WorldWideScience

Sample records for ic chip stress

  1. A contact-lens-shaped IC chip technology

    International Nuclear Information System (INIS)

    Liu, Ching-Yu; Yang, Frank; Teng, Chih-Chiao; Fan, Long-Sheng

    2014-01-01

    We report on novel contact-lens-shaped silicon integrated circuit chip technology for applications such as forming a conforming retinal prosthesis. This is achieved by means of patterning thin films of high residual stress on top of a shaped thin silicon substrate. Several strategies are employed to achieve curvatures of various amounts. Firstly, high residual stress on a thin film makes a thin chip deform into a designed three-dimensional shape. Also, a series of patterned stress films and ‘petal-shaped’ chips were fabricated and analyzed. Large curvatures can also be formed and maintained by the packaging process of bonding the chips to constraining elements such as thin-film polymer ring structures. As a demonstration, a complementary metal oxide semiconductor transistor (CMOS) image-sensing retina chip is made into a contact-lens shape conforming to a human eyeball 12.5 mm in radius. This non-planar and flexible chip technology provides a desirable device surface interface to soft tissues or non-planar bio surfaces and opens up many other possibilities for biomedical applications. (paper)

  2. Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

    DEFF Research Database (Denmark)

    2000-01-01

    towards diaphragm. Surface of the chip (2) has electrical conductors (14) to connect chip with IC chip (3). USE - For use in miniature electroacoustic devices such as hearing aid. ADVANTAGE - Since sound inlet is covered by filter, dust, moisture and other impurities do not obstruct interior and sound...... inlet of microphone. External electrical connection can be made economically reliable and the thermal stress is avoided with the small size solid state silicon based condenser microphone....

  3. Experimental and theoretical analysis of integrated circuit (IC) chips on flexible substrates subjected to bending

    Science.gov (United States)

    Chen, Ying; Yuan, Jianghong; Zhang, Yingchao; Huang, Yonggang; Feng, Xue

    2017-10-01

    The interfacial failure of integrated circuit (IC) chips integrated on flexible substrates under bending deformation has been studied theoretically and experimentally. A compressive buckling test is used to impose the bending deformation onto the interface between the IC chip and the flexible substrate quantitatively, after which the failed interface is investigated using scanning electron microscopy. A theoretical model is established based on the beam theory and a bi-layer interface model, from which an analytical expression of the critical curvature in relation to the interfacial failure is obtained. The relationships between the critical curvature, the material, and the geometric parameters of the device are discussed in detail, providing guidance for future optimization flexible circuits based on IC chips.

  4. OSL signal of IC chips from mobile phones for dose assessment in accidental dosimetry

    International Nuclear Information System (INIS)

    Mrozik, A.; Marczewska, B.; Bilski, P.; Książek, M.

    2017-01-01

    The rapid assessment of the radiation dose is very important for the prediction of biological effects after unintended exposition. The materials for use as dosimeters in accidental dosimetry should be everyday objects which are usually placed near the human body, for example mobile phones. IC (Integrated Circuit) chip is one of several electronic components of mobile phones which give a luminescent signal. The measurements of samples from different mobile phones and smartphones were conducted by optically stimulated luminescence (OSL) and thermoluminescence (TL) methods. The OSL measurement was performed in two ways: with readouts at room temperature and at 100 °C. This work is focused on determination of OSL dose response of IC chips, minimum detectable dose (MDD), OSL signal stability in the time after the exposition, its repeatability and sensitivity to light. Several tests of the assessment of unknown doses were also conducted. The readouts at 100 °C indicate the reducing of the fading of OSL signal in the first hours after irradiation in comparison with room temperature readouts. The obtained results showed relatively good dosimetric properties of IC chips: their high sensitivity to the ionizing radiation, linear dose response up to 10 Gy and a good reproducibility of OSL signal which can allow the dose recovery of doses less than 2 Gy in 14 days after an incident with the accuracy better than 25%. The fading is a drawback of IC chips and the fading factor should be considered when calculating the dose. - Highlights: • IC chips from smartphones demonstrated high potential for accidental dosimetry. • Minimum detectable dose was estimated as a value of 50 mGy. • Samples showed linear dose response for the dose range from 0.05 Gy up to 10 Gy.

  5. A Single-Chip Solar Energy Harvesting IC Using Integrated Photodiodes for Biomedical Implant Applications.

    Science.gov (United States)

    Chen, Zhiyuan; Law, Man-Kay; Mak, Pui-In; Martins, Rui P

    2017-02-01

    In this paper, an ultra-compact single-chip solar energy harvesting IC using on-chip solar cell for biomedical implant applications is presented. By employing an on-chip charge pump with parallel connected photodiodes, a 3.5 × efficiency improvement can be achieved when compared with the conventional stacked photodiode approach to boost the harvested voltage while preserving a single-chip solution. A photodiode-assisted dual startup circuit (PDSC) is also proposed to improve the area efficiency and increase the startup speed by 77%. By employing an auxiliary charge pump (AQP) using zero threshold voltage (ZVT) devices in parallel with the main charge pump, a low startup voltage of 0.25 V is obtained while minimizing the reversion loss. A 4 V in gate drive voltage is utilized to reduce the conduction loss. Systematic charge pump and solar cell area optimization is also introduced to improve the energy harvesting efficiency. The proposed system is implemented in a standard 0.18- [Formula: see text] CMOS technology and occupies an active area of 1.54 [Formula: see text]. Measurement results show that the on-chip charge pump can achieve a maximum efficiency of 67%. With an incident power of 1.22 [Formula: see text] from a halogen light source, the proposed energy harvesting IC can deliver an output power of 1.65 [Formula: see text] at 64% charge pump efficiency. The chip prototype is also verified using in-vitro experiment.

  6. Development of semiconductor ΔE-E detector chip using standard bipolar IC technology

    International Nuclear Information System (INIS)

    Mishra, Vijay; Kataria, S.K.

    2005-01-01

    A proposal has been made for developing silicon based AE-E detector chip which can be used as particle identifiers in nuclear physics experiments and also in several applications in nuclear industry scenario. The proposed development work employs standard bipolar IC fabrication technology of Bharat Electronics Ltd. and the deliverable products that emerge out will be very cost effective. The present paper discusses the concept, feasibility studies and systematic plan for fabrication, characterization and packaging of the proposed detectors. (author)

  7. The influence of the stress state on Ksub(Ic)

    International Nuclear Information System (INIS)

    Aurich, D.; Helms, R.; Schmidt, P.; Veith, H.; Ziebs, J.

    1977-01-01

    To get a first impression of the influence of stress states of higher multi-axiality than plane strain on Ksub(c) a specimen has been created, in which a bi-axial nominal stress state arises by uniaxial tension. This is attained by tension superimposed by transverse bending stress. The stress distribution without crack was analysed by photoelasticity as well as by finite element method. The results were identical. The stress distribution in the fracture (crack) plane was somewhat inhomogeneous, of course. But the ratio of the stress parallel to the tension axis to that perpendicular to it was max. 1:0.3 with a mean value 1:0.15. Specimens of this type were machined from a rolled sheet of the steel 22 NiMoCr 37, with specimen thickness of about 50 mm. For comparison single-edge notched specimens of the same cross section were prepared from the same material. Fatigue cracks were made following ASTM Recommendations. The fracture mechanics tests were carried out at a temperature of -100 0 C. Although valid Ksub(Ic)-values following the rigorous intention of the linear elastic fracture mechanics (ASTM Recommendations) were not obtained, the differences between the results of the two types of specimens and stress states were significant. The Ksub(Q)-values of the bi-axial stressed specimen were about 25% lower than that of the single-edge notched specimen. The deviation of the load-displacement trace from the linear elastic behavior was greater for the single-edge notched specimens than for the bi-axial stressed specimens. The consequences of these results for the assessment of flaws in pressure vessels are evident considering that bi-axial nominal stress states occur in pressure vessels

  8. In-situ volumetric topography of IC chips for defect detection using infrared confocal measurement with active structured light

    International Nuclear Information System (INIS)

    Chen, Liang-Chia; Le, Manh-Trung; Phuc, Dao Cong; Lin, Shyh-Tsong

    2014-01-01

    The article presents the development of in-situ integrated circuit (IC) chip defect detection techniques for automated clipping detection by proposing infrared imaging and full-field volumetric topography. IC chip inspection, especially held during or post IC packaging, has become an extremely critical procedure in IC fabrication to assure manufacturing quality and reduce production costs. To address this, in the article, microscopic infrared imaging using an electromagnetic light spectrum that ranges from 0.9 to 1.7 µm is developed to perform volumetric inspection of IC chips, in order to identify important defects such as silicon clipping, cracking or peeling. The main difficulty of infrared (IR) volumetric imaging lies in its poor image contrast, which makes it incapable of achieving reliable inspection, as infrared imaging is sensitive to temperature difference but insensitive to geometric variance of materials, resulting in difficulty detecting and quantifying defects precisely. To overcome this, 3D volumetric topography based on 3D infrared confocal measurement with active structured light, as well as light refractive matching principles, is developed to detect defects the size, shape and position of defects in ICs. The experimental results show that the algorithm is effective and suitable for in-situ defect detection of IC semiconductor packaging. The quality of defect detection, such as measurement repeatability and accuracy, is addressed. Confirmed by the experimental results, the depth measurement resolution can reach up to 0.3 µm, and the depth measurement uncertainty with one standard deviation was verified to be less than 1.0% of the full-scale depth-measuring range. (paper)

  9. Stress Voiding in IC Interconnects - Rules of Evidence for Failure Analysts

    Energy Technology Data Exchange (ETDEWEB)

    FILTER, WILLIAM F.

    1999-09-17

    Mention the words ''stress voiding'', and everyone from technology engineer to manager to customer is likely to cringe. This IC failure mechanism elicits fear because it is insidious, capricious, and difficult to identify and arrest. There are reasons to believe that a damascene-copper future might be void-free. Nevertheless, engineers who continue to produce ICs with Al-alloy interconnects, or who assess the reliability of legacy ICs with long service life, need up-to-date insights and techniques to deal with stress voiding problems. Stress voiding need not be fearful. Not always predictable, neither is it inevitable. On the contrary, stress voids are caused by specific, avoidable processing errors. Analytical work, though often painful, can identify these errors when stress voiding occurs, and vigilance in monitoring the improved process can keep it from recurring. In this article, they show that a methodical, forensics approach to failure analysis can solve suspected cases of stress voiding. This approach uses new techniques, and patiently applies familiar ones, to develop evidence meeting strict standards of proof.

  10. Applied rolling and sensitivity of Bi(2223)/Ag tapes on Ic degradation by mechanical stress

    International Nuclear Information System (INIS)

    Kovac, P.; Bukva, P.; Husek, I.; Richens, P.E.; Jones, H.

    1999-01-01

    An experimental study of multicore Bi(2223)/Ag tapes, roll-sintered by different methods and subjected to bending and tension stresses has been performed. The tapes, of various technological histories, were bent and tensioned and subsequently the transport current was measured at each stressed state. Comparison of I c degradation curves shows that applied rolling may influence the sensitivity of Bi-2223 filaments against the mechanical stress. The existence of transverse microcracks caused by intermediate rolling leads to a higher sensitivity of the tape to bending. A lowering of critical current degradation was observed for two-axially rolled tapes having a higher filament density and better homogeneity prior to sintering treatment. (author)

  11. Testing of a single-polarity piezoresistive three-dimensional stress-sensing chip

    International Nuclear Information System (INIS)

    Gharib, H H; Moussa, W A

    2013-01-01

    A new piezoresistive stress-sensing rosette is developed to extract the components of the three-dimensional (3D) stress tensor using single-polarity (n-type) piezoresistors. This paper presents the testing of a micro-fabricated sensing chip utilizing the developed single-polarity rosette. The testing is conducted using a four-point bending of a chip-on-beam to induce five controlled stress components, which are analyzed both numerically and experimentally. Numerical analysis using finite element analysis is conducted to study the levels of the induced stress components at three rosette-sites and the levels of the stress field non-uniformities, and to simulate the extracted stress components from the sensing rosette. The experimental analysis applied tensile and compressive loads over three rosette-sites at different load increments. The experimentally extracted stress components show good linearity with the applied load and values close to the numerical model. (paper)

  12. Influence of transverse compressive stress on Ic degradation of Ag alloy sheathed Bi-2223 tapes

    International Nuclear Information System (INIS)

    Oh, S S; Ha, D W; Ha, H S; Park, C; Kwon, Y K; Ryu, K S; Shin, H S

    2004-01-01

    In order to investigate the degradation of critical current (I c ) in the Ag alloy sheathed Bi-2223 tapes due to a transverse compressive stress introduced during manufacturing and operation of the HTS systems, a sample holder consisting of the upper block made of Ti alloy and the lower support plate made of glass fibre reinforced plastic was prepared. A shorter spacing of voltage taps caused large degradation of critical current with respect to compressive stress. It was found that the extent of the I c degradation is proportional to the initial critical current density of the tapes. Through the experiment optimizing the shape of voltage terminals and the pressing load for the continuous contact type 4-probe I c measurement system, it was found that the conical shape tip with large curvature radius was effective in suppressing the I c degradation in Bi-2223 tapes during the I c measurement. A hard alloy sheath of Ag-0.6wt%Mn was found to be quite tolerant to the I c degradation against the pressing load of voltage terminals

  13. An Experimentation Platform for On-Chip Integration of Analog Neural Networks: A Pathway to Trusted and Robust Analog/RF ICs.

    Science.gov (United States)

    Maliuk, Dzmitry; Makris, Yiorgos

    2015-08-01

    We discuss the design of an experimentation platform intended for prototyping low-cost analog neural networks for on-chip integration with analog/RF circuits. The objective of such integration is to support various tasks, such as self-test, self-tuning, and trust/aging monitoring, which require classification of analog measurements obtained from on-chip sensors. Particular emphasis is given to cost-efficient implementation reflected in: 1) low energy and area budgets of circuits dedicated to neural networks; 2) robust learning in presence of analog inaccuracies; and 3) long-term retention of learned functionality. Our chip consists of a reconfigurable array of synapses and neurons operating below threshold and featuring sub-μW power consumption. The synapse circuits employ dual-mode weight storage: 1) a dynamic mode, for fast bidirectional weight updates during training and 2) a nonvolatile mode, for permanent storage of learned functionality. We discuss a robust learning strategy, and we evaluate the system performance on several benchmark problems, such as the XOR2-6 and two-spirals classification tasks.

  14. Influence of passivation process on chip performance

    NARCIS (Netherlands)

    Lu, J.; Kovalgin, Alexeij Y.; Schmitz, Jurriaan

    2009-01-01

    In this work, we have studied the performance of CMOS chips before and after a low temperature post-processing step. In order to prevent damage to the IC chips by the post-processing steps, a first passivation layers is needed on top of the IC chips. Two different passivation layer deposition

  15. Fiscal 2000 regional consortium research and development project - regional new technology creation research and development. Development of system-on-chip mobile IC power source (1st fiscal year); 2000 nendo chiiki consortium kenkyu kaihatsu jigyo - chiiki shingijutsu soshutsu kenkyu kaihatsu seika hokokusho. System on chip mobile IC dengen no kaihatsu (daiichinendo)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-03-01

    Efforts are made to develop a switched capacitor (SC) integration technology based on the technology of switched capacitor power sources capable of efficiently performing voltage conversion without using magnetic parts such as coils. Activities are conducted in the six fields of (1) deciding on a programmable SC circuit, (2) circuit simulation, (3) layout design, (4) marketing and the contents and results of the studies, (5) profitability and the contents and results of the studies, and (6) a patent information survey. In field (1), a series fixed type DC-DC converter and a ring type converter are compared with each other in terms of electrical and theoretical characteristics, the number of devices to constitute the circuit, and ease of control, and the ring type converter is selected to serve as a general purpose SC power source. An efficiency simulation is conducted, as the result of which it is proved that the power source have the features that a practical power source should have. In field (2), for carrying out integration for the selected SC power source, a circuit simulation is conducted for the disclosure of IC power source constituent characteristics and dimensions are determined for the layout. (NEDO)

  16. Men and IC

    Science.gov (United States)

    ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ...

  17. IC Treatment: Surgical Procedures

    Science.gov (United States)

    ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ...

  18. IC: Frequently Asked Questions

    Science.gov (United States)

    ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ...

  19. General IC Symptoms

    Science.gov (United States)

    ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ...

  20. Children and IC

    Science.gov (United States)

    ... Cola, and Orange Crush, for example), Kool-Aid, chocolate, and many fruits, fruit juices and drinks (including ... Guideline IC Treatments IC Diet & Self Management Physical Therapy Antidepressants Antihistamines Pentosan Polysulfate Sodium Bladder Instillations Immunosuppresants ...

  1. Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology

    International Nuclear Information System (INIS)

    Wang, Jiachou; Li, Xinxin

    2013-01-01

    An on-chip integrated packaging-stress-suppressed suspension (PS 3 ) technology for a packaging-stress-free pressure sensor is proposed and developed. With a MIS (microholes interetch and sealing) micromachining process implemented only from the front-side of a single-side polished (1 1 1) silicon wafer, a compact cantilever-shaped PS 3 is on-chip integrated surrounding a piezoresistive pressure-sensing structure to provide a packaging-process/substrate-friendly method for low-cost but high-performance sensor applications. With the MIS process, the chip size of the PS 3 -enclosed pressure sensor is as small as 0.8 mm × 0.8 mm. Compared with a normal pressure sensor without PS 3 (but with an identical pressure-sensing structure), the proposed pressure sensor has the same sensitivity of 0.046 mV kPa −1 (3.3 V) −1 . However, without using the thermal compensation technique, a temperature coefficient of offset of only 0.016% °C −1 FS is noted for the sensor with PS 3 , which is about 15 times better than that for the sensor without PS 3 . Featuring effective isolation and elimination of the influence from packaging stress, the PS 3 technique is promising to be widely used for packaging-friendly mechanical sensors. (paper)

  2. Innovative Teaching of IC Design and Manufacture Using the Superchip Platform

    Science.gov (United States)

    Wilson, P. R.; Wilcock, R.; McNally, I.; Swabey, M.

    2010-01-01

    This paper describes how an intelligent chip architecture has allowed a large cohort of undergraduate (UG) students to be given effective practical insight into integrated circuit (IC) design by designing and manufacturing their own ICs. To achieve this, an efficient chip architecture, the "Superchip," was developed, which allows multiple student…

  3. Pregnancy and IC

    Science.gov (United States)

    ... have not already done so, try to identify foods, beverages, and supplements that are irritating to your bladder ... Other Medicines Over-the-counter Medicines Pain Management Management of IC ... Diet Food Diaries Least and Most Bothersome Foods IC-Friendly ...

  4. IC Associated Conditions

    Science.gov (United States)

    ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Newly Diagnosed Toolkit IC Awareness Toolkit Know ... Bowel Syndrome Lupus Pelvic Floor Dysfunction Pudendal Neuralgia Sjogren’s Syndrome Vulvodynia Click to learn more about these and ...

  5. LD to IC

    CERN Multimedia

    Association du personnel

    2010-01-01

    LC to IC – Publication of posts: Following the publication of new LD to IC posts, we regret that a large number of post descriptions are not available in both CERN official languages, English and French. Consequently, the Staff Association has decided to provide assistance to those who need it with the translation of one or more posts of interest. To do this, please contact the Staff Association secretariat, tel. 72819 or 72761 or 74224.

  6. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  7. The oiling of ICS

    International Nuclear Information System (INIS)

    Hunter, S.

    1993-01-01

    The incident command system (ICS) works for oil spills. It should be the industry standard and some will argue that it already is. But there are a number of temptations to fiddle with it. Fueling these inclinations is the fundamental difference between oil spills and natural disasters: Oil spills make the perpetrator fix the problem - under heavy oversight. Add to this difference the public outcry that attends oil spills and the dual role of government as both helper and prosecutor. From these conditions emerge adaptations of ICS which both weaken and strengthen it. The benefits of ICS are diminished by deputy incident commanders who block unified commanders from access to section chiefs, over-zealous crisis managers who displace command post decisions or its information office, separate press offices with party line slants, government law enforcement activity mixed into spill response, nonstandard operations terminology and structure involving open-quotes containment and clean upclose quotes or open-quotes salvage,close quotes and the commingling of public and private response funds. ICS's application to oil spill response is strengthened by the use of trained unified commanders, deputy incident commanders who operate as staff rather than line, crisis managers who support on-scene objectives, joint information centers, and heavy involvement of skilled, prepared environmental assessment teams in the planning section who generate priorities, strategies, and (operationally coordinated) tactics. Technically, not all these points constitute alterations of ICS, but most do and the others come close. This mixed bag of strengthening and weakening tweaks to oil spill ICS provides an opportunity to take a new look at this faithful friend to the crisis responder

  8. Near-chip compliant layer for reducing perimeter stress during assembly process

    Energy Technology Data Exchange (ETDEWEB)

    Schultz, Mark D.; Takken, Todd E.; Tian, Shurong; Yao, Yuan

    2018-03-20

    A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.

  9. Fluctuating asymmetry and developmental instability in Protoreaster nodosus (Chocolate Chip Sea Star as a biomarker for environmental stress

    Directory of Open Access Journals (Sweden)

    D. J. V. Trono

    2015-06-01

    Full Text Available Fluctuating asymmetry (FA, pertains to small and random departures from perfect symmetry of an organism's bilateral traits and has been used as a measurement of developmental instability and as a potential indicator of stress in populations. It measures the variations from symmetry of a symmetrical structure whose sides are said to be genetically identical, with similar history of gene activity and experiencing the same environment. Symmetries are potentially the basis for studies on FA. Hence, this study assessed the potential of FA as a reliable developmental instability and environmental stress indicator in five-fold dihedral symmetrical Protoreaster nodosus (Chocolate chip sea fish from three (3 different sites (Linamon, Lanao del Norte; Initao, Misamis Oriental and Jasaan, Misamis Oriental. FA for each population from every site was measured for comparison. In this study, anatomical landmarks were subjected to Procrustes superimposition and Principal Component Analysis (PCA using "Symmetry and Asymmetry in Geometric Data" (SAGE program. Results showed highly significant FA and significant DA for population from Jasaan and Linamon where habitat disturbance due to anthropogenic activities were prevalent. Thus, experienced more stress compared to the other populations, suggesting that significant variation in size or left-right side of each individual could be a product of genotype-environment interaction. Moreover, insignificant FA and high DA was obtained from Initao (protected seascape area which indicated that variation among individual genotypes and asymmetry in phenotypes is mostly induced by genetics under less stressful environment. Significant FA and increase FA present inability of species to buffer stress in its developmental pathways and have implications on species fitness. Hypothesis assumes that fluctuating asymmetry has costs, reflects the quality of individuals and the level of genetic and environmental stress experienced by

  10. STRESS ANALYSIS IN CUTTING TOOLS COATED TiN AND EFFECT OF THE FRICTION COEFFICIENT IN TOOL-CHIP INTERFACE

    Directory of Open Access Journals (Sweden)

    Kubilay ASLANTAŞ

    2003-02-01

    Full Text Available The coated tools are regularly used in today's metal cutting industry. Because, it is well known that thin and hard coatings can reduce tool wear, improve tool life and productivity. Such coatings have significantly contributed to the improvements cutting economies and cutting tool performance through lower tool wear and reduced cutting forces. TiN coatings have especially high strength and low friction coefficients. During the cutting process, low friction coefficient reduce damage in cutting tool. In addition, maximum stress values between coating and substrate also decrease as the friction coefficient decreases. In the present study, stress analysis is carried out for HSS (High Speed Steel cutting tool coated with TiN. The effect of the friction coefficient between tool and chip on the stresses developed at the cutting tool surface and interface of coating and HSS is investigated. Damage zones during cutting process was also attempted to determine. Finite elements method is used for the solution of the problem and FRANC2D finite element program is selected for numerical solutions.

  11. Serial cerebral hemodynamic change after extracranial-intracranial (EC-IC) bypass surgery: evaluated by acetazolamide stress brain perfusion SPECT(acz-SPECT)

    Energy Technology Data Exchange (ETDEWEB)

    Hong, Il Ki; Kim, Jae Seung; Ahn, Jae Sung; Im, Ki Chun; Kim, Euy Nyong; Mun, Dae Hyeog [Asan Medical Center, Seoul (Korea, Republic of)

    2005-07-01

    We evaluated serial cerebral hemodynamic changes after EC-IC bypass surgery in symptomatic pts with atherosclerotic occlusion of internal carotid (lCA) or mid-cerebral artery (MCA) using Acz-SPECT. 25 symptomatic pts (M/F 19/6, 53{+-}10 y) with ICA and MCA occlusion (16 uni - and 9 bilateral) prospectively underwent Acz-SPECT using Tc-99m ECD before and 1 week after EC-IC bypass surgery. Of these, 16 underwent additional f/u Acz-SPECT 5 mo later. Cerebral perfusion and perfusion reserve of MCA territory were evaluated visually and SPECT findings were classified into 4 groups: N/N; R/N; N/R; and R/R (perfusion/perfusion reserve: N = normal, R = reduced). For semiquantitative analysis, all SPECT images were normalized to MNI template and mean counts of MCA territory and cerebellum were obtained by AAL. Cerebral perfusion index (PI =C{sub region}/C{sub cere}) and perfusion reserve index (RI = (PI{sub Acz} - PI{sub basal}) /Pl{sub basal}) were calculated. Preop SPECT findings of ipsilateral MCA in 25 pts were R/N (4%), N/R (12%), and R/R (84% ). Early postop SPECT showed improvement of perfusion (26%) and/or reserve (68%) in ipsilateral MCA. Of 16 pts with 5mo f/u SPECT, 6 (38%) showed further improvement of perfusion or reserve. However, 4 (25%) showed aggravation of perfusion and one of these underwent revision surgery. Preop PI (1.1{+-}0.1) and RI (0.11{+-}0.07) of ipsilateral MCA were significantly lower than those of contralateral hemispheres (p<0.05). After surgery, PIs of bilateral MCA did not change at early postop period but improved in ipsilateral MCA at 5mo. Rls of ipsilateral MCA increased significantly (68%) at early postop period (P<0.001) and then did not changed. Cerebral perfusion and perfusion reserve changed with different manner during 5 mo after bypass surgery and perfusion reserve changed more dramatically than perfusion. Acz-SPECT is a feasible method for evaluating cerebral hemodynamic change after EC-IC bypass surgery.

  12. Irregular Dwarf Galaxy IC 1613

    Science.gov (United States)

    2005-01-01

    Ultraviolet image (left) and visual image (right) of the irregular dwarf galaxy IC 1613. Low surface brightness galaxies, such as IC 1613, are more easily detected in the ultraviolet because of the low background levels compared to visual wavelengths.

  13. 'When the chips are down': The relation between stress, social support, and food product attitudes

    NARCIS (Netherlands)

    ter Hoeven, C.L.; Fransen, M.L.

    2008-01-01

    Previous research has shown that decision-making strategies and attitudes are often influenced by affective states (e.g., Clore et al. 2005; Isen 2001). In the present studies, we propose that stress can be such an affective state that influences (product) evaluations. Based on the self-regulation

  14. The optical design of 3D ICs for smartphone and optro-electronics sensing module

    Science.gov (United States)

    Huang, Jiun-Woei

    2018-03-01

    Smartphone require limit space for image system, current lens, used in smartphones are refractive type, the effective focal length is limited the thickness of phone physical size. Other, such as optro-electronics sensing chips, proximity optical sensors, and UV indexer chips are integrated into smart phone with limit space. Due to the requirement of multiple lens in smartphone, proximity optical sensors, UV indexer and other optro-electronics sensing chips in a limited space of CPU board in future smart phone, optro-electronics 3D IC's integrated with optical lens or components may be a key technology for 3 C products. A design for reflective lens is fitted to CMOS, proximity optical sensors, UV indexer and other optro-electronics sensing chips based on 3-D IC. The reflective lens can be threes times of effective focal lens, and be able to resolve small object. The system will be assembled and integrated in one 3-D IC more easily.

  15. Simplified design of IC amplifiers

    CERN Document Server

    Lenk, John

    1996-01-01

    Simplified Design of IC Amplifiers has something for everyone involved in electronics. No matter what skill level, this book shows how to design and experiment with IC amplifiers. For experimenters, students, and serious hobbyists, this book provides sufficient information to design and build IC amplifier circuits from 'scratch'. For working engineers who design amplifier circuits or select IC amplifiers, the book provides a variety of circuit configurations to make designing easier.Provides basics for all phases of practical design.Covers the most popular forms for amplif

  16. Physical IC debug ─ backside approach and nanoscale challenge

    Directory of Open Access Journals (Sweden)

    U. Kerst

    2008-05-01

    Full Text Available Physical analysis for IC functionality in submicron technologies requires access through chip backside. Based upon typical global backside preparation with 50–100 µm moderate silicon thickness remaining, a state of the art of the analysis techniques available for this purpose is presented and evaluated for functional analysis and layout pattern resolution potential. A circuit edit technique valid for nano technology ICs, is also presented that is based upon the formation of local trenches using the bottom of Shallow Trench Isolation (STI as endpoint for Focused Ion Beam (FIB milling. As a derivative from this process, a locally ultra thin silicon device can be processed, creating a back surface as work bench for breakthrough applications of nanoscale analysis techniques to a fully functional circuit through chip backside. Several applications demonstrate the power and potential of this new approach.

  17. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method.

    Science.gov (United States)

    Qian, Cheng; Fan, Jiajie; Fang, Jiayi; Yu, Chaohua; Ren, Yi; Fan, Xuejun; Zhang, Guoqi

    2017-10-16

    By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample's rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs.

  18. Bio-medical CMOS ICs

    CERN Document Server

    Yoo, Hoi-Jun

    2011-01-01

    This book is based on a graduate course entitled, Ubiquitous Healthcare Circuits and Systems, that was given by one of the editors. It includes an introduction and overview to biomedical ICs and provides information on the current trends in research.

  19. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method

    Science.gov (United States)

    Yu, Chaohua; Fan, Xuejun; Zhang, Guoqi

    2017-01-01

    By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample’s rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs. PMID:29035300

  20. PELE-IC test problems

    International Nuclear Information System (INIS)

    Gong, E.Y.; Alexander, E.E.; McMaster, W.H.; Quinones, D.F.

    1979-01-01

    This report provides prospective users of the Lawrence Livermore Laboratory (LLL) fluid-structure interaction computer code, PELE-IC, a variety of test problems for verifying the code on CDC 7600 computer systems at facilities external to the LLL environment. The test problems have been successfully run on CDC 7600 computers at the LLL and Lawrence Berkeley Laboratory (LBL) computer centers

  1. Experiment list: SRX119684 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 2,13603 GSM874990: ES.H3K79me2; Homo sapiens; ChIP-Seq source_name=H1 human Embryonic stem cell || cell line=H1 || treatment=diagnost...ic sample (pre-treatment) || chip antibody=H3K79me2 || chip antibody manufacturer=A

  2. A novel prototyping method for die-level monolithic integration of MEMS above-IC

    International Nuclear Information System (INIS)

    Cicek, Paul-Vahe; Zhang, Qing; Saha, Tanmoy; Mahdavi, Sareh; Allidina, Karim; Gamal, Mourad El; Nabki, Frederic

    2013-01-01

    This work presents a convenient and versatile prototyping method for integrating surface-micromachined microelectromechanical systems (MEMS) directly above IC electronics, at the die level. Such localized implementation helps reduce development costs associated with the acquisition of full-sized semiconductor wafers. To demonstrate the validity of this method, variants of an IC-compatible surface-micromachining MEMS process are used to build different MEMS devices above a commercial transimpedance amplifier chip. Subsequent functional assessments for both the electronics and the MEMS indicate that the integration is successful, validating the prototyping methodology presented in this work, as well as the suitability of the selected MEMS technology for above-IC integration. (paper)

  3. A proposed holistic approach to on-chip, off-chip, test, and package interconnections

    Science.gov (United States)

    Bartelink, Dirk J.

    1998-11-01

    The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

  4. Development of an ASD IC for the Micro Pixel Chamber

    CERN Document Server

    Orito, R; Kubo, H; Miuchi, K; Nagayoshi, T; Okada, Y; Takada, A; Takeda, A; Tanimori, T; Ueno, M

    2004-01-01

    A new amplifier-shaper-discriminator (ASD) chip was designed and manufactured for the Micro Pixel Chamber ($\\mu$-PIC). The design of this ASD IC is based on the ASD IC (TGC-ASD) for the Thin Gap Chamber in the LHC Atlas Experiment. The decay time constant of the preamplifier is 5-times longer than that of the TGC-ASD, and some other modifications have been made in order to improve the signal-to-noise ratio of the $\\mu$-PIC. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 channels in a QFP48 package. The decay time constant of the preamplifier is 80 ns and its gain is approximately 0.8 V/pC. The output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. A baseline restoration circuit is incorporated in the main-amplifier, and the current used for the baseline restoration is 5-times smaller than that of the TGC-ASD. The threshold voltage for the discriminator section is common to the 4 channels and their digital output level is LVDS-compatible. The ASD...

  5. CMOS Analog IC Design: Fundamentals

    OpenAIRE

    Bruun, Erik

    2018-01-01

    This book is intended for use as the main textbook for an introductory course in CMOS analog integrated circuit design. It is aimed at electronics engineering students who have followed basic courses in mathematics, physics, circuit theory, electronics and signal processing. It takes the students directly from a basic level to a level where they can start working on simple analog IC design projects or continue their studies using more advanced textbooks in the field. A distinct feature of thi...

  6. Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

    Directory of Open Access Journals (Sweden)

    Chang-Chun Lee

    2015-08-01

    Full Text Available three-dimensional integrated circuit (3D-IC structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their surrounding wafer level underfill (WLUF. The mechanical properties of this equivalent material, including Young’s modulus (E, Poisson’s ratio, shear modulus, and coefficient of thermal expansion (CTE, are directly obtained by applying either a tensile load or a constant displacement, and by increasing the temperature during simulations, respectively. Analytic results indicate that at least eight microbumps at the outermost region of the chip stacking structure need to be considered as an accurate stress/strain contour in the concerned region. In addition, a factorial experimental design with analysis of variance is proposed to optimize chip stacking structure reliability with four factors: chip thickness, substrate thickness, CTE, and E-value. Analytic results show that the most significant factor is CTE of WLUF. This factor affects microbump reliability and structural warpage under a temperature cycling load and high-temperature bonding process. WLUF with low CTE and high E-value are recommended to enhance the assembly reliability of the 3D-IC architecture.

  7. A remotely-controlled locomotive IC driven by electrolytic bubbles and wireless powering.

    Science.gov (United States)

    Hsieh, Jian-Yu; Kuo, Po-Hung; Huang, Yi-Chun; Huang, Yu-Jie; Tsai, Rong-Da; Wang, Tao; Chiu, Hung-Wei; Wang, Yao-Hung; Lu, Shey-Shi

    2014-12-01

    A batteryless remotely-controlled locomotive IC utilizing electrolytic bubbles as propelling force is realized in 0.35 μm CMOS technology. Without any external components, such as magnets and on-board coils, the bare IC is wirelessly powered and controlled by a 10 MHz ASK modulated signal with RS232 control commands to execute movement in four moving directions and with two speeds. The receiving coil and electrolysis electrodes are all integrated on the locomotive chip. The experiment successfully demonstrated that the bare IC moved on the surface of an electrolyte with a speed up to 0.3 mm/s and change moving directions according to the commands. The total power consumptions of the chip are 207.4 μW and 180 μ W while the output electrolysis voltages are 2 V and 1.3 V, respectively.

  8. Computing fundamentals IC3 edition

    CERN Document Server

    Wempen, Faithe

    2014-01-01

    Kick start your journey into computing and prepare for your IC3 certification With this essential course book you'll be sending e-mails, surfing the web and understanding the basics of computing in no time. Written by Faithe Wempen, a Microsoft Office Master Instructor and author of more than 120 books, this complete guide to the basics has been tailored to provide comprehensive instruction on the full range of entry-level computing skills. It is a must for students looking to move into almost any profession, as entry-level computing courses have become a compulsory requirement in the modern w

  9. SEM probe of IC radiation sensitivity

    Science.gov (United States)

    Gauthier, M. K.; Stanley, A. G.

    1979-01-01

    Scanning Electron Microscope (SEM) used to irradiate single integrated circuit (IC) subcomponent to test for radiation sensitivity can localize area of IC less than .03 by .03 mm for determination of exact location of radiation sensitive section.

  10. Chips 2020

    CERN Document Server

    2016-01-01

    The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising  Moore-like exponential g...

  11. Spitzer Observations Of IC 2118

    Science.gov (United States)

    2010-09-01

    Micron All-Sky Survey ( 2MASS ; Skrutskie et al. 2006) photometric data in an effort to segregate YSOs from background galaxies. While one previously known T...Spectral Typea Other names IRAS 04591−0856 05 01 30.2 −08 52 14 . . . HHL 17, G13 2MASS 05020630−0850467 05 02 06.3 −08 50 47 M2 IV . . . RXJ 0502.4−0744b...05 02 20.8 −07 44 10 . . . 2MASS 05022084−0744099 2MASS 05060574−0646151c 05 06 05.7 −06 46 15 G8: (May not be a member of IC 2118; see Kun et al

  12. Mod 1 ICS TI Report: ICS Conversion of a 140% HPGe Detector

    Energy Technology Data Exchange (ETDEWEB)

    Bounds, John Alan [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-07-05

    This report evaluates the Mod 1 ICS, an electrically cooled 140% HPGe detector. It is a custom version of the ORTEC Integrated Cooling System (ICS) modified to make it more practical for us to use in the field. Performance and operating characteristics of the Mod 1 ICS are documented, noting both pros and cons. The Mod 1 ICS is deemed a success. Recommendations for a Mod 2 ICS, a true field prototype, are provided.

  13. Practical silicon Light emitting devices fabricated by standard IC technology

    International Nuclear Information System (INIS)

    Aharoni, H.; Monuko du Plessis; Snyman, L.W.

    2004-01-01

    Full Text:Research activities are described with regard to the development of a comprehensive approach for the practical realization of single crystal Silicon Light Emitting Devices (Si-LEDs). Several interesting suggestions for the fabrication of such devices were made in the literature but they were not adopted by the semiconductor industry because they involve non-standard fabrication schemes, requiring special production lines. Our work presents an alternative approach, proposed and realized in practice by us, permitting the fabrication of Si-LEDs using the standard conventional fully industrialized IC technology ''as is'' without any adaptation. It enables their fabrication in the same production lines of the presently existing IC industry. This means that Si-LEDs can now be fabricated simultaneously with other components, such as transistors, on the same silicon chip, using the same masks and processing procedures. The result is that the yield, reliability, and price of the above Si-LEDs are the same as the other Si devices integrated on the same chip. In this work some structural details of several practical Si-LED's designed by us, as well as experimental results describing their performance are presented. These Si-LED's were fabricated to our specifications utilizing standard CMOS/BiCMOS technology, a fact which comprises an achievement by itself. The structure of the Si-LED's, is designed according to specifications such as the required operating voltage, overall light output intensity, its dependence(linear, or non-linear) on the input signal (voltage or current), light generations location (bulk, or near-surface), the emission pattern and uniformity. Such structural design present a problem since the designer can not use any structural parameters (such as doping levels and junction depths for example) but only those which already exist in the production lines. Since the fabrication procedures in these lines are originally designed for processing of

  14. Development of an FPGA-Based Motion Control IC for Caving Machine

    Directory of Open Access Journals (Sweden)

    Chiu-Keng Lai

    2014-03-01

    Full Text Available Since the Field Programmable Gate Arrays (FPGAs with high density are available nowadays, systems with complex functions can thus be realized by FPGA in a single chip while they are traditionally implemented by several individual chips. In this research, the control of stepping motor drives as well as motion controller is integrated and implemented on Altera Cyclone III FPGA; the resulting system is evaluated by applying it to a 3-axis caving machine which is driven by stepping motors. Finally, the experimental results of current regulation and motion control integrated in FPGA IC are shown to prove the validness.

  15. Wafer level 3-D ICs process technology

    CERN Document Server

    Tan, Chuan Seng; Reif, L Rafael

    2009-01-01

    This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

  16. Method and apparatus to debug an integrated circuit chip via synchronous clock stop and scan

    Science.gov (United States)

    Bellofatto, Ralph E [Ridgefield, CT; Ellavsky, Matthew R [Rochester, MN; Gara, Alan G [Mount Kisco, NY; Giampapa, Mark E [Irvington, NY; Gooding, Thomas M [Rochester, MN; Haring, Rudolf A [Cortlandt Manor, NY; Hehenberger, Lance G [Leander, TX; Ohmacht, Martin [Yorktown Heights, NY

    2012-03-20

    An apparatus and method for evaluating a state of an electronic or integrated circuit (IC), each IC including one or more processor elements for controlling operations of IC sub-units, and each the IC supporting multiple frequency clock domains. The method comprises: generating a synchronized set of enable signals in correspondence with one or more IC sub-units for starting operation of one or more IC sub-units according to a determined timing configuration; counting, in response to one signal of the synchronized set of enable signals, a number of main processor IC clock cycles; and, upon attaining a desired clock cycle number, generating a stop signal for each unique frequency clock domain to synchronously stop a functional clock for each respective frequency clock domain; and, upon synchronously stopping all on-chip functional clocks on all frequency clock domains in a deterministic fashion, scanning out data values at a desired IC chip state. The apparatus and methodology enables construction of a cycle-by-cycle view of any part of the state of a running IC chip, using a combination of on-chip circuitry and software.

  17. Charge-sensitive preamplifier IC for silicon calorimetry at colliders

    International Nuclear Information System (INIS)

    Baturitsky, M.A.; Chekhovsky, V.A.; Emel'yanchik, I.F.; Shumeiko, N.M.; Golutvin, I.A.; Zamyatin, N.I.; Dvornikov, O.V.

    1995-01-01

    Four versions of a fast monolithic charge-sensitive preamplifier (CSP) were designed using microwave BJT-JFET technology. The best one has a 3.5 ns rise time for input detector capacitance C d =100 pF and approximately 8 mW power dissipation for 5 V supply voltage. The ENC performance at shaping time 30 ns is 1350 e+17 e/pF for C d up to 600 pF. Crosstalk in a four-channel amplifier made in the same chip was measured to be about -46 dB for C d =100 pF. The linear output voltage swing is 0.8 V for voltage supply 5 V. The IC has revealed good radiation hardness to neutron irradiation. ((orig.))

  18. Ion Chromatography-on-a-chip for Water Quality Analysis

    Science.gov (United States)

    Kidd, R. D.; Noell, A.; Kazarians, G.; Aubrey, A. D.; Scianmarello, N.; Tai, Y.-C.

    2015-01-01

    We report progress towards developing a Micro-Electro-Mechanical Systems (MEMS)- based ion chromatograph (IC) for crewed spacecraft water analysis. This IC-chip is an offshoot of a NASA-funded effort to produce a high performance liquid chromatograph (HPLC)-chip. This HPLC-chip system would require a desalting (i.e. ion chromatography) step. The complete HPLC instrument consists of the Jet Propulsion Labortory's (JPL's) quadrupole ion trap mass spectrometer integrated with a state-of-the-art MEMS liquid chromatograph (LC) system developed by the California Institute of Technology's (Caltech's) Micromachining Laboratory. The IC version of the chip consist of an electrolysis-based injector, a separation column, two electrolysis pumps for gradient generation, mixer, and a built-in conductivity detector. The HPLC version of the chip also includes a nanospray tip. The low instrument mass, coupled with its high analytical capabilities, makes the LC chip ideally suitable for wide range of applications such as trace contaminant, inorganic analytical science and, when coupled to a mass spectrometer, a macromolecular detection system for either crewed space exploration vehicles or robotic planetary missions.

  19. ASD IC for the thin gap chambers in the LHC Atlas experiment

    International Nuclear Information System (INIS)

    Sasaki, Osamu; Yoshida, Mitsuhiro

    1999-01-01

    An amplifier-shaper-discriminator (ASD) chip was designed and built for Thin Gap Chambers in the forward muon trigger system of the LHC Atlas experiment. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 channels in a QFP48 package. The gain of its first stage (preamplifier) is approximately 0.8V/pC and output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. The baseline restoration circuit is incorporated in the main-amplifier. The threshold voltage for discriminator section is common to the 4 channels and their digital output level is LVDS-compatible. The IC also has analog output of the preamplifier. The equivalent noise charge at input capacitance of 150 pF is around 7,500 electrons. The power dissipation with LDVS outputs (100 Omega load) is 59mW/ch

  20. ASD IC for the thin gap chambers in the LHC ATLAS experiment

    CERN Document Server

    Sasaki, O

    1998-01-01

    An amplifier-shaper-discriminator (ASD) chip was designed and built for Thin Gap Chambers in the forward muon trigger system of the LHC ATLAS experiment. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 $9 channels in a QFP48 package. The gain of its first stage (preamplifier) is approximately 0.8 V/pC and output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. The baseline restoration circuit is $9 incorporated in the main-amplifier. The threshold voltage for the discriminator section is common to the 4 channels and their digital output level is LVDS-compatible. The IC also has analog output for the preamplifier. The equivalent $9 noise charge at input capacitance of 150 pF is around 7500 electrons. The power dissipation with LDVS outputs (100 Omega load) is 59 mW/ch. (8 refs).

  1. ASD IC for the thin gap chambers in the LHC ATLAS Experiment

    CERN Document Server

    Sasaki, O

    1999-01-01

    An amplifier-shaper-discriminator (ASD) chip was designed and built for Thin Gap Chambers in the forward muon trigger system of the LHC Atlas experiment. The ASD IC uses SONY Analog Master Slice bipolar technology. The IC contains 4 channels in a QFP48 package. The gain of its first stage (preamplifier) is approximately 0.8 V/pC and output from the preamplifier is received by a shaper (main-amplifier) with a gain of 7. The baseline restoration circuit is incorporated in the main-amplifier. The threshold voltage for discriminator section is common to the 4 channels and their digital output level is LVDS- compatible. The IC also has analog output of the preamplifier. The equivalent noise charge at input capacitance of 150 pF is around 7500 electrons. The power dissipation with LDVS outputs (100 Omega load) is 59 mW/ch.

  2. A Novel Analog Integrated Circuit Design Course Covering Design, Layout, and Resulting Chip Measurement

    Science.gov (United States)

    Lin, Wei-Liang; Cheng, Wang-Chuan; Wu, Chen-Hao; Wu, Hai-Ming; Wu, Chang-Yu; Ho, Kuan-Hsuan; Chan, Chueh-An

    2010-01-01

    This work describes a novel, first-year graduate-level analog integrated circuit (IC) design course. The course teaches students analog circuit design; an external manufacturer then produces their designs in three different silicon chips. The students, working in pairs, then test these chips to verify their success. All work is completed within…

  3. Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

    NARCIS (Netherlands)

    Van Den Ende, D.A.; Van De Wiel, H.J.; Kusters, R.H.L.; Sridhar, A.; Schram, J.F.M.; Cauwe, M.; Van Den Brand, J.

    2014-01-01

    Ultra-thin chips of less than 20 μm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these

  4. Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5D IC technology

    Energy Technology Data Exchange (ETDEWEB)

    Li, Menglu; Tu, K. N., E-mail: kntu@ucla.edu [Department of Materials Science and Engineering, UCLA, Los Angeles, California 90095-1595 (United States); Kim, Dong Wook; Gu, Sam [Qualcomm, San Diego, California 92121 (United States); Parkinson, Dilworth Y.; Barnard, Harold [Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720 (United States)

    2016-08-21

    Thermal-crosstalk induced thermomigration failure in un-powered microbumps has been found in 2.5D integrated circuit (IC) circuit. In 2.5D IC, a Si interposer was used between a polymer substrate and a device chip which has transistors. The interposer has no transistors. If transistors are added to the interposer chip, it becomes 3D IC. In our test structure, there are two Si chips placed horizontally on a Si interposer. The vertical connections between the interposer and the Si chips are through microbumps. We powered one daisy chain of the microbumps under one Si chip; however, the un-powered microbumps in the neighboring chip are failed with big holes in the solder layer. We find that Joule heating from the powered microbumps is transferred horizontally to the bottom of the neighboring un-powered microbumps, and creates a large temperature gradient, in the order of 1000 °C/cm, through the un-powered microbumps in the neighboring chip, so the latter failed by thermomigration. In addition, we used synchrotron radiation tomography to compare three sets of microbumps in the test structure: microbumps under electromigration, microbumps under thermomigration, and microbumps under a constant temperature thermal annealing. The results show that the microbumps under thermomigration have the largest damage. Furthermore, simulation of temperature distribution in the test structure supports the finding of thermomigration.

  5. Experiment list: SRX099380 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available .7,8.5,497 GSM803108: Mi2beta Ikaros knockout chromatin source_name=mouse Ik knockout DP thymocytes || genet...ic background=C57BL/6 x129S4/SvJae || genotype=Ikaros knockout || cell type=DP thymocytes || chip antibody=h

  6. Self-Patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking.

    Science.gov (United States)

    Tuan, Chia-Chi; James, Nathan Pataki; Lin, Ziyin; Chen, Yun; Liu, Yan; Moon, Kyoung-Sik; Li, Zhuo; Wong, C P

    2017-03-15

    As microelectronics are trending toward smaller packages and integrated circuit (IC) stacks nowadays, underfill, the polymer composite filled in between the IC chip and the substrate, becomes increasingly important for interconnection reliability. However, traditional underfills cannot meet the requirements for low-profile and fine pitch in high density IC stacking packages. Post-applied underfills have difficulties in flowing into the small gaps between the chip and the substrate, while pre-applied underfills face filler entrapment at bond pads. In this report, we present a self-patterning underfilling technology that uses selective wetting of underfill on Cu bond pads and Si 3 N 4 passivation via surface energy engineering. This novel process, fully compatible with the conventional underfilling process, eliminates the issue of filler entrapment in typical pre-applied underfilling process, enabling high density and fine pitch IC die bonding.

  7. Study on boiling heat transfer from diode elements in an integrated circuit chip

    Energy Technology Data Exchange (ETDEWEB)

    Hijikata, Kunio; Nagasaki, Takao; Kurata, Naoki (Tokyo Institute of Technology Faculty of Engineering (Japan))

    1989-02-25

    By temperature measurement of elements in boiling experiments with diodes in an integrated circuit (IC) chip, characteristics of boiling heat transfer from tiny heat generating elements in an IC chip and thermal transfer characteristics of multiple heating elements adjoining positioned were studied. The Package of an IC was removed by acid to expose the IC chip. Electricity is applied to the diode in the IC to study the heat transfer properties. The heat transfer rate from a tiny heating element on an IC is greater than that from the conventional continual heated surface. In the case of heat generation by two adjoining elements, the relationship between the total amount of heat and the temperature of elements shows the same characteristics as in the case with a single element. The boiling heat transfer properties of an element in an IC chip are influenced by such microstructure surrounding the element as the pattern of wiring. Heat transfer increases with the decreasing size of the heating element by the heat transfer to the substrate beneath the element. 10 refs., 15 figs.

  8. Embedded Processor Based Automatic Temperature Control of VLSI Chips

    Directory of Open Access Journals (Sweden)

    Narasimha Murthy Yayavaram

    2009-01-01

    Full Text Available This paper presents embedded processor based automatic temperature control of VLSI chips, using temperature sensor LM35 and ARM processor LPC2378. Due to the very high packing density, VLSI chips get heated very soon and if not cooled properly, the performance is very much affected. In the present work, the sensor which is kept very near proximity to the IC will sense the temperature and the speed of the fan arranged near to the IC is controlled based on the PWM signal generated by the ARM processor. A buzzer is also provided with the hardware, to indicate either the failure of the fan or overheating of the IC. The entire process is achieved by developing a suitable embedded C program.

  9. ESD full chip simulation: HBM and CDM requirements and simulation approach

    Directory of Open Access Journals (Sweden)

    E. Franell

    2008-05-01

    Full Text Available Verification of ESD safety on full chip level is a major challenge for IC design. Especially phenomena with their origin in the overall product setup are posing a hurdle on the way to ESD safe products. For stress according to the Charged Device Model (CDM, a stumbling stone for a simulation based analysis is the complex current distribution among a huge number of internal nodes leading to hardly predictable voltage drops inside the circuits.

    This paper describes an methodology for Human Body Model (HBM simulations with an improved ESD-failure coverage and a novel methodology to replace capacitive nodes within a resistive network by current sources for CDM simulation. This enables a highly efficient DC simulation clearly marking CDM relevant design weaknesses allowing for application of this software both during product development and for product verification.

  10. Mismatch and noise in modern IC processes

    CERN Document Server

    Marshall, Andrew

    2009-01-01

    Component variability, mismatch, and various noise effects are major contributors to design limitations in most modern IC processes. Mismatch and Noise in Modern IC Processes examines these related effects and how they affect the building block circuits of modern integrated circuits, from the perspective of a circuit designer.Variability usually refers to a large scale variation that can occur on a wafer to wafer and lot to lot basis, and over long distances on a wafer. This phenomenon is well understood and the effects of variability are included in most integrated circuit design with the use

  11. Design Developing of IC- Model Using VHDL

    International Nuclear Information System (INIS)

    Inzar-Anas

    2005-01-01

    In present, the electronic design required to become simple, small and flexible. The physical dimension of IC and number of pin can be significantly reduced while the flexibility and compatibility of IC was not change. Implementation of VHDL(VHSIC Hardware Description Language) seem as a great progress in the design of digital circuit. By using this language designing of model can be more simple, flexible and efficient. This paper was purposed to introduce VHDL and its features. Sample in modeling to illustrate the advantage of VHDL will also be described. (author)

  12. Preliminary I&C Design for LORELEI

    International Nuclear Information System (INIS)

    Korotkin, S.; Kaufman, Y.; Guttmann, E. B.; Levy, S.; Amidan, D.; Gdalyho, B.; Cahana, T.; Ellenbogen, A.; Arad, M.; Weiss, Y.; Sasson, A.; Ferry, L.; Bourrelly, F.; Cohen, Y.

    2014-01-01

    This document summarizes the preliminary I&C design for LORELEI experiment The preliminary design deals with considerations regarding appropriate safety and service instrumentation. The determined closed loop control rules for temperature and position will be implemented in the detailed design. The Computer Aided Operator Decisions System (CAODS) will be used for prediction of hot spot temperature and thickness of oxidation layer using Baker-Just correlation. The proposed hybrid simulation system comprising of both virtual and real hardware will be in-cooperated for LORELEI verification. It will perform both integration cold tests for a partial hardware loop and virtual tests for the final I&C design

  13. Abundances of Planetary Nebulae IC 418, IC 2165 and NGC 5882

    NARCIS (Netherlands)

    Pottasch, [No Value; Bernard-Salas, J; Beintema, DA; Feibelman, WA

    The ISO and IUE spectra of the elliptical nebulae NGC 5882, IC 418 and IC 2165 are presented. These spectra are combined with the spectra in the visual wavelength region to obtain a complete, extinction corrected, spectrum. The chemical composition of the nebulae is then calculated and compared to

  14. SEU immune ICs for project Galileo

    International Nuclear Information System (INIS)

    Giddings, A.E.; Hewlett, F.W.; Treece, R.K.; Nichols, D.K.; Smith, L.S.; Zoutendyk, J.A.

    1985-01-01

    Tests showed that bipolar chips in the attitude control computer of the Galileo spacecraft would likely cause catastrophic mission failure due to single particle upset. This paper describes the design and testing of CMOS replacements which are speed compatible with the bipolar parts and are immune to upset by 165-MeV krypton ions

  15. Development of brain injury criteria (BrIC).

    Science.gov (United States)

    Takhounts, Erik G; Craig, Matthew J; Moorhouse, Kevin; McFadden, Joe; Hasija, Vikas

    2013-11-01

    Rotational motion of the head as a mechanism for brain injury was proposed back in the 1940s. Since then a multitude of research studies by various institutions were conducted to confirm/reject this hypothesis. Most of the studies were conducted on animals and concluded that rotational kinematics experienced by the animal's head may cause axonal deformations large enough to induce their functional deficit. Other studies utilized physical and mathematical models of human and animal heads to derive brain injury criteria based on deformation/pressure histories computed from their models. This study differs from the previous research in the following ways: first, it uses two different detailed mathematical models of human head (SIMon and GHBMC), each validated against various human brain response datasets; then establishes physical (strain and stress based) injury criteria for various types of brain injury based on scaled animal injury data; and finally, uses Anthropomorphic Test Devices (ATDs) (Hybrid III 50th Male, Hybrid III 5th Female, THOR 50th Male, ES-2re, SID-IIs, WorldSID 50th Male, and WorldSID 5th Female) test data (NCAP, pendulum, and frontal offset tests) to establish a kinematically based brain injury criterion (BrIC) for all ATDs. Similar procedures were applied to college football data where thousands of head impacts were recorded using a six degrees of freedom (6 DOF) instrumented helmet system. Since animal injury data used in derivation of BrIC were predominantly for diffuse axonal injury (DAI) type, which is currently an AIS 4+ injury, cumulative strain damage measure (CSDM) and maximum principal strain (MPS) were used to derive risk curves for AIS 4+ anatomic brain injuries. The AIS 1+, 2+, 3+, and 5+ risk curves for CSDM and MPS were then computed using the ratios between corresponding risk curves for head injury criterion (HIC) at a 50% risk. The risk curves for BrIC were then obtained from CSDM and MPS risk curves using the linear relationship

  16. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  17. Challenges in IC design for hearing aids

    DEFF Research Database (Denmark)

    Jørgensen, Ivan Harald Holger

    2012-01-01

    Designing modern hearing aids is a formidable challenge. The size of hearing aids is constantly decreasing, making them virtually invisible today. Still, as in all other modern electronics, more and more features are added to these devices driven by the development in modern IC technology....... The demands for performance and features at very low supply voltage and power consumption constantly prove a challenge to the physical design of hearing aids and not at least the design of the ICs for these. As a result of this all large hearing aid manufacturers use fully customized ASICs in their products...... to produce a competitive advantage. This presentation will give a brief insight into the hearing aid market and industry, a brief view of the historic development of hearing aids and an introduction to how a modern hearing is constructed showing the amplifier as the key component in the modern hearing aid...

  18. Stress

    Science.gov (United States)

    ... can be life-saving. But chronic stress can cause both physical and mental harm. There are at least three different types of stress: Routine stress related to the pressures of work, family, and other daily responsibilities Stress brought about ...

  19. Simulation of SEU transients in CMOS ICs

    International Nuclear Information System (INIS)

    Kaul, N.; Bhuva, B.L.; Kerns, S.E.

    1991-01-01

    This paper reports that available analytical models of the number of single-event-induced errors (SEU) in combinational logic systems are not easily applicable to real integrated circuits (ICs). An efficient computer simulation algorithm set, SITA, predicts the vulnerability of data stored in and processed by complex combinational logic circuits to SEU. SITA is described in detail to allow researchers to incorporate it into their error analysis packages. Required simulation algorithms are based on approximate closed-form equations modeling individual device behavior in CMOS logic units. Device-level simulation is used to estimate the probability that ion-device interactions produce erroneous signals capable of propagating to a latch (or n output node), and logic-level simulation to predict the spread of such erroneous, latched information through the IC. Simulation results are compared to those from SPICE for several circuit and logic configurations. SITA results are comparable to this established circuit-level code, and SITA can analyze circuits with state-of-the-art device densities (which SPICE cannot). At all IC complexity levels, SITAS offers several factors of 10 savings in simulation time over SPICE

  20. UW VLSI chip tester

    Science.gov (United States)

    McKenzie, Neil

    1989-12-01

    We present a design for a low-cost, functional VLSI chip tester. It is based on the Apple MacIntosh II personal computer. It tests chips that have up to 128 pins. All pin drivers of the tester are bidirectional; each pin is programmed independently as an input or an output. The tester can test both static and dynamic chips. Rudimentary speed testing is provided. Chips are tested by executing C programs written by the user. A software library is provided for program development. Tests run under both the Mac Operating System and A/UX. The design is implemented using Xilinx Logic Cell Arrays. Price/performance tradeoffs are discussed.

  1. High energy ion implantation for IC processing

    International Nuclear Information System (INIS)

    Oosterhoff, S.

    1986-01-01

    In this thesis the results of fundamental research on high energy ion implantation in silicon are presented and discussed. The implantations have been carried out with the 500 kV HVEE ion implantation machine, that was acquired in 1981 by the IC technology and Electronics group at Twente University of Technology. The damage and anneal behaviour of 1 MeV boron implantations to a dose of 10 13 /cm 2 have been investigated as a function of anneal temperature by sheet resistance, Hall and noise measurements. (Auth.)

  2. A microfluidic microprocessor: controlling biomimetic containers and cells using hybrid integrated circuit/microfluidic chips.

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A; Westervelt, Robert M

    2010-11-07

    We present an integrated platform for performing biological and chemical experiments on a chip based on standard CMOS technology. We have developed a hybrid integrated circuit (IC)/microfluidic chip that can simultaneously control thousands of living cells and pL volumes of fluid, enabling a wide variety of chemical and biological tasks. Taking inspiration from cellular biology, phospholipid bilayer vesicles are used as robust picolitre containers for reagents on the chip. The hybrid chip can be programmed to trap, move, and porate individual living cells and vesicles and fuse and deform vesicles using electric fields. The IC spatially patterns electric fields in a microfluidic chamber using 128 × 256 (32,768) 11 × 11 μm(2) metal pixels, each of which can be individually driven with a radio frequency (RF) voltage. The chip's basic functions can be combined in series to perform complex biological and chemical tasks and can be performed in parallel on the chip's many pixels for high-throughput operations. The hybrid chip operates in two distinct modes, defined by the frequency of the RF voltage applied to the pixels: Voltages at MHz frequencies are used to trap, move, and deform objects using dielectrophoresis and voltages at frequencies below 1 kHz are used for electroporation and electrofusion. This work represents an important step towards miniaturizing the complex chemical and biological experiments used for diagnostics and research onto automated and inexpensive chips.

  3. PDC IC WELD FAILURE EVALUATION AND RESOLUTION

    Energy Technology Data Exchange (ETDEWEB)

    Korinko, P.; Howard, S.; Maxwell, D.; Fiscus, J.

    2012-04-16

    During final preparations for start of the PDCF Inner Can (IC) qualification effort, welding was performed on an automated weld system known as the PICN. During the initial weld, using a pedigree canister and plug, a weld defect was observed. The defect resulted in a hole in the sidewall of the canister, and it was observed that the plug sidewall had not been consumed. This was a new type of failure not seen during development and production of legacy Bagless Transfer Cans (FB-Line/Hanford). Therefore, a team was assembled to determine the root cause and to determine if the process could be improved. After several brain storming sessions (MS and T, R and D Engineering, PDC Project), an evaluation matrix was established to direct this effort. The matrix identified numerous activities that could be taken and then prioritized those activities. This effort was limited by both time and resources (the number of canisters and plugs available for testing was limited). A discovery process was initiated to evaluate the Vendor's IC fabrication process relative to legacy processes. There were no significant findings, however, some information regarding forging/anneal processes could not be obtained. Evaluations were conducted to compare mechanical properties of the PDC canisters relative to the legacy canisters. Some differences were identified, but mechanical properties were determined to be consistent with legacy materials. A number of process changes were also evaluated. A heat treatment procedure was established that could reduce the magnetic characteristics to levels similar to the legacy materials. An in-situ arc annealing process was developed that resulted in improved weld characteristics for test articles. Also several tack welds configurations were addressed, it was found that increasing the number of tack welds (and changing the sequence) resulted in decreased can to plug gaps and a more stable weld for test articles. Incorporating all of the process

  4. Scalable IC Platform for Smart Cameras

    Directory of Open Access Journals (Sweden)

    Harry Broers

    2005-08-01

    Full Text Available Smart cameras are among the emerging new fields of electronics. The points of interest are in the application areas, software and IC development. In order to reduce cost, it is worthwhile to invest in a single architecture that can be scaled for the various application areas in performance (and resulting power consumption. In this paper, we show that the combination of an SIMD (single-instruction multiple-data processor and a general-purpose DSP is very advantageous for the image processing tasks encountered in smart cameras. While the SIMD processor gives the very high performance necessary by exploiting the inherent data parallelism found in the pixel crunching part of the algorithms, the DSP offers a friendly approach to the more complex tasks. The paper continues to motivate that SIMD processors have very convenient scaling properties in silicon, making the complete, SIMD-DSP architecture suitable for different application areas without changing the software suite. Analysis of the changes in power consumption due to scaling shows that for typical image processing tasks, it is beneficial to scale the SIMD processor to use the maximum level of parallelism available in the algorithm if the IC supply voltage can be lowered. If silicon cost is of importance, the parallelism of the processor should be scaled to just reach the desired performance given the speed of the silicon.

  5. Studying Radiation Tolerant ICs for LHC

    CERN Multimedia

    Faccio, F; Snoeys, W; Campbell, M; Casas-cubillos, J; Gomes, P

    2002-01-01

    %title\\\\ \\\\In the recent years, intensive work has been carried out on the development of custom ICs for the readout electronics for LHC experiments. As far as radiation hardness is concerned, attention has been focussed on high total dose applications, mainly for the tracker systems. The dose foreseen in this inner region is estimated to be higher than 1~Mrad/year. In the framework of R&D projects (RD-9 and RD-20) and in the ATLAS and CMS experiments, the study of different radiation hard processes has been pursued and good contacts with the manufacturers have been established. The results of these studies have been discussed during the Microelectronics User Group (MUG) rad-hard meetings, and now some HEP groups are working to develop radiation hard ICs for the LHC experiments on some of the available rad-hard processes.\\\\ \\\\In addition, a lot of the standard commercial electronic components and ASICs which are planned to be installed near the LHC machine and in the detectors will receive total doses in ...

  6. Electron Storage Ring Development for ICS Sources

    Energy Technology Data Exchange (ETDEWEB)

    Loewen, Roderick [Lyncean Technologies, Inc., Palo Alto, CA (United States)

    2015-09-30

    There is an increasing world-wide interest in compact light sources based on Inverse Compton Scattering. Development of these types of light sources includes leveraging the investment in accelerator technology first developed at DOE National Laboratories. Although these types of light sources cannot replace the larger user-supported synchrotron facilities, they offer attractive alternatives for many x-ray science applications. Fundamental research at the SLAC National Laboratory in the 1990’s led to the idea of using laser-electron storage rings as a mechanism to generate x-rays with many properties of the larger synchrotron light facilities. This research led to a commercial spin-off of this technology. The SBIR project goal is to understand and improve the performance of the electron storage ring system of the commercially available Compact Light Source. The knowledge gained from studying a low-energy electron storage ring may also benefit other Inverse Compton Scattering (ICS) source development. Better electron storage ring performance is one of the key technologies necessary to extend the utility and breadth of applications of the CLS or related ICS sources. This grant includes a subcontract with SLAC for technical personnel and resources for modeling, feedback development, and related accelerator physics studies.

  7. Conceptualising Intellectual Capital (IC) as Language Game and Power

    DEFF Research Database (Denmark)

    Jørgensen, Kenneth Mølbjerg

    2006-01-01

    Intellectual Capital (IC) can be viewed as knowledge about knowledge, knowledge creation and how such processes might be leveraged into value. Developing a critical understanding of IC requires a historical and contextual understanding of how IC has emerged and how IC is used. This paper, drawing...... this process of social construction. The paper concludes by proposing some methodological guidelines for conducting critical genealogical research on intellectual capital....

  8. ALICE chip processor

    CERN Multimedia

    Maximilien Brice

    2003-01-01

    This tiny chip provides data processing for the time projection chamber on ALICE. Known as the ALICE TPC Read Out (ALTRO), this device was designed to minimize the size and power consumption of the TPC front end electronics. This single chip contains 16 low-power analogue-to-digital converters with six million transistors of digital processing and 8 kbits of data storage.

  9. LDMOS Channel Thermometer Based on a Thermal Resistance Sensor for Balancing Temperature in Monolithic Power ICs

    Directory of Open Access Journals (Sweden)

    Tingyou Lin

    2017-06-01

    Full Text Available This paper presents a method of thermal balancing for monolithic power integrated circuits (ICs. An on-chip temperature monitoring sensor that consists of a poly resistor strip in each of multiple parallel MOSFET banks is developed. A temperature-to-frequency converter (TFC is proposed to quantize on-chip temperature. A pulse-width-modulation (PWM methodology is developed to balance the channel temperature based on the quantization. The modulated PWM pulses control the hottest of metal-oxide-semiconductor field-effect transistor (MOSFET bank to reduce its power dissipation and heat generation. A test chip with eight parallel MOSFET banks is fabricated in TSMC 0.25 μm HV BCD processes, and total area is 900 × 914 μm2. The maximal temperature variation among the eight banks can reduce to 2.8 °C by the proposed thermal balancing system from 9.5 °C with 1.5 W dissipation. As a result, our proposed system improves the lifetime of a power MOSFET by 20%.

  10. An NFC-Enabled CMOS IC for a Wireless Fully Implantable Glucose Sensor.

    Science.gov (United States)

    DeHennis, Andrew; Getzlaff, Stefan; Grice, David; Mailand, Marko

    2016-01-01

    This paper presents an integrated circuit (IC) that merges integrated optical and temperature transducers, optical interface circuitry, and a near-field communication (NFC)-enabled digital, wireless readout for a fully passive implantable sensor platform to measure glucose in people with diabetes. A flip-chip mounted LED and monolithically integrated photodiodes serve as the transduction front-end to enable fluorescence readout. A wide-range programmable transimpedance amplifier adapts the sensor signals to the input of an 11-bit analog-to-digital converter digitizing the measurements. Measurement readout is enabled by means of wireless backscatter modulation to a remote NFC reader. The system is able to resolve current levels of less than 10 pA with a single fluorescent measurement energy consumption of less than 1 μJ. The wireless IC is fabricated in a 0.6-μm-CMOS process and utilizes a 13.56-MHz-based ISO15693 for passive wireless readout through a NFC interface. The IC is utilized as the core interface to a fluorescent, glucose transducer to enable a fully implantable sensor-based continuous glucose monitoring system.

  11. Nanometer CMOS ICs from basics to ASICs

    CERN Document Server

    J M Veendrick, Harry

    2017-01-01

    This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.

  12. System reduction for nanoscale IC design

    CERN Document Server

    2017-01-01

    This book describes the computational challenges posed by the progression toward nanoscale electronic devices and increasingly short design cycles in the microelectronics industry, and proposes methods of model reduction which facilitate circuit and device simulation for specific tasks in the design cycle. The goal is to develop and compare methods for system reduction in the design of high dimensional nanoelectronic ICs, and to test these methods in the practice of semiconductor development. Six chapters describe the challenges for numerical simulation of nanoelectronic circuits and suggest model reduction methods for constituting equations. These include linear and nonlinear differential equations tailored to circuit equations and drift diffusion equations for semiconductor devices. The performance of these methods is illustrated with numerical experiments using real-world data. Readers will benefit from an up-to-date overview of the latest model reduction methods in computational nanoelectronics.

  13. High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

    2010-01-01

    A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

  14. Stress

    Science.gov (United States)

    ... taking care of an aging parent. With mental stress, the body pumps out hormones to no avail. Neither fighting ... with type 1 diabetes. This difference makes sense. Stress blocks the body from releasing insulin in people with type 2 ...

  15. Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging

    Science.gov (United States)

    Shih, T. I.; Duh, J. G.

    2008-06-01

    The decapsulation of flip chips bonded to ceramic substrates is a challenging task in the packaging industry owing to the vulnerability of the chip surface during the process. In conventional methods, such as manual grinding and polishing, the solder bumps are easily damaged during the removal of underfill, and the thin chip may even be crushed due to mechanical stress. An efficient and reliable decapsulation method consisting of thermal and chemical processes was developed in this study. The surface quality of chips after solder removal is satisfactory for the existing solder rework procedure as well as for die-level failure analysis. The innovative processes included heat-sink and ceramic substrate removal, solder bump separation, and solder residue cleaning from the chip surface. In the last stage, particular temperatures were selected for the removal of eutectic Pb-Sn, high-lead, and lead-free solders considering their respective melting points.

  16. Medicaid CHIP ESPC Database

    Data.gov (United States)

    U.S. Department of Health & Human Services — The Environmental Scanning and Program Characteristic (ESPC) Database is in a Microsoft (MS) Access format and contains Medicaid and CHIP data, for the 50 states and...

  17. LES of Gas Exchange in IC Engines

    Directory of Open Access Journals (Sweden)

    Mittal V.

    2013-10-01

    Full Text Available As engine technologies become increasingly complex and engines are driven to new operating points, understanding transient phenomena is important to ensure reliable engine operation. Unlike Reynolds Averaged Navier-Stokes (RANS studies that only provide cycle-averaged information, Large Eddy Simulation (LES studies are capable of simulating cycle-to-cycle dynamics. In this work, a finite difference based structured methodology for LES of IC engines is presented. This structured approach allows for an efficient mesh generation process and provides potential for higher order numerical accuracy. An efficient parallel scalable block decomposition is done to overcome the challenges associated with the low ratio of fluid elements to overall mesh elements. The motion of the valves and piston is handled using a dynamic cell blanking approach and the Arbitrary Lagrangian Eulerian (ALE method, respectively. Modified three-dimensional Navier-Stokes Characteristic Boundary Conditions (NSCBC are used in the simulation to prescribe conditions in the manifolds. The accuracy of the simulation framework is validated using various canonical configurations. Flow bench simulations of an axisymmetric configuration and an actual engine geometry are done with the LES methodology. Simulations of the gas exchange in an engine under motored conditions are also performed. Overall, good agreement is obtained with experiments for all the cases. Therefore, this framework can be used for LES of engine simulations. In the future, reactive LES simulations will be performed using this framework.

  18. The H II regions of IC 1613

    International Nuclear Information System (INIS)

    Hodge, P.; Lee, M.G.; Gurwell, M.

    1990-01-01

    Narrow-band CCD H-alpha imaging of the Local Group irregular galaxy IC 1613 has revealed a total of 77 H II regions, five of which are complexes of several smaller emission regions. Positions, H-alpha luminosities, and sizes of these objects are tabulated. The H-alpha luminosity function has the same shape as that for more luminous galaxies, following a power law with an exponent of -1.6. The faintest H II regions are at the low-luminosity end of the generally observed luminosity function for H II regions in galaxies, with fluxes of only 10 to the 35th erg/sec. The size distribution has an exponential shape, as for other galaxies, with a size scale of 56 pc. The morphologies of different H II regions are discussed and compared to those in other galaxies. Published radio continuum maps compare well with the H-alpha emission distribution. The distribution of H I is also similar in the central areas to the H II with, however, a tendency for the H II regions to lie to one side of H I peaks. 31 refs

  19. Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography

    DEFF Research Database (Denmark)

    Ghimire, Pramod; Pedersen, Kristian Bonderup; Trintis, Ionut

    2015-01-01

    This paper presents on-state collector-emitter voltage (υce, on)-load current (Ic) method to monitor chip temperature on power insulated gate bipolar transistor (IGBT) modules in converter operation. The measurement method is also evaluated using infrared (IR) thermography. Temperature dependencies...

  20. Thermal-Aware Scheduling for Future Chip Multiprocessors

    Directory of Open Access Journals (Sweden)

    Pedro Trancoso

    2007-04-01

    Full Text Available The increased complexity and operating frequency in current single chip microprocessors is resulting in a decrease in the performance improvements. Consequently, major manufacturers offer chip multiprocessor (CMP architectures in order to keep up with the expected performance gains. This architecture is successfully being introduced in many markets including that of the embedded systems. Nevertheless, the integration of several cores onto the same chip may lead to increased heat dissipation and consequently additional costs for cooling, higher power consumption, decrease of the reliability, and thermal-induced performance loss, among others. In this paper, we analyze the evolution of the thermal issues for the future chip multiprocessor architectures and show that as the number of on-chip cores increases, the thermal-induced problems will worsen. In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss. In order to minimize or even eliminate these problems, we propose thermal-aware scheduler (TAS algorithms. When assigning processes to cores, TAS takes their temperature and cooling ability into account in order to avoid thermal stress and at the same time improve the performance. Experimental results have shown that a TAS algorithm that considers also the temperatures of neighboring cores is able to significantly reduce the temperature-induced performance loss while at the same time, decrease the chip's temperature across many different operation and configuration scenarios.

  1. ASIC Wafer Test System for the ATLAS Semiconductor Tracker Front-End Chip

    International Nuclear Information System (INIS)

    Anghinolfi, F.; Bialas, W.; Busek, N.; Ciocio, A.; Cosgrove, D.; Fadeyev, V.; Flacco, C.; Gilchriese, M.; Grillo, A.A.; Haber, C.; Kaplon, J.; Lacasta, C.; Murray, W.; Niggli, H.; Pritchard, T.; Rosenbaum, F.; Spieler, H.; Stezelberger, T.; Vu, C.; Wilder, M.; Yaver, H.; Zetti, F.

    2002-01-01

    An ASIC wafer test system has been developed to provide comprehensive production screening of the ATLAS Semiconductor Tracker front-end chip (ABCD3T). The ABCD3T[1] features a 128-channel analog front-end, a digital pipeline, and communication circuitry, clocked at 40 MHz, which is the bunch crossing frequency at the LHC (Large Hadron Collider). The tester measures values and tolerance ranges of all critical IC parameters, including DC parameters, electronic noise, time resolution, clock levels and clock timing. The tester is controlled by an FPGA (ORCA3T) programmed to issue the input commands to the IC and to interpret the output data. This allows the high-speed wafer-level IC testing necessary to meet the production schedule. To characterize signal amplitudes and phase margins, the tester utilizes pin-driver, delay, and DAC chips, which control the amplitudes and delays of signals sent to the IC under test. Output signals from the IC under test go through window comparator chips to measure their levels. A probe card has been designed specifically to reduce pick-up noise that can affect the measurements. The system can operate at frequencies up to 100 MHz to study the speed limits of the digital circuitry before and after radiation damage. Testing requirements and design solutions are presented

  2. Description of the SAltro-16 chip for gas detector readout

    CERN Document Server

    Aspell, P; Garcia Garcia, E; de Gaspari, M; Mager, M; Musa, L; Rehman, A; Trampitsch, G

    2010-01-01

    The S-ALTRO prototype chip is a mixed-signal integrated circuit designed to be one of the building blocks of the readout electronics for gas detectors. Its architecture is based in the ALTRO (ALICE TPC Read Out) chip, being its main difference the integration of the charge shaping amplifier in the same IC. Just like ALTRO chip, the prototype architecture and programmability make it suitable for the readout of a wider class of detectors. In one single chip, 16 analogue signals from the detector are shaped, digitised, processed, compressed and stored in a multi-acquisition memory. The Analogue-to- Digital converters embedded in the chip have a 10-bit dynamic range and a maximum sampling rate up to 40MHz. After digitisation, a pipelined Data Processor is able to remove from the input signal a wide range of perturbations, related to the non- ideal behaviour of the detector, temperature variation of the electronics, environmental noise, etc. Moreover, the Data Processor is able to suppress the pulse tail within 1�...

  3. Prometheus Reactor I&C Software Development Methodology, for Action

    Energy Technology Data Exchange (ETDEWEB)

    T. Hamilton

    2005-07-30

    The purpose of this letter is to submit the Reactor Instrumentation and Control (I&C) software life cycle, development methodology, and programming language selections and rationale for project Prometheus to NR for approval. This letter also provides the draft Reactor I&C Software Development Process Manual and Reactor Module Software Development Plan to NR for information.

  4. Price of forest chips decreasing

    International Nuclear Information System (INIS)

    Hakkila, P.

    2001-01-01

    Use of forest chips was studied in 1999 in the national Puuenergia (Wood Energy) research program. Wood combusting heating plants were questioned about are the main reasons restricting the increment of the use of forest chips. Heating plants, which did not use forest chips at all or which used less than 250 m 3 (625 bulk- m 3 ) in 1999 were excluded. The main restrictions for additional use of forest chips were: too high price of forest chips; lack of suppliers and/or uncertainty of deliveries; technical problems of reception and processing of forest chips; insufficiency of boiler output especially in winter; and unsatisfactory quality of chips. The price of forest chips becomes relatively high because wood biomass used for production of forest chips has to be collected from wide area. Heavy equipment has to be used even though small fragments of wood are processed, which increases the price of chips. It is essential for forest chips that the costs can be pressed down because competition with fossil fuels, peat and industrial wood residues is hard. Low market price leads to the situation in which forest owner gets no price of the raw material, the entrepreneurs operate at the limit of profitability and renovation of machinery is difficult, and forest chips suppliers have to sell the chips at prime costs. Price of forest chips has decreased significantly during the past decade. Nominal price of forest chips is now lower than two decades ago. The real price of chips has decreased even more than the nominal price, 35% during the past decade and 20% during the last five years. Chips, made of small diameter wood, are expensive because the price includes the felling costs and harvesting is carried out at thinning lots. Price is especially high if chips are made of delimbed small diameter wood due to increased the work and reduced amount of chips. The price of logging residue chips is most profitable because cutting does not cause additional costs. Recovery of chips is

  5. Optimal selection of TLD chips

    International Nuclear Information System (INIS)

    Phung, P.; Nicoll, J.J.; Edmonds, P.; Paris, M.; Thompson, C.

    1996-01-01

    Large sets of TLD chips are often used to measure beam dose characteristics in radiotherapy. A sorting method is presented to allow optimal selection of chips from a chosen set. This method considers the variation

  6. Stress

    DEFF Research Database (Denmark)

    Keller, Hanne Dauer

    2015-01-01

    Kapitlet handler om stress som følelse, og det trækker primært på de få kvalitative undersøgelser, der er lavet af stressforløb.......Kapitlet handler om stress som følelse, og det trækker primært på de få kvalitative undersøgelser, der er lavet af stressforløb....

  7. Stress !!!

    OpenAIRE

    Fledderus, M.

    2012-01-01

    Twee op de vijf UT-studenten hebben last van ernstige studiestress, zo erg zelfs dat het ze in hun privéleven belemmert. Die cijfers komen overeen met het landelijk beeld van stress onder studenten. Samen met 14 andere universiteits- en hogeschoolbladen enquêteerde UT Nieuws bijna 5500 studenten. Opvallend is dat mannelijke studenten uit Twente zich veel minder druk lijken te maken over hun studie. Onder vrouwen ligt de stress juist erg hoog ten opzichte van het landelijk gemiddelde.

  8. Smart vision chips: An overview

    Science.gov (United States)

    Koch, Christof

    1994-01-01

    This viewgraph presentation presents four working analog VLSI vision chips: (1) time-derivative retina, (2) zero-crossing chip, (3) resistive fuse, and (4) figure-ground chip; work in progress on computing motion and neuromorphic systems; and conceptual and practical lessons learned.

  9. The Implications Related to Different IC, Different Projects and Different Thinking Addressing the Common Core of IC

    DEFF Research Database (Denmark)

    Lindgren, Peter; Saghaug, Kristin Margrethe

    2009-01-01

    challenge the development of IC: - The IC at the organizational level seems to diminish when innovation gets highly dispersed and is operated outside the core of the organization - The attractiveness of the organization to different ICA, which is one fundament to sustainable and successful innovation, seems...... to fall when the IC at the organizational core level diminishes The objective of this paper is therefore to understand 1) How the IC at the organizational core level may continue to be developed, when at the same time innovation is taking place in dispersed groups and projects. 2) How to motivate...... the different ICA´s to bring learning and knowledge back to the core with the purpose to develop IC at the organizational core level....

  10. Estimate the thermomechanical fatigue life of two flip chip packages

    International Nuclear Information System (INIS)

    Pash, R.A.; Ullah, H.S.; Khan, M.Z.

    2005-01-01

    The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

  11. HI observations of the irregular galaxy IC 10

    International Nuclear Information System (INIS)

    Shostak, G.S.; Woerden, H. van

    1983-01-01

    The authors have made radio synthesis observations of the galaxy IC 10 with resolutions of 30 arcsec and 8 km/sec in the neutral hydrogen line using the Westerbork telescope. These confirm Shostak's (1974) result that, in the central region of IC 10, the velocity gradient is opposite to that later measured by single-dish in the outer regions. The suggestion by Cohen (1979) that the velocity gradient reversal is due to IC 10 being nearly face-on and warped is consistent with the new data. (Auth.)

  12. Chip bonding of low-melting eutectic alloys by transmitted laser radiation

    Science.gov (United States)

    Hoff, Christian; Venkatesh, Arjun; Schneider, Friedrich; Hermsdorf, Jörg; Bengsch, Sebastian; Wurz, Marc C.; Kaierle, Stefan; Overmeyer, Ludger

    2017-06-01

    Present-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.

  13. Stress !!!

    NARCIS (Netherlands)

    Fledderus, M.

    2012-01-01

    Twee op de vijf UT-studenten hebben last van ernstige studiestress, zo erg zelfs dat het ze in hun privéleven belemmert. Die cijfers komen overeen met het landelijk beeld van stress onder studenten. Samen met 14 andere universiteits- en hogeschoolbladen enquêteerde UT Nieuws bijna 5500 studenten.

  14. Virtual design and qualification of IC backend structures

    NARCIS (Netherlands)

    Silfhout, van R.B.R.; Sluis, van der O.; Driel, van W.D.; Janssen, J.H.J.; Zhang, G.Q.

    2006-01-01

    For Integrated Circuit (IC) wafer backend development, process developers have to design robust backend structures that guarantee both functionality and reliability during waferfab processes, packaging, qualification tests and lifetime. Figure 1 shows a simplified diagram for the design (and

  15. Interband cascade (IC) photovoltaic (PV) architecture for PV devices

    Science.gov (United States)

    Yang, Rui Q.; Tian, Zhaobing; Mishima, Tetsuya D.; Santos, Michael B.; Johnson, Matthew B.; Klem, John F.

    2015-10-20

    A photovoltaic (PV) device, comprising a PV interband cascade (IC) stage, wherein the IC PV stage comprises an absorption region with a band gap, the absorption region configured to absorb photons, an intraband transport region configured to act as a hole barrier, and an interband tunneling region configured to act as an electron barrier. An IC PV architecture for a photovoltaic device, the IC PV architecture comprising an absorption region, an intraband transport region coupled to the absorption region, and an interband tunneling region coupled to the intraband transport region and to the adjacent absorption region, wherein the absorption region, the intraband transport region, and the interband tunneling region are positioned such that electrons will flow from the absorption region to the intraband transport region to the interband tunneling region.

  16. Study on Mine Emergency Mechanism based on TARP and ICS

    Science.gov (United States)

    Xi, Jian; Wu, Zongzhi

    2018-01-01

    By analyzing the experiences and practices of mine emergency in China and abroad, especially the United States and Australia, normative principle, risk management principle and adaptability principle of constructing mine emergency mechanism based on Trigger Action Response Plans (TARP) and Incident Command System (ICS) are summarized. Classification method, framework, flow and subject of TARP and ICS which are suitable for the actual situation of domestic mine emergency are proposed. The system dynamics model of TARP and ICS is established. The parameters such as evacuation ratio, response rate, per capita emergency capability and entry rate of rescuers are set up. By simulating the operation process of TARP and ICS, the impact of these parameters on the emergency process are analyzed, which could provide a reference and basis for building emergency capacity, formulating emergency plans and setting up action plans in the emergency process.

  17. APPLICATTON OF SCTENTIF'IC PRINCIPLES IN MERINO SHEEP ...

    African Journals Online (AJOL)

    THE PRACTICAI- APPLICATTON OF SCTENTIF'IC PRINCIPLES IN MERINO SHEEP BREEDING. C.A. van der ..... There is, however, no practical evidence in this ... 1910" Comparison of three Australian merino strains for wool and body traits.

  18. Simulation of design dependent failure exposure levels for CMOS ICs

    International Nuclear Information System (INIS)

    Kaul, N.; Bhuva, B.L.; Rangavajjhala, V.; van der Molen, H.; Kerns, S.E.

    1990-01-01

    The total dose exposure of CMOS ICs introduces bias-dependent parameter shifts in individual devices. The bias dependency of individual parameter shifts of devices cause different designs to behave differently under identical testing conditions. This paper studies the effect of design and bias on the radiation tolerance of ICs and presents an automated design tool that produces different designs for a logic function, and presents important parameters of each design to circuit designer for trade off analysis

  19. Hybridization of Environmental Microbial Community Nucleic Acids by GeoChip.

    Science.gov (United States)

    Van Nostrand, Joy D; Yin, Huaqin; Wu, Liyou; Yuan, Tong; Zhou, Jizhong

    2016-01-01

    Functional gene arrays, like the GeoChip, allow for the study of tens of thousands of genes in a single assay. The GeoChip array (5.0) contains probes for genes involved in geochemical cycling (N, C, S, and P), metal homeostasis, stress response, organic contaminant degradation, antibiotic resistance, secondary metabolism, and virulence factors as well as genes specific for fungi, protists, and viruses. Here, we briefly describe GeoChip design strategies (gene selection and probe design) and discuss minimum quantity and quality requirements for nucleic acids. We then provide detailed protocols for amplification, labeling, and hybridization of samples to the GeoChip.

  20. The Front-End Readout as an Encoder IC for Magneto-Resistive Linear Scale Sensors

    Directory of Open Access Journals (Sweden)

    Trong-Hieu Tran

    2016-09-01

    Full Text Available This study proposes a front-end readout circuit as an encoder chip for magneto-resistance (MR linear scales. A typical MR sensor consists of two major parts: one is its base structure, also called the magnetic scale, which is embedded with multiple grid MR electrodes, while another is an “MR reader” stage with magnets inside and moving on the rails of the base. As the stage is in motion, the magnetic interaction between the moving stage and the base causes the variation of the magneto-resistances of the grid electrodes. In this study, a front-end readout IC chip is successfully designed and realized to acquire temporally-varying resistances in electrical signals as the stage is in motions. The acquired signals are in fact sinusoids and co-sinusoids, which are further deciphered by the front-end readout circuit via newly-designed programmable gain amplifiers (PGAs and analog-to-digital converters (ADCs. The PGA is particularly designed to amplify the signals up to full dynamic ranges and up to 1 MHz. A 12-bit successive approximation register (SAR ADC for analog-to-digital conversion is designed with linearity performance of ±1 in the least significant bit (LSB over the input range of 0.5–2.5 V from peak to peak. The chip was fabricated by the Taiwan Semiconductor Manufacturing Company (TSMC 0.35-micron complementary metal oxide semiconductor (CMOS technology for verification with a chip size of 6.61 mm2, while the power consumption is 56 mW from a 5-V power supply. The measured integral non-linearity (INL is −0.79–0.95 LSB while the differential non-linearity (DNL is −0.68–0.72 LSB. The effective number of bits (ENOB of the designed ADC is validated as 10.86 for converting the input analog signal to digital counterparts. Experimental validation was conducted. A digital decoder is orchestrated to decipher the harmonic outputs from the ADC via interpolation to the position of the moving stage. It was found that the displacement

  1. Preservation of forest wood chips

    Energy Technology Data Exchange (ETDEWEB)

    Kofman, P.D.; Thomsen, I.M.; Ohlsson, C.; Leer, E.; Ravn Schmidt, E.; Soerensen, M.; Knudsen, P.

    1999-01-01

    As part of the Danish Energy Research Programme on biomass utilisation for energy production (EFP), this project concerns problems connected to the handling and storing of wood chips. In this project, the possibility of preserving wood chips of the Norway Spruce (Picea Abies) is addressed, and the potential improvements by anaerobic storage are tested. Preservation of wood chips aims at reducing dry matter losses from extensive heating during storage and to reduce production of fungal spores. Fungal spores pose a health hazards to workers handling the chips. Further the producers of wood chips are interested in such a method since it would enable them to give a guarantee for the delivery of homogeneous wood chips also during the winter period. Three different types of wood chips were stored airtight and further one of these was stored in accordance with normal practise and use as reference. The results showed that airtight storage had a beneficial impact on the quality of the chips: no redistribution of moisture, low dry matter losses, unfavourable conditions for microbial activity of most fungi, and the promotion of yeasts instead of fungi with airborne spores. Likewise the firing tests showed that no combustion problems, and no increased risk to the environment or to the health of staff is caused by anaerobic storage of wood chips. In all, the tests of the anaerobic storage method of forest wood chips were a success and a large-scale test of the method will be carried out in 1999. (au)

  2. Water saving in IC wafer washing process; IC wafer senjo deno sessui taisaku

    Energy Technology Data Exchange (ETDEWEB)

    Harada, H. [Mitsubishi Corp., Tokyo (Japan); Araki, M.; Nakazawa, T.

    1997-11-30

    This paper reports features of a wafer washing technology, a new IC wafer washing process, its pure water saving effect, and a `QC washing` which has pure water saving effect in the wafer washing. Wafer washing processes generally include the SC1 process (using ammonia + hydrogen peroxide aqueous solution) purposed for removing contamination due to ultrafine particles, the SC2 process (using hydrochloric acid + hydrogen peroxide aqueous solution) purposed for removing contamination due to heavy metals, the piranha washing process (using hot sulfuric acid + hydrogen peroxide aqueous solution) purposed for removing contamination due to organic matters, and the DHF (using dilute hydrofluoric acid) purposed for removing natural oxide films. Natural oxide films are now remained as surface protection films, by which surface contamination has been reduced remarkably. A high-temperature washing chemical circulating and filtering technology developed in Japan has brought about a reform in wafer washing processes having been used previously. Spin washing is used as a water saving measure, in which washing chemicals or pure water are sprayed onto one each of wafers which is spin-rotated, allowing washing and rinsing to be made with small amount of washing chemicals and pure water. The QC washing is a method to replace tank interior with pure was as quick as possible in order to increase the rinsing effect. 7 refs., 5 figs.

  3. Amdahl 470 Chip Package

    CERN Multimedia

    1975-01-01

    In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

  4. Silicon Chip-to-Chip Mode-Division Multiplexing

    DEFF Research Database (Denmark)

    Baumann, Jan Markus; Porto da Silva, Edson; Ding, Yunhong

    2018-01-01

    A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes.......A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes....

  5. Chipping operations and efficiency in different operational environments

    Energy Technology Data Exchange (ETDEWEB)

    Roeser, D.; Mola-Yudego, B.; Prinz, R.; Emer, B.; Sikanen, L., e-mail: dominik.roser@metla.fi

    2012-11-01

    This research analyses the productivity of energy wood chipping operations at several sites in Austria and Finland. The aim of the work is to examine the differences in productivity and the effects of the operational environment for the chipping of bioenergy at the roadside. Furthermore, the study quantifies the effects of different variables such as forest energy assortments, tree species, sieve size and machines on the overall productivity of chipping. The results revealed that there are significant differences in the chipping productivity in Austria and Finland which are largely based on the use of different sieve sizes. Furthermore, the different operational environments in both countries, as well as the characteristics of the raw material also seem to have an effect on productivity. In order to improve the chipping productivity, particularly in Central European conditions, all relevant stakeholders need to work jointly to find solutions that will allow a greater variation of chip size. Furthermore, in the future more consideration has to be given to the close interlinkage between the chipper, crane and grapple. As a result, investments costs can be optimized and operational costs and stress on the machines reduced. (orig.)

  6. Stress.

    Science.gov (United States)

    Chambers, David W

    2008-01-01

    We all experience stress as a regular, and sometimes damaging and sometimes useful, part of our daily lives. In our normal ups and downs, we have our share of exhaustion, despondency, and outrage--matched with their corresponding positive moods. But burnout and workaholism are different. They are chronic, dysfunctional, self-reinforcing, life-shortening habits. Dentists, nurses, teachers, ministers, social workers, and entertainers are especially susceptible to burnout; not because they are hard-working professionals (they tend to be), but because they are caring perfectionists who share control for the success of what they do with others and perform under the scrutiny of their colleagues (they tend to). Workaholics are also trapped in self-sealing cycles, but the elements are ever-receding visions of control and using constant activity as a barrier against facing reality. This essay explores the symptoms, mechanisms, causes, and successful coping strategies for burnout and workaholism. It also takes a look at the general stress response on the physiological level and at some of the damage American society inflicts on itself.

  7. The Search for Wolf-Rayet Stars in IC10

    Science.gov (United States)

    Tehrani, Katie; Crowther, Paul; Archer, Isabelle

    2017-11-01

    We present a deep imaging and spectroscopic survey of the Local Group starburst galaxy IC10 using Gemini North/GMOS to unveil the global Wolf-Rayet population. It has previously been suggested that for IC10 to follow the WC/WN versus metallicity dependence seen in other Local Group galaxies, a large WN population must remain undiscovered. Our search revealed 3 new WN stars, and 5 candidates awaiting confirmation, providing little evidence to support this claim. We also compute an updated nebular derived metallicity of log(O/H)+12=8.40 +/- 0.04 for the galaxy using the direct method. Inspection of IC10 WR average line luminosities show these stars are more similar to their LMC, rather than SMC counterparts.

  8. Considerations in applying on-line IC techniques to BWR's

    International Nuclear Information System (INIS)

    Kaleda, R.J.

    1992-01-01

    Ion-Chromatography (IC) has moved from its traditional role as a laboratory analytical tool to a real time, dynamic, on-line measurement device to follow ppb and sub-ppb concentrations of deleterious impurities in nuclear power plants. Electric Power Research Institute (EPRI), individual utilities, and industry all have played significant roles in effecting the transition. This paper highlights considerations and the evolution in current on-line Ion Chromatography systems. The first applications of on-line techniques were demonstrated by General Electric (GE) under EPRI sponsorship at Rancho Seco (1980), Calvert Cliffs, and McGuire nuclear units. The primary use was for diagnostic purposes. Today the on-line IC applications have been expanded to include process control and routine plant monitoring. Current on-line IC's are innovative in design, promote operational simplicity, are modular for simplified maintenance and repair, and use field-proven components which enhance reliability. Conductivity detection with electronic or chemical suppression and spectrometric detection techniques are intermixed in applications. Remote multi-point sample systems have addressed memory effects. Early applications measured ionic species in the part per billion range. Today reliable part per trillion measurements are common for on-line systems. Current systems are meeting the challenge of EPRI guideline requirements. Today's on-line IC's, with programmed sampling systems, monitor fluid streams throughout a power plant, supplying data that can be trended, stored and retrieved easily. The on-line IC has come of age. Many technical challenges were overcome to achieve today's IC

  9. Use of advanced commercial ICs (COTS) for space application

    International Nuclear Information System (INIS)

    Strobel, D.J.; Czajkowski, D.R.; Layton, P.; Shanken, S.

    1999-01-01

    A product line of space-qualified radiation-tolerant ICs based on a high-volume commercial-off-the-shelf (COTS) silicon has been developed. The basic results from over 300 lots of COTS silicon, assembled and screened to Class B and Class S requirements will be presented. Intelligent use of commercial ICs engineered to improve radiation performance, is effective in introducing advanced technology to new satellite systems. Space Electronics has introduced over 125 space-qualified microelectronics standard products, that are used on over 90 space projects. (authors)

  10. Transient SEU characterization of analog IC's for ESA's satellite

    International Nuclear Information System (INIS)

    Harboe-Soerensen, R.; Van Dooren, J.; Guerre, F.X.; Constans, H.; Berger, G.; Hajdas, W.

    1999-01-01

    Data analysis of four self switch-off power supply events in the SOHO satellite pointed strongly in the direction of being Cosmic Ray or Proton induced. Further analysis of the relevant power supply schematics identified a number of analog IC's capable of causing or contributing to such events. This paper concentrates on the testing aspects of these analog IC's and presents the results of a Single Event Effects (SEEs) test program. Ground testing, simulating the flight conditions, were carried out at both heavy ion and proton accelerators. (authors)

  11. Extreme low-power mixed signal IC design

    CERN Document Server

    Tajalli, Armin

    2010-01-01

    This book describes a completely novel class of techniques for designing ultra-low-power integrated circuits (ICs). In many applications such as battery operated systems and battery-less (energy-scavenging) systems, power dissipation is a critical parameter. As a result, there is a growing demand for reducing the power (energy) consumption in ICs to extremely low levels, not achievable by using classical ""subthreshold CMOS"" techniques. This book introduces a new family of ""subthreshold circuits"" called ""source-coupled circuits"". This family of circuits can be used for implementing digita

  12. On-Chip Sensing of Thermoelectric Thin Film’s Merit

    OpenAIRE

    Xiao, Zhigang; Zhu, Xiaoshan

    2015-01-01

    Thermoelectric thin films have been widely explored for thermal-to-electrical energy conversion or solid-state cooling, because they can remove heat from integrated circuit (IC) chips or micro-electromechanical systems (MEMS) devices without involving any moving mechanical parts. In this paper, we report using silicon diode-based temperature sensors and specific thermoelectric devices to characterize the merit of thermoelectric thin films. The silicon diode temperature sensors and thermoelect...

  13. Experiment list: SRX122496 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available || chip antibody=Rel || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip ant...ibody catalog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc

  14. Materials and integration schemes for above-IC integrated optics

    NARCIS (Netherlands)

    Schmitz, Jurriaan; Rangarajan, B.; Kovalgin, Alexeij Y.

    2014-01-01

    A study is presented on silicon oxynitride material for waveguides and germanium-silicon alloys for p-i-n diodes. The materials are manufactured at low, CMOS-backend compatible temperatures, targeting the integration of optical functions on top of CMOS chips. Low-temperature germanium-silicon

  15. El contenido de los mensajes icónicos: El discurso icónico como totalidad (2)

    OpenAIRE

    Dr. Raymond Colle

    1999-01-01

    En el capítulo anterior, hemos hablado de los códigos icónicos de modo general, por cuanto tienen algunas características comunes, en particular el uso de figuras como factores de los significantes. Sin embargo, como lo hemos señalado al final, no todos se construyen ni articulan de la misma manera. Tal como las lenguas son muchas y los códigos lingüísticos se rigen por diferentes reglas -aunque sobre la base de fonemas unidos secuencialmente-, los códigos icónicos son también variados y regi...

  16. Chips with everything

    CERN Document Server

    CERN. Geneva

    2007-01-01

    In March 1972, Sir Robin Saxby gave a talk to the Royal Television Society called 'TV and Chips' about a 'state of the art' integrated circuit, containing 50 resistors and 50 transistors. Today's 'state of the art' chips contain up to a billion transistors. This enormous leap forward illustrates how dramatically the semiconductor industry has evolved in the past 34 years. The next 10 years are predicted to bring times of turbulent change for the industry, as more and more digital devices are used around the world. In this talk, Sir Robin will discuss the history of the Microchip Industry in parallel with ARM's history, demonstrating how a small European start-up can become a world player in the IT sector. He will also present his vision of important applications and developments in the next 20 years that are likely to become even more pervasive than the mobile phone is today, and will provide anecdotes and learning points from his own experience at ARM. About ARM: Sir Robin and a group of designers from Acorn...

  17. Performance of Naturally Aspirating IC Engines Operating at High ...

    African Journals Online (AJOL)

    The loss of power and the increase of fuel consumption of naturally aspirating IC engines operating with low atmospheric pressure at high altitude as well as changes in the mixture quality with non adapting mixture formation systems are principally known. Other effects like the additional advance of ignition timing in petrol ...

  18. Measures of interaction contrast (biological interaction) - ic, ici and icp

    DEFF Research Database (Denmark)

    2015-01-01

    in Hosmer & Lemeshow (1992) and Alfredsson et all (2005) purely in Stata.These two sources however both uses odds ratios as approximations for relational risks. This code on the other hand opens up for using proper estimates of relational risks. To install type "ssc install ic" in the Stata command...

  19. Analog IC Design at the University of Twente

    NARCIS (Netherlands)

    Nauta, Bram

    2007-01-01

    This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands. Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we

  20. 30 CFR 57.22102 - Smoking (I-C mines).

    Science.gov (United States)

    2010-07-01

    ... Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL MINE SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-UNDERGROUND METAL AND NONMETAL MINES Safety Standards for Methane in Metal and Nonmetal Mines Fire Prevention and Control § 57.22102 Smoking (I-C mines). (a...

  1. IC 3475: A stripped dwarf galaxy in the Virgo cluster

    International Nuclear Information System (INIS)

    Vigroux, L.; Thuan, T.X.; Vader, J.P.; Lachieze-Rey, M.

    1986-01-01

    We have obtained B and R CCD and H I observations of the Virgo dwarf galaxy IC 3475. The galaxy is remarkable for its very large diameter (approx.10 kpc for a Virgo distance modulus of 31) and is comparable in size to the large dwarfs discussed by Sandage and Binggeli. Its light profile is best fitted by an exponential law, characteristic of a dwarf Magellanic irregular galaxy. It possesses a central bar with many knots and inclusions concentrated toward the center of the galaxy. These knots and inclusions have the same color (B-Rapprox.1.5) as the rest of the galaxy and are best explained as intermediate-age (1--7 x 10 9 yr) star clusters such as those found in the Magellanic Clouds. Despite possessing the photometric structure of a dwarf Magellanic irregular galaxy, IC 3475 contains less than 5.3 x 10 6 M/sub sun/ of neutral hydrogen. Its hydrogen mass to blue light ratio is less than 0.01, approx.60 times less than the mean value observed for dwarf Magellanic irregulars. It is most likely that IC 3475, which is located near the core of the Virgo cluster, is a stripped dwarf galaxy. The very large size of the galaxy (its diameter is approx.1.8 times larger than that of ''normal'' dwarfs) appears to rule out evolution of IC 3475 from a normal dwarf irregular or to a normal dwarf elliptical

  2. Computer modeling of magnetic structure for IC-35 cyclotron

    International Nuclear Information System (INIS)

    Alenitskij, Yu.G.; Morozov, N.A.

    1998-01-01

    An extensive series of calculations has been carried out in order to design the magnetic structure of the IC-35 cyclotron for radioisotope production. The calculations were carried out by 2-D POISCR code. The average magnetic field and its variation were produced with the help of two different calculation models. The parameters of the cyclotron magnetic system are presented

  3. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  4. A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

    Directory of Open Access Journals (Sweden)

    Chang-Hung Lee

    2014-05-01

    Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  5. A low-power integrated humidity CMOS sensor by printing-on-chip technology.

    Science.gov (United States)

    Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

    2014-05-23

    A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  6. 3D-SoftChip: A Novel Architecture for Next-Generation Adaptive Computing Systems

    Directory of Open Access Journals (Sweden)

    Lee Mike Myung-Ok

    2006-01-01

    Full Text Available This paper introduces a novel architecture for next-generation adaptive computing systems, which we term 3D-SoftChip. The 3D-SoftChip is a 3-dimensional (3D vertically integrated adaptive computing system combining state-of-the-art processing and 3D interconnection technology. It comprises the vertical integration of two chips (a configurable array processor and an intelligent configurable switch through an indium bump interconnection array (IBIA. The configurable array processor (CAP is an array of heterogeneous processing elements (PEs, while the intelligent configurable switch (ICS comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer, along with a direct memory access (DMA controller. This paper introduces the novel 3D-SoftChip architecture for real-time communication and multimedia signal processing as a next-generation computing system. The paper further describes the advanced HW/SW codesign and verification methodology, including high-level system modeling of the 3D-SoftChip using SystemC, being used to determine the optimum hardware specification in the early design stage.

  7. 3D stacked chips from emerging processes to heterogeneous systems

    CERN Document Server

    Fettweis, Gerhard

    2016-01-01

    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D I...

  8. K/sub Ic/ and J/sub Ic/ of Westerly granite: effects of thickness and in-plane dimensions

    International Nuclear Information System (INIS)

    Schmidt, R.A.; Lutz, T.J.

    1978-01-01

    An investigation is described in which tensile properties, fracture toughness, and critical J integral are measured for Westerly granite, a rock that is widely used in rock mechanics studies. This was primarily a parameter sensitivity study in which the effects of specimen dimensions and testing techniques were assessed. It is hoped that this study will aid in establishing tentative standards and guidelines for fracture toughness testing of rock as well as indicate the feasibility of using a J integral fracture criterion for this material. ASTM standard specimen configurations of the compact and bend types were tested with compact specimens ranging in width from W = 25.4 mm to W = 406.4 mm (0.5T to 8T) and with thickness ranging from 13 mm to 100 mm. A series of 4T compact specimens were tested to assess the effects of thickness and fatigue precracking. Techniques are described that enable several values of K/sub Ic/, a complete J vs crack growth curve, and a J/sub Ic/ value to be obtained from each sample. Direct-pull tension tests on shaped specimens of Westerly granite are described which indicate a high degree of nonlinear, inelastic behavior. This fact raises questions about the use of LEFM, but the J/sub Ic/ data presented appear to validate the K/sub Ic/ measurements

  9. Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.

    Science.gov (United States)

    Li, Lin; Yin, Heyu; Mason, Andrew J

    2018-04-01

    The integration of biosensors, microfluidics, and CMOS instrumentation provides a compact lab-on-CMOS microsystem well suited for high throughput measurement. This paper describes a new epoxy chip-in-carrier integration process and two planar metalization techniques for lab-on-CMOS that enable on-CMOS electrochemical measurement with multichannel microfluidics. Several design approaches with different fabrication steps and materials were experimentally analyzed to identify an ideal process that can achieve desired capability with high yield and low material and tool cost. On-chip electrochemical measurements of the integrated assembly were performed to verify the functionality of the chip-in-carrier packaging and its capability for microfluidic integration. The newly developed CMOS-compatible epoxy chip-in-carrier process paves the way for full implementation of many lab-on-CMOS applications with CMOS ICs as core electronic instruments.

  10. Pelly Crossing wood chip boiler

    Energy Technology Data Exchange (ETDEWEB)

    1985-03-11

    The Pelly wood chip project has demonstrated that wood chips are a successful fuel for space and domestic water heating in a northern climate. Pelly Crossing was chosen as a demonstration site for the following reasons: its extreme temperatures, an abundant local supply of resource material, the high cost of fuel oil heating and a lack of local employment. The major obstacle to the smooth operation of the boiler system was the poor quality of the chip supply. The production of poor quality chips has been caused by inadequate operation and maintenance of the chipper. Dull knives and faulty anvil adjustments produced chips and splinters far in excess of the one centimetre size specified for the system's design. Unanticipated complications have caused costs of the system to be higher than expected by approximately $15,000. The actual cost of the project was approximately $165,000. The first year of the system's operation was expected to accrue $11,600 in heating cost savings. This estimate was impossible to confirm given the system's irregular operation and incremental costs. Consistent operation of the system for a period of at least one year plus the installation of monitoring devices will allow the cost effectiveness to be calculated. The wood chip system's impact on the environment was estimated to be minimal. Wood chip burning was considered cleaner and safer than cordwood burning. 9 refs., 6 figs., 6 tabs.

  11. Single chip camera active pixel sensor

    Science.gov (United States)

    Shaw, Timothy (Inventor); Pain, Bedabrata (Inventor); Olson, Brita (Inventor); Nixon, Robert H. (Inventor); Fossum, Eric R. (Inventor); Panicacci, Roger A. (Inventor); Mansoorian, Barmak (Inventor)

    2003-01-01

    A totally digital single chip camera includes communications to operate most of its structure in serial communication mode. The digital single chip camera include a D/A converter for converting an input digital word into an analog reference signal. The chip includes all of the necessary circuitry for operating the chip using a single pin.

  12. Ultra-thin chip technology and applications

    CERN Document Server

    2010-01-01

    Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

  13. NEPP Evaluation of Automotive Grade Tantalum Chip Capacitors

    Science.gov (United States)

    Sampson, Mike; Brusse, Jay

    2018-01-01

    Automotive grade tantalum (Ta) chip capacitors are available at lower cost with smaller physical size and higher volumetric efficiency compared to military/space grade capacitors. Designers of high reliability aerospace and military systems would like to take advantage of these attributes while maintaining the high standards for long-term reliable operation they are accustomed to when selecting military-qualified established reliability tantalum chip capacitors (e.g., MIL-PRF-55365). The objective for this evaluation was to assess the long-term performance of off-the-shelf automotive grade Ta chip capacitors (i.e., manufacturer self-qualified per AEC Q-200). Two (2) lots of case size D manganese dioxide (MnO2) cathode Ta chip capacitors from 1 manufacturer were evaluated. The evaluation consisted of construction analysis, basic electrical parameter characterization, extended long-term (2000 hours) life testing and some accelerated stress testing. Tests and acceptance criteria were based upon manufacturer datasheets and the Automotive Electronics Council's AEC Q-200 qualification specification for passive electronic components. As-received a few capacitors were marginally above the specified tolerance for capacitance and ESR. X-ray inspection found that the anodes for some devices may not be properly aligned within the molded encapsulation leaving less than 1 mil thickness of the encapsulation. This evaluation found that the long-term life performance of automotive grade Ta chip capacitors is generally within specification limits suggesting these capacitors may be suitable for some space applications.

  14. Precracking of WC-Co-hardmetal-specimens for fracture-toughness testing. Anrisserzeugung in WC-Co-Hartmetall-Proben fuer die Messung des kritischen Spannungsintensitaetsfaktors K sub IC

    Energy Technology Data Exchange (ETDEWEB)

    Wissmeier, H.J.; Engel, U. (Erlangen-Nuernberg Univ., Erlangen (Germany, F.R.). Lehrstuhl fuer Fertigungstechnologie)

    1989-09-01

    The determination of a valid critical stress intensity factor K{sub IC} requires an extremely sharp, well defined initial crack. Methods producing such a crack are well known for metallic materials, but they often can not be used with brittle materials, like cemented carbides or ceramics. Their low fracture toughness makes a controlled crack growth under pure tensile stress nearly impossible. More useful are precracking methods, utilizing a stress gradient to stop the crack at defined depth. A very simple method uses the indentation of a hardness tester to produce a semi-elliptical surface crack, interfered with residual stresses. For different areas of application and specimen geometries, bridge indentation, wedge indentation and composite bending method produce cracks with a straight front. Also under cyclic loading, under tensile as well as under compressive stress, the creation of a sharp precrack, applicable in K{sub IC} measurement, is possible. (orig.).

  15. Shocked molecular hydrogen in the supernova remnant IC 443

    International Nuclear Information System (INIS)

    Burton, M.G.; Brand, P.W.J.L.; Webster, A.S.

    1988-01-01

    Emission from the υ = 1-0 S(1) line of molecular hydrogen has been mapped over a section of the supernova remnant IC 443. The emission originates in a sinuous ridge where the expanding shell of the SNR is interacting with a molecular cloud. The relative intensities of the 1-0 S(1), 1-0 S(0) and 2-1 S(1) lines at 2.1-2.2 μm were measured and found to be characteristic of shock-excitation of the gas. The ridge shows bright spots which are possibly density enhancements in the molecular cloud. The total luminosity of the molecular hydrogen lines in the mapped region is estimated to be about 1000 times the solar luminosity, making IC 443 one of the most luminous galactic molecular hydrogen sources yet detected. (author)

  16. Some new results on shock chemistry in IC 443

    International Nuclear Information System (INIS)

    DeNoyer, L.K.; Frerking, M.A.

    1981-01-01

    We have made new observations of CO, 13 CO, SiO, SO, H 2 CO, HCO + , N 2 H + , CS, OCS, HCN, and OH in the shocked clouds of IC 443. At position IC 443 B, we find (a) the shocked CO is optically thin, (b) the HCO + /CO abundance ratio is 4--9 x 10 -4 , a tenfold enhancement over normal interstellar clouds, (c) HCN/CO = 1--3 x 10 -4 and CS/CO = 2--3 x 10 -4 , consistent with abundances found in ordinary clouds, (d) no enhancements of SO or SiO as occur in Orion KL, (e) optically thin preshock OH, confirming a hundredfold enhancement of OH/CO in the shock, and (f) an OH main line anomaly, with T/sub ex/(1667)>T/sub ex/(1665) in the shocked region

  17. STAR FORMATION ASSOCIATED WITH THE SUPERNOVA REMNANT IC443

    International Nuclear Information System (INIS)

    Xu Jinlong; Wang Junjie; Miller, Martin

    2011-01-01

    We have performed submillimeter and millimeter observations in CO lines toward supernova remnant (SNR) IC443. The CO molecular shell coincides well with the partial shell of the SNR detected in radio continuum observations. Broad emission lines and three 1720 MHz OH masers were detected in the CO molecular shell. The present observations have provided further evidence in support of the interaction between the SNR and the adjoining molecular clouds (MCs). The total mass of the MCs is 9.26 x 10 3 M sun . The integrated CO line intensity ratio (R I CO(3-2) /I CO(2-1) ) for the whole MC is between 0.79 and 3.40. The average value is 1.58, which is much higher than previous measurements of individual Galactic MCs. Higher line ratios imply that shocks have driven into the MCs. We conclude that high R I CO(3-2) /I CO(2-1) is identified as a good signature of the SNR-MC interacting system. Based on the IRAS Point Source Catalog and the Two Micron All Sky Survey near-infrared database, 12 protostellar object and 1666 young stellar object (YSO) candidates (including 154 classical T Tauri stars and 419 Herbig Ae/Be stars) are selected. In the interacting regions, the significant enhancement of the number of protostellar objects and YSOs indicates the presence of some recently formed stars. After comparing the characteristic timescales of star formation with the age of IC443, we conclude that the protostellar objects and YSO candidates are not triggered by IC443. For the age of the stellar winds shell, we have performed our calculation on the basis of a stellar wind shell expansion model. The results and analysis suggest that the formation of these stars may be triggered by the stellar winds of the IC443 progenitor.

  18. Droplet-Wall/Film Impact in IC Engine Applications

    Science.gov (United States)

    2017-08-14

    Report: Droplet-Wall/ Film Impact in IC Engine Applications (ARO Topic 1.4.1 under ARO’s Dr. Ralph A. Anthenien) The views, opinions and/or findings...Participants: RPPR Final Report as of 12-Oct-2017 Agreement Number: W911NF-16-1-0449 Organization: Princeton University Title: Droplet-Wall/ Film Impact...droplets impacting a wet surface under various film thickness, which plays a critical role in controlling the efficiency of applications such as those

  19. The unusual kinematics of the galaxy IC 10

    International Nuclear Information System (INIS)

    Cohen, R.J.

    1979-01-01

    Observations of neutral hydrogen emission from the galaxy IC 10 show a large outer envelope of gas more than 1 0 in extent. The emission has a velocity gradient along the major axis in the opposite sense to that of the central concentration mapped by Shostak. This unusual velocity reversal can be interpreted in terms of a warped gas-layer in normal rotation and seen face-on. (author)

  20. Improved CVD Techniques for Depositing Passivation Layers of ICs

    Science.gov (United States)

    1975-10-01

    Halted PhilcoT xong, 43 o Flex b ru.an I ery t92." PrutptEnt,"e Electro nic -News; p. 34 --(M a~y 20, 1974). 355. 4t3fAtil, No 2(estbgru sey SpesHg-o e...and No. 4, 78 (1974). *J. G. Biddle Co., Plymouth Meeting, PA 19462. 222 NARROW AND WIDE INTERFERENCE CONTOUR 2 4 6 IC PE LLET Bonding pad oxide area

  1. IC modelling in the IRSN EPR level 1 PSA

    International Nuclear Information System (INIS)

    Delache, J.

    2012-01-01

    Today in France, an EPR (European Pressurized Water Reactor) Unit is under construction at the Flamanville site. The creation authorization was granted in April 2007 and the plant commissioning is planned for 2012. The plant operator (EDF) provided for the construction license several PSA (Probabilistic Safety Assessment) studies. IRSN, as TSO (Technical Safety Organisation), wishes to dispose of the appropriate knowledge and tools for the independent verification of the operator studies and so developed its own model of PSA level 1. The goal is not to rebuild the plant operator PSA (with a full scope...) but to dispose of a simplified model able to clearly point out specific important issues. In the IRSN model a particular effort has recently been done on the Digital IC modelling. The IC (Instrumentation and Control) is modelled in the IRSN EPR PSA by using Fault Trees. Instead, EDF EPR PSA applies the COMPACT model to simplify the command and instrumentation logics. The IRSN model is more detailed in order to be more accurate in the global analysis of the Digital IC. For instance the communication ways between automates are considered as well as the failure of support systems. The model is still under development mainly in order to define the CCF (Common Cause Failure) which may be considered. (authors)

  2. Protecting ICS Systems Within the Energy Sector from Cyber Attacks

    Science.gov (United States)

    Barnes, Shaquille

    Advance persistent threat (APT) groups are continuing to attack the energy sector through cyberspace, which poses a risk to our society, national security, and economy. Industrial control systems (ICSs) are not designed to handle cyber-attacks, which is why asset owners need to implement the correct proactive and reactive measures to mitigate the risk to their ICS environments. The Industrial Control Systems Cyber Emergency Response Team (ICS-CERT) responded to 290 incidents for fiscal year 2016, where 59 of those incidents came from the Energy Sector. APT groups know how vulnerable energy sector ICS systems are and the destruction they can cause when they go offline such as loss of production, loss of life, and economic impact. Defending against APT groups requires more than just passive controls such as firewalls and antivirus solutions. Asset owners should implement a combination of best practices and active defense in their environment to defend against APT groups. Cyber-attacks against critical infrastructure will become more complex and harder to detect and respond to with traditional security controls. The purpose of this paper was to provide asset owners with the correct security controls and methodologies to help defend against APT groups.

  3. AGB stars as tracers to IC 1613 evolution.

    Science.gov (United States)

    Hashemi, S. A.; Javadi, A.; van Loon, J. Th.

    We are going to apply AGB stars to find star formation history for IC 1613 galaxy; this a new and simple method that works well for nearby galaxies. IC 1613 is a Local Group dwarf irregular galaxy that is located at distance of 750 kpc, a gas rich and isolated dwarf galaxy that has a low foreground extinction. We use the long period variable stars (LPVs) that represent the very final stage of evolution of stars with low and intermediate mass at the AGB phase and are very luminous and cool so that they emit maximum brightness in near-infrared bands. Thus near-infrared photometry with using stellar evolutionary models help us to convert brightness to birth mass and age and from this drive star formation history of the galaxy. We will use the luminosity distribution of the LPVs to reconstruct the star formation history-a method we have successfully applied in other Local Group galaxies. Our analysis shows that the IC 1613 has had a nearly constant star formation rate, without any dominant star formation episode.

  4. Electronic States of IC60BA and PC71BM

    International Nuclear Information System (INIS)

    Sheng Chun-Qi; Wang Peng; Shen Ying; Li Wen-Jie; Li Hong-Nian; Zhang Wen-Hua; Zhu Jun-Fa; Lai Guo-Qiao

    2013-01-01

    We investigate the electronic states of IC 60 BA and PC 71 BM using first-principles calculations and photoelectron spectroscopy (PES) measurements. The energy level structures for all possible isomers are reported and compared with those of C 60 , C 70 and PC 61 BM. The attachment of the side chains can raise the LUMO energies and decrease the HOMO-LUMO gaps, and thus helps to increase the power-conversion efficiency of bulk heterojunction solar cells. In the PES studies, we prepared IC 60 BA and PC 71 BM films on Si:H(111) substrates to construct adsorbate/substrate interfaces describable with the integer charge-transfer (ICT) model. Successful measurements then revealed that one of the most important material properties for an electron acceptor, the energy of the negative integer charge-transfer state (E ICT− ), is 4.31 eV below the vacuum level for PC 71 BM. The E ICT− of IC 60 BA is smaller than 4.14 eV

  5. INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP

    Directory of Open Access Journals (Sweden)

    T. A. Ismailov

    2014-01-01

    Full Text Available The article considers the to enhance the efficiency the thermoelectric heat pump by making the branches of semiconductor p- and n-type as nanofilms and creating conditions for the emergence of additional thermoeffect between the hot and cold junctions of dissimilar metals that will create a more efficient heat pumps with small dimensions.

  6. Tunable on chip optofluidic laser

    DEFF Research Database (Denmark)

    Bakal, Avraham; Vannahme, Christoph; Kristensen, Anders

    2016-01-01

    On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range.......On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range....

  7. Moving from irrelevant intellectual capital (IC) reporting to value-relevant IC disclosures: key learning points from the Danish experience

    DEFF Research Database (Denmark)

    Schaper, Stefan; Nielsen, Christian; Roslender, Robin

    2017-01-01

    , largely informed by an accounting perspective, towards IC-related disclosures. Design/methodology/approach – The paper draws on data obtained from 21 semi-structured interviews with respondents in 16 companies. The respondents were contacted following a genealogical exercise carried out on the 102...... with a recognised reporting vehicle such as the annual report, were also encountered. Research limitations/implications – The implications of this study are that timely, value-relevant IC disclosures and compliant reporting, primarily for accountability purposes, have the potential to coexist. In addition...... to the usual limitations of a semi-structured interview research design, respondents’ difficulties in clearly recalling events during the project after some 10-12 years is a further potential limitation. Additionally, the use of internet-based communication channels for disclosure purposes was in its infancy...

  8. Dynamical Competition of IC-Industry Clustering from Taiwan to China

    Science.gov (United States)

    Tsai, Bi-Huei; Tsai, Kuo-Hui

    2009-08-01

    Most studies employ qualitative approach to explore the industrial clusters; however, few research has objectively quantified the evolutions of industry clustering. The purpose of this paper is to quantitatively analyze clustering among IC design, IC manufacturing as well as IC packaging and testing industries by using the foreign direct investment (FDI) data. The Lotka-Volterra system equations are first adopted here to capture the competition or cooperation among such three industries, thus explaining their clustering inclinations. The results indicate that the evolution of FDI into China for IC design industry significantly inspire the subsequent FDI of IC manufacturing as well as IC packaging and testing industries. Since IC design industry lie in the upstream stage of IC production, the middle-stream IC manufacturing and downstream IC packing and testing enterprises tend to cluster together with IC design firms, in order to sustain a steady business. Finally, Taiwan IC industry's FDI amount into China is predicted to cumulatively increase, which supports the industrial clustering tendency for Taiwan IC industry. Particularly, the FDI prediction of Lotka-Volterra model performs superior to that of the conventional Bass model after the forecast accuracy of these two models are compared. The prediction ability is dramatically improved as the industrial mutualism among each IC production stage is taken into account.

  9. Microfluidic organ-on-chip technology for blood-brain barrier research.

    Science.gov (United States)

    van der Helm, Marinke W; van der Meer, Andries D; Eijkel, Jan C T; van den Berg, Albert; Segerink, Loes I

    2016-01-01

    Organs-on-chips are a new class of microengineered laboratory models that combine several of the advantages of current in vivo and in vitro models. In this review, we summarize the advances that have been made in the development of organ-on-chip models of the blood-brain barrier (BBBs-on-chips) and the challenges that are still ahead. The BBB is formed by specialized endothelial cells and separates blood from brain tissue. It protects the brain from harmful compounds from the blood and provides homeostasis for optimal neuronal function [corrected]. Studying BBB function and dysfunction is important for drug development and biomedical research. Microfluidic BBBs-on-chips enable real-time study of (human) cells in an engineered physiological microenvironment, for example incorporating small geometries and fluid flow as well as sensors. Examples of BBBs-on-chips in literature already show the potential of more realistic microenvironments and the study of organ-level functions. A key challenge in the field of BBB-on-chip development is the current lack of standardized quantification of parameters such as barrier permeability and shear stress. This limits the potential for direct comparison of the performance of different BBB-on-chip models to each other and existing models. We give recommendations for further standardization in model characterization and conclude that the rapidly emerging field of BBB-on-chip models holds great promise for further studies in BBB biology and drug development.

  10. Implantable Biomedical Signal Monitoring Using RF Energy Harvestingand On-Chip Antenna

    Directory of Open Access Journals (Sweden)

    Jiann-Shiun Yuan

    2015-08-01

    Full Text Available This paper presents the design of an energy harvesting wireless and battery-less silicon-on-chip (SoC device that can be implanted in the human body to monitor certain health conditions. The proposed architecture has been designed on TSMC 0.18μm CMOS ICs and is an integrated system with a rectenna (antenna and rectifier and transmitting circuit, all on a single chip powered by an external transmitter and that is small enough to be inserted in the human eye, heart or brain. The transmitting and receiving antennas operate in the 5.8- GHz ISM band and have a -10dB gain. The distinguishing feature of this design is the rectenna that comprises of a singlestage diode connected NMOS rectifier and a 3-D on-chip antenna that occupies only 2.5 × 1 × 2.8 mm3 of chip area and has the ability to communicate within proximity of 5 cm while giving 10% efficiency. The external source is a reader that powers up the RF rectifier in the implantable chip triggering it to start sending data back to the reader enabling an efficient method of health evaluation for the patient.

  11. uvby and Hβ photometry of the open cluster IC 4996

    International Nuclear Information System (INIS)

    Alfaro, E.J.; Delgado, A.J.; Garcia-Pelayo, J.M.; Garrido, R.; Saez, M.

    1985-01-01

    Photoelectric uvby and Hβ observations have been obtained for 15 stars in the field of the open cluster IC 4996. An average colour excess of E(b-y)=0.473 is estimated for six observed members of the cluster, in good agreement with previous results. A comparison between the β-Msub(v) calibrations given by Crawford and by Eggen suggests that the first one takes better into account the evolutionary effects on the Hβ index. We have calculated a true distance modulus of 11.43 and an age of 7.5x10 6 years

  12. Integration of IC/EC systems in ITER

    International Nuclear Information System (INIS)

    Gassmann, T.; Beaumont, B.; Baruah, U.K.; Bonicelli, T.; Chiocchio, S.; Cox, D.; Darbos, C.; Decamps, H.; Denisov, G.; Henderson, M.; Kazarian, F.; Lamalle, P.U.; Mukherjee, A.; Rasmussen, D.; Saibene, G.; Sartori, R.; Sakamoto, K.; Tanga, A.

    2010-01-01

    The RF heating and current drive (H and CD) systems that are to be installed in ITER during the construction phase, are the electron cyclotron (EC) and ion cyclotron (IC) systems. They are complex assemblies of high voltage power supplies (HVPS), RF generators, transmission lines and antennas. Their design and integration are constrained by many interfaces, both internal, between the subsystems, and external, with the other ITER systems. In addition, some components must be compatible with a nuclear environment and are classified as Safety Important Component. This paper describes the processes implemented in ITER to ensure proper integration.

  13. Cache-aware network-on-chip for chip multiprocessors

    Science.gov (United States)

    Tatas, Konstantinos; Kyriacou, Costas; Dekoulis, George; Demetriou, Demetris; Avraam, Costas; Christou, Anastasia

    2009-05-01

    This paper presents the hardware prototype of a Network-on-Chip (NoC) for a chip multiprocessor that provides support for cache coherence, cache prefetching and cache-aware thread scheduling. A NoC with support to these cache related mechanisms can assist in improving systems performance by reducing the cache miss ratio. The presented multi-core system employs the Data-Driven Multithreading (DDM) model of execution. In DDM thread scheduling is done according to data availability, thus the system is aware of the threads to be executed in the near future. This characteristic of the DDM model allows for cache aware thread scheduling and cache prefetching. The NoC prototype is a crossbar switch with output buffering that can support a cache-aware 4-node chip multiprocessor. The prototype is built on the Xilinx ML506 board equipped with a Xilinx Virtex-5 FPGA.

  14. Atom chip gravimeter

    Science.gov (United States)

    Schubert, Christian; Abend, Sven; Gebbe, Martina; Gersemann, Matthias; Ahlers, Holger; Müntinga, Hauke; Matthias, Jonas; Sahelgozin, Maral; Herr, Waldemar; Lämmerzahl, Claus; Ertmer, Wolfgang; Rasel, Ernst

    2016-04-01

    Atom interferometry has developed into a tool for measuring rotations [1], accelerations [2], and testing fundamental physics [3]. Gravimeters based on laser cooled atoms demonstrated residual uncertainties of few microgal [2,4] and were simplified for field applications [5]. Atomic gravimeters rely on the interference of matter waves which are coherently manipulated by laser light fields. The latter can be interpreted as rulers to which the position of the atoms is compared. At three points in time separated by a free evolution, the light fields are pulsed onto the atoms. First, a coherent superposition of two momentum states is produced, then the momentum is inverted, and finally the two trajectories are recombined. Depending on the acceleration the atoms experienced, the number of atoms detected in the output ports will change. Consequently, the acceleration can be determined from the output signal. The laser cooled atoms with microkelvin temperatures used in state-of-the-art gravimeters impose limits on the accuracy [4]. Therefore, ultra-cold atoms generated by Bose-Einstein condensation and delta-kick collimation [6,7] are expected to be the key for further improvements. These sources suffered from a low flux implying an incompatible noise floor, but a competitive performance was demonstrated recently with atom chips [8]. In the compact and robust setup constructed for operation in the drop tower [6] we demonstrated all steps necessary for an atom chip gravimeter with Bose-Einstein condensates in a ground based operation. We will discuss the principle of operation, the current performance, and the perspectives to supersede the state of the art. The authors thank the QUANTUS cooperation for contributions to the drop tower project in the earlier stages. This work is supported by the German Space Agency (DLR) with funds provided by the Federal Ministry for Economic Affairs and Energy (BMWi) due to an enactment of the German Bundestag under grant numbers DLR 50WM

  15. Experiment list: SRX214075 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available age=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

  16. Experiment list: SRX122523 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Irf2 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

  17. Experiment list: SRX122414 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  18. Experiment list: SRX214071 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available Undifferentiated || treatment=Overexpress Sox2-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacturer 2=

  19. Experiment list: SRX214086 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available entiated || cell line=KH2 || chip antibody 1=none || chip antibody manufacturer 1=none || chip antibody 2=none || chip antibody manuf...acturer 2=none http://dbarchive.biosciencedbc.jp/kyushu-

  20. Experiment list: SRX122485 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100

  1. Experiment list: SRX122521 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Irf2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

  2. Experiment list: SRX122417 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  3. Experiment list: SRX122520 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Irf2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

  4. Experiment list: SRX122413 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Junb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http:/

  5. Experiment list: SRX122412 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Junb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http:/

  6. Experiment list: SRX122406 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Irf1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 http:/

  7. Experiment list: SRX122415 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  8. Experiment list: SRX214074 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ge=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

  9. Experiment list: SRX214072 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

  10. Experiment list: SRX214067 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available fferentiated || cell line=F9 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufacture...r 1=Santa Cruz || chip antibody 2=none || chip antibody manufacturer 2=none http://dbarchive.bioscien

  11. Experiment list: SRX122416 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  12. Experiment list: SRX122565 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat2 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 http:/

  13. Chip compacting press; Jido kirikuzu asshukuki

    Energy Technology Data Exchange (ETDEWEB)

    Oura, K. [Yuken Kogyo Co. Ltd., Kanagawa (Japan)

    1998-08-15

    The chips exhausted from various machine tools are massy, occupy much space and make working environment worse by staying added cutting oil to lower part. The chips are exhausted as a result of machining and have not constant quality. Even if used material is same the chips have various shapes and properties by kinds and machining methods of used machine tools, and are troublesome materials from a standpoint of their treatment. Pressing and solidification of the chips have frequently been tried. A chip compacting press introduced in this paper, a relatively cheap chip compacting press aimed for relatively small scale chip treatment, and has such characteristics and effects as follows. Chips are pressed and solidified by each raw material, so fractional management can be easily conducted. As casting metal chips and curled chips of iron and aluminum can be pressed to about 1/3 to 1/5 and about 1/40, respectively, space saving can be conducted. Chip compacting pressing upgrades its transporting efficiency to make possible to reduce its transporting cost. As chip solidification controls its oxidation and most cutting oil are removed, chips are easy to recycle. 2 figs., 1 tab.

  14. Instantaneous flywheel torque of IC engine grey-box identification

    Science.gov (United States)

    Milašinović, A.; Knežević, D.; Milovanović, Z.; Škundrić, J.

    2018-01-01

    In this paper a mathematical model developed for the identification of excitation torque acting on the IC engine flywheel is presented. The excitation torque gained through internal combustion of the fuel in the IC engine is transmitted from the flywheel to the transmission. The torque is not constant but variable and is a function of the crank angle. The verification of the mathematical model was done on a 4-cylinder 4-stroke diesel engine for which the in-cylinder pressure was measured in one cylinder and the instantaneous angular speed of the crankshaft at its free end. The research was conducted on a hydraulic engine brake. Inertial forces of all rotational parts, from flywheel to the turbine wheel of the engine brake, are acting on the flywheel due to the nonuniform motion of the flywheel. It is known from the theory of turbomachinery that the torque on the hydraulic brake is a quadratic function of angular speed. Due to that and the variable angular speed of the turbine wheel of the engine brake, the torque during one engine cycle is also variable. The motivation for this research was the idea (intention) to determine the instantaneous torque acting on the flywheel as a function of the crank angle with a mathematical model without any measuring and based on this to determine the quality of work of specific cylinders of the multi-cylinder engine. The crankshaft was considered elastic and also its torsional vibrations were taken into account.

  15. An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging.

    Science.gov (United States)

    Wygant, Ira O; Jamal, Nafis S; Lee, Hyunjoo J; Nikoozadeh, Amin; Oralkan, Omer; Karaman, Mustafa; Khuri-Yakub, Butrus T

    2009-10-01

    State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated properly timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (Bscans) of a latex heart phantom.

  16. STUDY OF CHIP IGNITION AND CHIP MORPHOLOGY AFTER MILLING OF MAGNESIUM ALLOYS

    Directory of Open Access Journals (Sweden)

    Ireneusz Zagórski

    2016-12-01

    Full Text Available The paper analyses the impact of specified technological parameters of milling (vc, fz, ap on time to ignition. Stages leading to chip ignition were analysed. Metallographic images of magnesium chip were presented. No significant difference was observed in time to ignition in different chip fractions. Moreover, the surface of chips was free of products of ignition and signs of strong oxidation.

  17. CMOS foveal image sensor chip

    Science.gov (United States)

    Bandera, Cesar (Inventor); Scott, Peter (Inventor); Sridhar, Ramalingam (Inventor); Xia, Shu (Inventor)

    2002-01-01

    A foveal image sensor integrated circuit comprising a plurality of CMOS active pixel sensors arranged both within and about a central fovea region of the chip. The pixels in the central fovea region have a smaller size than the pixels arranged in peripheral rings about the central region. A new photocharge normalization scheme and associated circuitry normalizes the output signals from the different size pixels in the array. The pixels are assembled into a multi-resolution rectilinear foveal image sensor chip using a novel access scheme to reduce the number of analog RAM cells needed. Localized spatial resolution declines monotonically with offset from the imager's optical axis, analogous to biological foveal vision.

  18. LSST camera readout chip ASPIC: test tools

    International Nuclear Information System (INIS)

    Antilogus, P; Bailly, Ph; Juramy, C; Lebbolo, H; Martin, D; Jeglot, J; Moniez, M; Tocut, V; Wicek, F

    2012-01-01

    The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

  19. LSST camera readout chip ASPIC: test tools

    Science.gov (United States)

    Antilogus, P.; Bailly, Ph; Jeglot, J.; Juramy, C.; Lebbolo, H.; Martin, D.; Moniez, M.; Tocut, V.; Wicek, F.

    2012-02-01

    The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

  20. Space division multiplexing chip-to-chip quantum key distribution

    DEFF Research Database (Denmark)

    Bacco, Davide; Ding, Yunhong; Dalgaard, Kjeld

    2017-01-01

    nodes of the quantum keys to their respective destinations. In this paper we present an experimental demonstration of a photonic integrated silicon chip quantum key distribution protocols based on space division multiplexing (SDM), through multicore fiber technology. Parallel and independent quantum...

  1. Iterative categorization (IC): a systematic technique for analysing qualitative data

    Science.gov (United States)

    2016-01-01

    Abstract The processes of analysing qualitative data, particularly the stage between coding and publication, are often vague and/or poorly explained within addiction science and research more broadly. A simple but rigorous and transparent technique for analysing qualitative textual data, developed within the field of addiction, is described. The technique, iterative categorization (IC), is suitable for use with inductive and deductive codes and can support a range of common analytical approaches, e.g. thematic analysis, Framework, constant comparison, analytical induction, content analysis, conversational analysis, discourse analysis, interpretative phenomenological analysis and narrative analysis. Once the data have been coded, the only software required is a standard word processing package. Worked examples are provided. PMID:26806155

  2. Iterative categorization (IC): a systematic technique for analysing qualitative data.

    Science.gov (United States)

    Neale, Joanne

    2016-06-01

    The processes of analysing qualitative data, particularly the stage between coding and publication, are often vague and/or poorly explained within addiction science and research more broadly. A simple but rigorous and transparent technique for analysing qualitative textual data, developed within the field of addiction, is described. The technique, iterative categorization (IC), is suitable for use with inductive and deductive codes and can support a range of common analytical approaches, e.g. thematic analysis, Framework, constant comparison, analytical induction, content analysis, conversational analysis, discourse analysis, interpretative phenomenological analysis and narrative analysis. Once the data have been coded, the only software required is a standard word processing package. Worked examples are provided. © 2016 The Authors. Addiction published by John Wiley & Sons Ltd on behalf of Society for the Study of Addiction.

  3. BV photographic and CCD photometry of IC 4651

    International Nuclear Information System (INIS)

    Anthony-Twarog, B.J.; Mukherjee, K.; Twarog, B.A.; Caldwell, N.

    1988-01-01

    A BV photometric survey in IC 4651 based on photographic and CCD material calibrated with photoelectric photometry from Eggen (1971) and Anthony-Twarog and Twarog (1987) has been completed. The color-magnitude diagram is consistent with an age of 2.4 + or - 0.3 x 10 to the 9th yr derived by comparison with the isochrones of VandenBerg (1985) if the apparent distance modulus and reddening derived from uvby photometry in Anthony-Twarog and Twarog (1987) are employed. While evidence is found of a hook in the upper main sequence, no evidence is found of a significantly bifurcated main sequence for this cluster, although it is similar in age to NGC 752 and NGC 3680, where this phenomenon has been noted. Finally, the survey has not resolved the apparent deficit of main-sequence stars fainter than V = 14.5 noted in Anthony-Twarog and Twarog (1987). 16 references

  4. Improving IC process efficiency with critical materials management

    Science.gov (United States)

    Hanson, Kathy L.; Andrews, Robert E.

    2003-06-01

    The management of critical materials in a high technology manufacturing facility is crucial to obtaining consistently high production yield. This is especially true in an industry like semiconductors where the success of the product is so dependent on the integrity of the critical production materials. Bar code systems, the traditional management tools, are voluntary, defeatable, and do not continuously monitor materials when in use. The significant costs associated with mis-management of chemicals can be captured with a customized model resulting in highly favorable ROI"s for the NOWTrak RFID chemical management system. This system transmits reliable chemical data about each individual container and generates information that can be used to increase wafer production efficiency and yield. The future of the RFID system will expand beyond the benefits of chemical management and into dynamic IC process management

  5. VLA observations of circumnebular neutral hydrogen in IC 418

    International Nuclear Information System (INIS)

    Taylor, A.R.; Gussie, G.T.; Goss, W.M.

    1989-01-01

    Neutral hydrogen images of the planetary nebula IC 418 have been made with the Very Large Array. These images show H I emission and absorption in close association with the nebula. Assuming a distance of 1 kpc, the total mass of circumnebular neutral hydrogen is 0.35 + or - 0.05 solar mass. Model fits to the data indicate that the neutral gas falls as a 1/r-squared density distribution, with outflow velocity about 5 km/s less than the expansion rate of the ionized gas. The observations also indicate that there is a region devoid of H I emission between the outer edge of the H II nebula and the inner edge of the H I shell. It is suggested that this gap is comprised of molecular hydrogen and that the surrounding H I shell is produced by photodissociation of H2 by the interstellar radiation field. Physical parameters of the H I gas are derived. 25 refs

  6. 2nd International Conference on Rheology and Modeling of Materials (IC-RMM2)

    International Nuclear Information System (INIS)

    2017-01-01

    Understanding the rheological properties of materials and their rheological behaviors during their manufacturing processes and in their applications in many cases can help to increase the efficiency and competitiveness not only of the finished goods and products but the organizations and societies also. The more scientific supported and prepared organizations develop more competitive products with better thermal, mechanical, physical, chemical and biological properties and the leading companies apply more competitive equipment and technology processes. The aims of the 2 nd International Conference on Rheology and Modeling of Materials (ic-rmm2) and the parallel organized symposiums of the 1 st International Symposium on Powder Injection Molding (is-pim1) and the 1 st International Symposium on Rheology and Fracture of Solids (is-rfs1) are the followings: Promote new methods and results of scientific research in the fields of modeling and measurements of rheological properties and behavior of materials under processing and applications; Change information between the theoretical and applied sciences as well as technical and technological implantations. Promote the communication and collaboration between the scientists, researchers and engineers of different disciplines, different nations, countries and continents. The international conference ic-rmm2 and symposiums of is-pim1 and is-rfs1 provide a platform among the leading international scientists, researchers, PhD students and engineers for discussing recent achievements in measurement, modeling and application of rheology in materials technology and materials science of liquids, melts, solids, crystals and amorphous structures. Among thr major fields of interest are the influence of materials structures, mechanical stresses, temperatures, deformation speeds and shear rates on rheological and physical properties, phase transformation of foams, foods, polymers, plastics and other competitive materials like ceramics

  7. 2nd International Conference on Rheology and Modeling of Materials (IC-RMM2)

    Science.gov (United States)

    2017-01-01

    Understanding the rheological properties of materials and their rheological behaviors during their manufacturing processes and in their applications in many cases can help to increase the efficiency and competitiveness not only of the finished goods and products but the organizations and societies also. The more scientific supported and prepared organizations develop more competitive products with better thermal, mechanical, physical, chemical and biological properties and the leading companies apply more competitive equipment and technology processes. The aims of the 2nd International Conference on Rheology and Modeling of Materials (ic-rmm2) and the parallel organized symposiums of the 1st International Symposium on Powder Injection Molding (is-pim1) and the 1st International Symposium on Rheology and Fracture of Solids (is-rfs1) are the followings: Promote new methods and results of scientific research in the fields of modeling and measurements of rheological properties and behavior of materials under processing and applications; Change information between the theoretical and applied sciences as well as technical and technological implantations. Promote the communication and collaboration between the scientists, researchers and engineers of different disciplines, different nations, countries and continents. The international conference ic-rmm2 and symposiums of is-pim1 and is-rfs1 provide a platform among the leading international scientists, researchers, PhD students and engineers for discussing recent achievements in measurement, modeling and application of rheology in materials technology and materials science of liquids, melts, solids, crystals and amorphous structures. Among thr major fields of interest are the influence of materials structures, mechanical stresses, temperatures, deformation speeds and shear rates on rheological and physical properties, phase transformation of foams, foods, polymers, plastics and other competitive materials like ceramics

  8. A revolutionary concept to improve the efficiency of IC antennas

    Energy Technology Data Exchange (ETDEWEB)

    Milanesio, D.; Maggiora, R. [Politecnico di Torino, Dipartimento di Elettronica e Telecomunicazioni (DET), Torino (Italy)

    2014-02-12

    The successful design of an Ion Cyclotron (IC) antenna mainly relies on the capability of coupling high power to the plasma (MW), feature that is currently reached by allowing rather high voltages (tens of kV) on the unavoidable unmatched part of the feeding lines. This requirement is often responsible of arcs along the transmission lines and other unwanted phenomena that considerably limit the usage of IC launchers. In this work, we suggest and describe a revolutionary approach based on high impedance surfaces, which allows to increase the antenna radiation efficiency and, hence, to highly reduce the imposed voltages to couple the same level of power to the plasma. High-impedance surfaces are periodic metallic structures (patches) displaced usually on top of a dielectric substrate and grounded by means of vertical posts usually embedded inside a dielectric, in a mushroom-like shape. In terms of working properties, high impedance surfaces are electrically thin in-phase reflectors, i.e. they present a high impedance, within a given frequency band, such that the image currents are in-phase with the currents of the antenna itself, thus determining a significant efficiency increase. While the usual design of a high impedance surface requires the presence of a dielectric layer, some alternative solutions can be realized in vacuum, taking advantage of double layers ofmetallic patches. After an introductory part on the properties of high impedance surfaces, this work documents both their design by means of numerical codes and their implementation on a scaled mock-up.

  9. Ultracold atoms on atom chips

    DEFF Research Database (Denmark)

    Krüger, Peter; Hofferberth, S.; Haller, E.

    2005-01-01

    Miniaturized potentials near the surface of atom chips can be used as flexible and versatile tools for the manipulation of ultracold atoms on a microscale. The full scope of possibilities is only accessible if atom-surface distances can be reduced to microns. We discuss experiments in this regime...

  10. FERMI multi-chip module

    CERN Multimedia

    This FERMI multi-chip module contains five million transistors. 25 000 of these modules will handle the flood of information through parts of the ATLAS and CMS detectors at the LHC. To select interesting events for recording, crucial decisions are taken before the data leaves the detector. FERMI modules are being developed at CERN in partnership with European industry.

  11. Tunable on chip optofluidic laser

    DEFF Research Database (Denmark)

    Bakal, Avraham; Vannahme, Christoph; Kristensen, Anders

    2015-01-01

    A chip scale tunable laser in the visible spectral band is realized by generating a periodic droplet array inside a microfluidic channel. Combined with a gain medium within the droplets, the periodic structure provides the optical feedback of the laser. By controlling the pressure applied to two...

  12. Chip & Cut Tests an Elastomeren

    OpenAIRE

    Euchler, Eric; Heinrich, Gert; Michael, Hannes; Gehde, Michael; Stocek, Radek; Kratina, Ondrej; Kipscholl, Reinhold

    2016-01-01

    Dieser Vortrag stellt einen neuartigen Prüfstand vor, mit welchem das Chip & Cut Verhalten von Elastomeren charakterisiert werden kann. Sowohl theoretischer Hintergrund als auch praktische Erkenntnisse werden diskutiert. Die Vorstellung der Praxisrelevanz dieser Untersuchungen steht im Fokus des Vortrags.

  13. Dicty_cDB: FC-IC0102 [Dicty_cDB

    Lifescience Database Archive (English)

    Full Text Available FC-IC (Link to library) FC-IC0102 (Link to dictyBase) - - - Contig-U16527-1 FC-IC01...02F (Link to Original site) FC-IC0102F 434 - - - - - - Show FC-IC0102 Library FC-IC (Link to library) Clone ...ID FC-IC0102 (Link to dictyBase) Atlas ID - NBRP ID - dictyBase ID - Link to Contig Contig-U16527-1 Original site URL http://dict... (bits) Value N AB088483 |AB088483.1 Dictyostelium discoideum gene for gamete and mating-type specific prote...oducing significant alignments: (bits) Value AB088483_1( AB088483 |pid:none) Dictyostelium discoideum gmsA g

  14. Profiles of the N II 6584 A line over the giant H II regions IC 1318b and c, NGC 7000 and IC 5070. 2

    Energy Technology Data Exchange (ETDEWEB)

    Canto, J; Johnson, P G; Meaburn, J; Mikhail, J S; Terrett, D L; White, N J [Manchester Univ. (UK). Dept of Astronomy

    1979-06-01

    Previously (Paper I) large-scale splitting of the (N II) line was discovered over an area of IC 1318b. The motions of the ionized material have now been mapped over a much larger region of this nebula and also IC 1318c. The splitting reaches a maximum value of 53 km/s over the faintest regions of IC 1318b and occurs over an area approximately > 20 pc across. However, few split (N II) lines were found over IC 1318c, but the motions of this whole ionized and neutral complex have been shown to be closely related. Wind-driven flows along neutral and ionized shells are proposed to explain the observations. Similar measurements have also been made on either side of the dark lane separating NGC 7000 from IC 5070.

  15. Prediction of 3D chip formation in the facing cutting with lathe machine using FEM

    Science.gov (United States)

    Prasetyo, Yudhi; Tauviqirrahman, Mohamad; Rusnaldy

    2016-04-01

    This paper presents the prediction of the chip formation at the machining process using a lathe machine in a more specific way focusing on facing cutting (face turning). The main purpose is to propose a new approach to predict the chip formation with the variation of the cutting directions i.e., the backward and forward direction. In addition, the interaction between stress analysis and chip formation on cutting process was also investigated. The simulations were conducted using three dimensional (3D) finite element method based on ABAQUS software with aluminum and high speed steel (HSS) as the workpiece and the tool materials, respectively. The simulation result showed that the chip resulted using a backward direction depicts a better formation than that using a conventional (forward) direction.

  16. Optical lattice on an atom chip

    DEFF Research Database (Denmark)

    Gallego, D.; Hofferberth, S.; Schumm, Thorsten

    2009-01-01

    Optical dipole traps and atom chips are two very powerful tools for the quantum manipulation of neutral atoms. We demonstrate that both methods can be combined by creating an optical lattice potential on an atom chip. A red-detuned laser beam is retroreflected using the atom chip surface as a high......-quality mirror, generating a vertical array of purely optical oblate traps. We transfer thermal atoms from the chip into the lattice and observe cooling into the two-dimensional regime. Using a chip-generated Bose-Einstein condensate, we demonstrate coherent Bloch oscillations in the lattice....

  17. The OptIC Data Assimilation Intercomparison: A Statistical Critique

    Science.gov (United States)

    Enting, I. G.; Clisby, N.

    2008-12-01

    The development of improved terrestrial carbon models has assumed great importance because of concerns about significant climate-to-carbon feedback processes. The complexity of the interactions leads to considerable difficulties in the process of model calibration. The OptIC intercomparison explored some aspects of model calibration, using an idealised terrestrial carbon model. Participants were invited to estimate model parameters in various cases defined by specified time series of the model state, with various forms of added noise. The study identified the crucial importance of the choice of cost function. The present analysis revisits the OptIC study, by considering it as an exercise in statistical estimation. This treats the observations as random variables. Consequently parameter estimates, â, based on observations will also be random variables whose distribution is known as the 'sampling distribution'. Key questions for any specific case are: Are departures from â/a_true =1 indication of bias or sampling error? Under what circumstance are uncertainty estimates (of Var[â]) reliable? We consider cases where the estimate is obtained by minimising a cost function, ΘX. Assuming that we know the true form of ℓ, the log likelihood, there are three different characterisations of uncertainty that should be distinguished: (i) The uncertainty from maximum-likelihood estimates, corresponding (either exactly or asymptotically) to the Cramer-Rao bound. In a realistic calibration situation, we won't be able to determine this because the 'true' form of the likelihood is unknown. (ii) The actual uncertainty associated with using a particular cost function. If the true noise distribution is known, this can be calculated in simple cases and determined from simulations in more complicated cases. (iii) The 'formal uncertainty' based on assuming (usually incorrectly) that ΘX is the true likelihood. In the first stage of the analysis, the distinctions are illustrated by

  18. Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

    Science.gov (United States)

    Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

    2016-01-01

    Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

  19. Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

    Directory of Open Access Journals (Sweden)

    Niina Halonen

    2016-11-01

    Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

  20. Broad Halpha Wing Formation in the Planetary Nebula IC 4997.

    Science.gov (United States)

    Lee; Hyung

    2000-02-10

    The young and compact planetary nebula IC 4997 is known to exhibit very broad wings with a width exceeding 5000 km s-1 around Halpha. We propose that the broad wings are formed through Rayleigh-Raman scattering that involves atomic hydrogen, by which Lybeta photons with a velocity width of a few 102 km s-1 are converted to optical photons and fill the Halpha broad wing region. The conversion efficiency reaches 0.6 near the line center, where the scattering optical depth is much larger than 1, and rapidly decreases in the far wings. Assuming that close to the central star there exists an unresolved inner compact core of high density, nH approximately 109-1010 cm-3, we use the photoionization code "CLOUDY" to show that sufficient Lybeta photons for scattering are produced. Using a top-hat-incident profile for the Lybeta flux and a scattering region with a H i column density NHi=2x1020 cm-2 and a substantial covering factor, we perform a profile-fitting analysis in order to obtain a satisfactory fit to the observed flux. We briefly discuss the astrophysical implications of the Rayleigh-Raman processes in planetary nebulae and other emission objects.

  1. Plasma end-loss studies on Scylla I-C

    International Nuclear Information System (INIS)

    McKenna, K.F.; York, T.M.

    1976-08-01

    The end-loss process in the collision dominated Scylla I-C plasma has been investigated with a local pressure sensitive diagnostic, integrated density measurement and axially arrayed diamagnetic loop probes. The development of a plasma loss orifice, well within the theta-pinch coil, has been identified. The magnitude of the observed orifice is found to be in excellent agreement with that predicted from collisional MHD theories. The axially flowing plasma is well confined until it flows through the loss orifice. After passing through the orifice, rapid axial expansion is observed. An indication of the existence of inward traveling rarefaction waves has been observed from the plasma midplane temperature data; an abrupt decrease in the plasma temperature at t approximately equal to 6.5 μs corresponds to the predicted time of arrival of rarefaction waves at the coil midplane. The plasma loss rate derived from the pressure data indicates an initial period (t 4 μs) of gradual decay in the loss rate. This initial period of high loss rate is predicted from the MHD flow theories when the measured, time dependent plasma parameters are substituted into the analytical models. The loss rate determined from the end-on interferograms does not respond to the detailed structure of the plasma loss process

  2. IRNSS/NavIC L5 Attitude Determination

    Directory of Open Access Journals (Sweden)

    Safoora Zaminpardaz

    2017-01-01

    Full Text Available The Indian Regional Navigation Satellite System (IRNSS has recently (May 2016 become fully-operational and has been provided with the operational name of NavIC (Navigation with Indian Constellation. It has been developed by the Indian Space Research Organization (ISRO with the objective of offering positioning, navigation and timing (PNT to the users in its service area. This contribution provides for the first time an assessment of the IRNSS L5-signal capability to achieve instantaneous attitude determination on the basis of data collected in Perth, Australia. Our evaluations are conducted for both a linear array of two antennas and a planar array of three antennas. A pre-requisite for precise and fast IRNSS attitude determination is the successful resolution of the double-differenced (DD integer carrier-phase ambiguities. In this contribution, we will compare the performances of different such methods, amongst which the unconstrained and the multivariate-constrained LAMBDA method for both linear and planar arrays. It is demonstrated that the instantaneous ambiguity success rates increase from 15% to 90% for the linear array and from 5% to close to 100% for the planar array, thus showing that standalone IRNSS can realize 24-h almost instantaneous precise attitude determination with heading and elevation standard deviations of 0.05 and 0.10 degrees, respectively.

  3. ICES IN THE QUIESCENT IC 5146 DENSE CLOUD

    International Nuclear Information System (INIS)

    Chiar, J. E.; Pendleton, Y. J.; Allamandola, L. J.; Ennico, K.; Greene, T. P.; Roellig, T. L.; Sandford, S. A.; Boogert, A. C. A.; Geballe, T. R.; Mason, R. E.; Keane, J. V.; Lada, C. J.; Tielens, A. G. G. M.; Werner, M. W.; Whittet, D. C. B.; Decin, L.; Eriksson, K.

    2011-01-01

    This paper presents spectra in the 2 to 20 μm range of quiescent cloud material located in the IC 5146 cloud complex. The spectra were obtained with NASA's Infrared Telescope Facility SpeX instrument and the Spitzer Space Telescope's Infrared Spectrometer. We use these spectra to investigate dust and ice absorption features in pristine regions of the cloud that are unaltered by embedded stars. We find that the H 2 O-ice threshold extinction is 4.03 ± 0.05 mag. Once foreground extinction is taken into account, however, the threshold drops to 3.2 mag, equivalent to that found for the Taurus dark cloud, generally assumed to be the touchstone quiescent cloud against which all other dense cloud and embedded young stellar object observations are compared. Substructure in the trough of the silicate band for two sources is attributed to CH 3 OH and NH 3 in the ices, present at the ∼2% and ∼5% levels, respectively, relative to H 2 O-ice. The correlation of the silicate feature with the E(J - K) color excess is found to follow a much shallower slope relative to lines of sight that probe diffuse clouds, supporting the previous results by Chiar et al.

  4. IC 630: Piercing the Veil of the Nuclear Gas

    Science.gov (United States)

    Durré, Mark; Mould, Jeremy; Schartmann, Marc; Ashraf Uddin, Syed; Cotter, Garrett

    2017-04-01

    IC 630 is a nearby early-type galaxy with a mass of 6× {10}10 M ⊙ with an intense burst of recent (6 Myr) star formation (SF). It shows strong nebular emission lines, with radio and X-ray emission, which classifies it as an active galactic nucleus (AGN). With VLT-SINFONI and Gemini North-NIFS adaptive optics observations (plus supplementary ANU 2.3 m WiFeS optical IFU observations), the excitation diagnostics of the nebular emission species show no sign of standard AGN engine excitation; the stellar velocity dispersion also indicates that a supermassive black hole (if one is present) is small ({M}\\bullet =2.25× {10}5 {M}⊙ ). The luminosity at all wavelengths is consistent with SF at a rate of about 1-2 M ⊙ yr-1. We measure gas outflows driven by SF at a rate of 0.18 M ⊙ yr-1 in a face-on truncated cone geometry. We also observe a nuclear cluster or disk and other clusters. Photoionization from young, hot stars is the main excitation mechanism for [Fe II] and hydrogen, whereas shocks are responsible for the H2 excitation. Our observations are broadly comparable with simulations where a Toomre-unstable, self-gravitating gas disk triggers a burst of SF, peaking after about 30 Myr and possibly cycling with a period of about 200 Myr.

  5. FinFET modeling for IC simulation and design

    CERN Document Server

    Hu, Chenming; Lu, Darsen D

    2015-01-01

    This book is the first to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture, as now enabled by the approved industry standard. The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, providing a step-by-step approach for the efficient extraction of model parameters. With this book you will learn: * Why you should use FinFET* The physics and operation of FinFET* Details of the FinFET standard model (BSIM-CMG)* Parameter extraction in BSIM-CMG* FinFET circuit design and simulation * Authored by the lead inventor and developer of FinFET, and developers of the BSIM-CM standard model, providing an experts' insight into the specifications of the standard* The first book on the industry-standard FinFET model - BSIM...

  6. Experiment list: SRX122465 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 6 || chip antibody=Relb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Bethyl || chip anti...body catalog number 1=A302-183A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2

  7. Experiment list: SRX122555 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available chip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip anti...body catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-7

  8. Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly

    OpenAIRE

    Peng Mou; Dong Xiang; Guanghong Duan

    2013-01-01

    Reuse of plastic IC packages disassembled from printed circuit boards (PCBs) has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages. Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the ...

  9. The integrated circuit IC EMP transient state disturbance effect experiment method investigates

    International Nuclear Information System (INIS)

    Li Xiaowei

    2004-01-01

    Transient state disturbance characteristic study on the integrated circuit, IC, need from its coupling path outset. Through cable (aerial) coupling, EMP converts to an pulse current voltage and results in the impact to the integrated circuit I/O orifice passing the cable. Aiming at the armament system construction feature, EMP effect to the integrated circuit, IC inside the system is analyzed. The integrated circuit, IC EMP effect experiment current injection method is investigated and a few experiments method is given. (authors)

  10. A combined thermodynamic cycle based on methanol dissociation for IC (internal combustion) engine exhaust heat recovery

    International Nuclear Information System (INIS)

    Fu, Jianqin; Liu, Jingping; Xu, Zhengxin; Ren, Chengqin; Deng, Banglin

    2013-01-01

    In this paper, a novel approach for exhaust heat recovery was proposed to improve IC (internal combustion) engine fuel efficiency and also to achieve the goal for direct usage of methanol as IC engine fuel. An open organic Rankine cycle system using methanol as working medium is coupled to IC engine exhaust pipe for exhaust heat recovery. In the bottom cycle, the working medium first undergoes dissociation and expansion processes, and is then directed back to IC engine as fuel. As the external bottom cycle and the IC engine main cycle are combined together, this scheme forms a combined thermodynamic cycle. Then, this concept was applied to a turbocharged engine, and the corresponding simulation models were built for both of the external bottom cycle and the IC engine main cycle. On this basis, the energy saving potential of this combined cycle was estimated by parametric analyses. Compared to the methanol vapor engine, IC engine in-cylinder efficiency has an increase of 1.4–2.1 percentage points under full load conditions, while the external bottom cycle can increase the fuel efficiency by 3.9–5.2 percentage points at the working pressure of 30 bar. The maximum improvement to the IC engine global fuel efficiency reaches 6.8 percentage points. - Highlights: • A combined thermodynamic cycle using methanol as working medium for IC engine exhaust heat recovery is proposed. • The external bottom cycle of exhaust heat recovery and IC engine working cycle are combined together. • IC engine fuel efficiency could be improved from both in-cylinder working cycle and external bottom cycle. • The maximum improvement to the IC engine global fuel efficiency reaches 6.8 percentage points at full load

  11. Prediction of fracture toughness K/sub Ic/ of steel from Charpy impact test results

    Energy Technology Data Exchange (ETDEWEB)

    Iwadate, Tadao; Tanaka, Yasuhiko; Takemata, Hiroyuki; Terashima, Shuhei

    1986-08-01

    This paper presents a method to predict the fracture toughness K/sub Ic/ and/or K/sub Id/ of steels using their Charpy impact test results and tensile properties. The fracture toughness, Charpy impact and tensile properties of 2 1/4 Cr-1Mo, ASTM A508 Cl.1, A508 Cl.2 A508 Cl.3 and A533 Gr.B Cl.1 steels were measured and analysed on the basis of the excess temperature (test temperature minus FATT) and Rolfe-Novak correlation. The relationship between K/sub Ic//K/sub Ic-us/ and the excess temperature, where K/sub Ic-us/ is the upper-shelf fracture toughness K/sub Ic/ predicted by Rolfe-Novak correlation, discloses that the K/sub Ic/ transition curves of several steels are representable by only one trend curve of K/sub Ic//K/sub Ic-us/ or K/sub Id//K/sub Id-us/ versus excess temperature relation. This curve is denoted as a ''master curve''. By using this curve, the fracture toughness of steel can be predicted using Charpy impact and tensile test results. By taking account of the scattering of both the fracture toughness and Charpy impact test results, the confidence limits of the master curve were also determined. Another approach to develop more general procedure of predicting the fracture toughness K/sub Ic/ is also discussed.

  12. IC ENGINE SUPERCHARGING AND EXHAUST GAS RECIRCULATION USING JET COMPRESSOR

    Directory of Open Access Journals (Sweden)

    Adhimoulame Kalaisselvane

    2010-01-01

    Full Text Available Supercharging is a process which is used to improve the performance of an engine by increasing the specific power output whereas exhaust gas recirculation reduces the NOx produced by engine because of supercharging. In a conventional engine, supercharger functions as a compressor for the forced induction of the charge taking mechanical power from the engine crankshaft. In this study, supercharging is achieved using a jet compressor. In the jet compressor, the exhaust gas is used as the motive stream and the atmospheric air as the propelled stream. When high pressure motive stream from the engine exhaust is expanded in the nozzle, a low pressure is created at the nozzle exit. Due to this low pressure, atmospheric air is sucked into the expansion chamber of the compressor, where it is mixed and pressurized with the motive stream. The pressure of the mixed stream is further increased in the diverging section of the jet compressor. A percentage volume of the pressurized air mixture is then inducted back into the engine as supercharged air and the balance is let out as exhaust. This process not only saves the mechanical power required for supercharging but also dilutes the constituents of the engine exhaust gas thereby reducing the emission and the noise level generated from the engine exhaust. The geometrical design parameters of the jet compressor were obtained by solving the governing equations using the method of constant rate of momentum change. Using the theoretical design parameters of the jet compressor, a computational fluid dinamics analysis using FLUENT software was made to evaluate the performance of the jet compressor for the application of supercharging an IC engine. This evaluation turned out to be an efficient diagnostic tool for determining performance optimization and design of the jet compressor. A jet compressor was also fabricated for the application of supercharging and its performance was studied.

  13. Flip chip assembly of thinned chips for hybrid pixel detector applications

    International Nuclear Information System (INIS)

    Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

  14. Temperature effects in Au piezoresistors integrated in SU-8 cantilever chips

    DEFF Research Database (Denmark)

    Johansson, Alicia; Hansen, Ole; Hales, Jan Harry

    2006-01-01

    We present a cantilever-based biosensor chip made for the detection of biochemical molecules. The device is fabricated entirely in the photosensitive polymer SU-8 except for integrated piezoresistors made of Au. The integrated piezoresistors are used to monitor the surface stress changes due to b...

  15. Photonic network-on-chip design

    CERN Document Server

    Bergman, Keren; Biberman, Aleksandr; Chan, Johnnie; Hendry, Gilbert

    2013-01-01

    This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing photonic network-on-chip architectures for future many-core high performance chip multiprocessors. The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and network-on-chip theory and existing research, and finishing with describing various architectures, their characteristics, and the impact they will have on a computing system. After acquainting

  16. Wax-bonding 3D microfluidic chips

    KAUST Repository

    Gong, Xiuqing; Yi, Xin; Xiao, Kang; Li, Shunbo; Kodzius, Rimantas; Qin, Jianhua; Wen, Weijia

    2013-01-01

    We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

  17. Wax-bonding 3D microfluidic chips

    KAUST Repository

    Gong, Xiuqing

    2013-10-10

    We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

  18. A scalable single-chip multi-processor architecture with on-chip RTOS kernel

    NARCIS (Netherlands)

    Theelen, B.D.; Verschueren, A.C.; Reyes Suarez, V.V.; Stevens, M.P.J.; Nunez, A.

    2003-01-01

    Now that system-on-chip technology is emerging, single-chip multi-processors are becoming feasible. A key problem of designing such systems is the complexity of their on-chip interconnects and memory architecture. It is furthermore unclear at what level software should be integrated. An example of a

  19. Chip formation and surface integrity in high-speed machining of hardened steel

    Science.gov (United States)

    Kishawy, Hossam Eldeen A.

    Increasing demands for high production rates as well as cost reduction have emphasized the potential for the industrial application of hard turning technology during the past few years. Machining instead of grinding hardened steel components reduces the machining sequence, the machining time, and the specific cutting energy. Hard turning Is characterized by the generation of high temperatures, the formation of saw toothed chips, and the high ratio of thrust to tangential cutting force components. Although a large volume of literature exists on hard turning, the change in machined surface physical properties represents a major challenge. Thus, a better understanding of the cutting mechanism in hard turning is still required. In particular, the chip formation process and the surface integrity of the machined surface are important issues which require further research. In this thesis, a mechanistic model for saw toothed chip formation is presented. This model is based on the concept of crack initiation on the free surface of the workpiece. The model presented explains the mechanism of chip formation. In addition, experimental investigation is conducted in order to study the chip morphology. The effect of process parameters, including edge preparation and tool wear on the chip morphology, is studied using Scanning Electron Microscopy (SEM). The dynamics of chip formation are also investigated. The surface integrity of the machined parts is also investigated. This investigation focusses on residual stresses as well as surface and sub-surface deformation. A three dimensional thermo-elasto-plastic finite element model is developed to predict the machining residual stresses. The effect of flank wear is introduced during the analysis. Although residual stresses have complicated origins and are introduced by many factors, in this model only the thermal and mechanical factors are considered. The finite element analysis demonstrates the significant effect of the heat generated

  20. Robust design and thermal fatigue life prediction of anisotropic conductive film flip chip package

    International Nuclear Information System (INIS)

    Nam, Hyun Wook

    2004-01-01

    The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF(Anisotropic Conductive Film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design Of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2 nd DOE was conducted to obtain RSM equation for the choose 3 design parameter. The coefficient of determination (R 2 ) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for Feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430μm, and 78μm, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter

  1. Measuring IC following a semi-qualitative approach: An integrated framework

    Directory of Open Access Journals (Sweden)

    Chiara Verbano

    2013-09-01

    Full Text Available Purpose: Considering the different IC measures adopted in literature, the advantages of adopting semi-qualitative measures, and the lack of an agreed system for IC evaluation, the purpose of the paper is to analyse literature on IC measurement following a semi-qualitative approach, with the final intent to build an IC measurement framework. Design/methodology/approach: A literature review on IC measurement system, following a semi-qualitative approach, has been conducted and analysed, in order to re-organize and synthesize all items used in previous researches. Findings: An integrated framework emerged from this research and it constitutes an IC  measurement system, created gathering and integrating different items previously adopted in literature. Each of these variables has been organized in categories belonging to one of the three main components of IC: human capital, internal structural capital and relational capital. Originality/value: This research provides an integrated tool for IC evaluation, fostering toward a well agreed measurement system that is still lacking in literature. This framework could be interesting  not only for the academic world, which in the last two decades reveals increasing attention to IC, but also for the management of the companies, that with IC measurement can increase awareness of the firm’s value and develop internal auditing system to support the management of these assets. Moreover, it could be a useful instrument for the communication of IC value to the external stakeholders, as customers, suppliers and especially shareholders, and to investors and financial analysts.

  2. Advancing Software Development for a Multiprocessor System-on-Chip

    Directory of Open Access Journals (Sweden)

    Stephen Bique

    2007-06-01

    Full Text Available A low-level language is the right tool to develop applications for some embedded systems. Notwithstanding, a high-level language provides a proper environment to develop the programming tools. The target device is a system-on-chip consisting of an array of processors with only local communication. Applications include typical streaming applications for digital signal processing. We describe the hardware model and stress the advantages of a flexible device. We introduce IDEA, a graphical integrated development environment for an array. A proper foundation for software development is a UML and standard programming abstractions in object-oriented languages.

  3. Crowdsourcing Disease Biomarker Discovery Research: The IP4IC Study.

    Science.gov (United States)

    Chancellor, Michael B; Bartolone, Sarah N; Veerecke, Andrew; Lamb, Laura E

    2018-05-01

    Biomarker discovery is limited by readily assessable, cost efficient human samples available in large numbers that represent the entire heterogeneity of the disease. We developed a novel, active participation crowdsourcing method to determine BP-RS (Bladder Permeability Defect Risk Score). It is based on noninvasive urinary cytokines to discriminate patients with interstitial cystitis/bladder pain syndrome who had Hunner lesions from controls and patients with interstitial cystitis/bladder pain syndrome but without Hunner lesions. We performed a national crowdsourcing study in cooperation with the Interstitial Cystitis Association. Patients answered demographic, symptom severity and urinary frequency questionnaires on a HIPAA (Health Insurance Portability and Accountability Act) compliant website. Urine samples were collected at home, stabilized with a preservative and sent to Beaumont Hospital for analysis. The expression of 3 urinary cytokines was used in a machine learning algorithm to develop BP-RS. The IP4IC study collected a total of 448 urine samples, representing 153 patients (147 females and 6 males) with interstitial cystitis/bladder pain syndrome, of whom 54 (50 females and 4 males) had Hunner lesions. A total of 159 female and 136 male controls also participated, who were age matched. A defined BP-RS was calculated to predict interstitial cystitis/bladder pain syndrome with Hunner lesions or a bladder permeability defect etiology with 89% validity. In this novel participation crowdsourcing study we obtained a large number of urine samples from 46 states, which were collected at home, shipped and stored at room temperature. Using a machine learning algorithm we developed BP-RS to quantify the risk of interstitial cystitis/bladder pain syndrome with Hunner lesions, which is indicative of a bladder permeability defect etiology. To our knowledge BP-RS is the first validated urine biomarker assay for interstitial cystitis/bladder pain syndrome and one of the

  4. EVN observations of the OH megamaser galaxies Mrk 231 and IC 694

    NARCIS (Netherlands)

    Klockner, HR; Baan, WA; Migenes,; Reid, MJ

    2002-01-01

    We present EVN observations of hydroxyl (OH) main-line emission in two megamaser sources Mrk 231 and IC 694. The observations indicate that the broad maser emission lines originate within the nuclear regions. A single 1667 MHz main-line feature is seen at the nucleus of IC 694. In Mrk 231 both

  5. Adopting De Novo Programming Approach on IC Design Service Firms Resources Integration

    Directory of Open Access Journals (Sweden)

    James K. C. Chen

    2014-01-01

    Full Text Available The semiconductor industry has very important position in computer industry, ICT field, and new electronic technology developing. The IC design service is one of key factor of semiconductor industry development. There are more than 365 IC design service firms have been established around Hsinchu Science Park in Taiwan. Building an efficient planning model for IC design service firm resources integrating is very interest issue. This study aims to construct a planning model for IC design service firm implementation resources integration. This study uses the De Novo programming as an approach of criteria alternative to achieve optimal resource allocation on IC design firm. Results show the IC design service firm should conduct open innovation concept and utilizes design outsourcing obtains cost down and enhance IC design service business performance. This plan model of De Novo programming is not only for IC design service firm and also can apply to the other industrial implementation strategic alliance/integrating resource. This plan model is a universal model for the others industries field.

  6. 30 CFR 57.22203 - Main fan operation (I-C mines).

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Main fan operation (I-C mines). 57.22203... Standards for Methane in Metal and Nonmetal Mines Ventilation § 57.22203 Main fan operation (I-C mines). Main fans shall be operated continuously while ore production is in progress. ...

  7. Industry-Oriented Laboratory Development for Mixed-Signal IC Test Education

    Science.gov (United States)

    Hu, J.; Haffner, M.; Yoder, S.; Scott, M.; Reehal, G.; Ismail, M.

    2010-01-01

    The semiconductor industry is lacking qualified integrated circuit (IC) test engineers to serve in the field of mixed-signal electronics. The absence of mixed-signal IC test education at the collegiate level is cited as one of the main sources for this problem. In response to this situation, the Department of Electrical and Computer Engineering at…

  8. A Solder Based Self Assembly Project in an Introductory IC Fabrication Course

    Science.gov (United States)

    Rao, Madhav; Lusth, John C.; Burkett, Susan L.

    2015-01-01

    Integrated circuit (IC) fabrication principles is an elective course in a senior undergraduate and early graduate student's curriculum. Over the years, the semiconductor industry relies heavily on students with developed expertise in the area of fabrication techniques, learned in an IC fabrication theory and laboratory course. The theory course…

  9. 30 CFR 57.22209 - Auxiliary fans (I-C mines).

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Auxiliary fans (I-C mines). 57.22209 Section 57... Standards for Methane in Metal and Nonmetal Mines Ventilation § 57.22209 Auxiliary fans (I-C mines). Electric auxiliary fans shall be approved by MSHA under the applicable requirements of 30 CFR part 18...

  10. 30 CFR 57.22241 - Advance face boreholes (I-C mines).

    Science.gov (United States)

    2010-07-01

    ...) Boreholes shall be drilled in such a manner to insure that the advancing face will not accidently break into... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Advance face boreholes (I-C mines). 57.22241... Standards for Methane in Metal and Nonmetal Mines Ventilation § 57.22241 Advance face boreholes (I-C mines...

  11. Evaluation of accelerated test parameters for CMOS IC total dose hardness prediction

    International Nuclear Information System (INIS)

    Sogoyan, A.V.; Nikiforov, A.Y.; Chumakov, A.I.

    1999-01-01

    The approach to accelerated test parameters evaluation is presented in order to predict CMOS IC total dose behavior in variable dose-rate environment. The technique is based on the analytical model of MOSFET parameters total dose degradation. The simple way to estimate model parameter is proposed using IC's input-output MOSFET radiation test results. (authors)

  12. Application of IC Card License for Road Transportation in Commercial Vehicles Supervision and Service

    Directory of Open Access Journals (Sweden)

    Li Weiwei

    2016-01-01

    Full Text Available IC card electronic license for road transport includes the IC card commercial vehicle’s certificate and IC card practitioner’s qualification certificate. In China, the IC card electronic license for road transport is the electronic ID card which must be carried by each commercial vehicles and practitioners. This paper briefly introduces the basic situation, data format and security keys architecture of IC card electronic license for road transportation of China. In order to strengthen the supervision and service of commercial vehicles, this paper puts forward the overall application framework of IC card electronic license for road transport. The application examples of IC card license in the supervision of passenger station, dangerous goods transport management, governance overload and logistics park and port area management are discussed. The practical application results show that the application of IC card electronic license for road transport is an important technical means to improve the supervision ability and service quality of the road transportation industry.

  13. Self-powered integrated systems-on-chip (energy chip)

    KAUST Repository

    Hussain, Muhammad Mustafa

    2010-04-23

    In today\\'s world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient power to run those devices, several critical technical challenges need to be overcome: a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low power consumption, faster response, higher sensitivity and batch production (low cost). b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new functionalities that were previously underutilized in the macro/micro dimension. c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand. We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

  14. Self-powered integrated systems-on-chip (energy chip)

    Science.gov (United States)

    Hussain, M. M.; Fahad, H.; Rojas, J.; Hasan, M.; Talukdar, A.; Oommen, J.; Mink, J.

    2010-04-01

    In today's world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient power to run those devices, several critical technical challenges need to be overcome: a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low power consumption, faster response, higher sensitivity and batch production (low cost). b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new functionalities that were previously underutilized in the macro/micro dimension. c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand. We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

  15. Development of grouped icEEG for the study of cognitive processing

    Directory of Open Access Journals (Sweden)

    Cihan Mehmet Kadipasaoglu

    2015-07-01

    Full Text Available Invasive intracranial EEG (icEEG offers a unique opportunity to study human cognitive networks at an unmatched spatiotemporal resolution. To date, the contributions of icEEG have been limited to the individual-level analyses or cohorts whose data are not integrated in any way. Here we discuss how grouped approaches to icEEG overcome challenges related to sparse-sampling, correct for individual variations in response and provide statistically valid models of brain activity in a population. By the generation of whole-brain activity maps, grouped icEEG enables the study of intra and interregional dynamics between distributed cortical substrates exhibiting task-dependent activity. In this fashion, grouped icEEG analyses can provide significant advances in understanding the mechanisms by which cortical networks give rise to cognitive functions.

  16. Periods and light curves of 16 Cepheid variables in IC 1613 not completed by Baade

    International Nuclear Information System (INIS)

    Carlson, G.; Sandage, A.

    1990-01-01

    New periods and light curves are presented for 16 of the faintest Cepheids in IC 1613 which had not been finished by Baade. Magnitudes have been reduced to Freedman's new photometric scale. The P-L relation is extended to periods of 2 days using these new data. Comparison of the total Cepheid data now available in IC 1613 with the data in LMC shows no significant slope difference in the two P-L relations for periods of less than 10 days despite the lower metallicity of the young stars in IC 1613. Fifty new faint Cepheid candidates have been found in IC 1613 by blinking plates not used for this purpose by Baade. Most of these stars will have probable periods of less than 2 days, which will eventually permit an extension of the P-L relation in IC 1613 to fainter magnitudes when the photometry and period determinations are completed. 18 refs

  17. The use of forest chips in Finland

    International Nuclear Information System (INIS)

    Hakkila, P.

    2001-01-01

    International commitments require the industrial world to restrict their greenhouse gas emissions. In Finland, where the annual timber cut per capita is more than ten times the average cut in the other EU countries, the primary means to reduce CO 2 emissions is to replace fossil fuels with forest biomass. The annual consumption of wood-based energy corresponds to 6 million tonnes of oil equivalent (toe) or almost 20% of the total primary energy consumption. The goal is to rise the annual production of wood-based energy to 7.8 million toe by 2010. Substantial part of the targeted increase could be obtained by forest chips produced of unmerchantable small-diameter trees and logging residues. The goal for 2010 is to use 5 million solid m 3 of forest chips, which equals to 0.9 million toe. The use of forest chips is increasing. About 474 000 solid m 3 of forest chips were used as fuel in 1999. At the moment, the growth is rapid especially in cogeneration plants producing both heat and electricity. The growth is based primarily on chips obtained from logging residues. The price of forest chips decreased considerably during the 1990s but the price range remained wide. Chips made of logging residues are cheaper than those made of small trees. The average price of forest chips at the plant, VAT excluded, is about 53 FIM per MWh. In Sweden, the average price is more than 40% higher

  18. Least cost supply strategies for wood chips

    DEFF Research Database (Denmark)

    Möller, Bernd

    The abstract presents a study based on a geographical information system, which produce  cost-supply curves by location for forest woods chips in Denmark.......The abstract presents a study based on a geographical information system, which produce  cost-supply curves by location for forest woods chips in Denmark....

  19. Teaching Quality Control with Chocolate Chip Cookies

    Science.gov (United States)

    Baker, Ardith

    2014-01-01

    Chocolate chip cookies are used to illustrate the importance and effectiveness of control charts in Statistical Process Control. By counting the number of chocolate chips, creating the spreadsheet, calculating the control limits and graphing the control charts, the student becomes actively engaged in the learning process. In addition, examining…

  20. A Chip for an Implantable Neural Stimulator

    DEFF Research Database (Denmark)

    Gudnason, Gunnar; Bruun, Erik; Haugland, Morten

    2000-01-01

    This paper describes a chip for a multichannel neural stimulator for functional electrical stimulation (FES). The purpose of FES is to restore muscular control in disabled patients. The chip performs all the signal processing required in an implanted neural stimulator. The power and digital data...

  1. Performance evaluation of chip seals in Idaho.

    Science.gov (United States)

    2010-08-01

    The intent of this research project is to identify a wide variety of parameters that influence the performance of pavements treated via chip seals within the State of Idaho. Chip sealing is currently one of the most popular methods of maintenance for...

  2. Simple photolithographic rapid prototyping of microfluidic chips

    DEFF Research Database (Denmark)

    Kunstmann-Olsen, Casper; Hoyland, James; Rubahn, Horst-Günter

    2012-01-01

    Vi præsenterer en simpel metode til at producere støbeforme til støbning af PDMS mikrofluide chips vha. fotolitografi, med 35mm fotonegativer som masker. Vi demonstrer metodens muligheder og begrænsninger. Vi har optimeret processen til at fremstille planare lab-on-a-chip strukturer med meget høj...

  3. Microneedle Array Interface to CE on Chip

    NARCIS (Netherlands)

    Lüttge, Regina; Gardeniers, Johannes G.E.; Vrouwe, E.X.; van den Berg, Albert; Northrup, M.A.; Jensen, K.F; Harrison, D.J.

    2003-01-01

    This paper presents a microneedle array sampler interfaced to a capillary electrophoresis (CE) glass chip with integrated conductivity detection electrodes. A solution of alkali ions was electrokinetically loaded through the microneedles onto the chip and separation was demonstrated compared to a

  4. Multimedia-Based Chip Design Education.

    Science.gov (United States)

    Catalkaya, Tamer; Golze, Ulrich

    This paper focuses on multimedia computer-based training programs on chip design. Their development must be fast and economical, in order to be affordable by technical university institutions. The self-produced teaching program Illusion, which demonstrates a monitor controller as an example of a small but complete chip design, was implemented to…

  5. Prion seeding activities of mouse scrapie strains with divergent PrPSc protease sensitivities and amyloid plaque content using RT-QuIC and eQuIC.

    Directory of Open Access Journals (Sweden)

    Sarah Vascellari

    Full Text Available Different transmissible spongiform encephalopathy (TSE-associated forms of prion protein (e.g. PrP(Sc can vary markedly in ultrastructure and biochemical characteristics, but each is propagated in the host. PrP(Sc propagation involves conversion from its normal isoform, PrP(C, by a seeded or templated polymerization mechanism. Such a mechanism is also the basis of the RT-QuIC and eQuIC prion assays which use recombinant PrP (rPrP(Sen as a substrate. These ultrasensitive detection assays have been developed for TSE prions of several host species and sample tissues, but not for murine models which are central to TSE pathogenesis research. Here we have adapted RT-QuIC and eQuIC to various murine prions and evaluated how seeding activity depends on glycophosphatidylinositol (GPI anchoring and the abundance of amyloid plaques and protease-resistant PrP(Sc (PrP(Res. Scrapie brain dilutions up to 10(-8 and 10(-13 were detected by RT-QuIC and eQuIC, respectively. Comparisons of scrapie-affected wild-type mice and transgenic mice expressing GPI anchorless PrP showed that, although similar concentrations of seeding activity accumulated in brain, the heavily amyloid-laden anchorless mouse tissue seeded more rapid reactions. Next we compared seeding activities in the brains of mice with similar infectivity titers, but widely divergent PrP(Res levels. For this purpose we compared the 263K and 139A scrapie strains in transgenic mice expressing P101L PrP(C. Although the brains of 263K-affected mice had little immunoblot-detectable PrP(Res, RT-QuIC indicated that seeding activity was comparable to that associated with a high-PrP(Res strain, 139A. Thus, in this comparison, RT-QuIC seeding activity correlated more closely with infectivity than with PrP(Res levels. We also found that eQuIC, which incorporates a PrP(Sc immunoprecipitation step, detected seeding activity in plasma from wild-type and anchorless PrP transgenic mice inoculated with 22L, 79A and/or RML

  6. METAL CHIP HEATING PROCESS INVESTIGATION (Part I

    Directory of Open Access Journals (Sweden)

    O. M. Dyakonov

    2007-01-01

    Full Text Available The main calculation methods for heat- and mass transfer in porous heterogeneous medium have been considered. The paper gives an evaluation of the possibility to apply them for calculation of metal chip heating process. It has been shown that a description of transfer processes in a chip has its own specific character that is attributed to difference between thermal and physical properties of chip material and lubricant-coolant components on chip surfaces. It has been determined that the known expressions for effective heat transfer coefficients can be used as basic ones while approaching mutually penetrating continuums. A mathematical description of heat- and mass transfer in chip medium can be considered as a basis of mathematical modeling, numerical solution and parameter optimization of the mentioned processes.

  7. Local stress analysis in devices by FIB

    NARCIS (Netherlands)

    Kregting, R.; Gielen, A.W.J.; Driel, W. van; Alkemade, P.; Miro, H.; Kamminga, J.-D.

    2010-01-01

    Intrinsic stresses in bondpads may lead to early failure of IC's. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/numerical approach which consists of the following steps: First, a conductive gold layer

  8. Design and fabrication stable LNF contact for future IC application

    International Nuclear Information System (INIS)

    Bhuiyan, M M I; Bhuiyan, M; Rashid, M M; Ahmed, Sayem; Kajihara, M

    2013-01-01

    Enable the design of a small contact spring for applications requiring high density, high speed and high durability. A low normal force (LNF) contact spring with high performance is fabricated using a unique combined MEMS photo resist lithography and electro fine forming (EFF) technology. Reducing a total contact material cost of a connector, a high-Hertz stress with LNF contact will be a key technology in the future. Only radius R 5μm tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional contact. 0.30million cycle's durability test was passed at 300μm displacement and the contact resistance was ≤50mΩ

  9. FY1995 evolvable hardware chip; 1995 nendo shinkasuru hardware chip

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-03-01

    This project aims at the development of 'Evolvable Hardware' (EHW) which can adapt its hardware structure to the environment to attain better hardware performance, under the control of genetic algorithms. EHW is a key technology to explore the new application area requiring real-time performance and on-line adaptation. 1. Development of EHW-LSI for function level hardware evolution, which includes 15 DSPs in one chip. 2. Application of the EHW to the practical industrial applications such as data compression, ATM control, digital mobile communication. 3. Two patents : (1) the architecture and the processing method for programmable EHW-LSI. (2) The method of data compression for loss-less data, using EHW. 4. The first international conference for evolvable hardware was held by authors: Intl. Conf. on Evolvable Systems (ICES96). It was determined at ICES96 that ICES will be held every two years between Japan and Europe. So the new society has been established by us. (NEDO)

  10. Current status of ITER I&C system as integration begins

    Energy Technology Data Exchange (ETDEWEB)

    Davis, William, E-mail: william.davis@iter.org [ITER Organisation, Route de Vinon-sur Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Wallander, Anders [ITER Organisation, Route de Vinon-sur Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Yonekawa, Izuru [Nippon Advanced Technology Ltd., 3129-45 Hibara Muramatsu, Tokai, Naka-gun, Ibaraki 319-1112 (Japan)

    2016-11-15

    Highlights: • The ITER I&C system is organisationally complicated and technically challenging. • Standard technologies for the ITER I&C systems have been selected. • Supply of non-standard technologies will cause serious issues. • Differing levels of design maturity of plant I&C systems is a serious challenge. • Systems are in the final stages of design and are being delivered to site. - Abstract: The ITER I&C system is organisationally complicated and technically challenging, and integrating its many sub-systems into a single coherent system is critical for the ITER project to meet its objectives. This paper explains the integration risks being faced now and anticipated in the near future. Standardisation initiatives by the ITER central team to mitigate these risks are described. The paper also presents the architecture of the ITER I&C system, the current status of design and manufacture key developments made in recent years, and the current and future activities of the central I&C teams. Finally, a short description is given of the plant I&C systems that will be delivered to ITER in the near future.

  11. ICECAP: an integrated, general-purpose, automation-assisted IC50/EC50 assay platform.

    Science.gov (United States)

    Li, Ming; Chou, Judy; King, Kristopher W; Jing, Jing; Wei, Dong; Yang, Liyu

    2015-02-01

    IC50 and EC50 values are commonly used to evaluate drug potency. Mass spectrometry (MS)-centric bioanalytical and biomarker labs are now conducting IC50/EC50 assays, which, if done manually, are tedious and error-prone. Existing bioanalytical sample preparation automation systems cannot meet IC50/EC50 assay throughput demand. A general-purpose, automation-assisted IC50/EC50 assay platform was developed to automate the calculations of spiking solutions and the matrix solutions preparation scheme, the actual spiking and matrix solutions preparations, as well as the flexible sample extraction procedures after incubation. In addition, the platform also automates the data extraction, nonlinear regression curve fitting, computation of IC50/EC50 values, graphing, and reporting. The automation-assisted IC50/EC50 assay platform can process the whole class of assays of varying assay conditions. In each run, the system can handle up to 32 compounds and up to 10 concentration levels per compound, and it greatly improves IC50/EC50 assay experimental productivity and data processing efficiency. © 2014 Society for Laboratory Automation and Screening.

  12. Extracción de cobre desde soluciones clorhídricas con LIX 860N-IC y LIX 84-IC

    Directory of Open Access Journals (Sweden)

    Navarro, Carlos María

    2001-08-01

    Full Text Available In this work, the extraction of copper from chloride solutions with two hydroxyoximes: 5- nonylsalicylaldoxime (LIX 860N-IC and 2-hydroxy-5-nonylacetophenona oxime (LIX 84-IC is discussed. The results showed that an increase in the acidity and an increase in the total concentration of chloride ions in the aqueous phase decreased significantly the extraction of copper as well as the extraction of iron for both extractants. This effect of the chloride ions can be explained by the formation of a series of chloro complexes of Cu(II and Fe(III in the aqueous phase. The effect of initial pH and total chloride concentration on the extraction of chloride by the organic phase suggests that LIX 860N-IC, and to a lesser extent LIX 84-IC, extract small amounts of the cationic complex, CuCl+. An increase in the concentration of chloride ions also produced a small decrease in the rate of copper extraction with both hydroxyoximes.

    En este trabajo se discute el estudio de la extracción de cobre desde soluciones clorhídricas con dos hidroxioximas: 5-nonilsalicilaldoxima (LIX 860N-IC, y 2-hidroxi-5 nonilacetofenona oxima (LIX 84-IC. Los resultados indicaron que al aumentar la acidez o aumentar la concentración de cloruro en la fase acuosa se produce una significativa disminución en la extracción de cobre y hierro con ambas hidroxioximas. Este efecto del ion cloruro se explica por la formación de varios clorocomplejos de Cu(II y Fe(III en la solución acuosa. El efecto del pH y la concentración total de cloruro en la extracción de cloruro sugiere que el LIX 860N-IC, y en menor grado el LIX 84-IC extraen pequeñas cantidades del catión monovalente, CuCl+. Se determinó también que un aumento en la concentración de cloruro en la solución acuosa produce una leve disminución en la velocidad de extracción del cobre con ambas hidroxioximas.

  13. Identification of signals that facilitate isoform specific nucleolar localization of myosin IC

    Energy Technology Data Exchange (ETDEWEB)

    Schwab, Ryan S.; Ihnatovych, Ivanna; Yunus, Sharifah Z.S.A.; Domaradzki, Tera [Department of Physiology and Biophysics, University at Buffalo—State University of New York, Buffalo, NY (United States); Hofmann, Wilma A., E-mail: whofmann@buffalo.edu [Department of Physiology and Biophysics, University at Buffalo—State University of New York, Buffalo, NY (United States)

    2013-05-01

    Myosin IC is a single headed member of the myosin superfamily that localizes to the cytoplasm and the nucleus, where it is involved in transcription by RNA polymerases I and II, intranuclear transport, and nuclear export. In mammalian cells, three isoforms of myosin IC are expressed that differ only in the addition of short isoform-specific N-terminal peptides. Despite the high sequence homology, the isoforms show differences in cellular distribution, in localization to nuclear substructures, and in their interaction with nuclear proteins through yet unknown mechanisms. In this study, we used EGFP-fusion constructs that express truncated or mutated versions of myosin IC isoforms to detect regions that are involved in isoform-specific localization. We identified two nucleolar localization signals (NoLS). One NoLS is located in the myosin IC isoform B specific N-terminal peptide, the second NoLS is located upstream of the neck region within the head domain. We demonstrate that both NoLS are functional and necessary for nucleolar localization of specifically myosin IC isoform B. Our data provide a first mechanistic explanation for the observed functional differences between the myosin IC isoforms and are an important step toward our understanding of the underlying mechanisms that regulate the various and distinct functions of myosin IC isoforms. - Highlights: ► Two NoLS have been identified in the myosin IC isoform B sequence. ► Both NoLS are necessary for myosin IC isoform B specific nucleolar localization. ► First mechanistic explanation of functional differences between the isoforms.

  14. Classification of fMRI independent components using IC-fingerprints and support vector machine classifiers.

    Science.gov (United States)

    De Martino, Federico; Gentile, Francesco; Esposito, Fabrizio; Balsi, Marco; Di Salle, Francesco; Goebel, Rainer; Formisano, Elia

    2007-01-01

    We present a general method for the classification of independent components (ICs) extracted from functional MRI (fMRI) data sets. The method consists of two steps. In the first step, each fMRI-IC is associated with an IC-fingerprint, i.e., a representation of the component in a multidimensional space of parameters. These parameters are post hoc estimates of global properties of the ICs and are largely independent of a specific experimental design and stimulus timing. In the second step a machine learning algorithm automatically separates the IC-fingerprints into six general classes after preliminary training performed on a small subset of expert-labeled components. We illustrate this approach in a multisubject fMRI study employing visual structure-from-motion stimuli encoding faces and control random shapes. We show that: (1) IC-fingerprints are a valuable tool for the inspection, characterization and selection of fMRI-ICs and (2) automatic classifications of fMRI-ICs in new subjects present a high correspondence with those obtained by expert visual inspection of the components. Importantly, our classification procedure highlights several neurophysiologically interesting processes. The most intriguing of which is reflected, with high intra- and inter-subject reproducibility, in one IC exhibiting a transiently task-related activation in the 'face' region of the primary sensorimotor cortex. This suggests that in addition to or as part of the mirror system, somatotopic regions of the sensorimotor cortex are involved in disambiguating the perception of a moving body part. Finally, we show that the same classification algorithm can be successfully applied, without re-training, to fMRI collected using acquisition parameters, stimulation modality and timing considerably different from those used for training.

  15. IC3 Internet and Computing Core Certification Global Standard 4 study guide

    CERN Document Server

    Rusen, Ciprian Adrian

    2015-01-01

    Hands-on IC3 prep, with expert instruction and loads of tools IC3: Internet and Computing Core Certification Global Standard 4 Study Guide is the ideal all-in-one resource for those preparing to take the exam for the internationally-recognized IT computing fundamentals credential. Designed to help candidates pinpoint weak areas while there's still time to brush up, this book provides one hundred percent coverage of the exam objectives for all three modules of the IC3-GS4 exam. Readers will find clear, concise information, hands-on examples, and self-paced exercises that demonstrate how to per

  16. Supply chains of forest chip production in Finland

    Energy Technology Data Exchange (ETDEWEB)

    Kaerhae, Kalle (Metsaeteho Oy, Helsinki (Finland)), e-mail: kalle.karha@metsateho.fi

    2010-07-15

    The Metsaeteho study investigated how logging residue chips, stump wood chips, and chips from small sized thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2008. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2008 by these suppliers was 6.5 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected in March-May 2009. The majority of the logging residue chips and chips from small-sized thinning wood were produced using the roadside chipping supply chain in Finland in 2008. The chipping at plant supply chain was also significant in the production of logging residue chips. 70% of all stump wood chips consumed were comminuted at the plant and 29% at terminals. The role of the terminal chipping supply chain was also significant in the production of chips from logging residues and small-sized wood chips. When producing chips from large-sized (rotten) roundwood, nearly a half of chips were comminuted at plants and more than 40% at terminals

  17. Supply systems of forest chip production in Finland

    Energy Technology Data Exchange (ETDEWEB)

    Kaerhae, K. (Metsaeteho Oy, Helsinki (Finland)), e-mail: kalle.karha@metsateho.fi

    2010-07-01

    The Metsaeteho study investigated how logging residue chips, stump wood chips, and chips from small-diameter thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2009. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2009 by these suppliers was 8,4 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected from March-May, 2010. The majority of the logging residue chips and chips from small-diameter thinning wood were produced using the roadside chipping supply system in Finland in 2009. The chipping at plant supply system was also significant in the production of logging residue chips. Nearly 70 % of all stump wood chips consumed were comminuted at the plant and 28 % at terminals. The role of the terminal chipping supply system was also significant in the production of chips from logging residues and small-diameter wood chips. When producing chips from large-sized (rotten) roundwood, similarly roughly 70 % of chips were comminuted at plants and 23 % at terminals. (orig.)

  18. Supply chains of forest chip production in Finland

    Energy Technology Data Exchange (ETDEWEB)

    Kaerhae, K. (Metsaeteho Oy, Helsinki (Finland)), Email: kalle.karha@metsateho.fi

    2009-07-01

    The Metsaeteho study investigated how logging residue chips. stump wood chips, and chips from small-sized thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2008. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2008 by these suppliers was 6,5 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected in March-May 2009. The majority of the logging residue chips and chips from small-sized thinning wood were produced using the roadside chipping supply chain in Finland in 2008. The chipping at plant supply chain was also significant in the production of logging residue chips. 70% of all stump wood chips consumed were comminuted at the plant and 29% at terminals. The role of the terminal chipping supply chain was also significant in the production of chips from logging residues and small-sized wood chips. When producing chips from large-sized (rotten) roundwood, nearly a half of chips were comminuted at plants and more than 40 % at terminals. (orig.)

  19. Experiment list: SRX122563 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  20. Experiment list: SRX122564 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  1. Experiment list: SRX122488 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 h

  2. Experiment list: SRX122510 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Egr1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-110 ht

  3. Experiment list: SRX122491 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

  4. Experiment list: SRX122519 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Irf2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http:

  5. Experiment list: SRX122548 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody... catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A

  6. Experiment list: SRX122468 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Rela || treatment=LPS || time=0 min || chip antibody manufacturer 1=Bethyl || chip antibody catalo...g number 1=A301-824A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-372 htt

  7. Experiment list: SRX122561 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  8. Experiment list: SRX122551 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ca...talog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A htt

  9. Experiment list: SRX122409 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Irf1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody cata...log number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 htt

  10. Experiment list: SRX122487 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 h

  11. Experiment list: SRX122546 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  12. Experiment list: SRX122552 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibo...dy catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753

  13. Experiment list: SRX122547 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

  14. Experiment list: SRX214084 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available turer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox17-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufac

  15. Experiment list: SRX122472 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Runx1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab61753 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-8564 http

  16. Experiment list: SRX122544 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

  17. Experiment list: SRX122408 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Irf1 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 http

  18. Experiment list: SRX122473 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Runx1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab61753 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-8564

  19. Experiment list: SRX122513 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Egr1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-110

  20. Experiment list: SRX214077 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available erentiated || treatment=Overexpress Sox17_V5 tagged || cell line=KH2 || chip antibody 1=Sox17 || chip antibody manufacture...r 1=R&D || chip antibody 2=V5 || chip antibody manufacturer 2=Invit

  1. Experiment list: SRX122497 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Rel || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http:

  2. Experiment list: SRX214082 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available facturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...age=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manu

  3. Experiment list: SRX122410 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog n...umber 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://db

  4. Experiment list: SRX122567 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 ht

  5. Experiment list: SRX122466 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Relb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Bethyl || chip antibody cata...log number 1=A302-183A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-226 h

  6. Experiment list: SRX122490 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

  7. Experiment list: SRX214068 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available inoic acid || cell line=F9 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufacturer 1=Santa Cruz || chip... antibody 2=none || chip antibody manufacturer 2=none http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachDat

  8. Experiment list: SRX122558 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available hip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antib...ody catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-75

  9. Experiment list: SRX122494 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available hip antibody=Atf4 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab28830-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-2

  10. Experiment list: SRX122545 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

  11. Experiment list: SRX186172 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 1=YY1 || chip antibody manufacturer 1=Abcam || chip antibody 2=YY1 || chip antibody manufacturer 2=Santa Cru...ip-Seq; Mus musculus; ChIP-Seq source_name=Rag1 -/- pro-B cells || chip antibody

  12. Experiment list: SRX122557 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available hip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antib...ody catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-75

  13. Experiment list: SRX122492 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

  14. Experiment list: SRX122493 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf4 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab28830-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-200

  15. Experiment list: SRX122571 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 http

  16. Experiment list: SRX122411 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog n...umber 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://db

  17. Experiment list: SRX122549 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody... catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A

  18. Experiment list: SRX122498 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Rel || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http:

  19. Experiment list: SRX122516 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Irf2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http:

  20. Experiment list: SRX122484 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cata...log number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 http

  1. Experiment list: SRX122514 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available tibody=Irf2 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog nu...mber 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://db

  2. Experiment list: SRX122570 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 ht

  3. Experiment list: SRX214080 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available cturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufa

  4. Experiment list: SRX122569 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 h

  5. Experiment list: SRX122511 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Egr1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-11

  6. Experiment list: SRX122471 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Rela || treatment=LPS || time=60 min || chip antibody manufacturer 1=Bethyl || chip antibody cat...alog number 1=A301-824A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-372

  7. Experiment list: SRX122495 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Rel || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody catal...og number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http://

  8. Experiment list: SRX122554 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibo...dy catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753

  9. Experiment list: SRX214081 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available cturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufa

  10. Possibilities for mixed mode chip manufacturing in EUROPRACTICE

    Science.gov (United States)

    Das, C.

    1997-02-01

    EUROPRACTICE is an EC initiative under the ESPRIT programme which aims to stimulate the wider exploitation of state-of-the-art microelectronics technologies by European industry and to enhance European industrial competitiveness in the global market-place. Through EUROPRACTICE, the EC has created a range of Basic Services that offer users a cost-effective and flexible means of accessing three main microelectronics-based technologies: Application Specific Integrated Circuit (ASICs), Multi-Chip Modules (MCMs) and Microsystems. EUROPRACTICE Basic Services reduce the cost and risk for companies wishing to begin using these technologies. EUROPRACTICE offers a fully supported, low cost route for companies to design and fabricate ASICs for their individual applications. Low cost is achieved by consolidating designs from many users onto a single semiconductor wafer (MPW: Multi Project Wafer). The EUROPRACTICE IC Manufacturing Service (ICMS) offers a broad range of fabrication technologies including CMOS, BiCMOS and GaAs. The Service extends from enabling users to produce prototype ASICs for testing and evaluation, through to low-volume production runs.

  11. Interface thermal characteristics of flip chip packages - A numerical study

    International Nuclear Information System (INIS)

    Kandasamy, Ravi; Mujumdar, A.S.

    2009-01-01

    Flip chip ball grid array (FC-BGA) packages are commonly used for high inputs/outputs (I/O) ICs; they have been proven to provide good solutions for a variety of applications to maximize thermal and electrical performance. A fundamental limitation to such devices is the thermal resistance at the top of the package, which is characterized θ JC parameter. The die-to-lid interface thermal resistance is identified as a critical issue for the thermal management of electronic packages. This paper focuses on the effect of the interface material property changes on the interface thermal resistance. The effect of package's junction to case (Theta-JC or θ JC ) thermal performance is investigated for bare die, flat lid and cup lid packages using a validated thermal model. Thermal performance of a cup or flat lid attached and bare die packages were investigated for different interface materials. Improved Theta-JC performance was observed for the large die as compared to the smaller die. Several parametric studies were carried out to understand the effects of interface bond line thickness (BLT), different die sizes, the average void size during assembly and thermal conductivity of interface materials on package thermal resistance

  12. Hard rock tunnel boring machine penetration test as an indicator of chipping process efficiency

    Directory of Open Access Journals (Sweden)

    M.C. Villeneuve

    2017-08-01

    Full Text Available The transition from grinding to chipping can be observed in tunnel boring machine (TBM penetration test data by plotting the penetration rate (distance/revolution against the net cutter thrust (force per cutter over the full range of penetration rates in the test. Correlating penetration test data to the geological and geomechanical characteristics of rock masses through which a penetration test is conducted provides the ability to reveal the efficiency of the chipping process in response to changing geological conditions. Penetration test data can also be used to identify stress-induced tunnel face instability. This research shows that the strength of the rock is an important parameter for controlling how much net cutter thrust is required to transition from grinding to chipping. It also shows that the geological characteristics of a rock will determine how efficient chipping occurs once it has begun. In particular, geological characteristics that lead to efficient fracture propagation, such as fabric and mica contents, will lead to efficient chipping. These findings will enable a better correlation between TBM performance and geological conditions for use in TBM design, as a basis for contractual payments where penetration rate dominates the excavation cycle and in further academic investigations into the TBM excavation process.

  13. Chip-to-Chip Half Duplex Spiking Data Communication over Power Supply Rails

    Science.gov (United States)

    Hashida, Takushi; Nagata, Makoto

    Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at more than 100Mbps. A pair of transceivers consumes 1.35mA from 3.3V, at 130Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by 30dB, purifying power supply current for internal circuits. Bi-directional spiking communication was successfully examined in a 90-nm CMOS prototype setup of on-chip waveform capturing. A micro controller forwards clock pulses to and receives data streams from a comparator based waveform capturer formed on a different chip, through a single pair of power and ground traces. The bit error rate is small enough not to degrade waveform acquisition capability, maintaining the spurious free dynamic range of higher than 50dB.

  14. Addressing On-Chip Power Converstion and Dissipation Issues in Many-Core System-on-a-Chip Based on Conventional Silicon and Emerging Nanotechnologies

    Science.gov (United States)

    Ashenafi, Emeshaw

    Integrated circuits (ICs) are moving towards system-on-a-chip (SOC) designs. SOC allows various small and large electronic systems to be implemented in a single chip. This approach enables the miniaturization of design blocks that leads to high density transistor integration, faster response time, and lower fabrication costs. To reap the benefits of SOC and uphold the miniaturization of transistors, innovative power delivery and power dissipation management schemes are paramount. This dissertation focuses on on-chip integration of power delivery systems and managing power dissipation to increase the lifetime of energy storage elements. We explore this problem from two different angels: On-chip voltage regulators and power gating techniques. On-chip voltage regulators reduce parasitic effects, and allow faster and efficient power delivery for microprocessors. Power gating techniques, on the other hand, reduce the power loss incurred by circuit blocks during standby mode. Power dissipation (Ptotal = Pstatic and Pdynamic) in a complementary metal-oxide semiconductor (CMOS) circuit comes from two sources: static and dynamic. A quadratic dependency on the dynamic switching power and a more than linear dependency on static power as a form of gate leakage (subthreshold current) exist. To reduce dynamic power loss, the supply power should be reduced. A significant reduction in power dissipation occurs when portions of a microprocessor operate at a lower voltage level. This reduction in supply voltage is achieved via voltage regulators or converters. Voltage regulators are used to provide a stable power supply to the microprocessor. The conventional off-chip switching voltage regulator contains a passive floating inductor, which is difficult to be implemented inside the chip due to excessive power dissipation and parasitic effects. Additionally, the inductor takes a very large chip area while hampering the scaling process. These limitations make passive inductor based on-chip

  15. Realtime 3D stress measurement in curing epoxy packaging

    DEFF Research Database (Denmark)

    Richter, Jacob; Hyldgård, A.; Birkelund, Karen

    2007-01-01

    This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process...

  16. Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

    NARCIS (Netherlands)

    Duan, P.; Raz, O.; Smalbrugge, B.E.; Plassche, van de K.L.; Dorren, H.J.S.

    2013-01-01

    Wafer scale fabrication of the 3D stacked transceivers is discussed. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology is robust.

  17. Generic test platform for representative tests of safety I/C systems - 15546

    International Nuclear Information System (INIS)

    Fourestie, B.; Kuck, H.; Richter, J.; Rieche, S.; Waitz, M.

    2015-01-01

    In compliance with the IEC 61513 safety Instrumentation and Control (I/C) systems must be successfully validated in their final configuration prior to installation on site and commissioning. However the contingent need for modifications during system validation activities or subsequently during the commissioning phase may entail long and costly re-engineering of the I/C systems. With the view to ease these possible modifications, a Generic Test Platform has been developed by AREVA which allows combining a real I/C system subpart with an emulation server. This platform provides a faithful representation of the I/C System allowing crediting the validation test results carried out on this platform. (authors)

  18. Dead-time free pixel readout architecture for ATLAS front-end IC

    CERN Document Server

    Einsweiler, Kevin F; Kleinfelder, S A; Luo, L; Marchesini, R; Milgrome, O; Pengg, F X

    1999-01-01

    A low power sparse scan readout architecture has been developed for the ATLAS pixel front-end IC. The architecture supports a dual discriminator and extracts the time over threshold (TOT) information along with a 2-D spatial address $9 of the hits associating them with a unique 7-bit beam crossing number. The IC implements level-1 trigger filtering along with event building (grouping together all hits in a beam crossing) in the end of column (EOC) buffer. The $9 events are transmitted over a 40 MHz serial data link with the protocol supporting buffer overflow handling by appending error flags to events. This mixed-mode full custom IC is implemented in 0.8 mu HP process to meet the $9 requirements for the pixel readout in the ATLAS inner detector. The circuits have been tested and the IC provides dead-time-less ambiguity free readout at 40 MHz data rate.

  19. CMOS analog integrated circuit design technology; CMOS anarogu IC sekkei gijutsu

    Energy Technology Data Exchange (ETDEWEB)

    Fujimoto, H.; Fujisawa, A. [Fuji Electric Co. Ltd., Tokyo (Japan)

    2000-08-10

    In the field of the LSI (large scale integrated circuit) in rapid progress toward high integration and advanced functions, CAD (computer-aided design) technology has become indispensable to LSI development within a short period. Fuji Electric has developed design technologies and automatic design system to develop high-quality analog ICs (integrated circuits), including power supply ICs. within a short period. This paper describes CMOS (complementary metal-oxide semiconductor) analog macro cell, circuit simulation, automatic routing, and backannotation technologies. (author)

  20. Cytostretch, an Organ-on-Chip Platform

    Directory of Open Access Journals (Sweden)

    Nikolas Gaio

    2016-07-01

    Full Text Available Organ-on-Chips (OOCs are micro-fabricated devices which are used to culture cells in order to mimic functional units of human organs. The devices are designed to simulate the physiological environment of tissues in vivo. Cells in some types of OOCs can be stimulated in situ by electrical and/or mechanical actuators. These actuations can mimic physiological conditions in real tissue and may include fluid or air flow, or cyclic stretch and strain as they occur in the lung and heart. These conditions similarly affect cultured cells and may influence their ability to respond appropriately to physiological or pathological stimuli. To date, most focus has been on devices specifically designed to culture just one functional unit of a specific organ: lung alveoli, kidney nephrons or blood vessels, for example. In contrast, the modular Cytostretch membrane platform described here allows OOCs to be customized to different OOC applications. The platform utilizes silicon-based micro-fabrication techniques that allow low-cost, high-volume manufacturing. We describe the platform concept and its modules developed to date. Membrane variants include membranes with (i through-membrane pores that allow biological signaling molecules to pass between two different tissue compartments; (ii a stretchable micro-electrode array for electrical monitoring and stimulation; (iii micro-patterning to promote cell alignment; and (iv strain gauges to measure changes in substrate stress. This paper presents the fabrication and the proof of functionality for each module of the Cytostretch membrane. The assessment of each additional module demonstrate that a wide range of OOCs can be achieved.

  1. Simultaneous detection of three lily viruses using Triplex IC-RT-PCR.

    Science.gov (United States)

    Zhang, Yubao; Wang, Yajun; Xie, Zhongkui; Yang, Guo; Guo, Zhihong; Wang, Le

    2017-11-01

    Viruses commonly infecting lily (Lilium spp.) include: Lily symptomless virus (LSV), Cucumber mosaic virus (CMV) and Lily mottle virus (LMoV). These viruses usually co-infect lilies causing severe economic losses in terms of quantity and quality of flower and bulb production around the world. Reliable and precise detection systems need to be developed for virus identification. We describe the development of a triplex immunocapture (IC) reverse transcription (RT) polymerase chain reaction (PCR) assay for the simultaneous detection of LSV, CMV and LMoV. The triplex IC-RT-PCR was compared with a quadruplex RT-PCR assay. Relative to the quadruplex RT-PCR, the specificity of the triplex IC-RT-PCR system for LSV, CMV and LMoV was 100% for field samples. The sensitivity of the triplex IC-RT-PCR system was 99.4%, 81.4% and 98.7% for LSV, CMV and LMoV, respectively. Agreement (κ) between the results obtained from the two tests was 0.968, 0.844 and 0.984 for LSV, CMV and LMoV, respectively. This is the first report of the simultaneous detection of LSV, CMV and LMoV in a triplex IC-RT-PCR assay. In particular we believe this convenient and reliable triplex IC-RT-PCR method could be used routinely for large-scale field surveys or crop health monitoring of lily. Copyright © 2017. Published by Elsevier B.V.

  2. PENGARUH IC TERHADAP KINERJA KEUANGAN PERUSAHAAN PERBANKAN PERIODE 2005-2007

    Directory of Open Access Journals (Sweden)

    Subkhan -

    2012-03-01

    Full Text Available Tujuan dari penelitian ini adalah untuk meneliti pengaruh intellectual capital (IC perusahaan pada kinerja keuangan mereka. Penelitian ini menggunakan Public Framework dan data dari 57 sektor perbankan Indonesia yang tercatat antara tahun 2005 dan 2007 pada Indonesian Stock Exchange. Penelitian ini menggunakan partial least square (PLS untuk menganalisis data. 3 elemen IC dan kinerja perusahaan dites dalam penelitian ini. Hasilnya memperlihatkan bahwa IC dan kinerja keuangan mempunyai pengaruh yang signifikan, VACA mempunyai pengaruh yang signifikan terhadap kinerja keuangan, VAHU mempuyai pengaruh yang signifikan  terhadap kinerja keuangan, dan STVA mempunyai pengaruh yang signifikan terhadap kinerja keuangan. Abstract The objective of this study is to investigate the influence of firm’s intellectual capital (IC on their financial performance. This paper uses Public Framework and data from 57 Indonesian banking sectors listed between 2005 and 2007 on the Indonesian Stock Exchange. This study uses partial least square (PLS for data analysis. Three elements of IC and company performances are tested by this study. The results show that IC and financial performance have significant influence, VACA has significant influence to financial performance, VAHU has significant influence to financial performance, and STVA has significant influence to financial performance.Keywords: intellectual capital; financial performance

  3. PENGARUH MEKANISME CORPORATE GOVERNANCE TERHADAP PENGUNGKAPAN INTELLECTUAL CAPITAL: PADA PERUSAHAAN IC INTENSIVE

    Directory of Open Access Journals (Sweden)

    Dista Amalia Arifah

    2012-12-01

    Full Text Available Intangible asset proxied by Intellectual Capital has important role to drive companies values creation. Although many companies have applied corporate governance mechanism in order to have IC disclosure recognition, most of them do not focus on Intellectual Capital disclosure yet. The aim of this study is to analyze the influence of corporate governance mechanisms consisting of size of the board commissioners, the independence level of independent commissioner, the activities of independent commissioners, and audit committee on the intellectual capital disclosures of the companies listed in BEI in 2009 using intensive ICs category with the adding of kontrol variables. This study will provide an illustration on how the mechanisms of corporate governance practices and IC disclosure become a value creation source for the company. There are a total of 176 companies categorized as IC intensive. Using a purposive sampling method, 45 companies were selected as samples. The 2009 annual reports of the companies are used as secondary data source of this research. Furthermore, to get ICs disclosure data content analysis technique was used both for quantity and quality terms. The results indicate that audit committee is the only corporate governance mechanism that significantly affects the level of IC disclosures.

  4. Sensitivity Study on Availability of I&C Components Using Bayesian Network

    Directory of Open Access Journals (Sweden)

    Rahman Khalil Ur

    2013-01-01

    Full Text Available The objective of this study is to find out the impact of instrumentation and control (I&C components on the availability of I&C systems in terms of sensitivity analysis using Bayesian network. The analysis has been performed on I&C architecture of reactor protection system. The analysis results would be applied to develop I&C architecture which will meet the desire reliability features and save cost. RPS architecture unavailability P(x=0 and availability P(x=1 were estimated to 6.1276E-05 and 9.9994E-01 for failure (0 and perfect (1 states, respectively. The impact of I&C components on overall system risk has been studied in terms of risk achievement worth (RAW and risk reduction worth (RRW. It is found that circuit breaker failure (TCB, bi-stable processor (BP, sensor transmitter (TR, and pressure transmitter (PT have high impact on risk. The study concludes and recommends that circuit breaker bi-stable processor should be given more consideration while designing I&C architecture.

  5. Haploinsufficiency of the E3 ubiquitin ligase C-terminus of heat shock cognate 70 interacting protein (CHIP produces specific behavioral impairments.

    Directory of Open Access Journals (Sweden)

    Bethann McLaughlin

    Full Text Available The multifunctional E3 ubiquitin ligase CHIP is an essential interacting partner of HSP70, which together promote the proteasomal degradation of client proteins. Acute CHIP overexpression provides neuroprotection against neurotoxic mitochondrial stress, glucocorticoids, and accumulation of toxic amyloid fragments, as well as genetic mutations in other E3 ligases, which have been shown to result in familial Parkinson's disease. These studies have created a great deal of interest in understanding CHIP activity, expression and modulation. While CHIP knockout mice have the potential to provide essential insights into the molecular control of cell fate and survival, the animals have been difficult to characterize in vivo due to severe phenotypic and behavioral dysfunction, which have thus far been poorly characterized. Therefore, in the present study we conducted a battery of neurobehavioral and physiological assays of adult CHIP heterozygotic (HET mutant mice to provide a better understanding of the functional consequence of CHIP deficiency. We found that CHIP HET mice had normal body and brain weight, body temperature, muscle tone and breathing patterns, but do have a significant elevation in baseline heart rate. Meanwhile basic behavioral screens of sensory, motor, emotional and cognitive functions were normative. We observed no alterations in performance in the elevated plus maze, light-dark preference and tail suspension assays, or two simple cognitive tasks: novel object recognition and spontaneous alternation in a Y maze. Significant deficits were found, however, when CHIP HET mice performed wire hang, inverted screen, wire maneuver, and open field tasks. Taken together, our data indicate a clear subset of behaviors that are altered at baseline in CHIP deficient animals, which will further guide whole animal studies of the effects of CHIP dysregulation on cardiac function, brain circuitry and function, and responsiveness to environmental and

  6. Instrument for measuring moisture in wood chips

    Energy Technology Data Exchange (ETDEWEB)

    Werme, L

    1980-06-01

    A method to determine the moisture content in wood chips, in batch and on-line, has been investigated. The method can be used for frozen and non frozen chips. Samples of wood chips are thawn and dryed with microwaves. During the drying the sample is weighed continously and the rate of drying is measured. The sample is dried t 10 percent moisture content. The result is extrapolated to the drying rate zero. The acccuracy at the method is 1.6 to 1.7 percent for both frozen and non frozen chips. The accuracy of the method is considered acceptable, but sofisticated sampling equipment is necessary. This makes the method too complex to make the instrument marketable.

  7. Medicaid CHIP Environmental Scanning and Program Char...

    Data.gov (United States)

    U.S. Department of Health & Human Services — ESPC development is sponsored by the CMS Center for Medicare and Medicaid Innovation in partnership with the Center for Medicaid and CHIP Services (CMCS) under the...

  8. Wafer of Intel Pentium 4 Prescott Chips

    CERN Multimedia

    Silicon wafer with hundreds of Penryn cores (microprocessor). There are around four times as many Prescott chips can be made per wafer than with the previous generation of Northwood-core Pentium 4 processors. It is faster and cheaper.

  9. On-chip power delivery and management

    CERN Document Server

    Vaisband, Inna P; Popovich, Mikhail; Mezhiba, Andrey V; Köse, Selçuk; Friedman, Eby G

    2016-01-01

    This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

  10. Distributed Processing Using Single-chip Microcomputers

    National Research Council Canada - National Science Library

    Pritchett, William

    1996-01-01

    This project investigates the use of single-chip microprocessors as nodes in a token ring control network and explores the implementation of a protocol to manage communication across such a network...

  11. Optical bio-sensors in microfluidic chips

    NARCIS (Netherlands)

    Pollnau, Markus; Dongre, C.; Pham Van So, P.V.S.; Bernhardi, Edward; Worhoff, Kerstin; de Ridder, R.M.; Hoekstra, Hugo

    2012-01-01

    Direct femtosecond laser writing is used to integrate optical waveguides that intersect the microfluidic channels in a commercial optofluidic chip. With laser excitation, fluorescently labeled DNA molecules of different sizes are separated by capillary electrophoresis with high operating speed and

  12. Optics and molecules on atom chips

    International Nuclear Information System (INIS)

    Tscherneck, M; Holmes, M E; Quinto-Su, P A; Haimberger, C; Kleinert, J; Bigelow, N P

    2005-01-01

    In this paper we will report on four experiments which have been carried out in the last year in our group. All of these experiments are necessary steps towards the trapping and probing of ultracold molecules on a chip surface

  13. The CHIP surveys | IDRC - International Development Research ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    2011-07-08

    Jul 8, 2011 ... Many of the young scholars relied on data generated by the China Household Income Project (CHIP), a collaboration between Chinese and international economists that has tracked inequality in China for the past 20 years.

  14. Industry trends in chip storage and handling

    Science.gov (United States)

    Tim McDonald; Alastair Twaddle

    2000-01-01

    A survey was conducted of US pulp and paper mills to characterize chip pile management trends. The survey was developed by members of the TAPPI Fiber Raw Material Supply Committee and mailed out in December of 1999. There were a total of 80 respondents to the survey. A typical mill was foudn to maintain one sofhvood and one hardwood chip pile, with maximum inventory of...

  15. FY1995 evolvable hardware chip; 1995 nendo shinkasuru hardware chip

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-03-01

    This project aims at the development of 'Evolvable Hardware' (EHW) which can adapt its hardware structure to the environment to attain better hardware performance, under the control of genetic algorithms. EHW is a key technology to explore the new application area requiring real-time performance and on-line adaptation. 1. Development of EHW-LSI for function level hardware evolution, which includes 15 DSPs in one chip. 2. Application of the EHW to the practical industrial applications such as data compression, ATM control, digital mobile communication. 3. Two patents : (1) the architecture and the processing method for programmable EHW-LSI. (2) The method of data compression for loss-less data, using EHW. 4. The first international conference for evolvable hardware was held by authors: Intl. Conf. on Evolvable Systems (ICES96). It was determined at ICES96 that ICES will be held every two years between Japan and Europe. So the new society has been established by us. (NEDO)

  16. Materials for microfluidic chip fabrication.

    Science.gov (United States)

    Ren, Kangning; Zhou, Jianhua; Wu, Hongkai

    2013-11-19

    Through manipulating fluids using microfabricated channel and chamber structures, microfluidics is a powerful tool to realize high sensitive, high speed, high throughput, and low cost analysis. In addition, the method can establish a well-controlled microenivroment for manipulating fluids and particles. It also has rapid growing implementations in both sophisticated chemical/biological analysis and low-cost point-of-care assays. Some unique phenomena emerge at the micrometer scale. For example, reactions are completed in a shorter amount of time as the travel distances of mass and heat are relatively small; the flows are usually laminar; and the capillary effect becomes dominant owing to large surface-to-volume ratios. In the meantime, the surface properties of the device material are greatly amplified, which can lead to either unique functions or problems that we would not encounter at the macroscale. Also, each material inherently corresponds with specific microfabrication strategies and certain native properties of the device. Therefore, the material for making the device plays a dominating role in microfluidic technologies. In this Account, we address the evolution of materials used for fabricating microfluidic chips, and discuss the application-oriented pros and cons of different materials. This Account generally follows the order of the materials introduced to microfluidics. Glass and silicon, the first generation microfluidic device materials, are perfect for capillary electrophoresis and solvent-involved applications but expensive for microfabriaction. Elastomers enable low-cost rapid prototyping and high density integration of valves on chip, allowing complicated and parallel fluid manipulation and in-channel cell culture. Plastics, as competitive alternatives to elastomers, are also rapid and inexpensive to microfabricate. Their broad variety provides flexible choices for different needs. For example, some thermosets support in-situ fabrication of

  17. Influences of Cutting Speed and Material Mechanical Properties on Chip Deformation and Fracture during High-Speed Cutting of Inconel 718

    Directory of Open Access Journals (Sweden)

    Bing Wang

    2018-03-01

    Full Text Available The paper aims to investigate the influences of material constitutive and fracture parameters in addition to cutting speed on chip formation during high-speed cutting of Inconel 718. Finite element analyses for chip formation are conducted with Johnson–Cook constitutive and fracture models. Meanwhile, experiments of high-speed orthogonal cutting are performed to verify the simulation results with cutting speeds ranging from 50 m/min to 7000 m/min. The research indicates that the chip morphology transforms from serrated to fragmented at the cutting speed of 7000 m/min due to embrittlement of the workpiece material under ultra-high cutting speeds. The parameter of shear localization sensitivity is put forward to describe the influences of material mechanical properties on serrated chip formation. The results demonstrate that the effects of initial yield stress and thermal softening coefficient on chip shear localization are much more remarkable than the other constitutive parameters. For the material fracture parameters, the effects of initial fracture strain and exponential factor of stress state on chip shear localization are more much prominent. This paper provides guidance for controlling chip formation through the adjustment of material mechanical properties and the selection of appropriate cutting parameters.

  18. Influences of Cutting Speed and Material Mechanical Properties on Chip Deformation and Fracture during High-Speed Cutting of Inconel 718.

    Science.gov (United States)

    Wang, Bing; Liu, Zhanqiang; Hou, Xin; Zhao, Jinfu

    2018-03-21

    The paper aims to investigate the influences of material constitutive and fracture parameters in addition to cutting speed on chip formation during high-speed cutting of Inconel 718. Finite element analyses for chip formation are conducted with Johnson-Cook constitutive and fracture models. Meanwhile, experiments of high-speed orthogonal cutting are performed to verify the simulation results with cutting speeds ranging from 50 m/min to 7000 m/min. The research indicates that the chip morphology transforms from serrated to fragmented at the cutting speed of 7000 m/min due to embrittlement of the workpiece material under ultra-high cutting speeds. The parameter of shear localization sensitivity is put forward to describe the influences of material mechanical properties on serrated chip formation. The results demonstrate that the effects of initial yield stress and thermal softening coefficient on chip shear localization are much more remarkable than the other constitutive parameters. For the material fracture parameters, the effects of initial fracture strain and exponential factor of stress state on chip shear localization are more much prominent. This paper provides guidance for controlling chip formation through the adjustment of material mechanical properties and the selection of appropriate cutting parameters.

  19. Definition of intercultural competence (IC) in undergraduate students at a private university in the USA: A mixed-methods study.

    Science.gov (United States)

    Gierke, Lioba; Binder, Nadine; Heckmann, Mark; Odağ, Özen; Leiser, Anne; Kedzior, Karina Karolina

    2018-01-01

    Intercultural competence (IC) is an important skill to be gained from higher education. However, it remains unclear what IC means to students and what factors might influence their definitions of IC. The aim of the current study was to qualitatively assess how students at one higher education institution in the USA define IC and to quantitatively test for relationships among IC components and various demographic characteristics, including intercultural experience and study context. A further aim was to descriptively compare the IC definitions from the US sample with the definitions obtained from another sample of university students in Germany. A purposive sample of n = 93 undergraduate, second semester students at Dickinson College, USA, participated in the study by completing an online questionnaire. The qualitative data were content-analyzed to define the dimensions of IC. The quantitative data were cluster-analyzed to assess the multivariate relationships among the IC components and the demographic characteristics of the sample. The most important dimensions of IC were Knowledge, External Outcomes (interaction, communication), and Attitudes (respect, tolerance) according to the US sample. The most frequently chosen dimensions of IC differed between both samples: Knowledge was chosen by the sample in the USA while External Outcomes was chosen by the sample in Germany. Relative to the US sample, significantly more students chose Attitudes, External Outcomes, and Intrapersonal Skills in the sample in Germany. The relationships among IC components and demographic characteristics were only weak in the US sample. A person with IC was rated as Open-minded and Respectful by students who lived predominantly in the USA or Tolerant and Curious by those who lived outside the USA for at least six months. The current results suggest that students residing in two countries (USA or Germany) define IC using similar dimensions. However, IC definitions may depend on the

  20. The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

    Directory of Open Access Journals (Sweden)

    Amlan Ganguly

    2018-02-01

    Full Text Available With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

  1. ICS logging solution for network-based attacks using Gumistix technology

    Science.gov (United States)

    Otis, Jeremy R.; Berman, Dustin; Butts, Jonathan; Lopez, Juan

    2013-05-01

    Industrial Control Systems (ICS) monitor and control operations associated with the national critical infrastructure (e.g., electric power grid, oil and gas pipelines and water treatment facilities). These systems rely on technologies and architectures that were designed for system reliability and availability. Security associated with ICS was never an inherent concern, primarily due to the protections afforded by network isolation. However, a trend in ICS operations is to migrate to commercial networks via TCP/IP in order to leverage commodity benefits and cost savings. As a result, system vulnerabilities are now exposed to the online community. Indeed, recent research has demonstrated that many exposed ICS devices are being discovered using readily available applications (e.g., ShodanHQ search engine and Google-esque queries). Due to the lack of security and logging capabilities for ICS, most knowledge about attacks are derived from real world incidents after an attack has already been carried out and the damage has been done. This research provides a method for introducing sensors into the ICS environment that collect information about network-based attacks. The sensors are developed using an inexpensive Gumstix platform that can be deployed and incorporated with production systems. Data obtained from the sensors provide insight into attack tactics (e.g., port scans, Nessus scans, Metasploit modules, and zero-day exploits) and characteristics (e.g., attack origin, frequency, and level of persistence). Findings enable security professionals to draw an accurate, real-time awareness of the threats against ICS devices and help shift the security posture from reactionary to preventative.

  2. EVIDENCE FOR AN INTERACTION IN THE NEAREST STARBURSTING DWARF IRREGULAR GALAXY IC 10

    International Nuclear Information System (INIS)

    Nidever, David L.; Slater, Colin T.; Bell, Eric F.; Ashley, Trisha; Simpson, Caroline E.; Ott, Jürgen; Johnson, Megan; Stanimirović, Snežana; Putman, Mary; Majewski, Steven R.; Jütte, Eva; Oosterloo, Tom A.; Burton, W. Butler

    2013-01-01

    Using deep 21 cm H I data from the Green Bank Telescope we have detected an ≳18.3 kpc long gaseous extension associated with the starbursting dwarf galaxy IC 10. The newly found feature stretches 1.°3 to the northwest and has a large radial velocity gradient reaching to ∼65 km s –1 lower than the IC 10 systemic velocity. A region of higher column density at the end of the extension that possesses a coherent velocity gradient (∼10 km s –1 across ∼26') transverse to the extension suggests rotation and may be a satellite galaxy of IC 10. The H I mass of IC 10 is 9.5 × 10 7 (d/805 kpc) 2 M ☉ and the mass of the new extension is 7.1 × 10 5 (d/805 kpc) 2 M ☉ . An IC 10-M31 orbit using known radial velocity and proper motion values for IC 10 show that the H I extension is inconsistent with the trailing portion of the orbit so that an M31-tidal or ram pressure origin seems unlikely. We argue that the most plausible explanation for the new feature is that it is the result of a recent interaction (and possible late merger) with another dwarf galaxy. This interaction could not only have triggered the origin of the recent starburst in IC 10, but could also explain the existence of previously found counter-rotating H I gas in the periphery of the IC 10 which was interpreted as originating from primordial gas infall

  3. Discovery Mondays: Chips with everything!

    CERN Multimedia

    2003-01-01

    Electronics to hear the sound of matter From the TV to the fridge, the wristwatch to the washing machine, hardly any consumer product in this day and age can escape the influence of electronics, and the ever more powerful microchip. So it's hardly surprising to learn that such sophisticated devices as particle detectors are bristling with the best and most powerful microchips technology has to offer! Particle detectors known as trackers are like 3-D digital cameras. They are used to detect the tracks of particles created in the accelerator and to pin down their momentum and thus their identity. A chip seen with a microscope.Come to Microcosm and see with your own eyes a silicon detector, packed full of electronic microchips. Get up closer with a microscope and admire the way in which the fine details of the etchings break down light. Further on, watch a TV as you've never done before - from the inside! Then try out our special simulation game that helps you understand the purpose of a particle detector. Bu...

  4. Flip chip assembly of thinned chips for hybrid pixel detector applications

    CERN Document Server

    Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

  5. On-chip digital power supply control for system-on-chip applications

    NARCIS (Netherlands)

    Meijer, M.; Pineda de Gyvez, J.; Otten, R.H.J.M.

    2005-01-01

    The authors presented an on-chip, fully-digital, power-supply control system. The scheme consists of two independent control loops that regulate power supply variations due to semiconductor process spread, temperature, and chip's workload. Smart power-switches working as linear voltage regulators

  6. Purification, crystallization and preliminary X-ray analysis of aminoglycoside-2′′-phosphotransferase-Ic [APH(2′′)-Ic] from Enterococcus gallinarum

    International Nuclear Information System (INIS)

    Byrnes, Laura J.; Badarau, Adriana; Vakulenko, Sergei B.; Smith, Clyde A.

    2008-01-01

    APH(2′′)-Ic is an enzyme that is responsible for high-level gentamicin resistance in E. gallinarum isolates. Crystals of the wild-type enzyme and three mutants have been prepared and a complete X-ray diffraction data set was collected to 2.15 Å resolution from an F108L crystal. Bacterial resistance to aminoglycoside antibiotics is primarily the result of deactivation of the drugs. Three families of enzymes are responsible for this activity, with one such family being the aminoglycoside phosphotransferases (APHs). The gene encoding one of these enzymes, aminoglycoside-2′′-phosphotransferase-Ic [APH(2′′)-Ic] from Enterococcus gallinarum, has been cloned and the wild-type protein (comprising 308 amino-acid residues) and three mutants that showed elevated minimum inhibitory concentrations towards gentamicin (F108L, H258L and a double mutant F108L/H258L) were expressed in Escherichia coli and subsequently purified. All APH(2′′)-Ic variants were crystallized in the presence of 14–20%(w/v) PEG 4000, 0.25 M MgCl 2 , 0.1 M Tris–HCl pH 8.5 and 1 mM Mg 2 GTP. The crystals belong to the monoclinic space group C2, with one molecule in the asymmetric unit. The approximate unit-cell parameters are a = 82.4, b = 54.2, c = 77.0 Å, β = 108.8°. X-ray diffraction data were collected to approximately 2.15 Å resolution from an F108L crystal at beamline BL9-2 at SSRL, Stanford, California, USA

  7. Intellectual Capital (IC Analysis and The Effect to Financial Performance in PT Kalasuba Indonesia (KSI

    Directory of Open Access Journals (Sweden)

    Dwi Ermayanti Susilo

    2016-10-01

    Full Text Available Financial Performance (FP is one of the important things for a company to know the development of the company. One important thing that influences FP is the Intellectual Capital (IC. Research was conducted to get the best IC analysis in order to get success and fulfill the daily human needs which always increases. Therefore, it had research problem ‘how was the components of IC affecting the FP of PT Kalasuba Indonesia (KSI, and the objective is to explore the IC components in affecting the FP. It was interesting to be explored because it had unique characteristics, which consist of spiritual knowledge, attitude, discipline, management knowledge and managerial experience, as well as skill and capabilities, in which the first three points were different from the rest. It used qualitative analysis method as the instrument. It was done by collecting the data through observation and was analyzed using the Robbins theory. It can be concluded that those five IC has important effect in increasing FP of PT KSI and keeping it stable.

  8. AREVA advanced safety IC solutions and licensing experience for new nuclear builds and modernization projects - 15545

    International Nuclear Information System (INIS)

    Fourestie, B.; Pickelmann, J.; Richter, S.; Hilsenkopf, P.; Paris, P.

    2015-01-01

    Regulatory requirements for the Instrumentation and Control (IC) for Nuclear Power Plants have become significantly more stringent during the last 10 years in the areas of software development and qualification, traceability, diversity, or seismic requirements for instance, and with the introduction of new standards (such as the IEC 62566, or the IEC 62003). Based on a large and comprehensive experience gained from projects in several regulatory environments and different plant types (including non-OEM plants), AREVA has developed and adapted its processes and products to provide state-of-the-art IC solutions in full compliance with the regulatory demands and requirements in terms of robustness (independence, defense-in-depth, diversity and cyber-security). In this paper we present the safety IC platforms developed by AREVA. These platforms include TELEPERM XS as the computerized safety IC platform for class 1 system implementation, the Qualified Display System (QDS) for safety classified screen-based interface, and UNICORN as fully diverse analog safety IC platform for backup systems

  9. A nu-space for ICS: characterization and application to measure protein transport in live cells.

    Science.gov (United States)

    Potvin-Trottier, Laurent; Chen, Lingfeng; Horwitz, Alan Rick; Wiseman, Paul W

    2013-08-01

    We introduce a new generalized theoretical framework for image correlation spectroscopy (ICS). Using this framework, we extend the ICS method in time-frequency ( ν , nu) space to map molecular flow of fluorescently tagged proteins in individual living cells. Even in the presence of a dominant immobile population of fluorescent molecules, nu-space ICS (nICS) provides an unbiased velocity measurement, as well as the diffusion coefficient of the flow, without requiring filtering. We also develop and characterize a tunable frequency-filter for STICS that allows quantification of the density, the diffusion coefficient and the velocity of biased diffusion. We show that the techniques are accurate over a wide range of parameter space in computer simulation. We then characterize the retrograde flow of adhesion proteins ( α 6- and αLβ 2-GFP integrins and mCherry-paxillin) in CHO.B2 cells plated on laminin and ICAM ligands respectively. STICS with a tunable frequency filter, in conjunction with nICS, measures two new transport parameters, the density and transport bias coefficient (a measure of the diffusive character of a flow/biased diffusion), showing that molecular flow in this cell system has a significant diffusive component. Our results suggest that the integrinligand interaction, along with the internal myosin-motor generated force, varies for different integrin-ligand pairs, consistent with previous results.

  10. A GRB and Broad-lined Type Ic Supernova from a Single Central Engine

    Science.gov (United States)

    Barnes, Jennifer; Duffell, Paul C.; Liu, Yuqian; Modjaz, Maryam; Bianco, Federica B.; Kasen, Daniel; MacFadyen, Andrew I.

    2018-06-01

    Unusually high velocities (≳0.1c) and correspondingly high kinetic energies have been observed in a subset of Type Ic supernovae (so-called “broad-lined Ic” supernovae; SNe Ic-BL), prompting a search for a central engine model capable of generating such energetic explosions. A clue to the explosion mechanism may lie in the fact that all supernovae that accompany long-duration gamma-ray bursts (GRBs) belong to the SN Ic-BL class. Using a combination of two-dimensional relativistic hydrodynamics and radiation transport calculations, we demonstrate that the central engine responsible for long GRBs can also trigger an SN Ic-BL. We find that a reasonable GRB engine injected into a stripped Wolf–Rayet progenitor produces a relativistic jet with energy ∼1051 erg, as well as an SN whose synthetic light curves and spectra are fully consistent with observed SNe Ic-BL during the photospheric phase. As a result of the jet’s asymmetric energy injection, the SN spectra and light curves depend on viewing angle. The impact of viewing angle on the spectrum is particularly pronounced at early times, while the viewing-angle dependence for the light curves (∼10% variation in bolometric luminosity) persists throughout the photospheric phase.

  11. Watching AGN feedback at its birth: HST observations of nascent outflow host IC860

    Science.gov (United States)

    Alatalo, Katherine

    2016-10-01

    IC860 is a nearby IR-luminous early-type spiral with a unique set of properties: it is a shocked, poststarburst galaxy that hosts an AGN-driven neutral wind and a compact core of molecular gas. IC860 can serve as a rosetta stone for the early stages of triggering AGN feedback. We propose to use WFC3 on HST to obtain NUV, optical and near-IR imaging of IC860. We will create a spatially-resolved history of star formation quenching through SED-fitting of 7 requested broadband filters, and compare the spatially resolved star formation histories to in different positions within the underlying stellar features (such as spiral structure) that might define a narrative of how star formation is quenching in IC860. These observations will also resolve the super-star cluster sites to trace the most recent star formation. Finally, these observations will trace the mass of the outflow by building an absorption map of the dust. IC860 presents a unique opportunity to study a galaxy at an early stage of transitioning from blue spiral to red early-type galaxy, that also hosts an AGN-driven neutral wind and a compact, turbulent molecular gas core.

  12. Revealing the nebular properties and Wolf-Rayet population of IC10 with Gemini/GMOS

    Science.gov (United States)

    Tehrani, Katie; Crowther, Paul A.; Archer, I.

    2017-12-01

    We present a deep imaging and spectroscopic survey of the Local Group irregular galaxy IC10 using Gemini North and GMOS to unveil its global Wolf-Rayet (WR) population. We obtain a star formation rate (SFR) of 0.045 ± 0.023 M⊙ yr-1, for IC10 from the nebular H α luminosity, which is comparable to the Small Magellanic Cloud. We also present a revised nebular oxygen abundance of log(O/H) + 12 = 8.40 ± 0.04, comparable to the LMC. It has previously been suggested that for IC10 to follow the WR subtype-metallicity dependance seen in other Local Group galaxies, a large WN population awaits discovery. Our search revealed three new WN stars, and six candidates awaiting confirmation, providing little evidence to support this claim. The new global WR star total of 29 stars is consistent with the Large Magellanic Cloud population when scaled to the reduced SFR of IC10. For spectroscopically confirmed WR stars, the WC/WN ratio is lowered to 1.0; however, including all potential candidates, and assuming those unconfirmed to be WN stars, would reduce the ratio to ∼0.7. We attribute the high WC/WN ratio to the high star formation surface density of IC10 relative to the Magellanic Clouds, which enhances the frequency of high-mass stars capable of producing WC stars.

  13. Monitoring System for Slope Stability under Rainfall by using MEMS Acceleration Sensor IC tags

    International Nuclear Information System (INIS)

    Murakami, S; Dairaku, A; Komine, H; Saito, O; Sakai, N; Isizawa, T; Maruyama, I

    2013-01-01

    Real-time warning system for slope failure under rainfall is available to disaster prevention and mitigation. Monitoring of multi-point and wireless measurements is effective because it is difficult to conclude the most dangerous part in a slope. The purpose of this study is to propose a method of monitoring system with multi-point and wireless measurements for a slope stability using MEMS acceleration sensor IC tags. MEMS acceleration sensor IC tag is an acceleration sensor microminiaturized by a technology of Micro Electro Mechanical Systems on board IC tag. Especially, low cost of the sensor will yield to the realization of the system. In order to investigate the applicability of the proposed system, a large-scale model test of artificial slope subjected to rainfall has been performed. MEMS acceleration sensor IC tags has been located on the slope and ground acceleration caused by forced vibration has been measured until the model slope collapses. The experimental results show that the MEMS acceleration sensor IC tag is comfortably available under rainfall, the characteristics of ground accelerations varies with changing the condition of the slope subjected to rainfall, and the proposed method can be applied to a real-time monitoring system for slope failure under rainfall.

  14. PTF 12gzk—A rapidly declining, high-velocity type Ic radio supernova

    Energy Technology Data Exchange (ETDEWEB)

    Horesh, Assaf; Kulkarni, Shrinivas R. [Cahill Center for Astrophysics, California Institute of Technology, Pasadena, CA 91125 (United States); Corsi, Alessandra [Department of Physics, The George Washington University, 725 21st Street, NW, Washington, DC 20052 (United States); Frail, Dale A. [National Radio Astronomy Observatory, P.O. Box 0, Socorro, NM 87801 (United States); Cenko, S. Bradley [Department of Astronomy, University of California, Berkeley, CA 94720-3411 (United States); Ben-Ami, Sagi; Gal-Yam, Avishay; Yaron, Ofer; Arcavi, Iair; Ofek, Eran O. [Department of Particle Physics and Astrophysics, The Weizmann Institute of Science, Rehovot 76100 (Israel); Kasliwal, Mansi M. [Carnegie Institution for Science, Department of Terrestrial Magnetism, 5241 Broad Branch Road, Washington, DC 20008 (United States)

    2013-11-20

    Only a few cases of Type Ic supernovae (SNe) with high-velocity ejecta (≥0.2 c) have been discovered and studied. Here, we present our analysis of radio and X-ray observations of the Type Ic SN PTF 12gzk. The radio emission declined less than 10 days after explosion, suggesting SN ejecta expanding at high velocity (∼0.3 c). The radio data also indicate that the density of the circumstellar material (CSM) around the supernova is lower by a factor of ∼10 than the CSM around normal Type Ic SNe. PTF 12gzk may therefore be an intermediate event between a 'normal' SN Ic and a gamma-ray-burst-SN-like event. Our observations of this rapidly declining radio SN at a distance of 58 Mpc demonstrates the potential to detect many additional radio SNe, given the new capabilities of the Very Large Array (improved sensitivity and dynamic scheduling), which are currently missed, leading to a biased view of radio SNe Ic. Early optical discovery followed by rapid radio observations would provide a full description of the ejecta velocity distribution and CSM densities around stripped massive star explosions as well as strong clues about the nature of their progenitor stars.

  15. PTF 12gzk—A rapidly declining, high-velocity type Ic radio supernova

    International Nuclear Information System (INIS)

    Horesh, Assaf; Kulkarni, Shrinivas R.; Corsi, Alessandra; Frail, Dale A.; Cenko, S. Bradley; Ben-Ami, Sagi; Gal-Yam, Avishay; Yaron, Ofer; Arcavi, Iair; Ofek, Eran O.; Kasliwal, Mansi M.

    2013-01-01

    Only a few cases of Type Ic supernovae (SNe) with high-velocity ejecta (≥0.2 c) have been discovered and studied. Here, we present our analysis of radio and X-ray observations of the Type Ic SN PTF 12gzk. The radio emission declined less than 10 days after explosion, suggesting SN ejecta expanding at high velocity (∼0.3 c). The radio data also indicate that the density of the circumstellar material (CSM) around the supernova is lower by a factor of ∼10 than the CSM around normal Type Ic SNe. PTF 12gzk may therefore be an intermediate event between a 'normal' SN Ic and a gamma-ray-burst-SN-like event. Our observations of this rapidly declining radio SN at a distance of 58 Mpc demonstrates the potential to detect many additional radio SNe, given the new capabilities of the Very Large Array (improved sensitivity and dynamic scheduling), which are currently missed, leading to a biased view of radio SNe Ic. Early optical discovery followed by rapid radio observations would provide a full description of the ejecta velocity distribution and CSM densities around stripped massive star explosions as well as strong clues about the nature of their progenitor stars.

  16. Atomic structure of machined semiconducting chips: An x-ray absorption spectroscopy study

    Energy Technology Data Exchange (ETDEWEB)

    Paesler, M.; Sayers, D.

    1988-12-01

    X-ray absorption spectroscopy (XAS) has been used to examine the atomic structure of chips of germanium that were produced by single point diamond machining. It is demonstrated that although the local (nearest neighbor) atomic structure is experimentally quite similar to that of single crystal specimens information from more distant atoms indicates the presence of considerable stress. An outline of the technique is given and the strength of XAS in studying the machining process is demonstrated.

  17. Prototype detection unit for the CHIPS experiment

    Science.gov (United States)

    Pfützner, Maciej M.

    2017-09-01

    CHIPS (CHerenkov detectors In mine PitS) is an R&D project aiming to develop novel cost-effective neutrino detectors, focused on measuring the CP-violating neutrino mixing phase (δ CP). A single detector module, containing an enclosed volume of purified water, would be submerged in an existing lake, located in a neutrino beam. A staged approach is proposed with first detectors deployed in a flooded mine pit in Northern Minnesota, 7 mrad off-axis from the existing NuMI beam. A small proof-of-principle model (CHIPS-M) has already been tested and the first stage of a fully functional 10 kt module (CHIPS-10) is planned for 2018. One of the instruments submerged on board of CHIPS-M in autumn 2015 was a prototype detection unit, constructed at Nikhef. The unit contains hardware borrowed from the KM3NeT experiment, including 16 3 inch photomultiplier tubes and readout electronics. In addition to testing the mechanical design and data acquisition, the detector was used to record a large sample of cosmic ray muon events. The collected data is valuable for characterising the cosmic muon background and validating a Monte Carlo simulation used to optimise future designs. This paper introduces the CHIPS project, describes the design of the prototype unit, and presents the results of a preliminary data analysis.

  18. A Search for Hydrodynamical Interaction Between the ISM and Radio Jets in IC4296

    Science.gov (United States)

    Mackie, Glen

    1998-01-01

    The ROSAT HRI Data set on IC 4296 has been reduced and analysed. A draft paper on the small-scale structure of x-ray emission and its relation to the radio emission has been written. Mackie left the Smithsonian Astrophysical Observatory in September 1997 and in January 1998 he joined the staff at Carter Observatory, New Zealand. Mackie is currently (May 1998) upgrading computer software at Carter to run IRAF-PROS and XSPEC x-ray software packages in order to reduce and analyze archival ROSAT PSPC data on IC 4296. The PSPC results are needed to investigate the hot gas temperature and abundance properties that will be used in conjunction with the radio jet properties to determine the hydrodynamical interaction status of IC 4296, and finalize the results of a research paper.

  19. Safety systems I/C equipment reliability analyses of the Kozloduy NPP units 3 and 4

    Energy Technology Data Exchange (ETDEWEB)

    Halev, G; Christov, N [Risk Engineering Ltd., Sofia (Bulgaria)

    1996-12-31

    The purpose of the analysis is to assess the safety systems I/C equipment reliability. The assessment includes: quantification of the safety systems unavailability due to component failures; definition of the minimal cut sets leading to the analysed safety systems failure; quantification of the I/C equipment importance measures of the dominant contribution components. The safety systems I/C equipment reliability has been analysed using PSAPACK (a code for probabilistic safety assessment). Fault trees for the following safety systems of the Kozloduy-3 and Kozloduy-4 reactors have been constructed: neutron flow control equipment, reactor protection system, main coolant pumps, pressurizer safety valves `Sempell`, steam dump systems, spray system, low pressure injection system, emergency feeding water system, essential service water system. THree separate reports have been issued containing the performed analyses and results. 1 ref.

  20. The FE-I4 Pixel Readout Chip and the IBL Module

    Energy Technology Data Exchange (ETDEWEB)

    Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; /Bonn U.; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; /Marseille, CPPM; Beccherle, Roberto; Darbo, Giovanni; /INFN, Genoa; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

    2012-05-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  1. Noise suppression and crosstalk analysis of on-chip magnetic film-type noise suppressor

    Science.gov (United States)

    Ma, Jingyan; Muroga, Sho; Endo, Yasushi; Hashi, Shuichiro; Naoe, Masayuki; Yokoyama, Hiroo; Hayashi, Yoshiaki; Ishiyama, Kazushi

    2018-05-01

    This paper discusses near field, conduction and crosstalk noise suppression of magnetic films with uniaxial anisotropy on transmission lines for a film-type noise suppressor in the GHz frequency range. The electromagnetic noise suppressions of magnetic films with different permeability and resistivity were measured and simulated with simple microstrip lines. The experimental and simulated results of Co-Zr-Nb and CoPd-CaF2 films agreed with each other. The results indicate that the higher permeability leads to a better near field shielding, and in the frequency range of 2-7 GHz, a higher conduction noise suppression. It also suggests that the higher resistivity results in a better crosstalk suppression in the frequency range below 2 GHz. These results can support the design guidelines of the magnetic film-type noise suppressor used in the next generation IC chip.

  2. SUPER-LUMINOUS TYPE Ic SUPERNOVAE: CATCHING A MAGNETAR BY THE TAIL

    International Nuclear Information System (INIS)

    Inserra, C.; Smartt, S. J.; Jerkstrand, A.; Fraser, M.; Wright, D.; Smith, K.; Chen, T.-W.; Kotak, R.; Nicholl, M.; Valenti, S.; Pastorello, A.; Benetti, S.; Bresolin, F.; Kudritzki, R. P.; Burgett, W. S.; Chambers, K. C.; Flewelling, H.; Botticella, M. T.; Ergon, M.; Fynbo, J. P. U.

    2013-01-01

    We report extensive observational data for five of the lowest redshift Super-Luminous Type Ic Supernovae (SL-SNe Ic) discovered to date, namely, PTF10hgi, SN2011ke, PTF11rks, SN2011kf, and SN2012il. Photometric imaging of the transients at +50 to +230 days after peak combined with host galaxy subtraction reveals a luminous tail phase for four of these SL-SNe. A high-resolution, optical, and near-infrared spectrum from xshooter provides detection of a broad He I λ10830 emission line in the spectrum (+50 days) of SN2012il, revealing that at least some SL-SNe Ic are not completely helium-free. At first sight, the tail luminosity decline rates that we measure are consistent with the radioactive decay of 56 Co, and would require 1-4 M ☉ of 56 Ni to produce the luminosity. These 56 Ni masses cannot be made consistent with the short diffusion times at peak, and indeed are insufficient to power the peak luminosity. We instead favor energy deposition by newborn magnetars as the power source for these objects. A semi-analytical diffusion model with energy input from the spin-down of a magnetar reproduces the extensive light curve data well. The model predictions of ejecta velocities and temperatures which are required are in reasonable agreement with those determined from our observations. We derive magnetar energies of 0.4 ∼ 51 erg) ∼ ej (M ☉ ) ∼< 8.6. The sample of five SL-SNe Ic presented here, combined with SN 2010gx—the best sampled SL-SNe Ic so far—points toward an explosion driven by a magnetar as a viable explanation for all SL-SNe Ic.

  3. A CENSUS OF YOUNG STARS AND BROWN DWARFS IN IC 348 AND NGC 1333

    Energy Technology Data Exchange (ETDEWEB)

    Luhman, K. L.; Esplin, T. L. [Department of Astronomy and Astrophysics, The Pennsylvania State University, University Park, PA 16802 (United States); Loutrel, N. P., E-mail: kluhman@astro.psu.edu [Department of Physics, Montana State University, Bozeman, MT 59715 (United States)

    2016-08-10

    We have obtained optical and near-infrared spectra of candidate members of the star-forming clusters IC 348 and NGC 1333. We classify 100 and 42 candidates as new members of the clusters, respectively, which brings the total numbers of known members to 478 and 203. We also have performed spectroscopy on a large majority of the previously known members of NGC 1333 in order to provide spectral classifications that are measured with the same scheme that has been applied to IC 348 in previous studies. The new census of members is nearly complete for K {sub s}< 16.8 at A {sub J}< 1.5 in IC 348 and for K {sub s}< 16.2 at A {sub J}< 3 in NGC 1333, which correspond to masses of ≳0.01 M {sub ⊙} for ages of 3 Myr according to theoretical evolutionary models. The faintest known members extend below these completeness limits and appear to have masses of ∼0.005 M {sub ⊙}. In extinction-limited samples of cluster members, NGC 1333 exhibits a higher abundance of objects at lower masses than IC 348. It would be surprising if the initial mass functions of these clusters differ significantly given their similar stellar densities and formation environments. Instead, it is possible that average extinctions are lower for less massive members of star-forming clusters, in which case extinction-limited samples could be biased in favor of low-mass objects in the more heavily embedded clusters like NGC 1333. In the Hertzsprung–Russell diagram, the median sequences of IC 348 and NGC 1333 coincide with each other for the adopted distances of 300 and 235 pc, which would suggest that they have similar ages. However, NGC 1333 is widely believed to be younger than IC 348 based on its higher abundance of disks and protostars and its greater obscuration. Errors in the adopted distances may be responsible for this discrepancy.

  4. VizieR Online Data Catalog: Optical & Spitzer photometry in IC 1805 (Sung+, 2017)

    Science.gov (United States)

    Sung, H.; Bessell, M. S.; Chun, M.-Y.; Yi, J.; Naze, Y.; Lim, B.; Karimov, R.; Rauw, G.; Park, B.-G.; Hur, H.

    2017-06-01

    For a study of the IMF and the star-formation history of the young open cluster IC 1805, we obtained deep wide-field VRI and Hα images of IC 1805 using the CFH12K mosaic CCD camera of the CFHT on 2002 January 6 and 7. We also observed several regions in IC 1805, for a study of the reddening and massive star content, using the SITe 2000x800 CCD (Maidanak 2k CCD) and standard UBVRI filters of the AZT-22 1.5m telescope at the Maidanak Astronomical Observatory in Uzbekistan on 2003 August 18 and 2004 december 25,30. Later, we obtained additional images of the central region of IC 1805 with the Fairchild 486 CCD (SNUCam) and UBVI and Hα filters of the AZT-22 telescope on 2007 October 7 and 2009 January 19. The Spitzer mapping observations were performed on 2006 September 20 under program ID 20052 (PI: S. Wolff). For complete photometry of stars in the CFH12K FOV in 3.6 and 4.5um, we also downloaded and reduced the GLIMPSE360 data (AOR: 38753280, 38763264, 38769408, 38799104, 38798592, 38784512, PI: B. A. Whitney). MIPS scans of IC 1805 were obtained on 2005 August 31 and 2005 September 2 (PID 3234, PI: J. S. Greeves). The Chandra X-ray Observatory Observations of IC 1805 (ObsID: 7033, PI: L. Townley) were made on 2006 November 25. The total exposure time was about 79ks. The properties of 647 X-ray sources were published in Townsley+ (2014,J/ApJS/213/1). We searched for the optical and MIR counterparts of these X-ray sources with a matching radius of up to 1.5". (4 data files).

  5. Submission of the First Full Scale Prototype Chip for Upgraded ATLAS Pixel Detector at LHC, FE-I4A

    CERN Document Server

    Barbero, M; The ATLAS collaboration; Beccherle, R; Darbo, G; Dube, S; Elledge, D; Fleury, J; Fougeron, D; Garcia-Sciveres, M; Gensolen, F; Gnani, D; Gromov, V; Jensen, F; Hemperek, T; Karagounis, M; Kluit, R; Kruth, A; Mekkaoui, A; Menouni, M; Schipper, JD; Wermes, N; Zivkovic, V

    2010-01-01

    A new ATLAS pixel chip FE-I4 is being developed for use in upgraded LHC luminosity environments, including the near-term Insertable B-Layer (IBL) upgrade. FE-I4 is designed in a 130nm CMOS technology, presenting advantages in terms of radiation tolerance and digital logic density compared to the 250nm CMOS technology used for the current ATLAS pixel IC, FE-I3. The FE-I4 architecture is based on an array of 80x336 pixels, each 50x250um^2, consisting of analog and digital sections. In the summer 2010, a first full scale prototype FE-I4A was submitted for an engineering run. This IC features the full scale pixel array as well as the complex periphery of the future full-size FE-I4. The FE-I4A contains also various extra test features which should prove very useful for the chip characterization, but deviate from the needs for standard operation of the final FE-I4 for IBL. In this paper, focus will be brought to the various features implemented in the FE-I4A submission, while also underlining the main differences b...

  6. Optical observations of the nearby galaxy IC342 with narrow band [SII] and Hα filters. I

    Directory of Open Access Journals (Sweden)

    Vučetić M.M.

    2013-01-01

    Full Text Available We present observations of a portion of the nearby spiral galaxy IC342 using narrow band [SII] and Hα filters. These observations were carried out in November 2011 with the 2m RCC telescope at Rozhen National Astronomical Observatory in Bulgaria. In this paper we report coordinates, diameters, Hα and [SII] fluxes for 203 HII regions detected in two fields of view in IC342 galaxy. The number of detected HII regions is 5 times higher than previously known in these two parts of the galaxy. [Projekat Ministarstva nauke Republike Srbije, br. 176005: Emission nebulae: structure and evolution

  7. Consciência icônica: o sentimento material do significado

    Directory of Open Access Journals (Sweden)

    Jeffrey C. Alexander

    Full Text Available Resumo Neste ensaio seminal, Jeffrey Alexander apresenta algumas das bases de sua virada icônica. O giro analítico proposto se fundamenta em uma compreensão da materialidade como portadora de conteúdo estético e moral, o que é sintetizado na noção de consciência icônica: o processo em que um observador vincula a superfície estética de uma materialidade a uma determinada estrutura moral de valores sociais.

  8. SN 2017dio: A Type-Ic Supernova Exploding in a Hydrogen-rich Circumstellar Medium

    Science.gov (United States)

    Kuncarayakti, Hanindyo; Maeda, Keiichi; Ashall, Christopher J.; Prentice, Simon J.; Mattila, Seppo; Kankare, Erkki; Fransson, Claes; Lundqvist, Peter; Pastorello, Andrea; Leloudas, Giorgos; Anderson, Joseph P.; Benetti, Stefano; Bersten, Melina C.; Cappellaro, Enrico; Cartier, Régis; Denneau, Larry; Della Valle, Massimo; Elias-Rosa, Nancy; Folatelli, Gastón; Fraser, Morgan; Galbany, Lluís; Gall, Christa; Gal-Yam, Avishay; Gutiérrez, Claudia P.; Hamanowicz, Aleksandra; Heinze, Ari; Inserra, Cosimo; Kangas, Tuomas; Mazzali, Paolo; Melandri, Andrea; Pignata, Giuliano; Rest, Armin; Reynolds, Thomas; Roy, Rupak; Smartt, Stephen J.; Smith, Ken W.; Sollerman, Jesper; Somero, Auni; Stalder, Brian; Stritzinger, Maximilian; Taddia, Francesco; Tomasella, Lina; Tonry, John; Weiland, Henry; Young, David R.

    2018-02-01

    SN 2017dio shows both spectral characteristics of a type-Ic supernova (SN) and signs of a hydrogen-rich circumstellar medium (CSM). Prominent, narrow emission lines of H and He are superposed on the continuum. Subsequent evolution revealed that the SN ejecta are interacting with the CSM. The initial SN Ic identification was confirmed by removing the CSM interaction component from the spectrum and comparing with known SNe Ic and, reversely, adding a CSM interaction component to the spectra of known SNe Ic and comparing them to SN 2017dio. Excellent agreement was obtained with both procedures, reinforcing the SN Ic classification. The light curve constrains the pre-interaction SN Ic peak absolute magnitude to be around {M}g=-17.6 mag. No evidence of significant extinction is found, ruling out a brighter luminosity required by an SN Ia classification. These pieces of evidence support the view that SN 2017dio is an SN Ic, and therefore the first firm case of an SN Ic with signatures of hydrogen-rich CSM in the early spectrum. The CSM is unlikely to have been shaped by steady-state stellar winds. The mass loss of the progenitor star must have been intense, \\dot{M}∼ 0.02{({ε }{{H}α }/0.01)}-1 ({v}{wind}/500 km s‑1) ({v}{shock}/10,000 km s‑1)‑3 M ⊙ yr‑1, peaking at a few decades before the SN. Such a high mass-loss rate might have been experienced by the progenitor through eruptions or binary stripping. Based on observations made with the NOT, operated by the Nordic Optical Telescope Scientific Association at the Observatorio del Roque de los Muchachos, La Palma, Spain, of the Instituto de Astrofisica de Canarias. This work is based (in part) on observations collected at the European Organisation for Astronomical Research in the Southern Hemisphere, Chile as part of PESSTO, (the Public ESO Spectroscopic Survey for Transient Objects Survey) ESO program 188.D-3003, 191.D-0935, 197.D-1075. Based on observations made with the Liverpool Telescope operated on the

  9. Advances in analog and RF IC design for wireless communication systems

    CERN Document Server

    Manganaro, Gabriele

    2013-01-01

    Advances in Analog and RF IC Design for Wireless Communication Systems gives technical introductions to the latest and most significant topics in the area of circuit design of analog/RF ICs for wireless communication systems, emphasizing wireless infrastructure rather than handsets. The book ranges from very high performance circuits for complex wireless infrastructure systems to selected highly integrated systems for handsets and mobile devices. Coverage includes power amplifiers, low-noise amplifiers, modulators, analog-to-digital converters (ADCs) and digital-to-analog converters

  10. The Coronary Health Improvement Projects Impact on Lowering Eating, Sleep, Stress, and Depressive Disorders

    Science.gov (United States)

    Merrill, Ray M.; Aldana, Stephen G.; Greenlaw, Roger L.; Diehl, Hans A.

    2008-01-01

    Background: The Coronary Health Improvement Project (CHIP) is designed to lower cardiovascular risk factors among a group of generally healthy individuals through health education. Purpose: This study will evaluate the efficacy of the CHIP intervention at improving eating, sleep, stress, and depressive disorders. Methods: A health education…

  11. The impact of CHIP premium increases on insurance outcomes among CHIP eligible children.

    Science.gov (United States)

    Nikolova, Silviya; Stearns, Sally

    2014-03-03

    Within the United States, public insurance premiums are used both to discourage private health policy holders from dropping coverage and to reduce state budget costs. Prior research suggests that the odds of having private coverage and being uninsured increase with increases in public insurance premiums. The aim of this paper is to test effects of Children's Health Insurance Program (CHIP) premium increases on public insurance, private insurance, and uninsurance rates. The fact that families just below and above a state-specific income cut-off are likely very similar in terms of observable and unobservable characteristics except the premium contribution provides a natural experiment for estimating the effect of premium increases. Using 2003 Medical Expenditure Panel Survey (MEPS) merged with CHIP premiums, we compare health insurance outcomes for CHIP eligible children as of January 2003 in states with a two-tier premium structure using a cross-sectional regression discontinuity methodology. We use difference-in-differences analysis to compare longitudinal insurance outcomes by December 2003. Higher CHIP premiums are associated with higher likelihood of private insurance. Disenrollment from CHIP in response to premium increases over time does not increase the uninsurance rate. When faced with higher CHIP premiums, private health insurance may be a preferable alternative for CHIP eligible families with higher incomes. Therefore, competition in the insurance exchanges being formed under the Affordable Care Act could enhance choice.

  12. A compact PE memory for vision chips

    Science.gov (United States)

    Cong, Shi; Zhe, Chen; Jie, Yang; Nanjian, Wu; Zhihua, Wang

    2014-09-01

    This paper presents a novel compact memory in the processing element (PE) for single-instruction multiple-data (SIMD) vision chips. The PE memory is constructed with 8 × 8 register cells, where one latch in the slave stage is shared by eight latches in the master stage. The memory supports simultaneous read and write on the same address in one clock cycle. Its compact area of 14.33 μm2/bit promises a higher integration level of the processor. A prototype chip with a 64 × 64 PE array is fabricated in a UMC 0.18 μm CMOS technology. Five types of the PE memory cell structure are designed and compared. The testing results demonstrate that the proposed PE memory architecture well satisfies the requirement of the vision chip in high-speed real-time vision applications, such as 1000 fps edge extraction.

  13. A compact PE memory for vision chips

    International Nuclear Information System (INIS)

    Shi Cong; Chen Zhe; Yang Jie; Wu Nanjian; Wang Zhihua

    2014-01-01

    This paper presents a novel compact memory in the processing element (PE) for single-instruction multiple-data (SIMD) vision chips. The PE memory is constructed with 8 × 8 register cells, where one latch in the slave stage is shared by eight latches in the master stage. The memory supports simultaneous read and write on the same address in one clock cycle. Its compact area of 14.33 μm 2 /bit promises a higher integration level of the processor. A prototype chip with a 64 × 64 PE array is fabricated in a UMC 0.18 μm CMOS technology. Five types of the PE memory cell structure are designed and compared. The testing results demonstrate that the proposed PE memory architecture well satisfies the requirement of the vision chip in high-speed real-time vision applications, such as 1000 fps edge extraction. (semiconductor integrated circuits)

  14. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  15. The single chip microcomputer technique in an intelligent nuclear instrument

    International Nuclear Information System (INIS)

    Wang Tieliu; Sun Punan; Wang Ying

    1995-01-01

    The authors present that how to acquire and process the output signals from the nuclear detector adopting single chip microcomputer technique, including working principles and the designing method of the computer's software and hardware in the single chip microcomputer instrument

  16. Experiment list: SRX180159 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available sd || cell type=hemogenic endothelium || chip antibody=CEBPb || chip antibody vendor=santa cruz biotechnol...ogy http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachData/bw/SRX180159.bw http://

  17. Experiment list: SRX112178 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available line=OS25 ES cells || chip antibody=8WG16 (MMS-126R, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Magnetic beads http://dbarchive.biosciencedbc.jp/kyushu-u/mm

  18. Experiment list: SRX319550 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e embryonic stem cells || genotype/variation=expressing Flag-bio tagged Myc || chip beads=Dynabeads MyOne Streptavidin T1 || chip bea...ds vendor=Invitrogen http://dbarchive.biosciencedbc.jp/k

  19. Experiment list: SRX319556 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ype=mouse embryonic stem cells || genotype/variation=expressing Flag-bio tagged Dax1 || chip beads=Dynabeads... MyOne Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.bioscienc

  20. Experiment list: SRX112184 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available line=OS25 ES cells || chip antibody=CTD4H8 (MMS-128P, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Sepharose beads http://dbarchive.biosciencedbc.jp/kyushu-u/m

  1. Experiment list: SRX319558 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available | cell type=mouse embryonic stem cells || genotype/variation=expressing control BirA || chip beads=Dynabeads... MyOne Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.bioscienc

  2. Experiment list: SRX319553 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available se embryonic stem cells || genotype/variation=expressing Flag-bio tagged Tip60 || chip beads=Dynabeads MyOne... Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.biosciencedbc.j

  3. Experiment list: SRX319557 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available se embryonic stem cells || genotype/variation=expressing Flag-bio tagged Nanog || chip beads=Dynabeads MyOne... Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.biosciencedbc.j

  4. Experiment list: SRX319555 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ype=mouse embryonic stem cells || genotype/variation=expressing Flag-bio tagged Dax1 || chip beads=Dynabeads... MyOne Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.bioscienc

  5. Experiment list: SRX319551 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available use embryonic stem cells || genotype/variation=expressing Flag-bio tagged Dmap1 || chip beads=Dynabeads MyOn...e Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.biosciencedbc.

  6. Experiment list: SRX185907 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available Homo sapiens; ChIP-Seq source_name=MCF-7 breast adenocarcinoma cells, control, FOXM1 ChIP || cell_line=MCF-...7 || cell_type=ER-positive breast adenocarcinoma cells || treatment=DMSO || chip_

  7. Experiment list: SRX367330 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nology) || sirna transfection=siBrd4 http://dbarchive.bi...=HEK293T cell || cell line=Human Embryonic Kidney 293 cells || chip antibody=CDK9 || chip antibody details=2316S (Cell Signaling Tech

  8. Experiment list: SRX367328 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nology) || sirna transfection=siCTL http://dbarchive.bio...=HEK293T cell || cell line=Human Embryonic Kidney 293 cells || chip antibody=CDK9 || chip antibody details=2316S (Cell Signaling Tech

  9. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  10. Experiment list: SRX543048 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/ea...CID.adh murine thymic lymphoma || development stage=DN3 || chip antibody=rabbit anti-Miz-1 || chip antibody vendor=Santa Cruz Biotech

  11. Lab-on a-Chip

    Science.gov (United States)

    1999-01-01

    Labs on chips are manufactured in many shapes and sizes and can be used for numerous applications, from medical tests to water quality monitoring to detecting the signatures of life on other planets. The eight holes on this chip are actually ports that can be filled with fluids or chemicals. Tiny valves control the chemical processes by mixing fluids that move in the tiny channels that look like lines, connecting the ports. Scientists at NASA's Marshall Space Flight Center (MSFC) in Huntsville, Alabama designed this chip to grow biological crystals on the International Space Station (ISS). Through this research, they discovered that this technology is ideally suited for solving the challenges of the Vision for Space Exploration. For example, thousands of chips the size of dimes could be loaded on a Martian rover looking for biosignatures of past or present life. Other types of chips could be placed in handheld devices used to monitor microbes in water or to quickly conduct medical tests on astronauts. The portable, handheld Lab-on-a Chip Application Development Portable Test System (LOCAD-PTS) made its debut flight aboard Discovery during the STS-116 mission launched December 9, 2006. The system allowed crew members to monitor their environment for problematic contaminants such as yeast, mold, and even E.coli, and salmonella. Once LOCAD-PTS reached the ISS, the Marshall team continued to manage the experiment, monitoring the study from a console in the Payload Operations Center at MSFC. The results of these studies will help NASA researchers refine the technology for future Moon and Mars missions. (NASA/MSFC/D.Stoffer)

  12. Biostability of an implantable glucose sensor chip

    Science.gov (United States)

    Fröhlich, M.; Birkholz, M.; Ehwald, K. E.; Kulse, P.; Fursenko, O.; Katzer, J.

    2012-12-01

    Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and Ra roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

  13. Biostability of an implantable glucose sensor chip

    International Nuclear Information System (INIS)

    Fröhlich, M; Ehwald, K E; Kulse, P; Fursenko, O; Katzer, J; Birkholz, M

    2012-01-01

    Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO 2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and R a roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

  14. Modified precision-husky progrind H-3045 for chipping biomass

    Science.gov (United States)

    Dana Mitchell; Fernando Seixas; John. Klepac

    2008-01-01

    A specific size of whole tree chip was needed to co-mill wood chips with coal. The specifications are stringent because chips must be mixed with coal, as opposed to a co-firing process. In co-firing, two raw products are conveyed separately to a boiler. In co-milling, such as at Alabama Power's Plant Gadsden, the chip and coal mix must pass through a series of...

  15. Silicon microstrip detectors with SVX chip readout

    International Nuclear Information System (INIS)

    Brueckner, W.; Dropmann, F.; Godbersen, M.; Konorov, I.; Koenigsmann, K.; Masciocchi, S.; Newsom, C.; Paul, S.; Povh, B.; Russ, J.S.; Timm, S.; Vorwalter, K.; Werding, R.

    1995-01-01

    A new silicon strip detector has been designed for the fixed target experiment WA89 at CERN. The system of about 30 000 channels is equipped with SVX chips and read out via a double buffer into a FASTBUS memory. The detector provides a fast readout by offering zero-suppressed data extraction on the chip. The silicon counters are the largest detectors built on a monocrystal so far in order to achieve good transversal acceptance. Construction and performance during the 1993 data taking run are discussed. ((orig.))

  16. MCMII and the TriP chip

    Energy Technology Data Exchange (ETDEWEB)

    Juan Estrada et al.

    2003-12-19

    We describe the development of the electronics that will be used to read out the Fiber Tracker and Preshower detectors in Run IIb. This electronics is needed for operation at 132ns bunch crossing, and may provide a measurement of the z coordinate of the Fiber Tracker hits when operating at 396ns bunch crossing. Specifically, we describe the design and preliminary tests of the Trip chip, MCM IIa, MCM IIb and MCM IIc. This document also serves as a user manual for the Trip chip and the MCM.

  17. Role of insular cortex in visceral hypersensitivity model in rats subjected to chronic stress.

    Science.gov (United States)

    Yi, LiSha; Sun, HuiHui; Ge, Chao; Chen, Ying; Peng, HaiXia; Jiang, YuanXi; Wu, Ping; Tang, YinHan; Meng, QingWei; Xu, ShuChang

    2014-12-30

    Abnormal processing of visceral sensation at the level of the central nervous system has been proven to be important in the pathophysiologic mechanisms of stress related functional gastrointestinal disorders. However, the specific mechanism is still not clear. The insular cortex (IC) was considered as one important visceral sensory area. Moreover, the IC has been shown to be involved in various neuropsychiatric diseases such as panic disorders and post-traumatic stress disorder. However, whether the IC is important in psychological stress related visceral hypersensitivity has not been studied yet. In our study, through destruction of the bilateral IC, we explored whether the IC played a critical role in the formation of visceral hypersensitivity induced by chronic stress on rats. Chronic partial restraint stress was used to establish viscerally hypersensitive rat model. Bilateral IC lesions were generated by N-methyl-D-day (door) aspartate. After a recovery period of 7 days, 14-day consecutive restraint stress was performed. The visceromotor response to colorectal distension was monitored by recording electromyogram to measure rats׳ visceral sensitivity. We found that bilateral insular cortex lesion could markedly inhibit the formation of visceral hypersensitivity induced by chronic stress. The insular cortex plays a critical role in the pathophysiology of stress-related visceral hypersensitivity.

  18. A Neuron- and a Synapse Chip for Artificial Neural Networks

    DEFF Research Database (Denmark)

    Lansner, John; Lehmann, Torsten

    1992-01-01

    A cascadable, analog, CMOS chip set has been developed for hardware implementations of artificial neural networks (ANN's):I) a neuron chip containing an array of neurons with hyperbolic tangent activation functions and adjustable gains, and II) a synapse chip (or a matrix-vector multiplier) where...

  19. Developing an Integrated Design Strategy for Chip Layout Optimization

    NARCIS (Netherlands)

    Wits, Wessel Willems; Jauregui Becker, Juan Manuel; van Vliet, Frank Edward; te Riele, G.J.

    2011-01-01

    This paper presents an integrated design strategy for chip layout optimization. The strategy couples both electric and thermal aspects during the conceptual design phase to improve chip performances; thermal management being one of the major topics. The layout of the chip circuitry is optimized

  20. Wood chip delivery and research project at Mikkeli region

    International Nuclear Information System (INIS)

    Saksa, T.; Auvinen, P.

    1995-01-01

    In 1994, a large-scale energywood production chain was started as a co-operation project by the Mikkeli city forest office and local forestry societies. Over 60 000 m 3 (about 46 000 MWh of energy) of forest processed chips were delivered to Pursiala heat and power plant in Mikkeli. About 60 % of these chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 51 FIM/m 3 (68 FIM/MWh) for the whole tree chips and 40 FIM/m 3 (53 FIM/MWh) for logging waste chips. The delivery costs of wood chips could compete with those of fuel peat only in the most favourable cases. The resources of forest processed chips were studied on the basis of forestry plans. According to the study, there is enough raw material for permanent, large-scale delivery of forest processed chips (up to 250 000 m 3 /a) in the forests located at a distance of under 40 road kilometers from the Pursiala heat and power plant. The following project stages will involve further development of the wood chip delivery chain logistics, as well as improvement of logging and chipping equipment and methods in energywood and logging waste production. Also the effects of wood energy production on the economy and environment of the whole Mikkeli region will be studied. (author)

  1. Experiment list: SRX485203 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346544: Rhino ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq ...source_name=Rhino ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult ||... Sex=female || tissue=ovary || germline knock-down=control || chip antibody=custo

  2. Experiment list: SRX485202 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346543: Rhino ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq ...source_name=Rhino ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult ||... Sex=female || tissue=ovary || germline knock-down=control || chip antibody=custo

  3. Experiment list: SRX485205 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 46546: Rhino ChIP from deadlock germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=R...hino ChIP from deadlock germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female ...|| tissue=ovary || germline knock-down=deadlock || chip antibody=custom-made rabb

  4. Experiment list: SRX485212 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346553: Cutoff ChIP from cutoff germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=C...utoff ChIP from cutoff germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female |...| tissue=ovary || germline knock-down=cutoff || chip antibody=custom-made rabbit

  5. Experiment list: SRX485210 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 6551: Deadlock ChIP from deadlock germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name...=Deadlock ChIP from deadlock germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=deadlock || chip antibody=custom-made

  6. Experiment list: SRX485220 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 53 GSM1346561: RNA Polymerase II ChIP from rhino germline knock-down ovaries; Drosophila melanogaster; ChIP-...Seq source_name=RNA Polymerase II ChIP from rhino germline knock-down ovaries || developmental stage=4-6 day...s old adult || Sex=female || tissue=ovary || germline knock-down=rhino || chip an

  7. Experiment list: SRX485211 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346552: Cutoff ChIP from control germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=...Cutoff ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female... || tissue=ovary || germline knock-down=control || chip antibody=custom-made rabb

  8. Experiment list: SRX485204 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346545: Rhino ChIP from rhino germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=Rhi...no ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female || ti...ssue=ovary || germline knock-down=rhino || chip antibody=custom-made rabbit polyc

  9. Experiment list: SRX485208 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346549: Rhino ChIP from piwi germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq sou...rce_name=Rhino ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=piwi || chip antibody=custom-made ra

  10. Experiment list: SRX485206 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346547: Rhino ChIP from cutoff germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=Rh...ino ChIP from cutoff germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female || ...tissue=ovary || germline knock-down=cutoff || chip antibody=custom-made rabbit po

  11. Experiment list: SRX485209 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346550: Deadlock ChIP from control germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_nam...e=Deadlock ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=control || chip antibody=custom-made

  12. Energy Model of Networks-on-Chip and a Bus

    NARCIS (Netherlands)

    Wolkotte, P.T.; Smit, Gerardus Johannes Maria; Kavaldjiev, N.K.; Becker, Jens E.; Becker, Jürgen; Nurmi, J.; Takala, J.; Hamalainen, T.D.

    2005-01-01

    A Network-on-Chip (NoC) is an energy-efficient onchip communication architecture for Multi-Processor Systemon-Chip (MPSoC) architectures. In earlier papers we proposed two Network-on-Chip architectures based on packet-switching and circuit-switching. In this paper we derive an energy model for both

  13. Experiment list: SRX110782 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e3 (ab6002, abcam), Pol II (CTD4H8, Millipore) || chip antibody 1 manufacturer=ab...cam || chip antibody 2=Pol II (CTD4H8, Millipore) || chip antibody 2 manufacturer=Millipore http://dbarchive

  14. The Effects of Industry Type, Company Size and Performance on Chinese Companies’ IC Disclosure: A Research Note

    Directory of Open Access Journals (Sweden)

    Yi An

    2011-09-01

    Full Text Available This paper examines the effects of industry type, firm size and corporate performance on intellectual capital (IC disclosure among Chinese (mainland companies. It was found that industry type did not have a significant influence on IC reporting practices of Chinese firms; the larger firms generally reported more IC information than the relatively smaller firms; and there was a positive relationship between corporate performance and IC disclosure. This paper contributes to fairly limited literature regarding the associations between the level of IC disclosure and a variety of relevant impact factors, in particular in the Chinese mainland context. In addition, the findings of this research provide some references for policy-makers while developing an IC reporting framework applicable to the Chinese environment.

  15. 3D Integration of MEMS and IC: Design, technology and simulations

    OpenAIRE

    Schjølberg-Henriksen, Kari

    2009-01-01

    * 3D integration: Opportunities and trends* e-CUBES: Tire pressure monitoring system (TPMS)* Package design including thermo-mechanical modeling* Technology development* Sensor packaging concept* Gold stud bump bonding* Device characterization and testing* Summary and outlook 3D Integration of MEMS and IC: Design, technology and simulations

  16. EMERGING I&C TECHNOLOGIES UNDER THE SHIFTING REGULATORY ENVIRONMENT IN SOUTH KOREA

    Directory of Open Access Journals (Sweden)

    Gyunyoung eHeo

    2015-04-01

    Full Text Available The role of Probabilistic Safety Assessment (PSA has been supplementary and Risk-Informed Applications (RIAs based on the insight from PSA has also been utilized limitedly in the licensing process for Nuclear Power Plants (NPPs in South Korea. However, as the technical significance of PSA is getting increased, PSA has become a mandatory part of Safety Analysis Reports and Periodic Safety Review. It is worthwhile to highlight the role of emerging Instrumentation and Control (I&C technologies including human-machine interface (HMI in developing more credible and realistic PSA models. Particularly, it is expected that the information technology (i.e. software embedded in digital I&C can adjust over- and under conservatism in analyzing risk. In this study, authors proposed the cases which would be able to significantly reduce risk if advanced I&C supported by information technologies is applied. In regard, the several enabling techniques and their effects are proposed. In order to improve the commercial competitiveness of NPPs, the need of collaboration and synergetic outcome of I&C, HMI and PSA should be emphasized.

  17. Emerging I&C Technologies Under the Shifting Regulatory Environment in South Korea

    Energy Technology Data Exchange (ETDEWEB)

    Heo, Gyunyoung [Department of Nuclear Engineering, Kyung Hee University, Youngin-si (Korea, Republic of); Seong, Poong Hyun; Kang, Hyun Gook, E-mail: hyungook@kaist.ac.kr [Department of Nuclear and Quantum Engineering, Korea Advanced Institute of Science and Technology, Daejeon (Korea, Republic of)

    2015-04-29

    The role of probabilistic safety assessment (PSA) has been supplementary and risk-informed applications based on the insight from PSA have also been utilized limitedly in the licensing process for nuclear power plants (NPPs) in South Korea. However, as the technical significance of PSA is getting increased, PSA has become a mandatory part of Safety Analysis Reports and Periodic Safety Review. It is worthwhile to highlight the role of emerging instrumentation and control (I&C) technologies including human–machine interface (HMI) in developing more credible and realistic PSA models. Particularly, it is expected that the information technology (i.e., software) embedded in digital I&C can adjust over- and under conservatism in analyzing risk. In this study, authors proposed the cases which would be able to significantly reduce risk if advanced I&C supported by information technologies is applied. In regard, the several enabling techniques and their effects are proposed. In order to improve the commercial competitiveness of NPPs, the need of collaboration and synergetic outcome of I&C, HMI, and PSA should be emphasized.

  18. The next generation in optical transport semiconductors: IC solutions at the system level

    Science.gov (United States)

    Gomatam, Badri N.

    2005-02-01

    In this tutorial overview, we survey some of the challenging problems facing Optical Transport and their solutions using new semiconductor-based technologies. Advances in 0.13um CMOS, SiGe/HBT and InP/HBT IC process technologies and mixed-signal design strategies are the fundamental breakthroughs that have made these solutions possible. In combination with innovative packaging and transponder/transceiver architectures IC approaches have clearly demonstrated enhanced optical link budgets with simultaneously lower (perhaps the lowest to date) cost and manufacturability tradeoffs. This paper will describe: *Electronic Dispersion Compensation broadly viewed as the overcoming of dispersion based limits to OC-192 links and extending link budgets, *Error Control/Coding also known as Forward Error Correction (FEC), *Adaptive Receivers for signal quality monitoring for real-time estimation of Q/OSNR, eye-pattern, signal BER and related temporal statistics (such as jitter). We will discuss the theoretical underpinnings of these receiver and transmitter architectures, provide examples of system performance and conclude with general market trends. These Physical layer IC solutions represent a fundamental new toolbox of options for equipment designers in addressing systems level problems. With unmatched cost and yield/performance tradeoffs, it is expected that IC approaches will provide significant flexibility in turn, for carriers and service providers who must ultimately manage the network and assure acceptable quality of service under stringent cost constraints.

  19. Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly

    Directory of Open Access Journals (Sweden)

    Peng Mou

    2013-01-01

    Full Text Available Reuse of plastic IC packages disassembled from printed circuit boards (PCBs has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages. Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the interface delamination. To this end, a computational model with variable boundary conditions is developed based on the different combination state of water in IC packages. The distribution characteristics and mechanism of moisture diffusion behavior are analyzed including the humidity distribution field and the relation among baking temperature, water loss rate, and baking time during baking process, and then the results are validated by FEA simulation based on the improved definition of relative moisture concentration. Baking under variable temperature is proposed and compared with the baking process and baking efficiency under constant temperature to find out the optimized baking parameters. Finally, a set of curves which indicate the relation between baking energy consumption and temperature are determined under actual industrial baking experiments, which could be used as references to develop industrial standards for PCB disassembling process.

  20. In vitro assays for cobblestone area-forming cells, LTC-IC, and CFU-C

    NARCIS (Netherlands)

    van Os, Ronald P; Dethmers-Ausema, Bertien; de Haan, Gerald; Bunting, Kevin

    2008-01-01

    Various assays exist that measure the function of hematopoietic stemcells (HSCs). In this chapter, in vitro assays are described that measure the frequency of progenitors (colony-forming unit in culture; CFU-C), stem cells (long-term culture-initiating cell; LTC-IC), or both (cobblestone

  1. Ethnobotany of the Sierra Nevada del Cocuy-Güicán

    NARCIS (Netherlands)

    Rodríguez, Mireia Alcántara; Angueyra, Andrea; Cleef, Antoine M.; Andel, van Tinde

    2018-01-01

    Background: The Sierra Nevada del Cocuy-Güicán in the Colombian Andes is protected as a National Natural Park since 1977 because of its fragile páramo ecosystems, extraordinary biodiversity, high plant endemism, and function as water reservoir. The vegetation on this mountain is threatened by

  2. IC 3639 - A new bona fide Compton thick AGN unveiled by NuSTAR

    DEFF Research Database (Denmark)

    Boorman, Peter G.; Gandhi, P.; Alexander, D.

    2016-01-01

    We analyse high-quality NuSTAR observations of the local (z = 0.011) Seyfert 2 active galactic nucleus (AGN) IC 3639, in conjunction with archival Suzaku and Chandra data. This provides the first broadband X-ray spectral analysis of the source, spanning nearly two decades in energy (0.5 -30 keV)....

  3. Alpha-particle detection based on the BJT detector and simple, IC-based readout electronics

    Energy Technology Data Exchange (ETDEWEB)

    Rovati, L; Bonaiuti, M [Dipartimento di Ingegneria dell' Informazione, Universita di Modena e Reggio Emilia, Modena (Italy); Bettarini, S [Dipartimento di Fisica, Universita di Pisa and INFN Pisa, Pisa (Italy); Bosisio, L [Dipartimento di Fisica, Universita di Trieste and INFN Trieste, Trieste (Italy); Dalla Betta, G-F; Tyzhnevyi, V [Dipartimento di Ingegneria e Scienza dell' Informazione, Universita di Trento e INFN Trento, Trento (Italy); Verzellesi, G [Dipartimento di Scienze e Metodi dell' Ingegneria, Universita di Modena e Reggio Emilia and INFN Trento, Reggio Emilia (Italy); Zorzi, N, E-mail: giovanni.verzellesi@unimore.i [Fondazione Bruno Kessler (FBK), Trento (Italy)

    2009-11-15

    In this paper we propose a portable instrument for alpha-particle detection based on a previously-developed BJT detector and a simple, IC-based readout electronics. Experimental tests of the BJT detector and readout electronics are reported. Numerical simulations are adopted to predict the performance enhancement achievable with optimized BJT detectors.

  4. Alpha-particle detection based on the BJT detector and simple, IC-based readout electronics

    International Nuclear Information System (INIS)

    Rovati, L; Bonaiuti, M; Bettarini, S; Bosisio, L; Dalla Betta, G-F; Tyzhnevyi, V; Verzellesi, G; Zorzi, N

    2009-01-01

    In this paper we propose a portable instrument for alpha-particle detection based on a previously-developed BJT detector and a simple, IC-based readout electronics. Experimental tests of the BJT detector and readout electronics are reported. Numerical simulations are adopted to predict the performance enhancement achievable with optimized BJT detectors.

  5. On the Significance of Process Comprehension for Conducting Targeted ICS Attacks

    NARCIS (Netherlands)

    Green, Benjamin; Krotofil, Marina; Abbasi, Ali

    2017-01-01

    The exploitation of Industrial Control Systems (ICSs) has been described as both easy and impossible, where is the truth? Post-Stuxnet works have included a plethora of ICS focused cyber security research activities, with topics covering device maturity, network protocols, and overall cyber security

  6. 30 CFR 57.22104 - Open flames (I-C mines).

    Science.gov (United States)

    2010-07-01

    ....22104 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL MINE SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-UNDERGROUND METAL AND NONMETAL MINES Safety Standards for Methane in Metal and Nonmetal Mines Fire Prevention and Control § 57.22104 Open flames (I-C...

  7. Using Tablet PCs and Interactive Software in IC Design Courses to Improve Learning

    Science.gov (United States)

    Simoni, M.

    2011-01-01

    This paper describes an initial study of using tablet PCs and interactive course software in integrated circuit (IC) design courses. A rapidly growing community is demonstrating how this technology can improve learning and retention of material by facilitating interaction between faculty and students via cognitive exercises during lectures. While…

  8. A Herschel view of IC 1396 A: Unveiling the different sequences of star formation

    NARCIS (Netherlands)

    Sicilia-Aguilar, Aurora; Roccatagliata, Veronica; Getman, Konstantin; Henning, Thomas; Merín, Bruno; Eiroa, Carlos; Rivière-Marichalar, Pablo; Currie, Thayne

    Context. The IC 1396 A globule, located to the west of the young cluster Tr 37, is known to host many very young stars and protostars, and is also assumed to be a site of triggered star formation. Aims: Our aim is to test the triggering mechanisms and sequences leading to star formation in Tr 37 and

  9. Comparison between dominant NB and dominant IC heated ELMy H-mode discharges in JET

    NARCIS (Netherlands)

    Versloot, T.W.; Sartori, R.; de Vries, P.C.; et al, [No Value

    2011-01-01

    Abstract The experiment described in this paper is aimed at characterization of ELMy H-mode discharges with varying momentum input, rotation, power deposition profiles and ion to electron heating ratio obtained by varying the proportion between ion cyclotron (IC) and neutral beam (NB) heating. The

  10. Comparison between dominant NB and dominant IC heated ELMy H-mode discharges in JET

    NARCIS (Netherlands)

    Versloot, T. W.; Sartori, R.; Rimini, F.; de Vries, P. C.; Saibene, G.; Parail, V.; Beurskens, M. N. A.; Boboc, A.; Budny, R.; Crombe, K.; de la Luna, E.; Durodie, F.; Eich, T.; Giroud, C.; Kiptily, V.; Johnson, T.; Mantica, P.; Mayoral, M. L.; McDonald, D. C.; Monakhov, I.; Nave, M. F. F.; Voitsekhovitch, I.; Zastrow, K. D.

    2011-01-01

    The experiment described in this paper is aimed at characterization of ELMy H-mode discharges with varying momentum input, rotation, power deposition profiles and ion to electron heating ratio obtained by varying the proportion between ion cyclotron (IC) and neutral beam (NB) heating. The motivation

  11. IC 751: A New Changing Look AGN Discovered By NuSTAR

    DEFF Research Database (Denmark)

    Ricci, C.; Bauer, F. E.; Arevalo, P.

    2016-01-01

    We present results of five Nuclear Spectroscopic Telescope Array (NuSTAR) observations of the type 2 active galactic nucleus (AGN) in IC 751, three of which were performed simultaneously with XMM-Newton or Swift/X-Ray Telescope. We find that the nuclear X-ray source underwent a clear transition f...

  12. The measurement of Ksub(IC) in single crystal SiC using the indentation method

    International Nuclear Information System (INIS)

    Henshall, J.L.; Brookes, C.A.

    1985-01-01

    The present work has concentrated on investigating the underlying fracture toughness behaviour of SiC single crystals. This material was chosen because of the commercial importance of the various polycrystalline forms of SiC and the relative ready availability of reasonably sized single crystals. This study has examined the feasibility of using the indentation technique to determine Ksub(IC) in SiC single crystals. This requires much more less complex experimentation and also affords the possibility of being able to use this method to study the orientation dependence of Ksub(IC) in a similar manner to that used to investigate anisotropy in indentation hardness behaviour. A single crystal of 6H-SiC was used for all the hardness and conventional Ksub(IC) results reported here. The particular polytype and orientation were determined using the Laue X-ray method. All the measurements were made under ambient conditions. Three-point bend tests, with a 6 mm span on single edge notched beams, SENB, orientated such that the plane of the notch was brace 112-bar0 brace and the crack propagation direction were used for the conventional Ksub(IC) tests. The hardness indentations were all made on one particular SENB test piece after it had been fractured. The results are discussed. (author)

  13. A grammar of Ik (Icé-tód) : Northeast Uganda's last thriving Kuliak language

    NARCIS (Netherlands)

    Schrock, Terrill B.

    2014-01-01

    The Ik language (Icé-tód), spoken in northeast Uganda, forms the Kuliak (Rub) subgroup along with So/Tepeth and Nyang’í. These latter two lects have already succombed to assimilative pressures from neighboring Nilotic pastoralists like the Karimojong, Turkana, and Pokot. Despite

  14. The Toby Jug nebula (IC 2220): a bipolar and biconical nebula

    International Nuclear Information System (INIS)

    Perkins, H.G.; King, D.J.; Scarrott, S.M.

    1981-01-01

    An optical linear polarization map of IC 2220, the nebula surrounding the cool red giant HD 65750, is presented. The nebula appears to be bipolar and biconical in structure. The mass of the nebula is estimated to be 0.01 solar mass and is consistent with the nebula being formed from the current mass loss stage of the central star. (author)

  15. Cardiovascular disease events and its predictors in women: Isfahan Cohort Study (ICS

    Directory of Open Access Journals (Sweden)

    Masoumeh Sadeghi

    2017-09-01

    Conclusion: In ICS, HTN, diabetes mellitus and high triglyceride are strong predictors for CV events in Iranian women. As almost all strong risk markers of CVD events are preventable, health policy makers have to give urgent consideration to make preventive public health strategies.

  16. Fluorimetric urease inhibition assay on a multilayer microfluidic chip with immunoaffinity immobilized enzyme reactors.

    Science.gov (United States)

    Zhang, Qin; Tang, Xiuwen; Hou, Fenghua; Yang, Jianping; Xie, Zhiyong; Cheng, Zhiyi

    2013-10-01

    We fabricated a three-layer polydimethylsiloxane (PDMS)-based microfluidic chip for realizing urease inhibition assay with sensitive fluorescence detection. Procedures such as sample prehandling, enzyme reaction, reagent mixing, fluorescence derivatization, and detection can be readily carried out. Urease reactors were prepared by adsorption of rabbit immunoglobulin G (IgG) and immunoreaction with urease-conjugated goat anti-rabbit IgG. Acetohydroxamic acid (AHA) as a competitive inhibitor of urease was tested on the chip. Microfluidically generated gradient concentrations of AHA with substrate (urea) were loaded into urease reactors. After incubation, the produced ammonia was transported out of reactors and then reacted with o-phthalaldehyde (OPA) to generate fluorescent products. Urease inhibition was indicated by a decrease in fluorescence signal detected by microplate reader. The IC50 value of AHA was determined and showed good agreement with that obtained in microplate. The presented device combines several steps of the analytical process with advantages of low reagent consumption, reduced analysis time, and ease of manipulation. This microfluidic approach can be extended to the screening of inhibitory compounds in drug discovery. Copyright © 2013 Elsevier Inc. All rights reserved.

  17. A novel on-chip high to low voltage power conversion circuit

    International Nuclear Information System (INIS)

    Wang Hui; Wang Songlin; Mou Zaixin; Guo Baolong; Lai Xinquan; Ye Qiang; Li Xianrui

    2009-01-01

    A novel power supply transform technique for high voltage IC based on the TSMC 0.6 μm BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm 2 area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/deg. C. Compared with the traditional LDO (low dropout) regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.

  18. A novel on-chip high to low voltage power conversion circuit

    Energy Technology Data Exchange (ETDEWEB)

    Wang Hui; Wang Songlin; Mou Zaixin; Guo Baolong [Institute of Mechano-electronic Engineering, Xidian University, Xi' an 71007 (China); Lai Xinquan; Ye Qiang; Li Xianrui, E-mail: whui94@126.co [Institute of Electronic CAD, Xidian University, Xi' an 710071 (China)

    2009-03-15

    A novel power supply transform technique for high voltage IC based on the TSMC 0.6 mum BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm{sup 2} area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/deg. C. Compared with the traditional LDO (low dropout) regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.

  19. The defective nature of ice Ic and its implications for atmospheric science

    Science.gov (United States)

    Kuhs, W. F.; Hansen, T. C.

    2009-04-01

    The possible atmospheric implication of ice Ic (cubic ice) has already been suggested some time ago in the context of snow crystal formation [1]. New findings from air-borne measurements in cirrus clouds and contrails have put ice Ic into the focus of interest to understand the so-called "supersaturation puzzle" [2,3,4,5]. Our recent microstructural work on ice Ic [6,7] appears to be highly relevant in this context. We have found that ice Ic is characterized by a complex stacking fault pattern, which changes as a function of temperature as well as time. Indeed, from our own [8] and other group's work [9] one knows that (in contrast to earlier believe) ice Ic can form up to temperatures at least as high as 240K - thus in the relevant range for cirrus clouds. We have good preliminary evidence that the "cubicity" (which can be related to stacking fault probabilities) as well as the particle size of ice Ic are the relevant parameters for this correlation. The "cubicity" of stacking faulty ice Ic (established by diffraction) correlates nicely with the increased supersaturation at decreasing temperatures observed in cirrus clouds and contrails, a fact, which may be considered as further evidence for the presence of ice Ic. Moreover, the stacking faults lead to kinks in the outer shapes of the minute ice Ic crystals as seen by cryo scanning electron microscopy (cryo-SEM); these defective sites are likely to play some role in heterogeneous reactions in the atmosphere. The cryo-SEM work suggests that stacking-faulty ice Ic has many more active centres for such reactions than the usually considered thermodynamically stable form, ice Ih. [1] T Kobayashi & T Kuroda (1987) Snow Crystals. In: Morphology of Crystals (ed. I Sunagawa), Terra Scientific Publishing, Tokyo, pp.649-743. [2] DM Murphy (2003) Dehydration in cold clouds is enhanced by a transition from from cubic to hexagonal ice. Geophys.Res.Lett.,30, 2230, doi:10.1029/2003GL018566. [3] RS Gao & 19 other authors (2004

  20. Simulating the Effect of Modulated Tool-Path Chip Breaking On Surface Texture and Chip Length

    Energy Technology Data Exchange (ETDEWEB)

    Smith, K.S.; McFarland, J.T.; Tursky, D. A.; Assaid, T. S.; Barkman, W. E.; Babelay, Jr., E. F.

    2010-04-30

    One method for creating broken chips in turning processes involves oscillating the cutting tool in the feed direction utilizing the CNC machine axes. The University of North Carolina at Charlotte and the Y-12 National Security Complex have developed and are refining a method to reliably control surface finish and chip length based on a particular machine's dynamic performance. Using computer simulations it is possible to combine the motion of the machine axes with the geometry of the cutting tool to predict the surface characteristics and map the surface texture for a wide range of oscillation parameters. These data allow the selection of oscillation parameters to simultaneously ensure broken chips and acceptable surface characteristics. This paper describes the machine dynamic testing and characterization activities as well as the computational method used for evaluating and predicting chip length and surface texture.

  1. On-chip electrochromic micro display for a disposable bio-sensor chip

    Science.gov (United States)

    Zhu, Yanjun; Tsukamoto, Takashiro; Tanaka, Shuji

    2017-12-01

    This paper reports an on-chip electrochromic micro display made of polyaniline (PANi) which can be easily made on a CMOS chip. Micro-patterned PANi thin films were selectively deposited on pre-patterned microelectrodes by using electrodeposition. The optimum conditions for deposition and electrochromism were investigated. An 8-pixel on-chip micro display was made on a Si chip. The color of each PANi film could be independently but simultaneously controlled, which means any 1-byte digital data could be displayed on the display. The PANi display had a response time as fast as about 100 ms, which means the transfer data rate was as fast as 80 bits per second.

  2. Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging.

    Science.gov (United States)

    Gurun, Gokce; Tekes, Coskun; Zahorian, Jaime; Xu, Toby; Satir, Sarp; Karaman, Mustafa; Hasler, Jennifer; Degertekin, F Levent

    2014-02-01

    Intravascular ultrasound (IVUS) and intracardiac echography (ICE) catheters with real-time volumetric ultrasound imaging capability can provide unique benefits to many interventional procedures used in the diagnosis and treatment of coronary and structural heart diseases. Integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with front-end electronics in single-chip configuration allows for implementation of such catheter probes with reduced interconnect complexity, miniaturization, and high mechanical flexibility. We implemented a single-chip forward-looking (FL) ultrasound imaging system by fabricating a 1.4-mm-diameter dual-ring CMUT array using CMUT-on-CMOS technology on a front-end IC implemented in 0.35-μm CMOS process. The dual-ring array has 56 transmit elements and 48 receive elements on two separate concentric annular rings. The IC incorporates a 25-V pulser for each transmitter and a low-noise capacitive transimpedance amplifier (TIA) for each receiver, along with digital control and smart power management. The final shape of the silicon chip is a 1.5-mm-diameter donut with a 430-μm center hole for a guide wire. The overall front-end system requires only 13 external connections and provides 4 parallel RF outputs while consuming an average power of 20 mW. We measured RF A-scans from the integrated single- chip array which show full functionality at 20.1 MHz with 43% fractional bandwidth. We also tested and demonstrated the image quality of the system on a wire phantom and an ex vivo chicken heart sample. The measured axial and lateral point resolutions are 92 μm and 251 μm, respectively. We successfully acquired volumetric imaging data from the ex vivo chicken heart at 60 frames per second without any signal averaging. These demonstrative results indicate that single-chip CMUT-on-CMOS systems have the potential to produce realtime volumetric images with image quality and speed suitable for catheter-based clinical applications.

  3. Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

    Science.gov (United States)

    Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook

    2009-01-01

    A thick Cu column based double-bump flip chip structure is one of the promising alternatives for fine pitch flip chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip chip assemblies was investigated, and the failure mechanism was analyzed through the correlation of T/C test and the finite element analysis (FEA) results. After 1000 thermal cycles, T/C failures occurred at some Cu/SnAg bumps located at the edge and corner of chips. Scanning acoustic microscope analysis and scanning electron microscope observations indicated that the failure site was the Cu column/Si chip interface. It was identified by a FEA where the maximum stress concentration was located during T/C. During T/C, the Al pad between the Si chip and a Cu column bump was displaced due to thermomechanical stress. Based on the low cycle fatigue model, the accumulation of equivalent plastic strain resulted in thermal fatigue deformation of the Cu column bumps and ultimately reduced the thermal cycling lifetime. The maximum equivalent plastic strains of some bumps at the chip edge increased with an increased number of thermal cycles. However, equivalent plastic strains of the inner bumps did not increase regardless of the number of thermal cycles. In addition, the z-directional normal plastic strain ɛ22 was determined to be compressive and was a dominant component causing the plastic deformation of Cu/SnAg double bumps. As the number of thermal cycles increased, normal plastic strains in the perpendicular direction to the Si chip and shear strains were accumulated on the Cu column bumps at the chip edge at low temperature region. Thus it was found that the Al pad at the Si chip/Cu column interface underwent thermal fatigue deformation by compressive normal strain and the contact loss by displacement failure of the Al pad, the main T/C failure mode of the Cu/SnAg flip chip assembly, then occurred at the Si chip/Cu column interface shear strain deformation

  4. "Hook"-calibration of GeneChip-microarrays: Chip characteristics and expression measures

    Directory of Open Access Journals (Sweden)

    Krohn Knut

    2008-08-01

    Full Text Available Abstract Background Microarray experiments rely on several critical steps that may introduce biases and uncertainty in downstream analyses. These steps include mRNA sample extraction, amplification and labelling, hybridization, and scanning causing chip-specific systematic variations on the raw intensity level. Also the chosen array-type and the up-to-dateness of the genomic information probed on the chip affect the quality of the expression measures. In the accompanying publication we presented theory and algorithm of the so-called hook method which aims at correcting expression data for systematic biases using a series of new chip characteristics. Results In this publication we summarize the essential chip characteristics provided by this method, analyze special benchmark experiments to estimate transcript related expression measures and illustrate the potency of the method to detect and to quantify the quality of a particular hybridization. It is shown that our single-chip approach provides expression measures responding linearly on changes of the transcript concentration over three orders of magnitude. In addition, the method calculates a detection call judging the relation between the signal and the detection limit of the particular measurement. The performance of the method in the context of different chip generations and probe set assignments is illustrated. The hook method characterizes the RNA-quality in terms of the 3'/5'-amplification bias and the sample-specific calling rate. We show that the proper judgement of these effects requires the disentanglement of non-specific and specific hybridization which, otherwise, can lead to misinterpretations of expression changes. The consequences of modifying probe/target interactions by either changing the labelling protocol or by substituting RNA by DNA targets are demonstrated. Conclusion The single-chip based hook-method provides accurate expression estimates and chip-summary characteristics

  5. A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection

    OpenAIRE

    Diwei He; Stephen P. Morgan; Dimitrios Trachanis; Jan van Hese; Dimitris Drogoudis; Franco Fummi; Francesco Stefanni; Valerio Guarnieri; Barrie R. Hayes-Gill

    2015-01-01

    Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 ?m CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the...

  6. Results of irriadiating the APV5 chip

    CERN Document Server

    Raymond, M

    1996-01-01

    An APV5 chip has been irradiated in steps up to 16 Mrads using a Co-60 source in order to confirm the radiation hardness expected from individual transistor and sub-circuit measurements. Full functionality is preserved after irradiation and measurements of the amplifier pulse shape and noise are presented.

  7. Chip based electroanalytical systems for cell analysis

    DEFF Research Database (Denmark)

    Spegel, C.; Heiskanen, A.; Skjolding, L.H.D.

    2008-01-01

    ' measurements of processes related to living cells, i.e., systems without lysing the cells. The focus is on chip based amperometric and impedimetric cell analysis systems where measurements utilizing solely carbon fiber microelectrodes (CFME) and other nonchip electrode formats, such as CFME for exocytosis...

  8. Increasing security in inter-chip communication

    Science.gov (United States)

    Edwards, Nathan J; Hamlet, Jason; Bauer, Todd; Helinski, Ryan

    2014-10-28

    An apparatus for increasing security in inter-chip communication includes a sending control module, a communication bus, and a receiving control module. The communication bus is coupled between the sending control module and the receiving control module. The sending control module operates to send data on the communication bus, disable the communication bus when threats are detected, or both.

  9. Cytostretch, an Organ-on-Chip Platform

    NARCIS (Netherlands)

    Gaio, N.; van Meer, B.; Quiros Solano, W.F.; Bergers, L.; van de Stolpe, A; Mummery, CL; Sarro, P.M.; Dekker, R.

    2016-01-01

    Organ-on-Chips (OOCs) are micro-fabricated devices which are used to culture cells in order to mimic functional units of human organs. The devices are designed to simulate the physiological environment of tissues in vivo. Cells in some types of OOCs can be stimulated in situ by electrical and/or

  10. Microprocessors: From basic chips to complete systems

    International Nuclear Information System (INIS)

    Dobinson, R.W.

    1985-01-01

    These lectures aim to present and explain in general terms some of the characteristics of microprocessor chips and associated components. They show how systems are synthesized from the basic integrated circuit building blocks which are currently available; processor, memory, input-output (I/0) devices, etc. (orig./HSI)

  11. Potential roughness near lithographically fabricated atom chips

    DEFF Research Database (Denmark)

    Krüger, Peter; Andersson, L. M.; Wildermuth, Stefan

    2007-01-01

    Potential roughness has been reported to severely impair experiments in magnetic microtraps. We show that these obstacles can be overcome as we measure disorder potentials that are reduced by two orders of magnitude near lithographically patterned high-quality gold layers on semiconductor atom chip...

  12. Smart Chips for Smart Surroundings -- 4S

    NARCIS (Netherlands)

    Schuler, Eberhard; König, Ralf; Becker, Jürgen; Rauwerda, G.K.; van de Burgwal, M.D.; Smit, Gerardus Johannes Maria; Cardoso, João M.P.; Hübner, Michael

    2011-01-01

    The overall mission of the 4S project (Smart Chips for Smart Surroundings) was to define and develop efficient flexible, reconfigurable core building blocks, including the supporting tools, for future Ambient System Devices. Reconfigurability offers the needed flexibility and adaptability, it

  13. On-chip mode division multiplexing technologies

    DEFF Research Database (Denmark)

    Ding, Yunhong; Frellsen, Louise Floor; Guan, Xiaowei

    2016-01-01

    Space division multiplexing (SDM) is currently widely investigated in order to provide enhanced capacity thanks to the utilization of space as a new degree of multiplexing freedom in both optical fiber communication and on-chip interconnects. Basic components allowing the processing of spatial...... photonic integrated circuit mode (de) multiplexer for few-mode fibers (FMFs)....

  14. What's A Pixel Particle Sensor Chip?

    CERN Multimedia

    2008-01-01

    ATLAS particle physics experiment aided with collaboration ON Semiconductor was recently honored by the European Council for Nuclear Research (CERN), with an Industrial Award recognizing the company's contribution in supplying complex "Pixel Particle Sensor" chips for use in CERN's ATLAS particle physics experiment.

  15. Microarrays (DNA Chips) for the Classroom Laboratory

    Science.gov (United States)

    Barnard, Betsy; Sussman, Michael; BonDurant, Sandra Splinter; Nienhuis, James; Krysan, Patrick

    2006-01-01

    We have developed and optimized the necessary laboratory materials to make DNA microarray technology accessible to all high school students at a fraction of both cost and data size. The primary component is a DNA chip/array that students "print" by hand and then analyze using research tools that have been adapted for classroom use. The…

  16. Drying characteristics of willow chips and stems

    NARCIS (Netherlands)

    Gigler, J.K.; Loon, van W.K.P.; Seres, I.; Meerdink, G.; Coumans, W.J.

    2000-01-01

    In supply chains of willow (Salix viminalis) biomass to energy plants, drying is advisable in order to enable safe long-term storage, increase boiler efficiency and reduce gaseous emissions. To gain insight into the drying process, drying characteristics of willow chips and stems were investigated

  17. Atom chips: mesoscopic physics with cold atoms

    International Nuclear Information System (INIS)

    Krueger, P.; Wildermuth, S.; Hofferberth, S.; Haller, E.; GAllego Garcia, D.; Schmiedmayer, J.

    2005-01-01

    Full text: Cold neutral atoms can be controlled and manipulated in microscopic potentials near surfaces of atom chips. These integrated micro-devices combine the known techniques of atom optics with the capabilities of well established micro- and nanofabrication technology. In analogy to electronic microchips and integrated fiber optics, the concept of atom chips is suitable to explore the domain of mesoscopic physics with matter waves. We use current and charge carrying structures to form complex potentials with high spatial resolution only microns from the surface. In particular, atoms can be confined to an essentially one-dimensional motion. In this talk, we will give an overview of our experiments studying the manipulation of both thermal atoms and BECs on atom chips. First experiments in the quasi one-dimensional regime will be presented. These experiments profit from strongly reduced residual disorder potentials caused by imperfections of the chip fabrication with respect to previously published experiments. This is due to our purely lithographic fabrication technique that proves to be advantageous over electroplating. We have used one dimensionally confined BECs as an ultra-sensitive probe to characterize these potentials. These smooth potentials allow us to explore various aspects of the physics of degenerate quantum gases in low dimensions. (author)

  18. An On-Chip Learning Neuromorphic Autoencoder With Current-Mode Transposable Memory Read and Virtual Lookup Table.

    Science.gov (United States)

    Cho, Hwasuk; Son, Hyunwoo; Seong, Kihwan; Kim, Byungsub; Park, Hong-June; Sim, Jae-Yoon

    2018-02-01

    This paper presents an IC implementation of on-chip learning neuromorphic autoencoder unit in a form of rate-based spiking neural network. With a current-mode signaling scheme embedded in a 500 × 500 6b SRAM-based memory, the proposed architecture achieves simultaneous processing of multiplications and accumulations. In addition, a transposable memory read for both forward and backward propagations and a virtual lookup table are also proposed to perform an unsupervised learning of restricted Boltzmann machine. The IC is fabricated using 28-nm CMOS process and is verified in a three-layer network of encoder-decoder pair for training and recovery of images with two-dimensional pixels. With a dataset of 50 digits, the IC shows a normalized root mean square error of 0.078. Measured energy efficiencies are 4.46 pJ per synaptic operation for inference and 19.26 pJ per synaptic weight update for learning, respectively. The learning performance is also estimated by simulations if the proposed hardware architecture is extended to apply to a batch training of 60 000 MNIST datasets.

  19. On-chip antenna: Practical design and characterization considerations

    KAUST Repository

    Shamim, Atif; Salama, Khaled N.; Sedky, S.; Soliman, E. A.

    2012-01-01

    This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

  20. On-chip antenna: Practical design and characterization considerations

    KAUST Repository

    Shamim, Atif

    2012-07-28

    This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

  1. On-chip concentration of bacteria using a 3D dielectrophoretic chip and subsequent laser-based DNA extraction in the same chip

    International Nuclear Information System (INIS)

    Cho, Yoon-Kyoung; Kim, Tae-hyeong; Lee, Jeong-Gun

    2010-01-01

    We report the on-chip concentration of bacteria using a dielectrophoretic (DEP) chip with 3D electrodes and subsequent laser-based DNA extraction in the same chip. The DEP chip has a set of interdigitated Au post electrodes with 50 µm height to generate a network of non-uniform electric fields for the efficient trapping by DEP. The metal post array was fabricated by photolithography and subsequent Ni and Au electroplating. Three model bacteria samples (Escherichia coli, Staphylococcus epidermidis, Streptococcus mutans) were tested and over 80-fold concentrations were achieved within 2 min. Subsequently, on-chip DNA extraction from the concentrated bacteria in the 3D DEP chip was performed by laser irradiation using the laser-irradiated magnetic bead system (LIMBS) in the same chip. The extracted DNA was analyzed with silicon chip-based real-time polymerase chain reaction (PCR). The total process of on-chip bacteria concentration and the subsequent DNA extraction can be completed within 10 min including the manual operation time.

  2. Digital column readout architecture for the ATLAS pixel 025 mum front end IC

    CERN Document Server

    Mandelli, E; Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Marchesini, R; Meddeler, G; Peric, I

    2002-01-01

    A fast low noise, limited power, radiation-hard front-end chip was developed for reading out the Atlas Pixel Silicon Detector. As in the past prototypes, every chip is used to digitize and read out charge and time information from hits on each one of its 2880 inputs. The basic column readout architecture idea was adopted and modified to allow a safe transition to quarter micron technology. Each pixel cell, organized in a 160 multiplied by 18 matrix, can be independently enabled and configured in order to optimize the analog signal response and to prevent defective pixels from saturating the readout. The digital readout organizes hit data coming from each column, with respect to time, and output them on a low-level serial interface. A considerable effort was made to design state machines free of undefined states, where single-point defects and charge deposited by heavy ions in the silicon could have led to unpredicted forbidden states. 7 Refs.

  3. A cell-level power management IC in BCD-SOI for partial power processing in Concentrating-PV systems

    NARCIS (Netherlands)

    Zaman, M.S.; Wen, Y.; Fernandes, R.; Buter, B.; Doorn, T.S.; Dijkstra, M.; Bergveld, H.J.; Trescases, O.

    2014-01-01

    This work presents a power management IC used to mitigate the effects of mismatch in Concentrating-Photovoltaic (CPV) systems. The IC contains a bi-directional dc-dc converter, an auxiliary boost converter to generate the internal 10 V power supply, as well as protection and monitoring circuits. The

  4. Radio Jets Clearing the Way Through a Galaxy: Watching Feedback in Action in the Seyfert Galaxy IC 5063

    NARCIS (Netherlands)

    Morganti, R.; Oosterloo, T. A.; Oonk, J. B. R.; Frieswijk, W.; Tadhunter, C. N.

    2015-01-01

    High-resolution (0.5 arcsec) CO(2-1) observations performed with the Atacama Large Millimetre/submillimetre Array have been used to trace the kinematics of the molecular gas in the Seyfert 2 galaxy{IC 5063}. Although one of the most radio-loud Seyfert galaxy, IC 5063 is a relatively weak radio

  5. Production test engineering in FE-I4 system-on-chip to boost the reliability and high-quality demands in IBL applications

    International Nuclear Information System (INIS)

    Zivkovic, V A; Porret, D

    2013-01-01

    The article addresses production test development effort of the ATLAS FE-I4 integrated circuit. This particular production test targets manufacturing faults in the ICs and has been taken as a supplementary approach, besides standard functional test, to further decrease the risk of potential application failures. The Design-for-Test structures inside the digital part of the chip, together with the specially devised top-level simulations enabled straightforward test development and debug in the production test environment. The production test itself has been commissioned to the external test company, with the supervision of the FE-I4 team at the test floor.

  6. Radon measurements at IC-09 well of Chingshui geothermal field (Taiwan): A case study

    International Nuclear Information System (INIS)

    Chen, Y.; Kuo, T.; Fan, K.; Liang, H.; Tsai, C.; Chiang, C.; Su, C.

    2011-01-01

    Radon concentration was monitored during the flow tests of well IC-09 at the Chingshui geothermal field. The radon concentration was found to increase from 54 ± 29 to 983 ± 65 Bq/m 3 as a step function of production time, or cumulative production. The observed radon behavior can be explained by a radial composite model with the carbonate scales deposited in the skin zone near the well. The radius of skin zone near well IC-09 can be estimated with radon data at about 20 m using a plug flow model. Monitoring natural radon during the well flow tests is a helpful tracer to diagnose the formation damage near the well.

  7. Tipe Mating pada Empat Isolat Thanatephorus Cucumeris Anamorf: Rhizoctonia solani Anastomosis Group (AG 1-IC

    Directory of Open Access Journals (Sweden)

    Achmadi Priyatmojo

    2006-12-01

    Full Text Available Four parent isolates (189, Rh28, BW3 and F-1 of Thanatephorus cucumeris (anamorph: Rhizoctonia solani AG 1-IC were induced to produce basidiospores using soil-over culture method. All of four parent isolates could produce basidiospores. Colonies obtained from single basidiospore isolate of each parent isolate were paired on charcoal potato dextrose agar. Single basidiospore isolate having different mating type produced tuft at area of the junction of paired colonies. On the based of tuft formation, single basidiospore isolates of each parent isolate could be divided into two different mating types, therefore it is concluded that each of 189, Rh28, BW3 and F-1 isolate of T. cucumeris AG I-IC has bipolar mating type.

  8. Automatic analog IC sizing and optimization constrained with PVT corners and layout effects

    CERN Document Server

    Lourenço, Nuno; Horta, Nuno

    2017-01-01

    This book introduces readers to a variety of tools for automatic analog integrated circuit (IC) sizing and optimization. The authors provide a historical perspective on the early methods proposed to tackle automatic analog circuit sizing, with emphasis on the methodologies to size and optimize the circuit, and on the methodologies to estimate the circuit’s performance. The discussion also includes robust circuit design and optimization and the most recent advances in layout-aware analog sizing approaches. The authors describe a methodology for an automatic flow for analog IC design, including details of the inputs and interfaces, multi-objective optimization techniques, and the enhancements made in the base implementation by using machine leaning techniques. The Gradient model is discussed in detail, along with the methods to include layout effects in the circuit sizing. The concepts and algorithms of all the modules are thoroughly described, enabling readers to reproduce the methodologies, improve the qual...

  9. Catalog of Realizations for DXCCII using Commercially Available ICs and Applications

    Directory of Open Access Journals (Sweden)

    S. Maheshwari

    2012-04-01

    Full Text Available This paper presents fifteen distinct practical realizations for dual-X second generation current conveyor (DXCCII using commercially available integrated circuits. Detailed comparisons and results are presented to verify the utility of proposed realizations. The catalog of proposed realizations is a first attempt and is expected to be useful for testing newly developed circuits based on dual-X second generation current conveyor. Each of the first fourteen proposed realizations uses four ICs. One three IC based implementation is further given making the total count fifteen. Some additional features are also explored which further enhance the versatility of DXCCII. The paper further presents a novel and compact quadrature oscillator to verify the applicability of the proposed realizations. Single resistance control of the frequency of oscillation is also demonstrated by employing the new gain-variable DXCCII. Experimental results are also included along with simulation results to validate the proposed theory and its practical significance.

  10. Anatomy of a merger - CO in Arp 299 (IC 694-NGC 3690)

    International Nuclear Information System (INIS)

    Sargent, A.; Scoville, N.

    1991-01-01

    High-resolution (2.4-arcsec) CO observations of the interacting system Arp 299 (Mrk 171: IC 694 and NGC 3690) reveal major gas condensations at the nuclei of both galaxies and in the disk overlap region. The 0.9 x 10 to the 9th solar masses of H2 at the nucleus of NGC 3690 extends to radii of 310 pc and probably sustains a starburst. A compact source (radius not greater than 250 pc) of mass 3.9 x 10 to the 9th solar masses is found at the nucleus of IC 694; this galaxy may harbor an AGN. At least three discrete subcondensations, probably active star-forming knots, are detected in the 1800 x 640 pc overlap region. 24 refs

  11. On-chip particle trapping and manipulation

    Science.gov (United States)

    Leake, Kaelyn Danielle

    The ability to control and manipulate the world around us is human nature. Humans and our ancestors have used tools for millions of years. Only in recent years have we been able to control objects at such small levels. In order to understand the world around us it is frequently necessary to interact with the biological world. Optical trapping and manipulation offer a non-invasive way to move, sort and interact with particles and cells to see how they react to the world around them. Optical tweezers are ideal in their abilities but they require large, non-portable, and expensive setups limiting how and where we can use them. A cheap portable platform is required in order to have optical manipulation reach its full potential. On-chip technology offers a great solution to this challenge. We focused on the Liquid-Core Anti-Resonant Reflecting Optical Waveguide (liquid-core ARROW) for our work. The ARROW is an ideal platform, which has anti-resonant layers which allow light to be guided in liquids, allowing for particles to easily be manipulated. It is manufactured using standard silicon manufacturing techniques making it easy to produce. The planner design makes it easy to integrate with other technologies. Initially I worked to improve the ARROW chip by reducing the intersection losses and by reducing the fluorescence and background on the ARROW chip. The ARROW chip has already been used to trap and push particles along its channel but here I introduce several new methods of particle trapping and manipulation on the ARROW chip. Traditional two beam traps use two counter propagating beams. A trapping scheme that uses two orthogonal beams which counter to first instinct allow for trapping at their intersection is introduced. This scheme is thoroughly predicted and analyzed using realistic conditions. Simulations of this method were done using a program which looks at both the fluidics and optical sources to model complex situations. These simulations were also used to

  12. Interface for the Construction of the CMS Detector (IC''3MS); Interfaz para la Construccion de Camaras CMS (IC''3MS)

    Energy Technology Data Exchange (ETDEWEB)

    Ballador Ferreras, A.; Gonzalez Giralda, C. [Ciemat. Madrid (Spain)

    2001-07-01

    This Technical Report shows a computer System named: Interface for the Control of CMS Detector (IC''3MS), whose main objective is to provide a design and advice tool which can be used for the assembly of super layers for the Compacts Muon Solenoid. This computer application is divided up into three independent modules that maintain a proper connection between them. These modules correspond to the three principal actors that control the assembly we said before. These actors are the analysts, that determine the control routines, the engineers, that specify the control details and finally the workers who use the control routines. This application has been developed as a collaboration between the Experimental Physic of Particles; which belongs to the Fusion and Elementary particles department and the Special Project Group, belonging to the Information Technologies Department, both them from the CIEMAT (Author)

  13. Near-infrared photometric study of open star cluster IC 1805

    International Nuclear Information System (INIS)

    Sagar, R.; Yu, Q.Z.

    1990-01-01

    The JHK magnitudes of 29 stars in the region of open star cluster IC 1805 were measured. These, and the existing infrared and optical observations, indicate a normal interstellar extinction law in the direction of the cluster. Further, most of the early-type stars have near-infrared fluxes as expected from their spectral types. Patchy distribution of ionized gas and dust appears to be the cause of nonuniform extinction across the cluster face. 36 refs

  14. International Cooperation in Acquisition, Technology and Logistics (IC in AT&L) Handbook

    Science.gov (United States)

    2012-05-01

    to think of the hierarchy of relationships as a pyramid as illustrated in Figure 1-2. Even though IC in AT&L programs form the capstone, it does...negotiation Czech Republic RDT&E Agreement Egypt TRDP Agreement Finland RDT&E Agreement in final national staffing France RDT&E Agreement Germany RDT&E...Act Australia Luxembourg Belgium Netherlands Canada Norway Egypt Portugal Denmark Spain France Sweden Germany Switzerland Greece Turkey Israel

  15. Testbed diversity as a fundamental principle for effective ICS security research

    OpenAIRE

    Green, Benjamin; Frey, Sylvain Andre Francis; Rashid, Awais; Hutchison, David

    2016-01-01

    The implementation of diversity in testbeds is essential to understanding and improving the security and resilience of Industrial Control Systems (ICS). Employing a wide spec- trum of equipment, diverse networks, and business processes, as deployed in real-life infrastructures, is particularly diffi- cult in experimental conditions. However, this level of di- versity is key from a security perspective, as attackers can exploit system particularities and process intricacies to their advantage....

  16. A SPECTROSCOPICALLY NORMAL TYPE Ic SUPERNOVA FROM A VERY MASSIVE PROGENITOR

    International Nuclear Information System (INIS)

    Valenti, Stefano; Pastorello, Andrea; Benetti, Stefano; Cappellaro, Enrico; Tomasella, Lina; Turatto, Massimo; Taubenberger, Stefan; Aramyan, Levon; Botticella, Maria Teresa; Fraser, Morgan; Smartt, Stephen J.; Magill, Lindsay; Kotak, Rubina; Wright, Darryl E.; Elias-Rosa, Nancy; Ergon, Mattias; Sollerman, Jesper; Magnier, Eugene; Price, Paul A.

    2012-01-01

    We present observations of the Type Ic supernova (SN Ic) 2011bm spanning a period of about one year. The data establish that SN 2011bm is a spectroscopically normal SN Ic with moderately low ejecta velocities and with a very slow spectroscopic and photometric evolution (more than twice as slow as SN 1998bw). The Pan-STARRS1 retrospective detection shows that the rise time from explosion to peak was ∼40 days in the R band. Through an analysis of the light curve and the spectral sequence, we estimate a kinetic energy of ∼7-17 foe and a total ejected mass of ∼7-17 M ☉ , 5-10 M ☉ of which is oxygen and 0.6-0.7 M ☉ is 56 Ni. The physical parameters obtained for SN 2011bm suggest that its progenitor was a massive star of initial mass 30-50 M ☉ . The profile of the forbidden oxygen lines in the nebular spectra shows no evidence of a bi-polar geometry in the ejected material.

  17. Service Quality, Students' Satisfaction and Behavioural Intentions in STEM and IC Higher Education Institutions

    Directory of Open Access Journals (Sweden)

    Dunja Meštrović

    2017-03-01

    Full Text Available Service quality, students' satisfaction and their behavioural intentions are recognised as rather important aspects in higher education institution's strategy in a competitive higher education marketplace, which enable them to attract and retain students in science, technology, engineering and mathematics (STEM and information-communication (IC study areas. This research aimed to study the relationship between service quality, students' satisfaction and behavioural intentions of STEM and IC students of the University of Rijeka Departments. Partial least squares structural equation modelling using SmartPLS 3.0 software was performed on student survey data, confirming a direct, positive and significant relationship between higher education service quality and students' satisfaction and between students' satisfaction and their behavioural intentions. According to indirect effects analysis, perceived higher education service quality has an an indirect, positive and significant impact on students' behavioural intentions through students' satisfaction. The results indicate that higher education service quality is an imperative for higher education sector. Based on the findings of this study, useful to policy makers in the services industry in general and in higher education sector in particular, improvements can be planned all service quality dimensions as a key factor to attract, educate and retain STEM and IC students in Croatia.

  18. Interpretation of two compact planetary nebulae, IC 4997 and NGC 6572, with aid of theoretical models.

    Science.gov (United States)

    Hyung, S; Aller, L H

    1993-01-15

    Observations of two dense compact planetary nebulae secured with the Hamilton Echelle spectrograph at Lick Observatory combined with previously published UV spectra secured with the International Ultraviolet Explorer enable us to probe the electron densities and temperatures (plasma diagnostics) and ionic concentrations in these objects. The diagnostic diagrams show that no homogenous model will work for these nebulae. NGC 6572 may consist of an inner torordal ring of density 25,000 atoms/cm3 and an outer conical shell of density 10,000 atoms/cm3. The simplest model of IC 4997 suggests a thick inner shell with a density of about 107 atoms/cm3 and an outer envelope of density 10,000 atoms/cm3. The abundances of all elements heavier than He appear to be less than the solar values in NGC 6572, whereas He, C, N, and O may be more abundant in IC 4997 than in the sun. IC 4997 presents puzzling problems.

  19. PREFACE: 2nd International Conference on Mathematical Modeling in Physical Sciences 2013 (IC-MSQUARE 2013)

    Science.gov (United States)

    2014-03-01

    The second International Conference on Mathematical Modeling in Physical Sciences (IC-MSQUARE) took place at Prague, Czech Republic, from Sunday 1 September to Thursday 5 September 2013. The Conference was attended by more than 280 participants and hosted about 400 oral, poster, and virtual presentations while counted more than 600 pre-registered authors. The second IC-MSQUARE consisted of different and diverging workshops and thus covered various research fields where Mathematical Modeling is used, such as Theoretical/Mathematical Physics, Neutrino Physics, Non-Integrable Systems, Dynamical Systems, Computational Nanoscience, Biological Physics, Computational Biomechanics, Complex Networks, Stochastic Modeling, Fractional Statistics, DNA Dynamics, Macroeconomics. The scientific program was rather heavy since after the Keynote and Invited Talks in the morning, three parallel sessions were running every day. However, according to all attendees, the program was excellent with high level of talks and the scientific environment was fruitful, thus all attendees had a creative time. We would like to thank the Keynote Speaker and the Invited Speakers for their significant contribution to IC-MSQUARE. We also would like to thank the Members of the International Advisory and Scientific Committees as well as the Members of the Organizing Committee. Further information on the editors, speakers and committees is available in the attached pdf.

  20. PREFACE: 4th International Conference on Mathematical Modeling in Physical Sciences (IC-MSquare2015)

    Science.gov (United States)

    Vlachos, Dimitrios; Vagenas, Elias C.

    2015-09-01

    The 4th International Conference on Mathematical Modeling in Physical Sciences (IC-MSQUARE) took place in Mykonos, Greece, from Friday 5th June to Monday 8th June 2015. The Conference was attended by more than 150 participants and hosted about 200 oral, poster, and virtual presentations. There were more than 600 pre-registered authors. The 4th IC-MSQUARE consisted of different and diverging workshops and thus covered various research fields where Mathematical Modeling is used, such as Theoretical/Mathematical Physics, Neutrino Physics, Non-Integrable Systems, Dynamical Systems, Computational Nanoscience, Biological Physics, Computational Biomechanics, Complex Networks, Stochastic Modeling, Fractional Statistics, DNA Dynamics, Macroeconomics etc. The scientific program was rather intense as after the Keynote and Invited Talks in the morning, three parallel oral and one poster session were running every day. However, according to all attendees, the program was excellent with a high quality of talks creating an innovative and productive scientific environment for all attendees. We would like to thank the Keynote Speaker and the Invited Speakers for their significant contribution to IC-MSQUARE. We also would like to thank the Members of the International Advisory and Scientific Committees as well as the Members of the Organizing Committee.