WorldWideScience

Sample records for integrated electronic circuits

  1. Thermionic integrated circuits: electronics for hostile environments

    International Nuclear Information System (INIS)

    Lynn, D.K.; McCormick, J.B.; MacRoberts, M.D.J.; Wilde, D.K.; Dooley, G.R.; Brown, D.R.

    1985-01-01

    Thermionic integrated circuits combine vacuum tube technology with integrated circuit techniques to form integrated vacuum triode circuits. These circuits are capable of extended operation in both high-temperature and high-radiation environments

  2. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1972-01-01

    Electronic Devices and Circuits, Volume 3 provides a comprehensive account on electronic devices and circuits and includes introductory network theory and physics. The physics of semiconductor devices is described, along with field effect transistors, small-signal equivalent circuits of bipolar transistors, and integrated circuits. Linear and non-linear circuits as well as logic circuits are also considered. This volume is comprised of 12 chapters and begins with an analysis of the use of Laplace transforms for analysis of filter networks, followed by a discussion on the physical properties of

  3. Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits.

    Science.gov (United States)

    Khuri-Yakub, B T; Oralkan, Omer; Nikoozadeh, Amin; Wygant, Ira O; Zhuang, Steve; Gencel, Mustafa; Choe, Jung Woo; Stephens, Douglas N; de la Rama, Alan; Chen, Peter; Lin, Feng; Dentinger, Aaron; Wildes, Douglas; Thomenius, Kai; Shivkumar, Kalyanam; Mahajan, Aman; Seo, Chi Hyung; O'Donnell, Matthew; Truong, Uyen; Sahn, David J

    2010-01-01

    Capacitive micromachined ultrasonic transducer (CMUT) arrays are conveniently integrated with frontend integrated circuits either monolithically or in a hybrid multichip form. This integration helps with reducing the number of active data processing channels for 2D arrays. This approach also preserves the signal integrity for arrays with small elements. Therefore CMUT arrays integrated with electronic circuits are most suitable to implement miniaturized probes required for many intravascular, intracardiac, and endoscopic applications. This paper presents examples of miniaturized CMUT probes utilizing 1D, 2D, and ring arrays with integrated electronics.

  4. Monolithic integration of photonic and electronic circuits in a CMOS process

    Science.gov (United States)

    Mekis, Attila; Abdalla, Sherif; Analui, Behnam; Gloeckner, Steffen; Guckenberger, Andrew; Koumans, Roger; Kucharski, Daniel; Liang, Yi; Masini, Gianlorenzo; Mirsaidi, Sina; Narasimha, Adithyaram; Pinguet, Thierry; Sadagopan, Vikram; Welch, Brian; White, Joe; Witzens, Jeremy

    2008-02-01

    We present our approach to a low-cost, highly scalable opto-electronic integration platform based on a commercial CMOS process. In this talk, we detail the performance of the device library elements and highlight performance trade-offs encountered in monolithically integrating optical and electronic circuits. We describe an opto-electronic integrated circuit (OEIC) design toolkit modeled after the standard electronic design flow, which includes automated design rule checking (DRC) and layout-versus-schematic (LVS) checks covering all types of circuit elements. As an example of integration, we detail the design of a multi-channel transceiver chip with 10 Gbps/channel optical data transmission speed and report on its performance.

  5. Photonic Integrated Circuits

    Science.gov (United States)

    Krainak, Michael; Merritt, Scott

    2016-01-01

    Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.

  6. SEM analysis of ionizing radiation effects in linear integrated circuits. [Scanning Electron Microscope

    Science.gov (United States)

    Stanley, A. G.; Gauthier, M. K.

    1977-01-01

    A successful diagnostic technique was developed using a scanning electron microscope (SEM) as a precision tool to determine ionization effects in integrated circuits. Previous SEM methods radiated the entire semiconductor chip or major areas. The large area exposure methods do not reveal the exact components which are sensitive to radiation. To locate these sensitive components a new method was developed, which consisted in successively irradiating selected components on the device chip with equal doses of electrons /10 to the 6th rad (Si)/, while the whole device was subjected to representative bias conditions. A suitable device parameter was measured in situ after each successive irradiation with the beam off.

  7. Electronic logic circuits

    CERN Document Server

    Gibson, J

    2013-01-01

    Most branches of organizing utilize digital electronic systems. This book introduces the design of such systems using basic logic elements as the components. The material is presented in a straightforward manner suitable for students of electronic engineering and computer science. The book is also of use to engineers in related disciplines who require a clear introduction to logic circuits. This third edition has been revised to encompass the most recent advances in technology as well as the latest trends in components and notation. It includes a wide coverage of application specific integrate

  8. Integrating integrated circuit chips on paper substrates using inkjet printed electronics

    CSIR Research Space (South Africa)

    Bezuidenhout, Petrone H

    2016-11-01

    Full Text Available This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively...

  9. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1968-01-01

    Electronic Devices and Circuits, Volume 1 deals with the design and applications of electronic devices and circuits such as passive components, diodes, triodes and transistors, rectification and power supplies, amplifying circuits, electronic instruments, and oscillators. These topics are supported with introductory network theory and physics. This volume is comprised of nine chapters and begins by explaining the operation of resistive, inductive, and capacitive elements in direct and alternating current circuits. The theory for some of the expressions quoted in later chapters is presented. Th

  10. Inkjet-printed conductive features for rapid integration of electronic circuits in centrifugal microfluidics

    CSIR Research Space (South Africa)

    Kruger, J

    2015-05-01

    Full Text Available This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which...

  11. Security electronics circuits manual

    CERN Document Server

    MARSTON, R M

    1998-01-01

    Security Electronics Circuits Manual is an invaluable guide for engineers and technicians in the security industry. It will also prove to be a useful guide for students and experimenters, as well as providing experienced amateurs and DIY enthusiasts with numerous ideas to protect their homes, businesses and properties.As with all Ray Marston's Circuits Manuals, the style is easy-to-read and non-mathematical, with the emphasis firmly on practical applications, circuits and design ideas. The ICs and other devices used in the practical circuits are modestly priced and readily available ty

  12. Electronic circuits fundamentals & applications

    CERN Document Server

    Tooley, Mike

    2015-01-01

    Electronics explained in one volume, using both theoretical and practical applications.New chapter on Raspberry PiCompanion website contains free electronic tools to aid learning for students and a question bank for lecturersPractical investigations and questions within each chapter help reinforce learning Mike Tooley provides all the information required to get to grips with the fundamentals of electronics, detailing the underpinning knowledge necessary to appreciate the operation of a wide range of electronic circuits, including amplifiers, logic circuits, power supplies and oscillators. The

  13. MOS integrated circuit design

    CERN Document Server

    Wolfendale, E

    2013-01-01

    MOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit desi

  14. Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices

    Science.gov (United States)

    Vanhoestenberghe, A.; Donaldson, N.

    2013-06-01

    Corrosion is a prime concern for active implantable devices. In this paper we review the principles underlying the concepts of hermetic packages and encapsulation, used to protect implanted electronics, some of which remain widely overlooked. We discuss how technological advances have created a need to update the way we evaluate the suitability of both protection methods. We demonstrate how lifetime predictability is lost for very small hermetic packages and introduce a single parameter to compare different packages, with an equation to calculate the minimum sensitivity required from a test method to guarantee a given lifetime. In the second part of this paper, we review the literature on the corrosion of encapsulated integrated circuits (ICs) and, following a new analysis of published data, we propose an equation for the pre-corrosion lifetime of implanted ICs, and discuss the influence of the temperature, relative humidity, encapsulation and field-strength. As any new protection will be tested under accelerated conditions, we demonstrate the sensitivity of acceleration factors to some inaccurately known parameters. These results are relevant for any application of electronics working in a moist environment. Our comparison of encapsulation and hermetic packages suggests that both concepts may be suitable for future implants.

  15. Electronics circuits and systems

    CERN Document Server

    Bishop, Owen

    2011-01-01

    The material in Electronics - Circuits and Systems is a truly up-to-date textbook, with coverage carefully matched to the electronics units of the 2007 BTEC National Engineering and the latest AS and A Level specifications in Electronics from AQA, OCR and WJEC. The material has been organized with a logical learning progression, making it ideal for a wide range of pre-degree courses in electronics. The approach is student-centred and includes: numerous examples and activities; web research topics; Self Test features, highlighted key facts, formulae and definitions. Ea

  16. Electronics circuits and systems

    CERN Document Server

    Bishop, Owen

    2007-01-01

    The material in Electronics - Circuits and Systems is a truly up-to-date textbook, with coverage carefully matched to the electronics units of the 2007 BTEC National Engineering and the latest AS and A Level specifications in Electronics from AQA, OCR and WJEC. The material has been organized with a logical learning progression, making it ideal for a wide range of pre-degree courses in electronics. The approach is student-centred and includes: numerous examples and activities; web research topics; Self Test features, highlighted key facts, formulae and definitions. Each chapter ends with a set

  17. Radiation effects and soft errors in integrated circuits and electronic devices

    CERN Document Server

    Fleetwood, D M

    2004-01-01

    This book provides a detailed treatment of radiation effects in electronic devices, including effects at the material, device, and circuit levels. The emphasis is on transient effects caused by single ionizing particles (single-event effects and soft errors) and effects produced by the cumulative energy deposited by the radiation (total ionizing dose effects). Bipolar (Si and SiGe), metal-oxide-semiconductor (MOS), and compound semiconductor technologies are discussed. In addition to considering the specific issues associated with high-performance devices and technologies, the book includes th

  18. Electronic meter with custom integrated circuit for electric energy measurement; Medidor eletronico de energia eletrica com circuito integrado dedicado

    Energy Technology Data Exchange (ETDEWEB)

    Caldas, Roberto Pereira

    1990-04-01

    The design and implementation of an electrical energy electronic meter for operation at low voltages, according to two steps of development carried out in Centro de Pesquisas de Energia Eletrica - CEPEL is described. In the first step, an electronic meter with discrete commercial components has been developed, in order to demonstrate to the Brazilian power suppliers the feasibility of such a device for electrical energy metering and charging. The second step was constituted by the design of an integrated circuit, aiming the reduction of the cost of the meter as well as the enhancement of its reliability. Several techniques of electrical energy measurement are presented. The meter with discrete components makes use of a time division multiplier (TDM), in order to determine the active power in the load. Voltage and current levels have been reduced through the use of voltage and current sensors compatible with the TDM's inputs. A V-F converter employing continuos integration, has been used for the determination of the energy consumed by the load through the integration of the TDM's output signal. Most of the discrete components of the meter have been replaced by the dedicated integrated circuit. The TDM has remained essentially the same, but the V-F converter has been changed into a dual-slope one, which is more adequate for implementation in a single chip. The tests performed with the prototypes of the meter including both the meter with discrete components and the meter with the custom-made integrated circuit have presented measurement errors of less the 0,2 %. The initial goal, according to Brazilian specifications of electromechanical meters and international specifications for electronic meters, was 1 %. (author)

  19. Electronic Circuit Analysis Language (ECAL)

    Science.gov (United States)

    Chenghang, C.

    1983-03-01

    The computer aided design technique is an important development in computer applications and it is an important component of computer science. The special language for electronic circuit analysis is the foundation of computer aided design or computer aided circuit analysis (abbreviated as CACD and CACA) of simulated circuits. Electronic circuit analysis language (ECAL) is a comparatively simple and easy to use circuit analysis special language which uses the FORTRAN language to carry out the explanatory executions. It is capable of conducting dc analysis, ac analysis, and transient analysis of a circuit. Futhermore, the results of the dc analysis can be used directly as the initial conditions for the ac and transient analyses.

  20. Basic electronic circuits

    CERN Document Server

    Buckley, P M

    1980-01-01

    In the past, the teaching of electricity and electronics has more often than not been carried out from a theoretical and often highly academic standpoint. Fundamentals and basic concepts have often been presented with no indication of their practical appli­ cations, and all too frequently they have been illustrated by artificially contrived laboratory experiments bearing little relationship to the outside world. The course comes in the form of fourteen fairly open-ended constructional experiments or projects. Each experiment has associated with it a construction exercise and an explanation. The basic idea behind this dual presentation is that the student can embark on each circuit following only the briefest possible instructions and that an open-ended approach is thereby not prejudiced by an initial lengthy encounter with the theory behind the project; this being a sure way to dampen enthusiasm at the outset. As the investigation progresses, questions inevitably arise. Descriptions of the phenomena encounte...

  1. Electronic Control Circuit

    International Nuclear Information System (INIS)

    Kim, Sang Jin; Kim, Je Hwong; Cha, In Su

    2001-08-01

    This book consists of nine chapters, which are basis of thyristor about its use and classify, structure of thyristor like outside, inside, manufacturing and structure of thyristor sorts of thyristor family and sub thyristor, how to use thyristor such as standard chart, choice of thyristor and way of on and off, electric heat control circuit like control temperature of heating apparatus and cooker, lighting control circuit for light bulb, neon lamp, traffic signal, lamp regulator and strobe, motor control circuit including an inverter circuit transistor and speed control of direct motor by transistor, electric power source circuit and a spark-plug, applied circuit for protection of fire.

  2. Semiconductor integrated circuits

    International Nuclear Information System (INIS)

    Michel, A.E.; Schwenker, R.O.; Ziegler, J.F.

    1979-01-01

    An improved method involving ion implantation to form non-epitaxial semiconductor integrated circuits. These are made by forming a silicon substrate of one conductivity type with a recessed silicon dioxide region extending into the substrate and enclosing a portion of the silicon substrate. A beam of ions of opposite conductivity type impurity is directed at the substrate at an energy and dosage level sufficient to form a first region of opposite conductivity within the silicon dioxide region. This impurity having a concentration peak below the surface of the substrate forms a region of the one conductivity type which extends from the substrate surface into the first opposite type region to a depth between the concentration peak and the surface and forms a second region of opposite conductivity type. The method, materials and ion beam conditions are detailed. Vertical bipolar integrated circuits can be made this way when the first opposite type conductivity region will function as a collector. Also circuits with inverted bipolar devices when this first region functions as a 'buried'' emitter region. (U.K.)

  3. Linear integrated circuits

    CERN Document Server

    Carr, Joseph

    1996-01-01

    The linear IC market is large and growing, as is the demand for well trained technicians and engineers who understand how these devices work and how to apply them. Linear Integrated Circuits provides in-depth coverage of the devices and their operation, but not at the expense of practical applications in which linear devices figure prominently. This book is written for a wide readership from FE and first degree students, to hobbyists and professionals.Chapter 1 offers a general introduction that will provide students with the foundations of linear IC technology. From chapter 2 onwa

  4. Lateral power transistors in integrated circuits

    CERN Document Server

    Erlbacher, Tobias

    2014-01-01

    This book details and compares recent advancements in the development of novel lateral power transistors (LDMOS devices) for integrated circuits in power electronic applications. It includes the state-of-the-art concept of double-acting RESURF topologies.

  5. Radiation-hardened CMOS integrated circuits

    International Nuclear Information System (INIS)

    Derbenwick, G.F.; Hughes, R.C.

    1977-01-01

    Electronic circuits that operate properly after exposure to ionizing radiation are necessary for nuclear weapon systems, satellites, and apparatus designed for use in radiation environments. The program to develop and theoretically model radiation-tolerant integrated circuit components has resulted in devices that show an improvement in hardness up to a factor of ten thousand over earlier devices. An inverter circuit produced functions properly after an exposure of 10 6 Gy (Si) which, as far as is known, is the record for an integrated circuit

  6. The Maplin electronic circuits handbook

    CERN Document Server

    Tooley, Michael

    1990-01-01

    The Maplin Electronic Circuits Handbook provides pertinent data, formula, explanation, practical guidance, theory and practical guidance in the design, testing, and construction of electronic circuits. This book discusses the developments in electronics technology techniques.Organized into 11 chapters, this book begins with an overview of the common types of passive component. This text then provides the reader with sufficient information to make a correct selection of passive components for use in the circuits. Other chapters consider the various types of the most commonly used semiconductor

  7. Integrated circuit cooled turbine blade

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Ching-Pang; Jiang, Nan; Um, Jae Y.; Holloman, Harry; Koester, Steven

    2017-08-29

    A turbine rotor blade includes at least two integrated cooling circuits that are formed within the blade that include a leading edge circuit having a first cavity and a second cavity and a trailing edge circuit that includes at least a third cavity located aft of the second cavity. The trailing edge circuit flows aft with at least two substantially 180-degree turns at the tip end and the root end of the blade providing at least a penultimate cavity and a last cavity. The last cavity is located along a trailing edge of the blade. A tip axial cooling channel connects to the first cavity of the leading edge circuit and the penultimate cavity of the trailing edge circuit. At least one crossover hole connects the penultimate cavity to the last cavity substantially near the tip end of the blade.

  8. A Low Noise Electronic Circuit

    NARCIS (Netherlands)

    Annema, Anne J.; Leenaerts, Dominicus M.W.; de Vreede, Petrus W.H.

    2002-01-01

    An electronic circuit, which can be used as a Low Noise Amplifier (LNA), comprises two complementary Field Effect Transistors (M1, M2; M5, M6), each having a gate, a source and a drain. The gates are connected together as a common input terminal, and the drains are connected together as a

  9. A CMOS application-specified-integrated-circuit for 40 GHz high-electron-mobility-transistors automatic biasing

    Science.gov (United States)

    De Matteis, M.; De Blasi, M.; Vallicelli, E. A.; Zannoni, M.; Gervasi, M.; Bau, A.; Passerini, A.; Baschirotto, A.

    2017-02-01

    This paper presents the design and the experimental results of a CMOS Automatic Control System (ACS) for the biasing of High-Electron-Mobility-Transistors (HEMT). The ACS is the first low-power mixed-signal Application-Specified-Integrated-Circuit (ASIC) able to automatically set and regulate the operating point of an off-chip 6 HEMT Low-Noise-Amplifiers (LNAs), hence it composes a two-chip system (the ACS+LNAs) to be used in the Large Scale Polarization Explorer (LSPE) stratospheric balloon for Cosmic Microwave Background (CMB) signal observation. The hereby presented ACS ASIC provides a reliable instrumentation for gradual and very stable LNAs characterization, switching-on, and operating point (digital programmable device components. The ASIC prototype has been implemented in a CMOS 0.35 μ m technology (12 mm2 area occupancy). It operates at 4 kHz clock frequency. The power consumption of one-channel ASIC (biasing one LNA) is 3.6 mW, whereas 30 mW are consumed by a single LNA device.

  10. Integrated Circuit Electromagnetic Immunity Handbook

    Science.gov (United States)

    Sketoe, J. G.

    2000-08-01

    This handbook presents the results of the Boeing Company effort for NASA under contract NAS8-98217. Immunity level data for certain integrated circuit parts are discussed herein, along with analytical techniques for applying the data to electronics systems. This handbook is built heavily on the one produced in the seventies by McDonnell Douglas Astronautics Company (MDAC, MDC Report E1929 of 1 August 1978, entitled Integrated Circuit Electromagnetic Susceptibility Handbook, known commonly as the ICES Handbook, which has served countless systems designers for over 20 years). Sections 2 and 3 supplement the device susceptibility data presented in section 4 by presenting information on related material required to use the IC susceptibility information. Section 2 concerns itself with electromagnetic susceptibility analysis and serves as a guide in using the information contained in the rest of the handbook. A suggested system hardening requirements is presented in this chapter. Section 3 briefly discusses coupling and shielding considerations. For conservatism and simplicity, a worst case approach is advocated to determine the maximum amount of RF power picked up from a given field. This handbook expands the scope of the immunity data in this Handbook is to of 10 MHz to 10 GHz. However, the analytical techniques provided are applicable to much higher frequencies as well. It is expected however, that the upper frequency limit of concern is near 10 GHz. This is due to two factors; the pickup of microwave energy on system cables and wiring falls off as the square of the wavelength, and component response falls off at a rapid rate due to the effects of parasitic shunt paths for the RF energy. It should be noted also that the pickup on wires and cables does not approach infinity as the frequency decreases (as would be expected by extrapolating the square law dependence of the high frequency roll-off to lower frequencies) but levels off due to mismatch effects.

  11. A simple electronic circuit realization of the tent map

    Energy Technology Data Exchange (ETDEWEB)

    Campos-Canton, I. [Fac. de Ciencias, Universidad Autonoma de San Luis Potosi, Alvaro Obregon 64, 78000 San Luis Potosi, SLP (Mexico)], E-mail: icampos@galia.fc.uaslp.mx; Campos-Canton, E. [Departamento de Fisico Matematicas, Universidad Autonoma de San Luis Potosi, Alvaro Obregon 64, 78000 San Luis Potosi, SLP (Mexico)], E-mail: ecamp@uaslp.mx; Murguia, J.S. [Departamento de Fisico Matematicas, Universidad Autonoma de San Luis Potosi, Alvaro Obregon 64, 78000 San Luis Potosi, SLP (Mexico)], E-mail: ondeleto@uaslp.mx; Rosu, H.C. [Division de Materiales Avanzados, Instituto Potosino de Investigacion Cientifica y Tecnologica, Camino a la presa San Jose 2055, 78216 San Luis Potosi, SLP (Mexico)], E-mail: hcr@ipicyt.edu.mx

    2009-10-15

    We present a very simple electronic implementation of the tent map, one of the best-known discrete dynamical systems. This is achieved by using integrated circuits and passive elements only. The experimental behavior of the tent map electronic circuit is compared with its numerical simulation counterpart. We find that the electronic circuit presents fixed points, periodicity, period doubling, chaos and intermittency that match with high accuracy the corresponding theoretical values.

  12. A fast charge integrating and shaping circuit

    International Nuclear Information System (INIS)

    Kulka, Z.; Szoncso, F.

    1990-01-01

    The development of a low cost fast charge integrating and shaping circuit (FCISC) was motivated by the need for an interface between the photomultipliers of an existing hadronic calorimeter and recently developed new readout electronics designed to match the output of small ionization chambers for the upgraded UA1 detector at the CERN proton-antiproton collider. This paper describes the design principles of gated and ungated charge integrating and shaping circuits. An FCISC prototype using discrete components was made and its properties were determined with a computerized test setup. Finally an SMD implementation of the FCISC is presented and the performance is reported. (orig.)

  13. Model Order Reduction for Electronic Circuits:

    DEFF Research Database (Denmark)

    Hjorth, Poul G.; Shontz, Suzanne

    Electronic circuits are ubiquitous; they are used in numerous industries including: the semiconductor, communication, robotics, auto, and music industries (among many others). As products become more and more complicated, their electronic circuits also grow in size and complexity. This increased...

  14. Viewing Integrated-Circuit Interconnections By SEM

    Science.gov (United States)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  15. Integrated circuits for multimedia applications

    DEFF Research Database (Denmark)

    Vandi, Luca

    2007-01-01

    This work presents several key aspects in the design of RF integrated circuits for portable multimedia devices. One chapter is dedicated to the application of negative-feedback topologies to receiver frontends. A novel feedback technique suitable for common multiplier-based mixers is described...

  16. Fluorine containing C(60) derivatives for high-performance electron transporting field-effect transistors and integrated circuits

    NARCIS (Netherlands)

    Wobkenberg, Paul H.; Ball, James; Bradley, Donal D. C.; Anthopoulos, Thomas D.; Kooistra, Floris; Hummelen, Jan C.; de Leeuw, Dago M.; Wöbkenberg, Paul H.

    2008-01-01

    We report on electron transporting organic transistors and integrated ring oscillators based on four different solution processible fluorine containing C(60) derivatives. Electron mobilities up to 0.15 cm(2)/V s are obtained from as-prepared bottom-gate, bottom-contact transistors utilizing gold

  17. Electronic circuit realization of the logistic map

    Indian Academy of Sciences (India)

    Abstract. An electronic circuit realization of the logistic difference equation is presented using analog electronics. The behaviour of the realized system is evalu- ated against computer simulations of the same. The circuit is found to exhibit the entire range of dynamics of the logistic equation: fixed points, periodicity, period.

  18. Very High Speed Integrated Circuits (VHSIC)

    Science.gov (United States)

    1990-09-01

    This report presents a description and final account of the VHSIC program during its ten years of successfully developing advanced integrated circuit technologies and products for military systems. The new technologies and the products that VHSIC has produced have steadily found their way not only in defense systems but also into the commercial industrial base. They provide the reservoir from which new system capabilities are emerging and a foundation upon which continual further advances are being made. Over the course of the past decade, the VHSIC program has been active in the development of new materials, new circuit design concepts, advanced fabrication processes, new manufacturing equipment, higher levels of radiation harding, new data interface standards and specifications, and improved techniques for built-in-test maintainability. The VHSIC Hardware Description Language and other design automation tools have broken through major integrated circuit complexity barriers and will decrease the cost and development time of modern electronic systems. The resulting achievements have helped to produce a new level of system design and fabrication - one that approaches an integrated concept-to-system capability.

  19. High transition temperature superconducting integrated circuit

    International Nuclear Information System (INIS)

    DiIorio, M.S.

    1985-01-01

    This thesis describes the design and fabrication of the first superconducting integrated circuit capable of operating at over 10K. The primary component of the circuit is a dc SQUID (Superconducting QUantum Interference Device) which is extremely sensitive to magnetic fields. The dc SQUID consists of two superconductor-normal metal-superconductor (SNS) Josephson microbridges that are fabricated using a novel step-edge process which permits the use of high transition temperature superconductors. By utilizing electron-beam lithography in conjunction with ion-beam etching, very small microbridges can be produced. Such microbridges lead to high performance dc SQUIDs with products of the critical current and normal resistance reaching 1 mV at 4.2 K. These SQUIDs have been extensively characterized, and exhibit excellent electrical characteristics over a wide temperature range. In order to couple electrical signals into the SQUID in a practical fashion, a planar input coil was integrated for efficient coupling. A process was developed to incorporate the technologically important high transition temperature superconducting materials, Nb-Sn and Nb-Ge, using integrated circuit techniques. The primary obstacles were presented by the metallurgical idiosyncrasies of the various materials, such as the need to deposit the superconductors at elevated temperatures, 800-900 0 C, in order to achieve a high transition temperature

  20. CMOS digital integrated circuits a first course

    CERN Document Server

    Hawkins, Charles; Zarkesh-Ha, Payman

    2016-01-01

    This book teaches the fundamentals of modern CMOS technology and covers equal treatment to both types of MOSFET transistors that make up computer circuits; power properties of logic circuits; physical and electrical properties of metals; introduction of timing circuit electronics and introduction of layout; real-world examples and problem sets.

  1. Design of analog integrated circuits and systems

    CERN Document Server

    Laker, Kenneth R

    1994-01-01

    This text is designed for senior or graduate level courses in analog integrated circuits or design of analog integrated circuits. This book combines consideration of CMOS and bipolar circuits into a unified treatment. Also included are CMOS-bipolar circuits made possible by BiCMOS technology. The text progresses from MOS and bipolar device modelling to simple one and two transistor building block circuits. The final two chapters present a unified coverage of sample-data and continuous-time signal processing systems.

  2. Oxide bipolar electronics: materials, devices and circuits

    Science.gov (United States)

    Grundmann, Marius; Klüpfel, Fabian; Karsthof, Robert; Schlupp, Peter; Schein, Friedrich-Leonhard; Splith, Daniel; Yang, Chang; Bitter, Sofie; von Wenckstern, Holger

    2016-06-01

    We present the history of, and the latest progress in, the field of bipolar oxide thin film devices. As such we consider primarily pn-junctions in which at least one of the materials is a metal oxide semiconductor. A wide range of n-type and p-type oxides has been explored for the formation of such bipolar diodes. Since most oxide semiconductors are unipolar, challenges and opportunities exist with regard to the formation of heterojunction diodes and band lineups. Recently, various approaches have led to devices with high rectification, namely p-type ZnCo2O4 and NiO on n-type ZnO and amorphous zinc-tin-oxide. Subsequent bipolar devices and applications such as photodetectors, solar cells, junction field-effect transistors and integrated circuits like inverters and ring oscillators are discussed. The tremendous progress shows that bipolar oxide electronics has evolved from the exploration of various materials and heterostructures to the demonstration of functioning integrated circuits. Therefore a viable, facile and high performance technology is ready for further exploitation and performance optimization.

  3. A monolithically integrated magneto-optoelectronic circuit

    Science.gov (United States)

    Saha, D.; Basu, D.; Bhattacharya, P.

    2008-11-01

    The monolithic integration of a spin valve, an amplifier, and a light emitting diode to form a magneto-optoelectronic integrated circuit on GaAs is demonstrated. The circuit converts the spin polarization information in the channel of the spin valve to an amplified change in light intensity with a gain of 20. The monolithic circuit therefore operates as a magnetoelectronic switch which modulates the light intensity of the light emitting diode.

  4. A concise guide to chaotic electronic circuits

    CERN Document Server

    Buscarino, Arturo; Frasca, Mattia; Sciuto, Gregorio

    2014-01-01

    This brief provides a source of instruction from which students can be taught about the practicalities of designing and using chaotic circuits. The text provides information on suitable materials, circuit design and schemes for design realization. Readers are then shown how to reproduce experiments on chaos and to design new ones. The text guides the reader easily from the basic idea of chaos to the laboratory test providing an experimental basis that can be developed for such applications as secure communications. This brief provides introductory information on sample chaotic circuits, includes coverage of their development, and the “gallery” section provides information on a wide range of circuits. Concise Guide to Chaotic Electronic Circuits will be useful to anyone running a laboratory class involving chaotic circuits and to students wishing to learn about them.

  5. Active components for integrated plasmonic circuits

    DEFF Research Database (Denmark)

    Krasavin, A.V.; Bolger, P.M.; Zayats, A.V.

    2009-01-01

    We present a comprehensive study of highly efficient and compact passive and active components for integrated plasmonic circuit based on dielectric-loaded surface plasmon polariton waveguides.......We present a comprehensive study of highly efficient and compact passive and active components for integrated plasmonic circuit based on dielectric-loaded surface plasmon polariton waveguides....

  6. Electronic circuit realization of the logistic map

    Indian Academy of Sciences (India)

    An electronic circuit realization of the logistic difference equation is presented using analog electronics. The behaviour of the realized system is evaluated against ... Author Affiliations. Madhekar Suneel1. PGAD (DRDO, Ministry of Defence, Government of India), DRDL Complex, Kanchanbagh, Hyderabad 500 058, India ...

  7. Silicon integrated circuits part A : supplement 2

    CERN Document Server

    Kahng, Dawon

    1981-01-01

    Applied Solid State Science, Supplement 2: Silicon Integrated Circuits, Part A focuses on MOS device physics. This book is divided into three chapters-physics of the MOS transistor; nonvolatile memories; and properties of silicon-on-sapphire substrates devices, and integrated circuits. The topics covered include the short channel effects, MOSFET structures, floating gate devices, technology for nonvolatile semiconductor memories, sapphire substrates, and SOS integrated circuits and systems. The MOS capacitor, MIOS devices, and SOS process and device technology are also deliberated. This public

  8. Semiconductors integrated circuit design for manufacturability

    CERN Document Server

    Balasinki, Artur

    2011-01-01

    Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That's why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotl

  9. Latch-up in CMOS integrated circuits

    International Nuclear Information System (INIS)

    Estreich, D.B.; Dutton, R.W.

    1978-04-01

    An analysis is presented of latch-up in CMOS integrated circuits. A latch-up prediction algorithm has been developed and used to evaluate methods to control latch-up. Experimental verification of the algorithm is demonstrated

  10. Development of electron beam deflection circuit

    International Nuclear Information System (INIS)

    Leo Kwee Wah; Lojius Lombigit; Abu Bakar Ghazali; Azaman

    2007-01-01

    This paper describes a development of a power supply circuit to deflect and move the electron beam across the window of the Baby electron beam machine. It comprises a discussion of circuit design, its assembly and the test results. A variety of input and output conditions have been tested and it was found that the design is capable to supply 1.0 A with 50Hz on X-axis coil and 0.4A with 500Hz on Y-axis coil. (Author)

  11. Multidisciplinary Modelling Tools for Power Electronic Circuits

    DEFF Research Database (Denmark)

    Bahman, Amir Sajjad

    package, e.g. power module, DFR approach meets trade-offs in electrical, thermal and mechanical design of the device. Today, virtual prototyping of power electronic circuits using advanced simulation tools is becoming attractive due to cost/time saving in building potential designs. With simulations......This thesis presents multidisciplinary modelling techniques in a Design For Reliability (DFR) approach for power electronic circuits. With increasing penetration of renewable energy systems, the demand for reliable power conversion systems is becoming critical. Since a large part of electricity...... is processed through power electronics, highly efficient, sustainable, reliable and cost-effective power electronic devices are needed. Reliability of a product is defined as the ability to perform within its predefined functions under given conditions in a specific time. Because power electronic devices...

  12. Radio-frequency integrated-circuit engineering

    CERN Document Server

    Nguyen, Cam

    2015-01-01

    Radio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC's using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. Provide

  13. Materials issues in silicon integrated circuit processing

    International Nuclear Information System (INIS)

    Wittmer, M.; Stimmell, J.; Strathman, M.

    1986-01-01

    The symposium on ''Materials Issues in Integrated Circuit Processing'' sought to bring together all of the materials issued pertinent to modern integrated circuit processing. The inherent properties of the materials are becoming an important concern in integrated circuit manufacturing and accordingly research in materials science is vital for the successful implementation of modern integrated circuit technology. The session on Silicon Materials Science revealed the advanced stage of knowledge which topics such as point defects, intrinsic and extrinsic gettering and diffusion kinetics have achieved. Adaption of this knowledge to specific integrated circuit processing technologies is beginning to be addressed. The session on Epitaxy included invited papers on epitaxial insulators and IR detectors. Heteroepitaxy on silicon is receiving great attention and the results presented in this session suggest that 3-d integrated structures are an increasingly realistic possibility. Progress in low temperature silicon epitaxy and epitaxy of thin films with abrupt interfaces was also reported. Diffusion and Ion Implantation were well presented. Regrowth of implant-damaged layers and the nature of the defects which remain after regrowth were discussed in no less than seven papers. Substantial progress was also reported in the understanding of amorphising boron implants and the use of gallium implants for the formation of shallow p/sup +/ -layers

  14. Printed organic thin-film transistor-based integrated circuits

    International Nuclear Information System (INIS)

    Mandal, Saumen; Noh, Yong-Young

    2015-01-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted. (paper)

  15. Counterfeit integrated circuits detection and avoidance

    CERN Document Server

    Tehranipoor, Mark (Mohammad); Forte, Domenic

    2015-01-01

    This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade.  The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs).  Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat.   ·      Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; ·      Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; ·      Provides step-by-step solutions for detecting different types of counterfeit ICs; ·      Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC d...

  16. 3D circuit integration for Vertex and other detectors

    Energy Technology Data Exchange (ETDEWEB)

    Yarema, Ray; /Fermilab

    2007-09-01

    High Energy Physics continues to push the technical boundaries for electronics. There is no area where this is truer than for vertex detectors. Lower mass and power along with higher resolution and radiation tolerance are driving forces. New technologies such as SOI CMOS detectors and three dimensional (3D) integrated circuits offer new opportunities to meet these challenges. The fundamentals for SOI CMOS detectors and 3D integrated circuits are discussed. Examples of each approach for physics applications are presented. Cost issues and ways to reduce development costs are discussed.

  17. Integrated digital superconducting logic circuits for the quantum synthesizer. Report

    International Nuclear Information System (INIS)

    Buchholz, F.I.; Kohlmann, J.; Khabipov, M.; Brandt, C.M.; Hagedorn, D.; Balashov, D.; Maibaum, F.; Tolkacheva, E.; Niemeyer, J.

    2006-11-01

    electronics/semiconductor electronics RSFQ voltage amplifiers were realized on the base of SQUID stacks. At 8-stage serial voltage drivers the voltage pulses could be amplified at the exit on the aimed amplitude values of above 400 μV at simultaneous exit-impedance increasement on about 9 Ω. Besides a manifold of test circuits was developed anf fabricated, by which the function of the developed construction elements as well as the further development of the technology process could be studied. In measurements at the IPHT performed commonly with project partners in a demonstator arrangement of the multichip module of the quantum synthesized correct digital function and signal processing by an integrated RSFQ monitor circuit with subsequent semiconductor pulse amplifier were successfully proved

  18. Micro-relay technology for energy-efficient integrated circuits

    CERN Document Server

    Kam, Hei

    2015-01-01

    This book describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers and highlights the importance of co-design across design hierarchies when optimizing system performance (in this case, energy-efficiency). This book is ideal for researchers and engineers focused on semiconductors, integrated circuits, and energy efficient electronics. This book also: ·         Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture, and CAD ·         Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design ·         Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more

  19. Radiation effects in semiconductors: technologies for hardened integrated circuits

    International Nuclear Information System (INIS)

    Charlot, J.M.

    1983-09-01

    Various technologies are used to manufacture integrated circuits for electronic systems. But for specific applications, including those with radiation environment, it is necessary to choose an appropriate technologie or to improve a specific one in order to reach a definite hardening level. The aim of this paper is to present the main effects induced by radiation (neutrons and gamma rays) into the basic semiconductor devices, to explain some physical degradation mechanisms and to propose solutions for hardened integrated circuit fabrication. The analysis involves essentially the monolithic structure of the integrated circuits and the isolation technology of active elements. In conclusion, the advantages of EPIC and SOS technologies are described and the potentialities of new technologies (GaAs and SOI) are presented

  20. Radiation effects in semiconductors: technologies for hardened integrated circuits

    International Nuclear Information System (INIS)

    Charlot, J.M.

    1984-01-01

    Various technologies are used to manufacture integrated circuits for electronic systems. But for specific applications, including those with radiation environment, it is necessary to choose an appropriate technology or to improve a specific one in order to reach a definite hardening level. The aim of this paper is to present the main effects induced by radiation (neutrons and gamma rays) into the basic semiconductor devices, to explain some physical degradation mechanisms and to propose solutions for hardened integrated circuit fabrication. The analysis involves essentially the monolithic structure of the integrated circuits and the isolation technology of active elements. In conclusion, the advantages of EPIC and SOS technologies are described and the potentialities of new technologies (GaAs and SOI) are presented. (author)

  1. Analysis of electronic circuits using digital computers

    International Nuclear Information System (INIS)

    Tapu, C.

    1968-01-01

    Various programmes have been proposed for studying electronic circuits with the help of computers. It is shown here how it possible to use the programme ECAP, developed by I.B.M., for studying the behaviour of an operational amplifier from different point of view: direct current, alternating current and transient state analysis, optimisation of the gain in open loop, study of the reliability. (author) [fr

  2. Moessbauer spectrometer on integrated circuits

    International Nuclear Information System (INIS)

    Tomov, T.; Spasov, A.; Kunov, B.

    1978-01-01

    Two versions of the small-size high-quality Moessbauer spectrometer for 57 Fe spectroscopy are developed. The first version includes a proportion counter, a preamplifier, a one-chennel analyzer, a timer, and a scaler. The spectrometer is intended for measuring characteristic points of the Moessbauer-spectra and operates at constant velocities. The spectrometer parameters are as follows: integral non-linearity of the entire channel about 1%, maximum load for 14 keV line 8x10 4 pulse/s. The second version uses a multichannel time analyzer as a recording device. The spectrometer operates in the saw-toothed velocity modulation, the integral nonlinearity of the modulation being at least 0.1%

  3. Silicon Photonic Integrated Circuit Mode Multiplexer

    DEFF Research Database (Denmark)

    Ding, Yunhong; Ou, Haiyan; Xu, Jing

    2013-01-01

    We propose and demonstrate a novel silicon photonic integrated circuit enabling multiplexing of orthogonal modes in a few-mode fiber (FMF). By selectively launching light to four vertical grating couplers, all six orthogonal spatial and polarization modes supported by the FMF are successfully exc...

  4. CLASSICS Invention of the Integrated Circuit

    Indian Academy of Sciences (India)

    IAS Admin

    CLASSICS. Jack Kilby demonstrated the working of the world's first integrated circuit in September 1958. He was awarded ... bility was established. In the early 1950's, Robert Henry of this group, working under ..... to the Air Force a small working computer complete with a few hundred bits of semiconductor memory, and. 1.

  5. LC Quadrature Generation in Integrated Circuits

    DEFF Research Database (Denmark)

    Christensen, Kåre Tais

    2001-01-01

    Today quadrature signals for IQ demodulation are provided through RC polyphase networks, quadrature oscillators or double frequency VCOs. This paper presents a new method for generating quadrature signals in integrated circuits using only inductors and capacitors. This LC quadrature generation...... method enables significantly reduced noise and power consumption....

  6. Power management techniques for integrated circuit design

    CERN Document Server

    Chen, Ke-Horng

    2016-01-01

    This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. * A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management * Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes * Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience * Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors manuals, and program downloads.

  7. Classical Conditioning with Pulsed Integrated Neural Networks: Circuits and System

    DEFF Research Database (Denmark)

    Lehmann, Torsten

    1998-01-01

    In this paper we investigate on-chip learning for pulsed, integrated neural networks. We discuss the implementational problems the technology imposes on learning systems and we find that abiologically inspired approach using simple circuit structures is most likely to bring success. We develop...... a suitable learning algorithm -- a continuous-time version of a temporal differential Hebbian learning algorithm for pulsed neural systems with non-linear synapses -- as well as circuits for the electronic implementation. Measurements from an experimental CMOS chip are presented. Finally, we use our test...

  8. Development of 3D integrated circuits for HEP

    International Nuclear Information System (INIS)

    Yarema, R.; Fermilab

    2006-01-01

    Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D demonstrator chip for the ILC is presented

  9. Monolithically Integrated Flexible Black Phosphorus Complementary Inverter Circuits.

    Science.gov (United States)

    Liu, Yuanda; Ang, Kah-Wee

    2017-07-25

    Two-dimensional (2D) inverters are a fundamental building block for flexible logic circuits which have previously been realized by heterogeneously wiring transistors with two discrete channel materials. Here, we demonstrate a monolithically integrated complementary inverter made using a homogeneous black phosphorus (BP) nanosheet on flexible substrates. The digital logic inverter circuit is demonstrated via effective threshold voltage tuning within a single BP material, which offers both electron and hole dominated conducting channels with nearly symmetric pinch-off and current saturation. Controllable electron concentration is achieved by accurately modulating the aluminum (Al) donor doping, which realizes BP n-FET with a room-temperature on/off ratio >10 3 . Simultaneously, work function engineering is employed to obtain a low Schottky barrier contact electrode that facilities hole injection, thus enhancing the current density of the BP p-FET by 9.4 times. The flexible inverter circuit shows a clear digital logic voltage inversion operation along with a larger-than-unity direct current voltage gain, while exhibits alternating current dynamic signal switching at a record high frequency up to 100 kHz and remarkable electrical stability upon mechanical bending with a radii as small as 4 mm. Our study demonstrates a practical monolithic integration strategy for achieving functional logic circuits on one material platform, paving the way for future high-density flexible electronic applications.

  10. Applying analog integrated circuits for HERO protection

    Science.gov (United States)

    Willis, Kenneth E.; Blachowski, Thomas J.

    1994-01-01

    One of the most efficient methods for protecting electro-explosive devices (EED's) from HERO and ESD is to shield the EED in a conducting shell (Faraday cage). Electrical energy is transferred to the bridge by means of a magnetic coupling which passes through a portion of the conducting shell that is made from a magnetically permeable but electrically conducting material. This technique was perfected by ML Aviation, a U.K. company, in the early 80's, and was called a Radio Frequency Attenuation Connector (RFAC). It is now in wide use in the U.K. Previously, the disadvantage of RFAC over more conventional methods was its relatively high cost, largely driven by a thick film hybrid circuit used to switch the primary of the transformer. Recently, through a licensing agreement, this technology has been transferred to the U.S. and significant cost reductions and performance improvements have been achieved by the introduction of analog integrated circuits. An integrated circuit performs the following functions: (1) Chops the DC input to a signal suitable for driving the primary of the transformer; (2) Verifies the input voltage is above a threshold; (3) Verifies the input voltage is valid for a pre set time before enabling the device; (4) Provides thermal protection of the circuit; and (5) Provides an external input for independent logic level enabling of the power transfer mechanism. This paper describes the new RFAC product and its applications.

  11. Reverse Engineering Integrated Circuits Using Finite State Machine Analysis

    Energy Technology Data Exchange (ETDEWEB)

    Oler, Kiri J. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Miller, Carl H. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

    2016-04-12

    In this paper, we present a methodology for reverse engineering integrated circuits, including a mathematical verification of a scalable algorithm used to generate minimal finite state machine representations of integrated circuits.

  12. The electronics companion devices and circuits for physicists and engineers

    CERN Document Server

    Fischer-Cripps, Anthony C

    2014-01-01

    Updated and expanded with new topics, The Electronics Companion: Devices and Circuits for Physicists and Engineers, 2nd Edition presents a full course in introductory electronics using a unique and educational presentation technique that is the signature style of the author’s companion books. This concise yet detailed book covers introductory electrical principles (DC and AC circuits), the physics of electronics components, circuits involving diodes and transistors, transistors amplifiers, filtering, operational amplifiers, digital electronics, transformers, instrumentation, and power supplies.

  13. Very High Speed Integrated Circuits (VHSIC).

    Science.gov (United States)

    1987-12-31

    will be chosen in January 1988. N_% The X-ray mask fabrication problems of adhesion , absorber uniformity and wall % slopes, membrane stresses, and...extent practical, the advances made in integrated circuit technology in the design of new and re-engineered sistems . Also included are coordinator’s...glass, -" metal, or ceramic (or combinations of these) packages. No organic or polymeric materials such as lacquers, varnishes, coatings, adhesives

  14. High-frequency analog integrated circuit design

    CERN Document Server

    1995-01-01

    To learn more about designing analog integrated circuits (ICs) at microwave frequencies using GaAs materials, turn to this text and reference. It addresses GaAs MESFET-based IC processing. Describes the newfound ability to apply silicon analog design techniques to reliable GaAs materials and devices which, until now, was only available through technical papers scattered throughout hundred of articles in dozens of professional journals.

  15. The RD53A Integrated Circuit

    CERN Document Server

    Garcia-Sciveres, Maurice

    2017-01-01

    Implementation details for the RD53A pixel readout integrated circuit designed by the RD53 Collaboration. This is a companion to the specifications document and will eventually become a reference for chip users. RD53A is not intended to be a final production IC for use in an experiment, and contains design variations for testing purposes, making the pixel matrix non-uniform. The chip size is 20.0 mm by 11.8 mm.

  16. Progress in radiation immune thermionic integrated circuits

    International Nuclear Information System (INIS)

    Lynn, D.K.; McCormick, J.B.

    1985-08-01

    This report describes the results of a program directed at evaluating the thermionic integrated circuit (TIC) technology for applicability to military systems. Previous programs under the sponsorship of the Department of Energy, Office of Basic Energy Sciences, have developed an initial TIC technology base and demonstrated operation in high-temperature and high-radiation environments. The program described in this report has two parts: (1) a technical portion in which experiments and analyses were conducted to refine perceptions of near-term as well as ultimate performance levels of the TIC technology and (2) an applications portion in which the technical conclusions were to be evaluated against potential military applications. This report draws several conclusions that strongly suggest that (1) useful radiation-hard/high-temperature operable integrated circuits can be developed using the TIC technology; (2) because of their ability to survive and operate in hostile environments, a variety of potential military applications have been projected for this technology; and (3) based on the above two conclusions, an aggressive TIC development program should be initiated to provide the designers of future systems with integrated circuits and devices with the unique features of the TICs

  17. Power system with an integrated lubrication circuit

    Science.gov (United States)

    Hoff, Brian D [East Peoria, IL; Akasam, Sivaprasad [Peoria, IL; Algrain, Marcelo C [Peoria, IL; Johnson, Kris W [Washington, IL; Lane, William H [Chillicothe, IL

    2009-11-10

    A power system includes an engine having a first lubrication circuit and at least one auxiliary power unit having a second lubrication circuit. The first lubrication circuit is in fluid communication with the second lubrication circuit.

  18. Integrated Circuits for Analog Signal Processing

    CERN Document Server

    2013-01-01

      This book presents theory, design methods and novel applications for integrated circuits for analog signal processing.  The discussion covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode.  This includes voltage operational amplifiers, current operational amplifiers, operational transconductance amplifiers, operational transresistance amplifiers, current conveyors, current differencing transconductance amplifiers, etc.  Design methods and challenges posed by nanometer technology are discussed and applications described, including signal amplification, filtering, data acquisition systems such as neural recording, sensor conditioning such as biomedical implants, actuator conditioning, noise generators, oscillators, mixers, etc.   Presents analysis and synthesis methods to generate all circuit topologies from which the designer can select the best one for the desired application; Includes design guidelines for active devices/elements...

  19. LASER APPLICATIONS AND OTHER TOPICS IN QUANTUM ELECTRONICS: Laser-induced extreme UV radiation sources for manufacturing next-generation integrated circuits

    Science.gov (United States)

    Borisov, V. M.; Vinokhodov, A. Yu; Ivanov, A. S.; Kiryukhin, Yu B.; Mishchenko, V. A.; Prokof'ev, A. V.; Khristoforov, O. B.

    2009-10-01

    The development of high-power discharge sources emitting in the 13.5±0.135-nm spectral band is of current interest because they are promising for applications in industrial EUV (extreme ultraviolet) lithography for manufacturing integrated circuits according to technological precision standards of 22 nm and smaller. The parameters of EUV sources based on a laser-induced discharge in tin vapours between rotating disc electrodes are investigated. The properties of the discharge initiation by laser radiation at different wavelengths are established and the laser pulse parameters providing the maximum energy characteristics of the EUV source are determined. The EUV source developed in the study emits an average power of 276 W in the 13.5±0.135-nm spectral band on conversion to the solid angle 2π sr in the stationary regime at a pulse repetition rate of 3000 Hz.

  20. Flexible Microstrip Circuits for Superconducting Electronics

    Science.gov (United States)

    Chervenak, James; Mateo, Jennette

    2013-01-01

    Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (approximately 0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (approximately 0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving highquality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.

  1. Digital signal processing in power electronics control circuits

    CERN Document Server

    Sozanski, Krzysztof

    2013-01-01

    Many digital control circuits in current literature are described using analog transmittance. This may not always be acceptable, especially if the sampling frequency and power transistor switching frequencies are close to the band of interest. Therefore, a digital circuit is considered as a digital controller rather than an analog circuit. This helps to avoid errors and instability in high frequency components. Digital Signal Processing in Power Electronics Control Circuits covers problems concerning the design and realization of digital control algorithms for power electronics circuits using

  2. Status of readout integrated circuits for radiation detector

    International Nuclear Information System (INIS)

    Moon, B. S.; Hong, S. B.; Cheng, J. E. and others

    2001-09-01

    In this report, we describe the current status of readout integrated circuits developed for radiation detectors, along with new technologies being applied to this field. The current status of ASCIC chip development related to the readout electronics is also included in this report. Major sources of this report are from product catalogs and web sites of the related industries. In the field of semiconductor process technology in Korea, the current status of the multi-project wafer(MPW) of IDEC, the multi-project chip(MPC) of ISRC and other domestic semiconductor process industries is described. In the case of other countries, the status of the MPW of MOSIS in USA and the MPW of EUROPRACTICE in Europe is studied. This report also describes the technologies and products of readout integrated circuits of industries worldwide

  3. Accelerating functional verification of an integrated circuit

    Science.gov (United States)

    Deindl, Michael; Ruedinger, Jeffrey Joseph; Zoellin, Christian G.

    2015-10-27

    Illustrative embodiments include a method, system, and computer program product for accelerating functional verification in simulation testing of an integrated circuit (IC). Using a processor and a memory, a serial operation is replaced with a direct register access operation, wherein the serial operation is configured to perform bit shifting operation using a register in a simulation of the IC. The serial operation is blocked from manipulating the register in the simulation of the IC. Using the register in the simulation of the IC, the direct register access operation is performed in place of the serial operation.

  4. Thermoelectricity from wasted heat of integrated circuits

    KAUST Repository

    Fahad, Hossain M.

    2012-05-22

    We demonstrate that waste heat from integrated circuits especially computer microprocessors can be recycled as valuable electricity to power up a portion of the circuitry or other important accessories such as on-chip cooling modules, etc. This gives a positive spin to a negative effect of ever increasing heat dissipation associated with increased power consumption aligned with shrinking down trend of transistor dimension. This concept can also be used as an important vehicle for self-powered systemson- chip. We provide theoretical analysis supported by simulation data followed by experimental verification of on-chip thermoelectricity generation from dissipated (otherwise wasted) heat of a microprocessor.

  5. Integrated circuit failure mechanism detected by IMMA

    International Nuclear Information System (INIS)

    Crooke, M.

    1981-01-01

    Unanticipated lateral field effect transistor (FET) action was observed between parts of an integrated circuit (IC) during electrical probing. Although comprehensive electrical investigation lead to the identification of potentially suspect areas, and reduced the possible origins of the problem to three, it was only after application of the technique of ion microprobe mass analysis (IMMA) in the suspect areas that the problem was unambiguously identified. Based on this, a mechanism of failure was proposed which was subsequently confirmed by direct observation of the critical event

  6. Continuous surveillance of reactor coolant circuit integrity

    International Nuclear Information System (INIS)

    1986-01-01

    Continuous surveillance is important to assuring the integrity of a reactor coolant circuit. It can give pre-warning of structural degradation and indicate where off-line inspection should be focussed. These proceedings describe the state of development of several techniques which may be used. These involve measuring structural vibration, core neutron noise, acoustic emission from cracks, coolant leakage, or operating parameters such as coolant temperature and pressure. Twenty three papers have been abstracted and indexed separately for inclusion in the data base

  7. Organic membrane photonic integrated circuits (OMPICs).

    Science.gov (United States)

    Amemiya, Tomohiro; Kanazawa, Toru; Hiratani, Takuo; Inoue, Daisuke; Gu, Zhichen; Yamasaki, Satoshi; Urakami, Tatsuhiro; Arai, Shigehisa

    2017-08-07

    We propose the concept of organic membrane photonic integrated circuits (OMPICs), which incorporate various functions needed for optical signal processing into a flexible organic membrane. We describe the structure of several devices used within the proposed OMPICs (e.g., transmission lines, I/O couplers, phase shifters, photodetectors, modulators), and theoretically investigate their characteristics. We then present a method of fabricating the photonic devices monolithically in an organic membrane and demonstrate the operation of transmission lines and I/O couplers, the most basic elements of OMPICs.

  8. 3D packaging for integrated circuit systems

    Energy Technology Data Exchange (ETDEWEB)

    Chu, D.; Palmer, D.W. [eds.

    1996-11-01

    A goal was set for high density, high performance microelectronics pursued through a dense 3D packing of integrated circuits. A {open_quotes}tool set{close_quotes} of assembly processes have been developed that enable 3D system designs: 3D thermal analysis, silicon electrical through vias, IC thinning, mounting wells in silicon, adhesives for silicon stacking, pretesting of IC chips before commitment to stacks, and bond pad bumping. Validation of these process developments occurred through both Sandia prototypes and subsequent commercial examples.

  9. Inexpensive robots used to teach dc circuits and electronics

    Science.gov (United States)

    Sidebottom, David L.

    2017-05-01

    This article describes inexpensive, autonomous robots, built without microprocessors, used in a college-level introductory physics laboratory course to motivate student learning of dc circuits. Detailed circuit descriptions are provided as well as a week-by-week course plan that can guide students from elementary dc circuits, through Kirchhoff's laws, and into simple analog integrated circuits with the motivational incentive of building an autonomous robot that can compete with others in a public arena.

  10. Improvement of electronic circuit and performance of electronic dosimeter

    Energy Technology Data Exchange (ETDEWEB)

    Chang, S. Y.; Lee, B. J.; Kim, B. H.; Kim, J. S.; Lee, K. C. [Korea Atomic Energy Research Institute, Taejeon (Korea)

    2001-03-01

    An electronic personnal dosimeter(EPD) adopting a PIN type Silicon semiconductor as a radiation detector has been designed and manufactured. A hybrid type design of electronic circuit for processing a radiation signal has been adopted not only to improve the EPD response to radiation detection but also to reduce a size as well as a weight. The EPD can be independently used as an individual personal dosimeter for exposure monitoring if necessary after setting some variables by operator. The performance of this EPD has been tested and finally accredited by Korea Testing Laboratory(KTL) through a series of performance test under international criteria given in IEC61526 standard on the mechanical, electronical and radiation performance. The EPD reader which can interface an EPD with entrance door for proper access control has been designed and manufactured. A hangul is supported in this EPD reader in operational display menu for the user convenience. 10 refs., 30 figs., 5 tabs. (Author)

  11. Connector and electronic circuit assembly for improved wet insulation resistance

    Energy Technology Data Exchange (ETDEWEB)

    Reese, Jason A.; Teli, Samar R.; Keenihan, James R.; Langmaid, Joseph A.; Maak, Kevin D.; Mills, Michael E.; Plum, Timothy C.; Ramesh, Narayan

    2016-07-19

    The present invention is premised upon a connector and electronic circuit assembly (130) at least partially encased in a polymeric frame (200). The assembly including at least: a connector housing (230); at least one electrical connector (330); at least one electronic circuit component (430); and at least one barrier element (530).

  12. Specs: Simulation Program for Electronic Circuits and Systems

    Science.gov (United States)

    de Geus, Aart Jan

    Simulation tools are central to the development and verification of very large scale integrated circuits. Circuit simulation has been used for over two decades to verify the behavior of designs. Recently the introduction of switch-level simulators which model MOS transistors in terms of switches has helped to overcome the long runtimes associated with full circuit simulation. Used strictly for functional verification and fault simulation, switch -level simulation can only give very rough estimates of the timing of a circuit. In this dissertation an approach is presented which adds a timing capability to switch-level simulators at relatively little extra CPU cost. A new logic state concept is introduced which consists of a set of discrete voltage steps. Signals are known only in terms of these states thus allowing all current computations to be table driven. State changes are scheduled in the same fashion as in the case of gate-level simulators, making the simulator event-driven. The simulator is of mixed-mode nature in that it can model portions of a design at either the gate or transistor level. In order to represent the "unknown" state, a signal consists of both an upper and a lower bound defining a signal envelope. Both bounds are expressed in terms of states. In order to speed up the simulation, MOS networks are subdivided in small pull-up and pull-down transistor configurations that can be preanalysed and prepared for fast evaluation during the simulation. These concepts have been implemented in the program SPECS (Simulation Program For Electronic Circuits and Systems) and examples of simulations are given.

  13. Electronic circuit for control rod attracting electromagnet

    International Nuclear Information System (INIS)

    Ito, Koji.

    1991-01-01

    The present invention provides a discharging circuit for control rod attracting electromagnet used for a reactor which is highly reliable and has high performance. The resistor of the circuit comprises a non-linear resistor element and a blocking rectification element connected in series. The discharging circuit can be prevented from short-circuit by selecting a resistor having a resistance value about ten times as great as the coil resistance, even in a case where the blocking rectification element and the non-linear resistor element are failed. Accordingly, reduction of attracting force and the increase of scream releasing time can be minimized. (I.S.)

  14. Electric circuit theory applied electricity and electronics

    CERN Document Server

    Yorke, R

    1981-01-01

    Electric Circuit Theory provides a concise coverage of the framework of electrical engineering. Comprised of six chapters, this book emphasizes the physical process of electrical engineering rather than abstract mathematics. Chapter 1 deals with files, circuits, and parameters, while Chapter 2 covers the natural and forced response of simple circuit. Chapter 3 talks about the sinusoidal steady state, and Chapter 4 discusses the circuit analysis. The fifth chapter tackles frequency response of networks, and the last chapter covers polyphase systems. This book will be of great help to electrical

  15. Microwave Integrated Circuit Amplifier Designs Submitted to Qorvo for Fabrication with 0.09-micron High Electron Mobility Transistors (HEMTs) using 2-mil Gallium Nitride (GaN) on Silicon Carbide (SiC)

    Science.gov (United States)

    2016-03-01

    monolithic microwave integrated circuits (MMICs) are essential for compact hand-held satellite communications systems that provide instant, secure data...of approximately 30 to 45 GHz, monolithic microwave integrated circuits (MMICs) are essential for compact hand- held satellite communications (SATCOM...efforts focused on developing efficient high-power amplifiers for SATCOM applications , while current efforts are focused on modeling efforts

  16. Silicon-based photonic integrated circuit for label-free biosensing

    OpenAIRE

    Samusenko, Alina

    2016-01-01

    Silicon-based Photonic Integrated Circuit (PIC) is a device that integrates several optical components using the mature semiconductor technology platform, developed through years for the needs of electronic integrated circuits. In recent years, silicon PICs have been demonstrated as a powerful platform for biosensing systems - devices which play an omnipresent role in such essential life aspects as health care, environmental monitoring, food safety, etc. The growing importance of silicon phot...

  17. Test results of a 90 MHz integrated circuit sixteen channel analog pipeline for SSC detector calorimetry

    International Nuclear Information System (INIS)

    Kleinfelder, S.; Levi, M.; Milgrome, O.

    1990-01-01

    A sixteen channel analog transient recorder with 128 cells per channel has been fabricated as an integrated circuit and tested at speeds of up to 90 MHz. The circuit uses a switched capacitor array technology to achieve a simultaneous read and write capability and twelve bit dynamic range. The high performance of this part should satisfy the demanding electronics requirements of calorimeter detectors at the SSC. The circuit parameters and test results are presented

  18. Pneumatic oscillator circuits for timing and control of integrated microfluidics.

    Science.gov (United States)

    Duncan, Philip N; Nguyen, Transon V; Hui, Elliot E

    2013-11-05

    Frequency references are fundamental to most digital systems, providing the basis for process synchronization, timing of outputs, and waveform synthesis. Recently, there has been growing interest in digital logic systems that are constructed out of microfluidics rather than electronics, as a possible means toward fully integrated laboratory-on-a-chip systems that do not require any external control apparatus. However, the full realization of this goal has not been possible due to the lack of on-chip frequency references, thus requiring timing signals to be provided from off-chip. Although microfluidic oscillators have been demonstrated, there have been no reported efforts to characterize, model, or optimize timing accuracy, which is the fundamental metric of a clock. Here, we report pneumatic ring oscillator circuits built from microfluidic valves and channels. Further, we present a compressible-flow analysis that differs fundamentally from conventional circuit theory, and we show the utility of this physically based model for the optimization of oscillator stability. Finally, we leverage microfluidic clocks to demonstrate circuits for the generation of phase-shifted waveforms, self-driving peristaltic pumps, and frequency division. Thus, pneumatic oscillators can serve as on-chip frequency references for microfluidic digital logic circuits. On-chip clocks and pumps both constitute critical building blocks on the path toward achieving autonomous laboratory-on-a-chip devices.

  19. Integrated circuits for particle physics experiments

    CERN Document Server

    Snoeys, W; Campbell, M; Cantatore, E; Faccio, F; Heijne, Erik H M; Jarron, Pierre; Kloukinas, Kostas C; Marchioro, A; Moreira, P; Toifl, Thomas H; Wyllie, Ken H

    2000-01-01

    High energy particle physics experiments investigate the nature of matter through the identification of subatomic particles produced in collisions of protons, electrons, or heavy ions which have been accelerated to very high energies. Future experiments will have hundreds of millions of detector channels to observe the interaction region where collisions take place at a 40 MHz rate. This paper gives an overview of the electronics requirements for such experiments and explains how data reduction, timing distribution, and radiation tolerance in commercial CMOS circuits are achieved for these big systems. As a detailed example, the electronics for the innermost layers of the future tracking detector, the pixel vertex detector, is discussed with special attention to system aspects. A small-scale prototype (130 channels) implemented in standard 0.25 mu m CMOS remains fully functional after a 30 Mrad(SiO/sub 2/) irradiation. A full-scale pixel readout chip containing 8000 readout channels in a 14 by 16 mm/sup 2/ ar...

  20. Photonic integrated circuits: new challenges for lithography

    Science.gov (United States)

    Bolten, Jens; Wahlbrink, Thorsten; Prinzen, Andreas; Porschatis, Caroline; Lerch, Holger; Giesecke, Anna Lena

    2016-10-01

    In this work routes towards the fabrication of photonic integrated circuits (PICs) and the challenges their fabrication poses on lithography, such as large differences in feature dimension of adjacent device features, non-Manhattan-type features, high aspect ratios and significant topographic steps as well as tight lithographic requirements with respect to critical dimension control, line edge roughness and other key figures of merit not only for very small but also for relatively large features, are highlighted. Several ways those challenges are faced in today's low-volume fabrication of PICs, including the concept multi project wafer runs and mix and match approaches, are presented and possible paths towards a real market uptake of PICs are discussed.

  1. Parallel Jacobi EVD Methods on Integrated Circuits

    Directory of Open Access Journals (Sweden)

    Chi-Chia Sun

    2014-01-01

    Full Text Available Design strategies for parallel iterative algorithms are presented. In order to further study different tradeoff strategies in design criteria for integrated circuits, A 10 × 10 Jacobi Brent-Luk-EVD array with the simplified μ-CORDIC processor is used as an example. The experimental results show that using the μ-CORDIC processor is beneficial for the design criteria as it yields a smaller area, faster overall computation time, and less energy consumption than the regular CORDIC processor. It is worth to notice that the proposed parallel EVD method can be applied to real-time and low-power array signal processing algorithms performing beamforming or DOA estimation.

  2. Inspection of integrated circuits through the microfocus radiography technique

    International Nuclear Information System (INIS)

    Scofano, Carmelo Fabio; Staszczak, Eduardo Jose; Rebello, Joao Marcos Alcoforado

    1995-01-01

    The application of microfocus radiography technique for integrated circuits inspection is evaluated. The experiments were performed according to the international standards for micro-electronic components. In order to define the operational parameters, factors such as contrast and image definition were considered, and by varying the voltage and amperage applied to the X-ray apparatus it was tried to obtain radiographic images with an adequate resolution. the results show that this technique is a promising tool for evaluating these components. 17 refs., 16 figs., 2 tabs

  3. Stitching Codeable Circuits: High School Students' Learning About Circuitry and Coding with Electronic Textiles

    Science.gov (United States)

    Litts, Breanne K.; Kafai, Yasmin B.; Lui, Debora A.; Walker, Justice T.; Widman, Sari A.

    2017-10-01

    Learning about circuitry by connecting a battery, light bulb, and wires is a common activity in many science classrooms. In this paper, we expand students' learning about circuitry with electronic textiles, which use conductive thread instead of wires and sewable LEDs instead of lightbulbs, by integrating programming sensor inputs and light outputs and examining how the two domains interact. We implemented an electronic textiles unit with 23 high school students ages 16-17 years who learned how to craft and code circuits with the LilyPad Arduino, an electronic textile construction kit. Our analyses not only confirm significant increases in students' understanding of functional circuits but also showcase students' ability in designing and remixing program code for controlling circuits. In our discussion, we address opportunities and challenges of introducing codeable circuit design for integrating maker activities that include engineering and computing into classrooms.

  4. A Novel Power Electronic Inverter Circuit for Transformerless Photovoltaic Systems

    OpenAIRE

    Hai-Yan, Cao

    2014-01-01

    Capacitive leakage current is one of the most important issues for transformerless photovoltaic systems. In order to deal with the capacitive leakage current, a new power electronic inverter circuit is proposed in this paper. The inverter circuit consists of six switches and operates with constant common mode voltage. Theoretical analysis is conducted to clarify the circuit operation principle and the common mode characteristic. The performance evaluation test is carried out, and test results...

  5. Integrated devices in digital circuit design

    Science.gov (United States)

    Hope, G. S.

    Aspects of combinational design are examined, taking into account logical operations, truth tables, Karnaugh maps as input output expressions, minimum forms, maximum forms, minterm forms, symbols, fundamental relationships, Karnaugh maps as design tools, the implementation of logic functions, logic and implementation, logic nor implementation, implementation examples, the exclusive or function, symmetrical forms, reduction, and practical circuits. Multiplexers and demultiplexers in combinational circuits are considered along with fundamental mode circuits, event-driven sequential circuits, event-driven circuit implementation using multiplexers, clock-driven sequential circuits, counters and multiplexers in clock-driven sequential circuits, state diagram construction, registers in logic design, a digital system, programming and programming aids, input and output techniques, operation and configuration of independent systems, and a definition of a Boolean algebra. Attention is also given to Intel's and Motorola's executable instructions.

  6. Electronic circuit detects left ventricular ejection events in cardiovascular system

    Science.gov (United States)

    Gebben, V. D.; Webb, J. A., Jr.

    1972-01-01

    Electronic circuit processes arterial blood pressure waveform to produce discrete signals that coincide with beginning and end of left ventricular ejection. Output signals provide timing signals for computers that monitor cardiovascular systems. Circuit operates reliably for heart rates between 50 and 200 beats per minute.

  7. Topology Optimization of Building Blocks for Photonic Integrated Circuits

    DEFF Research Database (Denmark)

    Jensen, Jakob Søndergaard; Sigmund, Ole

    2005-01-01

    Photonic integrated circuits are likely candidates as high speed replacements for the standard electrical integrated circuits of today. However, in order to obtain a satisfactorily performance many design prob- lems that up until now have resulted in too high losses must be resolved. In this work...... we demonstrate how the method of topology optimization can be used to design a variety of high performance building blocks for the future circuits....

  8. Diagnostic Neural Network Systems for the Electronic Circuits

    International Nuclear Information System (INIS)

    Mohamed, A.H.

    2014-01-01

    Neural Networks is one of the most important artificial intelligent approaches for solving the diagnostic processes. This research concerns with uses the neural networks for diagnosis of the electronic circuits. Modern electronic systems contain both the analog and digital circuits. But, diagnosis of the analog circuits suffers from great complexity due to their nonlinearity. To overcome this problem, the proposed system introduces a diagnostic system that uses the neural network to diagnose both the digital and analog circuits. So, it can face the new requirements for the modern electronic systems. A fault dictionary method was implemented in the system. Experimental results are presented on three electronic systems. They are: artificial kidney, wireless network and personal computer systems. The proposed system has improved the performance of the diagnostic systems when applied for these practical cases

  9. Integrated diode circuits for greater than 1 THz

    Science.gov (United States)

    Schoenthal, Gerhard Siegbert

    The terahertz frequency band, spanning from roughly 100 GHz to 10 THz, forms the transition from electronics to photonics. This band is often referred to as the "terahertz technology gap" because it lacks typical microwave and optical components. The deficit of terahertz devices makes it difficult to conduct important scientific measurements that are exclusive to this band in fields such as radio astronomy and chemical spectroscopy. In addition, a number of scientific, military and commercial applications will become more practical when a suitable terahertz technology is developed. UVa's Applied Electrophysics Laboratory has extended non-linear microwave diode technology into the terahertz region. Initial success was achieved with whisker-contacted diodes and then discrete planar Schottky diodes soldered onto quartz circuits. Work at UVa and the Jet Propulsion Laboratory succeeded in integrating this diode technology onto low dielectric substrates, thereby producing more practical components with greater yield and improved performance. However, the development of circuit integration technologies for greater than 1 THz and the development of broadly tunable sources of terahertz power remain as major research goals. Meeting these critical needs is the primary motivation for this research. To achieve this goal and demonstrate a useful prototype for one of our sponsors, this research project has focused on the development of a Sideband Generator at 1.6 THz. This component allows use of a fixed narrow band source as a tunable power source for terahertz spectroscopy and compact range radar. To prove the new fabrication and circuit technologies, initial devices were fabricated and tested at 200 and 600 GHz. These circuits included non-ohmic cathodes, air-bridged fingers, oxideless anode formation, and improved quartz integration processes. The excellent performance of these components validated these new concepts. The prototype process was then further optimized to

  10. Electronic circuit realization of the logistic map

    Indian Academy of Sciences (India)

    ICs used were Dual Inline Packages (DIP). The complete circuit diagram is shown in figure 3. 0.1µF Polystyrene capacitors were used as hold-capacitors for the sample-and-hold ICs. The gain of the amplifier A2 was kept variable by providing a variable resistor (5 k poten- tiometer) between its inverting terminal and ground.

  11. Securing Health Sensing Using Integrated Circuit Metric

    Directory of Open Access Journals (Sweden)

    Ruhma Tahir

    2015-10-01

    Full Text Available Convergence of technologies from several domains of computing and healthcare have aided in the creation of devices that can help health professionals in monitoring their patients remotely. An increase in networked healthcare devices has resulted in incidents related to data theft, medical identity theft and insurance fraud. In this paper, we discuss the design and implementation of a secure lightweight wearable health sensing system. The proposed system is based on an emerging security technology called Integrated Circuit Metric (ICMetric that extracts the inherent features of a device to generate a unique device identification. In this paper, we provide details of how the physical characteristics of a health sensor can be used for the generation of hardware “fingerprints”. The obtained fingerprints are used to deliver security services like authentication, confidentiality, secure admission and symmetric key generation. The generated symmetric key is used to securely communicate the health records and data of the patient. Based on experimental results and the security analysis of the proposed scheme, it is apparent that the proposed system enables high levels of security for health monitoring in resource optimized manner.

  12. Designing TSVs for 3D Integrated Circuits

    CERN Document Server

    Khan, Nauman

    2013-01-01

    This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available....

  13. Optical electronics self-organized integration and applications

    CERN Document Server

    Yoshimura, Tetsuzo

    2012-01-01

    IntroductionFrom Electronics to Optical ElectronicsAnalysis Tools for Optical CircuitsSelf-Organized Optical Waveguides: Theoretical AnalysisSelf-Organized Optical Waveguides: Experimental DemonstrationsOptical Waveguide Films with Vertical Mirrors 3-D Optical Circuits with Stacked Waveguide Films Heterogeneous Thin-Film Device IntegrationOptical Switches OE Hardware Built by Optical ElectronicsIntegrated Solar Energy Conversion SystemsFuture Challenges.

  14. Mixed signal custom integrated circuit development for physics instrumentation

    Energy Technology Data Exchange (ETDEWEB)

    Britton, C.L. Jr.; Bryan, W.L.; Emery, M.S. [and others

    1998-10-01

    The Monolithic Systems Development Group at the Oak Ridge National Laboratory has been greatly involved in custom mixed-mode integrated circuit development for the PHENIX detector at the Relativistic Heavy Ion collider (RHIC) at Brookhaven National Laboratory and position-sensitive germanium spectrometer front-ends for the Naval Research Laboratory (NRL). This paper will outline the work done for both PHENIX and the Naval Research Laboratory in the area of full-custom, mixed-signal CMOS integrated electronics. This paper presents the architectures chosen for the various PHENIX detectors which include position-sensitive silicon, capacitive pixel, and phototube detectors, and performance results for the subsystems as well as a system description of the NRL germanium strip system and its performance. The performance of the custom preamplifiers, discriminators, analog memories, analog-digital converters, and control circuitry for all systems will be presented.

  15. Integrated optoelectronic materials and circuits for optical interconnects

    International Nuclear Information System (INIS)

    Hutcheson, L.D.

    1988-01-01

    Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

  16. Radiation hardening of integrated circuits technologies

    International Nuclear Information System (INIS)

    Auberton-Herve, A.J.; Leray, J.L.

    1991-01-01

    The radiation hardening studies started in the mid decade -1960-1970. To survive the different military or space radiative environment, a new engineering science borned, to understand the degradation of electronics components. The different solutions to improve the electronic behavior in such environment, have been named radiation hardening of the technologies. Improvement of existing technologies, and qualification method have been widely studied. However, at the other hand, specific technologies was developped : The Silicon On Insulator technologies for CMOS or Bipolar. The HSOI3HD technology (supported by DGA-CEA DAM and LETI with THOMSON TMS) offers today the highest hardening level for the integration density of hundreds of thousand transistors on the same silicon. Full complex systems would be realized on a single die with a technological radiation hardening and no more system hardening

  17. Integrated differential high-voltage transmitting circuit for CMUTs

    DEFF Research Database (Denmark)

    Llimos Muntal, Pere; Larsen, Dennis Øland; Farch, Kjartan

    2015-01-01

    In this paper an integrated differential high-voltage transmitting circuit for capacitive micromachined ultrasonic transducers (CMUTs) used in portable ultrasound scanners is designed and implemented in a 0.35 μm high-voltage process. Measurements are performed on the integrated circuit in order...... to assess its performance. The circuit generates pulses at differential voltage levels of 60V, 80V and 100 V, a frequency up to 5MHz and a measured driving strength of 1.75 V/ns with the CMUT connected. The total on-chip area occupied by the transmitting circuit is 0.18 mm2 and the power consumption...

  18. Design of 3D integrated circuits and systems

    CERN Document Server

    Sharma, Rohit

    2014-01-01

    Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and sys

  19. Application specific integrated circuits and hybrid micro circuits for nuclear instrumentation

    International Nuclear Information System (INIS)

    Chandratre, V.B.; Sukhwani, Menka; Mukhopadhyay, P.K.; Shastrakar, R.S.; Sudheer, M.; Shedam, V.; Keni, Anubha

    2009-01-01

    Rapid development in semiconductor technology, sensors, detectors and requirements of high energy physics experiments as well as advances in commercially available nuclear instruments have lead to challenges for instrumentation. These challenges are met with development of Application Specific Integrated Circuits and Hybrid Micro Circuits. This paper discusses various activities in ASIC and HMC development in Bhabha Atomic Research Centre. (author)

  20. Parallel sparse direct solver for integrated circuit simulation

    CERN Document Server

    Chen, Xiaoming; Yang, Huazhong

    2017-01-01

    This book describes algorithmic methods and parallelization techniques to design a parallel sparse direct solver which is specifically targeted at integrated circuit simulation problems. The authors describe a complete flow and detailed parallel algorithms of the sparse direct solver. They also show how to improve the performance by simple but effective numerical techniques. The sparse direct solver techniques described can be applied to any SPICE-like integrated circuit simulator and have been proven to be high-performance in actual circuit simulation. Readers will benefit from the state-of-the-art parallel integrated circuit simulation techniques described in this book, especially the latest parallel sparse matrix solution techniques. · Introduces complicated algorithms of sparse linear solvers, using concise principles and simple examples, without complex theory or lengthy derivations; · Describes a parallel sparse direct solver that can be adopted to accelerate any SPICE-like integrated circuit simulato...

  1. Gate array type integrated circuits: technology and reliability

    International Nuclear Information System (INIS)

    Kumurdjian, P.

    1984-03-01

    This paper summarizes a study on a logical C-MOS circuit. After a short presentation, the technical parameters and performance desired are given. On this basis, the dispersion of measurements, according to the series, is examined. The processes of personalization are then analyzed. Finally, some results on the burn-in and aging of circuits are presented. This paper concludes with the methods adopted to obtain a reliable integrated circuit [fr

  2. Reconfigurable SDM Switching Using Novel Silicon Photonic Integrated Circuit

    DEFF Research Database (Denmark)

    Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld

    2016-01-01

    -division multiplexing switching using silicon photonic integrated circuit, which is fabricated on a novel silicon-oninsulator platform with buried Al mirror. The silicon photonic integrated circuit is composed of a 7x7 switch and low loss grating coupler array based multicore fiber couplers. Thanks to the Al mirror......, grating couplers with ultra-low coupling loss with optical multicore fibers is achieved. The lowest total insertion loss of the silicon integrated circuit is as low as 4.5 dB, with low crosstalk lower than -30 dB. Excellent performances in terms of low insertion loss and low crosstalk are obtained...

  3. Integrated neuron circuit for implementing neuromorphic system with synaptic device

    Science.gov (United States)

    Lee, Jeong-Jun; Park, Jungjin; Kwon, Min-Woo; Hwang, Sungmin; Kim, Hyungjin; Park, Byung-Gook

    2018-02-01

    In this paper, we propose and fabricate Integrate & Fire neuron circuit for implementing neuromorphic system. Overall operation of the circuit is verified by measuring discrete devices and the output characteristics of the circuit. Since the neuron circuit shows asymmetric output characteristic that can drive synaptic device with Spike-Timing-Dependent-Plasticity (STDP) characteristic, the autonomous weight update process is also verified by connecting the synaptic device and the neuron circuit. The timing difference of the pre-neuron and the post-neuron induce autonomous weight change of the synaptic device. Unlike 2-terminal devices, which is frequently used to implement neuromorphic system, proposed scheme of the system enables autonomous weight update and simple configuration by using 4-terminal synapse device and appropriate neuron circuit. Weight update process in the multi-layer neuron-synapse connection ensures implementation of the hardware-based artificial intelligence, based on Spiking-Neural- Network (SNN).

  4. Protection of electronic circuits from overvoltages

    CERN Document Server

    Standler, Ronald B

    1989-01-01

    Practical rules and strategies designed to protect electronic systems from damage by transient overvoltages include symptoms and threats, remedies, protective devices and their applications, and validation of protective measures. 1989 edition.

  5. Integrated circuit failure analysis by low-energy charge-induced voltage alteration

    Science.gov (United States)

    Cole, Jr., Edward I.

    1996-01-01

    A scanning electron microscope apparatus and method are described for detecting and imaging open-circuit defects in an integrated circuit (IC). The invention uses a low-energy high-current focused electron beam that is scanned over a device surface of the IC to generate a charge-induced voltage alteration (CIVA) signal at the location of any open-circuit defects. The low-energy CIVA signal may be used to generate an image of the IC showing the location of any open-circuit defects. A low electron beam energy is used to prevent electrical breakdown in any passivation layers in the IC and to minimize radiation damage to the IC. The invention has uses for IC failure analysis, for production-line inspection of ICs, and for qualification of ICs.

  6. Analog Integrated Circuit Design for Spike Time Dependent Encoder and Reservoir in Reservoir Computing Processors

    Science.gov (United States)

    2018-01-01

    nonlinear function was modeled [50] with three fabricated analog multipliers (AD633) [51] and multiple operational amplifiers (op- amp ) (AD712) [52...output signals of these electronic circuit are usually limited to several hundred nanovolts. An op- amp with a finite gain of 109 is normally required to...Op- AMPs ) are not necessary. This project resulted in the design of an agile analog integrated circuit implementation of a spike-time encoding

  7. A study of Latchup phenomenon induced in integrated circuits subject to an radiation field environment

    International Nuclear Information System (INIS)

    Merabtine, Nadjim; Sadaoui, Djaouida; Benslama, Malek

    2007-01-01

    [Text of English abstract is entered here]. The electronic equipment operated in hostile environment can undergo beside failures due to the normal component aging, degradation due to the environmental conditions of functioning. The interaction of the particles composing a radiation environment with materials within an integrated circuit can induce failures perturbing its functioning or eventually its destruction. The study of the radiation effects on integrated circuits particularly of the Latchup effect aims at evaluating the reliability of electronic systems subject to radiation. The objective of this work will be focused especially upon the Latchup phenomenon induced in the implied components. (authors) [fr

  8. Betatron with demagnetization of magnetic circuit with extracted electron beam

    International Nuclear Information System (INIS)

    Rychkov, M.M.; Chakhlov, V.L.; Chertov, A.S.

    2003-01-01

    The magnetic scheme of the betatron with the magnetic circuit demagnetization, wherein the excitation winding is switched on consecutively and contrarily with the compensation winding is described. The experimental study on the betatron magnetic system with the magnetic circuit demagnetization is carried out on the basis of the electromagnet of the series-produced betatron MIB-6. The feed-up scheme, providing for the electrons lead-out beyond the emitter limits at the end of the acceleration cycle is developed for this magnetic system. The start-up of the betatron with the magnetic circuit demagnetization onto the kinetic energy of the accelerated electrons in the extracted beam, of 6 MeV with the radiation pulse recurrence frequency of 50 Hz is accomplished. The curves for the dose fields distribution of the extracted electron beam are presented [ru

  9. Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

    Science.gov (United States)

    Zheng, Yi; He, Zhizhu; Gao, Yunxia; Liu, Jing

    2013-05-01

    There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidized alloy ink was demonstrated to be flexibly printed on coated paper, which could compose various functional electronics and the concept of Printed-Circuits-on-Paper was thus presented. Further, RTV silicone rubber was adopted as isolating inks and packaging material to guarantee the functional stability of the circuit, which suggests an approach for printing 3D hybrid electro-mechanical device. The present work paved the way for a low cost and easygoing method in directly printing paper electronics.

  10. Carbon Nanotubes as Vertical Interconnects in 3D Integrated Circuits

    NARCIS (Netherlands)

    Vollebregt, S.

    2014-01-01

    Interconnects in integrated circuits (IC) are the major cause of power dissipation and delay. 3D integration has been proposed as a method to reduce these issues. For this 3D integration, fabrication of high aspect ratio reliable vertical interconnects (vias) are required. For this new materials,

  11. Fuzzy classifier for fault diagnosis in analog electronic circuits.

    Science.gov (United States)

    Kumar, Ashwani; Singh, A P

    2013-11-01

    Many studies have presented different approaches for the fault diagnosis with fault models having ± 50% variation in the component values in analog electronic circuits. There is still a need of the approaches which provide the fault diagnosis with the variation in the component value below ± 50%. A new single and multiple fault diagnosis technique for soft faults in analog electronic circuit using fuzzy classifier has been proposed in this paper. This technique uses the simulation before test (SBT) approach by analyzing the frequency response of the analog circuit under faulty and fault free conditions. Three signature parameters peak gain, frequency and phase associated with peak gain, of the frequency response of the analog circuit are observed and extracted such that they give unique values for faulty and fault free configuration of the circuit. The single and double fault models with the component variations from ± 10% to ± 50% are considered. The fuzzy classifier along the classification of faults gives the estimated component value under faulty and faultfree conditions. The proposed method is validated using simulated data and the real time data for a benchmark analog circuit. The comparative analysis is also presented for both the validations. Copyright © 2013 ISA. Published by Elsevier Ltd. All rights reserved.

  12. Chaos in Electronic Circuits: Nonlinear Time Series Analysis

    Energy Technology Data Exchange (ETDEWEB)

    Wheat, Jr., Robert M. [Kennedy Western Univ., Cheyenne, WY (United States)

    2003-07-01

    Chaos in electronic circuits is a phenomenon that has been largely ignored by engineers, manufacturers, and researchers until the early 1990’s and the work of Chua, Matsumoto, and others. As the world becomes more dependent on electronic devices, the detrimental effects of non-normal operation of these devices becomes more significant. Developing a better understanding of the mechanisms involved in the chaotic behavior of electronic circuits is a logical step toward the prediction and prevention of any potentially catastrophic occurrence of this phenomenon. Also, a better understanding of chaotic behavior, in a general sense, could potentially lead to better accuracy in the prediction of natural events such as weather, volcanic activity, and earthquakes. As a first step in this improvement of understanding, and as part of the research being reported here, methods of computer modeling, identifying and analyzing, and producing chaotic behavior in simple electronic circuits have been developed. The computer models were developed using both the Alternative Transient Program (ATP) and Spice, the analysis techniques have been implemented using the C and C++ programming languages, and the chaotically behaving circuits developed using “off the shelf” electronic components.

  13. Electronic circuit analog of synthetic genetic networks: Revisited

    Science.gov (United States)

    Hellen, Edward H.; Kurths, Jürgen; Dana, Syamal K.

    2017-06-01

    Electronic circuits are useful tools for studying potential dynamical behaviors of synthetic genetic networks. The circuit models are complementary to numerical simulations of the networks, especially providing a framework for verification of dynamical behaviors in the presence of intrinsic and extrinsic noise of the electrical systems. Here we present an improved version of our previous design of an electronic analog of genetic networks that includes the 3-gene Repressilator and we show conversions between model parameters and real circuit component values to mimic the numerical results in experiments. Important features of the circuit design include the incorporation of chemical kinetics representing Hill function inhibition, quorum sensing coupling, and additive noise. Especially, we make a circuit design for a systematic change of initial conditions in experiment, which is critically important for studies of dynamical systems' behavior, particularly, when it shows multistability. This improved electronic analog of the synthetic genetic network allows us to extend our investigations from an isolated Repressilator to coupled Repressilators and to reveal the dynamical behavior's complexity.

  14. Integrating Neural Circuits Controlling Female Sexual Behavior

    Directory of Open Access Journals (Sweden)

    Paul E. Micevych

    2017-06-01

    Full Text Available The hypothalamus is most often associated with innate behaviors such as is hunger, thirst and sex. While the expression of these behaviors important for survival of the individual or the species is nested within the hypothalamus, the desire (i.e., motivation for them is centered within the mesolimbic reward circuitry. In this review, we will use female sexual behavior as a model to examine the interaction of these circuits. We will examine the evidence for a hypothalamic circuit that regulates consummatory aspects of reproductive behavior, i.e., lordosis behavior, a measure of sexual receptivity that involves estradiol membrane-initiated signaling in the arcuate nucleus (ARH, activating β-endorphin projections to the medial preoptic nucleus (MPN, which in turn modulate ventromedial hypothalamic nucleus (VMH activity—the common output from the hypothalamus. Estradiol modulates not only a series of neuropeptides, transmitters and receptors but induces dendritic spines that are for estrogenic induction of lordosis behavior. Simultaneously, in the nucleus accumbens of the mesolimbic system, the mating experience produces long term changes in dopamine signaling and structure. Sexual experience sensitizes the response of nucleus accumbens neurons to dopamine signaling through the induction of a long lasting early immediate gene. While estrogen alone increases spines in the ARH, sexual experience increases dendritic spine density in the nucleus accumbens. These two circuits appear to converge onto the medial preoptic area where there is a reciprocal influence of motivational circuits on consummatory behavior and vice versa. While it has not been formally demonstrated in the human, such circuitry is generally highly conserved and thus, understanding the anatomy, neurochemistry and physiology can provide useful insight into the motivation for sexual behavior and other innate behaviors in humans.

  15. Fuse Modeling for Reliability Study of Power Electronic Circuits

    DEFF Research Database (Denmark)

    Bahman, Amir Sajjad; Iannuzzo, Francesco; Blaabjerg, Frede

    2017-01-01

    This paper describes a comprehensive modeling approach on reliability of fuses used in power electronic circuits. When fuses are subjected to current pulses, cyclic temperature stress is introduced to the fuse element and will wear out the component. Furthermore, the fuse may be used in a large v...

  16. Integrated Reconfigurable High-Voltage Transmitting Circuit for CMUTs

    DEFF Research Database (Denmark)

    Llimos Muntal, Pere; Larsen, Dennis Øland; Jørgensen, Ivan Harald Holger

    2014-01-01

    In this paper a full high-voltage transmitting cir- cuit aimed for capacitive micromachined ultrasonic transducers (CMUTs) used in ultrasound medical applications is designed and implemented in a 0.35 μm high-voltage CMOS process. The CMUT is single-ended driven. The design is taped......-out and measurements are performed on the integrated circuit. The transmitting circuit is reconfigurable externally making it able to drive a wide variety of CMUTs. The transmitting circuit can generate several pulse shapes, pulse voltages up to 100 V, maximum pulse range of 50 V and frequencies up to 5 MHz. The area...

  17. Nano-Power Integrated Circuits for Energy Harvesting

    OpenAIRE

    Dini, Michele

    2015-01-01

    The energy harvesting research field has grown considerably in the last decade due to increasing interests in energy autonomous sensing systems, which require smart and efficient interfaces for extracting power from energy source and power management (PM) circuits. This thesis investigates the design trade-offs for minimizing the intrinsic power of PM circuits, in order to allow operation with very weak energy sources. For validation purposes, three different integrated power converter and PM...

  18. Molecular annotation of integrative feeding neural circuits.

    Science.gov (United States)

    Pérez, Cristian A; Stanley, Sarah A; Wysocki, Robert W; Havranova, Jana; Ahrens-Nicklas, Rebecca; Onyimba, Frances; Friedman, Jeffrey M

    2011-02-02

    The identity of higher-order neurons and circuits playing an associative role to control feeding is unknown. We injected pseudorabies virus, a retrograde tracer, into masseter muscle, salivary gland, and tongue of BAC-transgenic mice expressing GFP in specific neural populations and identified several CNS regions that project multisynaptically to the periphery. MCH and orexin neurons were identified in the lateral hypothalamus, and Nurr1 and Cnr1 in the amygdala and insular/rhinal cortices. Cholera toxin β tracing showed that insular Nurr1(+) and Cnr1(+) neurons project to the amygdala or lateral hypothalamus, respectively. Finally, we show that cortical Cnr1(+) neurons show increased Cnr1 mRNA and c-Fos expression after fasting, consistent with a possible role for Cnr1(+) neurons in feeding. Overall, these studies define a general approach for identifying specific molecular markers for neurons in complex neural circuits. These markers now provide a means for functional studies of specific neuronal populations in feeding or other complex behaviors. Copyright © 2011 Elsevier Inc. All rights reserved.

  19. Reactor protection system design using application specific integrated circuits

    International Nuclear Information System (INIS)

    Battle, R.E.; Bryan, W.L.; Kisner, R.A.; Wilson, T.L. Jr.

    1992-01-01

    Implementing reactor protection systems (RPS) or other engineering safeguard systems with application specific integrated circuits (ASICs) offers significant advantages over conventional analog or software based RPSs. Conventional analog RPSs suffer from setpoints drifts and large numbers of discrete analog electronics, hardware logic, and relays which reduce reliability because of the large number of potential failures of components or interconnections. To resolve problems associated with conventional discrete RPSs and proposed software based RPS systems, a hybrid analog and digital RPS system implemented with custom ASICs is proposed. The actual design of the ASIC RPS resembles a software based RPS but the programmable software portion of each channel is implemented in a fixed digital logic design including any input variable computations. Set point drifts are zero as in proposed software systems, but the verification and validation of the computations is made easier since the computational logic an be exhaustively tested. The functionality is assured fixed because there can be no future changes to the ASIC without redesign and fabrication. Subtle error conditions caused by out of order evaluation or time dependent evaluation of system variables against protection criteria are eliminated by implementing all evaluation computations in parallel for simultaneous results. On- chip redundancy within each RPS channel and continuous self-testing of all channels provided enhanced assurance that a particular channel is available and faults are identified as soon as possible for corrective actions. The use of highly integrated ASICs to implement channel electronics rather than the use of discrete electronics greatly reduces the total number of components and interconnections in the RPS to further increase system reliability. A prototype ASIC RPS channel design and the design environment used for ASIC RPS systems design is discussed

  20. 77 FR 42764 - Certain Integrated Circuits, Chipsets, & Products Containing Same Including Televisions; Notice...

    Science.gov (United States)

    2012-07-20

    ..., Chipsets, & Products Containing Same Including Televisions; Notice of Request for Statements on the Public... against certain integrated circuits, chipsets, and products containing the same including televisions...'') in a prominent place on the cover page and/or the first page. (See Handbook for Electronic Filing...

  1. CLASSICS Invention of the Integrated Circuit

    Indian Academy of Sciences (India)

    IAS Admin

    cost, bulk, and reliability of the electronics. One of the first attempts to simplify the manufacturing process was carried out under. National Bureau of Standards sponsorship. Their proximity fuse requirements necessi- tated compact rugged electronic subsystems. The Centralab Division of Globe-Union,. Inc. proposed a ...

  2. Dielectric isolation for power integrated circuits; Isolation dielectrique enterree pour les circuits integres de puissance

    Energy Technology Data Exchange (ETDEWEB)

    Zerrouk, D.

    1997-07-18

    Considerable efforts have been recently directed towards integrating onto the same chip, sense or protection elements that is low voltage analog and/or digital control circuitry together with high voltage/high current devices. Most of these so called `smart power` devices use either self isolation, junction isolation or Silicon-On-Insulator (SOI) to integrate low voltage elements with vertical power devices. Dielectric isolation is superior to the other isolation techniques such as self isolation or junction isolation. Thesis work consists of the study of the feasibility of a dielectric technology based on the melting and the solidification in a Rapid Thermal Processing furnace (RTP), of thick polysilicon films deposited on oxide. The purpose of this technique is to obtain substrate with localized SOI structures for smart power applications. SOI technology offers significant potential advantages, such as non-occurrence of latch-up in CMOS structures, high packaging density, low parasitic capacitance and the possibility of 3D structures. In addition, SOI technology using thick silicon films (10-100 {mu}m) offers special advantages for high voltage integrated circuits. Several techniques have been developed to form SOI films. Zone melting recrystallization is one of the most promising for localized SOI. The SOI structures have first been analyzed in term of extended defects. N-channel MOSFET`s transistors have also been fabricated in the SOI substrates and electrically characterized (threshold voltages, off-state leakage current, mobilities,...). The SOI transistors exhibit good characteristics, although inferior to witness transistors. The recrystallized silicon films are therefore found to be suitable for the fabrication of SOI devices. (author) 106 refs.

  3. Sequences of gluing bifurcations in an analog electronic circuit

    Energy Technology Data Exchange (ETDEWEB)

    Akhtanov, Sayat N.; Zhanabaev, Zeinulla Zh. [Physico-Technical Department, Al Farabi Kazakh National University, Al Farabi Av. 71, Almaty, 050038 Kazakhstan (Kazakhstan); Zaks, Michael A., E-mail: zaks@math.hu-berlin.de [Institute of Mathematics, Humboldt University, Rudower Chaussee 25, D-12489 Berlin (Germany)

    2013-10-01

    We report on the experimental investigation of gluing bifurcations in the analog electronic circuit which models a dynamical system of the third order: Lorenz equations with an additional quadratic nonlinearity. Variation of one of the resistances in the circuit changes the coefficient at this nonlinearity and replaces the Lorenz route to chaos by a different scenario which leads, through the sequence of homoclinic bifurcations, from periodic oscillations of the voltage to the irregular ones. Every single bifurcation “glues” in the phase space two stable periodic orbits and creates a new one, with the doubled length: a sequence of such bifurcations results in the birth of the chaotic attractor.

  4. PETRIC - A positron emission tomography readout integrated circuit

    Energy Technology Data Exchange (ETDEWEB)

    Pedrali-Noy, Marzio; Gruber, Gregory; Krieger, Bradley; Mandelli, Emmanuele; Meddeler, Gerrit; Moses, William; Rosso, Valeria

    2000-11-05

    We present architecture, critical design issues and performance measurements of PETRIC, a 64-channel mixed signal front-end integrated circuit (IC) for reading out a photodiode (PD) array coupled with LSO scintillator crystals for a medical imaging application (PET). Each channel consists of a low noise charge sensitive pre-amplifier (CSA), an RC-CR pulse shaper and a winner-take-all (WTA) multiplexer that selects the channel with the largest input signal. Triggered by an external timing signal, a switch opens and a capacitor stores the peak voltage of the winner channel. The shaper rise and fall times are adjustable by means of external current inputs over a continuous range of 0.7 (mu)s to 9 (mu)s. Power consumption is 5.4 mW per channel, measured Equivalent Noise Charge (ENC) at 1 (mu)s peaking time. Zero leakage current is 33 rms electrons plus 7.3 rms electrons per pF of input capacitance. Design is fabricated in 0.5 (mu)m 3.3V CMOS technology.

  5. Control circuits in power electronics practical issues in design and implementation

    CERN Document Server

    Castilla, Miguel

    2016-01-01

    Control circuits are a key element in the operation and performance of power electronics converters. This book describes practical issues related to the design and implementation of these control circuits, and is divided into three parts - analogue control circuits, digital control circuits, and new trends in control circuits.

  6. Process Variations and Probabilistic Integrated Circuit Design

    CERN Document Server

    Haase, Joachim

    2012-01-01

    Uncertainty in key parameters within a chip and between different chips in the deep sub micron era plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process.  Quantitative methodology is needed to ensure faultless functionality, despite existing process variations within given bounds, during product development.   This book presents the technological, physical, and mathematical fundamentals for a design paradigm shift, from a deterministic process to a probability-orientated design process for microelectronic circuits.  Readers will learn to evaluate the different sources of variations in the design flow in order to establish different design variants, while applying appropriate methods and tools to evaluate and optimize their design.  Trains IC designers to recognize problems caused by parameter variations during manufacturing and to choose the best methods available to mitigate these issues during the design process; Offers both qual...

  7. Non-Gaussianity in a quasiclassical electronic circuit

    Science.gov (United States)

    Suzuki, Takafumi J.; Hayakawa, Hisao

    2017-05-01

    We study the non-Gaussian dynamics of a quasiclassical electronic circuit coupled to a mesoscopic conductor. Non-Gaussian noise accompanying the nonequilibrium transport through the conductor significantly modifies the stationary probability density function (PDF) of the flux in the dissipative circuit. We incorporate weak quantum fluctuation of the dissipative LC circuit with a stochastic method and evaluate the quantum correction of the stationary PDF. Furthermore, an inverse formula to infer the statistical properties of the non-Gaussian noise from the stationary PDF is derived in the classical-quantum crossover regime. The quantum correction is indispensable to correctly estimate the microscopic transfer events in the QPC with the quasiclassical inverse formula.

  8. Photonic integrated circuits based on silica and polymer PLC

    Science.gov (United States)

    Izuhara, T.; Fujita, J.; Gerhardt, R.; Sui, B.; Lin, W.; Grek, B.

    2013-03-01

    Various methods of hybrid integration of photonic circuits are discussed focusing on merits and challenges. Material platforms discussed in this report are mainly polymer and silica. We categorize the hybridization methods using silica and polymer waveguides into two types, chip-to-chip and on-chip integration. General reviews of these hybridization technologies from the past works are reviewed. An example for each method is discussed in details. We also discuss current status of our silica PLC hybrid integration technology.

  9. Analysis of failure during the manufacturing of integrated circuits

    Science.gov (United States)

    Damm, C.; Sirot, N.

    1982-09-01

    To maintain the electrical output of integrated circuits at a high and stable level, a special analysis of failure techniques is systematically applied to plates of integrated circuits that have abnormal output. Aspects discussed include: a synoptic table of operations for failure analysis; methodology; preliminary data; visual analysis of defects; demonstration of crystal defects; and electrical analysis. Some examples illustrate the advantages of the method which are the reduction of fabrication cost, and improvement of the quality and reliability of products in a comprehensive, controlled procedure.

  10. Silicon integrated circuits advances in materials and device research

    CERN Document Server

    Kahng, Dawon

    1981-01-01

    Silicon Integrated Circuits, Part B covers the special considerations needed to achieve high-power Si-integrated circuits. The book presents articles about the most important operations needed for the high-power circuitry, namely impurity diffusion and oxidation; crystal defects under thermal equilibrium in silicon and the development of high-power device physics; and associated technology. The text also describes the ever-evolving processing technology and the most promising approaches, along with the understanding of processing-related areas of physics and chemistry. Physicists, chemists, an

  11. Programmable delay unit incorporating a semi-custom integrated circuit

    International Nuclear Information System (INIS)

    Linstadt, E.

    1985-04-01

    The synchronization of SLC accelerator control and monitoring functions is realized by a CAMAC module, the PDU II (Programmable Delay Unit II, SLAC 253-002), which includes a semi-custom gate array integrated circuit. The PDU II distributes 16 channels of independently programmable delayed pulses to other modules within the same CAMAC crate. The delays are programmable in increments of 8.4 ns. Functional descriptions of both the module and the semi-custom integrated circuit used to generate the output pulses are given

  12. Biochips: The Integrated Circuit of Biology

    DEFF Research Database (Denmark)

    Madsen, Jan

    2012-01-01

    Microfluidic biochips integrate different biochemical analysis functionalities (e.g., dispensers, filters, mixers, separators, detectors) on-chip, miniaturizing the macroscopic chemical and biological processes often processed by lab-robots, to a sub-millimeter scale. These microsystems offer...... the conventional biochemical analyzers, and areable to integrate on-chip all the necessary functions for biochemical analysis. Microfluidic biochips have an immense potential in multiple application areas, such as clinical diagnostics, advanced sequencing, drug discovery, and environmental monitoring, to name...... several advantages over the conventional biochemical analyzers, e.g., reduced sample and reagent volumes, speeded up biochemical reactions, ultra-sensitive detection and higher system throughput, with several assays being integrated on the same chip. Hence, microfluidic biochips are replacing...

  13. Photonic integrated circuits for NG-EPON

    Science.gov (United States)

    Rodrigues, Carla; Rodrigues, Francisco; Lima, Mário; Teixeira, António

    2017-08-01

    This paper intends to propose a monolithic photonic integrated InP transceiver for Next Generation of Ethernet Passive Optical Network (NG-EPON). The presented architecture was designed as an Optical Network Unit (ONU). The concept behind the suggested transceiver architecture is here presented together with the steps necessary to deploy the proposed solution.

  14. The Apply of Frequency Divider Circuit in Nuclear Electronics

    International Nuclear Information System (INIS)

    LIU Hefan; Zeng Bing; Zhang Ziliang; Ge Liangquan

    2009-01-01

    Different components in a digital system often need different working frequencies, the way we often used is clock division from the system clock. Through the analysis of frequency divider principle, a applied integer frequency dividing circuit with SE120A is proposed. It can divide the frequency multiple from 2 to 64. It's usually used in nuclear electronics. It's testing and analysis is displayed that it has no noise, good frequency division effect and stability. (authors)

  15. Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering

    Directory of Open Access Journals (Sweden)

    Heck Martijn J.R.

    2016-06-01

    Full Text Available Technologies for efficient generation and fast scanning of narrow free-space laser beams find major applications in three-dimensional (3D imaging and mapping, like Lidar for remote sensing and navigation, and secure free-space optical communications. The ultimate goal for such a system is to reduce its size, weight, and power consumption, so that it can be mounted on, e.g. drones and autonomous cars. Moreover, beam scanning should ideally be done at video frame rates, something that is beyond the capabilities of current opto-mechanical systems. Photonic integrated circuit (PIC technology holds the promise of achieving low-cost, compact, robust and energy-efficient complex optical systems. PICs integrate, for example, lasers, modulators, detectors, and filters on a single piece of semiconductor, typically silicon or indium phosphide, much like electronic integrated circuits. This technology is maturing fast, driven by high-bandwidth communications applications, and mature fabrication facilities. State-of-the-art commercial PICs integrate hundreds of elements, and the integration of thousands of elements has been shown in the laboratory. Over the last few years, there has been a considerable research effort to integrate beam steering systems on a PIC, and various beam steering demonstrators based on optical phased arrays have been realized. Arrays of up to thousands of coherent emitters, including their phase and amplitude control, have been integrated, and various applications have been explored. In this review paper, I will present an overview of the state of the art of this technology and its opportunities, illustrated by recent breakthroughs.

  16. Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering

    Science.gov (United States)

    Heck, Martijn J. R.

    2017-01-01

    Technologies for efficient generation and fast scanning of narrow free-space laser beams find major applications in three-dimensional (3D) imaging and mapping, like Lidar for remote sensing and navigation, and secure free-space optical communications. The ultimate goal for such a system is to reduce its size, weight, and power consumption, so that it can be mounted on, e.g. drones and autonomous cars. Moreover, beam scanning should ideally be done at video frame rates, something that is beyond the capabilities of current opto-mechanical systems. Photonic integrated circuit (PIC) technology holds the promise of achieving low-cost, compact, robust and energy-efficient complex optical systems. PICs integrate, for example, lasers, modulators, detectors, and filters on a single piece of semiconductor, typically silicon or indium phosphide, much like electronic integrated circuits. This technology is maturing fast, driven by high-bandwidth communications applications, and mature fabrication facilities. State-of-the-art commercial PICs integrate hundreds of elements, and the integration of thousands of elements has been shown in the laboratory. Over the last few years, there has been a considerable research effort to integrate beam steering systems on a PIC, and various beam steering demonstrators based on optical phased arrays have been realized. Arrays of up to thousands of coherent emitters, including their phase and amplitude control, have been integrated, and various applications have been explored. In this review paper, I will present an overview of the state of the art of this technology and its opportunities, illustrated by recent breakthroughs.

  17. 77 FR 25747 - Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Institution of...

    Science.gov (United States)

    2012-05-01

    ... INTERNATIONAL TRADE COMMISSION [Inv. No. 337-TA-840] Certain Semiconductor Integrated Circuit... States after importation of certain semiconductor integrated circuit devices and products containing same... importation, or the sale within the United States after importation of certain semiconductor integrated...

  18. International Conference on Nano-electronics, Circuits & Communication Systems

    CERN Document Server

    2017-01-01

    This volume comprises select papers from the International Conference on Nano-electronics, Circuits & Communication Systems(NCCS). The conference focused on the frontier issues and their applications in business, academia, industry, and other allied areas. This international conference aimed to bring together scientists, researchers, engineers from academia and industry. The book covers technological developments and current trends in key areas such as VLSI design, IC manufacturing, and applications such as communications, ICT, and hybrid electronics. The contents of this volume will prove useful to researchers, professionals, and students alike.

  19. Electronic circuits, systems and standards the best of EDN

    CERN Document Server

    Hickman, Ian

    2013-01-01

    Electronic Circuits, Systems and Standards: The Best of EDN is a collection of 66 EDN articles. The topics covered in this collection are diverse but all are relevant to controlled circulation electronics. The coverage of the text includes topics about software and algorithms, such as simple random number algorithm; simple log algorithm; and efficient algorithm for repeated FFTs. The book also tackles measurement related topics, including test for identifying a Gaussian noise source; enhancing product reliability; and amplitude-locked loop speeds filter test. The text will be useful to student

  20. Novel technique for reliability testing of silicon integrated circuits

    NARCIS (Netherlands)

    Le Minh, P.; Wallinga, Hans; Woerlee, P.H.; van den Berg, Albert; Holleman, J.

    2001-01-01

    We propose a simple, inexpensive technique with high resolution to identify the weak spots in integrated circuits by means of a non-destructive photochemical process in which photoresist is used as the photon detection tool. The experiment was done to localize the breakdown link of thin silicon

  1. Performance of digital integrated circuit technologies at very high temperatures

    Energy Technology Data Exchange (ETDEWEB)

    Prince, J.L.; Draper, B.L.; Rapp, E.A.; Kromberg, J.N.; Fitch, L.T.

    1980-01-01

    Results of investigations of the performance and reliability of digital bipolar and CMOS integrated circuits over the 25 to 340/sup 0/C range are reported. Included in these results are both parametric variation information and analysis of the functional failure mechanisms. Although most of the work was done using commercially available circuits (TTL and CMOS) and test chips from commercially compatible processes, some results of experimental simulations of dielectrically isolated CMOS are also discussed. It was found that commercial Schottky clamped TTL, and dielectrically isolated, low power Schottky-clamped TTL, functioned to junction temperatures in excess of 325/sup 0/C. Standard gold doped TTL functioned only to 250/sup 0/C, while commercial, isolated I/sup 2/L functioned to the range 250/sup 0/C to 275/sup 0/C. Commercial junction isolated CMOS, buffered and unbuffered, functioned to the range 280/sup 0/C to 310/sup 0/C/sup +/, depending on the manufacturer. Experimental simulations of simple dielectrically isolated CMOS integrated circuits, fabricated with heavier doping levels than normal, functioned to temperatures in excess of 340/sup 0/C. High temperature life testing of experimental, silicone-encapsulated simple TTL and CMOS integrated circuits have shown no obvious life limiting problems to date. No barrier to reliable functionality of TTL bipolar or CMOS integrated ciruits at temperatures in excess of 300/sup 0/C has been found.

  2. Classical Conditioning with Pulsed Integrated Neural Networks: Circuits and System

    DEFF Research Database (Denmark)

    Lehmann, Torsten

    1998-01-01

    In this paper we investigate on-chip learning for pulsed, integrated neural networks. We discuss the implementational problems the technology imposes on learning systems and we find that abiologically inspired approach using simple circuit structures is most likely to bring success. We develop a ...... chip to solve simple classical conditioning tasks, thus verifying the design methodologies put forward in the paper....

  3. Printed Circuit Board Integrated Toroidal Radio Frequency Inductors

    DEFF Research Database (Denmark)

    Kamby, Peter; Knott, Arnold; Andersen, Michael A. E.

    2012-01-01

    implemented as solenoids, either in spiral or cylindrical form. Those have the disadvantage of excessive stray fields, which can cause losses and disturbances in adjacent circuitry. Therefore this paper presents the analysis, design and realization of a printed circuit board (PCB) integrated inductor under...

  4. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  5. Mathematical model of an integrated circuit cooling through cylindrical rods

    Directory of Open Access Journals (Sweden)

    Beltrán-Prieto Luis Antonio

    2017-01-01

    Full Text Available One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton's law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface. This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.

  6. Applications of carbon nanotubes on integrated circuits

    Science.gov (United States)

    Zhang, Min

    The microelectronics technology falls within the boundaries of that definition. Carbon nanotube (CNT) is a promising alternative material for the future nanoelectronics. Owing to the unique properties of CNTs and the maturity of CMOS IC technology, the integration of the two technologies will take advantages of both. In this work, we demonstrate a new local silicon-gate carbon nanotube field-effect transistor (CNFET) by combining the in situ CNT growth technology and the SOI technology. The proposed CNFET structure has realized individual device operation, batch fabrication, low parasitics and better compatibility to the CMOS process at the same time. The configuration proposes a feasible approach to integrate the CNTs to CMOS platform for the first time, which makes CNT a step closer to application. The CNFETs show advanced DC characteristics. The ambipolar conductance and the scaling effect of the CNFETs have been analyzed based on the SB modulated conductance mechanism. Investigation of radio-frequency (RF) characteristics of CNTs is essential for their application. RF transmission characteristics of the semiconducting and metallic CNTs are investigated to the frequency of 12 GHz using the full two-port S-parameter methodology for the first time. Without the effect of the parasitics, the signal transmission capability of the CNTs maintains at a constant level and shows no degeneration even at a high frequency of 12 GHz. An empirical RLC element model has been proposed to fit the RF response of the CNT array. Capacitive contact is reported between the CNTs and the metal electrodes. We also explore the high-frequency properties of the local silicon-gate CNFET as an active device by measuring its S parameters using a common-source configuration. In addition, we demonstrate the application of CNT as via/contact filler to solve the problems of copper vias used in ICs nowadays. We have optimized the fabrication process for the CNT via integration. The CNT vias with

  7. Design of Integrated Circuits Approaching Terahertz Frequencies

    DEFF Research Database (Denmark)

    Yan, Lei

    are designed based on the monolithic membrane supported Schottky diodes, which is under development at Chalmers University of Technology, Sweden. To simplify the baseband circuitry, the received IF signal from the subharmonic mixer is further amplified and downconverted to the DC range with a low noise...... heterodyne receivers with requirements of room temperature operation, low system complexity, and high sensitivity, monolithic integrated Schottky diode technology is chosen for the implementation of submillimeterwave components. The corresponding subharmonic mixer and multiplier for a THz radiometer system...

  8. Laser Integration on Silicon Photonic Circuits Through Transfer Printing

    Science.gov (United States)

    2017-03-10

    silicon transfer printed single wavelength laser . Introduction Silicon has long offered promise as the ultimate platform for realizing compact photonic...the field has faced a big stumbling block: the lack of an integrated laser source. Thus far, silicon-photonics applications have had to rely on...AFRL-AFOSR-UK-TR-2017-0019 Laser integration on silicon photonic circuits through transfer printing Gunther Roelkens UNIVERSITEIT GENT VZW Final

  9. Wafer scale millimeter-wave integrated circuits based on epitaxial graphene in high data rate communication

    Science.gov (United States)

    Habibpour, Omid; He, Zhongxia Simon; Strupinski, Wlodek; Rorsman, Niklas; Zirath, Herbert

    2017-02-01

    In recent years, the demand for high data rate wireless communications has increased dramatically, which requires larger bandwidth to sustain multi-user accessibility and quality of services. This can be achieved at millimeter wave frequencies. Graphene is a promising material for the development of millimeter-wave electronics because of its outstanding electron transport properties. Up to now, due to the lack of high quality material and process technology, the operating frequency of demonstrated circuits has been far below the potential of graphene. Here, we present monolithic integrated circuits based on epitaxial graphene operating at unprecedented high frequencies (80-100 GHz). The demonstrated circuits are capable of encoding/decoding of multi-gigabit-per-second information into/from the amplitude or phase of the carrier signal. The developed fabrication process is scalable to large wafer sizes.

  10. Digital integrated circuit design using Verilog and SystemVerilog

    CERN Document Server

    Mehler, Ronald W

    2014-01-01

    For those with a basic understanding of digital design, this book teaches the essential skills to design digital integrated circuits using Verilog and the relevant extensions of SystemVerilog. In addition to covering the syntax of Verilog and SystemVerilog, the author provides an appreciation of design challenges and solutions for producing working circuits. The book covers not only the syntax and limitations of HDL coding, but deals extensively with design problems such as partitioning and synchronization, helping you to produce designs that are not only logically correct, but will actually

  11. Silicon compiler design of combinational and pipeline adder integrated circuits

    Science.gov (United States)

    Froede, A. O., III

    1985-06-01

    The architecture and structures used by the MacPitts silicon compiler to design integrated circuits are described, and the capabilities and limitations of the compiler are discussed. The performance of several combinational and pipeline adders designed by MacPitts and a hand-crafted pipeline adder are compared. Several different MacPitts design errors are documented. Tutorial material is presented to aid in using the MacPitts interpreter and to illustrate timing analysis of MacPitts-designed circuits using the program Crystal.

  12. A microfabricated fringing field capacitive pH sensor with an integrated readout circuit

    Energy Technology Data Exchange (ETDEWEB)

    Arefin, Md Shamsul, E-mail: md.arefin@monash.edu; Redoute, Jean-Michel; Rasit Yuce, Mehmet [Electrical and Computer Systems Engineering, Monash University, Melbourne (Australia); Bulut Coskun, M.; Alan, Tuncay; Neild, Adrian [Mechanical and Aerospace Engineering, Monash University, Melbourne (Australia)

    2014-06-02

    This work presents a microfabricated fringe-field capacitive pH sensor using interdigitated electrodes and an integrated modulation-based readout circuit. The changes in capacitance of the sensor result from the permittivity changes due to pH variations and are converted to frequency shifts using a crossed-coupled voltage controlled oscillator readout circuit. The shift in resonant frequency of the readout circuit is 30.96 MHz for a change in pH of 1.0–5.0. The sensor can be used for the measurement of low pH levels, such as gastric acid, and can be integrated with electronic pills. The measurement results show high repeatability, low noise, and a stable output.

  13. A microfabricated fringing field capacitive pH sensor with an integrated readout circuit

    International Nuclear Information System (INIS)

    Arefin, Md Shamsul; Redoute, Jean-Michel; Rasit Yuce, Mehmet; Bulut Coskun, M.; Alan, Tuncay; Neild, Adrian

    2014-01-01

    This work presents a microfabricated fringe-field capacitive pH sensor using interdigitated electrodes and an integrated modulation-based readout circuit. The changes in capacitance of the sensor result from the permittivity changes due to pH variations and are converted to frequency shifts using a crossed-coupled voltage controlled oscillator readout circuit. The shift in resonant frequency of the readout circuit is 30.96 MHz for a change in pH of 1.0–5.0. The sensor can be used for the measurement of low pH levels, such as gastric acid, and can be integrated with electronic pills. The measurement results show high repeatability, low noise, and a stable output.

  14. A microfabricated fringing field capacitive pH sensor with an integrated readout circuit

    Science.gov (United States)

    Arefin, Md Shamsul; Bulut Coskun, M.; Alan, Tuncay; Redoute, Jean-Michel; Neild, Adrian; Rasit Yuce, Mehmet

    2014-06-01

    This work presents a microfabricated fringe-field capacitive pH sensor using interdigitated electrodes and an integrated modulation-based readout circuit. The changes in capacitance of the sensor result from the permittivity changes due to pH variations and are converted to frequency shifts using a crossed-coupled voltage controlled oscillator readout circuit. The shift in resonant frequency of the readout circuit is 30.96 MHz for a change in pH of 1.0-5.0. The sensor can be used for the measurement of low pH levels, such as gastric acid, and can be integrated with electronic pills. The measurement results show high repeatability, low noise, and a stable output.

  15. The electronic temperature control and measurements reactor fuel rig circuits

    International Nuclear Information System (INIS)

    Glowacki, S.W.

    1980-01-01

    The electronic circuits of two digital temperature meters developed for the thermocouple of Ni-NiCr type are described. The output thermocouple signal as converted by means of voltage-to-freguency converter. The frequency is measured by a digital scaler controled by quartz generator signals. One of the described meter is coupled with digital temperature controler which drives the power stage of the reactor rig heater. The internal rig temperature is measured by the thermocouple providing the input signal to the mentioned voltage-to-frequency converter, that means the circuits work in the negative feedback loop. The converter frequency-to-voltage ratio is automatically adjusted to match to thermocouple sensitivity changes in the course of the temperature variations. The accuracy of measuring system is of order of +- 1degC for thermocouple temperature changes from 523 K up to 973 K (50degC up to 700degC). (author)

  16. The Plateau de Bure ASTEP Platform Test in natural radiation environment of electronic components and circuits

    International Nuclear Information System (INIS)

    Autran, J.L.; Munteanu, D.; Sauze, S.; Roche, Ph.; Gasiot, G.; Borel, J.

    2010-01-01

    Reducing the size of microelectronic devices and increasing the integration density of circuits lead (following the famous Moore's law) to an increased sensitivity of circuits to natural terrestrial radiation environment. - Such sensitivity to atmospheric particles (mainly neutrons) can cause non-destructive (soft-errors) or destructive (latch-up) failures in most electronic circuits, including volatile static memories (SRAM), object of the research work carried out since 2004 on the European Test Platform ASTER. - This paper presents in details the ASTEP platform, its location, the instruments (neutron monitor of the Plateau de Bure) and the experiences (memory tester) currently installed on the Plateau de Bure. In a second part, we also report a synthesis of the key results concerning the natural radiation sensitivity of SRAM fabricated in 130 nm and 65 nm bulk silicon technologies. (authors)

  17. RF and microwave integrated circuit development technology, packaging and testing

    CERN Document Server

    Gamand, Patrice; Kelma, Christophe

    2018-01-01

    RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development. In addition, the authors provide practical answers and solutions regarding the choice of technology, the packaging solutions and the effects on the performance on the circuit and to the industrial testing strategy. It will also discuss future trends and challenges and includes case studies to illustrate examples. * Offers an overview of the challenges in RF/microwave product design * Provides practical answers to packaging issues and evaluates its effect on the performance of the circuit * Includes industrial testing strategies * Examines relevant RF MIC technologies and the factors which affect the choice of technology for a particular application, e.g. technical performance and cost * Discusses future trends and challen...

  18. Design and Verification of Application Specific Integrated Circuits in a Network of Online Labs

    Directory of Open Access Journals (Sweden)

    A.Y. Al-Zoubi

    2009-08-01

    Full Text Available A solution to implement a remote laboratory for testing and designing analog Application-Specific Integrated Circuits of the type (ispPAC10 is presented. The application allows electrical engineering students to access and perform measurements and conduct analog electronics experiments over the internet. PAC-Designer software, running on a Citrix server, is used in the circuit design in which the signals are generated and the responses are acquired by a data acquisition board controlled by LabVIEW. Three interconnected remote labs located in three different continents will be implementing the proposed system.

  19. Highly integrated electronics for the star TPC

    Energy Technology Data Exchange (ETDEWEB)

    Arthur, A.A.; Bieser, F.; Hearn, W.; Kleinfelder, S.; Merrick, T.; Millaud, J.; Noggle, T.; Rai, G.; Ritter, H.G.; Wieman, H. [Lawrence Berkeley Laboratory, CA (United States)

    1991-12-31

    The concept for the STAR TPC front-end electronics is presented and the progress toward the development of a fully integrated solution is described. It is the goal of the R+D program to develop the complete electronics chain for the STAR central TPC detector at RHIC. It is obvious that solutions chosen e.g. for ALEPH are not adequate for the 150000 channels that need to be instrumented for readout. It will be necessary to perform all the signal processing, digitization and multiplexing directly on the detector in order to reduce per channel cost and the amount of cabling necessary to read out the information. We follow the approach chosen by the EOS TPC project, where the readout electronics on the detector consists of an integrated preamplifier, a hybrid shaping amplifier, an integrated switched capacitor array and a highly multiplexed ADC. The STAR electronics will be further integrated so that approximately 16 channels of the preamplifier, the shaper, the analog store and the ADC will be contained in two integrated circuits located directly on the pad plane.

  20. Trends in integrated circuit design for particle physics experiments

    International Nuclear Information System (INIS)

    Atkin, E V

    2017-01-01

    Integrated circuits are one of the key complex units available to designers of multichannel detector setups. A whole number of factors makes Application Specific Integrated Circuits (ASICs) valuable for Particle Physics and Astrophysics experiments. Among them the most important ones are: integration scale, low power dissipation, radiation tolerance. In order to make possible future experiments in the intensity, cosmic, and energy frontiers today ASICs should provide new level of functionality at a new set of constraints and trade-offs, like low-noise high-dynamic range amplification and pulse shaping, high-speed waveform sampling, low power digitization, fast digital data processing, serialization and data transmission. All integrated circuits, necessary for physical instrumentation, should be radiation tolerant at an earlier not reached level (hundreds of Mrad) of total ionizing dose and allow minute almost 3D assemblies. The paper is based on literary source analysis and presents an overview of the state of the art and trends in nowadays chip design, using partially own ASIC lab experience. That shows a next stage of ising micro- and nanoelectronics in physical instrumentation. (paper)

  1. Tomonaga-Luttinger physics in electronic quantum circuits.

    Science.gov (United States)

    Jezouin, S; Albert, M; Parmentier, F D; Anthore, A; Gennser, U; Cavanna, A; Safi, I; Pierre, F

    2013-01-01

    In one-dimensional conductors, interactions result in correlated electronic systems. At low energy, a hallmark signature of the so-called Tomonaga-Luttinger liquids is the universal conductance curve predicted in presence of an impurity. A seemingly different topic is the quantum laws of electricity, when distinct quantum conductors are assembled in a circuit. In particular, the conductances are suppressed at low energy, a phenomenon called dynamical Coulomb blockade. Here we investigate the conductance of mesoscopic circuits constituted by a short single-channel quantum conductor in series with a resistance, and demonstrate a proposed link to Tomonaga-Luttinger physics. We reformulate and establish experimentally a recently derived phenomenological expression for the conductance using a wide range of circuits, including carbon nanotube data obtained elsewhere. By confronting both conductance data and phenomenological expression with the universal Tomonaga-Luttinger conductance curve, we demonstrate experimentally the predicted mapping between dynamical Coulomb blockade and the transport across a Tomonaga-Luttinger liquid with an impurity.

  2. Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays

    OpenAIRE

    Çiçek, İhsan; Cicek, Ihsan; Bozkurt, Ayhan; Karaman, Mustafa

    2005-01-01

    Integration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMU...

  3. 77 FR 60721 - Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Notice of...

    Science.gov (United States)

    2012-10-04

    ... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-840] Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Notice of Commission Determination Not To Review an Initial... certain semiconductor integrated circuit devices and products containing same by reason of infringement of...

  4. 77 FR 19032 - Certain Semiconductor Integrated Circuit Devices and Products Containing Same Notice of Receipt...

    Science.gov (United States)

    2012-03-29

    ... INTERNATIONAL TRADE COMMISSION [DN 2888] Certain Semiconductor Integrated Circuit Devices and... the U.S. International Trade Commission has received a complaint entitled Certain Semiconductor... importation of certain semiconductor integrated circuit devices and products containing same. The complaint...

  5. 77 FR 39510 - Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Determination Not...

    Science.gov (United States)

    2012-07-03

    ... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-840] Certain Semiconductor Integrated Circuit Devices and Products Containing Same; Determination Not To Review an Initial Determination... certain semiconductor integrated circuit devices and products containing same by reason of infringement of...

  6. 75 FR 5804 - In the Matter of: Certain Semiconductor Integrated Circuits and Products Containing Same; Notice...

    Science.gov (United States)

    2010-02-04

    ... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-665] In the Matter of: Certain Semiconductor Integrated Circuits and Products Containing Same; Notice of Commission Determination To Review in... importation of certain semiconductor integrated circuits and products containing same by reason of...

  7. Design techniques for low-voltage analog integrated circuits

    Science.gov (United States)

    Rakús, Matej; Stopjaková, Viera; Arbet, Daniel

    2017-08-01

    In this paper, a review and analysis of different design techniques for (ultra) low-voltage integrated circuits (IC) are performed. This analysis shows that the most suitable design methods for low-voltage analog IC design in a standard CMOS process include techniques using bulk-driven MOS transistors, dynamic threshold MOS transistors and MOS transistors operating in weak or moderate inversion regions. The main advantage of such techniques is that there is no need for any modification of standard CMOS structure or process. Basic circuit building blocks like differential amplifiers or current mirrors designed using these approaches are able to operate with the power supply voltage of 600 mV (or even lower), which is the key feature towards integrated systems for modern portable applications.

  8. Monolithic Microwave Integrated Circuit (MMIC) technology for space communications applications

    Science.gov (United States)

    Connolly, Denis J.; Bhasin, Kul B.; Romanofsky, Robert R.

    1987-01-01

    Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMIC's to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMIC's is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. For the more distant future pseudomorphic indium gallium arsenide (InGaAs) and other advanced III-V materials offer the possibility of MMIC subsystems well up into the millimeter wavelength region. All of these technology elements are in NASA's MMIC program. Their status is reviewed.

  9. Materials Integration and Doping of Carbon Nanotube-based Logic Circuits

    Science.gov (United States)

    Geier, Michael

    Over the last 20 years, extensive research into the structure and properties of single- walled carbon nanotube (SWCNT) has elucidated many of the exceptional qualities possessed by SWCNTs, including record-setting tensile strength, excellent chemical stability, distinctive optoelectronic features, and outstanding electronic transport characteristics. In order to exploit these remarkable qualities, many application-specific hurdles must be overcome before the material can be implemented in commercial products. For electronic applications, recent advances in sorting SWCNTs by electronic type have enabled significant progress towards SWCNT-based integrated circuits. Despite these advances, demonstrations of SWCNT-based devices with suitable characteristics for large-scale integrated circuits have been limited. The processing methodologies, materials integration, and mechanistic understanding of electronic properties developed in this dissertation have enabled unprecedented scales of SWCNT-based transistor fabrication and integrated circuit demonstrations. Innovative materials selection and processing methods are at the core of this work and these advances have led to transistors with the necessary transport properties required for modern circuit integration. First, extensive collaborations with other research groups allowed for the exploration of SWCNT thin-film transistors (TFTs) using a wide variety of materials and processing methods such as new dielectric materials, hybrid semiconductor materials systems, and solution-based printing of SWCNT TFTs. These materials were integrated into circuit demonstrations such as NOR and NAND logic gates, voltage-controlled ring oscillators, and D-flip-flops using both rigid and flexible substrates. This dissertation explores strategies for implementing complementary SWCNT-based circuits, which were developed by using local metal gate structures that achieve enhancement-mode p-type and n-type SWCNT TFTs with widely separated and

  10. Study of integrated circuits in natural space environment

    International Nuclear Information System (INIS)

    Karoui, S.

    1993-11-01

    In this thesis we study one of the critical phenomena induced by the radiation of integrated circuits in the natural space environment: the so-called upset phenomenon. This phenomenon, caused by a heavy-ion strike on circuit sensitive areas, result in the modification of the information stored in a memory element. Upsets may then perturb the functioning of satellite-borne complex processors with serious consequences on the control of equipments operating in space. As commonly used processes or design hardening techniques cannot guarantee a total immunity against upsets, provisional methods are generally adopted to select the less sensitive circuits among components to be used in a space application. These methods consist in the simulation of the irradiated environment by means of particle accelerators, to get experimental figures about the upset sensitivity of the considered circuit, and the use of these measures to estimate the in orbit circuit vulnerability. To implement such experiments on different processor types, we have designed and developed a dedicated test system, the FUTE 16 tester. This tester has been used in several test experiments where irradiated environment was simulated by means of particle accelerators. The activity of the target circuit during the irradiation could have a great influence on the measured upset sensitivity. Generally used test sequences so-called ''register test'', consist on the initialization of accessible registers with known data, and the observation of their content after a given delay to detect errors due to upsets. The main goal of this thesis is to compare in orbit error rate estimations obtained with register tests, to those obtained with ''application like'' test sequences. Both kinds of test sequences have been used during heavy-ion test experiments performed on commercially available CISC and RISC processors. The results obtained clearly show that using ''register tests'' may lead to wrong decisions in the selections

  11. Optimization of Segmentation Quality of Integrated Circuit Images

    Directory of Open Access Journals (Sweden)

    Gintautas Mušketas

    2012-04-01

    Full Text Available The paper presents investigation into the application of genetic algorithms for the segmentation of the active regions of integrated circuit images. This article is dedicated to a theoretical examination of the applied methods (morphological dilation, erosion, hit-and-miss, threshold and describes genetic algorithms, image segmentation as optimization problem. The genetic optimization of the predefined filter sequence parameters is carried out. Improvement to segmentation accuracy using a non optimized filter sequence makes 6%.Artcile in Lithuanian

  12. Integrated biocircuits: engineering functional multicellular circuits and devices

    Science.gov (United States)

    Prox, Jordan; Smith, Tory; Holl, Chad; Chehade, Nick; Guo, Liang

    2018-04-01

    Objective. Implantable neurotechnologies have revolutionized neuromodulatory medicine for treating the dysfunction of diseased neural circuitry. However, challenges with biocompatibility and lack of full control over neural network communication and function limits the potential to create more stable and robust neuromodulation devices. Thus, we propose a platform technology of implantable and programmable cellular systems, namely Integrated Biocircuits, which use only cells as the functional components of the device. Approach. We envision the foundational principles for this concept begins with novel in vitro platforms used for the study and reconstruction of cellular circuitry. Additionally, recent advancements in organoid and 3D culture systems account for microenvironment factors of cytoarchitecture to construct multicellular circuits as they are normally formed in the brain. We explore the current state of the art of these platforms to provide knowledge of their advancements in circuit fabrication and identify the current biological principles that could be applied in designing integrated biocircuit devices. Main results. We have highlighted the exemplary methodologies and techniques of in vitro circuit fabrication and propose the integration of selected controllable parameters, which would be required in creating suitable biodevices. Significance. We provide our perspective and propose new insights into the future of neuromodulaion devices within the scope of living cellular systems that can be applied in designing more reliable and biocompatible stimulation-based neuroprosthetics.

  13. Control circuits for the 1.3 GeV electron synchrotron

    International Nuclear Information System (INIS)

    Asaoka, S.; Shiino, K.; Yoshioka, M.; Norimura, K.

    1980-01-01

    Following control circuits for the 1.3 GeV electron synchrotron, Institute for Nuclear Study, University of Tokyo, have been designed and constructed. 1. Variable delay circuits for the timing pulse of the synchrotron. 2. An alarm circuit for sputter ion pumps. 3. A sample and hold circuit for digital display and computer control of the beam intensity. This report describes detailes of the circuits and their specificatons. (author)

  14. Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics

    Science.gov (United States)

    Wang, Shuodao; Huang, Yonggang; Rogers, John A.

    2016-01-01

    Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent microscale/nanoscale devices, and experimental characterization. All of the designs reported here adopt heterogeneous structures of rigid and brittle inorganic materials on soft and elastic elastomeric substrates, with mechanical design layouts that isolate large deformations to the elastomer, thereby avoiding potentially destructive plastic strains in the brittle materials. The overall stiffnesses of the electronics, their stretchability, and curvilinear shapes can be designed to match the mechanical properties of biological tissues. The result is a class of soft stretchable electronic systems that are compatible with traditional high-performance inorganic semiconductor technologies. These systems afford promising options for applications in portable biomedical and health-monitoring devices. Mechanics theories and modeling play a key role in understanding the underlining physics and optimization of these systems. PMID:27668126

  15. Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics.

    Science.gov (United States)

    Wang, Shuodao; Huang, Yonggang; Rogers, John A

    2015-09-01

    Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent microscale/nanoscale devices, and experimental characterization. All of the designs reported here adopt heterogeneous structures of rigid and brittle inorganic materials on soft and elastic elastomeric substrates, with mechanical design layouts that isolate large deformations to the elastomer, thereby avoiding potentially destructive plastic strains in the brittle materials. The overall stiffnesses of the electronics, their stretchability, and curvilinear shapes can be designed to match the mechanical properties of biological tissues. The result is a class of soft stretchable electronic systems that are compatible with traditional high-performance inorganic semiconductor technologies. These systems afford promising options for applications in portable biomedical and health-monitoring devices. Mechanics theories and modeling play a key role in understanding the underlining physics and optimization of these systems.

  16. Study and realization of ultra-rapid logic circuits in middle scale integration

    International Nuclear Information System (INIS)

    Verhaeghe, Michel

    1972-01-01

    We associate middle scale integration with sub-nanosecond logic in order to realize ultra-rapid logic circuits, characterized by a 40 gates complexity for a dissipation lower than 1 watt. For this purpose, we must find a high special and low power gates family. With use of current mode logic, and sharing of the logic circuit between an internal part and interfaces, mean dissipation can be lowered to 20 mW while mean propagation time is 1 ns by gate. So, circuits present a speed-power product of 20 mW x ns giving to them one of the best places among the other types of ultra-rapid logic. Another interesting aspect of the work is the use of diffused components master slice including specialized integrated cells, fitting well complex circuits. With this master slice and the different gates, settlement of mean complexity circuits family is foreseen. The elements of this family would be able to reply to the main needs of rapid electronics. (author) [fr

  17. A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit

    Directory of Open Access Journals (Sweden)

    Zong Yao

    2016-06-01

    Full Text Available This paper focuses on the design and fabrication of a high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit, which consists of an encapsulated pressure-sensitive chip, a temperature compensation circuit and a signal-conditioning circuit. A silicon on insulation (SOI material and a standard MEMS process are used in the pressure-sensitive chip fabrication, and high-temperature electronic components are adopted in the temperature-compensation and signal-conditioning circuits. The entire pressure sensor achieves a hermetic seal and can be operated long-term in the range of −50 °C to 220 °C. Unlike traditional pressure sensor output voltage ranges (in the dozens to hundreds of millivolts, the output voltage of this sensor is from 0 V to 5 V, which can significantly improve the signal-to-noise ratio and measurement accuracy in practical applications of long-term transmission based on experimental verification. Furthermore, because this flexible sensor’s output voltage is adjustable, general follow-up pressure transmitter devices for voltage converters need not be used, which greatly reduces the cost of the test system. Thus, the proposed high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit is expected to be highly applicable to pressure measurements in harsh environments.

  18. Arbitrary modeling of TSVs for 3D integrated circuits

    CERN Document Server

    Salah, Khaled; El-Rouby, Alaa

    2014-01-01

    This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor?and inductive-based

  19. Integrating anatomy and function for zebrafish circuit analysis.

    Science.gov (United States)

    Arrenberg, Aristides B; Driever, Wolfgang

    2013-01-01

    Due to its transparency, virtually every brain structure of the larval zebrafish is accessible to light-based interrogation of circuit function. Advanced stimulation techniques allow the activation of optogenetic actuators at different resolution levels, and genetically encoded calcium indicators report the activity of a large proportion of neurons in the CNS. Large datasets result and need to be analyzed to identify cells that have specific properties-e.g., activity correlation to sensory stimulation or behavior. Advances in three-dimensional (3D) functional mapping in zebrafish are promising; however, the mere coordinates of implicated neurons are not sufficient. To comprehensively understand circuit function, these functional maps need to be placed into the proper context of morphological features and projection patterns, neurotransmitter phenotypes, and key anatomical landmarks. We discuss the prospect of merging functional and anatomical data in an integrated atlas from the perspective of our work on long-range dopaminergic neuromodulation and the oculomotor system. We propose that such a resource would help researchers to surpass current hurdles in circuit analysis to achieve an integrated understanding of anatomy and function.

  20. Fully integrated circuit chip of microelectronic neural bridge

    Science.gov (United States)

    Xiaoyan, Shen; Zhigong, Wang

    2014-09-01

    Nerve tracts interruption is one of the major reasons for dysfunction after spiral cord injury. The microelectronic neural bridge is a method to restore function of interrupted neural pathways, by making use of microelectronic chips to bypass the injured nerve tracts. A low-power fully integrated microelectronic neural bridge chip is designed, using CSMC 0.5-μm CMOS technology. The structure and the key points in the circuit design will be introduced in detail. In order to meet the requirement for implantation, the circuit was modified to avoid the use of off-chip components, and fully monolithic integration is achieved. The operating voltage of the circuit is ±2.5 V, and the chip area is 1.21 × 1.18 mm2. According to the characteristic of neural signal, the time-domain method is used in testing. The pass bandwidth of the microelectronic neural bridge system covers the whole frequency range of the neural signal, power consumption is 4.33 mW, and the gain is adjustable. The design goals are achieved.

  1. Generation of optical vortices in an integrated optical circuit

    Science.gov (United States)

    Tudor, Rebeca; Kusko, Mihai; Kusko, Cristian

    2017-09-01

    In this work, the generation of optical vortices in an optical integrated circuit is numerically demonstrated. The optical vortices with topological charge m = ±1 are obtained by the coherent superposition of the first order modes present in a waveguide with a rectangular cross section, where the phase delay between these two propagating modes is Δφ = ±π/2. The optical integrated circuit consists of an input waveguide continued with a y-splitter. The left and the right arms of the splitter form two coupling regions K1 and K2 with a multimode output waveguide. In each coupling region, the fundamental modes present in the arms of the splitter are selectively coupled into the output waveguide horizontal and vertical first order modes, respectively. We showed by employing the beam propagation method simulations that the fine tuning of the geometrical parameters of the optical circuit makes possible the generation of optical vortices in both transverse electric (TE) and transverse magnetic (TM) modes. Also, we demonstrated that by placing a thermo-optical element on one of the y-splitter arms, it is possible to switch the topological charge of the generated vortex from m = 1 to m = ‑1.

  2. 75 FR 75694 - Certain Semiconductor Integration Circuits Using Tungsten Metallization and Products Containing...

    Science.gov (United States)

    2010-12-06

    ... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-648] Certain Semiconductor Integration... semiconductor integrated circuits using tungsten metallization and products containing the same by reason of...

  3. Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

    DEFF Research Database (Denmark)

    Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2015-01-01

    Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...... conditions. Some commonly used circuits are analyzed as case studies and flux related contaminations of PCBA from process is used as an example to show how different flux chemistry and humidity together compromise the circuit functionality....

  4. A novel readout integrated circuit for ferroelectric FPA detector

    Science.gov (United States)

    Bai, Piji; Li, Lihua; Ji, Yulong; Zhang, Jia; Li, Min; Liang, Yan; Hu, Yanbo; Li, Songying

    2017-11-01

    Uncooled infrared detectors haves some advantages such as low cost light weight low power consumption, and superior reliability, compared with cryogenically cooled ones Ferroelectric uncooled focal plane array(FPA) are being developed for its AC response and its high reliability As a key part of the ferroelectric assembly the ROIC determines the performance of the assembly. A top-down design model for uncooled ferroelectric readout integrated circuit(ROIC) has been developed. Based on the optical thermal and electrical properties of the ferroelectric detector the RTIA readout integrated circuit is designed. The noise bandwidth of RTIA readout circuit has been developed and analyzed. A novel high gain amplifier, a high pass filter and a low pass filter circuits are designed on the ROIC. In order to improve the ferroelectric FPA package performance and decrease of package cost a temperature sensor is designed on the ROIC chip At last the novel RTIA ROIC is implemented on 0.6μm 2P3M CMOS silicon techniques. According to the experimental chip test results the temporal root mean square(RMS)noise voltage is about 1.4mV the sensitivity of the on chip temperature sensor is 0.6 mV/K from -40°C to 60°C the linearity performance of the ROIC chip is better than 99% Based on the 320×240 RTIA ROIC, a 320×240 infrared ferroelectric FPA is fabricated and tested. Test results shows that the 320×240 RTIA ROIC meets the demand of infrared ferroelectric FPA.

  5. Inverter circuits on freestanding flexible substrate using ZnO nanoparticles for cost-efficient electronics

    Science.gov (United States)

    Vidor, Fábio F.; Meyers, Thorsten; Müller, Kathrin; Wirth, Gilson I.; Hilleringmann, Ulrich

    2017-11-01

    Driven by the Internet of Things (IoT), flexible and transparent smart systems have been intensively researched by the scientific community and by several companies. This technology is already available for consumers in a wide range of innovative products, e.g., flexible displays, radio-frequency identification tags and wearable electronic skins which, for instance, collect and analyze data for medical applications. For these systems, thin-film transistors (TFTs) are the key elements responsible for the driving currents. Solution-based materials such as nanoparticle dispersions avail the fabrication on large-area substrates with high throughput processes. In this study, we discuss the integration of ZnO nanoparticle thin-film transistors and inverter circuits on freestanding polymeric substrates enclosing the main issues concerning the transfer of the integration process from a rigid substrate to a flexible one. The TFTs depict VON between -0.2 and 1 V, ION/IOFF > 104 and field-effect mobility >0.5 cm2 V-1 s-1. Additionally, in order to enhance the transistors and inverters performance, an adaptation on the device configuration, from an inverted coplanar to an inverted staggered setup, was conducted and analyzed. By employing the inverted staggered setup a considerable increase in the contact quality between the semiconductor and the drain and source electrodes was observed. As the integrated devices depict electrical characteristics which enable the fabrication of electronic circuits for the low-cost sector, inverters were fabricated and characterized, evaluating the circuit's gain as function of the applied supply voltage and circuit's geometric ratio.

  6. Adaptive Electronic Quizzing Method for Introductory Electrical Circuit Course

    Directory of Open Access Journals (Sweden)

    Issa Batarseh

    2009-08-01

    Full Text Available The interactive technical electronic book, TechEBook, currently under development at the University of Central Florida, provides a useful tool for engineers and scientists through unique features compared to the most used traditional electrical circuit textbooks available in the market. TechEBook has comprised the two worlds of classical circuit books and an interactive operating platform such as laptops and desktops utilizing Java Virtual Machine operator. The TechEBook provides an interactive applets screen that holds many modules, in which each had a specific application in the self learning process. This paper describes one of the interactive techniques in the TechEBook known as, QuizMe, for evaluating the readers’ performance and the overall understanding for all subjects at any stage. The QuizMe will be displayed after each section in the TechEBook for the user to evaluate his/her understanding, which introduces the term me-learning, as a comprehensive full experience for self or individualized education. In this paper, a practical example of applying the QuizMe feature is discussed as part of a basic electrical engineering course currently given at the University of Central Florida.

  7. Thermionic integrated circuit technology for high power space applications

    International Nuclear Information System (INIS)

    Yadavalli, S.R.

    1984-01-01

    Thermionic triode and integrated circuit technology is in its infancy and it is emerging. The Thermionic triode can operate at relatively high voltages (up to 2000V) and at least tens of amperes. These devices, including their use in integrated circuitry, operate at high temperatures (800 0 C) and are very tolerant to nuclear and other radiations. These properties can be very useful in large space power applications such as that represented by the SP-100 system which uses a nuclear reactor. This paper presents an assessment of the application of thermionic integrated circuitry with space nuclear power system technology. A comparison is made with conventional semiconductor circuitry considering a dissipative shunt regulator for SP-100 type nuclear power system rated at 100 kW. The particular advantages of thermionic circuitry are significant reductions in size and mass of heat dissipation and radiation shield subsystems

  8. Irradiation of electronic components and circuits at the Portuguese Research Reactor: Lessons learned

    Energy Technology Data Exchange (ETDEWEB)

    Marques, J.G.; Ramos, A.R.; Fernandes, A.C.; Santos, J.P. [Centro de Ciencias e Tecnologias Nucleares, Instituto Superior Tecnico, Universidade de Lisboa, Estrada Nacional 10, 2695-066 Bobadela LRS (Portugal)

    2015-07-01

    The behavior of electronic components and circuits under radiation is a concern shared by the nuclear industry, the space community and the high-energy physics community. Standard commercial components are used as much as possible instead of radiation hard components, since they are easier to obtain and allow a significant reduction of costs. However, these standard components need to be tested in order to determine their radiation tolerance. The Portuguese Research Reactor (RPI) is a 1 MW pool-type reactor, operating since 1961. The irradiation of electronic components and circuits is one area where a 1 MW reactor can be competitive, since the fast neutron fluences required for testing are in most cases well below 10{sup 16} n/cm{sup 2}. A program was started in 1999 to test electronics components and circuits for the LHC facility at CERN, initially using a dedicated in-pool irradiation device and later a beam line with tailored neutron and gamma filters. Neutron filters are essential to reduce the intensity of the thermal neutron flux, which does not produce significant defects in electronic components but produces unwanted radiation from activation of contacts and packages of integrated circuits and also of the printed circuit boards. In irradiations performed within the line-of-sight of the core of a fission reactor there is simultaneous gamma radiation which complicates testing in some cases. Filters can be used to reduce its importance and separate testing with a pure gamma radiation source can contribute to clarify some irradiation results. Practice has shown the need to introduce several improvements to the procedures and facilities over the years. We will review improvements done in the following areas: - Optimization of neutron and gamma filters; - Dosimetry procedures in mixed neutron / gamma fields; - Determination of hardness parameter and 1 MeV-equivalent neutron fluence; - Temperature measurement and control during irradiation; - Follow-up of reactor

  9. Design and characterization of radiation resistant integrated circuits for the LHC particle detectors using deep sub-micron CMOS technologies

    International Nuclear Information System (INIS)

    Anelli, Giovanni Maria

    2000-01-01

    The electronic circuits associated with the particle detectors of the CERN Large Hadron Collider (LHC) have to work in a highly radioactive environment. This work proposes a methodology allowing the design of radiation resistant integrated circuits using the commercial sub-micron CMOS technology. This method uses the intrinsic radiation resistance of ultra-thin grid oxides, the technology of enclosed layout transistors (ELT), and the protection rings to avoid the radio-induced creation of leakage currents. In order to check the radiation tolerance level, several test structures have been designed and tested with different radiation sources. These tests have permitted to study the physical phenomena responsible for the damages induced by the radiations and the possible remedies. Then, the particular characteristics of ELT transistors and their influence on the design of complex integrated circuits has been explored. The modeling of the W/L ratio, the asymmetries (for instance in the output conductance) and the performance of ELT couplings have never been studied yet. The noise performance of the 0.25 μ CMOS technology, used in the design of several integrated circuits of the LHC detectors, has been characterized before and after irradiation. Finally, two integrated circuits designed using the proposed method are presented. The first one is an analogic memory and the other is a circuit used for the reading of the signals of one of the LHC detectors. Both circuits were irradiated and have endured very high doses practically without any sign of performance degradation. (J.S.)

  10. Ultra-low power integrated circuit design circuits, systems, and applications

    CERN Document Server

    Li, Dongmei; Wang, Zhihua

    2014-01-01

    This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.

  11. Amorphous Zinc Oxide Integrated Wavy Channel Thin Film Transistor Based High Performance Digital Circuits

    KAUST Repository

    Hanna, Amir

    2015-12-04

    High performance thin film transistor (TFT) can be a great driving force for display, sensor/actuator, integrated electronics, and distributed computation for Internet of Everything applications. While semiconducting oxides like zinc oxide (ZnO) present promising opportunity in that regard, still wide area of improvement exists to increase the performance further. Here, we show a wavy channel (WC) architecture for ZnO integrated TFT which increases transistor width without chip area penalty, enabling high performance in material agnostic way. We further demonstrate digital logic NAND circuit using the WC architecture and compare it to the conventional planar architecture. The WC architecture circuits have shown 2× higher peak-to-peak output voltage for the same input voltage. They also have 3× lower high-to-low propagation delay times, respectively, when compared to the planar architecture. The performance enhancement is attributed to both extra device width and enhanced field effect mobility due to higher gate field electrostatics control.

  12. Investigation of Optimal Integrated Circuit Raster Image Vectorization Method

    Directory of Open Access Journals (Sweden)

    Leonas Jasevičius

    2011-03-01

    Full Text Available Visual analysis of integrated circuit layer requires raster image vectorization stage to extract layer topology data to CAD tools. In this paper vectorization problems of raster IC layer images are presented. Various line extraction from raster images algorithms and their properties are discussed. Optimal raster image vectorization method was developed which allows utilization of common vectorization algorithms to achieve the best possible extracted vector data match with perfect manual vectorization results. To develop the optimal method, vectorized data quality dependence on initial raster image skeleton filter selection was assessed.Article in Lithuanian

  13. Integrated circuit authentication hardware Trojans and counterfeit detection

    CERN Document Server

    Tehranipoor, Mohammad; Zhang, Xuehui

    2013-01-01

    This book describes techniques to verify the authenticity of integrated circuits (ICs). It focuses on hardware Trojan detection and prevention and counterfeit detection and prevention. The authors discuss a variety of detection schemes and design methodologies for improving Trojan detection techniques, as well as various attempts at developing hardware Trojans in IP cores and ICs. While describing existing Trojan detection methods, the authors also analyze their effectiveness in disclosing various types of Trojans, and demonstrate several architecture-level solutions. 

  14. Circuit arrangement of an electronic component for the design of fail-safe protective circuits

    International Nuclear Information System (INIS)

    Centmaier, W.; Bernhard, U.; Friederich, B.; Heisecke, I.

    1974-01-01

    The critical parameters of reactors are controlled by safety circuits. These circuits are controlled designed as logic modules operating by the 'n-out-of-m' selection principle. In most cases, a combination of a '1-out-of-3' circuit with a '2-out-of-3' circuit and separate indication is sufficient for a dynamic fail-safe circuit. The basic logic elements are AND and OR gate circuits, respectively, which are triggered by pulse trains and in which the failure of a pulse train is indicated as an error at the output. The module allows the design of safety circuits offering various degrees of safety. If the indication of an error is made on the modules, faulty components can be exchanged by the maintenance crew right away. (DG) [de

  15. Directly writing resistor, inductor and capacitor to composite functional circuits: a super-simple way for alternative electronics.

    Science.gov (United States)

    Gao, Yunxia; Li, Haiyan; Liu, Jing

    2013-01-01

    The current strategies for making electronic devices are generally time, water, material and energy consuming. Here, the direct writing of composite functional circuits through comprehensive use of GaIn10-based liquid metal inks and matching material is proposed and investigated, which is a rather easy going and cost effective electronics fabrication way compared with the conventional approaches. Owing to its excellent adhesion and electrical properties, the liquid metal ink was demonstrated as a generalist in directly making various basic electronic components such as planar resistor, inductor and capacitor or their combination and thus composing circuits with expected electrical functions. For a precise control of the geometric sizes of the writing, a mask with a designed pattern was employed and demonstrated. Mechanisms for justifying the chemical components of the inks and the magnitudes of the target electronic elements so as to compose various practical circuits were disclosed. Fundamental tests on the electrical components including capacitor and inductor directly written on paper with working time up to 48 h and elevated temperature demonstrated their good stability and potential widespread adaptability especially when used in some high frequency circuits. As the first proof-of-concept experiment, a typical functional oscillating circuit including an integrated chip of 74HC04 with a supply voltage of 5 V, a capacitor of 10 nF and two resistors of 5 kΩ and 1 kΩ respectively was directly composed on paper through integrating specific electrical elements together, which presented an oscillation frequency of 8.8 kHz. The present method significantly extends the roles of the metal ink in recent works serving as only a single electrical conductor or interconnecting wires. It opens the way for directly writing out complex functional circuits or devices on different substrates. Such circuit composition strategy has generalized purpose and can be extended to more

  16. Directly Writing Resistor, Inductor and Capacitor to Composite Functional Circuits: A Super-Simple Way for Alternative Electronics

    Science.gov (United States)

    Gao, Yunxia; Li, Haiyan; Liu, Jing

    2013-01-01

    Background The current strategies for making electronic devices are generally time, water, material and energy consuming. Here, the direct writing of composite functional circuits through comprehensive use of GaIn10-based liquid metal inks and matching material is proposed and investigated, which is a rather easy going and cost effective electronics fabrication way compared with the conventional approaches. Methods Owing to its excellent adhesion and electrical properties, the liquid metal ink was demonstrated as a generalist in directly making various basic electronic components such as planar resistor, inductor and capacitor or their combination and thus composing circuits with expected electrical functions. For a precise control of the geometric sizes of the writing, a mask with a designed pattern was employed and demonstrated. Mechanisms for justifying the chemical components of the inks and the magnitudes of the target electronic elements so as to compose various practical circuits were disclosed. Results Fundamental tests on the electrical components including capacitor and inductor directly written on paper with working time up to 48 h and elevated temperature demonstrated their good stability and potential widespread adaptability especially when used in some high frequency circuits. As the first proof-of-concept experiment, a typical functional oscillating circuit including an integrated chip of 74HC04 with a supply voltage of 5 V, a capacitor of 10 nF and two resistors of 5 kΩ and 1 kΩ respectively was directly composed on paper through integrating specific electrical elements together, which presented an oscillation frequency of 8.8 kHz. Conclusions The present method significantly extends the roles of the metal ink in recent works serving as only a single electrical conductor or interconnecting wires. It opens the way for directly writing out complex functional circuits or devices on different substrates. Such circuit composition strategy has

  17. Directly writing resistor, inductor and capacitor to composite functional circuits: a super-simple way for alternative electronics.

    Directory of Open Access Journals (Sweden)

    Yunxia Gao

    Full Text Available BACKGROUND: The current strategies for making electronic devices are generally time, water, material and energy consuming. Here, the direct writing of composite functional circuits through comprehensive use of GaIn10-based liquid metal inks and matching material is proposed and investigated, which is a rather easy going and cost effective electronics fabrication way compared with the conventional approaches. METHODS: Owing to its excellent adhesion and electrical properties, the liquid metal ink was demonstrated as a generalist in directly making various basic electronic components such as planar resistor, inductor and capacitor or their combination and thus composing circuits with expected electrical functions. For a precise control of the geometric sizes of the writing, a mask with a designed pattern was employed and demonstrated. Mechanisms for justifying the chemical components of the inks and the magnitudes of the target electronic elements so as to compose various practical circuits were disclosed. RESULTS: Fundamental tests on the electrical components including capacitor and inductor directly written on paper with working time up to 48 h and elevated temperature demonstrated their good stability and potential widespread adaptability especially when used in some high frequency circuits. As the first proof-of-concept experiment, a typical functional oscillating circuit including an integrated chip of 74HC04 with a supply voltage of 5 V, a capacitor of 10 nF and two resistors of 5 kΩ and 1 kΩ respectively was directly composed on paper through integrating specific electrical elements together, which presented an oscillation frequency of 8.8 kHz. CONCLUSIONS: The present method significantly extends the roles of the metal ink in recent works serving as only a single electrical conductor or interconnecting wires. It opens the way for directly writing out complex functional circuits or devices on different substrates. Such circuit

  18. Radiation-Hard Complementary Integrated Circuits Based on Semiconducting Single-Walled Carbon Nanotubes.

    Science.gov (United States)

    McMorrow, Julian J; Cress, Cory D; Gaviria Rojas, William A; Geier, Michael L; Marks, Tobin J; Hersam, Mark C

    2017-03-28

    Increasingly complex demonstrations of integrated circuit elements based on semiconducting single-walled carbon nanotubes (SWCNTs) mark the maturation of this technology for use in next-generation electronics. In particular, organic materials have recently been leveraged as dopant and encapsulation layers to enable stable SWCNT-based rail-to-rail, low-power complementary metal-oxide-semiconductor (CMOS) logic circuits. To explore the limits of this technology in extreme environments, here we study total ionizing dose (TID) effects in enhancement-mode SWCNT-CMOS inverters that employ organic doping and encapsulation layers. Details of the evolution of the device transport properties are revealed by in situ and in operando measurements, identifying n-type transistors as the more TID-sensitive component of the CMOS system with over an order of magnitude larger degradation of the static power dissipation. To further improve device stability, radiation-hardening approaches are explored, resulting in the observation that SWNCT-CMOS circuits are TID-hard under dynamic bias operation. Overall, this work reveals conditions under which SWCNTs can be employed for radiation-hard integrated circuits, thus presenting significant potential for next-generation satellite and space applications.

  19. Interactive Electronic Circuit Simulation on Small Computer Systems

    Science.gov (United States)

    1979-11-01

    State Circuits, SC-11, No. 5, 730-732, Octo- ber 1976. 3. A. R. Newton and G. L. Taylor, BIASL.25, A MOS Circuit Simulator, Tenth Annual Asilo ...Analysis Time, Accuracy, and Memory Requirement Tradeoffs in SPICE2, Eleventh Annual Asilo - mar Conference on Circuits, Systems and Computers

  20. RELATIONAL THEORY APPLICATION FOR OPTIMAL DESIGN OF INTEGRATED CIRCUITS

    Directory of Open Access Journals (Sweden)

    D. V. Demidov

    2014-09-01

    Full Text Available This paper deals with a method of relational theory adaptation for integrated circuits CAD systems. A new algorithm is worked out for optimal search of implicit Don’t Care values for combinational multiple-level digital circuits. The algorithm is described in terms of the adapted relational theory that gives the possibility for a very simple algorithm description for both intuitive understanding and formal analysis. The proposed method makes it possible to apply progressive experience of relational databases in efficient implementation of relational algebra operations (including distributed ones. Comparative analysis of the proposed algorithm and a classic one for optimal search of implicit Don’t Cares is carried out. The analysis has proved formal correctness of the proposed algorithm and its considerably less worst-case complexity. The search of implicit Don’t Care values in the integrated circuits design makes it easier to optimize such characteristics of IC as chip area, power, verifiability and reliability. However, the classic algorithm for optimal search of implicit Don’t Care values is not used in practice due to its very high computational complexity. Application of algorithms for sub-optimal search doesn’t give the possibility to realize the potential of IC optimization to the full. Implementation of the proposed algorithm in IC CAD (a.k.a., EDA systems is adequate due to much lower computational complexity, and potentially makes it possible to improve the quality-development time ratio of IC (chip area, power, verifiability and reliability. Developed method gives the possibility for creation of distributed EDA system with higher computational power and, consequently, for design automation of more complex IC.

  1. TUTORIAL: Integrated circuit amplifiers for multi-electrode intracortical recording

    Science.gov (United States)

    Jochum, Thomas; Denison, Timothy; Wolf, Patrick

    2009-02-01

    Significant progress has been made in systems that interpret the electrical signals of the brain in order to control an actuator. One version of these systems senses neuronal extracellular action potentials with an array of up to 100 miniature probes inserted into the cortex. The impedance of each probe is high, so environmental electrical noise is readily coupled to the neuronal signal. To minimize this noise, an amplifier is placed close to each probe. Thus, the need has arisen for many amplifiers to be placed near the cortex. Commercially available integrated circuits do not satisfy the area, power and noise requirements of this application, so researchers have designed custom integrated-circuit amplifiers. This paper presents a comprehensive survey of the neural amplifiers described in publications prior to 2008. Methods to achieve high input impedance, low noise and a large time-constant high-pass filter are reviewed. A tutorial on the biological, electrochemical, mechanical and electromagnetic phenomena that influence amplifier design is provided. Areas for additional research, including sub-nanoampere electrolysis and chronic cortical heating, are discussed. Unresolved design concerns, including teraohm circuitry, electrical overstress and component failure, are identified.

  2. Integrated circuit amplifiers for multi-electrode intracortical recording.

    Science.gov (United States)

    Jochum, Thomas; Denison, Timothy; Wolf, Patrick

    2009-02-01

    Significant progress has been made in systems that interpret the electrical signals of the brain in order to control an actuator. One version of these systems senses neuronal extracellular action potentials with an array of up to 100 miniature probes inserted into the cortex. The impedance of each probe is high, so environmental electrical noise is readily coupled to the neuronal signal. To minimize this noise, an amplifier is placed close to each probe. Thus, the need has arisen for many amplifiers to be placed near the cortex. Commercially available integrated circuits do not satisfy the area, power and noise requirements of this application, so researchers have designed custom integrated-circuit amplifiers. This paper presents a comprehensive survey of the neural amplifiers described in publications prior to 2008. Methods to achieve high input impedance, low noise and a large time-constant high-pass filter are reviewed. A tutorial on the biological, electrochemical, mechanical and electromagnetic phenomena that influence amplifier design is provided. Areas for additional research, including sub-nanoampere electrolysis and chronic cortical heating, are discussed. Unresolved design concerns, including teraohm circuitry, electrical overstress and component failure, are identified.

  3. Development of optical packet and circuit integrated ring network testbed.

    Science.gov (United States)

    Furukawa, Hideaki; Harai, Hiroaki; Miyazawa, Takaya; Shinada, Satoshi; Kawasaki, Wataru; Wada, Naoya

    2011-12-12

    We developed novel integrated optical packet and circuit switch-node equipment. Compared with our previous equipment, a polarization-independent 4 × 4 semiconductor optical amplifier switch subsystem, gain-controlled optical amplifiers, and one 100 Gbps optical packet transponder and seven 10 Gbps optical path transponders with 10 Gigabit Ethernet (10GbE) client-interfaces were newly installed in the present system. The switch and amplifiers can provide more stable operation without equipment adjustments for the frequent polarization-rotations and dynamic packet-rate changes of optical packets. We constructed an optical packet and circuit integrated ring network testbed consisting of two switch nodes for accelerating network development, and we demonstrated 66 km fiber transmission and switching operation of multiplexed 14-wavelength 10 Gbps optical paths and 100 Gbps optical packets encapsulating 10GbE frames. Error-free (frame error rate optical packets of various packet lengths and packet rates, and stable operation of the network testbed was confirmed. In addition, 4K uncompressed video streaming over OPS links was successfully demonstrated. © 2011 Optical Society of America

  4. Numerical counting ratemeter with variable time constant and integrated circuits

    International Nuclear Information System (INIS)

    Kaiser, J.; Fuan, J.

    1967-01-01

    We present here the prototype of a numerical counting ratemeter which is a special version of variable time-constant frequency meter (1). The originality of this work lies in the fact that the change in the time constant is carried out automatically. Since the criterion for this change is the accuracy in the annunciated result, the integration time is varied as a function of the frequency. For the prototype described in this report, the time constant varies from 1 sec to 1 millisec. for frequencies in the range 10 Hz to 10 MHz. This prototype is built entirely of MECL-type integrated circuits from Motorola and is thus contained in two relatively small boxes. (authors) [fr

  5. Control technology for integrated circuit fabrication at Micro-Circuit Engineering, Incorporated, West Palm Beach, Florida

    Science.gov (United States)

    Mihlan, G. I.; Mitchell, R. I.; Smith, R. K.

    1984-07-01

    A survey to assess control technology for integrated circuit fabrication was conducted. Engineering controls included local and general exhaust ventilation, shielding, and personal protective equipment. Devices or work stations that contained toxic materials that were potentially dangerous were controlled by local exhaust ventilation. Less hazardous areas were controlled by general exhaust ventilation. Process isolation was used in the plasma etching, low pressure chemical vapor deposition, and metallization operations. Shielding was used in ion implantation units to control X-ray emissions, in contact mask alignes to limit ultraviolet (UV) emissions, and in plasma etching units to control radiofrequency and UV emissions. Most operations were automated. Use of personal protective equipment varied by job function.

  6. The integration of cryogenic cooling systems with superconducting electronic systems

    International Nuclear Information System (INIS)

    Green, Michael A.

    2003-01-01

    The need for cryogenic cooling has been critical issue that has kept superconducting electronic devices from reaching the market place. Even though the performance of the superconducting circuit is superior to silicon electronics, the requirement for cryogenic cooling has put the superconducting devices at a disadvantage. This report will talk about the various methods for refrigerating superconducting devices. Cryocooler types will be compared for vibration, efficiency, and cost. Some solutions to specific problems of integrating cryocoolers to superconducting devices are presented.

  7. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    Energy Technology Data Exchange (ETDEWEB)

    Mitra, Kalyan Yoti, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de; Sowade, Enrico, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Martínez-Domingo, Carme [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra, Spain and Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Ramon, Eloi, E-mail: eloi.ramon@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Nanobioelectronics and Biosensors Group, Catalan Institute of Nanotechnology (ICN), Universitat Autònoma de Barcelona, Bellaterra, Catalonia (Spain); Carrabina, Jordi, E-mail: jordi.carrabina@uab.cat [Printed Microelectronics Group, CAIAC, Universitat Autònoma de Barcelona, Bellaterra (Spain); Gomes, Henrique Leonel, E-mail: hgomes@ualg.pt [Universidade do Algarve, Institute of Telecommunications, Faro (Portugal); Baumann, Reinhard R., E-mail: reinhard.baumann@mb.tu-chemnitz.de [Technische Universität Chemnitz, Department of Digital Printing and Imaging Technology, Chemnitz (Germany); Fraunhofer Institute for Electronic Nano Systems (ENAS), Department of Printed Functionalities, Chemnitz (Germany)

    2015-02-17

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

  8. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    Science.gov (United States)

    Mitra, Kalyan Yoti; Sowade, Enrico; Martínez-Domingo, Carme; Ramon, Eloi; Carrabina, Jordi; Gomes, Henrique Leonel; Baumann, Reinhard R.

    2015-02-01

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as "Bridging Platform". This transfer to "Bridging Platform" from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

  9. Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

    International Nuclear Information System (INIS)

    Mitra, Kalyan Yoti; Sowade, Enrico; Martínez-Domingo, Carme; Ramon, Eloi; Carrabina, Jordi; Gomes, Henrique Leonel; Baumann, Reinhard R.

    2015-01-01

    Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit

  10. Perspective: The future of quantum dot photonic integrated circuits

    Directory of Open Access Journals (Sweden)

    Justin C. Norman

    2018-03-01

    Full Text Available Direct epitaxial integration of III-V materials on Si offers substantial manufacturing cost and scalability advantages over heterogeneous integration. The challenge is that epitaxial growth introduces high densities of crystalline defects that limit device performance and lifetime. Quantum dot lasers, amplifiers, modulators, and photodetectors epitaxially grown on Si are showing promise for achieving low-cost, scalable integration with silicon photonics. The unique electrical confinement properties of quantum dots provide reduced sensitivity to the crystalline defects that result from III-V/Si growth, while their unique gain dynamics show promise for improved performance and new functionalities relative to their quantum well counterparts in many devices. Clear advantages for using quantum dot active layers for lasers and amplifiers on and off Si have already been demonstrated, and results for quantum dot based photodetectors and modulators look promising. Laser performance on Si is improving rapidly with continuous-wave threshold currents below 1 mA, injection efficiencies of 87%, and output powers of 175 mW at 20 °C. 1500-h reliability tests at 35 °C showed an extrapolated mean-time-to-failure of more than ten million hours. This represents a significant stride toward efficient, scalable, and reliable III-V lasers on on-axis Si substrates for photonic integrate circuits that are fully compatible with complementary metal-oxide-semiconductor (CMOS foundries.

  11. Perspective: The future of quantum dot photonic integrated circuits

    Science.gov (United States)

    Norman, Justin C.; Jung, Daehwan; Wan, Yating; Bowers, John E.

    2018-03-01

    Direct epitaxial integration of III-V materials on Si offers substantial manufacturing cost and scalability advantages over heterogeneous integration. The challenge is that epitaxial growth introduces high densities of crystalline defects that limit device performance and lifetime. Quantum dot lasers, amplifiers, modulators, and photodetectors epitaxially grown on Si are showing promise for achieving low-cost, scalable integration with silicon photonics. The unique electrical confinement properties of quantum dots provide reduced sensitivity to the crystalline defects that result from III-V/Si growth, while their unique gain dynamics show promise for improved performance and new functionalities relative to their quantum well counterparts in many devices. Clear advantages for using quantum dot active layers for lasers and amplifiers on and off Si have already been demonstrated, and results for quantum dot based photodetectors and modulators look promising. Laser performance on Si is improving rapidly with continuous-wave threshold currents below 1 mA, injection efficiencies of 87%, and output powers of 175 mW at 20 °C. 1500-h reliability tests at 35 °C showed an extrapolated mean-time-to-failure of more than ten million hours. This represents a significant stride toward efficient, scalable, and reliable III-V lasers on on-axis Si substrates for photonic integrate circuits that are fully compatible with complementary metal-oxide-semiconductor (CMOS) foundries.

  12. Back End of Line Nanorelays for Ultra-low Power Monolithic Integrated NEMS-CMOS Circuits

    KAUST Repository

    Lechuga Aranda, Jesus Javier

    2016-05-01

    Since the introduction of Complementary-Metal-Oxide-Semiconductor (CMOS) technology, the chip industry has enjoyed many benefits of transistor feature size scaling, including higher speed and device density and improved energy efficiency. However, in the recent years, the IC designers have encountered a few roadblocks, namely reaching the physical limits of scaling and also increased device leakage which has resulted in a slow-down of supply voltage and power density scaling. Therefore, there has been an extensive hunt for alternative circuit architectures and switching devices that can alleviate or eliminate the current crisis in the semiconductor industry. The Nano-Electro-Mechanical (NEM) relay is a promising alternative switch that offers zero leakage and abrupt turn-on behaviour. Even though these devices are intrinsically slower than CMOS transistors, new circuit design techniques tailored for the electromechanical properties of such devices can be leveraged to design medium performance, ultra-low power integrated circuits. In this thesis, we deal with a new generation of such devices that is built in the back end of line (BEOL) CMOS process and is an ideal option for full integration with current CMOS transistor technology. Simulation and verification at the circuit and system level is a critical step in the design flow of microelectronic circuits, and this is especially important for new technologies that lack the standard design infrastructure and well-known verification platforms. Although most of the physical and electrical properties of NEM structures can be simulated using standard electronic automation software, there is no report of a reliable behavioural model for NEMS switches that enable large circuit simulations. In this work, we present an optimised model of a BEOL nano relay that encompasses all the electromechanical characteristics of the device and is robust and lightweight enough for VLSI applications that require simulation of thousands of

  13. Integrated Circuit Design in US High-Energy Physics

    Energy Technology Data Exchange (ETDEWEB)

    Geronimo, G. D. [Brookhaven National Lab. (BNL), Upton, NY (United States); Christian, D. [Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States); Bebek, C. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Garcia-Sciveres, M. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Lippe, H. V. D. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Haller, G. [SLAC National Accelerator Lab., Menlo Park, CA (United States); Grillo, AA [Univ. of California, Santa Cruz, CA (United States); Newcomer, M [Univ. of Pennsylvania, Philadelphia, PA (United States)

    2013-07-10

    This whitepaper summarizes the status, plans, and challenges in the area of integrated circuit design in the United States for future High Energy Physics (HEP) experiments. It has been submitted to CPAD (Coordinating Panel for Advanced Detectors) and the HEP Community Summer Study 2013(Snowmass on the Mississippi) held in Minnesota July 29 to August 6, 2013. A workshop titled: US Workshop on IC Design for High Energy Physics, HEPIC2013 was held May 30 to June 1, 2013 at Lawrence Berkeley National Laboratory (LBNL). A draft of the whitepaper was distributed to the attendees before the workshop, the content was discussed at the meeting, and this document is the resulting final product. The scope of the whitepaper includes the following topics: Needs for IC technologies to enable future experiments in the three HEP frontiers Energy, Cosmic and Intensity Frontiers; Challenges in the different technology and circuit design areas and the related R&D needs; Motivation for using different fabrication technologies; Outlook of future technologies including 2.5D and 3D; Survey of ICs used in current experiments and ICs targeted for approved or proposed experiments; IC design at US institutes and recommendations for collaboration in the future.

  14. A neural circuit architecture for angular integration in Drosophila.

    Science.gov (United States)

    Green, Jonathan; Adachi, Atsuko; Shah, Kunal K; Hirokawa, Jonathan D; Magani, Pablo S; Maimon, Gaby

    2017-06-01

    Many animals keep track of their angular heading over time while navigating through their environment. However, a neural-circuit architecture for computing heading has not been experimentally defined in any species. Here we describe a set of clockwise- and anticlockwise-shifting neurons in the Drosophila central complex whose wiring and physiology provide a means to rotate an angular heading estimate based on the fly's angular velocity. We show that each class of shifting neurons exists in two subtypes, with spatiotemporal activity profiles that suggest different roles for each subtype at the start and end of tethered-walking turns. Shifting neurons are required for the heading system to properly track the fly's heading in the dark, and stimulation of these neurons induces predictable shifts in the heading signal. The central features of this biological circuit are analogous to those of computational models proposed for head-direction cells in rodents and may shed light on how neural systems, in general, perform integration.

  15. A fully integral, differential, high-speed, low-power consumption CMOS recovery clock circuit

    Directory of Open Access Journals (Sweden)

    Daniel Pacheco Bautista

    2007-09-01

    Full Text Available The clock recovery circuit (CRC plays a fundamental role in electronic information recovery systems (hard disks, DVD and CD read/writeable units and baseband digital communication systems in recovering the clock signal contained in the received data. This signal is necessary for synchronising subsequent information processing. Nowadays, this task is difficult to achieve because of the data’s random nature and its high transfer rate. This paper presents the design of a high-performance integral CMOS technology clock recovery circuit (CRC wor-king at 1.2 Gbps and only consuming 17.4 mW using a 3.3V power supply. The circuit was fully differentially designed to obtain high performance. Circuit architecture was based on a conventional phase lock loop (PLL, current mode logic (MCML and a novel two stage ring-based voltage controlled oscillator (VCO. The design used 0.35 μm CMOS AMS process parameters. Hspice simulation results proved the circuit’s high performance, achieving tracking in less than 300 ns.

  16. Monolithically integrated AlN/GaN electronics for harsh environments, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Recently, resonant-tunneling-diode (RTD) based circuits employing monolithically-integrated RTD on high electron mobility (HEMT) structures have been developed in a...

  17. A computer system for the analysis of integrated circuit reliability

    Science.gov (United States)

    Mauri, P.

    1989-12-01

    The formulation of total reliability assessment of integrated circuits involves an increasing amount of knowledge and data and hence it requires increasing computerized assistance. To perform this an information system has been designed and implemented. Following engineering practice, the key features of the system are (1) the collection of different types of data, e.g. electrical parameter measurements and qualitative description of the mode and the mechanism of failure and (2) the implementation of procedures coming from methods often applied, e.g. statistical or new approaches, such as formalization of cause-effect chains as studied for artificial intelligence applications. The system architecture has been designed so as to allow direct user maintenance, and hence a quick updating of reliability knowledge and information. Furthermore, its modularity eases the implementation of new procedures. Computer support improves the quality of data analysis and allows for the application of new methods and models.

  18. Two multichannel integrated circuits for neural recording and signal processing.

    Science.gov (United States)

    Obeid, Iyad; Morizio, James C; Moxon, Karen A; Nicolelis, Miguel A L; Wolf, Patrick D

    2003-02-01

    We have developed, manufactured, and tested two analog CMOS integrated circuit "neurochips" for recording from arrays of densely packed neural electrodes. Device A is a 16-channel buffer consisting of parallel noninverting amplifiers with a gain of 2 V/V. Device B is a 16-channel two-stage analog signal processor with differential amplification and high-pass filtering. It features selectable gains of 250 and 500 V/V as well as reference channel selection. The resulting amplifiers on Device A had a mean gain of 1.99 V/V with an equivalent input noise of 10 microV(rms). Those on Device B had mean gains of 53.4 and 47.4 dB with a high-pass filter pole at 211 Hz and an equivalent input noise of 4.4 microV(rms). Both devices were tested in vivo with electrode arrays implanted in the somatosensory cortex.

  19. Custom Integrated Circuit Design for Portable Ultrasound Scanners

    DEFF Research Database (Denmark)

    Llimos Muntal, Pere

    plane and the signals received from each transmit burst area summed. Each receiving channel is required to individually amplify and delay its signal in order to correctly pre-beamform. The handheld probe delivers the data to a processing unit digitally, hence, analog to digital converters (ADCs...... of evaluating the feasibility of the transmitting and receiving circuitry of a handheld probe for portable ultrasound scanners, three integrated circuit prototypes have been fabricated. Measurements have been performed on all of them with satisfactory results. The first part of this project is focused......-sigma analog-to-digital converter (CTDS ADC) operating at a sampling frequency of 320 MHz, a SNR of 45 dB, occupying an area of 0.0175 mm2 and a power consumption of 0.594 mW. The CTDS ADC digitizes the signal before the pre-beamform summing is applied. The SNR of the ADC is directly linked to the picture...

  20. Piezoelectric accelerometers with integral electronics

    CERN Document Server

    Levinzon, Felix

    2014-01-01

    This book provides an invaluable reference to Piezoelectric Accelerometers with Integral Electronics (IEPE). It describes the design and performance parameters of IEPE accelerometers and their key elements, PE transducers and FET-input amplifiers. Coverage includes recently designed, low-noise and high temperature IEPE accelerometers. Readers will benefit from the detailed noise analysis of the IEPE accelerometer, which enables estimation of its noise floor and noise limits. Other topics useful for designers of low-noise, high temperature silicon-based electronics include noise analysis of FET

  1. Report on the Minisession ''New developments in Flash ADC integrated circuits''

    International Nuclear Information System (INIS)

    Dhawan, S.K.

    1984-01-01

    New developments are taking place in the Flash Analog to Digital Converter marketplace. The big news is the digitization of VIDEO. It is expected to be a very large market and the merchant semiconductor and consumer electronics companies will be competing in selling these devices. The companies expect the initial selling price to be in the range of $ 7 - $15 for quantities of 10,000 units or more. This session was organized to expose the community to the new developments in FADC integrated circuits and the needs of physics instrumentation

  2. Enabling the Internet of Things from integrated circuits to integrated systems

    CERN Document Server

    2017-01-01

    This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia. After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT: ultra-low power digital architectures and circuits low- and zero-leakage memories (including emerging technologies) circuits for hardwar...

  3. Paper-based silver-nanowire electronic circuits with outstanding electrical conductivity and extreme bending stability

    Science.gov (United States)

    Huang, Gui-Wen; Xiao, Hong-Mei; Fu, Shao-Yun

    2014-07-01

    Here a facile, green and efficient printing-filtration-press (PFP) technique is reported for room-temperature (RT) mass-production of low-cost, environmentally friendly, high performance paper-based electronic circuits. The as-prepared silver nanowires (Ag-NWs) are uniformly deposited at RT on a pre-printed paper substrate to form high quality circuits via vacuum filtration and pressing. The PFP circuit exhibits more excellent electrical property and bending stability compared with other flexible circuits made by existing techniques. Furthermore, practical applications of the PFP circuits are demonstrated.Here a facile, green and efficient printing-filtration-press (PFP) technique is reported for room-temperature (RT) mass-production of low-cost, environmentally friendly, high performance paper-based electronic circuits. The as-prepared silver nanowires (Ag-NWs) are uniformly deposited at RT on a pre-printed paper substrate to form high quality circuits via vacuum filtration and pressing. The PFP circuit exhibits more excellent electrical property and bending stability compared with other flexible circuits made by existing techniques. Furthermore, practical applications of the PFP circuits are demonstrated. Electronic supplementary information (ESI) available: Video of rolling tests; video of the PFP circuit used as flexible cable in a cell phone; video of the application of the circuit as a RFID tag; a detailed method for synthesizing silver nanowires; details of the PFP technique; folding tests for the circuits; air humidity test for the circuit. See DOI: 10.1039/c4nr00846d

  4. SDN architecture for optical packet and circuit integrated networks

    Science.gov (United States)

    Furukawa, Hideaki; Miyazawa, Takaya

    2016-02-01

    We have been developing an optical packet and circuit integrated (OPCI) network, which realizes dynamic optical path, high-density packet multiplexing, and flexible wavelength resource allocation. In the OPCI networks, a best-effort service and a QoS-guaranteed service are provided by employing optical packet switching (OPS) and optical circuit switching (OCS) respectively, and users can select these services. Different wavelength resources are assigned for OPS and OCS links, and the amount of their wavelength resources are dynamically changed in accordance with the service usage conditions. To apply OPCI networks into wide-area (core/metro) networks, we have developed an OPCI node with a distributed control mechanism. Moreover, our OPCI node works with a centralized control mechanism as well as a distributed one. It is therefore possible to realize SDN-based OPCI networks, where resource requests and a centralized configuration are carried out. In this paper, we show our SDN architecture for an OPS system that configures mapping tables between IP addresses and optical packet addresses and switching tables according to the requests from multiple users via a web interface. While OpenFlow-based centralized control protocol is coming into widespread use especially for single-administrative, small-area (LAN/data-center) networks. Here, we also show an interworking mechanism between OpenFlow-based networks (OFNs) and the OPCI network for constructing a wide-area network, and a control method of wavelength resource selection to automatically transfer diversified flows from OFNs to the OPCI network.

  5. Realization of Electronically Controllable Current-mode Square-rooting Circuit Based on MO-CFTA

    OpenAIRE

    P. Silapan; C. Chanapromma; T. Worachak

    2011-01-01

    This article proposes a current-mode square-rooting circuit using current follower transconductance amplifier (CTFA). The amplitude of the output current can be electronically controlled via input bias current with wide input dynamic range. The proposed circuit consists of only single CFTA. Without any matching conditions and external passive elements, the circuit is then appropriate for an IC architecture. The magnitude of the output signal is temperature-insensitive. Th...

  6. Emerging Carbon Nanotube Electronic Circuits, Modeling, and Performance

    OpenAIRE

    Xu, Yao; Srivastava, Ashok; Sharma, Ashwani K.

    2010-01-01

    Current transport and dynamic models of carbon nanotube field-effect transistors are presented. A model of single-walled carbon nanotube as interconnect is also presented and extended in modeling of single-walled carbon nanotube bundles. These models are applied in studying the performances of circuits such as the complementary carbon nanotube inverter pair and carbon nanotube as interconnect. Cadence/Spectre simulations show that carbon nanotube field-effect transistor circuits can operate a...

  7. 77 FR 66481 - Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions; Notice...

    Science.gov (United States)

    2012-11-05

    ... COMMISSION Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions; Notice..., and the sale within the United States after importation of certain integrated circuits, chipsets, and... the following as respondents: MediaTek Inc. of Hsinchu City, Taiwan; Zoran Corporation of Sunnyvale...

  8. 77 FR 57589 - Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions...

    Science.gov (United States)

    2012-09-18

    ... COMMISSION Certain Integrated Circuits, Chipsets, and Products Containing Same Including Televisions... Inc. of Hsinchu City, Taiwan (``MediaTek''); and Zoran Corporation of Sunnyvale, California (``Zoran... found that those Zoran products that were adjudicated in Integrated Circuits I are precluded under the...

  9. Virtual Instrument Systems in Reality (VISIR) for Remote Wiring and Measurement of Electronic Circuits on Breadboard

    Science.gov (United States)

    Tawfik, M.; Sancristobal, E.; Martin, S.; Gil, R.; Diaz, G.; Colmenar, A.; Peire, J.; Castro, M.; Nilsson, K.; Zackrisson, J.; Hakansson, L.; Gustavsson, I.

    2013-01-01

    This paper reports on a state-of-the-art remote laboratory project called Virtual Instrument Systems in Reality (VISIR). VISIR allows wiring and measuring of electronic circuits remotely on a virtual workbench that replicates physical circuit breadboards. The wiring mechanism is developed by means of a relay switching matrix connected to a PCI…

  10. Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

    Science.gov (United States)

    Alt, Shannon

    2016-01-01

    Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.

  11. A fast charge-integrating sample-and-hold circuit for fast decision-making with calorimeter arrays

    International Nuclear Information System (INIS)

    Schuler, G.

    1982-01-01

    This paper describes a fast charge-integrating sample-and-hold circuit, particularly suited to the fast trigger electronics used with large arrays of photomultipliers in total-energy measurements of high-energy particles interactions. During a gate logic pulse, the circuit charges a capacitor with the current fed into the signal input. The output voltage is equal to the voltage developed across the capacitor, which is held until a fast clear discharges the capacitor. The main characteristics of the fast-charge-integrating sample-and-hold circuit are: i) a conversion factor of 1 V/220 pC; ii) a droop rate of 4 mV/μs for a 50 Ω load; and iii) a 1 μs fast-clear time. (orig.)

  12. Integrated reconfigurable high-voltage transmitting circuit for CMUTs

    DEFF Research Database (Denmark)

    Llimos Muntal, Pere; Larsen, Dennis Øland; Jørgensen, Ivan Harald Holger

    2015-01-01

    In this paper a high-voltage transmitting circuit aimed for capacitive micromachined ultrasonic transducers (CMUTs) used in scanners for medical applications is designed and implemented in a 0.35 μm high-voltage CMOS process. The transmitting circuit is reconfigurable externally making it able...... to drive a wide variety of CMUTs. The transmitting circuit can generate several pulse shapes with voltages up to 100 V, maximum pulse range of 50 V, frequencies up to 5 MHz and different driving slew rates. Measurements are performed on the circuit in order to assess its functionality and power consumption...

  13. Design structure for in-system redundant array repair in integrated circuits

    Science.gov (United States)

    Bright, Arthur A.; Crumley, Paul G.; Dombrowa, Marc; Douskey, Steven M.; Haring, Rudolf A.; Oakland, Steven F.; Quellette, Michael R.; Strissel, Scott A.

    2008-11-25

    A design structure for repairing an integrated circuit during operation of the integrated circuit. The integrated circuit comprising of a multitude of memory arrays and a fuse box holding control data for controlling redundancy logic of the arrays. The design structure provides the integrated circuit with a control data selector for passing the control data from the fuse box to the memory arrays; providing a source of alternate control data, external of the integrated circuit; and connecting the source of alternate control data to the control data selector. The design structure further passes the alternate control data from the source thereof, through the control data selector and to the memory arrays to control the redundancy logic of the memory arrays.

  14. Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations.

    Science.gov (United States)

    Kim, Dae-Hyeong; Song, Jizhou; Choi, Won Mook; Kim, Hoon-Sik; Kim, Rak-Hwan; Liu, Zhuangjian; Huang, Yonggang Y; Hwang, Keh-Chih; Zhang, Yong-wei; Rogers, John A

    2008-12-02

    Electronic systems that offer elastic mechanical responses to high-strain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introduces materials and mechanical design strategies for classes of electronic circuits that offer extremely high stretchability, enabling them to accommodate even demanding configurations such as corkscrew twists with tight pitch (e.g., 90 degrees in approximately 1 cm) and linear stretching to "rubber-band" levels of strain (e.g., up to approximately 140%). The use of single crystalline silicon nanomaterials for the semiconductor provides performance in stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators, and differential amplifiers, suggest a valuable route to high-performance stretchable electronics.

  15. Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

    Science.gov (United States)

    Kim, Dae-Hyeong; Song, Jizhou; Choi, Won Mook; Kim, Hoon-Sik; Kim, Rak-Hwan; Liu, Zhuangjian; Huang, Yonggang Y.; Hwang, Keh-Chih; Zhang, Yong-wei; Rogers, John A.

    2008-01-01

    Electronic systems that offer elastic mechanical responses to high-strain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introduces materials and mechanical design strategies for classes of electronic circuits that offer extremely high stretchability, enabling them to accommodate even demanding configurations such as corkscrew twists with tight pitch (e.g., 90° in ≈1 cm) and linear stretching to “rubber-band” levels of strain (e.g., up to ≈140%). The use of single crystalline silicon nanomaterials for the semiconductor provides performance in stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators, and differential amplifiers, suggest a valuable route to high-performance stretchable electronics. PMID:19015528

  16. Graphene-on-silicon hybrid plasmonic-photonic integrated circuits

    Science.gov (United States)

    Xiao, Ting-Hui; Cheng, Zhenzhou; Goda, Keisuke

    2017-06-01

    Graphene surface plasmons (GSPs) have shown great potential in biochemical sensing, thermal imaging, and optoelectronics. To excite GSPs, several methods based on the near-field optical microscope and graphene nanostructures have been developed in the past few years. However, these methods suffer from their bulky setups and low GSP-excitation efficiency due to the short interaction length between free-space vertical excitation light and the atomic layer of graphene. Here we present a CMOS-compatible design of graphene-on-silicon hybrid plasmonic-photonic integrated circuits that achieve the in-plane excitation of GSP polaritons as well as localized surface plasmon (SP) resonance. By employing a suspended membrane slot waveguide, our design is able to excite GSP polaritons on a chip. Moreover, by utilizing a graphene nanoribbon array, we engineer the transmission spectrum of the waveguide by excitation of localized SP resonance. Our theoretical and computational study paves a new avenue to enable, modulate, and monitor GSPs on a chip, potentially applicable for the development of on-chip electro-optic devices.

  17. Integrated circuits and electrode interfaces for noninvasive physiological monitoring.

    Science.gov (United States)

    Ha, Sohmyung; Kim, Chul; Chi, Yu M; Akinin, Abraham; Maier, Christoph; Ueno, Akinori; Cauwenberghs, Gert

    2014-05-01

    This paper presents an overview of the fundamentals and state of the-art in noninvasive physiological monitoring instrumentation with a focus on electrode and optrode interfaces to the body, and micropower-integrated circuit design for unobtrusive wearable applications. Since the electrode/optrode-body interface is a performance limiting factor in noninvasive monitoring systems, practical interface configurations are offered for biopotential acquisition, electrode-tissue impedance measurement, and optical biosignal sensing. A systematic approach to instrumentation amplifier (IA) design using CMOS transistors operating in weak inversion is shown to offer high energy and noise efficiency. Practical methodologies to obviate 1/f noise, counteract electrode offset drift, improve common-mode rejection ratio, and obtain subhertz high-pass cutoff are illustrated with a survey of the state-of-the-art IAs. Furthermore, fundamental principles and state-of-the-art technologies for electrode-tissue impedance measurement, photoplethysmography, functional near-infrared spectroscopy, and signal coding and quantization are reviewed, with additional guidelines for overall power management including wireless transmission. Examples are presented of practical dry-contact and noncontact cardiac, respiratory, muscle and brain monitoring systems, and their clinical applications.

  18. Emerging materials and devices in spintronic integrated circuits for energy-smart mobile computing and connectivity

    International Nuclear Information System (INIS)

    Kang, S.H.; Lee, K.

    2013-01-01

    A spintronic integrated circuit (IC) is made of a combination of a semiconductor IC and a dense array of nanometer-scale magnetic tunnel junctions. This emerging field is of growing scientific and engineering interest, owing to its potential to bring disruptive device innovation to the world of electronics. This technology is currently being pursued not only for scalable non-volatile spin-transfer-torque magnetoresistive random access memory, but also for various forms of non-volatile logic (Spin-Logic). This paper reviews recent advances in spintronic IC. Key discoveries and breakthroughs in materials and devices are highlighted in light of the broader perspective of their application in low-energy mobile computing and connectivity systems, which have emerged as leading drivers for the prevailing electronics ecosystem

  19. Circuits and electronics hands-on learning with analog discovery

    CERN Document Server

    Okyere Attia, John

    2018-01-01

    The book provides instructions on building circuits on breadboards, connecting the Analog Discovery wires to the circuit under test, and making electrical measurements. Various measurement techniques are described and used in this book, including: impedance measurements, complex power measurements, frequency response measurements, power spectrum measurements, current versus voltage characteristic measurements of diodes, bipolar junction transistors, and Mosfets. The book includes end-of-chapter problems for additional exercises geared towards hands-on learning, experimentation, comparisons between measured results and those obtained from theoretical calculations.

  20. Thermoreflectance temperature imaging of integrated circuits: calibration technique and quantitative comparison with integrated sensors and simulations

    International Nuclear Information System (INIS)

    Tessier, G; Polignano, M-L; Pavageau, S; Filloy, C; Fournier, D; Cerutti, F; Mica, I

    2006-01-01

    Camera-based thermoreflectance microscopy is a unique tool for high spatial resolution thermal imaging of working integrated circuits. However, a calibration is necessary to obtain quantitative temperatures on the complex surface of integrated circuits. The spatial and temperature resolutions reached by thermoreflectance are excellent (360 nm and 2.5 x 10 -2 K in 1 min here), but the precision is more difficult to assess, notably due to the lack of comparable thermal techniques at submicron scales. We propose here a Peltier element control of the whole package temperature in order to obtain calibration coefficients simultaneously on several materials visible on the surface of the circuit. Under high magnifications, movements associated with thermal expansion are corrected using a piezo electric displacement and a software image shift. This calibration method has been validated by comparison with temperatures measured using integrated thermistors and diodes and by a finite volume simulation. We show that thermoreflectance measurements agree within a precision of ±2.3% with the on-chip sensors measurements. The diode temperature is found to underestimate the actual temperature of the active area by almost 70% due to the thermal contact of the diode with the substrate, acting as a heat sink

  1. A Fast Classification Method of Faults in Power Electronic Circuits Based on Support Vector Machines

    OpenAIRE

    Cui Jiang; Shi Ge; Gong Chunying

    2017-01-01

    Fault detection and location are important and front-end tasks in assuring the reliability of power electronic circuits. In essence, both tasks can be considered as the classification problem. This paper presents a fast fault classification method for power electronic circuits by using the support vector machine (SVM) as a classifier and the wavelet transform as a feature extraction technique. Using one-against-rest SVM and one-against-one SVM are two general approaches to fault classificatio...

  2. A Parallel Genetic Algorithm for Automated Electronic Circuit Design

    Science.gov (United States)

    Long, Jason D.; Colombano, Silvano P.; Haith, Gary L.; Stassinopoulos, Dimitris

    2000-01-01

    Parallelized versions of genetic algorithms (GAs) are popular primarily for three reasons: the GA is an inherently parallel algorithm, typical GA applications are very compute intensive, and powerful computing platforms, especially Beowulf-style computing clusters, are becoming more affordable and easier to implement. In addition, the low communication bandwidth required allows the use of inexpensive networking hardware such as standard office ethernet. In this paper we describe a parallel GA and its use in automated high-level circuit design. Genetic algorithms are a type of trial-and-error search technique that are guided by principles of Darwinian evolution. Just as the genetic material of two living organisms can intermix to produce offspring that are better adapted to their environment, GAs expose genetic material, frequently strings of 1s and Os, to the forces of artificial evolution: selection, mutation, recombination, etc. GAs start with a pool of randomly-generated candidate solutions which are then tested and scored with respect to their utility. Solutions are then bred by probabilistically selecting high quality parents and recombining their genetic representations to produce offspring solutions. Offspring are typically subjected to a small amount of random mutation. After a pool of offspring is produced, this process iterates until a satisfactory solution is found or an iteration limit is reached. Genetic algorithms have been applied to a wide variety of problems in many fields, including chemistry, biology, and many engineering disciplines. There are many styles of parallelism used in implementing parallel GAs. One such method is called the master-slave or processor farm approach. In this technique, slave nodes are used solely to compute fitness evaluations (the most time consuming part). The master processor collects fitness scores from the nodes and performs the genetic operators (selection, reproduction, variation, etc.). Because of dependency

  3. Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays.

    Science.gov (United States)

    Ciçek, Ihsan; Bozkurt, Ayhan; Karaman, Mustafa

    2005-12-01

    Integration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 X 4 array of the designed circuit cells, each cell occupying a 200 X 200 microm2 area, was formed for the initial test studies and scheduled for fabrication in 0.8 microm, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.

  4. High-speed Integrated Circuits for electrical/Optical Interfaces

    DEFF Research Database (Denmark)

    Jespersen, Christoffer Felix

    2008-01-01

    circuits at the receiver interface, though VCOs are also found in the transmitter where a multitude of independent sources have to be mutually synchronized before multiplexing. The circuits are based on an InP DHBT process (VIP-2) supplied by Vitesse and made publicly available as MPW. The VIP-2 process...

  5. Integrated power electronic converters and digital control

    CERN Document Server

    Emadi, Ali; Nie, Zhong

    2009-01-01

    Non-isolated DC-DC ConvertersBuck ConverterBoost ConverterBuck-Boost ConverterIsolated DC-DC ConvertersFlyback ConverterForward ConverterPush-Pull ConverterFull-Bridge ConverterHalf-Bridge ConverterPower Factor CorrectionConcept of PFCGeneral Classification of PFC CircuitsHigh Switching Frequency Topologies for PFCApplication of PFC in Advanced Motor DrivesIntegrated Switched-Mode Power ConvertersSwitched-Mode Power SuppliesThe Concept of Integrated ConverterDefinition of Integrated Switched-Mode Power Supplies (ISMPS)Boost-Type Integrated TopologiesGeneral Structure of Boost-Type Integrated T

  6. Laser Direct Writing and Selective Metallization of Metallic Circuits for Integrated Wireless Devices.

    Science.gov (United States)

    Cai, Jinguang; Lv, Chao; Watanabe, Akira

    2018-01-10

    Portable and wearable devices have attracted wide research attention due to their intimate relations with human daily life. As basic structures in the devices, the preparation of high-conductive metallic circuits or micro-circuits on flexible substrates should be facile, cost-effective, and easily integrated with other electronic units. In this work, high-conductive carbon/Ni composite structures were prepared by using a facile laser direct writing method, followed by an electroless Ni plating process, which exhibit a 3-order lower sheet resistance of less than 0.1 ohm/sq compared to original structures before plating, showing the potential for practical use. The carbon/Ni composite structures exhibited a certain flexibility and excellent anti-scratch property due to the tight deposition of Ni layers on carbon surfaces. On the basis of this approach, a wireless charging and storage device on a polyimide film was demonstrated by integrating an outer rectangle carbon/Ni composite coil for harvesting electromagnetic waves and an inner carbon micro-supercapacitor for energy storage, which can be fast charged wirelessly by a commercial wireless charger. Furthermore, a near-field communication (NFC) tag was prepared by combining a carbon/Ni composite coil for harvesting signals and a commercial IC chip for data storage, which can be used as an NFC tag for practical application.

  7. Analysis of electronic circuits using digital computers; L'analyse des circuits electroniques par les calculateurs numeriques

    Energy Technology Data Exchange (ETDEWEB)

    Tapu, C. [Commissariat a l' Energie Atomique, Saclay (France). Centre d' Etudes Nucleaires

    1968-07-01

    Various programmes have been proposed for studying electronic circuits with the help of computers. It is shown here how it possible to use the programme ECAP, developed by I.B.M., for studying the behaviour of an operational amplifier from different point of view: direct current, alternating current and transient state analysis, optimisation of the gain in open loop, study of the reliability. (author) [French] Differents programmes ont ete proposes pour l'etude des circuits electroniques a l'aide des calculateurs. On montre comment on peut utiliser le programme ECAP, mis au point par I. B. M., pour etudier le comportement d'un amplificateur operationnel, a differents points de vue: analyse en courant continu, courant alternatif et regime transitoire, optimalisation du gain en boucle ouverte, etude de la fiabilite. (auteur)

  8. Integrated control system for electron beam processes

    Science.gov (United States)

    Koleva, L.; Koleva, E.; Batchkova, I.; Mladenov, G.

    2018-03-01

    The ISO/IEC 62264 standard is widely used for integration of the business systems of a manufacturer with the corresponding manufacturing control systems based on hierarchical equipment models, functional data and manufacturing operations activity models. In order to achieve the integration of control systems, formal object communication models must be developed, together with manufacturing operations activity models, which coordinate the integration between different levels of control. In this article, the development of integrated control system for electron beam welding process is presented as part of a fully integrated control system of an electron beam plant, including also other additional processes: surface modification, electron beam evaporation, selective melting and electron beam diagnostics.

  9. Integration issues of a photonic layer on top of a CMOS circuit

    Science.gov (United States)

    Fedeli, J. M.; Orobtchouk, R.; Seassal, C.; Vivien, L.

    2006-02-01

    Photonics on CMOS is the integration of CMOS technology and optics components to enable either improved functionality of the electronic circuit (e.g. optical clock distribution) or as a means to miniaturize optical functions (e.g. miniaturised transceiver). The Near Infra Red (NIR) wavelength range (1.3 or 1.55μm) was chosen for this to minimise the impact the light on the behaviour of the microelectronic components. The integration of a photonic layer on a CMOS circuit can be seen in different ways: A combined fabrication at the front end level, the wafer bonding of an SOI photonic circuit at the back-end level, or the insertion of an embedded photonic layer between metallization schemes. For combined fabrication, a silicon on insulator rib technology has been developed with low (0.4dB/cm) propagation loss, ultra-high speed Ge-on-Si photodetector and SiGe/Si modulators.. In the metal-semiconductor-metal (MSM) configuration, bandwith of 35 GHz at 1.3 μm and 1.55μm has been measured. In the second approach, a wafer bonding of silicon rib and stripe technologies was achieved above the metallization layers of a CMOS wafer. For the third method, direct fabrication of a photonic layer at the back-end level was achieved using low temperature processes. Waveguide technologies such as SiNx (loss 2dB/cm) or amorphous silicon (loss 5dB/cm) were developed and were followed by the molecular bonding of InP die, these were needed to create the optoelectronic components (sources and detectors). Using an InP microdisk, 50% coupling was achieved to a stripe silicon waveguide.

  10. Design and performance of a multi-channel, multi-sampling, PSD-enabling integrated circuit

    International Nuclear Information System (INIS)

    Engel, G.L.; Hall, M.J.; Proctor, J.M.; Elson, J.M.; Sobotka, L.G.; Shane, R.; Charity, R.J.

    2009-01-01

    This paper presents the design and test results of an eight-channel prototype integrated circuit chip intended to greatly simplify the pulse-processing electronics needed for large arrays of scintillation detectors. Because the chip design employs (user-controlled) multi-region charge integration, particle identification is incorporated into the basic design. Each channel on the chip also contains a time-to-voltage converter which provides relative time information. The pulse-height integrals and the relative time are all stored on capacitors and are either reset, after a user controlled time, or sequentially read out if acquisition of the event is desired. Each of the three pulse-height sub-channels consists of a gated integrator with eight programmable charging rates and an externally programmable gate generator that defines the start (with four time ranges) and width (with four time ranges) of the gate relative to an external discriminator signal. The chip supports three triggering modes, two time ranges, two power modes, and produces four sparsified analog pulse trains (three for the integrators and another for the time) with synchronized addresses for off-chip digitization with a pipelined ADC. The eight-channel prototype chip occupies an area of 2.8 mmx5.7 mm, dissipates 60 mW (low-power mode), and was fabricated in the AMI 0.5-μm process (C5N).

  11. Ultra low-power integrated circuit design for wireless neural interfaces

    CERN Document Server

    Holleman, Jeremy; Otis, Brian

    2014-01-01

    Presenting results from real prototype systems, this volume provides an overview of ultra low-power integrated circuits and systems for neural signal processing and wireless communication. Topics include analog, radio, and signal processing theory and design for ultra low-power circuits.

  12. Prediction of ionizing radiation effects in integrated circuits using black-box models

    International Nuclear Information System (INIS)

    Williamson, P.W.

    1976-10-01

    A method is described which allows general black-box modelling of integrated circuits as distinct from the existing method of deriving the radiation induced response of the model from actual terminal measurements on the device during irradiation. Both digital and linear circuits are discussed. (author)

  13. Pspice and Matlab for electronics an integrated approach

    CERN Document Server

    Attia, John Okyere

    2010-01-01

    Used collectively, PSPICE and MATLAB[registered] are unsurpassed for circuit modeling and data analysis. This title illustrates how to use the strong features of PSpice and the powerful functions of MATLAB for electronic circuit analysis.

  14. Analysis and application of analog electronic circuits to biomedical instrumentation

    CERN Document Server

    Northrop, Robert B

    2003-01-01

    This book introduces the basic mathematical tools used to describe noise and its propagation through linear systems and provides a basic description of the improvement of signal-to-noise ratio by signal averaging and linear filtering. The text also demonstrates how op amps are the keystone of modern analog signal conditioning systems design, and illustrates their use in isolation and instrumentation amplifiers, active filters, and numerous biomedical instrumentation systems and subsystems. It examines the properties of the ideal op amp and applies this model to the analysis of various circuits

  15. Radiation effects for high-energy protons and X-ray in integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Silveira, M.A.G.; Santos, R.B.B. [Centro Universitario da FEI, Sao Bernardo do Campo, SP (Brazil); Medina, N.H.; Added, N.; Tabacniks, M.H. [Universidade de Sao Paulo (IF/USP), SP (Brazil). Inst. de Fisica; Lima, J.A. de [Universidade Federal de Santa Catarina (UFSC), Florianopolis, SC (Brazil); Cirne, K.H. [Empresa Brasileira de Aeronautica S.A. (EMBRAER), Sao Jose dos Campos, SP (Brazil)

    2012-07-01

    Full text: Electronic circuits are strongly influenced by ionizing radiation. The necessity to develop integrated circuits (IC's) featuring radiation hardness is largely growing to meet the stringent environment in space electronics [1]. This work aims to development a test platform to qualify electronic devices under the influence of high radiation dose, for aerospace applications. To understand the physical phenomena responsible for changes in devices exposed to ionizing radiation several kinds of radiation should then be considered, among them heavy ions, alpha particles, protons, gamma and X-rays. Radiation effects on the ICs are usually divided into three categories: Total Ionizing Dose (TID), a cumulative dose that shifts the threshold voltage and increases transistor's off-state current; Single Events Effects (SEE), a transient effect which can deposit charge directly into the device and disturb the properties of electronic circuits and Displacement Damage (DD) which can change the arrangement of the atoms in the lattice [2]. In this study we are investigating the radiation effects in rectangular-gate and circular-gate MOSFETs, manufactured with standard CMOS fabrication process, using particle beams produced in electrostatic tandem accelerators and X-rays. Initial tests for TID effects were performed using the 1.7 MV 5SDH tandem Pelletron accelerator of the Instituto de Fisica da USP with a proton beam of 2.6 MeV. The devices were exposed to different doses, varying the beam current, and irradiation time with the accumulated dose reaching up to Grad. To study the effect of X-rays on the electronic devices, an XRD-7000 (Shimadzu) X-ray setup was used as a primary X-ray source. The devices were irradiated with a total dose from krad to Grad using different dose rates. The results indicate that changes of the I-V characteristic curve are strongly dependents on the geometry of the devices. [1] Duzellier, S., Aerospace Science and Technology 9, p. 93

  16. Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

    International Nuclear Information System (INIS)

    LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

    1999-01-01

    We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

  17. Leaky Integrate-and-Fire Neuron Circuit Based on Floating-Gate Integrator.

    Science.gov (United States)

    Kornijcuk, Vladimir; Lim, Hyungkwang; Seok, Jun Yeong; Kim, Guhyun; Kim, Seong Keun; Kim, Inho; Choi, Byung Joon; Jeong, Doo Seok

    2016-01-01

    The artificial spiking neural network (SNN) is promising and has been brought to the notice of the theoretical neuroscience and neuromorphic engineering research communities. In this light, we propose a new type of artificial spiking neuron based on leaky integrate-and-fire (LIF) behavior. A distinctive feature of the proposed FG-LIF neuron is the use of a floating-gate (FG) integrator rather than a capacitor-based one. The relaxation time of the charge on the FG relies mainly on the tunnel barrier profile, e.g., barrier height and thickness (rather than the area). This opens up the possibility of large-scale integration of neurons. The circuit simulation results offered biologically plausible spiking activity (field-effect transistor. The FG-LIF neuron also has the advantage of low operation power (<30 pW/spike). Finally, the proposed circuit was subject to possible types of noise, e.g., thermal noise and burst noise. The simulation results indicated remarkable distributional features of interspike intervals that are fitted to Gamma distribution functions, similar to biological neurons in the neocortex.

  18. Optimal testing input sets for reduced diagnosis time of nuclear power plant digital electronic circuits

    International Nuclear Information System (INIS)

    Kim, D.S.; Seong, P.H.

    1994-01-01

    This paper describes the optimal testing input sets required for the fault diagnosis of the nuclear power plant digital electronic circuits. With the complicated systems such as very large scale integration (VLSI), nuclear power plant (NPP), and aircraft, testing is the major factor of the maintenance of the system. Particularly, diagnosis time grows quickly with the complexity of the component. In this research, for reduce diagnosis time the authors derived the optimal testing sets that are the minimal testing sets required for detecting the failure and for locating of the failed component. For reduced diagnosis time, the technique presented by Hayes fits best for the approach to testing sets generation among many conventional methods. However, this method has the following disadvantages: (a) it considers only the simple network (b) it concerns only whether the system is in failed state or not and does not provide the way to locate the failed component. Therefore the authors have derived the optimal testing input sets that resolve these problems by Hayes while preserving its advantages. When they applied the optimal testing sets to the automatic fault diagnosis system (AFDS) which incorporates the advanced fault diagnosis method of artificial intelligence technique, they found that the fault diagnosis using the optimal testing sets makes testing the digital electronic circuits much faster than that using exhaustive testing input sets; when they applied them to test the Universal (UV) Card which is a nuclear power plant digital input/output solid state protection system card, they reduced the testing time up to about 100 times

  19. Conductance and activation energy for electron transport in series and parallel intramolecular circuits.

    Science.gov (United States)

    Hsu, Liang-Yan; Wu, Ning; Rabitz, Herschel

    2016-11-30

    We investigate electron transport through series and parallel intramolecular circuits in the framework of the multi-level Redfield theory. Based on the assumption of weak monomer-bath couplings, the simulations depict the length and temperature dependence in six types of intramolecular circuits. In the tunneling regime, we find that the intramolecular circuit rule is only valid in the weak monomer coupling limit. In the thermally activated hopping regime, for circuits based on two different molecular units M a and M b with distinct activation energies E act,a > E act,b , the activation energies of M a and M b in series are nearly the same as E act,a while those in parallel are nearly the same as E act,b . This study gives a comprehensive description of electron transport through intramolecular circuits from tunneling to thermally activated hopping. We hope that this work can motivate additional studies to design intramolecular circuits based on different types of building blocks, and to explore the corresponding circuit laws and the length and temperature dependence of conductance.

  20. Waveguide Phase Modulator for Integrated Planar Lightwave Circuits in KTP Project

    Data.gov (United States)

    National Aeronautics and Space Administration — This SBIR Phase II effort proposes the development and integration of a Planar Lightwave Circuit (PLC) into an all fiber-based seed laser system used in high...

  1. A review of the technology and process on integrated circuits failure analysis applied in communications products

    Science.gov (United States)

    Ming, Zhimao; Ling, Xiaodong; Bai, Xiaoshu; Zong, Bo

    2016-02-01

    The failure analysis of integrated circuits plays a very important role in the improvement of the reliability in communications products. This paper intends to mainly introduce the failure analysis technology and process of integrated circuits applied in the communication products. There are many technologies for failure analysis, include optical microscopic analysis, infrared microscopic analysis, acoustic microscopy analysis, liquid crystal hot spot detection technology, optical microscopic analysis technology, micro analysis technology, electrical measurement, microprobe technology, chemical etching technology and ion etching technology. The integrated circuit failure analysis depends on the accurate confirmation and analysis of chip failure mode, the search of the root failure cause, the summary of failure mechanism and the implement of the improvement measures. Through the failure analysis, the reliability of integrated circuit and rate of good products can improve.

  2. Development of pixel readout integrated circuits for extreme rate and radiation

    CERN Document Server

    Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC

    2013-01-01

    Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.

  3. Integrated circuits from mobile phones as possible emergency OSL/TL dosimeters

    International Nuclear Information System (INIS)

    Sholom, S.; McKeever, S.W.S.

    2016-01-01

    In this article, optically stimulated luminescence (OSL) data are presented from integrated circuits (ICs) extracted from mobile phones. The purpose is to evaluate the potential of using OSL from components in personal electronic devices such as smart phones as a means of emergency dosimetry in the event of a large-scale radiological incident. ICs were extracted from five different makes and models of mobile phone. Sample preparation procedures are described, and OSL from the IC samples following irradiation using a 90 Sr/ 90 Y source is presented. Repeatability, sensitivity, dose responses, minimum measurable doses, stability and fading data were examined and are described. A protocol for measuring absorbed dose is presented, and it was concluded that OSL from these components is a viable method for assessing dose in the days following a radiological incident. (authors)

  4. Laser-induced extreme UV radiation sources for manufacturing next-generation integrated circuits

    International Nuclear Information System (INIS)

    Borisov, V M; Vinokhodov, A Yu; Ivanov, A S; Kiryukhin, Yu B; Mishchenko, V A; Prokof'ev, A V; Khristoforov, O B

    2009-01-01

    The development of high-power discharge sources emitting in the 13.5±0.135-nm spectral band is of current interest because they are promising for applications in industrial EUV (extreme ultraviolet) lithography for manufacturing integrated circuits according to technological precision standards of 22 nm and smaller. The parameters of EUV sources based on a laser-induced discharge in tin vapours between rotating disc electrodes are investigated. The properties of the discharge initiation by laser radiation at different wavelengths are established and the laser pulse parameters providing the maximum energy characteristics of the EUV source are determined. The EUV source developed in the study emits an average power of 276 W in the 13.5±0.135-nm spectral band on conversion to the solid angle 2π sr in the stationary regime at a pulse repetition rate of 3000 Hz. (laser applications and other topics in quantum electronics)

  5. Sensors, Circuits, and Satellites - NGSS at it's best: the integration of three dimensions with NASA science

    Science.gov (United States)

    Butcher, G. J.; Roberts-Harris, D.

    2013-12-01

    A set of innovative classroom lessons were developed based on informal learning activities in the 'Sensors, Circuits, and Satellites' kit manufactured by littleBits™ Electronics that are designed to lead students through a logical science content storyline about energy using sound and light and fully implements an integrated approach to the three dimensions of the Next Generation of Science Standards (NGSS). This session will illustrate the integration of NGSS into curriculum by deconstructing lesson design to parse out the unique elements of the 3 dimensions of NGSS. We will demonstrate ways in which we have incorporated the NGSS as we believe they were intended. According to the NGSS, 'The real innovation in the NGSS is the requirement that students are required to operate at the intersection of practice, content, and connection. Performance expectations are the right way to integrate the three dimensions. It provides specificity for educators, but it also sets the tone for how science instruction should look in classrooms. (p. 3). The 'Sensors, Circuits, and Satellites' series of lessons accomplishes this by going beyond just focusing on the conceptual knowledge (the disciplinary core ideas) - traditionally approached by mapping lessons to standards. These lessons incorporate the other 2 dimensions -cross-cutting concepts and the 8-practices of Sciences and Engineering-via an authentic and exciting connection to NASA science, thus implementing the NGSS in the way they were designed to be used: practices and content with the crosscutting concepts. When the NGSS are properly integrated, students are engaged in science and engineering content through the coupling of practice, content and connection. In the past, these two dimensions have been separated as distinct entities. We know now that coupling content and practices better demonstrates what goes on in real world science and engineering. We set out to accomplish what is called for in NGSS by integrating these

  6. Experimental Demonstration of 7 Tb/s Switching Using Novel Silicon Photonic Integrated Circuit

    DEFF Research Database (Denmark)

    Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld

    2016-01-01

    We demonstrate BER performance <10^-9 for a 1 Tb/s/core transmission over 7-core fiber and SDM switching using a novel silicon photonic integrated circuit composed of a 7x7 fiber switch and low loss SDM couplers.......We demonstrate BER performance Tb/s/core transmission over 7-core fiber and SDM switching using a novel silicon photonic integrated circuit composed of a 7x7 fiber switch and low loss SDM couplers....

  7. On-Board Memory Extension on Reconfigurable Integrated Circuits using External DDR3 Memory

    OpenAIRE

    Lodaya, Bhaveen

    2018-01-01

    User-programmable, integrated circuits (ICs) e.g. Field Programmable Gate Arrays (FPGAs) are increasingly popular for embedded, high-performance data exploitation. They combine the parallelization capability and processing power of application specific integrated circuits (ASICs) with the exibility, scalability and adaptability of software-based processing solutions. FPGAs provide powerful processing resources due to an optimal adaptation to the target application and a well-balanced ratio o...

  8. Design of a semi-custom integrated circuit for the SLAC SLC timing control system

    International Nuclear Information System (INIS)

    Linstadt, E.

    1984-10-01

    A semi-custom (gate array) integrated circuit has been designed for use in the SLAC Linear Collider timing and control system. The design process and SLAC's experiences during the phases of the design cycle are described. Issues concerning the partitioning of the design into semi-custom and standard components are discussed. Functional descriptions of the semi-custom integrated circuit and the timing module in which it is used are given

  9. Integrated-Circuit Controller For Brushless dc Motor

    Science.gov (United States)

    Le, Dong Tuan

    1994-01-01

    Generic circuit performs commutation-logic and power-switching functions for control of brushless dc motor. Controller includes commutation-logic and associated control circuitry, power supply, and inverters containing power transistors. Major advantages of controller are size, weight, and power consumption can be made less than other brushless-dc-motor controllers.

  10. Principal working group 3 on primary circuit integrity

    International Nuclear Information System (INIS)

    1992-01-01

    The main themes of this conference (13 papers) are: operating experience on leakages and failures in nuclear power plant piping, coolant circuits and steam generator tubes, probabilistic estimation and risk assessment, system failure analysis, leakage events and frequency, leak rate models and crack propagation mechanics, damage mechanisms and rupture probability

  11. CMOS analog integrated circuits high-speed and power-efficient design

    CERN Document Server

    Ndjountche, Tertulien

    2011-01-01

    High-speed, power-efficient analog integrated circuits can be used as standalone devices or to interface modern digital signal processors and micro-controllers in various applications, including multimedia, communication, instrumentation, and control systems. New architectures and low device geometry of complementary metaloxidesemiconductor (CMOS) technologies have accelerated the movement toward system on a chip design, which merges analog circuits with digital, and radio-frequency components. CMOS: Analog Integrated Circuits: High-Speed and Power-Efficient Design describes the important tren

  12. Impedance Matching Antenna-Integrated High-Efficiency Energy Harvesting Circuit

    Directory of Open Access Journals (Sweden)

    Yuharu Shinki

    2017-08-01

    Full Text Available This paper describes the design of a high-efficiency energy harvesting circuit with an integrated antenna. The circuit is composed of series resonance and boost rectifier circuits for converting radio frequency power into boosted direct current (DC voltage. The measured output DC voltage is 5.67 V for an input of 100 mV at 900 MHz. Antenna input impedance matching is optimized for greater efficiency and miniaturization. The measured efficiency of this antenna-integrated energy harvester is 60% for −4.85 dBm input power and a load resistance equal to 20 kΩ at 905 MHz.

  13. V-band low-noise integrated circuit receiver. [for space communication systems

    Science.gov (United States)

    Chang, K.; Louie, K.; Grote, A. J.; Tahim, R. S.; Mlinar, M. J.; Hayashibara, G. M.; Sun, C.

    1983-01-01

    A compact low-noise V-band integrated circuit receiver has been developed for space communication systems. The receiver accepts an RF input of 60-63 GHz and generates an IF output of 3-6 GHz. A Gunn oscillator at 57 GHz is phaselocked to a low-frequency reference source to achieve high stability and low FM noise. The receiver has an overall single sideband noise figure of less than 10.5 dB and an RF to IF gain of 40 dB over a 3-GHz RF bandwidth. All RF circuits are fabricated in integrated circuits on a Duroid substrate.

  14. Ultrafast electron transport across nano gaps in nanowire circuits

    Energy Technology Data Exchange (ETDEWEB)

    Potma, Eric O. [Univ. of California, Irvine, CA (United States)

    2015-07-31

    In this Program we aim for a closer look at electron transfer through single molecules. To achieve this, we use ultrafast laser pulses to time stamp an electron tunneling event in a molecule that is connected between two metallic electrodes, while reading out the electron current. A key aspect of this project is the use of metallic substrates with plasmonic activity to efficiently manipulate the tunneling probability. The first Phase of this program is concerned with developing highly sensitive tools for the ultrafast optical manipulation of tethered molecules through the evanescent surface field of plasmonic substrates. The second Phase of the program aims to use these tools for exercising control over the electron tunneling probability.

  15. Knowledge-Based Functional-Symbol Understanding In Electronic Circuit Diagram Interpretation

    Science.gov (United States)

    Huang, C. L.; Tou, J. T.

    1986-03-01

    The AUTORED system is a computer-based system for automatic reading of electronic circuit diagrams, which was developed several years ago. This paper presents some of our new results in AUTORED research. The design of AUTORED consists of two major components: automatic interpretation of electronic diagrams, and organization of interpretation results into a knowledge base for CAD applications. An electronic circuit diagram may be segmented into three parts which are the graphical functional symbols, the connection line segments, and the denotations. New techniques for extracting symbols and denotations from the circuit diagram are presented in this paper. These techniques are designed for junction and corner extraction, line segment tracing and linking, line segment classification, connection-line segment removal and blocking, symbol locating and denotation character grouping. A knowledge base is developed to facilitate the tracing, template-matching, and categorization processes.

  16. Integrated Design Validation: Combining Simulation and Formal Verification for Digital Integrated Circuits

    Directory of Open Access Journals (Sweden)

    Lun Li

    2006-04-01

    Full Text Available The correct design of complex hardware continues to challenge engineers. Bugs in a design that are not uncovered in early design stages can be extremely expensive. Simulation is a predominantly used tool to validate a design in industry. Formal verification overcomes the weakness of exhaustive simulation by applying mathematical methodologies to validate a design. The work described here focuses upon a technique that integrates the best characteristics of both simulation and formal verification methods to provide an effective design validation tool, referred as Integrated Design Validation (IDV. The novelty in this approach consists of three components, circuit complexity analysis, partitioning based on design hierarchy, and coverage analysis. The circuit complexity analyzer and partitioning decompose a large design into sub-components and feed sub-components to different verification and/or simulation tools based upon known existing strengths of modern verification and simulation tools. The coverage analysis unit computes the coverage of design validation and improves the coverage by further partitioning. Various simulation and verification tools comprising IDV are evaluated and an example is used to illustrate the overall validation process. The overall process successfully validates the example to a high coverage rate within a short time. The experimental result shows that our approach is a very promising design validation method.

  17. Contribution to the resolution of algebraic differential equations. Application to electronic circuits and nuclear reactors

    International Nuclear Information System (INIS)

    Monsef, Youssef.

    1977-05-01

    This note deals with the resolution of large algebraic differential systems involved in the physical sciences, with special reference to electronics and nuclear physics. The theoretical aspect of the algorithms established and developed for this purpose is discussed in detail. A decomposition algorithm based on the graph theory is developed in detail and the regressive analysis of the error involved in the decomposition is carried out. The specific application of these algorithms on the analyses of non-linear electronic circuits and to the integration of algebraic differential equations simulating the general operation of nuclear reactors coupled to heat exchangers is discussed in detail. To conclude, it is shown that the development of efficient digital resolution techniques dealing with the elements in order is sub-optimal for large systems and calls for the revision of conventional formulation methods. Thus for a high-order physical system, the larger, the number of auxiliary unknowns introduced, the easier the formulation and resolution, owing to the elimination of any form of complex matricial calculation such as those given by the state variables method [fr

  18. Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node

    Energy Technology Data Exchange (ETDEWEB)

    Yin, Lan; Harburg, Daniel V.; Rogers, John A., E-mail: jrogers@illinois.edu [Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 104 S Goodwin Ave., Urbana, Illinois 61801 (United States); Bozler, Carl [Lincoln Laboratory, Massachusetts Institute of Technology, 244 Wood Street, Lexington, Massachusetts 02420 (United States); Omenetto, Fiorenzo [Department of Biomedical Engineering, Department of Physics, Tufts University, 4 Colby St., Medford, Massachusetts 02155 (United States)

    2015-01-05

    Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systematic experimental studies and modeling efforts reveal essential aspects of electrical performance in field effect transistors and complementary ring oscillators with as many as 499 stages. Accelerated tests reveal timescales for dissolution of the various constituent materials, including tungsten, silicon, and silicon dioxide. The results demonstrate that silicon complementary metal-oxide-semiconductor circuits formed with tungsten interconnects in foundry-compatible fabrication processes can serve as a path to high performance, mass-produced transient electronic systems.

  19. Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node

    International Nuclear Information System (INIS)

    Yin, Lan; Harburg, Daniel V.; Rogers, John A.; Bozler, Carl; Omenetto, Fiorenzo

    2015-01-01

    Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systematic experimental studies and modeling efforts reveal essential aspects of electrical performance in field effect transistors and complementary ring oscillators with as many as 499 stages. Accelerated tests reveal timescales for dissolution of the various constituent materials, including tungsten, silicon, and silicon dioxide. The results demonstrate that silicon complementary metal-oxide-semiconductor circuits formed with tungsten interconnects in foundry-compatible fabrication processes can serve as a path to high performance, mass-produced transient electronic systems

  20. Hidden hyperchaos and electronic circuit application in a 5D self-exciting homopolar disc dynamo

    Science.gov (United States)

    Wei, Zhouchao; Moroz, Irene; Sprott, J. C.; Akgul, Akif; Zhang, Wei

    2017-03-01

    We report on the finding of hidden hyperchaos in a 5D extension to a known 3D self-exciting homopolar disc dynamo. The hidden hyperchaos is identified through three positive Lyapunov exponents under the condition that the proposed model has just two stable equilibrium states in certain regions of parameter space. The new 5D hyperchaotic self-exciting homopolar disc dynamo has multiple attractors including point attractors, limit cycles, quasi-periodic dynamics, hidden chaos or hyperchaos, as well as coexisting attractors. We use numerical integrations to create the phase plane trajectories, produce bifurcation diagram, and compute Lyapunov exponents to verify the hidden attractors. Because no unstable equilibria exist in two parameter regions, the system has a multistability and six kinds of complex dynamic behaviors. To the best of our knowledge, this feature has not been previously reported in any other high-dimensional system. Moreover, the 5D hyperchaotic system has been simulated using a specially designed electronic circuit and viewed on an oscilloscope, thereby confirming the results of the numerical integrations. Both Matlab and the oscilloscope outputs produce similar phase portraits. Such implementations in real time represent a new type of hidden attractor with important consequences for engineering applications.

  1. Soft, smart contact lenses with integrations of wireless circuits, glucose sensors, and displays.

    Science.gov (United States)

    Park, Jihun; Kim, Joohee; Kim, So-Yun; Cheong, Woon Hyung; Jang, Jiuk; Park, Young-Geun; Na, Kyungmin; Kim, Yun-Tae; Heo, Jun Hyuk; Lee, Chang Young; Lee, Jung Heon; Bien, Franklin; Park, Jang-Ung

    2018-01-01

    Recent advances in wearable electronics combined with wireless communications are essential to the realization of medical applications through health monitoring technologies. For example, a smart contact lens, which is capable of monitoring the physiological information of the eye and tear fluid, could provide real-time, noninvasive medical diagnostics. However, previous reports concerning the smart contact lens have indicated that opaque and brittle components have been used to enable the operation of the electronic device, and this could block the user's vision and potentially damage the eye. In addition, the use of expensive and bulky equipment to measure signals from the contact lens sensors could interfere with the user's external activities. Thus, we report an unconventional approach for the fabrication of a soft, smart contact lens in which glucose sensors, wireless power transfer circuits, and display pixels to visualize sensing signals in real time are fully integrated using transparent and stretchable nanostructures. The integration of this display into the smart lens eliminates the need for additional, bulky measurement equipment. This soft, smart contact lens can be transparent, providing a clear view by matching the refractive indices of its locally patterned areas. The resulting soft, smart contact lens provides real-time, wireless operation, and there are in vivo tests to monitor the glucose concentration in tears (suitable for determining the fasting glucose level in the tears of diabetic patients) and, simultaneously, to provide sensing results through the contact lens display.

  2. Physical and electrical characterization of corundum substrates and epitaxial silicon layers in view of fabricating integrated circuits

    International Nuclear Information System (INIS)

    Trilhe, J.; Legal, H.; Rolland, G.

    1975-01-01

    The S.O.S. technology (silicon on insulating substrate) allows compact, radiation hard, fast integrated circuits to be fabricated. It is noticeable that complex integrated circuits on corundum substrates obtained with various fabrication processes have various electrical characteristics. Possible correlations between the macroscopic defects of the substrate and the electrical characteristics of the circuit were investigated [fr

  3. Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions

    Directory of Open Access Journals (Sweden)

    Philip G. Neudeck

    2016-12-01

    Full Text Available The prolonged operation of semiconductor integrated circuits (ICs needed for long-duration exploration of the surface of Venus has proven insurmountably challenging to date due to the ∼ 460 °C, ∼ 9.4 MPa caustic environment. Past and planned Venus landers have been limited to a few hours of surface operation, even when IC electronics needed for basic lander operation are protected with heavily cumbersome pressure vessels and cooling measures. Here we demonstrate vastly longer (weeks electrical operation of two silicon carbide (4H-SiC junction field effect transistor (JFET ring oscillator ICs tested with chips directly exposed (no cooling and no protective chip packaging to a high-fidelity physical and chemical reproduction of Venus’ surface atmosphere. This represents more than 100-fold extension of demonstrated Venus environment electronics durability. With further technology maturation, such SiC IC electronics could drastically improve Venus lander designs and mission concepts, fundamentally enabling long-duration enhanced missions to the surface of Venus.

  4. A 64-channel integrated circuit for signal readout from coordinate detectors

    International Nuclear Information System (INIS)

    Aulchenko, V.; Shekhtman, L.; Zhulanov, V.

    2017-01-01

    A specialized integrated circuit was developed for the readout of signal from coordinate detectors of different types, including gas micro-pattern detectors and silicon microstrip detectors. The ASIC includes 64 channels, each containing a low-noise charge-sensitive amplifier with a connectable feedback capacitor and resistor, and fast reset of the feedback capacitor. Each channel of the ASIC also contains 100 cells of analogue memory where the signal can be stored at a rate of 10 MHz. The pitch of input pads is 50 μm and the chip size is 5× 5 mm 2 . The equivalent noise charge of the ASIC channel is about 2000 electrons with 10 pF capacitance at the input and maximal signal before saturation corresponds to 2× 10 6 electrons. The first application for this ASIC is the detector for imaging of explosions at a synchrotron radiation beam (DIMEX), where it has to substitute the old and slower APC128 ASIC. The full-size electronics including 8 ASICs for 512 channels was assembled and tested.

  5. Monolithic integration of micromachined sensors and CMOS circuits based on SOI technologies

    International Nuclear Information System (INIS)

    Yu Xiaomei; Tang Yaquan; Zhang Haitao

    2008-01-01

    This note presents a novel way to monolithically integrate micro-cantilever sensors and signal conditioning circuits by combining SOI CMOS and SOI micromachining technologies. In order to improve the sensor performance and reduce the system volume, an integrated sensor system composed of a piezoresistive cantilever array, a temperature-compensation current reference, a digitally controlled multiplexer and an instrument amplifier is designed and finally fabricated. A post-SOI CMOS process is developed to realize the integrated sensor system which is based on a standard CMOS process with one more mask to define the cantilever structure at the end of the process. Measurements on the finished SOI CMOS devices and circuits show that the integration process has good compatibility both for the cantilever sensors and for the CMOS circuits, and the SOI CMOS integration process can decrease about 25% sequences compared with the bulk silicon CMOS process. (note)

  6. Simulation of single-electron tunnelling circuits using SPICE

    NARCIS (Netherlands)

    Van de Haar, R.

    2004-01-01

    Single-electron tunnelling (SET) devices have very promising properties, like their extremely low power consumption, their extremely high switching speeds and their extremely small physical dimensions. Since the field of SET devices is far from being fully exploited, and their device properties seem

  7. Split-cross-bridge resistor for testing for proper fabrication of integrated circuits

    Science.gov (United States)

    Buehler, M. G. (Inventor)

    1985-01-01

    An electrical testing structure and method is described whereby a test structure is fabricated on a large scale integrated circuit wafer along with the circuit components and has a van der Pauw cross resistor in conjunction with a bridge resistor and a split bridge resistor, the latter having two channels each a line width wide, corresponding to the line width of the wafer circuit components, and with the two channels separated by a space equal to the line spacing of the wafer circuit components. The testing structure has associated voltage and current contact pads arranged in a two by four array for conveniently passing currents through the test structure and measuring voltages at appropriate points to calculate the sheet resistance, line width, line spacing, and line pitch of the circuit components on the wafer electrically.

  8. Stochastic Simulation of Integrated Circuits with Nonlinear Black-Box Components via Augmented Deterministic Equivalents

    Directory of Open Access Journals (Sweden)

    MANFREDI, P.

    2014-11-01

    Full Text Available This paper extends recent literature results concerning the statistical simulation of circuits affected by random electrical parameters by means of the polynomial chaos framework. With respect to previous implementations, based on the generation and simulation of augmented and deterministic circuit equivalents, the modeling is extended to generic and ?black-box? multi-terminal nonlinear subcircuits describing complex devices, like those found in integrated circuits. Moreover, based on recently-published works in this field, a more effective approach to generate the deterministic circuit equivalents is implemented, thus yielding more compact and efficient models for nonlinear components. The approach is fully compatible with commercial (e.g., SPICE-type circuit simulators and is thoroughly validated through the statistical analysis of a realistic interconnect structure with a 16-bit memory chip. The accuracy and the comparison against previous approaches are also carefully established.

  9. Reliability Oriented Circuit Design For Power Electronics Applications

    DEFF Research Database (Denmark)

    Sintamarean, Nicolae Cristian

    . The temperature variation of the semiconductor devices plays a key role in the robustness design and reliability of power electronics converters. This factor has a major impact on the power converters used in renewable energy systems, like solar and wind energy applications, due to the fluctuating nature...... energy technology, a reliability-oriented design tool is of great interest. This tool is expected to perform the long-term (e.g. one year) electrothermal and then the reliability aspect analysis of the switching devices in the new generation of power converters. Besides this, another important method...... for improving the reliability is by active thermal control of the power electronic devices. The work developed during the Ph.D. studies the above mentioned topics, and is divided into two main parts: the first part develops a reliability-oriented design tool which is using a long term real-field mission...

  10. Active component modeling for analog integrated circuit design. Model parametrization and implementation in the SPICE-PAC circuit simulator

    International Nuclear Information System (INIS)

    Marchal, Xavier

    1992-01-01

    In order to use CAD efficiently in the analysis and design of electronic Integrated circuits, adequate modeling of active non-linear devices such as MOSFET transistors must be available to the designer. Many mathematical forms can be given to those models, such as explicit relations, or implicit equations to be solved. A major requirement in developing MOS transistor models for IC simulation is the availability of electrical characteristic curves over a wide range of channel width and length, including the sub-micrometer range. To account in a convenient way for bulk charge influence on I DS = f(V DS , V GS , v BS ) device characteristics, all 3 standard SPICE MOS models use an empirical fitting parameter called the 'charge sharing factor'. Unfortunately, this formulation produces models which only describe correctly either some of the short channel phenomena, or some particular operating conditions (low injection, avalanche effect, etc.). We present here a cellular model (CDM = Charge Distributed Model) implemented in the open modular SPICE-PAC Simulator; this model is derived from the 4-terminal WANG charge controlled MOSFET model, using the charge sheet approximation. The CDM model describes device characteristics in ail operating regions without introducing drain current discontinuities and without requiring a 'charge sharing factor'. A usual problem to be faced by designers when they simulate MOS ICs is to find a reliable source of model parameters. Though most models have a physical basis, some of their parameters cannot be easily estimated from physical considerations. It can also happen that physically determined parameters values do not produce a good fit to measured device characteristics. Thus it is generally necessary to extract model parameters from measured transistor data, to ensure that model equations approximate measured curves accurately enough. Model parameters extraction can be done in 2 different ways, exposed in this

  11. Scalable Testing Platform for CMOS Read In Integrated Circuits

    Science.gov (United States)

    2016-03-31

    to the test RIIC. The critical feature of the BRT board is a zero insertion force (ZIF) DIP socket that sits in the middle, which allows us to modify...PGA) package because it has a PGA socket that breaks out all of the necessary RIIC signals. This allows the control signals from the computer to be...One is programmed to do voltage sweeps of the pixel circuits in the RIIC (7 in Figure 1), and the other Keithley measures the output super-lattice

  12. Printed Circuit Boards with Integrated Heat Carrier Channels for Deep Geothermal Resources

    Science.gov (United States)

    Krühn, T.; Overmeyer, L.

    2012-04-01

    The exploration of deep geothermal resources is still very expensive. A large amount of these costs is caused by the drilling process. The high price results from a high failure risk, slow drilling progress and a large amount of manual work. To develop deep heat mining to a sizeable contribution to the European energy portfolio, the exploration process has to become a lot cheaper. One step to achieve lower costs is to monitor and automate the drilling process. Therefore, electronic components such as sensors and data processing units must be integrated into the Bottom Hole Assembly (BHA). The integration of electronics into the BHA faces the challenge of high ambient temperatures. The project "Packaging of Electronic Components for High Temperature Applications" within the "Geothermal Energy and High Performance-Drilling Collaborative Research Program (gebo)" develops a system of heat carrier channels integrated in printed circuit boards (PCB). These channels can be perfused with fluids such as water, oil or gas and provide high heat convection rates. Such PCBs will be able to withstand high ambient temperatures up to 250 °C. We have simulated, manufactured and are currently testing prototype boards with integrated heat carrier channels featuring a thickness of only 1.6 mm. As a simulation scenario, we chose a board measuring 25 mm x 100 mm, dimensions suitable for integration into a BHA. An ambient temperature of 250 °C was used. The simulation results presented in this contribution illustrate that cooling of the whole board as well as cooling of hotspots is possible. The cooling channel layout being the key for high convection rates was meticulously studied and optimized. Parameters such as necessary flow rate and fluid pressure were adjusted accordingly. Preliminary experiments validate the demonstrated and discussed simulation results. With the proposed cooling system, it is possible to integrate microelectronic components into the BHA for drilling

  13. Analysis and application of analog electronic circuits to biomedical instrumentation

    CERN Document Server

    Northrop, Robert B

    2012-01-01

    All chapters include an introduction and chapter summary.Sources and Properties of Biomedical SignalsSources of Endogenous Bioelectric SignalsNerve Action PotentialsMuscle Action PotentialsThe ElectrocardiogramOther BiopotentialsElectrical Properties of BioelectrodesExogenous Bioelectric SignalsProperties and Models of Semiconductor Devices Used in Analog Electronic Systemspn Junction DiodesMidfrequency Models for BJT BehaviorMidfrequency Models for Field-Effect TransistorsHigh-Frequency Models for Transistors and Simple Transistor AmplifiersPhotons, Photodiodes, Photoconductors, LEDs, and Las

  14. Electronic Device of Didactic and Electrometric Interest for the Study of RLC Circuits.

    Science.gov (United States)

    Rodriguez, Angel L. Perez; And Others

    1979-01-01

    Presents a method of studying RLC circuits with the help of the oscilloscope in the XYZ mode, complemented by an electronic device which generates a marker-trace on the screen and which is used to measure frequencies without the need of a reference point on the screen. (Author/GA)

  15. Reliability improvement of electronic circuits based on physical failure mechanisms in components

    NARCIS (Netherlands)

    Brombacher, A.C.; de Boer, H.A.; Bennion, M.; Fennema, P.H.; Hermann, O.E.

    1991-01-01

    Traditionally the position of reliability analysis in the design and production process of electronic circuits is a position of reliability verification. A completed design is checked on reliability aspects and either rejected or accepted for production. This paper describes a method to model

  16. Short-Circuit Robustness Assessment in Power Electronic Modules for Megawatt Applications

    DEFF Research Database (Denmark)

    Iannuzzo, Francesco

    2016-01-01

    In this paper, threats and opportunities in testing of megawatt power electronic modules under short circuit are presented and discussed, together with the introduction of some basic principles of non-destructive testing, a key technique to allow post-failure analysis. The non-destructive testing...... silicon carbide – and new concepts for nondestructive testing of ultrafast power modules adopting such a technology....

  17. Analog Multilayer Perceptron Circuit with On-chip Learning: Portable Electronic Nose

    Science.gov (United States)

    Pan, Chih-Heng; Tang, Kea-Tiong

    2011-09-01

    This article presents an analog multilayer perceptron (MLP) neural network circuit with on-chip back propagation learning. This low power and small area analog MLP circuit is proposed to implement as a classifier in an electronic nose (E-nose). Comparing with the E-nose using microprocessor or FPGA as a classifier, the E-nose applying analog circuit as a classifier can be faster and much smaller, demonstrate greater power efficiency and be capable of developing a portable E-nose [1]. The system contains four inputs, four hidden neurons, and only one output neuron; this simple structure allows the circuit to have a smaller area and less power consumption. The circuit is fabricated using TSMC 0.18 μm 1P6M CMOS process with 1.8 V supply voltage. The area of this chip is 1.353×1.353 mm2 and the power consumption is 0.54 mW. Post-layout simulations show that the proposed analog MLP circuit can be successively trained to identify three kinds of fruit odors.

  18. The Electron Runaround: Understanding Electric Circuit Basics Through a Classroom Activity

    Science.gov (United States)

    Singh, Vandana

    2010-05-01

    Several misconceptions abound among college students taking their first general physics course, and to some extent pre-engineering physics students, regarding the physics and applications of electric circuits. Analogies used in textbooks, such as those that liken an electric circuit to a piped closed loop of water driven by a water pump, do not completely resolve these misconceptions. Mazur and Knight,2 in particular, separately note that such misconceptions include the notion that electric current on either side of a light bulb in a circuit can be different. Other difficulties and confusions involve understanding why the current in a parallel circuit exceeds the current in a series circuit with the same components, and include the role of the battery (where students may assume wrongly that a dry cell battery is a fixed-current rather than a fixed-voltage device). A simple classroom activity that students can play as a game can resolve these misconceptions, providing an intellectual as well as a hands-on understanding. This paper describes the "Electron Runaround," first developed by the author to teach extremely bright 8-year-old home-schooled children the basics of electric circuits and subsequently altered (according to the required level of instruction) and used for various college physics courses.

  19. Thermal Management in Fine-Grained 3-D Integrated Circuits

    OpenAIRE

    Iqbal, Md Arif; Macha, Naveen Kumar; Danesh, Wafi; Hossain, Sehtab; Rahman, Mostafizur

    2018-01-01

    For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor increase hotspots and demand careful consideration of thermal management at all levels of integration [4] as stacked transistors are detached from the substrate (i.e., heat sink). Traditional system level approaches such as liquid cooling [5], heat spreader [6], ...

  20. Integrated electrofluidic circuits: pressure sensing with analog and digital operation functionalities for microfluidics.

    Science.gov (United States)

    Wu, Chueh-Yu; Lu, Jau-Ching; Liu, Man-Chi; Tung, Yi-Chung

    2012-10-21

    Microfluidic technology plays an essential role in various lab on a chip devices due to its desired advantages. An automated microfluidic system integrated with actuators and sensors can further achieve better controllability. A number of microfluidic actuation schemes have been well developed. In contrast, most of the existing sensing methods still heavily rely on optical observations and external transducers, which have drawbacks including: costly instrumentation, professional operation, tedious interfacing, and difficulties of scaling up and further signal processing. This paper reports the concept of electrofluidic circuits - electrical circuits which are constructed using ionic liquid (IL)-filled fluidic channels. The developed electrofluidic circuits can be fabricated using a well-developed multi-layer soft lithography (MSL) process with polydimethylsiloxane (PDMS) microfluidic channels. Electrofluidic circuits allow seamless integration of pressure sensors with analog and digital operation functions into microfluidic systems and provide electrical readouts for further signal processing. In the experiments, the analog operation device is constructed based on electrofluidic Wheatstone bridge circuits with electrical outputs of the addition and subtraction results of the applied pressures. The digital operation (AND, OR, and XOR) devices are constructed using the electrofluidic pressure controlled switches, and output electrical signals of digital operations of the applied pressures. The experimental results demonstrate the designed functions for analog and digital operations of applied pressures are successfully achieved using the developed electrofluidic circuits, making them promising to develop integrated microfluidic systems with capabilities of precise pressure monitoring and further feedback control for advanced lab on a chip applications.

  1. DCal: A custom integrated circuit for calorimetry at the International Linear Collider

    Energy Technology Data Exchange (ETDEWEB)

    Hoff, James R.; Mekkaoui, Abderrazek; Yarema, Ray; /Fermilab; Drake, Gary; Repond, Jose; /Argonne

    2005-10-01

    A research and development collaboration has been started with the goal of producing a prototype hadron calorimeter section for the purpose of proving the Particle Flow Algorithm concept for the International Linear Collider. Given the unique requirements of a Particle Flow Algorithm calorimeter, custom readout electronics must be developed to service these detectors. This paper introduces the DCal or Digital Calorimetry Chip, a custom integrated circuit developed in a 0.25um CMOS process specifically for this International Linear Collider project. The DCal is capable of handling 64 channels, producing a 1-bit Digital-to-Analog conversion of the input (i.e. hit/no hit). It maintains a 24-bit timestamp and is capable of operating either in an externally triggered mode or in a self-triggered mode. Moreover, it is capable of operating either with or without a pipeline delay. Finally, in order to permit the testing of different calorimeter technologies, its analog front end is capable of servicing Particle Flow Algorithm calorimeters made from either Resistive Plate Chambers or Gaseous Electron Multipliers.

  2. Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

    Science.gov (United States)

    Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

    2016-09-01

    Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

  3. A compact picosecond pulsed laser source using a fully integrated CMOS driver circuit

    Science.gov (United States)

    He, Yuting; Li, Yuhua; Yadid-Pecht, Orly

    2016-03-01

    Picosecond pulsed laser source have applications in areas such as optical communications, biomedical imaging and supercontinuum generation. Direct modulation of a laser diode with ultrashort current pulses offers a compact and efficient approach to generate picosecond laser pulses. A fully integrated complementary metaloxide- semiconductor (CMOS) driver circuit is designed and applied to operate a 4 GHz distributed feedback laser (DFB). The CMOS driver circuit combines sub-circuits including a voltage-controlled ring oscillator, a voltagecontrolled delay line, an exclusive-or (XOR) circuit and a current source circuit. Ultrashort current pulses are generated by the XOR circuit when the delayed square wave is XOR'ed with the original square wave from the on-chip oscillator. Circuit post-layout simulation shows that output current pulses injected into an equivalent circuit load of the laser have a pulse full width at half maximum (FWHM) of 200 ps, a peak current of 80 mA and a repetition rate of 5.8 MHz. This driver circuit is designed in a 0.13 μm CMOS process and taped out on a 0.3 mm2 chip area. This CMOS chip is packaged and interconnected with the laser diode on a printed circuit board (PCB). The optical output waveform from the laser source is captured by a 5 GHz bandwidth photodiode and an 8 GHz bandwidth oscilloscope. Measured results show that the proposed laser source can output light pulses with a pulse FWHM of 151 ps, a peak power of 6.4 mW (55 mA laser peak forward current) and a repetition rate of 5.3 MHz.

  4. Multi-valued logic circuits using hybrid circuit consisting of three gates single-electron transistors (TG-SETs) and MOSFETs.

    Science.gov (United States)

    Shin, SeungJun; Yu, YunSeop; Choi, JungBum

    2008-10-01

    New multi-valued logic (MVL) families using the hybrid circuits consisting of three gates single-electron transistors (TG-SETs) and a metal-oxide-semiconductor field-effect transistor (MOSFET) are proposed. The use of SETs offers periodic literal characteristics due to Coulomb oscillation of SET, which allows a realization of binary logic (BL) circuits as well as multi-valued logic (MVL) circuits. The basic operations of the proposed MVL families are successfully confirmed through SPICE circuit simulation based on the physical device model of a TG-SET. The proposed MVL circuits are found to be much faster, but much larger power consumption than a previously reported MVL, and they have a trade-off between speed and power consumption. As an example to apply the newly developed MVL families, a half-adder is introduced.

  5. Device Process and Circuit Application Interaction for Harsh Electronics: Hf-In-Zn-O Thin Film Transistors as an Example

    KAUST Repository

    Ho, Chih-Hsiang

    2017-06-27

    The effects of Hf content on the radiation hardness of Hf-In-Zn-O thin-film transistors (HIZO TFTs) and HIZO TFTbased circuits are systemically examined. The evaluated circuits, including current-starved ring oscillator, energy harvesting and RF circuits are essential for space electronic systems. It is shown that HIZO TFTs with low Hf concentration have better initial performance while TFTs with high Hf concentration are more stable against radiation. On the other hand, for circuit application, the stable HIZO TFTs are not necessarily preferred for all circuits. The work demonstrates that understanding the device-circuit interactions is necessary for device optimization and circuit reliability improvements for harsh electronic systems.

  6. Assessment of Electronic Circuits Reliability Using Boolean Truth Table Modeling Method

    International Nuclear Information System (INIS)

    EI-Shanshoury, A.I.

    2011-01-01

    This paper explores the use of Boolean Truth Table modeling Method (BTTM) in the analysis of qualitative data. It is widely used in certain fields especially in the fields of electrical and electronic engineering. Our work focuses on the evaluation of power supply circuit reliability using (BTTM) which involves systematic attempts to falsify and identify hypotheses on the basis of truth tables constructed from qualitative data. Reliability parameters such as the system's failure rates for the power supply case study are estimated. All possible state combinations (operating and failed states) of the major components in the circuit were listed and their effects on overall system were studied

  7. Problems and Projects Based Approach For Analog Electronic Circuits' Course

    Directory of Open Access Journals (Sweden)

    Mustapha Rafaf

    2009-04-01

    Full Text Available New educational methods and approaches are recently introduced and implemented at several North American and European universities using Problems and Projects Based Approach (PPBA. The PPBA employs a teaching technique based mostly on competences/skills rather than only on knowledge. This method has been implemented and proven by several pedagogical instructors and authors at several educational institutions. This approach is used at different disciplines such as medicine, biology, engineering and many others. It has the advantage to improve the student's skills and the knowledge retention rate, and reflects the 21st century industrial/company needs and demands. Before implementing this approach to a course, a good resources preparation and planning is needed upfront by the responsible or instructor of the course to achieve the course and students related objectives. This paper presents the preparation, the generated documentation and the implementation of a pilot project utilizing PPBA education for a second year undergraduate electronic course over a complete semester, and for two different class groups (morning and evening groups. The outcome of this project (achieved goals, observed difficulties and lessons learned is presented based on different tools such as students 'in class' communication and feedback, different course evaluation forms and the professor/instructor feedback. Resources, challenges, difficulties and recommendations are also assessed and presented. The impact, the effect and the results (during and at the end of the academic fall session of the PPBA on students and instructor are discussed, validated, managed and communicated to help other instructor in taking appropriate approach decisions with respect to this new educational approach compared to the classical one.

  8. Method and apparatus for in-system redundant array repair on integrated circuits

    Science.gov (United States)

    Bright, Arthur A [Croton-on-Hudson, NY; Crumley, Paul G [Yorktown Heights, NY; Dombrowa, Marc B [Bronx, NY; Douskey, Steven M [Rochester, MN; Haring, Rudolf A [Cortlandt Manor, NY; Oakland, Steven F [Colchester, VT; Ouellette, Michael R [Westford, VT; Strissel, Scott A [Byron, MN

    2008-07-08

    Disclosed is a method of repairing an integrated circuit of the type comprising of a multitude of memory arrays and a fuse box holding control data for controlling redundancy logic of the arrays. The method comprises the steps of providing the integrated circuit with a control data selector for passing the control data from the fuse box to the memory arrays; providing a source of alternate control data, external of the integrated circuit; and connecting the source of alternate control data to the control data selector. The method comprises the further step of, at a given time, passing the alternate control data from the source thereof, through the control data selector and to the memory arrays to control the redundancy logic of the memory arrays.

  9. Data Transformation in a Three Dimensional Integrated Circuit Implementation

    Science.gov (United States)

    2012-03-01

    enforcing data integrity is cryptographical hash functions. • Authentication is the process that verifies the identity of a specific entity involved in a...Using this primitive, the integrity of data can be enforced . It is feasible for any entity to reproduce the message digest from the same stream of...14th Annual IEEE International ASIC /SOC Conference, Sept. 2001. [17] B. Black, M. Annavaram, N. Brekelbaum, J. DeVale, L. Jiang, G. H. Loh, D

  10. Hybrid circuit prototypes for the CMS Tracker upgrade front-end electronics

    International Nuclear Information System (INIS)

    Blanchot, G; Honma, A; Kovacs, M; Braga, D; Raymond, M

    2013-01-01

    New high-density interconnect hybrid circuits are under development for the CMS tracker modules at the HL-LHC. These hybrids will provide module connectivity between flip-chip front-end ASICs, strip sensors and a service board for the data transmission and powering. Rigid organic-based substrate prototypes and also a flexible hybrid design have been built, containing up to eight front-end flip chip ASICs. A description of the function of the hybrid circuit in the tracker, the first prototype designs, results of some electrical and mechanical properties from the prototypes, and examples of the integration of the hybrids into detector modules are presented

  11. Integrated equipment for increasing and maintaining coolant pressure in primary circuit of PWR nuclear power plant

    International Nuclear Information System (INIS)

    Sykora, D.

    1986-01-01

    An open heat pump circuit is claimed connected to the primary circuit. The pump circuit consists of a steam pressurizer with a built-in steam distributor, a compressor, an expander, a reducing valve, an auxiliary pump, and of water and steam pipes. The operation is described and a block diagram is shown of integrated equipment for increasing and maintaining pressure in the nuclear power plant primary circuit. The appropriate entropy diagram is also shown. The advantage of the open pump circuit consists in reducing the electric power input and electric power consumption for the steam pressurizers, removing entropy loss in heat transfer with high temperature gradient, in the possibility of inserting, between the expander and the auxiliary pump, a primary circuit coolant treatment station, in simplified design and manufacture of the high-pressure steam pressurizer vessel, reducing the weight of the steam pressurizer by changing its shape from cylindrical to spherical, increasing the rate of pressure growth in the primary circuit. (E.S.)

  12. Printed Circuit Board Signal Integrity Analysis at CERN: POSTER 1/2 Workshop

    CERN Document Server

    Evans, John

    2001-01-01

    Printed circuit board (PCB) design layout for digital circuits has become a critical issue due to increasing clock frequencies and faster signal switching times. The Cadence SPECCTRAQuest package allows the detailed signal integrity (SI) analysis of designs from the schematic-entry phase to the board level. It is fully integrated into the Cadence PCB design flow and can be used to reduce prototype iterations and improve production robustness. Examples are given on how the tool can help engineers to make design choices and how to optimise board layout for electrical performance. Case studies of work done for LHC detectors are presented.

  13. Printed Circuit Board Signal Integrity Analysis at CERN: POSTER 2/2 Workshop

    CERN Document Server

    Evans, John

    2001-01-01

    Printed circuit board (PCB) design layout for digital circuits has become a critical issue due to increasing clock frequencies and faster signal switching times. The Cadence SPECCTRAQuest package allows the detailed signal integrity (SI) analysis of designs from the schematic-entry phase to the board level. It is fully integrated into the Cadence PCB design flow and can be used to reduce prototype iterations and improve production robustness. Examples are given on how the tool can help engineers to make design choices and how to optimise board layout for electrical performance. Case studies of work done for LHC detectors are presented.

  14. Method for Evaluating the Corrosion Resistance of Aluminum Metallization of Integrated Circuits under Multifactorial Influence

    Science.gov (United States)

    Kolomiets, V. I.

    2018-03-01

    The influence of complex influence of climatic factors (temperature, humidity) and electric mode (supply voltage) on the corrosion resistance of metallization of integrated circuits has been considered. The regression dependence of the average time of trouble-free operation t on the mentioned factors has been established in the form of a modified Arrhenius equation that is adequate in a wide range of factor values and is suitable for selecting accelerated test modes. A technique for evaluating the corrosion resistance of aluminum metallization of depressurized CMOS integrated circuits has been proposed.

  15. Wafer-level testing and test during burn-in for integrated circuits

    CERN Document Server

    Bahukudumbi, Sudarshan

    2010-01-01

    Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing.Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constrain

  16. An integrated energy-efficient capacitive sensor digital interface circuit

    KAUST Repository

    Omran, Hesham

    2014-06-19

    In this paper, we propose an energy-efficient 13-bit capacitive sensor interface circuit. The proposed design fully relies on successive approximation algorithm, which eliminates the need for oversampling and digital decimation filtering, and thus low-power consumption is achieved. The proposed architecture employs a charge amplifier stage to acheive parasitic insensitive operation and fine absolute resolution. Moreover, the output code is not affected by offset voltages or charge injection. The successive approximation algorithm is implemented in the capacitance-domain using a coarse-fine programmable capacitor array, which allows digitizing wide capacitance range in compact area. Analysis for the maximum achievable resolution due to mismatch is provided. The proposed design is insensitive to any reference voltage or current which translates to low temperature sensitivity. The operation of a prototype fabricated in a standard CMOS technology is experimentally verified using both on-chip and off-chip capacitive sensors. Compared to similar prior work, the fabricated prototype achieves and excellent energy efficiency of 34 pJ/step.

  17. Integrated circuits for volumetric ultrasound imaging with 2-D CMUT arrays.

    Science.gov (United States)

    Bhuyan, Anshuman; Choe, Jung Woo; Lee, Byung Chul; Wygant, Ira O; Nikoozadeh, Amin; Oralkan, Ömer; Khuri-Yakub, Butrus T

    2013-12-01

    Real-time volumetric ultrasound imaging systems require transmit and receive circuitry to generate ultrasound beams and process received echo signals. The complexity of building such a system is high due to requirement of the front-end electronics needing to be very close to the transducer. A large number of elements also need to be interfaced to the back-end system and image processing of a large dataset could affect the imaging volume rate. In this work, we present a 3-D imaging system using capacitive micromachined ultrasonic transducer (CMUT) technology that addresses many of the challenges in building such a system. We demonstrate two approaches in integrating the transducer and the front-end electronics. The transducer is a 5-MHz CMUT array with an 8 mm × 8 mm aperture size. The aperture consists of 1024 elements (32 × 32) with an element pitch of 250 μm. An integrated circuit (IC) consists of a transmit beamformer and receive circuitry to improve the noise performance of the overall system. The assembly was interfaced with an FPGA and a back-end system (comprising of a data acquisition system and PC). The FPGA provided the digital I/O signals for the IC and the back-end system was used to process the received RF echo data (from the IC) and reconstruct the volume image using a phased array imaging approach. Imaging experiments were performed using wire and spring targets, a ventricle model and a human prostrate. Real-time volumetric images were captured at 5 volumes per second and are presented in this paper.

  18. Exploitation of Unintentional Information Leakage from Integrated Circuits

    Science.gov (United States)

    Cobb, William E.

    2011-01-01

    The information leakage of electronic devices, especially those used in cryptographic or other vital applications, represents a serious practical threat to secure systems. While physical implementation attacks have evolved rapidly over the last decade, relatively little work has been done to allow system designers to effectively counter the…

  19. Photonic Integrated Circuits for mmW Systems

    DEFF Research Database (Denmark)

    Vegas Olmos, Juan José; Heck, M. J. R.; Tafur Monroy, Idelfonso

    2015-01-01

    WiFi frequency bands do not have enough capacity and wireless communication needs to move to the millimeter-wavelength or sub-terahertz range. The use of all-electronic solutions becomes increasingly prohibitive, though, at these higher frequencies. Microwave photonic technology o®ers the bandwidth...

  20. An integrated circuit for wireless ambulatory arrhythmia monitoring systems.

    Science.gov (United States)

    Kim, Hyejung; Yazicioglu, Refet Firat; Torfs, Tom; Merken, Patrick; Van Hoof, Chris; Yoo, Hoi-Jun

    2009-01-01

    An ECG signal processor (ESP) is proposed for the low energy wireless ambulatory arrhythmia monitoring system. The ECG processor mainly performs filtering, compression, classification and encryption. The data compression flow consisting of skeleton and modified Huffman coding is the essential function to reduce the transmission energy consumption and the memory capacity, which are the most energy consuming part. The classification flow performs the arrhythmia analysis to alert the abnormality. The proposed ESP IC is implemented in 0.18-microm CMOS process and integrated into the wireless arrhythmia monitoring sensor platform. By integration of the ESP, the total system energy reduction is evaluated by 95.6%.

  1. Integrative Strategy for Effective Teaching of Alternating Circuits in ...

    African Journals Online (AJOL)

    One of the reasons advanced for the low enrolment and achievement of students in Physics at both secondary and post-secondary schools is poor teaching strategies used by teachers of Physics particularly in teaching Physics concepts classified by students as being difficult. In this paper, integrative strategy for effective ...

  2. W-band Phased Array Systems using Silicon Integrated Circuits

    Science.gov (United States)

    Kim, Sang Young

    This thesis presents the silicon-based on-chip W-band phased array systems. An improved quadrature all-pass filter (QAF) and its implementation in 60--80 GHz active phase shifter using 0.13 microm SiGe BiCMOS technology is presented. It is demonstrated that with the inclusion of an Rs/R in the high Q branches of C and L, the sensitivity to the loading capacitance, therefore the I/Q phase and amplitude errors are minimized. This technique is especially suited for wideband millimeter-wave circuits where the loading capacitance (CL) is comparable to the filter capacitance (C). A prototype 60--80 GHz active phased shifter using the improved QAF is demonstrated. The overall chip size is 1.15 x 0.92 mm2 with the power consumption of 108 mW. The measured S11 and S22 are pass pi-network. The chip size is 0.45 x 0.3 mm2 without pads and consumes virtually no power. The measured S11 and S22 is 8 dBm and the simulated IIP3 is > 22 dBm. A low-power 76--84 GHz 4-element phased array receiver using the designed passive phase shifter is presented. The power consumption is minimized by using a single-ended design and alternating the amplifiers and phase shifter cells to result in a low noise figure at a low power consumption. A variable gain amplifier and the 11° phase shifter are used to correct for the rms gain and phase errors at different operating frequencies. The overall chip size is 2.0 x 2.7 mm2 with the current consumption of 18 mA/channel with 1.8 V supply voltage. The measured S11 and S 22 is circuits are designed differentially to result in less sensitivity to packaging effect and high channel-to-channel isolation. The overall chip size is 5.0 x 5.8 mm 2 with the power consumption of 500--600 mA from 2 V supply voltage. The measured S11 and S22 for all 16 phase states is 10 dB for 76.4--90 GHz with the rms gain error of -45 dB. The measured NF is 11.2--13 dB at 77--87 GHz at the maximum gain state. And the measured input P1dB is 20 dBm at 77 GHz and -25.8 dBm at the

  3. Coupling an Ensemble of Electrons on Superfluid Helium to a Superconducting Circuit

    Directory of Open Access Journals (Sweden)

    Ge Yang

    2016-03-01

    Full Text Available The quantized lateral motional states and the spin states of electrons trapped on the surface of superfluid helium have been proposed as basic building blocks of a scalable quantum computer. Circuit quantum electrodynamics allows strong dipole coupling between electrons and a high-Q superconducting microwave resonator, enabling such sensitive detection and manipulation of electron degrees of freedom. Here, we present the first realization of a hybrid circuit in which a large number of electrons are trapped on the surface of superfluid helium inside a coplanar waveguide resonator. The high finesse of the resonator allows us to observe large dispersive shifts that are many times the linewidth and make fast and sensitive measurements on the collective vibrational modes of the electron ensemble, as well as the superfluid helium film underneath. Furthermore, a large ensemble coupling is observed in the dispersive regime during experiment, and it shows excellent agreement with our numeric model. The coupling strength of the ensemble to the cavity is found to be ≈1  MHz per electron, indicating the feasibility of achieving single electron strong coupling.

  4. Analog Integrated Circuit and System Design for a Compact, Low-Power Cochlear Implant

    NARCIS (Netherlands)

    Ngamkham, W.

    2015-01-01

    Cochlear Implants (CIs) are prosthetic devices that restore hearing in profoundly deaf patients by bypassing the damaged parts of the inner ear and directly stimulating the remaining auditory nerve fibers in the cochlea with electrical pulses. This thesis describs the electronic circuit design of

  5. Sinusoidal oscillators and waveform generators using modern electronic circuit building blocks

    CERN Document Server

    Senani, Raj; Singh, V K; Sharma, R K

    2016-01-01

    This book serves as a single-source reference to sinusoidal oscillators and waveform generators, using classical as well as a variety of modern electronic circuit building blocks. It provides a state-of-the-art review of a large variety of sinusoidal oscillators and waveform generators and includes a catalogue of over 600 configurations of oscillators and waveform generators, describing their relevant design details and salient performance features/limitations. The authors discuss a number of interesting, open research problems and include a comprehensive collection of over 1500 references on oscillators and non-sinusoidal waveform generators/relaxation oscillators. Offers readers a single-source reference to everything connected to sinusoidal oscillators and waveform generators, using classical as well as modern electronic circuit building blocks; Provides a state-of-the-art review of a large variety of sinusoidal oscillators and waveform generators; Includes a catalog of over 600 configurations of oscillato...

  6. Computer-Aided Engineering of Semiconductor Integrated Circuits

    Science.gov (United States)

    1979-07-01

    effects, a nonelectron beam flash evaporation system was employed. 2. To investigate the annealing of an Si-SiO 2 interface covered by an aluminum...constant pressure, and c is a constant. Consequently, the temperature dependence of Eq. (3.49) depends on the endo- thermic or exothermic nature of...using an electron-beam evaporation system. The resulting Al/WSi 2/SiO 2/Si and Al/WS 2/poly-Si/Si0 2/Si structures were annealed in the temperature range

  7. Silicon-Based Light Sources for Silicon Integrated Circuits

    Directory of Open Access Journals (Sweden)

    L. Pavesi

    2008-01-01

    Full Text Available Silicon the material per excellence for electronics is not used for sourcing light due to the lack of efficient light emitters and lasers. In this review, after having introduced the basics on lasing, I will discuss the physical reasons why silicon is not a laser material and the approaches to make it lasing. I will start with bulk silicon, then I will discuss silicon nanocrystals and Er3+ coupled silicon nanocrystals where significant advances have been done in the past and can be expected in the near future. I will conclude with an optimistic note on silicon lasing.

  8. Performance prediction for silicon photonics integrated circuits with layout-dependent correlated manufacturing variability.

    Science.gov (United States)

    Lu, Zeqin; Jhoja, Jaspreet; Klein, Jackson; Wang, Xu; Liu, Amy; Flueckiger, Jonas; Pond, James; Chrostowski, Lukas

    2017-05-01

    This work develops an enhanced Monte Carlo (MC) simulation methodology to predict the impacts of layout-dependent correlated manufacturing variations on the performance of photonics integrated circuits (PICs). First, to enable such performance prediction, we demonstrate a simple method with sub-nanometer accuracy to characterize photonics manufacturing variations, where the width and height for a fabricated waveguide can be extracted from the spectral response of a racetrack resonator. By measuring the spectral responses for a large number of identical resonators spread over a wafer, statistical results for the variations of waveguide width and height can be obtained. Second, we develop models for the layout-dependent enhanced MC simulation. Our models use netlist extraction to transfer physical layouts into circuit simulators. Spatially correlated physical variations across the PICs are simulated on a discrete grid and are mapped to each circuit component, so that the performance for each component can be updated according to its obtained variations, and therefore, circuit simulations take the correlated variations between components into account. The simulation flow and theoretical models for our layout-dependent enhanced MC simulation are detailed in this paper. As examples, several ring-resonator filter circuits are studied using the developed enhanced MC simulation, and statistical results from the simulations can predict both common-mode and differential-mode variations of the circuit performance.

  9. Experimentally verified inductance extraction and parameter study for superconductive integrated circuit wires crossing ground plane holes

    International Nuclear Information System (INIS)

    Fourie, Coenrad J; Wetzstein, Olaf; Kunert, Juergen; Meyer, Hans-Georg; Toepfer, Hannes

    2013-01-01

    As the complexity of rapid single flux quantum (RSFQ) circuits increases, both current and power consumption of the circuits become important design criteria. Various new concepts such as inductive biasing for energy efficient RSFQ circuits and inductively coupled RSFQ cells for current recycling have been proposed to overcome increasingly severe design problems. Both of these techniques use ground plane holes to increase the inductance or coupling factor of superconducting integrated circuit wires. New design tools are consequently required to handle the new topographies. One important issue in such circuit design is the accurate calculation of networks of inductances even in the presence of finite holes in the ground plane. We show how a fast network extraction method using InductEx, which is a pre- and post-processor for the magnetoquasistatic field solver FastHenry, is used to calculate the inductances of a set of SQUIDs (superconducting quantum interference devices) with ground plane holes of different sizes. The results are compared to measurements of physical structures fabricated with the IPHT Jena 1 kA cm −2 RSFQ niobium process to verify accuracy. We then do a parameter study and derive empirical equations for fast and useful estimation of the inductance of wires surrounded by ground plane holes. We also investigate practical circuits and show excellent accuracy. (paper)

  10. SPICE Modeling of Body Bias Effect in 4H-SiC Integrated Circuit Resistors

    Science.gov (United States)

    Neudeck, Philip G.

    2017-01-01

    The DC electrical behavior of n-type 4H-SiC resistors used for realizing 500C durable integrated circuits (ICs) is studied as a function of substrate bias and temperature. Improved fidelity electrical simulation is described using SPICE NMOS model to simulate resistor substrate body bias effect that is absent from the SPICE semiconductor resistor model.

  11. The Hybrid Integrated Circuit of the ALICE Inner Tracking System upgrade

    CERN Document Server

    Fiorenza, G; Pastore, C; Valentino, V

    2016-01-01

    The upgrade of the Inner Tracking System scheduled during the second long shutdown is an important milestone of the ALICE upgrade and it will provide a high improvement of its performances. In this contribution the smallest operator unit of the detector, the Hybrid Integrated Circuits, is presented.

  12. Wideband Monolithic Microwave Integrated Circuit Frequency Converters with GaAs mHEMT Technology

    DEFF Research Database (Denmark)

    Krozer, Viktor; Johansen, Tom Keinicke; Djurhuus, Torsten

    2005-01-01

    We present monolithic microwave integrated circuit (MMIC) frequency converter, which can be used for up and down conversion, due to the large RF and IF port bandwidth. The MMIC converters are based on commercially available GaAs mHEMT technology and are comprised of a Gilbert mixer cell core...

  13. Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6

    NARCIS (Netherlands)

    Roozeboom, F.; Narayanan, V.; Kakushima, K.; Timans, P.J.; Gusev, E.P.; Karim, Z.; Gendt, S. De

    2016-01-01

    The topics of this annual symposium continue to describe the evolution of traditional scaling in CMOS integrated circuit manufacturing (More Moore for short), combined with the opportunities from growing diversification and embedded functionality (More than Moore). Once again, the main objective was

  14. 78 FR 35051 - Certain Encapsulated Integrated Circuit Devices and Products Containing Same; Commission...

    Science.gov (United States)

    2013-06-11

    ...., Washington, DC 20436, telephone (202) 205-3115. Copies of non- confidential documents filed in connection... encapsulated integrated circuit devices and products containing same in connection with claims 1-4, 7, 17, 18... `277 patent are invalid under 35 U.S.C. 102(b) as anticipated by certain prior art references, but...

  15. Diffusion barriers for Cu metallisation in Si integrated circuits : deposition and related thin film properties

    NARCIS (Netherlands)

    van Nieuwkasteele-Bystrova, Svetlana Nikolajevna

    2004-01-01

    In modern integrated circuits with Cu interconnects a diffusion barrier is used between the dielectric and Cu in order to prevent diffusion of Cu through the dielectrics. The choice of such a barrier requires a material exploration and a study of the material reactivity with both Cu and the

  16. Development of high-performance printed organic field-effect transistors and integrated circuits.

    Science.gov (United States)

    Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

    2015-10-28

    Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

  17. Method and apparatus to debug an integrated circuit chip via synchronous clock stop and scan

    Science.gov (United States)

    Bellofatto, Ralph E [Ridgefield, CT; Ellavsky, Matthew R [Rochester, MN; Gara, Alan G [Mount Kisco, NY; Giampapa, Mark E [Irvington, NY; Gooding, Thomas M [Rochester, MN; Haring, Rudolf A [Cortlandt Manor, NY; Hehenberger, Lance G [Leander, TX; Ohmacht, Martin [Yorktown Heights, NY

    2012-03-20

    An apparatus and method for evaluating a state of an electronic or integrated circuit (IC), each IC including one or more processor elements for controlling operations of IC sub-units, and each the IC supporting multiple frequency clock domains. The method comprises: generating a synchronized set of enable signals in correspondence with one or more IC sub-units for starting operation of one or more IC sub-units according to a determined timing configuration; counting, in response to one signal of the synchronized set of enable signals, a number of main processor IC clock cycles; and, upon attaining a desired clock cycle number, generating a stop signal for each unique frequency clock domain to synchronously stop a functional clock for each respective frequency clock domain; and, upon synchronously stopping all on-chip functional clocks on all frequency clock domains in a deterministic fashion, scanning out data values at a desired IC chip state. The apparatus and methodology enables construction of a cycle-by-cycle view of any part of the state of a running IC chip, using a combination of on-chip circuitry and software.

  18. Integrated Circuit Conception: A Wire Optimization Technic Reducing Interconnection Delay in Advanced Technology Nodes

    Directory of Open Access Journals (Sweden)

    Mohammed Darmi

    2017-10-01

    Full Text Available As we increasingly use advanced technology nodes to design integrated circuits (ICs, physical designers and electronic design automation (EDA providers are facing multiple challenges, firstly, to honor all physical constraints coming with cutting-edge technologies and, secondly, to achieve expected quality of results (QoR. An advanced technology should be able to bring better performances with minimum cost whatever the complexity. A high effort to develop out-of-the-box optimization techniques is more than needed. In this paper, we will introduce a new routing technique, with the objective to optimize timing, by only acting on routing topology, and without impacting the IC Area. In fact, the self-aligned double patterning (SADP technology offers an important difference on layer resistance between SADP and No-SADP layers; this property will be taken as an advantage to drive the global router to use No-SADP less resistive layers for critical nets. To prove the benefit on real test cases, we will use Mentor Graphics’ physical design EDA tool Nitro-SoC™ and several 7 nm technology node designs. The experiments show that worst negative slack (WNS and total negative slack (TNS improved up to 13% and 56%, respectively, compared to the baseline flow.

  19. Electronic circuits for recording signals from drift chambers of a neutrino calorimeter

    International Nuclear Information System (INIS)

    Bushnin, Yu.B.; Isaev, A.N.; Konoplyannikov, A.K.; Marchikhin, N.K.; Sen'ko, V.A.

    1985-01-01

    Electronic circuits for data acquisition from the system of neutrino calorimeter drift chambers are described. The equipment contains forming amplifiers, 24-input moduli of time-to-digital converters providing the quantization of 10 ns per a count and a computer-controlled timing generator. The system equipment for 1500 signal wires are located in 8 ''Vector'' crates and provide recording of up to 64 singnals from each drift chamber plane during one accelerator beam extraction period

  20. Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

    Directory of Open Access Journals (Sweden)

    Yefimenko A. A.

    2014-12-01

    Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

  1. Integrated Silicon Carbide Power Electronic Block

    Energy Technology Data Exchange (ETDEWEB)

    Radhakrishnan, Rahul [Global Power Technologies Group, Inc., Lake Forest, CA (United States)

    2017-11-07

    Research involved in this project is aimed at monolithically integrating an anti-parallel diode to the SiC MOSFET switch, so as to avoid having to use an external anti-parallel diode in power circuit applications. SiC MOSFETs are replacing Si MOSFETs and IGBTs in many applications, yet the high bandgap of the body diode in SiC MOSFET and consequent need for an external anti-parallel diode increases costs and discourages circuit designers from adopting this technology. Successful demonstration and subsequent commercialization of this technology would reduce SiC MOSFET cost and additionally reduce component count as well as other costs at the power circuit level. In this Phase I project, we have created multiple device designs, set up a process for device fabrication at the 150mm SiC foundry XFAB Texas, demonstrated unit-processes for device fabrication in short loops and started full flow device fabrication. Key findings of the development activity were: The limits of coverage of photoresist over the topology of thick polysilicon structures covered with oxide, which required larger feature dimensions to overcome; and The insufficient process margin for removing oxide spacers from polysilicon field ring features which could result in loss of some features without further process development No fundamental obstacles were uncovered during the process development. Given sufficient time for additional development it is likely that processes could be tuned to realize the monolithically integrated SiC JBS diode and MOSFET. Sufficient funds were not available in this program to resolve processing difficulties and fabricate the devices.

  2. CMOS-based carbon nanotube pass-transistor logic integrated circuits

    Science.gov (United States)

    Ding, Li; Zhang, Zhiyong; Liang, Shibo; Pei, Tian; Wang, Sheng; Li, Yan; Zhou, Weiwei; Liu, Jie; Peng, Lian-Mao

    2012-01-01

    Field-effect transistors based on carbon nanotubes have been shown to be faster and less energy consuming than their silicon counterparts. However, ensuring these advantages are maintained for integrated circuits is a challenge. Here we demonstrate that a significant reduction in the use of field-effect transistors can be achieved by constructing carbon nanotube-based integrated circuits based on a pass-transistor logic configuration, rather than a complementary metal-oxide semiconductor configuration. Logic gates are constructed on individual carbon nanotubes via a doping-free approach and with a single power supply at voltages as low as 0.4 V. The pass-transistor logic configurarion provides a significant simplification of the carbon nanotube-based circuit design, a higher potential circuit speed and a significant reduction in power consumption. In particular, a full adder, which requires a total of 28 field-effect transistors to construct in the usual complementary metal-oxide semiconductor circuit, uses only three pairs of n- and p-field-effect transistors in the pass-transistor logic configuration. PMID:22334080

  3. A Fast Classification Method of Faults in Power Electronic Circuits Based on Support Vector Machines

    Directory of Open Access Journals (Sweden)

    Cui Jiang

    2017-12-01

    Full Text Available Fault detection and location are important and front-end tasks in assuring the reliability of power electronic circuits. In essence, both tasks can be considered as the classification problem. This paper presents a fast fault classification method for power electronic circuits by using the support vector machine (SVM as a classifier and the wavelet transform as a feature extraction technique. Using one-against-rest SVM and one-against-one SVM are two general approaches to fault classification in power electronic circuits. However, these methods have a high computational complexity, therefore in this design we employ a directed acyclic graph (DAG SVM to implement the fault classification. The DAG SVM is close to the one-against-one SVM regarding its classification performance, but it is much faster. Moreover, in the presented approach, the DAG SVM is improved by introducing the method of Knearest neighbours to reduce some computations, so that the classification time can be further reduced. A rectifier and an inverter are demonstrated to prove effectiveness of the presented design.

  4. Design of a Negative Differential Resistance Circuit Element Using Single-Electron Transistors

    Science.gov (United States)

    Dixon, D. C.; Heij, C. P.; Hadley, P.; Mooij, J. E.

    1998-03-01

    Electronic circuit elements displaying negative differential resistance (NDR), such as tunnel diodes, have a wide variety of device applications, including oscillators, amplifiers, logic, and memory. We present a two-terminal device using two single-electron transistors (SET's) that demonstrates an NDR profile tuneable with gate voltages. If the capacitive coupling between the SET's is sufficiently larger than the junction capacitances, the device exhibits multiply-peaked NDR, allowing its use as a multi-valued digital element. We will also report recent experimental progress in measurements of such a device, fabricated using standard Al tunnel junctions, but with an additional overlap capacitor to allow the required inter-SET coupling.

  5. High-voltage integrated transmitting circuit with differential driving for CMUTs

    DEFF Research Database (Denmark)

    Llimos Muntal, Pere; Larsen, Dennis Øland; Færch, Kjartan Ullitz

    2016-01-01

    In this paper, a high-voltage integrated differential transmitting circuit for capacitive micromachined ultrasonic transducers (CMUTs) used in portable ultrasound scanners is presented. Due to its application, area and power consumption are critical and need to be minimized. The circuitry...... pulses at differential voltage levels of 60, 80 and 100 V, a frequency up to 5 MHz and a measured driving strength of 2.03 V/ns with the CMUT electrical model connected. The total on-chip area occupied by the transmitting circuit is 0.18 mm2 and the power consumption at the ultrasound scanner operation...

  6. Measurements of complex impedance in microwave high power systems with a new bluetooth integrated circuit.

    Science.gov (United States)

    Roussy, Georges; Dichtel, Bernard; Chaabane, Haykel

    2003-01-01

    By using a new integrated circuit, which is marketed for bluetooth applications, it is possible to simplify the method of measuring the complex impedance, complex reflection coefficient and complex transmission coefficient in an industrial microwave setup. The Analog Devices circuit AD 8302, which measures gain and phase up to 2.7 GHz, operates with variable level input signals and is less sensitive to both amplitude and frequency fluctuations of the industrial magnetrons than are mixers and AM crystal detectors. Therefore, accurate gain and phase measurements can be performed with low stability generators. A mechanical setup with an AD 8302 is described; the calibration procedure and its performance are presented.

  7. Calculus of the radical integrals in electrons

    International Nuclear Information System (INIS)

    Soto Vargas, C.W.

    1996-01-01

    The radial integrals which arise from the distorted wave treatment of photon emission processes in electron and positron scattering, involve products of the electron's (or positron's) in going and outgoing wave functions and the radial part of the electromagnetic Green's function. They can be performed analytically for point Dirac-Coulomb wave functions, but are difficult to evaluate because they involve slowly converging doubly infinite series. We present a discussion and review of the formulation and methods employed to calculate these basic integral at a given value of the energy transferred. (author) [es

  8. Micromachined piezoresistive inclinometer with oscillator-based integrated interface circuit and temperature readout

    Science.gov (United States)

    Dalola, Simone; Ferrari, Vittorio; Marioli, Daniele

    2012-03-01

    In this paper a dual-chip system for inclination measurement is presented. It consists of a MEMS (microelectromechanical system) piezoresistive accelerometer manufactured in silicon bulk micromachining and a CMOS (complementary metal oxide semiconductor) ASIC (application specific integrated circuit) interface designed for resistive-bridge sensors. The sensor is composed of a seismic mass symmetrically suspended by means of four flexure beams that integrate two piezoresistors each to detect the applied static acceleration, which is related to inclination with respect to the gravity vector. The ASIC interface is based on a relaxation oscillator where the frequency and the duty cycle of a rectangular-wave output signal are related to the fractional bridge imbalance and the overall bridge resistance of the sensor, respectively. The latter is a function of temperature; therefore the sensing element itself can be advantageously used to derive information for its own thermal compensation. DC current excitation of the sensor makes the configuration unaffected by wire resistances and parasitic capacitances. Therefore, a modular system results where the sensor can be placed remotely from the electronics without suffering accuracy degradation. The inclination measurement system has been characterized as a function of the applied inclination angle at different temperatures. At room temperature, the experimental sensitivity of the system results in about 148 Hz/g, which corresponds to an angular sensitivity around zero inclination angle of about 2.58 Hz deg-1. This is in agreement with finite element method simulations. The measured output fluctuations at constant temperature determine an equivalent resolution of about 0.1° at midrange. In the temperature range of 25-65 °C the system sensitivity decreases by about 10%, which is less than the variation due to the microsensor alone thanks to thermal compensation provided by the current excitation of the bridge and the positive

  9. Microfluidic valve array control system integrating a fluid demultiplexer circuit

    International Nuclear Information System (INIS)

    Kawai, Kentaro; Shoji, Shuichi; Arima, Kenta; Morita, Mizuho

    2015-01-01

    This paper proposes an efficient control method for the large-scale integration of microvalves in microfluidic systems. The proposed method can control 2 n individual microvalves with 2n + 2 control lines (where n is an integer). The on-chip valves are closed by applying pressure to a control line, similar to conventional pneumatic microvalves. Another control line closes gate valves between the control line to the on-chip valves and the on-chip valves themselves, to preserve the state of the on-chip valves. The remaining control lines select an activated gate valve. While the addressed gate valve is selected by the other control lines, the corresponding on-chip valve is actuated by applying input pressure to the control line to the on-chip valves. Using this method would substantially reduce the number of world-to-chip connectors and off-chip valve controllers. Experiments conducted using a fabricated 2 8 microvalve array device, comprising 256 individual on-chip valves controlled with 18 (2   ×   8 + 2) control lines, yielded switching speeds for the selected on-chip valve under 90 ms. (paper)

  10. Integrated CMOS photodetectors and signal processing for very low-level chemical sensing with the bioluminescent bioreporter integrated circuit

    Science.gov (United States)

    Bolton, Eric K.; Sayler, Gary S.; Nivens, David E.; Rochelle, James M.; Ripp, Steven; Simpson, Michael L.

    2002-01-01

    We report an integrated CMOS microluminometer optimized for the detection of low-level bioluminescence as part of the bioluminescent bioreporter integrated circuit (BBIC). This microluminometer improves on previous devices through careful management of the sub-femtoampere currents, both signal and leakage, that flow in the front-end processing circuitry. In particular, the photodiode is operated with a reverse bias of only a few mV, requiring special attention to the reset circuitry of the current-to-frequency converter (CFC) that forms the front-end circuit. We report a sub-femtoampere leakage current and a minimum detectable signal (MDS) of 0.15 fA (1510 s integration time) using a room temperature 1.47 mm2 CMOS photodiode. This microluminometer can detect luminescence from as few as 5000 fully induced Pseudomonas fluorescens 5RL bacterial cells. c2002 Elsevier Science B.V. All rights reserved.

  11. Towards Large-Scale Fast Reprogrammable SOA-Based Photonic Integrated Switch Circuits

    Directory of Open Access Journals (Sweden)

    Ripalta Stabile

    2017-09-01

    Full Text Available Due to the exponentially increasing connectivity and bandwidth demand from the Internet, the most advanced examples of medium-scale fast reconfigurable photonic integrated switch circuits are offered by research carried out for data- and computer-communication applications, where network flexibility at a high speed and high connectivity are provided to suit network demand. Recently we have prototyped optical switching circuits using monolithic integration technology with up to several hundreds of integrated optical components per chip for high connectivity. In this paper, the current status of fast reconfigurable medium-scale indium phosphide (InP integrated photonic switch matrices based on the use of semiconductor optical amplifier (SOA gates is reviewed, focusing on broadband and cross-connecting monolithic implementations, granting a connectivity of up to sixteen input ports, sixteen output ports, and sixty-four channels, respectively. The opportunities for increasing connectivity, enabling nanosecond order reconfigurability, and introducing distributed optical power monitoring at the physical layer are highlighted. Complementary architecture based on resonant switching elements on the same material platform are also discussed for power efficient switching. Performance projections related to the physical layer are presented and strategies for improvements are discussed in view of opening a route towards large-scale power efficient fast reprogrammable photonic integrated switching circuits.

  12. CMOS Integrated Lock-in Readout Circuit for FET Terahertz Detectors

    Science.gov (United States)

    Domingues, Suzana; Perenzoni, Daniele; Perenzoni, Matteo; Stoppa, David

    2017-06-01

    In this paper, a switched-capacitor readout circuit topology integrated with a THz antenna and field-effect transistor detector is analyzed, designed, and fabricated in a 0.13-μm standard CMOS technology. The main objective is to perform amplification and filtering of the signal, as well as subtraction of background in case of modulated source, in order to avoid the need for an external lock-in amplifier, in a compact implementation. A maximum responsivity of 139.7 kV/W, and a corresponding minimum NEP of 2.2 nW/√Hz, was obtained with a two-stage readout circuit at 1 kHz modulation frequency. The presented switched-capacitor circuit is suitable for implementation in pixel arrays due to its compact size and power consumption (0.014 mm2 and 36 μW).

  13. Test and verification of a reactor protection system application-specific integrated circuit

    International Nuclear Information System (INIS)

    Battle, R.E.; Turner, G.W.; Vandermolen, R.I.; Vitalbo, C.

    1997-01-01

    Application-specific integrated circuits (ASICs) were utilized in the design of nuclear plant safety systems because they have certain advantages over software-based systems and analog-based systems. An advantage they have over software-based systems is that an ASIC design can be simple enough to not include branch statements and also can be thoroughly tested. A circuit card on which an ASIC is mounted can be configured to replace various versions of older analog equipment with fewer design types required. The approach to design and testing of ASICs for safety system applications is discussed in this paper. Included are discussions of the ASIC architecture, how it is structured to assist testing, and of the functional and enhanced circuit testing

  14. Moving the boundary between wavelength resources in optical packet and circuit integrated ring network.

    Science.gov (United States)

    Furukawa, Hideaki; Miyazawa, Takaya; Wada, Naoya; Harai, Hiroaki

    2014-01-13

    Optical packet and circuit integrated (OPCI) networks provide both optical packet switching (OPS) and optical circuit switching (OCS) links on the same physical infrastructure using a wavelength multiplexing technique in order to deal with best-effort services and quality-guaranteed services. To immediately respond to changes in user demand for OPS and OCS links, OPCI networks should dynamically adjust the amount of wavelength resources for each link. We propose a resource-adjustable hybrid optical packet/circuit switch and transponder. We also verify that distributed control of resource adjustments can be applied to the OPCI ring network testbed we developed. In cooperation with the resource adjustment mechanism and the hybrid switch and transponder, we demonstrate that automatically allocating a shared resource and moving the wavelength resource boundary between OPS and OCS links can be successfully executed, depending on the number of optical paths in use.

  15. Automated electronic monitoring of circuit pressures during continuous renal replacement therapy: a technical report.

    Science.gov (United States)

    Zhang, Ling; Baldwin, Ian; Zhu, Guijun; Tanaka, Aiko; Bellomo, Rinaldo

    2015-03-01

    Automated electronic monitoring and analysis of circuit pressures during continuous renal replacement therapy (CRRT) has the potential to predict failure and allow intervention to optimise function. Current CRRT machines can measure and store pressure readings for downloading into databases and for analysis. We developed a procedure to obtain such data at intervals of 1 minute and analyse them using the Prismaflex CRRT machine, and we present an example of such analysis. We obtained data on pressures obtained at intervals of 1 minute in a patient with acute kidney injury and sepsis treated with continuous haemofiltration at 2 L/hour of ultrafiltration and a blood flow of 200 mL/minute. Data analysis identified progressive increases in transmembrane pressure (TMP) and prefilter pressure (PFP) from time 0 until 33 hours or clotting. TMP increased from 104 mmHg to 313 mmHg and PFP increased from from 131 mmHg to 185 mmHg. Effluent pressure showed a progressive increase in the negative pressure applied to achieve ultrafiltration from 0 mmHg to -168 mmHg. The inflection point for such changes was also identified. Blood pathway pressures for access and return remained unchanged throughout. Automated electronic monitoring of circuit pressure during CRRT is possible and provides useful information on the evolution of circuit clotting.

  16. Unexpected ICD pulse generator failure due to electronic circuit damage caused by electrical overstress.

    Science.gov (United States)

    Hauser, R G; Hayes, D L; Almquist, A K; Epstein, A E; Parsonnet, V; Tyers, G F; Vlay, S C; Schoenfeld, M H

    2001-07-01

    Because it is a lifesaving device, the unexpected failure of an ICD can be catastrophic. We report ICD electronic circuit failure due to electrical overstress damage (EOS) to the high voltage hybird circuit and other electronic components in a series of ICD pulse generator models. Data were obtained from the Multicenter Registry of Pacemaker and ICD Pacemaker and Lead Failures, and from the manufactures' adverse event reports, that were in the FDA's Manufacturer and User Facility Device Experience (MAUDE) database. Of 16 nonbattery Guidant/CPI ICD pulse generator failures reported to the registry, 6 (38%) have been confirmed by the manufacturer to be EOS related, and Guidant/CPI has reported 273 such failures to the FDA as of 12/29/00. The signs of failure included loss of telemetry and inability to deliver therapy, and some patients have experienced serious adverse events. Hybrid circuit damage may have occurred during capacitor charging or reform, and the majority appears to have happened during normal ICD function. While the incidence of this problem is unknown, a management strategy should be adopted that includes routine follow-up every 3 months and device evaluation after a shock or exposure to external defibrillation or electrosurgical devices. This study suggests that additional data are needed to determine the incidence of this problem, and that our present methods for monitoring the performance of ICD's following market release are inadequate.

  17. Design and analysis of CMOS single photon counting avalanche photodiodes integrated with active quenching circuits

    International Nuclear Information System (INIS)

    Kim, Kwang Hyun; Kim, Young Soo

    2008-01-01

    The CMOS SPADs (Single Photon Avalanche Diodes) integrated with active quenching circuits were fabricated on same chip using AMIS 0.7 μm high voltage CMOS process without any process modifications. The SPADs have N+/P-substrate structure and their diameter of photo sensing area are 25 μm, 50 μm, 100 μm, 400 μm, and 800 μm. The avalanche multiplication is occurred at 10.7 V, and the photocurrent gain at 11 V reverse bias voltage is about 1000. In zero bias condition, the maximum quantum efficiency appears at 650 nm wavelength, and it corresponds to around 30%. The active quenching circuit is composed to a comparator, three monostable, and two MOS switch. As a circuit simulation results, the comparator and the monostable generate ∼22 nsec and ∼1 nsec delayed output pulse, respectively. The dead time of the active quenching circuits integrated with SPADs is about 100 nsec as a measured result. (author)

  18. Polymer optical circuits technology for large-scale integration of passive functions

    Science.gov (United States)

    Maalouf, Azar; Bosc, Dominique; Henrio, Frédéric; Haesaert, Séverine; Grosso, Philippe; Hardy, Isabelle; Gadonna, Michel

    2006-04-01

    Polymers are attractive to realize integrated circuits specially because they are very simple to process and are promising for low cost devices. Moreover, beside low cost technology, the large possible range of refractive index, could lead to large scale of integration, lowering the fabrication costs. In some cases, it could be an alternative solution to semiconductor or inorganic dielectric technologies. With usual UV photolithography technology, this work shows that it is possible to perform small guides in order to provide relatively high circuit densification. The refractive index contrast, between optical core and cladding, can be as high as 0.07 instead of 0.02 for the higher contrast in silica Ge doped waveguides. Recently, this contrast has been increased to 0.11 at the wavelength of 1550nm. These materials make possible the patterning of guides having radius of curvature smaller than 200μm. Such curvatures open the way to functions based on microrings that potentially lead to compact wavelength multiplexers. With the view to control the fabrication of polymer waveguides, some features of the process are reported here. For example, shortcomings such as unsuitable film worm aspects are described and solutions are given with requirements assigned to rough materials. Mechanical and thermal properties of polymers have to be adjusted to withstand integrated circuit processing. This paper also presents results concerning the realization of integrated passive microring resonators with this technology.

  19. Inverter Circuits Using ZnO Nanoparticle Based Thin-Film Transistors for Flexible Electronic Applications.

    Science.gov (United States)

    Vidor, Fábio F; Meyers, Thorsten; Hilleringmann, Ulrich

    2016-08-23

    Innovative systems exploring the flexibility and the transparency of modern semiconducting materials are being widely researched by the scientific community and by several companies. For a low-cost production and large surface area applications, thin-film transistors (TFTs) are the key elements driving the system currents. In order to maintain a cost efficient integration process, solution based materials are used as they show an outstanding tradeoff between cost and system complexity. In this paper, we discuss the integration process of ZnO nanoparticle TFTs using a high- k resin as gate dielectric. The performance in dependence on the transistor structure has been investigated, and inverted staggered setups depict an improved performance over the coplanar device increasing both the field-effect mobility and the I ON / I OFF ratio. Aiming at the evaluation of the TFT characteristics for digital circuit applications, inverter circuits using a load TFT in the pull-up network and an active TFT in the pull-down network were integrated. The inverters show reasonable switching characteristics and V / V gains. Conjointly, the influence of the geometry ratio and the supply voltage on the devices have been analyzed. Moreover, as all integration steps are suitable to polymeric templates, the fabrication process is fully compatible to flexible substrates.

  20. Inverter Circuits Using ZnO Nanoparticle Based Thin-Film Transistors for Flexible Electronic Applications

    Directory of Open Access Journals (Sweden)

    Fábio F. Vidor

    2016-08-01

    Full Text Available Innovative systems exploring the flexibility and the transparency of modern semiconducting materials are being widely researched by the scientific community and by several companies. For a low-cost production and large surface area applications, thin-film transistors (TFTs are the key elements driving the system currents. In order to maintain a cost efficient integration process, solution based materials are used as they show an outstanding tradeoff between cost and system complexity. In this paper, we discuss the integration process of ZnO nanoparticle TFTs using a high-k resin as gate dielectric. The performance in dependence on the transistor structure has been investigated, and inverted staggered setups depict an improved performance over the coplanar device increasing both the field-effect mobility and the ION/IOFF ratio. Aiming at the evaluation of the TFT characteristics for digital circuit applications, inverter circuits using a load TFT in the pull-up network and an active TFT in the pull-down network were integrated. The inverters show reasonable switching characteristics and V/V gains. Conjointly, the influence of the geometry ratio and the supply voltage on the devices have been analyzed. Moreover, as all integration steps are suitable to polymeric templates, the fabrication process is fully compatible to flexible substrates.

  1. Synchronisation, electronic circuit implementation, and fractional-order analysis of 5D ordinary differential equations with hidden hyperchaotic attractors

    Science.gov (United States)

    Wei, Zhouchao; Rajagopal, Karthikeyan; Zhang, Wei; Kingni, Sifeu Takougang; Akgül, Akif

    2018-04-01

    Hidden hyperchaotic attractors can be generated with three positive Lyapunov exponents in the proposed 5D hyperchaotic Burke-Shaw system with only one stable equilibrium. To the best of our knowledge, this feature has rarely been previously reported in any other higher-dimensional systems. Unidirectional linear error feedback coupling scheme is used to achieve hyperchaos synchronisation, which will be estimated by using two indicators: the normalised average root-mean squared synchronisation error and the maximum cross-correlation coefficient. The 5D hyperchaotic system has been simulated using a specially designed electronic circuit and viewed on an oscilloscope, thereby confirming the results of the numerical integration. In addition, fractional-order hidden hyperchaotic system will be considered from the following three aspects: stability, bifurcation analysis and FPGA implementation. Such implementations in real time represent hidden hyperchaotic attractors with important consequences for engineering applications.

  2. Analysis of surface insulation resistance related failures in electronics by circuit simulation

    DEFF Research Database (Denmark)

    Verdingovas, Vadimas; Joshy, Salil; Jellesen, Morten Stendahl

    2017-01-01

    of the circuits using a range of empirical leakage resistance values combined with the knowledge of the humidity and contamination profile of the electronics can be used for the robust design of a device, which is also important for electronic products relying on low current consumption for long battery lifetime......Purpose-The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed...... conduction medium. Findings-This paper provides a summary of the effects of contamination with various weak organic acids representing the active components in no-clean solder flux residue, and demonstrates the effect of humidity and contamination on the possible malfunctions and errors in electronic...

  3. Localization and Imaging of Integrated Circuit Defect Using Simple Optical Feedback Detection

    Directory of Open Access Journals (Sweden)

    Vernon Julius Cemine

    2004-12-01

    Full Text Available High-contrast microscopy of semiconductor and metal edifices in integrated circuits is demonstrated by combining laser-scanning confocal reflectance microscopy, one-photon optical-beam-induced current (1P-OBIC imaging, and optical feedback detection via a commercially available semiconductor laser that also serves as the excitation source. The confocal microscope has a compact in-line arrangement with no external photodetector. Confocal and 1P-OBIC images are obtained simultaneously from the same focused beam that is scanned across the sample plane. Image pairs are processed to generate exclusive high-contrast distributions of the semiconductor, metal, and dielectric sites in a GaAs photodiode array sample. The method is then utilized to demonstrate defect localization and imaging in an integrated circuit.

  4. Silicon photonic integrated circuits with electrically programmable non-volatile memory functions.

    Science.gov (United States)

    Song, J-F; Lim, A E-J; Luo, X-S; Fang, Q; Li, C; Jia, L X; Tu, X-G; Huang, Y; Zhou, H-F; Liow, T-Y; Lo, G-Q

    2016-09-19

    Conventional silicon photonic integrated circuits do not normally possess memory functions, which require on-chip power in order to maintain circuit states in tuned or field-configured switching routes. In this context, we present an electrically programmable add/drop microring resonator with a wavelength shift of 426 pm between the ON/OFF states. Electrical pulses are used to control the choice of the state. Our experimental results show a wavelength shift of 2.8 pm/ms and a light intensity variation of ~0.12 dB/ms for a fixed wavelength in the OFF state. Theoretically, our device can accommodate up to 65 states of multi-level memory functions. Such memory functions can be integrated into wavelength division mutiplexing (WDM) filters and applied to optical routers and computing architectures fulfilling large data downloading demands.

  5. High-dimensional quantum key distribution based on multicore fiber using silicon photonic integrated circuits

    DEFF Research Database (Denmark)

    Ding, Yunhong; Bacco, Davide; Dalgaard, Kjeld

    2017-01-01

    is intrinsically limited to 1 bit/photon. Here we propose and experimentally demonstrate, for the first time, a high-dimensional quantum key distribution protocol based on space division multiplexing in multicore fiber using silicon photonic integrated lightwave circuits. We successfully realized three mutually......-dimensional quantum states, and enables breaking the information efficiency limit of traditional quantum key distribution protocols. In addition, the silicon photonic circuits used in our work integrate variable optical attenuators, highly efficient multicore fiber couplers, and Mach-Zehnder interferometers, enabling...... manipulating high-dimensional quantum states in a compact and stable manner. Our demonstration paves the way to utilize state-of-the-art multicore fibers for noise tolerance high-dimensional quantum key distribution, and boost silicon photonics for high information efficiency quantum communications....

  6. Advances in gallium arsenide monolithic microwave integrated-circuit technology for space communications systems

    Science.gov (United States)

    Bhasin, K. B.; Connolly, D. J.

    1986-01-01

    Future communications satellites are likely to use gallium arsenide (GaAs) monolithic microwave integrated-circuit (MMIC) technology in most, if not all, communications payload subsystems. Multiple-scanning-beam antenna systems are expected to use GaAs MMIC's to increase functional capability, to reduce volume, weight, and cost, and to greatly improve system reliability. RF and IF matrix switch technology based on GaAs MMIC's is also being developed for these reasons. MMIC technology, including gigabit-rate GaAs digital integrated circuits, offers substantial advantages in power consumption and weight over silicon technologies for high-throughput, on-board baseband processor systems. In this paper, current developments in GaAs MMIC technology are described, and the status and prospects of the technology are assessed.

  7. A multi-ring optical packet and circuit integrated network with optical buffering.

    Science.gov (United States)

    Furukawa, Hideaki; Shinada, Satoshi; Miyazawa, Takaya; Harai, Hiroaki; Kawasaki, Wataru; Saito, Tatsuhiko; Matsunaga, Koji; Toyozumi, Tatuya; Wada, Naoya

    2012-12-17

    We newly developed a 3 × 3 integrated optical packet and circuit switch-node. Optical buffers and burst-mode erbium-doped fiber amplifiers with the gain flatness are installed in the 3 × 3 switch-node. The optical buffer can prevent packet collisions and decrease packet loss. We constructed a multi-ring optical packet and circuit integrated network testbed connecting two single-ring networks and a client network by the 3 × 3 switch-node. For the first time, we demonstrated 244 km fiber transmission and 5-node hopping of multiplexed 14-wavelength 10 Gbps optical paths and 100 Gbps optical packets encapsulating 10 Gigabit Ethernet frames on the testbed. Error-free (frame error rate optical packets of various packet lengths. In addition, successful avoidance of packet collisions by optical buffers was confirmed.

  8. Advanced field-solver techniques for RC extraction of integrated circuits

    CERN Document Server

    Yu, Wenjian

    2014-01-01

    Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering, as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of ...

  9. Risk assessment of integrated electronic health records.

    Science.gov (United States)

    Bjornsson, Bjarni Thor; Sigurdardottir, Gudlaug; Stefansson, Stefan Orri

    2010-01-01

    The paper describes the security concerns related to Electronic Health Records (EHR) both in registration of data and integration of systems. A description of the current state of EHR systems in Iceland is provided, along with the Ministry of Health's future vision and plans. New legislation provides the opportunity for increased integration of EHRs and further collaboration between institutions. Integration of systems, along with greater availability and access to EHR data, requires increased security awareness since additional risks are introduced. The paper describes the core principles of information security as it applies to EHR systems and data. The concepts of confidentiality, integrity, availability, accountability and traceability are introduced and described. The paper discusses the legal requirements and importance of performing risk assessment for EHR data. Risk assessment methodology according to the ISO/IEC 27001 information security standard is described with examples on how it is applied to EHR systems.

  10. Integrated genomic and gene expression profiling identifies two major genomic circuits in urothelial carcinoma.

    Directory of Open Access Journals (Sweden)

    David Lindgren

    Full Text Available Similar to other malignancies, urothelial carcinoma (UC is characterized by specific recurrent chromosomal aberrations and gene mutations. However, the interconnection between specific genomic alterations, and how patterns of chromosomal alterations adhere to different molecular subgroups of UC, is less clear. We applied tiling resolution array CGH to 146 cases of UC and identified a number of regions harboring recurrent focal genomic amplifications and deletions. Several potential oncogenes were included in the amplified regions, including known oncogenes like E2F3, CCND1, and CCNE1, as well as new candidate genes, such as SETDB1 (1q21, and BCL2L1 (20q11. We next combined genome profiling with global gene expression, gene mutation, and protein expression data and identified two major genomic circuits operating in urothelial carcinoma. The first circuit was characterized by FGFR3 alterations, overexpression of CCND1, and 9q and CDKN2A deletions. The second circuit was defined by E3F3 amplifications and RB1 deletions, as well as gains of 5p, deletions at PTEN and 2q36, 16q, 20q, and elevated CDKN2A levels. TP53/MDM2 alterations were common for advanced tumors within the two circuits. Our data also suggest a possible RAS/RAF circuit. The tumors with worst prognosis showed a gene expression profile that indicated a keratinized phenotype. Taken together, our integrative approach revealed at least two separate networks of genomic alterations linked to the molecular diversity seen in UC, and that these circuits may reflect distinct pathways of tumor development.

  11. Gallium Nitride Monolithic Microwave Integrated Circuit Designs Using 0.25-micro m Qorvo Process

    Science.gov (United States)

    2017-07-27

    ARL-TN-0836 ● July 2017 US Army Research Laboratory Gallium Nitride Monolithic Microwave Integrated Circuit Designs Using 0.25...findings in this report are not to be construed as an official Department of the Army position unless so designated by other authorized documents...Citation of manufacturer’s or trade names does not constitute an official endorsement or approval of the use thereof. Destroy this report when it is no

  12. Self-organized mapping of R&D activities: bibliometric cartography of integrated circuit design testing

    OpenAIRE

    A F J van Raan; J G M van der Velde

    1992-01-01

    An exploratory bibliometric analysis of an R&D field (integrated circuit design testing) had the aim of visualizing the field's knowledge structure, and changes over time. It used bibliometric cartography based on co-word analysis. The basic approach and its relation with self-organizing systems are outlined; this includes the techniques for defining the field, drawing on publications (there being few patents for inclusion). Copyright , Beech Tree Publishing.

  13. SiGe Integrated Circuit Developments for SQUID/TES Readout

    Science.gov (United States)

    Prêle, D.; Voisin, F.; Beillimaz, C.; Chen, S.; Piat, M.; Goldwurm, A.; Laurent, P.

    2018-03-01

    SiGe integrated circuits dedicated to the readout of superconducting bolometer arrays for astrophysics have been developed since more than 10 years at APC. Whether for Cosmic Microwave Background (CMB) observations with the QUBIC ground-based experiment (Aumont et al. in astro-ph.IM, 2016. arXiv:1609.04372) or for the Hot and Energetic Universe science theme with the X-IFU instrument on-board of the ATHENA space mission (Barret et al. in SPIE 9905, space telescopes & instrumentation 2016: UV to γ Ray, 2016. https://doi.org/10.1117/12.2232432), several kinds of Transition Edge Sensor (TES) (Irwin and Hilton, in ENSS (ed) Cryogenic particle detection, Springer, Berlin, 2005) arrays have been investigated. To readout such superconducting detector arrays, we use time or frequency domain multiplexers (TDM, FDM) (Prêle in JINST 10:C08015, 2016. https://doi.org/10.1088/1748-0221/10/08/C08015) with Superconducting QUantum Interference Devices (SQUID). In addition to the SQUID devices, low-noise biasing and amplification are needed. These last functions can be obtained by using BiCMOS SiGe technology in an Application Specific Integrated Circuit (ASIC). ASIC technology allows integration of highly optimised circuits specifically designed for a unique application. Moreover, we could reach very low-noise and wide band amplification using SiGe bipolar transistor either at room or cryogenic temperatures (Cressler in J Phys IV 04(C6):C6-101, 1994. https://doi.org/10.1051/jp4:1994616). This paper discusses the use of SiGe integrated circuits for SQUID/TES readout and gives an update of the last developments dedicated to the QUBIC telescope and to the X-IFU instrument. Both ASIC called SQmux128 and AwaXe are described showing the interest of such SiGe technology for SQUID multiplexer controls.

  14. Application-specific integrated circuit design for a typical pressurized water reactor pressure channel trip

    International Nuclear Information System (INIS)

    Battle, R.E.; Manges, W.W.; Emery, M.S.; Vendermolen, R.I.; Bhatt, S.

    1994-01-01

    This article discusses the use of application-specific integrated circuits (ASICs) in nuclear plant safety systems. ASICs have certain advantages over software-based systems because they can be simple enough to be thoroughly tested, and they can be tailored to replace existing equipment. An architecture to replace a pressurized water reactor pressure channel trip is presented. Methods of implementing digital algorithms are also discussed

  15. Basic Consecutive System Consisted of Design, Process and Estimation of a Fundamental Integrated Circuit Education System

    Science.gov (United States)

    Kataoka, Hiroyuki; Yamada, Akihiro; Kamizono, Hiroki; Ando, Hideyuki; Tanaka, Takeshi

    The progress of integrated-circuits technology in recent years has enabled a large performance-increase of system LSI. As it is needed long time to study the knowledge of the system LSI such as design, semiconductor process, and estimation of device, it is hard to study system LSI technology for company man and students. The basic consecutive system consisted of design, process and estimation of a fundamental IC system was studied.

  16. Interior Architectural Requirements for Electronic Circuits and its Applications Research Laboratory

    International Nuclear Information System (INIS)

    ElDib, A.A.

    2014-01-01

    This paper discusses the pivotal role of the Interior Architecture As one of the scientific disciplines minute to complete the Architectural Sciences, which relied upon the achievement and development of facilities containing scientific research laboratories, in terms of planning and design, particularly those containing biological laboratories using radioactive materials, adding to that, the application of the materials or raw materials commensurate with each discipline of laboratory and its work nature, and by the discussion the processing of design techniques and requirements of interior architecture dealing with Research Laboratory for electronic circuits and their applications with the making of its prototypes

  17. Robert Lacoste's the darker side practical applications for electronic design concepts from circuit cellar

    CERN Document Server

    Lacoste, Robert

    2009-01-01

    Robert Lacoste's The Darker Side column has quickly become a must read among Circuit Cellar devotees. His column provides readers with succinct theoretical concepts and practical applications on topics as far reaching as digital modulation to antenna basics. Difficult concepts are demystified as Robert shines a light on complex topics within electronic design.This book collects sixteen Darker Side articles that have been enriched with new, exclusive content from the author. An intro into The Darker Side will give examples of material that can enhance and optimize the way you design. A

  18. Numerical solution of stiff systems of ordinary differential equations with applications to electronic circuits

    Science.gov (United States)

    Rosenbaum, J. S.

    1971-01-01

    Systems of ordinary differential equations in which the magnitudes of the eigenvalues (or time constants) vary greatly are commonly called stiff. Such systems of equations arise in nuclear reactor kinetics, the flow of chemically reacting gas, dynamics, control theory, circuit analysis and other fields. The research reported develops an A-stable numerical integration technique for solving stiff systems of ordinary differential equations. The method, which is called the generalized trapezoidal rule, is a modification of the trapezoidal rule. However, the method is computationally more efficient than the trapezoidal rule when the solution of the almost-discontinuous segments is being calculated.

  19. Integrated cascade of photovoltaic cells as a power supply for integrated circuits

    NARCIS (Netherlands)

    Mouthaan, A.J.

    1984-01-01

    ICs can be powered directly when a supply voltage source capable of generating a multiple of the open circuit voltage of one pn-junction is available on a chip. Two schemes have been investigated for cascading photovoltaic cells on the chip. The structures can be made compatible with standard

  20. System Modeling of a MEMS Vibratory Gyroscope and Integration to Circuit Simulation.

    Science.gov (United States)

    Kwon, Hyukjin J; Seok, Seyeong; Lim, Geunbae

    2017-11-18

    Recently, consumer applications have dramatically created the demand for low-cost and compact gyroscopes. Therefore, on the basis of microelectromechanical systems (MEMS) technology, many gyroscopes have been developed and successfully commercialized. A MEMS gyroscope consists of a MEMS device and an electrical circuit for self-oscillation and angular-rate detection. Since the MEMS device and circuit are interactively related, the entire system should be analyzed together to design or test the gyroscope. In this study, a MEMS vibratory gyroscope is analyzed based on the system dynamic modeling; thus, it can be mathematically expressed and integrated into a circuit simulator. A behavioral simulation of the entire system was conducted to prove the self-oscillation and angular-rate detection and to determine the circuit parameters to be optimized. From the simulation, the operating characteristic according to the vacuum pressure and scale factor was obtained, which indicated similar trends compared with those of the experimental results. The simulation method presented in this paper can be generalized to a wide range of MEMS devices.

  1. Design of CMOS analog integrated fractional-order circuits applications in medicine and biology

    CERN Document Server

    Tsirimokou, Georgia; Elwakil, Ahmed

    2017-01-01

    This book describes the design and realization of analog fractional-order circuits, which are suitable for on-chip implementation, capable of low-voltage operation and electronic adjustment of their characteristics. The authors provide a brief introduction to fractional-order calculus, followed by design issues for fractional-order circuits of various orders and types. The benefits of this approach are demonstrated with current-mode and voltage-mode filter designs. Electronically tunable emulators of fractional-order capacitors and inductors are presented, where the behavior of the corresponding chips fabricated using the AMS 0.35um CMOS process has been experimentally verified. Applications of fractional-order circuits are demonstrated, including a pre-processing stage suitable for the implementation of the Pan-Tompkins algorithm for detecting the QRS complexes of an electrocardiogram (ECG), a fully tunable implementation of the Cole-Cole model used for the modeling of biological tissues, and a simple, non-i...

  2. External circuit integration with electromagnetic particle in cell modeling of plasma focus devices

    International Nuclear Information System (INIS)

    Seng, Y. S.; Lee, P.; Rawat, R. S.

    2015-01-01

    The pinch performance of a plasma focus (PF) device is sensitive to the physical conditions of the breakdown phase. It is therefore essential to model and study the initial phase in order to optimize device performance. An external circuit is self consistently coupled to the electromagnetic particle in cell code to model the breakdown and initial lift phase of the United Nations University/International Centre for Theoretical Physics (UNU-ICTP) plasma focus device. Gas breakdown during the breakdown phase is simulated successfully, following a drop in the applied voltage across the device and a concurrent substantial rise in the circuit current. As a result, the plasma becomes magnetized, with the growing value of the magnetic field over time leading to the gradual lift off of the well formed current sheath into the axial acceleration phase. This lifting off, with simultaneous outward sheath motion along the anode and vertical cathode, and the strong magnetic fields in the current sheath region, was demonstrated in this work, and hence validates our method of coupling the external circuit to PF devices. Our method produces voltage waveforms that are qualitatively similar to the observed experimental voltage profiles of the UNU-ICTP device. Values of the mean electron energy before and after voltage breakdown turned out to be different, with the values after breakdown being much lower. In both cases, the electron energy density function turned out to be non-Maxwellian

  3. Organic integrated circuits for information storage based on ambipolar polymers and charge injection engineering

    Science.gov (United States)

    Dell'Erba, Giorgio; Luzio, Alessandro; Natali, Dario; Kim, Juhwan; Khim, Dongyoon; Kim, Dong-Yu; Noh, Yong-Young; Caironi, Mario

    2014-04-01

    Ambipolar semiconducting polymers, characterized by both high electron (μe) and hole (μh) mobility, offer the advantage of realizing complex complementary electronic circuits with a single semiconducting layer, deposited by simple coating techniques. However, to achieve complementarity, one of the two conduction paths in transistors has to be suppressed, resulting in unipolar devices. Here, we adopt charge injection engineering through a specific interlayer in order to tune injection into frontier energy orbitals of a high mobility donor-acceptor co-polymer. Starting from field-effect transistors with Au contacts, showing a p-type unbalanced behaviour with μh = 0.29 cm2/V s and μe = 0.001 cm2/V s, through the insertion of a caesium salt interlayer with optimized thickness, we obtain an n-type unbalanced transistor with μe = 0.12 cm2/V s and μh = 8 × 10-4 cm2/V s. We applied this result to the development of the basic pass-transistor logic building blocks such as inverters, with high gain and good noise margin, and transmission-gates. In addition, we developed and characterized information storage circuits like D-Latches and D-Flip-Flops consisting of 16 transistors, demonstrating both their static and dynamic performances and thus the suitability of this technology for more complex circuits such as display addressing logic.

  4. CMOS analog circuit design

    CERN Document Server

    Allen, Phillip E

    1987-01-01

    This text presents the principles and techniques for designing analog circuits to be implemented in a CMOS technology. The level is appropriate for seniors and graduate students familiar with basic electronics, including biasing, modeling, circuit analysis, and some familiarity with frequency response. Students learn the methodology of analog integrated circuit design through a hierarchically-oriented approach to the subject that provides thorough background and practical guidance for designing CMOS analog circuits, including modeling, simulation, and testing. The authors' vast industrial experience and knowledge is reflected in the circuits, techniques, and principles presented. They even identify the many common pitfalls that lie in the path of the beginning designer--expert advice from veteran designers. The text mixes the academic and practical viewpoints in a treatment that is neither superficial nor overly detailed, providing the perfect balance.

  5. Few-Electron Ultrastrong Light-Matter Coupling in a Quantum LC Circuit

    Directory of Open Access Journals (Sweden)

    Yanko Todorov

    2014-11-01

    Full Text Available The phenomenon of ultrastrong light-matter interaction of a two-dimensional electron gas within a lumped element electronic circuit resonator is explored. The gas is coupled through the oscillating electric field of the capacitor, and in the limit of very small capacitor volumes, the total number of electrons of the system can be reduced to only a few. One of the peculiar features of our quantum mechanical system is that its Hamiltonian evolves from the fermionic Rabi model to the bosonic Hopfield model for light-matter coupling as the number of electrons is increased. We show that the Dicke states, introduced to describe the atomic super-radiance, are the natural base to describe the crossover between the two models. Furthermore, we illustrate how the ultrastrong coupling regime in the system and the associated antiresonant terms of the quantum Hamiltonian have a fundamentally different impact in the fermionic and bosonic cases. In the intermediate regime, our system behaves like a multilevel quantum bit with nonharmonic energy spacing, owing to the particle-particle interactions. Such a system can be inserted into a technological semiconductor platform, thus opening interesting perspectives for electronic devices where the readout of quantum electrodynamical properties is obtained via the measure of a DC current.

  6. The functional significance of newly born neurons integrated into olfactory bulb circuits

    Directory of Open Access Journals (Sweden)

    Masayuki eSakamoto

    2014-05-01

    Full Text Available The olfactory bulb (OB is the first central processing center for olfactory information connecting with higher areas in the brain, and this neuronal circuitry mediates a variety of odor-evoked behavioral responses. In the adult mammalian brain, continuous neurogenesis occurs in two restricted regions, the subventricular zone (SVZ of the lateral ventricle and the hippocampal dentate gyrus. New neurons born in the SVZ migrate through the rostral migratory stream and are integrated into the neuronal circuits of the OB throughout life. The significance of this continuous supply of new neurons in the OB has been implicated in plasticity and memory regulation. Two decades of huge investigation in adult neurogenesis revealed the biological importance of integration of new neurons into the olfactory circuits. In this review, we highlight the recent findings about the physiological functions of newly generated neurons in rodent OB circuits and then discuss the contribution of neurogenesis in the brain function. Finally, we introduce cutting edge technologies to monitor and manipulate the activity of new neurons.

  7. A contact lens with integrated telecommunication circuit and sensors for wireless and continuous tear glucose monitoring

    International Nuclear Information System (INIS)

    Yao, H; Liao, Y; Lingley, A R; Afanasiev, A; Lähdesmäki, I; Otis, B P; Parviz, B A

    2012-01-01

    We present an integrated functional contact lens, composed of a differential glucose sensor module, metal interconnects, sensor read-out circuit, antenna and telecommunication circuit, to monitor tear glucose levels wirelessly, continuously and non-invasively. The electrochemical differential sensor module is based on immobilization of activated and de-activated glucose oxidase. We characterized the sensor on a model polymer eye and determined that it showed good repeatability, molecular interference rejection and linearity in the range of 0–2 mM glucose, covering normal tear glucose concentrations (0.1–0.6 mM). We also report the temperature, ageing and protein-fouling sensitivity of the sensor. We report the design and implementation of a low-power (3 µW) sensor read-out and telecommunication circuit to deliver wireless power and transmit data for the sensor module. Using this small chip (0.36 mm 2 ), we produced an integrated contact lens with sensors and demonstrated wireless operation of the system and glucose read-out over the distance of several centimeters. (paper)

  8. IRIS (Integrity and Reliability in Integrated Circuits) Test Article Generation (ITAG)

    Science.gov (United States)

    2015-03-31

    the device is working as expected. Our in-circuit testing approach assumes that the FPGA Device Under Test (DUT) is mounted on a PCB, and that...is mounted on a PCB, and that special test access to external FPGA I/O pins is not available. This precludes the use of clock, reset, control, and...andler. The primary exception handler tch registers. Processor context is saved, on handlers . Information specifi to the ed in a fi ed-location memory

  9. Gallium arsenide digital integrated circuits for controlling SLAC CW-RF systems

    International Nuclear Information System (INIS)

    Ronan, M.T.; Lee, K.L.; Corredoura, P.; Judkins, J.G.

    1989-01-01

    In order to fill the PEP and SPEAR storage rings with beams from the SLC linac and damping rings, precise control of the linac subharmonic buncher and the damping ring RF is required. Recently several companies have developed resettable GaAs master/slave D-type flip-flops which are capable of operating at frequencies of 3 GHz and higher. Using these digital devices as frequency dividers, one can phase shift the SLAC CW-RF systems to optimize the timing for filling the storage rings. The authors have evaluated the performance of integrated circuits from two vendors for our particular application. Using microstrip circuit techniques, they have built and operated in the accelerator several chassis to synchronize a reset signal from the storage rings to the SLAC 2.856 GHz RF and to phase shift divide-by-four and divide-by-sixteen frequency dividers to the nearest 350 psec bucket required for filling

  10. MEMS capacitive pressure sensor monolithically integrated with CMOS readout circuit by using post CMOS processes

    Science.gov (United States)

    Jang, Munseon; Yun, Kwang-Seok

    2017-12-01

    In this paper, we presents a MEMS pressure sensor integrated with a readout circuit on a chip for an on-chip signal processing. The capacitive pressure sensor is formed on a CMOS chip by using a post-CMOS MEMS processes. The proposed device consists of a sensing capacitor that is square in shape, a reference capacitor and a readout circuitry based on a switched-capacitor scheme to detect capacitance change at various environmental pressures. The readout circuit was implemented by using a commercial 0.35 μm CMOS process with 2 polysilicon and 4 metal layers. Then, the pressure sensor was formed by wet etching of metal 2 layer through via hole structures. Experimental results show that the MEMS pressure sensor has a sensitivity of 11 mV/100 kPa at the pressure range of 100-400 kPa.

  11. Design and implementation of Gm-APD array readout integrated circuit for infrared 3D imaging

    Science.gov (United States)

    Zheng, Li-xia; Yang, Jun-hao; Liu, Zhao; Dong, Huai-peng; Wu, Jin; Sun, Wei-feng

    2013-09-01

    A single-photon detecting array of readout integrated circuit (ROIC) capable of infrared 3D imaging by photon detection and time-of-flight measurement is presented in this paper. The InGaAs avalanche photon diodes (APD) dynamic biased under Geiger operation mode by gate controlled active quenching circuit (AQC) are used here. The time-of-flight is accurately measured by a high accurate time-to-digital converter (TDC) integrated in the ROIC. For 3D imaging, frame rate controlling technique is utilized to the pixel's detection, so that the APD related to each pixel should be controlled by individual AQC to sense and quench the avalanche current, providing a digital CMOS-compatible voltage pulse. After each first sense, the detector is reset to wait for next frame operation. We employ counters of a two-segmental coarse-fine architecture, where the coarse conversion is achieved by a 10-bit pseudo-random linear feedback shift register (LFSR) in each pixel and a 3-bit fine conversion is realized by a ring delay line shared by all pixels. The reference clock driving the LFSR counter can be generated within the ring delay line Oscillator or provided by an external clock source. The circuit is designed and implemented by CSMC 0.5μm standard CMOS technology and the total chip area is around 2mm×2mm for 8×8 format ROIC with 150μm pixel pitch. The simulation results indicate that the relative time resolution of the proposed ROIC can achieve less than 1ns, and the preliminary test results show that the circuit function is correct.

  12. Conception and test of an integrated circuit (ASIC): application to multiwire chambers and photomultipliers of the GRAAL experience; Conception et test d`un circuit integre (ASIC): application aux chambres multifils et aux photomultiplicateurs de l`experience GRAAL

    Energy Technology Data Exchange (ETDEWEB)

    Bugnet, H.

    1995-11-21

    The nuclear physics project GRAAL (GRenoble Anneau Accelerateur Laser) located at the European Synchrotron Radiation Facility (ESRF) in Grenoble produces a high energy photon beam with a maximum energy of 1.5 GeV. This gamma beam is obtained by Compton backscattering and can be polarized easily. It permits to probe, in an original way, the structure of the nucleon. The associated detector system includes multiwire proportional chambers and scintillator hodoscopes. A kit of six ASICs (Application Specific Integrated Circuit) has been developed and used for the signal processing and data conditioning up to the level of the data acquisition. This integrated electronics can be mounted right on the detectors. Obvious advantages, due to the reduction of the length of the wires and the number of connections, are an improvement of the signal quality and an increase of the reliability. The Wire Processor (WP), ASIC designed and tested during this thesis, treats the signals from the chamber wires and the photomultipliers. In one chip, there are two identical channels permitting the amplification, the amplitude discrimination, the generation of a programmable delay and the writing in a two state memory in case of coincidence with an external strobe signal. The measurement of the multiwire chamber efficiency demonstrates the functioning of the WP, the data conditioning electronics, the data acquisition and the chamber itself. (author). 62 refs., 111 figs., 13 tabs.

  13. Simulated annealing method for electronic circuits design: adaptation and comparison with other optimization methods

    International Nuclear Information System (INIS)

    Berthiau, G.

    1995-10-01

    The circuit design problem consists in determining acceptable parameter values (resistors, capacitors, transistors geometries ...) which allow the circuit to meet various user given operational criteria (DC consumption, AC bandwidth, transient times ...). This task is equivalent to a multidimensional and/or multi objective optimization problem: n-variables functions have to be minimized in an hyper-rectangular domain ; equality constraints can be eventually specified. A similar problem consists in fitting component models. In this way, the optimization variables are the model parameters and one aims at minimizing a cost function built on the error between the model response and the data measured on the component. The chosen optimization method for this kind of problem is the simulated annealing method. This method, provided by the combinatorial optimization domain, has been adapted and compared with other global optimization methods for the continuous variables problems. An efficient strategy of variables discretization and a set of complementary stopping criteria have been proposed. The different parameters of the method have been adjusted with analytical functions of which minima are known, classically used in the literature. Our simulated annealing algorithm has been coupled with an open electrical simulator SPICE-PAC of which the modular structure allows the chaining of simulations required by the circuit optimization process. We proposed, for high-dimensional problems, a partitioning technique which ensures proportionality between CPU-time and variables number. To compare our method with others, we have adapted three other methods coming from combinatorial optimization domain - the threshold method, a genetic algorithm and the Tabu search method - The tests have been performed on the same set of test functions and the results allow a first comparison between these methods applied to continuous optimization variables. Finally, our simulated annealing program

  14. Multiobjective Optimization for Electronic Circuit Design in Time and Frequency Domains

    Directory of Open Access Journals (Sweden)

    J. Dobes

    2013-04-01

    Full Text Available The multiobjective optimization provides an extraordinary opportunity for the finest design of electronic circuits because it allows to mathematically balance contradictory requirements together with possible constraints. In this paper, an original and substantial improvement of an existing method for the multiobjective optimization known as GAM (Goal Attainment Method is suggested. In our proposal, the GAM algorithm itself is combined with a procedure that automatically provides a set of parameters -- weights, coordinates of the reference point -- for which the method generates noninferior solutions uniformly spread over an appropriately selected part of the Pareto front. Moreover, the resulting set of obtained solutions is then presented in a suitable graphic form so that the solution representing the most satisfactory tradeoff can be easily chosen by the designer. Our system generates various types of plots that conveniently characterize results of up to four-dimensional problems. Technically, the procedures of the multiobjective optimization were created as a software add-on to the CIA (Circuit Interactive Analyzer program. This way enabled us to utilize many powerful features of this program, including the sensitivity analyses in time and frequency domains. As a result, the system is also able to perform the multiobjective optimization in the time domain and even highly nonlinear circuits can be significantly improved by our program. As a demonstration of this feature, a multiobjective optimization of a C-class power amplifier in the time domain is thoroughly described in the paper. Further, a four-dimensional optimization of a video amplifier is demonstrated with an original graphic representation of the Pareto front, and also some comparison with the weighting method is done. As an example of improving noise properties, a multiobjective optimization of a low-noise amplifier is performed, and the results in the frequency domain are shown

  15. QIE10: a new front-end custom integrated circuit for high-rate experiments

    International Nuclear Information System (INIS)

    Baumbaugh, A; Monte, L Dal; Freeman, J; Hare, D; Los, S; Shaw, T; Vidal, R; Whitmore, J; Zimmerman, T; Drake, G; Proudfoot, J; Rojas, H Hernandez; Hughes, E; Mendez, D Mendez; Tully, C

    2014-01-01

    We present results on a new version of the QIE (Charge Integrator and Encoder), a custom Application Specific Integrated Circuit (ASIC) designed at Fermilab. Developed specifically for the measurement of charge from photo-detectors in high-rate environments, this most recent addition to the QIE family features 3 fC sensitivity, 17-bits of dynamic range with logarithmic response, a Time-to-Digital Converter (TDC) with sub-nanosecond resolution, and internal charge injection. The device is capable of dead-timeless operation at 40 MHz, making it ideal for calorimetry at the Large hadron Collider (LHC). We present bench measurements and integration studies that characterize the performance, radiation tolerance measurements, and plans for deployment in the Atlas and CMS detectors as part of the Phase 1 and Phase 2 upgrades

  16. High speed preamplifier circuit, detection electronics, and radiation detection systems therefrom

    Science.gov (United States)

    Riedel, Richard A [Knoxville, TN; Wintenberg, Alan L [Knoxville, TN; Clonts, Lloyd G [Knoxville, TN; Cooper, Ronald G [Oak Ridge, TN

    2010-09-21

    A preamplifier circuit for processing a signal provided by a radiation detector includes a transimpedance amplifier coupled to receive a current signal from a detector and generate a voltage signal at its output. A second amplification stage has an input coupled to an output of the transimpedance amplifier for providing an amplified voltage signal. Detector electronics include a preamplifier circuit having a first and second transimpedance amplifier coupled to receive a current signal from a first and second location on a detector, respectively, and generate a first and second voltage signal at respective outputs. A second amplification stage has an input coupled to an output of the transimpedance amplifiers for amplifying the first and said second voltage signals to provide first and second amplified voltage signals. A differential output stage is coupled to the second amplification stage for receiving the first and second amplified voltage signals and providing a pair of outputs from each of the first and second amplified voltage signals. Read out circuitry has an input coupled to receive both of the pair of outputs, the read out circuitry having structure for processing each of the pair of outputs, and providing a single digital output having a time-stamp therefrom.

  17. Multi-channel integrated circuits for the detection and measurement of ionizing radiation

    International Nuclear Information System (INIS)

    Engel, G.L.; Duggireddi, N.; Vangapally, V.; Elson, J.M.; Sobotka, L.G.; Charity, R.J.

    2011-01-01

    The Integrated Circuits (IC) Design Research Laboratory at Southern Illinois University Edwardsville (SIUE) has collaborated with the Nuclear Reactions Group at Washington University (WU) to develop a family of multi-channel integrated circuits. To date, the collaboration has successfully produced two micro-chips. The first was an analog shaped and peak sensing chip with on-board constant-fraction discriminators and sparsified readout. This chip is known as Heavy-Ion Nuclear Physics-16 Channel (HINP16C). The second chip, christened PSD8C, was designed to logically complement (in terms of detector types) the HINP16C chip. Pulse Shape Discrimination-8 Channel (PSD8C), featuring three settable charge integration windows per channel, performs pulse shape discrimination (PSD). This paper summarizes the design, capabilities, and features of the HINP16C and PSD8C ICs. It proceeds to discuss the modifications, made to the ICs and their associated systems, which have attempted to improve ease of use, increase performance, and extend capabilities. The paper concludes with a brief discussion of what may be the next chip (employing a multi-sampling scheme) to be added to our CMOS ASIC 'tool box' for radiation detection instrumentation.

  18. Wiring Together Synthetic Bacterial Consortia to Create a Biological Integrated Circuit.

    Science.gov (United States)

    Perry, Nicolas; Nelson, Edward M; Timp, Gregory

    2016-12-16

    The promise of adapting biology to information processing will not be realized until engineered gene circuits, operating in different cell populations, can be wired together to express a predictable function. Here, elementary biological integrated circuits (BICs), consisting of two sets of transmitter and receiver gene circuit modules with embedded memory placed in separate cell populations, were meticulously assembled using live cell lithography and wired together by the mass transport of quorum-sensing (QS) signal molecules to form two isolated communication links (comlinks). The comlink dynamics were tested by broadcasting "clock" pulses of inducers into the networks and measuring the responses of functionally linked fluorescent reporters, and then modeled through simulations that realistically captured the protein production and molecular transport. These results show that the comlinks were isolated and each mimicked aspects of the synchronous, sequential networks used in digital computing. The observations about the flow conditions, derived from numerical simulations, and the biofilm architectures that foster or silence cell-to-cell communications have implications for everything from decontamination of drinking water to bacterial virulence.

  19. A Bistable Circuit Involving SCARECROW-RETINOBLASTOMA Integrates Cues to Inform Asymmetric Stem Cell Division

    Science.gov (United States)

    Cruz-Ramírez, Alfredo; Díaz-Triviño, Sara; Blilou, Ikram; Grieneisen, Verônica A.; Sozzani, Rosangela; Zamioudis, Christos; Miskolczi, Pál; Nieuwland, Jeroen; Benjamins, René; Dhonukshe, Pankaj; Caballero-Pérez, Juan; Horvath, Beatrix; Long, Yuchen; Mähönen, Ari Pekka; Zhang, Hongtao; Xu, Jian; Murray, James A.H.; Benfey, Philip N.; Bako, Laszlo; Marée, Athanasius F.M.; Scheres, Ben

    2012-01-01

    SUMMARY In plants, where cells cannot migrate, asymmetric cell divisions (ACDs) must be confined to the appropriate spatial context. We investigate tissue-generating asymmetric divisions in a stem cell daughter within the Arabidopsis root. Spatial restriction of these divisions requires physical binding of the stem cell regulator SCARECROW (SCR) by the RETINOBLASTOMA-RELATED (RBR) protein. In the stem cell niche, SCR activity is counteracted by phosphorylation of RBR through a cyclinD6;1-CDK complex. This cyclin is itself under transcriptional control of SCR and its partner SHORT ROOT (SHR), creating a robust bistable circuit with either high or low SHR-SCR complex activity. Auxin biases this circuit by promoting CYCD6;1 transcription. Mathematical modeling shows that ACDs are only switched on after integration of radial and longitudinal information, determined by SHR and auxin distribution, respectively. Coupling of cell-cycle progression to protein degradation resets the circuit, resulting in a “flip flop” that constrains asymmetric cell division to the stem cell region. PMID:22921914

  20. Integrated plasticity at inhibitory and excitatory synapses in the cerebellar circuit

    Directory of Open Access Journals (Sweden)

    Lisa eMapelli

    2015-05-01

    Full Text Available The way long-term potentiation (LTP and depression (LTD are integrated within the different synapses of brain neuronal circuits is poorly understood. In order to progress beyond the identification of specific molecular mechanisms, a system in which multiple forms of plasticity can be correlated with large-scale neural processing is required. In this paper we take as an example the cerebellar network , in which extensive investigations have revealed LTP and LTD at several excitatory and inhibitory synapses. Cerebellar LTP and LTD occur in all three main cerebellar subcircuits (granular layer, molecular layer, deep cerebellar nuclei and correspondingly regulate the function of their three main neurons: granule cells (GrCs, Purkinje cells (PCs and deep cerebellar nuclear (DCN cells. All these neurons, in addition to be excited, are reached by feed-forward and feed-back inhibitory connections, in which LTP and LTD may either operate synergistically or homeostatically in order to control information flow through the circuit. Although the investigation of individual synaptic plasticities in vitro is essential to prove their existence and mechanisms, it is insufficient to generate a coherent view of their impact on network functioning in vivo. Recent computational models and cell-specific genetic mutations in mice are shedding light on how plasticity at multiple excitatory and inhibitory synapses might regulate neuronal activities in the cerebellar circuit and contribute to learning and memory and behavioral control.

  1. Biosignal integrated circuit with simultaneous acquisition of ECG and PPG for wearable healthcare applications.

    Science.gov (United States)

    Kim, Hyungseup; Park, Yunjong; Ko, Youngwoon; Mun, Yeongjin; Lee, Sangmin; Ko, Hyoungho

    2017-10-13

    Wearable healthcare systems require measurements from electrocardiograms (ECGs) and photoplethysmograms (PPGs), and the blood pressure of the user. The pulse transit time (PTT) can be calculated by measuring the ECG and PPG simultaneously. Continuous-time blood pressure without using an air cuff can be estimated by using the PTT. This paper presents a biosignal acquisition integrated circuit (IC) that can simultaneously measure the ECG and PPG for wearable healthcare applications. Included in this biosignal acquisition circuit are a voltage mode instrumentation amplifier (IA) for ECG acquisition and a current mode transimpedance amplifier for PPG acquisition. The analog outputs from the ECG and PPG channels are muxed and converted to digital signals using 12-bit successive approximation register (SAR) analog-to-digital converter (ADC). The proposed IC is fabricated by using a standard 0.18 μm CMOS process with an active area of 14.44 mm2. The total current consumption for the multichannel IC is 327 μA with a 3.3 V supply. The measured input referred noise of ECG readout channel is 1.3 μVRMS with a bandwidth of 0.5 Hz to 100 Hz. And the measured input referred current noise of the PPG readout channel is 0.122 nA/√Hz with a bandwidth of 0.5 Hz to 100 Hz. The proposed IC, which is implemented using various circuit techniques, can measure ECG and PPG signals simultaneously to calculate the PTT for wearable healthcare applications.

  2. Non-invasive current and voltage imaging techniques for integrated circuits using scanning probe microscopy

    Science.gov (United States)

    Campbell, A. N.; Cole, E. I., Jr.; Tangyunyong, Paiboon

    1995-06-01

    This report describes the first practical, non-invasive technique for detecting and imaging currents internal to operating integrated circuits (IC's). This technique is based on magnetic force microscopy and was developed under Sandia National Laboratories' LDRD (Laboratory Directed Research and Development) program during FY 93 and FY 94. LDRD funds were also used to explore a related technique, charge force microscopy, for voltage probing of IC's. This report describes the technical work performed under this LDRD as well as the outcomes of the project in terms of publications and awards, intellectual property and licensing, synergistic work, potential future work, hiring of additional permanent staff, and benefits to DOE's defense programs (DP).

  3. Water cooling in nuclear reactors by using panels of integrated circuits

    International Nuclear Information System (INIS)

    Dominique, P.; Letissier, R.

    1977-01-01

    In view of the drawbacks of wet cooling towers, EDF is searching for another approach to the problem. A self-cleaning device is now envisaged, that consists in some exchanger plates, 30 to 40m height (max. 60m) capable of being hiden in the lanscape behind high trees. The plates would be rather smooth and the air circulated by natural convection. The prototype is composed of 960 aluminium panels of integrated circuits mounted on three modules made of tubular elements working as supporting and collecting means together [fr

  4. MeV He microbeam analysis of a semiconductor integrated circuit

    International Nuclear Information System (INIS)

    Zhu Peiran; Liu Jiarui; Zhang Jinping; Yin Shiduan

    1989-01-01

    An MeV He + microbeam has been used to analyse a microscale semiconductor structure. The 2 MeV He + ion beam is limited to 25 μm diameter by a set of diaphragms and is further focused by a quadrupole quadruplet to 3μm diameter. The incident beam current on the sample is about 0.3 nA. The Rutherford backscattering (RBS) technique is applied to the measurement of the composition and depth profile in the near-surface region of a semiconductor integrated circuit. (author)

  5. All-fiber hybrid photon-plasmon circuits: integrating nanowire plasmonics with fiber optics.

    Science.gov (United States)

    Li, Xiyuan; Li, Wei; Guo, Xin; Lou, Jingyi; Tong, Limin

    2013-07-01

    We demonstrate all-fiber hybrid photon-plasmon circuits by integrating Ag nanowires with optical fibers. Relying on near-field coupling, we realize a photon-to-plasmon conversion efficiency up to 92% in a fiber-based nanowire plasmonic probe. Around optical communication band, we assemble an all-fiber resonator and a Mach-Zehnder interferometer (MZI) with Q-factor of 6 × 10(6) and extinction ratio up to 30 dB, respectively. Using the MZI, we demonstrate fiber-compatible plasmonic sensing with high sensitivity and low optical power.

  6. Performance evaluation of a burst-mode EDFA in an optical packet and circuit integrated network.

    Science.gov (United States)

    Shiraiwa, Masaki; Awaji, Yoshinari; Furukawa, Hideaki; Shinada, Satoshi; Puttnam, Benjamin J; Wada, Naoya

    2013-12-30

    We experimentally investigate the performance of burst-mode EDFA in an optical packet and circuit integrated system. In such networks, packets and light paths can be dynamically assigned to the same fibers, resulting in gain transients in EDFAs throughout the network that can limit network performance. Here, we compare the performance of a 'burst-mode' EDFA (BM-EDFA), employing transient suppression techniques and optical feedback, with conventional EDFAs, and those using automatic gain control and previous BM-EDFA implementations. We first measure gain transients and other impairments in a simplified set-up before making frame error-rate measurements in a network demonstration.

  7. Stitching Codeable Circuits: High School Students' Learning about Circuitry and Coding with Electronic Textiles

    Science.gov (United States)

    Litts, Breanne K.; Kafai, Yasmin B.; Lui, Debora A.; Walker, Justice T.; Widman, Sari A.

    2017-01-01

    Learning about circuitry by connecting a battery, light bulb, and wires is a common activity in many science classrooms. In this paper, we expand students' learning about circuitry with electronic textiles, which use conductive thread instead of wires and sewable LEDs instead of lightbulbs, by integrating programming sensor inputs and light…

  8. Tunable power law in the desynchronization events of coupled chaotic electronic circuits

    Energy Technology Data Exchange (ETDEWEB)

    Oliveira, Gilson F. de, E-mail: gilson@otica.ufpb.br; Lorenzo, Orlando di; Chevrollier, Martine; Passerat de Silans, Thierry; Oriá, Marcos [Departamento de Física, Universidade Federal da Paraíba, 58051-900 João Pessoa, PB (Brazil); Souza Cavalcante, Hugo L. D. de [Departamento de Informática, Universidade Federal da Paraíba, 58051-900 João Pessoa, PB (Brazil)

    2014-03-15

    We study the statistics of the amplitude of the synchronization error in chaotic electronic circuits coupled through linear feedback. Depending on the coupling strength, our system exhibits three qualitatively different regimes of synchronization: weak coupling yields independent oscillations; moderate to strong coupling produces a regime of intermittent synchronization known as attractor bubbling; and stronger coupling produces complete synchronization. In the regime of moderate coupling, the probability distribution for the sizes of desynchronization events follows a power law, with an exponent that can be adjusted by changing the coupling strength. Such power-law distributions are interesting, as they appear in many complex systems. However, most of the systems with such a behavior have a fixed value for the exponent of the power law, while here we present an example of a system where the exponent of the power law is easily tuned in real time.

  9. Tunable power law in the desynchronization events of coupled chaotic electronic circuits

    International Nuclear Information System (INIS)

    Oliveira, Gilson F. de; Lorenzo, Orlando di; Chevrollier, Martine; Passerat de Silans, Thierry; Oriá, Marcos; Souza Cavalcante, Hugo L. D. de

    2014-01-01

    We study the statistics of the amplitude of the synchronization error in chaotic electronic circuits coupled through linear feedback. Depending on the coupling strength, our system exhibits three qualitatively different regimes of synchronization: weak coupling yields independent oscillations; moderate to strong coupling produces a regime of intermittent synchronization known as attractor bubbling; and stronger coupling produces complete synchronization. In the regime of moderate coupling, the probability distribution for the sizes of desynchronization events follows a power law, with an exponent that can be adjusted by changing the coupling strength. Such power-law distributions are interesting, as they appear in many complex systems. However, most of the systems with such a behavior have a fixed value for the exponent of the power law, while here we present an example of a system where the exponent of the power law is easily tuned in real time

  10. Organic integrated circuits for information storage based on ambipolar polymers and charge injection engineering

    Energy Technology Data Exchange (ETDEWEB)

    Dell' Erba, Giorgio; Natali, Dario [Center for Nano Science and Technology PoliMi, Istituto Italiano di Tecnologia, Via Pascoli 70/3, 20133 Milano (Italy); Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano (Italy); Luzio, Alessandro; Caironi, Mario, E-mail: mario.caironi@iit.it, E-mail: yynoh@dongguk.edu [Center for Nano Science and Technology PoliMi, Istituto Italiano di Tecnologia, Via Pascoli 70/3, 20133 Milano (Italy); Kim, Juhwan; Khim, Dongyoon; Kim, Dong-Yu [Heeger Center for Advanced Materials, School of Materials Science and Engineering, Gwangju Institute of Science and Technology (GIST), 261 Cheomdan-gwagiro, Buk-gu, Gwangju 500-712 (Korea, Republic of); Noh, Yong-Young, E-mail: mario.caironi@iit.it, E-mail: yynoh@dongguk.edu [Department of Energy and Materials Engineering, Dongguk University, 26 Pil-dong, 3-ga, Jung-gu, Seoul 100-715 (Korea, Republic of)

    2014-04-14

    Ambipolar semiconducting polymers, characterized by both high electron (μ{sub e}) and hole (μ{sub h}) mobility, offer the advantage of realizing complex complementary electronic circuits with a single semiconducting layer, deposited by simple coating techniques. However, to achieve complementarity, one of the two conduction paths in transistors has to be suppressed, resulting in unipolar devices. Here, we adopt charge injection engineering through a specific interlayer in order to tune injection into frontier energy orbitals of a high mobility donor-acceptor co-polymer. Starting from field-effect transistors with Au contacts, showing a p-type unbalanced behaviour with μ{sub h} = 0.29 cm{sup 2}/V s and μ{sub e} = 0.001 cm{sup 2}/V s, through the insertion of a caesium salt interlayer with optimized thickness, we obtain an n-type unbalanced transistor with μ{sub e} = 0.12 cm{sup 2}/V s and μ{sub h} = 8 × 10{sup −4} cm{sup 2}/V s. We applied this result to the development of the basic pass-transistor logic building blocks such as inverters, with high gain and good noise margin, and transmission-gates. In addition, we developed and characterized information storage circuits like D-Latches and D-Flip-Flops consisting of 16 transistors, demonstrating both their static and dynamic performances and thus the suitability of this technology for more complex circuits such as display addressing logic.

  11. A study on the development of an automatic fault diagnosis system for testing NPP digital electronic circuits

    International Nuclear Information System (INIS)

    Kim, Dae Sik

    1993-02-01

    This paper describes a study on the development of an automatic fault diagnosis system for testing digital electronic circuits of nuclear power plants. Compared with the other conventional fault diagnosis systems, the system described in this paper uses Artificial Intelligence technique of model based reasoning and corroboration, which makes fault diagnosis much more efficient. In order to reduce the testing time, an optimal testing set which means a minimal testing set to determine whether or not the circuit is fault-free and to locate the faulty gate was derived. Compared with the testing using an exhaustive testing set, the testing using the optimal testing set makes fault diagnosis much more fast. Since the system diagnoses the circuit boards bases only on input and output signals, it can be further developed for on-line testing. The system was implemented on a microprocessor and was applied for Universal Circuit board testing of the Solid State protection System in nuclear power plants

  12. Toolbox for the design of LiNbO3-based passive and active integrated quantum circuits

    Science.gov (United States)

    Sharapova, P. R.; Luo, K. H.; Herrmann, H.; Reichelt, M.; Meier, T.; Silberhorn, C.

    2017-12-01

    We present and discuss perspectives of current developments on advanced quantum optical circuits monolithically integrated in the lithium niobate platform. A set of basic components comprising photon pair sources based on parametric down conversion (PDC), passive routing elements and active electro-optically controllable switches and polarisation converters are building blocks of a toolbox which is the basis for a broad range of diverse quantum circuits. We review the state-of-the-art of these components and provide models that properly describe their performance in quantum circuits. As an example for applications of these models we discuss design issues for a circuit providing on-chip two-photon interference. The circuit comprises a PDC section for photon pair generation followed by an actively controllable modified mach–Zehnder structure for observing Hong–Ou–Mandel interference. The performance of such a chip is simulated theoretically by taking even imperfections of the properties of the individual components into account.

  13. Noise in Neuronal and Electronic Circuits: A General Modeling Framework and Non-Monte Carlo Simulation Techniques.

    Science.gov (United States)

    Kilinc, Deniz; Demir, Alper

    2017-08-01

    The brain is extremely energy efficient and remarkably robust in what it does despite the considerable variability and noise caused by the stochastic mechanisms in neurons and synapses. Computational modeling is a powerful tool that can help us gain insight into this important aspect of brain mechanism. A deep understanding and computational design tools can help develop robust neuromorphic electronic circuits and hybrid neuroelectronic systems. In this paper, we present a general modeling framework for biological neuronal circuits that systematically captures the nonstationary stochastic behavior of ion channels and synaptic processes. In this framework, fine-grained, discrete-state, continuous-time Markov chain models of both ion channels and synaptic processes are treated in a unified manner. Our modeling framework features a mechanism for the automatic generation of the corresponding coarse-grained, continuous-state, continuous-time stochastic differential equation models for neuronal variability and noise. Furthermore, we repurpose non-Monte Carlo noise analysis techniques, which were previously developed for analog electronic circuits, for the stochastic characterization of neuronal circuits both in time and frequency domain. We verify that the fast non-Monte Carlo analysis methods produce results with the same accuracy as computationally expensive Monte Carlo simulations. We have implemented the proposed techniques in a prototype simulator, where both biological neuronal and analog electronic circuits can be simulated together in a coupled manner.

  14. Remote sensing of microbial volatile organic compounds with a bioluminescent bioreporter integrated circuit

    Science.gov (United States)

    Ripp, Steven A.; Daumer, Kathleen A.; Garland, Jay L.; Simpson, Michael L.; Sayler, Gary S.

    2004-03-01

    As a means towards advanced, early-warning detection of microbial growth in enclosed structures, we have constructed a bioluminescent bioreporter for the detection of the microbial volatile organic compound (MVOC) p-cymene. MVOCs are produced as metabolic by-products of bacteria and fungi and are detectable before any visible signs of microbial growth appear, thereby serving as very early indicators of potential biocontamination problems. The bioreporter, designated Pseudomonas putida UT93, contains a Vibrio fischeri luxCDABE gene fusion to a p-cymene/p-cumate inducible promoter. Exposure of strain UT93 to p-cymene from approximately 0.02 to 850 ppm produced self-generated bioluminescence in less than 1.5 hours. The bioreporter was also interfaced with an integrated circuit microluminometer to create a miniaturized hybrid sensor for remote monitoring of p-cymene signatures. This bioluminescent bioreporter integrated circuit (BBIC) device was capable of detecting fungal presence within approximately 3.5 hours of initial exposure to Penicillium roqueforti.

  15. Three-dimensional multi-terminal superconductive integrated circuit inductance extraction

    International Nuclear Information System (INIS)

    Fourie, Coenrad J; Wetzstein, Olaf; Kunert, Jürgen; Ortlepp, Thomas

    2011-01-01

    Accurate inductance calculations are critical for the design of both digital and analogue superconductive integrated circuits, and three-dimensional calculations are gaining importance with the advent of inductive biasing, inductive coupling and sky plane shielding for RSFQ cells. InductEx, an extraction programme based on the three-dimensional calculation software FastHenry, was proposed earlier. InductEx uses segmentation techniques designed to accurately model the geometries of superconductive integrated circuit structures. Inductance extraction for complex multi-terminal three-dimensional structures from current distributions calculated by FastHenry is discussed. Results for both a reflection plane modelling an infinite ground plane and a finite segmented ground plane that allows inductive elements to extend over holes in the ground plane are shown. Several SQUIDs were designed for and fabricated with IPHT's 1 kA cm −2 RSFQ1D niobium process. These SQUIDs implement a number of loop structures that span different layers, include vias, inductively coupled control lines and ground plane holes. We measured the loop inductance of these SQUIDs and show how the results are used to calibrate the layer parameters in InductEx and verify the extraction accuracy. We also show that, with proper modelling, FastHenry can be fast enough to be used for the extraction of typical RSFQ cell inductances.

  16. A Reconfigurable Readout Integrated Circuit for Heterogeneous Display-Based Multi-Sensor Systems

    Directory of Open Access Journals (Sweden)

    Kyeonghwan Park

    2017-04-01

    Full Text Available This paper presents a reconfigurable multi-sensor interface and its readout integrated circuit (ROIC for display-based multi-sensor systems, which builds up multi-sensor functions by utilizing touch screen panels. In addition to inherent touch detection, physiological and environmental sensor interfaces are incorporated. The reconfigurable feature is effectively implemented by proposing two basis readout topologies of amplifier-based and oscillator-based circuits. For noise-immune design against various noises from inherent human-touch operations, an alternate-sampling error-correction scheme is proposed and integrated inside the ROIC, achieving a 12-bit resolution of successive approximation register (SAR of analog-to-digital conversion without additional calibrations. A ROIC prototype that includes the whole proposed functions and data converters was fabricated in a 0.18 μm complementary metal oxide semiconductor (CMOS process, and its feasibility was experimentally verified to support multiple heterogeneous sensing functions of touch, electrocardiogram, body impedance, and environmental sensors.

  17. Operational Excellence through Schedule Optimization and Production Simulation of Application Specific Integrated Circuits.

    Energy Technology Data Exchange (ETDEWEB)

    Flory, John Andrew [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Padilla, Denise D. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Gauthier, John H. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Zwerneman, April Marie [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Miller, Steven P [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2016-05-01

    Upcoming weapon programs require an aggressive increase in Application Specific Integrated Circuit (ASIC) production at Sandia National Laboratories (SNL). SNL has developed unique modeling and optimization tools that have been instrumental in improving ASIC production productivity and efficiency, identifying optimal operational and tactical execution plans under resource constraints, and providing confidence in successful mission execution. With ten products and unprecedented levels of demand, a single set of shared resources, highly variable processes, and the need for external supplier task synchronization, scheduling is an integral part of successful manufacturing. The scheduler uses an iterative multi-objective genetic algorithm and a multi-dimensional performance evaluator. Schedule feasibility is assessed using a discrete event simulation (DES) that incorporates operational uncertainty, variability, and resource availability. The tools provide rapid scenario assessments and responses to variances in the operational environment, and have been used to inform major equipment investments and workforce planning decisions in multiple SNL facilities.

  18. Capacitive Micro Pressure Sensor Integrated with a Ring Oscillator Circuit on Chip

    Directory of Open Access Journals (Sweden)

    Cheng-Yang Liu

    2009-12-01

    Full Text Available The study investigates a capacitive micro pressure sensor integrated with a ring oscillator circuit on a chip. The integrated capacitive pressure sensor is fabricated using the commercial CMOS (complementary metal oxide semiconductor process and a post-process. The ring oscillator is employed to convert the capacitance of the pressure sensor into the frequency output. The pressure sensor consists of 16 sensing cells in parallel. Each sensing cell contains a top electrode and a lower electrode, and the top electrode is a sandwich membrane. The pressure sensor needs a post-CMOS process to release the membranes after completion of the CMOS process. The post-process uses etchants to etch the sacrificial layers, and to release the membranes. The advantages of the post-process include easy execution and low cost. Experimental results reveal that the pressure sensor has a high sensitivity of 7 Hz/Pa in the pressure range of 0–300 kPa.

  19. Capacitive micro pressure sensor integrated with a ring oscillator circuit on chip.

    Science.gov (United States)

    Dai, Ching-Liang; Lu, Po-Wei; Chang, Chienliu; Liu, Cheng-Yang

    2009-01-01

    The study investigates a capacitive micro pressure sensor integrated with a ring oscillator circuit on a chip. The integrated capacitive pressure sensor is fabricated using the commercial CMOS (complementary metal oxide semiconductor) process and a post-process. The ring oscillator is employed to convert the capacitance of the pressure sensor into the frequency output. The pressure sensor consists of 16 sensing cells in parallel. Each sensing cell contains a top electrode and a lower electrode, and the top electrode is a sandwich membrane. The pressure sensor needs a post-CMOS process to release the membranes after completion of the CMOS process. The post-process uses etchants to etch the sacrificial layers, and to release the membranes. The advantages of the post-process include easy execution and low cost. Experimental results reveal that the pressure sensor has a high sensitivity of 7 Hz/Pa in the pressure range of 0-300 kPa.

  20. Multisensory integration for odor tracking by flying Drosophila: Behavior, circuits and speculation.

    Science.gov (United States)

    Duistermars, Brian J; Frye, Mark A

    2010-01-01

    Many see fruit flies as an annoyance, invading our homes with a nagging persistence and efficiency. Yet from a scientific perspective, these tiny animals are a wonder of multisensory integration, capable of tracking fragmented odor plumes amidst turbulent winds and constantly varying visual conditions. The peripheral olfactory, mechanosensory, and visual systems of the fruit fly, Drosophila melanogaster, have been studied in great detail;1-4 however, the mechanisms by which fly brains integrate information from multiple sensory modalities to facilitate robust odor tracking remain elusive. Our studies on olfactory orientation by flying flies reveal that these animals do not simply follow their "nose"; rather, fruit flies require mechanosensory and visual input to track odors in flight.5,6 Collectively, these results shed light on the neural circuits involved in odor localization by fruit flies in the wild and illuminate the elegant complexity underlying a behavior to which the annoyed and amazed are familiar.

  1. Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors

    Directory of Open Access Journals (Sweden)

    Fábio F. Vidor

    2015-07-01

    Full Text Available Flexible and transparent electronics have been studied intensively during the last few decades. The technique establishes the possibility of fabricating innovative products, from flexible displays to radio-frequency identification tags. Typically, large-area polymeric substrates such as polypropylene (PP or polyethylene terephthalate (PET are used, which produces new requirements for the integration processes. A key element for flexible and transparent electronics is the thin-film transistor (TFT, as it is responsible for the driving current in memory cells, digital circuits or organic light-emitting devices (OLEDs. In this paper, we discuss some fundamental concepts of TFT technology. Additionally, we present a comparison between the use of the semiconducting organic small-molecule pentacene and inorganic nanoparticle semiconductors in order to integrate TFTs suitable for flexible electronics. Moreover, a technique for integration with a submicron resolution suitable for glass and foil substrates is presented.

  2. Module Seven: Combination Circuits and Voltage Dividers; Basic Electricity and Electronics Individualized Learning System.

    Science.gov (United States)

    Bureau of Naval Personnel, Washington, DC.

    In this module the student will learn to apply the rules previously learned for series and parallel circuits to more complex circuits called series-parallel circuits, discover the utility of a common reference when making reference to voltage values, and learn how to obtain a required voltage from a voltage divider network. The module is divided…

  3. On the Basis of Synaptic Integration Constancy during Growth of a Neuronal Circuit

    Directory of Open Access Journals (Sweden)

    Adriana De-La-Rosa Tovar

    2016-08-01

    Full Text Available We studied how a neuronal circuit composed of two neuron types connected by chemical and electrical synapses maintains constant its integrative capacities as neurons grow. For this we combined electrophysiological experiments with mathematical modeling in pairs of electrically-coupled Retzius neurons from postnatal to adult leeches. The electrically-coupled dendrites of both Retzius neurons receive a common chemical input, which produces excitatory postsynaptic potentials (EPSPs with varying amplitudes. Each EPSP spreads to the soma, but also crosses the electrical synapse to arrive at the soma of the coupled neuron. The leak of synaptic current across the electrical synapse reduces the amplitude of the EPSPs in proportion to the coupling ratio. In addition, summation of EPSPs generated in both neurons generates the baseline action potentials of these serotonergic neurons. To study how integration is adjusted as neurons grow, we first studied the characteristics of the chemical and electrical connections onto the coupled dendrites of neuron pairs with soma diameters ranging from 21 to 75 μm. Then by feeding a mathematical model with the neuronal voltage responses to pseudorandom noise currents we obtained the values of the coupling ratio, the membrane resistance of the soma (rm and dendrites (rdend, the space constant (λ and the characteristic dendritic length (L = l/λ. We found that the EPSPs recorded from the somata were similar regardless on the neuron size. However, the amplitude of the EPSPs and the firing frequency of the neurons were inversely proportional to the coupling ratio of the neuron pair, which also was independent from the neuronal size. This data indicated that the integrative constancy relied on the passive membrane properties. We show that the growth of Retzius neurons was compensated by increasing the membrane resistance of the dendrites and therefore the λ value. By solely increasing the dendrite resistance this circuit

  4. A Higher Brain Circuit for Immediate Integration of Conflicting Sensory Information in Drosophila.

    Science.gov (United States)

    Lewis, Laurence P C; Siju, K P; Aso, Yoshinori; Friedrich, Anja B; Bulteel, Alexander J B; Rubin, Gerald M; Grunwald Kadow, Ilona C

    2015-08-31

    Animals continuously evaluate sensory information to decide on their next action. Different sensory cues, however, often demand opposing behavioral responses. How does the brain process conflicting sensory information during decision making? Here, we show that flies use neural substrates attributed to odor learning and memory, including the mushroom body (MB), for immediate sensory integration and modulation of innate behavior. Drosophila melanogaster must integrate contradictory sensory information during feeding on fermenting fruit that releases both food odor and the innately aversive odor CO2. Here, using this framework, we examine the neural basis for this integration. We have identified a local circuit consisting of specific glutamatergic output and PAM dopaminergic input neurons with overlapping innervation in the MB-β'2 lobe region, which integrates food odor and suppresses innate avoidance. Activation of food odor-responsive dopaminergic neurons reduces innate avoidance mediated by CO2-responsive MB output neurons. We hypothesize that the MB, in addition to its long recognized role in learning and memory, serves as the insect's brain center for immediate sensory integration during instantaneous decision making. Copyright © 2015 Elsevier Ltd. All rights reserved.

  5. Test and diagnosis of analogue, mixed-signal and RF integrated circuits the system on chip approach

    CERN Document Server

    Sun, Yichuang

    2008-01-01

    This book provides a comprehensive discussion of automatic testing, diagnosis and tuning of analogue, mixed-signal and RF integrated circuits, and systems in a single source. The book contains eleven chapters written by leading researchers worldwide. As well as fundamental concepts and techniques, the book reports systematically the state of the arts and future research directions of these areas. A complete range of circuit components are covered and test issues are also addressed from the SoC perspective.

  6. Heterostructure-based high-speed/high-frequency electronic circuit applications

    Science.gov (United States)

    Zampardi, P. J.; Runge, K.; Pierson, R. L.; Higgins, J. A.; Yu, R.; McDermott, B. T.; Pan, N.

    1999-08-01

    With the growth of wireless and lightwave technologies, heterostructure electronic devices are commodity items in the commercial marketplace [Browne J. Power-amplifier MMICs drive commercial circuits. Microwaves & RF, 1998. p. 116-24.]. In particular, HBTs are an attractive device for handset power amplifiers at 900 MHz and 1.9 GHz for CDMA applications [Lum E. GaAs technology rides the wireless wave. Proceedings of the 1997 GaAs IC Symposium, 1997. p. 11-13; "Rockwell Ramps Up". Compound Semiconductor, May/June 1997.]. At higher frequencies, both HBTs and p-HEMTs are expected to dominate the marketplace. For high-speed lightwave circuit applications, heterostructure based products on the market for OC-48 (2.5 Gb/s) and OC-192 (10 Gb/s) are emerging [http://www.nb.rockwell.com/platforms/network_access/nahome.html#5.; http://www.nortel.com/technology/opto/receivers/ptav2.html.]. Chips that operate at 40 Gb/ have been demonstrated in a number of research laboratories [Zampardi PJ, Pierson RL, Runge K, Yu R, Beccue SM, Yu J, Wang KC. hybrid digital/microwave HBTs for >30 Gb/s optical communications. IEDM Technical Digest, 1995. p. 803-6; Swahn T, Lewin T, Mokhtari M, Tenhunen H, Walden R, Stanchina W. 40 Gb/s 3 Volt InP HBT ICs for a fiber optic demonstrator system. Proceedings of the 1996 GaAs IC Symposium, 1996. p. 125-8; Suzuki H, Watanabe K, Ishikawa K, Masuda H, Ouchi K, Tanoue T, Takeyari R. InP/InGaAs HBT ICs for 40 Gbit/s optical transmission systems. Proceedings of the 1997 GaAs IC Symposium, 1997. p. 215-8]. In addition to these two markets, another area where heterostructure devices are having significant impact is for data conversion [Walden RH. Analog-to digital convertor technology comparison. Proceedings of the 1994 GaAs IC Symposium, 1994. p. 217-9; Poulton K, Knudsen K, Corcoran J, Wang KC, Nubling RB, Chang M-CF, Asbeck PM, Huang RT. A 6-b, 4 GSa/s GaAs HBT ADC. IEEE J Solid-State Circuits 1995;30:1109-18; Nary K, Nubling R, Beccue S, Colleran W

  7. The Electrocardiogram as an Electronic Filter and Why AC Circuits Are Important for Pre-Health Physics Students

    Science.gov (United States)

    Dunlap, Justin C.; Kutschera, Ellynne; Van Ness, Grace R.; Widenhorn, Ralf

    2015-01-01

    We present a general physics laboratory exercise that centres around the use of the electrocardiogram sensor as an application of circuits and electronic signal filtering. Although these topics are commonly taught in the general physics classroom, many students consider topics such as alternating current as unrelated to their future professions.…

  8. Mesh Nanoelectronics: Seamless Integration of Electronics with Tissues.

    Science.gov (United States)

    Dai, Xiaochuan; Hong, Guosong; Gao, Teng; Lieber, Charles M

    2018-02-20

    Nanobioelectronics represents a rapidly developing field with broad-ranging opportunities in fundamental biological sciences, biotechnology, and medicine. Despite this potential, seamless integration of electronics has been difficult due to fundamental mismatches, including size and mechanical properties, between the elements of the electronic and living biological systems. In this Account, we discuss the concept, development, key demonstrations, and future opportunities of mesh nanoelectronics as a general paradigm for seamless integration of electronics within synthetic tissues and live animals. We first describe the design and realization of hybrid synthetic tissues that are innervated in three dimensions (3D) with mesh nanoelectronics where the mesh serves as both as a tissue scaffold and as a platform of addressable electronic devices for monitoring and manipulating tissue behavior. Specific examples of tissue/nanoelectronic mesh hybrids highlighted include 3D neural tissue, cardiac patches, and vascular constructs, where the nanoelectronic devices have been used to carry out real-time 3D recording of electrophysiological and chemical signals in the tissues. This novel platform was also exploited for time-dependent 3D spatiotemporal mapping of cardiac tissue action potentials during cell culture and tissue maturation as well as in response to injection of pharmacological agents. The extension to simultaneous real-time monitoring and active control of tissue behavior is further discussed for multifunctional mesh nanoelectronics incorporating both recording and stimulation devices, providing the unique capability of bidirectional interfaces to cardiac tissue. In the case of live animals, new challenges must be addressed, including minimally invasive implantation, absence of deleterious chronic tissue response, and long-term capability for monitoring and modulating tissue activity. We discuss each of these topics in the context of implantation of mesh

  9. Sparse gallium arsenide to silicon metal waferbonding for heterogeneous monolithic microwave integrated circuits

    Science.gov (United States)

    Bickford, Justin Robert

    Waferbonding is a technique that integrates different semiconductors together, in order to obtain hybrid structures that exploit the strengths of each material. Work was done at the University of California at San Diego to investigate the waferbonding of III/V compound semiconductors to silicon using a metal interface. GaAs and other III/V compound semiconductors surpass silicon in their ability to create high performance microwave devices, while silicon offers an inexpensive platform with a proven digital architecture that can interface with microwave devices and support passive components and driver circuitry. Intimate integration of the two will be required, as mixed RF/digital and optical/digital systems for communications devices such as cell phones, wi-fi, and optical communications systems are pushed smaller, faster, and to higher power. The metalbonding implementation of a proposed heterogeneous monolithic microwave integrated circuit (HMMIC) system was investigated, and was shown to extend the capabilities of existing homogeneous monolithic microwave integrated circuit (MMIC) systems. The main goals of this work were two-fold; first to implement a robust heterogeneous integration technique, and second, to show that this approach uniquely improves upon existing microwave integration technology. The metalbonding technique investigated sparsely integrated GaAs structures onto silicon, in pursuit of this HMMIC scheme. Both bottom-up and top-down fabrication methods were implemented. These approaches required the development of a myriad of meticulously designed fabrication procedures capable of avoiding the many incompatibilities between the compound semiconductor, bondmetal, and silicon materials. The bondmetal interface, provided by these techniques, broadens the scope of existing monolithic microwave integrated circuit technology design possibilities. Essential bond interface properties were measured to establish the performance of this heterogeneous

  10. Polypyrrole Porous Micro Humidity Sensor Integrated with a Ring Oscillator Circuit on Chip

    Science.gov (United States)

    Yang, Ming-Zhi; Dai, Ching-Liang; Lu, De-Hao

    2010-01-01

    This study presents the design and fabrication of a capacitive micro humidity sensor integrated with a five-stage ring oscillator circuit on chip using the complimentary metal oxide semiconductor (CMOS) process. The area of the humidity sensor chip is about 1 mm2. The humidity sensor consists of a sensing capacitor and a sensing film. The sensing capacitor is constructed from spiral interdigital electrodes that can enhance the sensitivity of the sensor. The sensing film of the sensor is polypyrrole, which is prepared by the chemical polymerization method, and the film has a porous structure. The sensor needs a post-CMOS process to coat the sensing film. The post-CMOS process uses a wet etching to etch the sacrificial layers, and then the polypyrrole is coated on the sensing capacitor. The sensor generates a change in capacitance when the sensing film absorbs or desorbs vapor. The ring oscillator circuit converts the capacitance variation of the sensor into the oscillation frequency output. Experimental results show that the sensitivity of the humidity sensor is about 99 kHz/%RH at 25 °C. PMID:22163459

  11. A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations.

    Science.gov (United States)

    Tsai, Tsung-Heng; Tsai, Hao-Cheng; Wu, Tien-Keng

    2014-10-01

    This paper presents a capacitive tactile sensor fabricated in a standard CMOS process. Both of the sensor and readout circuits are integrated on a single chip by a TSMC 0.35 μm CMOS MEMS technology. In order to improve the sensitivity, a T-shaped protrusion is proposed and implemented. This sensor comprises the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few post-processing steps. By a nano-indenter, the measured spring constant of the T-shaped structure is 2.19 kNewton/m. Fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction are utilized to compensate process variations and improve the accuracy of the readout circuits. The measured displacement-to-voltage transductance is 7.15 mV/nm, and the sensitivity is 3.26 mV/μNewton. The overall power dissipation is 132.8 μW.

  12. Gallium arsenide digital integrated circuits for controlling SLAC CW-RF systems

    International Nuclear Information System (INIS)

    Ronan, M.T.; Lee, K.L.; Corredoura, P.; Judkins, J.G.

    1988-10-01

    In order to fill the PEP and SPEAR storage rings with beams from the SLC linac and damping rings, precise control of the linac subharmonic buncher and the damping ring RF is required. Recently several companies have developed resettable GaAs master/slave D-type flip-flops which are capable of operating at frequencies of 3 GHz and higher. Using these digital devices as frequency dividers, one can phase shift the SLAC CW-RF systems to optimize the timing for filling the storage rings. We have evaluated the performance of integrated circuits from two vendors for our particular application. Using microstrip circuit techniques, we have built and operated in the accelerator several chassis to synchronize a reset signal from the storage rings to the SLAC 2.856 GHz RF and to phase shift divide-by-four and divide-by-sixteen frequency dividers to the nearest 350 psec bucket required for filling. 4 refs., 4 figs., 2 tabs

  13. Polypyrrole porous micro humidity sensor integrated with a ring oscillator circuit on chip.

    Science.gov (United States)

    Yang, Ming-Zhi; Dai, Ching-Liang; Lu, De-Hao

    2010-01-01

    This study presents the design and fabrication of a capacitive micro humidity sensor integrated with a five-stage ring oscillator circuit on chip using the complimentary metal oxide semiconductor (CMOS) process. The area of the humidity sensor chip is about 1 mm(2). The humidity sensor consists of a sensing capacitor and a sensing film. The sensing capacitor is constructed from spiral interdigital electrodes that can enhance the sensitivity of the sensor. The sensing film of the sensor is polypyrrole, which is prepared by the chemical polymerization method, and the film has a porous structure. The sensor needs a post-CMOS process to coat the sensing film. The post-CMOS process uses a wet etching to etch the sacrificial layers, and then the polypyrrole is coated on the sensing capacitor. The sensor generates a change in capacitance when the sensing film absorbs or desorbs vapor. The ring oscillator circuit converts the capacitance variation of the sensor into the oscillation frequency output. Experimental results show that the sensitivity of the humidity sensor is about 99 kHz/%RH at 25 °C.

  14. Polypyrrole Porous Micro Humidity Sensor Integrated with a Ring Oscillator Circuit on Chip

    Directory of Open Access Journals (Sweden)

    De-Hao Lu

    2010-11-01

    Full Text Available This study presents the design and fabrication of a capacitive micro humidity sensor integrated with a five-stage ring oscillator circuit on chip using the complimentary metal oxide semiconductor (CMOS process. The area of the humidity sensor chip is about 1 mm2. The humidity sensor consists of a sensing capacitor and a sensing film. The sensing capacitor is constructed from spiral interdigital electrodes that can enhance the sensitivity of the sensor. The sensing film of the sensor is polypyrrole, which is prepared by the chemical polymerization method, and the film has a porous structure. The sensor needs a post-CMOS process to coat the sensing film. The post-CMOS process uses a wet etching to etch the sacrificial layers, and then the polypyrrole is coated on the sensing capacitor. The sensor generates a change in capacitance when the sensing film absorbs or desorbs vapor. The ring oscillator circuit converts the capacitance variation of the sensor into the oscillation frequency output. Experimental results show that the sensitivity of the humidity sensor is about 99 kHz/%RH at 25 °C.

  15. Analog integrated circuit design automation placement, routing and parasitic extraction techniques

    CERN Document Server

    Martins, Ricardo; Horta, Nuno

    2017-01-01

    This book introduces readers to a variety of tools for analog layout design automation. After discussing the placement and routing problem in electronic design automation (EDA), the authors overview a variety of automatic layout generation tools, as well as the most recent advances in analog layout-aware circuit sizing. The discussion includes different methods for automatic placement (a template-based Placer and an optimization-based Placer), a fully-automatic Router and an empirical-based Parasitic Extractor. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. All the methods described are applied to practical examples for a 130nm design process, as well as placement and routing benchmark sets. Introduces readers to hierarchical combination of Pareto fronts of placements; Presents electromigration-aware routing with multilayer multiport terminal structures...

  16. The electrocardiogram as an electronic filter and why ac circuits are important for pre-health physics students

    Science.gov (United States)

    Dunlap, Justin C.; Kutschera, Ellynne; Van Ness, Grace R.; Widenhorn, Ralf

    2015-01-01

    We present a general physics laboratory exercise that centres around the use of the electrocardiogram sensor as an application of circuits and electronic signal filtering. Although these topics are commonly taught in the general physics classroom, many students consider topics such as alternating current as unrelated to their future professions. This exercise provides the motivation for life science and pre-health majors to learn concepts such as voltage, resistance, alternating and direct current, RLC circuits, as well as signal and noise, in an introductory undergraduate physics lab.

  17. Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)

    Science.gov (United States)

    Li, Xiuling; Huang, Wen

    2015-04-28

    A rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC) comprises a multilayer sheet in a rolled configuration comprising multiple turns about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. The conductive pattern layer comprises a first conductive film and a second conductive film separated from the first conductive film in a rolling direction. In the rolled configuration, the first conductive film surrounds the longitudinal axis, and the second conductive film surrounds the first conductive film. The first conductive film serves as a signal line and the second conductive film serves as a conductive shield for the rolled-up transmission line structure.

  18. Development of high speed integrated circuit for very high resolution timing measurements

    International Nuclear Information System (INIS)

    Mester, Christian

    2009-10-01

    A multi-channel high-precision low-power time-to-digital converter application specific integrated circuit for high energy physics applications has been designed and implemented in a 130 nm CMOS process. To reach a target resolution of 24.4 ps, a novel delay element has been conceived. This nominal resolution has been experimentally verified with a prototype, with a minimum resolution of 19 ps. To further improve the resolution, a new interpolation scheme has been described. The ASIC has been designed to use a reference clock with the LHC bunch crossing frequency of 40 MHz and generate all required timing signals internally, to ease to use within the framework of an LHC upgrade. Special care has been taken to minimise the power consumption. (orig.)

  19. Effects of plasma-deposited silicon nitride passivation on the radiation hardness of CMOS integrated circuits

    International Nuclear Information System (INIS)

    Clement, J.J.

    1980-01-01

    The use of plasma-deposited silicon nitride as a final passivation over metal-gate CMOS integrated circuits degrades the radiation hardness of these devices. The hardness degradation is manifested by increased radiation-induced threshold voltage shifts caused principally by the charging of new interface states and, to a lesser extent, by the trapping of holes created upon exposure to ionizing radiation. The threshold voltage shifts are a strong function of the deposition temperature, and show very little dependence on thickness for films deposited at 300 0 C. There is some correlation between the threshold voltage shifts and the hydrogen content of the PECVD silicon nitride films used as the final passivation layer as a function of deposition temperature. The mechanism by which the hydrogen contained in these films may react with the Si/SiO 2 interface is not clear at this point

  20. Integrated circuit test-port architecture and method and apparatus of test-port generation

    Science.gov (United States)

    Teifel, John

    2016-04-12

    A method and apparatus are provided for generating RTL code for a test-port interface of an integrated circuit. In an embodiment, a test-port table is provided as input data. A computer automatically parses the test-port table into data structures and analyzes it to determine input, output, local, and output-enable port names. The computer generates address-detect and test-enable logic constructed from combinational functions. The computer generates one-hot multiplexer logic for at least some of the output ports. The one-hot multiplexer logic for each port is generated so as to enable the port to toggle between data signals and test signals. The computer then completes the generation of the RTL code.

  1. Photonic Integrated Circuits for Cost-Effective, High Port Density, and Higher Capacity Optical Communications Systems

    Science.gov (United States)

    Chiappa, Pierangelo

    Bandwidth-hungry services, such as higher speed Internet, voice over IP (VoIP), and IPTV, allow people to exchange and store huge amounts of data among worldwide locations. In the age of global communications, domestic users, companies, and organizations around the world generate new contents making bandwidth needs grow exponentially, along with the need for new services. These bandwidth and connectivity demands represent a concern for operators who require innovative technologies to be ready for scaling. To respond efficiently to these demands, Alcatel-Lucent is fast moving toward photonic integration circuits technologies as the key to address best performances at the lowest "bit per second" cost. This article describes Alcatel-Lucent's contribution in strategic directions or achievements, as well as possible new developments.

  2. Issues of verification and validation of application-specific integrated circuits in reactor trip systems

    International Nuclear Information System (INIS)

    Battle, R.E.; Alley, G.T.

    1993-01-01

    Concepts of using application-specific integrated circuits (ASICs) in nuclear reactor safety systems are evaluated. The motivation for this evaluation stems from the difficulty of proving that software-based protection systems are adequately reliable. Important issues concerning the reliability of computers and software are identified and used to evaluate features of ASICS. These concepts indicate that ASICs have several advantages over software for simple systems. The primary advantage of ASICs over software is that verification and validation (V ampersand V) of ASICs can be done with much higher confidence than can be done with software. A method of performing this V ampersand V on ASICS is being developed at Oak Ridge National Laboratory. The purpose of the method's being developed is to help eliminate design and fabrication errors. It will not solve problems with incorrect requirements or specifications

  3. Investigation of Planar Waveguides and Components for Millimeter-Wave Integrated Circuits.

    Science.gov (United States)

    1985-03-01

    cntant of fin-line in a WR-28 shield. ..................................... 1A 16 rmodea. 3 .C am - - *’% *jrrode 2 0 M0 e I 2.8. . .4 8.0 3.8 4.6...line with a WR-62 shield. I1 L2- 7.773 mm, 2d -0.254 mm, e,. -2.2, 2b -3.95 mm w1 3 mm, m -17, n -33. 66 0. am - char. fn. 𔃺 0. am 0.36 0.35 6.40...communication trasmitter and receiver system using dielectric waveguide integrated circuits," IEEE Trans. Microwave Theory Tech, vol. M’T-24, pp. 797-803, Nov

  4. A study on the recycling of scrap integrated circuits by leaching.

    Science.gov (United States)

    Lee, Ching-Hwa; Tang, Li-Wen; Popuri, Srinivasa R

    2011-07-01

    In order to minimize the problem of pollution and to conserve limited natural resources, a method to recover the valuable metals such as gold, silver and copper) present in the scrap integrated circuits (ICs) was developed in the present study. Roasting, grinding, screening, magnetic separation, melting and leaching were adopted to investigate the efficiency of recovery of gold, silver and copper from scrap ICs. The collected scrap IC samples were roasted at 850 °C to destroy their plastic resin sealing material, followed by screening and magnetic separation to separate the metals from the resin residue. The non-ferrous materials (0.840 mm) were mainly composed of copper and could be melted into a copper alloy. Non-ferrous materials containing gold (860.05 ppm), silver (1323.12 ppm) and copper (37259.7 ppm) (size less than 50 mesh) were recovered 100% by a leaching process and thiourea was used as a leaching reagent.

  5. Device-level and module-level three-dimensional integrated circuits created using oblique processing

    Science.gov (United States)

    Burckel, D. Bruce

    2016-07-01

    This paper demonstrates that another class of three-dimensional integrated circuits (3-D-ICs) exists, distinct from through-silicon-via-centric and monolithic 3-D-ICs. Furthermore, it is possible to create devices that are 3-D "at the device level" (i.e., with active channels oriented in each of the three coordinate axes), by performing standard CMOS fabrication operations at an angle with respect to the wafer surface into high aspect ratio silicon substrates using membrane projection lithography (MPL). MPL requires only minimal fixturing changes to standard CMOS equipment, and no change to current state-of-the-art lithography. Eliminating the constraint of two-dimensional planar device architecture enables a wide range of interconnect topologies which could help reduce interconnect resistance/capacitance, and potentially improve performance.

  6. Reducing image noise in computed tomography (CT) colonography: effect of an integrated circuit CT detector.

    Science.gov (United States)

    Liu, Yu; Leng, Shuai; Michalak, Gregory J; Vrieze, Thomas J; Duan, Xinhui; Qu, Mingliang; Shiung, Maria M; McCollough, Cynthia H; Fletcher, Joel G

    2014-01-01

    To investigate whether the integrated circuit (IC) detector results in reduced noise in computed tomography (CT) colonography (CTC). Three hundred sixty-six consecutive patients underwent clinically indicated CTC using the same CT scanner system, except for a difference in CT detectors (IC or conventional). Image noise, patient size, and scanner radiation output (volume CT dose index) were quantitatively compared between patient cohorts using each detector system, with separate comparisons for the abdomen and pelvis. For the abdomen and pelvis, despite significantly larger patient sizes in the IC detector cohort (both P noise was significantly lower (both P 0.18). Based on the observed image noise reduction, radiation dose could alternatively be reduced by approximately 20% to result in similar levels of image noise. Computed tomography colonography images acquired using the IC detector had significantly lower noise than images acquired using the conventional detector. This noise reduction can permit further radiation dose reduction in CTC.

  7. Development of high speed integrated circuit for very high resolution timing measurements

    Energy Technology Data Exchange (ETDEWEB)

    Mester, Christian

    2009-10-15

    A multi-channel high-precision low-power time-to-digital converter application specific integrated circuit for high energy physics applications has been designed and implemented in a 130 nm CMOS process. To reach a target resolution of 24.4 ps, a novel delay element has been conceived. This nominal resolution has been experimentally verified with a prototype, with a minimum resolution of 19 ps. To further improve the resolution, a new interpolation scheme has been described. The ASIC has been designed to use a reference clock with the LHC bunch crossing frequency of 40 MHz and generate all required timing signals internally, to ease to use within the framework of an LHC upgrade. Special care has been taken to minimise the power consumption. (orig.)

  8. Design and testing of an integrated electronically controlled capacitor for integral and fractional horse power single phase induction motor

    International Nuclear Information System (INIS)

    Faiz, Jawad; Kasebi, F.; Pillay, P.

    2004-01-01

    This paper addresses a problem that occurs in many small appliances. As such, it is an important problem of energy utilization. To improve the performance of a single phase capacitor start/run induction motor, FET type power transistors could be used to replace a SCR H bridge. Such a configuration can lead to a simpler and more inexpensive circuit for the electronically controlled capacitor. In this paper, ICs and an OP-AMP are used to design an electronically controlled capacitor for a single phase induction motor. The design can compensate for the input voltage fluctuations that are present in the normal operation of the motor. In addition, an improvement in its performance can be obtained. At present, the use of a tachometer can be considered a disadvantage of the proposed scheme. Thus, a configuration that enables removal of the tachometer, while maintaining reasonable cost, is desirable. In addition, replacing the ac capacitor with one rated for dc can lead to a system reduction, in addition to a considerable reduction in the size of the circuit due to the use of integrated circuits

  9. Methods and tools for the evaluation of the sensitivity to natural radiations of advanced integrated circuits

    International Nuclear Information System (INIS)

    Peronnard, P.

    2009-10-01

    Atmospheric neutrons, whose fluxes and energies dependent on the altitude, the sun activity and the geographic coordinates, have been identified as being capable to provoke SEE (Single Event Effects), by indirect ionisation, in integrated devices issued from advanced manufacturing processes (nano-metric devices). This concerns not only avionics but also applications operating at ground level. The evaluation of the sensitivity to SEE provoked by natural radiation becomes thus a mandatory step during the selection of devices devoted to be included in applications requiring high reliability. The sensitivity to SEE can be mitigated by different approaches at different levels from manufacturing level (use of particular process technologies such as SOI - Silicon On Isolator -) to the system level (hardware/software redundancy). Independently of the adopted hardening approach, the so-called radiation ground testing are mandatory to evaluate the error rates of a device or a system. During such tests, the DUT (Device Under Test) is exposed to a flux of particles while it performs a given activity. For SEU (Single Event Upsets) radiation ground testing, two main strategies exist: static test: the circuit areas which are supposed to be sensitive to SEUs (registers, memories,...) are initialized with a reference pattern. The content of the sensitive area is periodically compared to the reference pattern to identify potential SEU. Dynamic test: the DUT performs an activity representative of the one it will execute during the final application. Static test: strategies are frequently adopted as they provide the intrinsic sensitivity, in terms of the average number of particles needed to provoke an SEU, of different sensitive areas of the device. From such a strategy can thus be obtained a 'worst case estimation' of the device sensitivity. This thesis aims at giving a description and validating the methodologies required to estimate the sensitivity to radiations of two types of

  10. Design and testing of an all-digital readout integrated circuit for infrared focal plane arrays

    Science.gov (United States)

    Kelly, Michael; Berger, Robert; Colonero, Curtis; Gregg, Mark; Model, Joshua; Mooney, Daniel; Ringdahl, Eric

    2005-08-01

    The digital focal plane array (DFPA) project demonstrates the enabling technologies necessary to build readout integrated circuits for very large infrared focal plane arrays (IR FPAs). Large and fast FPAs are needed for a new class of spectrally diverse sensors. Because of the requirement for high-resolution (low noise) sampling, and because of the sample rate needed for rapid acquisition of high-resolution spectra, it is highly desirable to perform analog-to-digital (A/D) conversion right at the pixel level. A dedicated A/D converter located under every pixel in a one-million-plus element array, and all-digital readout integrated circuits will enable multi- and hyper-spectral imaging systems with unprecedented spatial and spectral resolution and wide area coverage. DFPAs provide similar benefits to standard IR imaging systems as well. We have addressed the key enabling technologies for realizing the DFPA architecture in this work. Our effort concentrated on demonstrating a 60-micron footprint, 14-bit A/D converter and 2.5 Gbps, 16:1 digital multiplexer, the most basic components of the sensor. The silicon test chip was fabricated in a 0.18-micron CMOS process, and was designed to operate with HgxCd1-xTe detectors at cryogenic temperatures. Two A/D designs, one using static logic and one using dynamic logic, were built and tested for performance and power dissipation. Structures for evaluating the bit-error-rate of the multiplexer on-chip and through a differential output driver were implemented for a complete performance assessment. A unique IC probe card with fixtures to mount into an evacuated, closed-cycle helium dewar were also designed for testing up to 2.5 Gbps at temperatures as low as 50 K.

  11. Design and test of component circuits of an integrated quantum voltage noise source for Johnson noise thermometry

    Science.gov (United States)

    Yamada, Takahiro; Maezawa, Masaaki; Urano, Chiharu

    2015-11-01

    We present design and testing of a pseudo-random number generator (PRNG) and a variable pulse number multiplier (VPNM) which are digital circuit subsystems in an integrated quantum voltage noise source for Jonson noise thermometry. Well-defined, calculable pseudo-random patterns of single flux quantum pulses are synthesized with the PRNG and multiplied digitally with the VPNM. The circuit implementation on rapid single flux quantum technology required practical circuit scales and bias currents, 279 junctions and 33 mA for the PRNG, and 1677 junctions and 218 mA for the VPNM. We confirmed the circuit operation with sufficiently wide margins, 80-120%, with respect to the designed bias currents.

  12. The ALICE TPC Readout Electronics Design, performance optimization and verification of the DAQ circuit

    CERN Document Server

    Attiq, urRehman; Dieter, Røhrich

    2012-12-03

    ALICE (A Large Ion Collider Experiment) is a dedicated heavy-ion experiment at CERN’s LHC (Large Hadron Collider). It is designed to study the physics of strongly interacting matter and the quark-gluon plasma in heavy-ion collisions. It contains a large volume Time Projection Chamber (TPC) as its main tracking device. The ALICE TPC is the largest ever built gaseous TPC, both in terms of dimensions and number of read-out channels (557,578). A total number of 128 channels are packed in one TPC Front End Card (FEC) and 4,356 FECs are distributed over 216 independent readout partitions. Each readout partition steered by a single Readout Control Unit (RCU) functions as an independent unit in the data acquisition system of the TPC. The RCU functions as an interface between the FECs, Data AcQuisition system (DAQ), the Trigger and Timing Circuit (TTC) and the Detector Control System (DCS). The ALICE TPC readout electronics is in operation since the start of the LHC in November 2009. The primary objectives of the wo...

  13. CMOS-analogous wafer-scale nanotube-on-insulator approach for submicrometer devices and integrated circuits using aligned nanotubes.

    Science.gov (United States)

    Ryu, Koungmin; Badmaev, Alexander; Wang, Chuan; Lin, Albert; Patil, Nishant; Gomez, Lewis; Kumar, Akshay; Mitra, Subhasish; Wong, H-S Philip; Zhou, Chongwu

    2009-01-01

    Massive aligned carbon nanotubes hold great potential but also face significant integration/assembly challenges for future beyond-silicon nanoelectronics. We report a wafer-scale processing of aligned nanotube devices and integrated circuits, including progress on essential technological components such as wafer-scale synthesis of aligned nanotubes, wafer-scale transfer of nanotubes to silicon wafers, metallic nanotube removal and chemical doping, and defect-tolerant integrated nanotube circuits. We have achieved synthesis of massive aligned nanotubes on complete 4 in. quartz and sapphire substrates, which were then transferred to 4 in. Si/SiO(2) wafers. CMOS analogous fabrication was performed to yield transistors and circuits with features down to 0.5 mum, with high current density approximately 20 muA/mum and good on/off ratios. In addition, chemical doping has been used to build fully integrated complementary inverter with a gain approximately 5, and a defect-tolerant design has been employed for NAND and NOR gates. This full-wafer approach could serve as a critical foundation for future integrated nanotube circuits.

  14. Resonant Circuits and Introduction to Vacuum Tubes, Industrial Electronics 2: 9325.03. Course Outline.

    Science.gov (United States)

    Dade County Public Schools, Miami, FL.

    The 135 clock-hour course for the 11th year consists of outlines for blocks of instruction on series resonant circuits, parallel resonant circuits, transformer theory and application, vacuum tube fundamentals, diode vacuum tubes, triode tube construction and parameters, vacuum tube tetrodes and pentodes, beam-power and multisection tubes, and…

  15. The Electron Runaround: Understanding Electric Circuit Basics through a Classroom Activity

    Science.gov (United States)

    Singh, Vandana

    2010-01-01

    Several misconceptions abound among college students taking their first general physics course, and to some extent pre-engineering physics students, regarding the physics and applications of electric circuits. Analogies used in textbooks, such as those that liken an electric circuit to a piped closed loop of water driven by a water pump, do not…

  16. Study of an automatic readout integrated circuit for the signal shaping of the ATLAS electromagnetic calorimeter; Etude d`un circuit integre de commutation automatique de gain pour le circuit de mise en forme du signal du calorimetre electromagnetique d`ATLAS

    Energy Technology Data Exchange (ETDEWEB)

    Bussat, J.M. [Laboratoire d`Annecy-le-Vieux de Physique des Particules, 74 - Annecy-le-Vieux (France)

    1996-12-01

    This paper describes the present state of the development of an automatic readout integrated circuit that can be used, connected to the four gain shaper of LAL, at the ATLAS electromagnetic calorimeter.

  17. Displacement damage analysis and modified electrical equivalent circuit for electron and photon-irradiated silicon solar cells

    Science.gov (United States)

    Arjhangmehr, Afshin; Feghhi, Seyed Amir Hossein

    2014-10-01

    Solar modules and arrays are the conventional energy resources of space satellites. Outside the earth's atmosphere, solar panels experience abnormal radiation environments and because of incident particles, photovoltaic (PV) parameters degrade. This article tries to analyze the electrical performance of electron and photon-irradiated mono-crystalline silicon (mono-Si) solar cells. PV cells are irradiated by mono-energetic electrons and poly-energetic photons and immediately characterized after the irradiation. The mean degradation of the maximum power (Pmax) of silicon solar cells is presented and correlated using the displacement damage dose (Dd) methodology. This method simplifies evaluation of cell performance in space radiation environments and produces a single characteristic curve for Pmax degradation. Furthermore, complete analysis of the results revealed that the open-circuit voltage (Voc) and the filling factor of mono-Si cells did not significantly change during the irradiation and were independent of the radiation type and fluence. Moreover, a new technique is developed that adapts the irradiation-induced effects in a single-cell equivalent electrical circuit and adjusts its elements. The "modified circuit" is capable of modeling the "radiation damage" in the electrical behavior of mono-Si solar cells and simplifies the designing of the compensation circuits.

  18. Highly Integrated Mixed-Mode Electronics for the readout of Time Projection Chambers

    CERN Document Server

    França Santos, Hugo Miguel; Musa, Luciano

    Time Projection Chambers (TPCs) are one of the most prevalent particle trackers for high-energy physics experiments. Future planed TPCs for the International Linear Collider (ILC) and the Compact Linear Collider (CLIC) entail very high spatial resolution in large gas volumes, but impose low material budget for the end caps of the TPC cylinder. This constraint is not accomplished with the state-of-the-art front-end electronics because of its unsuited relatively large mass and of its associated water cooling system. To reach the required material budget, highly compact and power efficient dedicated TPC front-end electronics should be developed. This project aims at re-designing the different electronic elements with significant improvements in terms of performance, power efficiency and versatility, and developing an integrated circuit that merges all components of the front-end electronics. This chip ambitions a large volume production at low unitary cost and its employment in multiple detectors. The design of ...

  19. A microfluidic microprocessor: controlling biomimetic containers and cells using hybrid integrated circuit/microfluidic chips.

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A; Westervelt, Robert M

    2010-11-07

    We present an integrated platform for performing biological and chemical experiments on a chip based on standard CMOS technology. We have developed a hybrid integrated circuit (IC)/microfluidic chip that can simultaneously control thousands of living cells and pL volumes of fluid, enabling a wide variety of chemical and biological tasks. Taking inspiration from cellular biology, phospholipid bilayer vesicles are used as robust picolitre containers for reagents on the chip. The hybrid chip can be programmed to trap, move, and porate individual living cells and vesicles and fuse and deform vesicles using electric fields. The IC spatially patterns electric fields in a microfluidic chamber using 128 × 256 (32,768) 11 × 11 μm(2) metal pixels, each of which can be individually driven with a radio frequency (RF) voltage. The chip's basic functions can be combined in series to perform complex biological and chemical tasks and can be performed in parallel on the chip's many pixels for high-throughput operations. The hybrid chip operates in two distinct modes, defined by the frequency of the RF voltage applied to the pixels: Voltages at MHz frequencies are used to trap, move, and deform objects using dielectrophoresis and voltages at frequencies below 1 kHz are used for electroporation and electrofusion. This work represents an important step towards miniaturizing the complex chemical and biological experiments used for diagnostics and research onto automated and inexpensive chips.

  20. Measurement of the Boltzmann constant by Johnson noise thermometry using a superconducting integrated circuit

    Science.gov (United States)

    Urano, C.; Yamazawa, K.; Kaneko, N.-H.

    2017-12-01

    We report on our measurement of the Boltzmann constant by Johnson noise thermometry (JNT) using an integrated quantum voltage noise source (IQVNS) that is fully implemented with superconducting integrated circuit technology. The IQVNS generates calculable pseudo white noise voltages to calibrate the JNT system. The thermal noise of a sensing resistor placed at the temperature of the triple point of water was measured precisely by the IQVNS-based JNT. We accumulated data of more than 429 200 s in total (over 6 d) and used the Akaike information criterion to estimate the fitting frequency range for the quadratic model to calculate the Boltzmann constant. Upon detailed evaluation of the uncertainty components, the experimentally obtained Boltzmann constant was k=1.380 6436× {{10}-23} J K-1 with a relative combined uncertainty of 10.22× {{10}-6} . The value of k is relatively -3.56× {{10}-6} lower than the CODATA 2014 value (Mohr et al 2016 Rev. Mod. Phys. 88 035009).

  1. Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

    CERN Document Server

    Lim, Sung Kyu

    2013-01-01

    This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs.  Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the e...

  2. Synaptic and intrinsic homeostasis cooperate to optimize single neuron response properties and tune integrator circuits

    Science.gov (United States)

    2016-01-01

    Homeostatic processes that provide negative feedback to regulate neuronal firing rate are essential for normal brain function, and observations suggest that multiple such processes may operate simultaneously in the same network. We pose two questions: why might a diversity of homeostatic pathways be necessary, and how can they operate in concert without opposing and undermining each other? To address these questions, we perform a computational and analytical study of cell-intrinsic homeostasis and synaptic homeostasis in single-neuron and recurrent circuit models. We demonstrate analytically and in simulation that when two such mechanisms are controlled on a long time scale by firing rate via simple and general feedback rules, they can robustly operate in tandem to tune the mean and variance of single neuron's firing rate to desired goals. This property allows the system to recover desired behavior after chronic changes in input statistics. We illustrate the power of this homeostatic tuning scheme by using it to regain high mutual information between neuronal input and output after major changes in input statistics. We then show that such dual homeostasis can be applied to tune the behavior of a neural integrator, a system that is notoriously sensitive to variation in parameters. These results are robust to variation in goals and model parameters. We argue that a set of homeostatic processes that appear to redundantly regulate mean firing rate may work together to control firing rate mean and variance and thus maintain performance in a parameter-sensitive task such as integration. PMID:27306675

  3. An integrated circuit/microsystem/nano-enhanced four species radiation sensor for inexpensive fissionable material detection

    Science.gov (United States)

    Waguespack, Randy Paul

    2011-12-01

    Small scale radiation detectors sensitive to alpha, beta, electromagnetic, neutron radiation are needed to combat the threat of nuclear terrorism and maintain national security. There are many types of radiation detectors on the market, and the type of detector chosen is usually determined by the type of particle to be detected. In the case of fissionable material, an ideal detector needs to detect all four types of radiation, which is not the focus of many detectors. For fissionable materials, the two main types of radiation that must be detected are gamma rays and neutrons. Our detector uses a glass or quartz scintillator doped with 10B nanoparticles to detect all four types of radiation particles. Boron-10 has a thermal neutron cross section of 3,840 barns. The interaction between the neutron and boron results in a secondary charge particle in the form of an alpha particle to be emitted, which is detectable by the scintillator. Radiation impinging on the scintillator matrix produces varying optical pulses dependent on the energy of the particles. The optical pulses are then detected by a photomultiplier (PM) tube, creating a current proportional to the energy of the particle. Current pulses from the PM tube are differentiated by on-chip pulse height spectroscopy, allowing for source discrimination. The pulse height circuitry has been fabricated with discrete circuits and designed into an integrated circuit package. The ability to replace traditional PM tubes with a smaller, less expensive photomultiplier will further reduce the size of the device and enhance the cost effectiveness and portability of the detector.

  4. Inclusion of Body-Bias Effect in SPICE Modeling of 4H-SiC Integrated Circuit Resistors

    Science.gov (United States)

    Neudeck, Philip G.

    2017-01-01

    The DC electrical behavior of n-type 4H-SiC resistors used for realizing 500 C durable integrated circuits (ICs) is studied as a function of substrate bias and temperature. Improved fidelity electrical simulation is described using SPICE NMOS model to simulate resistor substrate body bias effect that is absent from the SPICE semiconductor resistor model.

  5. Inclusion of Body Bias Effect in SPICE Modeling of 4H-SiC Integrated Circuit Resistors

    Science.gov (United States)

    Neudeck, Philip G.

    2017-01-01

    The DC electrical behavior of n-type 4H-SiC resistors used for realizing 500 degrees Celsius durable integrated circuits (ICs) is studied as a function of substrate bias and temperature. Improved fidelity electrical simulation is described using SPICE NMOS model to simulate resistor substrate body bias effect that is absent from the SPICE semiconductor resistor model.

  6. Electronic plants

    Science.gov (United States)

    Stavrinidou, Eleni; Gabrielsson, Roger; Gomez, Eliot; Crispin, Xavier; Nilsson, Ove; Simon, Daniel T.; Berggren, Magnus

    2015-01-01

    The roots, stems, leaves, and vascular circuitry of higher plants are responsible for conveying the chemical signals that regulate growth and functions. From a certain perspective, these features are analogous to the contacts, interconnections, devices, and wires of discrete and integrated electronic circuits. Although many attempts have been made to augment plant function with electroactive materials, plants’ “circuitry” has never been directly merged with electronics. We report analog and digital organic electronic circuits and devices manufactured in living plants. The four key components of a circuit have been achieved using the xylem, leaves, veins, and signals of the plant as the template and integral part of the circuit elements and functions. With integrated and distributed electronics in plants, one can envisage a range of applications including precision recording and regulation of physiology, energy harvesting from photosynthesis, and alternatives to genetic modification for plant optimization. PMID:26702448

  7. Few-layer molybdenum disulfide transistors and circuits for high-speed flexible electronics.

    Science.gov (United States)

    Cheng, Rui; Jiang, Shan; Chen, Yu; Liu, Yuan; Weiss, Nathan; Cheng, Hung-Chieh; Wu, Hao; Huang, Yu; Duan, Xiangfeng

    2014-10-08

    Two-dimensional layered materials, such as molybdenum disulfide, are emerging as an exciting material system for future electronics due to their unique electronic properties and atomically thin geometry. Here we report a systematic investigation of MoS2 transistors with optimized contact and device geometry, to achieve self-aligned devices with performance including an intrinsic gain over 30, an intrinsic cut-off frequency fT up to 42 GHz and a maximum oscillation frequency fMAX up to 50 GHz, exceeding the reported values for MoS2 transistors to date (fT~0.9 GHz, fMAX~1 GHz). Our results show that logic inverters or radio frequency amplifiers can be formed by integrating multiple MoS2 transistors on quartz or flexible substrates with voltage gain in the gigahertz regime. This study demonstrates the potential of two-dimensional layered semiconductors for high-speed flexible electronics.

  8. Towards a Chemiresistive Sensor-Integrated Electronic Nose: A Review

    Directory of Open Access Journals (Sweden)

    Kea-Tiong Tang

    2013-10-01

    Full Text Available Electronic noses have potential applications in daily life, but are restricted by their bulky size and high price. This review focuses on the use of chemiresistive gas sensors, metal-oxide semiconductor gas sensors and conductive polymer gas sensors in an electronic nose for system integration to reduce size and cost. The review covers the system design considerations and the complementary metal-oxide-semiconductor integrated technology for a chemiresistive gas sensor electronic nose, including the integrated sensor array, its readout interface, and pattern recognition hardware. In addition, the state-of-the-art technology integrated in the electronic nose is also presented, such as the sensing front-end chip, electronic nose signal processing chip, and the electronic nose system-on-chip.

  9. A circuit design for front-end read-out electronics of beam homogeneity measurement

    International Nuclear Information System (INIS)

    She Qianshun; Su Hong; Xu Zhiguo; Ma Xiaoli; Hu Zhengguo; Mao Ruishi; Xu Hushan

    2011-01-01

    It introduces a circuit design of beam homogeneity measurement for heavy ion beam in the monitoring needs, which convert multichannel weak current from 10 pA to 100 nA of the output of parallel plate avalanche counter (PPAC) for large area with sensitive two-dimensional position to voltage signal from -2 V to -20 mV by current-voltage-converter (IVC) circuit which composed of T-feedback resistor networks, combined with data acquisition and processing system realized the beam homogeneity measurement in heavy ion tumor therapy of the Institute of Modern Physics. Experiments have shown that the circuit with speed and high precision. This circuit can be used for read-out of the beam for the Multiwire Proportional Chamber, Faraday Cup and other weak current sources. (authors)

  10. Design of Passive Analog Electronic Circuits Using Hybrid Modified UMDA algorithm

    Directory of Open Access Journals (Sweden)

    J. Slezak

    2015-04-01

    Full Text Available Hybrid evolutionary passive analog circuits synthesis method based on modified Univariate Marginal Distribution Algorithm (UMDA and a local search algorithm is proposed in the paper. The modification of the UMDA algorithm which allows to specify the maximum number of the nodes and the maximum number of the components of the synthesized circuit is proposed. The proposed hybrid approach efficiently reduces the number of the objective function evaluations. The modified UMDA algorithm is used for synthesis of the topology and the local search algorithm is used for determination of the parameters of the components of the designed circuit. As an example the proposed method is applied to a problem of synthesis of the fractional capacitor circuit.

  11. Proposed minimum requirements for the operational characteristics and testing of closed circuit life support system control electronics.

    Science.gov (United States)

    Kirk, J C

    1998-01-01

    The popularization and transformation of scuba diving into a broadly practiced sport has served to ignite the interest of technically oriented divers into ever more demanding areas. This, along with the gradual release of military data, equipment, and techniques of closed circuit underwater breathing apparatus, has resulted in a virtual explosion of semiclosed and closed circuit systems for divers. Although many of these systems have been carefully thought out by capable designers, the impulse to rush to market with equipment that has not been fully developed and carefully tested is irresistible to marketers. In addition, the presence of systems developed by well-intentioned and otherwise competent designers who are, nonetheless, inexperienced in the field of life support can result in the sale of failure-prone equipment to divers who lack the knowledge and skills to identify deficiencies before disaster occurs. For this reason, a set of industry standards establishing minimum requirements and testing is needed to guide the designers of this equipment, and to protect the user community from incomplete or inadequate design. Many different technologies go into the development of closed circuit scuba. One key area is the design of electronics to monitor and maintain the critical gas mixtures of the closed circuit loop. Much of the system reliability and inherent danger is resident in the design of the circuitry and the software (if any) that runs it. This article will present a set of proposed minimum requirements, with the goal of establishing a dialog for the creation of guidelines for the classification, rating, design, and testing of embedded electronics for life support systems used in closed circuit applications. These guidelines will serve as the foundation for the later creation of a set of industry specifications.

  12. Power system compensation using a power electronics integrated transformer

    OpenAIRE

    Atef Abbas Elsaharty, Mohamed; Candela García, José Ignacio; Rodríguez Cortés, Pedro

    2017-01-01

    This paper presents a new transformer, i.e., the Custom Power Active Transformer (CPAT) - which integrates shunt and series equivalent circuits within the transformer's magnetic structure. Thus, it provides power system services using a single transformer. The CPAT equipped with a power converter can be utilized in distribution systems to control grid-current and load-voltage waveforms while operating as a step-up or step-down transformer between the grid and load. Moreover, it can provide ot...

  13. The Unification of Space Qualified Integrated Circuits by Example of International Space Project GAMMA-400

    Science.gov (United States)

    Bobkov, S. G.; Serdin, O. V.; Arkhangelskiy, A. I.; Arkhangelskaja, I. V.; Suchkov, S. I.; Topchiev, N. P.

    The problem of electronic component unification at the different levels (circuits, interfaces, hardware and software) used in space industry is considered. The task of computer systems for space purposes developing is discussed by example of scientific data acquisition system for space project GAMMA-400. The basic characteristics of high reliable and fault tolerant chips developed by SRISA RAS for space applicable computational systems are given. To reduce power consumption and enhance data reliability, embedded system interconnect made hierarchical: upper level is Serial RapidIO 1x or 4x with rate transfer 1.25 Gbaud; next level - SpaceWire with rate transfer up to 400 Mbaud and lower level - MIL-STD-1553B and RS232/RS485. The Ethernet 10/100 is technology interface and provided connection with the previously released modules too. Systems interconnection allows creating different redundancy systems. Designers can develop heterogeneous systems that employ the peer-to-peer networking performance of Serial RapidIO using multiprocessor clusters interconnected by SpaceWire.

  14. Analogy for Drude’s free electron model to promote students’ understanding of electric circuits in lower secondary school

    Directory of Open Access Journals (Sweden)

    Maria José BM de Almeida

    2014-09-01

    Full Text Available Aiming at a deep understanding of some basic concepts of electric circuits in lower secondary schools, this work introduces an analogy between the behavior of children playing in a school yard with a central lake, subject to different conditions, rules, and stimuli, and Drude’s free electron model of metals. Using this analogy from the first school contacts with electric phenomena, one can promote students’ understanding of concepts such as electric current, the role of generators, potential difference effects, energy transfer, open and closed circuits, resistances, and their combinations in series and parallel. One believes that through this analogy well-known previous misconceptions of young students about electric circuit behaviors can be overcome. Furthermore, students’ understanding will enable them to predict, and justify with self-constructed arguments, the behavior of different elementary circuits. The students’ predictions can be verified—as a challenge of self-produced understanding schemes—using laboratory experiments. At a preliminary stage, our previsions were confirmed through a pilot study with three classrooms of 9th level Portuguese students.

  15. Synchronic, optical transmission data link integrated with FPGA circuits (for TESLA LLRF control system)

    Energy Technology Data Exchange (ETDEWEB)

    Zielinski, J.S.

    2006-07-15

    The X-ray free-electron laser X-FEL that is being planned at the DESY research center in cooperation with European partners will produce high-intensity ultra-short X-ray flashes with the properties of laser light. This new light source, which can only be described in terms of superlatives, will open up a whole range of new possibilities for the natural sciences. It could also offer very promising opportunities for industrial users. SIMCON (SIMulator and CONtroller) is the project of the fast, low latency digital controller dedicated to the LLRF1 system in VUV FEL experiment It is being developed by the ELHEP2 group in the Institute of Electronic Systems at Warsaw University of Technology. The main purpose of the project is to create a controller to stabilize the vector sum of fields in cavities of one cryo-module in the experiment. The device can be also used as the simulator of the cavity and test bench for other devices. The synchronic, optical link project was made for the accelerator X-FEL laser TESLA, the LLRF control system experiment at DESY, Hamburg. The control and diagnostic data is transmitted up to 2.5Gbit/s through a plastic fiber in a distance up to a few hundred meters. The link is synchronized once after power up, and never resynchronized when data is transmitted with maximum speed. The one way link bit error rate is less then 10{sup -15}. The transceiver component written in VHDL that works in the dedicated Altera registered Stratix registered GX FPGA circuit. During the work in the PERG laboratory a 2,5Gbit/s serial link with the long vector parallel interface transceiver was created. Long-Data-Vector transceiver transmits 16bit vector each 8ns with 120ns latency. (orig.)

  16. Synchronic, optical transmission data link integrated with FPGA circuits (for TESLA LLRF control system)

    International Nuclear Information System (INIS)

    Zielinski, J.S.

    2006-05-01

    The X-ray free-electron laser X-FEL that is being planned at the DESY research center in cooperation with European partners will produce high-intensity ultra-short X-ray flashes with the properties of laser light. This new light source, which can only be described in terms of superlatives, will open up a whole range of new possibilities for the natural sciences. It could also offer very promising opportunities for industrial users. SIMCON (SIMulator and CONtroller) is the project of the fast, low latency digital controller dedicated to the LLRF1 system in VUV FEL experiment It is being developed by the ELHEP2 group in the Institute of Electronic Systems at Warsaw University of Technology. The main purpose of the project is to create a controller to stabilize the vector sum of fields in cavities of one cryo-module in the experiment. The device can be also used as the simulator of the cavity and test bench for other devices. The synchronic, optical link project was made for the accelerator X-FEL laser TESLA, the LLRF control system experiment at DESY, Hamburg. The control and diagnostic data is transmitted up to 2.5Gbit/s through a plastic fiber in a distance up to a few hundred meters. The link is synchronized once after power up, and never resynchronized when data is transmitted with maximum speed. The one way link bit error rate is less then 10 -15 . The transceiver component written in VHDL that works in the dedicated Altera registered Stratix registered GX FPGA circuit. During the work in the PERG laboratory a 2,5Gbit/s serial link with the long vector parallel interface transceiver was created. Long-Data-Vector transceiver transmits 16bit vector each 8ns with 120ns latency. (orig.)

  17. The Tendency of the Crest Factor Helps Detect Nascent Events; Electronic Circuit, Software and Applications to Signals from Diverse Fields

    Directory of Open Access Journals (Sweden)

    Núñez-Pérez Ricardo Francisco

    2014-04-01

    Full Text Available Within the signal analysis techniques in the time domain, the crest factor (CF is undoubtedly one of the most simple and fast to implement using electronic circuits and/or software. That's why it has been used reliably to care for machinery and to evaluate the quality of supply. One of the major manufacturers of instruments for these purposes is Bruel and Kjaer and defines the crest factor of voltage or repetitive current signal as the ratio of the peak level and its rms value during a certain period of time. In this paper, we try to find out experimentally the potential of CF and their tendency to detect the nascent and evolution of events in various fields of knowledge, either by generating it with a developed electronic circuit, or with calculations, through routines that are performed with the programs DADISP and LabVIEW. The results are validated and checked for all the above factors and trends through a comparison between them and the proposed features and specifications. The results were acceptable so that the tools were applied to detect early faults in electrical machines, to identify chaosity differences between the circuits with these dynamics, to detect abnormal respiratory distress or rales in patients and to detect harmful distortions in the electrical current, all this based on simulations and measurements for each of the 4 cases studied. Other CF original applications proposed are: a control of chaos in electronic circuits that stir/ mix industrial processes and b correct the power factor of non-linear and inductive loads. A medium-term study and use a CF that considers the maximum signal peak to peak is contemplated, and it is thought that it can improve event detection

  18. Data acquisition interface for calculating heat diffusion in certain electronic circuits; Interface d`acquisition des donnees permettant le calcul de la diffusion de la chaleur dans certains circuits electroniques

    Energy Technology Data Exchange (ETDEWEB)

    Spiesser, Ph.

    1996-05-01

    A user interface has been developed for geometrical and thermal data acquisition, in order to allow calculations of heat diffusion in certain types of electronic circuits such as power hybrids and compact electronic modules, using computerized simulations. Data management, structure and organization, the data acquisition interface program, and variables and sources, are described

  19. Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry

    Directory of Open Access Journals (Sweden)

    Yun Liu

    2018-01-01

    Full Text Available With the intensification of international competition, there are many international technological collaborations in the integrated circuit manufacturing (ICM industry. The importance of improving the level of international technological collaboration is becoming more and more prominent. Therefore, it is vital for a country, a region, or an institution to understand the international technological collaboration characteristics of the ICM industry and, thus, to know how to enhance its own international technological collaboration. This paper depicts the international technological collaboration characteristics of the ICM industry based on patent analysis. Four aspects, which include collaboration patterns, collaboration networks, collaboration institutions, and collaboration impacts, are analyzed by utilizing patent association analysis and social network analysis. The findings include the following: first, in regard to international technological collaboration, the USA has the highest level, while Germany has great potential for future development; second, Asia and Europe have already formed clusters, respectively, in the cooperative network; last, but not least, research institutions, colleges, and universities should also actively participate in international collaboration. In general, this study provides an objective reference for policy making, competitiveness, and sustainability in the ICM industry. The framework presented in this paper could be applied to examine other industrial international technological collaborations.

  20. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure

    Science.gov (United States)

    Chen, Meng; Lei, Jiefeng; Huang, Shengxiang; Liao, Congwei; Deng, Lianwen

    2017-06-01

    A p-type low-temperature poly-Si thin film transistors (LTPS TFTs) integrated gate driver using 2 non-overlapped clocks is proposed. This gate driver features charge-sharing structure to turn off buffer TFT and suppresses voltage feed-through effects. It is analyzed that the conventional gate driver suffers from waveform distortions due to voltage uncertainty of internal nodes for the initial period. The proposed charge-sharing structure also helps to suppress the unexpected pulses during the initialization phases. The proposed gate driver shows a simple circuit, as only 6 TFTs and 1 capacitor are used for single-stage, and the buffer TFT is used for both pulling-down and pulling-up of output electrode. Feasibility of the proposed gate driver is proven through detailed analyses. Investigations show that voltage bootrapping can be maintained once the bootrapping capacitance is larger than 0.8 pF, and pulse of gate driver outputs can be reduced to 5 μs. The proposed gate driver can still function properly with positive {V}{TH} shift within 0.4 V and negative {V}{TH} shift within -1.2 V and it is robust and promising for high-resolution display. Project supported by the Science and Technology Project of Hunan Province, China (No. 2015JC3401)