Microelectronic systems N2 checkbook

CERN Document Server

Vears, R E

2013-01-01

Microelectronic Systems N2 Checkbook provides coverage of the Business and Technician Education Council level NII unit in Microelectronic Systems. However, it can be regarded as a textbook in microelectronic systems for a much wider range of studies. The aim of this book is to provide a foundation in microelectronic systems hardware and software techniques. Each topic considered in the text is presented in a way that assumes in the reader only the knowledge attained in BTEC Information Technology Studies F, Engineering Fundamentals F, or equivalent. This book concentrates on the highly popular

76 FR 10395 - BreconRidge Manufacturing Solutions, Now Known as Sanmina-SCI Corporation, Division...

Science.gov (United States)

2011-02-24

... Solutions, Now Known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic Design and Manufacturing, a Subsidiary of Sanmina-SCI Corporation, Including On- Site Leased Workers From Kelly Services... Manufacturing Solutions, now known as Sanmina-SCI Corporation, Division Optoelectronic and Microelectronic...

Manufacture of heat exchangers

International Nuclear Information System (INIS)

Burton, J.E.; Tombs, R.W.T.

1980-01-01

A tube bundle for use in a heat exchanger has a series of spaced parallel tubes supported by tube plates and is manufactured by depositing welding material around the end of each tube, machining the deposited material to form an annular flange around the end of the tube and welding the flange into apertures in the tube plate. Preferably the tubes have a length which is slightly less than the distance between the outer surfaces of the tube plates and the deposited material is deposited so that it overlaps and protects the end surfaces of the tubes. A plug may be inserted in the bore of the tubes during the welding material deposition which, as described, is effected by manual metal arc welding. One use of heat exchangers incorporating a tube bundle manufactured as above is in apparatus for reducing the volume of, and recovering nitric acid from, radioactive effluents from a nuclear reprocessing plant. (author)

Advanced Microelectronics Technologies for Future Small Satellite Systems

Science.gov (United States)

Alkalai, Leon

1999-01-01

Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

Microelectronic systems 1 checkbook

CERN Document Server

Vears, R E

2013-01-01

Microelectronic Systems 1 Checkbook provides coverage of the Business and Technician Education Council level 1 unit in Microelectronic Systems. However, it can be regarded as a basic textbook in microelectronic systems for a much wider range of studies. Each topic considered in the text is presented in a way that assumes the reader has little prior knowledge of electronics. The aim of the book is to provide an introduction to the concept of systems, to differentiate analogue and digital systems, and to describe the nature of microprocessor-controlled systems. An introduction to programming is

A self-regulating valve for single-phase liquid cooling of microelectronics

International Nuclear Information System (INIS)

Donose, Radu; De Volder, Michaël; Peirs, Jan; Reynaerts, Dominiek

2011-01-01

This paper reports on the design, optimization and testing of a self-regulating valve for single-phase liquid cooling of microelectronics. Its purpose is to maintain the integrated circuit (IC) at constant temperature and to reduce power consumption by diminishing flow generated by the pump as a function of the cooling requirements. It uses a thermopneumatic actuation principle that combines the advantages of zero power consumption and small size in combination with a high flow rate and low manufacturing costs. The valve actuation is provided by the thermal expansion of a liquid (actuation fluid) which, at the same time, actuates the valve and provides feed-back sensing. A maximum flow rate of 38 kg h −1 passes through the valve for a heat load up to 500 W. The valve is able to reduce the pumping power by up to 60% and it has the capability to maintain the IC at a more uniform temperature.

Solid-State Additive Manufacturing for Heat Exchangers

Science.gov (United States)

Norfolk, Mark; Johnson, Hilary

2015-03-01

Energy densities in devices are increasing across many industries including power generation, high power electronics, manufacturing, and automotive. Increasingly, there is a need for very high efficiency thermal management devices that can pull heat out of a small area at higher and higher rates. Metal additive manufacturing (AM) technologies have the promise of creating parts with complex internal geometries required for integral thermal management. However, this goal has not been met due to constraints in fusion-based metal 3D printers. This work presents a new strategy for metal AM of heat exchangers using an ultrasonic sheet lamination approach.

Using federal technology policy to strength the US microelectronics industry

Science.gov (United States)

Gover, J. E.; Gwyn, C. W.

1994-07-01

A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan's government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

Using federal technology policy to strength the US microelectronics industry

Energy Technology Data Exchange (ETDEWEB)

Gover, J.E.; Gwyn, C.W.

1994-07-01

A review of US and Japanese experiences with using microelectronics consortia as a tool for strengthening their respective industries reveals major differences. Japan has established catch-up consortia with focused goals. These consortia have a finite life targeted from the beginning, and emphasis is on work that supports or leads to product and process-improvement-driven commercialization. Japan`s government has played a key role in facilitating the development of consortia and has used consortia promote domestic competition. US consortia, on the other hand, have often emphasized long-range research with considerably less focus than those in Japan. The US consortia have searched for and often made revolutionary technology advancements. However, technology transfer to their members has been difficult. Only SEMATECH has assisted its members with continuous improvements, compressing product cycles, establishing relationships, and strengthening core competencies. The US government has not been a catalyst nor provided leadership in consortia creation and operation. We propose that in order to regain world leadership in areas where US companies lag foreign competition, the US should create industry-wide, horizontal-vertical, catch-up consortia or continue existing consortia in the six areas where the US lags behind Japan -- optoelectronics, displays, memories, materials, packaging, and manufacturing equipment. In addition, we recommend that consortia be established for special government microelectronics and microelectronics research integration and application. We advocate that these consortia be managed by an industry-led Microelectronics Alliance, whose establishment would be coordinated by the Department of Commerce. We further recommend that the Semiconductor Research Corporation, the National Science Foundation Engineering Research Centers, and relevant elements of other federal programs be integrated into this consortia complex.

New Nomenclatures for Heat Treatments of Additively Manufactured Titanium Alloys

Science.gov (United States)

Baker, Andrew H.; Collins, Peter C.; Williams, James C.

2017-07-01

The heat-treatment designations and microstructure nomenclatures for many structural metallic alloys were established for traditional metals processing, such as casting, hot rolling or forging. These terms do not necessarily apply for additively manufactured (i.e., three-dimensionally printed or "3D printed") metallic structures. The heat-treatment terminology for titanium alloys generally implies the heat-treatment temperatures and their sequence relative to a thermomechanical processing step (e.g., forging, rolling). These designations include: β-processing, α + β-processing, β-annealing, duplex annealing and mill annealing. Owing to the absence of a thermomechanical processing step, these traditional designations can pose a problem when titanium alloys are first produced via additive manufacturing, and then heat-treated. This communication proposes new nomenclatures for heat treatments of additively manufactured titanium alloys, and uses the distinct microstructural features to provide a correlation between traditional nomenclature and the proposed nomenclature.

Microelectronic systems 3 checkbook

CERN Document Server

Vears, R E

1985-01-01

Microelectronic Systems 3: Checkbook aims to extend the range of hardware, software, and interfacing techniques developed at level 2. This book concentrates on the highly popular 6502, Z80, and 6800 microprocessors and contains approximately 70 tested programs that may be used with little or no modification on most systems based on these microprocessors. This text also covers the main points concerned with computer hardware configuration, interfacing devices, subroutines and the stack, polling and interrupts, microelectronic stores, and address decoding and organization. Each chapter of the b

Ion implantation for microelectronics

International Nuclear Information System (INIS)

Dearnaley, G.

1977-01-01

Ion implantation has proved to be a versatile and efficient means of producing microelectronic devices. This review summarizes the relevant physics and technology and assesses the advantages of the method. Examples are then given of widely different device structures which have been made by ion implantation. While most of the industrial application has been in silicon, good progress continues to be made in the more difficult field of compound semiconductors. Equipment designed for the industrial ion implantation of microelectronic devices is discussed briefly. (Auth.)

Methods for microwave heat treatment of manufactured components

Science.gov (United States)

Ripley, Edward B.

2010-08-03

An apparatus for heat treating manufactured components using microwave energy and microwave susceptor material. Heat treating medium such as eutectic salts may be employed. A fluidized bed introduces process gases which may include carburizing or nitriding gases. The process may be operated in a batch mode or continuous process mode. A microwave heating probe may be used to restart a frozen eutectic salt bath.

Experimental investigation of single-phase microjet cooling of microelectronics

Directory of Open Access Journals (Sweden)

Rusowicz Artur

2015-09-01

Full Text Available Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second. While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

Experimental investigation of single-phase microjet cooling of microelectronics

Science.gov (United States)

Rusowicz, Artur; Leszczyński, Maciej; Grzebielec, Andrzej; Laskowski, Rafał

2015-09-01

Development of electronics, which aims to improve the functionality of electronic devices, aims at increasing the packing of transistors in a chip and boosting clock speed (the number of elementary operations per second). While pursuing this objective, one encounters the growing problem of thermal nature. Each switching of the logic state at the elementary level of an integrated circuit is associated with the generation of heat. Due to a large number of transistors and high clock speeds, higher heat flux is emitted by the microprocessor to a level where the component needs to be intensively cooled, or otherwise it will become overheated. This paper presents the cooling of microelectronic components using microjets.

Radiation effects on microelectronics

International Nuclear Information System (INIS)

Gover, J.E.

1987-01-01

Applications of radiation-hardened microelectronics in nuclear power systems include (a) light water reactor (LWR) containment building, postaccident instrumentation that can operate through the beta and gamma radiation released in a design basis loss-of-coolant accident; (b) advanced LWR instrumentation and control systems employing distributed digital integrated circuit (IC) technology to achieve a high degree of artificial intelligence and thereby reduce the probability of operator error under accident conditions; (c) instrumentation, command, control and communication systems for space nuclear power applications that must operate during the neutron and gamma-ray core leakage environments as well as the background electron, proton, and heavy charged particle environments of space; and (d) robotics systems designed for the described functions. Advanced microelectronics offer advantages in cost and reliability over alternative approaches to instrumentation and control. No semiconductor technology is hard to all classes of radiation effects phenomena. As the effects have become better understood, however, significant progress has been made in hardening IC technology. Application of hardened microelectronics to nuclear power systems has lagged military applications because of the limited market potential of hardened instruments and numerous institutional impediments

Methods of designing and manufacturing a heat exchanger for the ...

African Journals Online (AJOL)

The article describes the method of calculation, design and manufacture of the the plate heat exchanger for the gas turbine plants with heat recovery. We represented the method of threedimensional calculation, which allowed conducting a virtual experiment and clarifying the design of the heat exchanger for the given ...

Physics in microelectronics and microelectronics in physics

International Nuclear Information System (INIS)

Mooser, E.

1983-01-01

Modern semiconductor technology and its many different facets such as microelectronics, optoelectronics, integrated optics, solar energy conversion, etc... have their origin in solid state physics, However, because of their enormous economic impact, their development has been so rapid and has lead to such a high degree of complexity and sophistication, that to the newcomer in the field, the links between solid state electronics and solid state physics are no longer evident. (author) [pt

Field Measurements of Heating Efficiency of Electric Forced-Air Furnaces in Six Manufactured Homes.

Energy Technology Data Exchange (ETDEWEB)

Davis, Bob; Palmiter, Larry S.; Siegel, Jeff

1994-07-26

This report presents the results of field measurements of heating efficiency for six manufactured homes in the Pacific Northwest heated with electric forced-air systems. This is the first in a series of regional and national efforts to measure in detail the heating efficiency of manufactured homes. Only six homes were included in this study because of budgetary constraints; therefore this is not a representative sample. These investigations do provide some useful information on the heating efficiency of these homes. Useful comparisons can be drawn between these study homes and site-built heating efficiencies measured with a similar protocol. The protocol used to test these homes is very similar to another Ecotope protocol used in the study conducted in 1992 and 1993 for the Bonneville Power Administration to test the heating efficiency of 24 homes. This protocol combined real-time power measurements of furnace energy usage with energy usage during co-heat periods. Accessory data such as house and duct tightness measurements and tracer gas measurements were used to describe these homes and their heating system efficiency. Ensuring that manufactured housing is constructed in an energy and resource efficient manner is of increasing concern to manufactured home builders and consumers. No comparable work has been done to measure the heating system efficiency of MCS manufactured homes, although some co-heat tests have been performed on manufactured homes heated with natural gas to validate HUD thermal standards. It is expected that later in 1994 more research of this kind will be conducted, and perhaps a less costly and less time-consuming method for testing efficiencies will be develops.

Nanoelectronics: The perspective in microelectronics

International Nuclear Information System (INIS)

Mutihac, R.; Mutihac, R.C.; Cicuttin, A.; Colavita, A.A.

2001-10-01

The present survey briefly presents the-state-of-the-art in microelectronics, invokes physical considerations in estimating the intrinsic limits of present microelectronic devices, and highlights the future trends in the perspectives of the incoming nanoscale technologies. In order to design artificial systems with molecular precision, molecular brand new engineering methods must be developed, that is, to hold, position, and assemble nanoscale parts in compliance with the laws of physics. In the framework of the nanoscale technologies, the thermodynamically reversible single electron switching systems are considered as ultimate evolutionary end point of electronic logic devices built up at molecular level. (author)

Future trends in microelectronics journey into the unknown

CERN Document Server

Xu, Jimmy; Zaslavsky, Alexander

2016-01-01

Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals. The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state electronics, material science, optoelectronics, bioelectronics, and renewable energies. The topics covered range from fundamental physical principles, materials and device technologies, and major new market opportunities.

Microelectronics Revolution And The Impact Of Automation In The New Industrialized Countries

Science.gov (United States)

Baranauskas, Vitor

1984-08-01

A brief review of some important historical points on the origin of the Factories and the Industrial Revolution is presented with emphasis in the social problems related to the automation of the human labor. Until the World War I, the social changes provoked by the Industrial Revolution caused one division of the World in developed and underdeveloped countries. After that period, the less developed nations began their industrialization mainly through the Multinationals Corporations (MC). These enterprises were very important to the production and exportation of utilities and manufactures in general, mainly in those products which required intensive and direct human labor. At present time, with the pervasiveness of microelectronics in the automation, this age seems to reaching an end because all continous processes in industry tend economicaly toward total automation. This fact will cause a retraction in long-term investments and, beyond massive unemployment, there is a tendency for these MC industries to return to their original countries. The most promising alternative to avoid these events, and perhaps the unique, is to incentive an autonomous development in areas of high technology, as for instance, the microelectronics itself.

Microelectronics and nanoelectronics trends, and applications to HEP instrumentation

CERN Multimedia

CERN. Geneva

2004-01-01

Lecture 1 : Microelectronics and HEP instrumentation CMOS technology has been the leading technology in microelectronics for more that 30 years thanks to its outstanding capability to miniaturization and low power consumption. A brief history of the microelectronics semiconductor industry is presented with applications for LEP and LHC experiments. Lecture 2: Future trends in microelectronics and nanoelectronics Trends in miniaturization point to the fabrication of ULSI nanoscale CMOS circuits by the end of the decade. Device issues and quantum effects in nanoscale MOS transistor will be discussed. Beyond CMOS technology, several technology avenues based on nanotechnology are under investigation. We will present some promising nanoelectronic devices and circuits based on Single Electron Tunneling (SET) transistor, nanowire, quantum dot and carbon nanotubes. Lecture 3: Monolithic pixel detectors Microvertex detectors for particle physics experiments currently uses hybrid silicon pixel detector. Novel emerging m...

Japan's technology and manufacturing infrastructure

Science.gov (United States)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Apparatus with moderating material for microwave heat treatment of manufactured components

Science.gov (United States)

Ripley, Edward B [Knoxville, TN

2011-05-10

An apparatus for heat treating manufactured components using microwave energy and microwave susceptor material. Heat treating medium such as eutectic salts may be employed. A fluidized bed introduces process gases which may include carburizing or nitriding gases The process may be operated in a batch mode or continuous process mode. A microwave heating probe may be used to restart a frozen eutectic salt bath.

Low-cost Electromagnetic Heating Technology for Polymer Extrusion-based Additive Manufacturing

Energy Technology Data Exchange (ETDEWEB)

Carter, William G. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Rios, Orlando [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Akers, Ronald R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Morrison, William A. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

2016-01-07

To improve the flow of materials used in in polymer additive manufacturing, ORNL and Ajax Tocco created an induction system for heating fused deposition modeling (FDM) nozzles used in polymer additive manufacturing. The system is capable of reaching a temperature of 230 C, a typical nozzle temperature for extruding ABS polymers, in 17 seconds. A prototype system was built at ORNL and sent to Ajax Tocco who analyzed the system and created a finalized power supply. The induction system was mounted to a PrintSpace Altair desktop printer and used to create several test parts similar in quality to those created using a resistive heated nozzle.

Hermeticity testing of MEMS and microelectronic packages

CERN Document Server

Costello, Suzanne

2013-01-01

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

Additive manufacturing of a compact flat-panel cryogenic gas-gap heat switch

NARCIS (Netherlands)

Vanapalli, Srinivas; Vermeer, Cristian Hendrik; Tirolien, T.

2016-01-01

State-of-the-art heat switches are only rarely employed in thermal system architectures, since they are rather bulky and have a limited thermal performance (expressed as the heat transfer ratio between the "On" and "Off" state). Using selective laser melting additive manufacturing technology, also

Orion Heat Shield Manufacturing Producibility Improvements for the EM-1 Flight Test Program

Science.gov (United States)

Koenig, William J.; Stewart, Michael; Harris, Richard F.

2018-01-01

This paper describes how the ORION program is incorporating improvements in the heat shield design and manufacturing processes reducing programmatic risk and ensuring crew safety in support of NASA's Exploration missions. The approach for the EFT-1 heat shield utilized a low risk Apollo heritage design and manufacturing process using an Avcoat TPS ablator with a honeycomb substrate to provide a one piece heat shield to meet the mission re-entry heating environments. The EM-1 mission will have additional flight systems installed to fly to the moon and return to Earth. Heat shield design and producibility improvements have been incorporated in the EM-1 vehicle to meet deep space mission requirements. The design continues to use the Avcoat material, but in a block configuration to enable improvements in consistant and repeatable application processes using tile bonding experience developed on the Space Shuttle Transportation System Program.

Fabrication of Thermoelectric Devices Using Additive-Subtractive Manufacturing Techniques: Application to Waste-Heat Energy Harvesting

Science.gov (United States)

Tewolde, Mahder

Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are well suited for waste-heat energy harvesting applications as opposed to primary energy generation. Commercially available thermoelectric modules are flat, inflexible and have limited sizes available. State-of-art manufacturing of TEG devices relies on assembling prefabricated parts with soldering, epoxy bonding, and mechanical clamping. Furthermore, efforts to incorporate them onto curved surfaces such as exhaust pipes, pump housings, steam lines, mixing containers, reaction chambers, etc. require custom-built heat exchangers. This is costly and labor-intensive, in addition to presenting challenges in terms of space, thermal coupling, added weight and long-term reliability. Additive manufacturing technologies are beginning to address many of these issues by reducing part count in complex designs and the elimination of sub-assembly requirements. This work investigates the feasibility of utilizing such novel manufacturing routes for improving the manufacturing process of thermoelectric devices. Much of the research in thermoelectricity is primarily focused on improving thermoelectric material properties by developing of novel materials or finding ways to improve existing ones. Secondary to material development is improving the manufacturing process of TEGs to provide significant cost benefits. To improve the device fabrication process, this work explores additive manufacturing technologies to provide an integrated and scalable approach for TE device manufacturing directly onto engineering component surfaces. Additive manufacturing techniques like thermal spray and ink-dispenser printing are developed with the aim of improving the manufacturing process of TEGs. Subtractive manufacturing techniques like laser micromachining are also studied in detail. This includes the laser processing parameters for cutting the thermal spray materials efficiently by

SOME METHODS FOR SAVING HEAT ENERGY WHILE MANUFACTURING VERTICAL INSULATING GLASS UNITS

Directory of Open Access Journals (Sweden)

S. A. Shybeka

2018-01-01

Full Text Available The paper proposes and considers two constructive methods for saving heat energy while manufacturing vertical insulating glass units with various gas filling of inter-glass space. The first method presupposes manufacturing of insulating glass units having specific thickness which is calculated in accordance with specific features of convective heat exchange in the closed loop circuit. Value of the heat-exchange coefficient depends on gas properties which is filling a chamber capacity (coefficients of thermal conductivity, volumetric expansion, kinematic viscosity, thermometric conducivity, temperature difference on the boundary of interlayer and its thickness. It has been shown that while increasing thickness of gas layer convective heat exchange coefficient is initially decreasing up to specific value and then after insignificant increase it practically remains constant. In this connection optimum thicknesses of filled inter-layers for widely-spread gas in production (dry air, argon, krypton, xenon and for carbon dioxide have determined in the paper. Manufacturing of insulating glass units with large thickness of gas chamber practically does not lead to an increase in resistance to heat transfer but it will increase gas consumption rate. The second industrial economic method is interrelated with application of carbon dioxide СО2 as a filler of inter-glass space which has some advantages in comparison with other gases (small cost due to abundance, nontoxicity, transparency for visual light and absorption of heat rays. Calculations have shown that application of carbon dioxide will make it possible to increase resistance to heat transfer of one-chamber glass unit by 0.05 m²×K/W (with emissivity factor of internal glass – 0.837 or by 0.16 m²×K/W (with emission factor – 0.1 in comparison with the glass unit where a chamber is filled with dry air.

Thermal design heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells

CERN Document Server

Lee, H S

2010-01-01

The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design cours

Radiation Effects and Hardening Techniques for Spacecraft Microelectronics

Science.gov (United States)

Gambles, J. W.; Maki, G. K.

2002-01-01

The natural radiation from the Van Allen belts, solar flares, and cosmic rays found outside of the protection of the earth's atmosphere can produce deleterious effects on microelectronics used in space systems. Historically civil space agencies and the commercial satellite industry have been able to utilize components produced in special radiation hardened fabrication process foundries that were developed during the 1970s and 1980s under sponsorship of the Departments of Defense (DoD) and Energy (DoE). In the post--cold war world the DoD and DoE push to advance the rad--hard processes has waned. Today the available rad--hard components lag two-plus technology node generations behind state- of-the-art commercial technologies. As a result space craft designers face a large performance gap when trying to utilize available rad--hard components. Compounding the performance gap problems, rad--hard components are becoming increasingly harder to get. Faced with the economic pitfalls associated with low demand versus the ever increasing investment required for integrated circuit manufacturing equipment most sources of rad--hard parts have simply exited this market in recent years, leaving only two domestic US suppliers of digital rad--hard components. This paper summarizes the radiation induced mechanisms that can cause digital microelectronics to fail in space, techniques that can be applied to mitigate these failure mechanisms, and ground based testing used to validate radiation hardness/tolerance. The radiation hardening techniques can be broken down into two classes, Hardness By Process (HBP) and Hardness By Design (HBD). Fortunately many HBD techniques can be applied to commercial fabrication processes providing space craft designer with radiation tolerant Application Specific Integrated Circuits (ASICs) that can bridge the performance gap between the special HBP foundries and the commercial state-of-the-art performance.

Vacuum Mechatronics And Insvection For Self-Contained Manufacturing

Science.gov (United States)

Belinski, Steve E.; Shirazi, Majid; Seidel, Thomas E.; Hackwood, Susan

1990-02-01

The vacuum environment is increasingly being used in manufacturing operations, especially in the semiconductor industry. Shrinking linewidths and feature sizes dictate that cleanliness standards become continually more strict. Studies at the Center for Robotic Systems in Microelectronics (CRSM) indicate that a controlled vacuum enclosure can provide a superior clean environment. In addition, since many microelectronic fabrication steps are already carried out under vacuum, self-contained multichamber processing systems are being developed at a rapid pace. CRSM support of these systems includes the development of a research system, the Self-contained Automated Robotic Factory (SCARF), a vacuum-compatible robot, and investigations of particulate characterization in vacuum and inspection for multichamber systems. Successful development of complex and expensive multichamber systems is, to a great extent, dependent upon the discipline called vacuum mechatronics, which includes the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. Here the constituents of the vacuum mechatronics discipline are defined and reviewed in the context of the importance to self-contained in-vacuum manufacturing.

Additive Manufacturing for Cost Efficient Production of Compact Ceramic Heat Exchangers and Recuperators

Energy Technology Data Exchange (ETDEWEB)

Shulman, Holly [Ceralink Incorporated, Troy, NY (United States); Ross, Nicole [Ceralink Incorporated, Troy, NY (United States)

2015-10-30

An additive manufacture technique known as laminated object manufacturing (LOM) was used to fabricate compact ceramic heat exchanger prototypes. LOM uses precision CO2 laser cutting of ceramic green tapes, which are then precision stacked to build a 3D object with fine internal features. Modeling was used to develop prototype designs and predict the thermal response, stress, and efficiency in the ceramic heat exchangers. Build testing and materials analyses were used to provide feedback for the design selection. During this development process, laminated object manufacturing protocols were established. This included laser optimization, strategies for fine feature integrity, lamination fluid control, green handling, and firing profile. Three full size prototypes were fabricated using two different designs. One prototype was selected for performance testing. During testing, cross talk leakage prevented the application of a high pressure differential, however, the prototype was successful at withstanding the high temperature operating conditions (1300 °F). In addition, analysis showed that the bulk of the part did not have cracks or leakage issues. This led to the development of a module method for next generation LOM heat exchangers. A scale-up cost analysis showed that given a purpose built LOM system, these ceramic heat exchangers would be affordable for the applications.

Applications of focused ion beams in microelectronics

International Nuclear Information System (INIS)

Broughton, C.; Beale, M.I.J.; Deshmukh, V.G.I.

1986-04-01

We present the conclusions of the RSRE programme on the application of focused ion beams in microelectronics and review the literature published in this field. We discuss the design and performance of focused beam implanters and the viability of their application to semiconductor device fabrication. Applications in the areas of lithography, direct implantation and micromachining are discussed in detail. Comparisons are made between the use of focused ion beams and existing techniques for these fabrication processes with a strong emphasis placed on the relative throughputs. We present results on a novel spot size measurement technique and the effect of beam heating on resist. We also present the results of studies into implantation passivation of resist to oxygen plasma attack as basis for a dry development lithography scheme. A novel lithography system employing flood electron exposure from a photocathode which is patterned by a focused ion beam which can also be used to repair mask defects is considered. (author)

Microelectronic circuit design for energy harvesting systems

CERN Document Server

Di Paolo Emilio, Maurizio

2017-01-01

This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design. Provides a single-source reference to energy harvesting and its applications; Serves as a practical guide to microelectronics design for energy harvesting, with application to mobile power supplies; Enables readers to develop energy harvesting systems for wearable/mobile electronics.

Adhesion in microelectronics

CERN Document Server

Mittal, K L

2014-01-01

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesi

Fundamentals of semiconductor manufacturing and process control

CERN Document Server

May, Gary S

2006-01-01

A practical guide to semiconductor manufacturing from process control to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Control covers all issues involved in manufacturing microelectronic devices and circuits, including fabrication sequences, process control, experimental design, process modeling, yield modeling, and CIM/CAM systems. Readers are introduced to both the theory and practice of all basic manufacturing concepts. Following an overview of manufacturing and technology, the text explores process monitoring methods, including those that focus on product wafers and those that focus on the equipment used to produce wafers. Next, the text sets forth some fundamentals of statistics and yield modeling, which set the foundation for a detailed discussion of how statistical process control is used to analyze quality and improve yields. The discussion of statistical experimental design offers readers a powerful approach for systematically varying controllable p...

Robust design of microelectronics assemblies against mechanical shock, temperature and moisture effects of temperature, moisture and mechanical driving forces

CERN Document Server

Wong, E-H

2015-01-01

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr

Space station automation study: Automation requriements derived from space manufacturing concepts,volume 2

Science.gov (United States)

1984-01-01

Automation reuirements were developed for two manufacturing concepts: (1) Gallium Arsenide Electroepitaxial Crystal Production and Wafer Manufacturing Facility, and (2) Gallium Arsenide VLSI Microelectronics Chip Processing Facility. A functional overview of the ultimate design concept incoporating the two manufacturing facilities on the space station are provided. The concepts were selected to facilitate an in-depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, sensors, and artificial intelligence. While the cost-effectiveness of these facilities was not analyzed, both appear entirely feasible for the year 2000 timeframe.

77 FR 10373 - Greenhouse Gas Reporting Program: Electronics Manufacturing: Revisions to Heat Transfer Fluid...

Science.gov (United States)

2012-02-22

... Greenhouse Gas Reporting Program: Electronics Manufacturing: Revisions to Heat Transfer Fluid Provisions... technical revisions to the electronics manufacturing source category of the Greenhouse Gas Reporting Rule... final rule will also be available through the WWW on the EPA's Greenhouse Gas Reporting Program Web site...

Tube with helical grooving for a heat exchanger and its manufacturing process

International Nuclear Information System (INIS)

Yampolsky, J.S.

1980-01-01

This claim broadly concerns heat transfer tubes for heat exchangers of the kind described in the main patent specification and, in particular, a heat transfer tube and a process for manufacturing it. This tube includes a strip of metal, the opposite sides of which extend to form a certain number of longitudinal grooves of specific profile and height. This strip is helically wound and the lateral edges are joined butt to butt so as to be leak tight to fluids [fr

III-V microelectronics

CERN Document Server

Nougier, JP

1991-01-01

As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in particular is well suited for Ultra Large Scale Integration processes. However, a number of III-V compound semiconductor devices and circuits have recently been built, and the contributions in this volume are devoted to those types of materials, which offer a number of interesting properties. Taking into account the great variety of problems encountered and of their mutual correlations when fabricating a circuit or even a device, most of the aspects of III-V microelectronics, from fundamental p

Space station automation study. Automation requirements derived from space manufacturing concepts. Volume 1: Executive summary

Science.gov (United States)

1984-01-01

The two manufacturing concepts developed represent innovative, technologically advanced manufacturing schemes. The concepts were selected to facilitate an in depth analysis of manufacturing automation requirements in the form of process mechanization, teleoperation and robotics, and artificial intelligence. While the cost effectiveness of these facilities has not been analyzed as part of this study, both appear entirely feasible for the year 2000 timeframe. The growing demand for high quality gallium arsenide microelectronics may warrant the ventures.

Testing of high heat flux components manufactured by ENEA for ITER divertor

International Nuclear Information System (INIS)

Visca, Eliseo; Escourbiac, F.; Libera, S.; Mancini, A.; Mazzone, G.; Merola, M.; Pizzuto, A.

2009-01-01

ENEA is involved in the International Thermonuclear Experimental Reactor (ITER) R and D activities and in particular in the manufacturing of high heat flux plasma-facing components, such as the divertor targets. During the last years ENEA has manufactured actively cooled mock-ups by using different technologies, namely brazing, diffusion bonding and HIPping. A new manufacturing process that combines two main techniques PBC (Pre-Brazed Casting) and the HRP (Hot Radial Pressing) has been set up and widely tested. A full monoblock medium scale vertical target, having a straight CFC armoured part and a curved W armoured part, was manufactured using this process. The ultrasonic method was used for the non-destructive examinations performed during the manufacturing of the component, from the monoblock preparation up to the final mock-up assembling. The component was also examined by thermography on SATIR facility (CEA, France), afterwards it was thermal fatigue tested at FE200 (200 kW electron beam facility, CEA/AREVA France). The successful results of the thermal fatigue testing performed according the ITER requirements (10 MW/m 2 , 3000 cycles of 10 s on both CFC and W part, then 20/15 MW/m 2 , 2000 cycles of 10 s on CFC/W part, respectively) have confirmed that the developed process can be considerate a candidate for the manufacturing of monoblock divertor components. Furthermore, a 35-MW/m 2 Critical Heat Flux was measured at relevant thermal-hydraulics conditions at the end of the testing campaign. This paper reports the manufacturing route, the thermal fatigue testing results, the pre and post non-destructive examination and the destructive examination performed on the ITER vertical target medium scale mock-up. These activities were performed in the frame of EFDA contracts (04-1218 with CEA, 93-851 JN with AREVA and 03-1054 with ENEA).

Effect of Heat Treatment on the Properties of CoCrMo Alloy Manufactured by Selective Laser Melting

Science.gov (United States)

Guoqing, Zhang; Junxin, Li; Xiaoyu, Zhou; Jin, Li; Anmin, Wang

2018-05-01

To obtain medical implants with better mechanical properties, it is necessary to conduct studies on the heat treatment process of the selective laser melting (SLM) manufacturing parts. The differential scanning calorimetry method was used to study the heat treatment process of the phase transition of SLM CoCrMo alloy parts. The tensile properties were tested with a tensile test machine, the quantity of carbide precipitated after heat treatment was measured by energy-dispersive x-ray spectroscopy, and the tensile fracture morphology of the parts was investigated using SEM. The obtained results were: Mechanical properties in terms of elongation and tensile strength of CoCrMo alloy manufactured by SLM that had been heat-treated at 1200 °C for 2 h followed by cooling with water were not only higher than the national standard but also higher than the experimental results of the same batch of castings. The mechanism of fracture of parts manufactured by SLM without heat treatment was brittle fracture, whereas parts which had been heat-treated at 1200 °C for 2 h combined with water cooling and at 1200 °C for 1 h with furnace cooling suffered ductile fracture. This study provides the basis for defining the applications for which CoCrMo alloys manufactured by SLM are suitable within the field of medical implants.

RF and microwave microelectronics packaging II

CERN Document Server

Sturdivant, Rick

2017-01-01

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

International Nuclear Information System (INIS)

Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

2010-01-01

This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100 deg. C, 1300 deg. C and 1500 deg. C for about 20 hours using heating and cooling rates of 2 deg. C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

Thermal and Electrical Characterization of Alumina Substrate for Microelectronic Applications

Science.gov (United States)

Ahmad, S.; Ibrahim, A.; Alias, R.; Shapee, S. M.; Ambak, Z.; Zakaria, S. Z.; Yahya, M. R.; Mat, A. F. A.

2010-03-01

This paper reports the effect of sintering temperature on thermal and electrical properties of alumina material as substrate for microelectronic devices. Alumina materials in the form of green sheet with 1 mm thickness were sintered at 1100° C, 1300° C and 1500° C for about 20 hours using heating and cooling rates of 2° C/min. The densities were measured using densitometer and the microstructures of the samples were analyzed using SEM micrographs. Meanwhile thermal and electrical properties of the samples were measured using flash method and impedance analyzer respectively. It was found that thermal conductivity and thermal diffusivity of the substrate increases as sintering temperature increases. It was found also that the dielectric constant of alumina substrate increases as the sintering temperature increases.

Microelectronics from fundamentals to applied design

CERN Document Server

Di Paolo Emilio, Maurizio

2016-01-01

This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics.  Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design.  ·         Describes fundamentals of microelectronics design in an accessible manner; ·         Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; ·         Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; ·         Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.

Integrated Microelectronics and Photonics Active Cooling Technology (IMPACT)

National Research Council Canada - National Science Library

Bowers, John

2003-01-01

...) coolers and their integration with microelectronics and photonics. The majority of our research involves the development of this new technology through nanostructured materials design and growth...

Dictionary of microelectronics and microcomputer technology

International Nuclear Information System (INIS)

Attiyate, Y.H.; Shah, R.R.

1984-01-01

This bilingual dictionary (German-English and English-German) is to give the general public a clearer idea of the terminology of microelectronics, microcomputers, data processing, and computer science. Each part contains about 7500 terms frequently encountered in practice, about 2000 of which are supplemented by precise explanations. (orig./HP) [de

Problems in CEMA microelectronic cooperation noted

Science.gov (United States)

Grzybowski, J.; Kusinski, J.

1983-10-01

The development and market trends of products, which use large scale integrated circuits are discussed. Products such as pocket calculators, electronic wrist watches, telephones, and automobiles are used to illustrate the economic results of market saturation with specialized integrated circuits. The status of microelectronics in socialist countries in Europe is addressed.

Application of ionizing radiation processing in biomedical engineering and microelectronics

International Nuclear Information System (INIS)

Hongfej, H.; Jilan, W.

1988-01-01

The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristics reaction means such as crosslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become a important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this technique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics

Manufacture of a heat-resistant alloy with modified specifications for HTGR structural applications

International Nuclear Information System (INIS)

Sahira, K.; Kondo, T.; Takeiri, T.

1984-01-01

A method of manufacturing a nuclear grade nickel-base heat-resistant alloy in application to heliumcooled reactor primary circuit components has been developed. The Hastelloy-XR alloy, a version of Hastelloy-X, was made available by combining the basic studies of the oxidation behavior of Hastelloy-X and the improvement of manufacturing techniques. In the primary and remelting steps, the choice of appropriate processes was made by performing numerical analyses of the statistical deviation of both chemical composition and the products' mechanical properties. The feasibility of making larger electroslag remelting ingots with reasonable control of macrosegregation was examined by the calculation of a molten metal pool shape during melting. The hot workability of Hastelloy-XR was confirmed to be equivalent to that of Hastelloy-X and the importance of controlling the thermal and mechanical processes more closely was stressed in obtaining a higher level of quality assurance for the nuclear applications. The possibility of enhancing the high-temperature mechanical performance of Hastelloy-XR was suggested based on the preliminary test results with the heats manufactured with controlled boron content

Materials contamination control in the microelectronic industry

International Nuclear Information System (INIS)

Tardif, F.

1993-01-01

This paper deals with many aspects of the contamination of materials in the microelectronic industry. The contamination's control of chemicals, process gases, silicon and the survey of the ions free water's purity are treated. (TEC). 29 figs., 7 tabs

Government Microelectronics Assessment for Trust (GOMAT)

Science.gov (United States)

Berg, Melanie D.; LaBel, Kenneth A.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

Applications of ionizing radiation processing in biomedical engineering and microelectronics

International Nuclear Information System (INIS)

Ha Hongfei; Wu Jilan

1987-01-01

The applied radiation chemistry has made great contributions to the development of polymeric industrial materials by the characteristic reaction means such as corsslinking, graft copolymerization and low-temperature or solid-phase polymerization, and become an important field on peaceful use of atomic energy. A brief review on the applications of ionizing radiation processing in biomedical engineering and microelectronics is presented. The examples of this techique were the studies on biocompatible and biofunctional polymers for medical use and on resists of lithography in microelectronics. (author)

The influence of wavelength-dependent radiation in simulation of lamp-heated rapid thermal processing systems

Energy Technology Data Exchange (ETDEWEB)

Ting, A. [Sandia National Labs., Livermore, CA (United States). Computational Mechanics Dept.

1994-08-01

Understanding the thermal response of lamp-heated rapid thermal processing (RTP) systems requires understanding relatively complex radiation exchange among opaque and partially transmitting surfaces and materials. The objective of this paper is to investigate the influence of wavelength-dependent radiative properties. The examples used for the analysis consider axisymmetric systems of the kind that were developed by Texas Instruments (TI) for the Microelectronics Manufacturing Science and Technology (MMST) Program and illustrate a number of wavelength-dependent (spectral) effects. The models execute quickly on workstation class computing flatforms, and thus permit rapid comparison of alternative reactor designs and physical models. The fast execution may also permit the incorporation of these models into real-time model-based process control algorithms.

Manufacturing and thermomechanical testing of actively cooled all beryllium high heat flux test pieces

International Nuclear Information System (INIS)

Vasiliev, N.N.; Sokolov, Yu.A.; Shatalov, G.E.

1995-01-01

One of the problems affiliated to ITER high heat flux elements development is a problem of interface of beryllium protection with heat sink routinely made of copper alloys. To get rid of this problem all beryllium elements could be used as heat receivers in places of enhanced thermal loads. In accordance with this objectives four beryllium test pieces of two types have been manufactured in open-quotes Institute of Berylliumclose quotes for succeeding thermomechanical testing. Two of them were manufactured in accordance with JET team design; they are round open-quotes hypervapotron typeclose quotes test pieces. Another two ones are rectangular test sections with a twisted tape installed inside of the circular channel. Preliminary stress-strain analysis have been performed for both type of the test pieces. Hypervapotrons have been shipped to JET where they were tested on JET test bed. Thermomechanical testing of pieces of the type of open-quotes swirl tape inside of tubeclose quotes have been performed on Kurchatov Institute test bed. Chosen beryllium grade properties, some details of manufacturing, results of preliminary stress-strain analysis and thermomechanical testing of the test pieces open-quotes swirl tape inside of tubeclose quotes type are given in this report

Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea

Science.gov (United States)

Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

2015-01-01

Objectives Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Methods Based on claim data from the National Health Insurance (2008–2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Results Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Conclusions Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results. PMID:25938673

Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

Directory of Open Access Journals (Sweden)

Inah Kim

Full Text Available Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea.Based on claim data from the National Health Insurance (2008-2012, we estimated age-specific rates of spontaneous abortion (SAB and menstrual aberration (MA among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs were estimated.Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties.Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

Reproductive Hazards Still Persist in the Microelectronics Industry: Increased Risk of Spontaneous Abortion and Menstrual Aberration among Female Workers in the Microelectronics Industry in South Korea.

Science.gov (United States)

Kim, Inah; Kim, Myoung-Hee; Lim, Sinye

2015-01-01

Despite the global expansion of supply chains and changes to the production process, few studies since the mid-1990 s and 2000s have examined reproductive risks of the microelectronics industry; we examined the reproductive risks among female microelectronics workers in South Korea. Based on claim data from the National Health Insurance (2008-2012), we estimated age-specific rates of spontaneous abortion (SAB) and menstrual aberration (MA) among women aged 20 to 39 years. We compared data between microelectronics workers and three different control groups: economically inactive women, the working population as a whole, and workers employed in the bank industry. For an effect measure, age-stratified relative risks (RRs) were estimated. Female workers in the microelectronics industry showed significantly higher risk for SAB and MA compared to control groups. The RRs for SAB with reference to economically inactive women, working population, and bank workers in their twenties were 1.57, 1.40, and 1.37, respectively, and the RRs for MA among females in their twenties were 1.54, 1.38, and 1.48, respectively. For women in their thirties, RRs for SAB were 1.58, 1.67, and 1.13, and those for MA were 1.25, 1.35, and 1.23 compared to the three control populations, respectively. All RRs were statistically significant at a level of 0.05, except for the SAB case comparison with bank workers in their thirties. Despite technical innovations and health and safety measures, female workers in microelectronics industry in South Korea have high rates of SAB and MA, suggesting continued exposure to reproductive hazards. Further etiologic studies based on primary data collection and careful surveillance are required to confirm these results.

Materials science in microelectronics II the effects of structure on properties in thin films

CERN Document Server

Machlin, Eugene

2005-01-01

The subject matter of thin-films - which play a key role in microelectronics - divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: Electrical properties Magnetic properties Optical properties Mechanical properties Mass transport properties Interface and junction properties Defects and properties Captures the importance of thin films to microelectronic development Examines the cause / effect relationship of structure on thin film properties.

Development, manufacturing and testing of a gas-loaded variable conductance methanol heat pipe

Science.gov (United States)

Vanbuggenum, R. I. J.; Daniels, D. H. W.

1987-02-01

The experimental technology required to measure the performance of moderate temperature heat pipes is presented. The heat pipe manufacturing process is described. The hydrodynamic characteristics of the porous structure inside the heat pipe envelope were examined using a specially developed test rig, based upon a steady-state evaporation test. A fully automated test facility was developed and validated by testing constant conductance and variable conductance heat pipes (VCHP). Theoretical performance predictions are illustrated in terms of pressure, depicted in 3D-plots, and compared with the test results of the heat pipe performance tests. The design of the VCHP was directed towards the verification of the VCHP mathematical model. The VCHP design is validated and ready for the final testing and model verification.

Improved method for detection of “hot spots” in microelectronic devices

Directory of Open Access Journals (Sweden)

Popov V. M.

2008-06-01

Full Text Available New method of liquid crystal thermography of “hot spots” in crystals of microelectronic products have been developed. The method is based on the use of local cholesteric phase image of “hot spot” in transparent smectic phase of cholesteric liquid crystal against a background of clearly visible topological elements on the surface of microelectronic device crystal. Examples of “hot spot” images in crystals of different types of integrated circuits are shown.

High Efficiency Microchannel Diamond Heat Sinks, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — While absolute power levels in microelectronic devices are relatively modest (a few tens to a few hundred watts), heat fluxes can be significant (~50 W/cm2 in...

Numerical study on boiling heat transfer enhancement in a microchannel heat exchanger

International Nuclear Information System (INIS)

Jeon, Jin Ho; Suh, Young Ho; Son, Gi Hun

2008-01-01

Flow boiling in a microchannel heat exchanger has received attention as an effective heat removal mechanism for high power-density microelectronics. Despite extensive experimental studied, the bubble dynamics coupled with boiling heat transfer in a microchannel heat exchanger is still not well understood due to the technological difficulties in obtaining detailed measurements of microscale two-phase flows. In this study, complete numerical simulations are performed to further clarify the dynamics of flow boiling in a microchannel heat exchanger. The level set method for tracking the liquid-vapor interface is modified to include the effects of phase change and contact angle and to treat an immersed solid surface. Based on the numerical results, the effects of modified channel shape on the bubble growth and heat transfer are quantified

Microelectronics used for Semiconductor Imaging Detectors

CERN Document Server

Heijne, Erik H M

2010-01-01

Semiconductor crystal technology, microelectronics developments and nuclear particle detection have been in a relation of symbiosis, all the way from the beginning. The increase of complexity in electronics chips can now be applied to obtain much more information on the incident nuclear radiation. Some basic technologies are described, in order to acquire insight in possibilities and limitations for the most recent detectors.

Progress in nuclear measuring and experimental techniques by application of microelectronics. 1

International Nuclear Information System (INIS)

Meiling, W.

1984-01-01

In the past decade considerable progress has been made in nuclear measuring and experimental techniques by developing position-sensitive detector systems and widely using integrated circuits and microcomputers for data acquisition and processing as well as for automation of measuring processes. In this report which will be published in three parts those developments are reviewed and demonstrated on selected examples. After briefly characterizing microelectronics, the use of microelectronic elements for radiation detectors is reviewed. (author)

Prototype Vent Gas Heat Exchanger for Exploration EVA - Performance and Manufacturing Characteristics

Science.gov (United States)

Quinn, Gregory J.; Strange, Jeremy; Jennings, Mallory

2013-01-01

NASA is developing new portable life support system (PLSS) technologies, which it is demonstrating in an unmanned ground based prototype unit called PLSS 2.0. One set of technologies within the PLSS provides suitable ventilation to an astronaut while on an EVA. A new component within the ventilation gas loop is a liquid-to-gas heat exchanger to transfer excess heat from the gas to the thermal control system s liquid coolant loop. A unique bench top prototype heat exchanger was built and tested for use in PLSS 2.0. The heat exchanger was designed as a counter-flow, compact plate fin type using stainless steel. Its design was based on previous compact heat exchangers manufactured by United Technologies Aerospace Systems (UTAS), but was half the size of any previous heat exchanger model and one third the size of previous liquid-to-gas heat exchangers. The prototype heat exchanger was less than 40 cubic inches and weighed 2.57 lb. Performance of the heat exchanger met the requirements and the model predictions. The water side and gas side pressure drops were less 0.8 psid and 0.5 inches of water, respectively, and an effectiveness of 94% was measured at the nominal air side pressure of 4.1 psia.

Physics in microelectronics and microelectronics in physics

International Nuclear Information System (INIS)

Mooser, E.

1983-01-01

Modern semiconductor technology and its many different facets such as micro-electronics, optoelectronics, integrated optics, solar energy conversion, etc... have their origin in solid state physics. However, because of their enormous economic impact, their development has been so rapid and has lead to such a high degree of complexity and sophistication, that to the newcomer in the field, the links between solid state electronics and solid state physics are no longer evident. The processes involved in the production of integrated circuits and solid state lasers afford very instructive examples on which to demostrate the impact of physics on semiconductor technology. Processes discussed include: Purification of silicon; Crystal growth; Liquid and vapour phase epitaxy; Photo- and electronbeam lithography; Mask production; Wet and dry etching; Doping and metal deposition, etc... The inverse phenomenon, i.e. the impact of semiconductor technology on physics will be demonstrated on examples involving two-dimensional electron gases. Such gases can readily be obtained in 'synthetic' layer structures, produced by molecular beam epitaxy and in the depletion layers of field-effect transistors with MOS geometry. the examples discussed involve the multiple potential well laser and the 'von Klitzing experiment'. (Author) [pt

Microelectronics in power electronics and electrical drives

Energy Technology Data Exchange (ETDEWEB)

1982-01-01

From October, 1214, 1982 at Darmstadt (FRG) a meeting took place on ''Microelectronics in power electronics and Electrical Drives''. This volume contains the papers of the 65 lectures, held at the symposium. For each of the 10 papers dealing with problems on electric-powered vehicles a separate subject analysis has been carried out.

Empirical component model to predict the overall performance of heating coils: Calibrations and tests based on manufacturer catalogue data

International Nuclear Information System (INIS)

Ruivo, Celestino R.; Angrisani, Giovanni

2015-01-01

Highlights: • An empirical model for predicting the performance of heating coils is presented. • Low and high heating capacity cases are used for calibration. • Versions based on several effectiveness correlations are tested. • Catalogue data are considered in approach testing. • The approach is a suitable component model to be used in dynamic simulation tools. - Abstract: A simplified methodology for predicting the overall behaviour of heating coils is presented in this paper. The coil performance is predicted by the ε-NTU method. Usually manufacturers do not provide information about the overall thermal resistance or the geometric details that are required either for the device selection or to apply known empirical correlations for the estimation of the involved thermal resistances. In the present work, heating capacity tables from the manufacturer catalogue are used to calibrate simplified approaches based on the classical theory of heat exchangers, namely the effectiveness method. Only two reference operating cases are required to calibrate each approach. The validity of the simplified approaches is investigated for a relatively high number of operating cases, listed in the technical catalogue of a manufacturer. Four types of coils of three sizes of air handling units are considered. A comparison is conducted between the heating coil capacities provided by the methodology and the values given by the manufacturer catalogue. The results show that several of the proposed approaches are suitable component models to be integrated in dynamic simulation tools of air conditioning systems such as TRNSYS or EnergyPlus

Manufacturing A Refrigerator with Heat Recovery Unit

Directory of Open Access Journals (Sweden)

Mustafa Mohammed Kadhim

2018-02-01

Full Text Available This study aims to exploite the rejected heating energy from condenser and benefit from it to reheat the foods and other materials. It can also be employed to improve the coefficient of performance of a refrigerator at the same time by using approximately the same consumption electrical energy used to operate the compressor and refrigerator in general. This idea has been implemented by manufacturing of a refrigerator with using additional part has the same metal and condenser pipe diameters but its surface area does not exceed 40% from total surface area of the condenser and its design as an insulated cabinet from all sides to prevent heat leakage through it and located between the compressor and the condenser. Small electrical fan has been added inside this cabinet to provide a suitable air circulation and a homogenous temperature distribution inside the cabinet space. It is expected that the super heating energy of refrigerant (R134a which comes out of the compressor would be removed  inside this cabinet and this insist to condensate the refrigerant (cooling fluid with a rate higher than that used in the normal refrigerator only. Three magnetic valves have been used in order to control the refrigerant flow in state of operation the refrigerator only or to gather with heating cabinet. To measure the temperatures at each process of the simple vapor compression refrigeration cycle, nine temperature sensors at input and output of each compressor, condenser and an evaporator in additional to input of cabinet and inside it and on evaporator surface have been provided. Five pressure gages have been used to measure the value of pressure and compare it for the two states of operation. The consumption of electrical energy  can be calculated by adding an ammeter and a voltmeter and compare between the consumption energy of both states. The obtained results show that there is an improvement in the coeffecient of performance in state of operation the

Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach

CERN Document Server

Laurila, Tomi; Paulasto-Kröckel, Mervi; Turunen, Markus; Mattila, Toni T; Kivilahti, Jorma

2012-01-01

Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep un...

A comparison of the heat transfer capabilities of two manufacturing methods for high heat flux water-cooled devices

International Nuclear Information System (INIS)

McKoon, R.H.

1986-10-01

An experimental program was undertaken to compare the heat transfer characteristics of water-cooled copper devices manufactured via conventional drilled passage construction and via a technique whereby molten copper is cast over a network of preformed cooling tubes. Two similar test blocks were constructed; one using the drilled passage technique, the other via casting copper over Monel pipe. Each test block was mounted in a vacuum system and heated uniformly on the top surface using a swept electron beam. From the measured absorbed powers and resultant temperatures, an overall heat transfer coefficient was calculated. The maximum heat transfer coefficient calculated for the case of the drilled passage test block was 2534 Btu/hr/ft 2 / 0 F. This corresponded to an absorbed power density of 320 w/cm 2 and resulted in a maximum recorded copper temperature of 346 0 C. Corresponding figures for the cast test block were 363 Btu/hr/ft 2 / 0 F, 91 w/cm 2 , and 453 0 C

ENERGY EFFICIENCY OF ELECTRIC HEATING OF REACTORS IN THE MANUFACTURE OF VARNISHES AND PAINTS

Directory of Open Access Journals (Sweden)

Tovajniansky L.L.

2014-08-01

Full Text Available The drawbacks of the traditional design of the heaters, which make known imperfections in manufacturing processes, realized with the use of electric heating. This determines the need for a radically new design of the heating devices. Created by high-temperature ceramics, characterized by abnormally high thermal stability and clarified the parameters that allow a certain degree change its thermal conductivity. On this basis the contact type ceramic heaters that provide thermal flow direction using different materials in the body of the heater - of high thermal conductivity, the surface facing the heat transfer and low which differs opposite sides of the heater are designed to eliminate the dissipation of heat into the surrounding space. This made it possible to equip the modern production paint industry energy efficient heating equipment with explosion and fire heating system reactors.

International Conference on Microelectronics, Electromagnetics and Telecommunications

CERN Document Server

Rao, N; Kumar, S; Raj, C; Rao, V; Sarma, G

2016-01-01

This volume contains 73 papers presented at ICMEET 2015: International Conference on Microelectronics, Electromagnetics and Telecommunications. The conference was held during 18 – 19 December, 2015 at Department of Electronics and Communication Engineering, GITAM Institute of Technology, GITAM University, Visakhapatnam, INDIA. This volume contains papers mainly focused on Antennas, Electromagnetics, Telecommunication Engineering and Low Power VLSI Design.

Assessing the heat stress of brick-manufacturing units’ workers based on WBGT index in Qom city

Directory of Open Access Journals (Sweden)

R. Hajizadeh

2015-01-01

Full Text Available Introduction: Heat stress is considered as a serious risk factor to the health and safety of workers in most working environments, especially in outdoor works and jobs that workers are exposed to heat due to the working process. This study aimed to evaluate heat stress among workers of brick-manufacturing units in Qom city based on WBGT index as well as the relationship between WBGT and physiological indicators. .Material and Method: The present study was conducted in 40 brick-manufacturing units in Qom city. WBGT measurements were performed according to ISO7243 standard. Physiological responses of 184 workers (up to 5 people per unit and also atmospheric parameters were measured. The physiological responses included oral temperature, skin temperature, and temperature for the carotid artery of the ear, heart rate, systolic and diastolic blood pressure. Statistical analysis was done using SPSS software version 16. .Result: Mean WBGT index for various brick-manufacturing jobs including firing, manual material handling, working with conveyors, molding, and tempering were 30.8 °C, 26.74 °C 26.58 °C and 24.25 °C, respectively and the average WBGT was estimated 27.98 °C. WBGT levels measured in all units exceeded the level provided in ISO7243 standard. The highest mean WBGT was belonged to kiln section (30.8 °C. The mean WBGT at three heights of head, abdomen and legs were not statistically different (using t-test. The correlation coefficients between mean WBGT and mean oral, skin and ears temperatures were 0.203, 0.319, and 0.490, respectively, with the highest correlation belonged to the carotid arteries of ears. Moreover, WBGT showed no significant association with the mean heart rate, systolic, and diastolic blood pressure (P-value>0.05. Indoor and outdoor WBGT index was significantly different (P-value<0.05. .Conclusion: The level of heat stress in all brick-manufacturing units was higher than the recommended limits, and the workers in kiln

CRRES microelectronics test package (MEP)

International Nuclear Information System (INIS)

Mullen, E.G.; Ray, K.P.

1993-01-01

The Microelectronics Test Package (MEP) flown on board the Combined Release and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and annealing). A description of the experiment, the method of testing devices, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the March 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package

Radiation effects on microelectronics in space

International Nuclear Information System (INIS)

Srour, J.R.; McGarrity, J.M.

1988-01-01

The basic mechanisms of space radiation effects on microelectronics are reviewed in this paper. Topics discussed include the effects of displacement damage and ionizing radiation on devices and circuits, single event phenomena, dose enhancement, radiation effects on optoelectronic devices and passive components, hardening approaches, and simulation of the space radiation environment. A summary is presented of damage mechanisms that can cause temporary or permanent failure of devices and circuits operating in space

Manufacturing of tailored tubes with a process integrated heat treatment

Science.gov (United States)

Hordych, Illia; Boiarkin, Viacheslav; Rodman, Dmytro; Nürnberger, Florian

2017-10-01

The usage of work-pieces with tailored properties allows for reducing costs and materials. One example are tailored tubes that can be used as end parts e.g. in the automotive industry or in domestic applications as well as semi-finished products for subsequent controlled deformation processes. An innovative technology to manufacture tubes is roll forming with a subsequent inductive heating and adapted quenching to obtain tailored properties in the longitudinal direction. This processing offers a great potential for the production of tubes with a wide range of properties, although this novel approach still requires a suited process design. Based on experimental data, a process simulation is being developed. The simulation shall be suitable for a virtual design of the tubes and allows for gaining a deeper understanding of the required processing. The model proposed shall predict microstructural and mechanical tube properties by considering process parameters, different geometries, batch-related influences etc. A validation is carried out using experimental data of tubes manufactured from various steel grades.

Design and manufacture of ceramic heat pipes for high temperature applications

International Nuclear Information System (INIS)

Meisel, Peter; Jobst, Matthias; Lippmann, Wolfgang; Hurtado, Antonio

2015-01-01

Heat exchangers based on ceramic heat pipes were designed for use under highly abrasive and corrosive atmospheres at temperatures in the range of 800–1200 °C for high-temperature power-engineering applications. The presented heat pipes are gravity assisted and based on a multi-layer concept comprising a ceramic cladding and an inner metal tube that contains sodium as the working fluid. Hermetical encapsulation of the working fluid was achieved by electron-beam welding of the inner metal tube. Subsequently, closure of the surrounding ceramic tube was performed by laser brazing technology using a glass solder. Temperature resistance and functionality of the manufactured ceramic thermosyphons could be confirmed experimentally in a hot combustion gas atmosphere at temperatures up to 1100 °C. The ceramic tubes used had an outer diameter of 22 mm and a total length of 770 mm. The measured axial heat transfer of the ceramic gravity assisted heat pipes at the stationary operating point with cold/hot gas temperature of 100 °C/900 °C was 400 W. The result of the calculation using the created mathematical model amounted to 459 W. - Highlights: • Heat-pipe design consists of a ceramic shell and an inner metallic tube. • Laser brazing technology is suitable to seal ceramic heat-pipes. • Thermal characteristic of double wall thermosyphon was modelled using FEM code. • Experimental investigations demonstrated functionality of double wall thermosyphons

Applicability of LET to single events in microelectronic structures

Science.gov (United States)

Xapsos, Michael A.

1992-12-01

LET is often used as a single parameter to determine the energy deposited in a microelectronic structure by a single event. The accuracy of this assumption is examined for ranges of ion energies and volumes of silicon appropriate for modern microelectronics. It is shown to be accurate only under very restricted conditions. Significant differences arise because (1) LET is related to energy lost by the ion, not energy deposited in the volume; and (2) LET is an average value and does not account for statistical variations in energy deposition. Criteria are suggested for determining when factors other than LET should be considered, and new analytical approaches are presented to account for them. One implication of these results is that improvements can be made in space upset rate predictions by incorporating the new methods into currently used codes such as CREME and CRUP.

All fiber cladding mode stripper with uniform heat distribution and high cladding light loss manufactured by CO2 laser ablation

Science.gov (United States)

Jebali, M. A.; Basso, E. T.

2018-02-01

Cladding mode strippers are primarily used at the end of a fiber laser cavity to remove high-power excess cladding light without inducing core loss and beam quality degradation. Conventional manufacturing methods of cladding mode strippers include acid etching, abrasive blasting or laser ablation. Manufacturing of cladding mode strippers using laser ablation consist of removing parts of the cladding by fused silica ablation with a controlled penetration and shape. We present and characterize an optimized cladding mode stripper design that increases the cladding light loss with a minimal device length and manufacturing time. This design reduces the localized heat generation by improving the heat distribution along the device. We demonstrate a cladding mode stripper written on a 400um fiber with cladding light loss of 20dB, with less than 0.02dB loss in the core and minimal heating of the fiber and coating. The manufacturing process of the designed component is fully automated and takes less than 3 minutes with a very high throughput yield.

Possibilities for mixed mode chip manufacturing in EUROPRACTICE

Science.gov (United States)

Das, C.

1997-02-01

EUROPRACTICE is an EC initiative under the ESPRIT programme which aims to stimulate the wider exploitation of state-of-the-art microelectronics technologies by European industry and to enhance European industrial competitiveness in the global market-place. Through EUROPRACTICE, the EC has created a range of Basic Services that offer users a cost-effective and flexible means of accessing three main microelectronics-based technologies: Application Specific Integrated Circuit (ASICs), Multi-Chip Modules (MCMs) and Microsystems. EUROPRACTICE Basic Services reduce the cost and risk for companies wishing to begin using these technologies. EUROPRACTICE offers a fully supported, low cost route for companies to design and fabricate ASICs for their individual applications. Low cost is achieved by consolidating designs from many users onto a single semiconductor wafer (MPW: Multi Project Wafer). The EUROPRACTICE IC Manufacturing Service (ICMS) offers a broad range of fabrication technologies including CMOS, BiCMOS and GaAs. The Service extends from enabling users to produce prototype ASICs for testing and evaluation, through to low-volume production runs.

24 CFR 3280.506 - Heat loss/heat gain.

Science.gov (United States)

2010-04-01

... 24 Housing and Urban Development 5 2010-04-01 2010-04-01 false Heat loss/heat gain. 3280.506... URBAN DEVELOPMENT MANUFACTURED HOME CONSTRUCTION AND SAFETY STANDARDS Thermal Protection § 3280.506 Heat loss/heat gain. The manufactured home heat loss/heat gain shall be determined by methods outlined in...

Labour-Saving versus Work-Amplifying Effects of Micro-Electronics.

Science.gov (United States)

Watanabe, Susumu

1986-01-01

This article argues that the labor-displacement effect of microelectronic machinery, especially numerically controlled machine tools and robots, has been exaggerated and that people tend to confuse the impact of intensified international competition with that of the new technology. (Author/CT)

Manufacturing microsystems-on-a-chip with 5-level surface micromachining technology

Energy Technology Data Exchange (ETDEWEB)

Sniegowski, J.; Rodgers, M.S.

1998-05-01

An agile microsystem manufacturing technology has been developed that provides unprecedented 5 levels of independent polysilicon surface-micromachine films for the designer. Typical surface-micromachining processes offer a maximum of 3 levels, making this the most complex surface-micromachining process technology developed to date. Leveraged from the extensive infrastructure present in the microelectronics industry, the manufacturing method of polysilicon surface-micromachining offers similar advantages of high-volume, high-reliability, and batch-fabrication to microelectromechanical systems (MEMS) as has been accomplished with integrated circuits (ICs). These systems, comprised of microscopic-sized mechanical elements, are laying the foundation for a rapidly expanding, multi-billion dollar industry 2 which impacts the automotive, consumer product, and medical industries to name only a few.

ICMCS-2014: 8. international conference on microelectronics and computer science and 5. conference of physicists of Moldova. Proceedings

International Nuclear Information System (INIS)

Canter, V.; Balmus, I.

2014-10-01

This book includes communications presented at the 8th International conference on microelectronics and computer science. The papers presented in the book cover certain issues of microelectronics, modern theoretical and experimental physics and advanced technology.

Modeling biology with HDL languages: a first step toward a genetic design automation tool inspired from microelectronics.

Science.gov (United States)

Gendrault, Yves; Madec, Morgan; Lallement, Christophe; Haiech, Jacques

2014-04-01

Nowadays, synthetic biology is a hot research topic. Each day, progresses are made to improve the complexity of artificial biological functions in order to tend to complex biodevices and biosystems. Up to now, these systems are handmade by bioengineers, which require strong technical skills and leads to nonreusable development. Besides, scientific fields that share the same design approach, such as microelectronics, have already overcome several issues and designers succeed in building extremely complex systems with many evolved functions. On the other hand, in systems engineering and more specifically in microelectronics, the development of the domain has been promoted by both the improvement of technological processes and electronic design automation tools. The work presented in this paper paves the way for the adaptation of microelectronics design tools to synthetic biology. Considering the similarities and differences between the synthetic biology and microelectronics, the milestones of this adaptation are described. The first one concerns the modeling of biological mechanisms. To do so, a new formalism is proposed, based on an extension of the generalized Kirchhoff laws to biology. This way, a description of all biological mechanisms can be made with languages widely used in microelectronics. Our approach is therefore successfully validated on specific examples drawn from the literature.

Materials science in microelectronics I the relationships between thin film processing and structure

CERN Document Server

Machlin, Eugene

2005-01-01

Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship - that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer - determines the ultimate structure of the thin film, and thus its properties. This

An Approach for Impression Creep of Lead Free Microelectronic Solders

Science.gov (United States)

Anastasio, Onofrio A.

2002-06-01

Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

Understanding microelectronics a top-down approach

CERN Document Server

Maloberti, Franco

2011-01-01

The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today's students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions,

Progress of High Heat Flux Component Manufacture and Heat Load Experiments in China

Energy Technology Data Exchange (ETDEWEB)

Liu, X.; Lian, Y.; Xu, Z.; Chen, J.; Chen, L.; Wang, Q.; Duan, X., E-mail: xliu@swip.ac.cn [Southwestern Institute of Physics, Chengu (China); Luo, G. [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei (China); Yan, Q. [University of Science and Technology Beijing, Beijing (China)

2012-09-15

Full text: High heat flux components for first wall and divertor are the key subassembly of the present fusion experiment apparatus and fusion reactors in the future. It is requested the metallurgical bonding among the plasma facing materials (PFMs), heat sink and support materials. As to PFMs, ITER grade vacuum hot pressed beryllium CN-G01 was developed in China and has been accepted as the reference material of ITER first wall. Additionally pure tungsten and tungsten alloys, as well as chemical vapor deposition (CVD) W coating are being developed for the aims of ITER divertor application and the demand of domestic fusion devices, and significant progress has been achieved. For plasma facing components (PFCs), high heat flux components used for divertor chamber are being studied according to the development program of the fusion experiment reactor of China. Two reference joining techniques of W/Cu mockups for ITER divertor chamber are being developed, one is mono-block structure by pure copper casting of tungsten surface following by hot iso-static press (HIP), and another is flat structure by brazing. The critical acceptance criteria of high heat flux components are their high heat load performance. A 60 kW Electron-beam Material testing Scenario (EMS-60) has been constructed at Southwestern Institute of Physics (SWIP),which adopts an electron beam welding gun with maximum energy of 150 keV and 150 x 150 mm{sup 2} scanning area by maximum frame rate of 30 kHz. Furthermore, an Engineering Mockup testing Scenario (EMS-400) facility with 400 kW electron-beam melting gun is under construction and will be available by the end of this year. After that, China will have the comprehensive capability of high heat load evaluation from PFMs and small-scale mockups to engineering full scale PFCs. A brazed W/CuCrZr mockup with 25 x 25 x 40 mm{sup 3} in dimension was tested at EMS-60. The heating and cooling time are 10 seconds and 15 seconds, respectively. The experiment

Lessons learned from early microelectronics production at Sandia National Laboratories

Energy Technology Data Exchange (ETDEWEB)

Weaver, H.T.

1998-02-01

During the 1980s Sandia designed, developed, fabricated, tested, and delivered hundreds of thousands of radiation hardened Integrated Circuits (IC) for use in weapons and satellites. Initially, Sandia carried out all phases, design through delivery, so that development of next generation ICs and production of current generation circuits were carried out simultaneously. All this changed in the mid-eighties when an outside contractor was brought in to produce ICs that Sandia developed, in effect creating a crisp separation between development and production. This partnership had a severe impact on operations, but its more damaging effect was the degradation of Sandia`s microelectronics capabilities. This report outlines microelectronics development and production in the early eighties and summarizes the impact of changing to a separate contractor for production. This record suggests that low volume production be best accomplished within the development organization.

Heat transfer and material flow during laser assisted multi-layer additive manufacturing

International Nuclear Information System (INIS)

Manvatkar, V.; De, A.; DebRoy, T.

2014-01-01

A three-dimensional, transient, heat transfer, and fluid flow model is developed for the laser assisted multilayer additive manufacturing process with coaxially fed austenitic stainless steel powder. Heat transfer between the laser beam and the powder particles is considered both during their flight between the nozzle and the growth surface and after they deposit on the surface. The geometry of the build layer obtained from independent experiments is compared with that obtained from the model. The spatial variation of melt geometry, cooling rate, and peak temperatures is examined in various layers. The computed cooling rates and solidification parameters are used to estimate the cell spacings and hardness in various layers of the structure. Good agreement is achieved between the computed geometry, cell spacings, and hardness with the corresponding independent experimental results.

Numerical investigation of heat transfer in Plastic Leaded Chip ...

African Journals Online (AJOL)

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit ...

Calculation of cracking under pulsed heat loads in tungsten manufactured according to ITER specifications

International Nuclear Information System (INIS)

Arakcheev, A.S.; Skovorodin, D.I.; Burdakov, A.V.; Shoshin, A.A.; Polosatkin, S.V.; Vasilyev, A.A.; Postupaev, V.V.; Vyacheslavov, L.N.; Kasatov, A.A.; Huber, A.; Mertens, Ph; Wirtz, M.; Linsmeier, Ch; Kreter, A.; Löwenhoff, Th; Begrambekov, L.; Grunin, A.; Sadovskiy, Ya

2015-01-01

A mathematical model of surface cracking under pulsed heat load was developed. The model correctly describes a smooth brittle–ductile transition. The elastic deformation is described in a thin-heated-layer approximation. The plastic deformation is described with the Hollomon equation. The time dependence of the deformation and stresses is described for one heating–cooling cycle for a material without initial plastic deformation. The model can be applied to tungsten manufactured according to ITER specifications. The model shows that the stability of stress-relieved tungsten deteriorates when the base temperature increases. This proved to be a result of the close ultimate tensile and yield strengths. For a heat load of arbitrary magnitude a stability criterion was obtained in the form of condition on the relation of the ultimate tensile and yield strengths.

Micro-electronics and employment in the Japanese automobile industry.

OpenAIRE

Watanabe, S

1984-01-01

ILO pub-WEP pub. Working paper on the employment effects of microelectronics technological change and industrial robots in the motor vehicle industry in Japan - examines industrial processes, labour productivity, job requirements of automobile workers, effects on the subcontracting system and small scale industry, diffusion patterns and prospects, etc. Bibliography, references and statistical tables.

Optimization of heat treatment parameters for additive manufacturing and gravity casting AlSi10Mg alloy

Science.gov (United States)

Girelli, L.; Tocci, M.; Montesano, L.; Gelfi, M.; Pola, A.

2017-11-01

Additive manufacturing of metals is a production process developed in the last few years to realize net shape components with complex geometry and high performance. AlSi10Mg is one of the most widely used aluminium alloys, both in this field and in conventional foundry processes, for its significant mechanical properties combined with good corrosion resistance. In this paper the effect of heat treatment on AlSi10Mg alloy was investigated. Solution and ageing treatments were carried out with different temperatures and times on samples obtained by direct metal laser sintering and gravity casting in order to compare their performance. Microstructural analyses and hardness tests were performed to investigate the effectiveness of the heat treatment. The results were correlated to the sample microstructure and porosity, analysed by means of optical microscopy and density measurements. It was found that, in the additive manufactured samples, the heat treatment can reduce significantly the performance of the alloy also because of the increase of porosity due to entrapped gas during the deposition technique and that the higher the solution temperature the higher the increase of such defects. A so remarkable effect was not found in the conventional cast alloy.

Microelectronics materials characterization studies at the Cornell TRIGA Reactor

International Nuclear Information System (INIS)

McGuire, Stephen C.

1992-01-01

The Cornell program of microelectronics materials characterization by neutron activation analysis (NAA) is described. Experimental details and results from the successful application of NAA to silicon germanium circuit structures and nickel silicide layers are presented. In doing so, the potential for using X rays from isotopes that decay by electron capture is demonstrated. (author)

Inactivation of 12 viruses by heating steps applied during manufacture of a hepatitis B vaccine

NARCIS (Netherlands)

Lelie, P. N.; Reesink, H. W.; Lucas, C. J.

1987-01-01

The efficacy of two heating cycles (90 sec at 103 degrees C and 10 hr at 65 degrees C) used during manufacture of a plasma-derived hepatitis-B vaccine was validated for the inactivation of 12 virus families. A period of 15 min warming up to 65 degrees C had already completely inactivated

Operation of arc heating furnace on manufacturing gigantic ingots and segregation of gigantic ingots

International Nuclear Information System (INIS)

Niimi, Takayasu; Okamura, Masayoshi

1976-01-01

The techniques and procedure for manufacturing gigantic ingots heavier than 200 t are described. Especially, practical results of an arc heating furnace which plays an important role in the procedure and segregation of gigantic ingots are discussed in detail. By appropriate operations of the arc heating furnance, hydrogen and phosphorus are kept unchanged, and oxygen and sulphur decrease to very low levels. Furthermore, the temperature can be accurately controlled. The application of multipour technique reduces segregation and its degree is dependent on kinds of steel. V-segregation and inverted V-segregation in steel deoxidized with carbon in vacuum seem to be very slight. (auth.)

Elastocaloric cooling of additive manufactured shape memory alloys with large latent heat

International Nuclear Information System (INIS)

Hou, Huilong; Stasak, Drew; Hasan, Naila Al; Takeuchi, Ichiro; Simsek, Emrah; Ott, Ryan; Cui, Jun; Qian, Suxin

2017-01-01

The stress-induced martensitic phase transformation of shape memory alloys (SMAs) is the basis for elastocaloric cooling. Here we employ additive manufacturing to fabricate TiNi SMAs, and demonstrate compressive elastocaloric cooling in the TiNi rods with transformation latent heat as large as 20 J g −1 . Adiabatic compression on as-fabricated TiNi displays cooling Δ T as high as  −7.5 °C with recoverable superelastic strain up to 5%. Unlike conventional SMAs, additive manufactured TiNi SMAs exhibit linear superelasticity with narrow hysteresis in stress–strain curves under both adiabatic and isothermal conditions. Microstructurally, we find that there are Ti 2 Ni precipitates typically one micron in size with a large aspect ratio enclosing the TiNi matrix. A stress transfer mechanism between reversible phase transformation in the TiNi matrix and mechanical deformation in Ti 2 Ni precipitates is believed to be the origin of the unique superelasticity behavior. (paper)

Quality politics: an immaterial investment for companies in (micro)electronics

Science.gov (United States)

Bacivarov, I. C.; Lupan, R.; Robledo, C.; Bacivarov, Angelica

2010-11-01

With the globalization of the markets and the growth of competitiveness in the manufacturing sector, quality has become a key factor of success. Quality is particularly important for the companies which activate in the micro(electronics) field. The quality management system holds a vital place in the company's structure. Implementing such a system requires important operating costs. These costs are known as Quality Obtaining Costs (QOC) and may be considered as an investment. Planning an investment, means evaluating its return in order to see if it is profitable or not. Measuring the return of quality politics investment raise some delicate problems. We may calculate some aspects of the return of investment by measuring the shape of non-quality costs. An eventual decrease of these costs could be synonym with a profitable investment. But the advantages of good quality politics cannot be measured only by taking into consideration the non-quality costs (even if they include direct and indirect costs). There are also intangible advantages (like mark image, competences, polyvalence, client's satisfaction...) that derive from quality approaches. How to evaluate this type of consequences / advantages? The idea developed in this article is to considerate the quality politics like un immaterial/intelligent investment. Therefore could it be advantageous / possible to use the immaterial investment's measuring and evaluation techniques for studying the quality politics return of investment?

Apparatus for manufacturing heating gas

Energy Technology Data Exchange (ETDEWEB)

Thompson, R

1899-12-09

Treating bituminous fuel, peat, or shale, is described for the production of a non-condensible heating gas by a three-stage but continuous process comprising: (1) a preliminary distillation operation under external heating, (2) a further distillation operation under the action of direct internal heating, (3) a combustion and gasification operation on the distilled hot fuel under the action of air or steam and air.

Spatial light modulator array with heat minimization and image enhancement features

Science.gov (United States)

Jain, Kanti [Briarcliff Manor, NY; Sweatt, William C [Albuquerque, NM; Zemel, Marc [New Rochelle, NY

2007-01-30

An enhanced spatial light modulator (ESLM) array, a microelectronics patterning system and a projection display system using such an ESLM for heat-minimization and resolution enhancement during imaging, and the method for fabricating such an ESLM array. The ESLM array includes, in each individual pixel element, a small pixel mirror (reflective region) and a much larger pixel surround. Each pixel surround includes diffraction-grating regions and resolution-enhancement regions. During imaging, a selected pixel mirror reflects a selected-pixel beamlet into the capture angle of a projection lens, while the diffraction grating of the pixel surround redirects heat-producing unused radiation away from the projection lens. The resolution-enhancement regions of selected pixels provide phase shifts that increase effective modulation-transfer function in imaging. All of the non-selected pixel surrounds redirect all radiation energy away from the projection lens. All elements of the ESLM are fabricated by deposition, patterning, etching and other microelectronic process technologies.

Bioelectrochemical Integration of Waste Heat Recovery, Waste-to- Energy Conversion, and Waste-to-Chemical Conversion with Industrial Gas and Chemical Manufacturing Processes

Energy Technology Data Exchange (ETDEWEB)

Mac Dougall, James [Air Products and Chemicals, Inc., Allentown, PA (United States)

2016-02-05

Many U.S. manufacturing facilities generate unrecovered, low-grade waste heat, and also generate or are located near organic-content waste effluents. Bioelectrochemical systems, such as microbial fuel cells and microbial electrolysis cells, provide a means to convert organic-content effluents into electric power and useful chemical products. A novel biochemical electrical system for industrial manufacturing processes uniquely integrates both waste heat recovery and waste effluent conversion, thereby significantly reducing manufacturing energy requirements. This project will enable the further development of this technology so that it can be applied across a wide variety of US manufacturing segments, including the chemical, food, pharmaceutical, refinery, and pulp and paper industries. It is conservatively estimated that adoption of this technology could provide nearly 40 TBtu/yr of energy, or more than 1% of the U.S. total industrial electricity use, while reducing CO₂ emissions by more than 6 million tons per year. Commercialization of this technology will make a significant contribution to DOE’s Industrial Technology Program goals for doubling energy efficiency and providing a more robust and competitive domestic manufacturing base.

Effects of heat treatment on microstructure and mechanical behaviour of additive manufactured porous Ti6Al4V

Science.gov (United States)

Ahmadi, S. M.; Jain, R. K. Ashok Kumar; Zadpoor, A. A.; Ayas, C.; Popovich, V. A.

2017-12-01

Titanium and its alloys such as Ti6Al4V play a major role in the medical industry as bone implants. Nowadays, by the aid of additive manufacturing (AM), it is possible to manufacture porous complex structures which mimic human bone. However, AM parts are near net shape and post processing may be needed to improve their mechanical properties. For instance, AM Ti6Al4V samples may be brittle and incapable of withstanding dynamic mechanical loads due to their martensitic microstructure. The aim of this study was to apply two different heat treatment regimes (below and above β-transus) to investigate their effects on the microstructure and mechanical properties of porous Ti6Al4V specimens. After heat treatment, fine acicular α‧ martensitic microstructure was transformed to a mixture of α and β phases. The ductility of the heat-treated specimens, as well as some mechanical properties such as hardness, plateau stress, and first maximum stress changed while the density and elastic gradient of the porous structure remained unchanged.

Corrosion Behavior of Heat-Treated AlSi10Mg Manufactured by Laser Powder Bed Fusion

Directory of Open Access Journals (Sweden)

Marina Cabrini

2018-06-01

Full Text Available This experimental work is aimed at studying the effect of microstructural modifications induced by post-processing heat treatments on the corrosion behavior of silicon-aluminum alloys produced by means of laser powder bed fusion (LPBF. The manufacturing technique leads to microstructures characterized by the presence of melt pools, which are quite different compared to casting alloys. In this study, the behavior of an AlSi10Mg alloy was evaluated by means of intergranular corrosion tests according to ISO 11846 standard on heat-treated samples ranging from 200 to 500 °C as well as on untreated samples. We found that temperatures above 200 °C reduced microhardness of the alloy, and different corrosion morphologies occurred due to the modification of both size and distribution of silicon precipitates. Selective penetrating attacks occurred at melt pool borders. The intergranular corrosion phenomena were less intense for as-produced specimens without heat treatments compared to the heat-treated specimens at 200 and 300 °C. General corrosion morphologies were noticed for specimens heat treated at temperatures exceeding 400 °C.

Experience feedback from high heat flux component manufacturing for Tore Supra

International Nuclear Information System (INIS)

Schlosser, J.; Durocher, A.; Huber, T.; Garin, P.; Schedler, B.; Agarici, G.

2001-01-01

Tore Supra is involved in flat tile carbon armoured plasma facing components (PFCs) since 1985. In 1997, a third generation of components, based on the original concept developed with Plansee Company, called active metal casting (AMC[reg]), has been launched. Since 1998, 660 elementary components for the toroidal pump limiter (TPL) are in production. The route of the manufacture is rather complex and many controls were requested all along the fabrication to insure a high reliability of the elements. One of the main controls is the final infrared (IR) test allowing to determine the quality of the bonding between the carbon fibre composite (CFC) tiles and the heat sink made of copper-chromium-zirconium alloy (CuCrZr). Although results for the first batch of elements were as expected (less than 5% rejected at the final test), unexpected defects appeared with the followings batches. Investigations on the fabrication processes underlined the importance of having a better heat treatment of the pieces in copper alloy (CuCrZr), however this was not sufficient to completely explain the observed defects

An Investigation of the Microstructure and Fatigue Behavior of Additively Manufactured AISI 316L Stainless Steel with Regard to the Influence of Heat Treatment

Directory of Open Access Journals (Sweden)

Bastian Blinn

2018-03-01

Full Text Available To exploit the whole potential of Additive Manufacturing, it is essential to investigate the complex relationships between Additive Manufacturing processes, the resulting microstructure, and mechanical properties of the materials and components. In the present work, Selective Laser Melted (SLM (process category: powder bed fusion, Laser Deposition Welded (LDW (process category: direct energy deposition and, for comparison, Continuous Casted and then hot and cold drawn (CC austenitic stainless steel AISI 316L blanks were investigated with regard to their microstructure and mechanical properties. To exclude the influence of surface topography and focus the investigation on the volume microstructure, the blanks were turned into final geometry of specimens. The additively manufactured (AM- blanks were manufactured in both the horizontal and vertical building directions. In the horizontally built specimens, the layer planes are perpendicular and in vertical building direction, they are parallel to the load axis of the specimens. The materials from different manufacturing processes exhibit different chemical composition and hence, austenite stability. Additionally, all types of blanks were heat treated (2 h, 1070 °C, H2O and the influence of the heat treatment on the properties of differently manufactured materials were investigated. From the cyclic deformation curves obtained in the load increase tests, the anisotropic fatigue behavior of the AM-specimens could be detected with only one specimen in each building direction for the different Additive Manufacturing processes, which could be confirmed by constant amplitude tests. The results showed higher fatigue strength for horizontally built specimens compared to the vertical building direction. Furthermore, the constant amplitude tests show that the austenite stability influences the fatigue behavior of differently manufactured 316L. Using load increase tests as an efficient rating method of the

Microelectronic Status Analysis and Secondary Part Procureability Assessment of the HAWK Weapon System

National Research Council Canada - National Science Library

Maddux, Gary

2000-01-01

The MT Division, Engineering Directorate (ED), RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the HAWK weapon system...

Microelectronic Status Analysis and Secondary Part Procureability Assessment of the HAWK Weapon System

National Research Council Canada - National Science Library

Maddux, Gary

1999-01-01

The Industrial Operations Division (IOD), SEPD, RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the HAWK weapon system...

Dictionary of microelectronics and microcomputer technology. Woerterbuch der Mikroelektronik und Mikrorechnertechnik

Energy Technology Data Exchange (ETDEWEB)

Attiyate, Y H; Shah, R R

1984-01-01

This bilingual dictionary (German-English and English-German) is to give the general public a clearer idea of the terminology of microelectronics, microcomputers, data processing, and computer science. Each part contains about 7500 terms frequently encountered in practice, about 2000 of which are supplemented by precise explanations.

Poly(3-hexylthiophene)/ZnO hybrid pn junctions for microelectronics applications

DEFF Research Database (Denmark)

Katsia, E.; Huby, N.; Tallarida, G.

2009-01-01

Hybrid poly(3-hexylthiophene)/ZnO devices are investigated as rectifying heterojunctions for microelectronics applications. A low-temperature atomic layer deposition of ZnO on top of poly(3-hexylthiophene) allows the fabrication of diodes featuring a rectification ratio of nearly 105 at ±4 V...

A system approach for reducing the environmental impact of manufacturing and sustainability improvement of nano-scale manufacturing

Science.gov (United States)

Yuan, Yingchun

This dissertation develops an effective and economical system approach to reduce the environmental impact of manufacturing. The system approach is developed by using a process-based holistic method for upstream analysis and source reduction of the environmental impact of manufacturing. The system approach developed consists of three components of a manufacturing system: technology, energy and material, and is useful for sustainable manufacturing as it establishes a clear link between manufacturing system components and its overall sustainability performance, and provides a framework for environmental impact reductions. In this dissertation, the system approach developed is applied for environmental impact reduction of a semiconductor nano-scale manufacturing system, with three case scenarios analyzed in depth on manufacturing process improvement, clean energy supply, and toxic chemical material selection. The analysis on manufacturing process improvement is conducted on Atomic Layer Deposition of Al2O3 dielectric gate on semiconductor microelectronics devices. Sustainability performance and scale-up impact of the ALD technology in terms of environmental emissions, energy consumption, nano-waste generation and manufacturing productivity are systematically investigated and the ways to improve the sustainability of the ALD technology are successfully developed. The clean energy supply is studied using solar photovoltaic, wind, and fuel cells systems for electricity generation. Environmental savings from each clean energy supply over grid power are quantitatively analyzed, and costs for greenhouse gas reductions on each clean energy supply are comparatively studied. For toxic chemical material selection, an innovative schematic method is developed as a visual decision tool for characterizing and benchmarking the human health impact of toxic chemicals, with a case study conducted on six chemicals commonly used as solvents in semiconductor manufacturing. Reliability of

An update on coating/manufacturing techniques of microneedles.

Science.gov (United States)

Tarbox, Tamara N; Watts, Alan B; Cui, Zhengrong; Williams, Robert O

2017-12-29

Recently, results have been published for the first successful phase I human clinical trial investigating the use of dissolving polymeric microneedles… Even so, further clinical development represents an important hurdle that remains in the translation of microneedle technology to approved products. Specifically, the potential for accumulation of polymer within the skin upon repeated application of dissolving and coated microneedles, combined with a lack of safety data in humans, predicates a need for further clinical investigation. Polymers are an important consideration for microneedle technology-from both manufacturing and drug delivery perspectives. The use of polymers enables a tunable delivery strategy, but the scalability of conventional manufacturing techniques could arguably benefit from further optimization. Micromolding has been suggested in the literature as a commercially viable means to mass production of both dissolving and swellable microneedles. However, the reliance on master molds, which are commonly manufactured using resource intensive microelectronics industry-derived processes, imparts notable material and design limitations. Further, the inherently multi-step filling and handling processes associated with micromolding are typically batch processes, which can be challenging to scale up. Similarly, conventional microneedle coating processes often follow step-wise batch processing. Recent developments in microneedle coating and manufacturing techniques are highlighted, including micromilling, atomized spraying, inkjet printing, drawing lithography, droplet-born air blowing, electro-drawing, continuous liquid interface production, 3D printing, and polyelectrolyte multilayer coating. This review provides an analysis of papers reporting on potentially scalable production techniques for the coating and manufacturing of microneedles.

Manufacturing of small-scale mock-ups and of a semi-prototype of the ITER Normal Heat Flux First Wall

International Nuclear Information System (INIS)

Banetta, S.; Zacchia, F.; Lorenzetto, P.; Bobin-Vastra, I.; Boireau, B.; Cottin, A.; Mitteau, R.; Eaton, R.; Raffray, R.

2014-01-01

This paper describes the manufacturing development and fabrication of reduced scale ITER First Wall (FW) mock-ups of the Normal Heat Flux (NHF) design, including a “semi-prototype” with a dimension of 305 mm × 660 mm, corresponding to about 1/6 of a full-scale panel. The activity was carried out in the framework of the pre-qualification of the European Domestic Agency (EU-DA or F4E) for the supply of the European share of the ITER First Wall. The hardware consists of three Upgraded (2 MW/m 2 ) Normal Heat Flux (U-NHF) small-scale mock-ups, bearing 3 beryllium tiles each, and of one Semi-Prototype, representing six full-scale fingers and bearing a total of 84 beryllium tiles. The manufacturing process makes extensive use of Hot Isostatic Pressing, which was developed over more than a decade during ITER Engineering Design Activity phase. The main manufacturing steps for the semi-prototype are described, with special reference to the lessons learned and the implications impacting the future fabrication of the full-scale prototype and the series which consists of 218 panels plus spares. In addition, a “tile-size” mock-up was manufactured in order to assess the performance of larger tiles. The use of larger tiles would be highly beneficial since it would allow a significant reduction of the panel assembly time

Manufacturing and characterisation of SiC-fibre-reinforced copper in heat sink applications

International Nuclear Information System (INIS)

Kimmig, Stefan

2013-01-01

The wall materials in future fusion reactors will be operating under extreme thermal and mechanical load conditions. The divertor region of such a device is the most severely loaded component. This part is exposed to heat fluxes of up to 15 MW m 2 due to the impinging plasma particle flux. Tungsten is currently considered as the best choice for the plasmafacing-materials (PFM) in the divertor region. An efficient heat sink material is required underneath the PFM for sufficient heat transfer to the cooling channels. In the research reactor ITER a copper alloy (CuCrZr) is foreseen as heat sink material, which is able to withstand temperatures of up to 350 C, corresponding to a water coolant temperature of 150 C. For the commercial use of fusion energy an increase of the thermal efficiency is necessary by increasing the coolant temperature to over 300 C. This will cause higher stresses in the connection area between PFM and the heat sink due to different coefficients of thermal expansion combined with higher temperatures. The mechanical properties of CuCrZr are insufficient for these conditions and fibre reinforced copper metal matrix composites (CuMMC) are considered as an alternative material to strengthen the critical connection area between the heat sink and the PFM. The composite should combine the high heat conductivity of a copper matrix with the high stiffness and mechanical strength of silicon-carbide fibres (SiC-fibres). During this investigation SiC-fibres of two different production principles were studied regarding their usage for the manufacturing of a CuMMC. The main goals for the CuMMC are a tensile strength of 300 MPa combined with a heat conductivity of more than 200 W m -1 K -1 . Both of these parameters are affected by the single fibre tensile strength and by the bonding between the fibres and the copper matrix. The achievable heat conductivity in the CuMMC depends on the fibre volume ratio within the composite. Higher fibre strength reduces the

Numerical Analysis and Experimental Verification of Stresses Building up in Microelectronics Packaging

NARCIS (Netherlands)

Rezaie Adli, A.R.

2017-01-01

This thesis comprises a thorough study of the microelectronics packaging process by means of various experimental and numerical methods to estimate the process induced residual stresses. The main objective of the packaging is to encapsulate the die, interconnections and the other exposed internal

Microelectronic Status Analysis and Secondary Part Procureability Assessment of the ATACMS-BAT Weapon System

National Research Council Canada - National Science Library

Maddux, Gary

2000-01-01

The MT Division, Engineering Directorate (ED), RDEC, AMCOM has the mission and function of providing microelectronic technology assessments, and producibility and supportability analyses for the ATACMS-BAT weapon system...

Assessment of the Current Level of Automation in the Manufacture of Fuel Cell Systems for Combined Heat and Power Applications

Energy Technology Data Exchange (ETDEWEB)

Ulsh, M.; Wheeler, D.; Protopappas, P.

2011-08-01

The U.S. Department of Energy (DOE) is interested in supporting manufacturing research and development (R&D) for fuel cell systems in the 10-1,000 kilowatt (kW) power range relevant to stationary and distributed combined heat and power applications, with the intent to reduce manufacturing costs and increase production throughput. To assist in future decision-making, DOE requested that the National Renewable Energy Laboratory (NREL) provide a baseline understanding of the current levels of adoption of automation in manufacturing processes and flow, as well as of continuous processes. NREL identified and visited or interviewed key manufacturers, universities, and laboratories relevant to the study using a standard questionnaire. The questionnaire covered the current level of vertical integration, the importance of quality control developments for automation, the current level of automation and source of automation design, critical balance of plant issues, potential for continuous cell manufacturing, key manufacturing steps or processes that would benefit from DOE support for manufacturing R&D, the potential for cell or stack design changes to support automation, and the relationship between production volume and decisions on automation.

The Electrical Engineering Curriculum at the Technical University of Denmark - Options in Microelectronics

DEFF Research Database (Denmark)

Bruun, Erik; Nielsen, Lars Drud

1997-01-01

This paper describes the modular structure of the engineering curriculum at the Technical University of Denmark. The basic requirements for an electrical engineering curriculum are presented and different possibilities for specialization in microelectronics and integrated circuit design...

Flow Visualization Study of Natural Convection from a Heated Protrusion in a Liquid Filled Rectangular Enclosure.

Science.gov (United States)

1983-12-01

PROPOSED SOLUTIONS Many papers have been published outlining alternative methods of thermally controlling microelectronic devices. Hannemann [3] describes...Workshop, NSF Grant ENG-7701297, Directions of Heat Transfer in Electronic Equipment, Fy R. C. Chu, 1977. 3. Hannemann , R., "Electronic System Thermal

The influence of heat accumulation on the surface roughness in powder-bed additive manufacturing

International Nuclear Information System (INIS)

Jamshidinia, Mahdi; Kovacevic, Radovan

2015-01-01

The influence of heat accumulation on surface roughness during powder-bed additive manufacturing was investigated. A series of Ti-6Al-4V thin plates were produced by using an identical heat input by electron beam melting® (EBM). Spacing distances of 5 mm, 10 mm, and 20 mm were used. The surface roughness of as-built thin plates was measured using a two-axis profilometer. A numerical model was developed to study the influence of spacing distance on heat accumulation. An inverse relationship between the spacing distance and surface roughness was revealed. The experimental and numerical results showed that the surface quality of buildups could be controlled not only by process parameters, but also by the arrangement of components in the buildup chamber. At a constant spacing distance, an increase in the number of powder layers resulted in the accumulation of more heat between the thin plates. An increase in the spacing distance resulted in an upward translation of the Bearing Area Curve (BAC) toward shallower depths, with a reduced core roughness depth (R k ) and peak height (R pk ). A logarithmic regression equation was established from the experimental data. This equation could be used to predict the surface roughness of parts fabricated by EBM® in the studied range of spacing distances. (paper)

Manufacturing of kevlar/polyester composite by resin transfer moulding using conventional and microwave heating

International Nuclear Information System (INIS)

Abdullah, I.

2015-01-01

Microwave heating was incorporated into the resin transfer moulding technique. Polytetrafluoroethylene (PTFE) mould was used to cure the composite panel. Through the use of microwave heating, the mechanical and physical properties of produced Kevlar fibre/polyester composites were compared to those manufactured by conventional resin transfer moulding. The flexural modulus and flexural strength of 6-ply conventionally cured composites was 45% and 9% higher than the flexural modulus and flexural strength of 6-ply microwaved cured composites, respectively. However, 19% increase in interlaminar shear strength (ILSS) and 2% increase in compressive strength was observed in 6-ply microwave cured composites. This enhancement in ILSS and compressive strength is attributed to the better interfacial bonding of polyester resin with Kevlar fibres in microwaved cured composite, which was also confirmed via electron microscopy scanning. Furthermore, the microwave cured composite yielded maximum void contents (3%). (author)

Wellbore manufacturing processes for in situ heat treatment processes

Science.gov (United States)

Davidson, Ian Alexander; Geddes, Cameron James; Rudolf, Randall Lynn; Selby, Bruce Allen; MacDonald, Duncan Charles

2012-12-11

A method includes making coiled tubing at a coiled tubing manufacturing unit coupled to a coiled tubing transportation system. One or more coiled tubing reels are transported from the coiled tubing manufacturing unit to one or more moveable well drilling systems using the coiled tubing transportation system. The coiled tubing transportation system runs from the tubing manufacturing unit to one or more movable well drilling systems, and then back to the coiled tubing manufacturing unit.

Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer

Directory of Open Access Journals (Sweden)

Zhengguo Shang

2009-05-01

Full Text Available A novel high-precision vacuum microelectronic accelerometer has been successfully fabricated and tested in our laboratory. This accelerometer has unique advantages of high sensitivity, fast response, and anti-radiation stability. It is a prototype intended for navigation applications and is required to feature micro-g resolution. This paper briefly describes the structure and working principle of our vacuum microelectronic accelerometer, and the mathematical model is also established. The performances of the accelerometer system are discussed after Matlab modeling. The results show that, the dynamic response of the accelerometer system is significantly improved by choosing appropriate parameters of signal detecting circuit, and the signal detecting circuit is designed. In order to attain good linearity and performance, the closed-loop control mode is adopted. Weak current detection technology is studied, and integral T-style feedback network is used in I/V conversion, which will eliminate high-frequency noise at the front of the circuit. According to the modeling parameters, the low-pass filter is designed. This circuit is simple, reliable, and has high precision. Experiments are done and the results show that the vacuum microelectronic accelerometer exhibits good linearity over -1 g to +1 g, an output sensitivity of 543 mV/g, and a nonlinearity of 0.94 %.

Design and manufacture of steam generators for replacement

International Nuclear Information System (INIS)

Hirano, Hiroshi; Kuri, Syuhei

1995-01-01

The basic specification of the steam generators for replacement as heat exchangers (the pressure, temperature, flow rate and thermal output on primary and secondary sides) is set same as that of steam generators before replacement, but the latest design reflecting the operation experience obtained so far and taking the countermeasures for preventing heating tube damage in it is adopted, such as the heating tubes made of TT 690 alloy, the tube support plates with four-lobe shape tube holes made of stainless steel, the stainless steel rest fittings of three in one set and so on. After the heating tube break accident in Mihama No. 2 plant, the quality control was further strengthened. The comparison of the specifications of the steam generators of respective plants before and after the replacement is shown. The main objective of improving steam generators is the heightening of the reliability of heating tubes against intergranular attack and primary water stress corrosion cracking. The improvements of heating tube material, tube support plate material, secondary side heat flow, the shape of tube holes of tube support plates, the method of expanding heating tubes, and vibration-controlling fittings are explained. As to the manufacturing procedure and quality control, the manufacture of raw materials, the build-up welding of tube plates, the manufacture of lower half shell plates, the tube hole making of support plates, the insection of outer cylinder, flow rate distribution plate. Support plates and heating tubes, the sealing welding and expanding of heating tubes, the fixing of rest fittings, the manufacture and fixing of water chamber cover, the manufacture of upper half shell, the fixing of parts inside it, the final joint and inspection are described. (K.I.)

The microelectronics and photonics test bed (MPTB) space, ground test and modeling experiments

International Nuclear Information System (INIS)

Campbell, A.

1999-01-01

This paper is an overview of the MPTB (microelectronics and photonics test bed) experiment, a combination of a space experiment, ground test and modeling programs looking at the response of advanced electronic and photonic technologies to the natural radiation environment of space. (author)

Process of heat exchangers manufactured by Scientific and Engineering Services (S.E.S.)

International Nuclear Information System (INIS)

Khurshid, S.

1995-01-01

The objective of this report is to have a comprehensive overview of heat exchanger fouling problems as they occur in the industrial manufacturing sector. Specifically the types of fouling, conditions that influence fouling, the mitigation and accommodation techniques currently being used and mitigation technology trends are discussed. Finally a table top apparatus is designed and fabricated to develop an on line mechanical technique of rubber ball system for the removal of dirt and scales of that exchangers. Experimental results of this apparatus show that the cleaning efficiency can be raised if this mechanical technique is used together with current chemical fouling removal methods. (author)

Job stress models, depressive disorders and work performance of engineers in microelectronics industry.

Science.gov (United States)

Chen, Sung-Wei; Wang, Po-Chuan; Hsin, Ping-Lung; Oates, Anthony; Sun, I-Wen; Liu, Shen-Ing

2011-01-01

Microelectronic engineers are considered valuable human capital contributing significantly toward economic development, but they may encounter stressful work conditions in the context of a globalized industry. The study aims at identifying risk factors of depressive disorders primarily based on job stress models, the Demand-Control-Support and Effort-Reward Imbalance models, and at evaluating whether depressive disorders impair work performance in microelectronics engineers in Taiwan. The case-control study was conducted among 678 microelectronics engineers, 452 controls and 226 cases with depressive disorders which were defined by a score 17 or more on the Beck Depression Inventory and a psychiatrist's diagnosis. The self-administered questionnaires included the Job Content Questionnaire, Effort-Reward Imbalance Questionnaire, demography, psychosocial factors, health behaviors and work performance. Hierarchical logistic regression was applied to identify risk factors of depressive disorders. Multivariate linear regressions were used to determine factors affecting work performance. By hierarchical logistic regression, risk factors of depressive disorders are high demands, low work social support, high effort/reward ratio and low frequency of physical exercise. Combining the two job stress models may have better predictive power for depressive disorders than adopting either model alone. Three multivariate linear regressions provide similar results indicating that depressive disorders are associated with impaired work performance in terms of absence, role limitation and social functioning limitation. The results may provide insight into the applicability of job stress models in a globalized high-tech industry considerably focused in non-Western countries, and the design of workplace preventive strategies for depressive disorders in Asian electronics engineering population.

Manufacturing development for the SAFE 100 kW core

International Nuclear Information System (INIS)

Carter, Robert; Roman, Jose; Salvail, Pat

2002-01-01

In stark contrast to what is sometimes considered the norm in traditional manufacturing processes, engineers at the Marshall Space Flight Center (MSFC) arc in the practice of altering the standard in an effort to realize other potential methods in core manufacturing. While remaining within the bounds of the materials database, we are researching into core manufacturing techniques that may have been overlooked in the past due to funding and/or time constraints. To augment proven core fabrication capabilities we are pursuing plating processes as another possible method for core build-up and assembly. Although brazing and a proprietary HIP cycle are used for module assembly (proven track record for stability and endurance), it is prudent to pursue secondary or backup methods of module and core assembly. For this reason heat tube manufacture and module assembly by means of plating is being investigated. Potentially, the plating processes will give engineers the ability to manufacture replacement modules for any module that might fail to perform nominally, and to assemble/disassemble a complete core in much less time than would be required for the conventional Braze-HIP process. Another area of improvement in core manufacturing capabilities is the installation of a sodium and lithium liquid metal heat pipe fill machine. This, along with the ability to Electron Beam Weld heat pipe seals and wet-in the pipes in the necessary vacuum atmosphere, will eliminate the need to ship potentially hazardous components outside for processing. In addition to developing core manufacturing techniques, the SAFE manufacturing team has been evaluating the thermal heat transfer characteristics, and manufacturability of several heat exchanger design concepts

3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

KAUST Repository

Farooqui, Muhammad Fahad; Karimi, Muhammad Akram; Salama, Khaled N.; Shamim, Atif

2017-01-01

disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept

Manufacturing study of beryllium bonded structures

International Nuclear Information System (INIS)

Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

2004-01-01

Manufacturing study has been conducted on Be-bonded structures employed in the first-wall panel of the blanket system for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating process has been used to bond the three materials. First, Cu-alloy and SS materials are bonded diffusively. Then, Be tiles are bonded to the pre-bonded structure under 20 MPa and at 560 degree C. An Al-Si base interlayer has been used to bond Be to the Cu-Alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. Using the above bonding techniques, a partial mockup of a blanket first-wall panel with 16 Be tiles (with 50 mm in size) has been successfully manufactured. (author)

Effects of microelectronics on industrial level measuring

International Nuclear Information System (INIS)

Schaudel, D.E.

1979-01-01

Microelectronic elements and production technologies have begun to change industrial level measurement, and this trend will continue. Spectacular breakthroughs cannot be expected, due to the major demand of reliability and to administrative constraints. The demand for transducers has increased with the advance of low-cost computer hardware. Electronics makes well-known method of measurements more universally applicable; it helps to realize new methods, and to design multifunctional transducers which always give the necessary signal for process guidance. The effects on society and environment are wholly positive: More and better measuring technologies permit a better utilisation of raw materials and energies, help to prevent environmental damage, and to raise the standard of living. Negative results are not to be expected on this sector. (orig./RW) [de

High density microelectronics package using low temperature cofirable ceramics

International Nuclear Information System (INIS)

Fu, S.-L.; Hsi, C.-S.; Chen, L.-S.; Lin, W. K.

1997-01-01

Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe 2/3 W 1/3 ) x (Fe l/2 Nb l/2 ) y Ti 2 O 3 was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)

High density microelectronics package using low temperature cofirable ceramics

Energy Technology Data Exchange (ETDEWEB)

Fu, S -L; Hsi, C -S; Chen, L -S; Lin, W K [Kaoshiung Polytechnic Institute Ta-Hsu, Kaoshiung (China)

1998-12-31

Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe{sub 2/3}W{sub 1/3}){sub x}(Fe{sub l/2}Nb{sub l/2}){sub y}Ti{sub 2}O{sub 3} was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)

Heteromagnetic Microelectronics Microsystems of Active Type

CERN Document Server

Ignatiev, Alexander A

2010-01-01

Heteromagnetic Microelectronics: Microsystems of Active Type, by Alexander A. Ignatiev of Saratov State University and Alexander V. Lyashenko of JSC Research Institute Tantal in Russia, offers a very detailed and specialized account of the author's research and development of heteromagnetic materials and devices. The book is based on original material from the author's programs of designing heteromagnetic microsystems. Polyvalent, multiple parameter magneto-semiconductor microsystems are described and the book reports on extensive experimental and theoretical results of research in a range of frequencies up to 1000 GHz. For the first time the direction of satisfying criteria, and burst technologies, which can make a subject of discovery, are discussed in great detail. This book is intended for post-graduate students and researchers specializing in the design and application of heteromagnetic materials and devices. Alexander A. Ignatiev is author of Magnetoelectronics of Microwaves and Extremely High Frequenci...

Registered manufacturers of renewable energy devices

International Nuclear Information System (INIS)

Anon.

1992-01-01

Registered manufacturers of renewable energy devices in India are listed. The list is arranged under the headings : solar water heating system, solar cooker, solar still and water pumping wind mill. In all 38 manufacturers are listed. The list gives the postal address, name of the contact person and phone number of each manufacturer. (M.G.B.)

Heat transfer enhancement by finned heat sinks with micro-structured roughness

International Nuclear Information System (INIS)

Ventola, L; Chiavazzo, E; Asinari, P; Calignano, F; Manfredi, D

2014-01-01

We investigated the benefits of micro-structured roughness on heat transfer performance of heat sinks, cooled by forced air. Heat sinks in aluminum alloy by direct metal laser sintering (DMLS) manufacturing technique were fabricated; values of the average surface roughness R a from 1 to 25 microns (standard milling leads to roughness around 1 micron) under turbulent regimes (Reynolds number based on heating edge from 3000 to 17000) have been explored. An enhancement of 50% in thermal performances with regards to standard manufacturing was observed. This may open the way for huge boost in the technology of electronic cooling by DMLS.

Heat Transfer Enhancement by Finned Heat Sinks with Micro-structured Roughness

Science.gov (United States)

Ventola, L.; Chiavazzo, E.; Calignano, F.; Manfredi, D.; Asinari, P.

2014-04-01

We investigated the benefits of micro-structured roughness on heat transfer performance of heat sinks, cooled by forced air. Heat sinks in aluminum alloy by direct metal laser sintering (DMLS) manufacturing technique were fabricated; values of the average surface roughness Ra from 1 to 25 microns (standard milling leads to roughness around 1 micron) under turbulent regimes (Reynolds number based on heating edge from 3000 to 17000) have been explored. An enhancement of 50% in thermal performances with regards to standard manufacturing was observed. This may open the way for huge boost in the technology of electronic cooling by DMLS.

Sustainable Micro-Manufacturing of Micro-Components via Micro Electrical Discharge Machining

Directory of Open Access Journals (Sweden)

Valeria Marrocco

2011-12-01

Full Text Available Micro-manufacturing emerged in the last years as a new engineering area with the potential of increasing peoples’ quality of life through the production of innovative micro-devices to be used, for example, in the biomedical, micro-electronics or telecommunication sectors. The possibility to decrease the energy consumption makes the micro-manufacturing extremely appealing in terms of environmental protection. However, despite this common belief that the micro-scale implies a higher sustainability compared to traditional manufacturing processes, recent research shows that some factors can make micro-manufacturing processes not as sustainable as expected. In particular, the use of rare raw materials and the need of higher purity of processes, to preserve product quality and manufacturing equipment, can be a source for additional environmental burden and process costs. Consequently, research is needed to optimize micro-manufacturing processes in order to guarantee the minimum consumption of raw materials, consumables and energy. In this paper, the experimental results obtained by the micro-electrical discharge machining (micro-EDM of micro-channels made on Ni–Cr–Mo steel is reported. The aim of such investigation is to shed a light on the relation and dependence between the material removal process, identified in the evaluation of material removal rate (MRR and tool wear ratio (TWR, and some of the most important technological parameters (i.e., open voltage, discharge current, pulse width and frequency, in order to experimentally quantify the material waste produced and optimize the technological process in order to decrease it.

24 CFR 3280.707 - Heat producing appliances.

Science.gov (United States)

2010-04-01

... 24 Housing and Urban Development 5 2010-04-01 2010-04-01 false Heat producing appliances. 3280.707... Systems § 3280.707 Heat producing appliances. (a) Heat-producing appliances and vents, roof jacks and... appliance, the heating appliance shall be installed by the manufacturer of the manufactured home in...

Effect of Heat Treatment on Microstructure and Impact Toughness of Ti-6Al-4V Manufactured by Selective Laser Melting Process

Directory of Open Access Journals (Sweden)

Lee K.-A.

2017-06-01

Full Text Available This study manufactured Ti-6Al-4V alloy using one of the powder bed fusion 3D-printing processes, selective laser melting, and investigated the effect of heat treatment (650°C/3hrs on microstructure and impact toughness of the material. Initial microstructural observation identified prior-β grain along the building direction before and after heat treatment. In addition, the material formed a fully martensite structure before heat treatment, and after heat treatment, α and β phase were formed simultaneously. Charpy impact tests were conducted. The average impact energy measured as 6.0 J before heat treatment, and after heat treatment, the average impact energy increased by approximately 20% to 7.3 J. Fracture surface observation after the impact test showed that both alloys had brittle characteristics on macro levels, but showed ductile fracture characteristics and dimples at micro levels.

Sensors for Metering Heat Flux Area Density and Metrological Equipment for the Heat Flux Density Measurement

Science.gov (United States)

Doronin, D. O.

2018-04-01

The demand in measuring and studies of heat conduction of various media is very urgent now. This article considers the problem of heat conduction monitoring and measurement in various media and materials in any industries and branches of science as well as metrological support of the heat flux measurement equipment. The main study objects are both the sensors manufactured and facilities onto which these sensors will be installed: different cladding structures of the buildings, awnings, rocket fairings, boiler units, internal combustion engines. The Company develops and manufactures different types of heat flux sensors: thermocouple, thin-film, heterogeneous gradient as well as metrological equipment for the gauging calibration of the heat flux density measurement. The calibration shall be performed using both referencing method in the unit and by fixed setting of the heat flux in the unit. To manufacture heterogeneous heat flux gradient sensors (HHFGS) the Company developed and designed a number of units: diffusion welding unit, HHFGS cutting unit. Rather good quality HHFGS prototypes were obtained. At this stage the factory tests on the equipment for the heat flux density measurement equipment are planned. A high-sensitivity heat flux sensor was produced, now it is tested at the Construction Physics Research Institute (Moscow). It became possible to create thin-film heat flux sensors with the sensitivity not worse than that of the sensors manufactured by Captec Company (France). The Company has sufficient premises to supply the market with a wide range of sensors, to master new sensor manufacture technologies which will enable their application range.

Using SDI-12 with ST microelectronics MCU's

Energy Technology Data Exchange (ETDEWEB)

Saari, Alexandra [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Hinzey, Shawn Adrian [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Frigo, Janette Rose [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Proicou, Michael Chris [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Borges, Louis [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

2015-09-03

ST Microelectronics microcontrollers and processors are readily available, capable and economical processors. Unfortunately they lack a broad user base like similar offerings from Texas Instrument, Atmel, or Microchip. All of these devices could be useful in economical devices for remote sensing applications used with environmental sensing. With the increased need for environmental studies, and limited budgets, flexibility in hardware is very important. To that end, and in an effort to increase open support of ST devices, I am sharing my teams' experience in interfacing a common environmental sensor communication protocol (SDI-12) with ST devices.

Additive manufacturing of Co-Cr-Mo alloy: Influence of heat treatment on microstructure, tribological and electrochemical properties

Directory of Open Access Journals (Sweden)

Kedar Mallik Mantrala

2015-03-01

Full Text Available Co-Cr-Mo alloy samples, fabricated using Laser Engineered Net Shaping – a laser based additive manufacturing technology, have been subjected heat treatment to study its influence on microstructure, wear and corrosion properties. Following L9 Orthogonal array of Taguchi method, the samples were solutionized at 1200oC for 30, 45 and 60 min followed by water quenching. Ageing treatment was done at 815oC and 830oC for 2, 4 and 6 h. Heat treated samples were evaluated for their microstructure, hardness, wear resistance and corrosion resistance. The results revealed that highest hardness of 512 ± 58 Hv and wear rate of 0.90 ± 0.14 × 10-4 mm3/N.m can be achieved with appropriate post-fabrication heat treatment. ANOVA and grey relational analysis on the experimental data revealed that the samples subjected to solution treatment for 60 min, without ageing, exhibit best combination of hardness, wear and corrosion resistance.

Emerging epidemic in a growing industry: cigarette smoking among female micro-electronics workers in Taiwan.

Science.gov (United States)

Lin, Y-P; Yen, L-L; Pan, L-Y; Chang, P-J; Cheng, T-J

2005-03-01

To explore the emerging tobacco epidemic in female workers in the growing micro-electronics industry of Taiwan. Workers were surveyed regarding their smoking status, sociodemographics and work characteristics. In total, 1950 female employees in two large micro-electronics companies in Taiwan completed the survey. Approximately 9.3% of the female employees were occasional or daily smokers at the time of the survey. The prevalence of smoking was higher in those aged 16-19 years (20.9%), those not married (12.9%), those with a high school education or less (11.7%), those employed by Company A (11.7%), shift workers (14.3%), and those who had been in their present employment for 1 year or less (13.6%). Results of multivariate adjusted logistic regression indicated that younger age, lower level of education, shorter periods of employment with the company and shift working were the important factors in determining cigarette smoking among the study participants. The odds ratio of being a daily smoker was similar to that of being a current smoker. Marital status was the only significant variable when comparing former smokers with current smokers. Smoking prevalence in female workers in the two micro-electronics companies studied was much higher than previous reports have suggested about female smoking prevalence in Taiwan and China. We suggest that smoking is no longer a 'male problem' in Taiwan. Future smoking cessation and prevention programmes should target young working women as well as men.

Implementation of Microelectronics Track in Electronics Engineering in a Philippines State University

Directory of Open Access Journals (Sweden)

Gil B. Barte

2015-11-01

Full Text Available The evolving trends in electronics continuous to attract students to take upElectronics Engineering.However, it also adds to discipline implementation complexities.Institutions of Higher Learning offering this program must adapt to this realities to avoid obsolescence. This paper looked at Batangas State University, in the Philippines,ongoingimplementation of the Microelectronics track under the Electronics Engineering (ECEProgram. It describes the restructuring done to the ECE curriculum to overcome the enormous complexity inherent in microelectronics design and the teaching pedagogy adopted to promote active learning. The ongoing program has produced encouraging outcomes:1students were able to design, and simulate complex gate CMOS circuits using EDA tools, in the four(4 course electives identified for the track; 2 the culture of independent learning among students improvement in students soft skills, communication skills, time-management and teamwork skill,; 3. useof free and web-based tools overcome the issue of high cost of license for EDA tools and seminar/training for continuous upgrading of faculty. Another encouraging outcome was the acceptance of the student-centered teaching approach used, Problem-Based Learning (PBL,in enhancing the students learning experience.

The effect of postproduction heat treatment on γ-TiAl alloys produced by the GTAW-based additive manufacturing process

Energy Technology Data Exchange (ETDEWEB)

Ma, Yan; Cuiuri, Dominic; Li, Huijun; Pan, Zengxi, E-mail: zengxi@uow.edu.au; Shen, Chen

2016-03-07

Postproduction heat treatments were carried out on additively manufactured γ-TiAl alloys that were produced by using the gas tungsten arc welding (GTAW) process. The microstructural evolution and mechanical properties of both as-fabricated and heat-treated specimens were investigated to assess the effect of different heat treatment conditions, by using optical microscopy (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD), Neutron Diffraction and tensile tests. The results indicated that heat treatment promotes the formation of the γ phase in the majority region after heat treatment at 1200 °C for 24 h, while a fully lamellar structure was formed in the near-substrate zone. The response to heat treatment at 1060 °C/24 h was markedly different, producing a fine lamellar structure with differing sizes in the majority region and near-substrate zone. These various microstructural characteristics determined the mechanical properties of the heat-treated samples. The heat-treated samples at 1200 °C/24 h exhibited lower UTS and microhardness values but higher ductility than the as-fabricated samples without heat treatment, while the 1060 °C/24 h heat treatment resulted in higher UTS and microhardness values but lower ductility. Due to the homogenous microstructure in the majority region after each postproduction heat treatment, the tensile properties were similar for both the build direction (Z) and travel direction (Y), thereby minimising the anisotropy that is exhibited by the as-fabricated alloy prior to heat treatment.

Heat pumps

CERN Document Server

Macmichael, DBA

1988-01-01

A fully revised and extended account of the design, manufacture and use of heat pumps in both industrial and domestic applications. Topics covered include a detailed description of the various heat pump cycles, the components of a heat pump system - drive, compressor, heat exchangers etc., and the more practical considerations to be taken into account in their selection.

3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2017-05-19

Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

Thermoelectric cooling of microelectronic circuits and waste heat electrical power generation in a desktop personal computer

International Nuclear Information System (INIS)

Gould, C.A.; Shammas, N.Y.A.; Grainger, S.; Taylor, I.

2011-01-01

Thermoelectric cooling and micro-power generation from waste heat within a standard desktop computer has been demonstrated. A thermoelectric test system has been designed and constructed, with typical test results presented for thermoelectric cooling and micro-power generation when the computer is executing a number of different applications. A thermoelectric module, operating as a heat pump, can lower the operating temperature of the computer's microprocessor and graphics processor to temperatures below ambient conditions. A small amount of electrical power, typically in the micro-watt or milli-watt range, can be generated by a thermoelectric module attached to the outside of the computer's standard heat sink assembly, when a secondary heat sink is attached to the other side of the thermoelectric module. Maximum electrical power can be generated by the thermoelectric module when a water cooled heat sink is used as the secondary heat sink, as this produces the greatest temperature difference between both sides of the module.

Investigation of “benign” ionic content in epoxy that induces microelectronic device failure

Science.gov (United States)

Gregory T. Schueneman; Jeffery Kingsbury; Edmund Klinkerch

2011-01-01

Microelectronics and the devices dependent upon them have the extremely challenging requirements of becoming more capable and less expensive every year. This drives the industry to pack more functions into an ever smaller footprint until the next technological revolution. Adding to this situation is the removal of lead from the bill of materials followed closely by...

The manufacture of carbon armoured plasma-facing components for fusion devices

International Nuclear Information System (INIS)

Schedler, B.; Huber, T.; Zabernig, A.; Rainer, F.; Scheiber, K.H.; Schedle, D.

2001-01-01

Within the last decade Plansee has been active in the development and manufacture of different plasma-facing-components for nuclear fusion experiments consisting in a tungsten or CFC-armor joined onto metallic substrates like TZM, stainless steel or copper-alloys. The manufacture of these components requires unique joining technologies in order to obtain reliable thermo mechanical stable joints able to withstand highest heat fluxes without any deterioration of the joint. In an overview the different techniques will be presented by some examples of components already manufactured and successfully tested under high heat flux conditions. Furthermore an overview will be given on the manufacture of different high heat flux components for TORE SUPRA, Wendelstein 7-X and ITER. (author)

Microelectronics to nanoelectronics: materials, devices & manufacturability

National Research Council Canada - National Science Library

Kaul, Anupama B

2013-01-01

.... They highlight new technologies that have successfully transitioned from the laboratory to the marketplace as well as technologies that have near-term market applications in electronics, materials, and optics...

Studies of Standard Heat Treatment Effects on Microstructure and Mechanical Properties of Laser Net Shape Manufactured INCONEL 718

Science.gov (United States)

Qi, H.; Azer, M.; Ritter, A.

2009-10-01

Laser net shape manufacturing (LNSM) is a laser cladding/deposition based technology, which can fabricate and repair near-net-shape high-performance components directly from metal powders. Characterizing mechanical properties of the laser net shape manufactured components is prerequisite to the applications of LNSM in aircraft engine industrial productions. Nickel-based superalloys such as INCONEL 718 are the most commonly used metal materials in aircraft engine high-performance components. In this study, the laser deposition process is optimized through a set of designed experiments to reduce the porosity to less than 0.03 pct. It is found that the use of plasma rotating electrode processed (PREP) powder and a high energy input level greater than 80 J/mm are necessary conditions to minimize the porosity. Material microstructure and tensile properties of laser-deposited INCONEL 718 are studied and compared under heat treatment conditions of as deposited, direct aged, solution treatment and aging (STA), and full homogenization followed by STA. Tensile test results showed that the direct age heat treatment produces the highest tensile strength equivalent to the wrought material, which is followed by the STA-treated and the homogenization-treated tensile strengths, while the ductility exhibits the reverse trend. Finally, failure modes of the tensile specimens were analyzed with fractography.

Determining DfT Hardware by VHDL-AMS Fault Simulation for Biological Micro-Electronic Fluidic Arrays

NARCIS (Netherlands)

Kerkhoff, Hans G.; Zhang, X.; Liu, H.; Richardson, A.; Nouet, P.; Azais, F.

2005-01-01

The interest of microelectronic fluidic arrays for biomedical applications, like DNA determination, is rapidly increasing. In order to evaluate these systems in terms of required Design-for-Test structures, fault simulations in both fluidic and electronic domains are necessary. VHDL-AMS can be used

Adhesion-delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices

International Nuclear Information System (INIS)

Khanna, V K

2011-01-01

Physico-chemical mechanisms of adhesion and debonding at the various surfaces and interfaces of semiconductor devices, integrated circuits and microelectromechanical systems are systematically examined, starting from chip manufacturing and traversing the process stages to the ultimate finished product. Sources of intrinsic and thermal stresses in these devices are pointed out. Thin film ohmic contacts to the devices call for careful attention. The role of an adhesion layer in multilayer metallization schemes is highlighted. In packaged devices, sites facing potential risks of delamination are indicated. As MEMS devices incorporate moving parts, there are additional issues due to adhesion of suspended structures to surfaces in the vicinity, both during chip fabrication and their subsequent operation. Proper surface treatments for preventing adhesion together with design considerations for overcoming stiction pave the way to reliable functioning of these devices. Adhesion-delamination issues in microelectronics and MEMS continue to pose significant challenges to both design and process engineers. This paper is an attempt to survey the adhesion characteristics of materials, their compatibilities and limitations and look at future research trends. In addition, it addresses some of the techniques for improved or reduced adhesion, as demanded by the situation. The paper encompasses fundamental aspects to contemporary applications.

PREFACE: E-MRS 2012 Spring Meeting, Symposium M: More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics

Science.gov (United States)

Wenger, Christian; Fompeyrine, Jean; Vallée, Christophe; Locquet, Jean-Pierre

2012-12-01

More than Moore explores a new area of Silicon based microelectronics, which reaches beyond the boundaries of conventional semiconductor applications. Creating new functionality to semiconductor circuits, More than Moore focuses on motivating new technological possibilities. In the past decades, the main stream of microelectronics progresses was mainly powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While the microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there is increasing momentum for the development of 'More than Moore' technologies which are based on silicon technologies but do not simply scale with Moore's law. Typical examples are RF, Power/HV, Passives, Sensor/Actuator/MEMS or Bio-chips. The More than Moore strategy is driven by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that More than Moore will add value to society on top of and beyond advanced CMOS with fast increasing marketing potentials. Important key challenges for the realization of the 'More than Moore' strategy are: perspective materials for future THz devices materials systems for embedded sensors and actuators perspective materials for epitaxial approaches material systems for embedded innovative memory technologies development of new materials with customized characteristics The Hot topics covered by the symposium M (More than Moore: Novel materials approaches for functionalized Silicon based Microelectronics) at E-MRS 2012 Spring Meeting, 14-18 May 2012 have been: development of functional ceramics thin films New dielectric materials for advanced microelectronics bio- and CMOS compatible

Three-Dimensional Printing of Multifunctional Nanocomposites: Manufacturing Techniques and Applications.

Science.gov (United States)

Farahani, Rouhollah D; Dubé, Martine; Therriault, Daniel

2016-07-01

The integration of nanotechnology into three-dimensional printing (3DP) offers huge potential and opportunities for the manufacturing of 3D engineered materials exhibiting optimized properties and multifunctionality. The literature relating to different 3DP techniques used to fabricate 3D structures at the macro- and microscale made of nanocomposite materials is reviewed here. The current state-of-the-art fabrication methods, their main characteristics (e.g., resolutions, advantages, limitations), the process parameters, and materials requirements are discussed. A comprehensive review is carried out on the use of metal- and carbon-based nanomaterials incorporated into polymers or hydrogels for the manufacturing of 3D structures, mostly at the microscale, using different 3D-printing techniques. Several methods, including but not limited to micro-stereolithography, extrusion-based direct-write technologies, inkjet-printing techniques, and popular powder-bed technology, are discussed. Various examples of 3D nanocomposite macro- and microstructures manufactured using different 3D-printing technologies for a wide range of domains such as microelectromechanical systems (MEMS), lab-on-a-chip, microfluidics, engineered materials and composites, microelectronics, tissue engineering, and biosystems are reviewed. Parallel advances on materials and techniques are still required in order to employ the full potential of 3D printing of multifunctional nanocomposites. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Experiences with integral microelectronics on smart structures for space

Science.gov (United States)

Nye, Ted; Casteel, Scott; Navarro, Sergio A.; Kraml, Bob

1995-05-01

One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX II) space-flight experiments implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. The data bus was controlled by Actel field programmable gate arrays arranged in a single master, four slave configuration. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via Delta Transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Thus, over-vibration detection circuitry with automatic output isolation was incorporated into the design. This was not used however, since during experiment integration and test, intentionally induced compensator instabilities resulted in benign mechanical oscillation symptoms. Not too surprisingly, it was determined that instabilities were most detectable by large temperature increases in the electronics, typically

The New S-RAM Air Variable Compressor/Expander for Heat Pump and Waste Heat to Power Application

Energy Technology Data Exchange (ETDEWEB)

Dehoff, Ryan R [ORNL; Jestings, Lee [S-RAM Dynamics; Conde, Ricardo [S-RAM Dynamics

2016-05-23

S-RAM Dynamics (S-RAM) has designed an innovative heat pump system targeted for commercial and industrial applications. This new heat pump system is more efficient than anything currently on the market and utilizes air as the refrigerant instead of hydrofluorocarbon (HFC) refrigerants, leading to lower operating costs, minimal environmental costs or concerns, and lower maintenance costs. The heat pumps will be manufactured in the United States. This project was aimed at determining the feasibility of utilizing additive manufacturing to make the heat exchanger device for the new heat pump system. ORNL and S-RAM Dynamics collaborated on determining the prototype performance and subsequently printing of the prototype using additive manufacturing. Complex heat exchanger designs were fabricated using the Arcam electron beam melting (EBM) powder bed technology using Ti-6Al-4V material. An ultrasonic welding system was utilized in order to remove the powder from the small openings of the heat exchanger. The majority of powder in the small chambers was removed, however, the amount of powder remaining in the heat exchanger was a function of geometry. Therefore, only certain geometries of heat exchangers could be fabricated. SRAM Dynamics evaluated a preliminary heat exchanger design. Although the results of the additive manufacturing of the heat exchanger were not optimum, a less complex geometry was demonstrated. A sleeve valve was used as a demonstration piece, as engine designs from S-RAM Dynamics require the engine to have a very high density. Preliminary designs of this geometry were successfully fabricated using the EBM technology.

Radiation-Induced Prompt Photocurrents in Microelectronics Physics

CERN Document Server

Dodd, P E; Buller, D L; Doyle, B L; Vizkelethy, G; Walsh, D S

2003-01-01

The effects of photocurrents in nuclear weapons induced by proximal nuclear detonations are well known and remain a serious hostile environment threat for the US stockpile. This report describes the final results of an LDRD study of the physical phenomena underlying prompt photocurrents in microelectronic devices and circuits. The goals of this project were to obtain an improved understanding of these phenomena, and to incorporate improved models of photocurrent effects into simulation codes to assist designers in meeting hostile radiation requirements with minimum build and test cycles. We have also developed a new capability on the ion microbeam accelerator in Sandia's Ion Beam Materials Research Laboratory (the Transient Radiation Microscope, or TRM) to supply ionizing radiation in selected micro-regions of a device. The dose rates achieved in this new facility approach those possible with conventional large-scale dose-rate sources at Sandia such as HERMES III and Saturn. It is now possible to test the phy...

Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan

Science.gov (United States)

Washio, Kunihiko; Kouta, Hikaru

2002-06-01

This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

Characteristics of entropy generation and heat transfer in double-layered micro heat sinks with complex structure

International Nuclear Information System (INIS)

Zhai, Y.L.; Xia, G.D.; Liu, X.F.; Wang, J.

2015-01-01

Highlights: • A novel DL-MCHS with complex structure is presented. • A model of entropy generation rate of DL-MCHSs is derived from the first and second laws of thermodynamics. • DL-MCHSs show better thermodynamic advantage and thermal performance under large volumetric flow rate. - Abstract: A new type of double-layered micro heat sink (DL-MCHS) with complex structure is designed and investigated numerically. Moreover, a model of entropy generation rate of DL-MCHSs is also derived from the first and second laws of thermodynamics. Results for the relationship of entropy generation rate between the first and second layer of DL-MCHSs, total entropy generation rate, the average temperature on the bottom wall, thermal resistance and pressure drop are investigated in detail, respectively. The results indicate that the effect of entropy generation rate of the first layer on total entropy generation rate is dominant. The thermal characteristic of DL-MCHSs with complex structure is better than that of all DL-MCHSs and single-layered micro heat sinks (SL-MCHSs) with simple structure under the same volumetric flow rate. However, DL-MCHSs only show better thermodynamic advantage and thermal performance than SL-MCHSs with complex structure when the volumetric flow rate larger than a certain value. It is not reasonable to use DL-MCHSs for cooling microelectronic equipments under small volumetric flow rate due to the larger irreversibility. Finally, the pressure drop of DL-MHCSs can be reduced by properly changing the channel height under various volumetric flow rates. Due to the less irreversibility and more uniform temperature distribution on the bottom wall, DL-MCHSs can effectively eliminate the internal thermal stresses in microelectronic equipments. Therefore, DL-MCHSs are an alternative method for the electronic cooling. Moreover, the thermodynamic analysis provides references for the actual application design

Grain Structure Control of Additively Manufactured Metallic Materials

Directory of Open Access Journals (Sweden)

Fuyao Yan

2017-11-01

Full Text Available Grain structure control is challenging for metal additive manufacturing (AM. Grain structure optimization requires the control of grain morphology with grain size refinement, which can improve the mechanical properties of additive manufactured components. This work summarizes methods to promote fine equiaxed grains in both the additive manufacturing process and subsequent heat treatment. Influences of temperature gradient, solidification velocity and alloy composition on grain morphology are discussed. Equiaxed solidification is greatly promoted by introducing a high density of heterogeneous nucleation sites via powder rate control in the direct energy deposition (DED technique or powder surface treatment for powder-bed techniques. Grain growth/coarsening during post-processing heat treatment can be restricted by presence of nano-scale oxide particles formed in-situ during AM. Grain refinement of martensitic steels can also be achieved by cyclic austenitizing in post-processing heat treatment. Evidently, new alloy powder design is another sustainable method enhancing the capability of AM for high-performance components with desirable microstructures.

Out-of-autoclave manufacturing of GLARE panels using resistance heating

NARCIS (Netherlands)

Muller, B.; Palardy, G.; Teixeira De Freitas, S.; Sinke, J.

2017-01-01

Autoclave manufacturing of fibre metal laminates, such as GLARE, is an expensive process.Therefore, there is an increasing interest to find cost effective out-of-autoclave manufacturing processes without diminishing the laminate quality. The aim of this study is to

Prototype solar heating and combined heating and cooling systems. Quarterly report No. 6

Energy Technology Data Exchange (ETDEWEB)

1978-01-06

The General Electric Company is developing eight prototype solar heating and combined heating and cooling systems. This effort includes development, manufacture, test, installation, maintenance, problem resolution, and performance evaluation.

Additive Manufacturing of Wind Turbine Molds

Energy Technology Data Exchange (ETDEWEB)

Post, Brian [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Richardson, Bradley [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Lloyd, Peter [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Love, Lonnie [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Nolet, Stephen [TPI Composites, Scottsdale, AZ (United States); Hannan, James [TPI Composites, Scottsdale, AZ (United States)

2017-07-01

The objective of this project was to explore the utility of Big Area Additive Manufacturing (BAAM) for low cost manufacturing of wind turbine molds. Engineers at Oak Ridge National Laboratory (ORNL) and TPI Composites (TPI) collaborated to design and manufacture a printed mold that can be used for resin infusion of wind turbine components. Specific focus was on required material properties (operating temperatures and pressures, coefficient of thermal expansion (CTE), thermal conductivity), surface finish (accuracy and coatings) and system integration (integrated vacuum ports, and heating element). The project began with a simple proof of principle components, targeting surface coatings and material properties for printing a small section (approximately 4’ x 4’ x 2’) of a mold. Next, the second phase scaled up and integrated with the objective of capturing all of the necessary components (integrated heating to accelerate cure time, and vacuum, sealing) for resin infusion on a mold of significant size (8’ x 20’ x 6’).

Study of thermo-fluidic behavior of micro-droplet in inkjet-based micro manufacturing processes

Science.gov (United States)

Das, Raju; Mahapatra, Abhijit; Ball, Amit Kumar; Roy, Shibendu Shekhar; Murmu, Naresh Chandra

2017-06-01

Inkjet printing technology, a maskless, non-contact patterning operation, which has been a revelation in the field of micro and nano manufacturing for its use in the selective deposition of desired materials. It is becoming an exciting alternative technology such as lithography to print functional material on to a substrate. Selective deposition of functional materials on desired substrates is a basic requirement in many of the printing based micro and nano manufacturing operations like the fabrication of microelectronic devices, solar cell, Light-emitting Diode (LED) research fields like pharmaceutical industries for drug discovery purposes and in biotechnology to make DNA microarrays. In this paper, an attempt has been made to design and develop an indigenous Electrohydrodynamic Inkjet printing system for micro fabrication and to study the interrelationships between various thermos-fluidic parameters of the ink material in the printing process. The effect of printing process parameters on printing performance characteristics has also been studied. And the applicability of the process has also been experimentally demonstrated. The experimentally found results were quite satisfactory and accordance to its applicability.

Applications of synchrotron X-rays in microelectronics industry research

International Nuclear Information System (INIS)

Jordan-Sweet, Jean L.; Detavernier, Christophe; Lavoie, Christian; Mooney, Patricia M.; Toney, Michael F.

2005-01-01

The high flux and density of X-rays produced at synchrotrons provide the microelectronics industry with a powerful probe of the structure and behavior of a wide array of solid materials that are being developed for use in devices of the future. They also are of great use in determining why currently-used materials and processes sometimes fail. This paper describes the X20 X-ray beamline facility operated by IBM at the National Synchrotron Light Source, and presents a series of three industry challenges and results that illustrate the variety of techniques used and problems addressed. The value of this research ranges from solving short-term, technically specific problems to increasing our academic understanding of materials in general. Techniques discussed include high-resolution diffraction, time-resolved diffraction, texture measurements, and grazing-incidence diffraction

Manufacturing and testing of ITER divertor gas box liners

International Nuclear Information System (INIS)

Mazul, I.; Giniatulin, R.; Komarov, V.L.; Krylov, V.; Kuzmin, Ye.; Makhankov, A.; Odintsov, V.; Zhuk, A.

1998-01-01

Among a variety of R and D works performed by different ITER parties there are seven large projects which deal with the development, manufacturing and testing of most important complex reactor components. One of the projects is directed to produce a prototype of divertor cassette. In according with integration plan two full size liners with dummy armour are manufactured by RF Home Team. Except for liners with dummy armors the large - scale mock-up with real armour have to be manufactured in order to demonstrate the semi-industrial possibilities for joining of Be and W to CuCrZr heat - sink structure. The design of this liners, technological approaches to their manufacturing are presented. The description of brazing facility and joining technology which use a fast ohmic heating by 15 kA current is made. A mock-up of 800 mm in length and 90 mm in width was armored by 18 Be tiles (44 x 44 mm 2 in plane, 10 mm - thick) and 16 W-Cu tiles (44 x 44 mm 2 in plane, 3 mm - thick W). The preliminary results of high heat flux testing of the armored mock-ups are also presented. (author)

Characterization and Processing Behavior of Heated Aluminum-Polycarbonate Composite Build Plates for the FDM Additive Manufacturing Process

Directory of Open Access Journals (Sweden)

Sherri L. Messimer

2018-02-01

Full Text Available One of the most essential components of the fused deposition modeling (FDM additive manufacturing (AM process is the build plate, the surface upon which the part is constructed. These are typically made from aluminum or glass, but there are clear disadvantages to both and restrictions on which materials can be processed on them successfully. This study examined the suitability of heated aluminum-polycarbonate (AL-PC composite print beds for FDM, looking particularly at the mechanical properties, thermal behavior, deformation behavior, bonding strength with deposited material, printing quality, and range of material usability. Theoretical examination and physical experiments were performed for each of these areas; the results were compared to similar experiments done using heated aluminum and aluminum-glass print beds. Ten distinct materials (ABS, PLA, PET, HIPS, PC, TPU, PVA, nylon, metal PLA, and carbon-fiber PLA were tested for printing performance. The use of a heated AL-PC print bed was found to be a practical option for most of the materials, particularly ABS and TPU, which are often challenging to process using traditional print bed types. Generally, the results were found to be equivalent to or superior to tempered glass and superior to standard aluminum build plates in terms of printing capability.

Effect of heat treatment on the microstructure of Co-Cr-W alloy fabricated by laser additive manufacturing

Science.gov (United States)

Ren, Bo; Chen, Changjun; Zhang, Min

2018-04-01

Stellite 6 cobalt-based alloy powder was used to produce Co-Cr-W alloy using laser additive manufacturing technology, and then different heat treatment strategies were carried out on the deposited sample. The characteristics of microstructure under different heat treatment conditions were investigated using scanning electron microscopy with energy dispersive spectroscopy, transmission electron microscope, and x-ray diffraction. The results show that the as-deposited sample has few cracks or pores, and the microstructure is typical dendritic structure, and lamellar eutectic carbides are rich in Cr in interdendritic. The matrix mainly consists of γ phases and a few ɛ phases. Some γ phases transform into ɛ phases after 900°C/6 h aging treatment and lamellar eutectic carbides transform into blocky carbides presenting as a network, most of the carbides are rich in Cr and a few are rich in W. When heat treated at 1200°C/1 h followed by water cooling and then treated at 900°C/6 h followed by furnace cooling, it can be found that some γ phases transform into ɛ phases. The carbides transform into elliptical M23C6 carbides that are rich in Cr with the size of 1 to 3 μm and a part of W-rich carbides.

Cooling Performance of Additively Manufactured Microchannels and Film Cooling Holes

Science.gov (United States)

Stimpson, Curtis K.

Additive manufacturing (AM) enables fabrication of components that cannot be made with any other manufacturing method. Significant advances in metal-based AM systems have made this technology feasible for building production parts to be used use in commercial products. In particular, the gas turbine industry benefits from AM as a manufacturing technique especially for development of components subjected to high heat flux. It has been shown that the use of microchannels in high heat flux components can lead to more efficient cooling designs than those that presently exist. The current manufacturing methods have prevented the use of microchannels in such parts, but AM now makes them manufacturable. However, before such designs can become a reality, much research must be done to characterize impacts on flow and heat transfer of AM parts. The current study considers the effect on flow and heat transfer through turbine cooling features made with AM. Specifically, the performance of microchannels and film cooling holes made with laser powder bed fusion (L-PBF) is assessed. A number of test coupons containing microchannels were built from high temperature alloy powders on a commercially available L-PBF machine. Pressure drop and heat transfer experiments characterized the flow losses and convective heat transfer of air passing through the channels at various Reynolds numbers and Mach numbers. The roughness of the channels' surfaces was characterized in terms of statistical roughness parameters; the morphology of the roughness was examined qualitatively. Magnitude and morphology of surface roughness found on AM parts is unlike any form of roughness seen in the literature. It was found that the high levels of roughness on AM surfaces result in markedly augmented pressure loss and heat transfer at all Reynolds numbers, and conventional flow and heat transfer correlations produce erroneous estimates. The physical roughness measurements made in this study were correlated to

Evolution of solidification texture during additive manufacturing

Science.gov (United States)

Wei, H. L.; Mazumder, J.; DebRoy, T.

2015-01-01

Striking differences in the solidification textures of a nickel based alloy owing to changes in laser scanning pattern during additive manufacturing are examined based on theory and experimental data. Understanding and controlling texture are important because it affects mechanical and chemical properties. Solidification texture depends on the local heat flow directions and competitive grain growth in one of the six preferred growth directions in face centered cubic alloys. Therefore, the heat flow directions are examined for various laser beam scanning patterns based on numerical modeling of heat transfer and fluid flow in three dimensions. Here we show that numerical modeling can not only provide a deeper understanding of the solidification growth patterns during the additive manufacturing, it also serves as a basis for customizing solidification textures which are important for properties and performance of components. PMID:26553246

Monitoring of Danish marketed solar heating systems

International Nuclear Information System (INIS)

Ellehauge, K.

1993-01-01

The paper describes the monitoring of manufactured solar heating systems for domestic hot water combined with space heating and systems for domestic hot water only. Results from the monitoring of 5 marketed combined systems for domestic hot water and space heating are presented. The systems situated at one family houses at different sites in Denmark have been monitored from January/February 1992. For the detailed monitoring of manufactured systems only for domestic hot water a test facility for simultaneous monitoring of 5 solar heating systems has been established at the Thermal Insulation Laboratory. (au)

Ultralow-loss CMOS copper plasmonic waveguides

DEFF Research Database (Denmark)

Fedyanin, Dmitry Yu.; Yakubovsky, Dmitry I.; Kirtaev, Roman V.

2016-01-01

with microelectronics manufacturing technologies. This prevents plasmonic components from integration with both silicon photonics and silicon microelectronics. Here, we demonstrate ultralow-loss copper plasmonic waveguides fabricated in a simple complementary metal-oxide semiconductor (CMOS) compatible process, which...

Characterization of industrial process waste heat and input heat streams

Energy Technology Data Exchange (ETDEWEB)

Wilfert, G.L.; Huber, H.B.; Dodge, R.E.; Garrett-Price, B.A.; Fassbender, L.L.; Griffin, E.A.; Brown, D.R.; Moore, N.L.

1984-05-01

The nature and extent of industrial waste heat associated with the manufacturing sector of the US economy are identified. Industry energy information is reviewed and the energy content in waste heat streams emanating from 108 energy-intensive industrial processes is estimated. Generic types of process equipment are identified and the energy content in gaseous, liquid, and steam waste streams emanating from this equipment is evaluated. Matchups between the energy content of waste heat streams and candidate uses are identified. The resultant matrix identifies 256 source/sink (waste heat/candidate input heat) temperature combinations. (MHR)

Effects of Heat Treatment on the Microstructures and High Temperature Mechanical Properties of Hypereutectic Al-14Si-Cu-Mg Alloy Manufactured by Liquid Phase Sintering Process

Science.gov (United States)

Heo, Joon-Young; Gwon, Jin-Han; Park, Jong-Kwan; Lee, Kee-Ahn

2018-05-01

Hypereutectic Al-Si alloy is an aluminum alloy containing at least 12.6 wt.% Si. It is necessary to evenly control the primary Si particle size and distribution in hypereutectic Al-Si alloy. In order to achieve this, there have been attempts to manufacture hypereutectic Al-Si alloy through a liquid phase sintering. This study investigated the microstructures and high temperature mechanical properties of hypereutectic Al-14Si-Cu-Mg alloy manufactured by liquid phase sintering process and changes in them after T6 heat treatment. Microstructural observation identified large amounts of small primary Si particles evenly distributed in the matrix, and small amounts of various precipitation phases were found in grain interiors and grain boundaries. After T6 heat treatment, the primary Si particle size and shape did not change significantly, but the size and distribution of CuAl2 ( θ) and AlCuMgSi ( Q) changed. Hardness tests measured 97.36 HV after sintering and 142.5 HV after heat treatment. Compression tests were performed from room temperature to 300 °C. The results represented that yield strength was greater after heat treatment (RT 300 °C: 351 93 MPa) than after sintering (RT 300 °C: 210 89 MPa). Fracture surface analysis identified cracks developing mostly along the interface between the primary Si particles and the matrix with some differences among temperature conditions. In addition, brittle fracture mode was found after T6 heat treatment.

Carbon-ionogel supercapacitors for integrated microelectronics

Science.gov (United States)

Leung, Greg; Smith, Leland; Lau, Jonathan; Dunn, Bruce; Chui, Chi On

2016-01-01

To exceed the performance limits of dielectric capacitors in microelectronic circuit applications, we design and demonstrate on-chip coplanar electric double-layer capacitors (EDLCs), or supercapacitors, employing carbon-coated gold electrodes with ionogel electrolyte. The formation of carbon-coated microelectrodes is accomplished by solution processing and results in a ten-fold increase in EDLC capacitance compared to bare gold electrodes without carbon. At frequencies up to 10 Hz, an areal capacitance of 2.1 pF μm-2 is achieved for coplanar carbon-ionogel EDLCs with 10 μm electrode gaps and 0.14 mm2 electrode area. Our smallest devices, comprised of 5 μm electrode gaps and 80 μm2 of active electrode area, reach areal capacitance values of ˜0.3 pF μm-2 at frequencies up to 1 kHz, even without carbon. To our knowledge, these are the highest reported values to date for on-chip EDLCs with sub-mm2 areas. A physical EDLC model is developed through the use of computer-aided simulations for design exploration and optimization of coplanar EDLCs. Through modeling and comparison with experimental data, we highlight the importance of reducing the electrode gap and electrolyte resistance to achieve maximum performance from on-chip EDLCs.

Assessing Advanced High School and Undergraduate Students' Thinking Skills: The Chemistry--From the Nanoscale to Microelectronics Module

Science.gov (United States)

Dori, Yehudit Judy; Dangur, Vered; Avargil, Shirly; Peskin, Uri

2014-01-01

Chemistry students in Israel have two options for studying chemistry: basic or honors (advanced placement). For instruction in high school honors chemistry courses, we developed a module focusing on abstract topics in quantum mechanics: Chemistry--From the Nanoscale to Microelectronics. The module adopts a visual-conceptual approach, which…

[Application of microelectronics CAD tools to synthetic biology].

Science.gov (United States)

Madec, Morgan; Haiech, Jacques; Rosati, Élise; Rezgui, Abir; Gendrault, Yves; Lallement, Christophe

2017-02-01

Synthetic biology is an emerging science that aims to create new biological functions that do not exist in nature, based on the knowledge acquired in life science over the last century. Since the beginning of this century, several projects in synthetic biology have emerged. The complexity of the developed artificial bio-functions is relatively low so that empirical design methods could be used for the design process. Nevertheless, with the increasing complexity of biological circuits, this is no longer the case and a large number of computer aided design softwares have been developed in the past few years. These tools include languages for the behavioral description and the mathematical modelling of biological systems, simulators at different levels of abstraction, libraries of biological devices and circuit design automation algorithms. All of these tools already exist in other fields of engineering sciences, particularly in microelectronics. This is the approach that is put forward in this paper. © 2017 médecine/sciences – Inserm.

Laser assisted hybrid additive manufacturing of thermoelectric modules

Science.gov (United States)

Zhang, Tao; Tewolde, Mahder; Longtin, Jon P.; Hwang, David J.

2017-02-01

Thermoelectric generators (TEGs) are an attractive means to produce electricity, particular from waste heat applications. However, TEGs are almost exclusively manufactured as flat, rigid modules of limited size and shape, and therefore an appropriate mounting for intimate contact of TEGs modules onto arbitrary surfaces represents a significant challenge. In this study, we introduce laser assisted additive manufacturing method to produce multi-layered thermoelectric generator device directly on flat and non-flat surfaces for waste heat recovery. The laser assisted processing spans from laser scribing of thermal sprayed thin films, curing of dispensed thermoelectric inks and selective laser sintering to functionalize thermoelectric materials.

Microstructure and hardness studies of Inconel 718 manufactured by selective laser melting before and after solution heat treatment

International Nuclear Information System (INIS)

Tucho, Wakshum M.; Cuvillier, Priscille; Sjolyst-Kverneland, Atle; Hansen, Vidar

2017-01-01

The microstructure of Additive Manufactured (AM) Inconel 718 in general and Selective Laser Melting (SLM), in particular is different from the material produced by conventional methods due to the rapid solidification process associated with the former. As a result, the widely adapted standard solution heat treatment temperature (<1100 °C) for conventional material is found to be not high enough for materials fabricated with SLM method in order to dissolve Laves and other microsegregated phases for releasing the ageing constituents (Nb, Ti, Al) sufficiently into the alloy matrix. In this study, sample of Inconel 718 fabricated with SLM method were solution heat-treated to 1100 °C or 1250 °C at different hold times to investigate the dissolution of macro- and micro-segregated precipitates. Investigations of microstructure and segregation in as-printed and solution heat-treated states have been studied using Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and Optical Microscopy (OM). Measurement of material hardness was performed with Vickers hardness tests. The microstructure of the as-printed parts exhibit non-columnar grains, but contain well-shaped columnar/cellular sub-grains. The intergranular boundaries are decorated with high density of dislocations and segregated particles. Tremendous stress relief and grain coarsening were observed with solution heat treatment. In particular, at 1250 °C annealing, the sub-grains, including precipitates and dislocation networks along the sub-grain boundaries, were entirely dissolved. However, the 1100/1250 °C solution heat treatment scheme could not dissolve microsegregated precipitates and carbides completely. Details of the analysis on microstructure, dissolution of precipitates and hardness are presented.

Microstructure and hardness studies of Inconel 718 manufactured by selective laser melting before and after solution heat treatment

Energy Technology Data Exchange (ETDEWEB)

Tucho, Wakshum M., E-mail: wakshum.m.tucho@uis.no [Department of Mechanical and Structural Engineering and Materials Science, University of Stavanger, N-4036 Stavanger (Norway); Cuvillier, Priscille [Department of Mechanical and Structural Engineering and Materials Science, University of Stavanger, N-4036 Stavanger (Norway); Sjolyst-Kverneland, Atle [Roxar/Emerson Process Management, POB 112, 4065 Stavanger (Norway); Hansen, Vidar [Department of Mechanical and Structural Engineering and Materials Science, University of Stavanger, N-4036 Stavanger (Norway)

2017-03-24

The microstructure of Additive Manufactured (AM) Inconel 718 in general and Selective Laser Melting (SLM), in particular is different from the material produced by conventional methods due to the rapid solidification process associated with the former. As a result, the widely adapted standard solution heat treatment temperature (<1100 °C) for conventional material is found to be not high enough for materials fabricated with SLM method in order to dissolve Laves and other microsegregated phases for releasing the ageing constituents (Nb, Ti, Al) sufficiently into the alloy matrix. In this study, sample of Inconel 718 fabricated with SLM method were solution heat-treated to 1100 °C or 1250 °C at different hold times to investigate the dissolution of macro- and micro-segregated precipitates. Investigations of microstructure and segregation in as-printed and solution heat-treated states have been studied using Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and Optical Microscopy (OM). Measurement of material hardness was performed with Vickers hardness tests. The microstructure of the as-printed parts exhibit non-columnar grains, but contain well-shaped columnar/cellular sub-grains. The intergranular boundaries are decorated with high density of dislocations and segregated particles. Tremendous stress relief and grain coarsening were observed with solution heat treatment. In particular, at 1250 °C annealing, the sub-grains, including precipitates and dislocation networks along the sub-grain boundaries, were entirely dissolved. However, the 1100/1250 °C solution heat treatment scheme could not dissolve microsegregated precipitates and carbides completely. Details of the analysis on microstructure, dissolution of precipitates and hardness are presented.

Manufacturing method for parts opposed to plasmas and manufacturing device therefor

International Nuclear Information System (INIS)

Fuse, Toshiaki; Tachikawa, Nobuo.

1995-01-01

The present invention provides a method of and a device for manufacturing heat insulation parts which are opposed to plasmas, such as parts in the inside of a thermonuclear reactor, which less suffer from defects such as crackings and peelings in the vicinity of the joining portion of the parts. Namely, when an armour and a heat sink are cooled to a room temperature after joining them, the upper surface of the armour and the bottom of the heat sink are pressurized. Then after restricting the convex deformation at the upper surface of the armour and the concave deformation at the bottom of the heat sink, the heat sink bottom are extended at from 600degC to a room temperature or at a room temperature. When a heat resistant material with a small heat expansion coefficient is joined with a cooling material with a large heat expansion coefficient and then cooled, deformation and residual stresses are generated by the difference of the shrinking amount. But deformation and the residual stresses can be reduced by gradually cooling them while restricting them by using a joining device compared with a case of not restricting them. As a result, occurrence of crackings and peelings in the vicinity of the joining portion can be prevented. (I.S.)

Multi-Function Gas Fired Heat Pump

Energy Technology Data Exchange (ETDEWEB)

Mehdizadeh Momen, Ayyoub [ORNL; Abu-Heiba, Ahmad [ORNL; Vineyard, Edward Allan [ORNL

2015-11-01

The aim of this project was to design a residential fuel fired heat pump and further improve efficiency in collaboration with an industry partner – Southwest Gas, the developer of the Nextaire commercial rooftop fuel-fired heat pump. Work started in late 2010. After extensive search for suitable engines, one manufactured by Marathon was selected. Several prototypes were designed and built over the following four years. Design changes were focused on lowering the cost of components and the cost of manufacturing. The design evolved to a final one that yielded the lowest cost. The final design also incorporates noise and vibration reduction measures that were verified to be effective through a customer survey. ETL certification is currently (as of November 2015) underway. Southwest Gas is currently in talks with GTI to reach an agreement through which GTI will assess the commercial viability and potential of the heat pump. Southwest Gas is searching for investors to manufacture the heat pump and introduce it to the market.

Multi-orifice deposition nozzle for additive manufacturing

Science.gov (United States)

Lind, Randall F.; Post, Brian K.; Cini, Colin L.

2017-11-21

An additive manufacturing extrusion head includes a nozzle for accepting and depositing a heated material onto a work surface and/or part. The nozzle includes a valve body and an internal poppet body moveable between positions to permit deposition of at least two bead sizes of heated material onto a work surface and/or part.

High performance passive solar heating system with heat pipe energy transfer

NARCIS (Netherlands)

Wit, de M.H.; Hensen, J.L.M.; Dijk, van H.A.L.; Brink, van den G.J.; Galen, van E; Ouden, den C.

1984-01-01

The aim of the project is to develop a passive solar heating system with a higher efficiency (regarding accumulation and transfer of solar heat into dwellings) than convential concrete thermal storage walls and with restricted extra costs for manufacturing the system. This is to be achieved by the

Equipment for manufacture of single crystals by zone overlaying

International Nuclear Information System (INIS)

Richter, O.

1981-01-01

The patented heater element for the manufacture of monocrystals by zone melting of layers consists of a heated pipe with insert slipped onto the heated pipe or consisting, in turn, of pieces fixed parallel to the heated pipe or a piece placed between two pipes. The insert is designed for stabilizing the melt surface. (Ha)

Performance Analysis Review of Thorium TRISO Coated Particles during Manufacture, Irradiation and Accident Condition Heating Tests

International Nuclear Information System (INIS)

2015-03-01

Thorium, in combination with high enriched uranium, was used in all early high temperature reactors (HTRs). Initially, the fuel was contained in a kernel of coated particles. However, particle quality was low in the 1960s and early 1970s. Modern, high quality, tristructural isotropic (TRISO) fuel particles with thorium oxide and uranium dioxide (UO 2 ) had been manufactured since 1978 and were successfully demonstrated in irradiation and accident tests. In 1980, HTR fuels changed to low enriched uranium UO 2 TRISO fuels. The wide ranging development and demonstration programme was successful, and it established a worldwide standard that is still valid today. During the process, results of the thorium work with high quality TRISO fuel particles had not been fully evaluated or documented. This publication collects and presents the information and demonstrates the performance of thorium TRISO fuels.This publication is an outcome of the technical contract awarded under the IAEA Coordinated Research Project on Near Term and Promising Long Term Options for Deployment of Thorium Based Nuclear Energy, initiated in 2012. It is based on the compilation and analysis of available results on thorium TRISO coated particle performance in manufacturing and during irradiation and accident condition heating tests

The effect of hot days on occupational heat stress in the manufacturing industry: implications for workers' well-being and productivity

Science.gov (United States)

Pogačar, Tjaša; Casanueva, Ana; Kozjek, Katja; Ciuha, Urša; Mekjavić, Igor B.; Kajfež Bogataj, Lučka; Črepinšek, Zalika

2018-03-01

Climate change is expected to exacerbate heat stress at the workplace in temperate regions, such as Slovenia. It is therefore of paramount importance to study present and future summer heat conditions and analyze the impact of heat on workers. A set of climate indices based on summer mean (Tmean) and maximum (Tmax) air temperatures, such as the number of hot days (HD: Tmax above 30 °C), and Wet Bulb Globe Temperature (WBGT) were used to account for heat conditions in Slovenia at six locations in the period 1981-2010. Observed trends (1961-2011) of Tmean and Tmax in July were positive, being larger in the eastern part of the country. Climate change projections showed an increase up to 4.5 °C for mean temperature and 35 days for HD by the end of the twenty-first century under the high emission scenario. The increase in WBGT was smaller, although sufficiently high to increase the frequency of days with a high risk of heat stress up to an average of a third of the summer days. A case study performed at a Slovenian automobile parts manufacturing plant revealed non-optimal working conditions during summer 2016 (WBGT mainly between 20 and 25 °C). A survey conducted on 400 workers revealed that 96% perceived the temperature conditions as unsuitable, and 56% experienced headaches and fatigue. Given these conditions and climate change projections, the escalating problem of heat is worrisome. The European Commission initiated a program of research within the Horizon 2020 program to develop a heat warning system for European workers and employers, which will incorporate case-specific solutions to mitigate heat stress.

Manufacturing study of Be, W and CFC bonded structures for plasma-facing components

Science.gov (United States)

Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

2004-08-01

A manufacturing study has been conducted for Be, W, and CFC bonded structures employed in plasma-facing components for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating processes has been used to bond the three materials. An Al-Si base interlayer has been used to bond Be to the Cu-alloy. The heating processes have been selected to match the required heat treatment conditions for the Cu-alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. For both the W and CFC tiles, the materials have been brazed at the same time to the Cu-alloy. Ni-Cu-Mn and Cu-Ti brazing materials have been used for the W and CFC tiles, respectively. Using the above bonding techniques, partial mockups of a blanket first-wall panel and divertor target have been successfully manufactured.

Manufacturing study of Be, W and CFC bonded structures for plasma-facing components

International Nuclear Information System (INIS)

Onozuka, M.; Hirai, S.; Kikuchi, K.; Oda, Y.; Shimizu, K.

2004-01-01

A manufacturing study has been conducted for Be, W, and CFC bonded structures employed in plasma-facing components for the ITER. For Be tiles bonded to the Cu-Cr-Zr alloy heat sink with stainless-steel cooling pipes, a one-axis hot press with two heating processes has been used to bond the three materials. An Al-Si base interlayer has been used to bond Be to the Cu-alloy. The heating processes have been selected to match the required heat treatment conditions for the Cu-alloy. Because of the limited heat processes using a conventional hot press, the manufacturing cost can be minimized. For both the W and CFC tiles, the materials have been brazed at the same time to the Cu-alloy. Ni-Cu-Mn and Cu-Ti brazing materials have been used for the W and CFC tiles, respectively. Using the above bonding techniques, partial mockups of a blanket first-wall panel and divertor target have been successfully manufactured

Experimental Study of Single Phase Flow in a Closed-Loop Cooling System with Integrated Mini-Channel Heat Sink

Directory of Open Access Journals (Sweden)

Lei Ma

2016-06-01

Full Text Available The flow and heat transfer characteristics of a closed-loop cooling system with a mini-channel heat sink for thermal management of electronics is studied experimentally. The heat sink is designed with corrugated fins to improve its heat dissipation capability. The experiments are performed using variable coolant volumetric flow rates and input heating powers. The experimental results show a high and reliable thermal performance using the heat sink with corrugated fins. The heat transfer capability is improved up to 30 W/cm2 when the base temperature is kept at a stable and acceptable level. Besides the heat transfer capability enhancement, the capability of the system to transfer heat for a long distance is also studied and a fast thermal response time to reach steady state is observed once the input heating power or the volume flow rate are varied. Under different input heat source powers and volumetric flow rates, our results suggest potential applications of the designed mini-channel heat sink in cooling microelectronics.

Micro-structured rough surfaces by laser etching for heat transfer enhancement on flush mounted heat sinks

International Nuclear Information System (INIS)

Ventola, L; Scaltrito, L; Ferrero, S; Chiavazzo, E; Asinari, P; Maccioni, G

2014-01-01

The aim of this work is to improve heat transfer performances of flush mounted heat sinks used in electronic cooling. To do this we patterned 1.23 cm 2 heat sinks surfaces by microstructured roughnesses built by laser etching manufacturing technique, and experimentally measured the convective heat transfer enhancements due to different patterns. Each roughness differs from the others with regards to the number and the size of the micro-fins (e.g. the micro- fin length ranges from 200 to 1100 μm). Experimental tests were carried out in forced air cooling regime. In particular fully turbulent flows (heating edge based Reynolds number ranging from 3000 to 17000) were explored. Convective heat transfer coefficient of the best micro-structured heat sink is found to be roughly two times compared to the smooth heat sinks one. In addition, surface area roughly doubles with regard to smooth heat sinks, due to the presence of micro-fins. Consequently, patterned heat sinks thermal transmittance [W/K] is found to be roughly four times the smooth heat sinks one. We hope this work may open the way for huge boost in the technology of electronic cooling by innovative manufacturing techniques.

The Diverse Ecology of Electronic Materials

NARCIS (Netherlands)

Mody, Cyrus C.M.; Teissier, Pierre; Mody, Cyrus C. M.; Tiggelen, Brigitte van

2017-01-01

Silicon has been the dominant material in microelectronics for a half century. Other materials, however, have subsidiary roles in microelectronics manufacturing. A few materials have even been promoted as replacements for silicon. Yet because of silicon’s dominance, none of these alternatives has

Perspectives of heat transfer enhancement in nuclear reactors toward nanofluids applications

International Nuclear Information System (INIS)

Rocha, Marcelo S.; Cabral, Eduardo L.L.; Sabundjian, Gaiane

2013-01-01

Nanofluids are colloidal suspensions of nanoparticles in a base fluid with interesting physical properties and large potential for heat transfer enhancement in thermal systems among other applications. There are an increasing number of nanofluids investigations concerning many aspects of synthesis and fabrication technologies, physical properties, and special applications. Results demonstrate that physical properties like high thermal conductivities and high critical heat flux (CHF) of some nanofluids classifies them as potential working fluids for high heat flux transportation in special systems, including thermal management of microelectronic devices (MEMS) and nuclear reactors. Understanding the importance of such investigations for the knowledge development of nuclear engineering a new research is being conducted at the Nuclear Engineering Center (CEN) of the Nuclear and Energy Research Institute (IPEN/CNEN-SP) to analyze the application potentiality of some nanofluids in nuclear systems for heat transfer enhancement under ionizing radiation influence. In this work a revision of theoretical and experimental studies of nanofluids is performed and its potentiality for using in future generations of nuclear reactors is highlighted showing the status of the research at present. (author)

Additive Manufacturing of Fuel Injectors

Energy Technology Data Exchange (ETDEWEB)

Sadek Tadros, Dr. Alber Alphonse [Edison Welding Institute, Inc., Columbus, OH (United States); Ritter, Dr. George W. [Edison Welding Institute, Inc., Columbus, OH (United States); Drews, Charles Donald [Edison Welding Institute, Inc., Columbus, OH (United States); Ryan, Daniel [Solar Turbines Inc., San Diego, CA (United States)

2017-10-24

Additive manufacturing (AM), also known as 3D-printing, has been shifting from a novelty prototyping paradigm to a legitimate manufacturing tool capable of creating components for highly complex engineered products. An emerging AM technology for producing metal parts is the laser powder bed fusion (L-PBF) process; however, industry manufacturing specifications and component design practices for L-PBF have not yet been established. Solar Turbines Incorporated (Solar), an industrial gas turbine manufacturer, has been evaluating AM technology for development and production applications with the desire to enable accelerated product development cycle times, overall turbine efficiency improvements, and supply chain flexibility relative to conventional manufacturing processes (casting, brazing, welding). Accordingly, Solar teamed with EWI on a joint two-and-a-half-year project with the goal of developing a production L-PBF AM process capable of consistently producing high-nickel alloy material suitable for high temperature gas turbine engine fuel injector components. The project plan tasks were designed to understand the interaction of the process variables and their combined impact on the resultant AM material quality. The composition of the high-nickel alloy powders selected for this program met the conventional cast Hastelloy X compositional limits and were commercially available in different particle size distributions (PSD) from two suppliers. Solar produced all the test articles and both EWI and Solar shared responsibility for analyzing them. The effects of powder metal input stock, laser parameters, heat treatments, and post-finishing methods were evaluated. This process knowledge was then used to generate tensile, fatigue, and creep material properties data curves suitable for component design activities. The key process controls for ensuring consistent material properties were documented in AM powder and process specifications. The basic components of the project

Effects of anodizing parameters and heat treatment on nanotopographical features, bioactivity, and cell culture response of additively manufactured porous titanium.

Science.gov (United States)

Amin Yavari, S; Chai, Y C; Böttger, A J; Wauthle, R; Schrooten, J; Weinans, H; Zadpoor, A A

2015-06-01

Anodizing could be used for bio-functionalization of the surfaces of titanium alloys. In this study, we use anodizing for creating nanotubes on the surface of porous titanium alloy bone substitutes manufactured using selective laser melting. Different sets of anodizing parameters (voltage: 10 or 20V anodizing time: 30min to 3h) are used for anodizing porous titanium structures that were later heat treated at 500°C. The nanotopographical features are examined using electron microscopy while the bioactivity of anodized surfaces is measured using immersion tests in the simulated body fluid (SBF). Moreover, the effects of anodizing and heat treatment on the performance of one representative anodized porous titanium structures are evaluated using in vitro cell culture assays using human periosteum-derived cells (hPDCs). It has been shown that while anodizing with different anodizing parameters results in very different nanotopographical features, i.e. nanotubes in the range of 20 to 55nm, anodized surfaces have limited apatite-forming ability regardless of the applied anodizing parameters. The results of in vitro cell culture show that both anodizing, and thus generation of regular nanotopographical feature, and heat treatment improve the cell culture response of porous titanium. In particular, cell proliferation measured using metabolic activity and DNA content was improved for anodized and heat treated as well as for anodized but not heat-treated specimens. Heat treatment additionally improved the cell attachment of porous titanium surfaces and upregulated expression of osteogenic markers. Anodized but not heat-treated specimens showed some limited signs of upregulated expression of osteogenic markers. In conclusion, while varying the anodizing parameters creates different nanotube structure, it does not improve apatite-forming ability of porous titanium. However, both anodizing and heat treatment at 500°C improve the cell culture response of porous titanium

Indigenous Manufacturing realization of TWIN Source

Science.gov (United States)

Pandey, R.; Bandyopadhyay, M.; Parmar, D.; Yadav, R.; Tyagi, H.; Soni, J.; Shishangiya, H.; Sudhir Kumar, D.; Shah, S.; Bansal, G.; Pandya, K.; Parmar, K.; Vuppugalla, M.; Gahlaut, A.; Chakraborty, A.

2017-04-01

TWIN source is two RF driver based negative ion source that has been planned to bridge the gap between single driver based ROBIN source (currently operational) and eight river based DNB source (to be operated under IN-TF test facility). TWIN source experiments have been planned at IPR keeping the objective of long term domestic fusion programme to gain operational experiences on vacuum immersed multi driver RF based negative ion source. High vacuum compatible components of twin source are designed at IPR keeping an aim on indigenous built in attempt. These components of TWIN source are mainly stainless steel and OFC-Cu. Being high heat flux receiving components, one of the major functional requirements is continuous heat removal via water as cooling medium. Hence for the purpose stainless steel parts are provided with externally milled cooling lines and that shall be covered with a layer of OFC-cu which would be on the receiving side of high heat flux. Manufacturability of twin source components requires joining of these dissimilar materials via process like electrode position, electron beam welding and vacuum brazing. Any of these manufacturing processes shall give a vacuum tight joint having proper joint strength at operating temperature and pressure. Taking the indigenous development effort vacuum brazing (in non-nuclear environment) has been opted for joining of dissimilar materials of twin source being one of the most reliable joining techniques and commercially feasible across the suppliers of country. Manufacturing design improvisation for the components has been done to suit the vacuum brazing process requirement and to ease some of the machining without comprising over the functional and operational requirements. This paper illustrates the details on the indigenous development effort, design improvisation to suits manufacturability, vacuum brazing basics and its procedures for twin source components.

Thermodynamic analysis of the effect of channel geometry on heat transfer in double-layered microchannel heat sinks

International Nuclear Information System (INIS)

Zhai, Yuling; Li, Zhouhang; Wang, Hua; Xu, Jianxin

2017-01-01

Highlights: • A novel geometry with rectangular and complex channels in each layer is presented. • It shows lower pressure drop and more uniform temperature distribution. • The essence of enhanced heat transfer is analyzed from thermodynamics. - Abstract: Novel double-layered microchannel heat sinks with different channel geometries in each layer (Structure 2 for short) are designed to reduce pressure drop and maintain good heat transfer performance, which is compared with structure 1 (the same of complex channel geometry in each layer). The effect of parallel flow, counter flow and different channel geometries on heat transfer is studied numerically. Moreover, the essence of heat transfer enhancement is analyzed by thermodynamics. On one hand, the synergy relationship between flow field and temperature field is analyzed by field synergy principle. On the other hand, the irreversibility of heat transfer is studied by transport efficiency of thermal energy. The results show that the temperature distribution of counter flow is more uniform than that of parallel flow. Furthermore, heat dissipation and pressure drop of structure 2 are both better and lower than that of structure 1. Form the viewpoint of temperature distribution, structure C2 (i.e., counter flow with rectangular channels in upper layer and complex channels in bottom layer) presents the most uniform bottom temperature for microelectronic cooling. However, comprehensive heat transfer performance of structure P2 (i.e., parallel flow with rectangular channels in upper layer and complex channels in bottom layer) shows the best from the viewpoint of thermodynamics. The reasons can be ascribed to the channel geometry of structure P2 can obviously improve the synergy relationship between temperature and velocity fields, reduce fluid temperature gradient and heat transfer irreversibility.

High-heat-flux testing of helium-cooled heat exchangers for fusion applications

International Nuclear Information System (INIS)

Youchison, D.L.; Izenson, M.G.; Baxi, C.B.; Rosenfeld, J.H.

1996-01-01

High-heat-flux experiments on three types of helium-cooled divertor mock-ups were performed on the 30-kW electron beam test system and its associated helium flow loop at Sandia National Laboratories. A dispersion-strengthened copper alloy (DSCu) was used in the manufacture of all the mock-ups. The first heat exchanger provides for enhanced heat transfer at relatively low flow rates and much reduced pumping requirements. The Creare sample was tested to a maximum absorbed heat flux of 5.8 MW/m 2 . The second used low pressure drops and high mass flow rates to achieve good heat removal. The GA specimen was tested to a maximum absorbed heat flux of 9 MW/m 2 while maintaining a surface temperature below 400 degree C. A second experiment resulted in a maximum absorbed heat flux of 34 MW/m 2 and surface temperatures near 533 degree C. The third specimen was a DSCu, axial flow, helium-cooled divertor mock-up filled with a porous metal wick which effectively increases the available heat transfer area. Low mass flow and high pressure drop operation at 4.0 MPa were characteristic of this divertor module. It survived a maximum absorbed heat flux of 16 MW/m 2 and reached a surface temperature of 740 degree C. Thermacore also manufactured a follow-on, dual channel porous metal-type heat exchanger, which survived a maximum absorbed heat flux of 14 MW/m 2 and reached a maximum surface temperature of 690 degree C. 11refs., 20 figs., 3 tabs

COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS: UNA COMPARACIÓN DE DOS ALGORITMOS DE OPTIMIZACIÓN GLOBAL

Directory of Open Access Journals (Sweden)

Jorge Mario Cruz Duarte

Full Text Available This article deals with the design of optimum microchannel heat sinks through Unified Particle Swarm Optimisation (UPSO and Harmony Search (HS. These heat sinks are used for the thermal management of electronic devices, and we analyse the performance of UPSO and HS in their design, both, systematically and thoroughly. The objective function was created using the entropy generation minimisation criterion. In this study, we fixed the geometry of the microchannel, the amount of heat to be removed, and the properties of the cooling fluid. Moreover, we calculated the entropy generation rate, the volume flow rate of air, the channel width, the channel height, and the Knudsen number. The results of several simulation optimizations indicate that both global optimisation strategies yielded similar results, about 0.032 W/K, and that HS required five times more iterations than UPSO, but only about a nineteenth of its computation time. In addition, HS revealed a greater chance (about three times of finding a better solution than UPSO, but with a higher dispersion rate (about five times. Nonetheless, both algorithms successfully optimised the design for different scenarios, even when varying the material of the heat sink, and for different heat transfer rates.

The Economics of Big Area Addtiive Manufacturing

Energy Technology Data Exchange (ETDEWEB)

Post, Brian [Oak Ridge National Laboratory (ORNL); Lloyd, Peter D [ORNL; Lindahl, John [Oak Ridge National Laboratory (ORNL); Lind, Randall F [ORNL; Love, Lonnie J [ORNL; Kunc, Vlastimil [ORNL

2016-01-01

Case studies on the economics of Additive Manufacturing (AM) suggest that processing time is the dominant cost in manufacturing. Most additive processes have similar performance metrics: small part sizes, low production rates and expensive feedstocks. Big Area Additive Manufacturing is based on transitioning polymer extrusion technology from a wire to a pellet feedstock. Utilizing pellets significantly increases deposition speed and lowers material cost by utilizing low cost injection molding feedstock. The use of carbon fiber reinforced polymers eliminates the need for a heated chamber, significantly reducing machine power requirements and size constraints. We hypothesize that the increase in productivity coupled with decrease in feedstock and energy costs will enable AM to become more competitive with conventional manufacturing processes for many applications. As a test case, we compare the cost of using traditional fused deposition modeling (FDM) with BAAM for additively manufacturing composite tooling.

Materials contamination control in the microelectronic industry; Controle de la contamination des materiaux dans l`industrie de la micro-electronique

Energy Technology Data Exchange (ETDEWEB)

Tardif, F

1994-12-31

This paper deals with many aspects of the contamination of materials in the microelectronic industry. The contamination`s control of chemicals, process gases, silicon and the survey of the ions free water`s purity are treated. (TEC). 29 figs., 7 tabs.

Heat pumps are a dream

Energy Technology Data Exchange (ETDEWEB)

1981-12-01

The fact that heat pumps do not achieve what their manufacturers promise in costs efficiency has been realized by the market. In 1981 the sales of heat pumps decreased by 50% of the 1980 market. Public utilities give the reason as economic, since fuel oil is too cheap. The author refutes this argument and presents arguments against heat pumps.

Manufacturing development of low activation vanadium alloys

International Nuclear Information System (INIS)

Smith, J.P.; Johnson, W.R.; Baxi, C.B.

1996-10-01

General Atomics is developing manufacturing methods for vanadium alloys as part of a program to encourage the development of low activation alloys for fusion use. The culmination of the program is the fabrication and installation of a vanadium alloy structure in the DIII-D tokamak as part of the Radiative Divertor modification. Water-cooled vanadium alloy components will comprise a portion of the new upper divertor structure. The first step, procuring the material for this program has been completed. The largest heat of vanadium alloy made to date, 1200 kg of V-4Cr-4Ti, has been produced and is being converted into various product forms. Results of many tests on the material during the manufacturing process are reported. Research into potential fabrication methods has been and continues to be performed along with the assessment of manufacturing processes particularly in the area of joining. Joining of vanadium alloys has been identified as the most critical fabrication issue for their use in the Radiative Divertor Program. Joining processes under evaluation include resistance seam, electrodischarge (stud), friction and electron beam welding. Results of welding tests are reported. Metallography and mechanical tests are used to evaluate the weld samples. The need for a protective atmosphere during different welding processes is also being determined. General Atomics has also designed, manufactured, and will be testing a helium-cooled, high heat flux component to assess the use of helium cooled vanadium alloy components for advanced tokamak systems. The component is made from vanadium alloy tubing, machined to enhance the heat transfer characteristics, and joined to end flanges to allow connection to the helium supply. Results are reported

Solar heating for an electronics manufacturing plant--Blue Earth, Minnesota

Science.gov (United States)

1981-01-01

Partial space heating for 97,000 square foot plant is supplied by 360 flat plate solar collectors; energy is sorted as heat in indoor 20,000 gallon water tank. System includes all necessary control electronics for year round operation. During December 1978, solar energy supplied 24.4 percent of building's space heating load.

Piezoelectric-nanowire-enabled power source for driving wireless microelectronics.

Science.gov (United States)

Xu, Sheng; Hansen, Benjamin J; Wang, Zhong Lin

2010-10-19

Harvesting energy from irregular/random mechanical actions in variable and uncontrollable environments is an effective approach for powering wireless mobile electronics to meet a wide range of applications in our daily life. Piezoelectric nanowires are robust and can be stimulated by tiny physical motions/disturbances over a range of frequencies. Here, we demonstrate the first chemical epitaxial growth of PbZr(x)Ti(1-x)O(3) (PZT) nanowire arrays at 230 °C and their application as high-output energy converters. The nanogenerators fabricated using a single array of PZT nanowires produce a peak output voltage of ~0.7 V, current density of 4 μA cm(-2) and an average power density of 2.8 mW cm(-3). The alternating current output of the nanogenerator is rectified, and the harvested energy is stored and later used to light up a commercial laser diode. This work demonstrates the feasibility of using nanogenerators for powering mobile and even personal microelectronics.

Experimental validation of additively manufactured optimized shapes for passive cooling

DEFF Research Database (Denmark)

Lazarov, Boyan S.; Sigmund, Ole; Meyer, Knud E.

2018-01-01

This article confirms the superior performance of topology optimized heat sinks compared to lattice designs and suggests simpler manufacturable pin-fin design interpretations. The development is driven by the wide adoption of light-emitting-diode (LED) lamps for industrial and residential lighting....... The presented heat sink solutions are generated by topology optimization, a computational morphogenesis approach with ultimate design freedom, relying on high-performance computing and simulation. Optimized devices exhibit complex and organic-looking topologies which are realized with the help of additive...... manufacturing. To reduce manufacturing cost, a simplified interpretation of the optimized design is produced and validated as well. Numerical and experimental results agree well and indicate that the obtained designs outperform lattice geometries by more than 21%, resulting in a doubling of life expectancy and...

Development of an Air-Source Heat Pump Integrated with a Water Heating / Dehumidification Module

Energy Technology Data Exchange (ETDEWEB)

Rice, C Keith [ORNL; Uselton, Robert B. [Lennox Industries, Inc; Shen, Bo [ORNL; Baxter, Van D [ORNL; Shrestha, Som S [ORNL

2014-01-01

A residential-sized dual air-source integrated heat pump (AS-IHP) concept is under development in partnership between ORNL and a manufacturer. The concept design consists of a two-stage air-source heat pump (ASHP) coupled on the air distribution side with a separate novel water heating/dehumidification (WH/DH) module. The motivation for this unusual equipment combination is the forecast trend for home sensible loads to be reduced more than latent loads. Integration of water heating with a space dehumidification cycle addresses humidity control while performing double-duty. This approach can be applied to retrofit/upgrade applications as well as new construction. A WH/DH module capable of ~1.47 L/h water removal and ~2 kW water heating capacity was assembled by the manufacturer. A heat pump system model was used to guide the controls design; lab testing was conducted and used to calibrate the models. Performance maps were generated and used in a TRNSYS sub-hourly simulation to predict annual performance in a well-insulated house. Annual HVAC/WH energy savings of ~35% are predicted in cold and hot-humid U.S. climates compared to a minimum efficiency baseline.

Wireless Integrated Microelectronic Vacuum Sensor System

Science.gov (United States)

Krug, Eric; Philpot, Brian; Trott, Aaron; Lawrence, Shaun

2013-01-01

NASA Stennis Space Center's (SSC's) large rocket engine test facility requires the use of liquid propellants, including the use of cryogenic fluids like liquid hydrogen as fuel, and liquid oxygen as an oxidizer (gases which have been liquefied at very low temperatures). These fluids require special handling, storage, and transfer technology. The biggest problem associated with transferring cryogenic liquids is product loss due to heat transfer. Vacuum jacketed piping is specifically designed to maintain high thermal efficiency so that cryogenic liquids can be transferred with minimal heat transfer. A vacuum jacketed pipe is essentially two pipes in one. There is an inner carrier pipe, in which the cryogenic liquid is actually transferred, and an outer jacket pipe that supports and seals the vacuum insulation, forming the "vacuum jacket." The integrity of the vacuum jacketed transmission lines that transfer the cryogenic fluid from delivery barges to the test stand must be maintained prior to and during engine testing. To monitor the vacuum in these vacuum jacketed transmission lines, vacuum gauge readings are used. At SSC, vacuum gauge measurements are done on a manual rotation basis with two technicians, each using a handheld instrument. Manual collection of vacuum data is labor intensive and uses valuable personnel time. Additionally, there are times when personnel cannot collect the data in a timely fashion (i.e., when a leak is detected, measurements must be taken more often). Additionally, distribution of this data to all interested parties can be cumbersome. To simplify the vacuum-gauge data collection process, automate the data collection, and decrease the labor costs associated with acquiring these measurements, an automated system that monitors the existing gauges was developed by Invocon, Inc. For this project, Invocon developed a Wireless Integrated Microelectronic Vacuum Sensor System (WIMVSS) that provides the ability to gather vacuum

Direct Heat

Energy Technology Data Exchange (ETDEWEB)

Lienau, P J

1990-01-01

Potential resources and applications of earth heat in the form of geothermal energy are large. United States direct uses amount to 2,100 MWt thermal and worldwide 8,850 MWt above a reference temperature of 35 degrees Celsius. Space and district heating are the major direct uses of geothermal energy. Equipment employed in direct use projects is of standard manufacture and includes downhole and circulation pumps, transmission and distribution pipelines, heat exchangers and convectors, heat pumps and chillers. Direct uses of earth heat discussed are space and district heating, greenhouse heating and fish farming, process and industrial applications. The economic feasibility of direct use projects is governed by site specific factors such as location of user and resource, resource quality, system load factor and load density, as well as financing. Examples are presented of district heating in Klamath Falls, and Elko. Further developments of direct uses of geothermal energy will depend on matching user needs to the resource, and improving load factors and load density.

Manufacturing fuel-switching capability, 1988

International Nuclear Information System (INIS)

1991-09-01

Historically, about one-third of all energy consumed in the United States has been used by manufacturers. About one-quarter of manufacturing energy is used as feedstocks and raw material inputs that are converted into nonenergy products; the remainder is used for its energy content. During 1988, the most recent year for which data are available, manufacturers consumed 15.5 quadrillion British thermal units (Btu) of energy to produce heat and power and to generate electricity. The manufacturing sector also has widespread capabilities to switch from one fuel to another for either economic or emergency reasons. There are numerous ways to define fuel switching. For the purposes of the Manufacturing Energy Consumption Survey (MECS), fuel switching is defined as the capability to substitute one energy source for another within 30 days with no significant modifications to the fuel-consuming equipment, while keeping production constant. Fuel-switching capability allows manufacturers substantial flexibility in choosing their mix of energy sources. The consumption of a given energy source can be maximized if all possible switching into that energy source takes place. The estimates in this report are based on data collected on the 1988 Manufacturing Energy Consumption Survey (MECS), Forms 846 (A through C). The EIA conducts this national sample survey of manufacturing energy consumption on a triennial basis. The MECS is the only comprehensive source of national-level data on energy-related information for the manufacturing industries. The MECS was first conducted in 1986 to collect data for 1985. This report presents information on the fuel-switching capabilities of manufacturers in 1988. This report is the second of a series based on the 1988 MECS. 8 figs., 31 tabs

Manufacturing fuel-switching capability, 1988

Energy Technology Data Exchange (ETDEWEB)

1991-09-01

Historically, about one-third of all energy consumed in the United States has been used by manufacturers. About one-quarter of manufacturing energy is used as feedstocks and raw material inputs that are converted into nonenergy products; the remainder is used for its energy content. During 1988, the most recent year for which data are available, manufacturers consumed 15.5 quadrillion British thermal units (Btu) of energy to produce heat and power and to generate electricity. The manufacturing sector also has widespread capabilities to switch from one fuel to another for either economic or emergency reasons. There are numerous ways to define fuel switching. For the purposes of the Manufacturing Energy Consumption Survey (MECS), fuel switching is defined as the capability to substitute one energy source for another within 30 days with no significant modifications to the fuel-consuming equipment, while keeping production constant. Fuel-switching capability allows manufacturers substantial flexibility in choosing their mix of energy sources. The consumption of a given energy source can be maximized if all possible switching into that energy source takes place. The estimates in this report are based on data collected on the 1988 Manufacturing Energy Consumption Survey (MECS), Forms 846 (A through C). The EIA conducts this national sample survey of manufacturing energy consumption on a triennial basis. The MECS is the only comprehensive source of national-level data on energy-related information for the manufacturing industries. The MECS was first conducted in 1986 to collect data for 1985. This report presents information on the fuel-switching capabilities of manufacturers in 1988. This report is the second of a series based on the 1988 MECS. 8 figs., 31 tabs.

29 CFR 1919.80 - Heat treatment.

Science.gov (United States)

2010-07-01

... 29 Labor 7 2010-07-01 2010-07-01 false Heat treatment. 1919.80 Section 1919.80 Labor Regulations...) GEAR CERTIFICATION Certification of Shore-Based Material Handling Devices § 1919.80 Heat treatment. (a) Wherever heat treatment of any loose gear is recommended by the manufacturer, it shall be carried out in...

Material Selection for Microchannel Heatsink: Conjugate Heat Transfer Simulation

Science.gov (United States)

Uday Kumar, A.; Javed, Arshad; Dubey, Satish K.

2018-04-01

Heat dissipation during the operation of electronic devices causes rise in temperature, which demands an effective thermal management for their performance, life and reliability. Single phase liquid cooling in microchannels is an effective and proven technology for electronics cooling. However, due to the ongoing trends of miniaturization and developments in the microelectronics technology, the future needs of heat flux dissipation rate are expected to rise to 1 kW/cm2. Air cooled systems are unable to meet this demand. Hence, liquid cooled heatsinks are preferred. This paper presents conjugate heat transfer simulation of single phase flow in microchannels with application to electronic cooling. The numerical model is simulated for different materials: copper, aluminium and silicon as solid and water as liquid coolant. The performances of microchannel heatsink are analysed for mass flow rate range of 20-40 ml/min. The investigation has been carried out on same size of electronic chip and heat flux in order to have comparative study of different materials. This paper is divided into two sections: fabrication techniques and numerical simulation for different materials. In the first part, a brief discussion of fabrication techniques of microchannel heatsink have been presented. The second section presents conjugate heat transfer simulation and parametric investigation for different material microchannel heatsink. The presented study and findings are useful for selection of materials for microchannel heatsink.

Contact-Free Support Structures for Part Overhangs in Powder-Bed Metal Additive Manufacturing

Directory of Open Access Journals (Sweden)

Kenneth Cooper

2017-12-01

Full Text Available This study investigates the feasibility of a novel concept, contact-free support structures, for part overhangs in powder-bed metal additive manufacturing. The intent is to develop alternative support designs that require no or little post-processing, and yet, maintain effectiveness in minimizing overhang distortions. The idea is to build, simultaneously during part fabrications, a heat sink (called “heat support”, underneath an overhang to alter adverse thermal behaviors. Thermomechanical modeling and simulations using finite element analysis were applied to numerically research the heat support effect on overhang distortions. Experimentally, a powder-bed electron beam additive manufacturing system was utilized to fabricate heat support designs and examine their functions. The results prove the concept and demonstrate the effectiveness of contact-free heat supports. Moreover, the method was tested with different heat support parameters and applied to various overhang geometries. It is concluded that the heat support proposed has the potential to be implemented in industrial applications.

Tube manufacturing and characterization of oxide dispersion strengthened ferritic steels

International Nuclear Information System (INIS)

Ukai, Shigeharu; Mizuta, Shunji; Yoshitake, Tunemitsu; Okuda, Takanari; Fujiwara, Masayuki; Hagi, Shigeki; Kobayashi, Toshimi

2000-01-01

Oxide dispersion strengthened (ODS) ferritic steels have an advantage in radiation resistance and superior creep rupture strength at elevated temperature due to finely distributed Y 2 O 3 particles in the ferritic matrix. Using a basic composition of low activation ferritic steel (Fe-12Cr-2W-0.05C), cladding tube manufacturing by means of pilger mill rolling and subsequent recrystallization heat-treatment was conducted while varying titanium and yttria contents. The recrystallization heat-treatment, to soften the tubes hardened due to cold-rolling and to subsequently improve the degraded mechanical properties, was demonstrated to be effective in the course of tube manufacturing. For a titanium content of 0.3 wt% and yttria of 0.25 wt%, improvement of the creep rupture strength can be attained for the manufactured cladding tubes. The ductility is also adequately maintained

Modification of heating system on HeaTiNG-02 test section of beta test loop

International Nuclear Information System (INIS)

Sagino; Dedy Haryanto; Riswan Djambiar; Edy Sumarno

2013-01-01

Modifications have been carried out on the heating test section heating-02 on the integration strand Beta Test (UUB). The activities carried out to overcome the obstacles that arise in the test section when used. Constraint that often arises is the fall of the heating source super chantal when it reaches a certain temperature. To mitigate the super chantal is initially converted into a horizontal vertical position. Change from vertical to horizontal position on super chantal aims to stabilize the position of super chantal, so it needs to be modified in the heating system. Modification activities include manufacturing, installation and testing of super chantal and refractory stone as super chantal support. Manufacturing refractory stone formation and assembly into the heater in accordance with design modifications that have been done in electromechanical workshop obtained using some machine tools. Testing results of fabrication has been done by providing voltage 110 volts until it reaches operating temperature 400°C. Test results obtained super chantal stable position when it reaches operating temperature, and heater of heating-02 test section feasible to be used for experiments. (author)

A cell-microelectronic sensing technique for profiling cytotoxicity of chemicals

International Nuclear Information System (INIS)

Boyd, Jessica M.; Huang, Li; Xie Li; Moe, Birget; Gabos, Stephan; Li Xingfang

2008-01-01

A cell-microelectronic sensing technique is developed for profiling chemical cytotoxicity and is used to study different cytotoxic effects of the same class chemicals using nitrosamines as examples. This technique uses three human cell lines (T24 bladder, HepG2 liver, and A549 lung carcinoma cells) and Chinese hamster ovary (CHO-K1) cells in parallel as the living components of the sensors of a real-time cell electronic sensing (RT-CES) method for dynamic monitoring of chemical toxicity. The RT-CES technique measures changes in the impedance of individual microelectronic wells that is correlated linearly with changes in cell numbers during t log phase of cell growth, thus allowing determination of cytotoxicity. Four nitrosamines, N-nitrosodimethylamine (NDMA), N-nitrosodiphenylamine (NDPhA), N-nitrosopiperidine (NPip), and N-nitrosopyrrolidine (NPyr), were examined and unique cytotoxicity profiles were detected for each nitrosamine. In vitro cytotoxicity values (IC 50 ) for NDPhA (ranging from 0.6 to 1.9 mM) were significantly lower than the IC 50 values for the well-known carcinogen NDMA (15-95 mM) in all four cell lines. T24 cells were the most sensitive to nitrosamine exposure among the four cell lines tested (T24 > CHO > A549 > HepG2), suggesting that T24 may serve as a new sensitive model for cytotoxicity screening. Cell staining results confirmed that administration of the IC 50 concentration from the RT-CES experiments inhibited cell growth by 50% compared to the controls, indicating that the RT-CES method provides reliable measures of IC 50 . Staining and cell-cycle analysis confirmed that NDPhA caused cell-cycle arrest at the G0/G1 phase, whereas NDMA did not disrupt the cell cycle but induced cell death, thus explaining the different cytotoxicity profiles detected by the RT-CES method. The parallel cytotoxicity profiling of nitrosamines on the four cell lines by the RT-CES method led to the discovery of the unique cytotoxicity of NDPhA causing cell

A cell-microelectronic sensing technique for profiling cytotoxicity of chemicals

Energy Technology Data Exchange (ETDEWEB)

Boyd, Jessica M [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Huang, Li [Environmental Health Sciences, Department of Public Health Sciences, School of Public Health, University of Alberta, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Li, Xie; Moe, Birget [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Gabos, Stephan [Public Health Surveillance and Environmental Health, Alberta Health and Wellness, 10025 Jasper Avenue, Box 1360, Edmonton, Alberta, T5J 2N3 (Canada); Xingfang, Li [Division of Analytical and Environmental Toxicology, Department of Laboratory Medicine and Pathology, Faculty of Medicine and Dentistry, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada); Environmental Health Sciences, Department of Public Health Sciences, School of Public Health, University of Alberta, 10-102 Clinical Sciences Building, Edmonton, Alberta, T6G 2G3 (Canada)], E-mail: xingfang.li@ualberta.ca

2008-05-12

A cell-microelectronic sensing technique is developed for profiling chemical cytotoxicity and is used to study different cytotoxic effects of the same class chemicals using nitrosamines as examples. This technique uses three human cell lines (T24 bladder, HepG2 liver, and A549 lung carcinoma cells) and Chinese hamster ovary (CHO-K1) cells in parallel as the living components of the sensors of a real-time cell electronic sensing (RT-CES) method for dynamic monitoring of chemical toxicity. The RT-CES technique measures changes in the impedance of individual microelectronic wells that is correlated linearly with changes in cell numbers during t log phase of cell growth, thus allowing determination of cytotoxicity. Four nitrosamines, N-nitrosodimethylamine (NDMA), N-nitrosodiphenylamine (NDPhA), N-nitrosopiperidine (NPip), and N-nitrosopyrrolidine (NPyr), were examined and unique cytotoxicity profiles were detected for each nitrosamine. In vitro cytotoxicity values (IC{sub 50}) for NDPhA (ranging from 0.6 to 1.9 mM) were significantly lower than the IC{sub 50} values for the well-known carcinogen NDMA (15-95 mM) in all four cell lines. T24 cells were the most sensitive to nitrosamine exposure among the four cell lines tested (T24 > CHO > A549 > HepG2), suggesting that T24 may serve as a new sensitive model for cytotoxicity screening. Cell staining results confirmed that administration of the IC{sub 50} concentration from the RT-CES experiments inhibited cell growth by 50% compared to the controls, indicating that the RT-CES method provides reliable measures of IC{sub 50}. Staining and cell-cycle analysis confirmed that NDPhA caused cell-cycle arrest at the G0/G1 phase, whereas NDMA did not disrupt the cell cycle but induced cell death, thus explaining the different cytotoxicity profiles detected by the RT-CES method. The parallel cytotoxicity profiling of nitrosamines on the four cell lines by the RT-CES method led to the discovery of the unique cytotoxicity of NDPh

Effects of anodizing parameters and heat treatment on nanotopographical features, bioactivity, and cell culture response of additively manufactured porous titanium

Energy Technology Data Exchange (ETDEWEB)

Amin Yavari, S., E-mail: s.aminyavari@tudelft.nl [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands); Chai, Y.C. [Prometheus, Division of Skeletal Tissue Engineering, Bus 813, O& N1, Herestraat 49, KU Leuven, 3000 Leuven (Belgium); Tissue Engineering Laboratory, Skeletal Biology and Engineering Research Center, Bus 813, O& N1, Herestraat 49, KU Leuven, 3000 Leuven (Belgium); Department of Biomedical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia); Böttger, A.J. [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands); Wauthle, R. [KU Leuven, Department of Mechanical Engineering, Section Production Engineering, Machine Design and Automation (PMA), Celestijnenlaan 300B, 3001 Leuven (Belgium); 3D Systems — LayerWise NV, Grauwmeer 14, 3001 Leuven (Belgium); Schrooten, J. [Department of Metallurgy and Materials Engineering, KU Leuven, Kasteelpark Arenberg 44 — PB2450, B-3001 Heverlee (Belgium); Weinans, H. [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands); Department of Orthopedics and Dept. Rheumatology, UMC Utrecht, Heidelberglaan100, 3584CX Utrecht (Netherlands); Zadpoor, A.A. [Faculty of Mechanical, Maritime, and Materials Engineering, Delft University of Technology (TU Delft), Mekelweg 2, 2628 CD Delft (Netherlands)

2015-06-01

Anodizing could be used for bio-functionalization of the surfaces of titanium alloys. In this study, we use anodizing for creating nanotubes on the surface of porous titanium alloy bone substitutes manufactured using selective laser melting. Different sets of anodizing parameters (voltage: 10 or 20 V anodizing time: 30 min to 3 h) are used for anodizing porous titanium structures that were later heat treated at 500 °C. The nanotopographical features are examined using electron microscopy while the bioactivity of anodized surfaces is measured using immersion tests in the simulated body fluid (SBF). Moreover, the effects of anodizing and heat treatment on the performance of one representative anodized porous titanium structures are evaluated using in vitro cell culture assays using human periosteum-derived cells (hPDCs). It has been shown that while anodizing with different anodizing parameters results in very different nanotopographical features, i.e. nanotubes in the range of 20 to 55 nm, anodized surfaces have limited apatite-forming ability regardless of the applied anodizing parameters. The results of in vitro cell culture show that both anodizing, and thus generation of regular nanotopographical feature, and heat treatment improve the cell culture response of porous titanium. In particular, cell proliferation measured using metabolic activity and DNA content was improved for anodized and heat treated as well as for anodized but not heat-treated specimens. Heat treatment additionally improved the cell attachment of porous titanium surfaces and upregulated expression of osteogenic markers. Anodized but not heat-treated specimens showed some limited signs of upregulated expression of osteogenic markers. In conclusion, while varying the anodizing parameters creates different nanotube structure, it does not improve apatite-forming ability of porous titanium. However, both anodizing and heat treatment at 500 °C improve the cell culture response of porous titanium

Maximising the recovery of low grade heat: An integrated heat integration framework incorporating heat pump intervention for simple and complex factories

International Nuclear Information System (INIS)

Miah, J.H.; Griffiths, A.; McNeill, R.; Poonaji, I.; Martin, R.; Leiser, A.; Morse, S.; Yang, A.; Sadhukhan, J.

2015-01-01

Highlights: • A new practical heat integration framework incorporating heat pump technology for simple and complex food factories. • A decision making procedure was proposed to select process or utility heat integration in complex and diverse factories. • New stream classifications proposed to identify and compare streams linked between process and utility, especially waste heat. • A range of ‘Heat Pump Thresholds’ to identify and compare heat pump configurations with steam generation combustion boiler. - Abstract: The recovery of heat has long been a key measure to improving energy efficiency and maximising the heat recovery of factories by Pinch analysis. However, a substantial amount of research has been dedicated to conventional heat integration where low grade heat is often ignored. Despite this, the sustainability challenges facing the process manufacturing community are turning interest on low grade energy recovery systems to further advance energy efficiency by technological interventions such as heat pumps. This paper presents a novel heat integration framework incorporating technological interventions for both simple and complex factories to evaluate all possible heat integration opportunities including low grade and waste heat. The key features of the framework include the role of heat pumps to upgrade heat which can significantly enhance energy efficiency; the selection process of heat pump designs which was aided by the development of ‘Heat Pump Thresholds’ to decide if heat pump designs are cost-competitive with steam generation combustion boiler; a decision making procedure to select process or utility heat integration in complex and diverse factories; and additional stream classifications to identify and separate streams that can be practically integrated. The application of the framework at a modified confectionery factory has yielded four options capable of delivering a total energy reduction of about 32% with an economic payback

Additive Manufacturing of 17-4 PH Stainless Steel: Post-processing Heat Treatment to Achieve Uniform Reproducible Microstructure

Science.gov (United States)

Cheruvathur, Sudha; Lass, Eric A.; Campbell, Carelyn E.

2016-03-01

17-4 precipitation hardenable (PH) stainless steel is a useful material when a combination of high strength and good corrosion resistance up to about 315°C is required. In the wrought form, this steel has a fully martensitic structure that can be strengthened by precipitation of fine Cu-rich face-centered cubic phase upon aging. When fabricated via additive manufacturing (AM), specifically laser powder-bed fusion, 17-4 PH steel exhibits a dendritic structure containing a substantial fraction of nearly 50% of retained austenite along with body centered cubic/martensite and fine niobium carbides preferentially aligned along interdendritic boundaries. The effect of post-build thermal processing on the material microstructure is studied in comparison to that of conventionally produced wrought 17-4 PH with the intention of creating a more uniform, fully martensitic microstructure. The recommended stress relief heat treatment currently employed in industry for post-processing of AM 17-4 PH steel is found to have little effect on the as-built dendritic microstructure. It is found that, by implementing the recommended homogenization heat treatment regimen of Aerospace Materials Specification 5355 for CB7Cu-1, a casting alloy analog to 17-4 PH, the dendritic solidification structure is eliminated, resulting in a microstructure containing about 90% martensite with 10% retained austenite.

FY 1986 report on research and development of super heat pump energy accumulation system. R and D of total systems (Surveys on heat sources and heat-utilization systems); 1986 nendo super heat pump energy shuseki system kenkyu kaihatsu seika hokokusho. Total system no kenkyu (netsugen netsu riyokei no chosa)

Energy Technology Data Exchange (ETDEWEB)

NONE

1987-03-01

The heat source systems and heat utilization systems are surveyed and studied for the super heat pump energy accumulation systems, in order to clarify effective application and application types of these systems in the domestic and industrial energy areas. These works include surveys on literature, both domestic and foreign, surveys on actual situations of the related facilities and plants and on-the-spot hearing, and numerical simulation to establish the basic data for some items. The FY 1986 program includes the literature surveys on heat source and heat utilization systems and on-the-spot hearing for the domestic energy areas, reviews of heat demand variation patterns, and studies on methodology for applying the data to the areas not investigated so far. For the industrial areas to which super heat pumps are potentially applicable, the chemical, refining, food manufacturing and plastic manufacturing/processing industries are selected, to study problems related to system structures and conditions of the heat pump systems in these areas. (NEDO)

Examination of material manufactured by direct metal laser sintering (DMLS

Directory of Open Access Journals (Sweden)

J. Dobránsky

2015-07-01

Full Text Available This article is concerned with assessing microstructural properties of metal component manufactured by additive DMLS technology. Two series of samples were assessed. The first one was manufactured without heat treatment. Samples in the second series were treated with heat in order to assess increase in hardness and influence on modification of microstructure. Subsequently, values of hardness were measured by Vickers Hardness Test and modification of microstructure was observed by optical microscope. Evaluations were carried out in three planes in order to assess the differences in layering of material during its processing. Differences in values of hardness and microstructural components were discovered by examination of changes in three planes.

IP validation in remote microelectronics testing

Science.gov (United States)

Osseiran, Adam; Eshraghian, Kamran; Lachowicz, Stefan; Zhao, Xiaoli; Jeffery, Roger; Robins, Michael

2004-03-01

This paper presents the test and validation of FPGA based IP using the concept of remote testing. It demonstrates how a virtual tester environment based on a powerful, networked Integrated Circuit testing facility, aimed to complement the emerging Australian microelectronics based research and development, can be employed to perform the tasks beyond the standard IC test. IC testing in production consists in verifying the tested products and eliminating defective parts. Defects could have a number of different causes, including process defects, process migration and IP design and implementation errors. One of the challenges in semiconductor testing is that while current fault models are used to represent likely faults (stuck-at, delay, etc.) in a global context, they do not account for all possible defects. Research in this field keeps growing but the high cost of ATE is preventing a large community from accessing test and verification equipment to validate innovative IP designs. For these reasons a world class networked IC teletest facility has been established in Australia under the support of the Commonwealth government. The facility is based on a state-of-the-art semiconductor tester operating as a virtual centre spanning Australia and accessible internationally. Through a novel approach the teletest network provides virtual access to the tester on which the DUT has previously been placed. The tester software is then accessible as if the designer is sitting next to the tester. This paper presents the approach used to test and validate FPGA based IPs using this remote test approach.

Use of COTS microelectronics in radiation environments

International Nuclear Information System (INIS)

Winokur, P.S.; Lum, G.K.; Shaneyfelt, M.R.; Sexton, F.W.; Hash, G.L.; Scott, L.

1999-01-01

This paper addresses key issues for the cost-effective use of COTS (Commercially available Off The Shelf) microelectronics in radiation environments that enable circuit or system designers to manage risks and ensure mission success. They review several factors and tradeoffs affecting the successful application of COTS parts including (1) hardness assurance and qualification issues, (2) system hardening techniques, and (3) life-cycle costs. The paper also describes several experimental studies that address trends in total-dose, transient, and single-event radiation hardness as COTS technology scales to smaller feature sizes. As an example, the level at which dose-rate upset occurs in Samsung SRAMs increases from 1.4 x 10 8 rad(Si)/s for a 256K SRAM to 7.7 x 10 9 rad(Si)/s for a 4M SRAM, indicating unintentional hardening improvements in the design of process of a commercial technology. Additional experiments were performed to quantify variations in radiation hardness for COTS parts. In one study, only small (10--15%) variations were found in the dose-rate upset and latchup thresholds for Samsung 4M SRAMs from three different date codes. In another study, irradiations of 4M SRAMs from Samsung, Hitachi, and Toshiba indicate large differences in total-dose radiation hardness. The paper attempts to carefully define terms and clear up misunderstandings about the definitions of COTS and radiation-hardened (RH) technology

Additive Manufacturing of Heat Pipe Wicks, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — Wick properties are often the limiting factor in a heat pipe design. Current technology uses conventional sintering of metal powders, screen wick, or grooves to...

Radiation protection measurements in nuclear engineering. The use of microelectronics is only just beginning

International Nuclear Information System (INIS)

Maushart, R.

1986-01-01

The progress achieved by microelectronics is impressive already now, but it is only a beginning. The contribution deals with the modern methods of representing measured data and with the processing of measured data as the optimum area of use of microprocessors. It outlines the uses of personnel dosimeters and portable dose rate meters, portable units with data storage capacity, new possibilities in monitoring the room air in large building complexes, gamma spectroscopy with very high purity germanium detectors, equivalent dose measurement with multichannel data evaluation, 'talking' equipment, and it also presents a forecast of future radiation protection measuring equipment. (orig.) [de

Microelectronics in Japan

Science.gov (United States)

Boulton, William R.

1995-02-01

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Manufacturing and testing of reference samples for the definition of acceptance criteria for the ITER divertor

International Nuclear Information System (INIS)

Visca, Eliseo; Cacciotti, E.; Libera, S.; Mancini, A.; Pizzuto, A.; Roccella, S.; Riccardi, B.; Escourbiac, F.; Sanguinetti, G.P.

2010-01-01

The most critical part of a high heat flux (HHF) plasma facing component (PFC) is the armour to heat sink joint. An experimental study was launched by EFDA in order to define the acceptance criteria to be used for the procurements of the ITER Divertor PFCs. ENEA is involved in the European International Thermonuclear Experimental Reactor (ITER) R and D activities and together with Ansaldo Ricerche S.p.A. has manufactured several PFCs mock-ups using the Hot Radial Pressing and Pre-Brazed Casting technologies. According to the technical specifications issued by EFDA, ENEA and Ansaldo have collaborated to manufacture half of the samples with calibrated artificial defects required for this experimental study. After manufacturing, the samples were examined by ultrasonic and SATIR non-destructive examination (NDE) methods in order to confirm the size and position of the artificial defects. In particular, it was concluded that defects are detectable with these NDE techniques and they finally gave indication about the threshold of propagation during high heat flux experiments relevant with heat fluxes expected in ITER Divertor. This paper reports the manufacturing procedure used to obtain the required calibrated artificial defects in the CFC and W armoured samples as well as the NDE results and the thermal high heat flux results.

Manufacturing and testing of reference samples for the definition of acceptance criteria for the ITER divertor

Energy Technology Data Exchange (ETDEWEB)

Visca, Eliseo, E-mail: visca@frascati.enea.i [Associazione EURATOM-ENEA sulla Fusione, Frascati (Italy); Cacciotti, E.; Libera, S.; Mancini, A.; Pizzuto, A.; Roccella, S. [Associazione EURATOM-ENEA sulla Fusione, Frascati (Italy); Riccardi, B., E-mail: Bruno.Riccardi@f4e.europa.e [Fusion For Energy, Barcelona (Spain); Escourbiac, F., E-mail: frederic.escourbiac@iter.or [ITER Organization, Cadarache (France); Sanguinetti, G.P., E-mail: gianpaolo.sanguinetti@aen.ansaldo.i [Ansaldo Energia S.p.A., Genova (Italy)

2010-12-15

The most critical part of a high heat flux (HHF) plasma facing component (PFC) is the armour to heat sink joint. An experimental study was launched by EFDA in order to define the acceptance criteria to be used for the procurements of the ITER Divertor PFCs. ENEA is involved in the European International Thermonuclear Experimental Reactor (ITER) R and D activities and together with Ansaldo Ricerche S.p.A. has manufactured several PFCs mock-ups using the Hot Radial Pressing and Pre-Brazed Casting technologies. According to the technical specifications issued by EFDA, ENEA and Ansaldo have collaborated to manufacture half of the samples with calibrated artificial defects required for this experimental study. After manufacturing, the samples were examined by ultrasonic and SATIR non-destructive examination (NDE) methods in order to confirm the size and position of the artificial defects. In particular, it was concluded that defects are detectable with these NDE techniques and they finally gave indication about the threshold of propagation during high heat flux experiments relevant with heat fluxes expected in ITER Divertor. This paper reports the manufacturing procedure used to obtain the required calibrated artificial defects in the CFC and W armoured samples as well as the NDE results and the thermal high heat flux results.

Laser Applications in Microelectronic and Optoelectronic Manufacturing IV

Science.gov (United States)

1999-07-15

coordination. It might operate as a companion to a much larger satellite like the Space Shuttle or International Space Station. Such a unit would... Sistemas , E.U.I.T.Telecomunicacion, UPM, Ctra.de Valencia km7.5, 28031 Madrid, Spain ABSTRACT Nanocomposite thin films formed by metal or semiconductor

Technological review of the HRP manufacturing process R and D activity

International Nuclear Information System (INIS)

Visca, Eliseo; Pizzuto, A.; Gavila, P.; Riccardi, B.; Roccella, S.; Candura, D.; Sanguinetti, G.P.

2013-01-01

Highlights: • R and D activities for the manufacturing of ITER divertor high heat flux plasma-facing components (HHFC). • ENEA and Ansaldo have jointly manufactured several actively cooled monoblock mock-ups and prototypical components. • Successful manufacturing by HRP (hot radial pressing) and PBC (pre-brazed casting) of both W and CFC armoured small and medium scale mockups. • ENEA-ANSALDO participate to the European programme for the qualification of the manufacturing technology for the ITER divertor IVT. • A qualification divertor inner vertical target prototype successfully tested at ITER relevant thermal heat fluxes. -- Abstract: ENEA and Ansaldo Nucleare S.p.A. have been deeply involved in the European International Thermonuclear Experimental Reactor (ITER) R and D activities for the manufacturing of high heat flux plasma-facing components (HHFC), and in particular for the inner vertical target (IVT) of the ITER divertor. This component has to be manufactured by using both armour and structural materials whose properties are defined by ITER. Their physical properties prevent the use of standard joining techniques. The reference armour materials are tungsten and carbon/carbon fibre composite (CFC). The cooling pipe is made of copper alloy (CuCrZr-IG). During the last years ENEA and Ansaldo have jointly manufactured several actively cooled monoblock mock-ups and prototypical components of different length, geometry and materials, by using innovative processes: HRP (hot radial pressing) and PBC (pre-brazed casting). The history of the technical issues solved during the R and D phase and the improvements implemented to the assembling tools and equipments are reviewed in the paper together with the testing results. The optimization of the processes started from the successful manufacturing of both W and CFC armoured small scale mockups thermal fatigue tested in the worst ITER operating condition (20 MW/m 2 ) through the achievement of record

Technological review of the HRP manufacturing process R and D activity

Energy Technology Data Exchange (ETDEWEB)

Visca, Eliseo, E-mail: eliseo.visca@enea.it [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, Via E. Fermi 45, IT-00044 Frascati (Italy); Pizzuto, A. [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, Via E. Fermi 45, IT-00044 Frascati (Italy); Gavila, P.; Riccardi, B. [Fusion For Energy, C. Josep Pla 2, ES-08019 Barcelona (Spain); Roccella, S. [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, Via E. Fermi 45, IT-00044 Frascati (Italy); Candura, D.; Sanguinetti, G.P. [Ansaldo Nucleare S.p.A., Corso Perrone 25, IT-16121 Genova (Italy)

2013-10-15

Highlights: • R and D activities for the manufacturing of ITER divertor high heat flux plasma-facing components (HHFC). • ENEA and Ansaldo have jointly manufactured several actively cooled monoblock mock-ups and prototypical components. • Successful manufacturing by HRP (hot radial pressing) and PBC (pre-brazed casting) of both W and CFC armoured small and medium scale mockups. • ENEA-ANSALDO participate to the European programme for the qualification of the manufacturing technology for the ITER divertor IVT. • A qualification divertor inner vertical target prototype successfully tested at ITER relevant thermal heat fluxes. -- Abstract: ENEA and Ansaldo Nucleare S.p.A. have been deeply involved in the European International Thermonuclear Experimental Reactor (ITER) R and D activities for the manufacturing of high heat flux plasma-facing components (HHFC), and in particular for the inner vertical target (IVT) of the ITER divertor. This component has to be manufactured by using both armour and structural materials whose properties are defined by ITER. Their physical properties prevent the use of standard joining techniques. The reference armour materials are tungsten and carbon/carbon fibre composite (CFC). The cooling pipe is made of copper alloy (CuCrZr-IG). During the last years ENEA and Ansaldo have jointly manufactured several actively cooled monoblock mock-ups and prototypical components of different length, geometry and materials, by using innovative processes: HRP (hot radial pressing) and PBC (pre-brazed casting). The history of the technical issues solved during the R and D phase and the improvements implemented to the assembling tools and equipments are reviewed in the paper together with the testing results. The optimization of the processes started from the successful manufacturing of both W and CFC armoured small scale mockups thermal fatigue tested in the worst ITER operating condition (20 MW/m{sup 2}) through the achievement of record

SURFACE ENGINEERING FOR PARTS MADE BY ADDITIVE MANUFACTURING

OpenAIRE

Nutal, Nicolas; Rochus, Pierre; Collette, Jean-Paul; Crahay, Jean; Larnicol, Maiween; Jochem, Helen; Magnien, Julien; Masse, Christian; Rigo, Olivier; Vanhumbeeck, Jean-François; Pambaguian, Laurent

2015-01-01

the surface preparation of metal parts made by additive manufacturing (AM). AM is a technology of choice for manufacturing of parts with complex shapes (heat exchangers, RF supports, optical parts…) and integrated functions such as conformal cooling channels, clips, hinges, etc. This opens the door for lightweight parts which are of prime importance for space applications. The potential of the AM technologies is however impeded by the quite rough surface finish that is observed on the as-m...

Japanese technology assessment: Computer science, opto- and microelectronics mechatronics, biotechnology

Energy Technology Data Exchange (ETDEWEB)

Brandin, D.; Wieder, H.; Spicer, W.; Nevins, J.; Oxender, D.

1986-01-01

The series studies Japanese research and development in four high-technology areas - computer science, opto and microelectronics, mechatronics (a term created by the Japanese to describe the union of mechanical and electronic engineering to produce the next generation of machines, robots, and the like), and biotechnology. The evaluations were conducted by panels of U.S. scientists - chosen from academia, government, and industry - actively involved in research in areas of expertise. The studies were prepared for the purpose of aiding the U.S. response to Japan's technological challenge. The main focus of the assessments is on the current status and long-term direction and emphasis of Japanese research and development. Other aspects covered include evolution of the state of the art; identification of Japanese researchers, R and D organizations, and resources; and comparative U.S. efforts. The general time frame of the studies corresponds to future industrial applications and potential commercial impacts spanning approximately the next two decades.

Electromigration of intergranular voids in metal films for microelectronic interconnects

CERN Document Server

Averbuch, A; Ravve, I

2003-01-01

Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

Preliminary Flight Results of the Microelectronics and Photonics Test Bed: NASA DR1773 Fiber Optic Data Bus Experiment

Science.gov (United States)

Jackson, George L.; LaBel, Kenneth A.; Marshall, Cheryl; Barth, Janet; Seidleck, Christina; Marshall, Paul

1998-01-01

NASA Goddard Spare Flight Center's (GSFC) Dual Rate 1773 (DR1773) Experiment on the Microelectronic and Photonic Test Bed (MPTB) has provided valuable information on the performance of the AS 1773 fiber optic data bus in the space radiation environment. Correlation of preliminary experiment data to ground based radiation test results show the AS 1773 bus is employable in future spacecraft applications requiring radiation tolerant communication links.

Manufacturing process optimization of nuclear fuel guide tube using HANA alloys

International Nuclear Information System (INIS)

Jeong, Yong Hwan; Park, S. Y.; Choi, B. K.; Park, J. Y.; Kim, H. G.; Jeong, Y. I.; Park, D. J.; Lim, J. K.

2010-08-01

From this project, the advanced manufacturing parameters which were contained of heat-treatment, reduction rate, and new process (2 step) were considered to increase the guide tube performance of HANA material. It was obtained that the strength and corrosion resistance of HANA material were improved by applying the improve manufacturing parameters when compared to the commercial guide tube material. · Manufacturing parameter study to increase mechanical property -Tensile strength increase of 30% by manufacturing parameter setup when compared to the guide tube specification · Manufacturing parameter study to decrease irradiation growth -Theoretical study of the texture effect on sample specimens related to the irradiation growth · Manufacturing parameter study to increase corrosion resistance -Corrosion resistance increase of 30% by manufacturing parameter setup when compared to the commercial guide tube

Method of manufacturing a niobium-aluminum-germanium superconductive material

Science.gov (United States)

Wang, J.L.F.; Pickus, M.R.; Douglas, K.E.

A method for manufacturing flexible Nb/sub 3/ (Al,Ge) multifilamentary superconductive material in which a sintered porous Nb compact is infiltrated with an Al-Ge alloy. It is deformed and heat treated in a series of steps at successively higher temperatures preferably below 1000/sup 0/C during the heat treatment, cladding material such as copper can be applied to facilitate a deformation step preceding the heat treatment and can remain in place through the heat treatment to serve as a temperature stabilizer for the superconductive material produced. These lower heat treatment temperatures favor formation of filaments with reduced grain size and with more grain boundaries which in turn increase the current-carrying capacity of the superconductive material.

Displacement Damage Effects in Solar Cells: Mining Damage From the Microelectronics and Photonics Test Bed Space Experiment

Science.gov (United States)

Hardage, Donna (Technical Monitor); Walters, R. J.; Morton, T. L.; Messenger, S. R.

2004-01-01

The objective is to develop an improved space solar cell radiation response analysis capability and to produce a computer modeling tool which implements the analysis. This was accomplished through analysis of solar cell flight data taken on the Microelectronics and Photonics Test Bed experiment. This effort specifically addresses issues related to rapid technological change in the area of solar cells for space applications in order to enhance system performance, decrease risk, and reduce cost for future missions.

Carbon nanotubes for thermal interface materials in microelectronic packaging

Science.gov (United States)

Lin, Wei

As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment

THEORETICAL AND EXPERIMENTAL ANALYSIS OF A CROSS-FLOW HEAT EXCHANGER

Directory of Open Access Journals (Sweden)

R. Tuğrul OĞULATA

1996-03-01

Full Text Available In this study, cross-flow plate type heat exchanger has been investigated because of its effective use in waste heat recovery systems. For this purpose, a heat regain system has been investigated and manufactured in laboratory conditions. Manufactured heat exchanger has been tested with an applicable experimental set up and temperatures, velocity of the air and the pressure losses occuring in the system have been measured and the efficiency of the system has been determined. The irreversibility of heat exchanger has been taken into consideration while the design of heat exchanger is being performed. So minimum entropy generation number has been analysied with respect to second law of thermodynamics in cross-flow heat exchanger. The minimum entropy generation number depends on parameters called optimum flow path length, dimensionless mass velocity and dimensionless heat transfer area. Variations of entropy generation number with these parameters have been analysied and introduced their graphics with their comments.

Large-scale solar heating

Energy Technology Data Exchange (ETDEWEB)

Tolonen, J.; Konttinen, P.; Lund, P. [Helsinki Univ. of Technology, Otaniemi (Finland). Advanced Energy Systems

1998-10-01

Solar heating market is growing in many European countries and annually installed collector area has exceeded one million square meters. There are dozens of collector manufacturers and hundreds of firms making solar heating installations in Europe. One tendency in solar heating is towards larger systems. These can be roof integrated, consisting of some tens or hundreds of square meters of collectors, or they can be larger centralized solar district heating plants consisting of a few thousand square meters of collectors. The increase of size can reduce the specific investments of solar heating systems, because e.g. the costs of some components (controllers, pumps, and pipes), planning and installation can be smaller in larger systems. The solar heat output can also be higher in large systems, because more advanced technique is economically viable

Hot radial pressing: An alternative technique for the manufacturing of plasma-facing components

International Nuclear Information System (INIS)

Visca, E.; Libera, S.; Mancini, A.; Mazzone, G.; Pizzuto, A.; Testani, C.

2005-01-01

The Hot radial pressing (HRP) manufacturing technique is based on the radial diffusion bonding principle performed between the cooling tube and the armour tile. The bonding is achieved by pressurizing the cooling tube while the joining interface is kept at the vacuum and temperature conditions. This technique has been used for the manufacturing of relevant mock-ups of the ITER divertor vertical target. Tungsten monoblock mock-ups were successfully tested to high heat flux thermal fatigue (20 MW/m 2 of absorbed heat flux for 1000 cycles). After these good results the activity is now focused on the developing of a manufacturing process suitable also for the CFC monoblock mock-ups. A FE calculation was performed to investigate the stress involved in the CFC tiles during the process and to avoid the CFC fracture. The results obtained by the FE calculation and by the test performed in air simulating a HRP manufacturing process for a CFC monoblock mock-ups is reported in the paper

Materialienbände zum Buch Mikroelektronik im Umweltschutz. Ergebnisse der Studie "Beitrag der Mikroelektronik zum Umweltschutz". In 6 Bänden

OpenAIRE

Angerer, G.; Hiessl, H.

1991-01-01

An effective and realizable environmental policy is dependent not only on the responsible behavior of each individual, but also on technological innovations. The study shows how the use of microelectronics supports this innovation process. The supplements show comprehensively the twenty-five areas of application for environmental microelectronics were analysed, including twelve manufacturing industries, combustion plants, industrial waste incineration, road traffic, household machines, agricu...

Effects of post heat-treatment on surface characteristics and adhesive bonding performance of medium density fiberboard

Science.gov (United States)

Nadir Ayrilimis; Jerrold E. Winandy

2009-01-01

A series of commercially manufactured medium density fiberboard (MDF) panels were exposed to a post-manufacture heat-treatment at various temperatures and durations using a hot press and just enough pressure to ensure firm contact between the panel and the press platens. Post-manufacture heat-treatment improved surface roughness of the exterior MDF panels. Panels...

Proceedings: Meeting customer needs with heat pumps, 1991

International Nuclear Information System (INIS)

1992-12-01

Electric heat pumps provide a growing number of residential and commercial customers with space heating and cooling as well as humidity control and water heating. Industrial customers use heat pump technology for energy-efficient, economical process heating and cooling. Heat pumps help utilities meet environmental protection needs and satisfy their load-shape objectives. The 1991 conference was held in Dallas on October 15--18, featuring 60 speakers representing electric utilities, consulting organizations, sponsoring organizations, and heat pump manufacturers. The speakers presented the latest information about heat pump markets, technologies, applications, trade ally programs, and relevant issues. Participants engaged in detailed discussions in ''breakout'' and parallel sessions and viewed more than 30 exhibits of heat pumps, software, and other products and services supporting heat pump installations and service. Electric utilities have the greatest vested interest in the sale of electric heat pumps and thus have responsibility to ensure quality installations through well-trained technicians, authoritative and accurate technical information, and wellinformed design professionals. The electric heat pump is an excellent tool for the electric utility industry's response to environmental and efficiency challenges as well as to competition from other fuel sources. Manufacturers are continually introducing new products and making research results available to meet these challenges. Industrial process heat pumps offer customers the ability to supply heat to process at a lower cost than heat supplied by primary-fuel-fired boilers. From the utility perspective these heat pumps offer an opportunity for a new electric year-round application

Manufacturing a 9-Meter Thermoplastic Composite Wind Turbine Blade: Preprint

Energy Technology Data Exchange (ETDEWEB)

Murray, Robynne [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Snowberg, David R [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Berry, Derek S [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Beach, Ryan [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Rooney, Samantha A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Swan, Dana [Arkema Inc.

2017-12-06

Currently, wind turbine blades are manufactured from a combination of glass and/or carbon fiber composite materials with a thermoset resin such as epoxy, which requires energy-intensive and expensive heating processes to cure. Newly developed in-situ polymerizing thermoplastic resin systems for composite wind turbine blades polymerize at room temperature, eliminating the heating process and significantly reducing the blade manufacturing cycle time and embodied energy, which in turn reduces costs. Thermoplastic materials can also be thermally welded, eliminating the need for adhesive bonds between blade components and increasing the overall strength and reliability of the blades. As well, thermoplastic materials enable end-of-life blade recycling by reheating and decomposing the materials, which is a limitation of existing blade technology. This paper presents a manufacturing demonstration for a 9-m-long thermoplastic composite wind turbine blade. This blade was constructed in the Composites Manufacturing Education and Technology facility at the National Wind Technology Center at the National Renewable Energy Laboratory (NREL) using a vacuum-assisted resin transfer molding process. Johns Manville fiberglass and an Arkema thermoplastic resin called Elium were used. Additional materials included Armacell-recycled polyethylene terephthalate foam from Creative Foam and low-cost carbon- fiber pultruded spar caps (manufactured in collaboration with NREL, Oak Ridge National Laboratory, Huntsman, Strongwell, and Chomarat). This paper highlights the development of the thermoplastic resin formulations, including an additive designed to control the peak exothermic temperatures. Infusion and cure times of less than 3 hours are also demonstrated, highlighting the efficiency and energy savings associated with manufacturing thermoplastic composite blades.

Effect of Temperature on the Toughness of Locally Manufactured Low Alloy Steel SUP9 Used for Manufacturing Leaf Springs

Directory of Open Access Journals (Sweden)

Muhammad Ishaque Abro

2011-10-01

Full Text Available The effect of heat treatment on locally manufactured low alloy steel grade SUP9 most frequently used in making leaf springs for automobiles was studied. While for determination of toughness and hardness Charpy impact testing machine and Rockwell hardness tester were used. The cryogenic test temperatures were achieved by soaking the samples in liquid nitrogen and temperature was measured using digital thermometer capable of reading the temperature from -40-200oC. Hardening, tempering and austempering treatments were conducted using muffle furnace and salt bath furnace. After heat treatment samples were quenched in oil. The results of present work confirmed that toughness and hardness are inversely related with each other and are highly dependent on the type of heat treatment employed. Highest toughness was measured after austempering at 450oC. Effect of test temperature revealed that toughness of the samples increased significantly with decreasing temperature. DBTT (Ductile to Brittle Transition Temperature of the austempered samples was observed at -10oC, whereas, that of tempered samples could not be determined. Based on the test results authors wish to recommend the 600oC tempering temperature in place of 450oC where normally tempering is practiced in Alwin industry Karachi during manufacturing of leaf spring.

Proceedings of the Goddard Space Flight Center Workshop on Robotics for Commercial Microelectronic Processes in Space

Science.gov (United States)

1987-01-01

Potential applications of robots for cost effective commercial microelectronic processes in space were studied and the associated robotic requirements were defined. Potential space application areas include advanced materials processing, bulk crystal growth, and epitaxial thin film growth and related processes. All possible automation of these processes was considered, along with energy and environmental requirements. Aspects of robot capabilities considered include system intelligence, ROM requirements, kinematic and dynamic specifications, sensor design and configuration, flexibility and maintainability. Support elements discussed included facilities, logistics, ground support, launch and recovery, and management systems.

Heat Rejection from a Variable Conductance Heat Pipe Radiator Panel

Science.gov (United States)

Jaworske, D. A.; Gibson, M. A.; Hervol, D. S.

2012-01-01

A titanium-water heat pipe radiator having an innovative proprietary evaporator configuration was evaluated in a large vacuum chamber equipped with liquid nitrogen cooled cold walls. The radiator was manufactured by Advanced Cooling Technologies, Inc. (ACT), Lancaster, PA, and delivered as part of a Small Business Innovative Research effort. The radiator panel consisted of five titanium-water heat pipes operating as thermosyphons, sandwiched between two polymer matrix composite face sheets. The five variable conductance heat pipes were purposely charged with a small amount of non-condensable gas to control heat flow through the condenser. Heat rejection was evaluated over a wide range of inlet water temperature and flow conditions, and heat rejection was calculated in real-time utilizing a data acquisition system programmed with the Stefan-Boltzmann equation. Thermography through an infra-red transparent window identified heat flow across the panel. Under nominal operation, a maximum heat rejection value of over 2200 Watts was identified. The thermal vacuum evaluation of heat rejection provided critical information on understanding the radiator s performance, and in steady state and transient scenarios provided useful information for validating current thermal models in support of the Fission Power Systems Project.

High-speed high-efficiency 500-W cw CO2 laser hermetization of metal frames of microelectronics devices

Science.gov (United States)

Levin, Andrey V.

1996-04-01

High-speed, efficient method of laser surface treatment has been developed using (500 W) cw CO2 laser. The principal advantages of CO2 laser surface treatment in comparison with solid state lasers are the basis of the method. It has been affirmed that high efficiency of welding was a consequence of the fundamental properties of metal-IR-radiation (10,6 mkm) interaction. CO2 laser hermetization of metal frames of microelectronic devices is described as an example of the proposed method application.

Numerical modeling of heat-transfer and the influence of process parameters on tailoring the grain morphology of IN718 in electron beam additive manufacturing

International Nuclear Information System (INIS)

Raghavan, Narendran; Dehoff, Ryan; Pannala, Sreekanth; Simunovic, Srdjan; Kirka, Michael; Turner, John; Carlson, Neil; Babu, Sudarsanam S.

2016-01-01

The fabrication of 3-D parts from CAD models by additive manufacturing (AM) is a disruptive technology that is transforming the metal manufacturing industry. The correlation between solidification microstructure and mechanical properties has been well understood in the casting and welding processes over the years. This paper focuses on extending these principles to additive manufacturing to understand the transient phenomena of repeated melting and solidification during electron beam powder melting process to achieve site-specific microstructure control within a fabricated component. In this paper, we have developed a novel melt scan strategy for electron beam melting of nickel-base superalloy (Inconel 718) and also analyzed 3-D heat transfer conditions using a parallel numerical solidification code (Truchas) developed at Los Alamos National Laboratory. The spatial and temporal variations of temperature gradient (G) and growth velocity (R) at the liquid-solid interface of the melt pool were calculated as a function of electron beam parameters. By manipulating the relative number of voxels that lie in the columnar or equiaxed region, the crystallographic texture of the components can be controlled to an extent. The analysis of the parameters provided optimum processing conditions that will result in columnar to equiaxed transition (CET) during the solidification. The results from the numerical simulations were validated by experimental processing and characterization thereby proving the potential of additive manufacturing process to achieve site-specific crystallographic texture control within a fabricated component.

Continued evaluation of compact heat exchangers for OTEC evaluation. Final report

Energy Technology Data Exchange (ETDEWEB)

McGowan, J.G.

1979-10-01

The objectives of this work investigating the applicability of compact plate heat type heat exchangers to OTEC power systems were: (1) an analytical and experimental evaluation of the performance characteristics of compact heat exchangers using ammonia as the working fluid operating under the entire range of OTEC system conditions; and (2) an evaluation of the applicable manufacturing processes, maintenance requirements, and arrangement concepts for large-scale compact OTEC heat exchangers with specific emphasis on total economics. The work was carried out to establish the applicability of compact plate type heat exchangers to OTEC power systems and to provide: (1) experimental verification of predicted performance (heat transfer and fluid flow) under OTEC operating conditions (using NH/sub 3/); (2) provide initial performance data for several desirable plate type OTEC heat exchanger panels; (3) provide test apparatus for continued experimental testing of OTEC compact heat exchanger panels; and (4) provide design information on applicable manufacturing processes maintenance requirements and arrangement concepts for plate type heat exchangers.

FY 1999 report on the results of 'the model project for effective utilization of the waste heat discharged from the combustion of paper-manufacturing sludge'; 1999 nendo seika hokoku. Seishi surajji nensho hainetsu yuko riyo moderu jigyo

Energy Technology Data Exchange (ETDEWEB)

NONE

2001-03-01

For the purpose of reducing the consumption of fossil fuel and reducing emissions of global warming gases in Malaysia, a model project for thermally effective use of the sludge discharged from paper-manufacturing plant was carried out. Concretely, the paper-manufacturing sludge discharged from paper-manufacturing plant is to be dewatered and improved of its lower heating value. Then, the sludge is to be burned in fluidized bed incinerator, and the steam is to be generated by recovering heat using waste heat recovering boiler. The steam obtained is to be used as process steam of the plant. In this fiscal year, the first year of the project, the attachment to the agreement was prepared in terms of the allotment of the project work between Japan and Malaysia, various kinds of gist, schedules, etc. and signed. After that, the determination of the basic specifications for facilities was made according to the attachment to the agreement. Now, the basic design of the whole plant is being made. The design of the process flow sheet, design of the layout plan for plant equipment, etc. were finished. The goods to be purchased are now being estimated and assessed. Moreover, as to the civil engineering/construction design, drawings of the basic design are now being made. (NEDO)

Procedure and equipment for continuous manufacture of solutions

International Nuclear Information System (INIS)

Stiefel, M.

1979-01-01

In order to manufacture boric acid solution for reactor commissioning, the heated water is divided into a main and subsidiary flow, and the total amount of the salt is added to the subsidiary flow. Mixing of the main flow with the salt-containing subsidiary flow takes place on a mixing column. Undissolved salt is removed in a hydro-cyclotron. Preheating of the water takes place in a recuperator heat exchanger and a through boiler provides the final temperatures. (HK) [de

Microelectronics in LMFBR: Activities sponsored by the Commission 1979-1983

International Nuclear Information System (INIS)

Nordwall, H.J. de

1986-01-01

These studies were designed to draw attention to signal handling techniques which have become applicable to the automatic control of reactors as a result of advances in microelectronics. The underlying concepts being explored are the extent to which more information may be obtained from existing sensors, whether changes in the state of a system may be acted upon automatically and the acceptability of stochastic methods of state estimation. If a given state may arise in a number of different ways, automatic action necessarily involves diagnosis of causes if any but the simplest actions, e.g. scram, is required. Up to now this diagnosis has been made by an operator, though a number of schemes intended to identify the primary cause of an abnormal state or to guide an operator to the most easily accessible safe state are in advanced states of development, e.g. at Halden, Westinghouse and GRS-Garching. The activity decribed is continuing, current emphasis being upon diagnostics using approaches based upon artificial intelligence concepts, system optimisation and quantification of the benefits of networking

Additive manufacturing for steels: a review

Science.gov (United States)

Zadi-Maad, A.; Rohib, R.; Irawan, A.

2018-01-01

Additive manufacturing (AM) of steels involves the layer by layer consolidation of powder or wire feedstock using a heating beam to form near net shape products. For the past decades, the AM technique reaches the maturation of both research grade and commercial production due to significant research work from academic, government and industrial research organization worldwide. AM process has been implemented to replace the conventional process of steel fabrication due to its potentially lower cost and flexibility manufacturing. This paper provides a review of previous research related to the AM methods followed by current challenges issues. The relationship between microstructure, mechanical properties, and process parameters will be discussed. Future trends and recommendation for further works are also provided.

Mechanical Properties of Austenitic Stainless Steel Made by Additive Manufacturing.

Science.gov (United States)

Luecke, William E; Slotwinski, John A

2014-01-01

Using uniaxial tensile and hardness testing, we evaluated the variability and anisotropy of the mechanical properties of an austenitic stainless steel, UNS S17400, manufactured by an additive process, selective laser melting. Like wrought materials, the mechanical properties depend on the orientation introduced by the processing. The recommended stress-relief heat treatment increases the tensile strength, reduces the yield strength, and decreases the extent of the discontinuous yielding. The mechanical properties, assessed by hardness, are very uniform across the build plate, but the stress-relief heat treatment introduced a small non-uniformity that had no correlation to position on the build plate. Analysis of the mechanical property behavior resulted in four conclusions. (1) The within-build and build-to-build tensile properties of the UNS S17400 stainless steel are less repeatable than mature engineering structural alloys, but similar to other structural alloys made by additive manufacturing. (2) The anisotropy of the mechanical properties of the UNS S17400 material of this study is larger than that of mature structural alloys, but is similar to other structural alloys made by additive manufacturing. (3) The tensile mechanical properties of the UNS S17400 material fabricated by selective laser melting are very different from those of wrought, heat-treated 17-4PH stainless steel. (4) The large discontinuous yielding strain in all tests resulted from the formation and propagation of Lüders bands.

The heat removal capability of actively cooled plasma-facing components for the ITER divertor

Science.gov (United States)

Missirlian, M.; Richou, M.; Riccardi, B.; Gavila, P.; Loarer, T.; Constans, S.

2011-12-01

Non-destructive examination followed by high-heat-flux testing was performed for different small- and medium-scale mock-ups; this included the most recent developments related to actively cooled tungsten (W) or carbon fibre composite (CFC) armoured plasma-facing components. In particular, the heat-removal capability of these mock-ups manufactured by European companies with all the main features of the ITER divertor design was investigated both after manufacturing and after thermal cycling up to 20 MW m-2. Compliance with ITER requirements was explored in terms of bonding quality, heat flux performances and operational compatibility. The main results show an overall good heat-removal capability after the manufacturing process independent of the armour-to-heat sink bonding technology and promising behaviour with respect to thermal fatigue lifetime under heat flux up to 20 MW m-2 for the CFC-armoured tiles and 15 MW m-2 for the W-armoured tiles, respectively.

The heat removal capability of actively cooled plasma-facing components for the ITER divertor

International Nuclear Information System (INIS)

Missirlian, M; Richou, M; Loarer, T; Riccardi, B; Gavila, P; Constans, S

2011-01-01

Non-destructive examination followed by high-heat-flux testing was performed for different small- and medium-scale mock-ups; this included the most recent developments related to actively cooled tungsten (W) or carbon fibre composite (CFC) armoured plasma-facing components. In particular, the heat-removal capability of these mock-ups manufactured by European companies with all the main features of the ITER divertor design was investigated both after manufacturing and after thermal cycling up to 20 MW m - 2. Compliance with ITER requirements was explored in terms of bonding quality, heat flux performances and operational compatibility. The main results show an overall good heat-removal capability after the manufacturing process independent of the armour-to-heat sink bonding technology and promising behaviour with respect to thermal fatigue lifetime under heat flux up to 20 MW m - 2 for the CFC-armoured tiles and 15 MW m - 2 for the W-armoured tiles, respectively.

Wireless link and microelectronics design for retinal prostheses

Energy Technology Data Exchange (ETDEWEB)

Liu, Wentai [Univ. of California, Santa Cruz, CA (United States)

2012-02-29

This project focuses on delivering power and data to the artificial retinal implant inside the eye and the implant microstimulator electronics which delivers the current pulses to stimulate the retinal layer to elicit visual perception. Since the use of invasive means such as tethering wires to transmit power and data results in discomfort to the patients which could eventually cause infection due to the abrasion caused by the wire and contact of the internals of the eye to the external environment, a completely wireless approach is used to transfer both power and data. Power is required inside the eye for the microelectronic implant which uses a dual voltage supply scheme (positive and negative) to deliver biphasic (anodic and cathodic) current pulses. Data in the form of digital bits from the data transmitter external to the eye, carries information about the amplitude, phase width, interphase delay, stimulation sequence for each implant electrode. The data receiver unit decodes the digital stream and the microstimulator unit generates the appropriate current stimuli. Since the external unit consisting of the power transmitter can experience coupling a variation with the power receiver due to the patient’s movements, a closed loop approach is used which varies the transmitted power dynamically to automatically compensate for such movements. This report presents the salient features of this research activities and results.

Predictive modeling of solidification during laser additive manufacturing of nickel superalloys: recent developments, future directions

Science.gov (United States)

Ghosh, Supriyo

2018-01-01

Additive manufacturing (AM) processes produce parts with improved physical, chemical, and mechanical properties compared to conventional manufacturing processes. In AM processes, intricate part geometries are produced from multicomponent alloy powder, in a layer-by-layer fashion with multipass laser melting, solidification, and solid-state phase transformations, in a shorter manufacturing time, with minimal surface finishing, and at a reasonable cost. However, there is an increasing need for post-processing of the manufactured parts via, for example, stress relieving heat treatment and hot isostatic pressing to achieve homogeneous microstructure and properties at all times. Solidification in an AM process controls the size, shape, and distribution of the grains, the growth morphology, the elemental segregation and precipitation, the subsequent solid-state phase changes, and ultimately the material properties. The critical issues in this process are linked with multiphysics (such as fluid flow and diffusion of heat and mass) and multiscale (lengths, times and temperature ranges) challenges that arise due to localized rapid heating and cooling during AM processing. The alloy chemistry-process-microstructure-property-performance correlation in this process will be increasingly better understood through multiscale modeling and simulation.

Drug-printing by flexographic printing technology--a new manufacturing process for orodispersible films.

Science.gov (United States)

Janssen, Eva Maria; Schliephacke, Ralf; Breitenbach, Armin; Breitkreutz, Jörg

2013-01-30

Orodispersible films (ODFs) are intended to disintegrate within seconds when placed onto the tongue. The common way of manufacturing is the solvent casting method. Flexographic printing on drug-free ODFs is introduced as a highly flexible and cost-effective alternative manufacturing method in this study. Rasagiline mesylate and tadalafil were used as model drugs. Printing of rasagiline solutions and tadalafil suspensions was feasible. Up to four printing cycles were performed. The possibility to employ several printing cycles enables a continuous, highly flexible manufacturing process, for example for individualised medicine. The obtained ODFs were characterised regarding their mechanical properties, their disintegration time, API crystallinity and homogeneity. Rasagiline mesylate did not recrystallise after the printing process. Relevant film properties were not affected by printing. Results were comparable to the results of ODFs manufactured with the common solvent casting technique, but the APIs are less stressed through mixing, solvent evaporation and heat. Further, loss of material due to cutting jumbo and daughter rolls can be reduced. Therefore, a versatile new manufacturing technology particularly for processing high-potent low-dose or heat sensitive drugs is introduced in this study. Copyright © 2012 Elsevier B.V. All rights reserved.

Nonlinear Aspects of Heat Pump Utilization

Directory of Open Access Journals (Sweden)

R. Najman

2010-01-01

Full Text Available This work attempts to answer the question: How much can we believe that the coefficient of performance provided by the manufacturer is correct, when a heat pump is required to face the real load coming from changes of temperature? The paper summarizes some basics of heat pump theory and describes the results of numerical models.

Study on manufacturing technology of fuel guide tube using HANA alloys

International Nuclear Information System (INIS)

Kim, Hyungil; Jung, Yangil; Park, Dongjun; Park, Jeongyong; Kim, Ilhyun; Choi, Byungkwon; Jeong, Yonghwan; Park, Sangyoon

2013-04-01

This research was focused on the study for the manufacturing technology of HANA alloys to crease the corrosion resistance of 30% as well as the to improve the strength of 10% when compared to the commercial zirconium alloys. The new manufacturing concept having higher corrosion resistance and strength than commercial alloy performance can be obtained in this research. This result was transferred to the KNF and, that will be commercialized. This research result can be summarized like this; Ο Parameter study to increase formability of HANA alloy tube - Study on alloy element and heat-treatment effect - Study on texture development mechanism - Study on final annealing effect Ο Out-of-pile performance evaluation of HANA alloy tube - Corrosion performance evaluation of HANA alloy manufactured at KNF - Mechanical performance evaluation of HANA alloy manufactured at KNF - Recrystallization behavior evaluation of HANA alloy manufactured at KNF - Texture characterization of HANA alloy manufactured at KNF - Microstructure characterization of HANA alloy manufactured at KNF Ο Manufacturing guideline setup to increase formability of HANA alloy tube - Manufacturing guideline setup to decrease surface defect - Manufacturing guideline setup to increase strength and corrosion resistance - Manufacturing guideline setup to control texture

High Thermal Conductivity Polymer Composites for Low Cost Heat Exchangers

Energy Technology Data Exchange (ETDEWEB)

None

2017-08-01

This factsheet describes a project that identified and evaluated commercially available and state-of-the-art polymer-based material options for manufacturing industrial and commercial non-metallic heat exchangers. A heat exchanger concept was also developed and its performance evaluated with heat transfer modeling tools.

Equipment for manufacture of single crystals by zone overlaying

International Nuclear Information System (INIS)

Richter, O.

1981-01-01

The patented heater element for the manufacture of monocrystals by zone melting of layers consists of a heated pipe on which short pipes or rings are slipped. A heater element of this design allows high volume capacity of expanded melt. (Ha)

Innovations in the Use of Nuclear Energy for Sustainable Manufacturing

International Nuclear Information System (INIS)

Herring, J. Stephen

2010-01-01

Over the next 50 years, nuclear energy will become increasingly important in providing the electricity and heat needed both by the presently industrialized countries and by those countries which are now developing their manufacturing industries. The twin concerns of global climate change and of the vulnerability of energy supplies caused by increasing international competition will lead to a greater reliance on nuclear energy for both electricity and process heat. Conservative estimates of new nuclear construction indicate a 50% increase in capacity by 2030. Other estimates predict a tripling of present capacity. Required machine tool technologies will include the improvements in the manufacture of standard LWR components, such as pressure vessels and pumps. Further in the future, technologies for working high temperature metals and ceramics will be needed and will require new machining capabilities.

Innovations in the Use of Nuclear Energy for Sustainable Manufacturing

Energy Technology Data Exchange (ETDEWEB)

J. Stephen Herring

2010-10-01

Abstract Over the next 50 years, nuclear energy will become increasingly important in providing the electricity and heat needed both by the presently industrialized countries and by those countries which are now developing their manufacturing industries. The twin concerns of global climate change and of the vulnerability of energy supplies caused by increasing international competition will lead to a greater reliance on nuclear energy for both electricity and process heat. Conservative estimates of new nuclear construction indicate a 50% increase in capacity by 2030. Other estimates predict a tripling of present capacity. Required machine tool technologies will include the improvements in the manufacture of standard LWR components, such as pressure vessels and pumps. Further in the future, technologies for working high temperature metals and ceramics will be needed and will require new machining capabilities.

A novel approach of manufacturing Nickel Wicks for loop heat pipes ...

Indian Academy of Sciences (India)

are manufactured with a basic purpose of generating capillary pumping ... The procedures for the production and characterization of the wick are presented here. ..... Huang X and Franchi G 2008 Design and fabrication of hybrid bi-modal wick ...

Field Evaluation of Advances in Energy-Efficiency Practices for Manufactured Homes

Energy Technology Data Exchange (ETDEWEB)

Levy, E. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Dentz, J. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Ansanelli, E. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Barker, G. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Rath, P. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States); Dadia, D. [Advanced Residential Integrated Energy Solutions (ARIES) Collaboration, New York, NY (United States)

2016-03-01

Three side-by-side lab houses were built, instrumented and monitored in an effort to determine through field testing and analysis the relative contributions of select technologies toward reducing energy use in new manufactured homes. The lab houses in Russellville, Alabama compared the performance of three homes built to varying levels of thermal integrity and HVAC equipment: a baseline HUD-code home equipped with an electric furnace and a split system air conditioner; an ENERGY STAR manufactured home with an enhanced thermal envelope and traditional split system heat pump; and a house designed to qualify for Zero Energy Ready Home designation with a ductless mini-split heat pump with transfer fan distribution system in place of the traditional duct system for distribution. Experiments were conducted in the lab houses to evaluate impact on energy and comfort of interior door position, window blind position and transfer fan operation. The report describes results of tracer gas and co-heating tests and presents calculation of the heat pump coefficient of performance for both the traditional heat pump and the ductless mini-split. A series of calibrated energy models was developed based on measured data and run in three locations in the Southeast to compare annual energy usage of the three homes.

Chalon/Saint-Marcel manufacturing plant

International Nuclear Information System (INIS)

2008-01-01

AREVA is the world leader in the design and construction of nuclear power plants, the manufacture of heavy components, and the supply of nuclear fuel and nuclear services such as maintenance and inspection. The Equipment Division provides the widest range of nuclear components and equipment, manufactured at its two facilities in Jeumont, northern France, and St. Marcel, in Burgundy. The St. Marcel plant, set on 35 ha (87.5 acres) near Chalon-sur-Saone, was established in 1973 in a region with a long history of specialized metalworking and mechanical activities to meet the demand for non-military nuclear requirements in France. The site offers two advantages: - excellent facilities for loading and transporting heavy components on the Saone river, - it's proximity to other group sites. Since its completion in 1975, the Chalon/St. Marcel facility has manufactured all the heavy components for French pressurized water reactors (PWRs) ranging from 900 MW to 1500 MW. It has also completed a significant number of export contracts that have made AREVA world leader. Nearly 600 heavy components (reactor vessels, steam generators, pressurizers and closure heads) have been manufactured or are currently being manufactured since the plant opened in 1975. The plant is at the heart of the manufacturing chain for nuclear steam supply systems (NSSS) supplied by AREVA. On the basis of engineering data, the plant manufactures reactor vessels, reactor vessel internals, steam generators, pressurizers and related components such as accumulators, auxiliary heat exchangers and supporting elements. Vessel upper internals Other similar components such as reactor vessels for boiling water reactors (BWR) or high temperature reactors (HTR) and other types of steam generators can also be manufactured in the plant (for example Once Through Steam Generators - OTSG). The basic activities performed at Chalon/St. Marcel are metalworking and heavy machining. These activities are carried out in strict

Heat Treatment of Cr- and Cr-V ledeburitic tool steels

Directory of Open Access Journals (Sweden)

Peter Jurči

2014-11-01

Full Text Available Cr- and Cr-V ledeburitic cold work tool steels belong to the most important tool materials for large series manufacturing. To enable high production stability, the tools must be heat treated before use. This overview paper brings a comprehensive study on the heat treatment of these materials, starting from the soft annealing and finishing with the tempering. Also, it describes the impact of any step of the heat treatment on the most important structural and mechanical characteristics, like the hardness, the toughness and the wear resistance. The widely used AIS D2- steel (conventionally manufactured and Vanadis 6 (PM are used as examples in most cases.

HVAC Modeling for Cost of Ownership Assessment in Biotechnology & Drugs Manufacturing

OpenAIRE

Broomes, Peter; Dornfeld, David A

2003-01-01

Heating, ventilation, and air conditioning (HVAC) systems used in the clean room environment of biotechnology and drug development and manufacturing, are extremely energy and water intensive and represent a significant operating cost for these facilities [1]. HVAC systems are also the primary source of environmental emissions for the majority of companies operating within the biotechnology and drugs sector. While the processes used in drug manufacture have negligible environmental impact...

A method for preparing a sintered glass powder for manufacturing microspheres

International Nuclear Information System (INIS)

Budrick, R.G.; King, F.T.; Nolen, R.L. Jr.; Solomon, D.E.

1975-01-01

The invention relates to the manufacture of sintered glass-powder. It relates to a method comprising the step of forming a vitreous gel so that it contains an occluded substance adapted to expand when heated, said gel being subsequently dried, then crushed and sorted prior to being washed and dried again. Application to the manufacture of sintered glass-powder for forming microspheres adapted to contain a thermonuclear fuel [fr

Residential gas-fired sorption heat pumps. Test and technology evaluation

Energy Technology Data Exchange (ETDEWEB)

Naeslund, M.

2008-12-15

Heat pumps may be the next step in gas-fired residential space heating. Together with solar energy it is an option to combine natural gas and renewable energy. Heat pumps for residential space heating are likely to be based on the absorption or adsorption process, i.e. sorption heat pumps. Manufacturers claim that the efficiency could reach 140-160%. The annual efficiency will be lower but it is clear that gas-fired heat pumps can involve an efficiency and technology step equal to the transition from non-condensing gas boilers with atmospheric burners to condensing boilers. This report contains a review of the current sorption gas-fired heat pumps for residential space heating and also the visible development trends. A prototype heat pump has been laboratory tested. Field test results from Germany and the Netherlands are also used for a technology evaluation. The tested heat pump unit combines a small heat pump and a supplementary condensing gas boiler. Field tests show an average annual efficiency of 120% for this prototype design. The manufacturer abandoned the tested design during the project period and the current development concentrates on a heat pump design only comprising the heat pump, although larger. The heat pump development at three manufacturers in Germany indicates a commercial stage around 2010-2011. A fairly high electricity consumption compared to traditional condensing boilers was observed in the tested heat pump. Based on current prices for natural gas and electricity the cost savings were estimated to 12% and 27% for heat pumps with 120% and 150% annual efficiency respectively. There is currently no widespread performance testing procedure useful for annual efficiency calculations of gas-fired heat pumps. The situation seems to be clearer for electric compression heat pumps regarding proposed testing and calculation procedures. A German environmental label exists and gasfired sorption heat pumps are also slightly treated in the Eco-design work

Current state-of-the-art manufacturing technology for He-cooled divertor finger

Science.gov (United States)

Norajitra, P.; Antusch, S.; Giniyatulin, R.; Mazul, I.; Ritz, G.; Ritzhaupt-Kleissl, H.-J.; Spatafora, L.

2011-10-01

A divertor concept for DEMO has been investigated at Karlsruhe Institute of Technology (KIT) which has to withstand a heat flux of 10 MW/m 2. The design utilizes small finger module composed of a small tungsten tile brazed on a thimble made from tungsten alloy. The divertor finger is cooled by helium jet impingement at 10 MPa and 600 °C. The subject of this paper is technological studies on machining and braze joining the divertor components. Goal of this task, which is considered an important R&D issue, is to find out appropriate manufacturing methods to ensure high functionality and high reliability of the divertor as well as to meet the economic aspect. One of the major requirements for manufacturing is micro-crack-free surface of tungsten parts, since crack propagations in tungsten were observed in the previous high-heat-flux tests at Efremov. Different manufacturing methods and the corresponding results are discussed in the following report.

The Tore Supra toroidal pump limiter: experience feedback of HHF elements series manufacture

Energy Technology Data Exchange (ETDEWEB)

Cordier, J.J.; Bayetti, P.; Chappuis, P.; Durocher, A.; Escourbiac, F.; Grosman, A.; Lipa, M.; Mitteau, R.; Schlosser, J.; Van Houtte, D

2003-07-01

Since 1992, reliable High Heat Flux PFCs based on copper alloy heat sink structures and a CFC armour, have been developed. The final result is an actively cooled high heat flux element that is capable of removing up to 10 MW.m{sup -2} in stationary operating conditions. About 600 of these high performance individual components have then been manufactured and assembled in order to equip a Toroidal Pump Limiter (TPL). The final deliveries was successfully achieved end of 2001. The paper deals with the experience feedback built-up along the four years duration of the TPL components manufacture. We will show where issues were encountered, how solutions were found to achieve the fabrication of components and will highlight what are the main technical lessons to be learned: acceptance criteria, choice of materials, margins of processes. Finally a proposal of an alternative optimised design is presented, fruit of the experience gained from this up to now, unique series manufacture of actively cooled plasma facing HHF components. We believe that such experience will certainly be of use to ITER as well as to Wendelstein 7-X as far as PFC is concerned. (authors)

The study of development of welded compact plate heat exchanger for high temperature and pressure

International Nuclear Information System (INIS)

Park, Jae Hong; Lim, Hyug; Kim, Jung Kyu; Cho, Sung Youl; Kwon, Oh Boong

2009-01-01

In view of space saving, the design of more compact heat exchangers is relatively important. Also, to meet the demand for saving energy and resources today, manufacturers are trying to enhance efficiency and reduce the size and weight of heat exchangers. Over the past decade, there has been tremendous advancement in the manufacturing technology of high efficiency heat exchangers. This has allowed the use of smaller and high performance heat exchangers. Consequently, the use of smaller and high performance heat exchanger becomes popular in the design of heat exchangers. Welded compact plate heat exchanger is used in high temperature and pressure. In the design of heat exchanger, it is necessary to understand the heat transfer characteristics, so performance data are provided to help design of this type heat exchanger.

FY 1999 report on the results of 'the model project for effective utilization of the waste heat discharged from the combustion of paper-manufacturing sludge'; 1999 nendo seika hokoku. Seishi surajji nensho hainetsu yuko riyo moderu jigyo

Energy Technology Data Exchange (ETDEWEB)

NONE

2001-03-01

For the purpose of reducing the consumption of fossil fuel and reducing emissions of global warming gases in Malaysia, a model project for thermally effective use of the sludge discharged from paper-manufacturing plant was carried out. Concretely, the paper-manufacturing sludge discharged from paper-manufacturing plant is to be dewatered and improved of its lower heating value. Then, the sludge is to be burned in fluidized bed incinerator, and the steam is to be generated by recovering heat using waste heat recovering boiler. The steam obtained is to be used as process steam of the plant. In this fiscal year, the first year of the project, the attachment to the agreement was prepared in terms of the allotment of the project work between Japan and Malaysia, various kinds of gist, schedules, etc. and signed. After that, the determination of the basic specifications for facilities was made according to the attachment to the agreement. Now, the basic design of the whole plant is being made. The design of the process flow sheet, design of the layout plan for plant equipment, etc. were finished. The goods to be purchased are now being estimated and assessed. Moreover, as to the civil engineering/construction design, drawings of the basic design are now being made. (NEDO)

Manufacturing of small scale W monoblock mockups by hot radial pressing

International Nuclear Information System (INIS)

Visca, Eliseo; Testani, C.; Libera, S.; Sacchetti, M.

2003-01-01

In the frame of the European Technology R and D programme for International thermonuclear experimental reactor (ITER) and in the area of high heat flux plasma facing components (HHFC), representative small-scale mock-ups were manufactured and tested to compare different concepts and joining technologies (i.e. active brazing, hot isostatic pressing (HIPping), diffusion bonding, etc.). On the basis of the results obtained by thermal fatigue tests, the monoblock concept resulted to be the most robust one, particularly when the HIPping manufacturing technology is used. Within this programme, ENEA developed an alternative technique for manufacturing plasma-facing components with a monoblock geometry of the ITER machine. The basic idea of this technique, named hot radial pressing (HRP), is to perform a radial diffusion bonding between the cooling tube and the armour tile by pressurising the internal tube only and by keeping the process parameters within the range in which the thermo-mechanical properties of the copper alloys are not yet degraded. The HRP is performed by a standard furnace, in which only a section of the canister is heated. The manufacturing procedure and the results of the screening and fatigue thermal tests performed on the ENEA mock-ups are reported in this paper

Quality assurance and quality control in fabrication of heat exchanger tubes

International Nuclear Information System (INIS)

Duennewald, A.

1980-01-01

Object of this report is the manufacture of heat exchanger tubes. A comprehensive manufacturing and test program has to be established to assure and prove and equal tube quality. This requires a functionally operating quality assurance system combined with a production exactly planned in advance. A specific continuous production line for heat exchanger tubes has been erected at the Hellenthal plant of the Mannesmannroehren-Werke. All production steps and heat treatments are generally controlled by a quality control department. Non-destructive testing of each tube produced in standard length is performed on several agregates in line using ultrasonic and/or eddy current technique. All tests are generally performed in the presence of quality inspectors or surveyors. For a lot of heat exchangers the straight tubes have to be hairpin bended. To avoid the risk of stress corrosion cracking, it is recommended to procreate defined compression stresses in the outside tube surface. Prior to releasing the tubes to shipment, the completeness of the documentation as to the manufacturing steps and inspection agreed upon is thoroughly checked. (RW)

Electrowetting-based microfluidic operations on rapid-manufactured devices for heat pipe applications

Science.gov (United States)

Hale, Renee S.; Bahadur, Vaibhav

2017-07-01

The heat transport capacity of traditional heat pipes is limited by the capillary pressure generated in the internal wick that pumps condensate to the evaporator. Recently, the authors conceptualized a novel heat pipe architecture, wherein wick-based pumping is replaced by electrowetting (EW)-based pumping of microliter droplets in the adiabatic section. An electrowetting heat pipe (EHP) can overcome the capillary limit to heat transport capacity and enable compact, planar, gravity-insensitive, and ultralow power consumption heat pipes that transport kiloWatt heat loads over extended distances. This work develops a novel technique for rapid, scalable fabrication of EW-based devices and studies critical microfluidic operations underlying the EHP, with the objective of predicting the key performance parameters of the EHP. Devices are fabricated on a printed circuit board (PCB) substrate with mechanically-milled electrodes, and a removable polyimide dielectric film. The first set of experiments uncovers the maximum channel gap (1 mm) for reliable EW-based pumping; this parameter determines the heat transport capacity of the EHP, which scales linearly with the channel gap. The second set of experiments uncovers the maximum channel gap (375 microns) at which EW voltages can successfully split droplets. This is an important consideration which ensures EHP operability in the event of unintentional droplet merging. The third set of experiments demonstrate and study EW-induced droplet generation from an open-to-air reservoir, which mimics the interface between the condenser and adiabatic sections of the EHP. The experimental findings predict that planar, water-based EHPs with a (10 cm by 4 mm) cross section can transport 1.6 kW over extended distances (>1 m), with a thermal resistance of 0.01 K W-1.

Machinability of Al 6061 Deposited with Cold Spray Additive Manufacturing

Science.gov (United States)

Aldwell, Barry; Kelly, Elaine; Wall, Ronan; Amaldi, Andrea; O'Donnell, Garret E.; Lupoi, Rocco

2017-10-01

Additive manufacturing techniques such as cold spray are translating from research laboratories into more mainstream high-end production systems. Similar to many additive processes, finishing still depends on removal processes. This research presents the results from investigations into aspects of the machinability of aluminum 6061 tubes manufactured with cold spray. Through the analysis of cutting forces and observations on chip formation and surface morphology, the effect of cutting speed, feed rate, and heat treatment was quantified, for both cold-sprayed and bulk aluminum 6061. High-speed video of chip formation shows changes in chip form for varying material and heat treatment, which is supported by the force data and quantitative imaging of the machined surface. The results shown in this paper demonstrate that parameters involved in cold spray directly impact on machinability and therefore have implications for machining parameters and strategy.

Manufactured Home Energy Audit (MHEA)Users Manual (Version 7)

Energy Technology Data Exchange (ETDEWEB)

Gettings, M.B.

2003-01-27

The Manufactured Home Energy Audit (MHEA) is a software tool that predicts manufactured home energy consumption and recommends weatherization retrofit measures. It was developed to assist local weatherization agencies working with the U.S. Department of Energy (DOE) Weatherization Assistance Program. Whether new or experienced, employed within or outside the Weatherization Assistance Program, all users can benefit from incorporating MHEA into their manufactured home weatherization programs. DOE anticipates that the state weatherization assistance programs that incorporate MHEA into their programs will find significant growth in the energy and cost savings achieved from manufactured home weatherization. The easy-to-use MHEA uses a relatively standard Windows graphical interface for entering simple inputs and provides understandable, usable results. The user enters information about the manufactured home construction, heating equipment, cooling equipment appliances, and weather site. MHEA then calculates annual energy consumption using a simplified building energy analysis technique. Weatherization retrofit measures are evaluated based on the predicted energy savings after installation of the measure, the measure cost, and the measure life. Finally, MHEA recommends retrofit measures that are energy and cost effective for the particular home being evaluated. MHEA evaluates each manufactured home individually and takes into account local weather conditions, retrofit measure costs, and fuel costs. The recommended package of weatherization retrofit measures is tailored to the home being evaluated. More traditional techniques apply the same package of retrofit measures to all manufactured homes, often the same set of measures that are installed into site-built homes. Effective manufactured home weatherization can be achieved only by installing measures developed specifically for manufactured homes. The unique manufactured home construction characteristics require that

Additive Design and Manufacturing of Jet Engine Parts

Directory of Open Access Journals (Sweden)

Pinlian Han

2017-10-01

Full Text Available The additive design (AD and additive manufacturing (AM of jet engine parts will revolutionize the traditional aerospace industry. The unique characteristics of AM, such as gradient materials and micro-structures, have opened up a new direction in jet engine design and manufacturing. Engineers have been liberated from many constraints associated with traditional methodologies and technologies. One of the most significant features of the AM process is that it can ensure the consistency of parts because it starts from point(s, continues to line(s and layer(s, and ends with the competed part. Collaboration between design and manufacturing is the key to success in fields including aerodynamics, thermodynamics, structural integration, heat transfer, material development, and machining. Engineers must change the way they design a part, as they shift from the traditional method of “subtracting material” to the new method of “adding material” in order to manufacture a part. AD is not the same as designing for AM. A new method and new tools are required to assist with this new way of designing and manufacturing. This paper discusses in detail what is required in AD and AM, and how current problems can be solved.

Low level radiation testing of micro-electronic components. Pt. 1

International Nuclear Information System (INIS)

Farren, J.; Stephen, J.H.; Mapper, D.; Sanderson, T.K.; Hardman, M.

1984-05-01

A review of the existing literature has been carried out, dealing with the current technology relating to low level radiation testing of microelectronic devices, as used in space satellite systems. After consideration of the space radiation environment, the general effects of cosmic radiation on MOSFET structures and other MOS devices have been assessed. The important aspect of annealing phenomena in relation to gamma-ray induced damage has also been reviewed in detail. The experimental and theoretical aspects of radiation testing have been assessed, with particular reference to the Harwell LORAD low level irradiation test facility. In addition, a review of modern dosimetry methods has been carried out, with specific regard to the problems of accurately measuring low radiation fields (1 to 10 R/hour) over periods of many months. Finally, a detailed account of the proposed experimental programme to be carried out in the LORAD facility is presented, and aspects of the experimental set-up discussed. The particular types of test circuits to be studied are dealt with, and full consideration is given to the various CMOS memory devices of special interest in the ESA space satellite programme. (author)

Manufacturing studies of double wall components for the ITER EC H and CD upper launcher

International Nuclear Information System (INIS)

Spaeh, P.; Aiello, G.; Goldmann, A.; Kleefeldt, K.; Kroiss, A.; Meier, A.; Obermeier, C.; Scherer, T.; Schreck, S.; Serikov, A.; Strauss, D.; Vaccaro, A.

2012-01-01

Highlights: ► Double wall manufacturing technologies for ITER In-vessel components. ► Rigid and safe accommodation of ECRH heating and current drive systems. ► Thermo hydraulic analysis of coolant flow in double-wall structures. - Abstract: To counteract plasma instabilities, Electron Cyclotron Launchers will be installed in four of the ITER Upper Ports. The structural system of an EC Upper Launcher accommodates the MM-wave-components and has to meet strong demands on alignment, removal of nuclear heat loads, mechanical strength and nuclear shielding. The EC Upper Launcher has successfully undergone the Preliminary Design Review in 2009 and is now in the final design phase. Nuclear heat loads from 0.1 W/cm 3 up to 0.8 W/cm 3 will affect the front area of the launcher main frame. To guarantee save and homogenous removal of those heat loads, the front part of the launcher main frame is designed as a double wall steel-casing with cooling channels inside the shell structure. To finalize the design of this double wall component, the main emphasis is now to define the cooling channels geometry and to identify the optimum manufacturing route to assure adequate flow of coolant and sufficient mechanical strength in compliance with required dimension tolerances and quality of the welds. Several manufacturing options have been investigated and were evaluated by computational analysis and fabrication of pre-prototypes. To come to a final design, the most promising route will be chosen to manufacture a full-size mock-up of the double wall main frame. It will be tested at the KIT Launcher Handling Test facility to check the compliance with the design goals related to geometrical accuracy and thermo-hydraulic characteristics. This paper describes the design and the manufacturing routes of the prototypic double wall main frame.

Manufacturing studies of double wall components for the ITER EC H and CD upper launcher

Energy Technology Data Exchange (ETDEWEB)

Spaeh, P., E-mail: peter.spaeh@kit.edu [Institute for Applied Materials, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany); Aiello, G. [Institute for Applied Materials, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany); Goldmann, A. [MAN Diesel and Turbo, D-94452 Deggendorf, P.O. Box 3640, D-76021 Karlsruhe (Germany); Kleefeldt, K. [Institute for Applied Materials, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany); Kroiss, A. [MAN Diesel and Turbo, D-94452 Deggendorf, P.O. Box 3640, D-76021 Karlsruhe (Germany); Meier, A. [Institute for Applied Materials, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany); Obermeier, C. [MAN Diesel and Turbo, D-94452 Deggendorf, P.O. Box 3640, D-76021 Karlsruhe (Germany); Scherer, T.; Schreck, S. [Institute for Applied Materials, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany); Serikov, A. [Institute for Neutron Physics and Reactor Technology, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany); Strauss, D.; Vaccaro, A. [Institute for Applied Materials, Karlsruhe Institute of Technology, P.O. Box 3640, D-76021 Karlsruhe (Germany)

2012-08-15

Highlights: Black-Right-Pointing-Pointer Double wall manufacturing technologies for ITER In-vessel components. Black-Right-Pointing-Pointer Rigid and safe accommodation of ECRH heating and current drive systems. Black-Right-Pointing-Pointer Thermo hydraulic analysis of coolant flow in double-wall structures. - Abstract: To counteract plasma instabilities, Electron Cyclotron Launchers will be installed in four of the ITER Upper Ports. The structural system of an EC Upper Launcher accommodates the MM-wave-components and has to meet strong demands on alignment, removal of nuclear heat loads, mechanical strength and nuclear shielding. The EC Upper Launcher has successfully undergone the Preliminary Design Review in 2009 and is now in the final design phase. Nuclear heat loads from 0.1 W/cm{sup 3} up to 0.8 W/cm{sup 3} will affect the front area of the launcher main frame. To guarantee save and homogenous removal of those heat loads, the front part of the launcher main frame is designed as a double wall steel-casing with cooling channels inside the shell structure. To finalize the design of this double wall component, the main emphasis is now to define the cooling channels geometry and to identify the optimum manufacturing route to assure adequate flow of coolant and sufficient mechanical strength in compliance with required dimension tolerances and quality of the welds. Several manufacturing options have been investigated and were evaluated by computational analysis and fabrication of pre-prototypes. To come to a final design, the most promising route will be chosen to manufacture a full-size mock-up of the double wall main frame. It will be tested at the KIT Launcher Handling Test facility to check the compliance with the design goals related to geometrical accuracy and thermo-hydraulic characteristics. This paper describes the design and the manufacturing routes of the prototypic double wall main frame.

Effect of Heat Treatment on Microstructure and Mechanical Properties of Laser Additively Manufactured AISI H13 Tool Steel

Science.gov (United States)

Chen, ChangJun; Yan, Kai; Qin, Lanlan; Zhang, Min; Wang, Xiaonan; Zou, Tao; Hu, Zengrong

2017-11-01

The effect of heat treatment on microstructure and mechanical properties (microhardness, wear resistance and impact toughness) of laser additively manufactured AISI H13 tool steel was systemically investigated. To understand the variation of microstructure and mechanical properties under different heat treatments, the as-deposited samples were treated at 350, 450, 550, 600 and 650 °C/2 h, respectively. Microstructure and phase transformation were investigated through optical microscopy, scanning electron microscope and transmission electron microscope. The mechanical properties were characterized by nanoindentation tests, Charpy tests and high-temperature wear tests. The microstructure of as-deposited samples consisted of martensite, ultrafine carbides and retained austenite. After the tempering treatment, the martensite was converted into tempered martensite and some fine alloy carbides which precipitated in the matrix. When treated at 550 °C, the greatest hardness and nanohardness were 600 HV0.3 and 6119.4 MPa due to many needle-like carbides precipitation. The value of hardness increased firstly and then decreased when increasing the temperature. When tempered temperatures exceeded 550 °C, the carbides became coarse, and martensitic matrix recrystallized at the temperature of 650 °C. The least impact energy was 6.0 J at a temperature of 550 °C. Samples tempered at 550 °C had larger wear volume loss than that of others. Wear resistances of all samples under atmospheric condition at 400 °C showed an oxidation mechanism.

Intensification of Evaporation and Condensation Processes in Heat Exchange Apparatus

Directory of Open Access Journals (Sweden)

L. L. Vasiliev

2005-01-01

Full Text Available The paper describes proposed design solutions for an intensification of heat transfer in evaporation and condensation heat exchangers. Complex experimental research of heat and mass transfer processes in flat and round cross-section miniature heat pipes is carried out. Optimization, development, manufacturing and an experimental investigation of copper miniature heat pipes with sintered powder are executed. Investigation results of capillary-porous structure properties that are used in evaporation and condensation heat-exchange apparatus are presented.

CREME96: A revision of the Cosmic Ray Effects on Micro-Electronics code

International Nuclear Information System (INIS)

Tylka, A.J.; Adams, J.H. Jr.; Boberg, P.R.

1997-01-01

CREME96 is an update of the Cosmic Ray Effects on Micro-Electronics code, a widely-used suite of programs for creating numerical models of the ionizing-radiation environment in near-Earth orbits and for evaluating radiation effects in spacecraft. CREME96, which is now available over the World-Wide Web (WWW) at http://crsp3.nrl.navy.mil/creme96/, has many significant features, including (1) improved models of the galactic cosmic ray, anomalous cosmic ray, and solar energetic particle (flare) components of the near-Earth environment; (2) improved geomagnetic transmission calculations; (3) improved nuclear transport routines; (4) improved single-event upset (SEU) calculation techniques, for both proton-induced and direct-ionization-induced SEUs; and (5) an easy-to-use graphical interface, with extensive on-line tutorial information. In this paper the authors document some of these improvements

Development of a helium/helium intermediate heat exchanger with helical coil tube bundle

International Nuclear Information System (INIS)

Czimczik, A.; Hirschle, G.

1984-01-01

Besides the research and development work leading to the design basis for the reference heat exchanger, the stages of development up to the realisation of a nuclear He/He intermediate heat exchanger (IHX) include selected experiments in manufacturing techniques and with individual test components, as well as the design, fabrication and testing of representative prototype component. The process of manufacturing and experiences gained so far are described

Manufacture of New Set of Calorimeter Panels for the Neutral Beam Injection of ASDEX Upgrade

International Nuclear Information System (INIS)

Huber, T.; Zabernig, A.; Riedel, R.; Schedler, B.; Froeschle, M.; Heinemann, B.; Entcheva, A.; Weigert, J.

2006-01-01

The Neutral Injection of ASDEX-Upgrade employs calorimeter panels to measure the power of the neutral beam. These components are designed to safely absorb specific heat flux loads as high as 25 MW/m 2 over a period of 10 s. The currently used calorimeter panels have reached after ten years the end of their service life time and have to be replaced. The components consist of the CuCrZr which is a precipitation hardened alloy. The selection of the manufacturing process therefore determines the final thermal and mechanical properties of the alloy. In the past these components were manufactured by a two step brazing process, at about 830 o C and 730 o C, respectively. This led to an overaging of the material resulting in low mechanical properties. As predicted by finite element calculations the cyclic heat flux load leads to ratcheting at the heated surface finally limiting the life time of the components. In order to increase the service life time of the component it has therefore been decided to employ electron beam welding as the only joining technique to realise the required joints of the components. To fully characterise this manufacturing route a qualification programme has been performed, which ended in the manufacture of prototypes. These have been tested in ASEDEX Upgrade in comparison to brazed components. After successful qualification of design and processes the manufacture and testing of 100 calorimeter panels has been launched and completed recently. The used design, the results of the qualification tests, the manufacturing sequence and the applied non-destructive methods will be described in the paper. (author)

Performance Characteristics of PTC Elements for an Electric Vehicle Heating System

Directory of Open Access Journals (Sweden)

Yoon Hyuk Shin

2016-10-01

Full Text Available A high-voltage positive temperature coefficient (PTC heater has a simple structure and a swift response. Therefore, for cabin heating in electric vehicles (EVs, such heaters are used either on their own or with a heat pump system. In this study, the sintering process in the manufacturing of PTC elements for an EV heating system was improved to enhance surface uniformity. The electrode production process entailing thin-film sputtering deposition was applied to ensure the high heating performance of PTC elements and reduce the electrode thickness. The allowable voltage and surface heat temperature of the high-voltage PTC elements with thin-film electrodes were 800 V and 172 °C, respectively. The electrode layer thickness was uniform at approximately 3.8 μm or less, approximately 69% less electrode materials were required compared to that before process improvement. Furthermore, a heater for the EV heating system was manufactured using the developed high-voltage PTC elements to verify performance and reliability.

Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics

Science.gov (United States)

Fu, Haoran; Nan, Kewang; Bai, Wubin; Huang, Wen; Bai, Ke; Lu, Luyao; Zhou, Chaoqun; Liu, Yunpeng; Liu, Fei; Wang, Juntong; Han, Mengdi; Yan, Zheng; Luan, Haiwen; Zhang, Yijie; Zhang, Yutong; Zhao, Jianing; Cheng, Xu; Li, Moyang; Lee, Jung Woo; Liu, Yuan; Fang, Daining; Li, Xiuling; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

2018-03-01

Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.

Optimum schedules of difficult-to-form heat-resistant alloys forging

International Nuclear Information System (INIS)

Majzengel'ter, V.A.; Shuvalov, A.A.; Perevozov, A.S.

2000-01-01

The process of manufacturing half finished discs for hydroturbine engines from heat resistant difficulty deformed nickel, iron-nickel and cobalt alloys (EI435, EI868, VZh145-ID, EK79-ID, EK152-ID, EI826, EP648-VI) is described. The recommendations on the modes of forging the single-phase nonaging and double phase aging alloys are developed. The conclusion is made, that the first compressions of ingots shoved be accomplished by small press runs. The subsequent compressions should constituted not less than 8% during one run. The total compression of the ingot during one heating should be within the concrete alloy properties. With the purpose of obtaining uniform fine-grain structure the ingot heating during the last manufacturing cycle should be accomplished within the range of 1100-1130 deg C for the majority of heat resistant alloys [ru

Heat transfer enhancement of NBI vacuum pump cryopanels

International Nuclear Information System (INIS)

Ochoa Guaman, Santiago; Hanke, Stefan; Day, Christian

2013-01-01

Highlights: ► Cryopanel is optimized minimizing its maximal temperature rise and heat capacity. ► Copper coating on the cryopanels is necessary to reach a high thermal efficiency. ► The copper coating is achieved using an electroplating technique. ► A thermal shield for the cryopump 4 K manifold would reduce heat leaks down to 10%. ► The manufacturability and operation of the thermal shield is discussed. -- Abstract: Huge cryogenic pumps are installed inside neutral beam injectors in order to manage the typically very large gas flows. This paper deals with the aspect of passive cooling in NBI cryopump design development and discusses design considerations in two example areas. One is the design of cryopanels consisting of a pipe, centrally supplied with cryogenic helium, and a welded fin, passively cooled, to provide the necessary pumping surface below a given maximum temperature. The results of several parametric simulations in ANSYS are presented using different copper thicknesses and cryopanel geometries to discuss the thermal capability (heat transfer characteristics and heat capacities) of a number of design variants. The optimum design solution is based on copper-coated fins, using an electroplating technique, and thereby improving the heat transfer of the cryopanels while attaining an overall reduction in weight. The other area is the sound design of the manifold shielding system with a weld contact between copper and stainless steel. Weld samples were manufactured and investigated to raise awareness of the demands and risks during manufacturing and to demonstrate that readily applicable weld procedures exist

Utilization of Additive Manufacturing for Aerospace Heat Exchangers

Science.gov (United States)

2016-02-29

7. A notional part that was designed and built in an aluminum-silicon- magnesium alloy using the powder bed fusion process was able to achieve fine...source=bl&ots=YxEzhfglaB&sig=Wk4sfyR94gelw51 chj5Mb mOavus&hl=en&sa=X& ei =m HSxU4ucLZfMsQTivYCgAg&ved=OCEcQ6AEwCDgK#v=o nepage&q=making%20of%20a%20heat

Nuclear data relevant to single-event upsets (SEU) in microelectronics and their application to SEU simulation

International Nuclear Information System (INIS)

Watanabe, Yukinobu; Tukamoto, Yasuyuki; Kodama, Akihiro; Nakashima, Hideki

2004-01-01

A cross-section database for neutron-induced reactions on 28 Si was developed in the energy range between 2 MeV and 3 GeV in order to analyze single-event upsets (SEUs) phenomena induced by cosmic-ray neutrons in microelectronic devices. A simplified spherical device model was proposed for simulation of the initial process of SEUs. The model was applied to SEU cross-section calculations for semiconductor memory devices. The calculated results were compared with measured SEU cross-sections and the other simulation result. The dependence of SEU cross-sections on incident neutron energy and secondary ions having the most important effects on SEUs are discussed. (author)

Manufacturing and testing of a ITER First Wall Semi-Prototype for EUDA pre-qualification

International Nuclear Information System (INIS)

Banetta, S.; Bellin, B.; Lorenzetto, P.; Zacchia, F.; Boireau, B.; Bobin, I.; Boiffard, P.; Cottin, A.; Nogue, P.; Mitteau, R.; Eaton, R.; Raffray, R.; Bürger, A.; Du, J.; Linke, J.; Pintsuk, G.; Weber, T.

2015-01-01

Highlights: • Three ITER First Wall Small Scale Mock-ups were manufactured passing factory acceptance tests. • One of the Small Scale Mock-ups passed the thermal fatigue tests (15,000 cycles at 2 MW/m"2). • The ITER First Wall Semi-Prototype was manufactured and is being High Heat Flux tested. • Preliminary results upto 2 MW/m"2 show an overall compliance with the acceptance criteria. • Next step for EU Domestic Agency qualification is the fabrication and testing of a Full-Scale Prototype. - Abstract: This paper describes the main activities carried out in the frame of EU-DA prequalification for the supply of Normal Heat Flux (NHF) First Wall (FW) panels to ITER. A key part of these activities is the manufacturing development, the fabrication and the factory acceptance tests of a reduced scale FW prototype (Semi-Prototype (SP)) of the NHF design. The SP has a dimension of 221 mm × 665 mm, corresponding to about 1/6 of a full-scale panel, with six full-scale “fingers” and bearing a total of 84 beryllium tiles. It has been manufactured by the AREVA Company in France. The manufacturing process has made extensive use of Hot Isostatic Pressing, which was developed over more than a decade during the ITER Engineering Design Activity phase. The main manufacturing steps for the Semi-Prototype are recalled, with a summary of the lessons learned and the implications with regard to the design and manufacturing of the full-scale prototype and of the series fabrication of the EU-DA share of the ITER first wall (215 NHF panels). The fabricated SP is then tested under High Heat Flux (HHF) in the dedicated test facility of JUDITH-II in Forschungszentrum Jülich, Germany. The objective of the HHF testing is the demonstration of achieving the requested performance under thermal fatigue. The test protocol and facility qualification are presented and the behaviour of the fingers under the 7500 cycles at 2 MW/m"2 is described in detail.

Manufacturing and testing of a ITER First Wall Semi-Prototype for EUDA pre-qualification

Energy Technology Data Exchange (ETDEWEB)

Banetta, S., E-mail: stefano.banetta@f4e.europa.eu [Fusion For Energy, Torres Diagonal Litoral, B3, Carrer Josep Pla 2, 08019 Barcelona (Spain); Bellin, B.; Lorenzetto, P.; Zacchia, F. [Fusion For Energy, Torres Diagonal Litoral, B3, Carrer Josep Pla 2, 08019 Barcelona (Spain); Boireau, B.; Bobin, I.; Boiffard, P.; Cottin, A.; Nogue, P. [AREVA NP PTCMI-F, Centre Technique, Fusion, 71200 Le Creusot (France); Mitteau, R.; Eaton, R.; Raffray, R. [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Bürger, A.; Du, J.; Linke, J.; Pintsuk, G.; Weber, T. [Forschungszentrum Jülich, Institute of Energy and Climate Research, Jülich (Germany)

2015-10-15

Highlights: • Three ITER First Wall Small Scale Mock-ups were manufactured passing factory acceptance tests. • One of the Small Scale Mock-ups passed the thermal fatigue tests (15,000 cycles at 2 MW/m{sup 2}). • The ITER First Wall Semi-Prototype was manufactured and is being High Heat Flux tested. • Preliminary results upto 2 MW/m{sup 2} show an overall compliance with the acceptance criteria. • Next step for EU Domestic Agency qualification is the fabrication and testing of a Full-Scale Prototype. - Abstract: This paper describes the main activities carried out in the frame of EU-DA prequalification for the supply of Normal Heat Flux (NHF) First Wall (FW) panels to ITER. A key part of these activities is the manufacturing development, the fabrication and the factory acceptance tests of a reduced scale FW prototype (Semi-Prototype (SP)) of the NHF design. The SP has a dimension of 221 mm × 665 mm, corresponding to about 1/6 of a full-scale panel, with six full-scale “fingers” and bearing a total of 84 beryllium tiles. It has been manufactured by the AREVA Company in France. The manufacturing process has made extensive use of Hot Isostatic Pressing, which was developed over more than a decade during the ITER Engineering Design Activity phase. The main manufacturing steps for the Semi-Prototype are recalled, with a summary of the lessons learned and the implications with regard to the design and manufacturing of the full-scale prototype and of the series fabrication of the EU-DA share of the ITER first wall (215 NHF panels). The fabricated SP is then tested under High Heat Flux (HHF) in the dedicated test facility of JUDITH-II in Forschungszentrum Jülich, Germany. The objective of the HHF testing is the demonstration of achieving the requested performance under thermal fatigue. The test protocol and facility qualification are presented and the behaviour of the fingers under the 7500 cycles at 2 MW/m{sup 2} is described in detail.

Technical Subtopic 2.1: Modeling Variable Refrigerant Flow Heat Pump and Heat Recovery Equipment in EnergyPlus

Energy Technology Data Exchange (ETDEWEB)

Raustad, Richard; Nigusse, Bereket; Domitrovic, Ron

2013-09-30

The University of Central Florida/Florida Solar Energy Center, in cooperation with the Electric Power Research Institute and several variable-refrigerant-flow heat pump (VRF HP) manufacturers, provided a detailed computer model for a VRF HP system in the United States Department of Energy's (U.S. DOE) EnergyPlus? building energy simulation tool. Detailed laboratory testing and field demonstrations were performed to measure equipment performance and compare this performance to both the manufacturer's data and that predicted by the use of this new model through computer simulation. The project goal was to investigate the complex interactions of VRF HP systems from an HVAC system perspective, and explore the operational characteristics of this HVAC system type within a laboratory and real world building environment. Detailed laboratory testing of this advanced HVAC system provided invaluable performance information which does not currently exist in the form required for proper analysis and modeling. This information will also be useful for developing and/or supporting test standards for VRF HP systems. Field testing VRF HP systems also provided performance and operational information pertaining to installation, system configuration, and operational controls. Information collected from both laboratory and field tests were then used to create and validate the VRF HP system computer model which, in turn, provides architects, engineers, and building owners the confidence necessary to accurately and reliably perform building energy simulations. This new VRF HP model is available in the current public release version of DOE?s EnergyPlus software and can be used to investigate building energy use in both new and existing building stock. The general laboratory testing did not use the AHRI Standard 1230 test procedure and instead used an approach designed to measure the field installed full-load operating performance. This projects test methodology used the air

Inverse optimal design of the radiant heating in materials processing and manufacturing

Science.gov (United States)

Fedorov, A. G.; Lee, K. H.; Viskanta, R.

1998-12-01

Combined convective, conductive, and radiative heat transfer is analyzed during heating of a continuously moving load in the industrial radiant oven. A transient, quasi-three-dimensional model of heat transfer between a continuous load of parts moving inside an oven on a conveyor belt at a constant speed and an array of radiant heaters/burners placed inside the furnace enclosure is developed. The model accounts for radiative exchange between the heaters and the load, heat conduction in the load, and convective heat transfer between the moving load and oven environment. The thermal model developed has been used to construct a general framework for an inverse optimal design of an industrial oven as an example. In particular, the procedure based on the Levenberg-Marquardt nonlinear least squares optimization algorithm has been developed to obtain the optimal temperatures of the heaters/burners that need to be specified to achieve a prescribed temperature distribution of the surface of a load. The results of calculations for several sample cases are reported to illustrate the capabilities of the procedure developed for the optimal inverse design of an industrial radiant oven.

How clean is clean?---How clean is needed?

International Nuclear Information System (INIS)

Hays, A.K.

1991-01-01

This paper will provide an overview of cleaning qualifications used in a variety of industries: from small-scale manufacturer's of precision-machined products to large-scale manufacturer's of electronics (printed wiring boards and surface mount technology) and microelectronics. Cleanliness testing techniques used in the production of precision-machined products, will be described. The on-going DOD program to obtain high-reliability electronics, through the use of military specifications for cleaning and cleanliness levels, will be reviewed. In addition, the continually changing cleanroom/materials standards of the microelectronics industry will be discussed. Finally, we will speculate on the role that new and improved analytical techniques and sensor technologies will play in the factories of the future. 4 refs., 1 tab

Applications of picosecond lasers and pulse-bursts in precision manufacturing

Science.gov (United States)

Knappe, Ralf

2012-03-01

Just as CW and quasi-CW lasers have revolutionized the materials processing world, picosecond lasers are poised to change the world of micromachining, where lasers outperform mechanical tools due to their flexibility, reliability, reproducibility, ease of programming, and lack of mechanical force or contamination to the part. Picosecond lasers are established as powerful tools for micromachining. Industrial processes like micro drilling, surface structuring and thin film ablation benefit from a process, which provides highest precision and minimal thermal impact for all materials. Applications such as microelectronics, semiconductor, and photovoltaic industries use picosecond lasers for maximum quality, flexibility, and cost efficiency. The range of parts, manufactured with ps lasers spans from microscopic diamond tools over large printing cylinders with square feet of structured surface. Cutting glass for display and PV is a large application, as well. With a smart distribution of energy into groups of ps-pulses at ns-scale separation (known as burst mode) ablation rates can be increased by one order of magnitude or more for some materials, also providing a better surface quality under certain conditions. The paper reports on the latest results of the laser technology, scaling of ablation rates, and various applications in ps-laser micromachining.

Design, Manufacture, and Experimental Serviceability Validation of ITER Blanket Components

Science.gov (United States)

Leshukov, A. Yu.; Strebkov, Yu. S.; Sviridenko, M. N.; Safronov, V. M.; Putrik, A. B.

2017-12-01

In 2014, the Russian Federation and the ITER International Organization signed two Procurement Arrangements (PAs) for ITER blanket components: 1.6.P1ARF.01 "Blanket First Wall" of February 14, 2014, and 1.6.P3.RF.01 "Blanket Module Connections" of December 19, 2014. The first PA stipulates development, manufacture, testing, and delivery to the ITER site of 179 Enhanced Heat Flux (EHF) First Wall (FW) Panels intended for withstanding the heat flux from the plasma up to 4.7MW/m2. Two Russian institutions, NIIEFA (Efremov Institute) and NIKIET, are responsible for the implementation of this PA. NIIEFA manufactures plasma-facing components (PFCs) of the EHF FW panels and performs the final assembly and testing of the panels, and NIKIET manufactures FW beam structures, load-bearing structures of PFCs, and all elements of the panel attachment system. As for the second PA, NIKIET is the sole official supplier of flexible blanket supports, electrical insulation key pads (EIKPs), and blanket module/vacuum vessel electrical connectors. Joint activities of NIKIET and NIIEFA for implementing PA 1.6.P1ARF.01 are briefly described, and information on implementation of PA 1.6.P3.RF.01 is given. Results of the engineering design and research efforts in the scope of the above PAs in 2015-2016 are reported, and results of developing the technology for manufacturing ITER blanket components are presented.

Manufacturing and testing of a Be/OFHCCu divertor module

Science.gov (United States)

Araki, M.; Youchison, D. L.; Akiba, M.; Watson, R. D.; Sato, K.; Suzuki, S.

1996-10-01

Beryllium, carbon-based materials and tungsten are considered as plasma facing materials for the next generation of fusion machines such as the international thermonuclear experimental reactor (ITER). Beryllium is one of the primary candidate materials because of its low atomic number and lack of tritium codeposition. However, joining of a beryllium armor to a copper heat sink remains a critical problem due to the formation of brittle intermetallics at the interface. To address this concern, the Japan Atomic Energy Research Institute manufactured a beryllium/Cu divertor module with Cr and Ni diffusion barriers. This Be/Cu module was tested in the electron beam test system of Sandia National Laboratories in the framework of the US—Japan Fusion Collaboration. The divertor module consisted of four beryllium tiles, 25 mm × 25 mm, and a square copper heat sink with convolutions like a screw nut inside the coolant channel. To evaluate the integrity of the brazed bonds under various heat fluxes, beryllium tiles of two different thicknesses, 2 and 10 mm, were bonded to the copper heat sink. Cooling conditions of 10 m/s water flow velocity at 1 MPa, and a water inlet temperature of 20°C were selected based on the thermal analysis. During high heat flux testing the 10 mm thick Be tiles detached at an absorbed heat flux around 5 MW/m 2 for several shots due to flaws at the braze joint confirmed by optical observation after manufacturing. One of the 2 mm thick Be tiles failed after 550 cycles at the steady state heat flux of 6.5 MW/m 2. Most likely the failure was caused by brittleness at the interface caused by the presence of BeCu intermetallics.

Manufacturing and testing of a Be/OFHC-Cu divertor module

International Nuclear Information System (INIS)

Araki, M.; Youchison, D.L.; Akiba, M.; Watson, R.D.; Sato, K.; Suzuki, S.

1996-01-01

Beryllium, carbon-based materials and tungsten are considered as plasma facing materials for the next generation of fusion machines such as the international thermonuclear experimental reactor (ITER). Beryllium is one of the primary candidate materials because of its low atomic number and lack of tritium codeposition. However, joining of a beryllium armor to a copper heat sink remains a critical problem due to the formation of brittle intermetallics at the interface. To address this concern, the Japan Atomic Energy Research Institute manufactured a beryllium/Cu divertor module with Cr and Ni diffusion barriers. This Be/Cu module was tested in the electron beam test system of Sandia National Laboratories in the framework of the US-Japan Fusion Collaboration. The divertor module consisted of four beryllium tiles, 25 mm x 25 mm, and a square copper heat sink with convolutions like a screw nut inside the coolant channel. To evaluate the integrity of the brazed bonds under various heat fluxes, beryllium tiles of two different thicknesses, 2 and 10 mm, were bonded to the copper heat sink. Cooling conditions of 10 m/s water flow velocity at 1 MPa, and a water inlet temperature of 20 C were selected based on the thermal analysis. During high heat flux testing the 10 mm thick Be tiles detached at an absorbed heat flux around 5 MW/m 2 for several shots due to flaws at the braze joint confirmed by optical observation after manufacturing. One of the 2 mm thick Be tiles failed after 550 cycles at the steady state heat flux of 6.5 MW/m 2 . Most likely the failure was caused by brittleness at the interface caused by the presence of Be-Cu intermetallics. (orig.)

Dynamic Performance of a Residential Air-to-Air Heat Pump.

Science.gov (United States)

Kelly, George E.; Bean, John

This publication is a study of the dynamic performance of a 5-ton air-to-air heat pump in a residence in Washington, D.C. The effect of part-load operation on the heat pump's cooling and heating coefficients of performance was determined. Discrepancies between measured performance and manufacturer-supplied performance data were found when the unit…

Starting manufacturing phase of ITER upper ports

Energy Technology Data Exchange (ETDEWEB)

Utin, Yuri, E-mail: yuri.utin@iter.org [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Alekseev, Alexander; Sborchia, Carlo; Choi, Changho; Albin, Vincent; Barabash, Vladimir; Davis, James [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Fabritsiev, Sergey [NTC Sintez, Efremov Inst., 189631 Metallostroy, St. Petersburg (Russian Federation); Giraud, Benoit; Guirao, Julio [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Koenig, Werner [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); Kedrov, Igor; Kuzmin, Evgeny [NTC Sintez, Efremov Inst., 189631 Metallostroy, St. Petersburg (Russian Federation); Levesy, Bruno; Martinez, Jean-Marc [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Prebeck, Markus [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); Privalova, Elena [NTC Sintez, Efremov Inst., 189631 Metallostroy, St. Petersburg (Russian Federation); Ranzinger, Franz [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); Savrukhin, Petr [Russian Federation ITER Domestic Agency, Kurchatov sq.1, 123182 Moscow (Russian Federation); Schiller, Thomas [MAN Diesel & Turbo SE, Werftstrasse 17, Deggendorf (Germany); and others

2015-10-15

Highlights: • The port plugs are attached to the ports with high-strength fasteners. • Tightening of the fasteners via inductive heating was tested. • A concept for the port/plug sealing with metal-type gaskets has progressed. • Manufacturing design of the Upper Ports is in progress. • A full-scale mock-up of double-wall part of the port stub extension is in manufacturing process – acceptable final tolerances are expected. - Abstract: The ITER Vacuum Vessel (VV) features upper, equatorial and lower ports. The upper and regular equatorial ports are occupied by the port plugs. Although the port design has been overall completed in the past, the design of some remaining interfaces was still in progress: in particular, the Sealing Flange package, which includes the high-vacuum seals and the plug fasteners. As the ITER construction phase has started, the procurement of the VV ports has been launched. The VV upper ports will be procured by the Russian Federation Domestic Agency. The main suppliers were selected and the manufacturing design of the first parts is in full progress now. Since the VV is classified at nuclear level N2, the design and manufacture of its components are to be compliant with the French RCC-MR code and regulations for nuclear pressure equipment in France. These regulations make a strong impact to the port design and manufacturing process.

Starting manufacturing phase of ITER upper ports

International Nuclear Information System (INIS)

Utin, Yuri; Alekseev, Alexander; Sborchia, Carlo; Choi, Changho; Albin, Vincent; Barabash, Vladimir; Davis, James; Fabritsiev, Sergey; Giraud, Benoit; Guirao, Julio; Koenig, Werner; Kedrov, Igor; Kuzmin, Evgeny; Levesy, Bruno; Martinez, Jean-Marc; Prebeck, Markus; Privalova, Elena; Ranzinger, Franz; Savrukhin, Petr; Schiller, Thomas

2015-01-01

Highlights: • The port plugs are attached to the ports with high-strength fasteners. • Tightening of the fasteners via inductive heating was tested. • A concept for the port/plug sealing with metal-type gaskets has progressed. • Manufacturing design of the Upper Ports is in progress. • A full-scale mock-up of double-wall part of the port stub extension is in manufacturing process – acceptable final tolerances are expected. - Abstract: The ITER Vacuum Vessel (VV) features upper, equatorial and lower ports. The upper and regular equatorial ports are occupied by the port plugs. Although the port design has been overall completed in the past, the design of some remaining interfaces was still in progress: in particular, the Sealing Flange package, which includes the high-vacuum seals and the plug fasteners. As the ITER construction phase has started, the procurement of the VV ports has been launched. The VV upper ports will be procured by the Russian Federation Domestic Agency. The main suppliers were selected and the manufacturing design of the first parts is in full progress now. Since the VV is classified at nuclear level N2, the design and manufacture of its components are to be compliant with the French RCC-MR code and regulations for nuclear pressure equipment in France. These regulations make a strong impact to the port design and manufacturing process.

Nanoparticles for heat transfer and thermal energy storage

Science.gov (United States)

Singh, Dileep; Cingarapu, Sreeram; Timofeeva, Elena V.; Moravek, Michael

2015-07-14

An article of manufacture and method of preparation thereof. The article of manufacture and method of making the article includes an eutectic salt solution suspensions and a plurality of nanocrystalline phase change material particles having a coating disposed thereon and the particles capable of undergoing the phase change which provides increase in thermal energy storage. In addition, other articles of manufacture can include a nanofluid additive comprised of nanometer-sized particles consisting of copper decorated graphene particles that provide advanced thermal conductivity to heat transfer fluids.

Materials for nuclear diffusion-bonded compact heat exchangers

International Nuclear Information System (INIS)

Li, Xiuqing; Smith, Tim; Kininmont, David; Dewson, Stephen John

2009-01-01

This paper discusses the characteristics of materials used in the manufacture of diffusion bonded compact heat exchangers. Heatric have successfully developed a wide range of alloys tailored to meet process and customer requirements. This paper will focus on two materials of interest to the nuclear industry: dual certified SS316/316L stainless steel and nickel-based alloy Inconel 617. Dual certified SS316/316L is the alloy used most widely in the manufacture of Heatric's compact heat exchangers. Its excellent mechanical and corrosion resistance properties make it a good choice for use with many heat transfer media, including water, carbon dioxide, liquid sodium, and helium. As part of Heatric's continuing product development programme, work has been done to investigate strengthening mechanisms of the alloy; this paper will focus in particular on the effects of nitrogen addition. Another area of Heatric's programme is Alloy 617. This alloy has recently been developed for diffusion bonded compact heat exchanger for high temperature nuclear applications, such as the intermediate heat exchanger (IHX) for the very high temperature nuclear reactors for production of electricity, hydrogen and process heat. This paper will focus on the effects of diffusion bonding process and cooling rate on the properties of alloy 617. This paper also compares the properties and discusses the applications of these two alloys to compact heat exchangers for various nuclear processes. (author)

Dimensionless numbers in additive manufacturing

Science.gov (United States)

Mukherjee, T.; Manvatkar, V.; De, A.; DebRoy, T.

2017-02-01

The effects of many process variables and alloy properties on the structure and properties of additively manufactured parts are examined using four dimensionless numbers. The structure and properties of components made from 316 Stainless steel, Ti-6Al-4V, and Inconel 718 powders for various dimensionless heat inputs, Peclet numbers, Marangoni numbers, and Fourier numbers are studied. Temperature fields, cooling rates, solidification parameters, lack of fusion defects, and thermal strains are examined using a well-tested three-dimensional transient heat transfer and fluid flow model. The results show that lack of fusion defects in the fabricated parts can be minimized by strengthening interlayer bonding using high values of dimensionless heat input. The formation of harmful intermetallics such as laves phases in Inconel 718 can be suppressed using low heat input that results in a small molten pool, a steep temperature gradient, and a fast cooling rate. Improved interlayer bonding can be achieved at high Marangoni numbers, which results in vigorous circulation of liquid metal, larger pool dimensions, and greater depth of penetration. A high Fourier number ensures rapid cooling, low thermal distortion, and a high ratio of temperature gradient to the solidification growth rate with a greater tendency of plane front solidification.

Propagation of resist heating mask error to wafer level

Science.gov (United States)

Babin, S. V.; Karklin, Linard

2006-10-01

As technology is approaching 45 nm and below the IC industry is experiencing a severe product yield hit due to rapidly shrinking process windows and unavoidable manufacturing process variations. Current EDA tools are unable by their nature to deliver optimized and process-centered designs that call for 'post design' localized layout optimization DFM tools. To evaluate the impact of different manufacturing process variations on final product it is important to trace and evaluate all errors through design to manufacturing flow. Photo mask is one of the critical parts of this flow, and special attention should be paid to photo mask manufacturing process and especially to mask tight CD control. Electron beam lithography (EBL) is a major technique which is used for fabrication of high-end photo masks. During the writing process, resist heating is one of the sources for mask CD variations. Electron energy is released in the mask body mainly as heat, leading to significant temperature fluctuations in local areas. The temperature fluctuations cause changes in resist sensitivity, which in turn leads to CD variations. These CD variations depend on mask writing speed, order of exposure, pattern density and its distribution. Recent measurements revealed up to 45 nm CD variation on the mask when using ZEP resist. The resist heating problem with CAR resists is significantly smaller compared to other types of resists. This is partially due to higher resist sensitivity and the lower exposure dose required. However, there is no data yet showing CD errors on the wafer induced by CAR resist heating on the mask. This effect can be amplified by high MEEF values and should be carefully evaluated at 45nm and below technology nodes where tight CD control is required. In this paper, we simulated CD variation on the mask due to resist heating; then a mask pattern with the heating error was transferred onto the wafer. So, a CD error on the wafer was evaluated subject to only one term of the

Measured Performance of a Low Temperature Air Source Heat Pump

Energy Technology Data Exchange (ETDEWEB)

R.K. Johnson

2013-09-01

A 4-ton Low Temperature Heat Pump (LTHP) manufactured by Hallowell International was installed in a residence near New Haven, Connecticut and monitored over two winters of operation. After attending to some significant service issues, the heat pump operated as designed. This report should be considered a review of the dual compressor “boosted heat pump” technology. The Low Temperature Heat Pump system operates with four increasing levels of capacity (heat output) as the outdoor temperature drops.

Manufacture of high-strength composite materials from prepregs prepared by radiation processing

International Nuclear Information System (INIS)

Laricheva, V.P.; Korotkij, A.F.

2008-01-01

Scientific principles of the manufacture of high-strength heat-resistant polymer composite materials with the successive ionizing-radiation and heat treatment (via the step of long-lived prepregs) were developed. Methods for the selection of components for the preparation of long-lived prepregs, as well as for the determination of the optimal curing conditions, were proposed. The mechanical properties of the materials were studied [ru

Plan for advanced microelectronics processing technology application

Energy Technology Data Exchange (ETDEWEB)

Goland, A.N.

1990-10-01

The ultimate objective of the tasks described in the research agreement was to identify resources primarily, but not exclusively, within New York State that are available for the development of a Center for Advanced Microelectronics Processing (CAMP). Identification of those resources would enable Brookhaven National Laboratory to prepare a program plan for the CAMP. In order to achieve the stated goal, the principal investigators undertook to meet the key personnel in relevant NYS industrial and academic organizations to discuss the potential for economic development that could accompany such a Center and to gauge the extent of participation that could be expected from each interested party. Integrated of these discussions was to be achieved through a workshop convened in the summer of 1990. The culmination of this workshop was to be a report (the final report) outlining a plan for implementing a Center in the state. As events unfolded, it became possible to identify the elements of a major center for x-ray lithography on Lone Island at Brookhaven National Laboratory. The principal investigators were than advised to substitute a working document based upon that concept in place of a report based upon the more general CAMP workshop originally envisioned. Following that suggestion from the New York State Science and Technology Foundation, the principals established a working group consisting of representatives of the Grumman Corporation, Columbia University, the State University of New York at Stony Brook, and Brookhaven National Laboratory. Regular meetings and additional communications between these collaborators have produced a preproposal that constitutes the main body of the final report required by the contract. Other components of this final report include the interim report and a brief description of the activities which followed the establishment of the X-ray Lithography Center working group.

Heat exchanger leakage problem location

Directory of Open Access Journals (Sweden)

Jícha Miroslav

2012-04-01

Full Text Available Recent compact heat exchangers are very often assembled from numerous parts joined together to separate heat transfer fluids and to form the required heat exchanger arrangement. Therefore, the leak tightness is very important property of the compact heat exchangers. Although, the compact heat exchangers have been produced for many years, there are still technological problems associated with manufacturing of the ideal connection between the individual parts, mainly encountered with special purpose heat exchangers, e.g. gas turbine recuperators. This paper describes a procedure used to identify the leakage location inside the prime surface gas turbine recuperator. For this purpose, an analytical model of the leaky gas turbine recuperator was created to assess its performance. The results obtained are compared with the experimental data which were acquired during the recuperator thermal performance analysis. The differences between these two data sets are used to indicate possible leakage areas.

Influence of heating and acidification on the flavor of whey protein isolate.

Science.gov (United States)

White, S S; Fox, K M; Jervis, S M; Drake, M A

2013-03-01

Previous studies have established that whey protein manufacture unit operations influence the flavor of dried whey proteins. Additionally, manufacturers generally instantize whey protein isolate (WPI; ≥ 90% protein) by agglomeration with lecithin to increase solubility and wettability. Whey protein isolate is often subjected to additional postprocessing steps in beverage manufacturing, including acidification and heat treatment. These postprocessing treatments may further influence formation or release of flavors. The objective of the first study was to characterize the effect of 2 processing steps inherent to manufacturing of acidic protein beverages (acidification and heat treatment) on the flavor of non-instant WPI. The second study sought to determine the effect of lecithin agglomeration, a common form of instantized (INST) WPI used in beverage manufacturing, on the flavor of WPI after acidification and heat treatment. In the first experiment, commercial non-instantized (NI) WPI were rehydrated and evaluated as is (control); acidified to pH 3.2; heated to 85°C for 5 min in a benchtop high temperature, short time (HTST) pasteurizer; or acidified to 3.2 and heated to 85°C for 30s (AH-HTST). In the second experiment, INST and NI commercial WPI were subsequently evaluated as control, acidified, heated, or AH-HTST. All samples were evaluated by descriptive sensory analysis, solid-phase microextraction (SPME), and gas chromatography-mass spectrometry. Acidification of NI WPI produced higher concentrations of dimethyl disulfide (DMDS) and sensory detection of potato/brothy flavors, whereas heating increased cooked/sulfur flavors. Acidification and heating increased cardboard, potato/brothy, and malty flavors and produced higher concentrations of aldehydes, ketones, and sulfur compounds. Differences between INST and NI WPI existed before treatment; INST WPI displayed cucumber flavors not present in NI WPI. After acidification, INST WPI were distinguished by higher

Quality of frozen fruit bars manufactured through infrared pre-dehydration

Science.gov (United States)

In this study, frozen restructured whole apple and strawberry bars were manufactured by partial dehydration, using infrared (IR) heating, followed by restructuring and freezing. The objective of this investigation was to determine the effect of IR partial dehydration on the quality of restructured f...

Performance test of miniature heat exchangers with microchannels

International Nuclear Information System (INIS)

Hong, Yong Ju; Koh, Deuk Yong

2005-01-01

Etched microchannel heat exchanger, a subfield within MEMS, has high heat flux capability. This capability makes microchannels well-suited for a wide variety of application of cooling and chemical reaction. In this study, counter flow type miniature heat exchangers, which have flat metal plates with chemically etched microchannels, were manufactured by brazing method. Four type of the heat exchangers, which have straight microchannels, wavy shape microchannels, pin-fin channels and serpentine shape microchannels, were investigated to compare their thermal and hydraulic performance. Gas to gas heat exchange experiments were performed to measure the pressure drop and effectiveness of the heat exchangers at given gas flow rates and temperature difference

Heat transfer augmentation along the tube wall of a louvered fin heat exchanger using practical delta winglets

Energy Technology Data Exchange (ETDEWEB)

Lawson, Michael J.; Thole, Karen A. [Mechanical and Nuclear Engineering Department, The Pennsylvania State University, University Park, PA 16802 (United States)

2008-05-15

Delta winglets are known to induce the formation of streamwise vortices and increase heat transfer between a working fluid and the surface on which the winglets are placed. This study investigates the use of delta winglets to augment heat transfer on the tube surface of louvered fin heat exchangers. It is shown that delta winglets placed on louvered fins produce augmentations in heat transfer along the tube wall as high as 47% with a corresponding increase of 19% in pressure losses. Manufacturing constraints are considered in this study whereby piercings in the louvered fins resulting from stamping the winglets into the louvered fins are simulated. Comparisons of measured heat transfer coefficients with and without piercings indicate that piercings reduce average heat transfer augmentations, but significant increases still occur with respect to no winglets present. (author)

A Review on the Mechanical Modeling of Composite Manufacturing Processes

DEFF Research Database (Denmark)

Baran, Ismet; Cinar, Kenan; Ersoy, Nuri

2016-01-01

The increased usage of fiber reinforced polymer composites in load bearing applications requires a detailed understanding of the process induced residual stresses and their effect on the shape distortions. This is utmost necessary in order to have more reliable composite manufacturing since...... the residual stresses alter the internal stress level of the composite part during the service life and the residual shape distortions may lead to not meeting the desired geometrical tolerances. The occurrence of residual stresses during the manufacturing process inherently contains diverse interactions...... between the involved physical phenomena mainly related to material flow, heat transfer and polymerization or crystallization. Development of numerical process models is required for virtual design and optimization of the composite manufacturing process which avoids the expensive trial-and-error based...

Single wafer rapid thermal multiprocessing

International Nuclear Information System (INIS)

Saraswat, K.C.; Moslehi, M.M.; Grossman, D.D.; Wood, S.; Wright, P.; Booth, L.

1989-01-01

Future success in microelectronics will demand rapid innovation, rapid product introduction and ability to react to a change in technological and business climate quickly. These technological advances in integrated electronics will require development of flexible manufacturing technology for VLSI systems. However, the current approach of establishing factories for mass manufacturing of chips at a cost of more than 200 million dollars is detrimental to flexible manufacturing. The authors propose concepts of a micro factory which may be characterized by more economical small scale production, higher flexibility to accommodate many products on several processes, and faster turnaround and learning. In-situ multiprocessing equipment where several process steps can be done in sequence may be a key ingredient in this approach. For this environment to be flexible, the equipment must have ability to change processing environment, requiring extensive in-situ measurements and real time control. This paper describes the development of a novel single wafer rapid thermal multiprocessing (RTM) reactor for next generation flexible VLSI manufacturing. This reactor will combine lamp heating, remote microwave plasma and photo processing in a single cold-wall chamber, with applications for multilayer in-situ growth and deposition of dielectrics, semiconductors and metals

Powder Injection Molding - An innovative manufacturing method for He-cooled DEMO divertor components

International Nuclear Information System (INIS)

Antusch, Steffen; Norajitra, Prachai; Piotter, Volker; Ritzhaupt-Kleissl, Hans-Joachim; Spatafora, Luigi

2011-01-01

At Karlsruhe Institute of Technology (KIT), a He-cooled divertor design for future fusion power plants has been developed. This concept is based on the use of modular cooling fingers made from tungsten and tungsten alloy, which are presently considered the most promising divertor materials to withstand the specific heat load of 10 MW/m 2 . Since a large number of the finger modules (n > 250,000) are needed for the whole reactor, developing a mass-oriented manufacturing method is indispensable. In this regard, an innovative manufacturing technology, Powder Injection Molding (PIM), has been adapted to W processing at KIT since a couple of years. This production method is deemed promising in view of large-scale production of tungsten parts with high near-net-shape precision, hence, offering an advantage of cost-saving process compared to conventional machining. The complete technological PIM process for tungsten materials and its application on manufacturing of real divertor components, including the design of a new PIM tool is outlined and, results of the examination of the finished product after heat-treatment are discussed. A binary tungsten powder feedstock with a solid load of 50 vol.% was developed and successfully tested in molding experiments. After design, simulation and manufacturing of a new PIM tool, real divertor parts are produced. After heat-treatment (pre-sintering and HIP) the successful finished samples showed a sintered density of approximately 99%, a hardness of 457 HV0.1, a grain size of approximately 5 μm and a microstructure without cracks and porosity.

Compact flat-panel gas-gap heat switch operating at 295 K

Science.gov (United States)

Krielaart, M. A. R.; Vermeer, C. H.; Vanapalli, S.

2015-11-01

Heat switches are devices that can change from a thermally conducting (on-) state to an insulating (off-) state whenever the need arises. They enable adaptive thermal management strategies in which cooling rates are altered either spatially or temporally, leading to a substantial reduction in the energy and mass budget of a large range of systems. State-of-the-art heat switches are only rarely employed in thermal system architectures, since they are rather bulky and have a limited thermal performance (expressed as the heat transfer ratio between the on- and off-state heat conductance). Using selective laser melting additive manufacturing technology, also known as 3D printing, we developed a compact flat-panel gas-gap heat switch that offers superior thermal performance, is simpler and more economic to produce and assemble, contains no moving parts, and is more reliable because it lacks welded joints. The manufactured rectangular panel heat switch has frontal device dimensions of 10 cm by 10 cm, thickness of 3.2 mm and weighs just 121 g. An off heat conductance of 0.2 W/K and on-off heat conductance ratio of 38 is observed at 295 K.

3-Dimensional numerical study of cooling performance of a heat sink with air-water flow through mini-channel

Science.gov (United States)

Majumder, Sambit; Majumder, Abhik; Bhaumik, Swapan

2016-07-01

The present microelectronics market demands devices with high power dissipation capabilities having enhanced cooling per unit area. The drive for miniaturizing the devices to even micro level dimensions is shooting up the applied heat flux on such devices, resulting in complexity in heat transfer and cooling management. In this paper, a method of CPU processor cooling is introduced where active and passive cooling techniques are incorporated simultaneously. A heat sink consisting of fins is designed, where water flows internally through the mini-channel fins and air flows externally. Three dimensional numerical simulations are performed for large set of Reynolds number in laminar region using finite volume method for both developing flows. The dimensions of mini-channel fins are varied for several aspect ratios such as 1, 1.33, 2 and 4. Constant temperature (T) boundary condition is applied at heat sink base. Channel fluid temperature, pressure drop are analyzed to obtain best cooling option in the present study. It has been observed that as the aspect ratio of the channel decreases Nusselt number decreases while pressure drop increases. However, Nusselt number increases with increase in Reynolds number.

Proceedings of the 33rd national heat transfer conference NHTC'99

International Nuclear Information System (INIS)

Jensen, M.K.; Di Marzo, M.

1999-01-01

The papers in this conference were divided into the following sections: Radiation Heat Transfer in Fires; Computational Fluid Dynamics Methods in Two-Phase Flow; Heat Transfer in Microchannels; Thin Film Heat Transfer; Thermal Design of Electronics; Enhanced Heat Transfer I; Porous Media Convection; Contact Resistance Heat Transfer; Materials Processing in Solidification and Crystal Growth; Fundamentals of Combustion; Challenging Modeling Aspects of Radiative Transfer; Fundamentals of Microscale Transport; Laser Processing and Diagnostics for Manufacturing and Materials Processing; Experimental Studies of Multiphase Flow; Enhanced Heat Transfer II; Heat and Mass Transfer in Porous Media; Heat Transfer in Turbomachinery and Gas Turbine Systems; Conduction Heat Transfer; General Papers; Open Forum on Combustion; Combustion and Instrumentation and Diagnostics I; Radiative Heat Transfer and Interactions in Participating and Nonparticipating Media; Applications of Computational Heat Transfer; Heat Transfer and Fluid Aspects of Heat Exchangers; Two-Phase Flow and Heat Transfer Phenomena; Fundamentals of Natural and Mixed Convection Heat Transfer I; Fundamental of Natural and Mixed Convection Heat Transfer II; Combustion and Instrumentation and Diagnostics II; Computational Methods for Multidimensional Radiative Transfer; Process Heat Transfer; Advances in Computational Heat and Mass Transfer; Numerical Methods for Porous Media; Transport Phenomena in Manufacturing and Materials Processing; Practical Combustion; Melting and Solidification Heat Transfer; Transients in Dynamics of Two-Phase Flow; Basic Aspects of Two-Phase Flow; Turbulent Heat Transfer; Convective Heat Transfer in Electronics; Thermal Problems in Radioactive and Mixed Waste Management; and Transport Phenomena in Oscillatory Flows. Separate abstracts were prepared for most papers in this conference

Surface texture measurement for additive manufacturing

International Nuclear Information System (INIS)

Triantaphyllou, Andrew; Tomita, Ben; Milne, Katherine A; Giusca, Claudiu L; Macaulay, Gavin D; Roerig, Felix; Hoebel, Matthias; Leach, Richard K

2015-01-01

The surface texture of additively manufactured metallic surfaces made by powder bed methods is affected by a number of factors, including the powder’s particle size distribution, the effect of the heat source, the thickness of the printed layers, the angle of the surface relative to the horizontal build bed and the effect of any post processing/finishing. The aim of the research reported here is to understand the way these surfaces should be measured in order to characterise them. In published research to date, the surface texture is generally reported as an Ra value, measured across the lay. The appropriateness of this method for such surfaces is investigated here. A preliminary investigation was carried out on two additive manufacturing processes—selective laser melting (SLM) and electron beam melting (EBM)—focusing on the effect of build angle and post processing. The surfaces were measured using both tactile and optical methods and a range of profile and areal parameters were reported. Test coupons were manufactured at four angles relative to the horizontal plane of the powder bed using both SLM and EBM. The effect of lay—caused by the layered nature of the manufacturing process—was investigated, as was the required sample area for optical measurements. The surfaces were also measured before and after grit blasting. (paper)

Surface texture measurement for additive manufacturing

Science.gov (United States)

Triantaphyllou, Andrew; Giusca, Claudiu L.; Macaulay, Gavin D.; Roerig, Felix; Hoebel, Matthias; Leach, Richard K.; Tomita, Ben; Milne, Katherine A.

2015-06-01

The surface texture of additively manufactured metallic surfaces made by powder bed methods is affected by a number of factors, including the powder’s particle size distribution, the effect of the heat source, the thickness of the printed layers, the angle of the surface relative to the horizontal build bed and the effect of any post processing/finishing. The aim of the research reported here is to understand the way these surfaces should be measured in order to characterise them. In published research to date, the surface texture is generally reported as an Ra value, measured across the lay. The appropriateness of this method for such surfaces is investigated here. A preliminary investigation was carried out on two additive manufacturing processes—selective laser melting (SLM) and electron beam melting (EBM)—focusing on the effect of build angle and post processing. The surfaces were measured using both tactile and optical methods and a range of profile and areal parameters were reported. Test coupons were manufactured at four angles relative to the horizontal plane of the powder bed using both SLM and EBM. The effect of lay—caused by the layered nature of the manufacturing process—was investigated, as was the required sample area for optical measurements. The surfaces were also measured before and after grit blasting.

Implementation of microelectronic components in nuclear application

International Nuclear Information System (INIS)

Ashour, M.A

1997-01-01

As the next logical step in the evolution of programmable devices, Field programmable interconnect components (FPIC) bring the benefits of programmability to the system-level by enabling totally p rogrammable hardware . Continuing what was started by programmable memories twenty years ago and then enhanced by programmable logic ten years later, programmable interconnect holds the key to complete system programmability. History has shown that flexibility is the key benefit realized by programmable technologies (see figure 1). Initially used in a lab environment for design verification purposes, programmable technologies enhance development and ease of experimentation. As experience by more users is accumulated, performances improves and component prices are reduced, applications rapidly expand to address highly flexible and quickly implemented final manufactured products. With similar attributes of it's programmable predecessors, FPIC technology provides an attractive solution to the design verification problems of today and the manufacturing challenges of tomorrow

MANUFACTURE OF UF$sub 4$

Science.gov (United States)

Calcott, W.S.

1959-10-13

The manufacture of uranium tetrafluoride from urarium dioxide is described. Uranium dioxide is heated to about 500 deg C in a reactor. Anhydrous hydrogen fluoride is passed through the reactor in contact with uranium dioxide for several hours, the flow of hydrogen fluoride is discontinued, and hydrogen passed through the reactor for less than an hour. The flow of hydrogen fluoride is resumed for several hours, and then nitrogen is passed for a few minutes to expel unreacted hydrogen fluoride as water vapor. The reactor is cooled to room temperature and the uranium tetrafluoride removed.

Waste Heat Recovery. Technology and Opportunities in U.S. Industry

Energy Technology Data Exchange (ETDEWEB)

Johnson, Ilona [BCS, Inc., Laurel, MD (United States); Choate, William T. [BCS, Inc., Laurel, MD (United States); Davidson, Amber [BCS, Inc., Laurel, MD (United States)

2008-03-01

This study was initiated in order to evaluate RD&D needs for improving waste heat recovery technologies. A bottomup approach is used to evaluate waste heat quantity, quality, recovery practices, and technology barriers in some of the largest energyconsuming units in U.S. manufacturing. The results from this investigation serve as a basis for understanding the state of waste heat recovery and providing recommendations for RD&D to advance waste heat recovery technologies.

Proceedings of the twenty third national heat and mass transfer conference and first international ISHMT-ASTFE heat and mass transfer conference: souvenir and book of abstracts

International Nuclear Information System (INIS)

2015-01-01

The conference covered various aspects of heat and mass transfer like Aero-thermodynamics, Atmospheric flows, Biological heat and mass transfer, Combustion and reactive flows, Cryogenics, Electronic and photonic cooling, Energy engineering, Environmental engineering, Experimental techniques, Heat transfer enhancement, Heat transfer equipment's, Heat transfer in nuclear applications, Mass transfer, Materials processing and manufacturing, Microscale and nanoscale transport, Multiphase transport and phase change, Multi mode heat transfer, Numerical methods, Refrigeration and air conditioning, Space heat transfer, Transport phenomena in porous media, and Turbulent transport. Papers relevant to INIS are indexed separately

Modeling Heat Flow In a Calorimeter Equipped With a Textured Solar Collector

Science.gov (United States)

Jaworske, Donald A.; Allen, Bradley J.

2001-01-01

Heat engines are being considered for generating electric power for minisatellite applications, particularly for those missions in high radiation threat orbits. To achieve this objective, solar energy must be collected and transported to the hot side of the heat engine. A solar collector is needed having the combined properties of high solar absorptance, low infrared emittance, and high thermal conductivity. To test candidate solar collector concepts, a simple calorimeter was designed, manufactured, and installed in a bench top vacuum chamber to measure heat flow. In addition, a finite element analysis model of the collector/calorimeter combination was made to model this heat flow. The model was tuned based on observations from the as-manufactured collector/calorimeter combination. In addition, the model was exercised to examine other collector concepts, properties, and scale up issues.

High heat flux facility GLADIS

International Nuclear Information System (INIS)

Greuner, H.; Boeswirth, B.; Boscary, J.; McNeely, P.

2007-01-01

The new ion beam facility GLADIS started the operation at IPP Garching. The facility is equipped with two individual 1.1 MW power ion sources for testing actively cooled plasma facing components under high heat fluxes. Each ion source generates heat loads between 3 and 55 MW/m 2 with a beam diameter of 70 mm at the target position. These parameters allow effective testing from probes to large components up to 2 m length. The high heat flux allows the target to be installed inclined to the beam and thus increases the heated surface length up to 200 mm for a heat flux of 15 MW/m 2 in the standard operating regime. Thus the facility has the potential capability for testing of full scale ITER divertor targets. Heat load tests on the WENDELSTEIN 7-X pre-series divertor targets have been successfully started. These tests will validate the design and manufacturing for the production of 950 elements

Simulation of atomistic processes during silicon oxidation

OpenAIRE

Bongiorno, Angelo

2003-01-01

Silicon dioxide (SiO2) films grown on silicon monocrystal (Si) substrates form the gate oxides in current Si-based microelectronics devices. The understanding at the atomic scale of both the silicon oxidation process and the properties of the Si(100)-SiO2 interface is of significant importance in state-of-the-art silicon microelectronics manufacturing. These two topics are intimately coupled and are both addressed in this theoretical investigation mainly through first-principles calculations....

Mechanical design and fabrication of a heat exchanger. Report of the design and construction of a heat exchanger which will be used in 'Experimental analysis of heat transfer in the boiling in forced convection

International Nuclear Information System (INIS)

Mariano H, E.

1991-08-01

To continue with the equipment of the thermal hydraulics laboratory, it was designed thermal and mechanically an heat exchanger, to satisfy the requirements to have circuit that allows to carry out heat transfer experiments. The heat exchanger was manufactured and proven in the workshops of the Prototypes and Models Management, and it is expected that to obtain the foreseen results once completely installed the circuit, in the laboratory of thermal hydraulics of the Management of Nuclear Systems. (Author)

Technical project of complex fast cycle heat treatment of hydrogenous coal preparation

OpenAIRE

Moiseev, V. A.; Andrienko, V. G.; Pileckij, V. G.; Urvancev, A. I.; Gvozdyakov, Dmitry Vasilievich; Gubin, Vladimir Evgenievich; Matveev, Aleksandr Sergeevich; Savostiyanova, Ludmila Viktorovna

2015-01-01

Problems of heat-treated milled hydrogenous coal preparation site creation in leading fast cycle heat treatment complex were considered. Conditions for effective use of electrostatic methods of heat-treated milled hydrogenous coal preparation were set. Technical project of heat treatment of milled hydrogenous coal preparation site was developed including coupling of working equipment complex on fast heat treatment and experimental samples of equipment being designed for manufacturing. It was ...

Heat exchangers for automotive gas turbine power plants

International Nuclear Information System (INIS)

Penny, R.N.

1974-01-01

Automotive gas turbine power plants are now in the final stages of development for quantity manufacture. A crucial factor in this development is the regenerative heat exchanger. The relative merits of the rotary regenerative and static recuperative heat exchanger are compared. Thermal efficiency and initial cost are two vital issues involved in the design of small gas turbines for the commercial establishment of gas turbine vehicles. The selection of a material for the rotaty regenerator is essentially related to resolving the two vital issues of future small gas turbines and is, therefore, analysed. The account of the pioneering work involved in engineering the glass ceramic and other non-metal regenerators includes a complete failure analysis based on running experience with over 200 ceramic regenerators. The problems of sealing, supporting and manufacturing the ceramic regenerator are discussed and future practical designs are outlined. Heat exchange theory applied to small gas turbines is also reviewed

Carbon Foam Self-Heated Tooling for Out-of-Autoclave Composites Manufacturing, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — This proposal addresses NASA's need for non-autoclave composites manufacture. The Constellation program, including the Ares V launch vehicle, will require very...

Fabricating Superior NiAl Bronze Components through Wire Arc Additive Manufacturing

Directory of Open Access Journals (Sweden)

Donghong Ding

2016-08-01

Full Text Available Cast nickel aluminum bronze (NAB alloy is widely used for large engineering components in marine applications due to its excellent mechanical properties and corrosion resistance. Casting porosity, as well as coarse microstructure, however, are accompanied by a decrease in mechanical properties of cast NAB components. Although heat treatment, friction stir processing, and fusion welding were implemented to eliminate porosity, improve mechanical properties, and refine the microstructure of as-cast metal, their applications are limited to either surface modification or component repair. Instead of traditional casting techniques, this study focuses on developing NAB components using recently expanded wire arc additive manufacturing (WAAM. Consumable welding wire is melted and deposited layer-by-layer on substrates producing near-net shaped NAB components. Additively-manufactured NAB components without post-processing are fully dense, and exhibit fine microstructure, as well as comparable mechanical properties, to as-cast NAB alloy. The effects of heat input from the welding process and post-weld-heat-treatment (PWHT are shown to give uniform NAB alloys with superior mechanical properties revealing potential marine applications of the WAAM technique in NAB production.

A compact atomic force-scanning tunneling microscope for studying microelectronics and environmental aerosols

International Nuclear Information System (INIS)

Chen, G.

1996-06-01

This dissertation describes the characteristics and the construction of a compact atomic force/scanning tunneling microscope (AFM/STM). The basics and the method of preparing a tunneling junction between a chemically etched tunneling tip and a micro-manufactured cantilever is outlined by analyzing the forces between tunneling tip and cantilever as well as between force-sensing tip and sample surfaces. To our best knowledge this instrument is the first one using a commercial cantilever with only one piezoelectric tube carrying the whole tunneling sensor. The feedback control system has been optimized after a careful analysis of the electronic loop characteristics. The mode of operation has been determined by analyzing the dynamic characteristics of the scan heads and by investigating the time characteristics of the data acquisition system. The vibration isolation system has been calibrated by analyzing the characteristics of the damping setup and the stiffness of the scan head. The calculated results agree well with the measured ones. Also, a software package for data acquisition and real time display as well as for image processing and three-dimensional visualization has been developed. With this home-made software package, the images can be processed by means of a convolution filter, a Wiener filter and other 2-D FFT filters, and can be displayed in different ways. Atomic resolution images of highly oriented pyrolytic graphite (HOPG) and graphite surfaces have been obtained in AFM and STM mode. New theoretical explanations have been given for the observed anomalous STM and AFM images of graphite by calculating the asymmetric distribution of quantum conductance and tip-surface forces on a graphite surface. This not only resolved the theoretical puzzles of STM and AFM of graphite, but also revealed the relation between atomic force microscopy and scanning tunneling microscopy of graphite. Applications of STM and AFM to micro-electronic devices have been investigated

Femtosecond laser pulses for fast 3-D surface profilometry of microelectronic step-structures.

Science.gov (United States)

Joo, Woo-Deok; Kim, Seungman; Park, Jiyong; Lee, Keunwoo; Lee, Joohyung; Kim, Seungchul; Kim, Young-Jin; Kim, Seung-Woo

2013-07-01

Fast, precise 3-D measurement of discontinuous step-structures fabricated on microelectronic products is essential for quality assurance of semiconductor chips, flat panel displays, and photovoltaic cells. Optical surface profilers of low-coherence interferometry have long been used for the purpose, but the vertical scanning range and speed are limited by the micro-actuators available today. Besides, the lateral field-of-view extendable for a single measurement is restricted by the low spatial coherence of broadband light sources. Here, we cope with the limitations of the conventional low-coherence interferometer by exploiting unique characteristics of femtosecond laser pulses, i.e., low temporal but high spatial coherence. By scanning the pulse repetition rate with direct reference to the Rb atomic clock, step heights of ~69.6 μm are determined with a repeatability of 10.3 nm. The spatial coherence of femtosecond pulses provides a large field-of-view with superior visibility, allowing for a high volume measurement rate of ~24,000 mm3/s.

COMPUTERIZED HEAT-TREATMENT IN A ZIMBABWEAN FACTORY

Directory of Open Access Journals (Sweden)

M. Collier

2012-01-01

Full Text Available In the context of Zimbabwe's current economic problems, parts of the manufacturing industry are turning their attention to the possibility of utilising local design talent in upgrading their manufacturing plants. This paper describes a project undertaken by the National University of Science and Technology to convert the heat-treatment process in a major manufacturing plant from semi -manual to a computerized one. The system comprises microcontroller connection to the furnaces and sensors, and communicates with a central computer on which software for a windowed user-interface is hosted. Experimental results for the system are presented, and a strategy for other companies in the same predicament is proposed.

Overview of the EU small scale mock-up tests for ITER high heat flux components

International Nuclear Information System (INIS)

Vieider, G.; Barabash, V.; Cardella, A.

1998-01-01

This task within the EU R and D for ITER was aimed at the development of basic manufacturing solutions for the high heat flux plasma facing components such as the divertor targets, the baffles and limiters. More than 50 representative small-scale mock-ups have been manufactured with beryllium, carbon and tungsten armour using various joining technologies. High heat flux testing of 20 of these mock-ups showed the carbon mono-blocks to be the most robust solution, surviving 2000 cycles at absorbed heat fluxes of up to 24 MW m -2 . With flat armour tiles rapid joint failures occurred at 5-16 MW m -2 depending on joining technology and armour material. These test results serve as a basis for the selection of manufacturing options and materials for the prototypes now being ordered. (orig.)

Heat pipes. (Latest citations from the US Patent Bibliographic file with exemplary claims). Published Search

Energy Technology Data Exchange (ETDEWEB)

NONE

1995-01-01

The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 250 citations and includes a subject term index and title list.)

Advanced single-wafer sequential multiprocessing techniques for semiconductor device fabrication

International Nuclear Information System (INIS)

Moslehi, M.M.; Davis, C.

1989-01-01

Single-wafer integrated in-situ multiprocessing (SWIM) is recognized as the future trend for advanced microelectronics production in flexible fast turn- around computer-integrated semiconductor manufacturing environments. The SWIM equipment technology and processing methodology offer enhanced equipment utilization, improved process reproducibility and yield, and reduced chip manufacturing cost. They also provide significant capabilities for fabrication of new and improved device structures. This paper describes the SWIM techniques and presents a novel single-wafer advanced vacuum multiprocessing technology developed based on the use of multiple process energy/activation sources (lamp heating and remote microwave plasma) for multilayer epitaxial and polycrystalline semiconductor as well as dielectric film processing. Based on this technology, multilayer in-situ-doped homoepitaxial silicon and heteroepitaxial strained layer Si/Ge x Si 1 - x /Si structures have been grown and characterized. The process control and the ultimate interfacial abruptness of the layer-to-layer transition widths in the device structures prepared by this technology will challenge the MBE techniques in multilayer epitaxial growth applications

More-than-Moore 2.5D and 3D SiP integration

CERN Document Server

Radojcic, Riko

2017-01-01

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product. .

Vacuum mechatronics

Science.gov (United States)

Hackwood, Susan; Belinski, Steven E.; Beni, Gerardo

1989-01-01

The discipline of vacuum mechatronics is defined as the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. The importance of vacuum mechatronics is growing with an increased application of vacuum in space studies and in manufacturing for material processing, medicine, microelectronics, emission studies, lyophylisation, freeze drying and packaging. The quickly developing field of vacuum mechatronics will also be the driving force for the realization of an advanced era of totally enclosed clean manufacturing cells. High technology manufacturing has increasingly demanding requirements for precision manipulation, in situ process monitoring and contamination-free environments. To remove the contamination problems associated with human workers, the tendency in many manufacturing processes is to move towards total automation. This will become a requirement in the near future for e.g., microelectronics manufacturing. Automation in ultra-clean manufacturing environments is evolving into the concept of self-contained and fully enclosed manufacturing. A Self Contained Automated Robotic Factory (SCARF) is being developed as a flexible research facility for totally enclosed manufacturing. The construction and successful operation of a SCARF will provide a novel, flexible, self-contained, clean, vacuum manufacturing environment. SCARF also requires very high reliability and intelligent control. The trends in vacuum mechatronics and some of the key research issues are reviewed.

Residual stress prediction in a powder bed fusion manufactured Ti6Al4V hip stem

Science.gov (United States)

Barrett, Richard A.; Etienne, Titouan; Duddy, Cormac; Harrison, Noel M.

2017-10-01

Powder bed fusion (PBF) is a category of additive manufacturing (AM) that is particularly suitable for the production of 3D metallic components. In PBF, only material in the current build layer is at the required melt temperature, with the previously melted and solidified layers reducing in temperature, thus generating a significant thermal gradient within the metallic component, particularly for laser based PBF components. The internal thermal stresses are subsequently relieved in a post-processing heat-treatment step. Failure to adequately remove these stresses can result in cracking and component failure. A prototype hip stem was manufactured from Ti6Al4V via laser PBF but was found to have fractured during over-seas shipping. This study examines the evolution of thermal stresses during the laser PBF manufacturing and heat treatment processes of the hip stem in a 2D finite element analysis (FEA) and compares it to an electron beam PBF process. A custom written script for the automatic conversion of a gross geometry finite element model into a thin layer- by-layer finite element model was developed. The build process, heat treatment (for laser PBF) and the subsequent cooling were simulated at the component level. The results demonstrate the effectiveness of the heat treatment in reducing PBF induced thermal stresses, and the concentration of stresses in the region that fractured.

Manufacture and Erection of SFR Components: Feedback from PFBR Experience

International Nuclear Information System (INIS)

Chellapandi, P.

2013-01-01

Unique Features of SFR Components: • Large diameter thin walled shell and slender structures calling for stringent tolerances posing challenges in manufacturing, handling and erection. • Single side welds are unavoidable at some difficult locations. • In-service inspection is difficult. • Residual stresses should be minimum calling for robust heat treatment strategy. • Minimum number of materials to be used from reliability point of view (but not preferred from economic considerations). • Mainly austenitic stainless steels calling for careful considerations for welding without significant weld repairs and distortions. • Reactor assembly components decide the project time schedule (large manufacturing, assembly and erection time). • Leak tightness is very important in view of resulting sodium leaks. • Limited experience on manufacturing and erection of components. • Design and manufacturing codes still evolvingPFBR Reactor Assembly – Major Lessons: • Grid plate Large number of sleeves, posing difficulty in assembly, hard facing of large diameter plates and heavy flange construction. • Roof slab Large box type structure with many penetrations – complicated manufacturing process, time consuming and difficulty to overcome lamellar tearing problems. • Inclined Fuel Transfer Machine Complex manufacturing processes leading to large time and extensive qualification tests. • Increase of number of primary pipes – essential for enhancing safety. • Integration of components manufactured by different industries took unduly long time

Low-cost access to development and manufacturing of photonic integrated circuits

NARCIS (Netherlands)

Smit, M.K.

2014-01-01

Generic photonic integration technology is rapidly gaining popularity. It applies the methodology that is so successful in microelectronics (CMOS technology) to the domain of photonics: providing lowcost access to highly standardized high-performance processes that support integration in a single

The impact of fit manufacturing on green manufacturing: A review

Science.gov (United States)

Qi, Ang Nian; Sin, Tan Chan; Fathullah, M.; Lee, C. C.

2017-09-01

Fit manufacturing and Green manufacturing are a new trend principle and concept. They are getting popular in industrial. This paper is identifying the impact between Fit manufacturing and Green manufacturing. Besides Fit manufacturing, Lean manufacturing, Agile manufacturing and Sustainable manufacturing gives big impacts to Green Manufacturing. On top of that, this paper also discuss the benefits of applying Fit manufacturing and Green manufacturing in industrial as well as environment. Hence, applications of Fit manufacturing and Green Manufacturing are increasing year by year.

AutoMOPS- B2B and B2C in mask making: Mask manufacturing performance and customer satisfaction improvement through better information flow management using generic models and standardized languages

Science.gov (United States)

Filies, Olaf; de Ridder, Luc; Rodriguez, Ben; Kujiken, Aart

2002-03-01

Semiconductor manufacturing has become a global business, in which companies of different size unite in virtual enterprises to meet new opportunities. Therefore Mask manufacturing is a key business, but mask ordering is a complex process and is always critical regarding design to market time, even though mask complexity and customer base are increasing using a wide variety of different mask order forms which are frequently faulty and very seldom complete. This is effectively blocking agile manufacturing and can tie wafer fabs to a single mask The goal of the project is elimination of the order verification through paperless, electronically linked information sharing/exchange between chip design, mask production and production stages, which will allow automation of the mask preparation. To cover these new techniques and their specifications as well as the common ones with automated tools a special generic Meta-model will be generated, based on the current standards for mask specifications, including the requirements from the involved partners (Alcatel Microelectronics, Altis, Compugraphics, Infineon, Nimble, Sigma-C), the project works out a pre-normative standard. The paper presents the current status of work. This work is partly funded by the Commission of the European Union under the Fifth Framework project IST-1999-10332 AutoMOPS.

Ripening of Sudanese Braided (Muddaffara Cheese Manufactured from Raw or Pasteurized Milk: Effect of Heat Treatment and Salt Concentration on the Physicochemical Properties

Directory of Open Access Journals (Sweden)

Mohamed O. E. Altahir

2014-01-01

Full Text Available The objective of the study was to investigate the interactive effect of heat treatment (raw or pasteurized milk, ripening in salted whey (SW and storage period for up to 3 months on the physicochemical properties of Sudanese braided cheese (SBC. Braided cheeses were manufactured from raw (BCRM and pasteurized (BCPM milk and ripened in SW (0%, 5%, and 10% salt for up to 90 days. All the treatments significantly (P≤0.05 affected the physicochemical characteristics of SBC. The total solid, protein, and fat contents of BCRM or BCPM decreased (P≤0.05, whereas their TA, SN, and salt contents increased significantly (P≤0.05 as storage period and the salt level of the whey were elevated. Both FRI and SRI of BCRM and BCPM increased with the increase in storage period and the salt level of the whey. For SN, FRI, SRI, pH, and moisture contents the magnitude of the change was more pronounced in BCRM than in BCPM, while for protein, fat, salt, and TS contents, the opposite was true; that is, the magnitude of the change was more pronounced in BCPM than in BCRM. Further studies are required to standardize muddaffara cheese manufacturing procedure particularly in rural areas.

Ripening of Sudanese Braided (Muddaffara) Cheese Manufactured from Raw or Pasteurized Milk: Effect of Heat Treatment and Salt Concentration on the Physicochemical Properties.

Science.gov (United States)

Altahir, Mohamed O E; Elgasim, Elgasim A; Mohamed Ahmed, Isam A

2014-01-01

The objective of the study was to investigate the interactive effect of heat treatment (raw or pasteurized milk), ripening in salted whey (SW) and storage period for up to 3 months on the physicochemical properties of Sudanese braided cheese (SBC). Braided cheeses were manufactured from raw (BCRM) and pasteurized (BCPM) milk and ripened in SW (0%, 5%, and 10% salt) for up to 90 days. All the treatments significantly (P ≤ 0.05) affected the physicochemical characteristics of SBC. The total solid, protein, and fat contents of BCRM or BCPM decreased (P ≤ 0.05), whereas their TA, SN, and salt contents increased significantly (P ≤ 0.05) as storage period and the salt level of the whey were elevated. Both FRI and SRI of BCRM and BCPM increased with the increase in storage period and the salt level of the whey. For SN, FRI, SRI, pH, and moisture contents the magnitude of the change was more pronounced in BCRM than in BCPM, while for protein, fat, salt, and TS contents, the opposite was true; that is, the magnitude of the change was more pronounced in BCPM than in BCRM. Further studies are required to standardize muddaffara cheese manufacturing procedure particularly in rural areas.

Heat pipes. (Latest citations from the US Patent bibliographic file with exemplary claims). Published Search

Energy Technology Data Exchange (ETDEWEB)

NONE

1997-03-01

The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 50-250 citations and includes a subject term index and title list.) (Copyright NERAC, Inc. 1995)

Heat pipes. (Latest citations from the US Patent Bibliographic file with exemplary claims). Published Search

Energy Technology Data Exchange (ETDEWEB)

NONE

1995-12-01

The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 50-250 citations and includes a subject term index and title list.) (Copyright NERAC, Inc. 1995)

Air-source heat pump carbon footprints: HFC impacts and comparison to other heat sources

International Nuclear Information System (INIS)

Johnson, Eric P.

2011-01-01

European governments see that heat pumps could reduce carbon emissions in space- and hot-water heating. EU's Renewable Energy Directive designates heat pumps as renewable - eligible for various subsidies - if their carbon footprints are below an implied, average threshold. This threshold omits carbon generated by manufacture and emission of a heat-pump's fluorocarbon refrigerant. It also omits the footprint of the heat pump's hardware. To see if these omissions are significant, this study calculated carbon footprints of representative, residential heat pumps in the UK. Three findings emerged. First, in relation to power generation, which accounts for most of a heat-pump's greenhouse-gas emissions, fluorocarbons add another 20% to the footprint. Second, at UK efficiencies a heat-pump footprint (in kg CO 2 e emitted per kWh delivered) is comparable or higher than footprints of gaseous fuels used in heating. It is lower than the footprint of heating oil and far lower than the footprints of solid fuels. Third, production and disposal of a heat pump's hardware is relatively insignificant, accounting for only 2-3% of the overall heat-pump footprint. Sensitivities to the results were assessed: key factors are footprint of electricity generation, F-gas composition and leak rates and type of wall construction. - Research highlights: → Refrigerant emissions add 20% to a UK air-source heat pump's carbon footprint. → This contribution is so far ignored by regulations. → UK heat pump footprints are comparable to those of gaseous fuels.

DLTS study of annihilation of oxidation induced deep-level defects ...

Indian Academy of Sciences (India)

Administrator

microelectronics device technologies. As technology is ... an important role in manufacturing high-speed electronic ... DLTS is a capacitance transient thermal scanning tech- ... again dipped in methanol and dried using nitrogen gun. A.

A method for manufacturing monocrystals

International Nuclear Information System (INIS)

Faure, Jacqueline; Malmejac, Yves; Schaub, Bernard.

1973-01-01

Description is given of a method for manufacturing monocrystals, substantially free of disorder, of a metal showing an allotropic transformation at a temperature lower than its melting point. Monocrystals of the raw metal having undergone a uni-directional solidification are heated to a temperature between the allotropic transformation point and the metal melting point; the monocrystals are maintained in the vicinity of that temperature for a given period of time; they are cooled down to a temperature lower than the allotropic transformation point, then they are annealed and cooled down to room temperature. Such monocrystals are used in neutron monochromators [fr

Manufacturing and testing of a prototypical divertor vertical target for ITER

Science.gov (United States)

Merola, M.; Plöchl, L.; Chappuis, Ph; Escourbiac, F.; Grattarola, M.; Smid, I.; Tivey, R.; Vieider, G.

2000-12-01

After an extensive R&D activity, a medium-scale divertor vertical target prototype has been manufactured by the EU Home Team. This component contains all the main features of the corresponding ITER divertor design and consists of two units with one cooling channel each, assembled together and having an overall length and width of about 600 and 50 mm, respectively. The upper part of the prototype has a tungsten macro-brush armour, whereas the lower part is covered by CFC monoblocks. A number of joining techniques were required to manufacture this component as well as an appreciable effort in the development of suitable non-destructive testing methods. The component was high heat flux tested in FE200 electron beam facility at Le Creusot, France. It endured 100 cycles at 5 MW/m 2, 1000 cycles at 10 MW/m 2 and more then 1000 cycles at 15-20 MW/m 2. The final critical heat flux test reached a value in excess of 30 MW/m 2.

Design for manufacturability of macro and micro products: a case study of heat exchanger design

DEFF Research Database (Denmark)

Omidvarnia, F.; Weng Feng, L.; Hansen, H. N.

2018-01-01

In this paper, a novel methodology in designing a micro heat exchanger is proposed by modifying a conventional design methodology for macro products with the considerations of differences between design of a micro and a macro product. The methodology starts with the identification of differences...... for fabricating micro heat exchangers are ranked based on the defined criteria. Following the design methodology, primary design ideas for micro heat exchangers are generated according to the heat transfer principles for macro heat exchangers. Taking micro design considerations into account, the designs from next...... iteration are created. Finally, the performances of the designs for micro heat exchangers are compared with their macro counterparts. The most appropriate designs for micro heat exchangers are finalized. The micro specific design guidelines obtained by the designer through evaluating the modeling results...

Pre-brazed casting and hot radial pressing: A reliable process for the manufacturing of CFC and W monoblock mock-ups

International Nuclear Information System (INIS)

Visca, Eliseo; Libera, S.; Mancini, A.; Mazzone, G.; Pizzuto, A.; Testani, C.

2007-01-01

ENEA is involved in the European International Thermonuclear Experimental Reactor (ITER) R and D activities and, in particular, for the manufacturing of high heat flux plasma-facing components (HHFC), such as the divertor targets, the baffles and the limiters. During last years, ENEA has manufactured actively cooled mock-ups by using different technologies, namely brazing, diffusion bonding and hot isostatic pressing (HIPping). A new manufacturing process has been set up and tested. It was successfully applied for the manufacturing of W armoured monoblock mock-ups. This technique is the HRP (hot radial pressing) based on performing a radial diffusion bonding between the cooling tube and the armour tile by pressurizing only internal tube and by keeping the joining zone in vacuum at the required bonding temperature. The heating is obtained by a standard air furnace. The HRP technique is now used for the manufacturing of CFC armoured monoblock components. For this purpose, some issues have to be faced, like the low CFC tensile strength, the pure copper interlayer between the heat sink and the armour necessary to mitigate the stress at the joint interface, and the low wettability of the pure copper on the CFC matrix. This paper reports the research path followed to manufacture a medium scale vertical target CFC and W armoured mock-up by HRP. A casting of a soft copper interlayer between the tube and the tile was obtained by a new technique: the pre-brazed casting (PBC, ENEA patent). Some preliminary mock-ups with three NB31 CFC tiles were successfully manufactured and tested to thermal fatigue using electron beam facilities. They all reached at least 1000 cycles at 20 MW/m 2 without suffering any damage. The manufactured medium scale vertical target mock-up is now under testing at the FE2000 (France) facility. These activities were performed in the frame of ITER-EFDA contracts

Heat Energy Markets: Trends of Spatial Organization

Directory of Open Access Journals (Sweden)

Olga Valeryevna Dyomina

2016-12-01

Full Text Available The author reviews competing forms of heat supply. It is shown that in Finland, Denmark, China and Russia the dominant form of heat supply is district heating system; in the United States and Canada the dominant form of heat supply is individual one. Using the countries’ data the author allocates 4 models of heat energy markets. The analysis is based on combinations of the following characteristics: the type of market, the orientation of market, the stage of market development, forms of state support of district heating systems and the approach to pricing. The results identified the failure of the current model of heat energy market in Russia (noncompetitive, manufacturer-oriented and evolved market with massive state support of its district heating system. The ‘target’ model of heat energy market in Russia is a model of noncompetitive, customer-oriented and evolved market with no state support of its district heating system. However, the ‘target’ model takes into account spatial heterogeneity of local heat energy markets in Russia only technically

Thermal engineering and micro-technology; Thermique et microtechnologie

Energy Technology Data Exchange (ETDEWEB)

Kandlikar, S. [Rochester Inst. of Tech., NY (United States); Luo, L. [Institut National Polytechnique, 54 - Nancy (France); Gruss, A. [CEA Grenoble, GRETH, 38 (France); Wautelet, M. [Mons Univ. (Belgium); Gidon, S. [CEA Grenoble, Lab. d' Electronique et de Technologie de l' Informatique (LETI), 38 (France); Gillot, C. [Ecole Nationale Superieure d' Ingenieurs Electriciens de Grenoble, 38 - Saint Martin d' Heres (France)]|[CEA Grenoble, Lab. Electronique et de Technologie de l' Informatique (LETI), 38 (France); Therme, J.; Marvillet, Ch.; Vidil, R. [CEA Grenoble, 38 (France); Dutartre, D. [ST Microelectronique, France (France); Lefebvre, Ph. [SNECMA, 75 - Paris (France); Lallemand, M. [Institut National des Sciences Appliquees (INSA), 69 - Villeurbanne (France); Colin, S. [Institut National des Sciences Appliquees (INSA), 31 - Toulouse (France); Joulin, K. [Ecole Nationale Superieure de Mecanique et d' Aerotechnique (ENSMA), 86 - Poitiers (France); Gad el Hak, M. [Virginia Univ., Charlottesville, VA (United States)

2003-07-01

This document gathers the abstracts and transparencies of 5 invited conferences of this congress of the SFT about heat transfers and micro-technologies: Flow boiling in microchannels: non-dimensional groups and heat transfer mechanisms (S. Kandlikar); Intensification and multi-scale process units (L. Luo and A. Gruss); Macro-, micro- and nano-systems: different physics? (M. Wautelet); micro-heat pipes (M. Lallemand); liquid and gas flows inside micro-ducts (S. Colin). The abstracts of the following presentations are also included: Electro-thermal writing of nano-scale memory points in a phase change material (S. Gidon); micro-technologies for cooling in micro-electronics (C. Gillot); the Minatec project (J. Therme); importance and trends of thermal engineering in micro-electronics (D. Dutartre); Radiant heat transfers at short length scales (K. Joulain); Momentum and heat transfer in micro-electromechanical systems (M. Gad-el-Hak). (J.S.)

Tube manufacturing trials by different routes in 9CrW-ODS martensitic steels

International Nuclear Information System (INIS)

Ukai, S.; Narita, T.; Alamo, A.; Parmentier, P.

2004-01-01

In the collaboration work between JNC and CEA-Saclay, JNC and CEA independently manufactured ODS martensitic cladding tubes by their own fabrication routes. Manufacturing started from the same hollow shape mother tubes with a composition of 9Cr-2W-0.1Ti-0.24Y 2 O 3 . The HPTR cold-rolling process was used by both JNC and CEA, but the applied fabrication routes included different cross-section reduction ratios, number of passes and intermediate heat treatments. The manufactured claddings exhibited an isotropic grain structure and equivalent tensile strength in the longitudinal and transverse directions. Even though different cross-section reduction ratios and intermediate annealing treatments were used, both cladding tubes manufactured by JNC and CEA showed similar levels of tensile and internal creep rupture strength

Final Report for Project titled High Thermal Conductivity Polymer Composites for Low-Cost Heat Exchangers

Energy Technology Data Exchange (ETDEWEB)

Thibaud-Erkey, Catherine [United Technologies reserach Center, East Hartford, CT (United States); Alahyari, Abbas [United Technologies reserach Center, East Hartford, CT (United States)

2016-12-28

Heat exchangers (HXs) are critical components in a wide range of heat transfer applications, from HVAC (Heating Ventilation and Cooling) to automobiles to manufacturing plants. They require materials capable of transferring heat at high rates while also minimizing thermal expansion over the usage temperature range. Conventionally, metals are used for applications where effective and efficient heat exchange is required, since many metals exhibit thermal conductivity over 100 W/m K. While metal HXs are constantly being improved, they still have some inherent drawbacks due to their metal construction, in particular corrosion. Polymeric material can offer solution to such durability issues and allow designs that cannot be afforded by metal construction either due to complexity or cost. A major drawback of polymeric material is their low thermal conductivity (0.1-0.5? W/mK) that would lead to large system size. Recent improvements in the area of filled polymers have highlighted the possibility to greatly improve the thermal conductivity of polymeric materials while retaining their inherent manufacturing advantage, and have been applied to heat sink applications. Therefore, the objective of this project was to develop a robust review of materials for the manufacturing of industrial and commercial non-metallic heat exchangers. This review consisted of material identification, literature evaluation, as well as empirical and model characterization, resulting in a database of relevant material properties and characteristics to provide guidance for future heat exchanger development.

Manufacturing and testing experience for FFTF major safety related components

International Nuclear Information System (INIS)

Peckinpaugh, C.L.

1976-01-01

Experience with FFTF Heat Transport System components during design, manufacturing, and prototype testing is dscussed. Specifically the special design features and the results of the testing performed to assure that the designs provide for safe operation are outlined. Particular emphasis is placed on the full size prototype testing programs and the valuable experience gained

Seminar on heat pump research and applications: proceedings

Energy Technology Data Exchange (ETDEWEB)

Steele, R.V. Jr. (ed.)

1984-11-01

This volume is a compilation of papers prepared by speakers at a seminar on heat pumps. The seminar was organized by the Electric Power Research Institute (EPRI) in cooperation with Louisiana Power and Light Company and New Orleans Public Service, Inc. The seminar's purpose was to inform utility managers and engineers of the most recent developments in residential heat pump technology and applications. Statements by invited panelists on the outlook for heat pump technology are also included. The speakers, who represented key organizations in the heat pump area, including utilities, industry associations, manufacturers, independent research institutes, government, and EPRI, addressed the following topics: status of heat pump research and development, heat pump testing and rating; field monitoring of heat pumps; heat pump water heaters; heat pump reliability; and marketing programs for pumps. All papers, total of sixteen have been processed for inclusion in the Energy Data Base.

Material science and manufacturing of heat-resistant reduced-activation ferritic-martensitic steels for fusion

International Nuclear Information System (INIS)

Ioltukhovskiy, A.G.; Blokhin, A.I.; Budylkin, N.I.; Chernov, V.M.; Leont'eva-Smirnova, M.V.; Mironova, E.G.; Medvedeva, E.A.; Solonin, M.I.; Porollo, S.I.; Zavyalsky, L.P.

2000-01-01

A number of issues regarding the development and use of 10-12% Cr reduced-activation ferritic-martensitic steels (RAFMS) for fusion are considered. These include: (1) problems of manufacturing and modifying their composition and metallurgical condition; (2) the influence on properties of their composition, purity, δ-ferrite concentration and cooling rates in the final stages of manufacturing; and (3) the effects of neutron irradiation at 320-650 deg. C up to 108 dpa on their mechanical properties. In addition, neutron activation and nuclear accumulation of elements in RAFMS with different initial concentrations of alloying and impurity elements for typical fusion reactor (DEMO) irradiation regimes have been calculated

On the role of the residual stress state in product manufacturing

NARCIS (Netherlands)

Zijlstra, G.; Groen, M.; Post, J.; Ocelik, V.; de Hosson, J.Th.M.

2016-01-01

This paper concentrates on the effect of the residual stress state during product manufacturing of AISI 420 steel on the final shape of the product. The work includes Finite Element (FE) calculations of the distribution of the residual stresses after metal forming and a heat treatment. The evolution

Manufacturing of cast fittings for power machine building using improved CO2-process

International Nuclear Information System (INIS)

Shuvalov, V.G.; Borodin, M.A.

1984-01-01

Technique for manufacturing of rods for casting fittings for power machines of heat and nuclear power plants using liquid-glass mixtures solidified by CO 2 is described. Optimal composition of mixtures and their basic technological properties were determined

High Effectiveness Heat Exchanger for Cryogenic Refrigerators, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — We propose an innovative high performance cryogenic heat exchanger manufactured of titanium by photo-etching and diffusion bonding. This is a parallel plate design...

Heat pipe solar receiver with thermal energy storage

Science.gov (United States)

Zimmerman, W. F.

1981-01-01

An HPSR Stirling engine generator system featuring latent heat thermal energy storge, excellent thermal stability and self regulating, effective thermal transport at low system delta T is described. The system was supported by component technology testing of heat pipes and of thermal storage and energy transport models which define the expected performance of the system. Preliminary and detailed design efforts were completed and manufacturing of HPSR components has begun.

Improving Process Heating System Performance v3

Energy Technology Data Exchange (ETDEWEB)

None

2016-04-11

Improving Process Heating System Performance: A Sourcebook for Industry is a development of the U.S. Department of Energy (DOE) Advanced Manufacturing Office (AMO) and the Industrial Heating Equipment Association (IHEA). The AMO and IHEA undertook this project as part of an series of sourcebook publications developed by AMO on energy-consuming industrial systems, and opportunities to improve performance. Other topics in this series include compressed air systems, pumping systems, fan systems, steam systems, and motors and drives

Specialists' meeting on heat exchanging components of gas-cooled reactors

Energy Technology Data Exchange (ETDEWEB)

NONE

1984-07-01

The objective of the Meeting sponsored by IAEA was to provide a forum for the exchange and discussion of technical information related to heat exchanging and heat conducting components for gas-cooled reactors. The technical part of the meeting covered eight subjects: Heat exchanging components for process heat applications, design and requirements, and research and development programs; Status of the design and construction of intermediate He/He exchangers; Design, construction and performance of steam generators; Metallic materials and design codes; Design and construction of valves and hot gas ducts; Description of component test facilities and test results; Manufacturing of heat exchanging components.

Specialists' meeting on heat exchanging components of gas-cooled reactors

International Nuclear Information System (INIS)

1984-01-01

The objective of the Meeting sponsored by IAEA was to provide a forum for the exchange and discussion of technical information related to heat exchanging and heat conducting components for gas-cooled reactors. The technical part of the meeting covered eight subjects: Heat exchanging components for process heat applications, design and requirements, and research and development programs; Status of the design and construction of intermediate He/He exchangers; Design, construction and performance of steam generators; Metallic materials and design codes; Design and construction of valves and hot gas ducts; Description of component test facilities and test results; Manufacturing of heat exchanging components

Feasibility of Observing and Characterizing Single Ion Strikes in Microelectronic Components

International Nuclear Information System (INIS)

Dingreville, Remi Philippe Michel; Hattar, Khalid Mikhiel; Bufford, Daniel Charles

2015-01-01

The transient degradation of semiconductor device performance under irradiation has long been an issue of concern. A single high-energy charged particle can degrade or permanently destroy the microelectronic component, potentially altering the course or function of the systems. Disruption of the the crystalline structure through the introduction of quasi-stable defect structures can change properties from semiconductor to conductor. Typically, the initial defect formation phase is followed by a recovery phase in which defect-defect or defect-dopant interactions modify the characteristics of the damaged structure. In this LDRD Express, in-situ ion irradiation transmission microscopy (TEM) in-situ TEM experiments combined with atomistic simulations have been conducted to determine the feasibility of imaging and characterizing the defect structure resulting from a single cascade in silicon. In-situ TEM experiments have been conducted to demonstrate that a single ion strike can be observed in Si thin films with nanometer resolution in real time using the in-situ ion irradiation transmission electron microscope (I 3 TEM). Parallel to this experimental effort, ion implantation has been numerically simulated using Molecular Dynamics (MD). This numerical framework provides detailed predictions of the damage and follow the evolution of the damage during the first nanoseconds. The experimental results demonstrate that single ion strike can be observed in prototypical semiconductors.

Fabrication of functionally graded materials between P21 tool steel and Cu by using laser aided layered manufacturing

Energy Technology Data Exchange (ETDEWEB)

Jeong, Jong Seol; Shin, Ki Hoon [Seoul Nat' l Univ., Seoul (Korea, Republic of)

2013-01-15

With the development of layered manufacturing, thermally conductive molds or molds embedding conformal cooling channels can be directly fabricated. Although P21 tool steel is widely used as a mold material because of its dimensional stability, it is not efficient for cooling molds owing to its low thermal conductivity. Hence, the use of functionally graded materials (FGMs) between P21 and Cu may circumvent a tradeoff between the strength and the heat transfer rate. As a preliminary study for the layered manufacturing of thermally conductive molds having FGM structures, one dimensional P21 Cu FGMs were fabricated by using laser aided direct metal tooling (DMT), and then, material properties such as the thermal conductivity and specific heat that are related to the heat transfer were measured and analyzed.

Heat Exchangers for Utilization of the Heat of High-Temperature Geothermal Brines

Science.gov (United States)

Alkhasov, A. B.; Alkhasova, D. A.

2018-03-01

The basic component of two-circuit geothermal systems is the heat exchanger. When used in geothermal power systems, conventional shell-and-tube and plate heat exchangers cause problems related to the cleaning of the latter from salt-deposition and corrosion products. Their lifetime does not exceed, as a rule, 1 year. To utilize the heat of high-temperature geothermal brines, a heat exchanger of the "tube-in-tube" type is proposed. A heat exchanger of this design has been operated for several years in Ternair geothermal steam field; in this heat exchanger, the thermal potential of the saline thermal water is transferred to the fresh water of the secondary circuit of the heating system for apartment houses. The reduction in the weight and size characteristics of the heat exchangers is a topical problem that can be solved with the help of heat transfer enhancers. To enhance the heat transfer process in the heat exchanger, longitudinal ribbing of the heat exchange surface is proposed. The increase in the heat exchange surface from the heat carrier side by ribbing results in an increase in the amount of the heat transferred from the heating agent. The heat exchanger is easy to manufacture and is assembled out of components comprised of two concentrically positioned tubes of a definite length, 3-6 m, serially connected with each other. The method for calculation of the impact of the number and the size of the longitudinal ribs on the heat transfer in the well heat exchanger is presented and a criterion for the selection of the optimal number and design parameters of the ribs is formulated. To prevent the corrosion and salt deposition in the heat exchanger, the use of an effective OEDFK (oxyethylidenediphosphonic acid) agent is proposed. This agent has a long-lasting corrosion-inhibiting and antiscaling effect, which is explained by the formation of a strongly adhesive chelate layer difficult to wash off the surface. The passivating OEDFK layer is restored by periodical

Diamond electrophoretic microchips-Joule heating effects

International Nuclear Information System (INIS)

Karczemska, Anna T.; Witkowski, Dariusz; Ralchenko, Victor; Bolshakov, Andrey; Sovyk, Dmitry; Lysko, Jan M.; Fijalkowski, Mateusz; Bodzenta, Jerzy; Hassard, John

2011-01-01

Microchip electrophoresis (MCE) has become a mature separation technique in the recent years. In the presented research, a polycrystalline diamond electrophoretic microchip was manufactured with a microwave plasma chemical vapour deposition (MPCVD) method. A replica technique (mould method) was used to manufacture microstructures in diamond. A numerical analysis with CoventorWare TM was used to compare thermal properties during chip electrophoresis of diamond and glass microchips of the same geometries. Temperature distributions in microchips were demonstrated. Thermal, electrical, optical, chemical and mechanical parameters of the polycrystalline diamond layers are advantageous over traditionally used materials for microfluidic devices. Especially, a very high thermal conductivity coefficient gives a possibility of very efficient dissipation of Joule heat from the diamond electrophoretic microchip. This enables manufacturing of a new generation of microdevices.

Diamond electrophoretic microchips-Joule heating effects

Energy Technology Data Exchange (ETDEWEB)

Karczemska, Anna T., E-mail: anna.karczemska@p.lodz.pl [Technical University of Lodz, Institute of Turbomachinery, 219/223 Wolczanska str., Lodz (Poland); Witkowski, Dariusz [Technical University of Lodz, Institute of Turbomachinery, 219/223 Wolczanska str., Lodz (Poland); Ralchenko, Victor, E-mail: ralchenko@nsc.gpi.ru [General Physics Institute, Russian Academy of Science, 38 Vavilov str., Moscow (Russian Federation); Bolshakov, Andrey; Sovyk, Dmitry [General Physics Institute, Russian Academy of Science, 38 Vavilov str., Moscow (Russian Federation); Lysko, Jan M., E-mail: jmlysko@ite.waw.pl [Institute of Electron Technology, Al. Lotnikow 32/46, 02-668 Warsaw (Poland); Fijalkowski, Mateusz, E-mail: petr.louda@vslib.cz [Technical University of Liberec, Faculty of Mechanical Engineering (Czech Republic); Bodzenta, Jerzy, E-mail: jerzy.bodzenta@polsl.pl [Silesian University of Technology, Institute of Physics, 2 Krzywoustego str., 44-100 Gliwice (Poland); Hassard, John, E-mail: j.hassard@imperial.ac.uk [Imperial College of Science, Technology and Medicine, London (United Kingdom)

2011-03-15

Microchip electrophoresis (MCE) has become a mature separation technique in the recent years. In the presented research, a polycrystalline diamond electrophoretic microchip was manufactured with a microwave plasma chemical vapour deposition (MPCVD) method. A replica technique (mould method) was used to manufacture microstructures in diamond. A numerical analysis with CoventorWare{sup TM} was used to compare thermal properties during chip electrophoresis of diamond and glass microchips of the same geometries. Temperature distributions in microchips were demonstrated. Thermal, electrical, optical, chemical and mechanical parameters of the polycrystalline diamond layers are advantageous over traditionally used materials for microfluidic devices. Especially, a very high thermal conductivity coefficient gives a possibility of very efficient dissipation of Joule heat from the diamond electrophoretic microchip. This enables manufacturing of a new generation of microdevices.

Manufacturing method for intragranular stress corrosion cracking-induced test specimen for stainless steel pipeline

International Nuclear Information System (INIS)

Futagawa, Kiyoshi.

1994-01-01

In a manufacturing step for intragranular stress corrosion cracking-induced for stainless steel pipelines, pipe are abutted against with each other and welded, and a heat affected portion is applied with a sensitizing heat treatment. Further, a crevice jig is attached near the heat affected portion at the inner surface of the pipe and kept in a chlorine ion added water under high temperature and high pressure at a predetermined period of time. If tap water is used instead of purified water for C.P.T. test in a step of forming sample of IGSCC (intergranular stress corrosion cracking), since the chlorine ion concentration in the tap water is relatively high, TGSCC (intragranular stress corrosion crackings caused in all of the samples. A heat input and an interlayer temperature are determined for the material of stainless pipe having a carbon content of more than 0.05% so that the welding residual stress on the inner surface is applied as tension. The condition for the heat treatment is determined as, for example, 500degC x 24hr, and the samples are kept under water at high temperature and high pressure applied with chlorine ions for 500 to 200hours. As a result, since samples of TGSCC can be formed by utilizing the manufacturing step for IGSCC, there is no requirement for providing devices for applying environmental factors separately. (N.H.)

Selection of engineering materials for heat exchangers (An expert system approach)

International Nuclear Information System (INIS)

Ahmed, K.; Abou-Ali, M.; Bassuni, M.

1997-01-01

The materials selection as a part of the design process of the heat exchangers is one of the most important steps in the whole industry. The clear recognition of the service requirements of the different types of the heat exchangers is very important to select the adequate and economic materials to meet such requirements. of course the manufacturer should ensure that failure does not occur in service specially it is one of the main and fetal component of the nuclear reactor, pressurized water type (PWR). It is necessary to know the possible mechanisms of failure. Also the achievement of the materials selection using the expert system approach in the process sequence of heat exchanger manufacturing is introduced. Different parameters and requirements controlling each process and the linkage between these parameters and the final product will be shown. 2 figs., 3 tabs

Work-related heat stress concerns in automotive industries: a case study from Chennai, India.

Science.gov (United States)

Ayyappan, Ramalingam; Sankar, Sambandam; Rajkumar, Paramasivan; Balakrishnan, Kalpana

2009-11-11

Work-related heat stress assessments, the quantification of thermal loads and their physiological consequences have mostly been performed in non-tropical developed country settings. In many developing countries (many of which are also tropical), limited attempts have been made to create detailed job-exposure profiles for various sectors. We present here a case study from Chennai in southern India that illustrates the prevalence of work-related heat stress in multiple processes of automotive industries and the efficacy of relatively simple controls in reducing prevalence of the risk through longitudinal assessments. We conducted workplace heat stress assessments in automotive and automotive parts manufacturing units according to the protocols recommended by NIOSH, USA. Sites for measurements included indoor locations with process-generated heat exposure, indoor locations without direct process-generated heat exposure and outdoor locations. Nearly 400 measurements of heat stress were made over a four-year period at more than 100 locations within eight units involved with automotive or automotive parts manufacturing in greater Chennai metropolitan area. In addition, cross-sectional measurements were made in select processes of glass manufacturing and textiles to estimate relative prevalence of heat stress. Results indicate that many processes even in organised large-scale industries have yet to control heat stress-related hazards adequately. Upwards of 28% of workers employed in multiple processes were at risk of heat stress-related health impairment in the sectors assessed. Implications of longitudinal baseline data for assessing efficacy of interventions as well as modelling potential future impacts from climate change (through contributions from worker health and productivity impairments consequent to increases in ambient temperature) are described. The study re-emphasises the need for recognising heat stress as an important occupational health risk in both formal

Two-phase pressure drop and flow visualization of FC-72 in a silicon microchannel heat sink

International Nuclear Information System (INIS)

Megahed, Ayman; Hassan, Ibrahim

2009-01-01

The rapid development of two-phase microfluidic devices has triggered the demand for a detailed understanding of the flow characteristics inside microchannel heat sinks to advance the cooling process of micro-electronics. The present study focuses on the experimental investigation of pressure drop characteristics and flow visualization of a two-phase flow in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 276 μm, width of 225 μm, and a length of 16 mm. Experiments are carried out for mass fluxes ranging from 341 to 531 kg/m 2 s and heat fluxes from 60.4 to 130.6 kW/m 2 using FC-72 as the working fluid. Bubble growth and flow regimes are observed using high speed visualization. Three major flow regimes are identified: bubbly, slug, and annular. The frictional two-phase pressure drop increases with exit quality for a constant mass flux. An assessment of various pressure drop correlations reported in the literature is conducted for validation. A new general correlation is developed to predict the two-phase pressure drop in microchannel heat sinks for five different refrigerants. The experimental pressure drops for laminar-liquid laminar-vapor and laminar-liquid turbulent-vapor flow conditions are predicted by the new correlation with mean absolute errors of 10.4% and 14.5%, respectively.

Manufacture of power station heat exchangers using modern production technology

International Nuclear Information System (INIS)

Genzlinger, W.; Hoffmann, J.; Ohlhaeuser, K.

1986-01-01

Heat exchangers of high quality and operational safety can only be fabricated economically if fabrication is as 'simple' as possible and can be controlled and if, through value analysis, the work flows can be mechanized and automated and the following requirements are met: use of materials that are easy to work with for the application considered, choice of product designs and wall thicknesses that offer favourable conditions for processing and non-destructive testing, placing of seams in such a way that good accessibility for welding and minimum residual welding stresses are assured, minimizing the number of welding seams, use of automatic welding machines for submerged-arc welding and electronically controlled sources of welding current - semi-automatic equipment for spatter-free interfaces (pulse technique), electronically controlled equipment for welding in rollers and pipes and CNC-controlled machining centres for drilling pipe galleries (deep-hole drilling) and baffle plates and for machining the sealing elements after welding. Continuous inspections in each phase of fabrication assures that heat exchangers are made which fully meet the requirements of nuclear power station operators. (orig.)

A study on heat transfer enhancement using flow channel inserts for thermoelectric power generation

International Nuclear Information System (INIS)

Lesage, Frédéric J.; Sempels, Éric V.; Lalande-Bertrand, Nathaniel

2013-01-01

Highlights: • Thermal enhancement in a thermoelectric liquid generator is tested. • Thermal enhancement is brought upon by flow impeding inserts. • CFD simulations attribute thermal enhancement to velocity field alterations. • Thermoelectric power enhancement is measured and discussed. • Power enhancement relative to adverse pressure drop is investigated. - Abstract: Thermoelectric power production has many potential applications that range from microelectronics heat management to large scale industrial waste-heat recovery. A low thermoelectric conversion efficiency of the current state of the art prevents wide spread use of thermoelectric modules. The difficulties lie in material conversion efficiency, module design, and thermal system management. The present study investigates thermoelectric power improvement due to heat transfer enhancement at the channel walls of a liquid-to-liquid thermoelectric generator brought upon by flow turbulating inserts. Care is taken to measure the adverse pressure drop due to the presence of flow impeding obstacles in order to measure the net thermoelectric power enhancement relative to an absence of inserts. The results illustrate the power enhancement performance of three different geometric forms fitted into the channels of a thermoelectric generator. Spiral inserts are shown to offer a minimal improvement in thermoelectric power production whereas inserts with protruding panels are shown to be the most effective. Measurements of the thermal enhancement factor which represents the ratio of heat flux into heat flux out of a channel and numerical simulations of the internal flow velocity field attribute the thermal enhancement resulting in the thermoelectric power improvement to thermal and velocity field synergy

Manufacturing method for radioactive material containing vessel

International Nuclear Information System (INIS)

Nishioka, Hideharu; Matsushita, Kazuo; Toyota, Michinori.

1997-01-01

Lead homogenization is applied on the inner surface of a space formed between an inner cylinder and an outer cylinder, and a molten lead heated to about 400 to 500degC is cast into a space formed between the inner cylinder and the outer cylinder in a state where the inner and the outer cylinders are heated to from 200 to 300degC. The space formed between the inner cylinder and the outer cylinder is heated to and kept at 330degC or higher for at least 2minutes after the casting of the molten lead, and then it is cooled. Thus, lowering of density of the molten lead due to excess elevation of temperature or dropping of the lead at the homogenization portion by heating the inner and the outer cylinders to an excessively high temperature are not caused. In addition, formation of gaps in the boundary between the inner cylinder and the outer cylinder or between the lead of the homogenized portion and that of the cast portion due to the melting of the lead of the homogenized portion in the space is prevented reliably thereby capable of forming a satisfactory shielding member. Then, even when the thickness of the inner cylinder and the outer cylinder is large, radioactive material containing vessel excellent in heat releasing property and radiation shielding property can be manufactured. (N.H.)

Pre-Brazed Casting and Hot Radial Pressing: A Reliable Process for the Manufacturing of CFC and W Monoblock Mockups

International Nuclear Information System (INIS)

Visca, E.; Libera, S.; Mancini, A.; Mazzone, G.; Pizzuto, A.; Testani, C.

2006-01-01

ENEA association is involved in the European International Thermonuclear Experimental Reactor (ITER) R-and-D activities and in particular for the manufacturing of high heat flux plasma-facing components (HHFC), such as the divertor targets, the baffles and the limiters: During the last years ENEA has manufactured actively cooled mock-ups by using different technologies, namely brazing, diffusion bonding and hot isostatic pressing (HIPping). A new manufacturing process has been set up and tested. It was successfully applied for the manufacturing of W armoured monoblock mockups. This technique is the HRP (Hot Radial Pressing) based on performing a radial diffusion bonding between the cooling tube and the armour tile by pressurizing only the internal tube and by keeping the joining zone in vacuum and at the required bonding temperature. The heating is obtained by a standard air furnace. The next step was to apply the HRP technique for the manufacturing of CFC armoured monoblock components. For this purpose some issues have to be solved like as the low CFC tensile strength, the pure copper interlayer between the heat sink and the armour necessary to mitigate the stress at the joint interface and the low wettability of the pure copper on the CFC matrix. This paper reports the research path followed to manufacture a medium scale vertical target CFC and W armoured mockup by HRP. An ad hoc rig able to maintain the CFC in a compressive constant condition was also designed and tested. The casting of a soft copper interlayer between the tube and the tile was performed by a new technique: the Pre-Brazed Casting (PBC, ENEA patent). Some mock-ups with three NB31 CFC tiles were successfully manufactured and tested to thermal fatigue using electron beam facilities. They all reached at least 1000 cycles at 20 MW/m 2 without suffering any damage. The manufactured medium scale vertical target mock-up is now under testing at the FE2000 (France) facility. (author)

Enhancement of microelectronic device performances by photothermal annealing under SiCl4 ambient

International Nuclear Information System (INIS)

Hassen, M.; Ben Jaballah, A.; Hajji, M.; Ezzaouia, H.

2006-01-01

The use of low cost silicon wafers seems to be very attractive for photovoltaic and microelectronic devices. However, this material is widely contaminated by different impurities particularly transitions metals, which deteriorate the lifetimes and the bulk diffusion lengths of the minority charge carriers. One possible way to overcome this undesirable behavior is to include an efficient purification technique in the process of device fabrication. In this work, we present the effect of photothermal treatments of monocrystalline Czochralski silicon substrates under SiCl 4 /N 2 atmosphere using a thin sacrificial porous silicon layer. The main results show a decrease of the resistivity over 40 μm depth. The Hall mobility of the majority charge carriers is improved from 300 to 1417 cm 2 V -1 s -1 . The capacitance-voltage (C-V) characteristics of metal/SiO 2 /Si (MIS) structures indicate a decrease of carrier concentration which confirms the results obtained by Hall Effect and Van Der Pauw method. The reduction of boron concentration in Czochralski silicon may reduce boron- and oxygen related metastable defect centers

Effect of an Intermediate Heat-treatment on a Change of the Corrosion Resistance and Hardness of a HANA-4 Outer Strip

International Nuclear Information System (INIS)

Lee, Myung Ho; Jung, Yang Il; Park, Sang Yoon; Choi, Byoung Kwon; Park, Jeong Yong; Jeong, Yong Hwan; Eom, Kyong Bo; Park, Nam Gyu; Lim, Yoon Soo

2008-01-01

KAERI (Korea Atomic Energy Research Institute) in collaboration with KNF (Korea Nuclear Fuel) undertook some researches on the applicability of HANA-4 and HANA-6 alloys for the spacer grid for a PWR (Pressurized Water Reactor) nuclear fuel. As a part of the research, KAERI studied the effect of the final heat-treatment on the mechanical and corrosion properties of a HANA-4 inner strip. The strip was manufactured with a sheet which had been intermediately heat-treated at about 580 .deg. C for 2.5-4 hours after each cold rolling before being processed into the final strip product. It was mentioned that the process with the intermediate heat treatment needed reviewing to establish an improved manufacturing process for the cold rolling. So, this work tried to check the effect of an intermediate heat-treatment on the properties of a HANA-4 strip using a specimen that was taken from a second hot rolled material before a cold-rolling. The manufacturing processes, with three different kinds of annealings, were introduced to investigate the applicable intermediate heat-treatment process. After all the cold-rolling processes, the Vickers hardness was measured for the final annealed specimens and 60 days of corrosion tests were carried out to check on the effect of the intermediate heat-treatment. Finally, an appropriate intermediate heat-treatment was proposed to improve the manufacturability of the HANA-4 strip

Manufacturing wizardry : products to tame heat, cold, deserts, swamps and underground infernos

International Nuclear Information System (INIS)

Jaremko, G.

1997-01-01

Some examples of Canadian oil and natural gas service equipment are cited as examples of exportable Canadian know-how. Foremosts are Canadian made, all terrain vehicles, designed to work in rugged terrain. Calgary-based Foremost Industries Inc., has sold several of their industrial vehicles for the Taklamakan, the high desert in the Tarim Basin of northwestern China. The huge vehicles with monster tires can haul up to 70 tonnes of material and leave very little or no mark on the wilderness. Foremost Industries Inc. is also an international corporation with branches in Nevada and Indiana. Their success stems from the fact that they were able to develop a vehicle for well drilling that would withstand the rough terrain and extreme climate conditions across western and northern Canada. Atco, a Calgary-based company, has developed quality portable housing to shelter surveyors, geologists, and drilling-rig crews. Another company, Reynolds Manufacturing, has developed safety clothing for workers in the oil industry. Canadian Oilfield Rigs and Equipment Fabrication Inc., manufacture volume production technology packages such as wireline data recording vehicles and well-service rigs, sold in markets from Algeria to Venezuela. 5 figs

IR-laser assisted additive freeform optics manufacturing.

Science.gov (United States)

Hong, Zhihan; Liang, Rongguang

2017-08-02

Computer-controlled additive manufacturing (AM) processes, also known as three-dimensional (3D) printing, create 3D objects by the successive adding of a material or materials. While there have been tremendous developments in AM, the 3D printing of optics is lagging due to the limits in materials and tight requirements for optical applicaitons. We propose a new precision additive freeform optics manufacturing (AFOM) method using an pulsed infrared (IR) laser. Compared to ultraviolet (UV) curable materials, thermally curable optical silicones have a number of advantages, such as strong UV stability, non-yellowing, and high transmission, making it particularly suitable for optical applications. Pulsed IR laser radiation offers a distinct advantage in processing optical silicones, as the high peak intensity achieved in the focal region allows for curing the material quickly, while the brief duration of the laser-material interaction creates a negligible heat-affected zone.

Heat pipes

CERN Document Server

Dunn, Peter D

1982-01-01

A comprehensive, up-to-date coverage of the theory, design and manufacture of heat pipes and their applications. This latest edition has been thoroughly revised, up-dated and expanded to give an in-depth coverage of the new developments in the field. Significant new material has been added to all the chapters and the applications section has been totally rewritten to ensure that topical and important applications are appropriately emphasised. The bibliography has been considerably enlarged to incorporate much valuable new information. Thus readers of the previous edition, which has established

Design and Manufacture of a Novel LED Table Lamp with Flower Decoration

OpenAIRE

Tzer-Ming Jeng; Sheng-Chung Tzeng; Wei-Ting Hsu; Chia-Hung Chang; Yu-Xiang Huang

2014-01-01

This work involved the design and manufacture of a novel LED table lamp that provides for flower decoration. It is a combination of a normal LED table lamp and attachments holding flower arrangement frogs. In this application the frogs, as used for traditional flower arrangements, became heat sinks for the LED units. They are made of an aluminum alloy to give good heat transfer and dissipation. In any case since they are fixed to the unit they do not need to be very heavy. The design features...

High heat flux actively cooled plasma facing components development, realization and first results in Tore Supra

Energy Technology Data Exchange (ETDEWEB)

Grosman, A. [Association Euratom-CEA, Centre d' Etudes de Cadarache, 13 - Saint-Paul-lez-Durance (France). Dept. de Recherches sur la Fusion Controlee

2004-07-01

The development, design, manufacture and testing of actively cooled high heat flux plasma facing components (PFC) has been an essential stage towards long powerful tokamak operations for Tore-Supra, it lasted about 10 years. This paper deals with the toroidal pumped limiter (TPL) that is able to sustain up to 10 MW/m{sup 2} of nominal heat flux. This device is based on hardened copper alloy heat sink structures covered by a carbon fiber composite armour, it resulted in the manufacturing of 600 elementary components, called finger elements, to achieve the 7.6 m{sup 2} TPL. This assembly has been operating in Tore-Supra since spring 2002. Some difficulties occurred during the manufacturing phase, the valuable industrial experience is summarized in the section 2. The permanent monitoring of PFC surface temperature all along the discharge is performed by a set of 6 actively cooled infrared endoscopes. The heat flux monitoring and control issue but also the progress made in our understanding of the deuterium retention in long discharges are described in the section 3. (A.C.)

High heat flux actively cooled plasma facing components development, realization and first results in Tore Supra

International Nuclear Information System (INIS)

Grosman, A.

2004-01-01

The development, design, manufacture and testing of actively cooled high heat flux plasma facing components (PFC) has been an essential stage towards long powerful tokamak operations for Tore-Supra, it lasted about 10 years. This paper deals with the toroidal pumped limiter (TPL) that is able to sustain up to 10 MW/m 2 of nominal heat flux. This device is based on hardened copper alloy heat sink structures covered by a carbon fiber composite armour, it resulted in the manufacturing of 600 elementary components, called finger elements, to achieve the 7.6 m 2 TPL. This assembly has been operating in Tore-Supra since spring 2002. Some difficulties occurred during the manufacturing phase, the valuable industrial experience is summarized in the section 2. The permanent monitoring of PFC surface temperature all along the discharge is performed by a set of 6 actively cooled infrared endoscopes. The heat flux monitoring and control issue but also the progress made in our understanding of the deuterium retention in long discharges are described in the section 3. (A.C.)

Solar heating and cooling system installed at RKL Controls Company, Lumberton, New Jersey. Final report

Energy Technology Data Exchange (ETDEWEB)

None

1981-03-01

Solar heating and cooling of a 40,000 square foot manufacturing building, sales offices and the solar computer control center/display room are described. Information on system description, test data, major problems and resolutions, performance, operation and maintenance manual, manufacturer's literature and as-built drawings are provided also. The solar system is composed of 6000 square feet of Sunworks double glazed flat plate collectors, external above ground storage subsystem, controls, ARKLA absorption chiller, heat recovery and a cooling tower.

Social manufacturing

OpenAIRE

Hamalainen, Markko; Karjalainen, Jesse

2017-01-01

New business models harnessing the power of individuals have already revolutionized service industries and digital content production. In this study, we investigate whether a similar phenomenon is taking place in manufacturing industries. We start by conceptually defining two distinct forms of firm-individual collaboration in manufacturing industries: (1) social cloud manufacturing, in which firms outsource manufacturing to individuals, and (2) social platform manufacturing, in which firms pr...

Manufacturability of Heat and Serve Ration in Institutional Pouch System Analysis

Science.gov (United States)

2006-09-01

This original scope of the project was to execute manufacturability studies on the ISP and develop a knowledge base that could be used to increase the...SHRIMP #10, DEHYD 8905-01-260-7475 2 X DHY AMER CHEESE 8910-00-823-6880 2 X DHY ONION #10 8915-00-128-1179 2 X CHOC CKIE MIX #10 8920-00...8920-00-935-3264 2 X CHOC ICING MX #10 8925-00-935-3260 2 X CHICKEN GRAVY MIX 8940-01-368-1615 2 x CHILI DHY #10 / 395-4611 8940-01-395

Miniaturized Air-to-Refrigerant Heat Exchangers

Energy Technology Data Exchange (ETDEWEB)

Radermacher, Reinhard [Univ. of Maryland, College Park, MD (United States); Bacellar, Daniel [Univ. of Maryland, College Park, MD (United States); Aute, Vikrant [Univ. of Maryland, College Park, MD (United States); Huang, Zhiwei [Univ. of Maryland, College Park, MD (United States); Hwang, Yunho [Univ. of Maryland, College Park, MD (United States); Ling, Jiazhen [Univ. of Maryland, College Park, MD (United States); Muehlbauer, Jan [Univ. of Maryland, College Park, MD (United States); Tancabel, James [Univ. of Maryland, College Park, MD (United States); Abdelaziz, Omar [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Zhang, Mingkan [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

2017-05-23

which met project requirements. Attempts to prototype a 10kW have presented unique manufacturing challenges, especially regarding tube blockages and structural stability. DP III comprised optimizing two-phase HX’s for a 3.0Ton capacity in a heat pump / air-conditioning unit for cooling mode application using R410A as the working fluid. The HX’s theoretically address the project requirements. System-level analysis showed the HX’s achieved up to 15% improvement in COP while also reducing overall unit charge by 30-40%. The project methodology was capable of developing HX’s which can outperform current state-of-the-art MCHX by at least 20% reduction in volume, material volume, and approach temperature. Additionally, the capability for optimization using refrigerant charge as an objective function was developed. The five-year manufacturing feasibility of the proposed HX’s was shown to have a good outlook. Successful prototyping through both conventional manufacturing methods and next generation methods such as additive manufacturing was achieved.

Solar heating and employment in Canada

Energy Technology Data Exchange (ETDEWEB)

Victor, P A

1978-01-01

If solar heating technology is to be introduced into sections of Canada as a way to alleviate unemployment problems and stimulate the manufacturing sector, realistic expectations must be grounded in better estimates of solar energy's potential than were made by early nuclear power enthusiasts. A study by Middleton Associates identified a number of factors affecting employment. These include implementation rates, choice of technologies, industry size, government involvement, location, and the share of solar heating relative to other heating sources. An employment simulation model using available technologies as inputs suggests that solar heating is feasible on the basis of both energy source and employment strategy. Model results are favorable for direct and indirect employment, while displacement effects on employment in conventional fuel industries are minor. Direct employment is affected more by implementation rates than by variations in the amount of imported equipment.

Out-of-autoclave manufacturing of a stiffened thermoplastic carbon fibre PEEK panel

Science.gov (United States)

Flanagan, M.; Goggins, J.; Doyle, A.; Weafer, B.; Ward, M.; Bizeul, M.; Canavan, R.; O'Bradaigh, C.; Doyle, K.; Harrison, N.

2017-10-01

Out-of-Autoclave manufacturing methods, specifically Automated Tape Placement (ATP) and induction welding, used in the fabrication of a stiffened thermoplastic demonstrator panel, are presented in this study. The demonstrator panel consists of two stiffeners induction welded to a flat skin, to form a typical load bearing aerospace sub-component. The skin of the panel is manufactured from uni-directional Carbon Fibre (CF) Polyetheretherkeytone (PEEK) using laser assisted Automated Tape Placement (ATP) and the stiffeners are press formed from woven CF-PEEK. The stiffeners are fusion bonded to the skin using a continuous induction welding process. A susceptor material is used at the interface to ensure the required heating is concentrated at the weldline. Microscopy was used to examine the manufactured coupons for defects. Destructive testing was carried out to evaluate the strength of the overall assembly. The work shows that assemblies manufactured using continuous induction welding and ATP are suitable for load bearing aerospace applications.

Heat loss from an open cavity

Energy Technology Data Exchange (ETDEWEB)

McDonald, C.G. [California State Polytechnic Univ., Pomona, CA (United States). Coll. of Engineering

1995-12-01

Cavity type receivers are used extensively in concentrating solar thermal energy collecting systems. The Solar Total Energy Project (STEP) in Shenandoah, Georgia is a large scale field test for the collection of solar thermal energy. The STEP experiment consists of a large field array of solar collectors used to supplement the process steam, cooling and other electrical power requirements of an adjacent knitwear manufacturing facility. The purpose of the tests, conducted for this study, was to isolate and quantify the radiative, conductive, and convective components of total heat loss, and to determine the effects of operating temperature, receiver angle, and aperture size on cavity heat loss. An analytical model for radiative heat loss was developed and compared with two other methods used to determine radiative heat loss. A proposed convective heat loss correlation, including effects of aperture size, receiver operating temperature, and receiver angle is presented. The resulting data is a source to evaluate the STEP measurements.

Enhanced additive manufacturing with a reciprocating platen

Science.gov (United States)

Lind, Randall F.; Blue, Craig A.; Love, Lonnie J.; Post, Brian K.; Lloyd, Peter D.

2018-02-06

An additive manufacturing extrusion head that includes a heated nozzle for accepting a feedstock and extruding the feedstock onto a substrate at a deposition plane, the nozzle having a longitudinal extrusion axis. A reciprocating platen surrounds the nozzle, the platen operable to reciprocate along the extrusion axis at or above the deposition plane as the nozzle extrudes feedstock onto the substrate; and wherein the platen flattens the extruded feedstock such that it does not protrude above the deposition plane as the extrusion head traverses over the substrate.

Manufacturing Competitiveness and Supply Chain Analyses for Hydrogen Refueling Stations

Energy Technology Data Exchange (ETDEWEB)

Mayyas, Ahmad T [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Garland, Nancy [U.S. Department of Energy

2018-04-27

This slide deck was presented in the monthly FCTO webinar series (May 2017). The goal of this presentation was to share our latest results and remarks on the manufacturing competitiveness analysis of the hydrogen refueling stations (HRS). Manufacturing cost models were developed for major systems in the HRS such as compressors, storage tanks, chillers, heat exchangers, and dispensers. In addition to the cost models, we also discussed important remarks from our analysis for the international trade flows and global supply chain for the hydrogen refueling stations. The last part of the presentation also highlights effect of economies of scale and high production volumes on lowering the cost of the hydrogen at the pump.

Manufacturing and microstructural characterization of sintered nickel wicks for capillary pumps

Directory of Open Access Journals (Sweden)

Eduardo Gonçalves Reimbrecht

1999-07-01

Full Text Available Sintered nickel powder is proposed to be used as porous wicks in heat pipes and capillary pumps. In this work the manufacturing procedure for tubular wicks for capillary pump application is discussed. The porosity, mechanical resistance and roundness of tubular wicks made of carbonila powder, atomized powder and a powder mixture of both are analyzed. A powder mixture was selected as the best raw material. In this case, pore size in the range of 2 to 24 mm and porosity about 50% were measured. First tests carried out in the laboratory, using acetone as the working fluid, show capillary pumping pressures up to 4 kPa and heat fluxes of about 1 W/cm2 in a two-phase heat transfer loop.

Morphology, microstructure, and hardness of titanium (Ti-6Al-4V) blocks deposited by wire-feed additive layer manufacturing (ALM)

International Nuclear Information System (INIS)

Brandl, Erhard; Schoberth, Achim; Leyens, Christoph

2012-01-01

Highlights: ► The microstructure and hardness of deposited Ti-6Al-4V blocks are investigated. ► Hardness is influenced by post heat treatment rather than by process parameters. ► Microstructure within the prior β-grains varies to some extent from grain to grain. ► A 600 °C/4 h treatment significantly increased the average hardness. - Abstract: Additive layer manufacturing offers a potential for time and cost savings, especially for aerospace components made from costly titanium alloys. In this paper, the morphology, microstructure, chemical composition, and hardness of additive manufactured Ti-6Al-4V blocks are investigated and discussed. Blocks (7 beads wide, 7 layers high) were deposited using Ti-6Al-4V wire and a Nd:YAG laser. Two different sets of parameters are used and three different post heat treatment conditions (as-built, 600 °C/4 h, 1200 °C/2 h) are investigated. The experiments reveal elementary properties of additive manufactured Ti-6Al-4V material in correlation to process parameters and heat treatments, which are discussed comprehensively.

FY 1988 Report on research and development of super heat pump energy accumulation system. Part 1; 1988 nendo super heat pump energy shuseki system no kenkyu kaihatsu seika hokokusho. 1

Energy Technology Data Exchange (ETDEWEB)

NONE

1989-11-01

Summarized in detail herein are the 1988 R and D results of the super high performance compression heat pumps and elementary equipment/media, for R and D of the super heat pump energy accumulation system. For R and D of the heat pumps, the R and D efforts are directed to manufacture, on a trial basis, and installation of the bench plant, and preparation of the basic plan for the pilot system for the highly efficient type (for heating only); to researches on the screw compressor, bench plant operation, heat exchanger, and so on for the highly efficient type (for cooling and heating); to development of the compressor with which a screw type expander is integrated at the low-temperature side, evaporator and so on, test runs of the bench plant, researches on the control methods, and so on for the high temperature type (utilization low temperature heat source); and to manufacture, on a trial basis, of the high-speed reciprocating compressor and steam supercharger, and tests for demonstrating their performance for the high temperature type (utilizing high temperature heat source). For R and D of the elementary equipment and working fluids, the R and D efforts are directed to the evaporator and EHD condenser for the mixed working fluids, heat exchanger, working fluids (alcohol-based and nonalcohol-based), and so on. (NEDO)

CFD Analysis of the Oscillating Flow within a Stirling Engine with an Additively Manufactured Foil Type Regenerator

Science.gov (United States)

Qiu, Songgang; Solomon, Laura

2017-11-01

The simplistic design, fuel independence, and robustness of Stirling convertors makes them the ideal choice for use in solar power and combined heat and power (CHP) applications. A lack of moving parts and the use of novel flexure bearings allows free-piston type Stirling engines to run in excess of ten years without degradation or maintenance. The key component to their overall efficiency is the regenerator. While a foil type regenerator outperforms a sintered random fiber regenerator, limitation in manufacturing and keeping uniform spacing between the foils has limited their overall use. However, with the advent of additive manufacturing, a robust foil type regenerator can be cheaply manufactured without traditional limitations. Currently, a CFD analysis of the oscillating internal flow within the novel design was conducted to evaluate the flow loses within the system. Particularly the pressure drop across the regenerator in comparison to a traditionally used random fiber regenerator. Additionally, the heat transfer and flow over the tubular heater hear was evaluated. The results of the investigation will be used to optimize the operation of the next generation of additively manufactured Stirling convertors. This research was supported by ARPA-E and West Virginia University.

Performance of Helical Coil Heat Recovery Exchanger using Nanofluid as Coolant

Directory of Open Access Journals (Sweden)

Navid Bozorgan

2015-07-01

Full Text Available Nanofluids are expected to be a promising coolant condidate in chemical processes for heat transfer system size reduction. This paper focuses on reducing the number of turns in a helical coil heat recovery exchanger with a given heat exchange capacity in a biomass heating plant using γ-Al2O3/n-decane nanofluid as coolant. The nanofluid flows through the tubes and the hot n-hexane flows through the shell. The numerical results show that using nanofluid as coolant in a helical coil heat exchanger can reduce the manufacturing cost of the heat exchanger and pumping power by reducing the number of turns of the coil.

Manufacturing and testing of a prototypical divertor vertical target for ITER

Energy Technology Data Exchange (ETDEWEB)

Merola, M. E-mail: merolam@ipp.mpg.de; Ploechl, L.; Chappuis, Ph.; Escourbiac, F.; Grattarola, M.; Smid, I.; Tivey, R.; Vieider, G

2000-12-01

After an extensive R and D activity, a medium-scale divertor vertical target prototype has been manufactured by the EU Home Team. This component contains all the main features of the corresponding ITER divertor design and consists of two units with one cooling channel each, assembled together and having an overall length and width of about 600 and 50 mm, respectively. The upper part of the prototype has a tungsten macro-brush armour, whereas the lower part is covered by CFC monoblocks. A number of joining techniques were required to manufacture this component as well as an appreciable effort in the development of suitable non-destructive testing methods. The component was high heat flux tested in FE200 electron beam facility at Le Creusot, France. It endured 100 cycles at 5 MW/m{sup 2}, 1000 cycles at 10 MW/m{sup 2} and more then 1000 cycles at 15-20 MW/m{sup 2}. The final critical heat flux test reached a value in excess of 30 MW/m{sup 2}.

Status of the beryllium tile bonding qualification activities for the manufacturing of the ITER first wall

International Nuclear Information System (INIS)

Mitteau, Raphaël; Eaton, R.; Perez, G.; Zacchia, F.; Banetta, S.; Bellin, B.; Gervash, A.; Glazunov, D.; Chen, J.

2015-01-01

The preparation of the manufacturing of the ITER first wall involves a qualification stage. The qualification aims at demonstrating that manufacturers can deliver the needed reliability and quality for the beryllium to copper bond, before the manufacturing can commence. The qualification is done on semi-prototype, containing relevant features relative to the beryllium armour (about 1/6 of the panel size). The qualification is done by the participating parties, firstly by a manufacturing semi-prototype and then by testing it under heat flux. One semi-prototype is manufactured and is being tested, and further from other manufacturers are still to come. The qualification programme is accompanied by bond defect investigations, which aim at defining defect acceptance criteria. Qualification and defect acceptance programme are supported by thermal and stress analyses, with good agreement regarding the thermal results, and some insights about the governing factors to bond damage.

Status of the beryllium tile bonding qualification activities for the manufacturing of the ITER first wall

Energy Technology Data Exchange (ETDEWEB)

Mitteau, Raphaël, E-mail: Raphael.mitteau@iter.org [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Eaton, R.; Perez, G. [ITER Organization, Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul Lez Durance Cedex (France); Zacchia, F.; Banetta, S.; Bellin, B. [Fusion for Energy, Josep Pla 2, Torres Diagonal Litoral B3, 08019 Barcelona (Spain); Gervash, A.; Glazunov, D. [Efremov Research Institute, 189631 St. Petersburg (Russian Federation); Chen, J. [Southwestern Institute of Physics, Huangjing Road, Chengdu 610225 (China)

2015-10-15

The preparation of the manufacturing of the ITER first wall involves a qualification stage. The qualification aims at demonstrating that manufacturers can deliver the needed reliability and quality for the beryllium to copper bond, before the manufacturing can commence. The qualification is done on semi-prototype, containing relevant features relative to the beryllium armour (about 1/6 of the panel size). The qualification is done by the participating parties, firstly by a manufacturing semi-prototype and then by testing it under heat flux. One semi-prototype is manufactured and is being tested, and further from other manufacturers are still to come. The qualification programme is accompanied by bond defect investigations, which aim at defining defect acceptance criteria. Qualification and defect acceptance programme are supported by thermal and stress analyses, with good agreement regarding the thermal results, and some insights about the governing factors to bond damage.

Rapid die manufacturing - high pressure casting of low volume non ferrous metals components

CSIR Research Space (South Africa)

Pereira, MFV

2006-11-01

Full Text Available .csir.co.za Models of assembled Die Slide 12 © CSIR 2006 www.csir.co.za 3. Die manufacture, assembly and data capturing 21.521.521.525.5total 4electrode 3Fitting3Fitting3Fitting3Fitting 2Polish2Polish2Polish2Polish 7SER 3F grind3F grind...3F grind4F grind Heat trHeat trHeat tr1Heat tr Jig boreJig boreJig boreJig bore GrindingGrindingGrinding2Grinding 13.5DMLS13.5DMLS13.5DMLS2.5Milling HrsCostProcessHrsCostProcessHrsCostProcessHrsCostProcess Core 4Core 3Core 2Core 1 NB. Times...

Polymeric hollow fiber heat exchanger as an automotive radiator

International Nuclear Information System (INIS)

Krásný, Ivo; Astrouski, Ilya; Raudenský, Miroslav

2016-01-01

Highlights: • Polymeric hollow fiber heat exchanger as an automotive radiator is proposed. • The mechanism of heat transfer (HT) relies on diameter of polymeric hollow fiber. • Grimson equation is sufficient for approximate prediction of the heat transfers. - Abstract: Nowadays, different automotive parts (tubing, covers, manifolds, etc.) are made of plastics because of their superior characteristics, low weight, chemical resistance, reasonable price and several other aspects. Manufacturing technologies are already well-established and the application of plastics is proven. Following this trend, the production of compact and light all-plastic radiators seems reasonable. Two plastic heat exchangers were manufactured based on polypropylene tubes of diameter 0.6 and 0.8 mm (so-called fibers) and tested. The heat transfer performance and pressure drops were studied with hot (60 °C) ethyleneglycol-water brine flowing inside the fibers and air (20 °C) outside because these conditions are conventional for car radiator operation. It was observed that heat transfer rates (up to 10.2 kW), overall heat transfer coefficients (up to 335 W/m"2 K), and pressure drops are competitive to conventional aluminium finned-tube radiators. Moreover, influence of fiber diameter was studied. It was observed that air-side convective coefficients rise with a decrease of fiber diameter. Air-side pressure drops of plastic prototypes were slightly higher than of aluminium radiator but it is expected that additional optimization will eliminate this drawback. Experimentally obtained air-side heat transfer coefficients were compared with the theoretical prediction using the Grimson equation and the Churchill and Bernstein approach. It was found that the Grimson equation is sufficient for approximate prediction of the outer HTCs and can be used for engineering calculations. Further work will concentrate on optimizing and developing a polymeric hollow fiber heat exchanger with reduced size

Temperature-independent resistor for microelectronic circuits

Science.gov (United States)

Aegerter, S.; Libby, W. F.

1970-01-01

Heat treating insulating crystals in gaseous hydrogen atmosphere produce resistive device which is temperature-independent from 77 to 295 degrees K. Increasing the concentration of hydrogen within the crystal yields semiconductor, hybrid, and metallic conduction characteristics which are combined with a depletion layer at the surface.

Computer simulation of electromigration in microelectronics interconnect

OpenAIRE

Zhu, Xiaoxin

2014-01-01

Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

Optimization of armour geometry and bonding techniques for tungsten-armoured high heat flux components

International Nuclear Information System (INIS)

Giniyatulin, R.N.; Komarov, V.L.; Kuzmin, E.G.; Makhankov, A.N.; Mazul, I.V.; Yablokov, N.A.; Zhuk, A.N.

2002-01-01

Joining of tungsten with copper-based cooling structure and armour geometry optimization are the major aspects in development of the tungsten-armoured plasma facing components (PFC). Fabrication techniques and high heat flux (HHF) tests of tungsten-armoured components have to reflect different PFC designs and acceptable manufacturing cost. The authors present the recent results of tungsten-armoured mock-ups development based on manufacturing and HHF tests. Two aspects were investigated--selection of armour geometry and examination of tungsten-copper bonding techniques. Brazing and casting tungsten-copper bonding techniques were used in small mock-ups. The mock-ups with armour tiles (20x5x10, 10x10x10, 20x20x10, 27x27x10) mm 3 in dimensions were tested by cyclic heat fluxes in the range of (5-20) MW/m 2 , the number of thermal cycles varied from hundreds to several thousands for each mock-up. The results of the tests show the applicability of different geometry and different bonding technique to corresponding heat loading. A medium-scale mock-up 0.6-m in length was manufactured and tested. HHF tests of the medium-scale mock-up have demonstrated the applicability of the applied bonding techniques and armour geometry for full-scale PFC's manufacturing

Standardization of rate of sugar addition for the manufacture of Thabdi.

Science.gov (United States)

Hirpara, Krupa B; Patel, H G; Prajapati, J P

2015-02-01

Traditional Indian Dairy Products are manufactured in India using an age old practice which varies from place to place. For manufacture of these products industrially, a standard formulation is required. Thabdi, a region specific, very popular heat desiccated milk product is one of such products which has not been studied scientifically. Sugar plays an important role in physico-chemical, sensory, textural characteristics and also the shelf life of any milk sweet. Hence for process standardization of Thabdi manufacture, different levels of sugar i.e. 4, 6, 8 and 10 (percent of milk) were studied so that an optimum level yielding best organoleptic characteristics in final product can be selected. The product was made from milk standardized to 0.66 Fat:SNF level and added with ghee @ 1.2 % of milk at the time of colour and texture development stage as selected from the earlier phase of study. Based on the results obtained, a level of 8 % sugar addition on the milk basis at the time of manufacture has been selected to have full taste and sensory attributes.

Low-cost small scale parabolic trough collector design for manufacturing and deployment in Africa

Science.gov (United States)

Orosz, Matthew; Mathaha, Paul; Tsiu, Anadola; Taele, B. M.; Mabea, Lengeta; Ntee, Marcel; Khakanyo, Makoanyane; Teker, Tamer; Stephens, Jordan; Mueller, Amy

2016-05-01

Concentrating Solar Power is expanding its deployment on the African subcontinent, highlighting the importance of efforts to indigenize manufacturing of this technology to increase local content and therefore local economic benefits of these projects. In this study a design for manufacturing (DFM) exercise was conducted to create a locally produced parabolic trough collector (the G4 PTC). All parts were sourced or fabricated at a production facility in Lesotho, and several examples of the design were prototyped and tested with collaborators in the Government of Lesotho's Appropriate Technology Services division and the National University of Lesotho. Optical and thermal performance was simulated and experimentally validated, and pedagogical pre-commercial versions of the PTC have been distributed to higher education partners in Lesotho and Europe. The cost to produce the PTC is 180 USD/m2 for a locally manufactured heat collection element (HCE) capable of sustaining 250C operation at ~65% efficiency. A version with an imported evacuated HCE can operate at 300°C with 70% efficiency. Economically relevant applications for this locally produced PTC include industrial process heat and distributed generation scenarios where cogeneration is required.

Mock-up qualification and prototype manufacture for ITER current leads

Energy Technology Data Exchange (ETDEWEB)

Zhou, Tingzhi, E-mail: tingszhou@ipp.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei (China); Lu, Kun; Ran, Qingxiang; Ding, Kaizhong; Feng, Hansheng; Wu, Huan; Liu, Chenglian; Song, Yuntao [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei (China); Niu, Erwu [CNDA, Ministry of Science and Technology, Beijing (China); Bauer, Pierre; Devred, Arnaud [Magnet Division, ITER Organization, Cadarache (France)

2015-10-15

Highlights: • Vacuum brazing and electron beam welding qualification. • Machine and assembly strategy of fin type heat exchanger. • Soldering and joint resistance test of superconducting joint. • Pre-preg technology with vacuum bag on insulation. - Abstract: Three types of high temperature superconducting current leads (HTSCL) are designed to carry 68 kA, 55 kA or 10 kA to the ITER magnets. Before the supply of the HTS current lead series, the design and manufacturing process is qualified through mock-ups and prototypes. Seven mock-ups, representing the critical technologies of the current leads, were built and tested successfully in the Institute of Plasma Physics of the Chinese Academy of Sciences (ASIPP) in 2013. After the qualification some design features of the HTS leads were updated. This paper summarizes the qualification through mock-ups. In 2014 ASIPP started the manufacture of the prototypes. The preparation and manufacturing process are also described.

A new application for food customization with additive manufacturing technologies

Science.gov (United States)

Serenó, L.; Vallicrosa, G.; Delgado, J.; Ciurana, J.

2012-04-01

Additive Manufacturing (AM) technologies have emerged as a freeform approach capable of producing almost any complete three dimensional (3D) objects from computer-aided design (CAD) data by successively adding material layer by layer. Despite the broad range of possibilities, commercial AM technologies remain complex and expensive, making them suitable only for niche applications. The developments of the Fab@Home system as an open AM technology discovered a new range of possibilities of processing different materials such as edible products. The main objective of this work is to analyze and optimize the manufacturing capacity of this system when producing 3D edible objects. A new heated syringe deposition tool was developed and several process parameters were optimized to adapt this technology to consumers' needs. The results revealed in this study show the potential of this system to produce customized edible objects without qualified personnel knowledge, therefore saving manufacturing costs compared to traditional technologies.

Pre-brazed casting and hot radial pressing: A reliable process for the manufacturing of CFC and W monoblock mock-ups

Energy Technology Data Exchange (ETDEWEB)

Visca, Eliseo [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, Via E. Fermi, 45, IT-00044 Frascati, RM (Italy)], E-mail: visca@frascati.enea.it; Libera, S.; Mancini, A.; Mazzone, G.; Pizzuto, A. [Associazione EURATOM-ENEA sulla Fusione, C.R. Frascati, Via E. Fermi, 45, IT-00044 Frascati, RM (Italy); Testani, C. [CSM S.p.A., IT-00128 Castel Romano, RM (Italy)

2007-10-15

ENEA is involved in the European International Thermonuclear Experimental Reactor (ITER) R and D activities and, in particular, for the manufacturing of high heat flux plasma-facing components (HHFC), such as the divertor targets, the baffles and the limiters. During last years, ENEA has manufactured actively cooled mock-ups by using different technologies, namely brazing, diffusion bonding and hot isostatic pressing (HIPping). A new manufacturing process has been set up and tested. It was successfully applied for the manufacturing of W armoured monoblock mock-ups. This technique is the HRP (hot radial pressing) based on performing a radial diffusion bonding between the cooling tube and the armour tile by pressurizing only internal tube and by keeping the joining zone in vacuum at the required bonding temperature. The heating is obtained by a standard air furnace. The HRP technique is now used for the manufacturing of CFC armoured monoblock components. For this purpose, some issues have to be faced, like the low CFC tensile strength, the pure copper interlayer between the heat sink and the armour necessary to mitigate the stress at the joint interface, and the low wettability of the pure copper on the CFC matrix. This paper reports the research path followed to manufacture a medium scale vertical target CFC and W armoured mock-up by HRP. A casting of a soft copper interlayer between the tube and the tile was obtained by a new technique: the pre-brazed casting (PBC, ENEA patent). Some preliminary mock-ups with three NB31 CFC tiles were successfully manufactured and tested to thermal fatigue using electron beam facilities. They all reached at least 1000 cycles at 20 MW/m{sup 2} without suffering any damage. The manufactured medium scale vertical target mock-up is now under testing at the FE2000 (France) facility. These activities were performed in the frame of ITER-EFDA contracts.

Welding of 3D-printed carbon nanotube–polymer composites by locally induced microwave heating

Science.gov (United States)