WorldWideScience

Sample records for flip chip packages

  1. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  2. Estimate the thermomechanical fatigue life of two flip chip packages

    International Nuclear Information System (INIS)

    Pash, R.A.; Ullah, H.S.; Khan, M.Z.

    2005-01-01

    The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

  3. Identifying Professional Competencies of the Flip-Chip Packaging Engineer in Taiwan

    Science.gov (United States)

    Guu, Y. H.; Lin, Kuen-Yi; Lee, Lung-Sheng

    2014-01-01

    This study employed a literature review, expert interviews, and a questionnaire survey to construct a set of two-tier competencies for a flip-chip packaging engineer. The fuzzy Delphi questionnaire was sent to 12 flip-chip engineering experts to identify professional competencies that a flip-chip packaging engineer must have. Four competencies,…

  4. Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging

    Science.gov (United States)

    Shih, T. I.; Duh, J. G.

    2008-06-01

    The decapsulation of flip chips bonded to ceramic substrates is a challenging task in the packaging industry owing to the vulnerability of the chip surface during the process. In conventional methods, such as manual grinding and polishing, the solder bumps are easily damaged during the removal of underfill, and the thin chip may even be crushed due to mechanical stress. An efficient and reliable decapsulation method consisting of thermal and chemical processes was developed in this study. The surface quality of chips after solder removal is satisfactory for the existing solder rework procedure as well as for die-level failure analysis. The innovative processes included heat-sink and ceramic substrate removal, solder bump separation, and solder residue cleaning from the chip surface. In the last stage, particular temperatures were selected for the removal of eutectic Pb-Sn, high-lead, and lead-free solders considering their respective melting points.

  5. Interface thermal characteristics of flip chip packages - A numerical study

    International Nuclear Information System (INIS)

    Kandasamy, Ravi; Mujumdar, A.S.

    2009-01-01

    Flip chip ball grid array (FC-BGA) packages are commonly used for high inputs/outputs (I/O) ICs; they have been proven to provide good solutions for a variety of applications to maximize thermal and electrical performance. A fundamental limitation to such devices is the thermal resistance at the top of the package, which is characterized θ JC parameter. The die-to-lid interface thermal resistance is identified as a critical issue for the thermal management of electronic packages. This paper focuses on the effect of the interface material property changes on the interface thermal resistance. The effect of package's junction to case (Theta-JC or θ JC ) thermal performance is investigated for bare die, flat lid and cup lid packages using a validated thermal model. Thermal performance of a cup or flat lid attached and bare die packages were investigated for different interface materials. Improved Theta-JC performance was observed for the large die as compared to the smaller die. Several parametric studies were carried out to understand the effects of interface bond line thickness (BLT), different die sizes, the average void size during assembly and thermal conductivity of interface materials on package thermal resistance

  6. Molded underfill (MUF) encapsulation for flip-chip package: A numerical investigation

    Science.gov (United States)

    Azmi, M. A.; Abdullah, M. K.; Abdullah, M. Z.; Ariff, Z. M.; Saad, Abdullah Aziz; Hamid, M. F.; Ismail, M. A.

    2017-07-01

    This paper presents the numerical simulation of epoxy molding compound (EMC) filling in multi flip-chip packages during encapsulation process. The empty and a group flip chip packages were considered in the mold cavity in order to study the flow profile of the EMC. SOLIDWORKS software was used for three-dimensional modeling and it was incorporated into fluid analysis software namely as ANSYS FLUENT. The volume of fluid (VOF) technique was used for capturing the flow front profiles and Power Law model was applied for its rheology model. The numerical result are compared and discussed with previous experimental and it was shown a good conformity for model validation. The prediction of flow front was observed and analyzed at different filling time. The possibility and visual of void formation in the package is captured and the number of flip-chip is one factor that contributed to the void formation.

  7. Robust design and thermal fatigue life prediction of anisotropic conductive film flip chip package

    International Nuclear Information System (INIS)

    Nam, Hyun Wook

    2004-01-01

    The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF(Anisotropic Conductive Film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design Of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2 nd DOE was conducted to obtain RSM equation for the choose 3 design parameter. The coefficient of determination (R 2 ) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for Feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430μm, and 78μm, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter

  8. A two-dimensional simulation model for the molded underfill process in flip chip packaging

    Energy Technology Data Exchange (ETDEWEB)

    Guo, Xue Ru; Young, Wen Bin [National Cheng Kung University, Tainan (China)

    2015-07-15

    The flip chip process involves the deposition of solder bumps on the chip surface and their subsequent direct attachment and connection to a substrate. Underfilling traditional flip chip packaging is typically performed following a two-step approach. The first step uses capillary force to fill the gap between the chip and the substrate, and the second step uses epoxy molding compound (EMC) to overmold the package. Unlike traditional flip chip packaging, the molded underfill (MUF) concept uses a single-step approach to simultaneously achieve both underfill and overmold. MUF is a simpler and faster process. In this study, a 2D numerical model is developed to simulate the front movement of EMC flow and the void formation for different geometric parameters. The 2D model simplifies the procedures of geometric modeling and reduces the modeling time for the MUF simulation. Experiments are conducted to verify the prediction results of the model. The effect on void formation for different geometric parameters is investigated using a 2D model.

  9. Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

    International Nuclear Information System (INIS)

    Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung-hyun; Nah, Jae-Woong; Paik, Kyung-Wook; Kwon, Dongil

    2004-01-01

    Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 deg. C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA)

  10. Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

    Science.gov (United States)

    Wu, Kuo-Tsai; Hwang, Sheng-Jye; Lee, Huei-Huang

    2017-08-01

    Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

  11. A novel conductive-polymer-based integration process for high-performance flip-chip packages

    Science.gov (United States)

    Lohokare, Saurabh

    Conductive polymers have recently attracted considerable attention for low-temperature fabrication of lead-free, reworkable, and flexible flip-chip interconnects. Using these materials, I demonstrate in this thesis a process that enables low-cost and high-resolution flip-chip interconnects using conventional micro-fabrication techniques. This fabrication process offers improved performance as compared to conventional flip-chip techniques, such as screen-printing, and allows for definition of interconnects with excellent surface uniformity and control over the bump profile. In order to demonstrate the utility and wide applicability of this process, several test implementations that serve as case studies were investigated. Specifically, novel InGaAsSb avalanche photodiodes (APDs), operating around lambda = 2m and targeted for free-space communication and biomedical spectroscopy applications, were fabricated and flip-chip-integrated to test the static electrical characteristics of the polymer bumps. Additionally, the dynamic electrical performance characteristics of the polymer bumps were studied by using AlGaAsSb/AlGaSb p-i-n photodetectors as a case study. The fabrication of these photodetectors, operating around lambda = 1.55mum and targeted for optical communication applications, was accomplished using a customized inductively coupled plasma (ICP) etch process that resulted in a low dark current and excellent speed (3dB bandwidth of 10GHz) and, responsivity (60% external quantum efficiency) characteristics. Furthermore, flip-chip integration was used to demonstrate a three-dimensional, point-to-point micro-optical interconnect, which was 2.33mm-long in a system 15.27mm3 in volume. Lastly, high-speed parallel optical interconnects were demonstrated using polymer-flip-chip-integrated 10GHz vertical-cavity surface-emitting laser (VCSEL) and DOEs. Such interconnects offer the ability to alleviate the communication bottleneck that is projected to occur in future, high

  12. Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Oh Young; Jung, Hoon Sun; Lee, Jung Hoon; Choa, Sung-Hoon [Seoul Nat’l Univ. of Science and Technology, Seoul (Korea, Republic of)

    2017-06-15

    In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

  13. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  14. Amdahl 470 Chip Package

    CERN Multimedia

    1975-01-01

    In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

  15. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  16. Rework of flip chip bonded radiation pixel detectors

    International Nuclear Information System (INIS)

    Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

    2008-01-01

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

  17. Rework of flip chip bonded radiation pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

    2008-06-11

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

  18. Flip chip assembly of thinned chips for hybrid pixel detector applications

    International Nuclear Information System (INIS)

    Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

  19. Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials

    Science.gov (United States)

    Suh, Jong-ook

    2013-01-01

    The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

  20. Flip chip assembly of thinned chips for hybrid pixel detector applications

    CERN Document Server

    Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

  1. Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

    Science.gov (United States)

    Michaelides, Stylianos

    Flip Chip on Board (FCOB) and Chip-Scale Packages (CSPs) are relatively new technologies that are being increasingly used in the electronic packaging industry. Compared to the more widely used face-up wirebonding and TAB technologies, flip-chips and most CSPs provide the shortest possible leads, lower inductance, higher frequency, better noise control, higher density, greater input/output (I/O), smaller device footprint and lower profile. However, due to the short history and due to the introduction of several new electronic materials, designs, and processing conditions, very limited work has been done to understand the role of material, geometry, and processing parameters on the reliability of flip-chip devices. Also, with the ever-increasing complexity of semiconductor packages and with the continued reduction in time to market, it is too costly to wait until the later stages of design and testing to discover that the reliability is not satisfactory. The objective of the research is to develop integrated process-reliability models that will take into consideration the mechanics of assembly processes to be able to determine the reliability of face-down devices under thermal cycling and long-term temperature dwelling. The models incorporate the time and temperature-dependent constitutive behavior of various materials in the assembly to be able to predict failure modes such as die cracking and solder cracking. In addition, the models account for process-induced defects and macro-micro features of the assembly. Creep-fatigue and continuum-damage mechanics models for the solder interconnects and fracture-mechanics models for the die have been used to determine the reliability of the devices. The results predicted by the models have been successfully validated against experimental data. The validated models have been used to develop qualification and test procedures for implantable medical devices. In addition, the research has helped develop innovative face

  2. Chip-scale white flip-chip light-emitting diode containing indium phosphide/zinc selenide quantum dots

    Science.gov (United States)

    Fan, Bingfeng; Yan, Linchao; Lao, Yuqin; Ma, Yanfei; Chen, Zimin; Ma, Xuejin; Zhuo, Yi; Pei, Yanli; Wang, Gang

    2017-08-01

    A method for preparing a quantum dot (QD)-white light-emitting diode (WLED) is reported. Holes were etched in the SiO2 layer deposited on the sapphire substrate of the flip-chip LED by inductively coupled plasma, and these holes were then filled with QDs. An ultraviolet-curable resin was then spin-coated on top of the QD-containing SiO2 layer, and the resin was cured to act as a protecting layer. The reflective sidewall structure minimized sidelight leakage. The fabrication of the QD-WLED is simple in preparation and compatible with traditional LED processes, which was the minimum size of the WLED chip-scale integrated package. InP/ZnS core-shell QDs were used as the converter in the WLED. A blue light-emitting diode with a flip-chip structure was used as the excitation source. The QD-WLED exhibited color temperatures from 5900 to 6400 K and Commission Internationale De L'Elcairage color coordinates from (0.315, 0.325) to (0.325, 0.317), under drive currents from 100 to 400 mA. The QD-WLED exhibited stable optoelectronic properties.

  3. High-sensitivity low-noise miniature fluxgate magnetometers using a flip chip conceptual design.

    Science.gov (United States)

    Lu, Chih-Cheng; Huang, Jeff; Chiu, Po-Kai; Chiu, Shih-Liang; Jeng, Jen-Tzong

    2014-07-30

    This paper presents a novel class of miniature fluxgate magnetometers fabricated on a print circuit board (PCB) substrate and electrically connected to each other similar to the current "flip chip" concept in semiconductor package. This sensor is soldered together by reversely flipping a 5 cm × 3 cm PCB substrate to the other identical one which includes dual magnetic cores, planar pick-up coils, and 3-D excitation coils constructed by planar Cu interconnections patterned on PCB substrates. Principles and analysis of the fluxgate sensor are introduced first, and followed by FEA electromagnetic modeling and simulation for the proposed sensor. Comprehensive characteristic experiments of the miniature fluxgate device exhibit favorable results in terms of sensitivity (or "responsivity" for magnetometers) and field noise spectrum. The sensor is driven and characterized by employing the improved second-harmonic detection technique that enables linear V-B correlation and responsivity verification. In addition, the double magnitude of responsivity measured under very low frequency (1 Hz) magnetic fields is experimentally demonstrated. As a result, the maximum responsivity of 593 V/T occurs at 50 kHz of excitation frequency with the second harmonic wave of excitation; however, the minimum magnetic field noise is found to be 0.05 nT/Hz(1/2) at 1 Hz under the same excitation. In comparison with other miniature planar fluxgates published to date, the fluxgate magnetic sensor with flip chip configuration offers advances in both device functionality and fabrication simplicity. More importantly, the novel design can be further extended to a silicon-based micro-fluxgate chip manufactured by emerging CMOS-MEMS technologies, thus enriching its potential range of applications in modern engineering and the consumer electronics market.

  4. High-Sensitivity Low-Noise Miniature Fluxgate Magnetometers Using a Flip Chip Conceptual Design

    Directory of Open Access Journals (Sweden)

    Chih-Cheng Lu

    2014-07-01

    Full Text Available This paper presents a novel class of miniature fluxgate magnetometers fabricated on a print circuit board (PCB substrate and electrically connected to each other similar to the current “flip chip” concept in semiconductor package. This sensor is soldered together by reversely flipping a 5 cm × 3 cm PCB substrate to the other identical one which includes dual magnetic cores, planar pick-up coils, and 3-D excitation coils constructed by planar Cu interconnections patterned on PCB substrates. Principles and analysis of the fluxgate sensor are introduced first, and followed by FEA electromagnetic modeling and simulation for the proposed sensor. Comprehensive characteristic experiments of the miniature fluxgate device exhibit favorable results in terms of sensitivity (or “responsivity” for magnetometers and field noise spectrum. The sensor is driven and characterized by employing the improved second-harmonic detection technique that enables linear V-B correlation and responsivity verification. In addition, the double magnitude of responsivity measured under very low frequency (1 Hz magnetic fields is experimentally demonstrated. As a result, the maximum responsivity of 593 V/T occurs at 50 kHz of excitation frequency with the second harmonic wave of excitation; however, the minimum magnetic field noise is found to be 0.05 nT/Hz1/2 at 1 Hz under the same excitation. In comparison with other miniature planar fluxgates published to date, the fluxgate magnetic sensor with flip chip configuration offers advances in both device functionality and fabrication simplicity. More importantly, the novel design can be further extended to a silicon-based micro-fluxgate chip manufactured by emerging CMOS-MEMS technologies, thus enriching its potential range of applications in modern engineering and the consumer electronics market.

  5. High-Sensitivity Low-Noise Miniature Fluxgate Magnetometers Using a Flip Chip Conceptual Design

    Science.gov (United States)

    Lu, Chih-Cheng; Huang, Jeff; Chiu, Po-Kai; Chiu, Shih-Liang; Jeng, Jen-Tzong

    2014-01-01

    This paper presents a novel class of miniature fluxgate magnetometers fabricated on a print circuit board (PCB) substrate and electrically connected to each other similar to the current “flip chip” concept in semiconductor package. This sensor is soldered together by reversely flipping a 5 cm × 3 cm PCB substrate to the other identical one which includes dual magnetic cores, planar pick-up coils, and 3-D excitation coils constructed by planar Cu interconnections patterned on PCB substrates. Principles and analysis of the fluxgate sensor are introduced first, and followed by FEA electromagnetic modeling and simulation for the proposed sensor. Comprehensive characteristic experiments of the miniature fluxgate device exhibit favorable results in terms of sensitivity (or “responsivity” for magnetometers) and field noise spectrum. The sensor is driven and characterized by employing the improved second-harmonic detection technique that enables linear V-B correlation and responsivity verification. In addition, the double magnitude of responsivity measured under very low frequency (1 Hz) magnetic fields is experimentally demonstrated. As a result, the maximum responsivity of 593 V/T occurs at 50 kHz of excitation frequency with the second harmonic wave of excitation; however, the minimum magnetic field noise is found to be 0.05 nT/Hz1/2 at 1 Hz under the same excitation. In comparison with other miniature planar fluxgates published to date, the fluxgate magnetic sensor with flip chip configuration offers advances in both device functionality and fabrication simplicity. More importantly, the novel design can be further extended to a silicon-based micro-fluxgate chip manufactured by emerging CMOS-MEMS technologies, thus enriching its potential range of applications in modern engineering and the consumer electronics market. PMID:25196107

  6. Polymer Flip Chips with Extreme Temperature Stability in Space, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The objective of the proposed SBIR Phase I program is to develop highly thermally and electrically conductive nanocomposites for space-based flip chips for...

  7. Tin-Silver Alloys for Flip-Chip Bonding Studied with a Rotating Cylinder Electrode

    DEFF Research Database (Denmark)

    Tang, Peter Torben; Pedersen, E.H.; Bech-Nielsen, G.

    1999-01-01

    Electrodeposition of solder for flip-chip bonding is studied in the form of a pyrophosphate/iodide tin-silver alloy bath. The objective is to obtain a uniform alloy composition, with 3.8 At.% silver, over a larger area. This specific alloy will provide an eutectic solder melting at 221°C (or 10°C...... photoresist, have shown a stable and promising alternative to pure tin and tin-lead alloys for flip-chip bonding applications....

  8. Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

    Science.gov (United States)

    Hong, Sunkwang; Ho, Tawei; Zhang, Liping; Sawchuk, Alexander A.

    2003-06-01

    We describe the design and test of flip-chip bonded optoelectronic CMOS devices based on Peregrine Semiconductor's 0.5 micron Ultra-Thin Silicon on sapphire (UTSi) technology. The UTSi process eliminates the substrate leakage that typically results in crosstalk and reduces parasitic capacitance to the substrate, providing many benefits compared to bulk silicon CMOS. The low-loss synthetic sapphire substrate is optically transparent and has a coefficient of thermal expansion suitable for flip-chip bonding of vertical cavity surface emitting lasers (VCSELs) and detectors. We have designed two different UTSi CMOS chips. One contains a flip-chip bonded 1 x 4 photodiode array, a receiver array, a double edge triggered D-flip flop-based 2047-pattern pseudo random bit stream (PRBS) generator and a quadrature-phase LC-voltage controlled oscillator (VCO). The other chip contains a flip-chip bonded 1 x 4 VCSEL array, a driver array based on high-speed low-voltage differential signals (LVDS) and a full-balanced differential LC-VCO. Each VCSEL driver and receiver has individual input and bias voltage adjustments. Each UTSi chip is mounted on different printed circuit boards (PCBs) which have holes with about 1 mm radius for optical output and input paths through the sapphire substrate. We discuss preliminary testing of these chips.

  9. A novel model for simulating the racing effect in capillary-driven underfill process in flip chip

    Science.gov (United States)

    Zhu, Wenhui; Wang, Kanglun; Wang, Yan

    2018-04-01

    Underfill is typically applied in flip chips to increase the reliability of the electronic packagings. In this paper, the evolution of the melt-front shape of the capillary-driven underfill flow is studied through 3D numerical analysis. Two different models, the prevailing surface force model and the capillary model based on the wetted wall boundary condition, are introduced to test their applicability, where level set method is used to track the interface of the two phase flow. The comparison between the simulation results and experimental data indicates that, the surface force model produces better prediction on the melt-front shape, especially in the central area of the flip chip. Nevertheless, the two above models cannot simulate properly the racing effect phenomenon that appears during underfill encapsulation. A novel ‘dynamic pressure boundary condition’ method is proposed based on the validated surface force model. Utilizing this approach, the racing effect phenomenon is simulated with high precision. In addition, a linear relationship is derived from this model between the flow front location at the edge of the flip chip and the filling time. Using the proposed approach, the impact of the underfill-dispensing length on the melt-front shape is also studied.

  10. Packaged and hybrid integrated all-optical flip-flop memory

    NARCIS (Netherlands)

    Liu, Y.; McDougall, R.; Hill, M.T.; Maxwell, G.D.; Zhang, S.; Harmon, R.; Huijskens, Frans; Rivers, L.; Dorren, H.J.S.; Poustie, A.

    2006-01-01

    A fully-packaged hybrid-integrated all-optical flip-flop, where InP-based semiconductor optical amplifiers are assembled onto a planar silica waveguide board, is demonstrated. It is shown experimentally that the flip-flop can dynamically toggle between its two states by injecting 150 ps optical

  11. Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

    Science.gov (United States)

    Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

    2016-01-01

    Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

  12. Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

    Directory of Open Access Journals (Sweden)

    Niina Halonen

    2016-11-01

    Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

  13. High-Sensitivity Low-Noise Miniature Fluxgate Magnetometers Using a Flip Chip Conceptual Design

    OpenAIRE

    Lu, Chih-Cheng; Huang, Jeff; Chiu, Po-Kai; Chiu, Shih-Liang; Jeng, Jen-Tzong

    2014-01-01

    This paper presents a novel class of miniature fluxgate magnetometers fabricated on a print circuit board (PCB) substrate and electrically connected to each other similar to the current “flip chip” concept in semiconductor package. This sensor is soldered together by reversely flipping a 5 cm × 3 cm PCB substrate to the other identical one which includes dual magnetic cores, planar pick-up coils, and 3-D excitation coils constructed by planar Cu interconnections patterned on PCB substrates. P...

  14. Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

    CERN Document Server

    Karadzhinova, Aneliya; Härkönen, Jaakko; Luukka, Panja-riina; Mäenpää, Teppo; Tuominen, Eija; Haeggstrom, Edward; Kalliopuska, Juha; Vahanen, Sami; Kassamakov, Ivan

    2014-01-01

    In contemporary high energy physics experiments, silicon detectors are essential for recording the trajectory of new particles generated by multiple simultaneous collisions. Modern particle tracking systems may feature 100 million channels, or pixels, which need to be individually connected to read-out chains. Silicon pixel detectors are typically connected to readout chips by flip-chip bonding using solder bumps. High-quality electro-mechanical flip-chip interconnects minimizes the number of dead read-out channels in the particle tracking system. Furthermore, the detector modules must endure handling during installation and withstand heat generation and cooling during operation. Silicon pixel detector modules were constructed by flip-chip bonding 16 readout chips to a single sensor. Eutectic SnPb solder bumps were deposited on the readout chips and the sensor chips were coated with TiW/Pt thin film UBM (under bump metallization). The modules were assembled at Advacam Ltd, Finland. We studied the uniformity o...

  15. Optimization of high frequency flip-chip interconnects for digital superconducting circuits

    International Nuclear Information System (INIS)

    Rafique, M R; Engseth, H; Kidiyarova-Shevchenko, A

    2006-01-01

    This paper presents the results of theoretical optimization of the multi-chip-module (MCM) contact and driver circuitries for gigabit chip-to-chip communication. Optimization has been done using 3D electromagnetic (EM) simulations of MCM contacts and time domain simulations of drivers and receivers. A single optimized MCM contact has a signal reflection of less than -20 dB for more than 400 GHz bandwidth. The MCM data link with the optimized SFQ driver, receiver and two MCM contacts has operational margins on the global bias current of ± 30% at 30 Gbit s -1 speedand can operate above 100 Gbit s -1 speed. Wide bandwidth transmission requires the realization of an advanced flip-chip process with a small dimension of the MCM contact (less than 30 μm diameter of the contact pad) and small height of the flip-chip contact bumps of the order of 2 μm. Current processes with about 7 μm height of the bumps require the application of a double-flux-quantum (DFQ) driver. The data link with the DFQ driver was also simulated. It has operational margins on the global bias current of ± 30% at 30 Gbit s -1 ; however, the maximum speed of operation is 61 Gbit s -1 . Several test structures have been designed for measurements of signal reflection, bit error rate and operational margins of the data link

  16. High-Tc dc-SQUID gradiometers in flip-chip configuration

    International Nuclear Information System (INIS)

    Peiselt, K; Schmidl, F; Linzen, S; Anton, A S; Huebner, U; Seidel, P

    2003-01-01

    We describe a new design of a gradiometric flip-chip antenna, which is inductively coupled to a dc-SQUID gradiometer. Both components are patterned out of thin films of the high-T c superconductor YBa 2 Cu 3 O 7-x (YBCO). For the flip-chip antenna, a 40 mm x 10 mm SrTiO 3 single crystalline substrate is used, while the gradiometer sensors are prepared on 10 mm x 10 mm SrTiO 3 bicrystal substrates. Special attention is paid to the inductive coupling between the flip-chip antenna and the read-out gradiometer antenna. We investigate different designs of coupling loops in order to optimize the coupling inductance between both components of the sensor. With optimized coupling the sensor achieves a field-gradient resolution of 12 fT cm -1 Hz -1/2 in the white noise region and of 310 fT cm -1 Hz -1/2 at 1 Hz in the unshielded laboratory environment

  17. High-Tc dc-SQUID gradiometers in flip-chip configuration

    Science.gov (United States)

    Peiselt, K.; Schmidl, F.; Linzen, S.; Anton, A. S.; Hübner, U.; Seidel, P.

    2003-12-01

    We describe a new design of a gradiometric flip-chip antenna, which is inductively coupled to a dc-SQUID gradiometer. Both components are patterned out of thin films of the high-Tc superconductor YBa2Cu3O7-x (YBCO). For the flip-chip antenna, a 40 mm × 10 mm SrTiO3 single crystalline substrate is used, while the gradiometer sensors are prepared on 10 mm × 10 mm SrTiO3 bicrystal substrates. Special attention is paid to the inductive coupling between the flip-chip antenna and the read-out gradiometer antenna. We investigate different designs of coupling loops in order to optimize the coupling inductance between both components of the sensor. With optimized coupling the sensor achieves a field-gradient resolution of 12 fT cm-1 Hz-1/2 in the white noise region and of 310 fT cm-1 Hz-1/2 at 1 Hz in the unshielded laboratory environment.

  18. Characterization of integrated circuit packaging materials

    CERN Document Server

    Moore, Thomas

    1993-01-01

    Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

  19. Dry-film polymer waveguide for silicon photonics chip packaging.

    Science.gov (United States)

    Hsu, Hsiang-Han; Nakagawa, Shigeru

    2014-09-22

    Polymer waveguide made by dry film process is demonstrated for silicon photonics chip packaging. With 8 μm × 11.5 μm core waveguide, little penalty is observed up to 25 Gbps before or after the light propagate through a 10-km long single-mode fiber (SMF). Coupling loss to SMF is 0.24 dB and 1.31 dB at the polymer waveguide input and output ends, respectively. Alignment tolerance for 0.5 dB loss increase is +/- 1.0 μm along both vertical and horizontal directions for the coupling from the polymer waveguide to SMF. The dry-film polymer waveguide demonstrates promising performance for silicon photonics chip packaging used in next generation optical multi-chip module.

  20. Analysis of a flip-chip bonded tunable high-temperature superconducting coplanar waveguide resonator using the conformal mapping technique

    CERN Document Server

    Misra, M; Murakami, H; Tonouchi, M

    2003-01-01

    We have studied the tuning properties of a high-temperature superconducting (HTS) half-wavelength coplanar waveguide (CPW) resonator operating at 5 GHz. The tuning schemes are based on flip-chip bonding of an electrically tunable ferroelectric (FE) thin film and a mechanically movable low-loss single crystal on top of the resonator. Using the conformal mapping method, closed-form analytical expressions have been derived for a flip-chip bonded conductor-backed and top-shielded CPW transmission line. The obtained expressions are used to analyse the volume effect of the FE thin film and the gap between the flip-chip and the CPW resonator on the tuning properties of the device. It has been found that large frequency modulation of the resonator produces impedance mismatch, which can considerably enhance the insertion loss of high-performance HTS microwave devices. Analysis also suggests that, for electrically tunable devices, flip-chip bonded FE thin films on HTS CPW devices provide a relatively higher performance...

  1. Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method

    International Nuclear Information System (INIS)

    Saitoh, Y.; Takeuchi, H.; Mandai, M.; Kanazawa, H.; Yamanaka, J.; Miyahara, S.; Kamiya, M.; Fujita, Y.; Higashi, Y.; Ikeda, H.; Ikeda, M.; Koike, S.; Matsuda, T.; Ozaki, H.; Tanaka, M.; Tsuboyama, T.; Avrillon, S.; Okuno, S.; Haba, J.; Hanai, H.; Mori, S.; Yusa, K.; Fukunaga, C.

    1994-01-01

    Full-size models of a detector unit for a silicon micro-vertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film was examined. The structure using the FCB method successfully provides a new architecture for the silicon micro-vertex detector unit. (orig.)

  2. Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

    Science.gov (United States)

    Lee, Tae-Kyu; Chen, Zhiqiang; Guirguis, Cherif; Akinade, Kola

    2017-10-01

    The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases with higher electric power condition, which brings the component into an elevated temperature environment, thus introducing another consideration factor for mechanical stability of interconnection joints. Since most of the shock performance data available were produced at room temperature, the effect of elevated temperature is of interest to ensure the reliability of the device in a mechanical shock environment. To achieve a stable␣interconnect in a dynamic shock environment, the interconnections must tolerate mechanical strain, which is induced by the shock wave input and reaches the particular component interconnect joint. In this study, large body size (52.5 × 52.5 mm2) FCBGA components assembled on 2.4-mm-thick boards were tested with various isothermal pre-conditions and testing conditions. With a heating element embedded in the test board, a test temperature range from room temperature to 100°C was established. The effects of elevated temperature on mechanical shock performance were investigated. Failure and degradation mechanisms are identified and discussed based on the microstructure evolution and grain structure transformations.

  3. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  4. A proposed holistic approach to on-chip, off-chip, test, and package interconnections

    Science.gov (United States)

    Bartelink, Dirk J.

    1998-11-01

    The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

  5. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  6. Spatial redistribution of radiation in flip-chip photodiodes based on InAsSbP/InAs double heterostructures

    Energy Technology Data Exchange (ETDEWEB)

    Zakgeim, A. L. [Russian Academy of Sciences, Scientific and Technological Center for Microelectronics (Russian Federation); Il’inskaya, N. D.; Karandashev, S. A.; Lavrov, A. A., E-mail: ioffeled@mail.ru; Matveev, B. A.; Remennyy, M. A.; Stus’, N. M.; Usikova, A. A. [Russian Academy of Sciences, Ioffe Institute (Russian Federation); Cherniakov, A. E. [Russian Academy of Sciences, Scientific and Technological Center for Microelectronics (Russian Federation)

    2017-02-15

    The spatial distribution of equilibrium and nonequilibrium (including luminescent) IR (infrared) radiation in flip-chip photodiodes based on InAsSbP/InAs double heterostructures (λ{sub max} = 3.4 μm) is measured and analyzed; the structural features of the photodiodes, including the reflective properties of the ohmic contacts, are taken into account. Optical area enhancement due to multiple internal reflection in photodiodes with different geometric characteristics is estimated.

  7. Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

    Science.gov (United States)

    Wu, Yuan-Yun

    In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a

  8. Ceramic thermal wind sensor based on advanced direct chip attaching package

    International Nuclear Information System (INIS)

    Zhou Lin; Qin Ming; Chen Shengqi; Chen Bei

    2014-01-01

    An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching (DCA) packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics (CFD) model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor. (semiconductor devices)

  9. Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs

    International Nuclear Information System (INIS)

    Unno, Y.; Hanagaki, K.; Hori, R.; Ikegami, Y.; Nakamura, K.; Takubo, Y.; Kamada, S.; Yamamura, K.; Yamamoto, H.; Takashima, R.; Tojo, J.; Kono, T.; Nagai, R.; Saito, S.; Sugibayashi, K.; Hirose, M.; Jinnouchi, O.; Sato, S.; Sawai, H.; Hara, K.

    2017-01-01

    We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n + -in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in wafer. Variation in readout connection for the pixels at the boundary of ASICs is implemented in the design of quadsensors. Bump bonding technology is developed for four ASICs onto one quadsensor. Both sensors and ASICs are thinned to 150 μm before bump bonding, and are held flat with vacuum chucks. Using lead-free SnAg solder bumps, we encounter deficiency with large areas of disconnected bumps after thermal stress treatment, including irradiation. Surface oxidation of the solder bumps is identified as a critical source of this deficiency after bump bonding trials, using SnAg bumps with solder flux, indium bumps, and SnAg bumps with a newly-introduced hydrogen-reflow process. With hydrogen-reflow, we establish flux-less bump bonding technology with SnAg bumps, appropriate for mass production of the flip-chip modules with thin sensors and thin ASICs.

  10. Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

    Science.gov (United States)

    Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook

    2009-01-01

    A thick Cu column based double-bump flip chip structure is one of the promising alternatives for fine pitch flip chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip chip assemblies was investigated, and the failure mechanism was analyzed through the correlation of T/C test and the finite element analysis (FEA) results. After 1000 thermal cycles, T/C failures occurred at some Cu/SnAg bumps located at the edge and corner of chips. Scanning acoustic microscope analysis and scanning electron microscope observations indicated that the failure site was the Cu column/Si chip interface. It was identified by a FEA where the maximum stress concentration was located during T/C. During T/C, the Al pad between the Si chip and a Cu column bump was displaced due to thermomechanical stress. Based on the low cycle fatigue model, the accumulation of equivalent plastic strain resulted in thermal fatigue deformation of the Cu column bumps and ultimately reduced the thermal cycling lifetime. The maximum equivalent plastic strains of some bumps at the chip edge increased with an increased number of thermal cycles. However, equivalent plastic strains of the inner bumps did not increase regardless of the number of thermal cycles. In addition, the z-directional normal plastic strain ɛ22 was determined to be compressive and was a dominant component causing the plastic deformation of Cu/SnAg double bumps. As the number of thermal cycles increased, normal plastic strains in the perpendicular direction to the Si chip and shear strains were accumulated on the Cu column bumps at the chip edge at low temperature region. Thus it was found that the Al pad at the Si chip/Cu column interface underwent thermal fatigue deformation by compressive normal strain and the contact loss by displacement failure of the Al pad, the main T/C failure mode of the Cu/SnAg flip chip assembly, then occurred at the Si chip/Cu column interface shear strain deformation

  11. Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology

    International Nuclear Information System (INIS)

    Wang, Jiachou; Li, Xinxin

    2013-01-01

    An on-chip integrated packaging-stress-suppressed suspension (PS 3 ) technology for a packaging-stress-free pressure sensor is proposed and developed. With a MIS (microholes interetch and sealing) micromachining process implemented only from the front-side of a single-side polished (1 1 1) silicon wafer, a compact cantilever-shaped PS 3 is on-chip integrated surrounding a piezoresistive pressure-sensing structure to provide a packaging-process/substrate-friendly method for low-cost but high-performance sensor applications. With the MIS process, the chip size of the PS 3 -enclosed pressure sensor is as small as 0.8 mm × 0.8 mm. Compared with a normal pressure sensor without PS 3 (but with an identical pressure-sensing structure), the proposed pressure sensor has the same sensitivity of 0.046 mV kPa −1 (3.3 V) −1 . However, without using the thermal compensation technique, a temperature coefficient of offset of only 0.016% °C −1 FS is noted for the sensor with PS 3 , which is about 15 times better than that for the sensor without PS 3 . Featuring effective isolation and elimination of the influence from packaging stress, the PS 3 technique is promising to be widely used for packaging-friendly mechanical sensors. (paper)

  12. Improvement of surface light extraction from flip-chip GaN-based LED by embossing of thermosetting polymers

    Energy Technology Data Exchange (ETDEWEB)

    Bao, Kui; Zhang, Bei; Wang, ZhiMin; Dai, Tao; Kang, XiangNing; Chen, ZhiZhong; Xu, Ke; Ji, Hang; Chen, Yong; Gan, ZiZhao [School of Physics and State Key Laboratory for Artificial Microstructures and Mesoscopic Physics, Peking University, Beijing 100871 (China)

    2007-07-01

    In this report, a further improvement of surface light extraction from flip-chip GaN-based LED was obtained by the micro patterning of encapsulation on the sapphire. The two dimensional taper arrays with period from 6 to 10 micron were successfully realized on polymer encapsulation by a simple and low cost technique so called embossing of thermosetting polymers. As a preliminary demonstration, at least 1.74 enhancement of the surface output intensity was achieved in the 1 mm x 1 mm GaN-based LED device under the injection current of 350 mA. (copyright 2007 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  13. A packaging solution utilizing adhesive-filled TSVs and flip–chip methods

    International Nuclear Information System (INIS)

    Benfield, David; Moussa, Walied A; Lou, Edmond

    2012-01-01

    A compact packaging solution for microelectromechanical systems (MEMS) devices is presented. The 3D-integrated packaging solution was designed for the instrumentation of a spinal screw with a wireless sensor array, but may be adapted for a variety of applications. To achieve the compact package size, an unobtrusive through-silicon via (TSV) design was added to the microfabrication process flow for the MEMS sensor. These TSVs allowed vertical integration of the MEMS devices onto flexible printed circuit boards (FPCBs) using a flip–chip system. Ohmic connections with resistance values below 1 Ω have been achieved for 100 µm TSVs in 300 and 500 µm substrates. This paper describes the design and microfabrication process flow for the TSVs, and provides details on the flip–chip techniques used to electrically and structurally connect the MEMS devices to the FPCBs. (paper)

  14. The IronChip evaluation package: a package of perl modules for robust analysis of custom microarrays

    Directory of Open Access Journals (Sweden)

    Brazma Alvis

    2010-03-01

    Full Text Available Abstract Background Gene expression studies greatly contribute to our understanding of complex relationships in gene regulatory networks. However, the complexity of array design, production and manipulations are limiting factors, affecting data quality. The use of customized DNA microarrays improves overall data quality in many situations, however, only if for these specifically designed microarrays analysis tools are available. Results The IronChip Evaluation Package (ICEP is a collection of Perl utilities and an easy to use data evaluation pipeline for the analysis of microarray data with a focus on data quality of custom-designed microarrays. The package has been developed for the statistical and bioinformatical analysis of the custom cDNA microarray IronChip but can be easily adapted for other cDNA or oligonucleotide-based designed microarray platforms. ICEP uses decision tree-based algorithms to assign quality flags and performs robust analysis based on chip design properties regarding multiple repetitions, ratio cut-off, background and negative controls. Conclusions ICEP is a stand-alone Windows application to obtain optimal data quality from custom-designed microarrays and is freely available here (see "Additional Files" section and at: http://www.alice-dsl.net/evgeniy.vainshtein/ICEP/

  15. The Chip-Scale Atomic Clock - Low-Power Physics Package

    Science.gov (United States)

    2004-12-01

    36th Annual Precise Time and Time Interval (PTTI) Meeting 339 THE CHIP-SCALE ATOMIC CLOCK – LOW-POWER PHYSICS PACKAGE R. Lutwak ...pdf/documents/ds-x72.pdf [2] R. Lutwak , D. Emmons, W. Riley, and R. M. Garvey, 2003, “The Chip-Scale Atomic Clock – Coherent Population Trapping vs...2002, Reston, Virginia, USA (U.S. Naval Observatory, Washington, D.C.), pp. 539-550. [3] R. Lutwak , D. Emmons, T. English, and W. Riley, 2004

  16. chipPCR: an R package to pre-process raw data of amplification curves.

    Science.gov (United States)

    Rödiger, Stefan; Burdukiewicz, Michał; Schierack, Peter

    2015-09-01

    Both the quantitative real-time polymerase chain reaction (qPCR) and quantitative isothermal amplification (qIA) are standard methods for nucleic acid quantification. Numerous real-time read-out technologies have been developed. Despite the continuous interest in amplification-based techniques, there are only few tools for pre-processing of amplification data. However, a transparent tool for precise control of raw data is indispensable in several scenarios, for example, during the development of new instruments. chipPCR is an R: package for the pre-processing and quality analysis of raw data of amplification curves. The package takes advantage of R: 's S4 object model and offers an extensible environment. chipPCR contains tools for raw data exploration: normalization, baselining, imputation of missing values, a powerful wrapper for amplification curve smoothing and a function to detect the start and end of an amplification curve. The capabilities of the software are enhanced by the implementation of algorithms unavailable in R: , such as a 5-point stencil for derivative interpolation. Simulation tools, statistical tests, plots for data quality management, amplification efficiency/quantification cycle calculation, and datasets from qPCR and qIA experiments are part of the package. Core functionalities are integrated in GUIs (web-based and standalone shiny applications), thus streamlining analysis and report generation. http://cran.r-project.org/web/packages/chipPCR. Source code: https://github.com/michbur/chipPCR. stefan.roediger@b-tu.de Supplementary data are available at Bioinformatics online. © The Author 2015. Published by Oxford University Press. All rights reserved. For Permissions, please e-mail: journals.permissions@oup.com.

  17. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  18. Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

    Science.gov (United States)

    Aggarwal, Ankur

    With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is

  19. Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers

    Directory of Open Access Journals (Sweden)

    Pai-Yang Tsai

    2014-01-01

    Full Text Available The temperature-dependent optical, electrical, and thermal properties of flip-chip light emitting diodes (FCLEDs with diamond-like carbon (DLC heat-spreading layers were investigated. On the basis of the measured results in the 20°C to 100°C temperature range, a significant performance improvement can be achieved for FCLEDs with DLC heat-spreading layers (DLC-FCLED compared with FCLEDs without DLC heat-spreading layers (non-DLC-FCLED. The external quantum efficiency (EQE of the DLC-FCLED improves by 9% at an injection current of 1000 mA and a temperature of 100°C. The forward voltage and spectra variations are smaller than those of non-DLC-FCLEDs. The DLC-FCLED provides high efficiency and high stability performance for high-power and high-temperature applications.

  20. An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging.

    Science.gov (United States)

    Wygant, Ira O; Jamal, Nafis S; Lee, Hyunjoo J; Nikoozadeh, Amin; Oralkan, Omer; Karaman, Mustafa; Khuri-Yakub, Butrus T

    2009-10-01

    State-of-the-art 3-D medical ultrasound imaging requires transmitting and receiving ultrasound using a 2-D array of ultrasound transducers with hundreds or thousands of elements. A tight combination of the transducer array with integrated circuitry eliminates bulky cables connecting the elements of the transducer array to a separate system of electronics. Furthermore, preamplifiers located close to the array can lead to improved receive sensitivity. A combined IC and transducer array can lead to a portable, high-performance, and inexpensive 3-D ultrasound imaging system. This paper presents an IC flip-chip bonded to a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array for 3-D ultrasound imaging. The IC includes a transmit beamformer that generates 25-V unipolar pulses with programmable focusing delays to 224 of the 256 transducer elements. One-shot circuits allow adjustment of the pulse widths for different ultrasound transducer center frequencies. For receiving reflected ultrasound signals, the IC uses the 32-elements along the array diagonals. The IC provides each receiving element with a low-noise 25-MHz-bandwidth transimpedance amplifier. Using a field-programmable gate array (FPGA) clocked at 100 MHz to operate the IC, the IC generated properly timed transmit pulses with 5-ns accuracy. With the IC flip-chip bonded to a CMUT array, we show that the IC can produce steered and focused ultrasound beams. We present 2-D and 3-D images of a wire phantom and 2-D orthogonal cross-sectional images (Bscans) of a latex heart phantom.

  1. Interface analysis of embedded chip resistor device package and its effect on drop shock reliability.

    Science.gov (United States)

    Park, Se-Hoon; Kim, Sun Kyoung; Kim, Young-Ho

    2012-04-01

    In this study, the drop reliability of an embedded passive package is investigated under JESD22-B111 condition. Chip resistors were buried in a PCB board, and it was electrically interconnected by electroless and electrolytic copper plating on a tin pad of a chip resistor without intermetallic phase. However tin, nickel, and copper formed a complex intermetallic phase, such as (Cu, Ni)6Sn5, (Cu, Ni)3Sn, and (Ni, Cu)3Sn2, at the via interface and via wall after reflow and aging. Since the amount of the tin layer was small compared with the solder joint, excessive intermetallic layer growth was not observed during thermal aging. Drop failures are always initiated at the IMC interface, and as aging time increases Cu-Sn-Ni IMC phases are transformed continuously due to Cu diffusion. We studied the intermetallic formation of the Cu via interface and simulated the stress distribution of drop shock by using material properties and board structure of embedded passive boards. The drop simulation was conducted according to the JEDEC standard. It was revealed that the crack starting point related to failure fracture changed due to intermetallic phase transformation along the via interface, and the position where failure occurs experimentally agrees well with our simulation results.

  2. Crossmodal correspondences in product packaging. Assessing color-flavor correspondences for potato chips (crisps).

    Science.gov (United States)

    Piqueras-Fiszman, Betina; Spence, Charles

    2011-12-01

    We report a study designed to investigate consumers' crossmodal associations between the color of packaging and flavor varieties in crisps (potato chips). This product category was chosen because of the long-established but conflicting color-flavor conventions that exist for the salt and vinegar and cheese and onion flavor varieties in the UK. The use of both implicit and explicit measures of this crossmodal association revealed that consumers responded more slowly, and made more errors, when they had to pair the color and flavor that they implicitly thought of as being "incongruent" with the same response key. Furthermore, clustering consumers by the brand that they normally purchased revealed that the main reason why this pattern of results was observed could be their differing acquaintance with one brand versus another. In addition, when participants tried the two types of crisps from "congruently" and "incongruently" colored packets, some were unable to guess the flavor correctly in the latter case. These strong crossmodal associations did not have a significant effect on participants' hedonic appraisal of the crisps, but did arouse confusion. These results are relevant in terms of R&D, since ascertaining the appropriate color of the packaging across flavor varieties ought normally to help achieve immediate product recognition and consumer satisfaction. Copyright © 2011 Elsevier Ltd. All rights reserved.

  3. An ultra-small, low-power, all-optical flip-flop memory on a silicon chip

    DEFF Research Database (Denmark)

    Liu, Liu; Kumar, R.; Huybrechts, K.

    2010-01-01

    Ultra-small, low-power, all-optical switching and memory elements, such as all-optical flip-flops, as well as photonic integrated circuits of many such elements, are in great demand for all-optical signal buffering, switching and processing. Silicon-on-insulator is considered to be a promising......-flop working in a continuous-wave regime with an electrical power consumption of a few milliwatts, allowing switching in 60 ps with 1.8 fJ optical energy. The total power consumption and the device size are, to the best of our knowledge, the smallest reported to date at telecom wavelengths. This is also...

  4. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  5. Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

    Science.gov (United States)

    Vásquez Quintero, Andrés; Briand, Danick; de Rooij, Nico F.

    2015-04-01

    In this paper, a low temperature flip-chip integration technique for Si bare dies is demonstrated on flexible PET substrates with screen-printed circuits. The proposed technique is based on patterned blind vias in dry film photoresist (DP) filled with isotropic conductive adhesive (ICA). The DP material serves to define the vias, to confine the ICA paste (80 µm-wide and potentially 25 µm-wide vias), as an adhesion layer to improve the mechanical robustness of the assembly, and to protect additional circuitry on the substrate. The technique is demonstrated using gold-bumped daisy chain chips (DCCs), with electrical vias resistances in the order to hundreds of milliohms, and peel/shear adhesion strengths of 0.7 N mm-1 and 3.2 MPa, respectively, (i.e. at 1.2 MPa of bonding pressure). Finally, the mechanical robustness to bending forces was optimized through flexural mechanics models by placing the neutral plane at the DCC/DP adhesive interface. The optimization was performed by reducing the Si thickness from 400 to 37 µm, and resulted in highly robust integrated assemblies withstanding 10 000 cycles of dynamic bending at 40 mm of radius, with relative changes in vias resistance lower than 20%. In addition, the electrical vias resistance and adhesion strengths were compared to samples integrated with anisotropic conductive adhesives (ACAs). Besides the low temperature and high integration resolution, the proposed method is compatible with large area fabrication and multilayer architectures on foil.

  6. Numerical analysis of light extraction enhancement of GaN-based thin-film flip-chip light-emitting diodes with high-refractive-index buckling nanostructures

    Science.gov (United States)

    Yue, Qing-Yang; Yang, Yang; Cheng, Zhen-Jia; Guo, Cheng-Shan

    2018-06-01

    In this work, the light extraction efficiency enhancement of GaN-based thin-film flip-chip (TFFC) light-emitting diodes (LEDs) with high-refractive-index (TiO2) buckling nanostructures was studied using the three-dimensional finite difference time domain method. Compared with 2-D photonic crystals, the buckling structures have the advantages of a random directionality and a broad distribution in periodicity, which can effectively extract the guided light propagating in all azimuthal directions over a wide spectrum. Numerical studies revealed that the light extraction efficiency of buckling-structured LEDs reaches 1.1 times that of triangular lattice photonic crystals. The effects of the buckling structure feature sizes and the thickness of the N-GaN layer on the light extraction efficiency for TFFC LEDs were also investigated systematically. With optimized structural parameters, a significant light extraction enhancement of about 2.6 times was achieved for TiO2 buckling-structured TFFC LEDs compared with planar LEDs.

  7. Performance Improvement of GaN-Based Flip-Chip White Light-Emitting Diodes with Diffused Nanorod Reflector and with ZnO Nanorod Antireflection Layer

    Directory of Open Access Journals (Sweden)

    Hsin-Ying Lee

    2014-01-01

    Full Text Available The GaN-based flip-chip white light-emitting diodes (FCWLEDs with diffused ZnO nanorod reflector and with ZnO nanorod antireflection layer were fabricated. The ZnO nanorod array grown using an aqueous solution method was combined with Al metal to form the diffused ZnO nanorod reflector. It could avoid the blue light emitted out from the Mg-doped GaN layer of the FCWLEDs, which caused more blue light emitted out from the sapphire substrate to pump the phosphor. Moreover, the ZnO nanorod array was utilized as the antireflection layer of the FCWLEDs to reduce the total reflection loss. The light output power and the phosphor conversion efficiency of the FCWLEDs with diffused nanorod reflector and 250 nm long ZnO nanorod antireflection layer were improved from 21.15 mW to 23.90 mW and from 77.6% to 80.1% in comparison with the FCWLEDs with diffused nanorod reflector and without ZnO nanorod antireflection layer, respectively.

  8. Nutrition labelling, marketing techniques, nutrition claims and health claims on chip and biscuit packages from sixteen countries.

    Science.gov (United States)

    Mayhew, Alexandra J; Lock, Karen; Kelishadi, Roya; Swaminathan, Sumathi; Marcilio, Claudia S; Iqbal, Romaina; Dehghan, Mahshid; Yusuf, Salim; Chow, Clara K

    2016-04-01

    Food packages were objectively assessed to explore differences in nutrition labelling, selected promotional marketing techniques and health and nutrition claims between countries, in comparison to national regulations. Cross-sectional. Chip and sweet biscuit packages were collected from sixteen countries at different levels of economic development in the EPOCH (Environmental Profile of a Community's Health) study between 2008 and 2010. Seven hundred and thirty-seven food packages were systematically evaluated for nutrition labelling, selected promotional marketing techniques relevant to nutrition and health, and health and nutrition claims. We compared pack labelling in countries with labelling regulations, with voluntary regulations and no regulations. Overall 86 % of the packages had nutrition labels, 30 % had health or nutrition claims and 87 % displayed selected marketing techniques. On average, each package displayed two marketing techniques and one health or nutrition claim. In countries with mandatory nutrition labelling a greater proportion of packages displayed nutrition labels, had more of the seven required nutrients present, more total nutrients listed and higher readability compared with those with voluntary or no regulations. Countries with no health or nutrition claim regulations had fewer claims per package compared with countries with regulations. Nutrition label regulations were associated with increased prevalence and quality of nutrition labels. Health and nutrition claim regulations were unexpectedly associated with increased use of claims, suggesting that current regulations may not have the desired effect of protecting consumers. Of concern, lack of regulation was associated with increased promotional marketing techniques directed at children and misleadingly promoting broad concepts of health.

  9. Flipped Learning

    DEFF Research Database (Denmark)

    Holmboe, Peter; Hachmann, Roland

    I FLIPPED LEARNING – FLIP MED VIDEO kan du læse om, hvordan du som underviser kommer godt i gang med at implementere video i undervisning, der har afsæt i tankerne omkring flipped learning. Bogen indeholder fire dele: I Del 1 fokuserer vi på det metarefleksive i at tænke video ind i undervisningen...

  10. Integrated microsystems packaging approach with LCP

    Science.gov (United States)

    Jaynes, Paul; Shacklette, Lawrence W.

    2006-05-01

    Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

  11. Light-extraction enhancement of GaN-based 395  nm flip-chip light-emitting diodes by an Al-doped ITO transparent conductive electrode.

    Science.gov (United States)

    Xu, Jin; Zhang, Wei; Peng, Meng; Dai, Jiangnan; Chen, Changqing

    2018-06-01

    The distinct ultraviolet (UV) light absorption of indium tin oxide (ITO) limits the performance of GaN-based near-UV light-emitting diodes (LEDs). Herein, we report an Al-doped ITO with enhanced UV transmittance and low sheet resistance as the transparent conductive electrode for GaN-based 395 nm flip-chip near-UV LEDs. The thickness dependence of optical and electrical properties of Al-doped ITO films is investigated. The optimal Al-doped ITO film exhibited a transmittance of 93.2% at 395 nm and an average sheet resistance of 30.1  Ω/sq. Meanwhile, at an injection current of 300 mA, the forward voltage decreased from 3.14 to 3.11 V, and the light output power increased by 13% for the 395 nm near-UV flip-chip LEDs with the optimal Al-doped ITO over those with pure ITO. This Letter provides a simple and repeatable approach to further improve the light extraction efficiency of GaN-based near-UV LEDs.

  12. Embeded photonic crystal at the interface of p-GaN and Ag reflector to improve light extraction of GaN-based flip-chip light-emitting diode

    International Nuclear Information System (INIS)

    Zhen, Aigong; Ma, Ping; Zhang, Yonghui; Guo, Enqing; Tian, Yingdong; Liu, Boting; Guo, Shikuan; Shan, Liang; Wang, Junxi; Li, Jinmin

    2014-01-01

    In this experiment, a flip-chip light-emitting diode with photonic crystal was fabricated at the interface of p-GaN and Ag reflector via nanospheres lithography technique. In this structure, photonic crystal could couple with the guide-light efficiently by reason of the little distance between photonic crystal and active region. The light output power of light emitting diode with embedded photonic crystal was 1.42 times larger than that of planar flip-chip light-emitting diode. Moreover, the embedded photonic crystal structure makes the far-field divergence angle decreased by 18° without spectra shift. The three-dimensional finite difference time domain simulation results show that photonic crystal could improve the light extraction, and enhance the light absorption caused by Ag reflector simultaneously, because of the roughed surface. The depth of photonic crystal is the key parameter affecting the light extraction and absorption. Light extraction efficiency increases with the depth photonic crystal structure rapidly, and reaches the maximum at the depth 80 nm, beyond which light extraction decrease drastically

  13. Flipping Excel

    Science.gov (United States)

    Frydenberg, Mark

    2013-01-01

    The "flipped classroom" model has become increasingly popular in recent years as faculty try new ways to engage students in the classroom. In a flipped classroom setting, students review the lecture online prior to the class session and spend time in class working on problems or exercises that would have been traditionally assigned as…

  14. Flipped Learning

    DEFF Research Database (Denmark)

    Hachmann, Roland; Holmboe, Peter

    arbejde med faglige problemstillinger gennem problembaserede og undersøgende didaktiske designs. Flipped Learning er dermed andet og mere end at distribuere digitale materialer til eleverne forud for undervisning. Flipped Learning er i lige så høj grad et syn på, hvordan undervisning med digitale medier...

  15. Flipped classroom

    DEFF Research Database (Denmark)

    Skov, Tobias Kidde; Jørgensen, Søren

    2016-01-01

    Artiklen beskriver Flipped Classroom som et didaktisk princip, der kan være med til at organisere og tilrettelægge en undervisning, med fokus på forskellige læringsformer. Det handler om at forstå Flipped Classroom som en opdeling i 2 faser og 3 led, som samlet set skaber en didaktisk organisering....

  16. Study on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System

    Directory of Open Access Journals (Sweden)

    Kailin Pan

    2014-10-01

    Full Text Available Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging heat dissipation system, three kinds of thermal resistance calculation method including theoretical calculation, experimental testing and finite element simulation are developed respectively. Firstly, based on the thermal resistance network model and the principle of steady state heat transfer, the theoretical value of total thermal resistance is 6.111 K/W through sum of the thermal resistance of every material layer in the major direction of heat flow. Secondly, the thermal resistance experiment is carried out by T3Ster to obtain the experimental result of total thermal resistance, and the value is 6.729 K/W. Thirdly, a three-dimensional finite element model of MCM-LED packaging heat dissipation system is established, and the junction temperature experiment is also performed to calculated the finite element simulated result of total thermal resistance, the value is 6.99 K/W. Finally, by comparing the error of all the three kinds of result, the error of total thermal resistance between the theoretical value and experimental result is 9.2 %, and the error of total thermal resistance between the experimental result and finite element simulation is only about -3.9 %, meanwhile, the main reason of each error is discussed respectively.

  17. Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

    Directory of Open Access Journals (Sweden)

    Chang-Chun Lee

    2015-08-01

    Full Text Available three-dimensional integrated circuit (3D-IC structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their surrounding wafer level underfill (WLUF. The mechanical properties of this equivalent material, including Young’s modulus (E, Poisson’s ratio, shear modulus, and coefficient of thermal expansion (CTE, are directly obtained by applying either a tensile load or a constant displacement, and by increasing the temperature during simulations, respectively. Analytic results indicate that at least eight microbumps at the outermost region of the chip stacking structure need to be considered as an accurate stress/strain contour in the concerned region. In addition, a factorial experimental design with analysis of variance is proposed to optimize chip stacking structure reliability with four factors: chip thickness, substrate thickness, CTE, and E-value. Analytic results show that the most significant factor is CTE of WLUF. This factor affects microbump reliability and structural warpage under a temperature cycling load and high-temperature bonding process. WLUF with low CTE and high E-value are recommended to enhance the assembly reliability of the 3D-IC architecture.

  18. Package

    Directory of Open Access Journals (Sweden)

    Arsić Zoran

    2013-01-01

    Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

  19. Long-Term Stability of NIST Chip-Scale Atomic Clock Physics Packages

    Science.gov (United States)

    2007-01-01

    vacuum packaging), as has been demonstrated by Lutwak et al. [3]. Nevertheless, we tried to investigate the causes for the frequency shifts of...stability,” Optics Express, 13, 1249-1253. [3] R. Lutwak , J. Deng, W. Riley, M. Varghese, J. Leblanc, G. Tepolt, M. Mescher, D. K. Serkland, K. M. Geib...the 1st Annual Multiconference on Electronics and Photonics, 7-11 November 2006, Guanajuato, Mexico, in press. [6] R. Lutwak , P. Vlitas, M

  20. Wafer-level chip-scale packaging analog and power semiconductor applications

    CERN Document Server

    Qu, Shichun

    2015-01-01

    This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

  1. Photonic packaging sourcebook fiber-chip coupling for optical components, basic calculations, modules

    CERN Document Server

    Fischer-Hirchert, Ulrich H P

    2015-01-01

    This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

  2. Ultra-thin silicon (UTSi) on insulator CMOS transceiver and time-division multiplexed switch chips for smart pixel integration

    Science.gov (United States)

    Zhang, Liping; Sawchuk, Alexander A.

    2001-12-01

    We describe the design, fabrication and functionality of two different 0.5 micron CMOS optoelectronic integrated circuit (OEIC) chips based on the Peregrine Semiconductor Ultra-Thin Silicon on insulator technology. The Peregrine UTSi silicon- on-sapphire (SOS) technology is a member of the silicon-on- insulator (SOI) family. The low-loss synthetic sapphire substrate is optically transparent and has good thermal conductivity and coefficient of thermal expansion properties, which meet the requirements for flip-chip bonding of VCSELs and other optoelectronic input-output components. One chip contains transceiver and network components, including four channel high-speed CMOS transceiver modules, pseudo-random bit stream (PRBS) generators, a voltage controlled oscillator (VCO) and other test circuits. The transceiver chips can operate in both self-testing mode and networking mode. An on- chip clock and true-single-phase-clock (TSPC) D-flip-flop have been designed to generate a PRBS at over 2.5 Gb/s for the high-speed transceiver arrays to operate in self-testing mode. In the networking mode, an even number of transceiver chips forms a ring network through free-space or fiber ribbon interconnections. The second chip contains four channel optical time-division multiplex (TDM) switches, optical transceiver arrays, an active pixel detector and additional test devices. The eventual applications of these chips will require monolithic OEICs with integrated optical input and output. After fabrication and testing, the CMOS transceiver array dies will be packaged with 850 nm vertical cavity surface emitting lasers (VCSELs), and metal-semiconductor- metal (MSM) or GaAs p-i-n detector die arrays to achieve high- speed optical interconnections. The hybrid technique could be either wire bonding or flip-chip bonding of the CMOS SOS smart-pixel arrays with arrays of VCSELs and photodetectors onto an optoelectronic chip carrier as a multi-chip module (MCM).

  3. Warpage behavior analysis in package processes of embedded copper substrates

    Directory of Open Access Journals (Sweden)

    Hwang Yeong-Maw

    2017-01-01

    Full Text Available With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packaging technology, especially for substrates with embedded copper trace. During the packaging process, the substrate usually warps because of the heating process. In this paper, a finite element software ANSYS is used to model the embedded copper trace substrate and simulate the thermal and deformation behaviors of the substrate during the heating package process. A fixed geometric configuration equivalent to the real structure is duplicated to make the simulation of the warpage behavior of the substrate feasible. An empirical formula for predicting the warpage displacements is also established.

  4. GaN-on-Si blue/white LEDs: epitaxy, chip, and package

    Science.gov (United States)

    Qian, Sun; Wei, Yan; Meixin, Feng; Zengcheng, Li; Bo, Feng; Hanmin, Zhao; Hui, Yang

    2016-04-01

    The dream of epitaxially integrating III-nitride semiconductors on large diameter silicon is being fulfilled through the joint R&D efforts of academia and industry, which is driven by the great potential of GaN-on-silicon technology in improving the efficiency yet at a much reduced manufacturing cost for solid state lighting and power electronics. It is very challenging to grow high quality GaN on Si substrates because of the huge mismatch in the coefficient of thermal expansion (CTE) and the large mismatch in lattice constant between GaN and silicon, often causing a micro-crack network and a high density of threading dislocations (TDs) in the GaN film. Al-composition graded AlGaN/AlN buffer layers have been utilized to not only build up a compressive strain during the high temperature growth for compensating the tensile stress generated during the cool down, but also filter out the TDs to achieve crack-free high-quality n-GaN film on Si substrates, with an X-ray rocking curve linewidth below 300 arcsec for both (0002) and (101¯2) diffractions. Upon the GaN-on-Si templates, prior to the deposition of p-AlGaN and p-GaN layers, high quality InGaN/GaN multiple quantum wells (MQWs) are overgrown with well-engineered V-defects intentionally incorporated to shield the TDs as non-radiative recombination centers and to enhance the hole injection into the MQWs through the via-like structures. The as-grown GaN-on-Si LED wafers are processed into vertical structure thin film LED chips with a reflective p-electrode and the N-face surface roughened after the removal of the epitaxial Si(111) substrates, to enhance the light extraction efficiency. We have commercialized GaN-on-Si LEDs with an average efficacy of 150-160 lm/W for 1mm2 LED chips at an injection current of 350 mA, which have passed the 10000-h LM80 reliability test. The as-produced GaN-on-Si LEDs featured with a single-side uniform emission and a nearly Lambertian distribution can adopt the wafer-level phosphor

  5. Flipped Physics

    Science.gov (United States)

    Kettle, Maria

    2013-01-01

    This paper defines flipped learning and then examines its practical implementation in AS and A2 level physics classes, that is, classes for 16-18 year olds. The effect of this teaching style on student learning behaviour and its impact on test results are evaluated. The paper recounts the difficulties of implementing it and evaluates student…

  6. Flipping qubits

    International Nuclear Information System (INIS)

    Martini De, F.; Sciarrino, F.; Sias, C.; Buzek, V.

    2003-01-01

    On a classical level the information can be represented by bits, each of which can be either 0 or 1. Quantum information, on the other hand, consists of qubits which can be represented as two-level quantum systems with one level labeled |0> and the other |1>. Unlike bits, qubits cannot only be in one of the two levels, but in any superposition of them as well. This superposition principle makes quantum information fundamentally different from its classical counterpart. One of the most striking difference between the classical and quantum information is as follows: it is not a problem to flip a classical bit, i.e., to change the value of a bit, a 0 to a 1 and vice versa. This is accomplished by a NOT gate. Flipping a qubit, however, is another matter: there exists the fundamental bound which prohibits to flip a qubit prepared in an arbitrary state |Ψ>=α|0> and to obtain the state |Ψ T >=β*|0>-α*|1> which is orthogonal to it, i.e., T |Ψ>=0. We experimentally realize the best possible approximation of the qubit flipping that achieves bounds imposed by complete positivity of quantum mechanics

  7. Flipped physics

    International Nuclear Information System (INIS)

    Nanopoulos, D.V.

    1991-01-01

    This paper is a revamp of a flipped SU(5) x U(1) model derived from the heterotic superstring. The author assumes that the reader is familiar with the general structure of the flipped SU(5) x U(1) model, either in its (pointlike) field theory form, or its stringy derivation. Ideally, one would like to derive directly from the superstring the standard model SU(3) x SU(2) x U(1), without possibly any extra structure (gauge or particle content). Well, this has been proven to be very difficult. Until now, always the standard model is accompanied with extra structure and usually one needs the ordinary Higgs mechanism to get rid of unwanted forms. This may happen at a superhigh energy scale (close to M Planck ) or at intermediate seals (10 13 --10 15 GeV). But if so, our original motivation of deriving directly the standard model from the superstring has been dispersed

  8. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method.

    Science.gov (United States)

    Qian, Cheng; Fan, Jiajie; Fang, Jiayi; Yu, Chaohua; Ren, Yi; Fan, Xuejun; Zhang, Guoqi

    2017-10-16

    By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample's rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs.

  9. A New Test Device for Characterization of Mechanical Stress Caused by Packaging Processes

    International Nuclear Information System (INIS)

    Hirsch, Soeren; Doerner, Steffen; Hauptmann, Peter; Schmidt, Bertram

    2006-01-01

    This paper reports on a new method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon membranes was fabricated. A network of piezo-resistive solid state resistors created by diffusion was used to measure the surface tension pattern between adjacent membranes. Finite element method simulation was used to calculate the stress profile and to determine the optimum positions for placing the resistive network

  10. Miniature stick-packaging--an industrial technology for pre-storage and release of reagents in lab-on-a-chip systems.

    Science.gov (United States)

    van Oordt, Thomas; Barb, Yannick; Smetana, Jan; Zengerle, Roland; von Stetten, Felix

    2013-08-07

    Stick-packaging of goods in tubular-shaped composite-foil pouches has become a popular technology for food and drug packaging. We miniaturized stick-packaging for use in lab-on-a-chip (LOAC) systems to pre-store and on-demand release the liquid and dry reagents in a volume range of 80-500 μl. An integrated frangible seal enables the pressure-controlled release of reagents and simplifies the layout of LOAC systems, thereby making the package a functional microfluidic release unit. The frangible seal is adjusted to defined burst pressures ranging from 20 to 140 kPa. The applied ultrasonic welding process allows the packaging of temperature sensitive reagents. Stick-packs have been successfully tested applying recovery tests (where 99% (STDV = 1%) of 250 μl pre-stored liquid is released), long-term storage tests (where there is loss of only <0.5% for simulated 2 years) and air transport simulation tests. The developed technology enables the storage of a combination of liquid and dry reagents. It is a scalable technology suitable for rapid prototyping and low-cost mass production.

  11. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method

    Science.gov (United States)

    Yu, Chaohua; Fan, Xuejun; Zhang, Guoqi

    2017-01-01

    By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample’s rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs. PMID:29035300

  12. Characterization of hybrid integrated all-optical flip-flop

    NARCIS (Netherlands)

    Liu, Y.; McDougall, R.; Seoane, J.; Kehayas, E.; Hill, M.T.; Maxwell, G.D.; Zhang, S.; Harmon, R.; Huijskens, Frans; Rivers, L.; Van Holm-Nielsen, P.; Martinez, J.M.; Herrera Llorente, J.; Ramos, F.; Marti, J.; Avramopoulos, H.; Jeppesen, P.; Koonen, A.M.J.; Poustie, A.; Dorren, H.J.S.

    2006-01-01

    We present a fully-packaged, hybrid-integrated all-optical flip-flop with separate optical set and reset operation. The flip-flop can control a wavelength converter to route 40 Gb/s data packets all-optically. The experimental results are given

  13. Characterisation of hybrid integrated all-optical flip-flop

    DEFF Research Database (Denmark)

    Liu, Y.; McDougall, R.; Seoane, Jorge

    2006-01-01

    We present a fully-packaged, hybrid-integrated all-optical flip-flop with separate optical set and reset operation. The flip-flop can control a wavelength converter to route 40 Gb/s data packets all-optically. The experimental results are given....

  14. Flipping HCI

    Directory of Open Access Journals (Sweden)

    C. Evans

    2016-08-01

    Full Text Available This paper presents the results of two studies involving “flipping the classroom”. Teaching material was delivered via interactive “e-lectures”, allowing face-to-face sessions to focus instead on practice. The e-lectures were designed according to standard usability principles coupled with recent research into the effect of interactivity on learning. The effectiveness of the use of e-lectures was then evaluated using an online survey. The results suggest that students prefer the flexibility offered by e-lectures compared to conventional lectures. The results contribute to our understanding of how this technology fits with face-to-face teaching in the digital age.

  15. All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform

    Science.gov (United States)

    Pitris, St.; Vagionas, Ch.; Kanellos, G. T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.

    2016-03-01

    At the dawning of the exaflop era, High Performance Computers are foreseen to exploit integrated all-optical elements, to overcome the speed limitations imposed by electronic counterparts. Drawing from the well-known Memory Wall limitation, imposing a performance gap between processor and memory speeds, research has focused on developing ultra-fast latching devices and all-optical memory elements capable of delivering buffering and switching functionalities at unprecedented bit-rates. Following the master-slave configuration of electronic Flip-Flops, coupled SOA-MZI based switches have been theoretically investigated to exceed 40 Gb/s operation, provided a short coupling waveguide. However, this flip-flop architecture has been only hybridly integrated with silica-on-silicon integration technology exhibiting a total footprint of 45x12 mm2 and intra-Flip-Flop coupling waveguide of 2.5cm, limited at 5 Gb/s operation. Monolithic integration offers the possibility to fabricate multiple active and passive photonic components on a single chip at a close proximity towards, bearing promises for fast all-optical memories. Here, we present for the first time a monolithically integrated all-optical SR Flip-Flop with coupled master-slave SOA-MZI switches. The photonic chip is integrated on a 6x2 mm2 die as a part of a multi-project wafer run using library based components of a generic InP platform, fiber-pigtailed and fully packaged on a temperature controlled ceramic submount module with electrical contacts. The intra Flip-Flop coupling waveguide is 5 mm long, reducing the total footprint by two orders of magnitude. Successful flip flop functionality is evaluated at 10 Gb/s with clear open eye diagram, achieving error free operation with a power penalty of 4dB.

  16. Numerical and experimental investigation of GaN-based flip-chip light-emitting diodes with highly reflective Ag/TiW and ITO/DBR Ohmic contacts.

    Science.gov (United States)

    Zhou, Shengjun; Liu, Xingtong; Gao, Yilin; Liu, Yingce; Liu, Mengling; Liu, Zongyuan; Gui, Chengqun; Liu, Sheng

    2017-10-30

    We demonstrate two types of GaN-based flip-chip light-emitting diodes (FCLEDs) with highly reflective Ag/TiW and indium-tin oxide (ITO)/distributed Bragg reflector (DBR) p-type Ohmic contacts. We show that a direct Ohmic contact to p-GaN layer using pure Ag is obtained when annealed at 600°C in N 2 ambient. A TiW diffusion barrier layer covered onto Ag is used to suppress the agglomeration of Ag and thus maintain high reflectance of Ag during high temperature annealing process. We develop a strip-shaped SiO 2 current blocking layer beneath the ITO/DBR to alleviate current crowding occurring in FCLED with ITO/DBR. Owing to negligibly small spreading resistance of Ag, however, our combined numerical and experimental results show that the FCLED with Ag/TiW has a more favorable current spreading uniformity in comparison to the FCLED with ITO/DBR. As a result, the light output power of FCLED with Ag/TiW is 7.5% higher than that of FCLED with ITO/DBR at 350 mA. The maximum output power of the FCLED with Ag/TiW obtained at 305.6 A/cm 2 is 29.3% larger than that of the FCLED with ITO/DBR obtained at 278.9 A/cm 2 . The improvement appears to be due to the enhanced current spreading and higher optical reflectance provided by the Ag/TiW.

  17. Heat Transfer Characteristics in High Power LED Packaging

    Directory of Open Access Journals (Sweden)

    Chi-Hung Chung

    2014-03-01

    Full Text Available This study uses the T3Ster transient thermal resistance measuring device to investigate the effects to heat transfer performances from different LED crystal grains, packaging methods and heat-sink substrates through the experimental method. The experimental parameters are six different types of LED modules that are made alternatively with the crystal grain structure, the die attach method and the carrying substrate. The crystal grain structure includes the lateral type, flip chip type and vertical type. The die attach method includes silver paste and the eutectic structure. The carrying substrates are aluminum oxide (Alumina and aluminum nitride (AIN ceramic substrates and metal core PCB (MCPCB. The experimental results show that, under the conditions of the same crystal grain and die attach method, the thermal resistance values for the AIN substrate and the Alumina substrate are 2.1K/W and 5.1K/W, respectively and the total thermal resistance values are 7.3K/W and 10.8K/W. Compared to the Alumina substrate, the AIN substrate can effectively lower the total thermal resistance value by 32.4%. This is because the heat transfer coefficient of the AIN substrate is higher than that of the Alumina substrate, thus effectively increasing its thermal conductivity. In addition, under the conditions of the same crystal grain and the same substrate, the packaging methods are using silver paste and the eutectic structure for die attach. Their thermal resistance values are 5.7K/W and 2.7K/W, respectively, with a variance of 3K/W. Comparisons of the crystal grain structure show that the thermal resistance for the flip chip type is lower than that of the traditional lateral type by 0.9K/W. This is because the light emitting layer of the flip chip crystal grain is closer to the heat-sink substrate, shortening the heat dissipation route, and thus lowering the thermal resistance value. For the total thermal resistance, the crystal grain structure has a lesser

  18. Fundamental study of microelectronic chip response under laser ultrasonic-interferometric inspection using C-scan method

    Science.gov (United States)

    Yang, Lei; Gong, Jie; Ume, I. Charles

    2014-02-01

    In modern surface mount packaging technologies, such as flip chips, chip scale packages, and ball grid arrays(BGA), chips are attached to the substrates/printed wiring board (PWB) using solder bump interconnections. The quality of solder bumps between the chips and the substrate/board is difficult to inspect. Laser ultrasonic-interferometric technique was proved to be a promising approach for solder bump inspection because of its noncontact and nondestructive characteristics. Different indicators extracted from received signals have been used to predict the potential defects, such as correlation coefficient, error ratio, frequency shifting, etc. However, the fundamental understanding of the chip behavior under laser ultrasonic inspection is still missing. Specifically, it is not sure whether the laser interferometer detected out-of-plane displacements were due to wave propagation or structural vibration when the chip was excited by pulsed laser. Plus, it is found that the received signals are chip dependent. Both challenges impede the interpretation of acquired signals. In this paper, a C-scan method was proposed to study the underlying phenomenon during laser ultrasonic inspection. The full chip was inspected. The response of the chip under laser excitation was visualized in a movie resulted from acquired signals. Specifically, a BGA chip was investigated to demonstrate the effectiveness of this method. By characterizing signals using discrete wavelet transform(DWT), both ultrasonic wave propagation and vibration were observed. Separation of them was successfully achieved using ideal band-pass filter and visualized in resultant movies, too. The observed ultrasonic waves were characterized and their respective speeds were measured by applying 2-D FFT. The C-scan method, combined with different digital signal processing techniques, was proved to be an very effective methodology to learn the behavior of chips under laser excitation. This general procedure can be

  19. The extended Beer-Lambert theory for ray tracing modeling of LED chip-scaled packaging application with multiple luminescence materials

    Science.gov (United States)

    Yuan, Cadmus C. A.

    2015-12-01

    Optical ray tracing modeling applied Beer-Lambert method in the single luminescence material system to model the white light pattern from blue LED light source. This paper extends such algorithm to a mixed multiple luminescence material system by introducing the equivalent excitation and emission spectrum of individual luminescence materials. The quantum efficiency numbers of individual material and self-absorption of the multiple luminescence material system are considered as well. By this combination, researchers are able to model the luminescence characteristics of LED chip-scaled packaging (CSP), which provides simple process steps and the freedom of the luminescence material geometrical dimension. The method will be first validated by the experimental results. Afterward, a further parametric investigation has been then conducted.

  20. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

    Directory of Open Access Journals (Sweden)

    Kenji Okabe

    2015-12-01

    Full Text Available In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI chip on the very thin parylene film (5 μm enables the integration of the rectifier circuits and the flexible antenna (rectenna. In the demonstration of wireless power transmission (WPT, the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

  1. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.

    Science.gov (United States)

    Okabe, Kenji; Jeewan, Horagodage Prabhath; Yamagiwa, Shota; Kawano, Takeshi; Ishida, Makoto; Akita, Ippei

    2015-12-16

    In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

  2. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    Science.gov (United States)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  3. DomFLIP++

    International Nuclear Information System (INIS)

    Hendrysiak, W.; Raggl, A.; Slany, W.

    1996-01-01

    DomFLIP++ is the knowledge engineering module of the *FLIP++ project. *FLIP++ is a tool for optimizing multiple criteria problems. It uses fuzzy constraints to model optimizing criteria and applies algorithms such as Tabu search or genetic algorithms to the problems. DomFLIP++ is a C++ library. It allows the definition of new optimization problems. It helps a domain engineer to design the structure of a new problem. However, there is a domain independent interface to other *FLIP++ modules such as OptiFLIP++, DynaFLIP++, and InterFLIP++. After each iteration in the optimization process, the considered instantiations of the problem are evaluated. Each evaluation produces a list of violated constraints. For each constraint in further iterations of the optimization. A domain can be fine-tuned through modifications of constraints, through editing their repair lists, and through change in the optimizing parameters. A well-tuned domain can be successfully applied for optimization. Object-oriented design and implementation makes this module easy to modify and to reuse. Definition of new domains, system extensions with new optimizing algorithms, and definition of specific domain-dependent repair steps can be done efficiently. DomFLIP++ is tested on real-world example, namely scheduling the steel plant LD3 in Linz, Austria

  4. The flipped classroom

    DEFF Research Database (Denmark)

    Triantafyllou, Evangelia

    2015-01-01

    One of the novel ideas in teaching that heavily relies on current technology is the “flipped classroom” approach. In a flipped classroom the traditional lecture and homework sessions are inverted. Students are provided with online material in order to gain necessary knowledge before class, while...... class time is devoted to clarifications and application of this knowledge. The hypothesis is that there could be deep and creative discussions when teacher and students physically meet. This paper presents design considerations for flipped classrooms, and discusses how Moodle can facilitate...... with a discussion of the opportunities and challenges when implementing the flipped model in a virtual learning environment (VLE) like Moodle....

  5. Flipped Classroom Approach

    Directory of Open Access Journals (Sweden)

    Fezile Ozdamli

    2016-07-01

    Full Text Available Flipped classroom is an active, student-centered approach that was formed to increase the quality of period within class. Generally this approach whose applications are done mostly in Physical Sciences, also attracts the attention of educators and researchers in different disciplines recently. Flipped classroom learning which wide-spreads rapidly in the world, is not well recognized in our country. That is why the aim of study is to attract attention to its potential in education field and provide to make it recognize more by educators and researchers. With this aim, in the study what flipped classroom approach is, flipped classroom technology models, its advantages and limitations were explained.

  6. Flipped Classroom, active Learning?

    DEFF Research Database (Denmark)

    Andersen, Thomas Dyreborg; Levinsen, Henrik; Philipps, Morten

    2015-01-01

    Action research is conducted in three physics classes over a period of eighteen weeks with the aim of studying the effect of flipped classroom on the pupils agency and learning processes. The hypothesis is that flipped classroom teaching will potentially allocate more time to work actively...

  7. Flipped Classroom Approach

    Science.gov (United States)

    Ozdamli, Fezile; Asiksoy, Gulsum

    2016-01-01

    Flipped classroom is an active, student-centered approach that was formed to increase the quality of period within class. Generally this approach whose applications are done mostly in Physical Sciences, also attracts the attention of educators and researchers in different disciplines recently. Flipped classroom learning which wide-spreads rapidly…

  8. Flipping Freshman Mathematics

    Science.gov (United States)

    Zack, Laurie; Fuselier, Jenny; Graham-Squire, Adam; Lamb, Ron; O'Hara, Karen

    2015-01-01

    Our study compared a flipped class with a standard lecture class in four introductory courses: finite mathematics, precalculus, business calculus, and calculus 1. The flipped sections watched video lectures outside of class and spent time in class actively working on problems. The traditional sections had lectures in class and did homework outside…

  9. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  10. Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package

    International Nuclear Information System (INIS)

    Ikeda, Akihiro; Sakamoto, Atsushi; Hattori, Reiji; Kuroki, Yukinori

    2009-01-01

    Electroless Ni-B was plated on SiO 2 as a barrier layer against Cu diffusion for through-Si via (TSV) interconnections in a 3-dimensional multi-chip package. The electroless Ni-B was deposited on the entire area of the SiO 2 side wall of a deep via with vapor phase pre-deposition of 3-aminopropyl-triethoxysilane on the SiO 2 . The carrier lifetimes in the Si substrates plated with Ni-B/Cu did not decrease with an increase in annealing temperature up to 400 deg. C . The absence of degradation of carrier lifetimes indicates that Cu atoms did not diffuse into the Si through the Ni-B. The advantages of electroless Ni-B (good conformal deposition and forming an effective diffusion barrier against Cu) make it useful as a barrier layer for TSV interconnections in a 3-dimensional multi-chip package

  11. Flipped Learning in the Workplace

    Science.gov (United States)

    Nederveld, Allison; Berge, Zane L.

    2015-01-01

    Purpose: The purpose of this paper is to serve as a summary of resources on flipped learning for workplace learning professionals. A recent buzzword in the training world is "flipped". Flipped learning and the flipped classroom are hot topics that have emerged in K-12 education, made their way to the university and are now being noticed…

  12. Flip Video for Dummies

    CERN Document Server

    Hutsko, Joe

    2010-01-01

    The full-color guide to shooting great video with the Flip Video camera. The inexpensive Flip Video camera is currently one of the hottest must-have gadgets. It's portable and connects easily to any computer to transfer video you shoot onto your PC or Mac. Although the Flip Video camera comes with a quick-start guide, it lacks a how-to manual, and this full-color book fills that void! Packed with full-color screen shots throughout, Flip Video For Dummies shows you how to shoot the best possible footage in a variety of situations. You'll learn how to transfer video to your computer and then edi

  13. Flipped Classroom Approach

    OpenAIRE

    Fezile Ozdamli; Gulsum Asiksoy

    2016-01-01

    Flipped classroom is an active, student-centered approach that was formed to increase the quality of period within class. Generally this approach whose applications are done mostly in Physical Sciences, also attracts the attention of educators and researchers in different disciplines recently. Flipped classroom learning which wide-spreads rapidly in the world, is not well recognized in our country. That is why the aim of study is to attract attention to its potential in education field and pr...

  14. SU(5): to flip or not to flip

    International Nuclear Information System (INIS)

    Nanopoulos, D.V.; Wisconsin Univ., Madison,

    1988-01-01

    Flipped SU(5) possesses some unique features as a grand unified theory: elegant missing partner mechanism, see-saw neutrino masses, no Higgs adjoints. This last property makes flipped SU(5) the only known grand unified theory derivable from 4-dimensional superstrings. When derived from the superstrings, flipped SU(5) possesses, in addition a hierarchical fermion mass spectrum. All these recent developments involving flipped SU(5) are discussed in a detailed but simple way, including phenomenological consequences at low energies

  15. Student Perceptions of a Flipped Pharmacotherapy Course

    Science.gov (United States)

    Khanova, Julia; McLaughlin, Jacqueline E.; Rhoney, Denise H.; Roth, Mary T.

    2015-01-01

    Objective. To evaluate student perception of the flipped classroom redesign of a required pharmacotherapy course. Design. Key foundational content was packaged into interactive, text-based online modules for self-paced learning prior to class. Class time was used for active and applied—but primarily case-based—learning. Assessment. For students with a strong preference for traditional lecture learning, the perception of the learning experience was negatively affected by the flipped course design. Module length and time required to complete preclass preparation were the most frequently cited impediments to learning. Students desired instructor-directed reinforcement of independently acquired knowledge to connect foundational knowledge and its application. Conclusion. This study illustrates the challenges and highlights the importance of designing courses to effectively balance time requirements and connect preclass and in-class learning activities. It underscores the crucial role of the instructor in bridging the gap between material learned as independent study and its application. PMID:26839429

  16. FLIPPED LEARNING: PRACTICAL ASPECTS

    Directory of Open Access Journals (Sweden)

    Olena Kuzminska

    2016-03-01

    Full Text Available The article is devoted to issues of implementation of the flipped learning technology in the practice of higher education institutions. The article defines the principles of technology and a model of the educational process, it notes the need to establish an information support system. The article defines online platforms and resources; it describes recommendations for the design of electronic training courses and organization of the students in the process of implementing the proposed model, as well as tools for assessing its effectiveness. The article provides a description of flipped learning implementation scenario and formulates suggestions regarding the use of this model as a mechanism to improve the efficiency of the learning process in the ICT-rich environment of high school: use of learning management systems (LMS and personal learning environments (PLE of participants in a learning process. The article provides an example of implementation of the flipped learning model as a part of the Information Technologies course in the National University of Life and Environmental Sciences of Ukraine (NULES. The article gives examples of tasks, resources and services, results of students’ research activity, as well as an example of the personal learning network, established in the course of implementation of the flipped learning model and elements of digital student portfolios. It presents the results of the monitoring of learning activities and students’ feedback. The author describes cautions against the mass introduction of the flipped learning model without monitoring of readiness of the participants of the educational process for its implementation

  17. The Flipped Journal Club.

    Science.gov (United States)

    Bounds, Richard; Boone, Stephen

    2018-01-01

    Educators struggle to develop a journal club format that promotes active participation from all levels of trainees. The explosion of social media compels residencies to incorporate the evaluation and application of these resources into evidence-based practice. We sought to design an innovative "flipped journal club" to achieve greater effectiveness in meeting goals and objectives among residents and faculty. Each journal club is focused on a specific clinical question based on a landmark article, a background article, and a podcast or blog post. With the "flipped" model, residents are assigned to prepare an in-depth discussion of one of these works based on their level of training. At journal club, trainees break into small groups and discuss their assigned readings with faculty facilitation. Following the small-group discussions, all participants convene to summarize key points. In redesigning our journal club, we sought to achieve specific educational outcomes, and improve participant engagement and overall impressions. Sixty-one residents at our emergency medicine program participated in the flipped journal club during the 2015-2016 academic year, with supervision by core faculty. Program evaluation for the flipped journal club was performed using an anonymous survey, with response rates of 70% and 56% for residents and faculty, respectively. Overall, 95% of resident respondents and 100% of faculty respondents preferred the flipped format. The "flipped journal club" hinges upon well-selected articles, incorporation of social media, and small-group discussions. This format engages all residents, holds learners accountable, and encourages greater participation among residents and faculty.

  18. Flipped SO(10) model

    Energy Technology Data Exchange (ETDEWEB)

    Maekawa, Nobuhiro; Yamashita, Toshifumi

    2003-08-14

    This Letter demonstrates that, as in flipped SU(5) models, doublet-triplet splitting is accomplished by a missing partner mechanism in flipped SO(10) models. The gauge group SO(10){sub F}xU(1){sub V'{sub F}} includes SU(2){sub E} gauge symmetry, which plays an important role in solving the supersymmetric (SUSY) flavor problem by introducing non-abelian horizontal gauge symmetry and anomalous U(1){sub A} gauge symmetry. The gauge group can be broken into the standard model gauge group by VEVs of only spinor fields; such models may be easier to derive than E{sub 6} models from superstring theory.

  19. Evaluation of flipped teaching

    OpenAIRE

    Henderson, K.; Hobbs, C.; Last, K.

    2017-01-01

    We report on our evaluation of flipping the classroom for two modules: a compulsory first year calculus module and an optional second year coding theory module taken by Mathe-matics students at the University of the West of England, Bristol (UWE). Flipped teaching is a change to the traditional lecture model used in universities for hundreds of years. In the traditional model the lecturer is in charge of the class and largely dictates the content and pace at which this is delivered. The idea ...

  20. Flipped SO(10)

    Energy Technology Data Exchange (ETDEWEB)

    Tamvakis, K.

    1988-01-28

    We construct an N=1 supersymmetric SO(10) GUT broken down to SU(3)c x SU(2)/sub L/ x U(1)/sub ..gamma../ with an intermediate flipped SU(5) x U(1)/sub chi/ gauge symmetry. A solution to the triplet-doublet mass-splitting problem is proposed in terms of a non-minimal missing-partner mechanism.

  1. Flipping the Classroom Revisited

    Science.gov (United States)

    Riendeau, Diane

    2013-02-01

    I received many emails following the first column on flipping the classroom. Many of my local colleagues also approached me at our physics alliance, Physics Northwest. Teachers are very interested in this new pedagogy. As I result, I wanted to share some more videos to inspire you.

  2. The Flipped Journal Club

    Directory of Open Access Journals (Sweden)

    Richard Bounds

    2017-12-01

    Full Text Available Introduction Educators struggle to develop a journal club format that promotes active participation from all levels of trainees. The explosion of social media compels residencies to incorporate the evaluation and application of these resources into evidence-based practice. We sought to design an innovative “flipped journal club” to achieve greater effectiveness in meeting goals and objectives among residents and faculty. Methods Each journal club is focused on a specific clinical question based on a landmark article, a background article, and a podcast or blog post. With the “flipped” model, residents are assigned to prepare an in-depth discussion of one of these works based on their level of training. At journal club, trainees break into small groups and discuss their assigned readings with faculty facilitation. Following the small-group discussions, all participants convene to summarize key points. In redesigning our journal club, we sought to achieve specific educational outcomes, and improve participant engagement and overall impressions. Results Sixty-one residents at our emergency medicine program participated in the flipped journal club during the 2015–2016 academic year, with supervision by core faculty. Program evaluation for the flipped journal club was performed using an anonymous survey, with response rates of 70% and 56% for residents and faculty, respectively. Overall, 95% of resident respondents and 100% of faculty respondents preferred the flipped format. Conclusion The “flipped journal club” hinges upon well-selected articles, incorporation of social media, and small-group discussions. This format engages all residents, holds learners accountable, and encourages greater participation among residents and faculty.

  3. Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

    Science.gov (United States)

    Beheim, Glenn M.

    2003-01-01

    The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

  4. FLIPPED LEARNING: PRACTICAL ASPECTS

    OpenAIRE

    Olena Kuzminska

    2016-01-01

    The article is devoted to issues of implementation of the flipped learning technology in the practice of higher education institutions. The article defines the principles of technology and a model of the educational process, it notes the need to establish an information support system. The article defines online platforms and resources; it describes recommendations for the design of electronic training courses and organization of the students in the process of implementing the proposed model,...

  5. The Flipped Journal Club

    OpenAIRE

    Bounds, Richard; Boone, Stephen

    2018-01-01

    Introduction: Educators struggle to develop a journal club format that promotes active participation from all levels of trainees. The explosion of social media compels residencies to incorporate the evaluation and application of these resources into evidence-based practice. We sought to design an innovative “flipped journal club” to achieve greater effectiveness in meeting goals and objectives among residents and faculty. Methods: Each journal club is focused o...

  6. Neural Implants, Packaging for Biocompatible Implants, and Improving Fabricated Capacitors

    Science.gov (United States)

    Agger, Elizabeth Rose

    We have completed the circuit design and packaging procedure for an NIH-funded neural implant, called a MOTE (Microscale Optoelectronically Transduced Electrode). Neural recording implants for mice have greatly advanced neuroscience, but they are often damaging and limited in their recording location. This project will result in free-floating implants that cause less damage, provide rapid electronic recording, and increase range of recording across the cortex. A low-power silicon IC containing amplification and digitization sub-circuits is powered by a dual-function gallium arsenide photovoltaic and LED. Through thin film deposition, photolithography, and chemical and physical etching, the Molnar Group and the McEuen Group (Applied and Engineering Physics department) will package the IC and LED into a biocompatible implant approximately 100microm3. The IC and LED are complete and we have begun refining this packaging procedure in the Cornell NanoScale Science & Technology Facility. ICs with 3D time-resolved imaging capabilities can image microorganisms and other biological samples given proper packaging. A portable, flat, easily manufactured package would enable scientists to place biological samples on slides directly above the Molnar group's imaging chip. We have developed a packaging procedure using laser cutting, photolithography, epoxies, and metal deposition. Using a flip-chip method, we verified the process by aligning and adhering a sample chip to a holder wafer. In the CNF, we have worked on a long-term metal-insulator-metal (MIM) capacitor characterization project. Former Fellow and continuing CNF user Kwame Amponsah developed the original procedure for the capacitor fabrication, and another former fellow, Jonilyn Longenecker, revised the procedure and began the arduous process of characterization. MIM caps are useful to clean room users as testing devices to verify electronic characteristics of their active circuitry. This project's objective is to

  7. Thermal analysis and improvement of cascode GaN device package for totem-pole bridgeless PFC rectifier

    International Nuclear Information System (INIS)

    She, Shuojie; Zhang, Wenli; Liu, Zhengyang; Lee, Fred C.; Huang, Xiucheng; Du, Weijing; Li, Qiang

    2015-01-01

    The totem-pole bridgeless power factor correction (PFC) rectifier has a simpler topology and higher efficiency than other boost-type bridgeless PFC rectifiers. Its promising performance is enabled by using high-voltage gallium nitride (GaN) high-electron-mobility transistors, which have considerably better figures of merit (e.g., lower reverse recovery charges and less switching losses) than the state-of-the-art silicon metal-oxide-semiconductor field-effect transistors. Cascode GaN devices in traditional packages, i.e., the TO-220 and power quad flat no-lead, are used in the totem-pole PFC boost rectifier. But the parasitic inductances induced by the traditional packages not only significantly deteriorate the switching characteristics of the discrete GaN device but also adversely affect the performance of the built PFC rectifier. A new stack-die packaging structure with an embedded capacitor has been introduced and proven to be efficient in reducing parasitic ringing at the turn-off transition and achieving true zero-voltage-switching turn-on. However, the thermal dissipation capability of the device packaged in this configuration becomes a limitation on further pushing the operating frequency and the output current level for high-efficiency power conversion. This paper focuses on the thermal analysis of the cascode GaN devices in different packages and the GaN-based multichip module used in a two-phase totem-pole bridgeless PFC boost rectifier. A series of thermal models are built based on the actual structures and materials of the packaged devices to evaluate their thermal performance. Finite element analysis (FEA) simulation results of the cascode GaN device in a flip-chip format demonstrate the possibility of increasing the device switching speed while maintaining the peak temperature of the device below 125 °C. Thermal analysis of the GaN-based power module in a very similar structure is also conducted using the FEA method. Experimental data measured using

  8. Flipped Learning, Flipped Satisfaction, Getting the Balance Right

    Science.gov (United States)

    Swinburne, Rosemary Fisher; Ross, Bella; LaFerriere, Richard; Maritz, Alex

    2017-01-01

    This paper explores students' perceptions of their learning outcomes, engagement, and satisfaction with a technology-facilitated flipped approach in a third-year core subject at an Australian university during 2014. In this pilot study, findings reveal that students preferred the flipped approach to the traditional face-to-face delivery and…

  9. Adventures in Flipping College Algebra

    Science.gov (United States)

    Van Sickle, Jenna

    2015-01-01

    This paper outlines the experience of a university professor who implemented flipped learning in two sections of college algebra courses for two semesters. It details how the courses were flipped, what technology was used, advantages, challenges, and results. It explains what students do outside of class, what they do inside class, and discusses…

  10. Relationships in the Flipped Classroom

    Science.gov (United States)

    McCollum, Brett M.; Fleming, Cassidy L.; Plotnikoff, Kara M.; Skagen, Darlene N.

    2017-01-01

    This study examines the effectiveness of flipped classrooms in chemistry, and identifies relationships as a major factor impacting the success of flipped instruction methods. Examination of student interview data reveals factors that affect the development of peer-peer, peer-peer leader, and peer-expert relationships in firstyear general chemistry…

  11. Flipped GUT inflation

    OpenAIRE

    Ellis, John; Gonzalo, Tomás E.; Harz, Julia; Huang, Wei-Chih

    2015-01-01

    We analyse the prospects for constructing hybrid models of inflation that provide a dynamical realisation of the apparent closeness between the supersymmetric GUT scale and the possible scale of cosmological inflation. In the first place, we consider models based on the flipped SU(5)×U(1) gauge group, which has no magnetic monopoles. In one model, the inflaton is identified with a sneutrino field, and in the other model it is a gauge singlet. In both cases we find regions of the model paramet...

  12. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  13. Flipped GUT inflation

    Energy Technology Data Exchange (ETDEWEB)

    Ellis, John [Theoretical Particle Physics and Cosmology Group, Department of Physics, King’s College London, Strand, London WC2R 2LS (United Kingdom); Theory Division, CERN, Route de Meyrin 385, 1217 Meyrin (Switzerland); Gonzalo, Tomás E.; Harz, Julia; Huang, Wei-Chih [Department of Physics and Astronomy, University College London, Gower Street, London WC1E 6BT (United Kingdom)

    2015-03-23

    We analyse the prospects for constructing hybrid models of inflation that provide a dynamical realisation of the apparent closeness between the supersymmetric GUT scale and the possible scale of cosmological inflation. In the first place, we consider models based on the flipped SU(5)×U(1) gauge group, which has no magnetic monopoles. In one model, the inflaton is identified with a sneutrino field, and in the other model it is a gauge singlet. In both cases we find regions of the model parameter spaces that are compatible with the experimental magnitudes of the scalar perturbations, A{sub s}, and the tilt in the scalar perturbation spectrum, n{sub s}, as well as with an indicative upper limit on the tensor-to-scalar perturbation ratio, r. We also discuss embeddings of these models into SO(10), which is broken at a higher scale so that its monopoles are inflated away.

  14. Flipped dark matter

    Energy Technology Data Exchange (ETDEWEB)

    Ellis, J.; Hagelin, J.S.; Kelley, S.; Nanopoulos, D.V.; Olive, K.A.

    1988-08-04

    We study candidates for dark matter in a minimal flipped SU(5) x U(1) supersymmetric GUT. Since the model has no R-parity, spin-1/2 supersymmetric partners of conventional particles mix with other neutral fermions including neutrinos, and can decay into them. The lighest particle which is predominantly a gaugino/higgsino mixture decays with a lifetime tau/sub chi/ approx. = 1-10/sup 9/ s. The model contains a scalar 'flaton' field whose coherent oscillations decay before cosmological nucleosynthesis, and whose pseudoscalar partner contributes negligibly to ..cap omega.. if it is light enough to survive to the present epoch. The fermionic 'flatino' partner of the flaton has a lifetime tau/sub PHI/ approx. = 10/sup 28/-10/sup 34/ yr and is a viable candiate for metastable dark matter with ..cap omega.. < or approx. 1.

  15. Flipped GUT inflation

    Energy Technology Data Exchange (ETDEWEB)

    Ellis, John [Theoretical Particle Physics and Cosmology Group, Department of Physics, King' s College London, Strand, London WC2R 2LS (United Kingdom); Gonzalo, Tomás E.; Harz, Julia; Huang, Wei-Chih, E-mail: john.ellis@cern.ch, E-mail: tomas.gonzalo.11@ucl.ac.uk, E-mail: j.harz@ucl.ac.uk, E-mail: wei-chih.huang@ucl.ac.uk [Department of Physics and Astronomy, University College London, Gower Street, London WC1E 6BT (United Kingdom)

    2015-03-01

    We analyse the prospects for constructing hybrid models of inflation that provide a dynamical realisation of the apparent closeness between the supersymmetric GUT scale and the possible scale of cosmological inflation. In the first place, we consider models based on the flipped SU(5)×U(1) gauge group, which has no magnetic monopoles. In one model, the inflaton is identified with a sneutrino field, and in the other model it is a gauge singlet. In both cases we find regions of the model parameter spaces that are compatible with the experimental magnitudes of the scalar perturbations, A{sub s}, and the tilt in the scalar perturbation spectrum, n{sub s}, as well as with an indicative upper limit on the tensor-to-scalar perturbation ratio, r. We also discuss embeddings of these models into SO(10), which is broken at a higher scale so that its monopoles are inflated away.

  16. A flipped 331 model

    Energy Technology Data Exchange (ETDEWEB)

    Fonseca, Renato M.; Hirsch, Martin [AHEP Group, Instituto de Física Corpuscular, C.S.I.C./Universitat de València,Parc Científic de Paterna. Calle Catedrático José Beltrán,2 E-46980 Paterna (Valencia) (Spain)

    2016-08-01

    Models based on the extended SU(3){sub C}×SU(3){sub L}×U(1){sub X} (331) gauge group usually follow a common pattern: two families of left-handed quarks are placed in anti-triplet representations of the SU(3){sub L} group; the remaining quark family, as well as the left-handed leptons, are assigned to triplets (or vice-versa). In this work we present a flipped 331 model where this scheme is reversed: all three quark families are in the same representation and it is the lepton families which are discriminated by the gauge symmetry. We discuss fermion masses and mixing, as well as Z{sup ′} interactions, in a minimal model implementing this idea.

  17. Practical quantum coin flipping

    International Nuclear Information System (INIS)

    Pappa, Anna; Diamanti, Eleni; Chailloux, Andre; Kerenidis, Iordanis

    2011-01-01

    We show that in the unconditional security model, a single quantum strong coin flip with security guarantees that are strictly better than in any classical protocol is possible to implement with current technology. Our protocol takes into account all aspects of an experimental implementation, including losses, multiphoton pulses emitted by practical photon sources, channel noise, detector dark counts, and finite quantum efficiency. We calculate the abort probability when both players are honest, as well as the probability of one player forcing his desired outcome. For a channel length up to 21 km and commonly used parameter values, we can achieve honest abort and cheating probabilities that are better than in any classical protocol. Our protocol is, in principle, implementable using attenuated laser pulses, with no need for entangled photons or any other specific resources.

  18. Flipped GUT Inflation

    CERN Document Server

    Ellis, John; Harz, Julia; Huang, Wei-Chih

    2015-01-01

    We analyse the prospects for constructing hybrid models of inflation that provide a dynamical realisation of the apparent closeness between the supersymmetric GUT scale and the possible scale of cosmological inflation. In the first place, we consider models based on the flipped SU(5)$\\times$U(1) gauge group, which has no magnetic monopoles. In one model, the inflaton is identified with a sneutrino field, and in the other model it is a gauge singlet. In both cases we find regions of the model parameter spaces that are compatible with the experimental magnitudes of the scalar perturbations, $A_s$, and the tilt in the scalar perturbation spectrum, $n_s$, as well as with an indicative upper limit on the tensor-to-scalar perturbation ratio, $r$. We also discuss embeddings of these models into SO(10), which is broken at a higher scale so that its monopoles are inflated away.

  19. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

    International Nuclear Information System (INIS)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-01-01

    inconsistent proportions of metal and glassy phase particles present during the subsequent firing process. The consequences were subtle, intermittent changes to the thick film microstructure that gave rise to the reaction layer and, thus, the low pull strength phenomenon. A mitigation strategy would be the use of physical vapor deposition (PVD) techniques to create thin film bond pads; this is multi-chip module, deposited (MCM-D) technology

  20. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    inconsistent proportions of metal and glassy phase particles present during the subsequent firing process. The consequences were subtle, intermittent changes to the thick film microstructure that gave rise to the reaction layer and, thus, the low pull strength phenomenon. A mitigation strategy would be the use of physical vapor deposition (PVD) techniques to create thin film bond pads; this is multi-chip module, deposited (MCM-D) technology.

  1. System issues for multichip packaging

    Science.gov (United States)

    Sage, Maurice G.; Hartley, Neil

    1991-04-01

    It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

  2. FLIP for FLAG model visualization

    Energy Technology Data Exchange (ETDEWEB)

    Wooten, Hasani Omar [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2017-11-15

    A graphical user interface has been developed for FLAG users. FLIP (FLAG Input deck Parser) provides users with an organized view of FLAG models and a means for efficiently and easily navigating and editing nodes, parameters, and variables.

  3. How material, visual and verbal cues on packaging influence consumer expectations and willingness to buy: The case of crisps (potato chips) in Spain.

    Science.gov (United States)

    Rebollar, Rubén; Gil, Ignacio; Lidón, Iván; Martín, Javier; Fernández, María J; Rivera, Sandra

    2017-09-01

    This paper analyses the influence that certain aspects of packaging design have on the consumer expectations of a series of sensory and non-sensory attributes and on willingness to buy for a bag of crisps in Spain. A two-part experiment was conducted in which 174 people evaluated the attributes for different stimuli using an online survey. In the first part, four stimuli were created in which two factors were varied: the packaging material and the image displayed. Interaction was identified between both factors for the attributes Crunchy, High quality and Artisan. For the attributes Salty, Crunchy and Willingness to buy, the image was the only significant factor, with the image displaying crisps ready for consumption being the only one that obtained higher scores. For the attribute Intense flavour, no statistically significant differences were identified among the stimuli. In general terms, the image displayed on the bag had a greater influence than the material from which the bag was made. In the second part, an analysis was made of the most effective way (visual cues versus verbal cues) to transmit the information that the crisps were fried in olive oil. To this end, two stimuli were designed: one displaying an image of an oil cruet and another with an allusive text. For all the attributes (Intense flavour, Crunchy, Artisan, High quality, Healthy and Willingness to buy), higher scores were obtained with the image than with the text. These results have important implications for crisps producers, marketers and packaging designers. Copyright © 2017 Elsevier Ltd. All rights reserved.

  4. Spin flipping a stored polarized proton beam

    International Nuclear Information System (INIS)

    Caussyn, D.D.; Derbenev, Y.S.; Ellison, T.J.P.; Lee, S.Y.; Rinckel, T.; Schwandt, P.; Sperisen, F.; Stephenson, E.J.; von Przewoski, B.; Blinov, B.B.; Chu, C.M.; Courant, E.D.; Crandell, D.A.; Kaufman, W.A.; Krisch, A.D.; Nurushev, T.S.; Phelps, R.A.; Ratner, L.G.; Wong, V.K.; Ohmori, C.

    1994-01-01

    We recently studied the spin flipping of a vertically polarized, stored 139-MeV proton beam. To flip the spin, we induced an rf depolarizing resonance by sweeping our rf solenoid magnet's frequency through the resonance frequency. With multiple spin flips, we found a polarization loss of 0.0000±0.0005 per spin flip under the best conditions; this loss increased significantly for small changes in the conditions. Minimizing the depolarization during each spin flip is especially important because frequent spin flipping could significantly reduce the systematic errors in stored polarized-beam experiments

  5. Interconnect mechanisms in microelectronic packaging

    Science.gov (United States)

    Roma, Maria Penafrancia C.

    alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

  6. To Flip or Not to Flip? An Exploratory Study Comparing Student Performance in Calculus I

    Science.gov (United States)

    Schroeder, Larissa B.; McGivney-Burelle, Jean; Xue, Fei

    2015-01-01

    The purpose of this exploratory, mixed-methods study was to compare student performance in flipped and non-flipped sections of Calculus I. The study also examined students' perceptions of the flipping pedagogy. Students in the flipped courses reported spending, on average, an additional 1-2 hours per week outside of class on course content.…

  7. The Flipped Classroom in Counselor Education

    Science.gov (United States)

    Moran, Kristen; Milsom, Amy

    2015-01-01

    The flipped classroom is proposed as an effective instructional approach in counselor education. An overview of the flipped-classroom approach, including advantages and disadvantages, is provided. A case example illustrates how the flipped classroom can be applied in counselor education. Recommendations for implementing or researching flipped…

  8. The Marriage of Constructivism and Flipped Learning

    Science.gov (United States)

    Chang, Sau Hou

    2016-01-01

    This report talks about how a constructivist teacher used flipped learning in a college class. To illustrate how to use flipped learning in a constructivist classroom, examples were given with the four pillars of F-L-I-P: Flexible environment, learning culture, intentional content, and professional educator.

  9. A Flipped Classroom Redesign in General Chemistry

    Science.gov (United States)

    Reid, Scott A.

    2016-01-01

    The flipped classroom continues to attract significant attention in higher education. Building upon our recent parallel controlled study of the flipped classroom in a second-term general chemistry course ("J. Chem. Educ.," 2016, 93, 13-23), here we report on a redesign of the flipped course aimed at scaling up total enrollment while…

  10. Flipping a Calculus Class: One Instructor's Experience

    Science.gov (United States)

    Palmer, Katrina

    2015-01-01

    This paper describes one instructor's experiences during a year of flipping four calculus classes. The first exploration attempts to understand student expectations of a math class and their preference towards a flipped classroom. The second examines success of students from a flipped classroom, and the last investigates relationships with student…

  11. Intersecting Branes Flip SU(5)

    CERN Document Server

    Ellis, Jonathan Richard; Nanopoulos, Dimitri V; Ellis, John

    2002-01-01

    Within a toroidal orbifold framework, we exhibit intersecting brane-world constructions of flipped SU(5) \\times U(1) GUT models with various numbers of generations, other chiral matter representations and Higgs representations. We exhibit orientifold constructions with integer winding numbers that yield 8 or more conventional SU(5) generations, and orbifold constructions with fractional winding numbers that yield flipped SU(5) \\times U(1) models with just 3 conventional generations. Some of these models have candidates for the 5 and {\\bar 5} Higgs representations needed for electroweak symmetry breaking, but not for the 10 and {\\bar 10} representations needed for GUT symmetry breaking, or vice-versa.

  12. Flipped Learning fra et elevperspektiv

    DEFF Research Database (Denmark)

    Holmboe, Peter; Hachmann, Roland

    2016-01-01

    Antologi er et resultat af et toårigt udviklingsprojekt om Flipped Learning baseret på et samarbejde mellem IT-Center Fyn og Region Syddanmark. Bidraget her præsenterer en række overvejelser, vi har gjort os på baggrund af observationer af undervisning og interviews med elever i projektet. Vores...... overordnede undersøgelsesspørgsmål var: "Hvilke forhold i undervisning og læringsmiljø fremme hhv. begrænser elevens opfattelse af mening og fagligt udbytte i et Flipped Learning design?"....

  13. Package Holds Five Monolithic Microwave Integrated Circuits

    Science.gov (United States)

    Mysoor, Narayan R.; Decker, D. Richard; Olson, Hilding M.

    1996-01-01

    Packages protect and hold monolithic microwave integrated circuit (MMIC) chips while providing dc and radio-frequency (RF) electrical connections for chips undergoing development. Required to be compact, lightweight, and rugged. Designed to minimize undesired resonances, reflections, losses, and impedance mismatches.

  14. Some comments on flipped SU(5) times U(1) and flipped unification in general

    Energy Technology Data Exchange (ETDEWEB)

    Barr, S.M. (Bartol Research Institute, University of Delaware, Newark, Delaware 19716 (US))

    1989-10-01

    A general group-theoretical discussion of flipped embeddings is given. In addition to the well-known flipped SU(5) and flipped SO(10), the existence of flipped E{sub 6} and E{sub 7} is shown, as well as several families and special cases of flipped embeddings. A possible physical reason, essentially based on the group theory of flipped embeddings, why nature prefers the low-energy group SU(3){times}SU(2){times}U(1) to alternatives such as SU(4){times}U(1) and SU(5) is pointed out.

  15. Some comments on flipped SU(5)xU(1) and flipped unification in general

    International Nuclear Information System (INIS)

    Barr, S.M.

    1989-01-01

    A general group-theoretical discussion of flipped embeddings is given. In addition to the well-known flipped SU(5) and flipped SO(10), the existence of flipped E 6 and E 7 is shown, as well as several families and special cases of flipped embeddings. A possible physical reason, essentially based on the group theory of flipped embeddings, why nature prefers the low-energy group SU(3)xSU(2)xU(1) to alternatives such as SU(4)xU(1) and SU(5) is pointed out

  16. Flipped Classroom Experiences: Student Preferences and Flip Strategy in a Higher Education Context

    Science.gov (United States)

    McNally, Brenton; Chipperfield, Janine; Dorsett, Pat; Del Fabbro, Letitia; Frommolt, Valda; Goetz, Sandra; Lewohl, Joanne; Molineux, Matthew; Pearson, Andrew; Reddan, Gregory; Roiko, Anne; Rung, Andrea

    2017-01-01

    Despite the popularity of the flipped classroom, its effectiveness in achieving greater engagement and learning outcomes is currently lacking substantial empirical evidence. This study surveyed 563 undergraduate and postgraduate students (61% female) participating in flipped teaching environments and ten convenors of the flipped courses in which…

  17. Flip-J: Development of the System for Flipped Jigsaw Supported Language Learning

    Science.gov (United States)

    Yamada, Masanori; Goda, Yoshiko; Hata, Kojiro; Matsukawa, Hideya; Yasunami, Seisuke

    2016-01-01

    This study aims to develop and evaluate a language learning system supported by the "flipped jigsaw" technique, called "Flip-J". This system mainly consists of three functions: (1) the creation of a learning material database, (2) allocation of learning materials, and (3) formation of an expert and jigsaw group. Flip-J was…

  18. Flipping the Graduate Qualitative Research Methods Classroom: Did It Lead to Flipped Learning?

    Science.gov (United States)

    Earley, Mark

    2016-01-01

    The flipped, or inverted, classroom has gained popularity in a variety of fields and at a variety of educational levels, from K-12 through higher education. This paper describes the author's positive experience flipping a graduate qualitative research methods classroom. After a review of the current literature on flipped classrooms in higher…

  19. How to Flip the Classroom--"Productive Failure or Traditional Flipped Classroom" Pedagogical Design?

    Science.gov (United States)

    Song, Yanjie; Kapur, Manu

    2017-01-01

    The paper reports a quasi-experimental study comparing the "traditional flipped classroom" pedagogical design with the "productive failure" (Kapur, 2016) pedagogical design in the flipped classroom for a 2-week curricular unit on polynomials in a Hong Kong Secondary school. Different from the flipped classroom where students…

  20. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  1. Welding robot package; Arc yosetsu robot package

    Energy Technology Data Exchange (ETDEWEB)

    Nishikawa, S. [Yaskawa Electric Corp., Kitakyushu (Japan)

    1998-09-01

    For the conventional high-speed welding robot, the welding current was controlled mainly for reducing the spatters during short circuits and for stabilizing the beads by the periodic short circuits. However, an increase of deposition amount in response to the speed is required for the high-speed welding. Large-current low-spatter welding current region control was added. Units were integrated into a package by which the arc length is kept in short without dispersion of arc length for welding without defects such as undercut and unequal beads. In automobile industry, use of aluminum parts is extended for the light weight. The welding is very difficult, and automation is not so progressing in spite of the poor environment. Buckling of welding wire is easy to occur, and supply of wire is obstructed by the deposition of chipped powders on the torch cable, which stay within the contact chip resulting in the deposition. Dislocation of locus is easy to occur at the corner of rectangular pipe during the welding. By improving these troubles, an aluminum MIG welding robot package has been developed. 13 figs.

  2. Chips 2020

    CERN Document Server

    2016-01-01

    The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising  Moore-like exponential g...

  3. To Flip or Not to Flip? Analysis of a Flipped Classroom Pedagogy in a General Biology Course

    Science.gov (United States)

    Heyborne, William H.; Perrett, Jamis J.

    2016-01-01

    In an attempt to better understand the flipped technique and evaluate its purported superiority in terms of student learning gains, the authors conducted an experiment comparing a flipped classroom to a traditional lecture classroom. Although the outcomes were mixed, regarding the superiority of either pedagogical approach, there does seem to be a…

  4. Chip-to-Chip Half Duplex Spiking Data Communication over Power Supply Rails

    Science.gov (United States)

    Hashida, Takushi; Nagata, Makoto

    Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at more than 100Mbps. A pair of transceivers consumes 1.35mA from 3.3V, at 130Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by 30dB, purifying power supply current for internal circuits. Bi-directional spiking communication was successfully examined in a 90-nm CMOS prototype setup of on-chip waveform capturing. A micro controller forwards clock pulses to and receives data streams from a comparator based waveform capturer formed on a different chip, through a single pair of power and ground traces. The bit error rate is small enough not to degrade waveform acquisition capability, maintaining the spurious free dynamic range of higher than 50dB.

  5. Interaction-flip identities in spin glasses

    NARCIS (Netherlands)

    Contucci, P.; Giardinà, C.; Giberti, C.

    2009-01-01

    We study the properties of fluctuation for the free energies and internal energies of two spin glass systems that differ for having some set of interactions flipped. We show that their difference has a variance that grows like the volume of the flipped region. Using a new interpolation method, which

  6. Just in Time to Flip Your Classroom

    Science.gov (United States)

    Lasry, Nathaniel; Dugdale, Michael; Charles, Elizabeth

    2014-01-01

    With advocates like Sal Khan and Bill Gates, flipped classrooms are attracting an increasing amount of media and research attention. We had heard Khan's TED talk and were aware of the concept of inverted pedagogies in general. Yet it really hit home when we accidentally flipped our classroom. Our objective was to better prepare our students…

  7. Conceptualizing "Homework" in Flipped Mathematics Classes

    Science.gov (United States)

    de Araujo, Zandra; Otten, Samuel; Birisci, Salih

    2017-01-01

    Flipped instruction is becoming more common in the United States, particularly in mathematics classes. One of the defining characteristics of this increasingly popular instructional format is the homework teachers assign. In contrast to traditional mathematics classes in which homework consists of problem sets, homework in flipped classes often…

  8. Diverse Perspectives on a Flipped Biostatistics Classroom

    Science.gov (United States)

    Schwartz, Todd A.; Andridge, Rebecca R.; Sainani, Kirstin L.; Stangle, Dalene K.; Neely, Megan L.

    2016-01-01

    "Flipping" the classroom refers to a pedagogical approach in which students are first exposed to didactic content outside the classroom and then actively use class time to apply their newly attained knowledge. The idea of the flipped classroom is not new, but has grown in popularity in recent years as the necessary technology has…

  9. Best Practices for Launching a Flipped Classroom

    Science.gov (United States)

    Hall, Ashley A.; DuFrene, Debbie D.

    2016-01-01

    Popularity is growing for flipped classroom instruction, which replaces lectures with out-of-class delivery of streaming video, reading materials, online chats, and other modalities. Face-to-face class time is spent on instructor-student and student-student interaction, including small group problem solving and discussion. Classroom flipping has…

  10. STEM Teacher Efficacy in Flipped Classrooms

    Science.gov (United States)

    Kelly, Daniel; Denson, Cameron

    2017-01-01

    The flipped classroom instructional model continues to grow in adoption and use in K-12 classrooms. Although there are an increasing number of studies into the implementation of the flipped classroom, there is limited empirical research into its effectiveness and even fewer into the educational, psychological, and theoretical constructs underlying…

  11. The Flipped Classroom: A Twist on Teaching

    Science.gov (United States)

    Schmidt, Stacy M. P.; Ralph, David L.

    2016-01-01

    The traditional classroom has utilized the "I Do", "We Do", "You Do" as a strategy for teaching for years. The flipped classroom truly flips that strategy. The teacher uses "You Do", "We Do", "I Do" instead. Homework, inquiry, and investigation happen in the classroom. At home students…

  12. Examining the Flipped Classroom through Action Research

    Science.gov (United States)

    Lo, Chung Kwan

    2017-01-01

    There is a growing interest in using a flipped classroom format in day-to-day teaching. Direct computer-based individual instruction outside the classroom and interactive group learning activities inside the classroom are the two essential components of the flipped classroom model. By watching instructional videos, students can work through some…

  13. Flipped Classroom Instruction for Inclusive Learning

    Science.gov (United States)

    Altemueller, Lisa; Lindquist, Cynthia

    2017-01-01

    The flipped classroom is a teaching methodology that has gained recognition in primary, secondary and higher education settings. The flipped classroom inverts traditional teaching methods, delivering lecture instruction outside class, and devoting class time to problem solving, with the teacher's role becoming that of a learning coach and…

  14. Just in Time to Flip Your Classroom

    Science.gov (United States)

    Lasry, Nathaniel; Dugdale, Michael; Charles, Elizabeth

    2014-01-01

    With advocates like Sal Khan and Bill Gates, flipped classrooms are attracting an increasing amount of media and research attention.2 We had heard Khan's TED talk and were aware of the concept of inverted pedagogies in general. Yet it really hit home when we accidentally flipped our classroom. Our objective was to better prepare our students for class. We set out to effectively move some of our course content outside of class and decided to tweak the Just-in-Time Teaching approach (JiTT).3 To our surprise, this tweak—which we like to call the flip-JiTT—ended up completely flipping our classroom. What follows is narrative of our experience and a procedure that any teacher can use to extend JiTT to a flipped classroom.

  15. Relationships in the Flipped Classroom

    Directory of Open Access Journals (Sweden)

    Brett M. McCollum

    2017-12-01

    Full Text Available This study examines the effectiveness of flipped classrooms in chemistry, and identifies relationships as a major factor impacting the success of flipped instruction methods. Examination of student interview data reveals factors that affect the development of peer-peer, peer-peer leader, and peer-expert relationships in first-year general chemistry and second-year organic chemistry flipped classrooms. Success was measured in terms of student perceptions of the effectiveness of the instruction, as well as student academic development. Furthermore, analysis of research participant interviews reveals that academic reading circles, open-response multiple-attempt group quizzes, and peer leaders are important elements of a text-centric flipped approach at a small-classroom, commuter-campus university. Student reflections and classroom observations provide further support for these conclusions. Cet étude examine l’efficacité des salles de classe inversées en chimie et identifie la création de liens en tant que facteur important qui affecte la réussite des méthodes d’instruction inversée. L’examen des données provenant d’entrevues avec les étudiants révèle les facteurs qui affectent le développement des rapports d’étudiant à étudiant, d’étudiant à leader et d’étudiant à expert dans un cours inversé de chimie générale de première année et dans un cours de chimie organique de deuxième année. La réussite a été mesurée en termes de perceptions des étudiants de l’efficacité de l’instruction, ainsi que du développement académique des étudiants. De plus, l’analyse des entrevues des participants à la recherche révèle que les cercles de lecture universitaires, les tests de groupes à essais multiples et à réponses ouvertes, ainsi que les leaders de groupes sont des éléments importants d’une approche inversée centrée sur un texte en petite salle de classe, dans une université de banlieusards. Les

  16. Flipping Radiology Education Right Side Up.

    Science.gov (United States)

    O'Connor, Erin E; Fried, Jessica; McNulty, Nancy; Shah, Pallav; Hogg, Jeffery P; Lewis, Petra; Zeffiro, Thomas; Agarwal, Vikas; Reddy, Sravanthi

    2016-07-01

    In flipped learning, medical students independently learn facts and concepts outside the classroom, and then participate in interactive classes to learn to apply these facts. Although there are recent calls for medical education reform using flipped learning, little has been published on its effectiveness. Our study compares the effects of flipped learning to traditional didactic instruction on students' academic achievement, task value, and achievement emotions. At three institutions, we alternated flipped learning with traditional didactic lectures during radiology clerkships, with 175 medical students completing a pretest on general diagnostic imaging knowledge to assess baseline cohort comparability. Following instruction, posttests and survey examinations of task value and achievement emotions were administered. Linear mixed effects analysis was used to examine the relationship between test scores and instruction type. Survey responses were modeled using ordinal category logistic regression. Instructor surveys were also collected. There were no baseline differences in test scores. Mean posttest minus pretest scores were 10.5% higher in the flipped learning group than in the didactic instruction group (P = 0.013). Assessment of task value and achievement emotions showed greater task value, increased enjoyment, and decreased boredom with flipped learning (all P flipped learning condition. Flipped learning was associated with increased academic achievement, greater task value, and more positive achievement emotions when compared to traditional didactic instruction. Further investigation of flipped learning methods in radiology education is needed to determine whether flipped learning improves long-term retention of knowledge, academic success, and patient care. Copyright © 2016 The Association of University Radiologists. Published by Elsevier Inc. All rights reserved.

  17. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  18. Packaging Effects on RadFET Sensors for High Energy Physics Experiments

    CERN Document Server

    Mekki, J; Glaser, M; Guatelli, S; Moll, M; Pia, M G; Ravotti, F

    2009-01-01

    RadFETs in customized chip carrier packages are installed in the LHC Experiments as radiation monitors. The package influence on the dose measurement in the complex LHC radiation environment is evaluated using Geant4 simulations and experimental data.

  19. Flipping the Electromagnetic Theory classroom

    Science.gov (United States)

    Berger, Andrew J.

    2017-08-01

    Electromagnetic Theory is a required junior-year course for Optics majors at the University of Rochester. This foundational course gives students their first rigorous exposure to electromagnetic vector fields, dipole radiation patterns, Fresnel reflection/transmission coefficients, waveguided modes, Jones vectors, waveplates, birefringence, and the Lorentz model of refractive index. To increase the percentage of class time devoted to student-centered conceptual reasoning and instructor feedback, this course was recently "flipped". Nearly all of the mathematically-intensive derivations were converted to narrated screencasts ("Khan Academy" style) and made available to students through the course's learning management system. On average, the students were assigned two 10-15 minute videos to watch in advance of each lecture. An electronic survey after each tutorial encouraged reflection and counted towards the student's participation grade. Over the past three years, students have consistently rated the videos as being highly valuable. This presentation will discuss the technical aspects of creating tutorial videos and the educational tradeoffs of flipping a mathematically-intensive upper-level course. The most important advantage is the instructor's increased ability to identify and respond to student confusion, via activities that would consume too much time in a lecture-centered course. Several examples of such activities will be given. Two pitfalls to avoid are the temptation for the instructor not to update the videos from year to year and the tendency of students not to take lecture notes while watching the videos.

  20. Comparing the Effectiveness of Blended, Semi-Flipped, and Flipped Formats in an Engineering Numerical Methods Course

    Science.gov (United States)

    Clark, Renee M.; Kaw, Autar; Besterfield-Sacre, Mary

    2016-01-01

    Blended, flipped, and semi-flipped instructional approaches were used in various sections of a numerical methods course for undergraduate mechanical engineers. During the spring of 2014, a blended approach was used; in the summer of 2014, a combination of blended and flipped instruction was used to deliver a semi-flipped course; and in the fall of…

  1. The Partially Flipped Classroom: The Effects of Flipping a Module on "Junk Science" in a Large Methods Course

    Science.gov (United States)

    Burgoyne, Stephanie; Eaton, Judy

    2018-01-01

    Flipped classrooms are gaining popularity, especially in psychology statistics courses. However, not all courses lend themselves to a fully flipped design, and some instructors might not want to commit to flipping every class. We tested the effectiveness of flipping just one component (a module on junk science) of a large methods course. We…

  2. Flipped classroom: a review of recent literature

    Directory of Open Access Journals (Sweden)

    Huseyin Uzunboylu

    2015-07-01

    Full Text Available The use of learning technologies, especially multimedia provide varied facilities for students’ learning that are not possible with other media. Pedagogical literature has proved that individuals have different learning styles. Flipped classroom is a pedagogical approach which means that activities that have traditionally taken place inside the classroom take place outside the classroom and vice versa. Flipped classroom environment ensures that students become more active participants compared with the traditional classroom. The purpose of this paper is to fulfil the needs regarding the review of recent literature on the use of flipped classroom approach in education. The contribution of flipped classroom to education is discussed in relation to the change of students' and instructors' role. Subsequently, flipped classroom applications in various disciplines of education are illustrated. The recommendations made in the literature for design specifications that integrate flipped classrooms with technology are discussed. The paper concludes that a careful consideration of the warnings and recommendations made in the literature can help to produce effective flipped classroom environments and also this paper attempts to inform those who are thinking of using new technologies and approaches to deliver courses.

  3. Using lightboard to flip the course

    DEFF Research Database (Denmark)

    Timcenko, Olga; Triantafyllou, Evangelia; Nilsson, Niels Chr.

    , and exercises for in-class work. However, the quality of videos that students have to watch before coming to the class is also important. In this paper, we will describe videos prepared for flipped classroom using light board, an invention from 2014. That allows natural flow of presentation, as it combines......Authors of the paper have several years of experience with flipping parts of the courses, and the whole courses. Crucial for successful flipping the class are well-chosen exercises that students need to do before the class, as a confirmation that they come prepared for in-class exercises...

  4. Twelve tips for "flipping" the classroom.

    Science.gov (United States)

    Moffett, Jennifer

    2015-04-01

    The flipped classroom is a pedagogical model in which the typical lecture and homework elements of a course are reversed. The following tips outline the steps involved in making a successful transition to a flipped classroom approach. The tips are based on the available literature alongside the author's experience of using the approach in a medical education setting. Flipping a classroom has a number of potential benefits, for example increased educator-student interaction, but must be planned and implemented carefully to support effective learning.

  5. Enhancing student engagement using the flipped classroom.

    Science.gov (United States)

    Gilboy, Mary Beth; Heinerichs, Scott; Pazzaglia, Gina

    2015-01-01

    The flipped classroom is an innovative pedagogical approach that focuses on learner-centered instruction. The purposes of this report were to illustrate how to implement the flipped classroom and to describe students' perceptions of this approach within 2 undergraduate nutrition courses. The template provided enables faculty to design before, during, and after class activities and assessments based on objectives using all levels of Bloom's taxonomy. The majority of the 142 students completing the evaluation preferred the flipped method compared with traditional pedagogical strategies. The process described in the report was successful for both faculty and students. Copyright © 2015 Society for Nutrition Education and Behavior. Published by Elsevier Inc. All rights reserved.

  6. Teaching & Learning Tips 6: The flipped classroom.

    Science.gov (United States)

    Shi, Connie R; Rana, Jasmine; Burgin, Susan

    2018-04-01

    Challenge: The "flipped classroom" is a pedagogical model in which instructional materials are delivered to learners outside of class, reserving class time for application of new principles with peers and instructors. Active learning has forever been an elusive ideal in medical education, but the flipped class model is relatively new to medical education. What is the evidence for the "flipped classroom," and how can these techniques be applied to the teaching of dermatology to trainees at all stages of their medical careers? © 2018 The International Society of Dermatology.

  7. Uncertainty in T1 mapping using the variable flip angle method with two flip angles

    International Nuclear Information System (INIS)

    Schabel, Matthias C; Morrell, Glen R

    2009-01-01

    Propagation of errors, in conjunction with the theoretical signal equation for spoiled gradient echo pulse sequences, is used to derive a theoretical expression for uncertainty in quantitative variable flip angle T 1 mapping using two flip angles. This expression is then minimized to derive a rigorous expression for optimal flip angles that elucidates a commonly used empirical result. The theoretical expressions for uncertainty and optimal flip angles are combined to derive a lower bound on the achievable uncertainty for a given set of pulse sequence parameters and signal-to-noise ratio (SNR). These results provide a means of quantitatively determining the effect of changing acquisition parameters on T 1 uncertainty. (note)

  8. FLIP the Switch: Regulation of Apoptosis and Necroptosis by cFLIP

    Directory of Open Access Journals (Sweden)

    Yuichi Tsuchiya

    2015-12-01

    Full Text Available cFLIP (cellular FLICE-like inhibitory protein is structurally related to caspase-8 but lacks proteolytic activity due to multiple amino acid substitutions of catalytically important residues. cFLIP protein is evolutionarily conserved and expressed as three functionally different isoforms in humans (cFLIPL, cFLIPS, and cFLIPR. cFLIP controls not only the classical death receptor-mediated extrinsic apoptosis pathway, but also the non-conventional pattern recognition receptor-dependent apoptotic pathway. In addition, cFLIP regulates the formation of the death receptor-independent apoptotic platform named the ripoptosome. Moreover, recent studies have revealed that cFLIP is also involved in a non-apoptotic cell death pathway known as programmed necrosis or necroptosis. These functions of cFLIP are strictly controlled in an isoform-, concentration- and tissue-specific manner, and the ubiquitin-proteasome system plays an important role in regulating the stability of cFLIP. In this review, we summarize the current scientific findings from biochemical analyses, cell biological studies, mathematical modeling, and gene-manipulated mice models to illustrate the critical role of cFLIP as a switch to determine the destiny of cells among survival, apoptosis, and necroptosis.

  9. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  10. Flipped Cryptons and the UHECRs

    CERN Document Server

    Ellis, Jonathan Richard; Nanopoulos, Dimitri V; Ellis, John

    2004-01-01

    Cryptons are metastable bound states of fractionally-charged particles that arise generically in the hidden sectors of models derived from heterotic string. We study their properties and decay modes in a specific flipped SU(5) model with long-lived four-particle spin-zero bound states called {\\it tetrons}. We show that the neutral tetrons are metastable, and exhibit the ninth- and tenth-order non-renormalizable superpotential operators responsible for their dominant decays. By analogy with QCD, we expect charged tetrons to be somewhat heavier, and to decay relatively rapidly via lower-order interactions that we also exhibit. The expected masses and lifetimes of the neutral tetrons make them good candidates for cold dark matter (CDM), and a potential source of the ultra-high energy cosmic rays (UHECRs) which have been observed, whereas the charged tetrons would have decayed in the early Universe.

  11. Signatures of flipped SU(5)

    Energy Technology Data Exchange (ETDEWEB)

    Abel, S.A. (Bristol Univ. (UK). H.H. Wills Physics Lab.); Whittingham, I. (James Cook Univ. of North Queensland, Townsville (Australia). Dept. of Physics)

    1990-02-22

    We examine the electric dipole moment of the neutron and flavour changing Z decays in the flipped SU(5) grand unification scheme. We find that the new couplings at energy scales above M{sub GUT} can lead to neutron electric dipole moments vertical strokedvertical stroke{approx equal} 10{sup -25} e cm and decays of the form Z{yields}banti s, santi b with a branching ratio Bsub(Z{yields}banti s,santi b) {approx equal} 10{sup -6}, of which a large proportion ({epsilon}{le}1/4) may be CP violating. The first two effects are found to be slightly suppressed in the currently popular no-scale theories, but the CP violation parameter, {epsilon}, is relatively theory independent. (orig.).

  12. Flipped learning in science education

    DEFF Research Database (Denmark)

    Andersen, Thomas Dyreborg; Foss, Kristian Kildemoes; Nissen, Stine Karen

    2017-01-01

    During the last decade, massive investment in ICT has been made in Danish schools. There seems, however, to be a need to rethink how to better integrate ICT in education (Bundgaard et al. 2014 p. 216) Flipped learning might be a didactical approach that could contribute to finding a method to use...... research questions are “To what extent can teachers using the FL-teaching method improve Danish pupils' learning outcomes in science subject’s physics / chemistry, biology and geography in terms of the results of national tests?” And “What factors influence on whether FL-teaching improves pupils' learning...... will be addressed. Hereafter an array of different scaffolding activities will be conducted, among these are individual supervision, sharing of materials used in lessons and involving local school leaders in the program. During this 3-year period we will follow the progress of the students involved in the program...

  13. Front propagation in flipping processes

    International Nuclear Information System (INIS)

    Antal, T; Ben-Avraham, D; Ben-Naim, E; Krapivsky, P L

    2008-01-01

    We study a directed flipping process that underlies the performance of the random edge simplex algorithm. In this stochastic process, which takes place on a one-dimensional lattice whose sites may be either occupied or vacant, occupied sites become vacant at a constant rate and simultaneously cause all sites to the right to change their state. This random process exhibits rich phenomenology. First, there is a front, defined by the position of the leftmost occupied site, that propagates at a nontrivial velocity. Second, the front involves a depletion zone with an excess of vacant sites. The total excess Δ k increases logarithmically, Δ k ≅ ln k, with the distance k from the front. Third, the front exhibits ageing-young fronts are vigorous but old fronts are sluggish. We investigate these phenomena using a quasi-static approximation, direct solutions of small systems and numerical simulations

  14. Wafer level packaging of MEMS

    International Nuclear Information System (INIS)

    Esashi, Masayoshi

    2008-01-01

    Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

  15. Analysis of Design of Mixed-Signal Electronic Packaging

    National Research Council Canada - National Science Library

    Pileggi, Lawrence

    1999-01-01

    The objective of this project is to develop innovative algorithms and prototype tools that will help facilitate the design of mixed signal multi-chip modules and packaging in a manner that is similar...

  16. Packaging microservices

    DEFF Research Database (Denmark)

    Montesi, Fabrizio; Thrane, Dan Sebastian

    2017-01-01

    We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

  17. Unifying flipped SU(5) in five dimensions

    International Nuclear Information System (INIS)

    Barr, S.M.; Dorsner, Ilja

    2002-01-01

    It is shown that embedding a four-dimensional flipped SU(5) model in a five-dimensional SO(10) model preserves the best features of both flipped SU(5) and SO(10). The missing partner mechanism, which naturally achieves both doublet-triplet splitting and suppression of d=5 proton decay operators, is realized as in flipped SU(5), while the gauge couplings are unified as in SO(10). The masses of down quarks and charged leptons, which are independent in flipped SU(5), are related by the SO(10). Distinctive patterns of quark and lepton masses can result. The gaugino mass M 1 is independent of M 3 and M 2 , which are predicted to be equal

  18. Equine First Aid Information Flip Booklet

    OpenAIRE

    Nay, Karah; Hoopes, Karl

    2017-01-01

    This is a flip chart type booklet with first aid information for horses, including checking vitals, pulse rate, respiration, mucus membrane color and capillary refill, signs of colic, deworming, vaccinations recommended for Utah, hoof care, and dental care.

  19. Flipped Science Inquiry@Crescent Girls' School

    Directory of Open Access Journals (Sweden)

    Peishi Goh

    2017-06-01

    Full Text Available This study shares the findings of a school-based Action Research project to explore how inquiry-based science practical lessons designed using the Flipped Science Inquiry@CGS classroom pedagogical model influence the way students learn scientific knowledge and also students' development of 21st century competencies, in particular, in the area of Knowledge Construction. Taking on a broader definition of the flipped classroom pedagogical model, the Flipped Science Inquiry@CGS framework adopts a structure that inverted the traditional science learning experience. Scientific knowledge is constructed through discussions with their peers, making use of their prior knowledge and their experiences while engaging in hands-on activities. Through the study, it is found that with the use of the Flipped Science Inquiry@CGS framework, learning experiences that are better aligned to the epistemology of science while developing 21st century competencies in students are created.

  20. How we flipped the medical classroom.

    Science.gov (United States)

    Sharma, Neel; Lau, C S; Doherty, Iain; Harbutt, Darren

    2015-04-01

    Flipping the classroom centres on the delivery of print, audio or video based material prior to a lecture or class session. The class session is then dedicated to more active learning processes with application of knowledge through problem solving or case based scenarios. The rationale behind this approach is that teachers can spend their face-to-face time supporting students in deeper learning processes. In this paper we provide a background literature review on the flipped classroom along with a three step approach to flipping the classroom comprising implementing, enacting and evaluating this form of pedagogy. Our three step approach is based on actual experience of delivering a flipped classroom at the University of Hong Kong. This initiative was evaluated with positive results. We hope our experience will be transferable to other medical institutions.

  1. En didaktisk model for Flipped Classroom

    DEFF Research Database (Denmark)

    Levinsen, Henrik; Foss, Kristian Kildemoes; Andersen, Thomas Dyreborg

    2016-01-01

    I artiklen præsenterer vi en model over flipped classroom som didaktisk metode udviklet med henblik på at stilladsere både de lærere, som gerne vil prøve kræfter med en flipped classroom-baseret praksis, og dem som allerede har erfaring, men kan have glæde af at bruge modellen til at kvalificere...... deres flipped classroom-undervisning. Modellen kan bidrage til erkendelsen af, at flipped classroom er noget nær et paradigmeskifte i forståelsen af god undervisning. Her tænkes på det skift i fokus metoden indebærer fra, at læreren er mest aktiv, til at eleverne er de mest aktive. Særligt for den...

  2. Flips for 3-folds and 4-folds

    CERN Document Server

    Corti, Alessio

    2007-01-01

    This edited collection of chapters, authored by leading experts, provides a complete and essentially self-contained construction of 3-fold and 4-fold klt flips. A large part of the text is a digest of Shokurov's work in the field and a concise, complete and pedagogical proof of the existence of 3-fold flips is presented. The text includes a ten page glossary and is accessible to students and researchers in algebraic geometry.

  3. Resonant Homoclinic Flips Bifurcation in Principal Eigendirections

    Directory of Open Access Journals (Sweden)

    Tiansi Zhang

    2013-01-01

    Full Text Available A codimension-4 homoclinic bifurcation with one orbit flip and one inclination flip at principal eigenvalue direction resonance is considered. By introducing a local active coordinate system in some small neighborhood of homoclinic orbit, we get the Poincaré return map and the bifurcation equation. A detailed investigation produces the number and the existence of 1-homoclinic orbit, 1-periodic orbit, and double 1-periodic orbits. We also locate their bifurcation surfaces in certain regions.

  4. EFFECTIVENESS OF FLIPPED CLASSROOM IN MATHEMATICS TEACHING

    OpenAIRE

    Dr. N. Ramakrishnan; Mrs. J. Johnsi Priya

    2016-01-01

    Flipped Classroom is an instructional strategy and a type of blended learning that reverses the traditional learning environment by delivering instructional content, often online, outside of the classroom. It moves activities, including those that may have traditionally been considered homework, into the classroom. In a flipped classroom, students watch online lectures, collaborate in online discussions, or carry out research at home and engage in concepts in the classroom with the guidance o...

  5. PACE3 - front-end chip for the CMS Preshower

    CERN Multimedia

    Aspel, Paul

    2003-01-01

    This is PACE3 which is the front-end chip for the CMS Preshower. In fact PACE3 is the combination of two ASICs called Delta3 and PACEAM3. Delta3 is on the left and PACEAM3 is on the right. The two ASICs are bonded together and then packaged within a single 196 pin fpBGA package.

  6. Numerical investigation of heat transfer in Plastic Leaded Chip ...

    African Journals Online (AJOL)

    Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit ...

  7. Neutrino helicity flips via electroweak interactions

    International Nuclear Information System (INIS)

    Gaemers, K.J.F.; Gandhi, R.; Lattimer, J.M.; Department of Earth and Space Sciences, State University of New York, Stony Brook, New York 11794)

    1989-01-01

    Electroweak mechanisms via which neutrinos may flip helicity are examined in detail. Exact and approximate expressions for a variety of flip processes relevant in astrophysics and cosmology, mediated by W, Z, and γ exchange, including their interference, are derived for both Dirac and Majorana neutrinos (with emphasis on the former). It is shown that in general flip and nonflip cross sections differ by more than just a multiplicative factor of m/sub ν/ 2 /4E/sub ν/ 2 contrary to what might be expected and that this additional dependence on helicities can be significant. It is also shown that within the context of the standard model with massive neutrinos, for νe yields νe scattering, σ/sub Z//sup flip//σ/sub γ//sup flip/ ∼ 10 4 , independent of particle masses and energies to a good approximation. As an application, using some general considerations and the fact that the observed bar nu/sub e/ burst from SN 1987A lasted several seconds, these weak-interaction flip cross sections are used to rule out μ and tau neutrino masses above 30 keV. Finally, some other consequences for astrophysics in general and supernovae in particular are briefly discussed

  8. Detection of trans-cis flips and peptide-plane flips in protein structures

    NARCIS (Netherlands)

    Touw, W.G.; Joosten, R.P.; Vriend, G.

    2015-01-01

    A coordinate-based method is presented to detect peptide bonds that need correction either by a peptide-plane flip or by a trans-cis inversion of the peptide bond. When applied to the whole Protein Data Bank, the method predicts 4617 trans-cis flips and many thousands of hitherto unknown

  9. Confchem Conference on Flipped Classroom: Student Engagement with Flipped Chemistry Lectures

    Science.gov (United States)

    Seery, Michael K.

    2015-01-01

    This project introduces the idea of "flipped lecturing" to a group of second-year undergraduate students. The aim of flipped lecturing is to provide much of the "content delivery" of the lecture in advance, so that the lecture hour can be devoted to more in-depth discussion, problem solving, and so on. As well as development of…

  10. Does "Flipping" Promote Engagement?: A Comparison of a Traditional, Online, and Flipped Class

    Science.gov (United States)

    Burke, Alison S.; Fedorek, Brian

    2017-01-01

    "Flipped" or inverted classrooms are designed to utilize class time for application and knowledge building, while course content is delivered through the use of online lectures and watched at home on the students' time. It is believed that flipped classrooms promote student engagement and a deeper understanding of the class material. The…

  11. Detection of trans–cis flips and peptide-plane flips in protein structures

    International Nuclear Information System (INIS)

    Touw, Wouter G.; Joosten, Robbie P.; Vriend, Gert

    2015-01-01

    A method is presented to detect peptide bonds that need either a trans–cis flip or a peptide-plane flip. A coordinate-based method is presented to detect peptide bonds that need correction either by a peptide-plane flip or by a trans–cis inversion of the peptide bond. When applied to the whole Protein Data Bank, the method predicts 4617 trans–cis flips and many thousands of hitherto unknown peptide-plane flips. A few examples are highlighted for which a correction of the peptide-plane geometry leads to a correction of the understanding of the structure–function relation. All data, including 1088 manually validated cases, are freely available and the method is available from a web server, a web-service interface and through WHAT-CHECK

  12. Detection of trans–cis flips and peptide-plane flips in protein structures

    Energy Technology Data Exchange (ETDEWEB)

    Touw, Wouter G., E-mail: wouter.touw@radboudumc.nl [Radboud University Medical Center, Geert Grooteplein-Zuid 26-28, 6525 GA Nijmegen (Netherlands); Joosten, Robbie P. [Netherlands Cancer Institute, Plesmanlaan 121, 1066 CX Amsterdam (Netherlands); Vriend, Gert, E-mail: wouter.touw@radboudumc.nl [Radboud University Medical Center, Geert Grooteplein-Zuid 26-28, 6525 GA Nijmegen (Netherlands)

    2015-07-28

    A method is presented to detect peptide bonds that need either a trans–cis flip or a peptide-plane flip. A coordinate-based method is presented to detect peptide bonds that need correction either by a peptide-plane flip or by a trans–cis inversion of the peptide bond. When applied to the whole Protein Data Bank, the method predicts 4617 trans–cis flips and many thousands of hitherto unknown peptide-plane flips. A few examples are highlighted for which a correction of the peptide-plane geometry leads to a correction of the understanding of the structure–function relation. All data, including 1088 manually validated cases, are freely available and the method is available from a web server, a web-service interface and through WHAT-CHECK.

  13. Ceramic packages for liquid-nitrogen operation

    International Nuclear Information System (INIS)

    Tong, H.M.; Yeh, H.L.; Goldblatt, R.D.

    1989-01-01

    To evaluate their compatibility for use in a liquid-nitrogen computer, metallized ceramic packages with test chips joined using IBM controlled-collapse solder (Pb-Sn) technology have been cycled between 30 0 C and liquid-nitrogen temperature. Room-temperature electrical resistance measurements were made at regular intervals of cycles to determine whether solder failure accompanied by a significant resistance increase had occurred. For the failed solder joints characterized by the highest thermal shear strain amplitude of 3.3 percent, the authors were able to estimate the number of liquid-nitrogen cycles needed to produce the corresponding failure rate using a room-temperature solder lifetime model. Cross-sectional examination of the failed solder joints using scanning electron microscopy and energy dispersive X-ray analysis indicated solder cracking occurring at the solder-ceramic interface. Chip pull tests on cycled packages yielded strengths far exceeding the minimal requirement. Mechanisms involving the formation of intermetallics were proposed to account for the observed solder fracture modes after liquid-nitrogen cycling and after chip pull. Furthermore, scanning electron microscopic examination of pulled chips in cycled packages showed no apparent sign of cracking in quartz and polyimide for chip insulation

  14. Use of Flipped Classroom Technology in Language Learning

    OpenAIRE

    Evseeva, Arina Mikhailovna; Solozhenko, Anton

    2015-01-01

    The flipped classroom as a key component of blended learning arouses great interest among researchers and educators nowadays. The technology of flipped classroom implies such organization of the educational process in which classroom activities and homework assignments are reversed. The present paper gives the overview of the flipped classroom technology and explores its potential for both teachers and students. The authors present the results obtained from the experience of the flipped class...

  15. Realtime 3D stress measurement in curing epoxy packaging

    DEFF Research Database (Denmark)

    Richter, Jacob; Hyldgård, A.; Birkelund, Karen

    2007-01-01

    This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process...

  16. MEMS packaging: state of the art and future trends

    Science.gov (United States)

    Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

    1998-07-01

    Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

  17. The evidence for 'flipping out': A systematic review of the flipped classroom in nursing education.

    Science.gov (United States)

    Betihavas, Vasiliki; Bridgman, Heather; Kornhaber, Rachel; Cross, Merylin

    2016-03-01

    The flipped classroom has generated interest in higher education providing a student-centred approach to learning. This has the potential to engage nursing students in ways that address the needs of today's students and the complexity of contemporary healthcare. Calls for educational reform, particularly in healthcare programs such as nursing, highlight the need for students to problem-solve, reason and apply theory into practice. The drivers towards student-based learning have manifested in team, problem and case-based learning models. Though there has been a shift towards the flipped classroom, comparatively little is known about how it is used in nursing curricula. The aims of this systematic review were to examine how the flipped classroom has been applied in nursing education and outcomes associated with this style of teaching. Five databases were searched and resulted in the retrieval of 21 papers: PubMed, CINAHL, EMBASE, Scopus and ERIC. After screening for inclusion/exclusion criteria, each paper was evaluated using a critical appraisal tool. Data extraction and analysis were completed on all included studies. This systematic review screened 21 titles and abstracts resulting in nine included studies. All authors critically appraised the quality of the included studies. Five studies were identified and themes identified were: academic performance outcomes, and student satisfaction implementing the flipped classroom. Use of the flipped classroom in higher education nursing programmes yielded neutral or positive academic outcomes and mixed results for satisfaction. Engagement of students in the flipped classroom model was achieved when academics informed and rationalised the purpose of the flipped classroom model to students. However, no studies in this review identified the evaluation of the process of implementing the flipped classroom. Studies examining the process and ongoing evaluation and refinement of the flipped classroom in higher education nursing

  18. Impacts of Flipped Classroom in High School Health Education

    Science.gov (United States)

    Chen, Li-Ling

    2016-01-01

    As advanced technology increasingly infiltrated into classroom, the flipped classroom has come to light in secondary educational settings. The flipped classroom is a new instructional approach that intends to flip the traditional teacher-centered classroom into student centered. The purpose of this research is to investigate the impact of the…

  19. Dynamics of spin-flip photon-assisted tunneling

    NARCIS (Netherlands)

    Braakman, F.R.; Danon, J.; Schreiber, L.R.; Wegscheider, W.; Vandersypen, L.M.K.

    2014-01-01

    We present time-resolved measurements of spin-flip photon-assisted tunneling and spin-flip relaxation in a doubly occupied double quantum dot. The photon-assisted excitation rate as a function of magnetic field indicates that spin-orbit coupling is the dominant mechanism behind the spin-flip under

  20. Performance and Motivation in a Middle School Flipped Learning Course

    Science.gov (United States)

    Winter, Joshua W.

    2018-01-01

    Flipped learning is a teaching approach that promotes collaboration by using technology to 'flip' traditional instruction. Content is delivered outside of class in the individual space (online) and the group space (classroom) is used to engage in collaborative activities. Flipped learning shifts the teacher's role toward facilitation. Research on…

  1. Deep Exploration of the Flipped Classroom before Implementing

    Science.gov (United States)

    Logan, Brenda

    2015-01-01

    This paper is a review of the literature that attempts to explain and document the literature on the flipped classroom. It examines 49 studies that explain the flipped approach in the classroom. This paper, particularly, delineates the history, the theory, benefits, criticisms, recommended practices, and what the research on flipping reveals.…

  2. Applying the Flipped Classroom Model to English Language Arts Education

    Science.gov (United States)

    Young, Carl A., Ed.; Moran, Clarice M., Ed.

    2017-01-01

    The flipped classroom method, particularly when used with digital video, has recently attracted many supporters within the education field. Now more than ever, language arts educators can benefit tremendously from incorporating flipped classroom techniques into their curriculum. "Applying the Flipped Classroom Model to English Language Arts…

  3. High energy hadron spin-flip amplitude

    International Nuclear Information System (INIS)

    Selyugin, O.V.

    2016-01-01

    The high-energy part of the hadron spin-flip amplitude is examined in the framework of the new high-energy general structure (HEGS) model of the elastic hadron scattering at high energies. The different forms of the hadron spin-flip amplitude are compared in the impact parameter representation. It is shown that the existing experimental data of the proton-proton and proton-antiproton elastic scattering at high energy in the region of the diffraction minimum and at large momentum transfer give support in the presence of the energy-independent part of the hadron spin-flip amplitude with the momentum dependence proposed in the works by Galynskii-Kuraev. [ru

  4. Experimental plug and play quantum coin flipping

    Science.gov (United States)

    Pappa, Anna; Jouguet, Paul; Lawson, Thomas; Chailloux, André; Legré, Matthieu; Trinkler, Patrick; Kerenidis, Iordanis; Diamanti, Eleni

    2014-04-01

    Performing complex cryptographic tasks will be an essential element in future quantum communication networks. These tasks are based on a handful of fundamental primitives, such as coin flipping, where two distrustful parties wish to agree on a randomly generated bit. Although it is known that quantum versions of these primitives can offer information-theoretic security advantages with respect to classical protocols, a demonstration of such an advantage in a practical communication scenario has remained elusive. Here we experimentally implement a quantum coin flipping protocol that performs strictly better than classically possible over a distance suitable for communication over metropolitan area optical networks. The implementation is based on a practical plug and play system, developed by significantly enhancing a commercial quantum key distribution device. Moreover, we provide combined quantum coin flipping protocols that are almost perfectly secure against bounded adversaries. Our results offer a useful toolbox for future secure quantum communications.

  5. Higgs Mass Textures in Flipped SU(5)

    CERN Document Server

    Ellis, Jonathan Richard; Rizos, J; Ellis, John

    1999-01-01

    We analyze the Higgs doublet-triplet mass splitting problem in the version of flipped SU(5) derived from string theory. Analyzing non-renormalizable terms up to tenth order in the superpotential, we identify a pattern of field vev's that keeps one pair of electroweak Higgs doublets light, while all other Higgs doublets and all Higgs triplets are kept heavy, with the aid of the economical missing-doublet mechanism found in the field-theoretical version of flipped SU(5). The solution predicts that second-generation charge -1/3 quarks and charged leptons are much lighter than those in the third generation.

  6. Calculability and stability in the flipped string

    Energy Technology Data Exchange (ETDEWEB)

    Lopez, J.L.; Nanopoulos, D.V. (Texas A and M Univ., College Station, TX (USA). Center for Theoretical Physics Houston Advanced Research Center (HARC), The Woodlands, TX (USA). Astroparticle Physics Group)

    1991-03-07

    We show that the highly successful structure of the recently proposed superstring flipped SU(5) model remains intact after the inclusion in the superpotential of the low-energy effective theory of all relevant string-induced nonrenormalizable terms. This structure provides for only two light Higgs doublets, hierarchical fermion mass matrices, and an adequate proton lifetime. We reach this conclusion explicit calculations using a recently derived set of rules to evaluate nonrenormalizable terms in the four-dimensional free fermionic formulation of superstrings. This remarkable stability of the infrared limit of the flipped string makes its experimental predictions trustworthy and hence its physical existence falsifiable. (orig.).

  7. Flipped neutrino emissivity from strange matter

    Energy Technology Data Exchange (ETDEWEB)

    Goyal, A.; Dutta, S. (Department of Physics and Astrophysics, University of Delhi, Delhi 110007 (India))

    1994-04-15

    Energy loss due to wrong helicity sterile neutrinos through spin flip processes leads to rapid cooling of nascent neutron stars. The observed cooling of neutron stars associated with SN 1987A seems to preclude the existence of Dirac neutrinos with a mass in excess of 20 keV. Assuming that nuclear matter in the core of the neutron star undergoes a phase transition to quark matter leading to a strange star or a neutron star with a strange matter core, we examine the emission of flipped Dirac neutrinos for two dominant processes: quark-neutrino scattering [[ital q]+[nu][sub [minus

  8. Quenching of spin-flip quadrupole transitions

    International Nuclear Information System (INIS)

    Castel, B.; Blunden, P.; Okuhara, Y.

    1985-01-01

    An increasing amount of experimental data indicates that spin-flip quadrupole transitions exhibit quenching effects similar to those reported earlier in (p,n) reactions involving l = 0 and l = 1 transitions. We present here two model calculations suggesting that the E2 spin-flip transitions are more affected than their M1 and M3 counterparts by the tensor and spin-orbit components of the nuclear force and should exhibit the largest quenching. We also review the experimental evidence corroborating our observations

  9. Blended Course with Flipped Classroom Approach

    DEFF Research Database (Denmark)

    Timcenko, Olga; Purwins, Hendrik; Triantafyllou, Evangelia

    2015-01-01

    This paper presents and analyses design decisions and development process of producing teaching materials for a blended course with flipped classroom approach at bachelor level at Aalborg University in Copenhagen, Denmark. Our experiences, as well as students’ reactions and opinions will be descr......This paper presents and analyses design decisions and development process of producing teaching materials for a blended course with flipped classroom approach at bachelor level at Aalborg University in Copenhagen, Denmark. Our experiences, as well as students’ reactions and opinions...

  10. Just in Time to Flip Your Classroom

    OpenAIRE

    Lasry, Nathaniel; Dugdale, Michael; Charles, Elizabeth

    2013-01-01

    With advocates like Sal Khan and Bill Gates, flipped classrooms are attracting an increasing amount of media and research attention. We had heard Khan's TED talk and were aware of the concept of inverted pedagogies in general. Yet, it really hit home when we accidentally flipped our classroom. Our objective was to better prepare our students for class. We set out to effectively move some of our course content outside of class and decided to tweak the Just-in-Time-Teaching approach (JiTT). To ...

  11. Flipped Classrooms for Advanced Science Courses

    Science.gov (United States)

    Tomory, Annette; Watson, Sunnie Lee

    2015-12-01

    This article explains how issues regarding dual credit and Advanced Placement high school science courses could be mitigated via a flipped classroom instructional model. The need for advanced high school courses will be examined initially, followed by an analysis of advanced science courses and the reform they are experiencing. Finally, it will conclude with an explanation of flipped classes as well as how they may be a solution to the reform challenges teachers are experiencing as they seek to incorporate more inquiry-based activities.

  12. RASPLAV package

    International Nuclear Information System (INIS)

    1990-01-01

    The RASPLAV package for investigation of post-accident mass transport and heat transfer processes is presented. The package performs three dimensional thermal conduction calculations in space nonuniform and temperature dependent conductivities and variable heat sources, taking into account phase transformations. The processes of free-moving bulk material, mixing of melting fuel due to advection and dissolution, and also evaporation/adsorption are modelled. Two-dimensional hydrodynamics with self-consistent heat transfer are also performed. The paper briefly traces the ways the solution procedures are carried out in the program package and outlines the major results of the simulation of reactor vessel melting after a core meltdown. The theoretical analysis and the calculations in this case were carried out in order to define the possibility of localization of the zone reminders. The interactions between the reminders and the concrete are simulated and evaluation of the interaction parameters is carried out. 4 refs. (R.Ts)

  13. 5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

    KAUST Repository

    Shamim, Atif

    2012-01-01

    A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator\\'s inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.

  14. 5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

    KAUST Repository

    Shamim, Atif; Arsalan, Muhammad; Hojjat, Nasrin; Roy, Langis

    2012-01-01

    A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.

  15. uFlip: Understanding Flash IO Patterns

    DEFF Research Database (Denmark)

    Bouganim, Luc; Jonsson, Bjørn; Bonnet, Philippe

    2009-01-01

    want to establish what kind of IOs should be favored (or avoided) when designing algorithms and architectures for flash-based systems. In this paper, we focus on flash IO patterns, that capture relevant distribution of IOs in time and space, and our goal is to quantify their performance. We define uFLIP...

  16. Flipped Instruction: Breakthroughs in Research and Practice

    Science.gov (United States)

    IGI Global, 2017

    2017-01-01

    The integration of technology into modern classrooms has enhanced learning opportunities for students. With increased access to educational content, students gain a better understanding of the concepts being taught. "Flipped Instruction: Breakthroughs in Research and Practice" is a comprehensive reference source for the latest scholarly…

  17. Intertwiner dynamics in the flipped vertex

    Energy Technology Data Exchange (ETDEWEB)

    Alesci, Emanuele; Bianchi, Eugenio; Magliaro, Elena; Perini, Claudio, E-mail: alesci@fis.uniroma3.i, E-mail: e.bianchi@sns.i, E-mail: elena.magliaro@gmail.co, E-mail: claude.perin@libero.i [Centre de Physique Theorique de Luminy, Case 907, F-13288 Marseille (France)

    2009-09-21

    We continue the semiclassical analysis, started in a previous paper, of the intertwiner sector of the flipped vertex spinfoam model. We use independently both a semi-analytical and a purely numerical approach, finding the correct behavior of wavepacket propagation and physical expectation values. In the end, we show preliminary results about correlation functions.

  18. Natural strong CP conservation in flipped physics

    Energy Technology Data Exchange (ETDEWEB)

    Frampton, P.H. (Institute of Field Physics, Department of Physics and Astronomy, University of North Carolina, Chapel Hill, NC (USA)); Kephart, T.W. (Department of Physics and Astronomy, Vanderbilt University, Nashville, TN (USA))

    1990-08-13

    A natural axion-free solution of the strong {ital CP} problem {ital at} {ital tree} {ital level} is noted within an E(6) grand unified theory. Using this as a springboard, it is shown that several flipped SU(5) theories which occur in superstring phenomenology contain within them a mechanism which enforces {bar {theta}}=0 at high accuracy.

  19. Flipping an Agricultural Education Teaching Methods Course

    Science.gov (United States)

    Conner, Nathan W.; Stripling, Christopher T.; Blythe, Jessica M.; Roberts, T. Grady; Stedman, Nicole L. P.

    2014-01-01

    Flipping or inverting a course is a relatively new approach to structuring a course. Using this method, the lectures traditionally delivered during regularly scheduled class time are converted to a media for delivery online, often in the form of videos. Learners are expected to view the online lectures prior to class. Then in turn, in-class time…

  20. The Flipped Classroom in World History

    Science.gov (United States)

    Gaughan, Judy E.

    2014-01-01

    The flipped Classroom is one in which lectures are presented as homework outside of class in online videos so that class time is reserved for engaging directly with the materials. This technique offers more personalized guidance and interaction with students, instead of lecturing. In this article, Judy Gaughan details her journey through choosing…

  1. Exploring Flipped Classroom Instruction in Calculus III

    Science.gov (United States)

    Wasserman, Nicholas H.; Quint, Christa; Norris, Scott A.; Carr, Thomas

    2017-01-01

    In an undergraduate Calculus III class, we explore the effect of "flipping" the instructional delivery of content on both student performance and student perceptions. Two instructors collaborated to determine daily lecture notes, assigned the same homework problems, and gave identical exams; however, compared to a more traditional…

  2. Flip-flopping binary black holes.

    Science.gov (United States)

    Lousto, Carlos O; Healy, James

    2015-04-10

    We study binary spinning black holes to display the long term individual spin dynamics. We perform a full numerical simulation starting at an initial proper separation of d≈25M between equal mass holes and evolve them down to merger for nearly 48 orbits, 3 precession cycles, and half of a flip-flop cycle. The simulation lasts for t=20 000M and displays a total change in the orientation of the spin of one of the black holes from an initial alignment with the orbital angular momentum to a complete antialignment after half of a flip-flop cycle. We compare this evolution with an integration of the 3.5 post-Newtonian equations of motion and spin evolution to show that this process continuously flip flops the spin during the lifetime of the binary until merger. We also provide lower order analytic expressions for the maximum flip-flop angle and frequency. We discuss the effects this dynamics may have on spin growth in accreting binaries and on the observational consequences for galactic and supermassive binary black holes.

  3. The Pedagogy of Flipped Instruction in Oman

    Science.gov (United States)

    Lane-Kelso, Mary

    2015-01-01

    "Flipping the classroom", or reverse instruction has been hailed the new pedagogical approach for preparing students for the 21st century. The idea behind this method is relatively simple. Instead of structuring class work to deliver direct instruction from the teacher in class and giving homework to students to practice outside of…

  4. Flipping Undergraduate Finite Mathematics: Findings and Implications

    Science.gov (United States)

    Guerrero, Shannon; Beal, Melissa; Lamb, Chris; Sonderegger, Derek; Baumgartel, Drew

    2015-01-01

    This paper reports on a research project that investigated the effects of a flipped instructional approach on student attitudes and achievement in a lower division university-level Finite Mathematics course. The project employed a mixed-methods design that included content exams, an attitude survey, open-ended student responses, observations, and…

  5. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  6. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  7. Packaging Technologies for High Temperature Electronics and Sensors

    Science.gov (United States)

    Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

    2013-01-01

    This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

  8. 3D packaging of a microfluidic system with sensory applications

    Science.gov (United States)

    Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

    1997-09-01

    Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

  9. Vibration characteristics of an inclined flip-flow screen panel in banana flip-flow screens

    Science.gov (United States)

    Xiong, Xiaoyan; Niu, Linkai; Gu, Chengxiang; Wang, Yinhua

    2017-12-01

    A banana flip-flow screen is an effective solution for the screening of high-viscosity, high-water and fine materials. As one of the key components, the vibration characteristics of the inclined flip-flow screen panel largely affects the screen performance and the processing capacity. In this paper, a mathematical model for the vibration characteristic of the inclined flip-flow screen panel is proposed based on Catenary theory. The reasonability of Catenary theory in analyzing the vibration characteristic of flip-flow screen panels is verified by a published experiment. Moreover, the effects of the rotation speed of exciters, the incline angle, the slack length and the characteristics of the screen on the vertical deflection, the vertical velocity and the vertical acceleration of the screen panel are investigated parametrically. The results show that the rotation speed of exciters, the incline angle, the slack length and the characteristics of the screen have significant effects on the vibrations of an inclined flip-flow screen panel, and these parameters should be optimized.

  10. Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

    NARCIS (Netherlands)

    Van Den Ende, D.A.; Van De Wiel, H.J.; Kusters, R.H.L.; Sridhar, A.; Schram, J.F.M.; Cauwe, M.; Van Den Brand, J.

    2014-01-01

    Ultra-thin chips of less than 20 μm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these

  11. Automating dChip: toward reproducible sharing of microarray data analysis

    Directory of Open Access Journals (Sweden)

    Li Cheng

    2008-05-01

    Full Text Available Abstract Background During the past decade, many software packages have been developed for analysis and visualization of various types of microarrays. We have developed and maintained the widely used dChip as a microarray analysis software package accessible to both biologist and data analysts. However, challenges arise when dChip users want to analyze large number of arrays automatically and share data analysis procedures and parameters. Improvement is also needed when the dChip user support team tries to identify the causes of reported analysis errors or bugs from users. Results We report here implementation and application of the dChip automation module. Through this module, dChip automation files can be created to include menu steps, parameters, and data viewpoints to run automatically. A data-packaging function allows convenient transfer from one user to another of the dChip software, microarray data, and analysis procedures, so that the second user can reproduce the entire analysis session of the first user. An analysis report file can also be generated during an automated run, including analysis logs, user comments, and viewpoint screenshots. Conclusion The dChip automation module is a step toward reproducible research, and it can prompt a more convenient and reproducible mechanism for sharing microarray software, data, and analysis procedures and results. Automation data packages can also be used as publication supplements. Similar automation mechanisms could be valuable to the research community if implemented in other genomics and bioinformatics software packages.

  12. Variable-flip-angle spin-echo imaging (VFSE)

    International Nuclear Information System (INIS)

    Kasai, Toshifumi; Sugimura, Kazuro; Kawamitsu, Hideaki; Yasui, Kiyoshi; Ishida, Tetsuya; Tsukamoto, Tetsuji.

    1990-01-01

    T 2 weighted imaging provides images with high object contrast for pathologic conditions in which the water content of tissues is increased. The authors predicted theoretical analysis of the effects of changing flip angle, and analyzed the effects in MR imaging of both phantoms and humans. Variable flip angle spin echo MR imaging (VFSE) with a 1,000/80 (repetition time msec/echo time msec) can obtain T 2 weighted image when flip angle is smaller than 80 degrees. VFSE with 40 to 60 degrees flip angle have higher contrast than other flip angle images. Signal to noise ratio (S/N) of VFSE are 55% at a 30 degree, 76% at a 45 degree, 92% at a 60 degree respectively as compared with conventional spin echo image (2000/80, flip angle 90 degree). VFSE is applicable to obtain T 2 weighted image reduced imaging time. (author)

  13. Flipped Learning With Simulation in Undergraduate Nursing Education.

    Science.gov (United States)

    Kim, HeaRan; Jang, YounKyoung

    2017-06-01

    Flipped learning has proliferated in various educational environments. This study aimed to verify the effects of flipped learning on the academic achievement, teamwork skills, and satisfaction levels of undergraduate nursing students. For the flipped learning group, simulation-based education via the flipped learning method was provided, whereas traditional, simulation-based education was provided for the control group. After completion of the program, academic achievement, teamwork skills, and satisfaction levels were assessed and analyzed. The flipped learning group received higher scores on academic achievement, teamwork skills, and satisfaction levels than the control group, including the areas of content knowledge and clinical nursing practice competency. In addition, this difference gradually increased between the two groups throughout the trial. The results of this study demonstrated the positive, statistically significant effects of the flipped learning method on simulation-based nursing education. [J Nurs Educ. 2017;56(6):329-336.]. Copyright 2017, SLACK Incorporated.

  14. The Flipped Learning Approach in Nursing Education: A Literature Review.

    Science.gov (United States)

    Presti, Carmen Rosa

    2016-05-01

    This integrative review examines the application of the pedagogical methodology-the flipped classroom-in nursing education. A literature search of the CINAHL, ERIC, and the National Library of Medicine (PubMed and MEDLINE) databases was conducted, using the following key words: flipped classroom, inverted classroom, and nursing education. Results of a literature search yielded 94 articles, with 13 meeting the criteria of the flipped classroom approach in nursing education. Themes identified include the theoretical underpinning, strategies for implementation of a flipped classroom, and student satisfaction with and outcomes of the flipped classroom approach. Syntheses of the findings indicate that the flipped classroom approach can yield positive outcomes, but further study of this methodology is needed to guide future implementation. [J Nurs Educ. 2016;55(5):252-257.]. Copyright 2016, SLACK Incorporated.

  15. Report on damaged FLIP TRIGA fuel

    International Nuclear Information System (INIS)

    Feltz, Donald E.; Randall, John D.; Schumacher, Robert F.

    1977-01-01

    Damaged FLIP elements were discovered, positioned adjacent to the transient rod. It then became apparent that this was not the failure of a defective, element but a heretofore unknown operating or design problem. The damaged elements are described as having bulges in the cladding and unevenly spaced dark rings along the fuelled portion of the element. Possible causes are investigated, including: defective fuel elements, incorrectly calculated power distributions in the core and in the elements, water leakage into the void follower of the transient rod, and improper safety limit for FLIP fuel. Based on measurements and calculations that have been experimentally verified it is concluded that the safety limit was not exceeded or even closely approached. It is also concluded that the problem is due entirely due to some phenomena occurring during pulsing, and that the steady state history of the fuel is not a factor

  16. Flip-flops of FK Comae Berenices

    DEFF Research Database (Denmark)

    Hackman, T.; Pelt, J.; Mantere, M. J.

    2013-01-01

    Context.FK Comae Berenices is a rapidly rotating magnetically active star, the light curve of which is modulated by cool spots on its surface. It was the first star where the "flip-flop" phenomenon was discovered. Since then, flip-flops in the spot activity have been reported in many other stars....... Follow-up studies with increasing length have shown, however, that the phenomenon is more complex than was thought right after its discovery. Aims. Therefore, it is of interest to perform a more thorough study of the evolution of the spot activity in FK Com. In this study, we analyse 15 years......-flop cannot be interpreted as a single phenomenon, where the main activity jumps from one active longitude to another. In some of our cases the phase shifts can be explained by differential rotation: two spot regions move with different angular velocity and even pass each other. Comparison between the methods...

  17. Scariest thing about climate change: climate flips

    International Nuclear Information System (INIS)

    Beaulieu, P.

    1997-01-01

    The idea that an increase in greenhouse gases will cause the global average temperature to rise slowly over the next decades was discussed. Studies of ice core from Greenland have shown that in the past climate shifts seem to have happened quickly. Some scientists fear that increasingly frequent extreme weather events could be a sign that the climate system is nearing its threshold and a rapid climate flip may be just ahead. In the case of global climatic system, the danger is that stresses from greenhouse gas effects are pushing the present system over the threshold where it must flip into a new warmer system that will be stable, but different from the climate on which our agriculture, economy, settlements and lives depend. 4 refs

  18. Flipped learning: should it replace didactic learning?

    Directory of Open Access Journals (Sweden)

    Osman A

    2017-10-01

    Full Text Available Abdirahman Osman, Seyed Ramin Jalal, Saeed Azizi Faculty of Medicine, St George’s Hospital Medical School, London, UKWe read with great interest the article by Pettit et al1 on the implementation of flipped learning. We wish to offer our perspective as medical students. The study concluded that a combination of lecture-based teaching accompanied with flipped learning activities appealed to most students. We find this response unsurprising. Pettit et al’s1 article documents the reason – the need for a variation in teaching styles for different themes by millennial learners of the modern student community.View the original paper by Pettit and colleagues.  

  19. Flipped neutrino emissivity from strange matter

    International Nuclear Information System (INIS)

    Goyal, A.; Dutta, S.

    1994-01-01

    Energy loss due to wrong helicity sterile neutrinos through spin flip processes leads to rapid cooling of nascent neutron stars. The observed cooling of neutron stars associated with SN 1987A seems to preclude the existence of Dirac neutrinos with a mass in excess of 20 keV. Assuming that nuclear matter in the core of the neutron star undergoes a phase transition to quark matter leading to a strange star or a neutron star with a strange matter core, we examine the emission of flipped Dirac neutrinos for two dominant processes: quark-neutrino scattering [q+ν - (bar ν + )→q+ν + (bar ν - )] and the quark neutrino pair bremsstrahlung process [q+q→q+q+ν - bar ν - (ν+bar ν + )]. We determine the composition of quark matter just after core bounce and examine the effect of neutrino degeneracy on the emission rate and mean free path of the wrong helicity neutrinos

  20. Flipped-Adversarial AutoEncoders

    OpenAIRE

    Zhang, Jiyi; Dang, Hung; Lee, Hwee Kuan; Chang, Ee-Chien

    2018-01-01

    We propose a flipped-Adversarial AutoEncoder (FAAE) that simultaneously trains a generative model G that maps an arbitrary latent code distribution to a data distribution and an encoder E that embodies an "inverse mapping" that encodes a data sample into a latent code vector. Unlike previous hybrid approaches that leverage adversarial training criterion in constructing autoencoders, FAAE minimizes re-encoding errors in the latent space and exploits adversarial criterion in the data space. Exp...

  1. The flipped classroom for medical students.

    Science.gov (United States)

    Morgan, Helen; McLean, Karen; Chapman, Chris; Fitzgerald, James; Yousuf, Aisha; Hammoud, Maya

    2015-06-01

    The objectives of this curricular innovation project were to implement a flipped classroom curriculum for the gynaecologic oncology topics of the obstetrics and gynaecology medical student clerkship, and to evaluate student satisfaction with the change. Four short online videos on the topics of endometrial hyperplasia, cervical dysplasia, evaluation of an adnexal mass, and ovarian cancer were created, and students were instructed to view them prior to a class-time active learning session. The Learning Activity Management System (lams) open-source online platform was used to create an active learning class-time activity that consisted of a coached discussion of cases. Student satisfaction with the two aspects of the flipped curriculum was obtained. In addition, lecture assessment for the gynaecologic oncology topics and aggregate student performance on the gynaecological oncology questions of the US National Board of Medical Examiners (NBME) Subject Examination were compared before and after implementation of the curriculum. Eighty-nine students rotated on the clerkship during the pilot period of analysis. Seventy-one students (80%) viewed the videos prior to the class session, and 84 (94%) attended the session. Student satisfaction was very high for both parts of the curriculum. There was no significant difference in aggregate student performance on the gynaecological oncology questions of the NBME Subject Examination. The flipped classroom curriculum demonstrates a promising platform for using technology to make better use of students' time Our implementation of the flipped classroom curriculum for the gynaecologic oncology topics successfully demonstrates a promising platform for using technology to make better use of our students' time, and for increasing their satisfaction with the necessary didactic learning of the clerkship. © 2015 John Wiley & Sons Ltd.

  2. The Implementation of A Flipped Classroom in Foreign Language Teaching

    OpenAIRE

    Ahmet BASAL

    2015-01-01

    Alongside the rise of educational technology, many teachers have been taking gradual but innovative steps to redesign their teaching methods. For example, in flipped learning or a flipped classroom, students watch instructional videos outside the classroom and do assignments or engage in activities inside the classroom. Language teachers are one group of educators exploring the flipped classroom. In foreign language classes, such an approach may offer great benefits for both the teachers and ...

  3. Flipped Classroom as an Alternative Strategy for Teaching Stoichiometry

    OpenAIRE

    Norrie E. Gayeta

    2017-01-01

    This study aimed to compare the effectiveness of flipped classroom and traditional classroom instruction in measuring conceptual change and to determine if flipped classroom instruction would be an alternative method of teaching to traditional lecture method. This study covered the level of conceptual understanding of students on stoichiometry and the type of conceptual change before and after exposure to flipped and traditional classroom environment. Qualitative and quantitative ...

  4. Assessment of learning gains in a flipped biochemistry classroom.

    Science.gov (United States)

    Ojennus, Deanna Dahlke

    2016-01-01

    The flipped classroom has become an increasingly popular pedagogical approach to teaching and learning. In this study, learning gains were assessed in a flipped biochemistry course and compared to gains in a traditional lecture. Although measured learning gains were not significantly different between the two courses, student perception of learning gains did differ and indicates a higher level of satisfaction with the flipped lecture format. © 2015 The International Union of Biochemistry and Molecular Biology.

  5. Lively package

    International Nuclear Information System (INIS)

    Jaremko, G.

    1997-01-01

    Progress on the Lloydminster Heavy Oil Interpretive Centre, sponsored by the Lloydminster Oilfield Technical Society and expected to open in late 1998, was discussed. Some $150,000 of the $750,000 budget is already in the bank, and another $150,000 is in the pipeline. The Centre will be added to an existing and well-established visitor's site. It is reported to contain a lively and imaginatively-designed exhibit package, and promises to become a combination of educational tool and tourist attraction for the town of Lloydminster, Saskatchewan, in the heart of heavy oil country

  6. Reflective Packaging

    Science.gov (United States)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  7. Nonlinear stability of spin-flip excitations

    International Nuclear Information System (INIS)

    Arunasalam, V.

    1975-01-01

    A rather complete discussion of the nonlinear electrodynamic behavior of a negative-temperature spin system is presented. The method presented here is based on a coupled set of master equations, one describing the time evolution of the photon (i.e., the spin-flip excitation) distribution function and the other describing the time evolution of the particle distribution function. It is found that the initially unstable (i.e., growing) spin-flip excitations grow to such a large amplitude that their nonlinear reaction on the particle distribution function becomes important. It is then shown that the initially totally inverted two-level spin system evolves rapidly (through this nonlinear photon-particle coupling) towards a quasilinear steady state where the populations of the spin-up and the spin-down states are equal to each other. Explicit expressions for the time taken to reach this quasilinear steady state and the energy in the spin-flip excitations at this state are also presented

  8. Ceramic ball grid array package stress analysis

    Science.gov (United States)

    Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

    2017-09-01

    The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

  9. Mapping of low flip angles in magnetic resonance

    International Nuclear Information System (INIS)

    Balezeau, Fabien; Saint-Jalmes, Herve; Eliat, Pierre-Antoine; Cayamo, Alejandro Bordelois

    2011-01-01

    Errors in the flip angle have to be corrected in many magnetic resonance imaging applications, especially for T1 quantification. However, the existing methods of B1 mapping fail to measure lower values of the flip angle despite the fact that these are extensively used in dynamic acquisition and 3D imaging. In this study, the nonlinearity of the radiofrequency (RF) transmit chain, especially for very low flip angles, is investigated and a simple method is proposed to accurately determine both the gain of the RF transmitter and the B1 field map for low flip angles. The method makes use of the spoiled gradient echo sequence with long repetition time (TR), such as applied in the double-angle method. It uses an image acquired with a flip angle of 90 0 as a reference image that is robust to B1 inhomogeneity. The ratio of the image at flip angle alpha to the image at a flip angle of 90 0 enables us to calculate the actual value of alpha. This study was carried out at 1.5 and 4.7 T, showing that the linearity of the RF supply system is highly dependent on the hardware. The method proposed here allows us to measure the flip angle from 1 0 to 60 0 with a maximal uncertainty of 10% and to correct T1 maps based on the variable flip angle method.

  10. Retention of Content Utilizing a Flipped Classroom Approach.

    Science.gov (United States)

    Shatto, Bobbi; LʼEcuyer, Kristine; Quinn, Jerod

    The flipped classroom experience promotes retention and accountability for learning. The authors report their evaluation of a flipped classroom for accelerated second-degree nursing students during their primary medical-surgical nursing course. Standardized HESI® scores were compared between a group of students who experienced the flipped classroom and a previous group who had traditional teaching methods. Short- and long-term retention was measured using standardized exams 3 months and 12 months following the course. Results indicated that short-term retention was greater and long- term retention was significantly great in the students who were taught using flipped classroom methodology.

  11. The flipped classroom: practices and opportunities for health sciences librarians.

    Science.gov (United States)

    Youngkin, C Andrew

    2014-01-01

    The "flipped classroom" instructional model is being introduced into medical and health sciences curricula to provide greater efficiency in curriculum delivery and produce greater opportunity for in-depth class discussion and problem solving among participants. As educators employ the flipped classroom to invert curriculum delivery and enhance learning, health sciences librarians are also starting to explore the flipped classroom model for library instruction. This article discusses how academic and health sciences librarians are using the flipped classroom and suggests opportunities for this model to be further explored for library services.

  12. Packaging technology of LEDs for LCD backlights

    International Nuclear Information System (INIS)

    Fan Manning; Liang Meng; Wang Guohong

    2009-01-01

    We design a package patterned with red and green emitting phosphors excited by a blue LED to emit tri-basic mixing color. For high backlight display quality, we compare several phosphors. According to our measurements, green phosphors 0752G, 0753G and red phosphor 0763R are preferred for producing a good backlight source. Compared to RGB-LED backlight units, this frame typically benefits the lighting uniformity, and can simplify the structures. It also provides higher color render and better CCT than the traditional package method of a yellow phosphor with a blue chip. However, its light efficiency needs to be further improved for the use of backlights for LCDs.

  13. UW VLSI chip tester

    Science.gov (United States)

    McKenzie, Neil

    1989-12-01

    We present a design for a low-cost, functional VLSI chip tester. It is based on the Apple MacIntosh II personal computer. It tests chips that have up to 128 pins. All pin drivers of the tester are bidirectional; each pin is programmed independently as an input or an output. The tester can test both static and dynamic chips. Rudimentary speed testing is provided. Chips are tested by executing C programs written by the user. A software library is provided for program development. Tests run under both the Mac Operating System and A/UX. The design is implemented using Xilinx Logic Cell Arrays. Price/performance tradeoffs are discussed.

  14. White LED with High Package Extraction Efficiency

    International Nuclear Information System (INIS)

    Yi Zheng; Stough, Matthew

    2008-01-01

    The goal of this project is to develop a high efficiency phosphor converting (white) Light Emitting Diode (pcLED) 1-Watt package through an increase in package extraction efficiency. A transparent/translucent monolithic phosphor is proposed to replace the powdered phosphor to reduce the scattering caused by phosphor particles. Additionally, a multi-layer thin film selectively reflecting filter is proposed between blue LED die and phosphor layer to recover inward yellow emission. At the end of the project we expect to recycle approximately 50% of the unrecovered backward light in current package construction, and develop a pcLED device with 80 lm/W e using our technology improvements and commercially available chip/package source. The success of the project will benefit luminous efficacy of white LEDs by increasing package extraction efficiency. In most phosphor-converting white LEDs, the white color is obtained by combining a blue LED die (or chip) with a powdered phosphor layer. The phosphor partially absorbs the blue light from the LED die and converts it into a broad green-yellow emission. The mixture of the transmitted blue light and green-yellow light emerging gives white light. There are two major drawbacks for current pcLEDs in terms of package extraction efficiency. The first is light scattering caused by phosphor particles. When the blue photons from the chip strike the phosphor particles, some blue light will be scattered by phosphor particles. Converted yellow emission photons are also scattered. A portion of scattered light is in the backward direction toward the die. The amount of this backward light varies and depends in part on the particle size of phosphors. The other drawback is that yellow emission from phosphor powders is isotropic. Although some backward light can be recovered by the reflector in current LED packages, there is still a portion of backward light that will be absorbed inside the package and further converted to heat. Heat generated

  15. ConfChem Conference on Flipped Classroom: Using a Blog to Flip a Classroom

    Science.gov (United States)

    Haile, January D.

    2015-01-01

    This communication summarizes one of the invited papers to the Flipped Classroom ACS Division of Chemical Education Committee on Computers in Chemical Education online ConfChem held from May 18 to June 24, 2014. Just in Time Teaching is a technique in which students read the material before class and respond to a few questions. In a first-year…

  16. Flipping Every Student? A Case Study of Content-Based Flipped Language Classrooms

    Science.gov (United States)

    Sun, Yu-Chih

    2017-01-01

    The study aims to explore university-level foreign language learners' perceptions of the content-based flipped classroom approach and factors influencing their perceptions. The research questions guiding the study are three-fold. (a) What attitudes and perceptions do students have about language and knowledge acquisition in the content-based…

  17. Using the Flipped Classroom to Enhance EFL Learning

    Science.gov (United States)

    Chen Hsieh, Jun Scott; Wu, Wen-Chi Vivian; Marek, Michael W.

    2017-01-01

    Instruction in English is a priority around the globe, but instructional methodologies have not always kept pace with the changing needs of students. To explore the benefits of the flipped classroom model for learners of English as a Foreign Language, the researchers used flipped learning and Wen's Output-driven/Input-enabled model to design a…

  18. Case Study: Guidelines for Producing Videos to Accompany Flipped Cases

    Science.gov (United States)

    Prud'homme-Généreux, Annie; Schiller, Nancy A.; Wild, John H.; Herreid, Clyde Freeman

    2017-01-01

    Three years ago, the "National Center for Case Study Teaching in Science" (NCCSTS) was inspired to merge the case study and flipped classroom approaches. The resulting project aimed to create the materials required to teach a flipped course in introductory biology by assigning videos as homework and case studies in the classroom. Three…

  19. Flipped Learning in TESOL: Definitions, Approaches, and Implementation

    Science.gov (United States)

    Bauer-Ramazani, Christine; Graney, John M.; Marshall, Helaine W.; Sabieh, Christine

    2016-01-01

    As the use of flipped learning spreads throughout educational disciplines, TESOL educators need to consider its potential for our field. This article, based on a computer-aided language learning (CALL) interest session at TESOL 2015, first looks at how best to describe and define flipped learning and examines the factors needed to make it…

  20. An Inquiry into Flipped Learning in Fourth Grade Math Instruction

    Science.gov (United States)

    D'addato, Teresa; Miller, Libbi R.

    2016-01-01

    The objective of this action research project was to better understand the impact of flipped learning on fourth grade math students in a socioeconomically disadvantaged setting. A flipped instructional model was implemented with the group of students enrolled in the researcher's class. Data was collected in the form of classroom observations,…

  1. Flipped SU(5) times U(1) in superconformal models

    Energy Technology Data Exchange (ETDEWEB)

    Bailin, D.; Katechou, E.K. (Sussex Univ., Brighton (United Kingdom). School of Mathematical and Physical Sciences); Love, A. (London Univ. (United Kingdom))

    1992-01-10

    This paper reports that flipped SU(5) {times} U(1) models are constructed in the framework of tensoring of N = 2 superconformal minimal models quotiented by discrete symmetries. Spontaneous breaking of flipped SU(5) {times} U(1) and extra U(1) factors in the gauge group along F-flat directions of the effective potential is studied.

  2. Partially Flipped Linear Algebra: A Team-Based Approach

    Science.gov (United States)

    Carney, Debra; Ormes, Nicholas; Swanson, Rebecca

    2015-01-01

    In this article we describe a partially flipped Introductory Linear Algebra course developed by three faculty members at two different universities. We give motivation for our partially flipped design and describe our implementation in detail. Two main features of our course design are team-developed preview videos and related in-class activities.…

  3. Examining Student Perceptions of Flipping an Agricultural Teaching Methods Course

    Science.gov (United States)

    Conner, Nathan W.; Rubenstein, Eric D.; DiBenedetto, Cathy A.; Stripling, Christopher T.; Roberts, T. Grady; Stedman, Nicole L. P.

    2014-01-01

    To meet the needs of the 21st century student, college instructors have been challenged to transform their classrooms from passive to active, "minds-on" learning environments. This qualitative study examined an active learning approach known as a flipped classroom and sought to explore student perceptions of flipping a teaching methods…

  4. Evaluation of a "Flipped Classroom" Approach in Management Education

    Science.gov (United States)

    Bergfjord, Ole Jakob; Heggernes, Tarjei

    2016-01-01

    In this paper, a "flipped classroom" approach is evaluated using three different datasets. We use student evaluations of the "flipped classroom" in particular, in addition to regular course evaluations and exam results for the past three years in order to allow for statistical comparisons. Overall, the results are quite…

  5. The Flipped Class: Experience in a University Business Communication Course

    Science.gov (United States)

    Sherrow, Tammy; Lang, Brenda; Corbett, Rod

    2016-01-01

    Business, like many other programs in higher education, continues to rely largely on traditional classroom environments. In this article, another approach to teaching and learning, the flipped classroom, is explored. After a review of relevant literature, the authors present their experience with the flipped classroom approach to teaching and…

  6. Assisted crack tip flipping under Mode I thin sheet tearing

    DEFF Research Database (Denmark)

    Felter, Christian Lotz; Nielsen, Kim Lau

    2017-01-01

    Crack tip flipping, where the fracture surface alternates from side to side in roughly 45° shear bands, seems to be an overlooked propagation mode in Mode I thin sheet tearing. In fact, observations of crack tip flipping is rarely found in the literature. Unlike the already established modes...

  7. Assessment of Learning Gains in a Flipped Biochemistry Classroom

    Science.gov (United States)

    Ojennus, Deanna Dahlke

    2016-01-01

    The flipped classroom has become an increasingly popular pedagogical approach to teaching and learning. In this study, learning gains were assessed in a flipped biochemistry course and compared to gains in a traditional lecture. Although measured learning gains were not significantly different between the two courses, student perception of…

  8. On Flipping First-Semester Calculus: A Case Study

    Science.gov (United States)

    Petrillo, Joseph

    2016-01-01

    High failure rates in calculus have plagued students, teachers, and administrators for decades, while science, technology, engineering, and mathematics programmes continue to suffer from low enrollments and high attrition. In an effort to affect this reality, some educators are "flipping" (or inverting) their classrooms. By flipping, we…

  9. Flipping College Algebra: Effects on Student Engagement and Achievement

    Science.gov (United States)

    Ichinose, Cherie; Clinkenbeard, Jennifer

    2016-01-01

    This study compared student engagement and achievement levels between students enrolled in a traditional college algebra lecture course and students enrolled in a "flipped" course. Results showed that students in the flipped class had consistently higher levels of achievement throughout the course than did students in the traditional…

  10. Assessing the Flipped Classroom in Operations Management: A Pilot Study

    Science.gov (United States)

    Prashar, Anupama

    2015-01-01

    The author delved into the results of a flipped classroom pilot conducted for an operations management course module. It assessed students' perception of a flipped learning environment after making them experience it in real time. The classroom environment was construed using a case research approach and students' perceptions were studied using…

  11. Flipping the Calculus Classroom: A Cost-Effective Approach

    Science.gov (United States)

    Young, Andrea

    2015-01-01

    This article discusses a cost-effective approach to flipping the calculus classroom. In particular, the emphasis is on low-cost choices, both monetarily and with regards to faculty time, that make the daunting task of flipping a course manageable for a single instructor. Student feedback and overall impressions are also presented.

  12. Flipped @ SBU: Student Satisfaction and the College Classroom

    Science.gov (United States)

    Gross, Benjamin; Marinari, Maddalena; Hoffman, Mike; DeSimone, Kimberly; Burke, Peggy

    2015-01-01

    In this paper, the authors find empirical support for the effectiveness of the flipped classroom model. Using a quasi-experimental method, the authors compared students enrolled in flipped courses to their counterparts in more traditional lecture-based ones. A survey instrument was constructed to study how these two different groups of students…

  13. Enhancing the Design and Analysis of Flipped Learning Strategies

    Science.gov (United States)

    Jenkins, Martin; Bokosmaty, Rena; Brown, Melanie; Browne, Chris; Gao, Qi; Hanson, Julie; Kupatadze, Ketevan

    2017-01-01

    There are numerous calls in the literature for research into the flipped learning approach to match the flood of popular media articles praising its impact on student learning and educational outcomes. This paper addresses those calls by proposing pedagogical strategies that promote active learning in "flipped" approaches and improved…

  14. Flipping to Teach the Conceptual Foundations of Successful Workplace Writing

    Science.gov (United States)

    Campbell, Kim Sydow

    2016-01-01

    Flipping originated in science, technology, engineering, and mathematics fields, where didactic transmission of conceptual knowledge has been the standard pedagogy. Flipping has resulted in additional focus on procedural knowledge within class meetings. This article argues that business and professional writing pedagogy, which already focuses…

  15. Flipping a College Calculus Course: A Case Study

    Science.gov (United States)

    Sahin, Alpaslan; Cavlazoglu, Baki; Zeytuncu, Yunus E.

    2015-01-01

    As online videos have become more easily available and more attractive to the new generation of students, and as new student-learning approaches tend to have more technology integration, the flipped classroom model has become very popular. The purpose of this study was to understand college students' views on flipped courses and investigate how…

  16. Flipped Instruction in a High School Science Classroom

    Science.gov (United States)

    Leo, Jonathan; Puzio, Kelly

    2016-01-01

    This paper reports on a quasi-experimental study examining the effectiveness of flipped instruction in a 9th grade biology classroom. This study included four sections of freshmen-level biology taught by the first author at a private secondary school in the Pacific Northwest. Using a block randomized design, two sections were flipped and two…

  17. Does the Flipped Classroom Improve Learning in Graduate Medical Education?

    Science.gov (United States)

    Riddell, Jeff; Jhun, Paul; Fung, Cha-Chi; Comes, James; Sawtelle, Stacy; Tabatabai, Ramin; Joseph, Daniel; Shoenberger, Jan; Chen, Esther; Fee, Christopher; Swadron, Stuart P

    2017-08-01

    The flipped classroom model for didactic education has recently gained popularity in medical education; however, there is a paucity of performance data showing its effectiveness for knowledge gain in graduate medical education. We assessed whether a flipped classroom module improves knowledge gain compared with a standard lecture. We conducted a randomized crossover study in 3 emergency medicine residency programs. Participants were randomized to receive a 50-minute lecture from an expert educator on one subject and a flipped classroom module on the other. The flipped classroom included a 20-minute at-home video and 30 minutes of in-class case discussion. The 2 subjects addressed were headache and acute low back pain. A pretest, immediate posttest, and 90-day retention test were given for each subject. Of 82 eligible residents, 73 completed both modules. For the low back pain module, mean test scores were not significantly different between the lecture and flipped classroom formats. For the headache module, there were significant differences in performance for a given test date between the flipped classroom and the lecture format. However, differences between groups were less than 1 of 10 examination items, making it difficult to assign educational importance to the differences. In this crossover study comparing a single flipped classroom module with a standard lecture, we found mixed statistical results for performance measured by multiple-choice questions. As the differences were small, the flipped classroom and lecture were essentially equivalent.

  18. The Perceived Effects of Flipped Teaching on Knowledge Acquisition

    Science.gov (United States)

    Newman, Galen; Kim, Jun-Hyun; Lee, Ryun Jung; Brown, Brandy A.; Huston, Sharon

    2016-01-01

    Increased demands for technological integration in higher education have resulted in new forms of course instruction. Under a flipped approach, students learn course materials outside the classroom while active learning methods are employed inside. This study focuses on the perceived effects of flipped instruction on knowledge acquisition in…

  19. Flipped Classroom: Effects on Education for the Case of Economics

    Science.gov (United States)

    Kurihara, Yutaka

    2016-01-01

    The notion of the flipped classroom has been received much attention in the literature as it may increase learning outcomes and learning effectiveness elementary and secondary education as well as university learning. In the author's class on international finance (economics) features a blended flipped classroom and lecture; questionnaires were…

  20. Evaluating the Flipped Classroom: A Randomized Controlled Trial

    Science.gov (United States)

    Wozny, Nathan; Balser, Cary; Ives, Drew

    2018-01-01

    Despite recent interest in flipped classrooms, rigorous research evaluating their effectiveness is sparse. In this study, the authors implement a randomized controlled trial to evaluate the effect of a flipped classroom technique relative to a traditional lecture in an introductory undergraduate econometrics course. Random assignment enables the…

  1. Flipping Preservice Elementary Teachers' Mathematics Anxieties

    Science.gov (United States)

    Dove, Anthony; Dove, Emily

    2017-01-01

    In preparing future elementary educators in mathematics, helping them overcome their anxieties of mathematics and teaching mathematics is paramount. This study examined how different instructional practices (in-class lecture, flipped learning with teacher-created videos, flipped classroom with Khan Academy videos) compared in improving students'…

  2. Teachers’ development in a flipped classroom for applied mathematics

    DEFF Research Database (Denmark)

    Triantafyllou, Evangelia; Timcenko, Olga; Kofoed, Lise

    2016-01-01

    In this paper, we discuss how the flipped classroom approach promoted teacher reflection and development. We look at the teaching cycle from a flipped instruction model perspective and we adjust it to cater for the reflection loops teachers are involved when designing, implementing and re-designi...

  3. Malaysian Students' Perceptions of Flipped Classroom: A Case Study

    Science.gov (United States)

    Zainuddin, Zamzami; Attaran, Mohammad

    2016-01-01

    The purpose of this study was to evaluate a class in University of Malaya where flipped learning was applied, and to examine students' perceptions and feedback towards flipped classroom. Data were collected using both quantitative and qualitative methods, i.e. survey, focus group and individual interviews. The results indicated that most students…

  4. The Implementation of a Flipped Classroom in Foreign Language Teaching

    Science.gov (United States)

    Basal, Ahmet

    2015-01-01

    Alongside the rise of educational technology, many teachers have been taking gradual but innovative steps to redesign their teaching methods. For example, in flipped learning or a flipped classroom, students watch instructional videos outside the classroom and do assignments or engage in activities inside the classroom. Language teachers are one…

  5. Implementing the Flipped Classroom in Teacher Education: Evidence from Turkey

    Science.gov (United States)

    Kurt, Gökçe

    2017-01-01

    The flipped classroom, a form of blended learning, is an emerging instructional strategy reversing a traditional lecture-based teaching model to improve the quality and efficiency of the teaching and learning process. The present article reports a study that focused on the implementation of the flipped approach in a higher education institution in…

  6. Re-Visiting the Flipped Classroom in a Design Context

    Science.gov (United States)

    Coyne, Richard David; Lee, John; Denitsa, Petrova

    2017-01-01

    After explaining our experience with a flipped classroom model of learning, we argue that the approach brings to light the dramaturgical and mediatized aspects of learning experiences that favour a closer connection between recorded content and "live" presentation by the lecturer. We adopted the flipped classroom approach to learning and…

  7. Flipped Classroom Research and Trends from Different Fields of Study

    Science.gov (United States)

    Zainuddin, Zamzami; Halili, Siti Hajar

    2016-01-01

    This paper aims to analyse the trends and contents of flipped classroom research based on 20 articles that report on flipped learning classroom initiatives from 2013-2015. The content analysis was used as a methodology to investigate methodologies, area of studies, technology tools or online platforms, the most frequently used keywords and works…

  8. Flipped Classrooms and Student Learning: Not Just Surface Gains

    Science.gov (United States)

    McLean, Sarah; Attardi, Stefanie M.; Faden, Lisa; Goldszmidt, Mark

    2016-01-01

    The flipped classroom is a relatively new approach to undergraduate teaching in science. This approach repurposes class time to focus on application and discussion; the acquisition of basic concepts and principles is done on the students' own time before class. While current flipped classroom research has focused on student preferences and…

  9. Exploring Flipped Classroom Effects on Second Language Learners' Cognitive Processing

    Science.gov (United States)

    Kim, Jeong-eun; Park, Hyunjin; Jang, Mijung; Nam, Hosung

    2017-01-01

    This study investigated the cognitive effects of the flipped classroom approach in a content-based instructional context by comparing second language learners' discourse in flipped vs. traditional classrooms in terms of (1) participation rate, (2) content of comments, (3) reasoning skills, and (4) interactional patterns. Learners in two intact…

  10. Curriculum Design of a Flipped Classroom to Enhance Haematology Learning

    Science.gov (United States)

    Porcaro, Pauline A.; Jackson, Denise E.; McLaughlin, Patricia M.; O'Malley, Cindy J.

    2016-01-01

    A common trend in higher education is the "flipped" classroom, which facilitates active learning during class. The flipped approach to teaching was instituted in a haematology "major" class and the students' attitudes and preferences for the teaching materials were surveyed. The curriculum design was explicit and involved four…

  11. Out of Classroom Instruction in the Flipped Classroom

    DEFF Research Database (Denmark)

    Triantafyllou, Evangelia; Timcenko, Olga

    2015-01-01

    This article presents experiences and student perceptions on the introduction of the flipped classroom model in two consecutive semesters at Media Technology department of Aalborg University, Copenhagen, Denmark. We introduced the flipped instruction model to a statistics course and a mathematics...

  12. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    Science.gov (United States)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

  13. ALICE chip processor

    CERN Multimedia

    Maximilien Brice

    2003-01-01

    This tiny chip provides data processing for the time projection chamber on ALICE. Known as the ALICE TPC Read Out (ALTRO), this device was designed to minimize the size and power consumption of the TPC front end electronics. This single chip contains 16 low-power analogue-to-digital converters with six million transistors of digital processing and 8 kbits of data storage.

  14. Neutrino helicity flips via electroweak interactions and SN1987a

    International Nuclear Information System (INIS)

    Gaemers, K.J.F.; Gandhi, R.; Lattimer, J.M.

    1988-10-01

    Electroweak mechanisms via which neutrinos may flip helicity and become sterile are examined in detail. Exact and approximate expressions for a variety of flip processes relevant in astrophysics and cosmology, mediated by W,Z, and γ exchange, including their interference, are derived. It is shown that within the context of the Standard Model with massive neutrinos, for νe→νe scattering, σ Z flip /σ γ flip ∼ 6 X 10 3 , independent of particle masses and energies to a good approximation. It is also shown that using some general considerations and the fact that the observed anti ν e burst from SN1987a lasted several seconds, these weak interaction flip cross-sections can be used to derive an upper limit on μ and τ neutrino masses of ∼ 40 keV. Finally, some other consequences for astrophysics in general and supernovae in particular are briefly discussed. 29 refs.; 47 schemes

  15. Flipping SU(5) out of Trouble

    CERN Document Server

    Ellis, Jonathan Richard; Walker, J; Ellis, John

    2002-01-01

    Minimal supersymmetric SU(5) GUTs are being squeezed by the recent values of alpha_s, sin^2 theta_W, the lower limit on the lifetime for p to nubar K decay, and other experimental data. We show how the minimal flipped SU(5) GUT survives these perils, accommodating the experimental values of alpha_s and sin^2 theta_W and other constraints, while yielding a p to e/mu+ pi0 lifetime beyond the present experimental limit but potentially accessible to a further round of experiments. We exemplify our analysis using a set of benchmark supersymmetric scenarios proposed recently in a constrained MSSM framework.

  16. Science packages

    Science.gov (United States)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  17. Assessing Behavioral Engagement in Flipped and Non-Flipped Mathematics Classrooms: Teacher Abilities and Other Potential Factors

    Science.gov (United States)

    Hodgson, Theodore R.; Cunningham, Abby; McGee, Daniel; Kinne, Lenore J.; Murphy, Teri J.

    2017-01-01

    There is a growing evidence that flipped classrooms are associated with increased levels of student engagement, as compared to engagement in "traditional" settings. Much of this research, however, occurs in post-secondary classrooms and is based upon self-reported engagement data. This study seeks to extend existing flipped classroom…

  18. Do Students Learn More from a Flip? An Exploration of the Efficacy of Flipped and Traditional Lessons

    Science.gov (United States)

    DeSantis, Joshua; Van Curen, Rebecca; Putsch, Jake; Metzger, Justin

    2015-01-01

    Flipped lesson planning, as popularized by Bergman & Sams (2012a), has been viewed by many as a revolutionary pedagogy, tailor-made for the twenty-first century classroom. Enthusiasm for flipped lesson planning has out-paced the collection of data that might determine its effectiveness. This paper presents the results of a study that compared…

  19. Flipping and Still Learning: Experiences of a Flipped Classroom Approach for a Third-Year Undergraduate Human Geography Course

    Science.gov (United States)

    Graham, Marnie; McLean, Jessica; Read, Alexander; Suchet-Pearson, Sandie; Viner, Venessa

    2017-01-01

    The flipped classroom approach, a form of blended learning, is currently popular in education praxis. Initial reports on the flipped classroom include that it offers opportunities to increase student engagement and build meaningful learning and teaching experiences. In this article, we analyse teacher and student experiences of a trial flipped…

  20. Experimental and theoretical analyses of package-on-package structure under three-point bending loading

    International Nuclear Information System (INIS)

    Jia Su; Wang Xi-Shu; Ren Huai-Hui

    2012-01-01

    High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates a chip scale package (CSP) in the top package and a fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results. (condensed matter: structural, mechanical, and thermal properties)

  1. Re-Envisioning the Archaic Higher Education Learning Environment: Implementation Processes for Flipped Classrooms

    Science.gov (United States)

    Rabidoux, Salena; Rottmann, Amy

    2018-01-01

    Flipped classrooms are often utilized in PK-12 classrooms; however, there is also a growing trend of flipped classrooms in higher education. This paper presents the benefits and limitations of implementing flipped classrooms in higher education as well as resources for integrating a flipped classroom design to instruction. The various technology…

  2. Fair loss-tolerant quantum coin flipping

    International Nuclear Information System (INIS)

    Berlin, Guido; Brassard, Gilles; Bussieres, Felix; Godbout, Nicolas

    2009-01-01

    Coin flipping is a cryptographic primitive in which two spatially separated players, who do not trust each other, wish to establish a common random bit. If we limit ourselves to classical communication, this task requires either assumptions on the computational power of the players or it requires them to send messages to each other with sufficient simultaneity to force their complete independence. Without such assumptions, all classical protocols are so that one dishonest player has complete control over the outcome. If we use quantum communication, on the other hand, protocols have been introduced that limit the maximal bias that dishonest players can produce. However, those protocols would be very difficult to implement in practice because they are susceptible to realistic losses on the quantum channel between the players or in their quantum memory and measurement apparatus. In this paper, we introduce a quantum protocol and we prove that it is completely impervious to loss. The protocol is fair in the sense that either player has the same probability of success in cheating attempts at biasing the outcome of the coin flip. We also give explicit and optimal cheating strategies for both players.

  3. Examination of shipping package 9975-04985

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2017-08-01

    Package 9975-04985 was examined following the identification of several unexpected conditions during surveillance activities. A heavy layer of corrosion product on the shield and the shield outer diameter being larger that allowed by drawing tolerances contributed to a very tight fit between the upper fiberboard assembly and shield. The average corrosion rate for the shield is estimated to be 0.0018 inch/year or less, which falls within the bounding rate of 0.002 inch/year that has been previously recommended for these packages. Several apparent foreign objects were noted within the package. One object observed on the air shield was identified as tape. The other objects were comprised of mostly fine fibers from the cane fiberboard. It is postulated that the upper and lower fiberboard assemblies were able to rub against each other due to the upper fiberboard assembly being held tight to the shield, and a few stray cane chips became frayed under vibratory motions.

  4. Development of a Flipped Medical School Dermatology Module.

    Science.gov (United States)

    Fox, Joshua; Faber, David; Pikarsky, Solomon; Zhang, Chi; Riley, Richard; Mechaber, Alex; O'Connell, Mark; Kirsner, Robert S

    2017-05-01

    The flipped classroom module incorporates independent study in advance of in-class instructional sessions. It is unproven whether this methodology is effective within a medical school second-year organ system module. We report the development, implementation, and effectiveness of the flipped classroom methodology in a second-year medical student dermatology module at the University of Miami Leonard M. Miller School of Medicine. In a retrospective cohort analysis, we compared attitudinal survey data and mean scores for a 50-item multiple-choice final examination of the second-year medical students who participated in this 1-week flipped course with those of the previous year's traditional, lecture-based course. Each group comprised nearly 200 students. Students' age, sex, Medical College Admission Test scores, and undergraduate grade point averages were comparable between the flipped and traditional classroom students. The flipped module students' mean final examination score of 92.71% ± 5.03% was greater than that of the traditional module students' 90.92% ± 5.51% ( P flipped methodology to attending live lectures or watching previously recorded lectures. The flipped classroom can be an effective instructional methodology for a medical school second-year organ system module.

  5. Results of a Flipped Classroom Teaching Approach in Anesthesiology Residents.

    Science.gov (United States)

    Martinelli, Susan M; Chen, Fei; DiLorenzo, Amy N; Mayer, David C; Fairbanks, Stacy; Moran, Kenneth; Ku, Cindy; Mitchell, John D; Bowe, Edwin A; Royal, Kenneth D; Hendrickse, Adrian; VanDyke, Kenneth; Trawicki, Michael C; Rankin, Demicha; Guldan, George J; Hand, Will; Gallagher, Christopher; Jacob, Zvi; Zvara, David A; McEvoy, Matthew D; Schell, Randall M

    2017-08-01

    In a flipped classroom approach, learners view educational content prior to class and engage in active learning during didactic sessions. We hypothesized that a flipped classroom improves knowledge acquisition and retention for residents compared to traditional lecture, and that residents prefer this approach. We completed 2 iterations of a study in 2014 and 2015. Institutions were assigned to either flipped classroom or traditional lecture for 4 weekly sessions. The flipped classroom consisted of reviewing a 15-minute video, followed by 45-minute in-class interactive sessions with audience response questions, think-pair-share questions, and case discussions. The traditional lecture approach consisted of a 55-minute lecture given by faculty with 5 minutes for questions. Residents completed 3 knowledge tests (pretest, posttest, and 4-month retention) and surveys of their perceptions of the didactic sessions. A linear mixed model was used to compare the effect of both formats on knowledge acquisition and retention. Of 182 eligible postgraduate year 2 anesthesiology residents, 155 (85%) participated in the entire intervention, and 142 (78%) completed all tests. The flipped classroom approach improved knowledge retention after 4 months (adjusted mean = 6%; P  = .014; d  = 0.56), and residents preferred the flipped classroom (pre = 46%; post = 82%; P  flipped classroom approach to didactic education resulted in a small improvement in knowledge retention and was preferred by anesthesiology residents.

  6. Studenters erfaringer med Flipped Classroom i en helsefagutdanning

    Directory of Open Access Journals (Sweden)

    Christine Tørris

    2015-12-01

    Full Text Available Background: The flipped classroom approach has gained increased attention in educational research literature. The purpose of this study was to investigate how students experience a flipped classroom approach in health education, compared to ordinary lectures. Method: Bachelor students (n=25 who watched the video-based material in the flipped classrooms pre-session, answered a questionnaire to evaluate their flipped classroom experience. The questionnaire consisted of both closed and open questions. Results: Ninety six per cent (24/25 of respondents found the video-based material in the pre-session useful. Seventy six per cent (19/25 of respondents found that the flipped classroom approach resulted in the highest learning outcome, over the traditional approach (16%, 4/25. Barriers to the flipped classroom approach was technical problems with the video-based material, such as screen view. Conclusion: The flipped classroom approach is promising as an acceptable approach for teaching in health science curricular in higher education.

  7. Packaging of silicon sensors for microfluidic bio-analytical applications

    International Nuclear Information System (INIS)

    Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

    2009-01-01

    A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

  8. Evaluation of a flipped classroom approach to learning introductory epidemiology.

    Science.gov (United States)

    Shiau, Stephanie; Kahn, Linda G; Platt, Jonathan; Li, Chihua; Guzman, Jason T; Kornhauser, Zachary G; Keyes, Katherine M; Martins, Silvia S

    2018-04-02

    Although the flipped classroom model has been widely adopted in medical education, reports on its use in graduate-level public health programs are limited. This study describes the design, implementation, and evaluation of a flipped classroom redesign of an introductory epidemiology course and compares it to a traditional model. One hundred fifty Masters-level students enrolled in an introductory epidemiology course with a traditional format (in-person lecture and discussion section, at-home assignment; 2015, N = 72) and a flipped classroom format (at-home lecture, in-person discussion section and assignment; 2016, N = 78). Using mixed methods, we compared student characteristics, examination scores, and end-of-course evaluations of the 2016 flipped classroom format and the 2015 traditional format. Data on the flipped classroom format, including pre- and post-course surveys, open-ended questions, self-reports of section leader teaching practices, and classroom observations, were evaluated. There were no statistically significant differences in examination scores or students' assessment of the course between 2015 (traditional) and 2016 (flipped). In 2016, 57.1% (36) of respondents to the end-of-course evaluation found watching video lectures at home to have a positive impact on their time management. Open-ended survey responses indicated a number of strengths of the flipped classroom approach, including the freedom to watch pre-recorded lectures at any time and the ability of section leaders to clarify targeted concepts. Suggestions for improvement focused on ways to increase regular interaction with lecturers. There was no significant difference in students' performance on quantitative assessments comparing the traditional format to the flipped classroom format. The flipped format did allow for greater flexibility and applied learning opportunities at home and during discussion sections.

  9. New generation of single-chip microcomputers focused on cost performance

    Energy Technology Data Exchange (ETDEWEB)

    Akao, Y.; Iwashita, H. (Hitachi, Ltd., Tokyo (Japan))

    1993-06-01

    A single-chip microcomputer which incorporates a CPU (central processing unit), memory, and peripheral functions in one chip has been increasingly applied to various fields as the heart of electronic equipment in terms of its economy, compactness, lightness, and suitability for mass production. In response to a wide variety of needs, a lineup must have substantial breadth with regard to performance, on-chip memory capacity, on-chip peripheral functions, operating voltage, and packaging. In particular, low-voltage high-speed operation, high integration, expanded address space, and improved software productivity, which are required for mobile communication terminals, are the common needs for single-chip microcomputers. In accordance with these needs, Hitachi has been actively developing new products. The present paper introduces Hitachi's lineup of single-chip microcomputers. 10 figs., 1 tab.

  10. Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

    NARCIS (Netherlands)

    Tilmans, H.A.C.; Ziad, H.; Jansen, Henricus V.; Di Monaco, O.; Jourdain, A.; De Raedt, W.; Rottenberg, X.; De Backer, E.; Decoussernaeker, A.; Baert, K.

    2001-01-01

    Reports on wafer-level packaged RF-MEMS switches fabricated in a commercial CMOS fab. Switch fabrication is based on a metal surface micromachining process. A novel wafer-level packaging scheme is developed, whereby the switches are housed in on-chip sealed cavities using benzocyclobutene (BCB) as

  11. Model studies of lipid flip-flop in membranes

    DEFF Research Database (Denmark)

    Parisio, Giulia; Ferrarini, Alberta; Sperotto, Maria Maddalena

    2016-01-01

    , and growth heavily depend. Such transverse motion—commonly called flip-flop—has been studied both experimentally and computationally. Experimental investigations face difficulties related to time-scales and probe-induced membrane perturbation issues. Molecular dynamics simulations play an important role...... for the molecular-level understanding of flip-flop. In this review we present a summary of the state of the art of computational studies of spontaneous flip-flop of phospholipids, sterols and fatty acids. Also, we highlight critical issues and strategies that have been developed to solve them, and what remains...

  12. Physical and transportation requirements for a FLIP fueled TRIGA

    International Nuclear Information System (INIS)

    Johnson, A.G.; Ringle, J.C.; Anderson, T.V.

    1977-01-01

    Several major changes to the OSTR Physical Security Plan were required by the NRC prior to the August 1976 receipt and installation of a new core consisting entirely of FLIP fuel. The general nature of these changes will be reviewed along with several decisions we faced during their implementation. At the previous TRIGA Owners' Conference in Salt Lake City, Utah, we reported on Oregon's regulatory program for research reactor emergency response planning and physical security. The latter program was of particular interest to us in light of the projected FLIP fuel shipments. The impact of the State's program for physical security of FLIP fuel during transportation will be presented. (author)

  13. Fitness Probability Distribution of Bit-Flip Mutation.

    Science.gov (United States)

    Chicano, Francisco; Sutton, Andrew M; Whitley, L Darrell; Alba, Enrique

    2015-01-01

    Bit-flip mutation is a common mutation operator for evolutionary algorithms applied to optimize functions over binary strings. In this paper, we develop results from the theory of landscapes and Krawtchouk polynomials to exactly compute the probability distribution of fitness values of a binary string undergoing uniform bit-flip mutation. We prove that this probability distribution can be expressed as a polynomial in p, the probability of flipping each bit. We analyze these polynomials and provide closed-form expressions for an easy linear problem (Onemax), and an NP-hard problem, MAX-SAT. We also discuss a connection of the results with runtime analysis.

  14. Integral Optimization of Systematic Parameters of Flip-Flow Screens

    Institute of Scientific and Technical Information of China (English)

    翟宏新

    2004-01-01

    The synthetic index Ks for evaluating flip-flow screens is proposed and systematically optimized in view of the whole system. A series of optimized values of relevant parameters are found and then compared with those of the current industrial specifications. The results show that the optimized value Ks approaches the one of those famous flip-flow screens in the world. Some new findings on geometric and kinematics parameters are useful for improving the flip-flow screens with a low Ks value, which is helpful in developing clean coal technology.

  15. Polarizing a stored proton beam by spin flip?

    International Nuclear Information System (INIS)

    Oellers, D.; Barion, L.; Barsov, S.; Bechstedt, U.; Benati, P.; Bertelli, S.; Chiladze, D.; Ciullo, G.; Contalbrigo, M.; Dalpiaz, P.F.; Dietrich, J.; Dolfus, N.; Dymov, S.; Engels, R.; Erven, W.; Garishvili, A.; Gebel, R.; Goslawski, P.

    2009-01-01

    We discuss polarizing a proton beam in a storage ring, either by selective removal or by spin flip of the stored ions. Prompted by recent, conflicting calculations, we have carried out a measurement of the spin-flip cross section in low-energy electron-proton scattering. The experiment uses the cooling electron beam at COSY as an electron target. The measured cross sections are too small for making spin flip a viable tool in polarizing a stored beam. This invalidates a recent proposal to use co-moving polarized positrons to polarize a stored antiproton beam.

  16. Research, Perspectives, and Recommendations on Implementing the Flipped Classroom.

    Science.gov (United States)

    Rotellar, Cristina; Cain, Jeff

    2016-03-25

    Flipped or inverted classrooms have become increasingly popular, and sometimes controversial, within higher education. Many educators have touted the potential benefits of this model and initial research regarding implementation has been primarily positive. The rationale behind the flipped classroom methodology is to increase student engagement with content, increase and improve faculty contact time with students, and enhance learning. This paper presents a summary of primary literature regarding flipped classrooms, discusses concerns and unanswered questions from both a student and faculty member perspective, and offers recommendations regarding implementation.

  17. Medicaid CHIP ESPC Database

    Data.gov (United States)

    U.S. Department of Health & Human Services — The Environmental Scanning and Program Characteristic (ESPC) Database is in a Microsoft (MS) Access format and contains Medicaid and CHIP data, for the 50 states and...

  18. Flipped cryptons and ultrahigh energy cosmic rays

    CERN Document Server

    Ellis, Jonathan Richard; Nanopoulos, D V

    2004-01-01

    Cryptons are metastable bound states of fractionally-charged particles that arise generically in the hidden sectors of models derived from heterotic string. We study their properties and decay modes in a specific flipped SU(5) model with long-lived four-particle spin-zero bound states called tetrons. We show that the neutral tetrons are metastable, and exhibit the tenth order nonrenormalizable superpotential operators responsible for their dominant decays. By analogy with QCD, we expect charged tetrons to be somewhat heavier, and to decay relatively rapidly via lower-order interactions that we also exhibit. The expected masses and lifetimes of the neutral tetrons make them good candidates for cold dark matter, and a potential source of the ultrahigh energy cosmic rays which have been observed, whereas the charged tetrons would have decayed in the early Universe.

  19. Bridging the gap with flipped classroom

    DEFF Research Database (Denmark)

    Selberg, Hanne; Topperzer, Martha

    the theoretical knowledge acquired during the course to their participation in the simulations. It is of pivotal importance that all students obtain hands-on experience during the sessions to reduce the theory-practice gap. The ongoing study has been pilot tested during three courses with participation of 90......Bridging the gap with flipped classroom Hanne Selberg, Metropolitan University College, Copenhagen, Martha Topperzer, University Hospital Rigshospitalet, Copenhagen, Denmark Background and aims Consistent with the strategy of increasing digitization and learner-centred teaching models....... The debriefing allows for students to reflect on how they applied their knowledge in the concrete patient situation which in turn promotes a positive learning experience. The learning objectives encompass both hands-on technical skills and non-technical communication skills enabling students to apply...

  20. Bit-commitment-based quantum coin flipping

    International Nuclear Information System (INIS)

    Nayak, Ashwin; Shor, Peter

    2003-01-01

    In this paper we focus on a special framework for quantum coin-flipping protocols, bit-commitment-based protocols, within which almost all known protocols fit. We show a lower bound of 1/16 for the bias in any such protocol. We also analyze a sequence of multiround protocols that tries to overcome the drawbacks of the previously proposed protocols in order to lower the bias. We show an intricate cheating strategy for this sequence, which leads to a bias of 1/4. This indicates that a bias of 1/4 might be optimal in such protocols, and also demonstrates that a more clever proof technique may be required to show this optimality

  1. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  2. Micro packaged MEMS pressure sensor for intracranial pressure measurement

    International Nuclear Information System (INIS)

    Liu Xiong; Yao Yan; Ma Jiahao; Zhang Zhaohua; Zhang Yanhang; Wang Qian; Ren Tianling

    2015-01-01

    This paper presents a micro packaged MEMS pressure sensor for intracranial pressure measurement which belongs to BioMEMS. It can be used in lumbar puncture surgery to measure intracranial pressure. Miniaturization is key for lumbar puncture surgery because the sensor must be small enough to allow it be placed in the reagent chamber of the lumbar puncture needle. The size of the sensor is decided by the size of the sensor chip and package. Our sensor chip is based on silicon piezoresistive effect and the size is 400 × 400 μm 2 . It is much smaller than the reported polymer intracranial pressure sensors such as liquid crystal polymer sensors. In terms of package, the traditional dual in-line package obviously could not match the size need, the minimal size of recently reported MEMS-based intracranial pressure sensors after packaging is 10 × 10 mm 2 . In this work, we are the first to introduce a quad flat no-lead package as the package form of piezoresistive intracranial pressure sensors, the whole size of the sensor is minimized to only 3 × 3 mm 2 . Considering the liquid measurement environment, the sensor is gummed and waterproof performance is tested; the sensitivity of the sensor is 0.9 × 10 −2 mV/kPa. (paper)

  3. Chip-size-packaged silicon microphones [for hearing instruments

    DEFF Research Database (Denmark)

    Müllenborn, Matthias; Rombach, Pirmin; Klein, Udo

    2001-01-01

    bonding. The devices are fully encapsulated and provided with a well-determined interface to the environment. The integrated microphones operate at a bias of 1.5 V and are expected to reach a sensitivity of 5 mV/Pa, an A-weighted equivalent input noise of 24 dB sound pressure level, and a power...

  4. Spin Flipping in the Presence of a Full Siberian Snake

    International Nuclear Information System (INIS)

    Blinov, B.B.; Anferov, V.A.; Derbenev, Y.S.; Kageya, T.; Krisch, A.D.; Lorenzon, W.; Ratner, L.G.; Sivers, D.W.; Sourkont, K.V.; Wong, V.K.; Chu, C.M.; Lee, S.Y.; Rinckel, T.; Schwandt, P.; Sperisen, F.; Przewoski, B. von; Sato, H.

    1998-01-01

    We have demonstrated for the first time spin flipping of a polarized proton beam stored in a ring containing a nearly 100% Siberian snake; we did this using a 'snake' depolarizing resonance induced by an rf solenoid magnet. By varying the rf solenoid close-quote s ramp time, frequency range, and voltage, we reached a spin-flip efficiency of about 91% . This spin-flip efficiency was probably reduced because the horizontal stable spin direction was not perpendicular to the longitudinal field of the rf solenoid, and was possibly reduced by nearby synchrotron sideband resonances. The planned use of a vertical rf dipole may improve the spin-flip efficiency. copyright 1998 The American Physical Society

  5. PENGARUH FLIPPED MASTERY CLASSROM TERHADAP PEROLEHAN HASIL BELAJAR KOGNITIF MAHASISWA

    Directory of Open Access Journals (Sweden)

    Muhammad Ridha

    2016-04-01

    Tujuan dari penelitian ini adalah untuk mengetahui pengaruh penerapan strategi flipped mastery classroom terhadap perolehan hasil belajar kognitif mahasiswa pada matakuliah psikologi pendidikan. Subjek dalam penelitian ini adalah mahasiswa Jurusan Teknologi Pendidikan Universitas Negeri Malang semester genap tahun ajaran 2015/2016 pada kelas utuh. Kelas eksperimen dibelajarkan dengan strategi flipped-mastery classroom dan kelas kontrol dibelajarkan dengan strategi tradisional.  Penelitian ini menggunakan rancangan kuasi eksperimen Non Equivalent Control Group Design. Hasil penelitian menunjukkan bahwa penerapan strategi flipped mastery classroom memberikan pengaruh positif terhadap perolehan hasil belajar kognitif mahasiswa. Perolehan hasil belajar kognitif mahasiswa yang dibelajarkan dengan strategi flipped-mastery lebih tinggi secara signifikan dari pada perolehan hasil belajar mahasiswa yang dibelajarkan dengan strategi tradisional.

  6. What millennial medical students say about flipped learning

    Science.gov (United States)

    Pettit, Robin K; McCoy, Lise; Kinney, Marjorie

    2017-01-01

    Flipped instruction is gaining popularity in medical schools, but there are unanswered questions such as the optimum amount of the curriculum to flip and whether flipped sessions should be mandatory. We were in a unique position to evaluate feedback from first-year medical students who had experienced both flipped and lecture-based courses during their first semester of medical school. A key finding was that the students preferred a variety of different learning formats over an “all or nothing” learning format. Learning format preferences did not necessarily align with perceptions of which format led to better course exam performance. Nearly 70% of respondents wanted to make their own decisions regarding attendance. Candid responses to open-ended survey prompts reflected millennial preferences for choice, flexibility, efficiency, and the ability to control the pace of their learning, providing insight to guide curricular improvements. PMID:28769600

  7. What millennial medical students say about flipped learning.

    Science.gov (United States)

    Pettit, Robin K; McCoy, Lise; Kinney, Marjorie

    2017-01-01

    Flipped instruction is gaining popularity in medical schools, but there are unanswered questions such as the optimum amount of the curriculum to flip and whether flipped sessions should be mandatory. We were in a unique position to evaluate feedback from first-year medical students who had experienced both flipped and lecture-based courses during their first semester of medical school. A key finding was that the students preferred a variety of different learning formats over an "all or nothing" learning format. Learning format preferences did not necessarily align with perceptions of which format led to better course exam performance. Nearly 70% of respondents wanted to make their own decisions regarding attendance. Candid responses to open-ended survey prompts reflected millennial preferences for choice, flexibility, efficiency, and the ability to control the pace of their learning, providing insight to guide curricular improvements.

  8. How the flip target behaves in four-dimensional space

    International Nuclear Information System (INIS)

    Antillon, A.; Kats, J.

    1985-01-01

    We use available coupling theory for understanding how a flip target in a 4-dimensional phase space reduces a gaussian beam of particles. Experimental evidence at the AGS can be qualitatively explained by this theory

  9. Step to improve neural cryptography against flipping attacks.

    Science.gov (United States)

    Zhou, Jiantao; Xu, Qinzhen; Pei, Wenjiang; He, Zhenya; Szu, Harold

    2004-12-01

    Synchronization of neural networks by mutual learning has been demonstrated to be possible for constructing key exchange protocol over public channel. However, the neural cryptography schemes presented so far are not the securest under regular flipping attack (RFA) and are completely insecure under majority flipping attack (MFA). We propose a scheme by splitting the mutual information and the training process to improve the security of neural cryptosystem against flipping attacks. Both analytical and simulation results show that the success probability of RFA on the proposed scheme can be decreased to the level of brute force attack (BFA) and the success probability of MFA still decays exponentially with the weights' level L. The synchronization time of the parties also remains polynomial with L. Moreover, we analyze the security under an advanced flipping attack.

  10. Flipped classroom model for learning evidence-based medicine.

    Science.gov (United States)

    Rucker, Sydney Y; Ozdogan, Zulfukar; Al Achkar, Morhaf

    2017-01-01

    Journal club (JC), as a pedagogical strategy, has long been used in graduate medical education (GME). As evidence-based medicine (EBM) becomes a mainstay in GME, traditional models of JC present a number of insufficiencies and call for novel models of instruction. A flipped classroom model appears to be an ideal strategy to meet the demands to connect evidence to practice while creating engaged, culturally competent, and technologically literate physicians. In this article, we describe a novel model of flipped classroom in JC. We present the flow of learning activities during the online and face-to-face instruction, and then we highlight specific considerations for implementing a flipped classroom model. We show that implementing a flipped classroom model to teach EBM in a residency program not only is possible but also may constitute improved learning opportunity for residents. Follow-up work is needed to evaluate the effectiveness of this model on both learning and clinical practice.

  11. Online Learning Room for ”Flipped Classroom”

    DEFF Research Database (Denmark)

    Bugge, Ellen Margrethe; Nielsen, Linda Susanna Hauschildt

    2014-01-01

    working actively and innovatively to create a didactic design in our online learning rooms in our LMS that satisfy the demands for flipped learning and at the same time adapted to the special needs of each learning module at the nursing education programme. Keywords: Online learning, flipped classroom......Abstract The “flipped classroom” learning concept is an alternative way of teaching & learning. The fundamental idea of the "flipped classroom" is to change the way students prepare for classes and the work that takes place when the students are together in the classroom. This integrates online...... learning with learning in the classroom. The learning room must support the students’ unassisted learning, their preparation for class and their preparation for supervision in both a motivating and clear way. At the Nursing Education Programme at University College Lillebaelt in Denmark, we have been...

  12. An evaluation of flipped e-learning experiences.

    Science.gov (United States)

    Jones-Bonofiglio, Kristen Dawn; Willett, Timothy; Ng, Stella

    2017-12-22

    The "flipped" classroom is an educational strategy gaining popularity for its growing evidence base that suggests it may successfully improve learning outcomes. Also known as reverse instruction, this approach has been typically implemented and studied in in-person post-secondary settings. The utilization of a flipped approach in the healthcare education literature has been examined in a wide range of contexts, but little has been written regarding continuing professional development (CPD). Therefore, with success in other contexts there is potential for the flipped classroom approach to enhance student satisfaction, learner engagement, and learning outcomes in the context of online education for CPD. In this paper, we describe the structure and format of such a course using a qualitative case study framework. This study contributes to a more comprehensive understanding of effective ways of overcoming distributed learning challenges in online CPD using a flipped approach.

  13. Teachers' development and reflection in the flipped classroom

    DEFF Research Database (Denmark)

    Triantafyllou, Evangelia; Timcenko, Olga; Kofoed, Lise

    2017-01-01

    The flipped classroom is an instruction method that has gained momentum during the last years due to technological advances allowing the online sharing of teaching material and learning activities. Bishop and Verleger defined the flipped classroom as “...an educational technique that consists...... of two parts: interactive group learning activities inside the classroom, and direct computer-based individual instruction outside the classroom” (Bishop & Verleger, 2013). So far, research on flipped classroom has mostly concentrated on student perceptions, engagement and achievement level, e...... course in order to adjust it to the flipped classroom model. We have also seen that these considerations have forced teachers to also reconsider the learning objectives of specific activities. Another aspect that promoted reflection was the production of video lectures. Finally, teachers reflected...

  14. Opto-electronic DNA chip-based integrated card for clinical diagnostics.

    Science.gov (United States)

    Marchand, Gilles; Broyer, Patrick; Lanet, Véronique; Delattre, Cyril; Foucault, Frédéric; Menou, Lionel; Calvas, Bernard; Roller, Denis; Ginot, Frédéric; Campagnolo, Raymond; Mallard, Frédéric

    2008-02-01

    Clinical diagnostics is one of the most promising applications for microfluidic lab-on-a-chip or lab-on-card systems. DNA chips, which provide multiparametric data, are privileged tools for genomic analysis. However, automation of molecular biology protocol and use of these DNA chips in fully integrated systems remains a great challenge. Simplicity of chip and/or card/instrument interfaces is amongst the most critical issues to be addressed. Indeed, current detection systems for DNA chip reading are often complex, expensive, bulky and even limited in terms of sensitivity or accuracy. Furthermore, for liquid handling in the lab-on-cards, many devices use complex and bulky systems, either to directly manipulate fluids, or to ensure pneumatic or mechanical control of integrated valves. All these drawbacks prevent or limit the use of DNA-chip-based integrated systems, for point-of-care testing or as a routine diagnostics tool. We present here a DNA-chip-based protocol integration on a plastic card for clinical diagnostics applications including: (1) an opto-electronic DNA-chip, (2) fluid handling using electrically activated embedded pyrotechnic microvalves with closing/opening functions. We demonstrate both fluidic and electric packaging of the optoelectronic DNA chip without major alteration of its electronical and biological functionalities, and fluid control using novel electrically activable pyrotechnic microvalves. Finally, we suggest a complete design of a card dedicated to automation of a complex biological protocol with a fully electrical fluid handling and DNA chip reading.

  15. Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Krozer, Viktor; Bach, H.-G.

    2009-01-01

    In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode...... conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates...

  16. Thermally excited proton spin-flip laser emission in tokamaks

    International Nuclear Information System (INIS)

    Arunasalam, V.; Greene, G.J.

    1993-07-01

    Based on statistical thermodynamic fluctuation arguments, it is shown here for the first time that thermally excited spin-flip laser emission from the fusion product protons can occur in large tokamak devices that are entering the reactor regime of operation. Existing experimental data from TFTR supports this conjecture, in the sense that these measurements are in complete agreement with the predictions of the quasilinear theory of the spin-flip laser

  17. Quantum protocol for cheat-sensitive weak coin flipping.

    Science.gov (United States)

    Spekkens, R W; Rudolph, Terry

    2002-11-25

    We present a quantum protocol for the task of weak coin flipping. We find that, for one choice of parameters in the protocol, the maximum probability of a dishonest party winning the coin flip if the other party is honest is 1/sqrt[2]. We also show that if parties restrict themselves to strategies wherein they cannot be caught cheating, their maximum probability of winning can be even smaller. As such, the protocol offers additional security in the form of cheat sensitivity.

  18. The Implementation of A Flipped Classroom in Foreign Language Teaching

    Directory of Open Access Journals (Sweden)

    Ahmet BASAL

    2015-10-01

    Full Text Available Alongside the rise of educational technology, many teachers have been taking gradual but innovative steps to redesign their teaching methods. For example, in flipped learning or a flipped classroom, students watch instructional videos outside the classroom and do assignments or engage in activities inside the classroom. Language teachers are one group of educators exploring the flipped classroom. In foreign language classes, such an approach may offer great benefits for both the teachers and students since classroom time can be applied to more interactive tasks. By extending classroom hours in this way, language teachers can focus on successfully addressing all subjects in the curriculum. The aim of this study is (a to gain insights into the perceptions of prospective English language teachers at a state university in Turkey on flipped classrooms and (b to introduce the implementation of a flipped classroom into an English language class. A total of 47 prospective English teachers participated in the study. Qualitative research design was used and data were collected via an open-ended question. Findings of the study indicated that pre-service English teachers had positive perceptions towards the use of the flipped classroom as an integral part of face-to-face courses. It can be concluded that flipped classroom was beneficial in terms of 4 categories based on the content analysis of the responses: learning at one’s own pace, advance student preparation, overcoming the limitations of class time, increasing the participation in the classroom. The study also provides recommendations towards LMS integration into courses in other English language teaching departments and for implementing flipped classrooms in language teaching.

  19. A contact-lens-shaped IC chip technology

    International Nuclear Information System (INIS)

    Liu, Ching-Yu; Yang, Frank; Teng, Chih-Chiao; Fan, Long-Sheng

    2014-01-01

    We report on novel contact-lens-shaped silicon integrated circuit chip technology for applications such as forming a conforming retinal prosthesis. This is achieved by means of patterning thin films of high residual stress on top of a shaped thin silicon substrate. Several strategies are employed to achieve curvatures of various amounts. Firstly, high residual stress on a thin film makes a thin chip deform into a designed three-dimensional shape. Also, a series of patterned stress films and ‘petal-shaped’ chips were fabricated and analyzed. Large curvatures can also be formed and maintained by the packaging process of bonding the chips to constraining elements such as thin-film polymer ring structures. As a demonstration, a complementary metal oxide semiconductor transistor (CMOS) image-sensing retina chip is made into a contact-lens shape conforming to a human eyeball 12.5 mm in radius. This non-planar and flexible chip technology provides a desirable device surface interface to soft tissues or non-planar bio surfaces and opens up many other possibilities for biomedical applications. (paper)

  20. Control of phospholipid flip-flop by transmembrane peptides

    International Nuclear Information System (INIS)

    Kaihara, Masanori; Nakao, Hiroyuki; Yokoyama, Hirokazu; Endo, Hitoshi; Ishihama, Yasushi; Handa, Tetsurou; Nakano, Minoru

    2013-01-01

    Highlights: ► Phospholipid flip-flop in transmembrane peptide-containing vesicles was investigated. ► Peptides that contained polar residues in the center of the transmembrane region promoted phospholipid flip-flop. ► A bioinformatics approach revealed the presence of polar residues in the transmembrane region of ER membrane proteins. ► Polar residues in ER membrane proteins possibly provide flippase-like activity. - Abstract: We designed three types of transmembrane model peptides whose sequence originates from a frequently used model peptide KALP23, and we investigated their effects on phospholipid flip-flop. Time-resolved small-angle neutron scattering and a dithionite fluorescent quenching assay demonstrated that TMP-L, which has a fully hydrophobic transmembrane region, did not enhance phospholipid flip-flop, whereas TMP-K and TMP-E, which have Lys and Glu, respectively, in the center of their transmembrane regions, enhanced phospholipid flip-flop. Introduction of polar residues in the membrane-spanning helices is considered to produce a locally polar region and enable the lipid head group to interact with the polar side-chain inside the bilayers, thereby reducing the activation energy for the flip-flop. A bioinformatics approach revealed that acidic and basic residues account for 4.5% of the central region of the transmembrane domain in human ER membrane proteins. Therefore, polar residues in ER membrane proteins are considered to provide flippase-like activity

  1. Study and practice of flipped classroom in optoelectronic technology curriculum

    Science.gov (United States)

    Shi, Jianhua; Lei, Bing; Liu, Wei; Yao, Tianfu; Jiang, Wenjie

    2017-08-01

    "Flipped Classroom" is one of the most popular teaching models, and has been applied in more and more curriculums. It is totally different from the traditional teaching model. In the "Flipped Classroom" model, the students should watch the teaching video afterschool, and in the classroom only the discussion is proceeded to improve the students' comprehension. In this presentation, "Flipped Classroom" was studied and practiced in opto-electronic technology curriculum; its effect was analyzed by comparing it with the traditional teaching model. Based on extensive and deep investigation, the phylogeny, the characters and the important processes of "Flipped Classroom" are studied. The differences between the "Flipped Classroom" and the traditional teaching model are demonstrated. Then "Flipped Classroom" was practiced in opto-electronic technology curriculum. In order to obtain high effectiveness, a lot of teaching resources were prepared, such as the high-quality teaching video, the animations and the virtual experiments, the questions that the students should finish before and discussed in the class, etc. At last, the teaching effect was evaluated through analyzing the result of the examination and the students' surveys.

  2. Flipped Classroom as an Alternative Strategy for Teaching Stoichiometry

    Directory of Open Access Journals (Sweden)

    Norrie E. Gayeta

    2017-11-01

    Full Text Available This study aimed to compare the effectiveness of flipped classroom and traditional classroom instruction in measuring conceptual change and to determine if flipped classroom instruction would be an alternative method of teaching to traditional lecture method. This study covered the level of conceptual understanding of students on stoichiometry and the type of conceptual change before and after exposure to flipped and traditional classroom environment. Qualitative and quantitative research methods were used in the study. Respondents were two sections of third year Bachelor of Secondary Education, Biological Science. Frequency, percentage, ranking, mean, standard deviation, Hake factor test, and t-test were the statistical tools applied to answer specific questions. Results showed profound increase towards conceptual change representing a shift from intuitive understanding to correct incomplete understanding level. Thus, change for the better, in theoretical type was determined from pretest to posttest of students exposed to flipped and traditional classroom. Results also indicated that there is no significant difference on students’ conceptual change on stoichiometry exposed to flipped and traditional classroom environment thus, flipped classroom instruction can be used as an alternative teaching method to traditional lecture method in teaching stoichiometry

  3. High coherence plane breaking packaging for superconducting qubits

    Science.gov (United States)

    Bronn, Nicholas T.; Adiga, Vivekananda P.; Olivadese, Salvatore B.; Wu, Xian; Chow, Jerry M.; Pappas, David P.

    2018-04-01

    We demonstrate a pogo pin package for a superconducting quantum processor specifically designed with a nontrivial layout topology (e.g., a center qubit that cannot be accessed from the sides of the chip). Two experiments on two nominally identical superconducting quantum processors in pogo packages, which use commercially available parts and require modest machining tolerances, are performed at low temperature (10 mK) in a dilution refrigerator and both found to behave comparably to processors in standard planar packages with wirebonds where control and readout signals come in from the edges. Single- and two-qubit gate errors are also characterized via randomized benchmarking, exhibiting similar error rates as in standard packages, opening the possibility of integrating pogo pin packaging with extensible qubit architectures.

  4. Enhanced thermaly managed packaging for III-nitride light emitters

    Science.gov (United States)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  5. Waste package performance assessment

    International Nuclear Information System (INIS)

    Lester, D.H.

    1981-01-01

    This paper describes work undertaken to assess the life-expectancy and post-failure nuclide release behavior of high-level and waste packages in a geologic repository. The work involved integrating models of individual phenomena (such as heat transfer, corrosion, package deformation, and nuclide transport) and using existing data to make estimates of post-emplacement behavior of waste packages. A package performance assessment code was developed to predict time to package failure in a flooded repository and subsequent transport of nuclides out of the leaking package. The model has been used to evaluate preliminary package designs. The results indicate, that within the limitation of model assumptions and data base, packages lasting a few hundreds of years could be developed. Very long lived packages may be possible but more comprehensive data are needed to confirm this

  6. Coupling structure in LED System-In-Package design: a physical responses-based critical parameter sheet like approach

    NARCIS (Netherlands)

    Borst, de E.C.M.; Gielen, A.W.J.; Etman, L.F.P.

    2012-01-01

    Abstract This paper introduces an approach to study the coupling structure between the design parameters and design objectives of a LED system-in-package (SiP) design concept [1]. The LED SiP is an integrated device that combines the LED chip with driver chips and potential other components in a

  7. Coupling structure in LED System-in-Package design: a physical responses-based critical parameter sheet like approach

    NARCIS (Netherlands)

    Borst, E.C.M. de; Gielen, A.W.J.; Etman, L.F.P.

    2012-01-01

    This paper introduces an approach to study the coupling structure between the design parameters and design objectives of a LED system-in-package (SiP) design concept [1]. The LED SiP is an integrated device that combines the LED chip with driver chips and potential other components in a single

  8. Packaging for Food Service

    Science.gov (United States)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  9. Waste Package Lifting Calculation

    International Nuclear Information System (INIS)

    H. Marr

    2000-01-01

    The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation

  10. High performance low cost interconnections for flip chip attachment with electrically conductive adhesive. Final report

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1998-05-01

    This final report is a compilation of final reports from each of the groups participating in the program. The main three groups involved in this effort are the Thomas J. Watson Research Center of IBM Corporation in Yorktown Heights, New York, Assembly Process Design of IBM Corporation in Endicott, New York, and SMT Laboratory of Universal Instruments Corporation in Binghamton, New York. The group at the research center focused on the conductive adhesive materials development and characterization. The group in process development focused on processing of the Polymer-Metal-Solvent Paste (PMSP) to form conductive adhesive bumps, formation of the Polymer-Metal Composite (PMC) on semiconductor devices and study of the bonding process to circuitized organic carriers, and the long term durability and reliability of joints formed using the process. The group at Universal Instruments focused on development of an equipment set and bonding parameters for the equipment to produce bond assembly tooling. Reports of each of these individual groups are presented here reviewing their technical efforts and achievements.

  11. A new functional and structural generation of JK edge-triggered flip-flops

    International Nuclear Information System (INIS)

    Stefanescu, I.

    1977-01-01

    A new type of logical structure for a JK edge-triggered flip-flop is proposed by the author. The structure facilitates flip-flop realizations, named ''jk-JK edge-triggered flip-flops'', satisfying more functional requirements, and offering an increased flexibility in logical design, with respect to the conventional JK edge-triggered flip-flops. The function of new flip-flops covers the function of JK edge-triggered flip-flops, known as integrated circuits. (author)

  12. Price of forest chips decreasing

    International Nuclear Information System (INIS)

    Hakkila, P.

    2001-01-01

    Use of forest chips was studied in 1999 in the national Puuenergia (Wood Energy) research program. Wood combusting heating plants were questioned about are the main reasons restricting the increment of the use of forest chips. Heating plants, which did not use forest chips at all or which used less than 250 m 3 (625 bulk- m 3 ) in 1999 were excluded. The main restrictions for additional use of forest chips were: too high price of forest chips; lack of suppliers and/or uncertainty of deliveries; technical problems of reception and processing of forest chips; insufficiency of boiler output especially in winter; and unsatisfactory quality of chips. The price of forest chips becomes relatively high because wood biomass used for production of forest chips has to be collected from wide area. Heavy equipment has to be used even though small fragments of wood are processed, which increases the price of chips. It is essential for forest chips that the costs can be pressed down because competition with fossil fuels, peat and industrial wood residues is hard. Low market price leads to the situation in which forest owner gets no price of the raw material, the entrepreneurs operate at the limit of profitability and renovation of machinery is difficult, and forest chips suppliers have to sell the chips at prime costs. Price of forest chips has decreased significantly during the past decade. Nominal price of forest chips is now lower than two decades ago. The real price of chips has decreased even more than the nominal price, 35% during the past decade and 20% during the last five years. Chips, made of small diameter wood, are expensive because the price includes the felling costs and harvesting is carried out at thinning lots. Price is especially high if chips are made of delimbed small diameter wood due to increased the work and reduced amount of chips. The price of logging residue chips is most profitable because cutting does not cause additional costs. Recovery of chips is

  13. Optimal selection of TLD chips

    International Nuclear Information System (INIS)

    Phung, P.; Nicoll, J.J.; Edmonds, P.; Paris, M.; Thompson, C.

    1996-01-01

    Large sets of TLD chips are often used to measure beam dose characteristics in radiotherapy. A sorting method is presented to allow optimal selection of chips from a chosen set. This method considers the variation

  14. Merganser Download Package

    Data.gov (United States)

    U.S. Environmental Protection Agency — This data download package contains an Esri 10.0 MXD, file geodatabase and copy of this FGDC metadata record. The data in this package are used in support of the...

  15. Creative Thinking Package

    Science.gov (United States)

    Jones, Clive

    1972-01-01

    A look at the latest package from a British managment training organization, which explains and demonstrates creative thinking techniques, including brainstorming. The package, designed for groups of twelve or more, consists of tapes, visuals, and associated exercises. (Editor/JB)

  16. Flipping the Continuing Medical Education Classroom: Validating a Measure of Attendees' Perceptions.

    Science.gov (United States)

    Stephenson, Christopher R; Wang, Amy T; Szostek, Jason H; Bonnes, Sara L; Ratelle, John T; Mahapatra, Saswati; Mandrekar, Jayawant N; Beckman, Thomas J; Wittich, Christopher M

    2016-01-01

    New teaching approaches for CME are needed. In flipped classrooms, coursework is completed beforehand and applied during class time. Studies of flipped classrooms and their potential benefits in CME have not been published. We sought to develop and validate an instrument measuring flipped classroom perceptions, identify whether participation changed perceptions, and determine which flipped classroom components were perceived as most effective. In this cross-sectional validation study, 167 participants in the Mayo Clinic's 2015 Internal Medicine Board Review course received surveys. Online modules were developed to deliver content before flipped classroom courses on acid-base disorders and electrolyte disorders. A flipped classroom perception instrument (FCPI) was developed and validated. The FCPI, with eight items structured on 5-point Likert scales, was given to participants before and after their flipped classroom experiences. Of the 167 participants, 111 returned surveys. Flipped classroom perceptions improved, with mean (SD) FCPI scores increasing from 3.74 (0.75) to 3.94 (0.76) (P flipped classrooms increased from 38% before the course to 53% after (P = .002). Positive changes in FCPI scores were unrelated to module completion. Most participants thought knowledge was enhanced by in-class sessions and online modules equally. The FCPI, the first validated measure of participants' perceptions of a CME flipped classroom, has strong validity evidence. Participants' perceptions of and preference for the flipped classroom improved after experiencing the flipped CME classroom. These findings support the need to further explore flipped classroom models in CME.

  17. Smart vision chips: An overview

    Science.gov (United States)

    Koch, Christof

    1994-01-01

    This viewgraph presentation presents four working analog VLSI vision chips: (1) time-derivative retina, (2) zero-crossing chip, (3) resistive fuse, and (4) figure-ground chip; work in progress on computing motion and neuromorphic systems; and conceptual and practical lessons learned.

  18. Flipped classrooms and student learning: not just surface gains.

    Science.gov (United States)

    McLean, Sarah; Attardi, Stefanie M; Faden, Lisa; Goldszmidt, Mark

    2016-03-01

    The flipped classroom is a relatively new approach to undergraduate teaching in science. This approach repurposes class time to focus on application and discussion; the acquisition of basic concepts and principles is done on the students' own time before class. While current flipped classroom research has focused on student preferences and comparative learning outcomes, there remains a lack of understanding regarding its impact on students' approaches to learning. Focusing on a new flipped classroom-based course for basic medical sciences students, the purpose of the present study was to evaluate students' adjustments to the flipped classroom, their time on task compared with traditional lectures, and their deep and active learning strategies. Students in this course worked through interactive online learning modules before in-class sessions. Class time focused on knowledge application of online learning module content through active learning methods. Students completed surveys and optional prequiz questions throughout the term to provide data regarding their learning approaches. Our results showed that the majority of students completed their prework in one sitting just before class. Students reported performing less multitasking behavior in the flipped classroom compared with lecture-based courses. Students valued opportunities for peer-peer and peer-instructor interactions and also valued having multiple modes of assessment. Overall, this work suggests that there is the potential for greater educational gains from the flipped classroom than the modest improvements in grades previously demonstrated in the literature; in this implementation of the flipped classroom, students reported that they developed independent learning strategies, spent more time on task, and engaged in deep and active learning. Copyright © 2016 The American Physiological Society.

  19. Packaging Printing Today

    OpenAIRE

    Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

  20. Genome packaging in viruses

    OpenAIRE

    Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

    2010-01-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

  1. Trends in Food Packaging.

    Science.gov (United States)

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  2. Constrained Sypersymmetric Flipped SU (5) GUT Phenomenology

    Energy Technology Data Exchange (ETDEWEB)

    Ellis, John; /CERN /King' s Coll. London; Mustafayev, Azar; /Minnesota U., Theor. Phys. Inst.; Olive, Keith A.; /Minnesota U., Theor. Phys. Inst. /Minnesota U. /Stanford U., Phys. Dept. /SLAC

    2011-08-12

    We explore the phenomenology of the minimal supersymmetric flipped SU(5) GUT model (CFSU(5)), whose soft supersymmetry-breaking (SSB) mass parameters are constrained to be universal at some input scale, Min, above the GUT scale, M{sub GUT}. We analyze the parameter space of CFSU(5) assuming that the lightest supersymmetric particle (LSP) provides the cosmological cold dark matter, paying careful attention to the matching of parameters at the GUT scale. We first display some specific examples of the evolutions of the SSB parameters that exhibit some generic features. Specifically, we note that the relationship between the masses of the lightest neutralino {chi} and the lighter stau {tilde {tau}}{sub 1} is sensitive to M{sub in}, as is the relationship between m{sub {chi}} and the masses of the heavier Higgs bosons A,H. For these reasons, prominent features in generic (m{sub 1/2}, m{sub 0}) planes such as coannihilation strips and rapid-annihilation funnels are also sensitive to Min, as we illustrate for several cases with tan {beta} = 10 and 55. However, these features do not necessarily disappear at large Min, unlike the case in the minimal conventional SU(5) GUT. Our results are relatively insensitive to neutrino masses.

  3. Constrained supersymmetric flipped SU(5) GUT phenomenology

    Energy Technology Data Exchange (ETDEWEB)

    Ellis, John [CERN, TH Division, PH Department, Geneva 23 (Switzerland); King' s College London, Theoretical Physics and Cosmology Group, Department of Physics, London (United Kingdom); Mustafayev, Azar [University of Minnesota, William I. Fine Theoretical Physics Institute, Minneapolis, MN (United States); Olive, Keith A. [University of Minnesota, William I. Fine Theoretical Physics Institute, Minneapolis, MN (United States); Stanford University, Department of Physics and SLAC, Palo Alto, CA (United States)

    2011-07-15

    We explore the phenomenology of the minimal supersymmetric flipped SU(5) GUT model (CFSU(5)), whose soft supersymmetry-breaking (SSB) mass parameters are constrained to be universal at some input scale, M{sub in}, above the GUT scale, M{sub GUT}. We analyze the parameter space of CFSU(5) assuming that the lightest supersymmetric particle (LSP) provides the cosmological cold dark matter, paying careful attention to the matching of parameters at the GUT scale. We first display some specific examples of the evolutions of the SSB parameters that exhibit some generic features. Specifically, we note that the relationship between the masses of the lightest neutralino {chi} and the lighter stau {tau}{sub 1} is sensitive to M{sub in}, as is the relationship between m{sub {chi}} and the masses of the heavier Higgs bosons A,H. For these reasons, prominent features in generic (m{sub 1/2},m{sub 0}) planes such as coannihilation strips and rapid-annihilation funnels are also sensitive to M{sub in}, as we illustrate for several cases with tan {beta}=10 and 55. However, these features do not necessarily disappear at large M{sub in}, unlike the case in the minimal conventional SU(5) GUT. Our results are relatively insensitive to neutrino masses. (orig.)

  4. Flipped spinfoam vertex and loop gravity

    Energy Technology Data Exchange (ETDEWEB)

    Engle, Jonathan; Pereira, Roberto [CPT, CNRS Case 907, Universite de la Mediterranee, F-13288 Marseille (France); Rovelli, Carlo [CPT, CNRS Case 907, Universite de la Mediterranee, F-13288 Marseille (France)], E-mail: rovelli@cpt.univ-mrs.fr

    2008-07-21

    We introduce a vertex amplitude for 4d loop quantum gravity. We derive it from a conventional quantization of a Regge discretization of euclidean general relativity. This yields a spinfoam sum that corrects some difficulties of the Barrett-Crane theory. The second class simplicity constraints are imposed weakly, and not strongly as in Barrett-Crane theory. Thanks to a flip in the quantum algebra, the boundary states turn out to match those of SO(3) loop quantum gravity-the two can be identified as eigenstates of the same physical quantities-providing a solution to the problem of connecting the covariant SO(4) spinfoam formalism with the canonical SO(3) spin-network one. The vertex amplitude is SO(3) and SO(4)-covariant. It rectifies the triviality of the intertwiner dependence of the Barrett-Crane vertex, which is responsible for its failure to yield the correct propagator tensorial structure. The construction provides also an independent derivation of the kinematics of loop quantum gravity and of the result that geometry is quantized.

  5. String threshold corrections and flipped SU(5)

    Energy Technology Data Exchange (ETDEWEB)

    Antoniadis, I. (Ecole Polytechnique, Centre de Physique Theorique, 91 - Palaiseau (France) Theory Div., CERN, Geneva (Switzerland)); Ellis, J. (Theory Div., CERN, Geneva (Switzerland)); Lacaze, R. (Service de Physique Theorique, CEN-Saclay, 91 - Gif-sur-Yvette (France)); Nanopoulos, D.V. (Center for Theoretical Physics, Dept. of Physics, Texas A and M Univ., College Station, TX (United States) Astroparticle Physics Group, HARC, The Woodlands, TX (United States) Theory Div., CERN, Geneva (Switzerland))

    1991-10-10

    We revise previous calculations of the effective unification scale m{sub SU} at which the extrapolated low-energy gauge couplings should appear to become equal, and we show explicitly how to calculate m{sub SU} in the fermionic construction of four-dimensional strings. In the case of the flipped SU(5) GUT derived from the string, the SU(5) and U(1) couplings defined in the anti Danti R scheme become equal to g{sub SU} at m{sub SU} {approx equal} 1.76 x g{sub SU} x 10{sup 18} GeV. This scale is significantly larger than m{sub GUT}, the scale at which the low-energy SU(3) and SU(2) couplings become equal if extrapolated using the renormalization group equations of the minimal supersymmetric extension of the standard model. The existence of an intermediate SU(5) x U(1) phase could have an observable effect on the calculated value of sin{sup 2}{theta}{sub w}. (orig.).

  6. Sharpening the flipped SU(5) string model

    Energy Technology Data Exchange (ETDEWEB)

    Lopez, J.L. (Center for Theoretical Physics, Dept. of Physics, Texas A and M Univ., College Station, TX (United States) Astroparticle Physics Group, Houston Advanced Research Center (HARC), The Woodlands, TX (United States)); Nanopoulos, D.V. (Center for Theoretical Physics, Dept. of Physics, Texas A and M Univ., College Station, TX (United States) Astroparticle Physics Group, Houston Advanced Research Center (HARC), The Woodlands, TX (United States) Theoretical Physics Div., CERN, Geneva (Switzerland))

    1991-10-17

    We present an improved version of the flipped SU(5) string model which accommodates numerous existing and expected features of the low-energy physics world, such as (i) two Higgs doublets with adequate mixing between them; (ii) hierarchy of quark and lepton masses, including relations such as m{sub s}/m{sub b}{proportional to}m{sub {mu}}/m{sub {tau}}, and m{sub c}/m{sub t}{sup 1/2.}, (iii) sufficiently suppressed proton decay operators, with gauge-boson mediated decays favoring p{yields}anti {nu}{sub {tau}}{pi}{sup +} and n{yields}anti {nu}{sub {tau}}, {pi}{sup 0}, (iv) nearly massless {nu}{sub {mu}} and {nu}{sub {tau}}, and {nu}{sub e} in the eV range; (v) heavy top quark (m{sub t} < or approx. 170 GeV) and large ratio of vacuum expectation values (tan {beta} < or approx. 33). (orig.).

  7. Flipped classroom or an active lecture?

    Science.gov (United States)

    Pickering, James D; Roberts, David J H

    2018-01-01

    Recent changes in anatomy education have seen the introduction of flipped classrooms as a replacement to the traditional didactic lecture. This approach utilizes the increasing availability of digital technology to create learning resources that can be accessed prior to attending class, with face-to-face sessions then becoming more student-centered via discussion, collaborative learning, and problem-solving activities. Although this approach may appear intuitive, this viewpoint commentary presents a counter opinion and highlights a simple alternative that utilizes evidence-based active learning approaches as part of the traditional lecture. The active lecture takes the traditional lecture, and (1) ensures the lecture content is relevant and has clear objectives, (2) contains lecture material that is designed according to the latest evidence-base, (3) complements it with additional supplementary material, (4) creates space to check prior understanding and knowledge levels, and (5) utilizes suitable technology to facilitate continual engagement and interaction. Clin. Anat. 31:118-121, 2018. © 2017 Wiley Periodicals, Inc. © 2017 Wiley Periodicals, Inc.

  8. Constrained Supersymmetric Flipped SU(5) GUT Phenomenology

    CERN Document Server

    Ellis, John; Olive, Keith A

    2011-01-01

    We explore the phenomenology of the minimal supersymmetric flipped SU(5) GUT model (CFSU(5)), whose soft supersymmetry-breaking (SSB) mass parameters are constrained to be universal at some input scale, $M_{in}$, above the GUT scale, $M_{GUT}$. We analyze the parameter space of CFSU(5) assuming that the lightest supersymmetric particle (LSP) provides the cosmological cold dark matter, paying careful attention to the matching of parameters at the GUT scale. We first display some specific examples of the evolutions of the SSB parameters that exhibit some generic features. Specifically, we note that the relationship between the masses of the lightest neutralino and the lighter stau is sensitive to $M_{in}$, as is the relationship between the neutralino mass and the masses of the heavier Higgs bosons. For these reasons, prominent features in generic $(m_{1/2}, m_0)$ planes such as coannihilation strips and rapid-annihilation funnels are also sensitive to $M_{in}$, as we illustrate for several cases with tan(beta)...

  9. Spin-flip tunneling in quantum dots

    Energy Technology Data Exchange (ETDEWEB)

    Schreiber, Lars; Braakman, Floris; Meunier, Tristan; Calado, Victor; Vandersypen, Lieven [Kavli Institute of NanoScience, Delft (Netherlands); Wegscheider, Werner [Institute for Experimental and Applied Physics, University of Regensburg (Germany)

    2010-07-01

    Electron spins in a gate-defined double quantum dot formed in a GaAs/(Al,Ga)As 2DEG are promising candidates for quantum information processing as coherent single spin rotation and spin swap has been demonstrated recently. In this system we investigate the two-electron spin dynamics in the presence of microwaves (5.20 GHz) applied to one side gate. During microwave excitation we observe characteristic photon assisted tunneling (PAT) peaks at the (1,1) to (0,2) charge transition. Some of the PAT peaks are attributed to photon tunneling events between the singlet S(0,2) and the singlet S(1,1) states, a spin-conserving transition. Surprisingly, other PAT peaks stand out by their different external magnetic field dependence. They correspond to tunneling involving a spin-flip, from the (0,2) singlet to a (1,1) triplet. The full spectrum of the observed PAT lines is captured by simulations. This process offers novel possibilities for 2-electron spin manipulation and read-out.

  10. Constrained supersymmetric flipped SU(5) GUT phenomenology

    International Nuclear Information System (INIS)

    Ellis, John; Mustafayev, Azar; Olive, Keith A.

    2011-01-01

    We explore the phenomenology of the minimal supersymmetric flipped SU(5) GUT model (CFSU(5)), whose soft supersymmetry-breaking (SSB) mass parameters are constrained to be universal at some input scale, M in , above the GUT scale, M GUT . We analyze the parameter space of CFSU(5) assuming that the lightest supersymmetric particle (LSP) provides the cosmological cold dark matter, paying careful attention to the matching of parameters at the GUT scale. We first display some specific examples of the evolutions of the SSB parameters that exhibit some generic features. Specifically, we note that the relationship between the masses of the lightest neutralino χ and the lighter stau τ 1 is sensitive to M in , as is the relationship between m χ and the masses of the heavier Higgs bosons A,H. For these reasons, prominent features in generic (m 1/2 ,m 0 ) planes such as coannihilation strips and rapid-annihilation funnels are also sensitive to M in , as we illustrate for several cases with tan β=10 and 55. However, these features do not necessarily disappear at large M in , unlike the case in the minimal conventional SU(5) GUT. Our results are relatively insensitive to neutrino masses. (orig.)

  11. The flipped classroom: now or never?

    Science.gov (United States)

    Hawks, Sharon J

    2014-08-01

    Pedagogical changes and new models of delivering educational content should be considered in the effort to address the recommendations of the 2007 Institute of Medicine report and Benner's recommendations on the radical transformation of nursing. Transition to the nurse anesthesia practice doctorate addresses the importance of these recommendations, but educational models and specific strategies on how to implement changes in educational models and systems are still emerging. The flipped classroom (FC) is generating a considerable amount of buzz in academic circles. The FC is a pedagogical model that employs asynchronous video lectures, reading assignments, practice problems, and other digital, technology-based resources outside the classroom, and interactive, group-based, problem-solving activities in the classroom. This FC represents a unique combination of constructivist ideology and behaviorist principles, which can be used to address the gap between didactic education and clinical practice performance. This article reviews recent evidence supporting use of the FC in health profession education and suggests ways to implement the FC in nurse anesthesia educational programs.

  12. Cleanup Verification Package for the 118-F-1 Burial Ground

    Energy Technology Data Exchange (ETDEWEB)

    E. J. Farris and H. M. Sulloway

    2008-01-10

    This cleanup verification package documents completion of remedial action for the 118-F-1 Burial Ground on the Hanford Site. This burial ground is a combination of two locations formerly called Minor Construction Burial Ground No. 2 and Solid Waste Burial Ground No. 2. This waste site received radioactive equipment and other miscellaneous waste from 105-F Reactor operations, including dummy elements and irradiated process tubing; gun barrel tips, steel sleeves, and metal chips removed from the reactor; filter boxes containing reactor graphite chips; and miscellaneous construction solid waste.

  13. Spin flipping a stored polarized proton beam with an rf magnetic field

    International Nuclear Information System (INIS)

    Hu, S.Q.; Blinov, B.B.; Caussyn, D.D.

    1995-01-01

    The authors studied the spin flipping of a vertically polarized, stored 139 MeV proton beam with an rf solenoid magnetic field. By sweeping the rf frequency through an rf depolarizing resonance, they made the spin flip. The spin flipping was more efficient for slower ramp times, and the spin flip efficiency peaked at some optimum ramp time that is not yet fully understood. Since frequent spin flipping could significantly reduce the systematic errors in scattering experiments using a stored polarized beam, it is very important to minimize the depolarization after each spin flip. In this experiment, with multiple spin flips, the authors found a polarization loss of 0.0000 ± 0.0005 per spin flip under the best conditions; this loss increased significantly for small changes in the conditions

  14. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  15. [Flipped classroom as a strategy to enhance active learning].

    Science.gov (United States)

    Wakabayashi, Noriyuki

    2015-03-01

    This paper reviews the introduction of a flipped class for fourth grade dentistry students, and analyzes the characteristics of the learning method. In fiscal 2013 and 2014, a series of ten three-hour units for removable partial prosthodontics were completed with the flipped class method; a lecture video of approximately 60 minutes was made by the teacher (author) and uploaded to the university's e-learning website one week before each class. Students were instructed to prepare for the class by watching the streaming video on their PC, tablet, or smartphone. In the flipped class, students were not given a lecture, but were asked to solve short questions displayed on screen, to make a short presentation about a part of the video lecture, and to discuss a critical question related to the main subject of the day. An additional team-based learning (TBL) session with individual and group answers was implemented. The average individual scores were considerably higher in the last two years, when the flipped method was implemented, than in the three previous years when conventional lectures were used. The following learning concepts were discussed: the role of the flipped method as an active learning strategy, the efficacy of lecture videos and short questions, students' participation in the class discussion, present-day value of the method, cooperation with TBL, the significance of active learning in relation with the students' learning ability, and the potential increase in the preparation time and workload for students.

  16. The influence of flip angle on the magic angle effect

    International Nuclear Information System (INIS)

    Zurlo, J.V.; Blacksin, M.F.; Karimi, S.

    2000-01-01

    Objective. To assess the impact of flip angle with gradient sequences on the ''magic angle effect''. We characterized the magic angle effect in various gradient echo sequences and compared the signal- to-noise ratios present on these sequences with the signal-to-noise ratios of spin echo sequences.Design. Ten normal healthy volunteers were positioned such that the flexor hallucis longus tendon remained at approximately at 55 to the main magnetic field (the magic angle). The tendon was imaged by a conventional spin echo T1- and T2-weighted techniques and by a series of gradient techniques. Gradient sequences were altered by both TE and flip angle. Signal-to-noise measurements were obtained at segments of the flexor hallucis longus tendon demonstrating the magic angle effect to quantify the artifact. Signal-to-noise measurements were compared and statistical analysis performed. Similar measurements were taken of the anterior tibialis tendon as an internal control.Results and conclusions. We demonstrated the magic angle effect on all the gradient sequences. The intensity of the artifact was affected by both the TE and flip angle. Low TE values and a high flip angle demonstrated the greatest magic angle effect. At TE values less than 30 ms, a high flip angle will markedly increase the magic angle effect. (orig.)

  17. Flipped classroom model for learning evidence-based medicine

    Directory of Open Access Journals (Sweden)

    Rucker SY

    2017-08-01

    Full Text Available Sydney Y Rucker,1 Zulfukar Ozdogan,1 Morhaf Al Achkar2 1School of Education, Indiana University, Bloomington, IN, 2Department of Family Medicine, School of Medicine, University of Washington, Seattle, WA, USA Abstract: Journal club (JC, as a pedagogical strategy, has long been used in graduate medical education (GME. As evidence-based medicine (EBM becomes a mainstay in GME, traditional models of JC present a number of insufficiencies and call for novel models of instruction. A flipped classroom model appears to be an ideal strategy to meet the demands to connect evidence to practice while creating engaged, culturally competent, and technologically literate physicians. In this article, we describe a novel model of flipped classroom in JC. We present the flow of learning activities during the online and face-to-face instruction, and then we highlight specific considerations for implementing a flipped classroom model. We show that implementing a flipped classroom model to teach EBM in a residency program not only is possible but also may constitute improved learning opportunity for residents. Follow-up work is needed to evaluate the effectiveness of this model on both learning and clinical practice. Keywords: evidence-based medicine, flipped classroom, residency education

  18. Student performance in a flipped classroom dental anatomy course.

    Science.gov (United States)

    Chutinan, S; Riedy, C A; Park, S E

    2017-11-09

    The purpose of this study was to assess dental student learning in a dental anatomy module between traditional lecture and flipped classroom cohorts. Two cohorts of predoctoral dental students (N = 70 within each cohort) participated in a dental anatomy module within an Introduction to the Dental Patient (IDP) course ([traditional/lecture cohort: academic year (AY) 2012, 2013] and [flipped classroom cohort: AY 2014, 2015]). For the dental anatomy module, both cohorts were evaluated on pre-clinical tooth waxing exercises immediately after each of five lectures and tooth identification after all lectures were given. Additionally, the cohorts' performance on the overall IDP course examination was compared. The flipped classroom cohort had statistically significant higher waxing scores (dental anatomy module) than students in the traditional classroom. There was no statistically significant difference for tooth identification scores and the overall IDP course examination between the traditional vs flipped approach cohorts. This is due to the latter two assessments conducted at the end of the course gave all students enough time to review the lecture content prior to the assessment resulting in similar scores for both cohorts. The flipped classroom cohort promoted students' individual learning and resulted in improved students' performance on immediate evaluation but not on the end of the course evaluation. Redesign of courses to include a new pedagogical approach should be carefully implemented and evaluated for student's educational success. © 2017 John Wiley & Sons A/S. Published by John Wiley & Sons Ltd.

  19. What millennial medical students say about flipped learning

    Directory of Open Access Journals (Sweden)

    Pettit RK

    2017-07-01

    Full Text Available Robin K Pettit, Lise McCoy, Marjorie Kinney School of Osteopathic Medicine in Arizona, A. T. Still University, Mesa, AZ, USA Abstract: Flipped instruction is gaining popularity in medical schools, but there are unanswered questions such as the optimum amount of the curriculum to flip and whether flipped sessions should be mandatory. We were in a unique position to evaluate feedback from first-year medical students who had experienced both flipped and lecture-based courses during their first semester of medical school. A key finding was that the students preferred a variety of different learning formats over an “all or nothing” learning format. Learning format preferences did not necessarily align with perceptions of which format led to better course exam performance. Nearly 70% of respondents wanted to make their own decisions regarding attendance. Candid responses to open-ended survey prompts reflected millennial preferences for choice, flexibility, efficiency, and the ability to control the pace of their learning, providing insight to guide ­curricular improvements. Keywords: flipped classroom, mandatory attendance, medical education, lecture-based, variety

  20. On flipping first-semester calculus: a case study

    Science.gov (United States)

    Petrillo, Joseph

    2016-05-01

    High failure rates in calculus have plagued students, teachers, and administrators for decades, while science, technology, engineering, and mathematics programmes continue to suffer from low enrollments and high attrition. In an effort to affect this reality, some educators are 'flipping' (or inverting) their classrooms. By flipping, we mean administering course content outside of the classroom and replacing the traditional in-class lectures with discussion, practice, group work, and other elements of active learning. This paper presents the major results from a three-year study of a flipped, first-semester calculus course at a small, comprehensive, American university with a well-known engineering programme. The data we have collected help quantify the positive and substantial effects of our flipped calculus course on failure rates, scores on the common final exam, student opinion of calculus, teacher impact on measurable outcomes, and success in second-semester calculus. While flipping may not be suitable for every teacher, every student, and in every situation, this report provides some evidence that it may be a viable option for those seeking an alternative to the traditional lecture model.

  1. Advancements in meat packaging.

    Science.gov (United States)

    McMillin, Kenneth W

    2017-10-01

    Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

  2. Edible packaging materials.

    Science.gov (United States)

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  3. Flipped Instruction with English Language Learners at a Newcomer High School

    Science.gov (United States)

    Graziano, Kevin J.; Hall, John D.

    2017-01-01

    Research on flipped instruction with English Language Learners (ELLs) is sparse. Data-driven flipped research conducted with ELLs primarily involves adult learners attending a college or university. This study examined the academic performance of secondary ELLs who received flipped instruction in an algebra course at a newcomer school compared to…

  4. Correlations between Learners' Initial EFL Proficiency and Variables of Clicker-Aided Flipped EFL Class

    Science.gov (United States)

    Yu, Zhonggen; Yu, Liheng

    2017-01-01

    Although the flipped class has been hotly discussed, the clicker-aided flipped EFL class (CFEC) still remains a mystery for most scholars. This study aims to determine the correlations between the initial EFL proficiency and other variables of the clicker-aided EFL flipped class. The sample was made up of randomly selected 79 participants (Female…

  5. To What Extent Does 'Flipping' Make Lessons Effective in a Multimedia Production Class?

    Science.gov (United States)

    Choi, Jaeho; Lee, Youngju

    2018-01-01

    This study examines the effects of a flipped classroom in a technology integration course for pre-service teachers. In total, 79 students were randomly assigned into a flipped classroom or a traditional classroom group and given three multimedia production tasks. Students in the flipped group reviewed an e-book for lessons on multimedia…

  6. Fat fraction bias correction using T1 estimates and flip angle mapping.

    Science.gov (United States)

    Yang, Issac Y; Cui, Yifan; Wiens, Curtis N; Wade, Trevor P; Friesen-Waldner, Lanette J; McKenzie, Charles A

    2014-01-01

    To develop a new method of reducing T1 bias in proton density fat fraction (PDFF) measured with iterative decomposition of water and fat with echo asymmetry and least-squares estimation (IDEAL). PDFF maps reconstructed from high flip angle IDEAL measurements were simulated and acquired from phantoms and volunteer L4 vertebrae. T1 bias was corrected using a priori T1 values for water and fat, both with and without flip angle correction. Signal-to-noise ratio (SNR) maps were used to measure precision of the reconstructed PDFF maps. PDFF measurements acquired using small flip angles were then compared to both sets of corrected large flip angle measurements for accuracy and precision. Simulations show similar results in PDFF error between small flip angle measurements and corrected large flip angle measurements as long as T1 estimates were within one standard deviation from the true value. Compared to low flip angle measurements, phantom and in vivo measurements demonstrate better precision and accuracy in PDFF measurements if images were acquired at a high flip angle, with T1 bias corrected using T1 estimates and flip angle mapping. T1 bias correction of large flip angle acquisitions using estimated T1 values with flip angle mapping yields fat fraction measurements of similar accuracy and superior precision compared to low flip angle acquisitions. Copyright © 2013 Wiley Periodicals, Inc.

  7. [Evaluation of flipped classroom teaching model in undergraduates education of oral and maxillofacial surgery].

    Science.gov (United States)

    Cai, Ming; Cao, Xia; Fang, Xiao; Wang, Xu-dong; Zhang, Li-li; Zheng, Jia-wei; Shen, Guo-fang

    2015-12-01

    Flipped classroom is a new teaching model which is different from the traditional teaching method. The history and characteristics of flipped classroom teaching model were introduced in this paper. A discussion on how to establish flipped classroom teaching protocol in oral and maxillofacial surgery education was carried out. Curriculum transformation, construction of education model and possible challenges were analyzed and discussed.

  8. The flipped classroom for professional development: part I. Benefits and strategies.

    Science.gov (United States)

    McDonald, Katie; Smith, Charlene M

    2013-10-01

    Individualizing the educational encounter is supported by flipping the classroom experience. This column offers an overview and describes the benefits of flipping the classroom. Part II will explore the practicalities and pedagogy of lecture capture using podcasts and videos, a technology strategy used in flipping the classroom. Copyright 2013, SLACK Incorporated.

  9. Implementing and Assessing a Flipped Classroom Model for First-Year Engineering Design

    Science.gov (United States)

    Saterbak, Ann; Volz, Tracy; Wettergreen, Matthew

    2016-01-01

    Faculty at Rice University are creating instructional resources to support teaching first-year engineering design using a flipped classroom model. This implementation of flipped pedagogy is unusual because content-driven, lecture courses are usually targeted for flipping, not project-based design courses that already incorporate an abundance of…

  10. Scaffolded Semi-Flipped General Chemistry Designed to Support Rural Students' Learning

    Science.gov (United States)

    Lenczewski, Mary S.

    2016-01-01

    Students who lack academic maturity can sometimes feel overwhelmed in a fully flipped classroom. Here an alternative, the Semi-Flipped method, is discussed. Rural students, who face unique challenges in transitioning from high school learning to college-level learning, can particularly profit from the use of the Semi-Flipped method in the General…

  11. The Flipped Classroom in Systems Analysis & Design: Leveraging Technology to Increase Student Engagement

    Science.gov (United States)

    Saulnier, Bruce M.

    2015-01-01

    Problems associated with the ubiquitous presence of technology on college campuses are discussed and the concept of the flipped classroom is explained. Benefits of using the flipped classroom to offset issues associated with the presence of technology in the classroom are explored. Fink's Integrated Course Design is used to develop a flipped class…

  12. The Benefits, Drawbacks, and Challenges of Using the Flipped Classroom in an Introduction to Psychology Course

    Science.gov (United States)

    Roehling, Patricia V.; Root Luna, Lindsey M.; Richie, Fallon J.; Shaughnessy, John J.

    2017-01-01

    Flipped pedagogy has become a popular approach in education. While preliminary research suggests that the flipped classroom has a positive effect on learning in Science, Technology, Engineering, and Mathematics and quantitative courses, the research on the flipped classroom in a content heavy social science course is minimal and contradictory. We…

  13. K-12 Teacher Perceptions Regarding the Flipped Classroom Model for Teaching and Learning

    Science.gov (United States)

    Gough, Evan; DeJong, David; Grundmeyer, Trent; Baron, Mark

    2017-01-01

    A great deal of evidence can be cited from higher education literature on the effectiveness of the flipped classroom; however, very little research was discovered on the flipped classroom at the K-12 level. This study examined K-12 teachers' perceptions regarding the flipped classroom and differences in teachers' perceptions based on grade level…

  14. Implementing the Flipped Classroom: An Exploration of Study Behaviour and Student Performance

    Science.gov (United States)

    Boevé, Anja J.; Meijer, Rob R.; Bosker, Roel J.; Vugteveen, Jorien; Hoekstra, Rink; Albers, Casper J.

    2017-01-01

    The flipped classroom is becoming more popular as a means to support student learning in higher education by requiring students to prepare before lectures and actively engaging students during lectures. While some research has been conducted into student performance in the flipped classroom, students' study behaviour throughout a flipped course…

  15. An Investigation of the Use of the "Flipped Classroom" Pedagogy in Secondary English Language Classrooms

    Science.gov (United States)

    Yang, Chi Cheung Ruby

    2017-01-01

    Aim/Purpose: To examine the use of a flipped classroom in the English Language subject in secondary classrooms in Hong Kong. Background: The research questions addressed were: (1) What are teachers' perceptions towards the flipped classroom pedagogy?; (2) How can teachers transfer their flipped classroom experiences to teaching other…

  16. Quark loops and spin-flip effects in pomeron exchange

    International Nuclear Information System (INIS)

    Goloskokov, S.V.

    1991-01-01

    On the basis of QCD at large distances with taking account of some nonperturbative properties of the theory, the possibility of spin-flip effects in high energy hadron processes at fixed momenta transfer is investigated. It is shown that the diagrams with the quark loops in QCD at large distances may lead to the spin-flip amplitude growing as s for s→∞, t-fixed. The confirmation of this result is obtained by calculations of the nonleading contributions from quark loops in t-channel exchange in QED up to the end. Physical mechanisms leading to that behaviour of the spin-flip amplitude is discussed. So we conclude that the pomeron has a complicated spin structure. (orig.)

  17. Is neutralino dark matter compatible with flipped SU(5) models

    Energy Technology Data Exchange (ETDEWEB)

    McDonald, J.

    1989-07-13

    We consider the possibility that the lightest supersymmetric particle in flipped SUSY SU(5)xU(1) models is cosmologically stable and corresponds to a neutralino. Previous studies of dark matter in flipped SUSY SU(5) models have suggested that the decay of the oscillations of the SU(5) breaking scalar field would result in too many neutralinos, if they are stable. We show that it is possible for an acceptable density of neutralinos to occur in the case where the neutralino corresponds to a light photino, if the temperature at the end of the oscillation dominated period is flipped SU(5) models. Direct detection of dark matter in forthcoming experiments will therefore not eliminate this class of models. (orig.).

  18. THE IMPLEMENTATION OF FLIPPED CLASSROOM MODEL IN EFL WRITING

    Directory of Open Access Journals (Sweden)

    Rida Afrilyasanti

    2016-10-01

    Full Text Available Flipped classroom is an approach to learning to write that allows teachers to have one-on-one assistance to help learners in the “during writing” stage in the classroom. Theories are given to the students in a video lectures to watch before class. Because problems in writing mostly occur in “during writing” stage, teacher assistance is crucial. This paper aims to share theoretical review and research findings pertaining to the implementation of flipped classroom model to EFL writing. Research findings show that flipped classroom is able to give greater opportunities for interactive sessions in class which focus on the students’ own concerns, questions, and needs. Therefore, students’ difficulties in “during writing” stage can be minimized

  19. Flipped Instruction in a High School Science Classroom

    Science.gov (United States)

    Leo, Jonathan; Puzio, Kelly

    2016-10-01

    This paper reports on a quasi-experimental study examining the effectiveness of flipped instruction in a 9th grade biology classroom. This study included four sections of freshmen-level biology taught by the first author at a private secondary school in the Pacific Northwest. Using a block randomized design, two sections were flipped and two remained traditional. The quiz and posttest data were adjusted for pretest differences using ANCOVA. The results suggest that flipped instruction had a positive effect student achievement, with effect sizes ranging from +0.16 to +0.44. In addition, some students reported that they preferred watching video lectures outside of class and appreciated more active approaches to learning.

  20. Strange attractors in a chaotic coin flip simulation

    International Nuclear Information System (INIS)

    Cooper, Crystal

    2006-01-01

    Presented is a computer simulation used to model a variation of the game known as the gambler's ruin. A rich player gambles with a set amount of money m. The poor player starts out with zero capital, and is allowed to flip a coin in order to try to win the money. If the coin is heads, the poor player wins a dollar but if it is tails, the player loses a dollar. The poor player is always allowed to win the first flip, and is allowed to flip n times, even when the amount of money lost reaches zero. The dynamics of this process is chaotic due to fluctuations in the variance of the amount of money

  1. Phenomenology with supersymmetric flipped SU(6)

    Energy Technology Data Exchange (ETDEWEB)

    Shafi, Qaisar E-mail: shafi@bartol.udel.edu; Tavartkiladze, Zurab E-mail: tavzur@axpfe1.fe.infn.it

    1999-07-12

    The supersymmetric flipped SU(6) x U(1) gauge symmetry can arise through compactification of the ten-dimensional E{sub 8} x E{sub 8} superstring theory. We show how realistic phenomenology can emerge from this theory by supplementing it with the symmetry R x U(1), where R denotes a discrete 'R'-symmetry. The well-known doublet-triplet splitting problem is resolved to 'all orders' via the pseudo-Goldstone mechanism, and the GUT scale arises from an interplay of the Planck and supersymmetry breaking scales. The symmetry R x U(1) is also important for understanding the fermion mass hierarchies as well as the magnitudes of the CKM matrix elements. Furthermore, the well-known MSSM parameter tan {beta} is estimated to be of order unity, while the proton lifetime ({tau}{sub p} {approx} 10{sup 2}{tau}{sub pSU(5)}) is consistent with observations. Depending on some parameters, p {yields} K{mu}{sup +} can be the dominant decay mode. Finally, the observed solar and atmospheric neutrino 'anomalies' requir us to introduce a 'sterile' neutrino state. Remarkably, the R x U(1) symmetry protects it from becoming heavy, so that maximal angle {nu}{sub {mu}} oscillations into a sterile state can explain the atmospheric anomaly, while the solar neutrino puzzle is resolved via the small angle {nu}{sub e} - {nu}{sub {tau}} MSW oscillations. The existence of some ({approx} 15-20% of critical energy density) neutrino hot dark matter is also predicted.

  2. Using 3DClass To Flip Biochemistry Classroom

    Directory of Open Access Journals (Sweden)

    T. Silva

    2014-08-01

    Full Text Available The flipped classroom inverts traditional teaching methods, in order to have studentsprepared for topics and techniques covered in the following meeting. This approach wasadopted in a biochemistry course taught to biology freshmen students at the University ofCampinas, using a Virtual Learning Environment called 3DClass. Before each classroomsession, a quiz was delivered covering the following topic and students were allowed totake quizzes as many times as they wanted. This approach was utilized in order to betterprepare students in classes and to perform lab experiments. Every student attempt wasrecorded in a database. Before each classroom session, the instructors were provided witha summary of the class answers, highlighting questions where students had more difficultyand the ones that scored higher. This kind of information was helpful to design activities tocover the topics where students had more difficulties. Based on the 3DClass records thestudents behaviors were mapped, such as students taking the quizzes seriously, studentsguessing, students answering a quiz until scoring 100%, students that continue answeringafter scoring 100% in order to increase their grades, students that never score 100%.However, the most relevant information 3DClass brought us was the possibility to identifystudent’s confidence in their answers, which could be observed by the analysis of theirattempts for each question. If they had made different choices each try, it would haveindicated a low confidence level, while always providing the same answer indicated ahigher confidence level, even whilst picking incorrect answers. This experiment haverevealed that students coming to the classroom better prepared reflected positively on thedeveloped activities, but the number of students taking the quizzes seriously were not asgreat as we had expected, indicating that more actions should be taken to improvestudents engagement with these activities.

  3. Packaging and testing of multi-wavelength DFB laser array using REC technology

    Science.gov (United States)

    Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guanghui; Luan, Jia

    2014-02-01

    Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310 nm and 8-channel @1550 nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35 dB average Side Mode Suppression Ratio (SMSR). When I=35 mA, we obtain the total output power of 1 mW for 4-channel @1310 nm, and 227 μw for 8-channel @1550 nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10 G or even 8×10 G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.

  4. RECOILING SUPERMASSIVE BLACK HOLES IN SPIN-FLIP RADIO GALAXIES

    International Nuclear Information System (INIS)

    Liu, F. K.; Wang Dong; Chen Xian

    2012-01-01

    Numerical relativity simulations predict that coalescence of supermassive black hole (SMBH) binaries leads not only to a spin flip but also to a recoiling of the merger remnant SMBHs. In the literature, X-shaped radio sources are popularly suggested to be candidates for SMBH mergers with spin flip of jet-ejecting SMBHs. Here we investigate the spectral and spatial observational signatures of the recoiling SMBHs in radio sources undergoing black hole spin flip. Our results show that SMBHs in most spin-flip radio sources have mass ratio q ∼> 0.3 with a minimum possible value q min ≅ 0.05. For major mergers, the remnant SMBHs can get a kick velocity as high as 2100 km s –1 in the direction within an angle ∼< 40° relative to the spin axes of remnant SMBHs, implying that recoiling quasars are biased to be with high Doppler-shifted broad emission lines while recoiling radio galaxies are biased to large apparent spatial off-center displacements. We also calculate the distribution functions of line-of-sight velocity and apparent spatial off-center displacements for spin-flip radio sources with different apparent jet reorientation angles. Our results show that the larger the apparent jet reorientation angle is, the larger the Doppler-shifting recoiling velocity and apparent spatial off-center displacement will be. We investigate the effects of recoiling velocity on the dust torus in spin-flip radio sources and suggest that recoiling of SMBHs would lead to 'dust-poor' active galactic nuclei. Finally, we collect a sample of 19 X-shaped radio objects and for each object give the probability of detecting the predicted signatures of recoiling SMBH.

  5. Switched Flip-Flop based Preprocessing Circuit for ISFETs

    Directory of Open Access Journals (Sweden)

    Martin Kollár

    2005-03-01

    Full Text Available In this paper, a preprocessing circuit for ISFETs (Ion-sensitive field-effecttransistors to measure hydrogen-ion concentration in electrolyte is presented. A modifiedflip-flop is the main part of the circuit. The modification consists in replacing the standardtransistors by ISFETs and periodically switching the supply voltage on and off.Concentration of hydrogen ions to be measured discontinues the flip-flop value symmetry,which means that by switching the supply voltage on the flip-flop goes to one of two stablestates, ‘one’ or ‘zero’. The recovery of the value symmetry can be achieved by changing abalanced voltage, which is incorporated to the flip-flop, to bring the flip-flop to a 50%position (probability of ‘one’ equals to probability of ‘zero’. Thus, the balanced voltagereflects the measured concentration of hydrogen ions. Its magnitude is set automatically byusing a feedback circuit whose input is connected to the flip-flop output. The preprocessingcircuit, as the whole, is the well-known δ modulator in which the switched flip-flop servesas a comparator and a sampling circuit. The advantages of this approach in comparison tothose of standard approaches are discussed. Finally, theoretical results are verified bysimulations with TSPICE and a good agreement is reported.

  6. Flipped version of the supersymmetric strongly coupled preon model

    Energy Technology Data Exchange (ETDEWEB)

    Fajfer, S. (Institut za Fiziku, University of Sarajevo, Sarajevo, (Yugoslavia)); Milekovic, M.; Tadic, D. (Zavod za Teorijsku Fiziku, Prirodoslovno-Matematicki Fakultet, University of Zagreb, Croatia, (Yugoslavia))

    1989-12-01

    In the supersymmetric SU(5) (SUSY SU(5)) composite model (which was described in an earlier paper) the fermion mass terms can be easily constructed. The SUSY SU(5){direct product}U(1), i.e., flipped, composite model possesses a completely analogous composite-particle spectrum. However, in that model one cannot construct a renormalizable superpotential which would generate fermion mass terms. This contrasts with the standard noncomposite grand unified theories (GUT's) in which both the Georgi-Glashow electrical charge embedding and its flipped counterpart lead to the renormalizable theories.

  7. I mål med flipped learning

    DEFF Research Database (Denmark)

    Hachmann, Roland

    2016-01-01

    Kapitlet belyser, hvordan synlige læringsmål og stilladsering er to vigtige elementer i Flipped Learning. Kapitlet belyser en række metoder til at bringe eleven i centrum for sin egen læring og hvorledes underviseren kan differentiere sin undervisning for netop at støtte denne proces......Kapitlet belyser, hvordan synlige læringsmål og stilladsering er to vigtige elementer i Flipped Learning. Kapitlet belyser en række metoder til at bringe eleven i centrum for sin egen læring og hvorledes underviseren kan differentiere sin undervisning for netop at støtte denne proces...

  8. Fully simulatable quantum-secure coin-flipping and applications

    DEFF Research Database (Denmark)

    Lunemann, Carolin; Nielsen, Jesper Buus

    2011-01-01

    schemes which we show how to construct in the given setting. We then show that the interactive generation of random coins at the beginning or during outer protocols allows for quantum-secure realizations of classical schemes, again without any set-up assumptions. As example applications we discuss quantum...... zero-knowledge proofs of knowledge and quantum-secure two-party function evaluation. Both applications assume only fully simulatable coin-flipping and mixed commitments. Since our framework allows to construct fully simulatable coin-flipping from mixed commitments, this in particular shows that mixed...

  9. Controlling spin flips of molecules in an electromagnetic trap

    Science.gov (United States)

    Reens, David; Wu, Hao; Langen, Tim; Ye, Jun

    2017-12-01

    Doubly dipolar molecules exhibit complex internal spin dynamics when electric and magnetic fields are both applied. Near magnetic trap minima, these spin dynamics lead to enhancements in Majorana spin-flip transitions by many orders of magnitude relative to atoms and are thus an important obstacle for progress in molecule trapping and cooling. We conclusively demonstrate and address this with OH molecules in a trap geometry where spin-flip losses can be tuned from over 200 s-1 to below our 2 s-1 vacuum-limited loss rate with only a simple external bias coil and with minimal impact on trap depth and gradient.

  10. Markov chain analysis of single spin flip Ising simulations

    International Nuclear Information System (INIS)

    Hennecke, M.

    1997-01-01

    The Markov processes defined by random and loop-based schemes for single spin flip attempts in Monte Carlo simulations of the 2D Ising model are investigated, by explicitly constructing their transition matrices. Their analysis reveals that loops over all lattice sites using a Metropolis-type single spin flip probability often do not define ergodic Markov chains, and have distorted dynamical properties even if they are ergodic. The transition matrices also enable a comparison of the dynamics of random versus loop spin selection and Glauber versus Metropolis probabilities

  11. Introducing a Flipped Classroom for a Statistics Course

    DEFF Research Database (Denmark)

    Triantafyllou, Eva; Timcenko, Olga

    2014-01-01

    before class, while class time is devoted to clarifications and application of this knowledge. The hypothesis is that there could be deep and creative discussions when teacher and students physically meet. This has inspired an experiment utilizing this approach in a statistics course for fourth semester......One of the novel ideas in teaching that heavily relies on current technology is the “flipped classroom” approach, or “inverse teaching”. In a flipped classroom the traditional lecture and homework sessions are inverted. Students are provided with online material in order to gain necessary knowledge...

  12. THE IMPLEMENTATION OF FLIPPED CLASSROOM MODEL IN EFL WRITING

    OpenAIRE

    Rida Afrilyasanti

    2016-01-01

    Flipped classroom is an approach to learning to write that allows teachers to have one-on-one assistance to help learners in the “during writing” stage in the classroom. Theories are given to the students in a video lectures to watch before class. Because problems in writing mostly occur in “during writing” stage, teacher assistance is crucial. This paper aims to share theoretical review and research findings pertaining to the implementation of flipped classroom model to EFL writing. Research...

  13. The FLIP fuel experience at Washington State University

    International Nuclear Information System (INIS)

    Lovas, Thomas A.

    1977-01-01

    The Washington State University TRIGA-fueled modified G.E. reactor was refueled with a partial TRIGA-FLIP core in February, 1976. The final core loading consisted of 35 FLIP and 75 Standard TRIGA fuel rods and provided a core excess reactivity of $7.98. The observed performance of the reactor did not deviate significantly from the design predictions and specifications. Pulsing tests revealed a maximum power output of 1850 MW with a fuel temperature of 449 deg. C from a $2.50 pulse. Slight power fluctuations at 1 Megawatt steady-state operation and post-pulse power oscillations were observed. (author)

  14. Preservation of forest wood chips

    Energy Technology Data Exchange (ETDEWEB)

    Kofman, P.D.; Thomsen, I.M.; Ohlsson, C.; Leer, E.; Ravn Schmidt, E.; Soerensen, M.; Knudsen, P.

    1999-01-01

    As part of the Danish Energy Research Programme on biomass utilisation for energy production (EFP), this project concerns problems connected to the handling and storing of wood chips. In this project, the possibility of preserving wood chips of the Norway Spruce (Picea Abies) is addressed, and the potential improvements by anaerobic storage are tested. Preservation of wood chips aims at reducing dry matter losses from extensive heating during storage and to reduce production of fungal spores. Fungal spores pose a health hazards to workers handling the chips. Further the producers of wood chips are interested in such a method since it would enable them to give a guarantee for the delivery of homogeneous wood chips also during the winter period. Three different types of wood chips were stored airtight and further one of these was stored in accordance with normal practise and use as reference. The results showed that airtight storage had a beneficial impact on the quality of the chips: no redistribution of moisture, low dry matter losses, unfavourable conditions for microbial activity of most fungi, and the promotion of yeasts instead of fungi with airborne spores. Likewise the firing tests showed that no combustion problems, and no increased risk to the environment or to the health of staff is caused by anaerobic storage of wood chips. In all, the tests of the anaerobic storage method of forest wood chips were a success and a large-scale test of the method will be carried out in 1999. (au)

  15. Restricted active space spin-flip configuration interaction: theory and examples for multiple spin flips with odd numbers of electrons.

    Science.gov (United States)

    Zimmerman, Paul M; Bell, Franziska; Goldey, Matthew; Bell, Alexis T; Head-Gordon, Martin

    2012-10-28

    The restricted active space spin flip (RAS-SF) method is extended to allow ground and excited states of molecular radicals to be described at low cost (for small numbers of spin flips). RAS-SF allows for any number of spin flips and a flexible active space while maintaining pure spin eigenfunctions for all states by maintaining a spin complete set of determinants and using spin-restricted orbitals. The implementation supports both even and odd numbers of electrons, while use of resolution of the identity integrals and a shared memory parallel implementation allow for fast computation. Examples of multiple-bond dissociation, excited states in triradicals, spin conversions in organic multi-radicals, and mixed-valence metal coordination complexes demonstrate the broad usefulness of RAS-SF.

  16. Librarians Flip for Students: Teaching Searching Skills to Medical Students Using a Flipped Classroom Approach.

    Science.gov (United States)

    Minuti, Aurelia; Sorensen, Karen; Schwartz, Rachel; King, Winifred S; Glassman, Nancy R; Habousha, Racheline G

    2018-01-01

    This article describes the development of a flipped classroom instructional module designed by librarians to teach first- and second-year medical students how to search the literature and find evidence-based articles. The pre-class module consists of an online component that includes reading, videos, and exercises relating to a clinical case. The in-class sessions, designed to reinforce important concepts, include various interactive activities. The specifics of designing both components are included for other health sciences librarians interested in presenting similar instruction. Challenges encountered, particularly in the live sessions, are detailed, as are the results of evaluations submitted by the students, who largely enjoyed the online component. Future plans are contingent on solving technical problems encountered during the in-class sessions.

  17. Lithium niobate packaging challenges

    International Nuclear Information System (INIS)

    Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

    1988-01-01

    The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

  18. Packaged die heater

    Science.gov (United States)

    Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

    2011-06-21

    A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

  19. Packaging for Sustainability

    CERN Document Server

    Lewis, Helen; Fitzpatrick, Leanne

    2012-01-01

    The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

  20. A fully packaged micromachined single crystalline resonant force sensor

    Energy Technology Data Exchange (ETDEWEB)

    Cavalloni, C.; Gnielka, M.; Berg, J. von [Kistler Instrumente AG, Winterthur (Switzerland); Haueis, M.; Dual, J. [ETH Zuerich, Inst. of Mechanical Systems, Zuerich (Switzerland); Buser, R. [Interstate Univ. of Applied Science Buchs, Buchs (Switzerland)

    2001-07-01

    In this work a fully packaged resonant force sensor for static load measurements is presented. The working principle is based on the shift of the resonance frequency in response to the applied load. The heart of the sensor, the resonant structure, is fabricated by micromachining using single crystalline silicon. To avoid creep and hysteresis and to minimize temperature induced stress the resonant structure is encapsulated using an all-in-silicon solution. This means that the load coupling, the excitation of the microresonator and the detection of the oscillation signal are integrated in only one single crystalline silicon chip. The chip is packaged into a specially designed housing made of steel which has been designed with respect to application in harsh environments. The unloaded sensor has an initial frequency of about 22,5 kHz. The sensitivity amounts to 26 Hz/N with a linearity error significantly less than 0,5%FSO. (orig.)

  1. Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

    Science.gov (United States)

    Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

    2018-02-01

    The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

  2. Packaged integrated opto-fluidic solution for harmful fluid analysis

    Science.gov (United States)

    Allenet, T.; Bucci, D.; Geoffray, F.; Canto, F.; Couston, L.; Jardinier, E.; Broquin, J.-E.

    2016-02-01

    Advances in nuclear fuel reprocessing have led to a surging need for novel chemical analysis tools. In this paper, we present a packaged lab-on-chip approach with co-integration of optical and micro-fluidic functions on a glass substrate as a solution. A chip was built and packaged to obtain light/fluid interaction in order for the entire device to make spectral measurements using the photo spectroscopy absorption principle. The interaction between the analyte solution and light takes place at the boundary between a waveguide and a fluid micro-channel thanks to the evanescent part of the waveguide's guided mode that propagates into the fluid. The waveguide was obtained via ion exchange on a glass wafer. The input and the output of the waveguides were pigtailed with standard single mode optical fibers. The micro-scale fluid channel was elaborated with a lithography procedure and hydrofluoric acid wet etching resulting in a 150+/-8 μm deep channel. The channel was designed with fluidic accesses, in order for the chip to be compatible with commercial fluidic interfaces/chip mounts. This allows for analyte fluid in external capillaries to be pumped into the device through micro-pipes, hence resulting in a fully packaged chip. In order to produce this co-integrated structure, two substrates were bonded. A study of direct glass wafer-to-wafer molecular bonding was carried-out to improve detector sturdiness and durability and put forward a bonding protocol with a bonding surface energy of γ>2.0 J.m-2. Detector viability was shown by obtaining optical mode measurements and detecting traces of 1.2 M neodymium (Nd) solute in 12+/-1 μL of 0.01 M and pH 2 nitric acid (HNO3) solvent by obtaining an absorption peak specific to neodymium at 795 nm.

  3. MARS software package status

    International Nuclear Information System (INIS)

    Azhgirej, I.L.; Talanov, V.V.

    2000-01-01

    The MARS software package is intended for simulating the nuclear-electromagnetic cascades and the secondary neutrons and muons transport in the heterogeneous medium of arbitrary complexity in the magnetic fields presence. The inclusive approach to describing the particle production in the nuclear and electromagnetic interactions and by the unstable particles decay is realized in the package. The MARS software package was actively applied for solving various radiation physical problems [ru

  4. Silicon Chip-to-Chip Mode-Division Multiplexing

    DEFF Research Database (Denmark)

    Baumann, Jan Markus; Porto da Silva, Edson; Ding, Yunhong

    2018-01-01

    A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes.......A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes....

  5. Multi spin-flip dynamics: a solution of the one-dimensional Ising model

    International Nuclear Information System (INIS)

    Novak, I.

    1990-01-01

    The Glauber dynamics of interacting Ising spins (the single spin-flip dynamics) is generalized to p spin-flip dynamics with a simultaneous flip of up to p spins in a single configuration move. The p spin-flip dynamics is studied of the one-dimensional Ising model with uniform nearest-neighbour interaction. For this case, an exact relation is given for the time dependence of magnetization. It was found that the critical slowing down in this model could be avoided when p spin-flip dynamics with p>2 was considered. (author). 17 refs

  6. Spin flipping a stored polarized proton beam at the IUCF cooler ring

    International Nuclear Information System (INIS)

    Phelps, R.A.

    1995-01-01

    We recently studied the spin flip of a vertically polarized 139 MeV proton beam stored in the IUCF Cooler Ring. We used an rf solenoid to induce a depolarizing resonance in the ring; we flipped the spin by varying the solenoid field's frequency through this resonance. We found a polarization loss after multiple spin flips less than 0.1% per flip; we also found that this loss increased for very slow frequency changes. This spin flip could reduce systematic errors in stored polarization beam experiments by allowing frequent beam polarization reversals during the experiment. copyright 1995 American Institute of Physics

  7. Student evaluation of the flipped classroom instruction method: is it aligned with Problem-Based Learning?

    DEFF Research Database (Denmark)

    Triantafyllou, Evangelia; Timcenko, Olga; Kofoed, Lise

    2017-01-01

    The flipped classroom approach is an instructional method that has gained momentum in the last years. In a flipped classroom the traditional lecture and homework sessions are inverted. We believe that the flipped classroom, which employs computer-based individual instruction outside the classroom...... presents data from the second year, where we conducted a survey study among students participating in the flipped statistics course. This study consisted of two surveys designed to gather student perceptions on the out-of-classroom preparation material (videos and quizzes) and the flipped classroom...

  8. Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

    2015-01-01

    This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

  9. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... “User-friendly Packaging” aims to create a platform for developing more user-friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

  10. The ZOOM minimization package

    International Nuclear Information System (INIS)

    Fischler, Mark S.; Sachs, D.

    2004-01-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete

  11. Plasma physics plotting package

    International Nuclear Information System (INIS)

    Hyman, D.H.

    1981-02-01

    We describe a package of plotting routines that do up to six two- or three-dimensional plots on a frame with minimal loss of resolution. The package now runs on a PDP-10 with PLOT-10 TCS primitives and on a Control Data Corporation-7600 and a Cray-1 with TV80LIB primitives on the National Magnetic Fusion Energy Computer Center network. The package is portable to other graphics systems because only the primitive plot calls are used from the underlying system's graphics package

  12. Active food packaging technologies.

    Science.gov (United States)

    Ozdemir, Murat; Floros, John D

    2004-01-01

    Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

  13. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    Science.gov (United States)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-06-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  14. Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications

    Science.gov (United States)

    Decrossas, Emmanuel; Glover, Michael D.; Porter, Kaoru; Cannon, Tom; Mantooth, H. Alan; Hamilton, M. C.

    2013-01-01

    Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.

  15. On-chip photonic particle sensor

    Science.gov (United States)

    Singh, Robin; Ma, Danhao; Agarwal, Anu; Anthony, Brian

    2018-02-01

    We propose an on-chip photonic particle sensor design that can perform particle sizing and counting for various environmental applications. The sensor is based on micro photonic ring resonators that are able to detect the presence of the free space particles through the interaction with their evanescent electric field tail. The sensor can characterize a wide range of the particle size ranging from a few nano meters to micron ( 1 micron). The photonic platform offers high sensitivity, compactness, fast response of the device. Further, FDTD simulations are performed to analyze different particle-light interactions. Such a compact and portable platform, packaged with integrated photonic circuit provides a useful sensing modality in space shuttle and environmental applications.

  16. Packaging Technologies for 500C SiC Electronics and Sensors

    Science.gov (United States)

    Chen, Liang-Yu

    2013-01-01

    Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

  17. Resolution of Single Spin-Flips of a Single Proton

    CERN Document Server

    Mooser, A.; Blaum, K.; Bräuninger, S.A.; Franke, K.; Leiteritz, C.; Quint, W.; Rodegheri, C.C.; Ulmer, S.; Walz, J.

    2013-04-04

    The spin magnetic moment of a single proton in a cryogenic Penning trap was coupled to the particle's axial motion with a superimposed magnetic bottle. Jumps in the oscillation frequency indicate spin-flips and were identified using a Bayesian analysis.

  18. String unification and leptophobic Z` in flipped SU(5)

    Energy Technology Data Exchange (ETDEWEB)

    Lopez, J.L. [Rice Univ., Houston, TX (United States). Bonner Nuclear Labs.

    1997-01-01

    We summarize recent developments in the prediction for {alpha}{sub s}(M{sub Z}), self-consistent string unification and the dynamical determination of mass scales, and leptophobic Z` gauge bosons in the context of stringy flipped SU(5). (orig.).

  19. Flipped neutrino emissivity of hot plasma in supernova core

    Energy Technology Data Exchange (ETDEWEB)

    Goyal, A.; Dutta, S. (Department of Physics and Astrophysics, University of Delhi, Delhi 110 007 (India))

    1994-05-15

    We calculate the energy loss due to wrong-helicity sterile neutrinos produced due to the decay of plasmons into flipped neutrino pairs at relativistic temperatures and densities in the core of a nascent neutron star and compare our results with other processes.

  20. How I Used Flipped Learning to Inform My Teaching

    Science.gov (United States)

    Chang, Sau Hou

    2016-01-01

    This paper aims to reflect upon the experience of using flipped learning in a college class. After presenting the alignment of learning objectives and assessments, evidence-based evaluation was provided as rationale for changes. Approaches taken to improve learning were then elaborated. Further assessment of impact of change on student learning…

  1. Flipped Heavy Neutrinos from the Solar Neutrino Problem to Baryogenesis

    CERN Document Server

    Ellis, Jonathan Richard; Olive, Keith A

    1993-01-01

    We discuss baryogenesis using the flipped $SU(5)$ model for lepton mass matrices. We show that the generalized see-saw mechanism in this model can not only provide MSW neutrino mixing suitable for solving the solar neutrino problem, and supply a hot dark matter candidate ($\

  2. Current-type flipped-Γ-source inverters

    DEFF Research Database (Denmark)

    Loh, Poh Chiang; Li, Ding; Blaabjerg, Frede

    2012-01-01

    are of interest since they use lesser components. Their winding turns might however become too excessive for higher demanded gains. Avoiding this usual trend, a new family of current-type flipped-Γ-source inverters are proposed, whose common gain is raised by lowering, and not increasing, the winding turns...

  3. Flipped Learning for ESL Writing in a Sudanese School

    Science.gov (United States)

    Abdelrahman, Limia Ali Mohamed; DeWitt, Dorothy; Alias, Norlidah; Rahman, Mohd Nazri Abdul

    2017-01-01

    Sudanese students seem to lack proficiency in writing English. In addition, teachers continue to use traditional, teacher-centered methods in teaching English as a second language (ESL). The flipped learning (FL) approach where video lectures are assigned as online homework before class, followed by learning activities during class, might be able…

  4. Student Learning and Perceptions in a Flipped Linear Algebra Course

    Science.gov (United States)

    Love, Betty; Hodge, Angie; Grandgenett, Neal; Swift, Andrew W.

    2014-01-01

    The traditional lecture style of teaching has long been the norm in college science, technology, engineering, and mathematics (STEM) courses, but an innovative teaching model, facilitated by recent advances in technology, is gaining popularity across college campuses. This new model inverts or "flips" the usual classroom paradigm, in…

  5. Just Do It: Flipped Lecture, Determinants and Debate

    Science.gov (United States)

    Kensington-Miller, Barbara; Novak, Julia; Evans, Tanya

    2016-01-01

    This paper describes a case study of two pure mathematicians who flipped their lecture to teach matrix determinants in two large mathematics service courses (one at Stage I and the other at Stage II). The purpose of the study was to transform the passive lecture into an active learning opportunity and to introduce valuable mathematical skills,…

  6. A New Learning Approach: Flipped Classroom and Its Impacts

    Science.gov (United States)

    Yildirim, Gürkan

    2017-01-01

    The aim of this study is to present opinions of undergraduate students towards Flipped Classroom (FC) practices and to determine their different aspects then traditional learning approaches. The case study approach is preferred to conduct the study. In this context, 34 volunteered students were included in the study group by purposive sampling…

  7. Student and Instructor Perceptions of a Flipped College Algebra Classroom

    Science.gov (United States)

    Jaster, Robert W.

    2017-01-01

    Each year about half a million students fail to make planned academic progress due to college algebra, hence the need for researchers to find ways of improving the quality of instruction in the course. Recent research suggests that flipping college algebra to allow time for active learning in the classroom may improve student performance. Also,…

  8. Preparing Students for Flipped or Team-Based Learning Methods

    Science.gov (United States)

    Balan, Peter; Clark, Michele; Restall, Gregory

    2015-01-01

    Purpose: Teaching methods such as Flipped Learning and Team-Based Learning require students to pre-learn course materials before a teaching session, because classroom exercises rely on students using self-gained knowledge. This is the reverse to "traditional" teaching when course materials are presented during a lecture, and students are…

  9. The space of colored interval exchange transformations with flips

    International Nuclear Information System (INIS)

    Zaw, Myint

    2002-04-01

    We study the space Cr(2h, c) of c-colored exchange transformations with flips on 2h-intervals. We describe its relation to the moduli space M g,c *c of non-orientable Riemann surfaces of genus g≥0 with one boundary curve and c≥0 extra points where g=h-c-1. (author)

  10. Helicity-flip in particle production on nuclei

    International Nuclear Information System (INIS)

    Faeldt, G.

    1977-01-01

    Coherent nuclear production processes are generally analyzed assuming helicity conserving production amplitudes. In view of the uncertainties of the actual helicity structure this could be a dangerous assumption. It is shown that helicity-flip contributions might be part of the explanation of the small effective (pππ)-nucleon cross sections observed in coherent production. (Auth.)

  11. Crack Tip Flipping Under Mode I/III Tearing

    DEFF Research Database (Denmark)

    Felter, Christian Lotz; Specht Jensen, Lasse; Nielsen, Kim Lau

    Crack tip flipping, where the fracture surface alternates from side to side in 45° shear bands, seems to be an overlooked propagation mode in Mode I sheet tearing often disregarded as  “transitional” or tied to randomness in the material. In fact, such observations rarely make it to the literature...

  12. University and Flipped Learning TIC & DIL Project: Framework and Design

    Science.gov (United States)

    Pinnelli, Stefania; Fiorucci, Andrea

    2015-01-01

    The flipped classroom approach (FC) is for the educational world a chance of recovery and improvement of pedagogical student-centered model and collaborative teaching methods aimed at optimizing the time resource and to promote personalization and self-learning in a perspective of autonomy. The paper moving from a pedagogical reflection on…

  13. On Flipping the Classroom in Large First Year Calculus Courses

    Science.gov (United States)

    Jungic, Veselin; Kaur, Harpreet; Mulholland, Jamie; Xin, Cindy

    2015-01-01

    Over the course of two years, 2012-2014, we have implemented a "flipping" the classroom approach in three of our large enrolment first year calculus courses: differential and integral calculus for scientists and engineers. In this article we describe the details of our particular approach and share with the reader some experiences of…

  14. The ideal flip-through impact: experimental and numerical investigation

    DEFF Research Database (Denmark)

    Bredmose, Henrik; Hunt-Raby, A.; Jayaratne, R.

    2010-01-01

    Results from a physical experiment and a numerical computation are compared for a flip-through type wave impact on a vertical face, typical of a seawall or breakwater. The physical wave was generated by application of the focused-wave group technique to the amplitudes of a JONSWAP spectrum, with ...

  15. Flipping the Classroom in Teaching Chinese as a Foreign Language

    Science.gov (United States)

    Yang, Jia; Yin, Chengxu; Wang, Wei

    2018-01-01

    Through an in-depth analysis of quantitative and qualitative data, this article offers a case study of the advantages and challenges in the application of the flipped learning approach in the instruction of Chinese as a foreign language at the beginning level. Data were collected from two first-year Chinese classes (one in traditional and the…

  16. Hidden Expectations behind the Promise of the Flipped Classroom

    Science.gov (United States)

    Sammel, Alison; Townend, Geraldine; Kanasa, Harry

    2018-01-01

    The purpose of this study was to evaluate the student experience of pre-service teachers in a compulsory primary science education course that adopted a flipped classroom approach. Participants (n = 79) were surveyed at the conclusion of the course exploring their perceptions of engagement, enjoyment, and degree of learning as a result of…

  17. Reflections on a Flipped Classroom in First Year Higher Education

    Science.gov (United States)

    McCarthy, Josh

    2016-01-01

    This paper explores the efficacy of a flipped classroom model for teaching first year students three-dimensional (3D) animation, and analyses the advantages and disadvantages when compared to traditional teaching mechanisms. In 2015, within the course "Introduction to CGI" at the University of South Australia, two different tutorial…

  18. Case Study: Student-Produced Videos for the Flipped Classroom

    Science.gov (United States)

    Prud'homme-Genereux, Annie

    2016-01-01

    This column provides original articles on innovations in case study teaching, assessment of the method, as well as case studies with teaching notes. This month's issue describes a way of building a library of student-produced videos to use in the flipped classroom.

  19. Student Attitudes toward Flipping the General Chemistry Classroom

    Science.gov (United States)

    Smith, J. Dominic

    2013-01-01

    The idea of ''flipping the classroom'' to make class time more engaging and student-centred has gained ground in recent years. The lecture portion of General Chemistry I and General Chemistry II courses were pushed outside the classroom using pre-recording technology and streaming delivery of content, in order to make in-class time more…

  20. Emphasizing peer learning in a virtually flipped classroom

    DEFF Research Database (Denmark)

    Jensen, Lars Peter

    2017-01-01

    in these programmes are often very motivated and they follow the flipped instructions and read the suggested material, but do they also use their study group and experience peer learning? This question is investigated in this paper using one semester in the 2-year part-time programme: Master in Problem Based Learning...

  1. The Effectiveness of a Technology-Enhanced Flipped Science Classroom

    Science.gov (United States)

    Sezer, Baris

    2017-01-01

    This study examined the effect on the learning and motivation of students of a flipped classroom environment enriched with technology. A mixed research design using a pretest or posttest experimental model, combined with qualitative data, was conducted in a public middle school in Turkey for 2 weeks (three class hours) within a science course.…

  2. The Flipped Classroom Model: When Technology Enhances Professional Skills

    Science.gov (United States)

    Baytiyeh, Hoda

    2017-01-01

    Purpose: The purpose of this paper is to investigate the effectiveness of the flipped classroom model in teaching and learning as well as the skills that can be acquired by students after being exposed to this learning style. Design/methodology/approach: This paper uses a qualitative case study design. In total, 20 students, from various majors,…

  3. Successful EFL Teaching Using Mobile Technologies in a Flipped Classroom

    Science.gov (United States)

    Obari, Hiroyuki; Lambacher, Stephen

    2015-01-01

    Two case studies evaluating the effectiveness of a flipped classroom compared to a traditional classroom were performed. The studies were conducted from April 2014 to January 2015 at a private university in Tokyo, targeting 60 first-year and 25 third-year undergraduates, respectively. In the first study, an assessment of pre- and post-treatment…

  4. A Qualitative Investigation of Student Engagement in a Flipped Classroom

    Science.gov (United States)

    Steen-Utheim, Anna Therese; Foldnes, Njål

    2018-01-01

    The flipped classroom is gaining acceptance in higher education as an alternative to more traditional methods of teaching. In the current study, twelve students in a Norwegian higher education institution were in-depth interviewed about their learning experiences in a two-semester long mathematics course. The first semester was taught using…

  5. On flipping the classroom in large first year calculus courses

    Science.gov (United States)

    Jungić, Veselin; Kaur, Harpreet; Mulholland, Jamie; Xin, Cindy

    2015-05-01

    Over the course of two years, 2012--2014, we have implemented a 'flipping' the classroom approach in three of our large enrolment first year calculus courses: differential and integral calculus for scientists and engineers. In this article we describe the details of our particular approach and share with the reader some experiences of both instructors and students.

  6. How do medical students prepare for flipped classrooms?

    NARCIS (Netherlands)

    Bouwmeester, RAM; de Kleijn, R.A.M.; ten Cate, TJ; van Rijen, HVM; Westerveld, HE

    A flipped classroom, an approach abandoning traditional lectures and having students come together to apply acquired knowledge, requires students to come to class well prepared. The nature of this preparation is currently being debated. Watching web lectures as a preparation has typically been

  7. Putting Structure to Flipped Classrooms Using Team-Based Learning

    Science.gov (United States)

    Jakobsen, Krisztina V.; Knetemann, Megan

    2017-01-01

    Current educational practices and cognitive-developmental theories emphasize the importance of active participation in the learning environment, and they suggest that the first, and arguably most important, step to creating a better learning environment is to make learning an active and reciprocal process. Flipped classrooms, in which students…

  8. Flipped Top-Down is Systematic Bottom-Up

    NARCIS (Netherlands)

    Zaytsev, V.; Sturm, A.; Clark, T.

    2016-01-01

    The paper presents an experience report in course design for a versatile group of computer science students where their needs were surfaced and met by the combination of strict top-down exposure to course material and the flipped classroom model of lecturing.

  9. Using Flip Camcorders for Active Classroom Metacognitive Reflection

    Science.gov (United States)

    Hargis, Jace; Marotta, Sebastian M.

    2011-01-01

    A Center for Teaching and Learning provided Flip camcorders to a group of 10 new faculty members, who were asked to use this teaching tool in their classroom instruction. The classes included mathematics, political science, computer engineering, psychology, business, music and dance. The qualitative results indicate that all faculty members and…

  10. An Investigation of the Use of the ‘Flipped Classroom’ Pedagogy in Secondary English Language Classrooms

    OpenAIRE

    Chi Cheung Ruby Yang

    2017-01-01

    Aim/Purpose : To examine the use of a flipped classroom in the English Language subject in secondary classrooms in Hong Kong. Background: The research questions addressed were: (1) What are teachers’ perceptions towards the flipped classroom pedagogy? (2) How can teachers transfer their flipped classroom experiences to teaching other classes/subjects? (3) What are students’ perceptions towards the flipped classroom pedagogy? (4) How can students transfer their flipped classroom experience...

  11. Heat management in integrated circuits on-chip and system-level monitoring and cooling

    CERN Document Server

    Ogrenci-Memik, Seda

    2016-01-01

    This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

  12. CYPROS - Cybernetic Program Packages

    Directory of Open Access Journals (Sweden)

    Arne Tyssø

    1980-10-01

    Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

  13. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...

  14. NRF TRIGA packaging

    International Nuclear Information System (INIS)

    Clements, M.D.

    1995-11-01

    Training Reactor Isotopes, General Atomics (TRIGA reg-sign) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask's small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads

  15. WASTE PACKAGE TRANSPORTER DESIGN

    International Nuclear Information System (INIS)

    Weddle, D.C.; Novotny, R.; Cron, J.

    1998-01-01

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''

  16. WASTE PACKAGE TRANSPORTER DESIGN

    Energy Technology Data Exchange (ETDEWEB)

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  17. The BINSYN Program Package

    Directory of Open Access Journals (Sweden)

    Albert P. Linnell

    2012-06-01

    Full Text Available The BINSYN program package, recently expanded to calculate synthetic spectra of cataclysmic variables, is being further extended to include synthetic photometry of ordinary binary stars in addition to binary stars with optically thick accretion disks. The package includes a capability for differentials correction optimization of eclipsing binary systems using synthetic photometry.

  18. The LCDROOT Analysis Package

    International Nuclear Information System (INIS)

    Abe, Toshinori

    2001-01-01

    The North American Linear Collider Detector group has developed simulation and analysis program packages. LCDROOT is one of the packages, and is based on ROOT and the C++ programing language to maximally benefit from object oriented programming techniques. LCDROOT is constantly improved and now has a new topological vertex finder, ZVTOP3. In this proceeding, the features of the LCDROOT simulation are briefly described

  19. Grooming. Learning Activity Package.

    Science.gov (United States)

    Stark, Pamela

    This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  20. Implementation of a Flipped Classroom for Nuclear Medicine Physician CME.

    Science.gov (United States)

    Komarraju, Aparna; Bartel, Twyla B; Dickinson, Lisa A; Grant, Frederick D; Yarbrough, Tracy L

    2018-06-21

    Increasingly, emerging technologies are expanding instructional possibilities, with new methods being adopted to improve knowledge acquisition and retention. Within medical education, many new techniques have been employed in the undergraduate setting, with less utilization thus far in the continuing medical education (CME) sphere. This paper discusses the use of a new method for CME-the "flipped classroom," widely used in undergraduate medical education. This method engages learners by providing content before the live ("in class") session that aids in preparation and fosters in-class engagement. A flipped classroom method was employed using an online image-rich case-based module and quiz prior to a live CME session at a national nuclear medicine meeting. The preparatory material provided a springboard for in-depth discussion at the live session-a case-based activity utilizing audience response technology. Study participants completed a survey regarding their initial experience with this new instructional method. In addition, focus group interviews were conducted with session attendees who had or had not completed the presession material; transcripts were qualitatively analyzed. Quantitative survey data (completed by two-thirds of the session attendees) suggested that the flipped method was highly valuable and met attendee educational objectives. Analysis of focus group data yielded six themes broadly related to two categories-benefits of the flipped method for CME and programmatic considerations for successfully implementing the flipped method in CME. Data from this study have proven encouraging and support further investigations around the incorporation of this innovative teaching method into CME for nuclear imaging specialists.