Wolfendale, E
2013-01-01
MOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit desi
Integrated circuit design using design automation
International Nuclear Information System (INIS)
Gwyn, C.W.
1976-09-01
Although the use of computer aids to develop integrated circuits is relatively new at Sandia, the program has been very successful. The results have verified the utility of the in-house CAD design capability. Custom IC's have been developed in much shorter times than available through semiconductor device manufacturers. In addition, security problems were minimized and a saving was realized in circuit cost. The custom CMOS IC's were designed at less than half the cost of designing with conventional techniques. In addition to the computer aided design, the prototype fabrication and testing capability provided by the semiconductor development laboratory and microelectronics computer network allows the circuits to be fabricated and evaluated before the designs are transferred to the commercial semiconductor manufacturers for production. The Sandia design and prototype fabrication facilities provide the capability of complete custom integrated circuit development entirely within the ERDA laboratories
Semiconductors integrated circuit design for manufacturability
Balasinki, Artur
2011-01-01
Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That's why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotl
Design of analog integrated circuits and systems
Laker, Kenneth R
1994-01-01
This text is designed for senior or graduate level courses in analog integrated circuits or design of analog integrated circuits. This book combines consideration of CMOS and bipolar circuits into a unified treatment. Also included are CMOS-bipolar circuits made possible by BiCMOS technology. The text progresses from MOS and bipolar device modelling to simple one and two transistor building block circuits. The final two chapters present a unified coverage of sample-data and continuous-time signal processing systems.
An analog integrated circuit design laboratory
Mondragon-Torres, A.F.; Mayhugh, Jr.; Pineda de Gyvez, J.; Silva-Martinez, J.; Sanchez-Sinencio, E.
2003-01-01
We present the structure of an analog integrated circuit design laboratory to instruct at both, senior undergraduate and entry graduate levels. The teaching material includes: a laboratory manual with analog circuit design theory, pre-laboratory exercises and circuit design specifications; a reference web page with step by step instructions and examples; the use of mathematical tools for automation and analysis; and state of the art CAD design tools in use by industry. Upon completion of the ...
Design of 3D integrated circuits and systems
Sharma, Rohit
2014-01-01
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and sys
Design optimization of radiation-hardened CMOS integrated circuits
International Nuclear Information System (INIS)
1975-01-01
Ionizing-radiation-induced threshold voltage shifts in CMOS integrated circuits will drastically degrade circuit performance unless the design parameters related to the fabrication process are properly chosen. To formulate an approach to CMOS design optimization, experimentally observed analytical relationships showing strong dependences between threshold voltage shifts and silicon dioxide thickness are utilized. These measurements were made using radiation-hardened aluminum-gate CMOS inverter circuits and have been corroborated by independent data taken from MOS capacitor structures. Knowledge of these relationships allows one to define ranges of acceptable CMOS design parameters based upon radiation-hardening capabilities and post-irradiation performance specifications. Furthermore, they permit actual design optimization of CMOS integrated circuits which results in optimum pre- and post-irradiation performance with respect to speed, noise margins, and quiescent power consumption. Theoretical and experimental results of these procedures, the applications of which can mean the difference between failure and success of a CMOS integrated circuit in a radiation environment, are presented
Experimental Device for Learning of Logical Circuit Design using Integrated Circuits
石橋, 孝昭
2012-01-01
This paper presents an experimental device for learning of logical circuit design using integrated circuits and breadboards. The experimental device can be made at a low cost and can be used for many subjects such as logical circuits, computer engineering, basic electricity, electrical circuits and electronic circuits. The proposed device is effective to learn the logical circuits than the usual lecture.
Analog integrated circuits design for processing physiological signals.
Li, Yan; Poon, Carmen C Y; Zhang, Yuan-Ting
2010-01-01
Analog integrated circuits (ICs) designed for processing physiological signals are important building blocks of wearable and implantable medical devices used for health monitoring or restoring lost body functions. Due to the nature of physiological signals and the corresponding application scenarios, the ICs designed for these applications should have low power consumption, low cutoff frequency, and low input-referred noise. In this paper, techniques for designing the analog front-end circuits with these three characteristics will be reviewed, including subthreshold circuits, bulk-driven MOSFETs, floating gate MOSFETs, and log-domain circuits to reduce power consumption; methods for designing fully integrated low cutoff frequency circuits; as well as chopper stabilization (CHS) and other techniques that can be used to achieve a high signal-to-noise performance. Novel applications using these techniques will also be discussed.
Power management techniques for integrated circuit design
Chen, Ke-Horng
2016-01-01
This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. * A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management * Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes * Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience * Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors manuals, and program downloads.
Macromodels of digital integrated circuits for program packages of circuit engineering design
Petrenko, A. I.; Sliusar, P. B.; Timchenko, A. P.
1984-04-01
Various aspects of the generation of macromodels of digital integrated circuits are examined, and their effective application in program packages of circuit engineering design is considered. Three levels of macromodels are identified, and the application of such models to the simulation of circuit outputs is discussed.
Design structure for in-system redundant array repair in integrated circuits
Bright, Arthur A.; Crumley, Paul G.; Dombrowa, Marc; Douskey, Steven M.; Haring, Rudolf A.; Oakland, Steven F.; Quellette, Michael R.; Strissel, Scott A.
2008-11-25
A design structure for repairing an integrated circuit during operation of the integrated circuit. The integrated circuit comprising of a multitude of memory arrays and a fuse box holding control data for controlling redundancy logic of the arrays. The design structure provides the integrated circuit with a control data selector for passing the control data from the fuse box to the memory arrays; providing a source of alternate control data, external of the integrated circuit; and connecting the source of alternate control data to the control data selector. The design structure further passes the alternate control data from the source thereof, through the control data selector and to the memory arrays to control the redundancy logic of the memory arrays.
A new integrated microwave SQUID circuit design
International Nuclear Information System (INIS)
Erne, S.N.; Finnegan, T.F.
1980-01-01
In this paper we consider the design and operation of a planar thin-film rf-SQUID circuit which can be realized via microwave-integrated-circuit (MIC) techniques and which differs substantially from pervious microwave SQUID configurations involving either mechanical point-contact or cylindrical thin-film micro-bridge geometries. (orig.)
CMOS analog integrated circuit design technology; CMOS anarogu IC sekkei gijutsu
Energy Technology Data Exchange (ETDEWEB)
Fujimoto, H.; Fujisawa, A. [Fuji Electric Co. Ltd., Tokyo (Japan)
2000-08-10
In the field of the LSI (large scale integrated circuit) in rapid progress toward high integration and advanced functions, CAD (computer-aided design) technology has become indispensable to LSI development within a short period. Fuji Electric has developed design technologies and automatic design system to develop high-quality analog ICs (integrated circuits), including power supply ICs. within a short period. This paper describes CMOS (complementary metal-oxide semiconductor) analog macro cell, circuit simulation, automatic routing, and backannotation technologies. (author)
CMOS analog integrated circuits high-speed and power-efficient design
Ndjountche, Tertulien
2011-01-01
High-speed, power-efficient analog integrated circuits can be used as standalone devices or to interface modern digital signal processors and micro-controllers in various applications, including multimedia, communication, instrumentation, and control systems. New architectures and low device geometry of complementary metaloxidesemiconductor (CMOS) technologies have accelerated the movement toward system on a chip design, which merges analog circuits with digital, and radio-frequency components. CMOS: Analog Integrated Circuits: High-Speed and Power-Efficient Design describes the important tren
High-frequency analog integrated circuit design
1995-01-01
To learn more about designing analog integrated circuits (ICs) at microwave frequencies using GaAs materials, turn to this text and reference. It addresses GaAs MESFET-based IC processing. Describes the newfound ability to apply silicon analog design techniques to reliable GaAs materials and devices which, until now, was only available through technical papers scattered throughout hundred of articles in dozens of professional journals.
Radio frequency integrated circuit design for cognitive radio systems
Fahim, Amr
2015-01-01
This book fills a disconnect in the literature between Cognitive Radio systems and a detailed account of the circuit implementation and architectures required to implement such systems. Throughout the book, requirements and constraints imposed by cognitive radio systems are emphasized when discussing the circuit implementation details. In addition, this book details several novel concepts that advance state-of-the-art cognitive radio systems. This is a valuable reference for anybody with background in analog and radio frequency (RF) integrated circuit design, needing to learn more about integrated circuits requirements and implementation for cognitive radio systems. · Describes in detail cognitive radio systems, as well as the circuit implementation and architectures required to implement them; · Serves as an excellent reference to state-of-the-art wideband transceiver design; · Emphasizes practical requirements and constraints imposed by cognitive radi...
McConkey, M. L.
1984-12-01
A complete CMOS/BULK design cycle has been implemented and fully tested to evaluate its effectiveness and a viable set of computer-aided design tools for the layout, verification, and simulation of CMOS/BULK integrated circuits. This design cycle is good for p-well, n-well, or twin-well structures, although current fabrication technique available limit this to p-well only. BANE, an integrated layout program from Stanford, is at the center of this design cycle and was shown to be simple to use in the layout of CMOS integrated circuits (it can be also used to layout NMOS integrated circuits). A flowchart was developed showing the design cycle from initial layout, through design verification, and to circuit simulation using NETLIST, PRESIM, and RNL from the University of Washington. A CMOS/BULK library was designed and includes logic gates that were designed and completely tested by following this flowchart. Also designed was an arithmetic logic unit as a more complex test of the CMOS/BULK design cycle.
Trends in integrated circuit design for particle physics experiments
International Nuclear Information System (INIS)
Atkin, E V
2017-01-01
Integrated circuits are one of the key complex units available to designers of multichannel detector setups. A whole number of factors makes Application Specific Integrated Circuits (ASICs) valuable for Particle Physics and Astrophysics experiments. Among them the most important ones are: integration scale, low power dissipation, radiation tolerance. In order to make possible future experiments in the intensity, cosmic, and energy frontiers today ASICs should provide new level of functionality at a new set of constraints and trade-offs, like low-noise high-dynamic range amplification and pulse shaping, high-speed waveform sampling, low power digitization, fast digital data processing, serialization and data transmission. All integrated circuits, necessary for physical instrumentation, should be radiation tolerant at an earlier not reached level (hundreds of Mrad) of total ionizing dose and allow minute almost 3D assemblies. The paper is based on literary source analysis and presents an overview of the state of the art and trends in nowadays chip design, using partially own ASIC lab experience. That shows a next stage of ising micro- and nanoelectronics in physical instrumentation. (paper)
Digital integrated circuit design using Verilog and SystemVerilog
Mehler, Ronald W
2014-01-01
For those with a basic understanding of digital design, this book teaches the essential skills to design digital integrated circuits using Verilog and the relevant extensions of SystemVerilog. In addition to covering the syntax of Verilog and SystemVerilog, the author provides an appreciation of design challenges and solutions for producing working circuits. The book covers not only the syntax and limitations of HDL coding, but deals extensively with design problems such as partitioning and synchronization, helping you to produce designs that are not only logically correct, but will actually
Ultra-low power integrated circuit design circuits, systems, and applications
Li, Dongmei; Wang, Zhihua
2014-01-01
This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.
Lin, Wei-Liang; Cheng, Wang-Chuan; Wu, Chen-Hao; Wu, Hai-Ming; Wu, Chang-Yu; Ho, Kuan-Hsuan; Chan, Chueh-An
2010-01-01
This work describes a novel, first-year graduate-level analog integrated circuit (IC) design course. The course teaches students analog circuit design; an external manufacturer then produces their designs in three different silicon chips. The students, working in pairs, then test these chips to verify their success. All work is completed within…
Ultra low-power integrated circuit design for wireless neural interfaces
Holleman, Jeremy; Otis, Brian
2014-01-01
Presenting results from real prototype systems, this volume provides an overview of ultra low-power integrated circuits and systems for neural signal processing and wireless communication. Topics include analog, radio, and signal processing theory and design for ultra low-power circuits.
Design automation for integrated nonlinear logic circuits (Conference Presentation)
Van Vaerenbergh, Thomas; Pelc, Jason; Santori, Charles; Bose, Ranojoy; Kielpinski, Dave; Beausoleil, Raymond G.
2016-05-01
A key enabler of the IT revolution of the late 20th century was the development of electronic design automation (EDA) tools allowing engineers to manage the complexity of electronic circuits with transistor counts now reaching into the billions. Recently, we have been developing large-scale nonlinear photonic integrated logic circuits for next generation all-optical information processing. At this time a sufficiently powerful EDA-style software tool chain to design this type of complex circuits does not yet exist. Here we describe a hierarchical approach to automating the design and validation of photonic integrated circuits, which can scale to several orders of magnitude higher complexity than the state of the art. Most photonic integrated circuits developed today consist of a small number of components, and only limited hierarchy. For example, a simple photonic transceiver may contain on the order of 10 building-block components, consisting of grating couplers for photonic I/O, modulators, and signal splitters/combiners. Because this is relatively easy to lay out by hand (or simple script) existing photonic design tools have relatively little automation in comparison to electronics tools. But demonstrating all-optical logic will require significantly more complex photonic circuits containing up to 1,000 components, hence becoming infeasible to design manually. Our design framework is based off Python-based software from Luceda Photonics which provides an environment to describe components, simulate their behavior, and export design files (GDS) to foundries for fabrication. At a fundamental level, a photonic component is described as a parametric cell (PCell) similarly to electronics design. PCells are described by geometric characteristics of their layout. A critical part of the design framework is the implementation of PCells as Python objects. PCell objects can then use inheritance to simplify design, and hierarchical designs can be made by creating composite
Designing charge-sensitive preamplifiers based on low-noise analog integrated circuits
International Nuclear Information System (INIS)
Agakhanyan, T.M.
1998-01-01
The methodology for designing charge-sensitive preamplifiers on the low-noise analog integral circuits, including all the stages: the mathematical synthesis with optimization of the intermediate function; the scheme-technical synthesis with parametric optimization of the scheme and analysis of draft projects with the parameter verification is presented. The designing is conducted on the basis of requirements for signal parameters and noise indices of the preamplifier. The system of automated designing of the charge-sensitive preamplifiers on the low-noise analog integral circuits is developed [ru
Reagor, James A; Holt, David W
2016-03-01
Advances in technology, the desire to minimize blood product transfusions, and concerns relating to inflammatory mediators have lead many practitioners and manufacturers to minimize cardiopulmonary bypass (CBP) circuit designs. The oxygenator and arterial line filter (ALF) have been integrated into one device as a method of attaining a reduction in prime volume and surface area. The instructions for use of a currently available oxygenator with integrated ALF recommends incorporating a recirculation line distal to the oxygenator. However, according to an unscientific survey, 70% of respondents utilize CPB circuits incorporating integrated ALFs without a path of recirculation distal to the oxygenator outlet. Considering this circuit design, the ability to quickly remove a gross air bolus in the blood path distal to the oxygenator may be compromised. This in vitro study was designed to determine if the time required to remove a gross air bolus from a CPB circuit without a path of recirculation distal to the oxygenator will be significantly longer than that of a circuit with a path of recirculation distal to the oxygenator. A significant difference was found in the mean time required to remove a gross air bolus between the circuit designs (p = .0003). Additionally, There was found to be a statistically significant difference in the mean time required to remove a gross air bolus between Trial 1 and Trials 4 (p = .015) and 5 (p =.014) irrespective of the circuit design. Under the parameters of this study, a recirculation line distal to an oxygenator with an integrated ALF significantly decreases the time it takes to remove an air bolus from the CPB circuit and may be safer for clinical use than the same circuit without a recirculation line.
Integrated circuits, and design and manufacture thereof
Auracher, Stefan; Pribbernow, Claus; Hils, Andreas
2006-04-18
A representation of a macro for an integrated circuit layout. The representation may define sub-circuit cells of a module. The module may have a predefined functionality. The sub-circuit cells may include at least one reusable circuit cell. The reusable circuit cell may be configured such that when the predefined functionality of the module is not used, the reusable circuit cell is available for re-use.
Directory of Open Access Journals (Sweden)
Lun Li
2006-04-01
Full Text Available The correct design of complex hardware continues to challenge engineers. Bugs in a design that are not uncovered in early design stages can be extremely expensive. Simulation is a predominantly used tool to validate a design in industry. Formal verification overcomes the weakness of exhaustive simulation by applying mathematical methodologies to validate a design. The work described here focuses upon a technique that integrates the best characteristics of both simulation and formal verification methods to provide an effective design validation tool, referred as Integrated Design Validation (IDV. The novelty in this approach consists of three components, circuit complexity analysis, partitioning based on design hierarchy, and coverage analysis. The circuit complexity analyzer and partitioning decompose a large design into sub-components and feed sub-components to different verification and/or simulation tools based upon known existing strengths of modern verification and simulation tools. The coverage analysis unit computes the coverage of design validation and improves the coverage by further partitioning. Various simulation and verification tools comprising IDV are evaluated and an example is used to illustrate the overall validation process. The overall process successfully validates the example to a high coverage rate within a short time. The experimental result shows that our approach is a very promising design validation method.
Design of a semi-custom integrated circuit for the SLAC SLC timing control system
International Nuclear Information System (INIS)
Linstadt, E.
1984-10-01
A semi-custom (gate array) integrated circuit has been designed for use in the SLAC Linear Collider timing and control system. The design process and SLAC's experiences during the phases of the design cycle are described. Issues concerning the partitioning of the design into semi-custom and standard components are discussed. Functional descriptions of the semi-custom integrated circuit and the timing module in which it is used are given
CMOS circuit design, layout and simulation
Baker, R Jacob
2010-01-01
The Third Edition of CMOS Circuit Design, Layout, and Simulation continues to cover the practical design of both analog and digital integrated circuits, offering a vital, contemporary view of a wide range of analog/digital circuit blocks including: phase-locked-loops, delta-sigma sensing circuits, voltage/current references, op-amps, the design of data converters, and much more. Regardless of one's integrated circuit (IC) design skill level, this book allows readers to experience both the theory behind, and the hands-on implementation of, complementary metal oxide semiconductor (CMOS) IC design via detailed derivations, discussions, and hundreds of design, layout, and simulation examples.
Design, Fabrication and Integration of a NaK-Cooled Circuit
International Nuclear Information System (INIS)
Garber, Anne; Godfroy, Thomas
2006-01-01
The Early Flight Fission Test Facilities (EFF-TF) team has been tasked by the NASA Marshall Space Flight Center Nuclear Systems Office to design, fabricate, and test an actively pumped alkali metal flow circuit. The system, which was originally designed for use with a eutectic mixture of sodium potassium (NaK), was redesigned for use with lithium. Due to a shift in focus, it is once again being prepared for use with NaK. Changes made to the actively pumped, high temperature circuit include the replacement of the expansion reservoir, addition of remotely operated valves, and modification of the support table. Basic circuit components include: reactor segment, NaK to gas heat exchanger, electromagnetic (EM) liquid metal pump, load/drain reservoir, expansion reservoir, instrumentation, and a spill reservoir. A 37-pin partial-array core (pin and flow path dimensions are the same as those in a full design) was selected for fabrication and test. This paper summarizes the integration and preparations for the fill of the pumped NaK circuit. (authors)
Secure integrated circuits and systems
Verbauwhede, Ingrid MR
2010-01-01
On any advanced integrated circuit or 'system-on-chip' there is a need for security. In many applications the actual implementation has become the weakest link in security rather than the algorithms or protocols. The purpose of the book is to give the integrated circuits and systems designer an insight into the basics of security and cryptography from the implementation point of view. As a designer of integrated circuits and systems it is important to know both the state-of-the-art attacks as well as the countermeasures. Optimizing for security is different from optimizations for speed, area,
Radio-frequency integrated-circuit engineering
Nguyen, Cam
2015-01-01
Radio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC's using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. Provide
ESD analog circuits and design
Voldman, Steven H
2014-01-01
A comprehensive and in-depth review of analog circuit layout, schematic architecture, device, power network and ESD design This book will provide a balanced overview of analog circuit design layout, analog circuit schematic development, architecture of chips, and ESD design. It will start at an introductory level and will bring the reader right up to the state-of-the-art. Two critical design aspects for analog and power integrated circuits are combined. The first design aspect covers analog circuit design techniques to achieve the desired circuit performance. The second and main aspect pres
Integrated Circuit Design in US High-Energy Physics
Energy Technology Data Exchange (ETDEWEB)
Geronimo, G. D. [Brookhaven National Lab. (BNL), Upton, NY (United States); Christian, D. [Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States); Bebek, C. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Garcia-Sciveres, M. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Lippe, H. V. D. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Haller, G. [SLAC National Accelerator Lab., Menlo Park, CA (United States); Grillo, AA [Univ. of California, Santa Cruz, CA (United States); Newcomer, M [Univ. of Pennsylvania, Philadelphia, PA (United States)
2013-07-10
This whitepaper summarizes the status, plans, and challenges in the area of integrated circuit design in the United States for future High Energy Physics (HEP) experiments. It has been submitted to CPAD (Coordinating Panel for Advanced Detectors) and the HEP Community Summer Study 2013(Snowmass on the Mississippi) held in Minnesota July 29 to August 6, 2013. A workshop titled: US Workshop on IC Design for High Energy Physics, HEPIC2013 was held May 30 to June 1, 2013 at Lawrence Berkeley National Laboratory (LBNL). A draft of the whitepaper was distributed to the attendees before the workshop, the content was discussed at the meeting, and this document is the resulting final product. The scope of the whitepaper includes the following topics: Needs for IC technologies to enable future experiments in the three HEP frontiers Energy, Cosmic and Intensity Frontiers; Challenges in the different technology and circuit design areas and the related R&D needs; Motivation for using different fabrication technologies; Outlook of future technologies including 2.5D and 3D; Survey of ICs used in current experiments and ICs targeted for approved or proposed experiments; IC design at US institutes and recommendations for collaboration in the future.
Integrated electric circuit engineering system in LSI design center, Konami Kogyo Co. Ltd
Energy Technology Data Exchange (ETDEWEB)
Kamitsuki, Kagehiko; Tanaka, Tomiaki
1988-08-26
Development of the integrated engineering system is presented which designs and manufactures the hardwares, softwares and cases of electronic game products with LSI integratedly as an experiment. The system is intended to reduce the number of each development of the parts, to verify each other by comparing each parts with the product concept during the development, to reduce modifications, and to shorten development periods. The main subsystems are an electric circuit CAD for LSI designs and a mechanical CAD for case or printed circuit board designs. The LSI development period has been shortened up to one month by a larger capacity computer and higher speed simulator, and the electric circuit engineering system capable of keeping step with the software development has been approximately completed. In the future, the system will be intended to introduce an expert system or a visual system capable of predicting the final product during a logical design period. (10 figs, 1 photo)
2018-01-01
HAS BEEN REVIEWED AND IS APPROVED FOR PUBLICATION IN ACCORDANCE WITH ASSIGNED DISTRIBUTION STATEMENT. FOR THE CHIEF ENGINEER : / S / / S...bridged high-performance computing, nanotechnology , and integrated circuits & systems. 15. SUBJECT TERMS neuromorphic computing, neuron design, spike...multidisciplinary effort encompassed high-performance computing, nanotechnology , integrated circuits, and integrated systems. The project’s architecture was
Design and characterization of integrated components for SiN photonic quantum circuits.
Poot, Menno; Schuck, Carsten; Ma, Xiao-Song; Guo, Xiang; Tang, Hong X
2016-04-04
The design, fabrication, and detailed calibration of essential building blocks towards fully integrated linear-optics quantum computation are discussed. Photonic devices are made from silicon nitride rib waveguides, where measurements on ring resonators show small propagation losses. Directional couplers are designed to be insensitive to fabrication variations. Their offset and coupling lengths are measured, as well as the phase difference between the transmitted and reflected light. With careful calibrations, the insertion loss of the directional couplers is found to be small. Finally, an integrated controlled-NOT circuit is characterized by measuring the transmission through different combinations of inputs and outputs. The gate fidelity for the CNOT operation with this circuit is estimated to be 99.81% after post selection. This high fidelity is due to our robust design, good fabrication reproducibility, and extensive characterizations.
Radiation-hardened CMOS integrated circuits
International Nuclear Information System (INIS)
Derbenwick, G.F.; Hughes, R.C.
1977-01-01
Electronic circuits that operate properly after exposure to ionizing radiation are necessary for nuclear weapon systems, satellites, and apparatus designed for use in radiation environments. The program to develop and theoretically model radiation-tolerant integrated circuit components has resulted in devices that show an improvement in hardness up to a factor of ten thousand over earlier devices. An inverter circuit produced functions properly after an exposure of 10 6 Gy (Si) which, as far as is known, is the record for an integrated circuit
Allen, Phillip E
1987-01-01
This text presents the principles and techniques for designing analog circuits to be implemented in a CMOS technology. The level is appropriate for seniors and graduate students familiar with basic electronics, including biasing, modeling, circuit analysis, and some familiarity with frequency response. Students learn the methodology of analog integrated circuit design through a hierarchically-oriented approach to the subject that provides thorough background and practical guidance for designing CMOS analog circuits, including modeling, simulation, and testing. The authors' vast industrial experience and knowledge is reflected in the circuits, techniques, and principles presented. They even identify the many common pitfalls that lie in the path of the beginning designer--expert advice from veteran designers. The text mixes the academic and practical viewpoints in a treatment that is neither superficial nor overly detailed, providing the perfect balance.
Sequential circuit design for radiation hardened multiple voltage integrated circuits
Clark, Lawrence T [Phoenix, AZ; McIver, III, John K.
2009-11-24
The present invention includes a radiation hardened sequential circuit, such as a bistable circuit, flip-flop or other suitable design that presents substantial immunity to ionizing radiation while simultaneously maintaining a low operating voltage. In one embodiment, the circuit includes a plurality of logic elements that operate on relatively low voltage, and a master and slave latches each having storage elements that operate on a relatively high voltage.
Top-down design and verification methodology for analog mixed-signal integrated circuits
Beviz, P.
2016-01-01
The current report contains the introduction of a novel Top-Down Design and Verification methodology for AMS integrated circuits. With the introduction of new design and verification flow, more reliable and efficient development of AMS ICs is possible. The assignment incorporated the research on the
Designing TSVs for 3D Integrated Circuits
Khan, Nauman
2013-01-01
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available....
Micro-relay technology for energy-efficient integrated circuits
Kam, Hei
2015-01-01
This book describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers and highlights the importance of co-design across design hierarchies when optimizing system performance (in this case, energy-efficiency). This book is ideal for researchers and engineers focused on semiconductors, integrated circuits, and energy efficient electronics. This book also: · Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture, and CAD · Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design · Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more
Vertically Integrated Circuits at Fermilab
International Nuclear Information System (INIS)
Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom
2009-01-01
The exploration of the vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. The consortium has submitted over 25 different designs for the Fermilab organized MPW run organized for the first time.
Effective Teaching of the Physical Design of Integrated Circuits Using Educational Tools
Aziz, Syed Mahfuzul; Sicard, Etienne; Ben Dhia, Sonia
2010-01-01
This paper presents the strategies used for effective teaching and skill development in integrated circuit (IC) design using project-based learning (PBL) methodologies. It presents the contexts in which these strategies are applied to IC design courses at the University of South Australia, Adelaide, Australia, and the National Institute of Applied…
Digital logic circuit design with ALTERA MAX+PLUS II
International Nuclear Information System (INIS)
Lee, Seung Ho; Park, Yong Su; Lee, Ju Heon
2006-03-01
Contents of this book are the kinds of integrated circuit, design process of integrated circuit, introduction of ALTERA MAX+PLUS II, designing logic circuit with VHDL of ALTERA MAX+PLUS II, grammar and practice of VHDL of ALTERA MAX+PLUS II, design for adder, subtractor, parallel binary subtractor, BCD design, CLA design, code converter design, ALU design, register design, counter design, accumulator design, state machine design, frequency divider design, circuit design with TENMILLION counter, LCD module, circuit design for control the outside RAM in training kit and introduction for HEB-DTK-20K-240/HBE-DTK-IOK.
Computer-aided engineering of semiconductor integrated circuits
Meindl, J. D.; Dutton, R. W.; Gibbons, J. F.; Helms, C. R.; Plummer, J. D.; Tiller, W. A.; Ho, C. P.; Saraswat, K. C.; Deal, B. E.; Kamins, T. I.
1980-07-01
Economical procurement of small quantities of high performance custom integrated circuits for military systems is impeded by inadequate process, device and circuit models that handicap low cost computer aided design. The principal objective of this program is to formulate physical models of fabrication processes, devices and circuits to allow total computer-aided design of custom large-scale integrated circuits. The basic areas under investigation are (1) thermal oxidation, (2) ion implantation and diffusion, (3) chemical vapor deposition of silicon and refractory metal silicides, (4) device simulation and analytic measurements. This report discusses the fourth year of the program.
Development of 3D integrated circuits for HEP
International Nuclear Information System (INIS)
Yarema, R.; Fermilab
2006-01-01
Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing effective circuit density. Recent advances in industry have made 3D integrated circuits an option for HEP. The 3D technology is discussed in this paper and several examples are shown. Design of a 3D demonstrator chip for the ILC is presented
Design and Verification of Application Specific Integrated Circuits in a Network of Online Labs
Directory of Open Access Journals (Sweden)
A.Y. Al-Zoubi
2009-08-01
Full Text Available A solution to implement a remote laboratory for testing and designing analog Application-Specific Integrated Circuits of the type (ispPAC10 is presented. The application allows electrical engineering students to access and perform measurements and conduct analog electronics experiments over the internet. PAC-Designer software, running on a Citrix server, is used in the circuit design in which the signals are generated and the responses are acquired by a data acquisition board controlled by LabVIEW. Three interconnected remote labs located in three different continents will be implementing the proposed system.
International Nuclear Information System (INIS)
Anelli, Giovanni Maria
2000-01-01
The electronic circuits associated with the particle detectors of the CERN Large Hadron Collider (LHC) have to work in a highly radioactive environment. This work proposes a methodology allowing the design of radiation resistant integrated circuits using the commercial sub-micron CMOS technology. This method uses the intrinsic radiation resistance of ultra-thin grid oxides, the technology of enclosed layout transistors (ELT), and the protection rings to avoid the radio-induced creation of leakage currents. In order to check the radiation tolerance level, several test structures have been designed and tested with different radiation sources. These tests have permitted to study the physical phenomena responsible for the damages induced by the radiations and the possible remedies. Then, the particular characteristics of ELT transistors and their influence on the design of complex integrated circuits has been explored. The modeling of the W/L ratio, the asymmetries (for instance in the output conductance) and the performance of ELT couplings have never been studied yet. The noise performance of the 0.25 μ CMOS technology, used in the design of several integrated circuits of the LHC detectors, has been characterized before and after irradiation. Finally, two integrated circuits designed using the proposed method are presented. The first one is an analogic memory and the other is a circuit used for the reading of the signals of one of the LHC detectors. Both circuits were irradiated and have endured very high doses practically without any sign of performance degradation. (J.S.)
Integrated electric circuit CAD system in Minolta Camera Co. Ltd
Energy Technology Data Exchange (ETDEWEB)
Nakagami, Tsuyoshi; Hirata, Sumiaki; Matsumura, Fumihiko
1988-08-26
Development background, fundamental concept, details and future plan of the integrated electric circuit CAD system for OA equipment are presented. The central integrated database is basically intended to store experiences or know-hows, to cover the wide range of data required for designs, and to provide a friendly interface. This easy-to-use integrated database covers the drawing data, parts information, design standards, know-hows and system data. The system contains the circuit design function to support drawing circuit diagrams, the wiring design function to support the wiring and arrangement of printed circuit boards and various parts integratedly, and the function to verify designs, to make full use of parts or technical information, to maintain the system security. In the future, as the system will be wholly in operation, the design period reduction, quality improvement and cost saving will be attained by this integrated design system. (19 figs, 2 tabs)
Enabling the Internet of Things from integrated circuits to integrated systems
2017-01-01
This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia. After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT: ultra-low power digital architectures and circuits low- and zero-leakage memories (including emerging technologies) circuits for hardwar...
Analysis and Evaluation of Statistical Models for Integrated Circuits Design
Directory of Open Access Journals (Sweden)
Sáenz-Noval J.J.
2011-10-01
Full Text Available Statistical models for integrated circuits (IC allow us to estimate the percentage of acceptable devices in the batch before fabrication. Actually, Pelgrom is the statistical model most accepted in the industry; however it was derived from a micrometer technology, which does not guarantee reliability in nanometric manufacturing processes. This work considers three of the most relevant statistical models in the industry and evaluates their limitations and advantages in analog design, so that the designer has a better criterion to make a choice. Moreover, it shows how several statistical models can be used for each one of the stages and design purposes.
Topology Optimization of Building Blocks for Photonic Integrated Circuits
DEFF Research Database (Denmark)
Jensen, Jakob Søndergaard; Sigmund, Ole
2005-01-01
Photonic integrated circuits are likely candidates as high speed replacements for the standard electrical integrated circuits of today. However, in order to obtain a satisfactorily performance many design prob- lems that up until now have resulted in too high losses must be resolved. In this work...... we demonstrate how the method of topology optimization can be used to design a variety of high performance building blocks for the future circuits....
Design of Integrated Circuits Approaching Terahertz Frequencies
DEFF Research Database (Denmark)
Yan, Lei
In this thesis, monolithic microwave integrated circuits(MMICs) are presented for millimeter-wave and submillimeter-wave or terahertz(THz) applications. Millimeter-wave power generation from solid state devices is not only crucial for the emerging high data rate wireless communications but also...... heterodyne receivers with requirements of room temperature operation, low system complexity, and high sensitivity, monolithic integrated Schottky diode technology is chosen for the implementation of submillimeterwave components. The corresponding subharmonic mixer and multiplier for a THz radiometer system...
Advances in Analog Circuit Design 2015
Baschirotto, Andrea; Harpe, Pieter
2016-01-01
This book is based on the 18 tutorials presented during the 24th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including low-power and energy-efficient analog electronics, with specific contributions focusing on the design of efficient sensor interfaces and low-power RF systems. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development. · Provides a state-of-the-art reference in analog circuit design, written by experts from industry and academia; · Presents material in a tutorial-based format; · Includes coverage of high-performance analog-to-digital and digital to analog converters, integrated circuit design in scaled technologies, and time-domain signal processing.
Test Structures For Bumpy Integrated Circuits
Buehler, Martin G.; Sayah, Hoshyar R.
1989-01-01
Cross-bridge resistors added to comb and serpentine patterns. Improved combination of test structures built into integrated circuit used to evaluate design rules, fabrication processes, and quality of interconnections. Consist of meshing serpentines and combs, and cross bridge. Structures used to make electrical measurements revealing defects in design or fabrication. Combination of test structures includes three comb arrays, two serpentine arrays, and cross bridge. Made of aluminum or polycrystalline silicon, depending on material in integrated-circuit layers evaluated. Aluminum combs and serpentine arrays deposited over steps made by polycrystalline silicon and diffusion layers, while polycrystalline silicon versions of these structures used to cross over steps made by thick oxide layer.
Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management
Directory of Open Access Journals (Sweden)
Wang Kang-Jia
2016-01-01
Full Text Available Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this paper, we perform a detailed evaluation of the influence of the microchannel structure and the parameters of the cooling liquid on steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for three dimensional integrated circuit with microchannel cooling.
Yamada, Takahiro; Maezawa, Masaaki; Urano, Chiharu
2015-11-01
We present design and testing of a pseudo-random number generator (PRNG) and a variable pulse number multiplier (VPNM) which are digital circuit subsystems in an integrated quantum voltage noise source for Jonson noise thermometry. Well-defined, calculable pseudo-random patterns of single flux quantum pulses are synthesized with the PRNG and multiplied digitally with the VPNM. The circuit implementation on rapid single flux quantum technology required practical circuit scales and bias currents, 279 junctions and 33 mA for the PRNG, and 1677 junctions and 218 mA for the VPNM. We confirmed the circuit operation with sufficiently wide margins, 80-120%, with respect to the designed bias currents.
Analog circuit design designing dynamic circuit response
Feucht, Dennis
2010-01-01
This second volume, Designing Dynamic Circuit Response builds upon the first volume Designing Amplifier Circuits by extending coverage to include reactances and their time- and frequency-related behavioral consequences.
Integrated circuit and method of arbitration in a network on an integrated circuit.
2011-01-01
The invention relates to an integrated circuit and to a method of arbitration in a network on an integrated circuit. According to the invention, a method of arbitration in a network on an integrated circuit is provided, the network comprising a router unit, the router unit comprising a first input
Bonacini, Sandro
2003-01-01
High Energy Physics research (HEP) involves the design of readout electron- ics for its experiments, which generate a high radiation ¯eld in the detectors. The several integrated circuits placed in the future Large Hadron Collider (LHC) experiments' environment have to resist the radiation and carry out their normal operation. In this thesis I will describe in detail what, during my 10-months partic- ipation in the digital section of the Microelectronics group at CERN, I had the possibility to work on: - The design of a radiation-tolerant data readout digital integrated cir- cuit in a 0.25 ¹m CMOS technology, called \\the Kchip", for the CMS preshower front-end system. This will be described in Chapter 3. - The design of a radiation-tolerant SRAM integrated circuit in a 0.13 ¹m CMOS technology, for technology radiation testing purposes and fu- ture applications in the HEP ¯eld. The SRAM will be described in Chapter 4. All the work has carried out under the supervision and with the help of Dr. Kostas Klouki...
Tuttle, Jeffery L.
In consideration of the computer processing power now available to the designer, an alternative analog circuit design methodology is proposed. Computer memory capacities no longer require the reduction of the transistor operational characteristics to an imprecise formulation. Therefore, it is proposed that transistor modelling be abandoned in favor of fully characterized transistor data libraries. Secondly, availability of the transistor libraries would facilitate an automated selection of the most appropriate device(s) for the circuit being designed. More specifically, a preprocessor computer program to a more sophisticated circuit simulator (e.g. SPICE) is developed to assist the designer in developing the basic circuit topology and the selection of the most appropriate transistor. Once this is achieved, the circuit topology and selected transistor data library would be downloaded to the simulator for full circuit operational characterization and subsequent design modifications. It is recognized that the design process is enhanced by the use of heuristics as applied to iterative design results. Accordingly, an artificial intelligence (AI) interface is developed to assist the designer in applying the preprocessor results. To demonstrate the retrofitability of the AI interface to established programs, the interface is specifically designed to be as non-intrusive to the host code as possible. Implementation of the proposed methodology offers the potential to speed the design process, since the preprocessor both minimizes the required number of simulator runs and provides a higher acceptance potential of the initial and subsequent simulator runs. Secondly, part count reductions may be realizable since the circuit topologies are not as strongly driven by transistor limitations. Thirdly, the predicted results should more closely match actual circuit operations since the inadequacies of the transistor models have been virtually eliminated. Finally, the AI interface
Yashin, A. A.
1985-04-01
A semiconductor or hybrid structure into a calculable two-dimensional region mapped by the Schwarz-Christoffel transformation and a universal algorithm can be constructed on the basis of Maxwell's electro-magnetic-thermal similarity principle for engineering design of integrated-circuit elements. The design procedure involves conformal mapping of the original region into a polygon and then the latter into a rectangle with uniform field distribution, where conductances and capacitances are calculated, using tabulated standard mapping functions. Subsequent synthesis of a device requires inverse conformal mapping. Devices adaptable as integrated-circuit elements are high-resistance film resistors with periodic serration, distributed-resistance film attenuators with high transformation ratio, coplanar microstrip lines, bipolar transistors, directional couplers with distributed coupling to microstrip lines for microwave bulk devices, and quasirregular smooth matching transitions from asymmetric to coplanar microstrip lines.
Parallel sparse direct solver for integrated circuit simulation
Chen, Xiaoming; Yang, Huazhong
2017-01-01
This book describes algorithmic methods and parallelization techniques to design a parallel sparse direct solver which is specifically targeted at integrated circuit simulation problems. The authors describe a complete flow and detailed parallel algorithms of the sparse direct solver. They also show how to improve the performance by simple but effective numerical techniques. The sparse direct solver techniques described can be applied to any SPICE-like integrated circuit simulator and have been proven to be high-performance in actual circuit simulation. Readers will benefit from the state-of-the-art parallel integrated circuit simulation techniques described in this book, especially the latest parallel sparse matrix solution techniques. · Introduces complicated algorithms of sparse linear solvers, using concise principles and simple examples, without complex theory or lengthy derivations; · Describes a parallel sparse direct solver that can be adopted to accelerate any SPICE-like integrated circuit simulato...
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Lim, Sung Kyu
2013-01-01
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the e...
Integrated differential high-voltage transmitting circuit for CMUTs
DEFF Research Database (Denmark)
Llimos Muntal, Pere; Larsen, Dennis Øland; Farch, Kjartan
2015-01-01
In this paper an integrated differential high-voltage transmitting circuit for capacitive micromachined ultrasonic transducers (CMUTs) used in portable ultrasound scanners is designed and implemented in a 0.35 μm high-voltage process. Measurements are performed on the integrated circuit in order...... to assess its performance. The circuit generates pulses at differential voltage levels of 60V, 80V and 100 V, a frequency up to 5MHz and a measured driving strength of 1.75 V/ns with the CMUT connected. The total on-chip area occupied by the transmitting circuit is 0.18 mm2 and the power consumption...
Wireless transceiver circuits system perspectives and design aspects
Rhee, Woogeun
2015-01-01
This cutting-edge work contains comprehensive coverage of integrated circuit (IC) design for modern transceiver circuits and wireless systems. Ranging in scope from system perspectives to practical circuit design for emerging wireless applications, the book includes detailed discussions of transceiver architectures and system parameters, mm-wave circuits, ultra-low-power radios for biomedical and sensor applications, and the latest circuit techniques. Written by renowned international experts in IC industry and academia, the text is an ideal reference for engineers and researchers in the area
A design concept for an MMIC (Monolithic Microwave Integrated Circuit) microstrip phased array
Lee, Richard Q.; Smetana, Jerry; Acosta, Roberto
1987-01-01
A conceptual design for a microstrip phased array with monolithic microwave integrated circuit (MMIC) amplitude and phase controls is described. The MMIC devices used are 20 GHz variable power amplifiers and variable phase shifters recently developed by NASA contractors for applications in future Ka proposed design, which concept is for a general NxN element array of rectangular lattice geometry. Subarray excitation is incorporated in the MMIC phased array design to reduce the complexity of the beam forming network and the number of MMIC components required.
Chen, Chin-Hui; Klamkin, Jonathan; Nicholes, Steven C; Johansson, Leif A; Bowers, John E; Coldren, Larry A
2009-09-01
We present an extensive study of an ultracompact grating-based beam splitter suitable for photonic integrated circuits (PICs) that have stringent density requirements. The 10 microm long beam splitter exhibits equal splitting, low insertion loss, and also provides a high extinction ratio in an integrated coherent balanced receiver. We further present the design strategies for avoiding mode distortion in the beam splitter and discuss optimization of the widths of the detectors to improve insertion loss and extinction ratio of the coherent receiver circuit. In our study, we show that the grating-based beam splitter is a competitive technology having low fabrication complexity for ultracompact PICs.
Energy-efficient neuron, synapse and STDP integrated circuits.
Cruz-Albrecht, Jose M; Yung, Michael W; Srinivasa, Narayan
2012-06-01
Ultra-low energy biologically-inspired neuron and synapse integrated circuits are presented. The synapse includes a spike timing dependent plasticity (STDP) learning rule circuit. These circuits have been designed, fabricated and tested using a 90 nm CMOS process. Experimental measurements demonstrate proper operation. The neuron and the synapse with STDP circuits have an energy consumption of around 0.4 pJ per spike and synaptic operation respectively.
The Software Reliability of Large Scale Integration Circuit and Very Large Scale Integration Circuit
Artem Ganiyev; Jan Vitasek
2010-01-01
This article describes evaluation method of faultless function of large scale integration circuits (LSI) and very large scale integration circuits (VLSI). In the article there is a comparative analysis of factors which determine faultless of integrated circuits, analysis of already existing methods and model of faultless function evaluation of LSI and VLSI. The main part describes a proposed algorithm and program for analysis of fault rate in LSI and VLSI circuits.
Design and test results of a low-noise readout integrated circuit for high-energy particle detectors
International Nuclear Information System (INIS)
Zhang Mingming; Chen Zhongjian; Zhang Yacong; Lu Wengao; Ji Lijiu
2010-01-01
A low-noise readout integrated circuit for high-energy particle detector is presented. The noise of charge sensitive amplifier was suppressed by using single-side amplifier and resistors as source degeneration. Continuous-time semi-Gaussian filter is chosen to avoid switch noise. The peaking time of pulse shaper and the gain can be programmed to satisfy multi-application. The readout integrated circuit has been designed and fabricated using a 0.35 μm double-poly triple-metal CMOS technology. Test results show the functions of the readout integrated circuit are correct. The equivalent noise charge with no detector connected is 500-700 e in the typical mode, the gain is tunable within 13-130 mV/fC and the peaking time varies from 0.7 to 1.6 μs, in which the average gain is about 20.5 mV/fC, and the linearity reaches 99.2%. (authors)
RF microwave circuit design for wireless applications
Rohde, Ulrich L
2012-01-01
Provides researchers and engineers with a complete set of modeling, design, and implementation tools for tackling the newest IC technologies Revised and completely updated, RF/Microwave Circuit Design for Wireless Applications, Second Edition is a unique, state-of-the-art guide to wireless integrated circuit design that provides researchers and engineers with a complete set of modeling, design, and implementation tools for tackling even the newest IC technologies. It emphasizes practical design solutions for high-performance devices and circuitry, incorporating ample exa
Maximum Temperature Detection System for Integrated Circuits
Frankiewicz, Maciej; Kos, Andrzej
2015-03-01
The paper describes structure and measurement results of the system detecting present maximum temperature on the surface of an integrated circuit. The system consists of the set of proportional to absolute temperature sensors, temperature processing path and a digital part designed in VHDL. Analogue parts of the circuit where designed with full-custom technique. The system is a part of temperature-controlled oscillator circuit - a power management system based on dynamic frequency scaling method. The oscillator cooperates with microprocessor dedicated for thermal experiments. The whole system is implemented in UMC CMOS 0.18 μm (1.8 V) technology.
A fast charge integrating and shaping circuit
International Nuclear Information System (INIS)
Kulka, Z.; Szoncso, F.
1990-01-01
The development of a low cost fast charge integrating and shaping circuit (FCISC) was motivated by the need for an interface between the photomultipliers of an existing hadronic calorimeter and recently developed new readout electronics designed to match the output of small ionization chambers for the upgraded UA1 detector at the CERN proton-antiproton collider. This paper describes the design principles of gated and ungated charge integrating and shaping circuits. An FCISC prototype using discrete components was made and its properties were determined with a computerized test setup. Finally an SMD implementation of the FCISC is presented and the performance is reported. (orig.)
Monolithic Microwave Integrated Circuits Based on GaAs Mesfet Technology
Bahl, Inder J.
Advanced military microwave systems are demanding increased integration, reliability, radiation hardness, compact size and lower cost when produced in large volume, whereas the microwave commercial market, including wireless communications, mandates low cost circuits. Monolithic Microwave Integrated Circuit (MMIC) technology provides an economically viable approach to meeting these needs. In this paper the design considerations for several types of MMICs and their performance status are presented. Multifunction integrated circuits that advance the MMIC technology are described, including integrated microwave/digital functions and a highly integrated transceiver at C-band.
Foundations for microstrip circuit design
Edwards, Terry
2016-01-01
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Design and testing of integrated circuits for reactor protection channels
International Nuclear Information System (INIS)
Battle, R.E.; Vandermolen, R.I.; Jagadish, U.; Swail, B.K.; Naser, J.
1995-01-01
Custom and semicustom application-specific integrated circuit design and testing methods are investigated for use in research and commercial nuclear reactor safety systems. The Electric Power Research Institute and Oak Ridge National Laboratory are working together through a cooperative research and development agreement to apply modern technology to a nuclear reactor protection system. The purpose of this project is to demonstrate to the nuclear industry an alternative approach for new or upgrade reactor protection and safety system signal processing and voting logic. Motivation for this project stems from (1) the difficulty of proving that software-based protection systems are adequately reliable, (2) the obsolescence of the original equipment, and (3) the improved performance of digital processing. A demonstration model for protection system of PWR reactor has been designed and built
Mouldable all-carbon integrated circuits.
Sun, Dong-Ming; Timmermans, Marina Y; Kaskela, Antti; Nasibulin, Albert G; Kishimoto, Shigeru; Mizutani, Takashi; Kauppinen, Esko I; Ohno, Yutaka
2013-01-01
A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm(2) V(-1) s(-1) and an ON/OFF ratio of 10(5). The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability.
Design of Integrated Circuits Approaching Terahertz Frequencies
Yan, Lei; Johansen, Tom Keinicke
2013-01-01
In this thesis, monolithic microwave integrated circuits(MMICs) are presented for millimeter-wave and submillimeter-wave or terahertz(THz) applications. Millimeter-wave power generation from solid state devices is not only crucial for the emerging high data rate wireless communications but also important for driving THz signal sources. To meet the requirement of high output power, amplifiers based on InP double heterojunction bipolar transistor (DHBT) devices from the III-V Lab in Marcoussic,...
23rd workshop on Advances in Analog Circuit Design
Baschirotto, Andrea; Makinwa, Kofi
2015-01-01
This book is based on the 18 tutorials presented during the 23rd workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, serving as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development. • Includes coverage of high-performance analog-to-digital and digital to analog converters, integrated circuit design in scaled technologies, and time-domain signal processing; • Provides a state-of-the-art reference in analog circuit design, written by experts from industry and academia; • Presents material in a tutorial-based format.
PUZZLE - A program for computer-aided design of printed circuit artwork
Harrell, D. A. W.; Zane, R.
1971-01-01
Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.
International Nuclear Information System (INIS)
Yamada, Takahiro; Maezawa, Masaaki; Urano, Chiharu
2015-01-01
Highlights: • We demonstrated RSFQ digital components of a new quantum voltage noise source. • A pseudo-random number generator and variable pulse number multiplier are designed. • Fabrication process is based on four Nb wiring layers and Nb/AlOx/Nb junctions. • The circuits successfully operated with wide dc bias current margins, 80–120%. - Abstract: We present design and testing of a pseudo-random number generator (PRNG) and a variable pulse number multiplier (VPNM) which are digital circuit subsystems in an integrated quantum voltage noise source for Jonson noise thermometry. Well-defined, calculable pseudo-random patterns of single flux quantum pulses are synthesized with the PRNG and multiplied digitally with the VPNM. The circuit implementation on rapid single flux quantum technology required practical circuit scales and bias currents, 279 junctions and 33 mA for the PRNG, and 1677 junctions and 218 mA for the VPNM. We confirmed the circuit operation with sufficiently wide margins, 80–120%, with respect to the designed bias currents.
Energy Technology Data Exchange (ETDEWEB)
Yamada, Takahiro, E-mail: yamada-takahiro@aist.go.jp [Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki 305-8568 (Japan); Maezawa, Masaaki [Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, Central 2, Umezono 1-1-1, Tsukuba, Ibaraki 305-8568 (Japan); Urano, Chiharu [National Metrology Institute of Japan, National Institute of Advanced Industrial Science and Technology, Central 3, Umezono 1-1-1, Tsukuba, Ibaraki 305-8563 (Japan)
2015-11-15
Highlights: • We demonstrated RSFQ digital components of a new quantum voltage noise source. • A pseudo-random number generator and variable pulse number multiplier are designed. • Fabrication process is based on four Nb wiring layers and Nb/AlOx/Nb junctions. • The circuits successfully operated with wide dc bias current margins, 80–120%. - Abstract: We present design and testing of a pseudo-random number generator (PRNG) and a variable pulse number multiplier (VPNM) which are digital circuit subsystems in an integrated quantum voltage noise source for Jonson noise thermometry. Well-defined, calculable pseudo-random patterns of single flux quantum pulses are synthesized with the PRNG and multiplied digitally with the VPNM. The circuit implementation on rapid single flux quantum technology required practical circuit scales and bias currents, 279 junctions and 33 mA for the PRNG, and 1677 junctions and 218 mA for the VPNM. We confirmed the circuit operation with sufficiently wide margins, 80–120%, with respect to the designed bias currents.
Practical design of digital circuits basic logic to microprocessors
Kampel, Ian
1983-01-01
Practical Design of Digital Circuits: Basic Logic to Microprocessors demonstrates the practical aspects of digital circuit design. The intention is to give the reader sufficient confidence to embark upon his own design projects utilizing digital integrated circuits as soon as possible. The book is organized into three parts. Part 1 teaches the basic principles of practical design, and introduces the designer to his """"tools"""" - or rather, the range of devices that can be called upon. Part 2 shows the designer how to put these together into viable designs. It includes two detailed descriptio
Integrated circuit implementation of fuzzy controllers
Huertas Díaz, José Luis; Sánchez Solano, Santiago; Baturone Castillo, María Iluminada; Barriga Barros, Ángel
1996-01-01
This paper presents mixed-signal current-mode CMOS circuits to implement programmable fuzzy controllers that perform the singleton or zero-order Sugeno’s method. Design equations to characterize these circuits are provided to explain the precision and speed that they offer. This analysis is illustrated with the experimental results of prototypes integrated in standard CMOS technologies. These tests show that an equivalent precision of 6 bits is achieved. The connection of these...
Monolitic integrated circuit for the strobed charge-to-time converter
International Nuclear Information System (INIS)
Bel'skij, V.I.; Bushnin, Yu.B.; Zimin, S.A.; Punzhin, Yu.N.; Sen'ko, V.A.; Soldatov, M.M.; Tokarchuk, V.P.
1985-01-01
The developed and comercially produced semiconducting circuit - gating charge-to-time converter KR1101PD1 is described. The considered integrated circuit is a short pulse charge-to-time converter with integration of input current. The circuit is designed for construction of time-to-pulse analog-to-digital converters utilized in multichannel detection systems when studying complex topology processes. Input resistance of the circuit is 0.1 Ω permissible input current is 50 mA, maximum measured charge is 300-1000 pC
Micromachined integrated quantum circuit containing a superconducting qubit
Brecht, Teresa; Chu, Yiwen; Axline, Christopher; Pfaff, Wolfgang; Blumoff, Jacob; Chou, Kevin; Krayzman, Lev; Frunzio, Luigi; Schoelkopf, Robert
We demonstrate a functional multilayer microwave integrated quantum circuit (MMIQC). This novel hardware architecture combines the high coherence and isolation of three-dimensional structures with the advantages of integrated circuits made with lithographic techniques. We present fabrication and measurement of a two-cavity/one-qubit prototype, including a transmon coupled to a three-dimensional microwave cavity micromachined in a silicon wafer. It comprises a simple MMIQC with competitive lifetimes and the ability to perform circuit QED operations in the strong dispersive regime. Furthermore, the design and fabrication techniques that we have developed are extensible to more complex quantum information processing devices.
Thermal measurement a requirement for monolithic microwave integrated circuit design
Hopper, Richard; Oxley, C. H.
2008-01-01
The thermal management of structures such as Monolithic Microwave Integrated Circuits (MMICs) is important, given increased circuit packing densities and RF output powers. The paper will describe the IR measurement technology necessary to obtain accurate temperature profiles on the surface of semiconductor devices. The measurement procedure will be explained, including the device mounting arrangement and emissivity correction technique. The paper will show how the measurement technique has be...
Design and testing of integrated circuits for reactor protection channels
International Nuclear Information System (INIS)
Battle, R.E.; Vandermolen, R.I.; Jagadish, U.; Swail, B.K.; Naser, J.; Rana, I.
1995-01-01
Custom and semicustom application-specific integrated circuit design and testing methods are investigated for use in research and commercial nuclear reactor safety systems. The Electric Power Research Institute and Oak Ridge National Laboratory are working together through a cooperative research and development agreement to apply modern technology to a nuclear reactor protection system. Purpose of this project is to demonstrate to the nuclear industry an alternative approach for new or upgrade reactor protection and safety system signal processing and voting logic. Motivation for this project stems from (1) the difficulty of proving that software-based protection systems are adequately reliable, (2) the obsolescence of the original equipment, and (3) the improved performance of digital processing
The circuit designer's companion
Williams, Tim
1991-01-01
The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll
Reactor protection system design using application specific integrated circuits
International Nuclear Information System (INIS)
Battle, R.E.; Bryan, W.L.; Kisner, R.A.; Wilson, T.L. Jr.
1992-01-01
Implementing reactor protection systems (RPS) or other engineering safeguard systems with application specific integrated circuits (ASICs) offers significant advantages over conventional analog or software based RPSs. Conventional analog RPSs suffer from setpoints drifts and large numbers of discrete analog electronics, hardware logic, and relays which reduce reliability because of the large number of potential failures of components or interconnections. To resolve problems associated with conventional discrete RPSs and proposed software based RPS systems, a hybrid analog and digital RPS system implemented with custom ASICs is proposed. The actual design of the ASIC RPS resembles a software based RPS but the programmable software portion of each channel is implemented in a fixed digital logic design including any input variable computations. Set point drifts are zero as in proposed software systems, but the verification and validation of the computations is made easier since the computational logic an be exhaustively tested. The functionality is assured fixed because there can be no future changes to the ASIC without redesign and fabrication. Subtle error conditions caused by out of order evaluation or time dependent evaluation of system variables against protection criteria are eliminated by implementing all evaluation computations in parallel for simultaneous results. On- chip redundancy within each RPS channel and continuous self-testing of all channels provided enhanced assurance that a particular channel is available and faults are identified as soon as possible for corrective actions. The use of highly integrated ASICs to implement channel electronics rather than the use of discrete electronics greatly reduces the total number of components and interconnections in the RPS to further increase system reliability. A prototype ASIC RPS channel design and the design environment used for ASIC RPS systems design is discussed
Integrated Circuits for Analog Signal Processing
2013-01-01
This book presents theory, design methods and novel applications for integrated circuits for analog signal processing. The discussion covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode. This includes voltage operational amplifiers, current operational amplifiers, operational transconductance amplifiers, operational transresistance amplifiers, current conveyors, current differencing transconductance amplifiers, etc. Design methods and challenges posed by nanometer technology are discussed and applications described, including signal amplification, filtering, data acquisition systems such as neural recording, sensor conditioning such as biomedical implants, actuator conditioning, noise generators, oscillators, mixers, etc. Presents analysis and synthesis methods to generate all circuit topologies from which the designer can select the best one for the desired application; Includes design guidelines for active devices/elements...
Microwave integrated circuit mask design, using computer aided microfilm techniques
Energy Technology Data Exchange (ETDEWEB)
Reymond, J.M.; Batliwala, E.R.; Ajose, S.O.
1977-01-01
This paper examines the possibility of using a computer interfaced with a precision film C.R.T. information retrieval system, to produce photomasks suitable for the production of microwave integrated circuits.
Design and application of multilayer monolithic microwave integrated circuit transformers
Energy Technology Data Exchange (ETDEWEB)
Economides, S.B
1999-07-01
The design and performance of planar spiral transformers, using multilayer GaAs and silicon MMIC technology, are presented. This multilayer technology gives new opportunities for improving the performance of planar transformers, couplers and baluns. Planar transformers have high parasitic resistance and capacitance and low levels of coupling. Using multilayer technology these problems are overcome by applying a multilayer structure of three metal layers separated by two polyimide dielectric layers. The improvements gained by placing the conductors on different metal layers, and using conductors raised on polyimide layers for low capacitance, have been investigated. The circuits were fabricated using a novel experimental fabrication process, which uses entirely standard materials and techniques and is compatible with BJT's and silicon-germanium HBT's. The transformers were all characterised up to 20 GHz using RF-on-wafer measurements. They demonstrated good performance, considering the experimental nature of in-house multilayer technology and the difficulties in simulating these three-dimensional new geometries. With high resistivity substrates, the silicon components achieved virtually the same performance as their gallium arsenide counterparts. The transformers were then used in simulations of transformer-coupled HBT amplifier circuits, to demonstrate their capabilities. It was shown that these circuits present good performance compared to standard off-the shelf component circuits and are very promising for use in most multilayer MMIC applications. The structures were further used in coupling configurations, and applied in balun circuits and pushpull amplifiers. The spiral transformer coupler can operate at low frequencies without using up much chip area. In a balun configuration, the balun can compensate for coupling and phase imbalance and operates over 5 to 15 GHz. The spiral coupler does not always need multilayer processing, so the balun may be
Thermionic integrated circuits: electronics for hostile environments
International Nuclear Information System (INIS)
Lynn, D.K.; McCormick, J.B.; MacRoberts, M.D.J.; Wilde, D.K.; Dooley, G.R.; Brown, D.R.
1985-01-01
Thermionic integrated circuits combine vacuum tube technology with integrated circuit techniques to form integrated vacuum triode circuits. These circuits are capable of extended operation in both high-temperature and high-radiation environments
Intuitive analog circuit design
Thompson, Marc
2013-01-01
Intuitive Analog Circuit Design outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject. In this book, Dr. Thompson describes intuitive and ""back-of-the-envelope"" techniques for designing and analyzing analog circuits, including transistor amplifi
Dobkin, Bob
2012-01-01
Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. The book's in-depth application examples provide insight into circuit design and application solutions that you can apply in today's demanding designs. <
High-voltage integrated transmitting circuit with differential driving for CMUTs
DEFF Research Database (Denmark)
Llimos Muntal, Pere; Larsen, Dennis Øland; Færch, Kjartan Ullitz
2016-01-01
In this paper, a high-voltage integrated differential transmitting circuit for capacitive micromachined ultrasonic transducers (CMUTs) used in portable ultrasound scanners is presented. Due to its application, area and power consumption are critical and need to be minimized. The circuitry...... is designed and implemented in AMS 0.35 μ m high-voltage process. Measurements are performed on the fabricated integrated circuit in order to assess its performance. The transmitting circuit consists of a low-voltage control logic, pulse-triggered level shifters and a differential output stage that generates...... conditions is 0.936 mW including the load. The integrated circuits measured prove to be consistent and robust to local process variations by measurements....
Ghavami, Behnam; Raji, Mohsen; Pedram, Hossein
2011-08-26
Carbon nanotube field-effect transistors (CNFETs) show great promise as building blocks of future integrated circuits. However, synthesizing single-walled carbon nanotubes (CNTs) with accurate chirality and exact positioning control has been widely acknowledged as an exceedingly complex task. Indeed, density and chirality variations in CNT growth can compromise the reliability of CNFET-based circuits. In this paper, we present a novel statistical compact model to estimate the failure probability of CNFETs to provide some material and process guidelines for the design of CNFETs in gigascale integrated circuits. We use measured CNT spacing distributions within the framework of detailed failure analysis to demonstrate that both the CNT density and the ratio of metallic to semiconducting CNTs play dominant roles in defining the failure probability of CNFETs. Besides, it is argued that the large-scale integration of these devices within an integrated circuit will be feasible only if a specific range of CNT density with an acceptable ratio of semiconducting to metallic CNTs can be adjusted in a typical synthesis process.
Integrated coherent matter wave circuits
International Nuclear Information System (INIS)
Ryu, C.; Boshier, M. G.
2015-01-01
An integrated coherent matter wave circuit is a single device, analogous to an integrated optical circuit, in which coherent de Broglie waves are created and then launched into waveguides where they can be switched, divided, recombined, and detected as they propagate. Applications of such circuits include guided atom interferometers, atomtronic circuits, and precisely controlled delivery of atoms. We report experiments demonstrating integrated circuits for guided coherent matter waves. The circuit elements are created with the painted potential technique, a form of time-averaged optical dipole potential in which a rapidly moving, tightly focused laser beam exerts forces on atoms through their electric polarizability. Moreover, the source of coherent matter waves is a Bose-Einstein condensate (BEC). Finally, we launch BECs into painted waveguides that guide them around bends and form switches, phase coherent beamsplitters, and closed circuits. These are the basic elements that are needed to engineer arbitrarily complex matter wave circuitry
Variational integrators for electric circuits
International Nuclear Information System (INIS)
Ober-Blöbaum, Sina; Tao, Molei; Cheng, Mulin; Owhadi, Houman; Marsden, Jerrold E.
2013-01-01
In this contribution, we develop a variational integrator for the simulation of (stochastic and multiscale) electric circuits. When considering the dynamics of an electric circuit, one is faced with three special situations: 1. The system involves external (control) forcing through external (controlled) voltage sources and resistors. 2. The system is constrained via the Kirchhoff current (KCL) and voltage laws (KVL). 3. The Lagrangian is degenerate. Based on a geometric setting, an appropriate variational formulation is presented to model the circuit from which the equations of motion are derived. A time-discrete variational formulation provides an iteration scheme for the simulation of the electric circuit. Dependent on the discretization, the intrinsic degeneracy of the system can be canceled for the discrete variational scheme. In this way, a variational integrator is constructed that gains several advantages compared to standard integration tools for circuits; in particular, a comparison to BDF methods (which are usually the method of choice for the simulation of electric circuits) shows that even for simple LCR circuits, a better energy behavior and frequency spectrum preservation can be observed using the developed variational integrator
Design, Analysis and Test of Logic Circuits Under Uncertainty
Krishnaswamy, Smita; Hayes, John P
2013-01-01
Integrated circuits (ICs) increasingly exhibit uncertain characteristics due to soft errors, inherently probabilistic devices, and manufacturing variability. As device technologies scale, these effects can be detrimental to the reliability of logic circuits. To improve future semiconductor designs, this book describes methods for analyzing, designing, and testing circuits subject to probabilistic effects. The authors first develop techniques to model inherently probabilistic methods in logic circuits and to test circuits for determining their reliability after they are manufactured. Then, they study error-masking mechanisms intrinsic to digital circuits and show how to leverage them to design more reliable circuits. The book describes techniques for: • Modeling and reasoning about probabilistic behavior in logic circuits, including a matrix-based reliability-analysis framework; • Accurate analysis of soft-error rate (SER) based on functional-simulation, sufficiently scalable for use in gate-l...
Process Variations and Probabilistic Integrated Circuit Design
Haase, Joachim
2012-01-01
Uncertainty in key parameters within a chip and between different chips in the deep sub micron era plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process. Quantitative methodology is needed to ensure faultless functionality, despite existing process variations within given bounds, during product development. This book presents the technological, physical, and mathematical fundamentals for a design paradigm shift, from a deterministic process to a probability-orientated design process for microelectronic circuits. Readers will learn to evaluate the different sources of variations in the design flow in order to establish different design variants, while applying appropriate methods and tools to evaluate and optimize their design. Trains IC designers to recognize problems caused by parameter variations during manufacturing and to choose the best methods available to mitigate these issues during the design process; Offers both qual...
Reverse Engineering Camouflaged Sequential Integrated Circuits Without Scan Access
Massad, Mohamed El; Garg, Siddharth; Tripunitara, Mahesh
2017-01-01
Integrated circuit (IC) camouflaging is a promising technique to protect the design of a chip from reverse engineering. However, recent work has shown that even camouflaged ICs can be reverse engineered from the observed input/output behaviour of a chip using SAT solvers. However, these so-called SAT attacks have so far targeted only camouflaged combinational circuits. For camouflaged sequential circuits, the SAT attack requires that the internal state of the circuit is controllable and obser...
Impedance Matching Antenna-Integrated High-Efficiency Energy Harvesting Circuit
Shinki, Yuharu; Shibata, Kyohei; Mansour, Mohamed
2017-01-01
This paper describes the design of a high-efficiency energy harvesting circuit with an integrated antenna. The circuit is composed of series resonance and boost rectifier circuits for converting radio frequency power into boosted direct current (DC) voltage. The measured output DC voltage is 5.67 V for an input of 100 mV at 900 MHz. Antenna input impedance matching is optimized for greater efficiency and miniaturization. The measured efficiency of this antenna-integrated energy harvester is 60% for −4.85 dBm input power and a load resistance equal to 20 kΩ at 905 MHz. PMID:28763043
Impedance Matching Antenna-Integrated High-Efficiency Energy Harvesting Circuit
Directory of Open Access Journals (Sweden)
Yuharu Shinki
2017-08-01
Full Text Available This paper describes the design of a high-efficiency energy harvesting circuit with an integrated antenna. The circuit is composed of series resonance and boost rectifier circuits for converting radio frequency power into boosted direct current (DC voltage. The measured output DC voltage is 5.67 V for an input of 100 mV at 900 MHz. Antenna input impedance matching is optimized for greater efficiency and miniaturization. The measured efficiency of this antenna-integrated energy harvester is 60% for −4.85 dBm input power and a load resistance equal to 20 kΩ at 905 MHz.
Impedance Matching Antenna-Integrated High-Efficiency Energy Harvesting Circuit.
Shinki, Yuharu; Shibata, Kyohei; Mansour, Mohamed; Kanaya, Haruichi
2017-08-01
This paper describes the design of a high-efficiency energy harvesting circuit with an integrated antenna. The circuit is composed of series resonance and boost rectifier circuits for converting radio frequency power into boosted direct current (DC) voltage. The measured output DC voltage is 5.67 V for an input of 100 mV at 900 MHz. Antenna input impedance matching is optimized for greater efficiency and miniaturization. The measured efficiency of this antenna-integrated energy harvester is 60% for -4.85 dBm input power and a load resistance equal to 20 kΩ at 905 MHz.
Graphene radio frequency receiver integrated circuit.
Han, Shu-Jen; Garcia, Alberto Valdes; Oida, Satoshi; Jenkins, Keith A; Haensch, Wilfried
2014-01-01
Graphene has attracted much interest as a future channel material in radio frequency electronics because of its superior electrical properties. Fabrication of a graphene integrated circuit without significantly degrading transistor performance has proven to be challenging, posing one of the major bottlenecks to compete with existing technologies. Here we present a fabrication method fully preserving graphene transistor quality, demonstrated with the implementation of a high-performance three-stage graphene integrated circuit. The circuit operates as a radio frequency receiver performing signal amplification, filtering and downconversion mixing. All circuit components are integrated into 0.6 mm(2) area and fabricated on 200 mm silicon wafers, showing the unprecedented graphene circuit complexity and silicon complementary metal-oxide-semiconductor process compatibility. The demonstrated circuit performance allow us to use graphene integrated circuit to perform practical wireless communication functions, receiving and restoring digital text transmitted on a 4.3-GHz carrier signal.
Integrated circuit for processing a low-frequency signal from a seismic detector
Energy Technology Data Exchange (ETDEWEB)
Malashevich, N. I.; Roslyakov, A. S.; Polomoshnov, S. A., E-mail: S.Polomoshnov@tsen.ru; Fedorov, R. A. [Research and Production Complex ' Technological Center' of the Moscow Institute of Electronic Technology (Russian Federation)
2011-12-15
Specific features for the detection and processing of a low-frequency signal from a seismic detector are considered in terms of an integrated circuit based on a large matrix crystal of the 5507 series. This integrated circuit is designed for the detection of human movements. The specific features of the information signal, obtained at the output of the seismic detector, and the main characteristics of the integrated circuit and its structure are reported.
Toolbox for the design of LiNbO3-based passive and active integrated quantum circuits
Sharapova, P. R.; Luo, K. H.; Herrmann, H.; Reichelt, M.; Meier, T.; Silberhorn, C.
2017-12-01
We present and discuss perspectives of current developments on advanced quantum optical circuits monolithically integrated in the lithium niobate platform. A set of basic components comprising photon pair sources based on parametric down conversion (PDC), passive routing elements and active electro-optically controllable switches and polarisation converters are building blocks of a toolbox which is the basis for a broad range of diverse quantum circuits. We review the state-of-the-art of these components and provide models that properly describe their performance in quantum circuits. As an example for applications of these models we discuss design issues for a circuit providing on-chip two-photon interference. The circuit comprises a PDC section for photon pair generation followed by an actively controllable modified mach-Zehnder structure for observing Hong-Ou-Mandel interference. The performance of such a chip is simulated theoretically by taking even imperfections of the properties of the individual components into account.
Design and performance of a multi-channel, multi-sampling, PSD-enabling integrated circuit
Energy Technology Data Exchange (ETDEWEB)
Engel, G.L., E-mail: gengel@siue.ed [Department of Electrical and Computer Engineering, VLSI Design Research Laboratory, Southern Illinois University Edwardsville, Engineering Building, Room 3043 Edwardsville, IL 62026 1081 (United States); Hall, M.J.; Proctor, J.M. [Department of Electrical and Computer Engineering, VLSI Design Research Laboratory, Southern Illinois University Edwardsville, Engineering Building, Room 3043 Edwardsville, IL 62026 1081 (United States); Elson, J.M.; Sobotka, L.G.; Shane, R.; Charity, R.J. [Departments of Chemistry and Physics, Washington University, Saint Louis, MO 63130 (United States)
2009-12-21
This paper presents the design and test results of an eight-channel prototype integrated circuit chip intended to greatly simplify the pulse-processing electronics needed for large arrays of scintillation detectors. Because the chip design employs (user-controlled) multi-region charge integration, particle identification is incorporated into the basic design. Each channel on the chip also contains a time-to-voltage converter which provides relative time information. The pulse-height integrals and the relative time are all stored on capacitors and are either reset, after a user controlled time, or sequentially read out if acquisition of the event is desired. Each of the three pulse-height sub-channels consists of a gated integrator with eight programmable charging rates and an externally programmable gate generator that defines the start (with four time ranges) and width (with four time ranges) of the gate relative to an external discriminator signal. The chip supports three triggering modes, two time ranges, two power modes, and produces four sparsified analog pulse trains (three for the integrators and another for the time) with synchronized addresses for off-chip digitization with a pipelined ADC. The eight-channel prototype chip occupies an area of 2.8 mmx5.7 mm, dissipates 60 mW (low-power mode), and was fabricated in the AMI 0.5-mum process (C5N).
Design and performance of a multi-channel, multi-sampling, PSD-enabling integrated circuit
International Nuclear Information System (INIS)
Engel, G.L.; Hall, M.J.; Proctor, J.M.; Elson, J.M.; Sobotka, L.G.; Shane, R.; Charity, R.J.
2009-01-01
This paper presents the design and test results of an eight-channel prototype integrated circuit chip intended to greatly simplify the pulse-processing electronics needed for large arrays of scintillation detectors. Because the chip design employs (user-controlled) multi-region charge integration, particle identification is incorporated into the basic design. Each channel on the chip also contains a time-to-voltage converter which provides relative time information. The pulse-height integrals and the relative time are all stored on capacitors and are either reset, after a user controlled time, or sequentially read out if acquisition of the event is desired. Each of the three pulse-height sub-channels consists of a gated integrator with eight programmable charging rates and an externally programmable gate generator that defines the start (with four time ranges) and width (with four time ranges) of the gate relative to an external discriminator signal. The chip supports three triggering modes, two time ranges, two power modes, and produces four sparsified analog pulse trains (three for the integrators and another for the time) with synchronized addresses for off-chip digitization with a pipelined ADC. The eight-channel prototype chip occupies an area of 2.8 mmx5.7 mm, dissipates 60 mW (low-power mode), and was fabricated in the AMI 0.5-μm process (C5N).
2016-03-01
ARL-TN-0743 ● MAR 2016 US Army Research Laboratory Microwave Integrated Circuit Amplifier Designs Submitted to Qorvo for...originator. ARL-TN-0743 ● MAR 2016 US Army Research Laboratory Microwave Integrated Circuit Amplifier Designs Submitted to Qorvo...To) October 2015–January 2016 4. TITLE AND SUBTITLE Microwave Integrated Circuit Amplifier Designs Submitted to Qorvo for Fabrication with 0.09
Chemical sensors fabricated by a photonic integrated circuit foundry
Stievater, Todd H.; Koo, Kee; Tyndall, Nathan F.; Holmstrom, Scott A.; Kozak, Dmitry A.; Goetz, Peter G.; McGill, R. Andrew; Pruessner, Marcel W.
2018-02-01
We describe the detection of trace concentrations of chemical agents using waveguide-enhanced Raman spectroscopy in a photonic integrated circuit fabricated by AIM Photonics. The photonic integrated circuit is based on a five-centimeter long silicon nitride waveguide with a trench etched in the top cladding to allow access to the evanescent field of the propagating mode by analyte molecules. This waveguide transducer is coated with a sorbent polymer to enhance detection sensitivity and placed between low-loss edge couplers. The photonic integrated circuit is laid-out using the AIM Photonics Process Design Kit and fabricated on a Multi-Project Wafer. We detect chemical warfare agent simulants at sub parts-per-million levels in times of less than a minute. We also discuss anticipated improvements in the level of integration for photonic chemical sensors, as well as existing challenges.
International Nuclear Information System (INIS)
Qian Li-Bo; Xia Yin-Shui; Zhu Zhang-Ming; Ding Rui-Xue; Yang Yin-Tang
2014-01-01
Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three-dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical parameters for the TSV channel, an analytical crosstalk noise model is established to capture the TSV induced crosstalk noise. The impact of various design parameters including insulation dielectric, via pitch, via height, silicon conductivity, and terminal impedance on the crosstalk noise is analyzed with the proposed model. Two approaches are proposed to alleviate the TSV noise, namely, driver sizing and via shielding, and the SPICE results show 241 mV and 379 mV reductions in the peak noise voltage, respectively
Package Holds Five Monolithic Microwave Integrated Circuits
Mysoor, Narayan R.; Decker, D. Richard; Olson, Hilding M.
1996-01-01
Packages protect and hold monolithic microwave integrated circuit (MMIC) chips while providing dc and radio-frequency (RF) electrical connections for chips undergoing development. Required to be compact, lightweight, and rugged. Designed to minimize undesired resonances, reflections, losses, and impedance mismatches.
Accurate Electromagnetic Modeling Methods for Integrated Circuits
Sheng, Z.
2010-01-01
The present development of modern integrated circuits (IC’s) is characterized by a number of critical factors that make their design and verification considerably more difficult than before. This dissertation addresses the important questions of modeling all electromagnetic behavior of features on
Investigation for connecting waveguide in off-planar integrated circuits.
Lin, Jie; Feng, Zhifang
2017-09-01
The transmission properties of a vertical waveguide connected by different devices in off-planar integrated circuits are designed, investigated, and analyzed in detail by the finite-difference time-domain method. The results show that both guide bandwidth and transmission efficiency can be adjusted effectively by shifting the vertical waveguide continuously. Surprisingly, the wide guide band (0.385[c/a]∼0.407[c/a]) and well transmission (-6 dB) are observed simultaneously in several directions when the vertical waveguide is located at a specific location. The results are very important for all-optical integrated circuits, especially in compact integration.
Vertically integrated circuit development at Fermilab for detectors
International Nuclear Information System (INIS)
Yarema, R; Deptuch, G; Hoff, J; Khalid, F; Lipton, R; Shenai, A; Trimpl, M; Zimmerman, T
2013-01-01
Today vertically integrated circuits, (a.k.a. 3D integrated circuits) is a popular topic in many trade journals. The many advantages of these circuits have been described such as higher speed due to shorter trace lenghts, the ability to reduce cross talk by placing analog and digital circuits on different levels, higher circuit density without the going to smaller feature sizes, lower interconnect capacitance leading to lower power, reduced chip size, and different processing for the various layers to optimize performance. There are some added advantages specifically for MAPS (Monolithic Active Pixel Sensors) in High Energy Physics: four side buttable pixel arrays, 100% diode fill factor, the ability to move PMOS transistors out of the diode sensing layer, and a increase in channel density. Fermilab began investigating 3D circuits in 2006. Many different bonding processes have been described for fabricating 3D circuits [1]. Fermilab has used three different processes to fabricate several circuits for specific applications in High Energy Physics and X-ray imaging. This paper covers some of the early 3D work at Fermilab and then moves to more recent activities. The major processes we have used are discussed and some of the problems encountered are described. An overview of pertinent 3D circuit designs is presented along with test results thus far.
High transition temperature superconducting integrated circuit
International Nuclear Information System (INIS)
DiIorio, M.S.
1985-01-01
This thesis describes the design and fabrication of the first superconducting integrated circuit capable of operating at over 10K. The primary component of the circuit is a dc SQUID (Superconducting QUantum Interference Device) which is extremely sensitive to magnetic fields. The dc SQUID consists of two superconductor-normal metal-superconductor (SNS) Josephson microbridges that are fabricated using a novel step-edge process which permits the use of high transition temperature superconductors. By utilizing electron-beam lithography in conjunction with ion-beam etching, very small microbridges can be produced. Such microbridges lead to high performance dc SQUIDs with products of the critical current and normal resistance reaching 1 mV at 4.2 K. These SQUIDs have been extensively characterized, and exhibit excellent electrical characteristics over a wide temperature range. In order to couple electrical signals into the SQUID in a practical fashion, a planar input coil was integrated for efficient coupling. A process was developed to incorporate the technologically important high transition temperature superconducting materials, Nb-Sn and Nb-Ge, using integrated circuit techniques. The primary obstacles were presented by the metallurgical idiosyncrasies of the various materials, such as the need to deposit the superconductors at elevated temperatures, 800-900 0 C, in order to achieve a high transition temperature
Garcia-Sciveres, Maurice
2017-01-01
Implementation details for the RD53A pixel readout integrated circuit designed by the RD53 Collaboration. This is a companion to the specifications document and will eventually become a reference for chip users. RD53A is not intended to be a final production IC for use in an experiment, and contains design variations for testing purposes, making the pixel matrix non-uniform. The chip size is 20.0 mm by 11.8 mm.
Monolithic microwave integrated circuit with integral array antenna
International Nuclear Information System (INIS)
Stockton, R.J.; Munson, R.E.
1984-01-01
A monolithic microwave integrated circuit including an integral array antenna. The system includes radiating elements, feed network, phasing network, active and/or passive semiconductor devices, digital logic interface circuits and a microcomputer controller simultaneously incorporated on a single substrate by means of a controlled fabrication process sequence
Palchaudhuri, Ayan
2016-01-01
This book describes the optimized implementations of several arithmetic datapath, controlpath and pseudorandom sequence generator circuits for realization of high performance arithmetic circuits targeted towards a specific family of the high-end Field Programmable Gate Arrays (FPGAs). It explores regular, modular, cascadable, and bit-sliced architectures of these circuits, by directly instantiating the target FPGA-specific primitives in the HDL. Every proposed architecture is justified with detailed mathematical analyses. Simultaneously, constrained placement of the circuit building blocks is performed, by placing the logically related hardware primitives in close proximity to one another by supplying relevant placement constraints in the Xilinx proprietary “User Constraints File”. The book covers the implementation of a GUI-based CAD tool named FlexiCore integrated with the Xilinx Integrated Software Environment (ISE) for design automation of platform-specific high-performance arithmetic circuits from us...
Integrated Circuit Design of 3 Electrode Sensing System Using Two-Stage Operational Amplifier
Rani, S.; Abdullah, W. F. H.; Zain, Z. M.; N, Aqmar N. Z.
2018-03-01
This paper presents the design of a two-stage operational amplifier(op amp) for 3-electrode sensing system readout circuits. The designs have been simulated using 0.13μm CMOS technology from Silterra (Malaysia) with Mentor graphics tools. The purpose of this projects is mainly to design a miniature interfacing circuit to detect the redox reaction in the form of current using standard analog modules. The potentiostat consists of several op amps combined together in order to analyse the signal coming from the 3-electrode sensing system. This op amp design will be used in potentiostat circuit device and to analyse the functionality for each module of the system.
Progress in radiation immune thermionic integrated circuits
International Nuclear Information System (INIS)
Lynn, D.K.; McCormick, J.B.
1985-08-01
This report describes the results of a program directed at evaluating the thermionic integrated circuit (TIC) technology for applicability to military systems. Previous programs under the sponsorship of the Department of Energy, Office of Basic Energy Sciences, have developed an initial TIC technology base and demonstrated operation in high-temperature and high-radiation environments. The program described in this report has two parts: (1) a technical portion in which experiments and analyses were conducted to refine perceptions of near-term as well as ultimate performance levels of the TIC technology and (2) an applications portion in which the technical conclusions were to be evaluated against potential military applications. This report draws several conclusions that strongly suggest that (1) useful radiation-hard/high-temperature operable integrated circuits can be developed using the TIC technology; (2) because of their ability to survive and operate in hostile environments, a variety of potential military applications have been projected for this technology; and (3) based on the above two conclusions, an aggressive TIC development program should be initiated to provide the designers of future systems with integrated circuits and devices with the unique features of the TICs
Progress in radiation immune thermionic integrated circuits
Energy Technology Data Exchange (ETDEWEB)
Lynn, D.K.; McCormick, J.B. (comps.)
1985-08-01
This report describes the results of a program directed at evaluating the thermionic integrated circuit (TIC) technology for applicability to military systems. Previous programs under the sponsorship of the Department of Energy, Office of Basic Energy Sciences, have developed an initial TIC technology base and demonstrated operation in high-temperature and high-radiation environments. The program described in this report has two parts: (1) a technical portion in which experiments and analyses were conducted to refine perceptions of near-term as well as ultimate performance levels of the TIC technology and (2) an applications portion in which the technical conclusions were to be evaluated against potential military applications. This report draws several conclusions that strongly suggest that (1) useful radiation-hard/high-temperature operable integrated circuits can be developed using the TIC technology; (2) because of their ability to survive and operate in hostile environments, a variety of potential military applications have been projected for this technology; and (3) based on the above two conclusions, an aggressive TIC development program should be initiated to provide the designers of future systems with integrated circuits and devices with the unique features of the TICs.
Three-dimensional integrated circuit design
Xie, Yuan; Sapatnekar, Sachin S
2009-01-01
This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutio
Deeply-etched DBR mirrors for photonic integrated circuits and tunable lasers
Docter, B.
2009-01-01
Deeply-etched Distributed Bragg Reflector (DBR) mirrors are a new versatile building block for Photonic Integrated Circuits that allows us to create more complex circuits for optical telecommunication applications. The DBR mirrors increase the device design flexibility because the mirrors can be
Silicon-based optical integrated circuits for terabit communication networks
International Nuclear Information System (INIS)
Svidzinsky, K K
2003-01-01
A brief review is presented of the development of silicon-based optical integrated circuits used as components in modern all-optical communication networks with the terabit-per-second transmission capacity. The designs and technologies for manufacturing these circuits are described and the problems related to their development and application in WDM communication systems are considered. (special issue devoted to the memory of academician a m prokhorov)
Development of integrated thermionic circuits for high-temperature applications
International Nuclear Information System (INIS)
McCormick, J.B.; Wilde, D.; Depp, S.; Hamilton, D.J.; Kerwin, W.; Derouin, C.; Roybal, L.; Dooley, R.
1981-01-01
A class of devices known as integrated thermionic circuits (ITC) capable of extended operation in ambient temperatures up to 500 0 C is described. The evolution of the ITC concept is discussed. A set of practical design and performance equations is demonstrated. Recent experimental results are discussed in which both devices and simple circuits have successfully operated in 500 0 C environments for extended periods of time
Integrated biocircuits: engineering functional multicellular circuits and devices
Prox, Jordan; Smith, Tory; Holl, Chad; Chehade, Nick; Guo, Liang
2018-04-01
Objective. Implantable neurotechnologies have revolutionized neuromodulatory medicine for treating the dysfunction of diseased neural circuitry. However, challenges with biocompatibility and lack of full control over neural network communication and function limits the potential to create more stable and robust neuromodulation devices. Thus, we propose a platform technology of implantable and programmable cellular systems, namely Integrated Biocircuits, which use only cells as the functional components of the device. Approach. We envision the foundational principles for this concept begins with novel in vitro platforms used for the study and reconstruction of cellular circuitry. Additionally, recent advancements in organoid and 3D culture systems account for microenvironment factors of cytoarchitecture to construct multicellular circuits as they are normally formed in the brain. We explore the current state of the art of these platforms to provide knowledge of their advancements in circuit fabrication and identify the current biological principles that could be applied in designing integrated biocircuit devices. Main results. We have highlighted the exemplary methodologies and techniques of in vitro circuit fabrication and propose the integration of selected controllable parameters, which would be required in creating suitable biodevices. Significance. We provide our perspective and propose new insights into the future of neuromodulaion devices within the scope of living cellular systems that can be applied in designing more reliable and biocompatible stimulation-based neuroprosthetics.
Semiconductor integrated circuits
International Nuclear Information System (INIS)
Michel, A.E.; Schwenker, R.O.; Ziegler, J.F.
1979-01-01
An improved method involving ion implantation to form non-epitaxial semiconductor integrated circuits. These are made by forming a silicon substrate of one conductivity type with a recessed silicon dioxide region extending into the substrate and enclosing a portion of the silicon substrate. A beam of ions of opposite conductivity type impurity is directed at the substrate at an energy and dosage level sufficient to form a first region of opposite conductivity within the silicon dioxide region. This impurity having a concentration peak below the surface of the substrate forms a region of the one conductivity type which extends from the substrate surface into the first opposite type region to a depth between the concentration peak and the surface and forms a second region of opposite conductivity type. The method, materials and ion beam conditions are detailed. Vertical bipolar integrated circuits can be made this way when the first opposite type conductivity region will function as a collector. Also circuits with inverted bipolar devices when this first region functions as a 'buried'' emitter region. (U.K.)
Silicon integrated circuit process
International Nuclear Information System (INIS)
Lee, Jong Duck
1985-12-01
This book introduces the process of silicon integrated circuit. It is composed of seven parts, which are oxidation process, diffusion process, ion implantation process such as ion implantation equipment, damage, annealing and influence on manufacture of integrated circuit and device, chemical vapor deposition process like silicon Epitaxy LPCVD and PECVD, photolithography process, including a sensitizer, spin, harden bake, reflection of light and problems related process, infrared light bake, wet-etch, dry etch, special etch and problems of etching, metal process like metal process like metal-silicon connection, aluminum process, credibility of aluminum and test process.
Silicon integrated circuit process
Energy Technology Data Exchange (ETDEWEB)
Lee, Jong Duck
1985-12-15
This book introduces the process of silicon integrated circuit. It is composed of seven parts, which are oxidation process, diffusion process, ion implantation process such as ion implantation equipment, damage, annealing and influence on manufacture of integrated circuit and device, chemical vapor deposition process like silicon Epitaxy LPCVD and PECVD, photolithography process, including a sensitizer, spin, harden bake, reflection of light and problems related process, infrared light bake, wet-etch, dry etch, special etch and problems of etching, metal process like metal process like metal-silicon connection, aluminum process, credibility of aluminum and test process.
CMOS-based carbon nanotube pass-transistor logic integrated circuits
Ding, Li; Zhang, Zhiyong; Liang, Shibo; Pei, Tian; Wang, Sheng; Li, Yan; Zhou, Weiwei; Liu, Jie; Peng, Lian-Mao
2012-01-01
Field-effect transistors based on carbon nanotubes have been shown to be faster and less energy consuming than their silicon counterparts. However, ensuring these advantages are maintained for integrated circuits is a challenge. Here we demonstrate that a significant reduction in the use of field-effect transistors can be achieved by constructing carbon nanotube-based integrated circuits based on a pass-transistor logic configuration, rather than a complementary metal-oxide semiconductor configuration. Logic gates are constructed on individual carbon nanotubes via a doping-free approach and with a single power supply at voltages as low as 0.4 V. The pass-transistor logic configurarion provides a significant simplification of the carbon nanotube-based circuit design, a higher potential circuit speed and a significant reduction in power consumption. In particular, a full adder, which requires a total of 28 field-effect transistors to construct in the usual complementary metal-oxide semiconductor circuit, uses only three pairs of n- and p-field-effect transistors in the pass-transistor logic configuration. PMID:22334080
Energy efficient circuit design using nanoelectromechanical relays
Venkatasubramanian, Ramakrishnan
Nano-electromechanical (NEM) relays are a promising class of emerging devices that offer zero off-state leakage and behave like an ideal switch. Recent advances in planar fabrication technology have demonstrated that microelectromechanical (MEMS) scale miniature relays could be manufactured reliably and could be used to build fully functional, complex integrated circuits. The zero leakage operation of relays has renewed the interest in relay based low power logic design. This dissertation explores circuit architectures using NEM relays and NEMS-CMOS heterogeneous integration. Novel circuit topologies for sequential logic, memory, and power management circuits have been proposed taking into consideration the NEM relay device properties and optimizing for energy efficiency and area. In nanoscale electromechanical devices, dispersion forces like Van der Waals' force (vdW) affect the pull-in stability of the relay devices significantly. Verilog-A electromechanical model of the suspended gate relay operating at 1V with a nominal air gap of 5 - 10nm has been developed taking into account all the electrical, mechanical and dispersion effects. This dissertation explores different relay based latch and flip-flop topologies. It has been shown that as few as 4 relay cells could be used to build flip-flops. An integrated voltage doubler based flip flop that improves the performance by 2X by overdriving Vgb has been proposed. Three NEM relay based parallel readout memory bitcell architectures have been proposed that have faster access time, and remove the reliability issues associated with previously reported serial readout architectures. A paradigm shift in design of power switches using NEM relays is proposed. An interesting property of the relay device is that the ON state resistance (Ron) of the NEM relay switch is constant and is insensitive to the gate slew rate. This coupled with infinite OFF state resistance (Roff ) offers significant area and power advantages over CMOS
Microcontroller based Integrated Circuit Tester
Yousif Taha Yousif Elamin; Abdelrasoul Jabar Alzubaidi
2015-01-01
The digital integrated circuit (IC) tester is implemented by using the ATmega32 microcontroller . The microcontroller processes the inputs and outputs and displays the results on a Liquid Crystal Display (LCD). The basic function of the digital IC tester is to test a digital IC for correct logical functioning as described in the truth table and/or function table. The designed model can test digital ICs having 14 pins. Since it is programmable, any number of ICs can be tested . Thi...
Krainak, Michael; Merritt, Scott
2016-01-01
Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.
Energy Technology Data Exchange (ETDEWEB)
Borisov, V.S.; Vlasov, F.S.; Kaloshkin, E.P.; Serzhanovich, D.S.; Sukhoparov, A.I.
1984-01-01
Progress in developing microprocessor computer hardware is based on progress and improvement in systems engineering, circuit engineering and manufacturing process methods of design and development of large-scale integrated circuits (BIS). Development of these methods with widespread use of computer-aided design (CAD) systems has allowed developing 4- and 8-bit microprocessor families (MPK) of LSI circuits based on integrated injection logic (I/sup 2/L), characterized by relatively high speed and low dissipated power. The emergence of LSI and VLSI microprocessor circuits required computer system developers to make changes to theory and practice of computer system design. Progress in technology upset the established relation between hardware and software component development costs in systems being designed. A characteristic feature of using LSI circuits is also the necessity of building devices from standard modules with large functional complexity. The existing directions of forming compositions of LSI microprocessor families allow the system developer to choose a particular methodology of design, proceeding from the efficiency function and field of application of the system being designed. The efficiency of using microprocessor families is largely governed by the user's understanding in depth of the structure of LSI microprocessor family circuits and the features of using them to implement a broad class of computer devices and modules being developed. This book is devoted to solving this problem.
A novel readout integrated circuit for ferroelectric FPA detector
Bai, Piji; Li, Lihua; Ji, Yulong; Zhang, Jia; Li, Min; Liang, Yan; Hu, Yanbo; Li, Songying
2017-11-01
Uncooled infrared detectors haves some advantages such as low cost light weight low power consumption, and superior reliability, compared with cryogenically cooled ones Ferroelectric uncooled focal plane array(FPA) are being developed for its AC response and its high reliability As a key part of the ferroelectric assembly the ROIC determines the performance of the assembly. A top-down design model for uncooled ferroelectric readout integrated circuit(ROIC) has been developed. Based on the optical thermal and electrical properties of the ferroelectric detector the RTIA readout integrated circuit is designed. The noise bandwidth of RTIA readout circuit has been developed and analyzed. A novel high gain amplifier, a high pass filter and a low pass filter circuits are designed on the ROIC. In order to improve the ferroelectric FPA package performance and decrease of package cost a temperature sensor is designed on the ROIC chip At last the novel RTIA ROIC is implemented on 0.6μm 2P3M CMOS silicon techniques. According to the experimental chip test results the temporal root mean square(RMS)noise voltage is about 1.4mV the sensitivity of the on chip temperature sensor is 0.6 mV/K from -40°C to 60°C the linearity performance of the ROIC chip is better than 99% Based on the 320×240 RTIA ROIC, a 320×240 infrared ferroelectric FPA is fabricated and tested. Test results shows that the 320×240 RTIA ROIC meets the demand of infrared ferroelectric FPA.
Design and implementation of Gm-APD array readout integrated circuit for infrared 3D imaging
Zheng, Li-xia; Yang, Jun-hao; Liu, Zhao; Dong, Huai-peng; Wu, Jin; Sun, Wei-feng
2013-09-01
A single-photon detecting array of readout integrated circuit (ROIC) capable of infrared 3D imaging by photon detection and time-of-flight measurement is presented in this paper. The InGaAs avalanche photon diodes (APD) dynamic biased under Geiger operation mode by gate controlled active quenching circuit (AQC) are used here. The time-of-flight is accurately measured by a high accurate time-to-digital converter (TDC) integrated in the ROIC. For 3D imaging, frame rate controlling technique is utilized to the pixel's detection, so that the APD related to each pixel should be controlled by individual AQC to sense and quench the avalanche current, providing a digital CMOS-compatible voltage pulse. After each first sense, the detector is reset to wait for next frame operation. We employ counters of a two-segmental coarse-fine architecture, where the coarse conversion is achieved by a 10-bit pseudo-random linear feedback shift register (LFSR) in each pixel and a 3-bit fine conversion is realized by a ring delay line shared by all pixels. The reference clock driving the LFSR counter can be generated within the ring delay line Oscillator or provided by an external clock source. The circuit is designed and implemented by CSMC 0.5μm standard CMOS technology and the total chip area is around 2mm×2mm for 8×8 format ROIC with 150μm pixel pitch. The simulation results indicate that the relative time resolution of the proposed ROIC can achieve less than 1ns, and the preliminary test results show that the circuit function is correct.
A full feature FASTBUS slave interface using semicustom integrated circuits
International Nuclear Information System (INIS)
Skegg, R.; Daviel, A.; Downing, R.
1986-01-01
Two semi-custom integrated circuits have been designed and manufactured which enable the construction of a full featured FASTBUS slave interface without the need for a detailed knowledge of the FASTBUS protocol. A relatively small amount of board space is required compared to implementations using conventional circuits. The semi-custom devices are described in detail, and an application example is given. (orig.)
Application specific integrated circuit for high temperature oil well applications
Energy Technology Data Exchange (ETDEWEB)
Fallet, T.; Gakkestad, J.; Forre, G.
1994-12-31
This paper describes the design of an integrated BiCMOS circuit for high temperature applications. The circuit contains Pierce oscillators with automatic gain control, and measurements show that it is operating up to 266{sup o}C. The relative frequency variation up to 200 {sup o}C is less than 60 ppm caused mainly by the crystal element itself. 4 refs., 7 figs.
Digitally-assisted analog and RF CMOS circuit design for software-defined radio
Okada, Kenichi
2011-01-01
This book describes the state-of-the-art in RF, analog, and mixed-signal circuit design for Software Defined Radio (SDR). It synthesizes for analog/RF circuit designers the most important general design approaches to take advantage of the most recent CMOS technology, which can integrate millions of transistors, as well as several real examples from the most recent research results.
Analog Circuit Design Optimization Based on Evolutionary Algorithms
Directory of Open Access Journals (Sweden)
Mansour Barari
2014-01-01
Full Text Available This paper investigates an evolutionary-based designing system for automated sizing of analog integrated circuits (ICs. Two evolutionary algorithms, genetic algorithm and PSO (Parswal particle swarm optimization algorithm, are proposed to design analog ICs with practical user-defined specifications. On the basis of the combination of HSPICE and MATLAB, the system links circuit performances, evaluated through specific electrical simulation, to the optimization system in the MATLAB environment, for the selected topology. The system has been tested by typical and hard-to-design cases, such as complex analog blocks with stringent design requirements. The results show that the design specifications are closely met. Comparisons with available methods like genetic algorithms show that the proposed algorithm offers important advantages in terms of optimization quality and robustness. Moreover, the algorithm is shown to be efficient.
Yi, He; Bao, Xin-Yu; Tiberio, Richard; Wong, H-S Philip
2015-02-11
Directed self-assembly (DSA) is a promising lithography candidate for technology nodes beyond 14 nm. Researchers have shown contact hole patterning for random logic circuits using DSA with small physical templates. This paper introduces an alphabet approach that uses a minimal set of small physical templates to pattern all contacts configurations on integrated circuits. We illustrate, through experiments, a general and scalable template design strategy that links the DSA material properties to the technology node requirements.
Integrated digital superconducting logic circuits for the quantum synthesizer. Report
International Nuclear Information System (INIS)
Buchholz, F.I.; Kohlmann, J.; Khabipov, M.; Brandt, C.M.; Hagedorn, D.; Balashov, D.; Maibaum, F.; Tolkacheva, E.; Niemeyer, J.
2006-11-01
This report presents the results, which were reached in the framework of the BMBF cooperative plan ''Quantum Synthesizer'' in the partial plan ''Integrated Digital Superconducting Logic Circuits''. As essential goal of the plan a novel instrument on the base of quantum-coherent superconducting circuits should be developed. which allows to generate praxis-relevant wave forms with quantum accuracy, the quantum synthesizer. The main topics of development of the reported partial plan lied at the one hand in the development of integrated, digital, superconducting circuit in rapid-single-flux (RSFQ) quantum logics for the pattern generator of the quantum synthesizer, at the other hand in the further development of the fabrication technology for the aiming of high circuit complexity. In order to fulfil these requirements at the PTB a new design system was implemented, based on the software of Cadence. Together with the required RSFQ extensions for the design of digital superconducting circuits was a platform generated, on which the reachable circuit complexity is exclusively limited by the technology parameters of the available fabrication technology: Physical simulations are with PSCAN up to a complexity of more than 1000 circuit elements possible; furthermore VHDL allows the verification of arbitrarily large circuit architectures. In accordance for this the production line at the PTB was brought to a level, which allows in Nb/Al-Al x O y /Nb SIS technology implementation the fabrication of highly integrable RSFQ circuit architectures. The developed and fabricated basic circuits of the pattern generator have proved correct functionality and reliability in the measuring operation. Thereby for the circular RSFQ shift registers a key role as local memories in the construction of the pattern generator is devolved upon. The registers were realized with the aimed bit lengths up to 128 bit and with reachable signal-processing speeds of above 10 GHz. At the interface RSFQ
Active components for integrated plasmonic circuits
DEFF Research Database (Denmark)
Krasavin, A.V.; Bolger, P.M.; Zayats, A.V.
2009-01-01
We present a comprehensive study of highly efficient and compact passive and active components for integrated plasmonic circuit based on dielectric-loaded surface plasmon polariton waveguides.......We present a comprehensive study of highly efficient and compact passive and active components for integrated plasmonic circuit based on dielectric-loaded surface plasmon polariton waveguides....
Silicon integrated circuits part A : supplement 2
Kahng, Dawon
1981-01-01
Applied Solid State Science, Supplement 2: Silicon Integrated Circuits, Part A focuses on MOS device physics. This book is divided into three chapters-physics of the MOS transistor; nonvolatile memories; and properties of silicon-on-sapphire substrates devices, and integrated circuits. The topics covered include the short channel effects, MOSFET structures, floating gate devices, technology for nonvolatile semiconductor memories, sapphire substrates, and SOS integrated circuits and systems. The MOS capacitor, MIOS devices, and SOS process and device technology are also deliberated. This public
The design of a semi-custom intergrated circuit for the SLAC SLC timing control system
International Nuclear Information System (INIS)
Linstadt, E.
1985-01-01
A semi-custom (gate array) integrated circuit has been designed for use in the SLAC Linear Collider timing and control system. The design process and SLAC's experiences during the phases of the design cycle are described. Issues concerning the partitioning of the design into semi-custom and standard components are discussed. Functional descriptions of the semi-custom integrated circuit and the timing module in which it is used are given
Data readout system utilizing photonic integrated circuit
Energy Technology Data Exchange (ETDEWEB)
Stopiński, S., E-mail: S.Stopinski@tue.nl [COBRA Research Institute, Eindhoven University of Technology (Netherlands); Institute of Microelectronics and Optoelectronics, Warsaw University of Technology (Poland); Malinowski, M.; Piramidowicz, R. [Institute of Microelectronics and Optoelectronics, Warsaw University of Technology (Poland); Smit, M.K.; Leijtens, X.J.M. [COBRA Research Institute, Eindhoven University of Technology (Netherlands)
2013-10-11
We describe a novel optical solution for data readout systems. The core of the system is an Indium-Phosphide photonic integrated circuit performing as a front-end readout unit. It functions as an optical serializer in which the serialization of the input signal is provided by means of on-chip optical delay lines. The circuit employs electro-optic phase shifters to build amplitude modulators, power splitters for signal distribution, semiconductor optical amplifiers for signal amplification as well as on-chip reflectors. We present the concept of the system, the design and first characterization results of the devices that were fabricated in a multi-project wafer run.
Thermally-isolated silicon-based integrated circuits and related methods
Wojciechowski, Kenneth; Olsson, Roy H.; Clews, Peggy J.; Bauer, Todd
2017-05-09
Thermally isolated devices may be formed by performing a series of etches on a silicon-based substrate. As a result of the series of etches, silicon material may be removed from underneath a region of an integrated circuit (IC). The removal of the silicon material from underneath the IC forms a gap between remaining substrate and the integrated circuit, though the integrated circuit remains connected to the substrate via a support bar arrangement that suspends the integrated circuit over the substrate. The creation of this gap functions to release the device from the substrate and create a thermally-isolated integrated circuit.
Method of making thermally-isolated silicon-based integrated circuits
Wojciechowski, Kenneth; Olsson, Roy; Clews, Peggy J.; Bauer, Todd
2017-11-21
Thermally isolated devices may be formed by performing a series of etches on a silicon-based substrate. As a result of the series of etches, silicon material may be removed from underneath a region of an integrated circuit (IC). The removal of the silicon material from underneath the IC forms a gap between remaining substrate and the integrated circuit, though the integrated circuit remains connected to the substrate via a support bar arrangement that suspends the integrated circuit over the substrate. The creation of this gap functions to release the device from the substrate and create a thermally-isolated integrated circuit.
Smart Power: New power integrated circuit technologies and their applications
Kuivalainen, Pekka; Pohjonen, Helena; Yli-Pietilae, Timo; Lenkkeri, Jaakko
1992-05-01
Power Integrated Circuits (PIC) is one of the most rapidly growing branches of the semiconductor technology. The PIC markets has been forecast to grow from 660 million dollars in 1990 to 1658 million dollars in 1994. It has even been forecast that at the end of the 1990's the PIC markets would correspond to the value of the whole semiconductor production in 1990. Automotive electronics will play the leading role in the development of the standard PIC's. Integrated motor drivers (36 V/4 A), smart integrated switches (60 V/30 A), solenoid drivers, integrated switch-mode power supplies and regulators are the latest standard devices of the PIC manufactures. ASIC (Application Specific Integrated Circuits) PIC solutions are needed for the same reasons as other ASIC devices: there are no proper standard devices, a company has a lot of application knowhow, which should be kept inside the company, the size of the product must be reduced, and assembly costs are wished to be reduced by decreasing the number of discrete devices. During the next few years the most probable ASIC PIC applications in Finland will be integrated solenoid and motor drivers, an integrated electronic lamp ballast circuit and various sensor interface circuits. Application of the PIC technologies to machines and actuators will strongly be increased all over the world. This means that various PIC's, either standard PIC's or full custom ASIC circuits, will appear in many products which compete with the corresponding Finnish products. Therefore the development of the PIC technologies must be followed carefully in order to immediately be able to apply the latest development in the smart power technologies and their design methods.
Advanced Breakdown Modeling for Solid-State Circuit Design
Milovanovi?, V.
2010-01-01
Modeling of the effects occurring outside the usual region of application of semiconductor devices is becoming more important with increasing demands set upon electronic systems for simultaneous speed and output power. Analog integrated circuit designers are forced to enter regimes of transistor
FDTD-SPICE for Characterizing Metamaterials Integrated with Electronic Circuits
Directory of Open Access Journals (Sweden)
Zhengwei Hao
2012-01-01
Full Text Available A powerful time-domain FDTD-SPICE simulator is implemented and applied to the broadband analysis of metamaterials integrated with active and tunable circuit elements. First, the FDTD-SPICE modeling theory is studied and details of interprocess communication and hybridization of the two techniques are discussed. To verify the model, some simple cases are simulated with results in both time domain and frequency domain. Then, simulation of a metamaterial structure constructed from periodic resonant loops integrated with lumped capacitor elements is studied, which demonstrates tuning resonance frequency of medium by changing the capacitance of the integrated elements. To increase the bandwidth of the metamaterial, non-Foster transistor configurations are integrated with the loops and FDTD-SPICE is applied to successfully bridge the physics of electromagnetic and circuit topologies and to model the whole composite structure. Our model is also applied to the design and simulation of a metasurface integrated with nonlinear varactors featuring tunable reflection phase characteristic.
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits
Directory of Open Access Journals (Sweden)
Domenico Capriglione
2018-03-01
Full Text Available This paper deals with the electromagnetic compatibility (EMC issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs. These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc., based on the Integrated Circuit Emission Model template (ICEM. As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.
Materials issues in silicon integrated circuit processing
International Nuclear Information System (INIS)
Wittmer, M.; Stimmell, J.; Strathman, M.
1986-01-01
The symposium on ''Materials Issues in Integrated Circuit Processing'' sought to bring together all of the materials issued pertinent to modern integrated circuit processing. The inherent properties of the materials are becoming an important concern in integrated circuit manufacturing and accordingly research in materials science is vital for the successful implementation of modern integrated circuit technology. The session on Silicon Materials Science revealed the advanced stage of knowledge which topics such as point defects, intrinsic and extrinsic gettering and diffusion kinetics have achieved. Adaption of this knowledge to specific integrated circuit processing technologies is beginning to be addressed. The session on Epitaxy included invited papers on epitaxial insulators and IR detectors. Heteroepitaxy on silicon is receiving great attention and the results presented in this session suggest that 3-d integrated structures are an increasingly realistic possibility. Progress in low temperature silicon epitaxy and epitaxy of thin films with abrupt interfaces was also reported. Diffusion and Ion Implantation were well presented. Regrowth of implant-damaged layers and the nature of the defects which remain after regrowth were discussed in no less than seven papers. Substantial progress was also reported in the understanding of amorphising boron implants and the use of gallium implants for the formation of shallow p/sup +/ -layers
A Fault Tolerant Integrated Circuit Memory
Barton, Anthony Francis
1980-01-01
Most commercially produced integrated circuits are incapable of tolerating manufacturing defects. The area and function of the circuits is thus limited by the probability of faults occurring within the circuit. This thesis examines techniques for using redundancy in memory circuits to provide fault tolerance and to increase storage capacity. A hierarchical memory architecture using multiple Hamming codes is introduced and analysed to determine its resistance to manufa...
Long-wavelength III-V/silicon photonic integrated circuits
Roelkens, G.C.; Kuyken, B.; Leo, F.; Hattasan, N.; Ryckeboer, E.M.P.; Muneeb, M.; Hu, C.L.; Malik, A.; Hens, Z.; Baets, R.G.F.; Shimura, Y.; Gencarelli, F.; Vincent, B.; Loo, van de R.; Verheyen, P.A.; Lepage, G.; Campenhout, van J.; Cerutti, L.; Rodriquez, J.B.; Tournie, E.; Chen, X; Nedeljkovic, G.; Mashanovich, G.; Liu, X.; Green, W.S.
2013-01-01
We review our work in the field of short-wave infrared and mid-infrared photonic integrated circuits for applications in spectroscopic sensing systems. Passive silicon waveguide circuits, GeSn photodetectors, the integration of III-V and IV-VI semiconductors on these circuits, and silicon nonlinear
Advanced field-solver techniques for RC extraction of integrated circuits
Yu, Wenjian
2014-01-01
Resistance and capacitance (RC) extraction is an essential step in modeling the interconnection wires and substrate coupling effect in nanometer-technology integrated circuits (IC). The field-solver techniques for RC extraction guarantee the accuracy of modeling, and are becoming increasingly important in meeting the demand for accurate modeling and simulation of VLSI designs. Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits presents a systematic introduction to, and treatment of, the key field-solver methods for RC extraction of VLSI interconnects and substrate coupling in mixed-signal ICs. Various field-solver techniques are explained in detail, with real-world examples to illustrate the advantages and disadvantages of each algorithm. This book will benefit graduate students and researchers in the field of electrical and computer engineering, as well as engineers working in the IC design and design automation industries. Dr. Wenjian Yu is an Associate Professor at the Department of ...
Integrated circuit amplifiers for multi-electrode intracortical recording.
Jochum, Thomas; Denison, Timothy; Wolf, Patrick
2009-02-01
Significant progress has been made in systems that interpret the electrical signals of the brain in order to control an actuator. One version of these systems senses neuronal extracellular action potentials with an array of up to 100 miniature probes inserted into the cortex. The impedance of each probe is high, so environmental electrical noise is readily coupled to the neuronal signal. To minimize this noise, an amplifier is placed close to each probe. Thus, the need has arisen for many amplifiers to be placed near the cortex. Commercially available integrated circuits do not satisfy the area, power and noise requirements of this application, so researchers have designed custom integrated-circuit amplifiers. This paper presents a comprehensive survey of the neural amplifiers described in publications prior to 2008. Methods to achieve high input impedance, low noise and a large time-constant high-pass filter are reviewed. A tutorial on the biological, electrochemical, mechanical and electromagnetic phenomena that influence amplifier design is provided. Areas for additional research, including sub-nanoampere electrolysis and chronic cortical heating, are discussed. Unresolved design concerns, including teraohm circuitry, electrical overstress and component failure, are identified.
Amos, S W
2013-01-01
For over thirty years, Stan Amos has provided students and practitioners with a text they could rely on to keep them at the forefront of transistor circuit design. This seminal work has now been presented in a clear new format and completely updated to include the latest equipment such as laser diodes, Trapatt diodes, optocouplers and GaAs transistors, and the most recent line output stages and switch-mode power supplies.Although integrated circuits have widespread application, the role of discrete transistors is undiminished, both as important building blocks which students must understand an
INTEGRATED SENSOR EVALUATION CIRCUIT AND METHOD FOR OPERATING SAID CIRCUIT
Krüger, Jens; Gausa, Dominik
2015-01-01
WO15090426A1 Sensor evaluation device and method for operating said device Integrated sensor evaluation circuit for evaluating a sensor signal (14) received from a sensor (12), having a first connection (28a) for connection to the sensor and a second connection (28b) for connection to the sensor. The integrated sensor evaluation circuit comprises a configuration data memory (16) for storing configuration data which describe signal properties of a plurality of sensor control signals (26a-c). T...
Monolithic integration of micromachined sensors and CMOS circuits based on SOI technologies
International Nuclear Information System (INIS)
Yu Xiaomei; Tang Yaquan; Zhang Haitao
2008-01-01
This note presents a novel way to monolithically integrate micro-cantilever sensors and signal conditioning circuits by combining SOI CMOS and SOI micromachining technologies. In order to improve the sensor performance and reduce the system volume, an integrated sensor system composed of a piezoresistive cantilever array, a temperature-compensation current reference, a digitally controlled multiplexer and an instrument amplifier is designed and finally fabricated. A post-SOI CMOS process is developed to realize the integrated sensor system which is based on a standard CMOS process with one more mask to define the cantilever structure at the end of the process. Measurements on the finished SOI CMOS devices and circuits show that the integration process has good compatibility both for the cantilever sensors and for the CMOS circuits, and the SOI CMOS integration process can decrease about 25% sequences compared with the bulk silicon CMOS process. (note)
Organic printed photonics: From microring lasers to integrated circuits.
Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng
2015-09-01
A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.
Hybdrid integral circuit for proportional chambers
International Nuclear Information System (INIS)
Yanik, R.; Khudy, M.; Povinets, P.; Strmen', P.; Grabachek, Z.; Feshchenko, A.A.
1978-01-01
Outlined briefly are a hybrid integrated circuit of the channel. One channel contains an input amplifier, delay circuit, and memory register on the base of the D-type flip-flop and controlled by the recording gate pulse. Provided at the output of the channel is a readout gating circuit. Presented are the flowsheet of the channel, the shaper amplifier and logical channel. At present the logical circuit was accepted for manufacture
Integrated optical circuit comprising a polarization convertor
1998-01-01
An integrated optical circuit includes a first device and a second device, which devices are connected by a polarization convertor. The polarization convertor includes a curved section of a waveguide, integrated in the optical circuit. The curved section may have several differently curved
High-frequency and microwave circuit design
Nelson, Charles
2007-01-01
An integral part of any communications system, high-frequency and microwave design stimulates major progress in the wireless world and continues to serve as a foundation for the commercial wireless products we use every day. The exceptional pace of advancement in developing these systems stipulates that engineers be well versed in multiple areas of electronics engineering. With more illustrations, examples, and worked problems, High-Frequency and Microwave Circuit Design, Second Edition provides engineers with a diverse body of knowledge they can use to meet the needs of this rapidly progressi
Transistor and integrated circuit manufacture
Energy Technology Data Exchange (ETDEWEB)
Colman, D
1978-09-27
This invention relates to the manufacture of transistors and integrated circuits by ion bombardment techniques and is particularly, but not exclusively, of value in the manufacture of so-called integrated injection logic circuitry.
Quantum dash based single section mode locked lasers for photonic integrated circuits.
Joshi, Siddharth; Calò, Cosimo; Chimot, Nicolas; Radziunas, Mindaugas; Arkhipov, Rostislav; Barbet, Sophie; Accard, Alain; Ramdane, Abderrahim; Lelarge, Francois
2014-05-05
We present the first demonstration of an InAs/InP Quantum Dash based single-section frequency comb generator designed for use in photonic integrated circuits (PICs). The laser cavity is closed using a specifically designed Bragg reflector without compromising the mode-locking performance of the self pulsating laser. This enables the integration of single-section mode-locked laser in photonic integrated circuits as on-chip frequency comb generators. We also investigate the relations between cavity modes in such a device and demonstrate how the dispersion of the complex mode frequencies induced by the Bragg grating implies a violation of the equi-distance between the adjacent mode frequencies and, therefore, forbids the locking of the modes in a classical Bragg Device. Finally we integrate such a Bragg Mirror based laser with Semiconductor Optical Amplifier (SOA) to demonstrate the monolithic integration of QDash based low phase noise sources in PICs.
Flexible circuits with integrated switches for robotic shape sensing
Harnett, C. K.
2016-05-01
Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.
Integrated circuit devices in control systems of coal mining complexes
Energy Technology Data Exchange (ETDEWEB)
1983-01-01
Systems of automatic monitoring and control of coal mining complexes developed in the 1960's used electromagnetic relays, thyristors, and flip-flops on transistors of varying conductivity. The circuits' designers, devoted much attention to ensuring spark safety, lowering power consumption, and raising noise immunity and repairability of functional devices. The fast development of integrated circuitry led to the use of microelectronic components in most devices of mine automation. An analysis of specifications and experimental research into integrated circuits (IMS) shows that the series K 176 IMS components made by CMOS technology best meet mine conditions of operation. The use of IMS devices under mine conditions has demonstrated their high reliability. Further development of integrated circuitry involve using microprocessors and microcomputers. (SC)
Design of CMOS analog integrated fractional-order circuits applications in medicine and biology
Tsirimokou, Georgia; Elwakil, Ahmed
2017-01-01
This book describes the design and realization of analog fractional-order circuits, which are suitable for on-chip implementation, capable of low-voltage operation and electronic adjustment of their characteristics. The authors provide a brief introduction to fractional-order calculus, followed by design issues for fractional-order circuits of various orders and types. The benefits of this approach are demonstrated with current-mode and voltage-mode filter designs. Electronically tunable emulators of fractional-order capacitors and inductors are presented, where the behavior of the corresponding chips fabricated using the AMS 0.35um CMOS process has been experimentally verified. Applications of fractional-order circuits are demonstrated, including a pre-processing stage suitable for the implementation of the Pan-Tompkins algorithm for detecting the QRS complexes of an electrocardiogram (ECG), a fully tunable implementation of the Cole-Cole model used for the modeling of biological tissues, and a simple, non-i...
Transistor and integrated circuit manufacture
International Nuclear Information System (INIS)
Colman, D.
1978-01-01
This invention relates to the manufacture of transistors and integrated circuits by ion bombardment techniques and is particularly, but not exclusively, of value in the manufacture of so-called integrated injection logic circuitry. (author)
Test and verification of a reactor protection system application-specific integrated circuit
International Nuclear Information System (INIS)
Battle, R.E.; Turner, G.W.; Vandermolen, R.I.; Vitalbo, C.
1997-01-01
Application-specific integrated circuits (ASICs) were utilized in the design of nuclear plant safety systems because they have certain advantages over software-based systems and analog-based systems. An advantage they have over software-based systems is that an ASIC design can be simple enough to not include branch statements and also can be thoroughly tested. A circuit card on which an ASIC is mounted can be configured to replace various versions of older analog equipment with fewer design types required. The approach to design and testing of ASICs for safety system applications is discussed in this paper. Included are discussions of the ASIC architecture, how it is structured to assist testing, and of the functional and enhanced circuit testing
Foundry fabricated photonic integrated circuit optical phase lock loop.
Bałakier, Katarzyna; Fice, Martyn J; Ponnampalam, Lalitha; Graham, Chris S; Wonfor, Adrian; Seeds, Alwyn J; Renaud, Cyril C
2017-07-24
This paper describes the first foundry-based InP photonic integrated circuit (PIC) designed to work within a heterodyne optical phase locked loop (OPLL). The PIC and an external electronic circuit were used to phase-lock a single-line semiconductor laser diode to an incoming reference laser, with tuneable frequency offset from 4 GHz to 12 GHz. The PIC contains 33 active and passive components monolithically integrated on a single chip, fully demonstrating the capability of a generic foundry PIC fabrication model. The electronic part of the OPLL consists of commercially available RF components. This semi-packaged system stabilizes the phase and frequency of the integrated laser so that an absolute frequency, high-purity heterodyne signal can be generated when the OPLL is in operation, with phase noise lower than -100 dBc/Hz at 10 kHz offset from the carrier. This is the lowest phase noise level ever demonstrated by monolithically integrated OPLLs.
Design and implementation of a hybrid circuit system for micro sensor signal processing
International Nuclear Information System (INIS)
Wang Zhuping; Chen Jing; Liu Ruqing
2011-01-01
This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)
Integrated circuit cooled turbine blade
Lee, Ching-Pang; Jiang, Nan; Um, Jae Y.; Holloman, Harry; Koester, Steven
2017-08-29
A turbine rotor blade includes at least two integrated cooling circuits that are formed within the blade that include a leading edge circuit having a first cavity and a second cavity and a trailing edge circuit that includes at least a third cavity located aft of the second cavity. The trailing edge circuit flows aft with at least two substantially 180-degree turns at the tip end and the root end of the blade providing at least a penultimate cavity and a last cavity. The last cavity is located along a trailing edge of the blade. A tip axial cooling channel connects to the first cavity of the leading edge circuit and the penultimate cavity of the trailing edge circuit. At least one crossover hole connects the penultimate cavity to the last cavity substantially near the tip end of the blade.
Investigation of SFQ integrated circuits using Nb fabrication technology
International Nuclear Information System (INIS)
Numata, H.; Tanaka, M.; Kitagawa, Y.; Tahara, S.
1999-01-01
In NEC's standard process, the minimum junction size is 2 μm and the critical current density (J C ) is 2.5 kA cm -2 . In the process, i-line stepper lithography and reactive ion etching with SF 6 gas are used and the standard deviation (σ) of the critical current (I C ) was 0.9% for the 2 μm junctions. This junction uniformity enables integration of more than 10M junctions if an I C variation of ±10% permits correct circuit operation. A 512-bit shift register was designed and fabricated by our standard process. Correct 512-bit delay operation was obtained. These results are promising for the large-scale integration of single flux quantum circuits. (author)
Pulse Detecting Genetic Circuit – A New Design Approach
Inniss, Mara; Iba, Hitoshi; Way, Jeffrey C.
2016-01-01
A robust cellular counter could enable synthetic biologists to design complex circuits with diverse behaviors. The existing synthetic-biological counters, responsive to the beginning of the pulse, are sensitive to the pulse duration. Here we present a pulse detecting circuit that responds only at the falling edge of a pulse–analogous to negative edge triggered electric circuits. As biological events do not follow precise timing, use of such a pulse detector would enable the design of robust asynchronous counters which can count the completion of events. This transcription-based pulse detecting circuit depends on the interaction of two co-expressed lambdoid phage-derived proteins: the first is unstable and inhibits the regulatory activity of the second, stable protein. At the end of the pulse the unstable inhibitor protein disappears from the cell and the second protein triggers the recording of the event completion. Using stochastic simulation we showed that the proposed design can detect the completion of the pulse irrespective to the pulse duration. In our simulation we also showed that fusing the pulse detector with a phage lambda memory element we can construct a counter which can be extended to count larger numbers. The proposed design principle is a new control mechanism for synthetic biology which can be integrated in different circuits for identifying the completion of an event. PMID:27907045
Method of manufacturing Josephson junction integrated circuits
International Nuclear Information System (INIS)
Jillie, D.W. Jr.; Smith, L.N.
1985-01-01
Josephson junction integrated circuits of the current injection type and magnetically controlled type utilize a superconductive layer that forms both Josephson junction electrode for the Josephson junction devices on the integrated circuit as well as a ground plane for the integrated circuit. Large area Josephson junctions are utilized for effecting contact to lower superconductive layers and islands are formed in superconductive layers to provide isolation between the groudplane function and the Josephson junction electrode function as well as to effect crossovers. A superconductor-barrier-superconductor trilayer patterned by local anodization is also utilized with additional layers formed thereover. Methods of manufacturing the embodiments of the invention are disclosed
Radiation-hardened CMOS integrated circuits
International Nuclear Information System (INIS)
Pikor, A.; Reiss, E.M.
1980-01-01
Substantial effort has been directed at radiation-hardening CMOS integrated circuits using various oxide processes. While most of these integrated circuits have been successful in demonstrating megarad hardness, further investigations have shown that the 'wet-oxide process' is most compatible with the RCA CD4000 Series process. This article describes advances in the wet-oxide process that have resulted in multimegarad hardness and yield to MIL-M-38510 screening requirements. The implementation of these advances into volume manufacturing is geared towards supplying devices for aerospace requirements such as the Defense Meterological Satellite program (DMSP) and the Global Positioning Satellite (GPS). (author)
Microwaves integrated circuits: hybrids and monolithics - fabrication technology
International Nuclear Information System (INIS)
Cunha Pinto, J.K. da
1983-01-01
Several types of microwave integrated circuits are presented together with comments about technologies and fabrication processes; advantages and disadvantages in their utilization are analysed. Basic structures, propagation modes, materials used and major steps in the construction of hybrid thin film and monolithic microwave integrated circuits are described. Important technological applications are revised and main activities of the microelectronics lab. of the University of Sao Paulo (Brazil) in the field of hybrid and monolithic microwave integrated circuits are summarized. (C.L.B.) [pt
Parallel Jacobi EVD Methods on Integrated Circuits
Directory of Open Access Journals (Sweden)
Chi-Chia Sun
2014-01-01
Full Text Available Design strategies for parallel iterative algorithms are presented. In order to further study different tradeoff strategies in design criteria for integrated circuits, A 10 × 10 Jacobi Brent-Luk-EVD array with the simplified μ-CORDIC processor is used as an example. The experimental results show that using the μ-CORDIC processor is beneficial for the design criteria as it yields a smaller area, faster overall computation time, and less energy consumption than the regular CORDIC processor. It is worth to notice that the proposed parallel EVD method can be applied to real-time and low-power array signal processing algorithms performing beamforming or DOA estimation.
Design of Energy Aware Adder Circuits Considering Random Intra-Die Process Variations
Directory of Open Access Journals (Sweden)
Marco Lanuzza
2011-04-01
Full Text Available Energy consumption is one of the main barriers to current high-performance designs. Moreover, the increased variability experienced in advanced process technologies implies further timing yield concerns and therefore intensifies this obstacle. Thus, proper techniques to achieve robust designs are a critical requirement for integrated circuit success. In this paper, the influence of intra-die random process variations is analyzed considering the particular case of the design of energy aware adder circuits. Five well known adder circuits were designed exploiting an industrial 45 nm static complementary metal-oxide semiconductor (CMOS standard cell library. The designed adders were comparatively evaluated under different energy constraints. As a main result, the performed analysis demonstrates that, for a given energy budget, simpler circuits (which are conventionally identified as low-energy slow architectures operating at higher power supply voltages can achieve a timing yield significantly better than more complex faster adders when used in low-power design with supply voltages lower than nominal.
Development of pixel readout integrated circuits for extreme rate and radiation
Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC
2013-01-01
Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.
Thermal hydraulic tradeoffs in the design of IRIS primary circuit
International Nuclear Information System (INIS)
Oriani, L.; Lombardi, C.; Ricotti, M.E.; Paramonov, D.; Carelli, M.; Conway, L.
2001-01-01
IRIS (International Reactor Innovative and Secure) is currently being developed by an international consortium, led by Westinghouse and including universities. In order to achieve high level of safety, reduce complexity and capital cost, and enhance proliferation resistance, an integral primary circuit configuration has been selected. The integral configuration (the core, steam generators, coolant pumps, pressurizer and control rods are all contained within the reactor vessel) has no loop piping and thereby eliminates the possibility of large loss of coolant accidents. If the reactor vessel and components are designed for a very high level of natural circulation, which is promoted by an integral design, the consequence of loss of flow accidents can be significantly reduced or even completely eliminated. Core and integral primary circuit design optimization has been performed using the OSCAR computer code, a specialized tool for the analyses of the IRIS primary system developed at POLIMI. Results of trade-off studies of various in-vessel configurations explored to achieve tight packaging and high serviceability and/or replacement of components such as steam generators and pumps are reported. Effects of changes in secondary side parameters and steam generator design on system efficiency were explored together with the optimization of the vessel and steam generator dimensions and costs. The aim of the trade-off analyses was to limit the design space, and select a reference configuration for the IRIS reactor. (author)
Addressable-Matrix Integrated-Circuit Test Structure
Sayah, Hoshyar R.; Buehler, Martin G.
1991-01-01
Method of quality control based on use of row- and column-addressable test structure speeds collection of data on widths of resistor lines and coverage of steps in integrated circuits. By use of straightforward mathematical model, line widths and step coverages deduced from measurements of electrical resistances in each of various combinations of lines, steps, and bridges addressable in test structure. Intended for use in evaluating processes and equipment used in manufacture of application-specific integrated circuits.
Tu, Zhengyuan; Wu, Menghao; Zeng, Xiao Cheng
2017-05-04
Coexistence of ferromagnetism and ferroelectricity in a single 2D material is highly desirable for integration of multifunctional units in 2D material-based circuits. We report theoretical evidence of C 6 N 8 H organic network as being the first 2D organic multiferroic material with coexisting ferromagnetic and ferroelectric properties. The ferroelectricity stems from multimode proton-transfer within the 2D C 6 N 8 H network, in which a long-range proton-transfer mode is enabled by the facilitation of oxygen molecule when the network is exposed to the air. Such oxygen-assisted ferroelectricity also leads to a high Curie temperature and coupling between ferroelectricity and ferromagnetism. We also find that hydrogenation and carbon doping can transform the 2D g-C 3 N 4 network from an insulator to an n-type/p-type magnetic semiconductor with modest bandgap. Akin to the dopant induced n/p channels in silicon wafer, a variety of dopant created functional units can be integrated into the g-C 3 N 4 wafer by design for nanoelectronic applications.
Design of Microcantilever-Based Biosensor with Digital Feedback Control Circuit
Directory of Open Access Journals (Sweden)
Jayu P. Kalambe
2012-01-01
Full Text Available This paper present the design of cantilever-based biosensors with new readout, which hold promises as fast and cheap “point of care” device as well as interesting research tools. The fabrication process and related issues of the cantilever based bio-sensor are discussed. Coventorware simulation is carried out to analyze the device behavior. A fully integrated control circuit has been designed to solve manufacturing challenge which will take care of positioning of the cantilever instead of creating nanometer gap between the electrodes. The control circuit will solve the manufacturing challenge faced by the readout methods where it is essential to maintain precise gap between the electrodes. The circuit can take care of variation obtained due to fabrication process and maintain the precise gap between the electrodes by electrostatic actuation. The control circuit consist of analog and digital modules. The reliability issues of the sensor are also discussed.
Post irradiation effects (PIE) in integrated circuits
International Nuclear Information System (INIS)
Barnes, C.E.; Shaw, D.C.; Fleetwood, D.M.; Winokur, P.S.
1992-01-01
Post Irradiation Effects (PIE) ranging from normal recovery catastrophic failure have been observed in integrated circuits during the PIE period. These variations indicate that a rebound or PIE recipe used for radiation hardness assurance must be chosen with care. In this paper, the authors provide examples of PIE in a variety of integrated circuits of importance to spacecraft electronics
Refractory silicides for integrated circuits
International Nuclear Information System (INIS)
Murarka, S.P.
1980-01-01
Transition metal silicides have, in the past, attracted attention because of their usefulness as high temperature materials and in integrated circuits as Schottky barrier and ohmic contacts. More recently, with the increasing silicon integrated circuits (SIC) packing density, the line widths get narrower and the sheet resistance contribution to the RC delay increases. The possibility of using low resistivity silicides, which can be formed directly on the polysilicon, makes these silicides highly attractive. The usefulness of a silicide metallization scheme for integrated circuits depends, not only on the desired low resistivity, but also on the ease with which the silicide can be formed and patterned and on the stability of the silicides throughout device processing and during actual device usage. In this paper, various properties and the formation techniques of the silicides have been reviewed. Correlations between the various properties and the metal or silicide electronic or crystallographic structure have been made to predict the more useful silicides for SIC applications. Special reference to the silicide resistivity, stress, and oxidizability during the formation and subsequent processing has been given. Various formation and etching techniques are discussed
Innovative Magnetic-Field Array Probe for TRUST Integrated Circuits
2017-03-01
Despite all actions and concerns, this problem continues to escalate due to offshore fabrication of the integrated circuits ICs [1]. In order to...diagnosis and fault isolation in ICs, as well as the characterization of the functionality of ICs including malicious circuitry. Integrated circuits ...Innovative Magnetic-Field Array Probe for TRUST Integrated Circuits contains the RF-switch matrix and broad-band (BB) low noise amplifiers (LNAs
Bonin, E. L.
1969-01-01
Multi-chip integrated circuit switch consists of a GaAs photon-emitting diode in close proximity with S1 phototransistor. A high current gain is obtained when the transistor has a high forward common-emitter current gain.
Wide-band polarization controller for Si photonic integrated circuits.
Velha, P; Sorianello, V; Preite, M V; De Angelis, G; Cassese, T; Bianchi, A; Testa, F; Romagnoli, M
2016-12-15
A circuit for the management of any arbitrary polarization state of light is demonstrated on an integrated silicon (Si) photonics platform. This circuit allows us to adapt any polarization into the standard fundamental TE mode of a Si waveguide and, conversely, to control the polarization and set it to any arbitrary polarization state. In addition, the integrated thermal tuning allows kilohertz speed which can be used to perform a polarization scrambler. The circuit was used in a WDM link and successfully used to adapt four channels into a standard Si photonic integrated circuit.
Kim, Dae-Hyeong; Song, Jizhou; Choi, Won Mook; Kim, Hoon-Sik; Kim, Rak-Hwan; Liu, Zhuangjian; Huang, Yonggang Y; Hwang, Keh-Chih; Zhang, Yong-wei; Rogers, John A
2008-12-02
Electronic systems that offer elastic mechanical responses to high-strain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introduces materials and mechanical design strategies for classes of electronic circuits that offer extremely high stretchability, enabling them to accommodate even demanding configurations such as corkscrew twists with tight pitch (e.g., 90 degrees in approximately 1 cm) and linear stretching to "rubber-band" levels of strain (e.g., up to approximately 140%). The use of single crystalline silicon nanomaterials for the semiconductor provides performance in stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators, and differential amplifiers, suggest a valuable route to high-performance stretchable electronics.
Circuit design on plastic foils
Raiteri, Daniele; Roermund, Arthur H M
2015-01-01
This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics. The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing. • Discusses implications of problems associated with large-area electronics and compares them to standard silicon; • Provides the basis for understanding physics and modeling of disordered material; • Includes guidelines to quickly setup the basic CAD tools enabling efficient and reliable designs; • Illustrates practical solutions to cope with hard/soft faults, variability, mismatch, aging and bias stress at architecture, circuit, layout, and device levels.
Test and Diagnosis of Integrated Circuits
Bosio , Alberto
2015-01-01
The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users...
The FE-I4 pixel readout integrated circuit
Energy Technology Data Exchange (ETDEWEB)
Garcia-Sciveres, M., E-mail: mgarcia-sciveres@bl.gov [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Arutinov, D.; Barbero, M. [University of Bonn, Bonn (Germany); Beccherle, R. [Istituto Nazionale di Fisica Nucleare Sezione di Genova, Genova (Italy); Dube, S.; Elledge, D. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Fleury, J. [Laboratoire de l' Accelerateur Lineaire, Orsay (France); Fougeron, D.; Gensolen, F. [Centre de Physique des Particules de Marseille, Marseille (France); Gnani, D. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Gromov, V. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands); Hemperek, T.; Karagounis, M. [University of Bonn, Bonn (Germany); Kluit, R. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands); Kruth, A. [University of Bonn, Bonn (Germany); Mekkaoui, A. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Menouni, M. [Centre de Physique des Particules de Marseille, Marseille (France); Schipper, J.-D. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands)
2011-04-21
A new pixel readout integrated circuit denominated FE-I4 is being designed to meet the requirements of ATLAS experiment upgrades. It will be the largest readout IC produced to date for particle physics applications, filling the maximum allowed reticle area. This will significantly reduce the cost of future hybrid pixel detectors. In addition, FE-I4 will have smaller pixels and higher rate capability than the present generation of LHC pixel detectors. Design features are described along with simulation and test results, including low power and high rate readout architecture, mixed signal design strategy, and yield hardening.
RF and microwave integrated circuit development technology, packaging and testing
Gamand, Patrice; Kelma, Christophe
2018-01-01
RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development. In addition, the authors provide practical answers and solutions regarding the choice of technology, the packaging solutions and the effects on the performance on the circuit and to the industrial testing strategy. It will also discuss future trends and challenges and includes case studies to illustrate examples. * Offers an overview of the challenges in RF/microwave product design * Provides practical answers to packaging issues and evaluates its effect on the performance of the circuit * Includes industrial testing strategies * Examines relevant RF MIC technologies and the factors which affect the choice of technology for a particular application, e.g. technical performance and cost * Discusses future trends and challen...
Analog circuit design art, science, and personalities
Williams, Jim
1991-01-01
Analog Circuit Design: Art, Science, and Personalities discusses the many approaches and styles in the practice of analog circuit design. The book is written in an informal yet informative manner, making it easily understandable to those new in the field. The selection covers the definition, history, current practice, and future direction of analog design; the practice proper; and the styles in analog circuit design. The book also includes the problems usually encountered in analog circuit design; approach to feedback loop design; and other different techniques and applications. The text is
Circuit design for reliability
Cao, Yu; Wirth, Gilson
2015-01-01
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management. Provides comprehensive review on various reliability mechanisms at sub-45nm nodes; Describes practical modeling and characterization techniques for reliability; Includes thorough presentation of robust design techniques for major VLSI design units; Promotes physical understanding with first-principle simulations.
International Nuclear Information System (INIS)
1981-01-01
The invention describes the fabrication of integrated circuit structures, such as read-only memory components of field-effect transistors, which may be fabricated and then maintained in inventory, and later selectively modified in accordance with a desired pattern. It is claimed that MOS depletion-mode devices in accordance with the invention can be fabricated at lower cost and at higher yields. (U.K.)
Benkrid, K.; Belkacemi, S.; Sukhsawas, S.
2005-06-01
This paper proposes an integrated framework for the high level design of high performance signal processing algorithms' implementations on FPGAs. The framework emerged from a constant need to rapidly implement increasingly complicated algorithms on FPGAs while maintaining the high performance needed in many real time digital signal processing applications. This is particularly important for application developers who often rely on iterative and interactive development methodologies. The central idea behind the proposed framework is to dynamically integrate high performance structural hardware description languages with higher level hardware languages in other to help satisfy the dual requirement of high level design and high performance implementation. The paper illustrates this by integrating two environments: Celoxica's Handel-C language, and HIDE, a structural hardware environment developed at the Queen's University of Belfast. On the one hand, Handel-C has been proven to be very useful in the rapid design and prototyping of FPGA circuits, especially control intensive ones. On the other hand, HIDE, has been used extensively, and successfully, in the generation of highly optimised parameterisable FPGA cores. In this paper, this is illustrated in the construction of a scalable and fully parameterisable core for image algebra's five core neighbourhood operations, where fully floorplanned efficient FPGA configurations, in the form of EDIF netlists, are generated automatically for instances of the core. In the proposed combined framework, highly optimised data paths are invoked dynamically from within Handel-C, and are synthesized using HIDE. Although the idea might seem simple prima facie, it could have serious implications on the design of future generations of hardware description languages.
Conductus makes high-Tc integrated circuit
International Nuclear Information System (INIS)
Anon.
1991-01-01
This paper reports that researchers at Conductus have successfully demonstrated what the company says is the world's first integrated circuit containing active devices made from high-temperature superconductors. The circuit is a SQUID magnetometer made from seven layers of material: three layers of yttrium-barium-copper oxide, two layers of insulating material, a seed layer to create grain boundaries for the Josephson junctions, and a layer of silver for making electrical contact to the device. The chip also contains vias, or pathways that make a superconducting contact between the superconducting layers otherwise separated by insulators. Conductus had previously announced the development of a SQUID magnetometer that featured a SQUID sensor and a flux transformer manufactured on separate chips. What makes this achievement important is that the company was able to put both components on the same chip, thus creating a simple integrated circuit on a single chip. This is still a long way from conventional semiconductor technology, with as many as a million components per chip, or even the sophisticated low-Tc superconducting chips made by the Japanese, but the SQUID magnetometer demonstrates all the elements and techniques necessary to build more complex high-temperature superconductor integrated circuits, making this an important first step
Materials Integration and Doping of Carbon Nanotube-based Logic Circuits
Geier, Michael
symmetric threshold voltages. Additionally, a novel n-type doping procedure for SWCNT TFTs was also developed utilizing a solution-processed organometallic small molecule to demonstrate the first network top-gated n-type SWCNT TFTs. Lastly, new doping and encapsulation layers were incorporated to stabilize both p-type and n-type SWCNT TFT electronic properties, which enabled the fabrication of large-scale memory circuits. Employing these materials and processing advances has addressed many application specific barriers to commercialization. For instance, the first thin-film SWCNT complementary metal-oxide-semi-conductor (CMOS) logic devices are demonstrated with sub-nanowatt static power consumption and full rail-to-rail voltage transfer characteristics. With the introduction of a new n-type Rh-based molecular dopant, the first SWCNT TFTs are fabricated in top-gate geometries over large areas with high yield. Then by utilizing robust encapsulation methods, stable and uniform electronic performance of both p-type and n-type SWCNT TFTs has been achieved. Based on these complementary SWCNT TFTs, it is possible to simulate, design, and fabricate arrays of low-power static random access memory (SRAM) circuits, achieving large-scale integration for the first time based on solution-processed semiconductors. Together, this work provides a direct pathway for solution processable, large scale, power-efficient advanced integrated logic circuits and systems.
Microwave GaAs Integrated Circuits On Quartz Substrates
Siegel, Peter H.; Mehdi, Imran; Wilson, Barbara
1994-01-01
Integrated circuits for use in detecting electromagnetic radiation at millimeter and submillimeter wavelengths constructed by bonding GaAs-based integrated circuits onto quartz-substrate-based stripline circuits. Approach offers combined advantages of high-speed semiconductor active devices made only on epitaxially deposited GaAs substrates with low-dielectric-loss, mechanically rugged quartz substrates. Other potential applications include integration of antenna elements with active devices, using carrier substrates other than quartz to meet particular requirements using lifted-off GaAs layer in membrane configuration with quartz substrate supporting edges only, and using lift-off technique to fabricate ultrathin discrete devices diced separately and inserted into predefined larger circuits. In different device concept, quartz substrate utilized as transparent support for GaAs devices excited from back side by optical radiation.
Asaithambi, Sasikumar; Rajappa, Muthaiah
2018-05-01
In this paper, an automatic design method based on a swarm intelligence approach for CMOS analog integrated circuit (IC) design is presented. The hybrid meta-heuristics optimization technique, namely, the salp swarm algorithm (SSA), is applied to the optimal sizing of a CMOS differential amplifier and the comparator circuit. SSA is a nature-inspired optimization algorithm which mimics the navigating and hunting behavior of salp. The hybrid SSA is applied to optimize the circuit design parameters and to minimize the MOS transistor sizes. The proposed swarm intelligence approach was successfully implemented for an automatic design and optimization of CMOS analog ICs using Generic Process Design Kit (GPDK) 180 nm technology. The circuit design parameters and design specifications are validated through a simulation program for integrated circuit emphasis simulator. To investigate the efficiency of the proposed approach, comparisons have been carried out with other simulation-based circuit design methods. The performances of hybrid SSA based CMOS analog IC designs are better than the previously reported studies.
Source-circuit design overview
Ross, R. G., Jr.
1983-01-01
The source circuit is the fundamental electrical building block of a large central-station array; it consists of a series-parallel network of solar cells that develops full system voltage. The array field is generally made up of a large number of parallel source circuits. Source-circuit electrical configuration is driven by a number of design considerations, which must be considered simultaneously. Array fault tolerance and hot spot heating endurance are examined in detail.
Neklyudov, A. A.; Savenkov, V. N.; Sergeyez, A. G.
1984-06-01
Memories are improved by increasing speed or the memory volume on a single chip. The most effective means for increasing speeds in bipolar memories are current control circuits with the lowest extraction times for a specific power consumption (1/4 pJ/bit). The control current circuitry involves multistage current switches and circuits accelerating transient processes in storage elements and links. Circuit principles for the design of bipolar memories with maximum speeds for an assigned minimum of circuit topology are analyzed. Two main classes of storage with current control are considered: the ECL type and super-integrated injection type storage with data capacities of N = 1/4 and N 4/16, respectively. The circuits reduce logic voltage differentials and the volumes of lexical and discharge buses and control circuit buses. The limiting speed is determined by the antiinterference requirements of the memory in storage and extraction modes.
Reverse Engineering Integrated Circuits Using Finite State Machine Analysis
Energy Technology Data Exchange (ETDEWEB)
Oler, Kiri J. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Miller, Carl H. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
2016-04-12
In this paper, we present a methodology for reverse engineering integrated circuits, including a mathematical verification of a scalable algorithm used to generate minimal finite state machine representations of integrated circuits.
Frontiers in Planar Lightwave Circuit Technology Design, Simulation, and Fabrication
Janz, Siegfried; Tanev, Stoyan
2005-01-01
This book is the result of the NATO Advanced Research Workshop on Frontiers in Planar Lightwave Circuit Technology, which took place in Ottawa, Canada from September 21-25, 2004. Many of the world’s leading experts in integrated photonic design, theory and experiment were invited to give lectures in their fields of expertise, and participate in discussions on current research and applications, as well as the new directions planar lightwave circuit technology is evolving towards. The sum of their contributions to this book constitutes an excellent record of many key issues and scientific problems in planar lightwave circuit research at the time of writing. In this volume the reader will find detailed overviews of experimental and theoretical work in high index contrast waveguide systems, micro-optical resonators, nonlinear optics, and advanced optical simulation methods, as well as articles describing emerging applications of integrated optics for medical and biological applications.
Pulsed laser-induced SEU in integrated circuits
International Nuclear Information System (INIS)
Buchner, S.; Kang, K.; Stapor, W.J.; Campbell, A.B.; Knudson, A.R.; McDonald, P.; Rivet, S.
1990-01-01
The authors have used a pulsed picosecond laser to measure the threshold for single event upset (SEU) and single event latchup (SEL) for two different kinds of integrated circuits. The relative thresholds show good agreement with published ion upset data. The consistency of the results together with the advantages of using a laser system suggest that the pulsed laser can be used for SEU/SEL hardness assurance of integrated circuits
Energy Technology Data Exchange (ETDEWEB)
Leroux, P. [Katholieke Hogeschool Kempen, Kleinhoefstraat 4, B-2440 Geel (Belgium); Katholieke Universiteit Leuven, Dept. ESAT-MICAS, Kasteelpark Arenberg 10, B-3001 Heverlee (Belgium); SCK-CEN, Belgian Nuclear Research Centre, Boeretang 200, B-2400 Mol (Belgium); Sterckx, J. [Katholieke Hogeschool Kempen, Kleinhoefstraat 4, B-2440 Geel (Belgium); Van Uffelen, M.; Damiani, C. [Fusion 4 Energy, Ed. B3, c/Josep, no 2, Torres Diagonal Litoral, 08019 Barcelona (Spain)
2011-07-01
This paper presents the design of a radiation tolerant configurable discrete time CMOS signal conditioning circuit for use with resistive sensors like strain gauge pressure sensors. The circuit is intended to be used for remote handling in harsh environments in the International Thermonuclear Experimental fusion Reactor (ITER). The design features a 5 V differential preamplifier using a Correlated Double Sampling (CDS) architecture at a sample rate of 20 kHz and a 24 V discrete time post amplifier. The gain is digitally controllable between 27 and 400 in the preamplifier and between 1 and 8 in the post amplifier. The nominal input referred noise voltage is only 8.5 {mu}V while consuming only 1 mW. The circuit has a simulated radiation tolerance of more than 1 MGy. (authors)
International Nuclear Information System (INIS)
Sohn, S.Y.
1999-01-01
We consider a robust parameter design of the process for forming contact windows in complementary metal-oxide semiconductor circuits. Robust design is often used to find the optimal levels of process conditions which would provide the output of consistent quality as close to a target value. In this paper, we analyze the results of the fractional factorial design of nine factors: mask dimension, viscosity, bake temperature, spin speed, bake time, aperture, exposure time, developing time, etch time, where the outcome of the experiment is measured in terms of a categorized window size with five categories. Random effect analysis is employed to model both the mean and variance of categorized window size as functions of some controllable factors as well as random errors. Empirical Bayes' procedures are then utilized to fit both the models, and to eventually find the robust design of CMOS circuit process by means of a Bootstrap resampling approach
Highly Uniform Carbon Nanotube Field-Effect Transistors and Medium Scale Integrated Circuits.
Chen, Bingyan; Zhang, Panpan; Ding, Li; Han, Jie; Qiu, Song; Li, Qingwen; Zhang, Zhiyong; Peng, Lian-Mao
2016-08-10
Top-gated p-type field-effect transistors (FETs) have been fabricated in batch based on carbon nanotube (CNT) network thin films prepared from CNT solution and present high yield and highly uniform performance with small threshold voltage distribution with standard deviation of 34 mV. According to the property of FETs, various logical and arithmetical gates, shifters, and d-latch circuits were designed and demonstrated with rail-to-rail output. In particular, a 4-bit adder consisting of 140 p-type CNT FETs was demonstrated with higher packing density and lower supply voltage than other published integrated circuits based on CNT films, which indicates that CNT based integrated circuits can reach to medium scale. In addition, a 2-bit multiplier has been realized for the first time. Benefitted from the high uniformity and suitable threshold voltage of CNT FETs, all of the fabricated circuits based on CNT FETs can be driven by a single voltage as small as 2 V.
Three-dimensional multi-terminal superconductive integrated circuit inductance extraction
International Nuclear Information System (INIS)
Fourie, Coenrad J; Wetzstein, Olaf; Kunert, Jürgen; Ortlepp, Thomas
2011-01-01
Accurate inductance calculations are critical for the design of both digital and analogue superconductive integrated circuits, and three-dimensional calculations are gaining importance with the advent of inductive biasing, inductive coupling and sky plane shielding for RSFQ cells. InductEx, an extraction programme based on the three-dimensional calculation software FastHenry, was proposed earlier. InductEx uses segmentation techniques designed to accurately model the geometries of superconductive integrated circuit structures. Inductance extraction for complex multi-terminal three-dimensional structures from current distributions calculated by FastHenry is discussed. Results for both a reflection plane modelling an infinite ground plane and a finite segmented ground plane that allows inductive elements to extend over holes in the ground plane are shown. Several SQUIDs were designed for and fabricated with IPHT's 1 kA cm −2 RSFQ1D niobium process. These SQUIDs implement a number of loop structures that span different layers, include vias, inductively coupled control lines and ground plane holes. We measured the loop inductance of these SQUIDs and show how the results are used to calibrate the layer parameters in InductEx and verify the extraction accuracy. We also show that, with proper modelling, FastHenry can be fast enough to be used for the extraction of typical RSFQ cell inductances.
Simplified design of filter circuits
Lenk, John
1999-01-01
Simplified Design of Filter Circuits, the eighth book in this popular series, is a step-by-step guide to designing filters using off-the-shelf ICs. The book starts with the basic operating principles of filters and common applications, then moves on to describe how to design circuits by using and modifying chips available on the market today. Lenk's emphasis is on practical, simplified approaches to solving design problems.Contains practical designs using off-the-shelf ICsStraightforward, no-nonsense approachHighly illustrated with manufacturer's data sheets
Phased-array-based photonic integrated circuits for wavelength division multiplexing applications
Staring, A.A.M.; Smit, M.K.
1997-01-01
Wavelength division multiplexing (WDM) technology provides many options to the design of flexible all-optical networks. In order to exploit these options to their full potential, photonic integrated circuits (PICs) for wavelength routing and switching will be indispensable. One of the basic building
SiGe Integrated Circuit Developments for SQUID/TES Readout
Prêle, D.; Voisin, F.; Beillimaz, C.; Chen, S.; Piat, M.; Goldwurm, A.; Laurent, P.
2018-03-01
SiGe integrated circuits dedicated to the readout of superconducting bolometer arrays for astrophysics have been developed since more than 10 years at APC. Whether for Cosmic Microwave Background (CMB) observations with the QUBIC ground-based experiment (Aumont et al. in astro-ph.IM, 2016. arXiv:1609.04372) or for the Hot and Energetic Universe science theme with the X-IFU instrument on-board of the ATHENA space mission (Barret et al. in SPIE 9905, space telescopes & instrumentation 2016: UV to γ Ray, 2016. https://doi.org/10.1117/12.2232432), several kinds of Transition Edge Sensor (TES) (Irwin and Hilton, in ENSS (ed) Cryogenic particle detection, Springer, Berlin, 2005) arrays have been investigated. To readout such superconducting detector arrays, we use time or frequency domain multiplexers (TDM, FDM) (Prêle in JINST 10:C08015, 2016. https://doi.org/10.1088/1748-0221/10/08/C08015) with Superconducting QUantum Interference Devices (SQUID). In addition to the SQUID devices, low-noise biasing and amplification are needed. These last functions can be obtained by using BiCMOS SiGe technology in an Application Specific Integrated Circuit (ASIC). ASIC technology allows integration of highly optimised circuits specifically designed for a unique application. Moreover, we could reach very low-noise and wide band amplification using SiGe bipolar transistor either at room or cryogenic temperatures (Cressler in J Phys IV 04(C6):C6-101, 1994. https://doi.org/10.1051/jp4:1994616). This paper discusses the use of SiGe integrated circuits for SQUID/TES readout and gives an update of the last developments dedicated to the QUBIC telescope and to the X-IFU instrument. Both ASIC called SQmux128 and AwaXe are described showing the interest of such SiGe technology for SQUID multiplexer controls.
Photonic crystal ring resonator based optical filters for photonic integrated circuits
International Nuclear Information System (INIS)
Robinson, S.
2014-01-01
In this paper, a two Dimensional (2D) Photonic Crystal Ring Resonator (PCRR) based optical Filters namely Add Drop Filter, Bandpass Filter, and Bandstop Filter are designed for Photonic Integrated Circuits (PICs). The normalized output response of the filters is obtained using 2D Finite Difference Time Domain (FDTD) method and the band diagram of periodic and non-periodic structure is attained by Plane Wave Expansion (PWE) method. The size of the device is minimized from a scale of few tens of millimeters to the order of micrometers. The overall size of the filters is around 11.4 μm × 11.4 μm which is highly suitable of photonic integrated circuits
Automatic design of digital synthetic gene circuits.
Directory of Open Access Journals (Sweden)
Mario A Marchisio
2011-02-01
Full Text Available De novo computational design of synthetic gene circuits that achieve well-defined target functions is a hard task. Existing, brute-force approaches run optimization algorithms on the structure and on the kinetic parameter values of the network. However, more direct rational methods for automatic circuit design are lacking. Focusing on digital synthetic gene circuits, we developed a methodology and a corresponding tool for in silico automatic design. For a given truth table that specifies a circuit's input-output relations, our algorithm generates and ranks several possible circuit schemes without the need for any optimization. Logic behavior is reproduced by the action of regulatory factors and chemicals on the promoters and on the ribosome binding sites of biological Boolean gates. Simulations of circuits with up to four inputs show a faithful and unequivocal truth table representation, even under parametric perturbations and stochastic noise. A comparison with already implemented circuits, in addition, reveals the potential for simpler designs with the same function. Therefore, we expect the method to help both in devising new circuits and in simplifying existing solutions.
Application specific integrated circuits and hybrid micro circuits for nuclear instrumentation
International Nuclear Information System (INIS)
Chandratre, V.B.; Sukhwani, Menka; Mukhopadhyay, P.K.; Shastrakar, R.S.; Sudheer, M.; Shedam, V.; Keni, Anubha
2009-01-01
Rapid development in semiconductor technology, sensors, detectors and requirements of high energy physics experiments as well as advances in commercially available nuclear instruments have lead to challenges for instrumentation. These challenges are met with development of Application Specific Integrated Circuits and Hybrid Micro Circuits. This paper discusses various activities in ASIC and HMC development in Bhabha Atomic Research Centre. (author)
Global design of an active integrated antenna for millimeter wave
Marzolf, Eric; Drissi, M’hamed
2001-01-01
An active integrated antenna working in the millimeter wave has been realized in a monolithic process. The concept of active integrated antenna is first introduced, then the design of the integrated circuit based on a global approach, following electromagnetic and circuit simulations, is presented. The obtained performances of the active antenna are discussed and compared to a passive one.
Adaptive control of power supply for integrated circuits
2012-01-01
The present invention relates to a circuit arrangement and method for controlling power supply in an integrated circuit wherein at least one working parameter of at least one electrically isolated circuit region (10) is monitored, and the conductivity of a variable resistor means is locally
Design improvement of FPGA and CPU based digital circuit cards to solve timing issues
International Nuclear Information System (INIS)
Lee, Dongil; Lee, Jaeki; Lee, Kwang-Hyun
2016-01-01
The digital circuit cards installed at NPPs (Nuclear Power Plant) are mostly composed of a CPU (Central Processing Unit) and a PLD (Programmable Logic Device; these include a FPGA (Field Programmable Gate Array) and a CPLD (Complex Programmable Logic Device)). This type of structure is typical and is maintained using digital circuit cards. There are no big problems with this device as a structure. In particular, signal delay causes a lot of problems when various IC (Integrated Circuit) and several circuit cards are connected to the BUS of the backplane in the BUS design. This paper suggests a structure to improve the BUS signal timing problems in a circuit card consisting of CPU and FPGA. Nowadays, as the structure of circuit cards has become complex and mass data at high speed is communicated through the BUS, data integrity is the most important issue. The conventional design does not consider delay and the synchronicity of signal and this causes many problems in data processing. In order to solve these problems, it is important to isolate the BUS controller from the CPU and maintain constancy of the signal delay by using a PLD
Design improvement of FPGA and CPU based digital circuit cards to solve timing issues
Energy Technology Data Exchange (ETDEWEB)
Lee, Dongil; Lee, Jaeki; Lee, Kwang-Hyun [KHNP CRI, Daejeon (Korea, Republic of)
2016-10-15
The digital circuit cards installed at NPPs (Nuclear Power Plant) are mostly composed of a CPU (Central Processing Unit) and a PLD (Programmable Logic Device; these include a FPGA (Field Programmable Gate Array) and a CPLD (Complex Programmable Logic Device)). This type of structure is typical and is maintained using digital circuit cards. There are no big problems with this device as a structure. In particular, signal delay causes a lot of problems when various IC (Integrated Circuit) and several circuit cards are connected to the BUS of the backplane in the BUS design. This paper suggests a structure to improve the BUS signal timing problems in a circuit card consisting of CPU and FPGA. Nowadays, as the structure of circuit cards has become complex and mass data at high speed is communicated through the BUS, data integrity is the most important issue. The conventional design does not consider delay and the synchronicity of signal and this causes many problems in data processing. In order to solve these problems, it is important to isolate the BUS controller from the CPU and maintain constancy of the signal delay by using a PLD.
Minimum-Energy Sub-Threshold Self-Timed Circuits: Design Methodology and a Case Study
DEFF Research Database (Denmark)
Akgun, Omer Can; Rodrigues, Joachim; Sparsø, Jens
2010-01-01
, which integrates the current sensing circuitry. The paper outlines a corresponding design flow, which is based on contemporary synchronous EDA tools, and which transforms a synchronous design, into a corresponding self-timed circuit. The design flow and the current-sensing technique is validated...
Back End of Line Nanorelays for Ultra-low Power Monolithic Integrated NEMS-CMOS Circuits
Lechuga Aranda, Jesus Javier
2016-05-01
Since the introduction of Complementary-Metal-Oxide-Semiconductor (CMOS) technology, the chip industry has enjoyed many benefits of transistor feature size scaling, including higher speed and device density and improved energy efficiency. However, in the recent years, the IC designers have encountered a few roadblocks, namely reaching the physical limits of scaling and also increased device leakage which has resulted in a slow-down of supply voltage and power density scaling. Therefore, there has been an extensive hunt for alternative circuit architectures and switching devices that can alleviate or eliminate the current crisis in the semiconductor industry. The Nano-Electro-Mechanical (NEM) relay is a promising alternative switch that offers zero leakage and abrupt turn-on behaviour. Even though these devices are intrinsically slower than CMOS transistors, new circuit design techniques tailored for the electromechanical properties of such devices can be leveraged to design medium performance, ultra-low power integrated circuits. In this thesis, we deal with a new generation of such devices that is built in the back end of line (BEOL) CMOS process and is an ideal option for full integration with current CMOS transistor technology. Simulation and verification at the circuit and system level is a critical step in the design flow of microelectronic circuits, and this is especially important for new technologies that lack the standard design infrastructure and well-known verification platforms. Although most of the physical and electrical properties of NEM structures can be simulated using standard electronic automation software, there is no report of a reliable behavioural model for NEMS switches that enable large circuit simulations. In this work, we present an optimised model of a BEOL nano relay that encompasses all the electromechanical characteristics of the device and is robust and lightweight enough for VLSI applications that require simulation of thousands of
Energy Technology Data Exchange (ETDEWEB)
Sohn, S.Y
1999-12-01
We consider a robust parameter design of the process for forming contact windows in complementary metal-oxide semiconductor circuits. Robust design is often used to find the optimal levels of process conditions which would provide the output of consistent quality as close to a target value. In this paper, we analyze the results of the fractional factorial design of nine factors: mask dimension, viscosity, bake temperature, spin speed, bake time, aperture, exposure time, developing time, etch time, where the outcome of the experiment is measured in terms of a categorized window size with five categories. Random effect analysis is employed to model both the mean and variance of categorized window size as functions of some controllable factors as well as random errors. Empirical Bayes' procedures are then utilized to fit both the models, and to eventually find the robust design of CMOS circuit process by means of a Bootstrap resampling approach.
A fully integral, differential, high-speed, low-power consumption CMOS recovery clock circuit
Directory of Open Access Journals (Sweden)
Daniel Pacheco Bautista
2007-09-01
Full Text Available The clock recovery circuit (CRC plays a fundamental role in electronic information recovery systems (hard disks, DVD and CD read/writeable units and baseband digital communication systems in recovering the clock signal contained in the received data. This signal is necessary for synchronising subsequent information processing. Nowadays, this task is difficult to achieve because of the data’s random nature and its high transfer rate. This paper presents the design of a high-performance integral CMOS technology clock recovery circuit (CRC wor-king at 1.2 Gbps and only consuming 17.4 mW using a 3.3V power supply. The circuit was fully differentially designed to obtain high performance. Circuit architecture was based on a conventional phase lock loop (PLL, current mode logic (MCML and a novel two stage ring-based voltage controlled oscillator (VCO. The design used 0.35 μm CMOS AMS process parameters. Hspice simulation results proved the circuit’s high performance, achieving tracking in less than 300 ns.
Ka-band to L-band frequency down-conversion based on III-V-on-silicon photonic integrated circuits
Van Gasse, K.; Wang, Z.; Uvin, S.; De Deckere, B.; Mariën, J.; Thomassen, L.; Roelkens, G.
2017-12-01
In this work, we present the design, simulation and characterization of a frequency down-converter based on III-V-on-silicon photonic integrated circuit technology. We first demonstrate the concept using commercial discrete components, after which we demonstrate frequency conversion using an integrated mode-locked laser and integrated modulator. In our experiments, five channels in the Ka-band (27.5-30 GHz) with 500 MHz bandwidth are down-converted to the L-band (1.5 GHz). The breadboard demonstration shows a conversion efficiency of - 20 dB and a flat response over the 500 MHz bandwidth. The simulation of a fully integrated circuit indicates that a positive conversion gain can be obtained on a millimeter-sized photonic integrated circuit.
Nanophotonic integrated circuits from nanoresonators grown on silicon.
Chen, Roger; Ng, Kar Wei; Ko, Wai Son; Parekh, Devang; Lu, Fanglu; Tran, Thai-Truong D; Li, Kun; Chang-Hasnain, Connie
2014-07-07
Harnessing light with photonic circuits promises to catalyse powerful new technologies much like electronic circuits have in the past. Analogous to Moore's law, complexity and functionality of photonic integrated circuits depend on device size and performance scale. Semiconductor nanostructures offer an attractive approach to miniaturize photonics. However, shrinking photonics has come at great cost to performance, and assembling such devices into functional photonic circuits has remained an unfulfilled feat. Here we demonstrate an on-chip optical link constructed from InGaAs nanoresonators grown directly on a silicon substrate. Using nanoresonators, we show a complete toolkit of circuit elements including light emitters, photodetectors and a photovoltaic power supply. Devices operate with gigahertz bandwidths while consuming subpicojoule energy per bit, vastly eclipsing performance of prior nanostructure-based optoelectronics. Additionally, electrically driven stimulated emission from an as-grown nanostructure is presented for the first time. These results reveal a roadmap towards future ultradense nanophotonic integrated circuits.
Printed organic thin-film transistor-based integrated circuits
International Nuclear Information System (INIS)
Mandal, Saumen; Noh, Yong-Young
2015-01-01
Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted. (paper)
Implantable neurotechnologies: a review of integrated circuit neural amplifiers.
Ng, Kian Ann; Greenwald, Elliot; Xu, Yong Ping; Thakor, Nitish V
2016-01-01
Neural signal recording is critical in modern day neuroscience research and emerging neural prosthesis programs. Neural recording requires the use of precise, low-noise amplifier systems to acquire and condition the weak neural signals that are transduced through electrode interfaces. Neural amplifiers and amplifier-based systems are available commercially or can be designed in-house and fabricated using integrated circuit (IC) technologies, resulting in very large-scale integration or application-specific integrated circuit solutions. IC-based neural amplifiers are now used to acquire untethered/portable neural recordings, as they meet the requirements of a miniaturized form factor, light weight and low power consumption. Furthermore, such miniaturized and low-power IC neural amplifiers are now being used in emerging implantable neural prosthesis technologies. This review focuses on neural amplifier-based devices and is presented in two interrelated parts. First, neural signal recording is reviewed, and practical challenges are highlighted. Current amplifier designs with increased functionality and performance and without penalties in chip size and power are featured. Second, applications of IC-based neural amplifiers in basic science experiments (e.g., cortical studies using animal models), neural prostheses (e.g., brain/nerve machine interfaces) and treatment of neuronal diseases (e.g., DBS for treatment of epilepsy) are highlighted. The review concludes with future outlooks of this technology and important challenges with regard to neural signal amplification.
Ostrowsky, D. B.; Sriram, S.
Aspects of waveguide technology are explored, taking into account waveguide fabrication techniques in GaAs/GaAlAs, the design and fabrication of AlGaAs/GaAs phase couplers for optical integrated circuit applications, ion implanted GaAs integrated optics fabrication technology, a direct writing electron beam lithography based process for the realization of optoelectronic integrated circuits, and advances in the development of semiconductor integrated optical circuits for telecommunications. Other subjects examined are related to optical signal processing, optical switching, and questions of optical bistability and logic. Attention is given to acousto-optic techniques in integrated optics, acousto-optic Bragg diffraction in proton exchanged waveguides, optical threshold logic architectures for hybrid binary/residue processors, integrated optical modulation and switching, all-optic logic devices for waveguide optics, optoelectronic switching, high-speed photodetector switching, and a mechanical optical switch.
Flexible, Photopatterned, Colloidal CdSe Semiconductor Nanocrystal Integrated Circuits
Stinner, F. Scott
As semiconductor manufacturing pushes towards smaller and faster transistors, a parallel goal exists to create transistors which are not nearly as small. These transistors are not intended to match the performance of traditional crystalline semiconductors; they are designed to be significantly lower in cost and manufactured using methods that can make them physically flexible for applications where form is more important than speed. One of the developing technologies for this application is semiconductor nanocrystals. We first explore methods to develop CdSe nanocrystal semiconducting "inks" into large-scale, high-speed integrated circuits. We demonstrate photopatterned transistors with mobilities of 10 cm2/Vs on Kapton substrates. We develop new methods for vertical interconnect access holes to demonstrate multi-device integrated circuits including inverting amplifiers with 7 kHz bandwidths, ring oscillators with NFC) link. The device draws its power from the NFC transmitter common on smartphones and eliminates the need for a fixed battery. This allows for the mass deployment of flexible, interactive displays on product packaging.
A Framework for Robust Multivariable Optimization of Integrated Circuits in Space Applications
DuMonthier, Jeffrey; Suarez, George
2013-01-01
Application Specific Integrated Circuit (ASIC) design for space applications involves multiple challenges of maximizing performance, minimizing power and ensuring reliable operation in extreme environments. This is a complex multidimensional optimization problem which must be solved early in the development cycle of a system due to the time required for testing and qualification severely limiting opportunities to modify and iterate. Manual design techniques which generally involve simulation at one or a small number of corners with a very limited set of simultaneously variable parameters in order to make the problem tractable are inefficient and not guaranteed to achieve the best possible results within the performance envelope defined by the process and environmental requirements. What is required is a means to automate design parameter variation, allow the designer to specify operational constraints and performance goals, and to analyze the results in a way which facilitates identifying the tradeoffs defining the performance envelope over the full set of process and environmental corner cases. The system developed by the Mixed Signal ASIC Group (MSAG) at the Goddard Space Flight Center is implemented as framework of software modules, templates and function libraries. It integrates CAD tools and a mathematical computing environment, and can be customized for new circuit designs with only a modest amount of effort as most common tasks are already encapsulated. Customization is required for simulation test benches to determine performance metrics and for cost function computation. Templates provide a starting point for both while toolbox functions minimize the code required. Once a test bench has been coded to optimize a particular circuit, it is also used to verify the final design. The combination of test bench and cost function can then serve as a template for similar circuits or be re-used to migrate the design to different processes by re-running it with the
Penchovsky, Robert
2012-10-19
Here we describe molecular implementations of integrated digital circuits, including a three-input AND logic gate, a two-input multiplexer, and 1-to-2 decoder using allosteric ribozymes. Furthermore, we demonstrate a multiplexer-decoder circuit. The ribozymes are designed to seek-and-destroy specific RNAs with a certain length by a fully computerized procedure. The algorithm can accurately predict one base substitution that alters the ribozyme's logic function. The ability to sense the length of RNA molecules enables single ribozymes to be used as platforms for multiple interactions. These ribozymes can work as integrated circuits with the functionality of up to five logic gates. The ribozyme design is universal since the allosteric and substrate domains can be altered to sense different RNAs. In addition, the ribozymes can specifically cleave RNA molecules with triplet-repeat expansions observed in genetic disorders such as oculopharyngeal muscular dystrophy. Therefore, the designer ribozymes can be employed for scaling up computing and diagnostic networks in the fields of molecular computing and diagnostics and RNA synthetic biology.
Multi-channel integrated circuits for the detection and measurement of ionizing radiation
International Nuclear Information System (INIS)
Engel, G.L.; Duggireddi, N.; Vangapally, V.; Elson, J.M.; Sobotka, L.G.; Charity, R.J.
2011-01-01
The Integrated Circuits (IC) Design Research Laboratory at Southern Illinois University Edwardsville (SIUE) has collaborated with the Nuclear Reactions Group at Washington University (WU) to develop a family of multi-channel integrated circuits. To date, the collaboration has successfully produced two micro-chips. The first was an analog shaped and peak sensing chip with on-board constant-fraction discriminators and sparsified readout. This chip is known as Heavy-Ion Nuclear Physics-16 Channel (HINP16C). The second chip, christened PSD8C, was designed to logically complement (in terms of detector types) the HINP16C chip. Pulse Shape Discrimination-8 Channel (PSD8C), featuring three settable charge integration windows per channel, performs pulse shape discrimination (PSD). This paper summarizes the design, capabilities, and features of the HINP16C and PSD8C ICs. It proceeds to discuss the modifications, made to the ICs and their associated systems, which have attempted to improve ease of use, increase performance, and extend capabilities. The paper concludes with a brief discussion of what may be the next chip (employing a multi-sampling scheme) to be added to our CMOS ASIC 'tool box' for radiation detection instrumentation.
Reconfigurable SDM Switching Using Novel Silicon Photonic Integrated Circuit
DEFF Research Database (Denmark)
Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld
2016-01-01
-division multiplexing switching using silicon photonic integrated circuit, which is fabricated on a novel silicon-oninsulator platform with buried Al mirror. The silicon photonic integrated circuit is composed of a 7x7 switch and low loss grating coupler array based multicore fiber couplers. Thanks to the Al mirror......, grating couplers with ultra-low coupling loss with optical multicore fibers is achieved. The lowest total insertion loss of the silicon integrated circuit is as low as 4.5 dB, with low crosstalk lower than -30 dB. Excellent performances in terms of low insertion loss and low crosstalk are obtained...
Integrated Reconfigurable High-Voltage Transmitting Circuit for CMUTs
DEFF Research Database (Denmark)
Llimos Muntal, Pere; Larsen, Dennis Øland; Jørgensen, Ivan Harald Holger
2014-01-01
-out and measurements are performed on the integrated circuit. The transmitting circuit is reconfigurable externally making it able to drive a wide variety of CMUTs. The transmitting circuit can generate several pulse shapes, pulse voltages up to 100 V, maximum pulse range of 50 V and frequencies up to 5 MHz. The area...
Device reliability challenges for modern semiconductor circuit design – a review
Directory of Open Access Journals (Sweden)
C. Schlünder
2009-05-01
Full Text Available Product development based on highly integrated semiconductor circuits faces various challenges. To ensure the function of circuits the electrical parameters of every device must be in a specific window. This window is restricted by competing mechanisms like process variations and device degradation (Fig. 1. Degradation mechanisms like Negative Bias Temperature Instability (NBTI or Hot Carrier Injection (HCI lead to parameter drifts during operation adding on top of the process variations.
The safety margin between real lifetime of MOSFETs and product lifetime requirements decreases at advanced technologies. The assignment of tasks to ensure the product lifetime has to be changed for the future. Up to now technology development has the main responsibility to adjust the technology processes to achieve the required lifetime. In future, reliability can no longer be the task of technology development only. Device degradation becomes a collective challenge for semiconductor technologist, reliability experts and circuit designers. Reliability issues have to be considered in design as well to achieve reliable and competitive products. For this work, designers require support by smart software tools with built-in reliability know how. Design for reliability will be one of the key requirements for modern product designs.
An overview will be given of the physical device damage mechanisms, the operation conditions within circuits leading to stress and the impact of the corresponding device parameter degradation on the function of the circuit. Based on this understanding various approaches for Design for Reliability (DfR will be described. The function of aging simulators will be explained and the flow of circuit-simulation will be described. Furthermore, the difference between full custom and semi custom design and therefore, the different required approaches will be discussed.
Design and implementation of JOM-3 Overhauser magnetometer analog circuit
Zhang, Xiao; Jiang, Xue; Zhao, Jianchang; Zhang, Shuang; Guo, Xin; Zhou, Tingting
2017-09-01
Overhauser magnetometer, a kind of static-magnetic measurement system based on the Overhauser effect, has been widely used in archaeological exploration, mineral resources exploration, oil and gas basin structure detection, prediction of engineering exploration environment, earthquakes and volcanic eruotions, object magnetic measurement and underground buried booty exploration. Overhauser magnetometer plays an important role in the application of magnetic field measurement for its characteristics of small size, low power consumption and high sensitivity. This paper researches the design and the application of the analog circuit of JOM-3 Overhauser magnetometer. First, the Larmor signal output by the probe is very weak. In order to obtain the signal with high signal to noise rstio(SNR), the design of pre-amplifier circuit is the key to improve the quality of the system signal. Second, in this paper, the effectual step which could improve the frequency characters of bandpass filter amplifier circuit were put forward, and theoretical analysis was made for it. Third, the shaping circuit shapes the amplified sine signal into a square wave signal which is suitable for detecting the rising edge. Fourth, this design elaborated the optimized choice of tuning circuit, so the measurement range of the magnetic field can be covered. Last, integrated analog circuit testing system was formed to detect waveform of each module. By calculating the standard deviation, the sensitivity of the improved Overhauser magnetometer is 0.047nT for Earth's magnetic field observation. Experimental results show that the new magnetometer is sensitive to earth field measurement.
Magnetic force microscopy method and apparatus to detect and image currents in integrated circuits
Campbell, Ann. N.; Anderson, Richard E.; Cole, Jr., Edward I.
1995-01-01
A magnetic force microscopy method and improved magnetic tip for detecting and quantifying internal magnetic fields resulting from current of integrated circuits. Detection of the current is used for failure analysis, design verification, and model validation. The interaction of the current on the integrated chip with a magnetic field can be detected using a cantilevered magnetic tip. Enhanced sensitivity for both ac and dc current and voltage detection is achieved with voltage by an ac coupling or a heterodyne technique. The techniques can be used to extract information from analog circuits.
Sketoe, J. G.; Clark, Anthony
2000-01-01
This paper presents a DOD E3 program overview on integrated circuit immunity. The topics include: 1) EMI Immunity Testing; 2) Threshold Definition; 3) Bias Tee Function; 4) Bias Tee Calibration Set-Up; 5) EDM Test Figure; 6) EMI Immunity Levels; 7) NAND vs. and Gate Immunity; 8) TTL vs. LS Immunity Levels; 9) TP vs. OC Immunity Levels; 10) 7805 Volt Reg Immunity; and 11) Seventies Chip Set. This paper is presented in viewgraph form.
The analysis and design of linear circuits
Thomas, Roland E; Toussaint, Gregory J
2009-01-01
The Analysis and Design of Linear Circuits, 6e gives the reader the opportunity to not only analyze, but also design and evaluate linear circuits as early as possible. The text's abundance of problems, applications, pedagogical tools, and realistic examples helps engineers develop the skills needed to solve problems, design practical alternatives, and choose the best design from several competing solutions. Engineers searching for an accessible introduction to resistance circuits will benefit from this book that emphasizes the early development of engineering judgment.
Integrated circuit authentication hardware Trojans and counterfeit detection
Tehranipoor, Mohammad; Zhang, Xuehui
2013-01-01
This book describes techniques to verify the authenticity of integrated circuits (ICs). It focuses on hardware Trojan detection and prevention and counterfeit detection and prevention. The authors discuss a variety of detection schemes and design methodologies for improving Trojan detection techniques, as well as various attempts at developing hardware Trojans in IP cores and ICs. While describing existing Trojan detection methods, the authors also analyze their effectiveness in disclosing various types of Trojans, and demonstrate several architecture-level solutions.Â
Suspended Integrated Strip-line Transition Design for Highly Integrated Radar Systems
2017-03-01
technology. The measured results show good correlation to the simulated results with a return loss and insertion loss of less than 10 dB and greater...SSS); Suspended Integrated Strip-line (SISL) RF packaging; Ultra-wideband (UWB). Introduction The next generation of highly integrated radar...RF Circuit Design,” Second Edition, Pearson Education, 2009. 3. B. Ma, A. Chousseaud, and S. Toutain, “A new design of compact planar microstrip
How complex can integrated optical circuits become?
Smit, M.K.; Hill, M.T.; Baets, R.G.F.; Bente, E.A.J.M.; Dorren, H.J.S.; Karouta, F.; Koenraad, P.M.; Koonen, A.M.J.; Leijtens, X.J.M.; Nötzel, R.; Oei, Y.S.; Waardt, de H.; Tol, van der J.J.G.M.; Khoe, G.D.
2007-01-01
The integration scale in Photonic Integrated Circuits will be pushed to VLSI-level in the coming decade. This will bring major changes in both application and manufacturing. In this paper developments in Photonic Integration are reviewed and the limits for reduction of device demensions are
Vertically integrated, three-dimensional nanowire complementary metal-oxide-semiconductor circuits.
Nam, SungWoo; Jiang, Xiaocheng; Xiong, Qihua; Ham, Donhee; Lieber, Charles M
2009-12-15
Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arsenide (n-InAs) and p-type germanium/silicon core/shell (p-Ge/Si) nanowire (NW) field-effect transistors (FETs). The DC voltage output (V(out)) versus input (V(in)) response of vertically interconnected CMOS inverters showed sharp switching at close to the ideal value of one-half the supply voltage and, moreover, exhibited substantial DC gain of approximately 45. The gain and the rail-to-rail output switching are consistent with the large noise margin and minimal static power consumption of CMOS. Vertically interconnected, three-stage CMOS ring oscillators were also fabricated by using layer-1 InAs NW n-FETs and layer-2 Ge/Si NW p-FETs. Significantly, measurements of these circuits demonstrated stable, self-sustained oscillations with a maximum frequency of 108 MHz, which represents the highest-frequency integrated circuit based on chemically synthesized nanoscale materials. These results highlight the flexibility of bottom-up assembly of distinct nanoscale materials and suggest substantial promise for 3D integrated circuits.
Designing Novel Quaternary Quantum Reversible Subtractor Circuits
Haghparast, Majid; Monfared, Asma Taheri
2018-01-01
Reversible logic synthesis is an important area of current research because of its ability to reduce energy dissipation. In recent years, multiple valued logic has received great attention due to its ability to reduce the width of the reversible circuit which is a main requirement in quantum technology. Subtractor circuits are between major components used in quantum computers. In this paper, we will discuss the design of a quaternary quantum reversible half subtractor circuit using quaternary 1-qudit, 2-qudit Muthukrishnan-Stroud and 3-qudit controlled gates and a 2-qudit Generalized quaternary gate. Then a design of a quaternary quantum reversible full subtractor circuit based on the quaternary half subtractor will be presenting. The designs shall then be evaluated in terms of quantum cost, constant input, garbage output, and hardware complexity. The proposed quaternary quantum reversible circuits are the first attempt in the designing of the aforementioned subtractor.
Classical Conditioning with Pulsed Integrated Neural Networks: Circuits and System
DEFF Research Database (Denmark)
Lehmann, Torsten
1998-01-01
In this paper we investigate on-chip learning for pulsed, integrated neural networks. We discuss the implementational problems the technology imposes on learning systems and we find that abiologically inspired approach using simple circuit structures is most likely to bring success. We develop a ...... chip to solve simple classical conditioning tasks, thus verifying the design methodologies put forward in the paper....
Operational amplifier circuits analysis and design
Nelson, J C C
1995-01-01
This book, a revised and updated version of the author's Basic Operational Amplifiers (Butterworths 1986), enables the non-specialist to make effective use of readily available integrated circuit operational amplifiers for a range of applications, including instrumentation, signal generation and processing.It is assumed the reader has a background in the basic techniques of circuit analysis, particularly the use of j notation for reactive circuits, with a corresponding level of mathematical ability. The underlying theory is explained with sufficient but not excessive, detail. A range of compu
Integrated coincidence circuits
International Nuclear Information System (INIS)
Borejko, V.F.; Grebenyuk, V.M.; Zinov, V.G.
1976-01-01
The description is given of two coincidence units employing integral circuits in the VISHNYA standard. The units are distinguished for the coincidence selection element which is essentially a combination of a tunnel diode and microcircuits. The output fast response of the units is at least 90 MHz in the mode of the output signal unshaped in duration and 50 MHz minimum in the mode of the output signal shaping. The resolution time of the units is dependent upon the duration of input signals
Integrated optical circuits for numerical computation
Verber, C. M.; Kenan, R. P.
1983-01-01
The development of integrated optical circuits (IOC) for numerical-computation applications is reviewed, with a focus on the use of systolic architectures. The basic architecture criteria for optical processors are shown to be the same as those proposed by Kung (1982) for VLSI design, and the advantages of IOCs over bulk techniques are indicated. The operation and fabrication of electrooptic grating structures are outlined, and the application of IOCs of this type to an existing 32-bit, 32-Mbit/sec digital correlator, a proposed matrix multiplier, and a proposed pipeline processor for polynomial evaluation is discussed. The problems arising from the inherent nonlinearity of electrooptic gratings are considered. Diagrams and drawings of the application concepts are provided.
Active Trimming of Hybrid Integrated Circuits
Németh, P.; Krémer, P.
1984-01-01
One of the more important fields of the microelectronics industry is the manufacturing of hybrid integrated circuits.An important part of the manufacturing process is concerned with the trimming of the hybrid integratedl circuits. This article deals with the basic principles of active trimming and introduces a microprocessor controlled trimming machine. By comparing active trimming with passive techniques, it can be shown that the active system has some advantages. This article outlines these...
A Parallel Genetic Algorithm for Automated Electronic Circuit Design
Lohn, Jason D.; Colombano, Silvano P.; Haith, Gary L.; Stassinopoulos, Dimitris; Norvig, Peter (Technical Monitor)
2000-01-01
We describe a parallel genetic algorithm (GA) that automatically generates circuit designs using evolutionary search. A circuit-construction programming language is introduced and we show how evolution can generate practical analog circuit designs. Our system allows circuit size (number of devices), circuit topology, and device values to be evolved. We present experimental results as applied to analog filter and amplifier design tasks.
A guide to printed circuit board design
Hamilton, Charles
1984-01-01
A Guide to Printed Circuit Board Design discusses the basic design principles of printed circuit board (PCB). The book consists of nine chapters; each chapter provides both text discussion and illustration relevant to the topic being discussed. Chapter 1 talks about understanding the circuit diagram, and Chapter 2 covers how to compile component information file. Chapter 3 deals with the design layout, while Chapter 4 talks about preparing the master artworks. The book also covers generating computer aided design (CAD) master patterns, and then discusses how to prepare the production drawing a
The integrated circuit IC EMP transient state disturbance effect experiment method investigates
International Nuclear Information System (INIS)
Li Xiaowei
2004-01-01
Transient state disturbance characteristic study on the integrated circuit, IC, need from its coupling path outset. Through cable (aerial) coupling, EMP converts to an pulse current voltage and results in the impact to the integrated circuit I/O orifice passing the cable. Aiming at the armament system construction feature, EMP effect to the integrated circuit, IC inside the system is analyzed. The integrated circuit, IC EMP effect experiment current injection method is investigated and a few experiments method is given. (authors)
An integrated circuit/packet switched video conferencing system
Energy Technology Data Exchange (ETDEWEB)
Kippenhan Junior, H.A.; Lidinsky, W.P.; Roediger, G.A. [Fermi National Accelerator Lab., Batavia, IL (United States). HEP Network Resource Center; Waits, T.A. [Rutgers Univ., Piscataway, NJ (United States). Dept. of Physics and Astronomy
1996-07-01
The HEP Network Resource Center (HEPNRC) at Fermilab and the Collider Detector Facility (CDF) collaboration have evolved a flexible, cost-effective, widely accessible video conferencing system for use by high energy physics collaborations and others wishing to use video conferencing. No current systems seemed to fully meet the needs of high energy physics collaborations. However, two classes of video conferencing technology: circuit-switched and packet-switched, if integrated, might encompass most of HEPS's needs. It was also realized that, even with this integration, some additional functions were needed and some of the existing functions were not always wanted. HEPNRC with the help of members of the CDF collaboration set out to develop such an integrated system using as many existing subsystems and components as possible. This system is called VUPAC (Video conferencing Using Packets and Circuits). This paper begins with brief descriptions of the circuit-switched and packet-switched video conferencing systems. Following this, issues and limitations of these systems are considered. Next the VUPAC system is described. Integration is accomplished primarily by a circuit/packet video conferencing interface. Augmentation is centered in another subsystem called MSB (Multiport MultiSession Bridge). Finally, there is a discussion of the future work needed in the evolution of this system. (author)
An integrated circuit/packet switched video conferencing system
International Nuclear Information System (INIS)
Kippenhan Junior, H.A.; Lidinsky, W.P.; Roediger, G.A.; Waits, T.A.
1996-01-01
The HEP Network Resource Center (HEPNRC) at Fermilab and the Collider Detector Facility (CDF) collaboration have evolved a flexible, cost-effective, widely accessible video conferencing system for use by high energy physics collaborations and others wishing to use video conferencing. No current systems seemed to fully meet the needs of high energy physics collaborations. However, two classes of video conferencing technology: circuit-switched and packet-switched, if integrated, might encompass most of HEPS's needs. It was also realized that, even with this integration, some additional functions were needed and some of the existing functions were not always wanted. HEPNRC with the help of members of the CDF collaboration set out to develop such an integrated system using as many existing subsystems and components as possible. This system is called VUPAC (Video conferencing Using Packets and Circuits). This paper begins with brief descriptions of the circuit-switched and packet-switched video conferencing systems. Following this, issues and limitations of these systems are considered. Next the VUPAC system is described. Integration is accomplished primarily by a circuit/packet video conferencing interface. Augmentation is centered in another subsystem called MSB (Multiport MultiSession Bridge). Finally, there is a discussion of the future work needed in the evolution of this system. (author)
A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit
Directory of Open Access Journals (Sweden)
Zong Yao
2016-06-01
Full Text Available This paper focuses on the design and fabrication of a high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit, which consists of an encapsulated pressure-sensitive chip, a temperature compensation circuit and a signal-conditioning circuit. A silicon on insulation (SOI material and a standard MEMS process are used in the pressure-sensitive chip fabrication, and high-temperature electronic components are adopted in the temperature-compensation and signal-conditioning circuits. The entire pressure sensor achieves a hermetic seal and can be operated long-term in the range of −50 °C to 220 °C. Unlike traditional pressure sensor output voltage ranges (in the dozens to hundreds of millivolts, the output voltage of this sensor is from 0 V to 5 V, which can significantly improve the signal-to-noise ratio and measurement accuracy in practical applications of long-term transmission based on experimental verification. Furthermore, because this flexible sensor’s output voltage is adjustable, general follow-up pressure transmitter devices for voltage converters need not be used, which greatly reduces the cost of the test system. Thus, the proposed high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit is expected to be highly applicable to pressure measurements in harsh environments.
FLANDES, Flange Design for He Circuits by Taylor-Forge Method
International Nuclear Information System (INIS)
Pitchford, B.E.
1977-01-01
1 - Nature of the physical problem solved: Flange design for helium circuits. 2 - Method of solution: This is a flange design programme based on the Taylor forge method with an additional calculation of flange rotation and bolt load change during the application of internal pressure. The method relates only to the integral hub type of flange, with or without a secondary O-ring seal but will deal also with the flange and cover plate case
Microwave integrated circuit for Josephson voltage standards
Holdeman, L. B.; Toots, J.; Chang, C. C. (Inventor)
1980-01-01
A microwave integrated circuit comprised of one or more Josephson junctions and short sections of microstrip or stripline transmission line is fabricated from thin layers of superconducting metal on a dielectric substrate. The short sections of transmission are combined to form the elements of the circuit and particularly, two microwave resonators. The Josephson junctions are located between the resonators and the impedance of the Josephson junctions forms part of the circuitry that couples the two resonators. The microwave integrated circuit has an application in Josephson voltage standards. In this application, the device is asymmetrically driven at a selected frequency (approximately equal to the resonance frequency of the resonators), and a d.c. bias is applied to the junction. By observing the current voltage characteristic of the junction, a precise voltage, proportional to the frequency of the microwave drive signal, is obtained.
Circuit design techniques for non-crystalline semiconductors
Sambandan, Sanjiv
2012-01-01
Despite significant progress in materials and fabrication technologies related to non-crystalline semiconductors, fundamental drawbacks continue to limit real-world application of these devices in electronic circuits. To help readers deal with problems such as low mobility and intrinsic time variant behavior, Circuit Design Techniques for Non-Crystalline Semiconductors outlines a systematic design approach, including circuit theory, enabling users to synthesize circuits without worrying about the details of device physics. This book: Offers examples of how self-assembly can be used as a powerf
International Nuclear Information System (INIS)
Tolpygo, Sergey K; Amparo, Denis
2010-01-01
Currently, superconductor digital integrated circuits fabricated at HYPRES, Inc. can operate at clock frequencies approaching 40 GHz. The circuits present multilayered structures containing tens of thousands of Nb/Al/AlO x /Nb Josephson junctions (JJs) of various sizes interconnected by four Nb wiring layers, resistors, and other circuit elements. In order to be fully operational, the integrated circuits should be fabricated such that the critical currents of the JJs are within the tight design margins and the proper relationships between the critical currents of JJs of different sizes are preserved. We present experimental data and discuss mechanisms of process-induced variations of the critical current and energy gap of Nb/Al/AlO x /Nb JJs in integrated circuits. We demonstrate that the Josephson critical current may depend on the type and area of circuit elements connected to the junction, on the circuit pattern, and on the step in the fabrication process at which the connection is made. In particular, we discuss the influence of (a) the junction base electrode connection to the ground plane, (b) the junction counter electrode connection to the ground plane, and (c) the counter electrode connection to the Ti/Au or Ti/Pd/Au contact pads by Nb wiring. We show that the process-induced changes of the properties of Nb/Al/AlO x /Nb junctions are caused by migration of impurity atoms (hydrogen) between the different layers comprising the integrated circuits.
Microwave integrated circuits for space applications
Leonard, Regis F.; Romanofsky, Robert R.
1991-01-01
Monolithic microwave integrated circuits (MMIC), which incorporate all the elements of a microwave circuit on a single semiconductor substrate, offer the potential for drastic reductions in circuit weight and volume and increased reliability, all of which make many new concepts in electronic circuitry for space applications feasible, including phased array antennas. NASA has undertaken an extensive program aimed at development of MMICs for space applications. The first such circuits targeted for development were an extension of work in hybrid (discrete component) technology in support of the Advanced Communication Technology Satellite (ACTS). It focused on power amplifiers, receivers, and switches at ACTS frequencies. More recent work, however, focused on frequencies appropriate for other NASA programs and emphasizes advanced materials in an effort to enhance efficiency, power handling capability, and frequency of operation or noise figure to meet the requirements of space systems.
Technique for selection of transient radiation-hard junction-isolated integrated circuits
International Nuclear Information System (INIS)
Crowley, J.L.; Junga, F.A.; Stultz, T.J.
1976-01-01
A technique is presented which demonstrates the feasibility of selecting junction-isolated integrated circuits (JI/ICS) for use in transient radiation environments. The procedure guarantees that all PNPN paths within the integrated circuit are identified and describes the methods used to determine whether the paths represent latchup susceptible structures. Two examples of the latchup analysis are given involving an SSI and an LSI bipolar junction-isolated integrated circuit
Microelectronic circuit design for energy harvesting systems
Di Paolo Emilio, Maurizio
2017-01-01
This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design. Provides a single-source reference to energy harvesting and its applications; Serves as a practical guide to microelectronics design for energy harvesting, with application to mobile power supplies; Enables readers to develop energy harvesting systems for wearable/mobile electronics.
Modular integration of electronics and microfluidic systems using flexible printed circuit boards.
Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard
2010-02-21
Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.
Lubecke, Victor M.; Mcgrath, William R.; Rutledge, David B.
1991-01-01
Planar RF circuits are used in a wide range of applications from 1 GHz to 300 GHz, including radar, communications, commercial RF test instruments, and remote sensing radiometers. These circuits, however, provide only fixed tuning elements. This lack of adjustability puts severe demands on circuit design procedures and materials parameters. We have developed a novel tuning element which can be incorporated into the design of a planar circuit in order to allow active, post-fabrication tuning by varying the electrical length of a coplanar strip transmission line. It consists of a series of thin plates which can slide in unison along the transmission line, and the size and spacing of the plates are designed to provide a large reflection of RF power over a useful frequency bandwidth. Tests of this structure at 1 GHz to 3 Ghz showed that it produced a reflection coefficient greater than 0.90 over a 20 percent bandwidth. A 2 GHz circuit incorporating this tuning element was also tested to demonstrate practical tuning ranges. This structure can be fabricated for frequencies as high as 1000 GHz using existing micromachining techniques. Many commercial applications can benefit from this micromechanical RF tuning element, as it will aid in extending microwave integrated circuit technology into the high millimeter wave and submillimeter wave bands by easing constraints on circuit technology.
Wu, Chueh-Yu; Lu, Jau-Ching; Liu, Man-Chi; Tung, Yi-Chung
2012-10-21
Microfluidic technology plays an essential role in various lab on a chip devices due to its desired advantages. An automated microfluidic system integrated with actuators and sensors can further achieve better controllability. A number of microfluidic actuation schemes have been well developed. In contrast, most of the existing sensing methods still heavily rely on optical observations and external transducers, which have drawbacks including: costly instrumentation, professional operation, tedious interfacing, and difficulties of scaling up and further signal processing. This paper reports the concept of electrofluidic circuits - electrical circuits which are constructed using ionic liquid (IL)-filled fluidic channels. The developed electrofluidic circuits can be fabricated using a well-developed multi-layer soft lithography (MSL) process with polydimethylsiloxane (PDMS) microfluidic channels. Electrofluidic circuits allow seamless integration of pressure sensors with analog and digital operation functions into microfluidic systems and provide electrical readouts for further signal processing. In the experiments, the analog operation device is constructed based on electrofluidic Wheatstone bridge circuits with electrical outputs of the addition and subtraction results of the applied pressures. The digital operation (AND, OR, and XOR) devices are constructed using the electrofluidic pressure controlled switches, and output electrical signals of digital operations of the applied pressures. The experimental results demonstrate the designed functions for analog and digital operations of applied pressures are successfully achieved using the developed electrofluidic circuits, making them promising to develop integrated microfluidic systems with capabilities of precise pressure monitoring and further feedback control for advanced lab on a chip applications.
Radiation effects in semiconductors: technologies for hardened integrated circuits
International Nuclear Information System (INIS)
Charlot, J.M.
1983-09-01
Various technologies are used to manufacture integrated circuits for electronic systems. But for specific applications, including those with radiation environment, it is necessary to choose an appropriate technologie or to improve a specific one in order to reach a definite hardening level. The aim of this paper is to present the main effects induced by radiation (neutrons and gamma rays) into the basic semiconductor devices, to explain some physical degradation mechanisms and to propose solutions for hardened integrated circuit fabrication. The analysis involves essentially the monolithic structure of the integrated circuits and the isolation technology of active elements. In conclusion, the advantages of EPIC and SOS technologies are described and the potentialities of new technologies (GaAs and SOI) are presented
Radiation effects in semiconductors: technologies for hardened integrated circuits
International Nuclear Information System (INIS)
Charlot, J.M.
1984-01-01
Various technologies are used to manufacture integrated circuits for electronic systems. But for specific applications, including those with radiation environment, it is necessary to choose an appropriate technology or to improve a specific one in order to reach a definite hardening level. The aim of this paper is to present the main effects induced by radiation (neutrons and gamma rays) into the basic semiconductor devices, to explain some physical degradation mechanisms and to propose solutions for hardened integrated circuit fabrication. The analysis involves essentially the monolithic structure of the integrated circuits and the isolation technology of active elements. In conclusion, the advantages of EPIC and SOS technologies are described and the potentialities of new technologies (GaAs and SOI) are presented. (author)
Analog Integrated Circuit and System Design for a Compact, Low-Power Cochlear Implant
Ngamkham, W.
2015-01-01
Cochlear Implants (CIs) are prosthetic devices that restore hearing in profoundly deaf patients by bypassing the damaged parts of the inner ear and directly stimulating the remaining auditory nerve fibers in the cochlea with electrical pulses. This thesis describs the electronic circuit design of
Carr, Joseph
1996-01-01
The linear IC market is large and growing, as is the demand for well trained technicians and engineers who understand how these devices work and how to apply them. Linear Integrated Circuits provides in-depth coverage of the devices and their operation, but not at the expense of practical applications in which linear devices figure prominently. This book is written for a wide readership from FE and first degree students, to hobbyists and professionals.Chapter 1 offers a general introduction that will provide students with the foundations of linear IC technology. From chapter 2 onwa
Diagnosis of soft faults in analog integrated circuits based on fractional correlation
International Nuclear Information System (INIS)
Deng Yong; Shi Yibing; Zhang Wei
2012-01-01
Aiming at the problem of diagnosing soft faults in analog integrated circuits, an approach based on fractional correlation is proposed. First, the Volterra series of the circuit under test (CUT) decomposed by the fractional wavelet packet are used to calculate the fractional correlation functions. Then, the calculated fractional correlation functions are used to form the fault signatures of the CUT. By comparing the fault signatures, the different soft faulty conditions of the CUT are identified and the faults are located. Simulations of benchmark circuits illustrate the proposed method and validate its effectiveness in diagnosing soft faults in analog integrated circuits. (semiconductor integrated circuits)
Silicon CMOS optical receiver circuits with integrated thin-film compound semiconductor detectors
Brooke, Martin A.; Lee, Myunghee; Jokerst, Nan Marie; Camperi-Ginestet, C.
1995-04-01
While many circuit designers have tackled the problem of CMOS digital communications receiver design, few have considered the problem of circuitry suitable for an all CMOS digital IC fabrication process. Faced with a high speed receiver design the circuit designer will soon conclude that a high speed analog-oriented fabrication process provides superior performance advantages to a digital CMOS process. However, for applications where there are overwhelming reasons to integrate the receivers on the same IC as large amounts of conventional digital circuitry, the low yield and high cost of the exotic analog-oriented fabrication is no longer an option. The issues that result from a requirement to use a digital CMOS IC process cut across all aspects of receiver design, and result in significant differences in circuit design philosophy and topology. Digital ICs are primarily designed to yield small, fast CMOS devices for digital logic gates, thus no effort is put into providing accurate or high speed resistances, or capacitors. This lack of any reliable resistance or capacitance has a significant impact on receiver design. Since resistance optimization is not a prerogative of the digital IC process engineer, the wisest option is thus to not use these elements, opting instead for active circuitry to replace the functions normally ascribed to resistance and capacitance. Depending on the application receiver noise may be a dominant design constraint. The noise performance of CMOS amplifiers is different than bipolar or GaAs MESFET circuits, shot noise is generally insignificant when compared to channel thermal noise. As a result the optimal input stage topology is significantly different for the different technologies. It is found that, at speeds of operation approaching the limits of the digital CMOS process, open loop designs have noise-power-gain-bandwidth tradeoff performance superior to feedback designs. Furthermore, the lack of good resisters and capacitors
RD53A Integrated Circuit Specifications
Garcia-Sciveres, Mauricio
2015-01-01
Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. The wafer scale production will permit the experiments to prototype bump bonding assembly with realistic sensors in this new technology and to measure the performance of hybrid assemblies. RD53A is not intended to be a final production IC for use in an experiment, and will contain design variations for testing purposes, making the pixel matrix non-uniform.
Analog integrated circuit design automation placement, routing and parasitic extraction techniques
Martins, Ricardo; Horta, Nuno
2017-01-01
This book introduces readers to a variety of tools for analog layout design automation. After discussing the placement and routing problem in electronic design automation (EDA), the authors overview a variety of automatic layout generation tools, as well as the most recent advances in analog layout-aware circuit sizing. The discussion includes different methods for automatic placement (a template-based Placer and an optimization-based Placer), a fully-automatic Router and an empirical-based Parasitic Extractor. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the quality of their designs, or use them as starting point for a new tool. All the methods described are applied to practical examples for a 130nm design process, as well as placement and routing benchmark sets. Introduces readers to hierarchical combination of Pareto fronts of placements; Presents electromigration-aware routing with multilayer multiport terminal structures...
Microwave plasmatrons for giant integrated circuit processing
Energy Technology Data Exchange (ETDEWEB)
Petrin, A.B.
2000-02-01
A method for calculating the interaction of a powerful microwave with a plane layer of magnetoactive low-pressure plasma under conditions of electron cyclotron resonance is presented. In this paper, the plasma layer is situated between a plane dielectric layer and a plane metal screen. The calculation model contains the microwave energy balance, particle balance, and electron energy balance. The equation that expressed microwave properties of nonuniform magnetoactive plasma is found. The numerical calculations of the microwave-plasma interaction for a one-dimensional model of the problem are considered. Applications of the results for microwave plasmatrons designed for processing giant integrated circuits are suggested.
A TDC integrated circuit for drift chamber readout
International Nuclear Information System (INIS)
Passaseo, M.; Petrolo, E.; Veneziano, S.
1995-01-01
A custom integrated circuit for the measurement of the signal drift-time coming from the KLOE chamber developed by INFN Sezione di Roma is presented. The circuit is a multichannel common start/stop TDC, with 32 channels per chip. The TDC integrated circuit will be developed as a full-custom device in 0.5 μm CMOS technology, with 1 ns LSB realized using a Gray counter working at the frequency of 1 GHz. The circuit is capable of detecting rising/falling edges, with a double edge resolution of 8 ns; the hits are recorded as 16 bit words, hits older than a programmable time window are discarded, if not confirmed by a stop signal. The chip has four event-buffers, which are used only if at least one hit is present in one of the 32 channels. The readout of the data passes through the I/O port at a speed of 33 MHz; empty channels are automatically skipped during the readout phase. (orig.)
A TDC integrated circuit for drift chamber readout
Energy Technology Data Exchange (ETDEWEB)
Passaseo, M. [Istituto Nazionale di Fisica Nucleare, Rome (Italy); Petrolo, E. [Istituto Nazionale di Fisica Nucleare, Rome (Italy); Veneziano, S. [Istituto Nazionale di Fisica Nucleare, Rome (Italy)
1995-12-11
A custom integrated circuit for the measurement of the signal drift-time coming from the KLOE chamber developed by INFN Sezione di Roma is presented. The circuit is a multichannel common start/stop TDC, with 32 channels per chip. The TDC integrated circuit will be developed as a full-custom device in 0.5 {mu}m CMOS technology, with 1 ns LSB realized using a Gray counter working at the frequency of 1 GHz. The circuit is capable of detecting rising/falling edges, with a double edge resolution of 8 ns; the hits are recorded as 16 bit words, hits older than a programmable time window are discarded, if not confirmed by a stop signal. The chip has four event-buffers, which are used only if at least one hit is present in one of the 32 channels. The readout of the data passes through the I/O port at a speed of 33 MHz; empty channels are automatically skipped during the readout phase. (orig.).
Circuit arrangement of an electronic component for the design of fail-safe protective circuits
International Nuclear Information System (INIS)
Centmaier, W.; Bernhard, U.; Friederich, B.; Heisecke, I.
1974-01-01
The critical parameters of reactors are controlled by safety circuits. These circuits are controlled designed as logic modules operating by the 'n-out-of-m' selection principle. In most cases, a combination of a '1-out-of-3' circuit with a '2-out-of-3' circuit and separate indication is sufficient for a dynamic fail-safe circuit. The basic logic elements are AND and OR gate circuits, respectively, which are triggered by pulse trains and in which the failure of a pulse train is indicated as an error at the output. The module allows the design of safety circuits offering various degrees of safety. If the indication of an error is made on the modules, faulty components can be exchanged by the maintenance crew right away. (DG) [de
Latch-up in CMOS integrated circuits
International Nuclear Information System (INIS)
Estreich, D.B.; Dutton, R.W.
1978-04-01
An analysis is presented of latch-up in CMOS integrated circuits. A latch-up prediction algorithm has been developed and used to evaluate methods to control latch-up. Experimental verification of the algorithm is demonstrated
Lateral power transistors in integrated circuits
Erlbacher, Tobias
2014-01-01
This book details and compares recent advancements in the development of novel lateral power transistors (LDMOS devices) for integrated circuits in power electronic applications. It includes the state-of-the-art concept of double-acting RESURF topologies.
Oscillator circuits frontiers in design, analysis and applications
2016-01-01
This book surveys recent developments in the design, analysis and applications of oscillator circuit design. It highlights developments in the analysis of synchronization and wave phenomena, new analytical and design methods and their application, and novel engineering applications of oscillator circuits.
The design of charge measurement circuit of MWPC
International Nuclear Information System (INIS)
Guan Xiaolei; Xiang Haisheng; Sheng Huayi; Zhao Yubin; Zhao Pingping; Zhang Hongyu; Jiang Xiaoshan; Zhao Jingwei; Zhao Dongxu
2010-01-01
It introduces the design of charge measurement (MQ) circuit of MWPC, including how MQ works in the whole MWPC readout electronic system, the architecture of MQ circuit, and the logic and algorithm design of FPGA. MQ circuit can also be applied to readout systems for other detectors. The test results in different working modes are provided. (authors)
2016-09-01
into two parts. The design, development, and testing efforts of the front-end microwave photonics circuit design and the system integration with the...miniature microwave - photonic phase-sampling DF technique is investigated in this thesis. This front-end design uses a combination of integrated optical...NAVAL POSTGRADUATE SCHOOL MONTEREY, CALIFORNIA THESIS Approved for public release. Distribution is unlimited. MICROWAVE
International Nuclear Information System (INIS)
Battle, R.E.; Manges, W.W.; Emery, M.S.; Vendermolen, R.I.; Bhatt, S.
1994-01-01
This article discusses the use of application-specific integrated circuits (ASICs) in nuclear plant safety systems. ASICs have certain advantages over software-based systems because they can be simple enough to be thoroughly tested, and they can be tailored to replace existing equipment. An architecture to replace a pressurized water reactor pressure channel trip is presented. Methods of implementing digital algorithms are also discussed
An Asynchronous Circuit Design Technique for a Flexible 8-Bit Microprocessor
Karaki, Nobuo; Nanmoto, Takashi; Inoue, Satoshi
This paper presents an asynchronous design technique, an enabler for the emerging technology of flexible microelectronics that feature low-temperature processed polysilicon (LTPS) thin-film transistors (TFT) and surface-free technology by laser annealing/ablation (SUFTLA®). The first design instance chosen is an 8-bit microprocessor. LTPS TFTs are good for realizing displays having integrated VLSI circuit at lower costs. However, LTPS TFTs have drawbacks, including substantial deviations in characteristics and the self-heating phenomenon. To solve these problems, the authors adopted the asynchronous circuit design technique and developed an asynchronous design language called Verilog+, which is based on a subset of Verilog HDL® and includes minimal primitives used for describing the communications between modules, and the dedicated tools including a translator called xlator and a synthesizer called ctrlsyn. The flexible 8-bit microprocessor stably operates at 500kHz, drawing 180μA from a 5V power source. The microprocessor's electromagnetic emissions are 21dB less than those of the synchronous counterpart.
CAD-CAM printed circuit board design
Agy, W. E.
A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.
Speech recognition by means of a three-integrated-circuit set
Energy Technology Data Exchange (ETDEWEB)
Zoicas, A.
1983-11-03
The author uses pattern recognition methods for detecting word boundaries, and monitors incoming speech at 12 millisecond intervals. Frequency is divided into eight bands and analysis is achieved in an analogue interface integrated circuit, a pipeline digital processor and a control integrated circuit. Applications are suggested, including speech input to personal computers. 3 references.
Tao Tang; Wang Ling Goh; Lei Yao; Jia Hao Cheong; Yuan Gao
2017-07-01
This paper describes an integrated multichannel neural recording analog front end (AFE) with a novel area-efficient driven right leg (DRL) circuit to improve the system common mode rejection ratio (CMRR). The proposed AFE consists of an AC-coupled low-noise programmable-gain amplifier, an area-efficient DRL block and a 10-bit SAR ADC. Compared to conventional DRL circuit, the proposed capacitor-less DRL design achieves 90% chip area reduction with enhanced CMRR performance, making it ideal for multichannel biomedical recording applications. The AFE circuit has been designed in a standard 0.18-μm CMOS process. Post-layout simulation results show that the AFE provides two gain settings of 54dB/60dB while consuming 1 μA per channel under a supply voltage of 1 V. The input-referred noise of the AFE integrated from 1 Hz to 10k Hz is only 4 μVrms and the CMRR is 110 dB.
LC Quadrature Generation in Integrated Circuits
DEFF Research Database (Denmark)
Christensen, Kåre Tais
2001-01-01
Today quadrature signals for IQ demodulation are provided through RC polyphase networks, quadrature oscillators or double frequency VCOs. This paper presents a new method for generating quadrature signals in integrated circuits using only inductors and capacitors. This LC quadrature generation...
Dictionary-based image reconstruction for superresolution in integrated circuit imaging.
Cilingiroglu, T Berkin; Uyar, Aydan; Tuysuzoglu, Ahmet; Karl, W Clem; Konrad, Janusz; Goldberg, Bennett B; Ünlü, M Selim
2015-06-01
Resolution improvement through signal processing techniques for integrated circuit imaging is becoming more crucial as the rapid decrease in integrated circuit dimensions continues. Although there is a significant effort to push the limits of optical resolution for backside fault analysis through the use of solid immersion lenses, higher order laser beams, and beam apodization, signal processing techniques are required for additional improvement. In this work, we propose a sparse image reconstruction framework which couples overcomplete dictionary-based representation with a physics-based forward model to improve resolution and localization accuracy in high numerical aperture confocal microscopy systems for backside optical integrated circuit analysis. The effectiveness of the framework is demonstrated on experimental data.
Heavy ions testing experimental results on programmable integrated circuits
International Nuclear Information System (INIS)
Velazco, R.; Provost-Grellier, A.
1988-01-01
The natural radiation environment in space has been shown to produce anomalies in satellite-borne microelectronics. It becomes then mandatory to define qualification strategies allowing to choose the less vulnerable circuits. In this paper, is presented a strategy devoted to one of the most critical effects, the soft errors (so called upset). The method addresses programmable integrated circuits i.e. circuits able to execute an instruction or command set. Experimental results on representative circuits will illustrate the approach. 11 refs [fr
MIMIC For Millimeter Wave Integrated Circuit Radars
Seashore, C. R.
1987-09-01
A significant program is currently underway in the U.S. to investigate, develop and produce a variety of GaAs analog circuits for use in microwave and millimeter wave sensors and systems. This represents a "new wave" of RF technology which promises to significantly change system engineering thinking relative to RF Architectures. At millimeter wave frequencies, we look forward to a relatively high level of critical component integration based on MESFET and HEMT device implementations. These designs will spawn more compact RF front ends with colocated antenna/transceiver functions and innovative packaging concepts which will survive and function in a typical military operational environment which includes challenging temperature, shock and special handling requirements.
Interconnect rise time in superconducting integrating circuits
International Nuclear Information System (INIS)
Preis, D.; Shlager, K.
1988-01-01
The influence of resistive losses on the voltage rise time of an integrated-circuit interconnection is reported. A distribution-circuit model is used to present the interconnect. Numerous parametric curves are presented based on numerical evaluation of the exact analytical expression for the model's transient response. For the superconducting case in which the series resistance of the interconnect approaches zero, the step-response rise time is longer but signal strength increases significantly
Standard high-reliability integrated circuit logic packaging. [for deep space tracking stations
Slaughter, D. W.
1977-01-01
A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.
Silicon Photonic Integrated Circuit Mode Multiplexer
DEFF Research Database (Denmark)
Ding, Yunhong; Ou, Haiyan; Xu, Jing
2013-01-01
We propose and demonstrate a novel silicon photonic integrated circuit enabling multiplexing of orthogonal modes in a few-mode fiber (FMF). By selectively launching light to four vertical grating couplers, all six orthogonal spatial and polarization modes supported by the FMF are successfully...
Integrated optical switch circuit operating under FPGA control
Stabile, R.; Zal, M.; Williams, K.A.; Bienstman, P.; Morthier, G.; Roelkens, G.; et al., xx
2011-01-01
Integrated photonic circuits are enabling an abrupt step change in networking systems providing massive bandwidth and record transmission. The increasing complexity of high connectivity photonic integrated switches requires sophisticated control planes and more intimate high speed electronics. Here
Novel Low Loss Wide-Band Multi-Port Integrated Circuit Technology for RF/Microwave Applications
Simons, Rainee N.; Goverdhanam, Kavita; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)
2001-01-01
In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).
A new approach of optimization procedure for superconducting integrated circuits
International Nuclear Information System (INIS)
Saitoh, K.; Soutome, Y.; Tarutani, Y.; Takagi, K.
1999-01-01
We have developed and tested a new circuit simulation procedure for superconducting integrated circuits which can be used to optimize circuit parameters. This method reveals a stable operation region in the circuit parameter space in connection with the global bias margin by means of a contour plot of the global bias margin versus the circuit parameters. An optimal set of parameters with margins larger than these of the initial values has been found in the stable region. (author)
Essential knowledge for transistor-level LSI circuit design
Nakura, Toru
2016-01-01
This book is a collection of the miscellaneous knowledge essential for transistor-level LSI circuit design, summarized as the issues that need to be considered in each design step. To design an LSI that actually functions and to be able to properly measure it, an extremely large amount of diverse, detailed knowledge is necessary. Even though one may read a textbook about an op-amp, for example, the op-amp circuit design may not actually be possible to complete in one’s CAD tools. The first half of this text explains important design issues such as the operating principles of CAD tools, including schematic entry, SPICE simulation, layout and verification, and RC extraction. Then, mistake-prone topics for many circuit design beginners, resulting from their lack of consideration of these subjects, are explained including IO buffers, noise, and problems due to the progress of miniaturization. Following these topics, basic but very specialized issues for LSI circuit measurement are explained including measuremen...
RF Circuit Design in Nanometer CMOS
Nauta, Bram
2007-01-01
With CMOS technology entering the nanometer regime, the design of analog and RF circuits is complicated by low supply voltages, very non-linear (and nonquadratic) devices and large 1/f noise. At the same time, circuits are required to operate over increasingly wide bandwidths to implement modern
Controllable clock circuit design in PEM system
International Nuclear Information System (INIS)
Sun Yunhua; Wang Peihua; Hu Tingting; Feng Baotong; Shuai Lei; Huang Huan; Wei Shujun; Li Ke; Zhao Jingwei; Wei Long
2011-01-01
A high-precision synchronized clock circuit design will be presented, which can supply steady, reliable and anti-jamming clock signal for the data acquirement (DAQ) system of Positron Emission Mammography (PEM). This circuit design is based on the Single-Chip Microcomputer and high-precision clock chip, and can achieve multiple controllable clock signals. The jamming between the clock signals can be reduced greatly with the differential transmission. Meanwhile, the adoption of CAN bus control in the clock circuit can prompt the clock signals to be transmitted or masked simultaneously when needed. (authors)
Controllable clock circuit design in PEM system
International Nuclear Information System (INIS)
Sun Yunhua; Wang Peilin; Hu Tingting; Feng Baotong; Shuai Lei; Huang Huan; Wei Shujun; Li Ke; Zhao Jingwei; Wei Long
2010-01-01
A high-precision synchronized clock circuit design will be presented, which can supply steady, reliable and anti-jamming clock signal for the data acquirement (DAQ) system of Positron Emission Mammography (PEM). This circuit design is based on the Single-Chip Microcomputer and high-precision clock chip, and can achieve multiple controllable clock signals. The jamming between the clock signals can be reduced greatly with the differential transmission. Meanwhile, the adoption of CAN bus control in the clock circuit can prompt the clock signals to be transmitted or masked simultaneously when needed. (authors)
A numerical integration-based yield estimation method for integrated circuits
International Nuclear Information System (INIS)
Liang Tao; Jia Xinzhang
2011-01-01
A novel integration-based yield estimation method is developed for yield optimization of integrated circuits. This method tries to integrate the joint probability density function on the acceptability region directly. To achieve this goal, the simulated performance data of unknown distribution should be converted to follow a multivariate normal distribution by using Box-Cox transformation (BCT). In order to reduce the estimation variances of the model parameters of the density function, orthogonal array-based modified Latin hypercube sampling (OA-MLHS) is presented to generate samples in the disturbance space during simulations. The principle of variance reduction of model parameters estimation through OA-MLHS together with BCT is also discussed. Two yield estimation examples, a fourth-order OTA-C filter and a three-dimensional (3D) quadratic function are used for comparison of our method with Monte Carlo based methods including Latin hypercube sampling and importance sampling under several combinations of sample sizes and yield values. Extensive simulations show that our method is superior to other methods with respect to accuracy and efficiency under all of the given cases. Therefore, our method is more suitable for parametric yield optimization. (semiconductor integrated circuits)
A numerical integration-based yield estimation method for integrated circuits
Energy Technology Data Exchange (ETDEWEB)
Liang Tao; Jia Xinzhang, E-mail: tliang@yahoo.cn [Key Laboratory of Ministry of Education for Wide Bandgap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi' an 710071 (China)
2011-04-15
A novel integration-based yield estimation method is developed for yield optimization of integrated circuits. This method tries to integrate the joint probability density function on the acceptability region directly. To achieve this goal, the simulated performance data of unknown distribution should be converted to follow a multivariate normal distribution by using Box-Cox transformation (BCT). In order to reduce the estimation variances of the model parameters of the density function, orthogonal array-based modified Latin hypercube sampling (OA-MLHS) is presented to generate samples in the disturbance space during simulations. The principle of variance reduction of model parameters estimation through OA-MLHS together with BCT is also discussed. Two yield estimation examples, a fourth-order OTA-C filter and a three-dimensional (3D) quadratic function are used for comparison of our method with Monte Carlo based methods including Latin hypercube sampling and importance sampling under several combinations of sample sizes and yield values. Extensive simulations show that our method is superior to other methods with respect to accuracy and efficiency under all of the given cases. Therefore, our method is more suitable for parametric yield optimization. (semiconductor integrated circuits)
Integrated reconfigurable high-voltage transmitting circuit for CMUTs
DEFF Research Database (Denmark)
Llimos Muntal, Pere; Larsen, Dennis Øland; Jørgensen, Ivan Harald Holger
2015-01-01
In this paper a high-voltage transmitting circuit aimed for capacitive micromachined ultrasonic transducers (CMUTs) used in scanners for medical applications is designed and implemented in a 0.35 μm high-voltage CMOS process. The transmitting circuit is reconfigurable externally making it able...... to drive a wide variety of CMUTs. The transmitting circuit can generate several pulse shapes with voltages up to 100 V, maximum pulse range of 50 V, frequencies up to 5 MHz and different driving slew rates. Measurements are performed on the circuit in order to assess its functionality and power consumption...... performance. The design occupies an on-chip area of 0.938 mm2 and the power consumption of a 128-element transmitting circuit array that would be used in an portable ultrasound scanner is found to be a maximum of 181 mW....
2011-09-19
... Integrated Circuit Devices and Components Thereof; Notice of Institution of Investigation; Institution of... integrated circuit devices and components thereof by reason of infringement of certain claims of U.S. Patent... after importation of certain digital televisions containing integrated circuit devices and components...
Low cost design of microprocessor EDAC circuit
International Nuclear Information System (INIS)
Hao Li; Yu Lixin; Peng Heping; Zhuang Wei
2015-01-01
An optimization method of error detection and correction (EDAC) circuit design is proposed. The method involves selecting or constructing EDAC codes of low cost hardware, associated with operation scheduling implementation based on 2-input XOR gates structure, and two actions for reducing hardware cells, which can reduce the delay penalties and area costs of the EDAC circuit effectively. The 32-bit EDAC circuit hardware implementation is selected to make a prototype, based on the 180 nm process. The delay penalties and area costs of the EDAC circuit are evaluated. Results show that the time penalty and area cost of the EDAC circuitries are affected with different parity-check matrices and different hardware implementation for the EDAC codes with the same capability of correction and detection code. This method can be used as a guide for low-cost radiation-hardened microprocessor EDAC circuit design and for more advanced technologies. (paper)
Introduction of circuit design on RFID system
International Nuclear Information System (INIS)
Pak, Sunho
2007-06-01
This is a case of research of Fujitsu company and design of basic circuit of electronic technique. It is composed of two parts. The first part deals with introduction of RFID system design, which lists basic knowledge of ubiquitous, glossary of high frequency, design of impedance matching circuit, RFID system, sorts and design of filter, modulator and a transmission and RFID system design. The second part deals with research and development of Fujitsu company, including RFID middle ware RFID CONNECT of Fujitsu, sensor network of Fujitsu and high handing technique of RFID system.
Introduction of circuit design on RFID system
Energy Technology Data Exchange (ETDEWEB)
Pak, Sunho
2007-06-15
This is a case of research of Fujitsu company and design of basic circuit of electronic technique. It is composed of two parts. The first part deals with introduction of RFID system design, which lists basic knowledge of ubiquitous, glossary of high frequency, design of impedance matching circuit, RFID system, sorts and design of filter, modulator and a transmission and RFID system design. The second part deals with research and development of Fujitsu company, including RFID middle ware RFID CONNECT of Fujitsu, sensor network of Fujitsu and high handing technique of RFID system.
Superior model for fault tolerance computation in designing nano-sized circuit systems
Energy Technology Data Exchange (ETDEWEB)
Singh, N. S. S., E-mail: narinderjit@petronas.com.my; Muthuvalu, M. S., E-mail: msmuthuvalu@gmail.com [Fundamental and Applied Sciences Department, Universiti Teknologi PETRONAS, Bandar Seri Iskandar, Perak (Malaysia); Asirvadam, V. S., E-mail: vijanth-sagayan@petronas.com.my [Electrical and Electronics Engineering Department, Universiti Teknologi PETRONAS, Bandar Seri Iskandar, Perak (Malaysia)
2014-10-24
As CMOS technology scales nano-metrically, reliability turns out to be a decisive subject in the design methodology of nano-sized circuit systems. As a result, several computational approaches have been developed to compute and evaluate reliability of desired nano-electronic circuits. The process of computing reliability becomes very troublesome and time consuming as the computational complexity build ups with the desired circuit size. Therefore, being able to measure reliability instantly and superiorly is fast becoming necessary in designing modern logic integrated circuits. For this purpose, the paper firstly looks into the development of an automated reliability evaluation tool based on the generalization of Probabilistic Gate Model (PGM) and Boolean Difference-based Error Calculator (BDEC) models. The Matlab-based tool allows users to significantly speed-up the task of reliability analysis for very large number of nano-electronic circuits. Secondly, by using the developed automated tool, the paper explores into a comparative study involving reliability computation and evaluation by PGM and, BDEC models for different implementations of same functionality circuits. Based on the reliability analysis, BDEC gives exact and transparent reliability measures, but as the complexity of the same functionality circuits with respect to gate error increases, reliability measure by BDEC tends to be lower than the reliability measure by PGM. The lesser reliability measure by BDEC is well explained in this paper using distribution of different signal input patterns overtime for same functionality circuits. Simulation results conclude that the reliability measure by BDEC depends not only on faulty gates but it also depends on circuit topology, probability of input signals being one or zero and also probability of error on signal lines.
Superior model for fault tolerance computation in designing nano-sized circuit systems
International Nuclear Information System (INIS)
Singh, N. S. S.; Muthuvalu, M. S.; Asirvadam, V. S.
2014-01-01
As CMOS technology scales nano-metrically, reliability turns out to be a decisive subject in the design methodology of nano-sized circuit systems. As a result, several computational approaches have been developed to compute and evaluate reliability of desired nano-electronic circuits. The process of computing reliability becomes very troublesome and time consuming as the computational complexity build ups with the desired circuit size. Therefore, being able to measure reliability instantly and superiorly is fast becoming necessary in designing modern logic integrated circuits. For this purpose, the paper firstly looks into the development of an automated reliability evaluation tool based on the generalization of Probabilistic Gate Model (PGM) and Boolean Difference-based Error Calculator (BDEC) models. The Matlab-based tool allows users to significantly speed-up the task of reliability analysis for very large number of nano-electronic circuits. Secondly, by using the developed automated tool, the paper explores into a comparative study involving reliability computation and evaluation by PGM and, BDEC models for different implementations of same functionality circuits. Based on the reliability analysis, BDEC gives exact and transparent reliability measures, but as the complexity of the same functionality circuits with respect to gate error increases, reliability measure by BDEC tends to be lower than the reliability measure by PGM. The lesser reliability measure by BDEC is well explained in this paper using distribution of different signal input patterns overtime for same functionality circuits. Simulation results conclude that the reliability measure by BDEC depends not only on faulty gates but it also depends on circuit topology, probability of input signals being one or zero and also probability of error on signal lines
High-speed Integrated Circuits for electrical/Optical Interfaces
DEFF Research Database (Denmark)
Jespersen, Christoffer Felix
2008-01-01
This thesis is a continuation of the effort to increase the bandwidth of communicationnetworks. The thesis presents the results of the design of several high-speed electrical ircuits for an electrical/optical interface. These circuits have been a contribution to the ESTA project in collaboration...... circuits at the receiver interface, though VCOs are also found in the transmitter where a multitude of independent sources have to be mutually synchronized before multiplexing. The circuits are based on an InP DHBT process (VIP-2) supplied by Vitesse and made publicly available as MPW. The VIP-2 process...... represents the avant-garde of InP technology, with ft and fmax well above 300 GHz. Principles of high speed design are presented and described as a useful background before proceeding to circuits. A static divider is used as an example to illustrate many of the design principles. Theory and fundamentals...
Nano integrated circuit process
International Nuclear Information System (INIS)
Yoon, Yung Sup
2004-02-01
This book contains nine chapters, which are introduction of manufacture of semiconductor chip, oxidation such as Dry-oxidation, wet oxidation, oxidation model and oxide film, diffusion like diffusion process, diffusion equation, diffusion coefficient and diffusion system, ion implantation, including ion distribution, channeling, multiimplantation and masking and its system, sputtering such as CVD and PVD, lithography, wet etch and dry etch, interconnection and flattening like metal-silicon connection, silicide, multiple layer metal process and flattening, an integrated circuit process, including MOSFET and CMOS.
Nano integrated circuit process
Energy Technology Data Exchange (ETDEWEB)
Yoon, Yung Sup
2004-02-15
This book contains nine chapters, which are introduction of manufacture of semiconductor chip, oxidation such as Dry-oxidation, wet oxidation, oxidation model and oxide film, diffusion like diffusion process, diffusion equation, diffusion coefficient and diffusion system, ion implantation, including ion distribution, channeling, multiimplantation and masking and its system, sputtering such as CVD and PVD, lithography, wet etch and dry etch, interconnection and flattening like metal-silicon connection, silicide, multiple layer metal process and flattening, an integrated circuit process, including MOSFET and CMOS.
Circuit and interconnect design for high bit-rate applications
Veenstra, H.
2006-01-01
This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate
An optoelectronic integrated device including a laser and its driving circuit
Energy Technology Data Exchange (ETDEWEB)
Matsueda, H.; Nakano, H.; Tanaka, T.P.
1984-10-01
A monolithic optoelectronic integrated circuit (OEIC) including a laser diode, photomonitor and driving and detecting circuits has been fabricated on a semi-insulating GaAs substrate. The OEIC has a horizontal integrating structure which is suitable for realising high-density multifunctional devices. The fabricating process and the static and dynamic characteristics of the optical and electronic elements are described. The preliminary results of the co-operative operation of the laser and its driving circuit are also presented.
Hasan, Mehedi; Hall, Trevor
2015-11-01
A photonic integrated circuit architecture for implementing frequency upconversion is proposed. The circuit consists of a 1×2 splitter and 2×1 combiner interconnected by two stages of differentially driven phase modulators having 2×2 multimode interference coupler between the stages. A transfer matrix approach is used to model the operation of the architecture. The predictions of the model are validated by simulations performed using an industry standard software tool. The intrinsic conversion efficiency of the proposed design is improved by 6 dB over the alternative functionally equivalent circuit based on dual parallel Mach-Zehnder modulators known in the prior art. A two-tone analysis is presented to study the linearity of the proposed circuit, and a comparison is provided over the alternative. The proposed circuit is suitable for integration in any platform that offers linear electro-optic phase modulation such as LiNbO(3), silicon, III-V, or hybrid technology.
Programmable delay unit incorporating a semi-custom integrated circuit
International Nuclear Information System (INIS)
Linstadt, E.
1985-04-01
The synchronization of SLC accelerator control and monitoring functions is realized by a CAMAC module, the PDU II (Programmable Delay Unit II, SLAC 253-002), which includes a semi-custom gate array integrated circuit. The PDU II distributes 16 channels of independently programmable delayed pulses to other modules within the same CAMAC crate. The delays are programmable in increments of 8.4 ns. Functional descriptions of both the module and the semi-custom integrated circuit used to generate the output pulses are given
On stethoscope design: a challenge for biomedical circuit designers.
Hahn, A W
2001-01-01
Most clinicians learned the art and science of auscultation using an acoustic stethoscope. While many models of electronic stethoscopes have been marketed over the years, none of them seem to do a very good job of emulating the most common forms of acoustic stethoscopes available. This paper is an appeal to biomedical circuit designers to learn more about the acoustics of commonly used stethoscopes and to develop an appropriate group of circuits which would emulate them much like music synthesizers can emulate almost any musical instrument. The implications are for creative designers to move toward a rational and acceptable design for both personal physician use and for telemedicine.
Integrated Circuit Electromagnetic Immunity Handbook
Sketoe, J. G.
2000-08-01
This handbook presents the results of the Boeing Company effort for NASA under contract NAS8-98217. Immunity level data for certain integrated circuit parts are discussed herein, along with analytical techniques for applying the data to electronics systems. This handbook is built heavily on the one produced in the seventies by McDonnell Douglas Astronautics Company (MDAC, MDC Report E1929 of 1 August 1978, entitled Integrated Circuit Electromagnetic Susceptibility Handbook, known commonly as the ICES Handbook, which has served countless systems designers for over 20 years). Sections 2 and 3 supplement the device susceptibility data presented in section 4 by presenting information on related material required to use the IC susceptibility information. Section 2 concerns itself with electromagnetic susceptibility analysis and serves as a guide in using the information contained in the rest of the handbook. A suggested system hardening requirements is presented in this chapter. Section 3 briefly discusses coupling and shielding considerations. For conservatism and simplicity, a worst case approach is advocated to determine the maximum amount of RF power picked up from a given field. This handbook expands the scope of the immunity data in this Handbook is to of 10 MHz to 10 GHz. However, the analytical techniques provided are applicable to much higher frequencies as well. It is expected however, that the upper frequency limit of concern is near 10 GHz. This is due to two factors; the pickup of microwave energy on system cables and wiring falls off as the square of the wavelength, and component response falls off at a rapid rate due to the effects of parasitic shunt paths for the RF energy. It should be noted also that the pickup on wires and cables does not approach infinity as the frequency decreases (as would be expected by extrapolating the square law dependence of the high frequency roll-off to lower frequencies) but levels off due to mismatch effects.
Assessment of Durable SiC JFET Technology for +600 C to -125 C Integrated Circuit Operation
Neudeck, P. G.; Krasowski, M. J.; Prokop, N. F.
2011-01-01
Electrical characteristics and circuit design considerations for prototype 6H-SiC JFET integrated circuits (ICs) operating over the broad temperature range of -125 C to +600 C are described. Strategic implementation of circuits with transistors and resistors in the same 6H-SiC n-channel layer enabled ICs with nearly temperature-independent functionality to be achieved. The frequency performance of the circuits declined at temperatures increasingly below or above room temperature, roughly corresponding to the change in 6H-SiC n-channel resistance arising from incomplete carrier ionization at low temperature and decreased electron mobility at high temperature. In addition to very broad temperature functionality, these simple digital and analog demonstration integrated circuits successfully operated with little change in functional characteristics over the course of thousands of hours at 500 C before experiencing interconnect-related failures. With appropriate further development, these initial results establish a new technology foundation for realizing durable 500 C ICs for combustion engine sensing and control, deep-well drilling, and other harsh-environment applications.
International Nuclear Information System (INIS)
Fourie, Coenrad J; Wetzstein, Olaf; Kunert, Juergen; Meyer, Hans-Georg; Toepfer, Hannes
2013-01-01
As the complexity of rapid single flux quantum (RSFQ) circuits increases, both current and power consumption of the circuits become important design criteria. Various new concepts such as inductive biasing for energy efficient RSFQ circuits and inductively coupled RSFQ cells for current recycling have been proposed to overcome increasingly severe design problems. Both of these techniques use ground plane holes to increase the inductance or coupling factor of superconducting integrated circuit wires. New design tools are consequently required to handle the new topographies. One important issue in such circuit design is the accurate calculation of networks of inductances even in the presence of finite holes in the ground plane. We show how a fast network extraction method using InductEx, which is a pre- and post-processor for the magnetoquasistatic field solver FastHenry, is used to calculate the inductances of a set of SQUIDs (superconducting quantum interference devices) with ground plane holes of different sizes. The results are compared to measurements of physical structures fabricated with the IPHT Jena 1 kA cm −2 RSFQ niobium process to verify accuracy. We then do a parameter study and derive empirical equations for fast and useful estimation of the inductance of wires surrounded by ground plane holes. We also investigate practical circuits and show excellent accuracy. (paper)
Analog circuit design art, science and personalities
Williams, Jim
1991-01-01
This book is far more than just another tutorial or reference guide - it's a tour through the world of analog design, combining theory and applications with the philosophies behind the design process. Readers will learn how leading analog circuit designers approach problems and how they think about solutions to those problems. They'll also learn about the `analog way' - a broad, flexible method of thinking about analog design tasks.A comprehensive and useful guide to analog theory and applications. Covers visualizing the operation of analog circuits. Looks at how to rap
Integrated circuits and logic operations based on single-layer MoS2.
Radisavljevic, Branimir; Whitwick, Michael Brian; Kis, Andras
2011-12-27
Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental limits in the near future. Two-dimensional materials such as single-layer MoS(2) represent the ultimate limit of miniaturization in the vertical dimension, are interesting as building blocks of low-power nanoelectronic devices, and are suitable for integration due to their planar geometry. Because they are less than 1 nm thin, 2D materials in transistors could also lead to reduced short channel effects and result in fabrication of smaller and more power-efficient transistors. Here, we report on the first integrated circuit based on a two-dimensional semiconductor MoS(2). Our integrated circuits are capable of operating as inverters, converting logical "1" into logical "0", with room-temperature voltage gain higher than 1, making them suitable for incorporation into digital circuits. We also show that electrical circuits composed of single-layer MoS(2) transistors are capable of performing the NOR logic operation, the basis from which all logical operations and full digital functionality can be deduced.
Amos, S W
2013-01-01
Principles of Transistor Circuits: Sixth Edition discusses the principles, concepts, and practices involved integrated circuits. The current edition includes up-to-date circuits, the section on thyristors has been revised to give more information on modern types, and dated information has been eliminated. The book covers related topics such as semiconductors and junction diodes; the principles behind transistors; and common amplifiers. The book also covers bias and DC stabilization; large-signal and small-signal AF amplifiers; DC and pulse amplifiers; sinusoidal oscillators; pulse and sawtooth
Silicon integrated circuits advances in materials and device research
Kahng, Dawon
1981-01-01
Silicon Integrated Circuits, Part B covers the special considerations needed to achieve high-power Si-integrated circuits. The book presents articles about the most important operations needed for the high-power circuitry, namely impurity diffusion and oxidation; crystal defects under thermal equilibrium in silicon and the development of high-power device physics; and associated technology. The text also describes the ever-evolving processing technology and the most promising approaches, along with the understanding of processing-related areas of physics and chemistry. Physicists, chemists, an
Mentzer, Mark A.; Sriram, S.
The design and implementation of integrated optical circuits are discussed in reviews and reports. Topics addressed include lithium niobate devices, silicon integrated optics, waveguide phenomena, coupling considerations, processing technology, nonlinear guided-wave optics, integrated optics for fiber systems, and systems considerations and applications. Also included are eight papers and a panel discussion from an SPIE conference on the processing of guided-wave optoelectronic materials (held in Los Angeles, CA, on January 21-22, 1986).
Leaky Integrate-and-Fire Neuron Circuit Based on Floating-Gate Integrator
Kornijcuk, Vladimir; Lim, Hyungkwang; Seok, Jun Yeong; Kim, Guhyun; Kim, Seong Keun; Kim, Inho; Choi, Byung Joon; Jeong, Doo Seok
2016-01-01
The artificial spiking neural network (SNN) is promising and has been brought to the notice of the theoretical neuroscience and neuromorphic engineering research communities. In this light, we propose a new type of artificial spiking neuron based on leaky integrate-and-fire (LIF) behavior. A distinctive feature of the proposed FG-LIF neuron is the use of a floating-gate (FG) integrator rather than a capacitor-based one. The relaxation time of the charge on the FG relies mainly on the tunnel barrier profile, e.g., barrier height and thickness (rather than the area). This opens up the possibility of large-scale integration of neurons. The circuit simulation results offered biologically plausible spiking activity (circuit was subject to possible types of noise, e.g., thermal noise and burst noise. The simulation results indicated remarkable distributional features of interspike intervals that are fitted to Gamma distribution functions, similar to biological neurons in the neocortex. PMID:27242416
Kim, David K; Lai, Yuming; Diroll, Benjamin T; Murray, Christopher B; Kagan, Cherie R
2012-01-01
Colloidal semiconductor nanocrystals are emerging as a new class of solution-processable materials for low-cost, flexible, thin-film electronics. Although these colloidal inks have been shown to form single, thin-film field-effect transistors with impressive characteristics, the use of multiple high-performance nanocrystal field-effect transistors in large-area integrated circuits has not been shown. This is needed to understand and demonstrate the applicability of these discrete nanocrystal field-effect transistors for advanced electronic technologies. Here we report solution-deposited nanocrystal integrated circuits, showing nanocrystal integrated circuit inverters, amplifiers and ring oscillators, constructed from high-performance, low-voltage, low-hysteresis CdSe nanocrystal field-effect transistors with electron mobilities of up to 22 cm(2) V(-1) s(-1), current modulation >10(6) and subthreshold swing of 0.28 V dec(-1). We fabricated the nanocrystal field-effect transistors and nanocrystal integrated circuits from colloidal inks on flexible plastic substrates and scaled the devices to operate at low voltages. We demonstrate that colloidal nanocrystal field-effect transistors can be used as building blocks to construct complex integrated circuits, promising a viable material for low-cost, flexible, large-area electronics.
Belenguer, Angel; Cano, Juan Luis; Esteban, Héctor; Artal, Eduardo; Boria, Vicente E.
2017-01-01
Substrate integrated circuits (SIC) have attracted much attention in the last years because of their great potential of low cost, easy manufacturing, integration in a circuit board, and higher-quality factor than planar circuits. A first suite of SIC where the waves propagate through dielectric have been first developed, based on the well-known substrate integrated waveguide (SIW) and related technological implementations. One step further has been made with a new suite of empty substrate integrated waveguides, where the waves propagate through air, thus reducing the associated losses. This is the case of the empty substrate integrated waveguide (ESIW) or the air-filled substrate integrated waveguide (air-filled SIW). However, all these SIC are H plane structures, so classical H plane solutions in rectangular waveguides have already been mapped to most of these new SIC. In this paper a novel E plane empty substrate integrated waveguide (ESIW-E) is presented. This structure allows to easily map classical E plane solutions in rectangular waveguide to this new substrate integrated solution. It is similar to the ESIW, although more layers are needed to build the structure. A wideband transition (covering the frequency range between 33 GHz and 50 GHz) from microstrip to ESIW-E is designed and manufactured. Measurements are successfully compared with simulation, proving the validity of this new SIC. A broadband high-frequency phase shifter (for operation from 35 GHz to 47 GHz) is successfully implemented in ESIW-E, thus proving the good performance of this new SIC in a practical application.
International Nuclear Information System (INIS)
Marchal, Xavier
1992-01-01
In order to use CAD efficiently in the analysis and design of electronic Integrated circuits, adequate modeling of active non-linear devices such as MOSFET transistors must be available to the designer. Many mathematical forms can be given to those models, such as explicit relations, or implicit equations to be solved. A major requirement in developing MOS transistor models for IC simulation is the availability of electrical characteristic curves over a wide range of channel width and length, including the sub-micrometer range. To account in a convenient way for bulk charge influence on I_D_S = f(V_D_S, V_G_S, v_B_S) device characteristics, all 3 standard SPICE MOS models use an empirical fitting parameter called the 'charge sharing factor'. Unfortunately, this formulation produces models which only describe correctly either some of the short channel phenomena, or some particular operating conditions (low injection, avalanche effect, etc.). We present here a cellular model (CDM = Charge Distributed Model) implemented in the open modular SPICE-PAC Simulator; this model is derived from the 4-terminal WANG charge controlled MOSFET model, using the charge sheet approximation. The CDM model describes device characteristics in ail operating regions without introducing drain current discontinuities and without requiring a 'charge sharing factor'. A usual problem to be faced by designers when they simulate MOS ICs is to find a reliable source of model parameters. Though most models have a physical basis, some of their parameters cannot be easily estimated from physical considerations. It can also happen that physically determined parameters values do not produce a good fit to measured device characteristics. Thus it is generally necessary to extract model parameters from measured transistor data, to ensure that model equations approximate measured curves accurately enough. Model parameters extraction can be done in 2 different ways, exposed in this thesis. The first
Multislice imaging of integrated circuits by precession X-ray ptychography.
Shimomura, Kei; Hirose, Makoto; Takahashi, Yukio
2018-01-01
A method for nondestructively visualizing multisection nanostructures of integrated circuits by X-ray ptychography with a multislice approach is proposed. In this study, tilt-series ptychographic diffraction data sets of a two-layered circuit with a ∼1.4 µm gap at nine incident angles are collected in a wide Q range and then artifact-reduced phase images of each layer are successfully reconstructed at ∼10 nm resolution. The present method has great potential for the three-dimensional observation of flat specimens with thickness on the order of 100 µm, such as three-dimensional stacked integrated circuits based on through-silicon vias, without laborious sample preparation.
25th workshop on Advances in Analog Circuit Design
Harpe, Pieter; Makinwa, Kofi
2017-01-01
This book is based on the 18 tutorials presented during the 25th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including low-power and energy-efficient analog electronics, with specific contributions focusing on the design of continuous-time sigma-delta modulators, automotive electronics, and power management. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development.
3D circuit integration for Vertex and other detectors
Energy Technology Data Exchange (ETDEWEB)
Yarema, Ray; /Fermilab
2007-09-01
High Energy Physics continues to push the technical boundaries for electronics. There is no area where this is truer than for vertex detectors. Lower mass and power along with higher resolution and radiation tolerance are driving forces. New technologies such as SOI CMOS detectors and three dimensional (3D) integrated circuits offer new opportunities to meet these challenges. The fundamentals for SOI CMOS detectors and 3D integrated circuits are discussed. Examples of each approach for physics applications are presented. Cost issues and ways to reduce development costs are discussed.
A multi-channel integrated circuit for the readout of a microstrip gas chamber
Energy Technology Data Exchange (ETDEWEB)
Krummenacher, F.; Enz, C. (Smart Silicon Systems S.A., Lausanne (Switzerland)); Bellazzini, R. (Dipt. di Fisica, Pisa (Italy) INFN, Pisa (Italy))
1992-03-15
The design and test of an 8 channel integrated circuit for the readout of the microstrip gas chamber and other multielectrode detectors are described. The circuit is composed of 8 identical channels, each providing the amplification and the shaping of the signal delivered by the detector. The peaking time of the shaper is 25 ns and the overall amplifier gain is 8 mV/1000 e{sup -}. In addition to the analog output, each channel provides a TTL compatible digital output. The equivalent input noise is less than 700 e{sup -} rms and the total dc power consumption is about 5 mW/channel. To avoid a baseline shift due to the tail of the current issued from the detector, an adjustable pole-zero cancellation circuit has been included. (orig.).
Applications of modularized circuit designs in a new hyper-chaotic system circuit implementation
International Nuclear Information System (INIS)
Wang Rui; Sun Hui; Wang Jie-Zhi; Wang Lu; Wang Yan-Chao
2015-01-01
Modularized circuit designs for chaotic systems are introduced in this paper. Especially, a typical improved modularized design strategy is proposed and applied to a new hyper-chaotic system circuit implementation. In this paper, the detailed design procedures are described. Multisim simulations and physical experiments are conducted, and the simulation results are compared with Matlab simulation results for different system parameter pairs. These results are consistent with each other and they verify the existence of the hyper-chaotic attractor for this new hyper-chaotic system. (paper)
Design and Test of Application-Specific Integrated Circuits by use of Mobile Clients
Directory of Open Access Journals (Sweden)
Michael Auer
2009-02-01
Full Text Available The aim of this work is to develop a simultaneous multi user access system – READ (Remote ASIC Design and Test that allows users to perform test and measurements remotely via clients running on mobile devices as well as on standard PCs. The system also facilitates the remote design of circuits with the PAC-Designer The system is controlled by LabVIEW and was implemented using a Data Acquisition Card from National instruments. Such systems are specially suited for manufacturing process monitoring and control. The performance of the simultaneous access was tested under load with a variable number of users. The server implements a queue that processes user’s commands upon request.
Differential transimpedance amplifier circuit for correlated differential amplification
Gresham, Christopher A [Albuquerque, NM; Denton, M Bonner [Tucson, AZ; Sperline, Roger P [Tucson, AZ
2008-07-22
A differential transimpedance amplifier circuit for correlated differential amplification. The amplifier circuit increase electronic signal-to-noise ratios in charge detection circuits designed for the detection of very small quantities of electrical charge and/or very weak electromagnetic waves. A differential, integrating capacitive transimpedance amplifier integrated circuit comprising capacitor feedback loops performs time-correlated subtraction of noise.
Photonic integrated circuits : a new approach to laser technology
Piramidowicz, R.; Stopinski, S.T.; Lawniczuk, K.; Welikow, K.; Szczepanski, P.; Leijtens, X.J.M.; Smit, M.K.
2012-01-01
In this work a brief review on photonic integrated circuits (PICs) is presented with a specific focus on integrated lasers and amplifiers. The work presents the history of development of the integration technology in photonics and its comparison to microelectronics. The major part of the review is
New way on designing majorant coincidence circuits
International Nuclear Information System (INIS)
Gajdamaka, R.I.; Kalinnikov, V.A.; Nikityuk, N.M.; Shirikov, V.P.
1982-01-01
A new way of designing fast devices of combinatorial selection by the number of particles passing through a multichannel charged particle detector is decribed. The algorithm of their operation is based on modern algebraic coding theory. By application of analytical computational methods Boolean expressions can be obtianed for designing basic circuits for a large number of inputs. An example of computation of 15 inputs majorant coincidence circuit is considered
Thermally-induced voltage alteration for integrated circuit analysis
Energy Technology Data Exchange (ETDEWEB)
Cole, E.I. Jr.
2000-06-20
A thermally-induced voltage alteration (TIVA) apparatus and method are disclosed for analyzing an integrated circuit (IC) either from a device side of the IC or through the IC substrate to locate any open-circuit or short-circuit defects therein. The TIVA apparatus uses constant-current biasing of the IC while scanning a focused laser beam over electrical conductors (i.e. a patterned metallization) in the IC to produce localized heating of the conductors. This localized heating produces a thermoelectric potential due to the Seebeck effect in any conductors with open-circuit defects and a resistance change in any conductors with short-circuit defects, both of which alter the power demand by the IC and thereby change the voltage of a source or power supply providing the constant-current biasing. By measuring the change in the supply voltage and the position of the focused and scanned laser beam over time, any open-circuit or short-circuit defects in the IC can be located and imaged. The TIVA apparatus can be formed in part from a scanning optical microscope, and has applications for qualification testing or failure analysis of ICs.
A Reconfigurable Readout Integrated Circuit for Heterogeneous Display-Based Multi-Sensor Systems
Directory of Open Access Journals (Sweden)
Kyeonghwan Park
2017-04-01
Full Text Available This paper presents a reconfigurable multi-sensor interface and its readout integrated circuit (ROIC for display-based multi-sensor systems, which builds up multi-sensor functions by utilizing touch screen panels. In addition to inherent touch detection, physiological and environmental sensor interfaces are incorporated. The reconfigurable feature is effectively implemented by proposing two basis readout topologies of amplifier-based and oscillator-based circuits. For noise-immune design against various noises from inherent human-touch operations, an alternate-sampling error-correction scheme is proposed and integrated inside the ROIC, achieving a 12-bit resolution of successive approximation register (SAR of analog-to-digital conversion without additional calibrations. A ROIC prototype that includes the whole proposed functions and data converters was fabricated in a 0.18 μm complementary metal oxide semiconductor (CMOS process, and its feasibility was experimentally verified to support multiple heterogeneous sensing functions of touch, electrocardiogram, body impedance, and environmental sensors.
Designing Asynchronous Circuits for Low Power: An IFIR Filter
DEFF Research Database (Denmark)
Nielsen, Lars Skovby; Sparsø, Jens
1999-01-01
This paper addresses the design of asynchronous circuits for low power through an example: a filter bank for a digital hearing aid. The asynchronous design re-implements an existing synchronous circuit which is used in a commercial product. For comparison, both designs have been fabricated...
Single-event effects in analog and mixed-signal integrated circuits
International Nuclear Information System (INIS)
Turflinger, T.L.
1996-01-01
Analog and mixed-signal integrated circuits are also susceptible to single-event effects, but they have rarely been tested. Analog circuit single-particle transients require modified test techniques and data analysis. Existing work is reviewed and future concerns are outlined
Insulated transcriptional elements enable precise design of genetic circuits.
Zong, Yeqing; Zhang, Haoqian M; Lyu, Cheng; Ji, Xiangyu; Hou, Junran; Guo, Xian; Ouyang, Qi; Lou, Chunbo
2017-07-03
Rational engineering of biological systems is often complicated by the complex but unwanted interactions between cellular components at multiple levels. Here we address this issue at the level of prokaryotic transcription by insulating minimal promoters and operators to prevent their interaction and enable the biophysical modeling of synthetic transcription without free parameters. This approach allows genetic circuit design with extraordinary precision and diversity, and consequently simplifies the design-build-test-learn cycle of circuit engineering to a mix-and-match workflow. As a demonstration, combinatorial promoters encoding NOT-gate functions were designed from scratch with mean errors of 96% using our insulated transcription elements. Furthermore, four-node transcriptional networks with incoherent feed-forward loops that execute stripe-forming functions were obtained without any trial-and-error work. This insulation-based engineering strategy improves the resolution of genetic circuit technology and provides a simple approach for designing genetic circuits for systems and synthetic biology.Unwanted interactions between cellular components can complicate rational engineering of biological systems. Here the authors design insulated minimal promoters and operators that enable biophysical modeling of bacterial transcription without free parameters for precise circuit design.
Energy Technology Data Exchange (ETDEWEB)
Nakamori, A.; Suzuki, T.; Mizoe, K. [Fuji Electric Corporate Research and Development,Ltd., Kanagawa (Japan)
2000-08-10
With the recent rapid spread of portable electronic appliances, specification requirements such as compact power supply and long operation with batteries have become severer. Power supply ICs (integrated circuits) are required to reduce power consumption in the circuit and perform high-precision control. To meet these requirements, Fuji Electric develops high-precision CMOS (complementary metal-oxide semiconductor) analog technology. This paper describes three analog circuit technologies of a voltage reference, an operational amplifier and a comparator as circuit components particularly important for the precision of power supply ICs. (author)
Cao, Zizheng; Zhang, Xuebing; Zhao, Xinran; Shen, Longfei; Deng, Xiong; Yin, Xin; Koonen, Ton
2017-01-01
In this talk, we review our recent progress and on-going research on millimeter wave beam steered fiber wireless systems for 5G indoor coverage enabled by the advanced photonic integrated circuit and well-designed fiber-wireless networks.
Hybrid integrated circuit for charge-to-time interval conversion
Energy Technology Data Exchange (ETDEWEB)
Basiladze, S.G.; Dotsenko, Yu.Yu.; Man' yakov, P.K.; Fedorchenko, S.N. (Joint Inst. for Nuclear Research, Dubna (USSR))
The hybrid integrated circuit for charge-to time interval conversion with nanosecond input fast response is described. The circuit can be used in energy measuring channels, time-to-digital converters and in the modified variant in amplitude-to-digital converters. The converter described consists of a buffer amplifier, a linear transmission circuit, a direct current source and a unit of time interval separation. The buffer amplifier represents a current follower providing low input and high output resistances by the current feedback. It is concluded that the described converter excelled the QT100B circuit analogous to it in a number of parameters especially, in thermostability.
Programming languages for circuit design.
Pedersen, Michael; Yordanov, Boyan
2015-01-01
This chapter provides an overview of a programming language for Genetic Engineering of Cells (GEC). A GEC program specifies a genetic circuit at a high level of abstraction through constraints on otherwise unspecified DNA parts. The GEC compiler then selects parts which satisfy the constraints from a given parts database. GEC further provides more conventional programming language constructs for abstraction, e.g., through modularity. The GEC language and compiler is available through a Web tool which also provides functionality, e.g., for simulation of designed circuits.
Circuit design for RF transceivers
Leenaerts, Domine; Vaucher, Cicero S
2007-01-01
Second edition of this successful 2001 RF Circuit Design book, has been updated, latest technology reviews have been added as well as several actual case studies. Due to the authors being active in industry as well as academia, this should prove to be an essential guide on RF Transceiver Design for students and engineers.
A CMOS integrated timing discriminator circuit for fast scintillation counters
International Nuclear Information System (INIS)
Jochmann, M.W.
1998-01-01
Based on a zero-crossing discriminator using a CR differentiation network for pulse shaping, a new CMOS integrated timing discriminator circuit is proposed for fast (t r ≥ 2 ns) scintillation counters at the cooler synchrotron COSY-Juelich. By eliminating the input signal's amplitude information by means of an analog continuous-time divider, a normalized pulse shape at the zero-crossing point is gained over a wide dynamic input amplitude range. In combination with an arming comparator and a monostable multivibrator this yields in a highly precise timing discriminator circuit, that is expected to be useful in different time measurement applications. First measurement results of a CMOS integrated logarithmic amplifier, which is part of the analog continuous-time divider, agree well with the corresponding simulations. Moreover, SPICE simulations of the integrated discriminator circuit promise a time walk well below 200 ps (FWHM) over a 40 dB input amplitude dynamic range
International Nuclear Information System (INIS)
Sykora, D.
1986-01-01
An open heat pump circuit is claimed connected to the primary circuit. The pump circuit consists of a steam pressurizer with a built-in steam distributor, a compressor, an expander, a reducing valve, an auxiliary pump, and of water and steam pipes. The operation is described and a block diagram is shown of integrated equipment for increasing and maintaining pressure in the nuclear power plant primary circuit. The appropriate entropy diagram is also shown. The advantage of the open pump circuit consists in reducing the electric power input and electric power consumption for the steam pressurizers, removing entropy loss in heat transfer with high temperature gradient, in the possibility of inserting, between the expander and the auxiliary pump, a primary circuit coolant treatment station, in simplified design and manufacture of the high-pressure steam pressurizer vessel, reducing the weight of the steam pressurizer by changing its shape from cylindrical to spherical, increasing the rate of pressure growth in the primary circuit. (E.S.)
Integrated circuits with emitter coupling and their application in nanosecond nuclear electronics
International Nuclear Information System (INIS)
Basiladze, S.G.
1976-01-01
Principal static and dynamic characteristics are considered of integrated circuits with emitter coupling, as well as problems of signal transmission. Diagrams are given of amplifiers, discriminators, time interval drivers, generators, etc. Systems and units of nanosecond electronics employing integrated circuits with emitter coupling are briefly described
Silicon carbide MOSFET integrated circuit technology
Energy Technology Data Exchange (ETDEWEB)
Brown, D.M.; Downey, E.; Ghezzo, M.; Kretchmer, J.; Krishnamurthy, V.; Hennessy, W.; Michon, G. [General Electric Co., Schenectady, NY (United States). Corporate Research and Development Center
1997-07-16
The research and development activities carried out to demonstrate the status of MOS planar technology for the manufacture of high temperature SiC ICs will be described. These activities resulted in the design, fabrication and demonstration of the World`s first SiC analog IC - a monolithic MOSFET operational amplifier. Research tasks required for the development of a planar SiC MOSFET IC technology included characterization of the SiC/SiO{sub 2} interface using thermally grown oxides: high temperature (350 C) reliability studies of thermally grown oxides: ion implantation studies of donor (N) and acceptor (B) dopants to form junction diodes: epitaxial layer characterization: N channel inversion and depletion mode MOSFETs; device isolation methods and finally integrated circuit design, fabrication and testing of the World`s first monolithic SiC operational amplifier IC. These studies defined a SiC n-channel depletion mode MOSFET IC technology and outlined tasks required to improve all types of SiC devices. For instance, high temperature circuit drift instabilities at 350 C were discovered and characterized. This type of instability needs to be understood and resolved because it affects the high temperature reliability of other types of SiC devices. Improvements in SiC wafer surface quality and the use of deposited oxides instead of thermally grown SiO{sub 2} gate dielectrics will probably be required for enhanced reliability. The slow reverse recovery time exhibited by n{sup +}-p diodes formed by N ion implantation is a problem that needs to be resolved for all types of planar bipolar devices. The reproducibility of acceptor implants needs to be improved before CMOS ICs and many types of power device structures will be manufacturable. (orig.) 51 refs.
Implementation of integrated circuit and design of SAR ADC for fully implantable hearing aids.
Kim, Jong Hoon; Lee, Jyung Hyun; Cho, Jin-Ho
2017-07-20
The hearing impaired population has been increasing; many people suffer from hearing problems. To deal with this difficulty, various types of hearing aids are being rapidly developed. In particular, fully implantable hearing aids are being actively studied to improve the performance of existing hearing aids and to reduce the stigma of hearing loss patients. It has to be of small size and low-power consumption for easy implantation and long-term use. The objective of the study was to implement a small size and low-power consumption successive approximation register analog-to-digital converter (SAR ADC) for fully implantable hearing aids. The ADC was selected as the SAR ADC because its analog circuit components are less required by the feedback circuit of the SAR ADC than the sigma-delta ADC which is conventionally used in hearing aids, and it has advantages in the area and power consumption. So, the circuit of SAR ADC is designed considering the speech region of humans because the objective is to deliver the speech signals of humans to hearing loss patients. If the switch of sample and hold works in the on/off positions, the charge injection and clock feedthrough are produced by a parasitic capacitor. These problems affect the linearity of the hold voltage, and as a result, an error of the bit conversion is generated. In order to solve the problem, a CMOS switch that consists of NMOS and PMOS was used, and it reduces the charge injection because the charge carriers in the NMOS and PMOS have inversed polarity. So, 16 bit conversion is performed before the occurrence of the Least Significant Bit (LSB) error. In order to minimize the offset voltage and power consumption of the designed comparator, we designed a preamplifier with current mirror. Therefore, the power consumption was reduced by the power control switch used in the comparator. The layout of the designed SAR ADC was performed by Virtuoso Layout Editor (Cadence, USA). In the layout result, the size of the
Integrated-circuit microwave detector based on granular high-Tc thin films. [Y-Ba-Cu-O
Energy Technology Data Exchange (ETDEWEB)
Drobinin, A.V.; Lutovinov, V.S.; Starostenko, I.V. (Moscow Inst. of Radioengineering, Electronics and Automation, (MIREA), Moscow (USSR))
1991-12-01
A highly sensitive integrative-circuit microwave detector based on granular High-Tc film has been designed. All matching circuits and High-Tc microbridge are located on the same substrate. The voltage responsivity 10{sup 3} V/W has been found at 65 K and frequency 5 GHz. Different modes of microwave detection have been observed: bolometric response near Tc in high-quality films, rectification mode caused by an array of weak links dominating in low-quality films, detection caused by nonlinear magnetic flux motion. (orig.).
Lithographic technology for microwave integrated circuits
Shepherd, PR; Evans, PSA; Ramsey, BJ; Harrison, DJ
1997-01-01
Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs.
Performance of digital integrated circuit technologies at very high temperatures
Energy Technology Data Exchange (ETDEWEB)
Prince, J.L.; Draper, B.L.; Rapp, E.A.; Kromberg, J.N.; Fitch, L.T.
1980-01-01
Results of investigations of the performance and reliability of digital bipolar and CMOS integrated circuits over the 25 to 340/sup 0/C range are reported. Included in these results are both parametric variation information and analysis of the functional failure mechanisms. Although most of the work was done using commercially available circuits (TTL and CMOS) and test chips from commercially compatible processes, some results of experimental simulations of dielectrically isolated CMOS are also discussed. It was found that commercial Schottky clamped TTL, and dielectrically isolated, low power Schottky-clamped TTL, functioned to junction temperatures in excess of 325/sup 0/C. Standard gold doped TTL functioned only to 250/sup 0/C, while commercial, isolated I/sup 2/L functioned to the range 250/sup 0/C to 275/sup 0/C. Commercial junction isolated CMOS, buffered and unbuffered, functioned to the range 280/sup 0/C to 310/sup 0/C/sup +/, depending on the manufacturer. Experimental simulations of simple dielectrically isolated CMOS integrated circuits, fabricated with heavier doping levels than normal, functioned to temperatures in excess of 340/sup 0/C. High temperature life testing of experimental, silicone-encapsulated simple TTL and CMOS integrated circuits have shown no obvious life limiting problems to date. No barrier to reliable functionality of TTL bipolar or CMOS integrated ciruits at temperatures in excess of 300/sup 0/C has been found.
Electron commutator on integrated circuits
International Nuclear Information System (INIS)
Demidenko, V.V.
1975-01-01
The scheme and the parameters of an electron 16-channel contactless commutator based entirely on integrated circuits are described. The device consists of a unit of analog keys based on field-controlled metal-insulator-semiconductor (m.i.s.) transistors, operation amplifier comparators controlling these keys, and a level distributor. The distributor is based on a ''matrix'' scheme and comprises two ring-shaped shift registers plugged in series and a decoder base on two-input logical elements I-NE. The principal dynamical parameters of the circuit are as follows: the control signal delay in the distributor. 50 nsec; the total channel switch-over time, 500-600 nsec. The commutator transmits both constant signals and pulses whose duration reaches tens of nsec. The commutator can be used in data acquisition and processing systems, for shaping complicated signals (for example), (otherwise signals), for simultaneous oscillographing of several signals, and so forth [ru
Integrated circuit cell library
Whitaker, Sterling R. (Inventor); Miles, Lowell H. (Inventor)
2005-01-01
According to the invention, an ASIC cell library for use in creation of custom integrated circuits is disclosed. The ASIC cell library includes some first cells and some second cells. Each of the second cells includes two or more kernel cells. The ASIC cell library is at least 5% comprised of second cells. In various embodiments, the ASIC cell library could be 10% or more, 20% or more, 30% or more, 40% or more, 50% or more, 60% or more, 70% or more, 80% or more, 90% or more, or 95% or more comprised of second cells.
Hydrogenated Amorphous Silicon Sensor Deposited on Integrated Circuit for Radiation Detection
Despeisse, M; Jarron, P; Kaplon, J; Moraes, D; Nardulli, A; Powolny, F; Wyrsch, N
2008-01-01
Radiation detectors based on the deposition of a 10 to 30 mum thick hydrogenated amorphous silicon (a-Si:H) sensor directly on top of integrated circuits have been developed. The performance of this detector technology has been assessed for the first time in the context of particle detectors. Three different circuits were designed in a quarter micron CMOS technology for these studies. The so-called TFA (Thin-Film on ASIC) detectors obtained after deposition of a-Si:H sensors on the developed circuits are presented. High internal electric fields (104 to 105 V/cm) can be built in the a-Si:H sensor and overcome the low mobility of electrons and holes in this amorphous material. However, the deposited sensor's leakage current at such fields turns out to be an important parameter which limits the performance of a TFA detector. Its detailed study is presented as well as the detector's pixel segmentation. Signal induction by generated free carrier motion in the a-Si:H sensor has been characterized using a 660 nm pul...
A programmable delay unit incorporating a semi-custom integrated circuit
International Nuclear Information System (INIS)
Linstadt, E.
1985-01-01
The synchronization of SLC accelerator control and monitoring functions is realized by a CAMAC module, the PDU II (Programmable Delay Unit II, SLAC 253-002), which includes a semi-custom gate array integrated circuit. The PDU II distributes 16 channels of independently programmable delayed pulses to other modules within the same CAMAC crate. The delays are programmable in increments of 8.4 ns. Functional descriptions of both the module and the semi-custom integrated circuit used to generate the output pulses are given
Integrated Circuits in the Introductory Electronics Laboratory
English, Thomas C.; Lind, David A.
1973-01-01
Discusses the use of an integrated circuit operational amplifier in an introductory electronics laboratory course for undergraduate science majors. The advantages of this approach and the implications for scientific instrumentation are identified. Describes a number of experiments suitable for the undergraduate laboratory. (Author/DF)
Mode converter based on an inverse taper for multimode silicon nanophotonic integrated circuits.
Dai, Daoxin; Mao, Mao
2015-11-02
An inverse taper on silicon is proposed and designed to realize an efficient mode converter available for the connection between multimode silicon nanophotonic integrated circuits and few-mode fibers. The present mode converter has a silicon-on-insulator inverse taper buried in a 3 × 3μm(2) SiN strip waveguide to deal with not only for the fundamental mode but also for the higher-order modes. The designed inverse taper enables the conversion between the six modes (i.e., TE(11), TE(21), TE(31), TE(41), TM(11), TM(12)) in a 1.4 × 0.22μm(2) multimode SOI waveguide and the six modes (like the LP(01), LP(11a), LP(11b) modes in a few-mode fiber) in a 3 × 3μm(2) SiN strip waveguide. The conversion efficiency for any desired mode is higher than 95.6% while any undesired mode excitation ratio is lower than 0.5%. This is helpful to make multimode silicon nanophotonic integrated circuits (e.g., the on-chip mode (de)multiplexers developed well) available to work together with few-mode fibers in the future.
Design principles and realization of electro-optical circuit boards
Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry
2013-02-01
The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.
Monolithically Integrated Flexible Black Phosphorus Complementary Inverter Circuits.
Liu, Yuanda; Ang, Kah-Wee
2017-07-25
Two-dimensional (2D) inverters are a fundamental building block for flexible logic circuits which have previously been realized by heterogeneously wiring transistors with two discrete channel materials. Here, we demonstrate a monolithically integrated complementary inverter made using a homogeneous black phosphorus (BP) nanosheet on flexible substrates. The digital logic inverter circuit is demonstrated via effective threshold voltage tuning within a single BP material, which offers both electron and hole dominated conducting channels with nearly symmetric pinch-off and current saturation. Controllable electron concentration is achieved by accurately modulating the aluminum (Al) donor doping, which realizes BP n-FET with a room-temperature on/off ratio >10 3 . Simultaneously, work function engineering is employed to obtain a low Schottky barrier contact electrode that facilities hole injection, thus enhancing the current density of the BP p-FET by 9.4 times. The flexible inverter circuit shows a clear digital logic voltage inversion operation along with a larger-than-unity direct current voltage gain, while exhibits alternating current dynamic signal switching at a record high frequency up to 100 kHz and remarkable electrical stability upon mechanical bending with a radii as small as 4 mm. Our study demonstrates a practical monolithic integration strategy for achieving functional logic circuits on one material platform, paving the way for future high-density flexible electronic applications.
2011-07-14
... INTERNATIONAL TRADE COMMISSION [Inv. No. 337-TA-786] In the Matter of Certain Integrated Circuits... sale within the United States after importation of certain integrated circuits, chipsets, and products... after importation of certain integrated circuits, chipsets, and products containing same including...
2010-02-04
... Semiconductor Integrated Circuits and Products Containing Same; Notice of Commission Determination To Review in... importation of certain semiconductor integrated circuits and products containing same by reason of... (collectively ``Seagate''). Qimonda accuses of infringement certain LSI integrated circuits, as well as certain...
2012-06-13
... of certain radio frequency integrated circuits and devices containing same by reason of infringement... importation of certain radio frequency integrated circuits and devices containing same that infringe one or... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-848] Certain Radio Frequency Integrated...
Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates.
Cao, Qing; Kim, Hoon-sik; Pimparkar, Ninad; Kulkarni, Jaydeep P; Wang, Congjun; Shim, Moonsub; Roy, Kaushik; Alam, Muhammad A; Rogers, John A
2008-07-24
The ability to form integrated circuits on flexible sheets of plastic enables attributes (for example conformal and flexible formats and lightweight and shock resistant construction) in electronic devices that are difficult or impossible to achieve with technologies that use semiconductor wafers or glass plates as substrates. Organic small-molecule and polymer-based materials represent the most widely explored types of semiconductors for such flexible circuitry. Although these materials and those that use films or nanostructures of inorganics have promise for certain applications, existing demonstrations of them in circuits on plastic indicate modest performance characteristics that might restrict the application possibilities. Here we report implementations of a comparatively high-performance carbon-based semiconductor consisting of sub-monolayer, random networks of single-walled carbon nanotubes to yield small- to medium-scale integrated digital circuits, composed of up to nearly 100 transistors on plastic substrates. Transistors in these integrated circuits have excellent properties: mobilities as high as 80 cm(2) V(-1) s(-1), subthreshold slopes as low as 140 m V dec(-1), operating voltages less than 5 V together with deterministic control over the threshold voltages, on/off ratios as high as 10(5), switching speeds in the kilohertz range even for coarse (approximately 100-microm) device geometries, and good mechanical flexibility-all with levels of uniformity and reproducibility that enable high-yield fabrication of integrated circuits. Theoretical calculations, in contexts ranging from heterogeneous percolative transport through the networks to compact models for the transistors to circuit level simulations, provide quantitative and predictive understanding of these systems. Taken together, these results suggest that sub-monolayer films of single-walled carbon nanotubes are attractive materials for flexible integrated circuits, with many potential areas of
Woon Tiong Ang; Scurtescu, C; Wing Hoy; El-Bialy, T; Ying Yin Tsui; Jie Chen
2010-02-01
Biological tissue healing has recently attracted a great deal of research interest in various medical fields. Trauma to teeth, deep and root caries, and orthodontic treatment can all lead to various degrees of root resorption. In our previous study, we showed that low-intensity pulsed ultrasound (LIPUS) enhances the growth of lower incisor apices and accelerates their rate of eruption in rabbits by inducing dental tissue growth. We also performed clinical studies and demonstrated that LIPUS facilitates the healing of orthodontically induced teeth-root resorption in humans. However, the available LIPUS devices are too large to be used comfortably inside the mouth. In this paper, the design and implementation of a low-power LIPUS generator is presented. The generator is the core of the final intraoral device for preventing tooth root loss and enhancing tooth root tissue healing. The generator consists of a power-supply subsystem, an ultrasonic transducer, an impedance-matching circuit, and an integrated circuit composed of a digital controller circuitry and the associated driver circuit. Most of our efforts focus on the design of the impedance-matching circuit and the integrated system-on-chip circuit. The chip was designed and fabricated using 0.8- ¿m high-voltage technology from Dalsa Semiconductor, Inc. The power supply subsystem and its impedance-matching network are implemented using discrete components. The LIPUS generator was tested and verified to function as designed and is capable of producing ultrasound power up to 100 mW in the vicinity of the transducer's resonance frequency at 1.5 MHz. The power efficiency of the circuitry, excluding the power supply subsystem, is estimated at 70%. The final products will be tailored to the exact size of teeth or biological tissue, which is needed to be used for stimulating dental tissue (dentine and cementum) healing.
22nd Workshop on Advances in Analog Circuit Design
Makinwa, Kofi; Harpe, Pieter
2014-01-01
This book is based on the 18 tutorials presented during the 22nd workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including frequency reference, power management for systems-on-chip, and smart wireless interfaces. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development. · Provides a state-of-the-art reference in analog circuit design, written by experts from industry and academia; · Presents material in a tutorial-based format; · Includes coverage of frequency reference, power management for systems-on-chip, and smart wireless interfaces.
A Sequential Circuit-Based IP Watermarking Algorithm for Multiple Scan Chains in Design-for-Test
Directory of Open Access Journals (Sweden)
C. Wu
2011-06-01
Full Text Available In Very Large Scale Integrated Circuits (VLSI design, the existing Design-for-Test(DFT based watermarking techniques usually insert watermark through reordering scan cells, which causes large resource overhead, low security and coverage rate of watermark detection. A novel scheme was proposed to watermark multiple scan chains in DFT for solving the problems. The proposed scheme adopts DFT scan test model of VLSI design, and uses a Linear Feedback Shift Register (LFSR for pseudo random test vector generation. All of the test vectors are shifted in scan input for the construction of multiple scan chains with minimum correlation. Specific registers in multiple scan chains will be changed by the watermark circuit for watermarking the design. The watermark can be effectively detected without interference with normal function of the circuit, even after the chip is packaged. The experimental results on several ISCAS benchmarks show that the proposed scheme has lower resource overhead, probability of coincidence and higher coverage rate of watermark detection by comparing with the existing methods.
Latch-up control in CMOS integrated circuits
International Nuclear Information System (INIS)
Ochoa, A.; Dawes, W.; Estreich, D.; Packard, H.
1979-01-01
The potential for latch-up, a pnpn self-sustaining low impedance state, is inherent in standard bulk CMOS-integrated circuit structures. Under normal bias, the parasitic SCR is in its blocking state but, if subjected to a large voltage spike or if exposed to an ionizing environment, triggering may occur. This may result in device burn-out or loss of state. The problem has been extensively studied for space and weapons applications. Prevention of latch-up has been achieved in conservative design (approx. 9 μm p-well depths) by the use of minority lifetime control methods such as gold doping and neutron irradiation and by modifying the base transport factor with buried layers. The push toward VLSI densities will enhance parasitic action sufficiently so that the problem will become of more universal concern. The paper will surveys latch-up control methods presently employed for weapons and space applications on present (approx. 9 μm p-well) CMOS and indicates the extent of their applicability to VLSI designs
Flexible, High-Speed CdSe Nanocrystal Integrated Circuits.
Stinner, F Scott; Lai, Yuming; Straus, Daniel B; Diroll, Benjamin T; Kim, David K; Murray, Christopher B; Kagan, Cherie R
2015-10-14
We report large-area, flexible, high-speed analog and digital colloidal CdSe nanocrystal integrated circuits operating at low voltages. Using photolithography and a newly developed process to fabricate vertical interconnect access holes, we scale down device dimensions, reducing parasitic capacitances and increasing the frequency of circuit operation, and scale up device fabrication over 4 in. flexible substrates. We demonstrate amplifiers with ∼7 kHz bandwidth, ring oscillators with <10 μs stage delays, and NAND and NOR logic gates.
Monolithic microwave integrated circuits: Interconnections and packaging considerations
Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.
1984-01-01
Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.
Monolithic microwave integrated circuits: Interconnections and packaging considerations
Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.
Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.
2010-04-02
... INTERNATIONAL TRADE COMMISSION [Inv. No. 337-TA-709] In the Matter of Certain Integrated Circuits... importation of certain integrated circuits, chipsets, and products containing same including televisions... importation, or the sale within the United States after importation of certain integrated circuits, chipsets...
International Nuclear Information System (INIS)
Bhuva, B.L.
1987-01-01
Degradations in the circuit performance created by the radiation exposure of integrated circuits are so unique and abnormal that thorough simulation and testing of VLSI circuits is almost impossible, and new ways to estimate the operating performance in a radiation environment must be developed. The principal goal of this work was the development of simulation techniques for radiation effects on semiconductor devices. The mixed-mode simulation approach proved to be the most promising. The switch-level approach is used to identify the failure mechanisms and critical subcircuits responsible for operational failure along with worst-case operating conditions during and after irradiation. For precise simulations of critical subcircuits, SPICE is used. The identification of failure mechanisms enables the circuit designer to improve the circuit's performance and failure-exposure level. Identification of worst-case operating conditions during and after irradiation reduces the complexity of testing VLSI circuits for radiation environments. The results of test circuits for failure simulations using a conventional simulator and the new simulator showed significant time savings using the new simulator. The savings in simulation time proved to be circuit topology-dependent. However, for large circuits, the simulation time proved to be orders of magnitude smaller than simulation time for conventional simulators
High-resolution non-destructive three-dimensional imaging of integrated circuits.
Holler, Mirko; Guizar-Sicairos, Manuel; Tsai, Esther H R; Dinapoli, Roberto; Müller, Elisabeth; Bunk, Oliver; Raabe, Jörg; Aeppli, Gabriel
2017-03-15
Modern nanoelectronics has advanced to a point at which it is impossible to image entire devices and their interconnections non-destructively because of their small feature sizes and the complex three-dimensional structures resulting from their integration on a chip. This metrology gap implies a lack of direct feedback between design and manufacturing processes, and hampers quality control during production, shipment and use. Here we demonstrate that X-ray ptychography-a high-resolution coherent diffractive imaging technique-can create three-dimensional images of integrated circuits of known and unknown designs with a lateral resolution in all directions down to 14.6 nanometres. We obtained detailed device geometries and corresponding elemental maps, and show how the devices are integrated with each other to form the chip. Our experiments represent a major advance in chip inspection and reverse engineering over the traditional destructive electron microscopy and ion milling techniques. Foreseeable developments in X-ray sources, optics and detectors, as well as adoption of an instrument geometry optimized for planar rather than cylindrical samples, could lead to a thousand-fold increase in efficiency, with concomitant reductions in scan times and voxel sizes.
High-resolution non-destructive three-dimensional imaging of integrated circuits
Holler, Mirko; Guizar-Sicairos, Manuel; Tsai, Esther H. R.; Dinapoli, Roberto; Müller, Elisabeth; Bunk, Oliver; Raabe, Jörg; Aeppli, Gabriel
2017-03-01
Modern nanoelectronics has advanced to a point at which it is impossible to image entire devices and their interconnections non-destructively because of their small feature sizes and the complex three-dimensional structures resulting from their integration on a chip. This metrology gap implies a lack of direct feedback between design and manufacturing processes, and hampers quality control during production, shipment and use. Here we demonstrate that X-ray ptychography—a high-resolution coherent diffractive imaging technique—can create three-dimensional images of integrated circuits of known and unknown designs with a lateral resolution in all directions down to 14.6 nanometres. We obtained detailed device geometries and corresponding elemental maps, and show how the devices are integrated with each other to form the chip. Our experiments represent a major advance in chip inspection and reverse engineering over the traditional destructive electron microscopy and ion milling techniques. Foreseeable developments in X-ray sources, optics and detectors, as well as adoption of an instrument geometry optimized for planar rather than cylindrical samples, could lead to a thousand-fold increase in efficiency, with concomitant reductions in scan times and voxel sizes.
Status of readout integrated circuits for radiation detector
International Nuclear Information System (INIS)
Moon, B. S.; Hong, S. B.; Cheng, J. E. and others
2001-09-01
In this report, we describe the current status of readout integrated circuits developed for radiation detectors, along with new technologies being applied to this field. The current status of ASCIC chip development related to the readout electronics is also included in this report. Major sources of this report are from product catalogs and web sites of the related industries. In the field of semiconductor process technology in Korea, the current status of the multi-project wafer(MPW) of IDEC, the multi-project chip(MPC) of ISRC and other domestic semiconductor process industries is described. In the case of other countries, the status of the MPW of MOSIS in USA and the MPW of EUROPRACTICE in Europe is studied. This report also describes the technologies and products of readout integrated circuits of industries worldwide
Leonard, Regis F. (Editor); Bhasin, Kul B. (Editor)
1991-01-01
Consideration is given to MMICs for airborne phased arrays, monolithic GaAs integrated circuit millimeter wave imaging sensors, accurate design of multiport low-noise MMICs up to 20 GHz, an ultralinear low-noise amplifier technology for space communications, variable-gain MMIC module for space applications, a high-efficiency dual-band power amplifier for radar applications, a high-density circuit approach for low-cost MMIC circuits, coplanar SIMMWIC circuits, recent advances in monolithic phased arrays, and system-level integrated circuit development for phased-array antenna applications. Consideration is also given to performance enhancement in future communications satellites with MMIC technology insertion, application of Ka-band MMIC technology for an Orbiter/ACTS communications experiment, a space-based millimeter wave debris tracking radar, low-noise high-yield octave-band feedback amplifiers to 20 GHz, quasi-optical MESFET VCOs, and a high-dynamic-range mixer using novel balun structure.
Hardware security and trust design and deployment of integrated circuits in a threatened environment
Chaves, Ricardo; Natale, Giorgio; Regazzoni, Francesco
2017-01-01
This book provides a comprehensive introduction to hardware security, from specification to implementation. Applications discussed include embedded systems ranging from small RFID tags to satellites orbiting the earth. The authors describe a design and synthesis flow, which will transform a given circuit into a secure design incorporating counter-measures against fault attacks. In order to address the conflict between testability and security, the authors describe innovative design-for-testability (DFT) computer-aided design (CAD) tools that support security challenges, engineered for compliance with existing, commercial tools. Secure protocols are discussed, which protect access to necessary test infrastructures and enable the design of secure access controllers. Covers all aspects of hardware security including design, manufacturing, testing, reliability, validation and utilization; Describes new methods and algorithms for the identification/detection of hardware trojans; Defines new architectures capable o...
Digital logic circuit design with ALTERA MAX+PLUS II
International Nuclear Information System (INIS)
Lee, Seung Ho; Park, Yong Su; Park, Gun Jong; Lee, Ju Heon
2006-09-01
This book is composed of five parts. The first part has introduction of ALTERA MAX+PLUS II and graphic editor, text editor, compiler, waveform editor simulator and timing analyzer of it. The second part is about direction of digital logic circuit design with training kit. The third part has grammar and practice of VHDL in ALTERA MAX+PLUS II including example and history of VHDL. The fourth part shows the design example of digital logic circuit by VHDL of ALTERA MAX+PLUS II which lists designs of adder and subtractor, code converter, counter, state machine and LCD module. The last part explains design example of digital logic circuit by graphic editor in ALTERA MAX+PLUS II.
InP-based three-dimensional photonic integrated circuits
Tsou, Diana; Zaytsev, Sergey; Pauchard, Alexandre; Hummel, Steve; Lo, Yu-Hwa
2001-10-01
Fast-growing internet traffic volumes require high data communication bandwidth over longer distances than short wavelength (850 nm) multi-mode fiber systems can provide. Access network bottlenecks put pressure on short-range (SR) telecommunication systems. To effectively address these datacom and telecom market needs, low cost, high-speed laser modules at 1310 and 1550 nm wavelengths are required. The great success of GaAs 850 nm VCSELs for Gb/s Ethernet has motivated efforts to extend VCSEL technology to longer wavelengths in the 1310 and 1550 nm regimes. However, the technological challenges associated with available intrinsic materials for long wavelength VCSELs are tremendous. Even with recent advances in this area, it is believed that significant additional development is necessary before long wavelength VCSELs that meet commercial specifications will be widely available. In addition, the more stringent OC192 and OC768 specifications for single-mode fiber (SMF) datacom may require more than just a long wavelength laser diode, VCSEL or not, to address numerous cost and performance issues. We believe that photonic integrated circuits, which compactly integrate surface-emitting lasers with additional active and passive optical components with extended functionality, will provide the best solutions to today's problems. Photonic integrated circuits (PICs) have been investigated for more than a decade. However, they have produced limited commercial impact to date primarily because the highly complicated fabrication processes produce significant yield and device performance issues. In this presentation, we will discuss a new technology platform for fabricating InP-based photonic integrated circuits compatible with surface-emitting laser technology. Employing InP transparency at 1310 and 1550 nm wavelengths, we have created 3-D photonic integrated circuits (PICs) by utilizing light beams in both surface normal and in-plane directions within the InP-based structure
New readout integrated circuit using continuous time fixed pattern noise correction
Dupont, Bertrand; Chammings, G.; Rapellin, G.; Mandier, C.; Tchagaspanian, M.; Dupont, Benoit; Peizerat, A.; Yon, J. J.
2008-04-01
LETI has been involved in IRFPA development since 1978; the design department (LETI/DCIS) has focused its work on new ROIC architecture since many years. The trend is to integrate advanced functions into the CMOS design to achieve cost efficient sensors production. Thermal imaging market is today more and more demanding of systems with instant ON capability and low power consumption. The purpose of this paper is to present the latest developments of fixed pattern noise continuous time correction. Several architectures are proposed, some are based on hardwired digital processing and some are purely analog. Both are using scene based algorithms. Moreover a new method is proposed for simultaneous correction of pixel offsets and sensitivities. In this scope, a new architecture of readout integrated circuit has been implemented; this architecture is developed with 0.18μm CMOS technology. The specification and the application of the ROIC are discussed in details.
Substrate optimization for integrated circuit antennas
Alexopoulos, N. G.; Katehi, P. B.; Rutledge, D. B.
1982-01-01
Imaging systems in microwaves, millimeter and submillimeter wave applications employ printed circuit antenna elements. The effect of substrate properties is analyzed in this paper by both reciprocity theorem as well as integral equation approach for infinitesimally short as well as finite length dipole and slot elements. Radiation efficiency and substrate surface wave guidance is studied for practical substrate materials as GaAs, Silicon, Quartz and Duroid.
Viewing Integrated-Circuit Interconnections By SEM
Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.
1990-01-01
Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.
Directory of Open Access Journals (Sweden)
Arun Kaintura
2018-02-01
Full Text Available Advances in manufacturing process technology are key ensembles for the production of integrated circuits in the sub-micrometer region. It is of paramount importance to assess the effects of tolerances in the manufacturing process on the performance of modern integrated circuits. The polynomial chaos expansion has emerged as a suitable alternative to standard Monte Carlo-based methods that are accurate, but computationally cumbersome. This paper provides an overview of the most recent developments and challenges in the application of polynomial chaos-based techniques for uncertainty quantification in integrated circuits, with particular focus on high-dimensional problems.
Design of delay insensitive circuits using multi-ring structures
DEFF Research Database (Denmark)
Sparsø, Jens; Staunstrup, Jørgen; Dantzer-Sørensen, Michael
1992-01-01
The design and VLSI implementation of a delay insensitive circuit that computes the inner product of two vec·tors is described. The circuit is based on an iterative serial-parallel multiplication algorithm. The design is based on a data flow approach using pipelines and rings that are combined...
Multi-Objective Optimization in Physical Synthesis of Integrated Circuits
A Papa, David
2013-01-01
This book introduces techniques that advance the capabilities and strength of modern software tools for physical synthesis, with the ultimate goal to improve the quality of leading-edge semiconductor products. It provides a comprehensive introduction to physical synthesis and takes the reader methodically from first principles through state-of-the-art optimizations used in cutting edge industrial tools. It explains how to integrate chip optimizations in novel ways to create powerful circuit transformations that help satisfy performance requirements. Broadens the scope of physical synthesis optimization to include accurate transformations operating between the global and local scales; Integrates groups of related transformations to break circular dependencies and increase the number of circuit elements that can be jointly optimized to escape local minima; Derives several multi-objective optimizations from first observations through complete algorithms and experiments; Describes integrated optimization te...
Shang, Kuanping; Pathak, Shibnath; Liu, Guangyao; Feng, Shaoqi; Li, Siwei; Lai, Weicheng; Yoo, S J B
2017-05-01
We designed and demonstrated a tri-layer Si3N4/SiO2 photonic integrated circuit capable of vertical interlayer coupling with arbitrary splitting ratios. Based on this multilayer photonic integrated circuit platform with each layer thicknesses of 150 nm, 50 nm, and 150 nm, we designed and simulated the vertical Y-junctions and 3D couplers with arbitrary power splitting ratios between 1:10 and 10:1 and with negligible(< -50 dB) reflection. Based on the design, we fabricated and demonstrated tri-layer vertical Y-junctions with the splitting ratios of 1:1 and 3:2 with excess optical losses of 0.230 dB. Further, we fabricated and demonstrated the 1 × 3 3D couplers with the splitting ratio of 1:1:4 for symmetric structures and variable splitting ratio for asymmetric structures.
A novel high voltage start up circuit for an integrated switched mode power supply
Energy Technology Data Exchange (ETDEWEB)
Hu Hao; Chen Xingbi, E-mail: huhao21@uestc.edu.c [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China)
2010-09-15
A novel high voltage start up circuit for providing an initial bias voltage to an integrated switched mode power supply (SMPS) is presented. An enhanced mode VDMOS transistor, the gate of which is biased by a floating p-island, is used to provide start up current and sustain high voltage. An NMOS transistor having a high source to ground breakdown voltage is included to extend the bias voltage range to the SMPS. Simulation results indicate that the high voltage start up circuit can start and restart as designed. The proposed structure is believed to be more energy saving and cost-effective compared with other solutions. (semiconductor devices)
A design method of oscillatory De-Qing circuit
International Nuclear Information System (INIS)
Feng Wenquan
1988-01-01
With some particular advantages the oscillatory De-Qing circuit now is widely used. However its design is very complex. By means of a quantitative analysis for this circuit a group of design formulas is obtained. According to these design formulas the maximum allowable charging inductance L c , the De-Qing network resistance R and capacitance C can easily be determined, if the PFN capacitance C N , the maximum pulse frequency F max , and percentage regulation η are given. Simple and direct formulas for specific situation are listed. Finally, a design example is given and a comparison with experimental result is made, which shows that the design method is feasible and reliable
Khuri-Yakub, B. (Pierre) T.; Oralkan, Ömer; Nikoozadeh, Amin; Wygant, Ira O.; Zhuang, Steve; Gencel, Mustafa; Choe, Jung Woo; Stephens, Douglas N.; de la Rama, Alan; Chen, Peter; Lin, Feng; Dentinger, Aaron; Wildes, Douglas; Thomenius, Kai; Shivkumar, Kalyanam; Mahajan, Aman; Seo, Chi Hyung; O’Donnell, Matthew; Truong, Uyen; Sahn, David J.
2010-01-01
Capacitive micromachined ultrasonic transducer (CMUT) arrays are conveniently integrated with frontend integrated circuits either monolithically or in a hybrid multichip form. This integration helps with reducing the number of active data processing channels for 2D arrays. This approach also preserves the signal integrity for arrays with small elements. Therefore CMUT arrays integrated with electronic circuits are most suitable to implement miniaturized probes required for many intravascular, intracardiac, and endoscopic applications. This paper presents examples of miniaturized CMUT probes utilizing 1D, 2D, and ring arrays with integrated electronics. PMID:21097106
Analysis and design of substrate integrated waveguide using efficient 2D hybrid method
Wu, Xuan Hui
2010-01-01
Substrate integrated waveguide (SIW) is a new type of transmission line. It implements a waveguide on a piece of printed circuit board by emulating the side walls of the waveguide using two rows of metal posts. It inherits the merits both from the microstrip for compact size and easy integration, and from the waveguide for low radiation loss, and thus opens another door to design efficient microwave circuits and antennas at a low cost. This book presents a two-dimensional fullwave analysis method to investigate an SIW circuit composed of metal and dielectric posts. It combines the cylindrical
Method and apparatus for in-system redundant array repair on integrated circuits
Bright, Arthur A.; Crumley, Paul G.; Dombrowa, Marc B.; Douskey, Steven M.; Haring, Rudolf A.; Oakland, Steven F.; Ouellette, Michael R.; Strissel, Scott A.
2007-12-18
Disclosed is a method of repairing an integrated circuit of the type comprising of a multitude of memory arrays and a fuse box holding control data for controlling redundancy logic of the arrays. The method comprises the steps of providing the integrated circuit with a control data selector for passing the control data from the fuse box to the memory arrays; providing a source of alternate control data, external of the integrated circuit; and connecting the source of alternate control data to the control data selector. The method comprises the further step of, at a given time, passing the alternate control data from the source thereof, through the control data selector and to the memory arrays to control the redundancy logic of the memory arrays.
Method and apparatus for in-system redundant array repair on integrated circuits
Bright, Arthur A [Croton-on-Hudson, NY; Crumley, Paul G [Yorktown Heights, NY; Dombrowa, Marc B [Bronx, NY; Douskey, Steven M [Rochester, MN; Haring, Rudolf A [Cortlandt Manor, NY; Oakland, Steven F [Colchester, VT; Ouellette, Michael R [Westford, VT; Strissel, Scott A [Byron, MN
2008-07-29
Disclosed is a method of repairing an integrated circuit of the type comprising of a multitude of memory arrays and a fuse box holding control data for controlling redundancy logic of the arrays. The method comprises the steps of providing the integrated circuit with a control data selector for passing the control data from the fuse box to the memory arrays; providing a source of alternate control data, external of the integrated circuit; and connecting the source of alternate control data to the control data selector. The method comprises the further step of, at a given time, passing the alternate control data from the source thereof, through the control data selector and to the memory arrays to control the redundancy logic of the memory arrays.
Transient-induced latchup in CMOS integrated circuits
Ker, Ming-Dou
2009-01-01
"Transient-Induced Latchup in CMOS Integrated Circuits equips the practicing engineer with all the tools needed to address this regularly occurring problem while becoming more proficient at IC layout. Ker and Hsu introduce the phenomenon and basic physical mechanism of latchup, explaining the critical issues that have resurfaced for CMOS technologies. Once readers can gain an understanding of the standard practices for TLU, Ker and Hsu discuss the physical mechanism of TLU under a system-level ESD test, while introducing an efficient component-level TLU measurement setup. The authors then present experimental methodologies to extract safe and area-efficient compact layout rules for latchup prevention, including layout rules for I/O cells, internal circuits, and between I/O and internal circuits. The book concludes with an appendix giving a practical example of extracting layout rules and guidelines for latchup prevention in a 0.18-micrometer 1.8V/3.3V silicided CMOS process."--Publisher's description.
GaAs Photonic Integrated Circuit (PIC) development for high performance communications
Energy Technology Data Exchange (ETDEWEB)
Sullivan, C.T.
1998-03-01
Sandia has established a foundational technology in photonic integrated circuits (PICs) based on the (Al,Ga,In)As material system for optical communication, radar control and testing, and network switching applications at the important 1.3{mu}m/1.55{mu}m wavelengths. We investigated the optical, electrooptical, and microwave performance characteristics of the fundamental building-block PIC elements designed to be as simple and process-tolerant as possible, with particular emphasis placed on reducing optical insertion loss. Relatively conventional device array and circuit designs were built using these PIC elements: (1) to establish a baseline performance standard; (2) to assess the impact of epitaxial growth accuracy and uniformity, and of fabrication uniformity and yield; (3) to validate our theoretical and numerical models; and (4) to resolve the optical and microwave packaging issues associated with building fully packaged prototypes. Novel and more complex PIC designs and fabrication processes, viewed as higher payoff but higher risk, were explored in a parallel effort with the intention of meshing those advances into our baseline higher-yield capability as they mature. The application focus targeted the design and fabrication of packaged solitary modulators meeting the requirements of future wideband and high-speed analog and digital data links. Successfully prototyped devices are expected to feed into more complex PICs solving specific problems in high-performance communications, such as optical beamforming networks for phased array antennas.
Analysis and design of a genetic circuit for dynamic metabolic engineering.
Anesiadis, Nikolaos; Kobayashi, Hideki; Cluett, William R; Mahadevan, Radhakrishnan
2013-08-16
Recent advances in synthetic biology have equipped us with new tools for bioprocess optimization at the genetic level. Previously, we have presented an integrated in silico design for the dynamic control of gene expression based on a density-sensing unit and a genetic toggle switch. In the present paper, analysis of a serine-producing Escherichia coli mutant shows that an instantaneous ON-OFF switch leads to a maximum theoretical productivity improvement of 29.6% compared to the mutant. To further the design, global sensitivity analysis is applied here to a mathematical model of serine production in E. coli coupled with a genetic circuit. The model of the quorum sensing and the toggle switch involves 13 parameters of which 3 are identified as having a significant effect on serine concentration. Simulations conducted in this reduced parameter space further identified the optimal ranges for these 3 key parameters to achieve productivity values close to the maximum theoretical values. This analysis can now be used to guide the experimental implementation of a dynamic metabolic engineering strategy and reduce the time required to design the genetic circuit components.
Leonard, Regis F.; Bhasin, Kul B.
Consideration is given to MMICs for airborne phased arrays, monolithic GaAs integrated circuit millimeter wave imaging sensors, accurate design of multiport low-noise MMICs up to 20 GHz, an ultralinear low-noise amplifier technology for space communications, variable-gain MMIC module for space applications, a high-efficiency dual-band power amplifier for radar applications, a high-density circuit approach for low-cost MMIC circuits, coplanar SIMMWIC circuits, recent advances in monolithic phased arrays, and system-level integrated circuit development for phased-array antenna applications. Consideration is also given to performance enhancement in future communications satellites with MMIC technology insertion, application of Ka-band MMIC technology for an Orbiter/ACTS communications experiment, a space-based millimeter wave debris tracking radar, low-noise high-yield octave-band feedback amplifiers to 20 GHz, quasi-optical MESFET VCOs, and a high-dynamic-range mixer using novel balun structure. (For individual items see A93-25777 to A93-25814)
A novel integrated circuit for semiconductor radiation detectors with sparse readout
International Nuclear Information System (INIS)
Zhang Yacong; Chen Zhognjian; Lu Wengao; Zhao Baoying; Ji Lijiu
2008-01-01
A novel fully integrated CMOS readout circuit for semiconductor radiation detector with sparse readout is presented. The new sparse scheme is: when one channel is being read out, the trigger signal from other channels is delayed and then processed. Therefore, the dead time is reduced and so is the error rate. Besides sparse readout, sequential readout is also allowed, which means the analog voltages and addresses of all the channels are read out sequentially once there is a channel triggered. The circuit comprises Charge Sensitive Amplifier (CSA), pulse shaper, peak detect and hold circuit, and digital logic. A test chip of four channels designed in a 0.5 μ DPTM CMOS technology has been taped out. The results of post simulation indicate that the gain is 79.3 mV/fC with a linearity of 99.92%. The power dissipation is 4 mW per channel. Theory analysis and calculation shows that the error probability is approximately 2.5%, which means a reduction of about 37% is obtained compared with the traditional scanning scheme, assuming a 16-channel system with a particle rate of 100 k/s per channel. (authors)
Absil, Philippe P; Verheyen, Peter; De Heyn, Peter; Pantouvaki, Marianna; Lepage, Guy; De Coster, Jeroen; Van Campenhout, Joris
2015-04-06
Silicon photonics integrated circuits are considered to enable future computing systems with optical input-outputs co-packaged with CMOS chips to circumvent the limitations of electrical interfaces. In this paper we present the recent progress made to enable dense multiplexing by exploiting the integration advantage of silicon photonics integrated circuits. We also discuss the manufacturability of such circuits, a key factor for a wide adoption of this technology.
Monolithic microwave integrated circuit devices for active array antennas
Mittra, R.
1984-01-01
Two different aspects of active antenna array design were investigated. The transition between monolithic microwave integrated circuits and rectangular waveguides was studied along with crosstalk in multiconductor transmission lines. The boundary value problem associated with a discontinuity in a microstrip line is formulated. This entailed, as a first step, the derivation of the propagating as well as evanescent modes of a microstrip line. The solution is derived to a simple discontinuity problem: change in width of the center strip. As for the multiconductor transmission line problem. A computer algorithm was developed for computing the crosstalk noise from the signal to the sense lines. The computation is based on the assumption that these lines are terminated in passive loads.
Monolithic microwave integrated circuit water vapor radiometer
Sukamto, L. M.; Cooley, T. W.; Janssen, M. A.; Parks, G. S.
1991-01-01
A proof of concept Monolithic Microwave Integrated Circuit (MMIC) Water Vapor Radiometer (WVR) is under development at the Jet Propulsion Laboratory (JPL). WVR's are used to remotely sense water vapor and cloud liquid water in the atmosphere and are valuable for meteorological applications as well as for determination of signal path delays due to water vapor in the atmosphere. The high cost and large size of existing WVR instruments motivate the development of miniature MMIC WVR's, which have great potential for low cost mass production. The miniaturization of WVR components allows large scale deployment of WVR's for Earth environment and meteorological applications. Small WVR's can also result in improved thermal stability, resulting in improved calibration stability. Described here is the design and fabrication of a 31.4 GHz MMIC radiometer as one channel of a thermally stable WVR as a means of assessing MMIC technology feasibility.
Directory of Open Access Journals (Sweden)
Daoxin Dai
2012-03-01
Full Text Available Silicon-based large-scale photonic integrated circuits are becoming important, due to the need for higher complexity and lower cost for optical transmitters, receivers and optical buffers. In this paper, passive technologies for large-scale photonic integrated circuits are described, including polarization handling, light non-reciprocity and loss reduction. The design rule for polarization beam splitters based on asymmetrical directional couplers is summarized and several novel designs for ultra-short polarization beam splitters are reviewed. A novel concept for realizing a polarization splitter–rotator is presented with a very simple fabrication process. Realization of silicon-based light non-reciprocity devices (e.g., optical isolator, which is very important for transmitters to avoid sensitivity to reflections, is also demonstrated with the help of magneto-optical material by the bonding technology. Low-loss waveguides are another important technology for large-scale photonic integrated circuits. Ultra-low loss optical waveguides are achieved by designing a Si3N4 core with a very high aspect ratio. The loss is reduced further to <0.1 dB m−1 with an improved fabrication process incorporating a high-quality thermal oxide upper cladding by means of wafer bonding. With the developed ultra-low loss Si3N4 optical waveguides, some devices are also demonstrated, including ultra-high-Q ring resonators, low-loss arrayed-waveguide grating (demultiplexers, and high-extinction-ratio polarizers.
Vacuum die attach for integrated circuits
Schmitt, E.H.; Tuckerman, D.B.
1991-09-10
A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die, and an IR lamp or other heat source. For bonding a silicon die to a silicon substrate, a gold silicon alloy bond is used. Multiple dies can be bonded simultaneously. No scrubbing is required. 1 figure.
Integrated neuron circuit for implementing neuromorphic system with synaptic device
Lee, Jeong-Jun; Park, Jungjin; Kwon, Min-Woo; Hwang, Sungmin; Kim, Hyungjin; Park, Byung-Gook
2018-02-01
In this paper, we propose and fabricate Integrate & Fire neuron circuit for implementing neuromorphic system. Overall operation of the circuit is verified by measuring discrete devices and the output characteristics of the circuit. Since the neuron circuit shows asymmetric output characteristic that can drive synaptic device with Spike-Timing-Dependent-Plasticity (STDP) characteristic, the autonomous weight update process is also verified by connecting the synaptic device and the neuron circuit. The timing difference of the pre-neuron and the post-neuron induce autonomous weight change of the synaptic device. Unlike 2-terminal devices, which is frequently used to implement neuromorphic system, proposed scheme of the system enables autonomous weight update and simple configuration by using 4-terminal synapse device and appropriate neuron circuit. Weight update process in the multi-layer neuron-synapse connection ensures implementation of the hardware-based artificial intelligence, based on Spiking-Neural- Network (SNN).
Kuindersma, P.I.; Leijtens, X.J.M.; Zantvoort, van J.H.C.; Waardt, de H.
2012-01-01
We characterize integrated InP circuits for high speed ‘all-optical’ signal processing. Single chip circuits act as optical transistors. Transmodulation is performed by non-linear gain sections. Integrated tunable filters give signal equalization in time domain.
Energy Technology Data Exchange (ETDEWEB)
Katayose, Yusaku, E-mail: katayose@ynu.ac.jp [Department of Physics, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama, Kanagawa 240-8501 (Japan); Ikeda, Hirokazu [Institute of Space and Astronautical Science (ISAS)/Japan Aerospace Exploration Agency (JAXA), 3-1-1 Yoshinodai, Chuo-ku, Sagamihara, Kanagawa 252-5210 (Japan); Tanaka, Manobu [National Laboratory for High Energy Physics, KEK, 1-1 Oho, Tsukuba, Ibaraki 305-0801 (Japan); Shibata, Makio [Department of Physics, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama, Kanagawa 240-8501 (Japan)
2013-01-21
A front-end application specified integrated circuit (ASIC) is developed with a wide dynamic range amplifier (WDAMP) to read-out signals from a photo-sensor like a photodiode. The WDAMP ASIC consists of a charge sensitive preamplifier, four wave-shaping circuits with different amplification factors and Wilkinson-type analog-to-digital converter (ADC). To realize a wider range, the integrating capacitor in the preamplifier can be changed from 4 pF to 16 pF by a two-bit switch. The output of a preamplifier is shared by the four wave-shaping circuits with four gains of 1, 4, 16 and 64 to adapt the input range of ADC. A 0.25-μm CMOS process (of UMC electronics CO., LTD) is used to fabricate the ASIC with four-channels. The dynamic range of four orders of magnitude is achieved with the maximum range over 20 pC and the noise performance of 0.46 fC + 6.4×10{sup −4} fC/pF. -- Highlights: ► A front-end ASIC is developed with a wide dynamic range amplifier. ► The ASIC consists of a CSA, four wave-shaping circuits and pulse-height-to-time converters. ► The dynamic range of four orders of magnitude is achieved with the maximum range over 20 pC.
International Nuclear Information System (INIS)
Prunier, J.
1977-01-01
The first generations of circuits intended to equip the multiwire proportional chambers provided the user with logical type indications (absence or presence of a signal at a given place). This logical indication was soon associated with a semi-analog data (presence or absence of a signal above an analog threshold, i.e. the discrimination function) as with FILAS, RBA and RBB circuits. The evolution continued with the appearance of analog data capture (time, amplitude, charge) and the corresponding circuits: IFT circuits, analog-to-digital converters [fr
Nucleic acids for the rational design of reaction circuits.
Padirac, Adrien; Fujii, Teruo; Rondelez, Yannick
2013-08-01
Nucleic acid-based circuits are rationally designed in vitro assemblies that can perform complex preencoded programs. They can be used to mimic in silico computations. Recent works emphasized the modularity and robustness of these circuits, which allow their scaling-up. Another new development has led to dynamic, time-responsive systems that can display emergent behaviors like oscillations. These are closely related to biological architectures and provide an in vitro model of in vivo information processing. Nucleic acid circuits have already been used to handle various processes for technological or biotechnological purposes. Future applications of these chemical smart systems will benefit from the rapidly growing ability to design, construct, and model nucleic acid circuits of increasing size. Copyright © 2012 Elsevier Ltd. All rights reserved.
Statistical delay estimation in digital circuits using VHDL
Directory of Open Access Journals (Sweden)
Milić Miljana Lj.
2014-01-01
Full Text Available The most important feature of modern integrated circuit is the speed. It depends on circuit's delay. For the design of high-speed digital circuits, it is necessary to evaluate delays in the earliest stages of design, thus making it easy to modify and redesign a circuit if it's too slow. This paper gives an approach for efficient delay estimation in the describing phase of the circuit design. The method can statistically estimate the minimum and maximum delay of all possible paths and signal transitions in the circuit, considering the practical implementation of circuits, and information about the parameters' tolerances. The method uses a VHDL description and is verified on ISCAS85 benchmark circuits. Matlab was used for data processing.
Custom high-reliability radiation-hard CMOS-LSI circuit design
International Nuclear Information System (INIS)
Barnard, W.J.
1981-01-01
Sandia has developed a custom CMOS-LSI design capability to provide high reliability radiation-hardened circuits. This capability relies on (1) proven design practices to enhance reliability, (2) use of well characterized cells and logic modules, (3) computer-aided design tools to reduce design time and errors and to standardize design definition, and (4) close working relationships with the system designer and technology fabrication personnel. Trade-offs are made during the design between circuit complexity/performance and technology/producibility for high reliability and radiation-hardened designs to result. Sandia has developed and is maintaining a radiation-hardened bulk CMOS technology fabrication line for production of prototype and small production volume parts
Radiation sensitivity of integrated circuits Pt. 1
International Nuclear Information System (INIS)
Bereczkine Kerenyi, Ilona
1986-01-01
The cosmic ray sensitivity of CMOS integrated circuits are overviewed in three parts. The aim is to analyze the effects of ionizing radiation on the degradation of electronic parameters, the effects of the electric state during irradiation, and the radiation hardening of ICs. In this Part 1 a general introduction of the response of semiconductors to cosmic radiation is given, and the radiation tolerance and hardening of small-scale integrated CMOS ICs is analyzed in detail. The devices include various basic inverters and simple gate ICs. (R.P.)
Gigahertz flexible graphene transistors for microwave integrated circuits.
Yeh, Chao-Hui; Lain, Yi-Wei; Chiu, Yu-Chiao; Liao, Chen-Hung; Moyano, David Ricardo; Hsu, Shawn S H; Chiu, Po-Wen
2014-08-26
Flexible integrated circuits with complex functionalities are the missing link for the active development of wearable electronic devices. Here, we report a scalable approach to fabricate self-aligned graphene microwave transistors for the implementation of flexible low-noise amplifiers and frequency mixers, two fundamental building blocks of a wireless communication receiver. A devised AlOx T-gate structure is used to achieve an appreciable increase of device transconductance and a commensurate reduction of the associated parasitic resistance, thus yielding a remarkable extrinsic cutoff frequency of 32 GHz and a maximum oscillation frequency of 20 GHz; in both cases the operation frequency is an order of magnitude higher than previously reported. The two frequencies work at 22 and 13 GHz even when subjected to a strain of 2.5%. The gigahertz microwave integrated circuits demonstrated here pave the way for applications which require high flexibility and radio frequency operations.
Silicon wafers for integrated circuit process
Leroy , B.
1986-01-01
Silicon as a substrate material will continue to dominate the market of integrated circuits for many years. We first review how crystal pulling procedures impact the quality of silicon. We then investigate how thermal treatments affect the behaviour of oxygen and carbon, and how, as a result, the quality of silicon wafers evolves. Gettering techniques are then presented. We conclude by detailing the requirements that wafers must satisfy at the incoming inspection.
An optimum design of R-C oscillatory De-Qing circuit
International Nuclear Information System (INIS)
Cao Dezhang; Pan Linghe; Yang Tianlu
1990-01-01
An optimum design of R-C oscillatory De-Qing circuit has been developed for voltage regulation of the pulse modulator. When a new coefficient T 3 /T is introduced, the selection of De-Qing circuit parameters will become quite simple and the optimum parameters can be calculated directly. The De-Qing circuit parameters calculated will be effective in the whole range of the percentage regulation η from zero to maximum design value. The limit value of η is 0.36 or 0.29, theoretically, when the time constant of the De-Qing circuit is 3RC or 5RC respectively
Stochastic simulation and robust design optimization of integrated photonic filters
Directory of Open Access Journals (Sweden)
Weng Tsui-Wei
2016-07-01
Full Text Available Manufacturing variations are becoming an unavoidable issue in modern fabrication processes; therefore, it is crucial to be able to include stochastic uncertainties in the design phase. In this paper, integrated photonic coupled ring resonator filters are considered as an example of significant interest. The sparsity structure in photonic circuits is exploited to construct a sparse combined generalized polynomial chaos model, which is then used to analyze related statistics and perform robust design optimization. Simulation results show that the optimized circuits are more robust to fabrication process variations and achieve a reduction of 11%–35% in the mean square errors of the 3 dB bandwidth compared to unoptimized nominal designs.
OMEGAPIX 3D integrated circuit prototype dedicated to the ATLAS upgrade Super LHC pixel project
Thienpont, D; de La Taille, C; Seguin-Moreau, N; Martin-Chassard, G; Guo b, Y
2009-01-01
In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability.
2012-05-01
... INTERNATIONAL TRADE COMMISSION [Inv. No. 337-TA-840] Certain Semiconductor Integrated Circuit... States after importation of certain semiconductor integrated circuit devices and products containing same... No. 6,847,904 (``the '904 patent''). The complaint further alleges that an industry in the United...
4H-SiC JFET Multilayer Integrated Circuit Technologies Tested Up to 1000 K
Spry, D. J.; Neudeck, P. G.; Chen, L.; Chang, C. W.; Lukco, D.; Beheim, G. M.
2015-01-01
Testing of semiconductor electronics at temperatures above their designed operating envelope is recognized as vital to qualification and lifetime prediction of circuits. This work describes the high temperature electrical testing of prototype 4H silicon carbide (SiC) junction field effect transistor (JFET) integrated circuits (ICs) technology implemented with multilayer interconnects; these ICs are intended for prolonged operation at temperatures up to 773K (500 C). A 50 mm diameter sapphire wafer was used in place of the standard NASA packaging for this experiment. Testing was carried out between 300K (27 C) and 1150K (877 C) with successful electrical operation of all devices observed up to 1000K (727 C).
Control circuits in power electronics practical issues in design and implementation
Castilla, Miguel
2016-01-01
Control circuits are a key element in the operation and performance of power electronics converters. This book describes practical issues related to the design and implementation of these control circuits, and is divided into three parts - analogue control circuits, digital control circuits, and new trends in control circuits.
Parts & Pools: A Framework for Modular Design of Synthetic Gene Circuits
Energy Technology Data Exchange (ETDEWEB)
Marchisio, Mario Andrea, E-mail: marchisio@hit.edu.cn [School of Life Science and Technology, Harbin Institute of Technology, Harbin (China)
2014-10-06
Published in 2008, Parts & Pools represents one of the first attempts to conceptualize the modular design of bacterial synthetic gene circuits with Standard Biological Parts (DNA segments) and Pools of molecules referred to as common signal carriers (e.g., RNA polymerases and ribosomes). The original framework for modeling bacterial components and designing prokaryotic circuits evolved over the last years and brought, first, to the development of an algorithm for the automatic design of Boolean gene circuits. This is a remarkable achievement since gene digital circuits have a broad range of applications that goes from biosensors for health and environment care to computational devices. More recently, Parts & Pools was enabled to give a proper formal description of eukaryotic biological circuit components. This was possible by employing a rule-based modeling approach, a technique that permits a faithful calculation of all the species and reactions involved in complex systems such as eukaryotic cells and compartments. In this way, Parts & Pools is currently suitable for the visual and modular design of synthetic gene circuits in yeast and mammalian cells too.
Parts & Pools: A Framework for Modular Design of Synthetic Gene Circuits
International Nuclear Information System (INIS)
Marchisio, Mario Andrea
2014-01-01
Published in 2008, Parts & Pools represents one of the first attempts to conceptualize the modular design of bacterial synthetic gene circuits with Standard Biological Parts (DNA segments) and Pools of molecules referred to as common signal carriers (e.g., RNA polymerases and ribosomes). The original framework for modeling bacterial components and designing prokaryotic circuits evolved over the last years and brought, first, to the development of an algorithm for the automatic design of Boolean gene circuits. This is a remarkable achievement since gene digital circuits have a broad range of applications that goes from biosensors for health and environment care to computational devices. More recently, Parts & Pools was enabled to give a proper formal description of eukaryotic biological circuit components. This was possible by employing a rule-based modeling approach, a technique that permits a faithful calculation of all the species and reactions involved in complex systems such as eukaryotic cells and compartments. In this way, Parts & Pools is currently suitable for the visual and modular design of synthetic gene circuits in yeast and mammalian cells too.
Experimental Demonstration of 7 Tb/s Switching Using Novel Silicon Photonic Integrated Circuit
DEFF Research Database (Denmark)
Ding, Yunhong; Kamchevska, Valerija; Dalgaard, Kjeld
2016-01-01
We demonstrate BER performance <10^-9 for a 1 Tb/s/core transmission over 7-core fiber and SDM switching using a novel silicon photonic integrated circuit composed of a 7x7 fiber switch and low loss SDM couplers.......We demonstrate BER performance integrated circuit composed of a 7x7 fiber switch and low loss SDM couplers....
The ATPG Attack for Reverse Engineering of Combinational Hybrid Custom-Programmable Circuits
2017-03-23
Introduction The widely practiced horizontal integrated circuit supply chain exposes a design to various types of attacks including the reverse engineering ...STT_CMOS designs for reverse- engineering prevention, DAC 2016. [5] M. E. Massad and et. al. Integrated circuit (IC) decamouflaging: reverse...The ATPG Attack for Reverse Engineering of Combinational Hybrid Custom-Programmable Circuits Raza Shafiq Hamid Mahmoodi Houman Homayoun Hassan
Mixed-integrator-based bi-quad cell for designing a continuous time filter
International Nuclear Information System (INIS)
Chen Yong; Zhou Yumei
2010-01-01
A new mixed-integrator-based bi-quad cell is proposed. An alternative synthesis mechanism of complex poles is proposed compared with source-follower-based bi-quad cells which is designed applying the positive feedback technique. Using the negative feedback technique to combine different integrators, the proposed bi-quad cell synthesizes complex poles for designing a continuous time filter. It exhibits various advantages including compact topology, high gain, no parasitic pole, no CMFB circuit, and high capability. The fourth-order Butterworth lowpass filter using the proposed cells has been fabricated in 0.18 μm CMOS technology. The active area occupied by the filter with test buffer is only 200 x 170 μm 2 . The proposed filter consumes a low power of 201 μW and achieves a 68.5 dB dynamic range. (semiconductor integrated circuits)
Energy Technology Data Exchange (ETDEWEB)
Zhang, B
1999-07-01
This thesis deals with the design the development and the tests of an integrated circuit VLSI, supplying selective read and time measure for 16 channels. This circuit has been developed for a experiment of particles physics, BABAR, that will take place at SLAC (Stanford Linear Accelerator Center). A first part describes the physical stakes of the experiment, the electronic architecture and the place of the developed circuit in the research program. The second part presents the technical drawings of the circuit, the prototypes leading to the final design and the validity tests. (A.L.B.)
Kunath, R. R.; Bhasin, K. B.
1986-01-01
The desire for rapid beam reconfigurability and steering has led to the exploration of new techniques. Optical techniques have been suggested as potential candidates for implementing these needs. Candidates generally fall into one of two areas: those using fiber optic Beam Forming Networks (BFNs) and those using optically processed BFNs. Both techniques utilize GaAs Monolithic Microwave Integrated Circuits (MMICs) in the BFN, but the role of the MMIC for providing phase and amplitude variations is largely eliminated by some new optical processing techniques. This paper discusses these two types of optical BFN designs and provides conceptual designs of both systems.
Lithography for enabling advances in integrated circuits and devices.
Garner, C Michael
2012-08-28
Because the transistor was fabricated in volume, lithography has enabled the increase in density of devices and integrated circuits. With the invention of the integrated circuit, lithography enabled the integration of higher densities of field-effect transistors through evolutionary applications of optical lithography. In 1994, the semiconductor industry determined that continuing the increase in density transistors was increasingly difficult and required coordinated development of lithography and process capabilities. It established the US National Technology Roadmap for Semiconductors and this was expanded in 1999 to the International Technology Roadmap for Semiconductors to align multiple industries to provide the complex capabilities to continue increasing the density of integrated circuits to nanometre scales. Since the 1960s, lithography has become increasingly complex with the evolution from contact printers, to steppers, pattern reduction technology at i-line, 248 nm and 193 nm wavelengths, which required dramatic improvements of mask-making technology, photolithography printing and alignment capabilities and photoresist capabilities. At the same time, pattern transfer has evolved from wet etching of features, to plasma etch and more complex etching capabilities to fabricate features that are currently 32 nm in high-volume production. To continue increasing the density of devices and interconnects, new pattern transfer technologies will be needed with options for the future including extreme ultraviolet lithography, imprint technology and directed self-assembly. While complementary metal oxide semiconductors will continue to be extended for many years, these advanced pattern transfer technologies may enable development of novel memory and logic technologies based on different physical phenomena in the future to enhance and extend information processing.
Coplanar strips for Josephson voltage standard circuits
International Nuclear Information System (INIS)
Schubert, M.; May, T.; Wende, G.; Fritzsch, L.; Meyer, H.-G.
2001-01-01
We present a microwave circuit for Josephson voltage standards. Here, the Josephson junctions are integrated in a microwave transmission line designed as coplanar strips (CPS). The new layout offers the possibility of achieving a higher scale of integration and to considerably simplify the fabrication technology. The characteristic impedance of the CPS is about 50 Ω, and this should be of interest for programmable Josephson voltage standard circuits with SNS or SINIS junctions. To demonstrate the function of the microwave circuit design, conventional 10 V Josephson voltage standard circuits with 17000 Nb/AlO x /Nb junctions were prepared and tested. Stable Shapiro steps at the 10 V level were generated. Furthermore, arrays of 1400 SINIS junctions in this microwave layout exhibited first-order Shapiro steps. Copyright 2001 American Institute of Physics
International Nuclear Information System (INIS)
Yao, H; Liao, Y; Lingley, A R; Afanasiev, A; Lähdesmäki, I; Otis, B P; Parviz, B A
2012-01-01
We present an integrated functional contact lens, composed of a differential glucose sensor module, metal interconnects, sensor read-out circuit, antenna and telecommunication circuit, to monitor tear glucose levels wirelessly, continuously and non-invasively. The electrochemical differential sensor module is based on immobilization of activated and de-activated glucose oxidase. We characterized the sensor on a model polymer eye and determined that it showed good repeatability, molecular interference rejection and linearity in the range of 0–2 mM glucose, covering normal tear glucose concentrations (0.1–0.6 mM). We also report the temperature, ageing and protein-fouling sensitivity of the sensor. We report the design and implementation of a low-power (3 µW) sensor read-out and telecommunication circuit to deliver wireless power and transmit data for the sensor module. Using this small chip (0.36 mm 2 ), we produced an integrated contact lens with sensors and demonstrated wireless operation of the system and glucose read-out over the distance of several centimeters. (paper)
A Parallel Genetic Algorithm for Automated Electronic Circuit Design
Long, Jason D.; Colombano, Silvano P.; Haith, Gary L.; Stassinopoulos, Dimitris
2000-01-01
Parallelized versions of genetic algorithms (GAs) are popular primarily for three reasons: the GA is an inherently parallel algorithm, typical GA applications are very compute intensive, and powerful computing platforms, especially Beowulf-style computing clusters, are becoming more affordable and easier to implement. In addition, the low communication bandwidth required allows the use of inexpensive networking hardware such as standard office ethernet. In this paper we describe a parallel GA and its use in automated high-level circuit design. Genetic algorithms are a type of trial-and-error search technique that are guided by principles of Darwinian evolution. Just as the genetic material of two living organisms can intermix to produce offspring that are better adapted to their environment, GAs expose genetic material, frequently strings of 1s and Os, to the forces of artificial evolution: selection, mutation, recombination, etc. GAs start with a pool of randomly-generated candidate solutions which are then tested and scored with respect to their utility. Solutions are then bred by probabilistically selecting high quality parents and recombining their genetic representations to produce offspring solutions. Offspring are typically subjected to a small amount of random mutation. After a pool of offspring is produced, this process iterates until a satisfactory solution is found or an iteration limit is reached. Genetic algorithms have been applied to a wide variety of problems in many fields, including chemistry, biology, and many engineering disciplines. There are many styles of parallelism used in implementing parallel GAs. One such method is called the master-slave or processor farm approach. In this technique, slave nodes are used solely to compute fitness evaluations (the most time consuming part). The master processor collects fitness scores from the nodes and performs the genetic operators (selection, reproduction, variation, etc.). Because of dependency
Wafer-level testing and test during burn-in for integrated circuits
Bahukudumbi, Sudarshan
2010-01-01
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing.Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constrain
Relay Protection and Automation Systems Based on Programmable Logic Integrated Circuits
International Nuclear Information System (INIS)
Lashin, A. V.; Kozyrev, A. V.
2015-01-01
One of the most promising forms of developing the apparatus part of relay protection and automation devices is considered. The advantages of choosing programmable logic integrated circuits to obtain adaptive technological algorithms in power system protection and control systems are pointed out. The technical difficulties in the problems which today stand in the way of using relay protection and automation systems are indicated and a new technology for solving these problems is presented. Particular attention is devoted to the possibility of reconfiguring the logic of these devices, using programmable logic integrated circuits
International Nuclear Information System (INIS)
Liao, M-H
2013-01-01
Trench structure is designed and used to release process induced stress, resulting from the different material thermal expansion coefficients, in three-dimensional integral circuits (3DICs). The stress in the designed trench structure is measured by atomic force microscope Raman technique experimentally, and simulated by the full process simulation model. With the help of this simulation model, the optimized trench structure near the copper-filled TSV is designed and reported. The experimental data demonstrate that the tensile stress near the TSV can be reduced from 600 MPa to 150 MPa and the corresponding keep-out zone (KOZ) can also be decreased ∼4 times with the designed trench structure having a depth of 10 µm and spacing distance of 8 µm to the TSV. This work provides one potential solution to release process induced stress for real application of 3DICs. (paper)
Energy Technology Data Exchange (ETDEWEB)
Marchal, Xavier
1992-06-19
In order to use CAD efficiently in the analysis and design of electronic Integrated circuits, adequate modeling of active non-linear devices such as MOSFET transistors must be available to the designer. Many mathematical forms can be given to those models, such as explicit relations, or implicit equations to be solved. A major requirement in developing MOS transistor models for IC simulation is the availability of electrical characteristic curves over a wide range of channel width and length, including the sub-micrometer range. To account in a convenient way for bulk charge influence on I{sub DS} = f(V{sub DS}, V{sub GS}, v{sub BS}) device characteristics, all 3 standard SPICE MOS models use an empirical fitting parameter called the 'charge sharing factor'. Unfortunately, this formulation produces models which only describe correctly either some of the short channel phenomena, or some particular operating conditions (low injection, avalanche effect, etc.). We present here a cellular model (CDM = Charge Distributed Model) implemented in the open modular SPICE-PAC Simulator; this model is derived from the 4-terminal WANG charge controlled MOSFET model, using the charge sheet approximation. The CDM model describes device characteristics in ail operating regions without introducing drain current discontinuities and without requiring a 'charge sharing factor'. A usual problem to be faced by designers when they simulate MOS ICs is to find a reliable source of model parameters. Though most models have a physical basis, some of their parameters cannot be easily estimated from physical considerations. It can also happen that physically determined parameters values do not produce a good fit to measured device characteristics. Thus it is generally necessary to extract model parameters from measured transistor data, to ensure that model equations approximate measured curves accurately enough. Model parameters extraction can be done in 2 different ways, exposed in this thesis
Graphene-on-silicon hybrid plasmonic-photonic integrated circuits.
Xiao, Ting-Hui; Cheng, Zhenzhou; Goda, Keisuke
2017-06-16
Graphene surface plasmons (GSPs) have shown great potential in biochemical sensing, thermal imaging, and optoelectronics. To excite GSPs, several methods based on the near-field optical microscope and graphene nanostructures have been developed in the past few years. However, these methods suffer from their bulky setups and low GSP-excitation efficiency due to the short interaction length between free-space vertical excitation light and the atomic layer of graphene. Here we present a CMOS-compatible design of graphene-on-silicon hybrid plasmonic-photonic integrated circuits that achieve the in-plane excitation of GSP polaritons as well as localized surface plasmon (SP) resonance. By employing a suspended membrane slot waveguide, our design is able to excite GSP polaritons on a chip. Moreover, by utilizing a graphene nanoribbon array, we engineer the transmission spectrum of the waveguide by excitation of localized SP resonance. Our theoretical and computational study paves a new avenue to enable, modulate, and monitor GSPs on a chip, potentially applicable for the development of on-chip electro-optic devices.
PETRIC - A positron emission tomography readout integrated circuit
Energy Technology Data Exchange (ETDEWEB)
Pedrali-Noy, Marzio; Gruber, Gregory; Krieger, Bradley; Mandelli, Emmanuele; Meddeler, Gerrit; Moses, William; Rosso, Valeria
2000-11-05
We present architecture, critical design issues and performance measurements of PETRIC, a 64-channel mixed signal front-end integrated circuit (IC) for reading out a photodiode (PD) array coupled with LSO scintillator crystals for a medical imaging application (PET). Each channel consists of a low noise charge sensitive pre-amplifier (CSA), an RC-CR pulse shaper and a winner-take-all (WTA) multiplexer that selects the channel with the largest input signal. Triggered by an external timing signal, a switch opens and a capacitor stores the peak voltage of the winner channel. The shaper rise and fall times are adjustable by means of external current inputs over a continuous range of 0.7 (mu)s to 9 (mu)s. Power consumption is 5.4 mW per channel, measured Equivalent Noise Charge (ENC) at 1 (mu)s peaking time. Zero leakage current is 33 rms electrons plus 7.3 rms electrons per pF of input capacitance. Design is fabricated in 0.5 (mu)m 3.3V CMOS technology.
Boson sampling with integrated optical circuits
International Nuclear Information System (INIS)
Bentivegna, M.
2014-01-01
Simulating the evolution of non-interacting bosons through a linear transformation acting on the system’s Fock state is strongly believed to be hard for a classical computer. This is commonly known as the Boson Sampling problem, and has recently got attention as the first possible way to demonstrate the superior computational power of quantum devices over classical ones. In this paper we describe the quantum optics approach to this problem, highlighting the role of integrated optical circuits.
The single-event effect evaluation technology for nano integrated circuits
International Nuclear Information System (INIS)
Zheng Hongchao; Zhao Yuanfu; Yue Suge; Fan Long; Du Shougang; Chen Maoxin; Yu Chunqing
2015-01-01
Single-event effects of nano scale integrated circuits are investigated. Evaluation methods for single-event transients, single-event upsets, and single-event functional interrupts in nano circuits are summarized and classified in detail. The difficulties in SEE testing are discussed as well as the development direction of test technology, with emphasis placed on the experimental evaluation of a nano circuit under heavy ion, proton, and laser irradiation. The conclusions in this paper are based on many years of testing at accelerator facilities and our present understanding of the mechanisms for SEEs, which have been well verified experimentally. (paper)
Optoelectronic integrated circuits utilising vertical-cavity surface-emitting semiconductor lasers
International Nuclear Information System (INIS)
Zakharov, S D; Fyodorov, V B; Tsvetkov, V V
1999-01-01
Optoelectronic integrated circuits with additional optical inputs/outputs, in which vertical-cavity surface-emitting (VCSE) lasers perform the data transfer functions, are considered. The mutual relationship and the 'affinity' between optical means for data transfer and processing, on the one hand, and the traditional electronic component base, on the other, are demonstrated in the case of implementation of three-dimensional interconnects with a high transmission capacity. Attention is drawn to the problems encountered when semiconductor injection lasers are used in communication lines. It is shown what role can be played by VCSE lasers in solving these problems. A detailed analysis is made of the topics relating to possible structural and technological solutions in the fabrication of single lasers and of their arrays, and also of the problems hindering integrating of lasers into emitter arrays. Considerable attention is given to integrated circuits with optoelectronic smart pixels. Various technological methods for vertical integration of GaAs VCSE lasers with the silicon substrate of a microcircuit (chip) are discussed. (review)
On-chip enzymatic microbiofuel cell-powered integrated circuits.
Mark, Andrew G; Suraniti, Emmanuel; Roche, Jérôme; Richter, Harald; Kuhn, Alexander; Mano, Nicolas; Fischer, Peer
2017-05-16
A variety of diagnostic and therapeutic medical technologies rely on long term implantation of an electronic device to monitor or regulate a patient's condition. One proposed approach to powering these devices is to use a biofuel cell to convert the chemical energy from blood nutrients into electrical current to supply the electronics. We present here an enzymatic microbiofuel cell whose electrodes are directly integrated into a digital electronic circuit. Glucose oxidizing and oxygen reducing enzymes are immobilized on microelectrodes of an application specific integrated circuit (ASIC) using redox hydrogels to produce an enzymatic biofuel cell, capable of harvesting electrical power from just a single droplet of 5 mM glucose solution. Optimisation of the fuel cell voltage and power to match the requirements of the electronics allow self-powered operation of the on-board digital circuitry. This study represents a step towards implantable self-powered electronic devices that gather their energy from physiological fluids.
The design of a compact integral medium size PWR
International Nuclear Information System (INIS)
Shirvan, Koroush; Hejzlar, Pavel; Kazimi, Mujid S.
2012-01-01
Highlights: ► We model the IRIS reactor in RELAP5 and VIPRE codes. ► We use Printed Circuit Heat Exchangers and internally and externally cooled fuel pins in IRIS. ► We increase the IRIS power by 50% and demonstrate adequate safety performance. ► We show significant potential gain in economics for any integral PWR reactor design. - Abstract: Integral reactors have been proposed in recent years as a means to eliminate loss of coolant events, and reduce the number of large vessels of a nuclear power plant. In this paper the focus on how to further increase the power that can be derived from a given vessel volume. The example is applied to the International Reactor Innovative and Secure (IRIS), a medium size, light water reactor rated at 1000 MWt. The IRIS is an integral design containing all pumps and steam generators along with a traditional PWR core inside the reactor vessel. IRIS was designed with 8 Once-Through Helically Coiled Steam Generators (OTHSG), located above the core, in an annular region between the riser and the pressure vessel wall. This work examines ideas to increase its power output in the same vessel size while maintaining or improving the safety margins. The combination of Printed Circuit Heat Exchangers (PCHE) and Internally and EXternally cooled Annular Fuel (IXAF) is proposed to implement such improvement in otherwise the reference IRIS design. Safety implications of such steam generator and fuel design changes for the same reactor size are examined, under both steady state and transients, using the RELAP5 and VIPRE codes. It is found that the IRIS reactor power can be increased by 50% by using the PCHE and IXAF. The proposed design is found to be less expensive per unit electric power produced, these improvements and analyses can be applied to any integral reactor design.
In-situ fabrication of flexible vertically integrated electronic circuits by inkjet printing
International Nuclear Information System (INIS)
Wang Zhuo; Wu Wenwen; Yang Qunbao; Li Yongxiang; Noh, Chang-Ho
2009-01-01
In this paper, a facile approach for fabricating flexible vertically integrated electronic circuits is demonstrated. A desktop inkjet printer was modified and employed to print silver precursor on a polymer-coated buffer substrates. In-situ reaction was taken place and a conducting line was formed without need of a high temperature treatment. Through this process, several layers of metal integrated circuits were deposited sequentially with polymer buffer layers sandwiched between each layer. Hence, vertically integrated electronic components of diodes, solar cells, flexible flat panel displays, and electrochromic devices can be built with this simple and low-cost technique.
Generation of optical vortices in an integrated optical circuit
Tudor, Rebeca; Kusko, Mihai; Kusko, Cristian
2017-09-01
In this work, the generation of optical vortices in an optical integrated circuit is numerically demonstrated. The optical vortices with topological charge m = ±1 are obtained by the coherent superposition of the first order modes present in a waveguide with a rectangular cross section, where the phase delay between these two propagating modes is Δφ = ±π/2. The optical integrated circuit consists of an input waveguide continued with a y-splitter. The left and the right arms of the splitter form two coupling regions K1 and K2 with a multimode output waveguide. In each coupling region, the fundamental modes present in the arms of the splitter are selectively coupled into the output waveguide horizontal and vertical first order modes, respectively. We showed by employing the beam propagation method simulations that the fine tuning of the geometrical parameters of the optical circuit makes possible the generation of optical vortices in both transverse electric (TE) and transverse magnetic (TM) modes. Also, we demonstrated that by placing a thermo-optical element on one of the y-splitter arms, it is possible to switch the topological charge of the generated vortex from m = 1 to m = -1.
30 CFR 75.907 - Design of trailing cables for medium-voltage circuits.
2010-07-01
... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Design of trailing cables for medium-voltage... Medium-Voltage Alternating Current Circuits § 75.907 Design of trailing cables for medium-voltage circuits. [Statutory Provisions] Trailing cables for medium-voltage circuits shall include grounding...
Post-irradiation effects in CMOS integrated circuits
International Nuclear Information System (INIS)
Zietlow, T.C.; Barnes, C.E.; Morse, T.C.; Grusynski, J.S.; Nakamura, K.; Amram, A.; Wilson, K.T.
1988-01-01
The post-irradiation response of CMOS integrated circuits from three vendors has been measured as a function of temperature and irradiation bias. The author's have found that a worst-case anneal temperature for rebound testing is highly process dependent. At an anneal temperature of 80 0 C, the timing parameters of a 16K SRAM from vendor A quickly saturate at maximum values, and display no further changes at this temperature. At higher temperature, evidence for the anneal of interface state charge is observed. Dynamic bias during irradiation results in the same saturation value for the timing parameters, but the anneal time required to reach this value is longer. CMOS/SOS integrated circuits (vendor B) were also examined, and showed similar behavior, except that the saturation value for the timing parameters was stable up to 105 0 C. After irradiation to 10 Mrad(Si), a 16K SRAM (vendor C) was annealed at 80 0 C. In contrast to the results from the vendor A SRAM, the access time decreased toward prerad values during the anneal. Another part irradiated in the same manner but annealed at room temperature showed a slight increase during the anneal
Circuit Design of Surface Acoustic Wave Based Micro Force Sensor
Directory of Open Access Journals (Sweden)
Yuanyuan Li
2014-01-01
Full Text Available Pressure sensors are commonly used in industrial production and mechanical system. However, resistance strain, piezoresistive sensor, and ceramic capacitive pressure sensors possess limitations, especially in micro force measurement. A surface acoustic wave (SAW based micro force sensor is designed in this paper, which is based on the theories of wavelet transform, SAW detection, and pierce oscillator circuits. Using lithium niobate as the basal material, a mathematical model is established to analyze the frequency, and a peripheral circuit is designed to measure the micro force. The SAW based micro force sensor is tested to show the reasonable design of detection circuit and the stability of frequency and amplitude.
Universal discrete Fourier optics RF photonic integrated circuit architecture.
Hall, Trevor J; Hasan, Mehedi
2016-04-04
This paper describes a coherent electro-optic circuit architecture that generates a frequency comb consisting of N spatially separated orders using a generalised Mach-Zenhder interferometer (MZI) with its N × 1 combiner replaced by an optical N × N Discrete Fourier Transform (DFT). Advantage may be taken of the tight optical path-length control, component and circuit symmetries and emerging trimming algorithms offered by photonic integration in any platform that offers linear electro-optic phase modulation such as LiNbO3, silicon, III-V or hybrid technology. The circuit architecture subsumes all MZI-based RF photonic circuit architectures in the prior art given an appropriate choice of output port(s) and dimension N although the principal application envisaged is phase correlated subcarrier generation for all optical orthogonal frequency division multiplexing. A transfer matrix approach is used to model the operation of the architecture. The predictions of the model are validated by simulations performed using an industry standard software tool. Implementation is found to be practical.
Electronic circuit design with HEP computational tools
International Nuclear Information System (INIS)
Vaz, Mario
1996-01-01
CPSPICE is an electronic circuit statistical simulation program developed to run in a parallel environment under UNIX operating system and TCP/IP communications protocol, using CPS - Cooperative Processes Software , SPICE program and CERNLIB software package. It is part of a set of tools being develop, intended to help electronic engineers to design, model and simulate complex systems and circuits for High Energy Physics detectors, based on statistical methods, using the same software and methodology used by HEP physicists for data analysis. CPSPICE simulates electronic circuits by Monte Carlo method, through several different processes running simultaneously SPICE in UNIX parallel computers or workstation farms. Data transfer between CPS processes for a modified version of SPICE2G6 is done by RAM memory, but can also be done through hard disk files if no source files are available for the simulator, and for bigger simulation outputs files. Simulation results are written in a HBOOK file as a NTUPLE, to be examined by HBOOK in batch model or graphics, and analyzed by statistical procedures available. The HBOOK file be stored on hard disk for small amount of data, or into Exabyte tape file for large amount of data. HEP tools also helps circuit or component modeling, like MINUT program from CERNLIB, that implements Nelder and Mead Simplex and Gradient with or without derivatives algorithms, and can be used for design optimization.This paper presents CPSPICE program implementation. The scheme adopted is suitable to make parallel other electronic circuit simulators. (author)
RD53A Integrated Circuit Specifications
Garcia-Sciveres, Mauricio
2015-01-01
Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. The wafer scale production will permit the experiments to prototype bump bonding assembly with...
Integration of SPICE with TEK LV500 ASIC Design Verification System
Directory of Open Access Journals (Sweden)
A. Srivastava
1996-01-01
Full Text Available The present work involves integration of the simulation stage of design of a VLSI circuit and its testing stage. The SPICE simulator, TEK LV500 ASIC Design Verification System, and TekWaves, a test program generator for LV500, were integrated. A software interface in ‘C’ language in UNIX ‘solaris 1.x’ environment has been developed between SPICE and the testing tools (TekWAVES and LV500. The function of the software interface developed is multifold. It takes input from either SPICE2G.6 or SPICE 3e.1. The output generated by the interface software can be given as an input to either TekWAVES or LV500. A graphical user interface has also been developed with OPENWlNDOWS using Xview tool kit on SUN workstation. As an example, a two phase clock generator circuit has been considered and usefulness of the software demonstrated. The interface software could be easily linked with VLSI design such as MAGIC layout editor.
Evolvable designs of experiments applications for circuits
Iordache, Octavian
2009-01-01
Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.
Prediction of ionizing radiation effects in integrated circuits using black-box models
International Nuclear Information System (INIS)
Williamson, P.W.
1976-10-01
A method is described which allows general black-box modelling of integrated circuits as distinct from the existing method of deriving the radiation induced response of the model from actual terminal measurements on the device during irradiation. Both digital and linear circuits are discussed. (author)
Practical guide to organic field effect transistor circuit design
Sou, Antony
2016-01-01
The field of organic electronics spans a very wide range of disciplines from physics and chemistry to hardware and software engineering. This makes the field of organic circuit design a daunting prospect full of intimidating complexities, yet to be exploited to its true potential. Small focussed research groups also find it difficult to move beyond their usual boundaries and create systems-on-foil that are comparable with the established silicon world.This book has been written to address these issues, intended for two main audiences; firstly, physics or materials researchers who have thus far designed circuits using only basic drawing software; and secondly, experienced silicon CMOS VLSI design engineers who are already knowledgeable in the design of full custom transistor level circuits but are not familiar with organic devices or thin film transistor (TFT) devices.In guiding the reader through the disparate and broad subject matters, a concise text has been written covering the physics and chemistry of the...
Radiation response of high speed CMOS integrated circuits
International Nuclear Information System (INIS)
Yue, H.; Davison, D.; Jennings, R.F.; Lothongkam, P.; Rinerson, D.; Wyland, D.
1987-01-01
This paper studies the total dose and dose rate radiation response of the FCT family of high speed CMOS integrated circuits. Data taken on the devices is used to establish the dominant failure modes, and this data is further analyzed using one-sided tolerance factors for normal distribution statistical analysis
Servo Platform Circuit Design of Pendulous Gyroscope Based on DSP
Tan, Lilong; Wang, Pengcheng; Zhong, Qiyuan; Zhang, Cui; Liu, Yunfei
2018-03-01
In order to solve the problem when a certain type of pendulous gyroscope in the initial installation deviation more than 40 degrees, that the servo platform can not be up to the speed of the gyroscope in the rough north seeking phase. This paper takes the digital signal processor TMS320F28027 as the core, uses incremental digital PID algorithm, carries out the circuit design of the servo platform. Firstly, the hardware circuit is divided into three parts: DSP minimum system, motor driving circuit and signal processing circuit, then the mathematical model of incremental digital PID algorithm is established, based on the model, writes the PID control program in CCS3.3, finally, the servo motor tracking control experiment is carried out, it shows that the design can significantly improve the tracking ability of the servo platform, and the design has good engineering practice.
Economic testing of large integrated switching circuits - a challenge to the test engineer
International Nuclear Information System (INIS)
Kreinberg, W.
1978-01-01
With reference to large integrated switching circuits, one can use an incoming standard programme test or the customer's switching circuits. The author describes the development of suitable, extensive and economical test programmes. (orig.) [de
Micro-coolers fabricated as a component in an integrated circuit
International Nuclear Information System (INIS)
Glover, James; Oxley, Chris H; Khalid, Ata; Cumming, David; Stephen, Alex; Dunn, Geoff
2015-01-01
The packing density and power capacity of integrated electronics is increasing resulting in higher thermal flux densities. Improved thermal management techniques are required and one approach is to include thermoelectric coolers as part of the integrated circuit. An analysis will be described showing that the supporting substrate will have a large influence on the cooling capacity of the thermoelectric cooler. In particular, for materials with a low ZT figure of merit (for example gallium arsenide (GaAs) based compounds) the substrate will have to be substantially thinned to obtain cooling, which may preclude the use of thermoelectric coolers, for example, as part of a GaAs based integrated circuit. Further, using experimental techniques to measure only the small positive cooling temperature difference (ΔT) between the anode (T h ) and the cathode (T c ) contacts can be misinterpreted as cooling when in fact it is heating. (paper)
Designing neutral-atom nanotraps with integrated optical waveguides
International Nuclear Information System (INIS)
Burke, James P. Jr.; Chu, S.-T.; Bryant, Garnett W.; Williams, C.J.; Julienne, P.S.
2002-01-01
Integrated optical structures offer the intriguing potential of compact, reproducible waveguide arrays, rings, Y junctions, etc., that could be used to design evanescent field traps to transport, store, and interact atoms in networks as complicated as any integrated optical waveguide circuit. We theoretically investigate three approaches to trapping atoms above linear integrated optical waveguides. A two-color scheme balances the decaying evanescent fields of red- and blue-detuned light to produce a potential minimum above the guide. A one-color surface trap proposal uses blue-detuned light and the attractive surface interaction to provide a potential minimum. A third proposal uses blue-detuned light in two guides positioned above and below one another. The atoms are confined to the 'dark' spot in the vacuum gap between the guides. We find that all three approaches can be used to trap atoms in two or three dimensions with approximately 100 mW of laser power. We show that the dark spot guide is robust to light scatter and provides the most viable approach for constructing integrated optical circuits that could be used to transport and manipulate atoms in a controlled manner
[Design of blood-pressure parameter auto-acquisition circuit].
Chen, Y P; Zhang, D L; Bai, H W; Zhang, D A
2000-02-01
This paper presents the realization and design of a kind of blood-pressure parameter auto-acquisition circuit. The auto-acquisition of blood-pressure parameter controlled by 89C2051 single chip microcomputer is accomplished by collecting and processing the driving signal of LCD. The circuit that is successfully applied in the home unit of telemedicine system has the simple and reliable properties.
MIDAS: Automated Approach to Design Microwave Integrated Inductors and Transformers on Silicon
Directory of Open Access Journals (Sweden)
L. Aluigi
2013-09-01
Full Text Available The design of modern radiofrequency integrated circuits on silicon operating at microwave and millimeter-waves requires the integration of several spiral inductors and transformers that are not commonly available in the process design-kits of the technologies. In this work we present an auxiliary CAD tool for Microwave Inductor (and transformer Design Automation on Silicon (MIDAS that exploits commercial simulators and allows the implementation of an automatic design flow, including three-dimensional layout editing and electromagnetic simulations. In detail, MIDAS allows the designer to derive a preliminary sizing of the inductor (transformer on the bases of the design entries (specifications. It draws the inductor (transformer layers for the specific process design kit, including vias and underpasses, with or without patterned ground shield, and launches the electromagnetic simulations, achieving effective design automation with respect to the traditional design flow for RFICs. With the present software suite the complete design time is reduced significantly (typically 1 hour on a PC based on Intel® Pentium® Dual 1.80GHz CPU with 2-GB RAM. Afterwards both the device equivalent circuit and the layout are ready to be imported in the Cadence environment.
Design of An Energy Efficient Hydraulic Regenerative circuit
Ramesh, S.; Ashok, S. Denis; Nagaraj, Shanmukha; Adithyakumar, C. R.; Reddy, M. Lohith Kumar; Naulakha, Niranjan Kumar
2018-02-01
Increasing cost and power demand, leads to evaluation of new method to increase through productivity and help to solve the power demands. Many researchers have break through to increase the efficiency of a hydraulic power pack, one of the promising methods is the concept of regenerative. The objective of this research work is to increase the efficiency of a hydraulic circuit by introducing a concept of regenerative circuit. A Regenerative circuit is a system that is used to speed up the extension stroke of the double acting single rod hydraulic cylinder. The output is connected to the input in the directional control value. By this concept, increase in velocity of the piston and decrease the cycle time. For the research, a basic hydraulic circuit and a regenerative circuit are designated and compared both with their results. The analysis was based on their time taken for extension and retraction of the piston. From the detailed analysis of both the hydraulic circuits, it is found that the efficiency by introducing hydraulic regenerative circuit increased by is 5.3%. The obtained results conclude that, implementing hydraulic regenerative circuit in a hydraulic power pack decreases power consumption, reduces cycle time and increases productivity in a longer run.
Logistic Regression Modeling of Diminishing Manufacturing Sources for Integrated Circuits
National Research Council Canada - National Science Library
Gravier, Michael
1999-01-01
.... This thesis draws on available data from the electronics integrated circuit industry to attempt to assess whether statistical modeling offers a viable method for predicting the presence of DMSMS...
Experimental Study of WBFC method for testing electromagnetic immunity of integrated circuits
香川, 直己; カガワ, ナオキ; Naoki, KAGAWA
2004-01-01
The author made a workbench faraday cage, WBFC, in order to estimate performance of the WBFC method for the measurement of common mode noise immunity of integrated circuits. In this report, characteristics of the constructed workbench faraday cage and results of experimental study of effects of the common mode noise on a circuit board including an electronic device are shown. Selected DUT, LM324 is popular operational amplifier for electrical circuits in vehicles.
Organic membrane photonic integrated circuits (OMPICs).
Amemiya, Tomohiro; Kanazawa, Toru; Hiratani, Takuo; Inoue, Daisuke; Gu, Zhichen; Yamasaki, Satoshi; Urakami, Tatsuhiro; Arai, Shigehisa
2017-08-07
We propose the concept of organic membrane photonic integrated circuits (OMPICs), which incorporate various functions needed for optical signal processing into a flexible organic membrane. We describe the structure of several devices used within the proposed OMPICs (e.g., transmission lines, I/O couplers, phase shifters, photodetectors, modulators), and theoretically investigate their characteristics. We then present a method of fabricating the photonic devices monolithically in an organic membrane and demonstrate the operation of transmission lines and I/O couplers, the most basic elements of OMPICs.
Wireless neural recording with single low-power integrated circuit.
Harrison, Reid R; Kier, Ryan J; Chestek, Cynthia A; Gilja, Vikash; Nuyujukian, Paul; Ryu, Stephen; Greger, Bradley; Solzbacher, Florian; Shenoy, Krishna V
2009-08-01
We present benchtop and in vivo experimental results from an integrated circuit designed for wireless implantable neural recording applications. The chip, which was fabricated in a commercially available 0.6- mum 2P3M BiCMOS process, contains 100 amplifiers, a 10-bit analog-to-digital converter (ADC), 100 threshold-based spike detectors, and a 902-928 MHz frequency-shift-keying (FSK) transmitter. Neural signals from a selected amplifier are sampled by the ADC at 15.7 kSps and telemetered over the FSK wireless data link. Power, clock, and command signals are sent to the chip wirelessly over a 2.765-MHz inductive (coil-to-coil) link. The chip is capable of operating with only two off-chip components: a power/command receiving coil and a 100-nF capacitor.
Intelligent switches of integrated lightwave circuits with core telecommunication functions
Izhaky, Nahum; Duer, Reuven; Berns, Neil; Tal, Eran; Vinikman, Shirly; Schoenwald, Jeffrey S.; Shani, Yosi
2001-05-01
We present a brief overview of a promising switching technology based on Silica on Silicon thermo-optic integrated circuits. This is basically a 2D solid-state optical device capable of non-blocking switching operation. Except of its excellent performance (insertion lossvariable output power control (attenuation), for instance, to equalize signal levels and compensate for unbalanced different optical input powers, or to equalize unbalanced EDFA gain curve. We examine the market segments appropriate for the switch size and technology, followed by a discussion of the basic features of the technology. The discussion is focused on important requirements from the switch and the technology (e.g., insertion loss, power consumption, channel isolation, extinction ratio, switching time, and heat dissipation). The mechanical design is also considered. It must take into account integration of optical fiber, optical planar wafer, analog electronics and digital microprocessor controls, embedded software, and heating power dissipation. The Lynx Photon.8x8 switch is compared to competing technologies, in terms of typical market performance requirements.
Analog circuit design automation for performance
Ning, Zhen-Qiu; Ning, Zhen-Qiu; Kole, Marq; Kole, M.E.; Mouthaan, A.J.; Wallinga, Hans
1992-01-01
This paper describes an improved version of the program SEAS (a Simulated Evolution approach for Analog circuit Synthesis), in which an approach for selection of alternatives based on the evaluation of mutation values is developed, and design automafion for high performance comparators is covered.
Electromagnetic Compatibility Design of the Computer Circuits
Zitai, Hong
2018-02-01
Computers and the Internet have gradually penetrated into every aspect of people’s daily work. But with the improvement of electronic equipment as well as electrical system, the electromagnetic environment becomes much more complex. Electromagnetic interference has become an important factor to hinder the normal operation of electronic equipment. In order to analyse the computer circuit compatible with the electromagnetic compatibility, this paper starts from the computer electromagnetic and the conception of electromagnetic compatibility. And then, through the analysis of the main circuit and system of computer electromagnetic compatibility problems, we can design the computer circuits in term of electromagnetic compatibility. Finally, the basic contents and methods of EMC test are expounded in order to ensure the electromagnetic compatibility of equipment.
International Nuclear Information System (INIS)
Depari, Alessandro; Flammini, Alessandra; De Marcellis, Andrea; Ferri, Giuseppe
2011-01-01
This paper presents a new interface circuit (for MOX-based resistive chemical sensors) capable of overcoming the main limit of the circuits based on the resistance-to-time approach, i.e. the long measuring time with high-value resistances. The system is designed to operate with a single supply of 3.3 V, thus facilitating an ASIC implementation together with digital electronics for a first data analysis and transmission. This is particularly advantageous when the elaboration process requires a large computational load and a data pre-elaboration is advisable. Simulations of the integrable solution of the system have shown the feasibility of the proposed approach. A prototype with discrete components has been furthermore fabricated and experimentally tested, showing good performance in the range 0.5 MΩ to 10 GΩ with a maximum measuring time of 60 ms
Diamond electro-optomechanical resonators integrated in nanophotonic circuits
Energy Technology Data Exchange (ETDEWEB)
Rath, P.; Ummethala, S.; Pernice, W. H. P., E-mail: wolfram.pernice@kit.edu [Institute of Nanotechnology, Karlsruhe Institute of Technology, 76344 Eggenstein-Leopoldshafen (Germany); Diewald, S. [Center for Functional Nanostructures, Karlsruhe Institute of Technology, 76131 Karlsruhe (Germany); Lewes-Malandrakis, G.; Brink, D.; Heidrich, N.; Nebel, C. [Fraunhofer Institute for Applied Solid State Physics, Tullastr. 72, 79108 Freiburg (Germany)
2014-12-22
Diamond integrated photonic devices are promising candidates for emerging applications in nanophotonics and quantum optics. Here, we demonstrate active modulation of diamond nanophotonic circuits by exploiting mechanical degrees of freedom in free-standing diamond electro-optomechanical resonators. We obtain high quality factors up to 9600, allowing us to read out the driven nanomechanical response with integrated optical interferometers with high sensitivity. We are able to excite higher order mechanical modes up to 115 MHz and observe the nanomechanical response also under ambient conditions.
Design of pressure-driven microfluidic networks using electric circuit analogy.
Oh, Kwang W; Lee, Kangsun; Ahn, Byungwook; Furlani, Edward P
2012-02-07
This article reviews the application of electric circuit methods for the analysis of pressure-driven microfluidic networks with an emphasis on concentration- and flow-dependent systems. The application of circuit methods to microfluidics is based on the analogous behaviour of hydraulic and electric circuits with correlations of pressure to voltage, volumetric flow rate to current, and hydraulic to electric resistance. Circuit analysis enables rapid predictions of pressure-driven laminar flow in microchannels and is very useful for designing complex microfluidic networks in advance of fabrication. This article provides a comprehensive overview of the physics of pressure-driven laminar flow, the formal analogy between electric and hydraulic circuits, applications of circuit theory to microfluidic network-based devices, recent development and applications of concentration- and flow-dependent microfluidic networks, and promising future applications. The lab-on-a-chip (LOC) and microfluidics community will gain insightful ideas and practical design strategies for developing unique microfluidic network-based devices to address a broad range of biological, chemical, pharmaceutical, and other scientific and technical challenges.
A high speed, wide dynamic range digitizer circuit for photomultiplier tubes
International Nuclear Information System (INIS)
Yarema, R.J.; Foster, G.W.; Knickerbocker, K.; Sarraj, M.; Tschirhart, R.; Whitmore, J.; Zimmerman, T.; Lindgren, M.
1995-01-01
A circuit has been designed for digitizing PMT signals over a wide dynamic range (17-18 bits) with 8 bits of resolution at rates up to 53 MHz. Output from the circuit is in a floating point format with a 4 bit exponent and an 8 bit mantissa. The heart of the circuit is a full custom integrated circuit called the QIE (Charge Integrator and Encoder). The design of the QIE and associated circuitry reported here permits operation over a 17 bit dynamic range. Test results of a multirange device are presented for the first time. (orig.)
Mentzer, Mark A.
Recent advances in the theoretical and practical design and applications of optoelectronic devices and optical circuits are examined in reviews and reports. Topics discussed include system and market considerations, guided-wave phenomena, waveguide devices, processing technology, lithium niobate devices, and coupling problems. Consideration is given to testing and measurement, integrated optics for fiber-optic systems, optical interconnect technology, and optical computing.
Design of organic complementary circuits and systems on foil
Abdinia, Sahel; Cantatore, Eugenio
2015-01-01
This book describes new approaches to fabricate complementary organic electronics, and focuses on the design of circuits and practical systems created using these manufacturing approaches. The authors describe two state-of-the-art, complementary organic technologies, characteristics and modeling of their transistors and their capability to implement circuits and systems on foil. Readers will benefit from the valuable overview of the challenges and opportunities that these extremely innovative technologies provide. · Demonstrates first circuits implemented using specific complementary organic technologies, including first printed analog to digital converter, first dynamic logic on foil and largest complementary organic circuit · Includes step-by-step design from single transistor level to complete systems on foil · Provides a platform for comparing state-of-the-art complementary organic technologies and for comparing these with other similar technologies, spec...
Electrostatic Discharge Current Linear Approach and Circuit Design Method
Directory of Open Access Journals (Sweden)
Pavlos K. Katsivelis
2010-11-01
Full Text Available The Electrostatic Discharge phenomenon is a great threat to all electronic devices and ICs. An electric charge passing rapidly from a charged body to another can seriously harm the last one. However, there is a lack in a linear mathematical approach which will make it possible to design a circuit capable of producing such a sophisticated current waveform. The commonly accepted Electrostatic Discharge current waveform is the one set by the IEC 61000-4-2. However, the over-simplified circuit included in the same standard is incapable of producing such a waveform. Treating the Electrostatic Discharge current waveform of the IEC 61000-4-2 as reference, an approximation method, based on Prony’s method, is developed and applied in order to obtain a linear system’s response. Considering a known input, a method to design a circuit, able to generate this ESD current waveform in presented. The circuit synthesis assumes ideal active elements. A simulation is carried out using the PSpice software.
Study of the interaction between heavy ions and integrated circuits using a pulsed laser beam
International Nuclear Information System (INIS)
Lewis, D.; Fouillat, P.; Pouget, V.; Lapuyade, H.
2002-01-01
A new pulsed laser beam equipment dedicated to the characterization of integrated circuit is presented. Using ultra-short laser pulses is a convenient way to simulate experimentally the spatial environment of integrated circuits when interactions with heavy ions occur. This experimental set-up can be considered as a complementary tool for particle accelerators to evaluate the hardness assurance of integrated circuits for space applications. These particles generate temporally electrical disturbance called Single Event Effect (SEE). The theoretical approach of an equivalence between heavy ions and a laser pulses is discussed. The experimental set-up and some relevant operational methodologies are presented. Experimental results demonstrate that the induced electrical responses due to an heavy ion or a laser pulse are quite similar. Some sensitivity mappings of integrated circuits provided by this test bench illustrate the capabilities and the limitations of this laser-based technique. Contrary to the particle accelerators, it provides useful information concerning the spatial and temporal dependences of SEE mechanisms. (authors)
Directory of Open Access Journals (Sweden)
Chris R. Bowen
2011-05-01
Full Text Available The adaptation of standard integrated circuit (IC technology as a transducer in cell-based biosensors in drug discovery pharmacology, neural interface systems and electrophysiology requires electrodes that are electrochemically stable, biocompatible and affordable. Unfortunately, the ubiquitous Complementary Metal Oxide Semiconductor (CMOS IC technology does not meet the first of these requirements. For devices intended only for research, modification of CMOS by post-processing using cleanroom facilities has been achieved. However, to enable adoption of CMOS as a basis for commercial biosensors, the economies of scale of CMOS fabrication must be maintained by using only low-cost post-processing techniques. This review highlights the methodologies employed in cell-based biosensor design where CMOS-based integrated circuits (ICs form an integral part of the transducer system. Particular emphasis will be placed on the application of multi-electrode arrays for in vitro neuroscience applications. Identifying suitable IC packaging methods presents further significant challenges when considering specific applications. The various challenges and difficulties are reviewed and some potential solutions are presented.
Arun Kaintura; Tom Dhaene; Domenico Spina
2018-01-01
Advances in manufacturing process technology are key ensembles for the production of integrated circuits in the sub-micrometer region. It is of paramount importance to assess the effects of tolerances in the manufacturing process on the performance of modern integrated circuits. The polynomial chaos expansion has emerged as a suitable alternative to standard Monte Carlo-based methods that are accurate, but computationally cumbersome. This paper provides an overview of the most recent developm...
Testing Fixture For Microwave Integrated Circuits
Romanofsky, Robert; Shalkhauser, Kurt
1989-01-01
Testing fixture facilitates radio-frequency characterization of microwave and millimeter-wave integrated circuits. Includes base onto which two cosine-tapered ridge waveguide-to-microstrip transitions fastened. Length and profile of taper determined analytically to provide maximum bandwidth and minimum insertion loss. Each cosine taper provides transformation from high impedance of waveguide to characteristic impedance of microstrip. Used in conjunction with automatic network analyzer to provide user with deembedded scattering parameters of device under test. Operates from 26.5 to 40.0 GHz, but operation extends to much higher frequencies.
Insulator photocurrents: Application to dose rate hardening of CMOS/SOI integrated circuits
International Nuclear Information System (INIS)
Dupont-Nivet, E.; Coiec, Y.M.; Flament, O.; Tinel, F.
1998-01-01
Irradiation of insulators with a pulse of high energy x-rays can induce photocurrents in the interconnections of integrated circuits. The authors present, here, a new method to measure and analyze this effect together with a simple model. They also demonstrate that these insulator photocurrents have to be taken into account to obtain high levels of dose-rate hardness with CMOS on SOI integrated circuits, especially flip-flops or memory blocks of ASICs. They show that it explains some of the upsets observed in a SRAM embedded in an ASIC
Securing health sensing using integrated circuit metric.
Tahir, Ruhma; Tahir, Hasan; McDonald-Maier, Klaus
2015-10-20
Convergence of technologies from several domains of computing and healthcare have aided in the creation of devices that can help health professionals in monitoring their patients remotely. An increase in networked healthcare devices has resulted in incidents related to data theft, medical identity theft and insurance fraud. In this paper, we discuss the design and implementation of a secure lightweight wearable health sensing system. The proposed system is based on an emerging security technology called Integrated Circuit Metric (ICMetric) that extracts the inherent features of a device to generate a unique device identification. In this paper, we provide details of how the physical characteristics of a health sensor can be used for the generation of hardware "fingerprints". The obtained fingerprints are used to deliver security services like authentication, confidentiality, secure admission and symmetric key generation. The generated symmetric key is used to securely communicate the health records and data of the patient. Based on experimental results and the security analysis of the proposed scheme, it is apparent that the proposed system enables high levels of security for health monitoring in resource optimized manner.
The design of high performance weak current integrated amplifier
International Nuclear Information System (INIS)
Chen Guojie; Cao Hui
2005-01-01
A design method of high performance weak current integrated amplifier using ICL7650 operational amplifier is introduced. The operating principle of circuits and the step of improving amplifier's performance are illustrated. Finally, the experimental results are given. The amplifier has programmable measurement range of 10 -9 -10 -12 A, automatic zero-correction, accurate measurement, and good stability. (authors)
Development of high speed integrated circuit for very high resolution timing measurements
International Nuclear Information System (INIS)
Mester, Christian
2009-10-01
A multi-channel high-precision low-power time-to-digital converter application specific integrated circuit for high energy physics applications has been designed and implemented in a 130 nm CMOS process. To reach a target resolution of 24.4 ps, a novel delay element has been conceived. This nominal resolution has been experimentally verified with a prototype, with a minimum resolution of 19 ps. To further improve the resolution, a new interpolation scheme has been described. The ASIC has been designed to use a reference clock with the LHC bunch crossing frequency of 40 MHz and generate all required timing signals internally, to ease to use within the framework of an LHC upgrade. Special care has been taken to minimise the power consumption. (orig.)