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Sample records for fast silicon etching

  1. Silicon etch process

    International Nuclear Information System (INIS)

    Day, D.J.; White, J.C.

    1984-01-01

    A silicon etch process wherein an area of silicon crystal surface is passivated by radiation damage and non-planar structure produced by subsequent anisotropic etching. The surface may be passivated by exposure to an energetic particle flux - for example an ion beam from an arsenic, boron, phosphorus, silicon or hydrogen source, or an electron beam. Radiation damage may be used for pattern definition and/or as an etch stop. Ethylenediamine pyrocatechol or aqueous potassium hydroxide anisotropic etchants may be used. The radiation damage may be removed after etching by thermal annealing. (author)

  2. Silicon germanium mask for deep silicon etching

    KAUST Repository

    Serry, Mohamed

    2014-07-29

    Polycrystalline silicon germanium (SiGe) can offer excellent etch selectivity to silicon during cryogenic deep reactive ion etching in an SF.sub.6/O.sub.2 plasma. Etch selectivity of over 800:1 (Si:SiGe) may be achieved at etch temperatures from -80 degrees Celsius to -140 degrees Celsius. High aspect ratio structures with high resolution may be patterned into Si substrates using SiGe as a hard mask layer for construction of microelectromechanical systems (MEMS) devices and semiconductor devices.

  3. Copper-assisted, anti-reflection etching of silicon surfaces

    Science.gov (United States)

    Toor, Fatima; Branz, Howard

    2014-08-26

    A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating (360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.

  4. Low surface damage dry etched black silicon

    DEFF Research Database (Denmark)

    Plakhotnyuk, Maksym M.; Gaudig, Maria; Davidsen, Rasmus Schmidt

    2017-01-01

    Black silicon (bSi) is promising for integration into silicon solar cell fabrication flow due to its excellent light trapping and low reflectance, and a continuously improving passivation. However, intensive ion bombardment during the reactive ion etching used to fabricate bSi induces surface...... power, during reactive ion etching at non-cryogenic temperature (-20°C), preserves the reflectivity below 1% and improves the effective minority carrier lifetime due to reduced ion energy. We investigate the effect of the etching process on the surface morphology, light trapping, reflectance......, transmittance, and effective lifetime of bSi. Additional surface passivation using atomic layer deposition of Al2O3 significantly improves the effective lifetime. For n-type wafers, the lifetime reaches 12 ms for polished and 7.5 ms for bSi surfaces. For p-type wafers, the lifetime reaches 800 ls for both...

  5. Silicon nanostructures produced by laser direct etching

    DEFF Research Database (Denmark)

    Müllenborn, Matthias; Dirac, Paul Andreas Holger; Petersen, Jon Wulff

    1995-01-01

    A laser direct-write process has been applied to structure silicon on a nanometer scale. In this process, a silicon substrate, placed in a chlorine ambience, is locally heated above its melting point by a continuous-wave laser and translated by high-resolution direct-current motor stages. Only...... the molten silicon reacts spontaneously with the molecular chlorine, resulting in trenches with the width of the laser-generated melt. Trenches have been etched with a width of less than 70 nm. To explain the functional dependence of the melt size on absorbed power, the calculations based on a two...

  6. Low surface damage dry etched black silicon

    Science.gov (United States)

    Plakhotnyuk, Maksym M.; Gaudig, Maria; Davidsen, Rasmus Schmidt; Lindhard, Jonas Michael; Hirsch, Jens; Lausch, Dominik; Schmidt, Michael Stenbæk; Stamate, Eugen; Hansen, Ole

    2017-10-01

    Black silicon (bSi) is promising for integration into silicon solar cell fabrication flow due to its excellent light trapping and low reflectance, and a continuously improving passivation. However, intensive ion bombardment during the reactive ion etching used to fabricate bSi induces surface damage that causes significant recombination. Here, we present a process optimization strategy for bSi, where surface damage is reduced and surface passivation is improved while excellent light trapping and low reflectance are maintained. We demonstrate that reduction of the capacitively coupled plasma power, during reactive ion etching at non-cryogenic temperature (-20 °C), preserves the reflectivity below 1% and improves the effective minority carrier lifetime due to reduced ion energy. We investigate the effect of the etching process on the surface morphology, light trapping, reflectance, transmittance, and effective lifetime of bSi. Additional surface passivation using atomic layer deposition of Al2O3 significantly improves the effective lifetime. For n-type wafers, the lifetime reaches 12 ms for polished and 7.5 ms for bSi surfaces. For p-type wafers, the lifetime reaches 800 μs for both polished and bSi surfaces.

  7. Obtaining porous silicon suitable for sensor technology using MacEtch nonelectrolytic etching

    Directory of Open Access Journals (Sweden)

    Iatsunskyi I. R.

    2013-12-01

    Full Text Available The author suggests to use the etching method MacEtch (metal-assisted chemical etching for production of micro- and nanostructures of porous silicon. The paper presents research results on the morphology structures obtained at different parameters of deposition and etching processes. The research has shown that, depending on the parameters of deposition of silver particles and silicon wafers etching, the obtained surface morphology may be different. There may be both individual crater-like pores and developed porous or macroporous surface. These results indicate that the MacEtch etching is a promising method for obtaining micro-porous silicon nanostructures suitable for effective use in gas sensors and biological object sensors.

  8. Particle precipitation in connection with KOH etching of silicon

    DEFF Research Database (Denmark)

    Nielsen, Christian Bergenstof; Christensen, Carsten; Pedersen, Casper

    2004-01-01

    This paper considers the precipitation of iron oxide particles in connection with the KOH etching of cavities in silicon wafers. The findings presented in this paper suggest that the source to the particles is the KOH pellets used for making the etching solution. Experiments show...... that the precipitation is independent of KOH etching time, but that the amount of deposited material varies with dopant type and dopant concentration. The experiments also suggest that the precipitation occurs when the silicon wafers are removed from the KOH etching solution and not during the etching procedure. When...

  9. Physical chemistry of wet chemical anisotropic etching of silicon

    NARCIS (Netherlands)

    Elwenspoek, Michael Curt

    1995-01-01

    In this paper we explain a view to understand the anisotropy of the etching of silicon in certain wet chemical agents (such as KOH). The starting point is the assumption that the [Left angle bracket]111[Right Angle Bracket] face of silicon is a flat face, the etch rate of which is then governed by a

  10. Anodic etching of p-type cubic silicon carbide

    Science.gov (United States)

    Harris, G. L.; Fekade, K.; Wongchotigul, K.

    1992-01-01

    p-Type cubic silicon carbide was anodically etched using an electrolyte of HF:HCl:H2O. The etching depth was determined versus time with a fixed current density of 96.4 mA/sq cm. It was found that the etching was very smooth and very uniform. An etch rate of 22.7 nm/s was obtained in a 1:1:50 HF:HCl:H2O electrolyte.

  11. Organization of silicon nanocrystals by localized electrochemical etching

    International Nuclear Information System (INIS)

    Ayari-Kanoun, Asma; Drouin, Dominique; Beauvais, Jacques; Lysenko, Vladimir; Nychyporuk, Tetyana; Souifi, Abdelkader

    2009-01-01

    An approach to form a monolayer of organized silicon nanocrystals on a monocrystalline Si wafer is reported. Ordered arrays of nanoholes in a silicon nitride layer were obtained by combining electron beam lithography and plasma etching. Then, a short electrochemical etching current pulse led to formation of a single Si nanocrystal per each nanohole. As a result, high quality silicon nanocrystal arrays were formed with well controlled and reproducible morphologies. In future, this approach can be used to fabricate single electron devices.

  12. Ga+ beam lithography for nanoscale silicon reactive ion etching

    Science.gov (United States)

    Henry, M. D.; Shearn, M. J.; Chhim, B.; Scherer, A.

    2010-06-01

    By using a dry etch chemistry which relies on the highly preferential etching of silicon, over that of gallium (Ga), we show resist-free fabrication of precision, high aspect ratio nanostructures and microstructures in silicon using a focused ion beam (FIB) and an inductively coupled plasma reactive ion etcher (ICP-RIE). Silicon etch masks are patterned via Ga + ion implantation in a FIB and then anisotropically etched in an ICP-RIE using fluorinated etch chemistries. We determine the critical areal density of the implanted Ga layer in silicon required to achieve a desired etch depth for both a Pseudo Bosch (SF6/C4F8) and cryogenic fluorine (SF6/O2) silicon etching. High fidelity nanoscale structures down to 30 nm and high aspect ratio structures of 17:1 are demonstrated. Since etch masks may be patterned on uneven surfaces, we utilize this lithography to create multilayer structures in silicon. The linear selectivity versus implanted Ga density enables grayscale lithography. Limits on the ultimate resolution and selectivity of Ga lithography are also discussed.

  13. Erbium doped stain etched porous silicon

    International Nuclear Information System (INIS)

    Gonzalez-Diaz, B.; Diaz-Herrera, B.; Guerrero-Lemus, R.; Mendez-Ramos, J.; Rodriguez, V.D.; Hernandez-Rodriguez, C.; Martinez-Duart, J.M.

    2008-01-01

    In this work a simple erbium doping process applied to stain etched porous silicon layers (PSLs) is proposed. This doping process has been developed for application in porous silicon solar cells, where conventional erbium doping processes are not affordable because of the high processing cost and technical difficulties. The PSLs were formed by immersion in a HF/HNO 3 solution to properly adjust the porosity and pore thickness to an optimal doping of the porous structure. After the formation of the porous structure, the PSLs were analyzed by means of nitrogen BET (Brunauer, Emmett and Teller) area measurements and scanning electron microscopy. Subsequently, the PSLs were immersed in a saturated erbium nitrate solution in order to cover the porous surface. Then, the samples were subjected to a thermal process to activate the Er 3+ ions. Different temperatures and annealing times were used in this process. The photoluminescence of the PSLs was evaluated before and after the doping processes and the composition was analyzed by Fourier transform IR spectroscopy

  14. Bias-assisted KOH etching of macroporous silicon membranes

    International Nuclear Information System (INIS)

    Mathwig, K; Geilhufe, M; Müller, F; Gösele, U

    2011-01-01

    This paper presents an improved technique to fabricate porous membranes from macroporous silicon as a starting material. A crucial step in the fabrication process is the dissolution of silicon from the backside of the porous wafer by aqueous potassium hydroxide to open up the pores. We improved this step by biasing the silicon wafer electrically against the KOH. By monitoring the current–time characteristics a good control of the process is achieved and the yield is improved. Also, the etching can be stopped instantaneously and automatically by short-circuiting Si and KOH. Moreover, the bias-assisted etching allows for the controlled fabrication of silicon dioxide tube arrays when the silicon pore walls are oxidized and inverted pores are released.

  15. Level Set Approach to Anisotropic Wet Etching of Silicon

    Directory of Open Access Journals (Sweden)

    Branislav Radjenović

    2010-05-01

    Full Text Available In this paper a methodology for the three dimensional (3D modeling and simulation of the profile evolution during anisotropic wet etching of silicon based on the level set method is presented. Etching rate anisotropy in silicon is modeled taking into account full silicon symmetry properties, by means of the interpolation technique using experimentally obtained values for the etching rates along thirteen principal and high index directions in KOH solutions. The resulting level set equations are solved using an open source implementation of the sparse field method (ITK library, developed in medical image processing community, extended for the case of non-convex Hamiltonians. Simulation results for some interesting initial 3D shapes, as well as some more practical examples illustrating anisotropic etching simulation in the presence of masks (simple square aperture mask, convex corner undercutting and convex corner compensation, formation of suspended structures are shown also. The obtained results show that level set method can be used as an effective tool for wet etching process modeling, and that is a viable alternative to the Cellular Automata method which now prevails in the simulations of the wet etching process.

  16. Constructing metal-based structures on nanopatterned etched silicon.

    Science.gov (United States)

    Zhang, Xiaojiang; Qiao, Yinghong; Xu, Lina; Buriak, Jillian M

    2011-06-28

    Silicon surfaces with nanoscale etched patterns were obtained using polystyrene-block-poly(4-vinylpyridine) (PS-b-P4VP) block copolymer films as templates, followed by brief immersion in HF(aq). The resulting interfaces were comprised of pseudohexagonal arrays of pits on the silicon, whose shapes depended upon the chosen silicon orientation. The top unetched face of silicon remains capped by the native oxide, and the pit interiors are terminated by Si-H(x). Selective chemical functionalization via these two chemical handles was demonstrated to be a viable approach toward building nanostructured metal oxide and metal features within these silicon pits and on the top face. Using a series of interfacial chemical reactions, including oxidation (of Si-H(x)-terminated regions), hydrosilylation, and alkoxysilane-based chemistry on silicon oxide, the growth of metal-based structures can be spatially controlled. In the first approach, titania nanobowls were grown within the etch pits, and in the second, galvanic displacement was used to produce gold nanoparticles either within the etch pits, on the top silicon face, or both.

  17. Non-Lithographic Silicon Micromachining Using Inkjet and Chemical Etching

    Directory of Open Access Journals (Sweden)

    Sasha Hoshian

    2016-12-01

    Full Text Available We introduce a non-lithographical and vacuum-free method to pattern silicon. The method combines inkjet printing and metal assisted chemical etching (MaCE; we call this method “INKMAC”. A commercial silver ink is printed on top of a silicon surface to create the catalytic patterns for MaCE. The MaCE process leaves behind a set of silicon nanowires in the shape of the inkjet printed micrometer scale pattern. We further show how a potassium hydroxide (KOH wet etching process can be used to rapidly etch away the nanowires, producing fully opened cavities and channels in the shape of the original printed pattern. We show how the printed lines (width 50–100 µm can be etched into functional silicon microfluidic channels with different depths (10–40 µm with aspect ratios close to one. We also used individual droplets (minimum diameter 30 µm to produce cavities with a depth of 60 µm and an aspect ratio of two. Further, we discuss using the structured silicon substrate as a template for polymer replication to produce superhydrophobic surfaces.

  18. Cryo-Etched Black Silicon for Use as Optical Black

    Science.gov (United States)

    Yee, Karl Y.; White, Victor E.; Mouroulis, Pantazis; Eastwood, Michael L.

    2011-01-01

    Stray light reflected from the surface of imaging spectrometer components in particular, the spectrometer slit degrade the image quality. A technique has been developed for rapid, uniform, and cost-effective black silicon formation based on inductively coupled plasma (ICP) etching at cryogenic temperatures. Recent measurements show less than 1-percent total reflectance from 350 2,500 nm of doped black silicon formed in this way, making it an excellent option for texturing of component surfaces for reduction of stray light. Oxygen combines with SF6 + Si etch byproducts to form a passivation layer atop the Si when the etch is performed at cryogenic temperatures. Excess flow of oxygen results in micromasking and the formation of black silicon. The process is repeatable and reliable, and provides control over etch depth and sidewall profile. Density of the needles can be controlled to some extent. Regions to be textured can be patterned lithographically. Adhesion is not an issue as the nanotips are part of the underlying substrate. This is in contrast to surface growth/deposition techniques such as carbon nanotubes (CNTs). The black Si surface is compatible with wet processing, including processing with solvents, the textured surface is completely inorganic, and it does not outgas. In radiometry applications, optical absorbers are often constructed using gold black or CNTs. This black silicon technology is an improvement for these types of applications.

  19. The effect of silicon crystallographic orientation on the formation of silicon nanoclusters during anodic electrochemical etching

    International Nuclear Information System (INIS)

    Timokhov, D. F.; Timokhov, F. P.

    2009-01-01

    Possible ways for increasing the photoluminescence quantum yield of porous silicon layers have been investigated. The effect of the anodization parameters on the photoluminescence properties for porous silicon layers formed on silicon substrates with different crystallographic orientations was studied. The average diameters for silicon nanoclusters are calculated from the photoluminescence spectra of porous silicon. The influence of the substrate crystallographic orientation on the photoluminescence quantum yield of porous silicon is revealed. A model explaining the effect of the substrate orientation on the photoluminescence properties for the porous silicon layers formed by anode electrochemical etching is proposed.

  20. A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon

    International Nuclear Information System (INIS)

    Dalvi-Malhotra, J; Zhong, X F; Planje, C; Yess, K; Brand, G

    2008-01-01

    Newly developed photosensitive etch protection materials have key advantages over standard photoresists typically used in today's MEMS applications. Using these new materials eliminates the need for silicon nitride (SiN) masks deposited via CVD processes, which require significant investments in processing equipment, utilize extreme processing conditions and contribute to an overall decrease in throughput. This new technology will enhance throughput by reducing the number of process steps and simplify the process flow with minimal impact on overall undercut performance. The polymeric coating serves as a SiN mask replacement for etching silicon substrates in alkaline anisotropic etchants such as KOH and TMAH. The undercut performance observed is larger than that of SiN when etched in KOH, but when alternative alkaline etchants such as TMAH are used, the undercut is identical (1–2% with respect to etch depth). Various factors, such as primer bake, topcoat final cure temperature, etchant concentration and substrate surface conditions, have all been shown to affect undercut results. An additional advantage of this new technology is that it can be easily reworked/removed by solvents, plasma etch, Nano-Strip®, Piranha and RCA cleaning solutions depending on where the removal takes place in the process

  1. Nanostructured porous silicon by laser assisted electrochemical etching

    Science.gov (United States)

    Li, J.; Lu, C.; Hu, X. K.; Yang, Xiujuan; Loboda, A. V.; Lipson, R. H.

    2009-08-01

    Nanostructured porous silicon (pSi) was fabricated by combining electrochemical etching with 355 nm laser processing. pSi prepared in this way proves to be an excellent substrate for desorption/ionization on silicon (DIOS) mass spectrometry (MS). Surfaces prepared by electrochemical etching and laser irradiation exhibit strong quantum confinement as evidenced by the observation of a red shift in the Si Raman band at ~520-500 cm-1. The height of the nanostructured columns produced by electrochemical etching and laser processing is on the order of microns compared with tens of nanometers obtained without laser irradiation. The threshold for laser desorption and ionization of 12 mJ/cm2 using the pSi substrates prepared in this work is lower than that obtained for conventional matrix assisted laser desorption ionization (MALDI)-MS using a standard matrix compound such as [alpha]-cyano-4-hydroxycinnamic acid (CHCA; 30 mJ/cm2). Furthermore, the substrates prepared by etching and laser irradiation appear to resist laser damage better than those prepared by etching alone. These results enhance the capability of pSi for the detection of small molecular weight analytes by DIOS-MS.

  2. A deep etching mechanism for trench-bridging silicon nanowires

    International Nuclear Information System (INIS)

    Tasdemir, Zuhal; Alaca, B Erdem; Wollschläger, Nicole; Österle, Werner; Leblebici, Yusuf

    2016-01-01

    Introducing a single silicon nanowire with a known orientation and dimensions to a specific layout location constitutes a major challenge. The challenge becomes even more formidable, if one chooses to realize the task in a monolithic fashion with an extreme topography, a characteristic of microsystems. The need for such a monolithic integration is fueled by the recent surge in the use of silicon nanowires as functional building blocks in various electromechanical and optoelectronic applications. This challenge is addressed in this work by introducing a top-down, silicon-on-insulator technology. The technology provides a pathway for obtaining well-controlled silicon nanowires along with the surrounding microscale features up to a three-order-of-magnitude scale difference. A two-step etching process is developed, where the first shallow etch defines a nanoscale protrusion on the wafer surface. After applying a conformal protection on the protrusion, a deep etch step is carried out forming the surrounding microscale features. A minimum nanowire cross-section of 35 nm by 168 nm is demonstrated in the presence of an etch depth of 10 μm. Nanowire cross-sectional features are characterized via transmission electron microscopy and linked to specific process steps. The technology allows control on all dimensional aspects along with the exact location and orientation of the silicon nanowire. The adoption of the technology in the fabrication of micro and nanosystems can potentially lead to a significant reduction in process complexity by facilitating direct access to the nanowire during surface processes such as contact formation and doping. (paper)

  3. Silicon germanium as a novel mask for silicon deep reactive ion etching

    KAUST Repository

    Serry, Mohamed Y.

    2013-10-01

    This paper reports on the use of p-type polycrystalline silicon germanium (poly-Si1-xGex) thin films as a new masking material for the cryogenic deep reactive ion etching (DRIE) of silicon. We investigated the etching behavior of various poly-Si1-xGex:B (0Etching selectivity for silicon, silicon oxide, and photoresist was determined at different etching temperatures, ICP and RF powers, and SF6 to O2 ratios. The study demonstrates that the etching selectivity of the SiGe mask for silicon depends strongly on three factors: Ge content; boron concentration; and etching temperature. Compared to conventional SiO2 and SiN masks, the proposed SiGe masking material exhibited several advantages, including high etching selectivity to silicon (>1:800). Furthermore, the SiGe mask was etched in SF6/O2 plasma at temperatures ≥ - 80°C and at rates exceeding 8 μm/min (i.e., more than 37 times faster than SiO2 or SiN masks). Because of the chemical and thermodynamic stability of the SiGe film as well as the electronic properties of the mask, it was possible to deposit the proposed film at CMOS backend compatible temperatures. The paper also confirms that the mask can easily be dry-removed after the process with high etching-rate by controlling the ICP and RF power and the SF6 to O2 ratios, and without affecting the underlying silicon substrate. Using low ICP and RF power, elevated temperatures (i.e., > - 80°C), and an adjusted O2:SF6 ratio (i.e., ~6%), we were able to etch away the SiGe mask without adversely affecting the final profile. Ultimately, we were able to develop deep silicon- trenches with high aspect ratio etching straight profiles. © 1992-2012 IEEE.

  4. Silicon etching using only Oxygen at high temperature: An alternative approach to Si micro-machining on 150 mm Si wafers

    Science.gov (United States)

    Chai, Jessica; Walker, Glenn; Wang, Li; Massoubre, David; Tan, Say Hwa; Chaik, Kien; Hold, Leonie; Iacopi, Alan

    2015-12-01

    Using a combination of low-pressure oxygen and high temperatures, isotropic and anisotropic silicon (Si) etch rates can be controlled up to ten micron per minute. By varying the process conditions, we show that the vertical-to-lateral etch rate ratio can be controlled from 1:1 isotropic etch to 1.8:1 anisotropic. This simple Si etching technique combines the main respective advantages of both wet and dry Si etching techniques such as fast Si etch rate, stiction-free, and high etch rate uniformity across a wafer. In addition, this alternative O2-based Si etching technique has additional advantages not commonly associated with dry etchants such as avoiding the use of halogens and has no toxic by-products, which improves safety and simplifies waste disposal. Furthermore, this process also exhibits very high selectivity (>1000:1) with conventional hard masks such as silicon carbide, silicon dioxide and silicon nitride, enabling deep Si etching. In these initial studies, etch rates as high as 9.2 μm/min could be achieved at 1150 °C. Empirical estimation for the calculation of the etch rate as a function of the feature size and oxygen flow rate are presented and used as proof of concepts.

  5. Silicon etching using only Oxygen at high temperature: An alternative approach to Si micro-machining on 150 mm Si wafers.

    Science.gov (United States)

    Chai, Jessica; Walker, Glenn; Wang, Li; Massoubre, David; Tan, Say Hwa; Chaik, Kien; Hold, Leonie; Iacopi, Alan

    2015-12-04

    Using a combination of low-pressure oxygen and high temperatures, isotropic and anisotropic silicon (Si) etch rates can be controlled up to ten micron per minute. By varying the process conditions, we show that the vertical-to-lateral etch rate ratio can be controlled from 1:1 isotropic etch to 1.8:1 anisotropic. This simple Si etching technique combines the main respective advantages of both wet and dry Si etching techniques such as fast Si etch rate, stiction-free, and high etch rate uniformity across a wafer. In addition, this alternative O2-based Si etching technique has additional advantages not commonly associated with dry etchants such as avoiding the use of halogens and has no toxic by-products, which improves safety and simplifies waste disposal. Furthermore, this process also exhibits very high selectivity (>1000:1) with conventional hard masks such as silicon carbide, silicon dioxide and silicon nitride, enabling deep Si etching. In these initial studies, etch rates as high as 9.2 μm/min could be achieved at 1150 °C. Empirical estimation for the calculation of the etch rate as a function of the feature size and oxygen flow rate are presented and used as proof of concepts.

  6. The black silicon method VI: high aspect ratio trench etching for MEMS applications

    NARCIS (Netherlands)

    Jansen, Henricus V.; de Boer, Meint J.; Elwenspoek, Michael Curt

    1996-01-01

    Etching high aspect ratio trenches (HART's) in silicon is becoming increasingly important for MEMS applications. Currently, the most important technique is dry reactive ion etching (RIE). This paper presents solutions for the most notorious problems during etching HART's: tilting and the aspect

  7. Metal assisted photochemical etching of 4H silicon carbide

    Science.gov (United States)

    Leitgeb, Markus; Zellner, Christopher; Schneider, Michael; Schwab, Stefan; Hutter, Herbert; Schmid, Ulrich

    2017-11-01

    Metal assisted photochemical etching (MAPCE) of 4H-silicon carbide (SiC) in Na2S2O8/HF and H2O2/HF aqueous solutions is investigated with platinum as metallic cathode. The formation process of the resulting porous layer is studied with respect to etching time, concentration and type of oxidizing agent. From the experiments it is concluded that the porous layer formation is due to electron hole pairs generated in the semiconductor, which stem from UV light irradiation. The generated holes are consumed during the oxidation of 4H-SiC and the formed oxide is dissolved by HF. To maintain charge balance, the oxidizing agent has to take up electrons at the Pt/etching solution interface. Total dissolution of the porous layers is achieved when the oxidizing agent concentration decreases during MAPCE. In combination with standard photolithography, the definition of porous regions is possible. Furthermore chemical micromachining of 4 H-SiC at room temperature is possible.

  8. Determination of etching parameters for pulsed XeF2 etching of silicon using chamber pressure data

    Science.gov (United States)

    Sarkar, Dipta; Baboly, M. G.; Elahi, M. M.; Abbas, K.; Butner, J.; Piñon, D.; Ward, T. L.; Hieber, Tyler; Schuberth, Austin; Leseman, Z. C.

    2018-04-01

    A technique is presented for determination of the depletion of the etchant, etched depth, and instantaneous etch rate for Si etching with XeF2 in a pulsed etching system in real time. The only experimental data required is the pressure data collected temporally. Coupling the pressure data with the knowledge of the chemical reactions allows for the determination of the etching parameters of interest. Using this technique, it is revealed that pulsed etching processes are nonlinear, with the initial etch rate being the highest and monotonically decreasing as the etchant is depleted. With the pulsed etching system introduced in this paper, the highest instantaneous etch rate of silicon was recorded to be 19.5 µm min-1 for an initial pressure of 1.2 Torr for XeF2. Additionally, the same data is used to determine the rate constant for the reaction of XeF2 with Si; the reaction is determined to be second order in nature. The effect of varying the exposed surface area of Si as well as the effect that pressure has on the instantaneous etch rate as a function of time is shown applying the same technique. As a proof of concept, an AlN resonator is released using XeF2 pulses to remove a sacrificial poly-Si layer.

  9. Low-Roughness Plasma Etching of HgCdTe Masked with Patterned Silicon Dioxide

    Science.gov (United States)

    Ye, Z. H.; Hu, W. D.; Yin, W. T.; Huang, J.; Lin, C.; Hu, X. N.; Ding, R. J.; Chen, X. S.; Lu, W.; He, L.

    2011-08-01

    A novel mask technique utilizing patterned silicon dioxide films has been exploited to perform mesa etching for device delineation and electrical isolation of HgCdTe third-generation infrared focal-plane arrays (IRFPAs). High-density silicon dioxide films were deposited at temperature of 80°C, and a procedure for patterning and etching of HgCdTe was developed by standard photolithography and wet chemical etching. Scanning electron microscopy (SEM) showed that the surfaces of inductively coupled plasma (ICP) etched samples were quite clean and smooth. Root-mean-square (RMS) roughness characterized by atomic force microscopy (AFM) was less than 1.5 nm. The etching selectivity between a silicon dioxide film and HgCdTe in the samples masked with patterned silicon dioxide films was greater than 30:1. These results show that the new masking technique is readily available and promising for HgCdTe mesa etching.

  10. Deep glass etched microring resonators based on silica-on-silicon technology

    DEFF Research Database (Denmark)

    Ou, Haiyan; Rottwitt, Karsten; Philipp, Hugh Taylor

    2006-01-01

    Microring resonators fabricated on silica-on-silicon technology using deep glass etching are demonstrated. The fabrication procedures are introduced and the transmission spectrum of a resonator is presented.......Microring resonators fabricated on silica-on-silicon technology using deep glass etching are demonstrated. The fabrication procedures are introduced and the transmission spectrum of a resonator is presented....

  11. Same-Side Platinum Electrodes for Metal Assisted Etching of Porous Silicon

    Science.gov (United States)

    2015-11-01

    Platinum Electrodes for Metal Assisted Etching of Porous Silicon by Matthew H Ervin and Brian Isaacson Sensors and Electron Devices Directorate...SUBTITLE Same-Side Platinum Electrodes for Metal Assisted Etching of Porous Silicon 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c. PROGRAM ELEMENT

  12. Etching of Silicon in HBr Plasmas for High Aspect Ratio Features

    Science.gov (United States)

    Hwang, Helen H.; Meyyappan, M.; Mathad, G. S.; Ranade, R.

    2002-01-01

    Etching in semiconductor processing typically involves using halides because of the relatively fast rates. Bromine containing plasmas can generate high aspect ratio trenches, desirable for DRAM and MEMS applications, with relatively straight sidewalk We present scanning electron microscope images for silicon-etched trenches in a HBr plasma. Using a feature profile simulation, we show that the removal yield parameter, or number of neutrals removed per incident ion due to all processes (sputtering, spontaneous desorption, etc.), dictates the profile shape. We find that the profile becomes pinched off when the removal yield is a constant, with a maximum aspect ratio (AR) of about 5 to 1 (depth to height). When the removal yield decreases with increasing ion angle, the etch rate increases at the comers and the trench bottom broadens. The profiles have ARs of over 9:1 for yields that vary with ion angle. To match the experimentally observed etched time of 250 s for an AR of 9:1 with a trench width of 0.135 microns, we find that the neutral flux must be 3.336 x 10(exp 17)sq cm/s.

  13. Multi-Step Deep Reactive Ion Etching Fabrication Process for Silicon-Based Terahertz Components

    Science.gov (United States)

    Jung-Kubiak, Cecile (Inventor); Reck, Theodore (Inventor); Chattopadhyay, Goutam (Inventor); Perez, Jose Vicente Siles (Inventor); Lin, Robert H. (Inventor); Mehdi, Imran (Inventor); Lee, Choonsup (Inventor); Cooper, Ken B. (Inventor); Peralta, Alejandro (Inventor)

    2016-01-01

    A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

  14. Synthesis and Characterization of Silicon Nanowires by Electroless Etching

    Science.gov (United States)

    Bhujel, Rabina; Rizal, Umesh; Agarwal, Amit; Swain, Bhabani S.; Swain, Bibhu P.

    2018-02-01

    Silicon nanowires (SiNWs) were synthesized by two-step electroless etching of p-type Si (100) wafer and characterized by field emission scanning electron microscopy, UV-Vis spectroscopy, x-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy and Raman spectroscopy. The vibrational signature at 1108 and 2087 cm-1 confirmed SiNWs were passivated by both oxygen and hydrogen atoms. Raman peak at 517 cm-1 indicated crystalline SiNWs with tailing toward redshift due to Fano effect. The Si(2p) and Si(2s) core orbital spectra of SiNWs were found at 99.8 and 150.5 eV, respectively. Moreover, the reflection of SiNWs is minimized to 1 to 5% in the 650-nm wavelength.

  15. Improved metal assisted chemical etching method for uniform, vertical and deep silicon structure

    International Nuclear Information System (INIS)

    Miao, Bin; Ding, Xiangzhen; Wu, Dongmin; Li, Jiadong; Zhang, Jian; Wu, Yihui; Lu, Wenhui

    2017-01-01

    This paper presents a preliminary result about ultra-deep etched microstructures on 〈1 0 0〉 silicon wafer based on metal assisted chemical etching (MaCE). Honeycomb hole arrays with 50 µ m width were successfully etched, as deep as 280 µ m. The porous defects on the patterned surface and the lateral etching on the sidewall were effectively suppressed by optimizing the etchant solution. The results in this paper indicate that 〈1 0 0〉 silicon can be etched vertically with smooth sidewalls by an etchant solution containing ethanol, instead of the conventional aqueous-based solution. This improved method of MaCE has potential application in large-scale Si etching as a supplementary method to the expensive and complicated dry etching method. (paper)

  16. Nano silver-catalyzed chemical etching of polycrystalline silicon wafer for solar cell application

    Directory of Open Access Journals (Sweden)

    S. R. Chen

    2016-03-01

    Full Text Available Silver nanoparticles were deposited on the surface of polycrystalline silicon wafer via vacuum thermal evaporation and metal-catalyzed chemical etching (MCCE was conducted in a HF-H2O2 etching system. Treatment of the etched silicon wafer with HF transformed the textured structure on the surface from nanorods into nanocones. An etching time of 30 s and treatment with HF resulted in nanocones with uniform size distribution and a reflectivity as low as 1.98% across a spectral range from 300 to 1000 nm.

  17. Formation of Mach angle profiles during wet etching of silica and silicon nitride materials

    Energy Technology Data Exchange (ETDEWEB)

    Ghulinyan, M., E-mail: ghulinyan@fbk.eu [Centre for Materials and Microsystems, Fondazione Bruno Kessler, I-38123 Povo (Italy); Bernard, M.; Bartali, R. [Centre for Materials and Microsystems, Fondazione Bruno Kessler, I-38123 Povo (Italy); Deptartment of Physics, University of Trento, I-38123 Povo (Italy); Pucker, G. [Centre for Materials and Microsystems, Fondazione Bruno Kessler, I-38123 Povo (Italy)

    2015-12-30

    Highlights: • Photoresist adhesion induces the formation of complex etch profiles in dielectrics. • Hydrofluoric acid etching of silica glass and silicon nitride materials was studied. • The phenomenon has been modeled in analogy with sonic boom propagation. • The material etch rate and resist adhesion/erosion define the final profile. - Abstract: In integrated circuit technology peeling of masking photoresist films is a major drawback during the long-timed wet etching of materials. It causes an undesired film underetching, which is often accompanied by a formation of complex etch profiles. Here we report on a detailed study of wedge-shaped profile formation in a series of silicon oxide, silicon oxynitride and silicon nitride materials during wet etching in a buffered hydrofluoric acid (BHF) solution. The shape of etched profiles reflects the time-dependent adhesion properties of the photoresist to a particular material and can be perfectly circular, purely linear or a combination of both, separated by a knee feature. Starting from a formal analogy between the sonic boom propagation and the wet underetching process, we model the wedge formation mechanism analytically. This model predicts the final form of the profile as a function of time and fits the experimental data perfectly. We discuss how this knowledge can be extended to the design and the realization of optical components such as highly efficient etch-less vertical tapers for passive silicon photonics.

  18. Synthesis and Characterization of Chemically Etched Nanostructured Silicon

    KAUST Repository

    Mughal, Asad Jahangir

    2012-05-01

    Silicon is an essential element in today’s modern world. Nanostructured Si is a more recently studied variant, which has currently garnered much attention. When its spatial dimensions are confined below a certain limit, its optical properties change dramatically. It transforms from an indirect bandgap material that does not absorb or emit light efficiently into one which can emit visible light at room temperatures. Although much work has been conducted in understanding the properties of nanostructured Si, in particular porous Si surfaces, a clear understanding of the origin of photoluminescence has not yet been produced. Typical synthesis approaches used to produce nanostructured Si, in particular porous Si and nanocrystalline Si have involved complex preparations used at high temperatures, pressures, or currents. The purpose of this thesis is to develop an easier synthesis approach to produce nanostructured Si as well as arrive at a clearer understanding of the origin of photoluminescence in these systems. We used a simple chemical etching technique followed by sonication to produce nanostructured Si suspensions. The etching process involved producing pores on the surface of a Si substrate in a solution containing hydrofluoric acid and an oxidant. Nanocrystalline Si as well as nanoscale amorphous porous Si suspensions were successfully synthesized using this process. We probed into the phase, composition, and origin of photoluminescence in these materials, through the use of several characterization techniques. TEM and SEM were used to determine morphology and phase. FT-IR and XPS were employed to study chemical compositions, and steady state and time resolved optical spectroscopy techniques were applied to resolve their photoluminescent properties. Our work has revealed that the type of oxidant utilized during etching had a significant impact on the final product. When using nitric acid as the oxidant, we formed nanocrystalline Si suspensions composed of

  19. Effect of helium ion beam treatment on wet etching of silicon dioxide

    Science.gov (United States)

    Petrov, Yu. V.; Grigoryev, E. A.; Sharov, T. V.; Baraban, A. P.

    2018-03-01

    We investigated the effect of helium ion beam treatment on the etching rate of silicon dioxide in a water based solution of hydrofluoric acid. A 460-nm-thick silicon dioxide film on silicon was irradiated with helium ions having energies of 20 keV and 30 keV with ion fluences ranging from 1014 cm-2 to 1017 cm-2. The dependence of the etching rate on depth was obtained and compared with the depth distribution of ion-induced defects, which was obtained from numerical simulation. Irradiation with helium ions results in an increase of the etching rate of silicon dioxide. The dependence of the etching rate on the calculated concentration of ion-induced defects is described.

  20. Light coupling and light trapping in alkaline etched multicrystalline silicon wafers for solar cells

    NARCIS (Netherlands)

    Hylton, J.D.

    2006-01-01

    The reflection reducing and light trapping properties of alkaline etched multicrystalline silicon wafers are investigated experimentally. Following an overview of various chemical texturisation methods and their effect upon the surface morphology, a high concentration saw-damage etch and a low

  1. Periodic arrays of deep nanopores made in silicon with reactive ion etching and deep UV lithography

    NARCIS (Netherlands)

    Woldering, L.A.; Tjerkstra, R.W.; Jansen, Henricus V.; Setija, Irwan D.; Vos, Willem L.

    2008-01-01

    We report on the fabrication of periodic arrays of deep nanopores with high aspect ratios in crystalline silicon. The radii and pitches of the pores were defined in a chromium mask by means of deep UV scan and step technology. The pores were etched with a reactive ion etching process with SF6,

  2. Isotropic etching of silicon in fluoride containing solutions as a tool for micromachining

    OpenAIRE

    Tjerkstra, R.W.

    1999-01-01

    μTAS is hot in micromechanics today. All μTAS devices contain channels to connect the different components together. Channels can also be used as chromatography columns. Isotropic wet chemical etching of silicon can be a suitable process to construct (hemi)circular channels with very smooth surfaces. Wet etching of silicon can be done chemically, using aqueous solutions of HF and HNO , or electrochemically, using aqueous HF solutions. Both processes suffer from the loading-effect: due to extr...

  3. Chemically Etched Silicon Nanowires as Anodes for Lithium-Ion Batteries

    Energy Technology Data Exchange (ETDEWEB)

    West, Hannah Elise [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2015-08-01

    This study focused on silicon as a high capacity replacement anode for Lithium-ion batteries. The challenge of silicon is that it expands ~270% upon lithium insertion which causes particles of silicon to fracture, causing the capacity to fade rapidly. To account for this expansion chemically etched silicon nanowires from the University of Maine were studied as anodes. They were built into electrochemical half-cells and cycled continuously to measure the capacity and capacity fade.

  4. Dopant Selective Reactive Ion Etching of Silicon Carbide

    Science.gov (United States)

    Okojie, Robert (Inventor)

    2016-01-01

    A method for selectively etching a substrate is provided. In one embodiment, an epilayer is grown on top of the substrate. A resistive element may be defined and etched into the epilayer. On the other side of the substrate, the substrate is selectively etched up to the resistive element, leaving a suspended resistive element.

  5. Study of microstructure and silicon segregation in cast iron using color etching and electron microprobe analysis

    Energy Technology Data Exchange (ETDEWEB)

    Vazehrad, S., E-mail: vazehrad@kth.se [Dep. Materials Science and Engineering/Casting of Metals, Royal Institute of Technology, SE-100 44 Stockholm (Sweden); Elfsberg, J., E-mail: jessica.elfsberg@scania.com [Scania CV AB, SE-151 87 Södertälje (Sweden); Diószegi, A., E-mail: attila.dioszegi@jth.hj.se [Dep. Materials Science and Engineering/Casting of Metals, Royal Institute of Technology, SE-100 44 Stockholm (Sweden); Dep. Mechanical Engineering/Materials and Manufacturing-Foundry Technology, Jönköping University, SE-551 11 Jönköping (Sweden)

    2015-06-15

    An investigation on silicon segregation of lamellar, compacted and nodular graphite iron was carried out by applying a selective, immersion color etching and a modified electron microprobe to study the microstructure. The color etched micrographs of the investigated cast irons by revealing the austenite phase have provided data about the chronology and mechanism of microstructure formation. Moreover, electron microprobe has provided two dimensional segregation maps of silicon. A good agreement was found between the segregation profile of silicon in the color etched microstructure and the silicon maps achieved by electron microprobe analysis. However, quantitative silicon investigation was found to be more accurate than color etching results to study the size of the eutectic colonies. - Highlights: • Sensitivity of a color etchant to silicon segregation is quantitatively demonstrated. • Si segregation measurement by EMPA approved the results achieved by color etching. • Color etched micrographs provided data about solidification mechanism in cast irons. • Austenite grain boundaries were identified by measuring the local Si concentration.

  6. Correlation between oxidant concentrations, morphological aspects and etching kinetics of silicon nanowires during silver-assist electroless etching

    Science.gov (United States)

    Moumni, Besma; Jaballah, Abdelkader Ben

    2017-12-01

    Silicon porosification by silver assisted chemical etching (Ag-ACE) for a short range of H2O2 concentration is reported. We experimentally show that porous silicon (PSi) is obtained for 1% H2O2, whereas silicon nanowires (SiNWs) appeared by simply tuning the concentration of H2O2 to relatively high concentrations up to 8%. The morphological aspects are claimed by scanning electron microscopy proving that the kinetics of SiNWs formation display nonlinear relationships versus H2O2 concentration and etching time. A semi-qualitative electrochemical etching model based on local anodic, Ic, and cathodic, Ia, currents is proposed to explain the different morphological changes, and to unveil the formation pathways of both PS and SiNWs. More importantly, an efficient antireflective character for silicon solar cell (reflectance close to 2%) is realized at 8% H2O2. In addition, the luminescence of the prepared Si-nanostructures is claimed by photoluminescence which exhibit a large enhancement of the intensity and a blue shift for narrow and deep SiNWs.

  7. Two modes of surface roughening during plasma etching of silicon: Role of ionized etch products

    Science.gov (United States)

    Nakazaki, Nobuya; Tsuda, Hirotaka; Takao, Yoshinori; Eriguchi, Koji; Ono, Kouichi

    2014-12-01

    Atomic- or nanometer-scale surface roughening has been investigated during Si etching in inductively coupled Cl2 plasmas, as a function of rf bias power or ion incident energy Ei, by varying feed gas flow rate, wafer stage temperature, and etching time. The experiments revealed two modes of surface roughening which occur depending on Ei: one is the roughening mode at low Ei rms) roughness of etched surfaces increases with increasing Ei, exhibiting an almost linear increase with time during etching (t rms surface roughness decreases substantially with Ei down to a low level etch rate versus √{Ei } curve, and in the evolution of the power spectral density distribution of surfaces. Such changes from the roughening to smoothing modes with increasing Ei were found to correspond to changes in the predominant ion flux from feed gas ions Clx+ to ionized etch products SiClx+ caused by the increased etch rates at increased Ei, in view of the results of several plasma diagnostics. Possible mechanisms for the formation and evolution of surface roughness during plasma etching are discussed with the help of Monte Carlo simulations of the surface feature evolution and classical molecular dynamics simulations of etch fundamentals, including stochastic roughening and effects of ion reflection and etch inhibitors.

  8. Etching process for improving the strength of a laser-machined silicon-based ceramic article

    Science.gov (United States)

    Copley, Stephen M.; Tao, Hongyi; Todd-Copley, Judith A.

    1991-01-01

    A process for improving the strength of laser-machined articles formed of a silicon-based ceramic material such as silicon nitride, in which the laser-machined surface is immersed in an etching solution of hydrofluoric acid and nitric acid for a duration sufficient to remove substantially all of a silicon film residue on the surface but insufficient to allow the solution to unduly attack the grain boundaries of the underlying silicon nitride substrate. This effectively removes the silicon film as a source of cracks that otherwise could propagate downwardly into the silicon nitride substrate and significantly reduce its strength.

  9. Study of the roughness in a photoresist masked, isotropic, SF6-based ICP silicon etch

    DEFF Research Database (Denmark)

    Larsen, Kristian Pontoppidan; Petersen, Dirch Hjorth; Hansen, Ole

    2006-01-01

    In this paper we study the etching behavior and the resulting roughness in photoresist-masked isotropic silicon plasma etch performed in an inductively coupled plasma (ICP) etcher using SF6. We report detailed observations of the resulting roughness for various etching parameters, covering......: pressure from 2.5 to 70 mTorr, SF6 flow rate from 50 to 300 sccm, platen power from 0 to 16 W, and ICP power from 1000 to 3000 W. Etch processes with a normalized roughness below 0.005 were found at low pressure, p = 10 mTorr, while larger normalized roughness, above 0.02, occurred at higher pressures, p...

  10. Improvement of surface roughness in silicon-on-insulator wafer fabrication using a neutral beam etching

    Science.gov (United States)

    Min, T. H.; Park, B. J.; Kang, S. K.; Gweon, G. H.; Kim, Y. Y.; Yeom, G. Y.

    2009-08-01

    Silicon-on-insulator (SOI) wafers were etched by an energetic chlorine neutral beam obtained by the low-angle forward reflection of an ion beam, and the surface roughness of the etched wafers was compared with that of the SOI wafers etched by an energetic chlorine ion beam. When the ion beam was used to etch the silicon layer of the SOI wafers, the surface roughness was not significantly changed even though the use of higher ion bombardment energy slightly decreased the surface roughness of the SOI wafer. However, when the chlorine neutral beam was used instead of the chlorine ion beam having a similar beam energy, the surface roughness of the SOI wafer was significantly improved compared with that etched by the chlorine ion beam. By etching about 150 nm silicon from the SOI wafer having a 300 nm-thick top silicon layer with the chlorine neutral beam at the energy of 500 eV, the rms surface roughness of 1.5 Å could be obtained with the etch rate of about 750 Å min-1.

  11. Porous silicon photonic devices using pulsed anodic etching of lightly doped silicon

    International Nuclear Information System (INIS)

    Escorcia-Garcia, J; Sarracino MartInez, O; Agarwal, V; Gracia-Jimenez, J M

    2009-01-01

    The fabrication of porous silicon photonic structures using lightly doped, p-type, silicon wafers (resistivity: 14-22 Ω cm) by pulsed anodic etching is reported. The optical properties have been found to be strongly dependent on the duty cycle and frequency of the applied current. All the interfaces of the single layered samples were digitally analysed by calculating the mean interface roughness (R m ). The interface roughness was found to be maximum for the sample with direct current. The use of a duty cycle above 50%, in a certain range of frequencies, is found to reduce the interface roughness. The optical properties of some microcavities and rugate filters are investigated from the optimized parameters of the duty cycle and frequency, using the current densities of 10, 90 and 150 mA cm -2 .

  12. Porous silicon photonic devices using pulsed anodic etching of lightly doped silicon

    Energy Technology Data Exchange (ETDEWEB)

    Escorcia-Garcia, J; Sarracino MartInez, O; Agarwal, V [CIICAP-Universidad Autonoma del Estado de Morelos, Av. Universidad 1001, Col Chamilpa, CP 62210, Cuernavaca, Morelos (Mexico); Gracia-Jimenez, J M, E-mail: vagarwal@uaem.m [Instituto de Fisica, BUAP, Apdo. Postal J-48, San Manuel, 72570 Puebla, Puebla (Mexico)

    2009-07-21

    The fabrication of porous silicon photonic structures using lightly doped, p-type, silicon wafers (resistivity: 14-22 OMEGA cm) by pulsed anodic etching is reported. The optical properties have been found to be strongly dependent on the duty cycle and frequency of the applied current. All the interfaces of the single layered samples were digitally analysed by calculating the mean interface roughness (R{sub m}). The interface roughness was found to be maximum for the sample with direct current. The use of a duty cycle above 50%, in a certain range of frequencies, is found to reduce the interface roughness. The optical properties of some microcavities and rugate filters are investigated from the optimized parameters of the duty cycle and frequency, using the current densities of 10, 90 and 150 mA cm{sup -2}.

  13. Simple and fast polydimethylsiloxane (PDMS) patterning using a cutting plotter and vinyl adhesives to achieve etching results.

    Science.gov (United States)

    Hyun Kim; Sun-Young Yoo; Ji Sung Kim; Zihuan Wang; Woon Hee Lee; Kyo-In Koo; Jong-Mo Seo; Dong-Il Cho

    2017-07-01

    Inhibition of polydimethylsiloxane (PDMS) polymerization could be observed when spin-coated over vinyl substrates. The degree of polymerization, partially curing or fully curing, depended on the PDMS thickness coated over the vinyl substrate. This characteristic was exploited to achieve simple and fast PDMS patterning method using a vinyl adhesive layer patterned through a cutting plotter. The proposed patterning method showed results resembling PDMS etching. Therefore, patterning PDMS over PDMS, glass, silicon, and gold substrates were tested to compare the results with conventional etching methods. Vinyl stencils with widths ranging from 200μm to 1500μm were used for the procedure. To evaluate the accuracy of the cutting plotter, stencil designed on the AutoCAD software and the actual stencil widths were compared. Furthermore, this method's accuracy was also evaluated by comparing the widths of the actual stencils and etched PDMS results.

  14. Silicon dioxide etching yield measurements with inductively coupled fluorocarbon plasmas

    International Nuclear Information System (INIS)

    Chae, Heeyeop; Vitale, Steven A.; Sawin, Herbert H.

    2003-01-01

    Oxide etching yield has been measured directly with inductively coupled fluorocarbon plasmas. The yields measurement technique of this work can provide useful information for feature profile evolution modeling, which is essential to understand various issues in oxide etching such as reactive ion etching (RIE) lag, inverse RIE lag, etch stop, microtrenching, bowing, etc. Etching and deposition yields per ion were measured using quartz crystal microbalance (QCM) as a function of ion bombardment energy, ion-to-neutral flux ratio, and ion-impinging angle. C 2 HF 5 , C 2 F 6 , C 2 H 4 F 2 , and C 4 F 8 were used for the oxide etching. Oxide etching mechanism with those gases is complex because etching and deposition are involved at the same time. In highly selective processes fluorocarbon deposition plays important role in determining etching characteristics. Two fluorocarbon deposition mechanisms are identified in this work: neutral deposition and ion-enhanced deposition. The low-energy ions are believed to enhance the deposition rates by creating active sites and fluorocarbon neutrals deposit on the active sites with higher sticking probability. A surface kinetic model is suggested to explain the ion-enhanced mechanism and shows good agreement with experimental data. Angular yield measurement shows that when fluorocarbon deposition is relatively severe, etching yield decreases significantly as the incident angle increases and deposit fluorocarbon at a high incident angle above 60 deg. C

  15. Optimization of silver-assisted nano-pillar etching process in silicon

    Science.gov (United States)

    Azhari, Ayu Wazira; Sopian, Kamaruzzaman; Desa, Mohd Khairunaz Mat; Zaidi, Saleem H.

    2015-12-01

    In this study, a respond surface methodology (RSM) model is developed using three-level Box-Behnken experimental design (BBD) technique. This model is developed to investigate the influence of metal-assisted chemical etching (MACE) process variables on the nanopillars profiles created in single crystalline silicon (Si) substrate. Design-Expert® software (version 7.1) is employed in formulating the RSM model based on five critical process variables: (A) concentration of silver (Ag), (B) concentration of hydrofluoric acid (HF), (C) concentration of hydrogen peroxide (H2O2), (D) deposition time, and (E) etching time. This model is supported by data from 46 experimental configurations. Etched profiles as a function of lateral etching rate, vertical etching rate, height, size and separation between the Si trenches and etching uniformity are characterized using field emission scanning electron microscope (FE-SEM). A quadratic regression model is developed to correlate critical process variables and is validated using the analysis of variance (ANOVA) methodology. The model exhibits near-linear dependence of lateral and vertical etching rates on both the H2O2 concentration and etching time. The predicted model is in good agreement with the experimental data where R2 is equal to 0.80 and 0.67 for the etching rate and lateral etching respectively. The optimized result shows minimum lateral etching with the average pore size of about 69 nm while the maximum etching rate is estimated at around 360 nm/min. The model demonstrates that the etching process uniformity is not influenced by either the etchant concentration or the etching time. This lack of uniformity could be attributed to the surface condition of the wafer. Optimization of the process parameters show adequate accuracy of the model with acceptable percentage errors of 6%, 59%, 1.8%, 38% and 61% for determination of the height, separation, size, the pore size and the etching rate respectively.

  16. Site-controlled fabrication of silicon nanotips by indentation-induced selective etching

    Science.gov (United States)

    Jin, Chenning; Yu, Bingjun; Liu, Xiaoxiao; Xiao, Chen; Wang, Hongbo; Jiang, Shulan; Wu, Jiang; Liu, Huiyun; Qian, Linmao

    2017-12-01

    In the present study, the indentation-induced selective etching approach is proposed to fabricate site-controlled pyramidal nanotips on Si(100) surface. Without any masks, the site-controlled nanofabrication can be realized by nanoindentation and post etching in potassium hydroxide (KOH) solution. The effect of indentation force and etching time on the formation of pyramidal nanotips was investigated. It is found that the height and radius of the pyramidal nanotips increase with the indentation force or etching time, while long-time etching can lead to the collapse of the tips. The formation of pyramidal tips is ascribed to the anisotropic etching of silicon and etching stop of (111) crystal planes in KOH aqueous solution. The capability of this fabrication method was further demonstrated by producing various tip arrays on silicon surface by selective etching of the site-controlled indent patterns, and the maximum height difference of these tips is less than 10 nm. The indentation-induced selective etching provides a new strategy to fabricate well site-controlled tip arrays for multi-probe SPM system, Si nanostructure-based sensors and high-quality information storage.

  17. 29Si-nuclear magnetic resonance on the etching products of silicon in potassium hydroxide solutions

    NARCIS (Netherlands)

    Nijdam, A.J.; van Veenendaal, E.; Gardeniers, Johannes G.E.; Kentgens, A.P.M.; Nachtegaal, G.H.; Elwenspoek, Michael Curt

    We present results of 29Si-nuclear magnetic resonance experiments on a large number of KOH solutions in which silicon has been dissolved. The goal of the experiments is to clarify the chemical composition of concentrated alkaline solutions after etching of silicon. It is confirmed that the initial

  18. Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

    DEFF Research Database (Denmark)

    Heschel, Matthias; Bouwstra, Siebe

    1997-01-01

    The authors describe a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the common baking...

  19. Effect of process parameters on sidewall damage in deep silicon etch

    International Nuclear Information System (INIS)

    Meng, Lingkuan; Yan, Jiang

    2015-01-01

    Sidewall damage caused in deep reactive ion silicon etch was investigated by varying etch cycle time, bias power, etch pressure and SF 6 flow rate using the Bosch process in a uniquely designed, inductively coupled plasma reactor. The effects of these process parameters on the etch profile and sidewall angle were also studied for high density metal–insulator–metal capacitor structure. By choosing the proper etch cycle time of 2 s, it was observed that the sidewall damage was very sensitive to these etch process parameters. As bias power increased, the sidewall damage increased gradually. Especially, at the bias power of 500 W, a dual bowing shape with severe sidewall damage was seen, which might be due to a combination of two mechanisms: the formation of a redeposition region and a secondary ion etch effect. With increasing pressure, the sidewall damage was not always located in a specific depth range but distributed along almost the whole trench sidewall. An etch pressure below 80 mTorr was favorably recommended for reducing the extent of the sidewall damage. In addition, we found that an appropriate SF 6 flow rate was also very beneficial to the realization of a smooth trench sidewall when it was controlled within an appropriate range. Based on these investigations, an acceptable etch condition could be selected to achieve a nearly vertical etch profile as well as a smooth sidewall surface. (paper)

  20. Etch-stop behavior of buried layers formed by substoichiometric nitrogen ion implantation into silicon

    International Nuclear Information System (INIS)

    Perez-Rodriguez, A.; Romano-Rodriguez, A.; Morante, J.R.; Acero, M.C. Esteve, J.; Montserrat, J.; El-Hassani, A.

    1996-01-01

    In this work the etch-stop behavior of buried layers formed by substoichiometric nitrogen ion implantation into silicon is studied as a function of the processing parameters, the implantation dose and temperature, and the presence of capping layers during implantation. Etching characteristics have been probed using tetramethylammonium hydroxide or KOH solutions for different times up to 6 h. Results show that, after annealing, the minimum dose required for the formation of an efficient etch-stop layer is about 4 x 10 17 cm -2 , for an implantation energy of 75 keV. This is defined as a layer with an efficient etch selectivity in relation to Si of s ≥ 100. For larger implantation doses efficient etch selectivities larger than 100 are obtained. However, for these doses a considerable density of pits is observed in the etch-stop layer. These are related to the presence of nitrogen poor Si regions in the buried layer after annealing, due to a partial separation of silicon and silicon nitride phases during the annealing process. The influence of this separation of phases as well as nitrogen gettering in the buried layer on the etch-stop behavior is discussed as a function of the processing parameters

  1. Silicon surface damage caused by reactive ion etching in fluorocarbon gas mixtures containing hydrogen

    International Nuclear Information System (INIS)

    Norstroem, H.; Blom, H.; Ostling, M.; Nylandsted Larsen, A.; Keinonen, J.; Berg, S.

    1991-01-01

    For selective etching of SiO 2 on silicon, gases or gas mixtures containing hydrogen are often used. Hydrogen from the glow discharge promotes the formation of a thin film polymer layer responsible for the selectivity of the etching process. The reactive ion etch (RIE) process is known to create damage in the silicon substrate. The influence of hydrogen on the damage and deactivation of dopants is investigated in the present work. The distribution of hydrogen in silicon, after different etching and annealing conditions have been studied. The influence of the RIE process on the charge carrier concentration in silicon has been investigated. Various analytical techniques like contact resistivity measurements, four point probe measurements, and Hall measurements have been used to determine the influence of the RIE process on the electrical properties of processed silicon wafers. The hydrogen profile in as-etched and post annealed wafers was determined by the 1 H( 15 N,αγ) 12 C nuclear reaction. The depth of the deactivated surface layer is discussed in terms of the impinging hydrogen ion energy, i.e., the possibility of H + ions to pick up an energy equal to the peak-to-peak voltage of the rf signal

  2. Two modes of surface roughening during plasma etching of silicon: Role of ionized etch products

    OpenAIRE

    Nakazaki, Nobuya; Tsuda, Hirotaka; Takao, Yoshinori; Eriguchi, Koji; Ono, Kouichi

    2014-01-01

    Atomic- or nanometer-scale surface roughening has been investigated during Si etching in inductively coupled Cl{2} plasmas, as a function of rf bias power or ion incident energy E{i} , by varying feed gas flow rate, wafer stage temperature, and etching time. The experiments revealed two modes of surface roughening which occur depending on E{i} : one is the roughening mode at low E{i}  

  3. Reactive species generated during wet chemical etching of silicon in HF/HNO3 mixtures.

    Science.gov (United States)

    Steinert, Marco; Acker, Jörg; Krause, Matthias; Oswald, Steffen; Wetzig, Klaus

    2006-06-15

    The role of intermediate species generated during wet chemical etching of silicon in a HF-rich HF/HNO3 mixture was studied by spectroscopic and analytical methods at 1 degrees C. The intermediate N2O3 was identified by its cobalt blue color and the characteristic features in its UV-vis and Raman spectra. Furthermore, a complex N(III) species (3NO+.NO3-) denoted as [N4O6(2+)] is observed in these solutions. The time-dependent decay of the N(III) intermediates, mainly by their oxidation at the liquid-air interface, serves as a precondition for the study of the etch rate as function of the intermediate concentration measured by Raman spectroscopy. From a linear relationship between etch rate and [N4O6(2+)] concentration, NO+ is considered to be a reactive species in the rate-limiting step. This step is attributed to the oxidation of permanent existing Si-H bonds at the silicon surface by the reactive NO+ species. N2O3 serves as a reservoir for the generation of NO+ leading to a complete coverage of the silicon surface with reactive species at high intermediate concentrations. As long as this condition is valid (plateau region), the etch rate is constant and yields a smooth silicon surface upon completion of the etching. If the N2O3 concentration is insufficient to ensure a coverage of the Si surface by NO+, the etch rate decreases linearly with the N2O3 concentration and results in a roughening of the etched silicon surface (slope region).

  4. Three-dimensionally controlled size-reduction of silicon nanopillars by photoelectrochemical etching

    Science.gov (United States)

    Juhasz, Robert; Linnros, Jan

    2001-05-01

    Silicon nanopillars, fabricated by electron beam lithography and reactive ion etching, were size-reduced using laser-assisted electrochemical etching in a dilute hydrofluoric acid solution. The progressing size reduction was followed by scanning electron microscopy down to final diameters of ˜15 nm. By varying the voltage bias, it was found that etching could be directed primarily at the pillar top (7 V) or at the pillar base (-0.6 V) whereas in an intermediate regime, conformal etching could be obtained. From the rate of volume change during etching, it was concluded that holes, participating in the dissolution reaction, were primarily generated within the pillar volume. The corresponding effective dissolution valence was ˜5-9, indicating substantial recombination losses within the pillar.

  5. Etch rate and surface morphology of polycrystalline beta-silicon carbide using chlorine trifluoride gas

    OpenAIRE

    Habuka, Hitoshi; Oda, S.; Fukai, Y.; Fukae, K.; Takeuchi, T.; Aihara, M.

    2006-01-01

    Etch rates of polycrystalline beta-silicon carbide (SiC) substrate in a wide range from less than one to more than 10 mu m/min are obtained using chlorine trifluoride gas in ambient nitrogen at 673-973 K and atmospheric pressure in a horizontal reactor. Over the chlorine trifluoride gas concentrations of 10-100% used in this study, the etch rate increases at the substrate temperatures between 673 and 773 K. Additionally, the etch rate at temperatures higher than 773 K is independent of the su...

  6. Optimization of silver-assisted nano-pillar etching process in silicon

    Energy Technology Data Exchange (ETDEWEB)

    Azhari, Ayu Wazira, E-mail: ayuwazira@unimap.edu.my [Solar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, Selangor 43650 (Malaysia); School of Environmental Engineering, Universiti Malaysia Perlis, 01000, Kangar, Perlis (Malaysia); Sopian, Kamaruzzaman [Solar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, Selangor 43650 (Malaysia); Desa, Mohd Khairunaz Mat [School of Electrical and Electronic Engineering, Universiti Sains Malaysia, Nibong Tebal, Pulau Pinang, 14300 (Malaysia); Zaidi, Saleem H. [Solar Energy Research Institute, Universiti Kebangsaan Malaysia, Bangi, Selangor 43650 (Malaysia)

    2015-12-01

    Graphical abstract: - Highlights: • Statistical analysis for synthesis of nano-pillar in crystalline Si substrates is presented. • Model is in good agreement with experimental for the etching rate and lateral etching respectively. • Optimum values for all parameters in fabrication of nanostructured Si are attained. - Abstract: In this study, a respond surface methodology (RSM) model is developed using three-level Box–Behnken experimental design (BBD) technique. This model is developed to investigate the influence of metal-assisted chemical etching (MACE) process variables on the nanopillars profiles created in single crystalline silicon (Si) substrate. Design-Expert{sup ®} software (version 7.1) is employed in formulating the RSM model based on five critical process variables: (A) concentration of silver (Ag), (B) concentration of hydrofluoric acid (HF), (C) concentration of hydrogen peroxide (H{sub 2}O{sub 2}), (D) deposition time, and (E) etching time. This model is supported by data from 46 experimental configurations. Etched profiles as a function of lateral etching rate, vertical etching rate, height, size and separation between the Si trenches and etching uniformity are characterized using field emission scanning electron microscope (FE-SEM). A quadratic regression model is developed to correlate critical process variables and is validated using the analysis of variance (ANOVA) methodology. The model exhibits near-linear dependence of lateral and vertical etching rates on both the H{sub 2}O{sub 2} concentration and etching time. The predicted model is in good agreement with the experimental data where R{sup 2} is equal to 0.80 and 0.67 for the etching rate and lateral etching respectively. The optimized result shows minimum lateral etching with the average pore size of about 69 nm while the maximum etching rate is estimated at around 360 nm/min. The model demonstrates that the etching process uniformity is not influenced by either the etchant

  7. Self-assembled peptide nanotubes as an etching material for the rapid fabrication of silicon wires

    DEFF Research Database (Denmark)

    Larsen, Martin Benjamin Barbour Spanget; Andersen, Karsten Brandt; Svendsen, Winnie Edith

    2011-01-01

    This study has evaluated self-assembled peptide nanotubes (PNTS) and nanowires (PNWS) as etching mask materials for the rapid and low-cost fabrication of silicon wires using reactive ion etching (RIE). The self-assembled peptide structures were fabricated under mild conditions and positioned on c...... characterization by SEM and I-V measurements. Additionally, the fabricated silicon structures were functionalized with fluorescent molecules via a biotin-streptavidin interaction in order to probe their potential in the development of biosensing devices....

  8. Electrochemically etched nanoporous silicon membrane for separation of biological molecules in mixture

    International Nuclear Information System (INIS)

    Burham, Norhafizah; Hamzah, Azrul Azlan; Yunas, Jumril; Majlis, Burhanuddin Yeop

    2017-01-01

    This paper presents a technique for separating biological molecules in mixture using nanoporous silicon membrane. Nanopores were formed using electrochemical etching process (ECE) by etching a prefabricated silicon membrane in hydrofluoric acid (HF) and ethanol, and then directly bonding it with PDMS to form a complete filtration system for separating biological molecules. Tygon S3"™ tubings were used as fluid interconnection between PDMS molds and silicon membrane during testing. Electrochemical etching parameters were manipulated to control pore structure and size. In this work, nanopores with sizes of less than 50 nm, embedded on top of columnar structures have been fabricated using high current densities and variable HF concentrations. Zinc oxide was diluted with deionized (DI) water and mixed with biological molecules and non-biological particles, namely protein standard, serum albumin and sodium chloride. Zinc oxide particles were trapped on the nanoporous silicon surface, while biological molecules of sizes up to 12 nm penetrated the nanoporous silicon membrane. The filtered particles were inspected using a Zetasizer Nano SP for particle size measurement and count. The Zetasizer Nano SP results revealed that more than 95% of the biological molecules in the mixture were filtered out by the nanoporous silicon membrane. The nanoporous silicon membrane fabricated in this work is integratable into bio-MEMS and Lab-on-Chip components to separate two or more types of biomolecules at once. The membrane is especially useful for the development of artificial kidney. (paper)

  9. Electrochemically etched nanoporous silicon membrane for separation of biological molecules in mixture

    Science.gov (United States)

    Burham, Norhafizah; Azlan Hamzah, Azrul; Yunas, Jumril; Yeop Majlis, Burhanuddin

    2017-07-01

    This paper presents a technique for separating biological molecules in mixture using nanoporous silicon membrane. Nanopores were formed using electrochemical etching process (ECE) by etching a prefabricated silicon membrane in hydrofluoric acid (HF) and ethanol, and then directly bonding it with PDMS to form a complete filtration system for separating biological molecules. Tygon S3™ tubings were used as fluid interconnection between PDMS molds and silicon membrane during testing. Electrochemical etching parameters were manipulated to control pore structure and size. In this work, nanopores with sizes of less than 50 nm, embedded on top of columnar structures have been fabricated using high current densities and variable HF concentrations. Zinc oxide was diluted with deionized (DI) water and mixed with biological molecules and non-biological particles, namely protein standard, serum albumin and sodium chloride. Zinc oxide particles were trapped on the nanoporous silicon surface, while biological molecules of sizes up to 12 nm penetrated the nanoporous silicon membrane. The filtered particles were inspected using a Zetasizer Nano SP for particle size measurement and count. The Zetasizer Nano SP results revealed that more than 95% of the biological molecules in the mixture were filtered out by the nanoporous silicon membrane. The nanoporous silicon membrane fabricated in this work is integratable into bio-MEMS and Lab-on-Chip components to separate two or more types of biomolecules at once. The membrane is especially useful for the development of artificial kidney.

  10. Self-assembled monolayer resists and nanoscale lithography of silicon dioxide thin films by chemically enhanced vapor etching (CEVE)

    Science.gov (United States)

    Pan, M.; Yun, M.; Kozicki, M. N.; Whidden, T. K.

    1996-10-01

    We report on the use of electron-beam exposed monolayers of undecylenic acid in the etch rate enhancement of silicon dioxide films in HF vapor for the formation of nanoscale features in the oxide. Variations of the etching characteristics with electron beam parameters are examined and the results analyzed in terms of proposed models of the etching mechanism. Apparent variations in the relative concentrations of etch initiator with the thermal history of the samples prior to etching provides support for the dominant etch initiator within this system as the carboxylic acid moiety bound at the oxide surface. Other variations in the etching characteristics are discussed in terms of differences in localized concentrations of hydrocarbon crosslinks and the effect that this has upon the etch initiation. The process has been employed in the production of features in silicon dioxide surface masks with sizes down to 50 nm.

  11. Bilayer–metal assisted chemical etching of silicon microwire arrays for photovoltaic applications

    Directory of Open Access Journals (Sweden)

    R. W. Wu

    2016-02-01

    Full Text Available Silicon microwires with lateral dimension from 5 μm to 20 μm and depth as long as 20 μm are prepared by bilayer metal assisted chemical etching (MaCE. A bilayer metal configuration (Metal 1 / Metal 2 was applied to assist etching of Si where metal 1 acts as direct catalyst and metal 2 provides mechanical support. Different metal types were investigated to figure out the influence of metal catalyst on morphology of etched silicon. We find that silicon microwires with vertical side wall are produced when we use Ag/Au bilayer, while cone–like and porous microwires formed when Pt/Au is applied. The different micro-/nano-structures in as-etched silicon are demonstrated to be due to the discrepancy of work function of metal catalyst relative to Si. Further, we constructed a silicon microwire arrays solar cells in a radial p–n junction configurations in a screen printed aluminum paste p–doping process.

  12. Texture-Etched SnO2 Glasses Applied to Silicon Thin-Film Solar Cells

    Directory of Open Access Journals (Sweden)

    Bing-Rui Wu

    2014-01-01

    Full Text Available Transparent electrodes of tin dioxide (SnO2 on glasses were further wet-etched in the diluted HCl:Cr solution to obtain larger surface roughness and better light-scattering characteristic for thin-film solar cell applications. The process parameters in terms of HCl/Cr mixture ratio, etching temperature, and etching time have been investigated. After etching process, the surface roughness, transmission haze, and sheet resistance of SnO2 glasses were measured. It was found that the etching rate was increased with the additions in etchant concentration of Cr and etching temperature. The optimum texture-etching parameters were 0.15 wt.% Cr in 49% HCl, temperature of 90°C, and time of 30 sec. Moreover, silicon thin-film solar cells with the p-i-n structure were fabricated on the textured SnO2 glasses using hot-wire chemical vapor deposition. By optimizing the texture-etching process, the cell efficiency was increased from 4.04% to 4.39%, resulting from the increment of short-circuit current density from 14.14 to 15.58 mA/cm2. This improvement in cell performances can be ascribed to the light-scattering effect induced by surface texturization of SnO2.

  13. Comparison of different PADC materials and etching conditions for fast neutron dosimetry

    International Nuclear Information System (INIS)

    Assenmacher, F.; Boschung, M.; Hohmann, E.; Mayer, S.

    2016-01-01

    Etched-track polyallyl diglycol carbonate (PADC) dosemeters have been in use at the Paul Scherrer Institute since 1998 in neutron dosimetry for individual monitoring. In the last years, the availability of PADC materials from different manufacturers has grown, and different etching conditions were proposed, with the intention to improve the quality and overall performance of PADC in individual neutron monitoring. The goal of the present study was to compare the performance of different PADC materials and to investigate the influence of different etching conditions on sensitivity to fast neutrons and lower detection limit. The comparison covers six different PADC materials and eight different etching conditions. (authors)

  14. Influence of stain etching on low minority carrier lifetime areas of multicrystalline silicon for solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Montesdeoca-Santana, A. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38206 La Laguna (Spain); Fraunhofer Institute for Solar Energy Systems, Laboratory and Servicecenter Gelsenkirchen, Auf der Reihe 2, 45884 Gelsenkirchen (Germany); Gonzalez-Diaz, B. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38206 La Laguna (Spain); Departamento de Energia Fotovoltaica, Instituto Tecnologico y de Energias Renovables. Poligono Industrial de Granadilla s/n, 38600 San Isidro-Granadilla de Abona (Spain); Jimenez-Rodriguez, E. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38206 La Laguna (Spain); Ziegler, J. [Fraunhofer Institute for Solar Energy Systems, Laboratory- and Servicecenter Gelsenkirchen. Auf der Reihe 2, 45884 Gelsenkirchen (Germany); Velazquez, J.J. [Departamento de Fisica Fundamental y Experimental, Electronica y Sistemas, Universidad de La Laguna. Avda. Astrofisico Francisco Sanchez, 38206 La Laguna (Spain); Hohage, S.; Borchert, D. [Fraunhofer Institute for Solar Energy Systems, Laboratory and Servicecenter Gelsenkirchen. Auf der Reihe 2, 45884 Gelsenkirchen (Germany); Guerrero-Lemus, R., E-mail: rglemus@ull.es [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38206 La Laguna (Spain)

    2011-11-15

    Highlights: > An enhanced minority carrier lifetime at extended defects in multicrystalline silicon is observed with the use of HF/HNO{sub 3} stain etching to texture the surface. > FTIR analysis shows no influence of oxide passivation in this effect. > SEM images show a preferential etching at extended defects suggesting smoothing at defects as one of the causes for the reduced recombination activity. > LBIC images show a reduction in IQE at extended defects in HF/HNO{sub 3} textured multicrystalline solar cells. - Abstract: In this work the use of HF/HNO{sub 3} solutions for texturing silicon-based solar cell substrates by stain etching and the influence of texturing on minority carrier lifetimes are studied. Stain etching is currently used to decrease the reflectance and, subsequently improve the photogenerated current of the cells, but also produces nanostructures on the silicon surface. In the textured samples it has been observed that an improvement on the minority carrier lifetime with respect to the samples treated with a conventional saw damage etching process is produced on grain boundaries and defects, and the origin of this effect has been discussed.

  15. Influence of stain etching on low minority carrier lifetime areas of multicrystalline silicon for solar cells

    International Nuclear Information System (INIS)

    Montesdeoca-Santana, A.; Gonzalez-Diaz, B.; Jimenez-Rodriguez, E.; Ziegler, J.; Velazquez, J.J.; Hohage, S.; Borchert, D.; Guerrero-Lemus, R.

    2011-01-01

    Highlights: → An enhanced minority carrier lifetime at extended defects in multicrystalline silicon is observed with the use of HF/HNO 3 stain etching to texture the surface. → FTIR analysis shows no influence of oxide passivation in this effect. → SEM images show a preferential etching at extended defects suggesting smoothing at defects as one of the causes for the reduced recombination activity. → LBIC images show a reduction in IQE at extended defects in HF/HNO 3 textured multicrystalline solar cells. - Abstract: In this work the use of HF/HNO 3 solutions for texturing silicon-based solar cell substrates by stain etching and the influence of texturing on minority carrier lifetimes are studied. Stain etching is currently used to decrease the reflectance and, subsequently improve the photogenerated current of the cells, but also produces nanostructures on the silicon surface. In the textured samples it has been observed that an improvement on the minority carrier lifetime with respect to the samples treated with a conventional saw damage etching process is produced on grain boundaries and defects, and the origin of this effect has been discussed.

  16. Electrochemistry in anisotropic etching of silicon in alkaline solutions

    NARCIS (Netherlands)

    Nguyen, Q.D.

    2007-01-01

    Etching is the process of using an acidic or caustic chemical to cut into unprotected areas of a particular material. Initially used in the 15th century for decorating plate armor and sword blades, the metal surface (typically steel or copper) was first covered with a wax-like material. Part of the

  17. Effect of additive gases and injection methods on chemical dry etching of silicon nitride, silicon oxynitride, and silicon oxide layers in F2 remote plasmas

    International Nuclear Information System (INIS)

    Yun, Y. B.; Park, S. M.; Kim, D. J.; Lee, N.-E.; Kim, K. S.; Bae, G. H.

    2007-01-01

    The authors investigated the effects of various additive gases and different injection methods on the chemical dry etching of silicon nitride, silicon oxynitride, and silicon oxide layers in F 2 remote plasmas. N 2 and N 2 +O 2 gases in the F 2 /Ar/N 2 and F 2 /Ar/N 2 /O 2 remote plasmas effectively increased the etch rate of the layers. The addition of direct-injected NO gas increased the etch rates most significantly. NO radicals generated by the addition of N 2 and N 2 +O 2 or direct-injected NO molecules contributed to the effective removal of nitrogen and oxygen in the silicon nitride and oxide layers, by forming N 2 O and NO 2 by-products, respectively, and thereby enhancing SiF 4 formation. As a result of the effective removal of the oxygen, nitrogen, and silicon atoms in the layers, the chemical dry etch rates were enhanced significantly. The process regime for the etch rate enhancement of the layers was extended at elevated temperature

  18. Fabrication of single-crystal silicon nanotubes with sub-10 nm walls using cryogenic inductively coupled plasma reactive ion etching

    Science.gov (United States)

    Li, Zhiqin; Chen, Yiqin; Zhu, Xupeng; Zheng, Mengjie; Dong, Fengliang; Chen, Peipei; Xu, Lihua; Chu, Weiguo; Duan, Huigao

    2016-09-01

    Single-crystal silicon nanostructures have attracted much attention in recent years due in part to their unique optical properties. In this work, we demonstrate direct fabrication of single-crystal silicon nanotubes with sub-10 nm walls which show low reflectivity. The fabrication was based on a cryogenic inductively coupled plasma reactive ion etching process using high-resolution hydrogen silsesquioxane nanostructures as the hard mask. Two main etching parameters including substrate low-frequency power and SF6/O2 flow rate ratio were investigated to determine the etching mechanism in the process. With optimized etching parameters, high-aspect-ratio silicon nanotubes with smooth and vertical sub-10 nm walls were fabricated. Compared to commonly-used antireflection silicon nanopillars with the same feature size, the densely packed silicon nanotubes possessed a lower reflectivity, implying possible potential applications of silicon nanotubes in photovoltaics.

  19. Analysis of buried etch-stop layers in silicon by nitrogen-ion implantation

    International Nuclear Information System (INIS)

    Acero, M.C.; Esteve, J.; Montserrat, J.; Perez-Rodriguez, A.; Garrido, B.; Romano-Rodriguez, A.; Morante, J.R.

    1993-01-01

    The analysis of the etch-stop properties of layers obtained by substoichiometric nitrogen-ion implantation and annealing in silicon has been performed as a function of the implantation conditions. The analysis of the etching efficiency has been tested in TMAH-IPA systems. The results obtained show the need to implant at doses higher than 2 x 10 17 cm -2 to obtain etch-stop layers stable under high-temperature annealing. So, for implantation doses of 5 x 10 17 cm -2 , layers stand unetched for times longer than 2 h. The preliminary structural analysis of the samples suggests the presence of an amorphous silicon nitride layer for higher implantation doses. (author)

  20. Quantum confinement effect in cheese like silicon nano structure fabricated by metal induced etching

    Energy Technology Data Exchange (ETDEWEB)

    Saxena, Shailendra K., E-mail: phd1211512@iiti.ac.in; Sahu, Gayatri; Sagdeo, Pankaj R.; Kumar, Rajesh [Material Research Laboratory, Discipline of Physics & MSEG, Indian Institute of Technology Indore, Madhya Pradesh-452017 (India)

    2015-08-28

    Quantum confinement effect has been studied in cheese like silicon nano-structures (Ch-SiNS) fabricated by metal induced chemical etching using different etching times. Scanning electron microscopy is used for the morphological study of these Ch-SiNS. A visible photoluminescence (PL) emission is observed from the samples under UV excitation at room temperature due to quantum confinement effect. The average size of Silicon Nanostructures (SiNS) present in the samples has been estimated by bond polarizability model using Raman Spectroscopy from the red-shift observed from SiNSs as compared to its bulk counterpart. The sizes of SiNS present in the samples decreases as etching time increase from 45 to 75 mintunes.

  1. Isotropic etching of silicon in fluoride containing solutions as a tool for micromachining

    NARCIS (Netherlands)

    Tjerkstra, R.W.

    1999-01-01

    μTAS is hot in micromechanics today. All μTAS devices contain channels to connect the different components together. Channels can also be used as chromatography columns. Isotropic wet chemical etching of silicon can be a suitable process to construct (hemi)circular channels with very smooth

  2. Characterizing the effects of free carriers in fully etched, dielectric-clad silicon waveguides

    Science.gov (United States)

    Sharma, Rajat; Puckett, Matthew W.; Lin, Hung-Hsi; Vallini, Felipe; Fainman, Yeshaiahu

    2015-06-01

    We theoretically characterize the free-carrier plasma dispersion effect in fully etched silicon waveguides, with various dielectric material claddings, due to fixed interface charges and trap states at the silicon-dielectric interfaces. The values used for these charges are obtained from the measured capacitance-voltage characteristics of SiO2, SiNx, and Al2O3 thin films deposited on silicon substrates. The effect of the charges on the properties of silicon waveguides is then calculated using the semiconductor physics tool Silvaco in combination with the finite-difference time-domain method solver Lumerical. Our results show that, in addition to being a critical factor in the analysis of such active devices as capacitively driven silicon modulators, this effect should also be taken into account when considering the propagation losses of passive silicon waveguides.

  3. Etching nano-holes in silicon carbide using catalytic platinum nano-particles

    Science.gov (United States)

    Moyen, E.; Wulfhekel, W.; Lee, W.; Leycuras, A.; Nielsch, K.; Gösele, U.; Hanbücken, M.

    2006-09-01

    The catalytic reaction of platinum during a hydrogen etching process has been used to perform controlled vertical nanopatterning of silicon carbide substrates. A first set of experiments was performed with platinum powder randomly distributed on the SiC surface. Subsequent hydrogen etching in a hot wall reactor caused local atomic hydrogen production at the catalyst resulting in local SiC etching and hole formation. Secondly, a highly regular and monosized distribution of Pt was obtained by sputter deposition of Pt through an Au membrane serving as a contact mask. After the lift-off of the mask, the hydrogen etching revealed the onset of well-controlled vertical patterned holes on the SiC surface.

  4. Sensors for ultra-fast silicon detectors

    International Nuclear Information System (INIS)

    Sadrozinski, H.F.-W.; Baselga, M.; Ely, S.; Fadeyev, V.; Galloway, Z.; Ngo, J.; Parker, C.; Schumacher, D.; Seiden, A.; Zatserklyaniy, A.; Cartiglia, N.; Pellegrini, G.; Fernández-Martínez, P.; Greco, V.; Hidalgo, S.; Quirion, D.

    2014-01-01

    We report on electrical and charge collection tests of silicon sensors with internal gain as part of our development of ultra-fast silicon detectors. Using C–V and α TCT measurements, we investigate the non-uniform doping profile of so-called low-gain avalanche detectors (LGAD). These are n-on-p pad sensors with charge multiplication due to the presence of a thin, low-resistivity diffusion layer below the junction, obtained with a highly doped implant. We compare the bias dependence of the pulse shapes of traditional sensors and of LGAD sensors with different dopant density of the diffusion layer, and extract the internal gain

  5. Fabrication of ultra-high aspect ratio (>160:1) silicon nanostructures by using Au metal assisted chemical etching

    Science.gov (United States)

    Li, Hailiang; Ye, Tianchun; Shi, Lina; Xie, Changqing

    2017-12-01

    We present a facile and effective approach for fabricating high aspect ratio, dense and vertical silicon nanopillar arrays, using a combination of metal etching following electron-beam lithography and Au metal assisted chemical etching (MacEtch). Ti/Au nanostructures used as catalysts in MacEtch are formed by single layer resist-based electron-beam exposure followed by ion beam etching. The effects of MacEtch process parameters, including half period, etching time, the concentrations of H2O2 and HF, etching temperature and drying method are systematically investigated. Especially, we demonstrate an enhancement of etching quality by employing cold MacEtch process, and an enhancement in preventing the collapse of high aspect ratio nanostructures by employing low surface tension rinse liquid and natural evaporation in the drying stage. Using an optimized MacEtch process, vertical silicon nanopillar arrays with a period of 250 nm and aspect ratio up to 160:1 are realized. Our results should be instructive for exploring the achievable aspect ratio limit in silicon nanostructures and may find potential applications in photovoltaic devices, thermoelectric devices and x-ray diffractive optics.

  6. Micropore x-ray optics using anisotropic wet etching of (110) silicon wafers

    International Nuclear Information System (INIS)

    Ezoe, Yuichiro; Koshiishi, Masaki; Mita, Makoto; Mitsuda, Kazuhisa; Hoshino, Akio; Ishisaki, Yoshitaka; Yang Zhen; Takano, Takayuki; Maeda, Ryutaro

    2006-01-01

    To develop x-ray mirrors for micropore optics, smooth silicon (111)sidewalls obtained after anisotropic wet etching of a silicon (110) wafer were studied. A sample device with 19 μm wide (111) sidewalls was fabricated using a 220 μm thick silicon (110) wafer and potassium hydroxide solution. For what we believe to be the first time,x-ray reflection on the (111) sidewalls was detected in the angular response measurement. Compared to ray-tracing simulations, the surface roughness of the sidewalls was estimated to be 3-5 nm, which is consistent with the atomic force microscope and the surface profiler measurements

  7. Dry Etch Black Silicon with Low Surface Damage: Effect of Low Capacitively Coupled Plasma Power

    DEFF Research Database (Denmark)

    Iandolo, Beniamino; Plakhotnyuk, Maksym; Gaudig, Maria

    2017-01-01

    Black silicon fabricated by reactive ion etch (RIE) is promising for integration into silicon solar cells thanks to its excellent light trapping ability. However, intensive ion bombardment during the RIE induces surface damage, which results in enhanced surface recombination velocity. Here, we pr...... carrier lifetime thanks to reduced ion energy. Surface passivation using atomic layer deposition of Al2O3 improves the effective lifetime to 7.5 ms and 0.8 ms for black silicon n- and p-type wafers, respectively.......Black silicon fabricated by reactive ion etch (RIE) is promising for integration into silicon solar cells thanks to its excellent light trapping ability. However, intensive ion bombardment during the RIE induces surface damage, which results in enhanced surface recombination velocity. Here, we...... present a RIE optimization leading to reduced surface damage while retaining excellent light trapping and low reflectivity. In particular, we demonstrate that the reduction of the capacitively coupled power during reactive ion etching preserves a reflectance below 1% and improves the effective minority...

  8. Fabrication and Photovoltaic Characteristics of Coaxial Silicon Nanowire Solar Cells Prepared by Wet Chemical Etching

    Directory of Open Access Journals (Sweden)

    Chien-Wei Liu

    2012-01-01

    Full Text Available Nanostructured solar cells with coaxial p-n junction structures have strong potential to enhance the performances of the silicon-based solar cells. This study demonstrates a radial junction silicon nanowire (RJSNW solar cell that was fabricated simply and at low cost using wet chemical etching. Experimental results reveal that the reflectance of the silicon nanowires (SNWs declines as their length increases. The excellent light trapping was mainly associated with high aspect ratio of the SNW arrays. A conversion efficiency of ∼7.1% and an external quantum efficiency of ∼64.6% at 700 nm were demonstrated. Control of etching time and diffusion conditions holds great promise for the development of future RJSNW solar cells. Improving the electrode/RJSNW contact will promote the collection of carries in coaxial core-shell SNW array solar cells.

  9. Low-power, low-pressure reactive-ion etching process for silicon etching with vertical and smooth walls for mechanobiology application

    Science.gov (United States)

    Ashraf, Mohammed; Sundararajan, Sree V.; Grenci, Gianluca

    2017-07-01

    We report our findings in developing a low-power etching recipe using a newly acquired reactive-ion etching (RIE) tool (RIE-10NR, Samco, Japan), with the aim of achieving smooth and vertical sidewalls in micropatterned silicon substrate. We used a combination of CF4, SF6, and O2 gases, which at low power (30 W) and low pressure (2 Pa) allowed for vertical silicon etching (aspect ratio ˜2). We used photoresist and silicon oxide as the etching masks. As it is a continuous etching process, scalloping effects were not present, which is contrary to the process done with an inductively coupled plasma-based "Bosch" approach. We also show a successful use of these microstructures as master mold in soft-lithographic techniques for producing devices in elastomeric materials that have applications in mechanobiology. To the best of our knowledge, the recipe we present here has the lowest combination of power and pressure for etching silicon with vertical profile using a standard, parallel plates RIE tool.

  10. Development of a Silicon Microneedle with Three-Dimensional Sharp Tip by Electrochemical Etching

    Science.gov (United States)

    Izumi, Hayato; Okamoto, Tokusuke; Suzuki, Masato; Aoyagi, Seiji

    Aiming at the use in low-invasive medical treatments, this paper reports a fabrication technique of silicon microneedle of conical sharp point. The electrochemical etching technique is employed for sharpening the tip of a pillar, which is diced from a silicon wafer. A finely smooth tip surface is obtained due to electrochemical etching reactions, and is effective for easy insertion. The fabrication method is based on inexpensive wet etching, which does not require expensive fabrication facilities such as deep reactive ion etching (DRIE). A sharp needle was successfully fabricated, the tip angle of which was considerably small and was distributed within the range from 15 to 30 deg. An experiment of inserting the fabricated needle into an artificial skin of silicone rubber was carried out. As the results, the resistance force during insertion was much reduced compared to those of two-dimensional sharp needles. Imitating mosquito's motion, the effectiveness of applying vibration to the fabricated needle during insertion was also confirmed. After biocompatible Parylene coating, puncturing a human skin was demonstrated assuming a lancet usage for the diabetics, in which the bleeding was surely observed.

  11. The fabrication of patternable silicon nanotips using deep reactive ion etching

    International Nuclear Information System (INIS)

    Kang, Chang Kun; Jung, Phill Gu; Hwang, Sung Jin; Ko, Jong Soo; Lee, Sang Min; Jung, Im Deok

    2008-01-01

    This paper presents a novel fabrication method of patternable silicon nanotips. The proposed fabrication method involves four steps: lithography, the first deep reactive ion etching (DRIE), removal of the photoresist and the second DRIE. The fabricated silicon nanotips are well aligned along the edges of microstructures. The plane shape of the microstructure was determined by the patterned shape of the photoresist. It means that the silicon nanotips can be patterned by the patterned shape of the photoresist. The width of the nanotips, 1 µm below the top, was measured to be about 200 nm. The fabricated nanotips were applied to modify the surface of silicon from hydrophilic to superhydrophobic. The contact angle was drastically increased from 79.7° (bare silicon surface) to 158.3° (surface modified with nanotips). Therefore, the surface was modified from hydrophilic to superhydrophobic

  12. Optimization of HNA etching parameters to produce high aspect ratio solid silicon microneedles

    International Nuclear Information System (INIS)

    Hamzah, A A; Yeop Majlis, B; Yunas, J; Dee, C F; Abd Aziz, N; Bais, B

    2012-01-01

    High aspect ratio solid silicon microneedles with a concave conic shape were fabricated. Hydrofluoric acid–nitric acid–acetic acid (HNA) etching parameters were characterized and optimized to produce microneedles that have long and narrow bodies with smooth surfaces, suitable for transdermal drug delivery applications. The etching parameters were characterized by varying the HNA composition, the optical mask's window size, the etching temperature and bath agitation. An L9 orthogonal Taguchi experiment with three factors, each having three levels, was utilized to determine the optimal fabrication parameters. Isoetch contours for HNA composition with 0% and 10% acetic acid concentrations were presented and a high nitric acid region was identified to produce microneedles with smooth surfaces. It is observed that an increase in window size indiscriminately increases the etch rate in both the vertical and lateral directions, while an increase in etching temperature beyond 35 °C causes the etching to become rapid and uncontrollable. Bath agitation and sample placement could be manipulated to achieve a higher vertical etch rate compared to its lateral counterpart in order to construct high aspect ratio microneedles. The Taguchi experiment performed suggests that a HNA composition of 2:7:1 (HF:HNO 3 :CH 3 COOH), window size of 500 µm and agitation rate of 450 RPM are optimal. Solid silicon microneedles with an average height of 159.4 µm, an average base width of 110.9 µm, an aspect ratio of 1.44, and a tip angle and diameter of 19.2° and 0.38 µm respectively were successfully fabricated. (paper)

  13. Elements for hard X-ray optics produced by cryogenic plasma etching of silicon

    Science.gov (United States)

    Miakonkikh, Andrey V.; Rogozhin, Alexander E.; Rudenko, Konstantin V.; Lukichev, Vladimir F.; Yunkin, Vyacheslav A.; Snigirev, Anatoly A.

    2016-12-01

    A number of different hard X-ray optics elements such as refractive lenses, refractive bi-lenses and multilens interferometers, mirror interferometers can be made of Silicon. The optical performance of these elements depends on the quality of refracting and reflecting surfaces. Cryogenic deep anisotropic etching was proposed for fabrication of parabolic planar lenses and mirror interferometers. The investigation of sidewall roughness was done by AFM and by optical interferometry. Geometrical parameters of structures were measured by SEM. It was observed that roughness of inner sidewalls of etched structures does not exceed 3 nm/um (RMS) and deviation from vertical profile was within 30 nm along 20 um depth.

  14. Design of experiment characterization of microneedle fabrication processes based on dry silicon etching

    Science.gov (United States)

    Held, J.; Gaspar, J.; Ruther, P.; Hagner, M.; Cismak, A.; Heilmann, A.; Paul, O.

    2010-02-01

    This paper reports on the characterization of dry etching-based processes for the fabrication of silicon microneedles using a design of experiment (DoE) approach. The possibility of using such microneedles as protruding microelectrodes able to electroporate adherently growing cells and record intracellular potentials motivates the systematic analysis of the influence of etching parameters on the needle shape. Two processes are characterized: a fully isotropic etch process and a three-step etching approach. In the first case, the shape of the microneedles is defined by a single etch step. For the stepped method, the structures are realized using the following sequence: a first, isotropic step defines the tip; this is followed by anisotropic etching that increases the height of the needle; a final isotropic procedure thins the microneedle and sharpens its tip. From the various process parameters tested, it is concluded that the isotropic fabrication is influenced mostly by four process parameters, whereas six parameters dominantly govern the outcome of the stepped etching technique. The dependence of the needle shape on the etch mask diameter is also investigated. Microneedles with diameters down to the sub-micrometer range and heights below 10 µm are obtained. The experimental design is performed using the D-optimal method. The resulting geometry, i.e. heights, diameters and radii of curvature measured at different positions, is extracted from scanning electron micrographs of needle cross-sections obtained from cuts by focused ion beam. The process parameters are used as inputs and the geometry features of the microneedles as outputs for the analysis of the process.

  15. Design of experiment characterization of microneedle fabrication processes based on dry silicon etching

    International Nuclear Information System (INIS)

    Held, J; Gaspar, J; Ruther, P; Paul, O; Hagner, M; Cismak, A; Heilmann, A

    2010-01-01

    This paper reports on the characterization of dry etching-based processes for the fabrication of silicon microneedles using a design of experiment (DoE) approach. The possibility of using such microneedles as protruding microelectrodes able to electroporate adherently growing cells and record intracellular potentials motivates the systematic analysis of the influence of etching parameters on the needle shape. Two processes are characterized: a fully isotropic etch process and a three-step etching approach. In the first case, the shape of the microneedles is defined by a single etch step. For the stepped method, the structures are realized using the following sequence: a first, isotropic step defines the tip; this is followed by anisotropic etching that increases the height of the needle; a final isotropic procedure thins the microneedle and sharpens its tip. From the various process parameters tested, it is concluded that the isotropic fabrication is influenced mostly by four process parameters, whereas six parameters dominantly govern the outcome of the stepped etching technique. The dependence of the needle shape on the etch mask diameter is also investigated. Microneedles with diameters down to the sub-micrometer range and heights below 10 µm are obtained. The experimental design is performed using the D-optimal method. The resulting geometry, i.e. heights, diameters and radii of curvature measured at different positions, is extracted from scanning electron micrographs of needle cross-sections obtained from cuts by focused ion beam. The process parameters are used as inputs and the geometry features of the microneedles as outputs for the analysis of the process.

  16. Effect of Current Density on Optical Properties of Anisotropic Photoelectrochemical Etched Silicon (110)

    Science.gov (United States)

    Amirhoseiny, M.; Hassan, Z.; Ng, S. S.

    2012-08-01

    Photoelectrochemical etched Si layers were prepared on n-type (110) oriented silicon wafer. The photoluminescence (PL), Fourier transformed infrared (FTIR) absorption and Raman spectroscopies of etched Si (110) at two different current densities were studied. Both samples showed PL peak in the visible spectral range situated from 650 nm to 750 nm. The corresponding changes in Raman spectra at different current density are discussed. The blue shift in the PL and Raman peaks is consequent of the quantum confinement effect and defect states of surface Si nanocrystallites complexes and hydrogen atoms of the photoelectrochemical etched Si (110) samples. The attenuated total reflection (ATR) results show both hydrogen and oxygen related IR modes in the samples which can be used to explain the PL effect.

  17. Nickel silicide thin films as masking and structural layers for silicon bulk micro-machining by potassium hydroxide wet etching

    International Nuclear Information System (INIS)

    Bhaskaran, M; Sriram, S; Sim, L W

    2008-01-01

    This paper studies the feasibility of using titanium and nickel silicide thin films as mask materials for silicon bulk micro-machining. Thin films of nickel silicide were found to be more resistant to wet etching in potassium hydroxide. The use of nickel silicide as a structural material, by fabricating micro-beams of varying dimensions, is demonstrated. The micro-structures were realized using these thin films with wet etching using potassium hydroxide solution on (1 0 0) and (1 1 0) silicon substrates. These results show that nickel silicide is a suitable alternative to silicon nitride for silicon bulk micro-machining

  18. Macro and quasi-mesoporous silicon by self-assembling and metal assisted etching

    Energy Technology Data Exchange (ETDEWEB)

    Boarino, L.; Enrico, E.; De Leo, N.; Celegato, F.; Tiberto, P. [NanoFacility Piemonte, Electromagnetism Division, Istituto Nazionale di Ricerca Metrologica, Strada delle Cacce 91, 10135 Turin (Italy); Sparnacci, Katia; Laus, M. [Dipartimento di Scienze dell' Ambiente e della Vita, Universita del Piemonte Orientale Amedeo Avogadro, Viale Teresa Michel 11, Alessandria (Italy)

    2011-06-15

    The combination of two recent techniques developed in the last years demonstrates the possibility to obtain regular and semi-ordered macro and mesopores on any type of silicon substrates and with holes diameter ranging from 800 to 60 nm and less. Self-assembling of polystyrene nanospheres (PSNS) is obtained by floating technique, then the 2D crystal is lifted on a silicon substrate with a 30 nm silver thin film deposited by thermal evaporation or sputtering. The nanospheres are then reduced in diameter by reactive ion etching (RIE) in oxygen plasma, then the samples are exposed to Ar ions sputter-etching (SE) for thin film structuration. At this point of the process the polystyrene nanosphere mask is removed and a metal assisted etching (MAE) of few minutes is performed. Ordered and regular pores of diameters ranging from 500 to 60 nm have been obtained. Macropores (450 nm) obtained by self-assembly nanolithography and metal assisted etching. (Copyright copyright 2011 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  19. Silicon-based photonic crystals fabricated using proton beam writing combined with electrochemical etching method.

    Science.gov (United States)

    Dang, Zhiya; Breese, Mark Bh; Recio-Sánchez, Gonzalo; Azimi, Sara; Song, Jiao; Liang, Haidong; Banas, Agnieszka; Torres-Costa, Vicente; Martín-Palma, Raúl José

    2012-07-23

    A method for fabrication of three-dimensional (3D) silicon nanostructures based on selective formation of porous silicon using ion beam irradiation of bulk p-type silicon followed by electrochemical etching is shown. It opens a route towards the fabrication of two-dimensional (2D) and 3D silicon-based photonic crystals with high flexibility and industrial compatibility. In this work, we present the fabrication of 2D photonic lattice and photonic slab structures and propose a process for the fabrication of 3D woodpile photonic crystals based on this approach. Simulated results of photonic band structures for the fabricated 2D photonic crystals show the presence of TE or TM gap in mid-infrared range.

  20. Effect of Etching Parameter on Pore Size and Porosity of Electrochemically Formed Nanoporous Silicon

    Directory of Open Access Journals (Sweden)

    Pushpendra Kumar

    2007-01-01

    Full Text Available The most common fabrication technique of porous silicon (PS is electrochemical etching of a crystalline silicon wafer in a hydrofluoric (HF acid-based solution. The electrochemical process allows for precise control of the properties of PS such as thickness of the porous layer, porosity, and average pore diameter. The control of these properties of PS was shown to depend on the HF concentration in the used electrolyte, the applied current density, and the thickness of PS. The change in pore diameter, porosity, and specific surface area of PS was investigated by measuring nitrogen sorption isotherms.

  1. Improved surface quality of anisotropically etched silicon {111} planes for mm-scale optics

    International Nuclear Information System (INIS)

    Cotter, J P; Hinds, E A; Zeimpekis, I; Kraft, M

    2013-01-01

    We have studied the surface quality of millimetre-scale optical mirrors produced by etching CZ and FZ silicon wafers in potassium hydroxide to expose the {111} planes. We find that the FZ surfaces have four times lower noise power at spatial frequencies up to 500 mm −1 . We conclude that mirrors made using FZ wafers have higher optical quality. (technical note)

  2. Method of Forming Textured Silicon Substrate by Maskless Cryogenic Etching

    Science.gov (United States)

    Yee, Karl Y. (Inventor); Homyk, Andrew P. (Inventor)

    2014-01-01

    Disclosed herein is a textured substrate comprising a base comprising silicon, the base having a plurality of needle like structures depending away from the base, wherein at least one of the needle like structures has a depth of greater than or equal to about 50 micrometers determined perpendicular to the base, and wherein at least one of the needle like structures has a width of less than or equal to about 50 micrometers determined parallel to the base. An anode and a lithium ion battery comprising the textured substrate, and a method of producing the textured substrate are also disclosed.

  3. Fluorocarbon polymer formation, characterization, and reduction in polycrystalline-silicon etching with CF4-added plasma

    International Nuclear Information System (INIS)

    Xu Songlin; Sun Zhiwen; Chen Arthur; Qian Xueyu; Podlesnik, Dragan

    2001-01-01

    Addition of CF 4 into HBr-based plasma for polycrystalline-silicon gate etching reduces the deposition of an etch byproduct, silicon oxide, onto the chamber wall but tends to generate organic polymer. In this work, a detailed study has been carried out to analyze the mechanism of polymerization and to characterize the polymer composition and quantity. The study has shown that the polymer formation is due to the F-radical depletion by H atoms dissociated from HBr. The composition of the polymer changes significantly with CF 4 concentration in the gas feed, and the polymer deposition rate depends on CF 4 % and other process conditions such as source power, bias power, and pressure. Surface temperature also affects the polymer deposition rate. Adding O 2 into the plasma can clean the organic polymer, but the O 2 amount has to be well controlled in order to prevent the formation of silicon oxide. Based on a series of tests to evaluate polymer deposition and oxide cleaning with O 2 addition, an optimized process regime in terms of O 2 -to-CF 4 ratio has been identified to simultaneously suppress the polymer and oxide deposition so that the etch process becomes self-cleaning

  4. Environmental Emissions from Chemical Etching Synthesis of Silicon Nanotube for Lithium Ion Battery Applications

    Directory of Open Access Journals (Sweden)

    Lulu Ma

    2018-02-01

    Full Text Available Silicon nanotubes (SiNTs have been researched as a promising anode material to replace graphite in next-generation lithium ion batteries. Chemical etching synthesis of SiNTs is a simple, controllable and scalable process for SiNT fabrication, but the environmental emissions are of grave concern. In this paper, the process emissions from chemical etching synthesis of SiNTs as anode for lithium ion batteries is studied through experimental techniques, considering the categories of aqueous wastes, gaseous emissions, aqueous nano-particle emissions, and gaseous aerosol emissions. The synthesized SiNTs are measured at 10 μm length and 1–2.2 μm diameter, and can maintain a specific capacity of over 800 mAh/g after 100 cycles in battery testing. In aqueous waste, the chemical compositions of all elements participating in the chemical etching are experimentally determined, with AgNO3 and Co(NO32 identified as the major pollutants. The only gaseous emission generated from the chemical etching synthesis process is H2, with 0.0088 ± 0.0002 mol H2 generated to produce 1.0 mg SiNTs. The aqueous nanoparticle sizes are found to be between 250 nm and 1540 nm. A large number of aerosol nanoparticle emissions of up to 2.96 × 107 particles/cm3 are detected through in situ experimental measurement.

  5. Morphological evolution of silver nanoparticles and its effect on metal-induced chemical etching of silicon.

    Science.gov (United States)

    Baek, Seong-Ho; Kong, Bo Hyun; Cho, Hyung Koun; Kim, Jae Hyun

    2013-05-01

    In this report, we have demonstrated the morphological evolution of the silver nanoparticles (AgNPs) by controlling the growth conditions and its effect on morphology of silicon (Si) during metal-induced electroless etching (MICE). Self-organized AgNPs with peculiarly shape were synthesized by an electroless plating method in a conventional aqueous hydrofluoric acid (HF) and silver nitrate (AgNO3) solution. AgNP nuclei were densely created on Si wafer surface, and they had a strong tendency to merge and form continuous metal films with increasing AgNO3 concentrations. Also, we have demonstrated that the fabrication of aligned Si nanowire (SiNW) arrays in large area of p-Si (111) substrates by MICE in a mixture of HF and hydrogen peroxide (H2O2) solution. We have found that the morphology of the initial AgNPs and oxidant concentration (H2O2) greatly influence on the shape of the SiNW etching profile. The morphological results showed that AgNP shapes were closely related to the etching direction of SiNWs, that is, the spherical AgNPs preferred to move vertical to the Si substrate, whereas non-spherical AgNPs changed their movement to the [100] directions. In addition, as the etching activity was increased at higher H2O2 concentrations, AgNPs had a tendency to move from the original [111] direction to the energetically preferred [100] direction.

  6. Minimizing Isolate Catalyst Motion in Metal-Assisted Chemical Etching for Deep Trenching of Silicon Nanohole Array.

    Science.gov (United States)

    Kong, Lingyu; Zhao, Yunshan; Dasgupta, Binayak; Ren, Yi; Hippalgaonkar, Kedar; Li, Xiuling; Chim, Wai Kin; Chiam, Sing Yang

    2017-06-21

    The instability of isolate catalysts during metal-assisted chemical etching is a major hindrance to achieve high aspect ratio structures in the vertical and directional etching of silicon (Si). In this work, we discussed and showed how isolate catalyst motion can be influenced and controlled by the semiconductor doping type and the oxidant concentration ratio. We propose that the triggering event in deviating isolate catalyst motion is brought about by unequal etch rates across the isolate catalyst. This triggering event is indirectly affected by the oxidant concentration ratio through the etching rates. While the triggering events are stochastic, the doping concentration of silicon offers a good control in minimizing isolate catalyst motion. The doping concentration affects the porosity at the etching front, and this directly affects the van der Waals (vdWs) forces between the metal catalyst and Si during etching. A reduction in the vdWs forces resulted in a lower bending torque that can prevent the straying of the isolate catalyst from its directional etching, in the event of unequal etch rates. The key understandings in isolate catalyst motion derived from this work allowed us to demonstrate the fabrication of large area and uniformly ordered sub-500 nm nanoholes array with an unprecedented high aspect ratio of ∼12.

  7. Vacuum-ultraviolet blazed silicon grating anisotropically etched by native-oxide mask.

    Science.gov (United States)

    Sheng, Bin; Xu, Xiangdong; Liu, Ying; Hong, Yilin; Zhou, Hongjun; Huo, Tonglin; Fu, Shaojun

    2009-04-15

    We describe a simple and convenient method of controlling the profile of a blazed grating that consists of using a patterned native-oxide layer of off-cut silicon (111) wafers as the mask of anisotropic etching to maximize the smooth blaze facets of the desired blaze angle and to minimize the deficiencies of the groove apexes. With the blazed-grating profile well controlled by this technique, a 1200 g/mm blazed grating was fabricated that had a blaze angle of 5.0 degrees and smooth blaze facets of about 0.2 nm rms. It was measured to have blaze efficiency in the vacuum-ultraviolet wavelength region.

  8. Atmospheric-pressure plasma jet system for silicon etching without fluorocarbon gas feed

    Science.gov (United States)

    Ohtsu, Yasunori; Nagamatsu, Kenta

    2018-01-01

    We developed an atmospheric-pressure plasma jet (APPJ) system with a tungsten rod electrode coated with C2F4 particles of approximately 0.3 µm diameter for the surface treatment of a silicon wafer. The APPJ was generated by dielectric barrier discharge with a driving frequency of 22 kHz using a He gas flow. The characteristics of the APPJ were examined under various experimental conditions. The plasma jet length increased proportionally to the electric field. It was found that the treatment area of the silicon wafer was approximately 1 mm in diameter. By atomic force microscopy analysis, minute irregularities with a maximum length of about 600 nm and part of a ring-shaped trench were observed. A Si etching rate of approximately 400 nm/min was attained at a low power of 6 W and a He flow rate of 1 L/min without introducing molecular gas including F atoms.

  9. Chemical etching studies of a Brazilian polycarbonate to fast neutron detection

    Energy Technology Data Exchange (ETDEWEB)

    Souto, E.B.; Campos, L.L. [Instituto de Pesquisas Energeticas e Nucleares, IPEN- CNEN/SP Radiation Metrology Center (CMR) Av. Prof. Lineu Prestes, 2242 CEP: 05508-000 Sao Paulo - SP (Brazil)]. e-mail: ebsouto@ipen.br

    2006-07-01

    The Dosimetric Materials Laboratory (LMD) of the Radiation Metrology Center (CMR) is developing a personal dosimeter for fast neutrons using the technique of solid state nuclear track detectors (SSNTD). This technique is based on the recorded damage (tracks) in dielectric materials due to the impact of charged particles. The tracks are revealed and amplified for visualization in optic microscope through a technique known as chemical etching. The LMD is investigating a Brazilian commercial polycarbonate as a new passive fast neutron's detector in substitution to the traditional materials, as the cellulose nitrate LR-115 and the polycarbonates Makrofol and CR-39. The variation of the etching parameters (chemical solution, time and temperature) alters the response of the material; the best revelation conditions provide the best relationship among the amount of revealed tracks, their clearness and the time spent for this. The polycarbonate studied is a resin of same chemical monomer of Makrofol (C,6H,403). Samples of 3 x 1 cm{sup 2} of the polycarbonate were irradiated with 5 mSv of fast neutrons ({sup 241}Am-Be) and revealed with the chemical solution PEW-40 (15% KOH, 45% H{sub 2}O, 40% C{sub 2}H{sub 5}OH), commonly used for Makrofol. The studied etching parameters were time and temperature. Groups of four samples were revealed at temperatures of 50, 65, 75, 90 and 100 C with etching times varying from one to six hours. The used track's counting procedure was that referred in the literature. The best response to fast neutrons was obtained at 75 C; in spite of their similar answers, smaller temperatures join larger uncertainties in the track's counting and poorer clearness. At this temperature, the number of revealed tracks increases with the etching time approximately until a plateau at three hours. For etching times higher than four hours the polycarbonate presents overlap of tracks. If the temperature is adjusted to 75 C, the etching time should be in

  10. Sacrificial structures for deep reactive ion etching of high-aspect ratio kinoform silicon x-ray lenses

    DEFF Research Database (Denmark)

    Stöhr, Frederik; Michael-Lindhard, Jonas; Hübner, Jörg

    2015-01-01

    investigated how sacrificial structures in the form of guarding walls and pillars may be utilized to facilitate accurate control of the etch profile. Unlike other sacrificial structuring approaches, no silicon-on-insulator substrates or multiple lithography steps are required. In addition, the safe removal...... of the sacrificial structures was accomplished by thermal oxidation and subsequent selective wet etching. The effects of the dimensions and relative placement of sacrificial walls and pillars on the etching result were determined through systematic experiments. The authors applied this process for exact sidewall...

  11. Relation between the ion flux, gas phase composition, and wall conditions in chlorine plasma etching of silicon

    International Nuclear Information System (INIS)

    Ullal, Saurabh J.; Kim, Tae Won; Vahedi, Vahid; Aydil, Eray S.

    2003-01-01

    Transients in plasma composition and positive ion flux due to changing chamber wall conditions during Cl 2 plasma etching of Si were studied using multiple plasma and surface diagnostics. In presence of Si and O containing species in the gas phase a glassy silicon oxychloride film coats the chamber walls over a time scale determined by the concentrations of the Si and O containing deposition precursors. This time scale can be a few minutes as in the case of Si etching with Cl 2 plasma, where the concentration of silicon chloride etching products can be high, or hours as in the case of a Cl 2 plasma maintained in absence of Si wafer, where the Si and O can only come from very slow etching of a quartz window. In either case, SiCl x (1≤x≤4) and Cl concentrations in the gas phase and the total ion flux impinging on the wafer surface increase as the chamber walls are coated with this glassy film. The increase in SiCl x and Cl concentrations are primarily due to lower loss probability of these species by recombination on the chamber walls. The ion flux increases primarily due to higher SiCl x concentration in the discharge. During etching of Si, increases in Cl concentration and ion flux through the mechanism described above increases the etching and SiCl x production rates. This strong coupling among the discharge properties, the wall conditions, and etching rate lead to transients in plasma operation

  12. The role of Triton surfactant in anisotropic etching of {1 1 0} reflective planes on (1 0 0) silicon

    Science.gov (United States)

    Resnik, Drago; Vrtacnik, Danilo; Aljancic, Uros; Mozek, Matej; Amon, Slavko

    2005-06-01

    Etching characteristics and properties of {1 1 0} silicon crystal planes used as 45° optical mirrors for deflecting optical beams from/to optical fibers were investigated. Fiber aligning grooves and passive mirror-like planes were realized by wet micromachining of (1 0 0) silicon in KOH IPA and TMAH IPA systems. Implementation of Triton-x-100 surfactant as an additive to 25% TMAH in anisotropic etching of {1 1 0} silicon passive mirror planes is reported and discussed. It was found that Triton-x-100 contents in the range of 10 200 ppm to the 25% TMAH water etchant significantly increase the anisotropy mostly by decreasing the {1 1 0} etch rate and retaining the {1 0 0} etch rate. It is also shown that {1 1 0} surface roughness is substantially improved compared to two other etching systems. Furthermore, efficient convex corner underetching reduction is demonstrated. The results of optical characterization of passive mirrors with 632 nm incident light show reduced scattering of reflected optical beam due to improved microroughness for mirrors made by TMAH Triton. For the reflection of the optical beam with 1.33 µm and 1.54 µm wavelengths, sputtered layer of gold is used as reflective coating on silicon mirrors thus increasing the reflected optical beam intensity by an additional 8%.

  13. Fast neutron personnel dosimetry by CR-39 plastics a new electrochemical etching procedure

    International Nuclear Information System (INIS)

    Djeffal, S.

    1984-07-01

    In the first part of this work a brief description of solid state nuclear track detectors, the principles of track registration and the different reading techniques are given. In the experimental part of the present work we systematically analysed different etching procedures and set a new electrochemical etching method, which enables us to develop a new fast neutron dosimeter. This fast neutron dosimeter makes possible the measurement of low neutron doses in the energy range from 10 Kev to 20 Mev with a reasonably flat energy response. These new developments are very attractive in personnel neutron dosimetry where nuclear emulsions are still used despite their insensitivity to neutron energies down to 500 Kev (i.e. the energy range one often encounters around nuclear facilities)

  14. Structural and optical properties of thin films porous amorphous silicon carbide formed by Ag-assisted photochemical etching

    International Nuclear Information System (INIS)

    Boukezzata, A.; Keffous, A.; Cheriet, A.; Belkacem, Y.; Gabouze, N.; Manseri, A.; Nezzal, G.; Kechouane, M.; Bright, A.; Guerbous, L.; Menari, H.

    2010-01-01

    In this work, we present the formation of porous layers on hydrogenated amorphous SiC (a-SiC: H) by Ag-assisted photochemical etching using HF/K 2 S 2 O 8 solution under UV illumination at 254 nm wavelength. The amorphous films a-SiC: H were elaborated by d.c. magnetron sputtering using a hot pressed polycrystalline 6H-SiC target. Because of the high resistivity of the SiC layer, around 1.6 MΩ cm and in order to facilitate the chemical etching, a thin metallic film of high purity silver (Ag) has been deposited under vacuum onto the thin a-SiC: H layer. The etched surface was characterized by scanning electron microscopy, secondary ion mass spectroscopy, infrared spectroscopy and photoluminescence. The results show that the morphology of etched a-SiC: H surface evolves with etching time. For an etching time of 20 min the surface presents a hemispherical crater, indicating that the porous SiC layer is perforated. Photoluminescence characterization of etched a-SiC: H samples for 20 min shows a high and an intense blue PL, whereas it has been shown that the PL decreases for higher etching time. Finally, a dissolution mechanism of the silicon carbide in 1HF/1K 2 S 2 O 8 solution has been proposed.

  15. Dry Phosphorus silicate glass etching and surface conditioning and cleaning for multi-crystalline silicon solar cell processing

    International Nuclear Information System (INIS)

    Kagilik, Ahmed S.

    2014-01-01

    As an alternative to the wet chemical etching method, dry chemical etching processes for Phosphorus silicate glass [PSG} layer removal using Trifluormethane/Sulfur Hexafluoride (CHF 3 / SF 6 ) gas mixture in commercial silicon-nitride plasma enhanced chemical vapour deposition (SiN-PECVD) system is applied. The dependence of the solar cell performance on the etching temperature is investigated and optimized. It is found that the SiN-PECVD system temperature variation has a significant impact on the whole solar cell characteristics. A dry plasma cleaning treatment of the Si wafer surface after the PSG removal step is also investigated and developed. The cleaning step is used to remove the polymer film which is formed during the PSG etching using both oxygen and hydrogen gases. By applying an additional cleaning step, the polymer film deposited on the silicon wafer surface after PSG etching is eliminated. The effect of different plasma cleaning conditions on solar cell performance is investigated. After optimization of the plasma operating conditions, the performance of the solar cell is improved and the overall gain in efficiency of 0.6% absolute is yielded compared to a cell without any further cleaning step. On the other hand, the best solar cell characteristics can reach values close to that achieved by the conventional wet chemical etching processes demonstrating the effectiveness of the additional O 2 /H 2 post cleaning treatment.(author)

  16. Optimizing shape uniformity and increasing structure heights of deep reactive ion etched silicon x-ray lenses

    DEFF Research Database (Denmark)

    Stöhr, Frederik; Wright, Jonathan; Simons, Hugh

    2015-01-01

    Line-focusing compound silicon x-ray lenses with structure heights exceeding 300 μm were fabricated using deep reactive ion etching. To ensure profile uniformity over the full height, a new strategy was developed in which the perimeter of the structures was defined by trenches of constant width....... The remaining sacrificial material inside the lens cavities was removed by etching through the silicon wafer. Since the wafers become fragile after through-etching, they were then adhesively bonded to a carrier wafer. Individual chips were separated using laser micro machining and the 3D shape of fabricated...... analysis, where a slight bowing of the lens sidewalls and an insufficiently uniform apex region are identified as resolution-limiting factors. Despite these, the proposed fabrication route proved a viable approach for producing x-ray lenses with large structure heights and provides the means to improve...

  17. Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon Electronics

    KAUST Repository

    Ghoneim, Mohamed T.

    2017-02-01

    A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems.

  18. Micro-morphology of single crystalline silicon surfaces during anisotropic wet chemical etching in KOH: velocity source forests

    NARCIS (Netherlands)

    van Veenendaal, E.; Sato, K.; Shikida, M.; Shikida, M.; Nijdam, A.J.; van Suchtelen, J.

    2001-01-01

    For silicon etched in KOH the micro-morphology of any surface, no matter the crystallographic orientation, is defined by some sort of persistent corrugations. As a matter of principle, the occurrence of these corrugations is incompatible with the classical kinematic wave theory for the evolution of

  19. Effect of TMAH Etching Duration on the Formation of Silicon Nano wire Transistor Patterned by AFM Nano lithography

    International Nuclear Information System (INIS)

    Hutagalung, S.D.; Lew, K.C.

    2012-01-01

    Atomic force microscopy (AFM) lithography was applied to produce nano scale pattern for silicon nano wire transistor fabrication. This technique takes advantage of imaging facility of AFM and the ability of probe movement controlling over the sample surface to create nano patterns. A conductive AFM tip was used to grow the silicon oxide nano patterns on silicon on insulator (SOI) wafer. The applied tip-sample voltage and writing speed were well controlled in order to form pre-designed silicon oxide nano wire transistor structures. The effect of tetra methyl ammonium hydroxide (TMAH) etching duration on the oxide covered silicon nano wire transistor structure has been investigated. A completed silicon nano wire transistor was obtained by removing the oxide layer via hydrofluoric acid etching process. The fabricated silicon nano wire transistor consists of a silicon nano wire that acts as a channel with source and drain pads. A lateral gate pad with a nano wire head was fabricated very close to the channel in the formation of transistor structures. (author)

  20. Characterization of silicon isotropic etch by inductively coupled plasma etcher for microneedle array fabrication

    International Nuclear Information System (INIS)

    Ji, J; Tay, F E H; Miao Jianmin; Sun Jianbo

    2006-01-01

    This work investigates the isotropic etching properties in inductively coupled plasma (ICP) etcher for microneedle arrays fabrication. The effects of process variables including powers, gas and pressure on needle structure generation are characterized by factorial design of experiment (DOE). The experimental responses of vertical etching depth, lateral etching length, ratio of vertical etching depth to lateral etching length and photoresist etching rate are reported. The relevance of the etching variables is also presented. The obtained etching behaviours for microneedle structure generation will be applied to develop recipes to fabricate microneedles in designed dimensions

  1. Characterization of silicon isotropic etch by inductively coupled plasma etcher for microneedle array fabrication

    Energy Technology Data Exchange (ETDEWEB)

    Ji, J [Mechanical Engineering National University of Singapore, 119260, Singapore (Singapore); Tay, F E H [Mechanical Engineering National University of Singapore, 119260, Singapore (Singapore); Miao Jianmin [MicroMachines Center, School of Mechanical and Aerospace Engineering, Nanyang Technologica l University, 50 Nanyang Avenue, 639798 (Singapore); Sun Jianbo [MicroMachines Center, School of Mechanical and Aerospace Engineering, Nanyang Technologica l University, 50 Nanyang Avenue, 639798 (Singapore)

    2006-04-01

    This work investigates the isotropic etching properties in inductively coupled plasma (ICP) etcher for microneedle arrays fabrication. The effects of process variables including powers, gas and pressure on needle structure generation are characterized by factorial design of experiment (DOE). The experimental responses of vertical etching depth, lateral etching length, ratio of vertical etching depth to lateral etching length and photoresist etching rate are reported. The relevance of the etching variables is also presented. The obtained etching behaviours for microneedle structure generation will be applied to develop recipes to fabricate microneedles in designed dimensions.

  2. Evaporative CO2 cooling using microchannels etched in silicon for the future LHCb vertex detector

    CERN Document Server

    Nomerotski, A.; Collins, P.; Dumps, R.; Greening, E.; John, M.; Mapelli, A.; Leflat, A.; Li, Y.; Romagnoli, G.; Verlaat, B.

    2013-01-01

    The extreme radiation dose received by vertex detectors at the Large Hadron Collider dictates stringent requirements on their cooling systems. To be robust against radiation damage, sensors should be maintained below -20 degree C and at the same time, the considerable heat load generated in the readout chips and the sensors must be removed. Evaporative CO2 cooling using microchannels etched in a silicon plane in thermal contact with the readout chips is an attractive option. In this paper, we present the first results of microchannel prototypes with circulating, two-phase CO2 and compare them to simulations. We also discuss a practical design of upgraded VELO detector for the LHCb experiment employing this approach.

  3. Biological functionalization and patterning of porous silicon prepared by Pt-assisted chemical etching

    Science.gov (United States)

    Li, Hong-Fang; Han, Huan-Mei; Wu, Ya-Guang; Xiao, Shou-Jun

    2010-04-01

    Porous silicon fabricated via Pt-assisted chemical etching of p-type Si (1 0 0) in 1:1:1 EtOH/HF/H 2O 2 solution possesses a longer durability in air and in aqueous media than anodized one, which is advantageous for biomedical applications. Its surface SiH x ( x = 1 and 2) species can react with 10-undecylenic acid completely under microwave irradiation, and subsequent derivatizations of the end carboxylic acid result in affinity capture of proteins. We applied two approaches to produce protein microarrays: photolithography and spotting. The former provides a homogeneous microarray with a very low fluorescence background, while the latter presents an inhomogeneous microarray with a high noise background.

  4. Biological functionalization and patterning of porous silicon prepared by Pt-assisted chemical etching

    International Nuclear Information System (INIS)

    Li Hongfang; Han Huanmei; Wu Yaguang; Xiao Shoujun

    2010-01-01

    Porous silicon fabricated via Pt-assisted chemical etching of p-type Si (1 0 0) in 1:1:1 EtOH/HF/H 2 O 2 solution possesses a longer durability in air and in aqueous media than anodized one, which is advantageous for biomedical applications. Its surface SiHx (x = 1 and 2) species can react with 10-undecylenic acid completely under microwave irradiation, and subsequent derivatizations of the end carboxylic acid result in affinity capture of proteins. We applied two approaches to produce protein microarrays: photolithography and spotting. The former provides a homogeneous microarray with a very low fluorescence background, while the latter presents an inhomogeneous microarray with a high noise background.

  5. Size-dependent Fano Interaction in the Laser-etched Silicon Nanostructures

    Directory of Open Access Journals (Sweden)

    Kumar Rajesh

    2008-01-01

    Full Text Available AbstractPhoto-excitation and size-dependent Raman scattering studies on the silicon (Si nanostructures (NSs prepared by laser-induced etching are presented here. Asymmetric and red-shifted Raman line-shapes are observed due to photo-excited Fano interaction in the quantum confined nanoparticles. The Fano interaction is observed between photo-excited electronic transitions and discrete phonons in Si NSs. Photo-excited Fano studies on different Si NSs show that the Fano interaction is high for smaller size of Si NSs. Higher Fano interaction for smaller Si NSs is attributed to the enhanced interference between photo-excited electronic Raman scattering and phonon Raman scattering.

  6. Time multiplexed deep reactive ion etching of germanium and silicon-A comparison of mechanisms and application to x-ray optics.

    Science.gov (United States)

    Genova, Vincent J; Agyeman-Budu, David N; Woll, Arthur R

    2018-01-01

    Although the mechanisms of deep reactive ion etching (DRIE) of silicon have been reported extensively, very little by comparison has been discussed concerning DRIE of germanium. By directly comparing silicon and germanium etching in a time multiplexed DRIE process, the authors extract significant differences in etch mechanisms from a design of experiment and discuss how these differences are relevant to the design and fabrication of silicon and germanium collimating channel array x-ray optics. The differences are illuminated by characteristics such as reactive ion etching (RIE)-lag, aspect ratio dependent etching, and sidewall passivation. Specifically, the authors demonstrate the more severe nature of RIE-lag in germanium, especially at aspect ratios exceeding 13:1. In addition, the differences in the profile evolution between silicon and germanium are shown to be a result of differences in sidewall passivation. There is also a correlation between the different sidewall passivation and the inherent lack of scalloping in the case of germanium DRIE.

  7. Alignment method combining interference lithography with anisotropic wet etch technique for fabrication of high aspect ratio silicon gratings.

    Science.gov (United States)

    Zheng, Yanchang; Qiu, Keqiang; Chen, Huoyao; Chen, Yong; Liu, Zhengkun; Liu, Ying; Xu, Xiangdong; Hong, Yilin

    2014-09-22

    A method was developed for aligning interference fringes generated in interference lithography to the vertical {111} planes of oriented silicon wafers. The alignment error is 0.036°. This high precision method makes it possible to combine interference lithography with anisotropic wet etch technique for the fabrication of high aspect ratio silicon gratings with extremely smooth sidewalls over a large sample area. With this alignment method, 320 nm and 2 μm period silicon gratings have been successfully fabricated. The highest aspect ratio is up to 100. The sample area is about 50 mm × 60 mm. The roughness (root mean square) of the sidewall is about 0.267 nm.

  8. Evaluation of different polymers for fast neutron personnel dosimetry using electrochemical etching

    International Nuclear Information System (INIS)

    Gammage, R.B.; Cotter, S.J.

    1977-01-01

    There is considerable optimism for the enhancement by electrochemical etching of fast neutron-induced recoil tracks in polycarbonate for the purpose of personnel dosimetry. The threshold energy, however, is rather high. A desirable improvement would be to lower this energy below 1 MeV. With this objective in mind, we have commenced an investigation of cellulose acetate, triacetate, and acetobutyrate in addition to polycarbonate. These cellulose derivatives are chemically more reactive and physically weaker than polycarbonate. It might, therefore, be possible to initiate the electrochemical amplification at the sites of shorter recoil atom damage tracks than is possible with polycarbonate. Some characteristics important for electrochemically etching in aqueous electrolytes are listed. Chemical etching is combined with treeing, an electrical breakdown process that starts when the dielectric strength is exceeded. These mechanical and electrical properties pertain to the dry plastics. The absorption of water molecules and electrolyte ions will cause these values to be reduced. Results and conclusions of the study are presented

  9. Fabrication of porous silicon based tunable distributed Bragg reflectors by anodic etching of irradiated silicon

    International Nuclear Information System (INIS)

    Vendamani, V.S.; Dang, Z.Y.; Ramana, P.; Pathak, A.P.; Ravi Kanth Kumar, V.V.; Breese, M.B.H.; Nageswara Rao, S.V.S.

    2015-01-01

    Highlights: • Fabrication of tunable distributed Bragg reflectors (DBRs) by gamma/ion irradiation of Si and subsequent formation of porous silicon multilayers has been described. • The central wavelength and the width of the stop band are found to decrease with increase in irradiation fluence. • The Si samples irradiated with highest fluence of 2 × 10 13 ions/cm 2 (100 MeV Ag ions) and 60 kGy (gamma) showed a central reflection at λ = 476 nm and 544 nm respectively, in contrast to un-irradiated sample, where λ = 635 nm. • The observed changes in the central wavelengths are attributed to the density of defects generated by gamma and ion irradiation in c-Si. • This study is expected to provide useful information for fabricating tunable wave reflectors for optical communication and other device applications. - Abstract: We report a study on the fabrication of tunable distributed Bragg reflectors (DBRs) by gamma/ion irradiation of Si and subsequent formation of porous silicon multilayers. Porous Si multilayers with 50 bilayers were designed to achieve high intensity of reflection. The reflection spectra appear to have a broad continuous band between 400 and 800 nm with a distinct central wavelength corresponding to different wave reflectors. The central wavelength and the width of the stop band are found to decrease with increase in irradiation fluence. The Si samples irradiated with highest fluence of 2 × 10 13 ions/cm 2 (100 MeV Ag ions) and 60 kGy (gamma) showed a central reflection at λ = 476 nm and 544 nm respectively, in contrast to un-irradiated sample, where λ = 635 nm. The observed changes are attributed to the density of defects generated by gamma and ion irradiation in c-Si. These results suggest that the gamma irradiation is a convenient and alternative method to tune the central wavelength of reflection without creating high density of defects by high energy ion implantation. This study is expected to provide useful information for

  10. Silicon structuring by etching with liquid chlorine and fluorine precursors using femtosecond laser pulses

    International Nuclear Information System (INIS)

    Radu, C.; Simion, S.; Zamfirescu, M.; Ulmeanu, M.; Enculescu, M.; Radoiu, M.

    2011-01-01

    The aim of this study is to investigate the micrometer and submicrometer scale structuring of silicon by liquid chlorine and fluorine precursors with 200 fs laser pulses working at both fundamental (775 nm) and frequency doubled (387 nm) wavelengths. The silicon surface was irradiated at normal incidence by immersing the Si (111) substrates in a glass container filled with liquid chlorine (CCl 4 ) and fluorine (C 2 Cl 3 F 3 ) precursors. We report that silicon surfaces develop an array of spikes with single step irradiation processes at 775 nm and equally at 387 nm. When irradiating the Si surface with 400 pulses at 330 mJ/cm 2 laser fluence and a 775 nm wavelength, the average height of the formed Si spikes in the case of fluorine precursors is 4.2 μm, with a full width at half maximum of 890 nm. At the same irradiation wavelength chlorine precursors develop Si spikes 4 μm in height and with a full width at half maximum of 2.3 μm with irradiation of 700 pulses at 560 mJ/cm 2 laser fluence. Well ordered areas of submicrometer spikes with an average height of about 500 nm and a width of 300 nm have been created by irradiation at 387 nm by chlorine precursors, whereas the fluorine precursors fabricate spikes with an average height of 700 nm and a width of about 200 nm. Atomic force microscopy and scanning electron microscopy of the surface show that the formation of the micrometer and sub-micrometer spikes involves a combination of capillary waves on the molten silicon surface and laser-induced etching of silicon, at both 775 nm and 387 nm wavelength irradiation. The energy-dispersive x-ray measurements indicate the presence of chlorine and fluorine precursors on the structured surface. The fluorine precursors create a more ordered area of Si spikes at both micrometer and sub-micrometer scales. The potential use of patterned Si substrates with gradient topography as model scaffolds for the systematic exploration of the role of 3D micro/nano morphology on cell

  11. Ionizing Energy Depositions After Fast Neutron Interactions in Silicon

    CERN Document Server

    Bergmann, Benedikt; Caicedo, Ivan; Kierstead, James; Takai, Helio; Frojdh, Erik

    2016-01-01

    In this study we present the ionizing energy depositions in a 300 μm thick silicon layer after fast neutron impact. With the Time-of-Flight (ToF) technique, the ionizing energy deposition spectra of recoil silicons and secondary charged particles were assigned to (quasi-)monoenergetic neutron energies in the range from 180 keV to hundreds of MeV. We show and interpret representative measured energy spectra. By separating the ionizing energy losses of the recoil silicon from energy depositions by products of nuclear reactions, the competition of ionizing (IEL) and non-ionizing energy losses (NIEL) of a recoil silicon within the silicon lattice was investigated. The data give supplementary information to the results of a previous measurement and are compared with different theoretical predictions.

  12. The influence of H{sub 2}O{sub 2} concentration to the structure of silicon nanowire growth by metal-assisted chemical etching

    Energy Technology Data Exchange (ETDEWEB)

    Omar, Hafsa, E-mail: mrshafsaomar@gmail.com [NANO-SciTech Centre, Institute of Science, Universiti Teknologi MARA(UiTM), 40450 Shah Alam, Selangor (Malaysia); Jani, Abdul Mutalib Md., E-mail: abdmutalib@perlis.uitm.edu.my; Abdullah, Saifollah, E-mail: saifollah@salam.utm.edu.my [Faculty of Applied Sciences, Universiti Teknologi MARA(UiTM), 40450 Shah Alam, Selangor (Malaysia); Rusop, Mohamad, E-mail: nanouitm@gmail.com [NANO-SciTech Centre, Institute of Science, Universiti Teknologi MARA(UiTM), 40450 Shah Alam, Selangor (Malaysia); Faculty of Electrical Engineering, Universiti Teknologi MARA(UiTM), p40450 Shah Alam, Selangor (Malaysia)

    2016-07-06

    A simple and low cost method to produce well aligned silicon nanowires at large areas using Ag-assisted chemical etching at room temperature were presented. The structure of silicon nanowires growth by metal-assisted chemical etching was observed. Prior to the etching, the silicon nanowires were prepared by electroless metal deposited (EMD) in solution containing hydrofluoric acid and hydrogen peroxide in Teflon vessel. The silver particle was deposited on substrate by immersion in hydrofluoric acid and silver nitrate solution for sixty second. The silicon nanowires were growth in different hydrogen peroxide concentration which are 0.3M, 0.4M, 0.5M and 0.6M and 0.7M.The influence of hydrogen peroxide concentration to the formation of silicon nanowires was studied. The morphological properties of silicon nanowires were investigated using field emission scanning electron microscopy (FESEM) and Energy Dispersive X-Ray Spectroscopy (EDS).

  13. Characterization of Ag-porous silicon nanostructured layer formed by an electrochemical etching of p-type silicon surface for bio-application

    Science.gov (United States)

    Naddaf, M.; Al-Mariri, A.; Haj-Mhmoud, N.

    2017-06-01

    Nanostructured layers composed of silver-porous silicon (Ag-PS) have been formed by an electrochemical etching of p-type (1 1 1) silicon substrate in a AgNO3:HF:C2H5OH solution at different etching times (10 min-30 min). Scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDS) results reveal that the produced layers consist of Ag dendrites and a silicon-rich porous structure. The nanostructuring nature of the layer has been confirmed by spatial micro-Raman scattering and x-ray diffraction techniques. The Ag dendrites exhibit a surface-enhanced Raman scattering (SERS) spectrum, while the porous structure shows a typical PS Raman spectrum. Upon increasing the etching time, the average size of silicon nanocrystallite in the PS network decreases, while the average size of Ag nanocrystals is slightly affected. In addition, the immobilization of prokaryote Salmonella typhimurium DNA via physical adsorption onto the Ag-PS layer has been performed to demonstrate its efficiency as a platform for detection of biological molecules using SERS.

  14. Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field

    Directory of Open Access Journals (Sweden)

    Hladkovskyi V. V.

    2017-10-01

    Full Text Available The article presents the research results on the influence of the amount of oxygen in a mixture with sulfur hexafluoride on the rate and anisotropy of the silicon etching in the plasma-chemical reactor with the controlled magnetic field. The etching was performed under the pressure of (0,3-2,0·10-3 Torr in the working chamber and the energy of chemically active ions of 50-80 eV. It was possible to etch the silicon to the depth of 100 Вµm with anisotropy 10, using a thick (0.4-1 µm nickel mask. The obtained results make it evident, that maximums do not coincide for speed of etch and anisotropy. The maximum of etch rate is observed at oxygen maintained at 5%. While the maximum of anisotropy is observed at 10% oxygen. The authors discovered the influence of the magnetic field on the rate and anisotropy of etching. Etch rate of the silicon at the increase of the magnetic-field tension increases virtually twofold at other discharge parameters remaining unchanged. The anisotropy first increases, and then decreases sharply. Thus, the increase of the tension of magnetic field results in worsening of anisotropy. Thus, the process of deep plasma-chemical etching of silicon has been developed and optimized.

  15. Iridium-coated micropore x-ray optics using dry etching of a silicon wafer and atomic layer deposition.

    Science.gov (United States)

    Ogawa, Tomohiro; Ezoe, Yuichiro; Moriyama, Teppei; Mitsuishi, Ikuyuki; Kakiuchi, Takuya; Ohashi, Takaya; Mitsuda, Kazuhisa; Putkonen, Matti

    2013-08-20

    To enhance x-ray reflectivity of silicon micropore optics using dry etching of silicon (111) wafers, iridium coating is tested by use of atomic layer deposition. An iridium layer is successfully formed on sidewalls of tiny micropores with a pore width of 20 μm and depth of 300 μm. The film thickness is ∼20  nm. An enhanced x-ray reflectivity compared to that of silicon is confirmed at Ti Kα 4.51 keV, for what we believe to be the first time, with this type of optics. Some discrepancies from a theoretical reflectivity curve of iridium-coated silicon are noticed at small incident angles rms is consistent with atomic force microscope measurements of the sidewalls.

  16. High aspect ratio micro tool manufacturing for polymer replication using mu EDM of silicon, selective etching and electroforming

    DEFF Research Database (Denmark)

    Tosello, Guido; Bissacco, Giuliano; Tang, Peter Torben

    2008-01-01

    Mass fabrication of polymer micro components with high aspect ratio micro-structures requires high performance micro tools allowing the use of low cost replication processes such as micro injection moulding. In this regard an innovative process chain, based on a combination of micro electrical di...... discharge machining (mu EDM) of a silicon substrate, electroforming and selective etching was used for the manufacturing of a micro tool. The micro tool was employed for polymer replication by means of the injection moulding process....

  17. Growth, etching, and stability of sputtered ZnO:Al for thin-film silicon solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Owen, Jorj Ian

    2011-07-01

    Aluminum-doped zinc oxide (ZnO:Al) can fulfill many requirements in thin-film solar cells, acting as (1) a transparent contact through which the incident light is transmitted, (2) part of the back reflector, and (3) a source of light scattering. Magnetron sputtered ZnO:Al thin-films are highly transparent, conductive, and are typically texturized by post-deposition etching in a dilute hydrochloric acid (HCl) solution to achieve light scattering. The ZnO:Al thin-film electronic and optical properties, as well as the surface texture after etching, depend on the deposition conditions and the post-deposition treatments. Despite having been used in thin-film solar cells for more than a decade, many aspects regarding the growth, effects of heat treatments, environmental stability, and etching of sputtered ZnO:Al are not fully understood. This work endeavors to further the understanding of ZnO:Al for the purpose improving silicon thin-film solar cell efficiency and reducing ZnO:Al production costs. With regard to the growth of ZnO:Al, the influence of various deposition conditions on the resultant electrical and structural properties and their evolution with film thickness were studied. The surface electrical properties extracted from a multilayer model show that while carrier concentration of the surface layer saturates already at film thickness of 100 nm, the surface mobility continues to increases with film thickness, and it is concluded that electronic transport across grain boundaries limits mobility in ZnO:Al thin films. ZnO:Al deposited onto a previously etched ZnO:Al surface grows epitaxially, preserving both the original orientation and grain structure. Further, it is determined that a typical ZnO:Al used in thin-film silicon solar cells grows Zn-terminated on glass substrates. Concerning the affects of heat treatments and stability, it is demonstrated that a layer of amorphous silicon can protect ZnO:Al from degradation during annealing, and the mobility of Zn

  18. Visible luminescence in photo-electrochemically etched p-type porous silicon: Effect of illumination wavelength

    International Nuclear Information System (INIS)

    Naddaf, M.; Hamadeh, H.

    2009-01-01

    The effect of low power density of ∼ 5 μW/cm 2 monochromatic light of different wavelengths on the visible photoluminescence (PL) properties of photo-electrochemically formed p-type porous silicon (PS) has been investigated. Two-peak PL 'red' and 'green' is resolved in PS samples etched under blue-green wavelength illumination; 480, 533 and 580 nm. It is found that the weight of 'green' PL has maxima for the sample illuminated with 533 nm wavelength. Whereas, PL spectra of PS prepared under the influence of red illumination or in dark does not exhibit 'green' PL band, but shows considerable enhancement in the 'red' PL peak intensity. Fourier transform infrared (FTIR) spectroscopic analysis reveals the relationship between the structures of chemical bonding in PS and the observed PL behavior. In particular, the PL efficiency is highly affected by the alteration of the relative content of hydride, oxide and hydroxyl species. Moreover, relative content of hydroxyl group with respect to oxide bonding is seen to have strong relationship to the blue PL. Although, the estimated energy gap value of PS samples shows a considerable enlargement with respect to that of bulk c-Si, the FTIR, low temperature PL and Raman measurements and analysis have inconsistency with quantum confinement of PS.

  19. Visible luminescence in photo-electrochemically etched p-type porous silicon: Effect of illumination wavelength

    International Nuclear Information System (INIS)

    Naddaf, M.; Hamadeh, H.

    2010-01-01

    The effect of low power density of ∼5 μWcm - 2 monochromatic light of different wavelengths on the visible photoluminescence (PL) properties of photo-electrochemically formed p-type porous silicon (PS) has been investigated. Tow peak PL red and green is resolved in PS samples etched under blue-green wavelength illumination; 480,533 and 580 nm. It is found that the weight of green PL has maxima for the sample illuminated with 533 nm wavelength whereas, PL spectra of PS prepared under the influence of red illumination or in dark does not exhibit green PL band, but shows considerable enhancement in the red PL peak intensity. Fourier transform infrared (FTIR) spectroscopic analysis reveals the relationship between the structures of chemical bonding in PS and the observed PL behavior. In particular, the PL efficiency is highly affected by the alteration of the relative content of hydride, oxide and hydroxyl species. Moreover, relative content of hydroxyl group with respect to oxide bonding is seen to have strong relationship to the blue PL. Although, the estimated energy gap value of PS samples shows a considerable enlargement with respect to that of bulk c-Si, the FTIR, low temperature PL and Raman measurements and analysis have inconsistency with quantum confinement of PS. (author)

  20. Concept Demonstration of Dopant Selective Reactive Etching (DSRIE) in Silicon Carbide

    Science.gov (United States)

    Okojie, Robert S.

    2015-01-01

    Accurate quantification of combustor pressure dynamics for the primary purpose of experimental validation of computational fluid dynamics (CFD) codes requires the use of robust, reliable and sensitive pressure sensors that can resolve sub--pound-per-square-inch pressure levels in high temperature environments (i.e., combustor). The state of the art microfabricated piezoresistive silicon carbide (SiC) pressure sensors that we have developed are capable of operating reliably at 600 degrees Centigrade. This technology was used in support of the ARMD ISRP-ERA (NASA's Aeronautics Research Mission Directorate, Integrated System Research Project - Environmentally Responsible Aviation) program to quantify combustor thermoacoustic instabilities. The results showed that while the SiC pressure sensors survived the high temperature and measured instabilities, the diaphragm (force collector) was not thin enough to be sensitive in resolving sub-pound-per-square-inch pressures; 30 meters is the thinnest diaphragm achievable with conventional reactive ion etching (RIE) processes. Therefore, this precludes its use for sub-pound-per-square-inch pressure measurement with high fidelity. In order to effectively resolve sub-pound-per-square-inch pressures, a thinner more sensitive diaphragm (10 meters) is needed. To achieve this would require a new and innovative fabrication process technique.

  1. Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams

    Directory of Open Access Journals (Sweden)

    Xiaohui Du

    2016-01-01

    Full Text Available A novel structure of the resonant pressure sensor is presented in this paper, which tactfully employs intercoupling between dual pressure-sensing diaphragms and a laterally driven resonant strain gauge. After the resonant pressure sensor principle is introduced, the coupling mechanism of the diaphragms and resonator is analyzed and the frequency equation of the resonator based on the triangle geometry theory is developed for this new coupling structure. The finite element (FE simulation results match the theoretical analysis over the full scale of the device. This pressure sensor was first fabricated by dry/wet etching and thermal silicon bonding, followed by vacuum-packaging using anodic bonding technology. The test maximum error of the fabricated sensor is 0.0310%F.S. (full scale in the range of 30 to 190 kPa, its pressure sensitivity is negative and exceeding 8 Hz/kPa, and its Q-factor reaches 20,000 after wafer vacuum-packaging. A novel resonant pressure sensor with high accuracy is presented in this paper.

  2. Nanodiamond infiltration into porous silicon through etching of solid carbon produced at different graphitization temperatures

    Energy Technology Data Exchange (ETDEWEB)

    Miranda, C. R. B., E-mail: claudia_rbm@yahoo.com.br [Instituto Nacional de Pesquisas Espaciais-INPE, Centro de Ciencias do Sistema Terrestre-CCST, Centro de Ciencias do Sistema Terrestre-CCST (Brazil); Baldan, M. R.; Beloto, A. F.; Ferreira, N. G. [CTE/INPE, Centro de Tecnologias Espaciais (Brazil)

    2011-09-15

    Nanocrystalline diamond (NCD) was grown on the porous silicon (PS) substrate using Reticulated Vitreous Carbon (RVC) as an additional solid carbon source. RVC was produced at different heat treatment temperatures of 1300, 1500, and 2000 Degree-Sign C, resulting in samples with different turbostratic carbon organizations. The PS substrate was produced by an electrochemical method. NCD film was obtained by the chemical vapor infiltration/deposition process where a RVC piece was positioned just below the PS substrate. The PS and NCD samples were characterized by Field Emission Gun-Scanning Electron Microscopy (FEG-SEM). NCD films presented faceted nanograins with uniform surface texture covering all the pores resulting in an apparent micro honeycomb structure. Raman's spectra showed the D and G bands, as well as, the typical two shoulders at 1,150 and 1,490 cm{sup -1} attributed to NCD. X-ray diffraction analyses showed the predominant (111) diamond orientation as well as the (220) and (311) peaks. The structural organization and the heteroatom presence on the RVC surface, analyzed from X-ray photoelectron spectroscopy, showed their significant influence on the NCD growth process. The hydrogen etching released, from RVC surface, associated to carbon and/or oxygen/nitrogen amounts led to different contributions for NCD growth.

  3. Characterization of graphite etched with potassium hydroxide and its application in fast-rechargeable lithium ion batteries

    Science.gov (United States)

    Shim, Jae-Hyun; Lee, Sanghun

    2016-08-01

    Surface-modified graphite for application as an anode material in lithium ion batteries was obtained by etching with KOH under mild conditions without high-temperature annealing. The surface of the etched graphite is covered with many nano-sized pores that act as entrances for lithium ions during the charging process. As compared with pristine graphite and other references such as pitch-coated or etched graphite samples with annealing, our non-annealed etched graphite exhibits excellent electrochemical properties, particularly at fast charging rates of over 2.5 C. While avoidance of the trade-off between increase of irreversible capacity and good rate capability has previously been a main concern in highly porous carbonaceous materials, we show that the slightly larger surface area created by the etching does not induce a significant increase of irreversible capacity. This study shows that it is important to limit the size of pores to the nanometer scale for excellent battery performance, which is possible by etching under relatively mild conditions.

  4. Fundamentals and applications of on-chip interferometers based on deep-etched silicon-air multilayer reflectors

    Science.gov (United States)

    St-Gelais, Raphael

    Deep reactive ion etching (DRIE) of silicon can be used to fabricate vertical (i.e. in-plane) silicon-air multilayer mirrors. In comparison with out-of-plane reflectors fabricated by thin film deposition, in-plane multilayer assemblies can be monolithically integrated with a variety of useful structures such as passive optical fiber alignment grooves, microfluidic systems, waveguides, and microelectromechanical (MEMS) actuators. However, all previously reported devices suffered from high insertion losses (> 10 dB) which translated, in most cases, in weak light confinement abilities (e.g. low finesses in the case of Fabry-Perot cavities). The first objective of this work is therefore to investigate the sources of loss and the technological limitations that affect interferometers based on deep-etched multilayer reflectors. Theoretical models for the prediction of losses---due to Gaussian beam divergence, surface roughness at silicon-air material interfaces, imperfect verticality of the etch profiles, and misalignment between input and output coupling optical fibers---are provided. Of these four loss mechanisms, the first three are demonstrated to be generally significant. For the devices presented in the current thesis, however, verticality deviation of the etch profiles (etch angle error ~ 0.04°) is found to be negligible compared with the measured contributions of surface roughness (30 nm RMS) and Gaussian beam divergence. The fourth loss mechanism (fiber misalignment) is found to be essentially negligible in all cases. These theoretical models are demonstrated to correspond remarkably well with our experimental results, such that we are able to state clear boundaries on the possibilities and limitations of interferometers based on deep-etched silicon-air multilayer reflectors. Within these boundaries, three new devices---with potential applications in biomedical sensing, chemical sensing, and optical fiber telecommunications---are investigated. Firstly, a deep-etched

  5. Surface roughening and rippling during plasma etching of silicon: Numerical investigations and a comparison with experiments

    OpenAIRE

    Tsuda, Hirotaka; Nakazaki, Nobuya; Takao, Yoshinori; Eriguchi, Koji; Ono, Kouichi

    2014-01-01

    Atomic- or nanometer-scale surface roughening and rippling during Si etching in high-density Cl2 and Cl2/O2 plasmas have been investigated by developing a three-dimensional atomic-scale cellular model (ASCeM-3D), which is a 3D Monte Carlo-based simulation model for plasma-surface interactions and the feature profile evolution during plasma etching. The model took into account the behavior of Cl+ ions, Cl and O neutrals, and etch products and byproducts of SiClx and SiClxOy in microstructures ...

  6. Simple, Fast, and Cost-Effective Fabrication of Wafer-Scale Nanohole Arrays on Silicon for Antireflection

    Directory of Open Access Journals (Sweden)

    Di Di

    2014-01-01

    Full Text Available A simple, fast, and cost-effective method was developed in this paper for the high-throughput fabrication of nanohole arrays on silicon (Si, which is utilized for antireflection. Wafer-scale polystyrene (PS monolayer colloidal crystal was developed as templates by spin-coating method. Metallic shadow mask was prepared by lifting off the oxygen etched PS beads from the deposited chromium film. Nanohole arrays were fabricated by Si dry etching. A series of nanohole arrays were fabricated with the similar diameter but with different depth. It is found that the maximum depth of the Si-hole was determined by the diameter of the Cr-mask. The antireflection ability of these Si-hole arrays was investigated. The results show that the reflection decreases with the depth of the Si-hole. The deepest Si-hole arrays show the best antireflection ability (reflection 600 nm, which was about 28 percent of the nonpatterned silicon wafer’s reflection. The proposed method has the potential for high-throughput fabrication of patterned Si wafer, and the low reflectivity allows the application of these wafers in crystalline silicon solar cells.

  7. Fabrication of a Silicon Nanowire on a Bulk Substrate by Use of a Plasma Etching and Total Ionizing Dose Effects on a Gate-All-Around Field-Effect Transistor

    Science.gov (United States)

    Moon, Dong-Il; Han, Jin-Woo; Meyyappan, Meyya

    2016-01-01

    The gate all around transistor is investigated through experiment. The suspended silicon nanowire for the next generation is fabricated on bulk substrate by plasma etching method. The scallop pattern generated by Bosch process is utilized to form a floating silicon nanowire. By combining anisotropic and istropic silicon etch process, the shape of nanowire is accurately controlled. From the suspended nanowire, the gate all around transistor is demonstrated. As the silicon nanowire is fully surrounded by the gate, the device shows excellent electrostatic characteristics.

  8. Noise induced regularity of porous silicon nanostructures electrochemically etched in the presence of a sub-threshold periodic signal

    Science.gov (United States)

    Roy, Tanushree; Rumandla, Sravya; Agarwal, V.; Parmananda, P.

    2017-09-01

    In the present work, regularity of the pores generated during the electrochemical etching of silicon wafer is analyzed. The wafer-electrolyte (ethanolic hydrofluoric acid) composite is placed in an electrochemical cell operated galvanostatically at a fixed (set-point) anodic current. This set-point current is subsequently perturbed by a sub-threshold periodic current signal. Numerous experiments were performed for diverse experimental configurations. Some of the experimental parameters varied were hydrofluoric concentration, set-points, and the properties of the input periodic signal (i.e., duty cycle and amplitude). The regularity of the generated pore size distribution was quantified by calculating the spatial normalized variance (NV). For certain experimental configurations, as described later, the phenomena of Periodic Stochastic Resonance (PSR) could be provoked. In PSR, enhanced regularity of the Porous Silicon nanostructures for an optimal HF concentration is observed. Consequently, the spatial NV versus the HF concentration curve exhibits a unimodal profile.

  9. Modeling of silicon etching in CF sub 4 /O sub 2 and CF sub 4 /H sub 2 plasmas

    Energy Technology Data Exchange (ETDEWEB)

    Trachtenberg, I.; Edgar, T.F. (Dept. of Chemical Engineering, Univ. of Texas at Austin, Austin, TX (US)); Venkatesan, S.P. (Morgantown Energy Technology Center, Morgantown, WV (US))

    1990-07-01

    A one-dimensional radial flow reactor model that includes fairly detailed free radical gas-phase chemistry has been developed for the etching of silicon in CF{sub 4}/O{sub 2} and CF{sub 4}/H{sub 2} plasmas. Attention has been restricted to transport and reaction of neutral species. The model equations were solved by orthogonal collocation. The sensitivities of the model predictions to flow rate, inlet gas composition, electron density, silicon loading, and other factors have been examined. The major loss path for fluorine atoms is different in CF{sub 4}/O{sub 2} and CF{sub 4}/H{sub 2} systems, and this results in significant qualitative differences in the parametric sensitivities of the two systems.

  10. Effect of hydrofluoric acid concentration on the evolution of photoluminescence characteristics in porous silicon nanowires prepared by Ag-assisted electroless etching method

    KAUST Repository

    Najar, Adel

    2012-01-01

    We report on the structural and optical properties of porous silicon nanowires (PSiNWs) fabricated using silver (Ag) ions assisted electroless etching method. Silicon nanocrystallites with sizes <5 nm embedded in amorphous silica have been observed from PSiNW samples etched using the optimum hydrofluoric acid (HF) concentration. The strongest photoluminescence (PL) signal has been measured from samples etched with 4.8 M of HF, beyond which a significant decreasing in PL emission intensity has been observed. A qualitative model is proposed for the formation of PSiNWs in the presence of Ag catalyst. This model affirms our observations in PL enhancement for samples etched using HF <4.8 M and the eventual PL reduction for samples etched beyond 4.8 M of HF concentration. The enhancement in PL signals has been associated to the formation of PSiNWs and the quantum confinement effect in the Si nanocrystallites. Compared to PSiNWs without Si-O x, the HF treated samples exhibited significant blue PL peak shift of 100 nm. This effect has been correlated to the formation of defect states in the surface oxide. PSiNWs fabricated using the electroless etching method can find useful applications in optical sensors and as anti-reflection layer in silicon-based solar cells. © 2012 American Institute of Physics.

  11. Silicon nanowires with controlled sidewall profile and roughness fabricated by thin-film dewetting and metal-assisted chemical etching

    Science.gov (United States)

    Azeredo, B. P.; Sadhu, J.; Ma, J.; Jacobs, K.; Kim, J.; Lee, K.; Eraker, J. H.; Li, X.; Sinha, S.; Fang, N.; Ferreira, P.; Hsu, K.

    2013-06-01

    This paper presents a non-lithographic approach to generate wafer-scale single crystal silicon nanowires (SiNWs) with controlled sidewall profile and surface morphology. The approach begins with silver (Ag) thin-film thermal dewetting, gold (Au) deposition and lift-off to generate a large-scale Au mesh on Si substrates. This is followed by metal-assisted chemical etching (MacEtch), where the Au mesh serves as a catalyst to produce arrays of smooth Si nanowires with tunable taper up to 13°. The mean diameter of the thus fabricated SiNWs can be controlled to range from 62 to 300 nm with standard deviations as small as 13.6 nm, and the areal coverage of the wire arrays can be up to 46%. Control of the mean wire diameter is achieved by controlling the pore diameter of the metallic mesh which is, in turn, controlled by adjusting the initial thin-film thickness and deposition rate. To control the wire surface morphology, a post-fabrication roughening step is added to the approach. This step uses Au nanoparticles and slow-rate MacEtch to produce rms surface roughness up to 3.6 nm.

  12. Low-temperature plasma etching of high aspect-ratio densely packed 15 to sub-10 nm silicon features derived from PS-PDMS block copolymer patterns

    International Nuclear Information System (INIS)

    Liu, Zuwei; Sassolini, Simone; Olynick, Deirdre L; Gu, Xiaodan; Hwu, Justin

    2014-01-01

    The combination of block copolymer (BCP) lithography and plasma etching offers a gateway to densely packed sub-10 nm features for advanced nanotechnology. Despite the advances in BCP lithography, plasma pattern transfer remains a major challenge. We use controlled and low substrate temperatures during plasma etching of a chromium hard mask and then the underlying substrate as a route to high aspect ratio sub-10 nm silicon features derived from BCP lithography. Siloxane masks were fabricated using poly(styrene-b-siloxane) (PS-PDMS) BCP to create either line-type masks or, with the addition of low molecular weight PS-OH homopolymer, dot-type masks. Temperature control was essential for preventing mask migration and controlling the etched feature’s shape. Vertical silicon wire features (15 nm with feature-to-feature spacing of 26 nm) were etched with aspect ratios up to 17 : 1; higher aspect ratios were limited by the collapse of nanoscale silicon structures. Sub-10 nm fin structures were etched with aspect ratios greater than 10 : 1. Transmission electron microscopy images of the wires reveal a crystalline silicon core with an amorphous surface layer, just slightly thicker than a native oxide. (paper)

  13. Deep reactive ion etching of silicon moulds for the fabrication of diamond x-ray focusing lenses

    Science.gov (United States)

    Malik, A. M.; Fox, O. J. L.; Alianelli, L.; Korsunsky, A. M.; Stevens, R.; Loader, I. M.; Wilson, M. C.; Pape, I.; Sawhney, K. J. S.; May, P. W.

    2013-12-01

    Diamond is a highly desirable material for use in x-ray optics and instrumentation. However, due to its extreme hardness and resistance to chemical attack, diamond is difficult to form into a structure suitable for x-ray lenses. Refractive lenses are capable of delivering x-ray beams with nanoscale resolution. A moulding technique for the fabrication of diamond lenses is reported. High-quality silicon moulds were made using photolithography and deep reactive ion etching. The study of the etch process conducted to achieve silicon moulds with vertical sidewalls and minimal surface roughness is discussed. Issues experienced when attempting to deposit diamond into a high-aspect-ratio mould by chemical vapour deposition are highlighted. Two generations of lenses have been successfully fabricated using this transfer-moulding approach with significant improvement in the quality and performance of the optics observed in the second iteration. Testing of the diamond x-ray optics on the Diamond Light Source Ltd synchrotron B16 beamline has yielded a line focus of sub-micrometre width.

  14. Controlling the shape and gap width of silicon electrodes using local anodic oxidation and anisotropic TMAH wet etching

    International Nuclear Information System (INIS)

    Rouhi, Jalal; Mahmud, Shahrom; Naderi, Nima; Abdullah, Mat Johar; Hutagalung, Sabar Derita; Kakooei, Saeid

    2012-01-01

    A simple method for fabricating silicon electrodes with various shapes and gap widths was designed using the special properties of anisotropic tetramethylammonium hydroxide (TMAH) wet etching and local anodic oxidation (LAO). A statistical system was used for the optimization of the parameters of the LAO process to facilitate a better understanding and precise analysis of the process. Analyses of the interaction effects among the significant factors of LAO showed that the relative humidity and applied voltage were interdependent. They had the strongest interaction effect on the dimensions of the oxide mask. TMAH with a concentration of 25% was used as an etchant solution in (1 0 0) silicon with a rectangular oxide mask. The observed undercutting at convex corners, tip shape of emitters and gap widths of electrodes were exactly consistent with theoretical studies. Combination of the LAO method and anisotropic TMAH wet etching was successfully used to fabricate Si nano-gap electrodes. This fabrication method of sharp and round tip emitters was simple, controllable and faster than common techniques. These results indicate that the method can be a new approach for studying the electrical properties of nano-gap electrodes. (paper)

  15. A Monte Carlo study of etching in the presence of a mask junction

    NARCIS (Netherlands)

    van Veenendaal, E.; Cuppen, H.M.; van Enckevort, W.J.P.; van Suchtelen, J.; Nijdam, A.J.; Elwenspoek, Michael Curt; Vlieg, E.

    Anisotropic wet chemical etching of silicon in alkaline solutions is a key technology in the fabrication of sensors and actuators. In this technology etching through masks is used for fast and reproducible shaping of micromechanical structures. Experimentally it has been found that near the junction

  16. Atomic Layer Etching of Silicon to Solve ARDE-Selectivity-Profile-Uniformity Trade-Offs

    Science.gov (United States)

    Wang, Mingmei; Ranjan, Alok; Ventzek, Peter; Koshiishi, Akira

    2014-10-01

    With shrinking critical dimensions, dry etch faces more and more challenges. Minimizing each of aspect ratio dependent etching (ARDE), bowing, undercut, selectivity, and within die uniformly across a wafer are met by trading off one requirement against another. At the root of the problem is that roles radical flux, ion flux and ion energy play may be both good and bad. Increasing one parameter helps meeting one requirement but hinders meeting the other. Self-limiting processes like atomic layer etching (ALE) promise a way to escape the problem of balancing trade-offs. ALE was realized in the mid-1990s but the industrial implementation has been slow. In recent years interest in ALE has revived. We present how ARDE, bowing/selectivity trade-offs may be overcome by varying radical/ion ratio, byproduct re-deposition. We overcome many of the practical implementation issues associated with ALE by precise passivation process control. The Monte Carlo Feature Profile Model (MCFPM) is used to illustrate realistic scenarios built around an Ar/Cl2 chemistry driven etch of Si masked by SiO2. We demonstrate that ALE can achieve zero ARDE and infinite selectivity. Profile control depends on careful management of the ion energies and angles. For ALE to be realized in production environment, tight control of IAD is a necessary. Experimental results are compared with simulation results to provide context to the work.

  17. Evaluation of silicon-chemiluminescence monitoring as a novel method for atomic fluorine determination and end point detection in plasma etch systems

    NARCIS (Netherlands)

    Zijlstra, P.A.; Beenakker, C.I.M.

    1981-01-01

    Optical methods for the detection of atomic fluorine in plasma etch systems are discussed and an experimental comparison is made between detection by optical emission and by a novel method based on the chemiluminescence from solid silicon in the presence of atomic fluorine. Although both methods

  18. High-Performance Black Multicrystalline Silicon Solar Cells by a Highly Simplified Metal-Catalyzed Chemical Etching Method

    KAUST Repository

    Ying, Zhiqin

    2016-05-20

    A wet-chemical surface texturing technique, including a two-step metal-catalyzed chemical etching (MCCE) and an extra alkaline treatment, has been proven as an efficient way to fabricate high-efficiency black multicrystalline (mc) silicon solar cells, whereas it is limited by the production capacity and the cost cutting due to the complicated process. Here, we demonstrated that with careful control of the composition in etching solution, low-aspect-ratio bowl-like nanostructures with atomically smooth surfaces could be directly achieved by improved one-step MCCE and with no posttreatment, like alkali solution. The doublet surface texture of implementing this nanobowl structure upon the industrialized acidic-textured surface showed concurrent improvement in optical and electrical properties for realizing 18.23% efficiency mc-Si solar cells (156 mm × 156 mm), which is sufficiently higher than 17.7% of the solely acidic-textured cells in the same batch. The one-step MCCE method demonstrated in this study may provide a cost-effective way to manufacture high-performance mc-Si solar cells for the present photovoltaic industry. © 2016 IEEE.

  19. Nanowall formation by maskless wet-etching on a femtosecond laser irradiated silicon surface

    Science.gov (United States)

    Lee, Siwoo; Jo, Kukhyun; Keum, Hee-sung; Chae, Sangmin; Kim, Yonghyeon; Choi, Jiyeon; Lee, Hyun Hwi; Kim, Hyo Jung

    2018-04-01

    We found that micro-cells surrounded by nanowalls can be formed by a maskless wet-etching process on Si (100) surfaces possessing Laser Induced Periodic Surface Structure (LIPSS) by femtosecond laser irradiation. The LIPSS process could produce periodic one-dimensional micron scale ripples on a Si surface, which could be developed into micro-cells by a subsequent etching process. The solution etching conditions strongly affected both the micro-cell and nanowall shapes such as the height and the thickness of nanowalls. The tetramethylammonium hydroxide solution created thin nanowalls and the resulting micro-cells with a well-flattened bottom while the KOH solution formed thick walls and incomplete micro-cells. The bottoms of micro-cells surrounded by the nanowalls were considerably flat with a 3.10 nm surface roughness. A pentacene layer was deposited on the micro-cells of a Si surface to evaluate the film properties by grazing incidence wide angle x-ray scattering measurements. The pentacene film on the micro-cell Si surface showed a strong film phase, which was comparable to the film phase grown on the atomically flat Si surface.

  20. Low-loss silicon waveguides with sidewall roughness reduction using a SiO2 hard mask and fluorine-based dry etching

    Science.gov (United States)

    Lee, Dong Ho; Choo, Sung Joong; Jung, Uiseok; Lee, Kyung Woon; Kim, Kwang Woong; Park, Jung Ho

    2015-01-01

    High optical field confinement-possible silicon waveguides are used in various fields. The performance of a silicon waveguide depends on its sidewall roughness, which is responsible for scattering loss. The fabrication process for a silicon waveguide with a smooth sidewall for low loss was studied. The propagation loss of an optical silicon waveguide was reduced by using a SiO2 hard mask and reactive ion etching (RIE) with fluorine gases. The sidewall angle was controlled by Si etching with a SF6 and CF4 gas mixture. The thickness of the SiO2 hard mask affects the sidewall smoothing treatment. The roughness of the sidewall was reduced in the SiO2 etching process with a CF4 and O2 gas mixture as the thickness of the SiO2 hard mask was increased. The minimum propagation loss (0.89 dB cm-1) of the fabricated silicon waveguide was achieved by using the fabrication method introduced in this paper.

  1. Study of silicon photomultipliers fast amplifier and thermoregulation

    International Nuclear Information System (INIS)

    D'antone, I.; Fabbri, L.; Foschi, E.; Guandalini, C.; Laurenti, G.; Lax, I.; Levi, G.; Quadrani, L.; Sbarra, Ca.; Sbarra, Cr.; Villa, M.; Zoccoli, A.; Zuffa, M.

    2011-01-01

    The silicon photomultipliers (SiPM) are adopted in various physical applications, from medical physics to astrophysics, for their advantages in terms of cost and weight with respect to traditional photo detectors. Their low bias voltage supply (about 30 V), hardiness and resistance to magnetic field are ideal characteristics for space application. In the frame of INFN-Irst collaboration, some of them have been developed and produced at FBK (Trento-Italy), and have been characterized in the INFN laboratories of Bologna (DaSiPM2 collaboration). The SiPM can be used in conjunction with fibres and counters in high energy physics experiments. To exploit the SiPM time resolution, a fast amplifier has been studied. The SiPM gain depends critically on temperature and a thermal stabilization is also necessary. The use of a thermoelectric cooler module based on a Peltier cell has been investigated, and the results are shown.

  2. Study of silicon photomultipliers fast amplifier and thermoregulation

    Energy Technology Data Exchange (ETDEWEB)

    D' antone, I. [INFN of Bologna, Viale B.Pichat 4/2, 40127 Bologna (Italy); Fabbri, L.; Foschi, E. [Department of Physics and INFN, Viale B.Pichat 4/2, 40127 Bologna (Italy); Guandalini, C.; Laurenti, G.; Lax, I. [INFN of Bologna, Viale B.Pichat 4/2, 40127 Bologna (Italy); Levi, G.; Quadrani, L.; Sbarra, Ca. [Department of Physics and INFN, Viale B.Pichat 4/2, 40127 Bologna (Italy); Sbarra, Cr., E-mail: cristina.sbarra@bo.infn.i [Department of Physics and INFN, Viale B.Pichat 4/2, 40127 Bologna (Italy); Villa, M.; Zoccoli, A. [Department of Physics and INFN, Viale B.Pichat 4/2, 40127 Bologna (Italy); Zuffa, M. [INFN of Bologna, Viale B.Pichat 4/2, 40127 Bologna (Italy)

    2011-02-21

    The silicon photomultipliers (SiPM) are adopted in various physical applications, from medical physics to astrophysics, for their advantages in terms of cost and weight with respect to traditional photo detectors. Their low bias voltage supply (about 30 V), hardiness and resistance to magnetic field are ideal characteristics for space application. In the frame of INFN-Irst collaboration, some of them have been developed and produced at FBK (Trento-Italy), and have been characterized in the INFN laboratories of Bologna (DaSiPM2 collaboration). The SiPM can be used in conjunction with fibres and counters in high energy physics experiments. To exploit the SiPM time resolution, a fast amplifier has been studied. The SiPM gain depends critically on temperature and a thermal stabilization is also necessary. The use of a thermoelectric cooler module based on a Peltier cell has been investigated, and the results are shown.

  3. Silicon nitride and silicon etching by CH{sub 3}F/O{sub 2} and CH{sub 3}F/CO{sub 2} plasma beams

    Energy Technology Data Exchange (ETDEWEB)

    Kaler, Sanbir S.; Lou, Qiaowei; Donnelly, Vincent M., E-mail: vmdonnelly@uh.edu; Economou, Demetre J., E-mail: economou@uh.edu [Department of Chemical and Biomolecular Engineering, Plasma Processing Laboratory, University of Houston, Houston, Texas 77204 (United States)

    2016-07-15

    Silicon nitride (SiN, where Si:N ≠ 1:1) films low pressure-chemical vapor deposited on Si substrates, Si films on Ge on Si substrates, and p-Si samples were exposed to plasma beams emanating from CH{sub 3}F/O{sub 2} or CH{sub 3}F/CO{sub 2} inductively coupled plasmas. Conditions within the plasma beam source were maintained at power of 300 W (1.9 W/cm{sup 3}), pressure of 10 mTorr, and total gas flow rate of 10 sccm. X-ray photoelectron spectroscopy was used to determine the thicknesses of Si/Ge in addition to hydrofluorocarbon polymer films formed at low %O{sub 2} or %CO{sub 2} addition on p-Si and SiN. Polymer film thickness decreased sharply as a function of increasing %O{sub 2} or %CO{sub 2} addition and dropped to monolayer thickness above the transition point (∼48% O{sub 2} or ∼75% CO{sub 2}) at which the polymer etchants (O and F) number densities in the plasma increased abruptly. The C(1s) spectra for the polymer films deposited on p-Si substrates appeared similar to those on SiN. Spectroscopic ellipsometry was used to measure the thickness of SiN films etched using the CH{sub 3}F/O{sub 2} and CH{sub 3}F/CO{sub 2} plasma beams. SiN etching rates peaked near 50% O{sub 2} addition and 73% CO{sub 2} addition. Faster etching rates were measured in CH{sub 3}F/CO{sub 2} than CH{sub 3}F/O{sub 2} plasmas above 70% O{sub 2} or CO{sub 2} addition. The etching of Si stopped after a loss of ∼3 nm, regardless of beam exposure time and %O{sub 2} or %CO{sub 2} addition, apparently due to plasma assisted oxidation of Si. An additional GeO{sub x}F{sub y} peak was observed at 32.5 eV in the Ge(3d) region, suggesting deep penetration of F into Si, under the conditions investigated.

  4. Plasma surface interactions in nanoscale processing: Preservation of low-k integrity and high-k gate-stack etching with silicon selectivity

    Science.gov (United States)

    Shoeb, Juline

    Plasma-surface interactions are very important in the fabrication of the nm-sized features of integrated circuits. Plasma processes are employed to produce high-resolution patterns in many of the thin layers of silicon integrated circuits and to remove masking layers while maintaining high selectivity. Integrated plasma processes consisting of sequential steps such as etch, clean and surface modification, are used in semiconductor industries. The surface in contact with the process plasma is exposed to the fluxes of neutrals, ions, molecules, electrons and photons. Modeling of surface reaction mechanisms requires the determination of the characterizations of fluxes (e.g. composition, magnitude, energy and angle) and development of the reaction mechanisms of the processes such as adsorption, reflection, bond breaking and etch product evolution, while reproducing the experimental results. When modeling the reaction mechanism for an entirely new material, the experimental data is often fragmentary. Therefore, fundamental principles such as bond energies and volatility of the etch products must be considered to develop the mechanism. In this thesis, results from a computational investigation of porous low-k SiCOH etching in fluorocarbon plasmas, damage during cleaning of CFx polymer etch residue in Ar/O2 and He/H2 plasmas, NH3 plasma pore sealing and low-k degradation due to water uptake, will be discussed. The plasma etching of HfO2 gate-stacks is also computationally investigated with an emphasis on the selectivity between HfO2 and Si.

  5. Broadband antireflection silicon carbide surface by self-assembled nanopatterned reactive-ion etching

    DEFF Research Database (Denmark)

    Ou, Yiyu; Aijaz, Imran; Jokubavicius, Valdas

    2013-01-01

    of 390x02013;784 nm is dramatically suppressed from 21.0x00025; to 1.9x00025; after introducing the pseudoperiodic nanostructures. A luminescence enhancement of 226x00025; was achieved at an emission angle of 20x000B0; on the fluorescent silicon carbide. Meanwhile, the angle-resolved photoluminescence...... study presents a considerable omnidirectional luminescence enhancement....

  6. An energy and direction independent fast neutron dosemeter based on electrochemically etched CR-39 nuclear track detectors

    International Nuclear Information System (INIS)

    James, K.; Matiullah; Durrani, S.A.

    1987-01-01

    A computer-based model is presented, which simulates the dose equivalent response of electrochemically etched CR-39 to fast neutrons of various energies and angles of incidence. Most previous calculations of the response of CR-39 have neglected the production of recoiling oxygen and carbon nuclei as well as α particles in the CR-39. We calculate that these 'heavy recoils' and α particles are the major source of electrochemically etchable tracks in bare CR-39 at neutron energies above approx. 2 MeV under typical etching conditions. Our calculations have been extended to predict the response of CR-39 used in conjunction with various combinations of polymeric front radiators and we have determined the radiator stack configuration with produces the most energy independent response. Again, the heavy recoils and α particles cannot be neglected and, for energies above approx. 2 MeV, these produce typically about 20% of the total response of our optimum stack. This type of fast neutron dosemeter is, however, strongly direction dependent. We have integrated the response over all appropriate angles to predict the dose equivalent response for two representative neutron fields, and we suggest a method for minimising the angular dependence. (author)

  7. Crystallographic orientation study of silicon steels using X-ray diffraction, electrons diffraction and the Etch Pit method

    International Nuclear Information System (INIS)

    Santos, Hamilta de Oliveira

    1999-01-01

    The aim of the present study is the microstructural and crystallographic orientation of Fe-3%Si steel. The silicon steel shows good electrical properties and it is used in the nuclear and electrical power fields. The studied steel was supplied by Cia. Acos Especiais Itabira S/A - ACESITA. The material was received in the hot compressed condition, in one or two passes. The hot compressing temperatures used were 900, 1000 and 1100 deg C with soaking times ranging from 32 to 470 s. The material preferential crystallographic orientation was evaluated in every grain of the samples. The characterization techniques used were: scanning electron microscopy (SEM) using the etch pit method; X ray diffraction using the Laue back-reflection method; orientation imaging microscopy (OIM). Microstructural characterization in terms of grain size measurement and mean number of grains in the sample were also undertaken. The Laue method was found an easy technique to access crystallographic orientation of this work polycrystalline samples 2.5 mm average grain size. This was due to the inability to focus the X-rays on a single grain of the material. The scanning electron microscopy showed microcavities left by the etch pit method, which allowed the observation of the crystallographic orientation of each grain from the samples. No conclusive grain crystallographic orientation was possible to obtain by the OIM technique due to the non-existing rolling direction. A more extensive work with the OIM technique must be undertaken on the Fe-3%Si with oriented grains and non oriented grains. (author)

  8. Fast determination of impurities in metallurgical grade silicon for photovoltaics by instrumental neutron activation analysis

    International Nuclear Information System (INIS)

    Hampel, J.; Boldt, F.M.; Gerstenberg, H.; Hampel, G.; Kratz, J.V.; Reber, S.; Wiehl, N.

    2011-01-01

    Standard wafer solar cells are made of near-semiconductor quality silicon. This high quality material makes up a significant part of the total costs of a solar module. Therefore, new concepts with less expensive so called solar grade silicon directly based on physiochemically upgraded metallurgical grade silicon are investigated. Metallurgical grade silicon contains large amounts of impurities, mainly transition metals like Fe, Cr, Mn, and Co, which degrade the minority carrier lifetime and thus the solar cell efficiency. A major reduction of the transition metal content occurs during the unidirectional crystallization due to the low segregation coefficient between the solid and liquid phase. A further reduction of the impurity level has to be done by gettering procedures applied to the silicon wafers. The efficiency of such cleaning procedures of metallurgical grade silicon is studied by instrumental neutron activation analysis (INAA). Small sized silicon wafers of approximately 200 mg with and without gettering step were analyzed. To accelerate the detection of transition metals in a crystallized silicon ingot, experiments of scanning whole vertical silicon columns with a diameter of approximately 1 cm by gamma spectroscopy were carried out. It was demonstrated that impurity profiles can be obtained in a comparably short time. Relatively constant transition metal ratios were found throughout an entire silicon ingot. This led to the conclusion that the determination of several metal profiles might be possible by the detection of only one 'leading element'. As the determination of Mn in silicon can be done quite fast compared to elements like Fe, Cr, and Co, it could be used as a rough marker for the overall metal concentration level. Thus, a fast way to determine impurities in photovoltaic silicon material is demonstrated. - Highlights: → We demonstrate a fast way to determine impurities in photovoltaic silicon by NAA. → We make first experiments of locally

  9. Glass frit bonding with controlled width and height using a two-step wet silicon etching procedure

    Science.gov (United States)

    Yifang, Liu; Daner, Chen; Liwei, Lin; Gaofeng, Zheng; Jianyi, Zheng; Lingyun, Wang; Daoheng, Sun

    2016-03-01

    A simple and versatile two-step silicon wet etching technique for the control of the width and height of the glass frit bonding layer has been developed to improve bonding strength and reliability in wafer-level microelectromechanical systems (MEMS) packaging processes. The height of the glass frit bonding layer is set by the design of a vertical reference wall which regulates the distance between the silicon wafer and the encapsulation capping substrate. On the other hand, the width of the bonding layer is constrained between two micro grooves which are used to accommodate the spillages of extra glass frit during the bonding process. An optimized thermal bonding process, including the formation of glass liquid, removal of gas bubbles under vacuum and the filling of voids under normal atmospheric condition has been developed to suppress the formation of the bubbles/voids. The stencil printing and pre-sintering processes for the glass frit have been characterized before the thermal bonding process under different magnitudes of bonding pressure. The bonding gap thickness is found to be equal to the height of the reference wall of 10 μm in the prototype design. The bubbles/voids are found to be suppressed effectively and the bonding strength increases from 10.2 to 19.1 MPa as compared with a conventional thermal annealing process in air. Experimentally, prototype samples are measured to have passed the high hermetic sealing leakage tests of 5  ×  10-8 atm cc s-1.

  10. Plasma etching on large-area mono-, multi- and quasi-mono crystalline silicon

    DEFF Research Database (Denmark)

    Davidsen, Rasmus Schmidt; Schmidt, Michael Stenbæk; Boisen, Anja

    2013-01-01

    for their 16.8% efficient black Si cell using a metal-assisted, chemical etching method on FZ mono-crystalline Si substrates. Yoo et al. [4] use RIE similar to this work on large-area, multi-crystalline Si cells and achieve a 16.1% efficiency despite a relatively high reflectance of 13.3%. Despite several...... using maskless RIE in a O2 and SF6 plasma, and the surface topology was optimized for solar cell applications by varying gas flows, pressure, power and process time. The starting substrates were 156x156 mm p-type, CZ mono-, multi- and quasi-mono crystalline Si wafers, respectively, with a thickness...... of 200 μm. Reflectance measurements of the RIE-textured mono-, multi and quasi-mono Si surfaces were performed using a broadband lightsource (Mikropack DH-2000), an integrating sphere (Mikropack ISP-30-6-R), and a spectrometer (Ocean Optics QE65000, 280-1000 nm). The reference solar spectral irradiance...

  11. Silicon nanowire formed via shallow anisotropic etching Si-ash-trimming for specific DNA and electrochemical detection

    International Nuclear Information System (INIS)

    Tijjani, Adam; Hashim, U.; Dhahi, Th S.

    2015-01-01

    A functionalized silicon nanowire field-effect transistor (SiNW FET) was fabricated to detect single molecules in the pM range to detect disease at the early stage with a sensitive, robust, and inexpensive method with the ability to provide specific and reliable data. The device was designed and fabricated by indented ash trimming via shallow anisotropic etching. The approach is a simple and low-cost technique that is compatible with the current commercial semiconductor standard CMOS process without an expensive deep reactive ion etcher. Specific electric changes were observed for DNA sensing when the nanowire surface was modified with a complementary captured DNA probe and target DNA through an organic linker (–OCH2CH3) using organofunctional alkoxysilanes (3-aminopropyl) triethoxysilane (APTES). With this surface modification, a single specific target molecule can be detected. The simplicity of the sensing domain makes it feasible to miniaturize it for the development of a cancer detection kit, facilitating its use in both clinical and non-clinical environments to allow non-expert interpretation. With its novel electric response and potential for mass commercial fabrication, this biosensor can be developed to become a portable/point of care biosensor for both field and diagnostic applications. (paper)

  12. Silicon nanowires for ultra-fast and ultrabroadband optical signal processing

    DEFF Research Database (Denmark)

    Ji, Hua; Hu, Hao; Pu, Minhao

    2015-01-01

    In this paper, we present recent research on silicon nanowires for ultra-fast and ultra-broadband optical signal processing at DTU Fotonik. The advantages and limitations of using silicon nanowires for optical signal processing are revealed through experimental demonstrations of various optical s...

  13. Maskless and resist-free rapid prototyping of three-dimensional structures through electron beam induced deposition (EBID) of carbon in combination with metal-assisted chemical etching (MaCE) of silicon.

    Science.gov (United States)

    Rykaczewski, Konrad; Hildreth, Owen J; Kulkarni, Dhaval; Henry, Matthew R; Kim, Song-Kil; Wong, Ching Ping; Tsukruk, Vladimir V; Fedorov, Andrei G

    2010-04-01

    In this work, we introduce a maskless, resist-free rapid prototyping method to fabricate three-dimensional structures using electron beam induced deposition (EBID) of amorphous carbon (aC) from a residual hydrocarbon precursor in combination with metal-assisted chemical etching (MaCE) of silicon. We demonstrate that EBID-made patterned aC coating, with thickness of even a few nanometers, acts as a negative "mask" for the etching process and is sufficient for localized termination of the MaCE of silicon. Optimal aC deposition settings and gold film thickness for fabrication of high-aspect-ratio nanoscale 3D silicon structures are determined. The speed necessary for optimal aC feature deposition is found to be comparable to the writing speed of standard Electron Beam Lithography and the MaCE etching rate is found to be comparable to standard deep reactive ion etching (DRIE) rate.

  14. Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment

    International Nuclear Information System (INIS)

    Jansen, H V; De Boer, M J; Unnikrishnan, S; Louwerse, M C; Elwenspoek, M C

    2009-01-01

    An intensive study has been performed to understand and tune deep reactive ion etch (DRIE) processes for optimum results with respect to the silicon etch rate, etch profile and mask etch selectivity (in order of priority) using state-of-the-art dual power source DRIE equipment. The research compares pulsed-mode DRIE processes (e.g. Bosch technique) and mixed-mode DRIE processes (e.g. cryostat technique). In both techniques, an inhibitor is added to fluorine-based plasma to achieve directional etching, which is formed out of an oxide-forming (O 2 ) or a fluorocarbon (FC) gas (C 4 F 8 or CHF 3 ). The inhibitor can be introduced together with the etch gas, which is named a mixed-mode DRIE process, or the inhibitor can be added in a time-multiplexed manner, which will be termed a pulsed-mode DRIE process. Next, the most convenient mode of operation found in this study is highlighted including some remarks to ensure proper etching (i.e. step synchronization in pulsed-mode operation and heat control of the wafer). First of all, for the fabrication of directional profiles, pulsed-mode DRIE is far easier to handle, is more robust with respect to the pattern layout and has the potential of achieving much higher mask etch selectivity, whereas in a mixed-mode the etch rate is higher and sidewall scalloping is prohibited. It is found that both pulsed-mode CHF 3 and C 4 F 8 are perfectly suited to perform high speed directional etching, although they have the drawback of leaving the FC residue at the sidewalls of etched structures. They show an identical result when the flow of CHF 3 is roughly 30 times the flow of C 4 F 8 , and the amount of gas needed for a comparable result decreases rapidly while lowering the temperature from room down to cryogenic (and increasing the etch rate). Moreover, lowering the temperature lowers the mask erosion rate substantially (and so the mask selectivity improves). The pulsed-mode O 2 is FC-free but shows only tolerable anisotropic results at

  15. Ultra-high efficiency, fast graphene micro-heater on silicon

    DEFF Research Database (Denmark)

    Yan, Siqi; Zhu, Xiaolong; Frandsen, Lars Hagedorn

    2017-01-01

    We demonstrate an ultra-high efficiency and fast graphene microheater on silicon photonic crystal waveguide. By taking advantage of slow-light effect, a tuning efficiency of 1.07 nm/mW and power consumption per free spectral range of 3.99 mW. A fast rise and decay times (10% to 90%) of only 750 ns...

  16. Ultra-Fast Optical Signal Processing in Nonlinear Silicon Waveguides

    DEFF Research Database (Denmark)

    Oxenløwe, Leif Katsuo; Galili, Michael; Pu, Minhao

    2011-01-01

    We describe recent demonstrations of exploiting highly nonlinear silicon nanowires for processing Tbit/s optical data signals. We perform demultiplexing and optical waveform sampling of 1.28 Tbit/s and wavelength conversion of 640 Gbit/s data signals.......We describe recent demonstrations of exploiting highly nonlinear silicon nanowires for processing Tbit/s optical data signals. We perform demultiplexing and optical waveform sampling of 1.28 Tbit/s and wavelength conversion of 640 Gbit/s data signals....

  17. Current measurement method for characterization of fast switching power semiconductors with Silicon Steel Current Transformer

    DEFF Research Database (Denmark)

    Li, Helong; Beczkowski, Szymon; Munk-Nielsen, Stig

    2015-01-01

    , it compensates the mechanical size limitations of the Pearson current monitor. Finally, experimental studied are carried out with both discrete Silicon Carbide (SiC) MOSFET and high current (1000A) Silicon (Si) IGBT power modules. The experimental results validate the effectiveness of the proposed method.......This paper proposes a novel current measurement method with Silicon Steel Current Transformer (SSCT) for the characterization of fast switching power semiconductors. First, the existing current sensors for characterization of fast switching power semiconductors are experimentally evaluated...... regarding three essential qualities: high bandwidth, suitable physical size, and galvanic isolation. Then, the proposed current measurement method with SSCT is mathematically analyzed, which proves that the proposed method has the capability of measuring fast switching current. Simultaneously...

  18. 4D tracking with ultra-fast silicon detectors

    Science.gov (United States)

    F-W Sadrozinski, Hartmut; Seiden, Abraham; Cartiglia, Nicolò

    2018-02-01

    The evolution of particle detectors has always pushed the technological limit in order to provide enabling technologies to researchers in all fields of science. One archetypal example is the evolution of silicon detectors, from a system with a few channels 30 years ago, to the tens of millions of independent pixels currently used to track charged particles in all major particle physics experiments. Nowadays, silicon detectors are ubiquitous not only in research laboratories but in almost every high-tech apparatus, from portable phones to hospitals. In this contribution, we present a new direction in the evolution of silicon detectors for charge particle tracking, namely the inclusion of very accurate timing information. This enhancement of the present silicon detector paradigm is enabled by the inclusion of controlled low gain in the detector response, therefore increasing the detector output signal sufficiently to make timing measurement possible. After providing a short overview of the advantage of this new technology, we present the necessary conditions that need to be met for both sensor and readout electronics in order to achieve 4D tracking. In the last section, we present the experimental results, demonstrating the validity of our research path.

  19. Increased Speed: 3D Silicon Sensors; Fast Current Amplifiers

    CERN Document Server

    Parker, S; Hasi, J; Da Via, C; Despeisse, M; Anelli, G; Kenney, C; Jarron, P

    2011-01-01

    The authors describe techniques to make fast, sub-nanosecond time resolution solid-state detector systems using sensors with 3D electrodes, current amplifiers, constant-fraction comparators or fast wave-form recorders, and some of the next steps to reach still faster results.

  20. The impact of etched trenches geometry and dielectric material on the electrical behaviour of silicon-on-insulator self-switching diodes

    Energy Technology Data Exchange (ETDEWEB)

    Farhi, G; Charlebois, S A [Departement de genie electrique et genie informatique, et Institut interdisciplinaire d' innovation technologique (3IT), Universite de Sherbrooke, 2500, Boulevard de l' Universite, J1K 2R1, Sherbrooke, QC (Canada); Morris, D [Departement de physique et Institut interdisciplinaire d' innovation technologique (3IT), Universite de Sherbrooke, 2500, Boulevard de l' Universite, J1K 2R1, Sherbrooke, QC (Canada); Raskin, J-P, E-mail: ghania.farhi@usherbrooke.ca [Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universite catholique de Louvain, Place du Levant, 3, B-1348 Louvain-la-Neuve (Belgium)

    2011-10-28

    Hole electrical transport in a p-doped nanochannel defined between two L-shape etched trenches made on a silicon-on-insulator substrate is investigated using a TCAD-Medici simulator. We study the impact of the etched trenches' geometry and dielectric filling materials on the current-voltage characteristics of the device. Carrier accumulation on frontiers defined by the trenches causes a modulation of the hole density inside the conduction channel as the bias voltage varies and this gives rise to a diode-like characteristic. For a 1.2 {mu}m-long channel, plots of the electric field distribution show that a nonlinear transport regime is reached at a moderate reverse and forward bias of {+-} 2 V. Plots of the carrier velocity along the conduction channel show that holes remain hot for a few hundreds of nm outside the nanometre-wide channel, at a bias of {+-} 10 V. Filling the etched trenches with a high-{kappa} dielectric material gives rise to a lower threshold voltage, V{sub th}. A similar decrease of V{sub th} is also achieved by reducing the longitudinal and/or the transverse trench width. Our simulation results provide useful design guidelines for future integrated self-switching-diode-based circuits.

  1. GigaTracker, a Thin and Fast Silicon Pixels Tracker

    CERN Document Server

    Velghe, Bob; Bonacini, Sandro; Ceccucci, Augusto; Kaplon, Jan; Kluge, Alexander; Mapelli, Alessandro; Morel, Michel; Noël, Jérôme; Noy, Matthew; Perktold, Lukas; Petagna, Paolo; Poltorak, Karolina; Riedler, Petra; Romagnoli, Giulia; Chiozzi, Stefano; Cotta Ramusino, Angelo; Fiorini, Massimiliano; Gianoli, Alberto; Petrucci, Ferruccio; Wahl, Heinrich; Arcidiacono, Roberta; Jarron, Pierre; Marchetto, Flavio; Gil, Eduardo Cortina; Nuessle, Georg; Szilasi, Nicolas

    2014-01-01

    GigaTracker, the NA62’s upstream spectrometer, plays a key role in the kinematically constrained background suppression for the study of the K + ! p + n ̄ n decay. It is made of three independent stations, each of which is a six by three cm 2 hybrid silicon pixels detector. To meet the NA62 physics goals, GigaTracker has to address challenging requirements. The hit time resolution must be better than 200 ps while keeping the total thickness of the sensor to less than 0.5 mm silicon equivalent. The 200 μm thick sensor is divided into 18000 300 μm 300 μm pixels bump-bounded to ten independent read-out chips. The chips use an end-of-column architecture and rely on time-over- threshold discriminators. A station can handle a crossing rate of 750 MHz. Microchannel cooling technology will be used to cool the assembly. It allows us to keep the sensor close to 0 C with 130 μm of silicon in the beam area. The sensor and read-out chip performance were validated using a 45 pixel demonstrator with a laser test setu...

  2. Metal-assisted etch combined with regularizing etch

    Energy Technology Data Exchange (ETDEWEB)

    Yim, Joanne; Miller, Jeff; Jura, Michael; Black, Marcie R.; Forziati, Joanne; Murphy, Brian; Magliozzi, Lauren

    2018-03-06

    In an aspect of the disclosure, a process for forming nanostructuring on a silicon-containing substrate is provided. The process comprises (a) performing metal-assisted chemical etching on the substrate, (b) performing a clean, including partial or total removal of the metal used to assist the chemical etch, and (c) performing an isotropic or substantially isotropic chemical etch subsequently to the metal-assisted chemical etch of step (a). In an alternative aspect of the disclosure, the process comprises (a) performing metal-assisted chemical etching on the substrate, (b) cleaning the substrate, including removal of some or all of the assisting metal, and (c) performing a chemical etch which results in regularized openings in the silicon substrate.

  3. Sub-parts per million NO2 chemi-transistor sensors based on composite porous silicon/gold nanostructures prepared by metal-assisted etching.

    Science.gov (United States)

    Sainato, Michela; Strambini, Lucanos Marsilio; Rella, Simona; Mazzotta, Elisabetta; Barillaro, Giuseppe

    2015-04-08

    Surface doping of nano/mesostructured materials with metal nanoparticles to promote and optimize chemi-transistor sensing performance represents the most advanced research trend in the field of solid-state chemical sensing. In spite of the promising results emerging from metal-doping of a number of nanostructured semiconductors, its applicability to silicon-based chemi-transistor sensors has been hindered so far by the difficulties in integrating the composite metal-silicon nanostructures using the complementary metal-oxide-semiconductor (CMOS) technology. Here we propose a facile and effective top-down method for the high-yield fabrication of chemi-transistor sensors making use of composite porous silicon/gold nanostructures (cSiAuNs) acting as sensing gate. In particular, we investigate the integration of cSiAuNs synthesized by metal-assisted etching (MAE), using gold nanoparticles (NPs) as catalyst, in solid-state junction-field-effect transistors (JFETs), aimed at the detection of NO2 down to 100 parts per billion (ppb). The chemi-transistor sensors, namely cSiAuJFETs, are CMOS compatible, operate at room temperature, and are reliable, sensitive, and fully recoverable for the detection of NO2 at concentrations between 100 and 500 ppb, up to 48 h of continuous operation.

  4. Evolution mechanism of mesoporous silicon nanopillars grown by metal-assisted chemical etching and nanosphere lithography: correlation of Raman spectra and red photoluminescence

    Science.gov (United States)

    Karadan, Prajith; John, Siju; Anappara, Aji A.; Narayana, Chandrabhas; Barshilia, Harish C.

    2016-07-01

    We have fabricated highly ordered, vertically aligned, high aspect ratio silicon nanopillars (SiNPLs) of diameter ~80 nm by combining metal-assisted chemical etching and nanosphere lithography. The evolution of surface morphology of porous silicon nanopillars has been explained, and the presence of mesoporous structures was detected on the top of silicon nanopillars using field emission scanning electron microscopy. The mesoporosity of the SiNPLs is confirmed by Brunauer-Emmett-Teller measurements. The peak shift and the splitting of optical phonon modes into LO and TO modes in the micro-Raman spectra of mesoporous SiNPLs manifest the presence of 2-3 nm porous Si nanocrystallites ( P-SiNCs) on the top of SiNPLs and the size of crystallites was calculated using bond polarizability model for spherical phonon confinement. The origin of red luminescence is explained using quantum confinement (QC) and QC luminescent center models for the P-SiNCs, which is correlated with the micro-Raman spectra. Finally, we confirmed the origin of the red luminescence is from the P-SiNCs formed on surface of SiNPLs, highly desired for LED devices by suitably tailoring the substrate.

  5. Evaluation of the soft x-ray reflectivity of micropore optics using anisotropic wet etching of silicon wafers

    Energy Technology Data Exchange (ETDEWEB)

    Mitsuishi, Ikuyuki; Ezoe, Yuichiro; Koshiishi, Masaki; Mita, Makoto; Maeda, Yoshitomo; Yamasaki, Noriko Y.; Mitsuda, Kazuhisa; Shirata, Takayuki; Hayashi, Takayuki; Takano, Takayuki; Maeda, Ryutaro

    2010-02-20

    The x-ray reflectivity of an ultralightweight and low-cost x-ray optic using anisotropic wet etching of Si (110) wafers is evaluated at two energies, C K{alpha}0.28 keV and Al K{alpha}1.49 keV. The obtained reflectivities at both energies are not represented by a simple planar mirror model considering surface roughness. Hence, an geometrical occultation effect due to step structures upon the etched mirror surface is taken into account. Then, the reflectivities are represented by the theoretical model. The estimated surface roughness at C K{alpha} ({approx}6 nm rms) is significantly larger than {approx}1 nm at Al K{alpha}. This can be explained by different coherent lengths at two energies.

  6. Evaluation of the soft x-ray reflectivity of micropore optics using anisotropic wet etching of silicon wafers.

    Science.gov (United States)

    Mitsuishi, Ikuyuki; Ezoe, Yuichiro; Koshiishi, Masaki; Mita, Makoto; Maeda, Yoshitomo; Yamasaki, Noriko Y; Mitsuda, Kazuhisa; Shirata, Takayuki; Hayashi, Takayuki; Takano, Takayuki; Maeda, Ryutaro

    2010-02-20

    The x-ray reflectivity of an ultralightweight and low-cost x-ray optic using anisotropic wet etching of Si (110) wafers is evaluated at two energies, C K(alpha)0.28 keV and Al K(alpha)1.49 keV. The obtained reflectivities at both energies are not represented by a simple planar mirror model considering surface roughness. Hence, an geometrical occultation effect due to step structures upon the etched mirror surface is taken into account. Then, the reflectivities are represented by the theoretical model. The estimated surface roughness at C K(alpha) (approximately 6 nm rms) is significantly larger than approximately 1 nm at Al K(alpha). This can be explained by different coherent lengths at two energies.

  7. In-situ virtual metrology for the silicon-dioxide etch rate by using optical emission spectroscopy data

    International Nuclear Information System (INIS)

    Kim, Boomsoo; Hong, Sangjeen

    2014-01-01

    As a useful tool for process control in a high volume semiconductor manufacturing environment, virtual metrology for the etch rate in a plasma etch process is investigated using optical emission spectroscopy (OES) data. Virtual metrology is a surrogate measurement taken from the process instead of from direct measurement, and it can provide in-situ metrology of a wafer's geometry from a predictive model. A statistical regression model that correlates the selected wavelengths of the optical emission spectra to the etch rate is established using the OES data collected over 20 experimental runs. In addition, an argon actinometry study is employed to quantify the OES data, and it provides valuable insight into the analysis of the OES data. The established virtual metrology model is further verified with an additional 20 runs of data. As a result, the virtual metrology model with both process recipe tool data and in-situ data shows higher prediction accuracy by as much as 56% compared with either the process recipe tool data or the in-situ data alone.

  8. Role of vibrationally excited HBr in a HBr/He inductively coupled plasma used for etching of silicon

    Science.gov (United States)

    Tinck, Stefan; Bogaerts, Annemie

    2016-06-01

    In this work, the role of vibrationally excited HBr (HBr(vib)) is computationally investigated for a HBr/He inductively coupled plasma applied for Si etching. It is found that at least 50% of all dissociations of HBr occur through HBr(vib). This additional dissociation pathway through HBr(vib) makes the plasma significantly more atomic. It also results in a slightly higher electron temperature (i.e. about 0.2 eV higher compared to simulation results where HBr(vib) is not included), as well as a higher gas temperature (i.e. about 50 K higher than without including HBr(vib)), due to the enhanced Franck-Condon heating through HBr(vib) dissociation, at the conditions investigated. Most importantly, the calculated etch rate with HBr(vib) included in the model is a factor 3 higher than in the case without HBr(vib), due to the higher fluxes of etching species (i.e. H and Br), while the chemical composition of the wafer surface shows no significant difference. Our calculations clearly show the importance of including HBr(vib) for accurate modeling of HBr-containing plasmas.

  9. Development of Ultra-Fast Silicon Detectors for 4D tracking

    Science.gov (United States)

    Staiano, A.; Arcidiacono, R.; Boscardin, M.; Dalla Betta, G. F.; Cartiglia, N.; Cenna, F.; Ferrero, M.; Ficorella, F.; Mandurrino, M.; Obertino, M.; Pancheri, L.; Paternoster, G.; Sola, V.

    2017-12-01

    In this contribution we review the progress towards the development of a novel type of silicon detectors suited for tracking with a picosecond timing resolution, the so called Ultra-Fast Silicon Detectors. The goal is to create a new family of particle detectors merging excellent position and timing resolution with GHz counting capabilities, very low material budget, radiation resistance, fine granularity, low power, insensitivity to magnetic field, and affordability. We aim to achieve concurrent precisions of ~ 10 ps and ~ 10 μm with a 50 μm thick sensor. Ultra-Fast Silicon Detectors are based on the concept of Low-Gain Avalanche Detectors, which are silicon detectors with an internal multiplication mechanism so that they generate a signal which is factor ~10 larger than standard silicon detectors. The basic design of UFSD consists of a thin silicon sensor with moderate internal gain and pixelated electrodes coupled to full custom VLSI chip. An overview of test beam data on time resolution and the impact on this measurement of radiation doses at the level of those expected at HL-LHC is presented. First I-V and C-V measurements on a new FBK sensor production of UFSD, 50 μm thick, with B and Ga, activated at two diffusion temperatures, with and without C co-implantation (in Low and High concentrations), and with different effective doping concentrations in the Gain layer, are shown. Perspectives on current use of UFSD in HEP experiments (UFSD detectors have been installed in the CMS-TOTEM Precision Protons Spectrometer for the forward physics tracking, and are currently taking data) and proposed applications for a MIP timing layer in the HL-LHC upgrade are briefly discussed.

  10. The radiation damage in silicon diodes induced by stray fast neutrons from the ANSTO Cyclotron

    International Nuclear Information System (INIS)

    Mukherjee, B.

    1996-01-01

    Intense flux of fast neutrons are produced during routine isotope production runs at the National Medical Cyclotron. These stray neutrons induce irreversible displacement damage in the semiconductor devices, the vital building blocks of the various electronic instruments used in the facility. This poster highlights the results of the radiation hardness investigation study of commercial silicon diodes undertaken at the Health Physics laboratory of the National Medical Cyclotron

  11. Combined up conversion, down conversion and down shifting photo-luminescence of low cost erbium-ytterbium co-doped porous silicon produced by stain etching

    Energy Technology Data Exchange (ETDEWEB)

    Diaz-Herrera, B. [Departamento de Fisica Basica, Universidad de La Laguna (ULL), Avenida Astrofisico Francisco Sanchez, 2, 38206 La Laguna, S/C de Tenerife (Spain); Linsun Power Technology (Quanzhou) Corp. Ltd. Co., Economic Development Zone, Jinjiang 362200, Fujian (China); Jimenez-Rodriguez, E. [Departamento de Fisica Basica, Universidad de La Laguna (ULL), Avenida Astrofisico Francisco Sanchez, 2, 38206 La Laguna, S/C de Tenerife (Spain); Gonzalez-Diaz, B. [Departamento de Fisica Basica, Universidad de La Laguna (ULL), Avenida Astrofisico Francisco Sanchez, 2, 38206 La Laguna, S/C de Tenerife (Spain); Instituto Tecnologico y de Energias Renovables, S.A. (ITER), Poligono Industrial de Granadilla, S/N, E38600, Granadilla de Abona (Spain); Montesdeoca-Santana, A. [Departamento de Fisica Basica, Universidad de La Laguna (ULL), Avenida Astrofisico Francisco Sanchez, 2, 38206 La Laguna, S/C de Tenerife (Spain); Velazquez, J.J. [Departamento de Fisica Fundamental y Experimental, Electronica y Sistemas, Avenida Astrofisico Francisco Sanchez, 2, 38206 La Laguna, S/C de Tenerife (Spain); Guerrero-Lemus, R., E-mail: rglemus@ull.es [Departamento de Fisica Basica, Universidad de La Laguna (ULL), Avenida Astrofisico Francisco Sanchez, 2, 38206 La Laguna, S/C de Tenerife (Spain); Fundacion de Estudios de Economia Aplicada, Programa Focus-Abengoa de Energia y Cambio Climaticoi, Jorge Juan 46, 28001 Madrid (Spain)

    2011-07-01

    In this work, erbium and ytterbium have been incorporated into luminescent porous silicon (PS) layers by simple impregnation of the PS substrate with a saturated nitrate solution of erbium and ytterbium. The photoluminescence of the co-doped rare earth layers have been evaluated. The doping process has been designed for its potential in silicon-based solar cell production, with the aim to improve the Shockley-Queisser limit with a reasonable cost effective method for the industry, which implies a significant enhancement of the efficiency under non-concentrated sunlight irradiation. The temperature and annealing time of the doping process were selected according to industry standards in order to ease a trial adoption. The composition was analyzed by Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy in order to characterize the doping profile. Different up-conversion and down-conversion contributions from the rare earths in the visible and IR were detected, together with the down shifting effect of the stain etched PS. There is no evidence of energy transference between the PS matrix and the rare earths.

  12. Role of surface-reaction layer in HBr/fluorocarbon-based plasma with nitrogen addition formed by high-aspect-ratio etching of polycrystalline silicon and SiO2 stacks

    Science.gov (United States)

    Iwase, Taku; Matsui, Miyako; Yokogawa, Kenetsu; Arase, Takao; Mori, Masahito

    2016-06-01

    The etching of polycrystalline silicon (poly-Si)/SiO2 stacks by using VHF plasma was studied for three-dimensional NAND fabrication. One critical goal is achieving both a vertical profile and high throughput for multiple-stack etching. While the conventional process consists of multiple steps for each stacked layer, in this study, HBr/fluorocarbon-based gas chemistry was investigated to achieve a single-step etching process to reduce process time. By analyzing the dependence on wafer temperature, we improved both the etching profile and rate at a low temperature. The etching mechanism is examined considering the composition of the surface reaction layer. X-ray photoelectron spectroscopy (XPS) analysis revealed that the adsorption of N-H and Br was enhanced at a low temperature, resulting in a reduced carbon-based-polymer thickness and enhanced Si etching. Finally, a vertical profile was obtained as a result of the formation of a thin and reactive surface-reaction layer at a low wafer temperature.

  13. Simulation of silicon microdosimetry spectra in fast neutron therapy using the GEANT4 Monte Carlo toolkit

    International Nuclear Information System (INIS)

    Cornelius, I.M.; Rosenfeld, A.B.

    2003-01-01

    Microdosimetry is used to predict the biological effects of the densely ionizing radiation environments of hadron therapy and space. The creation of a solid state microdosimeter to replace the conventional Tissue Equivalent Proportional Counter (TEPC) is a topic of ongoing research. The Centre for Medical Radiation Physics has been investigating a technique using microscopic arrays of reverse biased PN junctions. A prototype silicon-on-insulator (SOI) microdosimeter was developed and preliminary measurements have been conducted at several hadron therapy facilities. Several factors impede the application of silicon microdosimeters to hadron therapy. One of the major limitations is that of tissue equivalence, ideally the silicon microdosimeter should provide a microdosimetry distribution identical to that of a microscopic volume of tissue. For microdosimetry in neutron fields, such as Fast Neutron Therapy, it is important that products resulting from neutron interactions in the non tissue equivalent sensitive volume do not contribute significantly to the spectrum. Experimental measurements have been conducted at the Gershenson Radiation Oncology Center, Harper Hospital, Detroit by Bradley et al. The aim was to provide a comparison with measurements performed with a TEPC under identical experimental conditions. Monte Carlo based calculations of these measurements were made using the GEANT4 Monte Carlo toolkit. Agreement between experimental and theoretical results was observed. The model illustrated the importance of neutron interactions in the non tissue equivalent sensitive volume and showed this effect to decrease with sensitive volume size as expected. Simulations were also performed for 1 micron cubic silicon sensitive volumes embedded in tissue equivalent material to predict the best case scenario for silicon microdosimetry in Fast Neutron Therapy

  14. Study of selective amorphous silicon etching to silicon nitride using a pin-to-plate dielectric barrier discharge in atmospheric pressure

    Science.gov (United States)

    Kyung, Se-Jin; Park, Jae-Beom; Lee, June-Hee; Lim, Jong-Tae; Yeom, Geun-Young

    2007-08-01

    Remote-type atmospheric pressure plasmas were generated using a modified dielectric barrier discharge with the powered electrode consisting of multipins instead of a conventional blank planar plate. For the N2/NF3 gas mixture, a high etch rate of a :Si close to 115nm/s was obtained by adding 300SCCM (SCCM denotes cubic centimeter per minute at STP) of NF3 to N2 [50SLM (standard liters per minute)] at an ac rms voltage of 8.5kV (2.5kW, 30kHz). However, the selectivity of a :Si to Si3N4 was as low as 1.3. A selectivity of a :Si/Si3N4>5.0 could be obtained while maintaining an etch rate of a :Si at 110nm/s by adding 250SCCM CF4 to the N2 (50SLM )/NF3 (300SCCM) mixture through the formation of a C-F polymer layer preferentially on the Si3N4 surface.

  15. Spatial distribution of structural defects in Cz-seeded directionally solidified silicon ingots: An etch pit study

    Science.gov (United States)

    Lantreibecq, A.; Legros, M.; Plassat, N.; Monchoux, J. P.; Pihan, E.

    2018-02-01

    The PV properties of wafers processed from Cz-seeded directionally solidified silicon ingots suffer from variable structural defects. In this study, we draw an overview on the types of structural defects encountered in the specific case of full 〈1 0 0〉 oriented growth. We found micro twins, background dislocations, and subgrains boundaries. We discuss the possible links between thermomechanical stresses and growth processes with spatial evolution of both background dislocation densities and subgrain boundaries length.

  16. Gas plasma etching of Si and SiO2 films

    International Nuclear Information System (INIS)

    Koyama, Satoshi; Kajiwara, Yoshinori; Nanjo, Junji; Nomura, Shigeru; Hara, Shin-ichi

    1978-01-01

    The dependence of etching depth on the positions and on the quantity of materials to be etched, for plasma ething, has been investigated. When N identical wafers of silicon are etched simultaneously, the etching depth is subject to the following experimental formula D = 9600Nsup(-0.79) (A), where D is etching depth and N is the number of identical wafers. It has been shown that for uniform etching of all wafers, spaces between wafers need over 2.5 cm. Plasma etching characteristics of anodically oxidized silicon and thermally grown silicon dioxide are studied compared with the conventional chemical etching. Etching rate of anodically oxidized silicon in plasma etching is smaller than that of the thermally grown silicon dioxide, but in chemical etching, this relation becomes reverse. It has been suggested that the presence of the water molecules and OH radicals in the anodic oxide films prevents the role of fluorine radicals (F*) in plasma. (author)

  17. First prototype of a silicon tracker using an artificial retina for fast track finding

    CERN Document Server

    Neri, N.; Caponio, F.; Citterio, M.; Coelli, S.; Fu, J.; Geraci, A.; Monti, M.; Petruzzo, M.; Bedeschi, F.; Marino, P.; Morello, M.J.; Piucci, A.; Punzi, G.; Spinella, F.; Stracka, S.; Walsh, J.; Ristori, L.; Tonelli, D.

    2014-01-01

    We report on the R\\&D for a first prototype of a silicon tracker based on an alternative approach for fast track finding. The working principle is inspired from neurobiology, in particular by the processing of visual images by the brain as it happens in nature. It is based on extensive parallelisation of data distribution and pattern recognition. In this work we present the design of a practical device that consists of a telescope based on single-sided silicon detectors; we describe the data acquisition system and the implementation of the track finding algorithms using available digital logic of commercial FPGA devices. Tracking performance and trigger capabilities of the device are discussed along with perspectives for future applications.

  18. Measurements of timing resolution of ultra-fast silicon detectors with the SAMPIC WTDC

    CERN Document Server

    Breton, Dominique

    2016-11-01

    The SAMpler for PICosecond time (SAMPIC) chip has been designed by a collaboration including CEA/IRFU/SEDI, Saclay and CNRS/LAL/SERDI, Orsay. It benefits from both the quick response of a time to digital converter (TDC) and the versatility of a waveform digitizer to perform accurate timing measurements. Thanks to the sampled signals, smart algorithms making best use of the pulse shape can be used to maximize time resolution. A software framework has been developed to analyse the SAMPIC output data and extract timing information by using either a constant fraction discriminator or a fast cross-correlation algorithm. SAMPIC timing capabilities together with the software framework have been tested using Gaussian signals generated by a signal generator or by silicon detectors pulsed with an infra-red laser. Under these ideal experimental conditions, the SAMPIC chip has proven to be capable of timing resolutions down to 4 (40) ps with synthesized (silicon detector) signals.

  19. An etching mask and a method to produce an etching mask

    DEFF Research Database (Denmark)

    2016-01-01

    The present invention relates to an etching mask comprising silicon containing block copolymers produced by self-assembly techniques onto silicon or graphene substrate. Through the use of the etching mask, nanostructures having long linear features having sub-10 nm width can be produced....

  20. Dry Etching

    DEFF Research Database (Denmark)

    Stamate, Eugen; Yeom, Geun Young

    2016-01-01

    for the higher processing rates in FPDs, high-density plasma processing tools that can handle larger-area substrate uniformly are more intensively studied especially for the dry etching of polysilicon thin films. In the case of FPD processing, the current substrate size ranges from 730 × 920 mm (fourth...... etching requirements, and advantages of dry etching over wet processing. Current status and future trends are also presented....

  1. Fast Formation of Conductive Material by Simultaneous Chemical Process for Infilling Through-Silicon Via

    Science.gov (United States)

    Kawakita, Jin; Chikyow, Toyohiro

    2012-06-01

    It is necessary to develop a fast and inexpensive fabrication process of vertical electric wiring by through-silicon via (TSV) technology for advanced three-dimensional semiconductor devices. In this research, a fast-forming conductive composite was successfully developed by simultaneous deposition of conductive organic polymer (polypyrrole) and metal (silver) from the liquid phase, accelerated by photoirradiation. The growth rate of the composite was 38 nm·s-1, which is more than 10 times higher than that of copper by conventional plating. The electric conductivity of the composite was 2.1×104 Ω-1·cm-1, which is on the same level as general metal conductors. In addition, the effects of reaction conditions on the growth rate and the conductivity of the composites were revealed. From these results, the infilling time of the TSV was expected to shorten from the present 2-10 h to 5-10 m.

  2. Etching patterns on the micro‐ and nanoscale

    DEFF Research Database (Denmark)

    Michael-Lindhard, Jonas; Herstrøm, Berit; Stöhr, Frederik

    2014-01-01

    Dry etching is widely used for realizing micro‐ and nanostructured devices in various materials. Here, theavailable dry etching techniques and their capabilities at DTU‐Danchip are presented. What sets the dry etching apart from the traditional wet etching in which a chemical agent dissolved...... and polymer injection molding. High precision patterns of, for instance microfluidic devices, are etched intosilicon which is then electroplated with nickel that will serve as a stamp in the polymer injection molding tool where thousands of devices may be replicated. In addition to silicon and its derived...

  3. Anisotropic etching of silicon for application in micro machine using plasma of SF{sub 6}/CH{sub 4}/O{sub 2}/Ar and SF{sub 6}/CF{sub 4}/O{sub 2}/Ar; Grabado anisotropico de silicio para aplicacion en micromaquinado usando plasmas de SF{sub 6}/CH{sub 4}/O{sub 2}/Ar y SF{sub 6}/CF{sub 4}/O{sub 2}/Ar

    Energy Technology Data Exchange (ETDEWEB)

    Reyes B, C. [Instituto Nacional de Astrofisica, Optica y Electronica, A.P. 51, 72000 Puebla (Mexico); Moshkalyov, S.A.; Swart, J.W. [Centro de Componentes Semiconductores, UNICAMP, 6061 CEP. 13083-970, Campinas, Sao Paulo (Brazil)]. e-mail: creyes@inaoep.mx

    2004-07-01

    We investigated the reactive ion etching of silicon using SF{sub 6}/CH{sub 4}(CF{sub 4})/O{sub 2}/Ar gas mixtures containing fluorine for MEMS applications. Etch rates and anisotropy of etch profiles were examined as a function of gas composition, material of electrode, and RF power. Etch depths were measured using a profilometers, and etch profiles were analyzed by scanning electron microscope. As a mask material, an aluminium film deposited by evaporation, was used. High anisotropy of etching of 0.95 was achieved at etch depths up to 20-30 micrometers and etch rates of approximately 0.3-0.6 {mu}m/min. Highly anisotropic etching is based on a mechanism that enhance the ion bombarding and protects the sidewalls due to polymerization and/or oxidation mechanisms in order to avoid the lateral etch. However, under the anisotropic etching conditions, considerable damages of the etched surfaces (roughness formation), were observed. After etching experiments, wet / dry cleaning procedures were applied to remove surface residues resulting from the reactive ion etching and to improve the etched surface morphology. (Author)

  4. Method For Producing Mechanically Flexible Silicon Substrate

    KAUST Repository

    Hussain, Muhammad Mustafa

    2014-08-28

    A method for making a mechanically flexible silicon substrate is disclosed. In one embodiment, the method includes providing a silicon substrate. The method further includes forming a first etch stop layer in the silicon substrate and forming a second etch stop layer in the silicon substrate. The method also includes forming one or more trenches over the first etch stop layer and the second etch stop layer. The method further includes removing the silicon substrate between the first etch stop layer and the second etch stop layer.

  5. Epitaxial two dimensional aluminum films on silicon (111) by ultra-fast thermal deposition

    Science.gov (United States)

    Levine, Igal; Yoffe, Alexander; Salomon, Adi; Li, Wenjie; Feldman, Yishay; Vilan, Ayelet

    2012-06-01

    Aluminum thin films are known for their extremely rough surface, which is detrimental for applications such as molecular electronics and photonics, where protrusions cause electrical shorts or strong scattering. We achieved atomically flat Al films using a highly non-equilibrium approach. Ultra-fast thermal deposition (UFTD), at rates >10 nm/s, yields RMS roughness of 0.4 to 0.8 nm for 30-50 nm thick Al films on variety of substrates. For UFTD on Si(111) substrates, the top surface follows closely the substrate topography (etch pits), indicating a 2D, layer-by-layer growth. The Al film is a mixture of (100) and (111) grains, where the latter are commensurate with the in-plane orientation of the underlying Si (epitaxy). We show the use of these ultra-smooth Al films for highly reproducible charge-transport measurements across a monolayer of alkyl phosphonic acid as well as for plasmonics applications by directly patterning them by focused ion beam to form a long-range ordered array of holes. UFTD is a one-step process, with no need for annealing, peeling, or primer layers. It is conceptually opposite to high quality deposition methods, such as MBE or ALD, which are slow and near-equilibrium processes. For Al, though, we find that limited diffusion length (and good wetting) is critical for achieving ultra-smooth thin films.

  6. Highly selective etching of silicon nitride to physical-vapor-deposited a-C mask in dual-frequency capacitively coupled CH2F2/H2 plasmas

    International Nuclear Information System (INIS)

    Kim, J. S.; Kwon, B. S.; Heo, W.; Jung, C. R.; Park, J. S.; Shon, J. W.; Lee, N.-E.

    2010-01-01

    A multilevel resist (MLR) structure can be fabricated based on a very thin amorphous carbon (a-C) layer ( congruent with 80 nm) and Si 3 N 4 hard-mask layer ( congruent with 300 nm). The authors investigated the selective etching of the Si 3 N 4 layer using a physical-vapor-deposited (PVD) a-C mask in a dual-frequency superimposed capacitively coupled plasma etcher by varying the process parameters in the CH 2 F 2 /H 2 /Ar plasmas, viz., the etch gas flow ratio, high-frequency source power (P HF ), and low-frequency source power (P LF ). They found that under certain etch conditions they obtain infinitely high etch selectivities of the Si 3 N 4 layers to the PVD a-C on both the blanket and patterned wafers. The etch gas flow ratio played a critical role in determining the process window for infinitely high Si 3 N 4 /PVD a-C etch selectivity because of the change in the degree of polymerization. The etch results of a patterned ArF photoresisit/bottom antireflective coating/SiO x /PVD a-C/Si 3 N 4 MLR structure supported the idea of using a very thin PVD a-C layer as an etch-mask layer for the Si 3 N 4 hard-mask pattern with a pattern width of congruent with 80 nm and high aspect ratio of congruent with 5.

  7. Dynamics of fast pattern formation in porous silicon by laser interference

    Energy Technology Data Exchange (ETDEWEB)

    Peláez, Ramón J.; Kuhn, Timo; Afonso, Carmen N. [Laser Processing Group, Instituto de Óptica, CSIC, Serrano 121, 28006 Madrid (Spain); Vega, Fidel [Departament d' Òptica i Optometria, UPC, Violinista Vellsolà 37, 08222 Terrasa (Spain)

    2014-10-20

    Patterns are fabricated on 290 nm thick nanostructured porous silicon layers by phase-mask laser interference using single pulses of an excimer laser (193 nm, 20 ns pulse duration). The dynamics of pattern formation is studied by measuring in real time the intensity of the diffraction orders 0 and 1 at 633 nm. The results show that a transient pattern is formed upon melting at intensity maxima sites within a time <30 ns leading to a permanent pattern in a time <100 ns upon solidification at these sites. This fast process is compared to the longer one (>1 μs) upon melting induced by homogeneous beam exposure and related to the different scenario for releasing the heat from hot regions. The diffraction efficiency of the pattern is finally controlled by a combination of laser fluence and initial thickness of the nanostructured porous silicon layer and the present results open perspectives on heat release management upon laser exposure as well as have potential for alternative routes for switching applications.

  8. A fast-neutron detection detector based on fission material and large sensitive 4H silicon carbide Schottky diode detector

    Science.gov (United States)

    Liu, Linyue; Liu, Jinliang; Zhang, Jianfu; Chen, Liang; Zhang, Xianpeng; Zhang, Zhongbing; Ruan, Jinlu; Jin, Peng; Bai, Song; Ouyang, Xiaoping

    2017-12-01

    Silicon carbide radiation detectors are attractive in the measurement of the total numbers of pulsed fast neutrons emitted from nuclear fusion and fission devices because of high neutron-gamma discrimination and good radiation resistance. A fast-neutron detection system was developed based on a large-area 4H-SiC Schottky diode detector and a 235U fission target. Excellent pulse-height spectra of fission fragments induced by mono-energy deuterium-tritium (D-T) fusion neutrons and continuous energy fission neutrons were obtained. The detector is proven to be a good candidate for pulsed fast neutron detection in a complex radiation field.

  9. 3D Simulation and Modeling of Ultra-fast 3D Silicon Detectors

    Directory of Open Access Journals (Sweden)

    Liu Manwen

    2017-01-01

    Full Text Available 3D detectors with very small electrode spacing can provide ultra-fast detection due to their extremely small charge collection time. Since the detector full depletion voltage and charge collection time are independent to the detector thickness, ultra-fast 3D detectors can be made relatively thick (or not too thin, ~200 μm to ensure a large signal. The results of the 3D simulations and modeling of 3D silicon detectors with very small electrode spacing and relatively large thickness will be shown in this paper. The column spacing LP is in the range of 5 μm to 10 μm. At a bias voltage of only a few volts, the electric field in the detector can be large enough to ensure the carrier saturation drift velocity in most volume of the detector, and the detector charge collection time there can be as short as 10’s of ps. In this paper, we will analysis the simulated electrical characteristics of this detector structure through systematic 3D simulations using the Silvaco’s TCAD tool. Profiles of detector electric potential and electric field will be presented. We will investigate the region of low electric field (the “slow region” in the detector. We will also exam whether the detector reach the breakdown condition at operation voltages suggested in this work.

  10. Bottom-up and top-down fabrication of nanowire-based electronic devices: In situ doping of vapor liquid solid grown silicon nanowires and etch-dependent leakage current in InGaAs tunnel junctions

    Science.gov (United States)

    Kuo, Meng-Wei

    Semiconductor nanowires are important components in future nanoelectronic and optoelectronic device applications. These nanowires can be fabricated using either bottom-up or top-down methods. While bottom-up techniques can achieve higher aspect ratio at reduced dimension without having surface and sub-surface damage, uniform doping distributions with abrupt junction profiles are less challenging for top-down methods. In this dissertation, nanowires fabricated by both methods were systematically investigated to understand: (1) the in situ incorporation of boron (B) dopants in Si nanowires grown by the bottom-up vapor-liquid-solid (VLS) technique, and (2) the impact of plasma-induced etch damage on InGaAs p +-i-n+ nanowire junctions for tunnel field-effect transistors (TFETs) applications. In Chapter 2 and 3, the in situ incorporation of B in Si nanowires grown using silane (SiH4) or silicon tetrachloride (SiCl4) as the Si precursor and trimethylboron (TMB) as the p-type dopant source is investigated by I-V measurements of individual nanowires. The results from measurements using a global-back-gated test structure reveal nonuniform B doping profiles on nanowires grown from SiH4, which is due to simultaneous incorporation of B from nanowire surface and the catalyst during VLS growth. In contrast, a uniform B doping profile in both the axial and radial directions is achieved for TMBdoped Si nanowires grown using SiCl4 at high substrate temperatures. In Chapter 4, the I-V characteristics of wet- and dry-etched InGaAs p+-i-n+ junctions with different mesa geometries, orientations, and perimeter-to-area ratios are compared to evaluate the impact of the dry etch process on the junction leakage current properties. Different post-dry etch treatments, including wet etching and thermal annealing, are performed and the effectiveness of each is assessed by temperaturedependent I-V measurements. As compared to wet-etched control devices, dry-etched junctions have a significantly

  11. The Regularized Fast Hartley Transform Optimal Formulation of Real-Data Fast Fourier Transform for Silicon-Based Implementation in Resource-Constrained Environments

    CERN Document Server

    Jones, Keith

    2010-01-01

    The Regularized Fast Hartley Transform provides the reader with the tools necessary to both understand the proposed new formulation and to implement simple design variations that offer clear implementational advantages, both practical and theoretical, over more conventional complex-data solutions to the problem. The highly-parallel formulation described is shown to lead to scalable and device-independent solutions to the latency-constrained version of the problem which are able to optimize the use of the available silicon resources, and thus to maximize the achievable computational density, th

  12. Comparison between Silicon-Carbide and diamond for fast neutron detection at room temperature

    Science.gov (United States)

    Obraztsova, O.; Ottaviani, L.; Klix, A.; Döring, T.; Palais, O.; Lyoussi, A.

    2018-01-01

    Neutron radiation detector for nuclear reactor applications plays an important role in getting information about the actual neutron yield and reactor environment. Such detector must be able to operate at high temperature (up to 600° C) and high neutron flux levels. It is worth nothing that a detector for industrial environment applications must have fast and stable response over considerable long period of use as well as high energy resolution. Silicon Carbide is one of the most attractive materials for neutron detection. Thanks to its outstanding properties, such as high displacement threshold energy (20-35 eV), wide band gap energy (3.27 eV) and high thermal conductivity (4.9 W/cm·K), SiC can operate in harsh environment (high temperature, high pressure and high radiation level) without additional cooling system. Our previous analyses reveal that SiC detectors, under irradiation and at elevated temperature, respond to neutrons showing consistent counting rates as function of external reverse bias voltages and radiation intensity. The counting-rate of the thermal neutron-induced peak increases with the area of the detector, and appears to be linear with respect to the reactor power. Diamond is another semi-conductor considered as one of most promising materials for radiation detection. Diamond possesses several advantages in comparison to other semiconductors such as a wider band gap (5.5 eV), higher threshold displacement energy (40-50 eV) and thermal conductivity (22 W/cm·K), which leads to low leakage current values and make it more radiation resistant that its competitors. A comparison is proposed between these two semiconductors for the ability and efficiency to detect fast neutrons. For this purpose the deuterium-tritium neutron generator of Technical University of Dresden with 14 MeV neutron output of 1010 n·s-1 is used. In the present work, we interpret the first measurements and results with both 4H-SiC and chemical vapor deposition (CVD) diamond

  13. Comparison between Silicon-Carbide and diamond for fast neutron detection at room temperature

    Directory of Open Access Journals (Sweden)

    Obraztsova O.

    2018-01-01

    Full Text Available Neutron radiation detector for nuclear reactor applications plays an important role in getting information about the actual neutron yield and reactor environment. Such detector must be able to operate at high temperature (up to 600° C and high neutron flux levels. It is worth nothing that a detector for industrial environment applications must have fast and stable response over considerable long period of use as well as high energy resolution. Silicon Carbide is one of the most attractive materials for neutron detection. Thanks to its outstanding properties, such as high displacement threshold energy (20-35 eV, wide band gap energy (3.27 eV and high thermal conductivity (4.9 W/cm·K, SiC can operate in harsh environment (high temperature, high pressure and high radiation level without additional cooling system. Our previous analyses reveal that SiC detectors, under irradiation and at elevated temperature, respond to neutrons showing consistent counting rates as function of external reverse bias voltages and radiation intensity. The counting-rate of the thermal neutron-induced peak increases with the area of the detector, and appears to be linear with respect to the reactor power. Diamond is another semi-conductor considered as one of most promising materials for radiation detection. Diamond possesses several advantages in comparison to other semiconductors such as a wider band gap (5.5 eV, higher threshold displacement energy (40-50 eV and thermal conductivity (22 W/cm·K, which leads to low leakage current values and make it more radiation resistant that its competitors. A comparison is proposed between these two semiconductors for the ability and efficiency to detect fast neutrons. For this purpose the deuterium-tritium neutron generator of Technical University of Dresden with 14 MeV neutron output of 1010 n·s-1 is used. In the present work, we interpret the first measurements and results with both 4H-SiC and chemical vapor deposition (CVD

  14. Black silicon integrated aperture

    Science.gov (United States)

    Liu, Tianbo; Dickensheets, David L.

    2017-10-01

    This paper describes the incorporation of nanotextured black silicon as an optical absorbing material into silicon-based micro-optoelectromechanical systems devices to reduce stray light and increase optical contrast during imaging. Black silicon is created through a maskless dry etch process and characterized for two different etch conditions, a cold etch performed at 0°C and a cryogenic etch performed at -110°C. We measure specular reflection at visible wavelengths to be black velvet paint used to coat optical baffles and compare favorably with other methods to produce black surfaces from nanotextured silicon or using carbon nanotubes. We illustrate the use of this material by integrating a black silicon aperture around the perimeter of a deformable focus-control mirror. Imaging results show a significant improvement in contrast and image fidelity due to the effective reduction in stray light achieved with the self-aligned black aperture.

  15. Note: fast and reliable fracture strain extraction technique applied to silicon at nanometer scale.

    Science.gov (United States)

    Passi, Vikram; Bhaskar, Umesh; Pardoen, Thomas; Sodervall, Ulf; Nilsson, Bengt; Petersson, Goran; Hagberg, Mats; Raskin, Jean-Pierre

    2011-11-01

    Simple fabrication process and extraction procedure to determine the fracture strain of monocrystalline silicon are demonstrated. Nanowires/nanoribbons in silicon are fabricated and subjected to uniaxial tensile stress along the complete length of the beams. Large strains up to 5% are measured for nanowires presenting a cross section of 50 nm × 50 nm and a length of 2.5 μm. An increase in fracture strain for silicon nanowires (NWs) with the downscaling of their volume is observed, highlighting the reduction of the defects probability as volume is decreased. © 2011 American Institute of Physics

  16. Investigation of Fast Timing Capabilities of Silicon Sensors for the CMS High Granularity Calorimeter at HL-LHC

    CERN Document Server

    Apresyan, Artur

    2016-01-01

    The High Granularity Calorimeter (HGCAL) is the technology choice of the CMS collaboration for the endcap calorimetry upgrade planned to cope with the harsh radiation and unprecedented in-time event pileup projected at the High Luminosity-LHC era. In this context, profiting from fast-timing information (~tens of picoseconds) embedded in the calorimeter would represent a unique capability for resolving information from individual collisions at the HL-LHC. This will enhance the reconstruction and physics capabilities of the CMS detector in terms of pileup mitigation and particle identification. The HGCAL is realized as a sampling calorimeter, including 40 layers of silicon pad detectors with pad areas of 0.5 â?? 1.0 cm^2 and three active thicknesses 320, 200 and 120 μm. Prototype p-in-n and n-in-p 5x5mm^2 silicon pads, with thicknesses of 285, 211 and 133μm, were tested with high-energy electrons at the CERN SPS. We present the motivation for this study including the concept and use of fast-timing in th...

  17. First results of the silicon telescope using an 'artificial retina' for fast track finding

    Energy Technology Data Exchange (ETDEWEB)

    Neri, N. [Istituto Nazionale di Fisica Nucleare - INFN, Sezione di Milano, Milano (Italy); Abba, A.; Caponio, F.; Geraci, A.; Grizzuti, M.; Lusardi, N. [INFN Milano and Politecnico di Milano, Milano (Italy); Citterio, M.; Coelli, S.; Fu, J.; Monti, M.; Petruzzo, M. [INFN Milano, Milano (Italy); Bedeschi, F.; Ninci, D.; Piucci, A.; Spinella, F.; Walsh, J. [INFN Pisa, Pisa (Italy); Cenci, R.; Marino, P.; Morello, M. J.; Stracka, S. [INFN Pisa and Scuola Normale Superiore di Pisa, Pisa (Italy); Punzi, G. [INFN Pisa and Universita di Pisa, Pisa (Italy); Tonelli, D. [CERN, Geneva (Switzerland); Ristori, L. [INFN Pisa, Pisa (Italy); Fermilab, Batavia, Illinois (United States)

    2015-07-01

    We present the first results of the prototype of a silicon tracker with trigger capabilities based on a novel approach for fast track finding. The working principle of the 'artificial retina' is inspired by the processing of visual images by the brain and it is based on extensive parallelization of data distribution and pattern recognition. The algorithm has been implemented in commercial FPGAs in three main logic modules: a switch for the routing of the detector hits, a pool of engines for the digital processing of the hits, and a block for the calculation of the track parameters. The architecture is fully pipelined and allows the reconstruction of real-time tracks with a latency less then 100 clock cycles, corresponding to 0.25 microsecond at 400 MHz clock. The silicon telescope consists of 8 layers of single-sided silicon strip detectors with 512 strips each. The detector size is about 10 cm x 10 cm and the strip pitch is 183 μm. The detectors are read out by the Beetle chip, a custom ASICs developed for LHCb, which provides the measurement of the hit position and pulse height of 128 channels. The 'artificial retina' algorithm has been implemented on custom data acquisition boards based on FPGAs Xilinx Kintex 7 lx160. The parameters of the tracks detected are finally transferred to host PC via USB 3.0. The boards manage the read-out ASICs and the sampling of the analog channels. The read-out is performed at 40 MHz on 4 channels for each ASIC that corresponds to a decoding of the telescope information at 1.1 MHz. We report on the first results of the fast tracking device and compare with simulations. (authors)

  18. Spectra of fast neutrons using a lithiated glass film on silicon

    International Nuclear Information System (INIS)

    Wallace, Steven; Stephan, Andrew C.; Womble, Phillip C.; Begtrup, Gavi; Dai Sheng

    2003-01-01

    Experimental results of a neutron detector manufactured by coating a silicon charged particle detector with a film of lithiated glass are presented. The silicon surface barrier detector (SBD) responds to the 6 Li(n, alpha)triton reaction products generated in the thin film of lithiated glass entering the SBD. Neutron spectral information is present in the pulse height spectrum. An energy response is seen that clearly shows that neutrons from a Pu-Be source and from a deuterium-tritium (D-T) pulsed neutron generator can be differentiated and counted above a gamma background. The significant result is that the fissile content within a container can be measured using a pulsed D-T neutron generator using the neutrons that are counted in the interval between the pulses

  19. Development of a very fast spectral response measurement system for analysis of hydrogenated amorphous silicon solar cells and modules

    International Nuclear Information System (INIS)

    Rodríguez, J.A.; Fortes, M.; Alberte, C.; Vetter, M.; Andreu, J.

    2013-01-01

    Highlights: ► Spectral response equipment for measuring a-Si:H solar cells in a few seconds. ► Equipment based on 16 LEDs with simultaneous illumination of the solar cell. ► The current generated by each LED is analyzed by a Fast Fourier Transform. ► Cheap equipment without lock-in technology for the current measurement. ► Measurement error vs. conventional measurement less than 1% in J sc . - Abstract: An important requirement for a very fast spectral response measurement system is the simultaneous illumination of the solar cell at multiple well defined wavelengths. Nowadays this can be done by means of light emitting diodes (LEDs) available for a multitude of wavelengths. For the purpose to measure the spectral response (SR) of amorphous silicon solar cells a detailed characterization of LEDs emitting in the wavelength range from 300 nm to 800 nm was performed. In the here developed equipment the LED illumination is modulated in the frequency range from 100 Hz to 200 Hz and the current generated by each LED is analyzed by a Fast Fourier Transform (FFT) to determine the current component corresponding to each wavelength. The equipment provides a signal to noise ratio of 2–4 orders of magnitude for individual wavelengths resulting in a precise measurement of the SR over the whole wavelength range. The difference of the short circuit current determined from the SR is less than 1% in comparison to a conventional system with monochromator.

  20. Fast Statistical Timing Analysis for Circuits with Post-Silicon Tunable Clock Buffers

    OpenAIRE

    Li, Bing; Chen, Ning; Schlichtmann, Ulf

    2017-01-01

    Post-Silicon Tunable (PST) clock buffers are widely used in high performance designs to counter process variations. By allowing delay compensation between consecutive register stages, PST buffers can effectively improve the yield of digital circuits. To date, the evaluation of manufacturing yield in the presence of PST buffers is only possible using Monte Carlo simulation. In this paper, we propose an alternative method based on graph transformations, which is much faster, more than 1000 time...

  1. Silicon nanocrystals as light sources: stable, efficient and fast photoluminescence with suitable passivation

    Czech Academy of Sciences Publication Activity Database

    Kůsová, Kateřina

    2012-01-01

    Roč. 9, 8/9 (2012), s. 717-731 ISSN 1475-7435 R&D Projects: GA AV ČR(CZ) IAA101120804; GA MŠk LC510; GA AV ČR KJB100100903 Institutional research plan: CEZ:AV0Z10100521 Keywords : silicon nanocrystals * surface passivation * photoluminescence * lasing Subject RIV: BM - Solid Matter Physics ; Magnetism Impact factor: 1.087, year: 2012

  2. High rate particle tracking and ultra-fast timing with a thin hybrid silicon pixel detector

    Science.gov (United States)

    Fiorini, M.; Aglieri Rinella, G.; Carassiti, V.; Ceccucci, A.; Cortina Gil, E.; Cotta Ramusino, A.; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Martin, E.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Perktold, L.; Petagna, P.; Petrucci, F.; Poltorak, K.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    2013-08-01

    The Gigatracker (GTK) is a hybrid silicon pixel detector designed for the NA62 experiment at CERN. The beam spectrometer, made of three GTK stations, has to sustain high and non-uniform particle rate (∼ 1 GHz in total) and measure momentum and angles of each beam track with a combined time resolution of 150 ps. In order to reduce multiple scattering and hadronic interactions of beam particles, the material budget of a single GTK station has been fixed to 0.5% X0. The expected fluence for 100 days of running is 2 ×1014 1 MeV neq /cm2, comparable to the one foreseen in the inner trackers of LHC detectors during 10 years of operation. To comply with these requirements, an efficient and very low-mass (< 0.15 %X0) cooling system is being constructed, using a novel microchannel cooling silicon plate. Two complementary read-out architectures have been produced as small-scale prototypes: one is based on a Time-over-Threshold circuit followed by a TDC shared by a group of pixels, while the other makes use of a constant-fraction discriminator followed by an on-pixel TDC. The read-out ASICs are produced in 130 nm IBM CMOS technology and will be thinned down to 100 μm or less. An overview of the Gigatracker detector system will be presented. Experimental results from laboratory and beam tests of prototype bump-bonded assemblies will be described as well. These results show a time resolution of about 170 ps for single hits from minimum ionizing particles, using 200 μm thick silicon sensors.

  3. Silicon nanocrystals as fast and efficient light emitters for optical gain

    Czech Academy of Sciences Publication Activity Database

    Kůsová, Kateřina

    2012-01-01

    Roč. 358, č. 17 (2012), s. 2130-2133 ISSN 0022-3093 R&D Projects: GA AV ČR KAN400100701; GA AV ČR(CZ) IAA101120804; GA MŠk LC510; GA AV ČR KJB100100903; GA TA ČR TA01020972 Institutional research plan: CEZ:AV0Z10100521 Keywords : silicon nanocrystals * surface capping * photoluminescence * colloidal dispersion Subject RIV: BM - Solid Matter Physics ; Magnetism Impact factor: 1.597, year: 2012

  4. Optimization of some electrochemical etching parameters for cellulose derivatives

    International Nuclear Information System (INIS)

    Chowdhury, Annis; Gammage, R.B.

    1978-01-01

    Electrochemical etching of fast neutron induced recoil particle tracks in cellulose derivatives and other polymers provides an inexpensive and sensitive means of fast neutron personnel dosimetry. A study of the shape, clarity, and size of the tracks in Transilwrap polycarbonate indicated that the optimum normality of the potassium hydroxide etching solution is 9 N. Optimizations have also been attempted for cellulose nitrate, triacetate, and acetobutyrate with respect to such electrochemical etching parameters as frequency, voltage gradient, and concentration of the etching solution. The measurement of differential leakage currents between the undamaged and the neutron damaged foils aided in the selection of optimum frequencies. (author)

  5. Surface engineering of SiC via sublimation etching

    International Nuclear Information System (INIS)

    Jokubavicius, Valdas; Yazdi, Gholam R.; Ivanov, Ivan G.; Niu, Yuran; Zakharov, Alexei; Iakimov, Tihomir; Syväjärvi, Mikael; Yakimova, Rositsa

    2016-01-01

    Highlights: • Comparison of 6H-, 4H- and 3C-SiC sublimation etching. • Effects of Si-C and Si-C-Ta chemical systems on etching mechanisms. • Effect of etching ambient on surface reconstruction. • Application of etched 4H-SiC surface for the growth of graphene nanoribbons is illustrated. - Abstract: We present a technique for etching of SiC which is based on sublimation and can be used to modify the morphology and reconstruction of silicon carbide surface for subsequent epitaxial growth of various materials, for example graphene. The sublimation etching of 6H-, 4H- and 3C-SiC was explored in vacuum (10 −5 mbar) and Ar (700 mbar) ambient using two different etching arrangements which can be considered as Si-C and Si-C-Ta chemical systems exhibiting different vapor phase stoichiometry at a given temperature. The surfaces of different polytypes etched under similar conditions are compared and the etching mechanism is discussed with an emphasis on the role of tantalum as a carbon getter. To demonstrate applicability of such etching process graphene nanoribbons were grown on a 4H-SiC surface that was pre-patterned using the thermal etching technique presented in this study.

  6. Surface engineering of SiC via sublimation etching

    Energy Technology Data Exchange (ETDEWEB)

    Jokubavicius, Valdas, E-mail: valjo@ifm.liu.se [Department of Physics, Chemistry and Biology, Linköping University, 581 83 Linköping (Sweden); Yazdi, Gholam R.; Ivanov, Ivan G. [Department of Physics, Chemistry and Biology, Linköping University, 581 83 Linköping (Sweden); Niu, Yuran; Zakharov, Alexei [Max Lab, Lund University, S-22100 Lund (Sweden); Iakimov, Tihomir; Syväjärvi, Mikael; Yakimova, Rositsa [Department of Physics, Chemistry and Biology, Linköping University, 581 83 Linköping (Sweden)

    2016-12-30

    Highlights: • Comparison of 6H-, 4H- and 3C-SiC sublimation etching. • Effects of Si-C and Si-C-Ta chemical systems on etching mechanisms. • Effect of etching ambient on surface reconstruction. • Application of etched 4H-SiC surface for the growth of graphene nanoribbons is illustrated. - Abstract: We present a technique for etching of SiC which is based on sublimation and can be used to modify the morphology and reconstruction of silicon carbide surface for subsequent epitaxial growth of various materials, for example graphene. The sublimation etching of 6H-, 4H- and 3C-SiC was explored in vacuum (10{sup −5} mbar) and Ar (700 mbar) ambient using two different etching arrangements which can be considered as Si-C and Si-C-Ta chemical systems exhibiting different vapor phase stoichiometry at a given temperature. The surfaces of different polytypes etched under similar conditions are compared and the etching mechanism is discussed with an emphasis on the role of tantalum as a carbon getter. To demonstrate applicability of such etching process graphene nanoribbons were grown on a 4H-SiC surface that was pre-patterned using the thermal etching technique presented in this study.

  7. Microfabricated Silicon Microneedle Array for Transdermal Drug Delivery

    International Nuclear Information System (INIS)

    Ji, J; Tay, F E; Miao Jianmin; Iliescu, C

    2006-01-01

    This paper presents developed processes for silicon microneedle arrays microfabrication. Three types of microneedles structures were achieved by isotropic etching in inductively coupled plasma (ICP) using SF 6 /O 2 gases, combination of isotropic etching with deep etching, and wet etching, respectively. A microneedle array with biodegradable porous tips was further developed based on the fabricated microneedles

  8. Microfabricated Silicon Microneedle Array for Transdermal Drug Delivery

    Energy Technology Data Exchange (ETDEWEB)

    Ji, J [Mechanical Engineering National University of Singapore, 119260, Singapore (Singapore); Tay, F E [Mechanical Engineering National University of Singapore, 119260, Singapore (Singapore); Miao Jianmin [MicroMachines Center, School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798 (Singapore); Iliescu, C [Institute of Bioengineering and Nanotechnology, 31 Biopolis Way, Nanos, 04-01, 138669 (Singapore)

    2006-04-01

    This paper presents developed processes for silicon microneedle arrays microfabrication. Three types of microneedles structures were achieved by isotropic etching in inductively coupled plasma (ICP) using SF{sub 6}/O{sub 2} gases, combination of isotropic etching with deep etching, and wet etching, respectively. A microneedle array with biodegradable porous tips was further developed based on the fabricated microneedles.

  9. Performance improvement of silicon solar cells by nanoporous silicon coating

    Directory of Open Access Journals (Sweden)

    Dzhafarov T. D.

    2012-04-01

    Full Text Available In the present paper the method is shown to improve the photovoltaic parameters of screen-printed silicon solar cells by nanoporous silicon film formation on the frontal surface of the cell using the electrochemical etching. The possible mechanisms responsible for observed improvement of silicon solar cell performance are discussed.

  10. Reactive ion etching of microphotonic structures

    International Nuclear Information System (INIS)

    Du, J.; Glasscock, J.; Vanajek, J.; Savvides, N.

    2004-01-01

    Full text: Fabrication of microphotonic structures such as planar waveguides and other periodic structures based on silicon technology has become increasingly important due to the potential for integration of planar optical devices. We have fabricated various periodic microstructures on silicon wafers using standard optical lithography and reactive ion etching (RIE). For optical applications the surface roughness and the sidewall angle or steepness of microstructures are the most critical factors. In particular, sidewall roughness of the etched waveguide core accounts for most of the optical propagation loss. We show that by varying the main RIE parameters such as gas pressure, RF power and CF 4 /Ar/O 2 gas composition it is possible to produce microstructures with near-vertical sidewalls and very smooth surfaces. In addition to plasma etching conditions, poor edge quality of the mask often causes sidewall roughness. We employed Ni/Cr metal masks in these experiments for deep etching, and used Ar + ion milling instead of wet chemical etching to open the mask. This improves the edge quality of the mask and ultimately results in smooth sidewalls

  11. Fast silicon drift photodiodes free from bias connections on the light entering side

    CERN Document Server

    Castoldi, A; Gatti, E; Holl, P; Rehak, P

    2000-01-01

    A new type of silicon drift photodiode intended to be coupled to large area scintillators is described. The diodes have a relatively large area (1 cm sup 2) and a short maximal drift time (300 ns). They operate without requiring any external electrical connection at the side of the photodiode coupled to the scintillating crystal. These new photodiodes have almost identical ring structures on both sides with individual rings being at linearly increasing potentials providing the required high electric drift field. A new feature of the presented photodiodes is a small modification of the electrode structure near the signal collecting anode. It allows a full depletion of the photodiode and the highest drift field. Advantages and drawbacks of this kind of photodiodes are described.

  12. Fast silicon drift photodiodes free from bias connections on the light entering side

    Energy Technology Data Exchange (ETDEWEB)

    Castoldi, A.; Chen, W.; Gatti, E.; Holl, P.; Rehak, P. E-mail: rehak2@bnl.gov

    2000-01-11

    A new type of silicon drift photodiode intended to be coupled to large area scintillators is described. The diodes have a relatively large area (1 cm{sup 2}) and a short maximal drift time (300 ns). They operate without requiring any external electrical connection at the side of the photodiode coupled to the scintillating crystal. These new photodiodes have almost identical ring structures on both sides with individual rings being at linearly increasing potentials providing the required high electric drift field. A new feature of the presented photodiodes is a small modification of the electrode structure near the signal collecting anode. It allows a full depletion of the photodiode and the highest drift field. Advantages and drawbacks of this kind of photodiodes are described.

  13. Development of a very fast spectral response measurement system for analysis of hydrogenated amorphous silicon solar cells and modules

    Energy Technology Data Exchange (ETDEWEB)

    Rodriguez, J.A., E-mail: jose.rodriguez@tsolar.eu [Dept. Technology, Development and Innovation, T-Solar Global S.A., Parque Tecnologico de Galicia, Avda. de Vigo 5, E-32900 San Cibrao das Vinas (Ourense) (Spain); Fortes, M. [Departamento de Electronica e Computacion, Universidade de Santiago de Compostela, 15782 Santiago de Compostela (Spain); Alberte, C.; Vetter, M.; Andreu, J. [Dept. Technology, Development and Innovation, T-Solar Global S.A., Parque Tecnologico de Galicia, Avda. de Vigo 5, E-32900 San Cibrao das Vinas (Ourense) (Spain)

    2013-01-01

    Highlights: Black-Right-Pointing-Pointer Spectral response equipment for measuring a-Si:H solar cells in a few seconds. Black-Right-Pointing-Pointer Equipment based on 16 LEDs with simultaneous illumination of the solar cell. Black-Right-Pointing-Pointer The current generated by each LED is analyzed by a Fast Fourier Transform. Black-Right-Pointing-Pointer Cheap equipment without lock-in technology for the current measurement. Black-Right-Pointing-Pointer Measurement error vs. conventional measurement less than 1% in J{sub sc}. - Abstract: An important requirement for a very fast spectral response measurement system is the simultaneous illumination of the solar cell at multiple well defined wavelengths. Nowadays this can be done by means of light emitting diodes (LEDs) available for a multitude of wavelengths. For the purpose to measure the spectral response (SR) of amorphous silicon solar cells a detailed characterization of LEDs emitting in the wavelength range from 300 nm to 800 nm was performed. In the here developed equipment the LED illumination is modulated in the frequency range from 100 Hz to 200 Hz and the current generated by each LED is analyzed by a Fast Fourier Transform (FFT) to determine the current component corresponding to each wavelength. The equipment provides a signal to noise ratio of 2-4 orders of magnitude for individual wavelengths resulting in a precise measurement of the SR over the whole wavelength range. The difference of the short circuit current determined from the SR is less than 1% in comparison to a conventional system with monochromator.

  14. Fast thermal annealing of implantation defects in silicon. Solid phase epitaxy and residual imperfection recovery

    International Nuclear Information System (INIS)

    Adekoya, O.A.

    1987-06-01

    Basic processes ruling the crystal reconstitution in solid phase during fast thermal annealing are studied; the role of electronic and thermodynamic effects at the interface is precised, following the implantations of a donor element (p + ), an acceptor element (B + ) and an intrinsic element (Ge + ). Then, after recrystallization, the electric role of residual point defects is shown together with the possibility of total recovery and an important electric activation of the doping [fr

  15. Fabrication of a high sensitivity and fast response self-powered photosensor based on a core-shell silicon nanowire homojunction

    Science.gov (United States)

    Abdul-Hameed, Assel A.; Mahdi, M. A.; Ali, Basil; Selman, Abbas M.; Al-Taay, H. F.; Jennings, P.; Lee, Wen-Jen

    2018-04-01

    Core-shell self-powered SiNWs homojunction photosensors have been fabricated. SiNWs are prepared by a metal assisted chemical etching method using different HF/H2O2 ratios and etching times. The length of the p-SiNWs increased as the H2O2 concentration and etching time increased. All the grown SiNWs show very low (∼0.7%) optical reflectance for the wavelength range of 200-1100 nm. Photoluminescence spectra of all prepared SiNWs show sharp and broad emission bands located in the red region of the light spectrum. Core-shell homojunction photosensors were fabricated by spin coating P2O2 onto the surface of the prepared p-SiNWs and annealed at 900 °C for 1 h. The fabricated devices exhibited photovoltaic behavior and high photosensitivity with fast response speed to the visible light. However, the sample that was fabricated using HF/H2O2 ratio of 1:1 showed the highest photosensitivity value of 3578% while the photosensor prepared using 2:1 ratio of HF/H2O2 gave the faster rise and decay time.

  16. Etch pits on caprolactam

    Science.gov (United States)

    van der Heijden, A. E. D. M.; Geertman, R. M.

    1992-09-01

    As an extension of the results on the morphology, we investigated the defect structure of solution-grown caprolactam crystals by means of slight etching in cyclohexane and subsequent microscopic observation of the resulting etch pits on the 200, 110, and faces. In case of the face (which is a cleavage plane), we confirmed that the etch pits are formed around dislocation lines by performing an "etch-and-match" experiment. Information is obtained on morphology and density of etch pits, the presence of grain boundaries, as well as qualitative information on the inclination of the dislocation lines.

  17. Binding of p-mercaptobenzoic acid and adenine to gold-coated electroless etched silicon nanowires studied by surface-enhanced Raman scattering.

    Science.gov (United States)

    Mohaček-Grošev, Vlasta; Gebavi, Hrvoje; Bonifacio, Alois; Sergo, Valter; Daković, Marko; Bajuk-Bogdanović, Danica

    2018-04-10

    Modern diagnostic tools ever aim to reduce the amount of analyte and the time needed for obtaining the result. Surface-enhanced Raman spectroscopy is a method that could satisfy both of these requirements, provided that for each analyte an adequate substrate is found. Here we demonstrate the ability of gold-sputtered silicon nanowires (SiNW) to bind p-mercaptobenzoic acid in 10 -3 , 10 -4 and 10 -5 M and adenine in 30 and 100μM concentrations. Based on the normal mode analysis, presented here for the first time, the binding of p-mercaptobenzoic acid is deduced. The intensity enhancement of the 1106cm -1 band is explained by involvement of the CS stretching deformation, and the appearance of the broad 300cm -1 band attributed to SAu stretching mode. Adenine SERS spectra demonstrate the existence of the 7H tautomer since the strongest band observed is at 736cm -1 . The adenine binding is likely to occur in several ways, because the number of observed bands in the 1200-1600cm -1 interval exceeds the number of observed bands in the normal Raman spectrum of the free molecule. Copyright © 2018 Elsevier B.V. All rights reserved.

  18. Simple Approach to Superamphiphobic Overhanging Silicon Nanostructures

    DEFF Research Database (Denmark)

    Kumar, Rajendra; Mogensen, Klaus Bo; Bøggild, Peter

    2010-01-01

    Superhydrophobic silicon nanostructures were fabricated by anisotropic etching of silicon coated with a thin hydrophobic layer. At certain etch parameters, overhanging nanostructures form at the apexes of the rod-shaped tips, This leads to superoleophobic behavior for several oily liquids...

  19. Fast argon ion irradiation effect on the characteristics of silicon planar structures

    CERN Document Server

    Karatetskii, S S; Sokolov, V I

    2002-01-01

    The effect of irradiating by the argon ions with the energy of 40 MeV on the planar structures parameters is studied with the purpose of determining the possibilities of their controlled change. It is shown, that the planar structures irradiation by the argon ions with the energy of 40 MeV leads to decrease in the capacitance of the MOS-condensers and narrows the area of the photosensitivity of the p - n-transitions. The observed effects are explained by the specificity of violations, created by fast ions in the crystal

  20. Fast neutron-induced changes in net impurity concentration of high-resistivity silicon

    International Nuclear Information System (INIS)

    Tsveybak, I.; Bugg, W.; Harvey, J.A.; Walter, J.

    1992-01-01

    Resistivity changes produced by 1 MeV neutron irradiation at room temperature have been measured in float-zone grown n and p-type silicon with initial resistivities ranging from 1.8 to 100 kΩcm. Observed changes are discussed in terms of net electrically active impurity concentration. A model is presented which postulates escape of Si self-interstitials and vacancies from damage clusters and their subsequent interaction with impurities and other pre-existing defects in the lattice. These interactions lead to transfer of B and P from electrically active substitutional configurations into electrically inactive positions (B i , Pi i , and E-center), resulting in changes of net electrically active impurity concentration. The changes in spatial distribution of resistivity are discussed, and the experimental data are fit by theoretical curves. Differences in the behavior of n-type and p-type material are explained on the basis of a faster removal of substitutional P and a more nonuniform spatial distribution of the original P concentration

  1. Study of surfactant-added TMAH for applications in DRIE and wet etching-based micromachining

    Science.gov (United States)

    Tang, B.; Shikida, M.; Sato, K.; Pal, P.; Amakawa, H.; Hida, H.; Fukuzawa, K.

    2010-06-01

    In this paper, etching anisotropy is evaluated for a number of different crystallographic orientations of silicon in a 0.1 vol% Triton-X-100 added 25 wt% tetramethylammonium hydroxide (TMAH) solution using a silicon hemisphere. The research is primarily aimed at developing advanced applications of wet etching in microelectromechanical systems (MEMS). The etching process is carried out at different temperatures in the range of 61-81 °C. The etching results of silicon hemisphere and different shapes of three-dimensional structures in {1 0 0}- and {1 1 0}-Si surfaces are analyzed. Significantly important anisotropy, different from a traditional etchant (e.g. pure KOH and TMAH), is investigated to extend the applications of the wet etching process in silicon bulk micromachining. The similar etching behavior of exact and vicinal {1 1 0} and {1 1 1} planes in TMAH + Triton is utilized selectively to remove the scalloping from deep reactive-ion etching (DRIE) etched profiles. The direct application of the present research is demonstrated by fabricating a cylindrical lens with highly smooth etched surface finish. The smoothness of a micro-lens at different locations is measured qualitatively by a scanning electron microscope and quantitatively by an atomic force microscope. The present paper provides a simple and effective fabrication method of the silicon micro-lens for optical MEMS applications.

  2. Various shapes of silicon freestanding microfluidic channels and microstructures in one-step lithography

    International Nuclear Information System (INIS)

    Pal, Prem; Sato, Kazuo

    2009-01-01

    In this research, we have developed and demonstrated a fabrication method for the formation of various shapes of silicon freestanding microfluidic channels and microstructures in one-step photolithography. The fabrication process utilizes the silicon direct wafer bonding with silicon nitride as an intermediate layer, local oxidation of the silicon (LOCOS) process and wet anisotropic etching. Two different types of etchants (non-ionic surfactant (Triton-X-100) added and pure 25 wt% TMAH solutions) are used in series to perform silicon anisotropic etching. Surfactant-added tetramethyl ammonium hydroxide (TMAH) is employed to define the shapes of the structures, while pure TMAH is used to get high undercutting for their fast releasing. The non-ionic surfactant is preferred considering the complementary metal-oxide semiconductor (CMOS) post process issue of wet anisotropic etching. The undercutting at sharp and rounded concave corners, edges aligned along (1 0 0) directions, is measured and analyzed in both pure and surfactant-added TMAH solutions. Mask design issues that must be taken into consideration for the fabrication of desired shape and size structures are also presented

  3. FAST

    DEFF Research Database (Denmark)

    Zuidmeer-Jongejan, Laurian; Fernandez-Rivas, Montserrat; Poulsen, Lars K.

    2012-01-01

    ABSTRACT: The FAST project (Food Allergy Specific Immunotherapy) aims at the development of safe and effective treatment of food allergies, targeting prevalent, persistent and severe allergy to fish and peach. Classical allergen-specific immunotherapy (SIT), using subcutaneous injections...... with aqueous food extracts may be effective but has proven to be accompanied by too many anaphylactic side-effects. FAST aims to develop a safe alternative by replacing food extracts with hypoallergenic recombinant major allergens as the active ingredients of SIT. Both severe fish and peach allergy are caused...... in depth serological and cellular immune analyses will be performed, allowing identification of novel biomarkers for monitoring treatment efficacy. FAST aims at improving the quality of life of food allergic patients by providing a safe and effective treatment that will significantly lower their threshold...

  4. Microstructure and lubricating property of ultra-fast laser pulse textured silicon carbide seals

    Science.gov (United States)

    Chen, Chien-Yu; Chung, Chung-Jen; Wu, Bo-Hsiung; Li, Wang-Long; Chien, Chih-Wei; Wu, Ping-Han; Cheng, Chung-Wei

    2012-05-01

    Most previous studies have employed surface patterning to improve the performance of lubrication systems. However, few have experimentally analyzed improved effects on friction reduction in SiC mechanical seals by ultra-fast laser pulse texturing. This work applies surface texturing on a non-contact mechanical seal and analyzes the characteristics of the resultant surface morphology. A femtosecond laser system is employed to fabricate micro/nanostructures on the SiC mechanical seal, and generates microscale-depth stripes and induces nanostructures on the seal surface. This work examines the morphology and cross section of the SiC nanostructures that correspond to the different scanning speeds of the laser pulse. Results show that varying the scanning speed enables the application of nanostructures of different amplitudes and widths on the surface of the seal. The friction coefficient of the introduced SiC full-textured seal is about 20% smaller than that of a conventional SiC mechanical seal. Hence, femtosecond laser texturing is effective and enables direct fabrication of the surface micro/nanostructures of SiC seals. This technique also serves as a potential approach to lubricating applications.

  5. Microstructure and lubricating property of ultra-fast laser pulse textured silicon carbide seals

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Chien-Yu.; Li, Wang-Long [National Cheng Kung University, Department of Materials Science and Engineering, Tainan, Taiwan (China); Chung, Chung-Jen; Wu, Bo-Hsiung [National Cheng Kung University, Center for Micro/Nano Science and Technology, Tainan, Taiwan (China); Chien, Chih-Wei; Wu, Ping-Han; Cheng, Chung-Wei [ITRI South, Industrial Technology, Research Institute, Laser Application Technology Center, Tainan, Taiwan (China)

    2012-05-15

    Most previous studies have employed surface patterning to improve the performance of lubrication systems. However, few have experimentally analyzed improved effects on friction reduction in SiC mechanical seals by ultra-fast laser pulse texturing. This work applies surface texturing on a non-contact mechanical seal and analyzes the characteristics of the resultant surface morphology. A femtosecond laser system is employed to fabricate micro/nanostructures on the SiC mechanical seal, and generates microscale-depth stripes and induces nanostructures on the seal surface. This work examines the morphology and cross section of the SiC nanostructures that correspond to the different scanning speeds of the laser pulse. Results show that varying the scanning speed enables the application of nanostructures of different amplitudes and widths on the surface of the seal. The friction coefficient of the introduced SiC full-textured seal is about 20% smaller than that of a conventional SiC mechanical seal. Hence, femtosecond laser texturing is effective and enables direct fabrication of the surface micro/nanostructures of SiC seals. This technique also serves as a potential approach to lubricating applications. (orig.)

  6. Electrical field-induced faceting of etched features using plasma etching of fused silica

    Science.gov (United States)

    Huff, M.; Pedersen, M.

    2017-07-01

    This paper reports a previously unreported anomaly that occurs when attempting to perform deep, highly anisotropic etches into fused silica using an Inductively-Coupled Plasma (ICP) etch process. Specifically, it was observed that the top portion of the etched features exhibited a substantially different angle compared to the vertical sidewalls that would be expected in a typical highly anisotropic etch process. This anomaly has been termed as "faceting." A possible explanation of the mechanism that causes this effect and a method to eradicate it has been developed. Additionally, the method to eliminate the faceting is demonstrated. It is theorized that this faceting is a result of the interaction of the electro-potential electrical fields that surround the patterned nickel layers used as a hard mask and the electrical fields directing the high-energy ions from the plasma to the substrate surface. Based on this theory, an equation for calculating the minimum hard mask thickness required for a desired etch depth into fused silica to avoid faceting was derived. As validation, test samples were fabricated employing hard masks of thicknesses calculated based on the derived equation, and it was found that no faceting was observed on these samples, thereby demonstrating that the solution performed as predicted. Deep highly anisotropic etching of fused silica, as well as other forms of silicon dioxide, including crystalline quartz, using plasma etching, has an important application in the fabrication of several MEMS, NEMS, microelectronic, and photonic devices. Therefore, a method to eliminate faceting is an important development for the accurate control of the dimensions of deep and anisotropic etched features of these devices using ICP etch technology.

  7. FAST

    Science.gov (United States)

    Nathavitharana, R R; Daru, P; Barrera, A E; Mostofa Kamal, S M; Islam, S; Ul-Alam, M; Sultana, R; Rahman, M; Hossain, Md S; Lederer, P; Hurwitz, S; Chakraborty, K; Kak, N; Tierney, D B; Nardell, E

    2017-09-01

    National Institute of Diseases of the Chest and Hospital, Dhaka; Bangladesh Institute of Research and Rehabilitation in Diabetes, Endocrine and Metabolic Disorders, Dhaka; and Chittagong Chest Disease Hospital, Chittagong, Bangladesh. To present operational data and discuss the challenges of implementing FAST (Find cases Actively, Separate safely and Treat effectively) as a tuberculosis (TB) transmission control strategy. FAST was implemented sequentially at three hospitals. Using Xpert® MTB/RIF, 733/6028 (12.2%, 95%CI 11.4-13.0) patients were diagnosed with unsuspected TB. Patients with a history of TB who were admitted with other lung diseases had more than twice the odds of being diagnosed with unsuspected TB as those with no history of TB (OR 2.6, 95%CI 2.2-3.0, P stakeholder engagement and laboratory capacity are important for sustainability and scalability.

  8. Etch characteristics of BCB film using inductively coupled plasma

    International Nuclear Information System (INIS)

    Kang, Pil Seung; Kim, Dong Pyo; Kim, Kyoung Tae; Kim, Chang Il; Kim, Sang Gi

    2003-01-01

    The etching characteristics and mechanism of BCB thin films were investigated as a function of CF 4 /O 2 mixing ratio in ICP system. Maximum etch rate of 830 nm/min is obtained at the mixture of O 2 /CF 4 (=80%/20%). OES actinometry results showed that volume density of oxygen atoms fallows the same extreme behavior with the BCB etch rate, while the density of fluorine atoms changes monotonously. Therefore chemical destruction of BCB by oxygen atoms was proposed as the dominant etch mechanism. XPS analysis showed that the addition of CF 4 to O 2 helps to volatilize silicon atoms containing in BCB but leads to the formation of F-containing polymer layer. The profile of etched BCB film was close to 90 .deg. and the surface was clean

  9. Plasma etching an introduction

    CERN Document Server

    Manos, Dennis M

    1989-01-01

    Plasma etching plays an essential role in microelectronic circuit manufacturing. Suitable for researchers, process engineers, and graduate students, this book introduces the basic physics and chemistry of electrical discharges and relates them to plasma etching mechanisms. Throughout the volume the authors offer practical examples of process chemistry, equipment design, and production methods.

  10. Controllable process of nanostructured GaN by maskless inductively coupled plasma (ICP) etching

    International Nuclear Information System (INIS)

    Zhao, Yanfei; Wang, Hu; Shen, Yang; Huang, Zengli; Zhang, Jian; Dingsun, An; Zhang, Wei; Li, Jiadong

    2017-01-01

    This work improved the anisotropically etching profile of GaN with Cl 2 ICP by adjusting etching pressure and gas flow. High etching rate is achieved by lowering pressure and gas flow instead of increasing etching power. High etching power is unfavorable because it may cause physical damages on the surface. In addition, it is noticed that the material of the carrier, used for holding samples during etching, has significant effects on the morphology and profile of the etched GaN surface. A smooth and large-area GaN surface was achieved by proper ICP etching with a big piece of Si carrier; whereas, with other kinds of carriers, various nano-structures were formed on the GaN surfaces after etching. In fact, it is the etching resistance of carrier materials that impacts the surface profile of etched GaN. Needle-like and grass-like nanostructures on etched GaN surfaces were observed with Al and sapphire carriers, of which the process is very similar to RIE-grass or black-silicon technology. This controllable maskless dry-etching process for the GaN nanostructured surface may show more potential applications in GaN devices. (paper)

  11. Controllable process of nanostructured GaN by maskless inductively coupled plasma (ICP) etching

    Science.gov (United States)

    Zhao, Yanfei; Wang, Hu; Zhang, Wei; Li, Jiadong; Shen, Yang; Huang, Zengli; Zhang, Jian; Dingsun, An

    2017-11-01

    This work improved the anisotropically etching profile of GaN with Cl2 ICP by adjusting etching pressure and gas flow. High etching rate is achieved by lowering pressure and gas flow instead of increasing etching power. High etching power is unfavorable because it may cause physical damages on the surface. In addition, it is noticed that the material of the carrier, used for holding samples during etching, has significant effects on the morphology and profile of the etched GaN surface. A smooth and large-area GaN surface was achieved by proper ICP etching with a big piece of Si carrier; whereas, with other kinds of carriers, various nano-structures were formed on the GaN surfaces after etching. In fact, it is the etching resistance of carrier materials that impacts the surface profile of etched GaN. Needle-like and grass-like nanostructures on etched GaN surfaces were observed with Al and sapphire carriers, of which the process is very similar to RIE-grass or black-silicon technology. This controllable maskless dry-etching process for the GaN nanostructured surface may show more potential applications in GaN devices.

  12. A new method of dry cleaning after plasma etching of MRAM materials

    Science.gov (United States)

    Kubo, Takuya; Kang, Song-Yun; Tokyo Electron Ltd. Team

    2015-09-01

    This paper describes a new method for dry cleaning after etching of MRAM materials. Problems such as repeatability or particle generation after etching of MRAM materials are due to the non-volatile nature of etch products. A new etch concept for MRAM is to etch each material such as carbon, metal, or silicon compounds step by step. There are 4 steps in this cleaning: 1) carbon removal by N2/H2, 2) metal removal by Ar, 3) silicon removal by CF4/O2, 4) carbon, oxygen, and fluorine removal by N2/H2. Etch repeatability and particle level reduction have been demonstrated to result from this cleaning method. Akasaka Biz Tower, 5-3-1 Akasaka Minato-ku, Tokyo 107-6325, Japan.

  13. Micro-pyramidal structure fabrication on polydimethylsiloxane (PDMS) by Si (100) KOH wet etching

    Science.gov (United States)

    Hwang, Shinae; Lim, Kyungsuk; Shin, Hyeseon; Lee, Seongjae; Jang, Moongyu

    2017-10-01

    A high degree of accuracy in bulk micromachining is essential to fabricate micro-electro-mechanical systems (MEMS) devices. A series of etching experiments is carried out using 40 wt% KOH solutions at the constant temperature of 70 °C. Before wet etching, SF6 and O2 are used as the dry etching gas to etch the masking layers of a 100 nm thick Si3N4 and SiO2, respectively. The experimental results indicate that (100) silicon wafer form the pyramidal structures with (111) single crystal planes. All the etch profiles are analyzed using Scanning Electron Microscope (SEM) and the wet etch rates depend on the opening sizes. The manufactured pyramidal structures are used as the pattern of silicon mold. After a short hardening of coated polydimethylsiloxane (PDMS) layer, micro pyramidal structures are easily transferred to PDMS layer.

  14. Dry etching for microelectronics

    CERN Document Server

    Powell, RA

    1984-01-01

    This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book

  15. Etching in microsystem technology

    CERN Document Server

    Kohler, Michael

    2008-01-01

    Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices.The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching p

  16. Porous silicon: Synthesis and optical properties

    International Nuclear Information System (INIS)

    Naddaf, M.; Awad, F.

    2006-06-01

    Formation of porous silicon by electrochemical etching method of both p and n-type single crystal silicon wafers in HF based solutions has been performed by using three different modes. In addition to DC and pulsed voltage, a novel etching mode is developed to prepare light-emitting porous silicon by applying and holding-up a voltage in gradient steps form periodically, between the silicon wafer and a graphite electrode. Under same equivalent etching conditions, periodic gradient steps voltage etching can yield a porous silicon layer with stronger photoluminescence intensity and blue shift than the porous silicon layer prepared by DC or pulsed voltage etching. It has been found that the holding-up of the applied voltage during the etching process for defined interval of time is another significant future of this method, which highly affects the blue shift. This can be used for tailoring a porous layer with novel properties. The actual mechanism behind the blue shift is not clear exactly, even the experimental observation of atomic force microscope and purist measurements in support with quantum confinement model. It has been seen also from Fourier Transform Infrared study that interplays between O-Si-H and Si-H bond intensities play key role in deciding the efficiency of photoluminescence emission. Study of relative humidity sensing and photonic crystal properties of pours silicon samples has confirmed the advantages of the new adopted etching mode. The sensitivity at room temperature of porous silicon prepared by periodic gradient steps voltage etching was found to be about 70% as compared to 51% and 45% for the porous silicon prepared by DC and pulsed voltage etching, respectively. (author)

  17. Fabrication of wear-resistant silicon microprobe tips for high-speed surface roughness scanning devices

    Science.gov (United States)

    Wasisto, Hutomo Suryo; Yu, Feng; Doering, Lutz; Völlmeke, Stefan; Brand, Uwe; Bakin, Andrey; Waag, Andreas; Peiner, Erwin

    2015-05-01

    Silicon microprobe tips are fabricated and integrated with piezoresistive cantilever sensors for high-speed surface roughness scanning systems. The fabrication steps of the high-aspect-ratio silicon microprobe tips were started with photolithography and wet etching of potassium hydroxide (KOH) resulting in crystal-dependent micropyramids. Subsequently, thin conformal wear-resistant layer coating of aluminum oxide (Al2O3) was demonstrated on the backside of the piezoresistive cantilever free end using atomic layer deposition (ALD) method in a binary reaction sequence with a low thermal process and precursors of trimethyl aluminum and water. The deposited Al2O3 layer had a thickness of 14 nm. The captured atomic force microscopy (AFM) image exhibits a root mean square deviation of 0.65 nm confirming the deposited Al2O3 surface quality. Furthermore, vacuum-evaporated 30-nm/200-nm-thick Au/Cr layers were patterned by lift-off and served as an etch mask for Al2O3 wet etching and in ICP cryogenic dry etching. By using SF6/O2 plasma during inductively coupled plasma (ICP) cryogenic dry etching, micropillar tips were obtained. From the preliminary friction and wear data, the developed silicon cantilever sensor has been successfully used in 100 fast measurements of 5- mm-long standard artifact surface with a speed of 15 mm/s and forces of 60-100 μN. Moreover, the results yielded by the fabricated silicon cantilever sensor are in very good agreement with those of calibrated profilometer. These tactile sensors are targeted for use in high-aspect-ratio microform metrology.

  18. Porous Silicon Nanowires

    Science.gov (United States)

    Qu, Yongquan; Zhou, Hailong; Duan, Xiangfeng

    2011-01-01

    In this minreview, we summarize recent progress in the synthesis, properties and applications of a new type of one-dimensional nanostructures — single crystalline porous silicon nanowires. The growth of porous silicon nanowires starting from both p- and n-type Si wafers with a variety of dopant concentrations can be achieved through either one-step or two-step reactions. The mechanistic studies indicate the dopant concentration of Si wafers, oxidizer concentration, etching time and temperature can affect the morphology of the as-etched silicon nanowires. The porous silicon nanowires are both optically and electronically active and have been explored for potential applications in diverse areas including photocatalysis, lithium ion battery, gas sensor and drug delivery. PMID:21869999

  19. High-resolution and Fast-response Fiber-optic Temperature Sensor Using Silicon Fabry-Perot Cavity

    Science.gov (United States)

    2015-03-23

    sensor using silicon Fabry -Pérot cavity 0601153N 73-4951-05-5 Guigen Liu, Ming Han, and Weilin Hou Naval Research Laboratory Oceanography Division...VA 22203-1995 ONR Approved for public release, distribution is unlimited. We report a fiber-optic sensor based on a silicon Fabry -Pérot cavity...silicon Fabry -Pérot cavity Guigen Liu,1 Ming Han,1,* and Weilin Hou2 1Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln

  20. Detailed Time-Resolved Spectral Analysis of Ultra-Fast Four-Wave Mixing in Silicon Nanowires

    DEFF Research Database (Denmark)

    Ma, M.; Galili, Michael; Oxenløwe, Leif Katsuo

    2011-01-01

    We present an experimental set-up for measuring spectral and temporal nonlinear responses of silicon nanowires. We find that switching windows are independent of device lengths and there is no memory effect of the FWM response.......We present an experimental set-up for measuring spectral and temporal nonlinear responses of silicon nanowires. We find that switching windows are independent of device lengths and there is no memory effect of the FWM response....

  1. Deep SiO2 etching with Al and AlN masks for MEMS devices

    Science.gov (United States)

    Bliznetsov, Vladimir; Mao Lin, Hua; Zhang, Yue Jia; Johnson, David

    2015-08-01

    Silicon oxide-based materials such as quartz and silica are widely used in microelectromechanical systems (MEMS). One way to enhance the capability of their deep plasma etching is to increase selectivity by the use of hard masks. Although this approach was studied previously, information on the use of hard masks for the etching of silicon-oxide based materials on 200 mm substrates is scarce. We present the results of etching process development for amorphous silicon oxide using Al and AlN masks with a view of the application of the results for the etching of silica and quartz. Three gas chemistries (C4F8/O2, CF4 and SF6) and their mixtures were compared in an industrial reactive ion etch (RIE) chamber with two plasma sources. It was established that pure SF6 is the best etchant and AlN is a better mask than Al for providing higher selectivity and a sidewall angle close to vertical. A range of etching parameters for micromasking-free etching was established and etched structures of up to a 4 : 1 aspect ratio were created in 21 μm-thick oxide using the process with an etch rate of 0.32-0.36 μm min-1 and a selectivity to AlN mask of (38-49) : 1.

  2. Overview Of Dry-Etch Techniques

    Science.gov (United States)

    Salzer, John M.

    1986-08-01

    With pattern dimensions shrinking, dry methods of etching providing controllable degrees of anisotropy become a necessity. A number of different configurations of equipment - inline, hex, planar, barrel - have been offered, and within each type, there are numerous significant variations. Further, each specific type of machine must be perfected over a complex, interactive parameter space to achieve suitable removal of various materials. Among the most critical system parameters are the choice of cathode or anode to hold the wafers, the chamber pressure, the plasma excitation frequency, and the electrode and magnetron structures. Recent trends include the use of vacuum load locks, multiple chambers, multiple electrodes, downstream etching or stripping, and multistep processes. A major percentage of etches in production handle the three materials: polysilicon, oxide and aluminum. Recent process developments have targeted refractory metals, their silicides, and with increasing emphasis, silicon trenching. Indeed, with new VLSI structures, silicon trenching has become the process of greatest interest. For stripping, dry processes provide advantages other than anisotropy. Here, too, new configurations and methods have been introduced recently. While wet processes are less than desirable from a number of viewpoints (handling, safety, disposal, venting, classes of clean room, automatability), dry methods are still being perfected as a direct, universal replacement. The paper will give an overview of these machine structures and process solutions, together with examples of interest. These findings and the trends discussed are based on semiannual survey of manufacturers and users of the various types of equipment.

  3. Influence of porous silicon formation on the performance of multi

    Indian Academy of Sciences (India)

    The effect of formation of porous silicon on the performance of multi-crystalline silicon (mc-Si) solar cells is presented. Surface treatment of mc-Si solar cells was performed by electrochemical etching in HF-based solution. The effect of etching is viewed through scanning electron microscope (SEM) photographs that ...

  4. Influence of porous silicon formation on the performance of multi ...

    Indian Academy of Sciences (India)

    The effect of formation of porous silicon on the performance of multi-crystalline silicon (mc-Si) solar cells is presented. Surface treatment of mc-Si solar cells was performed by electrochemical etching in HF-based solution. The effect of etching is viewed through scanning electron microscope (SEM) photographs that ...

  5. Sacrificial wafer bonding for planarization after very deep etching

    NARCIS (Netherlands)

    Spiering, V.L.; Spiering, Vincent L.; Berenschot, Johan W.; Elwenspoek, Michael Curt; Fluitman, J.H.J.

    A new technique is presented that provides planarization after a very deep etching step in silicon. This offers the possibility for as well resist spinning and layer patterning as realization of bridges or cantilevers across deep holes or grooves. The sacrificial wafer bonding technique contains a

  6. Fabrication of silicon molds for polymer optics

    DEFF Research Database (Denmark)

    Nilsson, Daniel; Jensen, Søren; Menon, Aric Kumaran

    2003-01-01

    A silicon mold used for structuring polymer microcavities for optical applications is fabricated, using a combination of DRIE (deep reactive ion etching) and anisotropic chemical wet etching with KOH + IPA. For polymer optical microcavities, low surface roughness and vertical sidewalls are often...... needed. This is achieved by aligning the mold precisely to the [110] direction of a silicon (100) wafer and etching very close to the (110) surfaces using a DRIE Bosch process. The surface roughness of the sidewalls is then removed with a short etch in KOH + IPA. To achieve this, the parameters for DRIE...... and KOH + IPA etch have been optimized. To reduce stiction between the silicon mold and the polymers used for molding, the mold is coated with a teflon-like material using the DRIE system. Released polymer microstructures characterized with AFM and SEM are also presented....

  7. Chemical method for producing smooth surfaces on silicon wafers

    Science.gov (United States)

    Yu, Conrad

    2003-01-01

    An improved method for producing optically smooth surfaces in silicon wafers during wet chemical etching involves a pre-treatment rinse of the wafers before etching and a post-etching rinse. The pre-treatment with an organic solvent provides a well-wetted surface that ensures uniform mass transfer during etching, which results in optically smooth surfaces. The post-etching treatment with an acetic acid solution stops the etching instantly, preventing any uneven etching that leads to surface roughness. This method can be used to etch silicon surfaces to a depth of 200 .mu.m or more, while the finished surfaces have a surface roughness of only 15-50 .ANG. (RMS).

  8. Super-selective cryogenic etching for sub-10 nm features

    Science.gov (United States)

    Liu, Zuwei; Wu, Ying; Harteneck, Bruce; Olynick, Deirdre

    2013-01-01

    Plasma etching is a powerful technique for transferring high-resolution lithographic masks into functional materials. Significant challenges arise with shrinking feature sizes, such as etching with thin masks. Traditionally this has been addressed with hard masks and consequently additional costly steps. Here we present a pathway to high selectivity soft mask pattern transfer using cryogenic plasma etching towards low-cost high throughput sub-10 nm nanofabrication. Cryogenic SF6/O2 gas chemistry is studied for high fidelity, high selectivity inductively coupled plasma etching of silicon. Selectivity was maximized on large features (400 nm-1.5 μm) with a focus on minimizing photoresist etch rates. An overall anisotropic profile with selectivity around 140:1 with a photoresist mask for feature size 1.5 μm was realized with this clean, low damage process. At the deep nanoscale, selectivity is reduced by an order of magnitude. Despite these limits, high selectivity is achieved for anisotropic high aspect ratio 10 nm scale etching with thin polymeric masks. Gentler ion bombardment resulted in planar-dependent etching and produced faceted sub-100 nm features.

  9. Direct comparison of the performance of commonly used e-beam resists during nano-scale plasma etching of Si, SiO2, and Cr

    Science.gov (United States)

    Goodyear, Andy; Boettcher, Monika; Stolberg, Ines; Cooke, Mike

    2015-03-01

    Electron beam writing remains one of the reference pattern generation techniques, and plasma etching continues to underpin pattern transfer. We report a systematic study of the plasma etch resistance of several e-beam resists, both negative and positive as well as classical and Chemically Amplified Resists: HSQ[1,2] (Dow Corning), PMMA[3] (Allresist GmbH), AR-P6200 (Allresist GmbH), ZEP520 (Zeon Corporation), CAN028 (TOK), CAP164 (TOK), and an additional pCAR (non-disclosed provider). Their behaviour under plasma exposure to various nano-scale plasma etch chemistries was examined (SF6/C4F8 ICP silicon etch, CHF3/Ar RIE SiO2 etch, Cl2/O2 RIE and ICP chrome etch, and HBr ICP silicon etch). Samples of each resist type were etched simultaneously to provide a direct comparison of their etch resistance. Resist thicknesses (and hence resist erosion rates) were measured by spectroscopic ellipsometer in order to provide the highest accuracy for the resist comparison. Etch selectivities (substrate:mask etch rate ratio) are given, with recommendations for the optimum resist choice for each type of etch chemistry. Silicon etch profiles are also presented, along with the exposure and etch conditions to obtain the most vertical nano-scale pattern transfer. We identify one resist that gave an unusually high selectivity for chlorinated and brominated etches which could enable pattern transfer below 10nm without an additional hard mask. In this case the resist itself acts as a hard mask. We also highlight the differing effects of fluorine and bromine-based Silicon etch chemistries on resist profile evolution and hence etch fidelity.

  10. Thermal Oxidation of Structured Silicon Dioxide

    DEFF Research Database (Denmark)

    Christiansen, Thomas Lehrmann; Hansen, Ole; Jensen, Jørgen Arendt

    2014-01-01

    The topography of thermally oxidized, structured silicon dioxide is investigated through simulations, atomic force microscopy, and a proposed analytical model. A 357 nm thick oxide is structured by removing regions of the oxide in a masked etch with either reactive ion etching or hydrofluoric acid...

  11. Influence of neutron irradiation on etching of SiC in KOH

    Science.gov (United States)

    Mokhov, E. N.; Kazarova, O. P.; Soltamov, V. A.; Nagalyuk, S. S.

    2017-07-01

    The effect of reactor neutron irradiation on the etch rate of SiC in potassium hydroxide has been studied. In the case of high irradiation doses (1019-1021 cm-2), the etch rate of silicon carbide has been shown to drastically rise, especially in the [0001]Si direction. This considerably mitigates the orientation anisotropy of polar face etching. After high-temperature annealing (up to 1200-1400°C), a higher etch rate of irradiated crystals persists. The results have been explained by the high concentration of radiation-induced (partially clustered) defects they contain.

  12. Method of plastic track detector electrochemical etching

    International Nuclear Information System (INIS)

    D'yakov, A.A.

    1984-01-01

    The review of studies dealing with the development of the method for the electro-chemical etching (ECE) of the plastic track detectors on the base of polyethy-leneterephthalate (PET) and polycarbonate (PC) is given. Physical essence of the method, basic parameters of the processes, applied equipment and methods of measurement automation are considered. The advantages of the method over the traditional chemical etching are pointed out. Recommendations on the detector operation modes when detecting fission fragments, α-particles and fast neutrons are given. The ECE method is based on the condition that during chemical etching the high-voltage sound frequency alternating electric field is applied to the detector. In this case the detector serves as an isolating layer betWeen two vessels with etching solution in which high-voltage electrode are submerged. At a fixed electric field potential higher (over than the threshold value) at the end of the etching track cone atree-like discharge spot arises. It is shown that when PET is used for fast neutron detection it is advisable to apply for ECE the PEW solution (15g KOH+40 g C 2 H 2 OH + 45g H 2 O) the field potential should constitute 30 kVxcm -1 at the freqUency of 9 kHz. In the case of fission fragment detection Using ECE and PC the following ECE conditions are recommended: 30% KOH etcher, field potential of 10 kVxcm -1 , 2-4 kHz frequency. It is concluded that the ECE method permits considerably eXtend the sphere of plastic track detector application for detecting ionizing particles,

  13. Fabrication of SiC nanopillars by inductively coupled SF6/O2 plasma etching

    Science.gov (United States)

    Choi, J. H.; Latu-Romain, L.; Bano, E.; Dhalluin, F.; Chevolleau, T.; Baron, T.

    2012-06-01

    In this paper, we demonstrate a top-down fabrication technique for nanometre scale silicon carbide (SiC) pillars using inductively coupled plasma etching. A set of experiments in SF6-based plasma was carried out in order to realize high aspect ratio SiC nanopillars. The etched SiC nanopillars using a small circular mask pattern (115 nm diameter) show high aspect ratio (7.4) with a height of 2.2 µm at an optimum bias voltage (300 V) and pressure (6 mTorr). Under the optimal etching conditions using a large circular mask pattern with 370 nm diameter, the obtained SiC nanopillars exhibit high anisotropy features (6.4) with a large etch depth (>7 µm). The etch characteristic of the SiC nanopillars under these conditions shows a high etch rate (550 nm min-1) and a high selectivity (over 60 for Ni). We also studied the etch profile of the SiC nanopillars and mask evolution over the etching time. As the mask pattern size shrinks in nanoscale, vertical and lateral mask erosion plays a crucial role in the etch profile of the SiC nanopillars. Long etching process makes the pillars appear with a hexagonal shape, coming from the crystallographic structure of α-SiC. It is found that the feature of pillars depends not only on the etching process parameters, but also on the crystallographic structure of the SiC phase.

  14. Dry etching technology for semiconductors

    CERN Document Server

    Nojiri, Kazuo

    2015-01-01

    This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning ...

  15. Ultrahigh-efficiency apodized grating coupler using fully etched photonic crystals

    DEFF Research Database (Denmark)

    Ding, Yunhong; Ou, Haiyan; Peucheret, Christophe

    2013-01-01

    We present an efficient method to design apodized grating couplers with Gaussian output profiles for efficient coupling between standard single mode fibers and silicon chips. An apodized grating coupler using fully etched photonic crystal holes on the silicon-on-insulator platform is designed...

  16. Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

    Science.gov (United States)

    Rao, A. V. Narasimha; Swarnalatha, V.; Pal, P.

    2017-12-01

    Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed etchants (i.e. TMAH and KOH), potassium hydroxide (KOH) exhibits higher etch rate and provides improved anisotropy between Si{111} and Si{110} planes. In the manufacturing company, high etch rate is demanded to increase the productivity that eventually reduces the cost of end product. In order to modify the etching characteristics of KOH for the micromachining of Si{110}, we have investigated the effect of hydroxylamine (NH2OH) in 20 wt% KOH solution. The concentration of NH2OH is varied from 0 to 20% and the etching is carried out at 75 °C. The etching characteristics which are studied in this work includes the etch rates of Si{110} and silicon dioxide, etched surface morphology, and undercutting at convex corners. The etch rate of Si{110} in 20 wt% KOH + 15% NH2OH solution is measured to be four times more than that of pure 20 wt% KOH. Moreover, the addition of NH2OH increases the undercutting at convex corners and enhances the etch selectivity between Si and SiO2.

  17. Novel approaches for tri-crystalline silicon surface texturing

    Energy Technology Data Exchange (ETDEWEB)

    Han, Kyumin; Kim, Kyunghae; Ju, Minkyu; Kim, Young Kuk; Moon, Inyong; Lee, Kyungsoo; Kyung, Dohyun; Kwon, Taeyoung; Yi, Junsin [School of Information and Communication Engineering, Sungkyunkwan University, Suwon (Korea); Thamilselvan, M. [School of Information and Communication Engineering, Sungkyunkwan University, Suwon (Korea); Government College of Technology, Coimbatore, Tamil Nadu (India)

    2009-06-15

    Tri-crystalline silicon (Tri-Si) is a promising candidate to reduce the cost of solar cells fabrication because it can be made by a low-cost, fast process with a better mechanical strength, and needs a thinner wafer. One of the key parameters in improving the efficiency of the Tri-Si solar cells is the reflectance, which can be lowered by etching methods. However, Tri-Si is a crystal compound consisting of three mutually tilted monocrystalline silicon grains. In all grains boundaries the surface is (1 1 0)-oriented. A standard surface texture of etched random pyramids using an anisotropic etchant, such as NaOH, is not achievable here. In this paper, for the first time, a novel texturing method has been attempted, which consisted of two steps - HF:HNO{sub 3}:DI (2.5:2.5:5) etching was followed by exposure to the vapors to generate fine holes and an etching depth of 2.5 {mu}m had been reached. A best result of 12.3% has been achieved for surface reflectance, which is about 10% lower than that using normal acidic texturing. Nanoporous structures were formed and the size of the porous structure varied from 5 to 10 nm. An antireflection coating of SiN{sub x} SLAR was used to optimize the reflectance. A fill factor of 0.78 has been reached with an efficiency of 16.2% in 12.5 cm x 12.5 cm. This high efficiency is mainly due to an increased short-circuit current density of 34 mA/cm{sup 2}. (author)

  18. Fabrication of silicon molds for polymer optics

    DEFF Research Database (Denmark)

    Nilsson, Daniel; Jensen, Søren; Menon, Aric Kumaran

    2003-01-01

    A silicon mold used for structuring polymer microcavities for optical applications is fabricated, using a combination of DRIE (deep reactive ion etching) and anisotropic chemical wet etching with KOH + IPA. For polymer optical microcavities, low surface roughness and vertical sidewalls are often ...... and KOH + IPA etch have been optimized. To reduce stiction between the silicon mold and the polymers used for molding, the mold is coated with a teflon-like material using the DRIE system. Released polymer microstructures characterized with AFM and SEM are also presented....

  19. Fully etched apodized grating coupler on the SOI platform with −058 dB coupling efficiency

    DEFF Research Database (Denmark)

    Ding, Yunhong; Peucheret, Christophe; Ou, Haiyan

    2014-01-01

    We design and fabricate an ultrahigh coupling efficiency (CE) fully etched apodized grating coupler on the silicon- on-insulator (SOI) platform using subwavelength photonic crystals and bonded aluminum mirror. Fabrication error sensitivity andcoupling angle dependence are experimentally...

  20. Inductively coupled plasma etching of poly-SiC in SF6 chemistries

    Science.gov (United States)

    Kuah, S. H.; Wood, P. C.

    2005-07-01

    A study was made to find a low-cost and robust etching solution for silicon carbide (SiC) using a commercially available inductively coupled plasma etching tool. Sulfur hexafluoride (SF6) was selected because of its high degree of F dissociation and nonhazardous nature. A parametric study of the etching characteristics of poly-SiC in inductively coupled plasma (ICP) SF6 chemistries was performed. Etch chemistry was found to greatly affect etch rate, selectivity, and the postetch surface condition. Etch rates as high as 5884 A˚/min were achieved with high SiC/Cr selectivity (36) using a SF6/CF4/He gas mixture, but the etched surface was relatively rough (134 A˚ rms). He addition was found to increase the SiC etch rate, and this effect is believed to be caused by increased ionization of SF6 in the plasma and the resulting increases in the SF3+ and fluorine (F) radical concentrations. The formation of pillar-like structures and sidewall deposition was observed on the etched SiC surfaces under some conditions. These unwanted etch byproducts exhibited a high concentration of chromium (Cr) and fluorine. However, an argon (Ar) plasma preclean of the substrate, high ICP, and/or bias powers, and CF4 addition reduced the pillar formation significantly.

  1. High-aspect ratio micro- and nanostructures enabled by photo-electrochemical etching for sensing and energy harvesting applications

    Science.gov (United States)

    Alhalaili, Badriyah; Dryden, Daniel M.; Vidu, Ruxandra; Ghandiparsi, Soroush; Cansizoglu, Hilal; Gao, Yang; Saif Islam, M.

    2018-03-01

    Photo-electrochemical (PEC) etching can produce high-aspect ratio features, such as pillars and holes, with high anisotropy and selectivity, while avoiding the surface and sidewall damage caused by traditional deep reactive ion etching (DRIE) or inductively coupled plasma (ICP) RIE. Plasma-based techniques lead to the formation of dangling bonds, surface traps, carrier leakage paths, and recombination centers. In pursuit of effective PEC etching, we demonstrate an optical system using long wavelength (λ = 975 nm) infra-red (IR) illumination from a high-power laser (1-10 W) to control the PEC etching process in n-type silicon. The silicon wafer surface was patterned with notches through a lithography process and KOH etching. Then, PEC etching was introduced by illuminating the backside of the silicon wafer to enhance depth, resulting in high-aspect ratio structures. The effect of the PEC etching process was optimized by varying light intensities and electrolyte concentrations. This work was focused on determining and optimizing this PEC etching technique on silicon, with the goal of expanding the method to a variety of materials including GaN and SiC that are used in designing optoelectronic and electronic devices, sensors and energy harvesting devices.

  2. Investigation of InP etching mechanisms in a Cl2/H2 inductively coupled plasma by optical emission spectroscopy

    International Nuclear Information System (INIS)

    Gatilova, L.; Bouchoule, S.; Guilet, S.; Chabert, P.

    2009-01-01

    Optical emission spectroscopy (OES) has been used in order to investigate the InP etching mechanisms in a Cl 2 -H 2 inductively coupled plasma. The authors have previously shown that anisotropic etching of InP could be achieved for a H 2 percentage in the 35%-45% range where the InP etch rate also presents a local maximum [J. Vac. Sci. Technol. B 24, 2381 (2006)], and that anisotropic etching was due to an enhanced passivation of the etched sidewalls by a silicon oxide layer [J. Vac. Sci. Technol. B 26, 666 (2008)]. In this work, it is shown that this etching behavior is related to a maximum in the H atom concentration in the plasma. The possible enhancement of the sidewall passivation process in the presence of H is investigated by comparing OES measurements and etching results obtained for Cl 2 -H 2 and Cl 2 -Ar gas mixtures

  3. Test beam measurement of the first prototype of the fast silicon pixel monolithic detector for the TT-PET project

    Science.gov (United States)

    Paolozzi, L.; Bandi, Y.; Benoit, M.; Cardarelli, R.; Débieux, S.; Forshaw, D.; Hayakawa, D.; Iacobucci, G.; Kaynak, M.; Miucci, A.; Nessi, M.; Ratib, O.; Ripiccini, E.; Rücker, H.; Valerio, P.; Weber, M.

    2018-04-01

    The TT-PET collaboration is developing a PET scanner for small animals with 30 ps time-of-flight resolution and sub-millimetre 3D detection granularity. The sensitive element of the scanner is a monolithic silicon pixel detector based on state-of-the-art SiGe BiCMOS technology. The first ASIC prototype for the TT-PET was produced and tested in the laboratory and with minimum ionizing particles. The electronics exhibit an equivalent noise charge below 600 e‑ RMS and a pulse rise time of less than 2 ns , in accordance with the simulations. The pixels with a capacitance of 0.8 pF were measured to have a detection efficiency greater than 99% and, although in the absence of the post-processing, a time resolution of approximately 200 ps .

  4. Measurement of nuclear resonant scattering on 61Ni with fast scintillation detector using proportional-mode silicon avalanche photodiode

    Science.gov (United States)

    Inoue, Keisuke; Kobayashi, Yasuhiro; Yoda, Yoshitaka; Koshimizu, Masanori; Nishikido, Fumihiko; Haruki, Rie; Kishimoto, Shunji

    2018-02-01

    We developed a new scintillation timing detector using a proportional-mode silicon avalanche photodiode (Si-APD) for synchrotron radiation nuclear resonant scattering. We report on the nuclear forward scattering measurement on 61Ni with a prototype detector using a lead-loaded plastic scintillator (EJ-256, 3 mm in diameter and 2 mm in thickness), mounted on a proportional-mode Si-APD. Using synchrotron X-rays of 67.41 keV, we successfully measured the time spectra of nuclear forward scattering on 61Ni enriched metal foil and 61Ni86V14 alloy. The prototype detector confirmed the expected dynamical beat structure with a time resolution of 0.53 ns (FWHM).

  5. Annealing Kinetic Model Using Fast and Slow Metastable Defects for Hydrogenated-Amorphous-Silicon-Based Solar Cells

    Directory of Open Access Journals (Sweden)

    Seung Yeop Myong

    2007-01-01

    Full Text Available The two-component kinetic model employing “fast” and “slow” metastable defects for the annealing behaviors in pin-type hydrogenated-amorphous-silicon- (a-Si:H- based solar cells is simulated using a normalized fill factor. Reported annealing data on pin-type a-Si:H-based solar cells are revisited and fitted using the model to confirm its validity. It is verified that the two-component model is suitable for fitting the various experimental phenomena. In addition, the activation energy for annealing of the solar cells depends on the definition of the recovery time. From the thermally activated and high electric field annealing behaviors, the plausible microscopic mechanism on the defect removal process is discussed.

  6. Polymer masks for structured surface and plasma etching

    International Nuclear Information System (INIS)

    Vital, Alexane; Vayer, Marylène; Sinturel, Christophe; Tillocher, Thomas; Lefaucheux, Philippe; Dussart, Rémi

    2015-01-01

    Graphical abstract: - Highlights: • Sub-micrometric silicon structures were prepared by cryogenic plasma etching. • Polymer templates based on phase-separated films of PS/PLA were used. • Silica structured masks were prepared by filling the polymer templates. • Etching of underlying silicon through silica templates gave original structures. - Abstract: Silica and silicon structures have been prepared at the sub-micrometer length-scale, using laterally phase-separated thin films of poly(styrene) (PS) and poly(lactic acid) (PLA) homopolymer blends. The selective removal of one polymer and the filling of the released space by silica precursor solution led, after calcination, to silica structures on silicon such as arrays of bowl-shape features or pillars, layers with through or non-through cylindrical holes, which has not been observed for some of them. The control of the morphology of the initial polymer film was a key point to achieve such type of structures. Particularly relevant was the use of solvent vapor annealing (vs thermal annealing) of the initial spin-coated films that favored and stabilized laterally phase-separated morphologies. Characteristic dimension of the domains were shown to be coupled with the thickness of the film, thinner films giving smaller domain sizes. Despite a relatively high incompatibility of the two polymers, a macro-phase separation was prevented in all the studied conditions. Sub-micrometric domains were formed, and for the thinner films, nanometric domains as small as 74 nm in size can be obtained. The silica structures formed by the infiltration of the polymer templates were used as hard masks for the cryogenic etching of underlying silicon. New structured surfaces, arrays of silicon pillars which can be plain or hollow at the upper part or arrays of cylindrical holes were formed. A selectivity as high as 21 was obtained using this type of mask for 1.5 μm deep holes having a typical diameter of 200 nm

  7. Selfsupported epitaxial silicon films

    International Nuclear Information System (INIS)

    Lazarovici, D.; Popescu, A.

    1975-01-01

    The methods of removing the p or p + support of an n-type epitaxial silicon layer using electrochemical etching are described. So far, only n + -n junctions have been processed. The condition of anodic dissolution for some values of the support and layer resistivity are given. By this method very thin single crystal selfsupported targets of convenient areas can be obtained for channeling - blocking experiments

  8. Estimation of Ion/Radical Flux from Mask Selectivity and Etching Rate Calibrated by Topography Simulation

    Science.gov (United States)

    Ohmine, Toshimitsu; Deshpande, Vaibhav; Takada, Hideki; Ikeda, Tomoharu; Saito, Hirokazu; Kawai, Fumiaki; Hamada, Kimimori

    2011-08-01

    A simple method for the estimation of ion/radical fluxes in an ion-assisted etching process was developed for SF6/O2/Si etching utilizing the difference in etching mechanism between SiO2 mask and the silicon substrate. It was derived that F coverage of a silicon surface is approximately a linear function of the selectivity of the two materials, from which the incident ion flux and F flux are calculated. The selectivity-to-coverage proportional constant was determined using a topography simulator so that the general trend of etching profiles matched those of the experiment. The obtained fluxes showed reasonable qualitative trends in terms of reactor operational conditions and reactor parameters. The feature profiles simulated by the topography simulator using these flux values were in good agreement with those of scanning electron microscopy (SEM) experimental data over a wide range of operating conditions and machine configurations.

  9. Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching.

    Science.gov (United States)

    Lee, Jung-Pil; Choi, Sinho; Park, Soojin

    2011-01-18

    We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°.

  10. The TT-PET project: a thin TOF-PET scanner based on fast novel silicon pixel detectors

    Science.gov (United States)

    Bandi, Y.; Benoit, M.; Cadoux, F. R.; Forshaw, D. C.; Hänni, R.; Hayakawa, D.; Iacobucci, G.; Michal, S.; Miucci, A.; Paolozzi, L.; Ratib, O.; Ripiccini, E.; Tognina, C.; Valerio, P.; Weber, M.

    2018-01-01

    The TT-PET project aims at developing a compact Time-of-flight PET scanner with 30ps time resolution, capable of withstanding high magnetic fields and allowing for integration in a traditional MRI scanner, providing complimentary real-time PET images. The very high timing resolution of the TT-PET scanner is achieved thanks to a new generation of Silicon-Germanium (Si-Ge) amplifiers, which are embedded in monolithic pixel sensors. The scanner is composed of 16 detection towers as well as cooling blocks, arranged in a ring structure. The towers are composed of multiple ultra-thin pixel modules stacked on top of each other. Making it possible to perform depth of interaction measurements and maximize the spatial resolution along the line of flight of the two photons emitted within a patient. This will result in improved image quality, contrast, and uniformity while drastically reducing backgrounds within the scanner. Allowing for a reduction in the amount of radioactivity delivered to the patient. Due to an expected data rate of about 250 MB/s a custom readout system for high data throughput has been developed, which includes noise filtering and reduced data pressure. The realisation of a first scanner prototype for small animals is foreseen by 2019. A general overview of the scanner will be given including, technical details concerning the detection elements, mechanics, DAQ readout, simulation and results.

  11. Fast subsurface fingerprint imaging with full-field optical coherence tomography system equipped with a silicon camera.

    Science.gov (United States)

    Auksorius, Egidijus; Boccara, A Claude

    2017-09-01

    Images recorded below the surface of a finger can have more details and be of higher quality than the conventional surface fingerprint images. This is particularly true when the quality of the surface fingerprints is compromised by, for example, moisture or surface damage. However, there is an unmet need for an inexpensive fingerprint sensor that is able to acquire high-quality images deep below the surface in short time. To this end, we report on a cost-effective full-field optical coherent tomography system comprised of a silicon camera and a powerful near-infrared LED light source. The system, for example, is able to record 1.7  cm×1.7  cmen face images in 0.12 s with the spatial sampling rate of 2116 dots per inch and the sensitivity of 93 dB. We show that the system can be used to image internal fingerprints and sweat ducts with good contrast. Finally, to demonstrate its biometric performance, we acquired subsurface fingerprint images from 240 individual fingers and estimated the equal-error-rate to be ∼0.8%. The developed instrument could also be used in other en face deep-tissue imaging applications because of its high sensitivity, such as in vivo skin imaging. (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE).

  12. The Gigatracker: An ultra-fast and low-mass silicon pixel detector for the NA62 experiment

    CERN Document Server

    Fiorini, M; Morel, M; Petrucci, F; Marchetto, F; Garbolino, S; Cortina, E; Tiuraniemi, S; Ceccucci, A; Martin, E; Riedler, P; Martoiu, S; Ramusino, A C; Rinella, G A; Mapelli, A; Mazza, G; Noy, M; Jarron, P; Nuessle, G; Dellacasa, G; Kluge, A; Rivetti, A; Kaplon, J

    2011-01-01

    The Gigatracker is a hybrid silicon pixel detector developed to track the highly intense NA62 hadron beam with a time resolution of 150 ps (rms). The beam spectrometer of the experiment is composed of three Gigatracker stations installed in vacuum in order to precisely measure momentum, time and direction of every traversing particle. Precise tracking demands a very low mass of the detector assembly (<0.5\\% X(O) per station) in order to limit multiple scattering and beam hadronic interactions. The high rate and especially the high timing precision requirements are very demanding: two R\\&D options are ongoing and the corresponding prototype read-out chips have been recently designed and produced in 0.13 mu m CMOS technology. One solution makes use of a constant fraction discriminator and on-pixel analogue-based time-to-digital-converter (TDC); the other comprises a delay-locked loop based TDC placed at the end of each pixel column and a time-over-threshold discriminator with time-walk correction techniq...

  13. Negative capacitance (impedance of the inductive type) of silicon p+-n junctions irradiated with fast electrons

    International Nuclear Information System (INIS)

    Poklonski, N. A.; Shpakovski, S. V.; Gorbachuk, N. I.; Lastovskii, S. B.

    2006-01-01

    Silicon p + -n junction diodes irradiated with 3.5-MeV electrons (with the dose of 4 x 10 16 cm -2 ) are studied. The diodes' inductance (L) was measured at a frequency f = 1 MHz with the amplitude of alternating current equal to 0.25 mA. Simultaneously with measurements of L at alternating current, a direct current was passed through the forward-biased diode, which brought about the injection of minority charge carriers into the base. In order to identify both of the mechanisms that give rise to the inductive-type impedance in irradiated diodes with the p + -n junction and the main radiation defects that are directly involved in the formation of this impedance, irradiated samples were annealed isochronously in the temperature range T a = 225-375 deg. C with sub-sequent study of the main characteristics of the defects by deep-level transient spectroscopy. It is shown that the inductive-type impedance in irradiated diodes is caused by the processes of capture and retention of charge carriers injected into the base at the trapping centers for a time ∼1/2f, i.e., for a half-period of oscillations. It is also shown that the trapping centers are the vacancy-oxygen complexes introduced by irradiation with electrons

  14. Dry followed by wet backside etching processes for micromachined endfire antennae

    Science.gov (United States)

    Saadaoui, M.; Pons, P.; Plana, R.; Bary, L.; Dubreuil, P.; Bourrier, D.; Vasilache, D.; Neculoiu, D.; Müller, A.

    2005-07-01

    This paper presents a novel technological process based on dry followed by wet backside silicon etching for the manufacturing of 'quasi-three edge' membranes-supported millimeter wave circuits. The process is based on a backside deep reactive ion etching used to remove the first 350 µm of silicon, followed by wet etching in KOH solution, to eliminate the remaining 50 µm of silicon and create quasi-free edge membranes, according to the undercut mechanism. In order to validate the technology, a Yagi-Uda antenna for 45 GHz was designed using the Zeland IE3D software package, and fabricated. The demonstrator was characterized in terms of return loss and isotropic gain using 'on wafer' measurements. The agreement between the modeling and the measurements is very good, and validates the new technological approach, which assures free-space propagation conditions for endfire membrane-supported antennae structures.

  15. Development of a silicon microstrip detector with single photon sensitivity for fast dynamic diffraction experiments at a synchrotron radiation beam

    Science.gov (United States)

    Arakcheev, A.; Aulchenko, V.; Kudashkin, D.; Shekhtman, L.; Tolochko, B.; Zhulanov, V.

    2017-06-01

    Time-resolved experiments on the diffraction of synchrotron radiation (SR) from crystalline materials provide information on the evolution of a material structure after a heat, electron beam or plasma interaction with a sample under study. Changes in the material structure happen within a microsecond scale and a detector with corresponding parameters is needed. The SR channel 8 of the VEPP-4M storage ring provides radiation from the 7-pole wiggler that allows to reach several tens photons within one μs from a tungsten crystal for the most intensive diffraction peak. In order to perform experiments that allow to measure the evolution of tungsten crystalline structure under the impact of powerful laser beam, a new detector is developed, that can provide information about the distribution of a scattered SR flux in space and its evolution in time at a microsecond scale. The detector is based on the silicon p-in-n microstrip sensor with DC-coupled metal strips. The sensor contains 1024 30 mm long strips with a 50 μm pitch. 64 strips are bonded to the front-end electronics based on APC128 ASICs. The APC128 ASIC contains 128 channels that consist of a low noise integrator with 32 analogue memory cells each. The integrator equivalent noise charge is about 2000 electrons and thus the signal from individual photons with energy above 40 keV can be observed. The signal can be stored at the analogue memory with 10 MHz rate. The first measurements with the beam scattered from a tungsten crystal with energy near 60 keV demonstrated the capability of this prototype to observe the spatial distribution of the photon flux with the intensity from below one photon per channel up to 0~10 photons per channel with a frame rate from 10 kHz up to 1 MHz.

  16. Positron annihilation lifetime in float-zone n-type silicon irradiated by fast electrons: a thermally stable vacancy defect

    Energy Technology Data Exchange (ETDEWEB)

    Arutyunov, Nikolay [Martin Luther University Halle, Department of Physics, von-Danckelmann-Platz 3, 06120 Halle (Germany); Ioffe Physico-Technical Institute, 194021 St. Petersburg (Russian Federation); Institute of Ion-Plasma and Laser Technologies (Institute of Electronics), 700170 Tashkent (Uzbekistan); Emtsev, Vadim; Oganesyan, Gagik [Ioffe Physico-Technical Institute, 194021 St. Petersburg (Russian Federation); Krause-Rehberg, Reinhard [Martin Luther University Halle, Department of Physics, von-Danckelmann-Platz 3, 06120 Halle (Germany); Elsayed, Mohamed [Martin Luther University Halle, Department of Physics, von-Danckelmann-Platz 3, 06120 Halle (Germany); Minia University, Faculty of Science, Physics Department, 61519 Minia (Egypt); Kozlovskii, Vitalii [St. Petersburg State Polytechnical University, 195251 St. Petersburg (Russian Federation)

    2016-12-15

    Temperature dependency of the average positron lifetime has been investigated for n-type float-zone silicon, n-FZ-Si(P), subjected to irradiation with 0.9 MeV electrons at RT. In the course of the isochronal annealing a new defect-related temperature-dependent pattern of the positron lifetime spectra has been revealed. Beyond the well known intervals of isochronal annealing of acceptor-like defects such as E-centers, divacancies and A-centers, the positron annihilation at the vacancy defects has been observed in the course of the isochronal annealing from ∝ 320 C up to the limit of reliable detecting of the defect-related positron annihilation lifetime at ≥ 500 C. These data correlate with the ones of recovery of the concentration of the charge carriers and their mobility which is found to continue in the course of annealing to ∝ 570 C; the annealing is accomplished at ∝650 C. A thermally stable complex consisting of the open vacancy volume and the phosphorus impurity atom, V{sub op}-P, is suggested as a possible candidate for interpreting the data obtained by the positron annihilation lifetime spectroscopy. An extended couple of semi-vacancies, 2V{sub s-ext}, as well as a relaxed inwards a couple of vacancies, 2V{sub inw}, are suggested as the open vacancy volume V{sub op} to be probed with the positron. It is argued that a high thermal stability of the V{sub s-ext} PV{sub s-ext} (or V{sub inw}PV{sub inw.}) configuration is contributed by the efficiency of PSi{sub 5} bonding. (copyright 2016 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  17. Etching technology for chromatography microchannels

    NARCIS (Netherlands)

    Tjerkstra, R.W.; de Boer, Meint J.; Berenschot, Johan W.; Gardeniers, Johannes G.E.; van den Berg, Albert; Elwenspoek, Michael Curt

    1997-01-01

    Half-circular channels, to be used for gas chromatography, were etched isotropically using a mixture of HF, HNO3 and H2O. Two wafers with half-circular channels were bonded on top of each other to yield channels with a circular cross-section. During etching the so-called `loading effect' was

  18. Silicon oxide nanoimprint stamp fabrication by edge lithography reinforced with silicon nitride

    NARCIS (Netherlands)

    Zhao, Yiping; Berenschot, Johan W.; de Boer, Meint J.; Jansen, Henricus V.; Tas, Niels Roelof; Huskens, Jurriaan; Elwenspoek, Michael Curt

    2007-01-01

    The fabrication of silicon oxide nanoimprint stamp employing edge lithography in combination with silicon nitride deposition is presented. The fabrication process is based on conventional photolithography an weg etching methods. Nanoridges with width dimension of sub-20 nm were fabricated by edge

  19. Etch bias inversion during EUV mask ARC etch

    Science.gov (United States)

    Lajn, Alexander; Rolff, Haiko; Wistrom, Richard

    2017-07-01

    The introduction of EUV lithography to high volume manufacturing is now within reach for 7nm technology node and beyond (1), at least for some steps. The scheduling is in transition from long to mid-term. Thus, all contributors need to focus their efforts on the production requirements. For the photo mask industry, these requirements include the control of defectivity, CD performance and lifetime of their masks. The mask CD performance including CD uniformity, CD targeting, and CD linearity/ resolution, is predominantly determined by the photo resist performance and by the litho and etch processes. State-of-the-art chemically amplified resists exhibit an asymmetric resolution for directly and indirectly written features, which usually results in a similarly asymmetric resolution performance on the mask. This resolution gap may reach as high as multiple tens of nanometers on the mask level in dependence of the chosen processes. Depending on the printing requirements of the wafer process, a reduction or even an increase of this gap may be required. A potential way of tuning via the etch process, is to control the lateral CD contribution during etch. Aside from process tuning knobs like pressure, RF powers and gases, which usually also affect CD linearity and CD uniformity, the simplest knob is the etch time itself. An increased over etch time results in an increased CD contribution in the normal case. , We found that the etch CD contribution of ARC layer etch on EUV photo masks is reduced by longer over etch times. Moreover, this effect can be demonstrated to be present for different etch chambers and photo resists.

  20. Ultra-low coupling loss fully-etched apodized grating coupler with bonded metal mirror

    DEFF Research Database (Denmark)

    Ding, Yunhong; Peucheret, Christophe; Ou, Haiyan

    2014-01-01

    A fully etched apodized grating coupler with bonded metal mirror is designed and demonstrated on the silicon-on-insulator platform, showing an ultra-low coupling loss of only 1.25 dB with 3 dB bandwidth of 69 nm.......A fully etched apodized grating coupler with bonded metal mirror is designed and demonstrated on the silicon-on-insulator platform, showing an ultra-low coupling loss of only 1.25 dB with 3 dB bandwidth of 69 nm....

  1. Transfer of Direct and Moiré Patterns by Reactive Ion Etching Through Ex Situ Fabricated Nanoporous Polymer Masks

    DEFF Research Database (Denmark)

    Shvets, Violetta; Hentschel, Thomas; Schulte, Lars

    2015-01-01

    hexagonal packing of 10 nm pores with a principal period of 20 nm. We demonstrate the transfer of the hexagonal pattern onto silicon by means of reactive ion etching through the masks. In addition, patterns elliptic and slit-like holes on silicon are obtained by utilizing masks cut at 45 degrees relative...

  2. Transparent conducting oxide layers for thin film silicon solar cells

    NARCIS (Netherlands)

    Rath, J.K.; Liu, Y.; de Jong, M.M.; de Wild, J.; Schuttauf, J.A.; Brinza, M.; Schropp, R.E.I.

    2009-01-01

    Texture etching of ZnO:1%Al layers using diluted HCl solution provides excellent TCOs with crater type surface features for the front contact of superstrate type of thin film silicon solar cells. The texture etched ZnO:Al definitely gives superior performance than Asahi SnO2:F TCO in case of

  3. Effect of Cl2- and HBr-based inductively coupled plasma etching on InP surface composition analyzed using in situ x-ray photoelectron spectroscopy

    International Nuclear Information System (INIS)

    Bouchoule, S.; Vallier, L.; Patriarche, G.; Chevolleau, T.; Cardinaud, C.

    2012-01-01

    A Cl 2 -HBr-O 2 /Ar inductively coupled plasma (ICP) etching process has been adapted for the processing of InP-based heterostructures in a 300-mm diameter CMOS etching tool. Smooth and anisotropic InP etching is obtained at moderate etch rate (∼600 nm/min). Ex situ x-ray energy dispersive analysis of the etched sidewalls shows that the etching anisotropy is obtained through a SiO x passivation mechanism. The stoichiometry of the etched surface is analyzed in situ using angle-resolved x-ray photoelectron spectroscopy. It is observed that Cl 2 -based ICP etching results in a significantly P-rich surface. The phosphorous layer identified on the top surface is estimated to be ∼1-1.3-nm thick. On the other hand InP etching in HBr/Ar plasma results in a more stoichiometric surface. In contrast to the etched sidewalls, the etched surface is free from oxides with negligible traces of silicon. Exposure to ambient air of the samples submitted to Cl 2 -based chemistry results in the complete oxidation of the P-rich top layer. It is concluded that a post-etch treatment or a pure HBr plasma step may be necessary after Cl 2 -based ICP etching for the recovery of the InP material.

  4. SOI silicon on glass for optical MEMS

    DEFF Research Database (Denmark)

    Larsen, Kristian Pontoppidan; Ravnkilde, Jan Tue; Hansen, Ole

    2003-01-01

    A newly developed fabrication method for fabrication of single crystalline Si (SCS) components on glass, utilizing Deep Reactive Ion Etching (DRIE) of a Silicon On Insulator (SOI) wafer is presented. The devices are packaged at wafer level in a glass-silicon-glass (GSG) stack by anodic bonding...... and a final sealing at the interconnects can be performed using a suitable polymer. Packaged MEMS on glass are advantageous within Optical MEMS and for sensitive capacitive devices. We report on experiences with bonding SOI to Pyrex. Uniform DRIE shallow and deep etching was achieved by a combination...... of an optimized device layout and an optimized process recipe. The behavior of the buried oxide membrane when used as an etch stop for the through-hole etch is described. No harmful buckling or fracture of the membrane is observed for an oxide thickness below 1 μm, but larger and more fragile released structures...

  5. Etching technology for chromatography microchannels

    OpenAIRE

    Tjerkstra, R.W.; de Boer, Meint J.; Berenschot, Johan W.; Gardeniers, Johannes G.E.; van den Berg, Albert; Elwenspoek, Michael Curt

    1997-01-01

    Half-circular channels, to be used for gas chromatography, were etched isotropically using a mixture of HF, HNO3 and H2O. Two wafers with half-circular channels were bonded on top of each other to yield channels with a circular cross-section. During etching the so-called `loading effect' was encountered: the etch rate depends on the local structure density. To solve this, extra structures were placed around the channels to create an equal structure density over the wafer and so prevent irregu...

  6. Characterization of deep wet etching of fused silica glass for single cell and optical sensor deposition

    International Nuclear Information System (INIS)

    Zhu, Haixin; Holl, Mark; Ray, Tathagata; Bhushan, Shivani; Meldrum, Deirdre R

    2009-01-01

    The development of a high-throughput single-cell metabolic rate monitoring system relies on the use of transparent substrate material for a single cell-trapping platform. The high optical transparency, high chemical resistance, improved surface quality and compatibility with the silicon micromachining process of fused silica make it very attractive and desirable for this application. In this paper, we report the results from the development and characterization of a hydrofluoric acid (HF) based deep wet-etch process on fused silica. The pin holes and notching defects of various single-coated masking layers during the etching are characterized and the most suitable masking materials are identified for different etch depths. The dependence of the average etch rate and surface roughness on the etch depth, impurity concentration and HF composition are also examined. The resulting undercut from the deep HF etch using various masking materials is also investigated. The developed and characterized process techniques have been successfully implemented in the fabrication of micro-well arrays for single cell trapping and sensor deposition. Up to 60 µm deep micro-wells have been etched in a fused silica substrate with over 90% process yield and repeatability. To our knowledge, such etch depth has never been achieved in a fused silica substrate by using a non-diluted HF etchant and a single-coated masking layer at room temperature

  7. Postoperative sensitivity of self etch versus total etch adhesive.

    Science.gov (United States)

    Yousaf, Ajmal; Aman, Nadia; Manzoor, Manzoor Ahmed; Shah, Jawad Ali; Dilrasheed

    2014-06-01

    To compare postoperative sensitivity following composite restoration placed in supra gingival class-V cavities using self etch adhesive and total etch adhesive. A randomized clinical trial. Operative Dentistry Department of Armed Forces Institute of Dentistry, Rawalpindi, from July to December 2009. A total of 70 patients having class-V supra gingival carious lesions were divided into two groups. Classes-V cavities not exceeding 3 mm were prepared. One treatment group was treated with self etch adhesive (adhe SE one Ivoclar) and the control group was treated with total-etch adhesive (Eco-Etch Ivoclar) after acid etching with 37% phosphoric acid. Light cured composite (Te-Econom Ivoclar) restoration was placed for both groups and evaluated for postoperative sensitivity immediately after restoration, after 24 hours and after one week. Data was recorded on visual analogue scale. Comparison of sensitivity between the two treatment groups on application cold stimulus after 24 hours of restoration showed significant difference; however, no statistically significant difference was observed at baseline, immediately after restoration and at 1 week follow-up with cold stimulus or compressed air application. Less postoperative sensitivity was observed at postoperative 24 hours assessment in restoration placed using SE adhesives compared to TE adhesives. Thus, the use of SE adhesives may be helpful in reducing postoperative sensitivity during 24 hours after restoration placement.

  8. Plasma etch technologies for the development of ultra-small feature size transistor devices

    International Nuclear Information System (INIS)

    Borah, D; Shaw, M T; Rasappa, S; Farrell, R A; O'Mahony, C; Faulkner, C M; Bosea, M; Gleeson, P; Holmes, J D; Morris, M A

    2011-01-01

    The advances in information and communication technologies have been largely predicated around the increases in computer processor power derived from the constant miniaturization (and consequent higher density) of individual transistors. Transistor design has been largely unchanged for many years and progress has been around scaling of the basic CMOS device. Scaling has been enabled by photolithography improvements (i.e. patterning) and secondary processing such as deposition, implantation, planarization, etc. Perhaps the most important of the secondary processes is the plasma etch methodology whereby the pattern created by lithography is 'transferred' to the surface via a selective etch to remove exposed material. However, plasma etch technologies face challenges as scaling continues. Maintaining absolute fidelity in pattern transfer at sub-16 nm dimensions will require advances in plasma technology (plasma sources, chamber design, etc) and chemistry (etch gases, flows, interactions with substrates, etc). In this paper, we illustrate some of these challenges by discussing the formation of ultra-small device structures from the directed self-assembly of block copolymers (BCPs) where nanopatterns are formed from the micro-phase separation of the system. The polymer pattern is transferred by a double etch procedure where one block is selectively removed and the remaining block acts as a resist pattern for silicon pattern transfer. Data are presented which shows that highly regular nanowire patterns of feature size below 20 nm can be created using etch optimization techniques and in this paper we demonstrate generation of crystalline silicon nanowire arrays with feature sizes below 8 nm. BCP techniques are demonstrated to be applicable from these ultra-small feature sizes to 40 nm dimensions. Etch profiles show rounding effects because etch selectivity in these nanoscale resist patterns is limited and the resist thickness rather low. The nanoscale nature of the

  9. Silicon microphotonic waveguides

    International Nuclear Information System (INIS)

    Ta'eed, V.; Steel, M.J.; Grillet, C.; Eggleton, B.; Du, J.; Glasscock, J.; Savvides, N.

    2004-01-01

    Full text: Silicon microphotonic devices have been drawing increasing attention in the past few years. The high index-difference between silicon and its oxide (Δn = 2) suggests a potential for high-density integration of optical functions on to a photonic chip. Additionally, it has been shown that silicon exhibits strong Raman nonlinearity, a necessary property as light interaction can occur only by means of nonlinearities in the propagation medium. The small dimensions of silicon waveguides require the design of efficient tapers to couple light to them. We have used the beam propagation method (RSoft BeamPROP) to understand the principles and design of an inverse-taper mode-converter as implemented in several recent papers. We report on progress in the design and fabrication of silicon-based waveguides. Preliminary work has been conducted by patterning silicon-on-insulator (SOI) wafers using optical lithography and reactive ion etching. Thus far, only rib waveguides have been designed, as single-mode ridge-waveguides are beyond the capabilities of conventional optical lithography. We have recently moved to electron beam lithography as the higher resolutions permitted will provide the flexibility to begin fabricating sub-micron waveguides

  10. Overview of atomic layer etching in the semiconductor industry

    International Nuclear Information System (INIS)

    Kanarik, Keren J.; Lill, Thorsten; Hudson, Eric A.; Sriraman, Saravanapriyan; Tan, Samantha; Marks, Jeffrey; Vahedi, Vahid; Gottscho, Richard A.

    2015-01-01

    Atomic layer etching (ALE) is a technique for removing thin layers of material using sequential reaction steps that are self-limiting. ALE has been studied in the laboratory for more than 25 years. Today, it is being driven by the semiconductor industry as an alternative to continuous etching and is viewed as an essential counterpart to atomic layer deposition. As we enter the era of atomic-scale dimensions, there is need to unify the ALE field through increased effectiveness of collaboration between academia and industry, and to help enable the transition from lab to fab. With this in mind, this article provides defining criteria for ALE, along with clarification of some of the terminology and assumptions of this field. To increase understanding of the process, the mechanistic understanding is described for the silicon ALE case study, including the advantages of plasma-assisted processing. A historical overview spanning more than 25 years is provided for silicon, as well as ALE studies on oxides, III–V compounds, and other materials. Together, these processes encompass a variety of implementations, all following the same ALE principles. While the focus is on directional etching, isotropic ALE is also included. As part of this review, the authors also address the role of power pulsing as a predecessor to ALE and examine the outlook of ALE in the manufacturing of advanced semiconductor devices

  11. A plasmaless, photochemical etch process for porous organosilicate glass films

    Science.gov (United States)

    Ryan, E. Todd; Molis, Steven E.

    2017-12-01

    A plasmaless, photochemical etch process using ultraviolet (UV) light in the presence of NH3 or O2 etched porous organosilicate glass films, also called pSiCOH films, in a two-step process. First, a UV/NH3 or UV/O2 treatment removed carbon (mostly methyl groups bonded to silicon) from a pSiCOH film by demethylation to a depth determined by the treatment exposure time. Second, aqueous HF was used to selectively remove the demethylated layer of the pSiCOH film leaving the methylated layer below. UV in the presence of inert gas or H2 did not demethylate the pSiCOH film. The depth of UV/NH3 demethylation followed diffusion limited kinetics and possible mechanisms of demethylation are presented. Unlike reactive plasma processes, which contain ions that can damage surrounding structures during nanofabrication, the photochemical etch contains no damaging ions. Feasibility of the photochemical etching was shown by comparing it to a plasma-based process to remove the pSiCOH dielectric from between Cu interconnect lines, which is a critical step during air gap fabrication. The findings also expand our understanding of UV photon interactions in pSiCOH films that may contribute to plasma-induced damage to pSiCOH films.

  12. Fast and pure

    Science.gov (United States)

    De Franceschi, Silvano

    2018-02-01

    Removing nuclear spins by means of isotopically purified silicon, and introducing magnetic field gradients by means of microfabricated ferromagnets yields electron spin qubits with enhanced fidelity and fast electrical control.

  13. Dry Ice Etches Terrain

    Science.gov (United States)

    2007-01-01

    [figure removed for brevity, see original site] Figure 1 Every year seasonal carbon dioxide ice, known to us as 'dry ice,' covers the poles of Mars. In the south polar region this ice is translucent, allowing sunlight to pass through and warm the surface below. The ice then sublimes (evaporates) from the bottom of the ice layer, and carves channels in the surface. The channels take on many forms. In the subimage shown here (figure 1) the gas from the dry ice has etched wide shallow channels. This region is relatively flat, which may be the reason these channels have a different morphology than the 'spiders' seen in more hummocky terrain. Observation Geometry Image PSP_003364_0945 was taken by the High Resolution Imaging Science Experiment (HiRISE) camera onboard the Mars Reconnaissance Orbiter spacecraft on 15-Apr-2007. The complete image is centered at -85.4 degrees latitude, 104.0 degrees East longitude. The range to the target site was 251.5 km (157.2 miles). At this distance the image scale is 25.2 cm/pixel (with 1 x 1 binning) so objects 75 cm across are resolved. The image shown here has been map-projected to 25 cm/pixel . The image was taken at a local Mars time of 06:57 PM and the scene is illuminated from the west with a solar incidence angle of 75 degrees, thus the sun was about 15 degrees above the horizon. At a solar longitude of 219.6 degrees, the season on Mars is Northern Autumn.

  14. Ultra-High-Efficiency Apodized Grating Coupler Using a Fully Etched Photonic Crystal

    DEFF Research Database (Denmark)

    Ding, Yunhong; Peucheret, Christophe; Ou, Haiyan

    2013-01-01

    We demonstrate an apodized fiber-to-chip grating coupler using fully etched photonic crystal holes on the silicon-on-insulator platform. An ultra-high coupling efficiency of 1.65 dB (68%) with 3 dB bandwidth of 60 nm is experimentally demonstrated....

  15. Effect of chlorhexidine on the shear bond strength of self-etch ...

    African Journals Online (AJOL)

    The aim of this study was to investigate the effect of chlorhexidine on shear bond strength of self-etch adhesives to dentin. The crowns of 60 sound human premolars were horizontally sectioned to expose the coronal dentin. Dentin surfaces were polished with 320 grit silicon carbide papers, and were randomly divided into 4 ...

  16. Selective SiO2 etching in three dimensional structures using parylene-C as mask

    NARCIS (Netherlands)

    Veltkamp, Henk-Willem; Zhao, Yiyuan; de Boer, Meint J.; Wiegerink, Remco J.; Lötters, Joost Conrad

    2017-01-01

    This abstract describes an application of an easy and straightforward method for selective SiO2 etching in three dimensional structures, which is developed by our group. The application in this abstract is the protection of the buried-oxide (BOX) layer of a silicon-on-insulator (SOI) wafer against

  17. High electronegativity multi-dipolar electron cyclotron resonance plasma source for etching by negative ions

    DEFF Research Database (Denmark)

    Stamate, Eugen; Draghici, M.

    2012-01-01

    A large area plasma source based on 12 multi-dipolar ECR plasma cells arranged in a 3 x 4 matrix configuration was built and optimized for silicon etching by negative ions. The density ratio of negative ions to electrons has exceeded 300 in Ar/SF6 gas mixture when a magnetic filter was used...

  18. Above 700 V superjunction MOSFETs fabricated by deep trench etching and epitaxial growth

    International Nuclear Information System (INIS)

    Li Zehong; Ren Min; Zhang Bo; Ma Jun; Hu Tao; Zhang Shuai; Wang Fei; Chen Jian

    2010-01-01

    Silicon superjunction power MOSFETs were fabricated with deep trench etching and epitaxial growth, based on the process platform of the Shanghai Hua Hong NEC Electronics Company Limited. The breakdown voltages of the fabricated superjunction MOSFETs are above 700 V and agree with the simulation. The dynamic characteristics, especially reverse diode characteristics, are equivalent or even superior to foreign counterparts. (semiconductor devices)

  19. Low temperature sacrificial wafer bonding for planarization after very deep etching

    NARCIS (Netherlands)

    Spiering, V.L.; Spiering, V.L.; Berenschot, Johan W.; Elwenspoek, Michael Curt; Fluitman, J.H.J.

    1994-01-01

    A new technique, at temperatures of 150°C or 450°C, that provides planarization after a very deep etching step in silicon is presented. Resist spinning and layer patterning as well as realization of bridges or cantilevers across deep holes becomes possible. The sacrificial wafer bonding technique

  20. Low-loss, submicron chalcogenide integrated photonics with chlorine plasma etching

    International Nuclear Information System (INIS)

    Chiles, Jeff; Malinowski, Marcin; Rao, Ashutosh; Novak, Spencer; Richardson, Kathleen; Fathpour, Sasan

    2015-01-01

    A chlorine plasma etching-based method for the fabrication of high-performance chalcogenide-based integrated photonics on silicon substrates is presented. By optimizing the etching conditions, chlorine plasma is employed to produce extremely low-roughness etched sidewalls on waveguides with minimal penalty to propagation loss. Using this fabrication method, microring resonators with record-high intrinsic Q-factors as high as 450 000 and a corresponding propagation loss as low as 0.42 dB/cm are demonstrated in submicron chalcogenide waveguides. Furthermore, the developed chlorine plasma etching process is utilized to demonstrate fiber-to-waveguide grating couplers in chalcogenide photonics with high power coupling efficiency of 37% for transverse-electric polarized modes

  1. Self-aligned mask renewal for anisotropically etched circular micro- and nanostructures

    International Nuclear Information System (INIS)

    Kaspar, Peter; Jäckel, Heinz; Holzapfel, Sebastian; Windhab, Erich J

    2011-01-01

    The top–down fabrication of high aspect ratio circular micro- and nanostructures in silicon nitride is presented. A new method is introduced to increase the aspect ratio of anisotropically etched holes by a factor of more than two with respect to the results obtained from an established dry-etching process. The method is based on the renewal of an etching mask after a first etching step has been completed. Mask renewal is done by line-of-sight deposition of a masking layer on the surface of the sample, which is mounted at an angle with respect to the deposition direction. No additional alignment step is required. The proof of principle is performed for silicon nitride etching through a mask of titanium, but the method has great potential to be applicable to a wide variety of substrate–mask combinations and to find entrance into various engineering fields. Two specific applications are highlighted. Firstly, a thick silicon nitride hardmask is used for the fabrication of deeply etched photonic crystal holes in indium phosphide (InP). For holes of 280 nm diameter, a record aspect ratio of 20 and an overall selectivity of 28.5 between a positive-tone resist layer and InP are reported. Secondly, the use of perforated silicon nitride membranes for droplet formation for applications in food engineering or pharmaceutics is addressed. Preliminary results show a potential for the self-aligned mask renewal method to exceed state-of-the-art membrane quality in terms of pore size, aspect ratio and membrane stability.

  2. Simplified fast neutron dosimeter

    International Nuclear Information System (INIS)

    Sohrabi, M.

    1979-01-01

    Direct fast-neutron-induced recoil and alpha particle tracks in polycarbonate films may be enlarged for direct visual observation and automated counting procedures employing electrochemical etching techniques. Electrochemical etching is, for example, carried out in a 28% KOH solution at room temperature by applying a 2000 V peak-to-peak voltage at 1 kHz frequency. Such recoil particle amplification can be used for the detection of wide neutron dose ranges from 1 mrad to 1000 rads or higher, if desired. 5 claims

  3. Investigation of porous silicon nanopowders functionalized by antibiotic Kanamycin, fluorophore Indocyanine Green

    Science.gov (United States)

    Bespalova, K.; Somov, P. A.; Spivak, Yu M.

    2017-11-01

    Porous silicon nanopowders for target drug delivery were obtained by electrochemical anodic etching in a hydrofluoric acid solution using the monocrystalline silicon n-type conductivity. Porous silicon powders were obtained by sonification of porous silicon layers. The powders were functionalized by antibiotic Kanamycin and fluorophore Indocyanine Green by the passive adsorption method. The peculiarities of absorption spectra in 190-600 nm region were revealed for functionalized porous silicon powders dispersions in water.

  4. Black silicon maskless templates for carbon nanotube forests

    DEFF Research Database (Denmark)

    Wierzbicki, Rafal; Schmidt, Michael Stenbæk; Boisen, Anja

    2013-01-01

    We present here a proof of concept for a novel fabrication method of vertically aligned carbon nanotube forests, utilizing black silicon nanograss (a forest of silicon nanometer-sized spikes created with reactive ion etching) coated with titanium tungsten diffusion barrier as a template. The method...

  5. Surface texturing of crystalline silicon and effective area measurement

    Science.gov (United States)

    Sun, Tietun; Chen, Dong; Chui, Rongqiang

    2000-11-01

    In this paper, the surface area of solar cell is determined by the capacitance measurements of MOS structure. The texture etching technology can be controlled according to the change of silicon surface area, furthermore, the textured silicon surface and interface characteristic of solar cell can be studied by measuring the relationship of capacitance and voltage for MOS structure.

  6. DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process

    DEFF Research Database (Denmark)

    Chang, Bingdong; Leussink, Pele; Jensen, Flemming

    2018-01-01

    The quest to sculpture materials as small and deep as possible is an ongoing topic in micro- and nanofabrication. For this, the Bosch process has been widely used to achieve anisotropic silicon microstructures with high aspect ratio. Reactive ion etching (RIE) lag is a phenomenon in which etch ra...... periodic sidewall shaping. e.g., a sausage-chain-like feature is demonstrated with an almost perfect periodicity....

  7. Laser etching as an alternative

    International Nuclear Information System (INIS)

    Dreyfus, R.W.; Kelly, R.

    1989-01-01

    Atoms and molecules are removed from surfaces by intense laser beams. This fact has been known almost since the discovery of the laser. Within the present overall area of interest, namely understanding ion-beam-induced sputtering, it is equally important both to contrast laser etching to ion sputtering and to understand the underlying physics taking place during laser etching. Beyond some initial broad observations, the specific discussion is limited to, and aimed at, two areas: (i) short wavelength, UV, laser-pulse effects and (ii) energy fluences sufficiently small that only monolayers (and not microns) of material are removed per pulse. 38 refs.; 13 figs.; 5 tabs

  8. A micromachined silicon valve driven by a miniature bi-stable electro-magnetic actuator

    NARCIS (Netherlands)

    Bohm, S.; Burger, G.J.; Burger, G.J.; Korthorst, M.T.; Roseboom, F.

    2000-01-01

    In this paper a novel combination of a micromachined silicon valve with low dead volume and a bi-stable electromagnetic actuator produced by conventional machining is presented. The silicon valve part, 7×7×1 mm3 in dimensions, is a sandwich construction of two KOH etched silicon wafers with a layer

  9. Nanopore fabrication in silicon oxynitride membranes by heating Au-particles

    NARCIS (Netherlands)

    de Vreede, Lennart; Schmidt Muniz, M.; van den Berg, Albert; Eijkel, Jan C.T.

    2016-01-01

    We report the fabrication of nanopores in a silicon oxynitride (SiON) membrane by heating a silicon rich-silicon nitride (SiRN) membrane with a gold nanoparticle array deposited on its surface. The gold nanoparticle array was realized by photolithography and the membrane by wet-etching. The entire

  10. Electroless porous silicon formation applied to fabrication of boron-silica-glass cantilevers

    DEFF Research Database (Denmark)

    Teva, Jordi; Davis, Zachary James; Hansen, Ole

    2010-01-01

    This work describes the characterization and optimization of anisotropic formation of porous silicon in large volumes (0.5-1 mm3) of silicon by an electroless wet etching technique. The main goal is to use porous silicon as a sacrificial volume for bulk micromachining processes, especially in cas...

  11. Anisotropic etching of p-Si in HF solution

    International Nuclear Information System (INIS)

    Outemzabet, R.; Benzekour, N.; Gabouze, N.; Kesri, N.; Ait-Hamouda, K.

    2003-01-01

    In situ electrochemical attenuated total reflection Fourier transform infrared spectroscopy has been used to study the etching process on a Si (100), (110) and (111) surface in dilute HF solution. On the other hand I-V characteristic of the p-Si-HF system was used for the interface reactions and kinetics study. Infrared results show that monohydride (SiH) and hydroxyl (Si-OH) species surface concentration depend on the applied potential to the electrode. I-V characteristics show a relative variation in magnitude of the first peak as the substrate orientation is changed. A mechanism of silicon dissolution is proposed (Authors)

  12. Fabrication of thin vertical mirrors through plasma etch and KOH:IPA polishing for integration into MEMS electrostatic actuators

    Science.gov (United States)

    Huda, M. Q.; Amin, T. M. F.; Ning, Y.; McKinnon, G.; Tulip, J.; Jäger, W.

    2013-03-01

    We developed a process for the fabrication of thin vertical mirrors as integrated structures of MEMS electrostatic actuators. The mirrors can be implemented as a vertical extension of the actuator sidewall, or can be positioned at any movable part of the actuator. The process involves the fabrication of a mesa structure on the handle layer of a silicon-oninsulator (SOI) wafer through deep reactive ion etching (DRIE). The etch/passivation cycles of the DRIE process were optimized to achieve vertical etch profiles with a depth of up to 200 μm with an aspect ratio of 10:1. The DRIE process introduced typical etch scallops with peak-to-valley and rms roughnesses on the order of 100 nm and 30 nm, respectively. A mask layer was used to pattern a 2.1 μm sacrificial oxide layer for the mesa structure. A second mask layer allowed us to define a large etch cavity for handle layer back-etch. The DRIE etched mesa structure was then etched with diluted potassium hydroxide (KOH) in isopropyl alcohol (IPA). Temperature and etch concentration were optimized for the removal of etch scallops without the formation of etch facets. The etch scallops were almost completely removed and mirror quality surfaces were achieved. The developed mesa structures are suitable for integration into actuators that are patterned in the device layer. A third masking layer, aligned through infrared camera, was used to position the thin vertical mirror at the actuator sidewall. The process provides design flexibility in integrating vertical mirrors of adjustable dimensions to movable elements of MEMS structures.

  13. Comparative Evaluation of the Etching Pattern of Er,Cr:YSGG & Acid Etching on Extracted Human Teeth-An ESEM Analysis

    Science.gov (United States)

    Mazumdar, Dibyendu; Ranjan, Shashi; Krishna, Naveen Kumar; Kole, Ravindra; Singh, Priyankar; Lakiang, Deirimika; Jayam, Chiranjeevi

    2016-01-01

    Introduction Etching of enamel and dentin surfaces increases the surface area of the substrate for better bonding of the tooth colored restorative materials. Acid etching is the most commonly used method. Recently, hard tissue lasers have been used for this purpose. Aim The aim of the present study was to evaluate and compare the etching pattern of Er,Cr:YSGG and conventional etching on extracted human enamel and dentin specimens. Materials and Methods Total 40 extracted non-diseased teeth were selected, 20 anterior and 20 posterior teeth each for enamel and dentin specimens respectively. The sectioned samples were polished by 400 grit Silicon Carbide (SiC) paper to a thickness of 1.0 ± 0.5 mm. The enamel and dentin specimens were grouped as: GrE1 & GrD1 as control specimens, GrE2 & GrD2 were acid etched and GrE3 & GrD3 were lased. Acid etching was done using Conditioner 36 (37 % phosphoric acid) according to manufacturer instructions. Laser etching was done using Er,Cr:YSGG (Erbium, Chromium : Ytrium Scandium Gallium Garnet) at power settings of 3W, air 70% and water 20%. After surface treatment with assigned agents the specimens were analyzed under ESEM (Environmental Scanning Electron Microscope) at X1000 and X5000 magnification. Results Chi Square and Student “t” statistical analysis was used to compare smear layer removal and etching patterns between GrE2-GrE3. GrD2 and GrD3 were compared for smear layer removal and diameter of dentinal tubule opening using the same statistical analysis. Chi-square test for removal of smear layer in any of the treated surfaces i.e., GrE2-E3 and GrD2-D3 did not differ significantly (p>0.05). While GrE2 showed predominantly type I etching pattern (Chi-square=2.78, 0.050.10) and GrE3 showed type III etching (Chi-square=4.50, p<0.05). The tubule diameters were measured using GSA (Gesellschaft fur Softwareentwicklung und Analytik, Germany) image analyzer and the ‘t’ value of student ‘t’ test was 18.10 which was a

  14. Dry technologies for the production of crystalline silicon solar cells; Trockentechnologien zur Herstellung von kristallinen Siliziumsolarzellen

    Energy Technology Data Exchange (ETDEWEB)

    Rentsch, J.

    2005-04-15

    Within this work, dynamic plasma etching technologies for the industrial production of crystalline silicon solar cells has been investigated. The research activity can be separated into three major steps: the characterisation of the etching behaviour of a newly developed dynamic plasma etching system, the development and analysis of dry etching processes for solar cell production and the determination of the ecological and economical impacts of such a new technology compared to standard up to date technologies. The characterisation of the etching behaviour has been carried out for two different etching sources, a low frequency (110 kHz) and a microwave (2.45 GHz) plasma source. The parameter of interest was the delivered ion energy of each source mainly determining the reachable etch rate. The etch rate turned out to be the main most critical parameter concerning the reachable wafer throughput per hour. Other points of interest in characterisation of the etching system were the material of the transport carriers, the silicon load as well as the process temperatures. The development of different dry etching processes targets the design of a complete dry production process for crystalline silicon solar cells. Therefore etching processes for saw damage removal, texturing, edge isolation as well as etching of dielectric layers have been developed and optimised. The major benefits of a complete dry production process would be the reduction of handling steps in between process steps and therefore offers a large cost reduction potential. For multicrystalline silicon solar cells a cost reduction potential of 5 % compared to a standard wet chemical based reference process could be realized only including the dry etching of a phosphorus silicate glass layer after diffusion. Further reduction potential offers the implementation of a dry texturing process due to a significant efficiency increase. (orig.)

  15. Silicon-based metallic micro grid for electron field emission

    International Nuclear Information System (INIS)

    Kim, Jaehong; Jeon, Seok-Gy; Kim, Jung-Il; Kim, Geun-Ju; Heo, Duchang; Shin, Dong Hoon; Sun, Yuning; Lee, Cheol Jin

    2012-01-01

    A micro-scale metal grid based on a silicon frame for application to electron field emission devices is introduced and experimentally demonstrated. A silicon lattice containing aperture holes with an area of 80 × 80 µm 2 and a thickness of 10 µm is precisely manufactured by dry etching the silicon on one side of a double-polished silicon wafer and by wet etching the opposite side. Because a silicon lattice is more rigid than a pure metal lattice, a thin layer of Au/Ti deposited on the silicon lattice for voltage application can be more resistant to the geometric stress caused by the applied electric field. The micro-fabrication process, the images of the fabricated grid with 88% geometric transparency and the surface profile measurement after thermal feasibility testing up to 700 °C are presented. (paper)

  16. Silicone metalization

    Energy Technology Data Exchange (ETDEWEB)

    Maghribi, Mariam N. (Livermore, CA); Krulevitch, Peter (Pleasanton, CA); Hamilton, Julie (Tracy, CA)

    2008-12-09

    A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal features on the silicone body that provide an electronic device.

  17. A String Model Etching Algorithm

    Science.gov (United States)

    1979-10-18

    simulator, and especially to T. Van Duzer , who has provided continuous encouragement, suggestions, and computer funds. References [1] A.R...Neureuther, R.E. Jewett, P.I. Hagouel and T. Van Duzer , "Surface Etching Simula- tion and Applications in IC Processing", Kodak Microelectronics Seminar

  18. Streamlined cryogenic deep reactive ion etching protocol for hybrid micronozzle arrays

    Science.gov (United States)

    Erten, Ahmet; Makale, Milan; Lu, Xuekun; Fruhberger, Bernd; Kesari, Santosh; Esener, Sadik

    2011-10-01

    This paper describes a novel fabrication methodology for hybrid micronozzle arrays that markedly streamlines and simplifies process flow for cryogenic deep reactive ion etching (DRIE). Cryogenic DRIE utilizes SF6/O2-based high-density plasmas at cryogenic temperatures. A key innovation that we have developed and tested is the application of SU-8 negative resist as both the cryogenic etch mask, replacing hard masks, and as a means of defining micronozzle orifices. First, a thin layer of SU-8 is spun onto one side of the silicon wafer and is patterned to define the micronozzle exit orifices. Then a thick layer of SU-8 is spun onto the backside of wafer, aligned to the micro-patterns of the thin layer of SU-8 and is patterned to act as etch mask and define the micronozzle inlets. These parallel SU-8 coatings on the wafer simplify and shorten the fabrication process by eliminating multiple etching steps and mitigate common problems associated with wafer-wide etching rate non-uniformities and RIE lag. The potential benefits of the rapid cryogenic DRIE micronozzle array fabrication strategy include (1) accelerated throughput of micronozzle array fabrication, (2) enhanced feasibility of fabricating comparatively more complex and/or novel hybrid structures and (3) potential simplification of other through-silicon microfabrication processes.

  19. Optical properties of nano-silicon

    Indian Academy of Sciences (India)

    Unknown

    light-emitting films have been made applying various tech- niques such as sputtering, plasma processing and anodic etching. Morisaki et al (1991) reported the visible light luminescence from some other form of Si nanostructures such as Si ultrafine particles deposited by evaporation of silicon powders in an Ar atmosphere.

  20. Micromachining of buried micro channels in silicon

    NARCIS (Netherlands)

    de Boer, Meint J.; Tjerkstra, R.W.; Berenschot, Johan W.; Jansen, Henricus V.; Burger, G.J.; Burger, G.J.; Gardeniers, Johannes G.E.; Elwenspoek, Michael Curt; van den Berg, Albert

    A new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented in this paper. The micro structures are constructed by trench etching, coating of the

  1. Battery, especially for portable devices, has an anode containing silicon

    OpenAIRE

    Kan, S.Y.

    2002-01-01

    The anode (2) contains silicon. A battery with a silicon-containing anode is claimed. An Independent claim is also included for a method used to make the battery, comprising the doping of a silicon substrate (1) with charge capacity-increasing material (preferably boron, phosphorous or arsenic), etching the doped substrate layer in order to increase its porosity, and applying a cathode (3) in the form of a lithium oxide compound onto the resulting anode and applying an electrolyte (4) to the ...

  2. Lifetime of Nano-Structured Black Silicon for Photovoltaic Applications

    DEFF Research Database (Denmark)

    Plakhotnyuk, Maksym; Davidsen, Rasmus Schmidt; Schmidt, Michael Stenbæk

    2016-01-01

    properties. We applied reactive ion etching technology at -20ºC to create nano-structures on silicon samples and obtained an average reflectance below 0.5%. For passivation purposes, we used 37 nm ALD Al2O3 films. Lifetime measurements resulted in 1220 µs and to 4170 µs for p- and ntype CZ silicon wafers......, respectively. This is promising for use of black silicon RIE nano-structuring in a solar cell process flow...

  3. The effects of pre-etching time on the characteristic responses of electrochemically etched CR-39 neutron dosimeters

    International Nuclear Information System (INIS)

    Sohrabi, M.; Khoshnoodi, M.

    1986-01-01

    The effects of pre-etching time (PET) or duration of etching of fast-neutron-induced-recoil tracks in CR-39 in 6N KOH at 60 0 C on electrochemical etching neutron characteristic responses; i.e. sensitivity and mean recoil track diameter (MRTD) versus KOH normality up to 18N are investigated in this paper. Six sets of responses for PETs of 0, 1, 2, 3, 4, and 5 hours were obtained by using our new multi-chamber ECE (MCECE) system which reduced total operation time to about 6% of the time usually required when single-chamber ECE systems are used. The sensitivity response for zero PET showed a broad plateau and a high sensitivity low-LET peak around 16N. By increasing PET, another peak was also developed around 5N leading to 'double-humped' responses with two maximums around 5N and 16N, and a minimum around 11N. On the other hand, the MRTD responses for all PETs studied showed the same general trend with maximums around 11N. In this paper, shape of tracks under different conditions are also investigated, new optimum conditions such as KOH concentrations of 5, 11, and 15N at 25 0 C, with or without pre-etching, are recommended for tracks of lower-LET recoils including possibly protons, and alpha particle tracks over a broad energy range, and the efficiency of the MCECE system is also demonstrated. (author)

  4. Three-dimensional photonic crystals created by single-step multi-directional plasma etching.

    Science.gov (United States)

    Suzuki, Katsuyoshi; Kitano, Keisuke; Ishizaki, Kenji; Noda, Susumu

    2014-07-14

    We fabricate 3D photonic nanostructures by simultaneous multi-directional plasma etching. This simple and flexible method is enabled by controlling the ion-sheath in reactive-ion-etching equipment. We realize 3D photonic crystals on single-crystalline silicon wafers and show high reflectance (>95%) and low transmittance (photonic bandgap. Moreover, our method simply demonstrates Si-based 3D photonic crystals that show the photonic bandgap effect in a shorter wavelength range around 0.6 μm, where further fine structures are required.

  5. Dry etching of polydimethylsiloxane using microwave plasma

    Science.gov (United States)

    Hwang, Sung Jin; Oh, Dong Joon; Jung, Phill Gu; Lee, Sang Min; Go, Jeung Sang; Kim, Joon-Ho; Hwang, Kyu-Youn; Ko, Jong Soo

    2009-09-01

    This paper presents a new polydimethylsiloxane (PDMS) dry-etching method that uses microwave plasma. The applicability of the method for fabricating microstructures and removing residual PDMS is also verified. The etch rate of PDMS was dominantly influenced by the gas flux ratio of CF4/O2 and the microwave power. While the PDMS etch rate increased as the flux ratio of CF4 was increased, the etch rate decreased as the flux ratio of O2 was increased. The maximum etch rate of 4.31 µm min-1 was achieved when mixing oxygen (O2) and tetrafluoromethane (CF4) at a 1:2 ratio at 800 W power. The PDMS etch rate almost linearly increased with the microwave power. The ratio of the vertical etch rate to the lateral etch rate was in a range of 1.14-1.64 and varied with the gas fluxes. In consideration of potential applications of the proposed PDMS etching method, array-type PDMS microwells and network-type microprotrusion structures were fabricated. The contact angle was dramatically increased from 104° (non-etched PDMS surface) to 148° (etched PDMS surface) and the surface was thereby modified to be superhydrophobic. In addition, a thin PDMS skin that blocked holes and PDMS residues affixed in nickel microstructures was successively removed.

  6. Methods of etching a substrate

    International Nuclear Information System (INIS)

    Cosmo, J.J.; Gambino, R.J.; Harper, J.M.E.

    1979-01-01

    The invention relates to a method of etching a substrate. The substrate is located opposite a target electrode in a vacuum chamber, and the surface of the target electrode is bombarded with energetic particles of atomic dimensions. The target electrode is an intermetallic composition (compound, alloy or finely divided homogeneous mixture) of two metals A and B such that upon bombardment the electrode emits negative ions of metal B which have sufficient energy to produce etching of the substrate. Many target materials are exemplified. Typically the metal A has an electronegativity XA and metal B has an electronegativity XB such that Xb - Xa is greater than about 2.55 electron volts, with the exception of combinations of metals having a fractional ionicity Q less than about 0.314. The source of the energetic particles may be an ionised gas in the vacuum chamber. The apparatus and its mode of operation are described in detail. (U.K.)

  7. Hybrid mask for deep etching

    KAUST Repository

    Ghoneim, Mohamed T.

    2017-08-10

    Deep reactive ion etching is essential for creating high aspect ratio micro-structures for microelectromechanical systems, sensors and actuators, and emerging flexible electronics. A novel hybrid dual soft/hard mask bilayer may be deposited during semiconductor manufacturing for deep reactive etches. Such a manufacturing process may include depositing a first mask material on a substrate; depositing a second mask material on the first mask material; depositing a third mask material on the second mask material; patterning the third mask material with a pattern corresponding to one or more trenches for transfer to the substrate; transferring the pattern from the third mask material to the second mask material; transferring the pattern from the second mask material to the first mask material; and/or transferring the pattern from the first mask material to the substrate.

  8. All-(111) surface silicon nanowire field effect transistor devices: Effects of surface preparations

    NARCIS (Netherlands)

    Masood, M.N.; Carlen, Edwin; van den Berg, Albert

    2014-01-01

    Etching/hydrogen termination of All-(111) surface silicon nanowire field effect (SiNW-FET) devices developed by conventional photolithography and plane dependent wet etchings is studied with X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), atomic force microscopy (AFM) and

  9. Ion energy distributions and sidewall profiles in reactive ion etching

    International Nuclear Information System (INIS)

    May, P.W.; Field, D.; Klemperer, D.F.; Song, Y.P.

    1993-01-01

    We present a brief resume of modelling of ion trajectories in radio frequency discharges of interest in reactive ion etching of semiconductors. The procedures for calculating the energies and angles at which ions strike the substrate surface are described. Examples of ion energy distributions (IEDs) and angular distributions (IADs) are given both for low pressure, collisionless-sheath plasmas, and for higher pressure conditions, where collisions significantly modify ion trajectories. Fast neutral particles formed in the sheath by collision processes are also considered. Computer modelling of the evolution of sidewall profiles during etch processes is discussed, and examples are given of profiles calculated using IED and IAD data both at low and high pressures. (orig.)

  10. Thermal history-based etching

    Science.gov (United States)

    Simpson, John T.

    2017-11-28

    A method for adjusting an etchability of a first borosilicate glass by heating the first borosilicate glass; combining the first borosilicate glass with a second borosilicate glass to form a composite; and etching the composite with an etchant. A material having a protrusive phase and a recessive phase, where the protrusive phase protrudes from the recessive phase to form a plurality of nanoscale surface features, and where the protrusive phase and the recessive phase have the same composition.

  11. A novel room temperature-induced chemical etching (RTCE) technique for the enlargement of fission tracks in Lexan polycarbonate SSNTD

    International Nuclear Information System (INIS)

    Chavan, Vivek; Kalsi, P.C.; Manchanda, V.K.

    2011-01-01

    The chemical or electrochemical etching is an essential step to enlarge the ion-induced latent tracks in solid state nuclear track detectors (SSNTDs). In these methods, above ambient temperatures (∼60 o C) and moderately high concentrations of alkali are required for about 1-2 h to enlarge the latent tracks. Microwave induced chemical etching method is reported to reduce the etching time for alpha tracks from 3 to 4 h to 25 min for CR-39 detector. In the present work, a room temperature-induced chemical etching employing ethanolamine as a new etchant has been investigated for the first time to enlarge the fission tracks in Lexan polycarbonate SSNTD. The tracks developed in the Lexan detectors etched at room temperature using ethanolamine are compared with those etched with routinely used chemical etching (CE) technique in 6 N NaOH at 60 o C. The bulk etch and track etch rates are also reported. The detection efficiency of RTCE method is determined and compared with that of CE method. The RTCE technique is found to be simple, fast and convenient.

  12. Influence of Pre-etching Times on Fatigue Strength of Self-etch Adhesives to Enamel.

    Science.gov (United States)

    Takamizawa, Toshiki; Barkmeier, Wayne W; Tsujimoto, Akimasa; Endo, Hajime; Tsuchiya, Kenji; Erickson, Robert L; Latta, Mark A; Miyazaki, Masashi

    To use shear bond strength (SBS) and shear fatigue strength (SFS) testing to determine the influence of phosphoric acid pre-etching times prior to application of self-etch adhesives on enamel bonding. Two single-step self-etch universal adhesives (Prime&Bond Elect and Scotchbond Universal), a conventional single-step self-etch adhesive (G-ӕnial Bond), and a conventional two-step self-etch adhesive (OptiBond XTR) were used. The SBS and SFS were obtained with phosphoric acid pre-etching for 3, 10, or 15 s prior to application of the adhesives, and without pre-etching (0 s) as a control. A staircase method was used to determine the SFS with 10 Hz frequency for 50,000 cycles or until failure occurred. The mean demineralization depth for each treated enamel surface was also measured using a profilometer. For all the adhesives, the groups with pre-etching showed significantly higher SBS and SFS than groups without pre-etching. However, there was no significant difference in SBS and SFS among groups with > 3 s of preetching. In addition, although the groups with pre-etching showed significantly deeper demineralization depths than groups without pre-etching, there was no significant difference in depth among groups with > 3 s of pre-etching. Three seconds of phosphoric acid pre-etching prior to application of self-etch adhesive can enhance enamel bonding effectiveness.

  13. Plasmoids for etching and deposition

    Science.gov (United States)

    Pothiraja, Ramasamy; Bibinov, Nikita; Awakowicz, Peter

    2014-11-01

    In this manuscript we show fascinating properties of plasmoids, which are known to be self-sustained plasma entities, and can exist without being in contact with any power supply. Plasmoids are produced in a filamentary discharge in a Ar/CH4 mixture with a high production rate of about 105 s-1. It is observed that plasmoids etch the solid amorphous hydrocarbon film with high efficiency. Energy density of the plasmoid, which is estimated on the basis of glowing area of plasmoids in the photographic image and sublimation enthalpy of the etched hydrocarbon film, amounts to about 90 J m-3. This value is much lower than the energy density of observed ball lightning (natural plasmoid). A very surprising property is an attraction between plasmoids, and the formation of plasmoid-groups. Because of this attractive force, carbon material, which is collected in plasmoids by etching of the hydrocarbon film or by propagation through a methane/argon gas mixture, is compressed into crystals.

  14. Black Silicon Solar Cells with Black Ribbons

    DEFF Research Database (Denmark)

    Davidsen, Rasmus Schmidt; Tang, Peter Torben; Mizushima, Io

    2016-01-01

    We present the combination of mask-less reactive ion etch (RIE) texturing and blackened interconnecting ribbons as a method for obtaining all-black solar panels, while using conventional, front-contacted solar cells. Black silicon made by mask-less reactive ion etching has total, average...... reflectance below 0.5% across a 156x156 mm2 silicon (Si) wafer. Black interconnecting ribbons were realized by oxidizing copper resulting in reflectance below 3% in the visible wavelength range. Screen-printed Si solar cells were realized on 156x156 mm2 black Si substrates with resulting efficiencies...... in the range 15.7-16.3%. The KOH-textured reference cell had an efficiency of 17.9%. The combination of black Si and black interconnecting ribbons may result in aesthetic, all-black panels based on conventional, front-contacted silicon solar cells....

  15. Silicon microreactors for measurements of catalytic activity

    DEFF Research Database (Denmark)

    Henriksen, Toke Riishøj

    . The aim of this study has been to determine appropriate dimensions for the reaction chamber in the microsystem. It has been found that 200μm diameter circular silicon pillars distributed in the chamber are effective in preventing cavity collapse in such grooves. In particular, the pillars allow anodic....... The reactors consist of a microchannel system etched in an oxidized silicon chip and sealed with a glass lid using anodic bonding. The chip design relies on a gas flow through the channel system and is designed for reactions at pressures at the order of 1 bar. A high sensitivity is obtained by directing...... the entire gas flow through the reaction zone to a mass spectrometer, thus ensuring that nearly all reaction products are present in the analyzed gas flow. An experimental study has been carried out of the conditions for cavity collapse during anodic bonding of wide, shallow grooves etched in silicon...

  16. Black Silicon Solar Cells with Black Ribbons

    DEFF Research Database (Denmark)

    Davidsen, Rasmus Schmidt; Tang, Peter Torben; Mizushima, Io

    2016-01-01

    We present the combination of mask-less reactive ion etch (RIE) texturing and blackened interconnecting ribbons as a method for obtaining all-black solar panels, while using conventional, front-contacted solar cells. Black silicon made by mask-less reactive ion etching has total, average...... in the range 15.7-16.3%. The KOH-textured reference cell had an efficiency of 17.9%. The combination of black Si and black interconnecting ribbons may result in aesthetic, all-black panels based on conventional, front-contacted silicon solar cells....... reflectance below 0.5% across a 156x156 mm2 silicon (Si) wafer. Black interconnecting ribbons were realized by oxidizing copper resulting in reflectance below 3% in the visible wavelength range. Screen-printed Si solar cells were realized on 156x156 mm2 black Si substrates with resulting efficiencies...

  17. Laboratory course on silicon sensors

    CERN Document Server

    Crescio, E; Roe, S; Rudge, A

    2003-01-01

    The laboratory course consisted of four different mini sessions, in order to give the student some hands-on experience on various aspects of silicon sensors and related integrated electronics. The four experiments were. 1. Characterisation of silicon diodes for particle detection 2. Study of noise performance of the Viking readout circuit 3. Study of the position resolution of a silicon microstrip sensor 4. Study of charge transport in silicon with a fast amplifier The data in the following were obtained during the ICFA school by the students.

  18. CF3+ etching silicon surface: A molecular dynamics study

    NARCIS (Netherlands)

    Zhao, C.; Lu, X.; He, P.; Zhang, P.; Sun, W.; Zhang, Jingwei; Chen, F.; Gou, F.

    2012-01-01

    In this study, a molecular dynamics simulation method has been employed to investigate CF3 + ions, bombarding Si surface with the energy of 100, 200, 300 and 400 eV and an incident angle of 45 degrees with respect to the normal. The simulation results show that when CF3+ ions approach the Si surface

  19. Fabrication of a high-temperature microreactor with integrated heater and sensor patterns on an ultrathin silicon membrane

    NARCIS (Netherlands)

    Tiggelaar, Roald M.; Berenschot, Johan W.; van Male, P.; Oosterbroek, R.E.; Gardeniers, Johannes G.E.; de Croon, M.H.J.M.; Schouten, J.C.; van den Berg, Albert; Elwenspoek, Michael Curt

    2005-01-01

    In this paper critical steps in the fabrication process of a microreactor for high-temperature catalytic partial oxidation gas phase reactions are evaluated. The microreactor contains a flow channel etched in silicon, capped with an ultrathin composite membrane consisting of silicon and silicon

  20. Silicon micromachining using a high-density plasma source

    International Nuclear Information System (INIS)

    McAuley, S.A.; Ashraf, H.; Atabo, L.; Chambers, A.; Hall, S.; Hopkins, J.; Nicholls, G.

    2001-01-01

    Dry etching of Si is critical in satisfying the demands of the micromachining industry. The micro-electro-mechanical systems (MEMS) community requires etches capable of high aspect ratios, vertical profiles, good feature size control and etch uniformity along with high throughput to satisfy production requirements. Surface technology systems' (STS's) high-density inductively coupled plasma (ICP) etch tool enables a wide range of applications to be realized whilst optimizing the above parameters. Components manufactured from Si using an STS ICP include accelerometers and gyroscopes for military, automotive and domestic applications. STS's advanced silicon etch (ASE TM ) has also allowed the first generation of MEMS-based optical switches and attenuators to reach the marketplace. In addition, a specialized application for fabricating the next generation photolithography exposure masks has been optimized for 200 mm diameter wafers, to depths of ∼750 μm. Where the profile is not critical, etch rates of greater than 8 μm min -1 have been realized to replace previous methods such as wet etching. This is also the case for printer applications. Specialized applications that require etching down to pyrex or oxide often result in the loss of feature size control at the interface; this is an industry wide problem. STS have developed a technique to address this. The rapid progression of the industry has led to development of the STS ICP etch tool, as well as the process. (author)

  1. Porosity-dependent fractal nature of the porous silicon surface

    Energy Technology Data Exchange (ETDEWEB)

    Rahmani, N.; Dariani, R. S., E-mail: dariani@alzahra.ac.ir [Department of Physics, Alzahra University, Tehran, 1993893973 (Iran, Islamic Republic of)

    2015-07-15

    Porous silicon films with porosity ranging from 42% to 77% were fabricated by electrochemical anodization under different current density. We used atomic force microscopy and dynamic scaling theory for deriving the surface roughness profile and processing the topography of the porous silicon layers, respectively. We first compared the topography of bare silicon surface with porous silicon and then studied the effect of the porosity of porous silicon films on their scaling behavior by using their self-affinity nature. Our work demonstrated that silicon compared to the porous silicon films has the highest Hurst parameter, indicating that the formation of porous layer due to the anodization etching of silicon surface leads to an increase of its roughness. Fractal analysis revealed that the evolution of the nanocrystallites’ fractal dimension along with porosity. Also, we found that both interface width and Hurst parameter are affected by the increase of porosity.

  2. Optimal Conditions for Fast Charging and Long Cycling Stability of Silicon Microwire Anodes for Lithium Ion Batteries, and Comparison with the Performance of Other Si Anode Concepts

    OpenAIRE

    Enrique Quiroga-González; Jürgen Carstensen; Helmut Föll

    2013-01-01

    Cycling tests under various conditions have been performed for lithium ion battery anodes made from free-standing silicon microwires embedded at one end in a copper current collector. Optimum charging/discharging conditions have been found for which the anode shows negligible fading (< 0.001%) over 80 cycles; an outstanding result for this kind of anodes. Several performance parameters of the anode have been compared to the ones of other Si anode concepts, showing that especially the capacity...

  3. Combining retraction edge lithography and plasma etching for arbitrary contour nanoridge fabrication

    Science.gov (United States)

    Zhao, Yiping; Jansen, Henri; de Boer, Meint; Berenschot, Erwin; Bouwes, Dominique; Gironès, Miriam; Huskens, Jurriaan; Tas, Niels

    2010-09-01

    Edge lithography in combination with fluorine-based plasma etching is employed to avoid the dependence on crystal orientation in single crystal silicon to create monolithic nanoridges with arbitrary contours. This is demonstrated by using a mask with circular structures and Si etching at cryogenic temperature with SF6+O2 plasma mixtures. Initially, the explored etch recipe was used with Cr as the masking material. Although nanoridges with perfect vertical sidewalls have been achieved, Cr causes severe sidewall roughness due to line edge roughness. Therefore, an SU-8 polymer is used instead. Although the SU-8 pattern definition needs further improvement, we demonstrate the possibility of fabricating Si nanoridges of arbitrary contours providing a width below 50 nm and a height between 25 and 500 nm with smooth surface finish. Artifacts in the ridge profile are observed and are mainly caused by the bird's beak phenomenon which is characteristic for the used LOCOS process.

  4. Luminescence and optical absorption determination in porous silicon

    International Nuclear Information System (INIS)

    Nogal, U.; Calderon, A.; Marin, E.; Rojas T, J. B.; Juarez, A. G.

    2012-10-01

    We applied the photoacoustic spectroscopy technique in order to obtain the optical absorption spectrum in porous silicon samples prepared by electrochemical anodic etching on n-type, phosphorous doped, (100)-oriented crystal-line silicon wafer with thickness of 300 μm and 1-5 ωcm resistivity. The porous layers were prepared with etching times of 13, 20, 30, 40 and 60 minutes. Also, we realized a comparison among the optical absorption spectrum with the photoluminescence and photo reflectance ones, both obtained at room temperature. Our results show that the absorption spectrum of the samples of porous silicon depends notably of the etching time an it consist of two distinguishable absorption bands, one in the Vis region and the other one in the UV region. (Author)

  5. An area selective and anisotropic etching of Si by synchrotron radiation excitation; Effects of introducing O[sub 2] molecules

    Energy Technology Data Exchange (ETDEWEB)

    Goto, Takashi; Kitamura, Osamu; Terakado, Shingo; Suzuki, Shigeo (Sanyo Electric Co., Ltd., Tsukuba, Ibaraki (Japan). Tsukuba Research Center); Tanaka, Kenichiro

    1992-12-01

    Single crystalline silicon was photochemically etched by synchrotron radiation (SR) in the presence of reactive species produced by microwave discharge. The etching gases were a mixture of SF[sub 6] and Ar. We attempted to introduce O[sub 2] gas in order to increase the area selectivity by protecting the nonirradiated area. It was found that the introduction of O[sub 2] molecules was very effective in depressing the etching of a nonirradiated area resulting in high area selectivity. Also an anisotropic feature of c-Si was obtained by addition of O[sub 2] molecules and submicron patterning was successfully performed using a stencil mask. The effect of O[sub 2] molecules was investigated by the measurement of the spectra of total electron yield and Auger electrons. It seems that the formation of an oxide layer on c-Si surface played an important role in the area-selective etching. (author).

  6. DREM: Infinite etch selectivity and optimized scallop size distribution with conventional photoresists in an adapted multiplexed Bosch DRIE process

    DEFF Research Database (Denmark)

    Chang, Bingdong; Leussink, Pele; Jensen, Flemming

    2018-01-01

    The quest to sculpture materials as small and deep as possible is an ongoing topic in micro- and nanofabrication. For this, the Bosch process has been widely used to achieve anisotropic silicon microstructures with high aspect ratio. Reactive ion etching (RIE) lag is a phenomenon in which etch rate...... depends on the opening areas of patterns, aspect ratio of the trenches and other geometrical factors. The lag not only gives a non-uniform distribution of scallop size, but it also sets a limit for the maximum achievable aspect ratio. The latter since the mask suffers from persistent erosion. While...... different kinds of hard masks have been suggested to ensure a longer total etch time, here we report a correctly tuned 3-steps Bosch process - called DREM (Deposit, Remove, Etch, Multistep) – without mask erosion. The erosion-free feature is independent of the type of mask. For example, an aspect ratio...

  7. Etching and ellipsometry studies on CL-VPE grown GaN epilayer

    Directory of Open Access Journals (Sweden)

    Puviarasu P.

    2017-02-01

    Full Text Available The surface morphological characteristics of wet chemical etched GaN layers grown at different temperatures on (0 0 0 1 sapphire substrates by Chloride-Vapor Phase Epitaxy (Cl-VPE have been studied using optical microscope. Significant surface morphology changes have been observed in correlation to the growth temperature and etching time. Also optical properties of the as grown and high-energy silicon (Si ion irradiated gallium nitride (GaN epilayers were studied using monochromatic ellipsometry. The effect of ion fluences on the refractive index of the GaN has been investigated and it has been found to decrease with an increase of ion fluence. This decrease is attributed to irradiation-induced defects and polycrystallization which plays an important role in determining the optical properties of silicon (Si ion irradiated GaN layers.

  8. Electron beam induced etching of carbon nanotubes enhanced by secondary electrons in oxygen

    Science.gov (United States)

    Yoshida, Hideto; Tomita, Yuto; Soma, Kentaro; Takeda, Seiji

    2017-05-01

    Multi-walled carbon nanotubes (CNTs) are subjected to electron-beam-induced etching (EBIE) in oxygen. The EBIE process is observed in situ by environmental transmission electron microscopy. The partial pressure of oxygen (10 and 100 Pa), energy of the primary electrons (80 and 200 keV), and environment of the CNTs (suspended or supported on a silicon nitride membrane) are investigated as factors affecting the etching rate. The EBIE rate of CNTs was markedly promoted by the effects of secondary electrons that were emitted from a silicon nitride membrane under irradiation by primary electrons. Membrane supported CNTs can be cut by EBIE with a spatial accuracy better than 3 nm, and a nanogap of 2 nm can be successfully achieved between the ends of two suspended CNTs.

  9. Porous Silicon for Chemical Sensors

    Science.gov (United States)

    Tsamis, C.; Nassiopoulou, A. G.

    In this work we highlight the advantages of using Porous Silicon (PS) as a material for chemical sensors. Two different applications of PS are investigated: (a) as a matrix for the inclusion of catalytic materials, such as Pd or Pt, and (b) as a material for the fabrication of suspended micro hotplates, for improved thermal isolation. For the first application, the catalytic behavior of Pd-doped PS samples is estimated and the parameters that influence the kinetics of the chemical reaction are evaluated. It is found that the catalytic activity of Pd-doped porous silicon is significantly higher than that of a planar surface covered with Pd. On the other hand, the effectiveness of PS for local thermal isolation on a silicon substrate is examined and the thermal properties of suspended porous silicon (PS) micro-hotplates are investigated. The micro-hotplates are fabricated by a novel technique, based on the isotropic etching of silicon under a PS layer, in a high density plasma reactor. Very high local temperatures on the micro-hotplates (higher than 600°C) with very low power consumption (only a few tens of mW) have been obtained, due to the very low thermal conductivity of PS, which is comparable to that of thermal oxide and it is much lower than that of silicon nitride, typically used for thermal sensor applications.

  10. Dry etching technologies for reflective multilayer

    Science.gov (United States)

    Iino, Yoshinori; Karyu, Makoto; Ita, Hirotsugu; Kase, Yoshihisa; Yoshimori, Tomoaki; Muto, Makoto; Nonaka, Mikio; Iwami, Munenori

    2012-11-01

    We have developed a highly integrated methodology for patterning Extreme Ultraviolet (EUV) mask, which has been highlighted for the lithography technique at the 14nm half-pitch generation and beyond. The EUV mask is characterized as a reflective-type mask which is completely different compared with conventional transparent-type of photo mask. And it requires not only patterning of absorber layer without damaging the underlying multi reflective layers (40 Si/Mo layers) but also etching multi reflective layers. In this case, the dry etch process has generally faced technical challenges such as the difficulties in CD control, etch damage to quartz substrate and low selectivity to the mask resist. Shibaura Mechatronics ARESTM mask etch system and its optimized etch process has already achieved the maximal etch performance at patterning two-layered absorber. And in this study, our process technologies of multi reflective layers will be evaluated by means of optimal combination of process gases and our optimized plasma produced by certain source power and bias power. When our ARES™ is used for multilayer etching, the user can choose to etch the absorber layer at the same time or etch only the multilayer.

  11. Development of Novel Al-Doped Zinc Oxide Films Fabricated on Etched Glass and Their Application to Solar Cells

    Science.gov (United States)

    Hongsingthong, Aswin; Aino, Akehiro; Sichanugrist, Porponth; Konagai, Makoto; Kuramochi, Hideto; Akiike, Ryo; Iigusa, Hitoshi; Utsumi, Kentaro; Shibutami, Tetsuo

    2012-10-01

    We have successfully developed novel aluminum-doped zinc oxide (AZO-X) films with a high haze ratio by the combined use of an etched glass substrate and wet-etched AZO-X films. The effects of the use of an etched glass substrate and wet-chemical etching on the properties of AZO-X films were investigated. The texture size and rms roughness of these films largely increased with glass surface roughening. Post-treatment using wet chemical etching slightly increased the texture size and rms roughness. The etched glass approach has been found to be a promising method for achieving an AZO-coated glass substrate with a high haze ratio. Using high-haze ratio AZO-X films as the front transparent conductive oxide (TCO) layers in solar cells, we improved the quantum efficiency (QE) of these solar cells particularly in the long-wavelength region. Thus, the AZO-X films deposited on etched glass have a high potential for use as front TCO layers in silicon-based thin-film solar cells.

  12. Design criteria for XeF2 enabled deterministic transformation of bulk silicon (100) into flexible silicon layer

    KAUST Repository

    Hussain, Aftab M.

    2016-07-15

    Isotropic etching of bulk silicon (100) using Xenon Difluoride (XeF2) gas presents a unique opportunity to undercut and release ultra-thin flexible silicon layers with pre-fabricated state-of-the-art Complementary Metal Oxide Semiconductor (CMOS) electronics. In this work, we present design criteria and mechanism with a comprehensive mathematical model for this method. We consider various trench geometries and parametrize important metrics such as etch time, number of cycles and area efficiency in terms of the trench diameter and spacing so that optimization can be done for specific applications. From our theoretical analysis, we conclude that a honeycomb-inspired hexagonal distribution of trenches can produce the most efficient release of ultra-thin flexible silicon layers in terms of the number of etch cycles, while a rectangular distribution of circular trenches provides the most area efficient design. The theoretical results are verified by fabricating and releasing (varying sizes) flexible silicon layers. We observe uniform translation of design criteria into practice for etch distances and number of etch cycles, using reaction efficiency as a fitting parameter.

  13. Optical properties of 3D macroporous silicon structures

    International Nuclear Information System (INIS)

    Garin, M.; Trifonov, T.; Rodriguez, A.; Marsal, L.F.; Alcubilla, R.

    2008-01-01

    We study the optical properties of three-dimensional (3D) microstructures fabricated by electrochemical etching of macroporous silicon with modulated pore diameter. Optical measurements along the pore axis reveal photonic band gaps which are also confirmed by calculations of photonic band dispersion. We investigate numerically and experimentally the evolution of these gaps as a function of pore diameter modulation. In addition, a subsequent anisotropic etching of macroporous silicon in alkaline solutions allows to achieve pores with new shapes of modulation. We compare the optical characteristics of 3D macroporous structures with and without such anisotropic treatment

  14. Formation of ultra Si/Ti nano thin film for enhancing silicon solar cell efficiency

    Science.gov (United States)

    Adam, T.; Dhahi, T. S.; Mohammed, M.; Al-Hajj, A. M.; Hashim, U.

    2017-10-01

    An alternative electrical source has l has become the major quest of every researchers due to it numerous advantages and applications of power supply and as electronic devices are becoming more and more portable. A highly efficient power supply is become inevitable. Thus. in this study, present ultrasonic based assisted fabrication of electrochemical silicon-Titanium nano thin film by in-house simple technique, uniformly silicon Nano film was fabricated and etched with HF (40%): C2H5OH (99%):1:1, < 20 nm pore diameter of silicon was fabricated. The surface and morphology reveal that the method produce uniform nano silicon porous layer with smaller silicon pores with high etching efficiency. The silicon-Titanium integrated nano porous exhibited excellent observation properties with low reflection index ~ 1.1 compared to silicon alone thin film.

  15. Recycling of silicon: from industrial waste to biocompatible nanoparticles for nanomedicine

    Science.gov (United States)

    Kozlov, N. K.; Natashina, U. A.; Tamarov, K. P.; Gongalsky, M. B.; Solovyev, V. V.; Kudryavtsev, A. A.; Sivakov, V.; Osminkina, L. A.

    2017-09-01

    The formation of photoluminescent porous silicon (PSi) nanoparticles (NPs) is usually based on an expensive semiconductor grade wafers technology. Here, we report a low-cost method of PSi NPs synthesis from the industrial silicon waste remained after the wafer production. The proposed method is based on metal-assisted wet-chemical etching (MACE) of the silicon surface of cm-sized metallurgical grade silicon stones which leads to a nanostructuring of the surface due to an anisotropic etching, with subsequent ultrasound fracturing in water. The obtained PSi NPs exhibit bright red room temperature photoluminescence (PL) and demonstrate similar microstructure and physical characteristics in comparison with the nanoparticles synthesized from semiconductor grade Si wafers. PSi NPs prepared from metallurgical grade silicon stones, similar to silicon NPs synthesized from high purity silicon wafer, show low toxicity to biological objects that open the possibility of using such type of NPs in nanomedicine.

  16. Photonic Crystal Sensors Based on Porous Silicon

    Directory of Open Access Journals (Sweden)

    Claudia Pacholski

    2013-04-01

    Full Text Available Porous silicon has been established as an excellent sensing platform for the optical detection of hazardous chemicals and biomolecular interactions such as DNA hybridization, antigen/antibody binding, and enzymatic reactions. Its porous nature provides a high surface area within a small volume, which can be easily controlled by changing the pore sizes. As the porosity and consequently the refractive index of an etched porous silicon layer depends on the electrochemial etching conditions photonic crystals composed of multilayered porous silicon films with well-resolved and narrow optical reflectivity features can easily be obtained. The prominent optical response of the photonic crystal decreases the detection limit and therefore increases the sensitivity of porous silicon sensors in comparison to sensors utilizing Fabry-Pérot based optical transduction. Development of porous silicon photonic crystal sensors which allow for the detection of analytes by the naked eye using a simple color change or the fabrication of stacked porous silicon photonic crystals showing two distinct optical features which can be utilized for the discrimination of analytes emphasize its high application potential.

  17. Photonic Crystal Sensors Based on Porous Silicon

    Science.gov (United States)

    Pacholski, Claudia

    2013-01-01

    Porous silicon has been established as an excellent sensing platform for the optical detection of hazardous chemicals and biomolecular interactions such as DNA hybridization, antigen/antibody binding, and enzymatic reactions. Its porous nature provides a high surface area within a small volume, which can be easily controlled by changing the pore sizes. As the porosity and consequently the refractive index of an etched porous silicon layer depends on the electrochemial etching conditions photonic crystals composed of multilayered porous silicon films with well-resolved and narrow optical reflectivity features can easily be obtained. The prominent optical response of the photonic crystal decreases the detection limit and therefore increases the sensitivity of porous silicon sensors in comparison to sensors utilizing Fabry-Pérot based optical transduction. Development of porous silicon photonic crystal sensors which allow for the detection of analytes by the naked eye using a simple color change or the fabrication of stacked porous silicon photonic crystals showing two distinct optical features which can be utilized for the discrimination of analytes emphasize its high application potential. PMID:23571671

  18. Quantitative Analysis of Defects in Silicon. [to predict energy conversion efficiency of silicon samples for solar cells

    Science.gov (United States)

    Natesh, R.; Smith, J. M.; Qidwai, H. A.; Bruce, T.

    1979-01-01

    The evaluation and prediction of the conversion efficiency for a variety of silicon samples with differences in structural defects, such as grain boundaries, twin boundaries, precipitate particles, dislocations, etc. are discussed. Quantitative characterization of these structural defects, which were revealed by etching the surface of silicon samples, is performed by using an image analyzer. Due to different crystal growth and fabrication techniques the various types of silicon contain a variety of trace impurity elements and structural defects. The two most important criteria in evaluating the various silicon types for solar cell applications are cost and conversion efficiency.

  19. Graphene-pyramid textured silicon heterojunction for sensitive near-infrared light photodiode

    Science.gov (United States)

    Wang, Li; Ren, Zhi-Fei; Wang, Kui-Yuan; He, Shu-Juan; Luo, Lin-Bao

    2017-04-01

    In this study, we report on the fabrication of a near-infrared (NIR) light photodiode, which was constructed by transferring monolayer graphene films onto pyramid textured silicon etched by an aqueous solution method. It is found that the photodiode exhibits an obvious rectification characteristic, with a rectification ratio as high as 1.5  ×  104. What is more, the as-fabricated graphene-pyramid textured silicon Schottky photodiode could function as an efficient light photodetector that was highly sensitive to NIR irradiation with a high on/off ratio, and good reproducibility. In addition, such an NIR photodiode is able to monitor a fast-switching optical signal with a frequency as high as 2000 Hz. The rise/fall times were estimated to be 96/160 µs, respectively, which are comparable to or even higher than other Si nanostructure-based devices. The generality of the above results implies that the present graphene-pyramid textured silicon Schottky photodiode would have possible potential for future optoelectronic device applications.

  20. Effects of Bias Pulsing on Etching of SiO2 Pattern in Capacitively-Coupled Plasmas for Nano-Scale Patterning of Multi-Level Hard Masks.

    Science.gov (United States)

    Kim, Sechan; Choi, Gyuhyun; Chae, Heeyeop; Lee, Nae-Eung

    2016-05-01

    In order to study the effects of bias pulsing on the etching characteristics of a silicon dioxide (SiO2) layer using multi-level hard mask (MLHM) structures of ArF photoresist/bottom anti-reflected coating/SiO2/amorphous carbon layer (ACL)/SiO2, the effects of bias pulsing conditions on the etch characteristics of a SiO2 layer with an ACL mask pattern in C4F8/CH2F2/O2/Ar etch chemistries were investigated in a dual-frequency capacitively-coupled plasma (CCP) etcher. The effects of the pulse frequency, duty ratio, and pulse-bias power in the 2 MHz low-frequency (LF) power source were investigated in plasmas generated by a 27.12 MHz high-frequency (HF) power source. The etch rates of ACL and SiO2 decreased, but the etch selectivity of SiO2/ACL increased with decreasing duty ratio. When the ACL and SiO2 layers were etched with increasing pulse frequency, no significant change was observed in the etch rates and etch selectivity. With increasing LF pulse-bias power, the etch rate of ACL and SiO2 slightly increased, but the etch selectivity of SiO2/ACL decreased. Also, the precise control of the critical dimension (CD) values with decreasing duty ratio can be explained by the protection of sidewall etching of SiO2 by increased passivation. Pulse-biased etching was successfully applied to the patterning of the nano-scale line and space of SiO2 using an ACL pattern.

  1. Effect of phosphoric acid etching on the shear bond strength of two self-etch adhesives

    Science.gov (United States)

    SABATINI, Camila

    2013-01-01

    Objective: To evaluate the effect of optional phosphoric acid etching on the shear bond strength (SBS) of two self-etch adhesives to enamel and dentin. Material and Methods: Ninety-six bovine mandibular incisors were ground flat to obtain enamel and dentin substrates. A two-step self-etch adhesive (FL-Bond II) and a one-step self-etch adhesive (BeautiBond) were applied with and without a preliminary acid etching to both the enamel and dentin. The specimens were equally and randomly assigned to 4 groups per substrate (n=12) as follows: FL-Bond II etched; FL-Bond II un-etched; BeautiBond etched; BeautiBond un-etched. Composite cylinders (Filtek Z100) were bonded onto the treated tooth structure. The shear bond strength was evaluated after 24 hours of storage (37ºC, 100% humidity) with a testing machine (Ultra-tester) at a speed of 1 mm/min. The data was analyzed using a two-way ANOVA and post-hoc Tukey's test with a significance level of pself-etch adhesives evaluated while providing improvement on the enamel bond strength only for FL-Bond II. This suggests that the potential benefit that may be derived from an additional etching step with phosphoric acid does not justify the risk of adversely affecting the bond strength to dentin. PMID:23559113

  2. Modeling the characteristic etch morphologies along specific crystallographic orientations by anisotropic chemical etching

    Directory of Open Access Journals (Sweden)

    Kun-Dar Li

    2018-02-01

    Full Text Available To improve the advanced manufacturing technology for functional materials, a sophisticated control of chemical etching process is highly demanded, especially in the fields of environment and energy related applications. In this study, a phase-field-based model is utilized to investigate the etch morphologies influenced by the crystallographic characters during anisotropic chemical etching. Three types of etching modes are inspected theoretically, including the isotropic, and preferred oriented etchings. Owing to the specific etching behavior along the crystallographic directions, different characteristic surface structures are presented in the simulations, such as the pimple-like, pyramidal hillock and ridge-like morphologies. In addition, the processing parameters affecting the surface morphological formation and evolution are also examined systematically. According to the numerical results, the growth mechanism of surface morphology in a chemical etching is revealed distinctly. While the etching dynamics plays a dominant role on the surface formation, the characteristic surface morphologies corresponding to the preferred etching direction become more apparent. As the atomic diffusion turned into a determinative factor, a smoothened surface would appear, even under the anisotropic etching conditions. These simulation results provide fundamental information to enhance the development and application of anisotropic chemical etching techniques.

  3. Modeling the characteristic etch morphologies along specific crystallographic orientations by anisotropic chemical etching

    Science.gov (United States)

    Li, Kun-Dar; Miao, Jin-Ru

    2018-02-01

    To improve the advanced manufacturing technology for functional materials, a sophisticated control of chemical etching process is highly demanded, especially in the fields of environment and energy related applications. In this study, a phase-field-based model is utilized to investigate the etch morphologies influenced by the crystallographic characters during anisotropic chemical etching. Three types of etching modes are inspected theoretically, including the isotropic, and preferred oriented etchings. Owing to the specific etching behavior along the crystallographic directions, different characteristic surface structures are presented in the simulations, such as the pimple-like, pyramidal hillock and ridge-like morphologies. In addition, the processing parameters affecting the surface morphological formation and evolution are also examined systematically. According to the numerical results, the growth mechanism of surface morphology in a chemical etching is revealed distinctly. While the etching dynamics plays a dominant role on the surface formation, the characteristic surface morphologies corresponding to the preferred etching direction become more apparent. As the atomic diffusion turned into a determinative factor, a smoothened surface would appear, even under the anisotropic etching conditions. These simulation results provide fundamental information to enhance the development and application of anisotropic chemical etching techniques.

  4. Optimal Conditions for Fast Charging and Long Cycling Stability of Silicon Microwire Anodes for Lithium Ion Batteries, and Comparison with the Performance of Other Si Anode Concepts

    Directory of Open Access Journals (Sweden)

    Enrique Quiroga-González

    2013-10-01

    Full Text Available Cycling tests under various conditions have been performed for lithium ion battery anodes made from free-standing silicon microwires embedded at one end in a copper current collector. Optimum charging/discharging conditions have been found for which the anode shows negligible fading (< 0.001% over 80 cycles; an outstanding result for this kind of anodes. Several performance parameters of the anode have been compared to the ones of other Si anode concepts, showing that especially the capacity as well as the rates of charge flow per nominal area of anode are the highest for the present anode. With regard to applications, the specific parameters per area are more important than the specific gravimetric parameters like the gravimetric capacity, which is good for comparing the capacity between materials but not enough for comparing between anodes.

  5. New metrology techniques improve the production of silicon diffractive optics

    Science.gov (United States)

    Brooks, Cynthia B.; Gully-Santiago, Michael; Grigas, Michelle; Jaffe, Daniel T.

    2014-07-01

    Silicon immersion gratings and grisms offer significant advantages in compactness and performance over frontsurface gratings and over grisms made from lower-index materials. At the same time, the high refractive index of Si (3.4) leads to very stringent constraints on the allowable groove position errors, typically rms silicon using photolithography, plasma etching, and wet etching. To date, producers have used contact photolithography to pattern UV sensitive photoresist as the initial processing step, then transferred this pattern to a layer of silicon nitride that, in turn, serves as a hard mask during the wet etching of grooves into silicon. For each step of the groove production, we have used new and sensitive techniques to determine the contribution of that step to the phase non-uniformity. Armed with an understanding of the errors and their origins, we could then implement process controls for each step. The plasma uniformity was improved for the silicon nitride mask etch process and the phase contribution of the plasma etch step was measured. We then used grayscale lithography, a technique in which the photoresist is deliberately underexposed, to measure large-scale nonuniformities in the UV exposure system to an accuracy of 3-5%, allowing us to make corrections to the optical alignment. Additionally, we used a new multiple-exposure technique combined with laser interferometry to measure the relationship between UV exposure dose and line edge shift. From these data we predict the contribution of the etching and photolithographic steps to phase error of the grating surface. These measurements indicate that the errors introduced during the exposure step dominate the contributions of all the other processing steps. This paper presents the techniques used to quantify individual process contributions to phase errors and steps that were taken to improve overall phase uniformity.

  6. Black silicon solar cells with black bus-bar strings

    DEFF Research Database (Denmark)

    Davidsen, Rasmus Schmidt; Tang, Peter Torben; Mizushima, Io

    2016-01-01

    We present the combination of black silicon texturing and blackened bus-bar strings as a potential method for obtaining all-black solar panels, while using conventional, front-contacted solar cells. Black silicon was realized by maskless reactive ion etching resulting in total, average reflectance...... below 0.5% across a 156x156 mm2 silicon wafer. Four different methods to obtain blackened bus-bar strings were compared with respect to reflectance, and two of these methods (i.e., oxidized copper and etched solder) were used to fabricate functional allblack solar 9-cell panels. The black bus-bars (e.......g., by oxidized copper) have a reflectance below 3% in the entire visible wavelength range. The combination of black silicon cells and blackened bus-bars results in aesthetic, all-black panels based on conventional, front-contacted solar cells without compromising efficiency....

  7. A monolithic silicon-based membrane-electrode assembly for micro fuel cells

    Science.gov (United States)

    Yuzova, V. A.; Merkushev, F. F.; Semenova, O. V.

    2017-08-01

    We report the basic possibility of creating a micro fuel cell (MFC) with a monolithic silicon-based membrane-electrode assembly (MEA), which employs a porous three-layer framework structure manufactured by two-sided anodic etching of a 500-μm-thick silicon wafer. A technology of MEAs for MFCs is described.

  8. Wafer scale nano-membrane supported on a silicon microsieve using thin-film transfer technology

    NARCIS (Netherlands)

    Unnikrishnan, S.; Jansen, Henricus V.; Berenschot, Johan W.; Elwenspoek, Michael Curt

    A new micromachining method to fabricate wafer scale nano-membranes is described. The delicate thin-film nano-membrane is supported on a robust silicon microsieve fabricated by plasma etching. The silicon sieve is micromachined independently of the thin-film, which is later transferred onto it by

  9. Fabrication of High-Frequency pMUT Arrays on Silicon Substrates

    DEFF Research Database (Denmark)

    Pedersen, Thomas; Zawada, Tomasz; Hansen, Karsten

    2010-01-01

    A novel technique based on silicon micromachining for fabrication of linear arrays of high-frequency piezoelectric micromachined ultrasound transducers (pMUT) is presented. Piezoelectric elements are formed by deposition of lead zirconia titanate into etched features of a silicon substrate...

  10. Porous silicon in solar cell structures : a review of achievements and modern directions of further use

    NARCIS (Netherlands)

    Yerokhov, VY; Melnyk, [No Value

    1999-01-01

    Porous silicon, which is being obtained by electrochemical etching of silicon wafers in electrolytes on the base of hydrofluoric acid, recently attracted the attention of specialists in photovoltaics even more due to a number of its unique properties. However, at present, acceptable results are

  11. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-05-05

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulation was carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning

  12. Mechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)

    KAUST Repository

    Hussain, Muhammad Mustafa

    2013-05-30

    Today’s information age is driven by silicon based electronics. For nearly four decades semiconductor industry has perfected the fabrication process of continuingly scaled transistor – heart of modern day electronics. In future, silicon industry will be more pervasive, whose application will range from ultra-mobile computation to bio-integrated medical electronics. Emergence of flexible electronics opens up interesting opportunities to expand the horizon of electronics industry. However, silicon – industry’s darling material is rigid and brittle. Therefore, we report a generic batch fabrication process to convert nearly any silicon electronics into a flexible one without compromising its (i) performance; (ii) ultra-large-scale-integration complexity to integrate billions of transistors within small areas; (iii) state-of-the-art process compatibility, (iv) advanced materials used in modern semiconductor technology; (v) the most widely used and well-studied low-cost substrate mono-crystalline bulk silicon (100). In our process, we make trenches using anisotropic reactive ion etching (RIE) in the inactive areas (in between the devices) of a silicon substrate (after the devices have been fabricated following the regular CMOS process), followed by a dielectric based spacer formation to protect the sidewall of the trench and then performing an isotropic etch to create caves in silicon. When these caves meet with each other the top portion of the silicon with the devices is ready to be peeled off from the bottom silicon substrate. Release process does not need to use any external support. Released silicon fabric (25 μm thick) is mechanically flexible (5 mm bending radius) and the trenches make it semi-transparent (transparency of 7%). © (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  13. Etch Defect Characterization and Reduction in Hard-Mask-Based Al Interconnect Etching

    International Nuclear Information System (INIS)

    Lee, H.J.; Hung, C.L.; Leng, C.H.; Lian, N.T.; Young, L.W.

    2009-01-01

    This paper identifies the defect adders, for example, post hard-mask etch residue, post metal etch residue, and blocked etch metal island and investigates the removal characteristics of these defects within the oxide-masked Al etching process sequence. Post hard-mask etch residue containing C atom is related to the hardening of photoresist after the conventional post-RIE ashing at 275 degree C. An in situ O 2 -based plasma ashing on RIE etcher was developed to prevent the photoresist hardening from the high-ashing temperature; followed wet stripping could successfully eliminate such hardened polymeric residue. Post metal etch residue was caused from the attack of the Al sidewall by Cl atoms, and too much CHF 3 addition in the Al main etch step passivated the surface of Al resulting in poor capability to remove the Al-containing residue. The lower addition of CHF 3 in the Al main etch step would benefit from the residue removal. One possibility of blocked etch metal island creating was due to the micro masking formed on the opening of Ti N during the hard-mask patterning. We report that an additional Ti N surface pretreatment with the Ar/CHF 3 /N 2 plasmas could reduce the impact of the micro masking residues on blocked metal etch.

  14. Broadband antireflective silicon carbide surface produced by cost-effective method

    DEFF Research Database (Denmark)

    Argyraki, Aikaterini; Ou, Yiyu; Ou, Haiyan

    2013-01-01

    A cost-effective method for fabricating antireflective subwavelength structures on silicon carbide is demonstrated. The nanopatterning is performed in a 2-step process: aluminum deposition and reactive ion etching. The effect, of the deposited aluminum film thickness and the reactive ion etching...... conditions, on the average surface reflectance and nanostructure landscape have been investigated systematically. The average reflectance of silicon carbide surface is significantly suppressed from 25.4% to 0.05%, under the optimal experimental conditions, in the wavelength range of 390-784 nm. The presence...... of stochastic nanostructures also changes the wetting properties of silicon carbide surface from hydrophilic (47°) to hydrophobic (108°)....

  15. Laser direct writing of oxide structures on hydrogen-passivated silicon surfaces

    DEFF Research Database (Denmark)

    Müllenborn, Matthias; Birkelund, Karen; Grey, Francois

    1996-01-01

    A focused laser beam has been used to induce oxidation of hydrogen-passivated silicon. The scanning laser beam removes the hydrogen passivation locally from the silicon surface, which immediately oxidizes in air. The process has been studied as a function of power density and excitation wavelength...... be generated by laser direct oxidation and complemented with nanometer resolution by scanning probe techniques. The combined micro- and nanoscale pattern can be transferred to the silicon in a single etching step by either wet or dry etching techniques. (C) 1996 American Institute of Physics....

  16. Multispectral imaging with vertical silicon nanowires.

    Science.gov (United States)

    Park, Hyunsung; Crozier, Kenneth B

    2013-01-01

    Multispectral imaging is a powerful tool that extends the capabilities of the human eye. However, multispectral imaging systems generally are expensive and bulky, and multiple exposures are needed. Here, we report the demonstration of a compact multispectral imaging system that uses vertical silicon nanowires to realize a filter array. Multiple filter functions covering visible to near-infrared (NIR) wavelengths are simultaneously defined in a single lithography step using a single material (silicon). Nanowires are then etched and embedded into polydimethylsiloxane (PDMS), thereby realizing a device with eight filter functions. By attaching it to a monochrome silicon image sensor, we successfully realize an all-silicon multispectral imaging system. We demonstrate visible and NIR imaging. We show that the latter is highly sensitive to vegetation and furthermore enables imaging through objects opaque to the eye.

  17. In-depth porosity control of mesoporous silicon layers by an anodization current adjustment

    Science.gov (United States)

    Lascaud, J.; Defforge, T.; Certon, D.; Valente, D.; Gautier, G.

    2017-12-01

    The formation of thick mesoporous silicon layers in P+-type substrates leads to an increase in the porosity from the surface to the interface with silicon. The adjustment of the current density during the electrochemical etching of porous silicon is an intuitive way to control the layer in-depth porosity. The duration and the current density during the anodization were varied to empirically model porosity variations with layer thickness and build a database. Current density profiles were extracted from the model in order to etch layer with in-depth control porosity. As a proof of principle, an 80 μm-thick porous silicon multilayer was synthetized with decreasing porosities from 55% to 35%. The results show that the assessment of the in-depth porosity could be significantly enhanced by taking into account the pure chemical etching of the layer in the hydrofluoric acid-based electrolyte.

  18. Synthesis of Novel Reactive Disperse Silicon-Containing Dyes and Their Coloring Properties on Silicone Rubbers.

    Science.gov (United States)

    Yu, Ning; Zhang, Shufen; Tang, Bingtao; Ma, Wei; Qiu, Jinjing

    2018-01-09

    Novel red and purple reactive disperse silicon-containing dyes were designed and synthesized using p -nitroaniline and 6-bromo-2,4-dinitro-aniline as diazonium components, the first condensation product of cyanuric chloride and 3-( N , N -diethyl)amino-aniline as coupling component, and 3-aminopropylmethoxydimethylsilane, 3-aminopropylmethyldimethoxysilane, and 3-aminopropyltrimethoxysilane as silicone reactive agents. These dyes were characterized by UV-Vis, ¹H-NMR, FT-IR, and MS. The obtained reactive disperse silicon-containing dyes were used to color silicone rubbers and the color fastness of the dyes were evaluated. The dry/wet rubbing and washing fastnesses of these dyes all reached 4-5 grade and the sublimation fastness was also above 4 grade, indicating outstanding performance in terms of color fastness. Such colored silicone rubbers showed bright and rich colors without affecting its static mechanical properties.

  19. Synthesis of Novel Reactive Disperse Silicon-Containing Dyes and Their Coloring Properties on Silicone Rubbers

    Directory of Open Access Journals (Sweden)

    Ning Yu

    2018-01-01

    Full Text Available Novel red and purple reactive disperse silicon-containing dyes were designed and synthesized using p-nitroaniline and 6-bromo-2,4-dinitro-aniline as diazonium components, the first condensation product of cyanuric chloride and 3-(N,N-diethylamino-aniline as coupling component, and 3-aminopropylmethoxydimethylsilane, 3-aminopropylmethyldimethoxysilane, and 3-aminopropyltrimethoxysilane as silicone reactive agents. These dyes were characterized by UV-Vis, 1H-NMR, FT-IR, and MS. The obtained reactive disperse silicon-containing dyes were used to color silicone rubbers and the color fastness of the dyes were evaluated. The dry/wet rubbing and washing fastnesses of these dyes all reached 4–5 grade and the sublimation fastness was also above 4 grade, indicating outstanding performance in terms of color fastness. Such colored silicone rubbers showed bright and rich colors without affecting its static mechanical properties.

  20. Properties and etching rates of negative ions in inductively coupled plasmas and dc discharges produced in Ar/SF6

    DEFF Research Database (Denmark)

    Draghici, Mihai; Stamate, Eugen

    2010-01-01

    of negative ion to electron exceeded 300 in dc mode while it was below 100 in the ICP mode. The possibility to apply a large positive bias to an electrode without affecting the plasma potential and the transition from a negative sheath to anodic glow are also investigated. The etching rates by positive...... and negative ions are evaluated on silicon substrate for different Ar/SF6 gas ratios. The etching rate by negative ions was with less than 5% smaller than that by positive ions....

  1. Dry etching method for compound semiconductors

    Science.gov (United States)

    Shul, Randy J.; Constantine, Christopher

    1997-01-01

    A dry etching method. According to the present invention, a gaseous plasma comprising, at least in part, boron trichloride, methane, and hydrogen may be used for dry etching of a compound semiconductor material containing layers including aluminum, or indium, or both. Material layers of a compound semiconductor alloy such as AlGaInP or the like may be anisotropically etched for forming electronic devices including field-effect transistors and heterojunction bipolar transistors and for forming photonic devices including vertical-cavity surface-emitting lasers, edge-emitting lasers, and reflectance modulators.

  2. Model polymer etching and surface modification by a time modulated RF plasma jet: role of atomic oxygen and water vapor

    International Nuclear Information System (INIS)

    Luan, P; Knoll, A J; Wang, H; Oehrlein, G S; Kondeti, V S S K; Bruggeman, P J

    2017-01-01

    The surface interaction of a well-characterized time modulated radio frequency (RF) plasma jet with polystyrene, poly(methyl methacrylate) and poly(vinyl alcohol) as model polymers is investigated. The RF plasma jet shows fast polymer etching but mild chemical modification with a characteristic carbonate ester and NO formation on the etched surface. By varying the plasma treatment conditions including feed gas composition, environment gaseous composition, and treatment distance, we find that short lived species, especially atomic O for Ar/1% O 2 and 1% air plasma and OH for Ar/1% H 2 O plasma, play an essential role for polymer etching. For O 2 containing plasma, we find that atomic O initiates polymer etching and the etching depth mirrors the measured decay of O atoms in the gas phase as the nozzle-surface distance increases. The etching reaction probability of an O atom ranging from 10 −4 to 10 −3 is consistent with low pressure plasma research. We also find that adding O 2 and H 2 O simultaneously into Ar feed gas quenches polymer etching compared to adding them separately which suggests the reduction of O and OH density in Ar/O 2 /H 2 O plasma. (letter)

  3. Different index contrast silica-on-silicon waveguides by PECVD

    DEFF Research Database (Denmark)

    Ou, Haiyan

    2003-01-01

    Ge-doped silica-on-silicon waveguides with index steps of 0.01 and 0.02 were fabricated by a combination of plasma enhanced chemical vapour deposition (PECVD) and reactive ion etching (RIE) techniques, and their characteristics, including propagation loss, coupling loss with standard singlemode f...

  4. Novel approaches for low-cost through-silicon vias

    NARCIS (Netherlands)

    Bullema, J.E.; Bressers, P.; Oosterhuis, G.; Mueller, M.; Huis in 't veld, A.J.; Roozeboom, F.

    2011-01-01

    3D stacking of integrated circuits is an emerging packaging technology to enable a high degree of functional integration and miniaturization. Footprint reduction in 3D stacking can be achieved by use of Through Silicon Vias (TSV). Creation of TSVs with Deep Reactive Ion Etching (DRIE), laser

  5. Modular design of AFM probe with sputtered silicon tip

    DEFF Research Database (Denmark)

    Rasmussen, Peter; Thaysen, Jacob; Bouwstra, Siebe

    2001-01-01

    of the thin films constituting the cantilever. The AFM probe has an integrated tip made of a thick sputtered silicon layer, which is deposited after the probe has been defined and just before the cantilevers are released. The tips are so-called rocket tips made by reactive ion etching. We present probes...

  6. Impact of electron irradiation on particle track etching response in ...

    Indian Academy of Sciences (India)

    Scan- ning electron microscopy of etched samples further revealed the surface damage in these irradiated. PADCs. Keywords. 2 MeV electron; 140 MeV. ¾. Si; PADC; dose-dependent track registration properties; bulk etch-rate; etching response; critical angle of etching; detection efficiency; scanning electron microscopy.

  7. Silicon Carbide Gate Driver, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA needs efficient, low mass, low volume power electronics for a wide variety of applications and missions. Silicon carbide (SiC) switches provide fast, low loss...

  8. Scanning proximal microscopy study of the thin layers of silicon carbide-aluminum nitride solid solution manufactured by fast sublimation epitaxy

    Directory of Open Access Journals (Sweden)

    Tománek P.

    2013-05-01

    Full Text Available The objective of the study is a growth of SiC/(SiC1−x(AlNx structures by fast sublimation epitaxy of the polycrystalline source of (SiC1−x(AlNx and their characterisation by proximal scanning electron microscopy and atomic force microscopy. For that purpose optimal conditions of sublimation process have been defined. Manufactured structures could be used as substrates for wide-band-gap semiconductor devices on the basis of nitrides, including gallium nitride, aluminum nitride and their alloys, as well as for the production of transistors with high mobility of electrons and also for creation of blue and ultraviolet light emitters (light-emitted diodes and laser diodes. The result of analysis shows that increasing of the growth temperature up to 2300 K allows carry out sublimation epitaxy of thin layers of aluminum nitride and its solid solution.

  9. The Silicon Lattice Accelerator

    Energy Technology Data Exchange (ETDEWEB)

    Spencer, J

    2003-11-24

    Previously, the generalized luminosity L was defined and calculated for all incident channels based on an NLC e{sup +}e{sup -} design. Alternatives were then considered to improve the differing beam-beam effects in the e{sup -}e{sup -}, e{gamma} and {gamma}{gamma} channels. One example was tensor beams composed of bunchlets n{sub ijk} implemented with a laser-driven, silicon accelerator based on micromachining techniques. Problems were considered and expressions given for radiative broadening due to bunchlet manipulation near the final focus to optimize luminosity via charge enhancement, neutralization or bunch shaping. Because the results were promising, we explore fully integrated structures that include sources, optics (for both light and particles) and acceleration in a common format--an accelerator-on-chip. Acceptable materials (and wavelengths) must allow velocity synchronism between many laser and electron pulses with optimal efficiency in high radiation environments. There are obvious control and cost advantages that accrue from using silicon structures if radiation effects can be made acceptable and the structures fabricated. Tests related to deep etching, fabrication and radiation effects on candidate amorphous and crystalline materials indicate Si(1.2 < {lambda}{sub L} < 10 {micro}m) and fused c-SiO{sub 2}(0.3 < {lambda}{sub L} < 4 {micro}m) to be ideal.

  10. Semiconductor structure and recess formation etch technique

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Bin; Sun, Min; Palacios, Tomas Apostol

    2017-02-14

    A semiconductor structure has a first layer that includes a first semiconductor material and a second layer that includes a second semiconductor material. The first semiconductor material is selectively etchable over the second semiconductor material using a first etching process. The first layer is disposed over the second layer. A recess is disposed at least in the first layer. Also described is a method of forming a semiconductor structure that includes a recess. The method includes etching a region in a first layer using a first etching process. The first layer includes a first semiconductor material. The first etching process stops at a second layer beneath the first layer. The second layer includes a second semiconductor material.

  11. Broadband Nonlinear Signal Processing in Silicon Nanowires

    DEFF Research Database (Denmark)

    Yvind, Kresten; Pu, Minhao; Hvam, Jørn Märcher

    The fast non-linearity of silicon allows Tbit/s optical signal processing. By choosing suitable dimensions of silicon nanowires their dispersion can be tailored to ensure a high nonlinearity at power levels low enough to avoid significant two-photon abso We have fabricated low insertion...

  12. Etching characteristics of a CR-39 track detector at room temperature in different etching solutions

    International Nuclear Information System (INIS)

    Dajko, G.

    1991-01-01

    Investigations were carried out to discover how the etching characteristics of CR-39 detectors change with varying conditions of the etching process. Measurements were made at room temperature in pure NaOH and KOH solutions; in different alcoholic KOH solutions (PEW solution, i.e. potassium hydroxide, ethyl alcohol, water); and in NaOH and KOH solutions containing different additives. The bulk etching rate of the detector (V B ) and the V (= V T /V B ) function, i.e. track to bulk etch rates ratio, for 6.1 MeV α-particles, were measured systematically. (author)

  13. Effect of phosphoric acid etching on the shear bond strength of two self-etch adhesives

    Directory of Open Access Journals (Sweden)

    Camila SABATINI

    2013-01-01

    Full Text Available Objective To evaluate the effect of optional phosphoric acid etching on the shear bond strength (SBS of two self-etch adhesives to enamel and dentin. Material and Methods Ninety-six bovine mandibular incisors were ground flat to obtain enamel and dentin substrates. A two-step self-etch adhesive (FL-Bond II and a one-step self-etch adhesive (BeautiBond were applied with and without a preliminary acid etching to both the enamel and dentin. The specimens were equally and randomly assigned to 4 groups per substrate (n=12 as follows: FL-Bond II etched; FL-Bond II un-etched; BeautiBond etched; BeautiBond un-etched. Composite cylinders (Filtek Z100 were bonded onto the treated tooth structure. The shear bond strength was evaluated after 24 hours of storage (37°C, 100% humidity with a testing machine (Ultra-tester at a speed of 1 mm/min. The data was analyzed using a two-way ANOVA and post-hoc Tukey's test with a significance level of p<0.05. A field emission scanning electron microscope was used for the failure mode analysis. Results Both adhesives evidenced a significant decrease in the dentin SBS with the use of an optional phosphoric acid-etching step (p<0.05. Preliminary phosphoric acid etching yielded significantly higher enamel SBS for FL-Bond II (p<0.05 only, but not for BeautiBond. FL-Bond II applied to un-etched dentin demonstrated the highest mean bond strength (37.7±3.2 MPa and BeautiBond applied to etched dentin showed the lowest mean bond strength (18.3±6.7 MPa among all tested groups (p<0.05. Conclusion The use of a preliminary acid-etching step with 37.5% phosphoric acid had a significant adverse effect on the dentin bond strength of the self-etch adhesives evaluated while providing improvement on the enamel bond strength only for FL-Bond II. This suggests that the potential benefit that may be derived from an additional etching step with phosphoric acid does not justify the risk of adversely affecting the bond strength to dentin.

  14. Delineation of Crystalline Extended Defects on Multicrystalline Silicon Wafers

    Directory of Open Access Journals (Sweden)

    Mohamed Fathi

    2007-01-01

    Full Text Available We have selected Secco and Yang etch solutions for the crystalline defect delineation on multicrystalline silicon (mc-Si wafers. Following experimentations and optimization of Yang and Secco etching process parameters, we have successfully revealed crystalline extended defects on mc-Si surfaces. A specific delineation process with successive application of Yang and Secco agent on the same sample has proved the increased sensitivity of Secco etch to crystalline extended defects in mc-Si materials. The exploration of delineated mc-Si surfaces indicated that strong dislocation densities are localized mainly close to the grain boundaries and on the level of small grains in size (below 1 mm. Locally, we have observed the formation of several parallel dislocation lines, perpendicular to the grain boundaries. The overlapping of several dislocations lines has revealed particular forms for etched pits of dislocations.

  15. Plasma/Neutral-Beam Etching Apparatus

    Science.gov (United States)

    Langer, William; Cohen, Samuel; Cuthbertson, John; Manos, Dennis; Motley, Robert

    1989-01-01

    Energies of neutral particles controllable. Apparatus developed to produce intense beams of reactant atoms for simulating low-Earth-orbit oxygen erosion, for studying beam-gas collisions, and for etching semiconductor substrates. Neutral beam formed by neutralization and reflection of accelerated plasma on metal plate. Plasma ejected from coaxial plasma gun toward neutralizing plate, where turned into beam of atoms or molecules and aimed at substrate to be etched.

  16. A multi-step electrochemical etching process for a three-dimensional micro probe array

    International Nuclear Information System (INIS)

    Kim, Yoonji; Youn, Sechan; Cho, Young-Ho; Park, HoJoon; Chang, Byeung Gyu; Oh, Yong Soo

    2011-01-01

    We present a simple, fast, and cost-effective process for three-dimensional (3D) micro probe array fabrication using multi-step electrochemical metal foil etching. Compared to the previous electroplating (add-on) process, the present electrochemical (subtractive) process results in well-controlled material properties of the metallic microstructures. In the experimental study, we describe the single-step and multi-step electrochemical aluminum foil etching processes. In the single-step process, the depth etch rate and the bias etch rate of an aluminum foil have been measured as 1.50 ± 0.10 and 0.77 ± 0.03 µm min −1 , respectively. On the basis of the single-step process results, we have designed and performed the two-step electrochemical etching process for the 3D micro probe array fabrication. The fabricated 3D micro probe array shows the vertical and lateral fabrication errors of 15.5 ± 5.8% and 3.3 ± 0.9%, respectively, with the surface roughness of 37.4 ± 9.6 nm. The contact force and the contact resistance of the 3D micro probe array have been measured to be 24.30 ± 0.98 mN and 2.27 ± 0.11 Ω, respectively, for an overdrive of 49.12 ± 1.25 µm.

  17. Emerging heterogeneous integrated photonic platforms on silicon

    Directory of Open Access Journals (Sweden)

    Fathpour Sasan

    2015-05-01

    Full Text Available Silicon photonics has been established as a mature and promising technology for optoelectronic integrated circuits, mostly based on the silicon-on-insulator (SOI waveguide platform. However, not all optical functionalities can be satisfactorily achieved merely based on silicon, in general, and on the SOI platform, in particular. Long-known shortcomings of silicon-based integrated photonics are optical absorption (in the telecommunication wavelengths and feasibility of electrically-injected lasers (at least at room temperature. More recently, high two-photon and free-carrier absorptions required at high optical intensities for third-order optical nonlinear effects, inherent lack of second-order optical nonlinearity, low extinction ratio of modulators based on the free-carrier plasma effect, and the loss of the buried oxide layer of the SOI waveguides at mid-infrared wavelengths have been recognized as other shortcomings. Accordingly, several novel waveguide platforms have been developing to address these shortcomings of the SOI platform. Most of these emerging platforms are based on heterogeneous integration of other material systems on silicon substrates, and in some cases silicon is integrated on other substrates. Germanium and its binary alloys with silicon, III–V compound semiconductors, silicon nitride, tantalum pentoxide and other high-index dielectric or glass materials, as well as lithium niobate are some of the materials heterogeneously integrated on silicon substrates. The materials are typically integrated by a variety of epitaxial growth, bonding, ion implantation and slicing, etch back, spin-on-glass or other techniques. These wide range of efforts are reviewed here holistically to stress that there is no pure silicon or even group IV photonics per se. Rather, the future of the field of integrated photonics appears to be one of heterogenization, where a variety of different materials and waveguide platforms will be used for

  18. Oxidation and etching behaviors of the InAs surface in various acidic and basic chemical solutions

    Science.gov (United States)

    Na, Jihoon; Lee, Seunghyo; Lim, Sangwoo

    2017-04-01

    Indium arsenide (InAs) is the candidate of choice as a new channel material for application in future technologies beyond the Si-based electronic devices because it has a much higher electron mobility than silicon. In this study, the oxidation and etching behaviors of InAs (100) in various acidic and basic solutions, such as HF, HCl, H2SO4, NaOH, KOH, and NH4OH, were investigated. In addition, the effect of pH on the oxidation and etching reactions taking place on the InAs surface was studied using solutions with a pH ranging from 1 to 13. It was observed that the oxidation of the InAs surface was hindered in acidic solutions, which was attributed to the dissolution of the oxidized surface layer. In particular, the treatment of the InAs surface using a strongly acidic solution with a pH of less than 3 produced an oxide-free surface due to the predominant etching of the InAs surface. The addition of H2O2 to the acidic solutions greatly increased the etching rate of the InAs surface, which suggests that the oxidation process is the rate-limiting step in the sequence of reactions that occur during the etching of the InAs surface in acidic solutions. The etching of InAs was suppressed in neutral solutions, which resulted in the formation of a relatively thicker oxide layer on the surface, and mild etching of the InAs surface took place in basic solutions. However, in basic solutions, the addition of H2O2 did not significantly contribute to the increase of the oxidation state of the InAs surface; thus, its effect on the etching rate of InAs was smaller than in acidic solutions.

  19. Morphology and chemical termination of HF-etched Si{sub 3}N{sub 4} surfaces

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Li-Hong; Debenedetti, William J. I.; Peixoto, Tatiana; Gokalp, Sumeyra; Shafiq, Natis; Veyan, Jean-François; Chabal, Yves J., E-mail: chabal@utdallas.edu [Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, Texas 75080 (United States); Michalak, David J.; Hourani, Rami [Components Research, Intel Corporation, Hillsboro, Oregon 97124 (United States)

    2014-12-29

    Several reports on the chemical termination of silicon nitride films after HF etching, an important process in the microelectronics industry, are inconsistent claiming N-H{sub x}, Si-H, or fluorine termination. An investigation combining infrared and x-ray photoelectron spectroscopies with atomic force and scanning electron microscopy imaging reveals that under some processing conditions, salt microcrystals are formed and stabilized on the surface, resulting from products of Si{sub 3}N{sub 4} etching. Rinsing in deionized water immediately after HF etching for at least 30 s avoids such deposition and yields a smooth surface without evidence of Si-H termination. Instead, fluorine and oxygen are found to terminate a sizeable fraction of the surface in the form of Si-F and possibly Si-OH bonds. The relatively unique fluorine termination is remarkably stable in both air and water and could lead to further chemical functionalization pathways.

  20. Black silicon with black bus-bar strings

    DEFF Research Database (Denmark)

    Davidsen, Rasmus Schmidt; Tang, Peter Torben; Mizushima, Io

    2016-01-01

    We present the combination of black silicon texturing and blackened bus-bar strings as a potential method for obtaining all-black solar panels, while using conventional, front-contacted solar cells. Black silicon was realized by mask-less reactive ion etching resulting in total, average reflectance...... below 0.5% across a 156x156 mm2 silicon wafer. Black bus-bars were realized by oxidized copper resulting in reflectance below 3% in the entire visible wavelength range. The combination of these two technologies may result in aesthetic, all-black panels based on conventional, front-contacted solar cells...

  1. Effect of pre-etching enamel on fatigue of self-etch adhesive bonds

    NARCIS (Netherlands)

    Erickson, R.L.; de Gee, A.J.; Feilzer, A.J.

    2008-01-01

    Objective. A previous study found that the shear bond strength (SBS) to bovine enamel for the self-etching adhesive Adper Prompt-L-Pop (PLP) was 75% of that found with the etch-and-rinse material SingleBond, while the comparative value for the shear fatigue limit (SFL) was only 58% at 10(5) load

  2. Effect of pre-etching on sealing ability of two current self-etching adhesives

    Directory of Open Access Journals (Sweden)

    K Khosravi

    2005-05-01

    Full Text Available Background: We evaluated the effect of phosphoric acid etching on microleakage of two current self-etching adhesives on enamel margins in comparison to a conventional total- etch system. Methods: Sixty buccal class V cavities were made at the cemento-enamel junction with beveled enamel margins of extracted human premolar teeth and randomly divided into five groups (12 specimens in each group. Group 1 was applying with Clearfil SE bond, Group 2 with 35% phosphoric acid etching of enamel margins plus Clearfil SE bond, Group3 with I bond, Group 4 with 35% phosphoric acid etching of enamel margins plus I bond and Group5 with Scotchbond multi-purpose. All groups restored with a composite resins. After 24 hours storage with 100% humidity, the samples were thermocycled, immersed in a dye solution and sectioned buccoligually and enamel margins microleakage were evaluated on a scale of 0 to 2. Results: The differences between Groups 1 & 3 and Groups 3 & 4 were significant (P<0.05 but no significant differences between Groups1 & 2 or 1 & 5 were observed. Conclusion: The findings suggest that all-in-one adhesive systems need pre-etching enamel margins with phosphoric acid for effectively seal. Key words: Self-Etching Adhesives, Microleakage, Enamel, Total-Etch system

  3. Epitaxial Growth of Cadmium Selenide Films on Silicon with a Silicon Carbide Buffer Layer

    Science.gov (United States)

    Antipov, V. V.; Kukushkin, S. A.; Osipov, A. V.; Rubets, V. P.

    2018-03-01

    An epitaxial cubic 350-nm-thick cadmium selenide has been grown on silicon for the first time by the method of evaporation and condensation in a quasi-closed volume. It is revealed that, in this method, the optimum substrate temperature is 590°C, the evaporator temperature is 660°C, and the growth time is 2 s. To avoid silicon etching by selenium with formation of amorphous SiSe2, a high-quality 100-nm-thick buffer silicon carbide layer has been synthesized on the silicon surface by substituting atoms. The powder diffraction pattern and the Raman spectrum unambiguously correspond to cubic cadmium selenide crystal. The ellipsometric, Raman, and electron diffraction analyses demonstrate high structural perfection of the cadmium selenide layer and the absence of a polycrystalline phase.

  4. Virtual Fabrication of Silicon Nitride Based Multifunctional MEMS Pressure Sensor

    Directory of Open Access Journals (Sweden)

    Mahesh Kumar PATANKAR

    2011-04-01

    Full Text Available This paper shows how to combine absolute and differential pressure sensor on single silicon substrate for measuring the pressure in 0 – 1 MPa range. In this work, the sensor makes use a of silicon nitride square diaphragm supported by a thick silicon rim. Piezoresistors below the diaphragms are defined by the p+ etch stop technique and structured by the anisotropic etching in Wheatstone bridge configuration. In event of pressure, mechanical deformation occurs in the diaphragm and induces the stress in it which can be translated into electrical signal accordingly. This sensor shows the sensitivity of 142 mV/V.KPa. The pressure sensor has been designed, simulated and virtually fabricated using Intellisuite MEMS software tool. Simulation results shows that the good agreement with the analytical solutions.

  5. High Rate Deep Si Etching using Capacitively Coupled Plasma

    Science.gov (United States)

    Sakai, Itsuko; Sakurai, Noriko; Ohiwa, Tokuhisa

    High rate deep Si etching using SF6/O2 gas chemistry by Magnetically-Enhanced Reactive Ion Etch (MERIE) system using a Dipole-Ring Magnet (DRM) is studied. It is capable of etching holes 40 μm in diameter in a Si substrate at etch rates as high as 50 μm/min. It was found that the Si etch reaction is dominated by the density of fluorine radicals, which is realized at high frequency and pressure. In holes with higher aspect ratios, it was found that the Si etch rate at the bottom of holes is determined not only by the supply of fluorine radicals, but is also influenced by an etch-inhibiting effect related to the sidewall of the hole. Using an 8 μm square mask, holes with straight sidewalls were etched to a depth of 60 μm at an etch rate of 24 μm/min.

  6. Characterization of Czochralski Silicon Detectors

    CERN Document Server

    Luukka, Panja-Riina

    2012-01-01

    This thesis describes the characterization of irradiated and non-irradiated segmenteddetectors made of high-resistivity (>1 kΩcm) magnetic Czochralski (MCZ) silicon. It isshown that the radiation hardness (RH) of the protons of these detectors is higher thanthat of devices made of traditional materials such as Float Zone (FZ) silicon or DiffusionOxygenated Float Zone (DOFZ) silicon due to the presence of intrinsic oxygen (> 5 x1017 cm-3). The MCZ devices therefore present an interesting alternative for future highenergy physics experiments. In the large hadron collider (LHC), the RH of the detectorsis a critical issue due to the high luminosity (1034 cm-2s-1) corresponding to the expectedtotal fluencies of fast hadrons above 1015 cm-2. This RH improvement is important sinceradiation damage in the detector bulk material reduces the detector performance andbecause some of the devices produced from standard detector-grade silicon, e.g. FZsilicon with negligible oxygen concentration, might not survive the plann...

  7. Effects of pillar height and junction depth on the performance of radially doped silicon pillar arrays for solar energy applications

    NARCIS (Netherlands)

    Elbersen, R.; Vijselaar, Wouter Jan, Cornelis; Tiggelaar, Roald M.; Gardeniers, Johannes G.E.; Huskens, Jurriaan

    2016-01-01

    The effects of pillar height and junction depth on solar cell characteristics are investigated to provide design rules for arrays of such pillars in solar energy applications. Radially doped silicon pillar arrays are fabricated by deep reactive ion etching of silicon substrates followed by the

  8. Dry etched SiO2 Mask for HgCdTe Etching Process

    Science.gov (United States)

    Chen, Y. Y.; Ye, Z. H.; Sun, C. H.; Deng, L. G.; Zhang, S.; Xing, W.; Hu, X. N.; Ding, R. J.; He, L.

    2016-09-01

    A highly anisotropic etching process with low etch-induced damage is indispensable for advanced HgCdTe (MCT) infrared focal plane array (IRFPA) detectors. The inductively coupled plasma (ICP) enhanced reactive ion etching technique has been widely adopted in manufacturing HgCdTe IRFPA devices. An accurately patterned mask with sharp edges is decisive to accomplish pattern duplication. It has been reported by our group that the SiO2 mask functions well in etching HgCdTe with high selectivity. However, the wet process in defining the SiO2 mask is limited by ambiguous edges and nonuniform patterns. In this report, we patterned SiO2 with a mature ICP etching technique, prior to which a thin ZnS film was deposited by thermal evaporation. The SiO2 film etching can be terminated at the auto-stopping point of the ZnS layer thanks to the high selectivity of SiO2/ZnS in SF6 based etchant. Consequently, MCT etching was directly performed without any other treatment. This mask showed acceptable profile due to the maturity of the SiO2 etching process. The well-defined SiO2 pattern and the etched smooth surfaces were investigated with scanning electron microscopy and atomic force microscope. This new mask process could transfer the patterns exactly with very small etch-bias. A cavity with aspect-ratio (AR) of 1.2 and root mean square roughness of 1.77 nm was achieved first, slightly higher AR of 1.67 was also get with better mask profile. This masking process ensures good uniformity and surely benefits the delineation of shrinking pixels with its high resolution.

  9. Effects of dry etching on GaAs

    International Nuclear Information System (INIS)

    Pang, S.W.; Lincoln, G.A.; McClelland, R.W.; DeGraff, P.D.; Geis, M.W.; Piacentini, W.J.

    1983-01-01

    A number of dry etching techniques have been developed and their ability to produce anisotropic etch profiles has been demonstrated. In addition to etch anisotropy, an important consideration for device and circuit fabrication is whether a sample suffers radiation damage by exposure to ions, electrons, or ultraviolet light during etching. In this study we evaluate the degree of radiation damage induced in GaAs by ion-beam etching with Ar, reactive-ion etching with CF 4 and CHF 3 , and ion-beam-assisted etching with Ar and Cl 2 . In addition, we propose and demonstrate processing techniques which can be used after dry etching to reduce the effects of radiation damage. GaAs samples were etched under a variety of etching conditions. The degree of radiation damage caused by etching was determined by evaluating Schottky diodes fabricated on the etched surfaces and by using deep level transient spectroscopy to characterize trapping centers. It was found that the barrier heights and breakdown voltages of Schottky diodes were changed after etching. Also, an increase in the density of traps was observed. Variations in the etching conditions had a strong effect on the measured characteristics of the samples

  10. Fabrication of Metallic Microneedle by Electroplating and Sharpening of it by Electrochemical Etching

    Science.gov (United States)

    Huang, Chih-Hao; Tanaka, Takahiro; Takaoki, Yutaka; Izumi, Hayato; Takahashi, Tomokazu; Suzuki, Masato; Aoyagi, Seiji

    Aiming at the use in low-invasive medical treatments, this paper reports a fabrication of metallic microneedle, which has a three-dimensionally sharp tip. Compared to a silicon or polymer needle which we previously proposed, a metallic needle has toughness to evade breakage. Even if it is broken, it does not become small pieces thanks to its ductility, which increases the safety for a human body. A nickel needle was fabricated using electroplating, followed by sharpening it by electrochemical etching. A smooth tip surface is obtained due to electrochemical etching reactions. Sharpness and smoothness of the tip are effective for easy insertion in the viewpoint of large stress concentration and small friction, respectively. An experiment of inserting the fabricated needle into an artificial skin of silicone rubber was carried out. The resistance force during insertion was much reduced compared to that of commercial stainless needle (23 G: shank diameter 650 µm). Although a fabricated metallic needle was inserted and pulled-out for several times, it was not broken in any trial. By changing the angle between object surface and needle axis, the insertion experiments were carried out. Fabricated nickel needle was not broken for any angle, while silicon needle was broken in case the angle is small, i.e., the needle is much inclined from normal direction of the surface, which ensures the safety of metallic microneedle to human body in the viewpoint of breakage.

  11. Fully etched apodized grating coupler on the SOI platform with -0.58 dB coupling efficiency.

    Science.gov (United States)

    Ding, Yunhong; Peucheret, Christophe; Ou, Haiyan; Yvind, Kresten

    2014-09-15

    We design and fabricate an ultrahigh coupling efficiency (CE) fully etched apodized grating coupler on the silicon-on-insulator (SOI) platform using subwavelength photonic crystals and bonded aluminum mirror. Fabrication error sensitivity and coupling angle dependence are experimentally investigated. A record ultrahigh CE of -0.58 dB with a 3 dB bandwidth of 71 nm and low back reflection are demonstrated.

  12. Silicon Micromachining for Terahertz Component Development

    Science.gov (United States)

    Chattopadhyay, Goutam; Reck, Theodore J.; Jung-Kubiak, Cecile; Siles, Jose V.; Lee, Choonsup; Lin, Robert; Mehdi, Imran

    2013-01-01

    Waveguide component technology at terahertz frequencies has come of age in recent years. Essential components such as ortho-mode transducers (OMT), quadrature hybrids, filters, and others for high performance system development were either impossible to build or too difficult to fabricate with traditional machining techniques. With micromachining of silicon wafers coated with sputtered gold it is now possible to fabricate and test these waveguide components. Using a highly optimized Deep Reactive Ion Etching (DRIE) process, we are now able to fabricate silicon micromachined waveguide structures working beyond 1 THz. In this paper, we describe in detail our approach of design, fabrication, and measurement of silicon micromachined waveguide components and report the results of a 1 THz canonical E-plane filter.

  13. Accidental fast neutron dosimetry by means of plastic identity cards

    International Nuclear Information System (INIS)

    Lommler, B.; Pitt, E.; Scharmann, A.; Simmer, R.

    1991-01-01

    Identity cards designed to provide high security against falsification are often composed of polymeric compounds and a paper-like inlay containing the identifying information. This system may be considered as a fast neutron detector when certain boundary conditions, especially concerning the polymer are fulfilled. The track recording properties of the plastic envelope of a widely used identity card were investigated. Recoil tracks induced by fast neutrons were revealed by electrochemical etching in 5N NaOH in a thin cover mounted on a trick etch-resistant base. The etching parameters (etchant normality, temperature, time, field strength, frequency) were optimized to achieve maximum neutron sensitivity. The response for neutrons from a CF 252 source is about one per cent of that of the widely used CR-39 track detector material. The possible use of the identity card as an etch track detector in accidental neutron dosimetry is discussed. (author)

  14. Nanoscale semiconducting silicon as a nutritional food additive

    International Nuclear Information System (INIS)

    Canham, L T

    2007-01-01

    Very high surface area silicon powders can be realized by high energy milling or electrochemical etching techniques. Such nanoscale silicon structures, whilst biodegradable in the human gastrointestinal tract, are shown to be remarkably stable in most foodstuffs and beverages. The potential for using silicon to improve the shelf life and bioavailability of specific nutrients in functional foods is highlighted. Published drug delivery data implies that the nanoentrapment of hydrophobic nutrients will significantly improve their dissolution kinetics, through a combined effect of nanostructuring and solid state modification. Nutrients loaded to date include vitamins, fish oils, lycopene and coenzyme Q10. In addition, there is growing published evidence that optimized release of orthosilicic acid, the biodegradation product of semiconducting silicon in the gut, offers beneficial effects with regard bone health. The utility of nanoscale silicon in the nutritional field shows early promise and is worthy of much further study

  15. Fabrication of Capacitive Micromachined Ultrasonic Transducers Using a Boron Etch-Stop Method

    DEFF Research Database (Denmark)

    Diederichsen, Søren Elmin; Sandborg-Olsen, Filip; Engholm, Mathias

    2016-01-01

    etch-stop scheme for fabricating the flexible plate of a CMUT. The proposed fabrication method enables precise control of the plate thickness variation and is a low cost alternative to the SOI-based process. N-type silicon wafers are doped with boron to a surface concentration of > 1020 cm−3 using...... array is measured to 12MHz±2.5%. Furthermore, hydrophone measurements show that the fabricated devices can be used to emit sound pressure in the ultrasonic frequency domain....

  16. Fabrication of open-top microchannel plate using deep X-ray exposure mask made with silicon on insulator substrate

    CERN Document Server

    Fujimura, T; Etoh, S I; Hattori, R; Kuroki, Y; Chang, S S

    2003-01-01

    We propose a high-aspect-ratio open-top microchannel plate structure. This type of microchannel plate has many advantages in electrophoresis. The plate was fabricated by deep X-ray lithography using synchrotron radiation (SR) light and the chemical wet etching process. A deep X-ray exposure mask was fabricated with a silicon on insulator (SOI) substrate. The patterned Si microstructure was micromachined into a thin Si membrane and a thick Au X-ray absorber was embedded in it by electroplating. A plastic material, polymethylmethacrylate (PMMA) was used for the plate substrate. For reduction of the exposure time and high-aspect-ratio fast wet development, the fabrication condition was optimized with respect to not the exposure dose but to the PMMA mean molecular weight (M.W.) changing after deep X-ray exposure as measured by gel permeation chromatography (GPC). Decrement of the PMMA M.W. and increment of the wet developer temperature accelerated the etching rate. Under optimized fabrication conditions, a microc...

  17. Fabrication and characterization of truly 3-D diffuser/nozzle microstructures in silicon

    DEFF Research Database (Denmark)

    Heschel, Matthias; Müllenborn, Matthias; Bouwstra, Siebe

    1997-01-01

    We present microfabrication and characterization of truly three-dimensional (3-D) diffuser/nozzle structures in silicon. Chemical vapor deposition (CVD), reactive ion etching (RIE), and laser-assisted etching are used to etch flow chambers and diffuser/nozzle elements. The flow behavior of the fa...... of the fabricated elements and the dependence of diffuser/nozzle efficiency on structure geometry has been investigated. The large freedom of 3-D micromachining combined with rapid prototyping allows one to characterize and optimize diffuser/nozzle structures...

  18. On the texturization of monocrystalline silicon with sodium carbonate solutions

    Energy Technology Data Exchange (ETDEWEB)

    Vallejo, B.; Gonzalez-Manas, M.; Martinez-Lopez, J.; Caballero, M.A. [Departamento de Cristalografia, Facultad de Ciencias, Universidad de Cadiz, 11510 Puerto Real (Spain)

    2007-05-15

    The texturization of monocrystalline silicon wafers using sodium carbonate solution has been investigated. This etching process has been evaluated in terms of the surface morphology and the reflectance value. The results show that for low concentration of sodium carbonate the increase of texturing time decreases the reflectance value because of the change in morphology from hillocks to pyramidal; on the contrary for intermediate and high concentrations the increase of time has a detrimental effect on texturization because it increases both the pyramid sizes and their non-uniform distribution. However, a good cell performance could be obtained by etching at high concentrations and short times. (author)

  19. Porous silicon technology for integrated microsystems

    Science.gov (United States)

    Wallner, Jin Zheng

    With the development of micro systems, there is an increasing demand for integrable porous materials. In addition to those conventional applications, such as filtration, wicking, and insulating, many new micro devices, including micro reactors, sensors, actuators, and optical components, can benefit from porous materials. Conventional porous materials, such as ceramics and polymers, however, cannot meet the challenges posed by micro systems, due to their incompatibility with standard micro-fabrication processes. In an effort to produce porous materials that can be used in micro systems, porous silicon (PS) generated by anodization of single crystalline silicon has been investigated. In this work, the PS formation process has been extensively studied and characterized as a function of substrate type, crystal orientation, doping concentration, current density and surfactant concentration and type. Anodization conditions have been optimized for producing very thick porous silicon layers with uniform pore size, and for obtaining ideal pore morphologies. Three different types of porous silicon materials: meso porous silicon, macro porous silicon with straight pores, and macro porous silicon with tortuous pores, have been successfully produced. Regular pore arrays with controllable pore size in the range of 2mum to 6mum have been demonstrated as well. Localized PS formation has been achieved by using oxide/nitride/polysilicon stack as masking materials, which can withstand anodization in hydrofluoric acid up to twenty hours. A special etching cell with electrolytic liquid backside contact along with two process flows has been developed to enable the fabrication of thick macro porous silicon membranes with though wafer pores. For device assembly, Si-Au and In-Au bonding technologies have been developed. Very low bonding temperature (˜200°C) and thick/soft bonding layers (˜6mum) have been achieved by In-Au bonding technology, which is able to compensate the potentially

  20. DURIP 99 - Instrumentation for Deposition and Etching of Ferromagnetic Nanoparticles

    National Research Council Canada - National Science Library

    Kummel, Andrew

    2000-01-01

    .... Since silver is much more difficult to etch than iron due to the lack of volatile silver halides, this spontaneous coating of Fe by Ag explains the difficulty in etching Fe particles deposited on Ag substrates. (b...

  1. Influence of different pre-etching times on fatigue strength of self-etch adhesives to dentin.

    Science.gov (United States)

    Takamizawa, Toshiki; Barkmeier, Wayne W; Tsujimoto, Akimasa; Suzuki, Takayuki; Scheidel, Donal D; Erickson, Robert L; Latta, Mark A; Miyazaki, Masashi

    2016-04-01

    The purpose of this study was to use shear bond strength (SBS) and shear fatigue strength (SFS) testing to determine the influence on dentin bonding of phosphoric acid pre-etching times before the application of self-etch adhesives. Two single-step self-etch universal adhesives [Prime & Bond Elect (EL) and Scotchbond Universal (SU)], a conventional single-step self-etch adhesive [G-aenial Bond (GB)], and a two-step self-etch adhesive [OptiBond XTR (OX)] were used. The SBS and SFS values were obtained with phosphoric acid pre-etching times of 3, 10, or 15 s before application of the adhesives, and for a control without pre-etching. For groups with 3 s of pre-etching, SU and EL showed higher SBS values than control groups. No significant difference was observed for GB among the 3 s, 10 s, and control groups, but the 15 s pre-etching group showed significantly lower SBS and SFS values than the control group. No significant difference was found for OX among the pre-etching groups. Reducing phosphoric acid pre-etching time can minimize the adverse effect on dentin bonding durability for the conventional self-etch adhesives. Furthermore, a short phosphoric acid pre-etching time enhances the dentin bonding performance of universal adhesives. © 2016 Eur J Oral Sci.

  2. Etching of uranium dioxide in nitrogen trifluoride RF plasma glow discharge

    Science.gov (United States)

    Veilleux, John Mark

    1999-10-01

    A series of room temperature, low pressure (10.8 to 40 Pa), low power (25 to 210 W) RF plasma glow discharge experiments with UO2 were conducted to demonstrate that plasma treatment is a viable method for decontaminating UO2 from stainless steel substrates. Experiments were conducted using NF3 gas to decontaminate depleted uranium dioxide from stainless-steel substrates. Results demonstrated that UO2 can be completely removed from stainless-steel substrates after several minutes processing at under 200 W. At 180 W and 32.7 Pa gas pressure, over 99% of all UO2 in the samples was removed in just 17 minutes. The initial etch rate in the experiments ranged from 0.2 to 7.4 mum/min. Etching increased with the plasma absorbed power and feed gas pressure in the range of 10.8 to 40 Pa. A different pressure effect on UO2 etching was also noted below 50 W in which etching increased up to a maximum pressure, ˜23 Pa, then decreased with further increases in pressure. A computer simulation, CHEMKIN, was applied to predict the NF3 plasma species in the experiments. The code was validated first by comparing its predictions of the NF3 plasma species with mass spectroscopy etching experiments of silicon. The code predictions were within +/-5% of the measured species concentrations. The F atom radicals were identified as the primary etchant species, diffusing from the bulk plasma to the UO2 surface and reacting to form a volatile UF6, which desorbed into the gas phase to be pumped away. Ions created in the plasma were too low in concentration to have a major effect on etching, but can enhance the etch rate by removing non-volatile reaction products blocking the reaction of F with UO2. The composition of these non-volatile products were determined based on thermodynamic analysis and the electronic structure of uranium. Analysis identified possible non-volatile products as the uranium fluorides, UF2-5, and certain uranium oxyfluorides UO2F, UO2F2, UOF3, and UOF 4 which form over the

  3. Photochemical etching of GaAs using synchrotron radiation

    Energy Technology Data Exchange (ETDEWEB)

    Terakado, Shingo; Nishino, Jun-ichi; Morigami, Mitsuaki; Harada, Mitsuaki; Suzuki, Shigeo (SANYO Electric Co. Ltd., Tsukuba, Ibaraki (Japan). Tsukuba Research Center); Tanaka, Kenichiro; Chikawa, Jun-ichi

    1990-05-01

    The photochemical etching of gallium arsenide by chlorine was investigated using synchrotron radiation. At the substrate temperatures above 25degC, both the irradiated and nonirradiated regions were uniformly etched. In case of substrate temperatures below -25degC, highly selective etching was observed in the irradiated region. We considered that at low temperatures, etching reaction caused by gas-phase excitation is suppressed and photochemical surface reaction becomes dominant. (author).

  4. Growth of KOH etched AZO nanorods and investigation of its back scattering effect in thin film a-Si solar cell

    Science.gov (United States)

    Sharma, Jayasree Roy; Mitra, Suchismita; Ghosh, Hemanta; Das, Gourab; Bose, Sukanta; Mandal, Sourav; Mukhopadhyay, Sumita; Saha, Hiranmay; Barua, A. K.

    2018-02-01

    In order to increase the stabilized efficiencies of thin film silicon (TFS) solar cells it is necessary to use better light management techniques. Texturization by etching of sputtered aluminum doped zinc oxide (Al:ZnO or AZO) films has opened up a variety of promises to optimize light trapping schemes. RF sputtered AZO film has been etched by potassium hydroxide (KOH). A systematic study of etching conditions such as etchant concentration, etching time, temperature management etc. have been performed in search of improved electrical and optical performances of the films. The change in etching conditions has exhibited a noticeable effect on the structure of AZO films for which the light trapping effect differs. After optimizing the etching conditions, nanorods have been found on the substrate. Hence, nanorods have been developed only by chemical etching, rather than the conventional development method (hydrothermal method, sol-gel method, electrolysis method etc.). The optimized etched substrate has 82% transmittance, moderate haze in the visible range and sheet resistance ∼13 (Ω/□). The developed nanorods (optimized etched substrate) provide better light trapping within the cell as the optical path length has been increased by using the nanorods. This provides an effect on carrier collection as well as the efficiency in a-Si solar cells. Finite difference time domain (FDTD) simulations have been performed to observe the light trapping by AZO nanorods formed on sputtered AZO films. For a p-i-n solar cell developed on AZO nanorods coated with sputtered AZO films, it has been found through simulations that, the incident light is back scattered into the absorbing layer, leading to an increase in photogenerated current and hence higher efficiency. It has been found that, the light that passes through the nanorods is not getting absorbed and maximum amount of light is back scattered towards the solar cell.

  5. Special equipment for etching nitrocellulose film

    International Nuclear Information System (INIS)

    Domanus, J.C.

    1983-08-01

    Nitrocellulose film and converter screens used for neutron radiography are described. Difficulties in visualization of radiographs on those films are mentioned. Because there is no equipment for etching nitrocellulose film available on the market Risoe has designed and produced such equipment at an estimated cost of Dkr. 15,000. Design criteria for this equipment are given and its performance described

  6. Orientation Dependent Directed Etching of Aluminum

    International Nuclear Information System (INIS)

    Lee, Dong Nyung; Seo, Jong Hyun

    2009-01-01

    The direct-current electroetching of high purity aluminum in hot aqueous-chloride solution produces a high density of micrometer-wide tunnels whose walls are made up of the |100| planes and penetrate aluminum in the directions at rates of micrometer per second. In the process of the alternating-current pitting of aluminum, cathodic polarization plays an important role in the nucleation and growth of the pits during the subsequent polarization. The direct-current tunnel etching and alternating-current etching of aluminum are basically related to the formation of poorly crystallized or amorphous passive films. If the passive film forms on the wall, a natural misfit exists between the film and the aluminum substrate, which in turn gives rise to stress in both the film and the substrate. Even though the amorphous films do not have directed properties, their stresses are influenced by the substrate orientation. the films on elastically soft substrate are likely to be less stressed and more stable than those on elastically hard substrate. The hardest and softest planes of aluminum are the |111| and |100| planes, respectively. Therefore, the films on the |111| substrates are most likely to be attacked, and those on the |100| substrates, are least likely to be attacked. For the tunnel etching, it follows that the tunnel walls tend to be made of four closely packed |111| planes in order to minimize the surface energy, which gives rise to the tunnel etching

  7. Transport through track etched polymeric blend membrane

    Indian Academy of Sciences (India)

    Polymer blends of polycarbonate (PC) and polysulphone (PSF) having thickness, 27 m, are prepared by solution cast method. The transport properties of pores in a blend membrane are examined. The pores were produced in this membrane by a track etching technique. For this purpose, a thin polymer membrane was ...

  8. Silicon Nano fabrication by Atomic Force Microscopy-Based Mechanical Processing

    International Nuclear Information System (INIS)

    Miyake, Sh.; Wang, M.; Kim, J.

    2014-01-01

    This paper reviews silicon nano fabrication processes using atomic force microscopy (AFM). In particular, it summarizes recent results obtained in our research group regarding AFM-based silicon nano fabrication through mechanochemical local oxidation by diamond tip sliding, as well as mechanical, electrical, and electromechanical processing using an electrically conductive diamond tip. Microscopic three-dimensional manufacturing mainly relies on etching, deposition, and lithography. Therefore, a special emphasis was placed on nano mechanical processes, mechanochemical reaction by potassium hydroxide solution etching, and mechanical and electrical approaches. Several important surface characterization techniques consisting of scanning tunneling microscopy and related techniques, such as scanning probe microscopy and AFM, were also discussed.

  9. Comparison of Self-Etch Primers with Conventional Acid Etching System on Orthodontic Brackets.

    Science.gov (United States)

    Zope, Amit; Zope-Khalekar, Yogita; Chitko, Shrikant S; Kerudi, Veerendra V; Patil, Harshal Ashok; Bonde, Prasad Vasudeo; Jaltare, Pratik; Dolas, Siddhesh G

    2016-12-01

    The self-etching primer system consists of etchant and primer dispersed in a single unit. The etching and priming are merged as a single step leading to fewer stages in bonding procedure and reduction in the number of steps that also reduces the chance of introduction of error, resulting in saving time for the clinician. It also results in smaller extent of enamel decalcification. To compare the Shear Bond Strength (SBS) of orthodontic bracket bonded with Self-Etch Primers (SEP) and conventional acid etching system and to study the surface appearance of teeth after debonding; etching with conventional acid etch and self-etch priming, using stereomicroscope. Five Groups (n=20) were created randomly from a total of 100 extracted premolars. In a control Group A, etching of enamel was done with 37% phosphoric acid and bonding of stainless steel brackets with Transbond XT (3M Unitek, Monrovia, California). Enamel conditioning in left over four Groups was done with self-etching primers and adhesives as follows: Group B-Transbond Plus (3M Unitek), Group C Xeno V+ (Dentsply), Group D-G-Bond (GC), Group E-One-Coat (Coltene). The Adhesive Remnant Index (ARI) score was also evaluated. Additionally, the surface roughness using profilometer were observed. Mean SBS of Group A was 18.26±7.5MPa, Group B was 10.93±4.02MPa, Group C was 6.88±2.91MPa while of Group D was 7.78±4.13MPa and Group E was 10.39±5.22MPa respectively. In conventional group ARI scores shows that over half of the adhesive was remaining on the surface of tooth (score 1 to 3). In self-etching primer groups ARI scores show that there was no or minor amount of adhesive remaining on the surface of tooth (score 4 and 5). SEP produces a lesser surface roughness on the enamel than conventional etching. However, statistical analysis shows significant correlation (p<0.001) of bond strength with surface roughness of enamel. All groups might show clinically useful SBS values and Transbond XT can be successfully used

  10. Study of the deposition process of vinpocetine on the surface of porous silicon

    Science.gov (United States)

    Lenshin, A. S.; Polkovnikova, Yu. A.; Seredin, P. V.

    Currently the most prospective way in pharmacotherapy is the obtaining of nanoparticles involving pharmaceutical substances. Application of porous inorganic materials on the basis of silicon is among the main features in solving of this problem. The present work is concerned with the problem of the deposition of pharmaceutical drug with nootropic activity - vinpocetine - into porous silicon. Silicon nanoparticles were obtained by electrochemical anodic etching of Si plates. The process of vinpocetine deposition was studied in dependence of the deposition time. As a result of the investigations it was found that infrared transmission spectra of porous silicon with the deposited vinpocetine revealed the absorption bands characteristic of vinpocetine substance.

  11. Microtensile bond strength of etch and rinse versus self-etch adhesive systems.

    Science.gov (United States)

    Hamouda, Ibrahim M; Samra, Nagia R; Badawi, Manal F

    2011-04-01

    The aim of this study was to compare the microtensile bond strength of the etch and rinse adhesive versus one-component or two-component self-etch adhesives. Twelve intact human molar teeth were cleaned and the occlusal enamel of the teeth was removed. The exposed dentin surfaces were polished and rinsed, and the adhesives were applied. A microhybride composite resin was applied to form specimens of 4 mm height and 6 mm diameter. The specimens were sectioned perpendicular to the adhesive interface to produce dentin-resin composite sticks, with an adhesive area of approximately 1.4 mm(2). The sticks were subjected to tensile loading until failure occurred. The debonded areas were examined with a scanning electron microscope to determine the site of failure. The results showed that the microtensile bond strength of the etch and rinse adhesive was higher than that of one-component or two-component self-etch adhesives. The scanning electron microscope examination of the dentin surfaces revealed adhesive and mixed modes of failure. The adhesive mode of failure occurred at the adhesive/dentin interface, while the mixed mode of failure occurred partially in the composite and partially at the adhesive/dentin interface. It was concluded that the etch and rinse adhesive had higher microtensile bond strength when compared to that of the self-etch adhesives. Copyright © 2010 Elsevier Ltd. All rights reserved.

  12. Comparative Analysis of in vitro Performance of Total-Etch and Self-Etch Adhesives

    Directory of Open Access Journals (Sweden)

    Timur V. Melkumyan

    2016-12-01

    Full Text Available The aim of the study was in vitro assessment of shear bond strength and micro-leakage after application of total-etch and self-etch adhesive systems. Materials and Methods: Four adhesive systems were chosen for assessment of adhesion performance: Contax (DMG, GmbH, Bond Force (Tokuyama Dental Corp. Japan Mfr, Te-Econom Bond (Ivoclar Vivadent, Liechtenstein and Swisstec SL Bond (Coltene, Switzerland. The assessment of bond strength was performed on 20 tooth samples, which were prepared in accordance with the UltraTest technique for shear bond strength (SBS estimation. The test was conducted at a crosshead speed of 1.0 mm/min and results were fixed in kilograms. The assessment of SBS was performed on enamel and dentin separately. Microleakage assessment of self-etch and total-etch adhesive systems was performed on 20 extracted non-carious upper human premolars with immersion in 1% methylene blue solution after thermocycling. Results: Good SBS results and microleakage values on the dentin substrate were obtained after application of the Contax self-etch bonding agent. But the values of bond strength to enamel and the extent of dye penetration within the composite-enamel interface were still better with the total-etch approach.

  13. Influence of the ratio of surfactant additives on the anisotropic etching process used to make small pyramids for use in solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chung Ping [Yuan Ze University, Chungli, Taiwan (China); Fu Jen University, New Taipei, Taiwan (China); Chang, Ming Wei; Chuang, Chuan Lung [Yuan Ze University, Chungli, Taiwan (China)

    2014-05-15

    This paper focuses on surfactant additives (SA) that are used in alkaline etching of p-type monocrystalline silicon wafers for use in screen-printed silicon solar cells. An Al/p-type Si/ntype SiP/SiN{sub x}/Ag solar cell with an active area of 15.6 cm{sup 2} was fabricated. The highest measured efficiency of the solar cells was 19.24%, which proves that the SA method is highly efficient for fabricating monocrystalline silicon solar cells. The results show that 0.4 L of SA is the most favorable volume for alkaline etching of solar-cell samples. Samples etched at this volume exhibit the lowest average reflectance of 0.596%, an average internal quantum efficiency (IQE) gain of 5.6% and an efficiency gain of 0.84%, thus showing the SA method to be an efficient anisotropic etching process. In addition, the cell with the highest efficiency had an increase of 4.57% in power, an increase of 3.1% in the short-circuit current, and an increase of 1.43% in the open-circuit voltage. In summary, microstructural, reflectance, IQE, and I - V measurements revealed that the best cell was formed using an optimal SA volume of 0.4 L.

  14. Silicon Qubits

    Energy Technology Data Exchange (ETDEWEB)

    Ladd, Thaddeus D. [HRL Laboratories, LLC, Malibu, CA (United States); Carroll, Malcolm S. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2018-02-28

    Silicon is a promising material candidate for qubits due to the combination of worldwide infrastructure in silicon microelectronics fabrication and the capability to drastically reduce decohering noise channels via chemical purification and isotopic enhancement. However, a variety of challenges in fabrication, control, and measurement leaves unclear the best strategy for fully realizing this material’s future potential. In this article, we survey three basic qubit types: those based on substitutional donors, on metal-oxide-semiconductor (MOS) structures, and on Si/SiGe heterostructures. We also discuss the multiple schema used to define and control Si qubits, which may exploit the manipulation and detection of a single electron charge, the state of a single electron spin, or the collective states of multiple spins. Far from being comprehensive, this article provides a brief orientation to the rapidly evolving field of silicon qubit technology and is intended as an approachable entry point for a researcher new to this field.

  15. A TEMPORAL MAP IN GEOSTATIONARY ORBIT: THE COVER ETCHING ON THE EchoStar XVI ARTIFACT

    International Nuclear Information System (INIS)

    Weisberg, Joel M.; Paglen, Trevor

    2012-01-01

    Geostationary satellites are unique among orbital spacecraft in that they experience no appreciable atmospheric drag. After concluding their respective missions, geostationary spacecraft remain in orbit virtually in perpetuity. As such, they represent some of human civilization's longest lasting artifacts. With this in mind, the EchoStar XVI satellite, to be launched in fall 2012, will play host to a time capsule intended as a message for the deep future. Inspired in part by the Pioneer Plaque and Voyager Golden Records, the EchoStar XVI Artifact is a pair of gold-plated aluminum jackets housing a small silicon disk containing 100 photographs. The Cover Etching, the subject of this paper, is etched onto one of the two jackets. It is a temporal map consisting of a star chart, pulsar timings, and other information describing the epoch from which EchoStar XVI came. The pulsar sample consists of 13 rapidly rotating objects, 5 of which are especially stable, having spin periods <10 ms and extremely small spin-down rates. In this paper, we discuss our approach to the time map etched onto the cover and the scientific data shown on it, and we speculate on the uses that future scientists may have for its data. The other portions of the EchoStar XVI Artifact will be discussed elsewhere.

  16. SU-8 etching in inductively coupled oxygen plasma

    DEFF Research Database (Denmark)

    Rasmussen, Kristian Hagsted; Keller, Stephan Sylvest; Jensen, Flemming

    2013-01-01

    Structuring or removal of the epoxy based, photo sensitive polymer SU-8 by inductively coupled plasma reactive ion etching (ICP-RIE) was investigated as a function of plasma chemistry, bias power, temperature, and pressure. In a pure oxygen plasma, surface accumulation of antimony from the photo......-initiator introduced severe roughness and reduced etch rate significantly. Addition of SF6 to the plasma chemistry reduced the antimony surface concentration with lower roughness and higher etch rate as an outcome. Furthermore the etch anisotropy could be tuned by controlling the bias power. Etch rates up to 800 nm...

  17. Evolution of patterned and unpatterned surfaces during high temperature annealing and plasma etching

    Science.gov (United States)

    Kwon, Taesoon

    In this thesis we describe experiments designed to probe spontaneous and directed surface evolution during annealing and plasma etching of three materials of high technological interest: silicon, nanoporous silica and photoresist. Vicinal Si(111) surfaces provide a source of steps whose configuration we control via the introduction of a topographic pattern; this is done using combination of photolithography and reactive ion etching. We study the length scale dependence of self-organization of step bunches during annealing at ˜1273°C in ultrahigh vacuum (UHV), resulting from sublimation and diffusion, and the competition between effects due to the intrinsic stiffness of steps and their mutual interactions. We also show the results of numerical simulations on these surfaces based upon a simple model of step motion, which we compare with our experimental observations. Nanoporous silica (NPS) is a heterogeneous material which is of potential use in micro/nanoelectronic applications requiring an insulator with a small dielectric constant. We investigate the stability of the NPS-plasma interface during etching, comparing the tendency for spontaneous pattern formation with the persistence of patterned perturbations. We study samples with various porosity (0˜50 vol.%) under low pressure C4F8/90%Ar plasma etching conditions. Our AFM characterization of unpatterned surfaces shows a monotonic increase in RMS roughness with etching time. Annealing etched NPS surfaces at temperatures over the range from 300˜900°C in UHV as well as in non-oxidizing environment produces no significant relaxation of etching-induced surface roughness. Statistical analysis using a height-height correlation function reveals that NPS surfaces do not show a simple scaling behavior during the technologically-relevant transient time regime. Etching of patterned surfaces reveals a persistent period of approximately 400 nm, which is ˜4 times that which spontaneously appears during etching of

  18. Influence factors on etching rate of PET nuclear pore membrane

    International Nuclear Information System (INIS)

    Zuo Zhenzhong; Wu Zhendong; Liang Haiying; Ju Wei; Chen Dongfeng; Fu Yuanyong; Qu Guopu

    2014-01-01

    Background: The nuclear pore membrane is a kind of liquid filtration material manufactured by irradiation and chemical etching. Various conditions in etch process have a great influence on etch rate. Purpose: The influence factors of concentration and temperature of etch solution and the irradiation energy of heavy ions on etch rate was studied. Methods: Four layers of PET (polyethylene terephthalate) films were stacked together and were irradiated with 140-MeV 32 S ions at room temperature under vacuum conditions. Utilizing conductivity measurement technique, the electrical current changes through the u:radiated PET film were monitored during etching, from which the breakthrough time and therefore the track etching rate was calculated. Results: The results show that there is an exponential correlation between etch rate and temperature, and a linear correlation between etch rate and concentration. The track etching rate increases linearly with energy loss rate. Empirical formula for the bulk etching rate as a function of etchant concentration and temperature was also established via fitting of measurements. Conclusion: It is concluded that by using 1.6-MeV·u -1 32 S ions, PET nuclear pore membrane with cylindrical pore shape can be prepared at 85℃ with etchant concentration of l mol·L -1 . (authors)

  19. Development of imaging techniques for fast neutron radiography in Japan

    International Nuclear Information System (INIS)

    Fujine, Shigenori; Yoneda, Kenji; Yoshii, Koji; Kamata, Masahiro; Tamaki, Masayoshi; Ohkubo, Kohei; Ikeda, Yasushi; Kobayashi, Hisao

    1999-01-01

    Neutron radiography with fast neutron beams (FNR) has been studied at the fast neutron source reactor 'YAYOI' of the University of Tokyo since 1986. Imaging techniques for FNR have been developed for CR-39 track-etch detector, electronic imaging system (television method), direct film method, imaging plate and also fast and thermal neutron concurrent imaging method. The review of FNR imaging techniques and some applications are reported in this paper

  20. Silicon based ultrafast optical waveform sampling

    DEFF Research Database (Denmark)

    Ji, Hua; Galili, Michael; Pu, Minhao

    2010-01-01

    A 300 nmx450 nmx5 mm silicon nanowire is designed and fabricated for a four wave mixing based non-linear optical gate. Based on this silicon nanowire, an ultra-fast optical sampling system is successfully demonstrated using a free-running fiber laser with a carbon nanotube-based mode-locker as th......A 300 nmx450 nmx5 mm silicon nanowire is designed and fabricated for a four wave mixing based non-linear optical gate. Based on this silicon nanowire, an ultra-fast optical sampling system is successfully demonstrated using a free-running fiber laser with a carbon nanotube-based mode......-locker as the sampling source. A clear eye-diagram of a 320 Gbit/s data signal is obtained. The temporal resolution of the sampling system is estimated to 360 fs....

  1. Wavelength tuning of porous silicon microcavities

    International Nuclear Information System (INIS)

    Mulders, J.; Reece, P.; Zheng, W.H.; Lerondel, G.; Sun, B.; Gal, M.

    2002-01-01

    Full text: In the last decade much attention has been given to porous silicon (PS) for optoelectronic applications, which include efficient room temperature light emission as well as microcavity formation. Due to the large specific surface area, the use of porous silicon microcavities (PSMs) has been proposed for chemical sensing. Large wavelength shifts have indicated that the optical properties of PSMs are indeed strongly dependent on the environment. In this paper, we report the shifting of the resonance frequency of high quality PSMs, with the aim of tuning a future PS device to a certain required wavelength. The PSM samples were prepared by anodically etching p + -doped (5mΩcm) bulk silicon wafer in a solution (25%) of aqueous HF and ethanol. The device structure consisted of a PS layer sandwiched between 2 stacks of thin PS layers with alternating high and low effective refractive indices (RI), i.e. distributed Bragg mirrors (DBM). The layer thickness depends on the etch time while the porosity and hence refractive index is determined by the current density as the Si is etched. The position and the width of the stop-band can be fully controlled by the design of the DBMs, with the microcavity resonance mode sitting within the stop-band. We achieved tuning of the microcavity resonance by a number of methods, including temperature dependent tuning. The temperature induced wavelength shift was found to be of the order of 10 -15 nm. Computer modeling of these changes in the reflectivity spectra allowed us to quantify the changes of the effective refractive index and the respective layer thicknesses

  2. Growth of carbon fibres, sheets and tubes on diamond films under high power plasma etching conditions

    International Nuclear Information System (INIS)

    Villalpando, I.; John, P.; Wilson, J. I. B.

    2017-01-01

    The application of diamond as a plasma facing material for fusion reactors can be limited by unknown reactions between diamond and the chamber materials transported by the plasma. Transformation of diamond to other structures can cause problems such as contamination of the plasma with loose particles or retention of gases. We have seen that diamond thin films are eroded under hydrogen plasma etching, but if silicon is present the growth of various carbon structures on diamond films is observed. We have produced carbon with different morphologies on diamond films including fibres, sheets with flower-like shapes and tubes and proposed growth mechanisms based on the results of scanning electron microscopy, X-ray photoelectron spectroscopy and Raman spectroscopy. Sample surfaces contain silicon and are oxidised having COO and CO groups as seen by XP S analysis. Raman analyses revealed a spectrum typical for graphite combined with that from diamond that remains on the surface after hydrogen bombardment. The results of this sturdy show the experimental conditions in which carbon fibres, sheets and tubes are produced under high-power hydrogen etching of diamond films and open the possibility to other applications such as catalysts, sensors and the production of electrodes. (Author)

  3. Growth of carbon fibres, sheets and tubes on diamond films under high power plasma etching conditions

    Energy Technology Data Exchange (ETDEWEB)

    Villalpando, I. [Centro de Investigacion de los Recursos Naturales, Antigua Normal Rural, Salaices, Lopez, Chihuahua (Mexico); John, P.; Wilson, J. I. B., E-mail: isaelav@hotmail.com [School of Engineering and Physical Sciences, Heriot-Watt University, Riccarton, Edinburgh, EH14-4AS (United Kingdom)

    2017-11-01

    The application of diamond as a plasma facing material for fusion reactors can be limited by unknown reactions between diamond and the chamber materials transported by the plasma. Transformation of diamond to other structures can cause problems such as contamination of the plasma with loose particles or retention of gases. We have seen that diamond thin films are eroded under hydrogen plasma etching, but if silicon is present the growth of various carbon structures on diamond films is observed. We have produced carbon with different morphologies on diamond films including fibres, sheets with flower-like shapes and tubes and proposed growth mechanisms based on the results of scanning electron microscopy, X-ray photoelectron spectroscopy and Raman spectroscopy. Sample surfaces contain silicon and are oxidised having COO and CO groups as seen by XP S analysis. Raman analyses revealed a spectrum typical for graphite combined with that from diamond that remains on the surface after hydrogen bombardment. The results of this sturdy show the experimental conditions in which carbon fibres, sheets and tubes are produced under high-power hydrogen etching of diamond films and open the possibility to other applications such as catalysts, sensors and the production of electrodes. (Author)

  4. Oxidation of hydrogen-passivated silicon surfaces by scanning near-field optical lithography using uncoated and aluminum-coated fiber probes

    DEFF Research Database (Denmark)

    Madsen, Steen; Bozhevolnyi, Sergey I.; Birkelund, Karen

    1997-01-01

    Optically induced oxidation of hydrogen-passivated silicon surfaces using a scanning near-field optical microscope was achieved with both uncoated and aluminum-coated fiber probes. Line scans on amorphous silicon using uncoated fiber probes display a three-peak profile after etching in potassium...

  5. A comparison of buried oxide characteristics of single and multiple implant SIMOX and bond and etch back wafers

    International Nuclear Information System (INIS)

    Annamalai, N.K.; Bockman, J.F.; McGruer, N.E.; Chapski, J.

    1990-01-01

    The current through the buried oxides of single and multiple implant SIMOX and bond and etch back silicon-on-insulator (BESOI) wafers were measured as a function of radiation dose. From these measurements, conductivity and static capacitances were derived. High frequency capacitances were also measured. Leakage current through the buried oxide of multiple implant SIMOX is considerably less than that of single implant SIMOX (more than an order of magnitude). High frequency and static capacitances, as a function of total dose, were used to study the buried oxide---top silicon interface and the buried oxide---bottom silicon interface. Multiple implant had fewer interface traps than single implant at pre-rad and after irradiation

  6. Wafer scale oblique angle plasma etching

    Science.gov (United States)

    Burckel, David Bruce; Jarecki, Jr., Robert L.; Finnegan, Patrick Sean

    2017-05-23

    Wafer scale oblique angle etching of a semiconductor substrate is performed in a conventional plasma etch chamber by using a fixture that supports a multiple number of separate Faraday cages. Each cage is formed to include an angled grid surface and is positioned such that it will be positioned over a separate one of the die locations on the wafer surface when the fixture is placed over the wafer. The presence of the Faraday cages influences the local electric field surrounding each wafer die, re-shaping the local field to be disposed in alignment with the angled grid surface. The re-shaped plasma causes the reactive ions to follow a linear trajectory through the plasma sheath and angled grid surface, ultimately impinging the wafer surface at an angle. The selected geometry of the Faraday cage angled grid surface thus determines the angle at with the reactive ions will impinge the wafer.

  7. A Broadband Silicon Seismic Package for Planetary Exploration

    Science.gov (United States)

    Pike, W. Thomas; Standley, Ian; Calcutt, Simon; Kedar, Sharon

    2017-04-01

    The Silicon Seismic Package (SSP) is a compact, 0.3 ng/rtHz sensitivity silicon microseismometer based on the hardware successfully delivered to the InSight Mars 2018 mission. The SSP provides a sensitivity and dynamic range comparable to significantly more massive broadband terrestrial instruments in a robust, compact package. Combined with a high resolution radiation-hardened digitiser under development, the SSP offers high performance seismic monitoring under a range of planetary environments. The sensor is micromachined from single-crystal silicon by through-wafer deep reactive-ion etching to produce a non-magnetic suspension and proof mass. It is robust to high shock (> 1000 g) and vibration (> 30 grms). For qualification SP units have undergone the full thermal cycles of the InSight mission and has been noise tested down to 208K and up to 330K, with no degradation in the performance in both cases. In addition, the sensor has been tested as functional down to 77K. The total mass for the three-axis SP delivery is 635g while the power requirement is less than 400 mW. The SSP has particular advantages for a planetary deployment. All three axes deliver full performance over a tilt range of ±1 m/s2 which allows for operation without levelling. With no magnetic sensitivity and a temperature sensitivity below 2E-5 m/s^2, there is no need for magnetic field monitoring and the additional resources for thermal isolation are also much reduced. In terms of performance the SSP has fast initialisation, reaching a noise floor below 1 ng/√Hz in less than a minute from an untilted configuration. The noise floor is 0.3 ng/rtHz from 10 s to 10 Hz, with a long period noise below 10 ng/rtHz at 1000s. This allows tidal measurements as well as seismic monitoring for a number of proposed planetary missions.

  8. Etching of glass microchips with supercritical water

    Czech Academy of Sciences Publication Activity Database

    Karásek, Pavel; Grym, Jakub; Roth, Michal; Planeta, Josef; Foret, František

    2015-01-01

    Roč. 15, č. 1 (2015), s. 311-318 ISSN 1473-0197 R&D Projects: GA ČR(CZ) GAP106/12/0522; GA ČR(CZ) GBP206/12/G014; GA MŠk(CZ) EE2.3.20.0182 Institutional support: RVO:68081715 Keywords : glass microchips * channel etching * supercritical water Subject RIV: CB - Analytical Chemistry, Separation Impact factor: 5.586, year: 2015

  9. Fabrication of 25 μm-filter microfluidic chip on silicon substrate

    Science.gov (United States)

    Ngan Le, Nguyen; Khanh Huynh, Kim; Cam Hue Phan, Thi; Dung Dang, Thi My; Chien Dang, Mau

    2017-03-01

    This paper presents the entire fabrication process including photolithography, sputtering, deep reactive ion etching (Bosch DRIE process) on silicon substrate and bonding process between the lid and silicon substrate to create a designed filtration microfluidic chip with dimension of 28 mm × 7 mm, one inlet port and one outlet port. A pattered silver thin film was deposited on a silicon sample by the lift-off method. Subsequently the newly fabricated sample was anisotropically etched by Bosch DRIE process. Some parameters of Bosch DRIE process such as bias power, duration of etching step and passivation step, oxygen presence were studied to explore the dependence of silicon channel depth and etched shape profile on these parameters. An optimized process was utilized to fabricate a featured silicon channel with vertical, smooth sidewalls and an overall good uniformity. The silicon channel has four arrays of microposts with various distances between microposts from 25 μm to 100 μm. The depth of the silicon channel was about 150 μm. After that, silicon substrate was bonded with mica lid by adhesive bonding method to form the completed filtration microfluidic chip. The samples were characterized by scanning electron microscopy (SEM), mechanical profilometer (DEKTAK 6 M), optical microscopy (Olympus MX51). In this paper a test was performed to demonstrate how the microfluidic chip works by pumping solution with many various sizes of particles through the inlet port of the microfluidic chip and obtaining a solution with desired particles sizes (smaller than 25 μm) through another port. Moreover, the chip could be pumped de-ionized water through outlet port for backwash in order to make this microfluidic chip reusable. Finally, a few applications of microfluidic chips are presented to illustrate the advantages of this technology and the potential for future development. Invited talk at 8th International Workshop on Advanced Materials Science and Nanotechnology

  10. Predicting synergy in atomic layer etching

    Energy Technology Data Exchange (ETDEWEB)

    Kanarik, Keren J. [Lam Research Corp., Fremont, CA (United States); Tan, Samantha [Lam Research Corp., Fremont, CA (United States); Yang, Wenbing [Lam Research Corp., Fremont, CA (United States); Kim, Taeseung [Lam Research Corp., Fremont, CA (United States); Lill, Thorsten [Lam Research Corp., Fremont, CA (United States); Kabansky, Alexander [Lam Research Corp., Fremont, CA (United States); Hudson, Eric A. [Lam Research Corp., Fremont, CA (United States); Ohba, Tomihito [Lam Research Corp., Fremont, CA (United States); Nojiri, Kazuo [Lam Research Corp., Fremont, CA (United States); Yu, Jengyi [Lam Research Corp., Fremont, CA (United States); Wise, Rich [Lam Research Corp., Fremont, CA (United States); Berry, Ivan L. [Lam Research Corp., Fremont, CA (United States); Pan, Yang [Lam Research Corp., Fremont, CA (United States); Marks, Jeffrey [Lam Research Corp., Fremont, CA (United States); Gottscho, Richard A. [Lam Research Corp., Fremont, CA (United States)

    2017-03-27

    Atomic layer etching (ALE) is a multistep process used today in manufacturing for removing ultrathin layers of material. In this article, the authors report on ALE of Si, Ge, C, W, GaN, and SiO2 using a directional (anisotropic) plasma-enhanced approach. The authors analyze these systems by defining an “ALE synergy” parameter which quantifies the degree to which a process approaches the ideal ALE regime. This parameter is inspired by the ion-neutral synergy concept introduced in the 1979 paper by Coburn and Winters. ALE synergy is related to the energetics of underlying surface interactions and is understood in terms of energy criteria for the energy barriers involved in the reactions. Synergistic behavior is observed for all of the systems studied, with each exhibiting behavior unique to the reactant–material combination. By systematically studying atomic layer etching of a group of materials, the authors show that ALE synergy scales with the surface binding energy of the bulk material. This insight explains why some materials are more or less amenable to the directional ALE approach. Furthermore, they conclude that ALE is both simpler to understand than conventional plasma etch processing and is applicable to metals, semiconductors, and dielectrics.

  11. Pattern inspection of etched multilayer EUV mask

    Science.gov (United States)

    Iida, Susumu; Hirano, Ryoichi; Amano, Tsuyoshi; Watanabe, Hidehiro

    2015-10-01

    Patterned mask inspection for an etched multilayer (ML) EUV mask was investigated. In order to optimize the mask structure from the standpoint of not only a pattern inspection by using a projection electron microscope (PEM), but also by considering the other fabrication processes using electron beam (EB) techniques such as CD metrology and mask repair, we employed a conductive layer between the ML and substrate. By measuring the secondary electron emission coefficients (SEECs) of the candidate materials for conductive layer, we evaluated the image contrast and the influence of charging effect. In the cases of 40-pair-ML, 16 nm sized extrusion and intrusion defects were found to be detectable more than 10 sigma in hp 44 nm, 40 nm, and 32 nm line and space (L/S) patterns. Reducing 40-pair-ML to 20-pair-ML degraded the image contrast and the defect detectability. However, by selecting B4C as a conductive layer, 16 nm sized defects remained detectable. These defects were also detected after the etched part was refilled with Si. Moreover, the simulation shows a high sensitivity for detecting the residual-type defects (etching residues). A double layer structure with 2.5-nm-thik B4C on metal film used as a conductive layer was found to have sufficient conductivity and also was found to be free from the surface charging effect and influence of native oxide.

  12. Shapes of agglomerates in plasma etching reactors

    International Nuclear Information System (INIS)

    Huang, F.Y.; Kushner, M.J.

    1997-01-01

    Dust particle contamination of wafers in reactive ion etching (RIE) plasma tools is a continuing concern in the microelectronics industry. It is common to find that particles collected on surfaces or downstream of the etch chamber are agglomerates of smaller monodisperse spherical particles. The shapes of the agglomerates vary from compact, high fractal dimension structures to filamentary, low fractal dimension structures. These shapes are important with respect to the transport of particles in RIE tools under the influence electrostatic and ion drag forces, and the possible generation of polarization forces. A molecular dynamics simulation has been developed to investigate the shapes of agglomerates in plasma etching reactors. We find that filamentary, low fractal dimension structures are generally produced by smaller (<100s nm) particles in low powered plasmas where the kinetic energy of primary particles is insufficient to overcome the larger Coulomb repulsion of a compact agglomerate. This is analogous to the diffusive regime in neutral agglomeration. Large particles in high powered plasmas generally produce compact agglomerates of high fractal dimension, analogous to ballistic agglomeration of neutrals. copyright 1997 American Institute of Physics

  13. SAXS investigation of un-etched and etched ion tracks in polycarbonate

    Science.gov (United States)

    Hossain, U. H.; Rodriguez, M. D.; Schauries, D.; Hadley, A.; Schleberger, M.; Trautmann, C.; Mudie, S.; Kluth, P.

    2017-10-01

    Investigation of the ion track morphologies and track etching behaviour in polycarbonate (PC) films was carried out using synchrotron based small-angle X-ray scattering (SAXS) measurements. The tracks were induced by Au ions with kinetic energies of 1.7 and 2.2 GeV with applied fluences between 1 × 1010 and 1 × 1012 ions/cm2. The average radii of the un-etched tracks were studied as a function of the irradiation fluence, indicating a general ion induced degradation of the polymer, with a simultaneous increase in ion track radius from 2.6 ± 0.002 nm to 3.4 ± 0.03 nm. Chemical etching of the ion tracks in PC leads to the formation of cylindrical pores. The pore radius increases linearly with etching time. In 3 M NaOH at 55 °C, a radial etching rate of 9.2 nm/min is observed.

  14. Fabrication of combined-scale nano- and microfluidic polymer systems using a multilevel dry etching, electroplating and molding process

    DEFF Research Database (Denmark)

    Tanzi, Simone; Østergaard, Peter Friis; Matteucci, Marco

    2012-01-01

    Microfabricated single-cell capture and DNA stretching devices have been produced by injection molding. The fabrication scheme employed deep reactive ion etching in a silicon substrate, electroplating in nickel and molding in cyclic olefin polymer. This work proposes technical solutions to fabric......Microfabricated single-cell capture and DNA stretching devices have been produced by injection molding. The fabrication scheme employed deep reactive ion etching in a silicon substrate, electroplating in nickel and molding in cyclic olefin polymer. This work proposes technical solutions...... to fabrication challenges associated with chip sealing and demolding of polymer high-volume replication methods. UV-assisted thermal bonding was found to ensure a strong seal of the microstructures in the molded part without altering the geometry of the channels. In the DNA stretching device, a low aspect ratio...... nanoslit (1/200) connecting two larger micro-channels was used to stretch a 168.5 kbp DNA molecule, while in the other device single-HeLa cells were captured against a micro-aperture connecting two larger microfluidic channels. Different dry etching processes have been investigated for the master...

  15. Investigation of the phase formation from nickel coated nanostructured silicon

    Science.gov (United States)

    Shilyaeva, Yulia I.; Pyatilova, Olga V.; Berezkina, Alexandra Yu.; Sysa, Artem V.; Dudin, Alexander A.; Smirnov, Dmitry I.; Gavrilov, Sergey A.

    2016-12-01

    In this paper, the influence of the conditions of chemical and electrochemical nickel plating of nanostructured silicon and subsequent heat treatment on the phase composition of Si/Ni structures with advanced interface is studied. Nanostructured silicon formed by chemical and electrochemical etching was used for the formation of a developed interphase surface. The resulting Si/Ni samples were analyzed using scanning electron microscopy, energy dispersive X-ray analysis, and X-ray phase analysis. The experiments have revealed the differences in phase composition of the Si/Ni structures obtained by different methods, both before and after heat treatment.

  16. Electrochemical characteristics of bundle-type silicon nanorods as an anode material for lithium ion batteries

    International Nuclear Information System (INIS)

    Nguyen, Si Hieu; Lim, Jong Choo; Lee, Joong Kee

    2012-01-01

    Highlights: ► A metal-assisted chemical etching technique was performed on Si thin films. ► The etching process resulted in the formation of bundle-type Si nanorods. ► The morphology of Si electrodes closely relate to electrochemical characteristics. - Abstract: In order to prepare bundle-type silicon nanorods, a silver-assisted chemical etching technique was used to modify a 1.6 μm silicon thin film, which was deposited on Cu foil by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition. The bundle-type silicon nanorods on Cu foil were employed as anodes for a lithium secondary battery, without further treatment. The electrochemical characteristics of the pristine silicon thin film anodes and the bundle-type silicon nanorod anodes are different from one another. The electrochemical performance of the bundle-type silicon nanorod anodes exceeded that of the pristine Si thin film anodes. The specific capacity of the bundle-type silicon nanorod anodes is much higher than 3000 mAh g −1 at the first charge (Li insertion) cycle. The coulombic efficiency of bundle-type silicon anodes was stable at more than 97%, and the charge capacity remained at 1420 mAh g −1 , even after 100 cycles of charging and discharging. The results from the differential voltage analysis showed a side reaction at around 0.44–0.5 V, and the specific potential of this side reaction decreased after each cycle. The apparent diffusion coefficients of the two anode types were in the range of 10 −13 –10 −16 cm 2 s −1 in the first cycle. In subsequent charge cycles, these values for the silicon thin film anodes and the silicon nanorod bundle anode were approximately 10 −12 –10 −14 and 10 −13 –10 −15 cm 2 s −1 , respectively.

  17. Comparison of silicon nanocrystals prepared by two fundamentally different methods

    Czech Academy of Sciences Publication Activity Database

    Cibulka, Ondřej; Vorkotter, C.; Purkrt, Adam; Holovský, Jakub; Benedikt, J.; Herynková, Kateřina

    2016-01-01

    Roč. 11, Oct (2016), s. 1-7, č. článku 445. ISSN 1556-276X Grant - others:AV ČR(CZ) DAAD-16-18 Program:Bilaterální spolupráce Institutional support: RVO:68378271 Keywords : silicon nanocrystals * electrochemical etching * low-pressure plasma * photoluminescence * size distribution * surface passivation Subject RIV: BM - Solid Matter Physics ; Magnetism Impact factor: 2.833, year: 2016

  18. Unveiling the Formation Pathway of Single Crystalline Porous Silicon Nanowires

    Science.gov (United States)

    Zhong, Xing; Qu, Yongquan; Lin, Yung-Chen; Liao, Lei; Duan, Xiangfeng

    2011-01-01

    Porous silicon nanowire is emerging as an interesting material system due to its unique combination of structural, chemical, electronic, and optical properties. To fully understand their formation mechanism is of great importance for controlling the fundamental physical properties and enabling potential applications. Here we present a systematic study to elucidate the mechanism responsible for the formation of porous silicon nanowires in a two-step silver-assisted electroless chemical etching method. It is shown that silicon nanowire arrays with various porosities can be prepared by varying multiple experimental parameters such as the resistivity of the starting silicon wafer, the concentration of oxidant (H2O2) and the amount of silver catalyst. Our study shows a consistent trend that the porosity increases with the increasing wafer conductivity (dopant concentration) and oxidant (H2O2) concentration. We further demonstrate that silver ions, formed by the oxidation of silver, can diffuse upwards and re-nucleate on the sidewalls of nanowires to initiate new etching pathways to produce porous structure. The elucidation of this fundamental formation mechanism opens a rational pathway to the production of wafer-scale single crystalline porous silicon nanowires with tunable surface areas ranging from 370 m2·g−1 to 30 m2·g−1, and can enable exciting opportunities in catalysis, energy harvesting, conversion, storage, as well as biomedical imaging and therapy. PMID:21244020

  19. Fabrication of low-loss silicon-on-oxidized-porous-silicon strip waveguide using focused proton-beam irradiation

    OpenAIRE

    Teo, EJ; Bettiol, AA; Yang, P; Breese, MBH; Xiong, BQ; Mashanovich, GZ; Headley, WR; Reed, GT

    2009-01-01

    we have successfully fabricated low-loss silicon-on-oxidized-porous-silicon (SOPS) strip waveguides with high-index contrast using focused proton-beam irradiation and electrochemical etching. Smooth surface quality with rms roughness of 3.1 nm is achieved for a fluence of 1 x 10(15)/cm(2) after postoxidation treatment. Optical characterization at a wavelength of 1550 nm shows a loss of 1.1 +/- 0.4 dB/cm and 1.2 +/- 0.4 dB/cm in TE and TM polarization respectively, which we believe is the lowe...

  20. Photoacoustic spectroscopy analysis of silicon crystals

    International Nuclear Information System (INIS)

    Benamrani, H.; Satour, F.Z.; Zegadi, A.; Zouaoui, A.

    2012-01-01

    A high resolution fully automated photoacoustic spectrometer (PAS) of the gas-microphone type is used in the photon energy region 0.8–1.6 eV to analyze the optical properties of silicon single crystals at different frequencies between 25 and 312 Hz. At modulating frequencies at which the sample thickness approaches its thermal diffusion length, the results obtained of untreated specimens using different PA cells reveal the presence of several peaks in the absorption tail, some of which are independent of the photon energy. The magnitude of these peaks is seen to be stronger than that of the maximum of the fundamental edge of silicon, thus making it indistinct. At lower modulating frequencies at which the sample thickness is far less than its thermal diffusion length and using a highly reflecting backing material, multiple reflections of the light beam within the sample interfaces are seen to enhance the PA amplitude signal sensitivity response as predicted theoretically. The effect of etching silicon samples in a diluted solution of hydrofluoric acid (5%) on photoacoustic spectra has been investigated. It is observed that this process removes all spurious features in the spectra originating from the surface contaminants making the fundamental absorption edge clearly visible and leaving only one distinct peak at hν=0.9 eV. Transmission-photoacoustic (T-PAS) has also been used to study silicon single crystals. In the light of recent literature a comparison is carried out between the results obtained using the two techniques in determining the absorption coefficient and the gap energy. - Highlights: ► High resolution photoacoustic spectrometer used to analyze silicon crystals. ► Effects of sample preparation and the photoacoustic cell in measurements. ► Transmission-photoacoustic spectroscopy use in the study of silicon crystals. ► Comparison between the two modes of operation to characterise silicon.

  1. Fast neutron detection using solid state nuclear track detectors

    International Nuclear Information System (INIS)

    Vilela, E.C.

    1990-01-01

    CR-39 and Makrofol-E solid state nuclear track detectors were studied aiming their application to fast neutron detection. Optimum etching conditions of those two kinds of materials were determined the followings - the Makrofol-E detector is electrochemically etched in a PEW solution (15% KOH, 40% ethilic alcohol and 45% water) for 2 h., with an applied electric field strength of 30 kV/cm (r/m/s/) and frequency of 2 kHz, at room temperature; - the CR-39 detector is chemically pre-etched during 1 h in a 20% (w/v) NaOH solution at 70 sup(0)C, followed by 13 h electrochemical etch using the same solution at room temperature and an electric field strength of 30 kV/cm (r.m.s.) and frequency of 2 kHz.(E.G.)

  2. The evolution of silicon wafer cleaning technology

    International Nuclear Information System (INIS)

    Kern, W.

    1990-01-01

    The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as RCA Standard Clean. This is still the primary method used in the industry. What has changed is its implementation with optimized equipment:from simple immersion to centrifugal spraying, megasonic techniques, and enclosed system processing that allow simultaneous removal of both contaminant films and particles. Improvements in wafer drying by use of isopropanol vapor or by slow-pull out of hot deionized water are being investigated. Several alternative cleaning methods are also being tested, including choline solutions, chemical vapor etching, and UV/ozone treatments. The evolution of silicon wafer cleaning processes and technology is traced and reviewed

  3. Histologic Evaluation of Human Pulp Response to Total Etch and Self Etch Adhesive Systems

    OpenAIRE

    Malekipour, Mohammad Reza; Razavi, Sayed Mohammad; Khazaei, Saber; Kazemi, Shantia; Behnamanesh, Maryam; Shirani, Farzaneh

    2013-01-01

    Background To investigate pulp response to the application of two types adhesive systems (total-etch and self-etch) in human premolar teeth. Materials and Methods Cavities limited to enamel walls in all margins with 2.5 mm depth were prepared on buccal surfaces of thirty three human premolars. The cavities were treated with the following adhesive. Single Bond (SB) and Prompt L-Pop (PLP). The teeth were extracted after 30 days and prepared due to histological technique. Results Pulp responses ...

  4. 3DX: a micromachined silicon crystallographic x-ray detector

    Science.gov (United States)

    Morse, John; Kenney, Christopher J.; Westbrook, Edwin M.; Naday, Istvan; Parker, Sherwood I.

    2003-01-01

    We are developing pixel detectors for macromolecular crystallography, in which diffracted X-rays are directly absorbed by high-resistivity, crystalline silicon that has been micro-machined by inductively-coupled plasma etching. Arrays of 64 × 64 holes at 150 μm pitch are first formed by etching through the entire silicon bulk, then backfilled with polysilicon that is doped to create conducting p and n type columnar electrodes. When reverse biased, these electrodes generate electric fields that define the individual pixels. By forming conducting polysilicon on the sides of the sensors, which are cut-out of the silicon wafer by plasma etching, the entire surface of the detector may be made active. CMOS readout integrated circuits are conductively bump bonded behind each 3D detector, providing a direct connection to every pixel. A large array will be assembled with no insensitive bands along the edges by overlapping these sensors, each of area 0.96cm2. This detector will measure X-ray signal intensities of up to 105 events/pixel/sec without any pile-up loss, by using an integration method that retains the benefits of discrete photon counting. The detector sensitivity will be highly uniform, it will not exhibit any dark signal or spurious noise, and no geometric distortion will occur within each sensor.

  5. In vitro bonding effectiveness of three different one-step self-etch adhesives with additional enamel etching.

    Science.gov (United States)

    Batra, Charu; Nagpal, Rajni; Tyagi, Shashi Prabha; Singh, Udai Pratap; Manuja, Naveen

    2014-08-01

    To evaluate the effect of additional enamel etching on the shear bond strength of three self-etch adhesives. Class II box type cavities were made on extracted human molars. Teeth were randomly divided into one control group of etch and rinse adhesive and three test groups of self-etch adhesives (Clearfil S3 Bond, Futurabond NR, Xeno V). The teeth in the control group (n = 10) were treated with Adper™ Single Bond 2. The three test groups were further divided into two subgroups (n = 10): (i) self-etch adhesive was applied as per the manufacturer's instructions; (ii) additional etching of enamel surfaces was done prior to the application of self-etch adhesives. All cavities were restored with Filtek Z250. After thermocycling, shear bond strength was evaluated using a Universal testing machine. Data were analyzed using anova independent sample's 't' test and Dunnett's test. The failure modes were evaluated with a stereomicroscope at a magnification of 10×. Additional phosphoric acid etching of the enamel surface prior to the application of the adhesive system significantly increased the shear bond strength of all the examined self-etch adhesives. Additional phosphoric acid etching of enamel surface significantly improved the shear bond strength. © 2013 Wiley Publishing Asia Pty Ltd.

  6. Investigation on the structural characterization of pulsed p-type porous silicon

    Science.gov (United States)

    Wahab, N. H. Abd; Rahim, A. F. Abd; Mahmood, A.; Yusof, Y.

    2017-08-01

    P-type Porous silicon (PS) was sucessfully formed by using an electrochemical pulse etching (PC) and conventional direct current (DC) etching techniques. The PS was etched in the Hydrofluoric (HF) based solution at a current density of J = 10 mA/cm2 for 30 minutes from a crystalline silicon wafer with (100) orientation. For the PC process, the current was supplied through a pulse generator with 14 ms cycle time (T) with 10 ms on time (Ton) and pause time (Toff) of 4 ms respectively. FESEM, EDX, AFM, and XRD have been used to characterize the morphological properties of the PS. FESEM images showed that pulse PS (PPC) sample produces more uniform circular structures with estimated average pore sizes of 42.14 nm compared to DC porous (PDC) sample with estimated average size of 16.37nm respectively. The EDX spectrum for both samples showed higher Si content with minimal presence of oxide.

  7. Three-dimensional collimation of in-plane-propagating light using silicon micromachined mirror

    Science.gov (United States)

    Sabry, Yasser M.; Khalil, Diaa; Saadany, Bassam; Bourouina, Tarik

    2014-03-01

    We demonstrate light collimation of single-mode optical fibers using deeply-etched three-dimensional curved micromirror on silicon chip. The three-dimensional curvature of the mirror is controlled by a process combining deep reactive ion etching and isotropic etching of silicon. The produced surface is astigmatic with out-of-plane radius of curvature that is about one half the in-plane radius of curvature. Having a 300-μm in-plane radius and incident beam inplane inclined with an angle of 45 degrees with respect to the principal axis, the reflected beam is maintained stigmatic with about 4.25 times reduction in the beam expansion angle in free space and about 12-dB reduction in propagation losses, when received by a limited-aperture detector.

  8. Sub-15nm Silicon Lines Fabrication via PS-b-PDMS Block Copolymer Lithography

    DEFF Research Database (Denmark)

    Rasappa, Sozaraj; Schulte, Lars; Borah, Dipu

    2013-01-01

    -b-PDMS (33 k–17 k) was conditioned by applying solvent and solvothermal annealing techniques. BCP nanopatterns formed after the annealing process have been confirmed by scanning electron microscope (SEM) after removal of upper PDMS wetting layer by plasma etching. Silicon nanostructures were obtained...

  9. Cell motility, morphology, viability and proliferation in response to nanotopography on silicon black.

    NARCIS (Netherlands)

    Łopacińska, Joanna M; Grǎdinaru, Cristian; Wierzbicki, Rafal; Købler, Carsten; Schmidt, Michael S; Madsen, Martin T; Skolimowski, Maciej; Dufva, Martin; Flyvbjerg, Henrik; Mølhave, Kristian

    2012-01-01

    Knowledge of cells' interactions with nanostructured materials is fundamental for bio-nanotechnology. We present results for how individual mouse fibroblasts from cell line NIH3T3 respond to highly spiked surfaces of silicon black that were fabricated by maskless reactive ion etching (RIE). We did

  10. Morphological and optical properties of n-type porous silicon: effect ...

    Indian Academy of Sciences (India)

    Home; Journals; Bulletin of Materials Science; Volume 39; Issue 7. Morphological and optical properties of n-type porous silicon: effect of etching current density. M DAS D SARKAR. Volume 39 Issue 7 ... Calculated crystallite size shows decreasing trend with increasing J value. The optical properties of these samples have ...

  11. Influence of copper foil polycrystalline structure on graphene anisotropic etching

    Energy Technology Data Exchange (ETDEWEB)

    Sharma, Kamal P. [Department of Frontier Materials, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555 (Japan); Mahyavanshi, Rakesh D. [Department of Physical Science and Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555 (Japan); Kalita, Golap, E-mail: kalita.golap@nitech.ac.jp [Department of Frontier Materials, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555 (Japan); Department of Physical Science and Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555 (Japan); Tanemura, Masaki [Department of Frontier Materials, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555 (Japan); Department of Physical Science and Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555 (Japan)

    2017-01-30

    Graphical abstract: Hexagonal hole formation with anisotropic etching independent of the stripes and wrinkles in the synthesized graphene. We also observed variation in etched pattern of the graphene depending on the base Cu grain orientations, attributing to difference in nucleation and growth process. - Highlights: • Reveal the influence of copper polycrystalline structure on anisotropic etching of graphene. • Hexagonal hole formation with etching is observed to be independent of stripes and wrinkles in graphene. • Variation in etched pattern of graphene depending on the base Cu grain is confirmed. • This finding will help to understand the nature of microscopic etched pattern in graphene. - Abstract: Anisotropic etching of graphene and other two dimensional materials is an important tool to understand the growth process as well as enabling fabrication of various well-defined structures. Here, we reveal the influence of copper foil polycrystalline structure on anisotropic etching process of as-synthesized graphene. Graphene crystals were synthesized on the polycrystalline Cu foil by a low-pressure chemical vapor deposition (LPCVD) system. Microscopic analysis shows difference in shape, size and stripes alignment of graphene crystals with dissimilar nucleation within closure vicinity of neighboring Cu grains. Post-growth etching of such graphene crystals also significantly affected by the crystallographic nature of Cu grains as observed by the field emission scanning electron microscope (FE-SEM) and electron back scattered diffraction (EBSD) analysis. Hexagonal hole formation with anisotropic etching is observed to be independent of the stripes and wrinkles in the synthesized graphene. We also observed variation in etched pattern of the graphene depending on the base Cu grain orientations, attributing to difference in nucleation and growth process. The findings can facilitate to understand the nature of microscopic etched pattern depending on metal

  12. Self-etch Adhesive Systems: A Literature Review

    OpenAIRE

    Giannini M.; Makishi P.; Ayres A.P.A.; Vermelho P.M.; Fronza B.M.; Nikaido T.; Tagami J.

    2015-01-01

    This paper presents the state of the art of self-etch adhesive systems. Four topics are shown in this review and included: the historic of this category of bonding agents, bonding mechanism, characteristics/properties and the formation of acid-base resistant zone at enamel/dentin-adhesive interfaces. Also, advantages regarding etch-and-rinse systems and classifications of self-etch adhesive systems according to the num...

  13. Novel silicon fabrication process for high-aspect-ratio micromachined parts

    Energy Technology Data Exchange (ETDEWEB)

    Fleming, J.G.; Barron, C.C.

    1995-08-01

    Bulk micromachining generally refers to processes involving wet chemical etching of structures formed out of the silicon substrate and so is limited to fairly large, crude structures. Surface micromachining allows intricate patterning of thin films of polysilicon and other materials to form essentially two-dimensional layered parts (since the thickness of the parts is limited by the thickness of the deposited films). There is a third type of micromachining in which the part is formed by filling a mold which was defined by photolithographic means. Historically micromachining molds have been formed in some sort of photopolymer, be it with x-ray lithography (``LIGA``) or more conventional UV lithography, with the aim of producing piece parts. Recently, however, several groups including ours at Sandia have independently come up with the idea of forming the mold for mechanical parts by etching into the silicon substrate itself. In Sandia`s mold process, the mold is recessed into the substrate using a deep silicon trench etch, lined with a sacrificial or etch-stop layer, and then filled with any of a number of mechanical materials. The completed structures are not ejected from the mold to be used as piece parts rather, the mold is dissolved from around selected movable segments of the parts, leaving the parts anchored to the substrate. Since the mold is recessed into the substrate, the whole micromechanical structure can be formed, planarized, and integrated with standard silicon microelectronic circuits before the release etch. In addition, unlike surface-micromachined parts, the thickness of the molded parts is limited by the depth of the trench etch (typically 10--50 {mu}m) rather than the thickness of deposited polysilicon (typically 2 {mu}m). The capability of fabricating thicker (and therefore much stiffer and more massive) parts is critical for motion-sensing structures involving large gimballed platforms, proof masses, etc.

  14. Silicon oxide sacrificial layers deposited by pulsed-DC magnetron sputtering for MEMS applications

    Science.gov (United States)

    González-Castilla, Sheila; Olivares, Jimena; Clement, Marta; Vergara, Lucía; Pulido, Laura; Iborra, Enrique; Sangrador, Jesús

    2009-05-01

    Surface micromachining requires the use of easily-removable sacrificial layers fully compatible with all the materials and technological processes involved. Silicon dioxide films, thermally grown on silicon substrates or deposited by CVD, are commonly used as sacrificial layers in surface micromachining technologies, despite their low lateral etch rate in conventional fluorinate solutions. The development of silicon oxide layers with high etch rates poses a great technological challenge. In this work we have investigated the possibility of obtaining easily removable silicon oxide layers by pulsed-DC magnetron reactive sputtering. We have carried out a comprehensive study of the influence of the deposition parameters (total pressure and gas composition) on the composition, residual stress and lateral etch rate in fluorine wet solutions of the films. This study has allowed to determine the sputtering conditions to deposit, at very high rates (up to 0.1 μm/min), silicon oxide films with excellent characteristics for their use as sacrificial layers. Films with roughness around 5 nm rms, residual stress below 100 MPa and very high etch rate (up to 5 μm/min in the lateral directions), around 70 times greater than for thermal silicon oxide, have been achieved. The structural characteristics of these easily removable silicon oxide layers have been assessed by infrared spectroscopy and atomic force microscopy, which have revealed that the films exhibit some kind of porous structure, related to very specific sputter conditions. Finally, the viability of these films has been demonstrated by using them as sacrificial layer in the fabrication process of AlN-based microresonators.

  15. Influence of asymmetric etching on ion track shapes in polycarbonate

    International Nuclear Information System (INIS)

    Clochard, M.-C.; Wade, T.L.; Wegrowe, J.-E.; Balanzat, E.

    2007-01-01

    By combining low-energy ion irradiation with asymmetric etching, conical nanopores of controlled geometry can be etched in polycarbonate (PC). Cone bases vary from 0.5 to 1 μm. Top diameters down to 17 nm are reached. When etching from one side, the pH on the other side (bathed in neutral or acidic buffer) was monitored. Etching temperature ranged from 65 deg. C to 80 deg. C. Pore shape characterization was achieved by electro replication combined with SEM observation. The tip shape depended on whether an acidic buffer was used or not on the stopped side

  16. Preparation of Track Etch Membrane Filters Using Polystyrene Film

    International Nuclear Information System (INIS)

    Kaewsaenee, Jerawut; Ratanatongchai, Wichian; Supaphol, Pitt; Visal-athaphand, Pinpan

    2007-08-01

    Full text: Polystyrene nuclear track etch membrane filters was prepared by exposed 13 .m thin film polystyrene with fission fragment. Nuclear latent track was enlarged to through hole on the film by etching with 80 o C 40% H 2 SO 4 with K 2 Cr 2 O 7 solution for 6-10 hour. The hole size was depend on concentration of etching solution and etching time with 1.3-3.4 .m hole diameter. The flow rate test of water was 0.79-1.56 mm cm-2 min-1 at 109.8-113.7 kPa pressure

  17. Nanosecond pulsed laser ablation of silicon in liquids

    Energy Technology Data Exchange (ETDEWEB)

    Karimzadeh, R.; Anvari, J.Z.; Mansour, N. [Shahid Beheshti University, Department of Physics, Tehran (Iran)

    2009-03-15

    Laser fluence and laser shot number are important parameters for pulse laser based micromachining of silicon in liquids. This paper presents laser-induced ablation of silicon in liquids of the dimethyl sulfoxide (DMSO) and the water at different applied laser fluence levels and laser shot numbers. The experimental results are conducted using 15 ns pulsed laser irradiation at 532 nm. The silicon surface morphology of the irradiated spots has an appearance as one can see in porous formation. The surface morphology exhibits a large number of cavities which indicates as bubble nucleation sites. The observed surface morphology shows that the explosive melt expulsion could be a dominant process for the laser ablation of silicon in liquids using nanosecond pulsed laser irradiation at 532 nm. Silicon surface's ablated diameter growth was measured at different applied laser fluences and shot numbers in both liquid interfaces. A theoretical analysis suggested investigating silicon surface etching in liquid by intense multiple nanosecond laser pulses. It has been assumed that the nanosecond pulsed laser-induced silicon surface modification is due to the process of explosive melt expulsion under the action of the confined plasma-induced pressure or shock wave trapped between the silicon target and the overlying liquid. This analysis allows us to determine the effective lateral interaction zone of ablated solid target related to nanosecond pulsed laser illumination. The theoretical analysis is found in excellent agreement with the experimental measurements of silicon ablated diameter growth in the DMSO and the water interfaces. Multiple-shot laser ablation threshold of silicon is determined. Pulsed energy accumulation model is used to obtain the single-shot ablation threshold of silicon. The smaller ablation threshold value is found in the DMSO, and the incubation effect is also found to be absent. (orig.)

  18. Realization of thermally durable close-packed 2D gold nanoparticle arrays using self-assembly and plasma etching

    International Nuclear Information System (INIS)

    Sivaraman, Sankar K; Santhanam, Venugopal

    2012-01-01

    Realization of thermally and chemically durable, ordered gold nanostructures using bottom-up self-assembly techniques are essential for applications in a wide range of areas including catalysis, energy generation, and sensing. Herein, we describe a modular process for realizing uniform arrays of gold nanoparticles, with interparticle spacings of 2 nm and above, by using RF plasma etching to remove ligands from self-assembled arrays of ligand-coated gold nanoparticles. Both nanoscale imaging and macroscale spectroscopic characterization techniques were used to determine the optimal conditions for plasma etching, namely RF power, operating pressure, duration of treatment, and type of gas. We then studied the effect of nanoparticle size, interparticle spacing, and type of substrate on the thermal durability of plasma-treated and untreated nanoparticle arrays. Plasma-treated arrays showed enhanced chemical and thermal durability, on account of the removal of ligands. To illustrate the application potential of the developed process, robust SERS (surface-enhanced Raman scattering) substrates were formed using plasma-treated arrays of silver-coated gold nanoparticles that had a silicon wafer or photopaper as the underlying support. The measured value of the average SERS enhancement factor (2 × 10 5 ) was quantitatively reproducible on both silicon and paper substrates. The silicon substrates gave quantitatively reproducible results even after thermal annealing. The paper-based SERS substrate was also used to swab and detect probe molecules deposited on a solid surface. (paper)

  19. Radiation-induced diffusion at ionic etching

    International Nuclear Information System (INIS)

    Protsenko, A.N.; Chajkovskij, Eh.F.

    1986-01-01

    Effect of radiation-induced diffusion (RID) on profiles of cesium implanted into tantalum, tungsten and molybdenum with 100 keV energy was studied. Layer-by-layer analysis was performed by means of 4 keV argon ions and 100 μA/cm 2 beam density. For the case under investigation an integral equation, which solution permitted to determine impurity true distribution, has been derived. It is shown that RID taking place on ionic etching results in broadening and shifting cesium profiles peaks into the deep of a specimen and so perverts results of the layer-by-layer analysis

  20. Capillary flow in sacrificially etched nanochannels.

    Science.gov (United States)

    Hamblin, Mark N; Hawkins, Aaron R; Murray, Dallin; Maynes, Daniel; Lee, Milton L; Woolley, Adam T; Tolley, H Dennis

    2011-06-01

    Planar nanochannels are fabricated using sacrificial etching technology with sacrificial cores consisting of aluminum, chromium, and germanium, with heights ranging from 18 to 98 nm. Transient filling via capillary action is compared against the Washburn equation [E. W. Washburn, Phys. Rev. 17, 273 (1921)], showing experimental filling speeds significantly lower than classical continuum theory predicts. Departure from theory is expressed in terms of a varying dynamic contact angle, reaching values as high as 83° in channels with heights of 18 nm. The dynamic contact angle varies significantly from the macroscopic contact angle and increases with decreasing channel dimensions.