WorldWideScience

Sample records for hybrid microelectronic circuits

  1. Hybrid microelectronic technology

    Science.gov (United States)

    Moran, P.

    Various areas of hybrid microelectronic technology are discussed. The topics addressed include: basic thick film processing, thick film pastes and substrates, add-on components and attachment methods, thin film processing, and design of thick film hybrid circuits. Also considered are: packaging hybrid circuits, automating the production of hybrid circuits, application of hybrid techniques, customer's view of hybrid technology, and quality control and assurance in hybrid circuit production.

  2. Microelectronic circuit design for energy harvesting systems

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2017-01-01

    This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design. Provides a single-source reference to energy harvesting and its applications; Serves as a practical guide to microelectronics design for energy harvesting, with application to mobile power supplies; Enables readers to develop energy harvesting systems for wearable/mobile electronics.

  3. Temperature-independent resistor for microelectronic circuits

    Science.gov (United States)

    Aegerter, S.; Libby, W. F.

    1970-01-01

    Heat treating insulating crystals in gaseous hydrogen atmosphere produce resistive device which is temperature-independent from 77 to 295 degrees K. Increasing the concentration of hydrogen within the crystal yields semiconductor, hybrid, and metallic conduction characteristics which are combined with a depletion layer at the surface.

  4. A bistable microelectronic circuit for sensing extremely low electric field

    Science.gov (United States)

    In, Visarath; Longhini, Patrick; Liu, Norman; Kho, Andy; Neff, Joseph D.; Palacios, Antonio; Bulsara, Adi R.

    2010-01-01

    Bistable systems are prevalently found in many sensor systems. Recently, we have explored (unidirectionally) coupled overdamped bistable systems that admit self-sustained oscillations when the coupling parameter is swept through the critical points of bifurcations [V. In et al., Phys. Rev. E 68, 045102-R (2003); A. R. Bulsara et al., Phys. Rev. E 70, 036103 (2004); V. In et al., Phys. Rev. E 72, 045104-R (2005); Phys Rev. Lett. 91, 244101 (2003); A. Palacios et al., Phys. Rev. E 72, 026211 (2005); V. In et al., Phys. Rev. E 73, 066121 (2006)]. Complex behaviors emerge, in addition, from these (relatively simple) coupled systems when an external signal (ac or dc) is applied uniformly to all the elements in the array. In particular, we have demonstrated this emergent behavior for a coupled system comprised of mean-field hysteretic elements describing a "single-domain" ferromagnetic sample. The results are being used to develop extremely sensitive magnetic sensors capable of resolving field changes as low as 150 pT by observing the changes in the oscillation characteristics of the coupled sensors. In this paper, we explore the underlying dynamics of a coupled bistable system realized by coupling microelectronic circuits, which belong to the same class of dynamics as the aforementioned (ferromagnetic) system, with the nonlinear features and coupling terms modeled by hyperbolic tangent nonlinearities; these nonlinearities stem from the operational transconductance amplifiers used in constructing the microcircuits. The emergent behavior is being applied to develop an extremely sensitive electric-field sensor.

  5. Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer

    Directory of Open Access Journals (Sweden)

    Zhengguo Shang

    2009-05-01

    Full Text Available A novel high-precision vacuum microelectronic accelerometer has been successfully fabricated and tested in our laboratory. This accelerometer has unique advantages of high sensitivity, fast response, and anti-radiation stability. It is a prototype intended for navigation applications and is required to feature micro-g resolution. This paper briefly describes the structure and working principle of our vacuum microelectronic accelerometer, and the mathematical model is also established. The performances of the accelerometer system are discussed after Matlab modeling. The results show that, the dynamic response of the accelerometer system is significantly improved by choosing appropriate parameters of signal detecting circuit, and the signal detecting circuit is designed. In order to attain good linearity and performance, the closed-loop control mode is adopted. Weak current detection technology is studied, and integral T-style feedback network is used in I/V conversion, which will eliminate high-frequency noise at the front of the circuit. According to the modeling parameters, the low-pass filter is designed. This circuit is simple, reliable, and has high precision. Experiments are done and the results show that the vacuum microelectronic accelerometer exhibits good linearity over -1 g to +1 g, an output sensitivity of 543 mV/g, and a nonlinearity of 0.94 %.

  6. A flexible and robust soft-error testing system for microelectronic devices and integrated circuits

    Institute of Scientific and Technical Information of China (English)

    王晓辉; 杨振雷; 童腾; 苏弘; 刘杰; 张战刚; 古松; 刘天奇; 孔洁; 赵兴文

    2015-01-01

    Single event effects (SEEs) induced by radiations become a significant reliability challenge for modern elec-tronic systems. To evaluate SEEs susceptibility for microelectronic devices and integrated circuits (ICs), an SEE testing system with flexibility and robustness was developed at Heavy Ion Research Facility in Lanzhou (HIRFL). The system is compatible with various types of microelectronic devices and ICs, and supports plenty of complex and high-speed test schemes and plans for the irradiated devices under test (DUTs). Thanks to the combination of meticulous circuit design and the hardened logic design, the system has additional performances to avoid an overheated situation and irradiations by stray radiations. The system has been tested and verified by experiments for irradiating devices at HIRFL.

  7. A Bistable Microelectronic Circuit for Sensing Extremely Low Electric Field

    Science.gov (United States)

    2010-01-01

    schematic of a single element is shown in Fig. 2. It consists of two differential pairs that employ negative- positive-negative NPN transistors with...been transformed into a current Isig that is then amplified by the NPN transistor . In fact, the circuit responds to very small on the order of pico...one of them being cross coupled, two positive channel metal oxide semiconduc- tor PMOS transistors , and a pair of resistors. In each dif- ferential

  8. Microelectronics at Sandia Laboratories

    Energy Technology Data Exchange (ETDEWEB)

    Spencer, W.J.; Gregory, B.L.; Franzak, E.G.; Hood, J.A.

    1975-12-31

    The microelectronics capability at Sandia Laboratories spans the complete range of component activity from initial design to final assembly into subsystems and systems. Highly reliable, radiation-tolerant devices and integrated circuits can be designed, fabricated, and incorporated into printed circuit assemblies or into thick- or thin-film hybrid microcircuits. Sandia has an experienced staff, exceptional facilities and aggressive on-going programs in all these areas. The authors can marshall a broad range of skills and capabilities to attack and solve problems in design, fabrication, assembly, or production. Key facilities, programs, and capabilities in the Sandia microelectronics effort are discussed in more detail in this booklet.

  9. SEMICONDUCTOR INTEGRATED CIRCUITS: A four-channel microelectronic system for neural signal regeneration

    Science.gov (United States)

    Shushan, Xie; Zhigong, Wang; Xiaoying, Lü; Wenyuan, Li; Haixian, Pan

    2009-12-01

    This paper presents a microelectronic system which is capable of making a signal record and functional electric stimulation of an injured spinal cord. As a requirement of implantable engineering for the regeneration microelectronic system, the system is of low noise, low power, small size and high performance. A front-end circuit and two high performance OPAs (operational amplifiers) have been designed for the system with different functions, and the two OPAs are a low-noise low-power two-stage OPA and a constant-gm RTR input and output OPA. The system has been realized in CSMC 0.5-μm CMOS technology. The test results show that the system satisfies the demands of neuron signal regeneration.

  10. Additive Manufacturing of Hybrid Circuits

    Science.gov (United States)

    Sarobol, Pylin; Cook, Adam; Clem, Paul G.; Keicher, David; Hirschfeld, Deidre; Hall, Aaron C.; Bell, Nelson S.

    2016-07-01

    There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

  11. Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

    DEFF Research Database (Denmark)

    Katsia, E.; Huby, N.; Tallarida, G.

    2009-01-01

    Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V...

  12. Design and Implementation of a Hybrid SET-CMOS Based Sequential Circuits

    Directory of Open Access Journals (Sweden)

    Anindya Jana

    2012-05-01

    Full Text Available Single Electron Transistor is a hot cake in the present research area of VLSI design and Microelectron-ics technology. It operates through one-by-one tunneling of electrons through the channel, utilizing the Coulomb blockade Phenomenon. Due to nanoscale feature size, ultralow power dissipation, and unique Coulomb blockade oscillation characteristics it may replace Field Effect Transistor FET. SET is very much advantageous than CMOS in few points. And in few points CMOS is advantageous than SET. So it has been seen that Combination of SET and CMOS is very much effective in the nanoscale, low power VLSI circuits. This paper has given a idea to make different sequential circuits using the Hybrid SET-CMOS. The MIB model for SET and BSIM4 model for CMOS are used. The operations of the proposed circuits are verified in Tanner environment. The performances of CMOS and Hybrid SET-CMOS based circuits are compared. The hybrid SET-CMOS circuit is found to consume lesser power than the CMOS based circuit. Further it is established that hybrid SET-CMOS based circuit is much faster compared to CMOS based circuit.

  13. Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

    Science.gov (United States)

    Katsia, E.; Huby, N.; Tallarida, G.; Kutrzeba-Kotowska, B.; Perego, M.; Ferrari, S.; Krebs, F. C.; Guziewicz, E.; Godlewski, M.; Osinniy, V.; Luka, G.

    2009-04-01

    Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V and a current density of 104 A/cm2. Electrical characteristics are discussed taking into account the chemical structure of the stack and the energy band diagram.

  14. Design, processing and testing of LSI arrays: Hybrid microelectronics task

    Science.gov (United States)

    Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.

    1979-01-01

    Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

  15. Superconducting Microelectronics.

    Science.gov (United States)

    Henry, Richard W.

    1984-01-01

    Discusses superconducting microelectronics based on the Josephson effect and its advantages over conventional integrated circuits in speed and sensitivity. Considers present uses in standards laboratories (voltage) and in measuring weak magnetic fields. Also considers future applications in superfast computer circuitry using Superconducting…

  16. Active microelectronic array system for DNA hybridization, genotyping and pharmacogenomic applications.

    Science.gov (United States)

    Sosnowski, Ron; Heller, Michael J; Tu, Eugene; Forster, Anita H; Radtkey, Ray

    2002-12-01

    Microelectronic arrays have been developed for DNA hybridization analysis of point mutations, single nucleotide polymorphisms, short tandem repeats and gene expression. In addition to a variety of molecular biology and genomic research applications, such devices will also be used for infectious disease detection, genetic and cancer diagnostics, and pharmacogenomic applications. These microelectronic array devices are able to produce defined electric fields on their surfaces that allow charged molecules and other entities to be transported to or from any test site or micro-location on the planar surface of the device. These molecules and entities include DNA, RNA, proteins, enzymes, antibodies and cells. Electronic-based molecule addressing and hybridization can then be carried out, where the electric field is now used to greatly accelerate the hybridization reactions that occur on the selected test sites. When reversed, the electric field can be used to provide an additional parameter for improved hybridization. Special low-conductance buffers have been developed that provide for the rapid transport of the DNA molecules and facilitate the electronic hybridization reactions under conditions that do not support hybridization. Important to the device function is the permeation layer that overcoats the underlying microelectrodes. Generally composed of a porous hydrogel material impregnated with attachment chemistry, this permeation layer prevents the destruction of analytes at the active microelectrode surface, ameliorates the adverse effects of electrolysis products on the sensitive hybridization and affinity reactions, and serves as a support structure for attaching DNA probes and other molecules to the array. The microelectronic chip or array device is incorporated into a cartridge package (NanoChip trade mark cartridge) that provides the electronic, optical, and fluidic interfacing. A complete instrument system (NanoChip trade mark Molecular Biology Workstation

  17. Local tetrahedron modeling of microelectronics using the finite-volume hybrid-grid technique

    Energy Technology Data Exchange (ETDEWEB)

    Riley, D.J.; Turner, C.D.

    1995-12-01

    The finite-volume hybrid-grid (FVHG) technique uses both structured and unstructured grid regions in obtaining a solution to the time-domain Maxwell`s equations. The method is based on explicit time differencing and utilizes rectilinear finite-difference time-domain (FDTD) and nonorthogonal finite-volume time-domain (FVTD). The technique directly couples structured FDTD grids with unstructured FVTD grids without the need for spatial interpolation across grid interfaces. In this paper, the FVHG method is applied to simple planar microelectronic devices. Local tetrahedron grids are used to model portions of the device under study, with the remainder of the problem space being modeled with cubical hexahedral cells. The accuracy of propagating microstrip-guided waves from a low-density hexahedron region through a high-density tetrahedron grid is investigated.

  18. Organic-inorganic Hybrids Towards the Preparation of Nanoporous Composite Thin Films for Microelectronic Application

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    Silicon containing materials have traditionally been used in microelectronic fabrication. Semiconductor devices often have one or more arrays of patterned interconnect levels that serve to electrically couple the individual circuit elements forming an integrated circuit. These interconnect levels are typically separated by an insulating or dielectric film. Previously, a silicon oxide film was the most commonly used material for such dielectric films having dielectric constants(k) near 4. 0. However, as the feature size is continuously scaling down, the relatively high k of such silicon oxide films became inadequate to provide efficient electrical insulation. As such, there has been an increasing market demand for materials with even lower dielectric constant for Interlayer Dielectric (ILD) applications, yet retaining thermal and mechanical integrity. We wish to report here our investigations on the preparation of ultra-low k ILD materials using a sacrificial approach whereby organic groups are burnt out to generate low k porous ORMOSIL films. We have been able to prepare a variety of organically modified silicone resins leading to highly microporous thin films, exhibiting ultra-low k from 1.80 to 2.87, and good to high modulus, 1.5 to 5.5 Gpa. Structure property influences on porosity, dielectric constant and modulus will be discussed.

  19. Circuit design of VLSI for microelectronic coordinate-sensitive detector for material element analysis

    Directory of Open Access Journals (Sweden)

    Sidorenko V. P.

    2012-08-01

    Full Text Available There has been designed, manufactured and tested a VLSI providing as a part of the microelectronic coordinate-sensitive detector the simultaneous elemental analysis of all the principles of the substance. VLSI ensures the amplifier-converter response on receiving of 1,6.10–13 С negative charge to its input. Response speed of the microcircuit is at least 3 MHz in the counting mode and more than 4 MHz in the counter information read-out mode. The power consumption of the microcircuit is no more than 7 mA.

  20. Application of non-cyanide gold for selective plating of microelectronic circuits

    Energy Technology Data Exchange (ETDEWEB)

    Worobey, W.; Rieger, D.

    1991-01-01

    With the current trends towards miniaturization, high performance, high quality and cost competiveness, the electrodeposition process has become an important manufacturing technology in many new microelectronic applications. Gold electrodeposition plays an increasing role in processes that require this noble metal. Added to these trends is the continuing and increasing emphasis on manufacturing processes which are less damaging to the environment and potentially less hazardous to the operator and personnel in the vicinity of the operation. The present standard gold plating solutions are based on cyanide salts and are considered acutely hazardous solutions. The trend away from their use is gaining momentum as new non-hazardous gold plating solutions and manufacturing processes making use of them are developed. 2 refs.

  1. Digital Operation of Microelectronic Circuits Analogous to Protein Hydrogen Bonding Networks

    Directory of Open Access Journals (Sweden)

    Elitsa Gieva

    2012-12-01

    Full Text Available Two hydrogen bonding networks with water molecules and branching residues extracted from β-lactamase protein are investigated and their proton transfer characteristics are studied by creating analogous electrical circuits consisting of block-elements. The block-elements and their proton transfer are described by polynomials that are coded in Matlab and in Verilog-A for use in the Spectre simulator of Cadence IC design system. DC and digital pulse analyses are performed to demonstrate that some circuit outputs behave as repeaters while other - behave as inverters. The results also showed that the HBN circuits might behave as a D-latch and a demultiplexer.

  2. Microelectronics and nanoelectronics trends, and applications to HEP instrumentation

    CERN Document Server

    CERN. Geneva

    2004-01-01

    Lecture 1 : Microelectronics and HEP instrumentation CMOS technology has been the leading technology in microelectronics for more that 30 years thanks to its outstanding capability to miniaturization and low power consumption. A brief history of the microelectronics semiconductor industry is presented with applications for LEP and LHC experiments. Lecture 2: Future trends in microelectronics and nanoelectronics Trends in miniaturization point to the fabrication of ULSI nanoscale CMOS circuits by the end of the decade. Device issues and quantum effects in nanoscale MOS transistor will be discussed. Beyond CMOS technology, several technology avenues based on nanotechnology are under investigation. We will present some promising nanoelectronic devices and circuits based on Single Electron Tunneling (SET) transistor, nanowire, quantum dot and carbon nanotubes. Lecture 3: Monolithic pixel detectors Microvertex detectors for particle physics experiments currently uses hybrid silicon pixel detector. Novel emerging m...

  3. Hybrid quantum circuit with implanted erbium ions

    Energy Technology Data Exchange (ETDEWEB)

    Probst, S.; Rotzinger, H.; Tkalčec, A. [Physikalisches Institut, Karlsruhe Institute of Technology, D-76128 Karlsruhe (Germany); Kukharchyk, N.; Wieck, A. D. [Angewandte Festkörperphysik, Ruhr-Universität Bochum, Universitätsstraße 150, D-44780 Bochum (Germany); Wünsch, S.; Siegel, M. [Institut für Mikro- und Nanoelektronische Systeme, Karlsruhe Institute of Technology, D-76189 Karlsruhe (Germany); Ustinov, A. V. [Physikalisches Institut, Karlsruhe Institute of Technology, D-76128 Karlsruhe (Germany); Laboratory of Superconducting Metamaterials, National University of Science and Technology “MISIS,” Moscow 119049 (Russian Federation); Bushev, P. A. [Experimentalphysik, Universität des Saarlandes, D-66123 Saarbrücken (Germany)

    2014-10-20

    We report on hybrid circuit quantum electrodynamics experiments with focused ion beam implanted Er{sup 3+} ions in Y{sub 2}SiO{sub 5} coupled to an array of superconducting lumped element microwave resonators. The Y{sub 2}SiO{sub 5} crystal is divided into several areas with distinct erbium doping concentrations, each coupled to a separate resonator. The coupling strength is varied from 5 MHz to 18.7 MHz, while the linewidth ranges between 50 MHz and 130 MHz. We confirm the paramagnetic properties of the implanted spin ensemble by evaluating the temperature dependence of the coupling. The efficiency of the implantation process is analyzed and the results are compared to a bulk doped Er:Y{sub 2}SiO{sub 5} sample. We demonstrate the integration of these engineered erbium spin ensembles with superconducting circuits.

  4. Circuit QED with hybrid metamaterial transmission lines

    Energy Technology Data Exchange (ETDEWEB)

    Ruloff, Stefan; Taketani, Bruno; Wilhelm, Frank [Theoretical Physics, Universitaet des Saarlandes, Saarbruecken (Germany)

    2016-07-01

    We're working on the theory of metamaterials providing some interesting results. The negative refraction index causes an opposite orientation of the wave vector k and the Poynting vector S of the travelling waves. Hence the metamaterial has a falling dispersion relation ∂ω(k)/∂k < 0 implying that low frequencies correspond to short wavelengths. Metamaterials are simulated by left-handed transmission lines consisting of discrete arrays of series capacitors and parallel inductors to ground. Unusual physics arises when right-and left-handed transmission lines are coupled forming a hybrid metamaterial transmission line. E.g. if a qubit is placed in front of a hybrid metamaterial transmission line terminated in an open circuit, the spontaneous emission rate is weakened or unaffected depending on the transition frequency of the qubit. Some other research interests are the general analysis of metamaterial cavities and the mode structure of hybrid metamaterial cavities for QND readout of multi-qubit operators. Especially the precise answer to the question about the definition of the mode volume of a metamaterial cavity is one of our primary goals.

  5. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  6. A hybrid magnetic/complementary metal oxide semiconductor process design kit for the design of low-power non-volatile logic circuits

    Science.gov (United States)

    Di Pendina, G.; Prenat, G.; Dieny, B.; Torki, K.

    2012-04-01

    Since the advent of the MOS transistor, the performance of microelectronic circuits has followed Moore's law, stating that their speed and density would double every 18 months. Today, this trend tends to get out of breath: the continuously decreasing size of devices and increasing operation frequency result in power consumption and heating issues. Among the solutions investigated to circumvent these limitations, the use of non-volatile devices appears particularly promising. It allows easing, for example, the power gating technique, which consists in cutting-off the power supply of inactive blocks without losing information, drastically reducing the standby power consumption. In this approach, the advantages of magnetic tunnel junctions (MTJs) compared with other non-volatile devices allow one to design hybrid CMOS/magnetic circuits with high performance and new functionalities. Designing such circuits requires integrating MTJs in standard microelectronics design suites. This is performed by means of a process design kit (PDK) for the hybrid CMOS/magnetic technology. We present here a full magnetic PDK, which contains a compact model of the MTJ for electrical simulation, technology files for layout and physical verifications, and standard cells for the design of complex logic circuits and which is compatible with standard design suites. This PDK allows designers to accurately and comfortably design high-performance hybrid CMOS/magnetic logic circuits in the same way as standard CMOS circuits.

  7. Nanoscale Microelectronic Circuit Development

    Science.gov (United States)

    2011-06-17

    26. Sensitivity of the transient collector and emitter currents of a npn bipolar transistor to the doping level in the n-type...collector and emitter currents of a npn bipolar transistor to the doping level in the n-type collector region. Also shown are the sensitivities computed...semiconductor transistor NPN Negative-positive-negative ns Nanosecond nsec Nanosecond (Millimicrosecond) nW Nanowatt Op amp Operational amplifier OTA

  8. Microelectronics-embedded channel bridging and signal regeneration of injured spinal cords

    Institute of Scientific and Technical Information of China (English)

    Zhigong Wang; Xiaosong Gu; Xiaoying Lü; Zhenglin Jiang; Wenyuan Li; Guangming Lü; Yufeng Wang; Xiaoyan Shen; Xintai Zhao; Huiling Wang; Zhenyu Zhang; Hongmei Shen; Yang Wu; Weixing Shen; Jingyang Zhang; Dong Chen; Xiaoyi Mao; Huaxiang Shen

    2009-01-01

    Due to the difficulty in spinal cord regeneration with biological methods, the microelectronic neural bridge, a new concept based on microelectronic technology, is presented. The microelectronic system has been realized in the forms of hybrid and integrated circuits. The integrated circuits for neural signal detection, stimulation, and regeneration are realized in a CMOS process. In animal experiments with 100 toads, 48 rats, and 3 rabbits, nerve signals have been successfully detected from spinal cords and sciatic nerves, and functional electrical stimulation has been carried out for spinal cords and sciatic nerves. When the microelectronic system is bridged between the controlling and stimulated nerve, the relevant motion of legs and nerve signal waveforms, which are stimulated by the evoked or spontaneous nerve signal through such a system, have been observed. Therefore, the feasibility of the presented method was demonstrated.

  9. Electronic and Microelectronic Capabilities.

    Science.gov (United States)

    1982-07-01

    22 3.9 Aztec Products Custom Wet-Chemistry Line ........................................... 22 3.10 KotIrnorgen...Cofight Vertical Rotary Etcher............*....................................................... 22 11. Aztec Products Custom Wet-Chemistry Line...state of the art in thick film hybrid fabrication methods, microelectronic fabrication and assembly, PC board fabrication, and electronic board assembly

  10. III-V microelectronics

    CERN Document Server

    Nougier, JP

    1991-01-01

    As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in particular is well suited for Ultra Large Scale Integration processes. However, a number of III-V compound semiconductor devices and circuits have recently been built, and the contributions in this volume are devoted to those types of materials, which offer a number of interesting properties. Taking into account the great variety of problems encountered and of their mutual correlations when fabricating a circuit or even a device, most of the aspects of III-V microelectronics, from fundamental p

  11. Hybrid Direct-Current Circuit Breaker

    Science.gov (United States)

    Wang, Ruxi (Inventor); Premerlani, William James (Inventor); Caiafa, Antonio (Inventor); Pan, Yan (Inventor)

    2017-01-01

    A circuit breaking system includes a first branch including at least one solid-state snubber; a second branch coupled in parallel to the first branch and including a superconductor and a cryogenic contactor coupled in series; and a controller operatively coupled to the at least one solid-state snubber and the cryogenic contactor and programmed to, when a fault occurs in the load circuit, activate the at least one solid-state snubber for migrating flow of the electrical current from the second branch to the first branch, and, when the fault is cleared in the load circuit, activate the cryogenic contactor for migrating the flow of the electrical current from the first branch to the second branch.

  12. Hybrid CMOS/Nanodevice Integrated Circuits Design and Fabrication

    Science.gov (United States)

    2008-08-25

    This approach combines a semiconductor transistor system with a nanowire crossbar, with simple two-terminal nanodevices self-assembled at each...hybrid CMOS/nanodevice integrated circuits [10-12]. Such circuit combines a semiconductor transistors system with a nanowire crossbar, with simple two...both with and without embedded metallic clusters), self-assembled molecular monolayers, and thin chalcogenide and crystalline perovskite layers [20

  13. Utilization of MATLAB in Simulation of Linear Hybrid Circuits

    OpenAIRE

    BRANCIK, L.

    2003-01-01

    In the paper a MATLAB-based method for simulating transient phenomena in linear hybrid circuits containing parts with both lumped and distributed parameters is presented. Distributed parts of the circuit are multiconductor transmission lines, which can generally be nonuniform, with frequency-dependent parameters, and under nonzero initial voltage and/or current distributions. In principle a solution is formulated using the modified nodal analysis method in the frequency domain. Subsequently a...

  14. Hybrid HVDC circuit breaker with self-powered gate drives

    OpenAIRE

    Effah, Francis Boafo; Watson, Alan James; Ji, Chao; Amankwah, Emmanuel K.; Johnson, Christopher Mark; Davidson, Colin; Clare, Jon C.

    2016-01-01

    The ever increasing electric power demand and the advent of renewable energy sources have revived the interest in high-voltage direct current (HVDC) multi-terminal networks. However, the absence of a suitable circuit breaker or fault tolerant VSC station topologies with the required characteristics (such as operating speed) have, until recently, been an obstacle in the development of large scale multi-terminal networks for HVDC. This paper presents a hybrid HVDC circuit breaker concept which...

  15. Hybrid HVDC circuit breaker with self-powered gate drives

    OpenAIRE

    Effah, Francis Boafo; Watson, Alan James; Ji, Chao; Amankwah, Emmanuel K.; Johnson, Christopher Mark; Davidson, Colin; Clare, Jon C.

    2016-01-01

    The ever increasing electric power demand and the advent of renewable energy sources have revived the interest in high-voltage direct current (HVDC) multi-terminal networks. However, the absence of a suitable circuit breaker or fault tolerant VSC station topologies with the required characteristics (such as operating speed) have, until recently, been an obstacle in the development of large scale multi-terminal networks for HVDC. This paper presents a hybrid HVDC circuit breaker concept which ...

  16. Hybrid high direct current circuit interrupter

    Science.gov (United States)

    Rockot, J.H.; Mikesell, H.E.; Jha, K.N.

    1998-08-11

    A device and a method are disclosed for interrupting very high direct currents (greater than 100,000 amperes) and simultaneously blocking high voltages (greater than 600 volts). The device utilizes a mechanical switch to carry very high currents continuously with low loss and a silicon controlled rectifier (SCR) to bypass the current around the mechanical switch while its contacts are separating. A commutation circuit, connected in parallel with the SCR, turns off the SCR by utilizing a resonant circuit to divert the SCR current after the switch opens. 7 figs.

  17. Hybrid and monolithic integration of planar lightwave circuits (PLCs)

    Science.gov (United States)

    Chen, Ray T.

    2008-02-01

    In this paper, we review the status of monolithic and hybrid integration of planar lightwave circuits (PLCs). Building blocks needed for system integration based on polymeric materials, III-V semiconductor materials, LiNbO 3 and SOI on Silicon are summarized with pros and cons. Due to the maturity of silicon CMOS technology, silicon becomes the platform of choice for optical application specific integrated circuits (OASICs). However, the indirect bandgap of silicon makes the formation of electrically pumped silicon laser a remote plausibility which requires hybrid integration of laser sources made out of III-V compound semicouductor.

  18. Graphene/Si CMOS Hybrid Hall Integrated Circuits

    OpenAIRE

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-01-01

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal a...

  19. Mechanism of hybrid-magnetic-circuit multi-couple motor

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    Discusses the interval between laminations in a permanent-magnet inductor motor which makes the air-gap magnetic field produced by the permanent magnet very uneven in the axial direction, and limits the performance of a motor. Proposes a hybrid-magnetic-circuit multi-couple motor to compensate for the uneven air-gap magnetic field, thereby improving the performance of a motor.

  20. Multimode circuit quantum electrodynamics with hybrid metamaterial transmission lines.

    Science.gov (United States)

    Egger, D J; Wilhelm, F K

    2013-10-18

    Quantum transmission lines are central to superconducting and hybrid quantum computing. In this work we show how coupling them to a left-handed transmission line allows circuit QED to reach a new regime: multimode ultrastrong coupling. Out of the many potential applications of this novel device, we discuss the preparation of multipartite entangled states and the simulation of the spin-boson model where a quantum phase transition is reached up to finite size effects.

  1. Physically based analysis of electrical frequency response of passive microelectronic circuits by heterodyne lock-in thermal means

    Science.gov (United States)

    León, J.; Perpiñà, X.; Altet, J.; Vellvehi, M.; Jordà, X.

    2013-11-01

    This paper combines the heterodyne modulation technique with lock-in detection approaches to characterize the electrical behaviour of electronic systems in the frequency domain by thermal means. A thermal test chip (TTC), featuring a heating resistor and an embedded thermal sensor, is used as a test vehicle to assess this approach. The frequency response of the heating resistor has been first characterized by electrical measurements, yielding to a suitable TTC equivalent circuit which qualitatively explains its behaviour. Then, in order to infer this behaviour by thermal means, the heating resistor temperature has been heterodynally detected by on-chip local sensing (embedded thermal sensor) and off-chip spatially resolved (infrared lock-in thermography) techniques. The results of this paper show that from low-frequency temperature measurements it is possible to obtain the electrical frequency response of the TTC and to detect and locate capacitive coupling that disturbs the high-frequency operation of the device.

  2. Performance evaluation of an optical hybrid switch with circuit queued reservations and circuit priority preemption

    Science.gov (United States)

    Wong, Eric W. M.; Zukerman, Moshe

    2006-11-01

    We provide here a new loss model for an optical hybrid switch that can function as an optical burst switch and/or optical circuit switch. Our model is general as it considers an implementation whereby some of the circuits have preemptive priority over bursts and others are allowed to queue their reservations. We first present an analysis based on a 3-dimension state-space Markov chain that provides exact results for the blocking probabilities of bursts and circuits, the proportion of circuits that are delayed and the mean delay of the circuits that are delayed. Because it is difficult to exactly compute the blocking probability in realistic scenarios with a large number of wavelengths, we derive computationally a scalable and accurate approximations based on reducing the 3-dimension state space into a single dimension. These scalable approximations that can produce performance results in a fraction of a second can readily enable switch dimensioning. Extensive numerical results are presented to demonstrate the accuracy and the use of the new approximations.

  3. Microelectronics, bioinformatics and neurocomputation for massive neuronal recordings in brain circuits with large scale multielectrode array probes.

    Science.gov (United States)

    Maccione, Alessandro; Gandolfo, Mauro; Zordan, Stefano; Amin, Hayder; Di Marco, Stefano; Nieus, Thierry; Angotzi, Gian Nicola; Berdondini, Luca

    2015-10-01

    Deciphering neural network function in health and disease requires recording from many active neurons simultaneously. Developing approaches to increase their numbers is a major neurotechnological challenge. Parallel to recent advances in optical Ca(2+) imaging, an emerging approach consists in adopting complementary-metal-oxide-semiconductor (CMOS) technology to realize MultiElectrode Array (MEA) devices. By implementing signal conditioning and multiplexing circuits, these devices allow nowadays to record from several thousands of single neurons at sub-millisecond temporal resolution. At the same time, these recordings generate very large data streams which become challenging to analyze. Here, at first we shortly review the major approaches developed for data management and analysis for conventional, low-resolution MEAs. We highlight how conventional computational tools cannot be easily up-scaled to very large electrode array recordings, and custom bioinformatics tools are an emerging need in this field. We then introduce a novel approach adapted for the acquisition, compression and analysis of extracellular signals acquired simultaneously from 4096 electrodes with CMOS MEAs. Finally, as a case study, we describe how this novel large scale recording platform was used to record and analyze extracellular spikes from the ganglion cell layer in the wholemount retina at pan-retinal scale following patterned light stimulation.

  4. Utilization of MATLAB in Simulation of Linear Hybrid Circuits

    Directory of Open Access Journals (Sweden)

    L. Brancik

    2003-12-01

    Full Text Available In the paper a MATLAB-based method for simulating transientphenomena in linear hybrid circuits containing parts with both lumpedand distributed parameters is presented. Distributed parts of thecircuit are multiconductor transmission lines, which can generally benonuniform, with frequency-dependent parameters, and under nonzeroinitial voltage and/or current distributions. In principle a solutionis formulated using the modified nodal analysis method in the frequencydomain. Subsequently an improved fast method of the numerical inversionof Laplace transforms in the vector or matrix form is applied to obtainsolution in the time domain.

  5. Hybrid planar lightwave circuits for defense and aerospace applications

    Science.gov (United States)

    Zhang, Hua; Bidnyk, Serge; Yang, Shiquan; Balakrishnan, Ashok; Pearson, Matt; O'Keefe, Sean

    2010-04-01

    We present innovations in Planar Lightwave Circuits (PLCs) that make them ideally suited for use in advanced defense and aerospace applications. We discuss PLCs that contain no micro-optic components, no moving parts, pose no spark or fire hazard, are extremely small and lightweight, and are capable of transporting and processing a range of optical signals with exceptionally high performance. This PLC platform is designed for on-chip integration of active components such as lasers and detectors, along with transimpedance amplifiers and other electronics. These active components are hybridly integrated with our silica-on-silicon PLCs using fully-automated robotics and image recognition technology. This PLC approach has been successfully applied to the design and fabrication of multi-channel transceivers for aerospace applications. The chips contain hybrid DFB lasers and high-efficiency detectors, each capable of running over 10 Gb/s, with mixed digital and analog traffic multiplexed to a single optical fiber. This highlyintegrated functionality is combined onto a silicon chip smaller than 4 x 10 mm, weighing 125 degC, and more than 2,000 hours operating at 95 degC ambient air temperature. We believe that these recent advancements in planar lightwave circuits are poised to revolutionize optical communications and interconnects in the aerospace and defense industries.

  6. Design and implementation of a hybrid circuit system for micro sensor signal processing

    Energy Technology Data Exchange (ETDEWEB)

    Wang Zhuping; Chen Jing; Liu Ruqing, E-mail: wangzhuping169@163.com [School of Information and Electronics, Beijing Institute of Technology, Beijing 100081 (China)

    2011-04-15

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design. Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system. (semiconductor integrated circuits)

  7. Magnetic equivalent circuit model for unipolar hybrid excitation synchronous machine

    Directory of Open Access Journals (Sweden)

    Kupiec Emil

    2015-03-01

    Full Text Available Lately, there has been increased interest in hybrid excitation electrical machines. Hybrid excitation is a construction that combines permanent magnet excitation with wound field excitation. Within the general classification, these machines can be classified as modified synchronous machines or inductor machines. These machines may be applied as motors and generators. The complexity of electromagnetic phenomena which occur as a result of coupling of magnetic fluxes of separate excitation systems with perpendicular magnetic axis is a motivation to formulate various mathematical models of these machines. The presented paper discusses the construction of a unipolar hybrid excitation synchronous machine. The magnetic equivalent circuit model including nonlinear magnetization curves is presented. Based on this model, it is possible to determine the multi-parameter relationships between the induced voltage and magnetomotive force in the excitation winding. Particular attention has been paid to the analysis of the impact of additional stator and rotor yokes on above relationship. Induced voltage determines the remaining operating parameters of the machine, both in the motor and generator mode of operation. The analysis of chosen correlations results in an identification of the effective control range of electromotive force of the machine.

  8. High Voltage Dielectrophoretic and Magnetophoretic Hybrid Integrated Circuit / Microfluidic Chip

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A.; Hunt, Thomas P.; Westervelt, Robert M.

    2010-01-01

    A hybrid integrated circuit (IC) / microfluidic chip is presented that independently and simultaneously traps and moves microscopic objects suspended in fluid using both electric and magnetic fields. This hybrid chip controls the location of dielectric objects, such as living cells and drops of fluid, on a 60 × 61 array of pixels that are 30 × 38 μm2 in size, each of which can be individually addressed with a 50 V peak-to-peak, DC to 10 MHz radio frequency voltage. These high voltage pixels produce electric fields above the chip’s surface with a magnitude , resulting in strong dielectrophoresis (DEP) forces . Underneath the array of DEP pixels there is a magnetic matrix that consists of two perpendicular sets of 60 metal wires running across the chip. Each wire can be sourced with 120 mA to trap and move magnetically susceptible objects using magnetophoresis (MP). The DEP pixel array and magnetic matrix can be used simultaneously to apply forces to microscopic objects, such as living cells or lipid vesicles, that are tagged with magnetic nanoparticles. The capabilities of the hybrid IC / microfluidic chip demonstrated in this paper provide important building blocks for a platform for biological and chemical applications. PMID:20625468

  9. New Polymer Materials for Microelectronics Packaging

    Institute of Scientific and Technical Information of China (English)

    2005-01-01

    @@ Researchers at the CAS Institute of Chemistry (ICCAS) have made breakthrough progress in developing the manufacturing technology of advanced polymer materials for microelectronics packaging applications. The advanced integrated circuit (IC) packaging polymer materials, including photoimageable polyimide resins and liquid epoxy underfills, are a key issue for FC-BGA/CSP(flip chip-ball grill array/chip scale packaging) which is the main stream for the next generation of microelectronics devices. With the down-sizing, thinning and high I/O (input/output) of IC chips, microelectronics packaging is now facing a big technology challenge.

  10. Problems in CEMA microelectronic cooperation noted

    Science.gov (United States)

    Grzybowski, J.; Kusinski, J.

    1983-10-01

    The development and market trends of products, which use large scale integrated circuits are discussed. Products such as pocket calculators, electronic wrist watches, telephones, and automobiles are used to illustrate the economic results of market saturation with specialized integrated circuits. The status of microelectronics in socialist countries in Europe is addressed.

  11. Graphene/Si CMOS hybrid hall integrated circuits.

    Science.gov (United States)

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-07-07

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal amplifying/process ICs are manufactured via commercial 0.18 um silicon CMOS technology, and graphene Hall elements (GHEs) are fabricated on top of the passivation layer of the CMOS chip via a low-temperature micro-fabrication process. The sensitivity of the GHE on CMOS chip is further improved by integrating the GHE with the CMOS amplifier on the Si chip. This work not only paves the way to fabricate graphene/Si CMOS Hall ICs with much higher performance than that of conventional Hall ICs, but also provides a general method for scalable integration of graphene devices with silicon CMOS ICs via a low-temperature process.

  12. Hybrid circuit cavity quantum electrodynamics with a micromechanical resonator.

    Science.gov (United States)

    Pirkkalainen, J-M; Cho, S U; Li, Jian; Paraoanu, G S; Hakonen, P J; Sillanpää, M A

    2013-02-14

    Hybrid quantum systems with inherently distinct degrees of freedom have a key role in many physical phenomena. Well-known examples include cavity quantum electrodynamics, trapped ions, and electrons and phonons in the solid state. In those systems, strong coupling makes the constituents lose their individual character and form dressed states, which represent a collective form of dynamics. As well as having fundamental importance, hybrid systems also have practical applications, notably in the emerging field of quantum information control. A promising approach is to combine long-lived atomic states with the accessible electrical degrees of freedom in superconducting cavities and quantum bits (qubits). Here we integrate circuit cavity quantum electrodynamics with phonons. Apart from coupling to a microwave cavity, our superconducting transmon qubit, consisting of tunnel junctions and a capacitor, interacts with a phonon mode in a micromechanical resonator, and thus acts like an atom coupled to two different cavities. We measure the phonon Stark shift, as well as the splitting of the qubit spectral line into motional sidebands, which feature transitions between the dressed electromechanical states. In the time domain, we observe coherent conversion of qubit excitation to phonons as sideband Rabi oscillations. This is a model system with potential for a quantum interface, which may allow for storage of quantum information in long-lived phonon states, coupling to optical photons or for investigations of strongly coupled quantum systems near the classical limit.

  13. Graphene/Si CMOS Hybrid Hall Integrated Circuits

    Science.gov (United States)

    Huang, Le; Xu, Huilong; Zhang, Zhiyong; Chen, Chengying; Jiang, Jianhua; Ma, Xiaomeng; Chen, Bingyan; Li, Zishen; Zhong, Hua; Peng, Lian-Mao

    2014-07-01

    Graphene/silicon CMOS hybrid integrated circuits (ICs) should provide powerful functions which combines the ultra-high carrier mobility of graphene and the sophisticated functions of silicon CMOS ICs. But it is difficult to integrate these two kinds of heterogeneous devices on a single chip. In this work a low temperature process is developed for integrating graphene devices onto silicon CMOS ICs for the first time, and a high performance graphene/CMOS hybrid Hall IC is demonstrated. Signal amplifying/process ICs are manufactured via commercial 0.18 um silicon CMOS technology, and graphene Hall elements (GHEs) are fabricated on top of the passivation layer of the CMOS chip via a low-temperature micro-fabrication process. The sensitivity of the GHE on CMOS chip is further improved by integrating the GHE with the CMOS amplifier on the Si chip. This work not only paves the way to fabricate graphene/Si CMOS Hall ICs with much higher performance than that of conventional Hall ICs, but also provides a general method for scalable integration of graphene devices with silicon CMOS ICs via a low-temperature process.

  14. Microelectronics improves power electronics

    Energy Technology Data Exchange (ETDEWEB)

    Diehl, R.

    1982-07-01

    The share of electric energy consumed by electric drives - called power current - can be used more efficiently by using power electronic regulating processes. Lower cost for power electronic components and progress in circuit technology are the decisive factors for the widespread use of regulating units. Microelectronics permit a cost-beneficial control of power regulating units, are made them more attractive for the user. Technical and economic attractivity of power electronic regulating processes have increased. These processes are mainly used for adjusting engine speed to the other process engineering parameters like pressure, output or speed. Optimization of power-current consuming processes are expected to achieve an energy saving potential of 15 TWh by the year 1995.

  15. Design and implementation of a hybrid circuit system for micro sensor signal processing*

    Institute of Scientific and Technical Information of China (English)

    Wang Zhuping; Chen Jing; Liu Ruqing

    2011-01-01

    This paper covers a micro sensor analog signal processing circuit system (MASPS) chip with low power and a digital signal processing circuit board implementation including hardware connection and software design.Attention has been paid to incorporate the MASPS chip into the digital circuit board. The ultimate aim is to form a hybrid circuit used for mixed-signal processing, which can be applied to a micro sensor flow monitoring system.

  16. Microelectronic systems

    CERN Document Server

    Heuberger, Albert; Hanke, Randolf

    2011-01-01

    This book is dedicated to Prof. Dr. Heinz Gerhauser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universitat Erlangen-Nurnberg. Heinz Gerhauser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to beco

  17. Performance of a Y-Ba-Cu-O superconducting filter/GaAs low noise amplifier hybrid circuit

    Science.gov (United States)

    Bhasin, Kul B.; Toncich, S. S.; Chorey, C. M.; Bonetti, R. R.; Williams, A. E.

    1992-01-01

    A superconducting 7.3 GHz two-pole microstrip bandpass filter and a GaAs low noise amplifier (LNA) were combined into a hybrid circuit and characterized at liquid nitrogen temperatures. This superconducting/seismology circuit's performance was compared to a gold filter/GaAs LNA hybrid circuit. The superconducting filter/GaAs LNA hybrid circuit showed higher gain and lower noise figure than its gold counterpart.

  18. First order devices, hybrid memristors, and the frontiers of nonlinear circuit theory

    CERN Document Server

    Riaza, Ricardo

    2010-01-01

    Several devices exhibiting memory effects have shown up in nonlinear circuit theory in recent years. Among others, these circuit elements include Chua's memristors, as well as memcapacitors and meminductors. These and other related devices seem to be beyond the, say, classical scope of circuit theory, which is formulated in terms of resistors, capacitors, inductors, and voltage and current sources. We explore in this paper the potential extent of nonlinear circuit theory by classifying such mem-devices in terms of the variables involved in their constitutive relations and the notions of the differential- and the state-order of a device. Within this framework, the frontier of first order circuit theory is defined by so-called hybrid memristors, which are proposed here to accommodate a characteristic relating all four fundamental circuit variables. Devices with differential order two and mem-systems are discussed in less detail. We allow for fully nonlinear characteristics in all circuit elements, arriving at a...

  19. Microelectronics in Education

    Science.gov (United States)

    Orton, Richard J. J.

    2011-01-01

    The history and meaning of the term "microelectronics" is reviewed, followed by a discussion of the key inventions of the Intel microprocessor in 1971 and the Texas Instruments electronic pocket calculator in 1975. The six characteristic features of microelectronic components are then defined. The UK prime minister Jim Callaghan's…

  20. Microelectronics and Music Education.

    Science.gov (United States)

    Hofstetter, Fred T.

    1979-01-01

    This look at the impact of microelectronics on computer-assisted instruction (CAI) in music notes trends toward new applications and lower costs. Included are: a rationale for CAI in music, a list of sample programs, comparison of five microelectronic music systems, PLATO cost projections, and sources of further information. (SJL)

  1. Microelectronics in Education

    Science.gov (United States)

    Orton, Richard J. J.

    2011-01-01

    The history and meaning of the term "microelectronics" is reviewed, followed by a discussion of the key inventions of the Intel microprocessor in 1971 and the Texas Instruments electronic pocket calculator in 1975. The six characteristic features of microelectronic components are then defined. The UK prime minister Jim Callaghan's address to the…

  2. Hybridization of detector array and integrated circuit for readout

    Science.gov (United States)

    Fossum, Eric R.; Grunthaner, Frank J.

    1992-04-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  3. Analogy among microfluidics, micromechanics, and microelectronics.

    Science.gov (United States)

    Li, Sheng-Shian; Cheng, Chao-Min

    2013-10-07

    We wish to illuminate the analogous link between microfluidic-based devices, and the already established pairing of micromechanics and microelectronics to create a triangular/three-way scientific relationship as a means of interlinking familial disciplines and accomplishing two primary goals: (1) to facilitate the modeling of multidisciplinary domains; and, (2) to enable us to co-simulate the entire system within a compact circuit simulator (e.g., Cadence or SPICE). A microfluidic channel-like structure embedded in a micro-electro-mechanical resonator via our proposed CMOS-MEMS technology is used to illustrate the connections among microfluidics, micromechanics, and microelectronics.

  4. Design of Passive Analog Electronic Circuits Using Hybrid Modified UMDA algorithm

    Directory of Open Access Journals (Sweden)

    J. Slezak

    2015-04-01

    Full Text Available Hybrid evolutionary passive analog circuits synthesis method based on modified Univariate Marginal Distribution Algorithm (UMDA and a local search algorithm is proposed in the paper. The modification of the UMDA algorithm which allows to specify the maximum number of the nodes and the maximum number of the components of the synthesized circuit is proposed. The proposed hybrid approach efficiently reduces the number of the objective function evaluations. The modified UMDA algorithm is used for synthesis of the topology and the local search algorithm is used for determination of the parameters of the components of the designed circuit. As an example the proposed method is applied to a problem of synthesis of the fractional capacitor circuit.

  5. Design of a microelectronic circuit to amplify and modulate the signal of a micro-electro-mechanical systems arterial pressure sensor

    Science.gov (United States)

    Vela-Peóa, E.; Quiñones-Urióstegui, I.; Martínez-Piñon, F.; Álvarez-Chávez, J. A.

    2010-04-01

    In the article, the design and stimulation is presented of an integrated circuit for the amplification and modulation of an electrical signal proceeding from a Micro-Electro-Mechanical Systems (MEMS) arterial pressure sensor. The signal consists of voltage ranking from 0-10 mV, 1 mA and frequency of 50- 500 Hz. This simple but effective design consists of an operational amplifier (op-amp) configured as a differential amplifier, which amplifies the signal (up to 1V and 10 mA), originating from a Wheatstone bridge in the MEMS sensor, and then this signal is modulated by Pulse width modulation (PWM). The technology employed in this circuit is MOSIS AMIS 1.5 um. The circuit was designed with a two-state op-amp, which is utilized in diverse stages of the system. The use of a differential amplifier, the op-amp, and PWM simplifies the design and renders this compact due to the employment of few components (40 transistors). The use of the PWM facilitates the signaling process at later stages. Results comprise the design of the circuit and the simulation. This consists of a schematic diagram of the layers of all the rules specified in the MOSIS AMIS 1.5 um. Electric and LTSpice software was employed for the design and simulation of the circuit. We present a complete description of the design philosophy, design criteria, figures, and final results.

  6. Microelectronic systems 1 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems 1 Checkbook provides coverage of the Business and Technician Education Council level 1 unit in Microelectronic Systems. However, it can be regarded as a basic textbook in microelectronic systems for a much wider range of studies. Each topic considered in the text is presented in a way that assumes the reader has little prior knowledge of electronics. The aim of the book is to provide an introduction to the concept of systems, to differentiate analogue and digital systems, and to describe the nature of microprocessor-controlled systems. An introduction to programming is

  7. Biomedical implantable microelectronics.

    Science.gov (United States)

    Meindl, J D

    1980-10-17

    Innovative applications of microelectronics in new biomedical implantable instruments offer a singular opportunity for advances in medical research and practice because of two salient factors: (i) beyond all other types of biomedical instruments, implants exploit fully the inherent technical advantages--complex functional capability, high reliability, lower power drain, small size and weight-of microelectronics, and (ii) implants bring microelectronics into intimate association with biological systems. The combination of these two factors enables otherwise impossible new experiments to be conducted and new paostheses developed that will improve the quality of human life.

  8. Cascaded all-optical operations in a hybrid integrated 80-Gb/s logic circuit.

    Science.gov (United States)

    LeGrange, J D; Dinu, M; Sochor, T; Bollond, P; Kasper, A; Cabot, S; Johnson, G S; Kang, I; Grant, A; Kay, J; Jaques, J

    2014-06-01

    We demonstrate logic functionalities in a high-speed all-optical logic circuit based on differential Mach-Zehnder interferometers with semiconductor optical amplifiers as the nonlinear optical elements. The circuit, implemented by hybrid integration of the semiconductor optical amplifiers on a planar lightwave circuit platform fabricated in silica glass, can be flexibly configured to realize a variety of Boolean logic gates. We present both simulations and experimental demonstrations of cascaded all-optical operations for 80-Gb/s on-off keyed data.

  9. Testing microelectronic biofluidic systems

    NARCIS (Netherlands)

    Kerkhoff, Hans G.

    2007-01-01

    According to the 2005 International Technology Roadmap for Semiconductors, the integration of emerging nondigital CMOS technologies will require radically different test methods, posing a major challenge for designers and test engineers. One such technology is microelectronic fluidic (MEF) arrays,

  10. Testing microelectronic biofluidic systems

    NARCIS (Netherlands)

    Kerkhoff, Hans G.

    2007-01-01

    According to the 2005 International Technology Roadmap for Semiconductors, the integration of emerging nondigital CMOS technologies will require radically different test methods, posing a major challenge for designers and test engineers. One such technology is microelectronic fluidic (MEF) arrays, w

  11. Robust Hybrid Finite Element Methods for Antennas and Microwave Circuits

    Science.gov (United States)

    Gong, J.; Volakis, John L.

    1996-01-01

    One of the primary goals in this dissertation is concerned with the development of robust hybrid finite element-boundary integral (FE-BI) techniques for modeling and design of conformal antennas of arbitrary shape. Both the finite element and integral equation methods will be first overviewed in this chapter with an emphasis on recently developed hybrid FE-BI methodologies for antennas, microwave and millimeter wave applications. The structure of the dissertation is then outlined. We conclude the chapter with discussions of certain fundamental concepts and methods in electromagnetics, which are important to this study.

  12. Testing of the front-end hybrid circuits for the CMS Tracker upgrade

    Science.gov (United States)

    Gadek, T.; Blanchot, G.; Honma, A.; Kovacs, M.; Raymond, M.; Rose, P.

    2017-01-01

    The upgrade of the CMS Tracker for the HL-LHC requires the design of new double-sensor, silicon detector modules, which implement Level 1 trigger functionality in the increased luminosity environment. These new modules will contain two different, high-density front-end hybrid circuits, equipped with flip-chip ASICs, auxiliary electronic components and mechanical structures. The hybrids require qualification tests before they are assembled into modules. Test methods are proposed together with the corresponding test hardware and software. They include functional tests and signal injection in a cold environment to find possible failure modes of the hybrids under real operating conditions.

  13. Testing of the Front-End Hybrid Circuits for the CMS Tracker Upgrade

    CERN Document Server

    Gadek, Tomasz; Honma, Alan; Kovacs, Mark Istvan; Raymond, David Mark; Rose, Pierre

    2016-01-01

    The upgrade of the CMS tracker for the HL-LHC requires the design of new double-sensor, silicon detector modules, which implement Level 1 trigger functionality in the increased luminosity environment. These new modules will contain two different, high density front-end hybrid circuits, equipped with flip-chip ASICs, auxiliary electronic components and mechanical structures. The hybrids require qualification tests before they are assembled into modules. Test methods are proposed together with the corresponding test hardware and software. They include functional tests and signal injection in a cold environment to find possible failure modes of the hybrids under real operating conditions.

  14. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

    Science.gov (United States)

    Chakrabarti, B.; Lastras-Montaño, M. A.; Adam, G.; Prezioso, M.; Hoskins, B.; Cheng, K.-T.; Strukov, D. B.

    2017-02-01

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

  15. The Hybrid Integrated Circuit of the ALICE Inner Tracking System upgrade

    CERN Document Server

    Fiorenza, G; Pastore, C; Valentino, V

    2016-01-01

    The upgrade of the Inner Tracking System scheduled during the second long shutdown is an important milestone of the ALICE upgrade and it will provide a high improvement of its performances. In this contribution the smallest operator unit of the detector, the Hybrid Integrated Circuits, is presented.

  16. A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

    Science.gov (United States)

    Chakrabarti, B.; Lastras-Montaño, M. A.; Adam, G.; Prezioso, M.; Hoskins, B.; Cheng, K.-T.; Strukov, D. B.

    2017-01-01

    Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit. PMID:28195239

  17. Hybrid quantum circuit with a superconducting qubit coupled to an electron spin ensemble

    Energy Technology Data Exchange (ETDEWEB)

    Kubo, Yuimaru; Grezes, Cecile; Vion, Denis; Esteve, Daniel; Bertet, Patrice [Quantronics Group, SPEC (CNRS URA 2464), CEA-Saclay, 91191 Gif-sur-Yvette (France); Diniz, Igor; Auffeves, Alexia [Institut Neel, CNRS, BP 166, 38042 Grenoble (France); Isoya, Jun-ichi [Research Center for Knowledge Communities, University of Tsukuba, 305-8550 Tsukuba (Japan); Jacques, Vincent; Dreau, Anais; Roch, Jean-Francois [LPQM (CNRS, UMR 8537), Ecole Normale Superieure de Cachan, 94235 Cachan (France)

    2013-07-01

    We report the experimental realization of a hybrid quantum circuit combining a superconducting qubit and an ensemble of electronic spins. The qubit, of the transmon type, is coherently coupled to the spin ensemble consisting of nitrogen-vacancy (NV) centers in a diamond crystal via a frequency-tunable superconducting resonator acting as a quantum bus. Using this circuit, we prepare arbitrary superpositions of the qubit states that we store into collective excitations of the spin ensemble and retrieve back into the qubit. We also report a new method for detecting the magnetic resonance of electronic spins at low temperature with a qubit using the hybrid quantum circuit, as well as our recent progress on spin echo experiments.

  18. Organic transistors in optical displays and microelectronic applications.

    Science.gov (United States)

    Gelinck, Gerwin; Heremans, Paul; Nomoto, Kazumasa; Anthopoulos, Thomas D

    2010-09-08

    Organic thin-film transistors (OTFTs) offer unprecedented opportunities for implementation in a broad range of technological applications spanning from large-volume microelectronics and optical displays to chemical and biological sensors. In this Progress Report, we review the application of organic transistors in the fields of flexible optical displays and microelectronics. The advantages associated with the use of OTFT technology are discussed with primary emphasis on the latest developments in the area of active-matrix electrophoretic and organic light-emitting diode displays based on OTFT backplanes and on the application of organic transistors in microelectronics including digital and analog circuits.

  19. Microelectronics from fundamentals to applied design

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2016-01-01

    This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics.  Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design.  ·         Describes fundamentals of microelectronics design in an accessible manner; ·         Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; ·         Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; ·         Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.

  20. Delay-area trade-off for MPRM circuits based on hybrid discrete particle swarm optimization

    Institute of Scientific and Technical Information of China (English)

    Jiang Zhidi; Wang Zhenhai; Wang Pengjun

    2013-01-01

    Polarity optimization for mixed polarity Reed-Muller (MPRM) circuits is a combinatorial issue.Based on the study on discrete particle swarm optimization (DPSO) and mixed polarity,the corresponding relation between particle and mixed polarity is established,and the delay-area trade-off of large-scale MPRM circuits is proposed.Firstly,mutation operation and elitist strategy in genetic algorithm are incorporated into DPSO to further develop a hybrid DPSO (HDPSO).Then the best polarity for delay and area trade-off is searched for large-scale MPRM circuits by combining the HDPSO and a delay estimation model.Finally,the proposed algorithm is testified by MCNC Benchmarks.Experimental results show that HDPSO achieves a better convergence than DPSO in terms of search capability for large-scale MPRM circuits.

  1. Moore's law: the future of Si microelectronics

    Directory of Open Access Journals (Sweden)

    Scott E. Thompson

    2006-06-01

    Full Text Available Soon after Bardeen, Brattain, and Shockley invented a solid-state device in 19471 to replace electron vacuum tubes, the microelectronics industry and a revolution started. Since its birth, the industry has experienced four decades of unprecedented explosive growth driven by two factors: Noyce and Kilby inventing the planar integrated circuit2,3 and the advantageous characteristics that result from scaling (shrinking solid-state devices.

  2. Remote Microelectronics Fabrication Laboratory MEFLab

    Directory of Open Access Journals (Sweden)

    Jan Machotka

    2008-07-01

    Full Text Available Over the last decade, there has been a move towards using remote laboratories in engineering education. The majority of these laboratories are static, involving limited user-controlled mechanical movements. The University of South Australia has developed such a laboratory, called NetLab that has been successfully utilized for teaching both on-campus and transnational programs in electrical and electronics engineering. Following this success, we are now developing a remote laboratory for microelectronic fabrication, MEFLab. The first stage of the development is a remote laboratory for visual inspection and testing of electronic circuits directly on the silicon wafer under a microscope which is normally conducted in a cleanroom. The major challenge of this project is the accurate positioning of micro-probes remotely over the internet. This paper presents the details of the setup of this new remote laboratory, with a particular emphasis on the development of the hardware, software and graphical user interface.

  3. Advances in Microelectronics for Implantable Medical Devices

    Directory of Open Access Journals (Sweden)

    Andreas Demosthenous

    2014-01-01

    Full Text Available Implantable medical devices provide therapy to treat numerous health conditions as well as monitoring and diagnosis. Over the years, the development of these devices has seen remarkable progress thanks to tremendous advances in microelectronics, electrode technology, packaging and signal processing techniques. Many of today’s implantable devices use wireless technology to supply power and provide communication. There are many challenges when creating an implantable device. Issues such as reliable and fast bidirectional data communication, efficient power delivery to the implantable circuits, low noise and low power for the recording part of the system, and delivery of safe stimulation to avoid tissue and electrode damage are some of the challenges faced by the microelectronics circuit designer. This paper provides a review of advances in microelectronics over the last decade or so for implantable medical devices and systems. The focus is on neural recording and stimulation circuits suitable for fabrication in modern silicon process technologies and biotelemetry methods for power and data transfer, with particular emphasis on methods employing radio frequency inductive coupling. The paper concludes by highlighting some of the issues that will drive future research in the field.

  4. An adaptive metamaterial beam with hybrid shunting circuits for extremely broadband control of flexural waves

    Science.gov (United States)

    Chen, Y. Y.; Hu, G. K.; Huang, G. L.

    2016-10-01

    A great deal of research has been devoted to controlling the dynamic behaviors of phononic crystals and metamaterials by directly tuning the frequency regions and/or widths of their inherent band gaps. Here, we report a new class of adaptive metamaterial beams with hybrid shunting circuits to realize super broadband Lamb-wave band gaps at an extreme subwavelength scale. The proposed metamaterial is made of a homogeneous host beam on which tunable local resonators consisting of hybrid shunted piezoelectric stacks with proof masses are attached. The hybrid shunting circuits are composed of negative-capacitance and negative-inductance elements connected in series or in parallel in order to tune the desired frequency-dependent stiffness. It is shown theoretically and numerically that by properly modifying the shunting impedance, the adaptive mechanical mechanism within the tunable resonator can produce high-pass and low-pass wave filtering capabilities for the zeroth-order anti-symmetric Lamb-wave modes. These unique behaviors are due to the hybrid effects from the negative-capacitance and negative-inductance circuit elements. Such a system opens up important perspectives for the development of adaptive vibration or wave-attenuation devices for broadband frequency applications.

  5. Full Wave Simulation of Integrated Circuits Using Hybrid Numerical Methods

    Science.gov (United States)

    Tan, Jilin

    Transmission lines play an important role in digital electronics, and in microwave and millimeter-wave circuits. Analysis, modeling, and design of transmission lines are critical to the development of the circuitry in the chip, subsystem, and system levels. In the past several decays, at the EM modeling level, the quasi-static approximation has been widely used due to its great simplicity. As the clock rates increase, the inter-connect effects such as signal delay, distortion, dispersion, reflection, and crosstalk, limit the performance of microwave systems. Meanwhile, the quasi-static approach loses its validity for some complex system structures. Since the successful system design of the PCB, MCM, and the chip packaging, rely very much on the computer aided EM level modeling and simulation, many new methods have been developed, such as the full wave approach, to guarantee the successful design. Many difficulties exist in the rigorous EM level analysis. Some of these include the difficulties in describing the behavior of the conductors with finite thickness and finite conductivity, the field singularity, and the arbitrary multilayered multi-transmission lines structures. This dissertation concentrates on the full wave study of the multi-conductor transmission lines with finite conductivity and finite thickness buried in an arbitrary lossy multilayered environment. Two general approaches have been developed. The first one is the integral equation method in which the dyadic Green's function for arbitrary layered media has been correctly formulated and has been tested both analytically and numerically. By applying this method, the double layered high dielectric permitivitty problem and the heavy dielectrical lossy problem in multilayered media in the CMOS circuit design have been solved. The second approach is the edge element method. In this study, the correct functional for the two dimensional propagation problem has been successfully constructed in a rigorous way

  6. Chemistry in microelectronics

    CERN Document Server

    Le Tiec, Yannick

    2013-01-01

    Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionalit

  7. Microelectronic systems 3 checkbook

    CERN Document Server

    Vears, R E

    1985-01-01

    Microelectronic Systems 3: Checkbook aims to extend the range of hardware, software, and interfacing techniques developed at level 2. This book concentrates on the highly popular 6502, Z80, and 6800 microprocessors and contains approximately 70 tested programs that may be used with little or no modification on most systems based on these microprocessors. This text also covers the main points concerned with computer hardware configuration, interfacing devices, subroutines and the stack, polling and interrupts, microelectronic stores, and address decoding and organization. Each chapter of the b

  8. Microelectronic test structures for CMOS technology

    CERN Document Server

    Ketchen, Mark B

    2011-01-01

    Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance an

  9. Moore's law and the impact on trusted and radiation-hardened microelectronics.

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Kwok Kee

    2011-12-01

    In 1965 Gordon Moore wrote an article claiming that integrated circuit density would scale exponentially. His prediction has remained valid for more than four decades. Integrated circuits have changed all aspects of everyday life. They are also the 'heart and soul' of modern systems for defense, national infrastructure, and intelligence applications. The United States government needs an assured and trusted microelectronics supply for military systems. However, migration of microelectronics design and manufacturing from the United States to other countries in recent years has placed the supply of trusted microelectronics in jeopardy. Prevailing wisdom dictates that it is necessary to use microelectronics fabricated in a state-of-the-art technology for highest performance and military system superiority. Close examination of silicon microelectronics technology evolution and Moore's Law reveals that this prevailing wisdom is not necessarily true. This presents the US government the possibility of a totally new approach to acquire trusted microelectronics.

  10. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect.

    Science.gov (United States)

    Li, Shu; Zhang, Tong

    2008-05-07

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

  11. Architecture design of resistor/FET-logic demultiplexer for hybrid CMOS/nanodevice circuit interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Li Shu; Zhang Tong [Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180 (United States)], E-mail: lis4@rpi.edu, E-mail: tzhang@ecse.rpi.edu

    2008-05-07

    Hybrid nanoelectronics consisting of nanodevice crossbars on top of CMOS backplane circuits is emerging as one viable option to sustain Moore's law after the CMOS scaling limit is reached. One main design challenge in such hybrid nanoelectronics is the interface between the highly dense nanowires in nanodevice crossbars and relatively coarse microwires in the CMOS domain. Such an interface can be realized through a logic circuit called a demultiplexer (demux). In this context, all the prior work on demux design uses a single type of device, such as resistor, diode or field effect transistor (FET), to realize the demultiplexing function. However, different types of devices have their own advantages and disadvantages in terms of functionality, manufacturability, speed and power consumption. This makes none of them provide a satisfactory solution. To tackle this challenge, this work proposes to combine resistor with FET to implement the demux, leading to the hybrid resistor/FET-logic demux. Such hybrid demux architecture can make these two types of devices complement each other well to improve the overall demux design effectiveness. Furthermore, due to the inevitable fabrication process variations at the nanoscale, the effects of resistor conductance and FET threshold voltage variability are analyzed and evaluated based on computer simulations. The simulation results provide the requirement on the fabrication process to ensure a high demux reliability, and promise the hybrid resistor/FET-logic demux an improved addressability and process variance tolerance.

  12. Performance evaluation for an optical hybrid switch with circuit queued reservations

    Science.gov (United States)

    Wong, Eric W. M.; Zukerman, Moshe

    2005-11-01

    We provide here a new loss model for an optical hybrid switch that can function as an optical burst switch or optical circuit switch or both simultaneously. We introduce the feature of circuit queued reservation. That is, if a circuit request arrives and cannot find a free wavelength, and if there are not too many requests queued for reservations, it may join a queue and wait until such wavelength becomes available. We first present an analysis based on a 3-dimension state-space Markov chain that provides exact results for the blocking probabilities of bursts and circuits. We also provide results for the proportion of circuits that are delayed and the mean delay of the circuits that are delay. Because it is difficult to exactly compute the blocking probability in realistic scenarios with a large number of wavelengths, we derive computationally scalable and accurate approximations which are based on reducing the 3-dimension state space into a single dimension. These scalable approximations that can produce performance results in a fraction of a second can readily enable switch dimensioning.

  13. Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology

    Science.gov (United States)

    Kim, Jong-Hoi; Choe, Joong-Seon; Choi, Kwang-Seong; Youn, Chun-Ju; Kim, Duk-Jun; Jang, Sun-Hyok; Kwon, Yong-Hwan; Nam, Eun-Soo

    2011-12-01

    A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90°-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s.

  14. Series-connected substrate-integrated lead-carbon hybrid ultracapacitors with voltage-management circuit

    Indian Academy of Sciences (India)

    A Banerjee; R Srinivasan; A K Shukla

    2015-02-01

    Cell voltage for a fully charged-substrate-integrated lead-carbon hybrid ultracapacitor is about 2.3 V. Therefore, for applications requiring higher DC voltage, several of these ultracapacitors need to be connected in series. However, voltage distribution across each series-connected ultracapacitor tends to be uneven due to tolerance in capacitance and parasitic parallel-resistance values. Accordingly, voltage-management circuit is required to protect constituent ultracapacitors from exceeding their rated voltage. In this study, the design and characterization of the substrate-integrated lead-carbon hybrid ultracapacitor with co-located terminals is discussed. Voltage-management circuit for the ultracapacitor is presented, and its effectiveness is validated experimentally.

  15. Microelectronics in Scottish Education.

    Science.gov (United States)

    Morris, Ian

    1982-01-01

    Describes the Scottish Microelectronics Development Programme (SMDP), which was undertaken to advance the use of microcomputers in instruction at all educational levels in Scotland. The development of the microprocessor and its effect on educational technology are briefly considered, as well as initial problems and prospects for the future of…

  16. Carbon nanotubes for microelectronics?

    Science.gov (United States)

    Graham, Andrew P; Duesberg, Georg S; Seidel, Robert V; Liebau, Maik; Unger, Eugen; Pamler, Werner; Kreupl, Franz; Hoenlein, Wolfgang

    2005-04-01

    Despite all prophecies of its end, silicon-based microelectronics still follows Moore's Law and continues to develop rapidly. However, the inherent physical limits will eventually be reached. Carbon nanotubes offer the potential for further miniaturization as long as it is possible to selectively deposit them with defined properties.

  17. A novel protection layer of superconducting microwave circuits toward a hybrid quantum system

    CERN Document Server

    Lee, Jongmin

    2014-01-01

    We propose a novel multilayer structure based on Bragg layers that can protect a superconducting microwave resonator from photons and blackbody radiation and have little effect on its quality factor. We also discuss a hybrid quantum system exploiting a superconducting microwave circuit and a two-color evanescent field atom trap, where surface-scattered photons and absorption-induced broadband blackbody radiation might deteriorate the system.

  18. Efficient scheme for hybrid teleportation via entangled coherent states in circuit quantum electrodynamics.

    Science.gov (United States)

    Joo, Jaewoo; Ginossar, Eran

    2016-06-01

    We propose a deterministic scheme for teleporting an unknown qubit state through continuous-variable entangled states in superconducting circuits. The qubit is a superconducting two-level system and the bipartite quantum channel is a microwave photonic entangled coherent state between two cavities. A Bell-type measurement performed on the hybrid state of solid and photonic states transfers a discrete-variable unknown electronic state to a continuous-variable photonic cat state in a cavity mode. In order to facilitate the implementation of such complex protocols we propose a design for reducing the self-Kerr nonlinearity in the cavity. The teleporation scheme enables quantum information processing operations with circuit-QED based on entangled coherent states. These include state verification and single-qubit operations with entangled coherent states. These are shown to be experimentally feasible with the state of the art superconducting circuits.

  19. Efficient scheme for hybrid teleportation via entangled coherent states in circuit quantum electrodynamics

    Science.gov (United States)

    Joo, Jaewoo; Ginossar, Eran

    2016-06-01

    We propose a deterministic scheme for teleporting an unknown qubit state through continuous-variable entangled states in superconducting circuits. The qubit is a superconducting two-level system and the bipartite quantum channel is a microwave photonic entangled coherent state between two cavities. A Bell-type measurement performed on the hybrid state of solid and photonic states transfers a discrete-variable unknown electronic state to a continuous-variable photonic cat state in a cavity mode. In order to facilitate the implementation of such complex protocols we propose a design for reducing the self-Kerr nonlinearity in the cavity. The teleporation scheme enables quantum information processing operations with circuit-QED based on entangled coherent states. These include state verification and single-qubit operations with entangled coherent states. These are shown to be experimentally feasible with the state of the art superconducting circuits.

  20. A hybrid analytical model for open-circuit field calculation of multilayer interior permanent magnet machines

    Science.gov (United States)

    Zhang, Zhen; Xia, Changliang; Yan, Yan; Geng, Qiang; Shi, Tingna

    2017-08-01

    Due to the complicated rotor structure and nonlinear saturation of rotor bridges, it is difficult to build a fast and accurate analytical field calculation model for multilayer interior permanent magnet (IPM) machines. In this paper, a hybrid analytical model suitable for the open-circuit field calculation of multilayer IPM machines is proposed by coupling the magnetic equivalent circuit (MEC) method and the subdomain technique. In the proposed analytical model, the rotor magnetic field is calculated by the MEC method based on the Kirchhoff's law, while the field in the stator slot, slot opening and air-gap is calculated by subdomain technique based on the Maxwell's equation. To solve the whole field distribution of the multilayer IPM machines, the coupled boundary conditions on the rotor surface are deduced for the coupling of the rotor MEC and the analytical field distribution of the stator slot, slot opening and air-gap. The hybrid analytical model can be used to calculate the open-circuit air-gap field distribution, back electromotive force (EMF) and cogging torque of multilayer IPM machines. Compared with finite element analysis (FEA), it has the advantages of faster modeling, less computation source occupying and shorter time consuming, and meanwhile achieves the approximate accuracy. The analytical model is helpful and applicable for the open-circuit field calculation of multilayer IPM machines with any size and pole/slot number combination.

  1. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  2. Microelectronics plastic molded packaging

    Energy Technology Data Exchange (ETDEWEB)

    Johnson, D.R. [Ktech Corp., Albuquerque, NM (United States); Palmer, D.W.; Peterson, D.W. [Sandia National Lab., Albuquerque, NM (United States)] [and others

    1997-02-01

    The use of commercial off-the-shelf (COTS) microelectronics for nuclear weapon applications will soon be reality rather than hearsay. The use of COTS for new technologies for uniquely military applications is being driven by the so-called Perry Initiative that requires the U.S. Department of Defense (DoD) to accept and utilize commercial standards for procurement of military systems. Based on this philosophy, coupled with several practical considerations, new weapons systems as well as future upgrades will contain plastic encapsulated microelectronics. However, a conservative Department of Energy (DOE) approach requires lifetime predictive models. Thus, the focus of the current project is on accelerated testing to advance current aging models as well as on the development of the methodology to be used during WR qualification of plastic encapsulated microelectronics. An additional focal point involves achieving awareness of commercial capabilities, materials, and processes. One of the major outcomes of the project has been the definition of proper techniques for handling and evaluation of modern surface mount parts which might be used in future systems. This program is also raising the familiarity level of plastic within the weapons complex, allowing subsystem design rules accommodating COTS to evolve. A two year program plan is presented along with test results and commercial interactions during this first year.

  3. The study of hybrid model identification,computation analysis and fault location for nonlinear dynamic circuits and systems

    Institute of Scientific and Technical Information of China (English)

    XIE Hong; HE Yi-gang; ZENG Guan-da

    2006-01-01

    This paper presents the hybrid model identification for a class of nonlinear circuits and systems via a combination of the block-pulse function transform with the Volterra series.After discussing the method to establish the hybrid model and introducing the hybrid model identification,a set of relative formulas are derived for calculating the hybrid model and computing the Volterra series solution of nonlinear dynamic circuits and systems.In order to significantly reduce the computation cost for fault location,the paper presents a new fault diagnosis method based on multiple preset models that can be realized online.An example of identification simulation and fault diagnosis are given.Results show that the method has high accuracy and efficiency for fault location of nonlinear dynamic circuits and systems.

  4. Single axis controlled hybrid magnetic bearing for left ventricular assist device: hybrid core and closed magnetic circuit.

    Science.gov (United States)

    da Silva, Isaias; Horikawa, Oswaldo; Cardoso, Jose R; Camargo, Fernando A; Andrade, Aron J P; Bock, Eduardo G P

    2011-05-01

    In previous studies, we presented main strategies for suspending the rotor of a mixed-flow type (centrifugal and axial) ventricular assist device (VAD), originally presented by the Institute Dante Pazzanese of Cardiology (IDPC), Brazil. Magnetic suspension is achieved by the use of a magnetic bearing architecture in which the active control is executed in only one degree of freedom, in the axial direction of the rotor. Remaining degrees of freedom, excepting the rotation, are restricted only by the attraction force between pairs of permanent magnets. This study is part of a joint project in development by IDPC and Escola Politecnica of São Paulo University, Brazil. This article shows advances in that project, presenting two promising solutions for magnetic bearings. One solution uses hybrid cores as electromagnetic actuators, that is, cores that combine iron and permanent magnets. The other solution uses actuators, also of hybrid type, but with the magnetic circuit closed by an iron core. After preliminary analysis, a pump prototype has been developed for each solution and has been tested. For each prototype, a brushless DC motor has been developed as the rotor driver. Each solution was evaluated by in vitro experiments and guidelines are extracted for future improvements. Tests have shown good results and demonstrated that one solution is not isolated from the other. One complements the other for the development of a single-axis-controlled, hybrid-type magnetic bearing for a mixed-flow type VAD.

  5. Microelectronic systems N2 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems N2 Checkbook provides coverage of the Business and Technician Education Council level NII unit in Microelectronic Systems. However, it can be regarded as a textbook in microelectronic systems for a much wider range of studies. The aim of this book is to provide a foundation in microelectronic systems hardware and software techniques. Each topic considered in the text is presented in a way that assumes in the reader only the knowledge attained in BTEC Information Technology Studies F, Engineering Fundamentals F, or equivalent. This book concentrates on the highly popular

  6. Hybrid quantum processors: molecular ensembles as quantum memory for solid state circuits.

    Science.gov (United States)

    Rabl, P; DeMille, D; Doyle, J M; Lukin, M D; Schoelkopf, R J; Zoller, P

    2006-07-21

    We investigate a hybrid quantum circuit where ensembles of cold polar molecules serve as long-lived quantum memories and optical interfaces for solid state quantum processors. The quantum memory realized by collective spin states (ensemble qubit) is coupled to a high-Q stripline cavity via microwave Raman processes. We show that, for convenient trap-surface distances of a few microm, strong coupling between the cavity and ensemble qubit can be achieved. We discuss basic quantum information protocols, including a swap from the cavity photon bus to the molecular quantum memory, and a deterministic two qubit gate. Finally, we investigate coherence properties of molecular ensemble quantum bits.

  7. Hybrid Quantum Processors: molecular ensembles as quantum memory for solid state circuits

    CERN Document Server

    Rabl, P; Doyle, J M; Lukin, M D; Schölkopf, R J; Zoller, P

    2006-01-01

    We investigate a hybrid quantum circuit where ensembles of cold polar molecules serve as long-lived quantum memories and optical interfaces for solid state quantum processors. The quantum memory realized by collective spin states (ensemble qubit) is coupled to a high-Q stripline cavity via microwave Raman processes. We show that for convenient trap-surface distances of a few $\\mu$m, strong coupling between the cavity and ensemble qubit can be achieved. We discuss basic quantum information protocols, including a swap from the cavity photon bus to the molecular quantum memory, and a deterministic two qubit gate. Finally, we investigate coherence properties of molecular ensemble quantum bits.

  8. All-fiber hybrid photon-plasmon circuits: integrating nanowire plasmonics with fiber optics.

    Science.gov (United States)

    Li, Xiyuan; Li, Wei; Guo, Xin; Lou, Jingyi; Tong, Limin

    2013-07-01

    We demonstrate all-fiber hybrid photon-plasmon circuits by integrating Ag nanowires with optical fibers. Relying on near-field coupling, we realize a photon-to-plasmon conversion efficiency up to 92% in a fiber-based nanowire plasmonic probe. Around optical communication band, we assemble an all-fiber resonator and a Mach-Zehnder interferometer (MZI) with Q-factor of 6 × 10(6) and extinction ratio up to 30 dB, respectively. Using the MZI, we demonstrate fiber-compatible plasmonic sensing with high sensitivity and low optical power.

  9. Characterization of 4 K CMOS devices and circuits for hybrid Josephson-CMOS systems

    OpenAIRE

    Yoshikawa, Nobuyuki; Tomida, T.; Tokuda, A.; Liu, Q.; Meng, X.(Institute of High Energy Physics, Beijing, China); Whiteley, SR.; VanDuzer, T.

    2005-01-01

    Characterization and modeling of CMOS devices at 4.2 K are carried out in order to simulate low-temperature operation of CMOS circuits for Josephson-CMOS hybrid systems. CMOS devices examined in this study have been fabricated by using 0.18 mu m, 0.25 mu m, and 0.35 mu m commercial CMOS processes. Their static IN characteristics and capacitances are measured at 4.2 K to establish the low-temperature device model based on the BSIM3 SPICE model. The propagation delays of CMOS inverters measured...

  10. Organic–Inorganic Eu3+/Tb3+ codoped hybrid films for temperature mapping in integrated circuits

    Science.gov (United States)

    Brites, Carlos D. S.; Lima, Patrícia P.; Silva, Nuno J. O.; Millán, Angel; Amaral, Vitor S.; Palacio, Fernando; Carlos, Luís D.

    2013-01-01

    The continuous decrease on the geometric size of electronic devices and integrated circuits generates higher local power densities and localized heating problems that cannot be characterized by conventional thermographic techniques. Here, a self-referencing intensity-based molecular thermometer involving a di-ureasil organic-inorganic hybrid thin film co-doped with Eu3+ and Tb3+ tris (β-diketonate) chelates is used to obtain the temperature map of a FR4 printed wiring board with spatio-temporal resolutions of 0.42 μm/4.8 ms. PMID:24790938

  11. Road vehicle-induced vibration control of microelectronics facilities

    Institute of Scientific and Technical Information of China (English)

    Guo Anxin; Xu Youlin; Li Hui

    2005-01-01

    A hybrid control platform is investigated in this paper to mitigate microvibrations to a group of vibrationsensitive equipment installed in a microelectronics facility subject to nearby road vehicle-induced horizontal and vertical ground motions. The hybrid control platform, on which microelectronics equipment is installed, is mounted on a building floor through a series of passive mounts and controlled by hydraulic actuators in both horizontal and vertical directions. The control platform is an elastic body with significant bending modes of vibration, and a sub-optimal control algorithm is used to manipulate the hydraulic actuators with actuator dynamics included. The finite element model and the equations of motion of the coupled platform-building system are then established in the absolute coordinate to facilitate the feedback control and performance evaluation of the platform. The horizontal and vertical ground vibrations at the base of the building induced by nearby moving road vehicles are assumed to be stationary random processes. A typical three-story microelectronics building is selected as a case study. The case study shows that the vertical vibration of the microelectronics building is higher than the horizontal. The use of a hybrid control platform can effectively reduce both horizontal and vertical microvibrations of the microelectronics equipment to the level which satisfies the stringent microscale velocity requirement specified in the Bolt Beranek & Newman (BBN) criteria.

  12. The Electrical Engineering Curriculum at the Technical University of Denmark - Options in Microelectronics

    DEFF Research Database (Denmark)

    Bruun, Erik; Nielsen, Lars Drud

    1997-01-01

    This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design are outli......This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design...

  13. A novel circuit topology of modified switched boost hybrid resonant inverter fitted induction heating equipment

    Directory of Open Access Journals (Sweden)

    Bhattacharya Ananyo

    2016-12-01

    Full Text Available A novel circuit topology of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment is presented in this paper for efficient induction heating. Recently, induction heating technique is becoming very popular for both domestic and industrial purposes because of its high energy efficiency and controllability. Generally in induction heating, a high frequency alternating magnetic field is required to induce the eddy currents in the work piece. High frequency resonant inverters are incorporated in induction heating equipment which produce a high frequency alternating magnetic field surrounding the coil. Previously this high frequency alternating magnetic field was produced by voltage source inverters. But VSIs have several demerits. So, in this paper, a new scheme of modified switched boost high frequency hybrid resonant inverter fitted induction heating equipment has been depicted which enhances the energy efficiency and controllability and the same is validated by PSIM.

  14. Understanding microelectronics a top-down approach

    CERN Document Server

    Maloberti, Franco

    2011-01-01

    The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today's students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions,

  15. Porous low dielectric constant materials for microelectronics.

    Science.gov (United States)

    Baklanov, Mikhail R; Maex, Karen

    2006-01-15

    Materials with a low dielectric constant are required as interlayer dielectrics for the on-chip interconnection of ultra-large-scale integration devices to provide high speed, low dynamic power dissipation and low cross-talk noise. The selection of chemical compounds with low polarizability and the introduction of porosity result in a reduced dielectric constant. Integration of such materials into microelectronic circuits, however, poses a number of challenges, as the materials must meet strict requirements in terms of properties and reliability. These issues are the subject of the present paper.

  16. Dopant materials used in the microelectronics industry.

    Science.gov (United States)

    Lewis, D R

    1986-01-01

    Advances in microelectronics have transformed the occupational environment of the electronics industry. Large quantities of potentially hazardous materials are now in routine use as integrated circuit manufacturing becomes more complex and specialized. While the acute hazards associated with these dopant materials are clear, the subacute and chronic effects are less evident. Many of these elements are trace elements in humans and may play roles in health and disease in minute concentrations. Early detection and prevention of adverse health effects requires both astute medical surveillance, industrial hygiene, and safety engineering efforts to eliminate the sources of exposure to workers.

  17. Porous Dielectrics in Microelectronic Wiring Applications

    Directory of Open Access Journals (Sweden)

    Vincent McGahay

    2010-01-01

    Full Text Available Porous insulators are utilized in the wiring structure of microelectronic devices as a means of reducing, through low dielectric permittivity, power consumption and signal delay in integrated circuits. They are typically based on low density modifications of amorphous SiO2 known as SiCOH or carbon-doped oxides, in which free volume is created through the removal of labile organic phases. Porous dielectrics pose a number of technological challenges related to chemical and mechanical stability, particularly in regard to semiconductor processing methods. This review discusses porous dielectric film preparation techniques, key issues encountered, and mitigation strategies.

  18. Adhesion in microelectronics

    CERN Document Server

    Mittal, K L

    2014-01-01

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesi

  19. Fighting blindness with microelectronics.

    Science.gov (United States)

    Zrenner, Eberhart

    2013-11-06

    There is no approved cure for blindness caused by degeneration of the photoreceptor cells of the retina. However, there has been encouraging progress with attempts to restore vision using microelectronic retinal implant devices. Yet many questions remain to be addressed. Where is the best location to implant multielectrode arrays? How can spatial and temporal resolution be improved? What are the best ways to ensure the safety and longevity of these devices? Will color vision be possible? This Perspective discusses the current state of the art of retinal implants and attempts to address some of the outstanding questions.

  20. Polymers for microelectronics

    Directory of Open Access Journals (Sweden)

    Gerhard Maier

    2001-09-01

    Full Text Available The continuous advancement of microelectronics in all fields of technology has become a basic fact of our daily life. Increasingly complex tasks are performed by computers, requiring more memory capacity and faster processing speeds. This constant need to develop more highly integrated microchips is expressed by Moore's law, which states that the capacity of the most highly developed random access memory (RAM chips increases by a factor of four every three years. This is achieved by decreasing the size of devices on chips in each new generation by a factor of two and simultaneously increasing the size of the silicon chip (‘die’ by the same factor.

  1. Optical plasma microelectronic devices

    CERN Document Server

    Forati, Ebrahim; Dill, Thyler; Sievenpiper, Dan

    2015-01-01

    The semiconductor channel in conventional microelectronic devices was successfully replaced with an optically triggered gas plasma channel. The combination of DC and laser-induced gas ionizations controls the conductivity of the channel, enabling us to realize different electronic devices such as transistors, switches, modulators, etc. A special micro-scale metasurface was used to enhance the laser-gas interaction, as well as combining it with DC ionization properly. Optical plasma devices benefit form the advantages of plasma/vacuum electronic devices while preserving most of the integrablity of semiconductor based devices.

  2. NDE applications in microelectronic industries

    Science.gov (United States)

    Meyendorf, N.; Oppermann, M.; Krueger, P.; Roellig, M.; Wolter, K. J.

    2016-04-01

    New concepts in assembly technology boost our daily life in an unknown way. High end semiconductor industry today deals with functional structures down to a few nanometers. ITRS roadmap predicts an ongoing decrease of the "DRAM half pitch" over the next decade. Packaging of course is not intended to realize pitches at the nanometer scale, but has to face the challenges of integrating such semiconductor devices with smallest pitch and high pin counts into systems. Advanced techniques of nondestructive evaluation (NDE) with resolutions in volume better than 1 micrometer vixen size are urgently needed for the safety and reliability of electronic systems, especially those that are used in long living applications. The development speed of integrated circuits is still very high and is not expected to decrease in the next future. The integration density of microelectronic devices is increasing, the dimensions become smaller and the number of I/O's is getting higher. The development of new types of packages must be done with respect to reliability issues. Potential damage sources must be identified and finally avoided in the new packages. In power electronics production the condition monitoring receives a lot of interest to avoid electrical shortcuts, dead solder joints and interface cracking. It is also desired to detect and characterize very small defects like transportation phenomenon or Kirkendall voids. For this purpose, imaging technologies with resolutions in the sub-micron range are required.

  3. A Hybrid Circuit for Spoof Surface Plasmons and Spatial Waveguide Modes to Reach Controllable Band-Pass Filters.

    Science.gov (United States)

    Zhang, Qian; Zhang, Hao Chi; Wu, Han; Cui, Tie Jun

    2015-11-10

    We propose a hybrid circuit for spoof surface plasmon polaritons (SPPs) and spatial waveguide modes to develop new microwave devices. The hybrid circuit includes a spoof SPP waveguide made of two anti-symmetric corrugated metallic strips and a traditional substrate integrated waveguide (SIW). From dispersion relations, we show that the electromagnetic waves only can propagate through the hybrid circuit when the operating frequency is less than the cut-off frequency of the SPP waveguide and greater than the cut-off frequency of SIW, generating efficient band-pass filters. We demonstrate that the pass band is controllable in a large range by designing the geometrical parameters of SPP waveguide and SIW. Full-wave simulations are provided to show the large adjustability of filters, including ultra wideband and narrowband filters. We fabricate a sample of the new hybrid device in the microwave frequencies, and measurement results have excellent agreements to numerical simulations, demonstrating excellent filtering characteristics such as low loss, high efficiency, and good square ratio. The proposed hybrid circuit gives important potential to accelerate the development of plasmonic integrated functional devices and circuits in both microwave and terahertz frequencies.

  4. A microfluidic microprocessor: controlling biomimetic containers and cells using hybrid integrated circuit/microfluidic chips.

    Science.gov (United States)

    Issadore, David; Franke, Thomas; Brown, Keith A; Westervelt, Robert M

    2010-11-07

    We present an integrated platform for performing biological and chemical experiments on a chip based on standard CMOS technology. We have developed a hybrid integrated circuit (IC)/microfluidic chip that can simultaneously control thousands of living cells and pL volumes of fluid, enabling a wide variety of chemical and biological tasks. Taking inspiration from cellular biology, phospholipid bilayer vesicles are used as robust picolitre containers for reagents on the chip. The hybrid chip can be programmed to trap, move, and porate individual living cells and vesicles and fuse and deform vesicles using electric fields. The IC spatially patterns electric fields in a microfluidic chamber using 128 × 256 (32,768) 11 × 11 μm(2) metal pixels, each of which can be individually driven with a radio frequency (RF) voltage. The chip's basic functions can be combined in series to perform complex biological and chemical tasks and can be performed in parallel on the chip's many pixels for high-throughput operations. The hybrid chip operates in two distinct modes, defined by the frequency of the RF voltage applied to the pixels: Voltages at MHz frequencies are used to trap, move, and deform objects using dielectrophoresis and voltages at frequencies below 1 kHz are used for electroporation and electrofusion. This work represents an important step towards miniaturizing the complex chemical and biological experiments used for diagnostics and research onto automated and inexpensive chips.

  5. Microelectronics, radiation, and superconductivity.

    Science.gov (United States)

    Gochfeld, M

    1990-06-01

    Among the costs of technology are health hazards that face employees and consumers. New advances in the highly competitive field of microelectronics involve exposure to a variety of hazards such as gallium arsenide. Small high-technology industries appear unprepared to invest in health and safety. Although stray electromagnetic fields are not a new development, researchers are beginning to assemble data indicating that such fields pose a significant cancer risk under certain circumstances. Data have been obtained on fields associated with power lines on the one hand and consumer products on the other. Although not conclusive, the data are sufficient to warrant carefully designed research into the risks posed by electromagnetic fields. Because the scientific issues require research, there is a need to make basic social value decisions that will determine which technologies will be developed and which ones may be set aside because of their danger at the present time.

  6. Diagnostics and Microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Balch, J.W.

    1993-03-01

    This report discusses activities of the Diagnostics and Microelectronics thrust area which conducts activities in semiconductor devices and semiconductor fabrication technology for programs at Lawrence Livermore National Laboratory. Our multidisciplinary engineering and scientific staff use modern computational tools and semi-conductor microfabrication equipment to develop high-performance devices. Our work concentrates on three broad technologies of semiconductor microdevices: (1) silicon on III-V semiconductor microeletronics, (2) lithium niobate-based and III-V semiconductor-based photonics, and (3) silicon-based micromaching for application to microstructures and microinstruments. In FY-92, we worked on projects in seven areas, described in this report: novel photonic detectors; a wideband phase modulator; an optoelectronic terahertz beam system; the fabrication of microelectrode electrochemical sensors; diamond heatsinks; advanced micromachining technologies; and electrophoresis using silicon microchannels.

  7. Spectrally resolved single-photon imaging with hybrid superconducting - nanophotonic circuits

    CERN Document Server

    Kahl, O; Kovalyuk, V; Vetter, A; Lewes-Malandrakis, G; Nebel, C; Korneev, A; Goltsman, G; Pernice, W

    2016-01-01

    The detection of individual photons is an inherently binary mechanism, revealing either their absence or presence while concealing their spectral information. For multi-color imaging techniques, such as single photon spectroscopy, fluorescence resonance energy transfer microscopy and fluorescence correlation spectroscopy, wavelength discrimination is essential and mandates spectral separation prior to detection. Here, we adopt an approach borrowed from quantum photonic integration to realize a compact and scalable waveguide-integrated single-photon spectrometer capable of parallel detection on multiple wavelength channels, with temporal resolution below 50 ps and dark count rates below 10 Hz. We demonstrate multi-detector devices for telecommunication and visible wavelengths and showcase their performance by imaging silicon vacancy color centers in diamond nanoclusters. The fully integrated hybrid superconducting-nanophotonic circuits enable simultaneous spectroscopy and lifetime mapping for correlative imagi...

  8. On-chip single photon filtering and multiplexing in hybrid quantum photonic circuits.

    Science.gov (United States)

    Elshaari, Ali W; Zadeh, Iman Esmaeil; Fognini, Andreas; Reimer, Michael E; Dalacu, Dan; Poole, Philip J; Zwiller, Val; Jöns, Klaus D

    2017-08-30

    Quantum light plays a pivotal role in modern science and future photonic applications. Since the advent of integrated quantum nanophotonics different material platforms based on III-V nanostructures-, colour centers-, and nonlinear waveguides as on-chip light sources have been investigated. Each platform has unique advantages and limitations; however, all implementations face major challenges with filtering of individual quantum states, scalable integration, deterministic multiplexing of selected quantum emitters, and on-chip excitation suppression. Here we overcome all of these challenges with a hybrid and scalable approach, where single III-V quantum emitters are positioned and deterministically integrated in a complementary metal-oxide-semiconductor-compatible photonic circuit. We demonstrate reconfigurable on-chip single-photon filtering and wavelength division multiplexing with a foot print one million times smaller than similar table-top approaches, while offering excitation suppression of more than 95 dB and efficient routing of single photons over a bandwidth of 40 nm. Our work marks an important step to harvest quantum optical technologies' full potential.Combining different integration platforms on the same chip is currently one of the main challenges for quantum technologies. Here, Elshaari et al. show III-V Quantum Dots embedded in nanowires operating in a CMOS compatible circuit, with controlled on-chip filtering and tunable routing.

  9. Technological and Physical Compatibilities in Hybrid Integration of Laser and Monolithic Integration of Waveguide, Photodetector and CMOS Circuits on Silicon

    NARCIS (Netherlands)

    Zhou, M.J.; Ikkink, T.; Chalmers, J.; Kranenburg, H. van; Albers, H.; Holleman, J.; Lambeck, P.V.; Joppe, J.L.; Bekman, H.H.P.T.; Krijger, A.J.T. de

    1994-01-01

    In this paper, technological and physical compatibilities in hybrid integration of AlInGaP laser and monolithic integration of ZnO monomode waveguide, pin-photodetector, CMOS circuits for laser power control and signal amplification on silicon substrate are studied. Prospective problems and their po

  10. Technological and physical compatibilities in hybrid integration of laser and monolithic integration of waveguide, photodetector and CMOS circuits on silicon

    NARCIS (Netherlands)

    Zhou, Ming-Jiang; Ikkink, Ton; Chalmers, John; Kranenburg, van Herma; Albers, Hans; Holleman, Jisk; Lambeck, Paul; Joppe, Jan Leendert; Bekman, Herman; Krijger, de Ton; Lambeck, P.V.

    1994-01-01

    In this paper, technological and physical compatibilities in hybrid integration of AlInGaP laser and monolithic integration of ZnO monomode waveguide, pin-photodetector, CMOS circuits for laser power control and signal amplification on silicon substrate are studied. Prospective problems and their po

  11. Compact Hybrid Subsystem of 16 Channel Optical Demultiplexer, 2x2 Switches, Optical Power Monitors and Control Circuit

    Institute of Scientific and Technical Information of China (English)

    Kenichiro Takahashi; Toshihiko Kishimoto; Shintaro Mouri; Youichi Hata; Hideaki Yusa; Mitsuaki Tamura; Kazuhito Saito; Hisao Maki

    2003-01-01

    A compact hybrid subsystem of 16channel optical demultiplexer, 2x2 switches, optical power monitors and control circuit board is developed. The subsystem is able to add or drop arbitrary optical channels and monitor the optical power level by software commands. The size of the subsystem is 170x200x30(mm).

  12. A hybrid magnetic/complementary metal oxide semiconductor three-context memory bit cell for non-volatile circuit design

    Science.gov (United States)

    Jovanović, B.; Brum, R. M.; Torres, L.

    2014-04-01

    After decades of continued scaling to the beat of Moore's law, it now appears that conventional silicon based devices are approaching their physical limits. In today's deep-submicron nodes, a number of short-channel and quantum effects are emerging that affect the manufacturing process, as well as, the functionality of the microelectronic systems-on-chip. Spintronics devices that exploit both the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, are promising solutions to circumvent these scaling threats. Being compatible with the CMOS technology, such devices offer a promising synergy of radiation immunity, infinite endurance, non-volatility, increased density, etc. In this paper, we present a hybrid (magnetic/CMOS) cell that is able to store and process data both electrically and magnetically. The cell is based on perpendicular spin-transfer torque magnetic tunnel junctions (STT-MTJs) and is suitable for use in magnetic random access memories and reprogrammable computing (non-volatile registers, processor cache memories, magnetic field-programmable gate arrays, etc). To demonstrate the potential our hybrid cell, we physically implemented a small hybrid memory block using 45 nm × 45 nm round MTJs for the magnetic part and 28 nm fully depleted silicon on insulator (FD-SOI) technology for the CMOS part. We also report the cells measured performances in terms of area, robustness, read/write speed and energy consumption.

  13. Photoemission-based microelectronic devices

    Science.gov (United States)

    Forati, Ebrahim; Dill, Tyler J.; Tao, Andrea R.; Sievenpiper, Dan

    2016-11-01

    The vast majority of modern microelectronic devices rely on carriers within semiconductors due to their integrability. Therefore, the performance of these devices is limited due to natural semiconductor properties such as band gap and electron velocity. Replacing the semiconductor channel in conventional microelectronic devices with a gas or vacuum channel may scale their speed, wavelength and power beyond what is available today. However, liberating electrons into gas/vacuum in a practical microelectronic device is quite challenging. It often requires heating, applying high voltages, or using lasers with short wavelengths or high powers. Here, we show that the interaction between an engineered resonant surface and a low-power infrared laser can cause enough photoemission via electron tunnelling to implement feasible microelectronic devices such as transistors, switches and modulators. The proposed photoemission-based devices benefit from the advantages of gas-plasma/vacuum electronic devices while preserving the integrability of semiconductor-based devices.

  14. A Comparative Performance Study of Hybrid SET-CMOS Based Logic Circuits for the Estimation of Robustness

    Directory of Open Access Journals (Sweden)

    Biswabandhu Jana

    2013-10-01

    Full Text Available The urge of inventing a new low power consuming device for the post CMOS future technology has drawn the attention of the researchers on Single Electron Transistor [SET]. The two main virtues, ultra low power consumption [1] and ultra small dimension of SET [12, 13] have stimulated the researchers to consider it as a possible alternative. In our past paper [1] we have designed and simulated some basic gates. In this paper we have designed and simulated hybrid SET-CMOS based counter circuits, shift register to show that the hybrid SET-MOS based circuits consumes the lesser power than MOS based circuits. All the simulation were done and verified in Tanner environment using the MIB model for SET and the BSIM4.6.1 model for MOSFET.

  15. Whole body perfusion for hybrid aortic arch repair: evolution of selective regional perfusion with a modified extracorporeal circuit.

    Science.gov (United States)

    Fernandes, Philip; Walsh, Graham; Walsh, Stephanie; O'Neil, Michael; Gelinas, Jill; Chu, Michael W A

    2017-04-01

    Patients undergoing hybrid aortic arch reconstruction require careful protection of vital organs. We believe that whole body perfusion with tailored dual circuitry may help to achieve optimal patient outcomes. Our circuit has evolved from a secondary circuit utilizing a cardioplegia delivery device for lower body perfusion to a dual-oxygenator circuit. This allows individually controlled regional perfusion with ease of switching from secondary to primary circuit for total body flow. The re-design allows for separate flow and temperature regulation with two oxygenators in parallel. All patients underwent a single-stage operation for simultaneous treatment of arch and descending aortic pathology via a sternotomy, using a hybrid frozen elephant trunk technique. We report six consecutive patients undergoing hybrid arch and frozen elephant trunk reconstruction using a dual-oxygenator circuit. Five patients underwent elective surgery and one was emergent. One patient had an acute dissection while three underwent concomitant procedures, including a Ross procedure and two valve-sparing root reconstructions. Three cases were redo sternotomies. The mean pump time was 358 ± 131 min, the aortic cross clamp time 243 ± 135 min, the cardioplegia volume of 33,208 ml ± 16,173, cerebral ischemia 0 min, lower body ischemia 76 ± 34 min and the average lower body perfusion time was 142 min. Two patients did not require any donor blood products. The median intensive care unit (ICU) and hospital lengths of stay (LOS) were two days and 10 days, respectively. The average peak serum lactate on CPB was 7.47 mmol/L and, at admission to the ICU, it was 3.37 mmol/L. Renal and respiratory failure developed in the salvage acute type A dissection patient. No other complications occurred in this series. Whole body perfusion as delivered through individually controlled dual-oxygenator circuitry allows maximum flexibility for hybrid aortic arch reconstruction. A modified circuit perfusion

  16. Application of Cu-polyimide flex circuit and Al-on-glass pitch adapter for the ATLAS SCT barrel hybrid

    CERN Document Server

    Unno, Y; Ikegami, Y; Iwata, Y; Kohriki, T; Kondo, T; Nakano, I; Ohsugi, T; Takashima, R; Tanaka, R; Terada, S; Ujiie, N

    2005-01-01

    We applied the surface build-up Cu-polyimide flex-circuit technology with laser vias to the ATLAS SCT barrel hybrid to be made in one piece from the connector to the electronics sections including cables. The hybrids, reinforced with carbon-carbon substrates, provide mechanical strength, thermal conductivity, low-radiation length, and stability in application-specific integrated circuit (ASIC) operation. By following the design rules, we experienced little trouble in breaking the traces. The pitch adapter between the sensor and the ASICs was made of aluminum traces on glass substrate. We identified that the generation of whiskers around the wire-bonding feet was correlated with the hardness of metallized aluminum. The appropriate hardness has been achieved by keeping the temperature of the glasses as low as room temperature during the metallization. The argon plasma cleaning procedure cleaned the contamination on the gold pads of the hybrids for successful wire bonding, although it was unsuccessful in the alu...

  17. Surface analysis in microelectronics.

    Science.gov (United States)

    Pignataro, S

    1995-10-01

    The contribution given by surface analysis to solve some problems encountered in the production of electronic power devices have been discussed. Mainly two types of problems have been faced. One of these deal with interfacial chemistry. Three examples have been investigated. The first applies to the improvement of the quality and the reliability of plastic packages through the optimization of the resin/metal and resin/die adhesion. The second relies to the adhesion between polyimide and silicon nitride used in the multilevel technology. The third example refers to the so called die-attach process and related problems. Another area of interest in microelectronics is that of the erosion of various types of surfaces and the possibility of wrong etching. A few examples of the application of surface analytical techniques for these problems will be presented. XPS and SIMS working in imaging and multipoint analysis mode, scanning acoustic microscopy, contact angle measurements as well as peeling and tensile strength measurements are the main tools used to obtain useful data.

  18. Radiation hardness improvement of analog front-end microelectronic devices for particle accelerator

    Science.gov (United States)

    Miroshnichenko, A. G.; Rodin, A. S.; Bakerenkov, A. S.; Felitsyn, V. A.

    2016-10-01

    Series of schematic techniques for increasing radiation hardness of the current mirrors is developed. These techniques can be used for the design of analog front-end microelectronic devices based on the operational amplifiers. The circuit simulation of radiation degradation of current transmission coefficients was performed for various circuit solutions in LTSpice software.

  19. A four-channel microelectronic system for neural signal regeneration

    Energy Technology Data Exchange (ETDEWEB)

    Xie Shushan; Wang Zhigong; Li Wenyuan [Institute of RF- and OE-ICs, Southeast University, Nanjing 210096 (China); Lue Xiaoying; Pan Haixian, E-mail: zgwang@seu.edu.c [State Key Laboratory of Bio-Electronics, Southeast University, Nanjing 210096 (China)

    2009-12-15

    This paper presents a microelectronic system which is capable of making a signal record and functional electric stimulation of an injured spinal cord. As a requirement of implantable engineering for the regeneration microelectronic system, the system is of low noise, low power, small size and high performance. A front-end circuit and two high performance OPAs (operational amplifiers) have been designed for the system with different functions, and the two OPAs are a low-noise low-power two-stage OPA and a constant-g{sub m} RTR input and output OPA. The system has been realized in CSMC 0.5-{mu}m CMOS technology. The test results show that the system satisfies the demands of neuron signal regeneration. (semiconductor integrated circuits)

  20. MICROELECTRONICS: Flip the Chip.

    Science.gov (United States)

    Wong, C P; Luo, S; Zhang, Z

    2000-12-22

    As integrated circuit fabrication advances rapidly and the market for faster, lighter, smaller, yet less expensive electronic products accelerates, electronic packaging faces its own challenges. In this Perspective, Wong, Luo, and Zhang describe recent advances in flip chip packaging. This technology has many advantages over the conventional wire bonding technology and offers the possibility of low-cost electronic assembly for modern electronic products.

  1. From microelectronics to nanoelectronics

    Directory of Open Access Journals (Sweden)

    N. M. Rudenko

    2007-10-01

    Full Text Available The brief review of the literature in area nanoelectronics is submitted which reflects the analysis of fundamental restrictions of reduction of the sizes of elements of the integrated circuits, their number in one crystal, increase of speed and functionalities.

  2. Radiofrequency and microwave radiation in the microelectronics industry.

    Science.gov (United States)

    Cohen, R

    1986-01-01

    The microscopic precision required to produce minute integrated circuits is dependent on several processes utilizing radiofrequency and microwave radiation. This article provides a review of radiofrequency and microwave exposures in microelectronics and of the physical and biologic properties of these types of radiation; summarizes the existing, relevant medical literature; and provides the clinician with guidelines for diagnosis and treatment of excessive exposures to microwave and radiofrequency radiation.

  3. Surface reactions in microelectronics process technology.

    Science.gov (United States)

    Levitin, Galit; Hess, Dennis W

    2011-01-01

    Current integrated circuit (IC) manufacturing consists of more than 800 process steps, nearly all of which involve reactions at surfaces that significantly impact device yield and performance. From initial surface preparation through film deposition, patterning, etching, residue removal, and metallization, an understanding of surface reactions and interactions is critical to the successful continuous scaling, yield, and reliability of electronic devices. In this review, some of the most important surface reactions that drive the development of microelectronic device fabrication are described. The reactions discussed do not constitute comprehensive coverage of this topic in IC manufacture but have been selected to demonstrate the importance of surface/interface reactions and interactions in the development of new materials, processing sequences, and process integration challenges. Specifically, the review focuses on surface reactions related to surface cleaning/preparation, semiconductor film growth, dielectric film growth, metallization, and etching (dry and wet).

  4. Fundamentals of microelectronics

    CERN Document Server

    Razavi, Behzad

    2008-01-01

    Designed to build a strong foundation in both design and analysis of electronic circuits, Razavi teaches conceptual understanding and mastery of the material by using modern examples to motivate and prepare students for advanced courses and their careers. Razavi's unique problem-solving framework enables students to deconstruct complex problems into components that they are familiar with which builds the confidence and intuitive skills needed for success.

  5. Developments in microelectronics: Past and future

    Science.gov (United States)

    Zhijian, L.

    1985-04-01

    The evolution of microelectronics in China is reviewed. Current developments and fracture trends seen as characteristic of the technology are discussed and some suggestions are offered as to the advancement of microelectronics in China.

  6. Microelectronics: Their Implications for Education and Training.

    Science.gov (United States)

    Audiovisual Instruction, 1979

    1979-01-01

    This two-part article indicates some probable characteristics of the microelectronics in the future and assesses implications of the microelectronics revolution for the methods and systems currently used in teaching and training. (CMV)

  7. Mixed potential integral equation technique for hybrid microstrip-slotline multilayered circuits using a mixed rectangular-triangular mesh

    Science.gov (United States)

    Sercu, Jeannick; Fache, Niels; Libbrecht, Frank; Lagasse, Paul

    1995-05-01

    In this paper, a mixed potential integral equation (MPIE) formulation for hybrid microstrip-slotline multilayered circuits is presented. This integral equation is solved with the method of moments (MoM) in combination with Galerkin's method. The vector-valued rooftop functions defined over a mixed rectangular-triangular mesh are used to model the electric and magnetic currents on the microstrip and slotline structures. An efficient calculation technique for the quadruple interaction integrals between two cells in the system matrix equation is presented. Two examples of hybrid microstrip-slotline circuits are discussed. The first example compares the simulation results for a microstrip-slotline transition with measured data. The second example illustrates the use of the simulation technique in the design process of a broadband slot-coupled microstrip line transition.

  8. Modeling and Experimental Demonstration of a Hopfield Network Analog-to-Digital Converter with Hybrid CMOS/Memristor Circuits.

    Science.gov (United States)

    Guo, Xinjie; Merrikh-Bayat, Farnood; Gao, Ligang; Hoskins, Brian D; Alibart, Fabien; Linares-Barranco, Bernabe; Theogarajan, Luke; Teuscher, Christof; Strukov, Dmitri B

    2015-01-01

    The purpose of this work was to demonstrate the feasibility of building recurrent artificial neural networks with hybrid complementary metal oxide semiconductor (CMOS)/memristor circuits. To do so, we modeled a Hopfield network implementing an analog-to-digital converter (ADC) with up to 8 bits of precision. Major shortcomings affecting the ADC's precision, such as the non-ideal behavior of CMOS circuitry and the specific limitations of memristors, were investigated and an effective solution was proposed, capitalizing on the in-field programmability of memristors. The theoretical work was validated experimentally by demonstrating the successful operation of a 4-bit ADC circuit implemented with discrete Pt/TiO2- x /Pt memristors and CMOS integrated circuit components.

  9. Apparatus for assembly of microelectronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Lavin, Judith Maria; Resnick, Paul J.

    2017-09-12

    An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

  10. Microelectronics in Education--A Changing Future.

    Science.gov (United States)

    Humphries, Chris

    1985-01-01

    Describes major program activities of Microelectronics Education Programme (MEP) for England, Wales, and Northern Ireland, which is designed to help schools prepare children for society with microelectronics. The core elements and potential consequences of the Microelectronics Support Unit, a follow-up to MEP which will conclude activities in…

  11. 18k Channels single photon counting readout circuit for hybrid pixel detector

    Science.gov (United States)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e- and the equivalent noise charge is 168 e- rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  12. 18k Channels single photon counting readout circuit for hybrid pixel detector

    Energy Technology Data Exchange (ETDEWEB)

    Maj, P., E-mail: piotr.maj@agh.edu.pl [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Grybos, P.; Szczygiel, R.; Zoladz, M. [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Sakumura, T.; Tsuji, Y. [X-ray Analysis Division, Rigaku Corporation, Matsubara, Akishima, Tokyo 196-8666 (Japan)

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm Multiplication-Sign 20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96 Multiplication-Sign 192 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 {mu}W/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 {mu}V/e{sup -} and the equivalent noise charge is 168 e{sup -} rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  13. Microelectronics and Computers in Medicine.

    Science.gov (United States)

    Meindl, James D.

    1982-01-01

    The use of microelectronics and computers in medicine is reviewed, focusing on medical research; medical data collection, storage, retrieval, and manipulation; medical decision making; computed tomography; ultrasonic imaging; role in clinical laboratories; and use as adjuncts for diagnostic tests, monitors of critically-ill patients, and with the…

  14. Fundamentals of Microelectronics Processing (VLSI).

    Science.gov (United States)

    Takoudis, Christos G.

    1987-01-01

    Describes a 15-week course in the fundamentals of microelectronics processing in chemical engineering, which emphasizes the use of very large scale integration (VLSI). Provides a listing of the topics covered in the course outline, along with a sample of some of the final projects done by students. (TW)

  15. Launching a Programme on Microelectronics.

    Science.gov (United States)

    Fothergill, Richard

    1982-01-01

    Discusses the priorities and problems in the development by the United Kingdom Department of Education and Science of a program to introduce microelectronic technology to elementary and secondary level students. The basic needs for program implementation, information support required for the program, inservice teacher training, and curriculum…

  16. The Design of Drive Circuit with High-power Output for Two-phase Hybrid Stepping Motor Based on BY-5064

    Institute of Scientific and Technical Information of China (English)

    MA Xiao-jiao; LI Cheng-gui; CAI Zheng; ZHAO Li-guo

    2011-01-01

    A kind of drive circuit which high-power output for stepping motor, based two-phase hybrid stepping motor are designed, achieved. is low power consumption, high-performance and on BY-5064, and a kind of dedicated circuit for drive control for stepping motor with high-power is

  17. Applications of laser direct-write for embedding microelectronics

    Science.gov (United States)

    Piqué, Alberto; Charipar, Nicholas A.; Kim, Heungsoo; Auyeung, Ray C. Y.; Mathews, Scott A.

    2007-03-01

    The use of direct-write techniques might revolutionize the way microelectronic devices such as interconnects, passives, IC's, antennas, sensors and power sources are designed and fabricated. The Naval Research Laboratory has developed a laser-based microfabrication process for direct-writing the materials and components required for the assembly and interconnection of the above devices. This laser direct-write (LDW) technique is capable of operating in subtractive, additive, and transfer mode. In subtractive mode, the system operates as a laser micromachining workstation capable of achieving precise depth and surface roughness control. In additive mode, the system utilizes a laser-forward transfer process for the deposition of metals, oxides, polymers and composites under ambient conditions onto virtually any type of surface, thus functioning as a laser printer for patterns of electronic materials. Furthermore, in transfer mode, the system is capable of transferring individual devices, such as semiconductor bare die or surface mount devices, inside a trench or recess in a substrate, thus performing the same function of the pick-and-place machines used in circuit board manufacture. The use of this technique is ideally suited for the rapid prototyping of embedded microelectronic components and systems while allowing the overall circuit design and layout to be easily modified or adapted to any specific application or form factor. This paper describes the laser direct-write process as applied to the forward transfer of microelectronic devices.

  18. Delidding and Resealing Hybrid Microelectronic Packages

    Science.gov (United States)

    1982-05-01

    package. Survey data showed that the I" x 1" welded metal butterfly package to be the prime candidate, at first glance. More thorough evaluation, however...5th Avenue Chelmsford, MA 01824 King of Prussia, PA 19460 George Erdos M. R. Stahler Garrett Manufacturing Corporation M-8639 255 Atwell Drive General

  19. A four-channel microelectronic system for neural signal regeneration

    Institute of Scientific and Technical Information of China (English)

    Xie Shushan; Wang Zhigong; Lü Xiaoying; Li Wenyuan; Pan Haixian

    2009-01-01

    This paper presents a microelectronic system which is capable of making a signal record and functional electric stimulation of an injured spinal cord. As a requirement of implantable engineering for the regeneration microelectronic system, the system is of low noise, low power, small size and high performance. A front-end circuit and two high performance OPAs (operational amplifiers) have been designed for the system with different functions,and the two OPAs are a low-noise low-power two-stage OPA and a constant-g_m RTR input and output OPA. The system has been realized in CSMC 0.5-μm CMOS technology. The test results show that the system satisfies the demands of neuron signal regeneration.

  20. Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit.

    Science.gov (United States)

    Guan, Binbin; Scott, Ryan P; Qin, Chuan; Fontaine, Nicolas K; Su, Tiehui; Ferrari, Carlo; Cappuzzo, Mark; Klemens, Fred; Keller, Bob; Earnshaw, Mark; Yoo, S J B

    2014-01-13

    We demonstrate free-space space-division-multiplexing (SDM) with 15 orbital angular momentum (OAM) states using a three-dimensional (3D) photonic integrated circuit (PIC). The hybrid device consists of a silica planar lightwave circuit (PLC) coupled to a 3D waveguide circuit to multiplex/demultiplex OAM states. The low excess loss hybrid device is used in individual and two simultaneous OAM states multiplexing and demultiplexing link experiments with a 20 Gb/s, 1.67 b/s/Hz quadrature phase shift keyed (QPSK) signal, which shows error-free performance for 379,960 tested bits for all OAM states.

  1. A K-Band RF-MEMS-Enabled Reconfigurable and Multifunctional Low-Noise Amplifier Hybrid Circuit

    Directory of Open Access Journals (Sweden)

    R. Malmqvist

    2011-01-01

    Full Text Available A K-band (18–26.5 GHz RF-MEMS-enabled reconfigurable and multifunctional dual-path LNA hybrid circuit (optimised for lowest/highest possible noise figure/linearity, resp. is presented, together with its subcircuit parts. The two MEMS-switched low-NF (higher gain and high-linearity (lower gain LNA circuits (paths present 16.0 dB/8.2 dB, 2.8 dB/4.9 dB and 15 dBm/20 dBm of small-signal gain, noise figure, and 1 dB compression point at 24 GHz, respectively. Compared with the two (fixed LNA subcircuits used within this design, the MEMS-switched LNA circuit functions show minimum 0.6–1.3 dB higher NF together with similar values of P1 dB at 18–25 GHz. The gain of one LNA circuit path is reduced by 25–30 dB when the MEMS switch and active circuitry used within in the same switching branch are switched off to select the other LNA path and minimise power consumption.

  2. Low Insertion HVDC Circuit Breaker: Magnetically Pulsed Hybrid Breaker for HVDC Power Distribution Protection

    Energy Technology Data Exchange (ETDEWEB)

    None

    2012-01-09

    GENI Project: General Atomics is developing a direct current (DC) circuit breaker that could protect the grid from faults 100 times faster than its alternating current (AC) counterparts. Circuit breakers are critical elements in any electrical system. At the grid level, their main function is to isolate parts of the grid where a fault has occurred—such as a downed power line or a transformer explosion—from the rest of the system. DC circuit breakers must interrupt the system during a fault much faster than AC circuit breakers to prevent possible damage to cables, converters and other grid-level components. General Atomics’ high-voltage DC circuit breaker would react in less than 1/1,000th of a second to interrupt current during a fault, preventing potential hazards to people and equipment.

  3. An adaptive metamaterial beam with hybrid shunting circuits for extremely broadband control of flexural wave (Conference Presentation)

    Science.gov (United States)

    Chen, Yangyang; Huang, Guoliang

    2017-04-01

    A great deal of research has been devoted to controlling the dynamic behaviors of phononic crystals and metamaterials by directly tuning the frequency regions and/or widths of their inherent band gaps. Here, we present a novel approach to achieve extremely broadband flexural wave/vibration attenuation based on tunable local resonators made of piezoelectric stacks shunted by hybrid negative capacitance and negative inductance circuits with proof masses attached on a host beam. First, wave dispersion relations of the adaptive metamaterial beam are calculated analytically by using the transfer matrix method. The unique modulus tuning properties induced by the hybrid shunting circuits are then characterized conceptually, from which the frequency dependent modulus tuning curves of the piezoelectric stack located within wave attenuation frequency regions are quantitatively identified. As an example, a flexural wave high-pass band filter with a wave attenuation region from 0 to 23.0 kHz is demonstrated analytically and numerically by using the hybrid shunting circuit, in which the two electric components are connected in series. By changing the connection pattern to be parallel, another super wide wave attenuation region from 13.5 to 73.0 kHz is demonstrated to function as a low-pass filter at a subwavelength scale. The proposed adaptive metamaterial possesses a super wide band gap created both naturally and artificially. Therefore, it can be used for the transient wave mitigation at extremely broadband frequencies such as blast or impact loadings. We envision that the proposed design and approach can open many possibilities in broadband vibration and wave control.

  4. Development of distribution and subtransmission SF/sub 6/ circuit breaker and hybrid transmission interrupter. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Votta, G.A.

    1978-06-01

    This project covered the development of a new generation of SF/sub 6/ arc spinner interrupters, a 15-kV circuit breaker (distribution) using this interrupter, and investigated the feasibility of a high voltage (transmission) hybrid interrupter using the arc-spinner and a vacuum interrupter in series. The arc spinner interrupter concept uses a self-generated magnetic field to drive an arc, on a circular path in an atmosphere of SF/sub 6/ gas, to achieve interruption. Test models of the arc spinner interrupter were built and tested to determine the component requirements and arrangements necessary for the desired performance. A single-phase laboratory model of this interrupter was successfully tested up through 25 kA at 13.5 kV. Interruption of 40 kA at 13.5 kV was demonstrated; however, satisfactory performance was not obtained at significant current levels during this program when tested at higher voltages. A full-scale model of a three-phase outdoor distribution power circuit breaker rated 18 kA at 15.5 kV was built and successfully tested to standards. The hybrid interrupter concept (transmission) uses an arc spinner and a vacuum interrupter in series. The vacuum interrupter handles the high initial rate of rise of recovery voltage associated with short line faults, and the arc spinner interrupter handles the high peak transient recovery voltage. The hybrid interrupter demonstrated an ability to handle the initial high rate of rise recovery voltage but encountered dielectric failures at relatively low current levels. This feasibility investigation was limited by the unavailability of a suitable rating of vacuum interrupters and by limitations inherent to an early model arc spinner interrupter for the tests. The investigation of the hybrid was discontinued until further development of a higher voltage arc spinner interrupter could be accomplished.

  5. Method for producing a hybridization of detector array and integrated circuit for readout

    Science.gov (United States)

    Fossum, Eric R.; Grunthaner, Frank J.

    1993-08-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  6. Printed circuit board industry.

    Science.gov (United States)

    LaDou, Joseph

    2006-05-01

    The printed circuit board is the platform upon which microelectronic components such as semiconductor chips and capacitors are mounted. It provides the electrical interconnections between components and is found in virtually all electronics products. Once considered low technology, the printed circuit board is evolving into a high-technology product. Printed circuit board manufacturing is highly complicated, requiring large equipment investments and over 50 process steps. Many of the high-speed, miniaturized printed circuit boards are now manufactured in cleanrooms with the same health and safety problems posed by other microelectronics manufacturing. Asia produces three-fourths of the world's printed circuit boards. In Asian countries, glycol ethers are the major solvents used in the printed circuit board industry. Large quantities of hazardous chemicals such as formaldehyde, dimethylformamide, and lead are used by the printed circuit board industry. For decades, chemically intensive and often sloppy manufacturing processes exposed tens of thousands of workers to a large number of chemicals that are now known to be reproductive toxicants and carcinogens. The printed circuit board industry has exposed workers to high doses of toxic metals, solvents, acids, and photolithographic chemicals. Only recently has there been any serious effort to diminish the quantity of lead distributed worldwide by the printed circuit board industry. Billions of electronics products have been discarded in every region of the world. This paper summarizes recent regulatory and enforcement efforts.

  7. CHARACTERISTICS OF DROPLET TRANSFER IN CO2 LASER-MIG HYBRID WELDING WITH SHORT-CIRCUITING MODE

    Institute of Scientific and Technical Information of China (English)

    LEI Zhenglong; CHEN Yanbin; LI Liqun; WU Lin

    2006-01-01

    LF6 aluminum alloy plates with 4.5 mm thickness are welded in this experiment. Welding is carried out by using the CO2 laser-MIG paraxial hybrid welding in flat position. The experimental results indicate that the inherent droplet transfer cycle time of conventional MIG arc is changed due to the interaction between CO2 laser beam and MIG arc in the short-circuiting mode of laser-MIG hybrid welding. Because of the preheating action of CO2 laser to electrode and base material, the droplet transfer frequency of MIG arc is increased in the hybrid welding process. When laser power is increased to a certain degree, the droplet transfer frequency is decreased due to the effect of laser-induced keyhole. Furthermore, through analyzing the MIG welding current and arc voltage waveforms and the characteristics of droplet transfer in the hybrid welding process, the effect of laser energy and the action point between laser beam and arc on the frequency of droplet transfer and weld appearance is investigated in details.

  8. Microelectronics packaging research directions for aerospace applications

    Science.gov (United States)

    Galbraith, L.

    2003-01-01

    The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.

  9. Leveraging Microelectronics Research to Enable A Smarter Planet

    Science.gov (United States)

    Dalton, Timothy J.

    2009-10-01

    Over the course of the last fifty years, the microelectronics industry has made tremendous strides in the development and manufacturing of ever more complex integrated circuits (IC). These circuits have typically been applied to the information technology (IT) industry and have driven improvements in the computational power per dollar of many orders of magnitude. Part of the ``toolbox'' of skills acquired to produce integrated circuits is the ability to form desired patterns at ever decreasing sizes. The minimum controllable feature size has been reduced by six orders of magnitude (from millimeters to nanometers) during the last fifty years. With feature sizes rapidly approaching 10nm, the conventional silicon IC industry is nearing a threshold with the end of conventional silicon scaling approaching. Research today focuses on new device structure to replace the CMOS FET as the engine of the IT industry. A very exciting research area today is the concept of taking the skill-set acquired from IC research, development, and manufacturing, and applying those skills into new domains where they can enable a ``smarter planet''. These new domains include areas such as energy, water, and health care / life sciences. All of these are outside of the traditional IT focus for microelectronics research, yet, the new ``smarter planet'' domains may form the basis for future industries. This presentation will look at the evolution of IBM's research model and focus, shifting from one solely focused on IT, to one that compliments IT research with Smarter Planet domains.

  10. Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

    Energy Technology Data Exchange (ETDEWEB)

    Khan, Umer Amir [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of); National University of Sciences and Technology, PNEC Campus, Habib Rehmatullah Road, Karachi (Pakistan); Lee, Jong-Geon; Seo, In-Jin [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of); Amir, Faisal [National University of Sciences and Technology, PNEC Campus, Habib Rehmatullah Road, Karachi (Pakistan); Lee, Bang-Wook, E-mail: bangwook@hanyang.ac.kr [Hanyang University, Sa-3dong, Sangrok-gu, Ansan 426-791 (Korea, Republic of)

    2015-11-15

    Highlights: • A novel hybrid-type superconducting circuit breaker (SDCCB) is proposed. • SDCCB has SFCL located in the main current path to limit the fault current until the final trip signal. • SFCL in SDCCB suppressed the fast rising DC fault current for a predefined time. • SFCL significantly reduced the DC current breaking stress on SDCCB components. • SDCCB isolated the HVDC faulty line in three, four, and five converter stations MTDC. - Abstract: Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

  11. Carbon-ionogel supercapacitors for integrated microelectronics.

    Science.gov (United States)

    Leung, Greg; Smith, Leland; Lau, Jonathan; Dunn, Bruce; Chui, Chi On

    2016-01-22

    To exceed the performance limits of dielectric capacitors in microelectronic circuit applications, we design and demonstrate on-chip coplanar electric double-layer capacitors (EDLCs), or supercapacitors, employing carbon-coated gold electrodes with ionogel electrolyte. The formation of carbon-coated microelectrodes is accomplished by solution processing and results in a ten-fold increase in EDLC capacitance compared to bare gold electrodes without carbon. At frequencies up to 10 Hz, an areal capacitance of 2.1 pF μm(-2) is achieved for coplanar carbon-ionogel EDLCs with 10 μm electrode gaps and 0.14 mm(2) electrode area. Our smallest devices, comprised of 5 μm electrode gaps and 80 μm(2) of active electrode area, reach areal capacitance values of ∼0.3 pF μm(-2) at frequencies up to 1 kHz, even without carbon. To our knowledge, these are the highest reported values to date for on-chip EDLCs with sub-mm(2) areas. A physical EDLC model is developed through the use of computer-aided simulations for design exploration and optimization of coplanar EDLCs. Through modeling and comparison with experimental data, we highlight the importance of reducing the electrode gap and electrolyte resistance to achieve maximum performance from on-chip EDLCs.

  12. IP validation in remote microelectronics testing

    Science.gov (United States)

    Osseiran, Adam; Eshraghian, Kamran; Lachowicz, Stefan; Zhao, Xiaoli; Jeffery, Roger; Robins, Michael

    2004-03-01

    This paper presents the test and validation of FPGA based IP using the concept of remote testing. It demonstrates how a virtual tester environment based on a powerful, networked Integrated Circuit testing facility, aimed to complement the emerging Australian microelectronics based research and development, can be employed to perform the tasks beyond the standard IC test. IC testing in production consists in verifying the tested products and eliminating defective parts. Defects could have a number of different causes, including process defects, process migration and IP design and implementation errors. One of the challenges in semiconductor testing is that while current fault models are used to represent likely faults (stuck-at, delay, etc.) in a global context, they do not account for all possible defects. Research in this field keeps growing but the high cost of ATE is preventing a large community from accessing test and verification equipment to validate innovative IP designs. For these reasons a world class networked IC teletest facility has been established in Australia under the support of the Commonwealth government. The facility is based on a state-of-the-art semiconductor tester operating as a virtual centre spanning Australia and accessible internationally. Through a novel approach the teletest network provides virtual access to the tester on which the DUT has previously been placed. The tester software is then accessible as if the designer is sitting next to the tester. This paper presents the approach used to test and validate FPGA based IPs using this remote test approach.

  13. Hybrid-Circuit Module For Dc-To-Dc Power Converter

    Science.gov (United States)

    Vorperian, Vatche; Detwiler, Robert; Karmon, Dan

    1996-01-01

    Power hybrid module is general-purpose power-switching module providing flexibility in design and application. Complete dc-to-dc power converter constructed by adding input/output filters and feedback circuitry to module to suit specific application.

  14. Educational Implications of Microelectronics and Microprocessors.

    Science.gov (United States)

    Harris, N. D. C., Ed.

    This conference report explores microelectronic technology, its effect on educational methods and objectives, and its implications for educator responsibilities. Two main areas were considered: the significance of the likely impact of the large scale introduction of microprocessors and microelectronics on commercial and industrial processes, the…

  15. The Legacy of the Microelectronics Education Programme.

    Science.gov (United States)

    Thorne, Michael

    1987-01-01

    Describes the Microelectronics Education Programme (MEP), a plan developed to help British secondary school students learn about microcomputers and the role of technology in society, and its successor, the Microelectronics Support Unit (MESU). Highlights include curriculum development, teacher training, computer assisted instruction and the…

  16. Biomimetic Microelectronics for Regenerative Neuronal Cuff Implants.

    Science.gov (United States)

    Karnaushenko, Daniil; Münzenrieder, Niko; Karnaushenko, Dmitriy D; Koch, Britta; Meyer, Anne K; Baunack, Stefan; Petti, Luisa; Tröster, Gerhard; Makarov, Denys; Schmidt, Oliver G

    2015-11-18

    Smart biomimetics, a unique class of devices combining the mechanical adaptivity of soft actuators with the imperceptibility of microelectronics, is introduced. Due to their inherent ability to self-assemble, biomimetic microelectronics can firmly yet gently attach to an inorganic or biological tissue enabling enclosure of, for example, nervous fibers, or guide the growth of neuronal cells during regeneration.

  17. Study of switching electric circuits with DC hybrid breaker, one stage

    Science.gov (United States)

    Niculescu, T.; Marcu, M.; Popescu, F. G.

    2016-06-01

    The paper presents a method of extinguishing the electric arc that occurs between the contacts of direct current breakers. The method consists of using an LC type extinguishing group to be optimally sized. From this point of view is presented a theoretical approach to the phenomena that occurs immediately after disconnecting the load and the specific diagrams are drawn. Using these, the elements extinguishing group we can choose. At the second part of the paper there is presented an analyses of the circuit switching process by decomposing the process in particular time sequences. For every time interval there was conceived a numerical simulation model in MATLAB-SIMULINK medium which integrates the characteristic differential equation and plots the capacitor voltage variation diagram and the circuit dumping current diagram.

  18. [Application of microelectronics CAD tools to synthetic biology].

    Science.gov (United States)

    Madec, Morgan; Haiech, Jacques; Rosati, Élise; Rezgui, Abir; Gendrault, Yves; Lallement, Christophe

    2017-02-01

    Synthetic biology is an emerging science that aims to create new biological functions that do not exist in nature, based on the knowledge acquired in life science over the last century. Since the beginning of this century, several projects in synthetic biology have emerged. The complexity of the developed artificial bio-functions is relatively low so that empirical design methods could be used for the design process. Nevertheless, with the increasing complexity of biological circuits, this is no longer the case and a large number of computer aided design softwares have been developed in the past few years. These tools include languages for the behavioral description and the mathematical modelling of biological systems, simulators at different levels of abstraction, libraries of biological devices and circuit design automation algorithms. All of these tools already exist in other fields of engineering sciences, particularly in microelectronics. This is the approach that is put forward in this paper.

  19. New adders using hybrid circuit consisting of three-gate single-electron transistors (TG-SETs) and MOSFETs.

    Science.gov (United States)

    Yu, YunSeop; Choi, JungBum

    2007-11-01

    A half-adder (HA) and a full-adder (FA) using hybrid circuits combining three-gate single-electron transistors (TG-SETs) with metal-oxide-semiconductor field-effect-transistors (MOSFETs) are proposed. The proposed HA consists of three TG-SETs, two enhanced-mode NMOSFETs, and two depletion-mode NMOSFETs, and the proposed FA consists of eight TG-SETs, two enhanced-mode NMOSFETs, and two depletion-mode NMOSFETs. The complexities in the HA and the FA are 7 and 12, respectively, and the worst-case delays in the HA and the FA are 1.48 ns and 2.25 ns, respectively. Compared with the conventional CMOS FA with 0.35 microm technology, the proposed FA can be constructed with 0.43 of devices, and can operate with 3.5 of worst-case delay, 1/534 of average power consumption, and 1/152 of power-delay-product (PDP). The proposed HA and FA can be operated as a half-subtractor (HS) and a full-subtractor (FS) in the case when the levels of the control gates in the HA and the FA are fitly determined. The basic operations of the proposed HA and the proposed FA have been successfully confirmed through SPICE circuit simulation based on the physical device model of TG-SETs.

  20. Feasibility analysis of a novel hybrid-type superconducting circuit breaker in multi-terminal HVDC networks

    Science.gov (United States)

    Khan, Umer Amir; Lee, Jong-Geon; Seo, In-Jin; Amir, Faisal; Lee, Bang-Wook

    2015-11-01

    Voltage source converter-based HVDC systems (VSC-HVDC) are a better alternative than conventional thyristor-based HVDC systems, especially for developing multi-terminal HVDC systems (MTDC). However, one of the key obstacles in developing MTDC is the absence of an adequate protection system that can quickly detect faults, locate the faulty line and trip the HVDC circuit breakers (DCCBs) to interrupt the DC fault current. In this paper, a novel hybrid-type superconducting circuit breaker (SDCCB) is proposed and feasibility analyses of its application in MTDC are presented. The SDCCB has a superconducting fault current limiter (SFCL) located in the main current path to limit fault currents until the final trip signal is received. After the trip signal the IGBT located in the main line commutates the current into a parallel line where DC current is forced to zero by the combination of IGBTs and surge arresters. Fault simulations for three-, four- and five-terminal MTDC were performed and SDCCB performance was evaluated in these MTDC. Passive current limitation by SFCL caused a significant reduction of fault current interruption stress in the SDCCB. It was observed that the DC current could change direction in MTDC after a fault and the SDCCB was modified to break the DC current in both the forward and reverse directions. The simulation results suggest that the proposed SDCCB could successfully suppress the DC fault current, cause a timely interruption, and isolate the faulty HVDC line in MTDC.

  1. Circuit-tunable sub-wavelength THz resonators: hybridizing optical cavities and loop antennas.

    Science.gov (United States)

    Paulillo, B; Manceau, J M; Degiron, A; Zerounian, N; Beaudoin, G; Sagnes, I; Colombelli, R

    2014-09-08

    We demonstrate subwavelength electromagnetic resonators operating in the THz spectral range, whose spectral properties and spatial/angular patterns can be engineered in a similar way to an electronic circuit. We discuss the device concept, and we experimentally study the tuning of the resonant frequency as a function of variable capacitances and inductances. We then elucidate the optical coupling properties. The radiation pattern, obtained by angle-resolved reflectance, reveals that the system mainly couples to the outside world via a magnetic dipolar interaction.

  2. Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

    Science.gov (United States)

    Arrese, J.; Vescio, G.; Xuriguera, E.; Medina-Rodriguez, B.; Cornet, A.; Cirera, A.

    2017-03-01

    Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature (˜150 °C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique.

  3. Physical Limitations in Lithography for Microelectronics.

    Science.gov (United States)

    Flavin, P. G.

    1981-01-01

    Describes techniques being used in the production of microelectronics kits which have replaced traditional optical lithography, including contact and optical projection printing, and X-ray and electron beam lithography. Also includes limitations of each technique described. (SK)

  4. Microelectronics to nanoelectronics materials, devices & manufacturability

    CERN Document Server

    Kaul, Anupama B

    2012-01-01

    Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena.Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology's Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and

  5. Health issues in the microelectronics industry.

    Science.gov (United States)

    LaDou, J

    1986-01-01

    Since 1948, when microelectronics entered the American industrial scene, the rapid growth and advancing technology of the industry has caused production facilities to be spread throughout most industrialized areas in the United States. It is now speculated that microelectronics production will be the fourth largest industry in the United States by the end of the century. This article addresses the questions raised about the safety of this industry both for its workers and for the communities in which production facilities are located.

  6. Neuropsychological impairment among former microelectronics workers.

    Science.gov (United States)

    Bowler, R M; Mergler, D; Huel, G; Harrison, R; Cone, J

    1991-01-01

    Although chemicals posing potential neurotoxic hazards are commonly used in the microelectronics industry, there has been no systematic study of possible chronic nervous system effects in microelectronics workers. The objective of the present study was to assess neuropsychological functions of a group of former microelectronics plant assembly workers and a group of referents, using a matched pair design. During employment, the former microelectronics workers had been exposed to multiple organic solvents, including trichloroethylene, xylene, chlorofluorocarbons and trichloroethane. Referents were recruited from the same geographic region. From a pool of 180 former workers and 157 referents, 67 pairs were matched on the basis of age, sex, ethnicity, educational level, sex and number of children. Comparison of results on the subtests of the California Neuropsychological Screening Battery-Revised (CNS-R) revealed significantly lower performance by the former microelectronics workers on tests of attention/concentration, verbal ability, memory functions, visuospatial functions, visuomotor speed, cognitive flexibility, psychomotor speed, and reaction time (t-test for pairs or Wilcoxon Signed Rank p less than 0.05). No significant differences were observed for performance on tests assessing mental status, visual recall, tactile function and learning. This overall pattern of impairment is consistent with organic solvent-related chronic toxic encephalopathy, and possible early stages of dementia. These findings underline the need for more studies among workers currently or previously employed in microelectronics industries.

  7. Integrated microelectronics for smart textiles.

    Science.gov (United States)

    Lauterbach, Christl; Glaser, Rupert; Savio, Domnic; Schnell, Markus; Weber, Werner

    2005-01-01

    The combination of textile fabrics with microelectronics will lead to completely new applications, thus achieving elements of ambient intelligence. The integration of sensor or actuator networks, using fabrics with conductive fibres as a textile motherboard enable the fabrication of large active areas. In this paper we describe an integration technology for the fabrication of a "smart textile" based on a wired peer-to-peer network of microcontrollers with integrated sensors or actuators. A self-organizing and fault-tolerant architecture is accomplished which detects the physical shape of the network. Routing paths are formed for data transmission, automatically circumventing defective or missing areas. The network architecture allows the smart textiles to be produced by reel-to-reel processes, cut into arbitrary shapes subsequently and implemented in systems at low installation costs. The possible applications are manifold, ranging from alarm systems to intelligent guidance systems, passenger recognition in car seats, air conditioning control in interior lining and smart wallpaper with software-defined light switches.

  8. Hybrid Spintronic-CMOS Spiking Neural Network with On-Chip Learning: Devices, Circuits, and Systems

    Science.gov (United States)

    Sengupta, Abhronil; Banerjee, Aparajita; Roy, Kaushik

    2016-12-01

    Over the past decade, spiking neural networks (SNNs) have emerged as one of the popular architectures to emulate the brain. In SNNs, information is temporally encoded and communication between neurons is accomplished by means of spikes. In such networks, spike-timing-dependent plasticity mechanisms require the online programing of synapses based on the temporal information of spikes transmitted by spiking neurons. In this work, we propose a spintronic synapse with decoupled spike-transmission and programing-current paths. The spintronic synapse consists of a ferromagnet-heavy-metal heterostructure where the programing current through the heavy metal generates spin-orbit torque to modulate the device conductance. Low programing energy and fast programing times demonstrate the efficacy of the proposed device as a nanoelectronic synapse. We perform a simulation study based on an experimentally benchmarked device-simulation framework to demonstrate the interfacing of such spintronic synapses with CMOS neurons and learning circuits operating in the transistor subthreshold region to form a network of spiking neurons that can be utilized for pattern-recognition problems.

  9. The Microelectronics Education Programme--Dissemination and Diffusion of Microelectronics Technology in Education.

    Science.gov (United States)

    Milne, J. A.; Anderson, J. S. A.

    1984-01-01

    Describes the Microelectronics Education Programme, a development program which embodies the building of a springboard for the dissemination of microelectronic innovations that will benefit education. Springboard activities discussed in detail include information dissemination through regional information centers, inservice teacher training, and…

  10. Design and Performance Analysis of Hybrid Adders for High Speed Arithmetic Circuit

    Directory of Open Access Journals (Sweden)

    Rajkumar Sarma

    2012-06-01

    Full Text Available Adder cells using Gate Diffusion Technique (GDI & PTL-GDI technique are described in this paper. GDI technique allows reducing power consumption, propagation delay and low PDP (power delay productwhereas Pass Transistor Logic (PTL reduces the count of transistors used to make different logic gates, by eliminating redundant transistors. Performance comparison with various Hybrid Adder is been presented.In this paper, we propose two new designs based on GDI & PTL techniques, which is found to be much more power efficient in comparison with existing design technique. Only 10 transistors are used to implement the SUM & CARRY function for both the designs. The SUM and CARRY cell are implemented in a cascaded way i.e. firstly the XOR cell is implemented and then using XOR as input SUM as well as CARRY cell is implemented. For Proposed GDI adder the SUM as well as CARRY cell is designed using GDI technique. On the other hand in Proposed PTL-GDI adder the SUM cell is constructed using PTL technique and the CARRY cell is designed using GDI technique. The advantages of both the designs are discussed. The significance of these designs is substantiated by the simulation results obtained from Cadence Virtuoso 180 nm environment.

  11. CAD model for circuit parameters of superconducting-based hybrid planar transmission lines

    Energy Technology Data Exchange (ETDEWEB)

    Mohebbi, Hamid Reza; Hamed Majedi, A, E-mail: hmohebbi@maxwell.uwaterloo.c, E-mail: ahmajedi@maxwell.uwaterloo.c [Integrated Quantum Optoelectronics Lab (IQOL), Department of ECE, Institute for Quantum Computing (IQC), University of Waterloo, Waterloo, N2L 3G1 (Canada)

    2009-12-15

    Using the concept of surface impedance associated with a superconductor or normal conductor's plate, we extend the CAD (computer aided design) formalisms on modeling and simulation of superconducting and normal transmission lines (STL and NTL) in order to include hybrid transmission lines (HTL). STL and NTL are entirely made of superconductor or normal conductor materials, respectively. In this paper, HTL refers to a planar transmission line (TL) such as parallel plate (PPTL), microstrip ({mu}TL) and coplanar waveguide (CPW) whose ground plate is superconducting and whose top/center strip is a normal conductor or vice versa. We develop and present a set of closed-form equations in a tidy and succinct form for each configuration (STL, NTL and HTL) for widely-used planar TLs (PPTL, {mu}TL and CPW). They can be easily implemented in a systematic way by the user for the purpose of fast TL design. The results obtained with this CAD tool are compared with previously reported results in the literature, and good agreement is observed.

  12. Micro-Electronic Nose System

    Science.gov (United States)

    Zee, Frank C.

    2011-12-01

    The ability to "smell" various gas vapors and complex odors is important for many applications such as environmental monitoring for detecting toxic gases as well as quality control in the processing of food, cosmetics, and other chemical products for commercial industries. Mimicking the architecture of the biological nose, a miniature electronic nose system was designed and developed consisting of an array of sensor devices, signal-processing circuits, and software pattern-recognition algorithms. The array of sensors used polymer/carbon-black composite thin-films, which would swell or expand reversibly and reproducibly and cause a resistance change upon exposure to a wide variety of gases. Two types of sensor devices were fabricated using silicon micromachining techniques to form "wells" that confined the polymer/carbon-black to a small and specific area. The first type of sensor device formed the "well" by etching into the silicon substrate using bulk micromachining. The second type built a high-aspect-ratio "well" on the surface of a silicon wafer using SU-8 photoresist. Two sizes of "wells" were fabricated: 500 x 600 mum² and 250 x 250 mum². Custom signal-processing circuits were implemented on a printed circuit board and as an application-specific integrated-circuit (ASIC) chip. The circuits were not only able to measure and amplify the small resistance changes, which corresponded to small ppm (parts-per-million) changes in gas concentrations, but were also adaptable to accommodate the various characteristics of the different thin-films. Since the thin-films were not specific to any one particular gas vapor, an array of sensors each containing a different thin-film was used to produce a distributed response pattern when exposed to a gas vapor. Pattern recognition, including a clustering algorithm and two artificial neural network algorithms, was used to classify the response pattern and identify the gas vapor or odor. Two gas experiments were performed, one

  13. Radiation-Induced Prompt Photocurrents in Microelectronics Physics

    CERN Document Server

    Dodd, P E; Buller, D L; Doyle, B L; Vizkelethy, G; Walsh, D S

    2003-01-01

    The effects of photocurrents in nuclear weapons induced by proximal nuclear detonations are well known and remain a serious hostile environment threat for the US stockpile. This report describes the final results of an LDRD study of the physical phenomena underlying prompt photocurrents in microelectronic devices and circuits. The goals of this project were to obtain an improved understanding of these phenomena, and to incorporate improved models of photocurrent effects into simulation codes to assist designers in meeting hostile radiation requirements with minimum build and test cycles. We have also developed a new capability on the ion microbeam accelerator in Sandia's Ion Beam Materials Research Laboratory (the Transient Radiation Microscope, or TRM) to supply ionizing radiation in selected micro-regions of a device. The dose rates achieved in this new facility approach those possible with conventional large-scale dose-rate sources at Sandia such as HERMES III and Saturn. It is now possible to test the phy...

  14. Experimental investigation of single-phase microjet cooling of microelectronics

    Directory of Open Access Journals (Sweden)

    Rusowicz Artur

    2015-09-01

    Full Text Available Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second. While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

  15. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  16. Trusted Defense Microelectronics: Future Access and Capabilities Are Uncertain

    Science.gov (United States)

    2015-10-28

    TRUSTED DEFENSE MICROELECTRONICS Future Access and Capabilities Are Uncertain Statement of Marie A. Mak...1. REPORT DATE OCT 2015 2. REPORT TYPE 3. DATES COVERED 00-00-2015 to 00-00-2015 4. TITLE AND SUBTITLE Trusted Defense Microelectronics ...House of Representatives October 2015 TRUSTED DEFENSE MICROELECTRONICS Future Access and Capabilities Are Uncertain Why GAO Did This Study DOD’s

  17. Hybrid integration of synthesized dielectric image waveguides in substrate integrated circuit technology and its millimeter wave applications

    Science.gov (United States)

    Patrovsky, Andreas

    -band (75 GHz to 110 GHz), a transition from rectangular waveguide to SIIG was developed. Another transition to either microstrip or CPW is essential to enable coplanar probe measurements and to achieve compatibility with monolithic millimeter wave integrated circuits (MMICs). Microstrip and image guide have very different requirements for the substrate thickness, for which reason efforts were concentrated on a wideband transition between the SIIG and CPW. The designed transition shows good broadband performance and minimal radiation loss. Other transitions from the SIIG to the Substrate Integrated Waveguide (SIW) are also presented in the context of substrate integrated circuits (SICs). The latter technology combines planar transmission lines and originally non-planar waveguide structures that are synthesized in planar form on a common substrate. High alignment precision is a direct consequence, which eliminates the necessity for additional tuning. As an open dielectric waveguide technology with very small transmission loss, the SIIG is particularly suitable for antennas and corresponding feed lines. The similarity of the SIIG with other dielectric waveguides and especially with the image guide suggests a knowledge transfer from known dielectric antennas. A planar SIIG rod antenna was designed and fabricated, as a derivative of the established polyrod antenna. The structural shape is simple and compact, and it provides a medium gain in the range of 10 dBi to 15 dBi. A second developed type, an SIIG traveling-wave linear array antenna, is frequency-steerable through broadside due to special radiation elements. The novel design of a slab-mode antenna forms an endfire beam by a planar lens configuration. In addition, all of those dielectric-based antennas are highly efficient. Being synthesized on a planar substrate, the SIIG can be combined in a hybrid way with other waveguide structures on the same substrate in so-called substrate integrated circuits (SICs). It joins the

  18. Analysis of the property of nonlinear hybrid circuit by FDTD%基于FDTD的非线性混合电路特性分析

    Institute of Scientific and Technical Information of China (English)

    梅诣偲; 吴先良; 黄志祥; 鲁思龙; 任信钢; 杜红梅

    2012-01-01

    The full-wave analysis of nonlinear hybrid circuit is made by finite-difference time-domain (FDTD) algorithm, and the electromagnetic field distribution graph of microstrip circuits at different moments is obtained. The simulation result of FDTD method and that of commercial software are highly consistent. With full-wave simulation of electromagnetic field, its calculation results are more accurate than those of traditional circuit simulations, and the field value and distribution of electromagnetic field of microstrip circuits at different moments responding to high-frequency signals can be obtained directly, which has important significance for researching the properties of high-frequency nonlinear hybrid circuits and the problems about electromagnetic compatibility and so on.%文章采用三维时域有限差分(FDTD)方法,对非线性混合电路进行了全波分析,不仅获得不同时刻微带电路平面的电磁场分布图,并且所获得的电压分布图与软件仿真结果高度吻合.由于FDTD是电磁场的全波模拟,所得结果比传统电路模拟精度高且可以得到高频信号激励下微带电路所在平面各个时刻时域内的场解,直接观测到场分布情况,为高频非线性混合电路的特性分析提供了有效依据,同时对研究电磁兼容等问题有重要意义.

  19. CEMA cooperation in microelectronics research, production

    Science.gov (United States)

    1984-03-01

    The assignments resulting from an agreement concerning multilateral specialization and cooperation among European socialist countries in the development and production of microelectronic components for computer technology are enumerated. Several areas which impact directly on the manufacture of large scale and very large scale integrated components are identified.

  20. Visual dysfunction among former microelectronics assembly workers.

    Science.gov (United States)

    Mergler, D; Huel, G; Bowler, R; Frenette, B; Cone, J

    1991-01-01

    Although known neurotoxins with potential ophthalmotoxic properties are commonly used in microelectronics assembly, there has been no systematic study of visual disturbances among past or present workers in this industry. The objective of the present study was to compare visual functions, using a matched-pair design, between former workers from a microelectronics plant and a local reference population. From an initial population of 180 former workers and 157 potential referents, 54 pairs were matched for age (+/- 3 y), education (+/- 2 y), sex, ethnic origin, and number of children. Near and far visual acuity, chromatic discrimination, and near contrast sensitivity were assessed monocularly. Paired comparisons (Signed-rank Wilcoxon test) revealed that the former microelectronics workers had significantly lower contrast sensitivity, particularly in the intermediate frequencies, independently of near visual acuity loss. There were no differences for far visual acuity in both eyes. Even though near visual acuity and color vision were compromised among the former workers, the differences were only significant for one eye, as was the prevalence of acquired dyschromatopsia (chi-square for matched pairs, p less than .001). These findings suggest a pattern of contrast sensitivity deficits consistent with impairment to foveal and/or neuro-optic pathways among these former microelectronics workers. Exposure to ophthalmotoxic chemicals is proposed as the most probable risk factor.

  1. Carbon nanotubes as heat dissipaters in microelectronics

    DEFF Research Database (Denmark)

    Pérez Paz, Alejandro; García-Lastra, Juan María; Markussen, Troels

    2013-01-01

    We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties...

  2. International Conference on Microelectronics, Electromagnetics and Telecommunications

    CERN Document Server

    Rao, N; Kumar, S; Raj, C; Rao, V; Sarma, G

    2016-01-01

    This volume contains 73 papers presented at ICMEET 2015: International Conference on Microelectronics, Electromagnetics and Telecommunications. The conference was held during 18 – 19 December, 2015 at Department of Electronics and Communication Engineering, GITAM Institute of Technology, GITAM University, Visakhapatnam, INDIA. This volume contains papers mainly focused on Antennas, Electromagnetics, Telecommunication Engineering and Low Power VLSI Design.

  3. Failure and Delamination in Microelectronic Packages

    NARCIS (Netherlands)

    Sadeghinia, M.

    2013-01-01

    Thin layers of dissimilar materials are used in most microelectronic components in order to achieve special functional requirements. Generally, the interface between two adjacent materials forms a weak link, not only because of the relatively low delamination strength, but also because of the existi

  4. Fast Qualification Methods for Microelectronic Packages

    NARCIS (Netherlands)

    Ma, X.

    2011-01-01

    This research aims at developing a knowledge based fast qualification method for moisture or thermally induced failure in microelectronic packages. Driven by the market competition and the need for shorter time to market, fast qualification tests are becoming more and more important for the industry

  5. Evaluation of 320x240 pixel LEC GaAs Schottky barrier X-ray imaging arrays, hybridized to CMOS readout circuit based on charge integration

    CERN Document Server

    Irsigler, R; Alverbro, J; Borglind, J; Froejdh, C; Helander, P; Manolopoulos, S; O'Shea, V; Smith, K

    1999-01-01

    320x240 pixels GaAs Schottky barrier detector arrays were fabricated, hybridized to silicon readout circuits, and subsequently evaluated. The detector chip was based on semi-insulating LEC GaAs material. The square shaped pixel detector elements were of the Schottky barrier type and had a pitch of 38 mu m. The GaAs wafers were thinned down prior to the fabrication of the ohmic back contact. After dicing, the chips were indium bump, flip-chip bonded to CMOS readout circuits based on charge integration, and finally evaluated. A bias voltage between 50 and 100 V was sufficient to operate the detector. Results on I-V characteristics, noise behaviour and response to X-ray radiation are presented. Images of various objects and slit patterns were acquired by using a standard dental imaging X-ray source. The work done was a part of the XIMAGE project financed by the European Community (Brite-Euram). (author)

  6. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-05-19

    Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

  7. Four Quadrant Chopper Drive with Specialized Integrated Circuits

    Directory of Open Access Journals (Sweden)

    Alexandru Morar

    2009-12-01

    Full Text Available The paper presents a high performance system for separately-excited D.C. motor control, which was designed and performed with a specialized integrated circuit (L292, made by SGS-THOMSON Microelectronics Company. With an interface and an adequate software, L292 circuit can be used as a chopper in 2 or 4 quadrant.

  8. Four Quadrant Chopper Drive with Specialized Integrated Circuits

    OpenAIRE

    Alexandru Morar

    2009-01-01

    The paper presents a high performance system for separately-excited D.C. motor control, which was designed and performed with a specialized integrated circuit (L292), made by SGS-THOMSON Microelectronics Company. With an interface and an adequate software, L292 circuit can be used as a chopper in 2 or 4 quadrant.

  9. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  10. Laser processing of ceramics for microelectronics manufacturing

    Science.gov (United States)

    Sposili, Robert S.; Bovatsek, James; Patel, Rajesh

    2017-03-01

    Ceramic materials are used extensively in the microelectronics, semiconductor, and LED lighting industries because of their electrically insulating and thermally conductive properties, as well as for their high-temperature-service capabilities. However, their brittleness presents significant challenges for conventional machining processes. In this paper we report on a series of experiments that demonstrate and characterize the efficacy of pulsed nanosecond UV and green lasers in machining ceramics commonly used in microelectronics manufacturing, such as aluminum oxide (alumina) and aluminum nitride. With a series of laser pocket milling experiments, fundamental volume ablation rate and ablation efficiency data were generated. In addition, techniques for various industrial machining processes, such as shallow scribing and deep scribing, were developed and demonstrated. We demonstrate that lasers with higher average powers offer higher processing rates with the one exception of deep scribes in aluminum nitride, where a lower average power but higher pulse energy source outperformed a higher average power laser.

  11. Toward atom probe tomography of microelectronic devices

    Science.gov (United States)

    Larson, D. J.; Lawrence, D.; Lefebvre, W.; Olson, D.; Prosa, T. J.; Reinhard, D. A.; Ulfig, R. M.; Clifton, P. H.; Bunton, J. H.; Lenz, D.; Olson, J. D.; Renaud, L.; Martin, I.; Kelly, T. F.

    2011-11-01

    Atom probe tomography and scanning transmission electron microscopy has been used to analyze a commercial microelectronics device prepared by depackaging and focused ion beam milling. Chemical and morphological data are presented from the source, drain and channel regions, and part of the gate oxide region of an Intel® i5-650 p-FET device demonstrating feasibility in using these techniques to investigate commercial chips.

  12. Environmental health aspects of the microelectronics industry.

    Science.gov (United States)

    Himmelstein, J S; Levy, B S

    1986-01-01

    This article reviews examples of contamination to the surface or groundwater, the ambient air, and soil resulting from the microelectronics industry. The potential effects on human health arising from such environmental contamination are discussed, as well as aspects of their diagnosis, treatment, and related public health implications. Given the high costs of pollution control, the emphasis must be on prevention, which can be facilitated by a high level of suspicion and by the design of safety and pollution control into manufacturing processes.

  13. SYNTHESIS AND APPLICATIONS OF NANOMATERIALS IN MICROELECTRONICS

    Institute of Scientific and Technical Information of China (English)

    2000-01-01

    IntroductionThe rapid development of microelectronics andtelecommunication industry in the last few years haspresented enormous opportllnities and challenges forchemical engineers and material scientists alike. Thefuture of all electronic devices is cheaped, lighted,smaller and more reliable. This development requiresfinely engineered materials.The field of engineering hi-tech materials is abroad and interdisciplinary area with extensiveworldwide research and development. Chemicalengineers, materials scient...

  14. Multi-format all-optical processing based on a large-scale, hybridly integrated photonic circuit.

    Science.gov (United States)

    Bougioukos, M; Kouloumentas, Ch; Spyropoulou, M; Giannoulis, G; Kalavrouziotis, D; Maziotis, A; Bakopoulos, P; Harmon, R; Rogers, D; Harrison, J; Poustie, A; Maxwell, G; Avramopoulos, H

    2011-06-01

    We investigate through numerical studies and experiments the performance of a large scale, silica-on-silicon photonic integrated circuit for multi-format regeneration and wavelength-conversion. The circuit encompasses a monolithically integrated array of four SOAs inside two parallel Mach-Zehnder structures, four delay interferometers and a large number of silica waveguides and couplers. Exploiting phase-incoherent techniques, the circuit is capable of processing OOK signals at variable bit rates, DPSK signals at 22 or 44 Gb/s and DQPSK signals at 44 Gbaud. Simulation studies reveal the wavelength-conversion potential of the circuit with enhanced regenerative capabilities for OOK and DPSK modulation formats and acceptable quality degradation for DQPSK format. Regeneration of 22 Gb/s OOK signals with amplified spontaneous emission (ASE) noise and DPSK data signals degraded with amplitude, phase and ASE noise is experimentally validated demonstrating a power penalty improvement up to 1.5 dB.

  15. A hybrid pulse combining topology utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer.

    Science.gov (United States)

    Li, Jiangtao; Zhao, Zheng; Sun, Yi; Liu, Yuhao; Ren, Ziyuan; He, Jiaxin; Cao, Hui; Zheng, Minjun

    2017-03-01

    Numerous applications driven by pulsed voltage require pulses to be with high amplitude, high repetitive frequency, and narrow width, which could be satisfied by utilizing avalanche transistors. The output improvement is severely limited by power capacities of transistors. Pulse combining is an effective approach to increase the output amplitude while still adopting conventional pulse generating modules. However, there are drawbacks in traditional topologies including the saturation tendency of combining efficiency and waveform oscillation. In this paper, a hybrid pulse combining topology was adopted utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer. The factors affecting the combining efficiency were determined including the output time synchronization of Marx circuits, and the quantity and position of magnetic cores. The numbers of the parallel modules and the stages were determined by the output characteristics of each combining method. Experimental results illustrated the ability of generating pulses with 2-14 kV amplitude, 7-11 ns width, and a maximum 10 kHz repetitive rate on a matched 50-300 Ω resistive load. The hybrid topology would be a convinced pulse combining method for similar nanosecond pulse generators based on the solid-state switches.

  16. A hybrid pulse combining topology utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer

    Science.gov (United States)

    Li, Jiangtao; Zhao, Zheng; Sun, Yi; Liu, Yuhao; Ren, Ziyuan; He, Jiaxin; Cao, Hui; Zheng, Minjun

    2017-03-01

    Numerous applications driven by pulsed voltage require pulses to be with high amplitude, high repetitive frequency, and narrow width, which could be satisfied by utilizing avalanche transistors. The output improvement is severely limited by power capacities of transistors. Pulse combining is an effective approach to increase the output amplitude while still adopting conventional pulse generating modules. However, there are drawbacks in traditional topologies including the saturation tendency of combining efficiency and waveform oscillation. In this paper, a hybrid pulse combining topology was adopted utilizing the combination of modularized avalanche transistor Marx circuits, direct pulse adding, and transmission line transformer. The factors affecting the combining efficiency were determined including the output time synchronization of Marx circuits, and the quantity and position of magnetic cores. The numbers of the parallel modules and the stages were determined by the output characteristics of each combining method. Experimental results illustrated the ability of generating pulses with 2-14 kV amplitude, 7-11 ns width, and a maximum 10 kHz repetitive rate on a matched 50-300 Ω resistive load. The hybrid topology would be a convinced pulse combining method for similar nanosecond pulse generators based on the solid-state switches.

  17. Electromigration of intergranular voids in metal films for microelectronic interconnects

    CERN Document Server

    Averbuch, A; Ravve, I

    2003-01-01

    Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

  18. A Vacuum Microelectronic Pressure Sensor Array Integrated with Temperature Sensor

    Institute of Scientific and Technical Information of China (English)

    SU Jie; XIA Shanhong; CHEN Shaofeng

    2001-01-01

    This paper presents a microsystemthat integrates a Vacuum Microelectronic pressuresensor array with a temperature sensor. The Vac-uum Microelectronic pressure sensor array consists of4 × 4 sensing elements. The temperature sensor is aPt-thin-film resistor. Computer aided design is usedto optimize the structure.

  19. Microelectronics and Special Education. CET/MEP Information Sheet.

    Science.gov (United States)

    Council for Educational Technology, London (England).

    Used as an additional aid by the teacher, microelectronics can assist mentally and physically handicapped children to meet educational objectives that have been specifically agreed upon for the individual child. Microelectronics can help deaf children develop speech production, communication skills, and grammar and sentence construction;…

  20. Moving Education and Its Administration into the Microelectronic Age.

    Science.gov (United States)

    Culbertson, Jack A.

    Education is in transition between the ascendent microelectronic and descendent industrial revolutions, with purposes ambiguously linked to both. These purposes must be clarified before educational leaders can establish priorities for adapting education to the needs of a society transformed by microelectronic technology. Accordingly, the features…

  1. Microelectronics in the Curriculum--The Science Teacher's Contribution.

    Science.gov (United States)

    Association for Science Education, Cambridge (England).

    Rapid advances in microelectronics over the past few years have generally been beneficial, but they have also created some problems, and questions must be asked about the philosophy for including aspects of the new technology in the school curriculum. This statement, prepared by the Microelectronics and Science Education Subcommittee of the…

  2. Microelectronics effects as seen on CRRES.

    Science.gov (United States)

    Mullen, E G; Ray, K P

    1994-10-01

    A MicroElectronics Test Package (MEP) measured total dose degradation and single event upsets (SEUs) on 60 device types on the Combined Release and Radiation Effects Satellite (CRRES) in an 18 degrees inclination orbit between 350 km and 36000 km from July 1990 to October 1991. Simultaneous measurements of the high energy particle environment were used to make a direct cause and effect comparison of the energetic particle backgrounds and microelectronic performance characteristics. The galactic cosmic ray background for the period of the CRRES mission was at a minimum. The SEUs experienced from the cosmic ray background were correspondingly few in number, but surprisingly produced an equal probability of upset over an L-shell range of 8.5 Earth radii (RE) down to less than 3.0 RE. Cosmic ray induced upset frequencies in proton sensitive chips were over 2 orders of magnitude lower than those produced by protons in the heart of the inner proton radiation belts. Multiple upsets, those produced when a single particle upsets more than one memory location, were just as common from protons as from cosmic rays.

  3. Sub-Shot Noise Power Source for Microelectronics

    Science.gov (United States)

    Strekalov, Dmitry V.; Yu, Nan; Mansour, Kamjou

    2011-01-01

    Low-current, high-impedance microelectronic devices can be affected by electric current shot noise more than they are affected by Nyquist noise, even at room temperature. An approach to implementing a sub-shot noise current source for powering such devices is based on direct conversion of amplitude-squeezed light to photocurrent. The phenomenon of optical squeezing allows for the optical measurements below the fundamental shot noise limit, which would be impossible in the domain of classical optics. This becomes possible by affecting the statistical properties of photons in an optical mode, which can be considered as a case of information encoding. Once encoded, the information describing the photon (or any other elementary excitations) statistics can be also transmitted. In fact, it is such information transduction from optics to an electronics circuit, via photoelectric effect, that has allowed the observation of the optical squeezing. It is very difficult, if not technically impossible, to directly measure the statistical distribution of optical photons except at extremely low light level. The photoelectric current, on the other hand, can be easily analyzed using RF spectrum analyzers. Once it was observed that the photocurrent noise generated by a tested light source in question is below the shot noise limit (e.g. produced by a coherent light beam), it was concluded that the light source in question possess the property of amplitude squeezing. The main novelty of this technology is to turn this well-known information transduction approach around. Instead of studying the statistical property of an optical mode by measuring the photoelectron statistics, an amplitude-squeezed light source and a high-efficiency linear photodiode are used to generate photocurrent with sub-Poissonian electron statistics. By powering microelectronic devices with this current source, their performance can be improved, especially their noise parameters. Therefore, a room-temperature sub

  4. A Flexible Power Control Method of VSC-HVDC Link for the Enhancement of Effective Short-Circuit Ratio in a Hybrid Multi-Infeed HVDC System

    DEFF Research Database (Denmark)

    Liu, Yan; Chen, Zhe

    2013-01-01

    With the emerging use of voltage source converter high voltage direct current (VSC-HVDC) links, the hybrid multi-infeed HVDC (HMIDC) system that includes the line commutated converter (LCC) HVDC and the VSC-HVDC links is becoming a promising power transmission structure in the modern power systems....... To evaluate the contribution of the VSC-HVDC link on the voltage stability of HMIDC system, this paper proposes an effective short circuit ratio (ESCR) calculation method. Through the calculation, the voltage support capability of the VSC-HVDC link can be quantitatively represented by the ESCR. Furthermore......, based on the calculation results, a flexible power control strategy for the VSC-HVDC link is developed to provide maximum reactive power support under grid faults. The theoretical analysis of the HMIDC system is based on the Danish transmission grid, evaluated through PSCAD simulations under different...

  5. Improved performance of Li-ion cells under pulsed load using double-layer capacitors in a hybrid circuit mode

    Energy Technology Data Exchange (ETDEWEB)

    ROTH,EMANUEL P.; NAGASUBRAMANIAN,GANESAN

    2000-02-07

    Electrical characteristics of hybrid power sources consisting of Li-ion cells and double-layer capacitors were studied at 25 C and {minus}20 C. The cells were initially evaluated for pulse performance and then measured in hybrid modes of operation where they were coupled with the high-power capacitors. Cells manufactured by Panasonic measured at 25 C delivered full capacities of 0.76 Ah for pulses up to 3A and cells from A and T delivered full capacities of 0.73 Ah for pulses up to 4A. Measured cell resistances were 0.15 ohms and 0.12 ohms, respectively. These measurements were repeated at {minus}20 C. Direct coupling of the cells and capacitors (coupled hybrid) using 10F Panasonic capacitors in a 8F series/parallel combination extended the full capacity pulse limits (3.0V threshold) to 5.6A for the Panasonic cells and to 9A for the A and T cells. A similar arrangement using 100F capacitors from Elna in a 60F combination increased the Panasonic cell limit to 10 A. Operation in an uncoupled hybrid mode using uncoupled cell/capacitor discharge allowed fill cell capacity usage at 25 C up to the capacitor discharge limit and showed a factor of 5 improvement in delivered capacity at {minus}20 C.

  6. Microelectronic neural bridge for signal regeneration and function rebuilding over two separate nerves

    Energy Technology Data Exchange (ETDEWEB)

    Shen Xiaoyan; Wang Zhigong; Xie Shushan; Huang Zonghao [Institute of RF- and OE-ICs, Southeast University, Nanjing 210096 (China); Lue Xiaoying, E-mail: zgwang@seu.edu.cn [Key Laboratory of Bioelectronics, Southeast University, Nanjing 210096 (China)

    2011-06-15

    According to the feature of neural signals, a micro-electronic neural bridge (MENB) has been designed. It consists of two electrode arrays for neural signal detection and functional electrical stimulation (FES), and a microelectronic circuit for signal amplifying, processing, and FES driving. The core of the system is realized in 0.5-{mu}m CMOS technology and used in animal experiments. A special experimental strategy has been designed to demonstrate the feasibility of the system. With the help of the MENB, the withdrawal reflex function of the left/right leg of one spinal toad has been rebuilt in the corresponding leg of another spinal toad. According to the coherence analysis between the source and regenerated neural signals, the controlled spinal toad's sciatic nerve signal is delayed by 0.72 ms in relation to the sciatic nerve signal of the source spinal toad and the cross-correlation function reaches a value of 0.73. This shows that the regenerated signal is correlated with the source sciatic signal significantly and the neural activities involved in reflex function have been regenerated. The experiment demonstrates that the MENB is useful in rebuilding the neural function between nerves of different bodies. (semiconductor integrated circuits)

  7. Liver enzymes among microelectronics equipment maintenance technicians.

    Science.gov (United States)

    Upfal, M

    1992-04-01

    Equipment maintenance workers within the microelectronics industry have opportunities for occupational exposure to a variety of toxic agents. This pilot investigation compares liver enzymes in this population with that of other coworkers. Participants (n = 135) were randomly selected from a medical surveillance program at the manufacturing facility. Nine job categories were examined, including equipment maintenance workers and electronic technicians. Although abnormal liver enzymes were detected among equipment maintenance workers (odds ratio 16.4; P less than .008) and electronic technicians (odds ratio 27; P less than .0005), the numbers of participants were small (n = 8, 10). The data suggest that independent and/or interactive etiologic roles of occupation and alcohol should be further investigated. Early detection of subclinical occupational or recreational hepatotoxicity with appropriate employment of industrial hygiene control technology and/or the reduction of alcohol consumption may provide a means of preventing liver disease.

  8. Dimensionally Stable Poyimide Copolymers for Microelectronics Applications

    Science.gov (United States)

    Fay, Catherine C.; St.Clair, Anne K.

    1998-01-01

    Polyimides are finding increased applications in microelectronics due to their high thermal stability, good chemical resistance, good adhesion, low moisture absorption, good mechanical properties, and low coefficient of thermal expansion (CTE). Four series of random copolyimides were synthesized and characterized for potential application as encapsulants, stress-relief layers, and interlevel dielectrics. Several candidates exhibited good combinations of physical and mechanical properties with inherent viscosities from 1.21 to 1.42 dL/g, T(sub g)'s ranging from 251 to 277 C, 10% weight loss temperatures between 503 and 527 C, and CTEs ranging from 33 to 39 ppm/deg C. Mechanical properties at room temperature for the best candidates included tensile strengths of 17.8-21.3 ksi, moduli between 388 and 506 ksi, and elongations of 11-43%. Moisture absorption for these copolyimides ranged between 0.85 and 1.38 wt %.

  9. Nanocharacterization Challenges in a Changing Microelectronics Landscape

    Science.gov (United States)

    Brilloüt, Michel

    2011-11-01

    As the microelectronics industry enters the "nano"-era new challenges emerge. Traditional scaling of the MOS transistor faces major obstacles in fulfilling "Moore's law". New features like strain and new materials (e.g. high k—metal gate stack) are introduced in order to sustain performance increases. For a better electrostatic control, devices will use the third dimension, e.g., in gate-all-around nanowire structures. Due to the escalating cost and complexity of sub-28 nm technologies fewer industrial players can afford the development and production of advanced CMOS processes and many companies acknowledge the fact that the value in products can also be obtained in using more diversified non-digital technologies (the so-called "More-than-Moore" domain). This evolving landscape brings new requirements—discussed in this paper—in terms of physical characterization of technologies and devices.

  10. Polymer brush and inorganic oxide hybrid nanodielectrics for high performance organic transistors.

    Science.gov (United States)

    Li, Liqiang; Hu, Wenping; Chi, Lifeng; Fuchs, Harald

    2010-04-29

    A novel covalence-linked PMMA-SiO(2) hybrid nanodielectrics was prepared by grafting approximately 10 nm PMMA brush onto the SiO(2) (approximately 9 nm) surface, which effectively combines the respective merits of PMMA and SiO(2). As a result, the hybrid nanodielectrics exhibit excellent dielectric performance (e.g., low leakage density (<10(-7) A/cm(2) at 6 MV/cm), high breakdown voltage (7 MV/cm), high capacitance (142 nF/cm(2)), good operational stability, and good compatibility with organic semiconductors), and enable organic field-effect transistors (OFETs) to work with high performance and low voltage. These results may open a way to build ultrathin dielectrics for high performance transistor and circuit, as well as for microelectronics, nanoelectronics, and organic electronics.

  11. Future trends in microelectronics journey into the unknown

    CERN Document Server

    Xu, Jimmy; Zaslavsky, Alexander

    2016-01-01

    Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals. The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities.

  12. The International Implications of the Development of Microelectronics.

    Science.gov (United States)

    Sieghart, Paul

    1981-01-01

    Synthesizes issues covered at a conference on microelectronics: production, productivity, and employment; social implications; market mechanisms v government intervention; the role of national governments; data protection laws; and cultural pollution. (SW)

  13. The Unilab Blue Chip Range for Introducing Microelectronics.

    Science.gov (United States)

    Jarvis, W. H.

    1981-01-01

    Discusses various topics in microelectronics to aid those teaching modern electronics for the first time, including, among others, the slang name "micro," attitudes of examining boards, rapid obsolescence of electronic devices, costs, analog systems, and digital systems. (SK)

  14. Virtual thermo-mechanical prototyping of microelectronics devices

    NARCIS (Netherlands)

    Van Driel, W.D.

    2007-01-01

    Microelectronics have pervaded our lives for the past fifty years, with massive penetration into health, mobility, safety and security, communications, education, entertainment and virtually every aspect of human lives. The main technology drivers that enabled this expansion are miniaturization and

  15. Reliability and qualification of advanced microelectronics for space applications

    Science.gov (United States)

    Kayali, S.

    2003-01-01

    This paper provides a discussion of the subject and an approach to establish a reliability and qualification methodology to facilitate the utilization of state-of-the-art advanced microelectronic devices and structures in high reliability applications.

  16. Hybrid complementary circuits based on p-channel organic and n-channel metal oxide transistors with balanced carrier mobilities of up to 10 cm2/Vs

    KAUST Repository

    Isakov, Ivan

    2016-12-29

    We report the development of hybrid complementary inverters based on p-channel organic and n-channel metal oxide thin-film transistors (TFTs) both processed from solution at <200 °C. For the organic TFTs, a ternary blend consisting of the small-molecule 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene, the polymer indacenodithiophene-benzothiadiazole (CIDT-BT) and the p-type dopant CF was employed, whereas the isotype InO/ZnO heterojunction was used for the n-channel TFTs. When integrated on the same substrate, p- and n-channel devices exhibited balanced carrier mobilities up to 10 cm/Vs. Hybrid complementary inverters based on these devices show high signal gain (>30 V/V) and wide noise margins (70%). The moderate processing temperatures employed and the achieved level of device performance highlight the tremendous potential of the technology for application in the emerging sector of large-area microelectronics.

  17. Approximation for Transient of Nonlinear Circuits Using RHPM and BPES Methods

    Directory of Open Access Journals (Sweden)

    H. Vazquez-Leal

    2013-01-01

    Full Text Available The microelectronics area constantly demands better and improved circuit simulation tools. Therefore, in this paper, rational homotopy perturbation method and Boubaker Polynomials Expansion Scheme are applied to a differential equation from a nonlinear circuit. Comparing the results obtained by both techniques revealed that they are effective and convenient.

  18. A microelectronics approach for the ROSETTA surface science package

    Science.gov (United States)

    Sandau, Rainer (Editor); Alkalaj, Leon

    1996-01-01

    In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

  19. 1998 technology roadmap for integrated circuits used in critical applications

    Energy Technology Data Exchange (ETDEWEB)

    Dellin, T.A.

    1998-09-01

    Integrated Circuits (ICs) are being extensively used in commercial and government applications that have extreme consequences of failure. The rapid evolution of the commercial microelectronics industry presents serious technical and supplier challenges to this niche critical IC marketplace. This Roadmap was developed in conjunction with the Using ICs in Critical Applications Workshop which was held in Albuquerque, NM, November 11--12, 1997.

  20. Health hazards in the microelectronics industry.

    Science.gov (United States)

    Geiser, K

    1986-01-01

    The microelectronics industry is explored as a source of occupational health hazards resulting from the extensive use of toxic chemicals in the production of semiconductor chips and the assembly of electronic components. Information is provided on the range of chemicals used in the industry and their particular health implications. Case materials are drawn from Massachusetts' "Route 128" region and California's "Silicon Valley." Problems with worker exposure in the plants are compared with the risks experienced by residents of local neighborhoods from the leakage of industrial chemicals from underground storage tanks into the local groundwater used for drinking water. The recent development of the industry, its highly innovative character, the absence of unions and organizations for worker protection, and the persistence of a public perception that the industry is relatively safe and clean, are all identified as determinants of the extent of health hazards posed by chemical exposure. The paper concludes with recommendations for further studies, worker organization, and increased attention to the reduction of the volume and toxicity of chemicals in industrial production.

  1. Chemical Mechanical Planarization (CMP) for Microelectronic Applications

    Institute of Scientific and Technical Information of China (English)

    Li Yuzhuo

    2004-01-01

    Surface planarity is of paramount importance in microelectronics. Chemical Mechanical Polishing (CMP) is the most viable approach to address the planarity issues during the fabrication of advanced semiconductor devices. With the integration of copper as interconnect and low k materials as dielectric, the CMP community is facing an ever increasing demand on reducing defectivity without scarifying production throughput. Key issues in CMP today include reduction of surface defectivity and enhancement of planarization efficiency. More specifically, the polished surface should be free of defects such as scratches, pits, corrosion spots, and residue particles. To accomplish these goals, we have investigated a wide range of pathways including reduction of oversized particles,use of unique abrasives such as functionalized nanoparticles, and development of polishing solution without abrasive particles.In this presentation, some fundamental aspects of the CMP process will be given first.Several academic and industrial examples will be used to illustrate the issues and challenges during the implementation of various slurry designs into the CMP processes.

  2. Mechanical Fault Diagnosis of High Voltage Circuit Breakers with Unknown Fault Type Using Hybrid Classifier Based on LMD and Time Segmentation Energy Entropy

    Directory of Open Access Journals (Sweden)

    Nantian Huang

    2016-09-01

    Full Text Available In order to improve the identification accuracy of the high voltage circuit breakers’ (HVCBs mechanical fault types without training samples, a novel mechanical fault diagnosis method of HVCBs using a hybrid classifier constructed with Support Vector Data Description (SVDD and fuzzy c-means (FCM clustering method based on Local Mean Decomposition (LMD and time segmentation energy entropy (TSEE is proposed. Firstly, LMD is used to decompose nonlinear and non-stationary vibration signals of HVCBs into a series of product functions (PFs. Secondly, TSEE is chosen as feature vectors with the superiority of energy entropy and characteristics of time-delay faults of HVCBs. Then, SVDD trained with normal samples is applied to judge mechanical faults of HVCBs. If the mechanical fault is confirmed, the new fault sample and all known fault samples are clustered by FCM with the cluster number of known fault types. Finally, another SVDD trained by the specific fault samples is used to judge whether the fault sample belongs to an unknown type or not. The results of experiments carried on a real SF6 HVCB validate that the proposed fault-detection method is effective for the known faults with training samples and unknown faults without training samples.

  3. Control Strategy and Experimental Study of Hybrid HVDC Circuit Breaker%混合式高压直流断路器的控制策略与实验研究

    Institute of Scientific and Technical Information of China (English)

    杜翼; 江道灼; 陈可; 王玉芬; 尹瑞; 张弛

    2014-01-01

    现有的高压直流断路器能够在几十ms内断开电路,但对于高压直流输电系统,远不能达到要求。基于半导体的高压直流断路器能克服动作速度上的问题,但需要大量电力电子开关器件串并联,有很高的技术难度,同时会产生大量损耗。为了克服上述缺点,采用一种混合式高压直流断路器的拓扑结构。首先介绍了断路器开通和关断的原理,接着提出一种故障预处理的控制策略,在故障发生时提前进行换流,从而缩短故障发生后线路开断的时间;最后利用PSCAD进行建模仿真,制作了单元样机进行降压实验。仿真和实验结果证明:在系统发生短路的情况下,混合式直流断路器能够快速开断短路电流,还可以在直流线路分断后为直流线路及负载中储存的能量提供释放回路。%Existing HVDC circuit breakers are capable of interrupting HVDC currents within several tens of milliseconds, but this is too slow to fulfill the requirements of a reliable HVDC grid.HVDC breakers based on semiconductors can easily overcome the limitations of operating speed,but need large number of the series (parallel ) connection of electronic switching devices;at the same time, it requires high technology and generates a lot of loss. To overcome these shortcomings,a topology of hybrid HVDC circuit breaker was introduced.Firstly,this paper described the principle of hybrid HVDC circuit breaker;then a control strategy of fault pretreatment was also proposed,that was the pre-action of the converter when fault occurred,in order to improve the breaking speed of the hybrid circuit breaker;at last the modeling and simulation were carried out on the hybrid HVDC circuit breaker by PSCAD,and unit prototype was made for the step-down experiments.The simulation and experimental results prove that:when a short circuit occurs,the hybrid HVDC circuit breaker can quickly break the short-circuit current

  4. Implementation of Microelectronics Track in Electronics Engineering in a Philippines State University

    Directory of Open Access Journals (Sweden)

    Gil B. Barte

    2015-11-01

    Full Text Available The evolving trends in electronics continuous to attract students to take upElectronics Engineering.However, it also adds to discipline implementation complexities.Institutions of Higher Learning offering this program must adapt to this realities to avoid obsolescence. This paper looked at Batangas State University, in the Philippines,ongoingimplementation of the Microelectronics track under the Electronics Engineering (ECEProgram. It describes the restructuring done to the ECE curriculum to overcome the enormous complexity inherent in microelectronics design and the teaching pedagogy adopted to promote active learning. The ongoing program has produced encouraging outcomes:1students were able to design, and simulate complex gate CMOS circuits using EDA tools, in the four(4 course electives identified for the track; 2 the culture of independent learning among students improvement in students soft skills, communication skills, time-management and teamwork skill,; 3. useof free and web-based tools overcome the issue of high cost of license for EDA tools and seminar/training for continuous upgrading of faculty. Another encouraging outcome was the acceptance of the student-centered teaching approach used, Problem-Based Learning (PBL,in enhancing the students learning experience.

  5. Microelectronic neural bridge for signal regeneration and function rebuilding over two separate nerves*

    Institute of Scientific and Technical Information of China (English)

    Shen Xiaoyan; Wang Zhigong; Lü Xiaoying; Xie Shushan; Huang Zonghao

    2011-01-01

    According to the feature of neural signals, a micro-electronic neural bridge (MENB) has been designed.It consists of two electrode arrays for neural signal detection and functional electrical stimulation (FES), and a microelectronic circuit for signal amplifying, processing, and FES driving. The core of the system is realized in 0.5-μm CMOS technology and used in animal experiments. A special experimental strategy has been designed to demonstrate the feasibility of the system. With the help of the MENB, the withdrawal reflex function of the left/right leg of one spinal toad has been rebuilt in the corresponding leg of another spinal toad. According to the coherence analysis between the source and regenerated neural signals, the controlled spinal toad's sciatic nerve signal is delayed by 0.72 ms in relation to the sciatic nerve signal of the source spinal toad and the cross-correlation function reaches a value of 0.73. This shows that the regenerated signal is correlated with the source sciatic signal significantly and the neural activities involved in reflex function have been regenerated. The experiment demonstrates that the MENB is useful in rebuilding the neural function between nerves of different bodies.

  6. Plan for advanced microelectronics processing technology application

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  7. GeNeDA: An Open-Source Workflow for Design Automation of Gene Regulatory Networks Inspired from Microelectronics.

    Science.gov (United States)

    Madec, Morgan; Pecheux, François; Gendrault, Yves; Rosati, Elise; Lallement, Christophe; Haiech, Jacques

    2016-10-01

    The topic of this article is the development of an open-source automated design framework for synthetic biology, specifically for the design of artificial gene regulatory networks based on a digital approach. In opposition to other tools, GeNeDA is an open-source online software based on existing tools used in microelectronics that have proven their efficiency over the last 30 years. The complete framework is composed of a computation core directly adapted from an Electronic Design Automation tool, input and output interfaces, a library of elementary parts that can be achieved with gene regulatory networks, and an interface with an electrical circuit simulator. Each of these modules is an extension of microelectronics tools and concepts: ODIN II, ABC, the Verilog language, SPICE simulator, and SystemC-AMS. GeNeDA is first validated on a benchmark of several combinatorial circuits. The results highlight the importance of the part library. Then, this framework is used for the design of a sequential circuit including a biological state machine.

  8. Hybrid III-V/silicon lasers

    Science.gov (United States)

    Kaspar, P.; Jany, C.; Le Liepvre, A.; Accard, A.; Lamponi, M.; Make, D.; Levaufre, G.; Girard, N.; Lelarge, F.; Shen, A.; Charbonnier, P.; Mallecot, F.; Duan, G.-H.; Gentner, J.-.; Fedeli, J.-M.; Olivier, S.; Descos, A.; Ben Bakir, B.; Messaoudene, S.; Bordel, D.; Malhouitre, S.; Kopp, C.; Menezo, S.

    2014-05-01

    The lack of potent integrated light emitters is one of the bottlenecks that have so far hindered the silicon photonics platform from revolutionizing the communication market. Photonic circuits with integrated light sources have the potential to address a wide range of applications from short-distance data communication to long-haul optical transmission. Notably, the integration of lasers would allow saving large assembly costs and reduce the footprint of optoelectronic products by combining photonic and microelectronic functionalities on a single chip. Since silicon and germanium-based sources are still in their infancy, hybrid approaches using III-V semiconductor materials are currently pursued by several research laboratories in academia as well as in industry. In this paper we review recent developments of hybrid III-V/silicon lasers and discuss the advantages and drawbacks of several integration schemes. The integration approach followed in our laboratory makes use of wafer-bonded III-V material on structured silicon-on-insulator substrates and is based on adiabatic mode transfers between silicon and III-V waveguides. We will highlight some of the most interesting results from devices such as wavelength-tunable lasers and AWG lasers. The good performance demonstrates that an efficient mode transfer can be achieved between III-V and silicon waveguides and encourages further research efforts in this direction.

  9. High reliability plastic packaging for microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Sweet, J.N.; Peterson, D.W.; Hsia, A.H.; Tuck, M.

    1997-07-01

    Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technologies. Circuits were demonstrated for measuring Au-Al wirebond and Al metal corrosion failure rates during accelerated temperature and humidity testing. The test circuits on the ATC02.5 chip were very sensitive to extrinsic or processing induced failure rates. Accelerated aging experiments were conducted with unpassivated triple track Al structures on the ATC02.6 chip; the unpassivated tracks were found to be very sensitive to particulate contamination. Some modifications to existing circuitry were suggested. The piezoresistive stress sensing circuitry designed for the ATC04 test chip was found suitable for determining the change in the state of mechanical stress at the die when both initial and final measurements were made near room temperature (RT). Attempt to measure thermal stress between RT and a typical polymer glass transition temperature failed because of excessive die resistor- substrate leakage currents at the high temperature end; suitable circuitry changes were developed to overcome this problem. One temperature and humidity experiment was conducted with Sandia developed static radom access memory parts to examine non-corrosion CMOS failures; this objective was not achieved, but corrosion failure at the metal to Si contacts on the die surface could be detected. This 2-year effort resulted in new designs for test circuits which could be used on an advanced ATC for reliability assessment in Defense Programs electronics development projects.

  10. Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

    Science.gov (United States)

    Ramesham, Rajeshuni

    2000-01-01

    MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed

  11. Symmetric miniaturized heating system for active microelectronic devices

    Science.gov (United States)

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 °C when the oven operates at 200 °C. The minioven can heat packages from room temperature up to 200 °C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 °C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to

  12. Symmetric miniaturized heating system for active microelectronic devices.

    Science.gov (United States)

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The

  13. Algebraic circuits

    CERN Document Server

    Lloris Ruiz, Antonio; Parrilla Roure, Luis; García Ríos, Antonio

    2014-01-01

    This book presents a complete and accurate study of algebraic circuits, digital circuits whose performance can be associated with any algebraic structure. The authors distinguish between basic algebraic circuits, such as Linear Feedback Shift Registers (LFSRs) and cellular automata, and algebraic circuits, such as finite fields or Galois fields. The book includes a comprehensive review of representation systems, of arithmetic circuits implementing basic and more complex operations, and of the residue number systems (RNS). It presents a study of basic algebraic circuits such as LFSRs and cellular automata as well as a study of circuits related to Galois fields, including two real cryptographic applications of Galois fields.

  14. Affective and personality disturbances among female former microelectronics workers.

    Science.gov (United States)

    Bowler, R M; Mergler, D; Rauch, S S; Harrison, R; Cone, J

    1991-01-01

    The production and manufacture of microelectronic components, carried out primarily by women workers, require extensive use of organic solvents. Affective and personality disturbances frequently have been associated with organic solvent toxicity. A group of women, former microelectronics workers (N = 70), primarily of Hispanic origin (77.1%) but raised in the United States, were evaluated for affective and personality disturbance with the MMPI. Profiles were analyzed, and diagnostic classification was performed blind. Results showed that (1) 85.7% of the profiles indicated abnormally high clinical elevations; and (2) MMPI profile classification revealed four clinical diagnostic groups: somatoform (24.3%), depression (15.7%), anxiety (28.6%), and psychotic (14.3%). These findings indicate significant psychopathology among these women, who formerly had worked in a microelectronics plant. The patterns of impairment present similarities to previous reports of organic solvent toxicity.

  15. Animal experiments with the microelectronics neural bridge IC.

    Science.gov (United States)

    Li, Wenyuan; Pei, Fei; Wang, Zhigong; Lü, Xiaoying

    2012-01-01

    The combination of the neural science and the microelectronics science offers a new way to restore the function of central nervous system. A neural regeneration module is used to be implanted into body to bridge the damaged nerve. A microelectronics neural bridge IC designed in CSMC 0.5□m CMOS process which can detect the neural signal and stimulate the nerve is presented. The neural regeneration module is composed of the microelectronics neural bridge IC and some discrete devices. An animal experiment has been done to check whether the neural signal can be transmitted with the chip normally or not. The animal experiment results suggest that the neural regeneration module can make the neural signal transmit normally.

  16. Potential occupational health hazards in the microelectronics industry.

    Science.gov (United States)

    LaDou, J

    1983-02-01

    The microelectronics industry is a major user of a wide variety of chemicals and other toxic materials. In the recent past semiconductor manufacturers have located in many countries and brought a new set of challenging clinical problems to occupational physicians. California, an area with a significant history in the statistical study of health and safety in the microelectronics industry, presents some evidence of potential health hazards in the semiconductor manufacturing process. The Semiconductor Industry Study done in California in 1981 explains the application of many toxic materials in the semiconductor manufacturing process, including a variety of solvents, acids, and metals such as arsenic. The Study documents the extensive use of dopant gases, primarily arsine, phosphine and diborane. Further study is necessary to assure the health and safety of microelectronics workers, particularly in the application of dopant gases.

  17. Multilayered Microelectronic Device Package With An Integral Window

    Science.gov (United States)

    Peterson, Kenneth A.; Watson, Robert D.

    2004-10-26

    A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

  18. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  19. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie; Tigges, Chris P.

    1999-04-01

    We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

  20. Fluorinated and Thermo-Cross-Linked Polyhedral Oligomeric Silsesquioxanes: New Organic-Inorganic Hybrid Materials for High-Performance Dielectric Application.

    Science.gov (United States)

    Wang, Jiajia; Sun, Jing; Zhou, Junfeng; Jin, Kaikai; Fang, Qiang

    2017-04-12

    A fluorinated and thermo-cross-linked polyhedral oligomeric silsesquioxane (POSS) has been successfully synthesized by thermal polymerization of a fluorinated POSS monomer having an inorganic silsesquioxane core and organic side chains bearing thermo-cross-linkable trifluorovinyl ether groups. This new inorganic-organic hybrid polymer shows high thermostability with a 5 wt % loss temperature of 436 °C, as well as good transparency (a sheet with an average thickness of 1.5 mm shows high transmittance of 92% varying from 400 to 1100 nm). Moreover, the polymer exhibits both low dielectric constant (polymer also shows low water uptake (polymer is very suitable to be utilized as a high-performance dielectric material for fabrication of high-frequency printed circuit boards or encapsulation resins for integrated circuit dies in the microelectronic industry. Furthermore, this work also provides a route for the preparation of fluorinated POSS-based polymers.

  1. Interfacial adhesion for microelectronics and MEMS devices

    Science.gov (United States)

    Kennedy, Marian Siobhan

    2007-12-01

    The reliability of thin film systems is important to the continued development of microelectronic and micro-electro-mechanical systems. Most often, reliability of these systems is tied to the ability of the films to remain adhered to its substrate. By measuring the amount of energy to separate the film, interfacial fracture energy, and prediciting trends researchers can predicts film lifetimes. Recent work to measure this energy has resulted in several different testing techniques including spontaneous buckling, indentation induced delamination and four point bending. Literature has shown good agreement between delamination test methods, but only when energy dissipation into the substrate is minimized. Using a W/Si system, the effect of energy dissipation was shown to decrease from 0.6 J/m2 to 0.2 J/m2 between different methods; one where the only fracture was along the interface and the other where cracking also occurred in the film and substrate. For systems where fracture only occurs along the interface, such as Au/Si, the calculated fracture energies are identical if the energy put into the system is kept near the needed strain energy to cause delamination. Overlayers of different stresses and thickness on Au/Si showed that the adhesion energies could change by a factor of three (Chapter 3). This dependence on applied energy is also shown when comparisons of four point bending and stressed overlayer test methods were completed on Pt/Si systems. The fracture energies of Pt/Ti/SiO2 were studied using four-point bending and compressive overlayers. Varying the thickness of the Ti film from 2 to 17 nm in a Pt/Ti/SiO2 system, both test methods showed an increase of adhesion energy until the nominal Ti thickness was 12nm. Then this adhesion energy began to decrease. This decrease was due to an increase in the Pt grain size after a nominal 12nm thickness (Chapter 4 and 5). While the trends in energy release rate are similar, the magnitude of the toughness between the

  2. Structure, properties, and MEMS and microelectronic applications of vanadium oxides

    Indian Academy of Sciences (India)

    Robert B Darling; Shiho Iwanaga

    2009-08-01

    Vanadium oxides have for many decades attracted much attention for their rich and unique physical properties which pose intriguing questions as to their fundamental origins as well as offering numerous potential applications for microelectronics, sensors, and microelectromechanical systems (MEMS). This paper reviews the unique structure and properties of the two most common vanadium oxides which have entered into microfabricated devices, VO2 and V25, and some of the past and future device applications which can be realized using these materials. Two emerging new materials, sodium vanadium bronzes and vanadium oxide nanotubes are also discussed for their potential use in new microelectronic devices.

  3. Application of ionizing radiation processing in biomedical engineering and microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Hongfej, H.; Jilan, W.

    1988-01-01

    The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristics reaction means such as crosslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become a important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this technique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics.

  4. Study on the evaluation of aerospace microelectronic industry

    Institute of Scientific and Technical Information of China (English)

    江帆; 陈荣秋

    2004-01-01

    Aerospace microelectronic technology has become the core competence of aerospace technology. For evaluating the aerospace microelectronic industry, it is necessary to change descriptive language of goal to quantitative index that can be measured. Knowing quantified goals or tree structure and array of general goal system, with certain algorithm and processing each corresponding list or array, we can bring out a quantified general goal value. The multi-objective (multi-attribute) evaluation method and the relevant weight sum algorithm have been adopted to quantitatively evaluate and forecast the developing state of the industry. A practical example illustrates that the applied decision technique and the algorithm are feasible and effective.

  5. A Scheme for Current-limiting Hybrid DC Circuit Breaker%一种限流式混合直流断路器方案

    Institute of Scientific and Technical Information of China (English)

    江道灼; 张弛; 郑欢; 叶李心; 严玉婷

    2014-01-01

    直流输电与交流输电相比,具有线损低、不存在系统同步运行稳定性问题等一系列优点。近年来,随着电压源型高压变流器等技术的迅速发展,柔性多端高压直流输电系统、直流输配电网以及直流断路器等关键技术与装备的研究受到了国内外的高度重视。文中简要阐述了机械式、全固态与混合式3类直流断路器的拓扑结构、工作原理、优缺点及国内外研究现状,指出高压直流断路器应以混合式为主要发展方向;提出一种限流式混合直流断路器方案并仿真验证了其可行性,该方案采用全/半控器件串联构成固态开关再与机械开关并联的混合开关结构及故障限流技术,可有效抑制直流短路电流上升率,降低故障判断灵敏性与机械开关速动性的要求,减少高压应用场合下固态开关器件的串联数量(特别是绝缘栅双极型晶体管等价格昂贵的全控型器件),从而降低装置工程化实现的技术难度及其体积与成本。%In contrast to alternating current(AC) power transmission,direct current(DC) power transmission has a series of advantages,such as low line loss and nonexistence of the problem of system synchronous operation stability.In recent years, with the rapid development of voltage source converter technology with higher voltage,the study on flexible multi-terminal high voltage direct current transmission(HVDC) system,DC transmission and distribution power net,as well as the related key technologies and equipments such as the high-voltage DC circuit breaker (DC-breaker) has captured great attention from the community at home and abroad.The research status of three types of DC-breakers(spoken of as the mechanical type,all-solid-state and hybrid type DC-breakers) and their topologies,working principles,advantages as well as disadvantages are briefly treated.It is concluded that the hybrid type should be the main trend of development

  6. Microelectronic DNA assay for the detection of BRCA1 gene mutations

    Science.gov (United States)

    Chen, Hua; Han, Jie; Li, Jun; Meyyappan, Meyya

    2004-01-01

    Mutations in BRCA1 are characterized by predisposition to breast cancer, ovarian cancer and prostate cancer as well as colon cancer. Prognosis for this cancer survival depends upon the stage at which cancer is diagnosed. Reliable and rapid mutation detection is crucial for the early diagnosis and treatment. We developed an electronic assay for the detection of a representative single nucleotide polymorphism (SNP), deletion and insertion in BRCA1 gene by the microelectronics microarray instrumentation. The assay is rapid, and it takes 30 minutes for the immobilization of target DNA samples, hybridization, washing and readout. The assay is multiplexing since it is carried out at the same temperature and buffer conditions for each step. The assay is also highly specific, as the signal-to-noise ratio is much larger than recommended value (72.86 to 321.05 vs. 5) for homozygotes genotyping, and signal ratio close to the perfect value 1 for heterozygotes genotyping (1.04).

  7. Wireless Integrated Microelectronic Vacuum Sensor System

    Science.gov (United States)

    Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

    2013-01-01

    NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum

  8. The Wales Region: Microelectronics Education to the Mid Eighties.

    Science.gov (United States)

    Taylor, Lionel

    1982-01-01

    Discusses developments which should occur in the Wales region by the end of the Microelectronics Education Programme (1984). Indicates that a major curriculum project has been started to enable developments in information technology to be reflected in classrooms, focusing on the production of software and resource materials. (Author/JN)

  9. Speculations on the Social Effects of New Microelectronics Technology.

    Science.gov (United States)

    Cherns, A. B.

    1980-01-01

    Examines the implications of the reduced importance of employment for individuals, for enterprises (work conditions, management styles), trade unions (with a more political than industrial role), and the conservation of resources, concluding with a brief look at the possible benefits of microelectronics for the developing countries. (CT)

  10. Integrating Microcomputers and Microelectronics into the Physics Curriculum.

    Science.gov (United States)

    Gale, Douglas S.

    1980-01-01

    Describes an interdisciplinary microcomputer and microelectronics program offered jointly by the Physics and Computer Science Departments of East Texas State University. The program operates on both the graduate and undergraduate level. Content as well as structure of the program are discussed. (Author/DS)

  11. Organic transistors in optical displays and microelectronic applications

    NARCIS (Netherlands)

    Gelinck, G.H.; Heremans, P.; Nomoto, K.; Anthopoulos, T.D.

    2010-01-01

    Organic thin-film transistors (OTFTs) offer unprecedented opportunities for implementation in a broad range of technological applications spanning from large-volume microelectronics and optical displays to chemical and biological sensors. In this Progress Report, we review the application of organic

  12. Equivalent Magnetic Circuit Model of Flux-switching Hybrid Excitation Machine%混合励磁磁通切换电机等效磁路模型

    Institute of Scientific and Technical Information of China (English)

    许泽刚; 谢少军; 毛鹏

    2011-01-01

    混合励磁磁通切换电机(flux-switching hybrid excitationmachine,FSHM)是一种新型定子励磁型交流无刷电机,具有磁链双极性、结构简单、功率密度高、运行可靠等优点。改变电励磁绕组电流的大小和方向,实现了对永磁气隙磁场的有效调节与控制,而引入导磁磁桥可提升气隙磁场调节范围。以建立电枢绕组磁链最大位置的等效磁路模型为切入点,推导了峰值磁通表达式,探索了磁桥段相对磁导率的估算方法,结合有限元仿真分析了磁桥厚度变化与磁桥式FSHM初始气隙磁密、磁桥磁密、气隙磁场调节能力、磁力线路径转移等特性的关系。样机的有限元仿真及实验结果与等效磁路模型预测趋势基本一致,验证了建模方法与理论分析的正确性,可用于指导磁通切换电机的设计与性能分析。%Flux-switching hybrid excitation machine(FSHM) was an interesting brushless machine with magnets in the stator,which offered the advantages of bipolar flux linkage,simple and robust rotor structure and high power density.Adjustment and control of the PM air gap magnetic field could be achieved by means of controlling the field winding current,and magnetic bridge amplified the effect of field flux on PM flux.This paper took equivalent magnetic circuit model(EMCM) of maximum phase flux-linkage position as point of penetration,deduced the equation of peak magnetic flux,and explored a method for estimating the relative permeability of magnetic bridge.The characteristic relation between the thickness of magnetic bridge and initial air gap flux density,magnetic bridge flux density,regulating capacity of air gap magnetic field,and magnetic lines transfer were studied combined with finite element analysis(FEA).The estimation results based on EMCM agreed well with the FEA and experiment data,which confirmed the correctness of modeling method and theoretical analysis.It provided reference for

  13. PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

    Science.gov (United States)

    Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

    2012-12-01

    More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible

  14. Back End of Line Nanorelays for Ultra-low Power Monolithic Integrated NEMS-CMOS Circuits

    KAUST Repository

    Lechuga Aranda, Jesus Javier

    2016-05-01

    Since the introduction of Complementary-Metal-Oxide-Semiconductor (CMOS) technology, the chip industry has enjoyed many benefits of transistor feature size scaling, including higher speed and device density and improved energy efficiency. However, in the recent years, the IC designers have encountered a few roadblocks, namely reaching the physical limits of scaling and also increased device leakage which has resulted in a slow-down of supply voltage and power density scaling. Therefore, there has been an extensive hunt for alternative circuit architectures and switching devices that can alleviate or eliminate the current crisis in the semiconductor industry. The Nano-Electro-Mechanical (NEM) relay is a promising alternative switch that offers zero leakage and abrupt turn-on behaviour. Even though these devices are intrinsically slower than CMOS transistors, new circuit design techniques tailored for the electromechanical properties of such devices can be leveraged to design medium performance, ultra-low power integrated circuits. In this thesis, we deal with a new generation of such devices that is built in the back end of line (BEOL) CMOS process and is an ideal option for full integration with current CMOS transistor technology. Simulation and verification at the circuit and system level is a critical step in the design flow of microelectronic circuits, and this is especially important for new technologies that lack the standard design infrastructure and well-known verification platforms. Although most of the physical and electrical properties of NEM structures can be simulated using standard electronic automation software, there is no report of a reliable behavioural model for NEMS switches that enable large circuit simulations. In this work, we present an optimised model of a BEOL nano relay that encompasses all the electromechanical characteristics of the device and is robust and lightweight enough for VLSI applications that require simulation of thousands of

  15. The Principle of the Micro-Electronic Neural Bridge and a Prototype System Design.

    Science.gov (United States)

    Huang, Zong-Hao; Wang, Zhi-Gong; Lu, Xiao-Ying; Li, Wen-Yuan; Zhou, Yu-Xuan; Shen, Xiao-Yan; Zhao, Xin-Tai

    2016-01-01

    The micro-electronic neural bridge (MENB) aims to rebuild lost motor function of paralyzed humans by routing movement-related signals from the brain, around the damage part in the spinal cord, to the external effectors. This study focused on the prototype system design of the MENB, including the principle of the MENB, the neural signal detecting circuit and the functional electrical stimulation (FES) circuit design, and the spike detecting and sorting algorithm. In this study, we developed a novel improved amplitude threshold spike detecting method based on variable forward difference threshold for both training and bridging phase. The discrete wavelet transform (DWT), a new level feature coefficient selection method based on Lilliefors test, and the k-means clustering method based on Mahalanobis distance were used for spike sorting. A real-time online spike detecting and sorting algorithm based on DWT and Euclidean distance was also implemented for the bridging phase. Tested by the data sets available at Caltech, in the training phase, the average sensitivity, specificity, and clustering accuracies are 99.43%, 97.83%, and 95.45%, respectively. Validated by the three-fold cross-validation method, the average sensitivity, specificity, and classification accuracy are 99.43%, 97.70%, and 96.46%, respectively.

  16. Designing Low Power Circuits: A Review

    Directory of Open Access Journals (Sweden)

    Rohan M Joshi

    2012-09-01

    Full Text Available The growing market of battery-operated portable applications like laptop, mobile etc requires microelectronic devices with low power consumption. As transistor size continues to shrink and as need for more complex chips increases, power management of the chip is one of the key challenges in VLSI industry. The manufacturers are looking for low power designs because providing adequate cooling and packaging increases the cost and limits the functionality of the device. This paper surveys the optimization techniques used to reduce power consumption in CMOS at all the levels of the design flow. It includes the technology used to implement digital circuits, the circuit design style and topology, the architecture for implementing the circuits, and at the highest level the software and algorithms that are implemented.

  17. Life cycle assessment applied to the sector of microelectronic devices

    Science.gov (United States)

    Matarazzo, Agata; Ingrao, Carlo; Clasadonte, Maria Teresa

    2016-07-01

    This work is about the application of LCA to the ends of the environmental assessment of pure-silicon wafers production. The input-data quantification is realized studying two microelectronic devices and presenting schematically tables and graphs, to be easily interpreted. This will allow help the reader to individuate, clearly and immediately, the materials flows and the relationships among the different steps of the production process. The material flows, in terms of raw materials use and energy consumption, were studied using the data provided by a firm involved in the microelectronic device production field. The two devices environmental analysis was developed considering potential effects such as Acidification, Eutrophication, Ozone reduction, Global warming, Ozone photochemical formation, Human Toxicity.

  18. Applicability of LET to single events in microelectronic structures

    Science.gov (United States)

    Xapsos, Michael A.

    1992-12-01

    LET is often used as a single parameter to determine the energy deposited in a microelectronic structure by a single event. The accuracy of this assumption is examined for ranges of ion energies and volumes of silicon appropriate for modern microelectronics. It is shown to be accurate only under very restricted conditions. Significant differences arise because (1) LET is related to energy lost by the ion, not energy deposited in the volume; and (2) LET is an average value and does not account for statistical variations in energy deposition. Criteria are suggested for determining when factors other than LET should be considered, and new analytical approaches are presented to account for them. One implication of these results is that improvements can be made in space upset rate predictions by incorporating the new methods into currently used codes such as CREME and CRUP.

  19. Microvibration monitoring: some recent experiences in an operating microelectronics facility

    Science.gov (United States)

    Hassett, Kevin

    1992-02-01

    Major construction work is currently underway at Intel''s Aloha, Oregon, campus. Because of concerns about the effects that construction-generated vibration might have on adjacent ongoing microelectronics manufacturing activities, two important steps were taken. The first of these was to establish guidelines that would be followed by the construction contractor to limit vibration disturbance. The second was to install a computer-based monitoring system that would continuously measure the vibration on the floor of the microelectronics manufacturing facility. In this way, the vibration effects of the construction activities would be monitored and adjusted, by modifying procedures, if necessary. The monitoring program is discussed in this paper. The major characteristics of the monitoring system, the placement of the transducers, and the ways in which the data were managed are described. Some typical data are shown and discussed.

  20. 3D packaging for integrated circuit systems

    Energy Technology Data Exchange (ETDEWEB)

    Chu, D.; Palmer, D.W. [eds.

    1996-11-01

    A goal was set for high density, high performance microelectronics pursued through a dense 3D packing of integrated circuits. A {open_quotes}tool set{close_quotes} of assembly processes have been developed that enable 3D system designs: 3D thermal analysis, silicon electrical through vias, IC thinning, mounting wells in silicon, adhesives for silicon stacking, pretesting of IC chips before commitment to stacks, and bond pad bumping. Validation of these process developments occurred through both Sandia prototypes and subsequent commercial examples.

  1. Using federal technology policy to strength the US microelectronics industry

    Science.gov (United States)

    Gover, J. E.; Gwyn, C. W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan's government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  2. Using federal technology policy to strength the US microelectronics industry

    Energy Technology Data Exchange (ETDEWEB)

    Gover, J.E.; Gwyn, C.W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  3. PREFACE: The Second Conference on Microelectronics, Microsystems and Nanotechnology

    Science.gov (United States)

    Nassiopoulou, Androula G.; Papanikolaou, Nikos; Tsamis, Christos

    2005-01-01

    The Second Conference on Microelectronics, Microsystems and Nanotechnology took place at the National Centre for Scientific Research `Demokritos', in Athens, Greece, between 14 and 17 November 2004. The conference was organized by the Institute of Microelectronics (IMEL) with the aim to bring together scientists and engineers working in the above exciting fields in an interactive forum. The conference included 45 oral presentations with 9 invited papers and was attended by 146 participants from 16 countries. The topics covered were nanotechnologies, quantum devices, sensors, micro- and nano-systems, semiconductor devices, C-MOS fabrication and characterization techniques, new materials, and IC design. Quantum devices and nanostructured materials attracted considerable attention. Both theoretical and experimental studies of metallic and semiconducting quantum systems were presented, with emphasis on their applications in electronics, optoelectronics, and nanocrystal memory devices. Another exciting topic was the recent developments in biocompatible lithographic processes for applications in biosensors. In particular novel processes for bio-friendly lithography, together with innovations in Si sensors for applications in medicine and food industry were presented. Recent developments and perspectives in CMOS technology towards the ultimate limit were also discussed. The conference covered issues and concepts of IC design with two invited talks on RF design and cryptography.The conference included presentations from several companies active in the field of microelectronics and systems in Greece.

  4. Implications of Pb-free microelectronics assembly in aerospace applications

    Science.gov (United States)

    Shapiro, A. A.; Bonner, J. K.; Ogunseitan, D.; Saphores, J. D.; Schoenung, J.

    2003-01-01

    The commercial microelectronics industry is rapidly moving to completely Pb-free assembly strategies within the next decade. This trend is being driven by existing and proposed legislation in Europe and in Japan. The microelectronics industry has become truly global, as indicated by major U .S. firms who already adopted Pb-free implementation programs. Among these forward-looking firms are AT&T, IBM, Motorola, HP and Intel to name a few.Following Moore's law, advances in microelectronics are happening very rapidly. In many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry will, at some point, be forced to use Pb-free components and subsystems as part of their standard business practices. In this paper we attempt to provide a snapshot of the commercial industry trends and how they may impact electronics in the aerospace environment. In addition, we also look at different strategies for implementation. Finally we present data collected on a recent NASA project to focus on finding suitable alternatives to eutectic tin-lead solders and solder pastes. The world is moving toward implementation of environmentally friendly manufacturing techniques. The aerospace industry will be forced to deal with issues related with Pb free assembly, either by availability or legislation. This paper provides some insight into some of the tradeoffs that should be considered.

  5. Resonance circuits for adiabatic circuits

    Directory of Open Access Journals (Sweden)

    C. Schlachta

    2003-01-01

    Full Text Available One of the possible techniques to reduces the power consumption in digital CMOS circuits is to slow down the charge transport. This slowdown can be achieved by introducing an inductor in the charging path. Additionally, the inductor can act as an energy storage element, conserving the energy that is normally dissipated during discharging. Together with the parasitic capacitances from the circuit a LCresonant circuit is formed.

  6. Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

    Science.gov (United States)

    Ramesham, Rajeshuni

    2000-01-01

    Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS

  7. Simulations of a typical CMOS amplifier circuit using the Monte Carlo method

    OpenAIRE

    Borges, Jacques Cousteau da Silva

    2016-01-01

    In the present paper of Microelectronics, some simulations of a typical circuit of amplification, using a CMOS transistor, through the computational tools were performed. At that time, PSPICE® was used, where it was possible to observe the results, which are detailed in this work. The imperfections of the component due to manufacturing processes were obtained from simulations using the Monte Carlo method. The circuit operating point, mean and standard deviation were obtained and the influence...

  8. Analysis of Hybrid-Integrated High-Speed Electro-Absorption Modulated Lasers Based on EM/Circuit Co-simulation

    DEFF Research Database (Denmark)

    Johansen, Tom Keinicke; Krozer, Viktor; Kazmierski, C.

    2009-01-01

    An improved electromagnetic simulation (EM) based approach has been developed for optimization of the electrical to optical (E/O) transmission properties of integrated electro-absorption modulated lasers (EMLs) aiming at 100 Gbit/s Ethernet applications. Our approach allows for an accurate analys...... of the EML performance in a hybrid microstrip assembly. The established EM-based approach provides a design methodology for the future hybrid integration of the EML with its driving electronics....

  9. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Smith, J.H.

    1996-11-01

    An overview of the surface micromachining program at the Microelectronics Development Laboratory of Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators for both defense and commercial applications. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has been developed for integrating microelectronics with surface-micromachined micromechanical devices. The application of chemical-mechanical polishing to increase the manufacturability of micromechanical devices is also presented.

  10. GATING CIRCUITS

    Science.gov (United States)

    Merrill, L.C.

    1958-10-14

    Control circuits for vacuum tubes are described, and a binary counter having an improved trigger circuit is reported. The salient feature of the binary counter is the application of the input signal to the cathode of each of two vacuum tubes through separate capacitors and the connection of each cathode to ground through separate diodes. The control of the binary counter is achieved in this manner without special pulse shaping of the input signal. A further advantage of the circuit is the simplicity and minimum nuruber of components required, making its use particularly desirable in computer machines.

  11. Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

    Science.gov (United States)

    Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

    2017-07-05

    When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe2O3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

  12. Large-Area Laser-Lift-Off Processing in Microelectronics

    Science.gov (United States)

    Delmdahl, R.; Pätzel, R.; Brune, J.

    Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films. Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass manufacturing.

  13. Using SDI-12 with ST microelectronics MCU's

    Energy Technology Data Exchange (ETDEWEB)

    Saari, Alexandra [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Hinzey, Shawn Adrian [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Frigo, Janette Rose [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Proicou, Michael Chris [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Borges, Louis [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2015-09-03

    ST Microelectronics microcontrollers and processors are readily available, capable and economical processors. Unfortunately they lack a broad user base like similar offerings from Texas Instrument, Atmel, or Microchip. All of these devices could be useful in economical devices for remote sensing applications used with environmental sensing. With the increased need for environmental studies, and limited budgets, flexibility in hardware is very important. To that end, and in an effort to increase open support of ST devices, I am sharing my teams' experience in interfacing a common environmental sensor communication protocol (SDI-12) with ST devices.

  14. Laser sintering of thick-film conductors for microelectronic applications

    Science.gov (United States)

    Kinzel, Edward C.; Sigmarsson, Hjalti H.; Xu, Xianfan; Chappell, William J.

    2007-03-01

    This paper investigates fabrication of functional thick metal films using simultaneous laser sintering and patterning along with the fundamental physical phenomena that govern the laser sintering process. The effects of the processing parameters on the quality of the fabricated components are investigated through a heat transfer analysis. We show that our process has potentials for metallization of microelectronics directly onto substrates whose melting temperatures are much lower than the temperature needed for sintering, which is only possible by properly controlling the temperature field during laser sintering. Optimum properties of the fabricated components are obtained when certain thermal conditions are produced during laser heating.

  15. Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

    Science.gov (United States)

    Roshni, Satheesh Babu; Sebastian, Mailadil Thomas; Surendran, Kuzhichalil Peethambharan

    2017-01-01

    Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (‑60 ppmK‑1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK‑1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm‑1K‑1 (thermal conductivity of alumina is about 24.5 Wm‑1K‑1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates.

  16. Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

    Science.gov (United States)

    Roshni, Satheesh Babu; Sebastian, Mailadil Thomas; Surendran, Kuzhichalil Peethambharan

    2017-01-01

    Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (−60 ppmK−1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK−1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm−1K−1 (thermal conductivity of alumina is about 24.5 Wm−1K−1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates. PMID:28084459

  17. Self-Assembled DNA Templated Nano-wires and Circuits

    Science.gov (United States)

    Braun, Erez

    2000-03-01

    The realization that conventional microelectronics is approaching its miniaturization limits has motivated the search for an alternative route based on self-assembled nanometer-scale electronics. We have recently proposed a new approach based on the hybridization of biological and electronic materials (Braun E., Eichen Y., Sivan U. and Ben-Yoseph G., Nature 391, 775 (1998)). The concept relies on a two-step self-assembly process. The inherent molecular recognition capabilities of DNA molecules are first utilized to construct a network that serves as a template for the subsequent assembly of electronic materials into a circuit. The utilization of DNA and its associated enzymatic machinery enables: (a) self-assembly of complex substrates, (b) specific molecular addresses for the localization of electronic materials (e.g., gold colloids) by standard molecular biology techniques, (c) interdevice wiring and (d) bridging the microscopic structures to the macroscopic world. The self-assembly of nanometer scale electronics relies on two complementary developments. First, the ability to convert DNA molecules into thin conductive wires and second, the self-assembly of complex extended DNA templates. Our progress in these two directions will be presented. Regarding the first issue, a physical process resulting in condensation of gold colloids onto DNA molecules enables the assembly of thin gold wires (around 100-200 A wide) having, in principle, unlimited extensions. The second issue is developed in the context of recombinant DNA which allows the self-assembly of precise molecular junctions and networks. Specifically, we use RecA protein, which is the main protein responsible for genetic recombination in E. Coli bacteria, to construct DNA junctions at pre-designed addresses (sequences) on the molecules. The integration of these processes allows advancing nanometer-scale electronics. A realistic fabrication scheme for a room-temperature single-electron transistor

  18. Nonsmooth Modeling and Simulation for Switched Circuits

    CERN Document Server

    Acary, Vincent; Brogliato, Bernard

    2011-01-01

    "Nonsmooth Modeling and Simulation for Switched Circuits" concerns the modeling and the numerical simulation of switched circuits with the nonsmooth dynamical systems (NSDS) approach, using piecewise-linear and multivalued models of electronic devices like diodes, transistors, switches. Numerous examples (ranging from introductory academic circuits to various types of power converters) are analyzed and many simulation results obtained with the INRIA open-source SICONOS software package are presented. Comparisons with SPICE and hybrid methods demonstrate the power of the NSDS approach

  19. Microelectronics at Work: Productivity and Jobs in the World Economy. Worldwatch Paper 39.

    Science.gov (United States)

    Norman, Colin

    A combination of revitalized employment policies, greater industrial democracy, and new ways of distributing both the hours of work and the fruits of technological change are essential if the benefits of the microelectronic revolution are to be equitably shared. Microelectronic technology promises an array of benefits, and the electronic age is…

  20. Advanced Microelectronics Technologies for Future Small Satellite Systems

    Science.gov (United States)

    Alkalai, Leon

    1999-01-01

    Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

  1. System-Level Integrated Circuit (SLIC) Technology Development for Phased Array Antenna Applications

    Science.gov (United States)

    Windyka, John A.; Zablocki, Ed G.

    1997-01-01

    This report documents the efforts and progress in developing a 'system-level' integrated circuit, or SLIC, for application in advanced phased array antenna systems. The SLIC combines radio-frequency (RF) microelectronics, digital and analog support circuitry, and photonic interfaces into a single micro-hybrid assembly. Together, these technologies provide not only the amplitude and phase control necessary for electronic beam steering in the phased array, but also add thermally-compensated automatic gain control, health and status feedback, bias regulation, and reduced interconnect complexity. All circuitry is integrated into a compact, multilayer structure configured for use as a two-by-four element phased array module, operating at 20 Gigahertz, using a Microwave High-Density Interconnect (MHDI) process. The resultant hardware is constructed without conventional wirebonds, maintains tight inter-element spacing, and leads toward low-cost mass production. The measured performances and development issues associated with both the two-by-four element module and the constituent elements are presented. Additionally, a section of the report describes alternative architectures and applications supported by the SLIC electronics. Test results show excellent yield and performance of RF circuitry and full automatic gain control for multiple, independent channels. Digital control function, while suffering from lower manufacturing yield, also proved successful.

  2. Whole-body tissue stabilization and selective extractions via tissue-hydrogel hybrids for high-resolution intact circuit mapping and phenotyping

    OpenAIRE

    Treweek, Jennifer B.; Ken Y Chan; Flytzanis, Nicholas C.; Yang, Bin; Deverman, Benjamin E.; Greenbaum, Alon; Lignell, Antti; Xiao, Cheng; Cai, Long; Ladinsky, Mark S.; Bjorkman, Pamela J.; Fowlkes, Charless C.; Gradinaru, Viviana

    2015-01-01

    To facilitate fine-scale phenotyping of whole specimens, we describe here a set of tissue fixation-embedding, detergent-clearing and staining protocols that can be used to transform excised organs and whole organisms into optically transparent samples within 1–2 weeks without compromising their cellular architecture or endogenous fluorescence. PACT (passive CLARITY technique) and PARS (perfusion-assisted agent release in situ) use tissue-hydrogel hybrids to stabilize tissue biomolecules durin...

  3. 基于IGBT串联技术的混合式高压直流断路器方案%A Hybrid High Voltage DC Circuit Breaker Design Plan With Series-Connected IGBTs

    Institute of Scientific and Technical Information of China (English)

    药韬; 温家良; 李金元; 陈中圆

    2015-01-01

    Vigorously developing renewable energy will be an inevitable choice to solve the unbalanced distribution of energy resources, ease the tension between electricity supply and demand, and achieve sustainable economic development in China. To integrate conventional DC transmission technology and flexible DC transmission technology, establishing HVDC grid would be an effective means to solve the problem of large scale grid-connected of renewable energy. In this paper the history of HVDC circuit breaker is reviewed, the latest research results are introduced, the current challenges for HVDC circuit breaker are illustrated. Also the typical topological structure, working principle, advantages and shortcomings of different types of HVDC circuit breaker are analyzed and compared. Based on this, a new hybrid HVDC circuit breaker design with series-connected insulated gate bipolar transistors (IGBTs) is presented, and the topology characteristics and its working principles are introduced in details. Zhoushan five-terminal DC transmission system is modeled and simulated in the PSCAD/EMTDC software to verify its feasibility.%大力发展可再生能源将是解决我国能源资源分布不平衡,电力供需紧张,实现经济可持续发展的必然选择.综合常规直流输电技术和柔性直流输电技术,建立高压直流电网将是解决大规模可再生能源并网问题的有效手段.回顾高压直流断路器的发展历程,介绍当前最新的研究成果,阐明现阶段高压直流断路器将要面临的挑战,分析比较不同类型高压直流断路器的典型拓扑结构、工作原理和优缺点.在此基础上提出一种基于绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)串联技术的混合式高压直流断路器方案,详细介绍其拓扑结构、特点和工作原理,基于舟山5端直流工程在PSCAD/EMTDC软件中搭建仿真模型验证了其可行性.

  4. Flexible and tunable silicon photonic circuits on plastic substrates

    CERN Document Server

    Chen, Yu; Li, Mo

    2012-01-01

    Flexible microelectronics has shown tremendous promise in a broad spectrum of applications, especially those that cannot be addressed by conventional microelectronics in rigid materials and constructions1-3. These unconventional yet important applications range from flexible consumer electronics to conformal sensor arrays and biomedical devices. A recent successful paradigm shift in implementing flexible electronics is to physically transfer and bond highly integrated devices made in high-quality, crystalline semiconductor materials on to plastic materials4-8. Here we demonstrate a flexible form of silicon photonics on plastic substrates using the transfer-and-bond fabrication method. Photonic circuits including interferometers and resonators have been transferred onto flexible plastic substrates with preserved functionalities and performance. By mechanically deforming the flexible substrates, the optical characteristics of the devices can be tuned reversibly over a remarkably large range. The demonstration o...

  5. Controllable circuit

    DEFF Research Database (Denmark)

    2010-01-01

    A switch-mode power circuit comprises a controllable element and a control unit. The controllable element is configured to control a current in response to a control signal supplied to the controllable element. The control unit is connected to the controllable element and provides the control...

  6. Complex VLSI Feature Comparison for Commercial Microelectronics Verification

    Science.gov (United States)

    2014-03-27

    verification of untrusted circuits using industry-standard and custom software. The process developed under TRUST and implemented at the AFRL Mixed Signal...79 5.2.3 SCR and Other Netlists . . . . . . . . . . . . . . . . . . . . . . . . 79 5.2.4 Additional Tools...Reliability of Integrated Circuits LVS layout versus schematic MOSIS the Metal Oxide Semiconductor Implementation Service MSDC Mixed Signal Design

  7. Whole-body tissue stabilization and selective extractions via tissue-hydrogel hybrids for high-resolution intact circuit mapping and phenotyping.

    Science.gov (United States)

    Treweek, Jennifer B; Chan, Ken Y; Flytzanis, Nicholas C; Yang, Bin; Deverman, Benjamin E; Greenbaum, Alon; Lignell, Antti; Xiao, Cheng; Cai, Long; Ladinsky, Mark S; Bjorkman, Pamela J; Fowlkes, Charless C; Gradinaru, Viviana

    2015-11-01

    To facilitate fine-scale phenotyping of whole specimens, we describe here a set of tissue fixation-embedding, detergent-clearing and staining protocols that can be used to transform excised organs and whole organisms into optically transparent samples within 1-2 weeks without compromising their cellular architecture or endogenous fluorescence. PACT (passive CLARITY technique) and PARS (perfusion-assisted agent release in situ) use tissue-hydrogel hybrids to stabilize tissue biomolecules during selective lipid extraction, resulting in enhanced clearing efficiency and sample integrity. Furthermore, the macromolecule permeability of PACT- and PARS-processed tissue hybrids supports the diffusion of immunolabels throughout intact tissue, whereas RIMS (refractive index matching solution) grants high-resolution imaging at depth by further reducing light scattering in cleared and uncleared samples alike. These methods are adaptable to difficult-to-image tissues, such as bone (PACT-deCAL), and to magnified single-cell visualization (ePACT). Together, these protocols and solutions enable phenotyping of subcellular components and tracing cellular connectivity in intact biological networks.

  8. Optical packaging activities at Institute of Microelectronics (IME), Singapore

    Science.gov (United States)

    Teo, Keng-Hwa; Sudharsanam, Krishnamachari; Pamidighantam, Ramana V.; Yeo, Yongkee; Iyer, Mahadevan K.

    2002-08-01

    The development of optoelectronic components for gigabit Ethernet communications is converging towards access networks where the cost of device makes a significant impact on the market acceptance. Device fabrication and packaging cost have to be brought down with novel assembly and packaging methods. Singapore has established a reputation in semiconductor device development and fabrication with excellent process and packaging facilities. Institute of Microelectronics (IME) was founded in 1991 to add value to the Singapore electronics industry. IME is involved in the development of active and passive photonics components using Silicon and polymer materials. We present a brief report on the development activities taking place in the field of optical component packaging at IME in recent years. We present a review of our competence and some of the optical device packaging activities that are being undertaken.

  9. Miniature environmental chambers for temperature humidity bias testing of microelectronics.

    Science.gov (United States)

    Hook, Michael David; Mayer, Michael

    2017-03-01

    Environmental chambers are commonly used for reliability testing of microelectronics and other products and materials. These chambers are large, expensive, and limit electrical connectivity to devices under test. In this paper, we present a collection of ten small, low-cost environmental chambers, with humidity control based on mixtures of water and glycerol placed inside the chambers. We demonstrate relative humidities from 44% to 90%, at temperatures from 30 to 85 °C, enabling industry-standard testing at 85% humidity and 85 °C. The division of samples between ten separate chambers allows different conditions to be applied to each sample, in order to quickly characterize the effects of the environment on device reliability, enabling extrapolation to estimate lifetimes in working conditions.

  10. Self-healable electrically conducting wires for wearable microelectronics.

    Science.gov (United States)

    Sun, Hao; You, Xiao; Jiang, Yishu; Guan, Guozhen; Fang, Xin; Deng, Jue; Chen, Peining; Luo, Yongfeng; Peng, Huisheng

    2014-09-01

    Electrically conducting wires play a critical role in the advancement of modern electronics and in particular are an important key to the development of next-generation wearable microelectronics. However, the thin conducting wires can easily break during use, and the whole device fails to function as a result. Herein, a new family of high-performance conducting wires that can self-heal after breaking has been developed by wrapping sheets of aligned carbon nanotubes around polymer fibers. The aligned carbon nanotubes offer an effective strategy for the self-healing of the electric conductivity, whereas the polymer fiber recovers its mechanical strength. A self-healable wire-shaped supercapacitor fabricated from a wire electrode of this type maintained a high capacitance after breaking and self-healing.

  11. Pattern-integrated interference lithography: prospects for nano- and microelectronics.

    Science.gov (United States)

    Leibovici, Matthieu C R; Burrow, Guy M; Gaylord, Thomas K

    2012-10-08

    In recent years, limitations in optical lithography have challenged the cost-effective manufacture of nano- and microelectronic chips. Spatially regular designs have been introduced to improve manufacturability. However, regular designed layouts typically require an interference step followed by a trim step. These multiple steps increase cost and reduce yield. In the present work, Pattern-Integrated Interference Lithography (PIIL) is introduced to address this problem. PIIL is the integration of interference lithography and superposed pattern mask imaging, combining the interference and the trim into a single-exposure step. Example PIIL implementations and experimental demonstrations are presented. The degrees of freedom associated with the source, pattern mask, and Fourier filter designs are described.

  12. Using microelectronics technology to communicate with living cells.

    Science.gov (United States)

    Heer, F; Hafizovic, S; Ugniwenko, T; Frey, U; Roscic, B; Blau, A; Hierlemann, A

    2007-01-01

    A monolithic microsystem in CMOS (complementary metal oxide semiconductor) technology is presented that provides bidirectional communication (stimulation and recording) between standard microelectronics and cultured electrogenic cells. The 128-electrode chip can be directly used as a substrate for cell culturing. It features circuitry units for stimulation and immediate cell signal treatment near each electrode. In addition, it provides on-chip A/D conversion as well as a digital interface so that a fast interaction is possible at good signal quality. Spontaneous and stimulated electrical activity recordings with neuronal and cardiac cell cultures will be presented. The system can be used to, e.g., study the behavior and development of neural networks in vitro, to reveal the effects of neuronal plasticity and to study network activity in response to pharmacological treatments.

  13. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    Science.gov (United States)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-03-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  14. Thermal measurement. Nanoscale temperature mapping in operating microelectronic devices.

    Science.gov (United States)

    Mecklenburg, Matthew; Hubbard, William A; White, E R; Dhall, Rohan; Cronin, Stephen B; Aloni, Shaul; Regan, B C

    2015-02-06

    Modern microelectronic devices have nanoscale features that dissipate power nonuniformly, but fundamental physical limits frustrate efforts to detect the resulting temperature gradients. Contact thermometers disturb the temperature of a small system, while radiation thermometers struggle to beat the diffraction limit. Exploiting the same physics as Fahrenheit's glass-bulb thermometer, we mapped the thermal expansion of Joule-heated, 80-nanometer-thick aluminum wires by precisely measuring changes in density. With a scanning transmission electron microscope and electron energy loss spectroscopy, we quantified the local density via the energy of aluminum's bulk plasmon. Rescaling density to temperature yields maps with a statistical precision of 3 kelvin/hertz(-1/2), an accuracy of 10%, and nanometer-scale resolution. Many common metals and semiconductors have sufficiently sharp plasmon resonances to serve as their own thermometers. Copyright © 2015, American Association for the Advancement of Science.

  15. HYBRID VEHICLE CONTROL SYSTEM

    Directory of Open Access Journals (Sweden)

    V. Dvadnenko

    2016-06-01

    Full Text Available The hybrid vehicle control system includes a start–stop system for an internal combustion engine. The system works in a hybrid mode and normal vehicle operation. To simplify the start–stop system, there were user new possibilities of a hybrid car, which appeared after the conversion. Results of the circuit design of the proposed system of basic blocks are analyzed.

  16. Materials science in microelectronics II the effects of structure on properties in thin films

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    The subject matter of thin-films - which play a key role in microelectronics - divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: Electrical properties Magnetic properties Optical properties Mechanical properties Mass transport properties Interface and junction properties Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties.

  17. HYBRID EXCITATION CLAW-POLE SYNCHRONOUS GENERATOR WITH MAGNETIC CIRCUIT SERIES CONNECTION%串联磁路混合励磁爪极发电机的研究

    Institute of Scientific and Technical Information of China (English)

    赵朝会; 秦海鸿; 严仰光

    2009-01-01

    针对电励磁爪极发电机效率低、永磁爪极发电机磁场调节困难的问题,提出了一种串联磁路混合励磁爪极同步发电机,利用磁路计算方法和三维有限元的分析研究了这种新型电机各部分的磁密大小,确定了合适的极对数和合理的磁钢厚度,探讨了这种新型电机的空载特性、外特性和调节特性.研究表明:串联磁路混合励磁爪极发电机合适的极对数为2,且磁钢厚度存在一个较为合理的优化值.相对于电励磁爪极发电机,它实现了励磁电流的双向控制;相对于永磁爪极发电机它使得输出电压可调,在更宽的负载范围内实现了输出电压的恒定.在参数相同的情况下,与电励磁爪极发电机相比,该电机具有更高的气隙磁密和功率密度.%To solve the low efficiency of electric excitation claw-pole synchronous generator(EECPSG) and regulate the magnetic field of permanent magnet (PM) claw-pole synchronous generator(PMCPSG), a novel hybrid excitation claw-pole synchronous generator(HECPSG) with magnetic circuit series connection is proposed. Through the simulation study on the generator using the calculation method for magnetic circuit and 3-D finite element method(FEA), the appropriate magnet thickness and the number of pole-pairs for the proposed generator are determined. Its off-loading characteristics, load characteristics, and regulation behaviors are investigated. The study shows that the appropriate number of pole-pairs in HECPSG with series magnetic circuits is two, and there exists an optimum magnet thickness.Compared to EECPSG, HECPSG realizes dual-directional control to the excitation current. Moreover, the generator can adjust the output voltage and keep the output voltage stable in a broad load range. Under the condition of same parametes, the motor has higer air-gap flux density and power density.

  18. Thyristor Based Hybrid Arc-less High Voltage Direct Current Circuit Breaker%基于晶闸管的混合型无弧高压直流断路器

    Institute of Scientific and Technical Information of China (English)

    周万迪; 魏晓光; 高冲; 罗湘; 曹均正

    2014-01-01

    Increasing HVDC transmission project gradually attracts the researcher’s attention to the high voltage DC circuit breaker (DCCB), which is the interrupt equipment in DC line. The DCCB could promote the realization of multi-terminal direct current (MTDC) and DC grid, and advance the development of renewable energy such as offshore wind power. This paper firstly compared the various existing circuit breaker. A thyristor based on hybrid arc-less high voltage DCCB topology was proposed. According to the equivalent mathematical models established in the paper, the critical instants and electrical parameters for different operating stages of the DCCB were derived. Operating performance of the DCCB for Zhou Shan 5 terminals 200 kV DC system was analyzed using PSCAD/EMTDC simulations, which was compared from technology and economic aspects, and the correctness of the theoretical analysis and the feasibility of the circuit breaker were also proved.%伴随着高压直流输电工程日益增长,直流断路器作为直流线路中分断装置,也逐步受到了研究人员的关注,其能够促进多端直流及直流电网实现,推动可再生能源尤其是海上风电的开发。首先简要回顾了高压直流断路器研究状况,对现有方案进行了比较分析。随后提出了一种基于晶闸管的混合型无弧高压直流断路器,通过等效数学模型对工作阶段的电气参数和临界时刻进行了计算。最后以舟山5端直流系统电压200 kV为参照,利用PSCAD/EMTDC开展了断路器仿真研究,验证了理论分析的正确性以及所提断路器的可行性,并从技术和经济角度开展了性能分析。

  19. Use of COTS [commercial-off-the-shelf] Microelectronics in Radiation Environments

    Energy Technology Data Exchange (ETDEWEB)

    Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

    1999-07-07

    This paper addresses key issues for the cost-effective use of COTS microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. COTS parts with low radiation tolerance should not be used when they degrade mission critical functions or lead to premature system failure. We review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMS increases from 1.4x10{sup 8} rads(Si)/s for a 256K SRAM to 7.7x10{sup 9} rads(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design or process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10-15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMS from three different date codes. In another study, irradiations of 4M SRAMS from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of ''COTS'' and ''radiation-hardened'' technology.

  20. Analog and VLSI circuits

    CERN Document Server

    Chen, Wai-Kai

    2009-01-01

    Featuring hundreds of illustrations and references, this book provides the information on analog and VLSI circuits. It focuses on analog integrated circuits, presenting the knowledge on monolithic device models, analog circuit cells, high performance analog circuits, RF communication circuits, and PLL circuits.

  1. Circuit Connectors

    Science.gov (United States)

    1979-01-01

    The U-shaped wire devices in the upper photo are Digi-Klipsm; aids to compact packaging of electrical and electronic devices. They serve as connectors linking the circuitry of one circuit board with another in multi-board systems. Digi-Klips were originally developed for Goddard Space Flight Center to meet a need for lightweight, reliable connectors to replace hand-wired connections formerly used in spacecraft. They are made of beryllium copper wire, noted for its excellent conductivity and its spring-like properties, which assure solid electrical contact over a long period of time.

  2. Process Variations and Probabilistic Integrated Circuit Design

    CERN Document Server

    Haase, Joachim

    2012-01-01

    Uncertainty in key parameters within a chip and between different chips in the deep sub micron era plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process.  Quantitative methodology is needed to ensure faultless functionality, despite existing process variations within given bounds, during product development.   This book presents the technological, physical, and mathematical fundamentals for a design paradigm shift, from a deterministic process to a probability-orientated design process for microelectronic circuits.  Readers will learn to evaluate the different sources of variations in the design flow in order to establish different design variants, while applying appropriate methods and tools to evaluate and optimize their design.  Trains IC designers to recognize problems caused by parameter variations during manufacturing and to choose the best methods available to mitigate these issues during the design process; Offers both qual...

  3. LOGIC CIRCUIT

    Science.gov (United States)

    Strong, G.H.; Faught, M.L.

    1963-12-24

    A device for safety rod counting in a nuclear reactor is described. A Wheatstone bridge circuit is adapted to prevent de-energizing the hopper coils of a ball backup system if safety rods, sufficient in total control effect, properly enter the reactor core to effect shut down. A plurality of resistances form one arm of the bridge, each resistance being associated with a particular safety rod and weighted in value according to the control effect of the particular safety rod. Switching means are used to switch each of the resistances in and out of the bridge circuit responsive to the presence of a particular safety rod in its effective position in the reactor core and responsive to the attainment of a predetermined velocity by a particular safety rod enroute to its effective position. The bridge is unbalanced in one direction during normal reactor operation prior to the generation of a scram signal and the switching means and resistances are adapted to unbalance the bridge in the opposite direction if the safety rods produce a predetermined amount of control effect in response to the scram signal. The bridge unbalance reversal is then utilized to prevent the actuation of the ball backup system, or, conversely, a failure of the safety rods to produce the predetermined effect produces no unbalance reversal and the ball backup system is actuated. (AEC)

  4. Collective of mechatronics circuit

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1987-02-15

    This book is composed of three parts, which deals with mechatronics system about sensor, circuit and motor. The contents of the first part are photo sensor of collector for output, locating detection circuit with photo interrupts, photo sensor circuit with CdS cell and lamp, interface circuit with logic and LED and temperature sensor circuit. The second part deals with oscillation circuit with crystal, C-R oscillation circuit, F-V converter, timer circuit, stability power circuit, DC amp and DC-DC converter. The last part is comprised of bridge server circuit, deformation bridge server, controlling circuit of DC motor, controlling circuit with IC for PLL and driver circuit of stepping motor and driver circuit of Brushless.

  5. Piezoelectric-nanowire-enabled power source for driving wireless microelectronics.

    Science.gov (United States)

    Xu, Sheng; Hansen, Benjamin J; Wang, Zhong Lin

    2010-10-19

    Harvesting energy from irregular/random mechanical actions in variable and uncontrollable environments is an effective approach for powering wireless mobile electronics to meet a wide range of applications in our daily life. Piezoelectric nanowires are robust and can be stimulated by tiny physical motions/disturbances over a range of frequencies. Here, we demonstrate the first chemical epitaxial growth of PbZr(x)Ti(1-x)O(3) (PZT) nanowire arrays at 230 °C and their application as high-output energy converters. The nanogenerators fabricated using a single array of PZT nanowires produce a peak output voltage of ~0.7 V, current density of 4 μA cm(-2) and an average power density of 2.8 mW cm(-3). The alternating current output of the nanogenerator is rectified, and the harvested energy is stored and later used to light up a commercial laser diode. This work demonstrates the feasibility of using nanogenerators for powering mobile and even personal microelectronics.

  6. Japanese technology assessment: Computer science, opto- and microelectronics mechatronics, biotechnology

    Energy Technology Data Exchange (ETDEWEB)

    Brandin, D.; Wieder, H.; Spicer, W.; Nevins, J.; Oxender, D.

    1986-01-01

    The series studies Japanese research and development in four high-technology areas - computer science, opto and microelectronics, mechatronics (a term created by the Japanese to describe the union of mechanical and electronic engineering to produce the next generation of machines, robots, and the like), and biotechnology. The evaluations were conducted by panels of U.S. scientists - chosen from academia, government, and industry - actively involved in research in areas of expertise. The studies were prepared for the purpose of aiding the U.S. response to Japan's technological challenge. The main focus of the assessments is on the current status and long-term direction and emphasis of Japanese research and development. Other aspects covered include evolution of the state of the art; identification of Japanese researchers, R and D organizations, and resources; and comparative U.S. efforts. The general time frame of the studies corresponds to future industrial applications and potential commercial impacts spanning approximately the next two decades.

  7. Cold-Cathodes for Sensors and Vacuum Microelectronics

    Energy Technology Data Exchange (ETDEWEB)

    Siegal, M.P.; Sullivan, J.P.; Tallant, D.R.; Simpson, R.L. [Sandia National Labs., Albuquerque, NM (United States); DiNardo, N.J.; Mercer, T.W. [Drexel Univ., Philadelphia, PA (United States). Dept. of Physics and Astronomy; Martinez-Miranda, L.J. [Univ. of Maryland, College Park, MD (United States). Dept. of Materials Science and Engineering

    1998-05-01

    The aim of this laboratory-directed research and development project was to study amorphous carbon (a-C) thin films for eventual cold-cathode electron emitter applications. The development of robust, cold-cathode emitters are likely to have significant implications for modern technology and possibly launch a new industry: vacuum micro-electronics (VME). The potential impact of VME on Sandia`s National Security missions, such as defense against military threats and economic challenges, is profound. VME enables new microsensors and intrinsically radiation-hard electronics compatible with MOSFET and IMEM technologies. Furthermore, VME is expected to result in a breakthrough technology for the development of high-visibility, low-power flat-panel displays. This work covers four important research areas. First, the authors studied the nature of the C-C bonding structures within these a-C thin films. Second, they determined the changes in the film structures resulting from thermal annealing to simulate the effects of device processing on a-C properties. Third, they performed detailed electrical transport measurements as a function of annealing temperature to correlate changes in transport properties with structural changes and to propose a model for transport in these a-C materials with implications on the nature of electron emission. Finally, they used scanning atom probes to determine important aspects on the nature of emission in a-C.

  8. Wireless link and microelectronics design for retinal prostheses

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Wentai [Univ. of California, Santa Cruz, CA (United States)

    2012-02-29

    This project focuses on delivering power and data to the artificial retinal implant inside the eye and the implant microstimulator electronics which delivers the current pulses to stimulate the retinal layer to elicit visual perception. Since the use of invasive means such as tethering wires to transmit power and data results in discomfort to the patients which could eventually cause infection due to the abrasion caused by the wire and contact of the internals of the eye to the external environment, a completely wireless approach is used to transfer both power and data. Power is required inside the eye for the microelectronic implant which uses a dual voltage supply scheme (positive and negative) to deliver biphasic (anodic and cathodic) current pulses. Data in the form of digital bits from the data transmitter external to the eye, carries information about the amplitude, phase width, interphase delay, stimulation sequence for each implant electrode. The data receiver unit decodes the digital stream and the microstimulator unit generates the appropriate current stimuli. Since the external unit consisting of the power transmitter can experience coupling a variation with the power receiver due to the patient’s movements, a closed loop approach is used which varies the transmitted power dynamically to automatically compensate for such movements. This report presents the salient features of this research activities and results.

  9. Electrochemical investigations of advanced materials for microelectronic and energy storage devices

    Science.gov (United States)

    Goonetilleke, Pubudu Chaminda

    A broad range of electrochemical techniques are employed in this work to study a selected set of advanced materials for applications in microelectronics and energy storage devices. The primary motivation of this study has been to explore the capabilities of certain modern electrochemical techniques in a number of emerging areas of material processing and characterization. The work includes both aqueous and non-aqueous systems, with applications in two rather general areas of technology, namely microelectronics and energy storage. The sub-systems selected for investigation are: (i) Electrochemical mechanical and chemical mechanical planarization (ECMP and CMP, respectively), (ii) Carbon nanotubes in combination with room temperature ionic liquids (ILs), and (iii) Cathode materials for high-performance Li ion batteries. The first group of systems represents an important building block in the fabrication of microelectronic devices. The second and third groups of systems are relevant for new energy storage technologies, and have generated immense interests in recent years. A common feature of these different systems is that they all are associated with complex surface reactions that dictate the performance of the devices based on them. Fundamental understanding of these reactions is crucial to further development and expansion of their associated technologies. It is the complex mechanistic details of these surface reactions that we address using a judicious combination of a number of state of the art electrochemical techniques. The main electrochemical techniques used in this work include: (i) Cyclic voltammetry (CV) and slow scan cyclic voltammetry (SSCV, a special case of CV); (ii) Galvanostatic (or current-controlled) measurements; (iii) Electrochemical impedance spectroscopy (EIS), based on two different methodologies, namely, Fourier transform EIS (FT-EIS, capable of studying fast reaction kinetics in a time-resolved mode), and EIS using frequency response

  10. A study of relaxation techniques for the transient analysis of digital circuits

    Science.gov (United States)

    Chia, W. K.

    1985-06-01

    In the VLSI microelectronics era, the cost of the immense CPU time and memory storage for a standard circuit simulator has become prohibitive. In order to achieve dramatic improvement in the performance of the circuit simulator, there are two principal points of departure from the standard simulation approach, namely, tearing decomposition and relaxation decomposition. This research is to study the numerical convergence and stability properties of several of the relaxation algorithms that have been proposed for the simulation of VLSI circuits. The time-point Gauss-Seidel method with prediction, the exploitation of latency and event scheduling algorithms are implemented into a general purpose circuit simulator SLATE-R (a Simulator with Latency and Tearing--Relaxed version). The performance of the SLATE-R program in the analysis of various types of integrated circuit technologies is studied.

  11. Commutation circuit for an HVDC circuit breaker

    Science.gov (United States)

    Premerlani, William J.

    1981-01-01

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components.

  12. Probabilistic short-circuit analysis of wind power systems with multiple contingencies and hybrid sampling%基于多重故障和混合仿真算法的风电系统概率短路分析

    Institute of Scientific and Technical Information of China (English)

    李生虎; 钱壮; 黄杰杰; 董王朝

    2015-01-01

    Multiple-contingency and wind power integration add difficulty for probabilistic short-circuit analysis (PSCA). The power flow model with doubly-fed induction generators (DFIGs) is introduced, which together with wind uncertainty yields initial state before contingency. The multiple-contingency algorithm is introduced to find expectation, variance, and distribution of the bus voltages and the branch currents. A hybrid probabilistic sampling technique is proposed with the fault branch enumerated and probabilistically weighted, and other fault parameters sampled. The variance for the hybrid simulation is proposed by combined analytical enumeration and probabilistic sampling. Numerical analysis quantifies impact of wind fluctuation and double contingencies on the PSCA results, and compares convergence of sequential voltages and currents. The proposed models provide reference to select electrical equipment and analyze power system security.%多重故障、风电并网增加了概率短路计算难度。引入双馈风电机组潮流算法,计及风速不确定性,得到概率短路前初始运行方式。引入多重短路算法,计算节点电压和支路电流的期望、方差以及概率分布。对枚举故障线路进行概率加权,抽样确定其他故障参数,建立混合仿真算法。综合考虑解析枚举和概率抽样特点,提出混合概率仿真方差计算公式。算例分析对比了风电出力波动、双重短路对概率短路计算结果的影响,比较了三序电压和电流的收敛性。研究结果为电气设备选择和电网安全分析提供了参考数据。

  13. Species conservation-based hybrid algorithm for reversible circuit synthesis%基于子种群保留的可逆电路合成混合算法

    Institute of Scientific and Technical Information of China (English)

    王潇潇; 焦李成; 李阳阳

    2015-01-01

    为了进一步降低4 bit以上中小规模可逆逻辑电路的量子代价,提出一种基于子种群保留的变长染色体编码混合算法。该算法在已有变长染色体编码混合算法的基础上,将子种群保留策略用于变长编码种群的进化,以保持种群多样性,避免陷入局部最优解;定义了变长编码染色体的近似度,以此作为种子提取和子种群划分的基础;提出了子种群重新启动策略和新的启发式子种群更新操作,克服变长编码种群进化过程中的遗传漂移,从而提高可行解率和解的质量。对4 bit以上常用标准可逆函数测试结果表明该算法能大大降低合成可逆电路的量子代价。%In order to decrease the quantum cost of small and medium‐sized reversible functions with more than 4 bit ,a species conservation‐based variable‐length encoding hybrid algorithm for reversible logic circuit synthesis was proposed based on an existing variable‐length encoding hybrid algorithm . Firstly ,the species conservation mechanism was customized and introduced into variable‐length enco‐ding population to maintain the diversity of the population .The similarity definition between chromo‐somes with different lengths was given ,based on which seeds subtraction and species differentiation were conducted .Then ,the species restart strategy and heuristic species update were proposed to a‐void the genetic draft of the population with variable‐length encoding .The experimental results show that the proposed algorithm can reduce the quantum cost of common reversible benchmarks and im‐prove the feasible ratio greatly .

  14. CMOS Ultra Low Power Radiation Tolerant (CULPRiT) Microelectronics

    Science.gov (United States)

    Yeh, Penshu; Maki, Gary

    2007-01-01

    Space Electronics needs Radiation Tolerance or hardness to withstand the harsh space environment: high-energy particles can change the state of the electronics or puncture transistors making them disfunctional. This viewgraph document reviews the use of CMOS Ultra Low Power Radiation Tolerant circuits for NASA's electronic requirements.

  15. A New Microelectronics Curriculum Created by Synopsys, Inc.

    Science.gov (United States)

    Goldman, Rich; Bartleson, Karen; Wood, Troy; Melikyan, Vazgen; Wang, Zhi-hua; Chen, Lan

    2009-01-01

    Rapid changes in integrated circuits (IC) technology and constantly shrinking process geometries demand a new curriculum that meets the contemporary requirements for IC design. This is especially important for 90nm and below technologies and the use of state-of-the-art EDA design tools and advanced IC design techniques. The creation of new…

  16. FUTURE TRENDS IN MICROELECTRONICS - IMPACT ON DETECTOR READOUT.

    Energy Technology Data Exchange (ETDEWEB)

    O' CONNOR, P.

    2006-04-03

    Mainstream CMOS is now a well-established detector readout technology. We review technology scaling trends and limits, the implementation of analog circuits in digital CMOS processes, and radiation resistance. Emphasis is placed on the growing importance of power dissipation in ultra-scaled technologies.

  17. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

    Science.gov (United States)

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

  18. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

    Directory of Open Access Journals (Sweden)

    Inah Kim

    Full Text Available Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea.Based on claim data from the National Health Insurance (2008-2012, we estimated age-specific rates of spontaneous abortion (SAB and menstrual aberration (MA among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs were estimated.Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties.Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

  19. Photonic integrated circuits based on silica and polymer PLC

    Science.gov (United States)

    Izuhara, T.; Fujita, J.; Gerhardt, R.; Sui, B.; Lin, W.; Grek, B.

    2013-03-01

    Various methods of hybrid integration of photonic circuits are discussed focusing on merits and challenges. Material platforms discussed in this report are mainly polymer and silica. We categorize the hybridization methods using silica and polymer waveguides into two types, chip-to-chip and on-chip integration. General reviews of these hybridization technologies from the past works are reviewed. An example for each method is discussed in details. We also discuss current status of our silica PLC hybrid integration technology.

  20. Experiences with integral microelectronics on smart structures for space

    Science.gov (United States)

    Nye, Ted; Casteel, Scott; Navarro, Sergio A.; Kraml, Bob

    1995-05-01

    One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX II) space-flight experiments implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. The data bus was controlled by Actel field programmable gate arrays arranged in a single master, four slave configuration. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via Delta Transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Thus, over-vibration detection circuitry with automatic output isolation was incorporated into the design. This was not used however, since during experiment integration and test, intentionally induced compensator instabilities resulted in benign mechanical oscillation symptoms. Not too surprisingly, it was determined that instabilities were most detectable by large temperature increases in the electronics, typically

  1. Performance Evaluation of Management Environment in Microelectronics Enterprise

    Directory of Open Access Journals (Sweden)

    Hui-ying Gao

    2013-05-01

    Full Text Available For the microelectronics manufacturing industries that have uncertain demand, high volume cost and Oligarchs characteristics, we often discuss the possibility of competitors on the capacity of strategy. First of all we use the industry data to analysis the manufacturing cost, demand and the historical situation of the revenue and we also discuss the influence about the uncertain demand and high volume cost to the industrial structure. Secondly, it put the individual manufacturer not considering the capacity decision of the competitor as the premise and put revenue as the performance target for capacity expansion to construct the mathematical optimization model of the productivity level under the uncertain demand. And the productivity level is called the micro capacity. The manufacturer based on competition and the levels of microscopic production can consider using the radical strategy or still upholding the microscopic optimal capacity, and then put forward a game model to analysis the expected profits of the leaders and the followers who have take the two strategies. Besides, we can use the industrial data to calculate and then get the equilibrium. At last we can calculate the conclusion that for the manufacturers of monopoly industry when they faced with the different marginal profit, different demand variation and hyperbaric capacity amortization cost, the leading manufacturers can use radical production strategy. On the one hand, they can improve the profits, on the other hand they can also compress the profit that was gotten by following the manufacturers. Therefore, the capacity expansion decision can be used as the means of competition for the leading manufacturers.

  2. Plan for advanced microelectronics processing technology application. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  3. Isotropic copper-invar alloys for microelectronics packaging

    Science.gov (United States)

    Cottle, Rand Duprez

    The recent trend in microelectronics packaging toward surface mounted devices (SMD) has created a need for new types of materials that possess low thermal expansion and high electrical and thermal conductivity. Laminates that combine the high thermal and electrical conductivity of copper with the low thermal expansion of Invar, know as CuInvarCu or CIC, are widely use as core constraining materials in printed wire boards where SMDs are to be employed. CIC is highly anisotropic, and there are potential problems resulting from its anisotropy. An isotropic CuInvar alloy would be of great interest for a variety of applications. In suitable Cu-Fe-Ni alloys, a copper-rich solid solution equilibrates with an Invar-rich solid solution; casting such alloys invariably produces Invar-rich dendrites in a copper-rich solid solution. Casting followed by suitable heat treatments can produce two-phase alloys that combine the properties of copper and Invar. The overall composition controls the relative fractions of Invar and copper and the resulting trade-off between low thermal expansivity and electrical conductivity. Measured thermal expansivities (CTE) of CuInvar alloys follow very closely a linear rule of mixing. Electrical conductivities of as-cast specimens are quite poor due to iron and nickel contamination. Theoretical phase diagrams indicate that nearly pure copper equilibrates with an Invar-rich phase at temperatures below, roughly, 500°C. However, equilibrium compositions have been shown to take extremely, long to form, due to the very sluggish kinetics in the system. Long-term annealing was shown to improve conductivity significantly, but much greater improvements are needed to make CuInvar viable as an electrical conductive material.

  4. Carbon nanotubes for thermal interface materials in microelectronic packaging

    Science.gov (United States)

    Lin, Wei

    As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

  5. Analog circuit design designing dynamic circuit response

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    This second volume, Designing Dynamic Circuit Response builds upon the first volume Designing Amplifier Circuits by extending coverage to include reactances and their time- and frequency-related behavioral consequences.

  6. Simulations of a typical CMOS amplifier circuit using the Monte Carlo method

    Directory of Open Access Journals (Sweden)

    Borges, Jacques Cousteau da Silva

    2016-11-01

    Full Text Available In the present paper of Microelectronics, some simulations of a typical circuit of amplification, using a CMOS transistor, through the computational tools were performed. At that time, PSPICE® was used, where it was possible to observe the results, which are detailed in this work. The imperfections of the component due to manufacturing processes were obtained from simulations using the Monte Carlo method. The circuit operating point, mean and standard deviation were obtained and the influence of the threshold voltage Vth was analyzed.

  7. Towards a modeling synthesis of two or three-dimensional circuits through substrate coupling and interconnections

    CERN Document Server

    Gontrand, Christian

    2014-01-01

    The number of transistors in integrated circuits doubles every two years, as stipulated by Moore's law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years - currently advanced to the nanometric scale.This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore's law. This reference explains the modeling of 3D circuits without delving into the latest

  8. Microelectronics and nanotechnology, and the fractal-like structure of information, knowledge, and science

    Science.gov (United States)

    Nutu, Catalin Silviu; Axinte, Tiberiu

    2016-12-01

    The article is centralizing and is concentrating the information from a considerable amount of papers related to the field of microelectronics and nanotechnology and also provides an approach to science and to the future evolution of science, based on the theory of the fractals. The new science of microelectronics and nanotechnology is one of the best examples of how the science of future will look like, namely at the confluence of increasingly more other sciences, where increasingly more sciences are to be added in the structure of the new science and the role of the multidisciplinary and interdisciplinary is becoming more and more important. Although not giving explicit details (e.g. specific formulas) the theory of fractals is used in the paper to explain the way of generation of new science for the specific case of microelectronics and nanotechnology, but is also used in the paper to outline a different way to approach new science and eventually to approach new sciences to come. There are mainly two motivations for the present article, namely: on the one hand, the position of the microelectronics and nanotechnologies in the fractal-like structure of science, and, on the other hand, that much of the communication, information, knowledge and science transfer, dissemination and advancement in sciences are taking place using the new technologies related to microelectronics and nanotechnologies.

  9. Analog circuit design designing waveform processing circuits

    CERN Document Server

    Feucht, Dennis

    2010-01-01

    The fourth volume in the set Designing Waveform-Processing Circuits builds on the previous 3 volumes and presents a variety of analog non-amplifier circuits, including voltage references, current sources, filters, hysteresis switches and oscilloscope trigger and sweep circuitry, function generation, absolute-value circuits, and peak detectors.

  10. Dynamic dielectric recovery characteristics of hybrid circuit breaker based on vacuum interrupter and SF6 interrupter in series%基于真空灭弧室与SF6灭弧室串联的混合断路器动态介质恢复特性

    Institute of Scientific and Technical Information of China (English)

    程显; 廖敏夫; 段雄英; 邹积岩

    2012-01-01

    论述了基于真空灭弧室和SF6灭弧室串联的混合断路器开断能力提高的原理,分析了混合断路器两灭弧室的介质恢复过程.结合混合断路器开断能力提高的机理提出了混合断路器对其操动控制机构的要求,设计了一种基于真空灭弧室与SF6灭弧室串联的光控模块式混合断路器实验模型.实验模型能满足分析混合断路器中真空灭弧室与SF6灭弧室在不同时刻协同动作开断容量增益特性的要求,其协同动作时间分散性在微秒级.实验对比了SF6断路器与基于相同SF6灭弧室串联真空灭弧室的混合断路器短路电流开断能力,证明在不增加SF6气体使用量的前提下,混合断路器具有比SF6断路器更加优越的开断能力.%The principle of breaking capacity improvement of hybrid circuit breaker with serial vacuum interrupter and SF6 interrupter is discussed and the dielectric recovery process of two interrupters is analyzed. Based on the improvement of breaking capacity,the requirements of hybrid circuit breaker for its control mechanism are proposed. The experimental model of hybrid circuit breaker based on optical control modules is designed,which meets the research requirement for the breaking capacity gain characteristic of coordinating operation at different moments between vacuum interrupter and SF6 interrupter, and the time dispersion is microsecond level. Experimental results show that,if the usage of SF6 gas is same,the breaking capacity of hybrid circuit breaker is higher than that of SF6 circuit breaker.

  11. Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach

    CERN Document Server

    Laurila, Tomi; Paulasto-Kröckel, Mervi; Turunen, Markus; Mattila, Toni T; Kivilahti, Jorma

    2012-01-01

    Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep un...

  12. Creep of Two-Phase Microstructures for Microelectronic Applications

    Energy Technology Data Exchange (ETDEWEB)

    Reynolds, Heidi Linch [Univ. of California, Berkeley, CA (United States)

    1998-12-01

    The mechanical properties of low-melting temperature alloys are highly influenced by their creep behavior. This study investigates the dominant mechanisms that control creep behavior of two-phase, low-melting temperature alloys as a function of microstructure. The alloy systems selected for study were In-Ag and Sn-Bi because their eutectic compositions represent distinctly different microstructure.” The In-Ag eutectic contains a discontinuous phase while the Sn-Bi eutectic consists of two continuous phases. In addition, this work generates useful engineering data on Pb-free alloys with a joint specimen geometry that simulates microstructure found in microelectronic applications. The use of joint test specimens allows for observations regarding the practical attainability of superplastic microstructure in real solder joints by varying the cooling rate. Steady-state creep properties of In-Ag eutectic, Sn-Bi eutectic, Sn-xBi solid-solution and pure Bi joints have been measured using constant load tests at temperatures ranging from O°C to 90°C. Constitutive equations are derived to describe the steady-state creep behavior for In-Ageutectic solder joints and Sn-xBi solid-solution joints. The data are well represented by an equation of the form proposed by Dom: a power-law equation applies to each independent creep mechanism. Rate-controlling creep mechanisms, as a function of applied shear stress, test temperature, and joint microstructure, are discussed. Literature data on the steady-state creep properties of Sn-Bi eutectic are reviewed and compared with the Sn-xBi solid-solution and pure Bi joint data measured in the current study. The role of constituent phases in controlling eutectic creep behavior is discussed for both alloy systems. In general, for continuous, two-phase microstructure, where each phase exhibits significantly different creep behavior, the harder or more creep resistant phase will dominate the creep behavior in a lamellar microstructure. If a

  13. HCMT models of optical microring-resonator circuits

    NARCIS (Netherlands)

    Lohmeyer, Manfred

    2010-01-01

    Circuits of dielectric integrated optical microring resonators are addressed through a two-dimensional hybrid analytical/numerical coupled mode theory (HCMT) model. Analytical modes of all straight and curved cores form templates for the optical fields of the entire circuits. Our variational techniq

  14. Hybrid Techniques for Quantum Circuit Simulation

    Science.gov (United States)

    2014-02-01

    15 Figure 10. (a) Ripple-carry (Cuccaro) adder for 3...bit numbers [17]. (b) Average runtime and memory needed by Quipu and QuIDDPro (QPLite) to simulate -bit Cuccaro adders ...b) scaled adder , (c) binary-to- stochastic converter, and (d) stochastic-to-binary converter

  15. DNA hybridization catalysts and catalyst circuits

    OpenAIRE

    SEELIG, Georg; Yurke, Bernard; Winfree, Erik

    2005-01-01

    Practically all of life's molecular processes, from chemical synthesis to replication, involve enzymes that carry out their functions through the catalysis of metastable fuels into waste products. Catalytic control of reaction rates will prove to be as useful and ubiquitous in DNA nanotechnology as it is in biology. Here we present experimental results on the control of the decay rates of a metastable DNA "fuel". We show that the fuel complex can be induced to decay with a r...

  16. [Physiological and hygienic characteristic of high-precision manufacturing operations in microelectronics].

    Science.gov (United States)

    Kirillov, V F; Mironov, A I; Gadakchan, K A; Mekhova, M M; Spiridonova, V S

    2010-01-01

    It was shown that workers performing high-precision manufacturing operations in microelectronic industry undergo severe visual, nervous and emotional stress combined with significant locomotor load, air deionization and deozonation, bacterial contamination, and UV deficit at their workplaces. These working conditions promote development of negative changes in the visual analyzer, nervous and emotional disorders, disturbances of systemic and regional hemodynamics. Also impaired is the functional state of the upper limb neuromuscular apparatus, central nervous and cardiovascular systems. The proposed certified complex of organizational, sanitary, hygienic, physiological, ergonomic, therapeutic and preventive measures has positive influence on the working capacity of employees in microelectronic industry.

  17. Materials science in microelectronics I the relationships between thin film processing and structure

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship - that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer - determines the ultimate structure of the thin film, and thus its properties. This

  18. Depth optimization for topological quantum circuits

    Science.gov (United States)

    AlFailakawi, Mohammad; Ahmad, Imtiaz; AlTerkawi, Laila; Hamdan, Suha

    2015-02-01

    Topological quantum computing (TQC) model is one of the most promising models for quantum computation. A circuit implemented under TQC is optimized by reducing its depth due to special construction requirements in such technology. In this work, we propose a hybrid approach that combines a left-edge greedy heuristic with genetic algorithm (GA) to minimize circuit depth through combined line and gate ordering. In our implementation, GA is used to find line ordering, whereas the left edge is used to reduce circuit depth by taking into consideration overlap constraints imposed by line ordering. Moreover, the proposed algorithm can merge gates together realizing circuit with multi-target gates to provide reduced circuit depth. Experimental results on random benchmark circuits show that the proposed algorithm was able to reduce circuit depth by 42 % on average for CNOT circuits, with additional 5 % savings when multi-target optimization is used. Results on RevLib benchmarks revealed a typical enhancement of 21 % and an additional 11 % when multi-target gates are allowed.

  19. Solid-state circuits

    CERN Document Server

    Pridham, G J

    2013-01-01

    Solid-State Circuits provides an introduction to the theory and practice underlying solid-state circuits, laying particular emphasis on field effect transistors and integrated circuits. Topics range from construction and characteristics of semiconductor devices to rectification and power supplies, low-frequency amplifiers, sine- and square-wave oscillators, and high-frequency effects and circuits. Black-box equivalent circuits of bipolar transistors, physical equivalent circuits of bipolar transistors, and equivalent circuits of field effect transistors are also covered. This volume is divided

  20. Simple Autonomous Chaotic Circuits

    Science.gov (United States)

    Piper, Jessica; Sprott, J.

    2010-03-01

    Over the last several decades, numerous electronic circuits exhibiting chaos have been proposed. Non-autonomous circuits with as few as two components have been developed. However, the operation of such circuits relies on the non-ideal behavior of the devices used, and therefore the circuit equations can be quite complex. In this paper, we present two simple autonomous chaotic circuits using only opamps and linear passive components. The circuits each use one opamp as a comparator, to provide a signum nonlinearity. The chaotic behavior is robust, and independent of nonlinearities in the passive components. Moreover, the circuit equations are among the algebraically simplest chaotic systems yet constructed.

  1. Circuit analysis for dummies

    CERN Document Server

    Santiago, John

    2013-01-01

    Circuits overloaded from electric circuit analysis? Many universities require that students pursuing a degree in electrical or computer engineering take an Electric Circuit Analysis course to determine who will ""make the cut"" and continue in the degree program. Circuit Analysis For Dummies will help these students to better understand electric circuit analysis by presenting the information in an effective and straightforward manner. Circuit Analysis For Dummies gives you clear-cut information about the topics covered in an electric circuit analysis courses to help

  2. Current limiter circuit system

    Energy Technology Data Exchange (ETDEWEB)

    Witcher, Joseph Brandon; Bredemann, Michael V.

    2017-09-05

    An apparatus comprising a steady state sensing circuit, a switching circuit, and a detection circuit. The steady state sensing circuit is connected to a first, a second and a third node. The first node is connected to a first device, the second node is connected to a second device, and the steady state sensing circuit causes a scaled current to flow at the third node. The scaled current is proportional to a voltage difference between the first and second node. The switching circuit limits an amount of current that flows between the first and second device. The detection circuit is connected to the third node and the switching circuit. The detection circuit monitors the scaled current at the third node and controls the switching circuit to limit the amount of the current that flows between the first and second device when the scaled current is greater than a desired level.

  3. Gate-Level Commercial Microelectronics Verification with Standard Cell Recognition

    Science.gov (United States)

    2015-03-26

    of Integrated Circuits MDA Missile Defense Agency MEMS Micro-Electro- Mechanical Systems MOSIS Metal Oxide Semiconductor Implementation Service MSDC...Institute of Technology (AFIT) Micro-Electro- Mechanical Systems (MEMS)/Very Large Scale Integration (VLSI) Laboratory and the Air Force Research Laboratory...11 ps=27.0u pd=27.0u m=1 region=sat P17 (S2 net01531 vdd! vdd!) ami06P w=12.0u l=600n as=1.8e-11 ad=1.8e-11 \\ ps=27.0u pd=27.0u m=1 region=sat P16

  4. 基于磁路分析的轴向混合磁轴承径向承载力解析计算%Calculation of Radial Electromagnetic Force of Axial Hybrid Magnetic Bearing Based on Magnetic Circuit Analysis

    Institute of Scientific and Technical Information of China (English)

    张云鹏; 刘淑琴; 李红伟; 范友鹏

    2012-01-01

    研究轴向混合磁轴承实现五自由度悬浮时,需要计算径向承载力与磁轴承结构参数以及永磁体参数之间的关系。为了解决轴向混合磁轴承缺乏径向承载力解析数学模型的问题,该文在分析轴向混合磁轴承磁路以及各部分磁导的基础上,结合稀土永磁体的工作特性,用虚位移法得出了轴向混合磁轴承的径向承载力解析数学模型。模型表明,在小径向位移时,该型的混合磁轴承径向承载力随着径向位移增加而增加,近似线性关系,径向承载力和刚度随轴向气隙增大而减小;磁轴承径向承载力随永磁体的有效长度增加呈现先增大后趋近饱和。利用有限元方法对径向承载力进行仿真计算,仿真结果与模型计算结果基本吻合。%In studying axial hybrid magnetic bearing (HMB) for suspension in five degree of freedom (DOF), the relationship between radial electromagnetic force and magnetic bearing structural parameters and permanent magnet parameters should be calculated. In order to overcome the lack of analytical calculation model for radial electromagnet force of axial HMB, based on magnetic circuit analysis and calculation of magnetic conductance for each parts, the analytical calculation model for radial electromagnet force of axial HMB is proposed in this paper. The analytical formulation of radial electromagnetic force is derived by using virtual displacement method and demagnetization characteristics of the rare earth permanent magnet. It is found that the radial electromagnetic force increases with the radial displacement increasing approximately in linear relationship, and the radial force and stiffness decreases with the axial gap increasing. The radial electromagnetic force increased and then saturated with increasing permanent magnet effective length. The model of axial HMB is simulated by finite-element method software and the simulation results are basically in

  5. Solenoid-Simulation Circuit

    Science.gov (United States)

    Simon, R. A.

    1986-01-01

    Electrical properties of solenoids imitated for tests of control circuits. Simulation circuit imitates voltage and current responses of two engine-controlling solenoids. Used in tests of programs of digital engine-control circuits, also provides electronic interface with circuits imitating electrical properties of pressure sensors and linear variable-differential transformers. Produces voltages, currents, delays, and discrete turnon and turnoff signals representing operation of solenoid in engine-control relay. Many such circuits used simulating overall engine circuitry.

  6. Numerical techniques for electromagnetic applications in microelectronic and radar imaging systems

    Science.gov (United States)

    Akerson, Jerome J.

    1998-12-01

    In this thesis, the application of numerical techniques to electromagnetic problems in microelectronic and radar imaging systems are investigated. In particular the following problems are studied: (1) Dielectric rib waveguide discontinuities are analyzed with the Finite Difference Time Domain (FDTD) method. The application of Berenger's Perfectly Matched Layer to multi-layered dielectrics is analyzed and the specific conditions needed to successfully match the multiple dielectric layers are determined and justified. An FDTD method to find the fundamental mode's spatial distribution is used to excite the discontinuity problem. It is shown that the computational domain can be reduced by twenty percent over Gaussian excitations. The effects of rib waveguide bend discontinuities and the effects of the rib geometry to the bend loss are presented. (2) An Impedance Boundary Condition (IBC) for two dimensional FDTD simulations containing thin, good conductor sheets is developed. The IBC uses a recursive convolution scheme based on approximating the conductor's impedance as a sum of exponentials. The effects of FDTD parameters such as grid size and time step on simulation accuracy are presented. The IBC is shown to accurately model the conductor loss over a wide frequency range. The verification is performed by comparing the quality factors of rectangular resonant structures determined by the FDTD simulation and analytical methods. (3) Phase unwrapping techniques for the inversion of terrain height using Synthetic Aperture Radar Interferometry (InSAR) data are analyzed. The weighted least squares and branch cut phase unwrapping techniques are specifically studied. An optimal branch cut method and a hybrid least squares/branch cut method are presented and used to unwrap the phase of both simulated and real SAR interferograms. When used to invert terrain height, these new SAR phase unwrapping methods offer over fifty percent reduction in root mean square (rms) height error

  7. AN AUTOMATIC TEST ENVIRONMENT FOR MICROELECTRONICS EDUCATION AND RESEARCH

    Directory of Open Access Journals (Sweden)

    Federico Sandoval-Ibarra

    2008-04-01

    Full Text Available An automatic test environment (ATE based on a PSoC has been developed to perform electricalcharacterization of integrated circuits (ICs. The ICs are designed for academic and research purposesas part of the Electronic Design graduate program at CINVESTAV-Guadalajara Unit; these ICs aremanufactured in standard N-well, 5-V, 1.5μm/0.5μm CMOS technologies. The ATE offers programmablecapabilities to develop master-slave architectures, memory for data storage, functions generator tostimulate circuits and systems, current/voltage sources for several purposes, current-voltagemeasurements, and ports to download experimental data to a PC. To date, several ICs have been testedwith the help of the ATE. In this paper, however, examples based on MOS Transistors only arepresented in order to describe the ATE performance and also to show how experimental data of thedevices under characterization were validated through SPICE simulations, experimental data given bymanufacturers, and using commercial equipment as well.

  8. Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability

    Directory of Open Access Journals (Sweden)

    Xuejun Fan

    2015-09-01

    Full Text Available Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic (SH coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.

  9. Microelectronic Information Processing Systems: Computing Systems. Summary of Awards Fiscal Year 1994.

    Science.gov (United States)

    National Science Foundation, Arlington, VA. Directorate for Computer and Information Science and Engineering.

    The purpose of this summary of awards is to provide the scientific and engineering communities with a summary of the grants awarded in 1994 by the National Science Foundation's Division of Microelectronic Information Processing Systems. Similar areas of research are grouped together. Grantee institutions and principal investigators are identified…

  10. Hidden circuits and argumentation

    Science.gov (United States)

    Leinonen, Risto; Kesonen, Mikko H. P.; Hirvonen, Pekka E.

    2016-11-01

    Despite the relevance of DC circuits in everyday life and schools, they have been shown to cause numerous learning difficulties at various school levels. In the course of this article, we present a flexible method for teaching DC circuits at lower secondary level. The method is labelled as hidden circuits, and the essential idea underlying hidden circuits is in hiding the actual wiring of DC circuits, but to make their behaviour evident for pupils. Pupils are expected to find out the wiring of the circuit which should enhance their learning of DC circuits. We present two possible ways to utilise hidden circuits in a classroom. First, they can be used to test and enhance pupils’ conceptual understanding when pupils are expected to find out which one of the offered circuit diagram options corresponds to the actual circuit shown. This method aims to get pupils to evaluate the circuits holistically rather than locally, and as a part of that aim this method highlights any learning difficulties of pupils. Second, hidden circuits can be used to enhance pupils’ argumentation skills with the aid of argumentation sheet that illustrates the main elements of an argument. Based on the findings from our co-operating teachers and our own experiences, hidden circuits offer a flexible and motivating way to supplement teaching of DC circuits.

  11. C-share: Optical circuits sharing for software-defined data-centers [arXiv

    DEFF Research Database (Denmark)

    Ben-Itzhak, Yaniv; Caba, Cosmin Marius; Schour, Liran

    2016-01-01

    Integrating optical circuit switches in data-centers is an ongoing research challenge. In recent years, state-of-the-art solutions introduce hybrid packet/circuit architectures for different optical circuit switch technologies, control techniques, and traffic rerouting methods. These solutions ar...

  12. Intuitive analog circuit design

    CERN Document Server

    Thompson, Marc

    2013-01-01

    Intuitive Analog Circuit Design outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject. In this book, Dr. Thompson describes intuitive and ""back-of-the-envelope"" techniques for designing and analyzing analog circuits, including transistor amplifi

  13. The circuit designer's companion

    CERN Document Server

    Williams, Tim

    2013-01-01

    The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

  14. Cosimulation of electromagnetics-circuit systems exploiting DGTD and MNA

    KAUST Repository

    Li, Ping

    2014-06-01

    A hybrid electromagnetics (EM)-circuit simulator exploiting the discontinuous Galerkin time domain (DGTD) method and the modified nodal analysis (MNA) algorithm is developed for analyzing hybrid distributive and nonlinear multiport lumped circuit systems. The computational domain is split into two subsystems. One is the EM subsystem that is analyzed by DGTD, while the other is the circuit subsystem that is solved by the MNA method. The coupling between the EM and circuit subsystems is enforced at the lumped port where related field and circuit unknowns are coupled via the use of numerical flux, port voltages, and current sources. Since the spatial operations of DGTD are localized, thanks to the use of numerical flux, coupling matrices between EM and circuit subsystems are small and are directly inverted. To handle nonlinear devices within the circuit subsystem, the standard Newton-Raphson method is applied to the nonlinear coupling matrix system. In addition, a local time-stepping scheme is applied to improve the efficiency of the hybrid solver. Numerical examples including single and multiport linear/nonlinear circuit networks are presented to validate the proposed solver. © 2014 IEEE.

  15. Electrical Circuits and Water Analogies

    Science.gov (United States)

    Smith, Frederick A.; Wilson, Jerry D.

    1974-01-01

    Briefly describes water analogies for electrical circuits and presents plans for the construction of apparatus to demonstrate these analogies. Demonstrations include series circuits, parallel circuits, and capacitors. (GS)

  16. Circuits on Cylinders

    DEFF Research Database (Denmark)

    Hansen, Kristoffer Arnsfelt; Miltersen, Peter Bro; Vinay, V

    2006-01-01

    We consider the computational power of constant width polynomial size cylindrical circuits and nondeterministic branching programs. We show that every function computed by a Pi2 o MOD o AC0 circuit can also be computed by a constant width polynomial size cylindrical nondeterministic branching...... program (or cylindrical circuit) and that every function computed by a constant width polynomial size cylindrical circuit belongs to ACC0....

  17. Electric circuits essentials

    CERN Document Server

    REA, Editors of

    2012-01-01

    REA's Essentials provide quick and easy access to critical information in a variety of different fields, ranging from the most basic to the most advanced. As its name implies, these concise, comprehensive study guides summarize the essentials of the field covered. Essentials are helpful when preparing for exams, doing homework and will remain a lasting reference source for students, teachers, and professionals. Electric Circuits I includes units, notation, resistive circuits, experimental laws, transient circuits, network theorems, techniques of circuit analysis, sinusoidal analysis, polyph

  18. Modeling of low pressure plasma sources for microelectronics fabrication

    Science.gov (United States)

    Agarwal, Ankur; Bera, Kallol; Kenney, Jason; Likhanskii, Alexandre; Rauf, Shahid

    2017-10-01

    Chemically reactive plasmas operating in the 1 mTorr–10 Torr pressure range are widely used for thin film processing in the semiconductor industry. Plasma modeling has come to play an important role in the design of these plasma processing systems. A number of 3-dimensional (3D) fluid and hybrid plasma modeling examples are used to illustrate the role of computational investigations in design of plasma processing hardware for applications such as ion implantation, deposition, and etching. A model for a rectangular inductively coupled plasma (ICP) source is described, which is employed as an ion source for ion implantation. It is shown that gas pressure strongly influences ion flux uniformity, which is determined by the balance between the location of plasma production and diffusion. The effect of chamber dimensions on plasma uniformity in a rectangular capacitively coupled plasma (CCP) is examined using an electromagnetic plasma model. Due to high pressure and small gap in this system, plasma uniformity is found to be primarily determined by the electric field profile in the sheath/pre-sheath region. A 3D model is utilized to investigate the confinement properties of a mesh in a cylindrical CCP. Results highlight the role of hole topology and size on the formation of localized hot-spots. A 3D electromagnetic plasma model for a cylindrical ICP is used to study inductive versus capacitive power coupling and how placement of ground return wires influences it. Finally, a 3D hybrid plasma model for an electron beam generated magnetized plasma is used to understand the role of reactor geometry on plasma uniformity in the presence of E  ×  B drift.

  19. Piezoelectric drive circuit

    Science.gov (United States)

    Treu, Jr., Charles A.

    1999-08-31

    A piezoelectric motor drive circuit is provided which utilizes the piezoelectric elements as oscillators and a Meacham half-bridge approach to develop feedback from the motor ground circuit to produce a signal to drive amplifiers to power the motor. The circuit automatically compensates for shifts in harmonic frequency of the piezoelectric elements due to pressure and temperature changes.

  20. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, S.M.; Vertregt, Maarten

    2010-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converte

  1. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, S.M.; Vertregt, Maarten

    2011-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converte

  2. Load testing circuit

    DEFF Research Database (Denmark)

    2009-01-01

    A load testing circuit a circuit tests the load impedance of a load connected to an amplifier. The load impedance includes a first terminal and a second terminal, the load testing circuit comprising a signal generator providing a test signal of a defined bandwidth to the first terminal of the load...

  3. Short-circuit logic

    NARCIS (Netherlands)

    Bergstra, J.A.; Ponse, A.

    2010-01-01

    Short-circuit evaluation denotes the semantics of propositional connectives in which the second argument is only evaluated if the first argument does not suffice to determine the value of the expression. In programming, short-circuit evaluation is widely used. A short-circuit logic is a variant of p

  4. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, Simon Minze; Vertregt, Maarten

    2011-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converte

  5. Signal sampling circuit

    NARCIS (Netherlands)

    Louwsma, Simon Minze; Vertregt, Maarten

    2010-01-01

    A sampling circuit for sampling a signal is disclosed. The sampling circuit comprises a plurality of sampling channels adapted to sample the signal in time-multiplexed fashion, each sampling channel comprising a respective track-and-hold circuit connected to a respective analogue to digital converte

  6. Small-area and compact CMOS emulator circuit for CMOS/nanoscale memristor co-design.

    Science.gov (United States)

    Shin, Sanghak; Choi, Jun-Myung; Cho, Seongik; Min, Kyeong-Sik

    2013-11-01

    In this paper, a CMOS emulator circuit that can reproduce nanoscale memristive behavior is proposed. The proposed emulator circuit can mimic the pinched hysteresis loops of nanoscale memristor memory's current-voltage relationship without using any resistor array, complicated circuit blocks, etc. that may occupy very large layout area. Instead of using a resistor array, other complicated circuit blocks, etc., the proposed emulator circuit can describe the nanoscale memristor's current-voltage relationship using a simple voltage-controlled resistor, where its resistance can be programmed by the stored voltage at the state variable capacitor. Comparing the layout area between the previous emulator circuit and the proposed one, the layout area of the proposed emulator circuit is estimated to be 32 times smaller than the previous emulator circuit. The proposed CMOS emulator circuit of nanoscale memristor memory will be very useful in developing hybrid circuits of CMOS/nanoscale memristor memory.

  7. Reversible Logic Circuit Synthesis

    CERN Document Server

    Shende, V V; Markov, I L; Prasad, A K; Hayes, John P.; Markov, Igor L.; Prasad, Aditya K.; Shende, Vivek V.

    2002-01-01

    Reversible, or information-lossless, circuits have applications in digital signal processing, communication, computer graphics and cryptography. They are also a fundamental requirement for quantum computation. We investigate the synthesis of reversible circuits that employ a minimum number of gates and contain no redundant input-output line-pairs (temporary storage channels). We propose new constructions for reversible circuits composed of NOT, Controlled-NOT, and TOFFOLI gates (the CNT gate library) based on permutation theory. A new algorithm is given to synthesize optimal reversible circuits using an arbitrary gate library. We also describe much faster heuristic algorithms. We also pursue applications of the proposed techniques to the synthesis of quantum circuits.

  8. PRECISION MOTION SYSTEM FOR OPTO-MECHANICAL EQUIPMENT OF MICROELECTRONICS

    Directory of Open Access Journals (Sweden)

    I. V. Dainiak

    2015-01-01

    Full Text Available The paper proposes a structure of precision motion system built on the basis of a circular multi-coordinate synchronous segment motor and reconfigurable parallel kinematic mechanism. The multi-coordinate synchronous segment motor may have from two to six movable segments depending on the design, and number of the segments generally defines an internal mobility of the motor. A specific feature of the parallel kinematic mechanism consists in the possibility of its structure reconfiguration by serial connection of two neighboring rods with the help of free elements of their spherical joints into triangular circuits with one spherical hinge at the common vertex. As result of this, the controlled motion of motor movable segments is transformed into the complex spatial displacement of circular platform with number of degrees of freedom up to six inclusively.A mathematical model for solution of the kinematic problem in the investigated parallel mechanism has been offered in the paper. The model allows to calculate a position of movable segments of multi-coordinate synchronous motor depending on the desired position and orientation of the executive circular platform. The parametric definition of base point positions in the motor segments in time allows eventually to form algorithms of programmable motions.The paper substantiates ability to embed the developed motion system into projection unit of opto-mechanical equipment while preserving traditional configuration scheme. This provides the possibility of adaptive adjustment of optical elements during operation; it allows to adjust the optical elements when the geometry of projection system is changed due to deterioration. As result, main characteristics of projection system: resolution, depth of field and image contrast and distortion are maintained at the required level. The developed motion system can be used as a coordinate system of positioning, alignment and scanning in the assembly and other

  9. Exact Threshold Circuits

    DEFF Research Database (Denmark)

    Hansen, Kristoffer Arnsfelt; Podolskii, Vladimir V.

    2010-01-01

    We initiate a systematic study of constant depth Boolean circuits built using exact threshold gates. We consider both unweighted and weighted exact threshold gates and introduce corresponding circuit classes. We next show that this gives a hierarchy of classes that seamlessly interleave with the ......We initiate a systematic study of constant depth Boolean circuits built using exact threshold gates. We consider both unweighted and weighted exact threshold gates and introduce corresponding circuit classes. We next show that this gives a hierarchy of classes that seamlessly interleave...... with the well-studied corresponding hierarchies defined using ordinary threshold gates. A major open problem in Boolean circuit complexity is to provide an explicit super-polynomial lower bound for depth two threshold circuits. We identify the class of depth two exact threshold circuits as a natural subclass...

  10. Feedback in analog circuits

    CERN Document Server

    Ochoa, Agustin

    2016-01-01

    This book describes a consistent and direct methodology to the analysis and design of analog circuits with particular application to circuits containing feedback. The analysis and design of circuits containing feedback is generally presented by either following a series of examples where each circuit is simplified through the use of insight or experience (someone else’s), or a complete nodal-matrix analysis generating lots of algebra. Neither of these approaches leads to gaining insight into the design process easily. The author develops a systematic approach to circuit analysis, the Driving Point Impedance and Signal Flow Graphs (DPI/SFG) method that does not require a-priori insight to the circuit being considered and results in factored analysis supporting the design function. This approach enables designers to account fully for loading and the bi-directional nature of elements both in the feedback path and in the amplifier itself, properties many times assumed negligible and ignored. Feedback circuits a...

  11. Thermoacoustic and thermoreflectance imaging of biased integrated circuits: Voltage and temperature maps

    Science.gov (United States)

    Hernández-Rosales, E.; Cedeño, E.; Hernandez-Wong, J.; Rojas-Trigos, J. B.; Marin, E.; Gandra, F. C. G.; Mansanares, A. M.

    2016-07-01

    In this work a combined thermoacoustic and thermoreflectance set-up was designed for imaging biased microelectronic circuits. In particular, it was used with polycrystalline silicon resistive tracks grown on a monocrystalline Si substrate mounted on a test chip. Thermoreflectance images, obtained by scanning a probe laser beam on the sample surface, clearly show the regions periodically heated by Joule effect, which are associated to the electric current distribution in the circuit. The thermoacoustic signal, detected by a pyroelectric/piezoelectric sensor beneath the chip, also discloses the Joule contribution of the whole sample. However, additional information emerges when a non-modulated laser beam is focused on the sample surface in a raster scan mode allowing imaging of the sample. The distribution of this supplementary signal is related to the voltage distribution along the circuit.

  12. Thermoacoustic and thermoreflectance imaging of biased integrated circuits: Voltage and temperature maps

    Energy Technology Data Exchange (ETDEWEB)

    Hernández-Rosales, E.; Cedeño, E. [Gleb Wataghin Physics Institute, University of Campinas - Unicamp, 13083-859 Campinas, SP (Brazil); Instituto Politécnico Nacional, Centro de Investigación en Ciencia Aplicada y Tecnología Avanzada, Legaria 694, Colonia Irrigación, CP 11500, México, DF (Mexico); Hernandez-Wong, J. [Instituto Politécnico Nacional, Centro de Investigación en Ciencia Aplicada y Tecnología Avanzada, Legaria 694, Colonia Irrigación, CP 11500, México, DF (Mexico); CONACYT, México, DF, México (Mexico); Rojas-Trigos, J. B.; Marin, E. [Instituto Politécnico Nacional, Centro de Investigación en Ciencia Aplicada y Tecnología Avanzada, Legaria 694, Colonia Irrigación, CP 11500, México, DF (Mexico); Gandra, F. C. G.; Mansanares, A. M., E-mail: manoel@ifi.unicamp.br [Gleb Wataghin Physics Institute, University of Campinas - Unicamp, 13083-859 Campinas, SP (Brazil)

    2016-07-25

    In this work a combined thermoacoustic and thermoreflectance set-up was designed for imaging biased microelectronic circuits. In particular, it was used with polycrystalline silicon resistive tracks grown on a monocrystalline Si substrate mounted on a test chip. Thermoreflectance images, obtained by scanning a probe laser beam on the sample surface, clearly show the regions periodically heated by Joule effect, which are associated to the electric current distribution in the circuit. The thermoacoustic signal, detected by a pyroelectric/piezoelectric sensor beneath the chip, also discloses the Joule contribution of the whole sample. However, additional information emerges when a non-modulated laser beam is focused on the sample surface in a raster scan mode allowing imaging of the sample. The distribution of this supplementary signal is related to the voltage distribution along the circuit.

  13. VLSI Hybrid DC-DC Regulator

    OpenAIRE

    Cosp Vilella, Jordi; Martínez García, Herminio

    2015-01-01

    Hybrid DC-DC regulators are structures that combine both a linear voltage regulator and a switching DC-DC converter. The main objective of this hybrid topology is to converge, in a single circuit topology, the best of both alternatives: a small voltage output ripple, which is a common characteristic of linear regulator circuits, and good energy efficiency, as in switching alternatives. While the linear regulator fixes the required output voltage to a fixed value with negligible steady-state r...

  14. Model of control of glow discharge electron gun current for microelectronics production applications

    Science.gov (United States)

    Denbnovetsky, S. V.; Melnyk, V. I.; Melnyk, I. V.; Tugay, B. A.

    2003-04-01

    The problems of simulation of discharge current control and its gas-dynamic stabilization for technological glow discharge electron guns with a cold cathode are considered in a paper. Such guns are successfully operated in soft vacuum and can be used in modern microelectronic technologies for providing of thermal operations with using different technological gases including active ones. The results of theoretical and experimental investigation of automatic control system of current of electron gun which were used for deposition of coatings in reactive gas medium are presented in article. Time of regulation for considered system did not exceed 400 ms. Is proved, that the automatic control of a current of a glow discharge electron gun by pressure variation its volume is effective on all operation range of pressure, and the minimum time of a current regulation can be tens -- hundred of ms, and this fact is allow to use in the majority of technological operations for microelectronic production.

  15. Energy minimization-based analysis of electrowetting for microelectronics cooling applications

    OpenAIRE

    Bahadur, Vaibhav; Garimella, S V

    2008-01-01

    Electrowetting (EW)-induced droplet motion has been studied over the last decade in view of its promising applications in the field of microfluidics. The objective of the present work is to analyze the physics underlying two specific EW-based applications for microelectronics thermal management. The first of these involves heat absorption by liquid droplets moving on the surface of a chip under EW actuation. Droplet motion between two flat plates under the influence of an electrowetting volta...

  16. CALIBRATION OF DEVICES FOR MEASURING ELEMENTS OF MICRO-ELECTRONIC STRUCTURES

    OpenAIRE

    G. Trapashko

    2012-01-01

    Development of microelectronics requires solution of the problem ensuring unity of linear measurements in a submicron range. The problem can be solved on the condition that calibration of measuring devices shall be made in accordance with reference samples that is a short length scale.While making calibration of measuring equipment with the help of a reference measure it is important to investigate components of the method accuracy and their influence on measuring results. The paper considers...

  17. Computational Modeling as a Design Tool in Microelectronics Manufacturing

    Science.gov (United States)

    Meyyappan, Meyya; Arnold, James O. (Technical Monitor)

    1997-01-01

    Plans to introduce pilot lines or fabs for 300 mm processing are in progress. The IC technology is simultaneously moving towards 0.25/0.18 micron. The convergence of these two trends places unprecedented stringent demands on processes and equipments. More than ever, computational modeling is called upon to play a complementary role in equipment and process design. The pace in hardware/process development needs a matching pace in software development: an aggressive move towards developing "virtual reactors" is desirable and essential to reduce design cycle and costs. This goal has three elements: reactor scale model, feature level model, and database of physical/chemical properties. With these elements coupled, the complete model should function as a design aid in a CAD environment. This talk would aim at the description of various elements. At the reactor level, continuum, DSMC(or particle) and hybrid models will be discussed and compared using examples of plasma and thermal process simulations. In microtopography evolution, approaches such as level set methods compete with conventional geometric models. Regardless of the approach, the reliance on empricism is to be eliminated through coupling to reactor model and computational surface science. This coupling poses challenging issues of orders of magnitude variation in length and time scales. Finally, database development has fallen behind; current situation is rapidly aggravated by the ever newer chemistries emerging to meet process metrics. The virtual reactor would be a useless concept without an accompanying reliable database that consists of: thermal reaction pathways and rate constants, electron-molecule cross sections, thermochemical properties, transport properties, and finally, surface data on the interaction of radicals, atoms and ions with various surfaces. Large scale computational chemistry efforts are critical as experiments alone cannot meet database needs due to the difficulties associated with such

  18. Monitoring Composite Material Pressure Vessels with a Fiber-Optic/Microelectronic Sensor System

    Science.gov (United States)

    Klimcak, C.; Jaduszliwer, B.

    1995-01-01

    We discuss the concept of an integrated, fiber-optic/microelectronic distributed sensor system that can monitor composite material pressure vessels for Air Force space systems to provide assessments of the overall health and integrity of the vessel throughout its entire operating history from birth to end of life. The fiber optic component would include either a semiconductor light emitting diode or diode laser and a multiplexed fiber optic sensing network incorporating Bragg grating sensors capable of detecting internal temperature and strain. The microelectronic components include a power source, a pulsed laser driver, time domain data acquisition hardware, a microprocessor, a data storage device, and a communication interface. The sensing system would be incorporated within the composite during its manufacture. The microelectronic data acquisition and logging system would record the environmental conditions to which the vessel has been subjected to during its storage and transit, e.g., the history of thermal excursions, pressure loading data, the occurrence of mechanical impacts, the presence of changing internal strain due to aging, delamination, material decomposition, etc. Data would be maintained din non-volatile memory for subsequent readout through a microcomputer interface.

  19. Regenerative feedback resonant circuit

    Science.gov (United States)

    Jones, A. Mark; Kelly, James F.; McCloy, John S.; McMakin, Douglas L.

    2014-09-02

    A regenerative feedback resonant circuit for measuring a transient response in a loop is disclosed. The circuit includes an amplifier for generating a signal in the loop. The circuit further includes a resonator having a resonant cavity and a material located within the cavity. The signal sent into the resonator produces a resonant frequency. A variation of the resonant frequency due to perturbations in electromagnetic properties of the material is measured.

  20. Analog circuit design

    CERN Document Server

    Dobkin, Bob

    2012-01-01

    Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are being challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions aids engineers with elegant and practical design techniques that focus on common analog challenges. The book's in-depth application examples provide insight into circuit design and application solutions that you can apply in today's demanding designs. <

  1. Parallelizing quantum circuit synthesis

    OpenAIRE

    Di Matteo, Olivia; Mosca, Michele

    2016-01-01

    Quantum circuit synthesis is the process in which an arbitrary unitary operation is decomposed into a sequence of gates from a universal set, typically one which a quantum computer can implement both efficiently and fault-tolerantly. As physical implementations of quantum computers improve, the need is growing for tools which can effectively synthesize components of the circuits and algorithms they will run. Existing algorithms for exact, multi-qubit circuit synthesis scale exponentially in t...

  2. Analog circuits cookbook

    CERN Document Server

    Hickman, Ian

    2013-01-01

    Analog Circuits Cookbook presents articles about advanced circuit techniques, components and concepts, useful IC for analog signal processing in the audio range, direct digital synthesis, and ingenious video op-amp. The book also includes articles about amplitude measurements on RF signals, linear optical imager, power supplies and devices, and RF circuits and techniques. Professionals and students of electrical engineering will find the book informative and useful.

  3. Electronic devices and circuits

    CERN Document Server

    Pridham, Gordon John

    1968-01-01

    Electronic Devices and Circuits, Volume 1 deals with the design and applications of electronic devices and circuits such as passive components, diodes, triodes and transistors, rectification and power supplies, amplifying circuits, electronic instruments, and oscillators. These topics are supported with introductory network theory and physics. This volume is comprised of nine chapters and begins by explaining the operation of resistive, inductive, and capacitive elements in direct and alternating current circuits. The theory for some of the expressions quoted in later chapters is presented. Th

  4. CMOS circuits manual

    CERN Document Server

    Marston, R M

    1995-01-01

    CMOS Circuits Manual is a user's guide for CMOS. The book emphasizes the practical aspects of CMOS and provides circuits, tables, and graphs to further relate the fundamentals with the applications. The text first discusses the basic principles and characteristics of the CMOS devices. The succeeding chapters detail the types of CMOS IC, including simple inverter, gate and logic ICs and circuits, and complex counters and decoders. The last chapter presents a miscellaneous collection of two dozen useful CMOS circuits. The book will be useful to researchers and professionals who employ CMOS circu

  5. Circuits and filters handbook

    CERN Document Server

    Chen, Wai-Kai

    2003-01-01

    A bestseller in its first edition, The Circuits and Filters Handbook has been thoroughly updated to provide the most current, most comprehensive information available in both the classical and emerging fields of circuits and filters, both analog and digital. This edition contains 29 new chapters, with significant additions in the areas of computer-aided design, circuit simulation, VLSI circuits, design automation, and active and digital filters. It will undoubtedly take its place as the engineer's first choice in looking for solutions to problems encountered in the design, analysis, and behavi

  6. Timergenerator circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Timer/Generator Circuits Manual is an 11-chapter text that deals mainly with waveform generator techniques and circuits. Each chapter starts with an explanation of the basic principles of its subject followed by a wide range of practical circuit designs. This work presents a total of over 300 practical circuits, diagrams, and tables.Chapter 1 outlines the basic principles and the different types of generator. Chapters 2 to 9 deal with a specific type of waveform generator, including sine, square, triangular, sawtooth, and special waveform generators pulse. These chapters also include pulse gen

  7. Security electronics circuits manual

    CERN Document Server

    MARSTON, R M

    1998-01-01

    Security Electronics Circuits Manual is an invaluable guide for engineers and technicians in the security industry. It will also prove to be a useful guide for students and experimenters, as well as providing experienced amateurs and DIY enthusiasts with numerous ideas to protect their homes, businesses and properties.As with all Ray Marston's Circuits Manuals, the style is easy-to-read and non-mathematical, with the emphasis firmly on practical applications, circuits and design ideas. The ICs and other devices used in the practical circuits are modestly priced and readily available ty

  8. MOS integrated circuit design

    CERN Document Server

    Wolfendale, E

    2013-01-01

    MOS Integral Circuit Design aims to help in the design of integrated circuits, especially large-scale ones, using MOS Technology through teaching of techniques, practical applications, and examples. The book covers topics such as design equation and process parameters; MOS static and dynamic circuits; logic design techniques, system partitioning, and layout techniques. Also featured are computer aids such as logic simulation and mask layout, as well as examples on simple MOS design. The text is recommended for electrical engineers who would like to know how to use MOS for integral circuit desi

  9. A self-aligned approach to printed circuits (Conference Presentation)

    Science.gov (United States)

    Frisbie, C. Daniel

    2016-09-01

    Printed electronics has a number of significant challenges, including spatial resolution, pattern registration, and printed circuit performance. In this talk, I will describe a multi-pronged approach to address these challenges that may bring roll-to-roll printed electronics closer to reality. To begin, I will show that innovations in materials allow the fabrication of printable, low voltage thin film transistors (TFTs), the key building blocks of flexible circuits, and that these can be incorporated into simple printed circuit demonstrations involving two dozen TFTs and an equivalent number of printed resistors and capacitors. The second half of the talk will describe a novel liquid-based fabrication approach that we term SCALE, or Self-Aligned Capillarity-Assisted Lithography for Electronics. The SCALE process employs a combination of digital printing and in-substrate capillary flow to produce self-aligned devices with feature sizes that are currently as small as 1 micron. The talk will finish with a discussion of the new opportunities in flexible microelectronics afforded by liquid-based processing.

  10. Microtubule as nanobioelectronic nonlinear circuit

    Directory of Open Access Journals (Sweden)

    Sekulić Dalibor L.

    2012-01-01

    Full Text Available In recent years, the use of biological molecules has offered exciting alternatives to conventional synthetic methods. Specific methods use various biological templates to direct the deposition and patterning of inorganic materials. Here we have established a new electrical model of microtubules as a biological nanoscale circuit based on polyelectrolyte features of cylindrical biopolymers. Our working hypothesis is that microtubules play an active role in sub-cellular computation and signaling via electronic and protonic conductivity and can thus be made useful in hybrid materials that offer novel electronic characteristics. We verify these hypotheses both computationally and analytically through a quantitative model based on the atomic resolution structures of the key functional proteins.

  11. Synchronizing Hyperchaotic Circuits

    DEFF Research Database (Denmark)

    Tamasevicius, Arunas; Cenys, Antanas; Namajunas, Audrius

    1997-01-01

    Regarding possible applications to secure communications the technique of synchronizing hyperchaotic circuits with a single dynamical variable is discussed. Several specific examples including the fourth-order circuits with two positive Lyapunov exponents as well as the oscillator with a delay line...... characterized by multiple positive Lyapunov exponents are reviewd....

  12. Genetic circuit design automation.

    Science.gov (United States)

    Nielsen, Alec A K; Der, Bryan S; Shin, Jonghyeon; Vaidyanathan, Prashant; Paralanov, Vanya; Strychalski, Elizabeth A; Ross, David; Densmore, Douglas; Voigt, Christopher A

    2016-04-01

    Computation can be performed in living cells by DNA-encoded circuits that process sensory information and control biological functions. Their construction is time-intensive, requiring manual part assembly and balancing of regulator expression. We describe a design environment, Cello, in which a user writes Verilog code that is automatically transformed into a DNA sequence. Algorithms build a circuit diagram, assign and connect gates, and simulate performance. Reliable circuit design requires the insulation of gates from genetic context, so that they function identically when used in different circuits. We used Cello to design 60 circuits forEscherichia coli(880,000 base pairs of DNA), for which each DNA sequence was built as predicted by the software with no additional tuning. Of these, 45 circuits performed correctly in every output state (up to 10 regulators and 55 parts), and across all circuits 92% of the output states functioned as predicted. Design automation simplifies the incorporation of genetic circuits into biotechnology projects that require decision-making, control, sensing, or spatial organization.

  13. A Virtual Circuits Lab

    Science.gov (United States)

    Vick, Matthew E.

    2010-01-01

    The University of Colorado's Physics Education Technology (PhET) website offers free, high-quality simulations of many physics experiments that can be used in the classroom. The Circuit Construction Kit, for example, allows students to safely and constructively play with circuit components while learning the mathematics behind many circuit…

  14. Nanoelectronic circuit design and test

    Science.gov (United States)

    Simsir, Muzaffer Orkun

    address the above problem using device simulations and demonstrate that while fault models defined for CMOS show significant overlaps with those for double-gate CMOS, they are insufficient to encompass all regimes of operation. This implies that new fault models are needed to adequately capture the behavior of logic gates based on this new technology. Looking further into the future, simple extensions to CMOS will also reach scaling limitations and completely new technologies will be required to decrease the minimum feature size even further. Among many proposals, one-dimensional (1D) structures, especially nanowires, have the edge in the size of circuits and logic arrays that have already been fabricated and experimentally evaluated. It is expected that, initially, these technologies will coexist with CMOS. Therefore, researchers have been working on new architectures that integrate nanowires into CMOS. However, as the feature sizes get smaller, the fabrication process becomes defect-prone. Moreover, because of extreme device densities, it may not be possible to locate all defects. Hence, shipped chips may still be defective. Moreover, the devices in the nanometer range may be susceptible to transient faults which cause these circuits produce incorrect output values for a small period of time. Despite the above drawbacks, it is possible to make nanoscale architectures practical and realistic by introducing defect and fault tolerance. In this thesis, we propose and evaluate a hybrid nanowire-CMOS architecture that addresses all three problems---namely high defect rates, unlocated defects and transient faults---at the same time. This goal is achieved by using multiple levels of redundancy and majority voters. A key aspect of the architecture is that it contains a judicious balance of both nanoscale and traditional CMOS components. As the fabrication technology of nanowires evolves, it will be possible to build stand-alone nanowire-based circuits. Several small-sized stand

  15. Molecular logic circuits.

    Science.gov (United States)

    Balzani, Vincenzo; Credi, Alberto; Venturi, Margherita

    2003-01-13

    Miniaturization has been an essential ingredient in the outstanding progress of information technology over the past fifty years. The next, perhaps ultimate, limit of miniaturization is that of molecules, which are the smallest entities with definite size, shape, and properties. Recently, great effort has been devoted to design and investigate molecular-level systems that are capable of transferring, processing, and storing information in binary form. Some of these nanoscale devices can, in fact, perform logic operations of remarkable complexity. This research--although far from being transferred into technology--is attracting interest, as the nanometer realm seems to be out of reach for the "top-down" techniques currently available to microelectronics industry. Moreover, such studies introduce new concepts in the "old" field of chemistry and stimulate the ingenuity of researchers engaged in the "bottom-up" approach to nanotechnology.

  16. Hybrid winding concept for toroids

    DEFF Research Database (Denmark)

    Schneider, Henrik; Andersen, Thomas; Knott, Arnold;

    2013-01-01

    This paper proposes a hybrid winding concept for toroids using the traces in a printed circuit board to make connection to bended copper foil cutouts. In a final product a number of strips with a certain thickness would be held by a former and the whole assembly could be placed by pick and placem...

  17. Modeling biology with HDL languages: a first step toward a genetic design automation tool inspired from microelectronics.

    Science.gov (United States)

    Gendrault, Yves; Madec, Morgan; Lallement, Christophe; Haiech, Jacques

    2014-04-01

    Nowadays, synthetic biology is a hot research topic. Each day, progresses are made to improve the complexity of artificial biological functions in order to tend to complex biodevices and biosystems. Up to now, these systems are handmade by bioengineers, which require strong technical skills and leads to nonreusable development. Besides, scientific fields that share the same design approach, such as microelectronics, have already overcome several issues and designers succeed in building extremely complex systems with many evolved functions. On the other hand, in systems engineering and more specifically in microelectronics, the development of the domain has been promoted by both the improvement of technological processes and electronic design automation tools. The work presented in this paper paves the way for the adaptation of microelectronics design tools to synthetic biology. Considering the similarities and differences between the synthetic biology and microelectronics, the milestones of this adaptation are described. The first one concerns the modeling of biological mechanisms. To do so, a new formalism is proposed, based on an extension of the generalized Kirchhoff laws to biology. This way, a description of all biological mechanisms can be made with languages widely used in microelectronics. Our approach is therefore successfully validated on specific examples drawn from the literature.

  18. Job stress models, depressive disorders and work performance of engineers in microelectronics industry.

    Science.gov (United States)

    Chen, Sung-Wei; Wang, Po-Chuan; Hsin, Ping-Lung; Oates, Anthony; Sun, I-Wen; Liu, Shen-Ing

    2011-01-01

    Microelectronic engineers are considered valuable human capital contributing significantly toward economic development, but they may encounter stressful work conditions in the context of a globalized industry. The study aims at identifying risk factors of depressive disorders primarily based on job stress models, the Demand-Control-Support and Effort-Reward Imbalance models, and at evaluating whether depressive disorders impair work performance in microelectronics engineers in Taiwan. The case-control study was conducted among 678 microelectronics engineers, 452 controls and 226 cases with depressive disorders which were defined by a score 17 or more on the Beck Depression Inventory and a psychiatrist's diagnosis. The self-administered questionnaires included the Job Content Questionnaire, Effort-Reward Imbalance Questionnaire, demography, psychosocial factors, health behaviors and work performance. Hierarchical logistic regression was applied to identify risk factors of depressive disorders. Multivariate linear regressions were used to determine factors affecting work performance. By hierarchical logistic regression, risk factors of depressive disorders are high demands, low work social support, high effort/reward ratio and low frequency of physical exercise. Combining the two job stress models may have better predictive power for depressive disorders than adopting either model alone. Three multivariate linear regressions provide similar results indicating that depressive disorders are associated with impaired work performance in terms of absence, role limitation and social functioning limitation. The results may provide insight into the applicability of job stress models in a globalized high-tech industry considerably focused in non-Western countries, and the design of workplace preventive strategies for depressive disorders in Asian electronics engineering population.

  19. Approximate circuits for increased reliability

    Energy Technology Data Exchange (ETDEWEB)

    Hamlet, Jason R.; Mayo, Jackson R.

    2015-08-18

    Embodiments of the invention describe a Boolean circuit having a voter circuit and a plurality of approximate circuits each based, at least in part, on a reference circuit. The approximate circuits are each to generate one or more output signals based on values of received input signals. The voter circuit is to receive the one or more output signals generated by each of the approximate circuits, and is to output one or more signals corresponding to a majority value of the received signals. At least some of the approximate circuits are to generate an output value different than the reference circuit for one or more input signal values; however, for each possible input signal value, the majority values of the one or more output signals generated by the approximate circuits and received by the voter circuit correspond to output signal result values of the reference circuit.

  20. Approximate circuits for increased reliability

    Energy Technology Data Exchange (ETDEWEB)

    Hamlet, Jason R.; Mayo, Jackson R.

    2015-12-22

    Embodiments of the invention describe a Boolean circuit having a voter circuit and a plurality of approximate circuits each based, at least in part, on a reference circuit. The approximate circuits are each to generate one or more output signals based on values of received input signals. The voter circuit is to receive the one or more output signals generated by each of the approximate circuits, and is to output one or more signals corresponding to a majority value of the received signals. At least some of the approximate circuits are to generate an output value different than the reference circuit for one or more input signal values; however, for each possible input signal value, the majority values of the one or more output signals generated by the approximate circuits and received by the voter circuit correspond to output signal result values of the reference circuit.

  1. Eye vision system using programmable micro-optics and micro-electronics

    Science.gov (United States)

    Riza, Nabeel A.; Amin, M. Junaid; Riza, Mehdi N.

    2014-02-01

    Proposed is a novel eye vision system that combines the use of advanced micro-optic and microelectronic technologies that includes programmable micro-optic devices, pico-projectors, Radio Frequency (RF) and optical wireless communication and control links, energy harvesting and storage devices and remote wireless energy transfer capabilities. This portable light weight system can measure eye refractive powers, optimize light conditions for the eye under test, conduct color-blindness tests, and implement eye strain relief and eye muscle exercises via time sequenced imaging. Described is the basic design of the proposed system and its first stage system experimental results for vision spherical lens refractive error correction.

  2. Application of multivariate statistical analysis to STEM X-ray spectral images: interfacial analysis in microelectronics.

    Science.gov (United States)

    Kotula, Paul G; Keenan, Michael R

    2006-12-01

    Multivariate statistical analysis methods have been applied to scanning transmission electron microscopy (STEM) energy-dispersive X-ray spectral images. The particular application of the multivariate curve resolution (MCR) technique provides a high spectral contrast view of the raw spectral image. The power of this approach is demonstrated with a microelectronics failure analysis. Specifically, an unexpected component describing a chemical contaminant was found, as well as a component consistent with a foil thickness change associated with the focused ion beam specimen preparation process. The MCR solution is compared with a conventional analysis of the same spectral image data set.

  3. Configurations of high-frequency ultrasonics complex vibration systems for packaging in microelectronics.

    Science.gov (United States)

    Tsujino, Jiromaru; Harada, Yoshiki; Ihara, Shigeru; Kasahara, Kohei; Shimizu, Masanori; Ueoka, Tetsugi

    2004-04-01

    Ultrasonic high-frequency complex vibrations are effective for various ultrasonic high-power applications. Three types of ultrasonic complex vibration system with a welding tip vibrating elliptical to circular locus for packaging in microelectronics were studied. The complex vibration sources are using (1) a longitudinal-torsional vibration converter with diagonal slits that is driven only by a longitudinal vibration source, (2) a complex transverse vibration rod with several stepped parts that is driven by two longitudinal vibration source crossed at a right angle and (3) a longitudinal vibration circular disk and three longitudinal transducers that are installed at the circumference of the disk.

  4. [Modern hearing-aids at the cutting edge of microelectronics. Increased possibilities for individual customization].

    Science.gov (United States)

    Arlinger, S

    1999-08-25

    The development of modern hearing aids has been so great that they now represent the cutting edge of micro-electronics. Flexibility has been enhanced by computer-aided programming of the devices, and particularly by digital signal processing, developments which enable improved customization. Increased knowledge of the pathophysiology of the auditory system, fundamental processes in central auditory pathways, and cognitive function enable technological developments to be exploited, thus enhancing our ability to cope with an increasingly broad spectrum of hearing impairment, ranging from mild high-frequency loss to severe loss across the entire frequency range.

  5. Nano-interconnection for microelectronics and polymers with benzo-triazole

    Science.gov (United States)

    Park, Yeonjoon; Choi, Sang H.; Noh, Hyunpil; Kuk, Young

    2006-01-01

    Benzo-Triazole (BTA) is considered as an important bridging material that can connect an organic polymer to the metal electrode on silicon wafers as a part of the microelectronics fabrication technology. We report a detailed process of surface induced 3-D polymerization of BTA on the Cu electrode material which was measured with the Ultraviolet Photoemission Spectroscopy (UPS), X-ray Photoemission Spectroscopy (XPS), and Scanning Tunneling Microscope (STM). The electric utilization of shield and chain polymerization of BTA on Cu surface is contemplated in this study.

  6. Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials

    Science.gov (United States)

    1991-01-01

    Si I-xGex Strained Layers (D.B.Noble) ................................................ 55 I. Oral Presentations Resulting from AFOSR Grants No. 89-0185...120 8 7 0 100 6 4 60 80 , E 60 0 F. ac sorption D - 21 - A desorption ( Vih ) Q 1 I - I - - a- 1 -10 0 10 20 30 40 annealing time (min) Fig. 8 D...III. ORAL PRESENTATIONS RESULTING FROM AFOSR GRANTS NO. 86- 0051 AND 86-0051 1. W.DhjX, "Mechanical Properties of Microelectronic Thin Film Materials

  7. Coupling Two Different Nucleic Acid Circuits in an Enzyme-Free Amplifier

    Directory of Open Access Journals (Sweden)

    Andrew D. Ellington

    2012-11-01

    Full Text Available DNA circuits have proven to be useful amplifiers for diagnostic applications, in part because of their modularity and programmability. In order to determine whether different circuits could be modularly stacked, we used a catalytic hairpin assembly (CHA circuit to initiate a hybridization chain reaction (HCR circuit. In response to an input nucleic acid sequence, the CHA reaction accumulates immobilized duplexes and HCR elongates these duplexes. With fluorescein as a reporter each of these processes yielded 10-fold signal amplification in a convenient 96-well format. The modular circuit connections also allowed the output reporter to be readily modified to a G-quadruplex-DNAzyme that yielded a fluorescent signal.

  8. Simulation on Interaction of Vacuum Arc and SF6 Arc in Hybrid Circuit Breaker During High-current Interruption%混合断路器大电流开断过程中真空电弧与SF6电弧相互作用的仿真

    Institute of Scientific and Technical Information of China (English)

    程显; 段雄英; 廖敏夫; 陈建华; 邹积岩

    2012-01-01

    真空断路器和SF6断路器串联的混合断路器,可有效利用真空和SF6气体两种介质不同的灭弧特性实现更大短路电流的分断。为研究两种电弧的相互任用,运用ATP软件及其TACS工具建立了系统实验仿真平台、12kV真空断路器与40.5kV SF6断路器的电弧模型;将仿真结果与实验波形结合通过数学方法分别求得实用的真空电弧和SF6电弧模型参数;搭建了实用真空电弧模型与SF6电弧模型串联的混合断路器模型。通过设定不同的系统仿真参数,研究开断过程中真空电弧和SF6电弧的相互作用及真空断路器与SF6断路器的分压关系;分析两断路器不同时刻分断的协同特性与介质恢复过程;量化研究混合断路器的断流容量增益特性。仿真结果证明,真空断口首先承担恢复电压有利于SF6断口的介质强度恢复;两断口间的电压分布关系主要由电弧电阻与断口间电容决定;在不增加SF6气体使用量的情况下混合断路器具有比SF6断路器更大的断流能力。研究结果为大容量混合断路器的设计提供了理论依据。%Hybrid circuit breaker with vacuum interrupter and SF6 interrupter in series makes the best use ot different are extinguishing characteristics of vacuum arc and SF6 arc to achieve high-current interruption. To study the interaction between vacuum arc and SF6 arc, we established a system simulation platform, a vacuum arc model (12 kV), and a SF6 arc model{40. 5 kV) by alternative transients program(ATP) and its transient analysis of control systems (TACS). Combining with the experimental oscillograph traces, we obtained practical model parameters of the vacuum arc and the SF6 arc; and established a hybrid circuit breaker model by connecting the vacuum arc model and the SF6 arc model in series. To study interactions and voltage distribution relations between vacuum arc and SF6 arc during current interruption process, we analyzed the

  9. Circuit for Driving Piezoelectric Transducers

    Science.gov (United States)

    Randall, David P.; Chapsky, Jacob

    2009-01-01

    The figure schematically depicts an oscillator circuit for driving a piezoelectric transducer to excite vibrations in a mechanical structure. The circuit was designed and built to satisfy application-specific requirements to drive a selected one of 16 such transducers at a regulated amplitude and frequency chosen to optimize the amount of work performed by the transducer and to compensate for both (1) temporal variations of the resonance frequency and damping time of each transducer and (2) initially unknown differences among the resonance frequencies and damping times of different transducers. In other words, the circuit is designed to adjust itself to optimize the performance of whichever transducer is selected at any given time. The basic design concept may be adaptable to other applications that involve the use of piezoelectric transducers in ultrasonic cleaners and other apparatuses in which high-frequency mechanical drives are utilized. This circuit includes three resistor-capacitor networks that, together with the selected piezoelectric transducer, constitute a band-pass filter having a peak response at a frequency of about 2 kHz, which is approximately the resonance frequency of the piezoelectric transducers. Gain for generating oscillations is provided by a power hybrid operational amplifier (U1). A junction field-effect transistor (Q1) in combination with a resistor (R4) is used as a voltage-variable resistor to control the magnitude of the oscillation. The voltage-variable resistor is part of a feedback control loop: Part of the output of the oscillator is rectified and filtered for use as a slow negative feedback to the gate of Q1 to keep the output amplitude constant. The response of this control loop is much slower than 2 kHz and, therefore, does not introduce significant distortion of the oscillator output, which is a fairly clean sine wave. The positive AC feedback needed to sustain oscillations is derived from sampling the current through the

  10. Plasmonic Nanoguides and Circuits

    CERN Document Server

    Bozhevolnyi, Sergey

    2008-01-01

    Modern communication systems dealing with huge amounts of data at ever increasing speed try to utilize the best aspects of electronic and optical circuits. Electronic circuits are tiny but their operation speed is limited, whereas optical circuits are extremely fast but their sizes are limited by diffraction. Waveguide components utilizing surface plasmon (SP) modes were found to combine the huge optical bandwidth and compactness of electronics, and plasmonics thereby began to be considered as the next chip-scale technology. In this book, the authors concentrate on the SP waveguide configurati

  11. Optoelectronics circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Optoelectronics Circuits Manual covers the basic principles and characteristics of the best known types of optoelectronic devices, as well as the practical applications of many of these optoelectronic devices. The book describes LED display circuits and LED dot- and bar-graph circuits and discusses the applications of seven-segment displays, light-sensitive devices, optocouplers, and a variety of brightness control techniques. The text also tackles infrared light-beam alarms and multichannel remote control systems. The book provides practical user information and circuitry and illustrations.

  12. Circuit analysis with Multisim

    CERN Document Server

    Baez-Lopez, David

    2011-01-01

    This book is concerned with circuit simulation using National Instruments Multisim. It focuses on the use and comprehension of the working techniques for electrical and electronic circuit simulation. The first chapters are devoted to basic circuit analysis.It starts by describing in detail how to perform a DC analysis using only resistors and independent and controlled sources. Then, it introduces capacitors and inductors to make a transient analysis. In the case of transient analysis, it is possible to have an initial condition either in the capacitor voltage or in the inductor current, or bo

  13. Modern TTL circuits manual

    CERN Document Server

    Marston, R M

    2013-01-01

    Modern TTL Circuits Manual provides an introduction to the basic principles of Transistor-Transistor Logic (TTL). This book outlines the major features of the 74 series of integrated circuits (ICs) and introduces the various sub-groups of the TTL family.Organized into seven chapters, this book begins with an overview of the basics of digital ICs. This text then examines the symbology and mathematics of digital logic. Other chapters consider a variety of topics, including waveform generator circuitry, clocked flip-flop and counter circuits, special counter/dividers, registers, data latches, com

  14. Pragmatic circuits frequency domain

    CERN Document Server

    Eccles, William

    2006-01-01

    Pragmatic Circuits: Frequency Domain goes through the Laplace transform to get from the time domain to topics that include the s-plane, Bode diagrams, and the sinusoidal steady state. This second of three volumes ends with a-c power, which, although it is just a special case of the sinusoidal steady state, is an important topic with unique techniques and terminology. Pragmatic Circuits: Frequency Domain is focused on the frequency domain. In other words, time will no longer be the independent variable in our analysis. The two other volumes in the Pragmatic Circuits series include titles on DC

  15. Gallium Arsenide Domino Circuit

    Science.gov (United States)

    Yang, Long; Long, Stephen I.

    1990-01-01

    Advantages include reduced power and high speed. Experimental gallium arsenide field-effect-transistor (FET) domino circuit replicated in large numbers for use in dynamic-logic systems. Name of circuit denotes mode of operation, which logic signals propagate from each stage to next when successive stages operated at slightly staggered clock cycles, in manner reminiscent of dominoes falling in a row. Building block of domino circuit includes input, inverter, and level-shifting substages. Combinational logic executed in input substage. During low half of clock cycle, result of logic operation transmitted to following stage.

  16. Troubleshooting analog circuits

    CERN Document Server

    Pease, Robert A

    1991-01-01

    Troubleshooting Analog Circuits is a guidebook for solving product or process related problems in analog circuits. The book also provides advice in selecting equipment, preventing problems, and general tips. The coverage of the book includes the philosophy of troubleshooting; the modes of failure of various components; and preventive measures. The text also deals with the active components of analog circuits, including diodes and rectifiers, optically coupled devices, solar cells, and batteries. The book will be of great use to both students and practitioners of electronics engineering. Other

  17. Monolithic microwave integrated circuits

    Science.gov (United States)

    Pucel, R. A.

    Monolithic microwave integrated circuits (MMICs), a new microwave technology which is expected to exert a profound influence on microwave circuit designs for future military systems as well as for the commercial and consumer markets, is discussed. The book contains an historical discussion followed by a comprehensive review presenting the current status in the field. The general topics of the volume are: design considerations, materials and processing considerations, monolithic circuit applications, and CAD, measurement, and packaging techniques. All phases of MMIC technology are covered, from design to testing.

  18. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  19. Latching overcurrent circuit breaker

    Science.gov (United States)

    Moore, M. L.

    1970-01-01

    Circuit breaker consists of a preset current amplitude sensor, and a lamp-photo-resistor combination in a feedback arrangement which energizes a power switching relay. The ac input power is removed from the load at predetermined current amplitudes.

  20. High temperature circuit breaker

    Science.gov (United States)

    Edwards, R. N.; Travis, E. F.

    1970-01-01

    Alternating current circuit breaker is suitable for reliable long-term service at 1000 deg F in the vacuum conditions of outer space. Construction materials are resistant to nuclear radiation and vacuum welding. Service test conditions and results are given.

  1. Microelectronics: The Nature of Work, Skills and Training. An Analysis of Case Studies from Developed and Developing Countries. Training Discussion Paper No. 51.

    Science.gov (United States)

    Acero, Liliana

    Microelectronic technologies have had an impact on the nature of work in industry for both white-collar and blue-collar workers. Evidence from sector- and enterprise-level studies shows changes in skills and job content for blue-collar workers involved with numerically controlled machine tools, robots, and other microelectronics applications.…

  2. Technological Change and Women Workers: The Development of Microelectronics. World Conference of the United Nations Decade for Women: Equality, Development, and Peace.

    Science.gov (United States)

    Hult, Marit

    This report reviews the current debate in industrialized market economy countries on the impact of microelectronics technology on employment. A special focus is on the impact on women's employment opportunities. Chapter 1 presents information on the technological background, including the development of microelectronics and their application in…

  3. Overriding Faulty Circuit Breakers

    Science.gov (United States)

    Robbins, Richard L.; Pierson, Thomas E.

    1987-01-01

    Retainer keeps power on in emergency. Simple mechanical device attaches to failed aircraft-type push/pull circuit breaker to restore electrical power temporarily until breaker replaced. Device holds push/pull button in closed position; unnecessary for crewmember to hold button in position by continual finger pressure. Sleeve and plug hold button in, overriding mechanical failure in circuit breaker. Windows in sleeve show button position.

  4. FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

    Science.gov (United States)

    Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

    2016-01-01

    These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

  5. Microelectronics Revolution And The Impact Of Automation In The New Industrialized Countries

    Science.gov (United States)

    Baranauskas, Vitor

    1984-08-01

    A brief review of some important historical points on the origin of the Factories and the Industrial Revolution is presented with emphasis in the social problems related to the automation of the human labor. Until the World War I, the social changes provoked by the Industrial Revolution caused one division of the World in developed and underdeveloped countries. After that period, the less developed nations began their industrialization mainly through the Multinationals Corporations (MC). These enterprises were very important to the production and exportation of utilities and manufactures in general, mainly in those products which required intensive and direct human labor. At present time, with the pervasiveness of microelectronics in the automation, this age seems to reaching an end because all continous processes in industry tend economicaly toward total automation. This fact will cause a retraction in long-term investments and, beyond massive unemployment, there is a tendency for these MC industries to return to their original countries. The most promising alternative to avoid these events, and perhaps the unique, is to incentive an autonomous development in areas of high technology, as for instance, the microelectronics itself.

  6. Results of external review Sandia microelectronics and microsystems program (September 2004).

    Energy Technology Data Exchange (ETDEWEB)

    Peercy, Paul S. (University of Wisconsin-Madison, Madision, WI); Myers, David R.

    2005-08-01

    The US Department of Energy requires a periodic assessment of the Microsystems Program at Sandia National Laboratories. An external review of this program is held approximately every 18 months to 24 months. The report from the External Review Panel serves as the basis for Sandia's ''self assessment'' and is a specific deliverable of the governance contract between Lockheed Martin and the Department of Energy. The External Review of Microelectronics and Microsystems for Fiscal Year 2004 was held September 27-29, 2004 at Sandia National Laboratories, Albuquerque, NM. The external review panel consisted of experts in the fields of microelectronics, photonics and microsystems from universities, industry and other Government agencies. A complete list of the panel members is included as Appendix A of the attached report. The review assessed four areas: relevance to national needs and agency mission; quality of science, technology and engineering; performance in the operation of a major facility; and program performance management and planning. Relevance to national needs and agency mission was rated as ''outstanding''. The quality of science, technology, and engineering was rated as ''outstanding''. Operation of a major facility was rated as ''outstanding'', and the category of program performance, management, and planning was rated as ''outstanding''. Sandia's Microsystems Program thus received an overall rating of ''outstanding'' [the highest possible rating].

  7. Microelectronics Reliability

    Science.gov (United States)

    2017-01-17

    convey any rights or permission to manufacture, use, or sell any patented invention that may relate to them. This report was cleared for public release...testing for reliability prediction of devices exhibiting multiple failure mechanisms. Also presented was an integrated accelerating and measuring ...13  Table 2  T, V, F and matrix versus  measured  FIT

  8. ST Microelectronics

    CERN Multimedia

    Patrice Loïez

    2002-01-01

    Photo 01 : Prof. Roger Cashmore, Research Director for Collider Programmes, Dr Salvatore Castorina, Corporate Vice President, DSG, Prof. Gigi Rolandi, CMS Tracker Project Manager. Photo 02 : Dr Salvatore Castorina signing the Guest Book. Photo 03 : Prof. Roger Cashmore, Dr Salvatore Castorina.

  9. Heterogeneous photonic integrated circuits

    Science.gov (United States)

    Fang, Alexander W.; Fish, Gregory; Hall, Eric

    2012-01-01

    Photonic Integrated Circuits (PICs) have been dichotomized into circuits with high passive content (silica and silicon PLCs) and high active content (InP tunable lasers and transceivers) due to the trade-off in material characteristics used within these two classes. This has led to restrictions in the adoption of PICs to systems in which only one of the two classes of circuits are required to be made on a singular chip. Much work has been done to create convergence in these two classes by either engineering the materials to achieve the functionality of both device types on a single platform, or in epitaxial growth techniques to transfer one material to the next, but have yet to demonstrate performance equal to that of components fabricated in their native substrates. Advances in waferbonding techniques have led to a new class of heterogeneously integrated photonic circuits that allow for the concurrent use of active and passive materials within a photonic circuit, realizing components on a transferred substrate that have equivalent performance as their native substrate. In this talk, we review and compare advances made in heterogeneous integration along with demonstrations of components and circuits enabled by this technology.

  10. A simple DNA gate motif for synthesizing large-scale circuits

    OpenAIRE

    2011-01-01

    The prospects of programming molecular systems to perform complex autonomous tasks has motivated research into the design of synthetic biochemical circuits. Of particular interest to us are cell-free nucleic acid systems that exploit non-covalent hybridization and strand displacement reactions to create cascades that implement digital and analog circuits. To date, circuits involving at most tens of gates have been demonstrated experimentally. Here, we propose a DNA catalytic gate architecture...

  11. Circuit simulation: some humbling thoughts

    Energy Technology Data Exchange (ETDEWEB)

    Wendt, Manfred; /Fermilab

    2006-01-01

    A short, very personal note on circuit simulation is presented. It does neither include theoretical background on circuit simulation, nor offers an overview of available software, but just gives some general remarks for a discussion on circuit simulator needs in context to the design and development of accelerator beam instrumentation circuits and systems.

  12. Simplifying the circuit of Josephson parametric converters

    Science.gov (United States)

    Abdo, Baleegh; Brink, Markus; Chavez-Garcia, Jose; Keefe, George

    Josephson parametric converters (JPCs) are quantum-limited three-wave mixing devices that can play various important roles in quantum information processing in the microwave domain, including amplification of quantum signals, transduction of quantum information, remote entanglement of qubits, nonreciprocal amplification, and circulation of signals. However, the input-output and biasing circuit of a state-of-the-art JPC consists of bulky components, i.e. two commercial off-chip broadband 180-degree hybrids, four phase-matched short coax cables, and one superconducting magnetic coil. Such bulky hardware significantly hinders the integration of JPCs in scalable quantum computing architectures. In my talk, I will present ideas on how to simplify the JPC circuit and show preliminary experimental results

  13. Hybrid Baryons

    CERN Document Server

    Page, P R

    2003-01-01

    We review the status of hybrid baryons. The only known way to study hybrids rigorously is via excited adiabatic potentials. Hybrids can be modelled by both the bag and flux-tube models. The low-lying hybrid baryon is N 1/2^+ with a mass of 1.5-1.8 GeV. Hybrid baryons can be produced in the glue-rich processes of diffractive gamma N and pi N production, Psi decays and p pbar annihilation.

  14. Simulation Study on the Open-Circuit Voltage of Amorphous Silicon p-i-n Solar Cells Using AMPS-1D

    Directory of Open Access Journals (Sweden)

    B.M. Omer

    2014-04-01

    Full Text Available AMPS-1D (Analysis of Microelectronic and Photonic Structure simulation program was used to simulate Amorphous Silicon p-i-n Solar Cell. The simulated result of illuminated current density-voltage characteristics was in a good agreement with experimental values. The dependence of the open-circuit voltage on the characteristics of the a-Si:H intrinsic layer was investigated. The simulation result shows that the open-circuit voltage does not depend on the thickness of the intrinsic layer. The open-circuit voltage decreases when the front contact barrier height is small or the energy gap of the intrinsic layer is small. The open-circuit voltage increases when the distribution of the tail states is sharp or the capture cross sections of these states are small.

  15. Low latency asynchronous interface circuits

    Energy Technology Data Exchange (ETDEWEB)

    Sadowski, Greg

    2017-06-20

    In one form, a logic circuit includes an asynchronous logic circuit, a synchronous logic circuit, and an interface circuit coupled between the asynchronous logic circuit and the synchronous logic circuit. The asynchronous logic circuit has a plurality of asynchronous outputs for providing a corresponding plurality of asynchronous signals. The synchronous logic circuit has a plurality of synchronous inputs corresponding to the plurality of asynchronous outputs, a stretch input for receiving a stretch signal, and a clock output for providing a clock signal. The synchronous logic circuit provides the clock signal as a periodic signal but prolongs a predetermined state of the clock signal while the stretch signal is active. The asynchronous interface detects whether metastability could occur when latching any of the plurality of the asynchronous outputs of the asynchronous logic circuit using said clock signal, and activates the stretch signal while the metastability could occur.

  16. A semiconductor laser excitation circuit

    Energy Technology Data Exchange (ETDEWEB)

    Kaadzunari, O.; Masaty, K.

    1984-03-27

    A semiconductor laser excitation circuit is patented that is designed for operation in a pulsed mode with a high pulse repetition frequency. This circuit includes, in addition to a semiconductor laser, a high speed photodetector, a reference voltage source, a comparator, and a pulse oscillator and modulator. If the circuit is built using standard silicon integrated circuits, its speed amounts to several hundred megahertz, if it is constructed using gallium arsenide integrated circuits, its speed is several gigahertz.

  17. Inspection of integrated circuits through the microfocus radiography technique; Inspecao de circuitos integrados atraves da tecnica radiografia microfocada

    Energy Technology Data Exchange (ETDEWEB)

    Scofano, Carmelo Fabio; Staszczak, Eduardo Jose; Rebello, Joao Marcos Alcoforado [Universidade Federal, Rio de Janeiro, RJ (Brazil). Coordenacao dos Programas de Pos-graduacao de Engenharia

    1995-12-31

    The application of microfocus radiography technique for integrated circuits inspection is evaluated. The experiments were performed according to the international standards for micro-electronic components. In order to define the operational parameters, factors such as contrast and image definition were considered, and by varying the voltage and amperage applied to the X-ray apparatus it was tried to obtain radiographic images with an adequate resolution. the results show that this technique is a promising tool for evaluating these components. 17 refs., 16 figs., 2 tabs.

  18. The Mind Grows Circuits

    CERN Document Server

    Panigrahy, Rina

    2012-01-01

    There is a vast supply of prior art that study models for mental processes. Some studies in psychology and philosophy approach it from an inner perspective in terms of experiences and percepts. Others such as neurobiology or connectionist-machines approach it externally by viewing the mind as complex circuit of neurons where each neuron is a primitive binary circuit. In this paper, we also model the mind as a place where a circuit grows, starting as a collection of primitive components at birth and then builds up incrementally in a bottom up fashion. A new node is formed by a simple composition of prior nodes when we undergo a repeated experience that can be described by that composition. Unlike neural networks, however, these circuits take "concepts" or "percepts" as inputs and outputs. Thus the growing circuits can be likened to a growing collection of lambda expressions that are built on top of one another in an attempt to compress the sensory input as a heuristic to bound its Kolmogorov Complexity.

  19. Nonlinear optics quantum computing with circuit QED.

    Science.gov (United States)

    Adhikari, Prabin; Hafezi, Mohammad; Taylor, J M

    2013-02-08

    One approach to quantum information processing is to use photons as quantum bits and rely on linear optical elements for most operations. However, some optical nonlinearity is necessary to enable universal quantum computing. Here, we suggest a circuit-QED approach to nonlinear optics quantum computing in the microwave regime, including a deterministic two-photon phase gate. Our specific example uses a hybrid quantum system comprising a LC resonator coupled to a superconducting flux qubit to implement a nonlinear coupling. Compared to the self-Kerr nonlinearity, we find that our approach has improved tolerance to noise in the qubit while maintaining fast operation.

  20. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    Science.gov (United States)

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  1. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    Science.gov (United States)

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  2. Determining DfT Hardware by VHDL-AMS Fault Simulation for Biological Micro-Electronic Fluidic Arrays

    NARCIS (Netherlands)

    Kerkhoff, H.G.; Zhang, X.; Liu, H.; Richardson, A.; Nouet, P.; Azais, F.

    2005-01-01

    The interest of microelectronic fluidic arrays for biomedical applications, like DNA determination, is rapidly increasing. In order to evaluate these systems in terms of required Design-for-Test structures, fault simulations in both fluidic and electronic domains are necessary. VHDL-AMS can be used

  3. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    NARCIS (Netherlands)

    Yazdan Mehr, M.; Bahrami, A.; Fischer, H.; Gielen, S.; Corbeij, R.; van Driel, W.D.; Zhang, G.Q.

    2015-01-01

    In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as

  4. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    NARCIS (Netherlands)

    Yazdan Mehr, M.; Bahrami, A.; Fischer, H.; Gielen, S.; Corbeij, R.; van Driel, W.D.; Zhang, G.Q.

    2015-01-01

    In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as

  5. RD53A Integrated Circuit Specifications

    CERN Document Server

    Garcia-Sciveres, Mauricio

    2015-01-01

    Specifications for the RD53 collaboration’s first engineering wafer run of an integrated circuit (IC) for hybrid pixel detector readout, called RD53A. RD53A is intended to demonstrate in a large format IC the suitability of the technology (including radiation tolerance), the stable low threshold operation, and the high hit and trigger rate capabilities, required for HL-LHC upgrades of ATLAS and CMS. The wafer scale production will permit the experiments to prototype bump bonding assembly with realistic sensors in this new technology and to measure the performance of hybrid assemblies. RD53A is not intended to be a final production IC for use in an experiment, and will contain design variations for testing purposes, making the pixel matrix non-uniform.

  6. Chaotic memristive circuit: equivalent circuit realization and dynamical analysis

    Institute of Scientific and Technical Information of China (English)

    Bao Bo-Cheng; Xu Jian-Ping; Zhou Guo-Hua; Ma Zheng-Hua; Zou Ling

    2011-01-01

    In this paper,a practical equivalent circuit of an active flux-controlled memristor characterized by smooth piecewise-quadratic nonlinearity is designed and an experimental chaotic memristive circuit is implemented.The chaotic memristive circuit has an equilibrium set and its stability is dependent on the initial state of the memristor.The initial state-dependent and the circuit parameter-dependent dynamics of the chaotic memristive circuit are investigated via phase portraits,bifurcation diagrams and Lyapunov exponents.Both experimental and simulation results validate the proposed equivalent circuit realization of the active flux-controlled memristor.

  7. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  8. Current Conveyor Equivalent Circuits

    Directory of Open Access Journals (Sweden)

    Tejmal S. Rathore

    2012-02-01

    Full Text Available An equivalence between a class of (current conveyor CC II+ and CC II- circuits is established. CC IIequivalent circuit uses one extra element. However, under certain condition, the extra element can be eliminated. As an illustration of the application of this equivalence, minimal first and second order all-pass filters are derived. Incertain cases, it is possible to compensate the effect of the input resistor of CC at port X. At the end, an open problem of realizing an Nth order (N > 2 minimal all-pass filter is stated.

  9. Circuit design for reliability

    CERN Document Server

    Cao, Yu; Wirth, Gilson

    2015-01-01

    This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units.  The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management. Provides comprehensive review on various reliability mechanisms at sub-45nm nodes; Describes practical modeling and characterization techniques for reliability; Includes thorough presentation of robust design techniques for major VLSI design units; Promotes physical understanding with first-principle simulations.

  10. Inrush Current Control Circuit

    Science.gov (United States)

    Cole, Steven W. (Inventor)

    2002-01-01

    An inrush current control circuit having an input terminal connected to a DC power supply and an output terminal connected to a load capacitor limits the inrush current that charges up the load capacitor during power up of a system. When the DC power supply applies a DC voltage to the input terminal, the inrush current control circuit produces a voltage ramp at the load capacitor instead of an abrupt DC voltage. The voltage ramp results in a constant low level current to charge up the load capacitor, greatly reducing the current drain on the DC power supply.

  11. Electronic circuits fundamentals & applications

    CERN Document Server

    Tooley, Mike

    2015-01-01

    Electronics explained in one volume, using both theoretical and practical applications.New chapter on Raspberry PiCompanion website contains free electronic tools to aid learning for students and a question bank for lecturersPractical investigations and questions within each chapter help reinforce learning Mike Tooley provides all the information required to get to grips with the fundamentals of electronics, detailing the underpinning knowledge necessary to appreciate the operation of a wide range of electronic circuits, including amplifiers, logic circuits, power supplies and oscillators. The

  12. Hybrid power semiconductor

    Science.gov (United States)

    Chen, D. Y.

    1985-10-01

    The voltage rating of a bipolar transistor may be greatly extended while at the same time reducing its switching time by operating it in conjunction with FETs in a hybrid circuit. One FET is used to drive the bipolar transistor while the other FET is connected in series with the transistor and an inductive load. Both FETs are turned on or off by a single drive signal of load power, the second FET upon ceasing conductions, rendering one power electrode of the bipolar transistor open. Means are provided to dissipate currents which flow after the bipolar transistor is rendered nonconducting.

  13. Evaluation of advanced microelectronics for inclusion in MIL-STD-975

    Science.gov (United States)

    Scott, W. Richard

    1991-03-01

    The approach taken by NASA and JPL (Jet Propulsion Laboratory) in the development of a MIL-STD-975 section which contains advanced technology such as Large Scale Integration and Very Large Scale Integration (LSI/VLSI) microelectronic devices is described. The parts listed in this section are recommended as satisfactory for NASA flight applications, in the absence of alternate qualified devices, based on satisfactory results of a vendor capability audit, the availability of sufficient characterization and reliability data from the manufacturers and users and negotiated detail procurement specifications. The criteria used in the selection and evaluation of the vendors and candidate parts, the preparation of procurement specifications, and the status of this activity are discussed.

  14. Two-dimensional Green`s function Poisson solution appropriate for feature-scale microelectronics simulations

    Energy Technology Data Exchange (ETDEWEB)

    Riley, M.E.

    1998-03-01

    This report describes the numerical procedure used to implement the Green`s function method for solving the Poisson equation in two-dimensional Cartesian coordinates. The procedure can determine the solution to a problem with any or all of applied voltage boundary conditions, dielectric media, floating (insulated) conducting media, dielectric surface charging, periodic (reflective) boundary conditions, and volumetric space charge. The numerical solution is reasonably fast, and the dimension of the linear problem to be solved is that of the number of elements needed to represent the surfaces, not the whole computational volume. The method of solution is useful in the simulation of plasma particle motion in the vicinity of complex surface structures as found in microelectronics plasma processing applications. A FORTRAN implementation of this procedure is available from the author.

  15. West Europe report: Science and technology. FRG: Concept paper on microelectronics, communications technology

    Science.gov (United States)

    1984-07-01

    Precisely because the Federal Republic of Germany is a nation with a strong export orientation the capability to develop and apply, with an eye to the market, modern information and communication technologies and microelectronics which provides the basis for them has a very important bearing on the nations competitive position. To attain a leadership position in information technology, the men and women of the FRG must take up the challenge of this technology in terms of training and continuing education as well as in the media and in public life. Industry must agressively seek out markets and engage in international competition and the state must remove existing obstacles and create the kind of conditions that will make its assistance programs most effective. Programs which reflect the government's resolve to meet the challenge of information technology and to help improve the FRG's competitive position in this field are outlined.

  16. Synthesis оf Optoelectronic System for Control оf Microelectronic Structures

    Directory of Open Access Journals (Sweden)

    G. A. Trapashko

    2014-01-01

    Full Text Available Development of optoelectronic systems for registration of structuring element images demands improvement of the equipment for control of sizes and a form of microelectronic structures in accordance with design data and absence of introduced defects and impurities. For synthesis of these systems it is necessary to use a special method which allows to substantiate the use of a radiation source in it and  determine main functional parameters of the optoelectronic system. The paper presents the results of the method that has been used for development of the optoelectronic system operating  with the resolution of 250 nanometers. It has been shown that LED lamps can be used instead of traditionally used halogen and mercury-xenon lamps in the control equipment.

  17. Microelectronic image sensors: A report from the Charge Transfer Device (CTD) team at FOA 3

    Science.gov (United States)

    Engstroem, O.; Persson, S. T.; Pettersson, H.; Ryden, K. H.

    1985-05-01

    Three concepts of microelectronic image sensors where the photo effects are based on the properties of interfaces between silicon and metal silicides or insulators were investigated. An infrared sensitive image sensor for the 3 to 5 micron wavelength range was prepared. The photosensitive elements, patterned as a 4 x 4 matrix, consist of palladium silicide Schottky-diodes. Addressing of the different picture elements is made from shift registers placed on the same silicon chip. A concept for the storage of optical information was created. The basic principle relies on the possibilities to store electrons in deep lying energy levels in an insulator layer grown on silicon. A metal-insulator-semiconductor device, where the possibility of interaction between two images at the insulator-semiconductor interface is utilized for image recognition, was derived.

  18. Study of a two-stage photobase generator for photolithography in microelectronics.

    Science.gov (United States)

    Turro, Nicholas J; Li, Yongjun; Jockusch, Steffen; Hagiwara, Yuji; Okazaki, Masahiro; Mesch, Ryan A; Schuster, David I; Willson, C Grant

    2013-03-01

    The investigation of the photochemistry of a two-stage photobase generator (PBG) is described. Absorption of a photon by a latent PBG (1) (first step) produces a PBG (2). Irradiation of 2 in the presence of water produces a base (second step). This two-photon sequence (1 + hν → 2 + hν → base) is an important component in the design of photoresists for pitch division technology, a method that doubles the resolution of projection photolithography for the production of microelectronic chips. In the present system, the excitation of 1 results in a Norrish type II intramolecular hydrogen abstraction to generate a 1,4-biradiacal that undergoes cleavage to form 2 and acetophenone (Φ ∼ 0.04). In the second step, excitation of 2 causes cleavage of the oxime ester (Φ = 0.56) followed by base generation after reaction with water.

  19. Effects of occupational stress on the physical and psychological health of women in a microelectronics plant.

    Science.gov (United States)

    Bromet, E J; Dew, M A; Parkinson, D K; Cohen, S; Schwartz, J E

    1992-06-01

    Physical and psychological effects of occupational stress were examined in a sample of 552 female blue collar employees of a microelectronics facility. After controlling for demographic and biological risk factors, non-work life events, and solvent exposure, job-related conflict was associated with depressive symptomatology, severe headaches, lightheadedness weakness/fatigue, rashes, and presence of multiple symptoms. Job demands were only associated with multiple symptoms. Solvent exposure did not interact with either of the job stress measures synergistically to increase symptom reports. Although the main effects of social support, when present, were in the direction of reducing symptomatology, the interactive effects of social support and stress on health were inconsistent and dependent on the source of support.

  20. Phase transformation in SiOx/SiO₂ multilayers for optoelectronics and microelectronics applications.

    Science.gov (United States)

    Roussel, M; Talbot, E; Pratibha Nalini, R; Gourbilleau, F; Pareige, P

    2013-09-01

    Due to the quantum confinement, silicon nanoclusters (Si-ncs) embedded in a dielectric matrix are of prime interest for new optoelectronics and microelectronics applications. In this context, SiO(x)/SiO₂ multilayers have been prepared by magnetron sputtering and subsequently annealed to induce phase separation and Si clusters growth. The aim of this paper is to study phase separation processes and formation of nanoclusters in SiO(x)/SiO₂ multilayers by atom probe tomography. Influences of the silicon supersaturation, annealing temperature and SiO(x) and SiO₂ layer thicknesses on the final microstructure have been investigated. It is shown that supersaturation directly determines phase separation regime between nucleation/classical growth and spinodal decomposition. Annealing temperature controls size of the particles and interface with the surrounding matrix. Layer thicknesses directly control Si-nc shapes from spherical to spinodal-like structures.

  1. Single event upsets of spacecraft microelectronics exposed to solar cosmic rays.

    Science.gov (United States)

    Kuznetsov, N V; Nymmik, R A

    1996-11-01

    The technique for evaluating the SEU rate induced by solar particle incidence on spacecraft microelectronics is described, including the contributions from the primary (heavy ion-induced) and secondary proton-induced) SEU mechanisms. The technique is based on original computational models for solar particle energy spectra and for SEU occurrence in electronics. The technique was used to analyze the data of the TDRS-1 Fairchild 93L422 IC exposed to protons and ions during the solar cosmic ray event of September-October 1989. The analysis included the distribution of the microcircuit shielding. A strong dependence of solar proton-to-ion ratio on the shielding thickness was indicated by the calculations.

  2. Electrodeposition of Alloys and Compounds in the Era of Microelectronics and Energy Conversion Technology

    Directory of Open Access Journals (Sweden)

    Giovanni Zangari

    2015-06-01

    Full Text Available Electrochemical deposition methods are increasingly being applied to advanced technology applications, such as microelectronics and, most recently, to energy conversion. Due to the ever growing need for device miniaturization and enhanced performance, vastly improved control of the growth process is required, which in turn necessitates a better understanding of the fundamental phenomena involved. This overview describes the current status of and latest advances in electrodeposition science and technology. Electrochemical growth phenomena are discussed at the macroscopic and atomistic scale, while particular attention is devoted to alloy and compound formation, as well as surface-limited processes. Throughout, the contribution of Professor Foresti and her group to the understanding of electrochemical interfaces and electrodeposition, is highlighted.

  3. Characterization of the Effect of Au/Al Bondpad Corrosion on Microelectronic Device Reliability

    Energy Technology Data Exchange (ETDEWEB)

    BRAITHWAITE,JEFFREY W.; MICHAEL,JOSEPH R.; PETERSON,DAVID W.; ROBINSON,DAVID G.; SORENSEN,NEIL R.; STRIZICH,M.P.

    1999-10-07

    A methodology has been established to predict the effect of atmospheric corrosion on the reliability of plastic encapsulated microelectronic (PEM) devices. New experimental techniques were developed to directly characterize the Al/Au wirebond interface where corrosion primarily occurs. A deterministic empirical model describing wirebond degradation as a function of environmental conditions was generated. To demonstrate how this model can be used to determine corrosion effects on device reliability, a numerical simulation was performed on a three-lead voltage reference device. Surface reaction rate constants, environmental variables and the defect characteristics of the encapsulant were treated as distributed parameters. A Sandia-developed analytical framework (CRAX{trademark}) was used to include uncertainty in the analysis and directly calculate reliability.

  4. Application of Aloe vera gel instead of silicon dioxide as organic dielectric material in microelectronics

    Directory of Open Access Journals (Sweden)

    Rana Sardar Masud

    2015-09-01

    Full Text Available Organic materials are now being used in a wide range of microelectronic applications in parallel with inorganic materials, because of their superior properties, environmental safety, and low cost. This paper describes the characterization of Aloe vera gel (AVG, a new organic dielectric material. The surface morphology, spatial distribution of elements, and structural characteristics of an AVG layer were examined using scanning electron microscopy, energy-dispersive X-ray spectroscopy (EDX, and X-ray diffraction (XRD, respectively. The resistance of the AVG layer, determined using a four-probe station, was 640 Ω EDX showed that the elements contained in the layer were carbon, oxygen, aluminum, silicon, calcium, potassium, and copper. The XRD results suggested that the sample primarily consisted of bornite (Cu5FeS4, geerite (Cu8S5, sal ammoniac (NH4Cl, and carobbite (KF.

  5. Simulation of ion beam induced current in radiation detectors and microelectronic devices.

    Energy Technology Data Exchange (ETDEWEB)

    Vizkelethy, Gyorgy

    2009-10-01

    Ionizing radiation is known to cause Single Event Effects (SEE) in a variety of electronic devices. The mechanism that leads to these SEEs is current induced by the radiation in these devices. While this phenomenon is detrimental in ICs, this is the basic mechanism behind the operation of semiconductor radiation detectors. To be able to predict SEEs in ICs and detector responses we need to be able to simulate the radiation induced current as the function of time. There are analytical models, which work for very simple detector configurations, but fail for anything more complex. On the other end, TCAD programs can simulate this process in microelectronic devices, but these TCAD codes costs hundreds of thousands of dollars and they require huge computing resources. In addition, in certain cases they fail to predict the correct behavior. A simulation model based on the Gunn theorem was developed and used with the COMSOL Multiphysics framework.

  6. Advanced modeling and simulation to design and manufacture high performance and reliable advanced microelectronics and microsystems.

    Energy Technology Data Exchange (ETDEWEB)

    Nettleship, Ian (University of Pittsburgh, Pittsburgh, PA); Hinklin, Thomas; Holcomb, David Joseph; Tandon, Rajan; Arguello, Jose Guadalupe, Jr. (,; .); Dempsey, James Franklin; Ewsuk, Kevin Gregory; Neilsen, Michael K.; Lanagan, Michael (Pennsylvania State University, University Park, PA)

    2007-07-01

    An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.

  7. Trieste conference on digital microelectronics and microprocessors in particle physics: Summary and concluding remarks

    Energy Technology Data Exchange (ETDEWEB)

    Nash, T.

    1988-08-01

    This paper is a written version of the Concluding Remarks presented at the International Conference on the Impact of Digital Microelectronics and Microprocessors on Particle Physics. The Conference emphasized on-line data acquisition and triggering problems in high energy physics. Among the participants there was a clearly growing consensus that as these real time systems become larger they require more attention from the beginning to overall system coherence and manageability issues. We consider what this means for SSC/LHC era detectors. Given the interesting results on pixel silicon, neural networks, and parallel microprocessor based computers presented at Trieste, we speculate on some surprisingly simple, though still very radical, ideas on systems solutions for those huge detectors.

  8. SAVANT analysis of the microelectronics and photonics testbed solar cell data

    Energy Technology Data Exchange (ETDEWEB)

    Walters, Robert J.; Summers, G.P. [Naval Research Lab., Code 6818, Washington, DC (United States); Messenger, S.R. [SFA, Inc., Largo, MD (United States); Morton, T.L. [Ohio Aerospace Inst., Cleveland, OH (United States)

    2005-07-01

    An analysis of solar array data from the Microelectronic and Photonic Testbed (MPTB) space experiment is presented. The data are analyzed using the displacement damage dose (D{sub d}) methodology developed by the US Naval Research Laboratory (NRL) as implemented in the Solar Array Verification and Analysis Tool (SAVANT). SAVANT is a WindowsTM-based computer code that predicts the on-orbit performance of a solar cell in a specified Earth orbit. The predicted solar cell performance produced by the SAVANT code are compared with the measured on-orbit data. In addition, the calculated data are compared with onboard dosimeter measurements. The results allow both a validation of the SAVANT code and a comparison of the space environment models with measured on-orbit data. The results show the models to match the measured data within a factor of 2. (Author)

  9. Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages.

    Science.gov (United States)

    Carlton, Holly D; Elmer, John W; Li, Yan; Pacheco, Mario; Goyal, Deepak; Parkinson, Dilworth Y; MacDowell, Alastair A

    2016-04-13

    Synchrotron radiation micro-tomography (SRµT) is a non-destructive three-dimensional (3D) imaging technique that offers high flux for fast data acquisition times with high spatial resolution. In the electronics industry there is serious interest in performing failure analysis on 3D microelectronic packages, many which contain multiple levels of high-density interconnections. Often in tomography there is a trade-off between image resolution and the volume of a sample that can be imaged. This inverse relationship limits the usefulness of conventional computed tomography (CT) systems since a microelectronic package is often large in cross sectional area 100-3,600 mm(2), but has important features on the micron scale. The micro-tomography beamline at the Advanced Light Source (ALS), in Berkeley, CA USA, has a setup which is adaptable and can be tailored to a sample's properties, i.e., density, thickness, etc., with a maximum allowable cross-section of 36 x 36 mm. This setup also has the option of being either monochromatic in the energy range ~7-43 keV or operating with maximum flux in white light mode using a polychromatic beam. Presented here are details of the experimental steps taken to image an entire 16 x 16 mm system within a package, in order to obtain 3D images of the system with a spatial resolution of 8.7 µm all within a scan time of less than 3 min. Also shown are results from packages scanned in different orientations and a sectioned package for higher resolution imaging. In contrast a conventional CT system would take hours to record data with potentially poorer resolution. Indeed, the ratio of field-of-view to throughput time is much higher when using the synchrotron radiation tomography setup. The description below of the experimental setup can be implemented and adapted for use with many other multi-materials.

  10. A Hybrid IC Lead Circumcolumnar Welding Technology%一种混合厚膜电路引线绕焊技术

    Institute of Scientific and Technical Information of China (English)

    周峻霖; 夏俊生; 侯育增; 肖勇兵

    2012-01-01

    混合厚膜电路工艺加工中,微电子引线焊接既是制造中的关键工艺技术,又是研究最为薄弱之处。混合厚膜功率电路工作温度较高,组件安装温度可达300℃左右,如使用含铅普通低温焊料,整件组装时会导致焊料熔融、引线移位、电路失效,影响焊接可靠性。文章详细介绍了一种引线绕焊技术,通过工艺实验说明了研究过程,结合高低温焊料使用获得较实用的绕焊工艺实施方法和要求,保证了镀银铜线的高温焊接强度,提高了功率及航天电路外引线焊接可靠性。%Microelectronic lead welding is both key processing technology and the weakest point of Hybrid IC research. Hybrid Power circuits maintains high working temperature, the module assembly temperature could reach 300~C; while applied with common solder paste in Lead welding, the high temperature raised during device assembly would cause the internal solder paste to melt, then the leads would move off from their original locations, leading to circuits failure & lowering-down of comprehensive welding reliability. This paper introduced an Lead Circumcolumnar Welding technology, and also described the research course and experiments. Moreover, through many examples and test data, it verified a practical processing method and criterion of Lead Circumcolumnar Welding using varied solder pastes, obtained the welding Specification. Through research, the silver-plated copper wire welding strength has been assured, and the oower & soace aoolication circuits lead weldin~ reliability bein~ ~reatlv imoroved.

  11. Improved charge amplifier using hybrid hysteresis compensation

    Science.gov (United States)

    Amin-Shahidi, Darya; Trumper, David L.

    2013-08-01

    We present a novel charge amplifier, with a robust feedback circuit and a method for compensating piezoelectric actuator's hysteresis at low frequencies. The amplifier uses a modified feedback circuit which improves robustness to the addition of series load impedance such as in cabling. We also describe a hybrid hysteresis compensation method for enabling the charge amplifier to reduce hysteresis at low frequencies. Experimental results demonstrate the utility of the new amplifier design.

  12. Proceedings of the ECOM Hybrid Microcircuit Symposium, 1976

    Science.gov (United States)

    1976-06-01

    For Low Cost Avionics W. W. Staley , Westinghouse Electric Corporation 372 SDI Modules J. Fishel, Circuit Technology Inc. 385 Hybrid Thick Film...or Gerber plotters. i Drawings, when required, are usually generated from the circuit layout. They may be used as assembly aids or inspection guides...TCVCXO-I (left) and TCVCXO-II. <A <•SA 4 . .4’.374 SEM/HYBRIDS, PARTN1.RS FOR LOW COST AVIONICS W. W. Staley Systems Development Division

  13. Hybrid battery with bi-directional DC/DC converter

    Directory of Open Access Journals (Sweden)

    DUDRIK Jaroslav

    2010-05-01

    Full Text Available Bi-directional buck-boost DC/DC converterfor hybrid battery is described in this paper. The firstpart of the paper is aimed at concept of hybrid battery;main advance compared to conventional accumulatoris explained there. Control circuit with UC3637 andpower circuit of the converter are described in thesecond part of the paper. Experimental results frommeasuring of converter are mentioned in the last part.

  14. ESD analog circuits and design

    CERN Document Server

    Voldman, Steven H

    2014-01-01

    A comprehensive and in-depth review of analog circuit layout, schematic architecture, device, power network and ESD design This book will provide a balanced overview of analog circuit design layout, analog circuit schematic development, architecture of chips, and ESD design.  It will start at an introductory level and will bring the reader right up to the state-of-the-art. Two critical design aspects for analog and power integrated circuits are combined. The first design aspect covers analog circuit design techniques to achieve the desired circuit performance. The second and main aspect pres

  15. Bioluminescent bioreporter integrated circuit

    Energy Technology Data Exchange (ETDEWEB)

    Simpson, Michael L. (Knoxville, TN); Sayler, Gary S. (Blaine, TN); Paulus, Michael J. (Knoxville, TN)

    2000-01-01

    Disclosed are monolithic bioelectronic devices comprising a bioreporter and an OASIC. These bioluminescent bioreporter integrated circuit are useful in detecting substances such as pollutants, explosives, and heavy-metals residing in inhospitable areas such as groundwater, industrial process vessels, and battlefields. Also disclosed are methods and apparatus for environmental pollutant detection, oil exploration, drug discovery, industrial process control, and hazardous chemical monitoring.

  16. Superconducting Quantum Circuits

    NARCIS (Netherlands)

    Majer, J.B.

    2002-01-01

    This thesis describes a number of experiments with superconducting cir- cuits containing small Josephson junctions. The circuits are made out of aluminum islands which are interconnected with a very thin insulating alu- minum oxide layer. The connections form a Josephson junction. The current trough

  17. Quantum secure circuit evaluation

    Institute of Scientific and Technical Information of China (English)

    CHEN Huanhuan; LI Bin; ZHUANG Zhenquan

    2004-01-01

    In order to solve the problem of classical secure circuit evaluation, this paper proposes a quantum approach. In this approach, the method of inserting redundant entangled particles and quantum signature has been employed to strengthen the security of the system. Theoretical analysis shows that our solution is secure against classical and quantum attacks.

  18. Applications of advanced hybrid organic-inorganic nanomaterials: from laboratory to market.

    Science.gov (United States)

    Sanchez, Clément; Belleville, Philippe; Popall, Michael; Nicole, Lionel

    2011-02-01

    Today cross-cutting approaches, where molecular engineering and clever processing are synergistically coupled, allow the chemist to tailor complex hybrid systems of various shapes with perfect mastery at different size scales, composition, functionality, and morphology. Hybrid materials with organic-inorganic or bio-inorganic character represent not only a new field of basic research but also, via their remarkable new properties and multifunctional nature, hybrids offer prospects for many new applications in extremely diverse fields. The description and discussion of the major applications of hybrid inorganic-organic (or biologic) materials are the major topic of this critical review. Indeed, today the very large set of accessible hybrid materials span a wide spectrum of properties which yield the emergence of innovative industrial applications in various domains such as optics, micro-electronics, transportation, health, energy, housing, and the environment among others (526 references).

  19. Charge Qubit-Atom Hybrid

    CERN Document Server

    Yu, Deshui; Hufnagel, C; Kwek, L C; Amico, Luigi; Dumke, R

    2016-01-01

    We investigate a novel hybrid system of a superconducting charge qubit interacting directly with a single neutral atom via electric dipole coupling. Interfacing of the macroscopic superconducting circuit with the microscopic atomic system is accomplished by varying the gate capacitance of the charge qubit. To achieve strong interaction, we employ two Rydberg states with an electric-dipole-allowed transition, which alters the polarizability of the dielectric medium of the gate capacitor. Sweeping the gate voltage with different rates leads to a precise control of hybrid quantum states. Furthermore, we show a possible implementation of a universal two-qubit gate.

  20. Hybrid winding concept for toroids

    DEFF Research Database (Denmark)

    Schneider, Henrik; Andersen, Thomas; Knott, Arnold;

    2013-01-01

    This paper proposes a hybrid winding concept for toroids using the traces in a printed circuit board to make connection to bended copper foil cutouts. In a final product a number of strips with a certain thickness would be held by a former and the whole assembly could be placed by pick...... and placement machinery. This opens up the possibility for both an automated manufacturing process and an automated production process of toroidal magnetics such as power inductors, filtering inductors, air core inductors, transformers etc. Both the proposed hybrid and the common wire wound winding...