WorldWideScience

Sample records for heated microelectronics manufacturing

  1. Automatic differentiation for gradient-based optimization of radiatively heated microelectronics manufacturing equipment

    Energy Technology Data Exchange (ETDEWEB)

    Moen, C.D.; Spence, P.A.; Meza, J.C.; Plantenga, T.D.

    1996-12-31

    Automatic differentiation is applied to the optimal design of microelectronic manufacturing equipment. The performance of nonlinear, least-squares optimization methods is compared between numerical and analytical gradient approaches. The optimization calculations are performed by running large finite-element codes in an object-oriented optimization environment. The Adifor automatic differentiation tool is used to generate analytic derivatives for the finite-element codes. The performance results support previous observations that automatic differentiation becomes beneficial as the number of optimization parameters increases. The increase in speed, relative to numerical differences, has a limited value and results are reported for two different analysis codes.

  2. Microelectronics to nanoelectronics materials, devices & manufacturability

    CERN Document Server

    Kaul, Anupama B

    2012-01-01

    Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena.Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology's Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and

  3. Free-world microelectronic manufacturing equipment

    Science.gov (United States)

    Kilby, J. S.; Arnold, W. H.; Booth, W. T.; Cunningham, J. A.; Hutcheson, J. D.; Owen, R. W.; Runyan, W. R.; McKenney, Barbara L.; McGrain, Moira; Taub, Renee G.

    1988-12-01

    Equipment is examined and evaluated for the manufacture of microelectronic integrated circuit devices and sources for that equipment within the Free World. Equipment suitable for the following are examined: single-crystal silicon slice manufacturing and processing; required lithographic processes; wafer processing; device packaging; and test of digital integrated circuits. Availability of the equipment is also discussed, now and in the near future. Very adequate equipment for most stages of the integrated circuit manufacturing process is available from several sources, in different countries, although the best and most widely used versions of most manufacturing equipment are made in the United States or Japan. There is also an active market in used equipment, suitable for manufacture of capable integrated circuits with performance somewhat short of the present state of the art.

  4. Laser processing of ceramics for microelectronics manufacturing

    Science.gov (United States)

    Sposili, Robert S.; Bovatsek, James; Patel, Rajesh

    2017-03-01

    Ceramic materials are used extensively in the microelectronics, semiconductor, and LED lighting industries because of their electrically insulating and thermally conductive properties, as well as for their high-temperature-service capabilities. However, their brittleness presents significant challenges for conventional machining processes. In this paper we report on a series of experiments that demonstrate and characterize the efficacy of pulsed nanosecond UV and green lasers in machining ceramics commonly used in microelectronics manufacturing, such as aluminum oxide (alumina) and aluminum nitride. With a series of laser pocket milling experiments, fundamental volume ablation rate and ablation efficiency data were generated. In addition, techniques for various industrial machining processes, such as shallow scribing and deep scribing, were developed and demonstrated. We demonstrate that lasers with higher average powers offer higher processing rates with the one exception of deep scribes in aluminum nitride, where a lower average power but higher pulse energy source outperformed a higher average power laser.

  5. Enabling laser applications in microelectronics manufacturing

    Science.gov (United States)

    Delmdahl, Ralph; Brune, Jan; Fechner, Burkhard; Senczuk, Rolf

    2016-02-01

    In this experimental study, we report on high-pulse-energy excimer laser drilling into high-performance build-up films which are pivotal in microelectronics manufacturing. Build-up materials ABF-GX13 from Ajinomoto as well as ZS-100 from Zeon Corporation are evaluated with respect to their viability for economic excimer laser-based micro-via formation. Excimer laser mask imaging projection at laser wavelengths of 193, 248 and 308 nm is employed to generate matrices of smaller micro-vias with different diameters and via pitches. High drilling quality is achievable for all excimer laser wavelengths with the fastest ablation rates measured in the case of 248 and 308 nm wavelengths. The presence of glass fillers in build-up films as in the ABF-GX13 material poses some limitations to the minimum achievable via diameter. However, surprisingly good drilling results are obtainable as long as the filler dimensions are well below the diameter of the micro-vias. Sidewall angles of vias are controllable by adjusting the laser energy density and pulse number. In this work, the structuring capabilities of excimer lasers in build-up films as to taper angle variations, attainable via diameters, edge-stop behavior and ablation rates will be elucidated.

  6. Carbon nanotubes as heat dissipaters in microelectronics

    DEFF Research Database (Denmark)

    Pérez Paz, Alejandro; García-Lastra, Juan María; Markussen, Troels

    2013-01-01

    We review our recent modelling work of carbon nanotubes as potential candidates for heat dissipation in microelectronics cooling. In the first part, we analyze the impact of nanotube defects on their thermal transport properties. In the second part, we investigate the loss of thermal properties...... of nanotubes in presence of an interface with various substances, including air and water. Comparison with previous works is established whenever is possible....

  7. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

    Energy Technology Data Exchange (ETDEWEB)

    Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie; Tigges, Chris P.

    1999-04-01

    We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

  8. Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

    Science.gov (United States)

    Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

    2018-02-01

    The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

  9. Manufacture of heat exchangers

    International Nuclear Information System (INIS)

    Burton, J.E.; Tombs, R.W.T.

    1980-01-01

    A tube bundle for use in a heat exchanger has a series of spaced parallel tubes supported by tube plates and is manufactured by depositing welding material around the end of each tube, machining the deposited material to form an annular flange around the end of the tube and welding the flange into apertures in the tube plate. Preferably the tubes have a length which is slightly less than the distance between the outer surfaces of the tube plates and the deposited material is deposited so that it overlaps and protects the end surfaces of the tubes. A plug may be inserted in the bore of the tubes during the welding material deposition which, as described, is effected by manual metal arc welding. One use of heat exchangers incorporating a tube bundle manufactured as above is in apparatus for reducing the volume of, and recovering nitric acid from, radioactive effluents from a nuclear reprocessing plant. (author)

  10. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  11. Giant microelectronics

    International Nuclear Information System (INIS)

    Della Sala, D.; Privato, C.; Di Lazzaro, P.; Fortunato, G.

    1999-01-01

    Giant microelectronics, on which the technology of flat liquid-crystal screens is based, is an example of fruitful interaction among independently-developed technologies, in this case thin film micro devices and laser applications. It typifies the interdisciplinary approach needed to produce innovations in microelectronics [it

  12. Cooling high heat flux micro-electronic systems using refrigerants in high aspect ratio multi-microchannel evaporators

    International Nuclear Information System (INIS)

    Costa-Patry, E.

    2011-11-01

    Improving the energy efficiency of cooling systems can contribute to reduce the emission of greenhouse gases. Currently, most microelectronic applications are air-cooled. Switching to two-phase cooling systems would decrease power consumption and allow for the reuse of the extracted heat. For this type of application, multi-microchannel evaporators are thought to be well adapted. However, such devices have not been tested for a wide range of operating conditions, such that their thermal response to the high non-uniform power map typically generated by microelectronics has not been studied. This research project aims at clarifying these gray areas by investigating the behavior of the two-phase flow of different refrigerants in silicon and copper multi-microchannel evaporators under uniform, non-uniform and transient heat fluxes operating conditions. The test elements use as a heat source a pseudo-chip able to mimic the behavior of a CPU. It is formed by 35 independent sub-heaters, each having its own temperature sensor, such that 35 temperature and 35 heat flux measurements can be made simultaneously. Careful measurements of each pressure drop component (inlet, microchannels and outlet) found in the micro-evaporators showed the importance of the inlet and outlet restriction pressure losses. The overall pressure drop levels found in the copper test section were low enough to possibly be driven by a thermosyphon system. The heat transfer coefficients measured for uniform heat flux conditions were very high and typically followed a V-shape curve. The first branch was associated to the slug flow regime and the second to the annular flow regime. By tracking the minimum level of heat transfer, a transition criteria between the regimes was established, which included the effect of heat flux on the transition. Then for each branch, a different prediction method was used to form the first flow pattern-based prediction method for two-phase heat transfer in microchannels. A

  13. Apparatus for manufacturing heating gas

    Energy Technology Data Exchange (ETDEWEB)

    Thompson, R

    1899-12-09

    Treating bituminous fuel, peat, or shale, is described for the production of a non-condensible heating gas by a three-stage but continuous process comprising: (1) a preliminary distillation operation under external heating, (2) a further distillation operation under the action of direct internal heating, (3) a combustion and gasification operation on the distilled hot fuel under the action of air or steam and air.

  14. Thermoelectric cooling of microelectronic circuits and waste heat electrical power generation in a desktop personal computer

    International Nuclear Information System (INIS)

    Gould, C.A.; Shammas, N.Y.A.; Grainger, S.; Taylor, I.

    2011-01-01

    Thermoelectric cooling and micro-power generation from waste heat within a standard desktop computer has been demonstrated. A thermoelectric test system has been designed and constructed, with typical test results presented for thermoelectric cooling and micro-power generation when the computer is executing a number of different applications. A thermoelectric module, operating as a heat pump, can lower the operating temperature of the computer's microprocessor and graphics processor to temperatures below ambient conditions. A small amount of electrical power, typically in the micro-watt or milli-watt range, can be generated by a thermoelectric module attached to the outside of the computer's standard heat sink assembly, when a secondary heat sink is attached to the other side of the thermoelectric module. Maximum electrical power can be generated by the thermoelectric module when a water cooled heat sink is used as the secondary heat sink, as this produces the greatest temperature difference between both sides of the module.

  15. Wire bonding in microelectronics

    CERN Document Server

    Harman, George G

    2010-01-01

    Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. Coverage includes: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bo...

  16. Manufacturing A Refrigerator with Heat Recovery Unit

    Directory of Open Access Journals (Sweden)

    Mustafa Mohammed Kadhim

    2018-02-01

    Full Text Available This study aims to exploite the rejected heating energy from condenser and benefit from it to reheat the foods and other materials. It can also be employed to improve the coefficient of performance of a refrigerator at the same time by using approximately the same consumption electrical energy used to operate the compressor and refrigerator in general. This idea has been implemented by manufacturing of a refrigerator with using additional part has the same metal and condenser pipe diameters but its surface area does not exceed 40% from total surface area of the condenser and its design as an insulated cabinet from all sides to prevent heat leakage through it and located between the compressor and the condenser. Small electrical fan has been added inside this cabinet to provide a suitable air circulation and a homogenous temperature distribution inside the cabinet space. It is expected that the super heating energy of refrigerant (R134a which comes out of the compressor would be removed  inside this cabinet and this insist to condensate the refrigerant (cooling fluid with a rate higher than that used in the normal refrigerator only. Three magnetic valves have been used in order to control the refrigerant flow in state of operation the refrigerator only or to gather with heating cabinet. To measure the temperatures at each process of the simple vapor compression refrigeration cycle, nine temperature sensors at input and output of each compressor, condenser and an evaporator in additional to input of cabinet and inside it and on evaporator surface have been provided. Five pressure gages have been used to measure the value of pressure and compare it for the two states of operation. The consumption of electrical energy  can be calculated by adding an ammeter and a voltmeter and compare between the consumption energy of both states. The obtained results show that there is an improvement in the coeffecient of performance in state of operation the

  17. Microelectronics in energy technology

    Energy Technology Data Exchange (ETDEWEB)

    Oeding, D; Jesse, G

    1984-07-01

    This meeting, which will take place on the 16th and 17th of October 1984 at the Old Opera House at Frankfurt on Main, in the context of the VDE Congress, will consist of 14 lectures on the state of the application of microelectronics to energy technology, and give its participants information on and a chance for discussion of this subject. The meeting will cover the following subjects: Microelectronics in energy supply undertakings; Microelectronics in the automation of power stations; Microelectronics in switchgear and transmission networks; Microelectronics in measurement technology; Microelectronics in lighting technology; Microelectronics in drive technology; Microelectronics in railway technology. The following shortened versions of these lectures are intended to motivate people to visit this event and to prepare contributions to and questions for the discussions.

  18. Methods for microwave heat treatment of manufactured components

    Science.gov (United States)

    Ripley, Edward B.

    2010-08-03

    An apparatus for heat treating manufactured components using microwave energy and microwave susceptor material. Heat treating medium such as eutectic salts may be employed. A fluidized bed introduces process gases which may include carburizing or nitriding gases. The process may be operated in a batch mode or continuous process mode. A microwave heating probe may be used to restart a frozen eutectic salt bath.

  19. Methods of designing and manufacturing a heat exchanger for the ...

    African Journals Online (AJOL)

    The article describes the method of calculation, design and manufacture of the the plate heat exchanger for the gas turbine plants with heat recovery. We represented the method of threedimensional calculation, which allowed conducting a virtual experiment and clarifying the design of the heat exchanger for the given ...

  20. New Nomenclatures for Heat Treatments of Additively Manufactured Titanium Alloys

    Science.gov (United States)

    Baker, Andrew H.; Collins, Peter C.; Williams, James C.

    2017-07-01

    The heat-treatment designations and microstructure nomenclatures for many structural metallic alloys were established for traditional metals processing, such as casting, hot rolling or forging. These terms do not necessarily apply for additively manufactured (i.e., three-dimensionally printed or "3D printed") metallic structures. The heat-treatment terminology for titanium alloys generally implies the heat-treatment temperatures and their sequence relative to a thermomechanical processing step (e.g., forging, rolling). These designations include: β-processing, α + β-processing, β-annealing, duplex annealing and mill annealing. Owing to the absence of a thermomechanical processing step, these traditional designations can pose a problem when titanium alloys are first produced via additive manufacturing, and then heat-treated. This communication proposes new nomenclatures for heat treatments of additively manufactured titanium alloys, and uses the distinct microstructural features to provide a correlation between traditional nomenclature and the proposed nomenclature.

  1. Microelectronic systems 1 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems 1 Checkbook provides coverage of the Business and Technician Education Council level 1 unit in Microelectronic Systems. However, it can be regarded as a basic textbook in microelectronic systems for a much wider range of studies. Each topic considered in the text is presented in a way that assumes the reader has little prior knowledge of electronics. The aim of the book is to provide an introduction to the concept of systems, to differentiate analogue and digital systems, and to describe the nature of microprocessor-controlled systems. An introduction to programming is

  2. COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS: UNA COMPARACIÓN DE DOS ALGORITMOS DE OPTIMIZACIÓN GLOBAL

    Directory of Open Access Journals (Sweden)

    Jorge Mario Cruz Duarte

    Full Text Available This article deals with the design of optimum microchannel heat sinks through Unified Particle Swarm Optimisation (UPSO and Harmony Search (HS. These heat sinks are used for the thermal management of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically and thoroughly. The objective function was created using the entropy generation minimisation criterion. In this study, we fixed the geometry of the microchannel, the amount of heat to be removed, and the properties of the cooling fluid. Moreover, we calculated the entropy generation rate, the volume flow rate of air, the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations indicate that both global optimisation strategies yielded similar results, about 0.032 W/K, and that HS required five times more iterations than UPSO, but only about a nineteenth of its computation time. In addition, HS revealed a greater chance (about three times of finding a better solution than UPSO, but with a higher dispersion rate (about five times. Nonetheless, both algorithms successfully optimised the design for different scenarios, even when varying the material of the heat sink, and for different heat transfer rates.

  3. Solid-State Additive Manufacturing for Heat Exchangers

    Science.gov (United States)

    Norfolk, Mark; Johnson, Hilary

    2015-03-01

    Energy densities in devices are increasing across many industries including power generation, high power electronics, manufacturing, and automotive. Increasingly, there is a need for very high efficiency thermal management devices that can pull heat out of a small area at higher and higher rates. Metal additive manufacturing (AM) technologies have the promise of creating parts with complex internal geometries required for integral thermal management. However, this goal has not been met due to constraints in fusion-based metal 3D printers. This work presents a new strategy for metal AM of heat exchangers using an ultrasonic sheet lamination approach.

  4. Physics in microelectronics and microelectronics in physics

    International Nuclear Information System (INIS)

    Mooser, E.

    1983-01-01

    Modern semiconductor technology and its many different facets such as microelectronics, optoelectronics, integrated optics, solar energy conversion, etc... have their origin in solid state physics, However, because of their enormous economic impact, their development has been so rapid and has lead to such a high degree of complexity and sophistication, that to the newcomer in the field, the links between solid state electronics and solid state physics are no longer evident. (author) [pt

  5. Ion implantation for microelectronics

    International Nuclear Information System (INIS)

    Dearnaley, G.

    1977-01-01

    Ion implantation has proved to be a versatile and efficient means of producing microelectronic devices. This review summarizes the relevant physics and technology and assesses the advantages of the method. Examples are then given of widely different device structures which have been made by ion implantation. While most of the industrial application has been in silicon, good progress continues to be made in the more difficult field of compound semiconductors. Equipment designed for the industrial ion implantation of microelectronic devices is discussed briefly. (Auth.)

  6. Microelectronic systems 3 checkbook

    CERN Document Server

    Vears, R E

    1985-01-01

    Microelectronic Systems 3: Checkbook aims to extend the range of hardware, software, and interfacing techniques developed at level 2. This book concentrates on the highly popular 6502, Z80, and 6800 microprocessors and contains approximately 70 tested programs that may be used with little or no modification on most systems based on these microprocessors. This text also covers the main points concerned with computer hardware configuration, interfacing devices, subroutines and the stack, polling and interrupts, microelectronic stores, and address decoding and organization. Each chapter of the b

  7. Radiation effects on microelectronics

    International Nuclear Information System (INIS)

    Gover, J.E.

    1987-01-01

    Applications of radiation-hardened microelectronics in nuclear power systems include (a) light water reactor (LWR) containment building, postaccident instrumentation that can operate through the beta and gamma radiation released in a design basis loss-of-coolant accident; (b) advanced LWR instrumentation and control systems employing distributed digital integrated circuit (IC) technology to achieve a high degree of artificial intelligence and thereby reduce the probability of operator error under accident conditions; (c) instrumentation, command, control and communication systems for space nuclear power applications that must operate during the neutron and gamma-ray core leakage environments as well as the background electron, proton, and heavy charged particle environments of space; and (d) robotics systems designed for the described functions. Advanced microelectronics offer advantages in cost and reliability over alternative approaches to instrumentation and control. No semiconductor technology is hard to all classes of radiation effects phenomena. As the effects have become better understood, however, significant progress has been made in hardening IC technology. Application of hardened microelectronics to nuclear power systems has lagged military applications because of the limited market potential of hardened instruments and numerous institutional impediments

  8. Physics in microelectronics and microelectronics in physics

    International Nuclear Information System (INIS)

    Mooser, E.

    1983-01-01

    Modern semiconductor technology and its many different facets such as micro-electronics, optoelectronics, integrated optics, solar energy conversion, etc... have their origin in solid state physics. However, because of their enormous economic impact, their development has been so rapid and has lead to such a high degree of complexity and sophistication, that to the newcomer in the field, the links between solid state electronics and solid state physics are no longer evident. The processes involved in the production of integrated circuits and solid state lasers afford very instructive examples on which to demostrate the impact of physics on semiconductor technology. Processes discussed include: Purification of silicon; Crystal growth; Liquid and vapour phase epitaxy; Photo- and electronbeam lithography; Mask production; Wet and dry etching; Doping and metal deposition, etc... The inverse phenomenon, i.e. the impact of semiconductor technology on physics will be demonstrated on examples involving two-dimensional electron gases. Such gases can readily be obtained in 'synthetic' layer structures, produced by molecular beam epitaxy and in the depletion layers of field-effect transistors with MOS geometry. the examples discussed involve the multiple potential well laser and the 'von Klitzing experiment'. (Author) [pt

  9. Microelectronic systems N2 checkbook

    CERN Document Server

    Vears, R E

    2013-01-01

    Microelectronic Systems N2 Checkbook provides coverage of the Business and Technician Education Council level NII unit in Microelectronic Systems. However, it can be regarded as a textbook in microelectronic systems for a much wider range of studies. The aim of this book is to provide a foundation in microelectronic systems hardware and software techniques. Each topic considered in the text is presented in a way that assumes in the reader only the knowledge attained in BTEC Information Technology Studies F, Engineering Fundamentals F, or equivalent. This book concentrates on the highly popular

  10. Adhesion in microelectronics

    CERN Document Server

    Mittal, K L

    2014-01-01

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesi

  11. III-V microelectronics

    CERN Document Server

    Nougier, JP

    1991-01-01

    As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in particular is well suited for Ultra Large Scale Integration processes. However, a number of III-V compound semiconductor devices and circuits have recently been built, and the contributions in this volume are devoted to those types of materials, which offer a number of interesting properties. Taking into account the great variety of problems encountered and of their mutual correlations when fabricating a circuit or even a device, most of the aspects of III-V microelectronics, from fundamental p

  12. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

    Energy Technology Data Exchange (ETDEWEB)

    Smith, J.H.

    1996-11-01

    An overview of the surface micromachining program at the Microelectronics Development Laboratory of Sandia National Laboratories is presented. Development efforts are underway for a variety of surface micromachined sensors and actuators for both defense and commercial applications. A technology that embeds micromechanical devices below the surface of the wafer prior to microelectronics fabrication has been developed for integrating microelectronics with surface-micromachined micromechanical devices. The application of chemical-mechanical polishing to increase the manufacturability of micromechanical devices is also presented.

  13. Manufacturing of tailored tubes with a process integrated heat treatment

    Science.gov (United States)

    Hordych, Illia; Boiarkin, Viacheslav; Rodman, Dmytro; Nürnberger, Florian

    2017-10-01

    The usage of work-pieces with tailored properties allows for reducing costs and materials. One example are tailored tubes that can be used as end parts e.g. in the automotive industry or in domestic applications as well as semi-finished products for subsequent controlled deformation processes. An innovative technology to manufacture tubes is roll forming with a subsequent inductive heating and adapted quenching to obtain tailored properties in the longitudinal direction. This processing offers a great potential for the production of tubes with a wide range of properties, although this novel approach still requires a suited process design. Based on experimental data, a process simulation is being developed. The simulation shall be suitable for a virtual design of the tubes and allows for gaining a deeper understanding of the required processing. The model proposed shall predict microstructural and mechanical tube properties by considering process parameters, different geometries, batch-related influences etc. A validation is carried out using experimental data of tubes manufactured from various steel grades.

  14. Performance Evaluation of Management Environment in Microelectronics Enterprise

    OpenAIRE

    Hui-ying Gao

    2013-01-01

    For the microelectronics manufacturing industries that have uncertain demand, high volume cost and Oligarchs characteristics, we often discuss the possibility of competitors on the capacity of strategy. First of all we use the industry data to analysis the manufacturing cost, demand and the historical situation of the revenue and we also discuss the influence about the uncertain demand and high volume cost to the industrial structure. Secondly, it put the individual manufacturer not consideri...

  15. Moore's law and the impact on trusted and radiation-hardened microelectronics.

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Kwok Kee

    2011-12-01

    In 1965 Gordon Moore wrote an article claiming that integrated circuit density would scale exponentially. His prediction has remained valid for more than four decades. Integrated circuits have changed all aspects of everyday life. They are also the 'heart and soul' of modern systems for defense, national infrastructure, and intelligence applications. The United States government needs an assured and trusted microelectronics supply for military systems. However, migration of microelectronics design and manufacturing from the United States to other countries in recent years has placed the supply of trusted microelectronics in jeopardy. Prevailing wisdom dictates that it is necessary to use microelectronics fabricated in a state-of-the-art technology for highest performance and military system superiority. Close examination of silicon microelectronics technology evolution and Moore's Law reveals that this prevailing wisdom is not necessarily true. This presents the US government the possibility of a totally new approach to acquire trusted microelectronics.

  16. Microelectronic test structures for CMOS technology

    CERN Document Server

    Ketchen, Mark B

    2011-01-01

    Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance an

  17. Wellbore manufacturing processes for in situ heat treatment processes

    Science.gov (United States)

    Davidson, Ian Alexander; Geddes, Cameron James; Rudolf, Randall Lynn; Selby, Bruce Allen; MacDonald, Duncan Charles

    2012-12-11

    A method includes making coiled tubing at a coiled tubing manufacturing unit coupled to a coiled tubing transportation system. One or more coiled tubing reels are transported from the coiled tubing manufacturing unit to one or more moveable well drilling systems using the coiled tubing transportation system. The coiled tubing transportation system runs from the tubing manufacturing unit to one or more movable well drilling systems, and then back to the coiled tubing manufacturing unit.

  18. Microelectronics to nanoelectronics: materials, devices & manufacturability

    National Research Council Canada - National Science Library

    Kaul, Anupama B

    2013-01-01

    .... They highlight new technologies that have successfully transitioned from the laboratory to the marketplace as well as technologies that have near-term market applications in electronics, materials, and optics...

  19. Modern Microelectronics as Hardware Face of Information Technologies

    NARCIS (Netherlands)

    Jozwiak, L.; Luba, T.; Zbierzchowski, B.

    2000-01-01

    Development trends of contemporary microelectronics, as well as its influence on development of widely grasped information systems are discussed. It was proved, that about this development decide not only quantitative, but also qualitative reasons, such as technology of manufacturing and technology

  20. Photopolymerizable liquid encapsulants for microelectronic devices

    Science.gov (United States)

    Baikerikar, Kiran K.

    2000-10-01

    Plastic encapsulated microelectronic devices consist of a silicon chip that is physically attached to a leadframe, electrically interconnected to input-output leads, and molded in a plastic that is in direct contact with the chip, leadframe, and interconnects. The plastic is often referred to as the molding compound, and is used to protect the chip from adverse mechanical, thermal, chemical, and electrical environments. Encapsulation of microelectronic devices is typically accomplished using a transfer molding process in which the molding compound is cured by heat. Most transfer molding processes suffer from significant problems arising from the high operating temperatures and pressures required to fill the mold. These aspects of the current process can lead to thermal stresses, incomplete mold filling, and wire sweep. In this research, a new strategy for encapsulating microelectronic devices using photopolymerizable liquid encapsulants (PLEs) has been investigated. The PLEs consist of an epoxy novolac-based vinyl ester resin (˜25 wt.%), fused silica filler (70--74 wt.%), and a photoinitiator, thermal initiator, and silane coupling agent. For these encapsulants, the use of light, rather than heat, to initiate the polymerization allows precise control over when the reaction starts, and therefore completely decouples the mold filling and the cure. The low viscosity of the PLEs allows for low operating pressures and minimizes problems associated with wire sweep. In addition, the in-mold cure time for the PLEs is equivalent to the in-mold cure times of current transfer molding compounds. In this thesis, the thermal and mechanical properties, as well as the viscosity and adhesion of photopolymerizable liquid encapsulants, are reported in order to demonstrate that a UV-curable formulation can have the material properties necessary for microelectronic encapsulation. In addition, the effects of the illumination time, postcure time, fused silica loading, and the inclusion

  1. Apparatus with moderating material for microwave heat treatment of manufactured components

    Science.gov (United States)

    Ripley, Edward B [Knoxville, TN

    2011-05-10

    An apparatus for heat treating manufactured components using microwave energy and microwave susceptor material. Heat treating medium such as eutectic salts may be employed. A fluidized bed introduces process gases which may include carburizing or nitriding gases The process may be operated in a batch mode or continuous process mode. A microwave heating probe may be used to restart a frozen eutectic salt bath.

  2. Progress of High Heat Flux Component Manufacture and Heat Load Experiments in China

    Energy Technology Data Exchange (ETDEWEB)

    Liu, X.; Lian, Y.; Xu, Z.; Chen, J.; Chen, L.; Wang, Q.; Duan, X., E-mail: xliu@swip.ac.cn [Southwestern Institute of Physics, Chengu (China); Luo, G. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei (China); Yan, Q. [University of Science and Technology Beijing, Beijing (China)

    2012-09-15

    Full text: High heat flux components for first wall and divertor are the key subassembly of the present fusion experiment apparatus and fusion reactors in the future. It is requested the metallurgical bonding among the plasma facing materials (PFMs), heat sink and support materials. As to PFMs, ITER grade vacuum hot pressed beryllium CN-G01 was developed in China and has been accepted as the reference material of ITER first wall. Additionally pure tungsten and tungsten alloys, as well as chemical vapor deposition (CVD) W coating are being developed for the aims of ITER divertor application and the demand of domestic fusion devices, and significant progress has been achieved. For plasma facing components (PFCs), high heat flux components used for divertor chamber are being studied according to the development program of the fusion experiment reactor of China. Two reference joining techniques of W/Cu mockups for ITER divertor chamber are being developed, one is mono-block structure by pure copper casting of tungsten surface following by hot iso-static press (HIP), and another is flat structure by brazing. The critical acceptance criteria of high heat flux components are their high heat load performance. A 60 kW Electron-beam Material testing Scenario (EMS-60) has been constructed at Southwestern Institute of Physics (SWIP),which adopts an electron beam welding gun with maximum energy of 150 keV and 150 x 150 mm{sup 2} scanning area by maximum frame rate of 30 kHz. Furthermore, an Engineering Mockup testing Scenario (EMS-400) facility with 400 kW electron-beam melting gun is under construction and will be available by the end of this year. After that, China will have the comprehensive capability of high heat load evaluation from PFMs and small-scale mockups to engineering full scale PFCs. A brazed W/CuCrZr mockup with 25 x 25 x 40 mm{sup 3} in dimension was tested at EMS-60. The heating and cooling time are 10 seconds and 15 seconds, respectively. The experiment

  3. Field Measurements of Heating Efficiency of Electric Forced-Air Furnaces in Six Manufactured Homes.

    Energy Technology Data Exchange (ETDEWEB)

    Davis, Bob; Palmiter, Larry S.; Siegel, Jeff

    1994-07-26

    This report presents the results of field measurements of heating efficiency for six manufactured homes in the Pacific Northwest heated with electric forced-air systems. This is the first in a series of regional and national efforts to measure in detail the heating efficiency of manufactured homes. Only six homes were included in this study because of budgetary constraints; therefore this is not a representative sample. These investigations do provide some useful information on the heating efficiency of these homes. Useful comparisons can be drawn between these study homes and site-built heating efficiencies measured with a similar protocol. The protocol used to test these homes is very similar to another Ecotope protocol used in the study conducted in 1992 and 1993 for the Bonneville Power Administration to test the heating efficiency of 24 homes. This protocol combined real-time power measurements of furnace energy usage with energy usage during co-heat periods. Accessory data such as house and duct tightness measurements and tracer gas measurements were used to describe these homes and their heating system efficiency. Ensuring that manufactured housing is constructed in an energy and resource efficient manner is of increasing concern to manufactured home builders and consumers. No comparable work has been done to measure the heating system efficiency of MCS manufactured homes, although some co-heat tests have been performed on manufactured homes heated with natural gas to validate HUD thermal standards. It is expected that later in 1994 more research of this kind will be conducted, and perhaps a less costly and less time-consuming method for testing efficiencies will be develops.

  4. 77 FR 10373 - Greenhouse Gas Reporting Program: Electronics Manufacturing: Revisions to Heat Transfer Fluid...

    Science.gov (United States)

    2012-02-22

    ... Greenhouse Gas Reporting Program: Electronics Manufacturing: Revisions to Heat Transfer Fluid Provisions... technical revisions to the electronics manufacturing source category of the Greenhouse Gas Reporting Rule... final rule will also be available through the WWW on the EPA's Greenhouse Gas Reporting Program Web site...

  5. Nanoelectronics: The perspective in microelectronics

    International Nuclear Information System (INIS)

    Mutihac, R.; Mutihac, R.C.; Cicuttin, A.; Colavita, A.A.

    2001-10-01

    The present survey briefly presents the-state-of-the-art in microelectronics, invokes physical considerations in estimating the intrinsic limits of present microelectronic devices, and highlights the future trends in the perspectives of the incoming nanoscale technologies. In order to design artificial systems with molecular precision, molecular brand new engineering methods must be developed, that is, to hold, position, and assemble nanoscale parts in compliance with the laws of physics. In the framework of the nanoscale technologies, the thermodynamically reversible single electron switching systems are considered as ultimate evolutionary end point of electronic logic devices built up at molecular level. (author)

  6. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  7. Additive Manufacturing of Heat Pipe Wicks, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Wick properties are often the limiting factor in a heat pipe design. Current technology uses conventional sintering of metal powders, screen wick, or grooves to...

  8. Microelectronics in Japan

    Science.gov (United States)

    Boulton, William R.

    1995-02-01

    The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

  9. Additive manufacturing of a compact flat-panel cryogenic gas-gap heat switch

    NARCIS (Netherlands)

    Vanapalli, Srinivas; Vermeer, Cristian Hendrik; Tirolien, T.

    2016-01-01

    State-of-the-art heat switches are only rarely employed in thermal system architectures, since they are rather bulky and have a limited thermal performance (expressed as the heat transfer ratio between the "On" and "Off" state). Using selective laser melting additive manufacturing technology, also

  10. Tube with helical grooving for a heat exchanger and its manufacturing process

    International Nuclear Information System (INIS)

    Yampolsky, J.S.

    1980-01-01

    This claim broadly concerns heat transfer tubes for heat exchangers of the kind described in the main patent specification and, in particular, a heat transfer tube and a process for manufacturing it. This tube includes a strip of metal, the opposite sides of which extend to form a certain number of longitudinal grooves of specific profile and height. This strip is helically wound and the lateral edges are joined butt to butt so as to be leak tight to fluids [fr

  11. Orion Heat Shield Manufacturing Producibility Improvements for the EM-1 Flight Test Program

    Science.gov (United States)

    Koenig, William J.; Stewart, Michael; Harris, Richard F.

    2018-01-01

    This paper describes how the ORION program is incorporating improvements in the heat shield design and manufacturing processes reducing programmatic risk and ensuring crew safety in support of NASA's Exploration missions. The approach for the EFT-1 heat shield utilized a low risk Apollo heritage design and manufacturing process using an Avcoat TPS ablator with a honeycomb substrate to provide a one piece heat shield to meet the mission re-entry heating environments. The EM-1 mission will have additional flight systems installed to fly to the moon and return to Earth. Heat shield design and producibility improvements have been incorporated in the EM-1 vehicle to meet deep space mission requirements. The design continues to use the Avcoat material, but in a block configuration to enable improvements in consistant and repeatable application processes using tile bonding experience developed on the Space Shuttle Transportation System Program.

  12. Utilization of Additive Manufacturing for Aerospace Heat Exchangers

    Science.gov (United States)

    2016-02-29

    7. A notional part that was designed and built in an aluminum-silicon- magnesium alloy using the powder bed fusion process was able to achieve fine...source=bl&ots=YxEzhfglaB&sig=Wk4sfyR94gelw51 chj5Mb mOavus&hl=en&sa=X& ei =m HSxU4ucLZfMsQTivYCgAg&ved=OCEcQ6AEwCDgK#v=o nepage&q=making%20of%20a%20heat

  13. A self-regulating valve for single-phase liquid cooling of microelectronics

    International Nuclear Information System (INIS)

    Donose, Radu; De Volder, Michaël; Peirs, Jan; Reynaerts, Dominiek

    2011-01-01

    This paper reports on the design, optimization and testing of a self-regulating valve for single-phase liquid cooling of microelectronics. Its purpose is to maintain the integrated circuit (IC) at constant temperature and to reduce power consumption by diminishing flow generated by the pump as a function of the cooling requirements. It uses a thermopneumatic actuation principle that combines the advantages of zero power consumption and small size in combination with a high flow rate and low manufacturing costs. The valve actuation is provided by the thermal expansion of a liquid (actuation fluid) which, at the same time, actuates the valve and provides feed-back sensing. A maximum flow rate of 38 kg h −1 passes through the valve for a heat load up to 500 W. The valve is able to reduce the pumping power by up to 60% and it has the capability to maintain the IC at a more uniform temperature.

  14. Applications of focused ion beams in microelectronics

    International Nuclear Information System (INIS)

    Broughton, C.; Beale, M.I.J.; Deshmukh, V.G.I.

    1986-04-01

    We present the conclusions of the RSRE programme on the application of focused ion beams in microelectronics and review the literature published in this field. We discuss the design and performance of focused beam implanters and the viability of their application to semiconductor device fabrication. Applications in the areas of lithography, direct implantation and micromachining are discussed in detail. Comparisons are made between the use of focused ion beams and existing techniques for these fabrication processes with a strong emphasis placed on the relative throughputs. We present results on a novel spot size measurement technique and the effect of beam heating on resist. We also present the results of studies into implantation passivation of resist to oxygen plasma attack as basis for a dry development lithography scheme. A novel lithography system employing flood electron exposure from a photocathode which is patterned by a focused ion beam which can also be used to repair mask defects is considered. (author)

  15. Manufacture of power station heat exchangers using modern production technology

    International Nuclear Information System (INIS)

    Genzlinger, W.; Hoffmann, J.; Ohlhaeuser, K.

    1986-01-01

    Heat exchangers of high quality and operational safety can only be fabricated economically if fabrication is as 'simple' as possible and can be controlled and if, through value analysis, the work flows can be mechanized and automated and the following requirements are met: use of materials that are easy to work with for the application considered, choice of product designs and wall thicknesses that offer favourable conditions for processing and non-destructive testing, placing of seams in such a way that good accessibility for welding and minimum residual welding stresses are assured, minimizing the number of welding seams, use of automatic welding machines for submerged-arc welding and electronically controlled sources of welding current - semi-automatic equipment for spatter-free interfaces (pulse technique), electronically controlled equipment for welding in rollers and pipes and CNC-controlled machining centres for drilling pipe galleries (deep-hole drilling) and baffle plates and for machining the sealing elements after welding. Continuous inspections in each phase of fabrication assures that heat exchangers are made which fully meet the requirements of nuclear power station operators. (orig.)

  16. Low-cost Electromagnetic Heating Technology for Polymer Extrusion-based Additive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Carter, William G. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Rios, Orlando [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Akers, Ronald R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Morrison, William A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2016-01-07

    To improve the flow of materials used in in polymer additive manufacturing, ORNL and Ajax Tocco created an induction system for heating fused deposition modeling (FDM) nozzles used in polymer additive manufacturing. The system is capable of reaching a temperature of 230 C, a typical nozzle temperature for extruding ABS polymers, in 17 seconds. A prototype system was built at ORNL and sent to Ajax Tocco who analyzed the system and created a finalized power supply. The induction system was mounted to a PrintSpace Altair desktop printer and used to create several test parts similar in quality to those created using a resistive heated nozzle.

  17. ENERGY EFFICIENCY OF ELECTRIC HEATING OF REACTORS IN THE MANUFACTURE OF VARNISHES AND PAINTS

    Directory of Open Access Journals (Sweden)

    Tovajniansky L.L.

    2014-08-01

    Full Text Available The drawbacks of the traditional design of the heaters, which make known imperfections in manufacturing processes, realized with the use of electric heating. This determines the need for a radically new design of the heating devices. Created by high-temperature ceramics, characterized by abnormally high thermal stability and clarified the parameters that allow a certain degree change its thermal conductivity. On this basis the contact type ceramic heaters that provide thermal flow direction using different materials in the body of the heater - of high thermal conductivity, the surface facing the heat transfer and low which differs opposite sides of the heater are designed to eliminate the dissipation of heat into the surrounding space. This made it possible to equip the modern production paint industry energy efficient heating equipment with explosion and fire heating system reactors.

  18. Inactivation of 12 viruses by heating steps applied during manufacture of a hepatitis B vaccine

    NARCIS (Netherlands)

    Lelie, P. N.; Reesink, H. W.; Lucas, C. J.

    1987-01-01

    The efficacy of two heating cycles (90 sec at 103 degrees C and 10 hr at 65 degrees C) used during manufacture of a plasma-derived hepatitis-B vaccine was validated for the inactivation of 12 virus families. A period of 15 min warming up to 65 degrees C had already completely inactivated

  19. CRRES microelectronics test package (MEP)

    International Nuclear Information System (INIS)

    Mullen, E.G.; Ray, K.P.

    1993-01-01

    The Microelectronics Test Package (MEP) flown on board the Combined Release and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and annealing). A description of the experiment, the method of testing devices, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the March 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package

  20. Development, manufacturing and testing of a gas-loaded variable conductance methanol heat pipe

    Science.gov (United States)

    Vanbuggenum, R. I. J.; Daniels, D. H. W.

    1987-02-01

    The experimental technology required to measure the performance of moderate temperature heat pipes is presented. The heat pipe manufacturing process is described. The hydrodynamic characteristics of the porous structure inside the heat pipe envelope were examined using a specially developed test rig, based upon a steady-state evaporation test. A fully automated test facility was developed and validated by testing constant conductance and variable conductance heat pipes (VCHP). Theoretical performance predictions are illustrated in terms of pressure, depicted in 3D-plots, and compared with the test results of the heat pipe performance tests. The design of the VCHP was directed towards the verification of the VCHP mathematical model. The VCHP design is validated and ready for the final testing and model verification.

  1. Prototype Vent Gas Heat Exchanger for Exploration EVA - Performance and Manufacturing Characteristics

    Science.gov (United States)

    Quinn, Gregory J.; Strange, Jeremy; Jennings, Mallory

    2013-01-01

    NASA is developing new portable life support system (PLSS) technologies, which it is demonstrating in an unmanned ground based prototype unit called PLSS 2.0. One set of technologies within the PLSS provides suitable ventilation to an astronaut while on an EVA. A new component within the ventilation gas loop is a liquid-to-gas heat exchanger to transfer excess heat from the gas to the thermal control system s liquid coolant loop. A unique bench top prototype heat exchanger was built and tested for use in PLSS 2.0. The heat exchanger was designed as a counter-flow, compact plate fin type using stainless steel. Its design was based on previous compact heat exchangers manufactured by United Technologies Aerospace Systems (UTAS), but was half the size of any previous heat exchanger model and one third the size of previous liquid-to-gas heat exchangers. The prototype heat exchanger was less than 40 cubic inches and weighed 2.57 lb. Performance of the heat exchanger met the requirements and the model predictions. The water side and gas side pressure drops were less 0.8 psid and 0.5 inches of water, respectively, and an effectiveness of 94% was measured at the nominal air side pressure of 4.1 psia.

  2. SOME METHODS FOR SAVING HEAT ENERGY WHILE MANUFACTURING VERTICAL INSULATING GLASS UNITS

    Directory of Open Access Journals (Sweden)

    S. A. Shybeka

    2018-01-01

    Full Text Available The paper proposes and considers two constructive methods for saving heat energy while manufacturing vertical insulating glass units with various gas filling of inter-glass space. The first method presupposes manufacturing of insulating glass units having specific thickness which is calculated in accordance with specific features of convective heat exchange in the closed loop circuit. Value of the heat-exchange coefficient depends on gas properties which is filling a chamber capacity (coefficients of thermal conductivity, volumetric expansion, kinematic viscosity, thermometric conducivity, temperature difference on the boundary of interlayer and its thickness. It has been shown that while increasing thickness of gas layer convective heat exchange coefficient is initially decreasing up to specific value and then after insignificant increase it practically remains constant. In this connection optimum thicknesses of filled inter-layers for widely-spread gas in production (dry air, argon, krypton, xenon and for carbon dioxide have determined in the paper. Manufacturing of insulating glass units with large thickness of gas chamber practically does not lead to an increase in resistance to heat transfer but it will increase gas consumption rate. The second industrial economic method is interrelated with application of carbon dioxide СО2 as a filler of inter-glass space which has some advantages in comparison with other gases (small cost due to abundance, nontoxicity, transparency for visual light and absorption of heat rays. Calculations have shown that application of carbon dioxide will make it possible to increase resistance to heat transfer of one-chamber glass unit by 0.05 m²×K/W (with emissivity factor of internal glass – 0.837 or by 0.16 m²×K/W (with emission factor – 0.1 in comparison with the glass unit where a chamber is filled with dry air.

  3. Additive Manufacturing for Cost Efficient Production of Compact Ceramic Heat Exchangers and Recuperators

    Energy Technology Data Exchange (ETDEWEB)

    Shulman, Holly [Ceralink Incorporated, Troy, NY (United States); Ross, Nicole [Ceralink Incorporated, Troy, NY (United States)

    2015-10-30

    An additive manufacture technique known as laminated object manufacturing (LOM) was used to fabricate compact ceramic heat exchanger prototypes. LOM uses precision CO2 laser cutting of ceramic green tapes, which are then precision stacked to build a 3D object with fine internal features. Modeling was used to develop prototype designs and predict the thermal response, stress, and efficiency in the ceramic heat exchangers. Build testing and materials analyses were used to provide feedback for the design selection. During this development process, laminated object manufacturing protocols were established. This included laser optimization, strategies for fine feature integrity, lamination fluid control, green handling, and firing profile. Three full size prototypes were fabricated using two different designs. One prototype was selected for performance testing. During testing, cross talk leakage prevented the application of a high pressure differential, however, the prototype was successful at withstanding the high temperature operating conditions (1300 °F). In addition, analysis showed that the bulk of the part did not have cracks or leakage issues. This led to the development of a module method for next generation LOM heat exchangers. A scale-up cost analysis showed that given a purpose built LOM system, these ceramic heat exchangers would be affordable for the applications.

  4. Testing of high heat flux components manufactured by ENEA for ITER divertor

    International Nuclear Information System (INIS)

    Visca, Eliseo; Escourbiac, F.; Libera, S.; Mancini, A.; Mazzone, G.; Merola, M.; Pizzuto, A.

    2009-01-01

    ENEA is involved in the International Thermonuclear Experimental Reactor (ITER) R and D activities and in particular in the manufacturing of high heat flux plasma-facing components, such as the divertor targets. During the last years ENEA has manufactured actively cooled mock-ups by using different technologies, namely brazing, diffusion bonding and HIPping. A new manufacturing process that combines two main techniques PBC (Pre-Brazed Casting) and the HRP (Hot Radial Pressing) has been set up and widely tested. A full monoblock medium scale vertical target, having a straight CFC armoured part and a curved W armoured part, was manufactured using this process. The ultrasonic method was used for the non-destructive examinations performed during the manufacturing of the component, from the monoblock preparation up to the final mock-up assembling. The component was also examined by thermography on SATIR facility (CEA, France), afterwards it was thermal fatigue tested at FE200 (200 kW electron beam facility, CEA/AREVA France). The successful results of the thermal fatigue testing performed according the ITER requirements (10 MW/m 2 , 3000 cycles of 10 s on both CFC and W part, then 20/15 MW/m 2 , 2000 cycles of 10 s on CFC/W part, respectively) have confirmed that the developed process can be considerate a candidate for the manufacturing of monoblock divertor components. Furthermore, a 35-MW/m 2 Critical Heat Flux was measured at relevant thermal-hydraulics conditions at the end of the testing campaign. This paper reports the manufacturing route, the thermal fatigue testing results, the pre and post non-destructive examination and the destructive examination performed on the ITER vertical target medium scale mock-up. These activities were performed in the frame of EFDA contracts (04-1218 with CEA, 93-851 JN with AREVA and 03-1054 with ENEA).

  5. Operation of arc heating furnace on manufacturing gigantic ingots and segregation of gigantic ingots

    International Nuclear Information System (INIS)

    Niimi, Takayasu; Okamura, Masayoshi

    1976-01-01

    The techniques and procedure for manufacturing gigantic ingots heavier than 200 t are described. Especially, practical results of an arc heating furnace which plays an important role in the procedure and segregation of gigantic ingots are discussed in detail. By appropriate operations of the arc heating furnance, hydrogen and phosphorus are kept unchanged, and oxygen and sulphur decrease to very low levels. Furthermore, the temperature can be accurately controlled. The application of multipour technique reduces segregation and its degree is dependent on kinds of steel. V-segregation and inverted V-segregation in steel deoxidized with carbon in vacuum seem to be very slight. (auth.)

  6. Experimental investigation of single-phase microjet cooling of microelectronics

    Science.gov (United States)

    Rusowicz, Artur; Leszczyński, Maciej; Grzebielec, Andrzej; Laskowski, Rafał

    2015-09-01

    Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second). While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

  7. Manufacturing and thermomechanical testing of actively cooled all beryllium high heat flux test pieces

    International Nuclear Information System (INIS)

    Vasiliev, N.N.; Sokolov, Yu.A.; Shatalov, G.E.

    1995-01-01

    One of the problems affiliated to ITER high heat flux elements development is a problem of interface of beryllium protection with heat sink routinely made of copper alloys. To get rid of this problem all beryllium elements could be used as heat receivers in places of enhanced thermal loads. In accordance with this objectives four beryllium test pieces of two types have been manufactured in open-quotes Institute of Berylliumclose quotes for succeeding thermomechanical testing. Two of them were manufactured in accordance with JET team design; they are round open-quotes hypervapotron typeclose quotes test pieces. Another two ones are rectangular test sections with a twisted tape installed inside of the circular channel. Preliminary stress-strain analysis have been performed for both type of the test pieces. Hypervapotrons have been shipped to JET where they were tested on JET test bed. Thermomechanical testing of pieces of the type of open-quotes swirl tape inside of tubeclose quotes have been performed on Kurchatov Institute test bed. Chosen beryllium grade properties, some details of manufacturing, results of preliminary stress-strain analysis and thermomechanical testing of the test pieces open-quotes swirl tape inside of tubeclose quotes type are given in this report

  8. Using federal technology policy to strength the US microelectronics industry

    Science.gov (United States)

    Gover, J. E.; Gwyn, C. W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan's government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  9. Using federal technology policy to strength the US microelectronics industry

    Energy Technology Data Exchange (ETDEWEB)

    Gover, J.E.; Gwyn, C.W.

    1994-07-01

    A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

  10. Calculation of cracking under pulsed heat loads in tungsten manufactured according to ITER specifications

    International Nuclear Information System (INIS)

    Arakcheev, A.S.; Skovorodin, D.I.; Burdakov, A.V.; Shoshin, A.A.; Polosatkin, S.V.; Vasilyev, A.A.; Postupaev, V.V.; Vyacheslavov, L.N.; Kasatov, A.A.; Huber, A.; Mertens, Ph; Wirtz, M.; Linsmeier, Ch; Kreter, A.; Löwenhoff, Th; Begrambekov, L.; Grunin, A.; Sadovskiy, Ya

    2015-01-01

    A mathematical model of surface cracking under pulsed heat load was developed. The model correctly describes a smooth brittle–ductile transition. The elastic deformation is described in a thin-heated-layer approximation. The plastic deformation is described with the Hollomon equation. The time dependence of the deformation and stresses is described for one heating–cooling cycle for a material without initial plastic deformation. The model can be applied to tungsten manufactured according to ITER specifications. The model shows that the stability of stress-relieved tungsten deteriorates when the base temperature increases. This proved to be a result of the close ultimate tensile and yield strengths. For a heat load of arbitrary magnitude a stability criterion was obtained in the form of condition on the relation of the ultimate tensile and yield strengths.

  11. A comparison of the heat transfer capabilities of two manufacturing methods for high heat flux water-cooled devices

    International Nuclear Information System (INIS)

    McKoon, R.H.

    1986-10-01

    An experimental program was undertaken to compare the heat transfer characteristics of water-cooled copper devices manufactured via conventional drilled passage construction and via a technique whereby molten copper is cast over a network of preformed cooling tubes. Two similar test blocks were constructed; one using the drilled passage technique, the other via casting copper over Monel pipe. Each test block was mounted in a vacuum system and heated uniformly on the top surface using a swept electron beam. From the measured absorbed powers and resultant temperatures, an overall heat transfer coefficient was calculated. The maximum heat transfer coefficient calculated for the case of the drilled passage test block was 2534 Btu/hr/ft 2 / 0 F. This corresponded to an absorbed power density of 320 w/cm 2 and resulted in a maximum recorded copper temperature of 346 0 C. Corresponding figures for the cast test block were 363 Btu/hr/ft 2 / 0 F, 91 w/cm 2 , and 453 0 C

  12. Manufacture of a heat-resistant alloy with modified specifications for HTGR structural applications

    International Nuclear Information System (INIS)

    Sahira, K.; Kondo, T.; Takeiri, T.

    1984-01-01

    A method of manufacturing a nuclear grade nickel-base heat-resistant alloy in application to heliumcooled reactor primary circuit components has been developed. The Hastelloy-XR alloy, a version of Hastelloy-X, was made available by combining the basic studies of the oxidation behavior of Hastelloy-X and the improvement of manufacturing techniques. In the primary and remelting steps, the choice of appropriate processes was made by performing numerical analyses of the statistical deviation of both chemical composition and the products' mechanical properties. The feasibility of making larger electroslag remelting ingots with reasonable control of macrosegregation was examined by the calculation of a molten metal pool shape during melting. The hot workability of Hastelloy-XR was confirmed to be equivalent to that of Hastelloy-X and the importance of controlling the thermal and mechanical processes more closely was stressed in obtaining a higher level of quality assurance for the nuclear applications. The possibility of enhancing the high-temperature mechanical performance of Hastelloy-XR was suggested based on the preliminary test results with the heats manufactured with controlled boron content

  13. Materials contamination control in the microelectronic industry

    International Nuclear Information System (INIS)

    Tardif, F.

    1993-01-01

    This paper deals with many aspects of the contamination of materials in the microelectronic industry. The contamination's control of chemicals, process gases, silicon and the survey of the ions free water's purity are treated. (TEC). 29 figs., 7 tabs

  14. Process of heat exchangers manufactured by Scientific and Engineering Services (S.E.S.)

    International Nuclear Information System (INIS)

    Khurshid, S.

    1995-01-01

    The objective of this report is to have a comprehensive overview of heat exchanger fouling problems as they occur in the industrial manufacturing sector. Specifically the types of fouling, conditions that influence fouling, the mitigation and accommodation techniques currently being used and mitigation technology trends are discussed. Finally a table top apparatus is designed and fabricated to develop an on line mechanical technique of rubber ball system for the removal of dirt and scales of that exchangers. Experimental results of this apparatus show that the cleaning efficiency can be raised if this mechanical technique is used together with current chemical fouling removal methods. (author)

  15. Design and manufacture of ceramic heat pipes for high temperature applications

    International Nuclear Information System (INIS)

    Meisel, Peter; Jobst, Matthias; Lippmann, Wolfgang; Hurtado, Antonio

    2015-01-01

    Heat exchangers based on ceramic heat pipes were designed for use under highly abrasive and corrosive atmospheres at temperatures in the range of 800–1200 °C for high-temperature power-engineering applications. The presented heat pipes are gravity assisted and based on a multi-layer concept comprising a ceramic cladding and an inner metal tube that contains sodium as the working fluid. Hermetical encapsulation of the working fluid was achieved by electron-beam welding of the inner metal tube. Subsequently, closure of the surrounding ceramic tube was performed by laser brazing technology using a glass solder. Temperature resistance and functionality of the manufactured ceramic thermosyphons could be confirmed experimentally in a hot combustion gas atmosphere at temperatures up to 1100 °C. The ceramic tubes used had an outer diameter of 22 mm and a total length of 770 mm. The measured axial heat transfer of the ceramic gravity assisted heat pipes at the stationary operating point with cold/hot gas temperature of 100 °C/900 °C was 400 W. The result of the calculation using the created mathematical model amounted to 459 W. - Highlights: • Heat-pipe design consists of a ceramic shell and an inner metallic tube. • Laser brazing technology is suitable to seal ceramic heat-pipes. • Thermal characteristic of double wall thermosyphon was modelled using FEM code. • Experimental investigations demonstrated functionality of double wall thermosyphons

  16. Advanced Microelectronics Technologies for Future Small Satellite Systems

    Science.gov (United States)

    Alkalai, Leon

    1999-01-01

    Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

  17. Heat transfer and material flow during laser assisted multi-layer additive manufacturing

    International Nuclear Information System (INIS)

    Manvatkar, V.; De, A.; DebRoy, T.

    2014-01-01

    A three-dimensional, transient, heat transfer, and fluid flow model is developed for the laser assisted multilayer additive manufacturing process with coaxially fed austenitic stainless steel powder. Heat transfer between the laser beam and the powder particles is considered both during their flight between the nozzle and the growth surface and after they deposit on the surface. The geometry of the build layer obtained from independent experiments is compared with that obtained from the model. The spatial variation of melt geometry, cooling rate, and peak temperatures is examined in various layers. The computed cooling rates and solidification parameters are used to estimate the cell spacings and hardness in various layers of the structure. Good agreement is achieved between the computed geometry, cell spacings, and hardness with the corresponding independent experimental results.

  18. Manufacturing of kevlar/polyester composite by resin transfer moulding using conventional and microwave heating

    International Nuclear Information System (INIS)

    Abdullah, I.

    2015-01-01

    Microwave heating was incorporated into the resin transfer moulding technique. Polytetrafluoroethylene (PTFE) mould was used to cure the composite panel. Through the use of microwave heating, the mechanical and physical properties of produced Kevlar fibre/polyester composites were compared to those manufactured by conventional resin transfer moulding. The flexural modulus and flexural strength of 6-ply conventionally cured composites was 45% and 9% higher than the flexural modulus and flexural strength of 6-ply microwaved cured composites, respectively. However, 19% increase in interlaminar shear strength (ILSS) and 2% increase in compressive strength was observed in 6-ply microwave cured composites. This enhancement in ILSS and compressive strength is attributed to the better interfacial bonding of polyester resin with Kevlar fibres in microwaved cured composite, which was also confirmed via electron microscopy scanning. Furthermore, the microwave cured composite yielded maximum void contents (3%). (author)

  19. The influence of heat accumulation on the surface roughness in powder-bed additive manufacturing

    International Nuclear Information System (INIS)

    Jamshidinia, Mahdi; Kovacevic, Radovan

    2015-01-01

    The influence of heat accumulation on surface roughness during powder-bed additive manufacturing was investigated. A series of Ti-6Al-4V thin plates were produced by using an identical heat input by electron beam melting® (EBM). Spacing distances of 5 mm, 10 mm, and 20 mm were used. The surface roughness of as-built thin plates was measured using a two-axis profilometer. A numerical model was developed to study the influence of spacing distance on heat accumulation. An inverse relationship between the spacing distance and surface roughness was revealed. The experimental and numerical results showed that the surface quality of buildups could be controlled not only by process parameters, but also by the arrangement of components in the buildup chamber. At a constant spacing distance, an increase in the number of powder layers resulted in the accumulation of more heat between the thin plates. An increase in the spacing distance resulted in an upward translation of the Bearing Area Curve (BAC) toward shallower depths, with a reduced core roughness depth (R k ) and peak height (R pk ). A logarithmic regression equation was established from the experimental data. This equation could be used to predict the surface roughness of parts fabricated by EBM® in the studied range of spacing distances. (paper)

  20. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  1. Microelectronic circuit design for energy harvesting systems

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2017-01-01

    This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design. Provides a single-source reference to energy harvesting and its applications; Serves as a practical guide to microelectronics design for energy harvesting, with application to mobile power supplies; Enables readers to develop energy harvesting systems for wearable/mobile electronics.

  2. Effect of Heat Treatment on the Properties of CoCrMo Alloy Manufactured by Selective Laser Melting

    Science.gov (United States)

    Guoqing, Zhang; Junxin, Li; Xiaoyu, Zhou; Jin, Li; Anmin, Wang

    2018-05-01

    To obtain medical implants with better mechanical properties, it is necessary to conduct studies on the heat treatment process of the selective laser melting (SLM) manufacturing parts. The differential scanning calorimetry method was used to study the heat treatment process of the phase transition of SLM CoCrMo alloy parts. The tensile properties were tested with a tensile test machine, the quantity of carbide precipitated after heat treatment was measured by energy-dispersive x-ray spectroscopy, and the tensile fracture morphology of the parts was investigated using SEM. The obtained results were: Mechanical properties in terms of elongation and tensile strength of CoCrMo alloy manufactured by SLM that had been heat-treated at 1200 °C for 2 h followed by cooling with water were not only higher than the national standard but also higher than the experimental results of the same batch of castings. The mechanism of fracture of parts manufactured by SLM without heat treatment was brittle fracture, whereas parts which had been heat-treated at 1200 °C for 2 h combined with water cooling and at 1200 °C for 1 h with furnace cooling suffered ductile fracture. This study provides the basis for defining the applications for which CoCrMo alloys manufactured by SLM are suitable within the field of medical implants.

  3. Empirical component model to predict the overall performance of heating coils: Calibrations and tests based on manufacturer catalogue data

    International Nuclear Information System (INIS)

    Ruivo, Celestino R.; Angrisani, Giovanni

    2015-01-01

    Highlights: • An empirical model for predicting the performance of heating coils is presented. • Low and high heating capacity cases are used for calibration. • Versions based on several effectiveness correlations are tested. • Catalogue data are considered in approach testing. • The approach is a suitable component model to be used in dynamic simulation tools. - Abstract: A simplified methodology for predicting the overall behaviour of heating coils is presented in this paper. The coil performance is predicted by the ε-NTU method. Usually manufacturers do not provide information about the overall thermal resistance or the geometric details that are required either for the device selection or to apply known empirical correlations for the estimation of the involved thermal resistances. In the present work, heating capacity tables from the manufacturer catalogue are used to calibrate simplified approaches based on the classical theory of heat exchangers, namely the effectiveness method. Only two reference operating cases are required to calibrate each approach. The validity of the simplified approaches is investigated for a relatively high number of operating cases, listed in the technical catalogue of a manufacturer. Four types of coils of three sizes of air handling units are considered. A comparison is conducted between the heating coil capacities provided by the methodology and the values given by the manufacturer catalogue. The results show that several of the proposed approaches are suitable component models to be integrated in dynamic simulation tools of air conditioning systems such as TRNSYS or EnergyPlus

  4. Interconnect mechanisms in microelectronic packaging

    Science.gov (United States)

    Roma, Maria Penafrancia C.

    Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire

  5. Elastocaloric cooling of additive manufactured shape memory alloys with large latent heat

    International Nuclear Information System (INIS)

    Hou, Huilong; Stasak, Drew; Hasan, Naila Al; Takeuchi, Ichiro; Simsek, Emrah; Ott, Ryan; Cui, Jun; Qian, Suxin

    2017-01-01

    The stress-induced martensitic phase transformation of shape memory alloys (SMAs) is the basis for elastocaloric cooling. Here we employ additive manufacturing to fabricate TiNi SMAs, and demonstrate compressive elastocaloric cooling in the TiNi rods with transformation latent heat as large as 20 J g −1 . Adiabatic compression on as-fabricated TiNi displays cooling Δ T as high as  −7.5 °C with recoverable superelastic strain up to 5%. Unlike conventional SMAs, additive manufactured TiNi SMAs exhibit linear superelasticity with narrow hysteresis in stress–strain curves under both adiabatic and isothermal conditions. Microstructurally, we find that there are Ti 2 Ni precipitates typically one micron in size with a large aspect ratio enclosing the TiNi matrix. A stress transfer mechanism between reversible phase transformation in the TiNi matrix and mechanical deformation in Ti 2 Ni precipitates is believed to be the origin of the unique superelasticity behavior. (paper)

  6. Performance Analysis Review of Thorium TRISO Coated Particles during Manufacture, Irradiation and Accident Condition Heating Tests

    International Nuclear Information System (INIS)

    2015-03-01

    Thorium, in combination with high enriched uranium, was used in all early high temperature reactors (HTRs). Initially, the fuel was contained in a kernel of coated particles. However, particle quality was low in the 1960s and early 1970s. Modern, high quality, tristructural isotropic (TRISO) fuel particles with thorium oxide and uranium dioxide (UO 2 ) had been manufactured since 1978 and were successfully demonstrated in irradiation and accident tests. In 1980, HTR fuels changed to low enriched uranium UO 2 TRISO fuels. The wide ranging development and demonstration programme was successful, and it established a worldwide standard that is still valid today. During the process, results of the thorium work with high quality TRISO fuel particles had not been fully evaluated or documented. This publication collects and presents the information and demonstrates the performance of thorium TRISO fuels.This publication is an outcome of the technical contract awarded under the IAEA Coordinated Research Project on Near Term and Promising Long Term Options for Deployment of Thorium Based Nuclear Energy, initiated in 2012. It is based on the compilation and analysis of available results on thorium TRISO coated particle performance in manufacturing and during irradiation and accident condition heating tests

  7. Experimental investigation of single-phase microjet cooling of microelectronics

    Directory of Open Access Journals (Sweden)

    Rusowicz Artur

    2015-09-01

    Full Text Available Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second. While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

  8. Government Microelectronics Assessment for Trust (GOMAT)

    Science.gov (United States)

    Berg, Melanie D.; LaBel, Kenneth A.

    2018-01-01

    NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

  9. Dictionary of microelectronics and microcomputer technology

    International Nuclear Information System (INIS)

    Attiyate, Y.H.; Shah, R.R.

    1984-01-01

    This bilingual dictionary (German-English and English-German) is to give the general public a clearer idea of the terminology of microelectronics, microcomputers, data processing, and computer science. Each part contains about 7500 terms frequently encountered in practice, about 2000 of which are supplemented by precise explanations. (orig./HP) [de

  10. International Conference on Microelectronics, Electromagnetics and Telecommunications

    CERN Document Server

    Rao, N; Kumar, S; Raj, C; Rao, V; Sarma, G

    2016-01-01

    This volume contains 73 papers presented at ICMEET 2015: International Conference on Microelectronics, Electromagnetics and Telecommunications. The conference was held during 18 – 19 December, 2015 at Department of Electronics and Communication Engineering, GITAM Institute of Technology, GITAM University, Visakhapatnam, INDIA. This volume contains papers mainly focused on Antennas, Electromagnetics, Telecommunication Engineering and Low Power VLSI Design.

  11. Microelectronics in power electronics and electrical drives

    Energy Technology Data Exchange (ETDEWEB)

    1982-01-01

    From October, 1214, 1982 at Darmstadt (FRG) a meeting took place on ''Microelectronics in power electronics and Electrical Drives''. This volume contains the papers of the 65 lectures, held at the symposium. For each of the 10 papers dealing with problems on electric-powered vehicles a separate subject analysis has been carried out.

  12. Problems in CEMA microelectronic cooperation noted

    Science.gov (United States)

    Grzybowski, J.; Kusinski, J.

    1983-10-01

    The development and market trends of products, which use large scale integrated circuits are discussed. Products such as pocket calculators, electronic wrist watches, telephones, and automobiles are used to illustrate the economic results of market saturation with specialized integrated circuits. The status of microelectronics in socialist countries in Europe is addressed.

  13. Microelectronics used for Semiconductor Imaging Detectors

    CERN Document Server

    Heijne, Erik H M

    2010-01-01

    Semiconductor crystal technology, microelectronics developments and nuclear particle detection have been in a relation of symbiosis, all the way from the beginning. The increase of complexity in electronics chips can now be applied to obtain much more information on the incident nuclear radiation. Some basic technologies are described, in order to acquire insight in possibilities and limitations for the most recent detectors.

  14. Manufacturing and characterisation of SiC-fibre-reinforced copper in heat sink applications

    International Nuclear Information System (INIS)

    Kimmig, Stefan

    2013-01-01

    The wall materials in future fusion reactors will be operating under extreme thermal and mechanical load conditions. The divertor region of such a device is the most severely loaded component. This part is exposed to heat fluxes of up to 15 MW m 2 due to the impinging plasma particle flux. Tungsten is currently considered as the best choice for the plasmafacing-materials (PFM) in the divertor region. An efficient heat sink material is required underneath the PFM for sufficient heat transfer to the cooling channels. In the research reactor ITER a copper alloy (CuCrZr) is foreseen as heat sink material, which is able to withstand temperatures of up to 350 C, corresponding to a water coolant temperature of 150 C. For the commercial use of fusion energy an increase of the thermal efficiency is necessary by increasing the coolant temperature to over 300 C. This will cause higher stresses in the connection area between PFM and the heat sink due to different coefficients of thermal expansion combined with higher temperatures. The mechanical properties of CuCrZr are insufficient for these conditions and fibre reinforced copper metal matrix composites (CuMMC) are considered as an alternative material to strengthen the critical connection area between the heat sink and the PFM. The composite should combine the high heat conductivity of a copper matrix with the high stiffness and mechanical strength of silicon-carbide fibres (SiC-fibres). During this investigation SiC-fibres of two different production principles were studied regarding their usage for the manufacturing of a CuMMC. The main goals for the CuMMC are a tensile strength of 300 MPa combined with a heat conductivity of more than 200 W m -1 K -1 . Both of these parameters are affected by the single fibre tensile strength and by the bonding between the fibres and the copper matrix. The achievable heat conductivity in the CuMMC depends on the fibre volume ratio within the composite. Higher fibre strength reduces the

  15. Experience feedback from high heat flux component manufacturing for Tore Supra

    International Nuclear Information System (INIS)

    Schlosser, J.; Durocher, A.; Huber, T.; Garin, P.; Schedler, B.; Agarici, G.

    2001-01-01

    Tore Supra is involved in flat tile carbon armoured plasma facing components (PFCs) since 1985. In 1997, a third generation of components, based on the original concept developed with Plansee Company, called active metal casting (AMC[reg]), has been launched. Since 1998, 660 elementary components for the toroidal pump limiter (TPL) are in production. The route of the manufacture is rather complex and many controls were requested all along the fabrication to insure a high reliability of the elements. One of the main controls is the final infrared (IR) test allowing to determine the quality of the bonding between the carbon fibre composite (CFC) tiles and the heat sink made of copper-chromium-zirconium alloy (CuCrZr). Although results for the first batch of elements were as expected (less than 5% rejected at the final test), unexpected defects appeared with the followings batches. Investigations on the fabrication processes underlined the importance of having a better heat treatment of the pieces in copper alloy (CuCrZr), however this was not sufficient to completely explain the observed defects

  16. Fabrication of Thermoelectric Devices Using Additive-Subtractive Manufacturing Techniques: Application to Waste-Heat Energy Harvesting

    Science.gov (United States)

    Tewolde, Mahder

    Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are well suited for waste-heat energy harvesting applications as opposed to primary energy generation. Commercially available thermoelectric modules are flat, inflexible and have limited sizes available. State-of-art manufacturing of TEG devices relies on assembling prefabricated parts with soldering, epoxy bonding, and mechanical clamping. Furthermore, efforts to incorporate them onto curved surfaces such as exhaust pipes, pump housings, steam lines, mixing containers, reaction chambers, etc. require custom-built heat exchangers. This is costly and labor-intensive, in addition to presenting challenges in terms of space, thermal coupling, added weight and long-term reliability. Additive manufacturing technologies are beginning to address many of these issues by reducing part count in complex designs and the elimination of sub-assembly requirements. This work investigates the feasibility of utilizing such novel manufacturing routes for improving the manufacturing process of thermoelectric devices. Much of the research in thermoelectricity is primarily focused on improving thermoelectric material properties by developing of novel materials or finding ways to improve existing ones. Secondary to material development is improving the manufacturing process of TEGs to provide significant cost benefits. To improve the device fabrication process, this work explores additive manufacturing technologies to provide an integrated and scalable approach for TE device manufacturing directly onto engineering component surfaces. Additive manufacturing techniques like thermal spray and ink-dispenser printing are developed with the aim of improving the manufacturing process of TEGs. Subtractive manufacturing techniques like laser micromachining are also studied in detail. This includes the laser processing parameters for cutting the thermal spray materials efficiently by

  17. Laser Applications in Microelectronic and Optoelectronic Manufacturing IV

    Science.gov (United States)

    1999-07-15

    coordination. It might operate as a companion to a much larger satellite like the Space Shuttle or International Space Station. Such a unit would... Sistemas , E.U.I.T.Telecomunicacion, UPM, Ctra.de Valencia km7.5, 28031 Madrid, Spain ABSTRACT Nanocomposite thin films formed by metal or semiconductor

  18. Assessment of the Current Level of Automation in the Manufacture of Fuel Cell Systems for Combined Heat and Power Applications

    Energy Technology Data Exchange (ETDEWEB)

    Ulsh, M.; Wheeler, D.; Protopappas, P.

    2011-08-01

    The U.S. Department of Energy (DOE) is interested in supporting manufacturing research and development (R&D) for fuel cell systems in the 10-1,000 kilowatt (kW) power range relevant to stationary and distributed combined heat and power applications, with the intent to reduce manufacturing costs and increase production throughput. To assist in future decision-making, DOE requested that the National Renewable Energy Laboratory (NREL) provide a baseline understanding of the current levels of adoption of automation in manufacturing processes and flow, as well as of continuous processes. NREL identified and visited or interviewed key manufacturers, universities, and laboratories relevant to the study using a standard questionnaire. The questionnaire covered the current level of vertical integration, the importance of quality control developments for automation, the current level of automation and source of automation design, critical balance of plant issues, potential for continuous cell manufacturing, key manufacturing steps or processes that would benefit from DOE support for manufacturing R&D, the potential for cell or stack design changes to support automation, and the relationship between production volume and decisions on automation.

  19. Microelectronics from fundamentals to applied design

    CERN Document Server

    Di Paolo Emilio, Maurizio

    2016-01-01

    This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics.  Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design.  ·         Describes fundamentals of microelectronics design in an accessible manner; ·         Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; ·         Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; ·         Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.

  20. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  1. Radiation effects on microelectronics in space

    International Nuclear Information System (INIS)

    Srour, J.R.; McGarrity, J.M.

    1988-01-01

    The basic mechanisms of space radiation effects on microelectronics are reviewed in this paper. Topics discussed include the effects of displacement damage and ionizing radiation on devices and circuits, single event phenomena, dose enhancement, radiation effects on optoelectronic devices and passive components, hardening approaches, and simulation of the space radiation environment. A summary is presented of damage mechanisms that can cause temporary or permanent failure of devices and circuits operating in space

  2. Wireless Integrated Microelectronic Vacuum Sensor System

    Science.gov (United States)

    Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

    2013-01-01

    NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum

  3. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    International Nuclear Information System (INIS)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-01-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100 deg. C, 1300 deg. C and 1500 deg. C for about 20 hours using heating and cooling rates of 2 deg. C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  4. Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

    Science.gov (United States)

    Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

    2010-03-01

    This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

  5. All fiber cladding mode stripper with uniform heat distribution and high cladding light loss manufactured by CO2 laser ablation

    Science.gov (United States)

    Jebali, M. A.; Basso, E. T.

    2018-02-01

    Cladding mode strippers are primarily used at the end of a fiber laser cavity to remove high-power excess cladding light without inducing core loss and beam quality degradation. Conventional manufacturing methods of cladding mode strippers include acid etching, abrasive blasting or laser ablation. Manufacturing of cladding mode strippers using laser ablation consist of removing parts of the cladding by fused silica ablation with a controlled penetration and shape. We present and characterize an optimized cladding mode stripper design that increases the cladding light loss with a minimal device length and manufacturing time. This design reduces the localized heat generation by improving the heat distribution along the device. We demonstrate a cladding mode stripper written on a 400um fiber with cladding light loss of 20dB, with less than 0.02dB loss in the core and minimal heating of the fiber and coating. The manufacturing process of the designed component is fully automated and takes less than 3 minutes with a very high throughput yield.

  6. Radiation Effects and Hardening Techniques for Spacecraft Microelectronics

    Science.gov (United States)

    Gambles, J. W.; Maki, G. K.

    2002-01-01

    The natural radiation from the Van Allen belts, solar flares, and cosmic rays found outside of the protection of the earth's atmosphere can produce deleterious effects on microelectronics used in space systems. Historically civil space agencies and the commercial satellite industry have been able to utilize components produced in special radiation hardened fabrication process foundries that were developed during the 1970s and 1980s under sponsorship of the Departments of Defense (DoD) and Energy (DoE). In the post--cold war world the DoD and DoE push to advance the rad--hard processes has waned. Today the available rad--hard components lag two-plus technology node generations behind state- of-the-art commercial technologies. As a result space craft designers face a large performance gap when trying to utilize available rad--hard components. Compounding the performance gap problems, rad--hard components are becoming increasingly harder to get. Faced with the economic pitfalls associated with low demand versus the ever increasing investment required for integrated circuit manufacturing equipment most sources of rad--hard parts have simply exited this market in recent years, leaving only two domestic US suppliers of digital rad--hard components. This paper summarizes the radiation induced mechanisms that can cause digital microelectronics to fail in space, techniques that can be applied to mitigate these failure mechanisms, and ground based testing used to validate radiation hardness/tolerance. The radiation hardening techniques can be broken down into two classes, Hardness By Process (HBP) and Hardness By Design (HBD). Fortunately many HBD techniques can be applied to commercial fabrication processes providing space craft designer with radiation tolerant Application Specific Integrated Circuits (ASICs) that can bridge the performance gap between the special HBP foundries and the commercial state-of-the-art performance.

  7. 76 FR 10395 - BreconRidge Manufacturing Solutions, Now Known as Sanmina-SCI Corporation, Division...

    Science.gov (United States)

    2011-02-24

    ... Solutions, Now Known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic Design and Manufacturing, a Subsidiary of Sanmina-SCI Corporation, Including On- Site Leased Workers From Kelly Services... Manufacturing Solutions, now known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic...

  8. Integrated Microelectronics and Photonics Active Cooling Technology (IMPACT)

    National Research Council Canada - National Science Library

    Bowers, John

    2003-01-01

    ...) coolers and their integration with microelectronics and photonics. The majority of our research involves the development of this new technology through nanostructured materials design and growth...

  9. Understanding microelectronics a top-down approach

    CERN Document Server

    Maloberti, Franco

    2011-01-01

    The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today's students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions,

  10. Out-of-autoclave manufacturing of GLARE panels using resistance heating

    NARCIS (Netherlands)

    Muller, B.; Palardy, G.; Teixeira De Freitas, S.; Sinke, J.

    2017-01-01

    Autoclave manufacturing of fibre metal laminates, such as GLARE, is an expensive process.Therefore, there is an increasing interest to find cost effective out-of-autoclave manufacturing processes without diminishing the laminate quality. The aim of this study is to

  11. Solar heating for an electronics manufacturing plant--Blue Earth, Minnesota

    Science.gov (United States)

    1981-01-01

    Partial space heating for 97,000 square foot plant is supplied by 360 flat plate solar collectors; energy is sorted as heat in indoor 20,000 gallon water tank. System includes all necessary control electronics for year round operation. During December 1978, solar energy supplied 24.4 percent of building's space heating load.

  12. Assessing the heat stress of brick-manufacturing units’ workers based on WBGT index in Qom city

    Directory of Open Access Journals (Sweden)

    R. Hajizadeh

    2015-01-01

    Full Text Available Introduction: Heat stress is considered as a serious risk factor to the health and safety of workers in most working environments, especially in outdoor works and jobs that workers are exposed to heat due to the working process. This study aimed to evaluate heat stress among workers of brick-manufacturing units in Qom city based on WBGT index as well as the relationship between WBGT and physiological indicators. .Material and Method: The present study was conducted in 40 brick-manufacturing units in Qom city. WBGT measurements were performed according to ISO7243 standard. Physiological responses of 184 workers (up to 5 people per unit and also atmospheric parameters were measured. The physiological responses included oral temperature, skin temperature, and temperature for the carotid artery of the ear, heart rate, systolic and diastolic blood pressure. Statistical analysis was done using SPSS software version 16. .Result: Mean WBGT index for various brick-manufacturing jobs including firing, manual material handling, working with conveyors, molding, and tempering were 30.8 °C, 26.74 °C 26.58 °C and 24.25 °C, respectively and the average WBGT was estimated 27.98 °C. WBGT levels measured in all units exceeded the level provided in ISO7243 standard. The highest mean WBGT was belonged to kiln section (30.8 °C. The mean WBGT at three heights of head, abdomen and legs were not statistically different (using t-test. The correlation coefficients between mean WBGT and mean oral, skin and ears temperatures were 0.203, 0.319, and 0.490, respectively, with the highest correlation belonged to the carotid arteries of ears. Moreover, WBGT showed no significant association with the mean heart rate, systolic, and diastolic blood pressure (P-value>0.05. Indoor and outdoor WBGT index was significantly different (P-value<0.05. .Conclusion: The level of heat stress in all brick-manufacturing units was higher than the recommended limits, and the workers in kiln

  13. Design for manufacturability of macro and micro products: a case study of heat exchanger design

    DEFF Research Database (Denmark)

    Omidvarnia, F.; Weng Feng, L.; Hansen, H. N.

    2018-01-01

    In this paper, a novel methodology in designing a micro heat exchanger is proposed by modifying a conventional design methodology for macro products with the considerations of differences between design of a micro and a macro product. The methodology starts with the identification of differences...... for fabricating micro heat exchangers are ranked based on the defined criteria. Following the design methodology, primary design ideas for micro heat exchangers are generated according to the heat transfer principles for macro heat exchangers. Taking micro design considerations into account, the designs from next...... iteration are created. Finally, the performances of the designs for micro heat exchangers are compared with their macro counterparts. The most appropriate designs for micro heat exchangers are finalized. The micro specific design guidelines obtained by the designer through evaluating the modeling results...

  14. Carbon Foam Self-Heated Tooling for Out-of-Autoclave Composites Manufacturing, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This proposal addresses NASA's need for non-autoclave composites manufacture. The Constellation program, including the Ares V launch vehicle, will require very...

  15. A novel approach of manufacturing Nickel Wicks for loop heat pipes ...

    Indian Academy of Sciences (India)

    are manufactured with a basic purpose of generating capillary pumping ... The procedures for the production and characterization of the wick are presented here. ..... Huang X and Franchi G 2008 Design and fabrication of hybrid bi-modal wick ...

  16. Effects of anodizing parameters and heat treatment on nanotopographical features, bioactivity, and cell culture response of additively manufactured porous titanium.

    Science.gov (United States)

    Amin Yavari, S; Chai, Y C; Böttger, A J; Wauthle, R; Schrooten, J; Weinans, H; Zadpoor, A A

    2015-06-01

    Anodizing could be used for bio-functionalization of the surfaces of titanium alloys. In this study, we use anodizing for creating nanotubes on the surface of porous titanium alloy bone substitutes manufactured using selective laser melting. Different sets of anodizing parameters (voltage: 10 or 20V anodizing time: 30min to 3h) are used for anodizing porous titanium structures that were later heat treated at 500°C. The nanotopographical features are examined using electron microscopy while the bioactivity of anodized surfaces is measured using immersion tests in the simulated body fluid (SBF). Moreover, the effects of anodizing and heat treatment on the performance of one representative anodized porous titanium structures are evaluated using in vitro cell culture assays using human periosteum-derived cells (hPDCs). It has been shown that while anodizing with different anodizing parameters results in very different nanotopographical features, i.e. nanotubes in the range of 20 to 55nm, anodized surfaces have limited apatite-forming ability regardless of the applied anodizing parameters. The results of in vitro cell culture show that both anodizing, and thus generation of regular nanotopographical feature, and heat treatment improve the cell culture response of porous titanium. In particular, cell proliferation measured using metabolic activity and DNA content was improved for anodized and heat treated as well as for anodized but not heat-treated specimens. Heat treatment additionally improved the cell attachment of porous titanium surfaces and upregulated expression of osteogenic markers. Anodized but not heat-treated specimens showed some limited signs of upregulated expression of osteogenic markers. In conclusion, while varying the anodizing parameters creates different nanotube structure, it does not improve apatite-forming ability of porous titanium. However, both anodizing and heat treatment at 500°C improve the cell culture response of porous titanium

  17. Optimization of heat treatment parameters for additive manufacturing and gravity casting AlSi10Mg alloy

    Science.gov (United States)

    Girelli, L.; Tocci, M.; Montesano, L.; Gelfi, M.; Pola, A.

    2017-11-01

    Additive manufacturing of metals is a production process developed in the last few years to realize net shape components with complex geometry and high performance. AlSi10Mg is one of the most widely used aluminium alloys, both in this field and in conventional foundry processes, for its significant mechanical properties combined with good corrosion resistance. In this paper the effect of heat treatment on AlSi10Mg alloy was investigated. Solution and ageing treatments were carried out with different temperatures and times on samples obtained by direct metal laser sintering and gravity casting in order to compare their performance. Microstructural analyses and hardness tests were performed to investigate the effectiveness of the heat treatment. The results were correlated to the sample microstructure and porosity, analysed by means of optical microscopy and density measurements. It was found that, in the additive manufactured samples, the heat treatment can reduce significantly the performance of the alloy also because of the increase of porosity due to entrapped gas during the deposition technique and that the higher the solution temperature the higher the increase of such defects. A so remarkable effect was not found in the conventional cast alloy.

  18. Effects of heat treatment on microstructure and mechanical behaviour of additive manufactured porous Ti6Al4V

    Science.gov (United States)

    Ahmadi, S. M.; Jain, R. K. Ashok Kumar; Zadpoor, A. A.; Ayas, C.; Popovich, V. A.

    2017-12-01

    Titanium and its alloys such as Ti6Al4V play a major role in the medical industry as bone implants. Nowadays, by the aid of additive manufacturing (AM), it is possible to manufacture porous complex structures which mimic human bone. However, AM parts are near net shape and post processing may be needed to improve their mechanical properties. For instance, AM Ti6Al4V samples may be brittle and incapable of withstanding dynamic mechanical loads due to their martensitic microstructure. The aim of this study was to apply two different heat treatment regimes (below and above β-transus) to investigate their effects on the microstructure and mechanical properties of porous Ti6Al4V specimens. After heat treatment, fine acicular α‧ martensitic microstructure was transformed to a mixture of α and β phases. The ductility of the heat-treated specimens, as well as some mechanical properties such as hardness, plateau stress, and first maximum stress changed while the density and elastic gradient of the porous structure remained unchanged.

  19. Corrosion Behavior of Heat-Treated AlSi10Mg Manufactured by Laser Powder Bed Fusion

    Directory of Open Access Journals (Sweden)

    Marina Cabrini

    2018-06-01

    Full Text Available This experimental work is aimed at studying the effect of microstructural modifications induced by post-processing heat treatments on the corrosion behavior of silicon-aluminum alloys produced by means of laser powder bed fusion (LPBF. The manufacturing technique leads to microstructures characterized by the presence of melt pools, which are quite different compared to casting alloys. In this study, the behavior of an AlSi10Mg alloy was evaluated by means of intergranular corrosion tests according to ISO 11846 standard on heat-treated samples ranging from 200 to 500 °C as well as on untreated samples. We found that temperatures above 200 °C reduced microhardness of the alloy, and different corrosion morphologies occurred due to the modification of both size and distribution of silicon precipitates. Selective penetrating attacks occurred at melt pool borders. The intergranular corrosion phenomena were less intense for as-produced specimens without heat treatments compared to the heat-treated specimens at 200 and 300 °C. General corrosion morphologies were noticed for specimens heat treated at temperatures exceeding 400 °C.

  20. Effects of microelectronics on industrial level measuring

    International Nuclear Information System (INIS)

    Schaudel, D.E.

    1979-01-01

    Microelectronic elements and production technologies have begun to change industrial level measurement, and this trend will continue. Spectacular breakthroughs cannot be expected, due to the major demand of reliability and to administrative constraints. The demand for transducers has increased with the advance of low-cost computer hardware. Electronics makes well-known method of measurements more universally applicable; it helps to realize new methods, and to design multifunctional transducers which always give the necessary signal for process guidance. The effects on society and environment are wholly positive: More and better measuring technologies permit a better utilisation of raw materials and energies, help to prevent environmental damage, and to raise the standard of living. Negative results are not to be expected on this sector. (orig./RW) [de

  1. Heteromagnetic Microelectronics Microsystems of Active Type

    CERN Document Server

    Ignatiev, Alexander A

    2010-01-01

    Heteromagnetic Microelectronics: Microsystems of Active Type, by Alexander A. Ignatiev of Saratov State University and Alexander V. Lyashenko of JSC Research Institute Tantal in Russia, offers a very detailed and specialized account of the author's research and development of heteromagnetic materials and devices. The book is based on original material from the author's programs of designing heteromagnetic microsystems. Polyvalent, multiple parameter magneto-semiconductor microsystems are described and the book reports on extensive experimental and theoretical results of research in a range of frequencies up to 1000 GHz. For the first time the direction of satisfying criteria, and burst technologies, which can make a subject of discovery, are discussed in great detail. This book is intended for post-graduate students and researchers specializing in the design and application of heteromagnetic materials and devices. Alexander A. Ignatiev is author of Magnetoelectronics of Microwaves and Extremely High Frequenci...

  2. Effects of anodizing parameters and heat treatment on nanotopographical features, bioactivity, and cell culture response of additively manufactured porous titanium

    Energy Technology Data Exchange (ETDEWEB)

    Amin Yavari, S., E-mail: s.aminyavari@tudelft.nl [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands); Chai, Y.C. [Prometheus, Division of Skeletal Tissue Engineering, Bus 813, O& N1, Herestraat 49, KU Leuven, 3000 Leuven (Belgium); Tissue Engineering Laboratory, Skeletal Biology and Engineering Research Center, Bus 813, O& N1, Herestraat 49, KU Leuven, 3000 Leuven (Belgium); Department of Biomedical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Böttger, A.J. [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands); Wauthle, R. [KU Leuven, Department of Mechanical Engineering, Section Production Engineering, Machine Design and Automation (PMA), Celestijnenlaan 300B, 3001 Leuven (Belgium); 3D Systems — LayerWise NV, Grauwmeer 14, 3001 Leuven (Belgium); Schrooten, J. [Department of Metallurgy and Materials Engineering, KU Leuven, Kasteelpark Arenberg 44 — PB2450, B-3001 Heverlee (Belgium); Weinans, H. [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands); Department of Orthopedics and Dept. Rheumatology, UMC Utrecht, Heidelberglaan100, 3584CX Utrecht (Netherlands); Zadpoor, A.A. [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands)

    2015-06-01

    Anodizing could be used for bio-functionalization of the surfaces of titanium alloys. In this study, we use anodizing for creating nanotubes on the surface of porous titanium alloy bone substitutes manufactured using selective laser melting. Different sets of anodizing parameters (voltage: 10 or 20 V anodizing time: 30 min to 3 h) are used for anodizing porous titanium structures that were later heat treated at 500 °C. The nanotopographical features are examined using electron microscopy while the bioactivity of anodized surfaces is measured using immersion tests in the simulated body fluid (SBF). Moreover, the effects of anodizing and heat treatment on the performance of one representative anodized porous titanium structures are evaluated using in vitro cell culture assays using human periosteum-derived cells (hPDCs). It has been shown that while anodizing with different anodizing parameters results in very different nanotopographical features, i.e. nanotubes in the range of 20 to 55 nm, anodized surfaces have limited apatite-forming ability regardless of the applied anodizing parameters. The results of in vitro cell culture show that both anodizing, and thus generation of regular nanotopographical feature, and heat treatment improve the cell culture response of porous titanium. In particular, cell proliferation measured using metabolic activity and DNA content was improved for anodized and heat treated as well as for anodized but not heat-treated specimens. Heat treatment additionally improved the cell attachment of porous titanium surfaces and upregulated expression of osteogenic markers. Anodized but not heat-treated specimens showed some limited signs of upregulated expression of osteogenic markers. In conclusion, while varying the anodizing parameters creates different nanotube structure, it does not improve apatite-forming ability of porous titanium. However, both anodizing and heat treatment at 500 °C improve the cell culture response of porous titanium

  3. Loop Heat Pipe Manufacturing via DMLS for CubeSAT Applications, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Advanced Cooling Technologies, Inc. (ACT) proposes to develop a low-cost Loop Heat Pipe (LHP) evaporator using a technique known as Direct Metal Laser Sintering...

  4. Loop Heat Pipe Manufacturing via DMLS for CubeSAT Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Advanced Cooling Technologies, Inc. (ACT) proposes to develop a low-cost Loop Heat Pipe (LHP) evaporator using a technique known as Direct Metal Laser Sintering...

  5. Electrowetting-based microfluidic operations on rapid-manufactured devices for heat pipe applications

    Science.gov (United States)

    Hale, Renee S.; Bahadur, Vaibhav

    2017-07-01

    The heat transport capacity of traditional heat pipes is limited by the capillary pressure generated in the internal wick that pumps condensate to the evaporator. Recently, the authors conceptualized a novel heat pipe architecture, wherein wick-based pumping is replaced by electrowetting (EW)-based pumping of microliter droplets in the adiabatic section. An electrowetting heat pipe (EHP) can overcome the capillary limit to heat transport capacity and enable compact, planar, gravity-insensitive, and ultralow power consumption heat pipes that transport kiloWatt heat loads over extended distances. This work develops a novel technique for rapid, scalable fabrication of EW-based devices and studies critical microfluidic operations underlying the EHP, with the objective of predicting the key performance parameters of the EHP. Devices are fabricated on a printed circuit board (PCB) substrate with mechanically-milled electrodes, and a removable polyimide dielectric film. The first set of experiments uncovers the maximum channel gap (1 mm) for reliable EW-based pumping; this parameter determines the heat transport capacity of the EHP, which scales linearly with the channel gap. The second set of experiments uncovers the maximum channel gap (375 microns) at which EW voltages can successfully split droplets. This is an important consideration which ensures EHP operability in the event of unintentional droplet merging. The third set of experiments demonstrate and study EW-induced droplet generation from an open-to-air reservoir, which mimics the interface between the condenser and adiabatic sections of the EHP. The experimental findings predict that planar, water-based EHPs with a (10 cm by 4 mm) cross section can transport 1.6 kW over extended distances (>1 m), with a thermal resistance of 0.01 K W-1.

  6. Future trends in microelectronics journey into the unknown

    CERN Document Server

    Xu, Jimmy; Zaslavsky, Alexander

    2016-01-01

    Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals. The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities.

  7. Studies of Standard Heat Treatment Effects on Microstructure and Mechanical Properties of Laser Net Shape Manufactured INCONEL 718

    Science.gov (United States)

    Qi, H.; Azer, M.; Ritter, A.

    2009-10-01

    Laser net shape manufacturing (LNSM) is a laser cladding/deposition based technology, which can fabricate and repair near-net-shape high-performance components directly from metal powders. Characterizing mechanical properties of the laser net shape manufactured components is prerequisite to the applications of LNSM in aircraft engine industrial productions. Nickel-based superalloys such as INCONEL 718 are the most commonly used metal materials in aircraft engine high-performance components. In this study, the laser deposition process is optimized through a set of designed experiments to reduce the porosity to less than 0.03 pct. It is found that the use of plasma rotating electrode processed (PREP) powder and a high energy input level greater than 80 J/mm are necessary conditions to minimize the porosity. Material microstructure and tensile properties of laser-deposited INCONEL 718 are studied and compared under heat treatment conditions of as deposited, direct aged, solution treatment and aging (STA), and full homogenization followed by STA. Tensile test results showed that the direct age heat treatment produces the highest tensile strength equivalent to the wrought material, which is followed by the STA-treated and the homogenization-treated tensile strengths, while the ductility exhibits the reverse trend. Finally, failure modes of the tensile specimens were analyzed with fractography.

  8. Inverse optimal design of the radiant heating in materials processing and manufacturing

    Science.gov (United States)

    Fedorov, A. G.; Lee, K. H.; Viskanta, R.

    1998-12-01

    Combined convective, conductive, and radiative heat transfer is analyzed during heating of a continuously moving load in the industrial radiant oven. A transient, quasi-three-dimensional model of heat transfer between a continuous load of parts moving inside an oven on a conveyor belt at a constant speed and an array of radiant heaters/burners placed inside the furnace enclosure is developed. The model accounts for radiative exchange between the heaters and the load, heat conduction in the load, and convective heat transfer between the moving load and oven environment. The thermal model developed has been used to construct a general framework for an inverse optimal design of an industrial oven as an example. In particular, the procedure based on the Levenberg-Marquardt nonlinear least squares optimization algorithm has been developed to obtain the optimal temperatures of the heaters/burners that need to be specified to achieve a prescribed temperature distribution of the surface of a load. The results of calculations for several sample cases are reported to illustrate the capabilities of the procedure developed for the optimal inverse design of an industrial radiant oven.

  9. Robust design of microelectronics assemblies against mechanical shock, temperature and moisture effects of temperature, moisture and mechanical driving forces

    CERN Document Server

    Wong, E-H

    2015-01-01

    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr

  10. Microelectronics and nanoelectronics trends, and applications to HEP instrumentation

    CERN Multimedia

    CERN. Geneva

    2004-01-01

    Lecture 1 : Microelectronics and HEP instrumentation CMOS technology has been the leading technology in microelectronics for more that 30 years thanks to its outstanding capability to miniaturization and low power consumption. A brief history of the microelectronics semiconductor industry is presented with applications for LEP and LHC experiments. Lecture 2: Future trends in microelectronics and nanoelectronics Trends in miniaturization point to the fabrication of ULSI nanoscale CMOS circuits by the end of the decade. Device issues and quantum effects in nanoscale MOS transistor will be discussed. Beyond CMOS technology, several technology avenues based on nanotechnology are under investigation. We will present some promising nanoelectronic devices and circuits based on Single Electron Tunneling (SET) transistor, nanowire, quantum dot and carbon nanotubes. Lecture 3: Monolithic pixel detectors Microvertex detectors for particle physics experiments currently uses hybrid silicon pixel detector. Novel emerging m...

  11. Microstructure and hardness studies of Inconel 718 manufactured by selective laser melting before and after solution heat treatment

    Energy Technology Data Exchange (ETDEWEB)

    Tucho, Wakshum M., E-mail: wakshum.m.tucho@uis.no [Department of Mechanical and Structural Engineering and Materials Science, University of Stavanger, N-4036 Stavanger (Norway); Cuvillier, Priscille [Department of Mechanical and Structural Engineering and Materials Science, University of Stavanger, N-4036 Stavanger (Norway); Sjolyst-Kverneland, Atle [Roxar/Emerson Process Management, POB 112, 4065 Stavanger (Norway); Hansen, Vidar [Department of Mechanical and Structural Engineering and Materials Science, University of Stavanger, N-4036 Stavanger (Norway)

    2017-03-24

    The microstructure of Additive Manufactured (AM) Inconel 718 in general and Selective Laser Melting (SLM), in particular is different from the material produced by conventional methods due to the rapid solidification process associated with the former. As a result, the widely adapted standard solution heat treatment temperature (<1100 °C) for conventional material is found to be not high enough for materials fabricated with SLM method in order to dissolve Laves and other microsegregated phases for releasing the ageing constituents (Nb, Ti, Al) sufficiently into the alloy matrix. In this study, sample of Inconel 718 fabricated with SLM method were solution heat-treated to 1100 °C or 1250 °C at different hold times to investigate the dissolution of macro- and micro-segregated precipitates. Investigations of microstructure and segregation in as-printed and solution heat-treated states have been studied using Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and Optical Microscopy (OM). Measurement of material hardness was performed with Vickers hardness tests. The microstructure of the as-printed parts exhibit non-columnar grains, but contain well-shaped columnar/cellular sub-grains. The intergranular boundaries are decorated with high density of dislocations and segregated particles. Tremendous stress relief and grain coarsening were observed with solution heat treatment. In particular, at 1250 °C annealing, the sub-grains, including precipitates and dislocation networks along the sub-grain boundaries, were entirely dissolved. However, the 1100/1250 °C solution heat treatment scheme could not dissolve microsegregated precipitates and carbides completely. Details of the analysis on microstructure, dissolution of precipitates and hardness are presented.

  12. Microstructure and hardness studies of Inconel 718 manufactured by selective laser melting before and after solution heat treatment

    International Nuclear Information System (INIS)

    Tucho, Wakshum M.; Cuvillier, Priscille; Sjolyst-Kverneland, Atle; Hansen, Vidar

    2017-01-01

    The microstructure of Additive Manufactured (AM) Inconel 718 in general and Selective Laser Melting (SLM), in particular is different from the material produced by conventional methods due to the rapid solidification process associated with the former. As a result, the widely adapted standard solution heat treatment temperature (<1100 °C) for conventional material is found to be not high enough for materials fabricated with SLM method in order to dissolve Laves and other microsegregated phases for releasing the ageing constituents (Nb, Ti, Al) sufficiently into the alloy matrix. In this study, sample of Inconel 718 fabricated with SLM method were solution heat-treated to 1100 °C or 1250 °C at different hold times to investigate the dissolution of macro- and micro-segregated precipitates. Investigations of microstructure and segregation in as-printed and solution heat-treated states have been studied using Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and Optical Microscopy (OM). Measurement of material hardness was performed with Vickers hardness tests. The microstructure of the as-printed parts exhibit non-columnar grains, but contain well-shaped columnar/cellular sub-grains. The intergranular boundaries are decorated with high density of dislocations and segregated particles. Tremendous stress relief and grain coarsening were observed with solution heat treatment. In particular, at 1250 °C annealing, the sub-grains, including precipitates and dislocation networks along the sub-grain boundaries, were entirely dissolved. However, the 1100/1250 °C solution heat treatment scheme could not dissolve microsegregated precipitates and carbides completely. Details of the analysis on microstructure, dissolution of precipitates and hardness are presented.

  13. Manufacturability of Heat and Serve Ration in Institutional Pouch System Analysis

    Science.gov (United States)

    2006-09-01

    This original scope of the project was to execute manufacturability studies on the ISP and develop a knowledge base that could be used to increase the...SHRIMP #10, DEHYD 8905-01-260-7475 2 X DHY AMER CHEESE 8910-00-823-6880 2 X DHY ONION #10 8915-00-128-1179 2 X CHOC CKIE MIX #10 8920-00...8920-00-935-3264 2 X CHOC ICING MX #10 8925-00-935-3260 2 X CHICKEN GRAVY MIX 8940-01-368-1615 2 x CHILI DHY #10 / 395-4611 8940-01-395

  14. IP validation in remote microelectronics testing

    Science.gov (United States)

    Osseiran, Adam; Eshraghian, Kamran; Lachowicz, Stefan; Zhao, Xiaoli; Jeffery, Roger; Robins, Michael

    2004-03-01

    This paper presents the test and validation of FPGA based IP using the concept of remote testing. It demonstrates how a virtual tester environment based on a powerful, networked Integrated Circuit testing facility, aimed to complement the emerging Australian microelectronics based research and development, can be employed to perform the tasks beyond the standard IC test. IC testing in production consists in verifying the tested products and eliminating defective parts. Defects could have a number of different causes, including process defects, process migration and IP design and implementation errors. One of the challenges in semiconductor testing is that while current fault models are used to represent likely faults (stuck-at, delay, etc.) in a global context, they do not account for all possible defects. Research in this field keeps growing but the high cost of ATE is preventing a large community from accessing test and verification equipment to validate innovative IP designs. For these reasons a world class networked IC teletest facility has been established in Australia under the support of the Commonwealth government. The facility is based on a state-of-the-art semiconductor tester operating as a virtual centre spanning Australia and accessible internationally. Through a novel approach the teletest network provides virtual access to the tester on which the DUT has previously been placed. The tester software is then accessible as if the designer is sitting next to the tester. This paper presents the approach used to test and validate FPGA based IPs using this remote test approach.

  15. Use of COTS microelectronics in radiation environments

    International Nuclear Information System (INIS)

    Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

    1999-01-01

    This paper addresses key issues for the cost-effective use of COTS (Commercially available Off The Shelf) microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. They review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMs increases from 1.4 x 10 8 rad(Si)/s for a 256K SRAM to 7.7 x 10 9 rad(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design of process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10--15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMs from three different date codes. In another study, irradiations of 4M SRAMs from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of COTS and radiation-hardened (RH) technology

  16. Carbon-ionogel supercapacitors for integrated microelectronics

    Science.gov (United States)

    Leung, Greg; Smith, Leland; Lau, Jonathan; Dunn, Bruce; Chui, Chi On

    2016-01-01

    To exceed the performance limits of dielectric capacitors in microelectronic circuit applications, we design and demonstrate on-chip coplanar electric double-layer capacitors (EDLCs), or supercapacitors, employing carbon-coated gold electrodes with ionogel electrolyte. The formation of carbon-coated microelectrodes is accomplished by solution processing and results in a ten-fold increase in EDLC capacitance compared to bare gold electrodes without carbon. At frequencies up to 10 Hz, an areal capacitance of 2.1 pF μm-2 is achieved for coplanar carbon-ionogel EDLCs with 10 μm electrode gaps and 0.14 mm2 electrode area. Our smallest devices, comprised of 5 μm electrode gaps and 80 μm2 of active electrode area, reach areal capacitance values of ˜0.3 pF μm-2 at frequencies up to 1 kHz, even without carbon. To our knowledge, these are the highest reported values to date for on-chip EDLCs with sub-mm2 areas. A physical EDLC model is developed through the use of computer-aided simulations for design exploration and optimization of coplanar EDLCs. Through modeling and comparison with experimental data, we highlight the importance of reducing the electrode gap and electrolyte resistance to achieve maximum performance from on-chip EDLCs.

  17. Characterization and Processing Behavior of Heated Aluminum-Polycarbonate Composite Build Plates for the FDM Additive Manufacturing Process

    Directory of Open Access Journals (Sweden)

    Sherri L. Messimer

    2018-02-01

    Full Text Available One of the most essential components of the fused deposition modeling (FDM additive manufacturing (AM process is the build plate, the surface upon which the part is constructed. These are typically made from aluminum or glass, but there are clear disadvantages to both and restrictions on which materials can be processed on them successfully. This study examined the suitability of heated aluminum-polycarbonate (AL-PC composite print beds for FDM, looking particularly at the mechanical properties, thermal behavior, deformation behavior, bonding strength with deposited material, printing quality, and range of material usability. Theoretical examination and physical experiments were performed for each of these areas; the results were compared to similar experiments done using heated aluminum and aluminum-glass print beds. Ten distinct materials (ABS, PLA, PET, HIPS, PC, TPU, PVA, nylon, metal PLA, and carbon-fiber PLA were tested for printing performance. The use of a heated AL-PC print bed was found to be a practical option for most of the materials, particularly ABS and TPU, which are often challenging to process using traditional print bed types. Generally, the results were found to be equivalent to or superior to tempered glass and superior to standard aluminum build plates in terms of printing capability.

  18. Effect of heat treatment on the microstructure of Co-Cr-W alloy fabricated by laser additive manufacturing

    Science.gov (United States)

    Ren, Bo; Chen, Changjun; Zhang, Min

    2018-04-01

    Stellite 6 cobalt-based alloy powder was used to produce Co-Cr-W alloy using laser additive manufacturing technology, and then different heat treatment strategies were carried out on the deposited sample. The characteristics of microstructure under different heat treatment conditions were investigated using scanning electron microscopy with energy dispersive spectroscopy, transmission electron microscope, and x-ray diffraction. The results show that the as-deposited sample has few cracks or pores, and the microstructure is typical dendritic structure, and lamellar eutectic carbides are rich in Cr in interdendritic. The matrix mainly consists of γ phases and a few ɛ phases. Some γ phases transform into ɛ phases after 900°C/6 h aging treatment and lamellar eutectic carbides transform into blocky carbides presenting as a network, most of the carbides are rich in Cr and a few are rich in W. When heat treated at 1200°C/1 h followed by water cooling and then treated at 900°C/6 h followed by furnace cooling, it can be found that some γ phases transform into ɛ phases. The carbides transform into elliptical M23C6 carbides that are rich in Cr with the size of 1 to 3 μm and a part of W-rich carbides.

  19. Additive manufacturing of Co-Cr-Mo alloy: Influence of heat treatment on microstructure, tribological and electrochemical properties

    Directory of Open Access Journals (Sweden)

    Kedar Mallik Mantrala

    2015-03-01

    Full Text Available Co-Cr-Mo alloy samples, fabricated using Laser Engineered Net Shaping – a laser based additive manufacturing technology, have been subjected heat treatment to study its influence on microstructure, wear and corrosion properties. Following L9 Orthogonal array of Taguchi method, the samples were solutionized at 1200oC for 30, 45 and 60 min followed by water quenching. Ageing treatment was done at 815oC and 830oC for 2, 4 and 6 h. Heat treated samples were evaluated for their microstructure, hardness, wear resistance and corrosion resistance. The results revealed that highest hardness of 512 ± 58 Hv and wear rate of 0.90 ± 0.14 × 10-4 mm3/N.m can be achieved with appropriate post-fabrication heat treatment. ANOVA and grey relational analysis on the experimental data revealed that the samples subjected to solution treatment for 60 min, without ageing, exhibit best combination of hardness, wear and corrosion resistance.

  20. Manufacturing wizardry : products to tame heat, cold, deserts, swamps and underground infernos

    International Nuclear Information System (INIS)

    Jaremko, G.

    1997-01-01

    Some examples of Canadian oil and natural gas service equipment are cited as examples of exportable Canadian know-how. Foremosts are Canadian made, all terrain vehicles, designed to work in rugged terrain. Calgary-based Foremost Industries Inc., has sold several of their industrial vehicles for the Taklamakan, the high desert in the Tarim Basin of northwestern China. The huge vehicles with monster tires can haul up to 70 tonnes of material and leave very little or no mark on the wilderness. Foremost Industries Inc. is also an international corporation with branches in Nevada and Indiana. Their success stems from the fact that they were able to develop a vehicle for well drilling that would withstand the rough terrain and extreme climate conditions across western and northern Canada. Atco, a Calgary-based company, has developed quality portable housing to shelter surveyors, geologists, and drilling-rig crews. Another company, Reynolds Manufacturing, has developed safety clothing for workers in the oil industry. Canadian Oilfield Rigs and Equipment Fabrication Inc., manufacture volume production technology packages such as wireline data recording vehicles and well-service rigs, sold in markets from Algeria to Venezuela. 5 figs

  1. [Automated analysis of bacterial preparations manufactured on automatic heat fixation and staining equipment].

    Science.gov (United States)

    2012-01-01

    Heat fixation of preparations was made in the fixation bath designed by EMKO (Russia). Programmable "Emkosteiner" (EMKO, Russia) was used for trial staining. Reagents set Micko-GRAM-NITsF was applied for Gram's method of staining. It was demostrated that automatic smear fixation equipment and programmable staining ensure high-quality imaging (1% chromaticity variation) good enough for standardization of Gram's staining of microbial preparations.

  2. High density microelectronics package using low temperature cofirable ceramics

    International Nuclear Information System (INIS)

    Fu, S.-L.; Hsi, C.-S.; Chen, L.-S.; Lin, W. K.

    1997-01-01

    Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe 2/3 W 1/3 ) x (Fe l/2 Nb l/2 ) y Ti 2 O 3 was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)

  3. High density microelectronics package using low temperature cofirable ceramics

    Energy Technology Data Exchange (ETDEWEB)

    Fu, S -L; Hsi, C -S; Chen, L -S; Lin, W K [Kaoshiung Polytechnic Institute Ta-Hsu, Kaoshiung (China)

    1998-12-31

    Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe{sub 2/3}W{sub 1/3}){sub x}(Fe{sub l/2}Nb{sub l/2}){sub y}Ti{sub 2}O{sub 3} was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)

  4. An Investigation of the Microstructure and Fatigue Behavior of Additively Manufactured AISI 316L Stainless Steel with Regard to the Influence of Heat Treatment

    Directory of Open Access Journals (Sweden)

    Bastian Blinn

    2018-03-01

    Full Text Available To exploit the whole potential of Additive Manufacturing, it is essential to investigate the complex relationships between Additive Manufacturing processes, the resulting microstructure, and mechanical properties of the materials and components. In the present work, Selective Laser Melted (SLM (process category: powder bed fusion, Laser Deposition Welded (LDW (process category: direct energy deposition and, for comparison, Continuous Casted and then hot and cold drawn (CC austenitic stainless steel AISI 316L blanks were investigated with regard to their microstructure and mechanical properties. To exclude the influence of surface topography and focus the investigation on the volume microstructure, the blanks were turned into final geometry of specimens. The additively manufactured (AM- blanks were manufactured in both the horizontal and vertical building directions. In the horizontally built specimens, the layer planes are perpendicular and in vertical building direction, they are parallel to the load axis of the specimens. The materials from different manufacturing processes exhibit different chemical composition and hence, austenite stability. Additionally, all types of blanks were heat treated (2 h, 1070 °C, H2O and the influence of the heat treatment on the properties of differently manufactured materials were investigated. From the cyclic deformation curves obtained in the load increase tests, the anisotropic fatigue behavior of the AM-specimens could be detected with only one specimen in each building direction for the different Additive Manufacturing processes, which could be confirmed by constant amplitude tests. The results showed higher fatigue strength for horizontally built specimens compared to the vertical building direction. Furthermore, the constant amplitude tests show that the austenite stability influences the fatigue behavior of differently manufactured 316L. Using load increase tests as an efficient rating method of the

  5. Plan for advanced microelectronics processing technology application

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  6. Additive Manufacturing of 17-4 PH Stainless Steel: Post-processing Heat Treatment to Achieve Uniform Reproducible Microstructure

    Science.gov (United States)

    Cheruvathur, Sudha; Lass, Eric A.; Campbell, Carelyn E.

    2016-03-01

    17-4 precipitation hardenable (PH) stainless steel is a useful material when a combination of high strength and good corrosion resistance up to about 315°C is required. In the wrought form, this steel has a fully martensitic structure that can be strengthened by precipitation of fine Cu-rich face-centered cubic phase upon aging. When fabricated via additive manufacturing (AM), specifically laser powder-bed fusion, 17-4 PH steel exhibits a dendritic structure containing a substantial fraction of nearly 50% of retained austenite along with body centered cubic/martensite and fine niobium carbides preferentially aligned along interdendritic boundaries. The effect of post-build thermal processing on the material microstructure is studied in comparison to that of conventionally produced wrought 17-4 PH with the intention of creating a more uniform, fully martensitic microstructure. The recommended stress relief heat treatment currently employed in industry for post-processing of AM 17-4 PH steel is found to have little effect on the as-built dendritic microstructure. It is found that, by implementing the recommended homogenization heat treatment regimen of Aerospace Materials Specification 5355 for CB7Cu-1, a casting alloy analog to 17-4 PH, the dendritic solidification structure is eliminated, resulting in a microstructure containing about 90% martensite with 10% retained austenite.

  7. Effect of Heat Treatment on Microstructure and Mechanical Properties of Laser Additively Manufactured AISI H13 Tool Steel

    Science.gov (United States)

    Chen, ChangJun; Yan, Kai; Qin, Lanlan; Zhang, Min; Wang, Xiaonan; Zou, Tao; Hu, Zengrong

    2017-11-01

    The effect of heat treatment on microstructure and mechanical properties (microhardness, wear resistance and impact toughness) of laser additively manufactured AISI H13 tool steel was systemically investigated. To understand the variation of microstructure and mechanical properties under different heat treatments, the as-deposited samples were treated at 350, 450, 550, 600 and 650 °C/2 h, respectively. Microstructure and phase transformation were investigated through optical microscopy, scanning electron microscope and transmission electron microscope. The mechanical properties were characterized by nanoindentation tests, Charpy tests and high-temperature wear tests. The microstructure of as-deposited samples consisted of martensite, ultrafine carbides and retained austenite. After the tempering treatment, the martensite was converted into tempered martensite and some fine alloy carbides which precipitated in the matrix. When treated at 550 °C, the greatest hardness and nanohardness were 600 HV0.3 and 6119.4 MPa due to many needle-like carbides precipitation. The value of hardness increased firstly and then decreased when increasing the temperature. When tempered temperatures exceeded 550 °C, the carbides became coarse, and martensitic matrix recrystallized at the temperature of 650 °C. The least impact energy was 6.0 J at a temperature of 550 °C. Samples tempered at 550 °C had larger wear volume loss than that of others. Wear resistances of all samples under atmospheric condition at 400 °C showed an oxidation mechanism.

  8. The effect of postproduction heat treatment on γ-TiAl alloys produced by the GTAW-based additive manufacturing process

    Energy Technology Data Exchange (ETDEWEB)

    Ma, Yan; Cuiuri, Dominic; Li, Huijun; Pan, Zengxi, E-mail: zengxi@uow.edu.au; Shen, Chen

    2016-03-07

    Postproduction heat treatments were carried out on additively manufactured γ-TiAl alloys that were produced by using the gas tungsten arc welding (GTAW) process. The microstructural evolution and mechanical properties of both as-fabricated and heat-treated specimens were investigated to assess the effect of different heat treatment conditions, by using optical microscopy (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD), Neutron Diffraction and tensile tests. The results indicated that heat treatment promotes the formation of the γ phase in the majority region after heat treatment at 1200 °C for 24 h, while a fully lamellar structure was formed in the near-substrate zone. The response to heat treatment at 1060 °C/24 h was markedly different, producing a fine lamellar structure with differing sizes in the majority region and near-substrate zone. These various microstructural characteristics determined the mechanical properties of the heat-treated samples. The heat-treated samples at 1200 °C/24 h exhibited lower UTS and microhardness values but higher ductility than the as-fabricated samples without heat treatment, while the 1060 °C/24 h heat treatment resulted in higher UTS and microhardness values but lower ductility. Due to the homogenous microstructure in the majority region after each postproduction heat treatment, the tensile properties were similar for both the build direction (Z) and travel direction (Y), thereby minimising the anisotropy that is exhibited by the as-fabricated alloy prior to heat treatment.

  9. Experiences with integral microelectronics on smart structures for space

    Science.gov (United States)

    Nye, Ted; Casteel, Scott; Navarro, Sergio A.; Kraml, Bob

    1995-05-01

    One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX II) space-flight experiments implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. The data bus was controlled by Actel field programmable gate arrays arranged in a single master, four slave configuration. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via Delta Transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Thus, over-vibration detection circuitry with automatic output isolation was incorporated into the design. This was not used however, since during experiment integration and test, intentionally induced compensator instabilities resulted in benign mechanical oscillation symptoms. Not too surprisingly, it was determined that instabilities were most detectable by large temperature increases in the electronics, typically

  10. Effect of Heat Treatment on Microstructure and Impact Toughness of Ti-6Al-4V Manufactured by Selective Laser Melting Process

    Directory of Open Access Journals (Sweden)

    Lee K.-A.

    2017-06-01

    Full Text Available This study manufactured Ti-6Al-4V alloy using one of the powder bed fusion 3D-printing processes, selective laser melting, and investigated the effect of heat treatment (650°C/3hrs on microstructure and impact toughness of the material. Initial microstructural observation identified prior-β grain along the building direction before and after heat treatment. In addition, the material formed a fully martensite structure before heat treatment, and after heat treatment, α and β phase were formed simultaneously. Charpy impact tests were conducted. The average impact energy measured as 6.0 J before heat treatment, and after heat treatment, the average impact energy increased by approximately 20% to 7.3 J. Fracture surface observation after the impact test showed that both alloys had brittle characteristics on macro levels, but showed ductile fracture characteristics and dimples at micro levels.

  11. Application of ionizing radiation processing in biomedical engineering and microelectronics

    International Nuclear Information System (INIS)

    Hongfej, H.; Jilan, W.

    1988-01-01

    The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristics reaction means such as crosslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become a important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this technique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics

  12. Applications of ionizing radiation processing in biomedical engineering and microelectronics

    International Nuclear Information System (INIS)

    Ha Hongfei; Wu Jilan

    1987-01-01

    The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristic reaction means such as corsslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become an important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this techique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics. (author)

  13. Implementation of microelectronic components in nuclear application

    International Nuclear Information System (INIS)

    Ashour, M.A

    1997-01-01

    As the next logical step in the evolution of programmable devices, Field programmable interconnect components (FPIC) bring the benefits of programmability to the system-level by enabling totally p rogrammable hardware . Continuing what was started by programmable memories twenty years ago and then enhanced by programmable logic ten years later, programmable interconnect holds the key to complete system programmability. History has shown that flexibility is the key benefit realized by programmable technologies (see figure 1). Initially used in a lab environment for design verification purposes, programmable technologies enhance development and ease of experimentation. As experience by more users is accumulated, performances improves and component prices are reduced, applications rapidly expand to address highly flexible and quickly implemented final manufactured products. With similar attributes of it's programmable predecessors, FPIC technology provides an attractive solution to the design verification problems of today and the manufacturing challenges of tomorrow

  14. Computer simulation of electromigration in microelectronics interconnect

    OpenAIRE

    Zhu, Xiaoxin

    2014-01-01

    Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

  15. Microelectronics Revolution And The Impact Of Automation In The New Industrialized Countries

    Science.gov (United States)

    Baranauskas, Vitor

    1984-08-01

    A brief review of some important historical points on the origin of the Factories and the Industrial Revolution is presented with emphasis in the social problems related to the automation of the human labor. Until the World War I, the social changes provoked by the Industrial Revolution caused one division of the World in developed and underdeveloped countries. After that period, the less developed nations began their industrialization mainly through the Multinationals Corporations (MC). These enterprises were very important to the production and exportation of utilities and manufactures in general, mainly in those products which required intensive and direct human labor. At present time, with the pervasiveness of microelectronics in the automation, this age seems to reaching an end because all continous processes in industry tend economicaly toward total automation. This fact will cause a retraction in long-term investments and, beyond massive unemployment, there is a tendency for these MC industries to return to their original countries. The most promising alternative to avoid these events, and perhaps the unique, is to incentive an autonomous development in areas of high technology, as for instance, the microelectronics itself.

  16. Temperature-independent resistor for microelectronic circuits

    Science.gov (United States)

    Aegerter, S.; Libby, W. F.

    1970-01-01

    Heat treating insulating crystals in gaseous hydrogen atmosphere produce resistive device which is temperature-independent from 77 to 295 degrees K. Increasing the concentration of hydrogen within the crystal yields semiconductor, hybrid, and metallic conduction characteristics which are combined with a depletion layer at the surface.

  17. Bioelectrochemical Integration of Waste Heat Recovery, Waste-to- Energy Conversion, and Waste-to-Chemical Conversion with Industrial Gas and Chemical Manufacturing Processes

    Energy Technology Data Exchange (ETDEWEB)

    Mac Dougall, James [Air Products and Chemicals, Inc., Allentown, PA (United States)

    2016-02-05

    Many U.S. manufacturing facilities generate unrecovered, low-grade waste heat, and also generate or are located near organic-content waste effluents. Bioelectrochemical systems, such as microbial fuel cells and microbial electrolysis cells, provide a means to convert organic-content effluents into electric power and useful chemical products. A novel biochemical electrical system for industrial manufacturing processes uniquely integrates both waste heat recovery and waste effluent conversion, thereby significantly reducing manufacturing energy requirements. This project will enable the further development of this technology so that it can be applied across a wide variety of US manufacturing segments, including the chemical, food, pharmaceutical, refinery, and pulp and paper industries. It is conservatively estimated that adoption of this technology could provide nearly 40 TBtu/yr of energy, or more than 1% of the U.S. total industrial electricity use, while reducing CO2 emissions by more than 6 million tons per year. Commercialization of this technology will make a significant contribution to DOE’s Industrial Technology Program goals for doubling energy efficiency and providing a more robust and competitive domestic manufacturing base.

  18. Micro-electronics and employment in the Japanese automobile industry.

    OpenAIRE

    Watanabe, S

    1984-01-01

    ILO pub-WEP pub. Working paper on the employment effects of microelectronics technological change and industrial robots in the motor vehicle industry in Japan - examines industrial processes, labour productivity, job requirements of automobile workers, effects on the subcontracting system and small scale industry, diffusion patterns and prospects, etc. Bibliography, references and statistical tables.

  19. Microelectronics materials characterization studies at the Cornell TRIGA Reactor

    International Nuclear Information System (INIS)

    McGuire, Stephen C.

    1992-01-01

    The Cornell program of microelectronics materials characterization by neutron activation analysis (NAA) is described. Experimental details and results from the successful application of NAA to silicon germanium circuit structures and nickel silicide layers are presented. In doing so, the potential for using X rays from isotopes that decay by electron capture is demonstrated. (author)

  20. Effects of Heat Treatment on the Microstructures and High Temperature Mechanical Properties of Hypereutectic Al-14Si-Cu-Mg Alloy Manufactured by Liquid Phase Sintering Process

    Science.gov (United States)

    Heo, Joon-Young; Gwon, Jin-Han; Park, Jong-Kwan; Lee, Kee-Ahn

    2018-05-01

    Hypereutectic Al-Si alloy is an aluminum alloy containing at least 12.6 wt.% Si. It is necessary to evenly control the primary Si particle size and distribution in hypereutectic Al-Si alloy. In order to achieve this, there have been attempts to manufacture hypereutectic Al-Si alloy through a liquid phase sintering. This study investigated the microstructures and high temperature mechanical properties of hypereutectic Al-14Si-Cu-Mg alloy manufactured by liquid phase sintering process and changes in them after T6 heat treatment. Microstructural observation identified large amounts of small primary Si particles evenly distributed in the matrix, and small amounts of various precipitation phases were found in grain interiors and grain boundaries. After T6 heat treatment, the primary Si particle size and shape did not change significantly, but the size and distribution of CuAl2 ( θ) and AlCuMgSi ( Q) changed. Hardness tests measured 97.36 HV after sintering and 142.5 HV after heat treatment. Compression tests were performed from room temperature to 300 °C. The results represented that yield strength was greater after heat treatment (RT 300 °C: 351 93 MPa) than after sintering (RT 300 °C: 210 89 MPa). Fracture surface analysis identified cracks developing mostly along the interface between the primary Si particles and the matrix with some differences among temperature conditions. In addition, brittle fracture mode was found after T6 heat treatment.

  1. Japan's technology and manufacturing infrastructure

    Science.gov (United States)

    Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

    1995-02-01

    The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

  2. Manufacturing of small-scale mock-ups and of a semi-prototype of the ITER Normal Heat Flux First Wall

    International Nuclear Information System (INIS)

    Banetta, S.; Zacchia, F.; Lorenzetto, P.; Bobin-Vastra, I.; Boireau, B.; Cottin, A.; Mitteau, R.; Eaton, R.; Raffray, R.

    2014-01-01

    This paper describes the manufacturing development and fabrication of reduced scale ITER First Wall (FW) mock-ups of the Normal Heat Flux (NHF) design, including a “semi-prototype” with a dimension of 305 mm × 660 mm, corresponding to about 1/6 of a full-scale panel. The activity was carried out in the framework of the pre-qualification of the European Domestic Agency (EU-DA or F4E) for the supply of the European share of the ITER First Wall. The hardware consists of three Upgraded (2 MW/m 2 ) Normal Heat Flux (U-NHF) small-scale mock-ups, bearing 3 beryllium tiles each, and of one Semi-Prototype, representing six full-scale fingers and bearing a total of 84 beryllium tiles. The manufacturing process makes extensive use of Hot Isostatic Pressing, which was developed over more than a decade during ITER Engineering Design Activity phase. The main manufacturing steps for the semi-prototype are described, with special reference to the lessons learned and the implications impacting the future fabrication of the full-scale prototype and the series which consists of 218 panels plus spares. In addition, a “tile-size” mock-up was manufactured in order to assess the performance of larger tiles. The use of larger tiles would be highly beneficial since it would allow a significant reduction of the panel assembly time

  3. Effects of heat treatment on microstructure and mechanical behaviour of additive manufactured porous Ti6Al4V

    NARCIS (Netherlands)

    Ahmadi, S.M.; Ashok Kumar Jain, R. K.; Zadpoor, A.A.; Ayas, C.; Popovich, V.

    2018-01-01

    Titanium and its alloys such as Ti6Al4V play a major role in the medical industry as bone implants. Nowadays, by the aid of additive manufacturing (AM), it is possible to manufacture porous complex structures which mimic human bone. However, AM parts are near net shape and post processing may be

  4. Applicability of LET to single events in microelectronic structures

    Science.gov (United States)

    Xapsos, Michael A.

    1992-12-01

    LET is often used as a single parameter to determine the energy deposited in a microelectronic structure by a single event. The accuracy of this assumption is examined for ranges of ion energies and volumes of silicon appropriate for modern microelectronics. It is shown to be accurate only under very restricted conditions. Significant differences arise because (1) LET is related to energy lost by the ion, not energy deposited in the volume; and (2) LET is an average value and does not account for statistical variations in energy deposition. Criteria are suggested for determining when factors other than LET should be considered, and new analytical approaches are presented to account for them. One implication of these results is that improvements can be made in space upset rate predictions by incorporating the new methods into currently used codes such as CREME and CRUP.

  5. Lessons learned from early microelectronics production at Sandia National Laboratories

    Energy Technology Data Exchange (ETDEWEB)

    Weaver, H.T.

    1998-02-01

    During the 1980s Sandia designed, developed, fabricated, tested, and delivered hundreds of thousands of radiation hardened Integrated Circuits (IC) for use in weapons and satellites. Initially, Sandia carried out all phases, design through delivery, so that development of next generation ICs and production of current generation circuits were carried out simultaneously. All this changed in the mid-eighties when an outside contractor was brought in to produce ICs that Sandia developed, in effect creating a crisp separation between development and production. This partnership had a severe impact on operations, but its more damaging effect was the degradation of Sandia`s microelectronics capabilities. This report outlines microelectronics development and production in the early eighties and summarizes the impact of changing to a separate contractor for production. This record suggests that low volume production be best accomplished within the development organization.

  6. Exploration Of `Click' Chemistry For Microelectronic Applications

    Science.gov (United States)

    Musa, Osama M.; Sridhar, Laxmisha M.

    The ‘Click’ chemistry was explored for low temperature snap cure and for possible use as an adhesion promoter in electronic applications. Several azide and alkyne resins were synthesized and their curing potential was evaluated with a special emphasis on exploring Cu(I) catalyst effect. The preliminary curing study in the absence of catalysts showed a strong dependence of cure temperatures on the electronic nature of alkynes. The cure temperatures showed a tendency to increase with decreasing electronegativity of the substituent on alkynes. The capability of Cu(I) catalysts to accelerate the ‘Click’ chemistry was demonstrated for the first time in bulk phase. Using several Cu(I) catalysts, the cure temperatures could be lowered by as much as 40-100°C compared to the control, depending on the nature of catalyst and the catalyst loading. We discovered a novel synergistic effect between Cu(I) and silver filler in lowering the cure temperatures. Using this combination, lower cure temperatures could be obtained than using either alone. Among several resins screened, one resin system has shown promise for 80°C snap-cure in which the aforementioned synergistic effect is operative. Solution phase ‘Click’ chemistry was employed for the synthesis of a hybrid triazole-epoxy resin system. This system was found to cure without added amine curative. The triazole group here serves as a linker as well as an internal adhesion promoter. To address the incompatibility and volatility issues, which arose during evaluation, a controlled oligomerization method has been developed using controlled heating of azides and alkynes in solution phase.

  7. The effect of hot days on occupational heat stress in the manufacturing industry: implications for workers' well-being and productivity

    Science.gov (United States)

    Pogačar, Tjaša; Casanueva, Ana; Kozjek, Katja; Ciuha, Urša; Mekjavić, Igor B.; Kajfež Bogataj, Lučka; Črepinšek, Zalika

    2018-03-01

    Climate change is expected to exacerbate heat stress at the workplace in temperate regions, such as Slovenia. It is therefore of paramount importance to study present and future summer heat conditions and analyze the impact of heat on workers. A set of climate indices based on summer mean (Tmean) and maximum (Tmax) air temperatures, such as the number of hot days (HD: Tmax above 30 °C), and Wet Bulb Globe Temperature (WBGT) were used to account for heat conditions in Slovenia at six locations in the period 1981-2010. Observed trends (1961-2011) of Tmean and Tmax in July were positive, being larger in the eastern part of the country. Climate change projections showed an increase up to 4.5 °C for mean temperature and 35 days for HD by the end of the twenty-first century under the high emission scenario. The increase in WBGT was smaller, although sufficiently high to increase the frequency of days with a high risk of heat stress up to an average of a third of the summer days. A case study performed at a Slovenian automobile parts manufacturing plant revealed non-optimal working conditions during summer 2016 (WBGT mainly between 20 and 25 °C). A survey conducted on 400 workers revealed that 96% perceived the temperature conditions as unsuitable, and 56% experienced headaches and fatigue. Given these conditions and climate change projections, the escalating problem of heat is worrisome. The European Commission initiated a program of research within the Horizon 2020 program to develop a heat warning system for European workers and employers, which will incorporate case-specific solutions to mitigate heat stress.

  8. Numerical modeling of heat-transfer and the influence of process parameters on tailoring the grain morphology of IN718 in electron beam additive manufacturing

    International Nuclear Information System (INIS)

    Raghavan, Narendran; Dehoff, Ryan; Pannala, Sreekanth; Simunovic, Srdjan; Kirka, Michael; Turner, John; Carlson, Neil; Babu, Sudarsanam S.

    2016-01-01

    The fabrication of 3-D parts from CAD models by additive manufacturing (AM) is a disruptive technology that is transforming the metal manufacturing industry. The correlation between solidification microstructure and mechanical properties has been well understood in the casting and welding processes over the years. This paper focuses on extending these principles to additive manufacturing to understand the transient phenomena of repeated melting and solidification during electron beam powder melting process to achieve site-specific microstructure control within a fabricated component. In this paper, we have developed a novel melt scan strategy for electron beam melting of nickel-base superalloy (Inconel 718) and also analyzed 3-D heat transfer conditions using a parallel numerical solidification code (Truchas) developed at Los Alamos National Laboratory. The spatial and temporal variations of temperature gradient (G) and growth velocity (R) at the liquid-solid interface of the melt pool were calculated as a function of electron beam parameters. By manipulating the relative number of voxels that lie in the columnar or equiaxed region, the crystallographic texture of the components can be controlled to an extent. The analysis of the parameters provided optimum processing conditions that will result in columnar to equiaxed transition (CET) during the solidification. The results from the numerical simulations were validated by experimental processing and characterization thereby proving the potential of additive manufacturing process to achieve site-specific crystallographic texture control within a fabricated component.

  9. Material science and manufacturing of heat-resistant reduced-activation ferritic-martensitic steels for fusion

    International Nuclear Information System (INIS)

    Ioltukhovskiy, A.G.; Blokhin, A.I.; Budylkin, N.I.; Chernov, V.M.; Leont'eva-Smirnova, M.V.; Mironova, E.G.; Medvedeva, E.A.; Solonin, M.I.; Porollo, S.I.; Zavyalsky, L.P.

    2000-01-01

    A number of issues regarding the development and use of 10-12% Cr reduced-activation ferritic-martensitic steels (RAFMS) for fusion are considered. These include: (1) problems of manufacturing and modifying their composition and metallurgical condition; (2) the influence on properties of their composition, purity, δ-ferrite concentration and cooling rates in the final stages of manufacturing; and (3) the effects of neutron irradiation at 320-650 deg. C up to 108 dpa on their mechanical properties. In addition, neutron activation and nuclear accumulation of elements in RAFMS with different initial concentrations of alloying and impurity elements for typical fusion reactor (DEMO) irradiation regimes have been calculated

  10. Microelectronic Status Analysis and Secondary Part Procureability Assessment of the HAWK Weapon System

    National Research Council Canada - National Science Library

    Maddux, Gary

    2000-01-01

    The MT Division, Engineering Directorate (ED), RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the HAWK weapon system...

  11. Microelectronic Status Analysis and Secondary Part Procureability Assessment of the HAWK Weapon System

    National Research Council Canada - National Science Library

    Maddux, Gary

    1999-01-01

    The Industrial Operations Division (IOD), SEPD, RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the HAWK weapon system...

  12. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  13. Using SDI-12 with ST microelectronics MCU's

    Energy Technology Data Exchange (ETDEWEB)

    Saari, Alexandra [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Hinzey, Shawn Adrian [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Frigo, Janette Rose [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Proicou, Michael Chris [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Borges, Louis [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2015-09-03

    ST Microelectronics microcontrollers and processors are readily available, capable and economical processors. Unfortunately they lack a broad user base like similar offerings from Texas Instrument, Atmel, or Microchip. All of these devices could be useful in economical devices for remote sensing applications used with environmental sensing. With the increased need for environmental studies, and limited budgets, flexibility in hardware is very important. To that end, and in an effort to increase open support of ST devices, I am sharing my teams' experience in interfacing a common environmental sensor communication protocol (SDI-12) with ST devices.

  14. High Efficiency Microchannel Diamond Heat Sinks, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — While absolute power levels in microelectronic devices are relatively modest (a few tens to a few hundred watts), heat fluxes can be significant (~50 W/cm2 in...

  15. Effect of heat absorbing powder addition on cell morphology of porous titanium composite manufactured by reactive precursor method

    International Nuclear Information System (INIS)

    Kobashi, Makoto; Kamiya, Yoshinori; Kanetake, Naoyuki

    2012-01-01

    Open-cell structured porous titanium/ceramics composite was synthesized by a reactive precursor method using titanium and boron carbide (B 4 C) as reactant powders. Pore morphology was controlled by adding heat absorbing powder (titanium diboride: TiB 2 ) in the Ti+B 4 C blended powder. The effects of molar blending ratio of titanium and B 4 C and the amount of heat absorbing powder addition on the cell morphology (either open or closed) were investigated. Fine and homogeneous open-cell structure was achieved by adding appropriate amount of heat absorbing agent powder (>15 vol%), and the relative density of the specimen after the reaction became closer to that of the precursor by increasing TiB 2 volume fraction. When the volume fraction of TiB 2 addition was 20%, the open-cell fraction was maintained as 1.0 regardless of the relative density of the precursor.

  16. ICMCS-2014: 8. international conference on microelectronics and computer science and 5. conference of physicists of Moldova. Proceedings

    International Nuclear Information System (INIS)

    Canter, V.; Balmus, I.

    2014-10-01

    This book includes communications presented at the 8th International conference on microelectronics and computer science. The papers presented in the book cover certain issues of microelectronics, modern theoretical and experimental physics and advanced technology.

  17. The point of view of a heat exchangers manufacturer; Le point de vue d`un fabricant d`echangeurs

    Energy Technology Data Exchange (ETDEWEB)

    Bailly, A.; Jurkowski, R.; Meziani, M.

    1996-12-31

    This paper reports on a comparative study of the thermal performances of a RKM 200 refrigerating machinery tested with the R22, R134a, R404A and R407C refrigerants. The aim of this study was to compare the thermal performances of new fluids in identical functioning conditions and to analyze the behaviour of the two-phase exchange coefficient with respect to the mass velocity and to the heat flux. (J.S.)

  18. Manufacturing and High Heat Flux Testing of Brazed Flat-Type W/CuCrZr Plasma Facing Components

    Science.gov (United States)

    Lian, Youyun; Liu, Xiang; Feng, Fan; Chen, Lei; Cheng, Zhengkui; Wang, Jin; Chen, Jiming

    2016-02-01

    Water-cooled flat-type W/CuCrZr plasma facing components with an interlayer of oxygen-free copper (OFC) have been developed by using vacuum brazing route. The OFC layer for the accommodation of thermal stresses was cast onto the surface of W at a temperature range of 1150 °C-1200 °C in a vacuum furnace. The W/OFC cast tiles were vacuum brazed to a CuCrZr heat sink at 940 °C using the silver-free filler material CuMnSiCr. The microstructure, bonding strength, and high heat flux properties of the brazed W/CuCrZr joint samples were investigated. The W/Cu joint exhibits an average tensile strength of 134 MPa, which is about the same strength as pure annealed copper. High heat flux tests were performed in the electron beam facility EMS-60. Experimental results indicated that the brazed W/CuCrZr mock-up experienced screening tests of up to 15 MW/m2 and cyclic tests of 9 MW/m2 for 1000 cycles without visible damage. supported by National Natural Science Foundation of China (No. 11205049) and the National Magnetic Confinement Fusion Science Program of China (No. 2011GB110004)

  19. Quality politics: an immaterial investment for companies in (micro)electronics

    Science.gov (United States)

    Bacivarov, I. C.; Lupan, R.; Robledo, C.; Bacivarov, Angelica

    2010-11-01

    With the globalization of the markets and the growth of competitiveness in the manufacturing sector, quality has become a key factor of success. Quality is particularly important for the companies which activate in the micro(electronics) field. The quality management system holds a vital place in the company's structure. Implementing such a system requires important operating costs. These costs are known as Quality Obtaining Costs (QOC) and may be considered as an investment. Planning an investment, means evaluating its return in order to see if it is profitable or not. Measuring the return of quality politics investment raise some delicate problems. We may calculate some aspects of the return of investment by measuring the shape of non-quality costs. An eventual decrease of these costs could be synonym with a profitable investment. But the advantages of good quality politics cannot be measured only by taking into consideration the non-quality costs (even if they include direct and indirect costs). There are also intangible advantages (like mark image, competences, polyvalence, client's satisfaction...) that derive from quality approaches. How to evaluate this type of consequences / advantages? The idea developed in this article is to considerate the quality politics like un immaterial/intelligent investment. Therefore could it be advantageous / possible to use the immaterial investment's measuring and evaluation techniques for studying the quality politics return of investment?

  20. Applications of synchrotron X-rays in microelectronics industry research

    International Nuclear Information System (INIS)

    Jordan-Sweet, Jean L.; Detavernier, Christophe; Lavoie, Christian; Mooney, Patricia M.; Toney, Michael F.

    2005-01-01

    The high flux and density of X-rays produced at synchrotrons provide the microelectronics industry with a powerful probe of the structure and behavior of a wide array of solid materials that are being developed for use in devices of the future. They also are of great use in determining why currently-used materials and processes sometimes fail. This paper describes the X20 X-ray beamline facility operated by IBM at the National Synchrotron Light Source, and presents a series of three industry challenges and results that illustrate the variety of techniques used and problems addressed. The value of this research ranges from solving short-term, technically specific problems to increasing our academic understanding of materials in general. Techniques discussed include high-resolution diffraction, time-resolved diffraction, texture measurements, and grazing-incidence diffraction

  1. Radiation-Induced Prompt Photocurrents in Microelectronics Physics

    CERN Document Server

    Dodd, P E; Buller, D L; Doyle, B L; Vizkelethy, G; Walsh, D S

    2003-01-01

    The effects of photocurrents in nuclear weapons induced by proximal nuclear detonations are well known and remain a serious hostile environment threat for the US stockpile. This report describes the final results of an LDRD study of the physical phenomena underlying prompt photocurrents in microelectronic devices and circuits. The goals of this project were to obtain an improved understanding of these phenomena, and to incorporate improved models of photocurrent effects into simulation codes to assist designers in meeting hostile radiation requirements with minimum build and test cycles. We have also developed a new capability on the ion microbeam accelerator in Sandia's Ion Beam Materials Research Laboratory (the Transient Radiation Microscope, or TRM) to supply ionizing radiation in selected micro-regions of a device. The dose rates achieved in this new facility approach those possible with conventional large-scale dose-rate sources at Sandia such as HERMES III and Saturn. It is now possible to test the phy...

  2. Heat pumps

    CERN Document Server

    Macmichael, DBA

    1988-01-01

    A fully revised and extended account of the design, manufacture and use of heat pumps in both industrial and domestic applications. Topics covered include a detailed description of the various heat pump cycles, the components of a heat pump system - drive, compressor, heat exchangers etc., and the more practical considerations to be taken into account in their selection.

  3. Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing

    CERN Document Server

    Liu, Sheng

    2011-01-01

    Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people

  4. Ripening of Sudanese Braided (Muddaffara Cheese Manufactured from Raw or Pasteurized Milk: Effect of Heat Treatment and Salt Concentration on the Physicochemical Properties

    Directory of Open Access Journals (Sweden)

    Mohamed O. E. Altahir

    2014-01-01

    Full Text Available The objective of the study was to investigate the interactive effect of heat treatment (raw or pasteurized milk, ripening in salted whey (SW and storage period for up to 3 months on the physicochemical properties of Sudanese braided cheese (SBC. Braided cheeses were manufactured from raw (BCRM and pasteurized (BCPM milk and ripened in SW (0%, 5%, and 10% salt for up to 90 days. All the treatments significantly (P≤0.05 affected the physicochemical characteristics of SBC. The total solid, protein, and fat contents of BCRM or BCPM decreased (P≤0.05, whereas their TA, SN, and salt contents increased significantly (P≤0.05 as storage period and the salt level of the whey were elevated. Both FRI and SRI of BCRM and BCPM increased with the increase in storage period and the salt level of the whey. For SN, FRI, SRI, pH, and moisture contents the magnitude of the change was more pronounced in BCRM than in BCPM, while for protein, fat, salt, and TS contents, the opposite was true; that is, the magnitude of the change was more pronounced in BCPM than in BCRM. Further studies are required to standardize muddaffara cheese manufacturing procedure particularly in rural areas.

  5. Ripening of Sudanese Braided (Muddaffara) Cheese Manufactured from Raw or Pasteurized Milk: Effect of Heat Treatment and Salt Concentration on the Physicochemical Properties.

    Science.gov (United States)

    Altahir, Mohamed O E; Elgasim, Elgasim A; Mohamed Ahmed, Isam A

    2014-01-01

    The objective of the study was to investigate the interactive effect of heat treatment (raw or pasteurized milk), ripening in salted whey (SW) and storage period for up to 3 months on the physicochemical properties of Sudanese braided cheese (SBC). Braided cheeses were manufactured from raw (BCRM) and pasteurized (BCPM) milk and ripened in SW (0%, 5%, and 10% salt) for up to 90 days. All the treatments significantly (P ≤ 0.05) affected the physicochemical characteristics of SBC. The total solid, protein, and fat contents of BCRM or BCPM decreased (P ≤ 0.05), whereas their TA, SN, and salt contents increased significantly (P ≤ 0.05) as storage period and the salt level of the whey were elevated. Both FRI and SRI of BCRM and BCPM increased with the increase in storage period and the salt level of the whey. For SN, FRI, SRI, pH, and moisture contents the magnitude of the change was more pronounced in BCRM than in BCPM, while for protein, fat, salt, and TS contents, the opposite was true; that is, the magnitude of the change was more pronounced in BCPM than in BCRM. Further studies are required to standardize muddaffara cheese manufacturing procedure particularly in rural areas.

  6. Fundamentals of semiconductor manufacturing and process control

    CERN Document Server

    May, Gary S

    2006-01-01

    A practical guide to semiconductor manufacturing from process control to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Control covers all issues involved in manufacturing microelectronic devices and circuits, including fabrication sequences, process control, experimental design, process modeling, yield modeling, and CIM/CAM systems. Readers are introduced to both the theory and practice of all basic manufacturing concepts. Following an overview of manufacturing and technology, the text explores process monitoring methods, including those that focus on product wafers and those that focus on the equipment used to produce wafers. Next, the text sets forth some fundamentals of statistics and yield modeling, which set the foundation for a detailed discussion of how statistical process control is used to analyze quality and improve yields. The discussion of statistical experimental design offers readers a powerful approach for systematically varying controllable p...

  7. Materials science in microelectronics II the effects of structure on properties in thin films

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    The subject matter of thin-films - which play a key role in microelectronics - divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: Electrical properties Magnetic properties Optical properties Mechanical properties Mass transport properties Interface and junction properties Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties.

  8. Recovery of waste and side products of apatite-nepheline and eudialyte ores processing in manufacture of heat-insulating foam glassy-crystalline materials

    Directory of Open Access Journals (Sweden)

    Suvorova O. V.

    2017-03-01

    Full Text Available Overburden and dressing tailings accumulated in the Murmansk region in impressive volumes represent serious challenges of both economic and ecological character. Maintenance of overburden dumps and dressing tailings involves considerable capital and material expenses. Therefore reprocessing of mining waste and manufacture of building materials, including heat-insulating foam-glass materials, is a promising trend. The work discusses the feasibility of recovering silica-containing waste and ore processing byproducts on the Kola Peninsula. Compositions and techniques for producing blocks and pellets from foam-glass crystalline materials have been developed. The effect of modifying agents on the foam-silicate materials' mechanical properties has been investigated. The production conditions for high-quality foam-silicate blocks have been identified. The foam silicates obtained under optimal conditions have featured a relatively low viscosity (0.3–0.5 g/cm³, high strength (up to 5 MPa and heat conductivity (0.09–0.107 Wt/m·K. Methods of improving the operating characteristics of foam silicates based on structure perfecting have been proposed. It has been found that as a result of shorttime baking of grainy samples the product has a grain strength of 5–6 MPa, density of 0.25–0.35 g/cm3 and a resistance to crushing in cylinder of 2.2–3 MPa, which is 2–3 times higher than that of a material subjected to one-stage thermal treatment. The water absorption of the material is 5–6 %, which is by a half lower compared to a one-stage treated material. The thermal conduction coefficient is 0.091–0.096 Wt/m·K. The obtained materials are recommended for use as heat-insulating surfacing and filling material for garrets, floors and roofs in construction and renovation of industrial and civic buildings

  9. Microelectronic Status Analysis and Secondary Part Procureability Assessment of the ATACMS-BAT Weapon System

    National Research Council Canada - National Science Library

    Maddux, Gary

    2000-01-01

    The MT Division, Engineering Directorate (ED), RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the ATACMS-BAT weapon system...

  10. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad; Karimi, Muhammad Akram; Salama, Khaled N.; Shamim, Atif

    2017-01-01

    disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept

  11. The Electrical Engineering Curriculum at the Technical University of Denmark - Options in Microelectronics

    DEFF Research Database (Denmark)

    Bruun, Erik; Nielsen, Lars Drud

    1997-01-01

    This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design...

  12. Space station automation study. Automation requirements derived from space manufacturing concepts. Volume 1: Executive summary

    Science.gov (United States)

    1984-01-01

    The two manufacturing concepts developed represent innovative, technologically advanced manufacturing schemes. The concepts were selected to facilitate an in depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, and artificial intelligence. While the cost effectiveness of these facilities has not been analyzed as part of this study, both appear entirely feasible for the year 2000 timeframe. The growing demand for high quality gallium arsenide microelectronics may warrant the ventures.

  13. Improved method for detection of “hot spots” in microelectronic devices

    Directory of Open Access Journals (Sweden)

    Popov V. M.

    2008-06-01

    Full Text Available New method of liquid crystal thermography of “hot spots” in crystals of microelectronic products have been developed. The method is based on the use of local cholesteric phase image of “hot spot” in transparent smectic phase of cholesteric liquid crystal against a background of clearly visible topological elements on the surface of microelectronic device crystal. Examples of “hot spot” images in crystals of different types of integrated circuits are shown.

  14. Progress in nuclear measuring and experimental techniques by application of microelectronics. 1

    International Nuclear Information System (INIS)

    Meiling, W.

    1984-01-01

    In the past decade considerable progress has been made in nuclear measuring and experimental techniques by developing position-sensitive detector systems and widely using integrated circuits and microcomputers for data acquisition and processing as well as for automation of measuring processes. In this report which will be published in three parts those developments are reviewed and demonstrated on selected examples. After briefly characterizing microelectronics, the use of microelectronic elements for radiation detectors is reviewed. (author)

  15. Piezoelectric-nanowire-enabled power source for driving wireless microelectronics.

    Science.gov (United States)

    Xu, Sheng; Hansen, Benjamin J; Wang, Zhong Lin

    2010-10-19

    Harvesting energy from irregular/random mechanical actions in variable and uncontrollable environments is an effective approach for powering wireless mobile electronics to meet a wide range of applications in our daily life. Piezoelectric nanowires are robust and can be stimulated by tiny physical motions/disturbances over a range of frequencies. Here, we demonstrate the first chemical epitaxial growth of PbZr(x)Ti(1-x)O(3) (PZT) nanowire arrays at 230 °C and their application as high-output energy converters. The nanogenerators fabricated using a single array of PZT nanowires produce a peak output voltage of ~0.7 V, current density of 4 μA cm(-2) and an average power density of 2.8 mW cm(-3). The alternating current output of the nanogenerator is rectified, and the harvested energy is stored and later used to light up a commercial laser diode. This work demonstrates the feasibility of using nanogenerators for powering mobile and even personal microelectronics.

  16. Electromigration of intergranular voids in metal films for microelectronic interconnects

    CERN Document Server

    Averbuch, A; Ravve, I

    2003-01-01

    Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

  17. Japanese technology assessment: Computer science, opto- and microelectronics mechatronics, biotechnology

    Energy Technology Data Exchange (ETDEWEB)

    Brandin, D.; Wieder, H.; Spicer, W.; Nevins, J.; Oxender, D.

    1986-01-01

    The series studies Japanese research and development in four high-technology areas - computer science, opto and microelectronics, mechatronics (a term created by the Japanese to describe the union of mechanical and electronic engineering to produce the next generation of machines, robots, and the like), and biotechnology. The evaluations were conducted by panels of U.S. scientists - chosen from academia, government, and industry - actively involved in research in areas of expertise. The studies were prepared for the purpose of aiding the U.S. response to Japan's technological challenge. The main focus of the assessments is on the current status and long-term direction and emphasis of Japanese research and development. Other aspects covered include evolution of the state of the art; identification of Japanese researchers, R and D organizations, and resources; and comparative U.S. efforts. The general time frame of the studies corresponds to future industrial applications and potential commercial impacts spanning approximately the next two decades.

  18. Wireless link and microelectronics design for retinal prostheses

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Wentai [Univ. of California, Santa Cruz, CA (United States)

    2012-02-29

    This project focuses on delivering power and data to the artificial retinal implant inside the eye and the implant microstimulator electronics which delivers the current pulses to stimulate the retinal layer to elicit visual perception. Since the use of invasive means such as tethering wires to transmit power and data results in discomfort to the patients which could eventually cause infection due to the abrasion caused by the wire and contact of the internals of the eye to the external environment, a completely wireless approach is used to transfer both power and data. Power is required inside the eye for the microelectronic implant which uses a dual voltage supply scheme (positive and negative) to deliver biphasic (anodic and cathodic) current pulses. Data in the form of digital bits from the data transmitter external to the eye, carries information about the amplitude, phase width, interphase delay, stimulation sequence for each implant electrode. The data receiver unit decodes the digital stream and the microstimulator unit generates the appropriate current stimuli. Since the external unit consisting of the power transmitter can experience coupling a variation with the power receiver due to the patient’s movements, a closed loop approach is used which varies the transmitted power dynamically to automatically compensate for such movements. This report presents the salient features of this research activities and results.

  19. [Application of microelectronics CAD tools to synthetic biology].

    Science.gov (United States)

    Madec, Morgan; Haiech, Jacques; Rosati, Élise; Rezgui, Abir; Gendrault, Yves; Lallement, Christophe

    2017-02-01

    Synthetic biology is an emerging science that aims to create new biological functions that do not exist in nature, based on the knowledge acquired in life science over the last century. Since the beginning of this century, several projects in synthetic biology have emerged. The complexity of the developed artificial bio-functions is relatively low so that empirical design methods could be used for the design process. Nevertheless, with the increasing complexity of biological circuits, this is no longer the case and a large number of computer aided design softwares have been developed in the past few years. These tools include languages for the behavioral description and the mathematical modelling of biological systems, simulators at different levels of abstraction, libraries of biological devices and circuit design automation algorithms. All of these tools already exist in other fields of engineering sciences, particularly in microelectronics. This is the approach that is put forward in this paper. © 2017 médecine/sciences – Inserm.

  20. 24 CFR 3280.506 - Heat loss/heat gain.

    Science.gov (United States)

    2010-04-01

    ... 24 Housing and Urban Development 5 2010-04-01 2010-04-01 false Heat loss/heat gain. 3280.506... URBAN DEVELOPMENT MANUFACTURED HOME CONSTRUCTION AND SAFETY STANDARDS Thermal Protection § 3280.506 Heat loss/heat gain. The manufactured home heat loss/heat gain shall be determined by methods outlined in...

  1. Plan for advanced microelectronics processing technology application. Final report

    Energy Technology Data Exchange (ETDEWEB)

    Goland, A.N.

    1990-10-01

    The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

  2. Manufacturing Initiative

    Data.gov (United States)

    National Aeronautics and Space Administration — The Advanced Manufacturing Technologies (AMT) Project supports multiple activities within the Administration's National Manufacturing Initiative. A key component of...

  3. Carbon nanotubes for thermal interface materials in microelectronic packaging

    Science.gov (United States)

    Lin, Wei

    As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

  4. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

    Science.gov (United States)

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

  5. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

    Directory of Open Access Journals (Sweden)

    Inah Kim

    Full Text Available Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea.Based on claim data from the National Health Insurance (2008-2012, we estimated age-specific rates of spontaneous abortion (SAB and menstrual aberration (MA among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs were estimated.Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties.Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

  6. Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

    Science.gov (United States)

    Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

    2015-01-01

    Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Based on claim data from the National Health Insurance (2008-2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

  7. Social manufacturing

    OpenAIRE

    Hamalainen, Markko; Karjalainen, Jesse

    2017-01-01

    New business models harnessing the power of individuals have already revolutionized service industries and digital content production. In this study, we investigate whether a similar phenomenon is taking place in manufacturing industries. We start by conceptually defining two distinct forms of firm-individual collaboration in manufacturing industries: (1) social cloud manufacturing, in which firms outsource manufacturing to individuals, and (2) social platform manufacturing, in which firms pr...

  8. Creep of Two-Phase Microstructures for Microelectronic Applications

    Energy Technology Data Exchange (ETDEWEB)

    Reynolds, Heidi Linch [Univ. of California, Berkeley, CA (United States)

    1998-12-01

    The mechanical properties of low-melting temperature alloys are highly influenced by their creep behavior. This study investigates the dominant mechanisms that control creep behavior of two-phase, low-melting temperature alloys as a function of microstructure. The alloy systems selected for study were In-Ag and Sn-Bi because their eutectic compositions represent distinctly different microstructure.” The In-Ag eutectic contains a discontinuous phase while the Sn-Bi eutectic consists of two continuous phases. In addition, this work generates useful engineering data on Pb-free alloys with a joint specimen geometry that simulates microstructure found in microelectronic applications. The use of joint test specimens allows for observations regarding the practical attainability of superplastic microstructure in real solder joints by varying the cooling rate. Steady-state creep properties of In-Ag eutectic, Sn-Bi eutectic, Sn-xBi solid-solution and pure Bi joints have been measured using constant load tests at temperatures ranging from O°C to 90°C. Constitutive equations are derived to describe the steady-state creep behavior for In-Ageutectic solder joints and Sn-xBi solid-solution joints. The data are well represented by an equation of the form proposed by Dom: a power-law equation applies to each independent creep mechanism. Rate-controlling creep mechanisms, as a function of applied shear stress, test temperature, and joint microstructure, are discussed. Literature data on the steady-state creep properties of Sn-Bi eutectic are reviewed and compared with the Sn-xBi solid-solution and pure Bi joint data measured in the current study. The role of constituent phases in controlling eutectic creep behavior is discussed for both alloy systems. In general, for continuous, two-phase microstructure, where each phase exhibits significantly different creep behavior, the harder or more creep resistant phase will dominate the creep behavior in a lamellar microstructure. If a

  9. Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach

    CERN Document Server

    Laurila, Tomi; Paulasto-Kröckel, Mervi; Turunen, Markus; Mattila, Toni T; Kivilahti, Jorma

    2012-01-01

    Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep un...

  10. FY 1999 report on the results of 'the model project for effective utilization of the waste heat discharged from the combustion of paper-manufacturing sludge'; 1999 nendo seika hokoku. Seishi surajji nensho hainetsu yuko riyo moderu jigyo

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-03-01

    For the purpose of reducing the consumption of fossil fuel and reducing emissions of global warming gases in Malaysia, a model project for thermally effective use of the sludge discharged from paper-manufacturing plant was carried out. Concretely, the paper-manufacturing sludge discharged from paper-manufacturing plant is to be dewatered and improved of its lower heating value. Then, the sludge is to be burned in fluidized bed incinerator, and the steam is to be generated by recovering heat using waste heat recovering boiler. The steam obtained is to be used as process steam of the plant. In this fiscal year, the first year of the project, the attachment to the agreement was prepared in terms of the allotment of the project work between Japan and Malaysia, various kinds of gist, schedules, etc. and signed. After that, the determination of the basic specifications for facilities was made according to the attachment to the agreement. Now, the basic design of the whole plant is being made. The design of the process flow sheet, design of the layout plan for plant equipment, etc. were finished. The goods to be purchased are now being estimated and assessed. Moreover, as to the civil engineering/construction design, drawings of the basic design are now being made. (NEDO)

  11. Materials science in microelectronics I the relationships between thin film processing and structure

    CERN Document Server

    Machlin, Eugene

    2005-01-01

    Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship - that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer - determines the ultimate structure of the thin film, and thus its properties. This

  12. A compact atomic force-scanning tunneling microscope for studying microelectronics and environmental aerosols

    International Nuclear Information System (INIS)

    Chen, G.

    1996-06-01

    This dissertation describes the characteristics and the construction of a compact atomic force/scanning tunneling microscope (AFM/STM). The basics and the method of preparing a tunneling junction between a chemically etched tunneling tip and a micro-manufactured cantilever is outlined by analyzing the forces between tunneling tip and cantilever as well as between force-sensing tip and sample surfaces. To our best knowledge this instrument is the first one using a commercial cantilever with only one piezoelectric tube carrying the whole tunneling sensor. The feedback control system has been optimized after a careful analysis of the electronic loop characteristics. The mode of operation has been determined by analyzing the dynamic characteristics of the scan heads and by investigating the time characteristics of the data acquisition system. The vibration isolation system has been calibrated by analyzing the characteristics of the damping setup and the stiffness of the scan head. The calculated results agree well with the measured ones. Also, a software package for data acquisition and real time display as well as for image processing and three-dimensional visualization has been developed. With this home-made software package, the images can be processed by means of a convolution filter, a Wiener filter and other 2-D FFT filters, and can be displayed in different ways. Atomic resolution images of highly oriented pyrolytic graphite (HOPG) and graphite surfaces have been obtained in AFM and STM mode. New theoretical explanations have been given for the observed anomalous STM and AFM images of graphite by calculating the asymmetric distribution of quantum conductance and tip-surface forces on a graphite surface. This not only resolved the theoretical puzzles of STM and AFM of graphite, but also revealed the relation between atomic force microscopy and scanning tunneling microscopy of graphite. Applications of STM and AFM to micro-electronic devices have been investigated

  13. Thermal management of microelectronics with electrostatic fluid accelerators

    International Nuclear Information System (INIS)

    Wang, Hsiu-Che; Jewell-Larsen, Nels E.; Mamishev, Alexander V.

    2013-01-01

    Optimal thermal management is critical in modern consumer electronics. Typically, a thermal management scheme for an electronic system involves several physical principles. In many cases, it is highly desirable to enhance heat transfer at the solid-air interface while maintaining small size of the thermal management solution. The enhancement of heat transfer at the solid-air interface can be achieved by several physical principles. One principle that is getting increased attention of thermal management design engineers is electrostatic fluid acceleration. This paper discusses recent breakthroughs in state-of-the-art of electrostatic fluid accelerators (EFAs). The paper compares and contrasts EFAs’ design and performance metrics to those of other airside cooling technologies used in small form factor applications. Since the energy efficiency, flow rate, and acoustic emissions are highly influenced by the scale of the airside cooling devices, the paper also presents the analysis of fundamental effect of scaling laws on heat transfer performance. The presented review and analysis helps drawing conclusions regarding achievable comparative performance and practicality of using different design approaches and physical principles for different applications. -- Highlights: ► Discuss breakthrough in state-of-the-art of electrostatic fluid accelerators (EFA). ► Compare EFAs' performance metrics to those of other airside cooling technologies. ► Show analysis of fundamental effect of scaling laws on heat transfer performance

  14. Precision manufacturing

    CERN Document Server

    Dornfeld, David

    2008-01-01

    Today there is a high demand for high-precision products. The manufacturing processes are now highly sophisticated and derive from a specialized genre called precision engineering. Precision Manufacturing provides an introduction to precision engineering and manufacturing with an emphasis on the design and performance of precision machines and machine tools, metrology, tooling elements, machine structures, sources of error, precision machining processes and precision process planning. As well as discussing the critical role precision machine design for manufacturing has had in technological developments over the last few hundred years. In addition, the influence of sustainable manufacturing requirements in precision processes is introduced. Drawing upon years of practical experience and using numerous examples and illustrative applications, David Dornfeld and Dae-Eun Lee cover precision manufacturing as it applies to: The importance of measurement and metrology in the context of Precision Manufacturing. Th...

  15. Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

    DEFF Research Database (Denmark)

    Katsia, E.; Huby, N.; Tallarida, G.

    2009-01-01

    Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V...

  16. Dictionary of microelectronics and microcomputer technology. Woerterbuch der Mikroelektronik und Mikrorechnertechnik

    Energy Technology Data Exchange (ETDEWEB)

    Attiyate, Y H; Shah, R R

    1984-01-01

    This bilingual dictionary (German-English and English-German) is to give the general public a clearer idea of the terminology of microelectronics, microcomputers, data processing, and computer science. Each part contains about 7500 terms frequently encountered in practice, about 2000 of which are supplemented by precise explanations.

  17. The microelectronics and photonics test bed (MPTB) space, ground test and modeling experiments

    International Nuclear Information System (INIS)

    Campbell, A.

    1999-01-01

    This paper is an overview of the MPTB (microelectronics and photonics test bed) experiment, a combination of a space experiment, ground test and modeling programs looking at the response of advanced electronic and photonic technologies to the natural radiation environment of space. (author)

  18. Numerical Analysis and Experimental Verification of Stresses Building up in Microelectronics Packaging

    NARCIS (Netherlands)

    Rezaie Adli, A.R.

    2017-01-01

    This thesis comprises a thorough study of the microelectronics packaging process by means of various experimental and numerical methods to estimate the process induced residual stresses. The main objective of the packaging is to encapsulate the die, interconnections and the other exposed internal

  19. Labour-Saving versus Work-Amplifying Effects of Micro-Electronics.

    Science.gov (United States)

    Watanabe, Susumu

    1986-01-01

    This article argues that the labor-displacement effect of microelectronic machinery, especially numerically controlled machine tools and robots, has been exaggerated and that people tend to confuse the impact of intensified international competition with that of the new technology. (Author/CT)

  20. Investigation of “benign” ionic content in epoxy that induces microelectronic device failure

    Science.gov (United States)

    Gregory T. Schueneman; Jeffery Kingsbury; Edmund Klinkerch

    2011-01-01

    Microelectronics and the devices dependent upon them have the extremely challenging requirements of becoming more capable and less expensive every year. This drives the industry to pack more functions into an ever smaller footprint until the next technological revolution. Adding to this situation is the removal of lead from the bill of materials followed closely by...

  1. Adhesion-delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices

    International Nuclear Information System (INIS)

    Khanna, V K

    2011-01-01

    Physico-chemical mechanisms of adhesion and debonding at the various surfaces and interfaces of semiconductor devices, integrated circuits and microelectromechanical systems are systematically examined, starting from chip manufacturing and traversing the process stages to the ultimate finished product. Sources of intrinsic and thermal stresses in these devices are pointed out. Thin film ohmic contacts to the devices call for careful attention. The role of an adhesion layer in multilayer metallization schemes is highlighted. In packaged devices, sites facing potential risks of delamination are indicated. As MEMS devices incorporate moving parts, there are additional issues due to adhesion of suspended structures to surfaces in the vicinity, both during chip fabrication and their subsequent operation. Proper surface treatments for preventing adhesion together with design considerations for overcoming stiction pave the way to reliable functioning of these devices. Adhesion-delamination issues in microelectronics and MEMS continue to pose significant challenges to both design and process engineers. This paper is an attempt to survey the adhesion characteristics of materials, their compatibilities and limitations and look at future research trends. In addition, it addresses some of the techniques for improved or reduced adhesion, as demanded by the situation. The paper encompasses fundamental aspects to contemporary applications.

  2. Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan

    Science.gov (United States)

    Washio, Kunihiko; Kouta, Hikaru

    2002-06-01

    This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

  3. The influence of wavelength-dependent radiation in simulation of lamp-heated rapid thermal processing systems

    Energy Technology Data Exchange (ETDEWEB)

    Ting, A. [Sandia National Labs., Livermore, CA (United States). Computational Mechanics Dept.

    1994-08-01

    Understanding the thermal response of lamp-heated rapid thermal processing (RTP) systems requires understanding relatively complex radiation exchange among opaque and partially transmitting surfaces and materials. The objective of this paper is to investigate the influence of wavelength-dependent radiative properties. The examples used for the analysis consider axisymmetric systems of the kind that were developed by Texas Instruments (TI) for the Microelectronics Manufacturing Science and Technology (MMST) Program and illustrate a number of wavelength-dependent (spectral) effects. The models execute quickly on workstation class computing flatforms, and thus permit rapid comparison of alternative reactor designs and physical models. The fast execution may also permit the incorporation of these models into real-time model-based process control algorithms.

  4. Thermal design heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells

    CERN Document Server

    Lee, H S

    2010-01-01

    The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design cours

  5. Space station automation study: Automation requriements derived from space manufacturing concepts,volume 2

    Science.gov (United States)

    1984-01-01

    Automation reuirements were developed for two manufacturing concepts: (1) Gallium Arsenide Electroepitaxial Crystal Production and Wafer Manufacturing Facility, and (2) Gallium Arsenide VLSI Microelectronics Chip Processing Facility. A functional overview of the ultimate design concept incoporating the two manufacturing facilities on the space station are provided. The concepts were selected to facilitate an in-depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, sensors, and artificial intelligence. While the cost-effectiveness of these facilities was not analyzed, both appear entirely feasible for the year 2000 timeframe.

  6. Application of an energy efficient casting ladle heating system used in the manufacture of stainless steel; Einsatz einer energieeffizienten Pfannenaufheizstation bei der Herstellung von Edelstahl

    Energy Technology Data Exchange (ETDEWEB)

    Poeschl, Markus [Edelstahlwerke Schmees GmbH, Langenfeld (Germany); Lodde, Marcus [Effizienz-Agentur NRW, Duisburg (Germany). prisma Consult GmbH

    2011-06-15

    In the melting area, the company has been using four conventional burners to heat the ladles. The existing flame burners heat the upside down ladles from below and consume massive amount of energy. Heat radiation and all of the waste gas are released into the facility. The material around the ladles is therefore heavily affected. The company has now installed a new energy efficient casting ladle heating system with a new kind of porous burner which heats the transport ladles without exposing them to an open flame. The combustion heat is channeled to specially adapted steel pipes via infrared radiation and convection flow. By doing this, the heat is directly transferred to the ladles and can be controlled in a more balanced manner. The company now saves around 61,400 m{sup 3}/a of natural gas, approx. 60 % of the energy required for the ladle heating and, as a result, 113.8 tonnes of CO{sub 2}-equivalent. The life span of the ladles can be increased by a factor of 2 due to the reduced exposure of the fire resistant materials. The resulting waste gas is collected and the waste heat will be reused in the facility in the future (facility heating 2011). Due to reduction in cleaning and carrying time of the ladles, Fr. Schmees expects an increase in productivity of the complete process. The heat radiation from the ladles has been reduced by 75 % which has led to a reduction of breakdowns. In addition, the noise level has sunk from 78.7 dB to 67.4 db. (orig.)

  7. Computer Tomography from Micro-Electronics to Assembled Products

    Directory of Open Access Journals (Sweden)

    Keith Bryant

    2017-06-01

    Full Text Available Traditional CT in our industry has been limited to Business card sized samples, due to the Cone Beam x-ray systems used by Electronics manufacturing companies. Inclined or Partial CT provides a slightly different solution showing layers or slices in 2D very well, but due to the partial nature of the scans does not produce very accurate 3D reconstructions. This seminar will look at more sophisticated x-ray systems, including dual tube units, which can image at sub-micron level and have the ability to build an accurate and detailed 3D image of a tablet or smart phone without any stitching or joining of images. With high quality reconstruction software, these images can easily be manipulated to allow key features or failure sites to be easily seen. These systems are being used in Failure Analysis but also in NPI and in the design and development process as CAD data can be overlaid and metrology is also possible with some systems.

  8. Additive manufacturing.

    Science.gov (United States)

    Mumith, A; Thomas, M; Shah, Z; Coathup, M; Blunn, G

    2018-04-01

    Increasing innovation in rapid prototyping (RP) and additive manufacturing (AM), also known as 3D printing, is bringing about major changes in translational surgical research. This review describes the current position in the use of additive manufacturing in orthopaedic surgery. Cite this article: Bone Joint J 2018;100-B:455-60.

  9. Manufacturing technologies

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-09-01

    The Manufacturing Technologies Center is an integral part of Sandia National Laboratories, a multiprogram engineering and science laboratory, operated for the Department of Energy (DOE) with major facilities at Albuquerque, New Mexico, and Livermore, California. Our Center is at the core of Sandia`s Advanced Manufacturing effort which spans the entire product realization process.

  10. Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging

    Science.gov (United States)

    Shih, T. I.; Duh, J. G.

    2008-06-01

    The decapsulation of flip chips bonded to ceramic substrates is a challenging task in the packaging industry owing to the vulnerability of the chip surface during the process. In conventional methods, such as manual grinding and polishing, the solder bumps are easily damaged during the removal of underfill, and the thin chip may even be crushed due to mechanical stress. An efficient and reliable decapsulation method consisting of thermal and chemical processes was developed in this study. The surface quality of chips after solder removal is satisfactory for the existing solder rework procedure as well as for die-level failure analysis. The innovative processes included heat-sink and ceramic substrate removal, solder bump separation, and solder residue cleaning from the chip surface. In the last stage, particular temperatures were selected for the removal of eutectic Pb-Sn, high-lead, and lead-free solders considering their respective melting points.

  11. 3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

    KAUST Repository

    Farooqui, Muhammad Fahad

    2017-05-19

    Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

  12. Registered manufacturers of renewable energy devices

    International Nuclear Information System (INIS)

    Anon.

    1992-01-01

    Registered manufacturers of renewable energy devices in India are listed. The list is arranged under the headings : solar water heating system, solar cooker, solar still and water pumping wind mill. In all 38 manufacturers are listed. The list gives the postal address, name of the contact person and phone number of each manufacturer. (M.G.B.)

  13. Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer

    Directory of Open Access Journals (Sweden)

    Zhengguo Shang

    2009-05-01

    Full Text Available A novel high-precision vacuum microelectronic accelerometer has been successfully fabricated and tested in our laboratory. This accelerometer has unique advantages of high sensitivity, fast response, and anti-radiation stability. It is a prototype intended for navigation applications and is required to feature micro-g resolution. This paper briefly describes the structure and working principle of our vacuum microelectronic accelerometer, and the mathematical model is also established. The performances of the accelerometer system are discussed after Matlab modeling. The results show that, the dynamic response of the accelerometer system is significantly improved by choosing appropriate parameters of signal detecting circuit, and the signal detecting circuit is designed. In order to attain good linearity and performance, the closed-loop control mode is adopted. Weak current detection technology is studied, and integral T-style feedback network is used in I/V conversion, which will eliminate high-frequency noise at the front of the circuit. According to the modeling parameters, the low-pass filter is designed. This circuit is simple, reliable, and has high precision. Experiments are done and the results show that the vacuum microelectronic accelerometer exhibits good linearity over -1 g to +1 g, an output sensitivity of 543 mV/g, and a nonlinearity of 0.94 %.

  14. Emerging epidemic in a growing industry: cigarette smoking among female micro-electronics workers in Taiwan.

    Science.gov (United States)

    Lin, Y-P; Yen, L-L; Pan, L-Y; Chang, P-J; Cheng, T-J

    2005-03-01

    To explore the emerging tobacco epidemic in female workers in the growing micro-electronics industry of Taiwan. Workers were surveyed regarding their smoking status, sociodemographics and work characteristics. In total, 1950 female employees in two large micro-electronics companies in Taiwan completed the survey. Approximately 9.3% of the female employees were occasional or daily smokers at the time of the survey. The prevalence of smoking was higher in those aged 16-19 years (20.9%), those not married (12.9%), those with a high school education or less (11.7%), those employed by Company A (11.7%), shift workers (14.3%), and those who had been in their present employment for 1 year or less (13.6%). Results of multivariate adjusted logistic regression indicated that younger age, lower level of education, shorter periods of employment with the company and shift working were the important factors in determining cigarette smoking among the study participants. The odds ratio of being a daily smoker was similar to that of being a current smoker. Marital status was the only significant variable when comparing former smokers with current smokers. Smoking prevalence in female workers in the two micro-electronics companies studied was much higher than previous reports have suggested about female smoking prevalence in Taiwan and China. We suggest that smoking is no longer a 'male problem' in Taiwan. Future smoking cessation and prevention programmes should target young working women as well as men.

  15. Micro Manufacturing

    DEFF Research Database (Denmark)

    Hansen, Hans Nørgaard

    2003-01-01

    Manufacturing deals with systems that include products, processes, materials and production systems. These systems have functional requirements, constraints, design parameters and process variables. They must be decomposed in a systematic manner to achieve the best possible system performance....... If a micro manufacturing system isn’t designed rationally and correctly, it will be high-cost, unreliable, and not robust. For micro products and systems it is a continuously increasing challenge to create the operational basis for an industrial production. As the products through product development...... processes are made applicable to a large number of customers, the pressure in regard to developing production technologies that make it possible to produce the products at a reasonable price and in large numbers is growing. The micro/nano manufacturing programme at the Department of Manufacturing...

  16. Smart Manufacturing.

    Science.gov (United States)

    Davis, Jim; Edgar, Thomas; Graybill, Robert; Korambath, Prakashan; Schott, Brian; Swink, Denise; Wang, Jianwu; Wetzel, Jim

    2015-01-01

    Historic manufacturing enterprises based on vertically optimized companies, practices, market share, and competitiveness are giving way to enterprises that are responsive across an entire value chain to demand dynamic markets and customized product value adds; increased expectations for environmental sustainability, reduced energy usage, and zero incidents; and faster technology and product adoption. Agile innovation and manufacturing combined with radically increased productivity become engines for competitiveness and reinvestment, not simply for decreased cost. A focus on agility, productivity, energy, and environmental sustainability produces opportunities that are far beyond reducing market volatility. Agility directly impacts innovation, time-to-market, and faster, broader exploration of the trade space. These changes, the forces driving them, and new network-based information technologies offering unprecedented insights and analysis are motivating the advent of smart manufacturing and new information technology infrastructure for manufacturing.

  17. Numerical investigation of heat transfer in Plastic Leaded Chip ...

    African Journals Online (AJOL)

    Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit ...

  18. Gas manufacture

    Energy Technology Data Exchange (ETDEWEB)

    Fell, J W

    1915-05-03

    Retorts for the distillation of shale or coal for the production of oil or illuminating-gas are heated by gas from a generator or a gas-holder, and a portion of the gas from the flue leading to the heating-flues is forced by a steam jet through a by-pass and is injected into the bottom of the retorts. If the gas to be admitted to the retort is cold, it is first heated.

  19. Stage 1 performance qualification of heat-ventilation air-conditioning (HVAC) system for the manufacturing of Tc-99m Generator at Nuclear Malaysia

    International Nuclear Information System (INIS)

    Yen Ng; Noriah Jamal; Rehir Dahalan; Wan Anuar Wan Awang; Noraisyah Yusof; Shaharum Ramli; Jusnan Hashim; Ariff Hamzah; Wan Firdaus Wan Ishak; Yahaya Talib; Othman Mahmud; Asmah Mohibat; Shafii Khamis; Zulkifli Mohamed Hashim; Zakaria Ibrahim; Shaaban Kasim

    2007-01-01

    Manufacturing of Tc-99m generator is carried out in clean room Block 21 of Malaysian Nuclear Agency, which need to comply current Good Manufacturing Practice requirement. High-ventilation air conditioning (HVAC) is a new renovated system. It is a critical system for maintaining suitable temperature, relative humidity and pressure differential in the clean room. The objective of this paper is to present results on Stage 1 Performance Qualification (PQ) for HVAC. This PQ stage 1 was done from 7 February 2007 till 16 March 2007. Temperature, Relative Humidity and Pressure Differential for each compartment in the clean room was monitored twice daily. The Measurement of air-born particle count was done weekly. Settle plate for microbial test was also done weekly. The results were then analyzed and compared with the pre-determined specification. We found that temperature was within the specs, namely 24 +20 degree C. Relative humidity was less than 65%. Pressure differential shows variation, some compartments are below the specs namely 1-3 mm H 2 O. Air-born particle and microbial test also meet the requirement. The results show that all parameters meeting the specs excepts for the pressure differential for certain compartments are a bit low, but is sufficient to create proper air flow and not cause any risk of cross contamination. The existing HVAC system in the clean room is in compliance to the pre-determined specification. However, further improvement can be made by increasing the pressure differential between compartments. (Author)

  20. LEAN Manufacturing

    DEFF Research Database (Denmark)

    Bilberg, Arne

    . The mission with the strategy is to obtain competitive production in Denmark and in Western Europe based on the right combination of manufacturing principles, motivated and trained employees, level of automation, and cooperation with suppliers and customers worldwide. The strategy has resulted in technical...

  1. Job stress models, depressive disorders and work performance of engineers in microelectronics industry.

    Science.gov (United States)

    Chen, Sung-Wei; Wang, Po-Chuan; Hsin, Ping-Lung; Oates, Anthony; Sun, I-Wen; Liu, Shen-Ing

    2011-01-01

    Microelectronic engineers are considered valuable human capital contributing significantly toward economic development, but they may encounter stressful work conditions in the context of a globalized industry. The study aims at identifying risk factors of depressive disorders primarily based on job stress models, the Demand-Control-Support and Effort-Reward Imbalance models, and at evaluating whether depressive disorders impair work performance in microelectronics engineers in Taiwan. The case-control study was conducted among 678 microelectronics engineers, 452 controls and 226 cases with depressive disorders which were defined by a score 17 or more on the Beck Depression Inventory and a psychiatrist's diagnosis. The self-administered questionnaires included the Job Content Questionnaire, Effort-Reward Imbalance Questionnaire, demography, psychosocial factors, health behaviors and work performance. Hierarchical logistic regression was applied to identify risk factors of depressive disorders. Multivariate linear regressions were used to determine factors affecting work performance. By hierarchical logistic regression, risk factors of depressive disorders are high demands, low work social support, high effort/reward ratio and low frequency of physical exercise. Combining the two job stress models may have better predictive power for depressive disorders than adopting either model alone. Three multivariate linear regressions provide similar results indicating that depressive disorders are associated with impaired work performance in terms of absence, role limitation and social functioning limitation. The results may provide insight into the applicability of job stress models in a globalized high-tech industry considerably focused in non-Western countries, and the design of workplace preventive strategies for depressive disorders in Asian electronics engineering population.

  2. Modeling biology with HDL languages: a first step toward a genetic design automation tool inspired from microelectronics.

    Science.gov (United States)

    Gendrault, Yves; Madec, Morgan; Lallement, Christophe; Haiech, Jacques

    2014-04-01

    Nowadays, synthetic biology is a hot research topic. Each day, progresses are made to improve the complexity of artificial biological functions in order to tend to complex biodevices and biosystems. Up to now, these systems are handmade by bioengineers, which require strong technical skills and leads to nonreusable development. Besides, scientific fields that share the same design approach, such as microelectronics, have already overcome several issues and designers succeed in building extremely complex systems with many evolved functions. On the other hand, in systems engineering and more specifically in microelectronics, the development of the domain has been promoted by both the improvement of technological processes and electronic design automation tools. The work presented in this paper paves the way for the adaptation of microelectronics design tools to synthetic biology. Considering the similarities and differences between the synthetic biology and microelectronics, the milestones of this adaptation are described. The first one concerns the modeling of biological mechanisms. To do so, a new formalism is proposed, based on an extension of the generalized Kirchhoff laws to biology. This way, a description of all biological mechanisms can be made with languages widely used in microelectronics. Our approach is therefore successfully validated on specific examples drawn from the literature.

  3. Proceedings of the Goddard Space Flight Center Workshop on Robotics for Commercial Microelectronic Processes in Space

    Science.gov (United States)

    1987-01-01

    Potential applications of robots for cost effective commercial microelectronic processes in space were studied and the associated robotic requirements were defined. Potential space application areas include advanced materials processing, bulk crystal growth, and epitaxial thin film growth and related processes. All possible automation of these processes was considered, along with energy and environmental requirements. Aspects of robot capabilities considered include system intelligence, ROM requirements, kinematic and dynamic specifications, sensor design and configuration, flexibility and maintainability. Support elements discussed included facilities, logistics, ground support, launch and recovery, and management systems.

  4. Radiation protection measurements in nuclear engineering. The use of microelectronics is only just beginning

    International Nuclear Information System (INIS)

    Maushart, R.

    1986-01-01

    The progress achieved by microelectronics is impressive already now, but it is only a beginning. The contribution deals with the modern methods of representing measured data and with the processing of measured data as the optimum area of use of microprocessors. It outlines the uses of personnel dosimeters and portable dose rate meters, portable units with data storage capacity, new possibilities in monitoring the room air in large building complexes, gamma spectroscopy with very high purity germanium detectors, equivalent dose measurement with multichannel data evaluation, 'talking' equipment, and it also presents a forecast of future radiation protection measuring equipment. (orig.) [de

  5. Manufacturing W fibre-reinforced Cu composite pipes for application as heat sink in divertor targets of future nuclear fusion reactors

    Energy Technology Data Exchange (ETDEWEB)

    Mueller, Alexander v.; You, Jeong-Ha [Max-Planck-Institut fuer Plasmaphysik, 85748 Garching (Germany); Ewert, Dagmar [Institut fuer Textil- und Verfahrenstechnik Denkendorf, 73770 Denkendorf (Germany); Siefken, Udo [Louis Renner GmbH, 85221 Dachau (Germany)

    2016-07-01

    An important plasma-facing component (PFC) in future nuclear fusion reactors is the so-called divertor which allows power exhaust and removal of impurities from the main plasma. The most highly loaded parts of a divertor are the target plates which have to withstand intense particle bombardment. This intense particle bombardment leads to high heat fluxes onto the target plates which in turn lead to severe thermomechanical loads. With regard to future nuclear fusion reactors, an improvement of the performance of divertor targets is desirable in order to ensure reliable long term operation of such PFCs. The performance of a divertor target is most closely linked to the properties of the materials that are used for its design. W fibre-reinforced Cu (Wf/Cu) composites are regarded as promising heat sink materials in this respect. These materials do not only feature adequate thermophysical and mechanical properties, they do also offer metallurgical flexibility as their microstructure and hence their macroscopic properties can be tailored. The contribution will point out how Wf/Cu composites can be used to realise an advanced design of a divertor target and how these materials can be fabricated by means of liquid Cu infiltration.

  6. ST Microelectronics

    CERN Document Server

    Patrice Loïez

    2002-01-01

    Photo 01 : Prof. Roger Cashmore, Research Director for Collider Programmes, Dr Salvatore Castorina, Corporate Vice President, DSG, Prof. Gigi Rolandi, CMS Tracker Project Manager. Photo 02 : Dr Salvatore Castorina signing the Guest Book. Photo 03 : Prof. Roger Cashmore, Dr Salvatore Castorina.

  7. Microelectronic systems

    CERN Document Server

    Heuberger, Albert; Hanke, Randolf

    2011-01-01

    This book is dedicated to Prof. Dr. Heinz Gerhauser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universitat Erlangen-Nurnberg. Heinz Gerhauser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to beco

  8. Microelectronics Reliability

    Science.gov (United States)

    2017-01-17

    inverters  connected in a chain. ................................................. 5  Figure 3  Typical graph showing frequency versus square root of...developing an experimental  reliability estimating methodology that could both illuminate the  lifetime  reliability of advanced devices,  circuits and...or  FIT of the device. In other words an accurate estimate of the device  lifetime  was found and thus the  reliability  that  can  be  conveniently

  9. Polymeric Microelectronics.

    Science.gov (United States)

    1981-06-01

    Swelling Procedure For Crosslinked Gel 2A.1 Materials: Spectral grade hexane Petri dish with glass plate cover Planchette Balance Vacuum oven 2A.2...Uncrosslinked Material) To determine the amount of uncrosslinked material decant the dupernatant hexane into a weighed planchette . Wash the gel and...swelling flask or dish with hexane again and pour into planchette . Place the planchette and its contents into a vacuum oven at 350C until the contents

  10. Semiconductor Manufacturing equipment introduction

    International Nuclear Information System (INIS)

    Im, Jong Sun

    2001-02-01

    This book deals with semiconductor manufacturing equipment. It is comprised of nine chapters, which are manufacturing process of semiconductor device, history of semiconductor manufacturing equipment, kinds and role of semiconductor manufacturing equipment, construction and method of semiconductor manufacturing equipment, introduction of various semiconductor manufacturing equipment, spots of semiconductor manufacturing, technical elements of semiconductor manufacturing equipment, road map of technology of semiconductor manufacturing equipment and semiconductor manufacturing equipment in the 21st century.

  11. Green Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Patten, John

    2013-12-31

    Green Manufacturing Initiative (GMI): The initiative provides a conduit between the university and industry to facilitate cooperative research programs of mutual interest to support green (sustainable) goals and efforts. In addition to the operational savings that greener practices can bring, emerging market demands and governmental regulations are making the move to sustainable manufacturing a necessity for success. The funding supports collaborative activities among universities such as the University of Michigan, Michigan State University and Purdue University and among 40 companies to enhance economic and workforce development and provide the potential of technology transfer. WMU participants in the GMI activities included 20 faculty, over 25 students and many staff from across the College of Engineering and Applied Sciences; the College of Arts and Sciences' departments of Chemistry, Physics, Biology and Geology; the College of Business; the Environmental Research Institute; and the Environmental Studies Program. Many outside organizations also contribute to the GMI's success, including Southwest Michigan First; The Right Place of Grand Rapids, MI; Michigan Department of Environmental Quality; the Michigan Department of Energy, Labor and Economic Growth; and the Michigan Manufacturers Technical Center.

  12. Implementation of Microelectronics Track in Electronics Engineering in a Philippines State University

    Directory of Open Access Journals (Sweden)

    Gil B. Barte

    2015-11-01

    Full Text Available The evolving trends in electronics continuous to attract students to take upElectronics Engineering.However, it also adds to discipline implementation complexities.Institutions of Higher Learning offering this program must adapt to this realities to avoid obsolescence. This paper looked at Batangas State University, in the Philippines,ongoingimplementation of the Microelectronics track under the Electronics Engineering (ECEProgram. It describes the restructuring done to the ECE curriculum to overcome the enormous complexity inherent in microelectronics design and the teaching pedagogy adopted to promote active learning. The ongoing program has produced encouraging outcomes:1students were able to design, and simulate complex gate CMOS circuits using EDA tools, in the four(4 course electives identified for the track; 2 the culture of independent learning among students improvement in students soft skills, communication skills, time-management and teamwork skill,; 3. useof free and web-based tools overcome the issue of high cost of license for EDA tools and seminar/training for continuous upgrading of faculty. Another encouraging outcome was the acceptance of the student-centered teaching approach used, Problem-Based Learning (PBL,in enhancing the students learning experience.

  13. Direct Heat

    Energy Technology Data Exchange (ETDEWEB)

    Lienau, P J

    1990-01-01

    Potential resources and applications of earth heat in the form of geothermal energy are large. United States direct uses amount to 2,100 MWt thermal and worldwide 8,850 MWt above a reference temperature of 35 degrees Celsius. Space and district heating are the major direct uses of geothermal energy. Equipment employed in direct use projects is of standard manufacture and includes downhole and circulation pumps, transmission and distribution pipelines, heat exchangers and convectors, heat pumps and chillers. Direct uses of earth heat discussed are space and district heating, greenhouse heating and fish farming, process and industrial applications. The economic feasibility of direct use projects is governed by site specific factors such as location of user and resource, resource quality, system load factor and load density, as well as financing. Examples are presented of district heating in Klamath Falls, and Elko. Further developments of direct uses of geothermal energy will depend on matching user needs to the resource, and improving load factors and load density.

  14. Vacuum Mechatronics And Insvection For Self-Contained Manufacturing

    Science.gov (United States)

    Belinski, Steve E.; Shirazi, Majid; Seidel, Thomas E.; Hackwood, Susan

    1990-02-01

    The vacuum environment is increasingly being used in manufacturing operations, especially in the semiconductor industry. Shrinking linewidths and feature sizes dictate that cleanliness standards become continually more strict. Studies at the Center for Robotic Systems in Microelectronics (CRSM) indicate that a controlled vacuum enclosure can provide a superior clean environment. In addition, since many microelectronic fabrication steps are already carried out under vacuum, self-contained multichamber processing systems are being developed at a rapid pace. CRSM support of these systems includes the development of a research system, the Self-contained Automated Robotic Factory (SCARF), a vacuum-compatible robot, and investigations of particulate characterization in vacuum and inspection for multichamber systems. Successful development of complex and expensive multichamber systems is, to a great extent, dependent upon the discipline called vacuum mechatronics, which includes the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. Here the constituents of the vacuum mechatronics discipline are defined and reviewed in the context of the importance to self-contained in-vacuum manufacturing.

  15. Determining DfT Hardware by VHDL-AMS Fault Simulation for Biological Micro-Electronic Fluidic Arrays

    NARCIS (Netherlands)

    Kerkhoff, Hans G.; Zhang, X.; Liu, H.; Richardson, A.; Nouet, P.; Azais, F.

    2005-01-01

    The interest of microelectronic fluidic arrays for biomedical applications, like DNA determination, is rapidly increasing. In order to evaluate these systems in terms of required Design-for-Test structures, fault simulations in both fluidic and electronic domains are necessary. VHDL-AMS can be used

  16. Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

    Science.gov (United States)

    Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

    2014-01-01

    Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

  17. Characterization by ion beams of surfaces and interfaces of alternative materials for future microelectronic devices

    International Nuclear Information System (INIS)

    Krug, C.; Stedile, F.C.; Radtke, C.; Rosa, E.B.O. da; Morais, J.; Freire, F.L.; Baumvol, I.J.R.

    2003-01-01

    We present the potential use of ion beam techniques such as nuclear reactions, channelling Rutherford backscattering spectrometry, and low energy ion scattering in the characterization of the surface and interface of materials thought to be possible substitutes to Si (like SiC, for example) and to SiO 2 films (like Al 2 O 3 films, for example) in microelectronic devices. With narrow nuclear reaction resonance profiling the depth distribution of light elements such as Al and O in the films can be obtained non-destructively and with subnanometric depth resolution, allowing one to follow the mobility of each species under thermal treatments, for instance. Thinning of an amorphous layer at the surface of single-crystalline samples can be determined using channelling of He + ions and detection of the scattered light particles. Finally, the use of He + ions in the 1 keV range allows elemental analysis of the first monolayer at the sample surface

  18. CREME96: A revision of the Cosmic Ray Effects on Micro-Electronics code

    International Nuclear Information System (INIS)

    Tylka, A.J.; Adams, J.H. Jr.; Boberg, P.R.

    1997-01-01

    CREME96 is an update of the Cosmic Ray Effects on Micro-Electronics code, a widely-used suite of programs for creating numerical models of the ionizing-radiation environment in near-Earth orbits and for evaluating radiation effects in spacecraft. CREME96, which is now available over the World-Wide Web (WWW) at http://crsp3.nrl.navy.mil/creme96/, has many significant features, including (1) improved models of the galactic cosmic ray, anomalous cosmic ray, and solar energetic particle (flare) components of the near-Earth environment; (2) improved geomagnetic transmission calculations; (3) improved nuclear transport routines; (4) improved single-event upset (SEU) calculation techniques, for both proton-induced and direct-ionization-induced SEUs; and (5) an easy-to-use graphical interface, with extensive on-line tutorial information. In this paper the authors document some of these improvements

  19. Gas manufacture

    Energy Technology Data Exchange (ETDEWEB)

    Lewis, G P

    1913-02-22

    Carbonaceous matter, such as coal, shale, lignite, bitumen, bituminous earth, peat, wood, bark, nutshells, and oil nuts, is distilled and gasified in apparatus comprising an upper retort section having imperforate walls, and a lower generator section; part of the generator gases pass around the retort to heat it, and the remainder pass up through the fuel in the retort; the retort is arranged relatively to the generator so that the whole weight of the fuel in the retort does not act upon that in the generator, and an outlet is provided at the lower end of the retort so that a portion of the coke may be withdrawn when desired.

  20. Flow Visualization Study of Natural Convection from a Heated Protrusion in a Liquid Filled Rectangular Enclosure.

    Science.gov (United States)

    1983-12-01

    PROPOSED SOLUTIONS Many papers have been published outlining alternative methods of thermally controlling microelectronic devices. Hannemann [3] describes...Workshop, NSF Grant ENG-7701297, Directions of Heat Transfer in Electronic Equipment, Fy R. C. Chu, 1977. 3. Hannemann , R., "Electronic System Thermal

  1. Manufactured volvulus.

    Science.gov (United States)

    Zweifel, Noemi; Meuli, Martin; Subotic, Ulrike; Moehrlen, Ueli; Mazzone, Luca; Arlettaz, Romaine

    2013-06-01

    Malrotation with a common mesentery is the classical pathology allowing midgut volvulus to occur. There are only a few reports of small bowel volvulus without malrotation or other pathology triggering volvulation. We describe three cases of small bowel volvulus in very premature newborns with a perfectly normal intra-abdominal anatomy and focus on the question, what might have set off volvulation. In 2005 to 2008, three patients developed small bowel volvulus without any underlying pathology. Retrospective patient chart review was performed with special focus on clinical presentation, preoperative management, intraoperative findings, and potential causative explanations. Mean follow-up period was 46 months. All patients were born between 27 and 31 weeks (mean 28 weeks) with a birth weight between 800 and 1,000 g (mean 887 g). They presented with an almost identical pattern of symptoms including sudden abdominal distension, abdominal tenderness, erythema of the abdominal wall, high gastric residuals, and radiographic signs of ileus. All of them were treated with intensive abdominal massage or pelvic rotation to improve bowel movement before becoming symptomatic. Properistaltic maneuvers including abdominal massage and pelvic rotation may cause what we term a "manufactured" volvulus in very premature newborns. Thus, this practice was stopped. Georg Thieme Verlag KG Stuttgart · New York.

  2. Gas manufacture

    Energy Technology Data Exchange (ETDEWEB)

    Hutchins, T W.S.

    1921-10-01

    Coal, oil shale and the like are distilled by being charged from a hopper into a trough from which a scoop attached to an inner rotary tube feeds the material through this tube from which it passes through holes into an outer rotary tube to which the inner tube is secured at the end, the material being finally discharged into a hopper. The inner tube is provided with a tumbler having radiating arms and adapted to knock or scrape off any caked material in the tube, a similar tumbler may be provided in the outer tube which is heated by hot gases in flues. The tubes are rotated by gearing and the distillates escape through a pipe. A flexible joint between the tube and chamber comprises a diaphragm carrying a jointing ring held against a collar on the tube by tension springs.

  3. The impact of fit manufacturing on green manufacturing: A review

    Science.gov (United States)

    Qi, Ang Nian; Sin, Tan Chan; Fathullah, M.; Lee, C. C.

    2017-09-01

    Fit manufacturing and Green manufacturing are a new trend principle and concept. They are getting popular in industrial. This paper is identifying the impact between Fit manufacturing and Green manufacturing. Besides Fit manufacturing, Lean manufacturing, Agile manufacturing and Sustainable manufacturing gives big impacts to Green Manufacturing. On top of that, this paper also discuss the benefits of applying Fit manufacturing and Green manufacturing in industrial as well as environment. Hence, applications of Fit manufacturing and Green Manufacturing are increasing year by year.

  4. Numerical study on boiling heat transfer enhancement in a microchannel heat exchanger

    International Nuclear Information System (INIS)

    Jeon, Jin Ho; Suh, Young Ho; Son, Gi Hun

    2008-01-01

    Flow boiling in a microchannel heat exchanger has received attention as an effective heat removal mechanism for high power-density microelectronics. Despite extensive experimental studied, the bubble dynamics coupled with boiling heat transfer in a microchannel heat exchanger is still not well understood due to the technological difficulties in obtaining detailed measurements of microscale two-phase flows. In this study, complete numerical simulations are performed to further clarify the dynamics of flow boiling in a microchannel heat exchanger. The level set method for tracking the liquid-vapor interface is modified to include the effects of phase change and contact angle and to treat an immersed solid surface. Based on the numerical results, the effects of modified channel shape on the bubble growth and heat transfer are quantified

  5. Advanced Manufacturing Technologies

    Science.gov (United States)

    Fikes, John

    2016-01-01

    Advanced Manufacturing Technologies (AMT) is developing and maturing innovative and advanced manufacturing technologies that will enable more capable and lower-cost spacecraft, launch vehicles and infrastructure to enable exploration missions. The technologies will utilize cutting edge materials and emerging capabilities including metallic processes, additive manufacturing, composites, and digital manufacturing. The AMT project supports the National Manufacturing Initiative involving collaboration with other government agencies.

  6. An update on coating/manufacturing techniques of microneedles.

    Science.gov (United States)

    Tarbox, Tamara N; Watts, Alan B; Cui, Zhengrong; Williams, Robert O

    2017-12-29

    Recently, results have been published for the first successful phase I human clinical trial investigating the use of dissolving polymeric microneedles… Even so, further clinical development represents an important hurdle that remains in the translation of microneedle technology to approved products. Specifically, the potential for accumulation of polymer within the skin upon repeated application of dissolving and coated microneedles, combined with a lack of safety data in humans, predicates a need for further clinical investigation. Polymers are an important consideration for microneedle technology-from both manufacturing and drug delivery perspectives. The use of polymers enables a tunable delivery strategy, but the scalability of conventional manufacturing techniques could arguably benefit from further optimization. Micromolding has been suggested in the literature as a commercially viable means to mass production of both dissolving and swellable microneedles. However, the reliance on master molds, which are commonly manufactured using resource intensive microelectronics industry-derived processes, imparts notable material and design limitations. Further, the inherently multi-step filling and handling processes associated with micromolding are typically batch processes, which can be challenging to scale up. Similarly, conventional microneedle coating processes often follow step-wise batch processing. Recent developments in microneedle coating and manufacturing techniques are highlighted, including micromilling, atomized spraying, inkjet printing, drawing lithography, droplet-born air blowing, electro-drawing, continuous liquid interface production, 3D printing, and polyelectrolyte multilayer coating. This review provides an analysis of papers reporting on potentially scalable production techniques for the coating and manufacturing of microneedles.

  7. A cell-microelectronic sensing technique for profiling cytotoxicity of chemicals

    International Nuclear Information System (INIS)

    Boyd, Jessica M.; Huang, Li; Xie Li; Moe, Birget; Gabos, Stephan; Li Xingfang

    2008-01-01

    A cell-microelectronic sensing technique is developed for profiling chemical cytotoxicity and is used to study different cytotoxic effects of the same class chemicals using nitrosamines as examples. This technique uses three human cell lines (T24 bladder, HepG2 liver, and A549 lung carcinoma cells) and Chinese hamster ovary (CHO-K1) cells in parallel as the living components of the sensors of a real-time cell electronic sensing (RT-CES) method for dynamic monitoring of chemical toxicity. The RT-CES technique measures changes in the impedance of individual microelectronic wells that is correlated linearly with changes in cell numbers during t log phase of cell growth, thus allowing determination of cytotoxicity. Four nitrosamines, N-nitrosodimethylamine (NDMA), N-nitrosodiphenylamine (NDPhA), N-nitrosopiperidine (NPip), and N-nitrosopyrrolidine (NPyr), were examined and unique cytotoxicity profiles were detected for each nitrosamine. In vitro cytotoxicity values (IC 50 ) for NDPhA (ranging from 0.6 to 1.9 mM) were significantly lower than the IC 50 values for the well-known carcinogen NDMA (15-95 mM) in all four cell lines. T24 cells were the most sensitive to nitrosamine exposure among the four cell lines tested (T24 > CHO > A549 > HepG2), suggesting that T24 may serve as a new sensitive model for cytotoxicity screening. Cell staining results confirmed that administration of the IC 50 concentration from the RT-CES experiments inhibited cell growth by 50% compared to the controls, indicating that the RT-CES method provides reliable measures of IC 50 . Staining and cell-cycle analysis confirmed that NDPhA caused cell-cycle arrest at the G0/G1 phase, whereas NDMA did not disrupt the cell cycle but induced cell death, thus explaining the different cytotoxicity profiles detected by the RT-CES method. The parallel cytotoxicity profiling of nitrosamines on the four cell lines by the RT-CES method led to the discovery of the unique cytotoxicity of NDPhA causing cell

  8. A cell-microelectronic sensing technique for profiling cytotoxicity of chemicals

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, Jessica M [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Huang, Li [Environmental Health Sciences, Department of Public Health Sciences, School of Public Health, University of Alberta, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Li, Xie; Moe, Birget [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Gabos, Stephan [Public Health Surveillance and Environmental Health, Alberta Health and Wellness, 10025 Jasper Avenue, Box 1360, Edmonton, Alberta, T5J 2N3 (Canada); Xingfang, Li [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Environmental Health Sciences, Department of Public Health Sciences, School of Public Health, University of Alberta, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada)], E-mail: xingfang.li@ualberta.ca

    2008-05-12

    A cell-microelectronic sensing technique is developed for profiling chemical cytotoxicity and is used to study different cytotoxic effects of the same class chemicals using nitrosamines as examples. This technique uses three human cell lines (T24 bladder, HepG2 liver, and A549 lung carcinoma cells) and Chinese hamster ovary (CHO-K1) cells in parallel as the living components of the sensors of a real-time cell electronic sensing (RT-CES) method for dynamic monitoring of chemical toxicity. The RT-CES technique measures changes in the impedance of individual microelectronic wells that is correlated linearly with changes in cell numbers during t log phase of cell growth, thus allowing determination of cytotoxicity. Four nitrosamines, N-nitrosodimethylamine (NDMA), N-nitrosodiphenylamine (NDPhA), N-nitrosopiperidine (NPip), and N-nitrosopyrrolidine (NPyr), were examined and unique cytotoxicity profiles were detected for each nitrosamine. In vitro cytotoxicity values (IC{sub 50}) for NDPhA (ranging from 0.6 to 1.9 mM) were significantly lower than the IC{sub 50} values for the well-known carcinogen NDMA (15-95 mM) in all four cell lines. T24 cells were the most sensitive to nitrosamine exposure among the four cell lines tested (T24 > CHO > A549 > HepG2), suggesting that T24 may serve as a new sensitive model for cytotoxicity screening. Cell staining results confirmed that administration of the IC{sub 50} concentration from the RT-CES experiments inhibited cell growth by 50% compared to the controls, indicating that the RT-CES method provides reliable measures of IC{sub 50}. Staining and cell-cycle analysis confirmed that NDPhA caused cell-cycle arrest at the G0/G1 phase, whereas NDMA did not disrupt the cell cycle but induced cell death, thus explaining the different cytotoxicity profiles detected by the RT-CES method. The parallel cytotoxicity profiling of nitrosamines on the four cell lines by the RT-CES method led to the discovery of the unique cytotoxicity of NDPh

  9. Tribology in Manufacturing Technology

    CERN Document Server

    2013-01-01

    The present book aims to provide research advances on tribology in manufacturing technology for modern industry. This book can be used as a research book for final undergraduate engineering course (for example, mechanical, manufacturing, materials, etc) or as a subject on manufacturing at the postgraduate level. Also, this book can serve as a useful reference for academics, manufacturing and tribology researchers, mechanical, mechanical, manufacturing and materials engineers, professionals in related industries with manufacturing and tribology.

  10. Displacement Damage Effects in Solar Cells: Mining Damage From the Microelectronics and Photonics Test Bed Space Experiment

    Science.gov (United States)

    Hardage, Donna (Technical Monitor); Walters, R. J.; Morton, T. L.; Messenger, S. R.

    2004-01-01

    The objective is to develop an improved space solar cell radiation response analysis capability and to produce a computer modeling tool which implements the analysis. This was accomplished through analysis of solar cell flight data taken on the Microelectronics and Photonics Test Bed experiment. This effort specifically addresses issues related to rapid technological change in the area of solar cells for space applications in order to enhance system performance, decrease risk, and reduce cost for future missions.

  11. Preliminary Flight Results of the Microelectronics and Photonics Test Bed: NASA DR1773 Fiber Optic Data Bus Experiment

    Science.gov (United States)

    Jackson, George L.; LaBel, Kenneth A.; Marshall, Cheryl; Barth, Janet; Seidleck, Christina; Marshall, Paul

    1998-01-01

    NASA Goddard Spare Flight Center's (GSFC) Dual Rate 1773 (DR1773) Experiment on the Microelectronic and Photonic Test Bed (MPTB) has provided valuable information on the performance of the AS 1773 fiber optic data bus in the space radiation environment. Correlation of preliminary experiment data to ground based radiation test results show the AS 1773 bus is employable in future spacecraft applications requiring radiation tolerant communication links.

  12. Possibilities for mixed mode chip manufacturing in EUROPRACTICE

    Science.gov (United States)

    Das, C.

    1997-02-01

    EUROPRACTICE is an EC initiative under the ESPRIT programme which aims to stimulate the wider exploitation of state-of-the-art microelectronics technologies by European industry and to enhance European industrial competitiveness in the global market-place. Through EUROPRACTICE, the EC has created a range of Basic Services that offer users a cost-effective and flexible means of accessing three main microelectronics-based technologies: Application Specific Integrated Circuit (ASICs), Multi-Chip Modules (MCMs) and Microsystems. EUROPRACTICE Basic Services reduce the cost and risk for companies wishing to begin using these technologies. EUROPRACTICE offers a fully supported, low cost route for companies to design and fabricate ASICs for their individual applications. Low cost is achieved by consolidating designs from many users onto a single semiconductor wafer (MPW: Multi Project Wafer). The EUROPRACTICE IC Manufacturing Service (ICMS) offers a broad range of fabrication technologies including CMOS, BiCMOS and GaAs. The Service extends from enabling users to produce prototype ASICs for testing and evaluation, through to low-volume production runs.

  13. Feasibility of Observing and Characterizing Single Ion Strikes in Microelectronic Components

    International Nuclear Information System (INIS)

    Dingreville, Remi Philippe Michel; Hattar, Khalid Mikhiel; Bufford, Daniel Charles

    2015-01-01

    The transient degradation of semiconductor device performance under irradiation has long been an issue of concern. A single high-energy charged particle can degrade or permanently destroy the microelectronic component, potentially altering the course or function of the systems. Disruption of the the crystalline structure through the introduction of quasi-stable defect structures can change properties from semiconductor to conductor. Typically, the initial defect formation phase is followed by a recovery phase in which defect-defect or defect-dopant interactions modify the characteristics of the damaged structure. In this LDRD Express, in-situ ion irradiation transmission microscopy (TEM) in-situ TEM experiments combined with atomistic simulations have been conducted to determine the feasibility of imaging and characterizing the defect structure resulting from a single cascade in silicon. In-situ TEM experiments have been conducted to demonstrate that a single ion strike can be observed in Si thin films with nanometer resolution in real time using the in-situ ion irradiation transmission electron microscope (I 3 TEM). Parallel to this experimental effort, ion implantation has been numerically simulated using Molecular Dynamics (MD). This numerical framework provides detailed predictions of the damage and follow the evolution of the damage during the first nanoseconds. The experimental results demonstrate that single ion strike can be observed in prototypical semiconductors.

  14. The Principle of the Micro-Electronic Neural Bridge and a Prototype System Design.

    Science.gov (United States)

    Huang, Zong-Hao; Wang, Zhi-Gong; Lu, Xiao-Ying; Li, Wen-Yuan; Zhou, Yu-Xuan; Shen, Xiao-Yan; Zhao, Xin-Tai

    2016-01-01

    The micro-electronic neural bridge (MENB) aims to rebuild lost motor function of paralyzed humans by routing movement-related signals from the brain, around the damage part in the spinal cord, to the external effectors. This study focused on the prototype system design of the MENB, including the principle of the MENB, the neural signal detecting circuit and the functional electrical stimulation (FES) circuit design, and the spike detecting and sorting algorithm. In this study, we developed a novel improved amplitude threshold spike detecting method based on variable forward difference threshold for both training and bridging phase. The discrete wavelet transform (DWT), a new level feature coefficient selection method based on Lilliefors test, and the k-means clustering method based on Mahalanobis distance were used for spike sorting. A real-time online spike detecting and sorting algorithm based on DWT and Euclidean distance was also implemented for the bridging phase. Tested by the data sets available at Caltech, in the training phase, the average sensitivity, specificity, and clustering accuracies are 99.43%, 97.83%, and 95.45%, respectively. Validated by the three-fold cross-validation method, the average sensitivity, specificity, and classification accuracy are 99.43%, 97.70%, and 96.46%, respectively.

  15. Enhancement of microelectronic device performances by photothermal annealing under SiCl4 ambient

    International Nuclear Information System (INIS)

    Hassen, M.; Ben Jaballah, A.; Hajji, M.; Ezzaouia, H.

    2006-01-01

    The use of low cost silicon wafers seems to be very attractive for photovoltaic and microelectronic devices. However, this material is widely contaminated by different impurities particularly transitions metals, which deteriorate the lifetimes and the bulk diffusion lengths of the minority charge carriers. One possible way to overcome this undesirable behavior is to include an efficient purification technique in the process of device fabrication. In this work, we present the effect of photothermal treatments of monocrystalline Czochralski silicon substrates under SiCl 4 /N 2 atmosphere using a thin sacrificial porous silicon layer. The main results show a decrease of the resistivity over 40 μm depth. The Hall mobility of the majority charge carriers is improved from 300 to 1417 cm 2 V -1 s -1 . The capacitance-voltage (C-V) characteristics of metal/SiO 2 /Si (MIS) structures indicate a decrease of carrier concentration which confirms the results obtained by Hall Effect and Van Der Pauw method. The reduction of boron concentration in Czochralski silicon may reduce boron- and oxygen related metastable defect centers

  16. Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics

    Science.gov (United States)

    Fu, Haoran; Nan, Kewang; Bai, Wubin; Huang, Wen; Bai, Ke; Lu, Luyao; Zhou, Chaoqun; Liu, Yunpeng; Liu, Fei; Wang, Juntong; Han, Mengdi; Yan, Zheng; Luan, Haiwen; Zhang, Yijie; Zhang, Yutong; Zhao, Jianing; Cheng, Xu; Li, Moyang; Lee, Jung Woo; Liu, Yuan; Fang, Daining; Li, Xiuling; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

    2018-03-01

    Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.

  17. Microelectronics in LMFBR: Activities sponsored by the Commission 1979-1983

    International Nuclear Information System (INIS)

    Nordwall, H.J. de

    1986-01-01

    These studies were designed to draw attention to signal handling techniques which have become applicable to the automatic control of reactors as a result of advances in microelectronics. The underlying concepts being explored are the extent to which more information may be obtained from existing sensors, whether changes in the state of a system may be acted upon automatically and the acceptability of stochastic methods of state estimation. If a given state may arise in a number of different ways, automatic action necessarily involves diagnosis of causes if any but the simplest actions, e.g. scram, is required. Up to now this diagnosis has been made by an operator, though a number of schemes intended to identify the primary cause of an abnormal state or to guide an operator to the most easily accessible safe state are in advanced states of development, e.g. at Halden, Westinghouse and GRS-Garching. The activity decribed is continuing, current emphasis being upon diagnostics using approaches based upon artificial intelligence concepts, system optimisation and quantification of the benefits of networking

  18. Femtosecond laser pulses for fast 3-D surface profilometry of microelectronic step-structures.

    Science.gov (United States)

    Joo, Woo-Deok; Kim, Seungman; Park, Jiyong; Lee, Keunwoo; Lee, Joohyung; Kim, Seungchul; Kim, Young-Jin; Kim, Seung-Woo

    2013-07-01

    Fast, precise 3-D measurement of discontinuous step-structures fabricated on microelectronic products is essential for quality assurance of semiconductor chips, flat panel displays, and photovoltaic cells. Optical surface profilers of low-coherence interferometry have long been used for the purpose, but the vertical scanning range and speed are limited by the micro-actuators available today. Besides, the lateral field-of-view extendable for a single measurement is restricted by the low spatial coherence of broadband light sources. Here, we cope with the limitations of the conventional low-coherence interferometer by exploiting unique characteristics of femtosecond laser pulses, i.e., low temporal but high spatial coherence. By scanning the pulse repetition rate with direct reference to the Rb atomic clock, step heights of ~69.6 μm are determined with a repeatability of 10.3 nm. The spatial coherence of femtosecond pulses provides a large field-of-view with superior visibility, allowing for a high volume measurement rate of ~24,000 mm3/s.

  19. Low level radiation testing of micro-electronic components. Pt. 1

    International Nuclear Information System (INIS)

    Farren, J.; Stephen, J.H.; Mapper, D.; Sanderson, T.K.; Hardman, M.

    1984-05-01

    A review of the existing literature has been carried out, dealing with the current technology relating to low level radiation testing of microelectronic devices, as used in space satellite systems. After consideration of the space radiation environment, the general effects of cosmic radiation on MOSFET structures and other MOS devices have been assessed. The important aspect of annealing phenomena in relation to gamma-ray induced damage has also been reviewed in detail. The experimental and theoretical aspects of radiation testing have been assessed, with particular reference to the Harwell LORAD low level irradiation test facility. In addition, a review of modern dosimetry methods has been carried out, with specific regard to the problems of accurately measuring low radiation fields (1 to 10 R/hour) over periods of many months. Finally, a detailed account of the proposed experimental programme to be carried out in the LORAD facility is presented, and aspects of the experimental set-up discussed. The particular types of test circuits to be studied are dealt with, and full consideration is given to the various CMOS memory devices of special interest in the ESA space satellite programme. (author)

  20. FY 1999 report on the results of 'the model project for effective utilization of the waste heat discharged from the combustion of paper-manufacturing sludge'; 1999 nendo seika hokoku. Seishi surajji nensho hainetsu yuko riyo moderu jigyo

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-03-01

    For the purpose of reducing the consumption of fossil fuel and reducing emissions of global warming gases in Malaysia, a model project for thermally effective use of the sludge discharged from paper-manufacturing plant was carried out. Concretely, the paper-manufacturing sludge discharged from paper-manufacturing plant is to be dewatered and improved of its lower heating value. Then, the sludge is to be burned in fluidized bed incinerator, and the steam is to be generated by recovering heat using waste heat recovering boiler. The steam obtained is to be used as process steam of the plant. In this fiscal year, the first year of the project, the attachment to the agreement was prepared in terms of the allotment of the project work between Japan and Malaysia, various kinds of gist, schedules, etc. and signed. After that, the determination of the basic specifications for facilities was made according to the attachment to the agreement. Now, the basic design of the whole plant is being made. The design of the process flow sheet, design of the layout plan for plant equipment, etc. were finished. The goods to be purchased are now being estimated and assessed. Moreover, as to the civil engineering/construction design, drawings of the basic design are now being made. (NEDO)

  1. Heat pipes

    CERN Document Server

    Dunn, Peter D

    1982-01-01

    A comprehensive, up-to-date coverage of the theory, design and manufacture of heat pipes and their applications. This latest edition has been thoroughly revised, up-dated and expanded to give an in-depth coverage of the new developments in the field. Significant new material has been added to all the chapters and the applications section has been totally rewritten to ensure that topical and important applications are appropriately emphasised. The bibliography has been considerably enlarged to incorporate much valuable new information. Thus readers of the previous edition, which has established

  2. PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

    Science.gov (United States)

    Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

    2012-12-01

    More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible

  3. Heat pumps are a dream

    Energy Technology Data Exchange (ETDEWEB)

    1981-12-01

    The fact that heat pumps do not achieve what their manufacturers promise in costs efficiency has been realized by the market. In 1981 the sales of heat pumps decreased by 50% of the 1980 market. Public utilities give the reason as economic, since fuel oil is too cheap. The author refutes this argument and presents arguments against heat pumps.

  4. Manufacturing network evolution

    DEFF Research Database (Denmark)

    Yang, Cheng; Farooq, Sami; Johansen, John

    2011-01-01

    Purpose – This paper examines the effect of changes at the manufacturing plant level on other plants in the manufacturing network and also investigates the role of manufacturing plants on the evolution of a manufacturing network. Design/methodology/approach –The research questions are developed...... different manufacturing plants in the network and their impact on network transformation. Findings – The paper highlights the dominant role of manufacturing plants in the continuously changing shape of a manufacturing network. The paper demonstrates that a product or process change at one manufacturing...... by identifying the gaps in the reviewed literature. The paper is based on three case studies undertaken in Danish manufacturing companies to explore in detail their manufacturing plants and networks. The cases provide a sound basis for developing the research questions and explaining the interaction between...

  5. Manufacturing study of beryllium bonded structures

    International Nuclear Information System (INIS)

    Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

    2004-01-01

    Manufacturing study has been conducted on Be-bonded structures employed in the first-wall panel of the blanket system for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating process has been used to bond the three materials. First, Cu-alloy and SS materials are bonded diffusively. Then, Be tiles are bonded to the pre-bonded structure under 20 MPa and at 560 degree C. An Al-Si base interlayer has been used to bond Be to the Cu-Alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. Using the above bonding techniques, a partial mockup of a blanket first-wall panel with 16 Be tiles (with 50 mm in size) has been successfully manufactured. (author)

  6. Thermo-mechanical properties and integrity of metallic interconnects in microelectronics

    Science.gov (United States)

    Ege, Efe Sinan

    In this dissertation, combined numerical (Finite Element Method) and experimental efforts were undertaken to study thermo-mechanical behavior in microelectronic devices. Interconnects, including chip-level metallization and package-level solder joints, are used to join many of the circuit parts in modern equipment. The dissertation is structured into six independent studies after the introductory chapter. The first two studies focus on thermo-mechanical fatigue of solder joints. Thermo-mechanical fatigue, in the form of damage along a microstructurally coarsened region in tin-lead solder, is analyzed along with the effects of intermetallic morphology. Also, lap-shear testing is modeled to characterize the joint and to investigate the validity of experimental data from different solder and substrate geometries. In the third study, the effects of pre-machined holes on strain localization and overall ductility in bulk eutectic tin-lead alloy is examined. Finite element analyses, taking into account the viscoplastic response, were carried out to provide a mechanistic rationale to corroborate the experimental findings. The fourth study concerns chip-level copper interconnects. Various combinations of oxide and polymer-based low-k dielectric schemes, with and without the thin barrier layers surrounding the Cu line, are considered. Attention is devoted to the thermal stress and strain fields and their dependency on material properties, geometry, and modeling details. This study is followed by a chapter on atomistics of interface-mediated plasticity in thin metallic films. The objective is to gain fundamental insight into the underlying mechanisms affecting the mechanical response of nanoscale thin films. The final study investigates the effect of microstructural heterogeneity on indentation response, for the purpose of raising awareness of the uncertainties involved in applying indentation techniques in probing mechanical properties of miniaturized devices.

  7. Use of COTS [commercial-off-the-shelf] Microelectronics in Radiation Environments

    Energy Technology Data Exchange (ETDEWEB)

    Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

    1999-07-07

    This paper addresses key issues for the cost-effective use of COTS microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. COTS parts with low radiation tolerance should not be used when they degrade mission critical functions or lead to premature system failure. We review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMS increases from 1.4x10{sup 8} rads(Si)/s for a 256K SRAM to 7.7x10{sup 9} rads(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design or process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10-15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMS from three different date codes. In another study, irradiations of 4M SRAMS from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of ''COTS'' and ''radiation-hardened'' technology.

  8. Spoked-ring microcavities: enabling seamless integration of nanophotonics in unmodified advanced CMOS microelectronics chips

    Science.gov (United States)

    Wade, Mark T.; Shainline, Jeffrey M.; Orcutt, Jason S.; Ram, Rajeev J.; Stojanovic, Vladimir; Popovic, Milos A.

    2014-03-01

    We present the spoked-ring microcavity, a nanophotonic building block enabling energy-efficient, active photonics in unmodified, advanced CMOS microelectronics processes. The cavity is realized in the IBM 45nm SOI CMOS process - the same process used to make many commercially available microprocessors including the IBM Power7 and Sony Playstation 3 processors. In advanced SOI CMOS processes, no partial etch steps and no vertical junctions are available, which limits the types of optical cavities that can be used for active nanophotonics. To enable efficient active devices with no process modifications, we designed a novel spoked-ring microcavity which is fully compatible with the constraints of the process. As a modulator, the device leverages the sub-100nm lithography resolution of the process to create radially extending p-n junctions, providing high optical fill factor depletion-mode modulation and thereby eliminating the need for a vertical junction. The device is made entirely in the transistor active layer, low-loss crystalline silicon, which eliminates the need for a partial etch commonly used to create ridge cavities. In this work, we present the full optical and electrical design of the cavity including rigorous mode solver and FDTD simulations to design the Qlimiting electrical contacts and the coupling/excitation. We address the layout of active photonics within the mask set of a standard advanced CMOS process and show that high-performance photonic devices can be seamlessly monolithically integrated alongside electronics on the same chip. The present designs enable monolithically integrated optoelectronic transceivers on a single advanced CMOS chip, without requiring any process changes, enabling the penetration of photonics into the microprocessor.

  9. Use of COTS [commercial-off-the-shelf] Microelectronics in Radiation Environments

    International Nuclear Information System (INIS)

    Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

    1999-01-01

    This paper addresses key issues for the cost-effective use of COTS microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. COTS parts with low radiation tolerance should not be used when they degrade mission critical functions or lead to premature system failure. We review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMS increases from 1.4x10 8 rads(Si)/s for a 256K SRAM to 7.7x10 9 rads(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design or process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10-15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMS from three different date codes. In another study, irradiations of 4M SRAMS from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of ''COTS'' and ''radiation-hardened'' technology

  10. The Economics of Big Area Addtiive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Post, Brian [Oak Ridge National Laboratory (ORNL); Lloyd, Peter D [ORNL; Lindahl, John [Oak Ridge National Laboratory (ORNL); Lind, Randall F [ORNL; Love, Lonnie J [ORNL; Kunc, Vlastimil [ORNL

    2016-01-01

    Case studies on the economics of Additive Manufacturing (AM) suggest that processing time is the dominant cost in manufacturing. Most additive processes have similar performance metrics: small part sizes, low production rates and expensive feedstocks. Big Area Additive Manufacturing is based on transitioning polymer extrusion technology from a wire to a pellet feedstock. Utilizing pellets significantly increases deposition speed and lowers material cost by utilizing low cost injection molding feedstock. The use of carbon fiber reinforced polymers eliminates the need for a heated chamber, significantly reducing machine power requirements and size constraints. We hypothesize that the increase in productivity coupled with decrease in feedstock and energy costs will enable AM to become more competitive with conventional manufacturing processes for many applications. As a test case, we compare the cost of using traditional fused deposition modeling (FDM) with BAAM for additively manufacturing composite tooling.

  11. 24 CFR 3280.707 - Heat producing appliances.

    Science.gov (United States)

    2010-04-01

    ... 24 Housing and Urban Development 5 2010-04-01 2010-04-01 false Heat producing appliances. 3280.707... Systems § 3280.707 Heat producing appliances. (a) Heat-producing appliances and vents, roof jacks and... appliance, the heating appliance shall be installed by the manufacturer of the manufactured home in...

  12. Equipment for manufacture of single crystals by zone overlaying

    International Nuclear Information System (INIS)

    Richter, O.

    1981-01-01

    The patented heater element for the manufacture of monocrystals by zone melting of layers consists of a heated pipe with insert slipped onto the heated pipe or consisting, in turn, of pieces fixed parallel to the heated pipe or a piece placed between two pipes. The insert is designed for stabilizing the melt surface. (Ha)

  13. A system approach for reducing the environmental impact of manufacturing and sustainability improvement of nano-scale manufacturing

    Science.gov (United States)

    Yuan, Yingchun

    This dissertation develops an effective and economical system approach to reduce the environmental impact of manufacturing. The system approach is developed by using a process-based holistic method for upstream analysis and source reduction of the environmental impact of manufacturing. The system approach developed consists of three components of a manufacturing system: technology, energy and material, and is useful for sustainable manufacturing as it establishes a clear link between manufacturing system components and its overall sustainability performance, and provides a framework for environmental impact reductions. In this dissertation, the system approach developed is applied for environmental impact reduction of a semiconductor nano-scale manufacturing system, with three case scenarios analyzed in depth on manufacturing process improvement, clean energy supply, and toxic chemical material selection. The analysis on manufacturing process improvement is conducted on Atomic Layer Deposition of Al2O3 dielectric gate on semiconductor microelectronics devices. Sustainability performance and scale-up impact of the ALD technology in terms of environmental emissions, energy consumption, nano-waste generation and manufacturing productivity are systematically investigated and the ways to improve the sustainability of the ALD technology are successfully developed. The clean energy supply is studied using solar photovoltaic, wind, and fuel cells systems for electricity generation. Environmental savings from each clean energy supply over grid power are quantitatively analyzed, and costs for greenhouse gas reductions on each clean energy supply are comparatively studied. For toxic chemical material selection, an innovative schematic method is developed as a visual decision tool for characterizing and benchmarking the human health impact of toxic chemicals, with a case study conducted on six chemicals commonly used as solvents in semiconductor manufacturing. Reliability of

  14. High-speed high-efficiency 500-W cw CO2 laser hermetization of metal frames of microelectronics devices

    Science.gov (United States)

    Levin, Andrey V.

    1996-04-01

    High-speed, efficient method of laser surface treatment has been developed using (500 W) cw CO2 laser. The principal advantages of CO2 laser surface treatment in comparison with solid state lasers are the basis of the method. It has been affirmed that high efficiency of welding was a consequence of the fundamental properties of metal-IR-radiation (10,6 mkm) interaction. CO2 laser hermetization of metal frames of microelectronic devices is described as an example of the proposed method application.

  15. Appraising manufacturing location

    NARCIS (Netherlands)

    Steenhuis, H.J.; de Bruijn, E.J.

    2002-01-01

    International location of manufacturing activities is an issue for managers of manufacturing companies as well as public policy makers. For managers, the issue is relevant because international locations offer opportunities for lowering costs due to productivity improvements. For governments the

  16. Manufacturing engineering and technology

    CERN Document Server

    Kalpakjian, Serope; Vijai Sekar, K S

    2014-01-01

    For courses in manufacturing processes at two- or four-year schools. An up-to-date text that provides a solid background in manufacturing processes. Manufacturing Engineering and Technology, SI Edition, 7e, presents a mostly qualitative description of the science, technology, and practice of manufacturing. This includes detailed descriptions of manufacturing processes and the manufacturing enterprise that will help introduce students to important concepts. With a total of 120 examples and case studies, up-to-date and comprehensive coverage of all topics, and superior two-color graphics, this text provides a solid background for manufacturing students and serves as a valuable reference text for professionals. Teaching and Learning Experience To provide a better teaching and learning experience, for both instructors and students, this program will: * Apply Theory and/or Research: An excellent overview of manufacturing conceptswith a balance of relevant fundamentals and real-world practices. * Engage Students: E...

  17. Advanced Manufacture of Reflectors

    Energy Technology Data Exchange (ETDEWEB)

    Angel, Roger [Univ. of Arizona, Tucson, AZ (United States)

    2014-12-17

    The main project objective has been to develop an advanced gravity sag method for molding large glass solar reflectors with either line or point focus, and with long or short focal length. The method involves taking standard sized squares of glass, 1.65 m x 1.65 m, and shaping them by gravity sag into precision steel molds. The method is designed for high volume manufacture when incorporated into a production line with separate pre-heating and cooling. The performance objectives for the self-supporting glass mirrors made by this project include mirror optical accuracy of 2 mrad root mean square (RMS), requiring surface slope errors less than 1 mrad rms, a target not met by current production of solar reflectors. Our objective also included development of new methods for rapidly shaping glass mirrors and coating them for higher reflectivity and soil resistance. Reflectivity of 95% for a glass mirror with anti-soil coating was targeted, compared to the present ~94% with no anti-soil coating. Our mirror cost objective is ~$20/m2 in 2020, a significant reduction compared to the present ~$35/m2 for solar trough mirrors produced for trough solar plants.

  18. Application of manufactured products

    Science.gov (United States)

    Sastri, Sankar; Duke, Michael B.

    1992-01-01

    A wide range of products can be manufactured from the following materials: (1) lunar regolith or basalt; (2) regolith or rock beneficiated to concentrate plagioclase or other minerals; (3) iron, extracted from lunar soil or rocks by various means; (4) naturally occurring or easily obtained materials that have cementitious properties; and (5) byproducts of the above materials. Among the products that can be produced from these materials are the following: beams; plates and sheets; transparent plates (windows); bricks and blocks; pipes and tubes; low-density materials (foams); fiber, wire, and cables; foils and reflective coatings; hermetic seals (coatings); and formed objects. In addition to oxygen, which can be obtained by several processes, either from unbeneficiated regolith or by reduction of concentrated ilmenite, these materials make the simplest requirements of the lunar resource extraction system. A thorough analysis of the impact of these simplest products on the economics of space operations is not possible at this point. Research is necessary both to define optimum techniques and adapt them to space and to determine the probable market for the products so that the priority of various processes can be assessed. Discussions of the following products are presented: aerobraking heat shields; pressurized habitats; lunar photovoltaic farms; and agricultural systems.

  19. Additive Manufacturing Infrared Inspection

    Science.gov (United States)

    Gaddy, Darrell; Nettles, Mindy

    2015-01-01

    The Additive Manufacturing Infrared Inspection Task started the development of a real-time dimensional inspection technique and digital quality record for the additive manufacturing process using infrared camera imaging and processing techniques. This project will benefit additive manufacturing by providing real-time inspection of internal geometry that is not currently possible and reduce the time and cost of additive manufactured parts with automated real-time dimensional inspections which deletes post-production inspections.

  20. Additive Manufacturing of Fuel Injectors

    Energy Technology Data Exchange (ETDEWEB)

    Sadek Tadros, Dr. Alber Alphonse [Edison Welding Institute, Inc., Columbus, OH (United States); Ritter, Dr. George W. [Edison Welding Institute, Inc., Columbus, OH (United States); Drews, Charles Donald [Edison Welding Institute, Inc., Columbus, OH (United States); Ryan, Daniel [Solar Turbines Inc., San Diego, CA (United States)

    2017-10-24

    Additive manufacturing (AM), also known as 3D-printing, has been shifting from a novelty prototyping paradigm to a legitimate manufacturing tool capable of creating components for highly complex engineered products. An emerging AM technology for producing metal parts is the laser powder bed fusion (L-PBF) process; however, industry manufacturing specifications and component design practices for L-PBF have not yet been established. Solar Turbines Incorporated (Solar), an industrial gas turbine manufacturer, has been evaluating AM technology for development and production applications with the desire to enable accelerated product development cycle times, overall turbine efficiency improvements, and supply chain flexibility relative to conventional manufacturing processes (casting, brazing, welding). Accordingly, Solar teamed with EWI on a joint two-and-a-half-year project with the goal of developing a production L-PBF AM process capable of consistently producing high-nickel alloy material suitable for high temperature gas turbine engine fuel injector components. The project plan tasks were designed to understand the interaction of the process variables and their combined impact on the resultant AM material quality. The composition of the high-nickel alloy powders selected for this program met the conventional cast Hastelloy X compositional limits and were commercially available in different particle size distributions (PSD) from two suppliers. Solar produced all the test articles and both EWI and Solar shared responsibility for analyzing them. The effects of powder metal input stock, laser parameters, heat treatments, and post-finishing methods were evaluated. This process knowledge was then used to generate tensile, fatigue, and creep material properties data curves suitable for component design activities. The key process controls for ensuring consistent material properties were documented in AM powder and process specifications. The basic components of the project

  1. A method for manufacturing monocrystals

    International Nuclear Information System (INIS)

    Faure, Jacqueline; Malmejac, Yves; Schaub, Bernard.

    1973-01-01

    Description is given of a method for manufacturing monocrystals, substantially free of disorder, of a metal showing an allotropic transformation at a temperature lower than its melting point. Monocrystals of the raw metal having undergone a uni-directional solidification are heated to a temperature between the allotropic transformation point and the metal melting point; the monocrystals are maintained in the vicinity of that temperature for a given period of time; they are cooled down to a temperature lower than the allotropic transformation point, then they are annealed and cooled down to room temperature. Such monocrystals are used in neutron monochromators [fr

  2. ACE - Manufacturer Identification Code (MID)

    Data.gov (United States)

    Department of Homeland Security — The ACE Manufacturer Identification Code (MID) application is used to track and control identifications codes for manufacturers. A manufacturer is identified on an...

  3. Additive Manufacturing of Wind Turbine Molds

    Energy Technology Data Exchange (ETDEWEB)

    Post, Brian [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Richardson, Bradley [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Lloyd, Peter [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Love, Lonnie [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Nolet, Stephen [TPI Composites, Scottsdale, AZ (United States); Hannan, James [TPI Composites, Scottsdale, AZ (United States)

    2017-07-01

    The objective of this project was to explore the utility of Big Area Additive Manufacturing (BAAM) for low cost manufacturing of wind turbine molds. Engineers at Oak Ridge National Laboratory (ORNL) and TPI Composites (TPI) collaborated to design and manufacture a printed mold that can be used for resin infusion of wind turbine components. Specific focus was on required material properties (operating temperatures and pressures, coefficient of thermal expansion (CTE), thermal conductivity), surface finish (accuracy and coatings) and system integration (integrated vacuum ports, and heating element). The project began with a simple proof of principle components, targeting surface coatings and material properties for printing a small section (approximately 4’ x 4’ x 2’) of a mold. Next, the second phase scaled up and integrated with the objective of capturing all of the necessary components (integrated heating to accelerate cure time, and vacuum, sealing) for resin infusion on a mold of significant size (8’ x 20’ x 6’).

  4. Prototype solar heating and combined heating and cooling systems. Quarterly report No. 6

    Energy Technology Data Exchange (ETDEWEB)

    1978-01-06

    The General Electric Company is developing eight prototype solar heating and combined heating and cooling systems. This effort includes development, manufacture, test, installation, maintenance, problem resolution, and performance evaluation.

  5. Dimensionless numbers in additive manufacturing

    Science.gov (United States)

    Mukherjee, T.; Manvatkar, V.; De, A.; DebRoy, T.

    2017-02-01

    The effects of many process variables and alloy properties on the structure and properties of additively manufactured parts are examined using four dimensionless numbers. The structure and properties of components made from 316 Stainless steel, Ti-6Al-4V, and Inconel 718 powders for various dimensionless heat inputs, Peclet numbers, Marangoni numbers, and Fourier numbers are studied. Temperature fields, cooling rates, solidification parameters, lack of fusion defects, and thermal strains are examined using a well-tested three-dimensional transient heat transfer and fluid flow model. The results show that lack of fusion defects in the fabricated parts can be minimized by strengthening interlayer bonding using high values of dimensionless heat input. The formation of harmful intermetallics such as laves phases in Inconel 718 can be suppressed using low heat input that results in a small molten pool, a steep temperature gradient, and a fast cooling rate. Improved interlayer bonding can be achieved at high Marangoni numbers, which results in vigorous circulation of liquid metal, larger pool dimensions, and greater depth of penetration. A high Fourier number ensures rapid cooling, low thermal distortion, and a high ratio of temperature gradient to the solidification growth rate with a greater tendency of plane front solidification.

  6. Development of Drop/Shock Test in Microelectronics and Impact Dynamic Analysis for Uniform Board Response

    Science.gov (United States)

    Kallolimath, Sharan Chandrashekar

    -joints. No ring test conditions was proposed and verified for the current widely used JEDEC standard. The significance of impact loading parameters such as pulse magnitude, pulse duration, pulse shapes and board dynamic parameter such as linear hysteretic damping and dynamic stiffness were discussed. Third, Kirchhoff's plate theory by principle of minimum potential energy was adopted to develop the FEA formulation to consider the effect of material hysteretic damping for the currently used JEDEC board test and proposed no-ring response test condition. Fourth, a hexagonal symmetrical board model was proposed to address the uniform stress and strain distribution throughout the test board and identify the critical failure factors. Dynamic stress and strain of the hexagonal board model were then compared with standard JEDEC board for both standard and proposed no-ring test conditions. In general, this line of research demonstrates that advanced techniques of FEA analysis can provide useful insights concerning the optimal design of drop test in microelectronics.

  7. Investigations on MGy ionizing dose effects in thin oxides of micro-electronic devices

    Energy Technology Data Exchange (ETDEWEB)

    Gaillardin, M.; Paillet, P.; Raine, M.; Martinez, M.; Marcandella, C.; Duhamel, O.; Richard, N.; Leray, J.L. [CEA, DAM, DIF, F-91297 Arpajon (France); Goiffon, V.; Corbiere, F.; Rolando, S.; Molina, R.; Magnan, P. [ISAE, Universite de Toulouse, 10 avenue Edouard Belin, BP 54032, 31055 Toulouse Cedex 4 (France); Girard, S.; Ouerdane, Y.; Boukenter, A. [Universite de Saint-Etienne, Laboratoire H. Curien, UMR-5516, 42000, Saint-Etienne (France)

    2015-07-01

    Total ionizing dose (TID) effects have been studied for a long time in micro-electronic components designed to operate in natural and artificial environments. In most cases, TID induces both charge trapping in the bulk of irradiated oxides and the buildup of interface traps located at semiconductor/dielectric interfaces. Such effects result from basic mechanisms driven by both the shape of the electric field which stands into the oxide and by fabrication process parameters inducing pre-existing traps in the oxide's bulk. From the pioneering studies based on 'thick' oxide technologies to the most recent ones dedicated to innovative technologies, most studies concluded that the impact of total ionizing dose effects reduces with the oxide thinning. This is specifically the case for the gate-oxide of Metal-Oxide-Semiconductor Field Effect Transistors (MOSFET) for which it is generally considered that TID is not a major issue anymore at kGy dose ranges. TID effects are now mainly due to charge trapping in the field oxides such as Shallow Trench Isolation. This creates either parasitic conduction paths or Radiation-Induced Narrow Channel Effects (RINCE). Static current-voltage (I-V) electrical characteristics are then modified through a significant increase of the off-current of NMOS transistors or by shifting the whole I-V curves (of both NMOS and PMOS transistors). Based on these assumptions, no significant shift of I-V curves should be observed in modern bulk CMOS technologies. However, such phenomenon may not be directly extrapolated to higher TID ranges, typically of several MGy for which only few data are available in the literature. This paper presents evidences of large threshold voltage shifts measured at MGy dose levels despite the fact that transistors are designed in a submicron bulk technology which features a 7-nm thin gate-oxide on GO2 transistors dedicated to mixed analog/digital integrated circuits. Such electrical shifts are encountered

  8. Investigations on MGy ionizing dose effects in thin oxides of micro-electronic devices

    International Nuclear Information System (INIS)

    Gaillardin, M.; Paillet, P.; Raine, M.; Martinez, M.; Marcandella, C.; Duhamel, O.; Richard, N.; Leray, J.L.; Goiffon, V.; Corbiere, F.; Rolando, S.; Molina, R.; Magnan, P.; Girard, S.; Ouerdane, Y.; Boukenter, A.

    2015-01-01

    Total ionizing dose (TID) effects have been studied for a long time in micro-electronic components designed to operate in natural and artificial environments. In most cases, TID induces both charge trapping in the bulk of irradiated oxides and the buildup of interface traps located at semiconductor/dielectric interfaces. Such effects result from basic mechanisms driven by both the shape of the electric field which stands into the oxide and by fabrication process parameters inducing pre-existing traps in the oxide's bulk. From the pioneering studies based on 'thick' oxide technologies to the most recent ones dedicated to innovative technologies, most studies concluded that the impact of total ionizing dose effects reduces with the oxide thinning. This is specifically the case for the gate-oxide of Metal-Oxide-Semiconductor Field Effect Transistors (MOSFET) for which it is generally considered that TID is not a major issue anymore at kGy dose ranges. TID effects are now mainly due to charge trapping in the field oxides such as Shallow Trench Isolation. This creates either parasitic conduction paths or Radiation-Induced Narrow Channel Effects (RINCE). Static current-voltage (I-V) electrical characteristics are then modified through a significant increase of the off-current of NMOS transistors or by shifting the whole I-V curves (of both NMOS and PMOS transistors). Based on these assumptions, no significant shift of I-V curves should be observed in modern bulk CMOS technologies. However, such phenomenon may not be directly extrapolated to higher TID ranges, typically of several MGy for which only few data are available in the literature. This paper presents evidences of large threshold voltage shifts measured at MGy dose levels despite the fact that transistors are designed in a submicron bulk technology which features a 7-nm thin gate-oxide on GO2 transistors dedicated to mixed analog/digital integrated circuits. Such electrical shifts are encountered

  9. Manufacturing fuel-switching capability, 1988

    International Nuclear Information System (INIS)

    1991-09-01

    Historically, about one-third of all energy consumed in the United States has been used by manufacturers. About one-quarter of manufacturing energy is used as feedstocks and raw material inputs that are converted into nonenergy products; the remainder is used for its energy content. During 1988, the most recent year for which data are available, manufacturers consumed 15.5 quadrillion British thermal units (Btu) of energy to produce heat and power and to generate electricity. The manufacturing sector also has widespread capabilities to switch from one fuel to another for either economic or emergency reasons. There are numerous ways to define fuel switching. For the purposes of the Manufacturing Energy Consumption Survey (MECS), fuel switching is defined as the capability to substitute one energy source for another within 30 days with no significant modifications to the fuel-consuming equipment, while keeping production constant. Fuel-switching capability allows manufacturers substantial flexibility in choosing their mix of energy sources. The consumption of a given energy source can be maximized if all possible switching into that energy source takes place. The estimates in this report are based on data collected on the 1988 Manufacturing Energy Consumption Survey (MECS), Forms 846 (A through C). The EIA conducts this national sample survey of manufacturing energy consumption on a triennial basis. The MECS is the only comprehensive source of national-level data on energy-related information for the manufacturing industries. The MECS was first conducted in 1986 to collect data for 1985. This report presents information on the fuel-switching capabilities of manufacturers in 1988. This report is the second of a series based on the 1988 MECS. 8 figs., 31 tabs

  10. Manufacturing fuel-switching capability, 1988

    Energy Technology Data Exchange (ETDEWEB)

    1991-09-01

    Historically, about one-third of all energy consumed in the United States has been used by manufacturers. About one-quarter of manufacturing energy is used as feedstocks and raw material inputs that are converted into nonenergy products; the remainder is used for its energy content. During 1988, the most recent year for which data are available, manufacturers consumed 15.5 quadrillion British thermal units (Btu) of energy to produce heat and power and to generate electricity. The manufacturing sector also has widespread capabilities to switch from one fuel to another for either economic or emergency reasons. There are numerous ways to define fuel switching. For the purposes of the Manufacturing Energy Consumption Survey (MECS), fuel switching is defined as the capability to substitute one energy source for another within 30 days with no significant modifications to the fuel-consuming equipment, while keeping production constant. Fuel-switching capability allows manufacturers substantial flexibility in choosing their mix of energy sources. The consumption of a given energy source can be maximized if all possible switching into that energy source takes place. The estimates in this report are based on data collected on the 1988 Manufacturing Energy Consumption Survey (MECS), Forms 846 (A through C). The EIA conducts this national sample survey of manufacturing energy consumption on a triennial basis. The MECS is the only comprehensive source of national-level data on energy-related information for the manufacturing industries. The MECS was first conducted in 1986 to collect data for 1985. This report presents information on the fuel-switching capabilities of manufacturers in 1988. This report is the second of a series based on the 1988 MECS. 8 figs., 31 tabs.

  11. Evolution of solidification texture during additive manufacturing

    Science.gov (United States)

    Wei, H. L.; Mazumder, J.; DebRoy, T.

    2015-01-01

    Striking differences in the solidification textures of a nickel based alloy owing to changes in laser scanning pattern during additive manufacturing are examined based on theory and experimental data. Understanding and controlling texture are important because it affects mechanical and chemical properties. Solidification texture depends on the local heat flow directions and competitive grain growth in one of the six preferred growth directions in face centered cubic alloys. Therefore, the heat flow directions are examined for various laser beam scanning patterns based on numerical modeling of heat transfer and fluid flow in three dimensions. Here we show that numerical modeling can not only provide a deeper understanding of the solidification growth patterns during the additive manufacturing, it also serves as a basis for customizing solidification textures which are important for properties and performance of components. PMID:26553246

  12. Measuring Manufacturing Innovativeness

    DEFF Research Database (Denmark)

    Blichfeldt, Henrik; Knudsen, Mette Præst

    2017-01-01

    Globalization and customization increases the pressure on manufacturing companies, and the ability to provide innovativeness is a potential source of competitive advantage. This paper positions the manufacturing entity in the innovation process, and investigates the relation between innovation vers...... technology and organizational concepts. Based on Danish survey data from the European Manufacturing Survey (EMS-2015) this paper finds that there is a relation between innovative companies, and their level of technology and use of organizational concepts. Technology and organizational concepts act...... as manufacturing levers to support the manufacturing and production system to provide innovativeness. The managerial implication lies in building manufacturing capabilities to support the innovative process, by standardization, optimization and creating stability in combination with automation and advanced...

  13. Manufacturing microsystems-on-a-chip with 5-level surface micromachining technology

    Energy Technology Data Exchange (ETDEWEB)

    Sniegowski, J.; Rodgers, M.S.

    1998-05-01

    An agile microsystem manufacturing technology has been developed that provides unprecedented 5 levels of independent polysilicon surface-micromachine films for the designer. Typical surface-micromachining processes offer a maximum of 3 levels, making this the most complex surface-micromachining process technology developed to date. Leveraged from the extensive infrastructure present in the microelectronics industry, the manufacturing method of polysilicon surface-micromachining offers similar advantages of high-volume, high-reliability, and batch-fabrication to microelectromechanical systems (MEMS) as has been accomplished with integrated circuits (ICs). These systems, comprised of microscopic-sized mechanical elements, are laying the foundation for a rapidly expanding, multi-billion dollar industry 2 which impacts the automotive, consumer product, and medical industries to name only a few.

  14. Manufacturing ontology through templates

    Directory of Open Access Journals (Sweden)

    Diciuc Vlad

    2017-01-01

    Full Text Available The manufacturing industry contains a high volume of knowhow and of high value, much of it being held by key persons in the company. The passing of this know-how is the basis of manufacturing ontology. Among other methods like advanced filtering and algorithm based decision making, one way of handling the manufacturing ontology is via templates. The current paper tackles this approach and highlights the advantages concluding with some recommendations.

  15. Manufacturing knowledge management strategy

    OpenAIRE

    Shaw , Duncan; Edwards , John

    2006-01-01

    Abstract The study sought to understand the components of knowledge management strategy from the perspective of staff in UK manufacturing organisations. To analyse this topic we took an empirical approach and collaborated with two manufacturing organisations. Our main finding centres on the key components of a knowledge management strategy, and the relationships between it and manufacturing strategy and corporate strategy. Other findings include: the nature of knowledge in manufact...

  16. Industrial & Manufacturing Engineering | Classification | College of

    Science.gov (United States)

    Electrical Engineering Instructional Laboratories Student Resources Industrial & Manufacturing Engineering Industrial & Manufacturing Engineering Academic Programs Industrial & Manufacturing Engineering Major Industrial & Manufacturing Engineering Minor Industrial & Manufacturing Engineering

  17. Strategic Roles of Manufacturing

    DEFF Research Database (Denmark)

    Yang, Cheng

    with the trend of globalisation, how do industrial companies develop their global manufacturing networks? These two questions are actually interlinked. On the one hand, facing increasing offshoring and outsourcing of production activities, industrial companies have to understand how to develop their global...... manufacturing networks. On the other hand, ongoing globalisation also brings tremendous impacts to post-industrial economies (e.g. Denmark). A dilemma therefore arises, i.e. whether it is still necessary to keep manufacturing in these post-industrial economies; if yes, what kinds of roles manufacturing should...

  18. Composite Structures Manufacturing Facility

    Data.gov (United States)

    Federal Laboratory Consortium — The Composite Structures Manufacturing Facility specializes in the design, analysis, fabrication and testing of advanced composite structures and materials for both...

  19. Manufacturing Demonstration Facility (MDF)

    Data.gov (United States)

    Federal Laboratory Consortium — The U.S. Department of Energy Manufacturing Demonstration Facility (MDF) at Oak Ridge National Laboratory (ORNL) provides a collaborative, shared infrastructure to...

  20. Advanced Manufacturing Laboratory

    Data.gov (United States)

    Federal Laboratory Consortium — The Advanced Manufacturing Laboratory at the University of Maryland provides the state of the art facilities for realizing next generation products and educating the...

  1. Characterization of industrial process waste heat and input heat streams

    Energy Technology Data Exchange (ETDEWEB)

    Wilfert, G.L.; Huber, H.B.; Dodge, R.E.; Garrett-Price, B.A.; Fassbender, L.L.; Griffin, E.A.; Brown, D.R.; Moore, N.L.

    1984-05-01

    The nature and extent of industrial waste heat associated with the manufacturing sector of the US economy are identified. Industry energy information is reviewed and the energy content in waste heat streams emanating from 108 energy-intensive industrial processes is estimated. Generic types of process equipment are identified and the energy content in gaseous, liquid, and steam waste streams emanating from this equipment is evaluated. Matchups between the energy content of waste heat streams and candidate uses are identified. The resultant matrix identifies 256 source/sink (waste heat/candidate input heat) temperature combinations. (MHR)

  2. Heat pumps: heat recovery

    Energy Technology Data Exchange (ETDEWEB)

    Pielke, R

    1976-01-01

    The author firstly explains in a general manner the functioning of the heat pump. Following a brief look at the future heat demand and the possibilities of covering it, the various methods of obtaining energy (making use of solar energy, ground heat, and others) and the practical applications (office heating, swimming pool heating etc.) are explained. The author still sees considerable difficulties in using the heat pump at present on a large scale. Firstly there is not enough maintenance personnel available, secondly the electricity supply undertakings cannot provide the necessary electricity on a wide basis without considerable investments. Other possibilities to save energy or to use waste energy are at present easier and more economical to realize. Recuperative and regenerative systems are described.

  3. Materials contamination control in the microelectronic industry; Controle de la contamination des materiaux dans l`industrie de la micro-electronique

    Energy Technology Data Exchange (ETDEWEB)

    Tardif, F

    1994-12-31

    This paper deals with many aspects of the contamination of materials in the microelectronic industry. The contamination`s control of chemicals, process gases, silicon and the survey of the ions free water`s purity are treated. (TEC). 29 figs., 7 tabs.

  4. Nuclear data relevant to single-event upsets (SEU) in microelectronics and their application to SEU simulation

    International Nuclear Information System (INIS)

    Watanabe, Yukinobu; Tukamoto, Yasuyuki; Kodama, Akihiro; Nakashima, Hideki

    2004-01-01

    A cross-section database for neutron-induced reactions on 28 Si was developed in the energy range between 2 MeV and 3 GeV in order to analyze single-event upsets (SEUs) phenomena induced by cosmic-ray neutrons in microelectronic devices. A simplified spherical device model was proposed for simulation of the initial process of SEUs. The model was applied to SEU cross-section calculations for semiconductor memory devices. The calculated results were compared with measured SEU cross-sections and the other simulation result. The dependence of SEU cross-sections on incident neutron energy and secondary ions having the most important effects on SEUs are discussed. (author)

  5. Measuring the diffusion of Ti and Cu in low-k materials for microelectronic devices by EELS, EFTEM and EDX

    International Nuclear Information System (INIS)

    Barnes, J-P; Lafond, D; Guedj, C; Fayolle, M; Meininger, P; Maitrejean, S; David, T; Posseme, N; Bayle-Guillemaud, P; Chabli, Amal

    2006-01-01

    The need to reduce RC delay and cross talk in Cu interconnects means that ultra low-k dielectrics such as porous SiCOH are being integrated into microelectronic devices. Unfortunately porous materials lead to integration issues such as metal diffusion into the porosity of the dielectric, especially when chemical vapour deposition (CVD) methods are used for metal deposition. In our case, the copper anti-diffusion barrier used before Cu deposition is MOCVD TiN. Without an appropriate surface treatment (pore sealing) of the low-k the TiN may diffuse in the porosity. The presence of Ti or Cu in the low-k is deleterious as it can raise the dielectric constant and the leakage current. EFTEM EELS and EDX have been used to map Ti, Cu, O and C as a function of process conditions

  6. Improving Project Manufacturing Coordination

    Directory of Open Access Journals (Sweden)

    Korpivaara Ville

    2014-09-01

    Full Text Available The objective of this research is to develop firms’ project manufacturing coordination. The development will be made by centralizing the manufacturing information flows in one system. To be able to centralize information, a deep user need assessment is required. After user needs have been identified, the existing system will be developed to match these needs. The theoretical background is achieved through exploring the literature of project manufacturing, development project success factors and different frameworks and tools for development project execution. The focus of this research is rather in customer need assessment than in system’s technical expertise. To ensure the deep understanding of customer needs this study is executed by action research method. As a result of this research the information system for project manufacturing coordination was developed to respond revealed needs of the stakeholders. The new system improves the quality of the manufacturing information, eliminates waste in manufacturing coordination processes and offers a better visibility to the project manufacturing. Hence it provides a solid base for the further development of project manufacturing.

  7. Modern manufacturing engineering

    CERN Document Server

    2015-01-01

    This book covers recent research and trends in Manufacturing Engineering. The chapters emphasize different aspects of the transformation from materials to products. It provides the reader with fundamental materials treatments and the integration of processes. Concepts such as green and lean manufacturing are also covered in this book.

  8. Optimized manufacturable porous materials

    DEFF Research Database (Denmark)

    Andreassen, Erik; Andreasen, Casper Schousboe; Jensen, Jakob Søndergaard

    Topology optimization has been used to design two-dimensional material structures with specific elastic properties, but optimized designs of three-dimensional material structures are more scarsely seen. Partly because it requires more computational power, and partly because it is a major challenge...... to include manufacturing constraints in the optimization. This work focuses on incorporating the manufacturability into the optimization procedure, allowing the resulting material structure to be manufactured directly using rapid manufacturing techniques, such as selective laser melting/sintering (SLM....../S). The available manufacturing methods are best suited for porous materials (one constituent and void), but the optimization procedure can easily include more constituents. The elasticity tensor is found from one unit cell using the homogenization method together with a standard finite element (FE) discretization...

  9. Multi-orifice deposition nozzle for additive manufacturing

    Science.gov (United States)

    Lind, Randall F.; Post, Brian K.; Cini, Colin L.

    2017-11-21

    An additive manufacturing extrusion head includes a nozzle for accepting and depositing a heated material onto a work surface and/or part. The nozzle includes a valve body and an internal poppet body moveable between positions to permit deposition of at least two bead sizes of heated material onto a work surface and/or part.

  10. Heat pipes. (Latest citations from the US Patent Bibliographic file with exemplary claims). Published Search

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-01-01

    The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 250 citations and includes a subject term index and title list.)

  11. Heat pipe heat storage performance

    Energy Technology Data Exchange (ETDEWEB)

    Caruso, A; Pasquetti, R [Univ. de Provence, Marseille (FR). Inst. Universitaire des Systemes; Grakovich, L P; Vasiliev, L L [A.V. Luikov Heat and Mass Transfer Inst. of the BSSR, Academy of Sciences, Minsk (BY)

    1989-01-01

    Heat storage offers essential thermal energy saving for heating. A ground heat store equipped with heat pipes connecting it with a heat source and to the user is considered in this paper. It has been shown that such a heat exchanging system along with a batch energy source meets, to a considerable extent, house heating requirements. (author).

  12. Manufacturing development for the SAFE 100 kW core

    International Nuclear Information System (INIS)

    Carter, Robert; Roman, Jose; Salvail, Pat

    2002-01-01

    In stark contrast to what is sometimes considered the norm in traditional manufacturing processes, engineers at the Marshall Space Flight Center (MSFC) arc in the practice of altering the standard in an effort to realize other potential methods in core manufacturing. While remaining within the bounds of the materials database, we are researching into core manufacturing techniques that may have been overlooked in the past due to funding and/or time constraints. To augment proven core fabrication capabilities we are pursuing plating processes as another possible method for core build-up and assembly. Although brazing and a proprietary HIP cycle are used for module assembly (proven track record for stability and endurance), it is prudent to pursue secondary or backup methods of module and core assembly. For this reason heat tube manufacture and module assembly by means of plating is being investigated. Potentially, the plating processes will give engineers the ability to manufacture replacement modules for any module that might fail to perform nominally, and to assemble/disassemble a complete core in much less time than would be required for the conventional Braze-HIP process. Another area of improvement in core manufacturing capabilities is the installation of a sodium and lithium liquid metal heat pipe fill machine. This, along with the ability to Electron Beam Weld heat pipe seals and wet-in the pipes in the necessary vacuum atmosphere, will eliminate the need to ship potentially hazardous components outside for processing. In addition to developing core manufacturing techniques, the SAFE manufacturing team has been evaluating the thermal heat transfer characteristics, and manufacturability of several heat exchanger design concepts

  13. 29 CFR 1919.80 - Heat treatment.

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 7 2010-07-01 2010-07-01 false Heat treatment. 1919.80 Section 1919.80 Labor Regulations...) GEAR CERTIFICATION Certification of Shore-Based Material Handling Devices § 1919.80 Heat treatment. (a) Wherever heat treatment of any loose gear is recommended by the manufacturer, it shall be carried out in...

  14. Heat transfer

    Indian Academy of Sciences (India)

    First page Back Continue Last page Overview Graphics. Heat transfer. Heat conduction in solid slab. Convective heat transfer. Non-linear temperature. variation due to flow. HEAT FLUX AT SURFACE. conduction/diffusion.

  15. Heat Waves

    Science.gov (United States)

    Heat Waves Dangers we face during periods of very high temperatures include: Heat cramps: These are muscular pains and spasms due ... that the body is having trouble with the heat. If a heat wave is predicted or happening… - ...

  16. Heat Islands

    Science.gov (United States)

    EPA's Heat Island Effect Site provides information on heat islands, their impacts, mitigation strategies, related research, a directory of heat island reduction initiatives in U.S. communities, and EPA's Heat Island Reduction Program.

  17. Manufacture of disposal canisters

    International Nuclear Information System (INIS)

    Nolvi, L.

    2009-12-01

    The report summarizes the development work carried out in the manufacturing of disposal canister components, and present status, in readiness for manufacturing, of the components for use in assembly of spent nuclear fuel disposal canister. The disposal canister consist of two major components: the nodular graphite cast iron insert and overpack of oxygen-free copper. The manufacturing process for copper components begins with a cylindrical cast copper billet. Three different manufacturing processes i.e. pierce and draw, extrusion and forging are being developed, which produce a seamless copper tube or a tube with an integrated bottom. The pierce and draw process, Posiva's reference method, makes an integrated bottom possible and only the lid requires welding. Inserts for BWR-element are cast with 12 square channels and inserts for VVER 440-element with 12 round channels. Inserts for EPR-elements have four square channels. Casting of BWR insert type has been studied so far. Experience of casting inserts for PWR, which is similar to the EPR-type, has been got in co-operation with SKB. The report describes the processes being developed for manufacture of disposal canister components and some results of the manufacturing experiments are presented. Quality assurance and quality control in manufacture of canister component is described. (orig.)

  18. Micro/Nano manufacturing

    DEFF Research Database (Denmark)

    Tosello, Guido

    2017-01-01

    Micro- and nano-scale manufacturing has been the subject of an increasing amount of interest and research effort worldwide in both academia and industry over the past 10 years.Traditional (MEMS) manufacturing, but also precision manufacturing technologies have been developed to cover micro......-scale dimensions and accuracies. Furthermore, these fundamentally different technology ecosystems are currently combined in order to exploit strengths of both platforms. One example is the use of lithography-based technologies to establish nanostructures that are subsequently transferred to 3D geometries via...

  19. Design and manufacture of steam generators for replacement

    International Nuclear Information System (INIS)

    Hirano, Hiroshi; Kuri, Syuhei

    1995-01-01

    The basic specification of the steam generators for replacement as heat exchangers (the pressure, temperature, flow rate and thermal output on primary and secondary sides) is set same as that of steam generators before replacement, but the latest design reflecting the operation experience obtained so far and taking the countermeasures for preventing heating tube damage in it is adopted, such as the heating tubes made of TT 690 alloy, the tube support plates with four-lobe shape tube holes made of stainless steel, the stainless steel rest fittings of three in one set and so on. After the heating tube break accident in Mihama No. 2 plant, the quality control was further strengthened. The comparison of the specifications of the steam generators of respective plants before and after the replacement is shown. The main objective of improving steam generators is the heightening of the reliability of heating tubes against intergranular attack and primary water stress corrosion cracking. The improvements of heating tube material, tube support plate material, secondary side heat flow, the shape of tube holes of tube support plates, the method of expanding heating tubes, and vibration-controlling fittings are explained. As to the manufacturing procedure and quality control, the manufacture of raw materials, the build-up welding of tube plates, the manufacture of lower half shell plates, the tube hole making of support plates, the insection of outer cylinder, flow rate distribution plate. Support plates and heating tubes, the sealing welding and expanding of heating tubes, the fixing of rest fittings, the manufacture and fixing of water chamber cover, the manufacture of upper half shell, the fixing of parts inside it, the final joint and inspection are described. (K.I.)

  20. Additive manufacturing with polypropylene microfibers.

    Science.gov (United States)

    Haigh, Jodie N; Dargaville, Tim R; Dalton, Paul D

    2017-08-01

    The additive manufacturing of small diameter polypropylene microfibers is described, achieved using a technique termed melt electrospinning writing. Sequential fiber layering, which is important for accurate three-dimensional fabrication, was achieved with the smallest fiber diameter of 16.4±0.2μm obtained. The collector speed, temperature and melt flow rate to the nozzle were optimized for quality and minimal fiber pulsing. Of particular importance to the success of this method is appropriate heating of the collector plate, so that the electrostatically drawn filament adheres during the direct-writing process. By demonstrating the direct-writing of polypropylene, new applications exploiting the favorable mechanical, stability and biocompatible properties of this polymer are envisaged. Copyright © 2017. Published by Elsevier B.V.

  1. Graphene Aerogel Templated Fabrication of Phase Change Microspheres as Thermal Buffers in Microelectronic Devices.

    Science.gov (United States)

    Wang, Xuchun; Li, Guangyong; Hong, Guo; Guo, Qiang; Zhang, Xuetong

    2017-11-29

    Phase change materials, changing from solid to liquid and vice versa, are capable of storing and releasing a large amount of thermal energy during the phase change, and thus hold promise for numerous applications including thermal protection of electronic devices. Shaping these materials into microspheres for additional fascinating properties is efficient but challenging. In this regard, a novel phase change microsphere with the design for electrical-regulation and thermal storage/release properties was fabricated via the combination of monodispersed graphene aerogel microsphere (GAM) and phase change paraffin. A programmable method, i.e., coupling ink jetting-liquid marbling-supercritical drying (ILS) techniques, was demonstrated to produce monodispersed graphene aerogel microspheres (GAMs) with precise size-control. The resulting GAMs showed ultralow density, low electrical resistance, and high specific surface area with only ca. 5% diameter variation coefficient, and exhibited promising performance in smart switches. The phase change microspheres were obtained by capillary filling of phase change paraffin inside the GAMs and exhibited excellent properties, such as low electrical resistance, high latent heat, well sphericity, and thermal buffering. Assembling the phase change microsphere into the microcircuit, we found that this tiny device was quite sensitive and could respond to heat as low as 0.027 J.

  2. Manufacturing tolerant topology optimization

    DEFF Research Database (Denmark)

    Sigmund, Ole

    2009-01-01

    In this paper we present an extension of the topology optimization method to include uncertainties during the fabrication of macro, micro and nano structures. More specifically, we consider devices that are manufactured using processes which may result in (uniformly) too thin (eroded) or too thick...... (dilated) structures compared to the intended topology. Examples are MEMS devices manufactured using etching processes, nano-devices manufactured using e-beam lithography or laser micro-machining and macro structures manufactured using milling processes. In the suggested robust topology optimization...... approach, under- and over-etching is modelled by image processing-based "erode" and "dilate" operators and the optimization problem is formulated as a worst case design problem. Applications of the method to the design of macro structures for minimum compliance and micro compliant mechanisms show...

  3. Manufacturing parabolic mirrors

    CERN Multimedia

    CERN PhotoLab

    1975-01-01

    The photo shows the construction of a vertical centrifuge mounted on an air cushion, with a precision of 1/10000 during rotation, used for the manufacture of very high=precision parabolic mirrors. (See Annual Report 1974.)

  4. MEDICAL MANUFACTURING INNOVATIONS

    Directory of Open Access Journals (Sweden)

    Cosma Sorin Cosmin

    2015-02-01

    Full Text Available The purpose of these studies was to improve the design and manufacturing process by selective laser melting, of new medical implants. After manufacturing process, the implants were measured, microscopically and mechanical analyzed. Implants manufactured by AM can be an attractive option for surface coatings to improve the osseointegration process. The main advantages of customized implants made by AM process are: the precise adaptation to the region of implantation, better cosmesis, reduced surgical times and better performance over their generic counterparts. These medical manufacturing changes the way that the surgeons are planning surgeries and engineers are designing custom implant. AM process has eliminated the constraints of shape, size, internal structure and mechanical properties making it possible for fabrication of implants that conform to the physical and mechanical requirements of implantation according to CT images. This article will review some custom implants fabricated in DME using biocompatible titanium.

  5. Manufacturing Enterprise in Asia

    International Development Research Centre (IDRC) Digital Library (Canada)

    2017-12-13

    Dec 13, 2017 ... 53 Designing Financial Systems in East Asia and Japan ..... 5.3 Weights for the industrial production index (%) ..... The demand for manufactured goods for this low level of consumption per capita also tends to be very low.

  6. Additive manufactured serialization

    Science.gov (United States)

    Bobbitt, III, John T.

    2017-04-18

    Methods for forming an identifying mark in a structure are described. The method is used in conjunction with an additive manufacturing method and includes the alteration of a process parameter during the manufacturing process. The method can form in a unique identifying mark within or on the surface of a structure that is virtually impossible to be replicated. Methods can provide a high level of confidence that the identifying mark will remain unaltered on the formed structure.

  7. Designing materials for advanced microelectronic patterning applications using controlled polymerization RAFT technology

    Science.gov (United States)

    Sheehan, Michael T.; Farnham, William B.; Chambers, Charles R.; Tran, Hoang V.; Okazaki, Hiroshi; Brun, Yefim; Romberger, Matthew L.; Sounik, James R.

    2011-04-01

    Reversible Addition Fragmentation Chain Transfer (RAFT) polymerization technology enables the production of polymers possessing low polydispersity (PD) in high yield for many applications. RAFT technology also enables control over polymer architecture. With synthetic control over these polymer characteristics, a variety of polymers can be designed and manufactured for use in advanced electronic applications. By matching the specific RAFT reagent and monomer combinations, we can accommodate monomer reactivity and optimize acrylate or methacrylate polymerizations (193 and 193i photoresist polymers) or optimize styrenic monomer systems (248 nm photoresist polymers) to yield polymers with PD as low as 1.05. For 193i lithography, we have used RAFT technology to produce block copolymers comprising of a random "resist" block with composition and size based on conventional dry photoresist materials and a "low surface energy" block The relative block lengths and compositions may be varied to tune solution migration behavior, surface energy, contact angles, and solubility in developer. Directed self assembly is proving to be an interesting and innovative method to make 2- and even 3-dimensional periodic, uniform patterns. Two keys to acceptable performance of directed self assembly from block copolymers are the uniformity and the purity of the materials will be discussed.

  8. Energetics Manufacturing Technology Center (EMTC)

    Data.gov (United States)

    Federal Laboratory Consortium — The Energetics Manufacturing Technology Center (EMTC), established in 1994 by the Office of Naval Research (ONR) Manufacturing Technology (ManTech) Program, is Navy...

  9. Heat exchangers

    Energy Technology Data Exchange (ETDEWEB)

    Schmidt, E L; Eisenmann, G; Hahne, E [Stuttgart Univ. (TH) (F.R. Germany). Inst. fuer Thermodynamik und Waermetechnik

    1976-04-01

    A survey is presented on publications on design, heat transfer, form factors, free convection, evaporation processes, cooling towers, condensation, annular gap, cross-flowed cylinders, axial flow through a bundle of tubes, roughnesses, convective heat transfer, loss of pressure, radiative heat transfer, finned surfaces, spiral heat exchangers, curved pipes, regeneraters, heat pipes, heat carriers, scaling, heat recovery systems, materials selection, strength calculation, control, instabilities, automation of circuits, operational problems and optimization.

  10. Starting manufacturing phase of ITER upper ports

    Energy Technology Data Exchange (ETDEWEB)

    Utin, Yuri, E-mail: yuri.utin@iter.org [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Alekseev, Alexander; Sborchia, Carlo; Choi, Changho; Albin, Vincent; Barabash, Vladimir; Davis, James [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Fabritsiev, Sergey [NTC Sintez, Efremov Inst., 189631 Metallostroy, St. Petersburg (Russian Federation); Giraud, Benoit; Guirao, Julio [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Koenig, Werner [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); Kedrov, Igor; Kuzmin, Evgeny [NTC Sintez, Efremov Inst., 189631 Metallostroy, St. Petersburg (Russian Federation); Levesy, Bruno; Martinez, Jean-Marc [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Prebeck, Markus [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); Privalova, Elena [NTC Sintez, Efremov Inst., 189631 Metallostroy, St. Petersburg (Russian Federation); Ranzinger, Franz [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); Savrukhin, Petr [Russian Federation ITER Domestic Agency, Kurchatov sq.1, 123182 Moscow (Russian Federation); Schiller, Thomas [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); and others

    2015-10-15

    Highlights: • The port plugs are attached to the ports with high-strength fasteners. • Tightening of the fasteners via inductive heating was tested. • A concept for the port/plug sealing with metal-type gaskets has progressed. • Manufacturing design of the Upper Ports is in progress. • A full-scale mock-up of double-wall part of the port stub extension is in manufacturing process – acceptable final tolerances are expected. - Abstract: The ITER Vacuum Vessel (VV) features upper, equatorial and lower ports. The upper and regular equatorial ports are occupied by the port plugs. Although the port design has been overall completed in the past, the design of some remaining interfaces was still in progress: in particular, the Sealing Flange package, which includes the high-vacuum seals and the plug fasteners. As the ITER construction phase has started, the procurement of the VV ports has been launched. The VV upper ports will be procured by the Russian Federation Domestic Agency. The main suppliers were selected and the manufacturing design of the first parts is in full progress now. Since the VV is classified at nuclear level N2, the design and manufacture of its components are to be compliant with the French RCC-MR code and regulations for nuclear pressure equipment in France. These regulations make a strong impact to the port design and manufacturing process.

  11. Starting manufacturing phase of ITER upper ports

    International Nuclear Information System (INIS)

    Utin, Yuri; Alekseev, Alexander; Sborchia, Carlo; Choi, Changho; Albin, Vincent; Barabash, Vladimir; Davis, James; Fabritsiev, Sergey; Giraud, Benoit; Guirao, Julio; Koenig, Werner; Kedrov, Igor; Kuzmin, Evgeny; Levesy, Bruno; Martinez, Jean-Marc; Prebeck, Markus; Privalova, Elena; Ranzinger, Franz; Savrukhin, Petr; Schiller, Thomas

    2015-01-01

    Highlights: • The port plugs are attached to the ports with high-strength fasteners. • Tightening of the fasteners via inductive heating was tested. • A concept for the port/plug sealing with metal-type gaskets has progressed. • Manufacturing design of the Upper Ports is in progress. • A full-scale mock-up of double-wall part of the port stub extension is in manufacturing process – acceptable final tolerances are expected. - Abstract: The ITER Vacuum Vessel (VV) features upper, equatorial and lower ports. The upper and regular equatorial ports are occupied by the port plugs. Although the port design has been overall completed in the past, the design of some remaining interfaces was still in progress: in particular, the Sealing Flange package, which includes the high-vacuum seals and the plug fasteners. As the ITER construction phase has started, the procurement of the VV ports has been launched. The VV upper ports will be procured by the Russian Federation Domestic Agency. The main suppliers were selected and the manufacturing design of the first parts is in full progress now. Since the VV is classified at nuclear level N2, the design and manufacture of its components are to be compliant with the French RCC-MR code and regulations for nuclear pressure equipment in France. These regulations make a strong impact to the port design and manufacturing process.

  12. Sol-gel processing of glasses and glass-ceramics for microelectronic packaging

    International Nuclear Information System (INIS)

    Sriram, M.A.; Kumta, P.N.

    1992-01-01

    In recent years considerable progress has been made in electronic packaging substrate technology. The future need of miniaturization of devices to increase the signal processing speeds calls for an increase in the device density requiring the substrates to be designed for better thermal, mechanical and electrical efficiency. Fast signal propagation with minimum delay requires the substrate to possess very low dielectric constant. Several glasses and glass-ceramic materials have been identified over the years which show good promise as candidate substrate materials. among these borophosphate and borophosphosilicate glass-ceramics have been recently identified to have the lowest dielectric constant. This paper reports that sol-gel processing has been used to synthesize borosilicate, borophosphosilicate and borophosphate glasses and glass-ceramics using inexpensive boron oxide and phosphorus pentoxide precursors. Preliminary results of the processing of these gels and the effect of volatility of boron alkoxide and its modification on the gel structure are described. X-ray diffraction, Differential thermal analyses and FTIR have been used to characterize the as-prepared and heat treated gels

  13. Monitoring of Danish marketed solar heating systems

    International Nuclear Information System (INIS)

    Ellehauge, K.

    1993-01-01

    The paper describes the monitoring of manufactured solar heating systems for domestic hot water combined with space heating and systems for domestic hot water only. Results from the monitoring of 5 marketed combined systems for domestic hot water and space heating are presented. The systems situated at one family houses at different sites in Denmark have been monitored from January/February 1992. For the detailed monitoring of manufactured systems only for domestic hot water a test facility for simultaneous monitoring of 5 solar heating systems has been established at the Thermal Insulation Laboratory. (au)

  14. International Flipped Class for Chinese Honors Bachelor Students in the Frame of Multidisciplinary Fields: Reliability and Microelectronics

    Directory of Open Access Journals (Sweden)

    Olivier Bonnaud

    2018-07-01

    Full Text Available This paper reports an innovative pedagogic experience performed at South-East University (SEU with electrical engineering Bachelor honors students (computer science, mechanics, and electronics. The purpose was to develop their motivation and to make them aware of the strategic importance of two aspects of electronic engineering i.e. integrated technologies and reliability assessment of devices and systems. The pedagogical approach was based on a flipped class and learning by project that consisted to involve the students in the two topics. After several lectures on the fundamentals of microelectronics and reliability of electronics components performed by foreign professors, twelve groups of five students were built. Each group had to develop one topic, chosen for its strategic importance. Thus, from a given set of main literature references, the students prepared during three days a twelve pages report and an oral presentation, both in English language. Results were generally very good. Most of the students succeeded in addressing issues that were completely new for them. They clearly built by themselves the skills allowing understanding of all the important aspects of the topics they had to approach. This paper gives details on the organization, the content and the final evaluation.

  15. Space Radiation Environment Prediction for VLSI microelectronics devices onboard a LEO Satellite using OMERE-Trad Software

    Science.gov (United States)

    Sajid, Muhammad

    This tutorial/survey paper presents the assessment/determination of level of hazard/threat to emerging microelectronics devices in Low Earth Orbit (LEO) space radiation environment with perigee at 300 Km, apogee at 600Km altitude having different orbital inclinations to predict the reliability of onboard Bulk Built-In Current Sensor (BBICS) fabricated in 350nm technology node at OptMA Lab. UFMG Brazil. In this context, the various parameters for space radiation environment have been analyzed to characterize the ionizing radiation environment effects on proposed BBICS. The Space radiation environment has been modeled in the form of particles trapped in Van-Allen radiation belts(RBs), Energetic Solar Particles Events (ESPE) and Galactic Cosmic Rays (GCR) where as its potential effects on Device- Under-Test (DUT) has been predicted in terms of Total Ionizing Dose (TID), Single-Event Effects (SEE) and Displacement Damage Dose (DDD). Finally, the required mitigation techniques including necessary shielding requirements to avoid undesirable effects of radiation environment at device level has been estimated /determined with assumed standard thickness of Aluminum shielding. In order to evaluate space radiation environment and analyze energetic particles effects on BBICS, OMERE toolkit developed by TRAD was utilized.

  16. A review of the development of the application of micro-electronics in underground mining systems in the UK

    Energy Technology Data Exchange (ETDEWEB)

    Owen, D.

    1987-01-01

    The aim of this review is to contribute to a greater understanding of technological development for solving mining problems. The development is traced of some of the applications of microelectronics now in use in the UK mining industry. During the 1960s a 'systems view' of the mining industry emphasized the importance of the interdependence of the subsystems of the mining process. Several pioneering projects of the 1960s are described and the impact on the industry assessed. The limited success of these projects contributed to the shelving of full-mine integration by the end of the 1960s. Minicomputers were introduced in the 1970s and the National Coal Board (NCB) adopted a strategy of developing a standardised computer system for analysing and presenting data. Examples are given where information from such systems has resulted in more effective management action. Progress in current subsystems has resulted in a re-examination of full-mine integration and the introduction of a strategy for data communication which will enable information to be exchanged between subsystems. There is increasing awareness in the industry of the importance of data as an information resource that must be managed. 13 figs., 27 refs.

  17. Comparison of CREME (cosmic-ray effects on microelectronics) model LET (linear energy transfer) spaceflight dosimetry data

    Energy Technology Data Exchange (ETDEWEB)

    Letaw, J.R.; Adams, J.H.

    1986-07-15

    The galactic cosmic radiation (GCR) component of space radiation is the dominant cause of single-event phenomena in microelectronic circuits when Earth's magnetic shielding is low. Spaceflights outside the magnetosphere and in high inclination orbits are examples of such circumstances. In high-inclination orbits, low-energy (high LET) particles are transmitted through the field only at extreme latitudes, but can dominate the orbit-averaged dose. GCR is an important part of the radiation dose to astronauts under the same conditions. As a test of the CREME environmental model and particle transport codes used to estimate single event upsets, we have compiled existing measurements of HZE doses were compiled where GCR is expected to be important: Apollo 16 and 17, Skylab, Apollo Soyuz Test Project, and Kosmos 782. The LET spectra, due to direct ionization from GCR, for each of these missions has been estimated. The resulting comparisons with data validate the CREME model predictions of high-LET galactic cosmic-ray fluxes to within a factor of two. Some systematic differences between the model and data are identified.

  18. A novel patterning effect during high frequency laser micro-cutting of hard ceramics for microelectronics applications

    Energy Technology Data Exchange (ETDEWEB)

    Savriama, Guillaume, E-mail: guillaume.savriama@gmail.com [GREMI-UMR 7344, CNRS/Univ-Orléans, 14 rue d’Issoudun, BP 6744, F-45067 Orléans (France); STMicroelectronics, 10 rue Thalès de Milet, CS 97155, 37071 Tours Cedex 2 (France); Jarry, Vincent; Barreau, Laurent [STMicroelectronics, 10 rue Thalès de Milet, CS 97155, 37071 Tours Cedex 2 (France); Boulmer-Leborgne, Chantal; Semmar, Nadjib [GREMI-UMR 7344, CNRS/Univ-Orléans, 14 rue d’Issoudun, BP 6744, F-45067 Orléans (France)

    2014-05-01

    This paper investigates the laser micro-cutting of wide band gap materials for microelectronics industry purposes. An ultraviolet (355 nm) diode-pumped solid-state (DPSS) nanosecond laser was used in this investigation. The laser energy varied from 7 to 140 μJ/pulse with typical frequencies from 40 to 200 kHz. The effect of pulse energy and scanning speed on the depth of the cutting street of α-Al{sub 2}O{sub 3} and glass was studied. Typical depths of 200 μm were achieved on α-Al{sub 2}O{sub 3} for 140 μJ/pulse, 40 kHz at 13 mm/s. SEM images showed periodic patterns produced by periodic explosive boiling that can influence the achieved depth. The shape, size and periodicity of the recast material depended on the feed rate and the laser beam frequency. This periodic removal mechanism seems to be specific to dielectrics since it was not observed for semiconductors such as silicon or silicon carbide.

  19. Implementation of hierarchical design for manufacture rules in manufacturing processes

    OpenAIRE

    Parvez, Masud

    2008-01-01

    In order to shorten the product development cycle time, minimise overall cost and smooth transition into production, early consideration of manufacturing processes is important. Design for Manufacture (DFM) is the practice of designing products with manufacturing issues using an intelligent system, which translates 3D solid models into manufacturable features. Many existing and potential applications, particularly in the field of manufacturing, require various aspects of features technology. ...

  20. Ohio Advanced Energy Manufacturing Center

    Energy Technology Data Exchange (ETDEWEB)

    Kimberly Gibson; Mark Norfolk

    2012-07-30

    The program goal of the Ohio Advanced Energy Manufacturing Center (OAEMC) is to support advanced energy manufacturing and to create responsive manufacturing clusters that will support the production of advanced energy and energy-efficient products to help ensure the nation's energy and environmental security. This goal cuts across a number of existing industry segments critical to the nation's future. Many of the advanced energy businesses are starting to make the transition from technology development to commercial production. Historically, this transition from laboratory prototypes through initial production for early adopters to full production for mass markets has taken several years. Developing and implementing manufacturing technology to enable production at a price point the market will accept is a key step. Since these start-up operations are configured to advance the technology readiness of the core energy technology, they have neither the expertise nor the resources to address manufacturing readiness issues they encounter as the technology advances toward market entry. Given the economic realities of today's business environment, finding ways to accelerate this transition can make the difference between success and failure for a new product or business. The advanced energy industry touches a wide range of industry segments that are not accustomed to working together in complex supply chains to serve large markets such as automotive and construction. During its first three years, the Center has catalyzed the communication between companies and industry groups that serve the wide range of advanced energy markets. The Center has also found areas of common concern, and worked to help companies address these concerns on a segment or industry basis rather than having each company work to solve common problems individually. EWI worked with three industries through public-private partnerships to sew together disparate segments helping to promote

  1. Robust Manufacturing Control

    CERN Document Server

    2013-01-01

    This contributed volume collects research papers, presented at the CIRP Sponsored Conference Robust Manufacturing Control: Innovative and Interdisciplinary Approaches for Global Networks (RoMaC 2012, Jacobs University, Bremen, Germany, June 18th-20th 2012). These research papers present the latest developments and new ideas focusing on robust manufacturing control for global networks. Today, Global Production Networks (i.e. the nexus of interconnected material and information flows through which products and services are manufactured, assembled and distributed) are confronted with and expected to adapt to: sudden and unpredictable large-scale changes of important parameters which are occurring more and more frequently, event propagation in networks with high degree of interconnectivity which leads to unforeseen fluctuations, and non-equilibrium states which increasingly characterize daily business. These multi-scale changes deeply influence logistic target achievement and call for robust planning and control ...

  2. Heat Stress

    Science.gov (United States)

    ... Publications and Products Programs Contact NIOSH NIOSH HEAT STRESS Recommend on Facebook Tweet Share Compartir OSHA-NIOSH ... hot environments may be at risk of heat stress. Exposure to extreme heat can result in occupational ...

  3. Flexibility in fuel manufacturing

    International Nuclear Information System (INIS)

    Reparaz, A.; Stavig, W.E.; McLees, R.B.

    1987-01-01

    From its inception Exxon Nuclear has produced both BWR and PWR fuels. This is reflected in a product line that, to date, includes over 20 fuel designs. These range from 6x6 design at one end of the spectrum to the recently introduced 17x17 design. The benefits offered include close tailoring of the fuel design to match the customer's requirements, and the ability to rapidly introduce product changes, such as the axial blanket design, with a minimal impact on manufacturing. This flexibility places a number of demands on the manufacturing organization. Close interfaces must be established, and maintained, between the marketing, product design, manufacturing, purchasing and quality organizations, and the information flows must be immediate and accurate. Production schedules must be well planned and must be maintained or revised to reflect changing circumstances. Finally, the manufacturing facilities must be designed to allow rapid switchover between product designs with minor tooling changes and/or rerouting of product flows to alternate work stations. Among the tools used to manage the flow of information and to maintain the tight integration necessary between the various manufacturing, engineering and quality organizations is a commercially available, computerized planning and tracking system, AMAPS. A real-time production data collection system has been designed which gathers data from each production work station for use by the shop floor control module of AMAPS. Accuracy of input to the system is improved through extensive use of bar codes to gather information on the product as it moves through and between work stations. This computerized preparation of material tracing has an impact on direct manufacturing records, quality control records, nuclear material records and accounting and inventory records. This is of benefit to both Exxon Nuclear and its customers

  4. Diccionario Lean Manufacturing

    OpenAIRE

    Muñoz Ellner, Sarah María

    2016-01-01

    El Diccionario Bilingüe de Lean Manufacturing pretende ser un instrumento de apoyo a todo aquel que tenga la responsabilidad de planear, ejecutar o simplemente algún interés con las actividades de Lean Manufacturing, aportando así también conceptos claros tanto en castellano como en inglés, con el fin de entender de forma integral el alcance mismo que puede llegar a tener dicha filosofía, al igual que se proporcionara una serie de siglas y herramientas para la implementación del Lean Manufact...

  5. Developments in fuel manufacturing

    International Nuclear Information System (INIS)

    Williams, T.

    1997-01-01

    BNFL has a long tradition of willingness to embrace technological challenge and a dedication to quality. This paper describes advances in the overall manufacturing philosophy at BNFL's Fuel Business Group and then covers how some new technologies are currently being employed in BNFL Fuel Business Group's flagship oxide complex (OFC), which is currently in its final stages of commissioning. This plant represents a total investment of some Pound 200 million. This paper also describes how these technologies are also being deployed in BNFL's MOX plant now being built at Sellafield and, finally, covers some new processes being developed for advanced fuel manufacture. (author)

  6. Manufacturing development of low activation vanadium alloys

    International Nuclear Information System (INIS)

    Smith, J.P.; Johnson, W.R.; Baxi, C.B.

    1996-10-01

    General Atomics is developing manufacturing methods for vanadium alloys as part of a program to encourage the development of low activation alloys for fusion use. The culmination of the program is the fabrication and installation of a vanadium alloy structure in the DIII-D tokamak as part of the Radiative Divertor modification. Water-cooled vanadium alloy components will comprise a portion of the new upper divertor structure. The first step, procuring the material for this program has been completed. The largest heat of vanadium alloy made to date, 1200 kg of V-4Cr-4Ti, has been produced and is being converted into various product forms. Results of many tests on the material during the manufacturing process are reported. Research into potential fabrication methods has been and continues to be performed along with the assessment of manufacturing processes particularly in the area of joining. Joining of vanadium alloys has been identified as the most critical fabrication issue for their use in the Radiative Divertor Program. Joining processes under evaluation include resistance seam, electrodischarge (stud), friction and electron beam welding. Results of welding tests are reported. Metallography and mechanical tests are used to evaluate the weld samples. The need for a protective atmosphere during different welding processes is also being determined. General Atomics has also designed, manufactured, and will be testing a helium-cooled, high heat flux component to assess the use of helium cooled vanadium alloy components for advanced tokamak systems. The component is made from vanadium alloy tubing, machined to enhance the heat transfer characteristics, and joined to end flanges to allow connection to the helium supply. Results are reported

  7. Indigenous Manufacturing realization of TWIN Source

    Science.gov (United States)

    Pandey, R.; Bandyopadhyay, M.; Parmar, D.; Yadav, R.; Tyagi, H.; Soni, J.; Shishangiya, H.; Sudhir Kumar, D.; Shah, S.; Bansal, G.; Pandya, K.; Parmar, K.; Vuppugalla, M.; Gahlaut, A.; Chakraborty, A.

    2017-04-01

    TWIN source is two RF driver based negative ion source that has been planned to bridge the gap between single driver based ROBIN source (currently operational) and eight river based DNB source (to be operated under IN-TF test facility). TWIN source experiments have been planned at IPR keeping the objective of long term domestic fusion programme to gain operational experiences on vacuum immersed multi driver RF based negative ion source. High vacuum compatible components of twin source are designed at IPR keeping an aim on indigenous built in attempt. These components of TWIN source are mainly stainless steel and OFC-Cu. Being high heat flux receiving components, one of the major functional requirements is continuous heat removal via water as cooling medium. Hence for the purpose stainless steel parts are provided with externally milled cooling lines and that shall be covered with a layer of OFC-cu which would be on the receiving side of high heat flux. Manufacturability of twin source components requires joining of these dissimilar materials via process like electrode position, electron beam welding and vacuum brazing. Any of these manufacturing processes shall give a vacuum tight joint having proper joint strength at operating temperature and pressure. Taking the indigenous development effort vacuum brazing (in non-nuclear environment) has been opted for joining of dissimilar materials of twin source being one of the most reliable joining techniques and commercially feasible across the suppliers of country. Manufacturing design improvisation for the components has been done to suit the vacuum brazing process requirement and to ease some of the machining without comprising over the functional and operational requirements. This paper illustrates the details on the indigenous development effort, design improvisation to suits manufacturability, vacuum brazing basics and its procedures for twin source components.

  8. SURFACE ENGINEERING FOR PARTS MADE BY ADDITIVE MANUFACTURING

    OpenAIRE

    Nutal, Nicolas; Rochus, Pierre; Collette, Jean-Paul; Crahay, Jean; Larnicol, Maiween; Jochem, Helen; Magnien, Julien; Masse, Christian; Rigo, Olivier; Vanhumbeeck, Jean-François; Pambaguian, Laurent

    2015-01-01

    the surface preparation of metal parts made by additive manufacturing (AM). AM is a technology of choice for manufacturing of parts with complex shapes (heat exchangers, RF supports, optical parts…) and integrated functions such as conformal cooling channels, clips, hinges, etc. This opens the door for lightweight parts which are of prime importance for space applications. The potential of the AM technologies is however impeded by the quite rough surface finish that is observed on the as-m...

  9. Intensification of Evaporation and Condensation Processes in Heat Exchange Apparatus

    Directory of Open Access Journals (Sweden)

    L. L. Vasiliev

    2005-01-01

    Full Text Available The paper describes proposed design solutions for an intensification of heat transfer in evaporation and condensation heat exchangers. Complex experimental research of heat and mass transfer processes in flat and round cross-section miniature heat pipes is carried out. Optimization, development, manufacturing and an experimental investigation of copper miniature heat pipes with sintered powder are executed. Investigation results of capillary-porous structure properties that are used in evaporation and condensation heat-exchange apparatus are presented.

  10. A Taxonomy of Manufacturing Strategies

    OpenAIRE

    Jeffrey G. Miller; Aleda V. Roth

    1994-01-01

    This paper describes the development and analysis of a numerical taxonomy of manufacturing strategies. The taxonomy was developed with standard methods of cluster analysis, and is based on the relative importance attached to eleven competitive capabilities defining the manufacturing task of 164 large American manufacturing business units. Three distinct clusters of manufacturing strategy groups were observed. Though there is an industry effect, all three manufacturing strategy types are obser...

  11. Transfer of manufacturing units

    DEFF Research Database (Denmark)

    Madsen, Erik Skov; Riis, Jens Ove; Sørensen, Brian Vejrum

    2008-01-01

    The ongoing and unfolding relocation of activities is one of the major trends, that calls for attention in the domain of operations management. In particular, prescriptive models outlining: stages of the process, where to locate, and how to establish the new facilities have been studied, while...... and dilemmas to be addressed when transferring manufacturing units....

  12. Reusing Old Manufacturing Buildings

    Science.gov (United States)

    Roman, Harry T.

    2014-01-01

    This article presents an interesting design challenge for students, one that will certainly let them integrate subject matter and get a sense of pride for doing something useful in their own community. The author would be willing to bet that the average town or city has some old red brick manufacturing building(s) that have seen much better days.…

  13. Virtual manufacturing in reality

    Science.gov (United States)

    Papstel, Jyri; Saks, Alo

    2000-10-01

    SMEs play an important role in manufacturing industry. But from time to time there is a shortage in resources to complete the particular order in time. Number of systems is introduced to produce digital information in order to support product and process development activities. Main problem is lack of opportunity for direct data transition within design system modules when needed temporary extension of design capacity (virtuality) or to implement integrated concurrent product development principles. The planning experience in the field is weakly used as well. The concept of virtual manufacturing is a supporting idea to solve this problem. At the same time a number of practical problems should be solved like information conformity, data transfer, unified technological concepts acceptation etc. In the present paper the proposed ways to solve the practical problems of virtual manufacturing are described. General objective is to introduce the knowledge-based CAPP system as missing module for Virtual Manufacturing in the selected product domain. Surface-centered planning concept based on STEP- based modeling principles, and knowledge-based process planning methodology will be used to gain the objectives. As a result the planning module supplied by design data with direct access, and supporting advising environment is expected. Mould producing SME would be as test basis.

  14. Tolerances in micro manufacturing

    DEFF Research Database (Denmark)

    Hansen, Hans Nørgaard; Zhang, Yang; Islam, Aminul

    This paper describes a method for analysis of tolerances in micro manufacturing. It proposes a mapping oftolerances to dimensions and compares this with current available international standards. The analysisdocuments that tolerances are not scaled down as the absolute dimension. In practice...

  15. Cladding tube manufacturing technology

    International Nuclear Information System (INIS)

    Hahn, R.; Jeong, Y. H.; Baek, B. J.; Kim, K. H.; Kim, S. J.; Choi, B. K.; Kim, J. M.

    1999-04-01

    This report gives an overview of the manufacturing routine of PWR cladding tubes. The routine essentially consists of a series of deformation and annealing processes which are necessary to transform the ingot geometry to tube dimensions. By changing shape, microstructure and structure-related properties are altered simultaneously. First, a short overview of the basics of that part of deformation geometry is given which is related to tube reducing operations. Then those processes of the manufacturing routine which change the microstructure are depicted, and the influence of certain process parameters on microstructure and material properties are shown. The influence of the resulting microstructure on material properties is not discussed in detail, since it is described in my previous report A lloy Development for High Burnup Cladding . Because of their paramount importance still up to now, and because manufacturing data and their influence on properties for other alloys are not so well established or published, the descriptions are mostly related to Zry4 tube manufacturing, and are only in short for other alloys. (author). 9 refs., 46 figs

  16. Nuclear fuel manufacture

    International Nuclear Information System (INIS)

    Costello, J.M.

    1980-09-01

    The technologies used to manufacture nuclear fuel from uranium ore are outlined, with particular reference to the light water reactor fuel cycle. Capital and operating cost estimates for the processing stages are given, and the relevance to a developing uranium industry in Australia is discussed

  17. Manufacturing and Merchandising Careers

    Science.gov (United States)

    Ryan, Peter J.; And Others

    1977-01-01

    Anyone with a flair for business, product development, or promotion might consider a manufacturing or merchandising occupation. The music industry offers many career opportunities for administrators, salespersons, marketing specialists--the record industry offers positions from promotion manager to rack jobber. Describes instrument company…

  18. Manufacturing in Denmark

    DEFF Research Database (Denmark)

    Hansen, Johannes; Boer, Henrike Engele Elisabeth; Boer, Harry

    This report compares the manufacturing strategies, practices, performances and improvement activities of 39 companies that are representative for the Danish assembly industry with those of 804 companies from 19 other countries. The data supporting this report were collected in 2013 and concern...

  19. Competitive Manufacturing Dynamics

    DEFF Research Database (Denmark)

    Rymaszewska, Anna; Christensen, Irene; Karlsson, Christer

    to constantly improve this process in terms of time to volume, according to predefined cost and quality measures. The importance of the success of this process can lead to a significant creation of competitive advantage. This paper addresses the challenges of the manufacturing ramp-up process in the context...

  20. Cladding tube manufacturing technology

    Energy Technology Data Exchange (ETDEWEB)

    Hahn, R. [Kraftwerk Union AG, Mulheim (Germany); Jeong, Y.H.; Baek, B.J.; Kim, K.H.; Kim, S.J.; Choi, B.K.; Kim, J.M. [Korea Atomic Energy Research Institute, Taejon (Korea, Republic of)

    1999-04-01

    This report gives an overview of the manufacturing routine of PWR cladding tubes. The routine essentially consists of a series of deformation and annealing processes which are necessary to transform the ingot geometry to tube dimensions. By changing shape, microstructure and structure-related properties are altered simultaneously. First, a short overview of the basics of that part of deformation geometry is given which is related to tube reducing operations. Then those processes of the manufacturing routine which change the microstructure are depicted, and the influence of certain process parameters on microstructure and material properties are shown. The influence of the resulting microstructure on material properties is not discussed in detail, since it is described in my previous report 'Alloy Development for High Burnup Cladding.' Because of their paramount importance still up to now, and because manufacturing data and their influence on properties for other alloys are not so well established or published, the descriptions are mostly related to Zry4 tube manufacturing, and are only in short for other alloys. (author). 9 refs., 46 figs.

  1. Turbine airfoil manufacturing technology

    Energy Technology Data Exchange (ETDEWEB)

    Kortovich, C. [PCC Airfoils, Inc., Beachwood, OH (United States)

    1995-12-31

    The specific goal of this program is to define manufacturing methods that will allow single crystal technology to be applied to complex-cored airfoils components for power generation applications. Tasks addressed include: alloy melt practice to reduce the sulfur content; improvement of casting process; core materials design; and grain orientation control.

  2. Drug development and manufacturing

    Science.gov (United States)

    Warner, Benjamin P.; McCleskey, T. Mark; Burrell, Anthony K.

    2015-10-13

    X-ray fluorescence (XRF) spectrometry has been used for detecting binding events and measuring binding selectivities between chemicals and receptors. XRF may also be used for estimating the therapeutic index of a chemical, for estimating the binding selectivity of a chemical versus chemical analogs, for measuring post-translational modifications of proteins, and for drug manufacturing.

  3. Manufacturing method for parts opposed to plasmas and manufacturing device therefor

    International Nuclear Information System (INIS)

    Fuse, Toshiaki; Tachikawa, Nobuo.

    1995-01-01

    The present invention provides a method of and a device for manufacturing heat insulation parts which are opposed to plasmas, such as parts in the inside of a thermonuclear reactor, which less suffer from defects such as crackings and peelings in the vicinity of the joining portion of the parts. Namely, when an armour and a heat sink are cooled to a room temperature after joining them, the upper surface of the armour and the bottom of the heat sink are pressurized. Then after restricting the convex deformation at the upper surface of the armour and the concave deformation at the bottom of the heat sink, the heat sink bottom are extended at from 600degC to a room temperature or at a room temperature. When a heat resistant material with a small heat expansion coefficient is joined with a cooling material with a large heat expansion coefficient and then cooled, deformation and residual stresses are generated by the difference of the shrinking amount. But deformation and the residual stresses can be reduced by gradually cooling them while restricting them by using a joining device compared with a case of not restricting them. As a result, occurrence of crackings and peelings in the vicinity of the joining portion can be prevented. (I.S.)

  4. Determination of acrylamide in Chinese traditional carbohydrate-rich foods using gas chromatography with micro-electron capture detector and isotope dilution liquid chromatography combined with electrospray ionization tandem mass spectrometry

    International Nuclear Information System (INIS)

    Zhang Yu; Ren Yiping; Zhao Hangmei; Zhang Ying

    2007-01-01

    The present study developed two analytical methods for quantification of acrylamide in complex food matrixes, such as Chinese traditional carbohydrate-rich foods. One is based on derivatization with potassium bromate and potassium bromide without clean-up prior to gas chromatography with micro-electron capture detector (GC-MECD). Alternatively, the underivatized acrylamide was detected by high-performance liquid chromatography coupled to quadrupole tandem mass spectrometry (HPLC-MS/MS) in the positive electrospray ionization mode. For both methods, the Chinese carbohydrate-rich samples were homogenized, defatted with petroleum ether and extracted with aqueous solution of sodium chloride. Recovery rates for acrylamide from spiked Chinese style foods with the spiking level of 50, 500 and 1000 μg kg -1 were in the range of 79-93% for the GC-MECD including derivatization and 84-97% for the HPLC-MS/MS method. Typical quantification limits of the HPLC-MSMS method were 4 μg kg -1 for acrylamide. The GC-MECD method achieved quantification limits of 10 μg kg -1 in Chinese style foods. Thirty-eight Chinese traditional foods purchased from different manufacturers were analyzed and compared with four Western style foods. Acrylamide contaminant was found in all of samples at the concentration up to 771.1 and 734.5 μg kg -1 detected by the GC and HPLC method, respectively. The concentrations determined with the two different quantitative methods corresponded well with each other. A convenient and fast pretreatment procedure will be optimized in order to satisfy further investigation of hundreds of samples

  5. Laser assisted hybrid additive manufacturing of thermoelectric modules

    Science.gov (United States)

    Zhang, Tao; Tewolde, Mahder; Longtin, Jon P.; Hwang, David J.

    2017-02-01

    Thermoelectric generators (TEGs) are an attractive means to produce electricity, particular from waste heat applications. However, TEGs are almost exclusively manufactured as flat, rigid modules of limited size and shape, and therefore an appropriate mounting for intimate contact of TEGs modules onto arbitrary surfaces represents a significant challenge. In this study, we introduce laser assisted additive manufacturing method to produce multi-layered thermoelectric generator device directly on flat and non-flat surfaces for waste heat recovery. The laser assisted processing spans from laser scribing of thermal sprayed thin films, curing of dispensed thermoelectric inks and selective laser sintering to functionalize thermoelectric materials.

  6. Examination of material manufactured by direct metal laser sintering (DMLS

    Directory of Open Access Journals (Sweden)

    J. Dobránsky

    2015-07-01

    Full Text Available This article is concerned with assessing microstructural properties of metal component manufactured by additive DMLS technology. Two series of samples were assessed. The first one was manufactured without heat treatment. Samples in the second series were treated with heat in order to assess increase in hardness and influence on modification of microstructure. Subsequently, values of hardness were measured by Vickers Hardness Test and modification of microstructure was observed by optical microscope. Evaluations were carried out in three planes in order to assess the differences in layering of material during its processing. Differences in values of hardness and microstructural components were discovered by examination of changes in three planes.

  7. Large-scale solar heating

    Energy Technology Data Exchange (ETDEWEB)

    Tolonen, J.; Konttinen, P.; Lund, P. [Helsinki Univ. of Technology, Otaniemi (Finland). Advanced Energy Systems

    1998-10-01

    Solar heating market is growing in many European countries and annually installed collector area has exceeded one million square meters. There are dozens of collector manufacturers and hundreds of firms making solar heating installations in Europe. One tendency in solar heating is towards larger systems. These can be roof integrated, consisting of some tens or hundreds of square meters of collectors, or they can be larger centralized solar district heating plants consisting of a few thousand square meters of collectors. The increase of size can reduce the specific investments of solar heating systems, because e.g. the costs of some components (controllers, pumps, and pipes), planning and installation can be smaller in larger systems. The solar heat output can also be higher in large systems, because more advanced technique is economically viable

  8. High heat flux facility GLADIS

    International Nuclear Information System (INIS)

    Greuner, H.; Boeswirth, B.; Boscary, J.; McNeely, P.

    2007-01-01

    The new ion beam facility GLADIS started the operation at IPP Garching. The facility is equipped with two individual 1.1 MW power ion sources for testing actively cooled plasma facing components under high heat fluxes. Each ion source generates heat loads between 3 and 55 MW/m 2 with a beam diameter of 70 mm at the target position. These parameters allow effective testing from probes to large components up to 2 m length. The high heat flux allows the target to be installed inclined to the beam and thus increases the heated surface length up to 200 mm for a heat flux of 15 MW/m 2 in the standard operating regime. Thus the facility has the potential capability for testing of full scale ITER divertor targets. Heat load tests on the WENDELSTEIN 7-X pre-series divertor targets have been successfully started. These tests will validate the design and manufacturing for the production of 950 elements

  9. Heat exchanger leakage problem location

    Directory of Open Access Journals (Sweden)

    Jícha Miroslav

    2012-04-01

    Full Text Available Recent compact heat exchangers are very often assembled from numerous parts joined together to separate heat transfer fluids and to form the required heat exchanger arrangement. Therefore, the leak tightness is very important property of the compact heat exchangers. Although, the compact heat exchangers have been produced for many years, there are still technological problems associated with manufacturing of the ideal connection between the individual parts, mainly encountered with special purpose heat exchangers, e.g. gas turbine recuperators. This paper describes a procedure used to identify the leakage location inside the prime surface gas turbine recuperator. For this purpose, an analytical model of the leaky gas turbine recuperator was created to assess its performance. The results obtained are compared with the experimental data which were acquired during the recuperator thermal performance analysis. The differences between these two data sets are used to indicate possible leakage areas.

  10. Surface texture measurement for additive manufacturing

    Science.gov (United States)

    Triantaphyllou, Andrew; Giusca, Claudiu L.; Macaulay, Gavin D.; Roerig, Felix; Hoebel, Matthias; Leach, Richard K.; Tomita, Ben; Milne, Katherine A.

    2015-06-01

    The surface texture of additively manufactured metallic surfaces made by powder bed methods is affected by a number of factors, including the powder’s particle size distribution, the effect of the heat source, the thickness of the printed layers, the angle of the surface relative to the horizontal build bed and the effect of any post processing/finishing. The aim of the research reported here is to understand the way these surfaces should be measured in order to characterise them. In published research to date, the surface texture is generally reported as an Ra value, measured across the lay. The appropriateness of this method for such surfaces is investigated here. A preliminary investigation was carried out on two additive manufacturing processes—selective laser melting (SLM) and electron beam melting (EBM)—focusing on the effect of build angle and post processing. The surfaces were measured using both tactile and optical methods and a range of profile and areal parameters were reported. Test coupons were manufactured at four angles relative to the horizontal plane of the powder bed using both SLM and EBM. The effect of lay—caused by the layered nature of the manufacturing process—was investigated, as was the required sample area for optical measurements. The surfaces were also measured before and after grit blasting.

  11. Surface texture measurement for additive manufacturing

    International Nuclear Information System (INIS)

    Triantaphyllou, Andrew; Tomita, Ben; Milne, Katherine A; Giusca, Claudiu L; Macaulay, Gavin D; Roerig, Felix; Hoebel, Matthias; Leach, Richard K

    2015-01-01

    The surface texture of additively manufactured metallic surfaces made by powder bed methods is affected by a number of factors, including the powder’s particle size distribution, the effect of the heat source, the thickness of the printed layers, the angle of the surface relative to the horizontal build bed and the effect of any post processing/finishing. The aim of the research reported here is to understand the way these surfaces should be measured in order to characterise them. In published research to date, the surface texture is generally reported as an Ra value, measured across the lay. The appropriateness of this method for such surfaces is investigated here. A preliminary investigation was carried out on two additive manufacturing processes—selective laser melting (SLM) and electron beam melting (EBM)—focusing on the effect of build angle and post processing. The surfaces were measured using both tactile and optical methods and a range of profile and areal parameters were reported. Test coupons were manufactured at four angles relative to the horizontal plane of the powder bed using both SLM and EBM. The effect of lay—caused by the layered nature of the manufacturing process—was investigated, as was the required sample area for optical measurements. The surfaces were also measured before and after grit blasting. (paper)

  12. Micro-manufacturing: design and manufacturing of micro-products

    National Research Council Canada - National Science Library

    Koç, Muammer; Özel, Tuğrul

    2011-01-01

    .... After addressing the fundamentals and non-metallic-based micro-manufacturing processes in the semiconductor industry, it goes on to address specific metallic-based micro-manufacturing processes...

  13. Reconfigurable manufacturing system for agile mass customization manufacturing

    CSIR Research Space (South Africa)

    Xing, B

    2006-07-01

    Full Text Available Manufacturing companies are facing three challenges: low cost production of product, high quality standard and rapid responsiveness to customer requirements. These three goals are equally important for the manufacturing companies who want...

  14. Increase of manufacturability of manufacturing of difficult profile details

    Directory of Open Access Journals (Sweden)

    О.Ye. Semenovskiy

    2017-12-01

    Full Text Available The analysis of existing problems arising in the process of manufacturing such complex profile parts as gears is carried out. The possible ways of simplifying the technological processes with the aim of improving the economic performance of production, as well as reducing the defect are defined. The carried out researches of influence of chemical composition of steel, its structural parameters on technological characteristics. The choice of compositions of the chemical composition of steel with the optimal ratio of physical-mechanical and technological characteristics is substantiated. The causes of deformation of parts in the process of heat treatment are established. The developed criteria for estimating this value. At the same time, the task of not only qualitative but also quantitative evaluation of such technological properties as the propensity of steels to deformation in the course of chemical-thermal treatment is solved, with the aim of introducing a single characteristic that determines the tendency of the steel to deform during hardening. Reducing the propensity of steel to deformation allowed to increase the economic performance of production by reducing the number of finishing operations.

  15. Design and application of reconfigurable manufacturing systems in agile mass customization manufacturing environment.

    CSIR Research Space (South Africa)

    Xing, B

    2007-05-01

    Full Text Available processes. Many manufacturing techniques are based on the principles of Flexible Manufacturing and Dedicated Manufacturing for mass production. Reconfigurable Manufacturing System, (RMS), is a manufacturing system that can provide for Agile Manufacturing...

  16. Robot skills for manufacturing

    DEFF Research Database (Denmark)

    Pedersen, Mikkel Rath; Nalpantidis, Lazaros; Andersen, Rasmus Skovgaard

    2016-01-01

    -asserting robot skills for manufacturing. We show how a relatively small set of skills are derived from current factory worker instructions, and how these can be transferred to industrial mobile manipulators. General robot skills can not only be implemented on these robots, but also be intuitively concatenated...... products are introduced by manufacturers. In order to compete on global markets, the factories of tomorrow need complete production lines, including automation technologies that can effortlessly be reconfigured or repurposed, when the need arises. In this paper we present the concept of general, self...... in running production facilities at an industrial partner. It follows from these experiments that the use of robot skills, and associated task-level programming framework, is a viable solution to introducing robots that can intuitively and on the fly be programmed to perform new tasks by factory workers....

  17. Additive manufacturing of metals

    International Nuclear Information System (INIS)

    Herzog, Dirk; Seyda, Vanessa; Wycisk, Eric; Emmelmann, Claus

    2016-01-01

    Additive Manufacturing (AM), the layer-by layer build-up of parts, has lately become an option for serial production. Today, several metallic materials including the important engineering materials steel, aluminium and titanium may be processed to full dense parts with outstanding properties. In this context, the present overview article describes the complex relationship between AM processes, microstructure and resulting properties for metals. It explains the fundamentals of Laser Beam Melting, Electron Beam Melting and Laser Metal Deposition, and introduces the commercially available materials for the different processes. Thereafter, typical microstructures for additively manufactured steel, aluminium and titanium are presented. Special attention is paid to AM specific grain structures, resulting from the complex thermal cycle and high cooling rates. The properties evolving as a consequence of the microstructure are elaborated under static and dynamic loading. According to these properties, typical applications are presented for the materials and methods for conclusion.

  18. The manufacturers' viewpoint

    International Nuclear Information System (INIS)

    Davis, D.A.

    1986-01-01

    This paper describes the approach by six separate manufacturers to the problem of availability from their particular view point. This presentation demonstrates basic strategy: attention to high reliability at the design phase, based on positive and detailed feedback from existing plant; quality assurance at the production stage which has been planned into the production process in the form of a Q.A. manual in design; sophisticated test procedures and facilities; simplicity of design with high accuracy in production; provision of a clear operational maintenance manual, etc. The manufacturers agreed on the need to make a conscious commitment to design for high availability, taking into account both initial and ongoing operating costs in life cycle cost assessment. Predictability, reliability, maintainability, efficiency, market acceptability and maintenance support based on high quality feedback between operator and supplier were all stressed on the grounds that prevention is always better than cure

  19. Northwest Manufacturing Initiative

    Science.gov (United States)

    2014-07-31

    biodegradable wipes, and bags. The gStyle clothing line consists of various types of stylish clothes for babies. All gDiapers are plastic free...offers recycling services for industrial plastics and non-serviceable containers. Industrial plastics include pails, buckets, pallets, plastic film, and...manufacturer, now recycle used soda bottles, unusable second quality fabrics and worn out garments into polyester fibers to produce many of their clothes

  20. Rapid manufacturing for microfluidics

    CSIR Research Space (South Africa)

    Land, K

    2012-10-01

    Full Text Available for microfluidics K. LAND, S. HUGO, M MBANJWA, L FOURIE CSIR Materials Science and Manufacturing P O Box 395, Pretoria 0001, SOUTH AFRICA Email: kland@csir.co.za INTRODUCTION Microfluidics refers to the manipulation of very small volumes of fluid.... Microfluidics is at the forefront of developing solutions for drug discovery, diagnostics (from glucose tests to malaria and TB testing) and environmental diagnostics (E-coli monitoring of drinking water). In order to quickly implement new designs, a rapid...

  1. Northwest Manufacturing Initiative

    Science.gov (United States)

    2013-08-31

    Kadali R. Talla R. Hugo T. Russell A. Thoreson E. Porgharibshahishahrebabak Dae-wook Kim Ellen A. Fuller J. Rick Evans 5d. PROJECT NUMBER...Manufacturing (CIM) Cell .................................................................................. 8 Hurricane 130W Laser Cutter/Engraver (48” X 36...Miniature Prototype Warehouse Application using Imaging Source and RoboRealm® 3. Hurricane 130W Laser Cutter/Engraver (48” X 36”) a. Rapid

  2. Technology for Manufacturing Efficiency

    Science.gov (United States)

    1995-01-01

    The Ground Processing Scheduling System (GPSS) was developed by Ames Research Center, Kennedy Space Center and divisions of the Lockheed Company to maintain the scheduling for preparing a Space Shuttle Orbiter for a mission. Red Pepper Software Company, now part of PeopleSoft, Inc., commercialized the software as their ResponseAgent product line. The software enables users to monitor manufacturing variables, report issues and develop solutions to existing problems.

  3. Advances in Additive Manufacturing

    Science.gov (United States)

    2016-07-14

    with a collection of information if it does not display a currently valid OMB control number. PLEASE DO NOT RETURN YOUR FORM TO THE ABOVE ADDRESS...Hamilton • Beth Bimber Air Force Research Laboratory, Metals Branch • Eddie Schwalbach • Mike Groeber • Benjamin Leever • James Hardin...conducting more in-field, or point-of-need, manufacturing than ever before. Other areas of concentration include man- machine interface, capabilities

  4. Additive manufacturing for steels: a review

    Science.gov (United States)

    Zadi-Maad, A.; Rohib, R.; Irawan, A.

    2018-01-01

    Additive manufacturing (AM) of steels involves the layer by layer consolidation of powder or wire feedstock using a heating beam to form near net shape products. For the past decades, the AM technique reaches the maturation of both research grade and commercial production due to significant research work from academic, government and industrial research organization worldwide. AM process has been implemented to replace the conventional process of steel fabrication due to its potentially lower cost and flexibility manufacturing. This paper provides a review of previous research related to the AM methods followed by current challenges issues. The relationship between microstructure, mechanical properties, and process parameters will be discussed. Future trends and recommendation for further works are also provided.

  5. Seal Apparatus and Methods to Manufacture Thereof

    Science.gov (United States)

    Richard, James A. (Inventor)

    2013-01-01

    In some implementations, apparatus and methods are provided through which a dynamic cryogenic seal is manufactured. In some implementations, the seal includes a retainer and a spring-seal assembly, the assembly being comprised of a main spring housing and fluorine-containing polymer seals. In some implementations, either a radial seal, or an axial (or "piston seal") is provided. In some implementations, methods of manufacturing the dynamic cryogenic seal are also provided. In some implementations, the methods include assembling the components while either heated or cooled, taking advantage of thermal expansion and contraction, such that there is a strong interference fit between the components at room temperature. In some implementations, this process ensures that the weaker fluorine-containing polymer seal is forced to expand and contract with the stronger retainer and spring and is under constant preload. In some implementations, the fluorine-containing polymer is therefore fluidized and retained, and can not lift off.

  6. Heat Transfer Enhancement by Finned Heat Sinks with Micro-structured Roughness

    Science.gov (United States)

    Ventola, L.; Chiavazzo, E.; Calignano, F.; Manfredi, D.; Asinari, P.

    2014-04-01

    We investigated the benefits of micro-structured roughness on heat transfer performance of heat sinks, cooled by forced air. Heat sinks in aluminum alloy by direct metal laser sintering (DMLS) manufacturing technique were fabricated; values of the average surface roughness Ra from 1 to 25 microns (standard milling leads to roughness around 1 micron) under turbulent regimes (Reynolds number based on heating edge from 3000 to 17000) have been explored. An enhancement of 50% in thermal performances with regards to standard manufacturing was observed. This may open the way for huge boost in the technology of electronic cooling by DMLS.

  7. Heat transfer enhancement by finned heat sinks with micro-structured roughness

    International Nuclear Information System (INIS)

    Ventola, L; Chiavazzo, E; Asinari, P; Calignano, F; Manfredi, D

    2014-01-01

    We investigated the benefits of micro-structured roughness on heat transfer performance of heat sinks, cooled by forced air. Heat sinks in aluminum alloy by direct metal laser sintering (DMLS) manufacturing technique were fabricated; values of the average surface roughness R a from 1 to 25 microns (standard milling leads to roughness around 1 micron) under turbulent regimes (Reynolds number based on heating edge from 3000 to 17000) have been explored. An enhancement of 50% in thermal performances with regards to standard manufacturing was observed. This may open the way for huge boost in the technology of electronic cooling by DMLS.

  8. Procedure and equipment for continuous manufacture of solutions

    International Nuclear Information System (INIS)

    Stiefel, M.

    1979-01-01

    In order to manufacture boric acid solution for reactor commissioning, the heated water is divided into a main and subsidiary flow, and the total amount of the salt is added to the subsidiary flow. Mixing of the main flow with the salt-containing subsidiary flow takes place on a mixing column. Undissolved salt is removed in a hydro-cyclotron. Preheating of the water takes place in a recuperator heat exchanger and a through boiler provides the final temperatures. (HK) [de

  9. Advanced manufacturing: Technology diffusion

    Energy Technology Data Exchange (ETDEWEB)

    Tesar, A.

    1995-12-01

    In this paper we examine how manufacturing technology diffuses rom the developers of technology across national borders to those who do not have the capability or resources to develop advanced technology on their own. None of the wide variety of technology diffusion mechanisms discussed in this paper are new, yet the opportunities to apply these mechanisms are growing. A dramatic increase in technology diffusion occurred over the last decade. The two major trends which probably drive this increase are a worldwide inclination towards ``freer`` markets and diminishing isolation. Technology is most rapidly diffusing from the US In fact, the US is supplying technology for the rest of the world. The value of the technology supplied by the US more than doubled from 1985 to 1992 (see the Introduction for details). History shows us that technology diffusion is inevitable. It is the rates at which technologies diffuse to other countries which can vary considerably. Manufacturers in these countries are increasingly able to absorb technology. Their manufacturing efficiency is expected to progress as technology becomes increasingly available and utilized.

  10. Fuel manufacturing and utilization

    International Nuclear Information System (INIS)

    2005-01-01

    The efficient utilisation of nuclear fuel requires manufacturing facilities capable of making advanced fuel types, with appropriate quality control. Once made, the use of such fuels requires a proper understanding of their behaviour in the reactor environment, so that safe operation for the design life can be achieved. The International Atomic Energy Agency supports Member States to improve in-pile fuel performance and management of materials; and to develop advanced fuel technologies for ensuring reliability and economic efficiency of the nuclear fuel cycle. It provides assistance to Member States to support fuel-manufacturing capability, including quality assurance techniques, optimization of manufacturing parameters and radiation protection. The IAEA supports the development fuel modelling expertise in Member States, covering both normal operation and postulated and severe accident conditions. It provides information and support for the operation of Nuclear Power Plant to ensure that the environment and water chemistry is appropriate for fuel operation. The IAEA supports fuel failure investigations, including equipment for failed fuel detection and for post-irradiation examination and inspection, as well as fuel repair, it provides information and support research into the basic properties of fuel materials, including UO 2 , MOX and zirconium alloys. It further offers guidance on the relationship with back-end requirement (interim storage, transport, reprocessing, disposal), fuel utilization and management, MOX fuels, alternative fuels and advanced fuel technology

  11. Manufacturing method for radioactive material containing vessel

    International Nuclear Information System (INIS)

    Nishioka, Hideharu; Matsushita, Kazuo; Toyota, Michinori.

    1997-01-01

    Lead homogenization is applied on the inner surface of a space formed between an inner cylinder and an outer cylinder, and a molten lead heated to about 400 to 500degC is cast into a space formed between the inner cylinder and the outer cylinder in a state where the inner and the outer cylinders are heated to from 200 to 300degC. The space formed between the inner cylinder and the outer cylinder is heated to and kept at 330degC or higher for at least 2minutes after the casting of the molten lead, and then it is cooled. Thus, lowering of density of the molten lead due to excess elevation of temperature or dropping of the lead at the homogenization portion by heating the inner and the outer cylinders to an excessively high temperature are not caused. In addition, formation of gaps in the boundary between the inner cylinder and the outer cylinder or between the lead of the homogenized portion and that of the cast portion due to the melting of the lead of the homogenized portion in the space is prevented reliably thereby capable of forming a satisfactory shielding member. Then, even when the thickness of the inner cylinder and the outer cylinder is large, radioactive material containing vessel excellent in heat releasing property and radiation shielding property can be manufactured. (N.H.)

  12. Sustainable Micro-Manufacturing of Micro-Components via Micro Electrical Discharge Machining

    Directory of Open Access Journals (Sweden)

    Valeria Marrocco

    2011-12-01

    Full Text Available Micro-manufacturing emerged in the last years as a new engineering area with the potential of increasing peoples’ quality of life through the production of innovative micro-devices to be used, for example, in the biomedical, micro-electronics or telecommunication sectors. The possibility to decrease the energy consumption makes the micro-manufacturing extremely appealing in terms of environmental protection. However, despite this common belief that the micro-scale implies a higher sustainability compared to traditional manufacturing processes, recent research shows that some factors can make micro-manufacturing processes not as sustainable as expected. In particular, the use of rare raw materials and the need of higher purity of processes, to preserve product quality and manufacturing equipment, can be a source for additional environmental burden and process costs. Consequently, research is needed to optimize micro-manufacturing processes in order to guarantee the minimum consumption of raw materials, consumables and energy. In this paper, the experimental results obtained by the micro-electrical discharge machining (micro-EDM of micro-channels made on Ni–Cr–Mo steel is reported. The aim of such investigation is to shed a light on the relation and dependence between the material removal process, identified in the evaluation of material removal rate (MRR and tool wear ratio (TWR, and some of the most important technological parameters (i.e., open voltage, discharge current, pulse width and frequency, in order to experimentally quantify the material waste produced and optimize the technological process in order to decrease it.

  13. Nonlinear Aspects of Heat Pump Utilization

    Directory of Open Access Journals (Sweden)

    R. Najman

    2010-01-01

    Full Text Available This work attempts to answer the question: How much can we believe that the coefficient of performance provided by the manufacturer is correct, when a heat pump is required to face the real load coming from changes of temperature? The paper summarizes some basics of heat pump theory and describes the results of numerical models.

  14. Chalon/Saint-Marcel manufacturing plant

    International Nuclear Information System (INIS)

    2008-01-01

    AREVA is the world leader in the design and construction of nuclear power plants, the manufacture of heavy components, and the supply of nuclear fuel and nuclear services such as maintenance and inspection. The Equipment Division provides the widest range of nuclear components and equipment, manufactured at its two facilities in Jeumont, northern France, and St. Marcel, in Burgundy. The St. Marcel plant, set on 35 ha (87.5 acres) near Chalon-sur-Saone, was established in 1973 in a region with a long history of specialized metalworking and mechanical activities to meet the demand for non-military nuclear requirements in France. The site offers two advantages: - excellent facilities for loading and transporting heavy components on the Saone river, - it's proximity to other group sites. Since its completion in 1975, the Chalon/St. Marcel facility has manufactured all the heavy components for French pressurized water reactors (PWRs) ranging from 900 MW to 1500 MW. It has also completed a significant number of export contracts that have made AREVA world leader. Nearly 600 heavy components (reactor vessels, steam generators, pressurizers and closure heads) have been manufactured or are currently being manufactured since the plant opened in 1975. The plant is at the heart of the manufacturing chain for nuclear steam supply systems (NSSS) supplied by AREVA. On the basis of engineering data, the plant manufactures reactor vessels, reactor vessel internals, steam generators, pressurizers and related components such as accumulators, auxiliary heat exchangers and supporting elements. Vessel upper internals Other similar components such as reactor vessels for boiling water reactors (BWR) or high temperature reactors (HTR) and other types of steam generators can also be manufactured in the plant (for example Once Through Steam Generators - OTSG). The basic activities performed at Chalon/St. Marcel are metalworking and heavy machining. These activities are carried out in strict

  15. Transistor and integrated circuit manufacture

    International Nuclear Information System (INIS)

    Colman, D.

    1978-01-01

    This invention relates to the manufacture of transistors and integrated circuits by ion bombardment techniques and is particularly, but not exclusively, of value in the manufacture of so-called integrated injection logic circuitry. (author)

  16. 77 FR 2275 - Manufacturing Council

    Science.gov (United States)

    2012-01-17

    ... DEPARTMENT OF COMMERCE International Trade Administration Manufacturing Council AGENCY... candidate's proven experience in promoting, developing and marketing programs in support of manufacturing... participating in Council meetings and events are responsible for their travel, living and other personal...

  17. 76 FR 33244 - Manufacturing Council

    Science.gov (United States)

    2011-06-08

    ... DEPARTMENT OF COMMERCE International Trade Administration Manufacturing Council AGENCY... experience in promoting, developing and marketing programs in support of manufacturing industries, in job... Council meetings and events are responsible for their travel, living and other personal expenses. Meetings...

  18. Manufacturing mobility in global operations

    NARCIS (Netherlands)

    Steenhuis, H.J.; de Bruijn, E.J.

    2002-01-01

    The globalization trend inevitably affects the organization of manufacturing by enterprises. It offers opportunities to examine manufacturing from a global perspective and consequently to produce where it is most appropriate. However, globalization has also led to an increase in competitive

  19. Green Manufacturing Fundamentals and Applications

    CERN Document Server

    2013-01-01

    Green Manufacturing: Fundamentals and Applications introduces the basic definitions and issues surrounding green manufacturing at the process, machine and system (including supply chain) levels. It also shows, by way of several examples from different industry sectors, the potential for substantial improvement and the paths to achieve the improvement. Additionally, this book discusses regulatory and government motivations for green manufacturing and outlines the path for making manufacturing more green as well as making production more sustainable. This book also: • Discusses new engineering approaches for manufacturing and provides a path from traditional manufacturing to green manufacturing • Addresses regulatory and economic issues surrounding green manufacturing • Details new supply chains that need to be in place before going green • Includes state-of-the-art case studies in the areas of automotive, semiconductor and medical areas as well as in the supply chain and packaging areas Green Manufactu...

  20. 75 FR 80040 - Manufacturing Council

    Science.gov (United States)

    2010-12-21

    ..., developing and marketing programs in support of manufacturing industries, job creation in the manufacturing... relevant contact information such as mailing address, fax, e-mail, fixed and mobile phone numbers and...

  1. Transistor and integrated circuit manufacture

    Energy Technology Data Exchange (ETDEWEB)

    Colman, D

    1978-09-27

    This invention relates to the manufacture of transistors and integrated circuits by ion bombardment techniques and is particularly, but not exclusively, of value in the manufacture of so-called integrated injection logic circuitry.

  2. Heat pumps

    CERN Document Server

    Brodowicz, Kazimierz; Wyszynski, M L; Wyszynski

    2013-01-01

    Heat pumps and related technology are in widespread use in industrial processes and installations. This book presents a unified, comprehensive and systematic treatment of the design and operation of both compression and sorption heat pumps. Heat pump thermodynamics, the choice of working fluid and the characteristics of low temperature heat sources and their application to heat pumps are covered in detail.Economic aspects are discussed and the extensive use of the exergy concept in evaluating performance of heat pumps is a unique feature of the book. The thermodynamic and chemical properties o

  3. Composites Manufacturing Education and Technology Facility Expedites Manufacturing Innovation

    Energy Technology Data Exchange (ETDEWEB)

    2017-01-01

    The Composites Manufacturing Education and Technology facility (CoMET) at the National Wind Technology Center at the National Renewable Energy Laboratory (NREL) paves the way for innovative wind turbine components and accelerated manufacturing. Available for use by industry partners and university researchers, the 10,000-square-foot facility expands NREL's composite manufacturing research capabilities by enabling researchers to design, prototype, and test composite wind turbine blades and other components -- and then manufacture them onsite. Designed to work in conjunction with NREL's design, analysis, and structural testing capabilities, the CoMET facility expedites manufacturing innovation.

  4. Exploring manufacturing solutions for SMEs

    DEFF Research Database (Denmark)

    Radziwon, Agnieszka; Blichfeldt, Henrik; Bilberg, Arne

    This exploratory study provides an overview over current state of manufacturing solutions in small and medium sized enterprises (SMEs) in region of Southern Denmark. Building on manufacturing paradigms, this paper reveals relevant aspects for the development and implementation of improving SMEs...... of manufacturing solutions, which are required to increase their competitiveness and assure sustainable growth....

  5. 78 FR 67117 - Manufacturing Council

    Science.gov (United States)

    2013-11-08

    ... preeminent destination for investment in manufacturing throughout the world'' as provided for in Section 4 of... the viewpoint of those stakeholders on current and emerging issues in the manufacturing sector. In... the U.S. manufacturing industry in terms of industry sectors, geographic locations, demographics, and...

  6. 2001 Industry Studies: Advanced Manufacturing

    Science.gov (United States)

    2001-05-28

    oriented, 19 and manufacturers are employing the Internet and associated information technologies to better integrate supply chains and form extended...ways to compete in world markets . As part of this ongoing transformation, the broad implementation of advanced manufacturing technologies , processes...competitive advantages and better performance in world markets . Importantly, advanced manufacturing involves the innovative integration of new technology

  7. Process and control systems for composites manufacturing

    Science.gov (United States)

    Tsiang, T. H.; Wanamaker, John L.

    1992-01-01

    A precise control of composite material processing would not only improve part quality, but it would also directly reduce the overall manufacturing cost. The development and incorporation of sensors will help to generate real-time information for material processing relationships and equipment characteristics. In the present work, the thermocouple, pressure transducer, and dielectrometer technologies were investigated. The monitoring sensors were integrated with the computerized control system in three non-autoclave fabrication techniques: hot-press, self contained tool (self heating and pressurizing), and pressure vessel). The sensors were implemented in the parts and tools.

  8. Enhanced additive manufacturing with a reciprocating platen

    Science.gov (United States)

    Lind, Randall F.; Blue, Craig A.; Love, Lonnie J.; Post, Brian K.; Lloyd, Peter D.

    2018-02-06

    An additive manufacturing extrusion head that includes a heated nozzle for accepting a feedstock and extruding the feedstock onto a substrate at a deposition plane, the nozzle having a longitudinal extrusion axis. A reciprocating platen surrounds the nozzle, the platen operable to reciprocate along the extrusion axis at or above the deposition plane as the nozzle extrudes feedstock onto the substrate; and wherein the platen flattens the extruded feedstock such that it does not protrude above the deposition plane as the extrusion head traverses over the substrate.

  9. MANUFACTURE OF UF$sub 4$

    Science.gov (United States)

    Calcott, W.S.

    1959-10-13

    The manufacture of uranium tetrafluoride from urarium dioxide is described. Uranium dioxide is heated to about 500 deg C in a reactor. Anhydrous hydrogen fluoride is passed through the reactor in contact with uranium dioxide for several hours, the flow of hydrogen fluoride is discontinued, and hydrogen passed through the reactor for less than an hour. The flow of hydrogen fluoride is resumed for several hours, and then nitrogen is passed for a few minutes to expel unreacted hydrogen fluoride as water vapor. The reactor is cooled to room temperature and the uranium tetrafluoride removed.

  10. Three-Dimensional Printing of Multifunctional Nanocomposites: Manufacturing Techniques and Applications.

    Science.gov (United States)

    Farahani, Rouhollah D; Dubé, Martine; Therriault, Daniel

    2016-07-01

    The integration of nanotechnology into three-dimensional printing (3DP) offers huge potential and opportunities for the manufacturing of 3D engineered materials exhibiting optimized properties and multifunctionality. The literature relating to different 3DP techniques used to fabricate 3D structures at the macro- and microscale made of nanocomposite materials is reviewed here. The current state-of-the-art fabrication methods, their main characteristics (e.g., resolutions, advantages, limitations), the process parameters, and materials requirements are discussed. A comprehensive review is carried out on the use of metal- and carbon-based nanomaterials incorporated into polymers or hydrogels for the manufacturing of 3D structures, mostly at the microscale, using different 3D-printing techniques. Several methods, including but not limited to micro-stereolithography, extrusion-based direct-write technologies, inkjet-printing techniques, and popular powder-bed technology, are discussed. Various examples of 3D nanocomposite macro- and microstructures manufactured using different 3D-printing technologies for a wide range of domains such as microelectromechanical systems (MEMS), lab-on-a-chip, microfluidics, engineered materials and composites, microelectronics, tissue engineering, and biosystems are reviewed. Parallel advances on materials and techniques are still required in order to employ the full potential of 3D printing of multifunctional nanocomposites. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  11. Cooling Performance of Additively Manufactured Microchannels and Film Cooling Holes

    Science.gov (United States)

    Stimpson, Curtis K.

    Additive manufacturing (AM) enables fabrication of components that cannot be made with any other manufacturing method. Significant advances in metal-based AM systems have made this technology feasible for building production parts to be used use in commercial products. In particular, the gas turbine industry benefits from AM as a manufacturing technique especially for development of components subjected to high heat flux. It has been shown that the use of microchannels in high heat flux components can lead to more efficient cooling designs than those that presently exist. The current manufacturing methods have prevented the use of microchannels in such parts, but AM now makes them manufacturable. However, before such designs can become a reality, much research must be done to characterize impacts on flow and heat transfer of AM parts. The current study considers the effect on flow and heat transfer through turbine cooling features made with AM. Specifically, the performance of microchannels and film cooling holes made with laser powder bed fusion (L-PBF) is assessed. A number of test coupons containing microchannels were built from high temperature alloy powders on a commercially available L-PBF machine. Pressure drop and heat transfer experiments characterized the flow losses and convective heat transfer of air passing through the channels at various Reynolds numbers and Mach numbers. The roughness of the channels' surfaces was characterized in terms of statistical roughness parameters; the morphology of the roughness was examined qualitatively. Magnitude and morphology of surface roughness found on AM parts is unlike any form of roughness seen in the literature. It was found that the high levels of roughness on AM surfaces result in markedly augmented pressure loss and heat transfer at all Reynolds numbers, and conventional flow and heat transfer correlations produce erroneous estimates. The physical roughness measurements made in this study were correlated to

  12. Heat transfer

    International Nuclear Information System (INIS)

    Saad, M.A.

    1985-01-01

    Heat transfer takes place between material systems as a result of a temperature difference. The transmission process involves energy conversions governed by the first and second laws of thermodynamics. The heat transfer proceeds from a high-temperature region to a low-temperature region, and because of the finite thermal potential, there is an increase in entropy. Thermodynamics, however, is concerned with equilibrium states, which includes thermal equilibrium, irrespective of the time necessary to attain these equilibrium states. But heat transfer is a result of thermal nonequilibrium conditions, therefore, the laws of thermodynamics alone cannot describe completely the heat transfer process. In practice, most engineering problems are concerned with the rate of heat transfer rather than the quantity of heat being transferred. Resort then is directed to the particular laws governing the transfer of heat. There are three distinct modes of heat transfer: conduction, convection, and radiation. Although these modes are discussed separately, all three types may occur simultaneously

  13. The role of nanotechnology and nano and micro-electronics in monitoring and control of cardiovascular diseases and neurological disorders

    Science.gov (United States)

    Varadan, Vijay K.

    2007-04-01

    controlled manipulation of individual molecules and atoms that can interact with the human body at sub-cellular level. The recent progress in microelectronics and nanosensors crates very powerful tools for the early detection and diagnosis. The nanowire integrated potassium and dopamine sensors are ideal for the monitoring and control of many cardiovascular diseases and neurological disorders. Selected movies illustrating the applications of nanodevices to patients will be shown at the talk.

  14. Manufacturing and testing experience for FFTF major safety related components

    International Nuclear Information System (INIS)

    Peckinpaugh, C.L.

    1976-01-01

    Experience with FFTF Heat Transport System components during design, manufacturing, and prototype testing is dscussed. Specifically the special design features and the results of the testing performed to assure that the designs provide for safe operation are outlined. Particular emphasis is placed on the full size prototype testing programs and the valuable experience gained

  15. Equipment for manufacture of single crystals by zone overlaying

    International Nuclear Information System (INIS)

    Richter, O.

    1981-01-01

    The patented heater element for the manufacture of monocrystals by zone melting of layers consists of a heated pipe on which short pipes or rings are slipped. A heater element of this design allows high volume capacity of expanded melt. (Ha)

  16. Good manufacturing practice

    International Nuclear Information System (INIS)

    Schlyer, D.J.

    2001-01-01

    In this presentation author deals with the Implementation of good manufacturing practice for radiopharmaceuticals. The presentation is divided into next parts: Batch size; Expiration date; QC Testing; Environmental concerns; Personnel aspects; Radiation concerns; Theoretical yields; Sterilizing filters; Control and reconciliation of materials and components; Product strength; In process sampling and testing; Holding and distribution; Drug product inspection; Buildings and facilities; Renovations at BNL for GMP; Aseptic processing and sterility assurance; Process validation and control; Quality control and drug product stability; Documentation and other GMP topics; Building design considerations; Equipment; and Summary

  17. Measured Performance of a Low Temperature Air Source Heat Pump

    Energy Technology Data Exchange (ETDEWEB)

    R.K. Johnson

    2013-09-01

    A 4-ton Low Temperature Heat Pump (LTHP) manufactured by Hallowell International was installed in a residence near New Haven, Connecticut and monitored over two winters of operation. After attending to some significant service issues, the heat pump operated as designed. This report should be considered a review of the dual compressor “boosted heat pump” technology. The Low Temperature Heat Pump system operates with four increasing levels of capacity (heat output) as the outdoor temperature drops.

  18. Heat exchanger

    Science.gov (United States)

    Daman, Ernest L.; McCallister, Robert A.

    1979-01-01

    A heat exchanger is provided having first and second fluid chambers for passing primary and secondary fluids. The chambers are spaced apart and have heat pipes extending from inside one chamber to inside the other chamber. A third chamber is provided for passing a purge fluid, and the heat pipe portion between the first and second chambers lies within the third chamber.

  19. Experimental validation of additively manufactured optimized shapes for passive cooling

    DEFF Research Database (Denmark)

    Lazarov, Boyan S.; Sigmund, Ole; Meyer, Knud E.

    2018-01-01

    This article confirms the superior performance of topology optimized heat sinks compared to lattice designs and suggests simpler manufacturable pin-fin design interpretations. The development is driven by the wide adoption of light-emitting-diode (LED) lamps for industrial and residential lighting....... The presented heat sink solutions are generated by topology optimization, a computational morphogenesis approach with ultimate design freedom, relying on high-performance computing and simulation. Optimized devices exhibit complex and organic-looking topologies which are realized with the help of additive...... manufacturing. To reduce manufacturing cost, a simplified interpretation of the optimized design is produced and validated as well. Numerical and experimental results agree well and indicate that the obtained designs outperform lattice geometries by more than 21%, resulting in a doubling of life expectancy and...

  20. Tube manufacturing and characterization of oxide dispersion strengthened ferritic steels

    International Nuclear Information System (INIS)

    Ukai, Shigeharu; Mizuta, Shunji; Yoshitake, Tunemitsu; Okuda, Takanari; Fujiwara, Masayuki; Hagi, Shigeki; Kobayashi, Toshimi

    2000-01-01

    Oxide dispersion strengthened (ODS) ferritic steels have an advantage in radiation resistance and superior creep rupture strength at elevated temperature due to finely distributed Y 2 O 3 particles in the ferritic matrix. Using a basic composition of low activation ferritic steel (Fe-12Cr-2W-0.05C), cladding tube manufacturing by means of pilger mill rolling and subsequent recrystallization heat-treatment was conducted while varying titanium and yttria contents. The recrystallization heat-treatment, to soften the tubes hardened due to cold-rolling and to subsequently improve the degraded mechanical properties, was demonstrated to be effective in the course of tube manufacturing. For a titanium content of 0.3 wt% and yttria of 0.25 wt%, improvement of the creep rupture strength can be attained for the manufactured cladding tubes. The ductility is also adequately maintained

  1. Dry etching for microelectronics

    CERN Document Server

    Powell, RA

    1984-01-01

    This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book

  2. Tracer techniques in microelectronics

    International Nuclear Information System (INIS)

    Flachowsky, J.; Freyer, K.

    1981-01-01

    Tracer technique and neutron activation analysis are capable of measuring impurities in semiconductor material or on the semiconductor surface in a very low concentration range. The methods, combined with autoradiography, are also suitable to determine dopant distributions in silicon. However, both techniques suffer from certain inherent experimental difficulties and/or limitations which are discussed. Methods of tracer technique practicable in the semiconductor field are described. (author)

  3. Fundamentals of microelectronics

    CERN Document Server

    Razavi, Behzad

    2008-01-01

    Designed to build a strong foundation in both design and analysis of electronic circuits, Razavi teaches conceptual understanding and mastery of the material by using modern examples to motivate and prepare students for advanced courses and their careers. Razavi's unique problem-solving framework enables students to deconstruct complex problems into components that they are familiar with which builds the confidence and intuitive skills needed for success.

  4. Heat Rejection from a Variable Conductance Heat Pipe Radiator Panel

    Science.gov (United States)

    Jaworske, D. A.; Gibson, M. A.; Hervol, D. S.

    2012-01-01

    A titanium-water heat pipe radiator having an innovative proprietary evaporator configuration was evaluated in a large vacuum chamber equipped with liquid nitrogen cooled cold walls. The radiator was manufactured by Advanced Cooling Technologies, Inc. (ACT), Lancaster, PA, and delivered as part of a Small Business Innovative Research effort. The radiator panel consisted of five titanium-water heat pipes operating as thermosyphons, sandwiched between two polymer matrix composite face sheets. The five variable conductance heat pipes were purposely charged with a small amount of non-condensable gas to control heat flow through the condenser. Heat rejection was evaluated over a wide range of inlet water temperature and flow conditions, and heat rejection was calculated in real-time utilizing a data acquisition system programmed with the Stefan-Boltzmann equation. Thermography through an infra-red transparent window identified heat flow across the panel. Under nominal operation, a maximum heat rejection value of over 2200 Watts was identified. The thermal vacuum evaluation of heat rejection provided critical information on understanding the radiator s performance, and in steady state and transient scenarios provided useful information for validating current thermal models in support of the Fission Power Systems Project.

  5. Manufacturing of cast fittings for power machine building using improved CO2-process

    International Nuclear Information System (INIS)

    Shuvalov, V.G.; Borodin, M.A.

    1984-01-01

    Technique for manufacturing of rods for casting fittings for power machines of heat and nuclear power plants using liquid-glass mixtures solidified by CO 2 is described. Optimal composition of mixtures and their basic technological properties were determined

  6. OPINION: Safe exponential manufacturing

    Science.gov (United States)

    Phoenix, Chris; Drexler, Eric

    2004-08-01

    In 1959, Richard Feynman pointed out that nanometre-scale machines could be built and operated, and that the precision inherent in molecular construction would make it easy to build multiple identical copies. This raised the possibility of exponential manufacturing, in which production systems could rapidly and cheaply increase their productive capacity, which in turn suggested the possibility of destructive runaway self-replication. Early proposals for artificial nanomachinery focused on small self-replicating machines, discussing their potential productivity and their potential destructiveness if abused. In the light of controversy regarding scenarios based on runaway replication (so-called 'grey goo'), a review of current thinking regarding nanotechnology-based manufacturing is in order. Nanotechnology-based fabrication can be thoroughly non-biological and inherently safe: such systems need have no ability to move about, use natural resources, or undergo incremental mutation. Moreover, self-replication is unnecessary: the development and use of highly productive systems of nanomachinery (nanofactories) need not involve the construction of autonomous self-replicating nanomachines. Accordingly, the construction of anything resembling a dangerous self-replicating nanomachine can and should be prohibited. Although advanced nanotechnologies could (with great difficulty and little incentive) be used to build such devices, other concerns present greater problems. Since weapon systems will be both easier to build and more likely to draw investment, the potential for dangerous systems is best considered in the context of military competition and arms control.

  7. INTEGRATED AUTOMOTIVE MANUFACTURING SUPPLY

    Directory of Open Access Journals (Sweden)

    P.J.S. Van Dyk

    2012-01-01

    Full Text Available

    ENGLISH ABSTRACT: Supply planning and traffic flow planning are major activities in the automotive manufacturing environment worldwide. Traditionally, the impact of supply planning strategies on plant traffic is rarely considered. This paper describes the development of a Decision Support System (DSS that will assist automotive manufacturers to analyse the effect of supply planning decisions on plant traffic during the supply planning phase of their logistics planning process. In essence, this DSS consists of a Supply Medium Decision Support Tool (SMDST (an interactive MS-Excel model with Visual Basic interfacing and a traffic flow simulation model tool (using eMPlant simulation software.

    AFRIKAANSE OPSOMMING: Verskaffingsbeplanning en verkeersvloeibeplanning is belangrike aktiwiteite in die motorvervaardigingsbedryf wêreldwyd. Tradisioneel word die uitwerking van verskaffings-beplanningsstrategië op aanlegverkeer selde in ag geneem. Hierdie artikel beskryf die ontwikkeling van ’n Besluitnemings Ondersteuningstelsel (DSS wat motorvervaardigers sal ondersteun in die analise van die effek van verskaffingsbeplanningbesluite op aanlegverkeer tydens die verskaffingsbeplanningsfase van hulle logistieke beplanningsproses. Hierdie DSS bestaan hoofsaaklik uit ’n Verskaffings-vervoermiddel Besluitnemingshulpmiddel (SMDST (’n interaktiewe MS-Excel model met “Visual Basic” koppelling asook ’n simulasiemodel van verkeersvloei (met eM-Plant simulasiesagteware.

  8. Heat pipe

    International Nuclear Information System (INIS)

    Triggs, G.W.; Lightowlers, R.J.; Robinson, D.; Rice, G.

    1986-01-01

    A heat pipe for use in stabilising a specimen container for irradiation of specimens at substantially constant temperature within a liquid metal cooled fast reactor, comprises an evaporator section, a condenser section, an adiabatic section therebetween, and a gas reservoir, and contains a vapourisable substance such as sodium. The heat pipe further includes a three layer wick structure comprising an outer relatively fine mesh layer, a coarse intermediate layer and a fine mesh inner layer for promoting unimpeded return of condensate to the evaporation section of the heat pipe while enhancing heat transfer with the heat pipe wall and reducing entrainment of the condensate by the upwardly rising vapour. (author)

  9. Integrated multiscale simulation of combined heat and power based district heating system

    International Nuclear Information System (INIS)

    Li, Peifeng; Nord, Natasa; Ertesvåg, Ivar Ståle; Ge, Zhihua; Yang, Zhiping; Yang, Yongping

    2015-01-01

    Highlights: • Simulation of power plant, district heating network and heat users in detail and integrated. • Coupled calculation and analysis of the heat and pressure losses of the district heating network. • District heating is not preferable for very low heat load due to relatively high heat loss. • Lower design supply temperatures of the district heating network give higher system efficiency. - Abstract: Many studies have been carried out separately on combined heat and power and district heating. However, little work has been done considering the heat source, the district heating network and the heat users simultaneously, especially when it comes to the heating system with large-scale combined heat and power plant. For the purpose of energy conservation, it is very important to know well the system performance of the integrated heating system from the very primary fuel input to the terminal heat users. This paper set up a model of 300 MW electric power rated air-cooled combined heat and power plant using Ebsilon software, which was validated according to the design data from the turbine manufacturer. Then, the model of heating network and heat users were developed based on the fundamental theories of fluid mechanics and heat transfer. Finally the combined heat and power based district heating system was obtained and the system performances within multiscale scope of the system were analyzed using the developed Ebsilon model. Topics with regard to the heat loss, the pressure drop, the pump power consumption and the supply temperatures of the district heating network were discussed. Besides, the operational issues of the integrated system were also researched. Several useful conclusions were drawn. It was found that a lower design primary supply temperature of the district heating network would give a higher seasonal energy efficiency of the integrated system throughout the whole heating season. Moreover, it was not always right to relate low design

  10. Glass manufacturing through induction

    International Nuclear Information System (INIS)

    Boen, R.; Paya, B.; Roscini, M.; Fautrelle, Y.; Tuaz, F.; Delage, D.

    1991-01-01

    Oxides and glasses are electrical and thermal insulators, but show the characteristic of being weakly conductors of electricity when they are melt. It is then possible to heat them through HF induction. This interesting property allows the development of a melting process in cold crucible induction furnace. The process is being studied and developed by a consortium made up of CFEI, CEA Marcoule, ELECTRICITE DE FRANCE and MADYLAM laboratory. The studies include 2 parts: a) One experimental part to develop the technology and research for satisfying configurations, through a small size platform (10 to 30 kg/h). The long run continuous pouring melting tests made on different kinds of glass allow to go-on with industrial range units. b) One theoretical part to understand the magneto-thermo-hydraulic phenomenon hardly in relation with the heavy dependence of the physical characteristics (electrical and heat conductivities, viscosity) according to temperature. 6 refs., 4 figs [fr

  11. Gas manufacture, materials for

    Energy Technology Data Exchange (ETDEWEB)

    Evans, F J

    1867-01-11

    Cannel coal, parrot coal, shale, or the like is reduced to a fine powder and mixed with finely-divided bituminous coal, or the two coals are reduced to powder together, or pulverized bituminous coal is mixed with resin, resin oil, or coal tar. The mixture is charged into the retorts. The mixture containing resin and etc. may be first heated to cause the ingredients to cohere, and then compressed into blocks for transport.

  12. Cloud manufacturing distributed computing technologies for global and sustainable manufacturing

    CERN Document Server

    Mehnen, Jörn

    2013-01-01

    Global networks, which are the primary pillars of the modern manufacturing industry and supply chains, can only cope with the new challenges, requirements and demands when supported by new computing and Internet-based technologies. Cloud Manufacturing: Distributed Computing Technologies for Global and Sustainable Manufacturing introduces a new paradigm for scalable service-oriented sustainable and globally distributed manufacturing systems.   The eleven chapters in this book provide an updated overview of the latest technological development and applications in relevant research areas.  Following an introduction to the essential features of Cloud Computing, chapters cover a range of methods and applications such as the factors that actually affect adoption of the Cloud Computing technology in manufacturing companies and new geometrical simplification method to stream 3-Dimensional design and manufacturing data via the Internet. This is further supported case studies and real life data for Waste Electrical ...

  13. High Thermal Conductivity Polymer Composites for Low Cost Heat Exchangers

    Energy Technology Data Exchange (ETDEWEB)

    None

    2017-08-01

    This factsheet describes a project that identified and evaluated commercially available and state-of-the-art polymer-based material options for manufacturing industrial and commercial non-metallic heat exchangers. A heat exchanger concept was also developed and its performance evaluated with heat transfer modeling tools.

  14. Manufacturing Renaissance : Return of manufacturing to western countries

    OpenAIRE

    Kianian, Babak; Larsson, Tobias; Tavassoli, Mohammad

    2013-01-01

    This chapter argues that the location of manufacturing is gradually shifting to the west again, exemplifying the ‘manufacturing renaissance’. Such a claim is based on the recent observed trend and the discussion is contextualized within the established theory that has been able to explain the location of manufacturing, that is, the product life cycle (PLC) model. Then the chapter identifies and discusses the four main drivers of this new phenomenon: (i) rising wage levels in emerging economie...

  15. Competitive manufacturing strategies for the manufacturing industries in Turkey

    OpenAIRE

    Ulusoy, Gündüz; Ulusoy, Gunduz

    2003-01-01

    In this study, results of the research into competitive manufacturing strategies of companies in four different sector studies covering 82 companies from the electronics, cement, automotive manufacturers, and appliances part and component suppliers in Turkey are presented. The data used in the study are gathered by conducting four sector surveys in 1997 and 1998 using a questionnaire supported by some follow-up interviews and site visits. A competitive manufacturing strategy is represented he...

  16. Investigating broadband acoustic adsorption using rapid manufacturing

    Science.gov (United States)

    Godbold, O.

    The reduction of nuisance noise and the removal of unwanted sound modes within a room or component enclosure-area can be accomplished through the use of acoustic absorbers. Sound absorption can be achieved through conversion of the kinetic energy associated with pressure waves, into heat energy via viscous dissipation. This occurs within open porous materials, or by utilising resonant effects produced using simple cavity and orifice configurations. The manufacture of traditional porous and resonant absorbers is commonly realised using basic manufacturing techniques. These techniques restrict the geometry of a given resonant construction, and limit the configuration of porous absorbers. The aim of this work is to exploit new and emerging capabilities of Rapid Manufacturing (RM) to produce components with geometrical freedom, and apply it to the development of broadband acoustic absorption. New and novel absorber geometric configurations are identified and their absorption performance is determined. The capabilities and limitations of RM processes in reproducing these configurations are demonstrated. The geometric configuration of RM resonant absorbers is investigated. Cavity modifications aimed at damping the resonant effect by restricting the motion of cavity air, and adding increased viscous resistance are explored. Modifications relating to cavity shape, the addition of internal perforations and increased cavity surface area have all been shown to add acoustic resistance, thereby increasing the bandwidth of absorption. Decreasing the hydraulic radius of the cavity cross section and reducing internal feature dimensions provide improved resistance over conventional configurations..

  17. Arrangement, manufacturing process and use of solar heat collectors

    Energy Technology Data Exchange (ETDEWEB)

    Scheel, H W

    1978-03-30

    Solar collectors generally have a timber or metal frame where the transparent front cover, usually of glass, is replaceable. In order to prevent great deformation, such a frame must be relatively stable and of heavy construction, which may lead to difficulties in mounting the collector on the roofs or front walls of houses. The present invention proposes a light but nevertheless rigid collector frame, which consists of plastic material and is constructed so that the installation and replacement of collectors can be realized. Further, collectors are proposed which guarantee a minimum of reflection and are so designed that an optimum architectural effect is produced.

  18. Manufacture and Erection of SFR Components: Feedback from PFBR Experience

    International Nuclear Information System (INIS)

    Chellapandi, P.

    2013-01-01

    Unique Features of SFR Components: • Large diameter thin walled shell and slender structures calling for stringent tolerances posing challenges in manufacturing, handling and erection. • Single side welds are unavoidable at some difficult locations. • In-service inspection is difficult. • Residual stresses should be minimum calling for robust heat treatment strategy. • Minimum number of materials to be used from reliability point of view (but not preferred from economic considerations). • Mainly austenitic stainless steels calling for careful considerations for welding without significant weld repairs and distortions. • Reactor assembly components decide the project time schedule (large manufacturing, assembly and erection time). • Leak tightness is very important in view of resulting sodium leaks. • Limited experience on manufacturing and erection of components. • Design and manufacturing codes still evolvingPFBR Reactor Assembly – Major Lessons: • Grid plate Large number of sleeves, posing difficulty in assembly, hard facing of large diameter plates and heavy flange construction. • Roof slab Large box type structure with many penetrations – complicated manufacturing process, time consuming and difficulty to overcome lamellar tearing problems. • Inclined Fuel Transfer Machine Complex manufacturing processes leading to large time and extensive qualification tests. • Increase of number of primary pipes – essential for enhancing safety. • Integration of components manufactured by different industries took unduly long time

  19. Compact heat exchanger for power plants

    International Nuclear Information System (INIS)

    Kinnunen, L.

    2001-01-01

    Vahterus Oy, located at Kalanti, has manufactured heat exchangers since the beginning of 1990s. About 90% of the equipment produced are exported. In the PSHE (Plate and Shell) solution of the Vahterus heat exchanger the heat is transferred by round plated welded to form a compact package, which is assembled into a cylindrical steel casing. The heat exchanger contains no gaskets or soldered joints, which eliminates the leak risks. Traditional heat exchanges are usually operated at higher temperatures and pressures, but the heat transfer capacities of them are lower. Plate heat exchangers, on the other hand, are efficient, but the application range of them is narrow. Additionally, the rubber gasket of the heat exchange plates, sealing the joints of the heat exchanging plates, does not stand high pressures or temperatures, or corroding fluids. The new welded plate heat exchanger combine the pressure and temperature resistance of tube heat exchangers and the high heat exchange capacity of plate heat exchangers. The new corrosion resisting heat exchanger can be applied for especially hard conditions. The operating temperature range of the PSHE heat exchanger is - 200 - 900 deg C. The pressure resistance is as high as 100 bar. The space requirement of PSHE is only one tenth of the space requirement of traditional tube heat exchangers. Adjusting the number of heat exchanging plates can change the capacity of the heat exchanger. Power range of the heat exchanger can be as high as 80 MW. Due to the corrosion preventive construction and the small dimension the PSHE heat exchanger can be applied for refrigerators using ammonia as refrigerant. These kinds of new Vahterus heat exchangers are in use in 60 countries in more than 2000 refrigerators

  20. Manufacturing halal in Malaysia

    DEFF Research Database (Denmark)

    Fischer, Johan

    2016-01-01

    In Arabic, halal literally means ‘permissible’ or ‘lawful’. Halal is no longer an expression of an esoteric form of production, trade and consumption, but part of a huge and expanding globalized market in which certification, standards and technoscience play important roles. Over the past three...... production, trade and consumption. Based on fieldwork in Malaysia, this article explores how manufacturing companies understand and practise halal certification, standards and technoscience. I argue that while existing studies of halal overwhelmingly explore micro-social aspects such as the everyday...... consumption among Muslim groups, ‘the bigger institutional picture’ that frames such consumption production and regulation are not well understood. By studying halal production, I provide an ethnography of the overlapping technologies and techniques of production and regulation that together warrant a product...

  1. Developments in fuel manufacturing

    International Nuclear Information System (INIS)

    Ion, S.E.; Harrop, G.; Maricalva Gonzalez, J.

    1995-01-01

    The status of the investment and R and D programmes in the UK and Spanish fuel fabrication facilities is outlined. Due to a number of circumstances, BNFL and ENUSA have been in the forefront of capital investment, with associated commitment to engineering and scientific research and development. Carrying through this investment has allowed the embodiment of proven state of the art technologies in the design of fuel fabrication plants, with particular emphasis on meeting the future challenge of health and safety, and product quality, at an acceptable cost. ENUSA and BNFL currently supply fuel, not only to their respective 'home' markets but also to France, Belgium, Sweden, and Germany. Both organisations employ an International Business outlook and partake in focused and speculative R and D projects for the design and manufacture of nuclear fuel. (orig./HP)

  2. Manufacture of Probiotic Bacteria

    Science.gov (United States)

    Muller, J. A.; Ross, R. P.; Fitzgerald, G. F.; Stanton, C.

    Lactic acid bacteria (LAB) have been used for many years as natural biopreservatives in fermented foods. A small group of LAB are also believed to have beneficial health effects on the host, so called probiotic bacteria. Probiotics have emerged from the niche industry from Asia into European and American markets. Functional foods are one of the fastest growing markets today, with estimated growth to 20 billion dollars worldwide by 2010 (GIA, 2008). The increasing demand for probiotics and the new food markets where probiotics are introduced, challenges the industry to produce high quantities of probiotic cultures in a viable and stable form. Dried concentrated probiotic cultures are the most convenient form for incorporation into functional foods, given the ease of storage, handling and transport, especially for shelf-stable functional products. This chapter will discuss various aspects of the challenges associated with the manufacturing of probiotic cultures.

  3. Maintenance in sustainable manufacturing

    Directory of Open Access Journals (Sweden)

    Vladimir Stuchly

    2014-09-01

    Full Text Available Background: Sustainable development is about reaching a balance between economic, social, and environmental goals, as well as people's participation in the planning process in order to gain their input and support. For a company, sustainable development means adoption of such business strategy and actions that contribute to satisfying present needs of company and stakeholders, as well as simultaneous protection, maintenance and strengthening of human and environmental potential which will be needed in the future. This new approach forces manufacturing companies to change their previous management paradigms. New management paradigm should include new issues and develop innovative methods, practices and technologies striving for solving problem of shortages of resources, softening environment overload and enabling development of environment-friendly lifecycle of products. Hence, its realization requires updating existing production models as they are based on previously accepted paradigm of unlimited resources and unlimited regeneration capabilities. Maintenance plays a crucial role because of its impact on availability, reliability, quality and life cycle cost, thus it should be one of the main pillars of new business running model.  Material and methods: The following paper is a result of research on the literature and observation of practices undertaken by a company within maintenance area. Results and conclusions: The main message is that considering sustainable manufacturing requires considerable expanding range of analysis and focusing on supporting processes. Maintenance offers numerous opportunities of decreasing influence of business processes on natural environment and more efficient resources utilization. The goal of maintenance processes realizing sustainable development strategy is increased profitability of exploitation and optimization of total lifecycle cost without disturbing safety and environmental issues. 

  4. Heat pipes. (Latest citations from the US Patent bibliographic file with exemplary claims). Published Search

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-03-01

    The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 50-250 citations and includes a subject term index and title list.) (Copyright NERAC, Inc. 1995)

  5. Heat pipes. (Latest citations from the US Patent Bibliographic file with exemplary claims). Published Search

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-12-01

    The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 50-250 citations and includes a subject term index and title list.) (Copyright NERAC, Inc. 1995)

  6. High performance passive solar heating system with heat pipe energy transfer

    NARCIS (Netherlands)

    Wit, de M.H.; Hensen, J.L.M.; Dijk, van H.A.L.; Brink, van den G.J.; Galen, van E; Ouden, den C.

    1984-01-01

    The aim of the project is to develop a passive solar heating system with a higher efficiency (regarding accumulation and transfer of solar heat into dwellings) than convential concrete thermal storage walls and with restricted extra costs for manufacturing the system. This is to be achieved by the

  7. Method of manufacturing a niobium-aluminum-germanium superconductive material

    Science.gov (United States)

    Wang, J.L.F.; Pickus, M.R.; Douglas, K.E.

    A method for manufacturing flexible Nb/sub 3/ (Al,Ge) multifilamentary superconductive material in which a sintered porous Nb compact is infiltrated with an Al-Ge alloy. It is deformed and heat treated in a series of steps at successively higher temperatures preferably below 1000/sup 0/C during the heat treatment, cladding material such as copper can be applied to facilitate a deformation step preceding the heat treatment and can remain in place through the heat treatment to serve as a temperature stabilizer for the superconductive material produced. These lower heat treatment temperatures favor formation of filaments with reduced grain size and with more grain boundaries which in turn increase the current-carrying capacity of the superconductive material.

  8. Effects of post heat-treatment on surface characteristics and adhesive bonding performance of medium density fiberboard

    Science.gov (United States)

    Nadir Ayrilimis; Jerrold E. Winandy

    2009-01-01

    A series of commercially manufactured medium density fiberboard (MDF) panels were exposed to a post-manufacture heat-treatment at various temperatures and durations using a hot press and just enough pressure to ensure firm contact between the panel and the press platens. Post-manufacture heat-treatment improved surface roughness of the exterior MDF panels. Panels...

  9. Manufacturing consumption of energy 1994

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1997-12-01

    This report provides estimates on energy consumption in the manufacturing sector of the U.S. economy based on data from the Manufacturing Energy Consumption Survey. The sample used in this report represented about 250,000 of the largest manufacturing establishments which account for approximately 98 percent of U.S. economic output from manufacturing, and an expected similar proportion of manufacturing energy use. The amount of energy use was collected for all operations of each establishment surveyed. Highlights of the report include profiles for the four major energy-consuming industries (petroleum refining, chemical, paper, and primary metal industries), and an analysis of the effects of changes in the natural gas and electricity markets on the manufacturing sector. Seven appendices are included to provide detailed background information. 10 figs., 51 tabs.

  10. Manufacturing consumption of energy 1991

    Energy Technology Data Exchange (ETDEWEB)

    1994-12-01

    This report provides estimates on energy consumption in the manufacturing sector of the US economy. These estimates are based on data from the 1991 Manufacturing Energy Consumption Survey (MECS). This survey--administered by the Energy End Use and Integrated Statistics Division, Office of Energy Markets and End Use, Energy Information Administration (EIA)--is the most comprehensive source of national-level data on energy-related information for the manufacturing industries.

  11. Green manufacturing processes and systems

    Energy Technology Data Exchange (ETDEWEB)

    Davim, J. Paulo (ed.) [Aveiro Univ. (Portugal). Dept. of Mechanical Engineering, Campus Universitario de Santiago

    2013-02-01

    This book provides the recent advances on green manufacturing processes and systems for modern industry. Chapter 1 provides information on sustainable manufacturing through environmentally-friendly machining. Chapter 2 is dedicated to environmentally-friendly machining: vegetable based cutting fluids. Chapter 3 describes environmental-friendly joining of tubes. Chapter 4 contains information on concepts, methods and strategies for zero-waste in manufacturing. Finally, chapter 5 is dedicated to the application of hybrid MCDM approach for selecting the best tyre recycling process.

  12. The state of biopharmaceutical manufacturing.

    Science.gov (United States)

    Molowa, David T; Mazanet, Rosemary

    2003-01-01

    The manufacturing of protein-based biopharmaceuticals is done in bacterial or mammalian cell cultures. While bacterial cultures are inexpensive, dependable, and approved by regulatory authorities, many complex proteins cannot be manufactured this way. Complex proteins must be manufactured in mammalian cell cultures to produce active products. Mammalian cell culture capacity is limited and has slowed the delivery of necessary biopharmaceutical products to patients. The nature of the production capacity problem and future outlook are critically examined.

  13. Wide and High Additive Manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Post, Brian K. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Roschli, Alex C. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2017-03-01

    The goal of this project is to develop and demonstrate the enabling technologies for Wide and High Additive Manufacturing (WHAM). WHAM will open up new areas of U.S. manufacturing for very large tooling in support of the transportation and energy industries, significantly reducing cost and lead time. As with Big Area Additive Manufacturing (BAAM), the initial focus is on the deposition of composite materials.

  14. Virtual CIM and Digital Manufacturing

    Institute of Scientific and Technical Information of China (English)

    Sev V.Nagalingam; Grier C.I.Lin

    2006-01-01

    Manufacturing enterprises play an important role in improving the economic environment of a country.Today, the capability to produce high quality products with shorter delivery time and the ability to produce according to the diverse customer requirements has become the characteristics of successful manufacturing industries. Application of intelligent manufacturing systems and Computer integrated manufacturing (CIM) are the most effective methods for overcoming the issues faced by present day manufactures while retaining the employment level and revenue of a country in today's highly competitive global market. With the developments taking place in CIM and its related technologies, the application of CIM in manufacturing enterprises has become a reality from the dream. This paper highlights the historical developments towards automation and the need for CIM systems. Furthermore, it analyses some new terms such as agile manufacturing, digital manufacturing, agent-based manufacturing and others, which have been emerging recently, and argues all these new technologies are the subsystems of CIM. In addition, this paper provides a new direction in CIM to fulfil the emerging challenges in today's global market and to satisfy the emerging need of virtual enterprises in the form of Virtual CIM.

  15. Manufacturing process optimization of nuclear fuel guide tube using HANA alloys

    International Nuclear Information System (INIS)

    Jeong, Yong Hwan; Park, S. Y.; Choi, B. K.; Park, J. Y.; Kim, H. G.; Jeong, Y. I.; Park, D. J.; Lim, J. K.

    2010-08-01

    From this project, the advanced manufacturing parameters which were contained of heat-treatment, reduction rate, and new process (2 step) were considered to increase the guide tube performance of HANA material. It was obtained that the strength and corrosion resistance of HANA material were improved by applying the improve manufacturing parameters when compared to the commercial guide tube material. · Manufacturing parameter study to increase mechanical property -Tensile strength increase of 30% by manufacturing parameter setup when compared to the guide tube specification · Manufacturing parameter study to decrease irradiation growth -Theoretical study of the texture effect on sample specimens related to the irradiation growth · Manufacturing parameter study to increase corrosion resistance -Corrosion resistance increase of 30% by manufacturing parameter setup when compared to the commercial guide tube

  16. Advanced manufacturing technologies modern machining, advanced joining, sustainable manufacturing

    CERN Document Server

    2017-01-01

    This book provides details and collective information on working principle, process mechanism, salient features, and unique applications of various advanced manufacturing techniques and processes belong. The book is divided in three sessions covering modern machining methods, advanced repair and joining techniques and, finally, sustainable manufacturing. The latest trends and research aspects of those fields are highlighted.

  17. Manufacturing Math Classes: An Instructional Program Guide for Manufacturing Workers.

    Science.gov (United States)

    McBride, Pamela G.; And Others

    This program guide documents a manufacturing job family curriculum that develops competence in generic work force education skills through three courses: Reading Rulers, Charts, and Gauges and Math for Manufacturing Workers I and II. An annotated table of contents lists a brief description of the questions answered in each section. An introduction…

  18. Manufacturing and testing of ITER divertor gas box liners

    International Nuclear Information System (INIS)

    Mazul, I.; Giniatulin, R.; Komarov, V.L.; Krylov, V.; Kuzmin, Ye.; Makhankov, A.; Odintsov, V.; Zhuk, A.

    1998-01-01

    Among a variety of R and D works performed by different ITER parties there are seven large projects which deal with the development, manufacturing and testing of most important complex reactor components. One of the projects is directed to produce a prototype of divertor cassette. In according with integration plan two full size liners with dummy armour are manufactured by RF Home Team. Except for liners with dummy armors the large - scale mock-up with real armour have to be manufactured in order to demonstrate the semi-industrial possibilities for joining of Be and W to CuCrZr heat - sink structure. The design of this liners, technological approaches to their manufacturing are presented. The description of brazing facility and joining technology which use a fast ohmic heating by 15 kA current is made. A mock-up of 800 mm in length and 90 mm in width was armored by 18 Be tiles (44 x 44 mm 2 in plane, 10 mm - thick) and 16 W-Cu tiles (44 x 44 mm 2 in plane, 3 mm - thick W). The preliminary results of high heat flux testing of the armored mock-ups are also presented. (author)

  19. Manufacturing strategy issues in selected Indian manufacturing industry

    Directory of Open Access Journals (Sweden)

    Mahender Singh

    2013-03-01

    Full Text Available This paper presents some findings of Indian manufacturing sectors viz. automobile (especially two-wheeler, tractor and general manufacturing industry. Various manufacturing strategy issues such as competitive priorities, improvement activities, and performance measures, have been identified and assessed in Indian context. Sector wise comparison of competitive priorities, improvement activities i.e. advanced manufacturing technology (AMT, integrated information systems (IIS, and advanced management systems (AMS, and performance measure, is provided. Our results showed that most of the Indian companies are still emphasizing on quality. However, automobile sector has set to compete globally with high innovation rate, faster new product development, and continuous improvement. It is also observed that Indian companies are investing more in AMS as compared to IIS and AMT. Manufacturing competence index is also computed for each sector.

  20. Sensors for Metering Heat Flux Area Density and Metrological Equipment for the Heat Flux Density Measurement

    Science.gov (United States)

    Doronin, D. O.

    2018-04-01

    The demand in measuring and studies of heat conduction of various media is very urgent now. This article considers the problem of heat conduction monitoring and measurement in various media and materials in any industries and branches of science as well as metrological support of the heat flux measurement equipment. The main study objects are both the sensors manufactured and facilities onto which these sensors will be installed: different cladding structures of the buildings, awnings, rocket fairings, boiler units, internal combustion engines. The Company develops and manufactures different types of heat flux sensors: thermocouple, thin-film, heterogeneous gradient as well as metrological equipment for the gauging calibration of the heat flux density measurement. The calibration shall be performed using both referencing method in the unit and by fixed setting of the heat flux in the unit. To manufacture heterogeneous heat flux gradient sensors (HHFGS) the Company developed and designed a number of units: diffusion welding unit, HHFGS cutting unit. Rather good quality HHFGS prototypes were obtained. At this stage the factory tests on the equipment for the heat flux density measurement equipment are planned. A high-sensitivity heat flux sensor was produced, now it is tested at the Construction Physics Research Institute (Moscow). It became possible to create thin-film heat flux sensors with the sensitivity not worse than that of the sensors manufactured by Captec Company (France). The Company has sufficient premises to supply the market with a wide range of sensors, to master new sensor manufacture technologies which will enable their application range.

  1. Additive Manufactured Superconducting Cavities

    Science.gov (United States)

    Holland, Eric; Rosen, Yaniv; Woolleet, Nathan; Materise, Nicholas; Voisin, Thomas; Wang, Morris; Mireles, Jorge; Carosi, Gianpaolo; Dubois, Jonathan

    Superconducting radio frequency cavities provide an ultra-low dissipative environment, which has enabled fundamental investigations in quantum mechanics, materials properties, and the search for new particles in and beyond the standard model. However, resonator designs are constrained by limitations in conventional machining techniques. For example, current through a seam is a limiting factor in performance for many waveguide cavities. Development of highly reproducible methods for metallic parts through additive manufacturing, referred to colloquially as 3D printing\\x9D, opens the possibility for novel cavity designs which cannot be implemented through conventional methods. We present preliminary investigations of superconducting cavities made through a selective laser melting process, which compacts a granular powder via a high-power laser according to a digitally defined geometry. Initial work suggests that assuming a loss model and numerically optimizing a geometry to minimize dissipation results in modest improvements in device performance. Furthermore, a subset of titanium alloys, particularly, a titanium, aluminum, vanadium alloy (Ti - 6Al - 4V) exhibits properties indicative of a high kinetic inductance material. This work is supported by LDRD 16-SI-004.

  2. APPROACHES FOR SUSTAINABLE MANUFACTURING

    Institute of Scientific and Technical Information of China (English)

    G(U)NTHER Seliger; SEBASTIAN Kernbaum; MARCO Zettl

    2007-01-01

    Sustainable development is a holistic approach harmonizing ecological, economical and socio-political needs with respect to the superior objective of enhancing human living standards. Thereby the availability of natural resources and the conservation of the ecosystems have to be considered that future generations have the possibility to meet their own needs. A long-term economical development demands the transition from a source-sink economy to a cycle economy as a result of limited resources, limited environmental capacities to absorb waste and emissions as well as increasing needs of a growing population. A reference model for sustainability in manufacturing is presented and used to illustrate sustainable approaches with respect to management, technology, process and product. Adaptation of products and components is a vital element for supporting efficient reuse of products and components. Consequently adaptation contributes to the ambitious goals of sustainability. Technological enablers for adaptation as modularity, information and communication technology are exemplarily introduced. Moreover, approaches for disseminating knowledge in sustainability are given.

  3. Balances instruments, manufacturers, history

    CERN Document Server

    Robens, Erich; Kiefer, Susanne

    2014-01-01

    The book deals mainly with direct mass determination by means of a conventional balances. It covers the history of the balance from the beginnings in Egypt earlier than 3000 BC to recent developments. All balance types are described with emphasis on scientific balances. Methods of indirect mass determination, which are applied to very light objects like molecules and the basic particles of matter and celestial bodies, are included.  As additional guidance, today’s manufacturers are listed and the profile of important companies is reviewed. Several hundred photographs, reproductions and drawings show instruments and their uses. This book includes commercial weighing instruments for merchandise and raw materials in workshops as well as symbolic weighing in the ancient Egyptian’s ceremony of ‘Weighing of the Heart’, the Greek fate balance, the Roman  Justitia, Juno Moneta and Middle Ages scenes of the Last Judgement with Jesus or St. Michael and of modern balances. The photographs are selected from the...

  4. Heat exchanger

    International Nuclear Information System (INIS)

    Leigh, D.G.

    1976-01-01

    The arrangement described relates particularly to heat exchangers for use in fast reactor power plants, in which heat is extracted from the reactor core by primary liquid metal coolant and is then transferred to secondary liquid metal coolant by means of intermediate heat exchangers. One of the main requirements of such a system, if used in a pool type fast reactor, is that the pressure drop on the primary coolant side must be kept to a minimum consistent with the maintenance of a limited dynamic head in the pool vessel. The intermediate heat exchanger must also be compact enough to be accommodated in the reactor vessel, and the heat exchanger tubes must be available for inspection and the detection and plugging of leaks. If, however, the heat exchanger is located outside the reactor vessel, as in the case of a loop system reactor, a higher pressure drop on the primary coolant side is acceptable, and space restriction is less severe. An object of the arrangement described is to provide a method of heat exchange and a heat exchanger to meet these problems. A further object is to provide a method that ensures that excessive temperature variations are not imposed on welded tube joints by sudden changes in the primary coolant flow path. Full constructional details are given. (U.K.)

  5. Plasma heating

    International Nuclear Information System (INIS)

    Wilhelm, R.

    1989-01-01

    Successful plasma heating is essential in present fusion experiments, for the demonstration of DpT burn in future devices and finally for the fusion reactor itself. This paper discusses the common heating systems with respect to their present performance and their applicability to future fusion devices. The comparative discussion is oriented to the various function of heating, which are: - plasma heating to fusion-relevant parameters and to ignition in future machines, -non-inductive, steady-pstate current drive, - plasma profile control, -neutral gas breakdown and plasma build-up. In view of these different functions, the potential of neutral beam injection (NBI) and the various schemes of wave heating (ECRH, LH, ICRH and Alven wave heating) is analyzed in more detail. The analysis includes assessments of the present physical and technical state of these heating methods, and makes suggestions for future developments and about outstanding problems. Specific attention is given to the still critical problem of efficient current drive, especially with respect to further extrapolation towards an economically operating tokamak reactor. Remarks on issues such as reliability, maintenance and economy conclude this comparative overview on plasma heating systems. (author). 43 refs.; 13 figs.; 3 tabs

  6. Manufacturing Competitiveness and Supply Chain Analyses for Hydrogen Refueling Stations

    Energy Technology Data Exchange (ETDEWEB)

    Mayyas, Ahmad T [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Garland, Nancy [U.S. Department of Energy

    2018-04-27

    This slide deck was presented in the monthly FCTO webinar series (May 2017). The goal of this presentation was to share our latest results and remarks on the manufacturing competitiveness analysis of the hydrogen refueling stations (HRS). Manufacturing cost models were developed for major systems in the HRS such as compressors, storage tanks, chillers, heat exchangers, and dispensers. In addition to the cost models, we also discussed important remarks from our analysis for the international trade flows and global supply chain for the hydrogen refueling stations. The last part of the presentation also highlights effect of economies of scale and high production volumes on lowering the cost of the hydrogen at the pump.

  7. Training for New Manufacturing Technologies.

    Science.gov (United States)

    Jacobs, James

    1988-01-01

    Examines the effects of computer-based manufacturing technologies on employment opportunities and job skills. Describes the establishment of the Industrial Technology Institute in Michigan to develop and utilize advanced manufacturing technologies, and the institute's relationship to the state's community colleges. Reviews lessons learned from…

  8. 75 FR 30781 - Manufacturing Council

    Science.gov (United States)

    2010-06-02

    ... convenience. Pending applicants remain under consideration and do not need to resubmit their applications..., particularly seeking the representation of small- and medium-sized enterprises. Additional factors which may be... marketing programs in support of manufacturing industries, job creation in the manufacturing sector, or the...

  9. Heat Stroke

    DEFF Research Database (Denmark)

    Mørch, Sofie Søndergaard; Andersen, Johnny Dohn Holmgren; Bestle, Morten Heiberg

    2017-01-01

    not diagnosed until several days after admittance; hence treatment with cooling was delayed. Both patients were admitted to the intensive care unit, where they were treated with an external cooling device and received treatment for complications. Both cases ended fatally. As global warming continues, more heat......Heat stroke is an acute, life-threatening emergency characterized clinically by elevated body temperature and central nervous system dysfunction. Early recognition and treatment including aggressive cooling and management of life-threatening systemic complications are essential to reduce morbidity...... and mortality. This case report describes two Danish patients diagnosed with heat stroke syndrome during a heat wave in the summer of 2014. Both patients were morbidly obese and had several predisposing illnesses. However since heat stroke is a rare condition in areas with temperate climate, they were...

  10. Material Selection for Microchannel Heatsink: Conjugate Heat Transfer Simulation

    Science.gov (United States)

    Uday Kumar, A.; Javed, Arshad; Dubey, Satish K.

    2018-04-01

    Heat dissipation during the operation of electronic devices causes rise in temperature, which demands an effective thermal management for their performance, life and reliability. Single phase liquid cooling in microchannels is an effective and proven technology for electronics cooling. However, due to the ongoing trends of miniaturization and developments in the microelectronics technology, the future needs of heat flux dissipation rate are expected to rise to 1 kW/cm2. Air cooled systems are unable to meet this demand. Hence, liquid cooled heatsinks are preferred. This paper presents conjugate heat transfer simulation of single phase flow in microchannels with application to electronic cooling. The numerical model is simulated for different materials: copper, aluminium and silicon as solid and water as liquid coolant. The performances of microchannel heatsink are analysed for mass flow rate range of 20-40 ml/min. The investigation has been carried out on same size of electronic chip and heat flux in order to have comparative study of different materials. This paper is divided into two sections: fabrication techniques and numerical simulation for different materials. In the first part, a brief discussion of fabrication techniques of microchannel heatsink have been presented. The second section presents conjugate heat transfer simulation and parametric investigation for different material microchannel heatsink. The presented study and findings are useful for selection of materials for microchannel heatsink.

  11. Proceedings: Meeting customer needs with heat pumps, 1991

    International Nuclear Information System (INIS)

    1992-12-01

    Electric heat pumps provide a growing number of residential and commercial customers with space heating and cooling as well as humidity control and water heating. Industrial customers use heat pump technology for energy-efficient, economical process heating and cooling. Heat pumps help utilities meet environmental protection needs and satisfy their load-shape objectives. The 1991 conference was held in Dallas on October 15--18, featuring 60 speakers representing electric utilities, consulting organizations, sponsoring organizations, and heat pump manufacturers. The speakers presented the latest information about heat pump markets, technologies, applications, trade ally programs, and relevant issues. Participants engaged in detailed discussions in ''breakout'' and parallel sessions and viewed more than 30 exhibits of heat pumps, software, and other products and services supporting heat pump installations and service. Electric utilities have the greatest vested interest in the sale of electric heat pumps and thus have responsibility to ensure quality installations through well-trained technicians, authoritative and accurate technical information, and wellinformed design professionals. The electric heat pump is an excellent tool for the electric utility industry's response to environmental and efficiency challenges as well as to competition from other fuel sources. Manufacturers are continually introducing new products and making research results available to meet these challenges. Industrial process heat pumps offer customers the ability to supply heat to process at a lower cost than heat supplied by primary-fuel-fired boilers. From the utility perspective these heat pumps offer an opportunity for a new electric year-round application

  12. Topology Optimization for Additive Manufacturing

    DEFF Research Database (Denmark)

    Clausen, Anders

    This PhD thesis deals with the combination of topology optimization and additive man-ufacturing (AM, also known as 3D-printing). In addition to my own works, the thesis contains a broader review and assessment of the literature within the field. The thesis first presents a classification...... of the various AM technologies, a review of relevant manufacturing materials, the properties of these materials in the additively manufactured part, as well as manufacturing constraints with a potential for design optimization. Subsequently, specific topology optimization formulations relevant for the most im...... for scalable manufacturing. In relation to interface problems it is shown how a flexible void area may be included into a standard minimum compliance problem by employing an additional design variable field and a sensitivity filter. Furthermore, it is shown how the design of coated structures may be modeled...

  13. Business models for additive manufacturing

    DEFF Research Database (Denmark)

    Hadar, Ronen; Bilberg, Arne; Bogers, Marcel

    2015-01-01

    Digital fabrication — including additive manufacturing (AM), rapid prototyping and 3D printing — has the potential to revolutionize the way in which products are produced and delivered to the customer. Therefore, it challenges companies to reinvent their business model — describing the logic...... of creating and capturing value. In this paper, we explore the implications that AM technologies have for manufacturing systems in the new business models that they enable. In particular, we consider how a consumer goods manufacturer can organize the operations of a more open business model when moving from...... a manufacturer-centric to a consumer-centric value logic. A major shift includes a move from centralized to decentralized supply chains, where consumer goods manufacturers can implement a “hybrid” approach with a focus on localization and accessibility or develop a fully personalized model where the consumer...

  14. Manufacturing best practices and performance

    DEFF Research Database (Denmark)

    Szász, Levente; Demeter, Krisztina; Boer, Harry

    2014-01-01

    whether a) home and host country characteristics moderate the association between manufacturing practices and performance, and, thus, whether b) there are manufacturing practices that are universally best. Manufacturing practices and performance are measured using data collected through the fifth round...... analysis is used to develop groups of companies based on home and host country development. Exploratory factor analysis is applied to create bundles of manufacturing practices and performance measures. Then, using moderated multiple regressions (MMR) with interaction factor, and separate multiple...... regression analyses for each group of companies, bundles of manufacturing practices are identified that lead to best-in-class performance improvements. A range of control variables is introduced to help interpret the results. The study shows that home and host country context does affect the association...

  15. Virtual Manufacturing Techniques Designed and Applied to Manufacturing Activities in the Manufacturing Integration and Technology Branch

    Science.gov (United States)

    Shearrow, Charles A.

    1999-01-01

    One of the identified goals of EM3 is to implement virtual manufacturing by the time the year 2000 has ended. To realize this goal of a true virtual manufacturing enterprise the initial development of a machinability database and the infrastructure must be completed. This will consist of the containment of the existing EM-NET problems and developing machine, tooling, and common materials databases. To integrate the virtual manufacturing enterprise with normal day to day operations the development of a parallel virtual manufacturing machinability database, virtual manufacturing database, virtual manufacturing paradigm, implementation/integration procedure, and testable verification models must be constructed. Common and virtual machinability databases will include the four distinct areas of machine tools, available tooling, common machine tool loads, and a materials database. The machine tools database will include the machine envelope, special machine attachments, tooling capacity, location within NASA-JSC or with a contractor, and availability/scheduling. The tooling database will include available standard tooling, custom in-house tooling, tool properties, and availability. The common materials database will include materials thickness ranges, strengths, types, and their availability. The virtual manufacturing databases will consist of virtual machines and virtual tooling directly related to the common and machinability databases. The items to be completed are the design and construction of the machinability databases, virtual manufacturing paradigm for NASA-JSC, implementation timeline, VNC model of one bridge mill and troubleshoot existing software and hardware problems with EN4NET. The final step of this virtual manufacturing project will be to integrate other production sites into the databases bringing JSC's EM3 into a position of becoming a clearing house for NASA's digital manufacturing needs creating a true virtual manufacturing enterprise.

  16. The manufacture of carbon armoured plasma-facing components for fusion devices

    International Nuclear Information System (INIS)

    Schedler, B.; Huber, T.; Zabernig, A.; Rainer, F.; Scheiber, K.H.; Schedle, D.

    2001-01-01

    Within the last decade Plansee has been active in the development and manufacture of different plasma-facing-components for nuclear fusion experiments consisting in a tungsten or CFC-armor joined onto metallic substrates like TZM, stainless steel or copper-alloys. The manufacture of these components requires unique joining technologies in order to obtain reliable thermo mechanical stable joints able to withstand highest heat fluxes without any deterioration of the joint. In an overview the different techniques will be presented by some examples of components already manufactured and successfully tested under high heat flux conditions. Furthermore an overview will be given on the manufacture of different high heat flux components for TORE SUPRA, Wendelstein 7-X and ITER. (author)

  17. Information, communication and control systems for vehicle, road and traffic management. Contribution OECD Seminar on Micro-electronics for Road and Traffic Management. Tokyo, October 29 - November 2, 1984, Session V, p. 236-241.

    NARCIS (Netherlands)

    Oei, H.-l.

    1984-01-01

    The application of micro-electronics for vehicle, road and traffic management has increased rapidly in the past 10 to 15 years. The approach, however, is very often rather isolated, resulting in problems regarding consistency, continuity, uniformity and compatibility. The whole field of possible

  18. Organizing for manufacturing innovation. The case of Flexible Manufacturing Systems

    DEFF Research Database (Denmark)

    Boer, Harry; Krabbendam, Koos

    1992-01-01

    addressing the manufacturing innovation process are even fewer and provide little insight into its true nature. Consequently, little is known about the effective organization of such processes. In the present article an organization model of manufacturing innovation is described, and its practicability...... the implementation of new technology effectively. This is not surprising, considering the innovative nature of this process. Although there is a host of literature on innovation, organization and (the benefits of) new technology, the literature in which these areas are linked together is scarce. Publications...... assessed using the results of seven case studies of the implementation of flexible manufacturing systems in British, Belgian and Dutch mechanical engineering companies....

  19. Solar Variability and the Near-Earth Environment: Mining Enhanced Low Dose Rate Sensitivity Data From the Microelectronics and Photonics Test Bed Space Experiment

    Science.gov (United States)

    Turflinger, T.; Schmeichel, W.; Krieg, J.; Titus, J.; Campbell, A.; Reeves, M.; Marshall (P.); Hardage, Donna (Technical Monitor)

    2004-01-01

    This effort is a detailed analysis of existing microelectronics and photonics test bed satellite data from one experiment, the bipolar test board, looking to improve our understanding of the enhanced low dose rate sensitivity (ELDRS) phenomenon. Over the past several years, extensive total dose irradiations of bipolar devices have demonstrated that many of these devices exhibited ELDRS. In sensitive bipolar transistors, ELDRS produced enhanced degradation of base current, resulting in enhanced gain degradation at dose rates 1 rd(Si)/s. This Technical Publication provides updated information about the test devices, the in-flight experiment, and both flight-and ground-based observations. Flight data are presented for the past 5 yr of the mission. These data are compared to ground-based data taken on devices from the same date code lots. Information about temperature fluctuations, power shutdowns, and other variables encountered during the space flight are documented.

  20. Development of a Nuclear Reaction Database on Silicon for Simulation of Neutron-Induced Single-Event Upsets in Microelectronics and its Application

    International Nuclear Information System (INIS)

    Watanabe, Yukinobu; Kodama, Akihiro; Tukamoto, Yasuyuki; Nakashima, Hideki

    2005-01-01

    We have developed a cross-section database for neutron-induced reactions on 28Si in the energy range between 2 MeV and 3 GeV in order to analyze single-event upsets (SEUs) phenomena induced by cosmic-ray neutrons in microelectronic devices. A simplified spherical device model is proposed for simulation of the initial processes of SEUs. The model is applied to SEU cross-section calculations for semiconductor memory devices. The calculated results are compared with measured SEU cross sections and the other simulation result. The dependence of SEU cross sections on incident neutron energy and secondary ions having the most important effects on SEUs are discussed