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Sample records for improve current interconnect

  1. Electrode and interconnect for miniature fuel cells using direct methanol feed

    Science.gov (United States)

    Narayanan, Sekharipuram R. (Inventor); Valdez, Thomas I. (Inventor); Clara, Filiberto (Inventor)

    2004-01-01

    An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

  2. On the Distribution of Lightning Current among Interconnected Grounding Systems in Medium Voltage Grids

    Directory of Open Access Journals (Sweden)

    Guido Ala

    2018-03-01

    Full Text Available This paper presents the results of a first investigation on the effects of lightning stroke on medium voltage installations’ grounding systems, interconnected with the metal shields of the Medium Voltage (MV distribution grid cables or with bare buried copper ropes. The study enables us to evaluate the distribution of the lightning current among interconnected ground electrodes in order to estimate if the interconnection, usually created to reduce ground potential rise during a single-line-to-ground fault, can give place to dangerous situations far from the installation hit by the lightning stroke. Four different case studies of direct lightning stroke are presented and discussed: (1 two secondary substations interconnected by the cables’ shields; (2 two secondary substations interconnected by a bare buried conductor; (3 a high voltage/medium voltage station connected with a secondary substation by the medium voltage cables’ shields; (4 a high voltage/medium voltage station connected with a secondary substation by a bare buried conductor. The results of the simulations show that a higher peak-lowering action on the lighting-stroke current occurs due to the use of bare conductors as interconnection elements in comparison to the cables’ shields.

  3. Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current

    Science.gov (United States)

    Luo, X. M.; Zhang, B.; Zhang, G. P.

    2014-09-01

    Thermal fatigue failure of metallization interconnect lines subjected to alternating currents (AC) is becoming a severe threat to the long-term reliability of micro/nanodevices with increasing electrical current density/power. Here, thermal fatigue failure behaviors and damage mechanisms of nanocrystalline Au interconnect lines on the silicon glass substrate have been investigated by applying general alternating currents (the pure alternating current coupled with a direct current (DC) component) with different frequencies ranging from 0.05 Hz to 5 kHz. We observed both thermal fatigue damages caused by Joule heating-induced cyclic strain/stress and electromigration (EM) damages caused by the DC component. Besides, the damage formation showed a strong electrically-thermally-mechanically coupled effect and frequency dependence. At lower frequencies, thermal fatigue damages were dominant and the main damage forms were grain coarsening with grain boundary (GB) cracking/voiding and grain thinning. At higher frequencies, EM damages took over and the main damage forms were GB cracking/voiding of smaller grains and hillocks. Furthermore, the healing effect of the reversing current was considered to elucidate damage mechanisms of the nanocrystalline Au lines generated by the general AC. Lastly, a modified model was proposed to predict the lifetime of the nanocrystalline metal interconnect lines, i.e., that was a competing drift velocity-based approach based on the threshold time required for reverse diffusion/healing to occur.

  4. Electromigration kinetics and critical current of Pb-free interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Minhua; Rosenberg, Robert [IBM T. J. Watson Research Center, Yorktown Heights, New York 10598 (United States)

    2014-04-07

    Electromigration kinetics of Pb-free solder bump interconnects have been studied using a single bump parameter sweep technique. By removing bump to bump variations in structure, texture, and composition, the single bump sweep technique has provided both activation energy and power exponents that reflect atomic migration and interface reactions with fewer samples, shorter stress time, and better statistics than standard failure testing procedures. Contact metallurgies based on Cu and Ni have been studied. Critical current, which corresponds to the Blech limit, was found to exist in the Ni metallurgy, but not in the Cu metallurgy. A temperature dependence of critical current was also observed.

  5. Current Solutions: Recent Experience in Interconnecting Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Johnson, M.

    2003-09-01

    This report catalogues selected real-world technical experiences of utilities and customers that have interconnected distributed energy assets with the electric grid. This study was initiated to assess the actual technical practices for interconnecting distributed generation and had a particular focus on the technical issues covered under the Institute of Electrical and Electronics Engineers (IEEE) 1547(TM) Standard for Interconnecting Distributed Resources With Electric Power Systems.

  6. Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

    Science.gov (United States)

    Qu, Zilian; Meng, Yonggang; Zhao, Qian

    2015-03-01

    This paper proposes a new eddy current method, named equivalent unit method (EUM), for the thickness measurement of the top copper film of multilayer interconnects in the chemical mechanical polishing (CMP) process, which is an important step in the integrated circuit (IC) manufacturing. The influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent film thickness. By subtracting this equivalent film component, the accuracy of the thickness measurement of the top copper layer with an eddy current sensor is improved and the absolute error is 3 nm for sampler measurement.

  7. Si micro photonics for optical interconnection

    International Nuclear Information System (INIS)

    Wada, K.; Ahn, D.H.; Lim, D.R.; Michel, J.; Kimerling, L.C.

    2006-01-01

    This paper reviews current status of silicon microphotonics and the recent prototype of on-chip optical interconnection. Si microphotonics pursues complementary metal oxide semiconductor (CMOS)-compatibility of photonic devices to reduce the materials diversity eventually to integrate on Si chips. Fractal optical H-trees have been implemented on a chip and found to be a technology breakthrough beyond metal interconnection. It has shown that large RC time constants associated with metal can be eliminated at least long distant data communication on a chip, and eventually improve yield and power issues. This has become the world's first electronic and photonic integrated circuits (EPICs) and the possibility of at least 10 GHz clocking for personal computers has been demonstrated

  8. Analysis of the trade-offs between conventional and superconducting interconnections

    International Nuclear Information System (INIS)

    Frye, R.

    1989-01-01

    Superconductivity can now be achieved at temperatures compatible with semiconductor device operation. This raises the interesting possibility of using the new, high-temperature superconducting ceramics for interconnections in electronic systems. This paper examines some of the consequences of a resistance-free interconnection medium. A problem with conventional conductors in electronic systems is that the resistance of wires increases quadratically as the wire dimensions are scaled down. Below some minimum cross-sectional area, determined by the metal resistivity and wire length, the resistance in these lines begins to severely limit their bandwidth. Superconductors, on the other hand, are not constrained by the same scaling rules. They provide a high bandwidth interconnection at all sizes and lengths. The limitations for superconductors are set by their critical current densities. If line dimensions become too small, a superconductor will no longer support an adequate flow of current. An analysis is presented examining the performance trade-offs for conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. An important result of the analysis is that it determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. This identifies particular interconnection technologies for which high-temperature superconductors show the most promise

  9. Interconnections and market integration in the Irish Single Electricity Market

    International Nuclear Information System (INIS)

    Nepal, Rabindra; Jamasb, Tooraj

    2012-01-01

    Interconnections can be an effective way to increase competition and improve market integration in concentrated wholesale electricity markets with limited number of participants. This paper examines the potential for interconnections and increasing market integration in the Irish Single Electricity Market (SEM). We use a time-varying Kalman filter technique to assess the degree of market integration between SEM and other large, mature and interconnected wholesale electricity markets in Europe including Great Britain (GB). The results indicate no market integration between SEM and other European markets except for Elspot and GB. We show that the current state of market integration between SEM and GB is just 17% indicating potential to improve market integration via increased interconnector capacity. The results indicate that liquidity of wholesale markets might be a crucial factor in the market integration process while our results remain inconclusive in determining whether increased trade of renewables can improve market integration. - Highlights: ► We assess the degree of market integration between SEM and other EU electricity markets. ► Our results indicate no market integration between SEM and other European markets except for Elspot and GB. ► We show that the current state of market integration between SEM and GB is just 17%.

  10. Study of complete interconnect reliability for a GaAs MMIC power amplifier

    Science.gov (United States)

    Lin, Qian; Wu, Haifeng; Chen, Shan-ji; Jia, Guoqing; Jiang, Wei; Chen, Chao

    2018-05-01

    By combining the finite element analysis (FEA) and artificial neural network (ANN) technique, the complete prediction of interconnect reliability for a monolithic microwave integrated circuit (MMIC) power amplifier (PA) at the both of direct current (DC) and alternating current (AC) operation conditions is achieved effectively in this article. As a example, a MMIC PA is modelled to study the electromigration failure of interconnect. This is the first time to study the interconnect reliability for an MMIC PA at the conditions of DC and AC operation simultaneously. By training the data from FEA, a high accuracy ANN model for PA reliability is constructed. Then, basing on the reliability database which is obtained from the ANN model, it can give important guidance for improving the reliability design for IC.

  11. Value of Improved Wind Power Forecasting in the Western Interconnection (Poster)

    Energy Technology Data Exchange (ETDEWEB)

    Hodge, B.

    2013-12-01

    Wind power forecasting is a necessary and important technology for incorporating wind power into the unit commitment and dispatch process. It is expected to become increasingly important with higher renewable energy penetration rates and progress toward the smart grid. There is consensus that wind power forecasting can help utility operations with increasing wind power penetration; however, there is far from a consensus about the economic value of improved forecasts. This work explores the value of improved wind power forecasting in the Western Interconnection of the United States.

  12. Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

    International Nuclear Information System (INIS)

    Majumder, M.K.; Pandya, N.D.; Kaushik, B.K.; Manhas, S.K.

    2013-01-01

    Carbon nanotube (CN T) can be considered as an emerging interconnect material in current nano scale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

  13. Comprehensive evaluation of global energy interconnection development index

    Science.gov (United States)

    Liu, Lin; Zhang, Yi

    2018-04-01

    Under the background of building global energy interconnection and realizing green and low-carbon development, this article constructed the global energy interconnection development index system which based on the current situation of global energy interconnection development. Through using the entropy method for the weight analysis of global energy interconnection development index, and then using gray correlation method to analyze the selected countries, this article got the global energy interconnection development index ranking and level classification.

  14. Benefits of transmission interconnections

    International Nuclear Information System (INIS)

    Lyons, D.

    2006-01-01

    The benefits of new power transmission interconnections from Alberta were discussed with reference to the challenges and measures needed to move forward. Alberta's electricity system has had a long period of sustained growth in generation and demand and this trend is expected to continue. However, no new interconnections have been built since 1985 because the transmission network has not expanded in consequence with the growth in demand. As such, Alberta remains weakly interconnected with the rest of the western region. The benefits of stronger transmission interconnections include improved reliability, long-term generation capability, hydrothermal synergies, a more competitive market, system efficiencies and fuel diversity. It was noted that the more difficult challenges are not technical. Rather, the difficult challenges lie in finding an appropriate business model that recognizes different market structures. It was emphasized that additional interconnections are worthwhile and will require significant collaboration among market participants and governments. It was concluded that interties enable resource optimization between systems and their benefits far exceed their costs. tabs., figs

  15. 78 FR 73112 - Monitoring System Conditions-Transmission Operations Reliability Standards; Interconnection...

    Science.gov (United States)

    2013-12-05

    ...\\ \\8\\ Mandatory Reliability Standards for the Bulk-Power System, Order No. 693, 72 FR 16416 (Apr. 4... operators and reliability coordinators to ``plan and operate the interconnected Bulk Electric System in a... mandated in the currently- effective standards, thereby improving reliability of the bulk power system...

  16. IC layout adjustment method and tool for improving dielectric reliability at interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Kahng, Andrew B.; Chan, Tuck Boon

    2018-03-20

    Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges are to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.

  17. Integrated Optical Interconnect Architectures for Embedded Systems

    CERN Document Server

    Nicolescu, Gabriela

    2013-01-01

    This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

  18. Interconnecting heterogeneous database management systems

    Science.gov (United States)

    Gligor, V. D.; Luckenbaugh, G. L.

    1984-01-01

    It is pointed out that there is still a great need for the development of improved communication between remote, heterogeneous database management systems (DBMS). Problems regarding the effective communication between distributed DBMSs are primarily related to significant differences between local data managers, local data models and representations, and local transaction managers. A system of interconnected DBMSs which exhibit such differences is called a network of distributed, heterogeneous DBMSs. In order to achieve effective interconnection of remote, heterogeneous DBMSs, the users must have uniform, integrated access to the different DBMs. The present investigation is mainly concerned with an analysis of the existing approaches to interconnecting heterogeneous DBMSs, taking into account four experimental DBMS projects.

  19. MoS2/Ni3S4 composite nanosheets on interconnected carbon shells as an excellent supercapacitor electrode architecture for long term cycling at high current densities

    Science.gov (United States)

    Qin, Shengchun; Yao, Tinghui; Guo, Xin; Chen, Qiang; Liu, Dequan; Liu, Qiming; Li, Yali; Li, Junshuai; He, Deyan

    2018-05-01

    In this paper, we report an electrode architecture of molybdenum disulfide (MoS2)/nickel sulfide (Ni3S4) composite nanosheets anchored on interconnected carbon (C) shells (C@MoS2/Ni3S4). Electrochemical measurements indicate that the C@MoS2/Ni3S4 structure possesses excellent supercapacitive properties especially for long term cycling at high current densities. A specific capacitance as high as ∼640.7 F g-1 can still be delivered even after 10,000 cycles at a high current density of 20 A g-1. From comparison of microstructures and electrochemical properties of the related materials/structures, the improved performance of C@MoS2/Ni3S4 can be attributed to the relatively dispersedly distributed nanosheet-shaped MoS2/Ni3S4 that provides efficient contact with electrolyte and effectively buffers the volume change during charge/discharge processes, enhanced cycling stability by MoS2, and reduced equivalent series resistance by the interconnected C shells.

  20. The Interconnections of the LHC Cryomagnets

    CERN Document Server

    Jacquemod, A; Skoczen, Blazej; Tock, J P

    2001-01-01

    The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

  1. Carbon nanotubes for interconnects process, design and applications

    CERN Document Server

    Dijon, Jean; Maffucci, Antonio

    2017-01-01

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

  2. At the speed of light? electricity interconnections for Europe

    International Nuclear Information System (INIS)

    Nies, S.

    2010-01-01

    Electricity moves almost at the speed of light: 273,000 km per second. The speed of electricity makes it the ultimate 'just in time' commodity. A problem anywhere can be transmitted every where in a nanosecond. Electricity interconnection is a prominent issue in the news, sometimes even featured as a panacea for the shortcomings of the European electricity market - a panacea that will ensure security o supply, solidarity and pave the way for a promising use of renewables in the future. The present study is devoted to electricity interconnections in Europe, their current state and the projects concerning them. The study addresses the following questions: - What is the role of interconnections in the development of a sustainable grid that can emerge from the existing pieces, make optimum use of existing generation capacity, ensure energy security, and offer economies of scales? What is their role in the process of building a different energy concept, one that would be concerned with climate change and thus in favour of the use of renewables? - How are existing interconnections exploited and governed, and how can their exploitation be improved? Does the EU need more and new interconnections; and if so, where and why, and who is going to finance them? Prominent projects as such as Desertec, the debate on DC or AC lines, or the limits of synchronization, as well as the state of a potential East-West electricity linkage between Former Soviet Union and EU, termed UCTE-UPS/IPS, are discussed in the volume. Part I develops definitions and basic notions necessary for the understanding of the subject. It also addresses the independent variables that influence interconnections (here the dependent variable), and recounts the historical legacies and their enduring impact on today's grid. Part II is devoted to the EU legal framework and to the complex landscape of governance and its current state of transition. Part III addresses the management of existing interconnections and

  3. Chip-Level Electromigration Reliability for Cu Interconnects

    International Nuclear Information System (INIS)

    Gall, M.; Oh, C.; Grinshpon, A.; Zolotov, V.; Panda, R.; Demircan, E.; Mueller, J.; Justison, P.; Ramakrishna, K.; Thrasher, S.; Hernandez, R.; Herrick, M.; Fox, R.; Boeck, B.; Kawasaki, H.; Haznedar, H.; Ku, P.

    2004-01-01

    Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability concerns for most advanced process technologies. Ever increasing operating current densities and the introduction of low-k materials in the backend process scheme are some of the issues that threaten reliable, long-term operation at elevated temperatures. The traditional method of verifying EM reliability only through current density limit checks is proving to be inadequate in general, or quite expensive at the best. A Statistical EM Budgeting (SEB) methodology has been proposed to assess more realistic chip-level EM reliability from the complex statistical distribution of currents in a chip. To be valuable, this approach requires accurate estimation of currents for all interconnect segments in a chip. However, no efficient technique to manage the complexity of such a task for very large chip designs is known. We present an efficient method to estimate currents exhaustively for all interconnects in a chip. The proposed method uses pre-characterization of cells and macros, and steps to identify and filter out symmetrically bi-directional interconnects. We illustrate the strength of the proposed approach using a high-performance microprocessor design for embedded applications as a case study

  4. MATL : Canada's first merchant power transmission interconnection : experiences and future outlook

    International Nuclear Information System (INIS)

    Wilson, L.

    2006-01-01

    The current status of the Montana Alberta Tie Ltd. (MATL) merchant transmission project was outlined with reference to the business concept, the advantages of the project and market opportunities. Some of the challenges facing the project were discussed along with lessons learned and accomplishments thus far. MATL is preparing to construct a privately funded transmission line between Lethbridge, Alberta and Great Falls, Montana. The project represents the first direct power transmission inter-connection between Montana and Alberta. The 346 km, 230 kV AC transmission line with phase shifting transformer and 300 MW transfer capacity will be a synchronous interconnection and will improve the reliability of the entire electric systems in both Montana and Alberta. The benefits of the interconnected power system include increased reliability and stability of the existing power grids; better import/export capabilities; more competition and options in the marketplace; greater flexibility in scheduling generator maintenance; and, optimal allocation of generation resources. tabs., figs

  5. Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Kao, Li-Chi; Hsu, Li-Hsuan; Brahma, Sanjaya; Huang, Bo-Chia; Liu, Chun-Chu; Lo, Kuang-Yao, E-mail: kuanglo@mail.ncku.edu.tw

    2016-12-01

    Highlights: • Actual Cu interconnect experiences many times of annealing and then cause the stress. • Stack Cu grains with varying grain size successively to enhance packed density. • XRD and PBR analyze the residual stress of local and average area of plated Cu film. • High packed Cu grain with stable stress proved by texture of Cu(1 1 1) and Cu(2 0 0). - Abstract: In this work, we programmed the plating current to stack the different size of copper (Cu) grain and analyzed the relation between the sequence of different Cu grain size and the stability of the residual stress. The residual stress was measured with varying times of annealing process in order to reach the purpose of simulating the actual Cu interconnect process. We found that varied plating strategy will make different stabilization condition of residual stress through the proof of X-ray diffraction (XRD) and optical parallel beams reflection (PBR) method. The accumulation of Cu grains, formed by Cu grain with successive variation in grain size, would enhance the packing density better than only single grain size in the finite space. The high density of the grain boundary in the electroplated Cu film will be eliminated through annealing process and it will help to suppress the void formation in further interconnect process. The electroplated Cu film with the plating current of saw tooth wave can soon reach a stable tensile stress through annealing since the Cu grains with high packing density will be quickly eliminated to approach the minimum of the strain energy which reflects to variation in the texture of Cu (2 0 0). The result of this work illustrates the importance of how to stack different size of Cu grain, for achieving a densely packed Cu film which close to the Cu bulk.

  6. Crosstalk in modern on-chip interconnects a FDTD approach

    CERN Document Server

    Kaushik, B K; Patnaik, Amalendu

    2016-01-01

    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  7. Financial viability of the Sonora-Baja California interconnection line

    International Nuclear Information System (INIS)

    Alonso, G.; Ortega, G.

    2017-09-01

    In the Development Program of the National Electricity Sector 2015-2029, an electric interconnection line between Sonora and Baja California (Mexico) is proposed, this study analyzes the financial viability of this interconnection line based on the maximum hourly and seasonal energy demand between both regions and proposes alternatives for the supply of electric power that supports the economic convenience of this interconnection line. The results show that additional capacity is required in Sonora to cover the maximum demands of both regions since in the current condition of the National Electric System the interconnection line is not justified. (Author)

  8. Carbon nanotube based VLSI interconnects analysis and design

    CERN Document Server

    Kaushik, Brajesh Kumar

    2015-01-01

    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

  9. New technology for improved utilization of the interconnected power system; Ny teknologi for bedre utnyttelse av overfoerings-systemet

    Energy Technology Data Exchange (ETDEWEB)

    Enger, A.K.

    1996-12-31

    The present paper deals with methods used for improving the utilization of interconnected power systems. The author discusses new technologies for improvement and safety of power transmission. Main themes covered in this paper are HVDC (High Voltage DC) systems in Norway, possibilities of load management control, other possible/necessary measures in the grid system, and the development and trends. 21 figs.

  10. Free-Space Optical Interconnect Employing VCSEL Diodes

    Science.gov (United States)

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

    2009-01-01

    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  11. Interconnection Guidelines

    Science.gov (United States)

    The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

  12. Adapting Memory Hierarchies for Emerging Datacenter Interconnects

    Institute of Scientific and Technical Information of China (English)

    江涛; 董建波; 侯锐; 柴琳; 张立新; 孙凝晖; 田斌

    2015-01-01

    Efficient resource utilization requires that emerging datacenter interconnects support both high performance communication and efficient remote resource sharing. These goals require that the network be more tightly coupled with the CPU chips. Designing a new interconnection technology thus requires considering not only the interconnection itself, but also the design of the processors that will rely on it. In this paper, we study memory hierarchy implications for the design of high-speed datacenter interconnects—particularly as they affect remote memory access—and we use PCIe as the vehicle for our investigations. To that end, we build three complementary platforms: a PCIe-interconnected prototype server with which we measure and analyze current bottlenecks; a software simulator that lets us model microarchitectural and cache hierarchy changes;and an FPGA prototype system with a streamlined switchless customized protocol Thunder with which we study hardware optimizations outside the processor. We highlight several architectural modifications to better support remote memory access and communication, and quantify their impact and limitations.

  13. Transurban interconnectivities

    DEFF Research Database (Denmark)

    Jørgensen, Claus Møller

    2012-01-01

    This essay discusses the interpretation of the revolutionary situations of 1848 in light of recent debates on interconnectivity in history. The concept of transurban interconnectivities is proposed as the most precise concept to capture the nature of interconnectivity in 1848. It is argued....... It is argued that circulating political communication accounts for similarities with respect to political agenda, organisational form and political repertoire evident in urban settings across Europe. This argument is supported by a series of examples of local organisation and local appropriations of liberalism...

  14. Generation adequacy and transmission interconnection in regional electricity markets

    International Nuclear Information System (INIS)

    Cepeda, Mauricio; Saguan, Marcelo; Finon, Dominique; Pignon, Virginie

    2009-01-01

    The power system capacity adequacy has public good features that cannot be entirely solved by electricity markets. Regulatory intervention is then necessary and established methods have been used to assess adequacy and help regulators to fix this market failure. In regional electricity markets, transmission interconnections play an important role in contributing to adequacy. However, the adequacy problem and related policy are typically considered at a national level. This paper presents a simple model to study how the interconnection capacity interacts with generation adequacy. First results indicate that increasing interconnection capacity between systems improves adequacy up to a certain level; further increases do not procure additional adequacy improvements. Furthermore, besides adequacy improvement, increasing transmission capacity under asymmetric adequacy criteria or national system characteristics could create several concerns about externalities. These results imply that regional coordination of national adequacy policies is essential to internalise adequacy of cross-border effects.

  15. Optical interconnects

    CERN Document Server

    Chen, Ray T

    2006-01-01

    This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

  16. Alternative materials for solid oxide fuel cells: Factors affecting air-sintering of chromite interconnections

    International Nuclear Information System (INIS)

    Chick, L.A.; Bates, J.L.

    1992-01-01

    The purpose of this research is to develop alternative materials for solid oxide fuel cell (SOFC) interconnections and electrodes with improved electrical, thermal and electrochemical properties. Another objective is to develop synthesis and fabrication processes for these materials whereby they can be consolidated in air into SOFC's. The approach is to (1) develop modifications of the current, state-of-the-art materials used in SOFC's, (2) minimize the number of cations used in the SOFC materials to reduce potential deleterious interactions, (3) improve thermal, electrical, and electrochemical properties, (4) develop methods to synthesize both state-of-the-art and alternative materials for the simultaneous fabrication and consolidation in air of the interconnections and electrodes with the solid electrolyte, and (5) understand electrochemical reactions at materials interfaces and the effects of component compositions and processing on those reactions

  17. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    International Nuclear Information System (INIS)

    Sabourin, D; Snakenborg, D; Dufva, M

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications

  18. Cross-border effects of capacity mechanisms in interconnected power systems

    NARCIS (Netherlands)

    Bhagwat, P.C.; Richstein, J.C.; Chappin, E.J.L.; Iychettira, K.K.; de Vries, L.J.

    2017-01-01

    The cross-border effects of a capacity market and a strategic reserve in interconnected electricity markets are modeled using an agent-based modeling methodology. Both capacity mechanisms improve the security of supply and reduce consumer costs. Our results indicate that interconnections do not

  19. The Enhanced Segment Interconnect for FASTBUS data communications

    International Nuclear Information System (INIS)

    Machen, D.R.; Downing, R.W.; Kirsten, F.A.; Nelson, R.O.

    1987-01-01

    The Enhanced Segment Interconnect concept (ESI) for improved FASTBUS data communications is a development supported by the U.S. Department of Energy under the Small Business Innovation Research (SBIR) program. The ESI will contain both the Segment Interconnect (SI) Tyhpe S-1 and an optional buffered interconnect for store-and-forward data communications; fiber-optic-coupled serial ports will provide optional data paths. The ESI can be applied in large FASTBUS-implemented physics experiments whose data-set or data-transmission distance requirements dictate alternate approaches to data communications. This paper describes the functions of the ESI and the status of its development, now 25% complete

  20. Electro-optic techniques for VLSI interconnect

    Science.gov (United States)

    Neff, J. A.

    1985-03-01

    A major limitation to achieving significant speed increases in very large scale integration (VLSI) lies in the metallic interconnects. They are costly not only from the charge transport standpoint but also from capacitive loading effects. The Defense Advanced Research Projects Agency, in pursuit of the fifth generation supercomputer, is investigating alternatives to the VLSI metallic interconnects, especially the use of optical techniques to transport the information either inter or intrachip. As the on chip performance of VLSI continues to improve via the scale down of the logic elements, the problems associated with transferring data off and onto the chip become more severe. The use of optical carriers to transfer the information within the computer is very appealing from several viewpoints. Besides the potential for gigabit propagation rates, the conversion from electronics to optics conveniently provides a decoupling of the various circuits from one another. Significant gains will also be realized in reducing cross talk between the metallic routings, and the interconnects need no longer be constrained to the plane of a thin film on the VLSI chip. In addition, optics can offer an increased programming flexibility for restructuring the interconnect network.

  1. Next generation space interconnect research and development in space communications

    Science.gov (United States)

    Collier, Charles Patrick

    2017-11-01

    Interconnect or "bus" is one of the critical technologies in design of spacecraft avionics systems that dictates its architecture and complexity. MIL-STD-1553B has long been used as the avionics backbone technology. As avionics systems become more and more capable and complex, however, limitations of MIL-STD-1553B such as insufficient 1 Mbps bandwidth and separability have forced current avionics architects and designers to use combination of different interconnect technologies in order to meet various requirements: CompactPCI is used for backplane interconnect; LVDS or RS422 is used for low and high-speed direct point-to-point interconnect; and some proprietary interconnect standards are designed for custom interfaces. This results in a very complicated system that consumes significant spacecraft mass and power and requires extensive resources in design, integration and testing of spacecraft systems.

  2. Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects

    Science.gov (United States)

    Park, Young-Joon; Andleigh, Vaibhav K.; Thompson, Carl V.

    1999-04-01

    An electromigration model is developed to simulate the reliability of Al and Al-Cu interconnects. A polynomial expression for the free energy of solution by Murray [Int. Met. Rev. 30, 211 (1985)] was used to calculate the chemical potential for Al and Cu while the diffusivities were defined based on a Cu-trapping model by Rosenberg [J. Vac. Sci. Technol. 9, 263 (1972)]. The effects of Cu on stress evolution and lifetime were investigated in all-bamboo and near-bamboo stud-to-stud structures. In addition, the significance of the effect of mechanical stress on the diffusivity of both Al and Cu was determined in all-bamboo and near-bamboo lines. The void nucleation and growth process was simulated in 200 μm, stud-to-stud lines. Current density scaling behavior for void-nucleation-limited failure and void-growth-limited failure modes was simulated in long, stud-to-stud lines. Current density exponents of both n=2 for void nucleation and n=1 for void growth failure modes were found in both pure Al and Al-Cu lines. Limitations of the most widely used current density scaling law (Black's equation) in the analysis of the reliability of stud-to-stud lines are discussed. By modifying the input materials properties used in this model (when they are known), this model can be adapted to predict the reliability of other interconnect materials such as pure Cu and Cu alloys.

  3. The effect of long-distance interconnection on wind power variability

    International Nuclear Information System (INIS)

    Fertig, Emily; Apt, Jay; Jaramillo, Paulina; Katzenstein, Warren

    2012-01-01

    We use time- and frequency-domain techniques to quantify the extent to which long-distance interconnection of wind plants in the United States would reduce the variability of wind power output. Previous work has shown that interconnection of just a few wind plants across moderate distances could greatly reduce the ratio of fast- to slow-ramping generators in the balancing portfolio. We find that interconnection of aggregate regional wind plants would not reduce this ratio further but would reduce variability at all frequencies examined. Further, interconnection of just a few wind plants reduces the average hourly change in power output, but interconnection across regions provides little further reduction. Interconnection also reduces the magnitude of low-probability step changes and doubles firm power output (capacity available at least 92% of the time) compared with a single region. First-order analysis indicates that balancing wind and providing firm power with local natural gas turbines would be more cost-effective than with transmission interconnection. For net load, increased wind capacity would require more balancing resources but in the same proportions by frequency as currently, justifying the practice of treating wind as negative load. (letter)

  4. Investigation of performance degradation of SOFC using chromium-containing alloy interconnects

    DEFF Research Database (Denmark)

    Beeaff, D.R.; Dinesen, A.; Hendriksen, Peter Vang

    2007-01-01

    The long-term aging of a stack element (fuel cell, current collectors, and interconnect materials) was studied. A pair of tests were made in which one sample contained an interconnect, a high-temperature stainless steel (Crofer 22 APU), treated with an LSMC coating applied to the cathode-side int...

  5. Photovoltaic sub-cell interconnects

    Energy Technology Data Exchange (ETDEWEB)

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

    2017-05-09

    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  6. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Science.gov (United States)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    1984-01-01

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  7. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Science.gov (United States)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  8. Interconnected α-Fe2O3 nanosheet arrays as high-performance anode materials for lithium-ion batteries

    International Nuclear Information System (INIS)

    Cai, Dandan; Li, Dongdong; Ding, Liang-Xin; Wang, Suqing; Wang, Haihui

    2016-01-01

    The electrode materials with structure stability and binder-free are urgently required for improving the electrochemical performance of lithium-ion batteries. In this work, interconnected α-Fe 2 O 3 nanosheet arrays directly grown on Ti foil were fabricated via a facile galvanostatic electrodeposition method followed by thermal treatment. The as-prepared α-Fe 2 O 3 has an open network structure constituted of interconnected nanosheets and can be directly used as integrated electrodes for lithium-ion batteries. The α-Fe 2 O 3 nanosheet arrays exhibit a high reversible capacity of 986.3 mAh g −1 at a current density of 100 mA g −1 . Moreover, a reversible capacity of ca. 425.9 mAh g −1 is achieved even at a superhigh current density of 10 A g −1 , which is higher than the theoretical capacity of commercially used graphite. The excellent performance could be attributed to the efficient electron transport, the large electrode/electrolyte interfaces and the good accommodations for volume expansion from the interconnected nanosheet arrays structure.

  9. SDN Data Center Performance Evaluation of Torus and Hypercube Interconnecting Schemes

    DEFF Research Database (Denmark)

    Andrus, Bogdan-Mihai; Vegas Olmos, Juan José; Mehmeri, Victor

    2015-01-01

    — By measuring throughput, delay, loss-rate and jitter, we present how SDN framework yields a 45% performance increase in highly interconnected topologies like torus and hypercube compared to current Layer2 switching technologies, applied to data center architectures......— By measuring throughput, delay, loss-rate and jitter, we present how SDN framework yields a 45% performance increase in highly interconnected topologies like torus and hypercube compared to current Layer2 switching technologies, applied to data center architectures...

  10. Visualizing interconnections among climate risks

    Science.gov (United States)

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.

    2015-12-01

    therefore imperative to improve our understanding on how climate change may induce a chain of impacts. Our study is a first step toward this goal by mapping out climate risks and their cause-effect relationships based on current literature.

  11. Interconnecting Carbon Fibers with the In-situ Electrochemically Exfoliated Graphene as Advanced Binder-free Electrode Materials for Flexible Supercapacitor.

    Science.gov (United States)

    Zou, Yuqin; Wang, Shuangyin

    2015-07-07

    Flexible energy storage devices are highly demanded for various applications. Carbon cloth (CC) woven by carbon fibers (CFs) is typically used as electrode or current collector for flexible devices. The low surface area of CC and the presence of big gaps (ca. micro-size) between individual CFs lead to poor performance. Herein, we interconnect individual CFs through the in-situ exfoliated graphene with high surface area by the electrochemical intercalation method. The interconnected CFs are used as both current collector and electrode materials for flexible supercapacitors, in which the in-situ exfoliated graphene act as active materials and conductive "binders". The in-situ electrochemical intercalation technique ensures the low contact resistance between electrode (graphene) and current collector (carbon cloth) with enhanced conductivity. The as-prepared electrode materials show significantly improved performance for flexible supercapacitors.

  12. Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Martin

    2010-01-01

    We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

  13. Study on application of a high-speed trigger-type SFCL (TSFCL) for interconnection of power systems with different reliabilities

    International Nuclear Information System (INIS)

    Kim, Hye Ji; Yoon, Yong Tae

    2016-01-01

    Highlights: • Application of TSFCL to interconnect systems with different reliabilities is proposed. • TSFCL protects a grid by preventing detrimental effects from being delivered through the interconnection line. • A high-speed TSFCL with high impedance for transmission systems is required to be developed. - Abstract: Interconnection of power systems is one effective way to improve power supply reliability. However, differences in the reliability of each power system create a greater obstacle for the stable interconnection of power systems, as after interconnection a high-reliability system is affected by frequent faults in low reliability side systems. Several power system interconnection methods, such as the back-to-back method and the installation of either transformers or series reactors, have been investigated to counteract the damage caused by faults in the other neighboring systems. However, these methods are uneconomical and require complex operational management plans. In this work, a high-speed trigger-type superconducting fault current limiter (TSFCL) with large-impedance is proposed as a solution to maintain reliability and power quality when a high reliability power system is interconnected with a low reliability power system. Through analysis of the reliability index for the numerical examples obtained from a PSCAD/EMTDC simulator, a high-speed TSFCL with a large-impedance is confirmed to be effective for the interconnection between power systems with different reliabilities.

  14. Vertically aligned multiwalled carbon nanotubes as electronic interconnects

    Science.gov (United States)

    Gopee, Vimal Chandra

    The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace copper. Carbon nanotubes have been studied as a suitable replacement for copper due to its superior electrical, thermal and mechanical properties. One of the advantages of using carbon nanotubes is their high current carrying capacity which has been demonstrated to be three orders of magnitude greater than that of copper. Most approaches in the implementation of carbon nanotubes have so far focused on the growth in vias which limits their application. In this work, a process is described for the transfer of carbon nanotubes to substrates allowing their use for more varied applications. Arrays of vertically aligned multiwalled carbon nanotubes were synthesised by photo-thermal chemical vapour deposition with high growth rates. Raman spectroscopy was used to show that the synthesised carbon nanotubes were of high quality. The carbon nanotubes were exposed to an oxygen plasma and the nature of the functional groups present was determined using X-ray photoelectron spectroscopy. Functional groups, such as carboxyl, carbonyl and hydroxyl groups, were found to be present on the surface of the multiwalled carbon nanotubes after the functionalisation process. The multiwalled carbon nanotubes were metallised after the functionalisation process using magnetron sputtering. Two materials, solder and sintered silver, were chosen to bind carbon nanotubes to substrates so as to enable their transfer and also to make electrical contact. The wettability of solder to carbon nanotubes was investigated and it was demonstrated that both functionalisation and metallisation were required in order for solder to bond with the carbon nanotubes. Similarly, functionalisation followed by metallisation

  15. Roll and pitch independently tuned interconnected suspension: modelling and dynamic analysis

    Science.gov (United States)

    Xu, Guangzhong; Zhang, Nong; Roser, Holger M.

    2015-12-01

    In this paper, a roll and pitch independently tuned hydraulically interconnected passive suspension is presented. Due to decoupling of vibration modes and the improved lateral and longitudinal stability, the stiffness of individual suspension spring can be reduced for improving ride comfort and road grip. A generalised 14 degree-of-freedom nonlinear vehicle model with anti-roll bars is established to investigate the vehicle ride and handling dynamic responses. The nonlinear fluidic model of the hydraulically interconnected suspension is developed and integrated with the full vehicle model to investigate the anti-roll and anti-pitch characteristics. Time domain analysis of the vehicle model with the proposed suspension is conducted under different road excitations and steering/braking manoeuvres. The dynamic responses are compared with conventional suspensions to demonstrate the potential of enhanced ride and handling performance. The results illustrate the model-decoupling property of the hydraulically interconnected system. The anti-roll and anti-pitch performance could be tuned independently by the interconnected systems. With the improved anti-roll and anti-pitch characteristics, the bounce stiffness and ride damping can be optimised for better ride comfort and tyre grip.

  16. Interconnection policy: a theoretical survey

    Directory of Open Access Journals (Sweden)

    César Mattos

    2003-01-01

    Full Text Available This article surveys the theoretical foundations of interconnection policy. The requirement of an interconnection policy should not be taken for granted in all circumstances, even considering the issue of network externalities. On the other hand, when it is required, an encompassing interconnection policy is usually justified. We provide an overview of the theory on interconnection pricing that results in several different prescriptions depending on which problem the regulator aims to address. We also present a survey on the literature on two-way interconnection.

  17. Nanophotonic Devices for Optical Interconnect

    DEFF Research Database (Denmark)

    Van Thourhout, D.; Spuesens, T.; Selvaraja, S.K.

    2010-01-01

    We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity...... of the passive routing circuits and their thermal tuning. Finally, we discuss the performance of a wavelength selective detector....

  18. Enhancing Ecoefficiency in Shrimp Farming through Interconnected Ponds

    Directory of Open Access Journals (Sweden)

    Ramón Héctor Barraza-Guardado

    2015-01-01

    Full Text Available The future development of shrimp farming needs to improve its ecoefficiency. The purpose of this study was to evaluate water quality, flows, and nitrogen balance and production parameters on a farm with interconnected pond design to improve the efficiency of the semi-intensive culture of Litopenaeus vannamei ponds. The study was conducted in 21 commercial culture ponds during 180 days at densities of 30–35 ind m−2 and daily water exchange <2%. Our study provides evidence that by interconnecting ponds nutrient recycling is favored by promoting the growth of primary producers of the pond as chlorophyll a. Based on the mass balance and flow of nutrients this culture system reduces the flow of solid, particulate organic matter, and nitrogen compounds to the environment and significantly increases the efficiency of water (5 to 6.5 m3 kg−1 cycle−1, when compared with traditional culture systems. With this culture system it is possible to recover up to 34% of the total nitrogen entering the system, with production in excess of 4,000 kg ha−1 shrimp. We believe that the production system with interconnected ponds is a technically feasible model to improve ecoefficiency production of shrimp farming.

  19. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observ...

  20. An RLC interconnect analyzable crosstalk model considering self-heating effect

    International Nuclear Information System (INIS)

    Zhu Zhang-Ming; Liu Shu-Bin

    2012-01-01

    According to the thermal profile of actual multilevel interconnects, in this paper we propose a temperature distribution model of multilevel interconnects and derive an analytical crosstalk model for the distributed resistance—inductance—capacitance (RLC) interconnect considering effect of thermal profile. According to the 65-nm complementary metal—oxide semiconductor (CMOS) process, we compare the proposed RLC analytical crosstalk model with the Hspice simulation results for different interconnect coupling conditions and the absolute error is within 6.5%. The computed results of the proposed analytical crosstalk model show that RCL crosstalk decreases with the increase of current density and increases with the increase of insulator thickness. This analytical crosstalk model can be applied to the electronic design automation (EDA) and the design optimization for nanometer CMOS integrated circuits. (interdisciplinary physics and related areas of science and technology)

  1. EUROPEAN ENERGY INTERCONNECTION EFFECTS ON THE ROMANIAN ECONOMY

    Directory of Open Access Journals (Sweden)

    Ionescu Mihaela

    2014-07-01

    Full Text Available In this paper the author wants to exemplify the extent to which economic growth in Romania is influenced by the current power system infrastructure investments in Europe. Electricity transmission infrastructure in Romania is at a turning point. The high level of security of supply, delivery efficiency in a competitive internal market are dependent on significant investment, both within the country and across borders. Since the economic crisis makes investment financing is increasingly difficult, it is necessary that they be targeted as well. The European Union has initiated the “Connecting Europe” through which investments are allocated to European energy network interconnection of energy. The action plan for this strategy will put a greater emphasis on investments that require hundreds of billions of euro in new technologies, infrastructure, improve energy intensity, low carbon energy technologies. Romania's energy challenge will depend on the new interconnection modern and smart, both within the country and other European countries, energy saving practices and technologies. This challenge is particularly important as Romania has recovered severe gaps in the level of economic performance compared to developed countries. Such investment will have a significant impact on transmission costs, especially electricity, while network tariffs will rise slightly. Some costs will be higher due to support programs in renewable energy nationwide.Measures are more economically sustainable to maintain or even reinforce the electricity market, which system can be flexible in order to address any issues of adequacy. These measures include investments in border infrastructure (the higher the network, so it is easier to evenly distribute energy from renewable sources, to measure demand response and energy storage solutions.An integrated European infrastructure will ensure economic growth in countries interconnected and thus Romania. Huge energy potential of

  2. Asymmetric ZnO panel-like hierarchical architectures with highly interconnected pathways for free-electron transport and photovoltaic improvements.

    Science.gov (United States)

    Shi, Yantao; Zhu, Chao; Wang, Lin; Li, Wei; Fung, Kwok Kwong; Wang, Ning

    2013-01-02

    Through a rapid and template-free precipitation approach, we synthesized an asymmetric panel-like ZnO hierarchical architecture (PHA) for photoanodes of dye-sensitized solar cells (DSCs). The two sides of the PHA are constructed differently using densely interconnected, mono-crystalline and ultrathin ZnO nanosheets. By mixing these PHAs with ZnO nanoparticles (NPs), we developed an effective and feasible strategy to improve the electrical transport and photovoltaic performance of the composite photoanodes of DSCs. The highly crystallized and interconnected ZnO nanosheets largely minimized the total grain boundaries within the composite photoanodes and thus served as direct pathways for the transport and effective collection of free electrons. Through low-temperature (200 °C) annealing, these novel composite photoanodes achieved high conversion efficiencies of up to 5.59% for ZnO-based quasi-solid DSCs. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  3. Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology

    Science.gov (United States)

    Li, Yong-Jun; Sun, Qing-Qing; Chen, Lin; Zhou, Peng; Wang, Peng-Fei; Ding, Shi-Jin; Zhang, David Wei

    2012-03-01

    We proposed intercalation of hexagonal boron nitride (hBN) in multilayer graphene to improve its performance in ultra-scaled interconnects for integrated circuit. The effect of intercalated hBN layer in bilayer graphene is investigated using non-equilibrium Green's functions. We find the hBN intercalated bilayer graphene exhibit enhanced transport properties compared with pristine bilayer ones, and the improvement is attributed to suppression of interlayer scattering and good planar bonding condition of inbetween hBN layer. Based on these results, we proposed a via structure that not only benefits from suppressed interlayer scattering between multilayer graphene, but also sustains the unique electrical properties of graphene when many graphene layers are stacking together. The ideal current density across the structure can be as high as 4.6×109 A/cm2 at 1V, which is very promising for the future high-performance interconnect.

  4. Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology

    Directory of Open Access Journals (Sweden)

    Yong-Jun Li

    2012-03-01

    Full Text Available We proposed intercalation of hexagonal boron nitride (hBN in multilayer graphene to improve its performance in ultra-scaled interconnects for integrated circuit. The effect of intercalated hBN layer in bilayer graphene is investigated using non-equilibrium Green's functions. We find the hBN intercalated bilayer graphene exhibit enhanced transport properties compared with pristine bilayer ones, and the improvement is attributed to suppression of interlayer scattering and good planar bonding condition of inbetween hBN layer. Based on these results, we proposed a via structure that not only benefits from suppressed interlayer scattering between multilayer graphene, but also sustains the unique electrical properties of graphene when many graphene layers are stacking together. The ideal current density across the structure can be as high as 4.6×109 A/cm2 at 1V, which is very promising for the future high-performance interconnect.

  5. Report on electricity interconnection management and use. June 2008

    International Nuclear Information System (INIS)

    2008-06-01

    Apart from some concrete advances in interconnection management, the most striking event of 2007 has to be the emergence of a consensus at European level on the general principles of the target mechanisms for interconnection management. Three major projects currently undergoing development by the TSOs and the exchanges - the setting up of a single auction platform for allocating long- and medium-term products and of 'flow-based' market coupling in the Central-West region (Belgium, Luxemburg, the Netherlands, Germany, France), and in the France-UK-Ireland region, the introduction of reciprocal balancing exchanges on the France-England interconnection - should lay the foundations for the future management of congestion on interconnections in Europe. The completion of these projects, planned for the end of 2008 for the single auction platform project in the Central-West region and for mid-2009 for the other two, will be an important turning point in the construction of the European electricity market. This will be one of the successes of the Regional Initiatives process launched by ERGEG just over two years ago. However, this should not hide the fact that the regulators have experienced many difficulties during the regional integration of the markets and that the market operators have the general impression that this process could progress much more quickly. These difficulties and this relative slowness are mainly explained by: - a lack of consensus on the target market design the national markets would gradually tend towards, - a lack of harmonisation of the powers and competencies of the regulators when it comes to cross-border trades, the immediate consequence of which is a lack of incentives for TSOs to accelerate market integration. Several sizeable challenges await all the stakeholders over the coming months and years if market integration is to be a success: - How can the 'third legislative package' give all the necessary competencies

  6. Multilevel Dual Damascene copper interconnections

    Science.gov (United States)

    Lakshminarayanan, S.

    Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400o

  7. Net Metering and Interconnection Procedures-- Incorporating Best Practices

    Energy Technology Data Exchange (ETDEWEB)

    Jason Keyes, Kevin Fox, Joseph Wiedman, Staff at North Carolina Solar Center

    2009-04-01

    State utility commissions and utilities themselves are actively developing and revising their procedures for the interconnection and net metering of distributed generation. However, the procedures most often used by regulators and utilities as models have not been updated in the past three years, in which time most of the distributed solar facilities in the United States have been installed. In that period, the Interstate Renewable Energy Council (IREC) has been a participant in more than thirty state utility commission rulemakings regarding interconnection and net metering of distributed generation. With the knowledge gained from this experience, IREC has updated its model procedures to incorporate current best practices. This paper presents the most significant changes made to IREC’s model interconnection and net metering procedures.

  8. Interconnected networks

    CERN Document Server

    2016-01-01

    This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

  9. Interconnection of Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-04-19

    This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

  10. A metallic buried interconnect process for through-wafer interconnection

    International Nuclear Information System (INIS)

    Ji, Chang-Hyeon; Herrault, Florian; Allen, Mark G

    2008-01-01

    In this paper, we present the design, fabrication process and experimental results of electroplated metal interconnects buried at the bottom of deep silicon trenches with vertical sidewalls. A manual spray-coating process along with a unique trench-formation process has been developed for the electroplating of a metal interconnection structure at the bottom surface of the deep trenches. The silicon etch process combines the isotropic dry etch process and conventional Bosch process to fabricate a deep trench with angled top-side edges and vertical sidewalls. The resulting trench structure, in contrast to the trenches fabricated by wet anisotropic etching, enables spray-coated photoresist patterning with good sidewall and top-side edge coverage while maintaining the ability to form a high-density array of deep trenches without excessive widening of the trench opening. A photoresist spray-coating process was developed and optimized for the formation of electroplating mold at the bottom of 300 µm deep trenches having vertical sidewalls. A diluted positive tone photoresist with relatively high solid content and multiple coating with baking between coating steps has been experimentally proven to provide high quality sidewall and edge coverage. To validate the buried interconnect approach, a three-dimensional daisy chain structure having a buried interconnect as the bottom connector and traces on the wafer surface as the top conductor has been designed and fabricated

  11. Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

    Science.gov (United States)

    Aggarwal, Ankur

    developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

  12. Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

    DEFF Research Database (Denmark)

    Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver

    2008-01-01

    A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment. Integrated fluidic interconnections appear to be a good solution for interconn...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

  13. New organization scheme for the energy supply in the not interconnected zones of Colombia

    International Nuclear Information System (INIS)

    Zapata, Josue; Bayona Lugdy

    2001-01-01

    The paper shows a new scheme of solutions in the financial institutional environment and regulatory, in this sense it thinks about the creation from a support unit to the rural energy administration that takes charge of to identify energy solutions and the technical and organizational support of the service of a foundation that manage the obtained resources and a interconnected scheme to the current conditions of the NIZ. In Colombia the not interconnected zones NIZ corresponds those of the country that don't receive electric power service through the national interconnected system, and who interconnection is not economically feasible

  14. In-memory interconnect protocol configuration registers

    Energy Technology Data Exchange (ETDEWEB)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  15. In-memory interconnect protocol configuration registers

    Science.gov (United States)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  16. Embroidered Copper Microwire Current Collector for Improved Cycling Performance of Silicon Anodes in Lithium-Ion Batteries.

    Science.gov (United States)

    Breitung, Ben; Aguiló-Aguayo, Noemí; Bechtold, Thomas; Hahn, Horst; Janek, Jürgen; Brezesinski, Torsten

    2017-10-12

    Si holds great promise as an alloying anode material for Li-ion batteries with improved energy density because of its high theoretical specific capacity and favorable operation voltage range. However, the large volume expansion of Si during electrochemical reaction with Li and the associated adverse effects strongly limit its prospect for application. Here, we report on the use of three-dimensional instead of flat current collectors for high-capacity Si anodes in an attempt to mitigate the loss of electrical contact of active electrode regions as a result of structural disintegration with cycling. The current collectors were produced by technical embroidery and consist of interconnected Cu wires of diameter <150 µm. In comparison to Si/Li cells using a conventional Cu foil current collector, the embroidered microwire network-based cells show much enhanced capacity and reversibility due to a higher degree of tolerance to cycling.

  17. Energy conservation through the implementation of cogeneration and grid interconnection

    International Nuclear Information System (INIS)

    Dashash, M. A.

    2007-01-01

    With increasing awareness of energy conservation and environmental protection, the Arab World is moving to further improve energy conversion efficiency. The equivalent of over 2.7 MM bbl is being daily burnt to fuel the thermal power plants that represent 92% of the total Arab power generation. This adds up to close to one billion barrels annually. At a conservative 30$ per barrel, this represents a daily cost of over $81 Million. This paper will introduce two strategies with the ultimate objective to cut-off up to half of the current fuel consumption. Firstly, Cogeneration Technology is able to improve thermal efficiency from the current average of less than 25% to up to 80%. Just 1% improvement in power plant thermal efficiency represents 3 million $/day in fuel cost savings. In addition, a well-designed and operated cogeneration plant will: - Reduce unfriendly emissions by burning less fuel as a result of higher thermal efficiency, - Increase the decentralization of electrical generation, - Improve the reliability of electricity supply. As an example, the Kingdom of Saudi Arabia's experience of implementing cogeneration will be presented, in particular within its hydrocarbon facilities and desalination plants. This will include the existing facilities and the planned and on-going projects. Secondly, by interconnecting the power networks of all the adjacent Arab countries, the following benefits could be reached: - Reduce generation reserves and enhance the system reliability, - Improve the economic efficiency of the electricity power systems, - Provide power exchange and strengthen the supply reliability, - Adopt technological development and use the best modern technologies. At least two factors plead for this direction. On one hand, the four-hour time zone difference from Eastern to Western Arab World makes it easy to exchange power. On the other hand, this will help to reduce the reserve capacity and save on corresponding Capital investment, fuel, and O and M

  18. Knowledge Access in Rural Inter-connected Areas Network ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... and indigenous knowledge using information and communication technologies (ICTs) ... for research proposals on the aforementioned topics, action-research projects, ... Evaluating knowledge-sharing methods to improve land utilization and ...

  19. Policy issues in interconnecting networks

    Science.gov (United States)

    Leiner, Barry M.

    1989-01-01

    To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

  20. Interconnecting PV on New York City's Secondary Network Distribution System

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, K; Coddington, M; Burman, K; Hayter, S; Kroposki, B; Watson, and A

    2009-11-01

    The U.S. Department of Energy (DOE) has teamed with cities across the country through the Solar America Cities (SAC) partnership program to help reduce barriers and accelerate implementation of solar energy. The New York City SAC team is a partnership between the City University of New York (CUNY), the New York City Mayor s Office of Long-term Planning and Sustainability, and the New York City Economic Development Corporation (NYCEDC).The New York City SAC team is working with DOE s National Renewable Energy Laboratory (NREL) and Con Edison, the local utility, to develop a roadmap for photovoltaic (PV) installations in the five boroughs. The city set a goal to increase its installed PV capacity from1.1 MW in 2005 to 8.1 MW by 2015 (the maximum allowed in 2005). A key barrier to reaching this goal, however, is the complexity of the interconnection process with the local utility. Unique challenges are associated with connecting distributed PV systems to secondary network distribution systems (simplified to networks in this report). Although most areas of the country use simpler radial distribution systems to distribute electricity, larger metropolitan areas like New York City typically use networks to increase reliability in large load centers. Unlike the radial distribution system, where each customer receives power through a single line, a network uses a grid of interconnected lines to deliver power to each customer through several parallel circuits and sources. This redundancy improves reliability, but it also requires more complicated coordination and protection schemes that can be disrupted by energy exported from distributed PV systems. Currently, Con Edison studies each potential PV system in New York City to evaluate the system s impact on the network, but this is time consuming for utility engineers and may delay the customer s project or add cost for larger installations. City leaders would like to streamline this process to facilitate faster, simpler, and

  1. A Methodology for Physical Interconnection Decisions of Next Generation Transport Networks

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Madsen, Ole Brun

    2011-01-01

    of possibilities when designing the physical network interconnection. This paper develops and presents a methodology in order to deal with aspects related to the interconnection problem of optical transport networks. This methodology is presented as independent puzzle pieces, covering diverse topics going from......The physical interconnection for optical transport networks has critical relevance in the overall network performance and deployment costs. As telecommunication services and technologies evolve, the provisioning of higher capacity and reliability levels is becoming essential for the proper...... development of Next Generation Networks. Currently, there is a lack of specific procedures that describe the basic guidelines to design such networks better than "best possible performance for the lowest investment". Therefore, the research from different points of view will allow a broader space...

  2. Multi-net optimization of VLSI interconnect

    CERN Document Server

    Moiseev, Konstantin; Wimer, Shmuel

    2015-01-01

    This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

  3. Thermo-electric Analysis of the Interconnection of the LHC main Superconducting Bus Bars

    CERN Document Server

    Granieri, P P; Casali, M; Bottura, L; Siemko, A

    2013-01-01

    Spurred by the question of the maximum allowable energy for the operation of the Large Hadron Collider (LHC), we have progressed in the understanding of the thermo-electric behavior of the 13 kA superconducting bus bars interconnecting its main magnets. A deep insight of the underlying mechanisms is required to ensure the protection of the accelerator against undesired effects of resistive transitions. This is especially important in case of defective interconnections which can jeopardize the operation of the whole LHC. In this paper we present a numerical model of the interconnections between the main dipole and quadrupole magnets, validated against experimental tests of an interconnection sample with a purposely built-in defect. We consider defective interconnections featuring a lack of bonding among the superconducting cables and the copper stabilizer components, such as those that could be present in the machine. We evaluate the critical defect length limiting the maximum allowable current for powering th...

  4. High-speed VCSEL-based optical interconnects

    Science.gov (United States)

    Ishak, Waguih S.

    2001-11-01

    Vertical Cavity Surface Emitting Lasers (VCSEL) have made significant inroads into commercial realization especially in the area of data communications. Single VCSEL devices are key components in Gb Ethernet Transceivers. A multi-element VCSEL array is the key enabling technology for high-speed multi Gb/s parallel optical interconnect modules. In 1996, several companies introduced a new generation of fiber optic products based VCSEL technology such as multimode fiber transceivers for the ANSI Fiber Channel and Gigabit Ethernet IEEE 802.3 standards. VCSELs offer unique advantages over its edge-emitting counterparts in several areas. These include low-cost (LED-like) manufacturability, low current operation and array integrability. As data rates continue to increase, VCSELs offer the advantage of being able to provide the highest modulation bandwidth per milliamp of modulation current. Currently, most of the VCSEL-based products use short (780 - 980 nm) wavelength lasers. However, significant research efforts are taking place at universities and industrial research labs around the world to develop reliable, manufacturable and high-power long (1300 - 1550 nm) wavelength VCSELs. These lasers will allow longer (several km) transmission distances and will help alleviate some of the eye-safety issues. Perhaps, the most important advantage of VCSELs is the ability to form two-dimensional arrays much easier than in the case of edge-emitting lasers. These arrays (single and two-dimensional) will allow a whole new family of applications, specifically in very high-speed computer and switch interconnects.

  5. 18 CFR 292.306 - Interconnection costs.

    Science.gov (United States)

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any electric...

  6. FDTD technique based crosstalk analysis of bundled SWCNT interconnects

    International Nuclear Information System (INIS)

    Duksh, Yograj Singh; Kaushik, Brajesh Kumar; Agarwal, Rajendra P.

    2015-01-01

    The equivalent electrical circuit model of a bundled single-walled carbon nanotube based distributed RLC interconnects is employed for the crosstalk analysis. The accurate time domain analysis and crosstalk effect in the VLSI interconnect has emerged as an essential design criteria. This paper presents a brief description of the numerical method based finite difference time domain (FDTD) technique that is intended for estimation of voltages and currents on coupled transmission lines. For the FDTD implementation, the stability of the proposed model is strictly restricted by the Courant condition. This method is used for the estimation of crosstalk induced propagation delay and peak voltage in lossy RLC interconnects. Both functional and dynamic crosstalk effects are analyzed in the coupled transmission line. The effect of line resistance on crosstalk induced delay, and peak voltage under dynamic and functional crosstalk is also evaluated. The FDTD analysis and the SPICE simulations are carried out at 32 nm technology node for the global interconnects. It is observed that the analytical results obtained using the FDTD technique are in good agreement with the SPICE simulation results. The crosstalk induced delay, propagation delay, and peak voltage obtained using the FDTD technique shows average errors of 4.9%, 3.4% and 0.46%, respectively, in comparison to SPICE. (paper)

  7. Decentralised output feedback control of Markovian jump interconnected systems with unknown interconnections

    Science.gov (United States)

    Li, Li-Wei; Yang, Guang-Hong

    2017-07-01

    The problem of decentralised output feedback control is addressed for Markovian jump interconnected systems with unknown interconnections and general transition rates (TRs) allowed to be unknown or known with uncertainties. A class of decentralised dynamic output feedback controllers are constructed, and a cyclic-small-gain condition is exploited to dispose the unknown interconnections so that the resultant closed-loop system is stochastically stable and satisfies an H∞ performance. With slack matrices to cope with the nonlinearities incurred by unknown and uncertain TRs in control synthesis, a novel controller design condition is developed in linear matrix inequality formalism. Compared with the existing works, the proposed approach leads to less conservatism. Finally, two examples are used to illustrate the effectiveness of the new results.

  8. Nano/CMOS architectures using a field-programmable nanowire interconnect

    International Nuclear Information System (INIS)

    Snider, Gregory S; Williams, R Stanley

    2007-01-01

    A field-programmable nanowire interconnect (FPNI) enables a family of hybrid nano/CMOS circuit architectures that generalizes the CMOL (CMOS/molecular hybrid) approach proposed by Strukov and Likharev, allowing for simpler fabrication, more conservative process parameters, and greater flexibility in the choice of nanoscale devices. The FPNI improves on a field-programmable gate array (FPGA) architecture by lifting the configuration bit and associated components out of the semiconductor plane and replacing them in the interconnect with nonvolatile switches, which decreases both the area and power consumption of the circuit. This is an example of a more comprehensive strategy for improving the efficiency of existing semiconductor technology: placing a level of intelligence and configurability in the interconnect can have a profound effect on integrated circuit performance, and can be used to significantly extend Moore's law without having to shrink the transistors. Compilation of standard benchmark circuits onto FPNI chip models shows reduced area (8 x to 25 x), reduced power, slightly lower clock speeds, and high defect tolerance-an FPNI chip with 20% defective junctions and 20% broken nanowires has an effective yield of 75% with no significant slowdown along the critical path, compared to a defect-free chip. Simulations show that the density and power improvements continue as both CMOS and nano fabrication parameters scale down, although the maximum clock rate decreases due to the high resistance of very small (<10 nm) metallic nanowires

  9. Fuel cell system with interconnect

    Science.gov (United States)

    Goettler, Richard; Liu, Zhien

    2017-12-12

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  10. Encoded low swing for ultra low power interconnect

    NARCIS (Netherlands)

    Krishnan, R.; Pineda de Gyvez, J.

    2003-01-01

    We present a novel encoded-low swing technique for ultra low power interconnect. Using this technique and an efficient circuit implementation, we achieve an average of 45.7% improvement in the power-delay product over the schemes utilizing low swing techniques alone, for random bit streams. Also, we

  11. Inverter for Interchangeable Use as Current Source Inverter and Voltage Source Inverter for Interconnecting to Grid

    Science.gov (United States)

    Teruya, Daisuke; Masukawa, Shigeo; Iida, Shoji

    We propose a novel inverter that can be operated either as a Current Source Inverter (CSI) or as a Voltage Source Inverter (VSI) by changing only the control signals. It is proper to apply it to the interconnecting system with renewal energy, such as photovoltaic cells or wind generation systems, to a grid. This inverter is usually operated as the CSI connected to the grid. Even if the energy source has a lower voltage than the grid, the energy can be supplied to the grid through the proposed inverter. The power factor can be briefly maintained at almost unity. When power supply from the grid is interrupted, the proposed circuit should be operated as the VSI in the stand-alone operation mode. In this way, the circuit can maintain a constant output voltage to the loads. In this paper, the proposed circuit configuration and the control schemes for both the CSI and the VSI are described. Further, the circuit characteristics for both are discussed experimentally.

  12. Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Meyer, M.A.

    2007-07-12

    This thesis provides a methodology for the investigation of electromigration (EM) in Cu-based interconnects. An experimental framework based on in-situ scanning electron microscopy (SEM) investigations was developed for that purpose. It is capable to visualize the EM-induced void formation and evolution in multi-level test structures in real time. Different types of interconnects were investigated. Furthermore, stressed and unstressed samples were studied applying advanced physical analysis techniques in order to obtain additional information about the microstructure of the interconnects as well as interfaces and grain boundaries. These data were correlated to the observed degradation phenomena. Correlations of the experimental results to recently established theoretical models were highlighted. Three types of Cu-based interconnects were studied. Pure Cu interconnects were compared to Al-alloyed (CuAl) and CoWP-coated interconnects. The latter two represent potential approaches that address EM-related reliability concerns. It was found that in such interconnects the dominant diffusion path is no longer the Cu/capping layer interface for interconnects as in pure Cu interconnects. Instead, void nucleation occurs at the bottom Cu/barrier interface with significant effects from grain boundaries. Moreover, the in-situ investigations revealed that the initial void nucleation does not occur at the cathode end of the lines but several micrometers away from it. The mean times-to-failure of CuAl and CoWP-coated interconnects were increased by at least one order of magnitude compared to Cu interconnects. The improvements were attributed to the presence of foreign metal atoms at the Cu/capping layer interface. Post-mortem EBSD investigations were used to reveal the microstructure of the tested samples. The data were correlated to the in-situ observations. (orig.)

  13. High-performance parallel processors based on star-coupled wavelength division multiplexing optical interconnects

    Science.gov (United States)

    Deri, Robert J.; DeGroot, Anthony J.; Haigh, Ronald E.

    2002-01-01

    As the performance of individual elements within parallel processing systems increases, increased communication capability between distributed processor and memory elements is required. There is great interest in using fiber optics to improve interconnect communication beyond that attainable using electronic technology. Several groups have considered WDM, star-coupled optical interconnects. The invention uses a fiber optic transceiver to provide low latency, high bandwidth channels for such interconnects using a robust multimode fiber technology. Instruction-level simulation is used to quantify the bandwidth, latency, and concurrency required for such interconnects to scale to 256 nodes, each operating at 1 GFLOPS performance. Performance scales have been shown to .apprxeq.100 GFLOPS for scientific application kernels using a small number of wavelengths (8 to 32), only one wavelength received per node, and achievable optoelectronic bandwidth and latency.

  14. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  15. Universal Interconnection Technology Workshop Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    Sheaffer, P.; Lemar, P.; Honton, E. J.; Kime, E.; Friedman, N. R.; Kroposki, B.; Galdo, J.

    2002-10-01

    The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology, approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.

  16. Low power interconnect design

    CERN Document Server

    Saini, Sandeep

    2015-01-01

    This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.   ·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses; ·         Focuses on Deep Sub micron technology devices and interconnects; ·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics;  ·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for del...

  17. Epidemics spreading in interconnected complex networks

    International Nuclear Information System (INIS)

    Wang, Y.; Xiao, G.

    2012-01-01

    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  18. Epidemics spreading in interconnected complex networks

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Y. [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Institute of High Performance Computing, Agency for Science, Technology and Research (A-STAR), Singapore 138632 (Singapore); Xiao, G., E-mail: egxxiao@ntu.edu.sg [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)

    2012-09-03

    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  19. Superconducting Thin-Film Interconnects for Cryogenic Photon Detector Arrays, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Advanced imaging spectrometers for x-ray astronomy will require significant improvements in the high density interconnects between the detector arrays and the first...

  20. Reliability of spring interconnects for high channel-count polyimide electrode arrays

    Science.gov (United States)

    Khan, Sharif; Ordonez, Juan Sebastian; Stieglitz, Thomas

    2018-05-01

    Active neural implants with a high channel-count need robust and reliable operational assembly for the targeted environment in order to be classified as viable fully implantable systems. The discrete functionality of the electrode array and the implant electronics is vital for intact assembly. A critical interface exists at the interconnection sites between the electrode array and the implant electronics, especially in hybrid assemblies (e.g. retinal implants) where electrodes and electronics are not on the same substrate. Since the interconnects in such assemblies cannot be hermetically sealed, reliable protection against the physiological environment is essential for delivering high insulation resistance and low defusibility of salt ions, which are limited in complexity by current assembly techniques. This work reports on a combination of spring-type interconnects on a polyimide array with silicone rubber gasket insulation for chronically active implantable systems. The spring design of the interconnects on the backend of the electrode array compensates for the uniform thickness of the sandwiched gasket during bonding in assembly and relieves the propagation of extrinsic stresses to the bulk polyimide substrate. The contact resistance of the microflex-bonded spring interconnects with the underlying metallized ceramic test vehicles and insulation through the gasket between adjacent contacts was investigated against the MIL883 standard. The contact and insulation resistances remained stable in the exhausting environmental conditions.

  1. Interconnecting Microgrids via the Energy Router with Smart Energy Management

    Directory of Open Access Journals (Sweden)

    Yingshu Liu

    2017-08-01

    Full Text Available A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage equipment. The key idea is to establish complementary energy exchange between adjacent microgrids through a multiport electrical energy router, according to the consideration that adjacent microgrids may differ substantially in terms of their patterns of energy production and consumption, which can be utilized to compensate for each other’s instant energy deficit. Based on multiport bidirectional voltage source converters (VSCs and a shared direct current (DC power line, the energy router serves as an energy hub, and enables flexible energy flow among the adjacent microgrids and the main grid. The analytical model is established for the whole system, including the energy router, the interconnected microgrids and the main grid. Various operational modes of the interconnected microgrids, facilitated by the energy router, are analyzed, and the corresponding control strategies are developed. Simulations are carried out on the Matlab/Simulink platform, and the results have demonstrated the validity and reliability of the idea for microgrid interconnection as well as the corresponding control strategies for flexible energy flow.

  2. Interconnect fatigue design for terrestrial photovoltaic modules

    Science.gov (United States)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1982-03-01

    The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

  3. Recent Development of SOFC Metallic Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  4. Misalignment corrections in optical interconnects

    Science.gov (United States)

    Song, Deqiang

    Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

  5. Conductive polymer/metal composites for interconnect of flexible devices

    Science.gov (United States)

    Kawakita, Jin; Hashimoto Shinoda, Yasuo; Shuto, Takanori; Chikyow, Toyohiro

    2015-06-01

    An interconnect of flexible and foldable devices based on advanced electronics requires high electrical conductivity, flexibility, adhesiveness on a plastic substrate, and efficient productivity. In this study, we investigated the applicability of a conductive polymer/metal composite to the interconnect of flexible devices. By combining an inkjet process and a photochemical reaction, micropatterns of a polypyrrole/silver composite were formed on flexible plastic substrates with an average linewidth of approximately 70 µm within 10 min. The conductivity of the composite was improved to 6.0 × 102 Ω-1·cm-1. From these results, it is expected that the conducting polymer/metal composite can be applied to the microwiring of flexible electronic devices.

  6. Development and operation of interconnections in a restructuring context

    International Nuclear Information System (INIS)

    2003-01-01

    In many countries the electrical network is not fully interconnected and the best technical solution to achieve interconnection has to be found. At the same time the electricity industry is being restructured and interconnecting independent energy markets presents technical challenges. It is therefore timely to consider interconnection development and operation options: examine the benefits of interconnecting electrical networks and the development strategies, review the interconnection design options and the technologies available, identify the operational issues, the security problems of large interconnected systems, the protection issues, consider the impact of the restructuring of the electrical supply industry, assess the political, environmental and social implications of interconnections. reorganized in slovenia from 5-7 april 2004. (author)

  7. Functional neuroanatomy of amygdalohippocampal interconnections and their role in learning and memory.

    Science.gov (United States)

    McDonald, Alexander J; Mott, David D

    2017-03-01

    The amygdalar nuclear complex and hippocampal/parahippocampal region are key components of the limbic system that play a critical role in emotional learning and memory. This Review discusses what is currently known about the neuroanatomy and neurotransmitters involved in amygdalo-hippocampal interconnections, their functional roles in learning and memory, and their involvement in mnemonic dysfunctions associated with neuropsychiatric and neurological diseases. Tract tracing studies have shown that the interconnections between discrete amygdalar nuclei and distinct layers of individual hippocampal/parahippocampal regions are robust and complex. Although it is well established that glutamatergic pyramidal cells in the amygdala and hippocampal region are the major players mediating interconnections between these regions, recent studies suggest that long-range GABAergic projection neurons are also involved. Whereas neuroanatomical studies indicate that the amygdala only has direct interconnections with the ventral hippocampal region, electrophysiological studies and behavioral studies investigating fear conditioning and extinction, as well as amygdalar modulation of hippocampal-dependent mnemonic functions, suggest that the amygdala interacts with dorsal hippocampal regions via relays in the parahippocampal cortices. Possible pathways for these indirect interconnections, based on evidence from previous tract tracing studies, are discussed in this Review. Finally, memory disorders associated with dysfunction or damage to the amygdala, hippocampal region, and/or their interconnections are discussed in relation to Alzheimer's disease, posttraumatic stress disorder (PTSD), and temporal lobe epilepsy. © 2016 Wiley Periodicals, Inc. © 2016 Wiley Periodicals, Inc.

  8. Computer simulation of electromigration in microelectronics interconnect

    OpenAIRE

    Zhu, Xiaoxin

    2014-01-01

    Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

  9. Thermo-electric analysis of the interconnection of the LHC main superconducting bus bars

    Science.gov (United States)

    Granieri, P. P.; Breschi, M.; Casali, M.; Bottura, L.; Siemko, A.

    2013-01-01

    Spurred by the question of the maximum allowable energy for the operation of the Large Hadron Collider (LHC), we have progressed in the understanding of the thermo-electric behavior of the 13 kA superconducting bus bars interconnecting its main magnets. A deep insight of the underlying mechanisms is required to ensure the protection of the accelerator against undesired effects of resistive transitions. This is especially important in case of defective interconnections which can jeopardize the operation of the whole LHC. In this paper we present a numerical model of the interconnections between the main dipole and quadrupole magnets, validated against experimental tests of an interconnection sample with a purposely built-in defect. We consider defective interconnections featuring a lack of bonding among the superconducting cables and the copper stabilizer components, such as those that could be present in the machine. We evaluate the critical defect length limiting the maximum allowable current for powering the magnets. We determine the dependence of the critical defect length on different parameters as the heat transfer towards the cooling helium bath, the quality of manufacturing, the operating conditions and the protection system parameters, and discuss the relevant mechanisms.

  10. Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

    Science.gov (United States)

    Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

    1996-01-01

    A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  11. Single OR molecule and OR atomic circuit logic gates interconnected on a Si(100)H surface

    International Nuclear Information System (INIS)

    Ample, F; Joachim, C; Duchemin, I; Hliwa, M

    2011-01-01

    Electron transport calculations were carried out for three terminal OR logic gates constructed either with a single molecule or with a surface dangling bond circuit interconnected on a Si(100)H surface. The corresponding multi-electrode multi-channel scattering matrix (where the central three terminal junction OR gate is the scattering center) was calculated, taking into account the electronic structure of the supporting Si(100)H surface, the metallic interconnection nano-pads, the surface atomic wires and the molecule. Well interconnected, an optimized OR molecule can only run at a maximum of 10 nA output current intensity for a 0.5 V bias voltage. For the same voltage and with no molecule in the circuit, the output current of an OR surface atomic scale circuit can reach 4 μA.

  12. Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

    Science.gov (United States)

    Decrossas, Emmanuel; Glover, Michael D.; Porter, Kaoru; Cannon, Tom; Mantooth, H. Alan; Hamilton, M. C.

    2013-01-01

    Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

  13. Testing of Ni-plated ferritic steel interconnect in SOFC stacks

    DEFF Research Database (Denmark)

    Nielsen, K.A.; Dinesen, A.R.; Korcakova, L.

    2006-01-01

    heating to 1,030 °C. During this time, 20–70 μm thick surface layers of austenitic steel were formed, which were covered by a 1–4 μm chromia layer on the anode side and by a layer of mixed Cr-Fe-Ni-spinels over a 1–4 μm chromia layer on the cathode side. The microstructure and composition...... of the protective scale on the cathode side was susceptible to pitting-type corrosion patterns, which may limit the life expectancy to less than 2,000 hours for the 200 μm thick interconnect tested. The initial area-specific resistances (ASR) at the interconnect/cathode current collector interface...

  14. 47 CFR 90.477 - Interconnected systems.

    Science.gov (United States)

    2010-10-01

    ... part and medical emergency systems in the 450-470 MHz band, interconnection will be permitted only... operating on frequencies in the bands below 800 MHz are not subject to the interconnection provisions of...

  15. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    International Nuclear Information System (INIS)

    Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

    2011-01-01

    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

  16. Manufacturing of planar ceramic interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  17. Optimal interconnection and renewable targets for north-west Europe

    International Nuclear Information System (INIS)

    Lynch, Muireann Á.; Tol, Richard S.J.; O'Malley, Mark J.

    2012-01-01

    We present a mixed-integer, linear programming model for determining optimal interconnection for a given level of renewable generation using a cost minimisation approach. Optimal interconnection and capacity investment decisions are determined under various targets for renewable penetration. The model is applied to a test system for eight regions in Northern Europe. It is found that considerations on the supply side dominate demand side considerations when determining optimal interconnection investment: interconnection is found to decrease generation capacity investment and total costs only when there is a target for renewable generation. Higher wind integration costs see a concentration of wind in high-wind regions with interconnection to other regions. - Highlights: ► We use mixed-integer linear programming to determine optimal interconnection locations for given renewable targets. ► The model is applied to a test system for eight regions in Northern Europe. ► Interconnection reduces costs only when there is a renewable target. ► Wind integration costs affect the interconnection portfolio.

  18. Financial viability of the Sonora-Baja California interconnection line; Viabilidad financiera de la linea de interconexion Sonora-Baja California

    Energy Technology Data Exchange (ETDEWEB)

    Alonso, G. [ININ, Carretera Mexico-Touca s/n, 52750 Ocoyoacac, Estado de Mexico (Mexico); Ortega, G., E-mail: gustavo.alonso@inin.gob.mx [Comision Federal de Electricidad, Rio Rodano No. 14, Col. Cuauhtemoc, 06500 Ciudad de Mexico (Mexico)

    2017-09-15

    In the Development Program of the National Electricity Sector 2015-2029, an electric interconnection line between Sonora and Baja California (Mexico) is proposed, this study analyzes the financial viability of this interconnection line based on the maximum hourly and seasonal energy demand between both regions and proposes alternatives for the supply of electric power that supports the economic convenience of this interconnection line. The results show that additional capacity is required in Sonora to cover the maximum demands of both regions since in the current condition of the National Electric System the interconnection line is not justified. (Author)

  19. Electrical transport and electromigration studies on nickel encapsulated carbon nanotubes: possible future interconnects

    International Nuclear Information System (INIS)

    Kulshrestha, Neha; Misra, D S; Misra, Abhishek

    2013-01-01

    We nominate the nickel filled multiwalled carbon nanotubes (MWNTs) as potential candidates to cope with challenges in persistent scaling for future interconnect technology. The insights into electrical transport through nickel filled carbon nanotubes provide an effective solution for major performance and reliability issues such as the increasing resistivity of metals at reduced scales, electromigration at high current densities and the problem of diffusion and corrosion faced by the existing copper interconnect technology. Furthermore, the nickel filled MWNTs outperform their hollow counterparts, the unfilled MWNTs, carrying at least one order higher current density, with increased time to failure. The results suggest that metal filled carbon nanotubes can provide a twofold benefit: (1) the metal filling provides an increased density of states for the system leading to a higher current density compared to hollow MWNTs, (2) metal out-diffusion and corrosion is prevented by the surrounding graphitic walls. (paper)

  20. Fault current limiter

    Science.gov (United States)

    Darmann, Francis Anthony

    2013-10-08

    A fault current limiter (FCL) includes a series of high permeability posts for collectively define a core for the FCL. A DC coil, for the purposes of saturating a portion of the high permeability posts, surrounds the complete structure outside of an enclosure in the form of a vessel. The vessel contains a dielectric insulation medium. AC coils, for transporting AC current, are wound on insulating formers and electrically interconnected to each other in a manner such that the senses of the magnetic field produced by each AC coil in the corresponding high permeability core are opposing. There are insulation barriers between phases to improve dielectric withstand properties of the dielectric medium.

  1. Towards energy aware optical networks and interconnects

    Science.gov (United States)

    Glesk, Ivan; Osadola, Tolulope; Idris, Siti

    2013-10-01

    In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

  2. Epidemics in interconnected small-world networks.

    Science.gov (United States)

    Liu, Meng; Li, Daqing; Qin, Pengju; Liu, Chaoran; Wang, Huijuan; Wang, Feilong

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS) model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  3. Epidemics in interconnected small-world networks.

    Directory of Open Access Journals (Sweden)

    Meng Liu

    Full Text Available Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  4. Solar-cell interconnect design for terrestrial photovoltaic modules

    Science.gov (United States)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1984-01-01

    Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

  5. Management and use of electric interconnections in 2008

    International Nuclear Information System (INIS)

    2009-07-01

    Major progress was made throughout 2008 in border congestion management and market integration. A number of projects were carried out, including the creation of a single auction platform for the Central-West region (CASC-CWE) and the first centre for regional coordination (Coreso SA) to better control real-time flow, thus laying the foundations for future network management on a regional scale. Such progress encourages more improvements still, which should take effect some time in 2009 and should constitute an important stage in creating an integrated European electricity market. The more significant expected advances notably include the implementation of a single, harmonised set of bidding rules covering the entire Central-West region, which would include introducing the principle of automatic resale of capacity (use-it-or-sell-it); the launch of the second phase of the BALIT project for reciprocal adjusting exchanges between France and England; the introduction of a compensation scheme for curtailments of capacity based on the differences in pricing at Power Exchanges over the France-Spain interconnection; and finally the elaboration of the very first regional reports by regulators on the management and use of interconnections. The launch of the market coupling in the Central-West region, planned for March 2010, will unquestionably be a key event in market integration. In addition to substantially improving the use of the region's interconnections, it will offer significant new perspectives in market organisation (such as the future role and status of organised markets as regards day-ahead activity). The work of network operators on the flow-based aspect of the project will also enable improvements in transparency and coordination when calculating interconnection capacities, and could, in the long-run, open debates on changing the market design. However, of the issues raised in CRE's second report on management and use of interconnections, several have

  6. Self-Rerouting and Curative Interconnect Technology (SERCUIT)

    Science.gov (United States)

    2017-12-01

    SPECIAL REPORT RDMR-CS-17-01 SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) Shiv Joshi Concepts to Systems, Inc...Final 4. TITLE AND SUBTITLE Self-Rerouting and Curative Interconnect Technology (SERCUIT) 5. FUNDING NUMBERS 6. AUTHOR(S) Shiv Joshi...concepts2systems.com (p) 434-207-5189 x (f) Click to view full size Title Contract Number SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) W911W6-17-C-0029

  7. Network interconnections: an architectural reference model

    NARCIS (Netherlands)

    Butscher, B.; Lenzini, L.; Morling, R.; Vissers, C.A.; Popescu-Zeletin, R.; van Sinderen, Marten J.; Heger, D.; Krueger, G.; Spaniol, O.; Zorn, W.

    1985-01-01

    One of the major problems in understanding the different approaches in interconnecting networks of different technologies is the lack of reference to a general model. The paper develops the rationales for a reference model of network interconnection and focuses on the architectural implications for

  8. Epidemics in interconnected small-world networks

    NARCIS (Netherlands)

    Liu, M.; Li, D.; Qin, P.; Liu, C.; Wang, H.; Wang, F.

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks

  9. Interconnect rise time in superconducting integrating circuits

    International Nuclear Information System (INIS)

    Preis, D.; Shlager, K.

    1988-01-01

    The influence of resistive losses on the voltage rise time of an integrated-circuit interconnection is reported. A distribution-circuit model is used to present the interconnect. Numerous parametric curves are presented based on numerical evaluation of the exact analytical expression for the model's transient response. For the superconducting case in which the series resistance of the interconnect approaches zero, the step-response rise time is longer but signal strength increases significantly

  10. 76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...

    Science.gov (United States)

    2011-07-07

    .... EL11-20-001] PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of... Sell Offers for Planned Generation Capacity Resources submitted into PJM's Reliability Pricing Model... presents an opportunity to exercise buyer market power; (2) whether the Fixed Resource Requirement (FRR...

  11. The promotion of angiogenesis induced by three-dimensional porous beta-tricalcium phosphate scaffold with different interconnection sizes via activation of PI3K/Akt pathways

    Science.gov (United States)

    Xiao, Xin; Wang, Wei; Liu, Dong; Zhang, Haoqiang; Gao, Peng; Geng, Lei; Yuan, Yulin; Lu, Jianxi; Wang, Zhen

    2015-03-01

    The porous architectural characteristics of biomaterials play an important role in scaffold revascularization. However, no consensus exists regarding optimal interconnection sizes for vascularization and its scaffold bioperformance with different interconnection sizes. Therefore, a series of disk-type beta-tricalcium phosphates with the same pore sizes and variable interconnections were produced to evaluate how the interconnection size influenced biomaterial vascularization in vitro and in vivo. We incubated human umbilical vein endothelial cells on scaffolds with interconnections of various sizes. Results showed that scaffolds with a 150 μm interconnection size ameliorated endothelial cell function evidenced by promoting cell adhesion and migration, increasing cell proliferation and enhancing expression of platelet-endothelial cell adhesion molecules and vascular endothelial growth factor. In vivo study was performed on rabbit implanted with scaffolds into the bone defect on femoral condyles. Implantation with scaffolds with 150 μm interconnection size significantly improved neovascularization as shown by micro-CT as compared to scaffolds with 100 and 120 μm interconnection sizes. Moreover, the aforementioned positive effects were abolished by blocking PI3K/Akt/eNOS pathway with LY-294002. Our study explicitly demonstrates that the scaffold with 150 μm interconnection size improves neovascularization via the PI3K/Akt pathway and provides a target for biomaterial inner structure modification to attain improved clinical performance in implant vascularization.

  12. Optical Interconnects for Future Data Center Networks

    CERN Document Server

    Bergman, Keren; Tomkos, Ioannis

    2013-01-01

    Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

  13. Electromigration in integrated circuit interconnects studied by X-ray microscopy

    Energy Technology Data Exchange (ETDEWEB)

    Schneider, G. E-mail: gschnei1@gwdg.de; Denbeaux, G.; Anderson, E.; Bates, W.; Salmassi, F.; Nachimuthu, P.; Pearson, A.; Richardson, D.; Hambach, D.; Hoffmann, N.; Hasse, W.; Hoffmann, K

    2003-01-01

    To study mass transport phenomena in advanced microelectronic devices with X-rays requires penetration of dielectric and Si layers up to 30 {mu}m thick. X-ray imaging at 1.8 keV photon energy provides a high amplitude contrast between Cu or Al interconnects and dielectric layers and can penetrate through the required thickness. To perform X-ray microscopy at 1.8 keV, a new Ru/Si multilayer was designed for the transmission X-ray microscope XM-1 installed at the Advanced Light Source in Berkeley. The mass flow in a passivated Cu interconnect was studied at current densities up to 10{sup 7} A/cm{sup 2}. In addition, we demonstrated the high material contrast from different elements in integrated circuits with a resolution of about 40 nm.

  14. Electromigration in integrated circuit interconnects studied by X-ray microscopy

    CERN Document Server

    Schneider, G; Anderson, E; Bates, W; Salmassi, F; Nachimuthu, P; Pearson, A; Richardson, D; Hambach, D; Hoffmann, N; Hasse, W; Hoffmann, K

    2003-01-01

    To study mass transport phenomena in advanced microelectronic devices with X-rays requires penetration of dielectric and Si layers up to 30 mu m thick. X-ray imaging at 1.8 keV photon energy provides a high amplitude contrast between Cu or Al interconnects and dielectric layers and can penetrate through the required thickness. To perform X-ray microscopy at 1.8 keV, a new Ru/Si multilayer was designed for the transmission X-ray microscope XM-1 installed at the Advanced Light Source in Berkeley. The mass flow in a passivated Cu interconnect was studied at current densities up to 10 sup 7 A/cm sup 2. In addition, we demonstrated the high material contrast from different elements in integrated circuits with a resolution of about 40 nm.

  15. 11.72 sq cm SiC Wafer-scale Interconnected 64 kA PiN Diode

    Science.gov (United States)

    2012-01-30

    drop of 10.3 V. The dissipated energy was 382 J and the calculated action exceeded 1.7 MA2 -s. Preliminary development of high voltage interconnection...scale diode action (surge current integral), a key reliability parameter, exceeded 1.7 MA2 -s. Figure 6: The wafer-scale interconnected diode...scale diode was 382 J and the calculated action exceeded 1.7 MA2 -sec. High voltage operation of PiN diodes, thyristors, and other semiconductor

  16. Review of Interconnection Practices and Costs in the Western States

    Energy Technology Data Exchange (ETDEWEB)

    Bird, Lori A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Flores-Espino, Francisco [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Volpi, Christina M [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Ardani, Kristen B [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Manning, David [Western Interstate Energy Board (WIEB); McAllister, Richard [Western Interstate Energy Board (WIEB)

    2018-04-27

    The objective of this report is to evaluate the nature of barriers to interconnecting distributed PV, assess costs of interconnection, and compare interconnection practices across various states in the Western Interconnection. The report addresses practices for interconnecting both residential and commercial-scale PV systems to the distribution system. This study is part of a larger, joint project between the Western Interstate Energy Board (WIEB) and the National Renewable Energy Laboratory (NREL), funded by the U.S. Department of Energy, to examine barriers to distributed PV in the 11 states wholly within the Western Interconnection.

  17. Methodology for assessing the impacts of distributed generation interconnection

    Directory of Open Access Journals (Sweden)

    Luis E. Luna

    2011-06-01

    Full Text Available This paper proposes a methodology for identifying and assessing the impact of distributed generation interconnection on distribution systems using Monte Carlo techniques. This methodology consists of two analysis schemes: a technical analysis, which evaluates the reliability conditions of the distribution system; on the other hand, an economic analysis that evaluates the financial impacts on the electric utility and its customers, according to the system reliability level. The proposed methodology was applied to an IEEE test distribution system, considering different operation schemes for the distributed generation interconnection. The application of each one of these schemes provided significant improvements regarding the reliability and important economic benefits for the electric utility. However, such schemes resulted in negative profitability levels for certain customers, therefore, regulatory measures and bilateral contracts were proposed which would provide a solution for this kind of problem.

  18. Identifying influential spreaders in interconnected networks

    International Nuclear Information System (INIS)

    Zhao, Dawei; Li, Lixiang; Huo, Yujia; Yang, Yixian; Li, Shudong

    2014-01-01

    Identifying the most influential spreaders in spreading dynamics is of the utmost importance for various purposes for understanding or controlling these processes. The existing relevant works are limited to a single network. Most real networks are actually not isolated, but typically coupled and affected by others. The properties of epidemic spreading have recently been found to have some significant differences in interconnected networks from those in a single network. In this paper, we focus on identifying the influential spreaders in interconnected networks. We find that the well-known k-shell index loses effectiveness; some insignificant spreaders in a single network become the influential spreaders in the whole interconnected networks while some influential spreaders become no longer important. The simulation results show that the spreading capabilities of the nodes not only depend on their influence for the network topology, but also are dramatically influenced by the spreading rate. Based on this perception, a novel index is proposed for measuring the influential spreaders in interconnected networks. We then support the efficiency of this index with numerical simulations. (paper)

  19. Regulatory Issues Surrounding Merchant Interconnection

    International Nuclear Information System (INIS)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections

  20. Regulatory Issues Surrounding Merchant Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert [Office for Energy Regulation (DTe), The Hague (Netherlands)

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections.

  1. Brookhaven segment interconnect

    International Nuclear Information System (INIS)

    Morse, W.M.; Benenson, G.; Leipuner, L.B.

    1983-01-01

    We have performed a high energy physics experiment using a multisegment Brookhaven FASTBUS system. The system was composed of three crate segments and two cable segments. We discuss the segment interconnect module which permits communication between the various segments

  2. Optical backplane interconnect switch for data processors and computers

    Science.gov (United States)

    Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

    1989-01-01

    An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

  3. 76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...

    Science.gov (United States)

    2011-07-28

    ...-002; Docket No. EL11-20-001] PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference On June 13, 2011, the Commission issued... Resources Services, Inc., Maryland Public Service Commission, Monitoring Analytics, L.L.C., National Rural...

  4. Examination of Critical Length Effect in Copper Interconnects With Oxide and Low-k Dielectrics

    International Nuclear Information System (INIS)

    Thrasher, Stacye; Gall, Martin; Justison, Patrick; Hernandez, Richard; Kawasaki, Hisao; Capasso, Cristiano; Nguyen, Timothy

    2004-01-01

    As technology moves toward faster microelectronic devices with smaller feature sizes, copper is replacing aluminum-copper alloy and low-k dielectric is replacing oxide as the materials of choice for advanced interconnect integrations. Copper not only brings to the table the advantage of lower resistivity, but also exhibits better electromigration performance when compared to Al(Cu). Low-k dielectric materials are advantageous because they reduce power consumption and improve signal delay. Due to these advantages, the industry trend is moving towards integrating copper and low-k dielectric for high performance interconnects. The purpose of this study is to evaluate the critical length effect in single-inlaid copper interconnects and determine the critical product (jl)c, for a variety of integrations, examining the effect of ILD (oxide vs. low-k), geometry, and stress temperature

  5. Best Practices for Teaming and Collaboration in the Interconnected Systems Framework

    Science.gov (United States)

    Splett, Joni W.; Perales, Kelly; Halliday-Boykins, Colleen A.; Gilchrest, Callie E.; Gibson, Nicole; Weist, Mark D.

    2017-01-01

    The Interconnected Systems Framework (ISF) blends school mental health practices, systems, and resources into all levels of a multitiered system of supports (e.g., positive behavior interventions and supports). The ISF aims to improve mental health and school performance for all students by emphasizing effective school-wide promotion and…

  6. Strategic siting and regional grid interconnections key to low-carbon futures in African countries

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Grace C. [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Deshmukh, Ranjit [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Ndhlukula, Kudakwashe [Namibia Univ. of Science and Technology, Windhoek, (Namibia). Southern Africa Development Community (SADC) Centre for Renewable Energy and Energy Efficiency; Radojicic, Tijana [International Renewable Energy Agency, Masdar City, Abu Dhabi (United Arab Emirates); Reilly-Moman, Jessica [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Phadke, Amol [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Kammen, Daniel M. [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Callaway, Duncan S. [Univ. of California, Berkeley, CA (United States). Energy and Resources Group

    2017-03-27

    Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental– impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. In conclusion, the overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.

  7. Strategic siting and regional grid interconnections key to low-carbon futures in African countries.

    Science.gov (United States)

    Wu, Grace C; Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M; Callaway, Duncan S

    2017-04-11

    Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental-impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with "no-regrets" options-or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6-20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.

  8. Efficient modeling of metallic interconnects for thermo-mechanical simulation of SOFC stacks: homogenized behaviors and effect of contact

    DEFF Research Database (Denmark)

    Tadesse Molla, Tesfaye; Kwok, Kawai; Frandsen, Henrik Lund

    2016-01-01

    temperature, deformations involving the elastic, creep as well as effect of changes in the geometry due to contact should be accounted for. The constitutive law can be applied using 3D modeling, but for simple presentation of the theory, 2D plane strain formulation is used to model the corrugated metallic......Currently thermo-mechanical analysis of the entire solid oxide fuel cell (SOFC) stack at operational conditions is computationally challenging if the geometry of metallic interconnects is considered explicitly. This is particularly the case when creep deformations in the interconnect are considered...... model to calculate the homogenized mechanical response of corrugated metallic interconnects at high temperatures.Thereafter, a constitutive law for the homogenized structure (effective material law) is developed. In order to properly describe the mechanical behavior of the interconnect at high...

  9. SSC [Superconducting Super Collider] magnet mechanical interconnections

    International Nuclear Information System (INIS)

    Bossert, R.C.; Niemann, R.C.; Carson, J.A.; Ramstein, W.L.; Reynolds, M.P.; Engler, N.H.

    1989-03-01

    Installation of superconducting accelerator dipole and quadrupole magnets and spool pieces in the SSC tunnel requires the interconnection of the cryostats. The connections are both of an electrical and mechanical nature. The details of the mechanical connections are presented. The connections include piping, thermal shields and insulation. There are seven piping systems to be connected. These systems must carry cryogenic fluids at various pressures or maintain vacuum and must be consistently leak tight. The interconnection region must be able to expand and contract as magnets change in length while cooling and warming. The heat leak characteristics of the interconnection region must be comparable to that of the body of the magnet. Rapid assembly and disassembly is required. The magnet cryostat development program is discussed. Results of quality control testing are reported. Results of making full scale interconnections under magnet test situations are reviewed. 11 figs., 4 tabs

  10. Fusion-bonded fluidic interconnects

    International Nuclear Information System (INIS)

    Fazal, I; Elwenspoek, M C

    2008-01-01

    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 µm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 °C

  11. A one-semester course in modeling of VSLI interconnections

    CERN Document Server

    Goel, Ashok

    2015-01-01

    Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

  12. Colligation, Or the Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Falster, Peter

    1998-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in pure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  13. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  14. Analysis of Defective Interconnections of the 13 kA LHC Superconducting Bus Bars

    CERN Document Server

    Granieri, P P; Bianchi, M; Breschi, M; Bottura, L; Willering, G

    2012-01-01

    The interconnections between Large Hadron Collider (LHC) main dipole and quadrupole magnets are made of soldered joints of two superconducting cables stabilized by a copper bus bar. The 2008 incident revealed the possible presence of defects in the interconnections of the 13 kA circuits that could lead to unprotected resistive transitions. Since then thorough experimental and numerical investigations were undertaken to determine the safe operating conditions for the LHC. This paper reports the analysis of experimental tests reproducing defective interconnections between main quadrupole magnets. A thermo-electromagnetic model was developed taking into account the complicated sample geometry. Close attention was paid to the physical description of the heat transfer towards helium, one of the main unknown parameters. The simulation results are reported in comparison with the measurements in case of static He I cooling bath. The outcome of this study constitutes a useful input to improve the stability assessment ...

  15. Production and characterization of SLID interconnected n-in-p pixel modules with 75 micron thin silicon sensors

    CERN Document Server

    Andricek, L; Macchiolo, A; Moser, H.G; Nisius, R; Richter, R.H; Terzo, S; Weigell, P

    2014-01-01

    The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. T...

  16. Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

    CERN Document Server

    Andricek, L; Macchiolo, A.; Moser, H.-G.; Nisius, R.; Richter, R.H.; Terzo, S.; Weigell, P.

    2014-01-01

    The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tunability, charge collection, cluster sizes and hit efficiencies. Targeting at ...

  17. Laser printing of 3D metallic interconnects

    Science.gov (United States)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  18. High temperature corrosion of metallic interconnects in solid oxide fuel cells

    International Nuclear Information System (INIS)

    Bastidas, D. M.

    2006-01-01

    Research and development has made it possible to use metallic interconnects in solid oxide fuel cells (SOFC) instead of ceramic materials. The use of metallic interconnects was formerly hindered by the high operating temperature, which made the interconnect degrade too much and too fast to be an efficient alternative. When the operating temperature was lowered, the use of metallic interconnects proved to be favourable since they are easier and cheaper to produce than ceramic interconnects. However, metallic interconnects continue to be degraded despite the lowered temperature, and their corrosion products contribute to electrical degradation in the fuel cell. coatings of nickel, chromium, aluminium, zinc, manganese, yttrium or lanthanum between the interconnect and the electrodes reduce this degradation during operation. (Author) 66 refs

  19. Driving Interconnected Networks to Supercriticality

    Directory of Open Access Journals (Sweden)

    Filippo Radicchi

    2014-04-01

    Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

  20. Laser printed interconnects for flexible electronics

    Science.gov (United States)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  1. Carbon nanotube and graphene nanoribbon interconnects

    CERN Document Server

    Das, Debaprasad

    2014-01-01

    "The book, Caron Nanotube and Graphene Nanoribbon Interconnects, authored by Drs. Debapraad Das and Hafizur Rahaman serves as a good source of material on CNT and GNR interconnects for readers who wish to get into this area and also for practicing engineers who would like to be updated in advances of this field."-Prof. Ashok Srivastava, Louisiana State University, Baton Rouge, USA"Mathematical analysis included in each and every chapter is the main strength of the materials. ... The book is very precise and useful for those who are working in this area. ... highly focused, very compact, and easy to apply. ... This book depicts a detailed analysis and modelling of carbon nanotube and graphene nanoribbon interconnects. The book also covers the electrical circuit modelling of carbon nanotubes and graphene nanoribbons."-Prof. Chandan Kumar Sarkar, Jadavpur University, Kolkata, India.

  2. Packaging and interconnection for superconductive circuitry

    International Nuclear Information System (INIS)

    Anacker, W.

    1976-01-01

    A three dimensional microelectronic module packaged for reduced signal propagation delay times including a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon is described. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconnection wiring to contact the lands of the circuit carrying means. Further interconnecting wiring may take the form of integrated circuit wiring on the reverse side of the supporting means. The low heat dissipation of the superconductive circuitry allows the circuit carrying means to be spaced approximately no less than 30 mils apart. The three dimensional arrangement provides lower random propagation delays than would a planar array of circuits

  3. Economic and environmental benefits of interconnected systems. The Spanish example

    International Nuclear Information System (INIS)

    Chicharro, A.S.; Dios Alija, R. de

    1996-01-01

    The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author)

  4. Hierarchically interconnected porous scaffolds for phase change materials with improved thermal conductivity and efficient solar-to-electric energy conversion.

    Science.gov (United States)

    Yang, Jie; Yu, Peng; Tang, Li-Sheng; Bao, Rui-Ying; Liu, Zheng-Ying; Yang, Ming-Bo; Yang, Wei

    2017-11-23

    An ice-templating self-assembly strategy and a vacuum impregnation method were used to fabricate polyethylene glycol (PEG)/hierarchical porous scaffold composite phase change materials (PCMs). Hierarchically interconnected porous scaffolds of boron nitride (BN), with the aid of a small amount of graphene oxide (GO), endow the composite PCMs with high thermal conductivity, excellent shape-stability and efficient solar-to-electric energy conversion. The formation of a three-dimensional (3D) thermally conductive pathway in the composites contributes to improving the thermal conductivity up to 2.36 W m -1 K -1 at a relatively low content of BN (ca. 23 wt%). This work provides a route for thermally conductive and shape-stabilized composite PCMs used as energy storage materials.

  5. A low-cost, manufacturable method for fabricating capillary and optical fiber interconnects for microfluidic devices.

    Science.gov (United States)

    Hartmann, Daniel M; Nevill, J Tanner; Pettigrew, Kenneth I; Votaw, Gregory; Kung, Pang-Jen; Crenshaw, Hugh C

    2008-04-01

    Microfluidic chips require connections to larger macroscopic components, such as light sources, light detectors, and reagent reservoirs. In this article, we present novel methods for integrating capillaries, optical fibers, and wires with the channels of microfluidic chips. The method consists of forming planar interconnect channels in microfluidic chips and inserting capillaries, optical fibers, or wires into these channels. UV light is manually directed onto the ends of the interconnects using a microscope. UV-curable glue is then allowed to wick to the end of the capillaries, fibers, or wires, where it is cured to form rigid, liquid-tight connections. In a variant of this technique, used with light-guiding capillaries and optical fibers, the UV light is directed into the capillaries or fibers, and the UV-glue is cured by the cone of light emerging from the end of each capillary or fiber. This technique is fully self-aligned, greatly improves both the quality and the manufacturability of the interconnects, and has the potential to enable the fabrication of interconnects in a fully automated fashion. Using these methods, including a semi-automated implementation of the second technique, over 10,000 interconnects have been formed in almost 2000 microfluidic chips made of a variety of rigid materials. The resulting interconnects withstand pressures up to at least 800psi, have unswept volumes estimated to be less than 10 femtoliters, and have dead volumes defined only by the length of the capillary.

  6. Cellular structures with interconnected microchannels

    Science.gov (United States)

    Shaefer, Robert Shahram; Ghoniem, Nasr M.; Williams, Brian

    2018-01-30

    A method for fabricating a cellular tritium breeder component includes obtaining a reticulated carbon foam skeleton comprising a network of interconnected ligaments. The foam skeleton is then melt-infiltrated with a tritium breeder material, for example, lithium zirconate or lithium titanate. The foam skeleton is then removed to define a cellular breeder component having a network of interconnected tritium purge channels. In an embodiment the ligaments of the foam skeleton are enlarged by adding carbon using chemical vapor infiltration (CVI) prior to melt-infiltration. In an embodiment the foam skeleton is coated with a refractory material, for example, tungsten, prior to melt infiltration.

  7. Interconnectivity: Benefits and Challenges

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2010-09-15

    Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

  8. 32 x 16 CMOS smart pixel array for optical interconnects

    Science.gov (United States)

    Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.

    2000-05-01

    Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

  9. Ontario's intertie capacity and electricity trade in the interconnected system

    International Nuclear Information System (INIS)

    Dorey, S.

    2002-01-01

    Hydro One's capacity of existing interconnections were described. The Ontario utility is within reach of about 320 GW electricity markets in neighbouring Quebec, New York, Michigan, Minnesota, and Manitoba. It is also within reach of 50 million customers, and 30 per cent of total U.S. energy consumption. The author emphasized the need for expanded interties and new interconnections. The status of new interconnections was described along with the rules regarding electric power import, export and wheeling. It was noted that compared to the United States, Canada has a higher proportion of clean hydro and nuclear power plants in its mix of power generation. Markets across North America are adopting electricity restructuring and open competition. However, the transmission grids were not designed to support market-driven electricity trading. Most transmission grids were built when utilities were tightly regulated and provided service only within their assigned regions. The current energy infrastructure is not equipped for large-scale swapping of power in competitive markets. It was also noted that growth in US power flows is outpacing transmission investment. This paper addressed the issue of license requirements, transmitter proposals for regulated investments, and non-rate base transmitter investments. It was concluded that while market rules are flexible enough to encourage inter-jurisdictional trade, the rules have to facilitate and encourage transmission investment. 8 figs

  10. Cross-border versus cross-sector interconnectivity in renewable energy systems

    International Nuclear Information System (INIS)

    Thellufsen, Jakob Zinck; Lund, Henrik

    2017-01-01

    In the transition to renewable energy systems, fluctuating renewable energy, such as wind and solar power, plays a large and important role. This creates a challenge in terms of meeting demands, as the energy production fluctuates based on weather patterns. To utilise high amounts of fluctuating renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection, and the second is cross-sector interconnection, i.e., the integration between different parts of an energy system, for instance heat and electricity. This paper seeks to compare the types of interconnectivity and discuss to which extent they are mutually beneficial. To do this, the study investigates two energy systems that represent Northern and Southern Europe. Both systems go through three developmental steps that increase the cross-sector interconnectivity. At each developmental step an increasing level of transmission capacities is examined to identify the benefits of cross-border interconnectivity. The results show that while both measures increase the system utilisation of renewable energy and the system efficiency, the cross-sector interconnection gives the best system performance. To analyse the possible interaction between cross-sector and cross-border interconnectivity, two main aspects have to be clarified. The first part defines the approach and the second is the construction of the two archetypes. - Highlights: • A method to investigate system integration and system interconnection is suggested. • The implementation is investigated across a Northern and Southern energy system. • The study identifies benefits of system integration and system interconnection. • The performance of the energy system benefits most from system integration.

  11. Fuel cell electrode interconnect contact material encapsulation and method

    Science.gov (United States)

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  12. Application of Trapezoidal-Shaped Characteristic Basis Functions to Arrays of Electrically Interconnected Antenna Elements

    NARCIS (Netherlands)

    Maaskant, R.; Mittra, R.; Tijhuis, A.G.; Graglia, R.D.

    2007-01-01

    This paper describes a novel technique for generating the characteristic basis functions (CBFs) used to represent the surface currents on finite arrays of electrically interconnected antenna elements. The CBFs are high-level basis functions, defined on subdomains in which the original problem is

  13. Three-dimensional interconnected porous graphitic carbon derived from rice straw for high performance supercapacitors

    Science.gov (United States)

    Jin, Hong; Hu, Jingpeng; Wu, Shichao; Wang, Xiaolan; Zhang, Hui; Xu, Hui; Lian, Kun

    2018-04-01

    Three-dimensional interconnected porous graphitic carbon materials are synthesized via a combination of graphitization and activation process with rice straw as the carbon source. The physicochemical properties of the three-dimensional interconnected porous graphitic carbon materials are characterized by Nitrogen adsorption/desorption, Fourier-transform infrared spectroscopy, X-ray diffraction, Raman spectroscopy, Scanning electron microscopy and Transmission electron microscopy. The results demonstrate that the as-prepared carbon is a high surface area carbon material (a specific surface area of 3333 m2 g-1 with abundant mesoporous and microporous structures). And it exhibits superb performance in symmetric double layer capacitors with a high specific capacitance of 400 F g-1 at a current density of 0.1 A g-1, good rate performance with 312 F g-1 under a current density of 5 A g-1 and favorable cycle stability with 6.4% loss after 10000 cycles at a current density of 5 A g-1 in the aqueous electrolyte of 6M KOH. Thus, rice straw is a promising carbon source for fabricating inexpensive, sustainable and high performance supercapacitors' electrode materials.

  14. Architecture-Level Exploration of Alternative Interconnection Schemes Targeting 3D FPGAs: A Software-Supported Methodology

    Directory of Open Access Journals (Sweden)

    Kostas Siozios

    2008-01-01

    Full Text Available In current reconfigurable architectures, the interconnection structures increasingly contribute more to the delay and power consumption. The demand for increased clock frequencies and logic density (smaller area footprint makes the problem even more important. Three-dimensional (3D architectures are able to alleviate this problem by accommodating a number of functional layers, each of which might be fabricated in different technology. However, the benefits of such integration technology have not been sufficiently explored yet. In this paper, we propose a software-supported methodology for exploring and evaluating alternative interconnection schemes for 3D FPGAs. In order to support the proposed methodology, three new CAD tools were developed (part of the 3D MEANDER Design Framework. During our exploration, we study the impact of vertical interconnection between functional layers in a number of design parameters. More specifically, the average gains in operation frequency, power consumption, and wirelength are 35%, 32%, and 13%, respectively, compared to existing 2D FPGAs with identical logic resources. Also, we achieve higher utilization ratio for the vertical interconnections compared to existing approaches by 8% for designing 3D FPGAs, leading to cheaper and more reliable devices.

  15. Cost based interconnection charges as a way to induce competition

    DEFF Research Database (Denmark)

    Falch, Morten

    The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debat...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

  16. Cross-border versus cross-sector interconnectivity in renewable energy systems

    DEFF Research Database (Denmark)

    Thellufsen, Jakob Zinck; Lund, Henrik

    2017-01-01

    renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection...... systems that represent Northern and Southern Europe. Both systems go through three developmental steps that increase the cross-sector interconnectivity. At each developmental step an increasing level of transmission capacities is examined to identify the benefits of cross-border interconnectivity...

  17. Digital optical interconnects for photonic computing

    Science.gov (United States)

    Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.

    1994-05-01

    A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

  18. Analysis of interconnecting energy systems over a synchronized life cycle

    International Nuclear Information System (INIS)

    Nian, Victor

    2016-01-01

    Highlights: • A methodology is developed for evaluating a life cycle of interconnected systems. • A new concept of partial temporal boundary is introduced via quantitative formulation. • The interconnecting systems are synchronized through the partial temporal boundary. • A case study on the life cycle of the coal–uranium system is developed. - Abstract: Life cycle analysis (LCA) using the process chain analysis (PCA) approach has been widely applied to energy systems. When applied to an individual energy system, such as coal or nuclear electricity generation, an LCA–PCA methodology can yield relatively accurate results with its detailed process representation based on engineering data. However, there are fundamental issues when applying conventional LCA–PCA methodology to a more complex life cycle, namely, a synchronized life cycle of interconnected energy systems. A synchronized life cycle of interconnected energy systems is established through direct interconnections among the processes of different energy systems, and all interconnecting systems are bounded within the same timeframe. Under such a life cycle formation, there are some major complications when applying conventional LCA–PCA methodology to evaluate the interconnecting energy systems. Essentially, the conventional system and boundary formulations developed for a life cycle of individual energy system cannot be directly applied to a life cycle of interconnected energy systems. To address these inherent issues, a new LCA–PCA methodology is presented in this paper, in which a new concept of partial temporal boundary is introduced to synchronize the interconnecting energy systems. The importance and advantages of these new developments are demonstrated through a case study on the life cycle of the coal–uranium system.

  19. Distributed Energy Resources Interconnection Systems: Technology Review and Research Needs

    Energy Technology Data Exchange (ETDEWEB)

    Friedman, N. R.

    2002-09-01

    Interconnecting distributed energy resources (DER) to the electric utility grid (or Area Electric Power System, Area EPS) involves system engineering, safety, and reliability considerations. This report documents US DOE Distribution and Interconnection R&D (formerly Distributed Power Program) activities, furthering the development and safe and reliable integration of DER interconnected with our nation's electric power systems. The key to that is system integration and technology development of the interconnection devices that perform the functions necessary to maintain the safety, power quality, and reliability of the EPS when DER are connected to it.

  20. Interconnecting with VIPs

    Science.gov (United States)

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  1. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  2. 14 CFR 29.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow between them due to gravity or flight accelerations, it must be impossible for fuel to flow between tanks in...

  3. Spine-like Nanostructured Carbon Interconnected by Graphene for High-performance Supercapacitors

    Science.gov (United States)

    Park, Sang-Hoon; Yoon, Seung-Beom; Kim, Hyun-Kyung; Han, Joong Tark; Park, Hae-Woong; Han, Joah; Yun, Seok-Min; Jeong, Han Gi; Roh, Kwang Chul; Kim, Kwang-Bum

    2014-08-01

    Recent studies on supercapacitors have focused on the development of hierarchical nanostructured carbons by combining two-dimensional graphene and other conductive sp2 carbons, which differ in dimensionality, to improve their electrochemical performance. Herein, we report a strategy for synthesizing a hierarchical graphene-based carbon material, which we shall refer to as spine-like nanostructured carbon, from a one-dimensional graphitic carbon nanofiber by controlling the local graphene/graphitic structure via an expanding process and a co-solvent exfoliation method. Spine-like nanostructured carbon has a unique hierarchical structure of partially exfoliated graphitic blocks interconnected by thin graphene sheets in the same manner as in the case of ligaments. Owing to the exposed graphene layers and interconnected sp2 carbon structure, this hierarchical nanostructured carbon possesses a large, electrochemically accessible surface area with high electrical conductivity and exhibits high electrochemical performance.

  4. Reactive power interconnection requirements for PV and wind plants : recommendations to NERC.

    Energy Technology Data Exchange (ETDEWEB)

    McDowell, Jason (General Electric, Schenectady, NY); Walling, Reigh (General Electric, Schenectady, NY); Peter, William (SunPower, Richmond, CA); Von Engeln, Edi (NV Energy, Reno, NV); Seymour, Eric (AEI, Fort Collins, CO); Nelson, Robert (Siemens Wind Turbines, Orlando, FL); Casey, Leo (Satcon, Boston, MA); Ellis, Abraham; Barker, Chris. (SunPower, Richmond, CA)

    2012-02-01

    Voltage on the North American bulk system is normally regulated by synchronous generators, which typically are provided with voltage schedules by transmission system operators. In the past, variable generation plants were considered very small relative to conventional generating units, and were characteristically either induction generator (wind) or line-commutated inverters (photovoltaic) that have no inherent voltage regulation capability. However, the growing level of penetration of non-traditional renewable generation - especially wind and solar - has led to the need for renewable generation to contribute more significantly to power system voltage control and reactive power capacity. Modern wind-turbine generators, and increasingly PV inverters as well, have considerable dynamic reactive power capability, which can be further enhanced with other reactive support equipment at the plant level to meet interconnection requirements. This report contains a set of recommendations to the North-America Electricity Reliability Corporation (NERC) as part of Task 1-3 (interconnection requirements) of the Integration of Variable Generation Task Force (IVGTF) work plan. The report discusses reactive capability of different generator technologies, reviews existing reactive power standards, and provides specific recommendations to improve existing interconnection standards.

  5. The impact of increased interconnection on electricity systems with large penetrations of wind generation. A case study of Ireland and Great Britain

    International Nuclear Information System (INIS)

    Denny, E.; Tuohy, A.; Keane, A.; Flynn, D.; O'Malley, M.; Meibom, P.; Mullane, A.

    2010-01-01

    Increased interconnection has been highlighted as potentially facilitating the integration of wind generation in power systems by increasing the flexibility to balance the variable wind output. This paper utilizes a stochastic unit commitment model to simulate the impacts of increased interconnection for the island of Ireland with large penetrations of wind generation. The results suggest that increased interconnection should reduce average prices in Ireland, and the variability of those prices. The simulations also suggest that while increased interconnection may reduce carbon dioxide emissions in Ireland, Great Britain would experience an increase in emissions, resulting in total emissions remaining almost unchanged. The studies suggest that increased interconnection would not reduce excess wind generation. This is because under unit commitment techniques which incorporate wind power forecasts in the scheduling decisions, wind curtailment is minimal even with low levels of interconnection. As would be expected an increase in interconnection should improve system adequacy considerably with a significant reduction in the number of hours when the load and reserve constraints are not met. (author)

  6. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    International Nuclear Information System (INIS)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-01-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

  7. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    Energy Technology Data Exchange (ETDEWEB)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-05-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

  8. Architecture for on-die interconnect

    Science.gov (United States)

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  9. Sound insulation performance of plates with interconnected distributed piezoelectric patches

    Directory of Open Access Journals (Sweden)

    Yi Kaijun

    2017-02-01

    Full Text Available This paper deals with the sound insulation performance of a thin plate with interconnected distributed piezoelectric patches. Piezoelectric patches are periodically bonded on the surfaces of the plate in a collocated fashion, and are interconnected via an inductive circuit network. This piezoelectric system is termed as piezo-electromechanical (PEM plate in the paper. Homogenization methods are involved under a sub-wavelength assumption to analytically develop the dynamical equations for the PEM plate. The dispersion relationships and energy densities of the wave modes propagating in the PEM plate are studied; the sub-wavelength assumption is verified for the simulations in this paper. The coincidence frequency of the PEM plate is researched, and results show that the coincidence frequency of the PEM plate will disappear at certain circumstances; mathematical and physical explanations are made for this phenomenon. The disappearance of the coincidence frequency is used to optimize the value of inductance, for the purpose of improving the sound transmission loss of the PEM plate.

  10. Essays on optimal capacity and optimal regulation of interconnection infrastructures

    Science.gov (United States)

    Boffa, Federico

    The integration between geographically differentiated markets or between vertically related industries generate effects on welfare that depend on the structure of the underlying markets. My thesis investigates the impact of geographical interconnection on welfare, and illustrates welfare-enhancing modes of regulation of vertically integrated industries and of geographically integrated markets. The first chapter analyzes the effects of interconnection between two formerly fully-separated markets under the assumptions that producers in the two markets are capacity-constrained, and tacitly collude whenever it is rational for them to do so. I find that there exists a set of assumptions under which interconnection brings about greater collusion, hence it reduces overall welfare. The second chapter analyzes the optimal interconnection capacity allocation mechanism for a benevolent electricity regulator when generation is not competitive. The regulator's intervention should not only ensure that interconnection capacity is efficiently allocated to the most efficient firms, but it should also induce a higher welfare in the upstream generation market. In a two-node setting, with one firm per node, I show that the regulatory intervention becomes more effective as the cost asymmetries between the two firms become more pronounced. The third chapter illustrates a regulation mechanism for vertically related industries. Ownership shares of the upstream industry (that displays economies of scale) are allocated to the downstream (competitive) firms in proportion to their shares in the final goods market. I show that the mechanism combines the benefits of vertical integration with those of vertical separation. The advantages of vertical integration consist in avoiding double marginalization, and in internalizing the reduction in average cost resulting from the upstream increase in output; on the other hand, vertical separation allows to preserve the competitiveness of the downstream

  11. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  12. National Offshore Wind Energy Grid Interconnection Study Full Report

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  13. Overcoming Barriers to Rural Children's Mental Health: An Interconnected Systems Public Health Model

    Science.gov (United States)

    Huber, Brenda J.; Austen, Julie M.; Tobin, Renée M.; Meyers, Adena B.; Shelvin, Kristal H.; Wells, Michael

    2016-01-01

    A large, Midwestern county implemented a four-tiered public health model of children's mental health with an interconnected systems approach involving education, health care, juvenile justice and community mental health sectors. The community sought to promote protective factors in the lives of all youth, while improving the capacity,…

  14. New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response

    Directory of Open Access Journals (Sweden)

    El-Sayed A. El-Badawy

    2008-02-01

    Full Text Available Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton. Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

  15. Reinforcing electricity network cross border capacity: utility evaluation of a commercial interconnection between Belgium and Germany

    International Nuclear Information System (INIS)

    Dinko, Raytchev

    2004-01-01

    The emergence of a common European electricity market means that more exchange of electrical power between countries will be needed. Basically, there are two ways to accelerate the international trade in electricity: 1) improve the current methods of allocation of existing cross border capacity and 2) reinforce the network by building new capacity. The present paper deals only with the latter topic which is not well explored by the economic literature. The first section underlines the importance of encouraging the construction of a new cross border capacity. Then, using a concrete example - the possible construction of an interconnection line between Belgium and Germany - we discuss some questions concerning the installation of a new cross border capacity. We propose a new identification method for positioning of the interconnection line based on the examination of the energy balance of adjacent regions (section 2). The macro-economic analysis (section 3) and the revision of the institutions involved in the decision process (section 4) show that the three regions located at the German-Belgian border - the Rhineland-Palatinat, the Rhineland-of-North-Westphalia from the German side and Wallonia from the Belgian side-should be interested in building and operating the new electricity tie-line. (authors)

  16. Interconnecting Carbon Fibers with the In-situ Electrochemically Exfoliated Graphene as Advanced Binder-free Electrode Materials for Flexible Supercapacitor

    OpenAIRE

    Yuqin Zou; Shuangyin Wang

    2015-01-01

    Flexible energy storage devices are highly demanded for various applications. Carbon cloth (CC) woven by carbon fibers (CFs) is typically used as electrode or current collector for flexible devices. The low surface area of CC and the presence of big gaps (ca. micro-size) between individual CFs lead to poor performance. Herein, we interconnect individual CFs through the in-situ exfoliated graphene with high surface area by the electrochemical intercalation method. The interconnected CFs are us...

  17. Modeling of HVDC System to Improve Estimation of Transient DC Current and Voltages for AC Line-to-Ground Fault—An Actual Case Study in Korea

    Directory of Open Access Journals (Sweden)

    Dohoon Kwon

    2017-10-01

    Full Text Available A new modeling method for high voltage direct current (HVDC systems and associated controllers is presented for the power system simulator for engineering (PSS/E simulation environment. The aim is to improve the estimation of the transient DC voltage and current in the event of an AC line-to-ground fault. The proposed method consists primary of three interconnected modules for (a equation conversion; (b control-mode selection; and (c DC-line modeling. Simulation case studies were carried out using PSS/E and a power systems computer aided design/electromagnetic transients including DC (PSCAD/EMTDC model of the Jeju– Haenam HVDC system in Korea. The simulation results are compared with actual operational data and the PSCAD/EMTDC simulation results for an HVDC system during single-phase and three-phase line-to-ground faults, respectively. These comparisons show that the proposed PSS/E modeling method results in the improved estimation of the dynamic variation in the DC voltage and current in the event of an AC network fault, with significant gains in computational efficiency, making it suitable for real-time analysis of HVDC systems.

  18. Optics vs copper: from the perspective of "Thunderbolt" interconnect technology

    Science.gov (United States)

    Cheng, Hengju; Krause, Christine; Ko, Jamyuen; Gao, Miaobin; Liu, Guobin; Wu, Huichin; Qi, Mike; Lam, Chun-Chit

    2013-02-01

    Interconnect technology has been progressed at a very fast pace for the past decade. The signaling rates have steadily increased from 100:Mb/s to 25Gb/s. In every generation of interconnect technology evolution, optics always seems to take over at first, however, at the end, the cost advantage of copper wins over. Because of this, optical interconnects are limited to longer distance links where the attenuation in copper cable is too large for the integrated circuits to compensate. Optical interconnect has long been viewed as the premier solution in compared with copper interconnect. With the release of Thunderbolt technology, we are entering a new era in consumer electronics that runs at 10Gb/s line rate (20Gb/s throughput per connector interface). Thunderbolt interconnect technology includes both active copper cables and active optical cables as the transmission media which have very different physical characteristics. In order for optics to succeed in consumer electronics, several technology hurdles need to be cleared. For example, the optical cable needs to handle the consumer abuses such as pinch and bend. Also, the optical engine used in the active optical cable needs to be physically very small so that we don't change the looks and feels of the cable/connector. Most importantly, the cost of optics needs to come down significantly to effectively compete with the copper solution. Two interconnect technologies are compared and discussed on the relative cost, power consumption, form factor, density, and future scalability.

  19. Fusion-bonded fluidic interconnects

    NARCIS (Netherlands)

    Fazal, I.; Elwenspoek, Michael Curt

    2008-01-01

    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are

  20. All-zigzag graphene nanoribbons for planar interconnect application

    Science.gov (United States)

    Chen, Po-An; Chiang, Meng-Hsueh; Hsu, Wei-Chou

    2017-07-01

    A feasible "lightning-shaped" zigzag graphene nanoribbon (ZGNR) structure for planar interconnects is proposed. Based on the density functional theory and non-equilibrium Green's function, the electron transport properties are evaluated. The lightning-shaped structure increases significantly the conductance of the graphene interconnect with an odd number of zigzag chains. This proposed technique can effectively utilize the linear I-V characteristic of asymmetric ZGNRs for interconnect application. Variability study accounting for width/length variation and the edge effect is also included. The transmission spectra, transmission eigenstates, and transmission pathways are analyzed to gain the physical insights. This lightning-shaped ZGNR enables all 2D material-based devices and circuits on flexible and transparent substrates.

  1. Interconnected Silicon Hollow Nanospheres for Lithium-Ion Battery Anodes with Long Cycle Life

    KAUST Repository

    Yao, Yan

    2011-07-13

    Silicon is a promising candidate for the anode material in lithium-ion batteries due to its high theoretical specific capacity. However, volume changes during cycling cause pulverization and capacity fade, and improving cycle life is a major research challenge. Here, we report a novel interconnected Si hollow nanosphere electrode that is capable of accommodating large volume changes without pulverization during cycling. We achieved the high initial discharge capacity of 2725 mAh g-1 with less than 8% capacity degradation every hundred cycles for 700 total cycles. Si hollow sphere electrodes also show a Coulombic efficiency of 99.5% in later cycles. Superior rate capability is demonstrated and attributed to fast lithium diffusion in the interconnected Si hollow structure. © 2011 American Chemical Society.

  2. Optical interconnect for large-scale systems

    Science.gov (United States)

    Dress, William

    2013-02-01

    This paper presents a switchless, optical interconnect module that serves as a node in a network of identical distribution modules for large-scale systems. Thousands to millions of hosts or endpoints may be interconnected by a network of such modules, avoiding the need for multi-level switches. Several common network topologies are reviewed and their scaling properties assessed. The concept of message-flow routing is discussed in conjunction with the unique properties enabled by the optical distribution module where it is shown how top-down software control (global routing tables, spanning-tree algorithms) may be avoided.

  3. Electricity and gas interconnections in France. A tool for the construction of an integrated European market

    International Nuclear Information System (INIS)

    2016-06-01

    The French Energy Regulator (CRE) is publishing its report on French electricity and gas interconnections. The report makes two main conclusions: French electricity and natural gas networks are well interconnected with their counterparts in neighbouring countries and the use of interconnections has been significantly improved over the last 10 years. In terms of electricity, France's average export capacity is 13.5 GW, i.e. more than 10% of its production capacity. France is very well integrated in the European gas market and is a transit country to Spain and Italy. It has boosted its interconnection capacity in gas by 40% in 10 years. Interconnections are vital to the internal energy market and help trade between Member States. They enable European consumers to benefit from cost-effective energy by diversifying sources of supply. Since it was created, the CRE has played a leading role in this area, by fostering the development of interconnections at the French borders and by making them more efficiently used. After major efforts, the question of creating new interconnections (which constitute complex and costly projects) is now being raised. In terms of gas, the Midcat Project (a new gas interconnection between France and Spain) provides a good illustration of this question. The project will cost almost 3 billion Euros, two billion of which is being funded by France, and the decision to launch it should not be taken lightly without robust cost-benefit analyses. These studies must, in particular, identify and quantify the benefits for each country concerned as well as for the European Union, and organise the project funding in relation to these benefits. As concerns the interconnection project in the Bay of Biscay between France and Spain, overcoming technical uncertainties is an essential prerequisite before commenting on the opportunities it offers in terms of the costs and benefits that it might generate. In compliance with the law, the CRE acts on behalf of

  4. Smart City Reference Model: Interconnectivity for On-Demand User to Service Authentication

    Directory of Open Access Journals (Sweden)

    Michael Strasser

    2016-05-01

    Full Text Available The Internet of Things and Services (IoTS has encouraged the development of service provisioning systems in respect to Smart City topics. Most of them are operated as heterogeneous systems which limits end customers’ access and contradicts with IoTS principles. In this paper, we discuss and develop a reference model of an interconnected service marketplace ecosystem. The prototypical implementation incorporates findings from an empirical study and lessons learned from research projects. The elaborated ecosystem enables service request roaming between different parties across system boundaries. The paper presents a feasible centralized architecture, introduces involved parties and parts of a developed message protocol. Why a contracting mechanism is indispensable for request roaming is also outlined. The model’s feasibility is demonstrated by means of a current electric mobility use case: providing access to foreign charging infrastructure without multiple registrations. This work contributes to simplify the data exchange between service platforms to improve Smart City solutions and to support travelers with intelligent mobility applications.

  5. Influence of Mn-Co Spinel Coating on Oxidation Behavior of Ferritic SS Alloys for SOFC Interconnect Applications

    DEFF Research Database (Denmark)

    Venkatachalam, Vinothini; Molin, Sebastian; Kiebach, Wolff-Ragnar

    2014-01-01

    Chromia forming ferritic stainless steels (SS) are being considered for intermediate temperature solid oxide fuel cell interconnect applications. However, protective coatings are in general needed to avoid chromium volatilization and poisoning of cathodes from chromium species. Mn-Co spinel is one...... of the promising candidates to prevent chromium outward diffusion, improve oxidation resistance and ensure high electrical conductivity over the lifetime of interconnects. In the present study, uniform and well adherent Mn-Co spinel coatings were produced on Crofer 22APU using electrophoretic deposition (EPD...

  6. Opto-Electronic and Interconnects Hierarchical Design Automation System (OE-IDEAS)

    National Research Council Canada - National Science Library

    Turowski, M

    2004-01-01

    As microelectronics technology continues to advance, the associated electrical interconnection technology is not likely to keep pace, due to many parasitic effects appearing in metallic interconnections...

  7. High-density hybrid interconnect methodologies

    International Nuclear Information System (INIS)

    John, J.; Zimmermann, L.; Moor, P.De; Hoof, C.Van

    2003-01-01

    Full text: The presentation gives an overview of the state-of-the-art of hybrid integration and in particular the IMEC technological approaches that will be able to address future hybrid detector needs. The dense hybrid flip-chip integration of an array of detectors and its dedicated readout electronics can be achieved with a variety of solderbump techniques such as pure Indium or Indium alloys, Ph-In, Ni/PbSn, but also conducting polymers... Particularly for cooled applications or ultra-high density applications, Indium solderbump technology (electroplated or evaporated) is the method of choice. The state-of-the-art of solderbump technologies that are to a high degree independent of the underlying detector material will be presented and examples of interconnect densities between 5x1E4cm-2 and 1x1E6 cm-2 will be demonstrated. For several classes of detectors, flip-chip integration is not allowed since the detectors have to be illuminated from the top. This applies to image sensors for EUV applications such as GaN/AlGaN based detectors and to MEMS-based sensors. In such cases, the only viable interconnection method has to be through the (thinned) detector wafer followed by a solderbump-based integration. The approaches for dense and ultra-dense through-the-wafer interconnect 'vias' will be presented and wafer thinning approaches will be shown

  8. A model-based prognostic approach to predict interconnect failure using impedance analysis

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Dae Il; Yoon, Jeong Ah [Dept. of System Design and Control Engineering. Ulsan National Institute of Science and Technology, Ulsan (Korea, Republic of)

    2016-10-15

    The reliability of electronic assemblies is largely affected by the health of interconnects, such as solder joints, which provide mechanical, electrical and thermal connections between circuit components. During field lifecycle conditions, interconnects are often subjected to a DC open circuit, one of the most common interconnect failure modes, due to cracking. An interconnect damaged by cracking is sometimes extremely hard to detect when it is a part of a daisy-chain structure, neighboring with other healthy interconnects that have not yet cracked. This cracked interconnect may seem to provide a good electrical contact due to the compressive load applied by the neighboring healthy interconnects, but it can cause the occasional loss of electrical continuity under operational and environmental loading conditions in field applications. Thus, cracked interconnects can lead to the intermittent failure of electronic assemblies and eventually to permanent failure of the product or the system. This paper introduces a model-based prognostic approach to quantitatively detect and predict interconnect failure using impedance analysis and particle filtering. Impedance analysis was previously reported as a sensitive means of detecting incipient changes at the surface of interconnects, such as cracking, based on the continuous monitoring of RF impedance. To predict the time to failure, particle filtering was used as a prognostic approach using the Paris model to address the fatigue crack growth. To validate this approach, mechanical fatigue tests were conducted with continuous monitoring of RF impedance while degrading the solder joints under test due to fatigue cracking. The test results showed the RF impedance consistently increased as the solder joints were degraded due to the growth of cracks, and particle filtering predicted the time to failure of the interconnects similarly to their actual timesto- failure based on the early sensitivity of RF impedance.

  9. Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors

    Energy Technology Data Exchange (ETDEWEB)

    Andricek, L. [Halbleiterlabor der Max-Planck-Gesellschaft, Otto Hahn Ring 6, D-81739 München (Germany); Beimforde, M.; Macchiolo, A.; Moser, H.-G. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, D-80805 München (Germany); Nisius, R., E-mail: Richard.Nisius@mpp.mpg.de [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, D-80805 München (Germany); Richter, R.H. [Halbleiterlabor der Max-Planck-Gesellschaft, Otto Hahn Ring 6, D-81739 München (Germany); Terzo, S.; Weigell, P. [Max-Planck-Institut für Physik (Werner-Heisenberg-Institut), Föhringer Ring 6, D-80805 München (Germany)

    2014-09-11

    The performance of pixel modules built from 75 μm thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 μm thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of 10{sup 16}n{sub eq}/cm{sup 2}.

  10. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    Energy Technology Data Exchange (ETDEWEB)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-12-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

  11. Report of the French Energy Regulator on electricity interconnection management and use in 2006

    International Nuclear Information System (INIS)

    2007-01-01

    This report aims at, first, evaluating the congestion management methods in force at interconnected power systems managed by the French transmission system operator RTE as required by article 1.10 of the guidelines of 1228/2003 European regulation which foresees that: 'the national regulation authorities regularly evaluates the congestion management methods, in particular by controlling the respect of rules and principles established by the European regulation, and of trends, modalities and conditions fixed by the regulation authorities according to the above principles and rules'. It aims also at sharing the opinions of the commission of energy regulation (CRE) with other European regulating authorities and with all stakeholders involved in the domestic power market, about the management and use of European power interconnections in 2006. Content: 1 - 2005-2006, the turning point for congestion management; 2 - consequences of 2055-2006 changes in interconnections with Germany, Belgium, Spain and Italy; 3 - further improvements still required: allocation system, capacity bids, short-term trades, capacity management in compliance with European law; 4 - conclusion: an indispensable regional approach. (J.S.)

  12. Stability Analysis of Interconnected Fuzzy Systems Using the Fuzzy Lyapunov Method

    Directory of Open Access Journals (Sweden)

    Ken Yeh

    2010-01-01

    Full Text Available The fuzzy Lyapunov method is investigated for use with a class of interconnected fuzzy systems. The interconnected fuzzy systems consist of J interconnected fuzzy subsystems, and the stability analysis is based on Lyapunov functions. Based on traditional Lyapunov stability theory, we further propose a fuzzy Lyapunov method for the stability analysis of interconnected fuzzy systems. The fuzzy Lyapunov function is defined in fuzzy blending quadratic Lyapunov functions. Some stability conditions are derived through the use of fuzzy Lyapunov functions to ensure that the interconnected fuzzy systems are asymptotically stable. Common solutions can be obtained by solving a set of linear matrix inequalities (LMIs that are numerically feasible. Finally, simulations are performed in order to verify the effectiveness of the proposed stability conditions in this paper.

  13. Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

    Science.gov (United States)

    Peter, Geoffrey John M.

    With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect

  14. 75 FR 40815 - PJM Interconnection, L.L.C.; Notice of Filing

    Science.gov (United States)

    2010-07-14

    ... Interconnection, L.L.C.; Notice of Filing July 7, 2010. Take notice that on July 1, 2010, PJM Interconnection, L.L.C. (PJM) filed revised sheets to Schedule 1 of the Amended and Restated Operating Agreement of PJM Interconnection, L.L.C. (Operating Agreement) and the parallel provisions of Attachment K--Appendix of the PJM...

  15. 75 FR 22773 - PJM Interconnection, L.L.C.; Notice of Filing

    Science.gov (United States)

    2010-04-30

    ... Interconnection, L.L.C.; Notice of Filing April 23, 2010. Take notice that on April 22, 2010, PJM Interconnection, L.L.C. (PJM) filed revised tariff sheets to its Schedule 1 of the Amended and Restated Operating... (Commission) March 23, 2010 Order on Compliance Filing, PJM Interconnection, L.L.C., 130 FERC ] 61,230 (2010...

  16. 77 FR 34378 - PJM Interconnection, L.L.C.; Notice of Complaint

    Science.gov (United States)

    2012-06-11

    ... Interconnection, L.L.C.; Notice of Complaint Take notice that on June 1, 2012, pursuant to section 206 of the Federal Power Act (FPA), 16 U.S.C. 824(e), PJM Interconnection, L.L.C. (PJM) filed proposed revisions to the Amended and Restated Operating Agreement of PJM Interconnection L.L.C. (Operating Agreement) to...

  17. New transmission interconnection reduces consumer costs

    Energy Technology Data Exchange (ETDEWEB)

    Anon.

    2008-09-15

    The Central American electric interconnection system (SIEPAC) project will involve the construction of a 1830 km 230 kV transmission system that will link Guatemala, El Salvador, Honduras, Costa Rica, Nicaragua, and Panama. The system is expected to alleviate the region's power shortages and reduce electricity costs for consumers. Costs for the SIEPAC project have been estimated at $370 million. The system will serve approximately 37 million customers, and will include 15 substations. The contract for building the electrical equipment has been awarded to Schweitzer Engineering Laboratories (SEL) who plan to manufacture components at a plant in Mexico. The equipment will include high speed line protection, automation, and control systems. Line current differential systems and satellite-synchronized clocks will also be used. The new transmission system is expected to be fully operational by 2009. 1 fig.

  18. Circuit and interconnect design for high bit-rate applications

    NARCIS (Netherlands)

    Veenstra, H.

    2006-01-01

    This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate

  19. Area array interconnection handbook

    CERN Document Server

    Totta, Paul A

    2012-01-01

    Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later famil...

  20. Fiber bundle probes for interconnecting miniaturized medical imaging devices

    Science.gov (United States)

    Zamora, Vanessa; Hofmann, Jens; Marx, Sebastian; Herter, Jonas; Nguyen, Dennis; Arndt-Staufenbiel, Norbert; Schröder, Henning

    2017-02-01

    Miniaturization of medical imaging devices will significantly improve the workflow of physicians in hospitals. Photonic integrated circuit (PIC) technologies offer a high level of miniaturization. However, they need fiber optic interconnection solutions for their functional integration. As part of European funded project (InSPECT) we investigate fiber bundle probes (FBPs) to be used as multi-mode (MM) to single-mode (SM) interconnections for PIC modules. The FBP consists of a set of four or seven SM fibers hexagonally distributed and assembled into a holder that defines a multicore connection. Such a connection can be used to connect MM fibers, while each SM fiber is attached to the PIC module. The manufacturing of these probes is explored by using well-established fiber fusion, epoxy adhesive, innovative adhesive and polishing techniques in order to achieve reliable, low-cost and reproducible samples. An innovative hydrofluoric acid-free fiber etching technology has been recently investigated. The preliminary results show that the reduction of the fiber diameter shows a linear behavior as a function of etching time. Different etch rate values from 0.55 μm/min to 2.3 μm/min were found. Several FBPs with three different type of fibers have been optically interrogated at wavelengths of 630nm and 1550nm. Optical losses are found of approx. 35dB at 1550nm for FBPs composed by 80μm fibers. Although FBPs present moderate optical losses, they might be integrated using different optical fibers, covering a broad spectral range required for imaging applications. Finally, we show the use of FBPs as promising MM-to-SM interconnects for real-world interfacing to PIC's.

  1. Production process for advanced space satellite system cables/interconnects.

    Energy Technology Data Exchange (ETDEWEB)

    Mendoza, Luis A.

    2007-12-01

    This production process was generated for the satellite system program cables/interconnects group, which in essences had no well defined production process. The driver for the development of a formalized process was based on the set backs, problem areas, challenges, and need improvements faced from within the program at Sandia National Laboratories. In addition, the formal production process was developed from the Master's program of Engineering Management for New Mexico Institute of Mining and Technology in Socorro New Mexico and submitted as a thesis to meet the institute's graduating requirements.

  2. Welfare and competition effects of electricity interconnection between Ireland and Great Britain

    International Nuclear Information System (INIS)

    Malaguzzi Valeri, Laura

    2009-01-01

    This study analyzes the effects of additional interconnection on welfare and competition in the Irish electricity market. I simulate the wholesale electricity markets of the island of Ireland and Great Britain for 2005. I find that in order for the two markets to be integrated in 2005, additional interconnection would have to be large. The amount of interconnection decreases for high costs of carbon, since this causes the markets to become more similar. This suggests that in the absence of strategic behavior of firms, most of the gains from trade derive not from differences in size between countries, but from technology differences and are strongly influenced by fuel and carbon costs. Social welfare increases with interconnection, although at a decreasing rate. As the amount of interconnection increases, there are also positive effects on competition in Ireland, the less competitive of the two markets. Finally, it is unlikely that private investors will pay for the optimal amount of interconnection since their returns are significantly smaller than the total social benefit of interconnection. (author)

  3. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

    Directory of Open Access Journals (Sweden)

    Salman Shafqat

    2017-09-01

    Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

  4. Interconnection network architectures based on integrated orbital angular momentum emitters

    Science.gov (United States)

    Scaffardi, Mirco; Zhang, Ning; Malik, Muhammad Nouman; Lazzeri, Emma; Klitis, Charalambos; Lavery, Martin; Sorel, Marc; Bogoni, Antonella

    2018-02-01

    Novel architectures for two-layer interconnection networks based on concentric OAM emitters are presented. A scalability analysis is done in terms of devices characteristics, power budget and optical signal to noise ratio by exploiting experimentally measured parameters. The analysis shows that by exploiting optical amplifications, the proposed interconnection networks can support a number of ports higher than 100. The OAM crosstalk induced-penalty, evaluated through an experimental characterization, do not significantly affect the interconnection network performance.

  5. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  6. Global On-Chip Differential Interconnects with Optimally-Placed Twists

    NARCIS (Netherlands)

    Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria; Nauta, Bram

    2005-01-01

    Global on-chip communication is receiving quite some attention as global interconnects are rapidly becoming a speed, power and reliability bottleneck for digital CMOS systems. Recently, we proposed a bus-transceiver test chip in 0.13 μm CMOS using 10 mm long uninterrupted differential interconnects

  7. 76 FR 16405 - Notice of Attendance at PJM INterconnection, L.L.C., Meetings

    Science.gov (United States)

    2011-03-23

    ... INterconnection, L.L.C., Meetings The Federal Energy Regulatory Commission (Commission) hereby gives notice that members of the Commission and Commission staff may attend upcoming PJM Interconnection, L.L.C., (PJM...: Docket No. EL05-121, PJM Interconnection, L.L.C. Docket No. ER06-456, PJM Interconnection, L.L.C. Docket...

  8. Time Domain Analysis of Graphene Nanoribbon Interconnects Based on Transmission Line ‎Model

    Directory of Open Access Journals (Sweden)

    S. Haji Nasiri

    2012-03-01

    Full Text Available Time domain analysis of multilayer graphene nanoribbon (MLGNR interconnects, based on ‎transmission line modeling (TLM using a six-order linear parametric expression, has been ‎presented for the first time. We have studied the effects of interconnect geometry along with ‎its contact resistance on its step response and Nyquist stability. It is shown that by increasing ‎interconnects dimensions their propagation delays are increased and accordingly the system ‎becomes relatively more stable. In addition, we have compared time responses and Nyquist ‎stabilities of MLGNR and SWCNT bundle interconnects, with the same external dimensions. ‎The results show that under the same conditions, the propagation delays for MLGNR ‎interconnects are smaller than those of SWCNT bundle interconnects are. Hence, SWCNT ‎bundle interconnects are relatively more stable than their MLGNR rivals.‎

  9. Assessment of on-farm anaerobic digester grid interconnections

    International Nuclear Information System (INIS)

    Ruhnke, W.

    2006-01-01

    While several anaerobic digestion (AD) pilot plants have recently been built in Canada, early reports suggest that interconnection barriers are delaying their widescale implementation. This paper examined grid interconnection experiences from the perspectives of farmers, local distributing companies (LDCs) and other stakeholders. The aim of the paper was to identify challenges to the implementation of AD systems. Case studies included an Ontario Dairy Herd AD system generating 50 kW; a Saskatchewan hog farm AD system generating 120 kW and an Alberta outdoor beef feedlot AD system generating 1000 kW. Two survey forms were created for project operators, and LDCs. The following 3 category barriers were identified: (1) technical concerns over islanding conditions, power quality requirements, power flow studies and other engineering analyses; (2) business practices barriers such as a lack of response after initial utility contact; and (3) regulatory barriers including the unavailability of fair buy-back rates, the lack of net metering programs, restrictive net metering programs, and pricing issues. It was suggested that collaborative efforts among all stakeholders are needed to resolve barriers quickly. Recommendations included the adoption of uniform technical standards for connecting generators to the grid, as well as adopting standard commercial practices for any required LDC interconnection review. It was also suggested that standard business terms for interconnection agreements should be established. Regulatory principles should be compatible with distributed power choices in regulated and unregulated markets. It was concluded that resolving interconnection barriers is a critical step towards realizing market opportunities available for AD technologies. refs., tabs., figs

  10. Electromagnetism and interconnections

    CERN Document Server

    Charruau, S

    2009-01-01

    This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.

  11. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Science.gov (United States)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2016-05-03

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  12. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2017-04-04

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  13. CAISSON: Interconnect Network Simulator

    Science.gov (United States)

    Springer, Paul L.

    2006-01-01

    Cray response to HPCS initiative. Model future petaflop computer interconnect. Parallel discrete event simulation techniques for large scale network simulation. Built on WarpIV engine. Run on laptop and Altix 3000. Can be sized up to 1000 simulated nodes per host node. Good parallel scaling characteristics. Flexible: multiple injectors, arbitration strategies, queue iterators, network topologies.

  14. One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

    International Nuclear Information System (INIS)

    Sabourin, D; Dufva, M; Jensen, T; Kutter, J; Snakenborg, D

    2010-01-01

    A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfaces by direct micromilling. Upon UV-assisted bonding the tubing is trapped in the ports of the PMMA chip and forms an integrated, in-plane and adhesive-free interconnection. The interconnections support the average pressure of 6.1 bar and can be made with small dead volumes. A comparison is made to a similar interconnection approach which uses tubing to act as a gasket between a needle and port on the microfluidic chip. (technical note)

  15. Cross-border versus cross-sector interconnectivity in renewable energy systems

    DEFF Research Database (Denmark)

    Thellufsen, Jakob Zinck; Lund, Henrik

    2017-01-01

    . The results show that while both measures increase the system utilisation of renewable energy and the system efficiency, the cross-sector interconnection gives the best system performance. To analyse the possible interaction between cross-sector and cross-border interconnectivity, two main aspects have......In the transition to renewable energy systems, fluctuating renewable energy, such as wind and solar power, plays a large and important role. This creates a challenge in terms of meeting demands, as the energy production fluctuates based on weather patterns. To utilise high amounts of fluctuating...... renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection...

  16. Effect of interconnectivity of structures against seismic load

    International Nuclear Information System (INIS)

    Bhuvaneshwari, P.; Elangovan, S.

    2003-01-01

    Since years world had experienced number of earthquakes and in India, zones have been modified according to the severity of earthquake and all this have made designers and engineers to concentrate rigorously to bring down the effect of damage to structures. Since the response of the structures to seismic force mainly depends on the distribution of mass, stiffness and damping characteristics an attempt is being made to compare and study the response by improving these characteristics in a simple building frame with and without infill. This in turn gives an idea of interconnecting the adjacent buildings of nuclear island to reduce the hazard to a minimum. (author)

  17. Centralized database for interconnection system design. [for spacecraft

    Science.gov (United States)

    Billitti, Joseph W.

    1989-01-01

    A database application called DFACS (Database, Forms and Applications for Cabling and Systems) is described. The objective of DFACS is to improve the speed and accuracy of interconnection system information flow during the design and fabrication stages of a project, while simultaneously supporting both the horizontal (end-to-end wiring) and the vertical (wiring by connector) design stratagems used by the Jet Propulsion Laboratory (JPL) project engineering community. The DFACS architecture is centered around a centralized database and program methodology which emulates the manual design process hitherto used at JPL. DFACS has been tested and successfully applied to existing JPL hardware tasks with a resulting reduction in schedule time and costs.

  18. Fabrication of high aspect ratio through-wafer copper interconnects by reverse pulse electroplating

    International Nuclear Information System (INIS)

    Gu, Changdong; Zhang, Tong-Yi; Xu, Hui

    2009-01-01

    This study aims to fabricate high aspect ratio through-wafer copper interconnects by a simple reverse pulse electroplating technique. High aspect-ratio (∼18) through-wafer holes obtained by a two-step deep reactive ion etching (DRIE) process exhibit a taper profile, which might automatically optimize the local current density distribution during the electroplating process, thereby achieving void-free high aspect-ratio copper vias

  19. Advanced Platform for Development and Evaluation of Grid Interconnection Systems Using Hardware-in-the-Loop: Part III - Grid Interconnection System Evaluator

    Energy Technology Data Exchange (ETDEWEB)

    Lundstrom, B.; Shirazi, M.; Coddington, M.; Kroposki, B.

    2013-01-01

    This paper describes a Grid Interconnection System Evaluator (GISE) that leverages hardware-in-the-loop (HIL) simulation techniques to rapidly evaluate the grid interconnection standard conformance of an ICS according to the procedures in IEEE Std 1547.1. The architecture and test sequencing of this evaluation tool, along with a set of representative ICS test results from three different photovoltaic (PV) inverters, are presented. The GISE adds to the National Renewable Energy Laboratory's (NREL) evaluation platform that now allows for rapid development of ICS control algorithms using controller HIL (CHIL) techniques, the ability to test the dc input characteristics of PV-based ICSs through the use of a PV simulator capable of simulating real-world dynamics using power HIL (PHIL), and evaluation of ICS grid interconnection conformance.

  20. Location constrained resource interconnection

    International Nuclear Information System (INIS)

    Hawkins, D.

    2008-01-01

    This presentation discussed issues related to wind integration from the perspective of the California Independent System Operator (ISO). Issues related to transmission, reliability, and forecasting were reviewed. Renewable energy sources currently used by the ISO were listed, and details of a new transmission financing plan designed to address the location constraints of renewable energy sources and provide for new transmission infrastructure was presented. The financing mechanism will be financed by participating transmission owners through revenue requirements. New transmission interconnections will include network facilities and generator tie-lines. Tariff revisions have also been implemented to recover the costs of new facilities and generators. The new transmission project will permit wholesale transmission access to areas where there are significant energy resources that are not transportable. A rate impact cap of 15 per cent will be imposed on transmission owners to mitigate short-term costs to ratepayers. The presentation also outlined energy resource area designation plans, renewable energy forecasts, and new wind technologies. Ramping issues were also discussed. It was concluded that the ISO expects to ensure that 20 per cent of its energy will be derived from renewable energy sources. tabs., figs

  1. Interconnected Power Systems Mexico-Guatemala financed by BID

    International Nuclear Information System (INIS)

    Martinez, Veronica

    2003-01-01

    The article describes the plans for the interconnection of the electric power systems of Guatemala, El Salvador, Honduras, Nicaragua, Costa Rica, Panama and Mexico within the project Plan Pueba Panama. The objective of the interconnection is to create an electric market in the region that contributes to reduce costs and prices. The project will receive a financing of $37.5 millions of US dollars from the Banco Intrameramericano de Desarrollo (BID)

  2. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  3. Improving sensitivity of residual current transformers to high frequency earth fault currents

    Directory of Open Access Journals (Sweden)

    Czapp Stanislaw

    2017-09-01

    Full Text Available For protection against electric shock in low voltage systems residual current devices are commonly used. However, their proper operation can be interfered when high frequency earth fault current occurs. Serious hazard of electrocution exists then. In order to detect such a current, it is necessary to modify parameters of residual current devices, especially the operating point of their current transformer. The authors proposed the modification in the structure of residual current devices. This modification improves sensitivity of residual current devices when high frequency earth fault current occurs. The test of the modified residual current device proved that the authors’ proposition is appropriate.

  4. Agreement about interconnection capacities between Italy and France for 2002; Accord sur les capacites d'interconnextion entre l'Italie et la France pour 2002

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    CRE and AEEG, the French and Italian commissions of electricity regulation, have concluded an agreement about a common mechanism of allocation of interconnection capacities between Italy and France for 2002. This agreement increases the available capacities and greatly improves the freedom and the development of international electricity trades. This short press release precises the interconnection capacity, and the annual primary and secondary allocations of interconnection capacities between France and Italy. (J.S.)

  5. Robert Aymar seals the last interconnect in the LHC

    CERN Multimedia

    Maximilien Brice

    2007-01-01

    The LHC completes the circle. On 7 November, in a brief ceremony in the LHC tunnel, CERN Director General Robert Aymar (Photo 1) sealed the last interconnect between the main magnets of the Large Hadron Collider (LHC). Jean-Philippe Tock, leader of the Interconnections team, tightens the last bolt (Photos 4-8).

  6. Development of a New Insulation Approach for the LHC Main 13 kA Interconnection Splices

    CERN Document Server

    Lackner, F; Fessia, P; Lopez, R; Prin, H; Tock, J Ph

    2012-01-01

    In the long LHC (Large Hadron Collider) shutdown in 2013 it is foreseen to intervene on all the 13 kA interconnections in order to guarantee the necessary margin and redundancy to provide safe LHC operation at 7 TeV per beam. This implies reinforcement of the present interconnection configuration including a new insulation scheme of the busbars. The purpose of the new insulation model is to provide dielectric insulation with at least the same performance as its predecessor currently installed in the LHC machine, but in addition to contain the Lorentz forces. This paper describes the analytic and empirical approach of development to reach a new insulation concept based on state of the art materials and manufacturing techniques.

  7. Nanostructured CuS networks composed of interconnected nanoparticles for asymmetric supercapacitors.

    Science.gov (United States)

    Fu, Wenbin; Han, Weihua; Zha, Heming; Mei, Junfeng; Li, Yunxia; Zhang, Zemin; Xie, Erqing

    2016-09-21

    Nanostructured metal sulfides with excellent electrochemical activity and electrical conductivity are particularly promising for applications in high-performance energy storage devices. Here, we report on the facile synthesis of nanostructured CuS networks composed of interconnected nanoparticles as novel battery-type materials for asymmetric supercapacitors. We find that the CuS networks exhibit a high specific capacity of 49.8 mA g(-1) at a current density of 1 A g(-1), good rate capability and cycle stability. The superior performance could be attributed to the interconnected nanoparticles of CuS networks, which can facilitate electrolyte diffusion and provide fast electron pathways. Furthermore, an aqueous asymmetric supercapacitor has been assembled by using the CuS networks as the positive electrode and activated carbon as the negative electrode. The assembled device can work at a high operating voltage of 1.6 V and show a maximum energy density of 17.7 W h kg(-1) at a power density of 504 W kg(-1). This study indicates that the CuS networks have great potential for supercapacitor applications.

  8. Two component micro injection moulding for moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    2008-01-01

    Moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their capability of reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...... component injection moulding is one of the most industrially adaptive processes. However, the use of two component injection moulding for MID fabrication, with circuit patterns in the sub-millimeter range, is still a big challenge at the present state of technology. The scope of the current Ph.D. project...... and a reasonable adhesion between them. • Selective metallization of the two component plastic part (coating one polymer with metal and leaving the other one uncoated) To overcome these two main issues in MID fabrication for micro applications, the current Ph.D. project explores the technical difficulties...

  9. Optical interconnection networks for high-performance computing systems

    International Nuclear Information System (INIS)

    Biberman, Aleksandr; Bergman, Keren

    2012-01-01

    Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers. (review article)

  10. The variability of interconnected wind plants

    International Nuclear Information System (INIS)

    Katzenstein, Warren; Fertig, Emily; Apt, Jay

    2010-01-01

    We present the first frequency-dependent analyses of the geographic smoothing of wind power's variability, analyzing the interconnected measured output of 20 wind plants in Texas. Reductions in variability occur at frequencies corresponding to times shorter than ∼24 h and are quantified by measuring the departure from a Kolmogorov spectrum. At a frequency of 2.8x10 -4 Hz (corresponding to 1 h), an 87% reduction of the variability of a single wind plant is obtained by interconnecting 4 wind plants. Interconnecting the remaining 16 wind plants produces only an additional 8% reduction. We use step change analyses and correlation coefficients to compare our results with previous studies, finding that wind power ramps up faster than it ramps down for each of the step change intervals analyzed and that correlation between the power output of wind plants 200 km away is half that of co-located wind plants. To examine variability at very low frequencies, we estimate yearly wind energy production in the Great Plains region of the United States from automated wind observations at airports covering 36 years. The estimated wind power has significant inter-annual variability and the severity of wind drought years is estimated to be about half that observed nationally for hydroelectric power.

  11. Cascade-robustness optimization of coupling preference in interconnected networks

    International Nuclear Information System (INIS)

    Zhang, Xue-Jun; Xu, Guo-Qiang; Zhu, Yan-Bo; Xia, Yong-Xiang

    2016-01-01

    Highlights: • A specific memetic algorithm was proposed to optimize coupling links. • A small toy model was investigated to examine the underlying mechanism. • The MA optimized strategy exhibits a moderate assortative pattern. • A novel coupling coefficient index was proposed to quantify coupling preference. - Abstract: Recently, the robustness of interconnected networks has attracted extensive attentions, one of which is to investigate the influence of coupling preference. In this paper, the memetic algorithm (MA) is employed to optimize the coupling links of interconnected networks. Afterwards, a comparison is made between MA optimized coupling strategy and traditional assortative, disassortative and random coupling preferences. It is found that the MA optimized coupling strategy with a moderate assortative value shows an outstanding performance against cascading failures on both synthetic scale-free interconnected networks and real-world networks. We then provide an explanation for this phenomenon from a micro-scope point of view and propose a coupling coefficient index to quantify the coupling preference. Our work is helpful for the design of robust interconnected networks.

  12. The first LHC sector is fully interconnected

    CERN Multimedia

    2006-01-01

    Sector 7-8 is the first sector of the LHC to become fully operational. All the magnets, cryogenic line, vacuum chambers and services are interconnected. The cool down of this sector can soon commence. LHC project leader Lyn Evans, the teams from CERN's AT/MCS, AT/VAC and AT/MEL groups, and the members of the IEG consortium celebrate the completion of the first LHC sector. The 10th of November was a red letter day for the LHC accelerator teams, marking the completion of the first sector of the machine. The magnets of sector 7-8, together with the cryogenic line, the vacuum chambers and the distribution feedboxes (DFBs) are now all completely interconnected. Sector 7-8 has thus been closed and is the first LHC sector to become operational. The interconnection work required several thousand electrical, cryogenic and insulating connections to be made on the 210 interfaces between the magnets in the arc, the 30 interfaces between the special magnets and the interfaces with the cryogenic line. 'This represent...

  13. System interconnection studies using WASP

    Energy Technology Data Exchange (ETDEWEB)

    Bayrak, Y [Turkish Electricity Generation and Transmission Corp., Ankara (Turkey)

    1997-09-01

    The aim of this paper is to describe the application of WASP as a modelling tool for determining the development of two electric systems with interconnections. A case study has been carried out to determine the possibilities of transfer of baseload energy between Turkey and a neighboring country. The objective of this case study is to determine the amount of energy that can be transferred, variations of Loss Probability (LOLP) and unserved energy, and the cost of additional generation with interconnection. The break-even cost will be determined to obtain the minimum charge rate at which TEAS (Turkish Electricity Generation-Transmission Corp.) needs to sell the energy in order to recover the costs. The minimum charge rate for both capacity and energy will be estimated without considering extra capacity additions, except for the ones needed by the Turkish system alone. (author). 2 figs, 3 tabs.

  14. Probabilistic interconnection between interdependent networks promotes cooperation in the public goods game

    International Nuclear Information System (INIS)

    Wang, Baokui; Chen, Xiaojie; Wang, Long

    2012-01-01

    Most previous works study the evolution of cooperation in a structured population by commonly employing an isolated single network. However, realistic systems are composed of many interdependent networks coupled with each other, rather than an isolated single one. In this paper, we consider a system including two interacting networks with the same size, entangled with each other by the introduction of probabilistic interconnections. We introduce the public goods game into such a system, and study how the probabilistic interconnection influences the evolution of cooperation of the whole system and the coupling effect between two layers of interdependent networks. Simulation results show that there exists an intermediate region of interconnection probability leading to the maximum cooperation level in the whole system. Interestingly, we find that at the optimal interconnection probability the fraction of internal links between cooperators in two layers is maximal. Also, even if initially there are no cooperators in one layer of interdependent networks, cooperation can still be promoted by probabilistic interconnection, and the cooperation levels in both layers can more easily reach an agreement at the intermediate interconnection probability. Our results may be helpful in understanding cooperative behavior in some realistic interdependent networks and thus highlight the importance of probabilistic interconnection on the evolution of cooperation. (paper)

  15. Updating Small Generator Interconnection Procedures for New Market Conditions

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  16. Electric network interconnection of Mashreq Arab Countries

    International Nuclear Information System (INIS)

    El-Amin, I.M.; Al-Shehri, A.M.; Opoku, G.; Al-Baiyat, S.A.; Zedan, F.M.

    1994-01-01

    Power system interconnection is a well established practice for a variety of technical and economical reasons. Several interconnected networks exist worldwide for a number of factors. Some of these networks cross international boundaries. This presentation discusses the future developments of the power systems of Mashreq Arab Countries (MAC). MAC consists of Bahrain, Egypt, Iraq, Jordan, Kuwait, Lebanon, Oman, Qatar, Saudi Arabia, United Arab Emirates (UAE), and Yemen. Mac power systems are operated by government or semigovernment bodies. Many of these countries have national or regional electric grids but are generally isolated from each other. With the exception of Saudi Arabia power systems, which employ 60 Hz, all other MAC utilities use 50 Hz frequency. Each country is served by one utility, except Saudi Arabia, which is served by four major utilities and some smaller utilities serving remote towns and small load centers. The major utilities are the Saudi Consolidated electric Company in the Eastern Province (SCECO East), SCECO Center, SCECO West, and SCECO South. These are the ones considered in this study. The energy resources in MAC are varied. Countries such as Egypt, Iraq, and Syria have significant hydro resources.The gulf countries and Iraq have abundant fossil fuel, The variation in energy resources as well as the characteristics of the electric load make it essential to look into interconnections beyond the national boundaries. Most of the existing or planned interconnections involve few power systems. A study involving 12 countries and over 20 utilities with different characteristics represents a very large scale undertaking

  17. A proposed holistic approach to on-chip, off-chip, test, and package interconnections

    Science.gov (United States)

    Bartelink, Dirk J.

    1998-11-01

    The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

  18. Analytical Model based on Green Criteria for Optical Backbone Network Interconnection

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Pedersen, Jens Myrup

    2011-01-01

    Key terms such as Global warming, Green House Gas emissions, or Energy efficiency are currently on the scope of scientific research. Regarding telecommunications networks, wireless applications, routing protocols, etc. are being designed following this new “Green” trend. This work contributes...... to the evaluation of the environmental impact of networks from physical interconnection point of view. Networks deployment, usage, and disposal are analyzed as contributing elements to ICT’s (Information and Communications Technology) CO2 emissions. This paper presents an analytical model for evaluating...

  19. Local Network Wideband Interconnection Alternatives.

    Science.gov (United States)

    1984-01-01

    signal. 3.2.2 Limitations Although satellites offer the advantages of insensitivity to distance, point-to-multipoint communication capability and...Russell, the CATV franchisee for the town of Bedford, has not yit set rates for leasing channels on their network. If this network were interconnected

  20. Back-end interconnection. A generic concept for high volume manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Bosman, J.; Budel, T.; De Kok, C.J.G.M.

    2013-10-15

    The general method to realize series connection in thin film PV modules is monolithical interconnection through a sequence of laser scribes (P1, P2 and P3) and layer depositions. This method however implies that the deposition processes are interrupted several times, an undesirable situation in high volume processing. In order to eliminate this drawback we focus our developments on the so called 'back-end interconnection concept' in which series interconnection takes place AFTER the deposition of the functional layers of the thin film PV device. The process of making a back-end interconnection combines laser scribing, curing, sintering and inkjet processes. These different processes interacts with each other and are investigated in order to create processing strategies that are robust to ensure high volume production. The generic approach created a technology base that can be applied to any thin film PV technology.

  1. Copper Nanowire Production for Interconnect Applications

    Science.gov (United States)

    Han, Jin-Woo (Inventor); Meyyappan, Meyya (Inventor)

    2014-01-01

    A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

  2. The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

    Directory of Open Access Journals (Sweden)

    Amlan Ganguly

    2018-02-01

    Full Text Available With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

  3. Seismic Hazard Analysis on a Complex, Interconnected Fault Network

    Science.gov (United States)

    Page, M. T.; Field, E. H.; Milner, K. R.

    2017-12-01

    In California, seismic hazard models have evolved from simple, segmented prescriptive models to much more complex representations of multi-fault and multi-segment earthquakes on an interconnected fault network. During the development of the 3rd Uniform California Earthquake Rupture Forecast (UCERF3), the prevalence of multi-fault ruptures in the modeling was controversial. Yet recent earthquakes, for example, the Kaikora earthquake - as well as new research on the potential of multi-fault ruptures (e.g., Nissen et al., 2016; Sahakian et al. 2017) - have validated this approach. For large crustal earthquakes, multi-fault ruptures may be the norm rather than the exception. As datasets improve and we can view the rupture process at a finer scale, the interconnected, fractal nature of faults is revealed even by individual earthquakes. What is the proper way to model earthquakes on a fractal fault network? We show multiple lines of evidence that connectivity even in modern models such as UCERF3 may be underestimated, although clustering in UCERF3 mitigates some modeling simplifications. We need a methodology that can be applied equally well where the fault network is well-mapped and where it is not - an extendable methodology that allows us to "fill in" gaps in the fault network and in our knowledge.

  4. Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors

    CERN Document Server

    Andricek, L; Macchiolo, A; Moser, H.G; Nisius, R; Richter, R.H; Terzo, S; Weigell, P

    2014-01-01

    sensors of 75 μm thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a ...

  5. Performance of WCN diffusion barrier for Cu multilevel interconnects

    Science.gov (United States)

    Lee, Seung Yeon; Ju, Byeong-Kwon; Kim, Yong Tae

    2018-04-01

    The electrical and thermal properties of a WCN diffusion barrier have been studied for Cu multilevel interconnects. The WCN has been prepared using an atomic layer deposition system with WF6-CH4-NH3-H2 gases and has a very low resistivity of 100 µΩ cm and 96.9% step coverage on the high-aspect-ratio vias. The thermally stable WCN maintains an amorphous state at 800 °C and Cu/WCN contact resistance remains within a 10% deviation from the initial value after 700 °C. The mean time to failure suggests that the Cu/WCN interconnects have a longer lifetime than Cu/TaN and Cu/WN interconnects because WCN prevents Cu migration owing to the stress evolution from tensile to compressive.

  6. Antireflection coating design for series interconnected multi-junction solar cells

    International Nuclear Information System (INIS)

    Aiken, Daniel J.

    1999-01-01

    AR coating design for multi-junction solar cells can be more challenging than in the single junction case. Reasons for this are discussed. Analytical expressions used to optimize AR coatings for single junction solar cells are extended for use in monolithic, series interconnected multi-junction solar cell AR coating design. The result is an analytical expression which relates the solar cell performance (through J(sub SC)) directly to the AR coating design through the device reflectance. It is also illustrated how AR coating design can be used to provide an additional degree of freedom for current matching multi-junction devices

  7. Constructing Efficient and Stable Perovskite Solar Cells via Interconnecting Perovskite Grains.

    Science.gov (United States)

    Hou, Xian; Huang, Sumei; Ou-Yang, Wei; Pan, Likun; Sun, Zhuo; Chen, Xiaohong

    2017-10-11

    A high-quality perovskite film with interconnected perovskite grains was obtained by incorporating terephthalic acid (TPA) additive into the perovskite precursor solution. The presence of TPA changed the crystallization kinetics of the perovskite film and promoted lateral growth of grains in the vicinity of crystal boundaries. As a result, sheet-shaped perovskite was formed and covered onto the bottom grains, which made some adjacent grains partly merge together to form grains-interconnected perovskite film. Perovskite solar cells (PSCs) with TPA additive exhibited a power conversion efficiency (PCE) of 18.51% with less hysteresis, which is obviously higher than that of pristine cells (15.53%). PSCs without and with TPA additive retain 18 and 51% of the initial PCE value, respectively, aging for 35 days exposed to relative humidity 30% in air without encapsulation. Furthermore, MAPbI 3 film with TPA additive shows superior thermal stability to the pristine one under 100 °C baking. The results indicate that the presence of TPA in perovskite film can greatly improve the performance of PSCs as well as their moisture resistance and thermal stability.

  8. Operational Plan Ontology Model for Interconnection and Interoperability

    Science.gov (United States)

    Long, F.; Sun, Y. K.; Shi, H. Q.

    2017-03-01

    Aiming at the assistant decision-making system’s bottleneck of processing the operational plan data and information, this paper starts from the analysis of the problem of traditional expression and the technical advantage of ontology, and then it defines the elements of the operational plan ontology model and determines the basis of construction. Later, it builds up a semi-knowledge-level operational plan ontology model. Finally, it probes into the operational plan expression based on the operational plan ontology model and the usage of the application software. Thus, this paper has the theoretical significance and application value in the improvement of interconnection and interoperability of the operational plan among assistant decision-making systems.

  9. U.S. Laws and Regulations for Renewable Energy Grid Interconnections

    Energy Technology Data Exchange (ETDEWEB)

    Chernyakhovskiy, Ilya [National Renewable Energy Lab. (NREL), Golden, CO (United States); Tian, Tian [National Renewable Energy Lab. (NREL), Golden, CO (United States); McLaren, Joyce [National Renewable Energy Lab. (NREL), Golden, CO (United States); Miller, Mackay [National Renewable Energy Lab. (NREL), Golden, CO (United States); Geller, Nina [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2016-09-01

    Rapidly declining costs of wind and solar energy technologies, increasing concerns about the environmental and climate change impacts of fossil fuels, and sustained investment in renewable energy projects all point to a not-so-distant future in which renewable energy plays a pivotal role in the electric power system of the 21st century. In light of public pressures and market factors that hasten the transition towards a low-carbon system, power system planners and regulators are preparing to integrate higher levels of variable renewable generation into the grid. Updating the regulations that govern generator interconnections and operations is crucial to ensure system reliability while creating an enabling environment for renewable energy development. This report presents a chronological review of energy laws and regulations concerning grid interconnection procedures in the United States, highlighting the consequences of policies for renewable energy interconnections. Where appropriate, this report places interconnection policies and their impacts on renewable energy within the broader context of power market reform.

  10. Examination of Potential Benefits of an Energy Imbalance Market in the Western Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Milligan, M.; Clark, K.; King, J.; Kirby, B.; Guo, T.; Liu, G.

    2013-03-01

    In the Western Interconnection, there is significant interest in improving approaches to wide-area coordinated operations of the bulk electric power system, in part because of the increasing penetration of variable generation. One proposed solution is an energy imbalance market. This study focused on that approach alone, with the goal of identifying the potential benefits of an energy imbalance market in the year 2020.

  11. The GIOD Project-Globally Interconnected Object Databases

    CERN Document Server

    Bunn, J J; Newman, H B; Wilkinson, R P

    2001-01-01

    The GIOD (Globally Interconnected Object Databases) Project, a joint effort between Caltech and CERN, funded by Hewlett Packard Corporation, has investigated the use of WAN-distributed Object Databases and Mass Storage systems for LHC data. A prototype small- scale LHC data analysis center has been constructed using computing resources at Caltechs Centre for advanced Computing Research (CACR). These resources include a 256 CPU HP Exemplar of ~4600 SPECfp95, a 600 TByte High Performance Storage System (HPSS), and local/wide area links based on OC3 ATM. Using the exemplar, a large number of fully simulated CMS events were produced, and used to populate an object database with a complete schema for raw, reconstructed and analysis objects. The reconstruction software used for this task was based on early codes developed in preparation for the current CMS reconstruction program, ORCA. (6 refs).

  12. Planning and design of the Gulf States interconnection

    International Nuclear Information System (INIS)

    Al Alawi, J.; Sud, S.; McGillis, D.

    1994-01-01

    On May 25, 1981, the six Arab state of Bahrain, Kuwait, Oman, Qatar, Saudi Arabia and the United Arab Emirates (UAE) formally ratified the charter of the organization named Co-operation Council for the Arab States of the Gulf. This has become more popularly known as the Gulf Cooperation Council (GCC). In the mid 1980s, the integration of the electric systems study in the GCC was initiated, and several possible interconnection schemes to provide for reserve sharing and generally more economic and flexible operation of the networks were proposed. The GCC subsequently asked for an update of this study and a recommended interconnection scheme. this update study was completed in 1990, and a definite scheme was proposed, which met with the approval of all GCC members. This presentation describes the proposed interconnection, the studies that led to its selection, and the associated management structure required for its implementation. the population of the GCC states, and their load, generating capacity, and the transmission systems are shown

  13. Load shedding scheme in the south/southeastern interconnected system

    Energy Technology Data Exchange (ETDEWEB)

    Vieira Filho, Xisto; Couri, J J.G.; Gomes, P; Almeida, P C [ELETROBRAS, Rio de Janeiro, RJ (Brazil)

    1988-12-31

    This paper presents some characteristics of the Brazilian interconnected system and discusses the load shedding scheme in its different stages considering the beginning of operation of the Itaipu power plant. The present situation of the South and Southeastern load shedding scheme combination is also commented. Finally, the interconnected system evolution and the effects on the load shedding schemes are discussed. 4 refs., 5 figs., 2 tabs.

  14. Optoelectronic interconnects for 3D wafer stacks

    Science.gov (United States)

    Ludwig, David; Carson, John C.; Lome, Louis S.

    1996-01-01

    Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

  15. Synthesis and Characterization of Three Dimensional Nanostructures Based on Interconnected Carbon Nanomaterials

    Science.gov (United States)

    Koizumi, Ryota

    This thesis addresses various types of synthetic methods for novel three dimensional nanomaterials and nanostructures based on interconnected carbon nanomaterials using solution chemistry and chemical vapor deposition (CVD) methods. Carbon nanotube (CNT) spheres with porous and scaffold structures consisting of interconnected CNTs were synthesized by solution chemistry followed by freeze-drying, which have high elasticity under nano-indentation tests. This allows the CNT spheres to be potentially applied to mechanical dampers. CNTs were also grown on two dimensional materials--such as reduced graphene oxide (rGO) and hexagonal boron nitride (h-BN)--by CVD methods, which are chemically interconnected. CNTs on rGO and h-BN interconnected structures performed well as electrodes for supercapacitors. Furthermore, unique interconnected flake structures of alpha-phase molybdenum carbide were developed by a CVD method. The molybdenum carbide can be used for a catalyst of hydrogen evolution reaction activity as well as an electrode for supercapacitors.

  16. Advanced Platform for Development and Evaluation of Grid Interconnection Systems Using Hardware-in-the-Loop: Part III -- Grid Interconnection System Evaluator: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Lundstrom, B.; Shirazi, M.; Coddington, M.; Kroposki, B.

    2013-01-01

    This paper, presented at the IEEE Green Technologies Conference 2013, describes a Grid Interconnection System Evaluator (GISE) that leverages hardware-in-the-loop (HIL) simulation techniques to rapidly evaluate the grid interconnection standard conformance of an ICS according to the procedures in IEEE Std 1547.1 (TM). The architecture and test sequencing of this evaluation tool, along with a set of representative ICS test results from three different photovoltaic (PV) inverters, are presented. The GISE adds to the National Renewable Energy Laboratory's (NREL) evaluation platform that now allows for rapid development of ICS control algorithms using controller HIL (CHIL) techniques, the ability to test the dc input characteristics of PV-based ICSs through the use of a PV simulator capable of simulating real-world dynamics using power HIL (PHIL), and evaluation of ICS grid interconnection conformance.

  17. Design of a highly parallel board-level-interconnection with 320 Gbps capacity

    Science.gov (United States)

    Lohmann, U.; Jahns, J.; Limmer, S.; Fey, D.; Bauer, H.

    2012-01-01

    A parallel board-level interconnection design is presented consisting of 32 channels, each operating at 10 Gbps. The hardware uses available optoelectronic components (VCSEL, TIA, pin-diodes) and a combination of planarintegrated free-space optics, fiber-bundles and available MEMS-components, like the DMD™ from Texas Instruments. As a specific feature, we present a new modular inter-board interconnect, realized by 3D fiber-matrix connectors. The performance of the interconnect is evaluated with regard to optical properties and power consumption. Finally, we discuss the application of the interconnect for strongly distributed system architectures, as, for example, in high performance embedded computing systems and data centers.

  18. Regulate or deregulate. Influencing network interconnection charges

    Energy Technology Data Exchange (ETDEWEB)

    Van De Wielle, B.

    2003-06-01

    We study the choice between regulating interconnection charges or delegating their determination to the operators, both in a non-mature and a mature market. Three regulatory regimes are considered: full, cost-based and bill-and-keep. Delegation corresponds to bargaining about the interconnection charges using the regulatory schemes as disagreement outcomes. Applying regulation benefits the consumers. Under full regulation, access charges account for asymmetries and allow a unique Ramsey price. Delegation benefits the operators. In a mature market delegation robs the government of any market influence. In a non-mature market government preferences coincide with those of the largest operator and are disadvantageous for entry.

  19. Compact models and performance investigations for subthreshold interconnects

    CERN Document Server

    Dhiman, Rohit

    2014-01-01

    The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wi

  20. The myth of interconnected plastids and related phenomena.

    Science.gov (United States)

    Schattat, Martin H; Barton, Kiah A; Mathur, Jaideep

    2015-01-01

    Studies spread over nearly two and a half centuries have identified the primary plastid in autotrophic algae and plants as a pleomorphic, multifunctional organelle comprising of a double-membrane envelope enclosing an organization of internal membranes submerged in a watery stroma. All plastid units have been observed extending and retracting thin stroma-filled tubules named stromules sporadically. Observations on living plant cells often convey the impression that stromules connect two or more independent plastids with each other. When photo-bleaching techniques were used to suggest that macromolecules such as the green fluorescent protein could flow between already interconnected plastids, for many people this impression changed to conviction. However, it was noticed only recently that the concept of protein flow between plastids rests solely on the words "interconnected plastids" for which details have never been provided. We have critically reviewed botanical literature dating back to the 1880s for understanding this term and the phenomena that have become associated with it. We find that while meticulously detailed ontogenic studies spanning nearly 150 years have established the plastid as a singular unit organelle, there is no experimental support for the idea that interconnected plastids exist under normal conditions of growth and development. In this review, while we consider several possibilities that might allow a single elongated plastid to be misinterpreted as two or more interconnected plastids, our final conclusion is that the concept of direct protein flow between plastids is based on an unfounded assumption.

  1. 78 FR 19259 - Notice of Attendance at PJM Interconnection, L.L.C. Meetings

    Science.gov (United States)

    2013-03-29

    ... Interconnection, L.L.C. Meetings The Federal Energy Regulatory Commission (Commission) hereby gives notice that members of the Commission and Commission staff may attend upcoming PJM Interconnection, L.L.C. (PJM... proceedings: Docket No. EL05-121, PJM Interconnection, L.L.C. Docket No. EL08-14, Black Oak Energy LLC, et al...

  2. Ceria based protective coatings for steel interconnects prepared by spray pyrolysis

    DEFF Research Database (Denmark)

    Szymczewska, Dagmara; Molin, Sebastian; Chen, Ming

    2014-01-01

    Stainless steels can be used in solid oxide fuel/electrolysis stacks as interconnects. For successful long term operation they require protective coatings, that lower the corrosion rate and block chemical reactions between the interconnect and adjacent layers of the oxygen or the hydrogen electrode....... One of the promising coating materials for the hydrogen side is ceria. Using standard sintering techniques, ceria sinters at around 1400°C which even for a very short exposure would destroy the interconnect. Therefore in this paper a low temperature deposition method, i.e. spray pyrolysis, is used...

  3. Decentralized automatic generation control of interconnected power systems incorporating asynchronous tie-lines.

    Science.gov (United States)

    Ibraheem; Hasan, Naimul; Hussein, Arkan Ahmed

    2014-01-01

    This Paper presents the design of decentralized automatic generation controller for an interconnected power system using PID, Genetic Algorithm (GA) and Particle Swarm Optimization (PSO). The designed controllers are tested on identical two-area interconnected power systems consisting of thermal power plants. The area interconnections between two areas are considered as (i) AC tie-line only (ii) Asynchronous tie-line. The dynamic response analysis is carried out for 1% load perturbation. The performance of the intelligent controllers based on GA and PSO has been compared with the conventional PID controller. The investigations of the system dynamic responses reveal that PSO has the better dynamic response result as compared with PID and GA controller for both type of area interconnection.

  4. Performance analysis and comparison of a minimum interconnections direct storage model with traditional neural bidirectional memories.

    Science.gov (United States)

    Bhatti, A Aziz

    2009-12-01

    This study proposes an efficient and improved model of a direct storage bidirectional memory, improved bidirectional associative memory (IBAM), and emphasises the use of nanotechnology for efficient implementation of such large-scale neural network structures at a considerable lower cost reduced complexity, and less area required for implementation. This memory model directly stores the X and Y associated sets of M bipolar binary vectors in the form of (MxN(x)) and (MxN(y)) memory matrices, requires O(N) or about 30% of interconnections with weight strength ranging between +/-1, and is computationally very efficient as compared to sequential, intraconnected and other bidirectional associative memory (BAM) models of outer-product type that require O(N(2)) complex interconnections with weight strength ranging between +/-M. It is shown that it is functionally equivalent to and possesses all attributes of a BAM of outer-product type, and yet it is simple and robust in structure, very large scale integration (VLSI), optical and nanotechnology realisable, modular and expandable neural network bidirectional associative memory model in which the addition or deletion of a pair of vectors does not require changes in the strength of interconnections of the entire memory matrix. The analysis of retrieval process, signal-to-noise ratio, storage capacity and stability of the proposed model as well as of the traditional BAM has been carried out. Constraints on and characteristics of unipolar and bipolar binaries for improved storage and retrieval are discussed. The simulation results show that it has log(e) N times higher storage capacity, superior performance, faster convergence and retrieval time, when compared to traditional sequential and intraconnected bidirectional memories.

  5. 77 FR 3766 - PJM Interconnection, L.L.C.; Notice of Staff Technical Conference

    Science.gov (United States)

    2012-01-25

    ... Interconnection, L.L.C.; Notice of Staff Technical Conference On December 14, 2011, the Commission issued an order... Interconnection, L.L.C.'s (PJM) filing.\\1\\ Take notice that the technical conference will be held on February 14...\\ PJM Interconnection, L.L.C., 137 FERC ] 61,204 (2011) (December 14 Order). All interested parties are...

  6. Bi cluster-assembled interconnects produced using SU8 templates

    International Nuclear Information System (INIS)

    Partridge, J G; Matthewson, T; Brown, S A

    2007-01-01

    Bi clusters with an average diameter of 25 nm have been deposited from an inert gas aggregation source and assembled into thin-film interconnects which are formed between planar electrical contacts and supported on Si substrates passivated with Si 3 N 4 or thermally grown oxide. A layer of SU8 (a negative photoresist based on EPON SU-8 epoxy resin) is patterned using optical or electron-beam lithography, and it defines the position and dimensions of the cluster film. The conduction between the contacts is monitored throughout the deposition/assembly process, and subsequent I(V) characterization is performed in situ. Bi cluster-assembled interconnects have been fabricated with nanoscale widths and with up to 1:1 thickness:width aspect ratios. The conductivity of these interconnects has been increased, post-deposition, using a simple thermal annealing process

  7. 77 FR 10505 - Notice of Attendance at PJM Interconnection, L.L.C. Meetings

    Science.gov (United States)

    2012-02-22

    ... Interconnection, L.L.C. Meetings The Federal Energy Regulatory Commission (Commission) hereby gives notice that members of the Commission and Commission staff may attend upcoming PJM Interconnection, L.L.C. (PJM..., PJM Interconnection, L.L.C. Docket Nos. ER06-456, ER06-880, ER06-954, ER06-1271, EL07-57, ER07-424...

  8. Energetic diversification in the interconnected electric system

    International Nuclear Information System (INIS)

    Villanueva M, C.; Beltran M, H.; Serrano G, J.A.

    2007-01-01

    In the interconnected electric system of Mexico the demanded electricity in different timetable periods it is synthesized in the annual curve of load duration, which is characterized by three regions. The energy in every period is quantified according to the under curve areas in each region, which depend of the number of hours in that the power demand exceeds the minimum and the intermediate demands respectively that are certain percentages of the yearly maximum demand. In that context, the generating power stations are dispatched according to the marginal costs of the produced electricity and the electric power to be generated every year by each type of central it is located in some of the regions of the curve of load duration, as they are their marginal costs and their operation characteristic techniques. By strategic reasons it is desirable to diversify the primary energy sources that are used in the national interconnected system to generate the electricity that demand the millions of consumers that there are in Mexico. On one hand, when intensifying the use of renewable sources and of nucleo electric centrals its decrease the import volumes of natural gas, which has very volatile prices and it is a fuel when burning in the power stations produces hothouse gases that are emitted to the atmosphere. On the other hand, when diversifying the installed capacity of the different central types in the interconnected system, a better adaptation of the produced electricity volumes is achieved by each type to the timetable variation, daily, weekly and seasonal of the electric demand, as one manifests this in the curve of load duration. To exemplify a possible diversification plan of the installed capacity in the national interconnected system that includes nucleo electric centrals and those that use renewable energy, charts are presented that project of 2005 at 2015 the capacity, energy and ost of the electricity of different central types, located in each one of the

  9. Impact of Bundle Structure on Performance of on-Chip CNT Interconnects

    International Nuclear Information System (INIS)

    Kuruvilla, N.; Raina, J.P

    2014-01-01

    CNTs are proposed as a promising candidate against copper in deep submicron IC interconnects. Still this technology is in its infancy. Most available literatures on performance predictions of CNT interconnects, have focused only on interconnect geometries using segregated CNTs. Yet during the manufacturing phase, CNTs are obtained usually as a mixture of single-walled and multi-walled CNTs (SWCNTs and MWCNTs). Especially in case of SWCNTs; it is usually available as a mixture of both Semi conducting CNTs and metallic CNTs. This paper attempts to answer whether segregation is inevitable before using them to construct interconnects. This paper attempt to compare the performance variations of bundled CNT interconnects, where bundles are made of segregated CNTs versus mixed CNTs, for future technology nodes using electrical model based analysis. Also a proportionate mixing of different CNTs has been introduced so as to yield a set of criteria to aid the industry in selection of an appropriate bundle structure for use in a specific application with optimum performance. It was found that even the worst case performance of geometries using a mixture of SWCNTs and MWCNTs was better than copper. These results also reveal that, for extracting optimum performance vide cost matrix, the focus should be more on diameter controlled synthesis than on segregation.

  10. Two-dimensional optoelectronic interconnect-processor and its operational bit error rate

    Science.gov (United States)

    Liu, J. Jiang; Gollsneider, Brian; Chang, Wayne H.; Carhart, Gary W.; Vorontsov, Mikhail A.; Simonis, George J.; Shoop, Barry L.

    2004-10-01

    Two-dimensional (2-D) multi-channel 8x8 optical interconnect and processor system were designed and developed using complementary metal-oxide-semiconductor (CMOS) driven 850-nm vertical-cavity surface-emitting laser (VCSEL) arrays and the photodetector (PD) arrays with corresponding wavelengths. We performed operation and bit-error-rate (BER) analysis on this free-space integrated 8x8 VCSEL optical interconnects driven by silicon-on-sapphire (SOS) circuits. Pseudo-random bit stream (PRBS) data sequence was used in operation of the interconnects. Eye diagrams were measured from individual channels and analyzed using a digital oscilloscope at data rates from 155 Mb/s to 1.5 Gb/s. Using a statistical model of Gaussian distribution for the random noise in the transmission, we developed a method to compute the BER instantaneously with the digital eye-diagrams. Direct measurements on this interconnects were also taken on a standard BER tester for verification. We found that the results of two methods were in the same order and within 50% accuracy. The integrated interconnects were investigated in an optoelectronic processing architecture of digital halftoning image processor. Error diffusion networks implemented by the inherently parallel nature of photonics promise to provide high quality digital halftoned images.

  11. Physical-layer network coding for passive optical interconnect in datacenter networks.

    Science.gov (United States)

    Lin, Rui; Cheng, Yuxin; Guan, Xun; Tang, Ming; Liu, Deming; Chan, Chun-Kit; Chen, Jiajia

    2017-07-24

    We introduce physical-layer network coding (PLNC) technique in a passive optical interconnect (POI) architecture for datacenter networks. The implementation of the PLNC in the POI at 2.5 Gb/s and 10Gb/s have been experimentally validated while the gains in terms of network layer performances have been investigated by simulation. The results reveal that in order to realize negligible packet drop, the wavelengths usage can be reduced by half while a significant improvement in packet delay especially under high traffic load can be achieved by employing PLNC over POI.

  12. Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

    International Nuclear Information System (INIS)

    Li, Yi; Lim, Adeline B.Y.; Luo, Kaiming; Chen, Zhong; Wu, Fengshun; Chan, Y.C.

    2016-01-01

    The evolution of microstructure in Cu/In–48Sn/Cu solder bump interconnects at a current density of 0.7 × 10"4 A/cm"2 and ambient temperature of 55 °C has been investigated. During electromigration, tin (Sn) atoms migrated from cathode to anode, while indium (In) atoms migrated from anode to cathode. As a result, the segregation of the Sn-rich phase and the In-rich phase occurred. A Sn-rich layer and an In-rich layer were formed at the anode and the cathode, respectively. The accumulation rate of the Sn-rich layer was 1.98 × 10"−"9 cm/s. The atomic flux of Sn was calculated to be approximately 1.83 × 10"1"3 atoms/cm"2s. The product of the diffusivity and the effective charge number of Sn was determined to be approximately 3.13 × 10"−"1"0 cm"2/s. The In–48Sn/Cu IMC showed a two layer structure of Cu_6(Sn,In)_5, adjacent to the Cu, and Cu(In,Sn)_2, adjacent to the solder. Both the cathode IMC and the anode IMC thickened with increasing electromigration time. The IMC evolution during electromigration was strongly influenced by the migration of Cu atoms from cathode to anode and the accumulation of Sn-rich and In-rich layers. During electromigration, the Cu(In,Sn)_2 at the cathode interface thickened significantly, with a spalling characteristic, due to the accumulation of In-rich layer and the migration of Cu atoms - while the Cu(In,Sn)_2 at the anode interface reduced obviously, due to the accumulation of Sn-rich layer. The mechanism of electromigration-induced failure in Cu/In–48Sn/Cu interconnects was the cathode Cu dissolution-induced solder melt, which led to the rapid consumption of Cu in the cathode pad during liquid-state electromigration and this finally led to the failure. - Highlights: • Sn migrates to the anode, while In migrates to the cathode, during EM in Cu/In–48Sn/Cu. • The atomic flux of Sn has been calculated. • The interfacial IMCs were identified as: Cu_6(Sn,In)_5 + Cu(In,Sn)_2. • The interface evolution is strongly

  13. Decreasing Soft Costs for Solar Photovoltaics by Improving the Interconnection Process. A Case Study of Pacific Gas and Electric

    Energy Technology Data Exchange (ETDEWEB)

    Ardani, Kristen [National Renewable Energy Lab. (NREL), Golden, CO (United States); Margolis, Robert [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2015-09-01

    As of the end of 2014, Pacific Gas and Electric (PG&E) had connected over 130,000 DG PV systems in its service territory, more than any other utility in the U.S. In this case study, we examine how PG&E achieved a faster, more efficient interconnection approval process despite rising application volumes.

  14. Interconnected TiO2 Nanowire Networks for PbS Quantum Dot Solar Cell Applications

    Directory of Open Access Journals (Sweden)

    Fan Xu

    2012-01-01

    Full Text Available We present a simple method for the fabrication of an interconnected porous TiO2 nanostructured film via dip coating in a colloidal suspension of ultrathin TiO2 nanowires followed by high-temperature annealing. The spheroidization of the nanowires and the fusing of the loosely packed nanowire films at the contact points lead to the formation of nanopores. Using this interconnected TiO2 nanowire network for electron transport, a PbS/TiO2 heterojunction solar cell with a large short-circuit current of 2.5 mA/cm2, a Voc of 0.6 V, and a power conversion efficiency of 5.4% is achieved under 8.5 mW/cm2 white light illumination. Compared to conventional planar TiO2 film structures, these results suggest superior electron transport properties while still providing the large interfacial area between PbS quantum dots and TiO2 required for efficient exciton dissociation.

  15. Green interconnecting materials for semiconductor industry

    NARCIS (Netherlands)

    Matin, M.A.; Vellinga, W.P.; Geers, M.G.D.; Sawada, K.; Ishida, M.

    2009-01-01

    Interconnecting materials experience a complex thermo-mechanical load in applications. This may lead to the formation of macroscopic cracks resulting from induced stresses of the differences in thermal expansion coefficients on a sample scale (since different materials are involved) and on a grain

  16. An architectural model for network interconnection

    NARCIS (Netherlands)

    van Sinderen, Marten J.; Vissers, C.A.; Kalin, T.

    1983-01-01

    This paper presents a technique of successive decomposition of a common users' activity to illustrate the problems of network interconnection. The criteria derived from this approach offer a structuring principle which is used to develop an architectural model that embeds heterogeneous subnetworks

  17. Nominate an Organization | Distributed Generation Interconnection

    Science.gov (United States)

    Collaborative | NREL Nominate an Organization Nominate an Organization Do you know of an organization doing high-quality, innovative work on the interconnection of distributed generation? Want to practices by nominating an organization to be profiled in an online case study! Please include your

  18. Characterization of a Cobalt-Tungsten Interconnect

    DEFF Research Database (Denmark)

    Harthøj, Anders; Holt, Tobias; Caspersen, Michael

    2012-01-01

    is to act both as a diffusion barrier for chromium and provide better protection against high temperature oxidation than a pure cobalt coating. This work presents a characterization of a cobalt-tungsten alloy coating electrodeposited on the ferritic steel Crofer 22 H which subsequently was oxidized in air......A ferritic steel interconnect for a solid oxide fuel cell must be coated in order to prevent chromium evaporation from the steel substrate. The Technical University of Denmark and Topsoe Fuel Cell have developed an interconnect coating based on a cobalt-tungsten alloy. The purpose of the coating...... for 300 h at 800 °C. The coating was characterized with Glow Discharge Optical Spectroscopy (GDOES), Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD). The oxidation properties were evaluated by measuring weight change of coated samples of Crofer 22 H and Crofer 22 APU as a function...

  19. Comparative Analysis and Considerations for PV Interconnection Standards in the United States and China

    Energy Technology Data Exchange (ETDEWEB)

    None

    2017-01-01

    The main objectives of this report are to evaluate China's photovoltaic (PV) interconnection standards and the U.S. counterparts and to propose recommendations for future revisions to these standards. This report references the 2013 report Comparative Study of Standards for Grid-Connected PV System in China, the U.S. and European Countries, which compares U.S., European, and China's PV grid interconnection standards; reviews various metrics for the characterization of distribution network with PV; and suggests modifications to China's PV interconnection standards and requirements. The recommendations are accompanied by assessments of four high-penetration PV grid interconnection cases in the United States to illustrate solutions implemented to resolve issues encountered at different sites. PV penetration in China and in the United States has significantly increased during the past several years, presenting comparable challenges depending on the conditions of the grid at the point of interconnection; solutions are generally unique to each interconnected PV installation or PV plant.

  20. High temperature corrosion of metallic interconnects in solid oxide fuel cells

    Directory of Open Access Journals (Sweden)

    Bastidas, D. M.

    2006-12-01

    Full Text Available Research and development has made it possible to use metallic interconnects in solid oxide fuel cells (SOFC instead of ceramic materials. The use of metallic interconnects was formerly hindered by the high operating temperature, which made the interconnect degrade too much and too fast to be an efficient alternative. When the operating temperature was lowered, the use of metallic interconnects proved to be favourable since they are easier and cheaper to produce than ceramic interconnects. However, metallic interconnects continue to be degraded despite the lowered temperature, and their corrosion products contribute to electrical degradation in the fuel cell. Coatings of nickel, chromium, aluminium, zinc, manganese, yttrium or lanthanum between the interconnect and the electrodes reduce this degradation during operation

    El uso de interconectores metálicos en pilas de combustible de óxido sólido (SOFC en sustitución de materiales cerámicos ha sido posible gracias a la investigación y desarrollo de nuevos materiales metálicos. Inicialmente, el uso de interconectores metálicos fue limitado, debido a la elevada temperatura de trabajo, ocasionando de forma rápida la degradación del material, lo que impedía que fuesen una alternativa. A medida que la temperatura de trabajo de las SOFC descendió, el uso de interconectores metálicos demostró ser una buena alternativa, dado que son más fáciles de fabricar y más baratos que los interconectores cerámicos. Sin embargo, los interconectores metálicos continúan degradándose a pesar de descender la temperatura a la que operan las SOFC y, asimismo, los productos de corrosión favorecen las pérdidas eléctricas de la pila de combustible. Recubrimientos de níquel, cromo, aluminio, zinc, manganeso, itrio y lantano entre el interconector y los electrodos reduce dichas pérdidas eléctricas.

  1. Decreasing Soft Costs for Solar Photovoltaics by Improving the Interconnection Process. A Case Study of Pacific Gas and Electric

    Energy Technology Data Exchange (ETDEWEB)

    Ardani, Kristen [National Renewable Energy Lab. (NREL), Golden, CO (United States); Margolis, Robert [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2015-09-01

    In this case study, we examine how PG&E achieved a faster, more efficient interconnection approval process despite rising application volumes. Our goal is to draw insights from PG&E's experience that can help to inform decision making at other utilities across the U.S. that may face similar trajectories for DG PV market growth.

  2. Communication Requirements and Interconnect Optimization forHigh-End Scientific Applications

    Energy Technology Data Exchange (ETDEWEB)

    Kamil, Shoaib; Oliker, Leonid; Pinar, Ali; Shalf, John

    2007-11-12

    The path towards realizing peta-scale computing isincreasingly dependent on building supercomputers with unprecedentednumbers of processors. To prevent the interconnect from dominating theoverall cost of these ultra-scale systems, there is a critical need forhigh-performance network solutions whose costs scale linearly with systemsize. This work makes several unique contributions towards attaining thatgoal. First, we conduct one of the broadest studies to date of high-endapplication communication requirements, whose computational methodsinclude: finite-difference, lattice-bolzmann, particle in cell, sparselinear algebra, particle mesh ewald, and FFT-based solvers. Toefficiently collect this data, we use the IPM (Integrated PerformanceMonitoring) profiling layer to gather detailed messaging statistics withminimal impact to code performance. Using the derived communicationcharacterizations, we next present fit-trees interconnects, a novelapproach for designing network infrastructure at a fraction of thecomponent cost of traditional fat-tree solutions. Finally, we propose theHybrid Flexibly Assignable Switch Topology (HFAST) infrastructure, whichuses both passive (circuit) and active (packet) commodity switchcomponents to dynamically reconfigure interconnects to suit thetopological requirements of scientific applications. Overall ourexploration leads to a promising directions for practically addressingthe interconnect requirements of future peta-scale systems.

  3. Simple and reusable fibre-to-chip interconnect with adjustable coupling eficiency

    NARCIS (Netherlands)

    Heideman, Rene; Lambeck, Paul; Parriaux, Olivier M.; Kley, Ernst-Bernhard

    1997-01-01

    A simple, efficient and reusable fiber-to-chip interconnect is presented. The interconnect is based on a V-groove (wet- chemically etched) in silicon, combined with a loose-mode Si3N4-channel waveguide. The loose-mode waveguide is adiabatically tapered to the integrated optical (sensor) circuitry.

  4. Robust design of head interconnect for hard disk drive

    Science.gov (United States)

    Gao, X. K.; Liu, Q. H.; Liu, Z. J.

    2005-05-01

    Design of head interconnect is one of the important issues for hard disk drives with higher data rate and storage capacity. The impedance of interconnect and electromagnetic coupling influence the quality level of data communication. Thus an insightful study on how the trace configuration affects the impedance and crosstalk is necessary. An effective design approach based on Taguchi's robust design method is employed therefore in an attempt to realize impedance matching and crosstalk minimization with the effects of uncontrollable sources taken into consideration.

  5. Next Generation Space Interconnect Standard (NGSIS): a modular open standards approach for high performance interconnects for space

    Science.gov (United States)

    Collier, Charles Patrick

    2017-04-01

    The Next Generation Space Interconnect Standard (NGSIS) effort is a Government-Industry collaboration effort to define a set of standards for interconnects between space system components with the goal of cost effectively removing bandwidth as a constraint for future space systems. The NGSIS team has selected the ANSI/VITA 65 OpenVPXTM standard family for the physical baseline. The RapidIO protocol has been selected as the basis for the digital data transport. The NGSIS standards are developed to provide sufficient flexibility to enable users to implement a variety of system configurations, while meeting goals for interoperability and robustness for space. The NGSIS approach and effort represents a radical departure from past approaches to achieve a Modular Open System Architecture (MOSA) for space systems and serves as an exemplar for the civil, commercial, and military Space communities as well as a broader high reliability terrestrial market.

  6. Electronic constant current and current pulse signal generator for nuclear instrumentation testing

    International Nuclear Information System (INIS)

    Brown, R.A.

    1994-01-01

    Circuitry is described for testing the ability of an intermediate range nuclear instrument to detect and measure a constant current and a periodic current pulse. The invention simulates the resistance and capacitance of the signal connection of a nuclear instrument ion chamber detector and interconnecting cable. An LED flasher/oscillator illuminates an LED at a periodic rate established by a timing capacitor and circuitry internal to the flasher/oscillator. When the LED is on, a periodic current pulse is applied to the instrument. When the LED is off, a constant current is applied. An inductor opposes battery current flow when the LED is on. 1 figures

  7. Development of Innovative Distributed Power Interconnection and Control Systems: Annual Report, December 2000-December 2001

    Energy Technology Data Exchange (ETDEWEB)

    Liss, W.; Dybel, M.; West, R.; Adams, L.

    2002-11-01

    This report covers the first year's work performed by the Gas Technology Institute and Encorp Inc. under subcontract to the National Renewable Energy Laboratory. The objective of this three-year contract is to develop innovative grid interconnection and control systems. This supports the advancement of distributed generation in the marketplace by making installations more cost-effective and compatible across the electric power and energy management systems. Specifically, the goals are: (1) To develop and demonstrate cost-effective distributed power grid interconnection products and software and communication solutions applicable to improving the economics of a broad range of distributed power systems, including existing, emerging, and other power generation technologies. (2) To enhance the features and capabilities of distributed power products to integrate, interact, and provide operational benefits to the electric power and advanced energy management systems. This includes features and capabilities for participating in resource planning, the provision of ancillary services, and energy management. Specific topics of this report include the development of an advanced controller, a power sensing board, expanded communication capabilities, a revenue-grade meter interface, and a case study of an interconnection distributed power system application that is a model for demonstrating the functionalities of the design of the advanced controller.

  8. Electromigration failures under bidirectional current stress

    Science.gov (United States)

    Tao, Jiang; Cheung, Nathan W.; Hu, Chenming

    1998-01-01

    Electromigration failure under DC stress has been studied for more than 30 years, and the methodologies for accelerated DC testing and design rules have been well established in the IC industry. However, the electromigration behavior and design rules under time-varying current stress are still unclear. In CMOS circuits, as many interconnects carry pulsed-DC (local VCC and VSS lines) and bidirectional AC current (clock and signal lines), it is essential to assess the reliability of metallization systems under these conditions. Failure mechanisms of different metallization systems (Al-Si, Al-Cu, Cu, TiN/Al-alloy/TiN, etc.) and different metallization structures (via, plug and interconnect) under AC current stress in a wide frequency range (from mHz to 500 MHz) has been study in this paper. Based on these experimental results, a damage healing model is developed, and electromigration design rules are proposed. It shows that in the circuit operating frequency range, the "design-rule current" is the time-average current. The pure AC component of the current only contributes to self-heating, while the average (DC component) current contributes to electromigration. To ensure longer thermal-migration lifetime under high frequency AC stress, an additional design rule is proposed to limit the temperature rise due to self-joule heating.

  9. Implementation of interconnect simulation tools in spice

    Science.gov (United States)

    Satsangi, H.; Schutt-Aine, J. E.

    1993-01-01

    Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

  10. Structure-dependent behavior of stress-induced voiding in Cu interconnects

    International Nuclear Information System (INIS)

    Wu Zhenyu; Yang Yintang; Chai Changchun; Li Yuejin; Wang Jiayou; Li Bin; Liu Jing

    2010-01-01

    Stress modeling and cross-section failure analysis by focused-ion-beam have been used to investigate stress-induced voiding phenomena in Cu interconnects. The voiding mechanism and the effect of the interconnect structure on the stress migration have been studied. The results show that the most concentrated tensile stress appears and voids form at corners of vias on top surfaces of Cu M1 lines. A simple model of stress induced voiding in which vacancies arise due to the increase of the chemical potential under tensile stress and diffuse under the force of stress gradient along the main diffusing path indicates that stress gradient rather than stress itself determines the voiding rate. Cu interconnects with larger vias show less resistance to stress-induced voiding due to larger stress gradient at corners of vias.

  11. A Study on an Energy Conservation and Interconnection Scheme between WSN and Internet Based on the 6LoWPAN

    Directory of Open Access Journals (Sweden)

    Runtong Zhang

    2015-01-01

    Full Text Available Wireless sensor network (WSN, which has broad application prospects, consists of small nodes with sensing, computation, and communications capabilities. IPv6 is used over low power WPAN (wireless personal area network which is run by 6LoWPAN technology on the LoWPAN devices. In order to establish seamless connection of two heterogeneous networks, that is, WSN and IPv6 network, this paper proposes an improved energy conservation and interconnection scheme (ECIS based on the analysis of the current schemes. Detailed design of each functional component in the new scheme is proposed, and an expansion of the SSCS module in NS2 802.15.4 simulator is examined. Comprehensive experiments on the simulation platform show that the newly proposed scheme is advantageous over existing results.

  12. Electrochemical fabrication of interconnected tungsten bronze nanosheets for high performance supercapacitor

    Science.gov (United States)

    Yang, Gan; Liu, Xiao-Xia

    2018-04-01

    Interconnected H0.12WO3ṡH2O nanosheets with high electrochemical performances are fabricated on partial exfoliated graphite substrate (Ex-GF) by potential-limited pulse galvanostatic method (PLPG). The dead volume problem of bulk pesudocapacitive materials is addressed by the novel interconnected nanosheets structure, enabling a large specific capacitance of 5.95 F cm-2 (495.8 F g-1) at 2 mA cm-2. Merited from the fluent electrolyte penetration channels established by the plenty voids among nanosheets, as well as fast electron transportation in the electronic conductive tungsten bronze which is directly grown from graphite substrate, the obtained WO3/Ex-GF demonstrates excellent rate capability. The material can maintain 60.0% of its capacitance when the discharge current density increases from 2 to 100 mA cm-2. Moreover, WO3/Ex-GF doesn't show capacitance decay after 5000 galvanostatic charge-discharge cycles, displaying its super stability. Furthermore, a high performance asymmetric supercapacitor assembled by using WO3/Ex-GF and electrochemical fabricated MnO2/Ex-GF as negative and positive electrodes, respectively displays a high energy density of 2.88 mWh cm-3 at the power density of 11.1 mW cm-3, demonstrating its potential application for energy storage.

  13. Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections

    Science.gov (United States)

    Zhang, Bin; Yang, Xiaokuo; Liu, Jiahao; Li, Weiwei; Xu, Jie

    2018-02-01

    Nanomagnet logic (NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects. Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06).

  14. Construction of programmable interconnected 3D microfluidic networks

    International Nuclear Information System (INIS)

    Hunziker, Patrick R; Wolf, Marc P; Wang, Xueya; Zhang, Bei; Marsch, Stephan; Salieb-Beugelaar, Georgette B

    2015-01-01

    Microfluidic systems represent a key-enabling platform for novel diagnostic tools for use at the point-of-care in clinical contexts as well as for evolving single cell diagnostics. The design of 3D microfluidic systems is an active field of development, but construction of true interconnected 3D microfluidic networks is still a challenge, in particular when the goal is rapid prototyping, accurate design and flexibility. We report a novel approach for the construction of programmable 3D microfluidic systems consisting of modular 3D template casting of interconnected threads to allow user-programmable flow paths and examine its structural characteristics and its modular function. To overcome problems with thread template casting reported in the literature, low-surface-energy polymer threads were used, that allow solvent-free production. Connected circular channels with excellent roundness and low diameter variability were created. Variable channel termination allowed programming a flow path on-the-fly, thus rendering the resulting 3D microfluidic systems highly customizable even after production. Thus, construction of programmable/reprogrammable fully 3D microfluidic systems by template casting of a network of interconnecting threads is feasible, leads to high-quality and highly reproducible, complex 3D geometries. (paper)

  15. Accurate Modeling Method for Cu Interconnect

    Science.gov (United States)

    Yamada, Kenta; Kitahara, Hiroshi; Asai, Yoshihiko; Sakamoto, Hideo; Okada, Norio; Yasuda, Makoto; Oda, Noriaki; Sakurai, Michio; Hiroi, Masayuki; Takewaki, Toshiyuki; Ohnishi, Sadayuki; Iguchi, Manabu; Minda, Hiroyasu; Suzuki, Mieko

    This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully, incorporated and universally expressed. In addition, we have developed specific test patterns for the model parameters extraction, and an efficient extraction flow. We have extracted the model parameters for 0.15μm CMOS using this method and confirmed that 10%τpd error normally observed with conventional LPE (Layout Parameters Extraction) was completely dissolved. Moreover, it is verified that the model can be applied to more advanced technologies (90nm, 65nm and 55nm CMOS). Since the interconnect delay variations due to the processes constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

  16. LHC beampipe interconnection

    CERN Document Server

    Particle beams circulate for around 10 hours in the Large Hadron Collider (LHC). During this time, the particles make four hundred million revolutions of the machine, travelling a distance equivalent to the diameter of the solar system. The beams must travel in a pipe which is emptied of air, to avoid collisions between the particles and air molecules (which are considerably bigger than protons). The beam pipes are pumped down to an air pressure similar to that on the surface of the moon. Much of the LHC runs at 1.9 degrees above absolute zero. When material is cooled, it contracts. The interconnections must absorb this contraction whilst maintaining electrical connectivity.

  17. Reliable, Low Cost Distributed Generator/Utility System Interconnect: 2001 Annual Report

    Energy Technology Data Exchange (ETDEWEB)

    2003-08-01

    This report details a research program to develop requirements that support the definition, design, and demonstration of a distributed generation-electric power system interconnection interface concept that allows distributed generation to be interconnected to the electric power system in a manner that provides value to end users without compromising reliability and performance.

  18. Modeling of Ni Diffusion Induced Austenite Formation in Ferritic Stainless Steel Interconnects

    DEFF Research Database (Denmark)

    Chen, Ming; Alimadadi, Hossein; Molin, Sebastian

    2017-01-01

    Ferritic stainless steel interconnect plates are widely used in planar solid oxide fuel cell and electrolysis cell stacks. During stack production and operation, nickel from the Ni/yttria stabilized zirconia fuel electrode or from the Ni contact component layer diffuses into the interconnect plate......, causing transformation of the ferritic phase into an austenitic phase in the interface region. This is accompanied with changes in volume, and in mechanical and corrosion properties of the interconnect plates. In this work, kinetic modeling of the inter-diffusion between Ni and FeCr based ferritic...

  19. One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Dufva, Martin; Jensen, Thomas Glasdam

    2010-01-01

    A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfac...

  20. EEG simulation by 2D interconnected chaotic oscillators

    Energy Technology Data Exchange (ETDEWEB)

    Kubany, Adam, E-mail: adamku@bgu.ac.i [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel); Mhabary, Ziv; Gontar, Vladimir [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel)

    2011-01-15

    Research highlights: ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. An inverse problem solution (PRCGA) is proposed. Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  1. EEG simulation by 2D interconnected chaotic oscillators

    International Nuclear Information System (INIS)

    Kubany, Adam; Mhabary, Ziv; Gontar, Vladimir

    2011-01-01

    Research highlights: → ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. → An inverse problem solution (PRCGA) is proposed. → Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  2. Structural characteristics of carbon nanofibers for on-chip interconnect applications

    International Nuclear Information System (INIS)

    Ominami, Yusuke; Ngo, Quoc; Austin, Alexander J.; Yoong, Hans; Yang, Cary Y.; Cassell, Alan M.; Cruden, Brett A.; Li Jun; Meyyappan, M.

    2005-01-01

    In this letter, we compare the structures of plasma-enhanced chemical vapor deposition of Ni-catalyzed and Pd-catalyzed carbon nanofibers (CNFs) synthesized for on-chip interconnect applications with scanning transmission electron microscopy (STEM). The Ni-catalyzed CNF has a conventional fiberlike structure and many graphitic layers that are almost parallel to the substrate at the CNF base. In contrast, the Pd-catalyzed CNF has a multiwall nanotubelike structure on the sidewall spanning the entire CNF. The microstructure observed in the Pd-catalyzed fibers at the CNF-metal interface has the potential to lower contact resistance significantly, as our electrical measurements using current-sensing atomic force microscopy indicate. A structural model is presented based on STEM image analysis

  3. 76 FR 42534 - Mandatory Reliability Standards for Interconnection Reliability Operating Limits; System...

    Science.gov (United States)

    2011-07-19

    ... Reliability Operating Limits; System Restoration Reliability Standards AGENCY: Federal Energy Regulatory... data necessary to analyze and monitor Interconnection Reliability Operating Limits (IROL) within its... Interconnection Reliability Operating Limits, Order No. 748, 134 FERC ] 61,213 (2011). \\2\\ The term ``Wide-Area...

  4. Interconnection of bundled solid oxide fuel cells

    Science.gov (United States)

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  5. Modular cryogenic interconnects for multi-qubit devices

    Energy Technology Data Exchange (ETDEWEB)

    Colless, J. I.; Reilly, D. J., E-mail: david.reilly@sydney.edu.au [ARC Centre of Excellence for Engineered Quantum Systems, School of Physics, The University of Sydney, Sydney, NSW 2006 (Australia)

    2014-11-15

    We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with −3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.

  6. A large interconnecting network within hybrid MEH-PPV/TiO2 nanorod photovoltaic devices

    International Nuclear Information System (INIS)

    Zeng, T-W; Lin, Y-Y; Lo, H-H; Chen, C-W; Chen, C-H; Liou, S-C; Huang, H-Y; Su, W-F

    2006-01-01

    This is a study of hybrid photovoltaic devices based on TiO 2 nanorods and poly[2-methoxy-5-(2'-ethyl-hexyloxy)-1,4-phenylene vinylene] (MEH-PPV). We use TiO 2 nanorods as the electron acceptors and conduction pathways. Here we describe how to develop a large interconnecting network within the photovoltaic device fabricated by inserting a layer of TiO 2 nanorods between the MEH-PPV:TiO 2 nanorod hybrid active layer and the aluminium electrode. The formation of a large interconnecting network provides better connectivity to the electrode, leading to a 2.5-fold improvement in external quantum efficiency as compared to the reference device without the TiO 2 nanorod layer. A power conversion efficiency of 2.2% under illumination at 565 nm and a maximum external quantum efficiency of 24% at 430 nm are achieved. A power conversion efficiency of 0.49% is obtained under Air Mass 1.5 illumination

  7. Traffic Load on Interconnection Lines of Generalized Double Ring Network Structures

    DEFF Research Database (Denmark)

    Pedersen, Jens Myrup; Riaz, Muhammad Tahir; Madsen, Ole Brun

    2004-01-01

    Generalized Double Ring (N2R) network structures possess a number of good properties, but being not planar they are hard to physically embed in communication networks. However, if some of the lines, the interconnection lines, are implemented by wireless technologies, the remaining structure...... consists of two planar rings, which are easily embedded by fiber or other wired solutions. It is shown that for large N2R structures, the interconnection lines carry notably lower loads than the other lines if shortest-path routing is used, and the effects of two other routing schemes are explored, leading...... to lower load on interconnection lines at the price of larger efficient average distance and diameter....

  8. Electrohydrodynamic direct—writing of conductor—insulator-conductor multi-layer interconnection

    International Nuclear Information System (INIS)

    Zheng Gao-Feng; Pei Yan-Bo; Wang Xiang; Zheng Jian-Yi; Sun Dao-Heng

    2014-01-01

    A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor—insulator—conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10 −7 Ω·m and 1.39 × 10 −7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor—insulator—conductor multi-layer interconnections in the electronic industry

  9. Cyclic deformation-induced solute transport in tissue scaffolds with computer designed, interconnected, pore networks: experiments and simulations.

    Science.gov (United States)

    Den Buijs, Jorn Op; Dragomir-Daescu, Dan; Ritman, Erik L

    2009-08-01

    Nutrient supply and waste removal in porous tissue engineering scaffolds decrease from the periphery to the center, leading to limited depth of ingrowth of new tissue into the scaffold. However, as many tissues experience cyclic physiological strains, this may provide a mechanism to enhance solute transport in vivo before vascularization of the scaffold. The hypothesis of this study was that pore cross-sectional geometry and interconnectivity are of major importance for the effectiveness of cyclic deformation-induced solute transport. Transparent elastic polyurethane scaffolds, with computer-programmed design of pore networks in the form of interconnected channels, were fabricated using a 3D printing and injection molding technique. The scaffold pores were loaded with a colored tracer for optical contrast, cyclically compressed with deformations of 10 and 15% of the original undeformed height at 1.0 Hz. Digital imaging was used to quantify the spatial distribution of the tracer concentration within the pores. Numerical simulations of a fluid-structure interaction model of deformation-induced solute transport were compared to the experimental data. The results of experiments and modeling agreed well and showed that pore interconnectivity heavily influences deformation-induced solute transport. Pore cross-sectional geometry appears to be of less relative importance in interconnected pore networks. Validated computer models of solute transport can be used to design optimal scaffold pore geometries that will enhance the convective transport of nutrients inside the scaffold and the removal of waste, thus improving the cell survivability deep inside the scaffold.

  10. Microwave evaluation of electromigration susceptibility in advanced interconnects

    Science.gov (United States)

    Sunday, Christopher E.; Veksler, Dmitry; Cheung, Kin C.; Obeng, Yaw S.

    2017-11-01

    Traditional metrology has been unable to adequately address the needs of the emerging integrated circuits (ICs) at the nano scale; thus, new metrology and techniques are needed. For example, the reliability challenges in fabrication need to be well understood and controlled to facilitate mass production of through-substrate-via (TSV) enabled three-dimensional integrated circuits (3D-ICs). This requires new approaches to the metrology. In this paper, we use the microwave propagation characteristics to study the reliability issues that precede the physical damage caused by electromigration in the Cu-filled TSVs. The pre-failure microwave insertion losses and group delay are dependent on both the device temperature and the amount of current forced through the devices-under-test. The microwave insertion losses increase with the increase in the test temperature, while the group delay increases with the increase in the forced direct current magnitude. The microwave insertion losses are attributed to the defect mobility at the Cu-TiN interface, and the group delay changes are due to resistive heating in the interconnects, which perturbs the dielectric properties of the cladding dielectrics of the copper fill in the TSVs.

  11. Fundamentals of reliability engineering applications in multistage interconnection networks

    CERN Document Server

    Gunawan, Indra

    2014-01-01

    This book presents fundamentals of reliability engineering with its applications in evaluating reliability of multistage interconnection networks. In the first part of the book, it introduces the concept of reliability engineering, elements of probability theory, probability distributions, availability and data analysis.  The second part of the book provides an overview of parallel/distributed computing, network design considerations, and more.  The book covers a comprehensive reliability engineering methods and its practical aspects in the interconnection network systems. Students, engineers, researchers, managers will find this book as a valuable reference source.

  12. A Monolithic Interconnected module with a tunnel Junction for Enhanced Electrical and Optical Performance

    Energy Technology Data Exchange (ETDEWEB)

    Murray, Christopher Sean; Wilt, David Morgan

    1999-06-30

    An improved thermophotovoltaic (TPV) n/p/n device is provided. Monolithic Interconnected Modules (MIMs), semiconductor devices converting infrared radiation to electricity, have been developed with improved electrical and optical performance. The structure is an n-type emitter on a p-type base with an n-type lateral conduction layer. The incorporation of a tunnel junction and the reduction in the amount of p-type material used results in negligible parasitic absorption, decreased series resistance, increased voltage and increased active area. The novel use of a tunnel junction results in the potential for a TPV device with efficiency greater than 24%.

  13. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    KAUST Repository

    Qaiser, Nadeem

    2017-11-21

    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.

  14. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    KAUST Repository

    Qaiser, Nadeem; Khan, S. M.; Nour, Maha A.; Rehman, M. U.; Rojas, J. P.; Hussain, Muhammad Mustafa

    2017-01-01

    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.

  15. Nonfragile Guaranteed Cost Control and Optimization for Interconnected Systems of Neutral Type

    Directory of Open Access Journals (Sweden)

    Heli Hu

    2013-01-01

    Full Text Available The design and optimization problems of the nonfragile guaranteed cost control are investigated for a class of interconnected systems of neutral type. A novel scheme, viewing the interconnections with time-varying delays as effective information but not disturbances, is developed to decrease the conservatism. Many techniques on decomposing and magnifying the matrices are utilized to obtain the guaranteed cost of the considered system. Also, an algorithm is proposed to solve the nonlinear problem of the interconnected matrices. Based on this algorithm, the minimization of the guaranteed cost of the considered system is obtained by optimization. Further, the state feedback control is extended to the case in which the underlying system is dependent on uncertain parameters. Finally, two numerical examples are given to illustrate the proposed method, and some comparisons are made to show the advantages of the schemes of dealing with the interconnections.

  16. Graphene-on-diamond devices with increased current-carrying capacity: carbon sp2-on-sp3 technology.

    Science.gov (United States)

    Yu, Jie; Liu, Guanxiong; Sumant, Anirudha V; Goyal, Vivek; Balandin, Alexander A

    2012-03-14

    Graphene demonstrated potential for practical applications owing to its excellent electronic and thermal properties. Typical graphene field-effect transistors and interconnects built on conventional SiO(2)/Si substrates reveal the breakdown current density on the order of 1 μA/nm(2) (i.e., 10(8) A/cm(2)), which is ~100× larger than the fundamental limit for the metals but still smaller than the maximum achieved in carbon nanotubes. We show that by replacing SiO(2) with synthetic diamond, one can substantially increase the current-carrying capacity of graphene to as high as ~18 μA/nm(2) even at ambient conditions. Our results indicate that graphene's current-induced breakdown is thermally activated. We also found that the current carrying capacity of graphene can be improved not only on the single-crystal diamond substrates but also on an inexpensive ultrananocrystalline diamond, which can be produced in a process compatible with a conventional Si technology. The latter was attributed to the decreased thermal resistance of the ultrananocrystalline diamond layer at elevated temperatures. The obtained results are important for graphene's applications in high-frequency transistors, interconnects, and transparent electrodes and can lead to the new planar sp(2)-on-sp(3) carbon-on-carbon technology. © 2012 American Chemical Society

  17. The fabrication of well-interconnected polycaprolactone/hydroxyapatite composite scaffolds, enhancing the exposure of hydroxyapatite using the wire-network molding technique.

    Science.gov (United States)

    Cho, Yong Sang; Hong, Myoung Wha; Jeong, Hoon-Jin; Lee, Seung-Jae; Kim, Young Yul; Cho, Young-Sam

    2017-11-01

    In this study, the fabrication method was proposed for the well-interconnected polycaprolactone/hydroxyapatite composite scaffold with exposed hydroxyapatite using modified WNM technique. To characterize well-interconnected scaffolds in terms of hydroxyapatite exposure, several assessments were performed as follows: morphology, mechanical property, wettability, calcium ion release, and cell response assessments. The results of these assessments were compared with those of control scaffolds which were fabricated by precision extruding deposition (PED) apparatus. The control PED scaffolds have interconnected pores with nonexposed hydroxyapatite. Consequently, cell attachment of proposed WNM scaffold was improved by increased hydrophilicity and surface roughness of scaffold surface resulting from the exposure of hydroxyapatite particles and fabrication process using powders. Moreover, cell proliferation and differentiation of WNM scaffold were increased, because the exposure of hydroxyapatite particles may enhance cell adhesion and calcium ion release. © 2016 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 105B: 2315-2325, 2017. © 2016 Wiley Periodicals, Inc.

  18. Development of Interconnect Technologies for Particle Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Tripathi, Mani [Univ. of California, Davis, CA (United States)

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  19. Interconnection of the Keys north of the country with the National Electro energetic System (SEN) through a submarine cable

    International Nuclear Information System (INIS)

    Sánchez Yañez, Pablo

    2017-01-01

    Most of the keys of the north of the country have a high potential for tourism Sun and beach, which is why each has an associated infrastructure that allows hotels have the necessary quality standards. Within this infrastructure the continuous electrical service must have each hotel to meet the needs of tourists stands. Today the keys are isolated from the SEN and electrical service is supplied by generators. These groups feed on fuel and diesel, and generate polluting gases near where the major hotel groups are. The problems in transporting fuel and pollution they generate have led to begin to analyze different ways of providing electric service stably in the keys. One possible option to address the problems generated by power generators in an isolated system is to interconnect the cay with SEN. This connection can be made in three ways; by airlines, underground cables or submarine cables. The airlines in the tourist areas are discarded because they affect the visuality this is why variants of underground cables or submarines are almost always handled. The proposal is to interconnect the keys with submarine cable where current conditions do not allow the use of underground cables. This interconnection can meet the demand of the keys stably and more reliably than current conditions. In addition to cases where there is a tourism growth should be no more generators only have a cable with the ability to transfer all the power needed. (author)

  20. Interconnected porous hydroxyapatite ceramics for bone tissue engineering

    Science.gov (United States)

    Yoshikawa, Hideki; Tamai, Noriyuki; Murase, Tsuyoshi; Myoui, Akira

    2008-01-01

    Several porous calcium hydroxyapatite (HA) ceramics have been used clinically as bone substitutes, but most of them possessed few interpore connections, resulting in pathological fracture probably due to poor bone formation within the substitute. We recently developed a fully interconnected porous HA ceramic (IP-CHA) by adopting the ‘foam-gel’ technique. The IP-CHA had a three-dimensional structure with spherical pores of uniform size (average 150 μm, porosity 75%), which were interconnected by window-like holes (average diameter 40 μm), and also demonstrated adequate compression strength (10–12 MPa). In animal experiments, the IP-CHA showed superior osteoconduction, with the majority of pores filled with newly formed bone. The interconnected porous structure facilitates bone tissue engineering by allowing the introduction of mesenchymal cells, osteotropic agents such as bone morphogenetic protein or vasculature into the pores. Clinically, we have applied the IP-CHA to treat various bony defects in orthopaedic surgery, and radiographic examinations demonstrated that grafted IP-CHA gained radiopacity more quickly than the synthetic HA in clinical use previously. We review the accumulated data on bone tissue engineering using the novel scaffold and on clinical application in the orthopaedic field. PMID:19106069

  1. Patterned electrodeposition of interconnects using microcontact printing

    NARCIS (Netherlands)

    Hovestad, A.; Rendering, H.; Maijenburg, A.W.

    2012-01-01

    Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of

  2. Comparing Germany's and California's Interconnection Processes for PV Systems (White Paper)

    Energy Technology Data Exchange (ETDEWEB)

    Tweedie, A.; Doris, E.

    2011-07-01

    Establishing interconnection to the grid is a recognized barrier to the deployment of distributed energy generation. This report compares interconnection processes for photovoltaic projects in California and Germany. This report summarizes the steps of the interconnection process for developers and utilities, the average length of time utilities take to process applications, and paperwork required of project developers. Based on a review of the available literature, this report finds that while the interconnection procedures and timelines are similar in California and Germany, differences in the legal and regulatory frameworks are substantial.

  3. Processing and Prolonged 500 C Testing of 4H-SiC JFET Integrated Circuits with Two Levels of Metal Interconnect

    Science.gov (United States)

    Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

    2015-01-01

    Complex integrated circuit (IC) chips rely on more than one level of interconnect metallization for routing of electrical power and signals. This work reports the processing and testing of 4H-SiC junction field effect transistor (JFET) prototype IC's with two levels of metal interconnect capable of prolonged operation at 500 C. Packaged functional circuits including 3- and 11-stage ring oscillators, a 4-bit digital to analog converter, and a 4-bit address decoder and random access memory cell have been demonstrated at 500 C. A 3-stage oscillator functioned for over 3000 hours at 500 C in air ambient. Improved reproducibility remains to be accomplished.

  4. Opto-VLSI-based reconfigurable free-space optical interconnects architecture

    DEFF Research Database (Denmark)

    Aljada, Muhsen; Alameh, Kamal; Chung, Il-Sug

    2007-01-01

    is the Opto-VLSI processor which can be driven by digital phase steering and multicasting holograms that reconfigure the optical interconnects between the input and output ports. The optical interconnects architecture is experimentally demonstrated at 2.5 Gbps using high-speed 1×3 VCSEL array and 1......×3 photoreceiver array in conjunction with two 1×4096 pixel Opto-VLSI processors. The minimisation of the crosstalk between the output ports is achieved by appropriately aligning the VCSEL and PD elements with respect to the Opto-VLSI processors and driving the latter with optimal steering phase holograms....

  5. Interconnected 3 D Network of Graphene-Oxide Nanosheets Decorated with Carbon Dots for High-Performance Supercapacitors.

    Science.gov (United States)

    Zhao, Xiao; Li, Ming; Dong, Hanwu; Liu, Yingliang; Hu, Hang; Cai, Yijin; Liang, Yeru; Xiao, Yong; Zheng, Mingtao

    2017-06-22

    Interconnected 3 D nanosheet networks of reduced graphene oxide decorated with carbon dots (rGO/CDs) are successfully fabricated through a simple one-pot hydrothermal process. The as-prepared rGO/CDs present appropriate 3 D interconnectivity and abundant stable oxygen-containing functional groups, to which we can attribute the excellent electrochemical performance such as high specific capacitance, good rate capability, and great cycling stability. Employed as binder-free electrodes for supercapacitors, the resulting rGO/CDs exhibit excellent long-term cycling stability (ca. 92 % capacitance retention after 20 000 charge/discharge cycles at current density of 10 A g -1 ) as well as a maximum specific capacitance of about 308 F g -1 at current density of 0.5 A g -1 , which is much higher than that of rGO (200 F g -1 ) and CDs (2.2 F g -1 ). This work provides a promising strategy to fabricate graphene-based nanomaterials with greatly boosted electrochemical performances by decoration of with CDs. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

  6. A full-duplex working integrated optoelectronic device for optical interconnect

    Science.gov (United States)

    Liu, Kai; Fan, Huize; Huang, Yongqing; Duan, Xiaofeng; Wang, Qi; Ren, Xiaomin; Wei, Qi; Cai, Shiwei

    2018-05-01

    In this paper, a full-duplex working integrated optoelectronic device is proposed. It is constructed by integrating a vertical cavity surface emitting laser (VCSEL) unit above a resonant cavity enhanced photodetector (RCE-PD) unit. Analysis shows that, the VCSEL unit has a threshold current of 1 mA and a slop efficiency of 0.66 W/A at 849.7 nm, the RCE-PD unit obtains its maximal absorption quantum efficiency of 90.24% at 811 nm with a FWHM of 4 nm. Moreover, the two units of the proposed integrated device can work independently from each other. So that the proposed integrated optoelectronic device can work full-duplex. It can be applied for single fiber bidirectional optical interconnects system.

  7. Integrated optoelectronic materials and circuits for optical interconnects

    International Nuclear Information System (INIS)

    Hutcheson, L.D.

    1988-01-01

    Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

  8. Individual pore and interconnection size analysis of macroporous ceramic scaffolds using high-resolution X-ray tomography

    Energy Technology Data Exchange (ETDEWEB)

    Jerban, Saeed, E-mail: saeed.jerban@usherbrooke.ca; Elkoun, Saïd, E-mail: Said.Elkoun@usherbrooke.ca

    2016-08-15

    The pore interconnection size of β-tricalcium phosphate scaffolds plays an essential role in the bone repair process. Although, the μCT technique is widely used in the biomaterial community, it is rarely used to measure the interconnection size because of the lack of algorithms. In addition, discrete nature of the μCT introduces large systematic errors due to the convex geometry of interconnections. We proposed, verified and validated a novel pore-level algorithm to accurately characterize the individual pores and interconnections. Specifically, pores and interconnections were isolated, labeled, and individually analyzed with high accuracy. The technique was verified thoroughly by visually inspecting and verifying over 3474 properties of randomly selected pores. This extensive verification process has passed a one-percent accuracy criterion. Scanning errors inherent in the discretization, which lead to both dummy and significantly overestimated interconnections, have been examined using computer-based simulations and additional high-resolution scanning. Then accurate correction charts were developed and used to reduce the scanning errors. Only after the corrections, both the μCT and SEM-based results converged, and the novel algorithm was validated. Material scientists with access to all geometrical properties of individual pores and interconnections, using the novel algorithm, will have a more-detailed and accurate description of the substitute architecture and a potentially deeper understanding of the link between the geometric and biological interaction. - Highlights: •An algorithm is developed to analyze individually all pores and interconnections. •After pore isolating, the discretization errors in interconnections were corrected. •Dummy interconnections and overestimated sizes were due to thin material walls. •The isolating algorithm was verified through visual inspection (99% accurate). •After correcting for the systematic errors, algorithm was

  9. Deposition and characterisation of copper for high density interconnects

    International Nuclear Information System (INIS)

    McCusker, N.

    1999-09-01

    Copper has been deposited by sputtering and investigated for application as high density interconnects, with a view to maximising its performance and reliability. A sputter deposition process using gettering has been developed, which produces consistently pure, low resistivity films. A relationship between film thickness and resistivity has been explained by studying the grain growth process in copper films using atomic force microscopy. The Maydas-Shatzkes model has been used to separate the contributions of grain boundary and surface scattering to thin film resistivity, in copper and gold. Stress and texture in copper film have been studied. Annealing has been used to promote grain growth and texture development. Electromigration has been studied in copper and aluminium interconnects using a multi-line accelerated test set-up. A difference in failure distributions and void morphologies has been explained by an entirely different damage mechanism. The importance of surface/interface migration in electromigration damage of copper lines has been established and explained using a grain boundary-grooving model. A tantalum overlayer was found to extend the lifetime of copper lines. A composite sputtering target has been used to deposit copper/zirconium alloy films. The composition of the alloys was studied by Rutherford backscattering, Auger and secondary neutral mass spectrometry. The alloy films had an improved electromigration lifetime. A surface controlled mechanism is proposed to explain the advantage. A metal oxide semiconductor (MOS) capacitor technique is used to investigate barrier reliability. Tungsten is shown to be an effective diffusion barrier for copper, up to 700 deg. C. (author)

  10. 75 FR 6020 - Electrical Interconnection of the Lower Snake River Wind Energy Project

    Science.gov (United States)

    2010-02-05

    ... DEPARTMENT OF ENERGY Bonneville Power Administration Electrical Interconnection of the Lower Snake River Wind Energy Project AGENCY: Bonneville Power Administration (BPA), Department of Energy (DOE... (BPA) has decided to offer Puget Sound Energy Inc., a Large Generator Interconnection Agreement for...

  11. In-situ growth of LiFePO4 nanocrystals on interconnected carbon nanotubes/mesoporous carbon nanosheets for high-performance lithium ion batteries

    International Nuclear Information System (INIS)

    Wu, Ruofei; Xia, Guofeng; Shen, Shuiyun; Zhu, Fengjuan; Jiang, Fengjing; Zhang, Junliang

    2015-01-01

    Graphical abstract: In-situ soft-templated LFP nanocrystals on interconnected carbon nanotubes/mesoporous carbon nanosheets (designated as LFP@CNTs/CNSs), exhibited superior electrochemical performance due to the synergetic effect between CNTs and CNSs, which form interconnected conductive network for fast transport of both electrons and lithium ions. - Highlights: • LFP nanocrystals were in-situ synthesized on interconnected CNTs/CNSs framework with an in-situ soft-templated method. • LFP@CNTs/CNSs exhibited superior rate capability and cycling stability, due to interconnected conductive network for fast transport of both electrons and lithium ions. • The synergetic effect between CNTs and CNSs on the electrochemical performance of LFP electrode was demonstrated by a systematically electrochemical study compared with LFP/CNSs and LFP/CNTs. - Abstract: Lithium ion phosphate (LiFePO 4 ) nanocrystals are successfully in-situ grown on interconnected carbon nanotubes/mesoporous carbon nanosheets (designated as LFP@CNTs/CNSs) with a soft-templated method, which involves the multi-constituent co-assembly of a triblock copolymer, CNTs, resol and precursors of LFP followed by thermal treatment. X-ray diffraction, scanning electron microscopy, high resolution transmission electron microscopy and N 2 adsorption-desorption techniques are used to characterize the structure and morphology of the as-synthesized materials. When used as the cathode of lithium ion batteries, the LFP@CNTs/CNSs composite exhibits superior rate capability and cycling stability, compared with the samples modified only with CNSs (designated as LFP/CNSs) or with CNTs (designated as LFP/CNTs). This is mainly attributed to the synergetic effect between CNTs and CNSs caused by their unique structure, which forms interconnected conductive network for fast transport of both electrons and lithium ions, and thus remarkably improves the electrode kinetics. Firstly, nano-sized LFP are in-situ grown on the

  12. Determining optimal interconnection capacity on the basis of hourly demand and supply functions of electricity

    International Nuclear Information System (INIS)

    Keppler, Jan Horst; Meunier, William; Coquentin, Alexandre

    2017-01-01

    Interconnections for cross-border electricity flows are at the heart of the project to create a common European electricity market. At the time, increase in production from variable renewables clustered during a limited numbers of hours reduces the availability of existing transport infrastructures. This calls for higher levels of optimal interconnection capacity than in the past. In complement to existing scenario-building exercises such as the TYNDP that respond to the challenge of determining optimal levels of infrastructure provision, the present paper proposes a new empirically-based methodology to perform Cost-Benefit analysis for the determination of optimal interconnection capacity, using as an example the French-German cross-border trade. Using a very fine dataset of hourly supply and demand curves (aggregated auction curves) for the year 2014 from the EPEX Spot market, it constructs linearized net export (NEC) and net import demand curves (NIDC) for both countries. This allows assessing hour by hour the welfare impacts for incremental increases in interconnection capacity. Summing these welfare increases over the 8 760 hours of the year, this provides the annual total for each step increase of interconnection capacity. Confronting welfare benefits with the annual cost of augmenting interconnection capacity indicated the socially optimal increase in interconnection capacity between France and Germany on the basis of empirical market micro-data. (authors)

  13. Systems theory of interconnected port contact systems

    NARCIS (Netherlands)

    Eberard, D.; Maschke, B.M.; Schaft, A.J. van der

    2005-01-01

    Port-based network modeling of a large class of complex physical systems leads to dynamical systems known as port-Hamiltonian systems. The key ingredient of any port-Hamiltonian system is a power-conserving interconnection structure (mathematically formalized by the geometric notion of a Dirac

  14. Ultra-precision fabrication of high density micro-optical backbone interconnections for data center and mobile application

    Science.gov (United States)

    Lohmann, U.; Jahns, J.; Wagner, T.; Werner, C.

    2012-10-01

    A microoptical 3D interconnection scheme and fabricated samples of this fiberoptical multi-channel interconnec- tion with an actual capacity of 144 channels were shown. Additionally the aspects of micrometer-fabrication of such microoptical interconnection modules in the view of alignment-tolerances were considered. For the realiza- tion of the interconnection schemes, the approach of planar-integrated free space optics (PIFSO) is used with its well known advantages. This approach offers the potential for complex interconnectivity, and yet compact size.

  15. Overvoltages related to distributed generation-power system interconnection transformer

    Energy Technology Data Exchange (ETDEWEB)

    Zamanillo, G.R.; Gomez, J.C.; Florena, E.F. [Rio Cuarto National University (IPSEP/UNRC), Cordoba (Argentina). Electric Power Systems Protection Institute], Email: jcgomez@ing.unrc.edu.ar

    2009-07-01

    The energy crisis that experiences the world drives to carry to an extreme, the use of all energy sources which are available. The sources need to be connected to the electric network in their next point, requiring of electric-electronic interfaces. The traditional electric power systems are changing their characteristics, in what concerns to structure, operation and on overvoltage generation. This change is not taking place in coordinated form among the involved sectors. The interconnection of a Distributed Generator (DG) directly with the power system is objectionable and risky. It is required of an interconnection transformer which performs several functions. Rigid specifications do not exist in this respect, for the variety of systems in use in the world, nevertheless there are utilities recommendations. Overvoltages caused by the DG, which arise due to the change of structure of the electric system, are explained. The transformer connection selection, presents positive and negative aspects that impact the utility and the user in a different or many times in an antagonistic way. The phenomenon of balanced and unbalanced ferroresonance overvoltage is studied. This phenomenon can takes place when using DG, either with synchronous or asynchronous generator, and for any type of connection of the transformer. The necessary conditions so that the phenomenon appears are presented. Eight interconnection transformer connection ways were studied. It is concluded that the solutions to reach by means of the employment of the DG, offer technical-economic advantages so much to the utility as to the user. It is also concluded in this work that the more advisable interconnection type is function of the system connection type. (author)

  16. X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects

    Science.gov (United States)

    Spolenak, R.; Tamura, N.; Patel, J. R.

    2006-02-01

    Most reliability issues in interconnect systems occur at a local scale and many of them include the local build-up of stresses. Typical failure mechanisms are electromigration and stress voiding in interconnect lines and fatigue in surface acoustic wave devices. Thus a local probe is required for the investigation of these phenomena. In this paper the application of the Laue microdiffraction technique to investigate flux divergences in interconnect systems will be described. The deviatoric strain tensor of single grains can be correlated with the local microstructure, orientation and defect density. Especially the latter led to recent results about the correlation of stress build-up and orientation in Cu lines and electromigration-induced grain rotation in Cu and Al lines.

  17. Natural gas and electrical interconnections in the Mediterranean Basin

    International Nuclear Information System (INIS)

    Grenon, M.

    1992-01-01

    Intermediate and long term socio-economical and energetic scenarios have shown that mediterranean basin countries will know a great growth of energy demand, particularly power demand. The first part of this paper describes the main projects for the establishment of interconnected natural gas systems through Mediterranean sea, by pipelines (Algeria-Tunisia-Libya project, Algeria-Morocco-Spain project, Libya-Italy project). The second part describes the main projects of electrical networks with the establishment of undersea links between Spain and Morocco, and between Italy and Tunisia; beefing up the interconnections between the North African countries; and developing ties in the Near East (from Egypt to Turkey)

  18. Supplemental Information for New York State Standardized Interconnection Requirements

    Energy Technology Data Exchange (ETDEWEB)

    Ingram, Michael [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narang, David J. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Mather, Barry A. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Kroposki, Benjamin D. [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-10-24

    This document is intended to aid in the understanding and application of the New York State Standardized Interconnection Requirements (SIR) and Application Process for New Distributed Generators 5 MW or Less Connected in Parallel with Utility Distribution Systems, and it aims to provide supplemental information and discussion on selected topics relevant to the SIR. This guide focuses on technical issues that have to date resulted in the majority of utility findings within the context of interconnecting photovoltaic (PV) inverters. This guide provides background on the overall issue and related mitigation measures for selected topics, including substation backfeeding, anti-islanding and considerations for monitoring and controlling distributed energy resources (DER).

  19. Knowledge Access in Rural Inter-connected Areas Network ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... the existing network to include two thematic networks on food security and rural ... Woman conquering male business in Yemen : Waleya's micro-enterprise.

  20. Knowledge Access in Rural Inter-connected Areas Network ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... poor by sharing innovations, best practices and indigenous knowledge using ... A third thematic network - on knowledge management strategies - will play an ...

  1. National Offshore Wind Energy Grid Interconnection Study

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB Inc; Liu, Shu [ABB Inc; Ibanez, Eduardo [National Renewable Energy Laboratory; Pennock, Ken [AWS Truepower; Reed, Greg [University of Pittsburgh; Hanes, Spencer [Duke Energy

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  2. Security analysis of interconnected AC/DC systems

    DEFF Research Database (Denmark)

    Eriksson, Robert

    2015-01-01

    This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid...... any line or transformer limits. Simulations were performed in a model of the Nordic power system where a dc grid is placed on top. The simulation supports the method as a tool to consider transfer limits in the grid to avoid violate the same and increase the security after a converter outage........ The redistribution of power has a sudden effect on the power-flow in the interconnected ac system. This may cause overloading of lines and transformers resulting in disconnection of equipment, and as a consequence cascading failure. The PTDF is used as a method to analyze and avoid violating limits by in the dc...

  3. Minimum short-circuit ratios for grid interconnection of wind farms with induction generators

    Energy Technology Data Exchange (ETDEWEB)

    Reginatto, Romeu; Rocha, Carlos [Western Parana State University (UNIOESTE), Foz do Iguacu, PR (Brazil). Center for Engineering and Exact Sciences], Emails: romeu@unioeste.br, croberto@unioeste.br

    2009-07-01

    This paper concerns the problem of determining the minimum value for the short-circuit ratio which is adequate for the interconnection of a given wind farms to a given grid point. First, a set of 3 criteria is defined in order to characterize the quality/safety of the interconnection: acceptable terminal voltage variations, a minimum active power margin, and an acceptable range for the internal voltage angle. Then, the minimum short circuit ratio requirement is determined for 6 different induction generator based wind turbines, both fixed-speed (with and without reactive power compensation) and variable-speed (with the following control policies: reactive power, power factor, and terminal voltage regulation). The minimum short-circuit ratio is determined and shown in graphical results for the 6 wind turbines considered, for X/R in the range 0-15, also analyzing the effect of more/less stringent tolerances for the interconnection criteria. It is observed that the tighter the tolerances the larger the minimum short-circuit ratio required. For the same tolerances in the interconnection criteria, a comparison of the minimum short circuit ratio required for the interconnection of both squirrel-cage and doubly-fed induction generators is presented, showing that the last requires much smaller values for the short-circuit ratio. (author)

  4. Thermoelectric Coolers with Sintered Silver Interconnects

    Science.gov (United States)

    Kähler, Julian; Stranz, Andrej; Waag, Andreas; Peiner, Erwin

    2014-06-01

    The fabrication and performance of a sintered Peltier cooler (SPC) based on bismuth telluride with sintered silver interconnects are described. Miniature SPC modules with a footprint of 20 mm2 were assembled using pick-and-place pressure-assisted silver sintering at low pressure (5.5 N/mm2) and moderate temperature (250°C to 270°C). A modified flip-chip bonder combined with screen/stencil printing for paste transfer was used for the pick-and-place process, enabling high positioning accuracy, easy handling of the tiny bismuth telluride pellets, and immediate visual process control. A specific contact resistance of (1.4 ± 0.1) × 10-5 Ω cm2 was found, which is in the range of values reported for high-temperature solder interconnects of bismuth telluride pellets. The realized SPCs were evaluated from room temperature to 300°C, considerably outperforming the operating temperature range of standard commercial Peltier coolers. Temperature cycling capability was investigated from 100°C to 235°C over more than 200 h, i.e., 850 cycles, during which no degradation of module resistance or cooling performance occurred.

  5. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-12-05

    ... Electronics Engineers (IEEE) Standard 1547 for Interconnecting Distributed Resources with Electric Power... discriminatory manner.\\38\\ \\37\\ The Electricity Consumers Resource Council, American Chemistry Council, American...

  6. Viewing Integrated-Circuit Interconnections By SEM

    Science.gov (United States)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  7. DIMACS Workshop on Interconnection Networks and Mapping, and Scheduling Parallel Computations

    CERN Document Server

    Rosenberg, Arnold L; Sotteau, Dominique; NSF Science and Technology Center in Discrete Mathematics and Theoretical Computer Science; Interconnection networks and mapping and scheduling parallel computations

    1995-01-01

    The interconnection network is one of the most basic components of a massively parallel computer system. Such systems consist of hundreds or thousands of processors interconnected to work cooperatively on computations. One of the central problems in parallel computing is the task of mapping a collection of processes onto the processors and routing network of a parallel machine. Once this mapping is done, it is critical to schedule computations within and communication among processor from universities and laboratories, as well as practitioners involved in the design, implementation, and application of massively parallel systems. Focusing on interconnection networks of parallel architectures of today and of the near future , the book includes topics such as network topologies,network properties, message routing, network embeddings, network emulation, mappings, and efficient scheduling. inputs for a process are available where and when the process is scheduled to be computed. This book contains the refereed pro...

  8. MOEA based design of decentralized controllers for LFC of interconnected power systems with nonlinearities, AC-DC parallel tie-lines and SMES units

    International Nuclear Information System (INIS)

    Ganapathy, S.; Velusami, S.

    2010-01-01

    A new design of Multi-Objective Evolutionary Algorithm based decentralized controllers for load-frequency control of interconnected power systems with Governor Dead Band and Generation Rate Constraint nonlinearities, AC-DC parallel tie-lines and Superconducting Magnetic Energy Storage (SMES) units, is proposed in this paper. The HVDC link is used as system interconnection in parallel with AC tie-line to effectively damp the frequency oscillations of AC system while the SMES unit provides bulk energy storage and release, thereby achieving combined benefits. The proposed controller satisfies two main objectives, namely, minimum Integral Squared Error of the system output and maximum closed-loop stability of the system. Simulation studies are conducted on a two area interconnected power system with nonlinearities, AC-DC tie-lines and SMES units. Results indicate that the proposed controller improves the transient responses and guarantees the closed-loop stability of the overall system even in the presence of system nonlinearities and with parameter changes.

  9. TEM sample preparation by FIB for carbon nanotube interconnects

    International Nuclear Information System (INIS)

    Ke, Xiaoxing; Bals, Sara; Romo Negreira, Ainhoa; Hantschel, Thomas; Bender, Hugo; Van Tendeloo, Gustaaf

    2009-01-01

    A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5 kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects.

  10. TEM sample preparation by FIB for carbon nanotube interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Ke, Xiaoxing, E-mail: xiaoxing.ke@ua.ac.be [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); Bals, Sara [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); Romo Negreira, Ainhoa [IMEC, Kapeldreef 75, B-3001 Leuven (Belgium); Metallurgy and Materials Engineering Department, KU Leuven, Kasteelpark Arenberg 44, Leuven B-3001 (Belgium); Hantschel, Thomas; Bender, Hugo [IMEC, Kapeldreef 75, B-3001 Leuven (Belgium); Van Tendeloo, Gustaaf [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium)

    2009-10-15

    A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5 kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects.

  11. Metal-interconnection-free integration of InGaN/GaN light emitting diodes with AlGaN/GaN high electron mobility transistors

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chao; Cai, Yuefei; Liu, Zhaojun; Ma, Jun; Lau, Kei May, E-mail: eekmlau@ust.hk [Photonics Technology Center, Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon (Hong Kong)

    2015-05-04

    We report a metal-interconnection-free integration scheme for InGaN/GaN light emitting diodes (LEDs) and AlGaN/GaN high electron mobility transistors (HEMTs) by combining selective epi removal (SER) and selective epitaxial growth (SEG) techniques. SER of HEMT epi was carried out first to expose the bottom unintentionally doped GaN buffer and the sidewall GaN channel. A LED structure was regrown in the SER region with the bottom n-type GaN layer (n-electrode of the LED) connected to the HEMTs laterally, enabling monolithic integration of the HEMTs and LEDs (HEMT-LED) without metal-interconnection. In addition to saving substrate real estate, minimal interface resistance between the regrown n-type GaN and the HEMT channel is a significant improvement over metal-interconnection. Furthermore, excellent off-state leakage characteristics of the driving transistor can also be guaranteed in such an integration scheme.

  12. Metal-interconnection-free integration of InGaN/GaN light emitting diodes with AlGaN/GaN high electron mobility transistors

    International Nuclear Information System (INIS)

    Liu, Chao; Cai, Yuefei; Liu, Zhaojun; Ma, Jun; Lau, Kei May

    2015-01-01

    We report a metal-interconnection-free integration scheme for InGaN/GaN light emitting diodes (LEDs) and AlGaN/GaN high electron mobility transistors (HEMTs) by combining selective epi removal (SER) and selective epitaxial growth (SEG) techniques. SER of HEMT epi was carried out first to expose the bottom unintentionally doped GaN buffer and the sidewall GaN channel. A LED structure was regrown in the SER region with the bottom n-type GaN layer (n-electrode of the LED) connected to the HEMTs laterally, enabling monolithic integration of the HEMTs and LEDs (HEMT-LED) without metal-interconnection. In addition to saving substrate real estate, minimal interface resistance between the regrown n-type GaN and the HEMT channel is a significant improvement over metal-interconnection. Furthermore, excellent off-state leakage characteristics of the driving transistor can also be guaranteed in such an integration scheme

  13. Ultra-stretchable Interconnects for high-density stretchable electronics

    NARCIS (Netherlands)

    Shafqat, S.; Hoefnagels, J.P.M.; Savov, A.; Joshi, S.; Dekker, R.; Geers, M.G.D.

    2017-01-01

    The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for

  14. Power System Study for Renewable Energy Interconnection in Malaysia

    International Nuclear Information System (INIS)

    Askar, O F; Ramachandaramurthy, V K

    2013-01-01

    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  15. Power System Study for Renewable Energy Interconnection in Malaysia

    Science.gov (United States)

    Askar, O. F.; Ramachandaramurthy, V. K.

    2013-06-01

    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  16. CWDM for very-short-reach and optical-backplane interconnections

    Science.gov (United States)

    Laha, Michael J.

    2002-06-01

    Course Wavelength Division Multiplexing (CWDM) provides access to next generation optical interconnect data rates by utilizing conventional electro-optical components that are widely available in the market today. This is achieved through the use of CWDM multiplexers and demultiplexers that integrate commodity type active components, lasers and photodiodes, into small optical subassemblies. In contrast to dense wavelength division multiplexing (DWDM), in which multiple serial data streams are combined to create aggregate data pipes perhaps 100s of gigabits wide, CWDM uses multiple laser sources contained in one module to create a serial equivalent data stream. For example, four 2.5 Gb/s lasers are multiplexed to create a 10 Gb/s data pipe. The advantages of CWDM over traditional serial optical interconnects include lower module power consumption, smaller packaging, and a superior electrical interface. This discussion will detail the concept of CWDM and design parameters that are considered when productizing a CWDM module into an industry standard optical interconnect. Additionally, a scalable parallel CWDM hybrid architecture will be described that allows the transport of large amounts of data from rack to rack in an economical fashion. This particular solution is targeted at solving optical backplane bottleneck problems predicted for the next generation terabit and petabit routers.

  17. Lateral buckling and mechanical stretchability of fractal interconnects partially bonded onto an elastomeric substrate

    International Nuclear Information System (INIS)

    Fu, Haoran; Xu, Sheng; Rogers, John A.; Xu, Renxiao; Huang, Yonggang; Jiang, Jianqun; Zhang, Yihui

    2015-01-01

    Fractal-inspired designs for interconnects that join rigid, functional devices can ensure mechanical integrity in stretchable electronic systems under extreme deformations. The bonding configuration of such interconnects with the elastomer substrate is crucial to the resulting deformation modes, and therefore the stretchability of the entire system. In this study, both theoretical and experimental analyses are performed for postbuckling of fractal serpentine interconnects partially bonded to the substrate. The deformation behaviors and the elastic stretchability of such systems are systematically explored, and compared to counterparts that are not bonded at all to the substrate

  18. Experimental demonstration of titanium nitride plasmonic interconnects

    DEFF Research Database (Denmark)

    Kinsey, N.; Ferrera, M.; Naik, G. V.

    2014-01-01

    An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 mu m. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 mu m...

  19. Scandinavian interconnections as a means for an integrated and sustainable European system

    International Nuclear Information System (INIS)

    Hedenstedt, A.; Hansson, B.

    1996-01-01

    After the national grids had been established the comprehensive integration of the Nordic countries took place during a 20 year's period that started in early 1960's. A characteristic feature of the interconnection of the Nordic electric power systems is the need for long HVDC submarine cables for several of the interconnection links. Today the Nordel system is almost considered as one system. At present there are several ongoing, actively considered and planned projects for the integration of the Nordel system and the UCPTE system. The interconnection links offer a number of benefits for both the systems. One very important benefit is the stabilisation effect on the power supply security and the price for electricity. This is of special importance in view of the expected de-regulation of the electricity market. (author)

  20. Interconnection France-England; Interconnexion France-Angleterre

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    These documents defines the interconnection France-England rules for the 2000 MW DC submarine cable directly linking the transmission networks of England and Wales and France. Rights to use Interconnector capacity from 1 April 2001 are to be offered through competitive tenders and auctions, full details of which are set out in the Rules. The contract and a guide to the application form are provided. (A.L.B.)

  1. Cross-border electricity exchanges. Use and management of interconnections in 2012

    International Nuclear Information System (INIS)

    2013-06-01

    This report provides an overview of the use and management of interconnections between the French power transmission system and those in its border countries. This report measures the effectiveness of existing mechanisms and intends to provide an overview of the role of interconnections in the European Electricity Market and the manner in which they are actually used. Furthermore, this document provides an opportunity to reiterate recent and upcoming progress towards the implementation of target-models. Part 1 presents a set of indicators used to provide a general overview of capacities available on the market, the manner in which they are acquired and used by market players and the consequences of this use in terms of congestion income. Part 2 sets out a more detailed approach for each capacity acquisition time frame. It highlights the differences between mechanisms at each of the French interconnections and, more importantly, confirms the relevance of the target-models

  2. LaCrO{sub 3}-dispersed Cr for metallic interconnect of planar SOFC

    Energy Technology Data Exchange (ETDEWEB)

    Song, Rak-Hyun; Shin, Dong Ryul [Korea Institute of Energy Research, Taejon (Korea, Republic of); Dokiya, Masayuki [National Institute of Materials and Chemical Research, Ibaraki (Japan)

    1996-12-31

    In the planar SOFC, the interconnect materials plays two roles as an electrical connection and as a gas separation plate in a cell stack. The interconnect materials must be chemically stable in reducing and oxidizing environments, and have high electronic conductivity, high thermal conductivity, matching thermal expansion with an electrolyte, high mechanical strength, good fabricability, and gas tightness. Lanthanum chromite so far has been mainly used as interconnect materials in planar SOFC. However, the ceramic materials are very weak in mechanical strength and have poor machining property as compared with metal. Also the metallic materials have high electronic conductivity and high thermal conductivity. Recently some researchers have studied metallic interconnects such as Al{sub 2}O{sub 3}/Inconel 600 cermet, Ni-20Cr coated with (LaSr)CoO{sub 3}, and Y{sub 2}O{sub 3-} or La{sub 2}O{sub 3}-dispersed Cr alloy. These alloys have still some problems because Ni-based alloys have high thermal expansion, the added Al{sub 2}O{sub 3}, Y{sub 2}O{sub 3} and La{sub 2}O{sub 3} to metals have no electronic conductivity, and the oxide formed on the surface of Cr alloy has high volatility. To solve these problems, in this study, LaCrO{sub 3}-dispersed Cr for metallic interconnect of planar SOFC was investigated. The LaCrO{sub 3}-dispersed Cr can be one candidate of metallic interconnect because LaCrO{sub 3} possesses electronic conductivity and Cr metal has relatively low thermal expansion. The content of 25 vol.% LaCrO{sub 3} Was selected on the basis of a theoretically calculated thermal expansion. The thermal expansion, electrical and oxidation properties were examined and the results were discussed as related to SOFC requirements.

  3. Access to long-term capacity for electric interconnections: towards a single European set of rules

    International Nuclear Information System (INIS)

    2010-05-01

    Guaranteeing firmness of interconnection capacity (or compensating curtailments based on the daily market prices) is a key element to the design of the integrated European electricity market. However, although the European energy regulators are on the way to reaching a consensus on the target to be met in terms of firmness, there is less consensus on how this target can be reached, which means the two following key questions will have to be duly addressed: - How can we improve confidence in the daily price references used to compensate interconnection capacity holders in cases of curtailment? - How can we encourage transmission system operators to allocate a maximum of financially firm capacity, at a lesser cost for network users? In the short-term, in the absence of appropriate incentive mechanisms to maximise capacity, the regulators have no other choice but to guarantee transmission system operators that costs related to firmness of capacity allocated at the different time frames will be covered. In this perspective, transitory solutions can be implemented by regulators in order to limit the risk borne by network users (for example, by introducing caps on price differentials and/or on the budget available for compensating curtailments). The choices in terms of capacity and how it is distributed between the different time frames (daily, monthly, annual and multi-annual) are also important decision variables, as these could limit the risk borne by network users. In such, as they are responsible for guaranteeing the interests of network users, the regulators should decide what level of capacity should be made available to the market. This decision should be taken in close collaboration with the network operators, who have all the expertise needed in terms of calculating capacity. Finally, on the interconnections where a market-coupling mechanism exists, the regulators should ask the transmission system operators to allocate the long-term interconnection capacity in

  4. Integrated Circuit Interconnect Lines on Lossy Silicon Substrate with Finite Element Method

    OpenAIRE

    Sarhan M. Musa,; Matthew N. O. Sadiku

    2014-01-01

    The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using finite element method (FEM). We specifically illustrate the electrostatic modeling of single and coupled in...

  5. Agriculture for improved nutrition: the current research landscape.

    Science.gov (United States)

    Turner, Rachel; Hawkes, Corinna; Jeff, Waage; Ferguson, Elaine; Haseen, Farhana; Homans, Hilary; Hussein, Julia; Johnston, Deborah; Marais, Debbi; McNeill, Geraldine; Shankar, Bhavani

    2013-12-01

    Concern about food security and its effect on persistent undernutrition has increased interest in how agriculture could be used to improve nutritional outcomes in developing countries. Yet the evidence base for the impact of agricultural interventions targeted at improved nutrition is currently poor. To map the extent and nature of current and planned research on agriculture for improved nutrition in order to identify gaps where more research might be useful. The research, which was conducted from April to August 2012, involved developing a conceptual framework linking agriculture and nutrition, identifying relevant research projects and programs, devising and populating a "template" with details of the research projects in relation to the conceptual framework, classifying the projects, and conducting a gap analysis. The study identified a large number of research projects covering a broad range of themes and topics. There was a strong geographic focus on sub-Saharan Africa, and many studies were explicitly concerned with nutritional impacts on women and children. Although the study revealed a diverse and growing body of research, it also identified research gaps. Few projects consider the entire evidence chain linking agricultural input or practice to nutritional outcomes. There is comparatively little current research on indirect effects of agriculture on nutrition, or the effect of policies or governance, rather than technical interventions. Most research is focused on undernutrition and small farmer households, and few studies target consumers generally, urban populations, or nutrition-related non-communicable diseases. There is very little work on the cost-effectiveness of agricultural interventions. On the basis of these findings, we make suggestions for research investment and for broader engagement of researchers and disciplines in developing approaches to design and evaluate agricultural programs for improved nutrition.

  6. On Interconnections of Infinite-dimensional Port-Hamiltonian Systems

    NARCIS (Netherlands)

    Pasumarthy, Ramkrishna; Schaft, Arjan J. van der

    2004-01-01

    Network modeling of complex physical systems leads to a class of nonlinear systems called port-Hamiltonian systems, which are defined with respect to a Dirac structure (a geometric structure which formalizes the power-conserving interconnection structure of the system). A power conserving

  7. On interconnections of infinite-dimensional port-Hamiltonian systems

    NARCIS (Netherlands)

    Ramkrishna Pasumarthy, R.P.; van der Schaft, Arjan

    2004-01-01

    Network modeling of complex physical systems leads to a class of nonlinear systems called port-Hamiltonian systems, which are defined with respect to a Dirac structure (a geometric structure which formalizes the power-conserving interconnection structure of the system). A power conserving

  8. Optimal interconnect ATPG under a ground-bounce constraint

    NARCIS (Netherlands)

    Hollmann, H.D.L.; Marinissen, E.J.; Vermeulen, B.

    In order to prevent ground bounce, Automatic Test Pattern Generation (ATPG) algorithms for wire interconnects have recently been extended with the capability to restrict the maximal Hamming distance between any two consecutive test patterns to a user-defined integer, referred to as the

  9. A high-speed interconnect network using ternary logic

    DEFF Research Database (Denmark)

    Madsen, Jens Kargaard; Long, S. I.

    1995-01-01

    This paper describes the design and implementation of a high-speed interconnect network (ICN) for a multiprocessor system using ternary logic. By using ternary logic and a fast point-to-point communication technique called STARI (Self-Timed At Receiver's Input), the communication between...

  10. Consolidation of the 13 kA Interconnects in the LHC for Operation at 7 TeV

    CERN Document Server

    Verweij, A P; Tock, J P; Willering, G P; Steckert, J; Perin, A; Scheuerlein, C; Mathot, S; Koratzinos, M; Garion, C; Denz, R; Fessia, P; Charifoulline, Z; Bertinelli, F; Sgobba, S; ten Kate, H H J

    2011-01-01

    The accident in the LHC in September 2008 occurred in an interconnection between two magnets of the 13 kA dipole circuit. Successive measurements of the resistance of other interconnects revealed other defective joints, even though the SC cables were properly connected. These defective joints are characterized by a poor bonding between the SC cable and the copper stabilizer in combination with an electrical discontinuity in the copper stabilizer. A quench at the 7-13 kA level in such a joint can lead to a fast and unprotected thermal run-away and hence opening of the circuit. It has therefore been decided to operate the LHC at a reduced and safe current of 6 kA corresponding to 3.5 TeV beam energy until all defective joints are repaired. A task force is reviewing the status of all electrical joints in the magnet circuits and preparing for the necessary repairs. The principle solution is to resolder the worst defective joints and, in addition, to apply an electrical shunt made of copper across all joints with ...

  11. Optical interconnect technologies for high-bandwidth ICT systems

    Science.gov (United States)

    Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

    2016-03-01

    The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

  12. Three-dimensional interconnected nickel phosphide networks with hollow microstructures and desulfurization performance

    International Nuclear Information System (INIS)

    Zhang, Shuna; Zhang, Shujuan; Song, Limin; Wu, Xiaoqing; Fang, Sheng

    2014-01-01

    Graphical abstract: Three-dimensional interconnected nickel phosphide networks with hollow microstructures and desulfurization performance. - Highlights: • Three-dimensional Ni 2 P has been prepared using foam nickel as a template. • The microstructures interconnected and formed sponge-like porous networks. • Three-dimensional Ni 2 P shows superior hydrodesulfurization activity. - Abstract: Three-dimensional microstructured nickel phosphide (Ni 2 P) was fabricated by the reaction between foam nickel (Ni) and phosphorus red. The as-prepared Ni 2 P samples, as interconnected networks, maintained the original mesh structure of foamed nickel. The crystal structure and morphology of the as-synthesized Ni 2 P were characterized by X-ray diffraction, scanning electron microscopy, automatic mercury porosimetry and X-ray photoelectron spectroscopy. The SEM study showed adjacent hollow branches were mutually interconnected to form sponge-like networks. The investigation on pore structure provided detailed information for the hollow microstructures. The growth mechanism for the three-dimensionally structured Ni 2 P was postulated and discussed in detail. To investigate its catalytic properties, SiO 2 supported three-dimensional Ni 2 P was prepared successfully and evaluated for the hydrodesulfurization (HDS) of dibenzothiophene (DBT). DBT molecules were mostly hydrogenated and then desulfurized by Ni 2 P/SiO 2

  13. Towards a modeling synthesis of two or three-dimensional circuits through substrate coupling and interconnections

    CERN Document Server

    Gontrand, Christian

    2014-01-01

    The number of transistors in integrated circuits doubles every two years, as stipulated by Moore's law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years - currently advanced to the nanometric scale.This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore's law. This reference explains the modeling of 3D circuits without delving into the latest

  14. Carbon Nanotubes and Graphene Nanoribbons: Potentials for Nanoscale Electrical Interconnects

    Directory of Open Access Journals (Sweden)

    Swastik Kar

    2013-08-01

    Full Text Available Carbon allotropes have generated much interest among different scientific communities due to their peculiar properties and potential applications in a variety of fields. Carbon nanotubes and more recently graphene have shown very interesting electrical properties along with the possibility of being grown and/or deposited at a desired location. In this Review, we will focus our attention on carbon-based nanostructures (in particular, carbon nanotubes and graphene nanoribbons which could play an important role in the technological quest to replace copper/low-k for interconnect applications. We will provide the reader with a number of possible architectures, including single-wall as well as multi-wall carbon nanotubes, arranged in horizontal and vertical arrays, regarded as individual objects as well as bundles. Modification of their functional properties in order to fulfill interconnect applications requirements are also presented. Then, in the second part of the Review, recently discovered graphene and in particular graphene and few-graphene layers nanoribbons are introduced. Different architectures involving nanostructured carbon are presented and discussed in light of interconnect application in terms of length, chirality, edge configuration and more.

  15. Space Vector Modulation for DC-Link Current Ripple Reduction in Back-To-Back Current Source Converters for Microgrid Applications

    DEFF Research Database (Denmark)

    Guo, Xiaoqiang; Xu, David; Guerrero, Josep M.

    2015-01-01

    Back-to-back converters have been typically used to interconnect the microgrids. For a back-to-back current source converter, the dc-link current ripple is one of the important parameters. A large ripple will cause the electromagnetic interference, undesirable high-frequency losses, and system...... instability. Conventionally, with a given switching frequency and rated voltage, the current ripple can be reduced by increasing the dc-link inductor, but it leads to bulky size, high cost and slow dynamic response. In order to solve this problem, this paper reveals that the current ripple can...

  16. Load Frequency Control of AC Microgrid Interconnected Thermal Power System

    Science.gov (United States)

    Lal, Deepak Kumar; Barisal, Ajit Kumar

    2017-08-01

    In this paper, a microgrid (MG) power generation system is interconnected with a single area reheat thermal power system for load frequency control study. A new meta-heuristic optimization algorithm i.e. Moth-Flame Optimization (MFO) algorithm is applied to evaluate optimal gains of the fuzzy based proportional, integral and derivative (PID) controllers. The system dynamic performance is studied by comparing the results with MFO optimized classical PI/PID controllers. Also the system performance is investigated with fuzzy PID controller optimized by recently developed grey wolf optimizer (GWO) algorithm, which has proven its superiority over other previously developed algorithm in many interconnected power systems.

  17. Security challenges for cooperative and interconnected mobility systems

    NARCIS (Netherlands)

    Bijlsma, T.; Kievit, S. de; Sluis, H.J.D. van de; Nunen, E. van; Passchier, I.; Luiijf, H.A.M.

    2013-01-01

    Software is becoming an important part of the innovation for vehicles. In addition, the systems in vehicles become interconnected and also get external connections, to the internet and Vehicular Ad hoc NETworks (VANETs). These trends form a combined security and safety threat, because recent

  18. Scalability analysis methodology for passive optical interconnects in data center networks using PAM

    Science.gov (United States)

    Lin, R.; Szczerba, Krzysztof; Agrell, Erik; Wosinska, Lena; Tang, M.; Liu, D.; Chen, J.

    2017-11-01

    A framework is developed for modeling the fundamental impairments in optical datacenter interconnects, i.e., the power loss and the receiver noises. This framework makes it possible, to analyze the trade-offs between data rates, modulation order, and number of ports that can be supported in optical interconnect architectures, while guaranteeing that the required signal-to-noise ratios are satisfied. To the best of our knowledge, this important assessment methodology is not yet available. As a case study, the trade-offs are investigated for three coupler-based top-of-rack interconnect architectures, which suffer from serious insertion loss. The results show that using single-port transceivers with 10 GHz bandwidth, avalanche photodiode detectors, and quadratical pulse amplitude modulation, more than 500 ports can be supported.

  19. A reference model for space data system interconnection services

    Science.gov (United States)

    Pietras, John; Theis, Gerhard

    1993-01-01

    The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

  20. Time-division optical interconnects for local-area and micro-area networks

    Science.gov (United States)

    Krol, Mark F.; Boncek, Raymond K.; Johns, Steven T.; Stacy, John L.

    1991-12-01

    This report describes the development of an optical Time-Division Multiple-Access (TDMA) interconnect suitable for applications in local-area and micro-area networks. The advantages of using time-division techniques instead of frequency-division, wavelength-division, or code-division techniques in a shared-medium environment are discussed in detail. Furthermore, a detailed description of the TDMA architecture is presented along with various experiments pertaining to the actual components needed to implement the system. Finally, experimental data is presented for an actual optical TDMA test bed. The experimental data demonstrates the feasibility of the architecture, and shows that currently the system has the capability to accommodate up to 50 channels. The bit-error-rate per channel was measured to be less than 10(exp -9) for pseudo-random bit-sequences.

  1. Floating dielectric slab optical interconnection between metal-dielectric interface surface plasmon polariton waveguides.

    Science.gov (United States)

    Kang, Minsu; Park, Junghyun; Lee, Il-Min; Lee, Byoungho

    2009-01-19

    A simple and effective optical interconnection which connects two distanced single metal-dielectric interface surface plasmon waveguides by a floating dielectric slab waveguide (slab bridge) is proposed. Transmission characteristics of the suggested structure are numerically studied using rigorous coupled wave analysis, and design rules based on the study are given. In the wave-guiding part, if the slab bridge can support more than the fundamental mode, then the transmission efficiency of the interconnection shows strong periodic dependency on the length of the bridge, due to the multi-mode interference (MMI) effect. Otherwise, only small fluctuation occurs due to the Fabry-Pérot effect. In addition, light beating happens when the slab bridge is relatively short. In the wave-coupling part, on the other hand, gap-assisted transmission occurs at each overlapping region as a consequence of mode hybridization. Periodic dependency on the length of the overlap region also appears due to the MMI effect. According to these results, we propose design principles for achieving both high transmission efficiency and stability with respect to the variation of the interconnection distance, and we show how to obtain the transmission efficiency of 68.3% for the 1mm-long interconnection.

  2. Design and Training of Limited-Interconnect Architectures

    Science.gov (United States)

    1991-07-16

    and signal processing. Neuromorphic (brain like) models, allow an alternative for achieving real-time operation tor such tasks, while having a...compact and robust architecture. Neuromorphic models consist of interconnections of simple computational nodes. In this approach, each node computes a...operational performance. I1. Research Objectives The research objectives were: 1. Development of on- chip local training rules specifically designed for

  3. Health and the environment: Examining some interconnections

    International Nuclear Information System (INIS)

    Nair, G.; Castelino, J.; Parr, R.M.

    1994-01-01

    In various ways, the IAEA is working with national and international agencies to broaden scientific understanding of the interconnections between the environment and human health. Often nuclear and related technologies are applied in the search for answers to complex and puzzling questions. This article highlights some of that work, illustrating the dimensions of both the problems and the potential solutions

  4. Astrophysics Laboratory-Based Lecture Material Development of Solarscope with Integration and Interconnection

    Directory of Open Access Journals (Sweden)

    Asih Melati

    2015-12-01

    Full Text Available The development of laboratory-based lecture materials with integrated and interconnected value is a requirement for study and practical materials and in line with the vision and mission of UIN Sunan Kalijaga. As a result, the optimization of laboratory’s equipment is urgently needed. Although UIN Sunan Kalijaga Laboratory have had Solarscope telescope – which have a guidebook in German language – for six years, it was not optimally used even it can be used to satisfy the desires to observe astronomical objects economically, accurately and easy to operate. Based on above, this research propose to create a lab-work module for Solarscope with integration and interconnection value. This research used 4D methodology (Define, Design, Develop and Disseminate and have passed the assessment and validation phase from material, media and integrated-interconnected value experts. The data analysis of the module which was mapped by Sukarja into 5 scale mark resulted in good grade in the module assessment by material experts with 80% from the ideal mark with most of the complaint is in the formula typing which is not clear in its derivative. The module assessment by media experts scored very good grade with 88.89% from the ideal mark regarding the content and the figures of the module. Lastly, from the integrated-interconnected value experts marked in good grade with 73.50% from the ideal mark and suggested the addition of supported Al-Qur’an verses and relevant exclamation of the Al-Qur’an’s passages. With all of these assessment results, this module can be used as the material of astrophysics lab-work and for supporting students’ researches with integration-interconnection value and enhance the university’s book collection which will support the vision and mission of UIN Sunan Kalijaga

  5. Interconnection of psychology, color and design

    OpenAIRE

    Minchuk, A. M.; Kudryashova, Aleksandra Vladimirovna

    2016-01-01

    The paper presents the direct interconnection between color, design and psychology on the basis of theoretical and historical analysis. It describes the peculiarities of how peopleperceive color. In the paper some of the historical details concerning the way our ancestors used color are presented and the modern scientific discoveries in the field of psychology, which give the evidence of the great psychological, emotional and physical influence of color on a person are shown as well. The pape...

  6. Multi-gigabit optical interconnects for next-generation on-board digital equipment

    Science.gov (United States)

    Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

    2017-11-01

    Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

  7. 77 FR 63757 - Extension of the Commission's Rules Regarding Outage Reporting to Interconnected Voice Over...

    Science.gov (United States)

    2012-10-17

    ... telephone subscriptions in the United States were users of interconnected VoIP providers--an increase of 21... Commission's Rules Regarding Outage Reporting to Interconnected Voice Over Internet Protocol Service Providers and Broadband Internet Service Providers AGENCY: Federal Communications Commission. ACTION: Final...

  8. Improvement of Power Flow Calculation with Optimization Factor Based on Current Injection Method

    Directory of Open Access Journals (Sweden)

    Lei Wang

    2014-01-01

    Full Text Available This paper presents an improvement in power flow calculation based on current injection method by introducing optimization factor. In the method proposed by this paper, the PQ buses are represented by current mismatches while the PV buses are represented by power mismatches. It is different from the representations in conventional current injection power flow equations. By using the combined power and current injection mismatches method, the number of the equations required can be decreased to only one for each PV bus. The optimization factor is used to improve the iteration process and to ensure the effectiveness of the improved method proposed when the system is ill-conditioned. To verify the effectiveness of the method, the IEEE test systems are tested by conventional current injection method and the improved method proposed separately. Then the results are compared. The comparisons show that the optimization factor improves the convergence character effectively, especially that when the system is at high loading level and R/X ratio, the iteration number is one or two times less than the conventional current injection method. When the overloading condition of the system is serious, the iteration number in this paper appears 4 times less than the conventional current injection method.

  9. SnS{sub 2} nanoplates embedded in 3D interconnected graphene network as anode material with superior lithium storage performance

    Energy Technology Data Exchange (ETDEWEB)

    Tang, Hongli [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China); Qi, Xiang, E-mail: xqi@xtu.edu.cn [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China); Han, Weijia; Ren, Long; Liu, Yundan [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China); Wang, Xingyan, E-mail: xywangxtu@163.com [Department of Environmental Science and Engineering, College of Chemical Engineering, Xiangtan University, Xiangtan 411105 (China); Zhong, Jianxin [Hunan Key Laboratory of Micro-Nano Energy Materials and Devices, and School of Physics and Optoelectronics, Xiangtan University, Hunan 411105 (China)

    2015-11-15

    Graphical abstract: Schematic formation process of 3D interconnected SnS{sub 2}/graphene composite, and its superior lithium storage performance. - Highlights: • 3D graphene network embedded with SnS{sub 2} is synthesized by a facile two-step method. • This structure produces a synergistic effect between graphene and SnS{sub 2} nanoplates. • High capacity, excellent cycle performance and good rate capability are achieved. - Abstract: Three-dimensional (3D) interconnected graphene network embedded with uniformly distributed tin disulfide (SnS{sub 2}) nanoplates was prepared by a facile two-step method. The microstructures and morphologies of the SnS{sub 2}/graphene nanocomposite (SSG) are experimentally confirmed by X-ray diffraction (XRD), Raman spectroscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Using the as-prepared SSG as an anode material for lithium batteries, its electrochemical performances were investigated by cyclic voltammograms (CV), charge/discharge tests, galvanostatic cycling performance and AC impedance spectroscopy. The results demonstrate that the as-prepared SSG exhibits excellent cycling performance with a capacity of 1060 mAh g{sup −1} retained after 200 charge/discharge cycles at a current density of 100 mA g{sup −1}, also a superior rate capability of 670 mAh g{sup −1} even at such a high current density of 2000 mA g{sup −1}. This favorable performance can be attributed to the unique 3D interconnected architecture with great electro-conductivity and its intimate contact with SnS{sub 2}. Our results indicate a potential application of this novel 3D SnS{sub 2}/graphene nanocomposite in lithium-ion battery.

  10. Epidemic spreading on interconnected networks.

    Science.gov (United States)

    Saumell-Mendiola, Anna; Serrano, M Ángeles; Boguñá, Marián

    2012-08-01

    Many real networks are not isolated from each other but form networks of networks, often interrelated in nontrivial ways. Here, we analyze an epidemic spreading process taking place on top of two interconnected complex networks. We develop a heterogeneous mean-field approach that allows us to calculate the conditions for the emergence of an endemic state. Interestingly, a global endemic state may arise in the coupled system even though the epidemics is not able to propagate on each network separately and even when the number of coupling connections is small. Our analytic results are successfully confronted against large-scale numerical simulations.

  11. Current-Loop Control for the Pitching Axis of Aerial Cameras via an Improved ADRC

    Directory of Open Access Journals (Sweden)

    BingYou Liu

    2017-01-01

    Full Text Available An improved active disturbance rejection controller (ADRC is designed to eliminate the influences of the current-loop for the pitching axis control system of an aerial camera. The improved ADRC is composed of a tracking differentiator (TD, an improved extended state observer (ESO, an improved nonlinear state error feedback (NLSEF, and a disturbance compensation device (DCD. The TD is used to arrange transient process. The improved ESO is utilized to observe the state extended by nonlinear dynamics, model uncertainty, and external disturbances. Overtime variation of the current-loop can be predicted by the improved ESO. The improved NLSEF is adopted to restrain the residual errors of the current-loop. The DCD is used to compensate the overtime variation of the current-loop in real time. The improved ADRC is designed based on a new nonlinear function newfal(·. This function exhibits enhanced continuity and smoothness compared to previously available nonlinear functions. Thus, the new nonlinear function can effectively decrease the high-frequency flutter phenomenon. The improved ADRC exhibits improved control performance, and disturbances of the current-loop can be eliminated by the improved ADRC. Finally, simulation experiments are performed. Results show that the improved ADRC displayed better performance than the proportional integral (PI control strategy and traditional ADRC.

  12. Highly graphitized laterally interconnected SWCNT network synthesis via a sandwich-grown method

    International Nuclear Information System (INIS)

    Teng, I-Ju; Chen, Kai-Ling; Wang, Li-Chun; Kuo, Cheng-Tzu; Hsu, Hui-Lin; Jian, Sheng-Rui; Chen, Jung-Hsuan; Wang, Wei-Hsiang

    2011-01-01

    We present a sandwich-grown method for growing laterally interconnected single-walled carbon nanotube (SWCNT) networks with a high degree of graphitization by microwave plasma chemical vapour deposition (MPCVD). An Al 2 O 3 -supported Fe catalyst precursor layer deposited on an oxidized Si substrate with an upper Si cover is first pretreated in pure hydrogen, and then exposed to a gas mixture of methane/hydrogen for growth process at a lower growth temperature and a faster rate. The effects of various parameters, such as catalyst film thickness, gas flow rate, working pressure, growth time and plasma power, on the morphologies and structural characteristics of the SWCNT networks are investigated, and therefore provide the essential conditions for direct growth of laterally interconnected SWCNT networks. Analytical results demonstrate that the SWCNT-based lateral architecture comprises a mixture of graphene-sheet-wrapped catalyst particles and laterally interconnected nanotubes, isolated or branched or assembled into bundles. The results also show that the formation of the laterally interconnected SWCNT networks is related to the sandwich-like stack approach and the addition of an Al 2 O 3 layer in the MPCVD process. The successful growth of lateral SWCNT networks provides new experimental information for simply and efficiently preparing lateral SWCNTs on unpatterned substrates, and opens a pathway to create network-structured nanotube-based devices.

  13. Transcranial Direct Current Stimulation Improves Audioverbal Memory in Stroke Patients.

    Science.gov (United States)

    Kazuta, Toshinari; Takeda, Kotaro; Osu, Rieko; Tanaka, Satoshi; Oishi, Ayako; Kondo, Kunitsugu; Liu, Meigen

    2017-08-01

    The aim of this study was to investigate whether anodal transcranial direct current stimulation over the left temporoparietal area improved audioverbal memory performance in stroke patients. Twelve stroke patients with audioverbal memory impairment participated in a single-masked, crossover, and sham-controlled experiment. The anodal or sham transcranial direct current stimulation was applied during the Rey Auditory Verbal Learning Test, which evaluates the ability to recall a list of 15 heard words over five trials. The number of correctly recalled words was compared between the anodal and sham conditions and the influence of transcranial direct current stimulation on serial position effect of the 15 words was also examined. The increase in the number of correctly recalled words from the first to the fifth trial was significantly greater in the anodal condition than in the sham condition (P transcranial direct current stimulation over the left temporoparietal area improved audioverbal memory performance and induced the primacy effect in stroke patients.

  14. Decentralized H∞ Control of Interconnected Systems with Time-varying Delays

    Directory of Open Access Journals (Sweden)

    Amal Zouhri

    2017-01-01

    Full Text Available This paper focuses on the problem of delay dependent stability/stabilization of interconnected systems with time-varying delays. The approach is based on a new Lyapunov-Krasovskii functional. A decentralized delay-dependent stability analysis is performed to characterize linear matrix inequalities (LMIs based on the conditions under which every local subsystem of the linear interconnected delay system is asymptotically stable. Then we design a decentralized state-feedback stabilization scheme such that the family of closedloop feedback subsystems enjoys the delay-dependent asymptotic stability for each subsystem. The decentralized feedback gains are determined by convex optimization over LMIs. All the developed results are tested on a representative example and compared with some recent previous ones.

  15. Interconnected ponds operation for flood hazard distribution

    Science.gov (United States)

    Putra, S. S.; Ridwan, B. W.

    2016-05-01

    The climatic anomaly, which comes with extreme rainfall, will increase the flood hazard in an area within a short period of time. The river capacity in discharging the flood is not continuous along the river stretch and sensitive to the flood peak. This paper contains the alternatives on how to locate the flood retention pond that are physically feasible to reduce the flood peak. The flood ponds were designed based on flood curve number criteria (TR-55, USDA) with the aim of rapid flood peak capturing and gradual flood retuning back to the river. As a case study, the hydrologic condition of upper Ciliwung river basin with several presumed flood pond locations was conceptually designed. A fundamental tank model that reproducing the operation of interconnected ponds was elaborated to achieve the designed flood discharge that will flows to the downstream area. The flood hazard distribution status, as the model performance criteria, will be computed within Ciliwung river reach in Manggarai Sluice Gate spot. The predicted hazard reduction with the operation of the interconnected retention area result had been bench marked with the normal flow condition.

  16. Fabrication of interconnected microporous biomaterials with high hydroxyapatite nanoparticle loading

    International Nuclear Information System (INIS)

    Zhang Wei; Yao Donggang; Zhang Qingwei; Lelkes, Peter I; Zhou, Jack G

    2010-01-01

    Hydroxyapatite (HA) is known to promote osteogenicity and enhance the mechanical properties of biopolymers. However, incorporating a large amount of HA into a porous biopolymer still remains a challenge. In the present work, a new method was developed to produce interconnected microporous poly(glycolic-co-lactic acid) (PLGA) with high HA nanoparticle loading. First, a ternary blend comprising PLGA/PS (polystyrene)/HA (40/40/20 wt%) was prepared by melt blending under conditions for formation of a co-continuous phase structure. Next, a dynamic annealing stage under small-strain oscillation was applied to the blend to facilitate nanoparticle redistribution. Finally, the PS phase was sacrificially extracted, leaving a porous matrix. The results from different characterizations suggested that the applied small-strain oscillation substantially accelerated the migration of HA nanoparticles during annealing from the PS phase to the PLGA phase; nearly all HA particles were uniformly presented in the PLGA phase after a short period of annealing. After dissolution of the PS phase, a PLGA material with interconnected microporous structure was successfully produced, with a high HA loading above 30 wt%. The mechanisms beneath the experimental observations, particularly on the enhanced particle migration process, were discussed, and strategies for producing highly particle loaded biopolymers with interconnected microporous structures were proposed.

  17. A Distributed Robust Dispatch Approach for Interconnected Systems with a High Proportion of Wind Power Penetration

    Directory of Open Access Journals (Sweden)

    Jianwen Ren

    2018-04-01

    Full Text Available This paper proposes a distributed robust dispatch approach to solve the economic dispatch problem of the interconnected systems with a high proportion of wind power penetration. First of all, the basic principle of synchronous alternating direction method of multipliers (SADMM is introduced to solve the economic dispatch problem of the two interconnected regions. Next, the polyhedron set of the robust optimization method is utilized to describe the wind power output. To adjust the conservativeness of the polyhedron set, an adjustment factor of robust conservativeness is introduced. Subsequently, considering the operation characteristics of the DC tie line between the interconnected regions, an economic dispatch model with a high proportion of wind power penetration is established and parallel iteration based on SADMM is used to solve the model. In each iteration, the optimized power of DC tie lines is exchanged between the regions without requiring the participation of the superior dispatch center. Finally, the validity of the proposed model is verified by the examples of the 2-area 6-node interconnected system and the interconnection of several modified New England 39-node systems. The results show that the proposed model can meet the needs of the independent dispatch of regional power grids, effectively deal with the uncertainty of wind power output, and maximize the wind power consumption under the condition of ensuring the safe operation of the interconnected systems.

  18. Barriers and drivers of new interconnections between EU and non-EU electricity systems. Economic and regulatory aspects

    International Nuclear Information System (INIS)

    Van Werven, M.J.N.; Van Oostvoorn, F.

    2006-05-01

    Interconnection of different electricity systems offers several advantages and benefits. In the first place it provides reliability and increases the robustness of the system. Furthermore, it increases economic efficiency and reduces the possibility to abuse market power. Price differences are the signal that efficiency gains can be obtained. To make a sound decision whether to invest in new interconnection capacity, the causes behind the price differences should be well understood. Price differences must originate from structural, long-term causes. Differences in primary resources, fuel mix and load patterns are such causes. It is important to note that price differences that result from the difference between regulatory structures (lack of level playing field) may not be structural and therefore may not justify investment in interconnection capacity. Next to advantages and benefits, interconnection is faced with costs and barriers. Firstly, there are investment costs, which are high for building new interconnections, and there are energy losses that are caused by transporting electricity. A third possible barrier is congestion within the EU, which impedes the imported electricity to freely flow to demand areas (and hinders the export of electricity to neighbouring regions). Furthermore, interconnection may create loop flows. In addition, interconnection could lead to an increasing import dependency, which may create political resistance. And finally, there may be opposition from residents in the areas where the transmission and interconnection lines have to be built. Concerning regulatory issues, trade between markets is more likely to be impeded or distorted if market designs and rules between countries/regions differ substantially. Regulatory issues that are of relevance comprise rules concerning the timing of gate closure, imbalance arrangements, the firmness of transmission access rights, the type of tariff regulation, unbundling, the ownership of

  19. Unavailability of critical SCADA communication links interconnecting a power grid and a Telco network

    International Nuclear Information System (INIS)

    Bobbio, A.; Bonanni, G.; Ciancamerla, E.; Clemente, R.; Iacomini, A.; Minichino, M.; Scarlatti, A.; Terruggia, R.; Zendri, E.

    2010-01-01

    The availability of power supply to power grid customers depends upon the availability of services of supervision, control and data acquisition (SCADA) system, which constitutes the nervous system of a power grid. In turn, SCADA services depend on the availability of the interconnected networks supporting such services. We propose a service oriented stochastic modelling methodology to investigate the availability of large interconnected networks, based on the hierarchical application of different modelling formalisms to different parts of the networks. Interconnected networks are decomposed according to the specific services delivered until the failure and repair mechanisms of the decomposed elementary blocks can be identified. We represent each network by a convenient stochastic modelling formalism, able to capture the main technological issues and to cope with realistic assumptions about failure and recovery mechanisms. This procedure confines the application of the more intensive computational techniques to those subsystems that actually require it. The paper concentrates on an actual failure scenario, occurred in Rome in January 2004 that involved the outage of critical SCADA communication links, interconnecting a power grid and a Telco network.

  20. Unavailability of critical SCADA communication links interconnecting a power grid and a Telco network

    Energy Technology Data Exchange (ETDEWEB)

    Bobbio, A. [Dipartimento di Informatica, Universita del Piemonte Orientale, Viale Michel 11, 15121 Alessandria (Italy); Bonanni, G.; Ciancamerla, E. [ENEA - CRE Casaccia, Via Anguillarese 301, 00060 Roma (Italy); Clemente, R. [Telecom Italia Mobile, Via Isonzo112, 10141 Torino (Italy); Iacomini, A. [ACEA, Pl. Ostiense 2, 00154 Roma (Italy); Minichino, M., E-mail: minichino@casaccia.enea.i [ENEA - CRE Casaccia, Via Anguillarese 301, 00060 Roma (Italy); Scarlatti, A. [ACEA, Pl. Ostiense 2, 00154 Roma (Italy); Terruggia, R. [Dipartimento di Informatica, Universita del Piemonte Orientale, Viale Michel 11, 15121 Alessandria (Italy); Zendri, E. [ACEA, Pl. Ostiense 2, 00154 Roma (Italy)

    2010-12-15

    The availability of power supply to power grid customers depends upon the availability of services of supervision, control and data acquisition (SCADA) system, which constitutes the nervous system of a power grid. In turn, SCADA services depend on the availability of the interconnected networks supporting such services. We propose a service oriented stochastic modelling methodology to investigate the availability of large interconnected networks, based on the hierarchical application of different modelling formalisms to different parts of the networks. Interconnected networks are decomposed according to the specific services delivered until the failure and repair mechanisms of the decomposed elementary blocks can be identified. We represent each network by a convenient stochastic modelling formalism, able to capture the main technological issues and to cope with realistic assumptions about failure and recovery mechanisms. This procedure confines the application of the more intensive computational techniques to those subsystems that actually require it. The paper concentrates on an actual failure scenario, occurred in Rome in January 2004 that involved the outage of critical SCADA communication links, interconnecting a power grid and a Telco network.

  1. New High Voltage Interconnections with Islands in the Mediterranean Sea: Malta and Sicily. Analysis of the Effects on Renewable Energy Sources Integration and Benefits for the Electricity Market

    Directory of Open Access Journals (Sweden)

    Mariano Giuseppe Ippolito

    2018-04-01

    Full Text Available The present paper shows the benefits coming from the operation of the recent electrical high voltage (HV interconnections between Sicily, Malta and mainland Italy. These new interconnections allow zonal prices of electricity considerably lower than in the past, ensuring greater flexibility to the system and a better integration of Renewable Energy Sources (RES. After briefly illustrating the two high-voltage electrical systems (Sicily and Malta, and having provided a description of the interconnection cable with Malta and its protection devices, the authors hypothesized two modes of operation (Sicily-Malta system islanded or interconnected to the rest of Europe. For the first case (islanded some simulations are performed through the use of an electric network model realized in the Neplan® environment, and for the second case an analysis of one year real data was made. The results of the simulation, thanks to the use of a power flow tracing method, show that this new interconnection between the two islands (Sicily and Malta allows an important improvement in the integration and dispatching of the power generated by RES of the Sicilian territory, better operation of traditional Sicilian generation units, lower electricity zonal prices and a significant reduction in emissions from obsolete fuel oil thermal units located in Malta.

  2. Bacterial-cellulose-derived interconnected meso-microporous carbon nanofiber networks as binder-free electrodes for high-performance supercapacitors

    Science.gov (United States)

    Hao, Xiaodong; Wang, Jie; Ding, Bing; Wang, Ya; Chang, Zhi; Dou, Hui; Zhang, Xiaogang

    2017-06-01

    Bacterial cellulose (BC), a typical biomass prepared from the microbial fermentation process, has been proved that it can be an ideal platform for design of three-dimensional (3D) multifunctional nanomaterials in energy storage and conversion field. Here we developed a simple and general silica-assisted strategy for fabrication of interconnected 3D meso-microporous carbon nanofiber networks by confine nanospace pyrolysis of sustainable BC, which can be used as binder-free electrodes for high-performance supercapacitors. The synthesized carbon nanofibers exhibited the features of interconnected 3D networks architecture, large surface area (624 m2 g-1), mesopores-dominated hierarchical porosity, and high graphitization degree. The as-prepared electrode (CN-BC) displayed a maximum specific capacitance of 302 F g-1 at a current density of 0.5 A g-1, high-rate capability and good cyclicity in 6 M KOH electrolyte. This work, together with cost-effective preparation strategy to make high-value utilization of cheap biomass, should have significant implications in the green and mass-producible energy storage.

  3. In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration

    Energy Technology Data Exchange (ETDEWEB)

    Huang, M.L., E-mail: huang@dlut.edu.cn; Zhang, Z.J.; Zhao, N.; Yang, F.

    2015-01-15

    Highlights: • Abnormal reverse polarity effect in Cu/Sn–9Zn/Ni interconnect during L–S EM was observed. • The reverse polarity effect was resulted from directional diffusion of Zn to cathode. • Positive effective charge number is responsible for directional diffusion of Zn atom. • The effective charge number value of Zn was calculated to be +0.63 based on a model. • This effect is beneficial to EM reliability of micro-bump solder interconnect. - Abstract: Synchrotron radiation real-time imaging technology was used to in situ study the interfacial reactions in Cu/Sn–9Zn/Ni solder interconnects undergoing liquid–solid electromigration (L–S EM). The reverse polarity effect, evidenced by the continuous growth of intermetallic compound (IMC) layer at the cathode and the thinning of the IMC layer at the anode, was resulted from the abnormal directional migration of Zn atoms toward the cathode in electric field. This abnormal migration behavior was induced by the positive effective charge number (Z{sup ∗}) of Zn atoms, which was calculated to be +0.63 based on the Cu fluxes and the consumption kinetics of the anode Cu. Irrespective of the flowing direction of electrons, the consumption of Cu film was obvious while that of Ni film was limited. The dissolution of anode Cu followed a linear relationship with time while that of cathode Cu followed a parabolic relationship with time. It is more damaging with electrons flowing from the Ni to the Cu than that from the Cu to the Ni. The simulated Zn concentration distributions gave an explanation on the relationship between abnormal migration behavior of Zn atoms and the dissolution of Cu film under electron wind force. The abnormal directional migration of Zn atoms toward the cathode prevented the dissolution of cathode substrate, which is beneficial to improve the EM reliability of micro-bump solder interconnects.

  4. 77 FR 9225 - Allegheny Electric Cooperative, Inc., et al. v. PJM Interconnection, L.L.C.; Organization of PJM...

    Science.gov (United States)

    2012-02-16

    ...-58-010] Allegheny Electric Cooperative, Inc., et al. v. PJM Interconnection, L.L.C.; Organization of PJM States, Inc., et al. v. PJM Interconnection, L.L.C.; Notice of Filing Take notice that on February... by section 18.17.4 of the Amended and Restated Operating Agreement of PJM Interconnection, L.L.C. and...

  5. Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell

    Science.gov (United States)

    Kuo, Lewis J. H.; Vora, Shailesh D.

    1995-01-01

    A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La.sub.1-x M.sub.x Cr.sub.1-y N.sub.y O.sub.3, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075-0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO).sub.12. (Al.sub.2 O.sub.3).sub.7 flux particles including Ca and Al dopant, and LaCrO.sub.3 interconnection particles, preferably undoped LaCrO.sub.3, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and, (C) heat treating the interconnection layer at from about 1200.degree. to 1350.degree. C. to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power.

  6. Economic Valuation of Reserves on Cross Border Interconnections; A Danish Case Study

    DEFF Research Database (Denmark)

    Farashbashi-Astaneh, Seyed-Mostafa; Rather, Zakir Hussain; Hu, Weihao

    2014-01-01

    regions that plan for high penetration of intermittent renewables. Extreme intermittency in the nature of wind power imposes elevated risk levels to power system operation. This every day challenge of wind dominant power systems necessitate the crucial role of operating reserves. In this paper, we propose...... benefit of reserve provision provided by cross border interconnections. The focus here will be on reserve services from abundant hydropower resource in Norway, taking advantage of fast VSC-based HVDC interconnection that is expected to be commissioned in immediate coming years....

  7. The economic impacts of a submarine HVDC interconnection between Norway and Great Britain

    International Nuclear Information System (INIS)

    Doorman, Gerard L.; Frøystad, Dag Martin

    2013-01-01

    In the present paper we analyze the profitability of different HVDC interconnection alternatives between Norway and Great Britain for present and future scenarios. The analysis is done from a merchant and a social welfare perspective. The analyses include interconnections between Norway and Scotland and Southern Great Britain, respectively, as well as an alternative link to a future offshore wind farm. From a social welfare perspective the northern interconnection alternative is profitable under all sets of assumptions. The southern alternative is profitable under present conditions, but less than the northern alternative. The alternative link to the offshore wind park is not profitable, but this result is highly dependent on market conditions. From a merchant perspective none of the alternatives is profitable, clearly illustrating that leaving investments to commercial parties does not realize all projects that increase social welfare. - Highlights: • Profitability of interconnection between Norway and GB is analyzed using simulation. • The Northern alternative increases social welfare under all assumptions. • None of the alternatives is profitable from a merchant perspective. • A link to a prospective wind farm 200 km from the GB coast is not profitable. • Social welfare increasing infrastructure may not be built on commercial conditions

  8. 14 CFR 25.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Powerplant Fuel System § 25.957 Flow between interconnected tanks. If fuel can be pumped from one tank to another in flight, the fuel tank vents and the fuel transfer system must be designed so that no structural damage to the tanks can occur because of overfilling. ...

  9. Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

    International Nuclear Information System (INIS)

    Han, Jung Kyu; Choi, Daechul; Fujiyoshi, Masaru; Chiwata, Nobuhiko; Tu, King-Ning

    2012-01-01

    In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation indicate that there is a transition from no current crowding to current crowding, caused by void growth at the cathode. An analysis of the electromigration-induced failure mechanism in solder joints having a very thick Cu layer is presented. It is a unique failure mechanism, different from that in flip chip technology. Moreover, the study of marker displacement shows two different stages of drift velocity, which clearly demonstrates the back-stress effect and the development of compressive stress.

  10. Lyapunov-based Stability of Feedback Interconnections of Negative Imaginary Systems

    KAUST Repository

    Ghallab, Ahmed G.

    2017-10-19

    Feedback control systems using sensors and actuators such as piezoelectric sensors and actuators, micro-electro-mechanical systems (MEMS) sensors and opto-mechanical sensors, are allowing new advances in designing such high precision technologies. The negative imaginary control systems framework allows for robust control design for such high precision systems in the face of uncertainties due to unmodelled dynamics. The stability of the feedback interconnection of negative imaginary systems has been well established in the literature. However, the proofs of stability feedback interconnection which are used in some previous papers have a shortcoming due to a matrix inevitability issue. In this paper, we provide a new and correct Lyapunov-based proof of one such result and show that the result is still true.

  11. Lyapunov-based Stability of Feedback Interconnections of Negative Imaginary Systems

    KAUST Repository

    Ghallab, Ahmed G.; Mabrok, Mohamed; Petersen, Ian R.

    2017-01-01

    Feedback control systems using sensors and actuators such as piezoelectric sensors and actuators, micro-electro-mechanical systems (MEMS) sensors and opto-mechanical sensors, are allowing new advances in designing such high precision technologies. The negative imaginary control systems framework allows for robust control design for such high precision systems in the face of uncertainties due to unmodelled dynamics. The stability of the feedback interconnection of negative imaginary systems has been well established in the literature. However, the proofs of stability feedback interconnection which are used in some previous papers have a shortcoming due to a matrix inevitability issue. In this paper, we provide a new and correct Lyapunov-based proof of one such result and show that the result is still true.

  12. Microtexture of Strain in electroplated copper interconnects

    International Nuclear Information System (INIS)

    Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.; Patel, J.R.

    2001-01-01

    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbeam x-ray diffraction (MBXRD) that have enabled measurement not only of the microstructure of totally encapsulated conductors but also of the local stresses in them on a micron and submicron scale. White x-rays from the Advanced Light Source were focused to a micron spot size by Kirkpatrick-Baez mirrors. The sample was stepped under the micro-beam and Laue images obtained at each sample location using a CCD area detector. Microstructure and local strain were deduced from these images. Cu lines with widths ranging from 0.8 mm to 5 mm and thickness of 1 mm were investigated. Comparisons are made between the capabilities of MBXRD and the well established techniques of broad beam XRD, electron back scatter diffraction (EBSD) and focused ion beam imagining (FIB)

  13. High Speed PAM -8 Optical Interconnects with Digital Equalization based on Neural Network

    DEFF Research Database (Denmark)

    Gaiarin, Simone; Pang, Xiaodan; Ozolins, Oskars

    2016-01-01

    We experimentally evaluate a high-speed optical interconnection link with neural network equalization. Enhanced equalization performances are shown comparing to standard linear FFE for an EML-based 32 GBd PAM-8 signal after 4-km SMF transmission.......We experimentally evaluate a high-speed optical interconnection link with neural network equalization. Enhanced equalization performances are shown comparing to standard linear FFE for an EML-based 32 GBd PAM-8 signal after 4-km SMF transmission....

  14. An Interconnected Network of Core-Forming Melts Produced by Shear Deformation

    Science.gov (United States)

    Bruhn, D.; Groebner, N.; Kohlstedt, D. L.

    2000-01-01

    The formation mechanism of terrestrial planetary is still poorly understood, and has been the subject of numerous experimental studies. Several mechanisms have been proposed by which metal-mainly iron with some nickel-could have been extracted from a silicate mantle to form the core. Most recent models involve gravitational sinking of molten metal or metal sulphide through a partially or fully molten mantle that is often referred to as a'magma ocean. Alternative models invoke percolation of molten metal along an interconnected network (that is, porous flow) through a solid silicate matrix. But experimental studies performed at high pressures have shown that, under hydrostatic conditions, these melts do not form an interconnected network, leading to the widespread assumption that formation of metallic cores requires a magma ocean. In contrast, here we present experiments which demonstrate that shear deformation to large strains can interconnect a significant fraction of initially isolated pockets of metal and metal sulphide melts in a solid matrix of polycrystalline olivine. Therefore, in a dynamic (nonhydrostatic) environment, percolation remains a viable mechanism for the segregation and migration of core-forming melts in a solid silicate mantle.

  15. Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

    Science.gov (United States)

    de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

    2018-05-01

    We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

  16. Exploring the interconnections between gender, health and nature.

    Science.gov (United States)

    MacBride-Stewart, S; Gong, Y; Antell, J

    2016-12-01

    Public health has recognized that nature is good for health but there are calls for a review of its gendered aspects. This review attempts to develop and explore a broad analytical theme - the differing interconnections between gender, health and nature. The paper summarizes the interconnections that have been subject to extensive academic enquiry between gender and health, health and space, and gender and space. A combination of key terms including place; gender; health; outdoor space; green space; natural environment; national parks; femininity; masculinity; recreation; physical activity; sustainability; ecofeminism; feminism; environmental degradation; and environmental justice were used to search the electronic databases Sociological Abstracts, Web of Science and Scopus to identify relevant articles. We took two approaches for this review to provide an overview and analysis of the range of research in the field, and to present a framework of research that is an analysis of the intersection of gender, health and nature. Four dimensions are distinguished: (1) evaluations of health benefits and 'toxicities' of nature; (2) dimensions and qualities of nature/space; (3) environmental justice including accessibility, availability and usability; and (4) identification of boundaries (symbolic/material) that construct differential relationships between nature, gender and health. This paper offers an understanding of how environmental and social conditions may differentially shape the health of women and men. The dimensions direct analytical attention to the diverse linkages that constitute overlapping and inseparable domains of knowledge and practice, to identify complex interconnections between gender, health and nature. This review therefore analyses assumptions about the health benefits of nature, and its risks, for gender from an in-depth, analytical perspective that can be used to inform policy. Copyright © 2016 The Royal Society for Public Health. Published by

  17. Early resistance change and stress/electromigrationmodeling in aluminium interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.; Schoenmaker, W.

    1997-01-01

    A complete description for early resistance change and two dimensional simulation of mechanical stress evolution in confined Al interconnects, related to the electromigration, is given in this paper. The model, combines the stress/ vacancy concentration evolution with the early resistance change of

  18. Incorporation of in-plane interconnects to reflow bonding for electrical functionality

    International Nuclear Information System (INIS)

    Moğulkoç, B; Jansen, H V; Ter Brake, H J M; Elwenspoek, M C

    2011-01-01

    Incorporation of in-plane electrical interconnects to reflow bonding is studied to provide electrical functionality to lab-on-a-chip or microfluidic devices. Reflow bonding is the packaging technology, in which glass tubes are joined to silicon substrates at elevated temperatures. The tubes are used to interface the silicon-based fluidic devices and are directly compatible with standard Swagelok® connectors. After the bonding, the electrically conductive lines will allow probing into the volume confined by the tube, where the fluidic device operates. Therefore methods for fabricating electrical interconnects that survive the bonding procedure at elevated temperature and do not alter the properties of the bond interface are investigated

  19. Decentralized adaptive control of interconnected nonlinear systems with unknown control directions.

    Science.gov (United States)

    Huang, Jiangshuai; Wang, Qing-Guo

    2018-03-01

    In this paper, we propose a decentralized adaptive control scheme for a class of interconnected strict-feedback nonlinear systems without a priori knowledge of subsystems' control directions. To address this problem, a novel Nussbaum-type function is proposed and a key theorem is drawn which involves quantifying the interconnections of multiple Nussbaum-type functions of the subsystems with different control directions in a single inequality. Global stability of the closed-loop system and asymptotic stabilization of subsystems' output are proved and a simulation example is given to illustrate the effectiveness of the proposed control scheme. Copyright © 2018 ISA. Published by Elsevier Ltd. All rights reserved.

  20. Understanding price discovery in interconnected markets: Generalized Langevin process approach and simulation

    Science.gov (United States)

    Schenck, Natalya A.; Horvath, Philip A.; Sinha, Amit K.

    2018-02-01

    While the literature on price discovery process and information flow between dominant and satellite market is exhaustive, most studies have applied an approach that can be traced back to Hasbrouck (1995) or Gonzalo and Granger (1995). In this paper, however, we propose a Generalized Langevin process with asymmetric double-well potential function, with co-integrated time series and interconnected diffusion processes to model the information flow and price discovery process in two, a dominant and a satellite, interconnected markets. A simulated illustration of the model is also provided.

  1. Open system LANs and their global interconnection electronics and communications reference series

    CERN Document Server

    Houldsworth, Jack; Caves, Keith; Mazda, FF

    2014-01-01

    Open System LANs and Their Global Interconnection focuses on the OSI layer 1 to 4 standards (the OSI bearer service) and also introduces TCP/IP and some of the proprietary PC Local Area Network (LAN) standards.The publication first provides an introduction to Local Area Networks (LANs) and Wide Area Networks (WANs), Open Systems Interconnection (OSI), and LAN standards. Discussions focus on MAC bridging, token bus, slotted ring, MAC constraints and design considerations, OSI functional standards, OSI model, value of the transport model, benefits and origins of OSI, and significance of the tran

  2. Development of Readout Interconnections for the Si-W Calorimeter of SiD

    Energy Technology Data Exchange (ETDEWEB)

    Woods, M.; Fields, R.G.; Holbrook, B.; Lander, R.L.; Moskaleva, A.; Neher, C.; Pasner, J.; Tripathi, M.; /UC, Davis; Brau, J.E.; Frey, R.E.; Strom, D.; /Oregon U.; Breidenbach, M.; Freytag, D.; Haller, G.; Herbst, R.; Nelson, T.; /SLAC; Schier, S.; Schumm, B.; /UC, Santa Cruz

    2012-09-14

    The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.

  3. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    DEFF Research Database (Denmark)

    Wang, Feng; Li, Lijuan; Li, Canbing

    2018-01-01

    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distri......The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG....... The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by using the KS test and the maximum likelihood estimation (MLE). The blackouts data in China were used...

  4. Development of a Canadian certification strategy for distributed generation products and interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Toth, J.; Alfano, S. [Canadian Standards Association, Toronto, ON (Canada)

    2005-04-01

    A coordinated Canadian strategy for distributed generation and interconnection certification and testing was presented. An evaluation of the current situation regarding the deregulation of electric utilities in Canada was conducted and a needs analysis was performed in order to identify gaps as perceived by key stakeholders. The intent of the strategy is to ultimately develop a common set of criteria for certification and testing. The report presents the status of current federal programs, provincial programs, electrical inspection programs, and certification and test programs. It presents the methodology for identification of key stakeholders for the study as well as the identification of key issues. These include key issues for electric utilities, regulators, project owners and agents, federal government, provincial government, manufacturers, test laboratories, certifiers, standard development organizations, trade associations, and consultants, insurance and investors. An evaluation of the issues was presented along with a preliminary draft of the coordinated Canadian strategy. This includes the rationale supporting the strategy and feedback from key stakeholders. Last, the report presents recommendations for key stakeholders. 205 refs., 3 tabs., 2 figs., 6 appendices.

  5. Greenhouse gas emission factors of purchased electricity from interconnected grids

    International Nuclear Information System (INIS)

    Ji, Ling; Liang, Sai; Qu, Shen; Zhang, Yanxia; Xu, Ming; Jia, Xiaoping; Jia, Yingtao; Niu, Dongxiao; Yuan, Jiahai; Hou, Yong; Wang, Haikun; Chiu, Anthony S.F.; Hu, Xiaojun

    2016-01-01

    Highlights: • A new accounting framework is proposed for GHG emission factors of power grids. • Three cases are used to demonstrate the proposed framework. • Comparisons with previous system boundaries approve the necessity. - Abstract: Electricity trade among power grids leads to difficulties in measuring greenhouse gas (GHG) emission factors of purchased electricity. Traditional methods assume either electricity purchased from a grid is entirely produced locally (Boundary I) or imported electricity is entirely produced by the exporting grid (Boundary II) (in fact a blend of electricity produced by many grids). Both methods ignore the fact that electricity can be indirectly traded between grids. Failing to capture such indirect electricity trade can underestimate or overestimate GHG emissions of purchased electricity in interconnected grid networks, potentially leading to incorrectly accounting for the effects of emission reduction policies involving purchased electricity. We propose a “Boundary III” framework to account for emissions both directly and indirectly caused by purchased electricity in interconnected gird networks. We use three case studies on a national grid network, an Eurasian Continent grid network, and North Europe grid network to demonstrate the proposed Boundary III emission factors. We found that the difference on GHG emissions of purchased electricity estimated using different emission factors can be considerably large. We suggest to standardize the choice of different emission factors based on how interconnected the local grid is with other grids.

  6. Actual issues concerning nuclear power plants and interconnected grid

    International Nuclear Information System (INIS)

    Medjimorec, D.; Brkic, S.

    2004-01-01

    Nuclear power plants and transmission grid have always been mutually of special relevance. In countries and/or regions where nuclear power plants are located they are almost as a rule counted among strongest nodes of the grid. Hence, they are treated as such from grid point of view in various aspects (operational, planning). In interconnected high-voltage transmission grid of European mainland, usually called UCTE interconnected system, this importance could be shown in a range of issues and several cases, particularly under present situation in which there are numerous demanding and challenging tasks put on transmission system operators, largely due to the opening of electricity markets in the most of European countries. Among these issues definitely worth of mentioning is relevant influence to both commercial paths and physical power flows, and also to exchange programmes between control areas and blocks. In this context there is also relation to cross-border transactions and mechanism applied to them. In respect to security of supply issues and future of nuclear power generation under present regulative framework of most European countries it is needed to comply with connecting conditions (and other stipulations) from national grid codes where different approaches could be observed. Furthermore, nuclear issues significantly influence approach to extension of UCTE system. In certain extent this also applies to pending re-connection of present two synchronous zones of UCTE, particularly to area of broader region directly affected with this complex process. Some of these also reflect to Croatian high-voltage transmission grid as a part of UCTE interconnected system with certain peculiarities.(author)

  7. Load frequency control of three area interconnected hydro-thermal ...

    African Journals Online (AJOL)

    This paper present analysis on dynamic performance of Load Frequency Control (LFC) of three area interconnected hydrothermal reheat power system by the use of Artificial Intelligent and PI Controller. In the proposed scheme, control methodology developed using conventional PI controller, Artificial Neural Network ...

  8. Advanced Modulation Techniques for High-Performance Computing Optical Interconnects

    DEFF Research Database (Denmark)

    Karinou, Fotini; Borkowski, Robert; Zibar, Darko

    2013-01-01

    We experimentally assess the performance of a 64 × 64 optical switch fabric used for ns-speed optical cell switching in supercomputer optical interconnects. More specifically, we study four alternative modulation formats and detection schemes, namely, 10-Gb/s nonreturn-to-zero differential phase-...

  9. The impact of silicon solar cell architecture and cell interconnection on energy yield in hot & sunny climates

    KAUST Repository

    Haschke, Jan

    2017-03-23

    Extensive knowledge of the dependence of solar cell and module performance on temperature and irradiance is essential for their optimal application in the field. Here we study such dependencies in the most common high-efficiency silicon solar cell architectures, including so-called Aluminum back-surface-field (BSF), passivated emitter and rear cell (PERC), passivated emitter rear totally diffused (PERT), and silicon heterojunction (SHJ) solar cells. We compare measured temperature coefficients (TC) of the different electrical parameters with values collected from commercial module data sheets. While similar TC values of the open-circuit voltage and the short circuit current density are obtained for cells and modules of a given technology, we systematically find that the TC under maximum power-point (MPP) conditions is lower in the modules. We attribute this discrepancy to additional series resistance in the modules from solar cell interconnections. This detrimental effect can be reduced by using a cell design that exhibits a high characteristic load resistance (defined by its voltage-over-current ratio at MPP), such as the SHJ architecture. We calculate the energy yield for moderate and hot climate conditions for each cell architecture, taking into account ohmic cell-to-module losses caused by cell interconnections. Our calculations allow us to conclude that maximizing energy production in hot and sunny environments requires not only a high open-circuit voltage, but also a minimal series-to-load-resistance ratio.

  10. Interconnectivity and the Electronic Academic Library

    Directory of Open Access Journals (Sweden)

    Donald E. Riggs

    1988-03-01

    Full Text Available 無Due to the emphasis on the use of computing networks on campuses and to the very nature of more information being accessible to library users only via electronic means, we are witnessing a migration to electronic academic libraries. this new type of library is being required to have interconnections with the campus' other online information/data systems. Arizona State University libraries have been provided the opportunity to develop an electronic library that will be the focal point of a campus-wide information/data network.

  11. Opportunities and Benefits for Increasing Transmission Capacity between the US Eastern and Western Interconnections

    Science.gov (United States)

    Figueroa-Acevedo, Armando L.

    Historically, the primary justification for building wide-area transmission lines in the US and around the world has been based on reliability and economic criteria. Today, the influence of renewable portfolio standards (RPS), Environmental Protection Agency (EPA) regulations, transmission needs, load diversity, and grid flexibility requirements drives interest in high capacity wide-area transmission. By making use of an optimization model to perform long-term (15 years) co-optimized generation and transmission expansion planning, this work explored the benefits of increasing transmission capacity between the US Eastern and Western Interconnections under different policy and futures assumptions. The model assessed tradeoffs between investments in cross-interconnection HVDC transmission, AC transmission needs within each interconnection, generation investment costs, and operational costs, while satisfying different policy compliance constraints. Operational costs were broken down into the following market products: energy, up-/down regulation reserve, and contingency reserve. In addition, the system operating flexibility requirements were modeled as a function of net-load variability so that the flexibility of the non-wind/non-solar resources increases with increased wind and solar investment. In addition, planning reserve constraints are imposed under the condition that they be deliverable to the load. Thus, the model allows existing and candidate generation resources for both operating reserves and deliverable planning reserves to be shared throughout the interconnections, a feature which significantly drives identification of least-cost investments. This model is used with a 169-bus representation of the North American power grid to design four different high-capacity wide-area transmission infrastructures. Results from this analysis suggest that, under policy that imposes a high-renewable future, the benefits of high capacity transmission between the Eastern and

  12. Installation and Quality Assurance of the Interconnections between Cryo-assemblies of the LHC Long Straight Sections

    CERN Document Server

    Garion, C; Tock, J P

    2006-01-01

    The interconnections between the cryomagnets and cryogenic utilities in the LHC long Straight Sections constitute the last machine installation activity. They are ensuring continuity of the beam and insulation vacuum systems, cryogenic fluid and electrical circuits and thermal insulation. The assembly is carried out in a constraining tunnel environment with restricted space. Therefore, the assembly sequence has to be well defined and specific tests have to be performed during the interconnection work to secure the reliability of the system and thus to ensure the global accelerator availability. The LHC has 8 long straight insertion zones composed of special cryomagnets involving specific interconnection procedures and QA plans. The aim of this paper is to present the installation and quality assurance procedures implemented for the LHC LSS interconnections. Technologies such as manual and automatic welding and resistive soldering will be described as well as the different quality controls, such as visual and ...

  13. Improve processes on healthcare: current issues and future trends.

    Science.gov (United States)

    Chen, Jason C H; Dolan, Matt; Lin, Binshan

    2004-01-01

    Information Technology (IT) is a critical resource for improving today's business competitiveness. However, many healthcare providers do not proactively manage or improve the efficiency and effectiveness of their services with IT. Survival in a competitive business environment demands continuous improvements in quality and service, while rigorously maintaining core values. Electronic commerce continues its development, gaining ground as the preferred means of business transactions. Embracing e-healthcare and treating IT as a strategic tool to improve patient safety and the quality of care enables healthcare professionals to benefit from technology formerly used only for management purposes. Numerous improvement initiatives, introduced by both the federal government and the private sector, seek to better the status quo in IT. This paper examines the current IT climate using an enhanced "Built to Last" model, and comments on future IT strategies within the healthcare industry.

  14. Three-dimensional crossbar interconnection using planar-integrated free-space optics and digital mirror-device

    Science.gov (United States)

    Lohmann, U.; Jahns, J.; Limmer, S.; Fey, D.

    2011-01-01

    We consider the implementation of a dynamic crossbar interconnect using planar-integrated free-space optics (PIFSO) and a digital mirror-device™ (DMD). Because of the 3D nature of free-space optics, this approach is able to solve geometrical problems with crossings of the signal paths that occur in waveguide optical and electrical interconnection, especially for large number of connections. The DMD device allows one to route the signals dynamically. Due to the large number of individual mirror elements in the DMD, different optical path configurations are possible, thus offering the chance for optimizing the network configuration. The optimization is achieved by using an evolutionary algorithm for finding best values for a skewless parallel interconnection. Here, we present results and experimental examples for the use of the PIFSO/DMD-setup.

  15. Automatic generation control of an interconnected hydrothermal power system considering superconducting magnetic energy storage

    Energy Technology Data Exchange (ETDEWEB)

    Abraham, Rajesh Joseph; Das, D.; Patra, Amit [Department of Electrical Engineering, Indian Institute of Technology, Kharagpur 721 302 (India)

    2007-10-15

    This paper presents the analysis of automatic generation control (AGC) of an interconnected hydrothermal power system in the presence of generation rate constraints (GRCs). The improvement of AGC with the addition of a small capacity superconducting magnetic energy storage (SMES) unit in either, as well as in both the areas are studied. Time domain simulations are used to study the performance of the power system and control logic. The optimal values of the integral gain settings are obtained using integral squared error (ISE) technique by minimising a quadratic performance index. Suitable method for controlling the SMES unit is described. Analysis reveals that SMES unit fitted in either of the areas is as effective as SMES units fitted in both the areas and improves the dynamic performances to a considerable extent following a load disturbance in either of the areas. (author)

  16. Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

    Science.gov (United States)

    Lee, Tae-Kyu; Chen, Zhiqiang; Guirguis, Cherif; Akinade, Kola

    2017-10-01

    The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases with higher electric power condition, which brings the component into an elevated temperature environment, thus introducing another consideration factor for mechanical stability of interconnection joints. Since most of the shock performance data available were produced at room temperature, the effect of elevated temperature is of interest to ensure the reliability of the device in a mechanical shock environment. To achieve a stable␣interconnect in a dynamic shock environment, the interconnections must tolerate mechanical strain, which is induced by the shock wave input and reaches the particular component interconnect joint. In this study, large body size (52.5 × 52.5 mm2) FCBGA components assembled on 2.4-mm-thick boards were tested with various isothermal pre-conditions and testing conditions. With a heating element embedded in the test board, a test temperature range from room temperature to 100°C was established. The effects of elevated temperature on mechanical shock performance were investigated. Failure and degradation mechanisms are identified and discussed based on the microstructure evolution and grain structure transformations.

  17. Ballistic One-Dimensional InAs Nanowire Cross-Junction Interconnects.

    Science.gov (United States)

    Gooth, Johannes; Borg, Mattias; Schmid, Heinz; Schaller, Vanessa; Wirths, Stephan; Moselund, Kirsten; Luisier, Mathieu; Karg, Siegfried; Riel, Heike

    2017-04-12

    Coherent interconnection of quantum bits remains an ongoing challenge in quantum information technology. Envisioned hardware to achieve this goal is based on semiconductor nanowire (NW) circuits, comprising individual NW devices that are linked through ballistic interconnects. However, maintaining the sensitive ballistic conduction and confinement conditions across NW intersections is a nontrivial problem. Here, we go beyond the characterization of a single NW device and demonstrate ballistic one-dimensional (1D) quantum transport in InAs NW cross-junctions, monolithically integrated on Si. Characteristic 1D conductance plateaus are resolved in field-effect measurements across up to four NW-junctions in series. The 1D ballistic transport and sub-band splitting is preserved for both crossing-directions. We show that the 1D modes of a single injection terminal can be distributed into multiple NW branches. We believe that NW cross-junctions are well-suited as cross-directional communication links for the reliable transfer of quantum information as required for quantum computational systems.

  18. A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects

    Science.gov (United States)

    Zhou, Tianji; Lanzillo, Nicholas A.; Bhosale, Prasad; Gall, Daniel; Quon, Roger

    2018-05-01

    We present an ab initio evaluation of electron scattering mechanisms in Al interconnects from a back-end-of-line (BEOL) perspective. We consider the ballistic conductance as a function of nanowire size, as well as the impact of surface oxidation on electron transport. We also consider several representative twin grain boundaries and calculate the specific resistivity and reflection coefficients for each case. Lastly, we calculate the vertical resistance across the Al/Ta(N)/Al and Cu/Ta(N)/Cu interfaces, which are representative of typical vertical interconnect structures with diffusion barriers. Despite a high ballistic conductance, the calculated specific resistivities at grain boundaries are 70-100% higher in Al than in Cu, and the vertical resistance across Ta(N) diffusion barriers are 60-100% larger for Al than for Cu. These results suggest that in addition to the well-known electromigration limitations in Al interconnects, electron scattering represents a major problem in achieving low interconnect line resistance at fine dimensions.

  19. Hysteresis current control technique of VSI for compensation of grid-connected unbalanced loads

    DEFF Research Database (Denmark)

    Pouresmaeil, Edris; Akorede, Mudathir Funsho; Montesinos-Miracle, Daniel

    2014-01-01

    interconnection issues that usually arise as DG units connect to the electric grid. The proposed strategy, implemented in Matlab/Simulink environment in different operating scenarios, provides compensation for active, reactive, unbalanced, and harmonic current components of grid-connected nonlinear unbalanced...... resources as they connect to the exiting power grid could provoke many power quality problems on the grid side. For this reason, due considerations must be given to power generation and safe running before DG units is actually integrated into the power grid. The main aim of this paper is to address the grid...... loads. The simulation results obtained in this study demonstrate the level of accuracy of the proposed technique, which ensure a balance in the overall grid phase currents, injection of maximum available power from DG resources to the grid, improvement of the utility grid power factor, and a reduction...

  20. Compact Interconnection Networks Based on Quantum Dots

    Science.gov (United States)

    Fijany, Amir; Toomarian, Nikzad; Modarress, Katayoon; Spotnitz, Matthew

    2003-01-01

    Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary

  1. Development of pore interconnectivity/morphology in porous silica films investigated by cyclic voltammetry and slow positron annihilation spectroscopy

    International Nuclear Information System (INIS)

    Tang, Xiuqin; Xiong, Bangyun; Li, Qichao; Mao, Wenfeng; Xiao, Wei; Fang, Pengfei; He, Chunqing

    2015-01-01

    Highlights: •Porous silica films were studied by cyclic voltammetry and positron annihilation. •Highly interconnected pores were formed in the film fabricated with more CTAB. •Aligned nanochannels were observed in the porous flim prepared with 25 wt.% CTAB. •I − and Ps diffusion in the films was governed by pore interconnectivity/morphology. •Cyclic voltammetry is feasible to explore pore interconnectivity/morphology. -- Abstract: Cyclic voltammetry and positronium (Ps) 3γ-annihilation spectroscopy were applied to investigate pore interconnectivity/morphology of porous silica films fabricated with various loading of cetyltrimethyl ammonium bromide (CTAB). With increasing the ratio of CTAB up to 15 wt.%, the total charge Q, resulted from I − diffusion across the silica films, increased remarkably, indicative of formation of highly interconnected pores in the films prepared with more porogen. However, it decreased dramatically with further loading CTAB of 25 wt.%. Interestingly, 3γ-annihilation fraction I 3γ due to a triplet-state Ps (ortho-positronium, o-Ps) emission from the silica films showed a similar behavior as a function of CTAB loading. The abnormal decrement in Q and I 3γ in the film fabricated with 25 wt.% CTAB was well explained by formation of long nanochannels aligning parallel to the film surface. The results indicated that the total charge Q and Ps 3γ-annihilation fraction were closely associated with I − and Ps diffusion governed by the pore interconnectivity/morphology of the silica films, which made cyclic voltammetry possible to be a feasible tool to characterize pore interconnectivity/morphology of porous thin films

  2. Enhanced Device and Circuit-Level Performance Benchmarking of Graphene Nanoribbon Field-Effect Transistor against a Nano-MOSFET with Interconnects

    Directory of Open Access Journals (Sweden)

    Huei Chaeng Chin

    2014-01-01

    Full Text Available Comparative benchmarking of a graphene nanoribbon field-effect transistor (GNRFET and a nanoscale metal-oxide-semiconductor field-effect transistor (nano-MOSFET for applications in ultralarge-scale integration (ULSI is reported. GNRFET is found to be distinctly superior in the circuit-level architecture. The remarkable transport properties of GNR propel it into an alternative technology to circumvent the limitations imposed by the silicon-based electronics. Budding GNRFET, using the circuit-level modeling software SPICE, exhibits enriched performance for digital logic gates in 16 nm process technology. The assessment of these performance metrics includes energy-delay product (EDP and power-delay product (PDP of inverter and NOR and NAND gates, forming the building blocks for ULSI. The evaluation of EDP and PDP is carried out for an interconnect length that ranges up to 100 μm. An analysis, based on the drain and gate current-voltage (Id-Vd and Id-Vg, for subthreshold swing (SS, drain-induced barrier lowering (DIBL, and current on/off ratio for circuit implementation is given. GNRFET can overcome the short-channel effects that are prevalent in sub-100 nm Si MOSFET. GNRFET provides reduced EDP and PDP one order of magnitude that is lower than that of a MOSFET. Even though the GNRFET is energy efficient, the circuit performance of the device is limited by the interconnect capacitances.

  3. Reconfigurable optical interconnection network for multimode optical fiber sensor arrays

    Science.gov (United States)

    Chen, R. T.; Robinson, D.; Lu, H.; Wang, M. R.; Jannson, T.; Baumbick, R.

    1992-01-01

    A single-source, single-detector architecture has been developed to implement a reconfigurable optical interconnection network multimode optical fiber sensor arrays. The network was realized by integrating LiNbO3 electrooptic (EO) gratings working at the Raman Na regime and a massive fan-out waveguide hologram (WH) working at the Bragg regime onto a multimode glass waveguide. The glass waveguide utilized the whole substrate as a guiding medium. A 1-to-59 massive waveguide fan-out was demonstrated using a WH operating at 514 nm. Measured diffraction efficiency of 59 percent was experimentally confirmed. Reconfigurability of the interconnection was carried out by generating an EO grating through an externally applied electric field. Unlike conventional single-mode integrated optical devices, the guided mode demonstrated has an azimuthal symmetry in mode profile which is the same as that of a fiber mode.

  4. Optical Interconnection Via Computer-Generated Holograms

    Science.gov (United States)

    Liu, Hua-Kuang; Zhou, Shaomin

    1995-01-01

    Method of free-space optical interconnection developed for data-processing applications like parallel optical computing, neural-network computing, and switching in optical communication networks. In method, multiple optical connections between multiple sources of light in one array and multiple photodetectors in another array made via computer-generated holograms in electrically addressed spatial light modulators (ESLMs). Offers potential advantages of massive parallelism, high space-bandwidth product, high time-bandwidth product, low power consumption, low cross talk, and low time skew. Also offers advantage of programmability with flexibility of reconfiguration, including variation of strengths of optical connections in real time.

  5. Epidemics on interconnected networks

    Science.gov (United States)

    Dickison, Mark; Havlin, S.; Stanley, H. E.

    2012-06-01

    Populations are seldom completely isolated from their environment. Individuals in a particular geographic or social region may be considered a distinct network due to strong local ties but will also interact with individuals in other networks. We study the susceptible-infected-recovered process on interconnected network systems and find two distinct regimes. In strongly coupled network systems, epidemics occur simultaneously across the entire system at a critical infection strength βc, below which the disease does not spread. In contrast, in weakly coupled network systems, a mixed phase exists below βc of the coupled network system, where an epidemic occurs in one network but does not spread to the coupled network. We derive an expression for the network and disease parameters that allow this mixed phase and verify it numerically. Public health implications of communities comprising these two classes of network systems are also mentioned.

  6. Improved plasma confinement by modulated toroidal current on HT-7 superconducting tokamak

    International Nuclear Information System (INIS)

    Mao Jianshan; Zhao Junyu; Shen Biao; Luo Jiarong

    2004-01-01

    The improved confinement phase was observed during modulating toroidal current on the Hefei superconducting Tokamak-7 (HT-7). This improved plasma confinement phase is characterized by suppressing magnetohydrodynamic (MHD) instabilities effectively, thus increased the central line averaged electron density and the central electron temperature about 33%, out-put steeper density profiles, and reduced hydrogen radiation from the edge as well. The global energy confinement time was increased by 27%-45%; The impurity radiation was reduced by modulation of plasma toroidal current; particle confinement time was increased about two times; a stronger radial negative electric field formed inside the limiter. The radial electric field during modulating current was calculated and disscused. (authors)

  7. Research on frequency control strategy of interconnected region based on fuzzy PID

    Science.gov (United States)

    Zhang, Yan; Li, Chunlan

    2018-05-01

    In order to improve the frequency control performance of the interconnected power grid, overcome the problems of poor robustness and slow adjustment of traditional regulation, the paper puts forward a frequency control method based on fuzzy PID. The method takes the frequency deviation and tie-line deviation of each area as the control objective, takes the regional frequency deviation and its deviation as input, and uses fuzzy mathematics theory, adjusts PID control parameters online. By establishing the regional frequency control model of water-fire complementary power generation in MATLAB, the regional frequency control strategy is given, and three control modes (TBC-FTC, FTC-FTC, FFC-FTC) are simulated and analyzed. The simulation and experimental results show that, this method has better control performance compared with the traditional regional frequency regulation.

  8. A GA-fuzzy automatic generation controller for interconnected power system

    CSIR Research Space (South Africa)

    Boesack, CD

    2011-10-01

    Full Text Available This paper presents a GA-Fuzzy Automatic Generation Controller for large interconnected power systems. The design of Fuzzy Logic Controllers by means of expert knowledge have typically been the traditional design norm, however, this may not yield...

  9. Smart hospitality—Interconnectivity and interoperability towards an ecosystem

    OpenAIRE

    Buhalis, Dimitrios; Leung, Rosanna

    2018-01-01

    The Internet and cloud computing changed the way business operate. Standardised web-based applications simplify data interchange which allow internal applications and business partners systems to become interconnected and interoperable. This study conceptualises the smart and agile hospitality enterprises of the future, and proposes a smart hospitality ecosystem that adds value to all stakeholders. Internal data from applications among all stakeholders, consolidated with external environment ...

  10. The critical thickness of liners of Cu interconnects

    International Nuclear Information System (INIS)

    Jiang, Q; Zhang, S H; Li, J C

    2004-01-01

    A model for the size-dependence of activation energy is developed. With the model and Fick's second law, relationships among the liner thickness, the working life and the working temperature of a TaN liner for Cu interconnects are predicted. The predicted results of the TaN liner are in good agreement with the experimental results. Moreover, the critical thicknesses of liners of some elements are calculated

  11. Synthesis of micro-sized interconnected Si-C composites

    Science.gov (United States)

    Wang, Donghai; Yi, Ran; Dai, Fang

    2016-02-23

    Embodiments provide a method of producing micro-sized Si--C composites or doped Si--C and Si alloy-C with interconnected nanoscle Si and C building blocks through converting commercially available SiO.sub.x (0

  12. Operational parameters of an opto-electronic neural network employing fixed planar holographic interconnects

    Science.gov (United States)

    Keller, P. E.; Gmitro, A. F.

    1993-07-01

    A prototype neutral network system of multifaceted, planar interconnection holograms and opto-electronic neurons is analyzed. This analysis shows that a hologram fabricated with electron-beam lithography has the capacity to connect 6700 neuron outputs to 6700 neuron inputs, and that, the encoded synaptic weights have a precision of approximately 5 bits. Higher interconnection densities can be achieved by accepting a lower synaptic weight accuracy. For systems employing laser diodes at the outputs of the neurons, processing rates in the range of 45 to 720 trillion connections per second can potentially be achieved.

  13. Method of bonding an interconnection layer on an electrode of an electrochemical cell

    Science.gov (United States)

    Pal, Uday B.; Isenberg, Arnold O.; Folser, George R.

    1992-01-01

    An electrochemical cell containing an air electrode (16), contacting electrolyte and electronically conductive interconnection layer (26), and a fuel electrode, has the interconnection layer (26) attached by: (A) applying a thin, closely packed, discrete layer of LaCrO.sub.3 particles (30), doped with an element selected from the group consisting of Ca, Sr, Co, Ba, Mg and their mixtures on a portion of the air electrode, and then (B) electrochemical vapor depositing a dense skeletal structure (32) between and around the doped LaCrO.sub.3 particles (30).

  14. Wind/PV Generation for Frequency Regulation and Oscillation Damping in the Eastern Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [Univ. of Tennessee, Knoxville, TN (United States); Gracia, Jose R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Hadley, Stanton W. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2013-12-01

    This report presents the control of renewable energy sources, including the variable-speed wind generators and solar photovoltaic (PV) generators, for frequency regulation and inter-area oscillation damping in the U.S. Eastern Interconnection (EI). In this report, based on the user-defined wind/PV generator electrical control model and the 16,000-bus Eastern Interconnection dynamic model, the additional controllers for frequency regulation and inter-area oscillation damping are developed and incorporated and the potential contributions of renewable energy sources to the EI system frequency regulation and inter-area oscillation damping are evaluated.

  15. Switching Fabric Based on Multi-Level LVDS Compatible Interconnect, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Switching fabric (SF) is the key component of the next generation of back plane interconnects. Low power, TID and SEU resistant and high bandwidth upgradeable...

  16. 75 FR 71613 - Mandatory Reliability Standards for Interconnection Reliability Operating Limits

    Science.gov (United States)

    2010-11-24

    ... Interconnection to relieve overloads on the facilities modeled in the Interchange Distribution Calculator (IDC... for other SOLs. But the Functional Model assigns a much broader role to the reliability coordinator to...

  17. Seismic qualification of multiple interconnected safety-related cabinets in a high seismic zone

    International Nuclear Information System (INIS)

    Khan, M.R.; Chen, W.H.W.; Wang, T.Y.

    1993-01-01

    Certain safety-related multiple, interconnected electrical cabinets and the devices contained therein are required to perform their intended safety functions during and after a design basis seismic event. In general, seismic testing is performed to ensure the structural integrity of the cabinets and the functionality of their associated devices. Constrained by the shake table capacity, seismic testing is usually performed only for a limited number of interconnected cabinets. Also, original shake table tests performed usually did not provide detailed response information at various locations inside the cabinets. For operational and maintenance purposes, doors and panels of some cabinets may need to be opened while the adjacent cabinets are required to remain functional. In addition, in-cabinet response spectra need to be generated for the seismic qualification of new devices and the replacement parts. Consequently, seismic analysis of safety-related multiple, interconnected cabinets is frequently required for configurations which are different from the original tested conditions. This paper presents results of seismic tests of three interconnected safety-related cabinets and finite element analyses performed to compare the analytical results with those obtained from the cabinet seismic tests. Parametric analyses are performed to determine how many panels and doors can be opened while the adjacent cabinets still remain functional. The study indicates that for cabinets located in a high seismic zone, the critical damping of the cabinet is significantly higher than 5% to 7% typically used in qualifying electrical equipment. For devices mounted on the cabinet doors to performed their intended safety function, it requires stiffening of doors and that these doors be properly bolted to the cabinet frame. It also shows that even though doors and panels bolted to the cabinet frame are the primary seismic resistant element of the cabinet, opening of a limited number of them

  18. Fluctuations of the peak current of tunnel diodes in multi-junction solar cells

    International Nuclear Information System (INIS)

    Jandieri, K; Baranovskii, S D; Stolz, W; Gebhard, F; Guter, W; Hermle, M; Bett, A W

    2009-01-01

    Interband tunnel diodes are widely used to electrically interconnect the individual subcells in multi-junction solar cells. Tunnel diodes have to operate at high current densities and low voltages, especially when used in concentrator solar cells. They represent one of the most critical elements of multi-junction solar cells and the fluctuations of the peak current in the diodes have an essential impact on the performance and reliability of the devices. Recently we have found that GaAs tunnel diodes exhibit extremely high peak currents that can be explained by resonant tunnelling through defects homogeneously distributed in the junction. Experiments evidence rather large fluctuations of the peak current in the diodes fabricated from the same wafer. It is a challenging task to clarify the reason for such large fluctuations in order to improve the performance of the multi-junction solar cells. In this work we show that the large fluctuations of the peak current in tunnel diodes can be caused by relatively small fluctuations of the dopant concentration. We also show that the fluctuations of the peak current become smaller for deeper energy levels of the defects responsible for the resonant tunnelling.

  19. Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%

    Energy Technology Data Exchange (ETDEWEB)

    Arafat, Yeasir; Dutta, Indranath; Panat, Rahul, E-mail: Rahul.panat@wsu.edu [School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99163 (United States)

    2015-08-24

    Metal interconnects in flexible and wearable devices are heterogeneous metal-polymer systems that are expected to sustain large deformation without failure. The principal strategy to make strain tolerant interconnect lines on flexible substrates has comprised of creating serpentine structures of metal films with either in-plane or out-of-plane waves, using porous substrates, or using highly ductile materials such as gold. The wavy and helical serpentine patterns preclude high-density packing of interconnect lines on devices, while ductile materials such as Au are cost prohibitive for real world applications. Ductile copper films can be stretched if bonded to the substrate, but show high level of cracking beyond few tens of % strain. In this paper, we demonstrate a material system consisting of Indium metal film over an elastomer (PDMS) with a discontinuous Cr layer such that the metal interconnect can be stretched to extremely high linear strain (up to 100%) without any visible cracks. Such linear strain in metal interconnects exceeds that reported in literature and is obtained without the use of any geometrical manipulations or porous substrates. Systematic experimentation is carried out to explain the mechanisms that allow the Indium film to sustain the high strain level without failure. The islands forming the discontinuous Cr layer are shown to move apart from each other during stretching without delamination, providing strong adhesion to the Indium film while accommodating the large strain in the system. The Indium film is shown to form surface wrinkles upon release from the large strain, confirming its strong adhesion to PDMS. A model is proposed based upon the observations that can explain the high level of stretch-ability of the Indium metal film over the PDMS substrate.

  20. Distributed Robustness Analysis of Interconnected Uncertain Systems Using Chordal Decomposition

    DEFF Research Database (Denmark)

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard

    2014-01-01

    Large-scale interconnected uncertain systems commonly have large state and uncertainty dimensions. Aside from the heavy computational cost of performing robust stability analysis in a centralized manner, privacy requirements in the network can also introduce further issues. In this paper, we util...

  1. Area analysis of interconnection networks implemented on the honeycomb architecture

    Energy Technology Data Exchange (ETDEWEB)

    Milutinovic, D

    1996-12-31

    The are utilization of interconnection networks for parallel processing on one form of uniform parallel architecture of cellular type is analyzed. Formulae for the number of cells necessity to realize a networks and the efficiency factor of the system are derived. 15 refs.

  2. Report on technological survey in fiscal 1998. Demonstration test for smoothing grid interconnection (Collection of information by surveys in overseas countries); 1998 nendo keito renkei enkatsuka jissho shiken chosa hokokusho. Kaigai chosa ni yoru joho shushu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1999-03-01

    Surveys were performed on the institutional aspects of establishment and operation of grid interconnection guidelines in the countries advanced in introduction of discrete power supply systems, namely, England, Ireland, Italy and the United States, as well as on the simulation technologies to realize them technically. In England, the power transmission systems (controller: NGO) and the power distribution systems (controller: PES) are separated, to which grid interconnection operating regulations are provided respectively. Single operation of generators connected to the power distribution system is not permitted substantially. In Ireland, the power transmission and distribution functions are separated, but are in the transition stage. Interconnection, if requested, cannot be rejected except for a case that the interconnection is impossible. Italy has the condition similar to that in Ireland, where no small generators are not permitted of independent operation. America has not unified the operating regulations for grid interconnection, and has apprehension in the independent operation, but no countermeasures have been given. In the simulation technologies, surveys were made on PSS/E, EUROSTAG, and SICRE. The PSS/E is the standard software in America for the current and stability analysis. (NEDO)

  3. Interconnect patterns for printed organic thermoelectric devices with large fill factors

    Science.gov (United States)

    Gordiz, Kiarash; Menon, Akanksha K.; Yee, Shannon K.

    2017-09-01

    Organic materials can be printed into thermoelectric (TE) devices for low temperature energy harvesting applications. The output voltage of printed devices is often limited by (i) small temperature differences across the active materials attributed to small leg lengths and (ii) the lower Seebeck coefficient of organic materials compared to their inorganic counterparts. To increase the voltage, a large number of p- and n-type leg pairs is required for organic TEs; this, however, results in an increased interconnect resistance, which then limits the device output power. In this work, we discuss practical concepts to address this problem by positioning TE legs in a hexagonal closed-packed layout. This helps achieve higher fill factors (˜91%) than conventional inorganic devices (˜25%), which ultimately results in higher voltages and power densities due to lower interconnect resistances. In addition, wiring the legs following a Hilbert spacing-filling pattern allows for facile load matching to each application. This is made possible by leveraging the fractal nature of the Hilbert interconnect pattern, which results in identical sub-modules. Using the Hilbert design, sub-modules can better accommodate non-uniform temperature distributions because they naturally self-localize. These device design concepts open new avenues for roll-to-roll printing and custom TE module shapes, thereby enabling organic TE modules for self-powered sensors and wearable electronic applications.

  4. Interconnection test framework for the CMS level-1 trigger system

    International Nuclear Information System (INIS)

    Hammer, J.; Magrans de Abril, M.; Wulz, C.E.

    2012-01-01

    The Level-1 Trigger Control and Monitoring System is a software package designed to configure, monitor and test the Level-1 Trigger System of the Compact Muon Solenoid (CMS) experiment at CERN's Large Hadron Collider. It is a large and distributed system that runs over 50 PCs and controls about 200 hardware units. The objective of this paper is to describe and evaluate the architecture of a distributed testing framework - the Interconnection Test Framework (ITF). This generic and highly flexible framework for creating and executing hardware tests within the Level-1 Trigger environment is meant to automate testing of the 13 major subsystems interconnected with more than 1000 links. Features include a web interface to create and execute tests, modeling using finite state machines, dependency management, automatic configuration, and loops. Furthermore, the ITF will replace the existing heterogeneous testing procedures and help reducing both maintenance and complexity of operation tasks. (authors)

  5. Status of the segment interconnect, cable segment ancillary logic, and the cable segment hybrid driver projects

    International Nuclear Information System (INIS)

    Swoboda, C.; Barsotti, E.; Chappa, S.; Downing, R.; Goeransson, G.; Lensy, D.; Moore, G.; Rotolo, C.; Urish, J.

    1985-01-01

    The FASTBUS Segment Interconnect (SI) provides a communication path between two otherwise independent, asynchronous bus segments. In particular, the Segment Interconnect links a backplane crate segment to a cable segment. All standard FASTBUS address and data transactions can be passed through the SI or any number of SIs and segments in a path. Thus systems of arbitrary connection complexity can be formed, allowing simultaneous independent processing, yet still permitting devices associated with one segment to be accessed from others. The model S1 Segment Interconnect and the Cable Segment Ancillary Logic covered in this report comply with all the mandatory features stated in the FASTBUS specification document DOE/ER-0189. A block diagram of the SI is shown

  6. Adaptive critic designs for optimal control of uncertain nonlinear systems with unmatched interconnections.

    Science.gov (United States)

    Yang, Xiong; He, Haibo

    2018-05-26

    In this paper, we develop a novel optimal control strategy for a class of uncertain nonlinear systems with unmatched interconnections. To begin with, we present a stabilizing feedback controller for the interconnected nonlinear systems by modifying an array of optimal control laws of auxiliary subsystems. We also prove that this feedback controller ensures a specified cost function to achieve optimality. Then, under the framework of adaptive critic designs, we use critic networks to solve the Hamilton-Jacobi-Bellman equations associated with auxiliary subsystem optimal control laws. The critic network weights are tuned through the gradient descent method combined with an additional stabilizing term. By using the newly established weight tuning rules, we no longer need the initial admissible control condition. In addition, we demonstrate that all signals in the closed-loop auxiliary subsystems are stable in the sense of uniform ultimate boundedness by using classic Lyapunov techniques. Finally, we provide an interconnected nonlinear plant to validate the present control scheme. Copyright © 2018 Elsevier Ltd. All rights reserved.

  7. 3D-LIN: A Configurable Low-Latency Interconnect for Multi-Core Clusters with 3D Stacked L1 Memory

    OpenAIRE

    Beanato, Giulia; Loi, Igor; De Micheli, Giovanni; Leblebici, Yusuf; Benini, Luca

    2012-01-01

    Shared L1 memories are of interest for tightly- coupled processor clusters in programmable accelerators as they provide a convenient shared memory abstraction while avoiding cache coherence overheads. The performance of a shared-L1 memory critically depends on the architecture of the low-latency interconnect between processors and memory banks, which needs to provide ultra-fast access to the largest possible L1 working set. The advent of 3D technology provides new opportunities to improve the...

  8. Comparative study on stained InGaAs quantum wells for high-speed optical-interconnect VCSELs

    Science.gov (United States)

    Li, Hui; Jia, Xiaowei

    2018-05-01

    The gain-carrier characteristics of InGaAs quantum well for 980 nm high-speed, energy-efficient vertical-cavity surface-emitting lasers are investigated. We specially studied the potentially InGaAs quantum well designs can be used for the active region of energy-efficient, temperature-stable 980-nm VCSEL, which introduced a quantum well gain peak wavelength-to-cavity resonance wavelength offset to improve the dynamic performance at high operation temperature. Several candidate quantum wells are being compared in theory and measurement. We found that ∼5 nm InGaAs QW with ∼6 nm barrier thickness is suitable for the active region of high-speed optical interconnect 980 nm VCSELs, and no significant improvement in the 20% range of In content of InGaAs QWs. The results are useful for next generation green photonic device design.

  9. Advanced methodology for generation expansion planning including interconnected systems

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, M; Yokoyama, R; Yasuda, K [Tokyo Metropolitan Univ. (Japan); Sasaki, H [Hiroshima Univ. (Japan); Ogimoto, K [Electric Power Development Co. Ltd., Tokyo (Japan)

    1994-12-31

    This paper reviews advanced methodology for generation expansion planning including interconnected systems developed in Japan, putting focus on flexibility and efficiency in a practical application. First, criteria for evaluating flexibility of generation planning considering uncertainties are introduced. Secondly, the flexible generation mix problem is formulated as a multi-objective optimization with more than two objective functions. The multi-objective optimization problem is then transformed into a single objective problem by using the weighting method, to obtain the Pareto optimal solution, and solved by a dynamics programming technique. Thirdly, a new approach for electric generation expansion planning of interconnected systems is presented, based on the Benders Decomposition technique. That is, large scale generation problem constituted by the general economic load dispatch problem, and several sub problems which are composed of smaller scale isolated system generation expansion plans. Finally, the generation expansion plan solved by an artificial neural network is presented. In conclusion, the advantages and disadvantages of this method from the viewpoint of flexibility and applicability to practical generation expansion planning are presented. (author) 29 refs., 10 figs., 4 tabs.

  10. Zooplankton structure in two interconnected ponds: similarities and differences

    Directory of Open Access Journals (Sweden)

    Špoljar Maria

    2016-03-01

    Full Text Available The research of zooplankton diversity, abundance and trophic structure was conducted during the summer period in pelagial zone on the longitudinal profile of the Sutla River Backwater. Investigated site consists of two interconnected basins: transparent Upper Basin with submerged macrophytes and turbid Lower Basin without macrophytes in the littoral zone. In the Upper Basin, abundance and diversity of zooplankton in the pelagial was higher in comparison to the Lower Basin, with prevailing species of genus Keratella as microfilter-feeder, and genera of Polyartha and Trihocerca as macrofilter-feeder rotifers. On the contrary, in the Lower Basin, crustaceans dominated in abundance. Microfilter-feeder cladoceran (Bosmina longirostris and larval and adult stages of macrofilter-feeder copepod (Macrocyclops albidus prevailed in the Lower Basin. Fish predation pressure was more pronounced in the pelagial of the Upper Basin, indicated by low cladoceran abundance in the surface layer. Although the studied basins were interconnected, results indicate significant (Mann-Whitney U test, p < 0.05 differences in the zooplankton structure as a potential result of the macrophyte impact on environmental conditions and fish predation pressure.

  11. Optimal robust stabilizer design based on UPFC for interconnected power systems considering time delay

    Directory of Open Access Journals (Sweden)

    Koofigar Hamid Reza

    2017-09-01

    Full Text Available A robust auxiliary wide area damping controller is proposed for a unified power flow controller (UPFC. The mixed H2 / H∞ problem with regional pole placement, resolved by linear matrix inequality (LMI, is applied for controller design. Based on modal analysis, the optimal wide area input signals for the controller are selected. The time delay of input signals, due to electrical distance from the UPFC location is taken into account in the design procedure. The proposed controller is applied to a multi-machine interconnected power system from the IRAN power grid. It is shown that the both transient and dynamic stability are significantly improved despite different disturbances and loading conditions.

  12. An Improved Current-Doubler Rectifier for the Marine Controlled Source Electromagnetic Transmitter

    Directory of Open Access Journals (Sweden)

    Hongxi Song

    2018-01-01

    Full Text Available High power marine controlled source electromagnetic transmitters have gained interest with applications in marine geological survey and mineral resources exploration. The direct current to direct current (DC-DC converter that is typically used in marine transmitters has some issues, as the insulated-gate bipolar transistor (IGBT tube cannot achieve zero-voltage switching (ZVS. In particular, lagging-leg switching cannot easily achieve ZVS. The conversion efficiency of the heat converter requires improvement. This paper proposes an improved current-doubler rectifier for the marine controlled source electromagnetic transmitter (ICDR-MCSET. Resonant inductance is increased and a blocking capacitor is added to the converter (DC-DC circuit, where the converter can achieve ZVS in a wide load range. This results in the effective decrease of the heating temperature and the improvement of transformation efficiency. Saber software simulation and a 20 KW electromagnetic transmitter are used to verify the results, which show that the method is feasible and effective.

  13. 3D Interconnected V6O13 Nanosheets Grown on Carbonized Textile via a Seed-Assisted Hydrothermal Process as High-Performance Flexible Cathodes for Lithium-Ion Batteries

    Science.gov (United States)

    Xu, Shixing; Cen, Dingcheng; Gao, Peibo; Tang, Huang; Bao, Zhihao

    2018-03-01

    Three-dimensional (3D) free-standing nanostructured materials have been proven to be one of the most promising electrodes for energy storage due to their enhanced electrochemical performance. And they are also widely studied for the wearable energy storage systems. In this work, interconnected V6O13 nanosheets were grown on the flexible carbonized textile (c-textile) via a seed-assisted hydrothermal method to form a 3D free-standing electrode for lithium-ion batteries (LIBs). The electrode exhibited a specific capacity of 170 mA h g-1 at a specific current of 300 mA g-1. With carbon nanotube (CNT) coating, its specific capacities further increased 12-40% at the various current rates. It could retain a reversible capacity of 130 mA h g-1, 74% of the initial capacity after 300 cycles at the specific current of 300 mA g-1. It outperformed most of the mixed-valence vanadium oxides. The improved electrochemical performance was ascribed to the synergistic effect of the 3D nanostructure of V6O13 for feasible Li+ diffusion and transport and highly conductive hierarchical conductive network formed by CNT and carbon fiber in c-textile.

  14. Metastatic breast cancer: do current treatments improve quality of life? A prospective study

    Directory of Open Access Journals (Sweden)

    Fernanda Amado

    Full Text Available CONTEXT AND OBJECTIVE: In metastatic breast cancer cases, the currently available therapeutic approaches provide minimal improvement in survival. As such, quality of life (QOL becomes one of the main objectives of treatment. It is not known whether current treatments derived from trials improve QOL. The aim was to evaluate changes in QOL among metastatic breast cancer patients receiving treatment derived from trials. DESIGN AND SETTING: Prospective observational QOL survey in a tertiary cancer center. METHODS: To evaluate the influence of current treatments on patients' QOL, the Medical Outcomes Study Short Form-36 (SF-36 and the Beck Depression Inventory (BDI were applied on three occasions: before starting treatment and at the 6th and 12th weeks, to consecutive metastatic breast cancer patients over a one-year period. RESULTS: We found an improvement in QOL in the sample evaluated (n = 40, expressed by changes in the overall SF-36 score (p = 0.002 and the BDI (p = 0.004. Taken individually, the SF-36 components Pain, Social Functioning and Mental Health also improved significantly. Patients with worse initial performance status and secondary symptoms displayed greater improvement than those with better initial performance status and asymptomatic disease (p < 0.001. Patients who received more than one type of therapy showed larger gains than those given only one type (p = 0.038. CONCLUSIONS: In our environment, current metastatic breast cancer treatments can improve QOL, especially among symptomatic patients and those with low performance status.

  15. Bottom-up approach for carbon nanotube interconnects

    International Nuclear Information System (INIS)

    Li Jun; Ye Qi; Cassell, Alan; Ng, Hou Tee; Stevens, Ramsey; Han Jie; Meyyappan, M.

    2003-01-01

    We report a bottom-up approach to integrate multiwalled carbon nanotubes (MWNTs) into multilevel interconnects in silicon integrated-circuit manufacturing. MWNTs are grown vertically from patterned catalyst spots using plasma-enhanced chemical vapor deposition. We demonstrate the capability to grow aligned structures ranging from a single tube to forest-like arrays at desired locations. SiO 2 is deposited to encapsulate each nanotube and the substrate, followed by a mechanical polishing process for planarization. MWNTs retain their integrity and demonstrate electrical properties consistent with their original structure

  16. X-ray microdiffraction study of Cu interconnects

    International Nuclear Information System (INIS)

    Zhang, X.; Solak, H.; Cerrina, F.; Lai, B.; Cai, Z.; Ilinski, P.; Legnini, D.; Rodrigues, W.

    2000-01-01

    We have used x-ray microdiffraction to study the local structure and strain variation of copper interconnects. Different types of local microstructures have been found in different samples. Our data show that the Ti adhesion layer has a very dramatic effect on Cu microstructure. Strain measurement was conducted before and after electromigration test, Cu fluorescence was used to find the mass variations around voids and hillocks, and x-ray microdiffraction was used to measure the strain change around that interested region. (c) 2000 American Institute of Physics

  17. Environmental benefits of electricity grid interconnections in Northeast Asia

    International Nuclear Information System (INIS)

    Streets, D.G.

    2003-01-01

    From an environmental perspective, electricity grid interconnections in Northeast Asia make sense. Cities in Northeast China, Mongolia, the Democratic People's Republic of Korea (DPRK), and the Republic of Korea (ROK) suffer from poor air quality due to the extensive use of coal-fired power generation. Rural communities suffer from a deficit of electricity, forcing reliance on coal and biofuels for cooking and heating in the home, which causes health-damaging indoor air pollution. Regional air pollution from acid rain and ozone is widespread. In addition, Japan is finding it hard to meet its commitment under the Kyoto Protocol. Yet, just across their borders in far eastern Russia are extensive, clean energy resources: hydroelectricity and natural gas, and (potentially) nuclear power and tidal power. It would be environmentally beneficial to generate electricity cleanly in far eastern Russia and transmit the electricity across the borders into China, Mongolia, the DPRK, the ROK, and Japan, thereby displacing coal-fired electricity generation. We estimate that currently planned projects could alleviate the problems of two to five Chinese cities, with the potential for much larger benefits in the future. (author)

  18. Industrial tooling and methods for the junctions of the superconducting busbars in the interconnections between the LHC cryomagnets

    International Nuclear Information System (INIS)

    Balaguer, J M; Colombet, T; Jacquemod, A; Laurent, F; Nambride, C; Taffard, Y; Tock, J Ph

    2006-01-01

    The Large Hadron Collider (LHC) is the next world-facility for the high energy physics community, presently under installation at CERN, Geneva. The main components of the LHC are the twin-aperture high-field superconducting cryomagnets that are powered in series by superconducting Nb-Ti busbars. Along the machine, about 60 000 splices between the superconducting busbars have to be performed in-situ during the interconnection activities. They are carrying a nominal current varying from 600 A to 13 kA depending upon the magnets, at an operating temperature of 1.9 K. Three specific techniques have been developed and optimised for the splicing of the three main types of cables: inductive and resistive soldering, ultrasonic welding. After a brief presentation of the constraints and requirements applying to these junctions, the tooling is described, highlighting the industrialisation aspects. Before their use to interconnect actual cryomagnets in the LHC tunnel, the equipments and procedures follow rigorous qualification to ensure that all the characteristics of the junctions (electrical, mechanical, reliability, ...) are within the specifications. The assessment of the tooling performance is obtained via sample testing of superconducting busbars. Initial results are presented

  19. Statistical analysis of LHC main interconnection splices room temperature resistance (R-8) results

    CERN Document Server

    Heck, S

    2012-01-01

    During the 2008/2009 shutdown the so-called R-8/R-16 room temperature resistance test has been introduced for the quality control of the LHC main interconnection splices. It has been found that at present two groups of LHC main interconnection splices can be distinguished, so-called “old” splices produced during LHC installation, and so-called “new” splices produced during 2009. 2009 production splices are considered as the state-of-the art, which is reflected by a much smaller R-8 distribution as compared to that of splices produced during first LHC installation.

  20. The impact of increased interconnection on electricity systems with large penetrations of wind generation: A case study of Ireland and Great Britain

    DEFF Research Database (Denmark)

    Denny, E.; Tuohy, A.; Meibom, Peter

    2010-01-01

    interconnection for the island of Ireland with large penetrations of wind generation. The results suggest that increased interconnection should reduce average prices in Ireland, and the variability of those prices. The simulations also suggest that while increased interconnection may reduce carbon dioxide...