Sample records for global optical interconnects

  1. Optical interconnects

    Chen, Ray T


    This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

  2. Misalignment corrections in optical interconnects

    Song, Deqiang

    Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

  3. Nanophotonic Devices for Optical Interconnect

    Van Thourhout, D.; Spuesens, T.; Selvaraja, S.K.


    We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity...... of the passive routing circuits and their thermal tuning. Finally, we discuss the performance of a wavelength selective detector....

  4. Optical interconnect for large-scale systems

    Dress, William


    This paper presents a switchless, optical interconnect module that serves as a node in a network of identical distribution modules for large-scale systems. Thousands to millions of hosts or endpoints may be interconnected by a network of such modules, avoiding the need for multi-level switches. Several common network topologies are reviewed and their scaling properties assessed. The concept of message-flow routing is discussed in conjunction with the unique properties enabled by the optical distribution module where it is shown how top-down software control (global routing tables, spanning-tree algorithms) may be avoided.

  5. Integrated Optical Interconnect Architectures for Embedded Systems

    Nicolescu, Gabriela


    This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

  6. Optical Interconnects for Future Data Center Networks

    Bergman, Keren; Tomkos, Ioannis


    Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

  7. Comprehensive evaluation of global energy interconnection development index

    Liu, Lin; Zhang, Yi


    Under the background of building global energy interconnection and realizing green and low-carbon development, this article constructed the global energy interconnection development index system which based on the current situation of global energy interconnection development. Through using the entropy method for the weight analysis of global energy interconnection development index, and then using gray correlation method to analyze the selected countries, this article got the global energy interconnection development index ranking and level classification.

  8. Digital optical interconnects for photonic computing

    Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.


    A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

  9. Optical Interconnection Via Computer-Generated Holograms

    Liu, Hua-Kuang; Zhou, Shaomin


    Method of free-space optical interconnection developed for data-processing applications like parallel optical computing, neural-network computing, and switching in optical communication networks. In method, multiple optical connections between multiple sources of light in one array and multiple photodetectors in another array made via computer-generated holograms in electrically addressed spatial light modulators (ESLMs). Offers potential advantages of massive parallelism, high space-bandwidth product, high time-bandwidth product, low power consumption, low cross talk, and low time skew. Also offers advantage of programmability with flexibility of reconfiguration, including variation of strengths of optical connections in real time.

  10. Electro-optic techniques for VLSI interconnect

    Neff, J. A.


    A major limitation to achieving significant speed increases in very large scale integration (VLSI) lies in the metallic interconnects. They are costly not only from the charge transport standpoint but also from capacitive loading effects. The Defense Advanced Research Projects Agency, in pursuit of the fifth generation supercomputer, is investigating alternatives to the VLSI metallic interconnects, especially the use of optical techniques to transport the information either inter or intrachip. As the on chip performance of VLSI continues to improve via the scale down of the logic elements, the problems associated with transferring data off and onto the chip become more severe. The use of optical carriers to transfer the information within the computer is very appealing from several viewpoints. Besides the potential for gigabit propagation rates, the conversion from electronics to optics conveniently provides a decoupling of the various circuits from one another. Significant gains will also be realized in reducing cross talk between the metallic routings, and the interconnects need no longer be constrained to the plane of a thin film on the VLSI chip. In addition, optics can offer an increased programming flexibility for restructuring the interconnect network.

  11. Si micro photonics for optical interconnection

    Wada, K.; Ahn, D.H.; Lim, D.R.; Michel, J.; Kimerling, L.C.


    This paper reviews current status of silicon microphotonics and the recent prototype of on-chip optical interconnection. Si microphotonics pursues complementary metal oxide semiconductor (CMOS)-compatibility of photonic devices to reduce the materials diversity eventually to integrate on Si chips. Fractal optical H-trees have been implemented on a chip and found to be a technology breakthrough beyond metal interconnection. It has shown that large RC time constants associated with metal can be eliminated at least long distant data communication on a chip, and eventually improve yield and power issues. This has become the world's first electronic and photonic integrated circuits (EPICs) and the possibility of at least 10 GHz clocking for personal computers has been demonstrated

  12. Message Passing Framework for Globally Interconnected Clusters

    Hafeez, M; Riaz, N; Asghar, S; Malik, U A; Rehman, A


    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  13. Towards energy aware optical networks and interconnects

    Glesk, Ivan; Osadola, Tolulope; Idris, Siti


    In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

  14. Reconfigurable optical interconnection network for multimode optical fiber sensor arrays

    Chen, R. T.; Robinson, D.; Lu, H.; Wang, M. R.; Jannson, T.; Baumbick, R.


    A single-source, single-detector architecture has been developed to implement a reconfigurable optical interconnection network multimode optical fiber sensor arrays. The network was realized by integrating LiNbO3 electrooptic (EO) gratings working at the Raman Na regime and a massive fan-out waveguide hologram (WH) working at the Bragg regime onto a multimode glass waveguide. The glass waveguide utilized the whole substrate as a guiding medium. A 1-to-59 massive waveguide fan-out was demonstrated using a WH operating at 514 nm. Measured diffraction efficiency of 59 percent was experimentally confirmed. Reconfigurability of the interconnection was carried out by generating an EO grating through an externally applied electric field. Unlike conventional single-mode integrated optical devices, the guided mode demonstrated has an azimuthal symmetry in mode profile which is the same as that of a fiber mode.

  15. Optics vs copper: from the perspective of "Thunderbolt" interconnect technology

    Cheng, Hengju; Krause, Christine; Ko, Jamyuen; Gao, Miaobin; Liu, Guobin; Wu, Huichin; Qi, Mike; Lam, Chun-Chit


    Interconnect technology has been progressed at a very fast pace for the past decade. The signaling rates have steadily increased from 100:Mb/s to 25Gb/s. In every generation of interconnect technology evolution, optics always seems to take over at first, however, at the end, the cost advantage of copper wins over. Because of this, optical interconnects are limited to longer distance links where the attenuation in copper cable is too large for the integrated circuits to compensate. Optical interconnect has long been viewed as the premier solution in compared with copper interconnect. With the release of Thunderbolt technology, we are entering a new era in consumer electronics that runs at 10Gb/s line rate (20Gb/s throughput per connector interface). Thunderbolt interconnect technology includes both active copper cables and active optical cables as the transmission media which have very different physical characteristics. In order for optics to succeed in consumer electronics, several technology hurdles need to be cleared. For example, the optical cable needs to handle the consumer abuses such as pinch and bend. Also, the optical engine used in the active optical cable needs to be physically very small so that we don't change the looks and feels of the cable/connector. Most importantly, the cost of optics needs to come down significantly to effectively compete with the copper solution. Two interconnect technologies are compared and discussed on the relative cost, power consumption, form factor, density, and future scalability.

  16. Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

    Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)


    A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  17. Optical backplane interconnect switch for data processors and computers

    Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.


    An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

  18. Advanced Modulation Techniques for High-Performance Computing Optical Interconnects

    Karinou, Fotini; Borkowski, Robert; Zibar, Darko


    We experimentally assess the performance of a 64 × 64 optical switch fabric used for ns-speed optical cell switching in supercomputer optical interconnects. More specifically, we study four alternative modulation formats and detection schemes, namely, 10-Gb/s nonreturn-to-zero differential phase-...

  19. Free-Space Optical Interconnect Employing VCSEL Diodes

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi


    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  20. Optical interconnect technologies for high-bandwidth ICT systems

    Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki


    The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

  1. Ring-array processor distribution topology for optical interconnects

    Li, Yao; Ha, Berlin; Wang, Ting; Wang, Sunyu; Katz, A.; Lu, X. J.; Kanterakis, E.


    The existing linear and rectangular processor distribution topologies for optical interconnects, although promising in many respects, cannot solve problems such as clock skews, the lack of supporting elements for efficient optical implementation, etc. The use of a ring-array processor distribution topology, however, can overcome these problems. Here, a study of the ring-array topology is conducted with an aim of implementing various fast clock rate, high-performance, compact optical networks for digital electronic multiprocessor computers. Practical design issues are addressed. Some proof-of-principle experimental results are included.

  2. 32 x 16 CMOS smart pixel array for optical interconnects

    Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.


    Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

  3. 100 GHz Externally Modulated Laser for Optical Interconnects Applications

    Ozolins, Oskars; Pang, Xiaodan; Iglesias Olmedo, Miguel


    We report on a 116 Gb/s on-off keying (OOK), four pulse amplitude modulation (PAM) and 105-Gb/s 8-PAM optical transmitter using an InP-based integrated and packaged externally modulated laser for high-speed optical interconnects with up to 30 dB static extinction ratio and over 100-GHz 3-d......B bandwidth with 2 dB ripple. In addition, we study the tradeoff between power penalty and equalizer length to foresee transmission distances with standard single mode fiber....

  4. Optical interconnection networks for high-performance computing systems

    Biberman, Aleksandr; Bergman, Keren


    Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers. (review article)

  5. Integrated optoelectronic materials and circuits for optical interconnects

    Hutcheson, L.D.


    Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

  6. High-speed VCSEL-based optical interconnects

    Ishak, Waguih S.


    Vertical Cavity Surface Emitting Lasers (VCSEL) have made significant inroads into commercial realization especially in the area of data communications. Single VCSEL devices are key components in Gb Ethernet Transceivers. A multi-element VCSEL array is the key enabling technology for high-speed multi Gb/s parallel optical interconnect modules. In 1996, several companies introduced a new generation of fiber optic products based VCSEL technology such as multimode fiber transceivers for the ANSI Fiber Channel and Gigabit Ethernet IEEE 802.3 standards. VCSELs offer unique advantages over its edge-emitting counterparts in several areas. These include low-cost (LED-like) manufacturability, low current operation and array integrability. As data rates continue to increase, VCSELs offer the advantage of being able to provide the highest modulation bandwidth per milliamp of modulation current. Currently, most of the VCSEL-based products use short (780 - 980 nm) wavelength lasers. However, significant research efforts are taking place at universities and industrial research labs around the world to develop reliable, manufacturable and high-power long (1300 - 1550 nm) wavelength VCSELs. These lasers will allow longer (several km) transmission distances and will help alleviate some of the eye-safety issues. Perhaps, the most important advantage of VCSELs is the ability to form two-dimensional arrays much easier than in the case of edge-emitting lasers. These arrays (single and two-dimensional) will allow a whole new family of applications, specifically in very high-speed computer and switch interconnects.

  7. Optical Characteristics of a Multichannel Hybrid Integrated Light Source for Ultra-High-Bandwidth Optical Interconnections

    Takanori Shimizu


    Full Text Available The optical characteristics of a multi-channel hybrid integrated light source were described for an optical interconnection with a bandwidth of over 10 Tbit/s. The power uniformity of the relative intensity of a 1000-channel light source was shown, and the minimum standard deviation s of the optical power of the 200 output ports at each 25-channel laser diode (LD array was estimated to be 0.49 dB. This hybrid integrated light source is expected to be easily adaptable to a photonics-electronics convergence system for ultra-high-bandwidth interchip interconnections.

  8. The GIOD Project-Globally Interconnected Object Databases

    Bunn, J J; Newman, H B; Wilkinson, R P


    The GIOD (Globally Interconnected Object Databases) Project, a joint effort between Caltech and CERN, funded by Hewlett Packard Corporation, has investigated the use of WAN-distributed Object Databases and Mass Storage systems for LHC data. A prototype small- scale LHC data analysis center has been constructed using computing resources at Caltechs Centre for advanced Computing Research (CACR). These resources include a 256 CPU HP Exemplar of ~4600 SPECfp95, a 600 TByte High Performance Storage System (HPSS), and local/wide area links based on OC3 ATM. Using the exemplar, a large number of fully simulated CMS events were produced, and used to populate an object database with a complete schema for raw, reconstructed and analysis objects. The reconstruction software used for this task was based on early codes developed in preparation for the current CMS reconstruction program, ORCA. (6 refs).

  9. Multimode polymer waveguides for high-speed optical interconnects

    Bamiedakis, N.; Ingham, J. D.; Penty, R. V.; White, I. H.; DeGroot, J. V.; Clapp, T. V.


    Polymeric multimode waveguides are of particular interest for optical interconnections in short-reach data links. In some applications, for example in space-borne systems, the use of advanced materials with outstanding performance in extreme environments is required (temperature and radiation). In this paper therefore, we present novel siloxane polymers suitable for these applications. The materials are used to form straight, 90° bent and spiral polymer waveguides by low-cost conventional photolithographic techniques on FR4 substrates. The samples have been tested to investigate their propagation characteristics and demonstrate their potential for high-speed data links. Overall, there is strong evidence that these multimode waveguides can be successfully employed as high-speed short-reach data links. Their excellent thermal properties, their low cost and the simple fabrication process indicate their suitability for a wide range of space applications.

  10. Crosstalk in dynamic optical interconnects in photorefractive crystals

    Andersen, Peter E.; Petersen, Paul Michael; Buchhave, Preben


    We have investigated the crosstalk between two neighboring gratings in photorefractive Bi12SiO20 optical interconnects. The gratings are induced by the interference between one reference beam and two object beams. By applying a suitable phase shift in one of the object beams, we can selectively...... switch off one of the gratings. The crosstalk between the two gratings is experimentally determined from the diffraction efficiency in the remaining grating before and after applying the phase shift. The magnitude of the crosstalk is determined by the intensity ratio between the reference beam intensity...... and the object beam intensity. Crosstalk can be avoided by choosing a certain intensity ratio between the reference and the object beams....

  11. Global On-Chip Differential Interconnects with Optimally-Placed Twists

    Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria; Nauta, Bram


    Global on-chip communication is receiving quite some attention as global interconnects are rapidly becoming a speed, power and reliability bottleneck for digital CMOS systems. Recently, we proposed a bus-transceiver test chip in 0.13 μm CMOS using 10 mm long uninterrupted differential interconnects

  12. Printed polymer photonic devices for optical interconnect systems

    Subbaraman, Harish; Pan, Zeyu; Zhang, Cheng; Li, Qiaochu; Guo, L. J.; Chen, Ray T.


    Polymer photonic device fabrication usually relies on the utilization of clean-room processes, including photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which are expensive and are limited to areas as large as a wafer. Utilizing a novel and a scalable printing process involving ink-jet printing and imprinting, we have fabricated polymer based photonic interconnect components, such as electro-optic polymer based modulators and ring resonator switches, and thermo-optic polymer switch based delay networks and demonstrated their operation. Specifically, a modulator operating at 15MHz and a 2-bit delay network providing up to 35.4ps are presented. In this paper, we also discuss the manufacturing challenges that need to be overcome in order to make roll-to-roll manufacturing practically viable. We discuss a few manufacturing challenges, such as inspection and quality control, registration, and web control, that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. We have overcome these challenges, and currently utilizing our inhouse developed hardware and software tools, <10μm alignment accuracy at a 5m/min is demonstrated. Such a scalable roll-to-roll manufacturing scheme will enable the development of unique optoelectronic devices which can be used in a myriad of different applications, including communication, sensing, medicine, security, imaging, energy, lighting etc.

  13. New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response

    El-Sayed A. El-Badawy


    Full Text Available Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton. Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

  14. Holistic design in high-speed optical interconnects

    Saeedi, Saman

    Integrated circuit scaling has enabled a huge growth in processing capability, which necessitates a corresponding increase in inter-chip communication bandwidth. As bandwidth requirements for chip-to-chip interconnection scale, deficiencies of electrical channels become more apparent. Optical links present a viable alternative due to their low frequency-dependent loss and higher bandwidth density in the form of wavelength division multiplexing. As integrated photonics and bonding technologies are maturing, commercialization of hybrid-integrated optical links are becoming a reality. Increasing silicon integration leads to better performance in optical links but necessitates a corresponding co-design strategy in both electronics and photonics. In this light, holistic design of high-speed optical links with an in-depth understanding of photonics and state-of-the-art electronics brings their performance to unprecedented levels. This thesis presents developments in high-speed optical links by co-designing and co-integrating the primary elements of an optical link: receiver, transmitter, and clocking. In the first part of this thesis a 3D-integrated CMOS/Silicon-photonic receiver will be presented. The electronic chip features a novel design that employs a low-bandwidth TIA front-end, double-sampling and equalization through dynamic offset modulation. Measured results show -14.9dBm of sensitivity and energy eciency of 170fJ/b at 25Gb/s. The same receiver front-end is also used to implement source-synchronous 4-channel WDM-based parallel optical receiver. Quadrature ILO-based clocking is employed for synchronization and a novel frequency-tracking method that exploits the dynamics of IL in a quadrature ring oscillator to increase the effective locking range. An adaptive body-biasing circuit is designed to maintain the per-bit-energy consumption constant across wide data-rates. The prototype measurements indicate a record-low power consumption of 153fJ/b at 32Gb/s. The

  15. High Speed PAM -8 Optical Interconnects with Digital Equalization based on Neural Network

    Gaiarin, Simone; Pang, Xiaodan; Ozolins, Oskars


    We experimentally evaluate a high-speed optical interconnection link with neural network equalization. Enhanced equalization performances are shown comparing to standard linear FFE for an EML-based 32 GBd PAM-8 signal after 4-km SMF transmission.......We experimentally evaluate a high-speed optical interconnection link with neural network equalization. Enhanced equalization performances are shown comparing to standard linear FFE for an EML-based 32 GBd PAM-8 signal after 4-km SMF transmission....

  16. High-performance parallel processors based on star-coupled wavelength division multiplexing optical interconnects

    Deri, Robert J.; DeGroot, Anthony J.; Haigh, Ronald E.


    As the performance of individual elements within parallel processing systems increases, increased communication capability between distributed processor and memory elements is required. There is great interest in using fiber optics to improve interconnect communication beyond that attainable using electronic technology. Several groups have considered WDM, star-coupled optical interconnects. The invention uses a fiber optic transceiver to provide low latency, high bandwidth channels for such interconnects using a robust multimode fiber technology. Instruction-level simulation is used to quantify the bandwidth, latency, and concurrency required for such interconnects to scale to 256 nodes, each operating at 1 GFLOPS performance. Performance scales have been shown to .apprxeq.100 GFLOPS for scientific application kernels using a small number of wavelengths (8 to 32), only one wavelength received per node, and achievable optoelectronic bandwidth and latency.

  17. Novel Ethernet Based Optical Local Area Networks for Computer Interconnection

    Radovanovic, Igor; van Etten, Wim; Taniman, R.O.; Kleinkiskamp, Ronny


    In this paper we present new optical local area networks for fiber-to-the-desk application. Presented networks are expected to bring a solution for having optical fibers all the way to computers. To bring the overall implementation costs down we have based our networks on short-wavelength optical

  18. A low-cost, manufacturable method for fabricating capillary and optical fiber interconnects for microfluidic devices.

    Hartmann, Daniel M; Nevill, J Tanner; Pettigrew, Kenneth I; Votaw, Gregory; Kung, Pang-Jen; Crenshaw, Hugh C


    Microfluidic chips require connections to larger macroscopic components, such as light sources, light detectors, and reagent reservoirs. In this article, we present novel methods for integrating capillaries, optical fibers, and wires with the channels of microfluidic chips. The method consists of forming planar interconnect channels in microfluidic chips and inserting capillaries, optical fibers, or wires into these channels. UV light is manually directed onto the ends of the interconnects using a microscope. UV-curable glue is then allowed to wick to the end of the capillaries, fibers, or wires, where it is cured to form rigid, liquid-tight connections. In a variant of this technique, used with light-guiding capillaries and optical fibers, the UV light is directed into the capillaries or fibers, and the UV-glue is cured by the cone of light emerging from the end of each capillary or fiber. This technique is fully self-aligned, greatly improves both the quality and the manufacturability of the interconnects, and has the potential to enable the fabrication of interconnects in a fully automated fashion. Using these methods, including a semi-automated implementation of the second technique, over 10,000 interconnects have been formed in almost 2000 microfluidic chips made of a variety of rigid materials. The resulting interconnects withstand pressures up to at least 800psi, have unswept volumes estimated to be less than 10 femtoliters, and have dead volumes defined only by the length of the capillary.

  19. Four-port mode-selective silicon optical router for on-chip optical interconnect.

    Jia, Hao; Zhou, Ting; Fu, Xin; Ding, Jianfeng; Zhang, Lei; Yang, Lin


    We propose and demonstrate a four-port mode-selective optical router on a silicon-on-insulator platform. The passive routing property ensures that the router consumes no power to establish the optical links. For each port, input signals with different modes are selectively routed to the target ports through the pre-designed architecture. In general, the device intrinsically supports broadcasting of multiplexed signals from one port to the other three ports through mode division multiplexing. In some applications, the input signal from one port would only be sent to another port as in reconfigurable optical routers. The prototype is constructed by mode multiplexers/de-multiplexers and single-mode interconnect waveguides between them. The insertion losses for all optical links are lower than 8.0 dB, and the largest optical crosstalk values are lower than -18.7 dB and -22.0 dB for the broadcasting and port-to-port routing modes, respectively, at the wavelength range of 1525-1565 nm. In order to verify the routing functionality, a 40-Gbps bidirectional data transmission experiment is performed. The device offers a promising building block for passive routing by utilizing the dimension of the modes.

  20. Nonlinear optical properties of interconnected gold nanoparticles on silicon

    Lesuffleur, Antoine; Gogol, Philippe; Beauvillain, Pierre; Guizal, B.; Van Labeke, D.; Georges, P.


    We report second harmonic generation (SHG) measurements in reflectivity from chains of gold nanoparticles interconnected with metallic bridges. We measured more than 30 times a SHG enhancement when a surface plasmon resonance was excited in the chains of nanoparticles, which was influenced by coupling due to the electrical connectivity of the bridges. This enhancement was confirmed by rigorous coupled wave method calculations and came from high localization of the electric field at the bridge. The introduction of 10% random defects into the chains of nanoparticles dropped the SHG by a factor of 2 and was shown to be very sensitive to the fundamental wavelength.

  1. Optical pulse coupling in a photorefractive crystal, propagation of encoded pulses in an optical fiber, and phase conjugate optical interconnections

    Yao, X.S.


    In Part I, the author presents a theory to describe the interaction between short optical pulses in a photorefractive crystal. This theory provides an analytical framework for pulse coherence length measurements using a photorefractive crystal. The theory also predicts how a pulse changes its temporal shape due to its coupling with another pulse in a photorefractive crystal. The author describes experiments to demonstrate how photorefractive coupling alters the temporal shape and the frequency spectrum of an optical pulse. The author describes a compact optical field correlator. Using this correlator, the author measured the field cross-correlation function of optical pulses using a photorefractive crystal. The author presents a more sophisticated theory to describe the photorefractive coupling of optical pulses that are too short for the previous theory to be valid. In Part II of this dissertation, the author analyzes how the group-velocity dispersion and the optical nonlinearity of an optical fiber ruin an fiberoptic code-division multiple-access (CDMA) communication system. The author treats the optical fiber's nonlinear response with a novel approach and derives the pulse propagation equation. Through analysis and numerically simulations, the author obtains the maximum and the maximum allowed peak pulse power, as well as the minimum and the maximum allowed pulse width for the communication system to function properly. The author simulates how the relative misalignment between the encoding and the decoding masks affects the system's performance. In Part III the author demonstrates a novel optical interconnection device based on a mutually pumped phase conjugator. This device automatically routes light from selected information-sending channels to selected information-receiving channels, and vice versa. The phase conjugator eliminates the need for critical alignment. It is shown that a large number of optical channels can be interconnected using this

  2. Low-cost and high-capacity short-range optical interconnects using graded-index plastic optical fiber

    Tangdiongga, E.; Yang, H.; Lee, S.C.J.; Okonkwo, C.M.; Boom, van den H.P.A.; Randel, S.; Koonen, A.M.J.


    We demonstrate a transmission rate of 51.8 Gb/s over 100-meters of perfluorinated multimode graded-index plastic optical fiber using discrete multitone modulation. The results prove suitability of plastic fibers for low-cost high-capacity optical interconnects.

  3. Indium phosphide (InP) for optical interconnects

    Lebby, M.; Ristic, S.; Calabretta, N.; Stabile, R.; Tekin, T.; Pitwon, R.; Håkansson, A.; Pleros, N.


    We present InP as the incumbent technology for data center transceiver and switching optics. We review the most popular InP monolithic integration approaches in light of photonic integration being recognized as an increasingly important technology for data center optics. We present Multi-Guide

  4. Survivable resource orchestration for optically interconnected data center networks.

    Zhang, Qiong; She, Qingya; Zhu, Yi; Wang, Xi; Palacharla, Paparao; Sekiya, Motoyoshi


    We propose resource orchestration schemes in overlay networks enabled by optical network virtualization. Based on the information from underlying optical networks, our proposed schemes provision the fewest data centers to guarantee K-connect survivability, thus maintaining resource availability for cloud applications under any failure.

  5. Opto-VLSI-based reconfigurable free-space optical interconnects architecture

    Aljada, Muhsen; Alameh, Kamal; Chung, Il-Sug


    is the Opto-VLSI processor which can be driven by digital phase steering and multicasting holograms that reconfigure the optical interconnects between the input and output ports. The optical interconnects architecture is experimentally demonstrated at 2.5 Gbps using high-speed 1×3 VCSEL array and 1......×3 photoreceiver array in conjunction with two 1×4096 pixel Opto-VLSI processors. The minimisation of the crosstalk between the output ports is achieved by appropriately aligning the VCSEL and PD elements with respect to the Opto-VLSI processors and driving the latter with optimal steering phase holograms....

  6. Fast and Scalable Fabrication of Microscopic Optical Surfaces and its Application for Optical Interconnect Devices

    Summitt, Christopher Ryan

    The use of optical interconnects is a promising solution to the increasing demand for high speed mass data transmission used in integrated circuits as well as device to device data transfer applications. For the purpose, low cost polymer waveguides are a popular choice for routing signal between devices due to their compatibility with printed circuit boards. In optical interconnect, coupling from an external light source to such waveguides is a critical step, thus a variety of couplers have been investigated such as grating based couplers [1,2], evanescent couplers [3], and embedded mirrors [4-6]. These couplers are inherently micro-optical components which require fast and scalable fabrication for mass production with optical quality surfaces/structures. Low NA laser direct writing has been used for fast fabrication of structures such as gratings and Fresnel lenses using a linear laser direct writing scheme, though the length scale of such structures are an order of magnitude larger than the spot size of the focused laser of the tool. Nonlinear writing techniques such as with 2-photon absorption offer increased write resolution which makes it possible to fabricate sub-wavelength structures as well as having a flexibility in feature shape. However it does not allow a high speed fabrication and in general are not scalable due to limitations of speed and area induced by the tool's high NA optics. To overcome such limitations primarily imposed by NA, we propose a new micro-optic fabrication process which extends the capabilities of 1D, low NA, and thus fast and scalable, laser direct writing to fabricate a structure having a length scale close to the tool's spot size, for example, a mirror based and 45 degree optical coupler with optical surface quality. The newly developed process allows a high speed fabrication with a write speed of 2600 mm²/min by incorporating a mask based lithography method providing a blank structure which is critical to creating a 45 degree

  7. Polymer-based optical interconnects using nanoimprint lithography

    Boersma, A.; Wiegersma, S.; Offrein, B.J.; Duis, J.; Delis, J.; Ortsiefer, M.; Steenberge, G. van; Karpinen, M.; Blaaderen, A. van; Corbett, B.


    The increasing request for higher data speeds in the information and communication technology leads to continuously increasing performance of microprocessors. This has led to the introduction of optical data transmission as a replacement of electronic data transmission in most transmission

  8. Scalability analysis methodology for passive optical interconnects in data center networks using PAM

    Lin, R.; Szczerba, Krzysztof; Agrell, Erik; Wosinska, Lena; Tang, M.; Liu, D.; Chen, J.


    A framework is developed for modeling the fundamental impairments in optical datacenter interconnects, i.e., the power loss and the receiver noises. This framework makes it possible, to analyze the trade-offs between data rates, modulation order, and number of ports that can be supported in optical interconnect architectures, while guaranteeing that the required signal-to-noise ratios are satisfied. To the best of our knowledge, this important assessment methodology is not yet available. As a case study, the trade-offs are investigated for three coupler-based top-of-rack interconnect architectures, which suffer from serious insertion loss. The results show that using single-port transceivers with 10 GHz bandwidth, avalanche photodiode detectors, and quadratical pulse amplitude modulation, more than 500 ports can be supported.

  9. Multi-gigabit optical interconnects for next-generation on-board digital equipment

    Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques


    Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

  10. Multi-level single mode 2D polymer waveguide optical interconnects using nano-imprint lithography

    Khan, M.U.; Justice, J.; Petäjä, J.; Korhonen, T.; Boersma, A.; Wiegersma, S.; Karppinen, M.; Corbett, B.


    Single and multi-layer passive optical interconnects using single mode polymer waveguides are demonstrated using UV nano-imprint lithography. The fabrication tolerances associated with imprint lithography are investigated and we show a way to experimentally quantify a small variation in index

  11. Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects

    Vernoux, Christian; Chen, Yiting; Markey, Laurent


    We present the design, fabrication and characterization of long-range surface plasmon polariton waveguide arrays with materials, mainly silicones, carefully selected with the aim to be used as mechanically flexible single-mode optical interconnections, the socalled "plasmonic arc" working at 1.55μm...

  12. Open system LANs and their global interconnection electronics and communications reference series

    Houldsworth, Jack; Caves, Keith; Mazda, FF


    Open System LANs and Their Global Interconnection focuses on the OSI layer 1 to 4 standards (the OSI bearer service) and also introduces TCP/IP and some of the proprietary PC Local Area Network (LAN) standards.The publication first provides an introduction to Local Area Networks (LANs) and Wide Area Networks (WANs), Open Systems Interconnection (OSI), and LAN standards. Discussions focus on MAC bridging, token bus, slotted ring, MAC constraints and design considerations, OSI functional standards, OSI model, value of the transport model, benefits and origins of OSI, and significance of the tran

  13. CWDM for very-short-reach and optical-backplane interconnections

    Laha, Michael J.


    Course Wavelength Division Multiplexing (CWDM) provides access to next generation optical interconnect data rates by utilizing conventional electro-optical components that are widely available in the market today. This is achieved through the use of CWDM multiplexers and demultiplexers that integrate commodity type active components, lasers and photodiodes, into small optical subassemblies. In contrast to dense wavelength division multiplexing (DWDM), in which multiple serial data streams are combined to create aggregate data pipes perhaps 100s of gigabits wide, CWDM uses multiple laser sources contained in one module to create a serial equivalent data stream. For example, four 2.5 Gb/s lasers are multiplexed to create a 10 Gb/s data pipe. The advantages of CWDM over traditional serial optical interconnects include lower module power consumption, smaller packaging, and a superior electrical interface. This discussion will detail the concept of CWDM and design parameters that are considered when productizing a CWDM module into an industry standard optical interconnect. Additionally, a scalable parallel CWDM hybrid architecture will be described that allows the transport of large amounts of data from rack to rack in an economical fashion. This particular solution is targeted at solving optical backplane bottleneck problems predicted for the next generation terabit and petabit routers.

  14. Investigation and experimental validation of the contribution of optical interconnects in the SYMPHONIE massively parallel computer

    Scheer, Patrick


    Progress in microelectronics lead to electronic circuits which are increasingly integrated, with an operating frequency and an inputs/outputs count larger than the ones supported by printed circuit board and back-plane technologies. As a result, distributed systems with several boards cannot fully exploit the performance of integrated circuits. In synchronous parallel computers, the situation is worsen since the overall system performances rely on the efficiency of electrical interconnects between the integrated circuits which include the processing elements (PE). The study of a real parallel computer named SYMPHONIE shows for instance that the system operating frequency is far smaller than the capabilities of the microelectronics technology used for the PE implementation. Optical interconnections may cancel these limitations by providing more efficient connections between the PE. Especially, free-space optical interconnections based on vertical-cavity surface-emitting lasers (VCSEL), micro-lens and PIN photodiodes are compatible with the required features of the PE communications. Zero bias modulation of VCSEL with CMOS-compatible digital signals is studied and experimentally demonstrated. A model of the propagation of truncated gaussian beams through micro-lenses is developed. It is then used to optimise the geometry of the detection areas. A dedicated mechanical system is also proposed and implemented for integrating free-space optical interconnects in a standard electronic environment, representative of the one of parallel computer systems. A specially designed demonstrator provides the experimental validation of the above physical concepts. (author) [fr

  15. The CERN Host Interface and the optical interconnect

    McLaren, R.A.; Berners Lee, T.J.; Burckhart, D.


    Interfaces between Digital Equipment Corporation's VAX series computers and VMEbus and FASTBUS have been designed as part of the CERN Host Interface (CHI) project. Both the VMEbus and the FASTBUS interface share a common architecture which includes a powerful MC680x0 central processing unit, large data memories and a link port to connect to different members of the VAX family. Software support allows user software to be split between the VAX and the CHI processors whilst an enhanced VAX/VMS driver reduces operating system overheads. In addition an optical link allows the FASTBUS or VMEbus crate to be up to 1 kilometer from the host computer. (author). 12 refs, 3 diagrams

  16. Porous silicon based micro-opto-electro-mechanical-systems (MOEMS) components for free space optical interconnects

    Song, Da


    One of the major challenges confronting the current integrated circuits (IC) industry is the metal "interconnect bottleneck". To overcome this obstacle, free space optical interconnects (FSOIs) can be used to address the demand for high speed data transmission, multi-functionality and multi-dimensional integration for the next generation IC. One of the crucial elements in FSOIs system is to develop a high performance and flexible optical network to transform the incoming optical signal into a distributed set of optical signals whose direction, alignment and power can be independently controlled. Among all the optical materials for the realization of FSOI components, porous silicon (PSi) is one of the most promising candidates because of its unique optical properties, flexible fabrication methods and integration with conventional IC material sets. PSi-based Distributed Bragg Reflector (DBR) and Fabry-Perot (F-P) structures with unique optical properties are realized by electrochemical etching of silicon. By incorporating PSi optical structures with Micro-Opto-Electro-Mechanical-Systems (MOEMS), several components required for FSOI have been developed. The first type of component is the out-of-plane freestanding optical switch. Implementing a PSi DBR structure as an optically active region, the device can realize channel selection by changing the tilting angle of the micromirror supported by the thermal bimorph actuator. All the fabricated optical switches have reached kHz working frequency and life time of millions of cycles. The second type of component is the in-plane tunable optical filter. By introducing PSi F-P structure into the in-plane PSi film, a thermally tunable optical filter with a sensitivity of 7.9nm/V has been realized for add/drop optical signal selection. Also, for the first time, a new type of PSi based reconfigurable diffractive optical element (DOE) has been developed. By using patterned photoresist as a protective mask for electrochemical

  17. Optical interconnection network for parallel access to multi-rank memory in future computing systems.

    Wang, Kang; Gu, Huaxi; Yang, Yintang; Wang, Kun


    With the number of cores increasing, there is an emerging need for a high-bandwidth low-latency interconnection network, serving core-to-memory communication. In this paper, aiming at the goal of simultaneous access to multi-rank memory, we propose an optical interconnection network for core-to-memory communication. In the proposed network, the wavelength usage is delicately arranged so that cores can communicate with different ranks at the same time and broadcast for flow control can be achieved. A distributed memory controller architecture that works in a pipeline mode is also designed for efficient optical communication and transaction address processes. The scaling method and wavelength assignment for the proposed network are investigated. Compared with traditional electronic bus-based core-to-memory communication, the simulation results based on the PARSEC benchmark show that the bandwidth enhancement and latency reduction are apparent.

  18. Silicon photonic IC embedded optical-PCB for high-speed interconnect application

    Kallega, Rakshitha; Nambiar, Siddharth; Kumar, Abhai; Ranganath, Praveen; Selvaraja, Shankar Kumar


    Optical-Printed Circuit Board (PCB) is an emerging optical interconnect technology to bridge the gap between the board edge and the processing module. The technology so far has been used as a broadband transmitter using polymer waveguides in the PCB. In this paper, we report a Silicon Nitride based photonic IC embedded in the PCB along with the polymers as waveguides in the PCB. The motivation for such integration is to bring routing capability and to reduce the power loss due to broadcasting mode.

  19. Floating dielectric slab optical interconnection between metal-dielectric interface surface plasmon polariton waveguides.

    Kang, Minsu; Park, Junghyun; Lee, Il-Min; Lee, Byoungho


    A simple and effective optical interconnection which connects two distanced single metal-dielectric interface surface plasmon waveguides by a floating dielectric slab waveguide (slab bridge) is proposed. Transmission characteristics of the suggested structure are numerically studied using rigorous coupled wave analysis, and design rules based on the study are given. In the wave-guiding part, if the slab bridge can support more than the fundamental mode, then the transmission efficiency of the interconnection shows strong periodic dependency on the length of the bridge, due to the multi-mode interference (MMI) effect. Otherwise, only small fluctuation occurs due to the Fabry-Pérot effect. In addition, light beating happens when the slab bridge is relatively short. In the wave-coupling part, on the other hand, gap-assisted transmission occurs at each overlapping region as a consequence of mode hybridization. Periodic dependency on the length of the overlap region also appears due to the MMI effect. According to these results, we propose design principles for achieving both high transmission efficiency and stability with respect to the variation of the interconnection distance, and we show how to obtain the transmission efficiency of 68.3% for the 1mm-long interconnection.

  20. Ultra-precision fabrication of high density micro-optical backbone interconnections for data center and mobile application

    Lohmann, U.; Jahns, J.; Wagner, T.; Werner, C.


    A microoptical 3D interconnection scheme and fabricated samples of this fiberoptical multi-channel interconnec- tion with an actual capacity of 144 channels were shown. Additionally the aspects of micrometer-fabrication of such microoptical interconnection modules in the view of alignment-tolerances were considered. For the realiza- tion of the interconnection schemes, the approach of planar-integrated free space optics (PIFSO) is used with its well known advantages. This approach offers the potential for complex interconnectivity, and yet compact size.

  1. CATO: a CAD tool for intelligent design of optical networks and interconnects

    Chlamtac, Imrich; Ciesielski, Maciej; Fumagalli, Andrea F.; Ruszczyk, Chester; Wedzinga, Gosse


    Increasing communication speed requirements have created a great interest in very high speed optical and all-optical networks and interconnects. The design of these optical systems is a highly complex task, requiring the simultaneous optimization of various parts of the system, ranging from optical components' characteristics to access protocol techniques. Currently there are no computer aided design (CAD) tools on the market to support the interrelated design of all parts of optical communication systems, thus the designer has to rely on costly and time consuming testbed evaluations. The objective of the CATO (CAD tool for optical networks and interconnects) project is to develop a prototype of an intelligent CAD tool for the specification, design, simulation and optimization of optical communication networks. CATO allows the user to build an abstract, possible incomplete, model of the system, and determine its expected performance. Based on design constraints provided by the user, CATO will automatically complete an optimum design, using mathematical programming techniques, intelligent search methods and artificial intelligence (AI). Initial design and testing of a CATO prototype (CATO-1) has been completed recently. The objective was to prove the feasibility of combining AI techniques, simulation techniques, an optical device library and a graphical user interface into a flexible CAD tool for obtaining optimal communication network designs in terms of system cost and performance. CATO-1 is an experimental tool for designing packet-switching wavelength division multiplexing all-optical communication systems using a LAN/MAN ring topology as the underlying network. The two specific AI algorithms incorporated are simulated annealing and a genetic algorithm. CATO-1 finds the optimal number of transceivers for each network node, using an objective function that includes the cost of the devices and the overall system performance.

  2. Optical interconnects based on VCSELs and low-loss silicon photonics

    Aalto, Timo; Harjanne, Mikko; Karppinen, Mikko; Cherchi, Matteo; Sitomaniemi, Aila; Ollila, Jyrki; Malacarne, Antonio; Neumeyr, Christian


    Silicon photonics with micron-scale Si waveguides offers most of the benefits of submicron SOI technology while avoiding most of its limitations. In particular, thick silicon-on-insulator (SOI) waveguides offer 0.1 dB/cm propagation loss, polarization independency, broadband single-mode (SM) operation from 1.2 to >4 µm wavelength and ability to transmit high optical powers (>1 W). Here we describe the feasibility of Thick-SOI technology for advanced optical interconnects. With 12 μm SOI waveguides we demonstrate efficient coupling between standard single-mode fibers, vertical-cavity surface-emitting lasers (VCSELs) and photodetectors (PDs), as well as wavelength multiplexing in small footprint. Discrete VCSELs and PDs already support 28 Gb/s on-off keying (OOK), which shows a path towards 50-100 Gb/s bandwidth per wavelength by using more advanced modulation formats like PAM4. Directly modulated VCSELs enable very power-efficient optical interconnects for up to 40 km distance. Furthermore, with 3 μm SOI waveguides we demonstrate extremely dense and low-loss integration of numerous optical functions, such as multiplexers, filters, switches and delay lines. Also polarization independent and athermal operation is demonstrated. The latter is achieved by using short polymer waveguides to compensate for the thermo-optic effect in silicon. New concepts for isolator integration and polarization rotation are also explained.

  3. 8-dimensional lattice optimized formats in 25-GBaud/s VCSEL based IM/DD optical interconnections

    Lu, Xiaofeng; Tafur Monroy, Idelfonso


    Temporally combined 4- and 8-dimensional lattice grids optimized modulation formats for VCSEL based IM/DD short-reach optical inter-connections has been proposed and investigated numerically together with its conventional counterpart PAM-4. © 2015 OSA.......Temporally combined 4- and 8-dimensional lattice grids optimized modulation formats for VCSEL based IM/DD short-reach optical inter-connections has been proposed and investigated numerically together with its conventional counterpart PAM-4. © 2015 OSA....

  4. Three Dimensionally Interconnected Silicon Nanomembranes for Optical Phased Array (OPA) and Optical True Time Delay (TTD) Applications


    Joshi, C. Batten, Y. Kwon, S . Beamer, I Shamim , K. Asanovic, and V. Stojanovic, in NOCS 󈧍 Proceedings of the 2009 3rd ACM/IEEE international...Applications 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 6. AUTHOR( S ) 5d. PROJECT NUMBER 5e. TASK NUMBER 5f. WORK UNIT...NUMBER 7. PERFORMING ORGANIZATION NAME( S ) AND ADDRESS(ES) University of Texas,Microelectronic Research Center, Nanophotonics and Optical Interconnects

  5. Optical interconnection for a polymeric PLC device using simple positional alignment.

    Ryu, Jin Hwa; Kim, Po Jin; Cho, Cheon Soo; Lee, El-Hang; Kim, Chang-Seok; Jeong, Myung Yung


    This study proposes a simple cost-effective method of optical interconnection between a planar lightwave circuit (PLC) device chip and an optical fiber. It was conducted to minimize and overcome the coupling loss caused by lateral offset which is due to the process tolerance and the dimensional limitation existing between PLC device chips and fiber array blocks with groove structures. A PLC device chip and a fiber array block were simultaneously fabricated in a series of polymer replication processes using the original master. The dimensions (i.e., width and thickness) of the under-clad of the PLC device chip were identical to those of the fiber array block. The PLC device chip and optical fiber were aligned by simple positional control for the vertical direction of the PLC device chip under a particular condition. The insertion loss of the proposed 1 x 2 multimode optical splitter device interconnection was 4.0 dB at 850 nm and the coupling loss was below 0.1 dB compared with single-fiber based active alignment.

  6. Channel-Selectable Optical Link Based on a Silicon Microring for on-Chip Interconnection

    Qiu Chen; Hu Ting; Wang Wan-Jun; Yu Ping; Jiang Xiao-Qing; Yang Jian-Yi


    A channel-selectable optical link based on a silicon microring resonator is proposed and demonstrated. This optical link consists of the wavelength-tunable microring modulators and the filters, defined on a silicon-on-insulator (SOI) platform. With a p—i—n junction embedded in the microring modulator, light at the resonant wavelength of the ring resonator is modulated. The 2 nd -order microring add-drop filter routes the modulated light. The channel selectivity is demonstrated by heating the microrings. With a thermal tuning efficiency of 5.9 mW/nm, the filter drop port response was successfully tuned with 0.8 nm channel spacing. We also show that modulation can be achieved in these channels. This device aims to offer flexibility and increase the bandwidth usage efficiency in optical interconnection

  7. Physical-layer network coding for passive optical interconnect in datacenter networks.

    Lin, Rui; Cheng, Yuxin; Guan, Xun; Tang, Ming; Liu, Deming; Chan, Chun-Kit; Chen, Jiajia


    We introduce physical-layer network coding (PLNC) technique in a passive optical interconnect (POI) architecture for datacenter networks. The implementation of the PLNC in the POI at 2.5 Gb/s and 10Gb/s have been experimentally validated while the gains in terms of network layer performances have been investigated by simulation. The results reveal that in order to realize negligible packet drop, the wavelengths usage can be reduced by half while a significant improvement in packet delay especially under high traffic load can be achieved by employing PLNC over POI.

  8. A Monolithic Interconnected module with a tunnel Junction for Enhanced Electrical and Optical Performance

    Murray, Christopher Sean; Wilt, David Morgan


    An improved thermophotovoltaic (TPV) n/p/n device is provided. Monolithic Interconnected Modules (MIMs), semiconductor devices converting infrared radiation to electricity, have been developed with improved electrical and optical performance. The structure is an n-type emitter on a p-type base with an n-type lateral conduction layer. The incorporation of a tunnel junction and the reduction in the amount of p-type material used results in negligible parasitic absorption, decreased series resistance, increased voltage and increased active area. The novel use of a tunnel junction results in the potential for a TPV device with efficiency greater than 24%.

  9. Analytical Model based on Green Criteria for Optical Backbone Network Interconnection

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Pedersen, Jens Myrup


    Key terms such as Global warming, Green House Gas emissions, or Energy efficiency are currently on the scope of scientific research. Regarding telecommunications networks, wireless applications, routing protocols, etc. are being designed following this new “Green” trend. This work contributes...... to the evaluation of the environmental impact of networks from physical interconnection point of view. Networks deployment, usage, and disposal are analyzed as contributing elements to ICT’s (Information and Communications Technology) CO2 emissions. This paper presents an analytical model for evaluating...

  10. Three-dimensional crossbar interconnection using planar-integrated free-space optics and digital mirror-device

    Lohmann, U.; Jahns, J.; Limmer, S.; Fey, D.


    We consider the implementation of a dynamic crossbar interconnect using planar-integrated free-space optics (PIFSO) and a digital mirror-device™ (DMD). Because of the 3D nature of free-space optics, this approach is able to solve geometrical problems with crossings of the signal paths that occur in waveguide optical and electrical interconnection, especially for large number of connections. The DMD device allows one to route the signals dynamically. Due to the large number of individual mirror elements in the DMD, different optical path configurations are possible, thus offering the chance for optimizing the network configuration. The optimization is achieved by using an evolutionary algorithm for finding best values for a skewless parallel interconnection. Here, we present results and experimental examples for the use of the PIFSO/DMD-setup.

  11. Time-division optical interconnects for local-area and micro-area networks

    Krol, Mark F.; Boncek, Raymond K.; Johns, Steven T.; Stacy, John L.


    This report describes the development of an optical Time-Division Multiple-Access (TDMA) interconnect suitable for applications in local-area and micro-area networks. The advantages of using time-division techniques instead of frequency-division, wavelength-division, or code-division techniques in a shared-medium environment are discussed in detail. Furthermore, a detailed description of the TDMA architecture is presented along with various experiments pertaining to the actual components needed to implement the system. Finally, experimental data is presented for an actual optical TDMA test bed. The experimental data demonstrates the feasibility of the architecture, and shows that currently the system has the capability to accommodate up to 50 channels. The bit-error-rate per channel was measured to be less than 10(exp -9) for pseudo-random bit-sequences.

  12. Cost-effective parallel optical interconnection module based on fully passive-alignment process

    Son, Dong Hoon; Heo, Young Soon; Park, Hyoung-Jun; Kang, Hyun Seo; Kim, Sung Chang


    In optical interconnection technology, high-speed and large data transitions with low error rate and cost reduction are key issues for the upcoming 8K media era. The researchers present notable types of optical manufacturing structures of a four-channel parallel optical module by fully passive alignment, which are able to reduce manufacturing time and cost. Each of the components, such as vertical-cavity surface laser/positive-intrinsic negative-photodiode array, microlens array, fiber array, and receiver (RX)/transmitter (TX) integrated circuit, is integrated successfully using flip-chip bonding, die bonding, and passive alignment with a microscope. Clear eye diagrams are obtained by 25.78-Gb/s (for TX) and 25.7-Gb/s (for RX) nonreturn-to-zero signals of pseudorandom binary sequence with a pattern length of 231 to 1. The measured responsivity and minimum sensitivity of the RX are about 0.5 A/W and ≤-6.5 dBm at a bit error rate (BER) of 10-12, respectively. The optical power margin at a BER of 10-12 is 7.5 dB, and cross talk by the adjacent channel is ≤1 dB.

  13. Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects

    Sangirov Jamshid; Ukaegbu Ikechi Augustine; Lee Tae-Woo; Park Hyo-Hoon; Sangirov Gulomjon


    A power-aware transceiver for half-duplex bidirectional chip-to-chip optical interconnects has been designed and fabricated in a 0.13 μm complementary metal–oxide–semiconductor (CMOS) technology. The transceiver can detect the presence and absence of received signals and saves 55% power in Rx enabled mode and 45% in Tx enabled mode. The chip occupies an area of 1.034 mm 2 and achieves a 3-dB bandwidth of 6 GHz and 7 GHz in Tx and Rx modes, respectively. The disabled outputs for the Tx and Rx modes are isolated with 180 dB and 139 dB, respectively, from the enabled outputs. Clear eye diagrams are obtained at 4.25 Gbps for both the Tx and Rx modes. (semiconductor integrated circuits)

  14. A full-duplex working integrated optoelectronic device for optical interconnect

    Liu, Kai; Fan, Huize; Huang, Yongqing; Duan, Xiaofeng; Wang, Qi; Ren, Xiaomin; Wei, Qi; Cai, Shiwei


    In this paper, a full-duplex working integrated optoelectronic device is proposed. It is constructed by integrating a vertical cavity surface emitting laser (VCSEL) unit above a resonant cavity enhanced photodetector (RCE-PD) unit. Analysis shows that, the VCSEL unit has a threshold current of 1 mA and a slop efficiency of 0.66 W/A at 849.7 nm, the RCE-PD unit obtains its maximal absorption quantum efficiency of 90.24% at 811 nm with a FWHM of 4 nm. Moreover, the two units of the proposed integrated device can work independently from each other. So that the proposed integrated optoelectronic device can work full-duplex. It can be applied for single fiber bidirectional optical interconnects system.

  15. A 3Gb/s/ch Transceiver for 10-mm Uninterrupted RC-Limited Global On-Chip Interconnects

    Schinkel, Daniel; Mensink, E.; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria; Nauta, Bram


    Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed and interconnect bandwidth increases with CMOS process scaling. Repeaters can partly bridge this gap, but the classical repeater insertion approach requires a large number of repeaters while the

  16. Performance Evaluation of a SOA-based Rack-To-Rack Switch for Optical Interconnects Exploiting NRZ-DPSK

    Karinou, Fotini; Borkowski, Robert; Prince, Kamau


    We experimentally study the transmission performance of 10-Gb/s NRZ-DPSK through concatenated AWG MUX/DMUXs and SOAs employed in an optimized 64×64 optical supercomputer interconnect architecture. NRZ-DPSK offers 9-dB higher dynamic range compared to conventional IM/DD....

  17. Performance evaluation of multi-stratum resources integration based on network function virtualization in software defined elastic data center optical interconnect.

    Yang, Hui; Zhang, Jie; Ji, Yuefeng; Tian, Rui; Han, Jianrui; Lee, Young


    Data center interconnect with elastic optical network is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resilience between IP and elastic optical networks that allows to accommodate data center services. In view of this, this study extends to consider the resource integration by breaking the limit of network device, which can enhance the resource utilization. We propose a novel multi-stratum resources integration (MSRI) architecture based on network function virtualization in software defined elastic data center optical interconnect. A resource integrated mapping (RIM) scheme for MSRI is introduced in the proposed architecture. The MSRI can accommodate the data center services with resources integration when the single function or resource is relatively scarce to provision the services, and enhance globally integrated optimization of optical network and application resources. The overall feasibility and efficiency of the proposed architecture are experimentally verified on the control plane of OpenFlow-based enhanced software defined networking (eSDN) testbed. The performance of RIM scheme under heavy traffic load scenario is also quantitatively evaluated based on MSRI architecture in terms of path blocking probability, provisioning latency and resource utilization, compared with other provisioning schemes.

  18. Local smoothness for global optical flow

    Rakêt, Lars Lau


    by this technique and work on local-global optical flow we propose a simple method for fusing optical flow estimates of different smoothness by evaluating interpolation quality locally by means of L1 block match on the corresponding set of gradient images. We illustrate the method in a setting where optical flows...

  19. Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

    Schleunitz, A.; Klein, J. J.; Krupp, A.; Stender, B.; Houbertz, R.; Gruetzner, G.


    The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

  20. Protocol and Topology Issues for Wide-Area Satellite Interconnection of Terrestrial Optical LANs

    Parraga, N.


    Apart from broadcasting, the satellite business is targeting niche markets. Wide area interconnection is considered as one of these niche markets, since it addresses operators and business LANs (B2B, business to business) in remote areas where terrestrial infrastructure is not available. These LANs - if high-speed - are typically based on optical networks such as SONET. One of the advantages of SONET is its architecture flexibility and capacity to transport all kind of applications including multimedia with a range of different transmission rates. The applications can be carried by different protocols among which the Internet Protocol (IP) or the Asynchronous Transfer Mode (ATM) are the most prominent ones. Thus, the question arises how these protocols can be interconnected via the satellite segment. The paper addresses several solutions for interworking with different protocols. For this investigation we distinguish first of all between the topology and the switching technology of the satellites. In case of a star network with transparent satellite, the satellite protocol consists of physical layer and data layer which can be directly interconnected with layer 2 interworking function to their terrestrial counterparts in the SONET backbone. For regenerative satellites the situation is more complex: here we need to distinguish the types of transport protocols being used in the terrestrial and satellite segment. Whereas IP, ATM, MPEG dominate in the terrestrial networks, satellite systems usually do not follow these standards. Some might employ minor additions (for instance, satellite specific packet headers), some might be completely proprietary. In general, interworking must be done for the data plane on top of layer 2 (data link layer), whereas for the signaling plane the interworking is on top of layer 3. In the paper we will discuss the protocol stacks for ATM, IP, and MPEG with a regenerative satellite system. As an example we will use the EuroSkyWay satellite

  1. Low-cost optical interconnect module for parallel optical data links

    Noddings, Chad; Hirsch, Tom J.; Olla, M.; Spooner, C.; Yu, Jason J.


    We have designed, fabricated, and tested a prototype parallel ten-channel unidirectional optical data link. When scaled to production, we project that this technology will satisfy the following market penetration requirements: (1) up to 70 meters transmission distance, (2) at least 1 gigabyte/second data rate, and (3) 0.35 to 0.50 MByte/second volume selling price. These goals can be achieved by means of the assembly innovations described in this paper: a novel alignment method that is integrated with low-cost, few chip module packaging techniques, yielding high coupling and reducing the component count. Furthermore, high coupling efficiency increases projected reliability reducing the driver's power requirements.

  2. Development of a technology for fabricating low-cost parallel optical interconnects

    Van Steenberge, Geert; Hendrickx, Nina; Geerinck, Peter; Bosman, Erwin; Van Put, Steven; Van Daele, Peter


    We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility. In the fist part the waveguide fabrication technology is discussed, both photo lithography and laser ablation are proposed. It is shown that a frequency tripled Nd-YAG laser (355 nm) offers a lot of potential for defining single mode interconnections. Emphasis is on multimode waveguides, defined by KrF excimer laser (248 nm) ablation using acrylate polymers. The first conclusion out of loss spectrum measurements is a 'yellowing effect' of laser ablated waveguides, leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a wavelength of 850 nm, 980 nm and 1310 nm. This is verified at 850 nm by cut-back measurements on 10-cm-long waveguides showing an average propagation loss of 0.13 dB/cm. Photo lithographically defined waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.15 dB/cm at 850 nm. The generation of debris and the presence of microstructures are two main concerns for KrF excimer laser ablation of hybrid polymers. In the second part a process for embedding metal coated 45° micromirrors in optical waveguiding layers is described. Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Initial loss measurements indicate an excess mirror loss of 1.5 dB.

  3. Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

    Savich, Gregory R.


    The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the

  4. Optical interconnects for in-plane high-speed signal distribution at 10 Gb/s: Analysis and demonstration

    Chang, Yin-Jung

    With decreasing transistor size, increasing chip speed, and larger numbers of processors in a system, the performance of a module/system is being limited by the off-chip and off-module bandwidth-distance products. Optical links have moved from fiber-based long distance communications to the cabinet level of 1m--100m, and recently to the backplane-level (10cm--1m). Board-level inter-chip parallel optical interconnects have been demonstrated recently by researchers from Intel, IBM, Fujitsu, NTT and a few research groups in universities. However, the board-level signal/clock distribution function using optical interconnects, the lightwave circuits, the system design, a practically convenient integration scheme committed to the implementation of a system prototype have not been explored or carefully investigated. In this dissertation, the development of a board-level 1 x 4 optical-to-electrical signal distribution at 10Gb/s is presented. In contrast to other prototypes demonstrating board-level parallel optical interconnects that have been drawing much attention for the past decade, the optical link design for the high-speed signal broadcasting is even more complicated and the pitch between receivers could be varying as opposed to fixed-pitch design that has been widely-used in the parallel optical interconnects. New challenges for the board-level high-speed signal broadcasting include, but are not limited to, a new optical link design, a lightwave circuit as a distribution network, and a novel integration scheme that can be a complete radical departure from the traditional assembly method. One of the key building blocks in the lightwave circuit is the distribution network in which a 1 x 4 multimode interference (MMI) splitter is employed. MMI devices operating at high data rates are important in board-level optical interconnects and need to be characterized in the application of board-level signal broadcasting. To determine the speed limitations of MMI devices, the

  5. Low energy routing platforms for optical interconnects using active plasmonics integrated with Silicon Photonics

    Vyrsokinos, K.; Papaioannou, S.; Kalavrouziotis, D.


    technologies to cope with the massive amount of data moving across all hierarchical communication levels, namely rack-to-rack, backplane, chip-to-chip and even on-chip interconnections. Plasmonics comes indeed as a disruptive technology that enables seamless interoperability between light beams and electronic...

  6. Deep Proton Writing for the rapid prototyping of polymer micro-components for optical interconnects and optofluidics

    Van Erps, Jürgen; Vervaeke, Michael; Ottevaere, Heidi; Hermanne, Alex; Thienpont, Hugo


    The use of photonics in data communication and numerous other industrial applications brought plenty of prospects for innovation and opened up different unexplored market opportunities. This is a major driving force for the fabrication of micro-optical and micro-mechanical structures and their accurate alignment and integration into opto-mechanical modules and systems. To this end, we present Deep Proton Writing (DPW) as a powerful rapid prototyping technology for such micro-components. The DPW process consists of bombarding polymer samples (PMMA or SU-8) with swift protons, which results after chemical processing steps in high-quality micro-optical components. One of the strengths of the DPW micro-fabrication technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we comment on how we shifted from using 8.3 to 16.5 MeV protons for DPW and give some examples of micro-optical and micro-mechanical components recently fabricated through DPW, targeting applications in optical interconnections and in optofluidics.

  7. Deep Proton Writing for the rapid prototyping of polymer micro-components for optical interconnects and optofluidics

    Van Erps, Jürgen, E-mail:; Vervaeke, Michael; Ottevaere, Heidi; Hermanne, Alex; Thienpont, Hugo


    The use of photonics in data communication and numerous other industrial applications brought plenty of prospects for innovation and opened up different unexplored market opportunities. This is a major driving force for the fabrication of micro-optical and micro-mechanical structures and their accurate alignment and integration into opto-mechanical modules and systems. To this end, we present Deep Proton Writing (DPW) as a powerful rapid prototyping technology for such micro-components. The DPW process consists of bombarding polymer samples (PMMA or SU-8) with swift protons, which results after chemical processing steps in high-quality micro-optical components. One of the strengths of the DPW micro-fabrication technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we comment on how we shifted from using 8.3 to 16.5 MeV protons for DPW and give some examples of micro-optical and micro-mechanical components recently fabricated through DPW, targeting applications in optical interconnections and in optofluidics.

  8. Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

    Riggs, William R.


    SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

  9. IM/DD vs. 4-PAM Using a 1550-nm VCSEL over Short-Range SMF/MMF Links for Optical Interconnects

    Karinou, Fotini; Rodes Lopez, Roberto; Prince, Kamau


    We experimentally compare the performance of 10.9-Gb/s IM/DD and 5-GBd 4-PAM modulation formats over 5-km SMF and 1-km MMF links, employing a commercially-available 1550-nm VCSEL as an enabling technology for use in optical interconnects.......We experimentally compare the performance of 10.9-Gb/s IM/DD and 5-GBd 4-PAM modulation formats over 5-km SMF and 1-km MMF links, employing a commercially-available 1550-nm VCSEL as an enabling technology for use in optical interconnects....

  10. Application of the fractional Fourier transform to the design of LCOS based optical interconnects and fiber switches.

    Robertson, Brian; Zhang, Zichen; Yang, Haining; Redmond, Maura M; Collings, Neil; Liu, Jinsong; Lin, Ruisheng; Jeziorska-Chapman, Anna M; Moore, John R; Crossland, William A; Chu, D P


    It is shown that reflective liquid crystal on silicon (LCOS) spatial light modulator (SLM) based interconnects or fiber switches that use defocus to reduce crosstalk can be evaluated and optimized using a fractional Fourier transform if certain optical symmetry conditions are met. Theoretically the maximum allowable linear hologram phase error compared to a Fourier switch is increased by a factor of six before the target crosstalk for telecom applications of -40 dB is exceeded. A Gerchberg-Saxton algorithm incorporating a fractional Fourier transform modified for use with a reflective LCOS SLM is used to optimize multi-casting holograms in a prototype telecom switch. Experiments are in close agreement to predicted performance.

  11. Comparative study on stained InGaAs quantum wells for high-speed optical-interconnect VCSELs

    Li, Hui; Jia, Xiaowei


    The gain-carrier characteristics of InGaAs quantum well for 980 nm high-speed, energy-efficient vertical-cavity surface-emitting lasers are investigated. We specially studied the potentially InGaAs quantum well designs can be used for the active region of energy-efficient, temperature-stable 980-nm VCSEL, which introduced a quantum well gain peak wavelength-to-cavity resonance wavelength offset to improve the dynamic performance at high operation temperature. Several candidate quantum wells are being compared in theory and measurement. We found that ∼5 nm InGaAs QW with ∼6 nm barrier thickness is suitable for the active region of high-speed optical interconnect 980 nm VCSELs, and no significant improvement in the 20% range of In content of InGaAs QWs. The results are useful for next generation green photonic device design.

  12. Becoming Globally Competent Citizens: A Learning Journey of Two Classrooms in an Interconnected World

    Salmon, Angela K.; Gangotena, Maria Victoria; Melliou, Kiriaki


    Globally competent people are aware of world issues, take perspective, are engaged and know how to communicate to different people. This article portraits a story of two kindergarten classrooms, one in the United States and the other in Greece, both working with culturally diverse children and, in the case of the American classroom, English…

  13. Interconnection Guidelines

    The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

  14. Single event effect ground test results for a fiber optic data interconnect and associated electronics

    LaBel, K.A.; Hawkins, D.K.; Cooley, J.A.; Stassinopoulos, E.G.; Seidleck, C.M.; Marshall, P.; Dale, C.; Gates, M.M.; Kim, H.S.


    As spacecraft unlock the potential of fiber optics for spaceflight applications, system level bit error rates become of concern to the system designer. The authors present ground test data and analysis on candidate system components

  15. Interconnected synchronicities: the production of Bombay and Glasgow as modern global ports c.1850–1880

    Hazareesingh, Sandip


    Cain and Hopkins' influential theory of British imperialism opted for a metropolitan-based model of explanation, rooted in the interests of a City-of-London-based class of ‘gentlemanly capitalists’, and discounting in the process events and experiences in the colonies and the significance of industrialization. By focusing on the simultaneous emergence of Bombay and Glasgow as modern, global ports in the second half of the nineteenth century, this article argues, in diametrical opposition, for...

  16. SC-FDE for MMF short reach optical interconnects using directly modulated 850 nm VCSELs

    Teichmann, Victor S. C.; Barreto, Andre N.; Pham, Tien Thang


    We propose the use of single-carrier frequency-domain equalization (SC-FDE) for the compensation of modal dispersion in short distance optical links using multimode fibers and 850 nm VCSELs. By post-processing of experimental data, we demonstrate, at 7.9% overhead, the error-free transmission (ov...

  17. Performance comparison of 850-nm and 1550-nm VCSELs exploiting OOK, OFDM, and 4-PAM over SMF/MMF links for low-cost optical interconnects

    Karinou, Fotini; Deng, Lei; Rodes Lopez, Roberto


    -shift keying (QPSK)/16-ary quadrature amplitude modulation (16QAM) with direct detection, over SMF (100m and 5km) and MMF (100m and 1km) short-range links, for their potential application in low-cost rack-to-rack optical interconnects. Moreover, we assess the performance of quaternary-pulse amplitude...

  18. SU-8 Lenses: Simple Methods of Fabrication and Application in Optical Interconnection Between Fiber/LED and Microstructures

    Nguyen, Minh-Hang; Nguyen, Hai-Binh; Nguyen, Tuan-Hung; Vu, Xuan-Manh; Lai, Jain-Ren; Tseng, Fan-Gang; Chen, Te-Chang; Lee, Ming-Chang


    This paper presents two facile methods to fabricate off-plane lenses made of SU-8, an epoxy-based negative photoresist from MicroChem, on glass for optical interconnection. The methods allow the fabrication of lenses with flexible spot size and focal length depending on SU-8 well size and SU-8 drop volume and viscosity. In the first method, SU-8 drops were applied directly into patterned SU-8 wells with Teflon-coated micropipettes, and were baked to become (a)-spherical lenses. The lens shape and size were mainly determined by SU-8 viscosity, ratio of drop volume to well volume, and baking temperature and time. In the second method, a glass substrate with SU-8 patterned wells was emerged in diluted SU-8, then drawn up and baked to form lenses. The lens shapes and sizes were mainly determined by SU-8 viscosity and well volume. By the two methods, SU-8 lenses were successfully fabricated with spot sizes varying in range from micrometers to hundred micrometers, and focal lengths varying in range of several millimeters, depending on the lens rim diameters and aspheric sag height. Besides, on-plane SU-8 lenses were fabricated by photolithography to work in conjunction with the off-plane SU-8 lenses. The cascaded lenses produced light spots reduced to several micrometers, and they can be applied as a coupler for light coupling from fiber/Light-emitting diode (LED) to microstructures and nanostructures. The results open up the path for fabricating novel optical microsystems for optical communication and optical sensing applications.

  19. Graphical user interfaces for teaching and design of GRIN lenses in optical interconnections

    Gómez-Varela, A I; Bao-Varela, C


    The use of graphical user interfaces (GUIs) enables the implementation of practical teaching methodologies to make the comprehension of a given subject easier. GUIs have become common tools in science and engineering education, where very often, the practical implementation of experiences in a laboratory involves much equipment and many people; they are an efficient and inexpensive solution to the lack of resources. The aim of this work is to provide primarily physics and engineering students with a series of GUIs to teach some configurations in optical communications using gradient-index (GRIN) lenses. The reported GUIs are intended to perform a complementary role in education as part of a ‘virtual lab’ to supplement theoretical and practical sessions and to reinforce the knowledge acquired by the students. In this regard, a series of GUIs to teach and research the implementation of GRIN lenses in optical communications applications (including a GRIN light deflector and a beam-size controller, a GRIN fibre lens for fibre-coupling purposes, planar interconnectors, and an anamorphic self-focusing lens to correct astigmatism in laser diodes) was designed using the environment GUIDE developed by MATLAB. Numerical examples using available commercial GRIN lens parameter values are presented. (paper)

  20. 24-ch microlens-integrated no-polish connector for optical interconnection with polymer waveguides

    Shiraishi, Takashi; Yagisawa, Takatoshi; Ikeuchi, Tadashi; Daikuhara, Osamu; Tanaka, Kazuhiro


    We successfully developed a new 24-ch optical connector for polymer waveguides. The connector consists of a transparent thermoplastic resin that has two rectangular slits on one side for alignment of the waveguide films and integrated microlens arrays on the other side for coupling to the MT connector. Two 12-ch waveguide films were cut to a 3-mm width. The thickness of each waveguide film was controlled at 100 μm. The waveguide films were inserted into the slits until they touched the bottom face of the slit. Ultraviolet curing adhesive was used to achieve a short hardening process. The expanded beam in the transparent material is focused by the microlens arrays formed on the connector surface. This lens structure enables assembly without the need for a polishing process. We designed the lens for coupling between a step-index 40-μm rectangular waveguide and a graded-index 50-μm fiber. We achieved low-loss optical coupling by designing a method of providing asymmetric magnification between the horizontal and vertical directions in order to compensate for the asymmetric numerical aperture of the waveguide. The typical measured coupling losses from/to the waveguide to/from the fiber were 1.2 dB and 0.6 dB, respectively. The total coupling loss was as small as that of a physical contact connection.

  1. Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

    Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S


    We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

  2. Interconnecting wearable devices with nano-biosensing implants through optical wireless communications

    Johari, Pedram; Pandey, Honey; Jornet, Josep M.


    Major advancements in the fields of electronics, photonics and wireless communication have enabled the development of compact wearable devices, with applications in diverse domains such as fitness, wellness and medicine. In parallel, nanotechnology is enabling the development of miniature sensors that can detect events at the nanoscale with unprecedented accuracy. On this matter, in vivo implantable Surface Plasmon Resonance (SPR) nanosensors have been proposed to analyze circulating biomarkers in body fluids for the early diagnosis of a myriad of diseases, ranging from cardiovascular disorders to different types of cancer. In light of these results, in this paper, an architecture is proposed to bridge the gap between these two apparently disjoint paradigms, namely, the commercial wearable devices and the advanced nano-biosensing technologies. More specifically, this paper thoroughly assesses the feasibility of the wireless optical intercommunications of an SPR-based nanoplasmonic biochip -implanted subcutaneously in the wrist-, with a nanophotonic wearable smart band which is integrated by an array of nano-lasers and photon-detectors for distributed excitation and measurement of the nanoplasmonic biochip. This is done through a link budget analysis which captures the peculiarities of the intra-body optical channel at (sub) cellular level, the strength of the SPR nanosensor reflection, as well as the capabilities of the nanolasers (emission power, spectrum) and the nano photon-detectors (sensitivity and noise equivalent power). The proposed analysis guides the development of practical communication designs between the wearable devices and nano-biosensing implants, which paves the way through early-stage diagnosis of severe diseases.

  3. Add/drop filters based on SiC technology for optical interconnects

    Vieira, M; Vieira, M A; Louro, P; Fantoni, A; Silva, V


    In this paper we demonstrate an add/drop filter based on SiC technology. Tailoring of the channel bandwidth and wavelength is experimentally demonstrated. The concept is extended to implement a 1 by 4 wavelength division multiplexer with channel separation in the visible range. The device consists of a p-i'(a-SiC:H)-n/p-i(a-Si:H)-n heterostructure. Several monochromatic pulsed lights, separately or in a polychromatic mixture illuminated the device. Independent tuning of each channel is performed by steady state violet bias superimposed either from the front and back sides. Results show that, front background enhances the light-to-dark sensitivity of the long and medium wavelength channels and quench strongly the others. Back violet background has the opposite behaviour. This nonlinearity provides the possibility for selective removal or addition of wavelengths. An optoelectronic model is presented and explains the light filtering properties of the add/drop filter, under different optical bias conditions

  4. Spatial-phase code-division multiple-access system with multiplexed Fourier holography switching for reconfigurable optical interconnection

    Takasago, Kazuya; Takekawa, Makoto; Shirakawa, Atsushi; Kannari, Fumihiko


    A new, to our knowledge, space-variant optical interconnection system based on a spatial-phase code-division multiple-access technique with multiplexed Fourier holography is described. In this technique a signal beam is spread over wide spatial frequencies by an M -sequence pseudorandom phase code. At a receiver side a selected signal beam is properly decoded, and at the same time its spatial pattern is shaped with a Fourier hologram, which is recorded by light that is encoded with the same M -sequence phase mask as the desired signal beam and by light whose spatial beam pattern is shaped to a signal routing pattern. Using the multiplexed holography, we can simultaneously route multisignal flows into individually specified receiver elements. The routing pattern can also be varied by means of switching the encoding phase code or replacing the hologram. We demonstrated a proof-of-principle experiment with a doubly multiplexed hologram that enables simultaneous routing of two signal beams. Using a numerical model, we showed that the proposed scheme can manage more than 250 routing patterns for one signal flow with one multiplexed hologram at a signal-to-noise ratio of 5.

  5. Transurban interconnectivities

    Jørgensen, Claus Møller


    This essay discusses the interpretation of the revolutionary situations of 1848 in light of recent debates on interconnectivity in history. The concept of transurban interconnectivities is proposed as the most precise concept to capture the nature of interconnectivity in 1848. It is argued....... It is argued that circulating political communication accounts for similarities with respect to political agenda, organisational form and political repertoire evident in urban settings across Europe. This argument is supported by a series of examples of local organisation and local appropriations of liberalism...

  6. Approximate analytical method to evaluate diffraction crosstalk in free-space optical interconnects systems that use circular microlenses with finite uniform apertures

    Al-Ababneh, Nedal


    We propose an accurate analytical model to calculate the optical crosstalk of a first-order free space optical interconnects system that uses microlenses with circular apertures. The proposed model is derived by evaluating the resulted finite integral in terms of an infinite series of Bessel functions. Compared to the model that uses complex Gaussian functions to expand the aperture function, it is shown that the proposed model is superior in estimating the crosstalk and provides more accurate results. Moreover, it is shown that the proposed model gives results close to that of the numerical model with superior computational efficiency.

  7. Interconnected networks


    This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

  8. High-speed highly temperature stable 980 nm VCSELs operating at 25 Gb/s at up to 85 °C for short reach optical interconnects

    Mutig, Alex; Lott, James A.; Blokhin, Sergey A.; Moser, Philip; Wolf, Philip; Hofmann, Werner; Nadtochiy, Alexey M.; Bimberg, Dieter


    The progressive penetration of optical communication links into traditional copper interconnect markets greatly expands the applications of vertical cavity surface emitting lasers (VCSELs) for the next-generation of board-to-board, moduleto- module, chip-to-chip, and on-chip optical interconnects. Stability of the VCSEL parameters at high temperatures is indispensable for such applications, since these lasers typically reside directly on or near integrated circuit chips. Here we present 980 nm oxide-confined VCSELs operating error-free at bit rates up to 25 Gbit/s at temperatures as high as 85 °C without adjustment of the drive current and peak-to-peak modulation voltage. The driver design is therefore simplified and the power consumption of the driver electronics is lowered, reducing the production and operational costs. Small and large signal modulation experiments at various temperatures from 20 up to 85 °C for lasers with different oxide aperture diameters are presented in order to analyze the physical processes controlling the performance of the VCSELs. Temperature insensitive maximum -3 dB bandwidths of around 13-15 GHz for VCSELs with aperture diameters of 10 μm and corresponding parasitic cut-off frequencies exceeding 22 GHz are observed. Presented results demonstrate the suitability of our VCSELs for practical high speed and high temperature stable short-reach optical links.

  9. Optoelectronic interconnects for 3D wafer stacks

    Ludwig, David; Carson, John C.; Lome, Louis S.


    Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

  10. Low power laser driver design in 28nm CMOS for on-chip and chip-to-chip optical interconnect

    Belfiore, Guido; Szilagyi, Laszlo; Henker, Ronny; Ellinger, Frank


    This paper discusses the challenges and the trade-offs in the design of laser drivers for very-short distance optical communications. A prototype integrated circuit is designed and fabricated in 28 nm super-low-power CMOS technology. The power consumption of the transmitter is 17.2 mW excluding the VCSEL that in our test has a DC power consumption of 10 mW. The active area of the driver is only 0.0045 mm2. The driver can achieve an error-free (BER < 10 -12) electrical data-rate of 25 Gbit/s using a pseudo random bit sequence of 27 -1. When the driver is connected to the VCSEL module an open optical eye is reported at 15 Gbit/s. In the tested bias point the VCSEL module has a measured bandwidth of 10.7 GHz.

  11. Application of quantum-dot multi-wavelength lasers and silicon photonic ring resonators to data-center optical interconnects

    Beckett, Douglas J. S.; Hickey, Ryan; Logan, Dylan F.; Knights, Andrew P.; Chen, Rong; Cao, Bin; Wheeldon, Jeffery F.


    Quantum dot comb sources integrated with silicon photonic ring-resonator filters and modulators enable the realization of optical sub-components and modules for both inter- and intra-data-center applications. Low-noise, multi-wavelength, single-chip, laser sources, PAM4 modulation and direct detection allow a practical, scalable, architecture for applications beyond 400 Gb/s. Multi-wavelength, single-chip light sources are essential for reducing power dissipation, space and cost, while silicon photonic ring resonators offer high-performance with space and power efficiency.

  12. Interconnection network architectures based on integrated orbital angular momentum emitters

    Scaffardi, Mirco; Zhang, Ning; Malik, Muhammad Nouman; Lazzeri, Emma; Klitis, Charalambos; Lavery, Martin; Sorel, Marc; Bogoni, Antonella


    Novel architectures for two-layer interconnection networks based on concentric OAM emitters are presented. A scalability analysis is done in terms of devices characteristics, power budget and optical signal to noise ratio by exploiting experimentally measured parameters. The analysis shows that by exploiting optical amplifications, the proposed interconnection networks can support a number of ports higher than 100. The OAM crosstalk induced-penalty, evaluated through an experimental characterization, do not significantly affect the interconnection network performance.

  13. Economic and environmental benefits of interconnected systems. The Spanish example

    Chicharro, A.S.; Dios Alija, R. de


    The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author)

  14. Epidemics in interconnected small-world networks.

    Liu, Meng; Li, Daqing; Qin, Pengju; Liu, Chaoran; Wang, Huijuan; Wang, Feilong


    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS) model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  15. Epidemics in interconnected small-world networks.

    Meng Liu

    Full Text Available Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  16. Brookhaven segment interconnect

    Morse, W.M.; Benenson, G.; Leipuner, L.B.


    We have performed a high energy physics experiment using a multisegment Brookhaven FASTBUS system. The system was composed of three crate segments and two cable segments. We discuss the segment interconnect module which permits communication between the various segments

  17. Global Annual Average PM2.5 Grids from MODIS and MISR Aerosol Optical Depth (AOD)

    National Aeronautics and Space Administration — Global Annual PM2.5 Grids from MODIS and MISR Aerosol Optical Depth (AOD) data set represents a series of annual average grids (2001-2010) of fine particulate matter...

  18. Global Annual Average PM2.5 Grids from MODIS and MISR Aerosol Optical Depth (AOD)

    National Aeronautics and Space Administration — Global Annual PM2.5 Grids from MODIS and MISR Aerosol Optical Depth (AOD) data sets represent a series of annual average grids (2001-2010) of fine particulate matter...

  19. Epidemic spreading on interconnected networks.

    Saumell-Mendiola, Anna; Serrano, M Ángeles; Boguñá, Marián


    Many real networks are not isolated from each other but form networks of networks, often interrelated in nontrivial ways. Here, we analyze an epidemic spreading process taking place on top of two interconnected complex networks. We develop a heterogeneous mean-field approach that allows us to calculate the conditions for the emergence of an endemic state. Interestingly, a global endemic state may arise in the coupled system even though the epidemics is not able to propagate on each network separately and even when the number of coupling connections is small. Our analytic results are successfully confronted against large-scale numerical simulations.

  20. Benefits of transmission interconnections

    Lyons, D.


    The benefits of new power transmission interconnections from Alberta were discussed with reference to the challenges and measures needed to move forward. Alberta's electricity system has had a long period of sustained growth in generation and demand and this trend is expected to continue. However, no new interconnections have been built since 1985 because the transmission network has not expanded in consequence with the growth in demand. As such, Alberta remains weakly interconnected with the rest of the western region. The benefits of stronger transmission interconnections include improved reliability, long-term generation capability, hydrothermal synergies, a more competitive market, system efficiencies and fuel diversity. It was noted that the more difficult challenges are not technical. Rather, the difficult challenges lie in finding an appropriate business model that recognizes different market structures. It was emphasized that additional interconnections are worthwhile and will require significant collaboration among market participants and governments. It was concluded that interties enable resource optimization between systems and their benefits far exceed their costs. tabs., figs

  1. Importance of representing optical depth variability for estimates of global line-shaped contrail radiative forcing.

    Kärcher, Bernd; Burkhardt, Ulrike; Ponater, Michael; Frömming, Christine


    Estimates of the global radiative forcing by line-shaped contrails differ mainly due to the large uncertainty in contrail optical depth. Most contrails are optically thin so that their radiative forcing is roughly proportional to their optical depth and increases with contrail coverage. In recent assessments, the best estimate of mean contrail radiative forcing was significantly reduced, because global climate model simulations pointed at lower optical depth values than earlier studies. We revise these estimates by comparing the probability distribution of contrail optical depth diagnosed with a climate model with the distribution derived from a microphysical, cloud-scale model constrained by satellite observations over the United States. By assuming that the optical depth distribution from the cloud model is more realistic than that from the climate model, and by taking the difference between the observed and simulated optical depth over the United States as globally representative, we quantify uncertainties in the climate model's diagnostic contrail parameterization. Revising the climate model results accordingly increases the global mean radiative forcing estimate for line-shaped contrails by a factor of 3.3, from 3.5 mW/m(2) to 11.6 mW/m(2) for the year 1992. Furthermore, the satellite observations and the cloud model point at higher global mean optical depth of detectable contrails than often assumed in radiative transfer (off-line) studies. Therefore, we correct estimates of contrail radiative forcing from off-line studies as well. We suggest that the global net radiative forcing of line-shaped persistent contrails is in the range 8-20 mW/m(2) for the air traffic in the year 2000.

  2. Exploration of operator method digital optical computers for application to NASA


    Digital optical computer design has been focused primarily towards parallel (single point-to-point interconnection) implementation. This architecture is compared to currently developing VHSIC systems. Using demonstrated multichannel acousto-optic devices, a figure of merit can be formulated. The focus is on a figure of merit termed Gate Interconnect Bandwidth Product (GIBP). Conventional parallel optical digital computer architecture demonstrates only marginal competitiveness at best when compared to projected semiconductor implements. Global, analog global, quasi-digital, and full digital interconnects are briefly examined as alternative to parallel digital computer architecture. Digital optical computing is becoming a very tough competitor to semiconductor technology since it can support a very high degree of three dimensional interconnect density and high degrees of Fan-In without capacitive loading effects at very low power consumption levels.

  3. Low power interconnect design

    Saini, Sandeep


    This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.   ·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses; ·         Focuses on Deep Sub micron technology devices and interconnects; ·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics;  ·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for del...

  4. Interconnecting with VIPs

    Collins, Robert


    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  5. CAISSON: Interconnect Network Simulator

    Springer, Paul L.


    Cray response to HPCS initiative. Model future petaflop computer interconnect. Parallel discrete event simulation techniques for large scale network simulation. Built on WarpIV engine. Run on laptop and Altix 3000. Can be sized up to 1000 simulated nodes per host node. Good parallel scaling characteristics. Flexible: multiple injectors, arbitration strategies, queue iterators, network topologies.

  6. Fatigue, pain and patient global assessment responses to biological treatment are unpredictable, and poorly inter-connected in individual rheumatoid arthritis patients followed in the daily clinic

    Madsen, Ole Rintek; Egsmose, Eva Marie


    The objective of the study was to investigate relations on group level and agreements on the individual patient level between changes in fatigue, pain and patient global assessment (PaGl) assessed on visual analogue scales (VAS) in patients with rheumatoid arthritis (RA) after initiating...... and by baseline values. The results expose the unpredictable nature of patient-reported VAS scores in individual patients with RA....

  7. Photovoltaic sub-cell interconnects

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne


    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  8. Electromagnetism and interconnections

    Charruau, S


    This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.

  9. Interconnectivity: Benefits and Challenges



    Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

  10. Interconnection of Distributed Energy Resources

    Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)


    This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

  11. Interconnection policy: a theoretical survey

    César Mattos


    Full Text Available This article surveys the theoretical foundations of interconnection policy. The requirement of an interconnection policy should not be taken for granted in all circumstances, even considering the issue of network externalities. On the other hand, when it is required, an encompassing interconnection policy is usually justified. We provide an overview of the theory on interconnection pricing that results in several different prescriptions depending on which problem the regulator aims to address. We also present a survey on the literature on two-way interconnection.

  12. Aerosol optical thickness retrieval over land and water using Global Ozone Monitoring Experiment (GOME) data

    Kusmierczyk-Michulec, J.; Leeuw, G. de


    An algorithm for the retrieval of the aerosol optical thickness over land and over water from Global Ozone Monitoring Experiment (GOME) data is presented. The cloud fraction in the GOME pixels is determined using the Fast Retrieval Scheme for Clouds From the Oxygen A Band (FRESCO) algorithm. Surface

  13. LHC beampipe interconnection

    Particle beams circulate for around 10 hours in the Large Hadron Collider (LHC). During this time, the particles make four hundred million revolutions of the machine, travelling a distance equivalent to the diameter of the solar system. The beams must travel in a pipe which is emptied of air, to avoid collisions between the particles and air molecules (which are considerably bigger than protons). The beam pipes are pumped down to an air pressure similar to that on the surface of the moon. Much of the LHC runs at 1.9 degrees above absolute zero. When material is cooled, it contracts. The interconnections must absorb this contraction whilst maintaining electrical connectivity.

  14. Visualizing interconnections among climate risks

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.


    It is now widely recognized that climate change is affecting various sectors of the world. Climate change impact on one sector may spread out to other sectors including those seemingly remote, which we call "interconnections of climate risks". While a number of climate risks have been identified in the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5), there has been no attempt to explore their interconnections comprehensively. Here we present a first and most exhaustive visualization of climate risks drawn based on a systematic literature survey. Our risk network diagrams depict that changes in the climate system impact natural capitals (terrestrial water, crop, and agricultural land) as well as social infrastructures, influencing the socio-economic system and ultimately our access to food, water, and energy. Our findings suggest the importance of incorporating climate risk interconnections into impact and vulnerability assessments and call into question the widely used damage function approaches, which address a limited number of climate change impacts in isolation. Furthermore, the diagram is useful to educate decision makers, stakeholders, and general public about cascading risks that can be triggered by the climate change. Socio-economic activities today are becoming increasingly more inter-dependent because of the rapid technological progress, urbanization, and the globalization among others. Equally complex is the ecosystem that is susceptible to climate change, which comprises interwoven processes affecting one another. In the context of climate change, a number of climate risks have been identified and classified according to regions and sectors. These reports, however, did not fully address the inter-relations among risks because of the complexity inherent in this issue. Climate risks may ripple through sectors in the present inter-dependent world, posing a challenge ahead of us to maintain the resilience of the system. It is

  15. The Enhanced Segment Interconnect for FASTBUS data communications

    Machen, D.R.; Downing, R.W.; Kirsten, F.A.; Nelson, R.O.


    The Enhanced Segment Interconnect concept (ESI) for improved FASTBUS data communications is a development supported by the U.S. Department of Energy under the Small Business Innovation Research (SBIR) program. The ESI will contain both the Segment Interconnect (SI) Tyhpe S-1 and an optional buffered interconnect for store-and-forward data communications; fiber-optic-coupled serial ports will provide optional data paths. The ESI can be applied in large FASTBUS-implemented physics experiments whose data-set or data-transmission distance requirements dictate alternate approaches to data communications. This paper describes the functions of the ESI and the status of its development, now 25% complete

  16. 850-nm Zn-diffusion vertical-cavity surface-emitting lasers with with oxide-relief structure for high-speed and energy-efficient optical interconnects from very-short to medium (2km) reaches

    Shi, Jin-Wei; Wei, Chia-Chien; Chen, Jason (Jyehong); Yang, Ying-Jay


    High-speed and "green" ~850 nm vertical-cavity surface-emitting lasers (VCSELs) have lately attracted lots of attention due to their suitability for applications in optical interconnects (OIs). To further enhance the speed and its maximum allowable linking distance of VCSELs are two major trends to meet the requirement of OI in next generation data centers. Recently, by use of the advanced 850 nm VCSEL technique, data rate as high as 64 Gbit/sec over 57m and 20 Gbit/sec over 2km MMF transmission have been demonstrated, respectively. Here, we will review our recent work about 850 nm Zn-diffusion VCSELs with oxide-relief apertures to further enhance the above-mentioned performances. By using Zn-diffusion, we can not only reduce the device resistance but also manipulate the number of optical modes to benefit transmission. Combing such device, which has excellent single-mode (SMSR >30 dB) and high-power (~7mW) performance, with advanced modulation format (OFDM), record-high bit-rate-distance-product through MMF (2.3 km×28 Gbit/sec) has been demonstrated. Furthermore, by selective etching away the oxide aperture inside Zn-diffusion VCSEL, significant enhancement of device speed, D-factor, and reliability can be observed. With such unique VCSEL structure, >40 Gbit/sec energy-efficient transmission over 100m MMF under extremely low-driving current density (<10kA/cm2) has been successfully demonstrated.

  17. Fuel cell system with interconnect

    Goettler, Richard; Liu, Zhien


    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  18. Policy issues in interconnecting networks

    Leiner, Barry M.


    To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

  19. Epidemics on interconnected networks

    Dickison, Mark; Havlin, S.; Stanley, H. E.


    Populations are seldom completely isolated from their environment. Individuals in a particular geographic or social region may be considered a distinct network due to strong local ties but will also interact with individuals in other networks. We study the susceptible-infected-recovered process on interconnected network systems and find two distinct regimes. In strongly coupled network systems, epidemics occur simultaneously across the entire system at a critical infection strength βc, below which the disease does not spread. In contrast, in weakly coupled network systems, a mixed phase exists below βc of the coupled network system, where an epidemic occurs in one network but does not spread to the coupled network. We derive an expression for the network and disease parameters that allow this mixed phase and verify it numerically. Public health implications of communities comprising these two classes of network systems are also mentioned.

  20. Characterization of a Cobalt-Tungsten Interconnect

    Harthøj, Anders; Holt, Tobias; Caspersen, Michael


    is to act both as a diffusion barrier for chromium and provide better protection against high temperature oxidation than a pure cobalt coating. This work presents a characterization of a cobalt-tungsten alloy coating electrodeposited on the ferritic steel Crofer 22 H which subsequently was oxidized in air......A ferritic steel interconnect for a solid oxide fuel cell must be coated in order to prevent chromium evaporation from the steel substrate. The Technical University of Denmark and Topsoe Fuel Cell have developed an interconnect coating based on a cobalt-tungsten alloy. The purpose of the coating...... for 300 h at 800 °C. The coating was characterized with Glow Discharge Optical Spectroscopy (GDOES), Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD). The oxidation properties were evaluated by measuring weight change of coated samples of Crofer 22 H and Crofer 22 APU as a function...

  1. Global control of colored moiré pattern in layered optical structures

    Li, Kunyang; Zhou, Yangui; Pan, Di; Ma, Xueyan; Ma, Hongqin; Liang, Haowen; Zhou, Jianying


    Accurate description of visual effect of colored moiré pattern caused by layered optical structures consisting of gratings and Fresnel lens is proposed in this work. The colored moiré arising from the periodic and quasi-periodic structures is numerically simulated and experimentally verified. It is found that the visibility of moiré pattern generated by refractive optical elements is related to not only the spatial structures of gratings but also the viewing angles. To effectively control the moiré visibility, two constituting gratings are slightly separated. Such scheme is proved to be effective to globally eliminate moiré pattern for displays containing refractive optical films with quasi-periodic structures.

  2. Leaf optical properties shed light on foliar trait variability at individual to global scales

    Shiklomanov, A. N.; Serbin, S.; Dietze, M.


    Recent syntheses of large trait databases have contributed immensely to our understanding of drivers of plant function at the global scale. However, the global trade-offs revealed by such syntheses, such as the trade-off between leaf productivity and resilience (i.e. "leaf economics spectrum"), are often absent at smaller scales and fail to correlate with actual functional limitations. An improved understanding of how traits vary among communities, species, and individuals is critical to accurate representations of vegetation ecophysiology and ecological dynamics in ecosystem models. Spectral data from both field observations and remote sensing platforms present a rich and widely available source of information on plant traits. Here, we apply Bayesian inversion of the PROSPECT leaf radiative transfer model to a large global database of over 60,000 field spectra and plant traits to (1) comprehensively assess the accuracy of leaf trait estimation using PROSPECT spectral inversion; (2) investigate the correlations between optical traits estimable from PROSPECT and other important foliar traits such as nitrogen and lignin concentrations; and (3) identify dominant sources of variability and characterize trade-offs in optical and non-optical foliar traits. Our work provides a key methodological contribution by validating physically-based retrieval of plant traits from remote sensing observations, and provides insights about trait trade-offs related to plant acclimation, adaptation, and community assembly.

  3. Copper Nanowire Production for Interconnect Applications

    Han, Jin-Woo (Inventor); Meyyappan, Meyya (Inventor)


    A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

  4. Progress in the development of global medium-energy nucleon-nucleus optical model potentials

    Madland, D.G.


    Two existing global medium-energy nucleon-nucleus phenomenological optical model potentials are described and compared with experiment and with each other. The first of these employs a Dirac approach (second-order reduction) that is global in projectile energy and projectile isospin and applies to the target nucleus 208 Pb. The second of these employs a relativistic equivalent to the Schroedinger equation (including relativistic kinematics) that is global in projectile energy, projectile isospin, and target (Z,A). Finally, current work is described and the influence of the nuclear bound state problem (treated in relativistic mean field theory) on the Dirac scattering problem is mentioned. Spherical target nuclei are treated in the present work and strongly-collective target nuclei (rotational and vibrational) requiring coupled-channels approaches will be treated in a future paper. (author)

  5. Global Electric Circuit Diurnal Variation Derived from Storm Overflight and Satellite Optical Lightning Datasets

    Mach, Douglas M.; Blakeslee, R. J.; Bateman, M. J.; Bailey, J. C.


    We have combined analyses of over 1000 high altitude aircraft observations of electrified clouds with diurnal lightning statistics from the Lightning Imaging Sensor (LIS) and Optical Transient Detector (OTD) to produce an estimate of the diurnal variation in the global electric circuit. Using basic assumptions about the mean storm currents as a function of flash rate and location, and the global electric circuit, our estimate of the current in the global electric circuit matches the Carnegie curve diurnal variation to within 4% for all but two short periods of time. The agreement with the Carnegie curve was obtained without any tuning or adjustment of the satellite or aircraft data. Mean contributions to the global electric circuit from land and ocean thunderstorms are 1.1 kA (land) and 0.7 kA (ocean). Contributions to the global electric circuit from ESCs are 0.22 kA for ocean storms and 0.04 kA for land storms. Using our analysis, the mean total conduction current for the global electric circuit is 2.0 kA.

  6. Design of a highly parallel board-level-interconnection with 320 Gbps capacity

    Lohmann, U.; Jahns, J.; Limmer, S.; Fey, D.; Bauer, H.


    A parallel board-level interconnection design is presented consisting of 32 channels, each operating at 10 Gbps. The hardware uses available optoelectronic components (VCSEL, TIA, pin-diodes) and a combination of planarintegrated free-space optics, fiber-bundles and available MEMS-components, like the DMD™ from Texas Instruments. As a specific feature, we present a new modular inter-board interconnect, realized by 3D fiber-matrix connectors. The performance of the interconnect is evaluated with regard to optical properties and power consumption. Finally, we discuss the application of the interconnect for strongly distributed system architectures, as, for example, in high performance embedded computing systems and data centers.

  7. Location constrained resource interconnection

    Hawkins, D.


    This presentation discussed issues related to wind integration from the perspective of the California Independent System Operator (ISO). Issues related to transmission, reliability, and forecasting were reviewed. Renewable energy sources currently used by the ISO were listed, and details of a new transmission financing plan designed to address the location constraints of renewable energy sources and provide for new transmission infrastructure was presented. The financing mechanism will be financed by participating transmission owners through revenue requirements. New transmission interconnections will include network facilities and generator tie-lines. Tariff revisions have also been implemented to recover the costs of new facilities and generators. The new transmission project will permit wholesale transmission access to areas where there are significant energy resources that are not transportable. A rate impact cap of 15 per cent will be imposed on transmission owners to mitigate short-term costs to ratepayers. The presentation also outlined energy resource area designation plans, renewable energy forecasts, and new wind technologies. Ramping issues were also discussed. It was concluded that the ISO expects to ensure that 20 per cent of its energy will be derived from renewable energy sources. tabs., figs

  8. Area array interconnection handbook

    Totta, Paul A


    Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later famil...

  9. An optical potential for the statically deformed actinide nuclei derived from a global spherical potential

    Al-Rawashdeh, S. M.; Jaghoub, M. I.


    In this work we test the hypothesis that a properly deformed spherical optical potential, used within a channel-coupling scheme, provides a good description for the scattering data corresponding to neutron induced reactions on the heavy, statically deformed actinides and other lighter deformed nuclei. To accomplish our goal, we have deformed the Koning-Delaroche spherical global potential and then used it in a channel-coupling scheme. The ground-state is coupled to a sufficient number of inelastic rotational channels belonging to the ground-state band to ensure convergence. The predicted total cross sections, elastic and inelastic angular distributions are in good agreement with the experimental data. As a further test, we compare our results to those obtained by a global channel-coupled optical model whose parameters were obtained by fitting elastic and inelastic angular distributions in addition to total cross sections. Our results compare quite well with those obtained by the fitted, channel-coupled optical model. Below neutron incident energies of about 1MeV, our results show that scattering into the rotational excited states of the ground-state band plays a significant role in the scattering process and must be explicitly accounted for using a channel-coupling scheme.

  10. Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

    Majumder, M.K.; Pandya, N.D.; Kaushik, B.K.; Manhas, S.K.


    Carbon nanotube (CN T) can be considered as an emerging interconnect material in current nano scale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

  11. Interconnecting heterogeneous database management systems

    Gligor, V. D.; Luckenbaugh, G. L.


    It is pointed out that there is still a great need for the development of improved communication between remote, heterogeneous database management systems (DBMS). Problems regarding the effective communication between distributed DBMSs are primarily related to significant differences between local data managers, local data models and representations, and local transaction managers. A system of interconnected DBMSs which exhibit such differences is called a network of distributed, heterogeneous DBMSs. In order to achieve effective interconnection of remote, heterogeneous DBMSs, the users must have uniform, integrated access to the different DBMs. The present investigation is mainly concerned with an analysis of the existing approaches to interconnecting heterogeneous DBMSs, taking into account four experimental DBMS projects.

  12. Universal Interconnection Technology Workshop Proceedings

    Sheaffer, P.; Lemar, P.; Honton, E. J.; Kime, E.; Friedman, N. R.; Kroposki, B.; Galdo, J.


    The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology, approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.

  13. Graph-state preparation and quantum computation with global addressing of optical lattices

    Kay, Alastair; Pachos, Jiannis K.; Adams, Charles S.


    We present a way to manipulate ultracold atoms where four atomic levels are trapped by appropriately tuned optical lattices. When employed to perform quantum computation via global control, this unique structure dramatically reduces the number of steps involved in the control procedures, either for the standard, network, model, or for one-way quantum computation. The use of a far-blue-detuned lattice and a magnetically insensitive computational basis makes the scheme robust against decoherence. The present scheme is a promising candidate for experimental implementation of quantum computation and for graph-state preparation in one, two, or three spatial dimensions

  14. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin


    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

  15. Annual global tree cover estimated by fusing optical and SAR satellite observations

    Feng, M.; Sexton, J. O.; Channan, S.; Townshend, J. R.


    Tree cover defined structurally as the proportional, vertically projected area of vegetation (including leaves, stems, branches, etc.) of woody plants above a given height affects terrestrial energy and water exchanges, photosynthesis and transpiration, net primary production, and carbon and nutrient fluxes. Tree cover provides a measurable attribute upon which forest cover may be defined. Changes in tree cover over time can be used to monitor and retrieve site-specific histories of forest disturbance, succession, and degradation. Measurements of Earth's tree cover have been produced at regional, national, and global extents. However, most representations are static, and those for which multiple time periods have been produced are neither intended nor adequate for consistent, long-term monitoring. Moreover, although a substantial proportion of change has been shown to occur at resolutions below 250 m, existing long-term, Landsat-resolution datasets are either produced as static layers or with annual, five- or ten-year temporal resolution. We have developed an algorithms to retrieve seamless and consistent, sub-hectare resolution estimates of tree-canopy from optical and radar satellite data sources (e.g., Landsat, Sentinel-2, and ALOS-PALSAR). Our approach to estimation enables assimilation of multiple data sources and produces estimates of both cover and its uncertainty at the scale of pixels. It has generated the world's first Landsat-based percent tree cover dataset in 2013. Our previous algorithms are being adapted to produce prototype percent-tree and water-cover layers globally in 2000, 2005, and 2010—as well as annually over North and South America from 2010 to 2015—from passive-optical (Landsat and Sentinel-2) and SAR measurements. Generating a global, annual dataset is beyond the scope of this support; however, North and South America represent all of the world's major biomes and so offer the complete global range of environmental sources of error and

  16. Variations in global land surface phenology: a comparison of satellite optical and passive microwave data

    Tong, X.; Tian, F.; Brandt, M.; Zhang, W.; Liu, Y.; Fensholt, R.


    Changes in vegetation phenological events are among the most sensitive biological responses to climate change. In last decades, facilitating by satellite remote sensing techniques, land surface phenology (LSP) have been monitored at global scale using proxy approaches as tracking the temporal change of a satellite-derived vegetation index. However, the existing global assessments of changes in LSP are all established on the basis of leaf phenology using NDVI derived from optical sensors, being responsive to vegetation canopy cover and greenness. Instead, the vegetation optical depth (VOD) parameter from passive microwave sensors, which is sensitive to the aboveground vegetation water content by including as well the woody components in the observations, provides an alternative, independent and comprehensive means for global vegetation phenology monitoring. We used the unique long-term global VOD record available for the period 1992-2012 to monitoring the dynamics of LSP metrics (length of season, start of season and end of season) in comparison with the dynamics of LSP metrics derived from the latest GIMMS NDVI3G V1. We evaluated the differences in the linear trends of LSP metrics between two datasets. Currently, our results suggest that the level of seasonality variation of vegetation water content is less than the vegetation greenness. We found significant phenological changes in vegetation water content in African woodlands, where has been reported with little leaf phenological change regardless of the delays in rainfall onset. Therefore, VOD might allow us to detect temporal shifts in the timing difference of vegetation water storage vs. leaf emergence and to see if some ecophysiological thresholds seem to be reached, that could cause species turnover as climate change-driven alterations to the African monsoon proceed.

  17. Development of global medium-energy nucleon-nucleus optical model potentials

    Madland, D.G.; Sierk, A.J.


    The authors report on the development of new global optical model potentials for nucleon-nucleus scattering at medium energies. Using both Schroedinger and Dirac scattering formalisms, the goal is to construct a physically realistic optical potential describing nucleon-nucleus elastic scattering observables for a projectile energy range of (perhaps) 20 meV to (perhaps) 2 GeV and a target mass range of 16 to 209, excluding regions of strong nuclear deformation. They use a phenomenological approach guided by conclusions from recent microscopic studies. The experimental database consists largely of proton-nucleus elastic differential cross sections, analyzing powers, spin-rotation functions, and total reaction cross sections, and neutron-nucleus total cross sections. They will use this database in a nonlinear least-squares adjustment of optical model parameters in both relativistic equivalent Schroedinger (including relativistic kinematics) and Dirac (second-order reduction) formalisms. Isospin will be introduced through the standard Lane model and a relativistic generalization of that model

  18. Global direct radiative forcing by process-parameterized aerosol optical properties

    KirkevâG, Alf; Iversen, Trond


    A parameterization of aerosol optical parameters is developed and implemented in an extended version of the community climate model version 3.2 (CCM3) of the U.S. National Center for Atmospheric Research. Direct radiative forcing (DRF) by monthly averaged calculated concentrations of non-sea-salt sulfate and black carbon (BC) is estimated. Inputs are production-specific BC and sulfate from [2002] and background aerosol size distribution and composition. The scheme interpolates between tabulated values to obtain the aerosol single scattering albedo, asymmetry factor, extinction coefficient, and specific extinction coefficient. The tables are constructed by full calculations of optical properties for an array of aerosol input values, for which size-distributed aerosol properties are estimated from theory for condensation and Brownian coagulation, assumed distribution of cloud-droplet residuals from aqueous phase oxidation, and prescribed properties of the background aerosols. Humidity swelling is estimated from the Köhler equation, and Mie calculations finally yield spectrally resolved aerosol optical parameters for 13 solar bands. The scheme is shown to give excellent agreement with nonparameterized DRF calculations for a wide range of situations. Using IPCC emission scenarios for the years 2000 and 2100, calculations with an atmospheric global cliamte model (AFCM) yield a global net anthropogenic DRF of -0.11 and 0.11 W m-2, respectively, when 90% of BC from biomass burning is assumed anthropogenic. In the 2000 scenario, the individual DRF due to sulfate and BC has separately been estimated to -0.29 and 0.19 W m-2, respectively. Our estimates of DRF by BC per BC mass burden are lower than earlier published estimates. Some sensitivity tests are included to investigate to what extent uncertain assumptions may influence these results.

  19. Mapping Global Forest Aboveground Biomass with Spaceborne LiDAR, Optical Imagery, and Forest Inventory Data

    Tianyu Hu


    Full Text Available As a large carbon pool, global forest ecosystems are a critical component of the global carbon cycle. Accurate estimations of global forest aboveground biomass (AGB can improve the understanding of global carbon dynamics and help to quantify anthropogenic carbon emissions. Light detection and ranging (LiDAR techniques have been proven that can accurately capture both horizontal and vertical forest structures and increase the accuracy of forest AGB estimation. In this study, we mapped the global forest AGB density at a 1-km resolution through the integration of ground inventory data, optical imagery, Geoscience Laser Altimeter System/Ice, Cloud, and Land Elevation Satellite data, climate surfaces, and topographic data. Over 4000 ground inventory records were collected from published literatures to train the forest AGB estimation model and validate the resulting global forest AGB product. Our wall-to-wall global forest AGB map showed that the global forest AGB density was 210.09 Mg/ha on average, with a standard deviation of 109.31 Mg/ha. At the continental level, Africa (333.34 ± 63.80 Mg/ha and South America (301.68 ± 67.43 Mg/ha had higher AGB density. The AGB density in Asia, North America and Europe were 172.28 ± 94.75, 166.48 ± 84.97, and 132.97 ± 50.70 Mg/ha, respectively. The wall-to-wall forest AGB map was evaluated at plot level using independent plot measurements. The adjusted coefficient of determination (R2 and root-mean-square error (RMSE between our predicted results and the validation plots were 0.56 and 87.53 Mg/ha, respectively. At the ecological zone level, the R2 and RMSE between our map and Intergovernmental Panel on Climate Change suggested values were 0.56 and 101.21 Mg/ha, respectively. Moreover, a comprehensive comparison was also conducted between our forest AGB map and other published regional AGB products. Overall, our forest AGB map showed good agreements with these regional AGB products, but some of the regional

  20. Simple and reusable fibre-to-chip interconnect with adjustable coupling eficiency

    Heideman, Rene; Lambeck, Paul; Parriaux, Olivier M.; Kley, Ernst-Bernhard


    A simple, efficient and reusable fiber-to-chip interconnect is presented. The interconnect is based on a V-groove (wet- chemically etched) in silicon, combined with a loose-mode Si3N4-channel waveguide. The loose-mode waveguide is adiabatically tapered to the integrated optical (sensor) circuitry.

  1. A global analysis of the elastic 3He scattering in the framework of the optical model

    Trost, H.J.


    The elastic scattering of 3 He at projetile energies from 10 MeV to 220 MeV on target nuclei in the mass range 10 to 208 is coherently studied in the framework of the simple optical model. It succeeds to obtain in the whole range a reasonable description by means of the usual Woods-Saxon potentials. This is illustrated by the presentation of a global mass and energy dependent potential. The light target nuclei are included in these systematics without the introduction of any special procedures. The omission of the antisymmetrization by the use of a purely local potential and the spin-orbit interaction have no important influence in the determination of the central potential. The cancelling of the discerte ambiguity is globally guaranted by the presented parametrization. The tradional sum rule 'number of projectile nucleons multiplied by nucleon-nucleus potential is equal to nucleus-nuclear potential' is not fulfilled. Starting from existing theoretical papers the properties of the global 3 He potential can be quantitatively explained. On the base of the 3 He potentials determined here and existing nucleon and deuteron potentials finally an approach to a projectile systematic is indicated. (orig.) [de

  2. Total Volcanic Stratospheric Aerosol Optical Depths and Implications for Global Climate Change

    Ridley, D. A.; Solomon, S.; Barnes, J. E.; Burlakov, V. D.; Deshler, T.; Dolgii, S. I.; Herber, A. B.; Nagai, T.; Neely, R. R., III; Nevzorov, A. V.; hide


    Understanding the cooling effect of recent volcanoes is of particular interest in the context of the post-2000 slowing of the rate of global warming. Satellite observations of aerosol optical depth above 15 km have demonstrated that small-magnitude volcanic eruptions substantially perturb incoming solar radiation. Here we use lidar, Aerosol Robotic Network, and balloon-borne observations to provide evidence that currently available satellite databases neglect substantial amounts of volcanic aerosol between the tropopause and 15 km at middle to high latitudes and therefore underestimate total radiative forcing resulting from the recent eruptions. Incorporating these estimates into a simple climate model, we determine the global volcanic aerosol forcing since 2000 to be 0.19 +/- 0.09W/sq m. This translates into an estimated global cooling of 0.05 to 0.12 C. We conclude that recent volcanic events are responsible for more post-2000 cooling than is implied by satellite databases that neglect volcanic aerosol effects below 15 km.

  3. Manufacturing of planar ceramic interconnects

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)


    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  4. A metallic buried interconnect process for through-wafer interconnection

    Ji, Chang-Hyeon; Herrault, Florian; Allen, Mark G


    In this paper, we present the design, fabrication process and experimental results of electroplated metal interconnects buried at the bottom of deep silicon trenches with vertical sidewalls. A manual spray-coating process along with a unique trench-formation process has been developed for the electroplating of a metal interconnection structure at the bottom surface of the deep trenches. The silicon etch process combines the isotropic dry etch process and conventional Bosch process to fabricate a deep trench with angled top-side edges and vertical sidewalls. The resulting trench structure, in contrast to the trenches fabricated by wet anisotropic etching, enables spray-coated photoresist patterning with good sidewall and top-side edge coverage while maintaining the ability to form a high-density array of deep trenches without excessive widening of the trench opening. A photoresist spray-coating process was developed and optimized for the formation of electroplating mold at the bottom of 300 µm deep trenches having vertical sidewalls. A diluted positive tone photoresist with relatively high solid content and multiple coating with baking between coating steps has been experimentally proven to provide high quality sidewall and edge coverage. To validate the buried interconnect approach, a three-dimensional daisy chain structure having a buried interconnect as the bottom connector and traces on the wafer surface as the top conductor has been designed and fabricated

  5. Global phenomenological optical model potential for nucleon-actinide reactions at energies up to 300 MeV

    Han Yinlu; Liang Haiying; Guo Hairui; Shen Qingbiao; Xu Yongli


    A set of new global phenomenological optical model potential parameters for the actinide region with incident nucleon energies from 1 keV up to 300 MeV is obtained. They are based on a smooth, unique functional form for the energy dependence of the potential depths and on physically constrained geometry parameters. The available experimental data including the neutron total cross sections, nonelastic cross sections, elastic scattering cross sections, elastic scattering angular distributions, and proton reaction cross sections and elastic scattering angular distributions of 232 Th and 238 U are used. The new nucleon global optical model potential parameters obtained are analyzed and used to analyze the experimental data of nucleon-actinide reactions. It is found that the present form of the global optical model potential could reproduce both the neutron and the proton experimental data.

  6. Cellular structures with interconnected microchannels

    Shaefer, Robert Shahram; Ghoniem, Nasr M.; Williams, Brian


    A method for fabricating a cellular tritium breeder component includes obtaining a reticulated carbon foam skeleton comprising a network of interconnected ligaments. The foam skeleton is then melt-infiltrated with a tritium breeder material, for example, lithium zirconate or lithium titanate. The foam skeleton is then removed to define a cellular breeder component having a network of interconnected tritium purge channels. In an embodiment the ligaments of the foam skeleton are enlarged by adding carbon using chemical vapor infiltration (CVI) prior to melt-infiltration. In an embodiment the foam skeleton is coated with a refractory material, for example, tungsten, prior to melt infiltration.

  7. The Global Influence of Cloud Optical Thickness on Terrestrial Carbon Uptake

    Zhu, P.; Cheng, S. J.; Keppel-Aleks, G.; Butterfield, Z.; Steiner, A. L.


    Clouds play a critical role in regulating Earth's climate. One important way is by changing the type and intensity of solar radiation reaching the Earth's surface, which impacts plant photosynthesis. Specifically, the presence of clouds modifies photosynthesis rates by influencing the amount of diffuse radiation as well as the spectral distribution of solar radiation. Satellite-derived cloud optical thickness (COT) may provide the observational constraint necessary to assess the role of clouds on ecosystems and terrestrial carbon uptake across the globe. Previous studies using ground-based observations at individual sites suggest that below a COT of 7, there is a greater increase in light use efficiency than at higher COT values, providing evidence for higher carbon uptake rates than expected given the reduction in radiation by clouds. However, the strength of the COT-terrestrial carbon uptake correlation across the globe remains unknown. In this study, we investigate the influence of COT on terrestrial carbon uptake on a global scale, which may provide insights into cloud conditions favorable for plant photosynthesis and improve our estimates of the land carbon sink. Global satellite-derived MODIS data show that tropical and subtropical regions tend to have COT values around or below the threshold during growing seasons. We find weak correlations between COT and GPP with Fluxnet MTE global GPP data, which may be due to the uncertainty of upscaling GPP from individual site measurements. Analysis with solar-induced fluorescence (SIF) as a proxy for GPP is also evaluated. Overall, this work constructs a global picture of the role of COT on terrestrial carbon uptake, including its temporal and spatial variations.

  8. Bi cluster-assembled interconnects produced using SU8 templates

    Partridge, J G; Matthewson, T; Brown, S A


    Bi clusters with an average diameter of 25 nm have been deposited from an inert gas aggregation source and assembled into thin-film interconnects which are formed between planar electrical contacts and supported on Si substrates passivated with Si 3 N 4 or thermally grown oxide. A layer of SU8 (a negative photoresist based on EPON SU-8 epoxy resin) is patterned using optical or electron-beam lithography, and it defines the position and dimensions of the cluster film. The conduction between the contacts is monitored throughout the deposition/assembly process, and subsequent I(V) characterization is performed in situ. Bi cluster-assembled interconnects have been fabricated with nanoscale widths and with up to 1:1 thickness:width aspect ratios. The conductivity of these interconnects has been increased, post-deposition, using a simple thermal annealing process

  9. Fusion-bonded fluidic interconnects

    Fazal, I.; Elwenspoek, Michael Curt


    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are

  10. Regulatory Issues Surrounding Merchant Interconnection

    Kuijlaars, Kees-Jan; Zwart, Gijsbert


    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections

  11. Regulatory Issues Surrounding Merchant Interconnection

    Kuijlaars, Kees-Jan; Zwart, Gijsbert [Office for Energy Regulation (DTe), The Hague (Netherlands)


    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections.

  12. Local Network Wideband Interconnection Alternatives.


    signal. 3.2.2 Limitations Although satellites offer the advantages of insensitivity to distance, point-to-multipoint communication capability and...Russell, the CATV franchisee for the town of Bedford, has not yit set rates for leasing channels on their network. If this network were interconnected

  13. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin


    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observ...

  14. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    Sabourin, D; Snakenborg, D; Dufva, M


    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications

  15. Carbon nanotube based VLSI interconnects analysis and design

    Kaushik, Brajesh Kumar


    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

  16. 47 CFR 90.477 - Interconnected systems.


    ... part and medical emergency systems in the 450-470 MHz band, interconnection will be permitted only... operating on frequencies in the bands below 800 MHz are not subject to the interconnection provisions of...

  17. Fusion-bonded fluidic interconnects

    Fazal, I; Elwenspoek, M C


    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 µm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 °C

  18. System interconnection studies using WASP

    Bayrak, Y [Turkish Electricity Generation and Transmission Corp., Ankara (Turkey)


    The aim of this paper is to describe the application of WASP as a modelling tool for determining the development of two electric systems with interconnections. A case study has been carried out to determine the possibilities of transfer of baseload energy between Turkey and a neighboring country. The objective of this case study is to determine the amount of energy that can be transferred, variations of Loss Probability (LOLP) and unserved energy, and the cost of additional generation with interconnection. The break-even cost will be determined to obtain the minimum charge rate at which TEAS (Turkish Electricity Generation-Transmission Corp.) needs to sell the energy in order to recover the costs. The minimum charge rate for both capacity and energy will be estimated without considering extra capacity additions, except for the ones needed by the Turkish system alone. (author). 2 figs, 3 tabs.

  19. Multilevel Dual Damascene copper interconnections

    Lakshminarayanan, S.

    Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400o

  20. Asynchronous decentralized method for interconnected electricity markets

    Huang, Anni; Joo, Sung-Kwan; Song, Kyung-Bin; Kim, Jin-Ho; Lee, Kisung


    This paper presents an asynchronous decentralized method to solve the optimization problem of interconnected electricity markets. The proposed method decomposes the optimization problem of combined electricity markets into individual optimization problems. The impact of neighboring markets' information is included in the objective function of the individual market optimization problem by the standard Lagrangian relaxation method. Most decentralized optimization methods use synchronous models of communication to exchange updated market information among markets during the iterative process. In this paper, however, the solutions of the individual optimization problems are coordinated through an asynchronous communication model until they converge to the global optimal solution of combined markets. Numerical examples are presented to demonstrate the advantages of the proposed asynchronous method over the existing synchronous methods. (author)

  1. Performance evaluation of multi-stratum resources integrated resilience for software defined inter-data center interconnect.

    Yang, Hui; Zhang, Jie; Zhao, Yongli; Ji, Yuefeng; Wu, Jialin; Lin, Yi; Han, Jianrui; Lee, Young


    Inter-data center interconnect with IP over elastic optical network (EON) is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resources integration among IP networks, optical networks and application stratums resources that allows to accommodate data center services. In view of this, this study extends to consider the service resilience in case of edge optical node failure. We propose a novel multi-stratum resources integrated resilience (MSRIR) architecture for the services in software defined inter-data center interconnect based on IP over EON. A global resources integrated resilience (GRIR) algorithm is introduced based on the proposed architecture. The MSRIR can enable cross stratum optimization and provide resilience using the multiple stratums resources, and enhance the data center service resilience responsiveness to the dynamic end-to-end service demands. The overall feasibility and efficiency of the proposed architecture is experimentally verified on the control plane of our OpenFlow-based enhanced SDN (eSDN) testbed. The performance of GRIR algorithm under heavy traffic load scenario is also quantitatively evaluated based on MSRIR architecture in terms of path blocking probability, resilience latency and resource utilization, compared with other resilience algorithms.

  2. Interconnect mechanisms in microelectronic packaging

    Roma, Maria Penafrancia C.

    Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire

  3. Driving Interconnected Networks to Supercriticality

    Filippo Radicchi


    Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

  4. 18 CFR 292.306 - Interconnection costs.


    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any electric...

  5. Globalization

    Tulio Rosembuj


    Full Text Available There is no singular globalization, nor is the result of an individual agent. We could start by saying that global action has different angles and subjects who perform it are different, as well as its objectives. The global is an invisible invasion of materials and immediate effects.

  6. Globalization

    Tulio Rosembuj


    There is no singular globalization, nor is the result of an individual agent. We could start by saying that global action has different angles and subjects who perform it are different, as well as its objectives. The global is an invisible invasion of materials and immediate effects.

  7. The Chandra Deep Field South as a test case for Global Multi Conjugate Adaptive Optics

    Portaluri, E.; Viotto, V.; Ragazzoni, R.; Gullieuszik, M.; Bergomi, M.; Greggio, D.; Biondi, F.; Dima, M.; Magrin, D.; Farinato, J.


    The era of the next generation of giant telescopes requires not only the advent of new technologies but also the development of novel methods, in order to exploit fully the extraordinary potential they are built for. Global Multi Conjugate Adaptive Optics (GMCAO) pursues this approach, with the goal of achieving good performance over a field of view of a few arcmin and an increase in sky coverage. In this article, we show the gain offered by this technique to an astrophysical application, such as the photometric survey strategy applied to the Chandra Deep Field South as a case study. We simulated a close-to-real observation of a 500 × 500 arcsec2 extragalactic deep field with a 40-m class telescope that implements GMCAO. We analysed mock K-band images of 6000 high-redshift (up to z = 2.75) galaxies therein as if they were real to recover the initial input parameters. We attained 94.5 per cent completeness for source detection with SEXTRACTOR. We also measured the morphological parameters of all the sources with the two-dimensional fitting tools GALFIT. The agreement we found between recovered and intrinsic parameters demonstrates GMCAO as a reliable approach to assist extremely large telescope (ELT) observations of extragalactic interest.

  8. In-memory interconnect protocol configuration registers

    Cheng, Kevin Y.; Roberts, David A.


    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  9. In-memory interconnect protocol configuration registers

    Cheng, Kevin Y.; Roberts, David A.


    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  10. Design of an Electro-Optic Modulator for High Speed Communications

    Espinoza, David

    The telecommunications and computer technology industries have been requiring higher communications speeds at all levels for devices, components and interconnected systems. Optical devices and optical interconnections are a viable alternative over other traditional technologies such as copper-based interconnections. Latency reductions can be achieved through the use of optical interconnections. Currently, a particular architecture for optical interconnections is being studied at the University of Colorado at Boulder in the EMT/NANO project, called Broadcast Optical Interconnects for Global Communication in Many-Core Chip Multiprocessor. As with most types of networks, including optical networks, one of the most important components are modulators. Therefore adequate design and fabrication techniques for modulators contribute to higher modulation rates which lead to improve the efficiency and reductions in the latency of the optical network. Electro-optical modulators are presented in this study as an alternative to achieve this end. In recent years, nonlinear optical (NLO) materials have been used for the fabrication of high-speed electro-optical modulators. Polymers doped with chromophores are an alternative among NLO materials because they can develop large electro-optic coefficients and low dielectric constants. These two factors are critical for achieving high-speed modulation rates. These polymer-based electro-optical modulators can be fabricated using standard laboratory techniques, such as polymer spin-coating onto substrates, UV bleaching to achieve a refractive index variation and poling techniques to align the chromophores in cured polymers. The design of the electro-optic modulators require the use of the optical parameters of the materials to be used. Therefore the characterization of these materials is a required previous step. This characterization is performed by the fabrication of chromophores-doped polymer samples and conducting transmission and

  11. Globalization

    Andru?cã Maria Carmen


    The field of globalization has highlighted an interdependence implied by a more harmonious understanding determined by the daily interaction between nations through the inducement of peace and the management of streamlining and the effectiveness of the global economy. For the functioning of the globalization, the developing countries that can be helped by the developed ones must be involved. The international community can contribute to the institution of the development environment of the gl...

  12. Global dependence of optical potential parameters for alpha particles with energies up to 80 MeV

    Kuterbekov, K.A.; Zholdybaev, T.K.; Sadykov, B.M.; Mukhambetzhan, A.; Kukhtina, I.N.; Penionzhkevich, Yu.Eh.


    Global (energy and mass) dependences of optical potential for α-particles with energies up to 80 MeV have been received. A Woods-Saxon form factor for macroscopic potential has been used. Energy and mass dependences of the semi-microscopic α-particle potential parameters have been investigated for the first time. In general, a good description of elastic and inelastic differential and total reactions cross sections for different nuclei using the revealed global parameters has been received within the framework of macroscopic and semi-microscopic approaches

  13. A Compilation of Global Bio-Optical in Situ Data for Ocean-Colour Satellite Applications

    Valente, Andre; Sathyendranath, Shubha; Brotus, Vanda; Groom, Steve; Grant, Michael; Taberner, Malcolm; Antoine, David; Arnone, Robert; Balch, William M.; Barker, Kathryn; hide


    A compiled set of in situ data is important to evaluate the quality of ocean-colour satellite-data records. Here we describe the data compiled for the validation of the ocean-colour products from the ESA Ocean Colour Climate Change Initiative (OC-CCI). The data were acquired from several sources (MOBY, BOUSSOLE, AERONET-OC, SeaBASS, NOMAD, MERMAID, AMT, ICES, HOT, GePCO), span between 1997 and 2012, and have a global distribution. Observations of the following variables were compiled: spectral remote-sensing reflectances, concentrations of chlorophyll a, spectral inherent optical properties and spectral diffuse attenuation coefficients. The data were from multi-project archives acquired via the open internet services or from individual projects, acquired directly from data providers. Methodologies were implemented for homogenisation, quality control and merging of all data. No changes were made to the original data, other than averaging of observations that were close in time and space, elimination of some points after quality control and conversion to a standard format. The final result is a merged table designed for validation of satellite-derived ocean-colour products and available in text format. Metadata of each in situ measurement (original source, cruise or experiment, principal investigator) were preserved throughout the work and made available in the final table. Using all the data in a validation exercise increases the number of matchups and enhances the representativeness of different marine regimes. By making available the metadata, it is also possible to analyse each set of data separately. The compiled data are available at doi:10.1594PANGAEA.854832 (Valente et al., 2015).

  14. Power inverter with optical isolation

    Duncan, Paul G.; Schroeder, John Alan


    An optically isolated power electronic power conversion circuit that includes an input electrical power source, a heat pipe, a power electronic switch or plurality of interconnected power electronic switches, a mechanism for connecting the switch to the input power source, a mechanism for connecting comprising an interconnecting cable and/or bus bar or plurality of interconnecting cables and/or input bus bars, an optically isolated drive circuit connected to the switch, a heat sink assembly upon which the power electronic switch or switches is mounted, an output load, a mechanism for connecting the switch to the output load, the mechanism for connecting including an interconnecting cable and/or bus bar or plurality of interconnecting cables and/or output bus bars, at least one a fiber optic temperature sensor mounted on the heat sink assembly, at least one fiber optic current sensor mounted on the load interconnection cable and/or output bus bar, at least one fiber optic voltage sensor mounted on the load interconnection cable and/or output bus bar, at least one fiber optic current sensor mounted on the input power interconnection cable and/or input bus bar, and at least one fiber optic voltage sensor mounted on the input power interconnection cable and/or input bus bar.

  15. Optical Remote Sensing Algorithm Validation using High-Frequency Underway Biogeochemical Measurements in Three Large Global River Systems

    Kuhn, C.; Richey, J. E.; Striegl, R. G.; Ward, N.; Sawakuchi, H. O.; Crawford, J.; Loken, L. C.; Stadler, P.; Dornblaser, M.; Butman, D. E.


    More than 93% of the world's river-water volume occurs in basins impacted by large dams and about 43% of river water discharge is impacted by flow regulation. Human land use also alters nutrient and carbon cycling and the emission of carbon dioxide from inland reservoirs. Increased water residence times and warmer temperatures in reservoirs fundamentally alter the physical settings for biogeochemical processing in large rivers, yet river biogeochemistry for many large systems remains undersampled. Satellite remote sensing holds promise as a methodology for responsive regional and global water resources management. Decades of ocean optics research has laid the foundation for the use of remote sensing reflectance in optical wavelengths (400 - 700 nm) to produce satellite-derived, near-surface estimates of phytoplankton chlorophyll concentration. Significant improvements between successive generations of ocean color sensors have enabled the scientific community to document changes in global ocean productivity (NPP) and estimate ocean biomass with increasing accuracy. Despite large advances in ocean optics, application of optical methods to inland waters has been limited to date due to their optical complexity and small spatial scale. To test this frontier, we present a study evaluating the accuracy and suitability of empirical inversion approaches for estimating chlorophyll-a, turbidity and temperature for the Amazon, Columbia and Mississippi rivers using satellite remote sensing. We demonstrate how riverine biogeochemical measurements collected at high frequencies from underway vessels can be used as in situ matchups to evaluate remotely-sensed, near-surface temperature, turbidity, chlorophyll-a derived from the Landsat 8 (NASA) and Sentinel 2 (ESA) satellites. We investigate the use of remote sensing water reflectance to infer trophic status as well as tributary influences on the optical characteristics of the Amazon, Mississippi and Columbia rivers.

  16. Fiber bundle probes for interconnecting miniaturized medical imaging devices

    Zamora, Vanessa; Hofmann, Jens; Marx, Sebastian; Herter, Jonas; Nguyen, Dennis; Arndt-Staufenbiel, Norbert; Schröder, Henning


    Miniaturization of medical imaging devices will significantly improve the workflow of physicians in hospitals. Photonic integrated circuit (PIC) technologies offer a high level of miniaturization. However, they need fiber optic interconnection solutions for their functional integration. As part of European funded project (InSPECT) we investigate fiber bundle probes (FBPs) to be used as multi-mode (MM) to single-mode (SM) interconnections for PIC modules. The FBP consists of a set of four or seven SM fibers hexagonally distributed and assembled into a holder that defines a multicore connection. Such a connection can be used to connect MM fibers, while each SM fiber is attached to the PIC module. The manufacturing of these probes is explored by using well-established fiber fusion, epoxy adhesive, innovative adhesive and polishing techniques in order to achieve reliable, low-cost and reproducible samples. An innovative hydrofluoric acid-free fiber etching technology has been recently investigated. The preliminary results show that the reduction of the fiber diameter shows a linear behavior as a function of etching time. Different etch rate values from 0.55 μm/min to 2.3 μm/min were found. Several FBPs with three different type of fibers have been optically interrogated at wavelengths of 630nm and 1550nm. Optical losses are found of approx. 35dB at 1550nm for FBPs composed by 80μm fibers. Although FBPs present moderate optical losses, they might be integrated using different optical fibers, covering a broad spectral range required for imaging applications. Finally, we show the use of FBPs as promising MM-to-SM interconnects for real-world interfacing to PIC's.

  17. Interconnect fatigue design for terrestrial photovoltaic modules

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.


    The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

  18. Multi-net optimization of VLSI interconnect

    Moiseev, Konstantin; Wimer, Shmuel


    This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

  19. FDTD technique based crosstalk analysis of bundled SWCNT interconnects

    Duksh, Yograj Singh; Kaushik, Brajesh Kumar; Agarwal, Rajendra P.


    The equivalent electrical circuit model of a bundled single-walled carbon nanotube based distributed RLC interconnects is employed for the crosstalk analysis. The accurate time domain analysis and crosstalk effect in the VLSI interconnect has emerged as an essential design criteria. This paper presents a brief description of the numerical method based finite difference time domain (FDTD) technique that is intended for estimation of voltages and currents on coupled transmission lines. For the FDTD implementation, the stability of the proposed model is strictly restricted by the Courant condition. This method is used for the estimation of crosstalk induced propagation delay and peak voltage in lossy RLC interconnects. Both functional and dynamic crosstalk effects are analyzed in the coupled transmission line. The effect of line resistance on crosstalk induced delay, and peak voltage under dynamic and functional crosstalk is also evaluated. The FDTD analysis and the SPICE simulations are carried out at 32 nm technology node for the global interconnects. It is observed that the analytical results obtained using the FDTD technique are in good agreement with the SPICE simulation results. The crosstalk induced delay, propagation delay, and peak voltage obtained using the FDTD technique shows average errors of 4.9%, 3.4% and 0.46%, respectively, in comparison to SPICE. (paper)

  20. Interconnect rise time in superconducting integrating circuits

    Preis, D.; Shlager, K.


    The influence of resistive losses on the voltage rise time of an integrated-circuit interconnection is reported. A distribution-circuit model is used to present the interconnect. Numerous parametric curves are presented based on numerical evaluation of the exact analytical expression for the model's transient response. For the superconducting case in which the series resistance of the interconnect approaches zero, the step-response rise time is longer but signal strength increases significantly

  1. Optics

    Mathieu, Jean Paul


    Optics, Parts 1 and 2 covers electromagnetic optics and quantum optics. The first part of the book examines the various of the important properties common to all electromagnetic radiation. This part also studies electromagnetic waves; electromagnetic optics of transparent isotropic and anisotropic media; diffraction; and two-wave and multi-wave interference. The polarization states of light, the velocity of light, and the special theory of relativity are also examined in this part. The second part is devoted to quantum optics, specifically discussing the classical molecular theory of optical p

  2. Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

    Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver


    A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment. Integrated fluidic interconnections appear to be a good solution for interconn...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

  3. Globalization

    Plum, Maja

    Globalization is often referred to as external to education - a state of affair facing the modern curriculum with numerous challenges. In this paper it is examined as internal to curriculum; analysed as a problematization in a Foucaultian sense. That is, as a complex of attentions, worries, ways...... of reasoning, producing curricular variables. The analysis is made through an example of early childhood curriculum in Danish Pre-school, and the way the curricular variable of the pre-school child comes into being through globalization as a problematization, carried forth by the comparative practices of PISA...

  4. Globalization

    F. Gerard Adams


    The rapid globalization of the world economy is causing fundamental changes in patterns of trade and finance. Some economists have argued that globalization has arrived and that the world is “flat†. While the geographic scope of markets has increased, the author argues that new patterns of trade and finance are a result of the discrepancies between “old†countries and “new†. As the differences are gradually wiped out, particularly if knowledge and technology spread worldwide, the t...

  5. Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

    Sabourin, David; Snakenborg, Detlef; Dufva, Martin


    We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

  6. Recent results in the development of a global medium-energy nucleon-nucleus optical-model potential

    Madland, D.G.


    Initial results are presented for the determination of a global medium-energy nucleon-nucleus phenomenological optical-model potential using a relativistic Schroedinger representation. The starting point for this work is the global phenomenological optical-model potential of Schwandt /ital et al./, which is based on measured elastic scattering cross sections and analyzing power for polarized protons ranging from 80 to 180 MeV. This potential is optimally modified to reproduce experimental proton reaction cross sections as a function of energy, while allowing only minimal deterioration in the fits to the elastic cross sections and analyzing powers. Further modifications in the absorptive potential were found necessary to extrapolate the modified potential to higher energies. The final potential is converted to a neutron-nucleus potential by use of standard Lane model assumptions and by accounting approximately for the Coulomb correction. Comparisons of measured and calculated proton reaction and neutron total cross sections are presented for 27 Al, 56 Fe, and 208 Pb. Medium-energy optical-model potentials for complex projectiles are briefly discussed in an appendix. 7 refs., 20 figs

  7. Network interconnections: an architectural reference model

    Butscher, B.; Lenzini, L.; Morling, R.; Vissers, C.A.; Popescu-Zeletin, R.; van Sinderen, Marten J.; Heger, D.; Krueger, G.; Spaniol, O.; Zorn, W.


    One of the major problems in understanding the different approaches in interconnecting networks of different technologies is the lack of reference to a general model. The paper develops the rationales for a reference model of network interconnection and focuses on the architectural implications for

  8. Epidemics in interconnected small-world networks

    Liu, M.; Li, D.; Qin, P.; Liu, C.; Wang, H.; Wang, F.


    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks

  9. Colligation, Or the Logical Inference of Interconnection

    Falster, Peter


    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in pure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  10. Colligation or, The Logical Inference of Interconnection

    Franksen, Ole Immanuel; Falster, Peter


    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  11. Optics

    Fincham, W H A


    Optics: Ninth Edition Optics: Ninth Edition covers the work necessary for the specialization in such subjects as ophthalmic optics, optical instruments and lens design. The text includes topics such as the propagation and behavior of light; reflection and refraction - their laws and how different media affect them; lenses - thick and thin, cylindrical and subcylindrical; photometry; dispersion and color; interference; and polarization. Also included are topics such as diffraction and holography; the limitation of beams in optical systems and its effects; and lens systems. The book is recommen

  12. Algorithm for Optimizing Bipolar Interconnection Weights with Applications in Associative Memories and Multitarget Classification

    Chang, Shengjiang; Wong, Kwok-Wo; Zhang, Wenwei; Zhang, Yanxin


    An algorithm for optimizing a bipolar interconnection weight matrix with the Hopfield network is proposed. The effectiveness of this algorithm is demonstrated by computer simulation and optical implementation. In the optical implementation of the neural network the interconnection weights are biased to yield a nonnegative weight matrix. Moreover, a threshold subchannel is added so that the system can realize, in real time, the bipolar weighted summation in a single channel. Preliminary experimental results obtained from the applications in associative memories and multitarget classification with rotation invariance are shown.

  13. Mapping of interconnection of climate risks

    Yokohata, Tokuta; Tanaka, Katsumasa; Nishina, Kazuya; Takanashi, Kiyoshi; Emori, Seita; Kiguchi, Masashi; Iseri, Yoshihiko; Honda, Yasushi; Okada, Masashi; Masaki, Yoshimitsu; Yamamoto, Akitomo; Shigemitsu, Masahito; Yoshimori, Masakazu; Sueyoshi, Tetsuo; Iwase, Kenta; Hanasaki, Naota; Ito, Akihiko; Sakurai, Gen; Iizumi, Toshichika; Oki, Taikan


    Anthropogenic climate change possibly causes various impacts on human society and ecosystem. Here, we call possible damages or benefits caused by the future climate change as "climate risks". Many climate risks are closely interconnected with each other by direct cause-effect relationship. In this study, the major climate risks are comprehensively summarized based on the survey of studies in the literature using IPCC AR5 etc, and their cause-effect relationship are visualized by a "network diagram". This research is conducted by the collaboration between the experts of various fields, such as water, energy, agriculture, health, society, and eco-system under the project called ICA-RUS (Integrated Climate Assessment - Risks, Uncertainties and Society). First, the climate risks are classified into 9 categories (water, energy, food, health, disaster, industry, society, ecosystem, and tipping elements). Second, researchers of these fields in our project survey the research articles, and pick up items of climate risks, and possible cause-effect relationship between the risk items. A long list of the climate risks is summarized into ~130, and that of possible cause-effect relationship between the risk items is summarized into ~300, because the network diagram would be illegible if the number of the risk items and cause-effect relationship is too large. Here, we only consider the risks that could occur if climate mitigation policies are not conducted. Finally, the chain of climate risks is visualized by creating a "network diagram" based on a network graph theory (Fruchtman & Reingold algorithm). Through the analysis of network diagram, we find that climate risks at various sectors are closely related. For example, the decrease in the precipitation under the global climate change possibly causes the decrease in river runoff and the decrease in soil moisture, which causes the changes in crop production. The changes in crop production can have an impact on society by

  14. Global Lightning Climatology from the Tropical Rainfall Measuring Mission (TRMM), Lightning Imaging Sensor (LIS) and the Optical Transient Detector (OTD)

    Cecil, Daniel J.; Buechler, Dennis E.; Blakeslee, Richard J.


    The Tropical Rainfall Measuring Mission (TRMM) Lightning Imaging Sensor (LIS) has been collecting observations of total lightning in the global tropics and subtropics (roughly 38 deg S - 38 deg N) since December 1997. A similar instrument, the Optical Transient Detector, operated from 1995-2000 on another low earth orbit satellite that also saw high latitudes. Lightning data from these instruments have been used to create gridded climatologies and time series of lightning flash rate. These include a 0.5 deg resolution global annual climatology, and lower resolution products describing the annual cycle and the diurnal cycle. These products are updated annually. Results from the update through 2013 will be shown at the conference. The gridded products are publicly available for download. Descriptions of how each product can be used will be discussed, including strengths, weaknesses, and caveats about the smoothing and sampling used in various products.

  15. Optics

    Fincham, W H A


    Optics: Eighth Edition covers the work necessary for the specialization in such subjects as ophthalmic optics, optical instruments and lens design. The text includes topics such as the propagation and behavior of light; reflection and refraction - their laws and how different media affect them; lenses - thick and thin, cylindrical and subcylindrical; photometry; dispersion and color; interference; and polarization. Also included are topics such as diffraction and holography; the limitation of beams in optical systems and its effects; and lens systems. The book is recommended for engineering st


    Fialkov, Anastasia; Loeb, Abraham, E-mail:, E-mail: [Department of Astronomy, Harvard University, 60 Garden Street, MS-51, Cambridge, MA 02138 (United States)


    As a result of our limited data on reionization, the total optical depth for electron scattering, τ, limits precision measurements of cosmological parameters from the Cosmic Microwave Background (CMB). It was recently shown that the predicted 21 cm signal of neutral hydrogen contains enough information to reconstruct τ with sub-percent accuracy, assuming that the neutral gas was much hotter than the CMB throughout the entire epoch of reionization (EoR). Here we relax this assumption and use the global 21 cm signal alone to extract τ for realistic X-ray heating scenarios. We test our model-independent approach using mock data for a wide range of ionization and heating histories and show that an accurate measurement of the reionization optical depth at a sub-percent level is possible in most of the considered scenarios even when heating is not saturated during the EoR, assuming that the foregrounds are mitigated. However, we find that in cases where heating sources had hard X-ray spectra and their luminosity was close to or lower than what is predicted based on low-redshift observations, the global 21 cm signal alone is not a good tracer of the reionization history.


    Fialkov, Anastasia; Loeb, Abraham


    As a result of our limited data on reionization, the total optical depth for electron scattering, τ, limits precision measurements of cosmological parameters from the Cosmic Microwave Background (CMB). It was recently shown that the predicted 21 cm signal of neutral hydrogen contains enough information to reconstruct τ with sub-percent accuracy, assuming that the neutral gas was much hotter than the CMB throughout the entire epoch of reionization (EoR). Here we relax this assumption and use the global 21 cm signal alone to extract τ for realistic X-ray heating scenarios. We test our model-independent approach using mock data for a wide range of ionization and heating histories and show that an accurate measurement of the reionization optical depth at a sub-percent level is possible in most of the considered scenarios even when heating is not saturated during the EoR, assuming that the foregrounds are mitigated. However, we find that in cases where heating sources had hard X-ray spectra and their luminosity was close to or lower than what is predicted based on low-redshift observations, the global 21 cm signal alone is not a good tracer of the reionization history

  18. SSC [Superconducting Super Collider] magnet mechanical interconnections

    Bossert, R.C.; Niemann, R.C.; Carson, J.A.; Ramstein, W.L.; Reynolds, M.P.; Engler, N.H.


    Installation of superconducting accelerator dipole and quadrupole magnets and spool pieces in the SSC tunnel requires the interconnection of the cryostats. The connections are both of an electrical and mechanical nature. The details of the mechanical connections are presented. The connections include piping, thermal shields and insulation. There are seven piping systems to be connected. These systems must carry cryogenic fluids at various pressures or maintain vacuum and must be consistently leak tight. The interconnection region must be able to expand and contract as magnets change in length while cooling and warming. The heat leak characteristics of the interconnection region must be comparable to that of the body of the magnet. Rapid assembly and disassembly is required. The magnet cryostat development program is discussed. Results of quality control testing are reported. Results of making full scale interconnections under magnet test situations are reviewed. 11 figs., 4 tabs

  19. Variation Tolerant On-Chip Interconnects

    Nigussie, Ethiopia Enideg


    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  20. The Interconnections of the LHC Cryomagnets

    Jacquemod, A; Skoczen, Blazej; Tock, J P


    The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

  1. Recent Development of SOFC Metallic Interconnect

    Wu JW, Liu XB


    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  2. A Methodology for Physical Interconnection Decisions of Next Generation Transport Networks

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Madsen, Ole Brun


    of possibilities when designing the physical network interconnection. This paper develops and presents a methodology in order to deal with aspects related to the interconnection problem of optical transport networks. This methodology is presented as independent puzzle pieces, covering diverse topics going from......The physical interconnection for optical transport networks has critical relevance in the overall network performance and deployment costs. As telecommunication services and technologies evolve, the provisioning of higher capacity and reliability levels is becoming essential for the proper...... development of Next Generation Networks. Currently, there is a lack of specific procedures that describe the basic guidelines to design such networks better than "best possible performance for the lowest investment". Therefore, the research from different points of view will allow a broader space...

  3. Compound semiconductor optical waveguide switch

    Spahn, Olga B.; Sullivan, Charles T.; Garcia, Ernest J.


    An optical waveguide switch is disclosed which is formed from III-V compound semiconductors and which has a moveable optical waveguide with a cantilevered portion that can be bent laterally by an integral electrostatic actuator to route an optical signal (i.e. light) between the moveable optical waveguide and one of a plurality of fixed optical waveguides. A plurality of optical waveguide switches can be formed on a common substrate and interconnected to form an optical switching network.

  4. Effective aerosol optical depth from pyranometer measurements of surface solar radiation (global radiation) at Thessaloniki, Greece

    Lindfors, A. V.; Kouremeti, N.; Arola, A.; Kazadzis, S.; Bais, A. F.; Laaksonen, A.


    Pyranometer measurements of the solar surface radiation (SSR) are available at many locations worldwide, often as long time series covering several decades into the past. These data constitute a potential source of information on the atmospheric aerosol load. Here, we present a method for estimating the aerosol optical depth (AOD) using pyranometer measurements of the SSR together with total water vapor column information. The method, which is based on radiative transfer simulations, w...

  5. Epidemics spreading in interconnected complex networks

    Wang, Y.; Xiao, G.


    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  6. Epidemics spreading in interconnected complex networks

    Wang, Y. [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Institute of High Performance Computing, Agency for Science, Technology and Research (A-STAR), Singapore 138632 (Singapore); Xiao, G., E-mail: [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)


    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  7. Global validation of two-channel AVHRR aerosol optical thickness retrievals over the oceans

    Liu Li; Mishchenko, Michael I.; Geogdzhayev, Igor; Smirnov, Alexander; Sakerin, Sergey M.; Kabanov, Dmitry M.; Ershov, Oleg A.


    The paper presents validation results for the aerosol optical thickness derived by applying a two-channel retrieval algorithm to Advanced Very High Resolution Radiometer (AVHRR) radiance data. The satellite retrievals are compared with ship-borne sun-photometer results. The comparison of spatial and temporal statistics of the AVHRR results and the ship measurements shows a strong correlation. The satellite retrieval results obtained with the original algorithm for a wavelength of 0.55μm are systematically higher than the sun-photometer measurements in the cases of low aerosol loads. The ensemble averaged satellite-retrieved optical thickness overestimates the ensemble averaged sun-photometer data by about 11% with a random error of about 0.04. Increasing the diffuse component of the ocean surface reflectance from 0.002 to 0.004 in the AVHRR algorithm produces a better match, with the ensemble-averaged AVHRR-retrieved optical thickness differing by only about 3.6% from the sun-photometer truth and having a small offset of 0.03

  8. Global Crossing optical infrastructure is critical part of next-generation Internet


    "Global Crossing announced today that it has signed a contract with the Netherlands National Research Network, SURFnet, to provide multi-Gigabit wavelength connectivity between Amsterdam's NetherLight and Switzerland's CERN in Geneva for use in tests that optimise how research networks are used" (1 page).

  9. The high speed interconnect system architecture and operation

    Anderson, Steven C.

    The design and operation of a fiber-optic high-speed interconnect system (HSIS) being developed to meet the requirements of future avionics and flight-control hardware with distributed-system architectures are discussed. The HSIS is intended for 100-Mb/s operation of a local-area network with up to 256 stations. It comprises a bus transmission system (passive star couplers and linear media linked by active elements) and network interface units (NIUs). Each NIU is designed to perform the physical, data link, network, and transport functions defined by the ISO OSI Basic Reference Model (1982 and 1983) and incorporates a fiber-optic transceiver, a high-speed protocol based on the SAE AE-9B linear token-passing data bus (1986), and a specialized application interface unit. The operating modes and capabilities of HSIS are described in detail and illustrated with diagrams.

  10. Validation of high-resolution aerosol optical thickness simulated by a global non-hydrostatic model against remote sensing measurements

    Goto, Daisuke; Sato, Yousuke; Yashiro, Hisashi; Suzuki, Kentaroh; Nakajima, Teruyuki


    A high-performance computing resource allows us to conduct numerical simulations with a horizontal grid spacing that is sufficiently high to resolve cloud systems. The cutting-edge computational capability, which was provided by the K computer at RIKEN in Japan, enabled the authors to perform long-term, global simulations of air pollutions and clouds with unprecedentedly high horizontal resolutions. In this study, a next generation model capable of simulating global air pollutions with O(10 km) grid spacing by coupling an atmospheric chemistry model to the Non-hydrostatic Icosahedral Atmospheric Model (NICAM) was performed. Using the newly developed model, month-long simulations for July were conducted with 14 km grid spacing on the K computer. Regarding the global distributions of aerosol optical thickness (AOT), it was found that the correlation coefficient (CC) between the simulation and AERONET measurements was approximately 0.7, and the normalized mean bias was -10%. The simulated AOT was also compared with satellite-retrieved values; the CC was approximately 0.6. The radiative effects due to each chemical species (dust, sea salt, organics, and sulfate) were also calculated and compared with multiple measurements. As a result, the simulated fluxes of upward shortwave radiation at the top of atmosphere and the surface compared well with the observed values, whereas those of downward shortwave radiation at the surface were underestimated, even if all aerosol components were considered. However, the aerosol radiative effects on the downward shortwave flux at the surface were found to be as high as 10 W/m2 in a global scale; thus, simulated aerosol distributions can strongly affect the simulated air temperature and dynamic circulation.

  11. Two-dimensional optoelectronic interconnect-processor and its operational bit error rate

    Liu, J. Jiang; Gollsneider, Brian; Chang, Wayne H.; Carhart, Gary W.; Vorontsov, Mikhail A.; Simonis, George J.; Shoop, Barry L.


    Two-dimensional (2-D) multi-channel 8x8 optical interconnect and processor system were designed and developed using complementary metal-oxide-semiconductor (CMOS) driven 850-nm vertical-cavity surface-emitting laser (VCSEL) arrays and the photodetector (PD) arrays with corresponding wavelengths. We performed operation and bit-error-rate (BER) analysis on this free-space integrated 8x8 VCSEL optical interconnects driven by silicon-on-sapphire (SOS) circuits. Pseudo-random bit stream (PRBS) data sequence was used in operation of the interconnects. Eye diagrams were measured from individual channels and analyzed using a digital oscilloscope at data rates from 155 Mb/s to 1.5 Gb/s. Using a statistical model of Gaussian distribution for the random noise in the transmission, we developed a method to compute the BER instantaneously with the digital eye-diagrams. Direct measurements on this interconnects were also taken on a standard BER tester for verification. We found that the results of two methods were in the same order and within 50% accuracy. The integrated interconnects were investigated in an optoelectronic processing architecture of digital halftoning image processor. Error diffusion networks implemented by the inherently parallel nature of photonics promise to provide high quality digital halftoned images.

  12. Investigation of PAM-4 for extending reach in data center interconnect applications

    Vegas Olmos, Juan José; Teipen, Brian; Eiselt, Nicklas


    Optical four-level pulse amplitude modulation (PAM-4) is being widely studied for various short-reach optical interfaces, motivated by the need to keep cost structure low, and to increase link capacity despite various constraints in component bandwidth. When considering PAM-4 in applications...... with reach significantly greater than 10km, such as in extended data center interconnects which require optical amplification, impairments such as chromatic dispersion, optical filtering, and ASE must be controlled. We investigate and report on requirements of PAM-4 for extended-reach, data center...

  13. Eating on an interconnected planet

    MacDonald, Graham K.


    Calls to boost agricultural production in order to meet the demands of a growing global population are now commonplace. Yet, depending on where productivity changes and population growth occur, international trade could be increasingly necessary in the transfer of food from farms to consumers. Fader et al (2013) offer a nuanced view of this spatial disconnect and its food security implications by considering a valuable thought experiment: what countries could foreseeably meet their food requirements from internal production alone circa 2000 and for contrasting scenarios in 2050? They investigate the extent to which available renewable water and land resources constrain domestic per capita crop production, assuming current as well as broadly improved yields. The findings convey an intuitive, though often overlooked, point that population growth is likely to increase the reliance of certain regions on food imports unless substantial productivity improvements are realized. It is unlikely that any nation would be compelled to produce all of its food domestically, but reflecting on potential food self-sufficiency is a worthwhile endeavor. Importing crops may be matter of choice, but also one of necessity if available land, water, and yields limit production. Dependence on food imports can involve uncertainty: production shortfalls arising from drought and other factors have been associated with price volatility—or even restrictions on crop exports—posing challenges to countries anticipating consistent import arrangements (Headey 2011). Compounding this uncertainty is that a relatively small number of countries produce the bulk of staple crops for global markets. Just eight countries comprising 11% of the global population produced, on average, 70% of cereal exports during the past decade (FAO 2013). Although trade networks are dynamic, some net-importing countries have developed entrenched relationships with particular producers that entail very large crop transfers

  14. Two-step reconstruction method using global optimization and conjugate gradient for ultrasound-guided diffuse optical tomography.

    Tavakoli, Behnoosh; Zhu, Quing


    Ultrasound-guided diffuse optical tomography (DOT) is a promising method for characterizing malignant and benign lesions in the female breast. We introduce a new two-step algorithm for DOT inversion in which the optical parameters are estimated with the global optimization method, genetic algorithm. The estimation result is applied as an initial guess to the conjugate gradient (CG) optimization method to obtain the absorption and scattering distributions simultaneously. Simulations and phantom experiments have shown that the maximum absorption and reduced scattering coefficients are reconstructed with less than 10% and 25% errors, respectively. This is in contrast with the CG method alone, which generates about 20% error for the absorption coefficient and does not accurately recover the scattering distribution. A new measure of scattering contrast has been introduced to characterize benign and malignant breast lesions. The results of 16 clinical cases reconstructed with the two-step method demonstrates that, on average, the absorption coefficient and scattering contrast of malignant lesions are about 1.8 and 3.32 times higher than the benign cases, respectively.

  15. Leaf optical properties shed light on foliar trait variability at individual to global scales

    Shiklomanov, A. N.; Serbin, S.; Dietze, M.


    Recent syntheses of large trait databases have contributed immensely to our understanding of drivers of plant function at the global scale. However, the global trade-offs revealed by such syntheses, such as the trade-off between leaf productivity and resilience (i.e. "leaf economics spectrum"), are often absent at smaller scales and fail to correlate with actual functional limitations. An improved understanding of how traits vary within communities, species, and individuals is critical to accurate representations of vegetation ecophysiology and ecological dynamics in ecosystem models. Spectral data from both field observations and remote sensing platforms present a potentially rich and widely available source of information on plant traits. In particular, the inversion of physically-based radiative transfer models (RTMs) is an effective and general method for estimating plant traits from spectral measurements. Here, we apply Bayesian inversion of the PROSPECT leaf RTM to a large database of field spectra and plant traits spanning tropical, temperate, and boreal forests, agricultural plots, arid shrublands, and tundra to identify dominant sources of variability and characterize trade-offs in plant functional traits. By leveraging such a large and diverse dataset, we re-calibrate the empirical absorption coefficients underlying the PROSPECT model and expand its scope to include additional leaf biochemical components, namely leaf nitrogen content. Our work provides a key methodological contribution as a physically-based retrieval of leaf nitrogen from remote sensing observations, and provides substantial insights about trait trade-offs related to plant acclimation, adaptation, and community assembly.

  16. Carbon nanotube and graphene nanoribbon interconnects

    Das, Debaprasad


    "The book, Caron Nanotube and Graphene Nanoribbon Interconnects, authored by Drs. Debapraad Das and Hafizur Rahaman serves as a good source of material on CNT and GNR interconnects for readers who wish to get into this area and also for practicing engineers who would like to be updated in advances of this field."-Prof. Ashok Srivastava, Louisiana State University, Baton Rouge, USA"Mathematical analysis included in each and every chapter is the main strength of the materials. ... The book is very precise and useful for those who are working in this area. ... highly focused, very compact, and easy to apply. ... This book depicts a detailed analysis and modelling of carbon nanotube and graphene nanoribbon interconnects. The book also covers the electrical circuit modelling of carbon nanotubes and graphene nanoribbons."-Prof. Chandan Kumar Sarkar, Jadavpur University, Kolkata, India.

  17. Packaging and interconnection for superconductive circuitry

    Anacker, W.


    A three dimensional microelectronic module packaged for reduced signal propagation delay times including a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon is described. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconnection wiring to contact the lands of the circuit carrying means. Further interconnecting wiring may take the form of integrated circuit wiring on the reverse side of the supporting means. The low heat dissipation of the superconductive circuitry allows the circuit carrying means to be spaced approximately no less than 30 mils apart. The three dimensional arrangement provides lower random propagation delays than would a planar array of circuits

  18. Locating the Global: Schooling in an Interconnected World

    Hull, Glynda; Hellmich, Emily


    Background: Educators in the United States and internationally have become increasingly interested in incorporating international perspectives into curricula, programs, and policy (Hayden, 2011; Parker, 2011). Rooted in a long history of international education (Dolby & Rahman, 2008), these efforts have been described variously as…

  19. Millimeter-wave interconnects for microwave-frequency quantum machines

    Pechal, Marek; Safavi-Naeini, Amir H.


    Superconducting microwave circuits form a versatile platform for storing and manipulating quantum information. A major challenge to further scalability is to find approaches for connecting these systems over long distances and at high rates. One approach is to convert the quantum state of a microwave circuit to optical photons that can be transmitted over kilometers at room temperature with little loss. Many proposals for electro-optic conversion between microwave and optics use optical driving of a weak three-wave mixing nonlinearity to convert the frequency of an excitation. Residual absorption of this optical pump leads to heating, which is problematic at cryogenic temperatures. Here we propose an alternative approach where a nonlinear superconducting circuit is driven to interconvert between microwave-frequency (7 ×109 Hz) and millimeter-wave-frequency photons (3 ×1011 Hz). To understand the potential for quantum state conversion between microwave and millimeter-wave photons, we consider the driven four-wave mixing quantum dynamics of nonlinear circuits. In contrast to the linear dynamics of the driven three-wave mixing converters, the proposed four-wave mixing converter has nonlinear decoherence channels that lead to a more complex parameter space of couplings and pump powers that we map out. We consider physical realizations of such converter circuits by deriving theoretically the upper bound on the maximum obtainable nonlinear coupling between any two modes in a lossless circuit, and synthesizing an optimal circuit based on realistic materials that saturates this bound. Our proposed circuit dissipates less than 10-9 times the energy of current electro-optic converters per qubit. Finally, we outline the quantum link budget for optical, microwave, and millimeter-wave connections, showing that our approach is viable for realizing interconnected quantum processors for intracity or quantum data center environments.

  20. Laser printing of 3D metallic interconnects

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto


    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  1. The Interconnection between Processes of State and Class Formation: Problems of Conceptualisation

    G. van Benthem van den Bergh (Godfried)


    textabstractIn recent years a great deal of attention has been given to the exploitative character of the political and economic relations between the rich industrial ('developed') countries and the poor agrarian ('underdeveloped' or 'developing') countries, as interconnected parts of the global

  2. Regulate or deregulate. Influencing network interconnection charges

    Van De Wielle, B.


    We study the choice between regulating interconnection charges or delegating their determination to the operators, both in a non-mature and a mature market. Three regulatory regimes are considered: full, cost-based and bill-and-keep. Delegation corresponds to bargaining about the interconnection charges using the regulatory schemes as disagreement outcomes. Applying regulation benefits the consumers. Under full regulation, access charges account for asymmetries and allow a unique Ramsey price. Delegation benefits the operators. In a mature market delegation robs the government of any market influence. In a non-mature market government preferences coincide with those of the largest operator and are disadvantageous for entry.

  3. Effective aerosol optical depth from pyranometer measurements of surface solar radiation (global radiation at Thessaloniki, Greece

    A. V. Lindfors


    Full Text Available Pyranometer measurements of the solar surface radiation (SSR are available at many locations worldwide, often as long time series covering several decades into the past. These data constitute a potential source of information on the atmospheric aerosol load. Here, we present a method for estimating the aerosol optical depth (AOD using pyranometer measurements of the SSR together with total water vapor column information. The method, which is based on radiative transfer simulations, was developed and tested using recent data from Thessaloniki, Greece. The effective AOD calculated using this method was found to agree well with co-located AERONET measurements, exhibiting a correlation coefficient of 0.9 with 2/3 of the data found within ±20% or ±0.05 of the AERONET AOD. This is similar to the performance of current satellite aerosol methods. Differences in the AOD as compared to AERONET can be explained by variations in the aerosol properties of the atmosphere that are not accounted for in the idealized settings used in the radiative transfer simulations, such as variations in the single scattering albedo and Ångström exponent. Furthermore, the method is sensitive to calibration offsets between the radiative transfer simulations and the pyranometer SSR. The method provides an opportunity of extending our knowledge of the atmospheric aerosol load to locations and times not covered by dedicated aerosol measurements.

  4. Routing and Disaster Awareness in Optical Networks

    Muhammad Iqbal, M.A.F.


    Optical networks facilitate the configurations of high-speed network connections with tremendous bandwidth between the optical switches. Optical switches are interconnected by optical fibers that act as the mediums in which data are transferred using lightpaths. Due to the importance of optical

  5. Green interconnecting materials for semiconductor industry

    Matin, M.A.; Vellinga, W.P.; Geers, M.G.D.; Sawada, K.; Ishida, M.


    Interconnecting materials experience a complex thermo-mechanical load in applications. This may lead to the formation of macroscopic cracks resulting from induced stresses of the differences in thermal expansion coefficients on a sample scale (since different materials are involved) and on a grain

  6. Electric network interconnection of Mashreq Arab Countries

    El-Amin, I.M.; Al-Shehri, A.M.; Opoku, G.; Al-Baiyat, S.A.; Zedan, F.M.


    Power system interconnection is a well established practice for a variety of technical and economical reasons. Several interconnected networks exist worldwide for a number of factors. Some of these networks cross international boundaries. This presentation discusses the future developments of the power systems of Mashreq Arab Countries (MAC). MAC consists of Bahrain, Egypt, Iraq, Jordan, Kuwait, Lebanon, Oman, Qatar, Saudi Arabia, United Arab Emirates (UAE), and Yemen. Mac power systems are operated by government or semigovernment bodies. Many of these countries have national or regional electric grids but are generally isolated from each other. With the exception of Saudi Arabia power systems, which employ 60 Hz, all other MAC utilities use 50 Hz frequency. Each country is served by one utility, except Saudi Arabia, which is served by four major utilities and some smaller utilities serving remote towns and small load centers. The major utilities are the Saudi Consolidated electric Company in the Eastern Province (SCECO East), SCECO Center, SCECO West, and SCECO South. These are the ones considered in this study. The energy resources in MAC are varied. Countries such as Egypt, Iraq, and Syria have significant hydro resources.The gulf countries and Iraq have abundant fossil fuel, The variation in energy resources as well as the characteristics of the electric load make it essential to look into interconnections beyond the national boundaries. Most of the existing or planned interconnections involve few power systems. A study involving 12 countries and over 20 utilities with different characteristics represents a very large scale undertaking

  7. Health and the environment: Examining some interconnections

    Nair, G.; Castelino, J.; Parr, R.M.


    In various ways, the IAEA is working with national and international agencies to broaden scientific understanding of the interconnections between the environment and human health. Often nuclear and related technologies are applied in the search for answers to complex and puzzling questions. This article highlights some of that work, illustrating the dimensions of both the problems and the potential solutions

  8. Systems theory of interconnected port contact systems

    Eberard, D.; Maschke, B.M.; Schaft, A.J. van der


    Port-based network modeling of a large class of complex physical systems leads to dynamical systems known as port-Hamiltonian systems. The key ingredient of any port-Hamiltonian system is a power-conserving interconnection structure (mathematically formalized by the geometric notion of a Dirac

  9. Experimental demonstration of titanium nitride plasmonic interconnects

    Kinsey, N.; Ferrera, M.; Naik, G. V.


    An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 mu m. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 mu m...

  10. Nominate an Organization | Distributed Generation Interconnection

    Collaborative | NREL Nominate an Organization Nominate an Organization Do you know of an organization doing high-quality, innovative work on the interconnection of distributed generation? Want to practices by nominating an organization to be profiled in an online case study! Please include your

  11. Adapting Memory Hierarchies for Emerging Datacenter Interconnects

    江涛; 董建波; 侯锐; 柴琳; 张立新; 孙凝晖; 田斌


    Efficient resource utilization requires that emerging datacenter interconnects support both high performance communication and efficient remote resource sharing. These goals require that the network be more tightly coupled with the CPU chips. Designing a new interconnection technology thus requires considering not only the interconnection itself, but also the design of the processors that will rely on it. In this paper, we study memory hierarchy implications for the design of high-speed datacenter interconnects—particularly as they affect remote memory access—and we use PCIe as the vehicle for our investigations. To that end, we build three complementary platforms: a PCIe-interconnected prototype server with which we measure and analyze current bottlenecks; a software simulator that lets us model microarchitectural and cache hierarchy changes;and an FPGA prototype system with a streamlined switchless customized protocol Thunder with which we study hardware optimizations outside the processor. We highlight several architectural modifications to better support remote memory access and communication, and quantify their impact and limitations.

  12. Patterned electrodeposition of interconnects using microcontact printing

    Hovestad, A.; Rendering, H.; Maijenburg, A.W.


    Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of

  13. An architectural model for network interconnection

    van Sinderen, Marten J.; Vissers, C.A.; Kalin, T.


    This paper presents a technique of successive decomposition of a common users' activity to illustrate the problems of network interconnection. The criteria derived from this approach offer a structuring principle which is used to develop an architectural model that embeds heterogeneous subnetworks

  14. Identifying influential spreaders in interconnected networks

    Zhao, Dawei; Li, Lixiang; Huo, Yujia; Yang, Yixian; Li, Shudong


    Identifying the most influential spreaders in spreading dynamics is of the utmost importance for various purposes for understanding or controlling these processes. The existing relevant works are limited to a single network. Most real networks are actually not isolated, but typically coupled and affected by others. The properties of epidemic spreading have recently been found to have some significant differences in interconnected networks from those in a single network. In this paper, we focus on identifying the influential spreaders in interconnected networks. We find that the well-known k-shell index loses effectiveness; some insignificant spreaders in a single network become the influential spreaders in the whole interconnected networks while some influential spreaders become no longer important. The simulation results show that the spreading capabilities of the nodes not only depend on their influence for the network topology, but also are dramatically influenced by the spreading rate. Based on this perception, a novel index is proposed for measuring the influential spreaders in interconnected networks. We then support the efficiency of this index with numerical simulations. (paper)

  15. Laser printed interconnects for flexible electronics

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  16. Decentralized adaptive control of interconnected nonlinear systems with unknown control directions.

    Huang, Jiangshuai; Wang, Qing-Guo


    In this paper, we propose a decentralized adaptive control scheme for a class of interconnected strict-feedback nonlinear systems without a priori knowledge of subsystems' control directions. To address this problem, a novel Nussbaum-type function is proposed and a key theorem is drawn which involves quantifying the interconnections of multiple Nussbaum-type functions of the subsystems with different control directions in a single inequality. Global stability of the closed-loop system and asymptotic stabilization of subsystems' output are proved and a simulation example is given to illustrate the effectiveness of the proposed control scheme. Copyright © 2018 ISA. Published by Elsevier Ltd. All rights reserved.

  17. Review of Interconnection Practices and Costs in the Western States

    Bird, Lori A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Flores-Espino, Francisco [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Volpi, Christina M [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Ardani, Kristen B [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Manning, David [Western Interstate Energy Board (WIEB); McAllister, Richard [Western Interstate Energy Board (WIEB)


    The objective of this report is to evaluate the nature of barriers to interconnecting distributed PV, assess costs of interconnection, and compare interconnection practices across various states in the Western Interconnection. The report addresses practices for interconnecting both residential and commercial-scale PV systems to the distribution system. This study is part of a larger, joint project between the Western Interstate Energy Board (WIEB) and the National Renewable Energy Laboratory (NREL), funded by the U.S. Department of Energy, to examine barriers to distributed PV in the 11 states wholly within the Western Interconnection.

  18. Chip-To-Chip Optical Interconnection Using MEMS Mirrors


    power generated through a resistor is a function of this common current but different resistances, different amounts of heat are generated in the two...Chiu, “Modeling and control of piezo - electric cantilever beam micro mirror and micro laser arrays to reduce image band- ing in electrophotographic

  19. MEMS Lens Scanners for Free-Space Optical Interconnects


    electrothermal linear micromotors ,” Journal of Micromechanics and Microengineering, vol. 14, no. 2, pp. 226– 234, 2004. [59] Hyuck Choo and R. S. Muller...84] Mei Lin Chan et al., “Low friction liquid bearing mems micromotor ,” in 2011 IEEE 24th International Conference on Micro Electro Mechanical

  20. Multiangle Imaging Spectroradiometer (MISR) Global Aerosol Optical Depth Validation Based on 2 Years of Coincident Aerosol Robotic Network (AERONET) Observations

    Kahn, Ralph A.; Gaitley, Barbara J.; Martonchik, John V.; Diner, David J.; Crean, Kathleen A.; Holben, Brent


    Performance of the Multiangle Imaging Spectroradiometer (MISR) early postlaunch aerosol optical thickness (AOT) retrieval algorithm is assessed quantitatively over land and ocean by comparison with a 2-year measurement record of globally distributed AERONET Sun photometers. There are sufficient coincident observations to stratify the data set by season and expected aerosol type. In addition to reporting uncertainty envelopes, we identify trends and outliers, and investigate their likely causes, with the aim of refining algorithm performance. Overall, about 2/3 of the MISR-retrieved AOT values fall within [0.05 or 20% x AOT] of Aerosol Robotic Network (AERONET). More than a third are within [0.03 or 10% x AOT]. Correlation coefficients are highest for maritime stations (approx.0.9), and lowest for dusty sites (more than approx.0.7). Retrieved spectral slopes closely match Sun photometer values for Biomass burning and continental aerosol types. Detailed comparisons suggest that adding to the algorithm climatology more absorbing spherical particles, more realistic dust analogs, and a richer selection of multimodal aerosol mixtures would reduce the remaining discrepancies for MISR retrievals over land; in addition, refining instrument low-light-level calibration could reduce or eliminate a small but systematic offset in maritime AOT values. On the basis of cases for which current particle models are representative, a second-generation MISR aerosol retrieval algorithm incorporating these improvements could provide AOT accuracy unprecedented for a spaceborne technique.

  1. Global tree network for computing structures enabling global processing operations

    Blumrich; Matthias A.; Chen, Dong; Coteus, Paul W.; Gara, Alan G.; Giampapa, Mark E.; Heidelberger, Philip; Hoenicke, Dirk; Steinmacher-Burow, Burkhard D.; Takken, Todd E.; Vranas, Pavlos M.


    A system and method for enabling high-speed, low-latency global tree network communications among processing nodes interconnected according to a tree network structure. The global tree network enables collective reduction operations to be performed during parallel algorithm operations executing in a computer structure having a plurality of the interconnected processing nodes. Router devices are included that interconnect the nodes of the tree via links to facilitate performance of low-latency global processing operations at nodes of the virtual tree and sub-tree structures. The global operations performed include one or more of: broadcast operations downstream from a root node to leaf nodes of a virtual tree, reduction operations upstream from leaf nodes to the root node in the virtual tree, and point-to-point message passing from any node to the root node. The global tree network is configurable to provide global barrier and interrupt functionality in asynchronous or synchronized manner, and, is physically and logically partitionable.

  2. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)


    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  3. Development and operation of interconnections in a restructuring context


    In many countries the electrical network is not fully interconnected and the best technical solution to achieve interconnection has to be found. At the same time the electricity industry is being restructured and interconnecting independent energy markets presents technical challenges. It is therefore timely to consider interconnection development and operation options: examine the benefits of interconnecting electrical networks and the development strategies, review the interconnection design options and the technologies available, identify the operational issues, the security problems of large interconnected systems, the protection issues, consider the impact of the restructuring of the electrical supply industry, assess the political, environmental and social implications of interconnections. reorganized in slovenia from 5-7 april 2004. (author)

  4. National Offshore Wind Energy Grid Interconnection Study Full Report

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)


    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  5. Interconnection of bundled solid oxide fuel cells

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S


    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  6. Architecture for on-die interconnect

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.


    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  7. Accurate Modeling Method for Cu Interconnect

    Yamada, Kenta; Kitahara, Hiroshi; Asai, Yoshihiko; Sakamoto, Hideo; Okada, Norio; Yasuda, Makoto; Oda, Noriaki; Sakurai, Michio; Hiroi, Masayuki; Takewaki, Toshiyuki; Ohnishi, Sadayuki; Iguchi, Manabu; Minda, Hiroyasu; Suzuki, Mieko

    This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully, incorporated and universally expressed. In addition, we have developed specific test patterns for the model parameters extraction, and an efficient extraction flow. We have extracted the model parameters for 0.15μm CMOS using this method and confirmed that 10%τpd error normally observed with conventional LPE (Layout Parameters Extraction) was completely dissolved. Moreover, it is verified that the model can be applied to more advanced technologies (90nm, 65nm and 55nm CMOS). Since the interconnect delay variations due to the processes constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

  8. Development of Interconnect Technologies for Particle Detectors

    Tripathi, Mani [Univ. of California, Davis, CA (United States)


    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  9. Interconnecting Multidiscilinary Data Infrastructures: From Federation to Brokering Framework

    Nativi, S.


    Standardization and federation activities have been played an essential role to push interoperability at the disciplinary and cross-disciplinary level. However, they demonstrated not to be sufficient to resolve important interoperability challenges, including: disciplinary heterogeneity, cross-organizations diversities, cultural differences. Significant international initiatives like GEOSS, IODE, and CEOS demonstrated that a federation system dealing with global and multi-disciplinary domain turns out to be rater complex, raising more the already high entry level barriers for both Providers and Users. In particular, GEOSS demonstrated that standardization and federation actions must be accompanied and complemented by a brokering approach. Brokering architecture and its implementing technologies are able to implement an effective interoperability level among multi-disciplinary systems, lowering the entry level barriers for both data providers and users. This presentation will discuss the brokering philosophy as a complementary approach for standardization and federation to interconnect existing and heterogeneous infrastructures and systems. The GEOSS experience will be analyzed, specially.

  10. Interconnection of psychology, color and design

    Minchuk, A. M.; Kudryashova, Aleksandra Vladimirovna


    The paper presents the direct interconnection between color, design and psychology on the basis of theoretical and historical analysis. It describes the peculiarities of how peopleperceive color. In the paper some of the historical details concerning the way our ancestors used color are presented and the modern scientific discoveries in the field of psychology, which give the evidence of the great psychological, emotional and physical influence of color on a person are shown as well. The pape...

  11. Computer simulation of electromigration in microelectronics interconnect

    Zhu, Xiaoxin


    Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

  12. Viewing Integrated-Circuit Interconnections By SEM

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.


    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  13. High-density hybrid interconnect methodologies

    John, J.; Zimmermann, L.; Moor, P.De; Hoof, C.Van


    Full text: The presentation gives an overview of the state-of-the-art of hybrid integration and in particular the IMEC technological approaches that will be able to address future hybrid detector needs. The dense hybrid flip-chip integration of an array of detectors and its dedicated readout electronics can be achieved with a variety of solderbump techniques such as pure Indium or Indium alloys, Ph-In, Ni/PbSn, but also conducting polymers... Particularly for cooled applications or ultra-high density applications, Indium solderbump technology (electroplated or evaporated) is the method of choice. The state-of-the-art of solderbump technologies that are to a high degree independent of the underlying detector material will be presented and examples of interconnect densities between 5x1E4cm-2 and 1x1E6 cm-2 will be demonstrated. For several classes of detectors, flip-chip integration is not allowed since the detectors have to be illuminated from the top. This applies to image sensors for EUV applications such as GaN/AlGaN based detectors and to MEMS-based sensors. In such cases, the only viable interconnection method has to be through the (thinned) detector wafer followed by a solderbump-based integration. The approaches for dense and ultra-dense through-the-wafer interconnect 'vias' will be presented and wafer thinning approaches will be shown

  14. The first LHC sector is fully interconnected


    Sector 7-8 is the first sector of the LHC to become fully operational. All the magnets, cryogenic line, vacuum chambers and services are interconnected. The cool down of this sector can soon commence. LHC project leader Lyn Evans, the teams from CERN's AT/MCS, AT/VAC and AT/MEL groups, and the members of the IEG consortium celebrate the completion of the first LHC sector. The 10th of November was a red letter day for the LHC accelerator teams, marking the completion of the first sector of the machine. The magnets of sector 7-8, together with the cryogenic line, the vacuum chambers and the distribution feedboxes (DFBs) are now all completely interconnected. Sector 7-8 has thus been closed and is the first LHC sector to become operational. The interconnection work required several thousand electrical, cryogenic and insulating connections to be made on the 210 interfaces between the magnets in the arc, the 30 interfaces between the special magnets and the interfaces with the cryogenic line. 'This represent...

  15. Implementation of interconnect simulation tools in spice

    Satsangi, H.; Schutt-Aine, J. E.


    Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

  16. The variability of interconnected wind plants

    Katzenstein, Warren; Fertig, Emily; Apt, Jay


    We present the first frequency-dependent analyses of the geographic smoothing of wind power's variability, analyzing the interconnected measured output of 20 wind plants in Texas. Reductions in variability occur at frequencies corresponding to times shorter than ∼24 h and are quantified by measuring the departure from a Kolmogorov spectrum. At a frequency of 2.8x10 -4 Hz (corresponding to 1 h), an 87% reduction of the variability of a single wind plant is obtained by interconnecting 4 wind plants. Interconnecting the remaining 16 wind plants produces only an additional 8% reduction. We use step change analyses and correlation coefficients to compare our results with previous studies, finding that wind power ramps up faster than it ramps down for each of the step change intervals analyzed and that correlation between the power output of wind plants 200 km away is half that of co-located wind plants. To examine variability at very low frequencies, we estimate yearly wind energy production in the Great Plains region of the United States from automated wind observations at airports covering 36 years. The estimated wind power has significant inter-annual variability and the severity of wind drought years is estimated to be about half that observed nationally for hydroelectric power.

  17. Fiber optics in SHIVA

    Severyn, J.; Parker, J.


    SHIVA is a twenty arm laser which is controlled with a network of fifty computers, interconnected with digital fiber optic links. Three different fiber optic systems employed on the Shiva laser will be described. Two of the systems are for digital communications, one at 9600 baud and the other at 1 megabaud. The third system uses fiber optics to distribute diagnostic triggers with subnanosecond jitter

  18. Energetic diversification in the interconnected electric system

    Villanueva M, C.; Beltran M, H.; Serrano G, J.A.


    In the interconnected electric system of Mexico the demanded electricity in different timetable periods it is synthesized in the annual curve of load duration, which is characterized by three regions. The energy in every period is quantified according to the under curve areas in each region, which depend of the number of hours in that the power demand exceeds the minimum and the intermediate demands respectively that are certain percentages of the yearly maximum demand. In that context, the generating power stations are dispatched according to the marginal costs of the produced electricity and the electric power to be generated every year by each type of central it is located in some of the regions of the curve of load duration, as they are their marginal costs and their operation characteristic techniques. By strategic reasons it is desirable to diversify the primary energy sources that are used in the national interconnected system to generate the electricity that demand the millions of consumers that there are in Mexico. On one hand, when intensifying the use of renewable sources and of nucleo electric centrals its decrease the import volumes of natural gas, which has very volatile prices and it is a fuel when burning in the power stations produces hothouse gases that are emitted to the atmosphere. On the other hand, when diversifying the installed capacity of the different central types in the interconnected system, a better adaptation of the produced electricity volumes is achieved by each type to the timetable variation, daily, weekly and seasonal of the electric demand, as one manifests this in the curve of load duration. To exemplify a possible diversification plan of the installed capacity in the national interconnected system that includes nucleo electric centrals and those that use renewable energy, charts are presented that project of 2005 at 2015 the capacity, energy and ost of the electricity of different central types, located in each one of the

  19. Installation and Quality Assurance of the Interconnections between Cryo-assemblies of the LHC Long Straight Sections

    Garion, C; Tock, J P


    The interconnections between the cryomagnets and cryogenic utilities in the LHC long Straight Sections constitute the last machine installation activity. They are ensuring continuity of the beam and insulation vacuum systems, cryogenic fluid and electrical circuits and thermal insulation. The assembly is carried out in a constraining tunnel environment with restricted space. Therefore, the assembly sequence has to be well defined and specific tests have to be performed during the interconnection work to secure the reliability of the system and thus to ensure the global accelerator availability. The LHC has 8 long straight insertion zones composed of special cryomagnets involving specific interconnection procedures and QA plans. The aim of this paper is to present the installation and quality assurance procedures implemented for the LHC LSS interconnections. Technologies such as manual and automatic welding and resistive soldering will be described as well as the different quality controls, such as visual and ...

  20. Crosstalk in modern on-chip interconnects a FDTD approach

    Kaushik, B K; Patnaik, Amalendu


    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  1. Carbon nanotubes for interconnects process, design and applications

    Dijon, Jean; Maffucci, Antonio


    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

  2. Decentralised output feedback control of Markovian jump interconnected systems with unknown interconnections

    Li, Li-Wei; Yang, Guang-Hong


    The problem of decentralised output feedback control is addressed for Markovian jump interconnected systems with unknown interconnections and general transition rates (TRs) allowed to be unknown or known with uncertainties. A class of decentralised dynamic output feedback controllers are constructed, and a cyclic-small-gain condition is exploited to dispose the unknown interconnections so that the resultant closed-loop system is stochastically stable and satisfies an H∞ performance. With slack matrices to cope with the nonlinearities incurred by unknown and uncertain TRs in control synthesis, a novel controller design condition is developed in linear matrix inequality formalism. Compared with the existing works, the proposed approach leads to less conservatism. Finally, two examples are used to illustrate the effectiveness of the new results.

  3. Environmental Regulation Impacts on Eastern Interconnection Performance

    Markham, Penn N [ORNL; Liu, Yilu [ORNL; Young II, Marcus Aaron [ORNL


    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  4. Interconnectivity and the Electronic Academic Library

    Donald E. Riggs


    Full Text Available 無Due to the emphasis on the use of computing networks on campuses and to the very nature of more information being accessible to library users only via electronic means, we are witnessing a migration to electronic academic libraries. this new type of library is being required to have interconnections with the campus' other online information/data systems. Arizona State University libraries have been provided the opportunity to develop an electronic library that will be the focal point of a campus-wide information/data network.

  5. Validation of Long-Term Global Aerosol Climatology Project Optical Thickness Retrievals Using AERONET and MODIS Data

    Geogdzhayev, Igor V.; Mishchenko, Michael I.


    A comprehensive set of monthly mean aerosol optical thickness (AOT) data from coastal and island AErosol RObotic NETwork (AERONET) stations is used to evaluate Global Aerosol Climatology Project (GACP) retrievals for the period 1995-2009 during which contemporaneous GACP and AERONET data were available. To put the GACP performance in broader perspective, we also compare AERONET and MODerate resolution Imaging Spectroradiometer (MODIS) Aqua level-2 data for 2003-2009 using the same methodology. We find that a large mismatch in geographic coverage exists between the satellite and ground-based datasets, with very limited AERONET coverage of open-ocean areas. This is especially true of GACP because of the smaller number of AERONET stations at the early stages of the network development. Monthly mean AOTs from the two over-the-ocean satellite datasets are well-correlated with the ground-based values, the correlation coefficients being 0.81-0.85 for GACP and 0.74-0.79 for MODIS. Regression analyses demonstrate that the GACP mean AOTs are approximately 17%-27% lower than the AERONET values on average, while the MODIS mean AOTs are 5%-25% higher. The regression coefficients are highly dependent on the weighting assumptions (e.g., on the measure of aerosol variability) as well as on the set of AERONET stations used for comparison. Comparison of over-the-land and over-the-ocean MODIS monthly mean AOTs in the vicinity of coastal AERONET stations reveals a significant bias. This may indicate that aerosol amounts in coastal locations can differ significantly from those in adjacent open-ocean areas. Furthermore, the color of coastal waters and peculiarities of coastline meteorological conditions may introduce biases in the GACP AOT retrievals. We conclude that the GACP and MODIS over-the-ocean retrieval algorithms show similar ranges of discrepancy when compared to available coastal and island AERONET stations. The factors mentioned above may limit the performance of the

  6. Interconnectivity among Assessments from Rating Agencies: Using Cluster and Correlation Analysis

    Krejčíř, Jaroslav; Doubravsky, Karel; Dostál, Petr


    The aim of this paper is to determine whether there is a dependency among leading rating agencies assessments. Rating agencies are important part of global economy. Great attention has been paid to activities of rating agencies since 2007, when there was a financial crisis. One of the main causes of this crisis was identified credit rating agencies. This paper is focused on an existence of mutual interconnectivity among assessments from three leading rating agencies. The method used for this ...

  7. National Offshore Wind Energy Grid Interconnection Study

    Daniel, John P. [ABB Inc; Liu, Shu [ABB Inc; Ibanez, Eduardo [National Renewable Energy Laboratory; Pennock, Ken [AWS Truepower; Reed, Greg [University of Pittsburgh; Hanes, Spencer [Duke Energy


    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  8. Thermoelectric Coolers with Sintered Silver Interconnects

    Kähler, Julian; Stranz, Andrej; Waag, Andreas; Peiner, Erwin


    The fabrication and performance of a sintered Peltier cooler (SPC) based on bismuth telluride with sintered silver interconnects are described. Miniature SPC modules with a footprint of 20 mm2 were assembled using pick-and-place pressure-assisted silver sintering at low pressure (5.5 N/mm2) and moderate temperature (250°C to 270°C). A modified flip-chip bonder combined with screen/stencil printing for paste transfer was used for the pick-and-place process, enabling high positioning accuracy, easy handling of the tiny bismuth telluride pellets, and immediate visual process control. A specific contact resistance of (1.4 ± 0.1) × 10-5 Ω cm2 was found, which is in the range of values reported for high-temperature solder interconnects of bismuth telluride pellets. The realized SPCs were evaluated from room temperature to 300°C, considerably outperforming the operating temperature range of standard commercial Peltier coolers. Temperature cycling capability was investigated from 100°C to 235°C over more than 200 h, i.e., 850 cycles, during which no degradation of module resistance or cooling performance occurred.

  9. Interconnected ponds operation for flood hazard distribution

    Putra, S. S.; Ridwan, B. W.


    The climatic anomaly, which comes with extreme rainfall, will increase the flood hazard in an area within a short period of time. The river capacity in discharging the flood is not continuous along the river stretch and sensitive to the flood peak. This paper contains the alternatives on how to locate the flood retention pond that are physically feasible to reduce the flood peak. The flood ponds were designed based on flood curve number criteria (TR-55, USDA) with the aim of rapid flood peak capturing and gradual flood retuning back to the river. As a case study, the hydrologic condition of upper Ciliwung river basin with several presumed flood pond locations was conceptually designed. A fundamental tank model that reproducing the operation of interconnected ponds was elaborated to achieve the designed flood discharge that will flows to the downstream area. The flood hazard distribution status, as the model performance criteria, will be computed within Ciliwung river reach in Manggarai Sluice Gate spot. The predicted hazard reduction with the operation of the interconnected retention area result had been bench marked with the normal flow condition.

  10. The Global Resource Nexus

    Ridder, M. de; Duijne, F. van; Jong, S. de; Jones, J.; Luit, E. van; Bekkers, F.F.; Auping, W.


    Supply and demand of resources are connected in a complex way. This interconnectivity has been framed as the global resource nexus and can conceivebly include all types of resources. This study focus on the nexus of five essential natural resources: land, food, energy, water and minerals. Together

  11. Compact Interconnection Networks Based on Quantum Dots

    Fijany, Amir; Toomarian, Nikzad; Modarress, Katayoon; Spotnitz, Matthew


    Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary

  12. Current Solutions: Recent Experience in Interconnecting Distributed Energy Resources

    Johnson, M.


    This report catalogues selected real-world technical experiences of utilities and customers that have interconnected distributed energy assets with the electric grid. This study was initiated to assess the actual technical practices for interconnecting distributed generation and had a particular focus on the technical issues covered under the Institute of Electrical and Electronics Engineers (IEEE) 1547(TM) Standard for Interconnecting Distributed Resources With Electric Power Systems.

  13. Self-Rerouting and Curative Interconnect Technology (SERCUIT)


    SPECIAL REPORT RDMR-CS-17-01 SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) Shiv Joshi Concepts to Systems, Inc...Final 4. TITLE AND SUBTITLE Self-Rerouting and Curative Interconnect Technology (SERCUIT) 5. FUNDING NUMBERS 6. AUTHOR(S) Shiv (p) 434-207-5189 x (f) Click to view full size Title Contract Number SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) W911W6-17-C-0029

  14. Simulation of aerosol optical properties over a tropical urban site in India using a global model and its comparison with ground measurements

    D. Goto


    Full Text Available Aerosols have great impacts on atmospheric environment, human health, and earth's climate. Therefore, information on their spatial and temporal distribution is of paramount importance. Despite numerous studies have examined the variation and trends of BC and AOD over India, only very few have focused on their spatial distribution or even correlating the observations with model simulations. In the present study, a three-dimensional aerosol transport-radiation model coupled with a general circulation model. SPRINTARS, simulated atmospheric aerosol distributions including BC and aerosol optical properties, i.e., aerosol optical thickness (AOT, Ångström Exponent (AE, and single scattering albedo (SSA. The simulated results are compared with both BC measurements by aethalometer and aerosol optical properties measured by ground-based skyradiometer and by satellite sensor, MODIS/Terra over Hyderabad, which is a tropical urban area of India, for the year 2008. The simulated AOT and AE in Hyderabad are found to be comparable to ground-based measured ones. The simulated SSA tends to be higher than the ground-based measurements. Both these comparisons of aerosol optical properties between the simulations with different emission inventories and the measurements indicate that, firstly the model uncertainties derived from aerosol emission inventory cannot explain the gaps between the simulations and the measurements and secondly the vertical transport of BC and the treatment of BC-containing particles can be the main issue in the global model to solve the gap.

  15. Distributed Energy Resources Interconnection Systems: Technology Review and Research Needs

    Friedman, N. R.


    Interconnecting distributed energy resources (DER) to the electric utility grid (or Area Electric Power System, Area EPS) involves system engineering, safety, and reliability considerations. This report documents US DOE Distribution and Interconnection R&D (formerly Distributed Power Program) activities, furthering the development and safe and reliable integration of DER interconnected with our nation's electric power systems. The key to that is system integration and technology development of the interconnection devices that perform the functions necessary to maintain the safety, power quality, and reliability of the EPS when DER are connected to it.

  16. Cost based interconnection charges as a way to induce competition

    Falch, Morten

    The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debat...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

  17. Financial viability of the Sonora-Baja California interconnection line

    Alonso, G.; Ortega, G.


    In the Development Program of the National Electricity Sector 2015-2029, an electric interconnection line between Sonora and Baja California (Mexico) is proposed, this study analyzes the financial viability of this interconnection line based on the maximum hourly and seasonal energy demand between both regions and proposes alternatives for the supply of electric power that supports the economic convenience of this interconnection line. The results show that additional capacity is required in Sonora to cover the maximum demands of both regions since in the current condition of the National Electric System the interconnection line is not justified. (Author)

  18. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures


    ... Electronics Engineers (IEEE) Standard 1547 for Interconnecting Distributed Resources with Electric Power... discriminatory manner.\\38\\ \\37\\ The Electricity Consumers Resource Council, American Chemistry Council, American...

  19. Virtual interconnection platform initiative scoping study

    Liu, Yong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kou, Gefei [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Pan, Zuohong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); King Jr., Thomas J. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)


    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  20. New transmission interconnection reduces consumer costs



    The Central American electric interconnection system (SIEPAC) project will involve the construction of a 1830 km 230 kV transmission system that will link Guatemala, El Salvador, Honduras, Costa Rica, Nicaragua, and Panama. The system is expected to alleviate the region's power shortages and reduce electricity costs for consumers. Costs for the SIEPAC project have been estimated at $370 million. The system will serve approximately 37 million customers, and will include 15 substations. The contract for building the electrical equipment has been awarded to Schweitzer Engineering Laboratories (SEL) who plan to manufacture components at a plant in Mexico. The equipment will include high speed line protection, automation, and control systems. Line current differential systems and satellite-synchronized clocks will also be used. The new transmission system is expected to be fully operational by 2009. 1 fig.

  1. SIDES - Segment Interconnect Diagnostic Expert System

    Booth, A.W.; Forster, R.; Gustafsson, L.; Ho, N.


    It is well known that the FASTBUS Segment Interconnect (SI) provides a communication path between two otherwise independent, asynchronous bus segments. The SI is probably the most important module in any FASTBUS data acquisition network since it's failure to function can cause whole segments of the network to be inaccessible and sometimes inoperable. This paper describes SIDES, an intelligent program designed to diagnose SI's both in situ as they operate in a data acquisition network, and in the laboratory in an acceptance/repair environment. The paper discusses important issues such as knowledge acquisition; extracting knowledge from human experts and other knowledge sources. SIDES can benefit high energy physics experiments, where SI problems can be diagnosed and solved more quickly. Equipment pool technicians can also benefit from SIDES, first by decreasing the number of SI's erroneously turned in for repair, and secondly as SIDES acts as an intelligent assistant to the technician in the diagnosis and repair process

  2. Electric power grid interconnection in Northeast Asia

    Yun, Won-Cheol; Zhang, Zhong Xiang


    In spite of regional closeness, energy cooperation in Northeast Asia has remained unexplored. However, this situation appears to be changing. The government of South Korea seems to be very enthusiastic for power grid interconnection between the Russian Far East and South Korea to overcome difficulties in finding new sites for building power facilities to meet its need for increased electricity supplies. This paper analyzes the feasibility of this electric power grid interconnection route. The issues addressed include electricity market structures; the prospects for electric power industry restructuring in the Russian Federation and South Korea; the political issues related to North Korea; the challenges for the governments involved and the obstacles anticipated in moving this project forward; project financing and the roles and concerns from multilateral and regional banks; and institutional framework for energy cooperation. While there are many technical issues that need to be resolved, we think that the great challenge lies in the financing of this commercial project. Thus, the governments of the Russian Federation and South Korea involved in the project need to foster the development of their internal capital markets and to create confidence with international investors. To this end, on energy side, this involves defining a clear energy policy implemented by independent regulators, speeding up the already started but delayed reform process of restructuring electric power industry and markets, and establishing a fair and transparent dispute resolution mechanism in order to reduce non-commercial risks to a minimum. The paper argues that establishing a framework for energy cooperation in this region will contribute positively towards that end, although views differ regarding its specific form. Finally, given that North Korea has a crucial transit role to play and faces a very unstable political situation, it is concluded that moving the project forward needs to be

  3. Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

    Peter, Geoffrey John M.

    With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect

  4. Nanoantenna couplers for metal-insulator-metal waveguide interconnects

    Onbasli, M. Cengiz; Okyay, Ali K.


    State-of-the-art copper interconnects suffer from increasing spatial power dissipation due to chip downscaling and RC delays reducing operation bandwidth. Wide bandwidth, minimized Ohmic loss, deep sub-wavelength confinement and high integration density are key features that make metal-insulator-metal waveguides (MIM) utilizing plasmonic modes attractive for applications in on-chip optical signal processing. Size-mismatch between two fundamental components (micron-size fibers and a few hundred nanometers wide waveguides) demands compact coupling methods for implementation of large scale on-chip optoelectronic device integration. Existing solutions use waveguide tapering, which requires more than 4λ-long taper distances. We demonstrate that nanoantennas can be integrated with MIM for enhancing coupling into MIM plasmonic modes. Two-dimensional finite-difference time domain simulations of antennawaveguide structures for TE and TM incident plane waves ranging from λ = 1300 to 1600 nm were done. The same MIM (100-nm-wide Ag/100-nm-wide SiO2/100-nm-wide Ag) was used for each case, while antenna dimensions were systematically varied. For nanoantennas disconnected from the MIM; field is strongly confined inside MIM-antenna gap region due to Fabry-Perot resonances. Major fraction of incident energy was not transferred into plasmonic modes. When the nanoantennas are connected to the MIM, stronger coupling is observed and E-field intensity at outer end of core is enhanced more than 70 times.

  5. The Connective Tissue Components of Optic Nerve Head Cupping in Monkey Experimental Glaucoma Part 1: Global Change

    Yang, Hongli; Ren, Ruojin; Lockwood, Howard; Williams, Galen; Libertiaux, Vincent; Downs, Crawford; Gardiner, Stuart K.; Burgoyne, Claude F.


    Purpose To characterize optic nerve head (ONH) connective tissue change within 21 monkey experimental glaucoma (EG) eyes, so as to identify its principal components. Methods Animals were imaged three to five times at baseline then every 2 weeks following chronic unilateral IOP elevation, and euthanized early through end-stage confocal scanning laser tomographic change. Optic nerve heads were serial-sectioned, three-dimensionally (3D) reconstructed, delineated, and quantified. Overall EG versus control eye differences were assessed by general estimating equations (GEE). Significant, animal-specific, EG eye change was required to exceed the maximum physiologic intereye differences in six healthy animals. Results Overall EG eye change was significant (P connective tissue components of ONH “cupping” in monkey EG which serve as targets for longitudinally staging and phenotyping ONH connective tissue alteration within all forms of monkey and human optic neuropathy. PMID:26641545

  6. Updating Small Generator Interconnection Procedures for New Market Conditions

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.


    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  7. Optimal interconnection and renewable targets for north-west Europe

    Lynch, Muireann Á.; Tol, Richard S.J.; O'Malley, Mark J.


    We present a mixed-integer, linear programming model for determining optimal interconnection for a given level of renewable generation using a cost minimisation approach. Optimal interconnection and capacity investment decisions are determined under various targets for renewable penetration. The model is applied to a test system for eight regions in Northern Europe. It is found that considerations on the supply side dominate demand side considerations when determining optimal interconnection investment: interconnection is found to decrease generation capacity investment and total costs only when there is a target for renewable generation. Higher wind integration costs see a concentration of wind in high-wind regions with interconnection to other regions. - Highlights: ► We use mixed-integer linear programming to determine optimal interconnection locations for given renewable targets. ► The model is applied to a test system for eight regions in Northern Europe. ► Interconnection reduces costs only when there is a renewable target. ► Wind integration costs affect the interconnection portfolio.

  8. 14 CFR 29.957 - Flow between interconnected tanks.


    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow between them due to gravity or flight accelerations, it must be impossible for fuel to flow between tanks in...

  9. Robert Aymar seals the last interconnect in the LHC

    Maximilien Brice


    The LHC completes the circle. On 7 November, in a brief ceremony in the LHC tunnel, CERN Director General Robert Aymar (Photo 1) sealed the last interconnect between the main magnets of the Large Hadron Collider (LHC). Jean-Philippe Tock, leader of the Interconnections team, tightens the last bolt (Photos 4-8).

  10. Circuit and interconnect design for high bit-rate applications

    Veenstra, H.


    This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate

  11. Point-of-care and point-of-procedure optical imaging technologies for primary care and global health.

    Boppart, Stephen A; Richards-Kortum, Rebecca


    Leveraging advances in consumer electronics and wireless telecommunications, low-cost, portable optical imaging devices have the potential to improve screening and detection of disease at the point of care in primary health care settings in both low- and high-resource countries. Similarly, real-time optical imaging technologies can improve diagnosis and treatment at the point of procedure by circumventing the need for biopsy and analysis by expert pathologists, who are scarce in developing countries. Although many optical imaging technologies have been translated from bench to bedside, industry support is needed to commercialize and broadly disseminate these from the patient level to the population level to transform the standard of care. This review provides an overview of promising optical imaging technologies, the infrastructure needed to integrate them into widespread clinical use, and the challenges that must be addressed to harness the potential of these technologies to improve health care systems around the world. Copyright © 2014, American Association for the Advancement of Science.

  12. Interconnectivity among Assessments from Rating Agencies: Using Cluster and Correlation Analysis

    Jaroslav Krejčíř


    Full Text Available The aim of this paper is to determine whether there is a dependency among leading rating agencies assessments. Rating agencies are important part of global economy. Great attention has been paid to activities of rating agencies since 2007, when there was a financial crisis. One of the main causes of this crisis was identified credit rating agencies. This paper is focused on an existence of mutual interconnectivity among assessments from three leading rating agencies. The method used for this determines is based on cluster analysis and subsequently correlation analysis and the test of independence. Credit rating assessments of Greece and Spain were chosen to the determination of this mutual interconnectivity due to the fact that these countries are most talked euro­area countries. The significant dependence of the assessment from different rating agencies has been demonstrated.

  13. A one-semester course in modeling of VSLI interconnections

    Goel, Ashok


    Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

  14. Fuel cell electrode interconnect contact material encapsulation and method

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.


    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  15. Next generation space interconnect research and development in space communications

    Collier, Charles Patrick


    Interconnect or "bus" is one of the critical technologies in design of spacecraft avionics systems that dictates its architecture and complexity. MIL-STD-1553B has long been used as the avionics backbone technology. As avionics systems become more and more capable and complex, however, limitations of MIL-STD-1553B such as insufficient 1 Mbps bandwidth and separability have forced current avionics architects and designers to use combination of different interconnect technologies in order to meet various requirements: CompactPCI is used for backplane interconnect; LVDS or RS422 is used for low and high-speed direct point-to-point interconnect; and some proprietary interconnect standards are designed for custom interfaces. This results in a very complicated system that consumes significant spacecraft mass and power and requires extensive resources in design, integration and testing of spacecraft systems.

  16. Solar-cell interconnect design for terrestrial photovoltaic modules

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.


    Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

  17. 76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...


    ...-002; Docket No. EL11-20-001] PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference On June 13, 2011, the Commission issued... Resources Services, Inc., Maryland Public Service Commission, Monitoring Analytics, L.L.C., National Rural...

  18. 76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...


    .... EL11-20-001] PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of... Sell Offers for Planned Generation Capacity Resources submitted into PJM's Reliability Pricing Model... presents an opportunity to exercise buyer market power; (2) whether the Fixed Resource Requirement (FRR...

  19. Interconnection issues in Ontario : a status check

    Helbronner, V.


    This PowerPoint presentation discussed wind and renewable energy interconnection issues in Ontario. The province's Green Energy Act established a feed-in tariff (FIT) program and provided priority connection access to the electricity system for renewable energy generation facilities that meet regulatory requirements. As a result of the province's initiatives, Hydro One has identified 20 priority transmission expansion projects and is focusing on servicing renewable resource clusters. As of October 2010, the Ontario Power Authority (OPA) has received 1469 MW of FIT contracts executed for wind projects. A further 5953 MW of wind projects are awaiting approval. A Korean consortium is now planning to develop 2500 MW of renewable energy projects in the province. The OPA has also been asked to develop an updated transmission expansion plan. Transmission/distribution availability tests (TAT/DAT) have been established to determine if there is sufficient connection availability for FIT application projects. Economic connection tests (ECTs) are conducted to assess whether grid upgrade costs to enable additional FIT capacity are justifiable. When projects pass the ECT, grid upgrades needed for the connection included in grid expansion plans. Ontario's long term energy plan was also reviewed. tabs., figs.

  20. Thermal Runaways in LHC Interconnections: Experiments

    Willering, G P; Bottura, L; Scheuerlein, C; Verweij, A P


    The incident in the LHC in September 2008 occurred in an interconnection between two magnets of the 13 kA dipole circuit. This event was traced to a defect in one of the soldered joints between two superconducting cables stabilized by a copper busbar. Further investigation revealed defective joints of other types. A combination of (1) a poor contact between the superconducting cable and the copper stabilizer and (2) an electrical discontinuity in the stabilizer at the level of the connection can lead to an unprotected quench of the busbar. Once the heating power in the unprotected superconducting cable exceeds the heat removal capacity a thermal run-away occurs, resulting in a fast melt-down of the non-stabilized cable. We have performed a thorough investigation of the conditions upon which a thermal run-away in the defect can occur. To this aim, we have prepared heavily instrumented samples with well-defined and controlled defects. In this paper we describe the experiment, and the analysis of the data, and w...

  1. Microtexture of Strain in electroplated copper interconnects

    Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.; Patel, J.R.


    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbeam x-ray diffraction (MBXRD) that have enabled measurement not only of the microstructure of totally encapsulated conductors but also of the local stresses in them on a micron and submicron scale. White x-rays from the Advanced Light Source were focused to a micron spot size by Kirkpatrick-Baez mirrors. The sample was stepped under the micro-beam and Laue images obtained at each sample location using a CCD area detector. Microstructure and local strain were deduced from these images. Cu lines with widths ranging from 0.8 mm to 5 mm and thickness of 1 mm were investigated. Comparisons are made between the capabilities of MBXRD and the well established techniques of broad beam XRD, electron back scatter diffraction (EBSD) and focused ion beam imagining (FIB)

  2. Advances in optical information processing V; Proceedings of the Meeting, Orlando, FL, Apr. 21-24, 1992

    Pape, Dennis R.

    Consideration is given to the following topics: transition of optical processing into systems (TOPS), optical signal processing, optical signal processing devices, optical image processing, Russian optical information processing, optical interconnects, and optical computing. Particular papers are presented on an acoustooptic range-Doppler processor design for radar insertion, an optical SAR processor and target recognition system, an advanced magnetooptic spatial light modulator device development update, an algorithm for controlling speckle-noise parameters, optical image processing in Russia, a massively parallel optical interconnect for long data stream convolution, and a reprogrammable digital optical coprocessor. (For individual items see A93-27718 to A93-27723)

  3. Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

    Ramesham, Rajeshuni


    A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

  4. Analysis of interconnecting energy systems over a synchronized life cycle

    Nian, Victor


    Highlights: • A methodology is developed for evaluating a life cycle of interconnected systems. • A new concept of partial temporal boundary is introduced via quantitative formulation. • The interconnecting systems are synchronized through the partial temporal boundary. • A case study on the life cycle of the coal–uranium system is developed. - Abstract: Life cycle analysis (LCA) using the process chain analysis (PCA) approach has been widely applied to energy systems. When applied to an individual energy system, such as coal or nuclear electricity generation, an LCA–PCA methodology can yield relatively accurate results with its detailed process representation based on engineering data. However, there are fundamental issues when applying conventional LCA–PCA methodology to a more complex life cycle, namely, a synchronized life cycle of interconnected energy systems. A synchronized life cycle of interconnected energy systems is established through direct interconnections among the processes of different energy systems, and all interconnecting systems are bounded within the same timeframe. Under such a life cycle formation, there are some major complications when applying conventional LCA–PCA methodology to evaluate the interconnecting energy systems. Essentially, the conventional system and boundary formulations developed for a life cycle of individual energy system cannot be directly applied to a life cycle of interconnected energy systems. To address these inherent issues, a new LCA–PCA methodology is presented in this paper, in which a new concept of partial temporal boundary is introduced to synchronize the interconnecting energy systems. The importance and advantages of these new developments are demonstrated through a case study on the life cycle of the coal–uranium system.

  5. Interacting Social Processes on Interconnected Networks.

    Lucila G Alvarez-Zuzek

    Full Text Available We propose and study a model for the interplay between two different dynamical processes -one for opinion formation and the other for decision making- on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = -2,-1, 1, 2, describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2 or a moderate (S = ±1 is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1 or against (S = -1 the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A when the reinforcement overcomes a crossover value r*(β, while a negative consensus happens for r βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*.

  6. Genomic Predictability of Interconnected Biparental Maize Populations

    Riedelsheimer, Christian; Endelman, Jeffrey B.; Stange, Michael; Sorrells, Mark E.; Jannink, Jean-Luc; Melchinger, Albrecht E.


    Intense structuring of plant breeding populations challenges the design of the training set (TS) in genomic selection (GS). An important open question is how the TS should be constructed from multiple related or unrelated small biparental families to predict progeny from individual crosses. Here, we used a set of five interconnected maize (Zea mays L.) populations of doubled-haploid (DH) lines derived from four parents to systematically investigate how the composition of the TS affects the prediction accuracy for lines from individual crosses. A total of 635 DH lines genotyped with 16,741 polymorphic SNPs were evaluated for five traits including Gibberella ear rot severity and three kernel yield component traits. The populations showed a genomic similarity pattern, which reflects the crossing scheme with a clear separation of full sibs, half sibs, and unrelated groups. Prediction accuracies within full-sib families of DH lines followed closely theoretical expectations, accounting for the influence of sample size and heritability of the trait. Prediction accuracies declined by 42% if full-sib DH lines were replaced by half-sib DH lines, but statistically significantly better results could be achieved if half-sib DH lines were available from both instead of only one parent of the validation population. Once both parents of the validation population were represented in the TS, including more crosses with a constant TS size did not increase accuracies. Unrelated crosses showing opposite linkage phases with the validation population resulted in negative or reduced prediction accuracies, if used alone or in combination with related families, respectively. We suggest identifying and excluding such crosses from the TS. Moreover, the observed variability among populations and traits suggests that these uncertainties must be taken into account in models optimizing the allocation of resources in GS. PMID:23535384

  7. Meeting Earth Observation Requirements for Global Agricultural Monitoring: An Evaluation of the Revisit Capabilities of Current and Planned Moderate Resolution Optical Earth Observing Missions

    Alyssa K. Whitcraft


    Full Text Available Agriculture is a highly dynamic process in space and time, with many applications requiring data with both a relatively high temporal resolution (at least every 8 days and fine-to-moderate (FTM < 100 m spatial resolution. The relatively infrequent revisit of FTM optical satellite observatories coupled with the impacts of cloud occultation have translated into a barrier for the derivation of agricultural information at the regional-to-global scale. Drawing upon the Group on Earth Observations Global Agricultural Monitoring (GEOGLAM Initiative’s general satellite Earth observation (EO requirements for monitoring of major production areas, Whitcraft et al. (this issue have described where, when, and how frequently satellite data acquisitions are required throughout the agricultural growing season at 0.05°, globally. The majority of areas and times of year require multiple revisits to probabilistically yield a view at least 70%, 80%, 90%, or 95% clear within eight days, something that no present single FTM optical observatory is capable of delivering. As such, there is a great potential to meet these moderate spatial resolution optical data requirements through a multi-space agency/multi-mission constellation approach. This research models the combined revisit capabilities of seven hypothetical constellations made from five satellite sensors—Landsat 7 Enhanced Thematic Mapper (Landsat 7 ETM+, Landsat 8 Operational Land Imager and Thermal Infrared Sensor (Landsat 8 OLI/TIRS, Resourcesat-2 Advanced Wide Field Sensor (Resourcesat-2 AWiFS, Sentinel-2A Multi-Spectral Instrument (MSI, and Sentinel-2B MSI—and compares these capabilities with the revisit frequency requirements for a reasonably cloud-free clear view within eight days throughout the agricultural growing season. Supplementing Landsat 7 and 8 with missions from different space agencies leads to an improved capacity to meet requirements, with Resourcesat-2 providing the largest

  8. On-chip photonic interconnects a computer architect's perspective

    Nitta, Christopher J; Akella, Venkatesh


    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  9. Optical RISC computer

    Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Zeise, Frederick F.


    A second generation digital optical computer (DOC II) has been developed which utilizes a RISC based operating system as its host. This 32 bit, high performance (12.8 GByte/sec), computing platform demonstrates a number of basic principals that are inherent to parallel free space optical interconnects such as speed (up to 1012 bit operations per second) and low power 1.2 fJ per bit). Although DOC II is a general purpose machine, special purpose applications have been developed and are currently being evaluated on the optical platform.

  10. Ultra-High Capacity Silicon Photonic Interconnects through Spatial Multiplexing

    Chen, Christine P.

    The market for higher data rate communication is driving the semiconductor industry to develop new techniques of writing at smaller scales, while continuing to scale bandwidth at low power consumption. Silicon photonic (SiPh) devices offer a potential solution to the electronic interconnect bandwidth bottleneck. SiPh leverages the technology commensurate of decades of fabrication development with the unique functionality of next-generation optical interconnects. Finer fabrication techniques have allowed for manufacturing physical characteristics of waveguide structures that can support multiple modes in a single waveguide. By refining modal characteristics in photonic waveguide structures, through mode multiplexing with the asymmetric y-junction and microring resonator, higher aggregate data bandwidth is demonstrated via various combinations of spatial multiplexing, broadening applications supported by the integrated platform. The main contributions of this dissertation are summarized as follows. Experimental demonstrations of new forms of spatial multiplexing combined together exhibit feasibility of data transmission through mode-division multiplexing (MDM), mode-division and wavelength-division multiplexing (MDM-WDM), and mode-division and polarization-division multiplexing (MDM-PDM) through a C-band, Si photonic platform. Error-free operation through mode multiplexers and demultiplexers show how data can be viably scaled on multiple modes and with existing spatial domains simultaneously. Furthermore, we explore expanding device channel support from two to three arms. Finding that a slight mismatch in the third arm can increase crosstalk contributions considerably, especially when increasing data rate, we explore a methodical way to design the asymmetric y-junction device by considering its angles and multiplexer/demultiplexer arm width. By taking into consideration device fabrication variations, we turn towards optimizing device performance post

  11. Optical Material Characterization Using Microdisk Cavities

    Michael, Christopher P.

    Since Jack Kilby recorded his "Monolithic Idea" for integrated circuits in 1958, microelectronics companies have invested billions of dollars in developing the silicon material system to increase performance and reduce cost. For decades, the industry has made Moore's Law, concerning cost and transistor density, a self-fulfilling prophecy by integrating technical and material requirements vertically down their supply chains and horizontally across competitors in the market. At recent technology nodes, the unacceptable scaling behavior of copper interconnects has become a major design constraint by increasing latency and power consumption---more than 50% of the power consumed by high speed processors is dissipated by intrachip communications. Optical networks at the chip scale are a potential low-power high-bandwidth replacement for conventional global interconnects, but the lack of efficient on-chip optical sources has remained an outstanding problem despite significant advances in silicon optoelectronics. Many material systems are being researched, but there is no ideal candidate even though the established infrastructure strongly favors a CMOS-compatible solution. This thesis focuses on assessing the optical properties of materials using microdisk cavities with the intention to advance processing techniques and materials relevant to silicon photonics. Low-loss microdisk resonators are chosen because of their simplicity and long optical path lengths. A localized photonic probe is developed and characterized that employs a tapered optical-fiber waveguide, and it is utilized in practical demonstrations to test tightly arranged devices and to help prototype new fabrication methods. A case study in AlxGa1-xAs illustrates how the optical scattering and absorption losses can be obtained from the cavity-waveguide transmission. Finally, single-crystal Er2O3 epitaxially grown on silicon is analyzed in detail as a potential CMOS-compatable gain medium due to its high Er3

  12. Symmetry energy, its density slope, and neutron-proton effective mass splitting at normal density extracted from global nucleon optical potentials

    Xu Chang; Li Baoan; Chen Liewen


    Based on the Hugenholtz-Van Hove theorem, it is shown that both the symmetry energy E sym (ρ) and its density slope L(ρ) at normal density ρ 0 are completely determined by the nucleon global optical potentials. The latter can be extracted directly from nucleon-nucleus scatterings, (p,n) charge-exchange reactions, and single-particle energy levels of bound states. Averaging all phenomenological isovector nucleon potentials constrained by world data available in the literature since 1969, the best estimates of E sym (ρ 0 )=31.3 MeV and L(ρ 0 )=52.7 MeV are simultaneously obtained. Moreover, the corresponding neutron-proton effective mass splitting in neutron-rich matter of isospin asymmetry δ is estimated to be (m n * -m p * )/m=0.32δ.

  13. Opto-Electronic and Interconnects Hierarchical Design Automation System (OE-IDEAS)

    Turowski, M


    As microelectronics technology continues to advance, the associated electrical interconnection technology is not likely to keep pace, due to many parasitic effects appearing in metallic interconnections...

  14. Knowledge Access in Rural Inter-connected Areas Network ...

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... the existing network to include two thematic networks on food security and rural ... Woman conquering male business in Yemen : Waleya's micro-enterprise.

  15. Knowledge Access in Rural Inter-connected Areas Network ...

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... poor by sharing innovations, best practices and indigenous knowledge using ... A third thematic network - on knowledge management strategies - will play an ...

  16. Interconnected Power Systems Mexico-Guatemala financed by BID

    Martinez, Veronica


    The article describes the plans for the interconnection of the electric power systems of Guatemala, El Salvador, Honduras, Nicaragua, Costa Rica, Panama and Mexico within the project Plan Pueba Panama. The objective of the interconnection is to create an electric market in the region that contributes to reduce costs and prices. The project will receive a financing of $37.5 millions of US dollars from the Banco Intrameramericano de Desarrollo (BID)

  17. Robust design of head interconnect for hard disk drive

    Gao, X. K.; Liu, Q. H.; Liu, Z. J.


    Design of head interconnect is one of the important issues for hard disk drives with higher data rate and storage capacity. The impedance of interconnect and electromagnetic coupling influence the quality level of data communication. Thus an insightful study on how the trace configuration affects the impedance and crosstalk is necessary. An effective design approach based on Taguchi's robust design method is employed therefore in an attempt to realize impedance matching and crosstalk minimization with the effects of uncontrollable sources taken into consideration.

  18. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.


    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  19. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  20. Load shedding scheme in the south/southeastern interconnected system

    Vieira Filho, Xisto; Couri, J J.G.; Gomes, P; Almeida, P C [ELETROBRAS, Rio de Janeiro, RJ (Brazil)


    This paper presents some characteristics of the Brazilian interconnected system and discusses the load shedding scheme in its different stages considering the beginning of operation of the Itaipu power plant. The present situation of the South and Southeastern load shedding scheme combination is also commented. Finally, the interconnected system evolution and the effects on the load shedding schemes are discussed. 4 refs., 5 figs., 2 tabs.

  1. A Vision of China-Arab Interconnection Transmission Network Planning with UHVDC Technology

    Wu, Dan; Liu, Yujun; Yin, Hongyuan; Xu, Qingshan; Xu, Xiaohui; Ding, Maosheng


    Developments in ultra-high-voltage (UHV) power systems and clean energy technologies are paving the way towards unprecedented energy market globalization. In accordance with the international community’s enthusiasm for building up the Global Energy Internet, this paper focuses on the feasibility of transmitting large-size electricity from northwest China to Arab world through a long-distance transnational power interconnection. The complete investigations on the grids of both the sending-end and receiving-end is firstly presented. Then system configuration of the transmission scheme and corridor route planning is proposed with UHVDC technology. Based on transmission costs’ investigation about similar transmission projects worldwide, the costs of the proposed transmission scheme are estimated through adjustment factors which represent differences in latitude, topography and economy. The proposed China-Arab transmission line sheds light on the prospects of power cooperation and resource sharing between China and Arab states, and appeals for more emphasis on green energy concentrated power interconnections from a global perspective.

  2. Interconnections between energy and the environment

    Darmstadter, J.; Fri, R.W.


    Virtually every phase of energy production, delivery, and use exacts some environmental toll: land disturbance from coal mining, toxic residues as a by-product of petroleum extraction, oil spillage from tanker operations, airborne emissions from power pants, buildup of radioactive nuclear wastes. Despite these cost, however, energy delivers services that are essential to economic well-being. The challenge is to mange the energy system to produce both the economic and environmental benefits that people value. Meeting this goal is a global challenge on both fronts. The economic challenge is neither less daunting nor less global. The purpose of this article is to assess whether the energy system can in fact be managed to produce both the economic and environmental services likely to be demanded of it. There is as yet not definitive answer to this question, and we do not provide one here. The authors can, however, sketch some of the prerequisites to a successful outcome

  3. Development and the global environment

    Colombo, U.


    The development of the Third World and the protection of the environment are two major global problems interconnected by energy - the motor of economic growth and the main cause of deterioration of the global environment. They can no longer be separated. The threats of ozone, acid rain, and global warming are global in scope and solutions must involve energy consumption, conservations, and renewable resources. The precept that development should hinge on sound management of natural resources and the environment no longer has merely local or regional significance. It is a global concern and each person should feel a sense of ethical commitment as a world citizen

  4. Experimental Comparison of 56 Gbit/s PAM-4 and DMT for Data Center Interconnect Applications

    Eiselt, Nicklas; Dochhan, Annika; Griesser, Helmut


    Four-level pulse amplitude modulation (PAM-4) and discrete multi-tone transmission (DMT) in combination with intensity modulation and direct-detection are two promising approaches for a low-power and low-cost solution for the next generation of data center interconnect applications. We experiment......Four-level pulse amplitude modulation (PAM-4) and discrete multi-tone transmission (DMT) in combination with intensity modulation and direct-detection are two promising approaches for a low-power and low-cost solution for the next generation of data center interconnect applications. We...... experimentally investigate and compare both modulation formats at a data rate of 56 Gb/s and a transmission wavelength of 1544 nm using the same experimental setup. We show that PAM-4 outperforms double sideband DMT and also vestigial sideband DMT for the optical back-to-back (b2b) case and also...... for a transmission distance of 80 km SSMF in terms of required OSNR at a FEC-threshold of 3.8e-3. However, it is also pointed out that both versions of DMT do not require any optical dispersion compensation to transmit over 80 km SSMF while this is essential for PAM-4. Thus, implementation effort and cost may...

  5. Optical Computers and Space Technology

    Abdeldayem, Hossin A.; Frazier, Donald O.; Penn, Benjamin; Paley, Mark S.; Witherow, William K.; Banks, Curtis; Hicks, Rosilen; Shields, Angela


    The rapidly increasing demand for greater speed and efficiency on the information superhighway requires significant improvements over conventional electronic logic circuits. Optical interconnections and optical integrated circuits are strong candidates to provide the way out of the extreme limitations imposed on the growth of speed and complexity of nowadays computations by the conventional electronic logic circuits. The new optical technology has increased the demand for high quality optical materials. NASA's recent involvement in processing optical materials in space has demonstrated that a new and unique class of high quality optical materials are processible in a microgravity environment. Microgravity processing can induce improved orders in these materials and could have a significant impact on the development of optical computers. We will discuss NASA's role in processing these materials and report on some of the associated nonlinear optical properties which are quite useful for optical computers technology.

  6. Global Estimates of Average Ground-Level Fine Particulate Matter Concentrations from Satellite-Based Aerosol Optical Depth

    Van Donkelaar, A.; Martin, R. V.; Brauer, M.; Kahn, R.; Levy, R.; Verduzco, C.; Villeneuve, P.


    Exposure to airborne particles can cause acute or chronic respiratory disease and can exacerbate heart disease, some cancers, and other conditions in susceptible populations. Ground stations that monitor fine particulate matter in the air (smaller than 2.5 microns, called PM2.5) are positioned primarily to observe severe pollution events in areas of high population density; coverage is very limited, even in developed countries, and is not well designed to capture long-term, lower-level exposure that is increasingly linked to chronic health effects. In many parts of the developing world, air quality observation is absent entirely. Instruments aboard NASA Earth Observing System satellites, such as the MODerate resolution Imaging Spectroradiometer (MODIS) and the Multi-angle Imaging SpectroRadiometer (MISR), monitor aerosols from space, providing once daily and about once-weekly coverage, respectively. However, these data are only rarely used for health applications, in part because the can retrieve the amount of aerosols only summed over the entire atmospheric column, rather than focusing just on the near-surface component, in the airspace humans actually breathe. In addition, air quality monitoring often includes detailed analysis of particle chemical composition, impossible from space. In this paper, near-surface aerosol concentrations are derived globally from the total-column aerosol amounts retrieved by MODIS and MISR. Here a computer aerosol simulation is used to determine how much of the satellite-retrieved total column aerosol amount is near the surface. The five-year average (2001-2006) global near-surface aerosol concentration shows that World Health Organization Air Quality standards are exceeded over parts of central and eastern Asia for nearly half the year.

  7. Cyclic deformation-induced solute transport in tissue scaffolds with computer designed, interconnected, pore networks: experiments and simulations.

    Den Buijs, Jorn Op; Dragomir-Daescu, Dan; Ritman, Erik L


    Nutrient supply and waste removal in porous tissue engineering scaffolds decrease from the periphery to the center, leading to limited depth of ingrowth of new tissue into the scaffold. However, as many tissues experience cyclic physiological strains, this may provide a mechanism to enhance solute transport in vivo before vascularization of the scaffold. The hypothesis of this study was that pore cross-sectional geometry and interconnectivity are of major importance for the effectiveness of cyclic deformation-induced solute transport. Transparent elastic polyurethane scaffolds, with computer-programmed design of pore networks in the form of interconnected channels, were fabricated using a 3D printing and injection molding technique. The scaffold pores were loaded with a colored tracer for optical contrast, cyclically compressed with deformations of 10 and 15% of the original undeformed height at 1.0 Hz. Digital imaging was used to quantify the spatial distribution of the tracer concentration within the pores. Numerical simulations of a fluid-structure interaction model of deformation-induced solute transport were compared to the experimental data. The results of experiments and modeling agreed well and showed that pore interconnectivity heavily influences deformation-induced solute transport. Pore cross-sectional geometry appears to be of less relative importance in interconnected pore networks. Validated computer models of solute transport can be used to design optimal scaffold pore geometries that will enhance the convective transport of nutrients inside the scaffold and the removal of waste, thus improving the cell survivability deep inside the scaffold.

  8. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.


    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  9. 76 FR 16405 - Notice of Attendance at PJM INterconnection, L.L.C., Meetings


    ... INterconnection, L.L.C., Meetings The Federal Energy Regulatory Commission (Commission) hereby gives notice that members of the Commission and Commission staff may attend upcoming PJM Interconnection, L.L.C., (PJM...: Docket No. EL05-121, PJM Interconnection, L.L.C. Docket No. ER06-456, PJM Interconnection, L.L.C. Docket...

  10. Electrode and interconnect for miniature fuel cells using direct methanol feed

    Narayanan, Sekharipuram R. (Inventor); Valdez, Thomas I. (Inventor); Clara, Filiberto (Inventor)


    An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

  11. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.


    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  12. Global Learning in a New Era

    Ramaley, Judith


    Our nation's colleges and universities frequently adapt their approach to education in response to the reality of social, economic and environmental challenges. Today the reality is that we are increasingly interconnected on a global scale. This new era of globalization impacts every facet of society, and it offers both an exciting blend of…

  13. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.


    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  14. Online Simulations of Global Aerosol Distributions in the NASA GEOS-4 Model and Comparisons to Satellite and Ground-Based Aerosol Optical Depth

    Colarco, Peter; daSilva, Arlindo; Chin, Mian; Diehl, Thomas


    We have implemented a module for tropospheric aerosols (GO CART) online in the NASA Goddard Earth Observing System version 4 model and simulated global aerosol distributions for the period 2000-2006. The new online system offers several advantages over the previous offline version, providing a platform for aerosol data assimilation, aerosol-chemistry-climate interaction studies, and short-range chemical weather forecasting and climate prediction. We introduce as well a methodology for sampling model output consistently with satellite aerosol optical thickness (AOT) retrievals to facilitate model-satellite comparison. Our results are similar to the offline GOCART model and to the models participating in the AeroCom intercomparison. The simulated AOT has similar seasonal and regional variability and magnitude to Aerosol Robotic Network (AERONET), Moderate Resolution Imaging Spectroradiometer, and Multiangle Imaging Spectroradiometer observations. The model AOT and Angstrom parameter are consistently low relative to AERONET in biomass-burning-dominated regions, where emissions appear to be underestimated, consistent with the results of the offline GOCART model. In contrast, the model AOT is biased high in sulfate-dominated regions of North America and Europe. Our model-satellite comparison methodology shows that diurnal variability in aerosol loading is unimportant compared to sampling the model where the satellite has cloud-free observations, particularly in sulfate-dominated regions. Simulated sea salt burden and optical thickness are high by a factor of 2-3 relative to other models, and agreement between model and satellite over-ocean AOT is improved by reducing the model sea salt burden by a factor of 2. The best agreement in both AOT magnitude and variability occurs immediately downwind of the Saharan dust plume.

  15. Preface to the special issue on ;Optical Communications Exploiting the Space Domain;

    Wang, Jian; Yu, Siyuan; Li, Guifang


    The demand for high capacity optical communications will continue to be driven by the exponential growth of global internet traffic. Optical communications are about the exploitation of different physical dimensions of light waves, including complex amplitude, frequency (or wavelength), time, polarization, etc. Conventional techniques such as wavelength-division multiplexing (WDM), time-division multiplexing (TDM) and polarization-division multiplexing (PDM) have almost reached their scalability limits. Space domain is the only known physical dimension left and space-division multiplexing (SDM) seems the only option to further scale the transmission capacity and spectral efficiency of optical communications. In recent years, few-mode fiber (FMF), multi-mode fiber (MMF), multi-core fiber (MCF) and few-mode multi-core fiber (FM-MCF) have been widely explored as promising candidates for fiber-based SDM. The challenges for SDM include efficient (de)multiplexer, amplifiers, and multiple-input multiple-output (MIMO) digital signal processing (DSP) techniques. Photonic integration will also be a key technology to SDM. Meanwhile, free-space and underwater optical communications have also exploited the space domain to increase the transmission capacity and spectral efficiency. The challenges include long-distance transmission limited by propagation loss, divergence, scattering and turbulence. Very recently, helically phased light beams carrying orbital angular momentum (OAM) have also seen potential applications both in free-space, underwater and fiber-based optical communications. Actually, different mode bases such as linearly polarized (LP) modes and OAM modes can be employed for SDM. Additionally, SDM could be used in chip-scale photonic interconnects and data center optical interconnects. Quantum processing exploiting the space domain is of great interest. The information capacity limit and physical layer security in SDM optical communications systems are important

  16. Generation adequacy and transmission interconnection in regional electricity markets

    Cepeda, Mauricio; Saguan, Marcelo; Finon, Dominique; Pignon, Virginie


    The power system capacity adequacy has public good features that cannot be entirely solved by electricity markets. Regulatory intervention is then necessary and established methods have been used to assess adequacy and help regulators to fix this market failure. In regional electricity markets, transmission interconnections play an important role in contributing to adequacy. However, the adequacy problem and related policy are typically considered at a national level. This paper presents a simple model to study how the interconnection capacity interacts with generation adequacy. First results indicate that increasing interconnection capacity between systems improves adequacy up to a certain level; further increases do not procure additional adequacy improvements. Furthermore, besides adequacy improvement, increasing transmission capacity under asymmetric adequacy criteria or national system characteristics could create several concerns about externalities. These results imply that regional coordination of national adequacy policies is essential to internalise adequacy of cross-border effects.

  17. Performance of WCN diffusion barrier for Cu multilevel interconnects

    Lee, Seung Yeon; Ju, Byeong-Kwon; Kim, Yong Tae


    The electrical and thermal properties of a WCN diffusion barrier have been studied for Cu multilevel interconnects. The WCN has been prepared using an atomic layer deposition system with WF6-CH4-NH3-H2 gases and has a very low resistivity of 100 µΩ cm and 96.9% step coverage on the high-aspect-ratio vias. The thermally stable WCN maintains an amorphous state at 800 °C and Cu/WCN contact resistance remains within a 10% deviation from the initial value after 700 °C. The mean time to failure suggests that the Cu/WCN interconnects have a longer lifetime than Cu/TaN and Cu/WN interconnects because WCN prevents Cu migration owing to the stress evolution from tensile to compressive.

  18. Net Metering and Interconnection Procedures-- Incorporating Best Practices

    Jason Keyes, Kevin Fox, Joseph Wiedman, Staff at North Carolina Solar Center


    State utility commissions and utilities themselves are actively developing and revising their procedures for the interconnection and net metering of distributed generation. However, the procedures most often used by regulators and utilities as models have not been updated in the past three years, in which time most of the distributed solar facilities in the United States have been installed. In that period, the Interstate Renewable Energy Council (IREC) has been a participant in more than thirty state utility commission rulemakings regarding interconnection and net metering of distributed generation. With the knowledge gained from this experience, IREC has updated its model procedures to incorporate current best practices. This paper presents the most significant changes made to IREC’s model interconnection and net metering procedures.

  19. All-zigzag graphene nanoribbons for planar interconnect application

    Chen, Po-An; Chiang, Meng-Hsueh; Hsu, Wei-Chou


    A feasible "lightning-shaped" zigzag graphene nanoribbon (ZGNR) structure for planar interconnects is proposed. Based on the density functional theory and non-equilibrium Green's function, the electron transport properties are evaluated. The lightning-shaped structure increases significantly the conductance of the graphene interconnect with an odd number of zigzag chains. This proposed technique can effectively utilize the linear I-V characteristic of asymmetric ZGNRs for interconnect application. Variability study accounting for width/length variation and the edge effect is also included. The transmission spectra, transmission eigenstates, and transmission pathways are analyzed to gain the physical insights. This lightning-shaped ZGNR enables all 2D material-based devices and circuits on flexible and transparent substrates.

  20. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    Qaiser, Nadeem


    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.

  1. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    Qaiser, Nadeem; Khan, S. M.; Nour, Maha A.; Rehman, M. U.; Rojas, J. P.; Hussain, Muhammad Mustafa


    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.




    TThe globalization, complex interconnection process of the economies of states, is a reality of the XXI century. However, at the end of the first decade of this century, besides the positive effects of this process, due to the economic interconnections created, it has favored also a rapid propagation of a negative economic phenomenon: the global economic crisis. Its impact significantly influenced the hospitality industry, important component of modern economies. This paper examines over a pe...

  3. Natural gas and electrical interconnections in the Mediterranean Basin

    Grenon, M.


    Intermediate and long term socio-economical and energetic scenarios have shown that mediterranean basin countries will know a great growth of energy demand, particularly power demand. The first part of this paper describes the main projects for the establishment of interconnected natural gas systems through Mediterranean sea, by pipelines (Algeria-Tunisia-Libya project, Algeria-Morocco-Spain project, Libya-Italy project). The second part describes the main projects of electrical networks with the establishment of undersea links between Spain and Morocco, and between Italy and Tunisia; beefing up the interconnections between the North African countries; and developing ties in the Near East (from Egypt to Turkey)

  4. EEG simulation by 2D interconnected chaotic oscillators

    Kubany, Adam; Mhabary, Ziv; Gontar, Vladimir


    Research highlights: → ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. → An inverse problem solution (PRCGA) is proposed. → Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  5. Fundamentals of reliability engineering applications in multistage interconnection networks

    Gunawan, Indra


    This book presents fundamentals of reliability engineering with its applications in evaluating reliability of multistage interconnection networks. In the first part of the book, it introduces the concept of reliability engineering, elements of probability theory, probability distributions, availability and data analysis.  The second part of the book provides an overview of parallel/distributed computing, network design considerations, and more.  The book covers a comprehensive reliability engineering methods and its practical aspects in the interconnection network systems. Students, engineers, researchers, managers will find this book as a valuable reference source.

  6. Load Frequency Control of AC Microgrid Interconnected Thermal Power System

    Lal, Deepak Kumar; Barisal, Ajit Kumar


    In this paper, a microgrid (MG) power generation system is interconnected with a single area reheat thermal power system for load frequency control study. A new meta-heuristic optimization algorithm i.e. Moth-Flame Optimization (MFO) algorithm is applied to evaluate optimal gains of the fuzzy based proportional, integral and derivative (PID) controllers. The system dynamic performance is studied by comparing the results with MFO optimized classical PI/PID controllers. Also the system performance is investigated with fuzzy PID controller optimized by recently developed grey wolf optimizer (GWO) algorithm, which has proven its superiority over other previously developed algorithm in many interconnected power systems.

  7. EEG simulation by 2D interconnected chaotic oscillators

    Kubany, Adam, E-mail: [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel); Mhabary, Ziv; Gontar, Vladimir [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel)


    Research highlights: ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. An inverse problem solution (PRCGA) is proposed. Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  8. Supplemental Information for New York State Standardized Interconnection Requirements

    Ingram, Michael [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narang, David J. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Mather, Barry A. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Kroposki, Benjamin D. [National Renewable Energy Laboratory (NREL), Golden, CO (United States)


    This document is intended to aid in the understanding and application of the New York State Standardized Interconnection Requirements (SIR) and Application Process for New Distributed Generators 5 MW or Less Connected in Parallel with Utility Distribution Systems, and it aims to provide supplemental information and discussion on selected topics relevant to the SIR. This guide focuses on technical issues that have to date resulted in the majority of utility findings within the context of interconnecting photovoltaic (PV) inverters. This guide provides background on the overall issue and related mitigation measures for selected topics, including substation backfeeding, anti-islanding and considerations for monitoring and controlling distributed energy resources (DER).

  9. Compact models and performance investigations for subthreshold interconnects

    Dhiman, Rohit


    The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wi

  10. Performance analysis and comparison of a minimum interconnections direct storage model with traditional neural bidirectional memories.

    Bhatti, A Aziz


    This study proposes an efficient and improved model of a direct storage bidirectional memory, improved bidirectional associative memory (IBAM), and emphasises the use of nanotechnology for efficient implementation of such large-scale neural network structures at a considerable lower cost reduced complexity, and less area required for implementation. This memory model directly stores the X and Y associated sets of M bipolar binary vectors in the form of (MxN(x)) and (MxN(y)) memory matrices, requires O(N) or about 30% of interconnections with weight strength ranging between +/-1, and is computationally very efficient as compared to sequential, intraconnected and other bidirectional associative memory (BAM) models of outer-product type that require O(N(2)) complex interconnections with weight strength ranging between +/-M. It is shown that it is functionally equivalent to and possesses all attributes of a BAM of outer-product type, and yet it is simple and robust in structure, very large scale integration (VLSI), optical and nanotechnology realisable, modular and expandable neural network bidirectional associative memory model in which the addition or deletion of a pair of vectors does not require changes in the strength of interconnections of the entire memory matrix. The analysis of retrieval process, signal-to-noise ratio, storage capacity and stability of the proposed model as well as of the traditional BAM has been carried out. Constraints on and characteristics of unipolar and bipolar binaries for improved storage and retrieval are discussed. The simulation results show that it has log(e) N times higher storage capacity, superior performance, faster convergence and retrieval time, when compared to traditional sequential and intraconnected bidirectional memories.

  11. Use of ENVISAT ASAR Global Monitoring Mode to complement optical data in the mapping of rapid broad-scale flooding in Pakistan

    D. O'Grady


    Full Text Available Envisat ASAR Global Monitoring Mode (GM data are used to produce maps of the extent of the flooding in Pakistan which are made available to the rapid response effort within 24 h of acquisition. The high temporal frequency and independence of the data from cloud-free skies makes GM data a viable tool for mapping flood waters during those periods where optical satellite data are unavailable, which may be crucial to rapid response disaster planning, where thousands of lives are affected. Image differencing techniques are used, with pre-flood baseline image backscatter values being deducted from target values to eliminate regions with a permanent flood-like radar response due to volume scattering and attenuation, and to highlight the low response caused by specular reflection by open flood water. The effect of local incidence angle on the received signal is mitigated by ensuring that the deducted image is acquired from the same orbit track as the target image. Poor separability of the water class with land in areas beyond the river channels is tackled using a region-growing algorithm which seeks threshold-conformance from seed pixels at the center of the river channels. The resultant mapped extents are tested against MODIS SWIR data where available, with encouraging results.

  12. Optical measuring system with an interrogator and a polymer-based single-mode fibre optic sensor system


    The present invention relates to an optical measuring system comprising a polymer-based single-mode fibre-optic sensor system (102), an optical interrogator (101), and an optical arrangement (103) interconnecting the optical interrogator (101) and the polymer-based single-mode fibre-optic sensor...... system (102). The invention further relates to an optical interrogator adapted to be connected to a polymer-based single-mode fibre-optic sensor system via an optical arrangement. The interrogator comprises a broadband light source arrangement (104) and a spectrum analysing arrangement which receives...

  13. Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.

    Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng


    In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

  14. Characteristics of via-hole interconnections fabricated by using an inkjet printing method

    Yang, Yong Suk; You, In Kyu; Koo, Jae Bon; Lee, Sang Seok; Lim, Sang Chul; Kang, Seong Youl; Noh, Yong Young


    Inkjet printing is a familiar technique that creates and releases droplets of fluid on demand and precisely deposits those droplets on a substrate. It has received increased attention for its novelty and ability to produce patterned and template material structures. In the application of electronic interconnection fabrication, drop-on-demand inkjet printers especially offer the advantages of contactless printing and eliminat the use of a die or photomask. In this study, we created a via-hole interconnecting structure through a polymer insulator layer by using an inkjet printing. When the droplets of Ag ink were dropped onto a PMMA/Au/Cr/SiO 2 /Si area and the Ag film was annealed at high temperatures, the Ag ink containing solvents penetrated into the PMMA layer and generated the conducting paths between the top Ag and the bottom Au electrodes by partial dissolution and swelling of the polymer. The surface and the cross-sectional topologies of the formed via-holes were investigated by using an optical microscope and a field emission transmission electron microscope.

  15. Encoded low swing for ultra low power interconnect

    Krishnan, R.; Pineda de Gyvez, J.


    We present a novel encoded-low swing technique for ultra low power interconnect. Using this technique and an efficient circuit implementation, we achieve an average of 45.7% improvement in the power-delay product over the schemes utilizing low swing techniques alone, for random bit streams. Also, we

  16. Distributed Robustness Analysis of Interconnected Uncertain Systems Using Chordal Decomposition

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard


    Large-scale interconnected uncertain systems commonly have large state and uncertainty dimensions. Aside from the heavy computational cost of performing robust stability analysis in a centralized manner, privacy requirements in the network can also introduce further issues. In this paper, we util...

  17. Interconnecting Microgrids via the Energy Router with Smart Energy Management

    Yingshu Liu


    Full Text Available A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage equipment. The key idea is to establish complementary energy exchange between adjacent microgrids through a multiport electrical energy router, according to the consideration that adjacent microgrids may differ substantially in terms of their patterns of energy production and consumption, which can be utilized to compensate for each other’s instant energy deficit. Based on multiport bidirectional voltage source converters (VSCs and a shared direct current (DC power line, the energy router serves as an energy hub, and enables flexible energy flow among the adjacent microgrids and the main grid. The analytical model is established for the whole system, including the energy router, the interconnected microgrids and the main grid. Various operational modes of the interconnected microgrids, facilitated by the energy router, are analyzed, and the corresponding control strategies are developed. Simulations are carried out on the Matlab/Simulink platform, and the results have demonstrated the validity and reliability of the idea for microgrid interconnection as well as the corresponding control strategies for flexible energy flow.

  18. The myth of interconnected plastids and related phenomena.

    Schattat, Martin H; Barton, Kiah A; Mathur, Jaideep


    Studies spread over nearly two and a half centuries have identified the primary plastid in autotrophic algae and plants as a pleomorphic, multifunctional organelle comprising of a double-membrane envelope enclosing an organization of internal membranes submerged in a watery stroma. All plastid units have been observed extending and retracting thin stroma-filled tubules named stromules sporadically. Observations on living plant cells often convey the impression that stromules connect two or more independent plastids with each other. When photo-bleaching techniques were used to suggest that macromolecules such as the green fluorescent protein could flow between already interconnected plastids, for many people this impression changed to conviction. However, it was noticed only recently that the concept of protein flow between plastids rests solely on the words "interconnected plastids" for which details have never been provided. We have critically reviewed botanical literature dating back to the 1880s for understanding this term and the phenomena that have become associated with it. We find that while meticulously detailed ontogenic studies spanning nearly 150 years have established the plastid as a singular unit organelle, there is no experimental support for the idea that interconnected plastids exist under normal conditions of growth and development. In this review, while we consider several possibilities that might allow a single elongated plastid to be misinterpreted as two or more interconnected plastids, our final conclusion is that the concept of direct protein flow between plastids is based on an unfounded assumption.

  19. Load frequency control of three area interconnected hydro-thermal ...

    This paper present analysis on dynamic performance of Load Frequency Control (LFC) of three area interconnected hydrothermal reheat power system by the use of Artificial Intelligent and PI Controller. In the proposed scheme, control methodology developed using conventional PI controller, Artificial Neural Network ...

  20. Optimal interconnect ATPG under a ground-bounce constraint

    Hollmann, H.D.L.; Marinissen, E.J.; Vermeulen, B.

    In order to prevent ground bounce, Automatic Test Pattern Generation (ATPG) algorithms for wire interconnects have recently been extended with the capability to restrict the maximal Hamming distance between any two consecutive test patterns to a user-defined integer, referred to as the

  1. Time analysis of interconnection network implemented on the honeycomb architecture

    Milutinovic, D [Inst. Michael Pupin, Belgrade (Yugoslavia)


    Problems of time domains analysis of the mapping of interconnection networks for parallel processing on one form of uniform massively parallel architecture of the cellular type are considered. The results of time analysis are discussed. It is found that changing the technology results in changing the mapping rules. 17 refs.

  2. Area analysis of interconnection networks implemented on the honeycomb architecture

    Milutinovic, D


    The are utilization of interconnection networks for parallel processing on one form of uniform parallel architecture of cellular type is analyzed. Formulae for the number of cells necessity to realize a networks and the efficiency factor of the system are derived. 15 refs.

  3. 14 CFR 25.957 - Flow between interconnected tanks.


    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Powerplant Fuel System § 25.957 Flow between interconnected tanks. If fuel can be pumped from one tank to another in flight, the fuel tank vents and the fuel transfer system must be designed so that no structural damage to the tanks can occur because of overfilling. ...

  4. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

    Salman Shafqat


    Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

  5. Ultra-stretchable Interconnects for high-density stretchable electronics

    Shafqat, S.; Hoefnagels, J.P.M.; Savov, A.; Joshi, S.; Dekker, R.; Geers, M.G.D.


    The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for

  6. On Interconnections of Infinite-dimensional Port-Hamiltonian Systems

    Pasumarthy, Ramkrishna; Schaft, Arjan J. van der


    Network modeling of complex physical systems leads to a class of nonlinear systems called port-Hamiltonian systems, which are defined with respect to a Dirac structure (a geometric structure which formalizes the power-conserving interconnection structure of the system). A power conserving

  7. On interconnections of infinite-dimensional port-Hamiltonian systems

    Ramkrishna Pasumarthy, R.P.; van der Schaft, Arjan


    Network modeling of complex physical systems leads to a class of nonlinear systems called port-Hamiltonian systems, which are defined with respect to a Dirac structure (a geometric structure which formalizes the power-conserving interconnection structure of the system). A power conserving

  8. Bandwidth Analysis of Functional Interconnects Used as Test Access Mechanism

    Van den Berg, A.; Ren, P.; Marinissen, E.J.; Gaydadjiev, G.; Goossens, K.


    Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or

  9. Bandwidth analysis of functional interconnects used as test access mechanism

    Berg, van den Ardy; Ren, P.; Marinissen, Erik Jan; Gaydadjiev, G.N.; Goossens, K.G.W.


    Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or

  10. Cascade-robustness optimization of coupling preference in interconnected networks

    Zhang, Xue-Jun; Xu, Guo-Qiang; Zhu, Yan-Bo; Xia, Yong-Xiang


    Highlights: • A specific memetic algorithm was proposed to optimize coupling links. • A small toy model was investigated to examine the underlying mechanism. • The MA optimized strategy exhibits a moderate assortative pattern. • A novel coupling coefficient index was proposed to quantify coupling preference. - Abstract: Recently, the robustness of interconnected networks has attracted extensive attentions, one of which is to investigate the influence of coupling preference. In this paper, the memetic algorithm (MA) is employed to optimize the coupling links of interconnected networks. Afterwards, a comparison is made between MA optimized coupling strategy and traditional assortative, disassortative and random coupling preferences. It is found that the MA optimized coupling strategy with a moderate assortative value shows an outstanding performance against cascading failures on both synthetic scale-free interconnected networks and real-world networks. We then provide an explanation for this phenomenon from a micro-scope point of view and propose a coupling coefficient index to quantify the coupling preference. Our work is helpful for the design of robust interconnected networks.

  11. Security challenges for cooperative and interconnected mobility systems

    Bijlsma, T.; Kievit, S. de; Sluis, H.J.D. van de; Nunen, E. van; Passchier, I.; Luiijf, H.A.M.


    Software is becoming an important part of the innovation for vehicles. In addition, the systems in vehicles become interconnected and also get external connections, to the internet and Vehicular Ad hoc NETworks (VANETs). These trends form a combined security and safety threat, because recent

  12. A high-speed interconnect network using ternary logic

    Madsen, Jens Kargaard; Long, S. I.


    This paper describes the design and implementation of a high-speed interconnect network (ICN) for a multiprocessor system using ternary logic. By using ternary logic and a fast point-to-point communication technique called STARI (Self-Timed At Receiver's Input), the communication between...

  13. Early resistance change and stress/electromigrationmodeling in aluminium interconnects

    Petrescu, V.; Mouthaan, A.J.; Schoenmaker, W.


    A complete description for early resistance change and two dimensional simulation of mechanical stress evolution in confined Al interconnects, related to the electromigration, is given in this paper. The model, combines the stress/ vacancy concentration evolution with the early resistance change of

  14. Knowledge Access in Rural Inter-connected Areas Network ...

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... and indigenous knowledge using information and communication technologies (ICTs) ... for research proposals on the aforementioned topics, action-research projects, ... Evaluating knowledge-sharing methods to improve land utilization and ...

  15. Creating Intentional Spaces for Sustainable Development in the Indian Trans-Himalaya: Reconceptualizing Globalization from Below

    Shah, Payal


    In an era of globalization, multifaceted and complex changes have increasingly interconnected geographically dispersed places. A central question of globalization studies concerns whether top-down forces of globalization are forging a global culture or whether processes of globalization from below are able to push back against homogenization by…


    National Aeronautics and Space Administration — The Optical Transient Detector (OTD) records optical measurements of global lightning events in the daytime and nighttime. The data includes individual point...

  17. Integrated optical circuit engineering V; Proceedings of the Meeting, San Diego, CA, Aug. 17-20, 1987

    Mentzer, Mark A.

    Recent advances in the theoretical and practical design and applications of optoelectronic devices and optical circuits are examined in reviews and reports. Topics discussed include system and market considerations, guided-wave phenomena, waveguide devices, processing technology, lithium niobate devices, and coupling problems. Consideration is given to testing and measurement, integrated optics for fiber-optic systems, optical interconnect technology, and optical computing.

  18. At the speed of light? electricity interconnections for Europe

    Nies, S.


    Electricity moves almost at the speed of light: 273,000 km per second. The speed of electricity makes it the ultimate 'just in time' commodity. A problem anywhere can be transmitted every where in a nanosecond. Electricity interconnection is a prominent issue in the news, sometimes even featured as a panacea for the shortcomings of the European electricity market - a panacea that will ensure security o supply, solidarity and pave the way for a promising use of renewables in the future. The present study is devoted to electricity interconnections in Europe, their current state and the projects concerning them. The study addresses the following questions: - What is the role of interconnections in the development of a sustainable grid that can emerge from the existing pieces, make optimum use of existing generation capacity, ensure energy security, and offer economies of scales? What is their role in the process of building a different energy concept, one that would be concerned with climate change and thus in favour of the use of renewables? - How are existing interconnections exploited and governed, and how can their exploitation be improved? Does the EU need more and new interconnections; and if so, where and why, and who is going to finance them? Prominent projects as such as Desertec, the debate on DC or AC lines, or the limits of synchronization, as well as the state of a potential East-West electricity linkage between Former Soviet Union and EU, termed UCTE-UPS/IPS, are discussed in the volume. Part I develops definitions and basic notions necessary for the understanding of the subject. It also addresses the independent variables that influence interconnections (here the dependent variable), and recounts the historical legacies and their enduring impact on today's grid. Part II is devoted to the EU legal framework and to the complex landscape of governance and its current state of transition. Part III addresses the management of existing interconnections and

  19. Digital optical computer II

    Guilfoyle, Peter S.; Stone, Richard V.


    OptiComp is currently completing a 32-bit, fully programmable digital optical computer (DOC II) that is designed to operate in a UNIX environment running RISC microcode. OptiComp's DOC II architecture is focused toward parallel microcode implementation where data is input in a dual rail format. By exploiting the physical principals inherent to optics (speed and low power consumption), an architectural balance of optical interconnects and software code efficiency can be achieved including high fan-in and fan-out. OptiComp's DOC II program is jointly sponsored by the Office of Naval Research (ONR), the Strategic Defense Initiative Office (SDIO), NASA space station group and Rome Laboratory (USAF). This paper not only describes the motivational basis behind DOC II but also provides an optical overview and architectural summary of the device that allows the emulation of any digital instruction set.

  20. Assessment of on-farm anaerobic digester grid interconnections

    Ruhnke, W.


    While several anaerobic digestion (AD) pilot plants have recently been built in Canada, early reports suggest that interconnection barriers are delaying their widescale implementation. This paper examined grid interconnection experiences from the perspectives of farmers, local distributing companies (LDCs) and other stakeholders. The aim of the paper was to identify challenges to the implementation of AD systems. Case studies included an Ontario Dairy Herd AD system generating 50 kW; a Saskatchewan hog farm AD system generating 120 kW and an Alberta outdoor beef feedlot AD system generating 1000 kW. Two survey forms were created for project operators, and LDCs. The following 3 category barriers were identified: (1) technical concerns over islanding conditions, power quality requirements, power flow studies and other engineering analyses; (2) business practices barriers such as a lack of response after initial utility contact; and (3) regulatory barriers including the unavailability of fair buy-back rates, the lack of net metering programs, restrictive net metering programs, and pricing issues. It was suggested that collaborative efforts among all stakeholders are needed to resolve barriers quickly. Recommendations included the adoption of uniform technical standards for connecting generators to the grid, as well as adopting standard commercial practices for any required LDC interconnection review. It was also suggested that standard business terms for interconnection agreements should be established. Regulatory principles should be compatible with distributed power choices in regulated and unregulated markets. It was concluded that resolving interconnection barriers is a critical step towards realizing market opportunities available for AD technologies. refs., tabs., figs

  1. Optics/Optical Diagnostics Laboratory

    Federal Laboratory Consortium — The Optics/Optical Diagnostics Laboratory supports graduate instruction in optics, optical and laser diagnostics and electro-optics. The optics laboratory provides...

  2. Rejuvenating direct modulation and direct detection for modern optical communications

    Che, Di; Li, An; Chen, Xi; Hu, Qian; Shieh, William


    High-speed transoceanic optical fiber transmission using direct modulation (DM) and direct detection (DD) was one of the most stirring breakthroughs for telecommunication in 1990s, which drove the internet as a global phenomenon. However, the later evolution of optical coherent communications in 2000s gradually took over the long-haul applications, due to its superior optical spectral efficiency. Nowadays, DM-DD systems are dominant mainly in cost- and power-sensitive short-reach applications, because of its natural characteristics-the simplicity. This paper reviews the recent advances of DM-DD transceivers from both hardware and signal processing perspectives. It introduces a variety of modified DM and/or DD systems for 3 application scenarios: very-short-reach interconnect with little fiber channel impact; single or a few spans of fiber transmission up to several hundred km; and distance beyond the 2nd scenario. Besides the DM-DD and multi-dimension DM-DD with polarization diversity, this paper focuses on how to rejuvenate traditional DM and DD technologies in order to bridge the transmission application gap between DM-DD and coherent transceivers, using technologies such as dispersion compensation, signal field recovery from the intensity-only DD receiver, and complex direct modulation with coherent detection. More than 30 years since the birth, DM and DD still hold indispensable roles in modern optical communications.

  3. 40-Gb/s all-optical processing systems using hybrid photonic integration technology

    Kehayas, E.; Tsiokos, D.; Bakapoulos, P.; Apostolopoulos, D.; Petrantonakis, D.; Stampoulidis, L.; Poustie, A.; McDougall, R.; Maxwell, G.D.; Liu, Y.; Zhang, S.; Dorren, H.J.S.; Seoane, J.; Van Holm-Nielsen, P.; Jeppesen, P.; Avramopoulos, H.


    This paper presents an experimental performance characterization of all-optical subsystems at 40 Gb/s using interconnected hybrid integrated all-optical semiconductor optical amplifier (SOA) Mach-Zehnder interferometer (MZI) gates and flip-flop prototypes. It was shown that optical gates can be

  4. Multiple atomic scale solid surface interconnects for atom circuits and molecule logic gates

    Joachim, C; Martrou, D; Gauthier, S; Rezeq, M; Troadec, C; Jie Deng; Chandrasekhar, N


    The scientific and technical challenges involved in building the planar electrical connection of an atomic scale circuit to N electrodes (N > 2) are discussed. The practical, laboratory scale approach explored today to assemble a multi-access atomic scale precision interconnection machine is presented. Depending on the surface electronic properties of the targeted substrates, two types of machines are considered: on moderate surface band gap materials, scanning tunneling microscopy can be combined with scanning electron microscopy to provide an efficient navigation system, while on wide surface band gap materials, atomic force microscopy can be used in conjunction with optical microscopy. The size of the planar part of the circuit should be minimized on moderate band gap surfaces to avoid current leakage, while this requirement does not apply to wide band gap surfaces. These constraints impose different methods of connection, which are thoroughly discussed, in particular regarding the recent progress in single atom and molecule manipulations on a surface.

  5. Mean-field modeling approach for understanding epidemic dynamics in interconnected networks

    Zhu, Guanghu; Fu, Xinchu; Tang, Qinggan; Li, Kezan


    Modern systems (e.g., social, communicant, biological networks) are increasingly interconnected each other formed as ‘networks of networks’. Such complex systems usually possess inconsistent topologies and permit agents distributed in different subnetworks to interact directly/indirectly. Corresponding dynamics phenomena, such as the transmission of information, power, computer virus and disease, would exhibit complicated and heterogeneous tempo-spatial patterns. In this paper, we focus on the scenario of epidemic spreading in interconnected networks. We intend to provide a typical mean-field modeling framework to describe the time-evolution dynamics, and offer some mathematical skills to study the spreading threshold and the global stability of the model. Integrating the research with numerical analysis, we are able to quantify the effects of networks structure and epidemiology parameters on the transmission dynamics. Interestingly, we find that the diffusion transition in the whole network is governed by a unique threshold, which mainly depends on the most heterogenous connection patterns of network substructures. Further, the dynamics is highly sensitive to the critical values of cross infectivity with switchable phases.

  6. Interchip link system using an optical wiring method.

    Cho, In-Kui; Ryu, Jin-Hwa; Jeong, Myung-Yung


    A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.

  7. Hybridization of active and passive elements for planar photonic components and interconnects

    Pearson, M.; Bidnyk, S.; Balakrishnan, A.


    The deployment of Passive Optical Networks (PON) for Fiber-to-the-Home (FTTH) applications currently represents the fastest growing sector of the telecommunication industry. Traditionally, FTTH transceivers have been manufactured using commodity bulk optics subcomponents, such as thin film filters (TFFs), micro-optic collimating lenses, TO-packaged lasers, and photodetectors. Assembling these subcomponents into a single housing requires active alignment and labor-intensive techniques. Today, the majority of cost reducing strategies using bulk subcomponents has been implemented making future reductions in the price of manufacturing FTTH transceivers unlikely. Future success of large scale deployments of FTTH depends on further cost reductions of transceivers. Realizing the necessity of a radically new packaging approach for assembly of photonic components and interconnects, we designed a novel way of hybridizing active and passive elements into a planar lightwave circuit (PLC) platform. In our approach, all the filtering components were monolithically integrated into the chip using advancements in planar reflective gratings. Subsequently, active components were passively hybridized with the chip using fully-automated high-capacity flip-chip bonders. In this approach, the assembly of the transceiver package required no active alignment and was readily suitable for large-scale production. This paper describes the monolithic integration of filters and hybridization of active components in both silica-on-silicon and silicon-on-insulator PLCs.

  8. Oxide-confined 2D VCSEL arrays for high-density inter/intra-chip interconnects

    King, Roger; Michalzik, Rainer; Jung, Christian; Grabherr, Martin; Eberhard, Franz; Jaeger, Roland; Schnitzer, Peter; Ebeling, Karl J.


    We have designed and fabricated 4 X 8 vertical-cavity surface-emitting laser (VCSEL) arrays intended to be used as transmitters in short-distance parallel optical interconnects. In order to meet the requirements of 2D, high-speed optical links, each of the 32 laser diodes is supplied with two individual top contacts. The metallization scheme allows flip-chip mounting of the array modules junction-side down on silicon complementary metal oxide semiconductor (CMOS) chips. The optical and electrical characteristics across the arrays with device pitch of 250 micrometers are quite homogeneous. Arrays with 3 micrometers , 6 micrometers and 10 micrometers active diameter lasers have been investigated. The small devices show threshold currents of 600 (mu) A, single-mode output powers as high as 3 mW and maximum wavelength deviations of only 3 nm. The driving characteristics of all arrays are fully compatible to advanced 3.3 V CMOS technology. Using these arrays, we have measured small-signal modulation bandwidths exceeding 10 GHz and transmitted pseudo random data at 8 Gbit/s channel over 500 m graded index multimode fiber. This corresponds to a data transmission rate of 256 Gbit/s per array of 1 X 2 mm2 footprint area.

  9. Optimization of Silicon MZM Fabrication Parameters for High Speed Short Reach Interconnects at 1310 nm

    Alexis Abraham


    Full Text Available Optical modulators are key components to realize photonic circuits, and Mach-Zehnder modulators (MZM are often used for high speed short reach interconnects. In order to maximize the tolerable path loss of a transmission link at a given bitrate, the MZM needs to be optimized. However, the optimization can be complex since the overall link performance depends on various parameters, and, for the MZM in particular, implies several trade-offs between efficiency, losses, and bandwidth. In this work, we propose a general and rigorous method to optimize silicon MZM. We first describe the optical link, and the numerical method used for this study. Then we present the results associated to the active region for 1310 nm applications. An analytical model is generated, and allows us to quickly optimize the p-n junction depending of the targeted performances for the MZM. Taking into account the required optical link parameters, the maximum tolerable path losses for different length of MZM is determined. By applying this method, simulations show that the optimum MZM length for 25 Gbps applications is 4 mm with an efficiency of 1.87 V·cm, 0.52 dB/mm of losses. A tolerable path loss of more than 25 dB is obtained.

  10. Introducing a Global Optical Model Approach for Analysing 16O+16O Elastic Scattering at 5-10MeV/nucleon Region

    Mehmet Küçükoğlu


    Full Text Available Abstract: In this paper, the experimental data on elastic scattering of the 16O+16O reaction for the energy range 5-10 MeV/nucleon have been analyzed within the optical model (OM formalism by using the phenomenological potential forms in Fresco code. When developing the shape of the nuclear potential for the calculations, we have used the Woods-Saxon (WS or Woods-Saxon squared (WS2 potentials for the imaginary part together with a WS2 type real part. Although most of the previous OM analyses using phenomenological potentials have provided reasonably good fits with the experimental measurements, none of them could completely relate the behavior of the imaginary potential to the energy of the projectile yet. However, we have managed to introduce two analyses that can keep the real potential parameters almost constant and suggest a linear expression for the depth of the imaginary part of the nuclear potential depending on the incidence energy. Thus, 16O+16O system within this wide energy range has been described globally by the optical potentials having a deep, attractive real potential part and a weaker, energy dependent absorptive imaginary potential part. It has been also shown that, our calculations with these potential forms can reproduce the experimental elastic scattering angular distributions successfully and the maxima and minima are predicted correctly for most of the energies. Key words: 16O+16O reaction, optical model, elastic scattering, cross-section, phenomenological potentials. 5-10MeV/nükleon Bölgesinde 16O+16O Esnek Saçılmasının Analizi için Global bir Optik Model Yaklaşımının Tanıtılması Özet: Bu çalışmada 5-10 MeV/nükleon enerji aralığında 16O+16O reaksiyonunun deneysel esnek saçılma verileri, optik model (OM formalizmi altında, Fresco kodunda fenomenolojik potansiyel formları kullanılarak analiz edilmektedir. Hesaplamalar için nükleer potansiyelin şekli oluşturulurken gerçel kısım için Woods

  11. Structural Analysis of an Integrated Model of Short Straight Section, Service Module, Jumper Connection and Magnet Interconnects for the Large Hadron Collider

    Dutta, S; Kumar, A; Skoczen, B; Soni, H C


    The Short Straight Section (SSS) of the Large Hadron Collider (LHC) may undergo relative displacements between cold-mass and cryostat for the following three reasons: - Fabrication tolerance of interconnection bellows - Global smoothing after pre-alignment - Ground motion in a sector of the LHC tunnel The forces responsible for such displacements stem from finite stiffness of interconnect bellows & metal hoses of the internal piping of the jumper connection and from relatively flexible 'glass fibre reinforced epoxy' (GFRE) composite supports of the cold mass. In addition, the vacuum jacket of the jumper connection and the large sleeves attached to both ends of SSS produce elastic deformations of the cryostat vessel. A unified finite element model consisting of cryostat, large sleeves, vacuum jacket of jumper, interconnection bellows, internal piping of jumper, composite cold supports and alignment jacks has been prepared. The knowledge of the position of the cold mass with respect to its cryostat under va...

  12. Vertically aligned multiwalled carbon nanotubes as electronic interconnects

    Gopee, Vimal Chandra

    The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace copper. Carbon nanotubes have been studied as a suitable replacement for copper due to its superior electrical, thermal and mechanical properties. One of the advantages of using carbon nanotubes is their high current carrying capacity which has been demonstrated to be three orders of magnitude greater than that of copper. Most approaches in the implementation of carbon nanotubes have so far focused on the growth in vias which limits their application. In this work, a process is described for the transfer of carbon nanotubes to substrates allowing their use for more varied applications. Arrays of vertically aligned multiwalled carbon nanotubes were synthesised by photo-thermal chemical vapour deposition with high growth rates. Raman spectroscopy was used to show that the synthesised carbon nanotubes were of high quality. The carbon nanotubes were exposed to an oxygen plasma and the nature of the functional groups present was determined using X-ray photoelectron spectroscopy. Functional groups, such as carboxyl, carbonyl and hydroxyl groups, were found to be present on the surface of the multiwalled carbon nanotubes after the functionalisation process. The multiwalled carbon nanotubes were metallised after the functionalisation process using magnetron sputtering. Two materials, solder and sintered silver, were chosen to bind carbon nanotubes to substrates so as to enable their transfer and also to make electrical contact. The wettability of solder to carbon nanotubes was investigated and it was demonstrated that both functionalisation and metallisation were required in order for solder to bond with the carbon nanotubes. Similarly, functionalisation followed by metallisation

  13. Fabrication method to create high-aspect ratio pillars for photonic coupling of board level interconnects

    Debaes, C.; Van Erps, J.; Karppinen, M.; Hiltunen, J.; Suyal, H.; Last, A.; Lee, M. G.; Karioja, P.; Taghizadeh, M.; Mohr, J.; Thienpont, H.; Glebov, A. L.


    An important challenge that remains to date in board level optical interconnects is the coupling between the optical waveguides on printed wiring boards and the packaged optoelectronics chips, which are preferably surface mountable on the boards. One possible solution is the use of Ball Grid Array (BGA) packages. This approach offers a reliable attachment despite the large CTE mismatch between the organic FR4 board and the semiconductor materials. Collimation via micro-lenses is here typically deployed to couple the light vertically from the waveguide substrate to the optoelectronics while allowing for a small misalignment between board and package. In this work, we explore the fabrication issues of an alternative approach in which the vertical photonic connection between board and package is governed by a micro-optical pillar which is attached both to the board substrate and to the optoelectronic chips. Such an approach allows for high density connections and small, high-speed detector footprints while maintaining an acceptable tolerance between board and package. The pillar should exhibit some flexibility and thus a high-aspect ratio is preferred. This work presents and compares different fabrication methods and applies different materials for such high-aspect ratio pillars. The different fabrication methods are: photolithography, direct laser writing and deep proton writing. The selection of optical materials that was investigated is: SU8, Ormocers, PU and a multifunctional acrylate polymer. The resulting optical pillars have diameters ranging from 20um up to 80um, with total heights ranging between 30um and 100um (symbol for micron). The aspect-ratio of the fabricated structures ranges from 1.5 to 5.

  14. Comparison of microrings and microdisks for high-speed optical modulation in silicon photonics

    Ying, Zhoufeng; Wang, Zheng; Zhao, Zheng; Dhar, Shounak; Pan, David Z.; Soref, Richard; Chen, Ray T.


    The past several decades have witnessed the gradual transition from electrical to optical interconnects, ranging from long-haul telecommunication to chip-to-chip interconnects. As one type of key component in integrated optical interconnect and high-performance computing, optical modulators have been well developed these past few years, including ultrahigh-speed microring and microdisk modulators. In this paper, a comparison between microring and microdisk modulators is well analyzed in terms of dimensions, static and dynamic power consumption, and fabrication tolerance. The results show that microdisks have advantages over microrings in these aspects, which gives instructions to the chip design of high-density integrated systems for optical interconnects and optical computing.

  15. 75 FR 6020 - Electrical Interconnection of the Lower Snake River Wind Energy Project


    ... DEPARTMENT OF ENERGY Bonneville Power Administration Electrical Interconnection of the Lower Snake River Wind Energy Project AGENCY: Bonneville Power Administration (BPA), Department of Energy (DOE... (BPA) has decided to offer Puget Sound Energy Inc., a Large Generator Interconnection Agreement for...

  16. Neural networks in continuous optical media

    Anderson, D.Z.


    The authors' interest is to see to what extent neural models can be implemented using continuous optical elements. Thus these optical networks represent a continuous distribution of neuronlike processors rather than a discrete collection. Most neural models have three characteristic features: interconnections; adaptivity; and nonlinearity. In their optical representation the interconnections are implemented with linear one- and two-port optical elements such as lenses and holograms. Real-time holographic media allow these interconnections to become adaptive. The nonlinearity is achieved with gain, for example, from two-beam coupling in photorefractive media or a pumped dye medium. Using these basic optical elements one can in principle construct continuous representations of a number of neural network models. The authors demonstrated two devices based on continuous optical elements: an associative memory which recalls an entire object when addressed with a partial object and a tracking novelty filter which identifies time-dependent features in an optical scene. These devices demonstrate the potential of distributed optical elements to implement more formal models of neural networks

  17. Conductive polymer/metal composites for interconnect of flexible devices

    Kawakita, Jin; Hashimoto Shinoda, Yasuo; Shuto, Takanori; Chikyow, Toyohiro


    An interconnect of flexible and foldable devices based on advanced electronics requires high electrical conductivity, flexibility, adhesiveness on a plastic substrate, and efficient productivity. In this study, we investigated the applicability of a conductive polymer/metal composite to the interconnect of flexible devices. By combining an inkjet process and a photochemical reaction, micropatterns of a polypyrrole/silver composite were formed on flexible plastic substrates with an average linewidth of approximately 70 µm within 10 min. The conductivity of the composite was improved to 6.0 × 102 Ω-1·cm-1. From these results, it is expected that the conducting polymer/metal composite can be applied to the microwiring of flexible electronic devices.

  18. Security analysis of interconnected AC/DC systems

    Eriksson, Robert


    This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid...... any line or transformer limits. Simulations were performed in a model of the Nordic power system where a dc grid is placed on top. The simulation supports the method as a tool to consider transfer limits in the grid to avoid violate the same and increase the security after a converter outage........ The redistribution of power has a sudden effect on the power-flow in the interconnected ac system. This may cause overloading of lines and transformers resulting in disconnection of equipment, and as a consequence cascading failure. The PTDF is used as a method to analyze and avoid violating limits by in the dc...

  19. Methodology for assessing the impacts of distributed generation interconnection

    Luis E. Luna


    Full Text Available This paper proposes a methodology for identifying and assessing the impact of distributed generation interconnection on distribution systems using Monte Carlo techniques. This methodology consists of two analysis schemes: a technical analysis, which evaluates the reliability conditions of the distribution system; on the other hand, an economic analysis that evaluates the financial impacts on the electric utility and its customers, according to the system reliability level. The proposed methodology was applied to an IEEE test distribution system, considering different operation schemes for the distributed generation interconnection. The application of each one of these schemes provided significant improvements regarding the reliability and important economic benefits for the electric utility. However, such schemes resulted in negative profitability levels for certain customers, therefore, regulatory measures and bilateral contracts were proposed which would provide a solution for this kind of problem.

  20. TEM sample preparation by FIB for carbon nanotube interconnects

    Ke, Xiaoxing; Bals, Sara; Romo Negreira, Ainhoa; Hantschel, Thomas; Bender, Hugo; Van Tendeloo, Gustaaf


    A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5 kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects.

  1. TEM sample preparation by FIB for carbon nanotube interconnects

    Ke, Xiaoxing, E-mail: [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); Bals, Sara [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); Romo Negreira, Ainhoa [IMEC, Kapeldreef 75, B-3001 Leuven (Belgium); Metallurgy and Materials Engineering Department, KU Leuven, Kasteelpark Arenberg 44, Leuven B-3001 (Belgium); Hantschel, Thomas; Bender, Hugo [IMEC, Kapeldreef 75, B-3001 Leuven (Belgium); Van Tendeloo, Gustaaf [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium)


    A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5 kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects.

  2. Modular cryogenic interconnects for multi-qubit devices

    Colless, J. I.; Reilly, D. J., E-mail: [ARC Centre of Excellence for Engineered Quantum Systems, School of Physics, The University of Sydney, Sydney, NSW 2006 (Australia)


    We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with −3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.

  3. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    Wang, Feng; Li, Lijuan; Li, Canbing


    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distri......The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG....... The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by using the KS test and the maximum likelihood estimation (MLE). The blackouts data in China were used...

  4. Optimal interconnection trees in the plane theory, algorithms and applications

    Brazil, Marcus


    This book explores fundamental aspects of geometric network optimisation with applications to a variety of real world problems. It presents, for the first time in the literature, a cohesive mathematical framework within which the properties of such optimal interconnection networks can be understood across a wide range of metrics and cost functions. The book makes use of this mathematical theory to develop efficient algorithms for constructing such networks, with an emphasis on exact solutions.  Marcus Brazil and Martin Zachariasen focus principally on the geometric structure of optimal interconnection networks, also known as Steiner trees, in the plane. They show readers how an understanding of this structure can lead to practical exact algorithms for constructing such trees.  The book also details numerous breakthroughs in this area over the past 20 years, features clearly written proofs, and is supported by 135 colour and 15 black and white figures. It will help graduate students, working mathematicians, ...

  5. Interconnection test framework for the CMS level-1 trigger system

    Hammer, J.; Magrans de Abril, M.; Wulz, C.E.


    The Level-1 Trigger Control and Monitoring System is a software package designed to configure, monitor and test the Level-1 Trigger System of the Compact Muon Solenoid (CMS) experiment at CERN's Large Hadron Collider. It is a large and distributed system that runs over 50 PCs and controls about 200 hardware units. The objective of this paper is to describe and evaluate the architecture of a distributed testing framework - the Interconnection Test Framework (ITF). This generic and highly flexible framework for creating and executing hardware tests within the Level-1 Trigger environment is meant to automate testing of the 13 major subsystems interconnected with more than 1000 links. Features include a web interface to create and execute tests, modeling using finite state machines, dependency management, automatic configuration, and loops. Furthermore, the ITF will replace the existing heterogeneous testing procedures and help reducing both maintenance and complexity of operation tasks. (authors)

  6. A reference model for space data system interconnection services

    Pietras, John; Theis, Gerhard


    The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

  7. Feeling global, acting ethically: global identification and fairtrade consumption.

    Reese, Gerhard; Kohlmann, Fabienne


    Global identification has become a popular construct in recent psychological debate as it relates to harmonious intergroup relations and a caring for all humanity. Based on social identity theorizing, the current research tests whether global identification can also predict consumer choices, at the expense of lower personal benefit. Importantly, we assumed that concerns about global injustice represent a crucial component of that relation. We predicted that participants who identified strongly with all humanity would rather choose a Fairtrade product alternative over a conventional one, compared with low identifiers. In addition, we assumed that this effect be mediated by perceived global injustice. Both predictions were confirmed in a consumer choice study (N = 68). Overall, global identification and globally relevant consumer behavior seem meaningfully interconnected, and we discuss these findings with regard to recent theoretical developments in Fairtrade consumption research.

  8. Planetary Sciences, Geodynamics, Impacts, Mass Extinctions, and Evolution: Developments and Interconnections

    Jaime Urrutia-Fucugauchi


    Full Text Available Research frontiers in geophysics are being expanded, with development of new fields resulting from technological advances such as the Earth observation satellite network, global positioning system, high pressure-temperature physics, tomographic methods, and big data computing. Planetary missions and enhanced exoplanets detection capabilities, with discovery of a wide range of exoplanets and multiple systems, have renewed attention to models of planetary system formation and planet’s characteristics, Earth’s interior, and geodynamics, highlighting the need to better understand the Earth system, processes, and spatio-temporal scales. Here we review the emerging interconnections resulting from advances in planetary sciences, geodynamics, high pressure-temperature physics, meteorite impacts, and mass extinctions.

  9. Wide area stability analysis and control of interconnected power systems with HVDC and FACTS devices

    Li, Yong


    In order to damp low-frequency oscillations and improve the overall stability of large-scale interconnected power systems, this book investigates the wide-area stability analysis and control methods from different perspectives. The flexible and fast control capability of high-voltage (FACTS) is investigated in detail to implement a wide-area measurement based damping control. A sequential and global mixed optimization method is proposed to simultaneously optimize local and wide area damping controllers. A wide-area robust coordination method is presented to coordinate multiple wide-area damping controllers (WADC). A delay-dependent robust design method is also proposed to handle time-varying delays commonly existing in wide-area signal communication. A closed-loop hardware experiment is used to validate the damping performance. The research activities of this book include power system stability analysis and control, wide-area damping control as well as HVDC and FACTS technologies.

  10. Building an organic computing device with multiple interconnected brains

    Pais-Vieira, Miguel; Chiuffa, Gabriela; Lebedev, Mikhail; Yadav, Amol; Nicolelis, Miguel A. L.


    Recently, we proposed that Brainets, i.e. networks formed by multiple animal brains, cooperating and exchanging information in real time through direct brain-to-brain interfaces, could provide the core of a new type of computing device: an organic computer. Here, we describe the first experimental demonstration of such a Brainet, built by interconnecting four adult rat brains. Brainets worked by concurrently recording the extracellular electrical activity generated by populations of cortical ...

  11. Authentication in Virtual Organizations: A Reputation Based PKI Interconnection Model

    Wazan, Ahmad Samer; Laborde, Romain; Barrere, Francois; Benzekri, Abdelmalek

    Authentication mechanism constitutes a central part of the virtual organization work. The PKI technology is used to provide the authentication in each organization involved in the virtual organization. Different trust models are proposed to interconnect the different PKIs in order to propagate the trust between them. While the existing trust models contain many drawbacks, we propose a new trust model based on the reputation of PKIs.

  12. Interconnection France-England; Interconnexion France-Angleterre



    These documents defines the interconnection France-England rules for the 2000 MW DC submarine cable directly linking the transmission networks of England and Wales and France. Rights to use Interconnector capacity from 1 April 2001 are to be offered through competitive tenders and auctions, full details of which are set out in the Rules. The contract and a guide to the application form are provided. (A.L.B.)

  13. Interconnected microbiomes and resistomes in low-income human habitats

    Pehrsson, Erica C.; Tsukayama, Pablo; Patel, Sanket; Mej?a-Bautista, Melissa; Sosa-Soto, Giordano; Navarrete, Karla M.; Calderon, Maritza; Cabrera, Lilia; Hoyos-Arango, William; Bertoli, M. Teresita; Berg, Douglas E.; Gilman, Robert H.; Dantas, Gautam


    Summary Antibiotic-resistant infections annually claim hundreds of thousands of lives worldwide. This problem is exacerbated by resistance gene exchange between pathogens and benign microbes from diverse habitats. Mapping resistance gene dissemination between humans and their environment is a public health priority. We characterized the bacterial community structure and resistance exchange networks of hundreds of interconnected human fecal and environmental samples from two low-income Latin A...

  14. Synthesis of micro-sized interconnected Si-C composites

    Wang, Donghai; Yi, Ran; Dai, Fang


    Embodiments provide a method of producing micro-sized Si--C composites or doped Si--C and Si alloy-C with interconnected nanoscle Si and C building blocks through converting commercially available SiO.sub.x (0

  15. Smart hospitality—Interconnectivity and interoperability towards an ecosystem

    Buhalis, Dimitrios; Leung, Rosanna


    The Internet and cloud computing changed the way business operate. Standardised web-based applications simplify data interchange which allow internal applications and business partners systems to become interconnected and interoperable. This study conceptualises the smart and agile hospitality enterprises of the future, and proposes a smart hospitality ecosystem that adds value to all stakeholders. Internal data from applications among all stakeholders, consolidated with external environment ...

  16. Design and Training of Limited-Interconnect Architectures


    and signal processing. Neuromorphic (brain like) models, allow an alternative for achieving real-time operation tor such tasks, while having a...compact and robust architecture. Neuromorphic models consist of interconnections of simple computational nodes. In this approach, each node computes a...operational performance. I1. Research Objectives The research objectives were: 1. Development of on- chip local training rules specifically designed for

  17. Overvoltages related to distributed generation-power system interconnection transformer

    Zamanillo, G.R.; Gomez, J.C.; Florena, E.F. [Rio Cuarto National University (IPSEP/UNRC), Cordoba (Argentina). Electric Power Systems Protection Institute], Email:


    The energy crisis that experiences the world drives to carry to an extreme, the use of all energy sources which are available. The sources need to be connected to the electric network in their next point, requiring of electric-electronic interfaces. The traditional electric power systems are changing their characteristics, in what concerns to structure, operation and on overvoltage generation. This change is not taking place in coordinated form among the involved sectors. The interconnection of a Distributed Generator (DG) directly with the power system is objectionable and risky. It is required of an interconnection transformer which performs several functions. Rigid specifications do not exist in this respect, for the variety of systems in use in the world, nevertheless there are utilities recommendations. Overvoltages caused by the DG, which arise due to the change of structure of the electric system, are explained. The transformer connection selection, presents positive and negative aspects that impact the utility and the user in a different or many times in an antagonistic way. The phenomenon of balanced and unbalanced ferroresonance overvoltage is studied. This phenomenon can takes place when using DG, either with synchronous or asynchronous generator, and for any type of connection of the transformer. The necessary conditions so that the phenomenon appears are presented. Eight interconnection transformer connection ways were studied. It is concluded that the solutions to reach by means of the employment of the DG, offer technical-economic advantages so much to the utility as to the user. It is also concluded in this work that the more advisable interconnection type is function of the system connection type. (author)

  18. Stackable Form-Factor Peripheral Component Interconnect Device and Assembly

    Somervill, Kevin M. (Inventor); Ng, Tak-kwong (Inventor); Torres-Pomales, Wilfredo (Inventor); Malekpour, Mahyar R. (Inventor)


    A stackable form-factor Peripheral Component Interconnect (PCI) device can be configured as a host controller or a master/target for use on a PCI assembly. PCI device may comprise a multiple-input switch coupled to a PCI bus, a multiplexor coupled to the switch, and a reconfigurable device coupled to one of the switch and multiplexor. The PCI device is configured to support functionality from power-up, and either control function or add-in card function.


    Ionescu Mihaela


    Full Text Available In this paper the author wants to exemplify the extent to which economic growth in Romania is influenced by the current power system infrastructure investments in Europe. Electricity transmission infrastructure in Romania is at a turning point. The high level of security of supply, delivery efficiency in a competitive internal market are dependent on significant investment, both within the country and across borders. Since the economic crisis makes investment financing is increasingly difficult, it is necessary that they be targeted as well. The European Union has initiated the “Connecting Europe” through which investments are allocated to European energy network interconnection of energy. The action plan for this strategy will put a greater emphasis on investments that require hundreds of billions of euro in new technologies, infrastructure, improve energy intensity, low carbon energy technologies. Romania's energy challenge will depend on the new interconnection modern and smart, both within the country and other European countries, energy saving practices and technologies. This challenge is particularly important as Romania has recovered severe gaps in the level of economic performance compared to developed countries. Such investment will have a significant impact on transmission costs, especially electricity, while network tariffs will rise slightly. Some costs will be higher due to support programs in renewable energy nationwide.Measures are more economically sustainable to maintain or even reinforce the electricity market, which system can be flexible in order to address any issues of adequacy. These measures include investments in border infrastructure (the higher the network, so it is easier to evenly distribute energy from renewable sources, to measure demand response and energy storage solutions.An integrated European infrastructure will ensure economic growth in countries interconnected and thus Romania. Huge energy potential of

  20. The critical thickness of liners of Cu interconnects

    Jiang, Q; Zhang, S H; Li, J C


    A model for the size-dependence of activation energy is developed. With the model and Fick's second law, relationships among the liner thickness, the working life and the working temperature of a TaN liner for Cu interconnects are predicted. The predicted results of the TaN liner are in good agreement with the experimental results. Moreover, the critical thicknesses of liners of some elements are calculated

  1. Greenhouse gas emission factors of purchased electricity from interconnected grids

    Ji, Ling; Liang, Sai; Qu, Shen; Zhang, Yanxia; Xu, Ming; Jia, Xiaoping; Jia, Yingtao; Niu, Dongxiao; Yuan, Jiahai; Hou, Yong; Wang, Haikun; Chiu, Anthony S.F.; Hu, Xiaojun


    Highlights: • A new accounting framework is proposed for GHG emission factors of power grids. • Three cases are used to demonstrate the proposed framework. • Comparisons with previous system boundaries approve the necessity. - Abstract: Electricity trade among power grids leads to difficulties in measuring greenhouse gas (GHG) emission factors of purchased electricity. Traditional methods assume either electricity purchased from a grid is entirely produced locally (Boundary I) or imported electricity is entirely produced by the exporting grid (Boundary II) (in fact a blend of electricity produced by many grids). Both methods ignore the fact that electricity can be indirectly traded between grids. Failing to capture such indirect electricity trade can underestimate or overestimate GHG emissions of purchased electricity in interconnected grid networks, potentially leading to incorrectly accounting for the effects of emission reduction policies involving purchased electricity. We propose a “Boundary III” framework to account for emissions both directly and indirectly caused by purchased electricity in interconnected gird networks. We use three case studies on a national grid network, an Eurasian Continent grid network, and North Europe grid network to demonstrate the proposed Boundary III emission factors. We found that the difference on GHG emissions of purchased electricity estimated using different emission factors can be considerably large. We suggest to standardize the choice of different emission factors based on how interconnected the local grid is with other grids.

  2. Fabrication of interconnected microporous biomaterials with high hydroxyapatite nanoparticle loading

    Zhang Wei; Yao Donggang; Zhang Qingwei; Lelkes, Peter I; Zhou, Jack G


    Hydroxyapatite (HA) is known to promote osteogenicity and enhance the mechanical properties of biopolymers. However, incorporating a large amount of HA into a porous biopolymer still remains a challenge. In the present work, a new method was developed to produce interconnected microporous poly(glycolic-co-lactic acid) (PLGA) with high HA nanoparticle loading. First, a ternary blend comprising PLGA/PS (polystyrene)/HA (40/40/20 wt%) was prepared by melt blending under conditions for formation of a co-continuous phase structure. Next, a dynamic annealing stage under small-strain oscillation was applied to the blend to facilitate nanoparticle redistribution. Finally, the PS phase was sacrificially extracted, leaving a porous matrix. The results from different characterizations suggested that the applied small-strain oscillation substantially accelerated the migration of HA nanoparticles during annealing from the PS phase to the PLGA phase; nearly all HA particles were uniformly presented in the PLGA phase after a short period of annealing. After dissolution of the PS phase, a PLGA material with interconnected microporous structure was successfully produced, with a high HA loading above 30 wt%. The mechanisms beneath the experimental observations, particularly on the enhanced particle migration process, were discussed, and strategies for producing highly particle loaded biopolymers with interconnected microporous structures were proposed.

  3. Power System Study for Renewable Energy Interconnection in Malaysia

    Askar, O F; Ramachandaramurthy, V K


    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  4. Planning and design of the Gulf States interconnection

    Al Alawi, J.; Sud, S.; McGillis, D.


    On May 25, 1981, the six Arab state of Bahrain, Kuwait, Oman, Qatar, Saudi Arabia and the United Arab Emirates (UAE) formally ratified the charter of the organization named Co-operation Council for the Arab States of the Gulf. This has become more popularly known as the Gulf Cooperation Council (GCC). In the mid 1980s, the integration of the electric systems study in the GCC was initiated, and several possible interconnection schemes to provide for reserve sharing and generally more economic and flexible operation of the networks were proposed. The GCC subsequently asked for an update of this study and a recommended interconnection scheme. this update study was completed in 1990, and a definite scheme was proposed, which met with the approval of all GCC members. This presentation describes the proposed interconnection, the studies that led to its selection, and the associated management structure required for its implementation. the population of the GCC states, and their load, generating capacity, and the transmission systems are shown

  5. Carbon Nanotubes and Graphene Nanoribbons: Potentials for Nanoscale Electrical Interconnects

    Swastik Kar


    Full Text Available Carbon allotropes have generated much interest among different scientific communities due to their peculiar properties and potential applications in a variety of fields. Carbon nanotubes and more recently graphene have shown very interesting electrical properties along with the possibility of being grown and/or deposited at a desired location. In this Review, we will focus our attention on carbon-based nanostructures (in particular, carbon nanotubes and graphene nanoribbons which could play an important role in the technological quest to replace copper/low-k for interconnect applications. We will provide the reader with a number of possible architectures, including single-wall as well as multi-wall carbon nanotubes, arranged in horizontal and vertical arrays, regarded as individual objects as well as bundles. Modification of their functional properties in order to fulfill interconnect applications requirements are also presented. Then, in the second part of the Review, recently discovered graphene and in particular graphene and few-graphene layers nanoribbons are introduced. Different architectures involving nanostructured carbon are presented and discussed in light of interconnect application in terms of length, chirality, edge configuration and more.

  6. Construction of programmable interconnected 3D microfluidic networks

    Hunziker, Patrick R; Wolf, Marc P; Wang, Xueya; Zhang, Bei; Marsch, Stephan; Salieb-Beugelaar, Georgette B


    Microfluidic systems represent a key-enabling platform for novel diagnostic tools for use at the point-of-care in clinical contexts as well as for evolving single cell diagnostics. The design of 3D microfluidic systems is an active field of development, but construction of true interconnected 3D microfluidic networks is still a challenge, in particular when the goal is rapid prototyping, accurate design and flexibility. We report a novel approach for the construction of programmable 3D microfluidic systems consisting of modular 3D template casting of interconnected threads to allow user-programmable flow paths and examine its structural characteristics and its modular function. To overcome problems with thread template casting reported in the literature, low-surface-energy polymer threads were used, that allow solvent-free production. Connected circular channels with excellent roundness and low diameter variability were created. Variable channel termination allowed programming a flow path on-the-fly, thus rendering the resulting 3D microfluidic systems highly customizable even after production. Thus, construction of programmable/reprogrammable fully 3D microfluidic systems by template casting of a network of interconnecting threads is feasible, leads to high-quality and highly reproducible, complex 3D geometries. (paper)

  7. Interconnected porous hydroxyapatite ceramics for bone tissue engineering

    Yoshikawa, Hideki; Tamai, Noriyuki; Murase, Tsuyoshi; Myoui, Akira


    Several porous calcium hydroxyapatite (HA) ceramics have been used clinically as bone substitutes, but most of them possessed few interpore connections, resulting in pathological fracture probably due to poor bone formation within the substitute. We recently developed a fully interconnected porous HA ceramic (IP-CHA) by adopting the ‘foam-gel’ technique. The IP-CHA had a three-dimensional structure with spherical pores of uniform size (average 150 μm, porosity 75%), which were interconnected by window-like holes (average diameter 40 μm), and also demonstrated adequate compression strength (10–12 MPa). In animal experiments, the IP-CHA showed superior osteoconduction, with the majority of pores filled with newly formed bone. The interconnected porous structure facilitates bone tissue engineering by allowing the introduction of mesenchymal cells, osteotropic agents such as bone morphogenetic protein or vasculature into the pores. Clinically, we have applied the IP-CHA to treat various bony defects in orthopaedic surgery, and radiographic examinations demonstrated that grafted IP-CHA gained radiopacity more quickly than the synthetic HA in clinical use previously. We review the accumulated data on bone tissue engineering using the novel scaffold and on clinical application in the orthopaedic field. PMID:19106069

  8. Interconnections and market integration in the Irish Single Electricity Market

    Nepal, Rabindra; Jamasb, Tooraj


    Interconnections can be an effective way to increase competition and improve market integration in concentrated wholesale electricity markets with limited number of participants. This paper examines the potential for interconnections and increasing market integration in the Irish Single Electricity Market (SEM). We use a time-varying Kalman filter technique to assess the degree of market integration between SEM and other large, mature and interconnected wholesale electricity markets in Europe including Great Britain (GB). The results indicate no market integration between SEM and other European markets except for Elspot and GB. We show that the current state of market integration between SEM and GB is just 17% indicating potential to improve market integration via increased interconnector capacity. The results indicate that liquidity of wholesale markets might be a crucial factor in the market integration process while our results remain inconclusive in determining whether increased trade of renewables can improve market integration. - Highlights: ► We assess the degree of market integration between SEM and other EU electricity markets. ► Our results indicate no market integration between SEM and other European markets except for Elspot and GB. ► We show that the current state of market integration between SEM and GB is just 17%.

  9. Enhancing Ecoefficiency in Shrimp Farming through Interconnected Ponds

    Ramón Héctor Barraza-Guardado


    Full Text Available The future development of shrimp farming needs to improve its ecoefficiency. The purpose of this study was to evaluate water quality, flows, and nitrogen balance and production parameters on a farm with interconnected pond design to improve the efficiency of the semi-intensive culture of Litopenaeus vannamei ponds. The study was conducted in 21 commercial culture ponds during 180 days at densities of 30–35 ind m−2 and daily water exchange <2%. Our study provides evidence that by interconnecting ponds nutrient recycling is favored by promoting the growth of primary producers of the pond as chlorophyll a. Based on the mass balance and flow of nutrients this culture system reduces the flow of solid, particulate organic matter, and nitrogen compounds to the environment and significantly increases the efficiency of water (5 to 6.5 m3 kg−1 cycle−1, when compared with traditional culture systems. With this culture system it is possible to recover up to 34% of the total nitrogen entering the system, with production in excess of 4,000 kg ha−1 shrimp. We believe that the production system with interconnected ponds is a technically feasible model to improve ecoefficiency production of shrimp farming.

  10. Chip-Level Electromigration Reliability for Cu Interconnects

    Gall, M.; Oh, C.; Grinshpon, A.; Zolotov, V.; Panda, R.; Demircan, E.; Mueller, J.; Justison, P.; Ramakrishna, K.; Thrasher, S.; Hernandez, R.; Herrick, M.; Fox, R.; Boeck, B.; Kawasaki, H.; Haznedar, H.; Ku, P.


    Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability concerns for most advanced process technologies. Ever increasing operating current densities and the introduction of low-k materials in the backend process scheme are some of the issues that threaten reliable, long-term operation at elevated temperatures. The traditional method of verifying EM reliability only through current density limit checks is proving to be inadequate in general, or quite expensive at the best. A Statistical EM Budgeting (SEB) methodology has been proposed to assess more realistic chip-level EM reliability from the complex statistical distribution of currents in a chip. To be valuable, this approach requires accurate estimation of currents for all interconnect segments in a chip. However, no efficient technique to manage the complexity of such a task for very large chip designs is known. We present an efficient method to estimate currents exhaustively for all interconnects in a chip. The proposed method uses pre-characterization of cells and macros, and steps to identify and filter out symmetrically bi-directional interconnects. We illustrate the strength of the proposed approach using a high-performance microprocessor design for embedded applications as a case study

  11. Power System Study for Renewable Energy Interconnection in Malaysia

    Askar, O. F.; Ramachandaramurthy, V. K.


    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  12. Ontario's intertie capacity and electricity trade in the interconnected system

    Dorey, S.


    Hydro One's capacity of existing interconnections were described. The Ontario utility is within reach of about 320 GW electricity markets in neighbouring Quebec, New York, Michigan, Minnesota, and Manitoba. It is also within reach of 50 million customers, and 30 per cent of total U.S. energy consumption. The author emphasized the need for expanded interties and new interconnections. The status of new interconnections was described along with the rules regarding electric power import, export and wheeling. It was noted that compared to the United States, Canada has a higher proportion of clean hydro and nuclear power plants in its mix of power generation. Markets across North America are adopting electricity restructuring and open competition. However, the transmission grids were not designed to support market-driven electricity trading. Most transmission grids were built when utilities were tightly regulated and provided service only within their assigned regions. The current energy infrastructure is not equipped for large-scale swapping of power in competitive markets. It was also noted that growth in US power flows is outpacing transmission investment. This paper addressed the issue of license requirements, transmitter proposals for regulated investments, and non-rate base transmitter investments. It was concluded that while market rules are flexible enough to encourage inter-jurisdictional trade, the rules have to facilitate and encourage transmission investment. 8 figs

  13. 77 FR 3766 - PJM Interconnection, L.L.C.; Notice of Staff Technical Conference


    ... Interconnection, L.L.C.; Notice of Staff Technical Conference On December 14, 2011, the Commission issued an order... Interconnection, L.L.C.'s (PJM) filing.\\1\\ Take notice that the technical conference will be held on February 14...\\ PJM Interconnection, L.L.C., 137 FERC ] 61,204 (2011) (December 14 Order). All interested parties are...

  14. 75 FR 40815 - PJM Interconnection, L.L.C.; Notice of Filing


    ... Interconnection, L.L.C.; Notice of Filing July 7, 2010. Take notice that on July 1, 2010, PJM Interconnection, L.L.C. (PJM) filed revised sheets to Schedule 1 of the Amended and Restated Operating Agreement of PJM Interconnection, L.L.C. (Operating Agreement) and the parallel provisions of Attachment K--Appendix of the PJM...

  15. 78 FR 19259 - Notice of Attendance at PJM Interconnection, L.L.C. Meetings


    ... Interconnection, L.L.C. Meetings The Federal Energy Regulatory Commission (Commission) hereby gives notice that members of the Commission and Commission staff may attend upcoming PJM Interconnection, L.L.C. (PJM... proceedings: Docket No. EL05-121, PJM Interconnection, L.L.C. Docket No. EL08-14, Black Oak Energy LLC, et al...

  16. 75 FR 22773 - PJM Interconnection, L.L.C.; Notice of Filing


    ... Interconnection, L.L.C.; Notice of Filing April 23, 2010. Take notice that on April 22, 2010, PJM Interconnection, L.L.C. (PJM) filed revised tariff sheets to its Schedule 1 of the Amended and Restated Operating... (Commission) March 23, 2010 Order on Compliance Filing, PJM Interconnection, L.L.C., 130 FERC ] 61,230 (2010...

  17. 77 FR 34378 - PJM Interconnection, L.L.C.; Notice of Complaint


    ... Interconnection, L.L.C.; Notice of Complaint Take notice that on June 1, 2012, pursuant to section 206 of the Federal Power Act (FPA), 16 U.S.C. 824(e), PJM Interconnection, L.L.C. (PJM) filed proposed revisions to the Amended and Restated Operating Agreement of PJM Interconnection L.L.C. (Operating Agreement) to...

  18. Next Generation Space Interconnect Standard (NGSIS): a modular open standards approach for high performance interconnects for space

    Collier, Charles Patrick


    The Next Generation Space Interconnect Standard (NGSIS) effort is a Government-Industry collaboration effort to define a set of standards for interconnects between space system components with the goal of cost effectively removing bandwidth as a constraint for future space systems. The NGSIS team has selected the ANSI/VITA 65 OpenVPXTM standard family for the physical baseline. The RapidIO protocol has been selected as the basis for the digital data transport. The NGSIS standards are developed to provide sufficient flexibility to enable users to implement a variety of system configurations, while meeting goals for interoperability and robustness for space. The NGSIS approach and effort represents a radical departure from past approaches to achieve a Modular Open System Architecture (MOSA) for space systems and serves as an exemplar for the civil, commercial, and military Space communities as well as a broader high reliability terrestrial market.

  19. Essays on optimal capacity and optimal regulation of interconnection infrastructures

    Boffa, Federico

    The integration between geographically differentiated markets or between vertically related industries generate effects on welfare that depend on the structure of the underlying markets. My thesis investigates the impact of geographical interconnection on welfare, and illustrates welfare-enhancing modes of regulation of vertically integrated industries and of geographically integrated markets. The first chapter analyzes the effects of interconnection between two formerly fully-separated markets under the assumptions that producers in the two markets are capacity-constrained, and tacitly collude whenever it is rational for them to do so. I find that there exists a set of assumptions under which interconnection brings about greater collusion, hence it reduces overall welfare. The second chapter analyzes the optimal interconnection capacity allocation mechanism for a benevolent electricity regulator when generation is not competitive. The regulator's intervention should not only ensure that interconnection capacity is efficiently allocated to the most efficient firms, but it should also induce a higher welfare in the upstream generation market. In a two-node setting, with one firm per node, I show that the regulatory intervention becomes more effective as the cost asymmetries between the two firms become more pronounced. The third chapter illustrates a regulation mechanism for vertically related industries. Ownership shares of the upstream industry (that displays economies of scale) are allocated to the downstream (competitive) firms in proportion to their shares in the final goods market. I show that the mechanism combines the benefits of vertical integration with those of vertical separation. The advantages of vertical integration consist in avoiding double marginalization, and in internalizing the reduction in average cost resulting from the upstream increase in output; on the other hand, vertical separation allows to preserve the competitiveness of the downstream

  20. Report on electricity interconnection management and use. June 2008


    Apart from some concrete advances in interconnection management, the most striking event of 2007 has to be the emergence of a consensus at European level on the general principles of the target mechanisms for interconnection management. Three major projects currently undergoing development by the TSOs and the exchanges - the setting up of a single auction platform for allocating long- and medium-term products and of 'flow-based' market coupling in the Central-West region (Belgium, Luxemburg, the Netherlands, Germany, France), and in the France-UK-Ireland region, the introduction of reciprocal balancing exchanges on the France-England interconnection - should lay the foundations for the future management of congestion on interconnections in Europe. The completion of these projects, planned for the end of 2008 for the single auction platform project in the Central-West region and for mid-2009 for the other two, will be an important turning point in the construction of the European electricity market. This will be one of the successes of the Regional Initiatives process launched by ERGEG just over two years ago. However, this should not hide the fact that the regulators have experienced many difficulties during the regional integration of the markets and that the market operators have the general impression that this process could progress much more quickly. These difficulties and this relative slowness are mainly explained by: - a lack of consensus on the target market design the national markets would gradually tend towards, - a lack of harmonisation of the powers and competencies of the regulators when it comes to cross-border trades, the immediate consequence of which is a lack of incentives for TSOs to accelerate market integration. Several sizeable challenges await all the stakeholders over the coming months and years if market integration is to be a success: - How can the 'third legislative package' give all the necessary competencies

  1. Integrated Collaborative E-Learning for the Global Management Education in the 21st Century

    Son, Barbara W. K.


    Rapidly growing information and communications technology and a more interconnected global world offer benefits and challenges to global business organizations. While exploring benefits from global workforce and global production, they must successfully adapt to their local market conditions and manage their multicultural resources. How can we…

  2. World History, Liberal Arts, and Global Citizenship

    Watt, Carey A.


    In this article, the author investigates the role that world history might play in reshaping the liberal arts to better serve a twenty-first-century world that is increasingly interconnected, plural, and "globalized." While "Western civ" courses and perspectives are much less influential today than they were in the first seven decades of the…

  3. Global Citizenship Education for Mental Health Development

    Sheykhjan, Tohid Moradi


    It is obvious that today's students are graduating into a world that is interconnected as never before and education for international understanding for global citizenship education (GCE) inspires action, partnerships, dialogue and cooperation through formal and non-formal education. It promotes an ethos of curiosity, solidarity and shared…

  4. Creating Global Citizens through Study Abroad

    Bellamy, Carol; Weinberg, Adam


    One of the greatest challenges for a student today is how to live as a responsible citizen in a globalizing world. Today's interconnected world cannot afford bystanders or passive participants. It demands confident, skilled citizens who will make responsible choices that take into consideration how educators allocate resources and what impact…

  5. Parallel interconnect for a novel system approach to short distance high information transfer data links

    Raskin, Glenn; Lebby, Michael S.; Carney, F.; Kazakia, M.; Schwartz, Daniel B.; Gaw, Craig A.


    The OPTOBUSTM family of products provides for high performance parallel interconnection utilizing optical links in a 10-bit wide bi-directional configuration. The link is architected to be 'transparent' in that it is totally asynchronous and dc coupled so that it can be treated as a perfect cable with extremely low skew and no losses. An optical link consists of two identical transceiver modules and a pair of connectorized 62.5 micrometer multi mode fiber ribbon cables. The OPTOBUSTM I link provides bi- directional functionality at 4 Gbps (400 Mbps per channel), while the OPTOBUSTM II link will offer the same capability at 8 Gbps (800 Mbps per channel). The transparent structure of the OPTOBUSTM links allow for an arbitrary data stream regardless of its structure. Both the OPTOBUSTM I and OPTOBUSTM II transceiver modules are packaged as partially populated 14 by 14 pin grid arrays (PGA) with optical receptacles on one side of the module. The modules themselves are composed of several elements; including passives, integrated circuits optoelectronic devices and optical interface units (OIUs) (which consist of polymer waveguides and a specially designed lead frame). The initial offering of the modules electrical interface utilizes differential CML. The CML line driver sinks 5 mA of current into one of two pins. When terminated with 50 ohm pull-up resistors tied to a voltage between VCC and VCC-2, the result is a differential swing of plus or minus 250 mV, capable of driving standard PECL I/Os. Future offerings of the OPTOBUSTM links will incorporate LVDS and PECL interfaces as well as CML. The integrated circuits are silicon based. For OPTOBUSTM I links, a 1.5 micrometer drawn emitter NPN bipolar process is used for the receiver and an enhanced 0.8 micrometer CMOS process for the laser driver. For OPTOBUSTM II links, a 0.8 micrometer drawn emitter NPN bipolar process is used for the receiver and the driver IC utilizes 0.8 micrometer BiCMOS technology. The OPTOBUSTM

  6. Fast optical signal processing in high bit rate OTDM systems

    Poulsen, Henrik Nørskov; Jepsen, Kim Stokholm; Clausen, Anders


    As all-optical signal processing is maturing, optical time division multiplexing (OTDM) has also gained interest for simple networking in high capacity backbone networks. As an example of a network scenario we show an OTDM bus interconnecting another OTDM bus, a single high capacity user...

  7. High temperature corrosion of metallic interconnects in solid oxide fuel cells

    Bastidas, D. M.


    Research and development has made it possible to use metallic interconnects in solid oxide fuel cells (SOFC) instead of ceramic materials. The use of metallic interconnects was formerly hindered by the high operating temperature, which made the interconnect degrade too much and too fast to be an efficient alternative. When the operating temperature was lowered, the use of metallic interconnects proved to be favourable since they are easier and cheaper to produce than ceramic interconnects. However, metallic interconnects continue to be degraded despite the lowered temperature, and their corrosion products contribute to electrical degradation in the fuel cell. coatings of nickel, chromium, aluminium, zinc, manganese, yttrium or lanthanum between the interconnect and the electrodes reduce this degradation during operation. (Author) 66 refs

  8. Time Domain Analysis of Graphene Nanoribbon Interconnects Based on Transmission Line ‎Model

    S. Haji Nasiri


    Full Text Available Time domain analysis of multilayer graphene nanoribbon (MLGNR interconnects, based on ‎transmission line modeling (TLM using a six-order linear parametric expression, has been ‎presented for the first time. We have studied the effects of interconnect geometry along with ‎its contact resistance on its step response and Nyquist stability. It is shown that by increasing ‎interconnects dimensions their propagation delays are increased and accordingly the system ‎becomes relatively more stable. In addition, we have compared time responses and Nyquist ‎stabilities of MLGNR and SWCNT bundle interconnects, with the same external dimensions. ‎The results show that under the same conditions, the propagation delays for MLGNR ‎interconnects are smaller than those of SWCNT bundle interconnects are. Hence, SWCNT ‎bundle interconnects are relatively more stable than their MLGNR rivals.‎

  9. Modulation Formats for Beyond-100Gbps Ethernet Optical Links – A Review of Research

    Jensen, Jesper Bevensee; Iglesias Olmedo, Miguel; Tafur Monroy, Idelfonso


    The current increase in data-centers traffic and cloud-based services presents a formidable challenge for optical interconnects. We examine these challenges, and review recent breakthroughs in advanced modulation formats formats for intensity modulation - direct detection....

  10. Advanced materials for integrated optical waveguides

    Tong Ph D, Xingcun Colin


    This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, ...

  11. Comparison of self-written waveguide techniques and bulk index matching for low-loss polymer waveguide interconnects

    Burrell, Derek; Middlebrook, Christopher


    Polymer waveguides (PWGs) are used within photonic interconnects as inexpensive and versatile substitutes for traditional optical fibers. The PWGs are typically aligned to silica-based optical fibers for coupling. An epoxide elastomer is then applied and cured at the interface for index matching and rigid attachment. Self-written waveguides (SWWs) are proposed as an alternative to further reduce connection insertion loss (IL) and alleviate marginal misalignment issues. Elastomer material is deposited after the initial alignment, and SWWs are formed by injecting ultraviolet (UV) light into the fiber or waveguide. The coupled UV light cures a channel between the two differing structures. A suitable cladding layer can be applied after development. Such factors as longitudinal gap distance, UV cure time, input power level, polymer material selection and choice of solvent affect the resulting SWWs. Experimental data are compared between purely index-matched samples and those with SWWs at the fiber-PWG interface. It is shown that writing process. Successfully fabricated SWWs reduce overall processing time and enable an effectively continuous low-loss rigid interconnect.

  12. NOAA Climate Data Record (CDR) of AVHRR Daily and Monthly Aerosol Optical Thickness (AOT) over Global Oceans, Version 3.0

    National Oceanic and Atmospheric Administration, Department of Commerce — The product is the aerosol optical thickness (AOT) at 0.63 micron, which is retrieved from NOAA PATMOS-x level-2B orbital radinace and cloud CDR products. The...

  13. Exploring the interconnections between gender, health and nature.

    MacBride-Stewart, S; Gong, Y; Antell, J


    Public health has recognized that nature is good for health but there are calls for a review of its gendered aspects. This review attempts to develop and explore a broad analytical theme - the differing interconnections between gender, health and nature. The paper summarizes the interconnections that have been subject to extensive academic enquiry between gender and health, health and space, and gender and space. A combination of key terms including place; gender; health; outdoor space; green space; natural environment; national parks; femininity; masculinity; recreation; physical activity; sustainability; ecofeminism; feminism; environmental degradation; and environmental justice were used to search the electronic databases Sociological Abstracts, Web of Science and Scopus to identify relevant articles. We took two approaches for this review to provide an overview and analysis of the range of research in the field, and to present a framework of research that is an analysis of the intersection of gender, health and nature. Four dimensions are distinguished: (1) evaluations of health benefits and 'toxicities' of nature; (2) dimensions and qualities of nature/space; (3) environmental justice including accessibility, availability and usability; and (4) identification of boundaries (symbolic/material) that construct differential relationships between nature, gender and health. This paper offers an understanding of how environmental and social conditions may differentially shape the health of women and men. The dimensions direct analytical attention to the diverse linkages that constitute overlapping and inseparable domains of knowledge and practice, to identify complex interconnections between gender, health and nature. This review therefore analyses assumptions about the health benefits of nature, and its risks, for gender from an in-depth, analytical perspective that can be used to inform policy. Copyright © 2016 The Royal Society for Public Health. Published by

  14. Actual issues concerning nuclear power plants and interconnected grid

    Medjimorec, D.; Brkic, S.


    Nuclear power plants and transmission grid have always been mutually of special relevance. In countries and/or regions where nuclear power plants are located they are almost as a rule counted among strongest nodes of the grid. Hence, they are treated as such from grid point of view in various aspects (operational, planning). In interconnected high-voltage transmission grid of European mainland, usually called UCTE interconnected system, this importance could be shown in a range of issues and several cases, particularly under present situation in which there are numerous demanding and challenging tasks put on transmission system operators, largely due to the opening of electricity markets in the most of European countries. Among these issues definitely worth of mentioning is relevant influence to both commercial paths and physical power flows, and also to exchange programmes between control areas and blocks. In this context there is also relation to cross-border transactions and mechanism applied to them. In respect to security of supply issues and future of nuclear power generation under present regulative framework of most European countries it is needed to comply with connecting conditions (and other stipulations) from national grid codes where different approaches could be observed. Furthermore, nuclear issues significantly influence approach to extension of UCTE system. In certain extent this also applies to pending re-connection of present two synchronous zones of UCTE, particularly to area of broader region directly affected with this complex process. Some of these also reflect to Croatian high-voltage transmission grid as a part of UCTE interconnected system with certain peculiarities.(author)

  15. Ferroelectric devices, interconnects, and methods of manufacture thereof

    Alshareef, Husam N.


    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  16. First experience with the InfiniBand interconnect

    Schwickerath, Ulrich; Heiss, Andreas


    A test cluster of dual Intel-Xeon processor server nodes has been equipped with 10 GBit/s InfiniBand interconnect. Capabilities of this new technique were tested and compared to Gigabit-Ethernet (GE) with respect to both High-Performance Computing (MPI-based parallel computing applications) and High-Throughput Computing (HTC). RFIO, a protocol for fast and efficient file transfers, has been ported to make immediate use of InfiniBand, utilizing the remote direct memory access (RDMA) capabilities of the InfiniBand hardware. The performance is compared to Gigabit-Ethernet

  17. Performance evaluation of two highly interconnected Data Center networks

    Andrus, Bogdan-Mihai; Mihai Poncea, Ovidiu; Vegas Olmos, Juan José


    In this paper we present the analysis of highly interconnected topologies like hypercube and torus and how they can be implemented in data centers in order to cope with the rapid increase and demands for performance of the internal traffic. By replicating the topologies and subjecting them...... to uniformly distributed traffic routed by shortest path algorithms, we are able to extract relevant statistics related to average throughput, latency and loss rate. A decrease in throughput per connection of only about 5% for the hypercube compared to 16% for the 3D torus was measured when the size...

  18. Ferroelectric devices, interconnects, and methods of manufacture thereof

    Alshareef, Husam N.; Unnat, Bhansali; Khan, Mohd Adnan; Saleh, Moussa M.; Odeh, Ihab N.


    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  19. Electromigration kinetics and critical current of Pb-free interconnects

    Lu, Minhua; Rosenberg, Robert [IBM T. J. Watson Research Center, Yorktown Heights, New York 10598 (United States)


    Electromigration kinetics of Pb-free solder bump interconnects have been studied using a single bump parameter sweep technique. By removing bump to bump variations in structure, texture, and composition, the single bump sweep technique has provided both activation energy and power exponents that reflect atomic migration and interface reactions with fewer samples, shorter stress time, and better statistics than standard failure testing procedures. Contact metallurgies based on Cu and Ni have been studied. Critical current, which corresponds to the Blech limit, was found to exist in the Ni metallurgy, but not in the Cu metallurgy. A temperature dependence of critical current was also observed.

  20. Effect of interconnectivity of structures against seismic load

    Bhuvaneshwari, P.; Elangovan, S.


    Since years world had experienced number of earthquakes and in India, zones have been modified according to the severity of earthquake and all this have made designers and engineers to concentrate rigorously to bring down the effect of damage to structures. Since the response of the structures to seismic force mainly depends on the distribution of mass, stiffness and damping characteristics an attempt is being made to compare and study the response by improving these characteristics in a simple building frame with and without infill. This in turn gives an idea of interconnecting the adjacent buildings of nuclear island to reduce the hazard to a minimum. (author)

  1. DER Certification Laboratory Pilot, Accreditation Plan, and Interconnection Agreement Handbook

    Key, T.; Sitzlar, H. E.; Ferraro, R.


    This report describes the first steps toward creating the organization, procedures, plans and tools for distributed energy resources (DER) equipment certification, test laboratory accreditation, and interconnection agreements. It covers the activities and accomplishments during the first period of a multiyear effort. It summarizes steps taken to outline a certification plan to assist in the future development of an interim plan for certification and accreditation activities. It also summarizes work toward a draft plan for certification, a beta Web site to support communications and materials, and preliminary draft certification criteria.

  2. A new method for energy accounting in interconnected operations

    Navid, Taghizadegan; Navid, Taghizadegan; Naser, Tabatabaei; Ahmad Reza, Zentabchi; Majid, Mollazadeh


    Full text : The measurement of electrical energy supplied to customers or purchased from and delivered to interconnected power systems is of paramount importance in power system operations. Accurate measurement of energy delivered to customers or received from and delivered to other systems is necessary to ensure that billing is correct. energy transferred between systems also must be properly measured and accounted for to ensure that agreed-upon schedules are being met and that each system meets its obligation to match generation with load on a moment-to-moment basis

  3. Production process for advanced space satellite system cables/interconnects.

    Mendoza, Luis A.


    This production process was generated for the satellite system program cables/interconnects group, which in essences had no well defined production process. The driver for the development of a formalized process was based on the set backs, problem areas, challenges, and need improvements faced from within the program at Sandia National Laboratories. In addition, the formal production process was developed from the Master's program of Engineering Management for New Mexico Institute of Mining and Technology in Socorro New Mexico and submitted as a thesis to meet the institute's graduating requirements.

  4. X-ray microdiffraction study of Cu interconnects

    Zhang, X.; Solak, H.; Cerrina, F.; Lai, B.; Cai, Z.; Ilinski, P.; Legnini, D.; Rodrigues, W.


    We have used x-ray microdiffraction to study the local structure and strain variation of copper interconnects. Different types of local microstructures have been found in different samples. Our data show that the Ti adhesion layer has a very dramatic effect on Cu microstructure. Strain measurement was conducted before and after electromigration test, Cu fluorescence was used to find the mass variations around voids and hillocks, and x-ray microdiffraction was used to measure the strain change around that interested region. (c) 2000 American Institute of Physics

  5. Financial Economy and Financial System: Basis of Structural Interconnection

    Khorosheva Olena I.


    The goal of the article lies in identification of grounds of interconnection of the financial economy and financial system. The study was conducted with consideration of main provisions of the theory of finance and concept of financial economy, which is a set of means used in the process of reproduction of finance by their owner for formation and / or maintenance of the own system of values in the viable state. For the first time ever the structure of the financial system is identified as an ...

  6. Addendum to the 2015 Eastern Interconnect Baselining and Analysis Report

    Amidan, Brett G. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Follum, James D. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)


    This report serves as an addendum to the report 2015 Eastern Interconnect Baselining and Analysis Report (Amidan, Follum, and Freeman, 2015). This addendum report investigates the following: the impact of shorter record lengths and of adding a daily regularization term to the date/time models for angle pair measurements, additional development of a method to monitor the trend in phase angle pairs, the effect of changing the length of time to determine a baseline, when calculating atypical events, and a comparison between quantitatively discovered atypical events and actual events.

  7. Bottom-up approach for carbon nanotube interconnects

    Li Jun; Ye Qi; Cassell, Alan; Ng, Hou Tee; Stevens, Ramsey; Han Jie; Meyyappan, M.


    We report a bottom-up approach to integrate multiwalled carbon nanotubes (MWNTs) into multilevel interconnects in silicon integrated-circuit manufacturing. MWNTs are grown vertically from patterned catalyst spots using plasma-enhanced chemical vapor deposition. We demonstrate the capability to grow aligned structures ranging from a single tube to forest-like arrays at desired locations. SiO 2 is deposited to encapsulate each nanotube and the substrate, followed by a mechanical polishing process for planarization. MWNTs retain their integrity and demonstrate electrical properties consistent with their original structure

  8. Centralized database for interconnection system design. [for spacecraft

    Billitti, Joseph W.


    A database application called DFACS (Database, Forms and Applications for Cabling and Systems) is described. The objective of DFACS is to improve the speed and accuracy of interconnection system information flow during the design and fabrication stages of a project, while simultaneously supporting both the horizontal (end-to-end wiring) and the vertical (wiring by connector) design stratagems used by the Jet Propulsion Laboratory (JPL) project engineering community. The DFACS architecture is centered around a centralized database and program methodology which emulates the manual design process hitherto used at JPL. DFACS has been tested and successfully applied to existing JPL hardware tasks with a resulting reduction in schedule time and costs.

  9. Series interconnected photovoltaic cells and method for making same

    Albright, Scot P.; Chamberlin, Rhodes R.; Thompson, Roger A.


    A novel photovoltaic module (10) and method for constructing the same are disclosed. The module (10) includes a plurality of photovoltaic cells (12) formed on a substrate (14) and laterally separated by interconnection regions (15). Each cell (12) includes a bottom electrode (16), a photoactive layer (18) and a top electrode layer (20). Adjacent cells (12) are connected in electrical series by way of a conductive-buffer line (22). The buffer line (22) is also useful in protecting the bottom electrode (16) against severing during downstream layer cutting processes.

  10. On some interconnections between combinatorial optimization and extremal graph theory

    Cvetković Dragoš M.


    Full Text Available The uniting feature of combinatorial optimization and extremal graph theory is that in both areas one should find extrema of a function defined in most cases on a finite set. While in combinatorial optimization the point is in developing efficient algorithms and heuristics for solving specified types of problems, the extremal graph theory deals with finding bounds for various graph invariants under some constraints and with constructing extremal graphs. We analyze by examples some interconnections and interactions of the two theories and propose some conclusions.

  11. Decentralized control and filtering in interconnected dynamical systems

    Mahmoud, Magdi S


    Based on the many approaches available for dealing with large-scale systems (LSS), Decentralized Control and Filtering in Interconnected Dynamical Systems supplies a rigorous framework for studying the analysis, stability, and control problems of LSS. Providing an overall assessment of LSS theories, it addresses model order reduction, parametric uncertainties, time delays, and control estimator gain perturbations. Taking readers on a guided tour through LSS, the book examines recent trends and approaches and reviews past methods and results from a contemporary perspective. It traces the progre

  12. Religious Globalisms in the Post-Secular Age

    Wilson, E.K.; B. Steger, Manfred


    This article explores the interconnections between mounting global crises and the emergence of the post-secular. Specifically, the article argues that the post-secular is both a description of and a response to shifting global realities in the twenty-first century. It describes the crisis of secular

  13. Global Education: What the Research Shows. Information Capsule. Volume 0604

    Blazer, Christie


    Teaching from a global perspective is important because the lives of people around the world are increasingly interconnected through politics, economics, technology, and the environment. Global education teaches students to understand and appreciate people from different cultural backgrounds; view events from a variety of perspectives; recognize…

  14. The social dimension of globalization: A review of the literature

    B.G. Gunter (Bernard); R.E. van der Hoeven (Rolph)


    textabstractWith globalization affecting so many inter-connected areas, it is difficult to grasp its full impact. This literature review of over 120 sources considers the impact of globalization on wages and taxes, poverty, inequality, insecurity, child labour, gender, and migration. Opening with

  15. Global Mobility and the Challenges of Educational Research and Policy

    Rizvi, Fazal


    In this paper, the author focuses upon the global mobility of people and considers what some of its drivers are. The author explores the consequences it has in transforming not only the demographic composition of communities, but also the ways in which global interconnectivities now define the terrain in which social, economic, political and…

  16. Photorefractive optics materials, properties, and applications

    Yu, Francis T S


    The advances of photorefractive optics have demonstrated many useful and practical applications, which include the development of photorefractive optic devices for computer communication needs. To name a couple significant applications: the large capacity optical memory, which can greatly improve the accessible high-speed CD-ROM and the dynamic photorefractive gratings, which can be used for all-optic switches for high-speed fiber optic networks. This book is an important reference both for technical and non-technical staffs who are interested in this field. * Covers the recent development in materials, phenomena, and applications * Includes growth, characterization, dynamic gratings, and liquid crystal PR effect * Includes applications to photonic devices such as large capacity optical memory, 3-D interconnections, and dynamic holograms * Provides the recent overall picture of current trends in photorefractive optics * Includes optical and electronic properties of the materials as applied to dynamic photoref...

  17. Wearable Optical Sensors

    Ballard, Zachary S.; Ozcan, Aydogan


    The market for wearable sensors is predicted to grow to $5.5 billion by 2025, impacting global health in unprecedented ways. Optics and photonics will play a key role in the future of these wearable technologies, enabling highly sensitive

  18. Optical materials

    Poker, D.B.; Ortiz, C.


    This book reports on: Diamond films, Synthesis of optical materials, Structure related optical properties, Radiation effects in optical materials, Characterization of optical materials, Deposition of optical thin films, and Optical fibers and waveguides

  19. Opportunities and challenges in the wider adoption of liver and interconnected microphysiological systems.

    Hughes, David J; Kostrzewski, Tomasz; Sceats, Emma L


    Liver disease represents a growing global health burden. The development of in vitro liver models which allow the study of disease and the prediction of metabolism and drug-induced liver injury in humans remains a challenge. The maintenance of functional primary hepatocytes cultures, the parenchymal cell of the liver, has historically been difficult with dedifferentiation and the consequent loss of hepatic function limiting utility. The desire for longer term functional liver cultures sparked the development of numerous systems, including collagen sandwiches, spheroids, micropatterned co-cultures and liver microphysiological systems. This review will focus on liver microphysiological systems, often referred to as liver-on-a-chip, and broaden to include platforms with interconnected microphysiological systems or multi-organ-chips. The interconnection of microphysiological systems presents the opportunity to explore system level effects, investigate organ cross talk, and address questions which were previously the preserve of animal experimentation. As a field, microphysiological systems have reached a level of maturity suitable for commercialization and consequent evaluation by a wider community of users, in academia and the pharmaceutical industry. Here scientific, operational, and organizational considerations relevant to the wider adoption of microphysiological systems will be discussed. Applications in which microphysiological systems might offer unique scientific insights or enable studies currently feasible only with animal models are described, and challenges which might be addressed to enable wider adoption of the technologies are highlighted. A path forward which envisions the development of microphysiological systems in partnerships between academia, vendors and industry, is proposed. Impact statement Microphysiological systems are in vitro models of human tissues and organs. These systems have advanced rapidly in recent years and are now being

  20. Spectral space-time coding for optical communications through a multimode fiber

    Alonso, A.; Berghmans, F.; Thienpont, H.; Danckaert, J.; Desmet, L.


    We propose a method for coding the mode structure of a multimode optical fiber by spectral coding mixed with space-time modulation. With this system we can improve the data carrying capacity of a multimode fiber for optical communications and optical interconnects, and encode and decode the