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Sample records for emk21 mems silicon

  1. Assessment of Operation of EMK21 MEMS Silicon Oscillator Over Wide Temperature Range

    Science.gov (United States)

    Patterson, Richard L.; Hammoud, Ahmad

    2009-01-01

    Electronic control systems, data-acquisition instrumentation, and microprocessors require accurate timing signals for proper operation. Traditionally, ceramic resonators and crystal oscillators provided this clock function for the majority of these systems. Over the last few years, MEMS (Micro-Electro-Mechanical Systems) resonator-based oscillators began to surface as commercial-off-the-shelf (COTS) parts by a few companies. These quartz-free, miniature silicon devices could easily replace the traditional crystal oscillators in providing the timing/clock function for many digital and analog circuits. They are reported to provide stable output frequency, offer great tolerance to shock and vibration, and are immune to electro-static discharge [ 1-2]. In addition, they are encapsulated in compact lead-free packages and cover a wide frequency range (1 MHz to 125 MHz). The small size of the MEMS oscillators along with their thermal stability make them ideal candidates for use in space exploration missions. Limited data, however, exist on the performance and reliability of these devices under operation in applications where extreme temperatures or thermal cycling swings, which are typical of space missions, are encountered. This report presents the results of the work obtained on the evaluation of an Ecliptek Corporation MEMS silicon oscillator chip under extreme temperatures.

  2. Movable MEMS Devices on Flexible Silicon

    KAUST Repository

    Ahmed, Sally

    2013-05-05

    Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulation was carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning

  3. SOI silicon on glass for optical MEMS

    DEFF Research Database (Denmark)

    Larsen, Kristian Pontoppidan; Ravnkilde, Jan Tue; Hansen, Ole

    2003-01-01

    A newly developed fabrication method for fabrication of single crystalline Si (SCS) components on glass, utilizing Deep Reactive Ion Etching (DRIE) of a Silicon On Insulator (SOI) wafer is presented. The devices are packaged at wafer level in a glass-silicon-glass (GSG) stack by anodic bonding...... and a final sealing at the interconnects can be performed using a suitable polymer. Packaged MEMS on glass are advantageous within Optical MEMS and for sensitive capacitive devices. We report on experiences with bonding SOI to Pyrex. Uniform DRIE shallow and deep etching was achieved by a combination...... of an optimized device layout and an optimized process recipe. The behavior of the buried oxide membrane when used as an etch stop for the through-hole etch is described. No harmful buckling or fracture of the membrane is observed for an oxide thickness below 1 μm, but larger and more fragile released structures...

  4. PECVD silicon carbide surface micromachining technology and selected MEMS applications

    NARCIS (Netherlands)

    Rajaraman, V.; Pakula, L.S.; Yang, H.; French, P.J.; Sarro, P.M.

    2011-01-01

    Attractive material properties of plasma enhanced chemical vapour deposited (PECVD) silicon carbide (SiC) when combined with CMOS-compatible low thermal budget processing provides an ideal technology platform for developing various microelectromechanical systems (MEMS) devices and merging them with

  5. Predicting fracture in micron-scale polycrystalline silicon MEMS structures.

    Energy Technology Data Exchange (ETDEWEB)

    Hazra, Siddharth S. (Carnegie Mellon University, Pittsburgh, PA); de Boer, Maarten Pieter (Carnegie Mellon University, Pittsburgh, PA); Boyce, Brad Lee; Ohlhausen, James Anthony; Foulk, James W., III; Reedy, Earl David, Jr.

    2010-09-01

    Designing reliable MEMS structures presents numerous challenges. Polycrystalline silicon fractures in a brittle manner with considerable variability in measured strength. Furthermore, it is not clear how to use a measured tensile strength distribution to predict the strength of a complex MEMS structure. To address such issues, two recently developed high throughput MEMS tensile test techniques have been used to measure strength distribution tails. The measured tensile strength distributions enable the definition of a threshold strength as well as an inferred maximum flaw size. The nature of strength-controlling flaws has been identified and sources of the observed variation in strength investigated. A double edge-notched specimen geometry was also tested to study the effect of a severe, micron-scale stress concentration on the measured strength distribution. Strength-based, Weibull-based, and fracture mechanics-based failure analyses were performed and compared with the experimental results.

  6. MEMS magnetic field sensor based on silicon bridge structure

    Energy Technology Data Exchange (ETDEWEB)

    Du Guangtao; Chen Xiangdong; Lin Qibin; Li Hui; Guo Huihui, E-mail: xdchen@home.swjtu.edu.c [School of Information Science and Technology, Southwest Jiaotong University, Chengdu 610031 (China)

    2010-10-15

    A MEMS piezoresistive magnetic field sensor based on a silicon bridge structure has been simulated and tested. The sensor consists of a silicon sensitivity diaphragm embedded with a piezoresistive Wheatstone bridge, and a ferromagnetic magnet adhered to the sensitivity diaphragm. When the sensor is subjected to an external magnetic field, the magnetic force bends the silicon sensitivity diaphragm, producing stress and resistors change of the Wheatstone bridge and the output voltage of the sensor. Good agreement is observed between the theory and measurement behavior of the magnetic field sensor. Experimental results demonstrate that the maximum sensitivity and minimum resolution are 48 m V/T and 160 {mu}T, respectively, making this device suitable for strong magnetic field measurement. Research results indicate that the sensor repeatability and dynamic response time are about 0.66% and 150 ms, respectively. (semiconductor devices)

  7. Virtual Fabrication of Silicon Nitride Based Multifunctional MEMS Pressure Sensor

    Directory of Open Access Journals (Sweden)

    Mahesh Kumar PATANKAR

    2011-04-01

    Full Text Available This paper shows how to combine absolute and differential pressure sensor on single silicon substrate for measuring the pressure in 0 – 1 MPa range. In this work, the sensor makes use a of silicon nitride square diaphragm supported by a thick silicon rim. Piezoresistors below the diaphragms are defined by the p+ etch stop technique and structured by the anisotropic etching in Wheatstone bridge configuration. In event of pressure, mechanical deformation occurs in the diaphragm and induces the stress in it which can be translated into electrical signal accordingly. This sensor shows the sensitivity of 142 mV/V.KPa. The pressure sensor has been designed, simulated and virtually fabricated using Intellisuite MEMS software tool. Simulation results shows that the good agreement with the analytical solutions.

  8. Design, modeling and simulation of MEMS-based silicon Microneedles

    Science.gov (United States)

    Amin, F.; Ahmed, S.

    2013-06-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  9. Design, modeling and simulation of MEMS-based silicon Microneedles

    International Nuclear Information System (INIS)

    Amin, F; Ahmed, S

    2013-01-01

    The advancement in semiconductor process engineering and nano-scale fabrication technology has made it convenient to transport specific biological fluid into or out of human skin with minimum discomfort. Fluid transdermal delivery systems such as Microneedle arrays are one such emerging and exciting Micro-Electro Mechanical System (MEMS) application which could lead to a total painless fluid delivery into skin with controllability and desirable yield. In this study, we aimed to revisit the problem with modeling, design and simulations carried out for MEMS based silicon hollow out of plane microneedle arrays for biomedical applications particularly for transdermal drug delivery. An approximate 200 μm length of microneedle with 40 μm diameter of lumen has been successfully shown formed by isotropic and anisotropic etching techniques using MEMS Pro design tool. These microneedles are arranged in size of 2 × 4 matrix array with center to center spacing of 750 μm. Furthermore, comparisons for fluid flow characteristics through these microneedle channels have been modeled with and without the contribution of the gravitational forces using mathematical models derived from Bernoulli Equation. Physical Process simulations have also been performed on TCAD SILVACO to optimize the design of these microneedles aligned with the standard Si-Fabrication lines.

  10. Self-organized nanostructures in silicon and glass for MEMS, MOEMS and BioMEMS

    International Nuclear Information System (INIS)

    Lilienthal, K.; Fischer, M.; Stubenrauch, M.; Schober, A.

    2010-01-01

    The utilization of self-organization in the process workflows for Micro-Electro-Mechanical-Systems (MEMS) and their derivatives is a smart way to get large areas of nanostructured surfaces for various applications. The generation of nano-masking spots by self-organizing residues in the plasma can lead to needle- or tube-like structures on the surface after (deep-) reactive ion etching. With lengths of 3 up to 25 μm and 150 up to 500 nm in diameter for silicon broad applications in the fields of micro fluidics with catalysts, micro-optical or mechanical mountings or carrier wafer bonding in microelectronics are possible. Now, we also developed dry etching processes for fused silica which shows analogue properties to 'Black Silicon' and investigated these glass nanostructures by a first parameter study to identify new usable structures and hybrids. This innovative starting point allows the transfer of 'Black Silicon' technologies and its applications to another important material class in micro- and nanotechnologies, fused silica.

  11. Single-crystal-silicon-based microinstrument to study friction and wear at MEMS sidewall interfaces

    International Nuclear Information System (INIS)

    Ansari, N; Ashurst, W R

    2012-01-01

    Since the advent of microelectromechanical systems (MEMS) technology, friction and wear are considered as key factors that determine the lifetime and reliability of MEMS devices that contain contacting interfaces. However, to date, our knowledge of the mechanisms that govern friction and wear in MEMS is insufficient. Therefore, systematically investigating friction and wear at MEMS scale is critical for the commercial success of many potential MEMS devices. Specifically, since many emerging MEMS devices contain more sidewall interfaces, which are topographically and chemically different from in-plane interfaces, studying the friction and wear characteristics of MEMS sidewall surfaces is important. The microinstruments that have been used to date to investigate the friction and wear characteristics of MEMS sidewall surfaces possess several limitations induced either by their design or the structural film used to fabricate them. Therefore, in this paper, we report on a single-crystal-silicon-based microinstrument to study the frictional and wear behavior of MEMS sidewalls, which not only addresses some of the limitations of other microinstruments but is also easy to fabricate. The design, modeling and fabrication of the microinstrument are described in this paper. Additionally, the coefficients of static and dynamic friction of octadecyltrichlorosilane-coated sidewall surfaces as well as sidewall surfaces with only native oxide on them are also reported in this paper. (paper)

  12. PDMS-on-silicon microsystems: Integration of polymer micro/nanostructures for new MEMS device functions

    Science.gov (United States)

    Tung, Yi-Chung

    2005-11-01

    Modern technologies found in military, space-craft, automotive, and telecommunications applications strongly demand reductions of the manufacturing cost, power consumption, size, and weight of integrated sensors and actuators. The research field of microelectromechanical systems (MEMS) has seen significant technological innovations and advancements to meet this demand in the last two decades. Historically, MEMS technology has been seen as an offspring of silicon-based integrated circuit (IC) technology. But recently, the roles that polymer materials play in MEMS have been more pronounced due to their cost effectiveness, manufacturability, and compatibility with micro/nanoscale biological and chemical systems. Among these polymers, an organic elastomer, Polydimethylsiloxane (PDMS), has become one of the most popular materials because of its unique material properties and moldability suited for low-cost rapid prototyping based on a fabrication technique called soft lithography. However, PDMS micro/nanostructures, not allowed to be integrated with other silicon-based devices, find their limited use in MEMS other than in passive microfluidic components. The lack of a technology bridging the gap between silicon and PDMS prohibits us to realize new MEMS devices potentially resulting from the simultaneous use of these two materials. This research explores a fully new technological concept of "PDMS-on-silicon microsystems." "PDMS-on-silicon microsystems" refers to a class of novel MEMS devices integrating PDMS micro/nanostructures onto silicon actuators and/or sensors. The research aims to demonstrate a new type of MEMS devices taking advantage of benefits resulting from both of silicon and PDMS. To achieve this goal, this work develops a new MEMS fabrication technique called "soft-lithographic lift-off and grafting (SLLOG)." The SLLOG process starts with soft lithography-based molding and release of a three-dimensional (3D) PDMS microstructure. This is followed by

  13. The black silicon method VI: high aspect ratio trench etching for MEMS applications

    NARCIS (Netherlands)

    Jansen, Henricus V.; de Boer, Meint J.; Elwenspoek, Michael Curt

    1996-01-01

    Etching high aspect ratio trenches (HART's) in silicon is becoming increasingly important for MEMS applications. Currently, the most important technique is dry reactive ion etching (RIE). This paper presents solutions for the most notorious problems during etching HART's: tilting and the aspect

  14. Solid state MEMS devices on flexible and semi-transparent silicon (100) platform

    KAUST Repository

    Ahmed, Sally

    2014-01-01

    We report fabrication of MEMS thermal actuators on flexible and semi-transparent silicon fabric released from bulk silicon (100). We fabricated the devices first and then released the top portion of the silicon (≈ 19 μm) which is flexible and semi-transparent. We also performed chemical mechanical polishing to reuse the remaining wafer. A tested thermal actuator with 3 μm wide 240 μm hot arm and 10 μm wide 185 μm long cold arm deflected by 1.7 μm at 1 V. The fabricated thermal actuators exhibit similar performance before and after bending. We believe the demonstrated process will expand the horizon of flexible electronics into MEMS world devices. © 2014 IEEE.

  15. Development of an SU-8 MEMS process with two metal electrodes using amorphous silicon as a sacrificial material

    KAUST Repository

    Ramadan, Khaled S.

    2013-02-08

    This work presents an SU-8 surface micromachining process using amorphous silicon as a sacrificial material, which also incorporates two metal layers for electrical excitation. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic applications due to its mechanical properties, biocompatibility and low cost. Amorphous silicon is used as a sacrificial layer in MEMS applications because it can be deposited in large thicknesses, and can be released in a dry method using XeF2, which alleviates release-based stiction problems related to MEMS applications. In this work, an SU-8 MEMS process was developed using ;-Si as a sacrificial layer. Two conductive metal electrodes were integrated in this process to allow out-of-plane electrostatic actuation for applications like MEMS switches and variable capacitors. In order to facilitate more flexibility for MEMS designers, the process can fabricate dimples that can be conductive or nonconductive. Additionally, this SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were optimized for two sets of thicknesses: thin (5-10 m) and thick (130 m). The process was tested fabricating MEMS switches, capacitors and thermal actuators. © 2013 IOP Publishing Ltd.

  16. [A micro-silicon multi-slit spectrophotometer based on MEMS technology].

    Science.gov (United States)

    Hao, Peng; Wu, Yi-Hui; Zhang, Ping; Liu, Yong-Shun; Zhang, Ke; Li, Hai-Wen

    2009-06-01

    A new mini-spectrophotometer was developed by adopting micro-silicon slit and pixel segmentation technology, and this spectrophotometer used photoelectron diode array as the detector by the back-dividing-light way. At first, the effect of the spectral bandwidth on the tested absorbance linear correlation was analyzed. A theory for the design of spectrophotometer's slit was brought forward after discussing the relationships between spectrophotometer spectrum band width and pre-and post-slits width. Then, the integrative micro-silicon-slit, which features small volume, high precision, and thin thickness, was manufactured based on the MEMS technology. Finally, a test was carried on linear absorbance solution by this spectrophotometer. The final result showed that the correlation coefficients were larger than 0.999, which means that the new mini-spectrophotometer with micro-silicon slit pixel segmentation has an obvious linear correlation.

  17. MEMS optical tunable filter based on free-standing subwavelength silicon layers

    Science.gov (United States)

    Omran, Haitham; Sabry, Yasser M.; Sadek, Mohamed; Hassan, Khaled; Shalaby, Mohamed Y.; Khalil, Diaa

    2014-03-01

    We report a MEMS optical tunable filter based on high-aspect-ratio etching of sub-wavelength silicon layers on a silicon- on-insulator wafer. The reported filter has measured free-spectral and filter-tuning ranges of approximately 100 nm and a finesse of about 20 around a wavelength of 1550 nm, enabled by the use of 1000 nm-thick silicon layers and a balanced tilt-free motion using a lithographically-aligned electrostatic actuator. The average insertion loss of the filter is about 12 dB with a superior wavelength-dependent loss of about 1.5 dB. The filter has an out-of-band to in-band wavelength rejection ratio that is better than 20 dB. The reported filter experimental characteristics and its integrability are suitable for the production of integrated swept sources for optical coherence tomography application and miniaturized spectrometers.

  18. A phononic crystal strip based on silicon for support tether applications in silicon-based MEMS resonators and effects of temperature and dopant on its band gap characteristics

    Directory of Open Access Journals (Sweden)

    Thi Dep Ha

    2016-04-01

    Full Text Available Phononic crystals (PnCs and n-type doped silicon technique have been widely employed in silicon-based MEMS resonators to obtain high quality factor (Q as well as temperature-induced frequency stability. For the PnCs, their band gaps play an important role in the acoustic wave propagation. Also, the temperature and dopant doped into silicon can cause the change in its material properties such as elastic constants, Young’s modulus. Therefore, in order to design the simultaneous high Q and frequency stability silicon-based MEMS resonators by two these techniques, a careful design should study effects of temperature and dopant on the band gap characteristics to examine the acoustic wave propagation in the PnC. Based on these, this paper presents (1 a proposed silicon-based PnC strip structure for support tether applications in low frequency silicon-based MEMS resonators, (2 influences of temperature and dopant on band gap characteristics of the PnC strips. The simulation results show that the largest band gap can achieve up to 33.56 at 57.59 MHz and increase 1280.13 % (also increase 131.89 % for ratio of the widest gaps compared with the counterpart without hole. The band gap properties of the PnC strips is insignificantly effected by temperature and electron doping concentration. Also, the quality factor of two designed length extensional mode MEMS resonators with proposed PnC strip based support tethers is up to 1084.59% and 43846.36% over the same resonators with PnC strip without hole and circled corners, respectively. This theoretical study uses the finite element analysis in COMSOL Multiphysics and MATLAB softwares as simulation tools. This findings provides a background in combination of PnC and dopant techniques for high performance silicon-based MEMS resonators as well as PnC-based MEMS devices.

  19. Modeling high signal-to-noise ratio in a novel silicon MEMS microphone with comb readout

    Science.gov (United States)

    Manz, Johannes; Dehe, Alfons; Schrag, Gabriele

    2017-05-01

    Strong competition within the consumer market urges the companies to constantly improve the quality of their devices. For silicon microphones excellent sound quality is the key feature in this respect which means that improving the signal-to-noise ratio (SNR), being strongly correlated with the sound quality is a major task to fulfill the growing demands of the market. MEMS microphones with conventional capacitive readout suffer from noise caused by viscous damping losses arising from perforations in the backplate [1]. Therefore, we conceived a novel microphone design based on capacitive read-out via comb structures, which is supposed to show a reduction in fluidic damping compared to conventional MEMS microphones. In order to evaluate the potential of the proposed design, we developed a fully energy-coupled, modular system-level model taking into account the mechanical motion, the slide film damping between the comb fingers, the acoustic impact of the package and the capacitive read-out. All submodels are physically based scaling with all relevant design parameters. We carried out noise analyses and due to the modular and physics-based character of the model, were able to discriminate the noise contributions of different parts of the microphone. This enables us to identify design variants of this concept which exhibit a SNR of up to 73 dB (A). This is superior to conventional and at least comparable to high-performance variants of the current state-of-the art MEMS microphones [2].

  20. DOUBLE BOSS SCULPTURED DIAPHRAGM EMPLOYED PIEZORESISTIVE MEMS PRESSURE SENSOR WITH SILICON-ON-INSULATOR (SOI

    Directory of Open Access Journals (Sweden)

    D. SINDHANAISELVI

    2017-07-01

    Full Text Available This paper presents the detailed study on the measurement of low pressure sensor using double boss sculptured diaphragm of piezoresistive type with MEMS technology in flash flood level measurement. The MEMS based very thin diaphragms to sense the low pressure is analyzed by introducing supports to achieve linearity. The simulation results obtained from Intellisuite MEMS CAD design tool show that very thin diaphragms with rigid centre or boss give acceptable linearity. Further investigations on very thin diaphragms embedded with piezoresistor for low pressure measurement show that it is essential to analyse the piezoresistor placement and size of piezoresistor to achieve good sensitivity. A modified analytical modelling developed in this study for double boss sculptured diaphragm results were compared with simulated results. Further the enhancement of sensitivity is analyzed using non uniform thickness diaphragm and Silicon-On-Insulator (SOI technique. The simulation results indicate that the double boss square sculptured diaphragm with SOI layer using 0.85μm thickness yields the higher voltage sensitivity, acceptable linearity with Small Scale Deflection.

  1. Ultra-thin alumina and silicon nitride MEMS fabricated membranes for the electron multiplication

    Science.gov (United States)

    Prodanović, V.; Chan, H. W.; Graaf, H. V. D.; Sarro, P. M.

    2018-04-01

    In this paper we demonstrate the fabrication of large arrays of ultrathin freestanding membranes (tynodes) for application in a timed photon counter (TiPC), a novel photomultiplier for single electron detection. Low pressure chemical vapour deposited silicon nitride (Si x N y ) and atomic layer deposited alumina (Al2O3) with thicknesses down to only 5 nm are employed for the membrane fabrication. Detailed characterization of structural, mechanical and chemical properties of the utilized films is carried out for different process conditions and thicknesses. Furthermore, the performance of the tynodes is investigated in terms of secondary electron emission, a fundamental attribute that determines their applicability in TiPC. Studied features and presented fabrication methods may be of interest for other MEMS application of alumina and silicon nitride as well, in particular where strong ultra-thin membranes are required.

  2. Design and fabrication of non silicon substrate based MEMS energy harvester for arbitrary surface applications

    International Nuclear Information System (INIS)

    Balpande, Suresh S.; Pande, Rajesh S.

    2016-01-01

    Internet of Things (IoT) uses MEMS sensor nodes and actuators to sense and control objects through Internet. IOT deploys millions of chemical battery driven sensors at different locations which are not reliable many times because of frequent requirement of charging & battery replacement in case of underground laying, placement at harsh environmental conditions, huge count and difference between demand (24 % per year) and availability (energy density growing rate 8% per year). Energy harvester fabricated on silicon wafers have been widely used in manufacturing MEMS structures. These devices require complex fabrication processes, costly chemicals & clean room. In addition to this silicon wafer based devices are not suitable for curved surfaces like pipes, human bodies, organisms, or other arbitrary surface like clothes, structure surfaces which does not have flat and smooth surface always. Therefore, devices based on rigid silicon wafers are not suitable for these applications. Flexible structures are the key solution for this problems. Energy transduction mechanism generates power from free surrounding vibrations or impact. Sensor nodes application has been purposefully selected due to discrete power requirement at low duty cycle. Such nodes require an average power budget in the range of about 0.1 microwatt to 1 mW over a period of 3-5 seconds. Energy harvester is the best alternate source in contrast with battery for sensor node application. Novel design of Energy Harvester based on cheapest flexible non silicon substrate i.e. cellulose acetate substrate have been modeled, simulated and analyzed on COMSOL multiphysics and fabricated using sol-gel spin coating setup. Single cantilever based harvester generates 60-75 mV peak electric potential at 22Hz frequency and approximately 22 µW power at 1K-Ohm load. Cantilever array can be employed for generating higher voltage by replicating this structure. This work covers design, optimization, fabrication of

  3. 77 GHz MEMS antennas on high-resistivity silicon for linear and circular polarization

    KAUST Repository

    Sallam, M. O.

    2011-07-01

    Two new MEMS antennas operating at 77 GHz are presented in this paper. The first antenna is linearly polarized. It possesses a vertical silicon wall that carries a dipole on top of it. The wall is located on top of silicon substrate covered with a ground plane. The other side of the substrate carries a microstrip feeding network in the form of U-turn that causes 180 phase shift. This phase-shifter feeds the arms of the dipole antenna via two vertical Through-Silicon Vias (TSVs) that go through the entire wafer. The second antenna is circularly polarized and formed using two linearly polarized antennas spatially rotated with respect to each other by 90 and excited with 90 phase shift. Both antennas are fabricated using novel process flow on a single high-resistivity silicon wafer via bulk micromachining. Only three processing steps are required to fabricate these antennas. The proposed antennas have appealing characteristics, such as high polarization purity, high gain, and high radiation efficiency. © 2011 IEEE.

  4. Design, fabrication and characterization of nano-filters in silicon microfluidic channels based on MEMS technology.

    Science.gov (United States)

    Chen, Xing; Cui, Dafu; Chen, Jian

    2009-09-01

    Since most clinical assays are performed on cell-free serum or plasma, micro-analytical systems for blood tests require integrated on-chip microfluidics for the isolation of plasma or serum from crude blood samples. In this paper, we present a crossflow filtration method using novel silicon nano-filters for plasma separation. The microfluidic chip is made of a silicon substrate containing micropillar arrays, feed channels, side channels and nano-gap structures, sealed with a PDMS-glass compound cover. The design of the silicon filtration structures were optimized using numerical analysis and the optimal MEMS fabrication procedures were obtained. The filtration structures including nano-filters were characterized using SEM and subsequently used to isolate plasma from whole blood in a continuous manner. Compared with micro-gap structures in silicon microfluidic channels, the nano-gap structures have been used to separate plasma from whole blood samples with higher selectivity, where a maximum plasma selectivity of 97.7% has been obtained. Common problems of clogging and jamming in filtration applications have seldom been noticed in our device. The presented microfluidic filtration device for plasma isolation could be integrated into microTAS for point-of-care diagnostics in the near future.

  5. A novel high pressure, high temperature vessel used to conduct long-term stability measurements of silicon MEMS pressure transducers

    Science.gov (United States)

    Wisniewiski, David

    2014-03-01

    The need to quantify and to improve long-term stability of pressure transducers is a persistent requirement from the aerospace sector. Specifically, the incorporation of real-time pressure monitoring in aircraft landing gear, as exemplified in Tire Pressure Monitoring Systems (TPMS), has placed greater demand on the pressure transducer for improved performance and increased reliability which is manifested in low lifecycle cost and minimal maintenance downtime through fuel savings and increased life of the tire. Piezoresistive (PR) silicon MEMS pressure transducers are the primary choice as a transduction method for this measurement owing to their ability to be designed for the harsh environment seen in aircraft landing gear. However, these pressure transducers are only as valuable as the long-term stability they possess to ensure reliable, real-time monitoring over tens of years. The "heart" of the pressure transducer is the silicon MEMS element, and it is at this basic level where the long-term stability is established and needs to be quantified. A novel High Pressure, High Temperature (HPHT) vessel has been designed and constructed to facilitate this critical measurement of the silicon MEMS element directly through a process of mechanically "floating" the silicon MEMS element while being subjected to the extreme environments of pressure and temperature, simultaneously. Furthermore, the HPHT vessel is scalable to permit up to fifty specimens to be tested at one time to provide a statistically significant data population on which to draw reasonable conclusions on long-term stability. With the knowledge gained on the silicon MEMS element, higher level assembly to the pressure transducer envelope package can also be quantified as to the build-effects contribution to long-term stability in the same HPHT vessel due to its accommodating size. Accordingly, a HPHT vessel offering multiple levels of configurability and robustness in data measurement is presented, along

  6. Design and simulation of MEMS microvalves for silicon photonic biosensor chip

    Science.gov (United States)

    Amemiya, Yoshiteru; Nakashima, Yuuto; Maeda, Jun; Yokoyama, Shin

    2018-04-01

    For the early and easy diagnosis of diseases, we have proposed a silicon photonic biosensor chip with two kinds of MEMS microvalves for a multiple-item detection system. The driving voltage of the vertical type with the circular-plate capacitor structure and that of the lateral type with the comb-shaped electrode are investigated. From mechanical calculations, the driving voltage of the vertical type is estimated to be 30 V and that of the lateral type to be 15 V. The propagation loss at the intersecting waveguides of arrayed ring-resonator biosensors is also estimated. In the case of optimized intersecting waveguides, more than 67% transmittance of TE-mode light is simulated for the series connection of 20 intersecting waveguides. It is confirmed that it is possible to fabricate an 8 × 12 arrayed biosensor chip in an area of 1 × 1.5 mm2 taking the device size of the microvalves into consideration. We have, for the first time, designed a whole system, including sensors and a fluid channel with MEMS microvalves.

  7. Fabrication and Analysis of Tapered Tip Silicon Microneedles for MEMS based Drug Delivery System

    Directory of Open Access Journals (Sweden)

    Muhammad Waseem Ashraf

    2010-11-01

    Full Text Available In this paper, a novel design of transdermal drug delivery (TDD system is presented. The proposed system consists of controlled electronic circuit and microelectromechanical system (MEMS based devices like microneedles, micropump, flow sensor, and blood pressure sensor. The aim of this project is to develop a system that can eliminate the limitations associated with oral therapy. In this phase tapered tip silicon microneedles have been fabricated using inductively coupled plasma (ICP etching technology. Using ANSYS, simulation of microneedles has been conducted before the fabrication process to test the design suitability for TDD. More over multifield analysis of reservoir integrated with microneedle array using piezoelectric actuator has also been performed. The effects of frequency and voltage on actuator and fluid flow rate through 6×6 microneedle array have been investigated. This work provides envisage data to design suitable devices for TDD.

  8. Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives

    Directory of Open Access Journals (Sweden)

    Jović Vesna B.

    2011-01-01

    Full Text Available This paper gives comparison and discussion of adhesives used for attachment of silicon piezoresistive pressure sensor dies. Special attention is paid on low pressure sensor dies because of their extreme sensitivity on stresses, which can arise from packaging procedure and applied materials. Commercially available adhesives “Scotch Weld 2214 Hi-Temp” from “3M Co.” and “DM2700P/H848” from “DIEMAT”, USA, were compared. First of them is aluminum filled epoxy adhesive and second is low melting temperature (LMT glass paste. Comparing test results for low pressure sensor chips we found that LMT glass (glass frit is better adhesive for this application. Applying LMT glass paste minimizes internal stresses caused by disagreement of coefficients of thermal expansions between sensor die and housing material. Also, it minimizes stresses introduced during applying external loads in the process of pressure measuring. Regarding the measurements, for the sensors installed with filled epoxy paste, resistor for compensation of temperature offset change had negative values in all cases, which means that linear temperature compensation, of sensors installed this way, would be impossible. In the sensors installed with LMT glass paste, all results, without exception, were in their common limits (values, which give the possibility of passive temperature compensation. Furthermore, LMT glass attachment can broaden temperature operating range of MEM silicon pressure sensors towards higher values, up to 120 ºC.

  9. A MEMS Infrared Thermopile Fabricated from Silicon-On-Insulator with Phononic Crystal Structures and Carbon Nanotube Absorption Layer

    Science.gov (United States)

    Gray, Kory Forrest

    The goal of this project was to examine the possibility of creating a novel thermal infrared detector based on silicon CMOS technology that has been enhanced by the latest nano-engineering discoveries. Silicon typically is not thought as an efficient thermoelectric material. However recent advancements in nanotechnology have improved the potential for a highly sensitive infrared detector based on nano-structured silicon. The thermal conductivity of silicon has been shown to be reduced from 150 W/mK down to 60 W/mK just by decreasing the scale of the silicon from bulk down to the sub-micron scale. Further reduction of the thermal conductivity has been shown by patterning silicon with a phonon crystal structure which has been reported to have thermal conductivities down to 10 W/mK. The phonon crystal structure consists of a 2D array of holes that are etched into the silicon. The size and pitch of the holes are on the order of the mean free path of the phonons in silicon which is approximately 200-500nm. This particular device had 200nm holes on a 400nm pitch. The Seebeck coefficient of silicon can also be enhanced by the reduction of the material from the bulk to sub-micron scale and with degenerate level doping. The combination of decreased thermal conductivity and increased Seebeck coefficient allow silicon to be a promising material for thermoelectric infrared detectors. The highly doped silicon is desired to reduce the electrical resistance of the device. The low electrical resistance is required to reduce the Johnson noise of the device which is the dominant noise source for most thermal detectors. This project designed a MEMS thermopile using a silicon-on-insulator substrate, and a CMOS compatible process. The basic thermopile consists of a silicon dioxide membrane with phononic crystal patterned silicon thermocouples around the edges of the membrane. Vertical aligned, multi-walled, carbon nanotubes were used as the infrared absorption layer. A MEMS

  10. An X band RF MEMS switch based on silicon-on-glass architecture

    Indian Academy of Sciences (India)

    heavy and power hungry. In satellite systems with tight weight and power budgets these features are undesirable. An elegant solution to this problem is offered by Micro Electrome- chanical Systems (MEMS) technology. RF switches based on MEMS processes combine the advantages of small size of solid state switches ...

  11. Design and fabrication of a silicon-based MEMS acceleration switch working lower than 10 g

    Science.gov (United States)

    Hwang, Jeongki; Ryu, Daeho; Park, Chihyun; Jang, Seung-gyo; Lee, Chung-il; Kim, Yong-Kweon

    2017-06-01

    This paper reports a low-g MEMS acceleration switch with threshold acceleration below 10 g. The proposed switch is made of single-crystalline silicon for high thermal stability and stress-free structure. A vertical operation type is adopted to enable fine control of the contact surface during the fabrication process. The switch contains displacement-restricting structures in all directions for impact resistance and is packaged with anodic bonding process. The fabricated switches had an average proof mass, initial gap, and spring constant of 307.38 µg, 6.39 µm, and 3.29 N m-1, respectively. Height profile of the free-hanging proof mass was measured to show that the switch does not suffer from stress problems. In the electrostatic operation test, the contact resistance of the switch was varied with contact force and the minimum value was estimated to be 8.5 Ω. The response time of the switch was measured to be shorter than 1.2 ms. The fabricated switch operated more than 10 000 cycles without failure. For the thermal stability test, the switch was heated at 80 °C for 6 h and the switch operated successfully over 200 times. In the rotation-table experiment, the switch operated at 6.61 g and error analysis was carried out in the consideration of tangential force generated during the rotation-table experiment. From the experimental values, the tangential force was calculated as 2.375 µN and the resulting reduction in the initial switching gap was simulated as 0.32 µm. The reduced threshold acceleration thus was estimated to be 6.62 g, which agrees very well with the measured threshold acceleration value of 6.61 g.

  12. Conception, fabrication and characterization of a silicon based MEMS inertial switch with a threshold value of 5 g

    Science.gov (United States)

    Zhang, Fengtian; Wang, Chao; Yuan, Mingquan; Tang, Bin; Xiong, Zhuang

    2017-12-01

    Most of the MEMS inertial switches developed in recent years are intended for shock and impact sensing with a threshold value above 50 g. In order to follow the requirement of detecting linear acceleration signal at low-g level, a silicon based MEMS inertial switch with a threshold value of 5 g was designed, fabricated and characterized. The switch consisted of a large proof mass, supported by circular spiral springs. An analytical model of the structure stiffness of the proposed switch was derived and verified by finite-element simulation. The structure fabrication was based on a customized double-buried layer silicon-on-insulator wafer and encapsulated by glass wafers. The centrifugal experiment and nanoindentation experiment were performed to measure the threshold value as well as the structure stiffness. The actual threshold values were measured to be 0.1–0.3 g lower than the pre-designed value of 5 g due to the dimension loss during non-contact lithography processing. Concerning the reliability assessment, a series of environmental experiments were conducted and the switches remained operational without excessive errors. However, both the random vibration and the shock tests indicate that the metal particles generated during collision of contact parts might affect the contact reliability and long-time stability. According to the conclusion reached in this report, an attentive study on switch contact behavior should be included in future research.

  13. PZT-on-silicon RF-MEMS Lamb wave resonators and filters

    NARCIS (Netherlands)

    Yagubizade, H.

    2013-01-01

    Lamb-wave piezoelectric RF-MEMS resonators have demonstrated promising performance, such as low motional impedance and high Q-factor. Lamb-wave resonators are still in the perfectioning state and therefore there is a great demand for further understanding of various issues such as reducing the

  14. An X band RF MEMS switch based on silicon-on-glass architecture

    Indian Academy of Sciences (India)

    –12 GHz) with a target insertion ... In satellite systems with tight weight and power budgets these features are undesirable. ... MEMS devices such as RF switches and variable capacitors (Sakata et al 1999, Kim et al. 2004, 2005). The actuator ...

  15. Analysis and wafer-level design of a high-order silicon vibration isolator for resonating MEMS devices

    International Nuclear Information System (INIS)

    Yoon, Sang Won; Lee, Sangwoo; Najafi, Khalil; Perkins, Noel C

    2011-01-01

    This paper presents the analysis and preliminary design, fabrication, and measurement for mechanical vibration-isolation platforms especially designed for resonating MEMS devices including gyroscopes. Important parameters for designing isolation platforms are specified and the first platform (in designs with cascaded multiple platforms) is crucial for improving vibration-isolation performance and minimizing side-effects on integrated gyroscopes. This isolation platform, made from a thick silicon wafer substrate for an environment-resistant MEMS package, incorporates the functionalities of a previous design including vacuum packaging and thermal resistance with no additional resources. This platform consists of platform mass, isolation beams, vertical feedthroughs, and bonding pads. Two isolation platform designs follow from two isolation beam designs: lateral clamped–clamped beams and vertical torsion beams. The beams function simultaneously as mechanical springs and electrical interconnects. The vibration-isolation platform can yield a multi-dimensional, high-order mechanical low pass filter. The isolation platform possesses eight interconnects within a 12.2 × 12.2 mm 2 footprint. The contact resistance ranges from 4–11 Ω depending on the beam design. Vibration measurements using a laser-Doppler vibrometer demonstrate that the lateral vibration-isolation platform suppresses external vibration having frequencies exceeding 2.1 kHz.

  16. A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators

    Science.gov (United States)

    Zhao, Jicong; Yuan, Quan; Kan, Xiao; Yang, Jinling; Yang, Fuhua

    2017-01-01

    This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au-Sn solder bonding is employed to provide a vacuum encapsulation as well as electrical conductions. Vertical silicon vias are micro-fabricated by glass reflow process. The optimized grounding, via pitch, and all-round shielding effectively reduce feed-through capacitance. Thus the signal-to-background ratios (SBRs) of the transmission signals increase from 17 dB to 20 dB, and the quality factor (Q) values of the packaged resonators go from around 8000 up to more than 9500. The measured average leak rate and shear strength are (2.55  ±  0.9)  ×  10-8 atm-cc s-1 and 42.53  ±  4.19 MPa, respectively. Furthermore, thermal cycling test between  -40 °C and 100 °C and high temperature storage test at 150 °C show that the resonant-frequency drifts are less than  ±7 ppm. In addition, the SBRs and the Q values have no obvious change after the tests. The experimental results demonstrated that the proposed encapsulation technique is well suited for the applications of RF MEMS devices.

  17. Novel Processes for Modular Integration of Silicon-Germanium MEMS with CMOS Electronics

    Science.gov (United States)

    2007-02-28

    40 3.1 Boron trichloride (BCl3) as the boron dopant gas ...........................................40 3.1.1 BCl3...is developing a copper-based MEMS process for RF switches and resonators [1.7]. Aluminum nitride (AlN) is being explored as the structural material...are described. Boron trichloride (BCl3) has been successfully developed as a better p-type dopant gas to replace diborane (B2H6); disilane (Si2H6

  18. MEMS monocrystalline-silicon based thermal devices for chemical and microfluidic applications

    OpenAIRE

    Mihailovic, M.

    2011-01-01

    This thesis explores the employment of monocrystalline silicon in microsystems as an active material for different thermal functions, such as heat generation and heat transfer by conduction. In chapter 1 applications that need thermal micro devices, micro heaters and micro heat exchangers, are briefly introduced. The shortcomings of commonly used materials are listed, and monocrystalline silicon is identified as an appropriate choice for several thermal micro devices. Chapter 2 briefly presen...

  19. Silicon oxide sacrificial layers deposited by pulsed-DC magnetron sputtering for MEMS applications

    Science.gov (United States)

    González-Castilla, Sheila; Olivares, Jimena; Clement, Marta; Vergara, Lucía; Pulido, Laura; Iborra, Enrique; Sangrador, Jesús

    2009-05-01

    Surface micromachining requires the use of easily-removable sacrificial layers fully compatible with all the materials and technological processes involved. Silicon dioxide films, thermally grown on silicon substrates or deposited by CVD, are commonly used as sacrificial layers in surface micromachining technologies, despite their low lateral etch rate in conventional fluorinate solutions. The development of silicon oxide layers with high etch rates poses a great technological challenge. In this work we have investigated the possibility of obtaining easily removable silicon oxide layers by pulsed-DC magnetron reactive sputtering. We have carried out a comprehensive study of the influence of the deposition parameters (total pressure and gas composition) on the composition, residual stress and lateral etch rate in fluorine wet solutions of the films. This study has allowed to determine the sputtering conditions to deposit, at very high rates (up to 0.1 μm/min), silicon oxide films with excellent characteristics for their use as sacrificial layers. Films with roughness around 5 nm rms, residual stress below 100 MPa and very high etch rate (up to 5 μm/min in the lateral directions), around 70 times greater than for thermal silicon oxide, have been achieved. The structural characteristics of these easily removable silicon oxide layers have been assessed by infrared spectroscopy and atomic force microscopy, which have revealed that the films exhibit some kind of porous structure, related to very specific sputter conditions. Finally, the viability of these films has been demonstrated by using them as sacrificial layer in the fabrication process of AlN-based microresonators.

  20. MEMS silicon-based micro-evaporator with diamond-shaped fins

    NARCIS (Netherlands)

    Mihailovic, M.; Rops, C.; Creemer, J.F.; Sarro, P.M.

    2010-01-01

    A new design of micro-evaporators, with 45 channels (100 μm deep) and diamond-shaped fins (40μm wide, 160μm long, 20μm separation), is fabricated by anodic bonding of silicon and glass wafers, in a five masks process. This new design improves stability of the working conditions, and has a localized

  1. The Effects of Ionising Radiation on MEMS Silicon Strain Gauges: Preliminary Background and Methodology

    Science.gov (United States)

    2006-09-01

    stamping tool. That is, the droplet is formed on the tip of the dispenser while in contact with the dogbone, and the tip is then withdrawn vertically...to be a capillary action due to the silicon- aluminium contact. This flow occurs even with the AE-15 cured at room temperatures and below, rather than

  2. MEMS monocrystalline-silicon based thermal devices for chemical and microfluidic applications

    NARCIS (Netherlands)

    Mihailovic, M.

    2011-01-01

    This thesis explores the employment of monocrystalline silicon in microsystems as an active material for different thermal functions, such as heat generation and heat transfer by conduction. In chapter 1 applications that need thermal micro devices, micro heaters and micro heat exchangers, are

  3. Performance enhancement of a silicon MEMS piezoresistive single axis accelerometer with electroplated gold on a proof mass

    Science.gov (United States)

    Sankar, A. Ravi; Lahiri, S. K.; Das, S.

    2009-02-01

    Performance enhancement of a silicon MEMS piezoresistive single axis accelerometer with electroplated gold on a proof mass is presented in this paper. The fabricated accelerometer device consists of a heavy proof mass supported by four thin flexures. Boron-diffused piezoresistors located near the fixed ends of the flexures are used for sensing the developed stress and hence acceleration. Performance enhancement is achieved by electroplating a gold mass of 20 µm thickness on top of the proof mass. A commercially available sulfite-based solution TSG-250™ was used for the electroplating process. Aluminum metal lines were used to form a Wheatstone bridge for signal pick-up. To avoid galvanic corrosion between two dissimilar metals having contact in an electrolyte, a shadow mask technique was used to selectively deposit a Cr/Au seed layer on an insulator atop the proof mass for subsequent electrodeposition. Bulk micromachining was performed using a 5% dual-doped TMAH solution. Fabricated devices with different electroplated gold areas were tested up to ±13 g acceleration. For electroplated gold dimensions of 2500 µm × 2500 µm × 20 µm on a proof mass, sensitivity along the Z-axis is increased by 21.8% as compared to the structure without gold. Off-axis sensitivities along the X- and Y-axes are reduced by 7.6% and 6.9%, respectively.

  4. Novel processes for modular integration of silicon-germanium MEMS with CMOS electronics

    Science.gov (United States)

    Low, Carrie Wing-Zin

    Equipment control, process development and materials characterization for LPCVD poly-SiGe for MEMS applications are investigated in this work. In order to develop a repeatable process in an academic laboratory, equipment monitoring methods are implemented and new process gases are explored. With the dopant gas BCl3, the design-of-experiments technique is used to study the dependencies of deposition rate, resistivity, average residual stress, strain gradient and wet etch rate in hydrogen-peroxide. Structural layer requirements for general MEMS applications are met within the process temperature constraint imposed by CMOS electronics. However, the strain gradient required for inertial sensor applications is difficult to achieve with as-deposited films. Approaches to reduce the strain gradient of LPCVD poly-SiGe are investigated. Correlation between the strain gradient and film microstructure is found using stress-depth profiling and cross-sectional TEM analysis. The effects of film deposition conditions on film microstructure are also determined. Boron-doped poly-SiGe films generally have vertically oriented grains---either conical or columnar in shape. Films with conical grain structure have large strain gradient due to highly compressive stress in the lower (initially deposited) region of the film. Films with small strain gradient usually have columnar grain structure with low defect density. It is also found that the uniformity of films deposited in a batch LPCVD reactor can be improved by increasing the deposited film thickness, using a proper seeding layer, and/or depositing the film in multiple layers. The best strain gradient achieved in our academic research laboratory is 1.1x10-6 mum-1 for a ˜3.5 mum thick film deposited at 410°C in 8 hours, with a worst-case variation across a 150 mm-diameter wafer of 1.6x10 -5 mum-1 and a worse-case variation across a load of twenty-five wafers of 7x10-5 mum-1. The effects of post-deposition annealing and argon

  5. MEMS silicon-based micro-evaporator with diamond-shaped fins

    NARCIS (Netherlands)

    Mihailovic, M.; Rops, C.; Creemer, J.F.; Sarro, P.M.

    2010-01-01

    A new design of micro-evaporators, with 45 channels (View the MathML source100?m deep) and diamond-shaped fins (View the MathML source40?m wide, View the MathML source160?m long, View the MathML source20?m separation), is fabricated by anodic bonding of silicon and glass wafers, in a five masks

  6. MEMS-based Porous Silicon Preconcentrators Filled with Carbopack-B for Explosives Detection

    OpenAIRE

    Camara , El Hadji Malik; James , Franck; Breuil , Philippe; Pijolat , Christophe; Briand , Danick; De Rooij , Nicolaas F

    2014-01-01

    International audience; In this paper we report the detection of explosive compounds using a miniaturized gas preconcentrator (μGP) made of porous silicon (PS) filled in with Carbopack B as an adsorbent material. The μGP includes also a platinum heater patterned at the backside and fluidic connectors sealed on the glass cover. Our μGP is designed and optimized through fluidic and thermal simulations for meeting the requirements of trace explosives detection. The thermal mass of the device was...

  7. Acceleration of dormant storage effects to address the reliability of silicon surface micromachined Micro-Electro-Mechanical Systems (MEMS).

    Energy Technology Data Exchange (ETDEWEB)

    Cox, James V.; Candelaria, Sam A.; Dugger, Michael Thomas; Duesterhaus, Michelle Ann; Tanner, Danelle Mary; Timpe, Shannon J.; Ohlhausen, James Anthony; Skousen, Troy J.; Jenkins, Mark W.; Jokiel, Bernhard, Jr.; Walraven, Jeremy Allen; Parson, Ted Blair

    2006-06-01

    Qualification of microsystems for weapon applications is critically dependent on our ability to build confidence in their performance, by predicting the evolution of their behavior over time in the stockpile. The objective of this work was to accelerate aging mechanisms operative in surface micromachined silicon microelectromechanical systems (MEMS) with contacting surfaces that are stored for many years prior to use, to determine the effects of aging on reliability, and relate those effects to changes in the behavior of interfaces. Hence the main focus was on 'dormant' storage effects on the reliability of devices having mechanical contacts, the first time they must move. A large number ({approx}1000) of modules containing prototype devices and diagnostic structures were packaged using the best available processes for simple electromechanical devices. The packaging processes evolved during the project to better protect surfaces from exposure to contaminants and water vapor. Packages were subjected to accelerated aging and stress tests to explore dormancy and operational environment effects on reliability and performance. Functional tests and quantitative measurements of adhesion and friction demonstrated that the main failure mechanism during dormant storage is change in adhesion and friction, precipitated by loss of the fluorinated monolayer applied after fabrication. The data indicate that damage to the monolayer can occur at water vapor concentrations as low as 500 ppm inside the package. The most common type of failure was attributed to surfaces that were in direct contact during aging. The application of quantitative methods for monolayer lubricant analysis showed that even though the coverage of vapor-deposited monolayers is generally very uniform, even on hidden surfaces, locations of intimate contact can be significantly depleted in initial concentration of lubricating molecules. These areas represent defects in the film prone to adsorption of

  8. Resonant frequency of the silicon micro-structure of MEMS vector hydrophone in fluid-structure interaction

    Directory of Open Access Journals (Sweden)

    Guojun Zhang

    2015-04-01

    Full Text Available The MEMS vector hydrophone developed by the North University of China has advantages of high Signal to Noise Ratio, ease of array integration, etc. However, the resonance frequency of the MEMS device in the liquid is different from that in the air due to the fluid-structure interaction (FSI. Based on the theory of Fluid-Solid Coupling, a generalized distributed mass attached on the micro-structure has been found, which results in the resonance frequency of the microstructure in the liquid being lower than that in the air. Then, an FSI simulation was conducted by ANSYS software. Finally, the hydrophone was measured by using a shaking table and a vector hydrophone calibration system respectively. Results show that, due to the FSI, the resonance frequency of the MEMS devices of the bionic vector hydrophone in the liquid declines approximately 30% compared to the case in the air.

  9. A comparison of mechanical properties of three MEMS materials - silicon carbide, ultrananocrystalline diamond, and hydrogen-free tetrahedral amorphous carbon (Ta-C)

    Energy Technology Data Exchange (ETDEWEB)

    Carlisle, John A. (Argonne National Laboratory, Argonne, IL); Moldovan, N. (Northwestern University, Evanston, IL); Xiao, Xingcheng (Argonne National Laboratory, Argonne, IL); Zorman, C. A. (Case Western Reserve University, Cleveland, OH); Mancini, D. C. (Argonne National Laboratory, Argonne, IL); Peng, B. (Northwestern University, Evanston, IL); Espinosa, H. D. (Northwestern University, Evanston, IL); Friedmann, Thomas Aquinas; Auciello, Orlando, (Argonne National Laboratory, Argonne, IL)

    2004-06-01

    Many MEMS devices are based on polysilicon because of the current availability of surface micromachining technology. However, polysilicon is not the best choice for devices where extensive sliding and/or thermal fields are applied due to its chemical, mechanical and tribological properties. In this work, we investigated the mechanical properties of three new materials for MEMS/NEMS devices: silicon carbide (SiC) from Case Western Reserve University (CWRU), ultrananocrystalline diamond (UNCD) from Argonne National Laboratory (ANL), and hydrogen-free tetrahedral amorphous carbon (ta-C) from Sandia National Laboratories (SNL). Young's modulus, characteristic strength, fracture toughness, and theoretical strength were measured for these three materials using only one testing methodology - the Membrane Deflection Experiment (MDE) developed at Northwestern University. The measured values of Young's modulus were 430GPa, 960GPa, and 800GPa for SiC, UNCD, and ta-C, repectively. Fracture toughness measurments resulted in values of 3.2, 4.5, and 6.2 MPa x m{sup 1/2}, respectively. The strengths were found to follow a Weibull distribution but their scaling was found to be controlled by different specimen size parameters. Therefore, a cross comparison of the strengths is not fully meaningful. We instead propose to compare their theoretical strengths as determined by employing Novozhilov fracture criterion. The estimated theoretical strength for SiC is 10.6GPa at a characteristic length of 58nm, for UNCD is 18.6GPa at a characteristic length of 37nm, and for ta-C is 25.4GPa at a characteristic length of 38nm. The techniques used to obtained these results as well as microscopic fractographic analyses are summarized in the article. We also highlight the importance of characterizing mechanical properties of MEMS materials by means of only one simple and accurate experimental technique.

  10. Integrated design of MEMS

    DEFF Research Database (Denmark)

    De Grave, Arnaud; Brissaud, Daniel

    2007-01-01

    . Manufacturing is mainly coming from the silicon industry. Our interest is to highlight the differences between designing MEMS and designing classical ICs or mechanical devices, to propose new methods and aided-tools supporting the design process. Our methodology is based on an ethnographic approach through...

  11. CMOS MEMS Fabrication Technologies and Devices

    Directory of Open Access Journals (Sweden)

    Hongwei Qu

    2016-01-01

    Full Text Available This paper reviews CMOS (complementary metal-oxide-semiconductor MEMS (micro-electro-mechanical systems fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

  12. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  13. Effects of Radiation on MEMS

    OpenAIRE

    Shea, Herbert

    2011-01-01

    The sensitivity of MEMS devices to radiation is reviewed, with an emphasis on radiation levels representative of space missions. While silicon and metals generally do not show mechanical degradation at the radiation levels encountered in most missions, MEMS devices have been reported to fail at doses of as few krad, corresponding to less than one year in most orbits. Radiation sensitivity is linked primarily to the impact on device operation of radiation-induced trapped charge in dielectrics...

  14. Characterization of MEMS FTIR spectrometer

    Science.gov (United States)

    Khalil, Diaa; Sabry, Yasser; Omran, Haitham; Medhat, Mostafa; Hafez, Amr; Saadany, Bassam

    2011-03-01

    In this work we present the full characterization of an optical MEMS Fourier Transform Infra Red FTIR spectrometer fabricated by Deep Reactive Ion Etching DRIE Technology on Silicon substrate. Both electrical and optical properties of the spectrometer are measured. The presented techniques allows to build an engineering model for the spectrometer and to predict its main specifications taking into account the specificity of the MEMS technology used in the spectrometer fabrication.

  15. Cryogenic MEMS Pressure Sensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — A directly immersible cryogenic MEMS pressure sensor will be developed. Each silicon die will contain a vacuum-reference and a tent-like membrane. Offsetting thermal...

  16. RF sputtering: A viable tool for MEMS fabrication

    Indian Academy of Sciences (India)

    In the present work, we report preparation of silicon dioxide, silicon nitride and piezoelec- tric ZnO films by RF sputtering process. The properties of these films relevant for MEMS applications have been evaluated. The application of these films in fabricating basic MEMS structures such as diaphragm, micro-cantilever beams ...

  17. MEMS Calculator

    Science.gov (United States)

    SRD 166 MEMS Calculator (Web, free access)   This MEMS Calculator determines the following thin film properties from data taken with an optical interferometer or comparable instrument: a) residual strain from fixed-fixed beams, b) strain gradient from cantilevers, c) step heights or thicknesses from step-height test structures, and d) in-plane lengths or deflections. Then, residual stress and stress gradient calculations can be made after an optical vibrometer or comparable instrument is used to obtain Young's modulus from resonating cantilevers or fixed-fixed beams. In addition, wafer bond strength is determined from micro-chevron test structures using a material test machine.

  18. Modeling nonlinearities in MEMS oscillators.

    Science.gov (United States)

    Agrawal, Deepak K; Woodhouse, Jim; Seshia, Ashwin A

    2013-08-01

    We present a mathematical model of a microelectromechanical system (MEMS) oscillator that integrates the nonlinearities of the MEMS resonator and the oscillator circuitry in a single numerical modeling environment. This is achieved by transforming the conventional nonlinear mechanical model into the electrical domain while simultaneously considering the prominent nonlinearities of the resonator. The proposed nonlinear electrical model is validated by comparing the simulated amplitude-frequency response with measurements on an open-loop electrically addressed flexural silicon MEMS resonator driven to large motional amplitudes. Next, the essential nonlinearities in the oscillator circuit are investigated and a mathematical model of a MEMS oscillator is proposed that integrates the nonlinearities of the resonator. The concept is illustrated for MEMS transimpedance-amplifier- based square-wave and sine-wave oscillators. Closed-form expressions of steady-state output power and output frequency are derived for both oscillator models and compared with experimental and simulation results, with a good match in the predicted trends in all three cases.

  19. Status of the MEMS Industry: Evolution or MEMS Markets and of the Industrial Infrastructure

    Directory of Open Access Journals (Sweden)

    J. C. ELOY

    2007-12-01

    Full Text Available The MEMS markets in 2006 reached US$ 5.8 B and we can estimate that the 2011 MEMS markets will reach more than US $ 10.7 B, with very diverse growth rate depending on the devices and the applications: silicon microphone and RF MEMS are the fastest growing applications but the existing applications like ink jet head and pressure sensors are still growing at a rate of 4 % per year at least. The industrial infrastructure is changing, with more and more companies going to 8’’ manufacturing facilities and the strong growth of the MEMS foundry business. MEMS business is changing for more structured industry and high volume production.

  20. On the Stiction of MEMS Materials

    DEFF Research Database (Denmark)

    Zhuang, Yanxin; Menon, Aric Kumaran

    2005-01-01

    energies and stiction of commonly used MEMS materials by contact angle measurements and atomic force microscopy (AFM). Dispersive and polar components of surface energies are calculated by Owens-Wendt-Rabel-Kaelble method. Silicon and silicon-related materials have higher polar surface energies than SU-8...... been shown that the materials with higher surface energy have higher sticton/adhesion forces. The topography of surface influences the contact angle and stiction, and is also discussed in the paper....

  1. SiC MEMS For Harsh Environments

    National Research Council Canada - National Science Library

    Bradley, Kenneth

    2003-01-01

    This document is the final technical report for the SiC MEMS for Harsh Environments in-house research program jointly coordinated between AFRL/MNMF and AFRL/MLPS, and addresses the benefits of silicon carbide (SiC...

  2. Parylene for MEMS applications

    Science.gov (United States)

    Yao, Tze-Jung

    The goal of this thesis is to utilize Parylene, a room-temperature chemical-vapor-deposited (CVD) polymer, for MicroElectroMechanical Systems (MEMS) applications. The identified unique properties of Parylene are used to fabricate various micromachining devices such as thermopneumatic microvalve, in-channel microflow restrictor, and electret microphones. First, the properties of Parylene as a MEMS material are reviewed. The electrical, thermal, surface, and mechanical properties are first compared with that of other materials and further studied specifically for MEMS applications. The high dielectric strength (determined as 250V/mum) of Parylene makes it suitable for use as an electrical insulation material. However, its high resistivity causes un-desired charging effects first described in polymer-based electrostatic devices. The undesired high pull-in voltage, "bounce-back," and "snap-down" effects caused by dielectric charging are studied. Second, to make Parylene as a surface-micromachined material, a process that overcomes the stiction problem has to be developed. Thus, a new technique that combines wet-acetone dissolution and dry BrF3 dry etching has developed to overcome the stiction problem, which prevents Parylene microstructures from freestanding. The devices of mm*mm size with high yield are demonstrated using this technology. A thermopneumatic microvalve with a corrugated silicone/Parylene composite membrane is designed, fabricated, and tested for gas flows of several slpm and inlet pressures of tens of psi. The lowest power consumption to turn off the gas flow is determined to be 73mW. A silicone-based microfluidic coupler, initially designed for microvalve packaging, is also demonstrated for its ability to connect the external macrofluidic world to microfluidic devices. The demonstrated "quick-connect" microfluidic coupler has low leakage, is reusable, and can maintain good seal up to 60 psi. An in-channel microflow restrictor is also demonstrated with

  3. Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program

    Energy Technology Data Exchange (ETDEWEB)

    Schriner, H.; Davies, B.; Sniegowski, J.; Rodgers, M.S.; Allen, J.; Shepard, C.

    1998-05-01

    Research and development in the design and manufacture of Microelectromechanical Systems (MEMS) is growing at an enormous rate. Advances in MEMS design tools and fabrication processes at Sandia National Laboratories` Microelectronics Development Laboratory (MDL) have broadened the scope of MEMS applications that can be designed and manufactured for both military and commercial use. As improvements in micromachining fabrication technologies continue to be made, MEMS designs can become more complex, thus opening the door to an even broader set of MEMS applications. In an effort to further research and development in MEMS design, fabrication, and application, Sandia National Laboratories has launched the Sandia Agile MEMS Prototyping, Layout Tools, Education and Services Program or SAMPLES program. The SAMPLES program offers potential partners interested in MEMS the opportunity to prototype an idea and produce hardware that can be used to sell a concept. The SAMPLES program provides education and training on Sandia`s design tools, analysis tools and fabrication process. New designers can participate in the SAMPLES program and design MEMS devices using Sandia`s design and analysis tools. As part of the SAMPLES program, participants` designs are fabricated using Sandia`s 4 level polycrystalline silicon surface micromachine technology fabrication process known as SUMMiT (Sandia Ultra-planar, Multi-level MEMS Technology). Furthermore, SAMPLES participants can also opt to obtain state of the art, post-fabrication services provided at Sandia such as release, packaging, reliability characterization, and failure analysis. This paper discusses the components of the SAMPLES program.

  4. Wafer level packaging of MEMS

    International Nuclear Information System (INIS)

    Esashi, Masayoshi

    2008-01-01

    Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

  5. Effect of Radiation on Silicon and Borosilicate Glass

    National Research Council Canada - National Science Library

    Allred, Clark

    2003-01-01

    .... These two glasses are commonly used as substrates for silicon microelectromechanical (MEMS) devices, and radiation-induced compaction in a substrate can have deleterious effects on device performance...

  6. A MEMS Energy Harvesting Device for Vibration with Low Acceleration

    DEFF Research Database (Denmark)

    Triches, Marco; Wang, Fei; Crovetto, Andrea

    2012-01-01

    We propose a polymer electret based energy harvesting device in order to extract energy from vibration sources with low acceleration. With MEMS technology, a silicon structure is fabricated which can resonate in 2D directions. Thanks to the excellent mechanical properties of the silicon material...

  7. A single-mask thermal displacement sensor in MEMS

    NARCIS (Netherlands)

    Krijnen, B.; Krijnen, B.; Hogervorst, R.P.; van Dijk, J.W.; Engelen, Johannes Bernardus Charles; Woldering, L.A.; Brouwer, Dannis Michel; Abelmann, Leon; Soemers, Herman

    2011-01-01

    This work presents a MEMS displacement sensor based on the conductive heat transfer of a resistively heated silicon structure towards an actuated stage parallel to the structure. This differential sensor can be easily incorporated into a silicon-on-insulator-based process, and fabricated within the

  8. Biomaterials for MEMS

    CERN Document Server

    Chiao, Mu

    2011-01-01

    This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the necessary background in biomaterials.Biomaterials for MEMS highlights important features and issues of biomaterials that have been used in MEMS and biomedical areas. Hence this book is an essential guide for MEMS engineers or researchers who are trained in engineering institutes that do not provide the background or knowledge

  9. IC-Compatible Technologies for Optical MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Krygowski, T.W.; Sniegowski, J.J.

    1999-04-30

    Optical Micro Electro Mechanical Systems (Optical MEMS) Technology holds the promise of one-day producing highly integrated optical systems on a common, monolithic substrate. The choice of fabrication technology used to manufacture Optical MEMS will play a pivotal role in the size, functionality and ultimately the cost of optical Microsystems. By leveraging the technology base developed for silicon integrated circuits, large batches of routers, emitters, detectors and amplifiers will soon be fabricated for literally pennies per part. In this article we review the current status of technologies used for Optical MEMS, as well as fabrication technologies of the future, emphasizing manufacturable surface micromachining approaches to producing reliable, low-cost devices for optical communications applications.

  10. Vortex Anemometer Using MEMS Cantilever Sensor

    CERN Document Server

    Zylka, P; Zylka, Pawel; Modrzynski, Pawel

    2010-01-01

    This paper presents construction and performance of a novel hybrid microelectromechanical system (MEMS) vortex flowmeter. A miniature cantilever MEMS displacement sensor was used to detect frequency of vortices development. 3-mm-long silicon cantilever, protruding directly out of a trailing edge of a trapezoidal glass-epoxy composite bluff body was put into oscillatory motion by vortices shed alternately from side surfaces of the obstacle. Verified linearmeasurement range of the device extended from 5 to 22 m/s; however, it could be broadened in absence of external 50-Hz mains electrical interfering signal which required bandpass frequency-domain digital sensor signal processing. The MEMS vortex sensor proved its effectiveness in detection of semilaminar airflow velocity distribution in a 40-mm-diameter tubular pipe.

  11. MEMS-BASED OSCILLATORS: A REVIEW

    Directory of Open Access Journals (Sweden)

    Jamilah Karim

    2014-05-01

    Full Text Available ABSTRACT: This paper presents an overview of microelectromechanical (MEMS based oscillators. The accuracy and stability of the reference frequency will normally limit the performance of most wireless communication systems. MEMS technology is the technology of choice due to its compatibility to silicon, leading to integration with circuits and lowering power consumption. MEMS based oscillators also provide the potential of a fully integrated transceiver. The most commonly used topology for MEMS based oscillators are pierce oscillator circuit topology and TIA circuit topology. Both topologies result in very competitive output in terms of phase noise and power consumption.  They can be used for either higher or lower Rx. The major difference between both topologies is the number of transistors used. TIA circuit used more number of transistor compare to pierce circuit. Thus design complexity of the TIA is higher. Pierce circuit is simpler, provide straightforward biasing and easier to design. The highly integratable of MEMS-based oscillators have made them much needed in future multiband wireless system. So that future wireless systems are able to function globally without any problem. ABSTRAK: Kertas kerja ini membentangkan gambaran keseluruhan mikroelektromekanikal (MEMS berdasarkan pengayun.  Ketepatan dan kestabilan frekuensi rujukan sering membataskan perlaksanaan kebanyakan sistem komunikasi tanpa wayar. Teknologi MEMS merupakan teknologi pilihan memandangkan ia serasi dengan silikon; membolehkan integrasi dengan litar dan penggunaan tenaga yang rendah.  Pengayun berdasarkan MEMS juga  berpotensi sebagai integrasi penuh penghantar-terima. Topologi yang sering digunakan untuk pengayun berdasarkan MEMS adalah topologi litar pengayun pencantas dan topologi litar TIA.  Keputusan bagi kedua-dua topologi adalah amat kompetitif dari segi fasa bunyi dan penggunaan tenaga. Ia boleh digunakan untuk meninggikan atau merendahkan Rx. Perbezaan utama

  12. Design, fabrication, testing and packaging of a silicon ...

    Indian Academy of Sciences (India)

    In this paper, we describe the fabrication, wafer level test- ing and packaging of a silicon on glass based RF MEMS switch fabricated using DRIE. The device is a SPST direct contact series switch. The silicon on glass fabrication process has been suc- cessfully adapted by a number of groups to fabricate MEMS devices such ...

  13. SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

    KAUST Repository

    Ramadan, Khaled S.

    2012-04-01

    Polymer based microelectromechanical systems (MEMS) micromachining is finding more interest in research and applications. This is due to its low cost and less time processing compared with silicon MEMS. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic devices. In addition to being processed with low cost, it is a biocompatible material with good mechanical properties. Also, amorphous silicon (α-Si) has found use as a sacrificial layer in silicon MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed using amorphous silicon (α-Si) as a sacrificial layer. Electrostatic actuation and sensing is used in many MEMS applications. SU-8 is a dielectric material which limits its direct use in electrostatic actuation. This thesis provides a MEMS process with two conductive metal electrodes that can be used for out-of-plane electrostatic applications like MEMS switches and variable capacitors. The process provides the fabrication of dimples that can be conductive or non-conductive to facilitate more flexibility for MEMS designers. This SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were tuned for two sets of thicknesses which are thin (5-10μm) and thick (130μm). Chevron bent-beam structures and different suspended beams (cantilevers and bridges) were fabricated to characterize the SU-8 process through extracting the density, Young’s Modulus and the Coefficient of Thermal Expansion (CTE) of SU-8. Also, the process was tested and used as an educational tool through which different MEMS structures were fabricated including MEMS switches, variable capacitors and thermal actuators.

  14. CMOS-MEMS Microgravity Accelerometer with High-Precision DC Response Project

    Data.gov (United States)

    National Aeronautics and Space Administration — In this Phase II SBIR project a high-sensitivity low-noise all-silicon CMOS-MEMS accelerometer for quasi-steady measurements of accelerations at sub 1 micro-g levels...

  15. CMOS-MEMS Microgravity Accelerometer with High-Precision DC Response Project

    Data.gov (United States)

    National Aeronautics and Space Administration — This Phase I SBIR effort initiates development of a high-sensitivity low-noise all-silicon CMOS-MEMS accelerometer for quasi-steady measurements of accelerations at...

  16. Modularly Integrated MEMS Technology

    National Research Council Canada - National Science Library

    Eyoum, Marie-Angie N

    2006-01-01

    Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation...

  17. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    conference included a theme symposium on MEMS that spanned three days with paper presentations covering various aspects of MEMS technology. Out of all the papers presented in the symposium, we selected fifteen papers based on their reviews and other feedback and asked the authors to write the papers for ...

  18. Nanotwinned metal MEMS films with unprecedented strength and stability.

    Science.gov (United States)

    Sim, Gi-Dong; Krogstad, Jessica A; Reddy, K Madhav; Xie, Kelvin Y; Valentino, Gianna M; Weihs, Timothy P; Hemker, Kevin J

    2017-06-01

    Silicon-based microelectromechanical systems (MEMS) sensors have become ubiquitous in consumer-based products, but realization of an interconnected network of MEMS devices that allows components to be remotely monitored and controlled, a concept often described as the "Internet of Things," will require a suite of MEMS materials and properties that are not currently available. We report on the synthesis of metallic nickel-molybdenum-tungsten films with direct current sputter deposition, which results in fully dense crystallographically textured films that are filled with nanotwins. These films exhibit linear elastic mechanical behavior and tensile strengths exceeding 3 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultrahigh strength is attributed to a combination of solid solution strengthening and the presence of dense nanotwins. These films also have excellent thermal and mechanical stability, high density, and electrical properties that are attractive for next-generation metal MEMS applications.

  19. RF sputtering: A viable tool for MEMS fabrication

    Indian Academy of Sciences (India)

    RF sputtering: A viable tool for MEMS fabrication. 545 obtain highly c-axis oriented films, which is a requirement for these films to be piezoelectric in nature. In addition to the dielectric films, thin films of Cr, Au, Ti and Pt on silicon or glass substrates, (used for ZnO deposition) were also deposited by RF sputtering process.

  20. Cell Culture on MEMS Platforms: A Review

    Science.gov (United States)

    Ni, Ming; Tong, Wen Hao; Choudhury, Deepak; Rahim, Nur Aida Abdul; Iliescu, Ciprian; Yu, Hanry

    2009-01-01

    Microfabricated systems provide an excellent platform for the culture of cells, and are an extremely useful tool for the investigation of cellular responses to various stimuli. Advantages offered over traditional methods include cost-effectiveness, controllability, low volume, high resolution, and sensitivity. Both biocompatible and bio-incompatible materials have been developed for use in these applications. Biocompatible materials such as PMMA or PLGA can be used directly for cell culture. However, for bio-incompatible materials such as silicon or PDMS, additional steps need to be taken to render these materials more suitable for cell adhesion and maintenance. This review describes multiple surface modification strategies to improve the biocompatibility of MEMS materials. Basic concepts of cell-biomaterial interactions, such as protein adsorption and cell adhesion are covered. Finally, the applications of these MEMS materials in Tissue Engineering are presented. PMID:20054478

  1. Microelectromechanical pump utilizing porous silicon

    Science.gov (United States)

    Lantz, Jeffrey W [Albuquerque, NM; Stalford, Harold L [Norman, OK

    2011-07-19

    A microelectromechanical (MEM) pump is disclosed which includes a porous silicon region sandwiched between an inlet chamber and an outlet chamber. The porous silicon region is formed in a silicon substrate and contains a number of pores extending between the inlet and outlet chambers, with each pore having a cross-section dimension about equal to or smaller than a mean free path of a gas being pumped. A thermal gradient is provided along the length of each pore by a heat source which can be an electrical resistance heater or an integrated circuit (IC). A channel can be formed through the silicon substrate so that inlet and outlet ports can be formed on the same side of the substrate, or so that multiple MEM pumps can be connected in series to form a multi-stage MEM pump. The MEM pump has applications for use in gas-phase MEM chemical analysis systems, and can also be used for passive cooling of ICs.

  2. Ultra-compact MEMS FTIR spectrometer

    Science.gov (United States)

    Sabry, Yasser M.; Hassan, Khaled; Anwar, Momen; Alharon, Mohamed H.; Medhat, Mostafa; Adib, George A.; Dumont, Rich; Saadany, Bassam; Khalil, Diaa

    2017-05-01

    Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor's spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

  3. Silicon germanium mask for deep silicon etching

    KAUST Repository

    Serry, Mohamed

    2014-07-29

    Polycrystalline silicon germanium (SiGe) can offer excellent etch selectivity to silicon during cryogenic deep reactive ion etching in an SF.sub.6/O.sub.2 plasma. Etch selectivity of over 800:1 (Si:SiGe) may be achieved at etch temperatures from -80 degrees Celsius to -140 degrees Celsius. High aspect ratio structures with high resolution may be patterned into Si substrates using SiGe as a hard mask layer for construction of microelectromechanical systems (MEMS) devices and semiconductor devices.

  4. High Volume Manufacturing and Field Stability of MEMS Products

    Science.gov (United States)

    Martin, Jack

    Low volume MEMS/NEMS production is practical when an attractive concept is implemented with business, manufacturing, packaging, and test support. Moving beyond this to high volume production adds requirements on design, process control, quality, product stability, market size, market maturity, capital investment, and business systems. In a broad sense, this chapter uses a case study approach: It describes and compares the silicon-based MEMS accelerometers, pressure sensors, image projection systems, and gyroscopes that are in high volume production. Although they serve several markets, these businesses have common characteristics. For example, the manufacturing lines use automated semiconductor equipment and standard material sets to make consistent products in large quantities. Standard, well controlled processes are sometimes modified for a MEMS product. However, novel processes that cannot run with standard equipment and material sets are avoided when possible. This reliance on semiconductor tools, as well as the organizational practices required to manufacture clean, particle-free products partially explains why the MEMS market leaders are integrated circuit manufacturers. There are other factors. MEMS and NEMS are enabling technologies, so it can take several years for high volume applications to develop. Indeed, market size is usually a strong function of price. This becomes a vicious circle, because low price requires low cost - a result that is normally achieved only after a product is in high volume production. During the early years, IC companies reduced cost and financial risk by using existing facilities for low volume MEMS production. As a result, product architectures are partially determined by capabilities developed for previous products. This chapter includes a discussion of MEMS product architecture with particular attention to the impact of electronic integration, packaging, and surfaces. Packaging and testing are critical, because they are

  5. MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

    Energy Technology Data Exchange (ETDEWEB)

    TANNER,DANELLE M.; SMITH,NORMAN F.; IRWIN,LLOYD W.; EATON,WILLIAM P.; HELGESEN,KAREN SUE; CLEMENT,J. JOSEPH; MILLER,WILLIAM M.; MILLER,SAMUEL L.; DUGGER,MICHAEL T.; WALRAVEN,JEREMY A.; PETERSON,KENNETH A.

    2000-01-01

    The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

  6. Development of the micro pixel chamber based on MEMS technology

    Directory of Open Access Journals (Sweden)

    Takemura T.

    2018-01-01

    Full Text Available Micro pixel chambers (μ-PIC are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS, however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

  7. Development of the micro pixel chamber based on MEMS technology

    Science.gov (United States)

    Takemura, T.; Takada, A.; Kishimoto, T.; Komura, S.; Kubo, H.; Matsuoka, Y.; Miuchi, K.; Miyamoto, S.; Mizumoto, T.; Mizumura, Y.; Motomura, T.; Nakamasu, Y.; Nakamura, K.; Oda, M.; Ohta, K.; Parker, J. D.; Sawano, T.; Sonoda, S.; Tanimori, T.; Tomono, D.; Yoshikawa, K.

    2018-02-01

    Micro pixel chambers (μ-PIC) are gaseous two-dimensional imaging detectors originally manufactured using printed circuit board (PCB) technology. They are used in MeV gamma-ray astronomy, medicalimaging, neutron imaging, the search for dark matter, and dose monitoring. The position resolution of the present μ-PIC is approximately 120 μm (RMS), however some applications require a fine position resolution of less than 100 μm. To this end, we have started to develop a μ-PIC based on micro electro mechanical system (MEMS) technology, which provides better manufacturing accuracy than PCB technology. Our simulation predicted the gains of MEMS μ-PICs to be twice those of PCB μ-PICs at the same anode voltage. We manufactured two MEMS μ-PICs and tested them to study their behavior. In these experiments, we successfully operated the fabricatedMEMS μ-PICs and we achieved a maximum gain of approximately 7×103 and collected their energy spectra under irradiation of X-rays from 55Fe. However, the measured gains of the MEMS μ-PICs were less than half of the values predicted in the simulations. We postulated that the gains of the MEMS μ-PICs are diminished by the effect of the silicon used as a semiconducting substrate.

  8. Stress Analysis of SiC MEMS Using Raman Spectroscopy

    Science.gov (United States)

    Ness, Stanley J.; Marciniak, M. A.; Lott, J. A.; Starman, L. A.; Busbee, J. D.; Melzak, J. M.

    2003-03-01

    During the fabrication of Micro-Electro-Mechanical Systems (MEMS), residual stress is often induced in the thin films that are deposited to create these systems. These stresses can cause the device to fail due to buckling, curling, or fracture. Industry is looking for ways to characterize the stress during the deposition of thin films in order to reduce or eliminate device failure. Micro-Raman spectroscopy has been successfully used to characterize poly-Si MEMS devices made with the MUMPS® process. Raman spectroscopy was selected because it is nondestructive, fast and has the potential for in situ stress monitoring. This research attempts to use Raman spectroscopy to analyze the stress in SiC MEMS made with the MUSiC® process. Raman spectroscopy is performed on 1-2-micron-thick SiC thin films deposited on silicon, silicon nitride, and silicon oxide substrates. The most common poly-type of SiC found in thin film MEMS made with the MUSiC® process is 3C-SiC. Research also includes baseline spectra of 6H, 4H, and 15R poly-types of bulk SiC.

  9. APPLICATION OF MEMS TECHNOLOGY TO MICRO DIRECT METHANOL FUEL CELL

    OpenAIRE

    Liu, Xiaowei; Suo, Chunguang; Zhang, Yufeng; Zhang, Haifeng; Dhum, Ch.; Chen, Weiping; Lu, Xuebin

    2006-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; In view of micro fuel cells, the silicon processes are employed for microfabrication of the micro direct methanol fuel cell (µDMFC). Using the MEMS technology we have successfully made single µDMFC as small as 10mm×8mm×3mm. The main reason for the use of MEMS processes is the prospective potential for miniaturization and economical mass production of small fuel cells. The doub...

  10. Design, modeling, and simulation of MEMS pressure sensors

    Science.gov (United States)

    Geca, Mateusz; Kociubiński, Andrzej

    2013-10-01

    This paper focuses on the design and analysis of a MEMS piezoresistive pressure sensor. The absolute pressure sensor with a 150μm wide and 3μm thick silicon membrane is modeled and simulated using CoventorWare™ softwareprofiting from a finite element method (FEM) implemented to determine specific electro-mechanical parameter values characterizing MEMS structure being designed. Optimization of piezoresistor parameters has been also performed to determine optimum dimensions of piezoresistors and their location referred to the center on the pressure sensor diaphragm. The output voltage measured on a piezoresistive Wheatstone bridge has been obtained and compared for two different resistor materials along with and linearity error analysis.

  11. Advanced Mechatronics and MEMS Devices

    CERN Document Server

    2013-01-01

    Advanced Mechatronics and MEMS Devicesdescribes state-of-the-art MEMS devices and introduces the latest technology in electrical and mechanical microsystems. The evolution of design in microfabrication, as well as emerging issues in nanomaterials, micromachining, micromanufacturing and microassembly are all discussed at length in this volume. Advanced Mechatronics also provides a reader with knowledge of MEMS sensors array, MEMS multidimensional accelerometer, artificial skin with imbedded tactile components, as well as other topics in MEMS sensors and transducers. The book also presents a number of topics in advanced robotics and an abundance of applications of MEMS in robotics, like reconfigurable modular snake robots, magnetic MEMS robots for drug delivery and flying robots with adjustable wings, to name a few. This book also: Covers the fundamentals of advanced mechatronics and MEMS devices while also presenting new state-of-the-art methodology and technology used in the application of these devices Prese...

  12. MEMS Micro-Valve for Space Applications

    Science.gov (United States)

    Chakraborty, I.; Tang, W. C.; Bame, D. P.; Tang, T. K.

    1998-01-01

    We report on the development of a Micro-ElectroMechanical Systems (MEMS) valve that is designed to meet the rigorous performance requirements for a variety of space applications, such as micropropulsion, in-situ chemical analysis of other planets, or micro-fluidics experiments in micro-gravity. These systems often require very small yet reliable silicon valves with extremely low leak rates and long shelf lives. Also, they must survive the perils of space travel, which include unstoppable radiation, monumental shock and vibration forces, as well as extreme variations in temperature. Currently, no commercial MEMS valve meets these requirements. We at JPL are developing a piezoelectric MEMS valve that attempts to address the unique problem of space. We begin with proven configurations that may seem familiar. However, we have implemented some major design innovations that should produce a superior valve. The JPL micro-valve is expected to have an extremely low leak rate, limited susceptibility to particulates, vibration or radiation, as well as a wide operational temperature range.

  13. Piezoelectric MEMS resonators

    CERN Document Server

    Piazza, Gianluca

    2017-01-01

    This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associate...

  14. EDITORIAL: International MEMS Conference 2006

    Science.gov (United States)

    Tay, Francis E. H.; Jianmin, Miao; Iliescu, Ciprian

    2006-04-01

    The International MEMS conference (iMEMS2006) organized by the Institute of Bioengineering and Nanotechnology and Nanyang Technological University aims to provide a platform for academicians, professionals and industrialists in various related fields from all over the world to share and learn from each other. Of great interest is the incorporation of the theme of life sciences application using MEMS. It is the desire of this conference to initiate collaboration and form network of cooperation. This has continued to be the objective of iMEMS since its inception in 1997. The technological advance of MEMS over the past few decades has been truly exciting in terms of development and applications. In order to participate in this rapid development, a conference involving delegates from within the MEMS community and outside the community is very meaningful and timely. With the receipt of over 200 articles, delegates related to MEMS field from all over the world will share their perspectives on topics such as MEMS/MST Design, MEMS Teaching and Education, MEMS/MST Packaging, MEMS/MST Fabrication, Microsystems Applications, System Integration, Wearable Devices, MEMSWear and BioMEMS. Invited speakers and delegates from outside the field have also been involved to provide challenges, especially in the life sciences field, for the MEMS community to potentially address. The proceedings of the conference will be published as an issue in the online Journal of Physics: Conference Series and this can reach a wider audience and will facilitate the reference and citation of the work presented in the conference. We wish to express our deep gratitude to the International Scientific Committee members and the organizing committee members for contributing to the success of this conference. We would like to thank all the delegates, speakers and sponsors from all over the world for presenting and sharing their perspectives on topics related to MEMS and the challenges that MEMS can

  15. Crystal growth and evaluation of silicon for VLSI and ULSI

    CERN Document Server

    Eranna, Golla

    2014-01-01

    PrefaceAbout the AuthorIntroductionSilicon: The SemiconductorWhy Single CrystalsRevolution in Integrated Circuit Fabrication Technology and the Art of Device MiniaturizationUse of Silicon as a SemiconductorSilicon Devices for Boolean ApplicationsIntegration of Silicon Devices and the Art of Circuit MiniaturizationMOS and CMOS Devices for Digital ApplicationsLSI, VLSI, and ULSI Circuits and ApplicationsSilicon for MEMS ApplicationsSummaryReferencesSilicon: The Key Material for Integrated Circuit Fabrication TechnologyIntroductionPreparation of Raw Silicon MaterialMetallurgical-Grade SiliconPuri

  16. NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS

    CERN Document Server

    1998-01-01

    Micro Electro Mechanical Systems (MEMS) is already about a billion dollars a year industry and is growing rapidly. So far major emphasis has been placed on the fabrication processes for various devices. There are serious issues related to tribology, mechanics, surfacechemistry and materials science in the operationand manufacturingof many MEMS devices and these issues are preventing an even faster commercialization. Very little is understood about tribology and mechanical properties on micro- to nanoscales of the materials used in the construction of MEMS devices. The MEMS community needs to be exposed to the state-of-the-artoftribology and vice versa. Fundamental understanding of friction/stiction, wear and the role of surface contamination and environmental debris in micro devices is required. There are significantadhesion, friction and wear issues in manufacturing and actual use, facing the MEMS industry. Very little is understood about the tribology of bulk silicon and polysilicon films used in the constr...

  17. MEMS: A new approach to micro-optics

    Energy Technology Data Exchange (ETDEWEB)

    Sniegowski, J.J.

    1997-12-31

    MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlights polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.

  18. Development of a Multi-User Polyimide-MEMS Fabrication Process and its Application to MicroHotplates

    KAUST Repository

    Lizardo, Ernesto B.

    2013-05-08

    Micro-electro-mechanical systems (MEMS) became possible thanks to the silicon based technology used to fabricate integrated circuits. Originally, MEMS fabrication was limited to silicon based techniques and materials, but the expansion of MEMS applications brought the need of a wider catalog of materials, including polymers, now being used to fabricate MEMS. Polyimide is a very attractive polymer for MEMS fabrication due to its high temperature stability compared to other polymers, low coefficient of thermal expansion, low film stress and low cost. The goal of this thesis is to expand the Polyimide usage as structural material for MEMS by the development of a multi-user fabrication process for the integration of this polymer along with multiple metal layers on a silicon substrate. The process also integrates amorphous silicon as sacrificial layer to create free-standing structures. Dry etching is used to release the devices and avoid stiction phenomena. The developed process is used to fabricate platforms for micro-hotplate gas sensors. The fabrication steps for the platforms are described in detail, explaining the process specifics and capabilities. An initial testing of the micro-hotplate is presented. As the process was also used as educational tool, some designs made by students and fabricated with the Polyimide-MEMS process are also presented.

  19. Photonic MEMS switch applications

    Science.gov (United States)

    Husain, Anis

    2001-07-01

    As carriers and service providers continue their quest for profitable network solutions, they have shifted their focus from raw bandwidth to rapid provisioning, delivery and management of revenue generating services. Inherently transparent to data rate the transmission wavelength and data format, MEMS add scalability, reliability, low power and compact size providing flexible solutions to the management and/or fiber channels in long haul, metro, and access networks. MEMS based photonic switches have gone from the lab to commercial availability and are now currently in carrier trials and volume production. 2D MEMS switches offer low up-front deployment costs while remaining scalable to large arrays. They allow for transparent, native protocol transmission. 2D switches enable rapid service turn-up and management for many existing and emerging revenue rich services such as storage connectivity, optical Ethernet, wavelength leasing and optical VPN. As the network services evolve, the larger 3D MEMS switches, which provide greater scalability and flexibility, will become economically viable to serve the ever-increasing needs.

  20. Microelectromechanical Systems (MEMS)

    Indian Academy of Sciences (India)

    As a field, Microelectromechanical Systems (MEMS) has matured over the last two decades to have several scientific journals dedicated to it. These journals are instrumental in bringing out the interdisciplinary nature of research that the field demands. In the beginning, most papers were process centric where realization of ...

  1. MEMS Solar Generators

    OpenAIRE

    Grbovic, Dragoslav; Osswald, Sebastian

    2011-01-01

    Approved for public release; distribution is unlimited Using MEMS bimaterial structures to build highly efficient solar energy generators. This is a novel approach that utilizes developments in the area of bimaterial sensors and applies them in the field of solar energy harvesting.

  2. Characterization of assembled MEMS

    Science.gov (United States)

    Jandric, Zoran; Randall, John N.; Saini, Rahul; Nolan, Michael; Skidmore, George

    2005-01-01

    Zyvex is developing a low-cost high-precision method for manufacturing MEMS-based three-dimensional structures/assemblies. The assembly process relies on compliant properties of the interconnecting components. The sockets and connectors are designed to benefit from their compliant nature by allowing the mechanical component to self-align, i.e. reposition themselves to their designed, stable position, independent of the initial placement of the part by the external robot. Thus, the self-aligning property guarantees the precision of the assembled structure to be very close to, or the same, as the precision of the lithography process itself. A three-dimensional (3D) structure is achieved by inserting the connectors into the sockets through the use of a passive end-effector. We have developed the automated, high-yield, assembly procedure which permits connectors to be picked up from any location within the same die, or a separate die. This general procedure allows for the possibility to assemble parts of dissimilar materials. We have built many 3D MEMS structures, including several 3D MEMS devices such as a scanning electron microscope (SEM) micro column, mass-spectrometer column, variable optical attenuator. For these 3D MEMS structures we characterize their mechanical strength through finite element simulation, dynamic properties by finite-element analysis and experimentally with UMECH"s MEMS motion analyzer (MMA), alignment accuracy by using an in-house developed dihedral angle measurement laser autocollimator, and impact properties by performing drop tests. The details of the experimental set-ups, the measurement procedures, and the experimental data are presented in this paper.

  3. European MEMS foundries

    Science.gov (United States)

    Salomon, Patric R.

    2003-01-01

    According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

  4. Highly elastic conductive polymeric MEMS

    Science.gov (United States)

    Ruhhammer, J.; Zens, M.; Goldschmidtboeing, F.; Seifert, A.; Woias, P.

    2015-02-01

    Polymeric structures with integrated, functional microelectrical mechanical systems (MEMS) elements are increasingly important in various applications such as biomedical systems or wearable smart devices. These applications require highly flexible and elastic polymers with good conductivity, which can be embedded into a matrix that undergoes large deformations. Conductive polydimethylsiloxane (PDMS) is a suitable candidate but is still challenging to fabricate. Conductivity is achieved by filling a nonconductive PDMS matrix with conductive particles. In this work, we present an approach that uses new mixing techniques to fabricate conductive PDMS with different fillers such as carbon black, silver particles, and multiwalled carbon nanotubes. Additionally, the electrical properties of all three composites are examined under continuous mechanical stress. Furthermore, we present a novel, low-cost, simple three-step molding process that transfers a micro patterned silicon master into a polystyrene (PS) polytetrafluoroethylene (PTFE) replica with improved release features. This PS/PTFE mold is used for subsequent structuring of conductive PDMS with high accuracy. The non sticking characteristics enable the fabrication of delicate structures using a very soft PDMS, which is usually hard to release from conventional molds. Moreover, the process can also be applied to polyurethanes and various other material combinations.

  5. Micro-electro-mechanical systems (MEMS: Technology for the 21st century

    Directory of Open Access Journals (Sweden)

    Đakov Tatjana A.

    2014-01-01

    Full Text Available Micro-electro-mechanical systems (MEMS are miniturized devices that can sense the environment, process and analyze information, and respond with a variety of mechanical and electrical actuators. MEMS consists of mechanical elements, sensors, actuators, electrical and electronics devices on a common silicon substrate. Micro-electro-mechanical systems are becoming a vital technology for modern society. Some of the advantages of MEMS devices are: very small size, very low power consumption, low cost, easy to integrate into systems or modify, small thermal constant, high resistance to vibration, shock and radiation, batch fabricated in large arrays, improved thermal expansion tolerance. MEMS technology is increasingly penetrating into our lives and improving quality of life, similar to what we experienced in the microelectronics revolution. Commercial opportunities for MEMS are rapidly growing in broad application areas, including biomedical, telecommunication, security, entertainment, aerospace, and more in both the consumer and industrial sectors on a global scale. As a breakthrough technology, MEMS is building synergy between previously unrelated fields such as biology and microelectronics. Many new MEMS and nanotechnology applications will emerge, expanding beyond that which is currently identified or known. MEMS are definitely technology for 21st century.

  6. MEMS-based thick film PZT vibrational energy harvester

    DEFF Research Database (Denmark)

    Lei, Anders; Xu, Ruichao; Thyssen, Anders

    2011-01-01

    We present a MEMS-based unimorph silicon/PZT thick film vibrational energy harvester with an integrated proof mass. We have developed a process that allows fabrication of high performance silicon based energy harvesters with a yield higher than 90%. The process comprises a KOH etch using...... a mechanical front side protection of an SOI wafer with screen printed PZT thick film. The fabricated harvester device produces 14.0 μW with an optimal resistive load of 100 kΩ from 1g (g=9.81 m s-2) input acceleration at its resonant frequency of 235 Hz....

  7. Memória

    OpenAIRE

    Carlos Alberto Mourão Júnior; Nicole Costa Faria

    2015-01-01

    ResumoEste artigo tem como objetivo central apresentar os processos de memória de maneira didática, proporcionando aos alunos e futuros pesquisadores um primeiro contato satisfatório com o tema. Já há algum tempo, tem sido observada a ocorrência de confusões conceituais e metodológicas no campo da neurociência cognitiva, tanto em relação à memória quanto em relação às outras funções psicológicas básicas. Neste ensaio, alguns conceitos principais são esclarecidos. É apresentada uma classificaç...

  8. Introduction - MEMS Aerospace Applications

    Science.gov (United States)

    2004-02-01

    Advanced Materials and Fabrication Methods Commercial MEMS-based Products I-15 Digital Micromirrors for Sub-portable Projectors PLUS U3-880 • 2.9 lbs • 1.9...x 9” x 7” •SVGA (800 x 600) 10 um I-16 Digital Mirror Display (DMD) Texas Instruments, Inc. I-17 Micro flow-diffusion analysis system flow-diffusion

  9. Electromagnetic actuation in MEMS switches

    DEFF Research Database (Denmark)

    Oliveira Hansen, Roana Melina de; Mátéfi-Tempfli, Mária; Chemnitz, Steffen

    . Electromagnetic actuation is a very promising approach to operate such MEMS and Power MEMS devices, due to the long range, reproducible and strong forces generated by this method, among other advantages. However, the use of electromagnetic actuation in such devices requires the use of thick magnetic films, which...

  10. Topology optimized RF MEMS switches

    DEFF Research Database (Denmark)

    Philippine, M. A.; Zareie, H.; Sigmund, Ole

    2013-01-01

    Topology optimization is a rigorous and powerful method that should become a standard MEMS design tool - it can produce unique and non-intuitive designs that meet complex objectives and can dramatically improve the performance and reliability of MEMS devices. We present successful uses of topolog...

  11. Surface chemical modification for exceptional wear life of MEMS materials

    Directory of Open Access Journals (Sweden)

    R. Arvind Singh

    2011-12-01

    Full Text Available Micro-Electro-Mechanical-Systems (MEMS are built at micro/nano-scales. At these scales, the interfacial forces are extremely strong. These forces adversely affect the smooth operation and cause wear resulting in the drastic reduction in wear life (useful operating lifetime of actuator-based devices. In this paper, we present a surface chemical modification method that reduces friction and significantly extends the wear life of the two most popular MEMS structural materials namely, silicon and SU-8 polymer. The method includes surface chemical treatment using ethanolamine-sodium phosphate buffer, followed by coating of perfluoropolyether (PFPE nanolubricant on (i silicon coated with SU-8 thin films (500 nm and (ii MEMS process treated SU-8 thick films (50 μm. After the surface chemical modification, it was observed that the steady-state coefficient of friction of the materials reduced by 4 to 5 times and simultaneously their wear durability increased by more than three orders of magnitude (> 1000 times. The significant reduction in the friction coefficients is due to the lubrication effect of PFPE nanolubricant, while the exceptional increase in their wear life is attributed to the bonding between the -OH functional group of ethanolamine treated SU-8 thin/thick films and the -OH functional group of PFPE. The surface chemical modification method acts as a common route to enhance the performance of both silicon and SU-8 polymer. It is time-effective (process time ≤ 11 min, cost-effective and can be readily integrated into MEMS fabrication/assembly processes. It can also work for any kind of structural material from which the miniaturized devices are/can be made.

  12. Frequency adjustable MEMS vibration energy harvester

    Science.gov (United States)

    Podder, P.; Constantinou, P.; Amann, A.; Roy, S.

    2016-10-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators.

  13. Frequency adjustable MEMS vibration energy harvester

    International Nuclear Information System (INIS)

    Podder, P; Constantinou, P; Roy, S; Amann, A

    2016-01-01

    Ambient mechanical vibrations offer an attractive solution for powering the wireless sensor nodes of the emerging “Internet-of-Things”. However, the wide-ranging variability of the ambient vibration frequencies pose a significant challenge to the efficient transduction of vibration into usable electrical energy. This work reports the development of a MEMS electromagnetic vibration energy harvester where the resonance frequency of the oscillator can be adjusted or tuned to adapt to the ambient vibrational frequency. Micro-fabricated silicon spring and double layer planar micro-coils along with sintered NdFeB micro-magnets are used to construct the electromagnetic transduction mechanism. Furthermore, another NdFeB magnet is adjustably assembled to induce variable magnetic interaction with the transducing magnet, leading to significant change in the spring stiffness and resonance frequency. Finite element analysis and numerical simulations exhibit substantial frequency tuning range (25% of natural resonance frequency) by appropriate adjustment of the repulsive magnetic interaction between the tuning and transducing magnet pair. This demonstrated method of frequency adjustment or tuning have potential applications in other MEMS vibration energy harvesters and micromechanical oscillators. (paper)

  14. Piezoelectric Zinc Oxide Based MEMS Acoustic Sensor

    Directory of Open Access Journals (Sweden)

    Aarti Arora

    2008-04-01

    Full Text Available An acoustic sensors exhibiting good sensitivity was fabricated using MEMS technology having piezoelectric zinc oxide as a dielectric between two plates of capacitor. Thin film zinc oxide has structural, piezoelectric and optical properties for surface acoustic wave (SAW and bulk acoustic wave (BAW devices. Oxygen effficient films are transparent and insulating having wide applications for sensors and transducers. A rf sputtered piezoelectric ZnO layer transforms the mechanical deflection of a thin etched silicon diaphragm into a piezoelectric charge. For 25-micron thin diaphragm Si was etched in tetramethylammonium hydroxide solution using bulk micromachining. This was followed by deposition of sandwiched structure composed of bottom aluminum electrode, sputtered 3 micron ZnO film and top aluminum electrode. A glass having 1 mm diameter hole was bonded on backside of device to compensate sound pressure in side the cavity. The measured value of central capacitance and dissipation factor of the fabricated MEMS acoustic sensor was found to be 82.4pF and 0.115 respectively, where as the value of ~176 pF was obtained for the rim capacitance with a dissipation factor of 0.138. The response of the acoustic sensors was reproducible for the devices prepared under similar processing conditions under different batches. The acoustic sensor was found to be working from 30Hz to 8KHz with a sensitivity of 139µV/Pa under varying acoustic pressure.

  15. Mems cost analysis from laboratory to industry

    CERN Document Server

    Freng, Ron Lawes

    2016-01-01

    The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

  16. MEMS cost analysis from laboratory to industry

    CERN Document Server

    Freng, Ron Lawes

    2016-01-01

    The World of MEMS; Chapter 2: Basic Fabrication Processes; Chapter 3: Surface Microengineering. High Aspect Ratio Microengineering; Chapter 5: MEMS Testing; Chapter 6: MEMS Packaging. Clean Rooms, Buildings and Plant; Chapter 8: The MEMSCOST Spreadsheet; Chapter 9: Product Costs - Accelerometers. Product Costs - Microphones. MEMS Foundries. Financial Reporting and Analysis. Conclusions.

  17. MEMS switches having non-metallic crossbeams

    Science.gov (United States)

    Scardelletti, Maximillian C (Inventor)

    2009-01-01

    A RF MEMS switch comprising a crossbeam of SiC, supported by at least one leg above a substrate and above a plurality of transmission lines forming a CPW. Bias is provided by at least one layer of metal disposed on a top surface of the SiC crossbeam, such as a layer of chromium followed by a layer of gold, and extending beyond the switch to a biasing pad on the substrate. The switch utilizes stress and conductivity-controlled non-metallic thin cantilevers or bridges, thereby improving the RF characteristics and operational reliability of the switch. The switch can be fabricated with conventional silicon integrated circuit (IC) processing techniques. The design of the switch is very versatile and can be implemented in many transmission line mediums.

  18. Piezoelectric Films for Innovations in the Field of MEMS and Biosensors

    Science.gov (United States)

    Muralt, P.

    Microelectromechanical systems (MEMS) were born as a new technological discipline during the 1980s (for an introductory textbook, see, for instance [1]). The idea of the pioneers was to enlarge capabilities of integrated circuits based on silicon beyond pure electronics by adding mechanical elements, which were made of silicon and further materials of semiconductor technology. The addition of mechanics extended the application range of silicon technology to motion sensors, pressure and force sensors, small actuators, and a number of acoustic and ultrasonic devices, most importantly resonators for signal treatment. In order to profit from the symbiosis with electronics, those mechanical elements should, of course, be controlled by electronic signals. Evidently, this new silicon technology makes sense only for small, miniaturized devices. The technical advantage comes from the fact that powerful thin-film deposition and patterning techniques as used for semiconductor fabrication allow unprecedented precision of mechanics in the nano- to micrometer range. As a large number of devices are produced in parallel on the same wafer (batch processing), the cost level is acceptable in spite of expensive fabrication tools, at least at high production volumes. Concerning processing, the chemistry of silicon turned out to be very helpful: high etching rates of anisotropic wet etching in a base solution (as, e.g., KOH) and anisotropic deep silicon etching in a plasma reactor are crucial issues in efficiently tailoring silicon. Over the last 20 years, MEMS technology has became a proven and mature technology with many applications. While "MEMS" is still taken as a standing brand name for the field, the actual MEMS field has become much wider than stipulated by the notion of electromechanics, including thermal, optical, magnetic, chemical, biochemical, and further functional properties. Also, the main material of the device is not necessarily silicon, but may be glass or plastics

  19. Fast tunable blazed MEMS grating for external cavity lasers

    Science.gov (United States)

    Tormen, Maurizio; Niedermann, Philippe; Hoogerwerf, Arno; Shea, Herbert; Stanley, Ross

    2017-11-01

    Diffractive MEMS are interesting for a wide range of applications, including displays, scanners or switching elements. Their advantages are compactness, potentially high actuation speed and in the ability to deflect light at large angles. We have designed and fabricated deformable diffractive MEMS grating to be used as tuning elements for external cavity lasers. The resulting device is compact, has wide tunability and a high operating speed. The initial design is a planar grating where the beams are free-standing and attached to each other using leaf springs. Actuation is achieved through two electrostatic comb drives at either end of the grating. To prevent deformation of the free-standing grating, the device is 10 μm thick made from a Silicon on Insulator (SOI) wafer in a single mask process. At 100V a periodicity tuning of 3% has been measured. The first resonant mode of the grating is measured at 13.8 kHz, allowing high speed actuation. This combination of wide tunability and high operating speed represents state of the art in the domain of tunable MEMS filters. In order to improve diffraction efficiency and to expand the usable wavelength range, a blazed version of the deformable MEMS grating has been designed. A key issue is maintaining the mechanical properties of the original device while providing optically smooth blazed beams. Using a process based on anisotropic KOH etching, blazed gratings have been obtained and preliminary characterization is promising.

  20. Integrated Electromechanical Transduction Schemes for Polymer MEMS Sensors

    Directory of Open Access Journals (Sweden)

    Damien Thuau

    2018-04-01

    Full Text Available Polymer Micro ElectroMechanical Systems (MEMS have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future.

  1. Single-Mask Fabrication of Temperature Triggered MEMS Switch for Cooling Control in SSL System

    NARCIS (Netherlands)

    Wei, J.; Ye, H.; Van Zeijl, H.W.; Sarro, P.M.; Zhang, G.Q.

    2012-01-01

    A micro-electro-mechanical-system (MEMS) based, temperature triggered, switch is developed as a cost-effective solution for smart cooling control of solid-state-lighting systems. The switch (1.0x0.4 mm2) is embedded in a silicon substrate and fabricated with a single-mask 3D micro-machining process.

  2. MEMS startups: disruptive technology and business do's and don'ts

    Science.gov (United States)

    Bryzek, Janusz

    2005-02-01

    This paper characterizes factors that affect the probability of success for new startups. These guidelines are derived primarily from Venture Capital industry experience in funding disruptive technology companies. It follows with an overview of Silicon Valley MEMS and MOEMS startups and provides with a summary of Do"s and Don"ts for entrepreneurs.

  3. 76 FR 68207 - Certain Silicon Microphone Packages and Products Containing the Same; Determination To Rescind in...

    Science.gov (United States)

    2011-11-03

    ...] [FR Doc No: 2011-28488] INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-720] Certain Silicon... importation, or the sale within the United States after importation of certain silicon microphone packages and...'') prohibiting the unlicensed entry into the United States of MemsTech silicon microphone packages that infringe...

  4. Direct methanol fuel cell stack based on MEMS technology

    Science.gov (United States)

    Zhang, Yufeng; Tang, Xiaochuan; Yuan, Zhenyu; Liu, Xiaowei

    2008-10-01

    This paper presents a design configuration of silicon-based micro direct methanol fuel cell (DMFC) stack in a planar array. The integrated series connection is oriented in a "flip-flop" configuration with electrical interconnections made by thin-film metal layers that coat the flow channels etched in the silicon substrate. The configuration features small connection space and low contact resistance. The MEMS fabrication process was utilized to fabricate the silicon plates of DMFC stack. This DMFC stack with an active area of 64mm x 11mm was characterized at room temperature and normal atmosphere. Experimental results show that the prototype stack is able to generate an open-circuit voltage of 2.7V and a maximum power density of 2.2mW/cm2, which demonstrate the feasibility of this new DMFC stack configuration.

  5. Triaxial MEMS accelerometer with screen printed PZT thick film

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Almind, Ninia Sejersen; Brodersen, Simon Hedegaard

    2010-01-01

    Piezoelectric thick films have increasing interest due to the potential high sensitivity and actuation force for MEMS sensors and actuators. The screen printing technique is a promising deposition technique for realizing piezoelectric thick films in the thickness range from 10-100 mu m....... In this work integration of a screen printed piezoelectric PZT thick film with silicon MEMS technology is shown. A high bandwidth triaxial accelerometer has been designed, fabricated and characterized. The voltage sensitivity is 0.31 mV/g in the vertical direction, 0.062 mV/g in the horizontal direction...... and the first mode resonance frequency is 11 kHz. A Finite Element Method (FEM) model is used to validate the measured sensitivity and resonance frequency. Good agreement between the model and the measurements is seen....

  6. Microcutting and forming of thin aluminium foils for MEMS

    DEFF Research Database (Denmark)

    Damsgaard, Christian Danvad; Mortensen, Dennis; Rombach, Pirmin

    2011-01-01

    This paper presents a simple procedure for simultaneous cutting and forming of thin Al foils for use in MEMS components. The procedure makes use of scaled down macroscopic sheet forming and cutting techniques by using a hydraulic press, a soft counterpart, and a microfabricated stamp tool....... The relation between applied pressure and forming and cutting features has been characterized for a specific set of stamp geometries and boundary conditions. The results show that 10 μm forming features can be transferred to 4 m thick Al foils, which simultaneously can be cut into products by 25 μm wide cut...... lines. Using the procedure presented in this paper scaled to full 4-8 in. silicon wafer stamp tools, a fast and adequate method for high volume production of MEMS components is obtained. © 2011 American Society of Mechanical Engineers....

  7. Recent development of micropore optics using MEMS technologies

    Science.gov (United States)

    Ezoe, Yuichiro; Koshiishi, Masaki; Mita, Makoto; Mitsuda, Kazuhisa; Ishisaki, Yoshitaka; Hoshino, Akio; Yang, Zhen; Takano, Takayuki; Mekaru, Harutaka; Maeda, Ryutaro

    2006-06-01

    Recent development of the extremely light-weight micro pore optics based on the semiconductor MEMS (Micro Electro Mechanical System) technologies is reported. Anisotropic chemical wet etching of silicon (110) wafers were utilized, in order to obtain a row of smooth (111) side walls vertical to the wafer face and to use them as X-ray mirrors. To obtain high performance mirrors with smooth surfaces and a high aspect ratio, several modifications were made to our previous manufacturing process shown in Ezoe et al. (2005). After these improvements, smooth surfaces with rms roughness of the order of angstroms and also a high aspect ratio of 20 were achieved. Furthermore, a single-stage optic was designed as a first step to multi-stage optics. A mounting device and a slit device for the sample optic were fabricated fully using the MEMS technologies and evaluated.

  8. Development of thin film encapsulation process for piezoresistive MEMS gyroscope with wide gaps

    Science.gov (United States)

    Ayanoor-Vitikkate, Vipin

    The gyroscope is an inertial sensor used to measure the angular rate of a rotating object. This helps to determine the pitch and yaw rate of any moving body. A number of applications have been developed for consumer and automotive markets, for e.g. vehicle stability control, navigation assist, roll over detection. These are primarily used in high-end cars, where cost is not a major factor. Other areas where a MEMS Gyro can be used are robotics, camcorder stabilization, virtual reality, and more. Primarily due to cost and the size most of these applications have not reached any significant volume. One reason for this is the relatively high cost of MEMS gyros compared to other MEMS sensors like accelerometers or pressure sensors. Generally the cost of packaging a MEMS sensor is about 85-90% of the total cost. Currently most MEMS based gyroscopes are made using bulk or surface micromachining, after which they are packaged using wafer bonding. This unfortunately leads to wastage of silicon and increase in the package size, thus reducing the yield. One way to reduce the cost of packaging is by wafer scale thin film encapsulation of MEMS gyroscopes. The goal of the present work is to fabricate a rate grade MEMS gyroscope and encapsulate it by modifying an existing thin-film encapsulation technique. Packaging is an important step towards commercialization of the device and we plan to use thin wafer scale encapsulation technique developed previously in our group to package these devices. The silicon micro machined gyroscope will be fabricated on SOI (Silicon-on-Insulator) wafers using Bosch DRIE etching techniques. The encapsulation of the device is carried out using epitaxial polysilicon in order to provide a high vacuum inside the device chamber. The advantages offered by this technique are the reduction in area of the die and thus less silicon surface is wasted. In addition to this the encapsulation technique helps in creating a vacuum inside the micro device, which

  9. Dynamic Characterization of Silicon Nitride Cantilevers

    NARCIS (Netherlands)

    Babaei Gavan, K.

    2009-01-01

    This thesis describes a series of experiments on dynamical characterization of silicon nitride cantilevers. These devices play an important role in micro-and nanoelectromechanical systems (MEMS and NEMS). They consist of a mechanical part, a sensor or actuator, and an electronic part for readout and

  10. Ovenized microelectromechanical system (MEMS) resonator

    Science.gov (United States)

    Olsson, Roy H; Wojciechowski, Kenneth; Kim, Bongsang

    2014-03-11

    An ovenized micro-electro-mechanical system (MEMS) resonator including: a substantially thermally isolated mechanical resonator cavity; a mechanical oscillator coupled to the mechanical resonator cavity; and a heating element formed on the mechanical resonator cavity.

  11. Optically transduced MEMS magnetometer

    Science.gov (United States)

    Nielson, Gregory N; Langlois, Eric

    2014-03-18

    MEMS magnetometers with optically transduced resonator displacement are described herein. Improved sensitivity, crosstalk reduction, and extended dynamic range may be achieved with devices including a deflectable resonator suspended from the support, a first grating extending from the support and disposed over the resonator, a pair of drive electrodes to drive an alternating current through the resonator, and a second grating in the resonator overlapping the first grating to form a multi-layer grating having apertures that vary dimensionally in response to deflection occurring as the resonator mechanically resonates in a plane parallel to the first grating in the presence of a magnetic field as a function of the Lorentz force resulting from the alternating current. A plurality of such multi-layer gratings may be disposed across a length of the resonator to provide greater dynamic range and/or accommodate fabrication tolerances.

  12. MEMS digital parametric loudspeaker

    KAUST Repository

    Carreno, Armando Arpys Arevalo

    2016-03-23

    This paper reports on the design and fabrication of MEMS actuator arrays suitable for Digital Sound reconstruction and Parametric Directional Loudspeakers. Two distinct versions of the device were fabricated: one using the electrostatic principle actuation and the other one, the piezoelectric principle. Both versions used similar membrane dimensions, with a diameter of 500 μm. These devices are the smallest Micro-Machined Ultrasound Transducer (MUT) arrays that can be operated for both modes: Digital Sound Reconstruction and Parametric Loudspeaker. The chips consist of an array with 256 transducers, in a footprint of 12 mm by 12 mm. The total single chip size is: 2.3 cm by 2.3 cm, including the contact pads. © 2016 IEEE.

  13. A New MEMS Gyroscope Used for Single-Channel Damping.

    Science.gov (United States)

    Zhang, Zengping; Zhang, Wei; Zhang, Fuxue; Wang, Biao

    2015-04-30

    The silicon micromechanical gyroscope, which will be introduced in this paper, represents a novel MEMS gyroscope concept. It is used for the damping of a single-channel control system of rotating aircraft. It differs from common MEMS gyroscopes in that does not have a drive structure, itself, and only has a sense structure. It is installed on a rotating aircraft, and utilizes the aircraft spin to make its sensing element obtain angular momentum. When the aircraft is subjected to an angular rotation, a periodic Coriolis force is induced in the direction orthogonal to both the angular momentum and the angular velocity input axis. This novel MEMS gyroscope can thus sense angular velocity inputs. The output sensing signal is exactly an amplitude-modulation signal. Its envelope is proportional to the input angular velocity, and the carrier frequency corresponds to the spin frequency of the rotating aircraft, so the MEMS gyroscope can not only sense the transverse angular rotation of an aircraft, but also automatically change the carrier frequency over the change of spin frequency, making it very suitable for the damping of a single-channel control system of a rotating aircraft. In this paper, the motion equation of the MEMS gyroscope has been derived. Then, an analysis has been carried to solve the motion equation and dynamic parameters. Finally, an experimental validation has been done based on a precision three axis rate table. The correlation coefficients between the tested data and the theoretical values are 0.9969, 0.9872 and 0.9842, respectively. These results demonstrate that both the design and sensing mechanism are correct.

  14. MEMS based impedimetric sensing of phthalates

    KAUST Repository

    Zia, Asif I.

    2013-05-01

    Phthalate esters are known ubiquitous teratogenic and carcinogenic environmental and food pollutants. Their detection and quantification is strictly laboratory based, time consuming, expensive and professionally handled procedure. Presented research work describes a real time non-invasive detection technique for phthalates detection in ethanol, water and drinks. The new type of inter-digital sensor design incorporating multiple sensing gold electrodes were fabricated on silicon substrate based on thin film micro-electromechanical system (MEMS) using semiconductor device fabrication technology. A passivation layer of Silicon Nitride (Si3N4) was used to functionalize the sensor. Various concentrations (0.1 to 20ppm) of DINP (di-isononyl phthalates) in ethanol and di (2-ethylhexyl) phthalate (DEHP) in deionized MilliQ water were subjected to the testing system by dip testing method. Electrochemical impedance spectroscopy (EIS) technique was used to obtain impedance spectra in order to determine sample conductance for evaluation of its dielectric properties. The impedance spectra so obtained showed that the sensor was able to detect the presence of phthalates in the samples distinctively. Electrochemical Spectrum Analyser was used to model the experimentally obtained impedance spectra by curve fitting technique to figure out Constant Phase Element (CPE) equivalent circuit. Locally available energy drink and juice was added with phthalates in concentrations of 2, 6 and 10ppm to observe the performance of the sensor in such products. Experimental results showed that the new sensor was able to detect different concentrations of phthalates in energy drinks. © 2013 IEEE.

  15. MEMS for automotive and aerospace applications

    CERN Document Server

    Kraft, Michael

    2013-01-01

    MEMS for automotive and aerospace applications reviews the use of Micro-Electro-Mechanical-Systems (MEMS) in developing solutions to the unique challenges presented by the automotive and aerospace industries.Part one explores MEMS for a variety of automotive applications. The role of MEMS in passenger safety and comfort, sensors for automotive vehicle stability control applications and automotive tire pressure monitoring systems are considered, along with pressure and flow sensors for engine management, and RF MEMS for automotive radar sensors. Part two then goes on to explore MEMS for

  16. Piezoelectric MEMS: Ferroelectric thin films for MEMS applications

    Science.gov (United States)

    Kanno, Isaku

    2018-04-01

    In recent years, piezoelectric microelectromechanical systems (MEMS) have attracted attention as next-generation functional microdevices. Typical applications of piezoelectric MEMS are micropumps for inkjet heads or micro-gyrosensors, which are composed of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films and have already been commercialized. In addition, piezoelectric vibration energy harvesters (PVEHs), which are regarded as one of the key devices for Internet of Things (IoT)-related technologies, are promising future applications of piezoelectric MEMS. Significant features of piezoelectric MEMS are their simple structure and high energy conversion efficiency between mechanical and electrical domains even on the microscale. The device performance strongly depends on the function of the piezoelectric thin films, especially on their transverse piezoelectric properties, indicating that the deposition of high-quality piezoelectric thin films is a crucial technology for piezoelectric MEMS. On the other hand, although the difficulty in measuring the precise piezoelectric coefficients of thin films is a serious obstacle in the research and development of piezoelectric thin films, a simple unimorph cantilever measurement method has been proposed to obtain precise values of the direct or converse transverse piezoelectric coefficient of thin films, and recently this method has become to be the standardized testing method. In this article, I will introduce fundamental technologies of piezoelectric thin films and related microdevices, especially focusing on the deposition of PZT thin films and evaluation methods for their transverse piezoelectric properties.

  17. A MEMS-based high frequency x-ray chopper

    Energy Technology Data Exchange (ETDEWEB)

    Siria, A; Schwartz, W; Chevrier, J [Institut Neel, CNRS-Universite Joseph Fourier Grenoble, BP 166, F-38042 Grenoble Cedex 9 (France); Dhez, O; Comin, F [ESRF, 6 rue Jules Horowitz, F-38043 Grenoble Cedex 9 (France); Torricelli, G [Department of Physics and Astronomy, University of Leicester, University Road, Leicester LE1 7RH (United Kingdom)

    2009-04-29

    Time-resolved x-ray experiments require intensity modulation at high frequencies (advanced rotating choppers have nowadays reached the kHz range). We here demonstrate that a silicon microlever oscillating at 13 kHz with nanometric amplitude can be used as a high frequency x-ray chopper. We claim that using micro-and nanoelectromechanical systems (MEMS and NEMS), it will be possible to achieve higher frequencies in excess of hundreds of megahertz. Working at such a frequency can open a wealth of possibilities in chemistry, biology and physics time-resolved experiments.

  18. A MEMS-based high frequency x-ray chopper.

    Science.gov (United States)

    Siria, A; Dhez, O; Schwartz, W; Torricelli, G; Comin, F; Chevrier, J

    2009-04-29

    Time-resolved x-ray experiments require intensity modulation at high frequencies (advanced rotating choppers have nowadays reached the kHz range). We here demonstrate that a silicon microlever oscillating at 13 kHz with nanometric amplitude can be used as a high frequency x-ray chopper. We claim that using micro-and nanoelectromechanical systems (MEMS and NEMS), it will be possible to achieve higher frequencies in excess of hundreds of megahertz. Working at such a frequency can open a wealth of possibilities in chemistry, biology and physics time-resolved experiments.

  19. A MEMS-based high frequency x-ray chopper

    International Nuclear Information System (INIS)

    Siria, A; Schwartz, W; Chevrier, J; Dhez, O; Comin, F; Torricelli, G

    2009-01-01

    Time-resolved x-ray experiments require intensity modulation at high frequencies (advanced rotating choppers have nowadays reached the kHz range). We here demonstrate that a silicon microlever oscillating at 13 kHz with nanometric amplitude can be used as a high frequency x-ray chopper. We claim that using micro-and nanoelectromechanical systems (MEMS and NEMS), it will be possible to achieve higher frequencies in excess of hundreds of megahertz. Working at such a frequency can open a wealth of possibilities in chemistry, biology and physics time-resolved experiments.

  20. Conceptual MEMS Devices for a Redeployable Antenna

    National Research Council Canada - National Science Library

    Miller, Virginia

    2007-01-01

    Micro-Electro-Mechanical Systems (MEMS) are becoming an integral part of our lives through a wide range of applications, including MEMS accelerators for air bag deployment in vehicles, micromirrors in projection devices, and various...

  1. Microelectromechanical (MEM) thermal actuator

    Science.gov (United States)

    Garcia, Ernest J [Albuquerque, NM; Fulcher, Clay W. G. [Sandia Park, NM

    2012-07-31

    Microelectromechanical (MEM) buckling beam thermal actuators are disclosed wherein the buckling direction of a beam is constrained to a desired direction of actuation, which can be in-plane or out-of-plane with respect to a support substrate. The actuators comprise as-fabricated, linear beams of uniform cross section supported above the substrate by supports which rigidly attach a beam to the substrate. The beams can be heated by methods including the passage of an electrical current through them. The buckling direction of an initially straight beam upon heating and expansion is controlled by incorporating one or more directional constraints attached to the substrate and proximal to the mid-point of the beam. In the event that the beam initially buckles in an undesired direction, deformation of the beam induced by contact with a directional constraint generates an opposing force to re-direct the buckling beam into the desired direction. The displacement and force generated by the movement of the buckling beam can be harnessed to perform useful work, such as closing contacts in an electrical switch.

  2. Structured synthesis of MEMS using evolutionary approaches

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Achiche, Sofiane

    2008-01-01

    In this paper, we discuss the hierarchy that is involved in a typical MEMS design and how evolutionary approaches can be used to automate the hierarchical synthesis process for MEMS. The paper first introduces the flow of a structured MEMS design process and emphasizes that system-level lumped...... the integrated design automation idea using these evolutionary approaches....

  3. Electrostatic MEMS devices with high reliability

    Science.gov (United States)

    Goldsmith, Charles L; Auciello, Orlando H; Sumant, Anirudha V; Mancini, Derrick C; Gudeman, Chris; Sampath, Suresh; Carlilse, John A; Carpick, Robert W; Hwang, James

    2015-02-24

    The present invention provides for an electrostatic microelectromechanical (MEMS) device comprising a dielectric layer separating a first conductor and a second conductor. The first conductor is moveable towards the second conductor, when a voltage is applied to the MEMS device. The dielectric layer recovers from dielectric charging failure almost immediately upon removal of the voltage from the MEMS device.

  4. A six degrees of freedom mems manipulator

    NARCIS (Netherlands)

    de Jong, B.R.

    2006-01-01

    This thesis reports about a six degrees of freedom (DOF) precision manipulator in MEMS, concerning concept generation for the manipulator followed by design and fabrication (of parts) of the proposed manipulation concept in MEMS. Researching the abilities of 6 DOF precision manipulation in MEMS is

  5. Hewlett Packard's inkjet MEMS technology: past, present, and future

    Science.gov (United States)

    Stasiak, J.; Richards, S.; Angelos, S.

    2009-05-01

    In 1985, HP introduced the ThinkJet - the first low-cost, mass-produced thermal inkjet printer. Providing a reasonable alternative to noisy dot matrix printers, ThinkJet set the stage for subsequent generations of HP thermal inkjet technology (TIJ). With each new generation, HP TIJ products provided new standards for print quality, color, and an unprecedented cost/performance ratio. Regarded as the first and most successful commercial MEMS technology, the development of HP's TIJ printheads required multidisciplinary innovation in fluid dynamics, bulk and surface micromachining, large-scale integration of electronics, packaging, and high volume MEMS manufacturing. HP's current TIJ printhead products combine Pentium-class addressing circuitry, high voltage mixed-signal driver electronics, dense electrical interconnects, and up to 3900 high-precision microfluidic devices - all on a single silicon chip. In this paper, we will provide a brief history of HP's TIJ technology and discuss how the unique capabilities that were required to advance the state-of-the-art of TIJ printheads are now providing a platform for the development of new MEMS devices and systems.

  6. Polyimide and Metals MEMS Multi-User Processes

    KAUST Repository

    Arevalo, Arpys

    2016-11-01

    The development of a polyimide and metals multi-user surface micro-machining process for Micro-electro-mechanical Systems (MEMS) is presented. The process was designed to be as general as possible, and designed to be capable to fabricate different designs on a single silicon wafer. The process was not optimized with the purpose of fabricating any one specific device but can be tweaked to satisfy individual needs depending on the application. The fabrication process uses Polyimide as the structural material and three separated metallization layers that can be interconnected depending on the desired application. The technology allows the development of out-of-plane compliant mechanisms, which can be combined with six variations of different physical principles for actuation and sensing on a single processed silicon wafer. These variations are: electrostatic motion, thermal bimorph actuation, capacitive sensing, magnetic sensing, thermocouple-based sensing and radio frequency transmission and reception.

  7. MEMS linear and nonlinear statics and dynamics

    CERN Document Server

    Younis, Mohammad I

    2011-01-01

    MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of nume

  8. Of light, of MEMS: Optical MEMS in telecommunications and beyond

    Indian Academy of Sciences (India)

    Abstract. The burst of the Internet bubble in 2000 has severely quenched the pace of development in the optical MEMS field. However, it is now clear that this field is again set to move forward as not only telecommunication but many other industries are benefiting from its application. We describe in this paper some of.

  9. Design and Simulation of a Novel 3-DOF MEMS Convective Gyroscope

    Science.gov (United States)

    Dau, Van Thanh; Dinh, Thien Xuan; Dao, Dzung Viet; Sugiyama, Susumu

    This paper reports on the design and simulation of a novel MEMS based convective gyroscope which can independently detect three components of angular rate. The sensor was designed with standard bulk MEMS technology. The 3D jet flow was simulated in the confined space formed by MEMS compatible laminated-structures. The configuration of the sensor consists of a PZT diaphragm, caps, in-plane tungsten hotwires located on the surface of a 0.4mm-thick circular silicon frame with diameter of 10mm. The simulated scale factors of the sensor are SFz = 0.83 μV/o/s, SFx = SFy = 3.10 μV/o/s. In measurement application, the 3DOF gyro eliminates the sensor-to-sensor misalignment, and therefore provides accurate measurement with small cross-sensitivity. The sensor also has high shock resistance since no proof mass is used.

  10. Design and Fabrication of a Reconfigurable MEMS-Based Antenna

    KAUST Repository

    Martinez, Miguel Angel Galicia

    2011-06-22

    to the high gain obtained in a lossy silicon substrate and the compatibility of the custom MEMS process with the state of the art standard CMOS process, it is believed that the design of this antenna can lead to efficient and low cost reconfigurable millimeter-wave System-on-Chip (SoC) solution.

  11. Design and Fabrication of a Slanted-Beam MEMS Accelerometer

    Directory of Open Access Journals (Sweden)

    Wei Xu

    2017-03-01

    Full Text Available This paper presents a novel capacitive microelectromechanical systems (MEMS accelerometer with slanted supporting beams and all-silicon sandwich structure. Its sensing mechanism is quite similar to an ordinary sandwich-type MEMS accelerometer, except that its proof mass is suspended by a beam parallel to the {111} plane of a (100 silicon wafer. In this way, each sensing element can detect accelerations in two orthogonal directions. Four of these sensing elements could work together and constitute a 3-axis micro-accelerometer by using a simple planar assembly process. This design avoids the traditional 3-axis accelerometer’ disadvantage of possible placement inaccuracy when assembling on three different planes and largely reduces the package volume. The slanted-beam accelerometer’s performance was modeled and analyzed by using both analytical calculations and finite element method (FEM simulations. A prototype of one sensing element was fabricated and tested. Measured results show that this accelerometer has a good bias stability 76.8 ppm (1σ, tested immediately after power on, two directional sensitivities (sensitivity angle α = 45.4° and low nonlinearity (<0.5% over a sensing range up to ±50 g, which demonstrates a great opportunity for future high-precision three-axis inertial measurement.

  12. Piezoresistive and piezoelectric MEMS strain sensors for vibration detection

    Science.gov (United States)

    Kon, Stanley; Oldham, Kenn; Horowitz, Roberto

    2007-04-01

    Both piezoresistive and piezoelectric materials are commonly used to detect strain caused by structural vibrations in macro-scale structures. With the increasing complexity and miniaturization of modern mechanical systems such as hard disk drive suspensions, it is imperative to explore the performance of these strain sensors when their dimensions must shrink along with those of the host structures. The miniaturized strain sensors must remain as small as possible so as to minimum their effect on structure dynamics, yet still have acceptable sensing resolution. The performances of two types of novel micro-scale strain gage for installation on stainless steel parts are compared in this paper. Micro-fabrication processes have been developed to build polycrystalline silicon piezoresistive strain sensors on a silicon substrate, which are later bonded to a steel substrate for testing. Piezoresistor geometries are optimized to effectively increase the gage factor of piezoresistive sensors while reducing sensor size. The advantage and disadvantage of these piezoresistors are compared to those of piezoelectric sensors. Experimental results reveal that the MEMS piezoelectric sensors are able to achieve a better resolution than piezoresistors, while piezoresistors can be built in much smaller areas. Both types of the MEMS strain sensors are capable of high sensitivity measurements, subject to differing constraints.

  13. Modeling of rf MEMS switches

    Science.gov (United States)

    Robertson, Barbara; Ho, Fat D.; Hudson, Tracy D.

    2001-10-01

    The microelectromechanical system (MEMS) switch offers many benefits in radio frequency (RF) applications. These benefits include low insertion loss, high quality factor (Q), low power, RF isolation, and low cost. The ability to manufacture mechanical switches on a chip with electronics can lead to higher functionality, such as single-chip arrays, and smart switches. The MEMS switch is also used as a building block in devices such as phase shifters, filters, and switchable antenna elements. The MEMS designer needs models of these basic elements in order to incorporate them into their applications. The objective of this effort is to develop lumped element models for MEMS RF switches, which are incorporated into a CAD software. Tanner Research Inc.'s Electronic Design Automation (EDA) software is being used to develop a suite of mixed-signal RF switch models. The suite will include switches made from cantilever beams and fixed-fixed beams. The switches may be actuated by electrostatic, piezoelectric or electromagnetic forces. The effort presented in this paper concentrates on switches actuated by electrostatic forces. The lumped element models use a current-force electrical-mechanical analogy. Finite element modeling and device testing will be used to verify the Tanner models. The effects of materials, geometries, temperature, fringing fields, and mounting geometries are considered.

  14. MEMS AO for Planet Finding

    Science.gov (United States)

    Rao, Shanti; Wallace, J. Kent; Shao, Mike; Schmidtlin, Edouard; Levine, B. Martin; Samuele, Rocco; Lane, Benjamin; Chakrabarti, Supriya; Cook, Timothy; Hicks, Brian; hide

    2008-01-01

    This slide presentation reviews a method for planet finding using microelectromechanical systems (MEMS) Adaptive Optics (AO). The use of a deformable mirror (DM) is described as a part of the instrument that was designed with a nulling interferometer. The strategy that is used is described in detail.

  15. Silicone metalization

    Energy Technology Data Exchange (ETDEWEB)

    Maghribi, Mariam N. (Livermore, CA); Krulevitch, Peter (Pleasanton, CA); Hamilton, Julie (Tracy, CA)

    2008-12-09

    A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal features on the silicone body that provide an electronic device.

  16. Nonlinear Dynamics of Electrostatically Actuated MEMS Arches

    KAUST Repository

    Al Hennawi, Qais M.

    2015-05-01

    In this thesis, we present theoretical and experimental investigation into the nonlinear statics and dynamics of clamped-clamped in-plane MEMS arches when excited by an electrostatic force. Theoretically, we first solve the equation of motion using a multi- mode Galarkin Reduced Order Model (ROM). We investigate the static response of the arch experimentally where we show several jumps due to the snap-through instability. Experimentally, a case study of in-plane silicon micromachined arch is studied and its mechanical behavior is measured using optical techniques. We develop an algorithm to extract various parameters that are needed to model the arch, such as the induced axial force, the modulus of elasticity, and the initially induced initial rise. After that, we excite the arch by a DC electrostatic force superimposed to an AC harmonic load. A softening spring behavior is observed when the excitation is close to the first resonance frequency due to the quadratic nonlinearity coming from the arch geometry and the electrostatic force. Also, a hardening spring behavior is observed when the excitation is close to the third (second symmetric) resonance frequency due to the cubic nonlinearity coming from mid-plane stretching. Then, we excite the arch by an electric load of two AC frequency components, where we report a combination resonance of the summed type. Agreement is reported among the theoretical and experimental work.

  17. MEMS tandem ion-sorption micropump

    Science.gov (United States)

    Grzebyk, T.

    2017-12-01

    This paper presents a two-stage MEMS ion-sorption micropump, which works in a wide range of pressures—it allows efficient evacuation of gases from the internal volume of any microsystem starting from atmospheric pressure down to 10‑6 hPa. The miniature pre-vacuum pump is realized as a two-electrode silicon–glass structure with a very close inter-electrode distance. The use of the silicon substrate as a getter material instead of a metallic layer significantly increases the pumping capacity and as a result, the initial pressure can be reduced to a level of 1 hPa. From this point the pumping is continued with the second glow-discharge high vacuum micropump. This pump is a multilayer structure, in which ions are trapped in crossed electric and magnetic fields. It allows further reduction of pressure down to 10‑6 hPa. Both pumps are technologically compatible and together they enable the on-chip generation of avacuum at the desired level in a variety of miniaturized devices.

  18. Biocompatible Optically Transparent MEMS for Micromechanical Stimulation and Multimodal Imaging of Living Cells.

    Science.gov (United States)

    Fior, Raffaella; Kwok, Jeanie; Malfatti, Francesca; Sbaizero, Orfeo; Lal, Ratnesh

    2015-08-01

    Cells and tissues in our body are continuously subjected to mechanical stress. Mechanical stimuli, such as tensile and contractile forces, and shear stress, elicit cellular responses, including gene and protein alterations that determine key behaviors, including proliferation, differentiation, migration, and adhesion. Several tools and techniques have been developed to study these mechanobiological phenomena, including micro-electro-mechanical systems (MEMS). MEMS provide a platform for nano-to-microscale mechanical stimulation of biological samples and quantitative analysis of their biomechanical responses. However, current devices are limited in their capability to perform single cell micromechanical stimulations as well as correlating their structural phenotype by imaging techniques simultaneously. In this study, a biocompatible and optically transparent MEMS for single cell mechanobiological studies is reported. A silicon nitride microfabricated device is designed to perform uniaxial tensile deformation of single cells and tissue. Optical transparency and open architecture of the device allows coupling of the MEMS to structural and biophysical assays, including optical microscopy techniques and atomic force microscopy (AFM). We demonstrate the design, fabrication, testing, biocompatibility and multimodal imaging with optical and AFM techniques, providing a proof-of-concept for a multimodal MEMS. The integrated multimodal system would allow simultaneous controlled mechanical stimulation of single cells and correlate cellular response.

  19. Powering a leadless pacemaker using a PiezoMEMS energy harvester

    Science.gov (United States)

    Jackson, Nathan; Olszewski, Oskar; O'Murchu, Cian; Mathewson, Alan

    2017-06-01

    MEMS based vibrational energy harvesting devices have been a highly researched topic over the past decade. The application targeted in this paper focuses on a leadless pacemaker that will be implanted in the right ventricle of the heart. A leadless pacemaker requires the same functionality as a normal pacemaker, but with significantly reduced volume. The reduced volume limits the space for a battery; therefore an energy harvesting device is required. This paper compares varying the dimensions of a linear MEMS based piezoelectric energy harvester that can harvest energy from the mechanical vibrations of the heart due to shock induced vibration. Typical MEMS linear energy harvesting devices operate at high frequency (<50 Hz) with low acceleration (< 1g). The force generated from the heart acts as a series of impulses as opposed to traditional sinusoidal vibration force with high acceleration (1-4 g). Therefore the design of a MEMS harvester that is based on shock-induced vibration is necessary. PiezoMEMS energy harvesting devices consisting of a silicon substrate and mass with aluminium nitride piezoelectric material were developed and characterized using acceleration forces that mimic the heartbeat. Peak powers of up to 25μW were obtained at 1 g acceleration with a powder density of approximately 1.5 mW cm-3.

  20. Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies

    Science.gov (United States)

    2014-03-27

    effect of silicon crystal orientation on etch variance and anisotropy was also investigated. HNA polishing was demonstrated as an effective method of...16 9. A MEMS electrostatic comb drive actuator with associated gear train is dwarfed by a spider mite ...16. Left: The physical behavior of a liquid-spin coated photoresist at a sharp edge , as surface tension and gravity work to pull the photoresist

  1. Topology optimization for reduction of thermo-elastic dissipation in MEMS resonators

    DEFF Research Database (Denmark)

    Gerrard, Dustin D.; Chen, Yunhan; Chandorkar, Saurabh A.

    2017-01-01

    This paper presents a topology optimization approach for reducing thermo-elastic dissipation (TED) in MEMS resonators. This algorithm is applied to a clamped-clamped resonant beam to maximize the quality factor (Q). Optimal designs have a Q ten times higher than a solid beam and are 75% higher than...... previously optimized devices. Furthermore, new designs have intuitive topologies. Beams are fabricated in silicon wafers and experimental measurements of Q agree well with simulation....

  2. Computer-Aided Design (CAD) for Integrated Microelectromechanical (MEMS) Devices

    National Research Council Canada - National Science Library

    Judy, Michael

    2002-01-01

    The objective of this "CAD for Integrated MEMS Devices" research project was to develop MEMS CAD design and development tools that would facilitate the creation of behavioral models for complex MEMS devices...

  3. Integrated microphotonic-MEMS inertial sensors

    Science.gov (United States)

    Zandi, Kazem

    The objective of this thesis is to design, simulate, fabricate and characterize high sensitive low cost in-plane photonic-band-gap (PBG)-micro electromechanical systems (MEMS)-based miniature accelerometers and rotational rate sensors (gyroscopes) on a silicon-on-insulator (SOI) substrate in order to enable the integration of an array of two-axis of these sensors on a single SOI platform. Use of guided-wave optical devices integrated with MEMS on SOI for multichannel/multifunction sensor systems allows the use of multiple sensors to extend the measurement range and accuracy. This provides essential redundancy which makes long-term reliability in the space environment possible therefore reducing the possibility of system failure. The navigator microchip also represents the ability of accommodating diverse attitude and inertial sensors on the same microchip to eliminate the need of many separate sensors. The end product exhibits orders of magnitude reduction in system mass and size. Furthermore, redundancy improves the net performance and precision of the navigation measurement systems. Two classes of optical accelerometers/gyroscopes are considered in this thesis for application in smallsats navigation, one based on tunable Fabry-Perot (FP) filter, where the sensor is actuated by the applied acceleration providing a shift in the operating wavelength that varies linearly with the applied acceleration and the other one based on variable optical attenuator (VOA), where the sensor is actuated by the applied acceleration providing a linear change for small displacements around the waveguide propagation axis in the relative signal intensity with the applied acceleration. In the case of FP-based sensors, the FP microcavity consists of two distributed Bragg reflectors (DBR) in which one DBR mirror is attached to the proof mass of the system. As a consequence of acceleration/rotation, the relative displacement of the movable mirror with respect to the fixed mirror changes

  4. Integration of a MEMS Inertial Measuring Unit with a MEMS Magnetometer for 3D Orientation Estimation

    DEFF Research Database (Denmark)

    Cai, Junping; Malureanu, Christian; Andersen, Niels Lervad

    2011-01-01

    This paper presents an algorithm for combining the measurements of a MEMS Inertial Measurement Unit (IMU) and a MEMS magnetometer. The measurements are done using a special designed and customized miniature detecting system for 3D orientation estimation, and position tracking......This paper presents an algorithm for combining the measurements of a MEMS Inertial Measurement Unit (IMU) and a MEMS magnetometer. The measurements are done using a special designed and customized miniature detecting system for 3D orientation estimation, and position tracking...

  5. A study on the cellular structure during stress solicitation induced by BioMEMS.

    Science.gov (United States)

    Fior, Raffaella; Maggiolino, Stefano; Codan, Barbara; Lazzarino, Marco; Sbaizero, Orfeo

    2011-01-01

    The investigation of single cells is a topic in continuous evolution. The complexity of the cellular matrix, the huge variety of cells, the interaction of one cell with the other are all factors that must be taken into consideration in the study of the cellular structure and mechanics. In this project, we developed different types of bioMEMS for cell's stretching, both transparent devices based on silicon nitride and non-transparent silicon based. While the use of silicon devices is limited to reflection microscopes, transparent bioMEMS can be used with transmission and reflection microscopes but can also be easily coupled with other tools such as patch clamp analyzers or atomic force microscope. This improvement will open brand new possibilities in the biological investigation field. We used these two BioMEMS to stretch a single cell in a controlled way and, as a first investigation, we focused on its morphology. We noticed that during a controlled stretch, cells react to the applied deformation. A hysteretic behavior on the ratio between area and perimeter has been highlighted.

  6. Engineering stress in thin films for the field of bistable MEMS

    Science.gov (United States)

    Ratnayake, Dilan; Martin, Michael D.; Gowrishetty, Usha R.; Porter, Daniel A.; Berfield, Thomas A.; McNamara, Shamus P.; Walsh, Kevin M.

    2015-12-01

    While stress-free and tensile films are well-suited for released in-plane MEMS designs, compressive films are needed for released out-of-plane MEMS structures such as buckled beams and diaphragms. This study presents a characterization of stress on a variety of sputtered and plasma-enhanced chemical vapour deposition (PECVD)-deposited films, including titanium tungsten, invar, silicon nitride and amorphous silicon, appropriate for the field of bistable MEMS. Techniques and strategies are presented (including varying substrate bias, pressure, temperature, and frequency multiplexing) for tuning internal stress across the spectrum from highly compressive (-2300 MPa) to highly tensile (1500 MPa). Conditions for obtaining stress-free films are also presented in this work. Under certain conditions during the PECVD deposition of amorphous silicon, interesting ‘micro-bubbles’ formed within the deposited films. Strategies to mitigate their formation are presented, resulting in a dramatic improvement in surface roughness quality from 667 nm root mean square (RMS) to 16 nm RMS. All final deposited films successfully passed the traditional ‘tape test’ for adhesion.

  7. Miniaturized GPS/MEMS IMU integrated board

    Science.gov (United States)

    Lin, Ching-Fang (Inventor)

    2012-01-01

    This invention documents the efforts on the research and development of a miniaturized GPS/MEMS IMU integrated navigation system. A miniaturized GPS/MEMS IMU integrated navigation system is presented; Laser Dynamic Range Imager (LDRI) based alignment algorithm for space applications is discussed. Two navigation cameras are also included to measure the range and range rate which can be integrated into the GPS/MEMS IMU system to enhance the navigation solution.

  8. Cryogenic MEMS Technology for Sensing Applications Project

    Data.gov (United States)

    National Aeronautics and Space Administration — The development of cryogenic microwave components, such as focal plane polarization modulators, first requires an RF MEMS switching technology that operates...

  9. MEMS Bragg grating force sensor

    DEFF Research Database (Denmark)

    Reck, Kasper; Thomsen, Erik Vilain; Hansen, Ole

    2011-01-01

    We present modeling, design, fabrication and characterization of a new type of all-optical frequency modulated MEMS force sensor based on a mechanically amplified double clamped waveguide beam structure with integrated Bragg grating. The sensor is ideally suited for force measurements in harsh...... environments and for remote and distributed sensing and has a measured sensitivity of -14 nm/N, which is several times higher than what is obtained in conventional fiber Bragg grating force sensors. © 2011 Optical Society of America....

  10. Design, fabrication, testing and packaging of a silicon ...

    Indian Academy of Sciences (India)

    Design, fabrication, testing and packaging of a silicon micromachined radio frequency microelectromechanical series (RF MEMS) switch. M S Giridhar Ashwini Jambhalikar Jiju John R Islam Ananda Behera C L Nagendra George Thachil M P Srikanth Shailesh Somani B H M Darukesha Srinivasarao Bollu. Volume 38 Issue ...

  11. Experimental Investigation of 2:1 and 3:1 Internal Resonances in Nonlinear MEMS Arch Resonators

    KAUST Repository

    Ramini, Abdallah

    2016-12-05

    We demonstrate experimentally internal resonances in MEMS resonators. The investigation is conducted on in-plane MEMS arch resonators fabricated with a highly doped silicon. The resonators are actuated electrostatically and their stiffness are tuned by electrothermal loading by passing an electrical current though the microstructures. We show that through this tuning, the ratio of the various resonance frequencies can be varied and set at certain ratios. Particularly, we adjust the resonance frequencies of two different vibrational modes to 2:1 and 3:1. Finally, we validate the internal resonances at these ratios through frequency-response curves and FFTs.

  12. A Small Area In-Situ MEMS Test Structure to Accurately Measure Fracture Strength by Electrostatic Probing

    Energy Technology Data Exchange (ETDEWEB)

    Bitsie, Fernando; Jensen, Brian D.; de Boer, Maarten

    1999-07-15

    We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength or fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3-D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.

  13. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  14. The development of MEMS device packaging technology using proton beam

    International Nuclear Information System (INIS)

    Hyeon, J. W.; Kong, Y. J.; Kim, E. H.; Kim, H. S.; No, S. J.

    2006-05-01

    Wafer-bonding techniques are key issues for the commercialization of MEMS(MicroElectroMechanical Systems) devices. The anodic bonding method and the wafer direct-bonding method are well-known major techniques for wafer bonding. Due to the anodic bonding method includes high voltage processes above 1.5 kV, the MEMS devices can be damaged during the bonding process or malfunctioned while long-term operation. On the other hand, since the wafer direct-bonding method includes a high temperature processes above 1000 .deg. C, temperature-sensitive materials and integrated circuits will be damaged or degraded during the bonding processes. Therefore, high-temperature bonding processes are not applicable for fabricating or packaging devices where temperature-sensitive materials exist. During the past few years, much effort has been undertaken to find a reliable bonding process that can be conducted at a low temperature. Unfortunately, these new bonding processes depend highly on the bonding material, surface treatment and surface flatness. In this research, a new packaging method using proton beam irradiation is proposed. While the energy loss caused in an irradiated material by X-rays or electron beams decreases with the surface distance, the energy loss caused by proton beams has a maximum value at the Bragg peak. Thus, the localized energy produced at the Bragg peak of the proton beams can be used to bond pyrex glass on a silicon wafer, so the MEMS damage is expected to be minimized. The localized heating caused by as well as the penetration depth, or the proton beam has been investigated. The energy absorbed in a stack of pyrex glass/silicon wafers due to proton-beam irradiation was numerically calculated for various proton energies by using the SRIM program. The energy loss was shown to be sufficiently localized at the interface between the pyrex glass and the silicon wafer. Proton beam irradiation was performed in the common environment of room temperature and

  15. Silicon carbide microsystems for harsh environments

    CERN Document Server

    Wijesundara, Muthu B J

    2011-01-01

    Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods

  16. Effects of exogenous phosphorus and silicon on osteoblast differentiation at the interface with bioactive ceramics.

    Science.gov (United States)

    Gupta, Gautam; Kirakodu, Sreenatha; El-Ghannam, Ahmed

    2010-12-01

    In this study, we have investigated the effects of dissolved phosphorus and silicon on osteoblast differentiation in vitro. Neonatal rat calvarial osteoblasts were seeded on silica-calcium phosphate composites (SCPCS), hydroxyapatite (HA-200), and tissue culture polystyrene (TCPS) and incubated over 4 days in media containing 0 {minimal essential medium [MEM] (-)} or 3 mM β-glycerophosphate [MEM (+)]. Inductively coupled plasma analysis showed that P-content in original MEM (+) was 225% higher than that in MEM (-). Moreover, P-content in MEM (+) significantly increased to 3.4-4.4 mM and 3.6-4.7 mM after 2 and 4 days incubation with SCPC, respectively, owing to material dissolution and exogenous phosphate supplementation. In contrast, P-content in MEM (+) showed no change upon incubation with HA or TCPS. The P-content in MEM (-) incubated with SCPC was considerably lower than that in MEM (+). SCPC exhibited controlled Si-release in cell culture media [MEM (-) or MEM (+)], with Si-rich SCPC showing a significantly greater dissolution than Si-poor SCPC. Moreover, SCPC, unlike HA, demonstrated a cell- and solution-mediated dissolution over 4 days. Quantitative real-time PCR showed that in MEM (-), osteocalcin and osteopontin mRNA expression on Si-rich SCPC was significantly greater than that on HA, suggesting that Si plays an important role in enhancing bone-cell differentiation. However, osteoblast phenotypic expression on SCPC was significantly decreased after 4 days incubation in MEM (+), indicating that sustained exposure to elevated P-levels in the media can downregulate osteoblast function. Our results demonstrate that the controlled dissolution of SCPC provides a natural stimulus for bone-cell differentiation in vitro and could obviate the need of exogenous phosphate supplementation. © 2010 Wiley Periodicals, Inc. J Biomed Mater Res Part A, 2010.

  17. Direction Finding Using Multiple MEMS Acoustic Sensors

    Science.gov (United States)

    2015-09-01

    MEMS ACOUSTIC SENSORS by Daniel Wilmott September 2015 Thesis Advisor: Gamani Karunasiri Co-Advisor: Fabio Alves THIS PAGE INTENTIONALLY LEFT......resonance over an angular range of 120° with a maximum uncertainty of 3.4°. 14. SUBJECT TERMS MEMS , direction finding, Ormia ochracea, acoustic sensor

  18. Listening to MEMS : An acoustic vibrometer

    NARCIS (Netherlands)

    Yntema, Doekle Reinder; Haneveld, J.; Engelen, Johannes Bernardus Charles; Brookhuis, Robert Anton; Sanders, Remco G.P.; Wiegerink, Remco J.; Elwenspoek, Michael Curt

    2010-01-01

    new way to characterize vibrating MEMS devices is presented. Using an acoustic particle velocity sensor the coupled sound field is measured, which is a measure for the movement of the MEMS device. We present several possible applications of this measurement method. It can be used as a read-out

  19. A Teaching - Learning Framework for MEMS Education

    International Nuclear Information System (INIS)

    Sheeparamatti, B G; Angadi, S A; Sheeparamatti, R B; Kadadevaramath, J S

    2006-01-01

    Micro-Electro-Mechanical Systems (MEMS) technology has been identified as one of the most promising technologies in the 21st century. MEMS technology has opened up a wide array of unforeseen applications. Hence it is necessary to train the technocrats of tomorrow in this emerging field to meet the industrial/societal demands. The drive behind fostering of MEMS technology is the reduction in the cost, size, weight, and power consumption of the sensors, actuators, and associated electronics. MEMS is a multidisciplinary engineering and basic science area which includes electrical engineering, mechanical engineering, material science and biomedical engineering. Hence MEMS education needs a special approach to prepare the technocrats for a career in MEMS. The modern education methodology using computer based training systems (CBTS) with embedded modeling and simulation tools will help in this direction. The availability of computer based learning resources such as MATLAB, ANSYS/Multiphysics and rapid prototyping tools have contributed to proposition of an efficient teaching-learning framework for MEMS education presented in this paper. This paper proposes a conceptual framework for teaching/learning MEMS in the current technical education scenario

  20. Validation of thermal models for a prototypical MEMS thermal actuator.

    Energy Technology Data Exchange (ETDEWEB)

    Gallis, Michail A.; Torczynski, John Robert; Piekos, Edward Stanley; Serrano, Justin Raymond; Gorby, Allen D.; Phinney, Leslie Mary

    2008-09-01

    This report documents technical work performed to complete the ASC Level 2 Milestone 2841: validation of thermal models for a prototypical MEMS thermal actuator. This effort requires completion of the following task: the comparison between calculated and measured temperature profiles of a heated stationary microbeam in air. Such heated microbeams are prototypical structures in virtually all electrically driven microscale thermal actuators. This task is divided into four major subtasks. (1) Perform validation experiments on prototypical heated stationary microbeams in which material properties such as thermal conductivity and electrical resistivity are measured if not known and temperature profiles along the beams are measured as a function of electrical power and gas pressure. (2) Develop a noncontinuum gas-phase heat-transfer model for typical MEMS situations including effects such as temperature discontinuities at gas-solid interfaces across which heat is flowing, and incorporate this model into the ASC FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (3) Develop a noncontinuum solid-phase heat transfer model for typical MEMS situations including an effective thermal conductivity that depends on device geometry and grain size, and incorporate this model into the FEM heat-conduction code Calore to enable it to simulate these effects with good accuracy. (4) Perform combined gas-solid heat-transfer simulations using Calore with these models for the experimentally investigated devices, and compare simulation and experimental temperature profiles to assess model accuracy. These subtasks have been completed successfully, thereby completing the milestone task. Model and experimental temperature profiles are found to be in reasonable agreement for all cases examined. Modest systematic differences appear to be related to uncertainties in the geometric dimensions of the test structures and in the thermal conductivity of the

  1. Silicon MEMS for Detection of Liquid and Solid Fronts

    NARCIS (Netherlands)

    Wei, J.

    2010-01-01

    High-precision manipulation of small-size objects is an attractive and challenging topic for both industrial production and fundamental scientific research. The capability of monitoring micro-samples during handling is essential to the accuracy and efficiency of a handling system for both liquid and

  2. Silicon Carbide Capacitive High Temperature MEMS Strain Transducer

    Science.gov (United States)

    2012-03-22

    it is a little difficult to measure using traditional methods. One option could be using the 72 Wheatstone bridge method. Although this method is...commonly used for resistive bridges , it can be adapted to inductive or capacitive bridges . The more difficult task that lies ahead is attachment

  3. Piezoelectric MEMS sensors: state-of-the-art and perspectives

    International Nuclear Information System (INIS)

    Tadigadapa, S; Mateti, K

    2009-01-01

    Over the past two decades, several advances have been made in micromachined sensors and actuators. As the field of microelectromechanical systems (MEMS) has advanced, a clear need for the integration of materials other than silicon and its compounds into micromachined transducers has emerged. Piezoelectric materials are high energy density materials that scale very favorably upon miniaturization and that has led to an ever-growing interest in piezoelectric films for MEMS applications. At this time, piezoelectric aluminum-nitride-based film bulk acoustic resonators (FBAR) have already been successfully commercialized. Future innovations and improvements in inertial sensors for navigation, high-frequency crystal oscillators and filters for wireless applications, microactuators for RF applications, chip-scale chemical analysis systems and countless other applications hinge upon the successful miniaturization of components and integration of piezoelectrics and metals into these systems. In this article, a comprehensive review of micromachined piezoelectric transducer technology will be presented. Piezoelectric materials in bulk and thin film forms will be reviewed and fabrication techniques for the integration of these materials for microsensor applications will be presented. Recent advances in various piezoelectric microsensors will be presented through specific examples. This review will conclude with a critical assessment of the future trends and promise of this technology. (topical review)

  4. Optical fiber accelerometer based on MEMS torsional micromirror

    Science.gov (United States)

    Zeng, Fanlin; Zhong, Shaolong; Xu, Jing; Wu, Yaming

    2008-03-01

    A novel structure of optical fiber accelerometer based on MEMS torsional micro-mirror is introduced, including MEMS torsional micro-mirror and optical signal detection. The micro-mirror is a non-symmetric one, which means that the torsional bar supporting the micro-mirror is not located in the axis where the center of the micro-mirror locates. The optical signal detection is composed of PIN diode and dual fiber collimator, which is very sensitive to the coupling angle between the input fiber and output fiber. The detection principle is that acceleration is first transformed into torsional angle of the micro-mirror, then, optical insertion loss of the dual fiber collimator caused by the angle can be received by PIN. So under the flow of acceleration to torsional angle to optical signal attenuation to optical power detection, the acceleration is detected. The theory about sensing and optical signal detect of the device are discussed in this paper. The sensitive structure parameters and performance parameters are calculated by MATLAB. To simulate the static and modal analysis, the finite element analysis, ANSYS, is employed. Based on the above calculation, several optimization methods and the final structure parameters are given. The micro-mirror is completed by using silicon-glass bonding and deep reactive ion etching (DRIE). In the experiment, the acceleration is simulated by electrostatic force and the test results show that the static acceleration detection agrees with the theory analysis very well.

  5. MEMS Deformable Mirrors for Adaptive Optics in Astronomical Imaging

    Science.gov (United States)

    Cornelissen, S.; Bierden, P. A.; Bifano, T.

    We report on the development of micro-electromechanical (MEMS) deformable mirrors designed for ground and space-based astronomical instruments intended for imaging extra-solar planets. Three different deformable mirror designs, a 1024 element continuous membrane (32x32), a 4096 element continuous membrane (64x64), and a 331 hexagonal segmented tip-tilt-piston are being produced for the Planet Imaging Concept Testbed Using a Rocket Experiment (PICTURE) program, the Gemini Planet Imaging Instrument, and the visible nulling coronograph developed at JPL for NASA's TPF mission, respectively. The design of these polysilicon, surface-micromachined MEMS deformable mirrors builds on technology that was pioneered at Boston University and has been used extensively to correct for ocular aberrations in retinal imaging systems and for compensation of atmospheric turbulence in free-space laser communication. These light-weight, low power deformable mirrors will have an active aperture of up to 25.2mm consisting of thin silicon membrane mirror supported by an array of 1024 to 4096 electrostatic actuators exhibiting no hysteresis and sub-nanometer repeatability. The continuous membrane deformable mirrors, coated with a highly reflective metal film, will be capable of up to 4μm of stroke, have a surface finish of travel. New design features and fabrication processes are combined with a proven device architecture to achieve the desired performance and high reliability. Presented in this paper are device characteristic and performance results of these devices.

  6. Optical MEMS for Earth observation

    Science.gov (United States)

    Liotard, Arnaud; Viard, Thierry; Noell, Wilfried; Zamkotsian, Frédéric; Freire, Marco; Guldimann, Benedikt; Kraft, Stefan

    2017-11-01

    Due to the relatively large number of optical Earth Observation missions at ESA, this area is interesting for new space technology developments. In addition to their compactness, scalability and specific task customization, optical MEMS could generate new functions not available with current technologies and are thus candidates for the design of future space instruments. Most mature components for space applications are the digital mirror arrays, the micro-deformable mirrors, the programmable micro diffraction gratings and tiltable micromirrors. A first selection of market-pull and techno-push concepts is done. In addition, some concepts are coming from outside Earth Observation. Finally two concepts are more deeply analyzed. The first concept is a programmable slit for straylight control for space spectro-imagers. This instrument is a push-broom spectroimager for which some images cannot be exploited because of bright sources in the field-of-view. The proposed concept consists in replacing the current entrance spectrometer slit by an active row of micro-mirrors. The MEMS will permit to dynamically remove the bright sources and then to obtain a field-of-view with an optically enhanced signal-to-noise ratio. The second concept is a push-broom imager for which the acquired spectrum can be tuned by optical MEMS. This system is composed of two diffractive elements and a digital mirror array. The first diffractive element spreads the spectrum. A micromirror array is set at the location of the spectral focal plane. By putting the micro-mirrors ON or OFF, we can select parts of field-of-view or spectrum. The second diffractive element then recombines the light on a push-broom detector. Dichroics filters, strip filter, band-pass filter could be replaced by a unique instrument.

  7. Adaptive Subband Filtering Method for MEMS Accelerometer Noise Reduction

    Directory of Open Access Journals (Sweden)

    Piotr PIETRZAK

    2008-12-01

    Full Text Available Silicon microaccelerometers can be considered as an alternative to high-priced piezoelectric sensors. Unfortunately, relatively high noise floor of commercially available MEMS (Micro-Electro-Mechanical Systems sensors limits the possibility of their usage in condition monitoring systems of rotating machines. The solution of this problem is the method of signal filtering described in the paper. It is based on adaptive subband filtering employing Adaptive Line Enhancer. For filter weights adaptation, two novel algorithms have been developed. They are based on the NLMS algorithm. Both of them significantly simplify its software and hardware implementation and accelerate the adaptation process. The paper also presents the software (Matlab and hardware (FPGA implementation of the proposed noise filter. In addition, the results of the performed tests are reported. They confirm high efficiency of the solution.

  8. MEMS Tunable Diffraction Grating for Spaceborne Imaging Spectroscopic Applications

    Directory of Open Access Journals (Sweden)

    Sanathanan S. Muttikulangara

    2017-10-01

    Full Text Available Diffraction gratings are among the most commonly used optical elements in applications ranging from spectroscopy and metrology to lasers. Numerous methods have been adopted for the fabrication of gratings, including microelectromechanical system (MEMS fabrication which is by now mature and presents opportunities for tunable gratings through inclusion of an actuation mechanism. We have designed, modeled, fabricated and tested a silicon based pitch tunable diffraction grating (PTG with relatively large resolving power that could be deployed in a spaceborne imaging spectrometer, for example in a picosatellite. We have carried out a detailed analytical modeling of PTG, based on a mass spring system. The device has an effective fill factor of 52% and resolving power of 84. Tuning provided by electrostatic actuation results in a displacement of 2.7 μ m at 40 V . Further, we have carried out vibration testing of the fabricated structure to evaluate its feasibility for spaceborne instruments.

  9. In-Plane MEMS Shallow Arch Beam for Mechanical Memory

    KAUST Repository

    Hafiz, Md Abdullah Al

    2016-10-18

    We demonstrate a memory device based on the nonlinear dynamics of an in-plane microelectromechanical systems (MEMS) clamped–clamped beam resonator, which is deliberately fabricated as a shallow arch. The arch beam is made of silicon, and is electrostatically actuated. The concept relies on the inherent quadratic nonlinearity originating from the arch curvature, which results in a softening behavior that creates hysteresis and co-existing states of motion. Since it is independent of the electrostatic force, this nonlinearity gives more flexibility in the operating conditions and allows for lower actuation voltages. Experimental results are generated through electrical characterization setup. Results are shown demonstrating the switching between the two vibrational states with the change of the direct current (DC) bias voltage, thereby proving the memory concept.

  10. In-Plane MEMS Shallow Arch Beam for Mechanical Memory

    Directory of Open Access Journals (Sweden)

    Md Abdullah Al Hafiz

    2016-10-01

    Full Text Available We demonstrate a memory device based on the nonlinear dynamics of an in-plane microelectromechanical systems (MEMS clamped–clamped beam resonator, which is deliberately fabricated as a shallow arch. The arch beam is made of silicon, and is electrostatically actuated. The concept relies on the inherent quadratic nonlinearity originating from the arch curvature, which results in a softening behavior that creates hysteresis and co-existing states of motion. Since it is independent of the electrostatic force, this nonlinearity gives more flexibility in the operating conditions and allows for lower actuation voltages. Experimental results are generated through electrical characterization setup. Results are shown demonstrating the switching between the two vibrational states with the change of the direct current (DC bias voltage, thereby proving the memory concept.

  11. Initially Imperfect MEMS Microplates Under Electrostatic Actuation: Theory and Experiment

    KAUST Repository

    Saghir, Shahid

    2016-12-05

    Microplates are building blocks of many Micro-Electro-Mechanical Systems (MEMS). It is common for them to undergo imperfections due to residual stresses caused by the micro fabrication process. Such plates are essentially different from perfectly flat plates and cannot be modeled using the governing equations of flat plates. In this article, we adopt the governing equations of imperfect plates employing the modified von-Karman strains. These equations then are used to develop a Reduced Order Model based on the Galerkin procedure to simulate the static and dynamic behavior of an electrostatically actuated microplate. Also, microplates made of silicon nitride are fabricated and tested. First, the static behaviour of the microplate is investigated when applying a static voltage Vdc. To study the dynamic behaviour we apply a harmonic voltage, Vac, superimposed to Vdc. Simulation results show good agreement with the experimentally measured responses.

  12. Development of MEMS photoacoustic spectroscopy

    Energy Technology Data Exchange (ETDEWEB)

    Robinson, Alex Lockwood; Eichenfield, Matthew S.; Griffin, Benjamin; Harvey, Heidi Alyssa; Nielson, Gregory N.; Okandan, Murat; Langlois, Eric; Resnick, Paul James; Shaw, Michael J.; Young, Ian; Givler, Richard C.; Reinke, Charles M.

    2014-01-01

    After years in the field, many materials suffer degradation, off-gassing, and chemical changes causing build-up of measurable chemical atmospheres. Stand-alone embedded chemical sensors are typically limited in specificity, require electrical lines, and/or calibration drift makes data reliability questionable. Along with size, these "Achilles' heels" have prevented incorporation of gas sensing into sealed, hazardous locations which would highly benefit from in-situ analysis. We report on development of an all-optical, mid-IR, fiber-optic based MEMS Photoacoustic Spectroscopy solution to address these limitations. Concurrent modeling and computational simulation are used to guide hardware design and implementation.

  13. Nonhermetic Encapsulation Materials for MEMS-Based Movable Microelectrodes for Long-Term Implantation in the Brain

    Science.gov (United States)

    Jackson, Nathan; Anand, Sindhu; Okandan, Murat; Muthuswamy, Jit

    2010-01-01

    In this paper, we have fabricated and tested several composite materials with a mesh matrix, which are used as encapsulation materials for a novel implantable movable-microelectrode microelectromechanical-system (MEMS) device. Since movable microelectrodes extend off the edge of the MEMS chip and penetrate the brain, a hermetically sealed encapsulation was not feasible. An encapsulation material is needed to prevent cerebral-spinal-fluid entry that could cause failure of the MEMS device and, at the same time, allow for penetration by the microelectrodes. Testing of potential encapsulation materials included penetration-force measurements, gross-leak testing, maximum-pressure testing, and biocompatibility testing. Penetration-force tests showed that untreated mesh matrices and silicone-gel-mesh composites required the least amount of force to penetrate for both nylon 6,6 and polypropylene meshes. The silicone-gel-, poly(dimethylsiloxane)-, polyimide-, and fluoroacrylate-mesh composites with the nylon-mesh matrix were all able to withstand pressures above the normal intracranial pressures. Fourier-transform infrared-spectroscopy analysis and visual inspection of the implanted devices encapsulated by the silicone-gel-mesh composite showed that there was no fluid or debris entry at two and four weeks postimplantation. We conclude that a composite of nylon and silicone-gel meshes will meet the needs of the new generation of implantable devices that require nonhermetic encapsulation. PMID:20414474

  14. Micro electromechanical systems (MEMS) for mechanical engineers

    Energy Technology Data Exchange (ETDEWEB)

    Lee, A. P., LLNL

    1996-11-18

    The ongoing advances in Microelectromechanical Systems (MEMS) are providing man-kind the freedom to travel to dimensional spaces never before conceivable. Advances include new fabrication processes, new materials, tailored modeling tools, new fabrication machines, systems integration, and more detailed studies of physics and surface chemistry as applied to the micro scale. In the ten years since its inauguration, MEMS technology is penetrating industries of automobile, healthcare, biotechnology, sports/entertainment, measurement systems, data storage, photonics/optics, computer, aerospace, precision instruments/robotics, and environment monitoring. It is projected that by the turn of the century, MEMS will impact every individual in the industrial world, totaling sales up to $14 billion (source: System Planning Corp.). MEMS programs in major universities have spawned up all over the United States, preparing the brain-power and expertise for the next wave of MEMS breakthroughs. It should be pointed out that although MEMS has been initiated by electrical engineering researchers through the involvement of IC fabrication techniques, today it has evolved such that it requires a totally multi-disciplinary team to develop useful devices. Mechanical engineers are especially crucial to the success of MEMS development, since 90% of the physical realm involved is mechanical. Mechanical engineers are needed for the design of MEMS, the analysis of the mechanical system, the design of testing apparatus, the implementation of analytical tools, and the packaging process. Every single aspect of mechanical engineering is being utilized in the MEMS field today, however, the impact could be more substantial if more mechanical engineers are involved in the systems level designing. In this paper, an attempt is made to create the pathways for a mechanical engineer to enter in the MEMS field. Examples of application in optics and medical devices will be used to illustrate how mechanical

  15. Ka-Band, MEMS Switched Line Phase Shifters Implemented in Finite Ground Coplanar Waveguide

    Science.gov (United States)

    Scardelletti, Maximilian C.; Ponchak, George E.; Varaljay, Nicholas C.

    2005-01-01

    Ka-band MEMS switched line phase shifters implemented in finite ground coplanar waveguide are described in this paper. The phase shifters are constructed of single-pole double-throw (SPDT) switches with additional reference and phase offset transmission line lengths. The one- and two-bit phase shifters are fabricated on high resistivity (HR) silicon with a dielectric constant, Epsilon(sub T) = 11.7 and a substrate thickness, t = 500microns. The switching architectures integrated within the phase shifters consist of MEMS switches that are doubly anchored cantilever beam capacitive switches with additional high inductive sections (MEMS LC device). The SPDT switch is composed of a T-junction with a MEMS LC device at each output port. The one-bit phase shifter described in this paper has an insertion loss (IL) and return loss (RL) of 0.9 dB and 30 dB while the two-bit described has an IL and RL of 1.8 dB and 30 dB respectively. The one-bit phase shifter's designed offset phase is 22.5deg and actual measured phase shift is 21.8deg. The two-bit phase shifter's designed offset phase is 22.5deg, 45deg, and 67.5deg and the actual measured phase shifts are 21.4deg, 44.2deg, and 65.8deg, respectively.

  16. A novel multi-level IC-compatible surface microfabrication technology for MEMS with independently controlled lateral and vertical submicron transduction gaps

    Science.gov (United States)

    Cicek, Paul-Vahe; Elsayed, Mohannad; Nabki, Frederic; El-Gamal, Mourad

    2017-11-01

    An above-IC compatible multi-level MEMS surface microfabrication technology based on a silicon carbide structural layer is presented. The fabrication process flow provides optimal electrostatic transduction by allowing the creation of independently controlled submicron vertical and lateral gaps without the need for high resolution lithography. Adopting silicon carbide as the structural material, the technology ensures material, chemical and thermal compatibility with modern semiconductor nodes, reporting the lowest peak processing temperature (i.e. 200 °C) of all comparable works. This makes this process ideally suited for integrating capacitive-based MEMS directly above standard CMOS substrates. Process flow design and optimization are presented in the context of bulk-mode disk resonators, devices that are shown to exhibit improved performance with respect to previous generation flexural beam resonators, and that represent relatively complex MEMS structures. The impact of impending improvements to the fabrication technology is discussed.

  17. Optical-fiber-interconnected MEMS sensors and actuators

    Science.gov (United States)

    Miller, Michael B.; Meller, Scott A.; Wavering, Thomas A.; Greene, Jonathan A.; Murphy, Kent A.

    1998-07-01

    Microelectromechanical systems or MEMS are miniature devices that have several advantages over conventional sensing and actuating technology. MEMS devices benefit form well developed integrated circuit production methods which ensure high volume, high yield processes that create low-cost sensors and actuators. OPtical fiber interconnected MEMS will provide new functionality in MEMS devices such as multiplexed operation for distributed sensing applications. This paper presents approaches in optical fiber to MEMS interfacing and some preliminary results.

  18. Shock reliability analysis and improvement of MEMS electret-based vibration energy harvesters

    International Nuclear Information System (INIS)

    Renaud, M; Goedbloed, M; De Nooijer, C; Van Schaijk, R; Fujita, T

    2015-01-01

    Vibration energy harvesters can serve as a replacement solution to batteries for powering tire pressure monitoring systems (TPMS). Autonomous wireless TPMS powered by microelectromechanical system (MEMS) electret-based vibration energy harvester have been demonstrated. The mechanical reliability of the MEMS harvester still has to be assessed in order to bring the harvester to the requirements of the consumer market. It should survive the mechanical shocks occurring in the tire environment. A testing procedure to quantify the shock resilience of harvesters is described in this article. Our first generation of harvesters has a shock resilience of 400 g, which is far from being sufficient for the targeted application. In order to improve this aspect, the first important aspect is to understand the failure mechanism. Failure is found to occur in the form of fracture of the device’s springs. It results from impacts between the anchors of the springs when the harvester undergoes a shock. The shock resilience of the harvesters can be improved by redirecting these impacts to nonvital parts of the device. With this philosophy in mind, we design three types of shock absorbing structures and test their effect on the shock resilience of our MEMS harvesters. The solution leading to the best results consists of rigid silicon stoppers covered by a layer of Parylene. The shock resilience of the harvesters is brought above 2500 g. Results in the same range are also obtained with flexible silicon bumpers, which are simpler to manufacture. (paper)

  19. Design and optimization of stress centralized MEMS vector hydrophone with high sensitivity at low frequency

    Science.gov (United States)

    Zhang, Guojun; Ding, Junwen; Xu, Wei; Liu, Yuan; Wang, Renxin; Han, Janjun; Bai, Bing; Xue, Chenyang; Liu, Jun; Zhang, Wendong

    2018-05-01

    A micro hydrophone based on piezoresistive effect, "MEMS vector hydrophone" was developed for acoustic detection application. To improve the sensitivity of MEMS vector hydrophone at low frequency, we reported a stress centralized MEMS vector hydrophone (SCVH) mainly used in 20-500 Hz. Stress concentration area was actualized in sensitive unit of hydrophone by silicon micromachining technology. Then piezoresistors were placed in stress concentration area for better mechanical response, thereby obtaining higher sensitivity. Static analysis was done to compare the mechanical response of three different sensitive microstructure: SCVH, conventional micro-silicon four-beam vector hydrophone (CFVH) and Lollipop-shaped vector hydrophone (LVH) respectively. And fluid-structure interaction (FSI) was used to analyze the natural frequency of SCVH for ensuring the measurable bandwidth. Eventually, the calibration experiment in standing wave field was done to test the property of SCVH and verify the accuracy of simulation. The results show that the sensitivity of SCVH has nearly increased by 17.2 dB in contrast to CFVH and 7.6 dB in contrast to LVH during 20-500 Hz.

  20. Shock reliability analysis and improvement of MEMS electret-based vibration energy harvesters

    Science.gov (United States)

    Renaud, M.; Fujita, T.; Goedbloed, M.; de Nooijer, C.; van Schaijk, R.

    2015-10-01

    Vibration energy harvesters can serve as a replacement solution to batteries for powering tire pressure monitoring systems (TPMS). Autonomous wireless TPMS powered by microelectromechanical system (MEMS) electret-based vibration energy harvester have been demonstrated. The mechanical reliability of the MEMS harvester still has to be assessed in order to bring the harvester to the requirements of the consumer market. It should survive the mechanical shocks occurring in the tire environment. A testing procedure to quantify the shock resilience of harvesters is described in this article. Our first generation of harvesters has a shock resilience of 400 g, which is far from being sufficient for the targeted application. In order to improve this aspect, the first important aspect is to understand the failure mechanism. Failure is found to occur in the form of fracture of the device’s springs. It results from impacts between the anchors of the springs when the harvester undergoes a shock. The shock resilience of the harvesters can be improved by redirecting these impacts to nonvital parts of the device. With this philosophy in mind, we design three types of shock absorbing structures and test their effect on the shock resilience of our MEMS harvesters. The solution leading to the best results consists of rigid silicon stoppers covered by a layer of Parylene. The shock resilience of the harvesters is brought above 2500 g. Results in the same range are also obtained with flexible silicon bumpers, which are simpler to manufacture.

  1. Design of Surface Micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2002-12-31

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMs, most have used comb-drive actuation methods and bulk micromachining processes. This research focused on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  2. Design of Surface micromachined Compliant MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Bradley, Joe Anthony [Iowa State Univ., Ames, IA (United States)

    2001-01-01

    The consideration of compliant mechanisms as Microelectromechanical Systems (MEMS) is the focus of this research endeavor. MEMS are micron to millimeter devices that combine electrical, mechanical, and information processing capabilities on the same device. These MEMS need some mechanical motion or parts that move relative to each other. This relative motion, using multiple parts, is not desired because of the assembly requirement and the friction introduced. Compliant devices limits or eliminates friction and the need for multi-component assembly. Compliant devices improve designs by creating single piece mechanisms. The purpose of this research is to validate surface micromachining as a viable fabrication process for compliant MEMS designs. Specifically, this research has sought to fabricate a micro-compliant gripper and a micro-compliant clamp to illustrate the process. While other researchers have created compliant MEMS, most have used comb-drive actuation methods and bulk micromachining processes. This research focuses on fully-compliant devices that use device flexibility for motion and actuation. Validation of these compliant MEMS is achieved by structural optimization of device design and functional performance testing. This research contributes to the ongoing research in MEMS by evaluating the potential of using surface micromachining as a process for fabricating compliant micro-mechanisms.

  3. Optical inspection of hidden MEMS structures

    Science.gov (United States)

    Krauter, Johann; Gronle, Marc; Osten, Wolfgang

    2017-06-01

    Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

  4. Sleep estimates using microelectromechanical systems (MEMS).

    Science.gov (United States)

    te Lindert, Bart H W; Van Someren, Eus J W

    2013-05-01

    Although currently more affordable than polysomnography, actigraphic sleep estimates have disadvantages. Brand-specific differences in data reduction impede pooling of data in large-scale cohorts and may not fully exploit movement information. Sleep estimate reliability might improve by advanced analyses of three-axial, linear accelerometry data sampled at a high rate, which is now feasible using microelectromechanical systems (MEMS). However, it might take some time before these analyses become available. To provide ongoing studies with backward compatibility while already switching from actigraphy to MEMS accelerometry, we designed and validated a method to transform accelerometry data into the traditional actigraphic movement counts, thus allowing for the use of validated algorithms to estimate sleep parameters. Simultaneous actigraphy and MEMS-accelerometry recording. Home, unrestrained. Fifteen healthy adults (23-36 y, 10 males, 5 females). None. Actigraphic movement counts/15-sec and 50-Hz digitized MEMS-accelerometry. Passing-Bablok regression optimized transformation of MEMS-accelerometry signals to movement counts. Kappa statistics calculated agreement between individual epochs scored as wake or sleep. Bland-Altman plots evaluated reliability of common sleep variables both between and within actigraphs and MEMS-accelerometers. Agreement between epochs was almost perfect at the low, medium, and high threshold (kappa = 0.87 ± 0.05, 0.85 ± 0.06, and 0.83 ± 0.07). Sleep parameter agreement was better between two MEMS-accelerometers or a MEMS-accelerometer and an actigraph than between two actigraphs. The algorithm allows for continuity of outcome parameters in ongoing actigraphy studies that consider switching to MEMS-accelerometers. Its implementation makes backward compatibility feasible, while collecting raw data that, in time, could provide better sleep estimates and promote cross-study data pooling.

  5. Adhesion aspects in MEMS/NEMS

    CERN Document Server

    Kim, Seong H; Mittal, Kash L

    2012-01-01

    Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated. These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated. Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface

  6. Pressure reciprocity calibration of a MEMS microphone.

    Science.gov (United States)

    Wagner, Randall P; Fick, Steven E

    2017-09-01

    This article reports the first use of the pressure reciprocity technique to calibrate a micro-electromechanical system (MEMS) microphone. This standardized primary calibration method is conventionally used to calibrate laboratory standard microphones. Results for the pressure reciprocity calibration of a MEMS microphone and two laboratory standard microphones are presented for the frequency range 100-10 000 Hz. Because the amplifier in the MEMS microphone package prevents reciprocal operation, this microphone was used only as a receiver of sound. A description of the procedure is presented along with checks of the measurement results and data regarding the uncertainties of these results.

  7. Practical guide to RF-MEMS

    CERN Document Server

    Iannacci, Jacopo

    2013-01-01

    Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical

  8. Metrology of electromagnetic static actuation of MEMS microbridge using atomic force microscopy.

    Science.gov (United States)

    Moczała, M; Majstrzyk, W; Sierakowski, A; Dobrowolski, R; Grabiec, P; Gotszalk, T

    2016-05-01

    The objective of this paper is to describe application of atomic force microscopy (AFM) for characterization and calibration of static deflection of electromagnetically and/or thermally actuated micro-electromechanical (MEMS) bridge. The investigated MEMS structure is formed by a silicon nitride bridge and a thin film metal path enabling electromagnetic and/or thermal deflection actuation. We present how static microbridge deflection can be measured using contact mode AFM technology with resolution of 0.05nm in the range of up to tens of nm. We also analyze, for very small structure deflections and under defined and controlled load force varied in the range up to ca. 32nN, properties of thermal and electromagnetical microbridge deflection actuation schemes. Copyright © 2016 Elsevier Ltd. All rights reserved.

  9. A Monolithic High-G SOI-MEMS Accelerometer for Measuring Projectile Launch and Flight Accelerations

    Directory of Open Access Journals (Sweden)

    Bradford S. Davis

    2006-01-01

    Full Text Available Analog Devices (ADI has designed and fabricated a monolithic high-g acceleration sensor (ADXSTC3-HG fabricated with the ADI silicon-on-insulator micro-electro-mechanical system (SOI-MEMS process. The SOI-MEMS sensor structure has a thickness of 10 um, allowing for the design of inertial sensors with excellent cross-axis rejection. The high-g accelerometer discussed in this paper was designed to measure in-plane acceleration to 10,000 g while subjected to 100,000 g in the orthogonal axes. These requirements were intended to meet Army munition applications. The monolithic sensor was packaged in an 8-pin leadless chip carrier (LCC-8 and was successfully demonstrated by the US Army Research Laboratory (ARL as part of an inertial measurement unit during an instrumented flight experiment of artillery projectiles launched at 15,000 g.

  10. Concept for a Novel Multi-Object Spectrograph using MEMS Technology

    Science.gov (United States)

    MacKenty, J. W.

    1997-12-01

    We present a conceptual design for a multi-object spectrograph using an an array of small scale mirrors implemented on a silicon chip. The placement of switchable mirrors in the focal plane permits the custom definition of slits with arbitrarily small separations. Unlike punch plate spectrographs, the use of microelectronic devices permits very rapid configuration of the slits and avoids the use of consumable materials. The enabling Micro-Electronics Mechanical Systems (MEMS) technology promises a broader availability of optical/mechanical devices with electronic interfaces. One example of such a MEMS device is the Texas Instruments Digital Micromirror Device (DMD) a 600 x 800 array of 16 micron square mirrors used in projection television displays. We have experimented with the DMD and discuss its potential application to astronomical spectrographs.

  11. The technology of planarizing sacrificial layer on wide cavity for MEMS devices

    Science.gov (United States)

    Du, Bo; Chen, Jun; Ma, Jinyi; Xu, Yang; Tian, Benlang; Shi, Yu

    2017-12-01

    In order to prepare a polysilicon sacrificial layer on a wide cavity for a mirco-electromechanical system structure, this paper studied four kinds of CMP methods for polysilicon planarization. The dishing amount, polishing uniformity, surface roughness and wafer bow height were compared and discussed. A new CMP process has been developed for application to MEMS structures. Polysilicon on the backside of the wafer and outside of cavities was etched out. Then, the wafer was gross and fine polished with silicon slurry. Experimental results showed that the dishing amount was about 20 nm and showed good polishing uniformity, which meant local and global planarization. Meanwhile, its surface roughness was less than 1 nm, and the wafer bow height had no significant change pre- and post-CMP. This result suggests that the polysilicon CMP process developed in this work is effective and suits for application in MEMS fabrication.

  12. SOI-based nanoelectrospray emitter tips for mass spectrometry: a coupled MEMS and microfluidic design

    Science.gov (United States)

    Legrand, Bernard; Ashcroft, Alison E.; Buchaillot, Lionel; Arscott, Steve

    2007-03-01

    We present here micromachined nanoelectrospray emitter tips based on a microfluidic capillary slot fabricated using silicon-on-insulator (SOI) technology. We couple microelectromechanical systems (MEMS) and microfluidic design rules to ensure the rigidity of the structures by taking into account the effect of capillary forces generated by the introduction of liquids into MEMS. The SOI-based microtechnology fabrication process uses four simple steps: photolithography, dry etching, wet etching and dicing. This optimized fabrication process enables cost-effective batch production of chip-based micromachined nanoelectrospray emitter tips. The characteristics of these nanoelectrospray emitter tips were investigated using mass spectrometry. We have detected the protein lysozyme at a concentration as low as 100 fmol µL-1 our results indicate that micromachined electrospray emitter tips are useful in biomolecular analysis.

  13. Development of the Electromagnetic Induction Type Micro Air Turbine Generator Using MEMS and Multilayer Ceramic Technology

    International Nuclear Information System (INIS)

    Iiduka, A; Ishigaki, K; Takikawa, Y; Ohse, T; Saito, K; Uchikoba, F

    2011-01-01

    The miniaturized electromagnetic induction type air turbine generator is described. The micro air turbine generator rotated by the compressed air and generating electricity was fabricated by the combination of MEMS and multilayer ceramic technology. The micro generator consisted of an air turbine and a magnetic circuit. The turbine part consisted of 7 silicon layers fabricated by the MEMS technology. The magnetic circuit was fabricated by the multilayer ceramic technology based on the green sheet process. The magnetic material used in the circuit was ferrite, and the internal conductor was silver. The dimensions of the obtained generator were 3.5x4x3.5 mm. The output power was 1.92 μW. From FEM analysis of the magnetic flux, it was found that leakage of the flux affected the output power.

  14. Study of lateral mode SOI-MEMS resonators for reduced anchor loss

    International Nuclear Information System (INIS)

    Lee, Joshua E-Y; Yan, Jize; Seshia, Ashwin A

    2011-01-01

    MEMS resonators fabricated in silicon-on-insulator (SOI) technology must be clamped to the substrate via anchoring stems connected either from within the resonator or through the sides, with the side-clamped solution often employed due to manufacturing constraints. This paper examines the effect of two types of commonly used side-clamped, anchoring-stem geometries on the quality factor of three different laterally-driven resonator topologies. This study employs an analytical framework which considers the relative distribution of strain energies between the resonating body and clamping stems. The ratios of the strain energies are computed using ANSYS FEA and used to provide an indicator of the expected anchor-limited quality factors. Three MEMS resonator topologies have been fabricated and characterized in moderate vacuum. The associated measured quality factors are compared against the computed strain energy ratios, and the trends are shown to agree well with the experimental data.

  15. A review of MEMS micropropulsion technologies for CubeSats and PocketQubes

    Science.gov (United States)

    Silva, Marsil A. C.; Guerrieri, Daduí C.; Cervone, Angelo; Gill, Eberhard

    2018-02-01

    CubeSats have been extensively used in the past decade as scientific tools, technology demonstrators and for education. Recently, PocketQubes have emerged as an interesting and even smaller alternative to CubeSats. However, both satellite types often lack some key capabilities, such as micropropulsion, in order to further extend the range of applications of these small satellites. This paper reviews the current development status of micropropulsion systems fabricated with MEMS (micro electro-mechanical systems) and silicon technology intended to be used in CubeSat or PocketQube missions and compares different technologies with respect to performance parameters such as thrust, specific impulse, and power as well as in terms of operational complexity. More than 30 different devices are analyzed and divided into 7 main categories according to the working principle. A specific outcome of the research is the identification of the current status of MEMS technologies for micropropulsion including key opportunities and challenges.

  16. MEMS-based Circuits and Systems for Wireless Communication

    CERN Document Server

    Kaiser, Andreas

    2013-01-01

    MEMS-based Circuits and Systems for Wireless Communication provides comprehensive coverage of RF-MEMS technology from device to system level. This edited volume places emphasis on how system performance for radio frequency applications can be leveraged by Micro-Electro-Mechanical Systems (MEMS). Coverage also extends to innovative MEMS-aware radio architectures that push the potential of MEMS technology further ahead.  This work presents a broad overview of the technology from MEMS devices (mainly BAW and Si MEMS resonators) to basic circuits, such as oscillators and filters, and finally complete systems such as ultra-low-power MEMS-based radios. Contributions from leading experts around the world are organized in three parts. Part I introduces RF-MEMS technology, devices and modeling and includes a prospective outlook on ongoing developments towards Nano-Electro-Mechanical Systems (NEMS) and phononic crystals. Device properties and models are presented in a circuit oriented perspective. Part II focusses on ...

  17. Optical MEMS for chemical analysis and biomedicine

    CERN Document Server

    Jiang, Hongrui

    2016-01-01

    This book describes the current state of optical MEMS in chemical and biomedical analysis and brings together current trends and highlights topics representing the most exciting progress in recent years in the field.

  18. Advanced mechatronics and MEMS devices II

    CERN Document Server

    Wei, Bin

    2017-01-01

    This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intel...

  19. MEMS and Nano-Technology Clean Room

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS and Nano-Technology Clean Room is a state-of-the-art, 800 square foot, Class 1000-capable facility used for development of micro and sub-micro scale sensors...

  20. Wireless MEMs BioSensor, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  1. MEMS Gyroscope with Interferometric Detection, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This SBIR Phase I project will develop a MEMS gyroscope that uses an ultra high resolution sensing technique for measuring proof mass motion. The goal is to...

  2. MEMS Gyroscope with Interferometric Detection, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The proposed innovation is a novel MEMS gyroscope that uses micro-interferometric detection to measure the motion of the proof mass. Using an interferometric...

  3. Wireless MEMs BioSensor Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Crossfield is proposing to develop a low cost, single chip plant bio-monitor using an embedded MEMs based infrared (IR) spectroscopy gas sensor for carbon dioxide...

  4. MEMS Shutter for Spectrometer Calibration Project

    Data.gov (United States)

    National Aeronautics and Space Administration —   We shall develop a MEMS shutter that is expected to have 2-3 g mass and consumeThis research will demonstrate fabrication of a low mass (~2-3 grams), low...

  5. SiC MEMS For Harsh Environments

    National Research Council Canada - National Science Library

    Bradley, Kenneth

    2003-01-01

    ... (specifically high temperature) material for both structural and electronic devices. Although shock testing of SiC MEMS devices under this program was not accomplished, subsequent work allowed for this testing to occur, with positive results...

  6. MEMS Sensors and Actuators Laboratory (MSAL)

    Data.gov (United States)

    Federal Laboratory Consortium — The MEMS Sensors and Actuators Laboratory (MSAL) in the A.J. Clark School of Engineering at the University of Maryland (UMD) was established in January 2000. Our lab...

  7. Fabrication of integrated metallic MEMS devices

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

    2002-01-01

    A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

  8. Picometer-Resolution MEMS Segmented DM Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  9. MEMS direction finding acoustic sensor

    Science.gov (United States)

    Karunasiri, Gamani; Alves, Fabio; Swan, William

    2017-06-01

    Conventional directional sound sensing systems employ an array of spatially separated microphones to achieve directivity. However, there are insects such as the Ormia ochracea fly that can determine the direction of sound using a miniature hearing organ much smaller than the wavelength of sound it detects. The fly's eardrums are coupled mechanically with a separation of only 0.5 mm and yet have a remarkable sensitivity to the direction of sound. The MEMS based sensor mimicking the fly's hearing system was fabricated using an SOI substrate with a 25 μm device layer. The sensor consists of two 1.5 mm x1.6 mm wings connected in the middle by a 2.7 mm x 30 μm bridge. The entire structure is connected to the substrate by two torsional legs at the center. The frequency response of the sensor showed two resonance frequencies at approximately 1.1 kHz (rocking) and 1.5 kHz (bending). The resonance at 1.1 kHz is due to rocking of the wings by twisting the legs and the other at 1.5 kHz is due to bending of the bridge. The response of the sensor was probed electronically using comb finger capacitors integrated to the edges of the wings and with the help of an MS3110 chip. A peak output voltage of about 9V/Pa was measured for sound incident normal to the device at the resonance frequency of the bending mode. The bearing of the incident sound under these conditions could be determined to within a few degrees. These findings indicate the potential use of the MEMS sensor to locate sound sources with high accuracy.

  10. Variable Emissivity Through MEMS Technology

    Science.gov (United States)

    Darrin, Ann Garrison; Osiander, Robert; Champion, John; Swanson, Ted; Douglas, Donya; Grob, Lisa M.; Powers, Edward I. (Technical Monitor)

    2000-01-01

    This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro ElectroMechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison parametric evaluations of the thermal performances of the new vari-e technology and standard thermal control systems are presented in this paper.

  11. Digital holography for MEMS and microsystem metrology

    CERN Document Server

    Asundi, Anand

    2011-01-01

    Approaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the

  12. Fabrication of integrated metallic MEMS devices

    DEFF Research Database (Denmark)

    Yalcinkaya, Arda Deniz; Ravnkilde, Jan Tue; Hansen, Ole

    2002-01-01

    A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators are characteri......A simple and complementary metal oxide semiconductor (CMOS) compatible fabrication technique for microelectromechanical (MEMS) devices is presented. The fabrication technology makes use of electroplated metal layers. Among the fabricated devices, high quality factor microresonators...

  13. Nano-tribology and materials in MEMS

    CERN Document Server

    Satyanarayana, N; Lim, Seh

    2013-01-01

    This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.

  14. Partially flexible MEMS neural probe composed of polyimide and sucrose gel for reducing brain damage during and after implantation

    International Nuclear Information System (INIS)

    Jeon, Myounggun; Yoon, Eui-Sung; Cho, Il-Joo; Cho, Jeiwon; Jung, Dahee; Kim, Yun Kyung; Shin, Sehyun

    2014-01-01

    This paper presents a flexible microelectromechanical systems (MEMS) neural probe that minimizes neuron damage and immune response, suitable for chronic recording applications. MEMS neural probes with various features such as high electrode densities have been actively investigated for neuron stimulation and recording to study brain functions. However, successful recording of neural signals in chronic application using rigid silicon probes still remains challenging because of cell death and macrophages accumulated around the electrodes over time from continuous brain movement. Thus, in this paper, we propose a new flexible MEMS neural probe that consists of two segments: a polyimide-based, flexible segment for connection and a rigid segment composed of thin silicon for insertion. While the flexible connection segment is designed to reduce the long-term chronic neuron damage, the thin insertion segment is designed to minimize the brain damage during the insertion process. The proposed flexible neural probe was successfully fabricated using the MEMS process on a silicon on insulator wafer. For a successful insertion, a biodegradable sucrose gel is coated on the flexible segment to temporarily increase the probe stiffness to prevent buckling. After the insertion, the sucrose gel dissolves inside the brain exposing the polyimide probe. By performing an insertion test, we confirm that the flexible probe has enough stiffness. In addition, by monitoring immune responses and brain histology, we successfully demonstrate that the proposed flexible neural probe incurs fivefold less neural damage than that incurred by a conventional silicon neural probe. Therefore, the presented flexible neural probe is a promising candidate for recording stable neural signals for long-time chronic applications. (paper)

  15. In-plane deeply-etched optical MEMS notch filter with high-speed tunability

    Science.gov (United States)

    Sabry, Yasser M.; Eltagoury, Yomna M.; Shebl, Ahmed; Soliman, Mostafa; Sadek, Mohamed; Khalil, Diaa

    2015-12-01

    Notch filters are used in spectroscopy, multi-photon microscopy, fluorescence instrumentation, optical sensors and other life science applications. One type of notch filter is based on a fiber-coupled Fabry-Pérot cavity, which is formed by a reflector (external mirror) facing a dielectric-coated end of an optical fiber. Tailoring this kind of optical filter for different applications is possible because the external mirror has fewer mechanical and optical constraints. In this paper we present optical modeling and implementation of a fiber-coupled Fabry-Pérot filter based on dielectric-coated optical fiber inserted into a micromachined fiber groove facing a metallized micromirror, which is driven by a high-speed MEMS actuator. The optical MEMS chip is fabricated using deep reactive ion etching (DRIE) technology on a silicon on insulator wafer, where the optical axis is parallel to the substrate (in-plane) and the optical/mechanical components are self-aligned by the photolithographic process. The DRIE etching depth is 150 μm, chosen to increase the micromirror optical throughput and improving the out-of-plane stiffness of the MEMS actuator. The MEMS actuator type is closing-gap, while its quality factor is almost doubled by slotting the fixed plate. A low-finesse Fabry-Pérot interferometer is formed by the metallized surface of the micromirror and a cleaved end of a standard single-mode fiber, for characterization of the MEMS actuator stroke and resonance frequency. The actuator achieves a travel distance of 800 nm at a resonance frequency of 89.9 kHz. The notch filter characteristics were measured using an optical spectrum analyzer, and the filter exhibits a free spectral range up to 100 nm and a notch rejection ratio up to 20 dB around a wavelength of 1300 nm. The presented device provides batch processing and low-cost production of the filter.

  16. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O' NEAL, CHAD; SINGH, SUSHILA B.

    1999-09-24

    Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

  17. Dynamic metasurface lens based on MEMS technology

    Directory of Open Access Journals (Sweden)

    Tapashree Roy

    2018-02-01

    Full Text Available In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.

  18. A novel piezoresistive polymer nanocomposite MEMS accelerometer

    International Nuclear Information System (INIS)

    Seena, V; Hari, K; Prajakta, S; Ramgopal Rao, V; Pratap, Rudra

    2017-01-01

    A novel polymer MEMS (micro electro mechanical systems) accelerometer with photo-patternable polymer nanocomposite as a piezoresistor is presented in this work. Polymer MEMS Accelerometer with beam thicknesses of 3.3 µ m and embedded nanocomposite piezoresistive layer having a gauge factor of 90 were fabricated. The photosensitive nanocomposite samples were prepared and characterized for analyzing the mechanical and electrical properties and thereby ensuring proper process parameters for incorporating the piezoresistive layer into the polymer MEMS accelerometer. The microfabrication process flow and unit processes followed are extremely low cost with process temperatures below 100 °C. This also opens up a new possibility for easy integration of such polymer MEMS with CMOS (complementary metal oxide semiconductor) devices and circuits. The fabricated devices were characterized using laser Doppler vibrometer (LDV) and the devices exhibited a resonant frequency of 10.8 kHz and a response sensitivity of 280 nm g −1 at resonance. The main focus of this paper is on the SU-8/CB nanocomposite piezoresistive MEMS accelerometer technology development which covers the material and the fabrication aspects of these devices. CoventorWare FEA analysis performed using the extracted material properties from the experimental characterization which are in close agreement to performance parameters of the fabricated devices is also discussed. The simulated piezoresistive polymer MEMS devices showed an acceleration sensitivity of 126 nm g −1 and 82 ppm of Δ R / R per 1 g of acceleration. (paper)

  19. Dynamic metasurface lens based on MEMS technology

    Science.gov (United States)

    Roy, Tapashree; Zhang, Shuyan; Jung, Il Woong; Troccoli, Mariano; Capasso, Federico; Lopez, Daniel

    2018-02-01

    In the recent years, metasurfaces, being flat and lightweight, have been designed to replace bulky optical components with various functions. We demonstrate a monolithic Micro-Electro-Mechanical System (MEMS) integrated with a metasurface-based flat lens that focuses light in the mid-infrared spectrum. A two-dimensional scanning MEMS platform controls the angle of the lens along two orthogonal axes by ±9°, thus enabling dynamic beam steering. The device could be used to compensate for off-axis incident light and thus correct for aberrations such as coma. We show that for low angular displacements, the integrated lens-on-MEMS system does not affect the mechanical performance of the MEMS actuators and preserves the focused beam profile as well as the measured full width at half maximum. We envision a new class of flat optical devices with active control provided by the combination of metasurfaces and MEMS for a wide range of applications, such as miniaturized MEMS-based microscope systems, LIDAR scanners, and projection systems.

  20. Performance evaluation of perforated micro-cantilevers for MEMS applications

    Science.gov (United States)

    Swamy, Kenkere Balashanthamurthy Mruthyunjaya; Mukherjee, Banibrata; Ali Syed Mohammed, Zishan; Chakraborty, Suman; Sen, Siddhartha

    2014-04-01

    Miniaturized cantilevers are one of the elementary structures that are widely used in many micro-devices and systems. The dynamic performance of micro-cantilevers having process dictated through perforations is investigated. High-aspect ratio, long silicon cantilevers, intended for improved performance through lowered stiffness are designed with a series of through holes and simulated along with similar nonperforated/solid cantilevers for comparison. A few perforated structures are also fabricated using silicon-on-insulator-based multiproject MEMS processes from MEMSCAP Inc. (Durham, North Carolina) by reduced mask level and eliminating complex substrate trenching step. The dynamic behavior of these fabricated structures is experimentally studied for both in-plane and out-of-plane directions. It is shown that, due to the presence of perforations, stiffness in planar direction is lightly affected, whereas in out-of-plane direction it is significantly reduced by >35%. Similarly, the variation of damping in both perforated and nonperforated beams, too, is thoroughly analyzed for the first few modes of vibration. Nevertheless, their frequency response variation of micro-systems including those based on comb drives.

  1. ProTEK PSB as Biotechnology Photosensitive Protection Mask on 3C-SiC-on-Si in MEMS Sensor

    Science.gov (United States)

    Marsi, N.; Majlis, B. Y.; Mohd-Yasin, F.; Hamzah, A. A.; Mohd Rus, A. Z.

    2016-11-01

    This project presents the fabrication of MEMS employing a cubic silicon carbide (3C- SiC) on silicon wafer using newly developed ProTEK PSB as biotechnology photosensitive protection mask. This new biotechnology can reduce the number of processes and simplify the process flow with minimal impact on overall undercut performance. The 680 pm thick wafer is back-etched, leaving the 3C-SiC thin film with a thickness of 1.0 μm as the flexible diaphragm to detect pressure. The effect of the new coating of ProTEK PSB on different KOH solvents were investigated depending on various factors such as development time, final cure temperature and the thickness of the ProTEK PSB deposited layer. It is found that 6.174 μm thickness of ProTEK PSB offers some possibility of reducing the processing time compared to silicon nitride etch masks in KOH (55%wt, 80°C). The new ProTEK PSB biotechnology photosensitive protection mask indicates good stability and sustains its performance in different treatments under KOH and IPA for 8 hours. This work also revealed that the fabrication of MEMS sensors using the new biotechnology photosensitive protection mask provides a simple assembly approach and reduces manufacturing costs. The MEMS sensor can operate up to 500 °C as indicated under the sensitivity of 0.826 pF/MPa with nonlinearity and hysteresis of 0.61% and 3.13%, respectively.

  2. Programmable Aperture with MEMS Microshutter Arrays

    Science.gov (United States)

    Moseley, Samuel; Li, Mary; Kutyrev, Alexander; Kletetschka, Gunther; Fettig, Rainer

    2011-01-01

    the shutter sits are grounded. The shutters with one or both ungrounded electrodes are held open. Sub-micron bumps underneath light shields and silicon ribs on back walls are the two features to prevent stiction. These features ensure that the microshutter array functions properly in mechanical motions. The MSA technology can be used primarily in multi-object imaging and spectroscopy, photomask generation, light switches, and in the stepper equipment used to make integrated circuits and MEMS (microelectromechanical systems) devices.

  3. Fabrication of a mechanically aligned single-wafer MEMS turbine with turbocharger

    Science.gov (United States)

    Pelekies, S. O.; Schuhmann, T.; Gardner, W. G.; Camacho, A.; Protz, J. M.

    2010-10-01

    We describe the fabrication of a turbocharged, microelectromechanical system (MEMS) turbine. The turbine will be part of a standalone power unit and includes extra layers to connect the turbine to a generator. The project goal is to demonstrate the successful combination of several features, namely: silicon fusion bonding (SFB), a micro turbocharger [2], two rotors, mechanical alignment between two wafers [1], and the use of only one 5" silicon wafer. The dimension of the actual turbine casing will be 14mm. The turbine rotor will have a diameter of 8mm. Given these dimensions, MEMS processes are an adequate way to fabricate the device, but it will be necessary to stack up seven different layers to build the turbine, as it is not possible to construct it out of one thick wafer. SFB will be used for bonding because it permits the great precision necessary for high quality alignment. Yet a more precise alignment will be necessary between the layers that contain the turbine rotor, to decrease imbalance and guarantee operation at a very high rpm. To achieve these tight tolerances, a mechanical alignment feature announced by Liudi Jiang [1] is used. The alignment accuracy is expected to be around 200nm. Despite the fact that the turbine consists of multiple layers, it will be fabricated on only one silicon-on-insulator (SOI) wafer. As a result, all layers are exposed to the same process flow. The fabrication process includes MEMS technology as photolithography, nine deep reactive ion etching (DRIE) steps, and six SFB operations. A total of 14 masks are necessary for the fabrication.

  4. Screen printed PZT/PZT thick film bimorph MEMS cantilever device for vibration energy harvesting

    DEFF Research Database (Denmark)

    Xu, R.; Lei, A.; Christiansen, T. L.

    2011-01-01

    We present a MEMS-based PZT/PZT thick film bimorph vibration energy harvester with an integrated silicon proof mass. The most common piezoelectric energy harvesting devices utilize a cantilever beam of a non piezoelectric material as support beneath or in-between the piezoelectric material....... It provides mechanical support but it also reduces the power output. Our device replaces the support with another layer of the piezoelectric material, and with the absence of an inactive mechanical support all of the stresses induced by the vibrations will be harvested by the active piezoelectric elements....

  5. Screen printed PZT/PZT thick film bimorph MEMS cantilever device for vibration energy harvesting

    DEFF Research Database (Denmark)

    Xu, Ruichao; Lei, Anders; Dahl-Petersen, Christian

    2012-01-01

    We present a microelectromechanical system (MEMS) based PZT/PZT thick film bimorph vibration energy harvester with an integrated silicon proof mass. Most piezoelectric energy harvesting devices use a cantilever beam of a non piezoelectric material as support beneath or in-between the piezoelectric...... materials; it provides mechanical support but it also reduces the power output. In our device we replace the support material with another layer of the piezoelectric material. With the absence of an inactive mechanical support all stresses induced by vibrations will be harvested by the active piezoelectric...

  6. Infrastructure, Technology and Applications of Micro-Electro-Mechanical Systems (MEMS)

    Energy Technology Data Exchange (ETDEWEB)

    Allen, J.J.; Jakubczak, J.F.; Krygowski, T.W.; Miller, S.L.; Montague, S.; Rodgers, M.S.; Sniegowski, J.J.

    1999-07-09

    A review is made of the infrastructure, technology and capabilities of Sandia National Laboratories for the development of micromechanical systems. By incorporating advanced fabrication processes, such as chemical mechanical polishing, and several mechanical polysilicon levels, the range of micromechanical systems that can be fabricated in these technologies is virtually limitless. Representative applications include a micro-engine driven mirror, and a micromachined lock. Using a novel integrated MEMS/CMOS technology, a six degree-of-freedom accelerometer/gyroscope system has been designed by researchers at U.C. Berkeley and fabricated on the same silicon chip as the CMOS control circuits to produce an integrated micro-navigational unit.

  7. Polyimide/SU-8 catheter-tip MEMS gauge pressure sensor.

    Science.gov (United States)

    Hasenkamp, Willyan; Forchelet, David; Pataky, Kristopher; Villard, Jimmy; Van Lintel, Harald; Bertsch, Arnaud; Wang, Qing; Renaud, Philippe

    2012-10-01

    This paper describes the development of a polyimide/SU-8 catheter-tip MEMS gauge pressure sensor. Finite element analysis was used to investigate critical parameters, impacting on the device design and sensing characteristics. The sensing element of the device was fabricated by polyimide-based micromachining on a flexible membrane, using embedded thin-film metallic wires as piezoresistive elements. A chamber containing this flexible membrane was sealed using an adapted SU-8 bonding technique. The device was evaluated experimentally and its overall performance compared with a commercial silicon-based pressure sensor. Furthermore, the device use was demonstrated by measuring blood pressure and heart rate in vivo.

  8. Design and Simulation of RF MEMS Switch for Wireless Communication Applications

    Directory of Open Access Journals (Sweden)

    Girija Sravani K.

    2015-12-01

    Full Text Available In this paper, we have reported the design and analysis of a novel bulk-silicon fabricated RF MEMS capacitive switch. This RF switch has a short response time, low power consumption, and an IC compatible design. To lower the driving voltage and insertion loss, multiple geometries for the movable beam, membrane, and air gap are investigated using Software tool Comsol Multiphysics. Potential thermal stresses and deflection of the cantilever due to the application of forces have been investigated. Performance of the device under the application of forces also studied using the software.

  9. PCR biocompatibility of Lab-on-a-chip and MEMS materials

    DEFF Research Database (Denmark)

    Christensen, Troels Balmer; Pedersen, Christian Møller; Grøndahl, K. G.

    2007-01-01

    , reduced or no DNA amplification at all is an important challenge for microfabricated PCR devices due to a negative interaction between PCR chemicals and the surrounding environment, i.e. the materials encapsulating the PCR mix. Materials of special interest regarding PCR compatibility are silicon, glass...... and polymers, which are important in the fabrication of microelectromechanical systems (MEMS), micro total analysis systems (mu TAS) and lab-on-a-chip (LOC) systems. The PCR inhibition effect is a particularly important phenomenon in microsystems due to an increased surface-to-volume ratio which enhances...

  10. MEMS- and NEMS-based smart devices and systems

    Science.gov (United States)

    Varadan, Vijay K.

    2001-11-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sized now don at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic an micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sensing and control of a variety functions in automobile, aerospace, marine and civil

  11. MEMS device for mass market gas and chemical sensors

    Science.gov (United States)

    Kinkade, Brian R.; Daly, James T.; Johnson, Edward A.

    2000-08-01

    in the house. Internet grocery delivery services could check for spoiled foods in their clients' refrigerators. City emissions regulators could monitor the various emissions sources throughout the area from their desk to predict how many pollution vouchers they will need to trade in the next week. We describe a new component architecture for mass-market sensors based on silicon microelectromechanical systems (MEMS) technology. MEMS are micrometer-scale devices that can be fabricated as discrete devices or large arrays, using the technology of integrated circuit manufacturing. These new photonic bandgap and MEMS fabricataion technologies will simplify the component technology to provide high-quality gas and chemical sensors at consumer prices.

  12. Mid infrared MEMS FTIR spectrometer

    Science.gov (United States)

    Erfan, Mazen; Sabry, Yasser M.; Mortada, Bassem; Sharaf, Khaled; Khalil, Diaa

    2016-03-01

    In this work we report, for the first time to the best of our knowledge, a bulk-micromachined wideband MEMS-based spectrometer covering both the NIR and the MIR ranges and working from 1200 nm to 4800 nm. The core engine of the spectrometer is a scanning Michelson interferometer micro-fabricated using deep reactive ion etching (DRIE) technology. The spectrum is obtained using the Fourier Transform techniques that allows covering a very wide spectral range limited by the detector responsivity. The moving mirror of the interferometer is driven by a relatively large stroke electrostatic comb-drive actuator. Zirconium fluoride (ZrF4) multimode optical fibers are used to connect light between the white light source and the interferometer input, as well as the interferometer output to a PbSe photoconductive detector. The recorded signal-to-noise ratio is 25 dB at the wavelength of 3350 nm. The spectrometer is successfully used in measuring the absorption spectra of methylene chloride, quartz glass and polystyrene film. The presented solution provides a low cost method for producing miniaturized spectrometers in the near-/mid-infrared.

  13. Automotive Sensors and MEMS Technology

    Science.gov (United States)

    Nonomura, Yutaka

    - Automotive sensors are used for emission gas purification, energy conservation, car kinematic performance, safety and ITS (intelligent transportation system). The comparison of the sensor characteristics was made for their application area. Many kinds of the principles are applied for the sensors. There are two types of sensors, such as physical and chemical one. Many of the automotive sensors are physical type such as mechanical sensors. And a gas sensor is a chemical type. The sensors have been remarkably developed with the advancement of the MEMS (Micro Electro Mechanical Systems) technology. In this paper, gas, pressure, combustion pressure, acceleration, magnetic, and angular rate sensors for automotive use are explained with their features. The sensors are key devices to control cars in the engine, power train, chassis and safety systems. The environment resistance, long term reliability, and low cost are required for the automotive sensors. They are very hard to be resolved. However, the sensor technology contributes greatly to improving global environment, energy conservation, and safety. The applications of automotive sensors will be expanded with the automobile developments.

  14. A Nuclear Microbattery for MEMS Devices

    International Nuclear Information System (INIS)

    Blanchard, James; Henderson, Douglass; Lal, Amit

    2002-01-01

    This project was designed to demonstrate the feasibility of producing on-board power for MEMS devices using radioisotopes. MEMS is a fast growing field, with hopes for producing a wide variety of revolutionary applications, including ''labs on a chip,'' micromachined scanning tunneling microscopes, microscopic detectors for biological agents, microsystems for DNA identification, etc. Currently, these applications are limited by the lack of an on-board power source. Research is ongoing to study approaches such as fuel cells, fossil fuels, and chemical batteries, but all these concepts have limitations. For long-lived, high energy density applications, on-board radioisotope power offers the best choice. We have succeeded in producing such devices using a variety of isotopes, incorporation methods, and device geometries. These experiments have demonstrated the feasibility of using radioisotope power and that there are a variety of options available for MEMS designers. As an example of an integrated, self-powered application, we have created an oscillating cantilever beam that is capable of consistent, periodic oscillations over very long time periods without the need for refueling. Ongoing work will demonstrate that this cantilever is capable of radio frequency transmission, allowing MEMS devices to communicate with one another wirelessly. Thus, this will be the first self-powered wireless transmitter available for use in MEMS devices, permitting such applications as sensors embedded in buildings for continuous monitoring of the building performance and integrity

  15. In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

    International Nuclear Information System (INIS)

    Wang Yuelin; Li Tie; Zhang Xiao; Zeng Hongjiang; Jin Qinhua

    2014-01-01

    Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope (SEM) and a transmission electron microscope (TEM) with the help of traditional micro-electro-mechanical system (MEMS) technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young's modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices. (invited papers)

  16. Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices.

    Science.gov (United States)

    Sutanto, Jemmy; Anand, Sindhu; Sridharan, Arati; Korb, Robert; Zhou, Li; Baker, Michael S; Okandan, Murat; Muthuswamy, Jit

    2012-04-10

    We report here a successful demonstration of a flip-chip packaging approach for a microelectromechanical systems (MEMS) device with in-plane movable microelectrodes implanted in a rodent brain. The flip-chip processes were carried out using a custom-made apparatus that was capable of the following: 1) creating Ag epoxy microbumps for first-level interconnect; 2) aligning the die and the glass substrate; and 3) creating non-hermetic encapsulation (NHE). The completed flip-chip package had an assembled weight of only 0.5 g significantly less than the previously designed wire-bonded package of 4.5 g. The resistance of the Ag bumps was found to be negligible. The MEMS micro-electrodes were successfully tested for its mechanical movement with microactuators generating forces of 450 μ N with a displacement resolution of 8.8 μ m/step. An NHE on the front edge of the package was created by patterns of hydrophobic silicone microstructures to prevent contamination from cerebrospinal fluid while simultaneously allowing the microelectrodes to move in and out of the package boundary. The breakdown pressure of the NHE was found to be 80 cm of water, which is significantly (4.5-11 times) larger than normal human intracranial pressures. Bench top tests and in vivo tests of the MEMS flip-chip packages for up to 75 days showed reliable NHE for potential long-term implantation.

  17. A Fast, Large-Stroke Electrothermal MEMS Mirror Based on Cu/W Bimorph

    Directory of Open Access Journals (Sweden)

    Xiaoyang Zhang

    2015-12-01

    Full Text Available This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of multimorph beams for obtaining large vertical displacement from the angular motion of the bimorphs. The W layer is also used as the embedded heater. The silicon underneath the entire actuator is completely removed using a unique backside deep-reactive-ion-etching DRIE release process, leading to improved thermal response speed and front-side mirror surface protection. This MEMS mirror can perform both piston and tip-tilt motion. The mirror generates large pure vertical displacement up to 320 μm at only 3 V with a power consumption of 56 mW for each actuator. The maximum optical scan angle achieved is ±18° at 3 V. The measured thermal response time is 15.4 ms and the mechanical resonances of piston and tip-tilt modes are 550 Hz and 832 Hz, respectively.

  18. Electromagnetically Driven Dual-axis Tilting MEMS Grating for Near Infrared Spectroscopy

    Science.gov (United States)

    Watanabe, Yoshiyuki; Takahashi, Yoshiyuki; Abe, Yutaka; Iwamatsu, Shinnosuke; Yahagi, Toru; Kobayashi, Seiya; Konno, Shunsuke; Sato, Toshiyuki

    This paper describes design and fabrication of electromagnetically driven dual-axis tilting MEMS-grating, and evaluation for low coherent near infrared spectroscopy. At first, we have investigated fabrication of laminar grating using EB lithography of UV photoresist and dry etching of silicon. In consequence, the laminar gratings of 0.6 - 2.0μm pitches were fabricated successfully. Second, we fabricated electromagnetically driven MEMS-grating which can tilt to dual-axis. Primary axis is used for spectroscopy, and the secondary axis is used for optical axis alignment. As the results of evaluation, primary and secondary DC tilting angles were 0.40°/mA and 0.39°/mA, respectively. And then, primary and secondary resonant frequencies (Q-factor) were 217Hz (Q36) and 172Hz (Q25), respectively. Finally, we constructed Fourier domain fiber interferometer whose sample arm was 2m in length. As setting optical length difference to be 180μm, the interference spectrum in wavelength range of 1400-1700nm was observed in less than 25ms by MEMS-GR, and a Fourier and axis transformed peak was acquired at 50dB.

  19. SMA Foils for MEMS: From Material Properties to the Engineering of Microdevices

    Science.gov (United States)

    Kohl, Manfred; Ossmer, Hinnerk; Gueltig, Marcel; Megnin, Christof

    2017-12-01

    In the early nineties, microelectromechanical systems (MEMS) technology has been still in its infancy. As silicon (Si) is not a transducer material, it was clear at the very beginning that mechanically active materials had to be introduced to MEMS in order to enable functional microdevices with actuation capability beyond electrostatics. At that time, shape memory alloys (SMAs) have been available in bulk form, mainly as SMA wires and SMA plates. On the macro scale, these materials show highest work densities compared to other actuation principles in the order of 107 J/m3, which stimulated research on the integration of SMA to MEMS. Subsequently, two approaches for producing planar materials have been initiated (1) magnetron sputtering of SMA thin films and (2) the integration of rolled SMA foils, which both turned out to be very successful creating a paradigm change in microactuation technology. The following review covers important milestones of the research and development of SMA foil-based microactuators including materials characterization, design engineering, technology, and demonstrator development as well as first commercial products.

  20. MEMS Lubrication by In-Situ Tribochemical Reactions From the Vapor Phase.

    Energy Technology Data Exchange (ETDEWEB)

    Dugger, Michael Thomas; Asay, David B.; Kim, Seong H.

    2008-01-01

    Vapor Phase Lubrication (VPL) of silicon surfaces with pentanol has been demonstrated. Two potential show stoppers with respect to application of this approach to real MEMS devices have been investigated. Water vapor was found to reduce the effectiveness of VPL with alcohol for a given alcohol concentration, but the basic reaction mechanism observed in water-free environments is still active, and devices operated much longer in mixed alcohol and water vapor environments than with chemisorbed monolayer lubricants alone. Complex MEMS gear trains were successfully lubricated with alcohol vapors, resulting in a factor of 104 improvement in operating life without failure. Complex devices could be made to fail if operated at much higher frequencies than previously used, and there is some evidence that the observed failure is due to accumulation of reaction products at deeply buried interfaces. However, if hypothetical reaction mechanisms involving heated surfaces are valid, then the failures observed at high frequency may not be relevant to operation at normal frequencies. Therefore, this work demonstrates that VPL is a viable approach for complex MEMS devices in conventional packages. Further study of the VPL reaction mechanisms are recommended so that the vapor composition may be optimized for low friction and for different substrate materials with potential application to conventionally fabricated, metal alloy parts in weapons systems. Reaction kinetics should be studied to define effective lubrication regimes as a function of the partial pressure of the vapor phase constituent, interfacial shear rate, substrate composition, and temperature.

  1. MEMS tunable grating micro-spectrometer

    Science.gov (United States)

    Tormen, Maurizio; Lockhart, R.; Niedermann, P.; Overstolz, T.; Hoogerwerf, A.; Mayor, J.-M.; Pierer, J.; Bosshard, C.; Ischer, R.; Voirin, G.; Stanley, R. P.

    2017-11-01

    The interest in MEMS based Micro-Spectrometers is increasing due to their potential in terms of flexibility as well as cost, low mass, small volume and power savings. This interest, especially in the Near-Infrared and Mid- Infrared, ranges from planetary exploration missions to astronomy, e.g. the search for extra solar planets, as well as to many other terrestrial fields of application such as, industrial quality and surface control, chemical analysis of soil and water, detection of chemical pollutants, exhausted gas analysis, food quality control, process control in pharmaceuticals, to name a few. A compact MEMS-based Spectrometer for Near- Infrared and Mid-InfraRed operation have been conceived, designed and demonstrated. The design based on tunable MEMS blazed grating, developed in the past at CSEM [1], achieves state of the art results in terms of spectral resolution, operational wavelength range, light throughput, overall dimensions, and power consumption.

  2. MEMS reliability: The challenge and the promise

    Energy Technology Data Exchange (ETDEWEB)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.; Peterson, K.A.

    1998-05-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost effective solutions only if they prove to be sufficiently reliable. A valid reliability assessment of MEMS has three prerequisites: (1) statistical significance; (2) a technique for accelerating fundamental failure mechanisms, and (3) valid physical models to allow prediction of failures during actual use. These already exist for the microelectronics portion of such integrated systems. The challenge lies in the less well understood micromachine portions and its synergistic effects with microelectronics. This paper presents a methodology addressing these prerequisites and a description of the underlying physics of reliability for micromachines.

  3. Enabling technology for MEMS and nanodevices

    CERN Document Server

    Baltes, Henry; Fedder, Gary K; Hierold, Christofer; Korvink, Jan G; Tabata, Osamu

    2013-01-01

    This softcover edition of the eponymous volume from the successful ""Advanced Micro & Nanosystems"" series covers all aspects of fabrication of MEMS under CMOS-compatible conditions from design to implementation.It examines the various routes and methods to combine electronics generated by the CMOS technology with novel micromechanical parts into one-chip solutions. Various approaches, fundamental and technological aspects as well as strategies leading to different types of functionalities and presented in detail.For the practicing engineer as well as MSc and PhD students on MEMS cours

  4. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  5. Liquid Tunable Microlenses based on MEMS techniques

    Science.gov (United States)

    Zeng, Xuefeng; Jiang, Hongrui

    2013-01-01

    The recent rapid development in microlens technology has provided many opportunities for miniaturized optical systems, and has found a wide range of applications. Of these microlenses, tunable-focus microlenses are of special interest as their focal lengths can be tuned using micro-scale actuators integrated with the lens structure. Realization of such tunable microlens generally relies on the microelectromechanical system (MEMS) technologies. Here, we review the recent progress in tunable liquid microlenses. The underlying physics relevant to these microlenses are first discussed, followed by description of three main categories of tunable microlenses involving MEMS techniques, mechanically driven, electrically driven, and those integrated within microfluidic systems. PMID:24163480

  6. RF MEMS theory, design, and technology

    CERN Document Server

    Rebeiz, Gabriel M

    2003-01-01

    Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.

  7. Opportunities of CMOS-MEMS integration through LSI foundry and open facility

    Science.gov (United States)

    Mita, Yoshio; Lebrasseur, Eric; Okamoto, Yuki; Marty, Frédéfic; Setoguchi, Ryota; Yamada, Kentaro; Mori, Isao; Morishita, Satoshi; Imai, Yoshiaki; Hosaka, Kota; Hirakawa, Atsushi; Inoue, Shu; Kubota, Masanori; Denoual, Matthieu

    2017-06-01

    Since the 2000s, several countries have established micro- and nanofabrication platforms for the research and education community as national projects. By combining such platforms with VLSI multichip foundry services, various integrated devices, referred to as “CMOS-MEMS”, can be realized without constructing an entire cleanroom. In this paper, we summarize MEMS-last postprocess schemes for CMOS devices on a bulk silicon wafer as well as on a silicon-on-insulator (SOI) wafer using an open-access cleanroom of the Nanotechnology Platform of MEXT Japan. The integration devices presented in this article are free-standing structures and postprocess isolated LSI devices. Postprocess issues are identified with their solutions, such as the reactive ion etching (RIE) lag for dry release and the impact of the deep RIE (DRIE) postprocess on transistor characteristics. Integration with nonsilicon materials is proposed as one of the future directions.

  8. FEM Simulation of Influence of Protective Encapsulation on MEMS Pressure Sensor

    DEFF Research Database (Denmark)

    Yao, Qingshan; Janting, Jakob; Branebjerg, Jens

    2003-01-01

    The objective of the work is to evaluate the feasibility of packaging a MEMS silicon pressure sensor by using either a polymer encapsulation or a combination of a polymer encapsulation and a metallic protection Membrane (fig. 1). The potential application of the protected sensor is for harsh...... compared to the conventionally exposed sensor. 2) Stress concentration calculations are performed to investigate if the encapsulation could lead to increased stress concentration in the silicon structure. The reliability of the adhesion of the metallic encapsulating membrane is assessed by investigating...... whether the metallic membrane / coating will peel off when applying the maximum pressure, which is 4000 bar leading to high shear stress between the metallic membrane and the polymer encapsulation material.3) Thermal calculations are made to evaluate the influence of the environment on the packaged sensor...

  9. Review of Automated Design and Optimization of MEMS

    DEFF Research Database (Denmark)

    Achiche, Sofiane; Fan, Zhun; Bolognini, Francesca

    2007-01-01

    carried out. This paper presents a review of these techniques. The design task of MEMS is usually divided into four main stages: System Level, Device Level, Physical Level and the Process Level. The state of the art o automated MEMS design in each of these levels is investigated.......In recent years MEMS saw a very rapid development. Although many advances have been reached, due to the multiphysics nature of MEMS, their design is still a difficult task carried on mainly by hand calculation. In order to help to overtake such difficulties, attempts to automate MEMS design were...

  10. Optically pumped 1550nm wavelength tunable MEMS VCSEL

    DEFF Research Database (Denmark)

    Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa

    2016-01-01

    The paper presents the design and fabrication of an optically pumped 1550nm tunable MEMS VCSEL with anenclosed MEMS. The MEMS is defined in SOI and the active material, an InP wafer with quantum wells arebonded to the SOI and the last mirror is made from the deposition of dielectric materials. Th....... The design bringsin flexibility to fabricate MEMS VCSELs over a wider range of wavelengths. The paper discusses results fromthe simulations and bonding results from fabrication. The device will push the boundaries for wavelength sweepspeed and bandwidth.......The paper presents the design and fabrication of an optically pumped 1550nm tunable MEMS VCSEL with anenclosed MEMS. The MEMS is defined in SOI and the active material, an InP wafer with quantum wells arebonded to the SOI and the last mirror is made from the deposition of dielectric materials...

  11. Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.

    Science.gov (United States)

    Roy, Sukanta; Ramiah, Harikrishnan; Reza, Ahmed Wasif; Lim, Chee Cheow; Ferrer, Eloi Marigo

    2016-01-01

    Micro-electro mechanical system (MEMS) based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C) beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM). A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.

  12. Design of a MEMS-Based Oscillator Using 180nm CMOS Technology.

    Directory of Open Access Journals (Sweden)

    Sukanta Roy

    Full Text Available Micro-electro mechanical system (MEMS based oscillators are revolutionizing the timing industry as a cost effective solution, enhanced with more features, superior performance and better reliability. The design of a sustaining amplifier was triggered primarily to replenish MEMS resonator's high motion losses due to the possibility of their 'system-on-chip' integrated circuit solution. The design of a sustaining amplifier observing high gain and adequate phase shift for an electrostatic clamp-clamp (C-C beam MEMS resonator, involves the use of an 180nm CMOS process with an unloaded Q of 1000 in realizing a fixed frequency oscillator. A net 122dBΩ transimpedance gain with adequate phase shift has ensured 17.22MHz resonant frequency oscillation with a layout area consumption of 0.121 mm2 in the integrated chip solution, the sustaining amplifier draws 6.3mW with a respective phase noise of -84dBc/Hz at 1kHz offset is achieved within a noise floor of -103dBC/Hz. In this work, a comparison is drawn among similar design studies on the basis of a defined figure of merit (FOM. A low phase noise of 1kHz, high figure of merit and the smaller size of the chip has accredited to the design's applicability towards in the implementation of a clock generative integrated circuit. In addition to that, this complete silicon based MEMS oscillator in a monolithic solution has offered a cost effective solution for industrial or biomedical electronic applications.

  13. A Widely-Accessible Distributed MEMS Processing Environment. The MEMS Exchange Program

    Science.gov (United States)

    2012-10-29

    steadily rising for several years, our revenue began to drop in 2009, we think mostly due to the bad economy. In years past we would normally see a...the MEMS Materials and Processing Handbook, editors R. Ghodssi and P. Lin, Springer Press, New York, 2011. [3] BioMEMS and Biomaterials for...Medical Applications Biomaterials Science: An Integrated Clinical and Engineering Approach, edited by Yitzhak Rosen and Noel Elman, CRC Press, Boca

  14. Graphene ``microdrums'' on a freestanding perforated thin membrane for high sensitivity MEMS pressure sensors

    Science.gov (United States)

    Wang, Qiugu; Hong, Wei; Dong, Liang

    2016-03-01

    We present a microelectromechanical system (MEMS) graphene-based pressure sensor realized by transferring a large area, few-layered graphene on a suspended silicon nitride thin membrane perforated by a periodic array of micro-through-holes. Each through-hole is covered by a circular drum-like graphene layer, namely a graphene ``microdrum''. The uniqueness of the sensor design is the fact that introducing the through-hole arrays into the supporting nitride membrane allows generating an increased strain in the graphene membrane over the through-hole array by local deformations of the holes under an applied differential pressure. Further reasons contributing to the increased strain in the devised sensitive membrane include larger deflection of the membrane than that of its imperforated counterpart membrane, and direct bulging of the graphene microdrum under an applied pressure. Electromechanical measurements show a gauge factor of 4.4 for the graphene membrane and a sensitivity of 2.8 × 10-5 mbar-1 for the pressure sensor with a good linearity over a wide pressure range. The present sensor outperforms most existing MEMS-based small footprint pressure sensors using graphene, silicon, and carbon nanotubes as sensitive materials, due to the high sensitivity.

  15. Mechanical characterization of poly-SiGe layers for CMOS–MEMS integrated application

    International Nuclear Information System (INIS)

    Modlinski, Robert; Witvrouw, Ann; Verbist, Agnes; De Wolf, Ingrid; Puers, Robert

    2010-01-01

    Measuring mechanical properties at the microscale is essential to understand and to fabricate reliable MEMS. In this paper a tensile testing system and matching microscale test samples are presented. The test samples have a dog-bone-like structure. They are designed to mimic standard macro-tensile test samples. The micro-tensile tests are used to characterize 0.9 µm thick polycrystalline silicon germanium (poly-SiGe) films. The poly-SiGe film, that can be considered as a close equivalent to polycrystalline silicon (poly-Si), is studied as a very promising material for use in CMOS/MEMS integration in a single chip due to its low-temperature LPCVD deposition (T < 450 °C). The fabrication process of the poly-SiGe micro-tensile test structure is explained in detail: the design, the processing and post-processing, the testing and finally the results' discussion. The poly-SiGe micro-tensile results are also compared with nanoindentation data obtained on the same poly-SiGe films as well as with results obtained by other research groups

  16. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    Directory of Open Access Journals (Sweden)

    Zhuhao Gong

    2018-02-01

    Full Text Available A radio-frequency micro-electro-mechanical system (RF MEMS wafer-level packaging (WLP method using pre-patterned benzo-cyclo-butene (BCB polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to generate the housing cavity, the BCB sealing ring was protected by a sputtered Cr/Au (chromium/gold layer. The average measured thickness of the BCB layer was 5.9 μm. In contrast to the conventional methods of spin-coating BCB after fabricating cavities, the pre-patterned BCB method presented BCB bonding layers with better quality on severe topography surfaces in terms of increased uniformity of thickness and better surface flatness. The observation of the bonded layer showed that no void or gap formed on the protruding coplanar waveguide (CPW lines. A shear strength test was experimentally implemented as a function of the BCB widths in the range of 100–400 μm. The average shear strength of the packaged device was higher than 21.58 MPa. A RF MEMS switch was successfully packaged using this process with a negligible impact on the microwave characteristics and a significant improvement in the lifetime from below 10 million to over 1 billion. The measured insertion loss of the packaged RF MEMS switch was 0.779 dB and the insertion loss deterioration caused by the package structure was less than 0.2 dB at 30 GHz.

  17. Characterization of dielectric charging in RF MEMS

    NARCIS (Netherlands)

    Herfst, R.W.; Huizing, H.G.A.; Steeneken, P.G.; Schmitz, Jurriaan

    2005-01-01

    Capacitive RF MEMS switches show great promise for use in wireless communication devices such as mobile phones, but the successful application of these switches is hindered by the reliability of the devices: charge injection in the dielectric layer (SiN) can cause irreversible stiction of the moving

  18. Characterization of piezoelectric polymer composites for MEMS ...

    Indian Academy of Sciences (India)

    Abstract. Composite piezoelectric ceramics are important materials for transducer applications in medical diag- nostic devices and MEMS devices. In micrometer scale the material properties of piezopolymers or piezoceramics do not coincide with that of bulk materials. The present work is aimed at simulating the material ...

  19. From MEMS to NEMS : Scaling Cantilever Sensors

    NARCIS (Netherlands)

    Yang, C.K.

    2012-01-01

    This thesis studies the effects of scaling on the characterisation and readout of micro-electro mechanical systems (MEMS) to nano-electro mechanical systems (NEMS). In particular it focuses on cantilever, which is a basic device building block and an important transducer in many sensing

  20. Bullet Design of MEMS Cantilever - Hand Calculation

    Directory of Open Access Journals (Sweden)

    Abhijeet V. KSHIRSAGAR

    2008-04-01

    Full Text Available The present article describes the basic hand calculations for design of MEMS cantilever for beginners. The MATLAB software code was written to analysis the all formulae. Further the article gives insight of important parameters, its dependence and consideration for a good design.

  1. Fractal Structures For Mems Variable Capacitors

    KAUST Repository

    Elshurafa, Amro M.

    2014-08-28

    In accordance with the present disclosure, one embodiment of a fractal variable capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure, wherein the capacitor body has an upper first metal plate with a fractal shape separated by a vertical distance from a lower first metal plate with a complementary fractal shape; and a substrate above which the capacitor body is suspended.

  2. Novel RF-MEMS capacitive switching structures

    NARCIS (Netherlands)

    Rottenberg, X.; Jansen, Henricus V.; Fiorini, P.; De Raedt, W.; Tilmans, H.A.C.

    2002-01-01

    This paper reports on novel RF-MEMS capacitive switching devices implementing an electrically floating metal layer covering the dielectric to ensure intimate contact with the bridge in the down state. This results in an optimal switch down capacitance and allows optimisation of the down/up

  3. Review on the Modeling of Electrostatic MEMS

    Science.gov (United States)

    Chuang, Wan-Chun; Lee, Hsin-Li; Chang, Pei-Zen; Hu, Yuh-Chung

    2010-01-01

    Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analysis complex and complicated. This article introduces the physical model of pull-in voltage, dynamic characteristic analysis, air damping effect, reliability, numerical modeling method, and application of electrostatic-driven MEMS devices. PMID:22219707

  4. MEMS Piezoresistive Pressure Sensor: A Survey

    OpenAIRE

    Shwetha Meti; Kirankumar B. Balavald; B. G. Sheeparmatti

    2016-01-01

    Piezoresistive pressure sensors are one of the very first products of MEMS technology, and are used in various fields like automotive industries, aerospace, biomedical applications, and household appliances. Amongst various transduction principles of pressure sensor piezoresistive transduction mechanism is widely used. Over a decade therehas been tremendous improvement in the development of the design of piezoresistive pressure sensor starting with the invention of piezoresistance...

  5. MEMS deformable mirror CubeSat testbed

    Science.gov (United States)

    Cahoy, Kerri L.; Marinan, Anne D.; Novak, Benjamin; Kerr, Caitlin; Nguyen, Tam; Webber, Matthew; Falkenburg, Grant; Barg, Andrew; Berry, Kristen; Carlton, Ashley; Belikov, Ruslan; Bendek, Eduardo A.

    2013-09-01

    To meet the high contrast requirement of 1 × 10-10to image an Earth-like planet around a Sun-like star, space telescopes equipped with coronagraphs require wavefront control systems. Deformable mirrors are a key element of these systems that correct for optical imperfections, thermal distortions, and diffraction that would otherwise corrupt the wavefront and ruin the contrast. However, high-actuator-count MEMS deformable mirrors have yet to fly in space long enough to characterize their on-orbit performance and reduce risk by developing and operating their supporting systems. The goal of the MEMS Deformable Mirror CubeSat Testbed is to develop a CubeSat-scale demonstration of MEMS deformable mirror and wavefront sensing technology. In this paper, we consider two approaches for a MEMS deformable mirror technology demonstration payload that will fit within the mass, power, and volume constraints of a CubeSat: 1) a Michelson interferometer and 2) a Shack-Hartmann wavefront sensor. We clarify the constraints on the payload based on the resources required for supporting CubeSat subsystems drawn from subsystems that we have developed for a different CubeSat flight project. We discuss results from payload lab prototypes and their utility in defining mission requirements.

  6. Synthesis of Bioactive Three-dimensional Silicon-oxide Nanofibrous Structures on the Silicon Substrate for Bionic Devices’ Fabrication

    Directory of Open Access Journals (Sweden)

    Candace Colpitts

    2016-02-01

    Full Text Available Bionic devices are implants that replace biological functions that have been lost due to damaged or lost tissue. The challenge of this area is to find the appropriate materials to match the biocompatible criteria with the same mechanical and electrical performance. In this research, a new method is introduced for the enhance‐ ment of silicon biocompatibility by fabrication of a 3D nanofibrous layer on the silicon surface, induced by nanosecond laser pulses at a high repetition rate and power. It was found that the laser treatment with small‐ er line spacing and a higher overlap number enhanced the biocompatibility of silicon. The results display a promis‐ ing improvement in the biocompatibility of silicon for the production of biomedical devices such as sensors, bio- MEMS and nano-biomaterial fabrications.

  7. Microstructure factor and mechanical and electronic properties of hydrogenated amorphous and nanocrystalline silicon thin-films for microelectromechanical systems applications

    International Nuclear Information System (INIS)

    Mouro, J.; Gualdino, A.; Chu, V.; Conde, J. P.

    2013-01-01

    Thin-film silicon allows the fabrication of MEMS devices at low processing temperatures, compatible with monolithic integration in advanced electronic circuits, on large-area, low-cost, and flexible substrates. The most relevant thin-film properties for applications as MEMS structural layers are the deposition rate, electrical conductivity, and mechanical stress. In this work, n + -type doped hydrogenated amorphous and nanocrystalline silicon thin-films were deposited by RF-PECVD, and the influence of the hydrogen dilution in the reactive mixture, the RF-power coupled to the plasma, the substrate temperature, and the deposition pressure on the structural, electrical, and mechanical properties of the films was studied. Three different types of silicon films were identified, corresponding to three internal structures: (i) porous amorphous silicon, deposited at high rates and presenting tensile mechanical stress and low electrical conductivity, (ii) dense amorphous silicon, deposited at intermediate rates and presenting compressive mechanical stress and higher values of electrical conductivity, and (iii) nanocrystalline silicon, deposited at very low rates and presenting the highest compressive mechanical stress and electrical conductivity. These results show the combinations of electromechanical material properties available in silicon thin-films and thus allow the optimized selection of a thin silicon film for a given MEMS application. Four representative silicon thin-films were chosen to be used as structural material of electrostatically actuated MEMS microresonators fabricated by surface micromachining. The effect of the mechanical stress of the structural layer was observed to have a great impact on the device resonance frequency, quality factor, and actuation force

  8. Materials, design and processing of air encapsulated MEMS packaging

    Science.gov (United States)

    Fritz, Nathan T.

    integrity. The development of mechanical models complimented the experimental studies. A model of the overcoat materials used the film properties and elastic deformations to study the stress-strain behavior of the suspended dielectric films under external forces. The experimental molding tests and mechanical models were used to establish processing conditions and physical designs for the cavities as a function of cavity size. A novel, metal-free chip package was investigated combining the in-situ thermal decomposition of the sacrificial material during post-mold curing of the lead frame molding compound. Sacrificial materials were characterized for their degree of decomposition during the molding cure to provide a chip package with improved mechanical support and no size restrictions. Improvements to the air cavities for MEMS packaging led to investigations and refinements of other microfabrication processes. The sacrificial polycarbonate materials were shown to be useful as temporary bonding materials for wafer-level bonding. The release temperature and conditions of the processed wafer can be changed based on the polycarbonates formulation. The electroless deposition of metal was investigated as an alternative process for metalizing the air cavities. The deposition of silver and copper using a Sn/Ag catalyst as a replacement for costly palladium activation was demonstrated. The electroless deposition was tested on polymer and silicon dioxide surfaces for organic boards and through-silicon vias.

  9. Homogeneity analysis of high yield manufacturing process of mems-based pzt thick film vibrational energy harvesters

    DEFF Research Database (Denmark)

    Lei, Anders; Xu, Ruichao; Pedersen, C.M.

    2011-01-01

    This work presents a high yield wafer scale fabrication of MEMS-based unimorph silicon/PZT thick film vibrational energy harvesters aimed towards vibration sources with peak frequencies in the range of a few hundred Hz. By combining KOH etching with mechanical front side protection, SOI wafer...... to accurately define the thickness of the silicon part of the harvester and a silicon compatible PZT thick film screen-printing technique, we are able to fabricate energy harvesters on wafer scale with a yield higher than 90%. The characterization of the fabricated harvesters is focused towards the full wafer....../mass-production aspect; hence the analysis of uniformity in harvested power and resonant frequency....

  10. MEMS Actuators for Improved Performance and Durability

    Science.gov (United States)

    Yearsley, James M.

    Micro-ElectroMechanical Systems (MEMS) devices take advantage of force-scaling at length scales smaller than a millimeter to sense and interact with directly with phenomena and targets at the microscale. MEMS sensors found in everyday devices like cell-phones and cars include accelerometers, gyros, pressure sensors, and magnetic sensors. MEMS actuators generally serve more application specific roles including micro- and nano-tweezers used for single cell manipulation, optical switching and alignment components, and micro combustion engines for high energy density power generation. MEMS rotary motors are actuators that translate an electric drive signal into rotational motion and can serve as rate calibration inputs for gyros, stages for optical components, mixing devices for micro-fluidics, etc. Existing rotary micromotors suffer from friction and wear issues that affect lifetime and performance. Attempts to alleviate friction effects include surface treatment, magnetic and electrostatic levitation, pressurized gas bearings, and micro-ball bearings. The present work demonstrates a droplet based liquid bearing supporting a rotary micromotor that improves the operating characteristics of MEMS rotary motors. The liquid bearing provides wear-free, low-friction, passive alignment between the rotor and stator. Droplets are positioned relative to the rotor and stator through patterned superhydrophobic and hydrophilic surface coatings. The liquid bearing consists of a central droplet that acts as the motor shaft, providing axial alignment between rotor and stator, and satellite droplets, analogous to ball-bearings, that provide tip and tilt stable operation. The liquid bearing friction performance is characterized through measurement of the rotational drag coefficient and minimum starting torque due to stiction and geometric effects. Bearing operational performance is further characterized by modeling and measuring stiffness, environmental survivability, and high

  11. Silicon induces minimal thromboinflammatory response during 28-day intravascular implant testing

    Science.gov (United States)

    Melvin, Melissa E.; Fissell, William H; Roy, Shuvo; Brown, David L

    2015-01-01

    Microelectromechanical systems (MEMS) are used to machine miniaturized implantable medical devices. Our group has used MEMS technology to develop hemofiltration membranes for use in renal replacement therapy which possess enhanced selectivity and permeability. The use of silicon in blood-contacting environments may be limited, however, due to contact activation of the coagulation cascade by silicon which form the surface oxides in atmospheric conditions. As well, reports of long-term biocompatibility of blood-contacting silicon devices are lacking. The aims of this pilot study were: 1) to develop a model for investigating the effects of intravascular implants and 2) to characterize the degree of thrombosis and tissue inflammation incited by prolonged implantation of silicon materials. Silicon implants with and without polyethylene glycol (PEG) coatings were surgically implanted transluminally through rat femoral veins. Gore-Tex and stainless steel implants served as controls. Implants were left in vivo for four weeks. All femoral veins remained patent. Veins associated with silicon implants exhibited rare thrombi and occasional mild perivascular inflammation. In contrast, Gore-Tex and stainless steel controls caused moderate vein thrombosis and provoked a moderate to marked cellular infiltrate. Under scanning electron microscopy, bare silicon implants were found to have significant adherent microthrombi, while PEG-treated implants showed no evidence of thrombi. PEG-treated silicon appears to be biocompatible and holds potential as an excellent material with which to construct an implantable, miniaturized hemofiltration membrane. PMID:20431483

  12. Genetic Assessment of the Space Environment using MEMS Technologies

    Science.gov (United States)

    Jana, Dilip; Saint Jean, Dileon; Abdurakhimov, Siyovush; Kopparthy, Varun; Nestorova, Gergana; Pal, Nabamita; Nguyen, Nam; Derosa, Pedro; Sawyer, Lee; Crews, Niel; Decoster, Mark; Louisiana Tech University Team

    For decades, researchers have studied the damage to DNA by high-energy radiation. Radiation induced damage include DNA strand breaks, base damage and base substitution. Currently, though, scientists are discovering that it is, in fact, the non-irradiated cells adjacent to the irradiated cells are the primary source of carcinogenesis. To address these ``bystander effects'', we developed a radiation detector using multi-clad scintillating fibers and silicon pixel arrays to study the effect of radiation on gene expression changes using Microelectromechanical systems (MEMS) technology. The efficiency of proton energy deposition on each of the different layers of the radiation tracking detector has been simulated using GEANT4 toolkit and tested experimentally using the detector. The position of the proton beam was determined from the intensity of the output signal from orthogonal planes of the tracking detector. We have developed and tested an instrument that automates the extraction and quantification of RNA from living cells that automates the collection, purification, and reverse transcription (RT) of RNA from a precisely-defined area of the biological sample. NASA EPSCOR GRANT 13-EPSCoR-0027.

  13. An Integrated Thermal Compensation System for MEMS Inertial Sensors

    Directory of Open Access Journals (Sweden)

    Sheng-Ren Chiu

    2014-03-01

    Full Text Available An active thermal compensation system for a low temperature-bias-drift (TBD MEMS-based gyroscope is proposed in this study. First, a micro-gyroscope is fabricated by a high-aspect-ratio silicon-on-glass (SOG process and vacuum packaged by glass frit bonding. Moreover, a drive/readout ASIC, implemented by the 0.25 µm 1P5M standard CMOS process, is designed and integrated with the gyroscope by directly wire bonding. Then, since the temperature effect is one of the critical issues in the high performance gyroscope applications, the temperature-dependent characteristics of the micro-gyroscope are discussed. Furthermore, to compensate the TBD of the micro-gyroscope, a thermal compensation system is proposed and integrated in the aforementioned ASIC to actively tune the parameters in the digital trimming mechanism, which is designed in the readout ASIC. Finally, some experimental results demonstrate that the TBD of the micro-gyroscope can be compensated effectively by the proposed compensation system.

  14. Design and fabrication of a micro parallel mechanism system using MEMS technologies

    Science.gov (United States)

    Chin, Chi-Te

    A parallel mechanism is seen as an attractive method of fabricating a multi-degree of freedom micro-stage on a chip. The research team at Arizona State University has experience with several potential parallel mechanisms that would be scaled down to micron dimensions and fabricated by using the silicon process. The researcher developed a micro parallel mechanism that allows for planar motion having two translational motions and one rotational motion (e.g., x, y, theta). The mask design shown in Appendix B is an example of a planar parallel mechanism, however, this design would only have a few discrete positions given the nature of the fully extended or fully retracted electrostatic motor. The researcher proposes using a rotary motor (comb-drive actuator with gear chain system) coupled to a rack and pinion for finer increments of linear motion. The rotary motor can behave as a stepper motor by counting drive pulses, which is the basis for a simple open loop control system. This system was manufactured at the Central Regional MEMS Research Center (CMEMS), National Tsing-Hua University, and supported by the National Science Council, Taiwan. After the microstructures had been generated, the proceeding devices were released and an experiment study was performed to demonstrate the feasibility of the proposed micro-stage devices. In this dissertation, the micro electromechanical system (MEMS) fabrication technologies were introduced. The development of this parallel mechanism system will initially focus on development of a planar micro-stage. The design of the micro-stage will build on the parallel mechanism technology, which has been developed for manufacturing, assembly, and flight simulator applications. Parallel mechanism will give the maximum operating envelope with a minimum number of silicon levels. The ideally proposed mechanism should comprise of a user interface, a micro-stage and a non-silicon tool, which is difficult to accomplish by current MEMS technology

  15. Silicon Qubits

    Energy Technology Data Exchange (ETDEWEB)

    Ladd, Thaddeus D. [HRL Laboratories, LLC, Malibu, CA (United States); Carroll, Malcolm S. [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2018-02-28

    Silicon is a promising material candidate for qubits due to the combination of worldwide infrastructure in silicon microelectronics fabrication and the capability to drastically reduce decohering noise channels via chemical purification and isotopic enhancement. However, a variety of challenges in fabrication, control, and measurement leaves unclear the best strategy for fully realizing this material’s future potential. In this article, we survey three basic qubit types: those based on substitutional donors, on metal-oxide-semiconductor (MOS) structures, and on Si/SiGe heterostructures. We also discuss the multiple schema used to define and control Si qubits, which may exploit the manipulation and detection of a single electron charge, the state of a single electron spin, or the collective states of multiple spins. Far from being comprehensive, this article provides a brief orientation to the rapidly evolving field of silicon qubit technology and is intended as an approachable entry point for a researcher new to this field.

  16. MEMS for Tunable Photonic Metamaterial Applications

    Science.gov (United States)

    Stark, Thomas

    Photonic metamaterials are materials whose optical properties are derived from artificially-structured sub-wavelength unit cells, rather than from the bulk properties of the constituent materials. Examples of metamaterials include plasmonic materials, negative index materials, and electromagnetic cloaks. While advances in simulation tools and nanofabrication methods have allowed this field to grow over the past several decades, many challenges still exist. This thesis addresses two of these challenges: fabrication of photonic metamaterials with tunable responses and high-throughput nanofabrication methods for these materials. The design, fabrication, and optical characterization of a microelectromechanical systems (MEMS) tunable plasmonic spectrometer are presented. An array of holes in a gold film, with plasmon resonance in the mid-infrared, is suspended above a gold reflector, forming a Fabry-Perot interferometer of tunable length. The spectra exhibit the convolution of extraordinary optical transmission through the holes and Fabry-Perot resonances. Using MEMS, the interferometer length is modulated from 1.7 mum to 21.67 mum , thereby tuning the free spectral range from about 2900 wavenumbers to 230.7 wavenumbers and shifting the reflection minima and maxima across the infrared. Due to its broad spectral tunability in the fingerprint region of the mid-infrared, this device shows promise as a tunable biological sensing device. To address the issue of high-throughput, high-resolution fabrication of optical metamaterials, atomic calligraphy, a MEMS-based dynamic stencil lithography technique for resist-free fabrication of photonic metamaterials on unconventional substrates, has been developed. The MEMS consists of a moveable stencil, which can be actuated with nanometer precision using electrostatic comb drive actuators. A fabrication method and flip chip method have been developed, enabling evaporation of metals through the device handle for fabrication on an

  17. Failure and fracture of thin film materials for MEMS

    Science.gov (United States)

    Jonnalagadda, Krishna Nagasai

    silicon was responsible for the large scatter in the effective fracture toughness. Grain boundaries were found to be tougher by as much as 50% with respect to the smallest fracture toughness values for in-grain crack tips, which was almost the same as the smallest toughness values for single crystal silicon {100}. Similarly, the mixed mode I/II fracture experiments on polysilicon pointed out to a monotonic increase of the mode II stress intensity factor with respect to the pre-crack angle. However, the mode I stress intensity factor varied dramatically with the location of the crack tip. Pre-cracks terminated at grain boundaries provided the maximum resistance to crack initiation. On the other hand, the normalized stress intensity factors for amorphous diamond-like carbon (ta-C) films agreed fairly well with theoretical LEFM criteria for crack initiation. Systematic mode I fracture experiments with four different ta-C film thicknesses (0.5-3.0 mum), combined with numerical analysis, showed that boundary force measurements from fracture experiments that do not account for the bending moments due to film stress gradients result in the miscalculation of the true stress intensity factor, which scales with the thickness-to-radius of curvature ratio of the film. In terms of metallic films, the mechanical behavior of Pt and Au films was investigated by a full-field strain measurement method that employed optical microscopy and digital image correlation analysis. By virtue of this method accurate measurements of strain and stress were obtained from freestanding films loaded at strain rates between 10-6 to 10-1 s-1. The accuracy of the method was established by the Au and Pt Young's moduli that were invariant with strain rate and equal to 67+/-2.7 GPa and 181+/-8 GPa, respectively. Furthermore, the inelastic properties of Au were found to be five times more rate sensitive at strain rates lower than 10-4 s-1. The elastic limit, a key parameter in the design of MEMS, decreased by 45

  18. Commercial-Off-The-Shelf Microelectromechanical Systems (MEMS) Flow-Measurement Probes Fabricated And Assembled

    Science.gov (United States)

    Redding, Chip

    2002-01-01

    As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at the NASA Glenn Research Center have been fabricating packaging components and assembling a set of unique probes using commercial-off-the-shelf microelectromechanical systems (MEMS) integrated circuits (computer chips). Using MEMS as an alternative has some compelling advantages over standard measurement devices. Sensor technologies have matured through high-production usage in industries such as automotive and aircraft manufacturers. Currently, MEMS are the choice in applications such as tire pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Conventional instrumentation uses tubing buried in the model aerodynamic surfaces or wind tunnel walls. The measurements are made when pressure is introduced at the tube opening. The pressure then must travel the tubing for lengths ranging from 20 to hundreds of feet before reaching an electronic signal conditioner. This condition causes a considerable amount of damping and requires measurements to be made only after the test rig has reached steady-state operation. The electronic MEMS pressure sensor is able to take readings continuously under dynamic states in nearly real time. The use of stainless steel tubing for pressure measurements requires many tubes to be cleaned, cut to length, carefully installed, and delicately deburred and spliced for use. A cluster of a few hundred 1/16-in.- (0.0625-in.-) diameter tubes (not uncommon in research testing facilities) can be several inches in diameter and may weigh enough to require two men to handle. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of the 1/16-in. tubing with room to spare. The P592 piezoresistive silicon pressure sensor (Lucas NovaSensor, Fremont, CA) was chosen for this project because of its cost, availability, and tolerance to extreme ambient

  19. A high thermal resistance MEMS-based Pirani vacuum sensor chip

    Science.gov (United States)

    Dams, Florian; Schreiner, Rupert

    2013-05-01

    The performance of thermal conductivity vacuum gauges can be improved by a well-designed geometry. The lower measurement range limit is determined by the size of the active sensing area and the thermal conduction heat losses through the supporting structures. The upper measurement range is limited by the distance between the heated element and the cold reference plane. Silicon based MEMS-technology gives the possibility to fabricate both sensing structures with suitable areas out of low thermal conductive materials and narrow gaps in order to extend the measurement range in both directions. In this work we present a MEMS-process to fabricate high thermal resistance sensor structures. The rectangular sensitive areas are anchored by four beams and are structured out of low thermal conductive PECVD-siliconnitride films with 1 µm in thickness. The metallic heating structure is completely embedded in the SiN-layer. Both sensitive area and its support beams were released from the silicon bulk material by anisotropic underetching. In this way a free-supporting structure with a gap of 150 μm to the silicon substrate was formed. The influence of the filament geometry and temperature was systematically investigated to determine the properties of the chips as thermal conductivity vacuum gauges. The temperature of the sensitive area was held constant by a self-balancing bridge circuit and the heating power was measured by a Δ-Σ-ADC. The average solid state thermal conductivity is in the order of 106WK1. The measuring range of the most sensitive structures covers 8 orders of magnitude from 105 mbar to 1000mbar.

  20. DLC nano-dot surfaces for tribological applications in MEMS devices

    International Nuclear Information System (INIS)

    Singh, R. Arvind; Na, Kyounghwan; Yi, Jin Woo; Lee, Kwang-Ryeol; Yoon, Eui-Sung

    2011-01-01

    With the invention of miniaturized devices like micro-electro-mechanical systems (MEMS), tribological studies at micro/nano-scale have gained importance. These studies are directed towards understanding the interactions between surfaces at micro/nano-scales, under relative motion. In MEMS devices, the critical forces, namely adhesion and friction restrict the smooth operation of the elements that are in relative motion. These miniaturized devices are traditionally made from silicon (Si), whose tribological properties are not good. In this paper, we present a short investigation of nano- and micro-tribological properties of diamond-like carbon (DLC) nano-dot surfaces. The investigation was undertaken to evaluate the potential of these surfaces for their possible application to the miniaturized devices. The tribological evaluation of the DLC nano-dot surfaces was done in comparison with bare Si (1 0 0) surfaces and DLC coated silicon surfaces. A commercial atomic force microscope (AFM) was used to measure adhesion and friction properties of the test materials at the nano-scale, whereas a custom-built micro-tribotester was used to measure their micro-friction property. Results showed that the DLC nano-dot surfaces exhibited superior tribological properties with the lowest values of adhesion force, and friction force both at the nano- and micro-scales, when compared to the bare Si (1 0 0) surfaces and DLC coated silicon surfaces. In addition, the DLC nano-dot surfaces showed no observable wear at the micro-scale, unlike the other two test materials. The superior tribological performance of the DLC nano-dot surfaces is attributed to their hydrophobic nature and the reduced area of contact projected by them.

  1. Investigation on the Quality Factor Limit of the (111 Silicon Based Disk Resonator

    Directory of Open Access Journals (Sweden)

    Xin Zhou

    2018-01-01

    Full Text Available Quality factor is one of the most important parameters for a MEMS resonator. Most MEMS resonators are dominated by thermoelastic dissipation (TED. This paper demonstrates that the TED in a disk resonator that is made of (111 single-crystal silicon is surpassed by clamping loss. The stiffness-mass decoupling design method, combined with reducing the beam width, was used to engineer high QTED. Experiments show that Q of the (111 disk resonator have an upper boundary that is determined by the clamping loss caused by the unbalanced out-of-plane displacement. The origin of the out-of-plane displacement is explained by theory and simulation.

  2. Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

    Directory of Open Access Journals (Sweden)

    Azrul Azlan Hamzah

    2008-11-01

    Full Text Available This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer level after fabrication. A MEMSTech 50g capacitive accelerometer was used to demonstrate a sputtered encapsulation technique. Encapsulation with a very uniform surface profile was achieved using spin-on glass (SOG as a sacrificial layer, SU-8 as base layer, RF sputtered silicon as main structural layer, eutectic gold-silicon as seal layer, and liquid crystal polymer (LCP as outer encapsulant layer. SEM inspection and capacitance test indicated that the movable elements were released after encapsulation. Nanoindentation test confirmed that the encapsulated device is sufficiently robust to withstand a transfer molding process. Thus, an encapsulation technique that is robust, CMOS compatible, and economical has been successfully developed for packaging isolatable MEMS devices at the wafer level.

  3. Electroplating of low stress permalloy for MEMS

    International Nuclear Information System (INIS)

    Zhang Yonghua; Ding Guifu; Cai Yuli; Wang Hong; Cai Bingchu

    2006-01-01

    With the wafer-bending method and spectrophotometry, the internal stress in electroplated Ni-Fe alloy for MEMS has been investigated as a function of bath concentration. This investigation demonstrated that low concentration plating solution is useful for the decrease of the residual stress in the electrodeposits, and the stress could further decrease with an increase of saccharin additive content. And the change of stress from tensile to compressive was not observed with the increase of the additive content in plating path. The low stress permalloy (Ni 81 Fe 19 ) was reached in our experimental conditions. A bistable electromagnetic RF MEMS switch with deformation-free bilayer cantilever beam was fabricated successfully by electroplated permalloy

  4. MEMS wireless temperature sensor for combustion studies

    Science.gov (United States)

    Lee, Minhyeok; Kawahara, Yoshihiro; Morimoto, Kenichi; Suzuki, Yuji

    2014-11-01

    A MEMS wireless wall temperature sensor for combustion studies is proposed. Electrical resistance change in a LCR circuit is used to measure the temperature through inductive coupling the sensor coil and the read-out coil. Equivalent circuit model and 3-D electromagnetic simulation are employed to design sensor configuration. The resonant frequency is increased with increasing the resistance due to the temperature increase. The prototype sensor was successfully fabricated with MEMS technologies. The impedance phase angle shows a sharp dip at the resonant frequency, which is in good accordance with the equivalent circuit model. The measured temperature sensitivity is found to be as high as 6 kHz/K, when the distance between the read-out and the sensor coils is 0.71 mm.

  5. MEMS Packaging - Current Issues and Approaches

    Energy Technology Data Exchange (ETDEWEB)

    DRESSENDORFER,PAUL V.; PETERSON,DAVID W.; REBER,CATHLEEN ANN

    2000-01-19

    The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, unique process schedules, hermetic sealing in controlled environments (including vacuum), and other special constraints. These constraints force changes in the techniques used to separate die on a wafer, in the types of packages which can be used in the assembly processes and materials, and in the sealing environment and process. This paper discusses a number of these issues and provides information on approaches being taken or proposed to address them.

  6. Giant Piezoelectricity on Si for Hyperactive MEMS

    Science.gov (United States)

    Baek, S. H.; Park, J.; Kim, D. M.; Aksyuk, V. A.; Das, R. R.; Bu, S. D.; Felker, D. A.; Lettieri, J.; Vaithyanathan, V.; Bharadwaja, S. S. N.; Bassiri-Gharb, N.; Chen, Y. B.; Sun, H. P.; Folkman, C. M.; Jang, H. W.; Kreft, D. J.; Streiffer, S. K.; Ramesh, R.; Pan, X. Q.; Trolier-McKinstry, S.; Schlom, D. G.; Rzchowski, M. S.; Blick, R. H.; Eom, C. B.

    2011-11-01

    Microelectromechanical systems (MEMS) incorporating active piezoelectric layers offer integrated actuation, sensing, and transduction. The broad implementation of such active MEMS has long been constrained by the inability to integrate materials with giant piezoelectric response, such as Pb(Mg1/3Nb2/3)O3-PbTiO3 (PMN-PT). We synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of an epitaxial (001) SrTiO3 template layer with superior piezoelectric coefficients (e31,f = -27 ± 3 coulombs per square meter) and figures of merit for piezoelectric energy-harvesting systems. We have incorporated these heterostructures into microcantilevers that are actuated with extremely low drive voltage due to thin-film piezoelectric properties that rival bulk PMN-PT single crystals. These epitaxial heterostructures exhibit very large electromechanical coupling for ultrasound medical imaging, microfluidic control, mechanical sensing, and energy harvesting.

  7. Image Registration for Stability Testing of MEMS

    Science.gov (United States)

    Memarsadeghi, Nargess; LeMoigne, Jacqueline; Blake, Peter N.; Morey, Peter A.; Landsman, Wayne B.; Chambers, Victor J.; Moseley, Samuel H.

    2011-01-01

    Image registration, or alignment of two or more images covering the same scenes or objects, is of great interest in many disciplines such as remote sensing, medical imaging. astronomy, and computer vision. In this paper, we introduce a new application of image registration algorithms. We demonstrate how through a wavelet based image registration algorithm, engineers can evaluate stability of Micro-Electro-Mechanical Systems (MEMS). In particular, we applied image registration algorithms to assess alignment stability of the MicroShutters Subsystem (MSS) of the Near Infrared Spectrograph (NIRSpec) instrument of the James Webb Space Telescope (JWST). This work introduces a new methodology for evaluating stability of MEMS devices to engineers as well as a new application of image registration algorithms to computer scientists.

  8. MEMS Gyroscopes Based on Acoustic Sagnac Effect

    Directory of Open Access Journals (Sweden)

    Yuanyuan Yu

    2016-12-01

    Full Text Available This paper reports on the design, fabrication and preliminary test results of a novel microelectromechanical systems (MEMS device—the acoustic gyroscope. The unique operating mechanism is based on the “acoustic version” of the Sagnac effect in fiber-optic gyros. The device measures the phase difference between two sound waves traveling in opposite directions, and correlates the signal to the angular velocity of the hosting frame. As sound travels significantly slower than light and develops a larger phase change within the same path length, the acoustic gyro can potentially outperform fiber-optic gyros in sensitivity and form factor. It also promises superior stability compared to vibratory MEMS gyros as the design contains no moving parts and is largely insensitive to mechanical stress or temperature. We have carried out systematic simulations and experiments, and developed a series of processes and design rules to implement the device.

  9. Giant piezoelectricity on Si for hyperactive MEMS.

    Science.gov (United States)

    Baek, S H; Park, J; Kim, D M; Aksyuk, V A; Das, R R; Bu, S D; Felker, D A; Lettieri, J; Vaithyanathan, V; Bharadwaja, S S N; Bassiri-Gharb, N; Chen, Y B; Sun, H P; Folkman, C M; Jang, H W; Kreft, D J; Streiffer, S K; Ramesh, R; Pan, X Q; Trolier-McKinstry, S; Schlom, D G; Rzchowski, M S; Blick, R H; Eom, C B

    2011-11-18

    Microelectromechanical systems (MEMS) incorporating active piezoelectric layers offer integrated actuation, sensing, and transduction. The broad implementation of such active MEMS has long been constrained by the inability to integrate materials with giant piezoelectric response, such as Pb(Mg(1/3)Nb(2/3))O(3)-PbTiO(3) (PMN-PT). We synthesized high-quality PMN-PT epitaxial thin films on vicinal (001) Si wafers with the use of an epitaxial (001) SrTiO(3) template layer with superior piezoelectric coefficients (e(31,f) = -27 ± 3 coulombs per square meter) and figures of merit for piezoelectric energy-harvesting systems. We have incorporated these heterostructures into microcantilevers that are actuated with extremely low drive voltage due to thin-film piezoelectric properties that rival bulk PMN-PT single crystals. These epitaxial heterostructures exhibit very large electromechanical coupling for ultrasound medical imaging, microfluidic control, mechanical sensing, and energy harvesting.

  10. Active mems microbeam device for gas detection

    KAUST Repository

    Bouchaala, Adam M.

    2017-10-05

    Sensors and active switches for applications in gas detection and other fields are described. The devices are based on the softening and hardening nonlinear response behaviors of microelectromechanical systems (MEMS) clamped-clamped microbeams. In that context, embodiments of gas-triggered MEMS microbeam sensors and switches are described. The microbeam devices can be coated with a Metal-Organic Framework to achieve high sensitivity. For gas sensing, an amplitude-based tracking algorithm can be used to quantify an amount of gas captured by the devices according to frequency shift. Noise analysis is also conducted according to the embodiments, which shows that the microbeam devices have high stability against thermal noise. The microbeam devices are also suitable for the generation of binary sensing information for alarming, for example.

  11. Investigating ESD sensitivity in electrostatic SiGe MEMS

    International Nuclear Information System (INIS)

    Sangameswaran, Sandeep; De Coster, Jeroen; Linten, Dimitri; Scholz, Mirko; Thijs, Steven; Groeseneken, Guido; De Wolf, Ingrid

    2010-01-01

    The sensitivity of electrostatically actuated SiGe microelectromechanical systems to electrostatic discharge events has been investigated in this paper. Torsional micromirrors and RF microelectromechanical systems (MEMS) actuators have been used as two case studies to perform this study. On-wafer electrostatic discharge (ESD) measurement methods, such as the human body model (HBM) and machine model (MM), are discussed. The impact of HBM ESD zap tests on the functionality and behavior of MEMS is explained and the ESD failure levels of MEMS have been verified by failure analysis. It is demonstrated that electrostatic MEMS devices have a high sensitivity to ESD and that it is essential to protect them.

  12. Review on the Modeling of Electrostatic MEMS

    Directory of Open Access Journals (Sweden)

    Wan-Chun Chuang

    2010-06-01

    Full Text Available Electrostatic-driven microelectromechanical systems devices, in most cases, consist of couplings of such energy domains as electromechanics, optical electricity, thermoelectricity, and electromagnetism. Their nonlinear working state makes their analysis complex and complicated. This article introduces the physical model of pull-in voltage, dynamic characteristic analysis, air damping effect, reliability, numerical modeling method, and application of electrostatic-driven MEMS devices.

  13. Different grades MEMS accelerometers error characteristics

    Science.gov (United States)

    Pachwicewicz, M.; Weremczuk, J.

    2017-08-01

    The paper presents calibration effects of two different MEMS accelerometers of different price and quality grades and discusses different accelerometers errors types. The calibration for error determining is provided by reference centrifugal measurements. The design and measurement errors of the centrifuge are discussed as well. It is shown that error characteristics of the sensors are very different and it is not possible to use simple calibration methods presented in the literature in both cases.

  14. Thermoelectrical Generator for a MEMS-Fuze

    OpenAIRE

    A. K. Efremov; K. V. Vlasov

    2015-01-01

    The structure of modern fuzes includes micro-electromechanical systems (MEMS), which have such advanced devices as micro-accelerometers and micro-switches, being triggered at a specified level of setback. Independent power source (PS), as an inherent part of the MEMSfuze, charges an energy storage unit during the shot and triggers the fuze firing circuit when the shell encounters the target. Operating level of the control signal should be achieved within the time of remote arming, determined ...

  15. Fractal Structures For Fixed Mems Capacitors

    KAUST Repository

    Elshurafa, Amro M.

    2014-08-28

    An embodiment of a fractal fixed capacitor comprises a capacitor body in a microelectromechanical system (MEMS) structure. The capacitor body has a first plate with a fractal shape separated by a horizontal distance from a second plate with a fractal shape. The first plate and the second plate are within the same plane. Such a fractal fixed capacitor further comprises a substrate above which the capacitor body is positioned.

  16. Solid polymer MEMS-based fuel cells

    Science.gov (United States)

    Jankowski, Alan F [Livermore, CA; Morse, Jeffrey D [Pleasant Hill, CA

    2008-04-22

    A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. The electrolyte layer can consist of either a solid oxide or solid polymer material, or proton exchange membrane electrolyte materials may be used. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells.

  17. The challenge of reliability in MEMS commercialization

    Energy Technology Data Exchange (ETDEWEB)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.

    1998-09-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost-effective solutions only if MEMS is demonstrated to be sufficiently reliable. This could prove to be a major challenge if it is not addressed concurrently with technology development. There are three requirements for a valid assessment of reliability: statistical significance, identification of fundamental failure mechanisms and development of techniques for accelerating them, and valid physical models to allow prediction of failures during actual use. While these already exist for the microelectronics portion of such integrated systems, the real challenge lies in the less well-understood micromachine portions and its synergistic effects with microelectronics. This requires the elicitation of a methodology focused on MEMS reliability, which the authors discuss. A new testing and analysis infrastructure must also be developed to meet the needs of this methodology. They describe their implementation of this infrastructure and its success in addressing the three requirements for a valid reliability assessment.

  18. An Opto-MEMS Multiobject Spectrograph

    Science.gov (United States)

    Kearney, K.; Ninkov, Z.; Zwarg, D.

    2000-05-01

    Optical MEMS (Micro-Electro-Mechanical-Structures) are an enabling technology for a new class of optical instrumentation designs. An opto-MEMS device consists of an array of microfabricated structures, each of which modulates the phase and/or amplitude of an incident light beam. Typically the devices consist of an array of moveable micromirrors - each of which reflects an incident beam in a unique direction (tilt), or with a unique phase shift (piston). One widely available opto-MEMS device is the Texas Instruments' Digital Micromirror Device (DMD). The DMD is an array of 16 micron x 16 micron square mirrors postioned on a 17 micron pitch. Each mirror can tilt +/- 10 degrees from the normal - reflecting a normally incident light beam +/- 20 degrees. By positioning the DMD in an intermediate image plane in an optical system, portions of the image can be directed into- or out-of the input pupil of the follow-on imaging optics. RIT is utilizing the DMD to construct a prototype multiobject spectrograph (RIT-MOS) for visible observations with terrestrial telescopes. The DMD array replaces the input slit of an imaging spectrograph, forming a 'virtual', programmable slit assembly. By acquiring a pre-image of the astronomical field, it is possible to select a multidude of objects, and to program the DMD to pass only those objects into the input optics of the imaging spectrograph. We will report on the design and characterizatotion of the RIT-MOS, as well as preliminary imaging results.

  19. Heterogeneous MEMS device assembly and integration

    Science.gov (United States)

    Topart, Patrice; Picard, Francis; Ilias, Samir; Alain, Christine; Chevalier, Claude; Fisette, Bruno; Paultre, Jacques E.; Généreux, Francis; Legros, Mathieu; Lepage, Jean-François; Laverdière, Christian; Ngo Phong, Linh; Caron, Jean-Sol; Desroches, Yan

    2014-03-01

    In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the microassembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs with a less than 50 micron pixel co-registration is reported.

  20. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Lal, A.; Bilbao Y Leon, R.M.; Guo, H.; Li, H.; Santanam, S.; Yao, R.; Blanchard, J.; Henderson, D.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include alpha and low-energy beta emitters. The sources are in both solid and liquid form, and a technique for plating a solid source from a liquid source has been investigated. Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. Performance results are provided for each of these concepts. (authors)

  1. MEMS and the direct detection of exoplanets

    Science.gov (United States)

    Thomas, Sandrine J.; Macintosh, Bruce; Belikov, Ruslan

    2014-03-01

    Deformable mirrors, and particularly MEMS, are crucial components for the direct imaging of exoplanets for both ground-based and space-based instruments. Without deformable mirrors, coronagraphs are incapable of reaching contrasts required to image Jupiter-like planets. The system performance is limited by image quality degradation resulting from wavefront error introduced from multiple effects including: atmospheric turbulence, static aberrations in the system, non-common-path aberrations, all of which vary with time. Correcting for these effects requires a deformable mirror with fast response and numerous actuators having moderate stroke. Not only do MEMS devices fulfill this requirement but their compactness permits their application in numerous space- and ground-based instruments, which are often volume- and mass-limited. In this paper, I will briefly explain how coronagraphs work and their requirements. I then will discuss the Extreme Adaptive Optics needed to compensate for the introduced wavefront error and how MEMS devices are a good choice to achieve the performance needed to produce the contrasts necessary to detect exoplanets. As examples, I will discuss a facility instrument for the Gemini Observatory, called the Gemini Planet Imager, that will detect Jupiter-like planets and present recent results from the NASA Ames Coronagraph Experiment laboratory, in the context of a proposed space- based mission called EXCEDE. EXCEDE is planned to focus on protoplanetary disks.

  2. Macroporous silicon for high-capacitance devices using metal electrodes.

    Science.gov (United States)

    Vega, Didac; Reina, Jordi; Martí, Ferran; Pavón, Ramón; Rodríguez, Angel

    2014-01-01

    In this paper, high-capacity energy storage devices based on macroporous silicon are demonstrated. Small footprint devices with large specific capacitances up to 100 nF/mm(2), and an absolute capacitance above 15 μF, have been successfully fabricated using standard microelectronics and MEMS techniques. The fabricated devices are suitable for high-density system integration. The use of 3-D silicon structures allows achieving a large surface to volume ratio. The macroporous silicon structures are fabricated by electrochemical etching of silicon. This technique allows creating large structures of tubes with either straight or modulated radial profiles in depth. Furthermore, a very large aspect ratio is possible with this fabrication method. Macroporous silicon grown this way permits well-controlled structure definition with excellent repeatability and surface quality. Additionally, structure geometry can be accurately controlled to meet designer specifications. Macroporous silicon is used as one of the electrodes over which a silicon dioxide insulating layer is grown. Several insulator thicknesses have been tested. The second capacitor electrode is a solid nickel filling of the pores prepared by electroplating in a low-temperature industry standard process. The use of high-conductivity materials allows reaching small equivalent series resistance near 1 Ω. Thanks to these improvements, the presented devices are capable of operating up to 10 kHz. 84.32.Tt; 81.15.Pq; 81.05.Rm.

  3. Energy Harvesting Using Screen Printed PZT on Silicon

    DEFF Research Database (Denmark)

    Lei, Anders

    The objective of the work presented in this Ph.D. thesis is to design and fabricate a miniaturised vibration energy harvester based on screen printed PZT thick film and silicon MEMS processing technology. The vision of the vibration energy harvester is to eliminate the need for batteries...... by harvesting energy on-site from a vibration source, thereby enabling fully autonomous wireless sensor systems. The vibration harvester is a resonator consisting of a silicon support cantilever with screen printed PZT thick film on top and with an integrated proof mass at the cantilever tip. To achieve....... The final fabrication process features a sequence with screen printing of the PZT thick film at an early stage and cantilever definition by etching at a later stage. Screen printing PZT on a full thickness silicon wafer enables efficient use of a high pressure treatment process with improved performance...

  4. Tribo-functionalizing Si and SU8 materials by surface modification for application in MEMS/NEMS actuator-based devices

    International Nuclear Information System (INIS)

    Singh, R A; Satyanarayana, N; Sinha, S K; Kustandi, T S

    2011-01-01

    Micro/nano-electro-mechanical-systems (MEMS/NEMS) are miniaturized devices built at micro/nanoscales. At these scales, the surface/interfacial forces are extremely strong and they adversely affect the smooth operation and the useful operating lifetimes of such devices. When these forces manifest in severe forms, they lead to material removal and thereby reduce the wear durability of the devices. In this paper, we present a simple, yet robust, two-step surface modification method to significantly enhance the tribological performance of MEMS/NEMS materials. The two-step method involves oxygen plasma treatment of polymeric films and the application of a nanolubricant, namely perfluoropolyether. We apply the two-step method to the two most important MEMS/NEMS structural materials, namely silicon and SU8 polymer. On applying surface modification to these materials, their initial coefficient of friction reduces by ∼4-7 times and the steady-state coefficient of friction reduces by ∼2.5-3.5 times. Simultaneously, the wear durability of both the materials increases by >1000 times. The two-step method is time effective as each of the steps takes the time duration of approximately 1 min. It is also cost effective as the oxygen plasma treatment is a part of the MEMS/NEMS fabrication process. The two-step method can be readily and easily integrated into MEMS/NEMS fabrication processes. It is anticipated that this method will work for any kind of structural material from which MEMS/NEMS are or can be made.

  5. Aluminum Nitride Micro-Channels Grown via Metal Organic Vapor Phase Epitaxy for MEMs Applications

    Energy Technology Data Exchange (ETDEWEB)

    Rodak, L.E.; Kuchibhatla, S.; Famouri, P.; Ting, L.; Korakakis, D.

    2008-01-01

    Aluminum nitride (AlN) is a promising material for a number of applications due to its temperature and chemical stability. Furthermore, AlN maintains its piezoelectric properties at higher temperatures than more commonly used materials, such as Lead Zirconate Titanate (PZT) [1, 2], making AlN attractive for high temperature micro and nanoelectromechanical (MEMs and NEMs) applications including, but not limited to, high temperature sensors and actuators, micro-channels for fuel cell applications, and micromechanical resonators. This work presents a novel AlN micro-channel fabrication technique using Metal Organic Vapor Phase Epitaxy (MOVPE). AlN easily nucleates on dielectric surfaces due to the large sticking coefficient and short diffusion length of the aluminum species resulting in a high quality polycrystalline growth on typical mask materials, such as silicon dioxide and silicon nitride [3,4]. The fabrication process introduced involves partially masking a substrate with a silicon dioxide striped pattern and then growing AlN via MOVPE simultaneously on the dielectric mask and exposed substrate. A buffered oxide etch is then used to remove the underlying silicon dioxide and leave a free standing AlN micro-channel. The width of the channel has been varied from 5 ìm to 110 ìm and the height of the air gap from 130 nm to 800 nm indicating the stability of the structure. Furthermore, this versatile process has been performed on (111) silicon, c-plane sapphire, and gallium nitride epilayers on sapphire substrates. Reflection High Energy Electron Diffraction (RHEED), Atomic Force Microscopy (AFM), and Raman measurements have been taken on channels grown on each substrate and indicate that the substrate is influencing the growth of the AlN micro-channels on the SiO2 sacrificial layer.

  6. Buffering Implications for the Design Space of Streaming MEMS Storage

    NARCIS (Netherlands)

    Khatib, M.G.; Abelmann, Leon; Preas, Kathy

    2011-01-01

    Emerging nanotechnology-based systems encounter new non-functional requirements. This work addresses MEMS storage, an emerging technology that promises ultrahigh density and energy-efficient storage devices. We study the buffering requirement of MEMS storage in streaming applications. We show that

  7. Shutdown Policies for MEMS-Based Storage Devices -- Analytical Models

    NARCIS (Netherlands)

    Khatib, M.G.; Engelen, Johannes Bernardus Charles; Hartel, Pieter H.

    MEMS-based storage devices should be energy ecient for deployment in mobile systems. Since MEMS-based storage devices have a moving me- dia sled, they should be shut down during periods of inactivity. However, shutdown costs energy, limiting the applicability of aggressive shutdown decisions. The

  8. Development and application of high-end aerospace MEMS

    Science.gov (United States)

    Yuan, Weizheng

    2017-12-01

    This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.

  9. Lubricated MEMS: effect of boundary slippage and texturing

    NARCIS (Netherlands)

    Tauviqirrahman, Mohammad

    2013-01-01

    Many types of micro-electro-mechanical-system (MEMS) based products are currently employed in a variety of applications. Recently, there has been an increase in the demand for higher reliability of MEMS which incorporate moving parts for each intended application. This is because the reliability of

  10. LTCC phase shifter modules for RF-MEMS-switch integration

    NARCIS (Netherlands)

    Bartnitzek, T.; Muller, E.; Dijk, R. van

    2005-01-01

    The European 1ST project ARHMS is covering a wide field of R&D activities with the final goal: a satellite based car communication system with a fiat electronically steerable roof antenna based on RF-MEMS. The required phase shift for beam steering will be done with MEMS switches and RF networks. An

  11. Nonlinear Adaptive Filter for MEMS Gyro Error Cancellation

    Data.gov (United States)

    National Aeronautics and Space Administration — Thermal biases are the dominate error in low-cost low-power small MEMS gyros. CubeSats often can't afford the power/mass to put a heater on their MEMS gyros and...

  12. Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

    Directory of Open Access Journals (Sweden)

    Di Chen

    2007-05-01

    Full Text Available Electrostatic micro-electro-mechanical system (MEMS is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

  13. RF-MEMS capacitive switches with high reliability

    Science.gov (United States)

    Goldsmith, Charles L.; Auciello, Orlando H.; Carlisle, John A.; Sampath, Suresh; Sumant, Anirudha V.; Carpick, Robert W.; Hwang, James; Mancini, Derrick C.; Gudeman, Chris

    2013-09-03

    A reliable long life RF-MEMS capacitive switch is provided with a dielectric layer comprising a "fast discharge diamond dielectric layer" and enabling rapid switch recovery, dielectric layer charging and discharging that is efficient and effective to enable RF-MEMS switch operation to greater than or equal to 100 billion cycles.

  14. Integrated optical MEMS using through-wafer vias and bump-bonding.

    Energy Technology Data Exchange (ETDEWEB)

    McCormick, Frederick Bossert; Frederick, Scott K.

    2008-01-01

    This LDRD began as a three year program to integrate through-wafer vias, micro-mirrors and control electronics with high-voltage capability to yield a 64 by 64 array of individually controllable micro-mirrors on 125 or 250 micron pitch with piston, tip and tilt movement. The effort was a mix of R&D and application. Care was taken to create SUMMiT{trademark} (Sandia's ultraplanar, multilevel MEMS technology) compatible via and mirror processes, and the ultimate goal was to mate this MEMS fabrication product to a complementary metal-oxide semiconductor (CMOS) electronics substrate. Significant progress was made on the via and mirror fabrication and design, the attach process development as well as the electronics high voltage (30 volt) and control designs. After approximately 22 months, the program was ready to proceed with fabrication and integration of the electronics, final mirror array, and through wafer vias to create a high resolution OMEMS array with individual mirror electronic control. At this point, however, mission alignment and budget constraints reduced the last year program funding and redirected the program to help support the through-silicon via work in the Hyper-Temporal Sensors (HTS) Grand Challenge (GC) LDRD. Several months of investigation and discussion with the HTS team resulted in a revised plan for the remaining 10 months of the program. We planned to build a capability in finer-pitched via fabrication on thinned substrates along with metallization schemes and bonding techniques for very large arrays of high density interconnects (up to 2000 x 2000 vias). Through this program, Sandia was able to build capability in several different conductive through wafer via processes using internal and external resources, MEMS mirror design and fabrication, various bonding techniques for arrayed substrates, and arrayed electronics control design with high voltage capability.

  15. Structural health monitoring MEMS sensors using elasticity-based beam vibrations

    Science.gov (United States)

    Plankis, Alivia

    The worsening problem of aging and deficient infrastructure in this nation and across the world has demonstrated the need for an improved system to monitor and maintain these structures. The field of structural health monitoring has grown in recent years to address this issue. The goal of this field is to continually monitor the condition of a structure to detect and mitigate damage that may occur. Many structural health monitoring methods have been developed and most of these require sensor systems to collect the necessary information to assess the current strength and integrity of a structure. The motivation for this thesis is a proposed new microelectromechanical systems (MEMS) sensor with applications in civil infrastructure sensing. The work required was to determine accurate estimates of the resonant frequencies for a fixed-fixed silicon bridge within the device so that further testing and development could proceed. Additional knowledge and information were essential, though, before these requested calculations could be performed confidently. First, a thorough review of current structural health monitoring concepts and methods was performed to better understand the field in which this device would be applied and what incentive existed to develop a new sensor. Second, an in-depth investigation of vibrational beam mechanics theories was completed to ensure the accuracy of the frequency results for the new MEMS sensor. This study analyzed the influence of three assumptions employed in the Euler-Bernoulli, Rayleigh, and Timoshenko beam theories by comparing their results to a three-dimensional, elasticity-based approximation for vibrational frequencies and mode shapes. The results of this study showed that all three theories are insufficient when a fixed support is involved, so the elasticity-based approximation was utilized to calculate the frequencies for the bridge component in the MEMS device. These results have been passed on to the developers so that the

  16. Temperature dependency of silicon structures for magnetic field gradient sensing

    Science.gov (United States)

    Dabsch, Alexander; Rosenberg, Christoph; Stifter, Michael; Keplinger, Franz

    2018-02-01

    This work describes the temperature dependence of two sensors for magnetic field gradient sensors and demonstrates a structure to compensate for the drift of resonance frequency over a wide temperature range. The temperature effect of the sensing element is based on internal stresses induced by the thermal expansion of material, therefore FEM is used to determine the change of the eigenvalues of the sensing structure. The experimental setup utilizes a Helmholtz coil system to generate the magnetic field and to excite the MEMS structure with Lorentz forces. The MEMS structure is placed on a plate heated with resistors and cooled by a Peltier element to control the plate temperature. In the second part, we describe how one can exploit temperature sensitivity for temperature measurements and we show the opportunity to include the temperature effect to increase the sensitivity of single-crystal silicon made flux density gradient sensors.

  17. MEMS fiber-optic Fabry-Perot pressure sensor for high temperature application

    Science.gov (United States)

    Fang, G. C.; Jia, P. G.; Cao, Q.; Xiong, J. J.

    2016-10-01

    We design and demonstrate a fiber-optic Fabry-Perot pressure sensor (FOFPPS) for high-temperature sensing by employing micro-electro-mechanical system (MEMS) technology. The FOFPPS is fabricated by anodically bonding the silicon wafer and the Pyrex glass together and fixing the facet of the optical fiber in parallel with the silicon surface by glass frit and organic adhesive. The silicon wafer can be reduced through dry etching technology to construct the sensitive diaphragm. The length of the cavity changes with the deformation of the diaphragm due to the loaded pressure, which leads to a wavelength shift of the interference spectrum. The pressure can be gauged by measuring the wavelength shift. The pressure experimental results show that the sensor has linear pressure sensitivities ranging from 0 kPa to 600 kPa at temperature range between 20°C to 300°C. The pressure sensitivity at 300°C is approximately 27.63 pm/kPa. The pressure sensitivities gradually decrease with increasing the temperature. The sensor also has a linear thermal drift when temperature changes from 20°C - 300°C.

  18. MEMS fabrication and frequency sweep for suspending beam and plate electrode in electrostatic capacitor

    Science.gov (United States)

    Zhu, Jianxiong; Song, Weixing

    2018-01-01

    We report a MEMS fabrication and frequency sweep for a high-order mode suspending beam and plate layer in electrostatic micro-gap semiconductor capacitor. This suspended beam and plate was designed with silicon oxide (SiO2) film which was fabricated using bulk silicon micromachining technology on both side of a silicon substrate. The designed semiconductor capacitors were driven by a bias direct current (DC) and a sweep frequency alternative current (AC) in a room temperature for an electrical response test. Finite element calculating software was used to evaluate the deformation mode around its high-order response frequency. Compared a single capacitor with a high-order response frequency (0.42 MHz) and a 1 × 2 array parallel capacitor, we found that the 1 × 2 array parallel capacitor had a broader high-order response range. And it concluded that a DC bias voltage can be used to modulate a high-order response frequency for both a single and 1 × 2 array parallel capacitors.

  19. Deep SiO2 etching with Al and AlN masks for MEMS devices

    Science.gov (United States)

    Bliznetsov, Vladimir; Mao Lin, Hua; Zhang, Yue Jia; Johnson, David

    2015-08-01

    Silicon oxide-based materials such as quartz and silica are widely used in microelectromechanical systems (MEMS). One way to enhance the capability of their deep plasma etching is to increase selectivity by the use of hard masks. Although this approach was studied previously, information on the use of hard masks for the etching of silicon-oxide based materials on 200 mm substrates is scarce. We present the results of etching process development for amorphous silicon oxide using Al and AlN masks with a view of the application of the results for the etching of silica and quartz. Three gas chemistries (C4F8/O2, CF4 and SF6) and their mixtures were compared in an industrial reactive ion etch (RIE) chamber with two plasma sources. It was established that pure SF6 is the best etchant and AlN is a better mask than Al for providing higher selectivity and a sidewall angle close to vertical. A range of etching parameters for micromasking-free etching was established and etched structures of up to a 4 : 1 aspect ratio were created in 21 μm-thick oxide using the process with an etch rate of 0.32-0.36 μm min-1 and a selectivity to AlN mask of (38-49) : 1.

  20. Real-time analysis for Stochastic errors of MEMS gyro

    Science.gov (United States)

    Miao, Zhiyong; Shi, Hongyang; Zhang, Yi

    2017-10-01

    Since a good knowledge of MEMS gyro stochastic errors is important and critical to MEMS INS/GPS integration system. Therefore, the stochastic errors of MEMS gyro should be accurately modeled and identified. The Allan variance method is IEEE standard method in the filed of analysis stochastic errors of gyro. This kind of method can fully characterize the random character of stochastic errors. However, it requires a large amount of data to be stored, resulting in large offline computational burden. Moreover, it has a painful procedure of drawing slope lines for estimation. To overcome the barriers, a simple linear state-space model was established for MEMS gyro. Then, a recursive EM algorithm was implemented to estimate the stochastic errors of MEMS gyro in real time. The experimental results of ADIS16405 IMU show that the real-time estimations of proposed approach are well within the error limits of Allan variance method. Moreover, the proposed method effectively avoids the storage of data.

  1. Using MEMS Capacitive Switches in Tunable RF Amplifiers

    Directory of Open Access Journals (Sweden)

    Danson John

    2006-01-01

    Full Text Available A MEMS capacitive switch suitable for use in tunable RF amplifiers is described. A MEMS switch is designed, fabricated, and characterized with physical and RF measurements for inclusion in simulations. Using the MEMS switch models, a dual-band low-noise amplifier (LNA operating at GHz and GHz, and a tunable power amplifier (PA at GHz are simulated in m CMOS. MEMS switches allow the LNA to operate with 11 dB of isolation between the two bands while maintaining dB of gain and sub- dB noise figure. MEMS switches are used to implement a variable matching network that allows the PA to realize up to 37% PAE improvement at low input powers.

  2. MEMS-Based Piezoelectric/Electrostatic Inchworm Actuator

    Science.gov (United States)

    Yang, Eui-Hyeok

    2003-01-01

    A proposed inchworm actuator, to be designed and fabricated according to the principles of microelectromechanical systems (MEMS), would effect linear motion characterized by steps as small as nanometers and an overall range of travel of hundreds of microns. Potential applications for actuators like this one include precise positioning of optical components and active suppression of noise and vibration in scientific instruments, conveyance of wafers in the semiconductor industry, precise positioning for machine tools, and positioning and actuation of micro-surgical instruments. The inchworm motion would be generated by a combination of piezoelectric driving and electrostatic clamping. The actuator (see figure), would include a pair of holders (used for electrostatic clamping), a slider (the part that would engage in the desired linear motion), a driver, a piezoelectric stack under the driver, and a pair of polymer beams centrally clamped to the flexure beam via a T bar. The holders would be held stationary. One end of the piezoelectric stack would be held stationary; the other end would be connected to the bottom of the driver, which would be free to move up and down. All of these components except the piezoelectric stack and the polymer beams would be micromachined from a 500- m-thick silicon wafer by deep reactive-ion etching. The inchworm motion would be perpendicular to the broad faces of the wafer (perpendicular to the plane of the figure). The combination of the polymer beams and the centrally clamped flexure beam would spring-bias the slider into a position such that, in the absence of electrostatic clamping, the gap between the slider on the one hand and both the driver and the holder on the other hand would be no more than a few microns. This arrangement would make it possible to electrostatically pull the slider into contact with either the holders or the driver at a clamping force of the order of 1 N by applying a reasonably small voltage (of the order of

  3. In situ MEMS testing: correlation of high-resolution X-ray diffraction with mechanical experiments and finite element analysis.

    Science.gov (United States)

    Schifferle, Andreas; Dommann, Alex; Neels, Antonia

    2017-01-01

    New methods are needed in microsystems technology for evaluating microelectromechanical systems (MEMS) because of their reduced size. The assessment and characterization of mechanical and structural relations of MEMS are essential to assure the long-term functioning of devices, and have a significant impact on design and fabrication. Within this study a concept for the investigation of mechanically loaded MEMS materials on an atomic level is introduced, combining high-resolution X-ray diffraction (HRXRD) measurements with finite element analysis (FEA) and mechanical testing. In situ HRXRD measurements were performed on tensile loaded single crystal silicon (SCSi) specimens by means of profile scans and reciprocal space mapping (RSM) on symmetrical (004) and (440) reflections. A comprehensive evaluation of the rather complex XRD patterns and features was enabled by the correlation of measured with simulated, 'theoretical' patterns. Latter were calculated by a specifically developed, simple and fast approach on the basis of continuum mechanical relations. Qualitative and quantitative analysis confirmed the admissibility and accuracy of the presented method. In this context [001] Poisson's ratio was determined providing an error of less than 1.5% with respect to analytical prediction. Consequently, the introduced procedure contributes to further going investigations of weak scattering being related to strain and defects in crystalline structures and therefore supports investigations on materials and devices failure mechanisms.

  4. Design of a MEMS piezoresistive differential pressure sensor with small thermal hysteresis for air data modules.

    Science.gov (United States)

    Song, Jin Woo; Lee, Jang-Sub; An, Jun-Eon; Park, Chan Gook

    2015-06-01

    The design, fabrication, and evaluation results of a MEMS piezoresistive differential pressure sensor fabricated by the dry etching process are described in this paper. The proposed sensor is designed to have optimal performances in mid-pressure range from 0 psi to 20 psi suitable for a precision air data module. The piezoresistors with a Wheatstone bridge structure are implanted where the thermal effects are minimized subject to sustainment of the sensitivity. The rectangular-shaped silicon diaphragm is adopted and its dimension is analyzed for improving pressure sensitivity and linearity. The bridge resistors are driven by constant current to compensate temperature effects on sensitivity. The designed differential pressure sensor is fabricated by using MEMS dry etching techniques, and the fabricated sensing element is attached and packaged in a Kovar package in consideration of leakage and temperature hysteresis. The implemented sensors are tested and evaluated as well. The evaluation results show the static RSS (root sum square) accuracy including nonlinearity, non-repeatability, and pressure hysteresis before temperature compensation is about 0.09%, and the total error band which includes the RSS accuracy, the thermal hysteresis, and other thermal effects is about 0.11%, which confirm the validity of the proposed design process.

  5. High-performance piezoresistive MEMS strain sensor with low thermal sensitivity.

    Science.gov (United States)

    Mohammed, Ahmed A S; Moussa, Walied A; Lou, Edmond

    2011-01-01

    This paper presents the experimental evaluation of a new piezoresistive MEMS strain sensor. Geometric characteristics of the sensor silicon carrier have been employed to improve the sensor sensitivity. Surface features or trenches have been introduced in the vicinity of the sensing elements. These features create stress concentration regions (SCRs) and as a result, the strain/stress field was altered. The improved sensing sensitivity compensated for the signal loss. The feasibility of this methodology was proved in a previous work using Finite Element Analysis (FEA). This paper provides the experimental part of the previous study. The experiments covered a temperature range from -50 °C to +50 °C. The MEMS sensors are fabricated using five different doping concentrations. FEA is also utilized to investigate the effect of material properties and layer thickness of the bonding adhesive on the sensor response. The experimental findings are compared to the simulation results to guide selection of bonding adhesive and installation procedure. Finally, FEA was used to analyze the effect of rotational/alignment errors.

  6. MEMS- and NEMS-based complex adaptive smart devices and systems

    Science.gov (United States)

    Varadan, Vijay K.

    2001-10-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with feature sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: 1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; 2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; 3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; 4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nanotubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems.

  7. Tailoring design and fabrication of capacitive RF MEMS switches for K-band applications

    Science.gov (United States)

    Quaranta, Fabio; Persano, Anna; Capoccia, Giovanni; Taurino, Antonietta; Cola, Adriano; Siciliano, Pietro; Lucibello, Andrea; Marcelli, Romolo; Proietti, Emanuela; Bagolini, Alvise; Margesin, Benno; Bellutti, Pierluigi; Iannacci, Jacopo

    2015-05-01

    Shunt capacitive radio-frequency microelectromechanical (RF MEMS) switches were modelled, fabricated and characterized in the K-band domain. Design allowed to predict the RF behaviour of the switches as a function of the bridge geometric parameters. The modelled switches were fabricated on silicon substrate, using a surface micromachining approach. In addition to the geometric parameters, the material structure in the bridge-actuator area was modified for switches fabricated on the same wafer, thanks to the removal/addition of two technological steps of crucial importance for RF MEMS switches performance, which are the use of the sacrificial layer and the deposition of a floating metal layer on the actuator. Surface profilometry analysis was used to check the material layer structure in the different regions of the bridge area as well as to investigate the mechanical behaviour of the moveable bridge under the application of a loaded force. The RF behaviour of all the fabricated switches was measured, observing the impact on the isolation of the manipulation of the bridge size and of the variations in the fabrication process.

  8. MEMS based monolithic Phased array using 3-bit Switched-line Phase Shifter

    Directory of Open Access Journals (Sweden)

    A. Karmakr

    2017-10-01

    Full Text Available This article details the design of an electronically scanning phased array antenna with proposed fabrication process steps. Structure is based upon RF micro-electromechanical system (MEMS technology. Capacitive type shunt switches have been implemented here to cater high frequency operation. The architecture, which is deigned at 30 GHz, consists of 3-bit (11.25º, 22.5º and 45º integrated Switched-line phase shifter and a linearly polarized microstrip patch antenna. Detailed design tricks of the Ka-band phase shifter is outlined here. The whole design is targeted for future monolithic integration. So, the substrate of choice is High Resistive Silicon (ρ > 8kΩ-cm, tan δ =0.01 and ϵr =11.8. The overall circuit occupies an cross-sectional area of 20 × 5 mm2. The simulated results show that the phase shifter can provide nearly 11.25º/22.5º/45º phase shifts and their combinations at the expense of 1dB average insertion loss at 30 GHz for eight combinations. Practical fabrication process flow using surface micromachining is proposed here. Critical dimensions of the phased array structure is governed by the deign rules of the standard CMOS/MEMS foundry.

  9. Modeling and optimal design of an optical MEMS tactile sensor for use in robotically assisted surgery

    Science.gov (United States)

    Ahmadi, Roozbeh; Kalantari, Masoud; Packirisamy, Muthukumaran; Dargahi, Javad

    2010-06-01

    Currently, Minimally Invasive Surgery (MIS) performs through keyhole incisions using commercially available robotic surgery systems. One of the most famous examples of these robotic surgery systems is the da Vinci surgical system. In the current robotic surgery systems like the da Vinci, surgeons are faced with problems such as lack of tactile feedback during the surgery. Therefore, providing a real-time tactile feedback from interaction between surgical instruments and tissue can help the surgeons to perform MIS more reliably. The present paper proposes an optical tactile sensor to measure the contact force between the bio-tissue and the surgical instrument. A model is proposed for simulating the interaction between a flexible membrane and bio-tissue based on the finite element methods. The tissue is considered as a hyperelastic material with the material properties similar to the heart tissue. The flexible membrane is assumed as a thin layer of silicon which can be microfabricated using the technology of Micro Electro Mechanical Systems (MEMS). The simulation results are used to optimize the geometric design parameters of a proposed MEMS tactile sensor for use in robotic surgical systems to perform MIS.

  10. A low-cost CMOS-MEMS piezoresistive accelerometer with large proof mass.

    Science.gov (United States)

    Khir, Mohd Haris Md; Qu, Peng; Qu, Hongwei

    2011-01-01

    This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS) substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.

  11. A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

    Directory of Open Access Journals (Sweden)

    Mohd Haris Md Khir

    2011-08-01

    Full Text Available This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive sensing material. A full Wheatstone bridge was constructed through easy wiring allowed by the three metal layers in the 0.5 μm CMOS technology. The device fabrication process consisted of a standard CMOS process for sensor configuration, and a deep reactive ion etching (DRIE based post-CMOS microfabrication for MEMS structure release. A bulk single-crystal silicon (SCS substrate is included in the proof mass to increase sensor sensitivity. In device design and analysis, the self heating of the polysilicon piezoresistors and its effect to the sensor performance is also discussed. With a low operating power of 1.5 mW, the accelerometer demonstrates a sensitivity of 0.077 mV/g prior to any amplification. Dynamic tests have been conducted with a high-end commercial calibrating accelerometer as reference.

  12. Parametrically excited MEMS vibration energy harvesters with design approaches to overcome the initiation threshold amplitude

    International Nuclear Information System (INIS)

    Jia, Yu; Yan, Jize; Soga, Kenichi; Seshia, Ashwin A

    2013-01-01

    Resonant-based vibration harvesters have conventionally relied upon accessing the fundamental mode of directly excited resonance to maximize the conversion efficiency of mechanical-to-electrical power transduction. This paper explores the use of parametric resonance, which unlike the former, the resonant-induced amplitude growth, is not limited by linear damping and wherein can potentially offer higher and broader nonlinear peaks. A numerical model has been constructed to demonstrate the potential improvements over the convention. Despite the promising potential, a damping-dependent initiation threshold amplitude has to be attained prior to accessing this alternative resonant phenomenon. Design approaches have been explored to passively reduce this initiation threshold. Furthermore, three representative MEMS designs were fabricated with both 25 and 10 μm thick device silicon. The devices include electrostatic cantilever-based harvesters, with and without the additional design modification to overcome initiation threshold amplitude. The optimum performance was recorded for the 25 μm thick threshold-aided MEMS prototype with device volume ∼0.147 mm 3 . When driven at 4.2 ms −2 , this prototype demonstrated a peak power output of 10.7 nW at the fundamental mode of resonance and 156 nW at the principal parametric resonance, as well as a 23-fold decrease in initiation threshold over the purely parametric prototype. An approximate doubling of the half-power bandwidth was also observed for the parametrically excited scenario. (paper)

  13. A nuclear micro battery for Mems devices

    International Nuclear Information System (INIS)

    Blanchard, J.; Lal, A.; Henderson, D.; Bilbao Y Leon, R.; Guo, H.; Li, H.; Santanam, S.; Yao, R.

    2001-01-01

    Micro-electromechanical Systems (MEMS) have not gained wide use because they lack the on-device power required by many important applications. Several forms of energy could be considered to supply this needed power (solar, fossil fuels, etc), but nuclear sources provide an intriguing option in terms of power density and lifetime. This paper describes several approaches for establishing the viability of nuclear sources for powering realistic MEMS devices. Isotopes currently being used include low-energy beta emitters (solid and liquid) and alpha emitters (solid). Several approaches are being explored for the production of MEMS power sources. The first concept is a junction-type battery. In this case, the charged particles emitted from the decay of the radioisotopes are absorbed by a semiconductor and dissipate most of their energy as ionization of the atoms in the solid. The carriers generated in this fashion are in excess of the number permitted by thermodynamic equilibrium and, if they diffuse to the vicinity of a rectifying junction, induce a voltage across the junction. The second concept involves a more direct use of the charged particles produced by the decay: the creation of a resonator by inducing movement due to attraction or repulsion resulting from the collection of charged particles. As the charge is collected, the deflection of a cantilever beam increases until it contacts a grounded element, thus discharging the beam and causing it to return to its original position. This process will repeat as long as the source is active. One final concept relies on temperature gradients produced by the sources, along with appropriate insulation, to create power using a Peltier device. The source is isolated in order to allow it to reach sufficient temperatures, and the temperature difference between the source and the rest of the device is exploited using the Peltier effect. Performance results will be provided for each of these concepts. (author)

  14. Preliminary Performance Evaluation of MEMS-based Piezoelectric Energy Harvesters in Extended Temperature Range

    DEFF Research Database (Denmark)

    Xu, R.; Borregaard, L.M.; Lei, A.

    2012-01-01

    In this work a batch of MEMS-based vibration energy harvesters consisting of a silicon/PZT thick film ntilever with integrated proof mass is characterized. The purpose of a vibration energy harvester is to convert low grade vibrations to useful electrical power. Optimally, the natural frequency...... of the harvester should match the frequency of he ambient vibration. The first step to achieve this is to evaluate the uniformity of the fabricated harvesters and nderstand the effects of temperature on the harvesters during operation. Therefore, the uniformity of 40 energy harvesters from one wafer has been...... evaluated. Thereafter the performance of the energy harvesters operating at emperatures between -30°C to 100°C was measured....

  15. Homogeneity Analysis of a MEMS-based PZT Thick Film Vibration Energy Harvester Manufacturing Process

    DEFF Research Database (Denmark)

    Lei, Anders; Xu, Ruichao; Borregaard, Louise M.

    2012-01-01

    This paper presents a homogeneity analysis of a high yield wafer scale fabrication of MEMS-based unimorph silicon/PZT thick film vibration energy harvesters aimed towards vibration sources with peak vibrations in the range of around 300Hz. A wafer with a yield of 91% (41/45 devices) has been...... indicating that the main variation in open circuit voltage performance is caused by varying quality factor. The average resonant frequency was measured to 333Hz with a standard variation of 9.8Hz and a harvesting bandwidth of 5-10Hz. A maximum power output of 39.3μW was achieved at 1g for the best performing...... harvester....

  16. MEMS-based optical mini- and microspectrometers for the visible and infrared spectral range

    Science.gov (United States)

    Wolffenbuttel, R. F.

    2005-07-01

    Miniaturized free-field based optical microspectrometers have huge potential for application in industry, science, medicine, agriculture and biology. State-of-the-art is the micro-assembly of micromachined optical components on a mini-bench and the trend is towards fully integrated optical microsystems. Complete silicon IC compatible MEMS-based opto-electrical microsystems on a single chip may offer huge cost benefits in these potentially high-volume applications. On-chip integration does, however, impose limitations. The required process compatibility and limited choice of acceptable materials does not necessarily give optimum optical performance. Also, the dimensional downscaling is not generally an optical advantage. This overview discusses grating-based and interferometer-based mini- and microspectrometers, shows performances already reported, the trends, the potential, the limitations and approaches to obtain a sufficient optical performance, in terms of spectral resolution and throughput, for serving the majority of applications.

  17. Design of narrow band photonic filter with compact MEMS for tunable resonant wavelength ranging 100 nm

    Directory of Open Access Journals (Sweden)

    Guanquan Liang

    2011-12-01

    Full Text Available A prototype of planar silicon photonic structure is designed and simulated to provide narrow resonant line-width (∼2 nm in a wide photonic band gap (∼210 nm with broad tunable resonant wavelength range (∼100 nm around the optical communication wavelength 1550 nm. This prototype is based on the combination of two modified basic photonic structures, i.e. a split tapered photonic crystal micro-cavity embedded in a photonic wire waveguide, and a slot waveguide with narrowed slabs. This prototype is then further integrated with a MEMS (microelectromechanical systems based electrostatic comb actuator to achieve “coarse tune” and “fine tune” at the same time for wide range and narrow-band filtering and modulating. It also provides a wide range tunability to achieve the designed resonance even fabrication imperfection occurs.

  18. Friction characteristics of the curved sidewall surfaces of a rotary MEMS device in oscillating motion

    International Nuclear Information System (INIS)

    Wu, Jie; Wang, Shao; Miao, Jianmin

    2009-01-01

    A MEMS device with a configuration similar to that of a micro-bearing was developed to study the friction behavior of the curved sidewall surfaces. This friction-testing device consists of two sets of actuators for normal motion and rotation, respectively. Friction measurements were performed at the curved sidewall surfaces of single-crystal silicon. Two general models were developed to determine the equivalent tangential stiffness of the bush-flexure assembly at the contact point by reducing a matrix equation to a one-dimensional formulation. With this simplification, the motions of the contacting surfaces were analyzed by using a recently developed quasi-static stick-slip model. The measurement results show that the coefficient of static friction exhibits a nonlinear dependence on the normal load. The true coefficient of static friction was determined by fitting the experimental friction curve

  19. Using MEMS mirrors to pattern electrical forces

    Science.gov (United States)

    Neale, Steven L.; Hsu, Hsan-Yin; Valley, Justin K.; Jamshidi, Arash; Wu, Ming C.

    2009-02-01

    By switching between two tilt angles MEMS mirrors can be used to produce spatial light patterns. This enables the Digital Micromirror Display (DMD, Texas Instruments) chip to produce the images found in some data projectors. In this paper we will show how these images can be converted into electrical patterns. We use the electrical gradients in these patterns to control the movement of particles through dielectrophoresis. We show how this can be used to move cells within PBS solution and characterize our device. We also discuss possible ways to improve our optical setup through Adaptive Optics (AO).

  20. MEMS-Reconfigurable Metamaterials and Antenna Applications

    Directory of Open Access Journals (Sweden)

    Tomislav Debogovic

    2014-01-01

    Full Text Available This paper reviews some of our contributions to reconfigurable metamaterials, where dynamic control is enabled by microelectromechanical systems (MEMS technology. First, we show reconfigurable composite right-/left-handed transmission lines (CRLH-TLs having state of the art phase velocity variation and loss, thereby enabling efficient reconfigurable phase shifters and leaky-wave antennas (LWA. Second, we present very low loss metasurface designs with reconfigurable reflection properties, applicable in reflectarrays and partially reflective surface (PRS antennas. All the presented devices have been fabricated and experimentally validated. They operate in X- and Ku-bands.

  1. Prospects for MEMS in the Automotive Industry

    Directory of Open Access Journals (Sweden)

    Richard DIXON

    2007-12-01

    Full Text Available An automotive sector as a growth market for MEMS sensors is analyzed in the article. The automotive sector accounted for $1.6 billion, making this the second biggest opportunity after IT peripherals and inkjet print heads. By 2011 the market will top $2.2 billion, a CAGR of around 7%. The main applications in revenues terms are, in order, pressure sensors, gyroscopes, accelerometers and flow sensors and this will remain so for the foreseeable future. Automotive companies are forced to innovate as a result of competition and price pressures.

  2. MEMS-BASED 3D CONFOCAL SCANNING MICROENDOSCOPE USING MEMS SCANNERS FOR BOTH LATERAL AND AXIAL SCAN.

    Science.gov (United States)

    Liu, Lin; Wang, Erkang; Zhang, Xiaoyang; Liang, Wenxuan; Li, Xingde; Xie, Huikai

    2014-08-15

    A fiber-optic 3D confocal scanning microendoscope employing MEMS scanners for both lateral and axial scan was designed and constructed. The MEMS 3D scan engine achieved a lateral scan range of over ± 26° with a 2D MEMS scanning micromirror and a depth scan of over 400 μm with a 1D MEMS tunable microlens. The lateral resolution and axial resolution of this system were experimentally measured as 1.0 μm and 7.0 μm, respectively. 2D and 3D confocal reflectance images of micro-patterns, micro-particles, onion skins and acute rat brain tissue were obtained by this MEMS-based 3D confocal scanning microendoscope.

  3. RF MEMS Based Tunable Bandpass Filter For X-Band Applications

    Science.gov (United States)

    Chaubey, Mahesh Kumar; Bhadauria, Avanish

    2018-03-01

    In this paper, we present the design and simulation of RF MEMS based Tunable combline band pass filters for X-band applications at different substrate thicknesses and studied the effect of thickness on tuning. The proposed filters are designed on high resistive silicon substrate of 500µm and 300 thicknesses. The tunability is achieved by using MEMS based varacter replaced with fix capacitor in conventional combline filter. First, the microstrip combline filter is designed at the centre frequency of 9.5 GHz and then tuning is achieved by varying the capacitance in the designed combline filters. The electromagnetic simulation has been carried out using HFSS v15 software based on finite element method (FEM). The tuning of the filter on silicon substrate of 500 μm is achieved by changing the capacitance value from 0.2035 pF to 0.4035 pF in the model in HFSS, which resulted the tuning in the frequency range of 7.85 to 10.35GHz. Insertion loss of design filter is in the range of 1dB within the tuning range. In case of substrate thickness 300 μm the tuning of the filter is achieved by changing the capacitance value from 0.293 pF to 0.403 pF in the model in HFSS, which resulted the tuning in the frequency range of 8.80 to 9.90 GHz. Insertion loss of design filter is in the range of ∼1.2dB within the tuning range.

  4. MEMS mass-spring-damper systems using an out-of-plane suspension scheme

    KAUST Repository

    Abdel Aziz, Ahmed Kamal Said

    2014-02-04

    MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

  5. Black silicon-based infrared radiation source

    Science.gov (United States)

    Anwar, Momen; Sabry, Yasser; Basset, Philippe; Marty, Frédéric; Bourouina, Tarik; Khalil, Diaa

    2016-03-01

    Micromachined infrared sources are enabling component for interferometric and spectroscopic sensors. Their compact size and low cost transform bulky instruments to the sensor scale, which is needed for a wide range of applications in the conventional and unconventional environments. The silicon micromachined sources should be engineered to have good emissivity across a large wavelength range because the intrinsic emissivity of silicon is low. This optimization was reported in literature by either the deposition of black metal at the surface of an emitter or the use of deep phonic crystal cavities, which complicates the fabrication technology and results in sharp dip lines in the spectral emissivity, respectively. In this work we report a micromachined infrared radiation source based on a heater on the top of black silicon structure for the first time in the literature, up to the authors' knowledge. The temperature of the device is characterized versus the applied voltage and the radiated spectrum is captured in the 1300 nm to 2500 nm spectral range; limited by the spectrum analysis instrument. The reported source opens the doors for completely integrated MEMS spectral sensors onchip.

  6. MEMS Integrated Submount Alignment for Optoelectronics

    Science.gov (United States)

    Shakespeare, W. Jeffrey; Pearson, Raymond A.; Grenestedt, Joachim L.; Hutapea, Parsaoran; Gupta, Vikas

    2005-02-01

    One of the most expensive and time-consuming production processes for single-mode fiber-optic components is the alignment of the photonic chip or waveguide to the fiber. The alignment equipment is capital intensive and usually requires trained technicians to achieve desired results. Current technology requires active alignment since tolerances are only ~0.2 μ m or less for a typical laser diode. This is accomplished using piezoelectric actuated stages and active optical feedback. Joining technologies such as soldering, epoxy bonding, or laser welding may contribute significant postbond shift, and final coupling efficiencies are often less than 80%. This paper presents a method of adaptive optical alignment to freeze in place directly on an optical submount using a microelectromechanical system (MEMS) shape memory alloy (SMA) actuation technology. Postbond shift is eliminated since the phase change is the alignment actuation. This technology is not limited to optical alignment but can be applied to a variety of MEMS actuations, including nano-actuation and nano-alignment for biomedical applications. Experimental proof-of-concept results are discussed, and a simple analytical model is proposed to predict the stress strain behavior of the optical submount. Optical coupling efficiencies and alignment times are compared with traditional processes. The feasibility of this technique in high-volume production is discussed.

  7. The Development of the Differential MEMS Vector Hydrophone.

    Science.gov (United States)

    Zhang, Guojun; Liu, Mengran; Shen, Nixin; Wang, Xubo; Zhang, Wendong

    2017-06-08

    To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and simulation analyses have been carried out. Lastly, a prototype of the differential MEMS vector hydrophone has been created and tested using a standing wave tube and a vibration platform. The results of the test show that this hydrophone has a high sensitivity, M v = -185 dB (@ 500 Hz, 0 dB reference 1 V/μPa), which is almost the same as the previous MEMS vector hydrophones, and has a low acceleration sensitivity, M v = -58 dB (0 dB reference 1 V/g), which has decreased by 17 dB compared with the previous MEMS vector hydrophone. The differential MEMS vector hydrophone basically meets the requirements of acoustic vector detection when it is rigidly fixed to a working platform, which lays the foundation for engineering applications of MEMS vector hydrophones.

  8. Shifting the Intertial Navigation Paradigm with the MEMS Technology

    Science.gov (United States)

    Crain, Timothy P., II; Bishop, Robert H.; Brady, Tye

    2010-01-01

    "Why don't you use MEMS?" is of the most common questions posed to navigation systems engineers designing inertial navigation solutions in the modern era. The question stems from a general understanding that great strides have been made in terrestrial MEMS accelerometers and attitude rate sensors in terms of accuracy, mass, and power. Yet, when compared on a unit-to-unit basis, MEMS devices do not provide comparable performance (accuracy) to navigation grade sensors in several key metrics. This paper will propose a paradigm shift where the comparison in performance is between multiple MEMS devices and a single navigation grade sensor. The concept is that systematically, a sufficient number of MEMS sensors may mathematically provide comparable performance to a single navigation grade device and be competitive in terms power and mass allocations when viewed on a systems level. The implication is that both inertial navigation system design and fault detection, identification, and recovery could benefit from a system of MEMS devices in the same way that swarm sensing has benefited Earth observation and astronomy. A survey of the state of the art in inertial sensor accuracy scaled by mass and power will be provided to show the scaled error in MEMS and navigation graded devices, a mathematical comparison of multi-unit to single-unit sensor errors will be developed, and preliminary application to an Orion lunar skip atmospheric entry trajectory will be explored.

  9. Shifting the Inertial Navigation Paradigm with MEMS Technology

    Science.gov (United States)

    Crain, Timothy; Brady, Tye; Bishop, Robert H.

    2010-01-01

    Why don t you use MEMS? is one of the most common questions posed to navigation systems engineers designing inertial navigation solutions in the modern era. The question stems from a general understanding that great strides have been made in terrestrial MEMS accelerometers and attitude rate sensors in terms of accuracy, mass, and power. Yet, when compared on a unit-to-unit basis, MEMS devices do not provide comparable performance (accuracy) to navigation grade sensors. This paper will propose a paradigm shift where the comparison in performance is between multiple MEMS devices and a single navigation grade sensor. The concept is that systematically, a sufficient number of MEMS sensors may mathematically provide comparable performance to a single navigation grade device and be competitive in terms power and mass allocations when viewed on a systems level. The implication is that both inertial navigation system design and fault detection, identification, and recovery could benefit from a system of MEMS devices in the same way that swarm sensing has benefited Earth observation and astronomy. A survey of the state of the art in inertial sensor accuracy scaled by mass and power will be provided to show the specific error in MEMS and navigation graded devices, a mathematical comparison of multi-unit to single-unit sensor errors will be developed, and preliminary applications to Constellation vehicles will be explored.

  10. Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors

    KAUST Repository

    Agrawal, Richa

    2015-05-18

    The rapid development in miniaturized electronic devices has led to an ever increasing demand for high-performance rechargeable micropower scources. Microsupercapacitors in particular have gained much attention in recent years owing to their ability to provide high pulse power while maintaining long cycle lives. Carbon microelectromechanical systems (C-MEMS) is a powerful approach to fabricate high aspect ratio carbon microelectrode arrays, which has been proved to hold great promise as a platform for energy storage. C-MEMS is a versatile technique to create carbon structures by pyrolyzing a patterned photoresist. Furthermore, different active materials can be loaded onto these microelectrode platforms for further enhancement of the electrochemical performance of the C-MEMS platform. In this article, different techniques and methods in order to enhance C-MEMS based various electrochemical capacitor systems have been discussed, including electrochemical activation of C-MEMS structures for miniaturized supercapacitor applications, integration of carbon nanostructures like carbon nanotubes onto C-MEMS structures and also integration of pseudocapacitive materials such as polypyrrole onto C-MEMS structures. © (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

  11. Progress of MEMS Scanning Micromirrors for Optical Bio-Imaging

    Directory of Open Access Journals (Sweden)

    Lih Y. Lin

    2015-11-01

    Full Text Available Microelectromechanical systems (MEMS have an unmatched ability to incorporate numerous functionalities into ultra-compact devices, and due to their versatility and miniaturization, MEMS have become an important cornerstone in biomedical and endoscopic imaging research. To incorporate MEMS into such applications, it is critical to understand underlying architectures involving choices in actuation mechanism, including the more common electrothermal, electrostatic, electromagnetic, and piezoelectric approaches, reviewed in this paper. Each has benefits and tradeoffs and is better suited for particular applications or imaging schemes due to achievable scan ranges, power requirements, speed, and size. Many of these characteristics are fabrication-process dependent, and this paper discusses various fabrication flows developed to integrate additional optical functionality beyond simple lateral scanning, enabling dynamic control of the focus or mirror surface. Out of this provided MEMS flexibility arises some challenges when obtaining high resolution images: due to scanning non-linearities, calibration of MEMS scanners may become critical, and inherent image artifacts or distortions during scanning can degrade image quality. Several reviewed methods and algorithms have been proposed to address these complications from MEMS scanning. Given their impact and promise, great effort and progress have been made toward integrating MEMS and biomedical imaging.

  12. The Development of the Differential MEMS Vector Hydrophone

    Directory of Open Access Journals (Sweden)

    Guojun Zhang

    2017-06-01

    Full Text Available To solve the problem that MEMS vector hydrophones are greatly interfered with by the vibration of the platform and flow noise in applications, this paper describes a differential MEMS vector hydrophone that could simultaneously receive acoustic signals and reject acceleration signals. Theoretical and simulation analyses have been carried out. Lastly, a prototype of the differential MEMS vector hydrophone has been created and tested using a standing wave tube and a vibration platform. The results of the test show that this hydrophone has a high sensitivity, Mv = −185 dB (@ 500 Hz, 0 dB reference 1 V/μPa, which is almost the same as the previous MEMS vector hydrophones, and has a low acceleration sensitivity, Mv = −58 dB (0 dB reference 1 V/g, which has decreased by 17 dB compared with the previous MEMS vector hydrophone. The differential MEMS vector hydrophone basically meets the requirements of acoustic vector detection when it is rigidly fixed to a working platform, which lays the foundation for engineering applications of MEMS vector hydrophones.

  13. Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

    Science.gov (United States)

    Rao, A. V. Narasimha; Swarnalatha, V.; Pal, P.

    2017-12-01

    Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed etchants (i.e. TMAH and KOH), potassium hydroxide (KOH) exhibits higher etch rate and provides improved anisotropy between Si{111} and Si{110} planes. In the manufacturing company, high etch rate is demanded to increase the productivity that eventually reduces the cost of end product. In order to modify the etching characteristics of KOH for the micromachining of Si{110}, we have investigated the effect of hydroxylamine (NH2OH) in 20 wt% KOH solution. The concentration of NH2OH is varied from 0 to 20% and the etching is carried out at 75 °C. The etching characteristics which are studied in this work includes the etch rates of Si{110} and silicon dioxide, etched surface morphology, and undercutting at convex corners. The etch rate of Si{110} in 20 wt% KOH + 15% NH2OH solution is measured to be four times more than that of pure 20 wt% KOH. Moreover, the addition of NH2OH increases the undercutting at convex corners and enhances the etch selectivity between Si and SiO2.

  14. Magnetic field assisted finishing of ultra-lightweight and high-resolution MEMS x-ray micro-pore optics

    Science.gov (United States)

    Riveros, Raul E.; Yamaguchi, Hitomi; Mitsuishi, Ikuyuki; Takagi, Utako; Ezoe, Yuichiro; Kato, Fumiki; Sugiyama, Susumu; Yamasaki, Noriko; Mitsuda, Kazuhisa

    2009-05-01

    In recent years, X-ray telescopes have been shrinking in both size and weight to reduce cost and volume on space flight missions. Current designs focus on the use of MEMS technologies to fabricate ultra-lightweight and high-resolution X-ray optics. In 2006, Ezoe et al. introduced micro-pore X-ray optics fabricated using anisotropic wet etching of silicon (110) wafers. These optics, though extremely lightweight (completed telescope weight 1 kg or less for an effective area of 1000 cm2), had limited angular resolution, as the reflecting surfaces were flat crystal planes. To achieve higher angular resolution, curved reflecting surfaces should be used. Both silicon dry etching and X-ray LIGA were used to create X-ray optics with curvilinear micro-pores; however, the resulting surface roughness of the curved micro-pore sidewalls did not meet X-ray reflection criteria of 10 nm rms in a 10 μm2 area. This indicated the need for a precision polishing process. This paper describes the development of an ultra-precision polishing process employing an alternating magnetic field assisted finishing process to polish the micro-pore side walls to a mirror finish (< 4 nmrms). The processing principle is presented, and a polishing machine is designed and fabricated to explore the feasibility of this polishing process as a possible method for processing MEMS X-ray optics to meet X-ray reflection specifications.

  15. A method for manufacturing a hollow mems structure

    DEFF Research Database (Denmark)

    2017-01-01

    The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then covered by an etch-stop layer. After this step, a bottom...... further comprises the step of creating bottom and top conductors in the respective bottom and top layers. Finally, excess core material is removed in order to create the at least partly hollow MEMS structure which may include a MEMS inductor....

  16. Mathematical analysis of partial differential equations modeling electrostatic MEMS

    CERN Document Server

    Esposito, Pierpaolo; Guo, Yujin

    2010-01-01

    Micro- and nanoelectromechanical systems (MEMS and NEMS), which combine electronics with miniature-size mechanical devices, are essential components of modern technology. It is the mathematical model describing "electrostatically actuated" MEMS that is addressed in this monograph. Even the simplified models that the authors deal with still lead to very interesting second- and fourth-order nonlinear elliptic equations (in the stationary case) and to nonlinear parabolic equations (in the dynamic case). While nonlinear eigenvalue problems-where the stationary MEMS models fit-are a well-developed

  17. Differential RF MEMS interwoven capacitor immune to residual stress warping

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-27

    A RF MEMS capacitor with an interwoven structure is designed, fabricated in the PolyMUMPS process and tested in an effort to address fabrication challenges usually faced in MEMS processes. The interwoven structure was found to offer several advantages over the typical MEMS parallel-plate design including eliminating the warping caused by residual stress, eliminating the need for etching holes, suppressing stiction, reducing parasitics and providing differential capability. The quality factor of the proposed capacitor was higher than five throughout a 2–10 GHz range and the resonant frequency was in excess of 20 GHz.

  18. The Sandia MEMS passive shock sensor : FY07 maturation activities.

    Energy Technology Data Exchange (ETDEWEB)

    Houston, Jack E.; Blecke, Jill; Mitchell, John Anthony; Wittwer, Jonathan W.; Crowson, Douglas A.; Clemens, Rebecca C.; Walraven, Jeremy Allen; Epp, David S.; Baker, Michael Sean

    2008-08-01

    This report describes activities conducted in FY07 to mature the MEMS passive shock sensor. The first chapter of the report provides motivation and background on activities that are described in detail in later chapters. The second chapter discusses concepts that are important for integrating the MEMS passive shock sensor into a system. Following these two introductory chapters, the report details modeling and design efforts, packaging, failure analysis and testing and validation. At the end of FY07, the MEMS passive shock sensor was at TRL 4.

  19. Millorar la memòria amb adrenalina

    OpenAIRE

    Portell Cortés, Isabel

    2010-01-01

    Aquesta recerca ha estudiat la influència positiva de l'adrenalina sobre la memòria de reconeixement, en concret per a la identitat i la localització d'un objecte determinat. Aquesta hormona afecta la manera en què el cervell guarda els records. Usant models animals de laboratori, s'ha pogut observar que l'administració d'adrenalina, després de l'entrenament de memòria, allarga la durada del record, en tasques de memòria de reconeixement, fins a deu vegades més que en els animals control....

  20. 3D heterostructures and systems for novel MEMS/NEMS

    Directory of Open Access Journals (Sweden)

    Victor Yakovlevich Prinz, Vladimir Alexandrovich Seleznev, Alexander Victorovich Prinz and Alexander Vladimirovich Kopylov

    2009-01-01

    Full Text Available In this review, we consider the application of solid micro- and nanostructures of various shapes as building blocks for micro-electro-mechanical or nano-electro-mechanical systems (MEMS/NEMS. We provide examples of practical applications of structures created by MEMS/NEMS fabrication. Novel devices are briefly described, such as a high-power electrostatic nanoactuator, a fast-response tubular anemometer for measuring gas and liquid flows, a nanoprinter, a nanosyringe and optical MEMS/NEMS. The prospects are described for achieving NEMS with tunable quantum properties.

  1. Silicone chain extender

    DEFF Research Database (Denmark)

    2015-01-01

    The present invention relates to a silicone chain extender, more particularly a chain extender for silicone polymers and copolymers, to a chain extended silicone polymer or copolymer and to a functionalized chain extended silicone polymer or copolymer, to a method for the preparation thereof...

  2. Direct bonding of ALD Al2O3 to silicon nitride thin films

    DEFF Research Database (Denmark)

    Laganà, Simone; Mikkelsen, E. K.; Marie, Rodolphe

    2017-01-01

    microscopy (TEM) by improving low temperature annealing bonding strength when using atomic layer deposition of aluminum oxide. We have investigated and characterized bonding of Al2O3-SixNy (low stress silicon rich nitride) and Al2O3-Si3N4 (stoichiometric nitride) thin films annealed from room temperature up......, the current bonding method can be also used for further MEMS applications. ...

  3. Silicon plasmonics at midinfrared using silicon-insulator-silicon platform

    Science.gov (United States)

    Gamal, Rania; Shafaay, Sarah; Ismail, Yehea; Swillam, Mohamed A.

    2017-01-01

    We propose devices based on doped silicon. Doped silicon is designed to act as a plasmonic medium in the midinfrared (MIR) range. The surface plasmon frequency of the doped silicon can be tuned within the MIR range, which gives rise to useful properties in the material's dispersion. We propose various plasmonic configurations that can be utilized for silicon on-chip applications in MIR. These devices have superior performance over conventional silicon devices and provide unique functionalities such as 90-sharp degree bends, T- and X-junction splitters, and stubs. These devices are CMOS-compatible and can be easily integrated with other electronic devices. In addition, the potential for biological and environmental sensing using doped silicon nanowires is demonstrated.

  4. Superhydrophobic Surface Coatings for Microfluidics and MEMs.

    Energy Technology Data Exchange (ETDEWEB)

    Branson, Eric D.; Singh, Seema [Sandia National Laboratories, Livermore, CA; Houston, Jack E.; van Swol, Frank B.; Brinker, C. Jeffrey

    2006-11-01

    Low solid interfacial energy and fractally rough surface topography confer to Lotus plants superhydrophobic (SH) properties like high contact angles, rolling and bouncing of liquid droplets, and self-cleaning of particle contaminants. This project exploits the porous fractal structure of a novel, synthetic SH surface for aerosol collection, its self-cleaning properties for particle concentration, and its slippery nature 3 to enhance the performance of fluidic and MEMS devices. We propose to understand fundamentally the conditions needed to cause liquid droplets to roll rather than flow/slide on a surface and how this %22rolling transition%22 influences the boundary condition describing fluid flow in a pipe or micro-channel. Rolling of droplets is important for aerosol collection strategies because it allows trapped particles to be concentrated and transported in liquid droplets with no need for a pre-defined/micromachined fluidic architecture. The fluid/solid boundary condition is important because it governs flow resistance and rheology and establishes the fluid velocity profile. Although many research groups are exploring SH surfaces, our team is the first to unambiguously determine their effects on fluid flow and rheology. SH surfaces could impact all future SNL designs of collectors, fluidic devices, MEMS, and NEMS. Interfaced with inertial focusing aerosol collectors, SH surfaces would allow size-specific particle populations to be collected, concentrated, and transported to a fluidic interface without loss. In microfluidic systems, we expect to reduce the energy/power required to pump fluids and actuate MEMS. Plug-like (rather than parabolic) velocity profiles can greatly improve resolution of chip-based separations and enable unprecedented control of concentration profiles and residence times in fluidic-based micro-reactors. Patterned SH/hydrophilic channels could induce mixing in microchannels and enable development of microflow control elements

  5. Advantages of PZT thick film for MEMS sensors

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lou-Moller, R.; Hansen, K.

    2010-01-01

    For all MEMS devices a high coupling between the mechanical and electrical domain is desired. Figures of merit describing the coupling are important for comparing different piezoelectric materials. The existing figures of merit are discussed and a new figure of merit is introduced for a fair...... comparison of piezoelectric thin and thick films based MEMS devices, as cantilevers, beams, bridges and membranes. Simple analytical modeling is used to define the new figure of merit. The relevant figure of merits is compared for the piezoelectric material of interest for MEMS applications: ZnO, AIN, PZT....... Improved figure of merit is reached in the piezoelectric PZT thick film, TF2100CIP, by using cold isostatic pressure in the PZT preparation process. The porosity of TF2100 is decreased 38%, hence, allowing an increase of charge sensitivity for MEMS sensors of 59%....

  6. Planetary-Whigs: Optical MEMS-Based Seismometer, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — During this Phase I, Michigan Aerospace Corporation will adapt the design of an optical MEMS seismometer for lunar and other planetary science instrumentation. The...

  7. Ultra-Low-Power MEMS Selective Gas Sensors, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a very low power but very practical "nano-watt" MEMS sensor platform for NASA requirements. The proposed nano-sensor platform is ultra...

  8. High Speed Magnetostrictive MEMS Actuated Mirror Deflectors, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — The main goal of this proposal is to develop high speed magnetostrictive and MEMS actuators for rapidly deflecting or deforming mirrors. High speed, light-weight,...

  9. An analytical formulation for phase noise in MEMS oscillators.

    Science.gov (United States)

    Agrawal, Deepak; Seshia, Ashwin

    2014-12-01

    In recent years, there has been much interest in the design of low-noise MEMS oscillators. This paper presents a new analytical formulation for noise in a MEMS oscillator encompassing essential resonator and amplifier nonlinearities. The analytical expression for oscillator noise is derived by solving a second-order nonlinear stochastic differential equation. This approach is applied to noise modeling of an electrostatically addressed MEMS resonator-based square-wave oscillator in which the resonator and oscillator circuit nonlinearities are integrated into a single modeling framework. By considering the resulting amplitude and phase relations, we derive additional noise terms resulting from resonator nonlinearities. The phase diffusion of an oscillator is studied and the phase diffusion coefficient is proposed as a metric for noise optimization. The proposed nonlinear phase noise model provides analytical insight into the underlying physics and a pathway toward the design optimization for low-noise MEMS oscillators.

  10. Tactical Grade MEMS IMUs for Spin-Stabilized Rockets Project

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose a tactical grade MEMS IMU for spin-stabilized rockets for metric tracking and autonomous systems. The enabling instrument is a gyroscope designed for very...

  11. MEMS Sensor Arrays for Cryogenic Propellant Applications, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — KWJ offers this proposal for a low-power, practical and versatile MEMS sensor platform for NASA applications. The proposed nano-sensor platform is ultra-low power...

  12. Reaction Wheel with Embedded MEMS IMU, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The innovation is to embed a MEMS IMU Sensor Chip into a reaction wheel to measure its spin rate as well as wheel attitude rate. We propose to use a reaction wheel...

  13. Picometer-Resolution MEMS Segmented DM, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  14. MEMS/Electronic Device Design and Characterization Facility

    Data.gov (United States)

    Federal Laboratory Consortium — This facility allows DoD to design and characterize state-of-the-art microelectromechanical systems (MEMS) and electronic devices. Device designers develop their own...

  15. 1015 PTT Segment MEMS DM Development, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with more than 10^4 actuators with size, weight, and power...

  16. Picometer-Resolution MEMS Segmented DM, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with 10^4 actuators that have size, weight, and power...

  17. Extreme-Precision MEMS Segmented Deformable Mirror, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — In Phase I research, Iris AO developed enhanced electromechanical models and calibration techniques for MEMS-based segmented deformable mirrors (DMs) applicable to a...

  18. MEMS-based transmission lines for microwave applications

    Science.gov (United States)

    Wu, Qun; Fu, Jiahui; Gu, Xuemai; Shi, Huajuan; Lee, Jongchul

    2003-04-01

    This paper mainly presents a briefly review for recent progress in MEMS-based transmission lines for use in microwave and millimeterwave range. MEMS-based transmission lines including different transmission line structure such as membrane-supported microstrip line microstrip line, coplanar microshield transmission line, LIGA micromachined planar transmission line, micromachined waveguides and coplanar waveguide are discussed. MEMS-based transmission lines are characterized by low propagation loss, wide operation frequency band, low dispersion and high quality factor, in addition, the fabrication is compatible with traditional processing of integrated circuits (IC"s). The emergence of MEMS-based transmission lines provided a solution for miniaturizing microwave system and monolithic microwave integrated circuits.

  19. High Speed Magnetostrictive MEMS Actuated Mirror Deflectors, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — We propose to develop high speed magnetostrictive and MEMS actuators for rapidly deflecting or deforming mirrors. High speed, light-weight, low voltage beam...

  20. Laboratory for Development, Calibration and Utilization of MEMS Devices

    National Research Council Canada - National Science Library

    Reshotko, Eli

    1997-01-01

    ... (notification letter dated 28 May 1997) to 31 May 1997. This DURIP equipment grant has provided us with the means to proceed in our development of MEMS devices for fluid dynamic and aerodynamic applications...

  1. Highly Tunable Narrow Bandpass MEMS Filter

    KAUST Repository

    Hafiz, Md Abdullah Al

    2017-07-07

    We demonstrate a proof-of-concept highly tunable narrow bandpass filter based on electrothermally and electrostatically actuated microelectromechanical-system (MEMS) resonators. The device consists of two mechanically uncoupled clamped-clamped arch resonators, designed such that their resonance frequencies are independently tuned to obtain the desired narrow passband. Through the electrothermal and electrostatic actuation, the stiffness of the structures is highly tunable. We experimentally demonstrate significant percentage tuning (~125%) of the filter center frequency by varying the applied electrothermal voltages to the resonating structures, while maintaining a narrow passband of 550 ± 50 Hz, a stopband rejection of >17 dB, and a passband ripple ≤ 2.5 dB. An analytical model based on the Euler-Bernoulli beam theory is used to confirm the behavior of the filter, and the origin of the high tunability using electrothermal actuation is discussed.

  2. Strong Motion Seismograph Based On MEMS Accelerometer

    Science.gov (United States)

    Teng, Y.; Hu, X.

    2013-12-01

    The MEMS strong motion seismograph we developed used the modularization method to design its software and hardware.It can fit various needs in different application situation.The hardware of the instrument is composed of a MEMS accelerometer,a control processor system,a data-storage system,a wired real-time data transmission system by IP network,a wireless data transmission module by 3G broadband,a GPS calibration module and power supply system with a large-volumn lithium battery in it. Among it,the seismograph's sensor adopted a three-axis with 14-bit high resolution and digital output MEMS accelerometer.Its noise level just reach about 99μg/√Hz and ×2g to ×8g dynamically selectable full-scale.Its output data rates from 1.56Hz to 800Hz. Its maximum current consumption is merely 165μA,and the device is so small that it is available in a 3mm×3mm×1mm QFN package. Furthermore,there is access to both low pass filtered data as well as high pass filtered data,which minimizes the data analysis required for earthquake signal detection. So,the data post-processing can be simplified. Controlling process system adopts a 32-bit low power consumption embedded ARM9 processor-S3C2440 and is based on the Linux operation system.The processor's operating clock at 400MHz.The controlling system's main memory is a 64MB SDRAM with a 256MB flash-memory.Besides,an external high-capacity SD card data memory can be easily added.So the system can meet the requirements for data acquisition,data processing,data transmission,data storage,and so on. Both wired and wireless network can satisfy remote real-time monitoring, data transmission,system maintenance,status monitoring or updating software.Linux was embedded and multi-layer designed conception was used.The code, including sensor hardware driver,the data acquisition,earthquake setting out and so on,was written on medium layer.The hardware driver consist of IIC-Bus interface driver, IO driver and asynchronous notification driver. The

  3. Torsion based universal MEMS logic device

    KAUST Repository

    Ilyas, Saad

    2015-10-28

    In this work we demonstrate torsion based complementary MEMS logic device, which is capable, of performing INVERTER, AND, NAND, NOR, and OR gates using one physical structure within an operating range of 0-10 volts. It can also perform XOR and XNOR with one access inverter using the same structure with different electrical interconnects. The paper presents modeling, fabrication and experimental calculations of various performance features of the device including lifetime, power consumption and resonance frequency. The fabricated device is 535 μm by 150 μm with a gap of 1.92 μm and a resonant frequency of 6.51 kHz. The device is capable of performing the switching operation with a frequency of 1 kHz.

  4. MEMS inertial sensors with integral rotation means.

    Energy Technology Data Exchange (ETDEWEB)

    Kohler, Stewart M.

    2003-09-01

    The state-of-the-art of inertial micro-sensors (gyroscopes and accelerometers) has advanced to the point where they are displacing the more traditional sensors in many size, power, and/or cost-sensitive applications. A factor limiting the range of application of inertial micro-sensors has been their relatively poor bias stability. The incorporation of an integral sensitive axis rotation capability would enable bias mitigation through proven techniques such as indexing, and foster the use of inertial micro-sensors in more accuracy-sensitive applications. Fabricating the integral rotation mechanism in MEMS technology would minimize the penalties associated with incorporation of this capability, and preserve the inherent advantages of inertial micro-sensors.

  5. Wideband MEMS Resonator Using Multifrequency Excitation

    KAUST Repository

    Jaber, Nizar

    2016-03-09

    We demonstrate the excitation of combination resonances of additive and subtractive types and their exploitations to realize a large bandwidth micro-machined resonator of large amplitude even at higher harmonic modes of vibrations. The investigation is conducted on a Microelectromechanical systems (MEMS) clamped-clamped microbeam fabricated using polyimide as a structural layer coated with nickel from top and chromium and gold layers from bottom. The microbeam is excited by a two-source harmonic excitation, where the first frequency source is swept around the targeted resonance (first or third mode of vibration) while the second source frequency is kept fixed. We report for the first time a large bandwidth and large amplitude response near the higher order modes of vibration. Also, we show that by properly tuning the frequency and amplitude of the excitation force, the frequency bandwidth of the resonator is controlled.

  6. Feedback Control of MEMS to Atoms

    CERN Document Server

    Shapiro, Benjamin

    2012-01-01

    Feedback Control of MEMS to Atoms illustrates the use of control and control systems as an essential part of functioning integrated miniaturized systems. The book is organized according to the dimensional scale of the problem, starting with microscale systems and ending with atomic-scale systems. Similar to macroscale machines and processes, control systems can play a major role in improving the performance of micro- and nanoscale systems and in enabling new capabilities that would otherwise not be possible. The majority of problems at these scales present many new challenges that go beyond the current state-of-the-art in control theory and engineering. This is a result of the multidisciplinary nature of micro/nanotechnology, which requires the merging of control engineering with physics, biology and chemistry. This book: Shows how the utilization of feedback control in nanotechnology instrumentation can yield results far better than passive systems can Discusses the application of control systems to problems...

  7. Quantitative Boundary Support Characterization for Cantilever MEMS

    Directory of Open Access Journals (Sweden)

    Ion Stiharu

    2007-10-01

    Full Text Available Microfabrication limitations are of concern especially for suspended Micro-Electro-Mechanical-Systems (MEMS microstructures such as cantilevers. The static anddynamic qualities of such microscale devices are directly related to the invariant and variantproperties of the microsystem. Among the invariant properties, microfabrication limitationscan be quantified only after the fabrication of the device through testing. However, MEMSare batch fabricated in large numbers where individual testing is neither possible nor costeffective. Hence, a suitable test algorithm needs to be developed where the test resultsobtained for a few devices can be applied to the whole fabrication batch, and also to thefoundry process in general. In this regard, this paper proposes a method to test MEMScantilevers under variant electro-thermal influences in order to quantify the effectiveboundary support condition obtained for a foundry process. A non-contact optical sensingapproach is employed for the dynamic testing. The Rayleigh-Ritz energy method usingboundary characteristic orthogonal polynomials is employed for the modeling andtheoretical analysis.

  8. Ultra-Low-Power MEMS Selective Gas Sensors

    Science.gov (United States)

    Stetter, Joseph

    2012-01-01

    This innovation is a system for gas sensing that includes an ultra-low-power MEMS (microelectromechanical system) gas sensor, combined with unique electronic circuitry and a proprietary algorithm for operating the sensor. The electronics were created from scratch, and represent a novel design capable of low-power operation of the proprietary MEMS gas sensor platform. The algorithm is used to identify a specific target gas in a gas mixture, making the sensor selective to that target gas.

  9. Programming cell fate on bio-functionalized silicon.

    Science.gov (United States)

    Premnath, Priyatha; Tan, Bo; Venkatakrishnan, Krishnan

    2015-04-01

    Controlling the growth of cells on the surface of silicon without an additive layer or topographical modification is unexplored. This research article delineates the discovery of unique properties of a bio-functionalized silicon substrate, programmed to repel or control cells, generated by ultrafast femtosecond pulse interaction with silicon. Remarkably, bio-functionalization in any shape or size without change in topology or morphology is observed indicating only sub-surface phase transformations. Material characterization reveals the presence of a unique mixture of phases of SiO2 and Si. Consequently, these variations in phase alter the physicochemical characteristics on the surface of silicon resulting in its bio-functionalization. The culture of mouse embryonic fibroblasts shows unique adhesion characteristics on these bio-functionalized silicon surfaces that include cell controlling, cell trapping, and cell shaping. Furthermore, the directionality of fibroblasts is restrained parallel to bio-functionalized zones as evidenced by changes in cytoskeleton. The controlling of proliferation, migration and adhesion of cells is attributed to unique phase bio-functionalization. This method presents considerable promise in a myriad of applications such as tissue engineering, MEMS, and lab-on-a-chip devices. Copyright © 2015 Elsevier B.V. All rights reserved.

  10. Digital reflection holography based systems development for MEMS testing

    Science.gov (United States)

    Singh, Vijay Raj; Liansheng, Sui; Asundi, Anand

    2010-05-01

    MEMS are tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers and nanometers. Testing of MEMS device is an important part in carrying out their functional assessment and reliability analysis. Development of systems based on digital holography (DH) for MEMS inspection and characterization is presented in this paper. Two DH reflection systems, table-top and handheld types, are developed depending on the MEMS measurement requirements and their capabilities are presented. The methodologies for the systems are developed for 3D profile inspection and static & dynamic measurements, which is further integrated with in-house developed software that provides the measurement results in near real time. The applications of the developed systems are demonstrated for different MEMS devices for 3D profile inspection, static deformation/deflection measurements and vibration analysis. The developed systems are well suitable for the testing of MEMS and Microsystems samples, with full-field, static & dynamic inspection as well as to monitor micro-fabrication process.

  11. Performance Analysis of Alignment Process of MEMS IMU

    Directory of Open Access Journals (Sweden)

    Vadim Bistrov

    2012-01-01

    Full Text Available The procedure of determining the initial values of the attitude angles (pitch, roll, and heading is known as the alignment. Also, it is essential to align an inertial system before the start of navigation. Unless the inertial system is not aligned with the vehicle, the information provided by MEMS (microelectromechanical system sensors is not useful for navigating the vehicle. At the moment MEMS gyroscopes have poor characteristics and it’s necessary to develop specific algorithms in order to obtain the attitude information of the object. Most of the standard algorithms for the attitude estimation are not suitable when using MEMS inertial sensors. The wavelet technique, the Kalman filter, and the quaternion are not new in navigation data processing. But the joint use of those techniques for MEMS sensor data processing can give some new results. In this paper the performance of a developed algorithm for the attitude estimation using MEMS IMU (inertial measurement unit is tested. The obtained results are compared with the attitude output of another commercial GPS/IMU device by Xsens. The impact of MEMS sensor measurement noises on an alignment process is analysed. Some recommendations for the Kalman filter algorithm tuning to decrease standard deviation of the attitude estimation are given.

  12. MEMS IMU Error Mitigation Using Rotation Modulation Technique.

    Science.gov (United States)

    Du, Shuang; Sun, Wei; Gao, Yang

    2016-11-29

    Micro-electro-mechanical-systems (MEMS) inertial measurement unit (IMU) outputs are corrupted by significant sensor errors. The navigation errors of a MEMS-based inertial navigation system will therefore accumulate very quickly over time. This requires aiding from other sensors such as Global Navigation Satellite Systems (GNSS). However, it will still remain a significant challenge in the presence of GNSS outages, which are typically in urban canopies. This paper proposed a rotary inertial navigation system (INS) to mitigate navigation errors caused by MEMS inertial sensor errors when external aiding information is not available. A rotary INS is an inertial navigator in which the IMU is installed on a rotation platform. Application of proper rotation schemes can effectively cancel and reduce sensor errors. A rotary INS has the potential to significantly increase the time period that INS can bridge GNSS outages and make MEMS IMU possible to maintain longer autonomous navigation performance when there is no external aiding. In this research, several IMU rotation schemes (rotation about X-, Y- and Z-axes) are analyzed to mitigate the navigation errors caused by MEMS IMU sensor errors. As the IMU rotation induces additional sensor errors, a calibration process is proposed to remove the induced errors. Tests are further conducted with two MEMS IMUs installed on a tri-axial rotation table to verify the error mitigation by IMU rotations.

  13. Design, fabrication and characterization of a bulk-PZT-actuated MEMS deformable mirror

    Science.gov (United States)

    Xu, Xiao-Hui; Li, Bao-Qing; Feng, Yan; Chu, Jia-Ru

    2007-12-01

    This paper describes the design, fabrication and characterization of a bulk-PZT-actuated MEMS deformable mirror (DM). An analytical model was employed to optimize the DM's structure. The fabrication techniques for PZT thick film actuators were also experimentally explored, including the bonding of bulk PZT ceramics and a silicon wafer by epoxy resin, and the thinning of the bulk PZT ceramics using a wet-etching method. A 10 × 10 array of 1.75 mm × 1.75 mm PZT thick film actuators was successfully fabricated. The PZT actuators showed a stroke of about 4.5 µm at 100 V. When a 36 µm thick silicon membrane mirror was assembled, the measured mirror deflection at 100 V was approximately 3.8 µm. The assembled DM showed an operating frequency bandwidth of 21 kHz and an influence function of approximately 30%. The displacement hysteresis was greatly eliminated by using the method of staying on the same segment.

  14. A Virtual Pivot Point MEMS Actuator with Externally Mounted Mirror: Design, Fabrication and Characterization

    Directory of Open Access Journals (Sweden)

    T. M. Fahim AMIN

    2014-12-01

    Full Text Available In this paper, the design, fabrication, and characterization of a virtual pivot point micro electromechanical systems (MEMS electrostatic actuator with externally mounted mirror is presented. The point of rotation of the movable arm of the actuator is distant from the physical actuator. This is a requirement for certain applications, such as an external cavity laser in Littman configuration. A maximum rotational radius of 5 mm from the virtual pivot point was achieved. A detailed analytical analysis for the displacement of the structure is presented. The dynamic characterization of the device with a finite element analysis simulation shows that the resonance frequency of the in-plane rotational mode is well separated from that of the out-of-plane bending mode, confirming high in-plane stability. The devices were fabricated on a silicon-on-insulator wafer with device layer thickness of 100 µm. Thin mirrors were fabricated by dicing a 100 µm thick silicon wafer. A resonance frequency of about 5.9 ´ 102 Hz for the maximum sized mounted mirror (1.7 mm ´ 100 µm ´ 1.0 mm was determined by optical characterization.

  15. MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

    Science.gov (United States)

    Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H; Peterson, Tracy C; Shul, Randy J; Ahlers, Catalina; Plut, Thomas A; Patrizi, Gary A

    2013-12-03

    In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

  16. Impedance characterization, degradation, and in vitro biocompatibility for platinum electrodes on BioMEMS.

    Science.gov (United States)

    Geninatti, Thomas; Bruno, Giacomo; Barile, Bernardo; Hood, R Lyle; Farina, Marco; Schmulen, Jeffrey; Canavese, Giancarlo; Grattoni, Alessandro

    2015-02-01

    Fine control of molecular transport through microfluidic systems can be obtained by modulation of an applied electrical field across channels with the use of electrodes. In BioMEMS designed for biological fluids and in vivo applications, electrodes must be biocompatible, biorobust and stable. In this work, the analysis and characterization of platinum (Pt) electrodes integrated on silicon substrates for biomedical applications are presented. Electrodes were incorporated on the surface of silicon chips by adhesion of laminated Pt foils or deposited at 30°, 45° or 90° angle by e-beam or physical vapor (sputtering) methods. Electrical and physical properties of the electrodes were quantified and evaluated using electrical impedance spectroscopy and modelling of the electrode-electrolyte interfaces. Electrode degradation in saline solution at pH 7.4 was tested at room temperature and under accelerated conditions (90 °C), both in the presence and absence of an applied electrical potential. Degradation was quantified using atomic force microscopy (AFM) and inductively coupled plasma mass spectroscopy (ICP-MS). Biocompatibility was assessed by MTT proliferation assay with human dermal fibroblasts. Results demonstrated that the deposited electrodes were biocompatible with negligible material degradation and exhibited electrochemical behavior similar to Pt foils, especially for e-beam deposited electrodes. Finally, Pt electrodes e-beam deposited on silicon nanofabricated nanochannel membranes were evaluated for controlled drug delivery applications. By tuning a low applied electrical potential (<1.5 VDC) to the electrodes, temporal modulation of the dendritic fullerene 1 (DF-1) release from a source reservoir was successfully achieved as a proof of concept, highlighting the potential of deposited electrodes in biomedical applications.

  17. Nanotechnology: MEMS and NEMS and their applications to smart systems and devices

    Science.gov (United States)

    Varadan, Vijay K.

    2003-10-01

    The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron and nanometer level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and systems. This effort offers the promise of: (1) increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed including micro stereo lithographic and micro molding techniques; (2) developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines; (3) development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation; (4) development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems, etc. A novel composite structure can be tailored by functionalizing carbon nano tubes and chemically bonding them with the polymer matrix e.g. block or graft copolymer, or even cross-linked copolymer, to impart exceptional structural, electronic and surface properties. Bio- and Mechanical-MEMS devices derived from this hybrid composite provide a new avenue for future smart systems. The integration of NEMS (NanoElectroMechanical Systems), MEMS, IDTs (Interdigital Transducers) and required microelectronics and conformal antenna in the multifunctional smart materials and composites results in a smart system suitable for sending and control of a variety functions in automobile, aerospace, marine and

  18. Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices

    National Research Council Canada - National Science Library

    Zhang, Xin

    2007-01-01

    ...) in MEMS devices and structures. In this project, PECVD SiOx is chosen as an example for the systematic study of mechanical behavior and underlying casual mechanisms of amorphous thin films for MEMS applications, which are generally...

  19. Diffusive Silicon Nanopore Membranes for Hemodialysis Applications.

    Directory of Open Access Journals (Sweden)

    Steven Kim

    Full Text Available Hemodialysis using hollow-fiber membranes provides life-sustaining treatment for nearly 2 million patients worldwide with end stage renal disease (ESRD. However, patients on hemodialysis have worse long-term outcomes compared to kidney transplant or other chronic illnesses. Additionally, the underlying membrane technology of polymer hollow-fiber membranes has not fundamentally changed in over four decades. Therefore, we have proposed a fundamentally different approach using microelectromechanical systems (MEMS fabrication techniques to create thin-flat sheets of silicon-based membranes for implantable or portable hemodialysis applications. The silicon nanopore membranes (SNM have biomimetic slit-pore geometry and uniform pores size distribution that allow for exceptional permeability and selectivity. A quantitative diffusion model identified structural limits to diffusive solute transport and motivated a new microfabrication technique to create SNM with enhanced diffusive transport. We performed in vitro testing and extracorporeal testing in pigs on prototype membranes with an effective surface area of 2.52 cm2 and 2.02 cm2, respectively. The diffusive clearance was a two-fold improvement in with the new microfabrication technique and was consistent with our mathematical model. These results establish the feasibility of using SNM for hemodialysis applications with additional scale-up.

  20. Silicon: electrochemistry and luminescence

    NARCIS (Netherlands)

    Kooij, Ernst Stefan

    1997-01-01

    The electrochemistry of crystalline and porous silicon and the luminescence from porous silicon has been studied. One chapter deals with a model for the anodic dissolution of silicon in HF solution. In following chapters both the electrochemistry and various ways of generating visible

  1. Evolution of gettering technologies for vacuum tubes to getters for MEMS

    Science.gov (United States)

    Amiotti, M.

    2008-05-01

    development of Micro Electro Mechanical Systems (MEMS) with moving parts in a vacuum environment required the development of a new generation of getter film, few microns thick, that can be selectively patterned onto a silicon or glass wafer (usually 4'' or 8''). This wafer with patterned getter film can be used directly as the cap wafer of a wafer to wafer bonded MEMS structure, assuring long life and reliability to the moving MEMS structure especially in automotive applications where thermal cycles are required for qualification.

  2. Evolution of gettering technologies for vacuum tubes to getters for MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Amiotti, M [SAES Getters S.p.A., Viale Italia 77, 20020 Lainate, Milano (Italy)], E-mail: Marco_Amiotti@saes-group.com

    2008-05-01

    getter surface. The development of Micro Electro Mechanical Systems (MEMS) with moving parts in a vacuum environment required the development of a new generation of getter film, few microns thick, that can be selectively patterned onto a silicon or glass wafer (usually 4-prime or 8-prime). This wafer with patterned getter film can be used directly as the cap wafer of a wafer to wafer bonded MEMS structure, assuring long life and reliability to the moving MEMS structure especially in automotive applications where thermal cycles are required for qualification.

  3. Field Tests of a Portable MEMS Gravimeter

    Directory of Open Access Journals (Sweden)

    Richard P. Middlemiss

    2017-11-01

    Full Text Available Gravimeters are used to measure density anomalies under the ground. They are applied in many different fields from volcanology to oil and gas exploration, but present commercial systems are costly and massive. A new type of gravity sensor has been developed that utilises the same fabrication methods as those used to make mobile phone accelerometers. In this study, we describe the first results of a field-portable microelectromechanical system (MEMS gravimeter. The stability of the gravimeter is demonstrated through undertaking a multi-day measurement with a standard deviation of 5.58 × 10 − 6 ms − 2 . It is then demonstrated that a change in gravitational acceleration of 4.5 × 10 − 5 ms − 2 can be measured as the device is moved between the top and the bottom of a 20.7 m lift shaft with a signal-to-noise ratio (SNR of 14.25. Finally, the device is demonstrated to be stable in a more harsh environment: a 4.5 × 10 − 4 ms − 2 gravity variation is measured between the top and bottom of a 275-m hill with an SNR of 15.88. These initial field-tests are an important step towards a chip-sized gravity sensor.

  4. DMD reliability: a MEMS success story

    Science.gov (United States)

    Douglass, Michael

    2003-01-01

    The Digital Micromirror Device (DMD) developed by Texas Instruments (TI) has made tremendous progress in both performance and reliability since it was first invented in 1987. From the first working concept of a bistable mirror, the DMD is now providing high-brightness, high-contrast, and high-reliability in over 1,500,000 projectors using Digital Light Processing technology. In early 2000, TI introduced the first DMD chip with a smaller mirror (14-micron pitch versus 17-micron pitch). This allowed a greater number of high-resolution DMD chips per wafer, thus providing an increased output capacity as well as the flexibility to use existing package designs. By using existing package designs, subsequent DMDs cost less as well as met our customers' demand for faster time to market. In recent years, the DMD achieved the status of being a commercially successful MEMS device. It reached this status by the efforts of hundreds of individuals working toward a common goal over many years. Neither textbooks nor design guidelines existed at the time. There was little infrastructure in place to support such a large endeavor. The knowledge we gained through our characterization and testing was all we had available to us through the first few years of development. Reliability was only a goal in 1992 when production development activity started; a goal that many throughout the industry and even within Texas Instruments doubted the DMD could achieve. The results presented in this paper demonstrate that we succeeded by exceeding the reliability goals.

  5. Modular packaging concept for MEMS and MOEMS

    Science.gov (United States)

    Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

    2017-11-01

    Wherever technical systems detect objects in their environment or interact with people, optical devices may play an important role. Light can be relatively easily produced and spatially and temporally modulated. Laser can project sharp images over long distances or cut materials in short distances. Depending on the wavelength an invisible scanning in near infrared for gesture recognition is possible as well as a projection of brilliant colour images. For several years, the Fraunhofer ISIT develops Opto-Packaging processes based on the viscous reshaping of glass wafers: First, hermetically sealed laser micro-mirror scanners WLP with inclined windows deflect in the central light reflex of the window out of the image area. Second, housing with lateral light exit permits hermetic sealing of edge-emitting lasers for highest reliability and durability. Such systems are currently experiencing an extremely high interest of the industry in all segments, from consumer to automotive through to materials processing. Our modular Opto-Packaging platform enables fast product developments. Housing for opto mechanical MEMS devices are equipped with inclined windows to minimize distortion, stray light and reflection losses. The hot viscous glass forming technology is also applied to functionalized substrate wafers which possess areas with high heat dissipation in addition to thermally insulating areas. Electrical contacts may be realized with metal filled vias or TGV (Through Glass Vias). The modular system reduces the development times for new, miniaturized optical systems so that manufacturers can focus on the essentials in their development, namely their product functionalities.

  6. Smartphone MEMS accelerometers and earthquake early warning

    Science.gov (United States)

    Kong, Q.; Allen, R. M.; Schreier, L.; Kwon, Y. W.

    2015-12-01

    The low cost MEMS accelerometers in the smartphones are attracting more and more attentions from the science community due to the vast number and potential applications in various areas. We are using the accelerometers inside the smartphones to detect the earthquakes. We did shake table tests to show these accelerometers are also suitable to record large shakings caused by earthquakes. We developed an android app - MyShake, which can even distinguish earthquake movements from daily human activities from the recordings recorded by the accelerometers in personal smartphones and upload trigger information/waveform to our server for further analysis. The data from these smartphones forms a unique datasets for seismological applications, such as earthquake early warning. In this talk I will layout the method we used to recognize earthquake-like movement from single smartphone, and the overview of the whole system that harness the information from a network of smartphones for rapid earthquake detection. This type of system can be easily deployed and scaled up around the global and provides additional insights of the earthquake hazards.

  7. MEMS DM development at Iris AO, Inc.

    Science.gov (United States)

    Helmbrecht, Michael A.; He, Min; Kempf, Carl J.; Besse, Marc

    2011-03-01

    Iris AO is actively developing piston-tip-tilt (PTT) segmented MEMS deformable mirrors (DM) and adaptive optics (AO) controllers for these DMs. This paper discusses ongoing research at Iris AO that has advanced the state-of-the-art of these devices and systems over the past year. Improvements made to open-loop operation and mirror fabrication enables mirrors to open-loop flatten to 4 nm rms. Additional testing of an anti snap-in technology was conducted and demonstrates that the technology can withstand 100 million snap-in events without failure. Deformable mirrors with dielectric coatings are shown that are capable of handling 630 W/cm2 of incident laser power. Over a localized region on the segment, the dielectric coatings can withstand 100kW/cm2 incident laser power for 30 minutes. Results from the first-ever batch of PTT489 DMs that were shipped to pilot customers are reported. Optimizations made to the open-loop PTT controller are shown to have latencies of 157.5 μs and synchronous array update rates of nearly 6.5 kHz. Finally, plans for the design and fabrication of the next-generation PTT939 DM are presented.

  8. Field Tests of a Portable MEMS Gravimeter.

    Science.gov (United States)

    Middlemiss, Richard P; Bramsiepe, Steven G; Douglas, Rebecca; Hough, James; Paul, Douglas J; Rowan, Sheila; Hammond, Giles D

    2017-11-08

    Gravimeters are used to measure density anomalies under the ground. They are applied in many different fields from volcanology to oil and gas exploration, but present commercial systems are costly and massive. A new type of gravity sensor has been developed that utilises the same fabrication methods as those used to make mobile phone accelerometers. In this study, we describe the first results of a field-portable microelectromechanical system (MEMS) gravimeter. The stability of the gravimeter is demonstrated through undertaking a multi-day measurement with a standard deviation of 5.58 × 10 - 6 ms - 2 . It is then demonstrated that a change in gravitational acceleration of 4.5 × 10 - 6 ms - 2 can be measured as the device is moved between the top and the bottom of a 20.7 m lift shaft with a signal-to-noise ratio (SNR) of 14.25. Finally, the device is demonstrated to be stable in a more harsh environment: a 4.5 × 10 - 4 ms - 2 gravity variation is measured between the top and bottom of a 275-m hill with an SNR of 15.88. These initial field-tests are an important step towards a chip-sized gravity sensor.

  9. MEMS Logic Using Mixed-Frequency Excitation

    KAUST Repository

    Ilyas, Saad

    2017-06-22

    We present multi-function microelectromechanical systems (MEMS) logic device that can perform the fundamental logic gate AND, OR, universal logic gates NAND, NOR, and a tristate logic gate using mixed-frequency excitation. The concept is based on exciting combination resonances due to the mixing of two or more input signals. The device vibrates at two steady states: a high state when the combination resonance is activated and a low state when no resonance is activated. These vibration states are assigned to logical value 1 or 0 to realize the logic gates. Using ac signals to drive the resonator and to execute the logic inputs unifies the input and output wave forms of the logic device, thereby opening the possibility for cascading among logic devices. We found that the energy consumption per cycle of the proposed logic resonator is higher than those of existing technologies. Hence, integration of such logic devices to build complex computational system needs to take into consideration lowering the total energy consumption. [2017-0041

  10. Differentially-driven MEMS spatial light modulator

    Science.gov (United States)

    Stappaerts, Eddy A.

    2004-09-14

    A MEMS SLM and an electrostatic actuator associated with a pixel in an SLM. The actuator has three electrodes: a lower electrode; an upper electrode fixed with respect to the lower electrode; and a center electrode suspended and actuable between the upper and lower electrodes. The center electrode is capable of resiliently-biasing to restore the center electrode to a non-actuated first equilibrium position, and a mirror is operably connected to the center electrode. A first voltage source provides a first bias voltage across the lower and center electrodes and a second voltage source provides a second bias voltage across the upper and center electrodes, with the first and second bias voltages determining the non-actuated first equilibrium position of the center electrode. A third voltage source provides a variable driver voltage across one of the lower/center and upper/center electrode pairs in series with the corresponding first or second bias voltage, to actuate the center electrode to a dynamic second equilibrium position.

  11. Poly-SiGe for MEMS-above-CMOS sensors

    CERN Document Server

    Gonzalez Ruiz, Pilar; Witvrouw, Ann

    2014-01-01

    Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence o...

  12. Gamma-ray irradiation of ohmic MEMS switches

    Science.gov (United States)

    Maciel, John J.; Lampen, James L.; Taylor, Edward W.

    2012-10-01

    Radio Frequency (RF) Microelectromechanical System (MEMS) switches are becoming important building blocks for a variety of military and commercial applications including switch matrices, phase shifters, electronically scanned antennas, switched filters, Automatic Test Equipment, instrumentation, cell phones and smart antennas. Low power consumption, large ratio of off-impedance to on-impedance, extreme linearity, low mass, small volume and the ability to be integrated with other electronics makes MEMS switches an attractive alternative to other mechanical and solid-state switches for a variety of space applications. Radant MEMS, Inc. has developed an electrostatically actuated broadband ohmic microswitch that has applications from DC through the microwave region. Despite the extensive earth based testing, little is known about the performance and reliability of these devices in space environments. To help fill this void, we have irradiated our commercial-off-the-shelf SPST, DC to 40 GHz MEMS switches with gamma-rays as an initial step to assessing static impact on RF performance. Results of Co-60 gamma-ray irradiation of the MEMS switches at photon energies ≥ 1.0 MeV to a total dose of ~ 118 krad(Si) did not show a statistically significant post-irradiation change in measured broadband, RF insertion loss, insertion phase, return loss and isolation.

  13. Memória de longo prazo modulada pela memória de curto prazo

    Directory of Open Access Journals (Sweden)

    Viviane Moreira-Aguiar

    2008-01-01

    Full Text Available Quando um estímulo ocorre aleatoriamente à esquerda ou à direita, a resposta é mais rápida quando estímulo e resposta estão no mesmo lado (condição compatível do que em lados opostos (condição incompatível. Na tarefa de Simon, embora a resposta seja selecionada pela forma (ou cor do estímulo, a posição deste influencia o Tempo de Reação Manual (TRM. O efeito Simon corresponde à diferença entre as médias dos TRMs nas duas condições (incompatível e compatível. Neste trabalho, estudamos como uma tarefa prévia de compatibilidade realizada com um dedo indicador modula o efeito Simon. Vinte e oito voluntários realizaram uma tarefa de compatibilidade seguida pela tarefa de Simon. No grupo compatível (14 voluntários, encontramos um efeito Simon de 24 ms. No incompatível (14 voluntários, ocorreu um efeito Simon inverso de -16 ms. Estes resultados mostram uma modulação da memória de longo prazo por uma tarefa envolvendo a memória de curto prazo.

  14. Power Management of MEMS-Based Storage Devices for Mobile Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Hartel, Pieter H.

    2008-01-01

    Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. MEMS-based storage devices should also be energy efficient for deployment in mobile systems. The problem is that MEMS-based storage devices are mechanical,

  15. Workload-Based Configuration of MEMS-Based Storage Devices for Mobile Systems

    NARCIS (Netherlands)

    Khatib, M.G.; Miller, E.L.; Hartel, Pieter H.

    2008-01-01

    Because of its small form factor, high capacity, and expected low cost, MEMS-based storage is a suitable storage technology for mobile systems. However, flash memory may outperform MEMS-based storage in terms of performance, and energy-efficiency. The problem is that MEMS-based storage devices have

  16. The chemistry of silicon

    CERN Document Server

    Rochow, E G; Emeléus, H J; Nyholm, Ronald

    1975-01-01

    Pergamon Texts in Organic Chemistry, Volume 9: The Chemistry of Silicon presents information essential in understanding the chemical properties of silicon. The book first covers the fundamental aspects of silicon, such as its nuclear, physical, and chemical properties. The text also details the history of silicon, its occurrence and distribution, and applications. Next, the selection enumerates the compounds and complexes of silicon, along with organosilicon compounds. The text will be of great interest to chemists and chemical engineers. Other researchers working on research study involving s

  17. Mask-less deposition of Au-SnO2 nanocomposites on CMOS MEMS platform for ethanol detection

    Science.gov (United States)

    Santra, S.; Sinha, A. K.; De Luca, A.; Ali, S. Z.; Udrea, F.; Guha, P. K.; Ray, S. K.; Gardner, J. W.

    2016-03-01

    Here we report on the mask-less deposition of Au-SnO2 nanocomposites with a silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) micro electro mechanical system (MEMS) platform through the use of dip pen nanolithography (DPN) to create a low-cost ethanol sensor. MEMS technology is used in order to achieve low power consumption, by the employment of a membrane structure formed using deep reactive ion etching technique. The device consists of an embedded tungsten micro-heater with gold interdigitated electrodes on top of the SOI membrane. The tungsten micro-heater is used to raise the membrane temperature up to its operating temperature and the electrodes are used to measure the resistance of the nanocomposite sensing layer. The CMOS MEMS devices have high electro-thermal efficiency, with 8.2 °C temperature increase per mW power of consumption. The sensing material (Au-SnO2 nanocomposite) was synthesised starting from SnO nanoplates, then Au nanoparticles were attached chemically to the surface of SnO nanoplates, finally the mixture was heated at 700 °C in an oven in air for 4 h. This composite material was sonicated for 2 h in terpineol to make a viscous homogeneous slurry and then ‘written’ directly across the electrode area using the DPN technique without any mask. The devices were characterised by exposure to ethanol vapour in humid air in the concentration range of 100-1000 ppm. The sensitivity varied from 1.2 to 0.27 ppm-1 for 100-1000 ppm of ethanol at 10% relative humid air. Selectivity measurements showed that the sensors were selective towards ethanol when they were exposed to acetone and toluene.

  18. PZT thin films for piezoelectric MEMS mechanical energy harvesting

    Science.gov (United States)

    Yeager, Charles

    This thesis describes the optimization of piezoelectric Pb(ZrxTi 1-x)O3 (PZT) thin films for energy generation by mechanical energy harvesting, and self-powered micro-electro-mechanical systems (MEMS). For this purpose, optimization of the material was studied, as was the incorporation of piezoelectric films into low frequency mechanical harvesters. A systematic analysis of the energy harvesting figure of merit was made. As a figure of merit (e31,ƒ)2/epsilon r (transverse piezoelectric coefficient squared over relative permittivity) was utilized. PZT films of several tetragonal compositions were grown on CaF2, MgO, SrTiO3, and Si substrates, thereby separating the dependence of composition on domain orientation. To minimize artifacts associated with composition gradients, and to extend the temperature growth window, PZT films were grown by metal organic chemical vapor deposition (MOCVD). Using this method, epitaxial {001} films achieved c-domain textures above 90% on single crystal MgO and CaF2 substrates. This could be tailored via the thermal stresses established by the differences in thermal expansion coefficients of the film and the substrate. The single-domain e31,ƒ for PZT thin films was determined to exceed -12 C/m2 in the tetragonal phase field for x ≥ 0.19, nearly twice the phenomenologically modeled value. The utilization of c-domain PZT films is motivated by a figure of merit above 0.8 C2/m4 for (001) PZT thin films. Increases to the FoM via doping and hot poling were also quantified; a 1% Mn doping reduced epsilonr by 20% without decreasing the piezoelectric coefficient. Hot poling a device for one hour above 120°C also resulted in a 20% reduction in epsilonr ; furthermore, 1% Mn doping reduced epsilonr by another 12% upon hot poling. Two methods for fabricating thin film mechanical energy harvesting devices were investigated. It was found that phosphoric acid solutions could be used to pattern MgO crystals, but this was typically accompanied by

  19. Silicone Resin Applications for Ceramic Precursors and Composites

    Directory of Open Access Journals (Sweden)

    Masaki Narisawa

    2010-06-01

    Full Text Available This article reviews the applications of silicone resins as ceramic precursors. The historical background of silicone synthesis chemistry is introduced to explain the production costs and supply availability of various silicones. Thermal degradation processes of silicones are classified in terms of the main chain structure and cyclic oligomer expulsion process, which determine the resulting ceramic yield and the chemical composition. The high temperature decomposition of Si-O-C beyond 1,400 °C in an inert atmosphere and formation of a protective silica layer on material surfaces beyond 1,200 °C in an oxidative atmosphere are discussed from the viewpoints of the wide chemical composition of the Si-O-C materials. Applications of the resins for binding agents, as starting materials for porous ceramics, matrix sources with impregnation, fiber spinning and ceramic adhesions are introduced. The recent development of the process of filler or cross-linking agent additions to resin compounds is also introduced. Such resin compounds are useful for obtaining thick coatings, MEMS parts and bulk ceramics, which are difficult to obtain by pyrolysis of simple organometallic precursors without additives.

  20. Optical measurement methods to study dynamic behavior in MEMS

    Science.gov (United States)

    Rembe, Christian; Kant, Rishi; Muller, Richard S.

    2001-10-01

    The maturing designs of moving microelectromechanical systems (MEMS) make it more-and-more important to have precise measurements and visual means to characterize dynamic microstructures. The Berkeley Sensor&Actuator Center (BSAC) has a forefront project aimed at developing these capabilities and at providing high-speed Internet (Supernet) access for remote use of its facilities. Already in operation are three optical-characterization tools: a stroboscopic-interferometer system, a computer-microvision system, and a laser-Doppler vibrometer. This paper describes precision and limitations of these systems and discusses their further development. In addition, we describe the results of experimental studies on the different MEMS devices, and give an overview about high-speed visualization of rapidly moving MEMS structures.

  1. MEMS capacitive force sensors for cellular and flight biomechanics

    International Nuclear Information System (INIS)

    Sun Yu; Nelson, Bradley J

    2007-01-01

    Microelectromechanical systems (MEMS) are playing increasingly important roles in facilitating biological studies. They are capable of providing not only qualitative but also quantitative information on the cellular, sub-cellular and organism levels, which is instrumental to understanding the fundamental elements of biological systems. MEMS force sensors with their high bandwidth and high sensitivity combined with their small size, in particular, have found a role in this domain, because of the importance of quantifying forces and their effect on the function and morphology of many biological structures. This paper describes our research in the development of MEMS capacitive force sensors that have already demonstrated their effectiveness in the areas of cell mechanics and Drosophila flight dynamics studies. (review article)

  2. MEMS and mil/aero: technology push and market pull

    Science.gov (United States)

    Clifford, Thomas H.

    2001-04-01

    MEMS offers attractive solutions to high-density fluidics, inertial, optical, switching and other demanding military/aerospace (mil/aero) challenges. However, full acceptance must confront the realities of production-scale producibility, verifiability, testability, survivability, as well as long-term reliability. Data on these `..ilities' are crucial, and are central in funding and deployment decisions. Similarly, mil/aero users must highlight specific missions, environmental exposures, and procurement issues, as well as the quirks of its designers. These issues are particularly challenging in MEMS, because of the laws of physics and business economics, as well as the risks of deploying leading-edge technology into no-fail applications. This paper highlights mil/aero requirements, and suggests reliability/qualification protocols, to guide development effort and to reassure mil/aero users that MEMS labs are mindful of the necessary realities.

  3. Integrated Magnetic MEMS Relays: Status of the Technology

    Directory of Open Access Journals (Sweden)

    Giuseppe Schiavone

    2014-08-01

    Full Text Available The development and application of magnetic technologies employing microfabricated magnetic structures for the production of switching components has generated enormous interest in the scientific and industrial communities over the last decade. Magnetic actuation offers many benefits when compared to other schemes for microelectromechanical systems (MEMS, including the generation of forces that have higher magnitude and longer range. Magnetic actuation can be achieved using different excitation sources, which create challenges related to the integration with other technologies, such as CMOS (Complementary Metal Oxide Semiconductor, and the requirement to reduce power consumption. Novel designs and technologies are therefore sought to enable the use of magnetic switching architectures in integrated MEMS devices, without incurring excessive energy consumption. This article reviews the status of magnetic MEMS technology and presents devices recently developed by various research groups, with key focuses on integrability and effective power management, in addition to the ability to integrate the technology with other microelectronic fabrication processes.

  4. Amplitude saturation of MEMS resonators explained by autoparametric resonance

    International Nuclear Information System (INIS)

    Van der Avoort, C; Bontemps, J J M; Steeneken, P G; Le Phan, K; Van Beek, J T M; Van der Hout, R; Hulshof, J; Fey, R H B

    2010-01-01

    This paper describes a phenomenon that limits the power handling of MEMS resonators. It is observed that above a certain driving level, the resonance amplitude becomes independent of the driving level. In contrast to previous studies of power handling of MEMS resonators, it is found that this amplitude saturation cannot be explained by nonlinear terms in the spring constant or electrostatic force. Instead we show that the amplitude in our experiments is limited by nonlinear terms in the equation of motion which couple the in-plane length-extensional resonance mode to one or more out-of-plane (OOP) bending modes. We present experimental evidence for the autoparametric excitation of these OOP modes using a vibrometer. The measurements are compared to a model that can be used to predict a power-handling limit for MEMS resonators

  5. Modelling of damping forces occuring in simple MEMS systems

    Directory of Open Access Journals (Sweden)

    Kamil Urbanowicz

    2015-12-01

    Full Text Available A certain damping force occurs in the micro-mechanical systems referred as MEMS. At the design stage of such systems, these forces must be accurately estimated. As shown in this work, in all systems operating at low frequencies, most important force is the one associated with the flotation of air film from the volume between two parallel operating movable MEMS plates. This force can be accurately estimated by analytical methods known from the literature. The paper presents analytical solutions that are frequently used in practice for simple plates. Also some simple simulations, using all described analytical solutions compared with the results of specialized program called Comsol Multyphysics, are shown. Presented research demonstrate the effectiveness of numerical software.[b]Keywords[/b]: MEMS, damping forces, Reynolds equation, modelling, simulation

  6. A 4 mm² Double Differential Torsional MEMS Accelerometer Based on a Double-Beam Configuration.

    Science.gov (United States)

    Miao, Tongqiao; Xiao, Dingbang; Li, Qingsong; Hou, Zhanqiang; Wu, Xuezhong

    2017-10-02

    This paper reports the design and simulation of a 4 mm² double differential torsional MEMS accelerometer based on a double-beam configuration. Based on the structure of conventional torsional accelerometers, normally composed of one pair of proof masses and one torsional beam, this work explores the double differential configuration: a torsional accelerometer with two pairs of unbalanced proof masses rotating in reverse. Also, the torsional beam is designed as a double-beam structure, which is a symmetrical structure formed by two torsional beams separated by a certain distance. The device area of the novel accelerometer is more than 50 times smaller than that of a traditional double differential torsional MEMS accelerometer. The FEM simulation results demonstrate that the smaller device does not sacrifice other specifications, such as mechanical sensitivity, nonlinearity and temperature robustness. The mechanical sensitivity and nonlinearity of a ±15 g measuring range is 59.4 fF/g and 0.88%, respectively. Compared with traditional single-beam silicon structures, the novel structure can achieve lower maximum principle stress in critical regions and reduce the possibility of failure when high-g acceleration loading is applied along all three axes. The mechanical noise equivalent acceleration is about 0.13 mg / Hz in the theoretical calculations and the offset temperature coefficient is 0.25 mg/ ℃ in the full temperature range of - 40 ℃ to 60 ℃ .

  7. Electrochemically etched nanoporous silicon membrane for separation of biological molecules in mixture

    International Nuclear Information System (INIS)

    Burham, Norhafizah; Hamzah, Azrul Azlan; Yunas, Jumril; Majlis, Burhanuddin Yeop

    2017-01-01

    This paper presents a technique for separating biological molecules in mixture using nanoporous silicon membrane. Nanopores were formed using electrochemical etching process (ECE) by etching a prefabricated silicon membrane in hydrofluoric acid (HF) and ethanol, and then directly bonding it with PDMS to form a complete filtration system for separating biological molecules. Tygon S3"™ tubings were used as fluid interconnection between PDMS molds and silicon membrane during testing. Electrochemical etching parameters were manipulated to control pore structure and size. In this work, nanopores with sizes of less than 50 nm, embedded on top of columnar structures have been fabricated using high current densities and variable HF concentrations. Zinc oxide was diluted with deionized (DI) water and mixed with biological molecules and non-biological particles, namely protein standard, serum albumin and sodium chloride. Zinc oxide particles were trapped on the nanoporous silicon surface, while biological molecules of sizes up to 12 nm penetrated the nanoporous silicon membrane. The filtered particles were inspected using a Zetasizer Nano SP for particle size measurement and count. The Zetasizer Nano SP results revealed that more than 95% of the biological molecules in the mixture were filtered out by the nanoporous silicon membrane. The nanoporous silicon membrane fabricated in this work is integratable into bio-MEMS and Lab-on-Chip components to separate two or more types of biomolecules at once. The membrane is especially useful for the development of artificial kidney. (paper)

  8. Electrochemically etched nanoporous silicon membrane for separation of biological molecules in mixture

    Science.gov (United States)

    Burham, Norhafizah; Azlan Hamzah, Azrul; Yunas, Jumril; Yeop Majlis, Burhanuddin

    2017-07-01

    This paper presents a technique for separating biological molecules in mixture using nanoporous silicon membrane. Nanopores were formed using electrochemical etching process (ECE) by etching a prefabricated silicon membrane in hydrofluoric acid (HF) and ethanol, and then directly bonding it with PDMS to form a complete filtration system for separating biological molecules. Tygon S3™ tubings were used as fluid interconnection between PDMS molds and silicon membrane during testing. Electrochemical etching parameters were manipulated to control pore structure and size. In this work, nanopores with sizes of less than 50 nm, embedded on top of columnar structures have been fabricated using high current densities and variable HF concentrations. Zinc oxide was diluted with deionized (DI) water and mixed with biological molecules and non-biological particles, namely protein standard, serum albumin and sodium chloride. Zinc oxide particles were trapped on the nanoporous silicon surface, while biological molecules of sizes up to 12 nm penetrated the nanoporous silicon membrane. The filtered particles were inspected using a Zetasizer Nano SP for particle size measurement and count. The Zetasizer Nano SP results revealed that more than 95% of the biological molecules in the mixture were filtered out by the nanoporous silicon membrane. The nanoporous silicon membrane fabricated in this work is integratable into bio-MEMS and Lab-on-Chip components to separate two or more types of biomolecules at once. The membrane is especially useful for the development of artificial kidney.

  9. Component-based assistants for MEMS design tools

    Science.gov (United States)

    Hahn, Kai; Brueck, Rainer; Schneider, Christian; Schumer, Christian; Popp, Jens

    2001-04-01

    With this paper a new approach for MEMS design tools will be introduced. An analysis of the design tool market leads to the result that most of the designers work with large and inflexible frameworks. Purchasing and maintaining these frameworks is expensive, and gives no optimum support for MEMS design process. The concept of design assistants, carried out with the concept of interacting software components, denotes a new generation of flexible, small, semi-autonomous software systems that are used to solve specific MEMS design tasks in close interaction with the designer. The degree of interaction depends on the complexity of the design task to be performed and the possibility to formalize the respective knowledge. In this context the Internet as one of today's most important communication media provides support for new tool concepts on the basis of the Java programming language. These modern technologies can be used to set up distributed and platform-independent applications. Thus the idea emerged to implement design assistants using Java. According to the MEMS design model new process sequences have to be defined new for every specific design object. As a consequence, assistants have to be built dynamically depending on the requirements of the design process, what can be achieved with component based software development. Componentware offers the possibility to realize design assistants, in areas like design rule checks, process consistency checks, technology definitions, graphical editors, etc. that may reside distributed over the Internet, communicating via Internet protocols. At the University of Siegen a directory for reusable MEMS components has been created, containing a process specification assistant and a layout verification assistant for lithography based MEMS technologies.

  10. Sputtered highly oriented PZT thin films for MEMS applications

    Science.gov (United States)

    Kalpat, Sriram S.

    Recently there has been an explosion of interest in the field of micro-electro-mechanical systems (MEMS). MEMS device technology has become critical in the growth of various fields like medical, automotive, chemical, and space technology. Among the many applications of ferroelectric thin films in MEMS devices, microfluidics is a field that has drawn considerable amount of research from bio-technology industries as well as chemical and semiconductor manufacturing industries. PZT thin films have been identified as best suited materials for micro-actuators and micro-sensors used in MEMS devices. A promising application for piezoelectric thin film based MEMS devices is disposable drug delivery systems that are capable of sensing biological parameters, mixing and delivering minute and precise amounts of drugs using micro-pumps or micro mixers. These devices call for low driving voltages, so that they can be battery operated. Improving the performance of the actuator material is critical in achieving battery operated disposal drug delivery systems. The device geometry and power consumption in MEMS devices largely depends upon the piezoelectric constant of the films, since they are most commonly used to convert electrical energy into a mechanical response of a membrane or cantilever and vice versa. Phenomenological calculation on the crystal orientation dependence of piezoelectric coefficients for PZT single crystal have reported a significant enhancement of the piezoelectric d33 constant by more than 3 times along [001] in the rhombohedral phase as compared to the conventionally used orientation PZT(111) since [111] is the along the spontaneous polarization direction. This could mean considerable improvement in the MEMS device performance and help drive the operating voltages lower. The motivation of this study is to investigate the crystal orientation dependence of both dielectric and piezoelectric coefficients of PZT thin films in order to select the appropriate

  11. RF MEMS Fractal Capacitors With High Self-Resonant Frequencies

    KAUST Repository

    Elshurafa, Amro M.

    2012-07-23

    This letter demonstrates RF microelectromechanical systems (MEMS) fractal capacitors possessing the highest reported self-resonant frequencies (SRFs) in PolyMUMPS to date. Explicitly, measurement results show SRFs beyond 20 GHz. Furthermore, quality factors higher than 4 throughout a band of 1-15 GHz and reaching as high as 28 were achieved. Additional benefits that are readily attainable from implementing fractal capacitors in MEMS are discussed, including suppressing residual stress warping, eliminating the need for etching holes, and reducing parasitics. The latter benefits were acquired without any fabrication intervention. © 2011 IEEE.

  12. A structural health monitoring system with ultrasonic MEMS transducers

    Science.gov (United States)

    Guldiken, Rasim O.; Onen, Onursal; Gul, Mustafa; Catbas, F. Necati

    2011-04-01

    In this paper, we will summarize our efforts on exploring guided acoustic waves generated by MEMS ultrasonic transducers enabling a non-destructive, ultra-low powered, wireless SHM system. State-of-the-art SHM systems employ bulk piezoelectric transducers. However, they are not environmentally benign (contain lead), not cost feasible for monitoring every bridge in the U.S., require significant power for operation, lack integration capability for wireless interrogation, need precise matching layers, and have only 25-50 percent fractional bandwidth, limiting the detection resolution. To alleviate most of these shortcomings, a low impedance MEMS transducer, called a capacitive micromachined ultrasonic transducer (CMUT), is explored.

  13. An Evolutionary Approach for Robust Layout Synthesis of MEMS

    DEFF Research Database (Denmark)

    Fan, Zhun; Wang, Jiachuan; Goodman, Erik

    2005-01-01

    The paper introduces a robust design method for layout synthesis of MEM resonators subject to inherent geometric uncertainties such as the fabrication error on the sidewall of the structure. The robust design problem is formulated as a multi-objective constrained optimisation problem after certain...... assumptions and treated with multiobjective genetic algorithm (MOGA), a special type of evolutionary computing approaches. Case study based on layout synthesis of a comb-driven MEM resonator shows that the approach proposed in this paper can lead to design results that meet the target performance and are less...

  14. MEMS-based thermoelectric infrared sensors: A review

    Science.gov (United States)

    Xu, Dehui; Wang, Yuelin; Xiong, Bin; Li, Tie

    2017-12-01

    In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

  15. Pulse Reversal Plating of Nickel and Nickel Alloys for MEMS

    DEFF Research Database (Denmark)

    Tang, Peter Torben

    2001-01-01

    Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilized for micro electromechanical systems (MEMS), internal stress and mater......Pulse plating has previously been reported to improve the properties of nickel and nickel alloy deposits. Typically, focus has been on properties such as grain size, hardness and smoothness. When pulse plating is to be utilized for micro electromechanical systems (MEMS), internal stress...

  16. Memória e Pastiche em Leite Derramado

    Directory of Open Access Journals (Sweden)

    Mírian Sumica Carneiro Reis

    2016-07-01

    Full Text Available Neste artigo, propomos uma análise do romance Leite Derramado, de Chico Buarque, considerando que, em sua tessitura, a memória é tema e trabalho de citação, a partir dos quais ecoam as vozes de outros autores, textos, teorias, mas também da ruptura com a historiografia tradicional e da derrocada de valores e ideologias para as quais nem o aspecto de criação da memória pode representar redenção.

  17. Additive direct-write microfabrication for MEMS: A review

    Science.gov (United States)

    Teh, Kwok Siong

    2017-12-01

    Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer- generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into threedimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive

  18. Endovascular retrieval of a CardioMEMS heart failure system

    Directory of Open Access Journals (Sweden)

    Arun Reghunathan, MD

    2018-04-01

    Full Text Available As the creation and utilization of new implantable devices increases, so does the need for interventionalists to devise unique retrieval mechanisms. This report describes the first endovascular retrieval of a CardioMEMS heart failure monitoring device. A 20-mm gooseneck snare was utilized in conjunction with a 9-French sheath and Envoy catheter for retrieval. The patient suffered no immediate postprocedural complications but died 5 days after the procedure from multiorgan failure secondary to sepsis. Keywords: CardioMEMS heart failure system, Endovascular retrieval

  19. Lead salt resonant cavity enhanced detector with MEMS mirror

    Science.gov (United States)

    Felder, F.; Fill, M.; Rahim, M.; Zogg, H.; Quack, N.; Blunier, S.; Dual, J.

    2010-01-01

    We describe a tunable resonant cavity enhanced detector (RCED) for the mid-infrared employing narrow gap lead-chalcogenide (IV-VI) layers on a Si substrate. The device consists of an epitaxial Bragg reflector layer, a thin p-n+ heterojunction with PbSrTe as detecting layer and a micro-electro-mechanical system (MEMS) micromirror as second mirror. Despite the thin absorber layer the sensitivity is even higher than for a conventional detector. Tunability is achieved by changing the cavity length with a vertically movable MEMS mirror. The device may be used as miniature infrared spectrometer to cover the spectral range from 30 μm.

  20. Thermal energy harvesting for application at MEMS scale

    CERN Document Server

    Percy, Steven; McGarry, Scott; Post, Alex; Moore, Tim; Cavanagh, Kate

    2014-01-01

    This book discusses the history of thermal heat generators and focuses on the potential for these processes using micro-electrical mechanical systems (MEMS) technology for this application. The main focus is on the capture of waste thermal energy for example from industrial processes, transport systems or the human body to generate useable electrical power.  A wide range of technologies is discussed, including external combustion heat cycles at MEMS ( Brayton, Stirling and Rankine), Thermoacoustic, Shape Memory Alloys (SMAs), Multiferroics, Thermionics, Pyroelectric, Seebeck, Alkali Metal Thermal, Hydride Heat Engine, Johnson Thermo Electrochemical Converters, and the Johnson Electric Heat Pipe.

  1. Optical MEMS: past, present and future

    Science.gov (United States)

    Ramani, Chandra Mouli

    2005-09-01

    Spurred by the growth of the internet, Optical Telecommunications bandwidth, experienced unprecedented growth during late 1990's. During this time of great economic expansion, the creation of new enterprises was vast and the expansion of established component, system and services companies was breathtaking. Unfortunately, this positive economic state was short-lived. This period was followed in 2001-2004 by one of the most significant market crashes in history. During those 10 years of economic growth, about $20B in venture capital was invested in the optical telecom industry, most of this investment was lost in recent years. Many start-up industries which experienced unprecedented growth at the end of the 20th century were lost at the start of the 21st. (1) During this time many, innovative technologies were born and buried. However, many new capabilities emerged from this period of unrest; one such example is the advent of Optical MEMS (MOEMS). Many academics and corporate laboratories pursued the development of MOEMS during the economic boom and, in the author's view; MOEMS surfaced as a powerful and versatile tool set that has proved invaluable and in the last few years during economic downturn, stood the test of time. In the Telecommunications industry, for optical switching and wavelength management applications MOEMS has proven to be the technology of choice. (2) Variable Optical Attenuators (VOA), Wavelength Blockers (WB), Dynamic Gain Equalizers (DGE), and most recently Wavelength Selective Switches (WSS) are being used in the numerous recent network deployments. Moreover, agile networks of the future will have MOEMS at every node. This presentation will provide an overview of the history of MOEMS in Telecommunications, discuss its byproducts and offer a window into the future of the technology.

  2. Optical MEMS: boom, bust and beyond

    Science.gov (United States)

    Ramani, Chandra Mouli

    2005-10-01

    Optical Telecommunications bandwidth, spurred by the growth of the internet, experienced unprecedented growth in the late 1990's. The creation of new enterprises was vast and the expansion of established component, system and services companies was also breathtaking. This period of speculative growth was followed in 2001-2004 by one of the most significant market crashes in history. While $20B of venture capital was invested in optical telecom in the last 10 years, the vast majority of that has been written off in the last four. Countless start-ups inaugurated with great fanfare at the end of the 20th century were unceremoniously shut down at the start of the 21st. (1) As in all speculative bubbles, innovative technologies were born and buried. Nonetheless, new capabilities emerge from the chaos and disruption; one such example is the advent of Optical MEMS (MOEMS). Its development was vigorously pursued in both academic and corporate laboratories during the boom and, in the author's view; MOEMS constitutes a powerful and versatile tool set that is an invaluable residual of the last few years. In Telecommunications, MOEMS has proven to be the technology of choice for many optical switching and wavelength management applications. (2) Variable Optical Attenuators (VOA), Wavelength Blockers (WB), Dynamic Gain Equalizers (DGE), and most recently Wavelength Selective Switches (WSS) are being used in the numerous recent network deployments. Moreover, agile networks of the future will have MOEMS at every node. This presentation will provide an overview of the history of MOEMS in Telecommunications, discuss its byproducts and project the future of the technology.

  3. Thermoelectrical Generator for a MEMS-Fuze

    Directory of Open Access Journals (Sweden)

    A. K. Efremov

    2015-01-01

    Full Text Available The structure of modern fuzes includes micro-electromechanical systems (MEMS, which have such advanced devices as micro-accelerometers and micro-switches, being triggered at a specified level of setback. Independent power source (PS, as an inherent part of the MEMSfuze, charges an energy storage unit during the shot and triggers the fuze firing circuit when the shell encounters the target. Operating level of the control signal should be achieved within the time of remote arming, determined by the type of ammunition. The paper considers a possibility to develop PS as a thermoelectric generator (TEG with aerodynamic heating of hot junctions due to friction of the projectile body on the incoming airflow. The initial temperature is determined by the driving band cutting into the rifling and friction during the movement of projectile through the tube bore. The paper presents a technique for calculating the temperature field along the body of the projectile from the critical point, located at the top of the shell head. The solution of the equation of heat balance reveals the temporal development of the projectile body temperature. The proposed mathematical model of the TEG describes the process of converting heat into electrical output signal (thermo-EMF. An example of calculation for a specific artillery system – 57-mm anti-aircraft gun S-60 is given. Calculation of the TEG output signal was limited by the time, which is necessary to reach the top of the projectile trajectory. It is shown that at high altitude the temperature difference may drop to zero, thus cutting off the TEG output signal. Selection of capacitive storage parameters can be based on the reliability test conditions of the fuze firing circuit actuators, taking into account the partial storage discharge on the trajectory before the projectile encounters the target.

  4. MEMS and MOEMS for national security applications

    Science.gov (United States)

    Scott, Marion W.

    2003-01-01

    Major opportunities for microsystem insertion into commercial applications, such as telecommunications and medical prosthesis, are well known. Less well known are applications that ensure the security of our nation, the protection of its armed forces, and the safety of its citizens. Microsystems enable entirely new possibilities to meet National Security needs, which can be classed along three lines: anticipating security needs and threats, deterring the efficacy of identified threats, and defending against the application of these threats. In each of these areas, specific products that are enabled by MEMS and MOEMS are discussed. In the area of anticipating needs and threats, sensored microsystems designed for chem/bio/nuclear threats, and sensors for border and asset protection can significantly secure our borders, ports, and transportation systems. Key features for these applications include adaptive optics and spectroscopic capabilities. Microsystems to monitor soil and water quality can be used to secure critical infrastructure, food safety can be improved by in-situ identification of pathogens, and sensored buildings can ensure the architectural safety of our homes and workplaces. A challenge to commercializing these opportunities, and thus making them available for National Security needs, is developing predictable markets and predictable technology roadmaps. The integrated circuit manufacturing industry provides an example of predictable technology maturation and market insertion, primarily due to the existence of a "unit cell" that allows volume manufacturing. It is not clear that microsystems can follow an analogous path. The possible paths to affordable low-volume production, as well as the prospects of a microsystems unit cell, are discussed.

  5. Transplantation tool integrated with MEMS manipulator for retinal pigment epithelium cell sheet.

    Science.gov (United States)

    Wada, H; Konishi, S

    2013-01-01

    This paper reports a transplantation tool for the retinal pigment epithelium in an eye. We have developed MEMS manipulator as an end-effector for transplantation of retinal pigment epithelium cell sheet. Typical size of MEMS manipulator is 3mm×3mm. MEMS manipulator was made of polydimethylsiloxane and driven by pneumatic balloon actuators. MEMS manipulator have been improved and integrated with several functions by sensors and actuators. MEMS manipulator is integrated into a transplantation tool. A whole tool also requires improvements based on our experimental results. We have improved our tool in terms of assembling, sealing, and operation.

  6. Nondestructive surface profiling of hidden MEMS using an infrared low-coherence interferometric microscope

    Science.gov (United States)

    Krauter, Johann; Osten, Wolfgang

    2018-03-01

    There are a wide range of applications for micro-electro-mechanical systems (MEMS). The automotive and consumer market is the strongest driver for the growing MEMS industry. A 100 % test of MEMS is particularly necessary since these are often used for safety-related purposes such as the ESP (Electronic Stability Program) system. The production of MEMS is a fully automated process that generates 90 % of the costs during the packaging and dicing steps. Nowadays, an electrical test is carried out on each individual MEMS component before these steps. However, after encapsulation, MEMS are opaque to visible light and other defects cannot be detected. Therefore, we apply an infrared low-coherence interferometer for the topography measurement of those hidden structures. A lock-in algorithm-based method is shown to calculate the object height and to reduce ghost steps due to the 2π -unambiguity. Finally, measurements of different MEMS-based sensors are presented.

  7. MEMS fabricated energy harvesting device with 2D resonant structure

    DEFF Research Database (Denmark)

    Crovetto, Andrea; Wang, Fei; Triches, Marco

    This paper reports on a MEMS energy harvester able to generate power from two perpendicular ambient vibration directions. CYTOP polymer is used both as the electret material for electrostatic transduction and as a bonding interface for low-temperature wafer bonding. With final chip size of ~1 cm2...

  8. Tailoring the nonlinear response of MEMS resonators using shape optimization

    DEFF Research Database (Denmark)

    Li, Lily L.; Polunin, Pavel M.; Dou, Suguang

    2017-01-01

    We demonstrate systematic control of mechanical nonlinearities in micro-electromechanical (MEMS) resonators using shape optimization methods. This approach generates beams with non-uniform profiles, which have nonlinearities and frequencies that differ from uniform beams. A set of bridge-type mic...

  9. Characterization of dielectric charging in RF MEMS capacitive switches

    NARCIS (Netherlands)

    Herfst, R.W.; Huizing, H.G.A.; Steeneken, P.G.; Schmitz, Jurriaan

    2006-01-01

    RF MEMS capacitive switches show great promise for use in wireless communication devices such as mobile phones, but the successful application of these switches is hindered by reliability concerns: charge injection in the dielectric layer (SiN) can cause irreversible stiction of the moving part of

  10. The conical conformal MEMS quasi-end-fire array antenna

    Science.gov (United States)

    Cong, Lin; Xu, Lixin; Li, Jianhua; Wang, Ting; Han, Qi

    2017-03-01

    The microelectromechanical system (MEMS) quasi-end-fire array antenna based on a liquid crystal polymer (LCP) substrate is designed and fabricated in this paper. The maximum radiation direction of the antenna tends to the cone axis forming an angle less than 90∘, which satisfies the proximity detection system applied at the forward target detection. Furthermore, the proposed antenna is fed at the ended side in order to save internal space. Moreover, the proposed antenna takes small covering area of the proximity detection system. The proposed antenna is fabricated by using the flexible MEMS process, and the measurement results agree well with the simulation results. This is the first time that a conical conformal array antenna is fabricated by the flexible MEMS process to realize the quasi-end-fire radiation. A pair of conformal MEMS array antennas resonates at 14.2 GHz with its mainlobes tending to the cone axis forming a 30∘ angle and a 31∘ angle separately, and the gains achieved are 1.82 dB in two directions, respectively. The proposed antenna meets the performance requirements for the proximity detection system which has vast application prospects.

  11. Design of the MEMS Piezoresistive Electronic Heart Sound Sensor

    Directory of Open Access Journals (Sweden)

    Guojun Zhang

    2016-11-01

    Full Text Available This paper proposes the electronic heart sound sensor, based on the piezoresistive principle and MEMS (Micro-Electro-Mechanical System technology. Firstly, according to the characteristics of heart sound detection, the double-beam-block microstructure has been proposed, and the theoretical analysis and finite element method (FEM simulation have been carried out. Combined with the natural frequency response of the heart sound (20~600 Hz, its structure sizes have been determined. Secondly, the processing technology of the microstructure with the stress concentration grooves has been developed. The material and sizes of the package have been determined by the three-layer medium transmission principle. Lastly, the MEMS piezoresistive electronic heart sound sensor has been tested compared with the 3200-type electronic stethoscope from 3M (São Paulo, MN, USA. The test results show that the heart sound waveform tested by the MEMS electronic heart sound sensor are almost the same as that tested by the 3200-type electronic stethoscope. Moreover, its signal-to-noise ratio is significantly higher. Compared with the traditional stethoscope, the MEMS heart sound sensor can provide the first and second heart sounds containing more abundant information about the lesion. Compared with the 3200-type electronic stethoscope from 3M, it has better performance and lower cost.

  12. Design of the MEMS Piezoresistive Electronic Heart Sound Sensor.

    Science.gov (United States)

    Zhang, Guojun; Liu, Mengran; Guo, Nan; Zhang, Wendong

    2016-11-07

    This paper proposes the electronic heart sound sensor, based on the piezoresistive principle and MEMS (Micro-Electro-Mechanical System) technology. Firstly, according to the characteristics of heart sound detection, the double-beam-block microstructure has been proposed, and the theoretical analysis and finite element method (FEM) simulation have been carried out. Combined with the natural frequency response of the heart sound (20~600 Hz), its structure sizes have been determined. Secondly, the processing technology of the microstructure with the stress concentration grooves has been developed. The material and sizes of the package have been determined by the three-layer medium transmission principle. Lastly, the MEMS piezoresistive electronic heart sound sensor has been tested compared with the 3200-type electronic stethoscope from 3M (São Paulo, MN, USA). The test results show that the heart sound waveform tested by the MEMS electronic heart sound sensor are almost the same as that tested by the 3200-type electronic stethoscope. Moreover, its signal-to-noise ratio is significantly higher. Compared with the traditional stethoscope, the MEMS heart sound sensor can provide the first and second heart sounds containing more abundant information about the lesion. Compared with the 3200-type electronic stethoscope from 3M, it has better performance and lower cost.

  13. Realization of a hybrid-integrated MEMS scanning grating spectrometer

    Science.gov (United States)

    Pügner, Tino; Knobbe, Jens; Grüger, Heinrich; Schenk, Harald

    2012-06-01

    Spectrometers and Spectrographs based on scanning grating monochromators are well-established tools for various applications. As new applications came into focus in the last few years, there is a demand for more sophisticated and miniaturized systems. The next generation spectroscopic devices should exhibit very small dimensions and low power consumption, respectively. We have developed a spectroscopic system with a volume of only (15 × 10 × 14) mm3 and a few milliwatts of power consumption that has the potential to fulfill the demands of the upcoming applications. Our approach is based on two dierent strategies. First, we apply resonantly driven MEMS (micro electro mechanical systems). The latest generation of our MEMS scanning grating device has two integrated optical slits and piezoresistive position detection in addition to the already existing miniaturized 1-d scanning grating plate and the electrostatic driving mechanism. Our second strategy is to take advantage of the hybrid integration of optical components by highly sophisticated manufacturing technologies. One objective is the combination of MEMS technology and a planar mounting approach, which potentially facilitate the mass production of spectroscopic systems and a signicant reduction of cost per unit. We present the optical system design as well as the realization of a miniaturized scanning grating spectrometer for the near infrared (NIR) range between 950 nm and 1900 nm with a spectral resolution of 10 nm. The MEMS devices as well as the optical components have been manufactured and rst samples of the spectroscopic measurement device have been mounted by an automated die bonder.

  14. MEMS Accelerometer with Screen Printed Piezoelectric Thick Film

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Lau-Moeller, R.; Bove, T.

    2006-01-01

    A bulk-micromachined piezoelectric MEMS accelerometer with screen printed piezoelectric Pb(ZrxTil )O3(PZT) thick film (TF) as the sensing material has been fabricated and characterized. The accelerometer has a four beam structure with a central seismic mass (3600x3600x500 pm3) and a total chip size...

  15. Adaptive Sliding Mode Control of MEMS AC Voltage Reference Source

    Directory of Open Access Journals (Sweden)

    Ehsan Ranjbar

    2017-01-01

    Full Text Available The accuracy of physical parameters of a tunable MEMS capacitor, as the major part of MEMS AC voltage reference, is of great importance to achieve an accurate output voltage free of the malfunctioning noise and disturbance. Even though strenuous endeavors are made to fabricate MEMS tunable capacitors with desiderated accurate physical characteristics and ameliorate exactness of physical parameters’ values, parametric uncertainties ineluctably emerge in fabrication process attributable to imperfections in micromachining process. First off, this paper considers applying an adaptive sliding mode controller design in the MEMS AC voltage reference source so that it is capable of giving off a well-regulated output voltage in defiance of jumbling parametric uncertainties in the plant dynamics and also aggravating external disturbance imposed on the system. Secondly, it puts an investigatory comparison with the designed model reference adaptive controller and the pole-placement state feedback one into one’s prospective. Not only does the tuned adaptive sliding mode controller show remarkable robustness against slow parameter variation and external disturbance being compared to the pole-placement state feedback one, but also it immensely gets robust against the external disturbance in comparison with the conventional adaptive controller. The simulation results are promising.

  16. Modeling of MEMS Mirrors Actuated by Phase-Change Mechanism

    Directory of Open Access Journals (Sweden)

    David Torres

    2017-04-01

    Full Text Available Given the multiple applications for micro-electro-mechanical system (MEMS mirror devices, most of the research efforts are focused on improving device performance in terms of tilting angles, speed, and their integration into larger arrays or systems. The modeling of these devices is crucial for enabling a platform, in particular, by allowing for the future control of such devices. In this paper, we present the modeling of a MEMS mirror structure with four actuators driven by the phase-change of a thin film. The complexity of the device structure and the nonlinear behavior of the actuation mechanism allow for a comprehensive study that encompasses simpler electrothermal designs, thus presenting a general approach that can be adapted to most MEMS mirror designs based on this operation principle. The MEMS mirrors presented in this work are actuated by Joule heating and tested using optical techniques. Mechanical and thermal models including both pitch and roll displacements are developed by combining theoretical analysis (using both numerical and analytical tools with experimental data and subsequently verifying with quasi-static and dynamic experiments.

  17. A single-mask thermal displacement sensor in MEMS

    NARCIS (Netherlands)

    Hogervorst, R.P.; Krijnen, B.; Krijnen, B.; Brouwer, Dannis Michel; Engelen, Johannes Bernardus Charles; Staufer, U.

    Position sensing in MEMS is often based on the principle of varying capacitance [1]. Alternative position sensing principles include using integrated optical waveguides [2] or varying thermal conductance [3]. Lantz et al demonstrated a thermal displacement sensor achieving nanometre resolution on a

  18. A MEMS Condenser Microphone-Based Intracochlear Acoustic Receiver.

    Science.gov (United States)

    Pfiffner, Flurin; Prochazka, Lukas; Peus, Dominik; Dobrev, Ivo; Dalbert, Adrian; Sim, Jae Hoon; Kesterke, Rahel; Walraevens, Joris; Harris, Francesca; Roosli, Christof; Obrist, Dominik; Huber, Alexander

    2017-10-01

    Intracochlear sound pressure (ICSP) measurements are limited by the small dimensions of the human inner ear and the requirements imposed by the liquid medium. A robust intracochlear acoustic receiver (ICAR) for repeated use with a simple data acquisition system that provides the required high sensitivity and small dimensions does not yet exist. The work described in this report aims to fill this gap and presents a new microelectromechanical systems (MEMS) condenser microphone (CMIC)-based ICAR concept suitable for ICSP measurements in human temporal bones. The ICAR head consisted of a passive protective diaphragm (PD) sealing the MEMS CMIC against the liquid medium, enabling insertion into the inner ear. The components of the MEMS CMIC-based ICAR were expressed by a lumped element model (LEM) and compared to the performance of successfully fabricated ICARs. Good agreement was achieved between the LEM and the measurements with different sizes of the PD. The ICSP measurements in a human cadaver temporal bone yielded data in agreement with the literature. Our results confirm that the presented MEMS CMIC-based ICAR is a promising technology for measuring ICSP in human temporal bones in the audible frequency range. A sensor for evaluation of the biomechanical hearing process by quantification of ICSP is presented. The concept has potential as an acoustic receiver in totally implantable cochlear implants.

  19. Materials analysis of fluorocarbon films for MEMS applications

    NARCIS (Netherlands)

    Elders, J.; Jansen, Henricus V.; Elwenspoek, Michael Curt

    1994-01-01

    In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS

  20. Modeling of a bimetallic MEMS-based infrared detector

    Science.gov (United States)

    Pevtsov, E. Ph; Breev, S. V.; Demenkova, T. A.

    2018-01-01

    In work techniques of calculations of the key parameters of the bimetal capacitive IR detectors matrix are presented. Sensitivity characteristics of the bimetal detector were calculated and prototype model of detector in the form of bimetallic console was produced. The possibility of use of capacitive MEMS-receivers on basis of bimetallic effect as an alternative to pyroelectric and microbolometer IR detectors is shown.

  1. Pulse Reversal PermAlloy Plating Process for MEMS Applications

    DEFF Research Database (Denmark)

    Smistrup, Kristian; Tang, Peter Torben; Møller, Per

    2007-01-01

    -stress deposits.We demonstrate selected MEMS applications of the electrolyte.The use of the strong complexing agent 5-sulfosalicylic acidallows for a photometric determination of the Fe3+-level in thebath and eliminate precipitates. This makes the electrolytesuitable as a Permalloy plating process used...

  2. Noise Reduction for a MEMS-Gyroscope-Based Head Mouse.

    Science.gov (United States)

    Du, Jiaying; Gerdtman, Christer; Lindén, Maria

    2015-01-01

    In this paper, four different signal processing algorithms which can be applied to reduce the noise from a MEMS-gyroscope-based computer head mouse are presented. MEMS-gyroscopes are small, light, cheap and widely used in many electrical products. MultiPos, a MEMS-gyroscope-based computer head mouse system was designed for persons with movement disorders. Noise such as physiological tremor and electrical noise is a common problem for the MultiPos system. In this study four different signal processing algorithms were applied and evaluated by simulation in MATLAB and implementation in a dsPIC, with aim to minimize the noise in MultiPos. The algorithms were low-pass filter, Least Mean Square (LMS) algorithm, Kalman filter and Weighted Fourier Linear Combiner (WFLC) algorithm. Comparisons and system tests show that these signal processing algorithms can be used to improve the MultiPos system. The WFLC algorithm was found the best method for noise reduction in the application of a MEMS-gyroscope-based head mouse.

  3. Structure, properties, and MEMS and microelectronic applications of ...

    Indian Academy of Sciences (India)

    Abstract. Vanadium oxides have for many decades attracted much attention for their rich and unique physical properties which pose intriguing questions as to their fundamental origins as well as offering numerous potential applications for microelectronics, sensors, and microelectromechanical systems (MEMS). This.

  4. Mems-Based Waste Vibration and Acoustic Energy Harvesters

    Science.gov (United States)

    2014-12-01

    behind the semiconductor-based integrated circuit industry, the MEMS field has capitalized upon the significant advances made in photolithography and...Surface and Coatings Technology, vol. 198, pp. 68–73, 2005. [20] M. Morita, T. Ohmi, E. Hasegawa, M. Kawakami and K. Suma . Control factor of native

  5. MemBrain: improving the accuracy of predicting transmembrane helices.

    Directory of Open Access Journals (Sweden)

    Hongbin Shen

    Full Text Available Prediction of transmembrane helices (TMH in alpha helical membrane proteins provides valuable information about the protein topology when the high resolution structures are not available. Many predictors have been developed based on either amino acid hydrophobicity scale or pure statistical approaches. While these predictors perform reasonably well in identifying the number of TMHs in a protein, they are generally inaccurate in predicting the ends of TMHs, or TMHs of unusual length. To improve the accuracy of TMH detection, we developed a machine-learning based predictor, MemBrain, which integrates a number of modern bioinformatics approaches including sequence representation by multiple sequence alignment matrix, the optimized evidence-theoretic K-nearest neighbor prediction algorithm, fusion of multiple prediction window sizes, and classification by dynamic threshold. MemBrain demonstrates an overall improvement of about 20% in prediction accuracy, particularly, in predicting the ends of TMHs and TMHs that are shorter than 15 residues. It also has the capability to detect N-terminal signal peptides. The MemBrain predictor is a useful sequence-based analysis tool for functional and structural characterization of helical membrane proteins; it is freely available at http://chou.med.harvard.edu/bioinf/MemBrain/.

  6. Modeling and non-linear responses of MEMS capacitive accelerometer

    Directory of Open Access Journals (Sweden)

    Sri Harsha C.

    2014-01-01

    Full Text Available A theoretical investigation of an electrically actuated beam has been illustrated when the electrostatic-ally actuated micro-cantilever beam is separated from the electrode by a moderately large gap for two distinct types of geometric configurations of MEMS accelerometer. Higher order nonlinear terms have been taken into account for studying the pull in voltage analysis. A nonlinear model of gas film squeezing damping, another source of nonlinearity in MEMS devices is included in obtaining the dynamic responses. Moreover, in the present work, the possible source of nonlinearities while formulating the mathematical model of a MEMS accelerometer and their influences on the dynamic responses have been investigated. The theoretical results obtained by using MATLAB has been verified with the results obtained in FE software and has been found in good agreement. Criterion towards stable micro size accelerometer for each configuration has been investigated. This investigation clearly provides an understanding of nonlinear static and dynamics characteristics of electrostatically micro cantilever based device in MEMS.

  7. MEMS-based tunable gratings and their applications

    Science.gov (United States)

    Yu, Yiting; Yuan, Weizheng; Qiao, Dayong

    2015-03-01

    The marriage of optics and MEMS has resulted in a new category of optical devices and systems that have unprecedented advantages compared with their traditional counterparts. As an important spatial light modulating technology, diffractive optical MEMS obtains a wide variety of successful commercial applications, e.g. projection displays, optical communication and spectral analysis, due to its features of highly compact, low-cost, IC-compatible, excellent performance, and providing possibilities for developing totally new, yet smart devices and systems. Three most successful MEMS diffraction gratings (GLVs, Polychromator and DMDs) are briefly introduced and their potential applications are analyzed. Then, three different MEMS tunable gratings developed by our group, named as micro programmable blazed gratings (μPBGs) and micro pitch-tunable gratings (μPTGs) working in either digital or analog mode, are demonstrated. The strategies to largely enhance the maximum blazed angle and grating period are described. Some preliminary application explorations based on the developed grating devices are also shown. For our ongoing research focus, we will further improve the device performance to meet the engineering application requirements.

  8. TCMO(TM): A Versatile MEMS Oscillator Timing Platform

    Science.gov (United States)

    2009-11-01

    Honolulu, Hawaii, USA (IEEE CFP08FRE), pp. 396-401. [7] B. Neubig, 2008, “MEMS-Oscillators–Opportunities and Limitations” (in German), Markt & Technik, No. 37, 28-29. (http://www.axtal.com/info/MuT_37_08.pdf)

  9. 3D Printing and Bioprinting in MEMS Technology

    Directory of Open Access Journals (Sweden)

    Chee Kai Chua

    2017-07-01

    Full Text Available 3D printing and bioprinting have advanced significantly in printing resolution in recent years, which presents a great potential for fabricating small and complex features suitable for microelectromechanical systems (MEMS with new functionalities. This special issue aims to give a glimpse into the future of this research field.

  10. Mechanical Robustness and Hermeticity Monitoring for MEMS Thin Film Encapsulation

    NARCIS (Netherlands)

    Santagata, F.

    2011-01-01

    Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film

  11. Breast Implants: Saline vs. Silicone

    Science.gov (United States)

    ... differ in material and consistency, however. Saline breast implants Saline implants are filled with sterile salt water. ... of any age for breast reconstruction. Silicone breast implants Silicone implants are pre-filled with silicone gel — ...

  12. Memórias de uma vida passada?

    Directory of Open Access Journals (Sweden)

    Erlendur Haraldsson

    2014-04-01

    Full Text Available Contexto : Há crianças que alegam ter memórias de uma vida passada. Se essas supostas memórias puderem ser verificadas, elas poderão ser bastante relevantes para a questão da relação mente-cérebro. Elas poderão indicar que a memória não está apenas armazenada no cérebro e que a mente pode existir sem um cérebro e ainda assim reter algumas de suas memórias. Essas possibilidades são contrárias ao que atualmente se sabe sobre memória e sua dependência do funcionamento cerebral. Objetivos : Testar se um pesquisador independente obteria achados comparáveis aos de Stevenson (Universidade da Virgínia que publicou um grande números desses casos. Métodos : Entrevistar as crianças que faziam afirmações consistentes sobre uma vida passada e as pessoas que haviam testemunhado as crianças fazerem essas declarações. Três estudos psicológicos compararam crianças com e sem alegadas memórias de uma vida passada. Resultados : Em dois dos três casos apresentados, foi encontrada uma pessoa falecida cujas características eram compatíveis com as afirmações das crianças sobre uma vida anterior. Psicologicamente, essas crianças diferem das outras crianças, mostrando sinais de Transtorno de Estresse Pós-Traumático, provavelmente por causa das alegadas lembranças de como elas morreram em acidentes ou foram assassinadas. Conclusões : As características dos casos de “memória de vida passada” fazem com que estas sejam relevantes para a questão da relação mente-cérebro.

  13. Memória: entre o oral e o escrito

    Directory of Open Access Journals (Sweden)

    Maria Aparecida Bergamaschi

    2012-07-01

    Full Text Available  O trabalho discute a relação entre o oral e o escrito sob a perspectiva da memória como experiência humana. Retoma as significações de memória que prevaleceram na história do ocidente, relacionando-as com a oralidade, a escrita e as práticas escolares, evidenciando que, na medida em que a presença da escrita vai se tomando cada vez mais intensa na sociedade e na escola, a memória vai perdendo o prestígio e aparece de forma mais contundente a dicotomia entre memória oral e escrita. O conceito de apropriação, desenvolvido por Chartier, é utilizado para reatar a relação entre memória oral e escrita tendo como palco de análise as práticas escolares e as práticas de escrita entre alguns grupos indígenas brasileiros que têm, historicamente, a tradição oral como traço fundante de suas culturas e que, ao fazerem uso da escrita, reelaboram essa linguagem através de novas relações com a memória.Palavras-chave: oralidade e escrita, memória, práticas escolares.   Abstract The paper discusses the relation between the oral and the written under the perspective of memory as a human experience. It retakes the meanings of memory that prevailed in western history, relating it with the orality, the writing and the school practices, proving that, as the presence of writing becomes more intense in society and in school, memory looses prestige and the dichotomy appears in a stronger way between written and oral memory. The concept of appropriation developed by Chartier, is used in order to tie again the relation between oral and written memory by analyzing school practices and writing practices among some Brazilian indian groups. These groups have, historically, the oral tradition as foundation of their culture and, when writing, they reelaborate this language through new relations with memory. Keywords: oral and written, memory, school practices. 

  14. An X band RF MEMS switch based on silicon-on-glass architecture

    Indian Academy of Sciences (India)

    Author Affiliations. M S Giridhar1 Ashwini Jambhalikar1 J John1 R Islam1 C L Nagendra1 T K Alex1. Laboratory for Electro-Optic Systems, Thin Films and Microsystems Group, Indian Space Research Organisation, 1st Cross, 1st Stage, Peenya Industrial Estate, Bangalore 560 058 ...

  15. FEM assisted calibration of a MEMS-based dispensing system with integrated piezoresistive force sensors

    International Nuclear Information System (INIS)

    Lishchynska, Maryna; Leïchlé, Thierry; Nicu, Liviu

    2008-01-01

    The focus of this work is a liquid dispensing system relying on the use of piezoresistive silicon microcantilevers. The experimental calibration of newly developed devices, required for global characterization of their mechanical, electromechanical properties and other performance characteristics, is usually complicated due to the structures' small size as well as cost and time consumption. On the other hand, closed-form analytical solutions to the nonlinear behaviour of devices of non-canonical geometry incorporating residual stresses are not commonly available either. Therefore, virtual calibration by means of computational modelling and simulation is not only adequate but also highly desirable. The finite element method has repeatedly proven its worth as a useful and efficient technique for the investigation of various mechanical and multiphysical systems, and has been extensively used in the design and analysis of MEMS. In the present work, the method is employed for virtual calibration of mechanical and electromechanical properties of novel liquid dispensing cantilevers. Separately, mechanical and electromechanical simulation results are in good agreement with experiment. Combined, these simulation data provide the ultimate calibration tool, allowing control over the force applied by depositing devices onto the substrate, and thereby preventing stiction problems and damage of fragile depositing surfaces

  16. Fully Integrated, Miniature, High-Frequency Flow Probe Utilizing MEMS Leadless SOI Technology

    Science.gov (United States)

    Ned, Alex; Kurtz, Anthony; Shang, Tonghuo; Goodman, Scott; Giemette. Gera (d)

    2013-01-01

    This work focused on developing, fabricating, and fully calibrating a flowangle probe for aeronautics research by utilizing the latest microelectromechanical systems (MEMS), leadless silicon on insulator (SOI) sensor technology. While the concept of angle probes is not new, traditional devices had been relatively large due to fabrication constraints; often too large to resolve flow structures necessary for modern aeropropulsion measurements such as inlet flow distortions and vortices, secondary flows, etc. Mea surements of this kind demanded a new approach to probe design to achieve sizes on the order of 0.1 in. (.3 mm) diameter or smaller, and capable of meeting demanding requirements for accuracy and ruggedness. This approach invoked the use of stateof- the-art processing techniques to install SOI sensor chips directly onto the probe body, thus eliminating redundancy in sensor packaging and probe installation that have historically forced larger probe size. This also facilitated a better thermal match between the chip and its mount, improving stability and accuracy. Further, the leadless sensor technology with which the SOI sensing element is fabricated allows direct mounting and electrical interconnecting of the sensor to the probe body. This leadless technology allowed a rugged wire-out approach that is performed at the sensor length scale, thus achieving substantial sensor size reductions. The technology is inherently capable of high-frequency and high-accuracy performance in high temperatures and harsh environments.

  17. CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

    Directory of Open Access Journals (Sweden)

    Pei-Zen Chang

    2012-12-01

    Full Text Available This paper develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, and mean stress, through the external electrical circuit behavior of the micro test-key. An approximate analytical solution for the pull-in voltage of bridge-type test-key subjected to electrostatic load and initial stress is derived based on Euler’s beam model and the minimum energy method. Then one can use the aforesaid closed form solution of the pull-in voltage to extract the Young’s modulus and mean stress of the test structures. The test cases include the test-key fabricated by a TSMC 0.18 μm standard CMOS process, and the experimental results refer to Osterberg’s work on the pull-in voltage of single crystal silicone microbridges. The extracted material properties calculated by the present algorithm are valid. Besides, this paper also analyzes the robustness of this algorithm regarding the dimension effects of test-keys. This mechanical properties extracting method is expected to be applicable to the wafer-level testing in micro-device manufacture and compatible with the wafer-level testing in IC industry since the test process is non-destructive.

  18. Mode Coupling and Nonlinear Resonances of MEMS Arch Resonators for Bandpass Filters

    KAUST Repository

    Hajjaj, Amal Z.

    2017-01-30

    We experimentally demonstrate an exploitation of the nonlinear softening, hardening, and veering phenomena (near crossing), where the frequencies of two vibration modes get close to each other, to realize a bandpass filter of sharp roll off from the passband to the stopband. The concept is demonstrated based on an electrothermally tuned and electrostatically driven MEMS arch resonator operated in air. The in-plane resonator is fabricated from a silicon-on-insulator wafer with a deliberate curvature to form an arch shape. A DC current is applied through the resonator to induce heat and modulate its stiffness, and hence its resonance frequencies. We show that the first resonance frequency increases up to twice of the initial value while the third resonance frequency decreases until getting very close to the first resonance frequency. This leads to the phenomenon of veering, where both modes get coupled and exchange energy. We demonstrate that by driving both modes nonlinearly and electrostatically near the veering regime, such that the first and third modes exhibit softening and hardening behavior, respectively, sharp roll off from the passband to the stopband is achievable. We show a flat, wide, and tunable bandwidth and center frequency by controlling the electrothermal actuation voltage.

  19. Investigation of top electrode for PZT thick films based MEMS sensors

    DEFF Research Database (Denmark)

    Hindrichsen, Christian Carstensen; Pedersen, Thomas; Kristiansen, Paw T.

    2010-01-01

    In this work processing of screen printed piezoelectric PZT thick films on silicon substrates is investigated for use in future MEMS devices. E-beam evaporated Al and Pt are patterned on PZT as a top electrode using a lift-off process with a line width down to 3 mu m. Three test structures are used...... to investigate the optimal thickness of the top electrode, the degradation of the piezoelectric properties of the PZT film in absence of a diffusion barrier layer and finally how to fabricate electrical interconnects down the edge of the PZT thick film. The roughness of the PZT is found to have a strong...... influence on the conductance of the top electrode influencing the optimal top electrode thickness. A 100 nm thick top electrode on the PZT thick film with a surface roughness of 273 nm has a 4.5 times higher resistance compared to a similar wire on a planar SiO2 surface which has a surface roughness of less...

  20. Cupula-Inspired Hyaluronic Acid-Based Hydrogel Encapsulation to Form Biomimetic MEMS Flow Sensors.

    Science.gov (United States)

    Kottapalli, Ajay Giri Prakash; Bora, Meghali; Kanhere, Elgar; Asadnia, Mohsen; Miao, Jianmin; Triantafyllou, Michael S

    2017-07-28

    Blind cavefishes are known to detect objects through hydrodynamic vision enabled by arrays of biological flow sensors called neuromasts. This work demonstrates the development of a MEMS artificial neuromast sensor that features a 3D polymer hair cell that extends into the ambient flow. The hair cell is monolithically fabricated at the center of a 2 μm thick silicon membrane that is photo-patterned with a full-bridge bias circuit. Ambient flow variations exert a drag force on the hair cell, which causes a displacement of the sensing membrane. This in turn leads to the resistance imbalance in the bridge circuit generating a voltage output. Inspired by the biological neuromast, a biomimetic synthetic hydrogel cupula is incorporated on the hair cell. The morphology, swelling behavior, porosity and mechanical properties of the hyaluronic acid hydrogel are characterized through rheology and nanoindentation techniques. The sensitivity enhancement in the sensor output due to the material and mechanical contributions of the micro-porous hydrogel cupula is investigated through experiments.