WorldWideScience

Sample records for electronics packaging technology

  1. Electronic equipment packaging technology

    CERN Document Server

    Ginsberg, Gerald L

    1992-01-01

    The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

  2. Japan's electronic packaging technologies

    Science.gov (United States)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  3. Packaging Technologies for High Temperature Electronics and Sensors

    Science.gov (United States)

    Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

    2013-01-01

    This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

  4. Packaging Technologies for 500C SiC Electronics and Sensors

    Science.gov (United States)

    Chen, Liang-Yu

    2013-01-01

    Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

  5. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  6. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal; Romenesco, Bruce

    2011-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  7. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal

    2000-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  8. Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

    2015-01-01

    This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

  9. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  10. Active food packaging technologies.

    Science.gov (United States)

    Ozdemir, Murat; Floros, John D

    2004-01-01

    Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

  11. Packaging and Embedded Electronics for the Next Generation

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  12. Technology transfer packages

    International Nuclear Information System (INIS)

    Mizon, G.A.; Bleasdale, P.A.

    1994-01-01

    Nuclear power is firmly established in many developed countries'energy policies and is being adopted by emerging nations as an attractive way of gaining energy self sufficiency. The early users of nuclear power had to develop the technology that they needed, which now, through increasing world wide experience, has been rationalised to meet demanding economic and environmental pressures. These justifiable pressures, can lead to existing suppliers of nuclear services to consider changing to more appropriate technologies and for new suppliers to consider licensing proven technology rather then incurring the cost of developing new alternatives. The transfer of technology, under license, is made more straight forward if the owner conveniently groups appropriate technology into packages. This paper gives examples of 'Technology Packages' and suggests criteria for the specification, selection and contractual requirements to ensure successful licensing

  13. Annual Symposium in Electronics Packaging

    CERN Document Server

    1991-01-01

    Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be cle...

  14. Power Electronics Packaging Reliability | Transportation Research | NREL

    Science.gov (United States)

    Packaging Reliability Power Electronics Packaging Reliability A photo of a piece of power electronics laboratory equipment. NREL power electronics packaging reliability research investigates the electronics packaging around a semiconductor switching device determines the electrical, thermal, and

  15. Anticounterfeit packaging technologies

    Directory of Open Access Journals (Sweden)

    Ruchir Y Shah

    2010-01-01

    Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

  16. Electronic technology

    International Nuclear Information System (INIS)

    Kim, Jin Su

    2010-07-01

    This book is composed of five chapters, which introduces electronic technology about understanding of electronic, electronic component, radio, electronic application, communication technology, semiconductor on its basic, free electron and hole, intrinsic semiconductor and semiconductor element, Diode such as PN junction diode, characteristic of junction diode, rectifier circuit and smoothing circuit, transistor on structure of transistor, characteristic of transistor and common emitter circuit, electronic application about electronic equipment, communication technology and education, robot technology and high electronic technology.

  17. Electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

  18. JTEC Panel report on electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

  19. Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

    Science.gov (United States)

    Ghaffarian, Reza

    2015-01-01

    The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

  20. Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

    Energy Technology Data Exchange (ETDEWEB)

    Bennion, K.; Moreno, G.

    2010-04-27

    Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

  1. Electronic packaging: new results in singulation by Laser Microjet

    Science.gov (United States)

    Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

    2004-07-01

    Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

  2. Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

    CERN Document Server

    Liu, Yong

    2012-01-01

    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

  3. Practical Packaging Technology for Microfluidic Systems

    International Nuclear Information System (INIS)

    Lee, Hwan Yong; Han, Song I; Han, Ki Ho

    2010-01-01

    This paper presents the technology for the design, fabrication, and characterization of a microfluidic system interface (MSI): the purpose of this technology is to enable the integration of complex microfluidic systems. The MSI technology can be applied in a simple manner for realizing complex arrangements of microfluidic interconnects, integrated microvalves for fluid control, and optical windows for on-chip optical processes. A microfluidic system for the preparation of genetic samples was used as the test vehicle to prove the effectiveness of the MSI technology for packaging complex microfluidic systems with multiple functionalities. The miniaturized genetic sample preparation system comprised several functional compartments, including compartments for cell purification, cell separation, cell lysis, solid-phase DNA extraction, polymerase chain reaction, and capillary electrophoresis. Additionally, the functional operation of the solid-phase extraction and PCR thermocycling compartments was demonstrated by using the MSI

  4. Functional Requirements for an Electronic Work Package System

    Energy Technology Data Exchange (ETDEWEB)

    Oxstrand, Johanna H. [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2016-12-01

    This document provides a set of high level functional requirements for a generic electronic work package (eWP) system. The requirements have been identified by the U.S. nuclear industry as a part of the Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative. The functional requirements are mainly applied to eWP system supporting Basic and Moderate types of smart documents, i.e., documents that have fields for recording input such as text, dates, numbers, and equipment status, and documents which incorporate additional functionalities such as form field data “type“ validation (e.g. date, text, number, and signature) of data entered and/or self-populate basic document information (usually from existing host application meta data) on the form when the user first opens it. All the requirements are categorized by the roles; Planner, Supervisor, Craft, Work Package Approval Reviewer, Operations, Scheduling/Work Control, and Supporting Functions. The categories Statistics, Records, Information Technology are also included used to group the requirements. All requirements are presented in Section 2 through Section 11. Examples of more detailed requirements are provided for the majority of high level requirements. These examples are meant as an inspiration to be used as each utility goes through the process of identifying their specific requirements. The report’s table of contents provides a summary of the high level requirements.

  5. NASA Electronic Parts and Packaging (NEPP) Program - Update

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

  6. Diamond-based heat spreaders for power electronic packaging applications

    Science.gov (United States)

    Guillemet, Thomas

    As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging

  7. A multimedia package for particle technology

    International Nuclear Information System (INIS)

    Mathers, B.; Rhodes, M.; Iveson, S.

    2002-01-01

    A CD-ROM-based package is being prepared for Particle Technology education. It is based on the textbook 'Introduction to Particle Technology' by Martin Rhodes, and aims to expand on the information given in the text by making best possible use of the advantages offered by the CD-ROM format, including use of videos, animations and interactive functions. The CD-ROM will be divided into the same twelve sections as the text. Each section will have subsections of: 1) Industrial Relevance (showing a video and/or photos and explanation of how the subject matter is used in industry). 2) Experiment/Demonstration (a video where measurements can be taken by the user, or explanatory video and raw data provided. The user will be given directions on how to carry out the experiment and the necessary calculations). 3) Quiz (multiple choice format testing the knowledge gained in the previous sections). 4) Calculators (allowing the user to easily make important particle technology calculations) The CD-ROM will allow users the opportunity to observe particulate processes and operations without the necessity of participating in laboratories or site visits, and will therefore be a useful tool for distance education, for users learning on an individual basis or as an addition to institutionally based particle technology courses

  8. Data analysis for the LISA Technology Package

    International Nuclear Information System (INIS)

    Hewitson, M; Danzmann, K; Diepholz, I; GarcIa, A; Armano, M; Fauste, J; Benedetti, M; Bogenstahl, J; Bortoluzzi, D; Bosetti, P; Cristofolini, I; Brandt, N; Cavalleri, A; Ciani, G; Dolesi, R; Ferraioli, L; Cruise, M; Fertin, D; GarcIa, C; Fichter, W

    2009-01-01

    The LISA Technology Package (LTP) on board the LISA Pathfinder mission aims to demonstrate some key concepts for LISA which cannot be tested on ground. The mission consists of a series of preplanned experimental runs. The data analysis for each experiment must be designed in advance of the mission. During the mission, the analysis must be carried out promptly so that the results can be fed forward into subsequent experiments. As such a robust and flexible data analysis environment needs to be put in place. Since this software is used during mission operations and effects the mission timeline, it must be very robust and tested to a high degree. This paper presents the requirements, design and implementation of the data analysis environment (LTPDA) that will be used for analysing the data from LTP. The use of the analysis software to perform mock data challenges (MDC) is also discussed, and some highlights from the first MDC are presented.

  9. Data analysis for the LISA Technology Package

    Energy Technology Data Exchange (ETDEWEB)

    Hewitson, M; Danzmann, K; Diepholz, I; GarcIa, A [Albert-Einstein-Institut, Max-Planck-Institut fuer Gravitationsphysik und Universitaet Hannover, 30167 Hannover (Germany); Armano, M; Fauste, J [European Space Agency, ESAC, Villanueva de la Canada, 28692 Madrid (Spain); Benedetti, M [Dipartimento di Ingegneria dei Materiali e Tecnologie Industriali, Universita di Trento and INFN, Gruppo Collegato di Trento, Mesiano, Trento (Italy); Bogenstahl, J [Department of Physics and Astronomy, University of Glasgow, Glasgow (United Kingdom); Bortoluzzi, D; Bosetti, P; Cristofolini, I [Dipartimento di Ingegneria Meccanica e Strutturale, Universita di Trento and INFN, Gruppo Collegato di Trento, Mesiano, Trento (Italy); Brandt, N [Astrium GmbH, 88039 Friedrichshafen (Germany); Cavalleri, A; Ciani, G; Dolesi, R; Ferraioli, L [Dipartimento di Fisica, Universita di Trento and INFN, Gruppo Collegato di Trento, 38050 Povo, Trento (Italy); Cruise, M [Department of Physics and Astronomy, University of Birmingham, Birmingham (United Kingdom); Fertin, D; GarcIa, C [European Space Agency, ESTEC, 2200 AG Noordwijk (Netherlands); Fichter, W, E-mail: martin.hewitson@aei.mpg.d [Institut fuer Flugmechanik und Flugregelung, 70569 Stuttgart (Germany)

    2009-05-07

    The LISA Technology Package (LTP) on board the LISA Pathfinder mission aims to demonstrate some key concepts for LISA which cannot be tested on ground. The mission consists of a series of preplanned experimental runs. The data analysis for each experiment must be designed in advance of the mission. During the mission, the analysis must be carried out promptly so that the results can be fed forward into subsequent experiments. As such a robust and flexible data analysis environment needs to be put in place. Since this software is used during mission operations and effects the mission timeline, it must be very robust and tested to a high degree. This paper presents the requirements, design and implementation of the data analysis environment (LTPDA) that will be used for analysing the data from LTP. The use of the analysis software to perform mock data challenges (MDC) is also discussed, and some highlights from the first MDC are presented.

  10. Electronics practice technology

    International Nuclear Information System (INIS)

    1995-01-01

    This book concentrates on electronic technology. It deals with kinds of terminal and mounting such as teflon terminal, steatite terminal, and harmonica terminal, small parts like connector, plug jack, vernier dial, and coupling, termination of wiring, kinds of switch and mounting, a condenser, fixed resistor, trance coil, loading of semiconductor, mounting of high input impedance circuit, mounting of electric power circuit, manufacturing of print substrate and practice of manufacturing for print substrate. This is one of series books on electronic technology.

  11. 2016 China Academic Conference on Printing, Packaging Engineering & Media Technology

    CERN Document Server

    Ouyang, Yun; Xu, Min; Yang, Li; Ouyang, Yujie

    2017-01-01

    This book includes a selection of reviewed papers presented at the 2016 China Academic Conference on Printing, Packaging Engineering & Media Technology, held on November 25-27, 2016 in Xi’an, China. The conference was jointly organized by China Academy of Printing Technology, Xi’an University of Technology and Stuttgart Media University of Germany. The proceedings cover the recent outcomes on color science and technology, image processing technology, digital media technology, digital process management technology in packaging and packaging etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, material science, computer science, digital media and network technology fields.

  12. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.

    2016-10-14

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  13. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.; Cordero, Marlon D.; Nassar, Joanna M.; Hanna, Amir; Kutbee, Arwa T.; Carreno, Armando Arpys Arevalo; Hussain, Muhammad Mustafa

    2016-01-01

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  14. Advanced materials for thermal management of electronic packaging

    CERN Document Server

    Tong, Xingcun Colin

    2011-01-01

    The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility

  15. Electron Technology: ELTE 2016

    Science.gov (United States)

    Pisarkiewicz, Tadeusz; Kucewicz, Wojciech

    2016-12-01

    In this paper we present a review of research results and technical accomplishments presented by researchers from technical universities, governmental institutes and research companies during the XIIth Scientific Conference Electron Technology, ELTE 2016. This review is based on materials presented at four topical conference sessions: Microelectronics and Nanoelectronics, Photonics, Materials and Technologies, and Microsystems and also on materials presented by invited speakers at two dedicated sessions. Oral sessions were accompanied by the poster sessions. In effect about 50 papers gathered in this volume reflect the topics discussed at the Conference. A short description of technological and measurement possibilities in the laboratories of Academic Centre for Materials and Nanotechnology and also in the Department of Electronics of the Faculty of Computer Science, Electronics and Telecommunications AGH UST are given.

  16. 500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

    Science.gov (United States)

    Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

    2016-01-01

    High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

  17. Mathematics for electronic technology

    CERN Document Server

    Howson, D P

    1975-01-01

    Mathematics for Electronic Technology is a nine-chapter book that begins with the elucidation of the introductory concepts related to use of mathematics in electronic engineering, including differentiation, integration, partial differentiation, infinite series, vectors, vector algebra, and surface, volume and line integrals. Subsequent chapters explore the determinants, differential equations, matrix analysis, complex variable, topography, graph theory, and numerical analysis used in this field. The use of Fourier method for harmonic analysis and the Laplace transform is also described. The ma

  18. Application of electron irradiation to food containers and packaging materials

    International Nuclear Information System (INIS)

    Ueno, Koji

    2010-01-01

    Problems caused by microbial contamination and hazardous chemicals have attracted much attention in the food industry. The number of systems such as hygienic management systems and Hazard Analysis Critical Control Point (HACCP) systems adopted in the manufacturing process is increasing. As manufacturing process control has become stricter, stricter control is also required for microbial control for containers and packaging materials (from disinfection to sterilization). Since safe and reliable methods for sterilizing food containers and packaging materials that leave no residue are required, electron beam sterilization used for medical equipment has attracted attention from the food industry. This paper describes an electron irradiation facility, methods for applying electron beams to food containers and packaging materials, and products irradiated with electron beams. (author)

  19. A computer code package for electron transport Monte Carlo simulation

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    1999-01-01

    A computer code package was developed for solving various electron transport problems by Monte Carlo simulation. It is based on condensed history Monte Carlo algorithm. In order to get reliable results over wide ranges of electron energies and target atomic numbers, specific techniques of electron transport were implemented such as: Moliere multiscatter angular distributions, Blunck-Leisegang multiscatter energy distribution, sampling of electron-electron and Bremsstrahlung individual interactions. Path-length and lateral displacement corrections algorithms and the module for computing collision, radiative and total restricted stopping powers and ranges of electrons are also included. Comparisons of simulation results with experimental measurements are finally presented. (author)

  20. Packaging technology of LEDs for LCD backlights

    International Nuclear Information System (INIS)

    Fan Manning; Liang Meng; Wang Guohong

    2009-01-01

    We design a package patterned with red and green emitting phosphors excited by a blue LED to emit tri-basic mixing color. For high backlight display quality, we compare several phosphors. According to our measurements, green phosphors 0752G, 0753G and red phosphor 0763R are preferred for producing a good backlight source. Compared to RGB-LED backlight units, this frame typically benefits the lighting uniformity, and can simplify the structures. It also provides higher color render and better CCT than the traditional package method of a yellow phosphor with a blue chip. However, its light efficiency needs to be further improved for the use of backlights for LCDs.

  1. Recent trends and future of pharmaceutical packaging technology.

    Science.gov (United States)

    Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

    2013-04-01

    The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

  2. Recent trends and future of pharmaceutical packaging technology

    Directory of Open Access Journals (Sweden)

    Nityanand Zadbuke

    2013-01-01

    Full Text Available The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

  3. Recent trends and future of pharmaceutical packaging technology

    Science.gov (United States)

    Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

    2013-01-01

    The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

  4. Electronic components and technology

    CERN Document Server

    Sangwine, Stephen

    2007-01-01

    Most introductory textbooks in electronics focus on the theory while leaving the practical aspects to be covered in laboratory courses. However, the sooner such matters are introduced, the better able students will be to include such important concerns as parasitic effects and reliability at the very earliest stages of design. This philosophy has kept Electronic Components and Technology thriving for two decades, and this completely updated third edition continues the approach with a more international outlook.Not only does this textbook introduce the properties, behavior, fabrication, and use

  5. Radiation disinfestation of used packagings: irradiation trials with electron beams

    International Nuclear Information System (INIS)

    Ignatowicz, S.; Zaedee, I.

    1994-01-01

    Used bags, sacks and other packagings are often infested with insects and mites - pest of stored products. Such packagings provide a source of infestation of a new lot or unit of agricultural products. Cleaning of repeatedly used packages is the most important preventive method. After using, the bags and sacks should be carefully beaten with a mechanical or hand beater. When pests are found, the packages should be disinfested with hot air or hot water. Larger numbers of bags are usually fumigated in a special fumigation chamber. Disinfestation by radiation processing is potentially a feasible substitute for chemical fumigation. In the present paper trials of radiation disinfestation of used bags are described and discussed. Information about using electron beams for pest disinfestation of jute and polyvinyl chloride bags (plastic bags) is provided. The absorbed dose is the most important irradiation process parameter. The lethal effects equivalent to chemical insecticides are obtained by high doses of ionizing radiation. Control of insect and/or mite infestation of the repeatedly used packagings may be secured by ionizing radiation applied at 2-3 kGy. These doses result in complete mortality of stored product pests within a few days. The radiation must penetrate deeply into the target product at sufficient level. Gamma rays and X-rays penetrate into the treated products easily but electron radiation penetrating is much lower, depending on electron energy applied. The results of this study indicate that bags made of polyvinyl chloride may be disinfested with electron beams when are created as separate units or batches up to 50 bags. Penetrability of jute bags is lower than the plastic bags. Therefore the jute bags should be irradiated with electrons as batches containing no more than 30 bags. (author)

  6. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  7. Technology transfer package on seismic base isolation - Volume III

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-02-14

    This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume III contains supporting materials not included in Volumes I and II.

  8. Interferometry for the LISA technology package LTP: an update

    International Nuclear Information System (INIS)

    Heinzel, G; Bogenstahl, J; Braxmaier, C; Danzmann, K; Garcia, A; Guzman, F; Hough, J; Hoyland, D; Jennrich, O; Killow, C; Robertson, D; Sodnik, Z; Steier, F; Ward, H; Wand, V

    2006-01-01

    This paper gives an update on the status of the LISA technology package (LTP) which is to be launched in 2009 by ESA as a technology demonstration mission for the spaceborne gravitational wave observatory LISA. The dominant noise source in the interferometer prototype has been investigated and improved such that it is now comfortably below its budget at all frequencies

  9. Technological Packages Extended To Farmers by Non ...

    African Journals Online (AJOL)

    Global Approaches to Extension Practice: A Journal of Agricultural Extension ... extended to farmers by Non Governmental Organizations in the Niger Delta area of Nigeria. ... Modern snailery was the only identified agro forestry technology extended, ... technologies were the significant soil management practices extended.

  10. Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules

    OpenAIRE

    Lostetter, Alexander B.

    1998-01-01

    High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and thus ultimately reduce the cost of the power electronic circuits. The problem with this strategy in conventional packaging, however, is that at high frequencies, interconnects between the power devic...

  11. NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

    Science.gov (United States)

    Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

    2018-01-01

    NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

  12. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    Science.gov (United States)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  13. The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2015-01-01

    This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

  14. Image Fusion Technologies In Commercial Remote Sensing Packages

    OpenAIRE

    Al-Wassai, Firouz Abdullah; Kalyankar, N. V.

    2013-01-01

    Several remote sensing software packages are used to the explicit purpose of analyzing and visualizing remotely sensed data, with the developing of remote sensing sensor technologies from last ten years. Accord-ing to literature, the remote sensing is still the lack of software tools for effective information extraction from remote sensing data. So, this paper provides a state-of-art of multi-sensor image fusion technologies as well as review on the quality evaluation of the single image or f...

  15. RF and microwave integrated circuit development technology, packaging and testing

    CERN Document Server

    Gamand, Patrice; Kelma, Christophe

    2018-01-01

    RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development. In addition, the authors provide practical answers and solutions regarding the choice of technology, the packaging solutions and the effects on the performance on the circuit and to the industrial testing strategy. It will also discuss future trends and challenges and includes case studies to illustrate examples. * Offers an overview of the challenges in RF/microwave product design * Provides practical answers to packaging issues and evaluates its effect on the performance of the circuit * Includes industrial testing strategies * Examines relevant RF MIC technologies and the factors which affect the choice of technology for a particular application, e.g. technical performance and cost * Discusses future trends and challen...

  16. Maintainability design criteria for packaging of spacecraft replaceable electronic equipment.

    Science.gov (United States)

    Kappler, J. R.; Folsom, A. B.

    1972-01-01

    Maintainability must be designed into long-duration spacecraft and equipment to provide the required high probability of mission success with the least cost and weight. The ability to perform repairs quickly and easily in a space environment can be achieved by imposing specific maintainability design criteria on spacecraft equipment design and installation. A study was funded to investigate and define design criteria for electronic equipment that would permit rapid removal and replacement in a space environment. The results of the study are discussed together with subsequent simulated zero-g demonstration tests of a mockup with new concepts for packaging.

  17. Technology transfer package on seismic base isolation - Volume I

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-02-14

    This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume I contains the proceedings of the Workshop on Seismic Base Isolation for Department of Energy Facilities held in Marina Del Rey, California, May 13-15, 1992.

  18. Technology transfer package on seismic base isolation - Volume II

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1995-02-14

    This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume II contains the proceedings for the Short Course on Seismic Base Isolation held in Berkeley, California, August 10-14, 1992.

  19. The use of modified packaging in the technology of butter

    Directory of Open Access Journals (Sweden)

    L. V. Golubeva

    2017-01-01

    Full Text Available Improving the food industry has led to a significant increase in the role of packaging in food production. At present, so-called "active packings" have appeared that have a positive effect on the product in contact with it, including through the use of antimicrobial additives. Work has been carried out on the use of a water-soluble form of chitosan in the technological process for the production of creamy butter "Krestyanskoe". The sample of chitosan was dissolved in drinking water with ascorbic acid (mass fraction 1%. The resulting chitosan solution was applied to the packaging material-aluminum laminated foil. Packaging is considered suitable for use after complete evaporation of moisture at room temperature from the surface of the material. The process of obtaining butter cream was carried out according to a conventional technological scheme by converting high-fat cream. It is determined that butter "Peasant" with chitosan is microbiologically more resistant than the control sample. The effect of the mass fraction of chitosan in the inner layer of the packaging material on the contacting product was experimentally established. It is established that the developed modified package allows to reduce the number of pathogens on the oil surface. In the course of storage, the control samples before the experimental ones showed the first signs of spoilage: an acidic unpleasant smell appeared and an aftertaste that sharply increased by the end of the storage period. The results of determining the organoleptic properties of the products correlated with physicochemical and microbiological indices. On the surface of the oil of the control samples, a more active development of yeast and mold fungi was observed. It is determined that the use of chitosan solution inhibits the development of mold fungi and yeast. The possibility of increasing the shelf life of butter "Peasant" in modified packaging by an average of 30% is proved.

  20. Carbon Nano tube Composites for Electronic Packaging Applications: A Review

    International Nuclear Information System (INIS)

    Aryasomayajula, L.; Wolter, K.J.

    2013-01-01

    Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nano tubes has opened new possibilities to face challenges better. Carbon Nano tubes are known for their high mechanical strength, excellent thermal and electrical properties. Recent research has made progress in fabricating carbon nano tube metal matrix and polymer-based composites. The methods of fabrication of these composites, their properties and possible applications restricted to the field of electronic packaging have been discussed in this paper. Experimental and theoretical calculations have shown improved mechanical and physical properties like tensile stress, toughness, and improved electrical and thermal properties. They have also demonstrated the ease of production of the composites and their adaptability as one can tailor their properties as per the requirement. This paper reviews work reported on fabricating and characterizing carbon- nano tube-based metal matrix and polymer composites. The focus of this paper is mainly to review the importance of these composites in the field of electronics packaging.

  1. Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

    Science.gov (United States)

    Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

    2012-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

  2. DEEP DRAWING TECHNOLOGY WITH WALL IRONING IN MASS PACKAGING INDUSTRY

    Directory of Open Access Journals (Sweden)

    Saša Ranđelović

    2017-04-01

    Full Text Available Aluminum is a metal that is being increasingly used in the packaging industry in the modern metal forming technology, but it also provides a good opportunity for effective advertising and product promotion. Processing technologies for aluminum plastic deformation ensure superior packaging that meets the most rigorous demands in the food, pharmaceutical, chemical, and other industries. It is the case of mass production with very little material loss that offers the possibility of multiple recycling. On the other hand, today's products for general purpose consumers cannot be imagined without aggressive advertising that has a major impact on customers. Modern graphics techniques for printing images and different basic surfaces offer great opportunities that manufacturers use widely in the promotion and sale of their products.

  3. Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

    Science.gov (United States)

    Bryant, Robert G.

    2007-01-01

    Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

  4. Accessible Electronic and Information Technology

    Science.gov (United States)

    This Policy establishes EPA's responsibilities and procedures for making its Electronic and Information Technology (EIT) products accessible to all people, including people with disabilities, in accordance with Section 508 of the Rehabilitation Act.

  5. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

  6. Thermal interface material characterization for cryogenic electronic packaging solutions

    Science.gov (United States)

    Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

    2017-12-01

    As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

  7. Benchmarking foreign electronics technologies

    Energy Technology Data Exchange (ETDEWEB)

    Bostian, C.W.; Hodges, D.A.; Leachman, R.C.; Sheridan, T.B.; Tsang, W.T.; White, R.M.

    1994-12-01

    This report has been drafted in response to a request from the Japanese Technology Evaluation Center`s (JTEC) Panel on Benchmarking Select Technologies. Since April 1991, the Competitive Semiconductor Manufacturing (CSM) Program at the University of California at Berkeley has been engaged in a detailed study of quality, productivity, and competitiveness in semiconductor manufacturing worldwide. The program is a joint activity of the College of Engineering, the Haas School of Business, and the Berkeley Roundtable on the International Economy, under sponsorship of the Alfred P. Sloan Foundation, and with the cooperation of semiconductor producers from Asia, Europe and the United States. Professors David A. Hodges and Robert C. Leachman are the project`s Co-Directors. The present report for JTEC is primarily based on data and analysis drawn from that continuing program. The CSM program is being conducted by faculty, graduate students and research staff from UC Berkeley`s Schools of Engineering and Business, and Department of Economics. Many of the participating firms are represented on the program`s Industry Advisory Board. The Board played an important role in defining the research agenda. A pilot study was conducted in 1991 with the cooperation of three semiconductor plants. The research plan and survey documents were thereby refined. The main phase of the CSM benchmarking study began in mid-1992 and will continue at least through 1997. reports are presented on the manufacture of integrated circuits; data storage; wireless technology; human-machine interfaces; and optoelectronics. Selected papers are indexed separately for inclusion in the Energy Science and Technology Database.

  8. The Next Technology Revolution - Nano Electronic Technology

    Science.gov (United States)

    Turlik, Iwona

    2004-03-01

    Nanotechnology is a revolutionary engine that will engender enormous changes in a vast majority of today's industries and markets, while potentially creating whole new industries. The impact of nanotechnology is particularly significant in the electronics industry, which is constantly driven by the need for higher performance, increased functionality, smaller size and lower cost. Nanotechnology can influence many of the hundreds of components that are typically assembled to manufacture modern electronic devices. Motorola manufactures electronics for a wide range of industries and communication products. In this presentation, the typical components of a cellular phone are outlined and technology requirements for future products, the customer benefits, and the potential impact of nanotechnology on many of the components are discussed. Technology needs include reliable materials supply, processes for high volume production, experimental and simulation tools, etc. For example, even routine procedures such as failure characterization may require the development of new tools for investigating nano-scale phenomena. Business needs include the development of an effective, high volume supply chain for nano-materials and devices, disruptive product platforms, and visible performance impact on the end consumer. An equally significant long-term industry need is the availability of science and engineering graduates with a multidisciplinary focus and a deep understanding of the fundamentals of nano-technology, that can harness the technology to create revolutionary products.

  9. Pilot Project Technology Business Case: Mobile Work Packages

    Energy Technology Data Exchange (ETDEWEB)

    Thomas, Ken [Idaho National Lab. (INL), Idaho Falls, ID (United States); Lawrie, Sean [ScottMadden, Inc., Raleigh, NC (United States); Niedermuller, Josef [ScottMadden, Inc., Raleigh, NC (United States)

    2015-05-01

    Performance advantages of the new pilot project technologies are widely acknowledged, but it has proven difficult for utilities to derive business cases for justifying investment in these new capabilities. Lack of a business case is often cited by utilities as a barrier to pursuing wide-scale application of digital technologies to nuclear plant work activities. The decision to move forward with funding usually hinges on demonstrating actual cost reductions that can be credited to budgets and thereby truly reduce O&M or capital costs. Technology enhancements, while enhancing work methods and making work more efficient, often fail to eliminate workload such that it changes overall staffing and material cost requirements. It is critical to demonstrate cost reductions or impacts on non-cost performance objectives in order for the business case to justify investment by nuclear operators. The Business Case Methodology (BCM) was developed in September of 2015 to frame the benefit side of II&C technologies to address the “benefit” side of the analysis—as opposed to the cost side—and how the organization evaluates discretionary projects (net present value (NPV), accounting effects of taxes, discount rates, etc.). The cost and analysis side is not particularly difficult for the organization and can usually be determined with a fair amount of precision (not withstanding implementation project cost overruns). It is in determining the “benefits” side of the analysis that utilities have more difficulty in technology projects and that is the focus of this methodology. The methodology is presented in the context of the entire process, but the tool provided is limited to determining the organizational benefits only. This report describes a the use of the BCM in building a business case for mobile work packages, which includes computer-based procedures and other automated elements of a work package. Key to those impacts will be identifying where the savings are

  10. Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

    Science.gov (United States)

    Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

    2012-01-01

    Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

  11. Package

    Directory of Open Access Journals (Sweden)

    Arsić Zoran

    2013-01-01

    Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

  12. Thermal expansion model for multiphase electronic packaging materials

    International Nuclear Information System (INIS)

    Allred, B.E.; Warren, W.E.

    1991-01-01

    Control of thermal expansion is often necessary in the design and selection of electronic packages. In some instances, it is desirable to have a coefficient of thermal expansion intermediate between values readily attainable with single or two phase materials. The addition of a third phase in the form of fillers, whiskers, or fibers can be used to attain intermediate expansions. To help design the thermal expansion of multiphase materials for specific applications, a closed form model has been developed that accurately predicts the effective elastic properties of isotropic filled materials and transversely isotropic lamina. Properties of filled matrix materials are used as inputs to the lamina model to obtain the composite elastic properties as a function of the volume fraction of each phase. Hybrid composites with two or more fiber types are easily handled with this model. This paper reports that results for glass, quartz, and Kevlar fibers with beta-eucryptite filled polymer matrices show good agreement with experimental results for X, Y, and Z thermal expansion coefficients

  13. A comparison and benchmark of two electron cloud packages

    Energy Technology Data Exchange (ETDEWEB)

    Lebrun, Paul L.G.; Amundson, James F; Spentzouris, Panagiotis G; Veitzer, Seth A

    2012-01-01

    We present results from precision simulations of the electron cloud (EC) problem in the Fermilab Main Injector using two distinct codes. These two codes are (i)POSINST, a F90 2D+ code, and (ii)VORPAL, a 2D/3D electrostatic and electromagnetic code used for self-consistent simulations of plasma and particle beam problems. A specific benchmark has been designed to demonstrate the strengths of both codes that are relevant to the EC problem in the Main Injector. As differences between results obtained from these two codes were bigger than the anticipated model uncertainties, a set of changes to the POSINST code were implemented. These changes are documented in this note. This new version of POSINST now gives EC densities that agree with those predicted by VORPAL, within {approx}20%, in the beam region. The root cause of remaining differences are most likely due to differences in the electrostatic Poisson solvers. From a software engineering perspective, these two codes are very different. We comment on the pros and cons of both approaches. The design(s) for a new EC package are briefly discussed.

  14. Interferometry for the LISA technology package (LTP) aboard SMART-2

    International Nuclear Information System (INIS)

    Heinzel, G; Braxmaier, C; Schilling, R; Ruediger, A; Robertson, D; Plate, M te; Wand, V; Arai, K; Johann, U; Danzmann, K

    2003-01-01

    The interferometer of the LISA technology package (LTP) on SMART-2 is needed to verify the performance of the gravitational sensors by monitoring the distance between two test masses with a noise level of 10 pm Hz -1/2 between 3 mHz and 30 mHz. It must continuously track the motion of the test mass distance while that distance changes by many μm with a speed of up to 20 μm s -1 , without losing track of the sign of the motion and without exerting any influence on the test masses that might lead to a motion above that level. As a result of a detailed comparison study, a heterodyne Mach-Zehnder interferometer was selected as the baseline for the SMART-2 mission. Its design and expected performance are described in this paper

  15. A QR code identification technology in package auto-sorting system

    Science.gov (United States)

    di, Yi-Juan; Shi, Jian-Ping; Mao, Guo-Yong

    2017-07-01

    Traditional manual sorting operation is not suitable for the development of Chinese logistics. For better sorting packages, a QR code recognition technology is proposed to identify the QR code label on the packages in package auto-sorting system. The experimental results compared with other algorithms in literatures demonstrate that the proposed method is valid and its performance is superior to other algorithms.

  16. Analysis of Design of Mixed-Signal Electronic Packaging

    National Research Council Canada - National Science Library

    Pileggi, Lawrence

    1999-01-01

    The objective of this project is to develop innovative algorithms and prototype tools that will help facilitate the design of mixed signal multi-chip modules and packaging in a manner that is similar...

  17. Sustainable packaging design for consumer electronics products: Balancing marketing, logistics and environmental requirements

    OpenAIRE

    Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

    2007-01-01

    Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of sophistication of data concerning a packagings marketing performance is limited, decisions are often strongly based on beliefs. This is reflected in inconsistencies in packaging that is currently in...

  18. The Packaging Technology Study on Smart Composite Structure Based on The Embedded FBG Sensor

    Science.gov (United States)

    Zhang, Youhong; Chang, Xinlong; Zhang, Xiaojun; He, Xiangyong

    2018-03-01

    It is convenient to carry out the health monitoring of the solid rocket engine composite shell based on the embedded FBG sensor. In this paper, the packaging technology using one-way fiber layer of prepreg fiberglass/epoxy resin was proposed. The proposed packaging process is simple, and the packaged sensor structure size is flexible and convenient to use, at the mean time, the packaged structure has little effect on the pristine composite material structure.

  19. A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages

    International Nuclear Information System (INIS)

    Kay, N.R.; Ghosh, S.; Guven, I.; Madenci, E.

    2006-01-01

    This study concerns the development of a combined experimental and analytical technique to determine the critical values of fracture parameters for interfaces between dissimilar materials in electronic packages. This technique utilizes specimens from post-production electronic packages. The mechanical testing is performed inside a scanning electron microscope while the measurements are achieved by means of digital image correlation. The measured displacements around the crack tip are used as the boundary conditions for the analytical model to compute the energy release rate. The critical energy release rate values obtained from post-production package specimens are obtained to be lower than those laboratory specimens

  20. Development of utility generic functional requirements for electronic work packages and computer-based procedures

    Energy Technology Data Exchange (ETDEWEB)

    Oxstrand, Johanna [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2017-06-01

    The Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative is a step toward a vision of implementing an eWP framework that includes many types of eWPs. This will enable immediate paper-related cost savings in work management and provide a path to future labor efficiency gains through enhanced integration and process improvement in support of the Nuclear Promise (Nuclear Energy Institute 2016). The NEWPER initiative was organized by the Nuclear Information Technology Strategic Leadership (NITSL) group, which is an organization that brings together leaders from the nuclear utility industry and regulatory agencies to address issues involved with information technology used in nuclear-power utilities. NITSL strives to maintain awareness of industry information technology-related initiatives and events and communicates those events to its membership. NITSL and LWRS Program researchers have been coordinating activities, including joint organization of NEWPER-related meetings and report development. The main goal of the NEWPER initiative was to develop a set of utility generic functional requirements for eWP systems. This set of requirements will support each utility in their process of identifying plant-specific functional and non-functional requirements. The NEWPER initiative has 140 members where the largest group of members consists of 19 commercial U.S. nuclear utilities and eleven of the most prominent vendors of eWP solutions. Through the NEWPER initiative two sets of functional requirements were developed; functional requirements for electronic work packages and functional requirements for computer-based procedures. This paper will describe the development process as well as a summary of the requirements.

  1. Non-destructive testing of electronic component packages

    International Nuclear Information System (INIS)

    Anderle, C.

    1975-01-01

    A non-destructive method of investigating packaged parts of semiconductor components by X radiation is described and the relevant theoretical relations limiting this technique are derived. The application of the technique is demonstrated in testing several components. The described method is iNsimple and quick. (author)

  2. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

    Directory of Open Access Journals (Sweden)

    Masaru Ishizuka

    2011-01-01

    Full Text Available In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

  3. Extension Learners' Use of Electronic Technology

    Science.gov (United States)

    Guenthner, Joseph F.; Swan, Benjamin G.

    2011-01-01

    Extension clientele use electronic technology for entertainment, communication, and business. Educational programs that use electronic technology can enhance learning. To learn more about use of electronic technology among Extension clientele, we surveyed 80 university students and 135 potato farmers. We found that the farmers were likely to use…

  4. The magnetic diagnostics subsystem of the LISA Technology Package

    Energy Technology Data Exchange (ETDEWEB)

    Diaz-Aguilo, M; Garcia-Berro, E [Departament de Fisica Aplicada, Universitat Politecnica de Catalunya, c/Esteve Terrades, 5, 08860 Castelldefels (Spain); Lobo, A; Mateos, N; Sanjuan, J, E-mail: marc.diaz.aguilo@fa.upc.ed [Institut d' Estudis Espacials de Catalunya, c/Gran Capita 2-4, Edif. Nexus 104, 08034 Barcelona (Spain)

    2010-05-01

    The Magnetic Diagnostics Subsystem of the LISA Technology Package (LTP) on board the LISA Pathfinder (LPF) spacecraft includes a set of four tri-axial fluxgate magnetometers, intended to measure with high precision the magnetic field at the positions they occupy. However, their readouts do not provide a direct measurement of the magnetic field at the positions of the test masses. Therefore, an interpolation method must be implemented to obtain this information. However, such interpolation process faces serious difficulties. Indeed, the size of the interpolation region is excessive for a linear interpolation to be reliable, and the number of magnetometer channels does not provide sufficient data to go beyond that poor approximation. Recent research points to a possible alternative to address the magnetic interpolation problem by means of neural network algorithms. The key point of this approach is the ability neural networks have to learn from suitable training data representing the magnetic field behaviour. Despite the large distance to the test masses and the insufficient magnetic readings, artificial neural networks are able to significantly reduce the estimation error to acceptable levels. The learning efficiency can be best improved by making use of data obtained from on-ground measurements prior to mission launch in all relevant satellite locations and under real operation conditions. Reliable information on that appears to be essential for a meaningful assessment of magnetic noise in the LTP.

  5. The magnetic diagnostics subsystem of the LISA Technology Package

    International Nuclear Information System (INIS)

    Diaz-Aguilo, M; Garcia-Berro, E; Lobo, A; Mateos, N; Sanjuan, J

    2010-01-01

    The Magnetic Diagnostics Subsystem of the LISA Technology Package (LTP) on board the LISA Pathfinder (LPF) spacecraft includes a set of four tri-axial fluxgate magnetometers, intended to measure with high precision the magnetic field at the positions they occupy. However, their readouts do not provide a direct measurement of the magnetic field at the positions of the test masses. Therefore, an interpolation method must be implemented to obtain this information. However, such interpolation process faces serious difficulties. Indeed, the size of the interpolation region is excessive for a linear interpolation to be reliable, and the number of magnetometer channels does not provide sufficient data to go beyond that poor approximation. Recent research points to a possible alternative to address the magnetic interpolation problem by means of neural network algorithms. The key point of this approach is the ability neural networks have to learn from suitable training data representing the magnetic field behaviour. Despite the large distance to the test masses and the insufficient magnetic readings, artificial neural networks are able to significantly reduce the estimation error to acceptable levels. The learning efficiency can be best improved by making use of data obtained from on-ground measurements prior to mission launch in all relevant satellite locations and under real operation conditions. Reliable information on that appears to be essential for a meaningful assessment of magnetic noise in the LTP.

  6. The development of MEMS device packaging technology using proton beam

    International Nuclear Information System (INIS)

    Hyeon, J. W.; Kong, Y. J.; Kim, E. H.; Kim, H. S.; No, S. J.

    2006-05-01

    Wafer-bonding techniques are key issues for the commercialization of MEMS(MicroElectroMechanical Systems) devices. The anodic bonding method and the wafer direct-bonding method are well-known major techniques for wafer bonding. Due to the anodic bonding method includes high voltage processes above 1.5 kV, the MEMS devices can be damaged during the bonding process or malfunctioned while long-term operation. On the other hand, since the wafer direct-bonding method includes a high temperature processes above 1000 .deg. C, temperature-sensitive materials and integrated circuits will be damaged or degraded during the bonding processes. Therefore, high-temperature bonding processes are not applicable for fabricating or packaging devices where temperature-sensitive materials exist. During the past few years, much effort has been undertaken to find a reliable bonding process that can be conducted at a low temperature. Unfortunately, these new bonding processes depend highly on the bonding material, surface treatment and surface flatness. In this research, a new packaging method using proton beam irradiation is proposed. While the energy loss caused in an irradiated material by X-rays or electron beams decreases with the surface distance, the energy loss caused by proton beams has a maximum value at the Bragg peak. Thus, the localized energy produced at the Bragg peak of the proton beams can be used to bond pyrex glass on a silicon wafer, so the MEMS damage is expected to be minimized. The localized heating caused by as well as the penetration depth, or the proton beam has been investigated. The energy absorbed in a stack of pyrex glass/silicon wafers due to proton-beam irradiation was numerically calculated for various proton energies by using the SRIM program. The energy loss was shown to be sufficiently localized at the interface between the pyrex glass and the silicon wafer. Proton beam irradiation was performed in the common environment of room temperature and

  7. Using computer technology to identify the appropriate radioactive materials packaging

    International Nuclear Information System (INIS)

    Driscoll, K.L.; Conan, M.R.

    1989-01-01

    The Radioactive Materials Packaging (RAMPAC) database is designed to store and retrieve information on all non-classified packages certified for the transport of radioactive materials within the boundaries of the US. The information in RAMPAC is publicly available, and the database has been designed so that individuals without programming experience can search for and retrieve information using a menu-driven system. RAMPAC currently contains information on over 650 radioactive material shipping packages. Information is gathered from the US Department of Energy (DOE), the US Department of transportation (DOT), and the US Nuclear Regulatory Commission (NRC). RAMPAC is the only tool available to radioactive material shippers that contains and reports packaging information from all three Federal Agencies. The DOT information includes package listings from Canada, France, Germany, Great Britain, and Japan, which have DOT revalidations for their certificates of competent authority and are authorized for use within the US for import and export shipments only. RAMPAC was originally developed in 1981 by DOE as a research and development tool. In recent years, however, RAMPAC has proven to be highly useful to operational personnel. As packages become obsolete or materials to be transported change, shippers of radioactive materials must be able to determine if alternative packages exist before designing new packages. RAMPAC is designed to minimize the time required to make this determination, thus assisting the operational community in meeting their goals

  8. Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology

    International Nuclear Information System (INIS)

    Wang, Jiachou; Li, Xinxin

    2013-01-01

    An on-chip integrated packaging-stress-suppressed suspension (PS 3 ) technology for a packaging-stress-free pressure sensor is proposed and developed. With a MIS (microholes interetch and sealing) micromachining process implemented only from the front-side of a single-side polished (1 1 1) silicon wafer, a compact cantilever-shaped PS 3 is on-chip integrated surrounding a piezoresistive pressure-sensing structure to provide a packaging-process/substrate-friendly method for low-cost but high-performance sensor applications. With the MIS process, the chip size of the PS 3 -enclosed pressure sensor is as small as 0.8 mm × 0.8 mm. Compared with a normal pressure sensor without PS 3 (but with an identical pressure-sensing structure), the proposed pressure sensor has the same sensitivity of 0.046 mV kPa −1 (3.3 V) −1 . However, without using the thermal compensation technique, a temperature coefficient of offset of only 0.016% °C −1 FS is noted for the sensor with PS 3 , which is about 15 times better than that for the sensor without PS 3 . Featuring effective isolation and elimination of the influence from packaging stress, the PS 3 technique is promising to be widely used for packaging-friendly mechanical sensors. (paper)

  9. Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

    Science.gov (United States)

    Kolacz, John S.; Clapper, Randy S.; Wade, Raymond P.

    2006-01-01

    The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

  10. Introduction and NASA Electronic Parts and Packaging (NEPP) Program Overview

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2014-01-01

    This presentation includes an introduction to the space radiation environment, the effects on electronics, the environment in action, flight projects, mission needs, and radiation hardness assurance (RHA).

  11. The NASA Electronic Parts and Packaging (NEPP) Program: An Overview

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    This presentation provides an overview of the NEPP Program. The NEPP Mission is to provide guidance to NASA for the selection and application of microelectronics technologies; Improve understanding of the risks related to the use of these technologies in the space environment; Ensure that appropriate research is performed to meet NASA mission assurance needs. NEPP's Goals are to provide customers with appropriate and cost-effective risk knowledge to aid in: Selection and application of microelectronics technologies; Improved understanding of risks related to the use of these technologies in the space environment; Appropriate evaluations to meet NASA mission assurance needs; Guidelines for test and application of parts technologies in space; Assurance infrastructure and support for technologies in use by NASA space systems.

  12. Smart Packaging Technologies and Their Application in Conventional Meat Packaging Systems

    Science.gov (United States)

    O'Grady, Michael N.; Kerry, Joseph P.

    Preservative packaging of meat and meat products should maintain acceptable appearance, odour and flavour and should delay the onset of microbial spoilage. Typically fresh red meats are placed on trays and over-wrapped with an oxygen permeable film or alternatively, meats are stored in modified atmosphere packages (MAP) containing high levels of oxygen and carbon dioxide (80% O2:20% CO2) (Georgala & Davidson, 1970). Cooked meats are usually stored in 70% N2:30% CO2 (Smiddy, Papkovsky, & Kerry, 2002). The function of oxygen in MAP is to maintain acceptable fresh meat colour and carbon dioxide inhibits the growth of spoilage bacteria (Seideman & Durland, 1984). Nitrogen is used as an inert filler gas either to reduce the proportions of the other gases or to maintain the pack shape (Bell & Bourke, 1996).

  13. Decontamination of food packaging using electron beam—status and prospects

    Science.gov (United States)

    Mittendorfer, J.; Bierbaumer, H. P.; Gratzl, F.; Kellauer, E.

    2002-03-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

  14. Decontamination of food packaging using electron beam--status and prospects

    Energy Technology Data Exchange (ETDEWEB)

    Mittendorfer, J. E-mail: htcmitt@eunet.at; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E

    2002-03-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

  15. Decontamination of food packaging using electron beam--status and prospects

    International Nuclear Information System (INIS)

    Mittendorfer, J.; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E.

    2002-01-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding

  16. Polymer dispensing and embossing technology for the lens type LED packaging

    Science.gov (United States)

    Chien, Chien-Lin Chang; Huang, Yu-Che; Hu, Syue-Fong; Chang, Chung-Min; Yip, Ming-Chuen; Fang, Weileun

    2013-06-01

    This study presents a ring-type micro-structure design on the substrate and its corresponding micro fabrication processes for a lens-type light-emitting diode (LED) package. The dome-type or crater-type silicone lenses are achieved by a dispensing and embossing process rather than a molding process. Silicone with a high viscosity and thixotropy index is used as the encapsulant material. The ring-type micro structure is adopted to confine the dispensed silicone encapsulant so as to form the packaged lens. With the architecture and process described, this LED package technology herein has three merits: (1) the flexibility of lens-type LED package designs is enhanced; (2) a dome-type package design is used to enhance the intensity; (3) a crater-type package design is used to enhance the view angle. Measurement results show the ratio between the lens height and lens radius can vary from 0.4 to 1 by changing the volume of dispensed silicone. The view angles of dome-type and crater-type packages can reach 155° ± 5° and 175° ± 5°, respectively. As compared with the commercial plastic leaded chip carrier-type package, the luminous flux of a monochromatic blue light LED is improved by 15% by the dome-type package (improved by 7% by the crater-type package) and the luminous flux of a white light LED is improved by 25% by the dome-type package (improved by 13% by the crater-type package). The luminous flux of monochromatic blue light LED and white light LED are respectively improved by 8% and 12% by the dome-type package as compare with the crater-type package.

  17. Packaged solar water heating technology: twenty years of progress

    International Nuclear Information System (INIS)

    Morrison, Graham; Wood, Byard

    2000-01-01

    The world market for packaged solar water heaters is reviewed, and descriptions are given of the different types of solar domestic water heaters (SDWH), design concepts for packaged SDWH, thermosyphon SDWH, evacuated insulation and excavated tube collectors, seasonally biased solar collectors, heat pump water heaters, and photovoltaic water heaters. The consumer market value for SDWHs is explained, and the results of a survey of solar water heating are summarised covering advantages, perceived disadvantages, the relative importance of purchase decision factors, experience with system components, and the most frequent maintenance problems. The durability, reliability, and performance of SDWHs are discussed

  18. Package Technology for Manufacture of Caprolactam Developed by SINOPEC Commands Internationally Leading Position

    Institute of Scientific and Technical Information of China (English)

    2008-01-01

    @@ In October one of SINOPEC's ten core projects to be tackled- "Development of package technology for the 140kt/a caprolactam unit" had passed the technical appraisal organized by the SINOPEC Group.This package technology integrates new techniques relating to the production of cyclohexanone via oxidation of ethylene oxide,the production of cyclohexanone-oxime through ammoximation of cyclohexanone,the triple rearrangement of cyclohexanoneoxime,and the purification ofcaprolactam.The overall package technology has reached the internationally advanced level with independent intellectual property rights,and has filed or has been granted a lot of Chinese and overseas patents.This package technology has been successfully adopted in commercial scale at the Baling Petrochemical Company.

  19. Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

    Science.gov (United States)

    Ren, Huai-Hui; Wang, Xi-Shu

    2014-04-01

    This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

  20. Physical packaging and organization of the drift chamber electronics system for the Stanford Large Detector

    International Nuclear Information System (INIS)

    Haller, G.M.; Freytag, M.L.; Mazaheri, G.; Olsen, J.; Paffrath, L.

    1990-10-01

    In this paper the logical organization, physical packaging, and operation of the drift chamber electronics for the SLD at SLAC is described. The system processes signals from approximately 7000 drift wires and is unusual in that most electronic functions are packaged on printed circuit boards within the detector. The circuits reside on signal-processing motherboards, controller boards, signal-transition boards, power-distribution boards, and fiber-optics-to-electrical conversion boards. The interaction and interconnection of these boards with respect to signal and control flow are presented. 11 refs., 7 figs

  1. Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

    Energy Technology Data Exchange (ETDEWEB)

    Kuper, Cameron Mathias [Univ. of New Mexico, Albuquerque, NM (United States)

    2015-12-10

    The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

  2. Development in Electronic Packaging – Moving to 3D System Configuration

    Directory of Open Access Journals (Sweden)

    I. Szendiuch

    2011-04-01

    Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

  3. System issues for multichip packaging

    Science.gov (United States)

    Sage, Maurice G.; Hartley, Neil

    1991-04-01

    It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

  4. Technology station in electronics at the Tshwane University of Technology: strengthening technological innovation activities amongst SMEs and students

    CSIR Research Space (South Africa)

    Jacobs, SJ

    2009-01-01

    Full Text Available that technology and science are closely intertwined (Gibbons et a/., 1994). Thus in this mode of the production of knowledge, innovation is often a process of moving back and forth between invention and/or design, development and testing, redesign... through-hole components and Component identification hardware, surface-mount components, surface-mount IC chip components, Metal Electrode Faces (MELFs), Small Outline Transistors (SOTs) and Discrete Packaging (DPAK). Handling in electronics assembly...

  5. Electron grafted barrier coatings for packaging film modification

    International Nuclear Information System (INIS)

    Rangwalla, I.J.; Nablo, S.V.

    1993-01-01

    The O 2 barrier performance of organosilane films, coated, dried and electron beam grafted to polyolefin film has been studied. Excellent anti-scalping properties based upon limonene (dipentene) transmission measurements have also been observed. Results are also reported on O 2 permeability reduction when the process is applied to common barrier polymers such as EVOH and acrylonitrile. Experience with its in-line application on LDPE is discussed. (author)

  6. Potential application of UV radiation processing in electronic packaging

    International Nuclear Information System (INIS)

    Ng Chee Mang; Lim Yoke Keem; Kumar, R.N.

    1999-01-01

    UV-curable epoxies have been formulated for use in place of the established heat cure epoxy systems for coating, adhesion and encapsulation of electronic devices. The UV-cured epoxy systems can be formulated to give comparable or even better physical and chemical properties than the more common heat cured systems. The UV systems offer significant advantage in very fast cure and hence very short production cycle time. UV systems can also be formulated to give desired properties of increased strength, high Tg, increased humidity resistance and improved temperature cycling performance

  7. Technological challenges of addressing new and more complex migrating products from novel food packaging materials.

    Science.gov (United States)

    Munro, Ian C; Haighton, Lois A; Lynch, Barry S; Tafazoli, Shahrzad

    2009-12-01

    The risk assessment of migration products resulting from packaging material has and continues to pose a difficult challenge. In most jurisdictions, there are regulatory requirements for the approval or notification of food contact substances that will be used in packaging. These processes generally require risk assessment to ensure safety concerns are addressed. The science of assessing food contact materials was instrumental in the development of the concept of Threshold of Regulation and the Threshold of Toxicological Concern procedures. While the risk assessment process is in place, the technology of food packaging continues to evolve to include new initiatives, such as the inclusion of antimicrobial substances or enzyme systems to prevent spoilage, use of plastic packaging intended to remain on foods as they are being cooked, to the introduction of more rigid, stable and reusable materials, and active packaging to extend the shelf-life of food. Each new technology brings with it the potential for exposure to new and possibly novel substances as a result of migration, interaction with other chemical packaging components, or, in the case of plastics now used in direct cooking of products, degradation products formed during heating. Furthermore, the presence of trace levels of certain chemicals from packaging that were once accepted as being of low risk based on traditional toxicology studies are being challenged on the basis of reports of adverse effects, particularly with respect to endocrine disruption, alleged to occur at very low doses. A recent example is the case of bisphenol A. The way forward to assess new packaging technologies and reports of very low dose effects in non-standard studies of food contact substances is likely to remain controversial. However, the risk assessment paradigm is sufficiently robust and flexible to be adapted to meet these challenges. The use of the Threshold of Regulation and the Threshold of Toxicological Concern concepts may

  8. Sustainable packaging design for consumer electronics products : Balancing marketing, logistics and environmental requirements

    NARCIS (Netherlands)

    Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

    2007-01-01

    Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of

  9. The commoditization of consumer electronics products and its influence on packaging design

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    The traditional purpose of packaging for consumer electronics (CE) products was to get them in one piece from the factory to the consumers home. It was purely focused on the physical distribution. In that time, buying a CE product could be considered a major family investment. However, times have

  10. The NASA Electronic Parts and Packaging (NEPP) Program - Presentation to Korean Aerospace Research Institute

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.

  11. Demonstration of a Prototype Hydrogen Sensor and Electronics Package - Progress Report 2

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-06-14

    This is the second progress report on the demonstration of a prototype hydrogen sensor and electronics package. It goes into detail about the five tasks, four of which are already completed as of August 2016, with the final to be completed by January 26, 2017. Then the budget is detailed along with the planned work for May 27, 2016 to July 27, 2016.

  12. Radiation cross-linked plastics: a versatile material solution for packaging, automotive, Electrotechnic and Electronics

    International Nuclear Information System (INIS)

    Rouif, Sophie

    2004-01-01

    Used since the beginning of the 1970s for the production of halogen-free and heat-resistant cables and wires, for conditioning polyethylene hot-water pipes or for the manufacture of heat shrinkable tubes and of tyres, radiation cross-linking is developing fastly today on the scale of plastic-moulded parts, and not only by the mean of EB, but also under gamma rays. Indeed, it improves considerably the performances of a great number of plastics among thermoplastics, elastomers and thermoplastic elastomers (TPE). Radiation cross-linking reinforces the dimensional stability of polymers in chemically aggressive and high-temperature conditions. Radiation cross-linked-based engineering plastics offers OEM and end users in many branches of industry both technical and economical advantages in comparison with high-performances plastics. They constitute a technical and economical compromise between engineering plastics that failed and high-performances plastic, often over-tailored and expensive. This modern industrial technology gives way to new applications and perspectives in various sectors (packaging, automotive, electrotechnic and electronics, including connectors, surface-mounted devices, integrated circuits, 3D-MID, etc.) that are described in the paper

  13. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  14. Strategic Business-IT alignment of application software packages: Bridging the Information Technology gap

    Directory of Open Access Journals (Sweden)

    Wandi Kruger

    2012-09-01

    Full Text Available An application software package implementation is a complex endeavour, and as such it requires the proper understanding, evaluation and redefining of the current business processes to ensure that the implementation delivers on the objectives set at the start of the project. Numerous factors exist that may contribute to the unsuccessful implementation of application software packages. However, the most significant contributor to the failure of an application software package implementation lies in the misalignment of the organisation’s business processes with the functionality of the application software package. Misalignment is attributed to a gap that exists between the business processes of an organisation and what functionality the application software package has to offer to translate the business processes of an organisation into digital form when implementing and configuring an application software package. This gap is commonly referred to as the information technology (IT gap. This study proposes to define and discuss the IT gap. Furthermore this study will make recommendations for aligning the business processes with the functionality of the application software package (addressing the IT gap. The end result of adopting these recommendations will be more successful application software package implementations.

  15. Polymer electronics a flexible technology

    CERN Document Server

    Technology, Rapra

    2009-01-01

    The worldwide market for polymer electronic products has been estimated to be worth up to £15 billion by 2015 and the opportunity for new markets could be as high as £125 billion by 2025.'The rapid development of polymer electronics has revealed the possibility for transforming the electronics market by offering lighter, flexible and more cost effective alternatives to conventional materials and products. With applications ranging from printed, flexible conductors and novel semiconductor components to intelligent labels and large area displays and solar panels, products that were previously un

  16. Sensors and packages based on LTCC and thick-film technology for ...

    Indian Academy of Sciences (India)

    Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a ...

  17. A computer code package for Monte Carlo photon-electron transport simulation Comparisons with experimental benchmarks

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    2000-01-01

    A computer code package (PTSIM) for particle transport Monte Carlo simulation was developed using object oriented techniques of design and programming. A flexible system for simulation of coupled photon, electron transport, facilitating development of efficient simulation applications, was obtained. For photons: Compton and photo-electric effects, pair production and Rayleigh interactions are simulated, while for electrons, a class II condensed history scheme was considered, in which catastrophic interactions (Moeller electron-electron interaction, bremsstrahlung, etc.) are treated in detail and all other interactions with reduced individual effect on electron history are grouped together using continuous slowing down approximation and energy straggling theories. Electron angular straggling is simulated using Moliere theory or a mixed model in which scatters at large angles are treated as distinct events. Comparisons with experimentally benchmarks for electron transmission and bremsstrahlung emissions energy and angular spectra, and for dose calculations are presented

  18. Plasma Wave Electronic Terahertz Technology

    National Research Council Canada - National Science Library

    Shur, Michael

    2003-01-01

    Plasma waves are oscillations of electron density in time and space. In deep submicron field effect transistors plasma wave frequencies lie in the terahertz range and can be tuned by applied gate bias...

  19. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  20. Health Instruction Packages: Medical Technologies--EEG, Radiology, & Biomedical Photography.

    Science.gov (United States)

    Brittenham, Dorothea; And Others

    Text, illustrations, and exercises are utilized in this set of four learning modules to instruct medical technology students in a variety of job-related skills. The first module, "EEG Technology: Measurement Technique of the 'International 10-20 System'" by Dorothea Brittenham, describes a procedure used by electroencephalograph…

  1. Technology scan for electronic toll collection.

    Science.gov (United States)

    2008-06-01

    The purpose of this project was to identify and assess available technologies and methodologies for electronic toll collection (ETC) and to develop recommendations for the best way(s) to implement toll collection in the Louisville metropolitan area. ...

  2. Industrial applications of electron beam technology

    International Nuclear Information System (INIS)

    Khairul Zaman Mohd Dahlan

    1997-01-01

    Electron beam technology was first introduced in Malaysia in 1989 with the conclusion of the bilateral cooperation between the Malaysian Institute for Nuclear Technology Research (MINT) and Japan International Co-operation Agency (JICA) on Radiation Application Projects. Two electron beam accelerators with energy of 3.0 MeV and 200 keV were installed at MINT. These two accelerators pave the way for R and D to be carried out in radiation processing of polymers for cross-linking and surface curing. In 1994, another electron beam accelerator was installed in the private sector for cross-linking of home appliance wires. Since then, two more accelerators were installed in the private sector for cross-linking of heat shrinkable plastic films. Recently, a local company has acquired a low energy electron beam machine for cross-linking of plastic film. Within a period of 7 years, industrial applications of electron beam technology in Malaysia have increased significantly

  3. Electronic Nose Technology and its Applications

    Directory of Open Access Journals (Sweden)

    Esmaeil MAHMOUDI

    2009-08-01

    Full Text Available In the past decade, Electronic Nose instrumentation has generated much interest internationally for its potential to solve a wide variety of problems in fragrance and cosmetics production, food and beverages manufacturing, chemical engineering, environmental monitoring and more recently medical diagnostic, bioprocesses and clinical diagnostic plant diseases. This instrument measure electrical resistance changes generated by adsorption of volatiles to the surface of electro active- polymer coated sensor- unique digital electronic fingerprint of aroma derived from multi-sensor- responses to distinct mixture of microbial volatiles. Major advances in information and gas sensor technology could enhance the diagnostic power of future bio-electronic nose and facilitate global surveillance mode of disease control and management. Several dozen companies are now designed and selling electronic nose units globally for a wide variety of expending markets. The present review includes principles of electronic nose technology, biosensor structure and applications of electronic nose in many fields.

  4. Design Brief--Packaging: More than Just a Box! Communications: Getting the Message across with Advertising. Technology Learning Activities.

    Science.gov (United States)

    Technology Teacher, 1991

    1991-01-01

    Each technology learning activity in this article includes content description, objectives, required materials, challenge, and evaluation questions. Subjects are designing product packages and communication through advertising. (SK)

  5. penORNL: a parallel Monte Carlo photon and electron transport package using PENELOPE

    International Nuclear Information System (INIS)

    Bekar, Kursat B.; Miller, Thomas Martin; Patton, Bruce W.; Weber, Charles F.

    2015-01-01

    The parallel Monte Carlo photon and electron transport code package penORNL was developed at Oak Ridge National Laboratory to enable advanced scanning electron microscope (SEM) simulations on high-performance computing systems. This paper discusses the implementations, capabilities and parallel performance of the new code package. penORNL uses PENELOPE for its physics calculations and provides all available PENELOPE features to the users, as well as some new features including source definitions specifically developed for SEM simulations, a pulse-height tally capability for detailed simulations of gamma and x-ray detectors, and a modified interaction forcing mechanism to enable accurate energy deposition calculations. The parallel performance of penORNL was extensively tested with several model problems, and very good linear parallel scaling was observed with up to 512 processors. penORNL, along with its new features, will be available for SEM simulations upon completion of the new pulse-height tally implementation.

  6. Packaging and testing of multi-wavelength DFB laser array using REC technology

    Science.gov (United States)

    Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guanghui; Luan, Jia

    2014-02-01

    Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310 nm and 8-channel @1550 nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35 dB average Side Mode Suppression Ratio (SMSR). When I=35 mA, we obtain the total output power of 1 mW for 4-channel @1310 nm, and 227 μw for 8-channel @1550 nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10 G or even 8×10 G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.

  7. Test facilities for radioactive material transport packages (AEA Technology, Winfrith, UK)

    International Nuclear Information System (INIS)

    Burgess, M.H.

    1991-01-01

    Transport packages for radioactive materials are tested to demonstrate compliance with national and international regulations. The involvement of AEA Technology is traced from the establishment of the early IAEA Regulations. Transport package design, testing, assessment and approval requires a wide variety of skills and facilities. The comprehensive capability of AEA Technology in these areas is described with references to practical experience in the form of a short bibliography. The facilities described include drop-test cranes and targets (up to 700te); air guns for impacts up to sonic velocities; pool fires, furnaces and rigs for thermal tests including heat dissipation on prototype flasks; shielding facilities and instruments; criticality simulations and leak test instruments. These are illustrated with photographs demonstrating the comprehensive nature of package testing services supplied to customers. (author)

  8. Technological Innovations in the Food Packaging: a case study of adoption of active packaging in coffee roaster companies

    Directory of Open Access Journals (Sweden)

    Mário Otávio Batalha

    2010-12-01

    Full Text Available Most of technological innovations in agro-food systems are created by “supporting industries”, the group where packaging industries are inserted. This article presents the packaging innovations used in food industries, particularly, the active packaging. This paper deals with an adoption case of a degassing one-way valve, describing this innovation and its impacts in two coffee companies. This study can be classified as a documental, qualitative-descriptive and empirical research, using indirect documentation technique and case study analysis. According to this case, the valve made possible the diversification of the company product line and product quality improvement. There were no complications involving an additional cost to the customers. However, it has been observed that this additional cost from technology adoption makes difficult the diffusion of this valve in other similar products.Grande parcela das inovações tecnológicas dos sistemas agroindustriais é gerada pelas “indústrias de apoio”, grupo no qual as indústrias de embalagens se inserem. Esse artigo discute as inovações em embalagens destinadas à indústria de alimentos, em especial as chamadas embalagens ativas. Discute-se o caso de adoção da válvula unidirecional de alívio de gases, descrevendo a inovação e seus impactos em duas indústria processadoras de café nas empresas. A pesquisa desenvolvida é de ordem documental e qualitativo-descritiva de caráter empírica, usando técnica de análise de documentação indireta e estudo de caso . No caso abordado, a válvula possibilitou a diversificação da linha de produtos e o incremento da sua qualidade, não havendo complicações no que se refere ao repasse do custo adicional para o consumidor desse produto. Contudo, verifica-se que esse custo adicional da adoção da tecnologia dificulta a difusão da válvula em produtos similares.

  9. Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

    International Nuclear Information System (INIS)

    Hoshi, T; Fujiwara, T

    2009-01-01

    An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

  10. Some thermo-electromagnetic applications to fusion technology of a general purpose CAD package

    International Nuclear Information System (INIS)

    Girdinio, P.; Molfino, P.; Molinari, G.; Raia, G.; Rosatelli, F.; Viviani, A.

    1985-01-01

    A general purpose CAD package is applied to the solution of problems related to fusion technology. The problems solved are the interacting electromagnetic and thermal fields in a resistive toroidal coil and the design of the poloidal field coils in Tokamak machines. In both cases, the procedure used is reported and the results obtained are displayed and discussed

  11. Some thermo-electromagnetic applications to fusion technology of a general purpose CAD package

    International Nuclear Information System (INIS)

    Girdinio, P.; Molfino, P.; Molinari, G.; Viviani, A.; Raia, G.; Rosatelli, F.

    1984-01-01

    A general purpose CAD package is applied to the solution of problems related to fusion technology. The problems solved are the interacting electromagnetic and thermal fields in a resistive toroidal coil and the design of the poloidal field coils in Tokamak machines. In both cases, the procedure used is reported and the results obtained are displayed and discussed. (author)

  12. [Evaluation and selection of VOCs treatment technologies in packaging and printing industry].

    Science.gov (United States)

    Wang, Hai-Lin; Wang, Jun-Hui; Zhu, Chun-Lei; Nie, Lei; Hao, Zheng-Ping

    2014-07-01

    Volatile organic compounds (VOCs) play an important role in urban air pollution. Activities of industries including the packaging and printing industries are regarded as the major sources. How to select the suitable treating techniques is the major problem for emission control. In this article, based on the VOCs emission characteristics of the packaging and printing industry and the existing treatment technologies, using the analytic hierarchy process (AHP) model, an evaluation system for VOCs selection was established and all the technologies used for treatment were assessed. It showed that the priority selection was in the following order: Carbon Fiber Adsorption-Desorption > Granular Carbon Adsorption-Desorption > Thermal Combustion > Regenerative Combustion > Catalytic combustion > Rotary adsorption-concentration and combustion > Granular Carbon adsorption-concentration and combustion. Carbon Fiber Adsorption-Desorption was selected as the best available technology due to its highest weight among those technologies.

  13. ADVANCED TECHNOLOGIES OF ELECTRONIC EDUCATIONAL SYSTEMS DEVELOPMENT

    Directory of Open Access Journals (Sweden)

    M. Shishkina

    2011-11-01

    Full Text Available Actual problems and contradictions of electronic educational systems development are described: availability of education, quality of educational services; individualization of education; exposures and advantages in using of computer technology; standardization of technologies and resources. Tendencies of their solution in the view of development of new advanced technologies of e-education are specified. The essence and advantages of using the cloud computing technologies as a new platform of distributed learning are specified. Advanced directions of cloud-based data usage in executive system of education are declared: access management, content management, asset management, communications management.

  14. Meat Quality Assessment by Electronic Nose (Machine Olfaction Technology

    Directory of Open Access Journals (Sweden)

    Sundar Balasubramanian

    2009-07-01

    Full Text Available Over the last twenty years, newly developed chemical sensor systems (so called “electronic noses” have made odor analyses possible. These systems involve various types of electronic chemical gas sensors with partial specificity, as well as suitable statistical methods enabling the recognition of complex odors. As commercial instruments have become available, a substantial increase in research into the application of electronic noses in the evaluation of volatile compounds in food, cosmetic and other items of everyday life is observed. At present, the commercial gas sensor technologies comprise metal oxide semiconductors, metal oxide semiconductor field effect transistors, organic conducting polymers, and piezoelectric crystal sensors. Further sensors based on fibreoptic, electrochemical and bi-metal principles are still in the developmental stage. Statistical analysis techniques range from simple graphical evaluation to multivariate analysis such as artificial neural network and radial basis function. The introduction of electronic noses into the area of food is envisaged for quality control, process monitoring, freshness evaluation, shelf-life investigation and authenticity assessment. Considerable work has already been carried out on meat, grains, coffee, mushrooms, cheese, sugar, fish, beer and other beverages, as well as on the odor quality evaluation of food packaging material. This paper describes the applications of these systems for meat quality assessment, where fast detection methods are essential for appropriate product management. The results suggest the possibility of using this new technology in meat handling.

  15. Meat quality assessment by electronic nose (machine olfaction technology).

    Science.gov (United States)

    Ghasemi-Varnamkhasti, Mahdi; Mohtasebi, Seyed Saeid; Siadat, Maryam; Balasubramanian, Sundar

    2009-01-01

    Over the last twenty years, newly developed chemical sensor systems (so called "electronic noses") have made odor analyses possible. These systems involve various types of electronic chemical gas sensors with partial specificity, as well as suitable statistical methods enabling the recognition of complex odors. As commercial instruments have become available, a substantial increase in research into the application of electronic noses in the evaluation of volatile compounds in food, cosmetic and other items of everyday life is observed. At present, the commercial gas sensor technologies comprise metal oxide semiconductors, metal oxide semiconductor field effect transistors, organic conducting polymers, and piezoelectric crystal sensors. Further sensors based on fibreoptic, electrochemical and bi-metal principles are still in the developmental stage. Statistical analysis techniques range from simple graphical evaluation to multivariate analysis such as artificial neural network and radial basis function. The introduction of electronic noses into the area of food is envisaged for quality control, process monitoring, freshness evaluation, shelf-life investigation and authenticity assessment. Considerable work has already been carried out on meat, grains, coffee, mushrooms, cheese, sugar, fish, beer and other beverages, as well as on the odor quality evaluation of food packaging material. This paper describes the applications of these systems for meat quality assessment, where fast detection methods are essential for appropriate product management. The results suggest the possibility of using this new technology in meat handling.

  16. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  17. Advanced thermal management technologies for defense electronics

    Science.gov (United States)

    Bloschock, Kristen P.; Bar-Cohen, Avram

    2012-05-01

    Thermal management technology plays a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. For the past decade, and particularly, the past 4 years, the Defense Advanced Research Projects Agency (DARPA) has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT). An overview of the TMT program will be presented with emphasis on the goals and status of these efforts relative to the current State-of-the-Art. The presentation will close with future challenges and opportunities in the thermal management of defense electronics.

  18. Test facilities for radioactive material transport packages (AEA Technology plc, Winfrith,UK)

    International Nuclear Information System (INIS)

    Gillard, J.E.

    2001-01-01

    Transport containers for radioactive materials are tested to demonstrate compliance with national and international standards. Transport package design, testing, assessment and approval requires a wide range of skills and facilities. The comprehensive capability of AEA Technology in these areas is described. The facilities described include drop-test cranes and targets (up to 700 tonne); pool fires, furnaces and rigs for thermal tests, including heat dissipation on prototype flasks; shielding facilities; criticality simulations and leak test techniques. These are illustrated with photographs demonstrating the comprehensive nature of package testing services supplied to customers. (author)

  19. Test facilities for radioactive material transport packages (AEA Technology plc, Winfrith,UK)

    Energy Technology Data Exchange (ETDEWEB)

    Gillard, J.E

    2001-07-01

    Transport containers for radioactive materials are tested to demonstrate compliance with national and international standards. Transport package design, testing, assessment and approval requires a wide range of skills and facilities. The comprehensive capability of AEA Technology in these areas is described. The facilities described include drop-test cranes and targets (up to 700 tonne); pool fires, furnaces and rigs for thermal tests, including heat dissipation on prototype flasks; shielding facilities; criticality simulations and leak test techniques. These are illustrated with photographs demonstrating the comprehensive nature of package testing services supplied to customers. (author)

  20. Literacity: A multimedia adult literacy package combining NASA technology, recursive ID theory, and authentic instruction theory

    Science.gov (United States)

    Willis, Jerry; Willis, Dee Anna; Walsh, Clare; Stephens, Elizabeth; Murphy, Timothy; Price, Jerry; Stevens, William; Jackson, Kevin; Villareal, James A.; Way, Bob

    1994-01-01

    An important part of NASA's mission involves the secondary application of its technologies in the public and private sectors. One current application under development is LiteraCity, a simulation-based instructional package for adults who do not have functional reading skills. Using fuzzy logic routines and other technologies developed by NASA's Information Systems Directorate and hypermedia sound, graphics, and animation technologies the project attempts to overcome the limited impact of adult literacy assessment and instruction by involving the adult in an interactive simulation of real-life literacy activities. The project uses a recursive instructional development model and authentic instruction theory. This paper describes one component of a project to design, develop, and produce a series of computer-based, multimedia instructional packages. The packages are being developed for use in adult literacy programs, particularly in correctional education centers. They use the concepts of authentic instruction and authentic assessment to guide development. All the packages to be developed are instructional simulations. The first is a simulation of 'finding a friend a job.'

  1. Applications and technology of electron beam accelerators

    International Nuclear Information System (INIS)

    Sethi, R.C.

    2005-01-01

    Traditionally, accelerators have been employed for pursuing research in basic sciences. But over the last couple of decades their uses have proliferated into the applied fields as well. The major credit for which goes to the electron beams. Electron beams or the radiations generated by them are being extensively used in almost all the applied areas. This article is a brief account of the impact made by the accelerator based electron beams and the attempts initiated by DAE for building a base in this technology. (author)

  2. Vault Nanoparticles Packaged with Enzymes as an Efficient Pollutant Biodegradation Technology.

    Science.gov (United States)

    Wang, Meng; Abad, Danny; Kickhoefer, Valerie A; Rome, Leonard H; Mahendra, Shaily

    2015-11-24

    Vault nanoparticles packaged with enzymes were synthesized as agents for efficiently degrading environmental contaminants. Enzymatic biodegradation is an attractive technology for in situ cleanup of contaminated environments because enzyme-catalyzed reactions are not constrained by nutrient requirements for microbial growth and often have higher biodegradation rates. However, the limited stability of extracellular enzymes remains a major challenge for practical applications. Encapsulation is a recognized method to enhance enzymatic stability, but it can increase substrate diffusion resistance, lower catalytic rates, and increase the apparent half-saturation constants. Here, we report an effective approach for boosting enzymatic stability by single-step packaging into vault nanoparticles. With hollow core structures, assembled vault nanoparticles can simultaneously contain multiple enzymes. Manganese peroxidase (MnP), which is widely used in biodegradation of organic contaminants, was chosen as a model enzyme in the present study. MnP was incorporated into vaults via fusion to a packaging domain called INT, which strongly interacts with vaults' interior surface. MnP fused to INT and vaults packaged with the MnP-INT fusion protein maintained peroxidase activity. Furthermore, MnP-INT packaged in vaults displayed stability significantly higher than that of free MnP-INT, with slightly increased Km value. Additionally, vault-packaged MnP-INT exhibited 3 times higher phenol biodegradation in 24 h than did unpackaged MnP-INT. These results indicate that the packaging of MnP enzymes in vault nanoparticles extends their stability without compromising catalytic activity. This research will serve as the foundation for the development of efficient and sustainable vault-based bioremediation approaches for removing multiple contaminants from drinking water and groundwater.

  3. Linac technology for free-electron lasers

    International Nuclear Information System (INIS)

    Cooper, R.K.; Morton, P.L.; Wilson, P.B.; Keefe, D.; Faltens, A.

    1983-01-01

    The purpose of this paper is to concentrate on the properties of high-energy electron linear accelerators for use in free-electron lasers operating principally in the Compton regime. To fix our focus somewhat, we shall consider electron energies in the 20- to 200-MeV range and consider requirements for high-power free-electron lasers operating in the 0.5- to 10-μm range. Preliminary remarks are made on high-power free-electron laser amplifiers and oscillators and some desirable characteristics of the linacs that deliver electron beams for these devices. Both the high peak-current requirements of the amplifier and the high pulse-repetition frequency requirements of the oscillator can be met by present-day linac technology, although not necessarily by the same machine. In this papers second and third section, the technology of two rather different types of linear accelerators, the rf linac and the induction linac, is reviewed. In conclusion, applications to the Free Electron Lasers are stated

  4. Technology and applications of electron accelerator

    International Nuclear Information System (INIS)

    Natsir, M.

    1998-01-01

    Technology of electron accelerator have been developed so fast in advanced countries. It was applied in the research and development (R and D) and comercially in various industries. The industries applying electron accelerator includes polymers industry, sterilization of medical tools, material surface modification, and environmental management. The radiation process using electron beam is an ionization radiation process. Two facilities of electron accelerator have been established in pilot scale at the Centre for the Application of Isotope and Radiation CAIR-BATAN, Jakarta, for the RandD of radiation process technology and in demonstrating the electron accelerator application in industry in Indonesia. The first has low energy specification of 300 keV, 50 mA, EPS-300 type and the second has medium energy specification of 2 MeV, 10 mA dynamitron model GJ-2 type. Both the electron accelerators have an electron penetration depth capability of 0.6 and 12 mm, respectively, for the double side irradiation in the materials with density of 1 g/cm 3 . They also highly capacity production and electron beam cross-section of 120 cm length and 10 cm width. The beam will go through the atmosphere for irradiation samples or industrial products. The radiation dose can be selected precisely by adjusting the electron beam current and conveyor speed. Both of these facilities were applied in many aspects RandD, for examples dosimetry, wood surface coating, cross-linking of polymer, heatshrincable tube, polymer grafting, plastic degradation, food preservation, sterilization and so on. Engineering factors of radiation design process and general observation of electron accelerator application in RandD for various industries in Indonesia are briefly discussed

  5. AlN 3D Thermal Packaging, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This proposal addresses the need for compact, lightweight packaging to cool high heat producing electronics. Technology Assessment & Transfer, Inc. (TA&T)...

  6. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and the New Tenets for Cost Conscious Mission Assurance on Electrical, Electronic, and Electromechanical (EEE) Parts

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2015-01-01

    The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.

  7. Fatigue failure of pb-free electronic packages under random vibration loads

    Science.gov (United States)

    Saravanan, S.; Prabhu, S.; Muthukumar, R.; Gowtham Raj, S.; Arun Veerabagu, S.

    2018-03-01

    The electronic equipment are used in several fields like, automotive, aerospace, consumer goods where they are subjected to vibration loads leading to failure of solder joints used in these equipment. This paper presents a methodology to predict the fatigue life of Pb-free surface mounted BGA packages subjected to random vibrations. The dynamic characteristics of the PCB, such as the natural frequencies, mode shapes and damping ratios were determined. Spectrum analysis was used to determine the stress response of the critical solder joint and the cumulative fatigue damage accumulated by the solder joint for a specific duration was determined.

  8. Determinants of Adoption of Wheat Production Technology Package by Smallholder Farmers: Evidences from Eastern Ethiopia

    Directory of Open Access Journals (Sweden)

    Degefu Kebede

    2017-03-01

    Full Text Available A study was conducted to analyze factors influencing adoption of wheat technology packages by smallholder farmers in Gurawa, Meta and Habro districts in eastern Ethiopia. The analysis was based on a household survey data collected from 136 randomly selected households. A Two-limit Tobit model was used to elucidate factors affecting adoption of technology packages measured based on an index derived from five components of wheat technologies which included row planting, pesticide application, use of improved varieties, and application of inorganic fertilizers, namely, Diammonium Phosphate (DAP and Urea. Among the variables included in the model, variation in district, gender, age of the household head, education status of the household head, farm size, distance to market, distance to FTC (Farmers’ Training Centers, cooperative membership, dependency ratio, and annual income of the households were found to significantly affect the adoption of wheat technology packages. Policy makers, planners and development practitioners should give due attention to these determinants to support smallholder farmers in wheat production and enhance gains derived from it.

  9. The NASA Electronic Parts and Packaging (NEPP) Program: NEPP Overview - Automotive Electronics

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    The results of NASAs studies into the appropriateness of using U.S. Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Council's AECQ standardization program, the second part provides a summary of the results of NASA's procurement and testing experiences and other lessons learned along with preliminary test results.

  10. Technical Support Document: 50% Energy Savings Design Technology Packages for Highway Lodging Buildings

    Energy Technology Data Exchange (ETDEWEB)

    Jiang, Wei; Gowri, Krishnan; Lane, Michael D.; Thornton, Brian A.; Rosenberg, Michael I.; Liu, Bing

    2009-09-28

    This Technical Support Document (TSD) describes the process, methodology and assumptions for development of the 50% Energy Savings Design Technology Packages for Highway Lodging Buildings, a design guidance document intended to provide recommendations for achieving 50% energy savings in highway lodging properties over the energy-efficiency levels contained in ANSI/ASHRAE/IESNA Standard 90.1-2004, Energy Standard for Buildings Except Low-Rise Residential Buildings.

  11. Research and Application of WCF Technology in Data Acquisition of Ultra-high Speed Packaging Machine

    Directory of Open Access Journals (Sweden)

    Qian Jie

    2016-01-01

    Full Text Available By introducing WCF technology on data acquisition of ultra-high speed packaging machine, data acquisition system reads dates of machine in polling mode through the WCF client, which can achieve accurate data collection, and effectively isolate the data acquisition system and the machine control system. It enhances the security of data interaction between systems, but also reduces the coupling degree between systems.

  12. CEPXS/ONELD: A one-dimensional coupled electron-photon discrete ordinates code package

    International Nuclear Information System (INIS)

    Lorence, L.J. Jr.; Morel, J.E.

    1992-01-01

    CEPXS/ONELD is a discrete ordinates transport code package that can model the electron-photon cascade from 100 MeV to 1 keV. The CEPXS code generates fully-coupled multigroup-Legendre cross section data. This data is used by the general-purpose discrete ordinates code, ONELD, which is derived from the Los Alamos ONEDANT and ONBTRAN codes. Version 1.0 of CEPXS/ONELD was released in 1989 and has been primarily used to analyze the effect of radiation environments on electronics. Version 2.0 is under development and will include user-friendly features such as the automatic selection of group structure, spatial mesh structure, and S N order

  13. Control Technologies for Room Air-conditioner and Packaged Air-conditioner

    Science.gov (United States)

    Ito, Nobuhisa

    Trends of control technologies about air-conditioning machineries, especially room or packaged air conditioners, are presented in this paper. Multiple air conditioning systems for office buildings are mainly described as one application of the refrigeration cycle control technologies including sensors for thermal comfort and heating/ cooling loads are also described as one of the system control technologies. Inverter systems and related technologies for driving variable speed compressors are described in both case of including induction motors and brushless DC motors. Technologies for more accurate control to meet various kind of regulations such as ozone layer destruction, energy saving and global warming, and for eliminating harmonic distortion of power source current, as a typical EMC problem, will be urgently desired.

  14. Electron gun for technological linear accelerator

    International Nuclear Information System (INIS)

    Khodak, I.V.; Kushnir, V.A.; Mirochenko, V.V.; Stepin, D.L.; Zavada, L.M.

    2000-01-01

    The work is purposed to the design of diode electron gun for powerful technologic electron linac and to experimental investigations of the beam parameters at the gun exit.The gun feature is the quick cathode replacement.This is very impotent for operating of the accelerator.The gun optics and beam parameters were calculated using the EGUN code.Beam parameters were investigated as at the special test stand so as component of the linac injector.The gun produces the beam current of 2 A at the anode voltage 25 kV.Measured beam parameters correspond to calculated results

  15. Organic electronics emerging concepts and technologies

    CERN Document Server

    Santato, Clara

    2013-01-01

    An overview of the tremendous potential of organic electronics, concentrating on those emerging topics and technologies that will form the focus of research over the next five to ten years. The young and energetic team of editors with an excellent research track record has brought together internationally renowned authors to review up-and-coming topics, some for the first time, such as organic spintronics, iontronics, light emitting transistors, organic sensors and advanced structural analysis. As a result, this book serves the needs of experienced researchers in organic electronics, graduate

  16. Photonics and nanophotonics and information and communication technologies in modern food packaging.

    Science.gov (United States)

    Sarapulova, Olha; Sherstiuk, Valentyn; Shvalagin, Vitaliy; Kukhta, Aleksander

    2015-01-01

    The analysis of the problem of conjunction of information and communication technologies (ICT) with packaging industry and food production was made. The perspective of combining the latest advances of nanotechnology, including nanophotonics, and ICT for creating modern smart packaging was shown. There were investigated luminescent films with zinc oxide nanoparticles, which change luminescence intensity as nano-ZnO interacts with decay compounds of food products, for active and intelligent packaging. High luminescent transparent films were obtained from colloidal suspension of ZnO and polyvinylpyrrolidone (PVP). The influence of molecular mass, concentration of nano-ZnO, and film thickness on luminescent properties of films was studied in order to optimize the content of the compositions. The possibility of covering the obtained films with polyvinyl alcohol was considered for eliminating water soluble properties of PVP. The luminescent properties of films with different covers were studied. The insoluble in water composition based on ZnO stabilized with colloidal silicon dioxide and PVP in polymethylmethacrylate was developed, and the luminescent properties of films were investigated. The compositions are non-toxic, safe, and suitable for applying to the inner surface of active and intelligent packaging by printing techniques, such as screen printing, flexography, inkjet, and pad printing.

  17. Photonics and Nanophotonics and Information and Communication Technologies in Modern Food Packaging

    Science.gov (United States)

    Sarapulova, Olha; Sherstiuk, Valentyn; Shvalagin, Vitaliy; Kukhta, Aleksander

    2015-05-01

    The analysis of the problem of conjunction of information and communication technologies (ICT) with packaging industry and food production was made. The perspective of combining the latest advances of nanotechnology, including nanophotonics, and ICT for creating modern smart packaging was shown. There were investigated luminescent films with zinc oxide nanoparticles, which change luminescence intensity as nano-ZnO interacts with decay compounds of food products, for active and intelligent packaging. High luminescent transparent films were obtained from colloidal suspension of ZnO and polyvinylpyrrolidone (PVP). The influence of molecular mass, concentration of nano-ZnO, and film thickness on luminescent properties of films was studied in order to optimize the content of the compositions. The possibility of covering the obtained films with polyvinyl alcohol was considered for eliminating water soluble properties of PVP. The luminescent properties of films with different covers were studied. The insoluble in water composition based on ZnO stabilized with colloidal silicon dioxide and PVP in polymethylmethacrylate was developed, and the luminescent properties of films were investigated. The compositions are non-toxic, safe, and suitable for applying to the inner surface of active and intelligent packaging by printing techniques, such as screen printing, flexography, inkjet, and pad printing.

  18. Electron Beam Technology for Environmental Pollution Control.

    Science.gov (United States)

    Chmielewski, Andrzej G; Han, Bumsoo

    2016-10-01

    Worldwide, there are over 1700 electron beam (EB) units in commercial use, providing an estimated added value to numerous products, amounting to 100 billion USD or more. High-current electron accelerators are used in diverse industries to enhance the physical and chemical properties of materials and to reduce undesirable contaminants such as pathogens, toxic byproducts, or emissions. Over the past few decades, EB technologies have been developed aimed at ensuring the safety of gaseous and liquid effluents discharged to the environment. It has been demonstrated that EB technologies for flue gas treatment (SO x and NO x removal), wastewater purification, and sludge hygienization can be effectively deployed to mitigate environmental degradation. Recently, extensive work has been carried out on the use of EB for environmental remediation, which also includes the removal of emerging contaminants such as VOCs, endocrine disrupting chemicals (EDCs), and potential EDCs.

  19. Electronics, information, Communication and high technology

    International Nuclear Information System (INIS)

    1999-11-01

    The contents of this book are summary of investigation, investigation system, purpose of investigation, characteristic of this investigation, important studying and development filed, compare of the level of research and development, policy, characteristic of the respondent, a future illustration in 2025 cause of hindrance of realization, propel method of research and development, the prediction of the realization period the result of investigation in electronics, information communication and high technology.

  20. The Intelligent Technologies of Electronic Information System

    Science.gov (United States)

    Li, Xianyu

    2017-08-01

    Based upon the synopsis of system intelligence and information services, this paper puts forward the attributes and the logic structure of information service, sets forth intelligent technology framework of electronic information system, and presents a series of measures, such as optimizing business information flow, advancing data decision capability, improving information fusion precision, strengthening deep learning application and enhancing prognostic and health management, and demonstrates system operation effectiveness. This will benefit the enhancement of system intelligence.

  1. 29 CFR 1615.135 - Electronic and information technology requirements.

    Science.gov (United States)

    2010-07-01

    ... 29 Labor 4 2010-07-01 2010-07-01 false Electronic and information technology requirements. 1615... INFORMATION TECHNOLOGY § 1615.135 Electronic and information technology requirements. (a) Development, procurement, maintenance, or use of electronic and information technology.—When developing, procuring...

  2. Ferroelectric Electron Emission Principles and Technology

    CERN Document Server

    Riege, H

    1997-01-01

    The spontaneous electrical polarization of ferroelectric materials can be changed either by reversal or by phase transition from a ferroelectric into a non-ferroelectric state or vice versa. If spontaneous polarization changes are induced with fast heat, mechanical pressure, laser or electric field pulses on a submicrosecond time scale, strong uncompensated surface charge densities and related polarization fields are generated, which may lead to the intense self-emission of electrons from the negatively charged free surface areas of the ferroelectric sample. Hence, electron guns can be built with extraction-field-free ferroelectric cathodes, which may be easily separated from the high-field regions of post-accelerating gap structures. The intensity, the energy, the temporal and spatial distribution, and the repetitition rate of the emitted electron beams can be controlled within wide limits via the excitation pulses and external focusing and accelerating electromagnetic fields. The technological advantages an...

  3. Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

  4. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  5. Packaging Concerns/Techniques for Large Devices

    Science.gov (United States)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  6. Availability, Price, and Packaging of Electronic Cigarettes and E-Liquids in Guatemala City Retailers.

    Science.gov (United States)

    Chacon, Violeta; Arriaza, Astrid; Cavazos-Rehg, Patricia; Barnoya, Joaquin

    2018-01-05

    Electronic cigarettes (e-cigarettes) have the potential to normalize smoking and undermine tobacco control efforts. However, if well regulated, they also have a potential as smoking cessation aids. This study sought to determine the availability and types of e-cigarettes and e-liquids in Guatemala. We also assessed packaging characteristics and price. We surveyed a convenient sample of 39 Guatemala City retailers and purchased all e-cigarettes and e-liquids available. Duplicate samples (same brand, e-liquid type, flavor, nicotine content, or packaging) were purchased when prices were different between each other. Country of manufacture, flavor, expiration date, nicotine concentration, and price were recorded. We also documented package marketing strategies and warning labels. We purchased 64 e-cigarettes (53 unique and 11 duplicates) and 57 e-liquids (52 unique and 5 duplicates), mostly found on mall retailers. Most e-cigarettes (42, 66%) were first generation, followed by second (18, 28%) and third generations (4, 6%). Price of e-cigarettes differed significantly by generation. Most e-cigarettes (31, 58%) and 24 (46%) e-liquids did not include warning labels. Nicotine content was reported in 21 (39%) e-cigarettes that included e-liquids and 41 (79%) e-liquids' packages. E-cigarettes and e-liquids are available among a variety of retailers in Guatemala City and the industry is taking advantage of the fact that they are not regulated (eg, health claims, minimum sales age, and taxation). Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. To the best of our knowledge, this is the first study describing e-cigarettes and e-liquids available in retailers in a low/middle-income country like Guatemala. E-cigarettes and e-liquids were found in a variety of types, flavors, and nicotine concentrations in Guatemalan retailers. Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. © The Author

  7. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  8. Electrical and electronic principles and technology

    CERN Document Server

    John Bird

    2013-01-01

    This much-loved textbook introduces electrical and electronic principles and technology to students who are new to the subject. Real-world situations and engineering examples put the theory into context. The inclusion of worked problems with solutions really help aid your understanding and further problems then allow you to test and confirm you have mastered each subject. In total the books contains 410 worked problems, 540 further problems, 340 multiple-choice questions, 455 short-answer questions, and 7 revision tests with answers online.This an ideal text for vocational courses enabling a s

  9. 48 CFR 1352.239-71 - Electronic and information technology.

    Science.gov (United States)

    2010-10-01

    ... Electronic and information technology. As prescribed in 48 CFR 1339.270(a), insert the following provision: Electronic and Information Technology (APR 2010) (a) To be considered eligible for award, offerors must propose electronic and information technology (EIT) that meet the applicable Access Board accessibility...

  10. On-orbit alignment and diagnostics for the LISA Technology Package

    International Nuclear Information System (INIS)

    MarIn, A F GarcIa; Wand, V; Steier, F; Cervantes, F Guzman; Bogenstahl, J; Jennrich, O; Heinzel, G; Danzmann, K

    2006-01-01

    This paper presents a procedure to perform fully autonomous on-orbit alignment of the interferometer on board the LISA Technology Package (LTP). LTP comprises two free-floating test masses as inertial sensors that additionally serve as end mirrors of a set of interferometers. From the output signals of the interferometers, a subset has been selected to obtain alignment information of the test masses. Based on these signals, an alignment procedure was developed and successfully tested on the engineering model of the optical bench. Furthermore, operation procedures for the characterization of critical on-orbit properties of the optical metrology system (e.g. fibre noise) have been established

  11. LTP - LISA technology package: Development challenges of a spaceborne fundamental physics experiment

    International Nuclear Information System (INIS)

    Gerndt, R

    2009-01-01

    The LISA Technology Package (LTP) is the main payload onboard the LISA Pathfinder Spacecraft. The LTP Instrument together with the Drag-Free Attitude Control System (DFACS) and the respective LTP and DFACS operational software forms the LTP Experiment. It is completed by the FEEPs of the LPF spacecraft that are controlled by DFACS in order to control the spacecraft's attitude along with the experiment's needs. This article concentrates on aspects of the Industrial development of the LTP Instrument items and on essential performance issues of LTP. Examples of investigations on specific issue will highlight the kind of special problems to be solved for LTP in close cooperation with the Scientific Community.

  12. On interactions between Packaging and Logistics - Exploring implications of technological developments

    OpenAIRE

    Hellström, Daniel

    2007-01-01

    Packaging is a fundamental element in logistics systems. Packaging not only affects every logistical activity; it is also recognised as having a significant impact on logistics costs and performance. In order for logisticians and packaging professionals to gain insight into packaging-dependent costs and performance, the interactions between packaging systems and logistics systems must be understood. This is instead of dividing packaging and logistics into separate systems which are analysed o...

  13. Electron beam irradiation technology for environmental conservation

    International Nuclear Information System (INIS)

    Tokunaga, Okihiro; Arai, Hidehiko; Hashimoto, Shoji

    1992-01-01

    This paper reviews research and development of application of electron beam (EB) irradiation technology for treatment of flue gas and waste water, and for disinfection of sewage sludge. Feasibility studies on EB purification of flue gases have been performed with pilot-scale experiments in Japan, the USA and Germany, and is being carried out in Poland for flue gases from iron-sintering furnaces or coal burning boilers. Based on results obtained by experiments using simulated flue gas, pilot scale test for treatment of flue gas of low-sulfur containing coal combustion has recently started in Japan. Organic pollutants in waste water and ground water have been found to be decomposed by EB irradiation. Synergetic effect of EB irradiation and ozone addition was found to improve the decomposition efficiency. Electron beam irradiation technology for disinfection of water effluent from water treatment plants was found to avoid formation of chlorinated organic compounds which are formed in using chlorine. Efficient process for composting of sewage sludge disinfected by EB irradiation has been developed by small scale and pilot scale experiments. In the new process, disinfection by EB irradiation and composing can be done separately and optimum temperature for composting can be, therefore, selected to minimize period of composting. (author)

  14. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Yongcun; Liu, Feng, E-mail: liufeng@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi' an Shaanxi 710072 (China)

    2016-08-22

    The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.

  15. Advances in superconducting materials and electronics technologies

    International Nuclear Information System (INIS)

    Palmer, D.N.

    1990-01-01

    Technological barriers blocking the early implementation of ceramic oxide high critical temperature [Tc] and LHe Nb based superconductors are slowly being dismantled. Spearheading these advances are mechanical engineers with diverse specialties and creative interests. As the technology expands, most engineers have recognized the importance of inter-disciplinary cooperation. Cooperation between mechanical engineers and material and system engineers is of particular importance. Recently, several problems previously though to be insurmountable, has been successfully resolved. These accomplishment were aided by interaction with other scientists and practitioners, working in the superconductor research and industrial communities, struggling with similar systems and materials problems. Papers published here and presented at the 1990 ASME Winter Annual Meeting held in Dallas, Texas 25-30 November 1990 can be used as a bellwether to gauge the progress in the development of both ceramic oxide and low temperature Nb superconducting device and system technologies. Topics are focused into two areas: mechanical behavior of high temperature superconductors and thermal and mechanical problems in superconducting electronics

  16. Innovative food processing technology using ohmic heating and aseptic packaging for meat.

    Science.gov (United States)

    Ito, Ruri; Fukuoka, Mika; Hamada-Sato, Naoko

    2014-02-01

    Since the Tohoku earthquake, there is much interest in processed foods, which can be stored for long periods at room temperature. Retort heating is one of the main technologies employed for producing it. We developed the innovative food processing technology, which supersede retort, using ohmic heating and aseptic packaging. Electrical heating involves the application of alternating voltage to food. Compared with retort heating, which uses a heat transfer medium, ohmic heating allows for high heating efficiency and rapid heating. In this paper we ohmically heated chicken breast samples and conducted various tests on the heated samples. The measurement results of water content, IMP, and glutamic acid suggest that the quality of the ohmically heated samples was similar or superior to that of the retort-heated samples. Furthermore, based on the monitoring of these samples, it was observed that sample quality did not deteriorate during storage. © 2013. Published by Elsevier Ltd on behalf of The American Meat Science Association. All rights reserved.

  17. Environmental applications of electron-beam technology

    International Nuclear Information System (INIS)

    Pikaev, A.K.

    2001-01-01

    The main directions of modern environmental applications of electron-beam technology are the following: 1) treatment of polluted natural and drinking water, municipal and industrial wastewater, other liquid wastes; 2) purification of gases; 3) treatment of sewage sludges; 4) treatment of solid wastes (medical wastes, contaminated soil and so on). In some cases, the results of respective researches and developments found a large-scale application. For example, recently several industrial plants for electron-beam purification of flue gases of thermal power plants from SO2 and NOx were created in China, Poland and Japan. In the report, a brief summary of the most important results obtained in the mentioned directions will be presented. A special attention will be paid to the data in the first direction. In particular, the recent results on radiation treatment of some liquid systems obtained in the laboratory under author's leadership will be considered. One of them is water polluted with petroleum products (motor oil, diesel fuel, residual fuel oil). The pollutants were present in water in dissolved form and as a separate phase. It was found that irradiation (dose 25-40 kGy) decomposes and removes the pollutants as a precipitate. The second system is natural oil gas consisting of gaseous and low-boiling hydrocarbons, water and so on. Laboratory- and pilot-scale (with electron accelerator of 0.7 MeV and 30 kW) studies have shown that electron-beam treatment (in a recycling regime with continuous sampling the liquid phase) of this gas leads to the formation of a mixture of liquid branched hydrocarbons, alcohols, ethers and so on, i.e., there is a radiation-induced liquefaction of the natural oil gas. The mechanism of radiolytic conversions occurring in the mentioned systems will be discussed

  18. Packaging for consumer electronic products: The need for integrating design and engineering

    OpenAIRE

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of packaging for CE goods would imply a process that takes into account all requirements, whether they are technical, financial, environmental or psychological in nature, and that also incorporates the rel...

  19. Determining the feasibility of objective adherence measurement with blister packaging smart technology.

    Science.gov (United States)

    van Onzenoort, Hein A; Neef, Cees; Verberk, Willem W; van Iperen, H Peter; de Leeuw, Peter W; van der Kuy, Paul-Hugo M

    2012-05-15

    The results of a feasibility study of blister-pack smart technology for monitoring medication adherence are reported. Research in the area of objective therapy compliance measurement has led to the development of microprocessor-driven systems that record the time a unit dose is removed from blister packaging. One device under development is the Smart Blister-a label imprinted with event-detection circuitry that can be affixed to standard commercial blister cards. In the first trial of the device in actual clinical practice, 115 community-dwelling Dutch patients receiving valsartan maintenance therapy (160 mg once daily) were given 14-day blister packages equipped with the Smart Blister. On the return of empty blister cards to the 20 participating community pharmacies, the stored information was scanned and downloaded for data analysis and patient counseling purposes. A total of 245 Smart Blister-equipped packages were used by valsartan recipients during the eight-month study. The device was largely effective in recording patient and blister-card identification data and other desired information. However, in 17% of cases, the Smart Blister system registered multiple tablet-removal events at the same time, presumably indicating unintentional breakage of nearby conductive circuits and the need for design refinements. The Smart Blister-equipped medication cards were generally well received by patients and pharmacies. An evaluation of the functionality and robustness of the Smart Blister in a real-world clinical practice situation yielded some promising results, but the findings also indicated a need for design refinements and additional performance testing of the device.

  20. Technology Acceptance of Electronic Medical Records by Nurses

    Science.gov (United States)

    Stocker, Gary

    2010-01-01

    The purpose of this study was to evaluate the Technology Acceptance Model's (TAM) relevance of the intention of nurses to use electronic medical records in acute health care settings. The basic technology acceptance research of Davis (1989) was applied to the specific technology tool of electronic medical records (EMR) in a specific setting…

  1. Performance characteristics of the 12 GHz, 200 watt Transmitter Experiment Package for CTS. [Communication Technology Satellite

    Science.gov (United States)

    Miller, E. F.; Fiala, J. L.; Hansen, I. G.

    1975-01-01

    Measured performance characteristics from ground test of the Transmitter Experiment Package (TEP) for the Communications Technology Satellite are presented. The experiment package consists of a 200 W Output Stage Tube (OST) powered by a Power Processing System (PPS). Descriptions of both the PPS and OST are given. The PPS provides the necessary voltages with a measured dc/dc conversion efficiency of 89 per cent. The OST, a traveling wave tube with multiple collectors, has a saturated rf output power of 224 W and operates at an overall efficiency exceeding 40 per cent over an 85 MHz bandwidth at 12 GHz. OST performance given includes frequency response, saturation characteristics, group delay, AM to PM conversion, intermodulation distortion, and two channel gain suppression. Single and dual channel FM video performance is presented. It was determined that for 12 MHz peak to peak frequency deviation on each channel, dual channel FM television signals can be transmitted through the TEP at 60 W, each channel, with 40 MHz channel spacing (center to center).

  2. Board Level Proton Testing Book of Knowledge for NASA Electronic Parts and Packaging Program

    Science.gov (United States)

    Guertin, Steven M.

    2017-01-01

    This book of knowledge (BoK) provides a critical review of the benefits and difficulties associated with using proton irradiation as a means of exploring the radiation hardness of commercial-off-the-shelf (COTS) systems. This work was developed for the NASA Electronic Parts and Packaging (NEPP) Board Level Testing for the COTS task. The fundamental findings of this BoK are the following. The board-level test method can reduce the worst case estimate for a board's single-event effect (SEE) sensitivity compared to the case of no test data, but only by a factor of ten. The estimated worst case rate of failure for untested boards is about 0.1 SEE/board-day. By employing the use of protons with energies near or above 200 MeV, this rate can be safely reduced to 0.01 SEE/board-day, with only those SEEs with deep charge collection mechanisms rising this high. For general SEEs, such as static random-access memory (SRAM) upsets, single-event transients (SETs), single-event gate ruptures (SEGRs), and similar cases where the relevant charge collection depth is less than 10 µm, the worst case rate for SEE is below 0.001 SEE/board-day. Note that these bounds assume that no SEEs are observed during testing. When SEEs are observed during testing, the board-level test method can establish a reliable event rate in some orbits, though all established rates will be at or above 0.001 SEE/board-day. The board-level test approach we explore has picked up support as a radiation hardness assurance technique over the last twenty years. The approach originally was used to provide a very limited verification of the suitability of low cost assemblies to be used in the very benign environment of the International Space Station (ISS), in limited reliability applications. Recently the method has been gaining popularity as a way to establish a minimum level of SEE performance of systems that require somewhat higher reliability performance than previous applications. This sort of application of

  3. Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

    International Nuclear Information System (INIS)

    Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung-hyun; Nah, Jae-Woong; Paik, Kyung-Wook; Kwon, Dongil

    2004-01-01

    Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 deg. C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA)

  4. Packaging for consumer electronic products : The need for integrating design and engineering

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of

  5. Radioactive waste package assay facility. Volume 1. Application of assay technology

    International Nuclear Information System (INIS)

    Findlay, D.J.S.; Green, T.H.; Molesworth, T.V.; Staniforth, D.; Strachan, N.R.; Rogers, J.D.; Wise, M.O.; Forrest, K.R.

    1992-01-01

    This report, in three volumes, covers the work carried out by Taylor Woodrow Construction Ltd., and two major sub-contractors: Harwell Laboratory (AEA Technology) and Siemens Plessey Controls Ltd., on the development of a radioactive waste package assay facility, for cemented 500 litre intermediate level waste drums. In volume 1, the reasons for assay are considered together with the various techniques that can be used, and the information that can be obtained. The practical problems associated with the use of the various techniques in an integrated assay facility are identified, and the key parameters defined. Engineering and operational features are examined and provisional designs proposed for facilities at three throughput levels: 15,000, 750 and 30 drums per year respectively. The capital and operating costs for such facilities have been estimated. A number of recommendations are made for further work. 16 refs., 14 figs., 13 tabs

  6. LTP - LISA technology package: Development challenges of a spaceborne fundamental physics experiment

    Energy Technology Data Exchange (ETDEWEB)

    Gerndt, R, E-mail: ruediger.gerndt@astrium.eads.ne [Astrium Satellites GmbH, Claude-Dornier-Str., 88090 Immenstaad (Germany)

    2009-03-01

    The LISA Technology Package (LTP) is the main payload onboard the LISA Pathfinder Spacecraft. The LTP Instrument together with the Drag-Free Attitude Control System (DFACS) and the respective LTP and DFACS operational software forms the LTP Experiment. It is completed by the FEEPs of the LPF spacecraft that are controlled by DFACS in order to control the spacecraft's attitude along with the experiment's needs. This article concentrates on aspects of the Industrial development of the LTP Instrument items and on essential performance issues of LTP. Examples of investigations on specific issue will highlight the kind of special problems to be solved for LTP in close cooperation with the Scientific Community.

  7. Electron-processing technology: A promising application for the viscose industry

    Science.gov (United States)

    Stepanik, T. M.; Rajagopal, S.; Ewing, D.; Whitehouse, R.

    1998-06-01

    In marketing its IMPELA ® line of high power, high-throughput industrial accelerators, Atomic Energy of Canada Limited (AECL) is working with viscose (rayon) companies world-wide to integrate electron-processing technology as part of the viscose manufacturing process. The viscose industry converts cellulose wood pulp into products such as staple fiber, filament, cord, film, packaging, and non-edible sausage casings. This multibillion dollar industry is currently suffering from high production costs, and is facing increasingly stringent environmental regulations. The use of electron-treated pulp can significantly lower production costs and can provide equally significant environmental benefits. This paper describes our current understanding of the benefits of using electron-treated pulp in this process, and AECL's efforts in developing this technology.

  8. Application of the Technology Acceptance Model (TAM) in electronic ...

    African Journals Online (AJOL)

    Application of the Technology Acceptance Model (TAM) in electronic ticket purchase for ... current study examined the perceived usefulness and ease of use of online technology ... The findings are discussed in the light of these perspectives.

  9. QMCPACK: an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

    Science.gov (United States)

    Kim, Jeongnim; Baczewski, Andrew D.; Beaudet, Todd D.; Benali, Anouar; Chandler Bennett, M.; Berrill, Mark A.; Blunt, Nick S.; Josué Landinez Borda, Edgar; Casula, Michele; Ceperley, David M.; Chiesa, Simone; Clark, Bryan K.; Clay, Raymond C., III; Delaney, Kris T.; Dewing, Mark; Esler, Kenneth P.; Hao, Hongxia; Heinonen, Olle; Kent, Paul R. C.; Krogel, Jaron T.; Kylänpää, Ilkka; Li, Ying Wai; Lopez, M. Graham; Luo, Ye; Malone, Fionn D.; Martin, Richard M.; Mathuriya, Amrita; McMinis, Jeremy; Melton, Cody A.; Mitas, Lubos; Morales, Miguel A.; Neuscamman, Eric; Parker, William D.; Pineda Flores, Sergio D.; Romero, Nichols A.; Rubenstein, Brenda M.; Shea, Jacqueline A. R.; Shin, Hyeondeok; Shulenburger, Luke; Tillack, Andreas F.; Townsend, Joshua P.; Tubman, Norm M.; Van Der Goetz, Brett; Vincent, Jordan E.; ChangMo Yang, D.; Yang, Yubo; Zhang, Shuai; Zhao, Luning

    2018-05-01

    QMCPACK is an open source quantum Monte Carlo package for ab initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater–Jastrow type trial wavefunctions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary-field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performance computing architectures, including multicore central processing unit and graphical processing unit systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://qmcpack.org.

  10. Advanced Image Processing Package for FPGA-Based Re-Programmable Miniature Electronics

    National Research Council Canada - National Science Library

    Ovod, Vladimir I; Baxter, Christopher R; Massie, Mark A; McCarley, Paul L

    2005-01-01

    .... An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical background...

  11. Successful completion of the development and testing of a coal to fuel cell grade hydrogen technology package for New Zealand

    Energy Technology Data Exchange (ETDEWEB)

    Anthony H. Clemens; Tana P. Levi; Robert S. Whitney; Alister I. Gardiner

    2009-07-01

    A technology package for the production, from New Zealand lignite, of high purity hydrogen suitable for use in an alkaline fuel cell has been successfully developed and tested. The technology involves the integration of an air-blown 1 tonne per day fluidised bed gasifier with a range of downstream syngas clean-up components leading to the fuel cell. The development of the technology package was built on earlier work that showed New Zealand lignites to be among the most reactive in the world and well suited to fluidised bed gasification. The reason for their high reactivity was shown to be due to the presence of ion-exchanged calcium within the lignite structure. The clean-up line is comprised of some commonly used 'off the shelf' technologies. These include a cyclone and Venturi scrubber for particulate and condensables capture respectively and a high temperature water gas shift reactor. It also contains a less commonly used counterflow caustic wash packed column for H{sub 2}S removal and an experimental membrane for final hydrogen separation. The clean-up line is constructed so that it may be used to testbed other new syngas clean-up technologies. The paper describes the new technology package, considers several issues that arose during its development and how these were addressed. It also considers the future development of the technology including co-gasification with biomass and conversion to an oxygen blown unit for synfuel production. 20 refs., 4 figs., 1 tab.

  12. Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

    Energy Technology Data Exchange (ETDEWEB)

    Hoshi, T [Department of Applied Mathematics and Physics, Tottori University, Tottori 680-8550 (Japan); Fujiwara, T [Core Research for Evolutional Science and Technology, Japan Science and Technology Agency (CREST-JST) (Japan)

    2009-02-11

    An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

  13. Values of Modern Technology to Electronic Media Management in ...

    African Journals Online (AJOL)

    This paper examines the influence, impact and communicative values of modern technology to electronic media management in Nigeria. It evaluates changes in distribution and consumer technologies, the impact on media content, new business models for the electronic media, and concludes with a discussion of issues ...

  14. 48 CFR 311.7000 - Defining electronic information technology requirements.

    Science.gov (United States)

    2010-10-01

    ... 48 Federal Acquisition Regulations System 4 2010-10-01 2010-10-01 false Defining electronic information technology requirements. 311.7000 Section 311.7000 Federal Acquisition Regulations System HEALTH... Accessibility Standards 311.7000 Defining electronic information technology requirements. HHS staff that define...

  15. Applications and advances in electronic-nose technologies

    Science.gov (United States)

    A. D. Wilson; M. Baietto

    2009-01-01

    Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software...

  16. Ion Implantation Processing Technologies for Telecommunications Electronics

    Energy Technology Data Exchange (ETDEWEB)

    Haynes, T E

    2000-05-01

    The subject CRADA was a collaboration between Oak Ridge National Laboratory and Bell Laboratories, Lucent Technologies (formerly AT and T Bell Laboratories) to explore the development of ion implantation technologies for silicon integrated circuit (IC) manufacturing.

  17. International Collaboration in Packaging Education: Hands-on System-on-Package (SOP) Graduate Level Courses at Indian Institute of Science and Georgia Tech PRC

    OpenAIRE

    Varadarajan, Mahesh; Bhattacharya, Swapan; Doraiswami, Ravi; Rao, Ananda G; Rao, NJ; May, Gary; Conrad, Leyla; Tummala, Rao

    2005-01-01

    System-on-Package (SOP) continues to revolutionize the realization of convergent systems in microelectronics packaging. The SOP concept which began at the Packaging Research Center (PRC) at Georgia Tech has benefited its international collaborative partners in education including the Indian Institute of Science (IISc). The academic program for electronics packaging currently in the Centre for Electronics Design and Technology (CEDT) at IISc is aimed at educating a new breed of globally-compet...

  18. Impact of different packaging technologies on post harvest losses of stone fruits in swat pakistan

    International Nuclear Information System (INIS)

    Shahzad, M.; Luqman, M.; Jehan, N.

    2015-01-01

    Soft texture of stone fruits makes them prone to post harvest losses. Effect of different packaging materials on the texture of fruits also varies for their post-harvest losses. The present study was conducted to evaluate the effect of wooden and cardboard box technologies on post-harvest losses of plum through its marketing channel. Primary data was collected through pre tested questionnaires by proportionate random sampling procedure. Quantitative losses were estimated through percentage method while partial losses were estimated at the wholesale and retail level by price differential method. Multiple regression analysis was employed to find relation between post-harvest losses and different factors at three different stages. Findings of the study revealed the channel of cardboard box technology accounted for post-harvest losses of 10.49% while at farm level, losses were 2.90%, at wholesale level 1.45% and retail level the losses were 6.14%. On the other hand post-harvest losses were 14.24% in wooden box channel; in which 6.10% occurred at farm level, 1.43% at the wholesale level and 6.71% at the retail level. Cardboard box technology has reduced post-harvest losses of plum by 27%. Post-harvest losses were moderate and positively correlated at farm level, weakly and positive related at whole sale level and weak and negatively correlated at retail level. Pre-harvest management, careful handling and harvesting in proper maturity can help in reducing post-harvest losses. (author)

  19. XRAY applied program package for calculation of electron-photon fields in the energy range of 1-1000 keV

    International Nuclear Information System (INIS)

    Lappa, A.V.; Khadyeva, Z.M.; Burmistrov, D.S.; Vasil'ev, O.N.

    1990-01-01

    The package of applied XRAY programs is intended for calculating the linear and fluctuation characteristics of photon and electron radiation fields in heterogeneous medium within 1-1000 keV energy range. The XRAY program package consists of moduli written in FORTRAN-IV and data files. 9 refs

  20. Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications

    OpenAIRE

    Morris, Michael A.; Padmanabhan, Sibu C.; Cruz-Romero, Malco C.; Cummins, Enda; Kerry, Joseph P.

    2017-01-01

    Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased custom...

  1. TREK1-a program package of modeling of the ion implantation of materials used in electronic techniques

    International Nuclear Information System (INIS)

    Leont'ev, A.V.; Nechaev, S.V.

    1999-01-01

    A package of computer programs is described which treats the slowing down of ions in solids by the means of Monte-Carlo method in the binary collision approximation for an amorphous substance using a screened Coulomb potential for nuclear collisions and the Brandt-Kitagawa theory for the electronic energy loss. For each nuclear collision, the impact parameter and the azimuthal deflection angle are determined from random numbers. The package contains a program of calculation of ion implantation whose features are described above, a database 'MME' (Materials of Micro Electronics) which stores all necessary data for the calculation, and a database control application providing an easy access to the data in MME. The programs of the package are made to run under Windows 95/98 and Windows NT operating systems. They were created using the following means: Borland Delphi 3.0, Paradox 7.0, Borland Database Engine 4.5. The running time of the calculation process depends on the problem chosen and is mainly influenced by the number of pseudo ions, their energy and atomic properties of the target. For the test example of 100 keV boron atoms incident PMMA, a calculation with 1*10 4 pseudo ions on a computer with the Pentium-166 processor requires about 2 min compared to 7 min by well known Trim95

  2. Functional chitosan-based grapefruit seed extract composite films for applications in food packaging technology

    International Nuclear Information System (INIS)

    Tan, Y.M.; Lim, S.H.; Tay, B.Y.; Lee, M.W.; Thian, E.S.

    2015-01-01

    Highlights: • Chitosan-based grapefruit seed extract (GFSE) films were solution casted. • GFSE was uniformly dispersed within all chitosan film matrices. • All chitosan-based composite films showed remarkable transparency. • Increasing amounts of GFSE incorporated increased the elongation at break of films. • Chitosan-based GFSE composite films inhibited the proliferation of fungal growth. - Abstract: Chitosan-based composite films with different amounts of grapefruit seed extract (GFSE) (0.5, 1.0 and 1.5% v/v) were fabricated via solution casting technique. Experimental results showed that GFSE was uniformly dispersed within all chitosan film matrices. The presence of GFSE made the films more amorphous and tensile strength decreased, while elongation at break values increased as GFSE content increased. Results from the measurement of light transmission revealed that increasing amounts of GFSE (from 0.5 to 1.5% v/v) did not affect transparency of the films. Furthermore, packaging of bread samples with chitosan-based GFSE composite films inhibited the proliferation of fungal growth as compared to control samples. Hence, chitosan-based GFSE composite films have the potential to be a useful material in the area of food technology

  3. Functional chitosan-based grapefruit seed extract composite films for applications in food packaging technology

    Energy Technology Data Exchange (ETDEWEB)

    Tan, Y.M. [Department of Mechanical Engineering, National University of Singapore (Singapore); Lim, S.H.; Tay, B.Y. [Forming Technology Group, Singapore Institute of Manufacturing Technology (Singapore); Lee, M.W. [Food Innovation and Resource Centre, Singapore Polytechnic (Singapore); Thian, E.S., E-mail: mpetes@nus.edu.sg [Department of Mechanical Engineering, National University of Singapore (Singapore)

    2015-09-15

    Highlights: • Chitosan-based grapefruit seed extract (GFSE) films were solution casted. • GFSE was uniformly dispersed within all chitosan film matrices. • All chitosan-based composite films showed remarkable transparency. • Increasing amounts of GFSE incorporated increased the elongation at break of films. • Chitosan-based GFSE composite films inhibited the proliferation of fungal growth. - Abstract: Chitosan-based composite films with different amounts of grapefruit seed extract (GFSE) (0.5, 1.0 and 1.5% v/v) were fabricated via solution casting technique. Experimental results showed that GFSE was uniformly dispersed within all chitosan film matrices. The presence of GFSE made the films more amorphous and tensile strength decreased, while elongation at break values increased as GFSE content increased. Results from the measurement of light transmission revealed that increasing amounts of GFSE (from 0.5 to 1.5% v/v) did not affect transparency of the films. Furthermore, packaging of bread samples with chitosan-based GFSE composite films inhibited the proliferation of fungal growth as compared to control samples. Hence, chitosan-based GFSE composite films have the potential to be a useful material in the area of food technology.

  4. Electronics in nuclear science and technology

    International Nuclear Information System (INIS)

    Dastidar, P.R.

    1979-01-01

    Electronics plays a vital role in the field of nuclear research and industry. Nuclear instrumentation and control systems rely heavily on electronics for reliable plant operation and to ensure personnel safety from harmful radiations. Rapid developments in electronics have resulted in the gradual phasing out of pneumatic instruments and replacement by solid-state electronic systems. On-line computers are now being used extensively for centralised monitoring and control of large nuclear plants. The paper covers the following main topics: (i) radiation detection and measurement, (ii) systems for nuclear research and design, (iii) nuclear reactor control and safety systems and (iv) modern trends in reactor control and nuclear instrumentation systems. The methods for radiation detection, ionization chambers, self-powdered detectors and semiconductor detectors are discussed in brief, followed by the description of the electronic systems commonly used in nuclear research, namely the pulse height, multichannel, correlation and fourier analysers. NIM and CAMAC, the electronic system standards used in nuclear laboratories/industries are also outlined. Electronic systems used for nuclear reactor control, safety, reactor core monitoring, failed fuel detection and process control instrumentation, have been described. The application of computers to reactor control, plant data processing, better man-machine interface and the use of multiple computer systems for achieving better reliability have also been discussed. Micro-computer based instrumentation systems, computers in reactor safety and advanced nuclear instrumentation techniques are briefly illustrated. (auth.)

  5. Recent developments in electron beam machine technology

    International Nuclear Information System (INIS)

    Sadat, T.; Ross, A.; Leveziel, H.

    1994-01-01

    Electron beam accelerator provides ionisation energy for industrial processing. Electron beam accelerators are increasingly used for decontamination, conservation and disinfestation of food, for sterilization of medical products, and for polymerisation of materials. These machines are easy to install into a production factory as the radiation stops as soon as the machine is switched off. This safety advantage, together with the flexibility of use of these highly automated machines, has allowed the electron beam accelerator to become an important production tool. (author). 23 refs., 6 figs., 2 tabs

  6. Future Perspective : Design Process of Perfume Packaging

    OpenAIRE

    Anderson, Duncan

    2016-01-01

    In a world where technology develops at a rapid speed a packaging designer should have the ability to adapt to the challenges in a world where the packaging landscape might look far more different from today. This thesis will look at possible future scenarios relating to resources, infrastructure and consumer behaviour in the year 2050. It will then go on to discuss the emergence of new packaging materials pitted to replace plastic, as well as take a look at printed electronics in packaging a...

  7. Packaging & Other Structures. Stuff That Works! A Technology Curriculum for the Elementary Grades.

    Science.gov (United States)

    Benenson, Gary

    This book explores all kinds of packaging materials including bags, boxes, etc. and how they are used to protect and display products. Contents are divided into six chapters: (1) "Appetizers" includes activities that can be done individually to become familiar with the topic of packaging and structures; (2) "Concepts" provides…

  8. Technology and application of two sets of industrial electron accelerators

    International Nuclear Information System (INIS)

    Hua Degen

    2000-01-01

    The radiation industry in China Academy of Engineering Physics (CAEP) has had a big scale, and the two sets of industrial electron accelerators play important roles. The Electron Processing System (E.P.S), which was introduced in 1987, is a powerful electron accelerator. And the 10 MeV Accelerator, which is a traveling wave linear electron accelerator, has the higher electron energy. Both of the stes are equipped the driving devices under the beam, and has made a considerable economic results. This article describes the technology and application of the two electron accelerators. (author)

  9. Deploying Electronic Roadside Vehicle Identification Technology to ...

    African Journals Online (AJOL)

    ... suicide bombing, ritual murders and human parts selling. ..... Table 1.1: Prototype Platforms For VANET And WSN Nodes [11] ... store items are common examples. This is the one .... viewed on electronic maps via the internet or specialized ...

  10. Electron accelerator technology research in food irradiation

    International Nuclear Information System (INIS)

    Jin Jianqiao; Ye Mingyang; Zhang Yue; Yang Bin; Xu Tao; Kong Xiangshan

    2014-01-01

    Electronic accelerator was applied to instead of cobalt sources for food irradiation, to keep food quality and to improve the effect of the treatment. Appropriate accelerator parameters lead to optimal technique. The irradiation effect is associated with the relationship between uniformity and irradiating speed, the effect of cargo size on radiation penetration, as well as other factors that affect the irradiation effects. Industrialization of electron accelerator irradiation will be looked to the future. (authors)

  11. Radiation effects evaluation for electrons sheaf in packages resistance in a Lasioderma serricorne, Plodia interpunctella and Sitophilus zeamais

    International Nuclear Information System (INIS)

    Alves, Juliana Nazare

    2011-01-01

    The plagues of stored products consist of a man problem, depreciating products and causing economical damages. Among these curses we have Lasioderma serricorne (F. 1792), Sitophilus zeamais (M. 1855) and Plodia interpunctella (H. 1813) known by infesting stored products as: grains, brans, flours, coffee, tobacco, dried fruits and spices. These curses perforate and penetrate the packages, ovipositing over the substratum. In this context the package plays a fundamental part, preventing the contact and curses' proliferation in the packed product. So, to protect the packed product and to prolong its shelf life, the package should have good mechanical resistance to tension and perforation, good sealing, good barrier properties and should not transfer odors nor strange flavors to the packed product. The ionizing radiation can cause structural changes in polymer packages, these changes are caused by the scission processes and reticulation of the polymers chains. These are concurrent processes and the predominance of one over the other depends on the chemical structure of the polymer, the irradiation conditions and specific factors of the material that will absorb the energy. This work had the objective to evaluate the changes in mechanical properties of package structures used to store granola, cereal bar and pasta, as well as its resistance to perforation by L. serricorne, P. interpunctella and S. zeamais, when submitted to electrons sheaf radiation. In this methodology were used five structures of commercially utilized packages to store granola, cereal bar and pasta composed by (Polypropylene bi-oriented metallic/Polypropylene bi-oriented coextruded - BOPPmet/BOPP 50 μm), (Polypropylene bi-oriented/Polypropylene - BOPP/PP 50 μm), Poli (ethylene terephthalate) metallic/Polypropylene bi-oriented coextruded - PETmet/BOPP 32 μm), Poli (ethylene terephthalate) /Polypropylene - PET/PP1 72 μm), Poli (ethylene terephthalate)/Polypropylene - PET/PP2 32 μm). The structures

  12. HIGH VOLTAGE ENVIRONMENTAL APPLICATIONS, INC.ELECTRON BEAM TECHNOLOGY - INNOVATIVE TECHNOLOGY EVALUATION REPORT

    Science.gov (United States)

    This report evaluates a high-voltage electron beam (E-beam) technology's ability to destroy volatile organic compounds (VOCs) and other contaminants present in liquid wastes. Specifically, this report discusses performance and economic data from a Superfund Innovative Technology...

  13. Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications.

    Science.gov (United States)

    Morris, Michael A; Padmanabhan, Sibu C; Cruz-Romero, Malco C; Cummins, Enda; Kerry, Joseph P

    2017-10-01

    Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased customer demands for longer product shelf-life and storage capability. Consequently, conventional packaging materials and systems will have to evolve to meet these challenges. This review presents some of the new strategies that have been developed by employing novel nanotechnological concepts which have demonstrated some promise in significantly extending the shelf-life of muscle-based foods by providing commercially-applicable, antimicrobially-active, smart packaging solutions. The primary focus of this paper is applied to subject aspects, such as; material chemistries employed, forming methods utilised, interactions of the packaging functionalities including nanomaterials employed with polymer substrates and how such materials ultimately affect microbes. In order that such materials become industrially feasible, it is important that safe, stable and commercially-viable packaging materials are shown to be producible and effective in order to gain public acceptance, legislative approval and industrial adoption. Copyright © 2017. Published by Elsevier Ltd.

  14. Technologies and Capabilities in: Communications, Electronics and IT (Information Technologies)

    National Research Council Canada - National Science Library

    1998-01-01

    ... and has offices in several international cities, including Brussels and Moscow. DERA is composed of hundreds of specialist teams, each of which is an expert in its particular technology or facility...

  15. Structure of a headful DNA-packaging bacterial virus at 2.9 Å resolution by electron cryo-microscopy.

    Science.gov (United States)

    Zhao, Haiyan; Li, Kunpeng; Lynn, Anna Y; Aron, Keith E; Yu, Guimei; Jiang, Wen; Tang, Liang

    2017-04-04

    The enormous prevalence of tailed DNA bacteriophages on this planet is enabled by highly efficient self-assembly of hundreds of protein subunits into highly stable capsids. These capsids can stand with an internal pressure as high as ∼50 atmospheres as a result of the phage DNA-packaging process. Here we report the complete atomic model of the headful DNA-packaging bacteriophage Sf6 at 2.9 Å resolution determined by electron cryo-microscopy. The structure reveals the DNA-inflated, tensed state of a robust protein shell assembled via noncovalent interactions. Remarkable global conformational polymorphism of capsid proteins, a network formed by extended N arms, mortise-and-tenon-like intercapsomer joints, and abundant β-sheet-like mainchain:mainchain intermolecular interactions, confers significant strength yet also flexibility required for capsid assembly and DNA packaging. Differential formations of the hexon and penton are mediated by a drastic α-helix-to-β-strand structural transition. The assembly scheme revealed here may be common among tailed DNA phages and herpesviruses.

  16. Electronics Technology. Tech Prep Competency Profile.

    Science.gov (United States)

    Lakeland Tech Prep Consortium, Kirtland, OH.

    This tech prep competency profile covers the occupation of electronics technician. Section 1 provides the occupation definition. Section 2 lists development committee members. Section 3 provides the leveling codes--abbreviations for grade level, (by the end of grade 12, by the end of associate degree), academic codes (communications, math, or…

  17. Transactions on the Precision and Electronic Technology. Vol. 4

    International Nuclear Information System (INIS)

    1999-01-01

    The conference covers most important subjects connected with application of electronic technologies for resistors, sensors, radiation detectors and other microelectronic structures. The investigations of physical properties (electrical and magnetic properties, crystal structure etc.) of interest materials have been also presented

  18. Information technologies and software packages for education of specialists in materials science [In Russian

    NARCIS (Netherlands)

    Krzhizhanovskaya, V.; Ryaboshuk, S.

    2009-01-01

    This paper presents methodological materials, interactive text-books and software packages developed and extensively used for education of specialists in materials science. These virtual laboratories for education and research are equipped with tutorials and software environment for modeling complex

  19. Status report on the relativistic electron beam technology

    International Nuclear Information System (INIS)

    Iyyengar, S.K.; Ron, P.H.; Rohatgi, V.K.

    1974-01-01

    The status of technology of the pulsed relativistic electron beam (REB) has been examined and summarised in this report. With the present technology the beam generator can be used either as a source of intense electron burst or to produce bursts of positive ions x and γ-rays, and neutrons by suitable secondary reactions. A large number of applications have been identified where this technology can play an important role. Typical applications of the technology include : (a) generation and heating of fusion plasma (b) development of high power laser and (c) sterilisation and radiation sources. The present day cost of radiation produced by REB is competitive with the cost of radiation produced from Co 60 source. At the same time there are indications that the cost of radiation from REB source can be significantly reduced with advanced technology. The type of equipment developed by various laboratories to study realitivistic electron beams is also included in this report. (author)

  20. Overview on thermal and mechanical challenges of high power RF electronic packaging

    NARCIS (Netherlands)

    Yuan, C.A.; Kregting, R.; Driel, W. van; Gielen, A.W.J.; Xiao, A.; Zhang, G.Q.

    2011-01-01

    High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics

  1. Establishing a store baseline during interim storage of waste packages and a review of potential technologies for base-lining

    Energy Technology Data Exchange (ETDEWEB)

    McTeer, Jennifer; Morris, Jenny; Wickham, Stephen [Galson Sciences Ltd. Oakham, Rutland (United Kingdom); Bolton, Gary [National Nuclear Laboratory Risley, Warrington (United Kingdom); McKinney, James; Morris, Darrell [Nuclear Decommissioning Authority Moor Row, Cumbria (United Kingdom); Angus, Mike [National Nuclear Laboratory Risley, Warrington (United Kingdom); Cann, Gavin; Binks, Tracey [National Nuclear Laboratory Sellafield (United Kingdom)

    2013-07-01

    Interim storage is an essential component of the waste management lifecycle, providing a safe, secure environment for waste packages awaiting final disposal. In order to be able to monitor and detect change or degradation of the waste packages, storage building or equipment, it is necessary to know the original condition of these components (the 'waste storage system'). This paper presents an approach to establishing the baseline for a waste-storage system, and provides guidance on the selection and implementation of potential base-lining technologies. The approach is made up of two sections; assessment of base-lining needs and definition of base-lining approach. During the assessment of base-lining needs a review of available monitoring data and store/package records should be undertaken (if the store is operational). Evolutionary processes (affecting safety functions), and their corresponding indicators, that can be measured to provide a baseline for the waste-storage system should then be identified in order for the most suitable indicators to be selected for base-lining. In defining the approach, identification of opportunities to collect data and constraints is undertaken before selecting the techniques for base-lining and developing a base-lining plan. Base-lining data may be used to establish that the state of the packages is consistent with the waste acceptance criteria for the storage facility and to support the interpretation of monitoring and inspection data collected during store operations. Opportunities and constraints are identified for different store and package types. Technologies that could potentially be used to measure baseline indicators are also reviewed. (authors)

  2. Control system in the technological electron linacs

    International Nuclear Information System (INIS)

    Boriskin, V.N.; Akchurin, Yu.I.; Bahmetev, N.N.; Gurin, V.A.

    1999-01-01

    The special system has been developed for linac control.It controls the electron beam current,the energy and the position,protects the accelerating and scanning systems from the damage caused by the beam;blocks the modulator and the klystron amplifier in the case of intolerable operating modes;regulates the phase and power of the HF signals in the injecting system and also regulates the source power currents in the magnetic system

  3. Technological guns which form the profiled electron beans

    International Nuclear Information System (INIS)

    Mel'nik, V.I.

    1998-01-01

    Electron guns with high-voltage glow discharge are developed which form disc - and tubule-like,hollow conic and linear electron beams,as well as devices and systems for control of gun parameter and technological processes in low and intermediate vacuum

  4. The Impact of Electronic Communication Technology on Written Language

    Science.gov (United States)

    Hamzah, Mohd. Sahandri Gani B.; Ghorbani, Mohd. Reza; Abdullah, Saifuddin Kumar B.

    2009-01-01

    Communication technology is changing things. Language is no exception. Some language researchers argue that language is deteriorating due to increased use in electronic communication. The present paper investigated 100 randomly selected electronic mails (e-mails) and 50 short messaging system (SMS) messages of a representative sample of…

  5. CERN's web application updates for electron and laser beam technologies

    CERN Document Server

    Sigas, Christos

    2017-01-01

    This report describes the modifications at CERN's web application for electron and laser beam technologies. There are updates at both the front and the back end of the application. New electron and laser machines were added and also old machines were updated. There is also a new feature for printing needed information.

  6. Development of broadband free electron laser technology

    International Nuclear Information System (INIS)

    Lee, B. C.; Jeong, Y. W.; Joe, S. O.; Park, S. H.; Ryu, J. K.; Kazakevich, G.; Cha, H. J.; Sohn, S. C.; Han, S. J.

    2003-02-01

    Layer cladding technology was developed to mitigate the fretting wear damages occurred at fuel spacers in Hanaro reactor. The detailed experimental procedures are as follows. 1) Analyses of fretting wear damages and fabrication process of fuel spacers 2) Development and analysis of spherical Al 6061 T-6 alloy powders for the laser cladding 3) Analysis of parameter effects on laser cladding process for clad bids, and optimization of laser cladding process 4) Analysis on the changes of cladding layers due to overlapping factor change 5) Microstructural observation and phase analysis 6) Characterization of materials properties (hardness wear tests) 7) Development of a vision system and revision of its related software 8) Manufacture of prototype fuel spacers. As a result, it was confirmed that the laser cladding technology could increased considerably the wear resistance of Al 6061 alloy which is the raw material of fuel spacers.

  7. Information Technology in project-organized electronic and computer technology engineering education

    DEFF Research Database (Denmark)

    Nielsen, Kirsten Mølgaard; Nielsen, Jens Frederik Dalsgaard

    1999-01-01

    This paper describes the integration of IT in the education of electronic and computer technology engineers at Institute of Electronic Systems, Aalborg Uni-versity, Denmark. At the Institute Information Technology is an important tool in the aspects of the education as well as for communication...

  8. ESTAR, PSTAR, ASTAR. A PC package for calculating stopping powers and ranges of electrons, protons and helium ions. Version 2

    International Nuclear Information System (INIS)

    Berger, M.J.

    1993-01-01

    A PC package is documented for calculating stopping powers and ranges of electrons, protons and helium ions in matter for energies from 1 keV up to 10 GeV. Stopping powers and ranges for electrons can be calculated for any element, compound or mixture. Stopping powers and ranges of protons and helium ions can be calculated for 74 materials (26 elements and 48 compounds and mixtures). The files are stored on two HD diskettes in compressed form. Both executable files for IBM PC and Fortran-77 source files are provided. All three programs require 5.2 Mb of disk space. This set of two diskettes with detailed documentation is available upon request, cost free, from the IAEA Nuclear Data Section. (author). 25 refs, 4 tabs

  9. Electronic Cigarette Refill Liquids: Child-Resistant Packaging, Nicotine Content, and Sales to Minors2

    Science.gov (United States)

    Buettner-Schmidt, Kelly; Miller, Donald R.; Balasubramanian, Narayanaganesh

    2016-01-01

    Purpose To determine the accuracy of the labeled quantity of the nicotine content of the e-liquids sold in unlicensed vape stores, whether the packaging of e-liquids sold within the vape stores was child-resistant, whether minors were present within vape stores, and whether sales to minors occurred. This study was conducted across North Dakota prior to implementation of a new e-cigarette state law and provided a baseline assessment before enactment of the new legal requirements. Design and Methods We tested samples of e-liquids and performed observations in 16 stores that were selling e-cigarettes but were not legally required to be licensed for tobacco retail. The e-liquids were analyzed for nicotine content using a validated high-performance liquid chromatography method for nicotine analysis. Results Of the 70 collected e-liquid samples that claimed to contain nicotine, 17% contained more than the labeled quantity and 34% contained less than the labeled quantity by 10% or more, with one sample containing 172% more than the labeled quantity. Of the 94 e-liquid containers sampled, only 35% were determined to be child-resistant. Minors were present in stores, although no sales to minors occurred. Conclusions Mislabeling of nicotine in e-liquids is common and exposes the user to the harmful effects of nicotine. The lack of child-resistant packaging for this potentially toxic substance is a serious public health problem. E-cigarettes should be included in the legal definition of tobacco products, child-resistant packaging and nicotine labeling laws should be enacted and strictly enforced, and vape stores should be licensed by states. PMID:27079973

  10. Electronic Cigarette Refill Liquids: Child-Resistant Packaging, Nicotine Content, and Sales to Minors.

    Science.gov (United States)

    Buettner-Schmidt, Kelly; Miller, Donald R; Balasubramanian, Narayanaganesh

    2016-01-01

    To determine the accuracy of the labeled quantity of the nicotine content of the e-liquids sold in unlicensed vape stores, whether the packaging of e-liquids sold within the vape stores was child-resistant, whether minors were present within vape stores, and whether sales to minors occurred. This study was conducted across North Dakota prior to implementation of a new e-cigarette state law and provided a baseline assessment before enactment of the new legal requirements. We tested samples of e-liquids and performed observations in 16 stores that were selling e-cigarettes but were not legally required to be licensed for tobacco retail. The e-liquids were analyzed for nicotine content using a validated high-performance liquid chromatography method for nicotine analysis. Of the 70 collected e-liquid samples that claimed to contain nicotine, 17% contained more than the labeled quantity and 34% contained less than the labeled quantity by 10% or more, with one sample containing 172% more than the labeled quantity. Of the 94 e-liquid containers sampled, only 35% were determined to be child-resistant. Minors were present in stores, although no sales to minors occurred. Mislabeling of nicotine in e-liquids is common and exposes the user to the harmful effects of nicotine. The lack of child-resistant packaging for this potentially toxic substance is a serious public health problem. E-cigarettes should be included in the legal definition of tobacco products, child-resistant packaging and nicotine labeling laws should be enacted and strictly enforced, and vape stores should be licensed by states. Copyright © 2016 Elsevier Inc. All rights reserved.

  11. Study on tamper-indicating technology in electronic seals system

    International Nuclear Information System (INIS)

    Xu Xiong; Han Feng; Zuo Guangxia; Zhao Xin; Zhang Quanhu; Di Yuming

    2009-01-01

    To strengthen our national arms control verification technical storage and deepen electronic seals' research, this paper mainly introduces seals' characteristics, functions and work principle, studies on tamper-indicating technology which is a key technology in electronic seals, designs some hardware circuit such as optical transceiver, temperature detection circuit, move detection circuit, re-prized circuit and so on, also designs a software program which is used for recording the destroying or tampering events' information. Experimental results show that electronic seals system can record the destroying or tampering events' information accurately and quickly, and give corresponding tamper-indication. (authors)

  12. Test Plan for Lockheed Idaho Technologies Company (LITCO), ARROW-PAK Packaging, Docket 95-40-7A, Type A Container

    International Nuclear Information System (INIS)

    Kelly, D.L.

    1995-01-01

    This report documents the U.S. Department of Transportation Specification 7A Type A (DOT-7A) compliance testing to be followed for qualification of the Lockheed Idaho Technologies Company, ARROW-PAK, for use as a Type A Packaging. The packaging configuration being tested is intended for transportation of radioactive solids, Form No. 1, Form No. 2, and Form No. 3

  13. Deep Impact Delta II Launch Vehicle Cracked Thick Film Coating on Electronic Packages Technical Consultation Report

    Science.gov (United States)

    Cameron, Kenneth D.; Kichak, Robert A.; Piascik, Robert S.; Leidecker, Henning W.; Wilson, Timmy R.

    2009-01-01

    The Deep Impact spacecraft was launched on a Boeing Delta II rocket from Cape Canaveral Air Force Station (CCAFS) on January 12, 2005. Prior to the launch, the Director of the Office of Safety and Mission Assurance (OS&MA) requested the NASA Engineering and Safety Center (NESC) lead a team to render an independent opinion on the rationale for flight and the risk code assignments for the hazard of cracked Thick Film Assemblies (TFAs) in the E-packages of the Delta II launch vehicle for the Deep Impact Mission. The results of the evaluation are contained in this report.

  14. Heterogeneous Electronics – Wafer Level Integration, Packaging, and Assembly Facility

    Data.gov (United States)

    Federal Laboratory Consortium — This facility integrates active electronics with microelectromechanical (MEMS) devices at the miniature system scale. It obviates current size-, weight-, and power...

  15. Handbook of Machine Olfaction: Electronic Nose Technology

    Science.gov (United States)

    Pearce, Tim C.; Schiffman, Susan S.; Nagle, H. Troy; Gardner, Julian W.

    2003-02-01

    "Electronic noses" are instruments which mimic the sense of smell. Consisting of olfactory sensors and a suitable signal processing unit, they are able to detect and distinguish odors precisely and at low cost. This makes them very useful for a remarkable variety of applications in the food and pharmaceutical industry, in environmental control or clinical diagnostics and more. The scope covers biological and technical fundamentals and up-to-date research. Contributions by renowned international scientists as well as application-oriented news from successful "e-nose" manufacturers give a well-rounded account of the topic, and this coverage from R&D to applications makes this book a must-have read for e-nose researchers, designers and users alike.

  16. TECHNOLOGY FOR DEVELOPMENT OF ELECTRONIC TEXTBOOK ON HANDICRAFTS METHODOLOGY

    Directory of Open Access Journals (Sweden)

    Iryna V. Androshchuk

    2017-10-01

    Full Text Available The main approaches to defining the concept of electronic textbook have been analyzed in the article. The main advantages of electronic textbooks in the context of future teachers’ training have been outlined. They are interactivity, feedback provision, availability of navigation and search engine. The author has presented and characterized the main stages in the technology of development of an electronic textbook on Handicraft and Technology Training Methodology: determination of its role and significance in the process of mastering the discipline; justification of its structure; outline of the stages of its development in accordance with the defined structure. The characteristic feature of the developed electronic textbook is availability of macro- and microstructure. Macrostructure is viewed as a sequence of components of the electronic textbook that are manifested in its content; microstructure is considered to be an internal pattern of each component of macrostructure.

  17. Small compact pulsed electron source for radiation technologies

    International Nuclear Information System (INIS)

    Korenev, Sergey

    2002-01-01

    The small compact pulsed electron source for radiation technologies is considered in the report. The electron source consists of pulsed high voltage Marx generator and vacuum diode with explosive emission cathode. The main parameters of electron source are next: kinetic energy is 100-150 keV, beam current is 5-200 A and pulse duration is 100-400 nsec. The distribution of absorbed doses in irradiated materials is considered. The physical feasibility of pulsed low energy electron beam for applications is considered

  18. Effects of Technological Parameters and Fishing Ground on Quality Attributes of Thawed, Chilled Cod Fillets Stored in Modified Atmosphere Packaging

    DEFF Research Database (Denmark)

    Bøknæs, Niels; Østerberg, Carsten; Sørensen, Rie

    2001-01-01

    . The parameters investigated were: (1) packaging in modified atmosphere during frozen storage, (2)frozen storage period and temperature, (3),fishing ground and chill storage temperature, together with (4) the addition of trimethylamine oxide (TMAO) and sodium chloride (NaCl) to cod fillets before freezing......Effects were studied of various technological parameters and fishing ground on quality attributes of thawed, chilled cod fillets stored in modified atmosphere packaging Frozen fillets of Baltic Sea and Barents Sea cod, representing two commercial fishing grounds, were used as raw material...... of Baltic Sea cod. Therefore, addition of trimethylamine oxide and NaCl to Baltic Sea cod fillets was evaluated and shown to protect P, phosphoreum against fro::en storage inactivation and this explained the observed differences in growth of the spoilage bacteria and trimethylamine production between thawed...

  19. Flexible technology for Electronics: Its Derivatives and Possibilities

    OpenAIRE

    Deovrat Phal; Akshay Narkar

    2014-01-01

    With the inkjet printing technology becoming more popular, integration of circuits developed on flexible substrates which are easily embedded inside the machine as against the rigid PCB circuits is becoming more prevalent. Much of the research has been done in applications of such circuits in human body implants or for other low cost applications. This paper concentrates particularly on applications of such circuits in the field of consumer electronics, disposable electronics,...

  20. Allocating Spending Between Advertising and Information Technology in Electronic Retailing

    OpenAIRE

    Yong Tan; Vijay S. Mookerjee

    2005-01-01

    This study examines coordination issues that occur in allocating spending between advertising and information technology (IT) in electronic retailing. Electronic retailers run the risk of overspending on advertising to attract customers but underspending on IT, thus resulting in inadequate processing capacity at the firm's website. In this paper, we present a centralized, joint marketing-IT model to optimally allocate spending between advertising and IT, and we discuss an uncoordinated case w...

  1. Managing electronic records methods, best practices, and technologies

    CERN Document Server

    Smallwood, Robert F

    2013-01-01

    The ultimate guide to electronic records management, featuring a collaboration of expert practitioners including over 400 cited references documenting today's global trends, standards, and best practices Nearly all business records created today are electronic, and are increasing in number at breathtaking rates, yet most organizations do not have the policies and technologies in place to effectively organize, search, protect, preserve, and produce these records. Authored by an internationally recognized expert on e-records in collaboration with leading subject matter experts worldwide

  2. Advances in electronic-nose technologies developed for biomedical applications.

    Science.gov (United States)

    Wilson, Alphus D; Baietto, Manuela

    2011-01-01

    The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

  3. Advances in Electronic-Nose Technologies Developed for Biomedical Applications

    Directory of Open Access Journals (Sweden)

    Alphus D. Wilson

    2011-01-01

    Full Text Available The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

  4. Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

    Science.gov (United States)

    Beheim, Glenn M.

    2003-01-01

    The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

  5. Technology and Power. A Foucauldian Analysis of Electronic Monitoring Discourses

    OpenAIRE

    Anna Vitores; Miquel Domènech

    2007-01-01

    The article aims to show the importance of FOUCAULT within social studies of science and technology. It also illustrates how a Foucauldian analysis can be useful for studies of science, technology and society focused on power effects. To accomplish these objectives we analyze the emergence of a specific techno-scientific innovation: the electronic monitoring of offenders. We map the discontinuities and discourse dispersions linked to those practices that constitute different materializations ...

  6. Spin polarized electron source technology transferred from HE accelerators to electron microscopes

    International Nuclear Information System (INIS)

    Nakanishi, Tsutomu

    2009-01-01

    For many years, we have developed a technology of spin-polarized-electron-source (PES) for a future linear collider project (ILC). Various new techniques for achieving high polarization, high quantum efficiency, high current density, sub-nanosecond multi-bunch generation etc. were developed. Two fundamental technologies; reduction of dark current and preparation of extremely high vacuum environment to protect the Negative Electron Affinity (NEA) surface have been also developed. Using these PES technologies and a new transmission type photocathode, we recently succeeded in producing the high brightness and high polarization electron beam for the low energy electron microscope (LEEM). Our Spin-LEEM system enables the world-first dynamic observation of surface magnetic domain formed by evaporation on the metal substrate with ∼ 20 nm space resolutions. (author)

  7. Balancing Environmental Performance with Sales Functionalities in Packaging for Consumer Electronic Products

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2006-01-01

    Two major changes are currently taking place in the world of Consumer Electronics. They are, first, the relocation of production to low-wage countries, in particularly China. This results in longer distribution distances, which lead to a higher relative importance of this phase in the entire life

  8. Technology Corner: Dating of Electronic Hardware for Prior Art Investigations

    Directory of Open Access Journals (Sweden)

    Sellam Ismail

    2012-03-01

    Full Text Available In many legal matters, specifically patent litigation, determining and authenticating the date of computer hardware or other electronic products or components is often key to establishing the item as legitimate evidence of prior art. Such evidence can be used to buttress claims of technologies available or of events transpiring by or at a particular date.In 1945, the Electronics Industry Association published a standard, EIA 476-A, standardized in the reference Source and Date Code Marking (Electronic Industries Association, 1988.(see PDF for full tech corner

  9. Pulsed electron accelerator for radiation technologies in the enviromental applications

    Science.gov (United States)

    Korenev, Sergey

    1997-05-01

    The project of pulsed electron accelerator for radiation technologies in the environmental applications is considered. An accelerator consists of high voltage generator with vacuum insulation and vacuum diode with plasma cathode on the basis discharge on the surface of dielectric of large dimensions. The main parameters of electron accelerators are following: kinetic energy 0.2 - 2.0 MeV, electron beam current 1 - 30 kA and pulse duration 1- 5 microseconds. The main applications of accelerator for decomposition of wastewaters are considered.

  10. Construction of a Chemical Sensor/Instrumentation Package Using Fiber Optic and Miniaturization Technology

    Science.gov (United States)

    Newton, R. L.

    1999-01-01

    The objective of this research was to construct a chemical sensor/instrumentation package that was smaller in weight and volume than conventional instrumentation. This reduction in weight and volume is needed to assist in further reducing the cost of launching payloads into space. To accomplish this, fiber optic sensors, miniaturized spectrometers, and wireless modems were employed. The system was evaluated using iodine as a calibration analyte.

  11. Genome packaging in viruses

    OpenAIRE

    Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

    2010-01-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

  12. Trends in Food Packaging.

    Science.gov (United States)

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  13. Packaging for Food Service

    Science.gov (United States)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  14. Advances in electronic-nose technologies developed for biomedical applications

    Science.gov (United States)

    Dan Wilson; Manuela. Baietto

    2011-01-01

    The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and...

  15. Power Electronics as key technology in wind turbines

    DEFF Research Database (Denmark)

    Blaabjerg, Frede

    2005-01-01

    This paper discuss the development in wind turbines in a two-decade perspective looking at the technology based on track records. Different power electronic topologies for interfacing the wind turbine to the grid are discussed and related to the possibility for the wind turbine to act as a power...

  16. Application of electron beams to environmental conservation technology

    International Nuclear Information System (INIS)

    Pikaev, A.K.

    1992-01-01

    The paper is a review of current status of the application of electron beams to environmental conservation technology. Different aspects of radiation treatment of natural and polluted drinking water, radiation purification of industrial and municipal wastes, radiation treatment of sewage sludge and radiation purification of exhaust gases are considered. The special attention is paid to the respective pilot and industrial facilities. (author) 70 refs

  17. Special Article Ethics and Electronic Health Information Technology ...

    African Journals Online (AJOL)

    Objectives: The National Health Insurance Scheme (NHIS), and the National Identification Authority (NIA), pose ethical challenges to the physician-patient relationship due to interoperability. This paper explores (1) the national legislation on Electronic Health Information Technology (EHIT), (2) the ethics of information ...

  18. special article ethics and electronic health information technology

    African Journals Online (AJOL)

    David Ofori-Adjei

    Electronic Health Information Technology, (EHIT) has become an integral part of the national health care delivery system. Reliance on EHIT seems poised to grow in the years to come due to the myriad of advantages derived from the capture, storage, retrieval and analysis of large volumes of protected health data, and from ...

  19. Purification technology for flue/off gases using electron beams

    International Nuclear Information System (INIS)

    Kojima, Takuji

    2004-01-01

    The present paper describes research and development on purification technology using electron beams for flue/off gases containing pollutants: removal of sulfate oxide and nitrogen oxide from flue gases of coal/oil combustion power plants, decomposition of dioxins in waste incineration flue gas, and decomposition/removal of toxic volatile organic compounds from off gas. (author)

  20. HF electronic tubes. Technologies, grid tubes and klystrons

    International Nuclear Information System (INIS)

    Lemoine, Th.

    2009-01-01

    This article gives an overview of the basic technologies of electronic tubes: cathodes, electronic optics, vacuum and high voltage. Then the grid tubes, klystrons and inductive output tubes (IOT) are introduced. Content: 1 - context and classification; 2 - electronic tube technologies: cathodes, electronic optics, magnetic confinement (linear tubes), periodic permanent magnet (PPM) focussing, collectors, depressed collectors; 3 - vacuum technologies: vacuum quality, surface effects and interaction with electrostatic and RF fields, secondary emission, multipactor effect, thermo-electronic emission; 4 - grid tubes: operation of a triode, tetrodes, dynamic operation and classes of use, 'common grid' and 'common cathode' operation, ranges of utilisation and limitations, operation of a tetrode on unadjusted load, lifetime of a tetrode, uses of grid tubes; 5 - klystrons: operation, impact of space charge, multi-cavity klystrons, interaction efficiency, extended interaction klystrons, relation between interaction efficiency, perveance and efficiency, ranges of utilization and power limitations, multi-beam klystrons and sheet beam klystrons, operation on unadjusted load, klystron band pass and lifetime, uses; 6 - IOT: principle of operation, ranges of utilisation and limitations, interaction efficiency and depressed collector IOT, IOT lifetime and uses. (J.S.)

  1. Applications and Advances in Electronic-Nose Technologies

    Directory of Open Access Journals (Sweden)

    Manuela Baietto

    2009-06-01

    Full Text Available Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software innovations and progress in microcircuitry design and systems integration. The invention of many new e-nose sensor types and arrays, based on different detection principles and mechanisms, is closely correlated with the expansion of new applications. Electronic noses have provided a plethora of benefits to a variety of commercial industries, including the agricultural, biomedical, cosmetics, environmental, food, manufacturing, military, pharmaceutical, regulatory, and various scientific research fields. Advances have improved product attributes, uniformity, and consistency as a result of increases in quality control capabilities afforded by electronic-nose monitoring of all phases of industrial manufacturing processes. This paper is a review of the major electronic-nose technologies, developed since this specialized field was born and became prominent in the mid 1980s, and a summarization of some of the more important and useful applications that have been of greatest benefit to man.

  2. International Conference on NextGen Electronic Technologies

    CERN Document Server

    Thalmann, Nadia; Bhaaskaran, V

    2017-01-01

    This book is a collection of keynote lectures from international experts presented at International Conference on NextGen Electronic Technologies (ICNETS2-2016). ICNETS2 encompasses six symposia covering all aspects of electronics and communications domains, including relevant nano/micro materials and devices . This volume comprises of recent research in areas like computational signal processing analysis, intelligent embedded systems, nanoelectronic materials and devices, optical and microwave technologies, VLSI design: circuits systems and application, and wireless communication networks, and the internet of things. The contents of this book will be useful to researchers, professionals, and students working in the core areas of electronics and their applications, especially to signal processing, embedded systems, and networking.

  3. Effects of health-oriented descriptors on combustible cigarette and electronic cigarette packaging: an experiment among adult smokers in the United States.

    Science.gov (United States)

    Sanders-Jackson, Ashley; Tan, Andy S L; Yie, Kyeungyeun

    2017-10-05

    Certain tobacco companies use health-oriented descriptors (eg, 100% organic) on product packaging and advertising of combustible cigarettes or electronic cigarettes (e-cigarettes) that create a 'health halo' around smoking and vaping. Previous observational research suggests that such language may be associated with more favourable attitudes and reduced risk perceptions toward these brands compared with others. This study aimed to determine the effects of health-oriented descriptors on smokers' attitude toward the brand, perception of packaging information, comparative harm versus other brands and intention to purchase either combustible cigarettes or e-cigarettes. US adult smokers were randomly assigned to view either a health-oriented language package ('100% organic,' 'all natural' or 'no additives'), traditional marketing language package ('fine quality,' 'premium blend' or '100% original') or a no-language package of a combustible cigarette brand (Study 1, n=405) or an e-cigarette brand (Study 2, n=396) in an experimental design. Study 1: Participants in the health-oriented condition reported more favourable perceptions toward the package information, lower comparative harm and higher intention to purchase combustible cigarettes versus the no language control. In addition, participants in the health-oriented condition reported more positive attitude toward the brand and lower comparative harm versus the traditional marketing condition. Study 2: Compared with the traditional marketing condition, participants in the health-oriented condition reported greater intention to purchase Absolute e-cigarettes. There were no significant differences in attitude toward the brand, perception of packaging information and comparative harm versus other brands across conditions. The effect of health-oriented language was significant for combustible cigarettesand e-cigarette packages. Policies to restrict health-oriented language on cigarette and e-cigarette packaging are

  4. Applications of electron beam technology for healthcare and environment

    International Nuclear Information System (INIS)

    Varshney, Lalit

    2013-01-01

    Radiation technology has matured from lab scale to industrial scale in many areas of interests to industry, healthcare, agriculture and environment. Some of the well established applications include radiation sterilization, wires and cable, composites for automobiles, radiation surface curing, nanomaterials, hydrogels and special materials for nuclear and aerospace industry, radiation treatment of effluents, sewage sludge etc. These applications are as a result of characteristics of high energy radiation like gamma and electron beams which are able to deliver energy directly at molecular level. Unlike nuclear based radiations, electron beam accelerator technology is amenable to easy acceptance by public as well has capability to manipulate processes and product treatment to produce varieties of advanced/smart materials for healthcare and environment. Faster dose rates and depth profiling are the important characteristics of electron beam technology which gives it an edge over gamma radiation processing. Department of Atomic Energy has an ambitious program to indigenously develop accelerator technology and utilize them for national progress. In the presentation some important applications of radiation technology will be discussed. (author)

  5. Radiation treatment for sterilization of packaging materials

    International Nuclear Information System (INIS)

    Haji-Saeid, Mohammad; Sampa, Maria Helena O.; Chmielewski, Andrzej G.

    2007-01-01

    Treatment with gamma and electron radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in the aseptic processing of foods and pharmaceuticals. The effect of irradiation on these materials is crucial for packaging engineering to understand the effects of these new treatments. Packaging material may be irradiated either prior to or after filling. The irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceutical, and medical device industries in the United States, Europe, and Canada. Radiation effects on packaging material properties still need further investigation. This paper summarizes the work done by different groups and discusses recent developments in regulations and testing procedures in the field of packaging technology

  6. System-in Package of Integrated Humidity Sensor Using CMOS-MEMS Technology.

    Science.gov (United States)

    Lee, Sung Pil

    2015-10-01

    Temperature/humidity microchips with micropump were fabricated using a CMOS-MEMS process and combined with ZigBee modules to implement a sensor system in package (SIP) for a ubiquitous sensor network (USN) and/or a wireless communication system. The current of a diode temperature sensor to temperature and a normalized current of FET humidity sensor to relative humidity showed linear characteristics, respectively, and the use of the micropump has enabled a faster response. A wireless reception module using the same protocol as that in transmission systems processed the received data within 10 m and showed temperature and humidity values in the display.

  7. Technology for the storage of radioactive materials packagings during maritime transport. Phase 1

    International Nuclear Information System (INIS)

    Ringot, C.; Chevalier, G.; Tomachevski, E.G.

    1989-01-01

    Following the accident of the M/S Mont Louis on August 25, 1984 carrying UF 6 cylinders, this report is a preliminary study of bibliographic data to help to define recommendations on packaging stowing for sea transport. Data on acceleration to take into account for normal or accidental transport conditions, safe areas on board that should be reserved for radioactive materials and accidents statistics are collected. Main information concerns: number of serious casualities or total losses to ships in European waters, accident causes, collision probability in function of mean distance between ships in the British Channel, selection of 8 reference accidents for future studies

  8. MO-H-19A-03: Patient Specific Bolus with 3D Printing Technology for Electron Radiotherapy

    International Nuclear Information System (INIS)

    Zou, W; Swann, B; Siderits, R; McKenna, M; Khan, A; Yue, N; Zhang, M; Fisher, T

    2014-01-01

    Purpose: Bolus is widely used in electron radiotherapy to achieve desired dose distribution. 3D printing technologies provide clinicians with easy access to fabricate patient specific bolus accommodating patient body surface irregularities and tissue inhomogeneity. This study presents the design and the clinical workflow of 3D printed bolus for patient electron therapy in our clinic. Methods: Patient simulation CT images free of bolus were exported from treatment planning system (TPS) to an in-house developed software package. Bolus with known material properties was designed in the software package and then exported back to the TPS as a structure. Dose calculation was carried out to examine the coverage of the target. After satisfying dose distribution was achieved, the bolus structure was transferred in Standard Tessellation Language (STL) file format for the 3D printer to generate the machine codes for printing. Upon receiving printed bolus, a quick quality assurance was performed with patient resimulated with bolus in place to verify the bolus dosimetric property before treatment started. Results: A patient specific bolus for electron radiotherapy was designed and fabricated in Form 1 3D printer with methacrylate photopolymer resin. Satisfying dose distribution was achieved in patient with bolus setup. Treatment was successfully finished for one patient with the 3D printed bolus. Conclusion: The electron bolus fabrication with 3D printing technology was successfully implemented in clinic practice

  9. MO-H-19A-03: Patient Specific Bolus with 3D Printing Technology for Electron Radiotherapy

    Energy Technology Data Exchange (ETDEWEB)

    Zou, W; Swann, B; Siderits, R; McKenna, M; Khan, A; Yue, N; Zhang, M [Rutgers University, New Brunswick, NJ (United States); Fisher, T [Memorial Medical Center, Modesto, CA (United States)

    2014-06-15

    Purpose: Bolus is widely used in electron radiotherapy to achieve desired dose distribution. 3D printing technologies provide clinicians with easy access to fabricate patient specific bolus accommodating patient body surface irregularities and tissue inhomogeneity. This study presents the design and the clinical workflow of 3D printed bolus for patient electron therapy in our clinic. Methods: Patient simulation CT images free of bolus were exported from treatment planning system (TPS) to an in-house developed software package. Bolus with known material properties was designed in the software package and then exported back to the TPS as a structure. Dose calculation was carried out to examine the coverage of the target. After satisfying dose distribution was achieved, the bolus structure was transferred in Standard Tessellation Language (STL) file format for the 3D printer to generate the machine codes for printing. Upon receiving printed bolus, a quick quality assurance was performed with patient resimulated with bolus in place to verify the bolus dosimetric property before treatment started. Results: A patient specific bolus for electron radiotherapy was designed and fabricated in Form 1 3D printer with methacrylate photopolymer resin. Satisfying dose distribution was achieved in patient with bolus setup. Treatment was successfully finished for one patient with the 3D printed bolus. Conclusion: The electron bolus fabrication with 3D printing technology was successfully implemented in clinic practice.

  10. Insect-resistant food packaging film development using cinnamon oil and microencapsulation technologies.

    Science.gov (United States)

    Kim, In-Hah; Han, Jaejoon; Na, Ja Hyun; Chang, Pahn-Sik; Chung, Myung Sub; Park, Ki Hwan; Min, Sea C

    2013-02-01

    Insect-resistant films containing a microencapsulated insect-repelling agent were developed to protect food products from the Indian meal moth (Plodia interpunctella). Cinnamon oil (CO), an insect repelling agent, was encapsulated with gum arabic, whey protein isolate (WPI)/maltodextrin (MD), or poly(vinyl alcohol) (PVA). A low-density polyethylene (LDPE) film was coated with an ink or a polypropylene (PP) solution that incorporated the microcapsules. The encapsulation efficiency values obtained with gum arabic, WPI/MD, and PVA were 90.4%, 94.6%, and 80.7%, respectively. The films containing a microcapsule emulsion of PVA and CO or incorporating a microcapsule powder of WPI/MD and CO were the most effective (P packaging for food products. The insect-repelling effect of cinnamon oil incorporated into LDPE films was more effective with microencapsulation. The system developed in this research with LDPE film may also be extended to other food-packaging films where the same coating platform can be used. This platform is interchangeable and easy to use for the delivery of insect-repelling agents. The films can protect a wide variety of food products from invasion by the Indian meal moth. © 2013 Institute of Food Technologists®

  11. Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes

    Science.gov (United States)

    Dalverny, O.; Alexis, J.

    2018-02-01

    This article deals with thermo-mechanical behavior of power electronic modules used in several transportation applications as railway, aeronautic or automotive systems. Due to a multi-layered structures, involving different materials with a large variation of coefficient of thermal expansion, temperature variations originated from active or passive cycling (respectively from die dissipation or environmental constraint) induces strain and stresses field variations, giving fatigue phenomenon of the system. The analysis of the behavior of these systems and their dimensioning require the implementation of complex modeling strategies by both the multi-physical and the multi-scale character of the power modules. In this paper we present some solutions for studying the thermomechanical behavior of brazed assemblies as well as taking into account the interfaces represented by the numerous metallizations involved in the process assembly.

  12. Technology and Power. A Foucauldian Analysis of Electronic Monitoring Discourses

    Directory of Open Access Journals (Sweden)

    Anna Vitores

    2007-05-01

    Full Text Available The article aims to show the importance of FOUCAULT within social studies of science and technology. It also illustrates how a Foucauldian analysis can be useful for studies of science, technology and society focused on power effects. To accomplish these objectives we analyze the emergence of a specific techno-scientific innovation: the electronic monitoring of offenders. We map the discontinuities and discourse dispersions linked to those practices that constitute different materializations of this electronic device. Because we start from questions concerning power technologies, rather than simply analyzing the ideologies and knowledges that legitimate electronic monitoring and its technical reliability, we attend to the assemblage of discourses, rhetorics, vocabularies, techniques and procedures by which knowledge is intertwined and joins with the exercise of power. In this way, we show how one of FOUCAULT's technologies of power—disciplinary technology—is articulated, nourished and contradicted by other emergent logics drawing on new forms of regulation and social control. URN: urn:nbn:de:0114-fqs070225

  13. Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

    International Nuclear Information System (INIS)

    Zhang Guang-Chen; Feng Shi-Wei; Zhou Zhou; Li Jing-Wan; Guo Chun-Sheng

    2011-01-01

    The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip-level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

  14. Developing electron beam bunching technology for improving light sources

    International Nuclear Information System (INIS)

    Carlsten, B.E.; Chan, K.C.D.; Feldman, D.W.

    1997-01-01

    This is the final report of a three-year, Laboratory-Directed Research and Development (LDRD) project at the Los Alamos National Laboratory (LANL). The goal of this project was to develop a new electron bunch compression technology, experimentally demonstrate subpicosecond compression of bunches with charges on the order of 1 nC, and to theoretically investigate fundamental limitations to electron bunch compression. All of these goals were achieved, and in addition, the compression system built for this project was used to generate 22 nm light in a plasma-radiator light source

  15. Test facilities for radioactive materials transport packages (Transportation Technology Center Inc., Pueblo, Colorado, USA)

    International Nuclear Information System (INIS)

    Conlon, P.C.L.

    2001-01-01

    Transportation Technology Center, Inc. is capable of conducting tests on rail vehicle systems designed for transporting radioactive materials including low level waste debris, transuranic waste, and spent nuclear fuel and high level waste. Services include rail vehicle dynamics modelling, on-track performance testing, full scale structural fatigue testing, rail vehicle impact tests, engineering design and technology consulting, and emergency response training. (author)

  16. Development of applications for Indian industry using electron beam technology

    International Nuclear Information System (INIS)

    Sarma, K.S.S.; Khader, S.A.; Sabharwal, S.

    2009-01-01

    This paper presents a report on the industrial applications that have been developed and demonstrated to the Indian industry using 2MeV/20kW Electron Beam accelerator at BARC-BRIT in the field of polymer modifications (crosslinking and degradation), gem stone coloration etc. Technological scale demonstration of the applications citing the benefits in terms of clean technology and better economics, encouraged three companies in private industry to set up EB facilities for the treatment of cable insulations, heat shrinkable products, diamond and gem stones during the last five years. Recent work on EB processing of automobile rubber tires is also included. (author)

  17. MEMS packaging: state of the art and future trends

    Science.gov (United States)

    Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

    1998-07-01

    Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

  18. Roadmapping - A Tool for Resolving Science and Technology Issues Related to Processing, Packaging, and Shipping Nuclear Materials and Waste

    International Nuclear Information System (INIS)

    Luke, Dale Elden; Dixon, Brent Wayne; Murphy, James Anthony

    2002-01-01

    Roadmapping is an effective methodology to identify and link technology development and deployment efforts to a program's or project's needs and requirements. Roadmapping focuses on needed technical support to the baselines (and to alternatives to the baselines) where the probability of success is low (high uncertainty) and the consequences of failure are relatively high (high programmatic risk, higher cost, longer schedule, or higher ES and H risk). The roadmap identifies where emphasis is needed, i.e., areas where investments are large, the return on investment is high, or the timing is crucial. The development of a roadmap typically involves problem definition (current state versus the desired state) and major steps (functions) needed to reach the desired state. For Nuclear Materials (NM), the functions could include processing, packaging, storage, shipping, and/or final disposition of the material. Each function is examined to determine what technical development would be needed to make the function perform as desired. This requires a good understanding of the current state of technology and technology development and validation activities to ensure the viability of each step. In NM disposition projects, timing is crucial. Technology must be deployed within the project window to be of value. Roadmaps set the stage to keep the technology development and deployment focused on project milestones and ensure that the technologies are sufficiently mature when needed to mitigate project risk and meet project commitments. A recent roadmapping activity involved a 'cross-program' effort, which included NM programs, to address an area of significant concern to the Department of Energy (DOE) related to gas generation issues, particularly hydrogen. The roadmap that was developed defined major gas generation issues within the DOE complex and research that has been and is being conducted to address gas generation concerns. The roadmap also provided the basis for sharing

  19. Power electronics - The key technology for Renewable Energy Systems

    DEFF Research Database (Denmark)

    Blaabjerg, Frede; Ma, Ke; Yang, Yongheng

    2014-01-01

    The energy paradigms in many countries (e.g. Germany and Denmark) have experienced a significant change from fossil-based resources to clean renewables (e.g. wind turbines and photovoltaics) in the past few decades. The scenario of highly penetrated renewables is going to be further enhanced...... - Denmark expects to be 100 % fossil-free by 2050. Consequently, it is required that the production, distribution and use of the energy should be as technologically efficient as possible and incentives to save energy at the end-user should also be strengthened. In order to realize the transition smoothly...... and effectively, energy conversion systems, currently based on power electronics technology, will again play an essential role in this energy paradigm shift. Using highly efficient power electronics in power generation, power transmission/distribution and end-user application, together with advanced control...

  20. Intellectual property in consumer electronics, software and technology startups

    CERN Document Server

    Halt, Jr , Gerald B; Stiles, Amber R; Fesnak, Robert

    2014-01-01

    This book provides a comprehensive guide to procuring, utilizing and monetizing intellectual property rights, tailored for readers in the high-tech consumer electronics and software industries, as well as technology startups.  Numerous, real examples, case studies and scenarios are incorporated throughout the book to illustrate the topics discussed.  Readers will learn what to consider throughout the various creative phases of a product’s lifespan from initial research and development initiatives through post-production.  Readers will gain an understanding of the intellectual property protections afforded to U.S. corporations, methods to pro-actively reduce potential problems, and guidelines for future considerations to reduce legal spending, prevent IP theft, and allow for greater profitability from corporate innovation and inventiveness. • Offers a comprehensive guide to intellectual property for readers in high-tech consumer electronics, software and technology startups; • Uses real case studies...

  1. Mathematical Model of Plasma Space for Electronic Technologies

    OpenAIRE

    N.N. Chernyshov; K.T. Umyarov; D.V. Pisarenko

    2014-01-01

    The paper is devoted to studying the plasma used in technologies of the electronic industry. It gives the characteristic of plasma space on the basis of a system of Maxwell-Boltzmann equa-tions. Solving these equations is represented in the form of Fourier transformation and Green functions. Fluctuation-dissipative theorem and method of Longevin sources for calculating electric filed fluctua-tions are used.

  2. Electronic-projecting Moire method applying CBR-technology

    Science.gov (United States)

    Kuzyakov, O. N.; Lapteva, U. V.; Andreeva, M. A.

    2018-01-01

    Electronic-projecting method based on Moire effect for examining surface topology is suggested. Conditions of forming Moire fringes and their parameters’ dependence on reference parameters of object and virtual grids are analyzed. Control system structure and decision-making subsystem are elaborated. Subsystem execution includes CBR-technology, based on applying case base. The approach related to analysing and forming decision for each separate local area with consequent formation of common topology map is applied.

  3. Leveraging Technological Capabilities across Polarized Cultures: Shanghai Delco Electronics Limited

    OpenAIRE

    Lucy A. Ojode

    2006-01-01

    Rallying its units for an impending spin-off from General Motors, the Delphi Automotive Systems division cleared the Delphi Delco Electronics (Delphi-D) unit to begin planning for entry into China in 1994. Delphi saw China as ideal for leveraging its technological and innovation capabilities as well as the enormous General Motor heritage and reputation from years of experience delivering quality products to the automotive industry. Delphi-D found a perfect partner in Shanghai Changjiang YiBia...

  4. Development of electron beam flue gas treatment technology

    International Nuclear Information System (INIS)

    Tanaka, T.

    1995-01-01

    The electron beam flue gas treatment technology is expected to bring many advantages such as the simultaneous reduction of SO x and NO x emissions, a dry process without waste water, valuable fertilizer byproducts, etc. In order to verify the feasibility and performances of the process, a practical application test is carried out with a pilot plant which treats the actual flue gas from a coal-fired boiler. Results are presented. 4 figs., 2 tabs

  5. Power cycling test of a 650 V discrete GaN-on-Si power device with a laminated packaging embedding technology

    DEFF Research Database (Denmark)

    Song, Sungyoung; Munk-Nielsen, Stig; Uhrenfeldt, Christian

    2017-01-01

    A GaN-on-Si power device is a strong candidate to replace power components based on silicon in high-end market for low-voltage applications, thanks to its electrical characteristics. To maximize opportunities of the GaN device in field applications, a package technology plays an important role...... in a discrete GaN power device. A few specialized package technologies having very lower stray inductance and higher thermal conductivity have been proposed for discrete GaN-on-Si power devices. Despite their superior performance, there has been little discussion of their reliability. The paper presents a power...... cycling test of a discrete GaN power device employing a laminated embedded packaging technology subjected to 125 degrees Celsius junction temperature swing. Failure modes are described with collected electrical characteristics and measured temperature data under the test. In conclusion, physical...

  6. Assessment of environmental impact of ultraviolet radiation or electron beam cured print inks on plastic packaging materials

    International Nuclear Information System (INIS)

    Bardi, Marcelo Augusto Goncalves

    2014-01-01

    The high level of pollution generated by the inadequate disposal of polymeric materials has motivated the search for environmentally friendly systems and techniques such as the application of biodegradable polymers and the replacement of the solvent-based paint systems by those with high solids content, based water or cured by radiation, practically free of volatile organic compounds. However, the cured polymer coatings are neither soluble nor molten, increasing the complexity of the reprocessing, recycling and degradation. Thus, this work aimed to develop print inks modified with pro-degrading agents, cured by ultraviolet radiation or electron beam, for printing or decoration in plastic packaging products of short lifetime, which are biodegradable or not. Six coatings (varnish and inks in five colors: yellow, blue, white, black and red), three pro-degrading agents (cobalt stearate, cerium stearate and manganese stearate), five polymeric substrates (Ecobras®, low density polyethylene and its respective modifications with pro-degrading agents). The coatings were applied to the substrates and cured by ultraviolet radiation or electron beam, resulting in 180 samples. These materials were then exposed to accelerated aging chamber, type 'QUV', and composting in natural environment. In order to assess the effects of the polymer coatings on the degradation process of the specimens, only the yellow and black samples were exposed to a controlled composting environment via respirometry, reducing to 16 the number of samples. The organic compound generated by the biodegradation process was analyzed by the ecotoxicity tests. It was observed that the coating layer acted as a barrier that inhibits degradation of the plastic when exposed to weathering. The addition of pro-degrading agents promoted acceleration in the degradation process, promoting the migration of the metal ion to the medium without affecting the final quality of the organic compost. (author)

  7. Lithium niobate packaging challenges

    International Nuclear Information System (INIS)

    Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

    1988-01-01

    The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

  8. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  9. PVD Silicon Carbide as a Thin Film Packaging Technology for Antennas on LCP Substrates for Harsh Environments

    Science.gov (United States)

    Scardelletti, Maximilian C.; Stanton, John W.; Ponchak, George E.; Jordan, Jennifer L.; Zorman, Christian A.

    2010-01-01

    This paper describes an effort to develop a thin film packaging technology for microfabricated planar antennas on polymeric substrates based on silicon carbide (SiC) films deposited by physical vapor deposition (PVD). The antennas are coplanar waveguide fed dual frequency folded slot antennas fabricated on liquid crystal polymer (LCP) substrates. The PVD SiC thin films were deposited directly onto the antennas by RF sputtering at room temperature at a chamber pressure of 30 mTorr and a power level of 300 W. The SiC film thickness is 450 nm. The return loss and radiation patterns were measured before and after the SiC-coated antennas were submerged into perchloric acid for 1 hour. No degradation in RF performance or physical integrity of the antenna was observed.

  10. Status of electron beam processing technology in Malaysia

    International Nuclear Information System (INIS)

    Ghazali, Zulkafli; Dahlan, Khairul Zaman; Aiasah, S.H.; Khomsaton, A.B.; Ting, T.M.

    2003-01-01

    The electron beam processing in Malaysia starting in 1991 at MINT (Malaysian Institute for Nuclear Technology Research) has been focussed on medical product sterilization, curing of surface coating and polymer modifications. Subsequent installation of accelerators by private companies promoted the development of radiation processing technologies for the use of production of heat-shrinkable products, pilot-scale flue gas purification, as well as wires, cables, tubes and hydrogels. Decomposition of a wide range of volatile organic compounds from industrial exhausts (car painting lines, volatile dioxin and furan from municipal waste incinerators) and purification of liquid wastewater and drinking water are also being under R and D work. Malaysia will continue to play an active part in the program on radiation technology to strengthen environmentally sustainable development in line with FNCA objectives. (S. Ohno)

  11. Application of electron beam curing technology for paper products

    International Nuclear Information System (INIS)

    Takaharu Miura

    1999-01-01

    The electron beam (EB) curing technology has rapidly advanced in recent years. However there were few examples applying this technology to paper products. One reason comes from the high price of EB equipment and the other comes from the difficulty of controlling the irradiation which gives damages to paper. In spite of these problems, the EB cured coating layer shows remarkable features, such as solvent-resistance, water-resistance, heat-resistance and high smoothness using the drum casting technique. Concentrating on application of this technology to paper, we have already developed some products. For example, paper for printings (Super Mirror PN) and for white boards (Super Mirror WB) have been manufactured. In this presentation, we are going to introduce this EB curing technique and the products

  12. Vacuum technologies developed for at-400A Type B transportation and storage package

    International Nuclear Information System (INIS)

    Franklin, K.W.; Cockrell, G.D.

    1995-01-01

    The AT-400A TYPE B transportation and storage container will be used at Pantex Plant for the transportation and interim storage of plutonium pits. The AT-400A was designed by a joint effort between Sandia National Labs, Los Alamos National Labs, Lawrence Livermore National Laboratory, and Mason and Hanger-Silas Mason Co., Inc. In order to meet the requirements for transportation and storage, five different vacuum technologies had to be developed. The goals of the various vacuum technologies were to verify the plutonium pit was sealed, perform the assembly verification leak check in accordance with ANSI N-14.5 and to provide a final inert gas backfill in the containment vessel. This paper will discuss the following five vacuum technologies: (1) Pit Leak Testing, (2) Containment Vessel Purge and Backfill with tracer gas, (3) Containment Vessel Leak Testing, (4) Containment Vessel Purge and Final Backfill, and (5) Leak Testing of the Containment Vessel Gas Transfer tube

  13. Self-adaptive phosphor coating technology for wafer-level scale chip packaging

    International Nuclear Information System (INIS)

    Zhou Linsong; Rao Haibo; Wang Wei; Wan Xianlong; Liao Junyuan; Wang Xuemei; Zhou Da; Lei Qiaolin

    2013-01-01

    A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied and exposed to LED blue light itself and developed to form a conformal phosphor coating with self-adaptability to the angular distribution of intensity of blue light and better-performing spatial color uniformity. The self-adaptive phosphor coating technology had been successfully adopted in the wafer surface to realize a wafer-level scale phosphor conformal coating. The first-stage experiments show satisfying results and give an adequate demonstration of the flexibility of self-adaptive coating technology on application of WLSCP. (semiconductor devices)

  14. Development of superconducting acceleration cavity technology for free electron lasers

    International Nuclear Information System (INIS)

    Lee, Jong Min; Lee, Byung Cheol; Kim, Sun Kook; Jeong, Young Uk; Cho, Sung Oh

    2000-10-01

    As a result of the cooperative research between the KAERI and Peking University, the key technologies of superconducting acceleration cavity and photoelectron gun have been developed for the application to high power free electron lasers. A 1.5-GHz, 1-cell superconducting RF cavity has been designed and fabricated by using pure Nb sheets. The unloaded Q values of the fabricated superconducting cavity has been measured to be 2x10 9 at 2.5K, and 8x10 9 at 1.8K. The maximum acceleration gradient achieved was 12 MeV/m at 2.5K, and 20MV/m at 1.8 K. A cryostat for the 1-cell superconducting cavity has been designed. As a source of electron beam, a DC photocathode electron gun has been designed and fabricated, which is composed of a photocathode evaporation chamber and a 100-keV acceleration chamber. The efficiency of the Cs2Te photocathode is 3% nominally at room temperature, 10% at 290 deg C. The superconducting photoelectron gun system developed has been estimated to be a good source of high-brightness electron beam for high-power free electron lasers

  15. Innovative technologies in course Electrical engineering and electronics

    Science.gov (United States)

    Kuznetsov, E. V.; Kiselev, V. I.; Kulikova, E. A.

    2017-11-01

    Department of Electrical Engineering and Nondestructive Testing, NRU “MPEI”, has been working on development Electronic Learning Resources (ELRs) in course Electrical Engineering and Electronics for several years. This work have been focused on education intensification and effectiveness while training bachelors in nonelectrical specializations including students from Thermal and Atomic Power Engineering Institute. The developed ELRs are united in a tutorial module consisting of three parts (Electrical Circuits, Electrical Machines, Basics of Electronics): electronic textbook and workbook (ETW); virtual laboratory sessions (VLS); training sessions (ETS); personal tasks (PT); testing system that contains electronic tests in all course subjects and built-in verification of a student’s work results in ETW, VLS, ETS, PT. The report presents samples of different ELRs in html format and MathCAD, MatLAB Simulink applications, copyrighted programs in Java2, Delphi, VB6, C++. The report also contains the experience description, advantages and disadvantages of the new technologies. It is mentioned that ELRs provide new opportunities in course studying.

  16. Development of superconducting acceleration cavity technology for free electron lasers

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Jong Min; Lee, Byung Cheol; Kim, Sun Kook; Jeong, Young Uk; Cho, Sung Oh

    2000-10-01

    As a result of the cooperative research between the KAERI and Peking University, the key technologies of superconducting acceleration cavity and photoelectron gun have been developed for the application to high power free electron lasers. A 1.5-GHz, 1-cell superconducting RF cavity has been designed and fabricated by using pure Nb sheets. The unloaded Q values of the fabricated superconducting cavity has been measured to be 2x10{sup 9} at 2.5K, and 8x10{sup 9} at 1.8K. The maximum acceleration gradient achieved was 12 MeV/m at 2.5K, and 20MV/m at 1.8 K. A cryostat for the 1-cell superconducting cavity has been designed. As a source of electron beam, a DC photocathode electron gun has been designed and fabricated, which is composed of a photocathode evaporation chamber and a 100-keV acceleration chamber. The efficiency of the Cs2Te photocathode is 3% nominally at room temperature, 10% at 290 deg C. The superconducting photoelectron gun system developed has been estimated to be a good source of high-brightness electron beam for high-power free electron lasers.

  17. Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

    International Nuclear Information System (INIS)

    Cao Yuhan; Luo Le

    2009-01-01

    A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu 6 Sn 5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 x 10 -9 atm cc/s are possible, meeting the demands of MIL-STD-883E. (semiconductor technology)

  18. Determining the feasibility of objective adherence measurement with blister packaging smart technology

    NARCIS (Netherlands)

    Onzenoort, H.A. van; Neef, C.; Verberk, W.W.; van Iperen, H.P.; Leeuw, P.W. de; van der Kuy, P.H.

    2012-01-01

    PURPOSE: The results of a feasibility study of blister-pack smart technology for monitoring medication adherence are reported. METHODS: Research in the area of objective therapy compliance measurement has led to the development of microprocessor-driven systems that record the time a unit dose is

  19. Miniature stick-packaging--an industrial technology for pre-storage and release of reagents in lab-on-a-chip systems.

    Science.gov (United States)

    van Oordt, Thomas; Barb, Yannick; Smetana, Jan; Zengerle, Roland; von Stetten, Felix

    2013-08-07

    Stick-packaging of goods in tubular-shaped composite-foil pouches has become a popular technology for food and drug packaging. We miniaturized stick-packaging for use in lab-on-a-chip (LOAC) systems to pre-store and on-demand release the liquid and dry reagents in a volume range of 80-500 μl. An integrated frangible seal enables the pressure-controlled release of reagents and simplifies the layout of LOAC systems, thereby making the package a functional microfluidic release unit. The frangible seal is adjusted to defined burst pressures ranging from 20 to 140 kPa. The applied ultrasonic welding process allows the packaging of temperature sensitive reagents. Stick-packs have been successfully tested applying recovery tests (where 99% (STDV = 1%) of 250 μl pre-stored liquid is released), long-term storage tests (where there is loss of only <0.5% for simulated 2 years) and air transport simulation tests. The developed technology enables the storage of a combination of liquid and dry reagents. It is a scalable technology suitable for rapid prototyping and low-cost mass production.

  20. Evaluation of the effects of electron-beam irradiation on the puncture resistance by Lasioderma serricorne in flexible packaging of granola

    International Nuclear Information System (INIS)

    Oliveira, Vitor M.; Alves, Juliana N.; Nogueira, Beatriz R.; Moura, Esperidiana A.B.; Ortiz, Angel V.; Potenza, Marcos R.

    2009-01-01

    Lasioderma serricorne is a beetle that infests stored and industrialized dry foods such as cereal bars, granola, flour and pasta, amongst others, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by L. serricorne in BOPP/PP structure, used commercially as granola packaging after electron-beam irradiation. The irradiations were performed using a 1.5 MeV electron beam accelerator, dose rate of 11.22 kGy/s, at room temperature in presence of air, doses up to 120 kGy. After irradiation the BOPP/PP samples were subjected to tests of puncture resistance by L. serricorne, tensile strength, friction coefficient, penetration and seal strength. Results showed decreases in the original mechanical properties of the structure according to the radiation doses applied and effective resistance against punctures by L. serricorne (p<0.05). The results indicate that the irradiated and non-irradiated BOPP/PP structure, in the conditions studied in this work, is resistant against L. serricorne, however the decreases observed in the mechanical properties of the irradiated structure may turn it inappropriate for packaging granola. (author)

  1. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

    International Nuclear Information System (INIS)

    Murray, Kieran A.; Kennedy, James E.; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L.

    2014-01-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance

  2. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

    Energy Technology Data Exchange (ETDEWEB)

    Murray, Kieran A., E-mail: kmurray@research.ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); Kennedy, James E., E-mail: jkennedy@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); McEvoy, Brian, E-mail: Brian.Mcevoy@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Vrain, Olivier, E-mail: Olivier.Vrain@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Ryan, Damien, E-mail: Damien.Ryan@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Cowman, Richard, E-mail: Richard.Cowman@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Higginbotham, Clement L., E-mail: chigginbotham@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland)

    2014-06-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance.

  3. Healthcare technology innovation adoption electronic health records and other emerging health information technology innovations

    CERN Document Server

    Daim, Tugrul U; Basoglu, Nuri; Kök, Orhun M; Hogaboam, Liliya

    2016-01-01

    This book aims to study the factors affecting the adoption and diffusion of Health Information Technology (HIT) innovation. It analyzes the adoption processes of various tools and applications, particularly Electronic Health Records (EHR), highlighting the impact on various sectors of the healthcare system, such as physicians, administration,  and patient care, while also identifying the various pitfalls and gaps in the literature. With the various challenges currently facing the United States healthcare system, the study, adoption and diffusion of healthcare technology innovation, particularly HIT, is imperative to achieving national goals. This book is organized into three sections. Section one reviews theories and applications for the diffusion of Health Care Technologies. Section two evaluates EHR technology, including the barriers and enables in adoption and alternative technologies. Finally, section three examines the factors impacting the adoption of EHR systems. This book will be a key source for stu...

  4. Repetitive nanosecond electron accelerators type URT-1 for radiation technology

    Science.gov (United States)

    Sokovnin, S. Yu.; Balezin, M. E.

    2018-03-01

    The electron accelerator URT-1М-300 for mobile installation was created for radiation disinfecting to correct drawbacks that were found the URT-1M electron accelerator operation (the accelerating voltage up to 1 МV, repetition rate up to 300 pps, electron beam size 400 × 100 mm, the pulse width about 100 ns). Accelerator configuration was changed that allowed to reduce significantly by 20% tank volume with oil where is placed the system of formation high-voltage pulses, thus the average power of the accelerator is increased by 6 times at the expense of increase in pulses repetition rate. Was created the system of the computerized monitoring parameters (output parameters and thermal mode) and remote control of the accelerator (charge voltage, pulse repetition rate), its elements and auxiliary systems (heat of the thyratron, vacuum system), the remote control panel is connected to the installation by the fiber-optical channel, what lightens the work for service personnel. For generating an electron beam up to 400 mm wide there are used metal- ceramic] and metal-dielectric cold cathodes of several emission elements (plates) with a non-uniform distribution of the electron beam current density on the output foil ± 15%. It was found that emission drop of both type of cathodes, during the operation at the high repetition rate (100 pps) is substantial at the beginning of the process, and then proceeds rather slowly that allows for continuous operation up to 40 h. Experiments showed that linear dependence of the voltage and a signal from the pin-diode remains within the range of the charge voltage 45-65 kV. Thus, voltage increases from 690 to 950 kV, and the signal from the pin-diode - from (2,8-4,6)*104 Gy/s. It allows to select electron energy quite precisely with consideration of the radiation technology requirements.

  5. Reflective Packaging

    Science.gov (United States)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  6. Application of the air/water cushion technology for handling of heavy waste packages in Sweden and France

    International Nuclear Information System (INIS)

    Bosgiraud, Jean-Michel; Seidler, Wolf K.; Londe, Louis; Thurner, Erik; Pettersson, Stig

    2008-01-01

    The disposal of certain types of radioactive waste canisters in a deep repository involves handling and emplacement of very heavy loads. The weight of these particular canisters can be in the order of 20 to 50 metric tons. They generally have to be handled underground in openings that are not much larger than the canisters themselves as it is time consuming and expensive to excavate and backfill large openings in a repository. This therefore calls for the development of special technology that can meet the requirements for safe operation in an industrial scale in restrained operating spaces. Air/water cushion lifting systems are used world wide in the industry for moving heavy loads. However, until now the technology needed for emplacing heavy cylindrical radioactive waste packages in bored drifts (with narrow annular gaps) has not been developed or demonstrated previously. This paper describes the related R and D work carried out by ANDRA (for air cushion technology) and by SKB and Posiva (for water cushion technology) respectively, mainly within the framework of the European Commission (EC) funded Integrated Project called ESDRED (6th European Framework Programme). The background for both the air and the water cushion applications is presented. The specific characteristics of the two different emplacement concepts are also elaborated. The various phases of the Test Programmes (including the Prototype phases) are detailed and illustrated for the two lifting media. Conclusions are drawn for each system developed and evaluated. Finally, based on the R and D experience, improvements deemed necessary for an industrial application are listed. The tests performed so far have shown that the emplacement equipment developed is operating efficiently. However further tests are required to verify the availability and the reliability of the equipment over longer periods of time and to identify the modifications that would be needed for an industrial application in a nuclear

  7. Monolithic millimeter-wave and picosecond electronic technologies

    International Nuclear Information System (INIS)

    Talley, W.K.; Luhmann, N.C.

    1996-01-01

    Theoretical and experimental studies into monolithic millimeter-wave and picosecond electronic technologies have been undertaken as a collaborative project between the Lawrence Livermore National Laboratory (LLNL) and the University of California Department of Applied Science Coherent Millimeter-Wave Group under the auspices of the Laboratory Directed Research and Development Program at LLNL. The work involves the design and fabrication of monolithic frequency multiplier, beam control, and imaging arrays for millimeter-wave imaging and radar, as well as the development of high speed nonlinear transmission lines for ultra-wideband radar imaging, time domain materials characterization and magnetic fusion plasma applications. In addition, the Coherent Millimeter-Wave Group is involved in the fabrication of a state-of-the-art X-band (∼8-11 GHz) RF photoinjector source aimed at producing psec high brightness electron bunches for advanced accelerator and coherent radiation generation studies

  8. Power electronics - key technology for renewable energy systems

    DEFF Research Database (Denmark)

    Blaabjerg, Frede; Iov, Florin; Kerekes, Tamas

    2011-01-01

    sources to renewable energy sources. Another is to use high efficient power electronics in power generation, power transmission/distribution and end-user application. This paper discuss trends of the most emerging renewable energy sources, wind energy and photovoltaics, which by means of power electronics...... as efficient as possible. Further, the emerging climate changes is arguing to find sustainable future solutions. Of many options, two major technologies will play important roles to solve parts of those future problems. One is to change the electrical power production from conventional, fossil based energy......The electrical energy consumption continues to grow and more applications are based on electricity. We can expect that more 60% of all energy consumption will be converted and used as electricity. Therefore, it is a demand that production, distribution and use of electrical energy are done...

  9. A comprehensible need of zinc oxide varistors in electronics technology

    International Nuclear Information System (INIS)

    Mehmood, F.S.

    2007-01-01

    A range of varistors, in terms of break down voltage, is required to protect integrated circuits, automotive systems and other modern electronics against transient over-voltages. There is a progressing need for the development and advancement of rugged and reliable varistor capable and proficient of working in harsh and callous environment like automotive Industry where greater than before use of electronics technology has led to improvements in equipment performance and presentation. There is a comprehensible need to combine triumphant and successable models developed at different length scales into an integrated framework that can be used to drive new research and guide experimental efforts and device development. The review of ZnO varistor in particular and metal-oxide varistors (MOVs) in general is presented In this article. (author)

  10. Control system by the technological electron Linac KUT-20

    CERN Document Server

    Akchurin, Y I; Gurin, V A; Demidov, N V

    2001-01-01

    The high-power technological electron linac KUT-20 was developed at the Science Research Complex 'Accelerator' of NSC KIPT. The linac consists of two 1.2 m length accelerating structures with a variable geometry and an injector. The latter comprises a diode electron gun,a klystron type buncher and an accelerating cavity.With a RF supply power at accelerating structure entries of 11 MW and with a current at the accelerator exit of 1A,the beam energy will be up to 20 MeV.An average beam power is planned to be 20 kW.All systems of the accelerator are controlled by a computerised control system. The program and technical complex consist of PC equipped with fast ADC control console, synchronization unit, microprocessor-operated complexes.

  11. 3D Printing Technologies for Flexible Tactile Sensors toward Wearable Electronics and Electronic Skin

    Directory of Open Access Journals (Sweden)

    Changyong Liu

    2018-06-01

    Full Text Available 3D printing has attracted a lot of attention in recent years. Over the past three decades, various 3D printing technologies have been developed including photopolymerization-based, materials extrusion-based, sheet lamination-based, binder jetting-based, power bed fusion-based and direct energy deposition-based processes. 3D printing offers unparalleled flexibility and simplicity in the fabrication of highly complex 3D objects. Tactile sensors that emulate human tactile perceptions are used to translate mechanical signals such as force, pressure, strain, shear, torsion, bend, vibration, etc. into electrical signals and play a crucial role toward the realization of wearable electronics and electronic skin. To date, many types of 3D printing technologies have been applied in the manufacturing of various types of tactile sensors including piezoresistive, capacitive and piezoelectric sensors. This review attempts to summarize the current state-of-the-art 3D printing technologies and their applications in tactile sensors for wearable electronics and electronic skin. The applications are categorized into five aspects: 3D-printed molds for microstructuring substrate, electrodes and sensing element; 3D-printed flexible sensor substrate and sensor body for tactile sensors; 3D-printed sensing element; 3D-printed flexible and stretchable electrodes for tactile sensors; and fully 3D-printed tactile sensors. Latest advances in the fabrication of tactile sensors by 3D printing are reviewed and the advantages and limitations of various 3D printing technologies and printable materials are discussed. Finally, future development of 3D-printed tactile sensors is discussed.

  12. Electron beam technology for production of preparations of immobilized enzymes

    International Nuclear Information System (INIS)

    Gonchar, A.M.; Auslender, V.L.; Polyakov, V.A.

    1995-01-01

    Possibility of electron beam usage for proteases immobilization on 1,4-polyalkylene oxide (1,4-PAO) was studied to obtain biologically active complex for multi-purpose usage. It is shown that immobilization of Bacillus Subtilis protease is done due to free-radical linking of enzyme and carrier with formation of mycelium-like structures. Immobilization improves heat resistance of enzyme up to 60 centigrade without substrate and up to 80 centigrade in presence of substrate, widens range pH activity in comparison with non-immobilized forms. Immobilized proteases does not contain peroxides and long-live radicals. Our results permitted to create technologies for production of medical and veterinary preparations, active components for wool washing agents and leather fabrication technology

  13. 39 CFR 255.4 - Accessibility to electronic and information technology.

    Science.gov (United States)

    2010-07-01

    ... AND INFORMATION TECHNOLOGY § 255.4 Accessibility to electronic and information technology. (a) In... burden, that the electronic and information technology the agency procures allows— (1) Individuals with... 39 Postal Service 1 2010-07-01 2010-07-01 false Accessibility to electronic and information...

  14. Technology of silicon charged-particle detectors developed at the Institute of Electron Technology (ITE)

    Science.gov (United States)

    Wegrzecka, Iwona; Panas, Andrzej; Bar, Jan; Budzyński, Tadeusz; Grabiec, Piotr; Kozłowski, Roman; Sarnecki, Jerzy; Słysz, Wojciech; Szmigiel, Dariusz; Wegrzecki, Maciej; Zaborowski, Michał

    2013-07-01

    The paper discusses the technology of silicon charged-particle detectors developed at the Institute of Electron Technology (ITE). The developed technology enables the fabrication of both planar and epiplanar p+-ν-n+ detector structures with an active area of up to 50 cm2. The starting material for epiplanar structures are silicon wafers with a high-resistivity n-type epitaxial layer ( ν layer - ρ < 3 kΩcm) deposited on a highly doped n+-type substrate (ρ< 0,02Ωcm) developed and fabricated at the Institute of Electronic Materials Technology. Active layer thickness of the epiplanar detectors (νlayer) may range from 10 μm to 150 μm. Imported silicon with min. 5 kΩcm resistivity is used to fabricate planar detectors. Active layer thickness of the planar detectors (ν) layer) may range from 200 μm to 1 mm. This technology enables the fabrication of both discrete and multi-junction detectors (monolithic detector arrays), such as single-sided strip detectors (epiplanar and planar) and double-sided strip detectors (planar). Examples of process diagrams for fabrication of the epiplanar and planar detectors are presented in the paper, and selected technological processes are discussed.

  15. Effects of electron beam radiation on mechanical properties and on the resistance to punctures caused by Plodia interpunctella in cereal bar packaging

    International Nuclear Information System (INIS)

    Alves, Juliana N.; Moura, Esperidiana A.B.; Oliveira, Vitor M.; Potenza, Marcos R.; Arthur, Valter

    2009-01-01

    Plodia interpunctella is an important pest in stored products in the tropical and subtropical regions, infesting grains and flours. The adult of P. interpunctella is a small butterfly with about 15 - 20mm of spread and the female places separately of 100 the 400 eggs in groups on the grains whose hard incubation some days. This insect infesting diverse types of food packaging, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by P. interpunctella in BOPPmet/BOPP structure, used commercially as cereal bar packaging, after electron beam irradiation. The material samples were irradiated up to 120 kGy using a 1.5 MeV electrostatic accelerator, at room temperature, in air, dose rate 11.22 kGy/s. Irradiation doses were measured using cellulose triacetate film dosimeters 'CTA-FTR-125' from Fuji Photo Film Co. Ltd. After irradiation the BOPPmet/BOPP samples were subjected to tests of puncture resistance by P. interpunctella, tensile tests and penetration resistance. The results showed significant decreases (p<0.05) in the original mechanical properties of the structures according to the radiation doses applied and effective resistance against punctures by P. interpunctella for irradiated and nonirradiated BOPPmet/BOPP samples. These results indicate that non-irradiated and irradiated BOPPmet/BOPP structure presents puncture resistance against P. interpunctella and that electron-beam irradiation, in conditions studied in this work, may turn the structure inappropriate for cereal bar packaging, due to high reduction its mechanical properties after irradiation. (author)

  16. Flue gas cleaning by electron beam technology in 21st

    International Nuclear Information System (INIS)

    Xu Guang; Luo Jingyu; Zhang Ming

    2005-01-01

    China is paying great attention to the pollution caused by flue gases including sulfur oxides, nitrogen oxides, fine particles, and volatile organic compounds (VOC) for the environmental protection and sustainable development of China economy for 21st century. Among several promising processes, applicable to industrial scale, the electron beam (EB) scrubbing process can simultaneously remove SO 2 , NOx, PM-10 (particulate matter 10 μm or less in diameter), VOC and CO 2 from the flue gas is a new high technology combined with radiation chemistry and electron accelerator technique. The EB flue gas purification process consists of the producing ionization in the EB irradiated gases followed by the formation of free radicals and active species which ultimately forming foggy sulfur acid and nitrate acid. These acids react further with added ammonia to form ammonium sulfate and nitrates as by-products, which can be fertilizer usable in agriculture. The next stage for this technology is its optimization for the reduction of electricity energy consumption and an effective collection of by-products. Lastly the investment cost for EB method is shown to be the most economic compared with other competing methods. (S. Ohno)

  17. 16 CFR 6.152 - Program accessibility: Electronic and information technology.

    Science.gov (United States)

    2010-01-01

    ... information technology. 6.152 Section 6.152 Commercial Practices FEDERAL TRADE COMMISSION ORGANIZATION... information technology. (a) When developing, procuring, maintaining, or using electronic and information... electronic and information technology allows, regardless of the type of medium of the technology: (1...

  18. Packaging - Materials review

    Energy Technology Data Exchange (ETDEWEB)

    Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  19. Packaging - Materials review

    Science.gov (United States)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  20. Packaging - Materials review

    International Nuclear Information System (INIS)

    Herrmann, Matthias

    2014-01-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  1. Electron beam technology as a new industrial processing tool in Malaysia

    International Nuclear Information System (INIS)

    Zaman, K.

    1996-01-01

    Electron beam cross-linked products such as heat resistant automobile and home appliance wires, heat shrinkable tubes, sleeves, end caps for power and electronic industries, plastic packaging and semiconductors are commercially available in Malaysia and most of them are imported products. However, recently there are three newly established in-house industrial electron beam accelerators, in operation in Malaysia for cross-linking of home appliance wires and plastic packaging. Another electron beam accelerator of 3.0 MV, 90 kW is stationed in MINT which is used for research as well as for irradiation services. Research on electron beam cross-linking of natural polymer is one of the main subjects of interest. (author)

  2. Raman spectroscopy, electronic microscopy and SPME-GC-MS to elucidate the mode of action of a new antimicrobial food packaging material.

    Science.gov (United States)

    Clemente, Isabel; Aznar, Margarita; Salafranca, Jesús; Nerín, Cristina

    2017-02-01

    One critical challenge when developing a new antimicrobial packaging material is to demonstrate the mode of action of the antimicrobials incorporated into the packaging. For this task, several analytical techniques as well as microbiology are required. In this work, the antimicrobial properties of benzyl isothiocyanate, allyl isothiocyanate and essential oils of cinnamon and oregano against several moulds and bacteria have been evaluated. Benzyl isothiocyanate showed the highest antimicrobial activity and it was selected for developing the new active packaging material. Scanning electron microscopy and Raman spectroscopy were successfully used to demonstrate the mode of action of benzyl isothiocyanate on Escherichia coli. Bacteria exhibited external modifications such as oval shape and the presence of septum surface, but they did not show any disruption or membrane damage. To provide data on the in vitro action of benzyl isothiocyanate and the presence of inhibition halos, the transfer mechanism to the cells was assessed using solid-phase microextraction-gas chromatography-mass spectrometry. Based on the transfer system, action mechanism and its stronger antimicrobial activity, benzyl isothiocyanate was incorporated to two kinds of antimicrobial labels. The labels were stable and active for 140 days against two mould producers of ochratoxin A; Penicillium verrucosum is more sensitive than Aspergillus ochraceus. Details about the analytical techniques and the results obtained are shown and discussed. Graphical Abstract Antimicrobial evaluation of pure compounds, incorporation in the packaging and study for mode of action on S. coli by Raman, SEM and SPME-GC-MS.

  3. Applications of Active Packaging in Breads

    Directory of Open Access Journals (Sweden)

    Ali Göncü

    2017-10-01

    Full Text Available Changes on consumer preferences lead to innovations and improvements in new packaging technologies. With these new developments passive packaging technologies aiming to protect food nowadays have left their place to active and intelligent packaging technologies that have other various functions beside protection of food. Active packaging is defined as an innovative packaging type and its usage increases the shelf life of food significantly. Applications of active packaging have begun to be used for packaging of breads. In this study active packaging applications in breads have been reviewed.

  4. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  5. The Role of Electronic Learning Technology in Networks Systems

    International Nuclear Information System (INIS)

    Abd ELhamid, A.; Ayad, N.M.A.; Fouad, Y.; Abdelkader, T.

    2016-01-01

    Recently, Electronic Learning Technology (ELT) has been widely spread as one of the new technologies in the world through using Information and Communication Technology (ICT). One of the strategies of ELT is Simulation, for instance Military and Medical simulations that are used to avoid risks and reduce Costs. A wireless communication network refers to any network not physically connected by cables, which enables the desired convenience and mobility for the user. Wireless communication networks have been useful in areas such as commerce, education and defense. According to the nature of a particular application, they can be used in home-based and industrial systems or in commercial and military environments. Historically, Mobile Ad-hoc Networks (MANET) have primarily been used for tactical military network related applications to improve battlefield communications/ survivability. MANET is a collection of wireless nodes that can dynamically be set up anywhere and anytime without using any pre-existing network infrastructure. Mobility in wireless networks basically refers to nodes changing its point of attachment to the network. Also, how the end terminals can move, there are many mobility models described the movement of nodes, many researchers use the Random Way point Mobility Model (RWPM). In this paper, a Graphical User Interface (GUI) for RWPM simulation is introduced as a proposal to be used through ELT Project. In the research area of computer and communications networks, simulation is a very useful technique for the behavior of networks

  6. Low-Cost and Low-Temperature Integration Methods for System-in-Package

    NARCIS (Netherlands)

    Palacios Aguilera, N.B.

    2013-01-01

    Packaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different

  7. Japan's technology and manufacturing infrastructure

    Science.gov (United States)

    Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

    1995-02-01

    The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

  8. Preferences of Informal Carers on Technology Packages to Support Meal Production by People Living with Dementia, Elicited from Personalised AT and ICT Product Brochures

    Directory of Open Access Journals (Sweden)

    Maria Laura De Filippis

    2017-01-01

    Full Text Available Assistive technology (AT can help support the continued independence of people living with dementia, supported by informal carers. Opinions and preferences of informal carers towards a range of assistive and digital information and communication technologies (ICT to support food purchase and menu selection, including navigation and online shopping, and safe meal-making by individuals living with dementia were investigated. General attitudes and experiences with assistive technologies were first probed by means of a focus group with carers (n = 6, organised through the Alzheimer’s Society in Nottingham, England. A series of AT/ICT product brochures were then produced, describing packages of technologies to enable meal production. Task-specific questions were asked of carers (n = 10 at local Memory Cafés as to the perceived capabilities of each individual for shopping and meal-making. Carers were asked to make pair-wise choices in order to select a personalised brochure and to complete a questionnaire to elicit the practicality, desirability and affordability of specific products and to probe for preferences amongst key features. Opinions on ease-of-use, aesthetics, expected safety-in-use, independence of use and stigma related to the technology packages were also collected. Results showed that carers are able to make detailed choices and express preferences about assistive and digital technologies for the individuals in their care, and customise their enabler package. Most believed that having an enabler package would improve safety. Greater exposure of carers to newer digital products would be beneficial. The brochure method could be employed on consumer websites and by AT assessors.

  9. Electron cyclotron resonance plasmas and electron cyclotron resonance ion sources: Physics and technology (invited)

    International Nuclear Information System (INIS)

    Girard, A.; Hitz, D.; Melin, G.; Serebrennikov, K.

    2004-01-01

    Electron cyclotron resonance (ECR) ion sources are scientific instruments particularly useful for physics: they are extensively used in atomic, nuclear, and high energy physics, for the production of multicharged beams. Moreover, these sources are also of fundamental interest for plasma physics, because of the very particular properties of the ECR plasma. This article describes the state of the art on the physics of the ECR plasma related to multiply charged ion sources. In Sec. I, we describe the general aspects of ECR ion sources. Physics related to the electrons is presented in Sec. II: we discuss there the problems of heating and confinement. In Sec. III, the problem of ion production and confinement is presented. A numerical code is presented, and some particular and important effects, specific to ECR ion sources, are shown in Sec. IV. Eventually, in Sec. V, technological aspects of ECR are presented and different types of sources are shown

  10. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Siyu Cai

    2016-12-01

    Full Text Available In this work, a novel processing method called powder thixoforming was proposed to prepare composites reinforced with 50 vol % of SiC particles (SiCp that were used for electronic packaging in order to investigate the effects of remelting duration on its microstructure and properties. Optical Microscope (OM, Scanning Electron Microscope (SEM, X-ray Diffraction (XRD and Transmission Electron Microscope (TEM methods were applied for the material characterization and the corresponding physical and mechanical properties were examined in detail. The obtained results indicate that the remelting duration exerted a large effect on the microstructure as well as the SiCp/Al interfacial reaction. The density and hardness of the composite continuously increased with increasing remelting duration. The thermal conductivity (TC and bending strength (BS first increased during the initial 90 min and then decreased. The remelting duration exerted a limited influence on the coefficient of thermal expansion (CTE. The optimal TC, BS, and hardness of these composites were up to 135.79 W/(m·K, 348.53 MPa, and 105.23 HV, respectively, and the CTE was less than 6.5 ppm/K after the composites were remelted at 600 °C for 90 min. The properties of the composites could thus be controlled to conform to the application requirements for electronic packaging materials.

  11. The influence of electron-beam irradiation on some mechanical properties of commercial multilayer flexible packaging materials (PET MET/LDPE)

    International Nuclear Information System (INIS)

    Nogueira, Beatriz R.; Oliveira, Vitor M.; Moura, Esperidiana A.B.; Ortiz, Angel V.

    2009-01-01

    The treatment with electron-beam radiation is a promising approach to the controllable modification of the properties of the polymeric flexible packaging materials, in order to adjust their properties. In recent years electron-beam irradiation have been efficiently applied in the flexible packaging industry to promote crosslinking and scission of the polymeric chains in order to improve material mechanical properties. On the other hand, ionizing irradiation can also affect the polymeric materials itself leading to a production of free radicals. These free radicals can in turn lead to degradation and or cross-linking phenomena. The influence of electron beam irradiation on mechanical properties of commercial multilayer flexible packaging materials based on laminated low-density polyethylene (LDPE) and metallized poly(ethylene terephthalate) (PET) was studied. The PETmet/LDPE structure was irradiated with doses up to 120 kGy, using a 1.5 MeV electron beam accelerator, dose rate 11.22kGy/s, at room temperature in presence of air. The results showed that penetration resistance of the irradiated PETmet/LDPE film increase up to 10 %, except for radiation dose of 30 kGy that resulted in a slight decrease of ca. 3%, while the sealing resistance decreased ca. 8-26% in all doses (p < 0.05). In addition, the samples of PETmet/LDPE film at 45, 60, 75 and 105 kGy presented a gain up to 18 % in their original tensile strength at break, a gain of ca. 38% in their original elongation at break for radiation dose of 45 kGy and ca. 17% for radiation doses of 60, 75 and 120 kGy. (author)

  12. Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

    Science.gov (United States)

    Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

    2011-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

  13. Polymedication Electronic Monitoring System (POEMS) - a new technology for measuring adherence.

    Science.gov (United States)

    Arnet, Isabelle; Walter, Philipp N; Hersberger, Kurt E

    2013-01-01

    Reliable and precise measurement of patient adherence to medications is feasible by incorporating a microcircuitry into pharmaceutical packages of various designs, such that the maneuvers needed to remove a dose of drug are detected, time-stamped, and stored. The principle is called "electronic medication event monitoring" but is currently limited to the monitoring of a single drug therapy. Our aims were introducing a new technology; a clear, self-adhesive polymer film, with printed loops of conductive wires that can be affixed to multidrug punch cards for the electronic adherence monitoring of multiple medication regimens (Polymedication Electronic Monitoring System, POEMS), and illustrating potential benefits for patient care. We present a preliminary report with one patient experience. Our illustrative case was supplied with a pre-filled 7-day multiple medication punch card with unit-of-use doses for specific times of the day (six pills in the morning cavity, two pills in the evening cavity, and one pill in case of insomnia in the bedtime cavity), with the new electronic film affixed on it. The intake times over 1 week were extremely skewed (median intake hours at 2:00 pm for the morning doses and at 6:40 pm for the evening doses). After an intervention aimed at optimizing the timing adherence, the morning and evening intake hours became more balanced, with 42.3% of correct dosing intervals (±3 h) for drugs with twice daily intake (vs. 0% before the intervention). The electronic monitoring of the entire therapy revealed an intake pattern that would have remained undiscovered with any other device and allowed a personalized intervention to correct an inadequate medication intake behavior. POEMS may guide health professionals when they need to optimize a pharmacotherapy because of suspected insufficient adherence. Further, knowing the intake pattern of the entire pharmacotherapy can elucidate unreached clinical outcome, drug-drug interactions, and drug resistance

  14. Development of aromatic VOC control technology by electron beam hybrid

    International Nuclear Information System (INIS)

    Kim, Jo-Chun; Kim, Ki-Joon

    2006-01-01

    As a fundamental study, the decomposition of volatile organic compounds (VOCs) using electron beam (EB) irradiation has been extensively investigated. EB treatments of VOCs such as toluene and styrene are discussed. The degradation characteristics were intensively investigated under various concentrations and irradiation doses to determine and improve VOC removal efficiencies. This work illustrates that the removal efficiencies of aromatic VOCs generally increase as their concentrations decrease and the irradiation doses increase. Based on these basic studies, it was found that by-products produced from EB irradiation of VOCs would cause a secondary pollution problem. Therefore, a novel hybrid technology has been applied to control aromatic VOC emissions by annexing the catalyst technique with conventional treatment study using EB technology. The experiments were carried out using a bench-scale at first, then a pilot-scale system was followed. Toluene was selected as a typical VOC for EB hybrid control to investigate by-products, effects of ceramic and catalyst, and factors affecting overall efficiency of degradation. It was concluded that VOCs could be destroyed more effectively by a novel hybrid system than single EB irradiation. (author)

  15. Electron beam irradiation: novel technology for phytosanitary purposes

    International Nuclear Information System (INIS)

    Bhalla, Shashi; Srinivasan, K.; Dwivedi, J.; Gautam, S.; Sharma, Arun

    2015-01-01

    In the WTO regime, flow of agricultural commodities has increased, posing risk of inadvertent introduction of exotic pests. This can be minimized by undertaking quarantine measures. Quarantine/phytosanitary disinfestation treatments demand a very high level of security as the pest tolerance in quarantine is zero. Methyl bromide, a potent fumigant has been restricted in its use due to ozone depleting effect. Also, the conventional chemicals/fumigants being used world over are being restricted globally because of the various associated problems. Therefore, there is a need for an alternative ecofriendly strategy for controlling the pests. Irradiation, an approved technology by International Plant Protection Convention, appears to be a viable, nonchemical, residue-free strategy. Disinfestation of pulses with low energy electron irradiation potentially will have less deleterious effects on commodity quality than irradiation with other sources. Internationally, new radiation generating sources as Electron beam (EB) are being explored to meet import standards of quality and quarantine. The EB has a machine source and can be simply switched on or off. Irradiation of legume seeds viz., blackgram, greengram and soybean infested with pulse beetles (Callosobruchus maculatus and C. chinensis) at different doses at an energy level of 500 keV using the Accelerator facility at Raja Ramanna Centre for Advanced Technology, Indore revealed the dose-dependent effects on the insect growth parameters. Adult emergence from seeds infested with different stages was negligible and eggs laid by beetles that survived treatment did not develop into adults at higher doses. The lower doses viz., 170, 340 and 510 Gy on the other hand caused sterility effect on the insect but showed stimulatory effect on the physiological seed parameters . viz., seedling vigour and vigour index. Electron beam irradiation has a great potential for use in the disinfestation for phytosanitary purposes. Nevertheless

  16. 76 FR 77738 - Telecommunications Act Accessibility Guidelines; Electronic and Information Technology...

    Science.gov (United States)

    2011-12-14

    ... Telecommunications Act Accessibility Guidelines and its Electronic and Information Technology Accessibility Standards... electronic and information technology covered by Section 508 of the Rehabilitation Act Amendments of 1998. 76.... 2011-07] RIN 3014-AA37 Telecommunications Act Accessibility Guidelines; Electronic and Information...

  17. 12 CFR 352.5 - Accessibility to electronic and information technology.

    Science.gov (United States)

    2010-01-01

    ... and information technology. (a) In accordance with section 508 of the Rehabilitation Act, the FDIC shall ensure, absent an undue burden, that the electronic and information technology the agency develops... or procurement of electronic and information technology that meets the standards published by the...

  18. Decal electronics for printed high performance cmos electronic systems

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-11-23

    High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

  19. New technologies to enhance quality and safety of table eggs: ultra-violet treatment and modified atmosphere packaging

    Directory of Open Access Journals (Sweden)

    Frédérique Pasquali

    2014-12-01

    Full Text Available In the present study the effect of ultra-violet (UV treatment alone and in combination with 100% CO2 modified atmosphere packaging (MAP was evaluated both on the survival of naturally occurring bacteria, as well as on quality parameters of table eggs during 28 days of storage at 21°C. Table eggs were collected from the conveyor belt after the UV module, and placed on carton trays. A representative number of carton trays were packed in a high barrier multilayer pouch filled with 100% CO2. All eggs were stored at 21°C and analysed at 0, 1, 7, 14, 21 and 28 days of storage. Eggs not treated with UV and not packed were also included. On the eggshells total colony count, total coliforms and faecal coliforms counts, as well as the detection of Salmonella spp. were investigated. Moreover, chemical-functional parameters such as weight loss, albumen pH and Haugh Unit (HU were evaluated. The total colony count on UV treated table eggs was approximately 1 log10 CFU/g lower than untreated eggs (2.27 vs 3.29 log10 CFU/g. During storage, CO2 packed eggs maintained the initial values of HU, whereas the albumen pH decreased up to 1.5-2 points in comparison to unpacked eggs. The UV treatment was effective in reducing the total colony count on the surface of table eggs. MAP showed a great potential in maintaining/enhance the technological properties of egg constituents (higher foam stability of the albumen for meringue preparation without significantly impacting on the microbial load of table eggs.

  20. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends.

    Science.gov (United States)

    Murray, Kieran A; Kennedy, James E; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L

    2014-06-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. Copyright © 2014. Published by Elsevier B.V.

  1. 23 CFR 950.5 - Requirement to use electronic toll collection technology.

    Science.gov (United States)

    2010-04-01

    ... shall use an electronic toll collection system as the method for collecting tolls from vehicle operators... 23 Highways 1 2010-04-01 2010-04-01 false Requirement to use electronic toll collection technology... TRANSPORTATION SYSTEMS ELECTRONIC TOLL COLLECTION § 950.5 Requirement to use electronic toll collection...

  2. Electron beam facilities and technologies developed in the Institute of Nuclear Chemistry and Technology

    International Nuclear Information System (INIS)

    Chmielewski, A.G.; Walis, L.; Zimek, Z.

    1992-01-01

    The operation of the first electron accelerator has been started at Institute /former Institute for Nuclear Research/ in 1971. This LAE-13/9 accelerator is a two-section lineac with adjustable energy of electrons: 5 to 13 MeV and the beam power up to 9 kW. The main technologies developed on the basis of LAE-13/9 are: sterilization, manufacturing of thermoshrinkable materials and modification of semiconductors. The accelerator is operated 4000 hours per year and used for small scale production and services in these fields. The other problems investigated in laboratory scale are: food preservation and hygenization, hygenization of municipal sewage sludge, and bio-conversion of pig-farm wastes into animal fodder. The laboratory experiments are basis for pilot construction and other industrial applications. The mentioned technology of thermoshrinkable tube production was implemented in industrial scale at ZWUT Czluchow which factory is equipped in the accelerator ILU-6 /20 kW, 2 MeV/. On the basis of similar unit a technological installation was built at Institute. The plant is furnished with a conveyer and the rewinding machines for tubes and tapes manufacturing. This allows continuous production of these materials. The plant will start operation next year and linear accelerator /10 MeV, 15 kW/ for this purpose is already delivered. The pilot plant for food preservation and hygenization has been built. It is equipped in small pilot accelerator 10 MeV, 1 kW and will be furnished with 10 MeV, 10 kW lineac this year. Beside of this technological lines Institute is furnished in Van de Graff accelerator /2, MeV, 100 μA/ and another laboratory unit LAE-10 /10 MeV, 10-100 ns 2 us/ is under construction. (J.P.N.)

  3. Columbus electronic freight management evaluation : achieving business benefits with EFM technologies.

    Science.gov (United States)

    2009-03-01

    Effective innovation in information technology (IT) may be the most important tool for the private and public sectors to respond to international supply chain capacity constraints and congestion. Electronic Freight Management (EFM) technologies are m...

  4. Characterization of integrated circuit packaging materials

    CERN Document Server

    Moore, Thomas

    1993-01-01

    Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

  5. An AES Study of the Room Temperature Surface Conditioning of Technological Metal Surfaces by Electron Irradiation

    CERN Document Server

    Scheuerlein, C; Taborelli, M; Brown, A; Baker, M A

    2002-01-01

    The modifications to technological copper and niobium surfaces induced by 2.5 keV electron irradiation have been investigated in the context of the conditioning process occurring in particle accelerator ultra high vacuum systems. Changes in the elemental surface composition have been found using Scanning Auger Microscopy (SAM) by monitoring the carbon, oxygen and metal Auger peak intensities as a function of electron irradiation in the dose range 10-6 to 10-2 C mm-2. The surface analysis results are compared with electron dose dependent secondary electron and electron stimulated desorption yield measurements. Initially the electron irradiation causes a surface cleaning through electron stimulated desorption, in particular of hydrogen. During this period both the electron stimulated desorption and secondary electron yield decrease as a function of electron dose. When the electron dose exceeds 10-4 C mm-2 electron stimulated desorption yields are reduced by several orders of magnitude and the electron beam indu...

  6. Sticker electronics

    KAUST Repository

    Hussain, Muhammad Mustafa; Torres Sevilla, Galo Andres; Diaz Cordero, Marlon Steven

    2017-01-01

    Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces

  7. Computation of integral electron storage ring beam characteristics in the application package DeCA. Version 3.3. A physical model

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

    1993-01-01

    In calculations and optimization of electron storage ring lattices, aside from solving the problem of particle motion stability in the ring and calculating ring structure functions and betatron tune, it is of great importance to determine the integral characteristics such as momentum compaction factor, chromaticity of the lattice, emittance, energy spread, bunch size, beam lifetime, etc. Knowing them, one is able to determine all most important properties which the beam would have in the storage ring, as well as to work out requirements for physical equipment of the ring. In this respect it is of importance to have a possibility of calculating rapidly all the parameters required. This paper describes convenient algorithms for calculating integral beam characteristics in electron storage rings, which are employed in the application package DeCA

  8. Radiolysis products and sensory properties of electron-beam-irradiated high-barrier food-packaging films containing a buried layer of recycled low-density polyethylene.

    Science.gov (United States)

    Chytiri, S D; Badeka, A V; Riganakos, K A; Kontominas, M G

    2010-04-01

    The aim was to study the effect of electron-beam irradiation on the production of radiolysis products and sensory changes in experimental high-barrier packaging films composed of polyamide (PA), ethylene-vinyl alcohol (EVOH) and low-density polyethylene (LDPE). Films contained a middle buried layer of recycled LDPE, while films containing 100% virgin LDPE as the middle buried layer were taken as controls. Irradiation doses ranged between zero and 60 kGy. Generally, a large number of radiolysis products were produced during electron-beam irradiation, even at the lower absorbed doses of 5 and 10 kGy (approved doses for food 'cold pasteurization'). The quantity of radiolysis products increased with irradiation dose. There were no significant differences in radiolysis products identified between samples containing a recycled layer of LDPE and those containing virgin LDPE (all absorbed doses), indicating the 'functional barrier' properties of external virgin polymer layers. Sensory properties (mainly taste) of potable water were affected after contact with irradiated as low as 5 kGy packaging films. This effect increased with increasing irradiation dose.

  9. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  10. New Electronic Technology Applied in Flexible Organic Optical System

    Directory of Open Access Journals (Sweden)

    Andre F. S. Guedes

    2014-02-01

    Full Text Available The synthesis and application of new organic materials, nanostructured, for developing technology based on organic devices, have been the main focus of the scientific community. In recent years, the first polymeric electronics products have entered the market (organic semiconductor materials and there are some electrochromic devices among them that have been called smart windows, once they control the passage of light or heat through a closed environment as an ordinary window. The main functional aspect of electrochromic devices, when being used in architectural and automotive industry, is to control the passage of light and temperature with thermal and visual comfort. These devices can be flexible and very thin, not containing heavy metals, and formed by layers of organic material deposited in several architectures. In this study, the electro-deposition of organic materials in the Polyaniline, PANI case, which provide stability in optical and electrical parameters, was utilized with the means of developing prototypes of organic electrochromic devices. These materials were characterized by: ultraviolet-visible spectroscopy absorption (UV-Vis, measurement of thickness (MT and electrical measurements (EM. This study aims to establish the relationship between the thickness of the active layer and the value of the electrical resistivity of the layer deposited through an electro-deposition technique. The experimental results enabled the equating of the electrical resistivity related to the thickness of the deposited layer. The linear fit of these results has expressed the thickness of the conducting layer, α, and the lowest value of the electrical resistivity, β, associated with the gap between the valence band and the conduction band. Thus, the results have demonstrated that, when the layer of organic material is completely conductive, we may obtain the thickness of the organic material deposited on the substrate.

  11. Exploiting Nanotechnology and Radiation Technologies to Develop New Eco-Sustainable Nanomaterials for Food Packaging Suitable for Sterilization by Irradiation. Chapter 11

    Energy Technology Data Exchange (ETDEWEB)

    Silvestre, C.; Pezzuto, M.; Duraccio, D.; Marra, A.; Cimmino, S. [Istituto di Chimica e Tecnologia dei Polimeri, Consiglio Nazionale delle Ricerhe, Via Campi Flegrei 34, 80078, Pozzuoli, Napoli (Italy)

    2014-07-15

    The objective of the study is to develop new food packaging nanomaterials based on biopolymers (PLA) to be used in prepackaged foods intended for radiation. The processing conditions were optimized, and the properties of the systems before irradiation were studied. From these studies, the following conclusions were drawn: 1) The final properties of polymer nanocomposites depend on their structure and morphology, and 2) Improved properties can be achieved only if a good dispersion and distribution are realized in the polymer nanomaterials. The team at Istituto di Chimica e Tecnologia dei Polimeri, Consiglio Nazionale delle Ricerhe (ICTP/CNR) participated in the IAEA CRP on “Application of Radiation Processing Technology in the Development of Advanced Packaging Materials for Food Products”. (author)

  12. DensToolKit: A comprehensive open-source package for analyzing the electron density and its derivative scalar and vector fields

    Science.gov (United States)

    Solano-Altamirano, J. M.; Hernández-Pérez, Julio M.

    2015-11-01

    DensToolKit is a suite of cross-platform, optionally parallelized, programs for analyzing the molecular electron density (ρ) and several fields derived from it. Scalar and vector fields, such as the gradient of the electron density (∇ρ), electron localization function (ELF) and its gradient, localized orbital locator (LOL), region of slow electrons (RoSE), reduced density gradient, localized electrons detector (LED), information entropy, molecular electrostatic potential, kinetic energy densities K and G, among others, can be evaluated on zero, one, two, and three dimensional grids. The suite includes a program for searching critical points and bond paths of the electron density, under the framework of Quantum Theory of Atoms in Molecules. DensToolKit also evaluates the momentum space electron density on spatial grids, and the reduced density matrix of order one along lines joining two arbitrary atoms of a molecule. The source code is distributed under the GNU-GPLv3 license, and we release the code with the intent of establishing an open-source collaborative project. The style of DensToolKit's code follows some of the guidelines of an object-oriented program. This allows us to supply the user with a simple manner for easily implement new scalar or vector fields, provided they are derived from any of the fields already implemented in the code. In this paper, we present some of the most salient features of the programs contained in the suite, some examples of how to run them, and the mathematical definitions of the implemented fields along with hints of how we optimized their evaluation. We benchmarked our suite against both a freely-available program and a commercial package. Speed-ups of ˜2×, and up to 12× were obtained using a non-parallel compilation of DensToolKit for the evaluation of fields. DensToolKit takes similar times for finding critical points, compared to a commercial package. Finally, we present some perspectives for the future development and

  13. INFLUENCE OF CELLULOSE REACTION CAPACITY ON ITS QUALITY AS RAW MATERIAL FOR PACKAGE PRINTING WITH REFERENCE TO INNOVATION TECHNOLOGIES

    Directory of Open Access Journals (Sweden)

    I. I. Karpunin

    2011-01-01

    Full Text Available The paper investigates an influence of cellulose polymerization rate on viscose production.It has been ascertained that while having low reaction capacity with cellulose destruction it is characterized by high viscose formation  that has a specific significance for package printing.

  14. Packaging microservices

    DEFF Research Database (Denmark)

    Montesi, Fabrizio; Thrane, Dan Sebastian

    2017-01-01

    We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

  15. Electron stimulated desorption of gases at technological surfaces of aluminium

    International Nuclear Information System (INIS)

    Ding, M.Q.; Williams, E.M.

    1989-01-01

    The release of gas by electron bombardment at aluminium alloy surfaces in vacuum -9 torr has been investigated for a range of treatments including bakeout and glow discharge cleaning. Particular attention has been given to the role of continuous electron bombardment, with current densities and electron energies of up to 1.5 mA cm -2 and 2.0 keV, respectively, over the 10 cm 2 of surface area under irradiation. The observations of desorption efficiency, defined as the number of desorbed molecules per incident electron, conform to a model involving a dynamic balance between adsorption and desorption, with contributions to adsorption from both surface and sub-surface gas. Continuous electron bombardment promotes a surface with low desorption efficiency, -5 mol/electron, however, the conditioning cycle is accelerated significantly by glow discharge treatment. There is evidence of some short-term memory when the samples are exposed to air. (author)

  16. Validation of the superconducting 3.9 GHz cavity package for the European X-ray Free Electron Laser

    Science.gov (United States)

    Maiano, C. G.; Branlard, J.; Hüning, M.; Jensch, K.; Kostin, D.; Matheisen, A.; Möller, W.-D.; Sulimov, A.; Vogel, E.; Bosotti, A.; Chen, J. F.; Moretti, M.; Paparella, R.; Pierini, P.; Sertore, D.

    2017-04-01

    A full test of the cavity package concept under realistic operating condition was a necessary step before the assembly of the European XFEL (EXFEL) 3.9 GHz superconducting system and its installation in the accelerator. One cavity, equipped with magnetic shielding, power coupler and frequency tuner has been tested in a specially designed single cavity cryostat in one of the test benches of the DESY Accelerator Module Test Facility (AMTF). The cavity was operated at high pulsed power up to an accelerating field of 24 MV /m , above the quench accelerating field of 21 MV /m achieved during the continuous wave (CW) vertical qualification test and with a large margin with respect to the EXFEL maximum operating specification of 15 MV /m for the 3.9 GHz system. All subsystems under test—coupler, tuner, waveguide tuners, low level radio-frequency (LLRF) system—were qualified to their design performances.

  17. An overview of power electronic converter technology for renewable energy systems

    DEFF Research Database (Denmark)

    Chen, Zhe

    2013-01-01

    This chapter presents power electronic technology which is an enabling tool for modern wind and marine energy conversion systems. In this chapter, the main power electronic devices are described. Various power electronic converter topologies are represented, and commonly used modulation schemes...

  18. Food-packaging materials: migration of constituents into food contents. January 1982-December 1988 (Citations from Packaging Science and technology Abstracts data base). Report for January 1982-December 1988

    International Nuclear Information System (INIS)

    1989-01-01

    This bibliography contains citations concerning the migration of food-packaging materials into foods. Plastic, glass, cardboard, metal, and ceramic containers are discussed. Techniques for analyzing packaging contamination are included. (Contains 90 citations fully indexed and including a title list.)

  19. International Conference on Emerging Research in Electronics, Computer Science and Technology

    CERN Document Server

    Sheshadri, Holalu; Padma, M

    2014-01-01

    PES College of Engineering is organizing an International Conference on Emerging Research in Electronics, Computer Science and Technology (ICERECT-12) in Mandya and merging the event with Golden Jubilee of the Institute. The Proceedings of the Conference presents high quality, peer reviewed articles from the field of Electronics, Computer Science and Technology. The book is a compilation of research papers from the cutting-edge technologies and it is targeted towards the scientific community actively involved in research activities.

  20. Technology of electron beam welding for Zr-4 alloy spacer grid

    International Nuclear Information System (INIS)

    Pei Qiusheng; Wu Xueyi; Yang Qishun

    1989-10-01

    The welding technology for Zr-4 alloy spacer grid by using vacuum electron beam was studied. Through a series of welding technological experiments, metallographic examinations of seam structure and detecting tests for welding defect by X-ray defectoscopy, a good welding technology was selected to meet the requirements. The experimental results indicated that the Zr-4 alloy spacer grid welded by vacuum electron beam welding is feasible

  1. Science packages

    Science.gov (United States)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  2. High Power Electronics - Key Technology for Wind Turbines

    DEFF Research Database (Denmark)

    Blaabjerg, Frede; Ma, Ke

    2014-01-01

    reliability challenges for the future wind turbines are explained. It is concluded that the wind turbine behavior/performance can be significantly improved by introducing power electronics, and there will be higher requirements for the power electronics performances in wind power application....

  3. Integration of electronic nose technology with spirometry: validation of a new approach for exhaled breath analysis

    NARCIS (Netherlands)

    de Vries, R.; Brinkman, P.; van der Schee, M. P.; Fens, N.; Dijkers, E.; Bootsma, S. K.; de Jongh, F. H. C.; Sterk, P. J.

    2015-01-01

    New 'omics'-technologies have the potential to better define airway disease in terms of pathophysiological and clinical phenotyping. The integration of electronic nose (eNose) technology with existing diagnostic tests, such as routine spirometry, can bring this technology to 'point-of-care'. We

  4. The Innovations, Technology and Waste Management Approaches to Safely Package and Transport the World's First Radioactive Fusion Research Reactor for Burial

    International Nuclear Information System (INIS)

    Keith Rule; Erik Perry; Jim Chrzanowski; Mike Viola; Ron Strykowsky

    2003-01-01

    Original estimates stated that the amount of radioactive waste that will be generated during the dismantling of the Tokamak Fusion Test Reactor will approach two million kilograms with an associated volume of 2,500 cubic meters. The materials were activated by 14 MeV neutrons and were highly contaminated with tritium, which present unique challenges to maintain integrity during packaging and transportation. In addition, the majority of this material is stainless steel and copper structural metal that were specifically designed and manufactured for this one-of-a-kind fusion research reactor. This provided further complexity in planning and managing the waste. We will discuss the engineering concepts, innovative practices, and technologies that were utilized to size reduce, stabilize, and package the many unique and complex components of this reactor. This waste was packaged and shipped in many different configurations and methods according to the transportation regulations and disposal facility requirements. For this particular project, we were able to utilize two separate disposal facilities for burial. This paper will conclude with a complete summary of the actual results of the waste management costs, volumes, and best practices that were developed from this groundbreaking and successful project

  5. HOW THE ROCKY FLATS ENVIRONMENTAL TECHNOLOGY SITE DEVELOPED A NEW WASTE PACKAGE USING A POLYUREA COATING THAT IS SAFELY AND ECONOMICALLY ELIMINATING SIZE REDUCTION OF LARGE ITEMS

    International Nuclear Information System (INIS)

    Dorr, Kent A.; Hogue, Richard S.; Kimokeo, Margaret K.

    2003-01-01

    One of the major challenges involved in closing the Rocky Flats Environmental Technology Site (RFETS) is the disposal of extremely large pieces of contaminated production equipment and building debris. Past practice has been to size reduce the equipment into pieces small enough to fit into approved, standard waste containers. Size reducing this equipment is extremely expensive, and exposes workers to high-risk tasks, including significant industrial, chemical, and radiological hazards. RFETS has developed a waste package using a Polyurea coating for shipping large contaminated objects. The cost and schedule savings have been significant

  6. Adhesives technology for electronic applications materials, processing, reliability

    CERN Document Server

    Licari, James J

    2011-01-01

    Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book par

  7. Handbook of polymer coatings for electronics chemistry, technology and applications

    CERN Document Server

    Licari, James J

    1990-01-01

    This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered

  8. Technology transfer present and futures in the electronic arts

    Directory of Open Access Journals (Sweden)

    Brian Degger

    2008-01-01

    Full Text Available We are entering an era where creating the fantastical is possible in the arts. In the areas of mixed reality and biological arts, responsive works are created based on advances in basic science and technology. This is enabling scientists and artists to pose new questions. As the time between discovery and application is so short, artists need imaginative ways of accessing new technology in order to critique and use it.These are the new paints that the majority of artists cannot afford or access, technology to enable cloning of DNA, to print channels on a chip, to access proprietary 3G networks. Currently, partnerships or residencies are used to facilitate artist’s access to these technologies. What would they do if technology was available that enabled them to make any art work they so desire? Are the limitations in current technology an advantage rather than a disadvantage in some of their works? Does interaction with technologists make their work more robust? Are there disadvantages? How do they get access to the technology they require? Open source or proprietary? Or have they encountered the situation where their vision is greater than technology allows. When their work breaks because of this fact, is their art broken? Blast Theory (Brighton,UK, FoAM(Brussels, Belgium and Amsterdam, Netherlands, SymbioticA (Perth, Australia are organisations pushing technological boundaries in the service of art. This paper addresses some questions of technology transfer in relation to recent artworks, particularly I like Frank in Adelaide (Blast Theory, transient reality generators (trg (FoAM and Multi electrode array artist (MeART (SymbioticA.

  9. Innovating the Standard Procurement System Through Electronic Commerce Technologies

    National Research Council Canada - National Science Library

    Mangum, Stephen

    1999-01-01

    ... business processes with commercial best practices and advances in electronic commerce. When fully implemented, it will serve more than 1,100 sites worldwide and be employed by over 44,000 professionals...

  10. Power System Electronics (PSE) Development for SmallSat Technology

    Data.gov (United States)

    National Aeronautics and Space Administration — We develop a modular Power System Electronics (PSE) that is reliable, efficient, and flexible to meet the Goddard Modular Smallsat Architecture (GMSA) challenge....

  11. Electron-ionic technology of storage of foodstuffs

    International Nuclear Information System (INIS)

    Tsoj, A.P.

    1996-01-01

    Work is trained on reduction of food suffer losses under cold store due to its drying and spoiling. Experimental cold store of fruits in 'microclimates' in electron-ionic medium created with help of pilot unit is carried out

  12. The development of technology for recycling of electronic scrap

    Energy Technology Data Exchange (ETDEWEB)

    Yu, Hyo-Shin; Kim, Won-Baek; Sohn, Yong-Uhn [Korea Institute of Geology Mining and Materials, Taejon (KR)] (and others)

    1999-12-01

    Electronic devices, especially computer becomes an essential tools for home and industries entering the information era. The number of computers exceed over 100 million, hence, the amount of end of life(EOL) computer and electronic scrap is increasing. These wastes and scraps include products rejected from manufacturing processes and obstacle computers. Owing to a short life cycle of electronic products and rapid growth of electronic industries, the number of domestic EOL computers goes beyond a million and its disposal causes an environmental problems. Therefore, this recycling is considered to play an important role from the viewpoint of environmental preservation as well as reusable resources. The process development for the recovery of valuable materials and minimization of waste from electronic scrap has been carried out. In the first year of three year project, physical separation such as shredding, crushing, and magnetic separation is established to reclaim valuable materials effectively. Then, hydro- and pyrometallurgical processes are employed to recover valuable metals from electronic scrap. First, metallic and nonmetallic portion are separated from PCBs by a newly designed shredder to prevent hazardous organic materials from further chemical treatment. The optimum conditions for each unit process were found in terms of separation ratio, energy consumption, recovery rate, etc. (author). 92 refs., 24 tabs., 39 figs.

  13. New Possibilities of Power Electronic Structures Using SiC Technology

    Directory of Open Access Journals (Sweden)

    Robert Sul

    2006-01-01

    Full Text Available This paper is dedicated to the recent unprecedented boom of SiC electronic technology. The contribution deals with brief survey of those properties. In particular, the differences (both good and bad between SiC electronics technology and well-known silicon VLSI technology are highlighted. Projected performance benefits of SiC electronics are given for several large-scale applications on the end of the contribution. The basic properties of SiC material have been discussed already on the beginning of 80’s, also at our university.

  14. Proceedings of 8. national conference on nuclear electronic and nuclear detection technology: Pt.1

    International Nuclear Information System (INIS)

    1996-01-01

    The 8th National Conference on Nuclear Electronics and Nuclear Detection Technology was held during 2-7, 12, 1996 in Zhuhai, Guangdong, China. 184 pieces of papers were collected in the conference proceedings. The contents of the conference proceedings are: nuclear electronics, nuclear detectors, nuclear instruments and its application, nuclear medical electronics, computer applications in nuclear sciences and technology, measurement of nuclear monitoring and nuclear explosion, radiation hardened electronics, liquid scintillation counting techniques and miscellaneous. Reported hereafter is the first part of the proceedings

  15. Basic radiation effects in nuclear power electronics technology

    International Nuclear Information System (INIS)

    Gover, J.E.; Srour, J.R.

    1985-05-01

    An overview is presented of the effects of radiation in microelectronics technology. The approach taken throughout these notes is to review microscopic phenomena associated with radiation effects and to show how these lead to macroscopic effects in semiconductor devices and integrated circuits. Bipolar integrated circuits technology is reviewed in Appendix A. Appendix B gives present and future applications of radiation-tolerant microelectronics in nuclear power applications as well as the radiation tolerance requirements of these applications

  16. [Application of electronic fence technology based on GIS in Oncomelania hupensis snail monitoring].

    Science.gov (United States)

    Zhi-Hua, Chen; Yi-Sheng, Zhu; Zhi-Qiang, Xue; Xue-Bing, Li; Yi-Min, Ding; Li-Jun, Bi; Kai-Min, Gao; You, Zhang

    2017-07-27

    To study the application of Geographic Information System (GIS) electronic fence technique in Oncomelania hupensis snail monitoring. The electronic fence was set around the history and existing snail environments in the electronic map, the information about snail monitoring and controlling was linked to the electronic fence, and the snail monitoring information system was established on these bases. The monitoring information was input through the computer and smart phone. The electronic fence around the history and existing snail environments was set in the electronic map (Baidu map), and the snail monitoring information system and smart phone APP were established. The monitoring information was input and upload real-time, and the snail monitoring information was demonstrated in real time on Baidu map. By using the electronic fence technology based on GIS, the unique "environment electronic archives" for each snail monitoring environment can be established in the electronic map, and real-time, dynamic monitoring and visual management can be realized.

  17. Use of gamma-irradiation technology in the manufacture of biopolymer-based packaging films for shelf-stable foods

    International Nuclear Information System (INIS)

    Parra, Duclerc F.; Rodrigues, Juliana A.F.R.; Lugao, Ademar B.

    2005-01-01

    Gamma irradiation is an alternative method for the manufacture of sterilized packaging with increased storage stability and microbiological safety. Biopolymer-based packaging films are a potential solution to many environmental problems that have emerged from the production and accumulation of significant amounts of synthetic polymeric waste. This work was undertaken to verify the effectiveness of low-dose gamma-irradiation in obtaining biopolymer-based packaging films for shelf-stable foods. PHB polyester poly(3-hydroxybutyrate) is an interesting biodegradable polymer that has been intensely investigated as cast and sheet films, with applications in the food industry and medicine. The films obtained are, however, typically brittle, and many scientists have attempted to reduce this brittleness by blending PHB with other polymers. In the present work, PHB was blended with PEG (polyethyleneglycol) to obtain films by the casting method that were then irradiated at a dose rate of 5.72 kGy/h with a 60 Co source. Samples were melted at 200 deg. C and quenched to 0 deg. C in order to evaluate film crystallinity levels by differential scanning calorimetry (DSC). DSC analyses were performed with the samples (10 mg) under N 2 atmosphere, heating from -50 to 200 deg. C (10 deg. C min -1 ), cooling from 200 to -50 deg. C (10 deg. C min -1 ); and heating from -50 to 200 deg. C (10 deg. C min -1 ). The thermal and mechanical resistances of the films after irradiation at low doses (5, 10, 20 kGy) are discussed. Water vapour transmission decreased with increasing irradiation dose, indicating that the films' performance as water vapour barrier had improved. Critical loss of the mechanical properties was observed at 40 kGy

  18. Use of gamma-irradiation technology in the manufacture of biopolymer-based packaging films for shelf-stable foods

    Science.gov (United States)

    Parra, Duclerc F.; Rodrigues, Juliana A. F. R.; Lugão, Ademar B.

    2005-07-01

    Gamma irradiation is an alternative method for the manufacture of sterilized packaging with increased storage stability and microbiological safety. Biopolymer-based packaging films are a potential solution to many environmental problems that have emerged from the production and accumulation of significant amounts of synthetic polymeric waste. This work was undertaken to verify the effectiveness of low-dose gamma-irradiation in obtaining biopolymer-based packaging films for shelf-stable foods. PHB polyester poly(3-hydroxybutyrate) is an interesting biodegradable polymer that has been intensely investigated as cast and sheet films, with applications in the food industry and medicine. The films obtained are, however, typically brittle, and many scientists have attempted to reduce this brittleness by blending PHB with other polymers. In the present work, PHB was blended with PEG (polyethyleneglycol) to obtain films by the casting method that were then irradiated at a dose rate of 5.72 kGy/h with a 60Co source. Samples were melted at 200 °C and quenched to 0 °C in order to evaluate film crystallinity levels by differential scanning calorimetry (DSC). DSC analyses were performed with the samples (10 mg) under N2 atmosphere, heating from -50 to 200 °C (10 °C min-1), cooling from 200 to -50 °C (10 °C min-1); and heating from -50 to 200 °C (10 °C min-1). The thermal and mechanical resistances of the films after irradiation at low doses (5, 10, 20 kGy) are discussed. Water vapour transmission decreased with increasing irradiation dose, indicating that the films' performance as water vapour barrier had improved. Critical loss of the mechanical properties was observed at 40 kGy.

  19. Electronic commerce: wiring the coal industry for new data technology

    Energy Technology Data Exchange (ETDEWEB)

    Carter, R.A.

    1998-07-01

    Industry pundits predict that coal by wire may some day replace much of the industry`s long-distance shipping requirements and their attendant costs, but data by wire, also known as electronic commerce (EC) can today offer coal producers and customers the means to gather and send large volumes of data cheaply and quickly. EC`s major components - electronic data interchange (EDI), bar-coding, smart codes, radio frequency `D`, and the internet - can reduce costs in equipment-intensive industries such as mining. The US National Mining Association sponsored a forum to discuss these alternatives at its 1998 Electronic Commerce Summit held in Tuscon, Arizona, 18-20 May. A report is given of discussions at the forum and contacts are given for sources of EDI information.

  20. Multimedia package for LRFD concrete bridge design.

    Science.gov (United States)

    2009-02-01

    This Project developed a Load and Resistance Factor Design (LRFD) multimedia package to provide a practical introduction and an in-depth understanding of the technological advances in the design of concrete bridges. This package can be used to train ...

  1. Application of GA package in functional packaging

    Science.gov (United States)

    Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

    2018-05-01

    The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

  2. Electronic aroma detection technology for forensic and law enforcement applications

    Energy Technology Data Exchange (ETDEWEB)

    Barshick, S.-A.; Griest, W.H.; Vass, A.A.

    1996-12-31

    A major problem hindering criminal investigations is the lack of appropriate tools for proper crime scene investigations. Often locating important pieces of evidence means relying on the ability of trained detection canines. Development of analytical technology to uncover and analyze evidence, potentially at the scene, could serve to expedite criminal investigations, searches, and court proceedings. To address this problem, a new technology based on gas sensor arrays was investigated for its applicability to forensic and law enforcement problems. The technology employs an array of sensors that respond to volatile chemical components yielding a characteristic `fingerprint` pattern representative of the vapor- phase composition of a sample. Sample aromas can be analyzed and identified using artificial neural networks that are trained on known aroma patterns. Several candidate applications based on known technological needs of the forensic and law enforcement communities have been investigated. These applications have included the detection of aromas emanating from cadavers to aid in determining time since death, drug detection for deterring the manufacture, sale, and use of drugs of abuse, and the analysis of fire debris for accelerant identification. The results to date for these applications have been extremely promising and demonstrate the potential applicability of this technology for forensic use.

  3. Technology of niobium and molybdenum refining by electron beam

    International Nuclear Information System (INIS)

    Conti, R.A.; Pinatti, D.G.; Sandim, H.R.Z.

    1988-01-01

    The uses of metals and alloys in superconductors (Nb46%Ti), aerospatial industry (Ti6Al4V), electroeletronic industry (Nb, Mo, W) and in surgical implants (Ti, Nb) are increasing nowadays. A refining process of niobium and molybdenum by electron beam technique, since the oxides reduction till the obtention of a high purity ingot is presented. (C.G.C.) [pt

  4. Technology of irradiation of liquids by electron beams

    International Nuclear Information System (INIS)

    Tofaute, K.

    1979-01-01

    The methods of pretreatment, the technical details of the irradiating equipment, the applied radiation doses and the general requirements of the effectively working system are described. The extent of reinfection is compared in cases of heat-treated and electron-irradiated mud. The latter method gave significantly better results. (L.E.)

  5. Research on electron beam welding technology of steel HR-4

    International Nuclear Information System (INIS)

    Guo Peng; Guan Kai

    2001-01-01

    The electron beam weldability of HR- 4 steels (J75 and J90) is studied and the welding parameters needed for design and usage are presented. The assessment on the effect of mechanical properties by different processing order of welding and heat-treatment is made

  6. Simulation Tools for Power Electronics Courses Based on Java Technologies

    Science.gov (United States)

    Canesin, Carlos A.; Goncalves, Flavio A. S.; Sampaio, Leonardo P.

    2010-01-01

    This paper presents interactive power electronics educational tools. These interactive tools make use of the benefits of Java language to provide a dynamic and interactive approach to simulating steady-state ideal rectifiers (uncontrolled and controlled; single-phase and three-phase). Additionally, this paper discusses the development and use of…

  7. Size Control Technology of Silver Nanoparticles Using Electron Beam Irradiation

    International Nuclear Information System (INIS)

    Kang, Hyun Suk; Kim, Byungnam; Kim, Hye Won; Koo, Yong Hwan; Lee, Byung Cheol; Park, Ji Hyun; Bae, Hyung Bin; Park, Changmoon

    2013-01-01

    The manufacturing of silver nanoparticles using an electron beam is easy, fast, and highly productive, and it is possible at room temperature with no chemical residuals. Its various advantages therefore make this an important method for manufacturing nanoparticles such as silver, copper, and platinum. In particular, despite the use of electron beam irradiation, the results show that this method makes it possible to produce silver nanoparticles at low cost since low beam energy and low doses are used. This means that middle and high-energy electron beam accelerators are very expensive, but a low-energy electron beam accelerator has a relatively low cost of around 4-5 times, and mass production for a flow reaction without the need for extra radiation shielding is possible. Silver nanoparticles are of great interest to many researchers owing to their ability to be used in many applications such as catalysis, nanoelectronics, optical filters, electromagnetic interference shielding, surface Raman scattering, medical supplies, fabrics, cosmetics, hygiene and kitchen supplies, and electric home appliances

  8. Agent Technologies in the Electronic Classroom: Some Pedagogical Issues.

    Science.gov (United States)

    Dowling, Carolyn

    The use of intelligent software agents within computer mediated learning environments has become an important focus of research and development in both AI and educational contexts. Some of the roles envisaged and implemented for these electronic entities involve direct interactions with students, participating in the "social" dimension of the…

  9. Using XML Technologies to Organize Electronic Reference Resources

    OpenAIRE

    Huser, Vojtech; Del Fiol, Guilherme; Rocha, Roberto A.

    2005-01-01

    Provision of access to reference electronic resources to clinicians is becoming increasingly important. We have created a framework for librarians to manage access to these resources at an enterprise level, rather than at the individual hospital libraries. We describe initial project requirements, implementation details, and some preliminary results.

  10. Size Control Technology of Silver Nanoparticles Using Electron Beam Irradiation

    Energy Technology Data Exchange (ETDEWEB)

    Kang, Hyun Suk; Kim, Byungnam; Kim, Hye Won; Koo, Yong Hwan; Lee, Byung Cheol [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Park, Ji Hyun [Univ. of Science and Technology, Daejeon (Korea, Republic of); Bae, Hyung Bin [Korea Advanced Institute of Science and Technology, Daejeon (Korea, Republic of); Park, Changmoon [Chungnam National Univ., Daejeon (Korea, Republic of)

    2013-12-15

    The manufacturing of silver nanoparticles using an electron beam is easy, fast, and highly productive, and it is possible at room temperature with no chemical residuals. Its various advantages therefore make this an important method for manufacturing nanoparticles such as silver, copper, and platinum. In particular, despite the use of electron beam irradiation, the results show that this method makes it possible to produce silver nanoparticles at low cost since low beam energy and low doses are used. This means that middle and high-energy electron beam accelerators are very expensive, but a low-energy electron beam accelerator has a relatively low cost of around 4-5 times, and mass production for a flow reaction without the need for extra radiation shielding is possible. Silver nanoparticles are of great interest to many researchers owing to their ability to be used in many applications such as catalysis, nanoelectronics, optical filters, electromagnetic interference shielding, surface Raman scattering, medical supplies, fabrics, cosmetics, hygiene and kitchen supplies, and electric home appliances.

  11. CMOS technology: a critical enabler for free-form electronics-based killer applications

    KAUST Repository

    Hussain, Muhammad Mustafa; Hussain, Aftab M.; Hanna, Amir

    2016-01-01

    Complementary metal oxide semiconductor (CMOS) technology offers batch manufacturability by ultra-large-scaleintegration (ULSI) of high performance electronics with a performance/cost advantage and profound reliability. However, as of today

  12. Microstructure and property measurements on in situ TiB2/70Si–Al composite for electronic packaging applications

    International Nuclear Information System (INIS)

    Zhang, L.; Gan, G.S.; Yang, B.

    2012-01-01

    Highlights: ► 2.0 wt.%TiB 2 /70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB 2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties. -- Abstract: A novel reactive technique has been employed in fabrication of 2.0 wt.%TiB 2 /70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB 2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0 wt.%TiB 2 /70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.

  13. Development of Xi'an-CI package – applying the hole–particle symmetry in multi-reference electronic correlation calculations

    Science.gov (United States)

    Suo, Bingbing; Lei, Yibo; Han, Huixian; Wang, Yubin

    2018-04-01

    This mini-review introduces our works on the Xi'an-CI (configuration interaction) package using graphical unitary group approach (GUGA). Taking advantage of the hole-particle symmetry in GUGA, the Galfand states used to span the CI space are classified into CI subspaces according to the number of holes and particles, and the coupling coefficients used to calculate Hamiltonian matrix elements could be factorised into the segment factors in the hole, active and external spaces. An efficient multi-reference CI with single and double excitations (MRCISD) algorithm is thus developed that reduces the storage requirement and increases the number of correlated electrons significantly. The hole-particle symmetry also gives rise to a doubly contracted MRCISD approach. Moreover, the internally contracted Gelfand states are defined within the CI subspace arising from the hole-particle symmetry, which makes the implementation of internally contracted MRCISD in the framework of GUGA possible. In addition to MRCISD, the development of multi-reference second-order perturbation theory (MRPT2) also benefits from the hole-particle symmetry. A configuration-based MRPT2 algorithm is proposed and extended to the multi-state n-electron valence-state second-order perturbation theory.

  14. Electronic Mail, Privacy, and the Electronic Communications Privacy Act of 1986: Technology in Search of Law.

    Science.gov (United States)

    Samoriski, Jan H.; And Others

    1996-01-01

    Attempts to clarify the status of e-mail privacy under the Electronic Communications Privacy Act of 1986 (ECPA). Examines current law and the paucity of definitive case law. A review of cases and literature suggests there is a gap in the existing ECPA that allows for potentially abusive electronic monitoring and interception of e-mail,…

  15. Technology for the compatible integration of silicon detectors with readout electronics

    International Nuclear Information System (INIS)

    Zimmer, G.

    1984-01-01

    Compatible integration of detectors and readout electronics on the same silicon substrate is of growing interest. As the methods of microelectronics technology have already been adapted for detector fabrication, a common technology basis for detectors and readout electronics is available. CMOS technology exhibits most attractive features for the compatible realization of readout electronics when advanced LSI processing steps are combined with detector requirements. The essential requirements for compatible integration are the availability of high resistivity (100)-oriented single crystalline silicon substrate, the formation of suitably doped areas for MOS circuits and the isolation of the low voltage circuit from the detector operated at much higher supply voltage. Junction isolation as a first approach based on present production technology and dielectric isolation based on an advanced SOI-LSI technology are discussed as the most promising solutions for present and future applications, respectively. (orig.)

  16. Users Guide on Scaled CMOS Reliability: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

    Science.gov (United States)

    White, Mark; Cooper, Mark; Johnston, Allan

    2011-01-01

    Reliability of advanced CMOS technology is a complex problem that is usually addressed from the standpoint of specific failure mechanisms rather than overall reliability of a finished microcircuit. A detailed treatment of CMOS reliability in scaled devices can be found in Ref. 1; it should be consulted for a more thorough discussion. The present document provides a more concise treatment of the scaled CMOS reliability problem, emphasizing differences in the recommended approach for these advanced devices compared to that of less aggressively scaled devices. It includes specific recommendations that can be used by flight projects that use advanced CMOS. The primary emphasis is on conventional memories, microprocessors, and related devices.

  17. Teaching ethics and technology with Agora, an electronic tool

    NARCIS (Netherlands)

    Burg, van der S.; Poel, van de I.R.

    2005-01-01

    Courses on ethics and technology have become compulsory for many students at the three Dutch technical universities during the past few years. During this time, teachers have faced a number of didactic problems, which are partly due to a growing number of students. In order to deal with these

  18. High power electron and ion beam research and technology

    Energy Technology Data Exchange (ETDEWEB)

    Nation, J.A.; Sudan, R.N. (eds.)

    1977-01-01

    Topics covered in volume II include: collective accelerators; microwaves and unneutralized E-beams; technology of high-current E-beam accelerators and laser applications of charged-particle beams. Abstracts of twenty-nine papers from the conference were prepared for the data base in addition to six which appeared previously. (GHT)

  19. Electronic Commerce: Canadian Community Colleges and Institutes of Technology.

    Science.gov (United States)

    Association of Canadian Community Colleges.

    This paper reports on the Canadian college system's collaboration with industry and community services in the development and delivery of non-credit e-commerce courses offered through continuing education departments at community colleges and institutes of technology. The paper argues that, in today's changing economy, the accelerated need for…

  20. Project-Based Learning in Electronic Technology: A Case Study

    Science.gov (United States)

    Li, Li

    2015-01-01

    A case study of project-based learning (PBL) implemented in Tianjin University of Technology and Education is presented. This multidiscipline project is innovated to meet the novel requirements of industry while keeping its traditional effectiveness in driving students to apply knowledge to practice and problem-solving. The implementation of PBL…

  1. Development of superconductor electronics technology for high-end computing

    Energy Technology Data Exchange (ETDEWEB)

    Silver, A [Jet Propulsion Laboratory, 4800 Oak Grove Drive, Pasadena, CA 91109-8099 (United States); Kleinsasser, A [Jet Propulsion Laboratory, 4800 Oak Grove Drive, Pasadena, CA 91109-8099 (United States); Kerber, G [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States); Herr, Q [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States); Dorojevets, M [Department of Electrical and Computer Engineering, SUNY-Stony Brook, NY 11794-2350 (United States); Bunyk, P [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States); Abelson, L [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States)

    2003-12-01

    This paper describes our programme to develop and demonstrate ultra-high performance single flux quantum (SFQ) VLSI technology that will enable superconducting digital processors for petaFLOPS-scale computing. In the hybrid technology, multi-threaded architecture, the computational engine to power a petaFLOPS machine at affordable power will consist of 4096 SFQ multi-chip processors, with 50 to 100 GHz clock frequency and associated cryogenic RAM. We present the superconducting technology requirements, progress to date and our plan to meet these requirements. We improved SFQ Nb VLSI by two generations, to a 8 kA cm{sup -2}, 1.25 {mu}m junction process, incorporated new CAD tools into our methodology, demonstrated methods for recycling the bias current and data communication at speeds up to 60 Gb s{sup -1}, both on and between chips through passive transmission lines. FLUX-1 is the most ambitious project implemented in SFQ technology to date, a prototype general-purpose 8 bit microprocessor chip. We are testing the FLUX-1 chip (5K gates, 20 GHz clock) and designing a 32 bit floating-point SFQ multiplier with vector-register memory. We report correct operation of the complete stripline-connected gate library with large bias margins, as well as several larger functional units used in FLUX-1. The next stage will be an SFQ multi-processor machine. Important challenges include further reducing chip supply current and on-chip power dissipation, developing at least 64 kbit, sub-nanosecond cryogenic RAM chips, developing thermally and electrically efficient high data rate cryogenic-to-ambient input/output technology and improving Nb VLSI to increase gate density.

  2. Development of superconductor electronics technology for high-end computing

    International Nuclear Information System (INIS)

    Silver, A; Kleinsasser, A; Kerber, G; Herr, Q; Dorojevets, M; Bunyk, P; Abelson, L

    2003-01-01

    This paper describes our programme to develop and demonstrate ultra-high performance single flux quantum (SFQ) VLSI technology that will enable superconducting digital processors for petaFLOPS-scale computing. In the hybrid technology, multi-threaded architecture, the computational engine to power a petaFLOPS machine at affordable power will consist of 4096 SFQ multi-chip processors, with 50 to 100 GHz clock frequency and associated cryogenic RAM. We present the superconducting technology requirements, progress to date and our plan to meet these requirements. We improved SFQ Nb VLSI by two generations, to a 8 kA cm -2 , 1.25 μm junction process, incorporated new CAD tools into our methodology, demonstrated methods for recycling the bias current and data communication at speeds up to 60 Gb s -1 , both on and between chips through passive transmission lines. FLUX-1 is the most ambitious project implemented in SFQ technology to date, a prototype general-purpose 8 bit microprocessor chip. We are testing the FLUX-1 chip (5K gates, 20 GHz clock) and designing a 32 bit floating-point SFQ multiplier with vector-register memory. We report correct operation of the complete stripline-connected gate library with large bias margins, as well as several larger functional units used in FLUX-1. The next stage will be an SFQ multi-processor machine. Important challenges include further reducing chip supply current and on-chip power dissipation, developing at least 64 kbit, sub-nanosecond cryogenic RAM chips, developing thermally and electrically efficient high data rate cryogenic-to-ambient input/output technology and improving Nb VLSI to increase gate density

  3. Development of electron beam flue gas treatment technology

    International Nuclear Information System (INIS)

    Tokunaga, Okihiro; Namba, Hideki; Tanaka, Tadashi; Ogura, Yoshimi; Doi, Yoshitake; Aoki, Shinji; Izutsu, Masahiro.

    1995-01-01

    Smoke treatment system making use of electron beam irradiation made it possible to simultaneously eliminate SOx and NOn from exhaust gas. The fundamental study of the system was started in the seventies and at present, its application in practical use is under way. A pilot plant for the smoke treatment system was constructed in cooperation of Chubu Electric Power Company, Inc., Japan Atomic Energy Research Institute and Ebara Corporation and several tests with the actual exhaust gas were conducted during the period, Oct. 1992-Dec. 1993 and the treatment efficiency and the control capacity of this system was confirmed to be so high as the conventional systems and many engineering data were obtained. A high treatment efficiency (>94% for desulfurization and >80% for denitrification) was obtainable by choosing the optimum irradiation amount of electron beam and the optimum temperature of gas to treat. And this system was found superior from a financial aspect to the conventional smoke treatment system. (M.N.)

  4. Linking emerging hazardous waste technologies with the electronic information era

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, B.E.; Suk, W.A. [National Institute of Environmental Health Sciences, Research Triangle Park, NC (United States); Blackard, B. [Technology Planning and Management Corp., Durham, NC (United States)

    1996-12-31

    In looking to the future and the development of new approaches or strategies for managing hazardous waste, it is important to understand and appreciate the factors that have contributed to current successful approaches. In the United States, several events in the last two decades have had a significant impact in advancing remediation of hazardous waste, including environmental legislation, legislative reforms on licensing federally funded research, and electronic transfer of information. Similar activities also have occurred on a global level. While each of these areas is significant, the electronic exchange of information has no national boundaries and has become an active part of major hazardous waste research and management programs. It is important to realize that any group or society that is developing a comprehensive program in hazardous waste management should be able to take advantage of this advanced approach in the dissemination of information. 6 refs., 1 tab.

  5. A decision technology system for health care electronic commerce.

    Science.gov (United States)

    Forgionne, G A; Gangopadhyay, A; Klein, J A; Eckhardt, R

    1999-08-01

    Mounting costs have escalated the pressure on health care providers and payers to improve decision making and control expenses. Transactions to form the needed decision data will routinely flow, often electronically, between the affected parties. Conventional health care information systems facilitate flow, process transactions, and generate useful decision information. Typically, such support is offered through a series of stand-alone systems that lose much useful decision knowledge and wisdom during health care electronic commerce (e-commerce). Integrating the stand-alone functions can enhance the quality and efficiency of the segmented support, create synergistic effects, and augment decision-making performance and value for both providers and payers. This article presents an information system that can provide complete and integrated support for e-commerce-based health care decision making. The article describes health care e-commerce, presents the system, examines the system's potential use and benefits, and draws implications for health care management and practice.

  6. Electronic Health Record developed by the Internet technology

    OpenAIRE

    吉原, 博幸; Yoshihara, Hiroyuki

    1998-01-01

    Installation of the order entry system had been done in the college hospital. However, Installation of the order entry system has just begun in middle sized hospitals. On the other hand, at the middle sized hospitals which does not equipped with the order entry system, the administrator is considering to install the electronic health record system rather than to install the order entry system, In case of small hospitals, there is no merit of installing the order entry system. So, many young d...

  7. Advanced methods for teaching electronic-nose technologies to diagnosticians and clinical laboratory technicians

    Science.gov (United States)

    Alphus D. Wilson

    2012-01-01

    Electronic-detection technologies and instruments increasingly are being utilized in the biomedical field to perform a wide variety of clinical operations and laboratory analyses to facilitate the delivery of health care to patients. The introduction of improved electronic instruments for diagnosing diseases and for administering treatments has required new training of...

  8. Organic electronics: materials, technology and circuit design developments enabling new applications

    NARCIS (Netherlands)

    Leeuw, de D.M.; Cantatore, E.

    2009-01-01

    Organic electronics is growing to become an important new field in the global electronics market. RFID labels, flexible displays, solar cells, OLED-based lighting and displays are only some of the innovative products enabled by technologies based on organic semiconductors. Starting from a short

  9. Future applications of electronic-nose technologies in healthcare and biomedicine

    Science.gov (United States)

    Alphus D. Wilson

    2011-01-01

    The development and utilization of many new electronic-nose (e-nose) applications in the healthcare and biomedical fields have continued to rapidly accelerate over the past 20 years. Innovative e-nose technologies are providing unique solutions to a diversity of complex problems in biomedicine that are now coming to fruition. A wide range of electronic-nose instrument...

  10. DEMONSTRATION BULLETIN: HIGH VOLTAGE ELECTRON BEAM TECHNOLOGY - HIGH VOLTAGE ENVIRONMENTAL APPLICATIONS, INC.

    Science.gov (United States)

    The high energy electron beam irradiation technology is a low temperature method for destroying complex mixtures of hazardous organic chemicals in solutions containing solids. The system consists of a computer-automated, portable electron beam accelerator and a delivery system. T...

  11. Electronics

    Science.gov (United States)

    2001-01-01

    International Acer Incorporated, Hsin Chu, Taiwan Aerospace Industrial Development Corporation, Taichung, Taiwan American Institute of Taiwan, Taipei, Taiwan...Singapore and Malaysia .5 - 4 - The largest market for semiconductor products is the high technology consumer electronics industry that consumes up...Singapore, and Malaysia . A new semiconductor facility costs around $3 billion to build and takes about two years to become operational

  12. Impregnation of cinnamaldehyde into cassava starch biocomposite films using supercritical fluid technology for the development of food active packaging.

    Science.gov (United States)

    de Souza, Ana Cristina; Dias, Ana M A; Sousa, Hermínio C; Tadini, Carmen C

    2014-02-15

    In this work, supercritical solvent impregnation (SSI) has been tested for the incorporation of natural compounds into biocomposite materials for food packaging. Cinnamaldehyde, with proved antimicrobial activity against fungi commonly found in bread products, was successfully impregnated on biocomposite cassava starch based materials using supercritical carbon dioxide as solvent. Different process experimental conditions were tested (pressure, impregnation time and depressurization rate) at a fixed temperature (35 °C) in order to study their influence on the amount of impregnated cinnamaldehyde as well as on the morphology of the films. Results showed that all conditions permitted to impregnate antimicrobial active amounts superior to those previously obtained using conventional incorporation methods. Moreover, a significant decrease of the equilibrium water vapor sorption capacity and water vapor permeability of the films was observed after SSI processing which is a clear advantage of the process, considering the envisaged applications. Copyright © 2013 Elsevier Ltd. All rights reserved.

  13. New Approach on Sunflower Seeds Processing: Kernel with Several Technological Applications, Husks Package, Different Fat Content Tahini and Halva Properties

    Directory of Open Access Journals (Sweden)

    Vlad Mureşan

    2015-11-01

    Full Text Available Sunflower is the basic oil-crop in Central and Eastern Europe. As sunflower seeds are mainly used for oil production, the most of the kernels available on the market show high oil content (>55%. Consequently, when sunflower kernel paste (tahini is used in different food products, oil exudation occurs.The aim of current work was to use entirely the sunflower seeds by partially defatting and obtaining different fat content sunflower pastes with multiple food applications, while using the husks for developing an ecological package. Sunflower kernels were industrially roasted in a continuous roasting drum.  Raw and roasted kernels were pressed at pilot plant scale by using a laboratory expeller. Partially defatted sunflower paste was obtained from the press cakes by employing a ball mill. Different fat content tahini samples were obtained by adding the required amount of oil to the partially defatted paste. Tahini samples fat content ranged from 45 to 60%. Tahini and halva were chosen as a study model. Decreasing tahini oil content increased its colloidal stability during storage, a similar trend being noticed when halva samples were stored. Moreover, halva texture analysis and sensory characteristics were assessed for selecting the optimum tahini oil content and thermal treatment. Various sunflower kernel food applications were proposed by obtaining the related prototypes at pilot plant scale: roasted sunflower kernel biscuits, sunflower spreadable cream filled biscuits, hummus, sunflower paste coated in chocolate, sunflower kernel chikki and bars, as well as an innovative ecological package based on the resulting sunflower husks and a starch adhesive. 

  14. IFT Scientific Status Summary 2008: Innovative Food Packaging Solutions

    Science.gov (United States)

    Food and beverage packaging comprises 55-65% of the $110 billion value of packaging in the United States. This review provides a summary of innovative technology developments in food packaging. The expanded role of food and beverage packaging is reviewed. Active and intelligent food packaging, ba...

  15. Technology Trust in Internet-Based Interorganizational Electronic Commerce

    OpenAIRE

    Pauline Ratnasingam; Paul A. Pavlou

    2003-01-01

    Trust in Internet-based Business-to-Business (B2B) e-commerce is an important issue for both practicioners and academicians. Whereas the traditional notion of dyadic interfirm trust primarily focuses on trust in a trading partner firm, trust in e-commerce also implicitly incorporates the notion of trust in the transaction infrastructure and underlying control mechanisms (technology trust), which deals with transaction integrity, authentication, confidentliality, non-repudiation, and best busi...

  16. Blockchain Technology: A new secured Electronic Health Record System

    OpenAIRE

    Tamazirt , Lotfi; Alilat , Farid; Agoulmine , Nazim

    2018-01-01

    International audience; Nowadays, health systems are looking for effective ways to manage more patients in a shorter time, and to increase the quality of care through better coordination to provide quick, accurate and non-invasive diagnostics to patients. This paper aims to solve the dependence on trusted third parties by proposing a new management strategy, storage and security in a decentralized network through Blockchain technology. The proposed system also aims to offer a solution to help...

  17. New generation of compact electron accelerators for radiation technologies

    International Nuclear Information System (INIS)

    Auslender, V.L.; Balakin, V.E.; Kraynov, G.S.

    1995-01-01

    Compact electron accelerators with energy range 0.25-1.0 MeV and beam power up to 32 kw are described. The feeding high voltage is formed by converter (working frequency 20 khz), coreless step-up transformer and a set of rectifying sections. The rectifying multiplier circuit used in rectifying sections permits to reach voltage gradient along accelerator's axis up to 14 kV/cm. The accelerators with vertical and horizontal position are described. The accelerators can be produced together with local radiation shielding and various underbeam transportation systems for irradiation of different products. Such version can be installed in any room facing general requirements for electric equipment

  18. CMOS technology: a critical enabler for free-form electronics-based killer applications

    Science.gov (United States)

    Hussain, Muhammad M.; Hussain, Aftab M.; Hanna, Amir

    2016-05-01

    Complementary metal oxide semiconductor (CMOS) technology offers batch manufacturability by ultra-large-scaleintegration (ULSI) of high performance electronics with a performance/cost advantage and profound reliability. However, as of today their focus has been on rigid and bulky thin film based materials. Their applications have been limited to computation, communication, display and vehicular electronics. With the upcoming surge of Internet of Everything, we have critical opportunity to expand the world of electronics by bridging between CMOS technology and free form electronics which can be used as wearable, implantable and embedded form. The asymmetry of shape and softness of surface (skins) in natural living objects including human, other species, plants make them incompatible with the presently available uniformly shaped and rigidly structured today's CMOS electronics. But if we can break this barrier then we can use the physically free form electronics for applications like plant monitoring for expansion of agricultural productivity and quality, we can find monitoring and treatment focused consumer healthcare electronics - and many more creative applications. In our view, the fundamental challenge is to engage the mass users to materialize their creative ideas. Present form of electronics are too complex to understand, to work with and to use. By deploying game changing additive manufacturing, low-cost raw materials, transfer printing along with CMOS technology, we can potentially stick high quality CMOS electronics on any existing objects and embed such electronics into any future objects that will be made. The end goal is to make them smart to augment the quality of our life. We use a particular example on implantable electronics (brain machine interface) and its integration strategy enabled by CMOS device design and technology run path.

  19. CMOS technology: a critical enabler for free-form electronics-based killer applications

    KAUST Repository

    Hussain, Muhammad Mustafa

    2016-05-17

    Complementary metal oxide semiconductor (CMOS) technology offers batch manufacturability by ultra-large-scaleintegration (ULSI) of high performance electronics with a performance/cost advantage and profound reliability. However, as of today their focus has been on rigid and bulky thin film based materials. Their applications have been limited to computation, communication, display and vehicular electronics. With the upcoming surge of Internet of Everything, we have critical opportunity to expand the world of electronics by bridging between CMOS technology and free form electronics which can be used as wearable, implantable and embedded form. The asymmetry of shape and softness of surface (skins) in natural living objects including human, other species, plants make them incompatible with the presently available uniformly shaped and rigidly structured today’s CMOS electronics. But if we can break this barrier then we can use the physically free form electronics for applications like plant monitoring for expansion of agricultural productivity and quality, we can find monitoring and treatment focused consumer healthcare electronics – and many more creative applications. In our view, the fundamental challenge is to engage the mass users to materialize their creative ideas. Present form of electronics are too complex to understand, to work with and to use. By deploying game changing additive manufacturing, low-cost raw materials, transfer printing along with CMOS technology, we can potentially stick high quality CMOS electronics on any existing objects and embed such electronics into any future objects that will be made. The end goal is to make them smart to augment the quality of our life. We use a particular example on implantable electronics (brain machine interface) and its integration strategy enabled by CMOS device design and technology run path. © (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is

  20. RASPLAV package

    International Nuclear Information System (INIS)

    1990-01-01

    The RASPLAV package for investigation of post-accident mass transport and heat transfer processes is presented. The package performs three dimensional thermal conduction calculations in space nonuniform and temperature dependent conductivities and variable heat sources, taking into account phase transformations. The processes of free-moving bulk material, mixing of melting fuel due to advection and dissolution, and also evaporation/adsorption are modelled. Two-dimensional hydrodynamics with self-consistent heat transfer are also performed. The paper briefly traces the ways the solution procedures are carried out in the program package and outlines the major results of the simulation of reactor vessel melting after a core meltdown. The theoretical analysis and the calculations in this case were carried out in order to define the possibility of localization of the zone reminders. The interactions between the reminders and the concrete are simulated and evaluation of the interaction parameters is carried out. 4 refs. (R.Ts)

  1. Printing versus coating - What will be the future production technology for printed electronics?

    Energy Technology Data Exchange (ETDEWEB)

    Glawe, Andrea; Eggerath, Daniel; Schäfer, Frank [KROENERT GmbH and Co KG, Schuetzenstrasse 105, 22761 Hamburg (Germany)

    2015-02-17

    The market of Large Area Organic Printed Electronics is developing rapidly to increase efficiency and quality as well as to lower costs further. Applications for OPV, OLED, RFID and compact Printed Electronic systems are increasing. In order to make the final products more affordable, but at the same time highly accurate, Roll to Roll (R2R) production on flexible transparent polymer substrates is the way forward. There are numerous printing and coating technologies suitable depending on the design, the product application and the chemical process technology. Mainly the product design (size, pattern, repeatability) defines the application technology.

  2. Technology and equipment for processing diamond materials of modern electronics

    Directory of Open Access Journals (Sweden)

    Mityagin A. Yu.

    2009-02-01

    Full Text Available The methods of selection and sorting of diamonds according to their physical properties by modern physical methods of the analysis are developed, as well as the technologies of precision laser cutting of diamonds, their processing on a basis of thermochemical reactions in gas environment. The experimental installation for polishing and grinding of diamond plates, installation for slicing, installation for plasma-chemical processing are created. The techniques of surface roughness measurement of the processed plates and control of roughness parameters are developed. Some experimental results are given.

  3. Applications of Organic and Printed Electronics A Technology-Enabled Revolution

    CERN Document Server

    2013-01-01

    Organic and printed electronics can enable a revolution in the applications of electronics and this book offers readers an overview of the state-of-the-art in this rapidly evolving domain.  The potentially low cost, compatibility with flexible substrates and the wealth of devices that characterize organic and printed electronics will make possible applications that go far beyond the well-known displays made with large-area silicon electronics. Since organic electronics are still in their early stage, undergoing transition from lab-scale and prototype activities to production, this book serves as a valuable snapshot of the current landscape of the different devices enabled by this technology, reviewing all applications that are developing and those can be foreseen.   Provides a complete roadmap for organic and printed electronics research and development for the next several years; Includes an overview of the printing processes for organic electronics, along with state of the art applications, such as solar ...

  4. Cryo-electron Microscopy Reconstruction and Stability Studies of the Wild Type and the R432A Variant of Adeno-associated Virus Type 2 Reveal that Capsid Structural Stability Is a Major Factor in Genome Packaging.

    Science.gov (United States)

    Drouin, Lauren M; Lins, Bridget; Janssen, Maria; Bennett, Antonette; Chipman, Paul; McKenna, Robert; Chen, Weijun; Muzyczka, Nicholas; Cardone, Giovanni; Baker, Timothy S; Agbandje-McKenna, Mavis

    2016-10-01

    The adeno-associated viruses (AAV) are promising therapeutic gene delivery vectors and better understanding of their capsid assembly and genome packaging mechanism is needed for improved vector production. Empty AAV capsids assemble in the nucleus prior to genome packaging by virally encoded Rep proteins. To elucidate the capsid determinants of this process, structural differences between wild-type (wt) AAV2 and a packaging deficient variant, AAV2-R432A, were examined using cryo-electron microscopy and three-dimensional image reconstruction both at an ∼5.0-Å resolution (medium) and also at 3.8- and 3.7-Å resolutions (high), respectively. The high resolution structures showed that removal of the arginine side chain in AAV2-R432A eliminated hydrogen bonding interactions, resulting in altered intramolecular and intermolecular interactions propagated from under the 3-fold axis toward the 5-fold channel. Consistent with these observations, differential scanning calorimetry showed an ∼10°C decrease in thermal stability for AAV2-R432A compared to wt-AAV2. In addition, the medium resolution structures revealed differences in the juxtaposition of the less ordered, N-terminal region of their capsid proteins, VP1/2/3. A structural rearrangement in AAV2-R432A repositioned the βA strand region under the icosahedral 2-fold axis rather than antiparallel to the βB strand, eliminating many intramolecular interactions. Thus, a single amino acid substitution can significantly alter the AAV capsid integrity to the extent of reducing its stability and possibly rendering it unable to tolerate the stress of genome packaging. Furthermore, the data show that the 2-, 3-, and 5-fold regions of the capsid contributed to producing the packaging defect and highlight a tight connection between the entire capsid in maintaining packaging efficiency. The mechanism of AAV genome packaging is still poorly understood, particularly with respect to the capsid determinants of the required capsid

  5. Electron Beam Technology and Other Irradiation Technology Applications in the Food Industry.

    Science.gov (United States)

    Pillai, Suresh D; Shayanfar, Shima

    2017-02-01

    Food irradiation is over 100 years old, with the original patent for X-ray treatment of foods being issued in early 1905, 20 years after there discovery by W. C. Roentgen in 1885. Since then, food irradiation technology has become one of the most extensively studied food processing technologies in the history of mankind. Unfortunately, it is the one of the most misunderstood technologies with the result that there are rampant misunderstandings of the core technology, the ideal applications, and how to use it effectively to derive the maximum benefits. There are a number of books, book chapters, and review articles that provide overviews of this technology [25, 32, 36, 39]. Over the last decade or so, the technology has come into greater focus because many of the other pathogen intervention technologies have been unable to provide sustainable solutions on how to address pathogen contamination in foods. The uniqueness of food irradiation is that this technology is a non-thermal food processing technology, which unto itself is a clear high-value differentiator from other competing technologies.

  6. Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

    International Nuclear Information System (INIS)

    Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S.R.; Silveira, Carlos G.

    2012-01-01

    The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO 2 and NO X removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and

  7. Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

    Science.gov (United States)

    Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S. R.; Silveira, Carlos G.; Rela, Paulo R.

    2012-08-01

    The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO2 and NOX removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and

  8. A systematic review of portable electronic technology for health education in resource-limited settings.

    Science.gov (United States)

    McHenry, Megan S; Fischer, Lydia J; Chun, Yeona; Vreeman, Rachel C

    2017-08-01

    The objective of this study is to conduct a systematic review of the literature of how portable electronic technologies with offline functionality are perceived and used to provide health education in resource-limited settings. Three reviewers evaluated articles and performed a bibliography search to identify studies describing health education delivered by portable electronic device with offline functionality in low- or middle-income countries. Data extracted included: study population; study design and type of analysis; type of technology used; method of use; setting of technology use; impact on caregivers, patients, or overall health outcomes; and reported limitations. Searches yielded 5514 unique titles. Out of 75 critically reviewed full-text articles, 10 met inclusion criteria. Study locations included Botswana, Peru, Kenya, Thailand, Nigeria, India, Ghana, and Tanzania. Topics addressed included: development of healthcare worker training modules, clinical decision support tools, patient education tools, perceptions and usability of portable electronic technology, and comparisons of technologies and/or mobile applications. Studies primarily looked at the assessment of developed educational modules on trainee health knowledge, perceptions and usability of technology, and comparisons of technologies. Overall, studies reported positive results for portable electronic device-based health education, frequently reporting increased provider/patient knowledge, improved patient outcomes in both quality of care and management, increased provider comfort level with technology, and an environment characterized by increased levels of technology-based, informal learning situations. Negative assessments included high investment costs, lack of technical support, and fear of device theft. While the research is limited, portable electronic educational resources present promising avenues to increase access to effective health education in resource-limited settings, contingent

  9. Description of the plasma diagnostics package (PDP) for the OSS-1 Shuttle mission and JSC plasma chamber test in conjunction with the fast pulse electron gun (FPEG)

    Science.gov (United States)

    Shawhan, S. D.

    1982-01-01

    The objectives, equipment, and techniques for the plasma diagnostics package (PDP) carried by the OSS-1 instrument payload of the STS-4 and scheduled for the Spacelab-2 mission are described. The goals of the first flight were to examine the Orbiter-magnetoplasma interactions by measuring the electric and magnetic field strengths, the ionized particle wakes, and the generated waves. The RMS was employed to lift the unit out of the bay in order to allow characterization of the fields, EM interference, and plasma contamination within 15 m of the Orbiter. The PDP will also be used to examine plasma depletion, chemical reaction rates, waves, and energized plasma produced by firing of the Orbiter thrusters. Operation of the PDP was carried out in the NASA Space Environment Simulation Laboratory test chamber, where the PDP was used to assay the fields, fluxes, wave amplitudes, and particle energy spectra. The PDP instrumentation is also capable of detecting thermal ions, thermal electrons suprathermal particles, VHF/UHF EMI levels, and the S-band field strength.

  10. CMOS-Technology-Enabled Flexible and Stretchable Electronics for Internet of Everything Applications

    KAUST Repository

    Hussain, Aftab M.

    2015-11-26

    Flexible and stretchable electronics can dramatically enhance the application of electronics for the emerging Internet of Everything applications where people, processes, data and devices will be integrated and connected, to augment quality of life. Using naturally flexible and stretchable polymeric substrates in combination with emerging organic and molecular materials, nanowires, nanoribbons, nanotubes, and 2D atomic crystal structured materials, significant progress has been made in the general area of such electronics. However, high volume manufacturing, reliability and performance per cost remain elusive goals for wide commercialization of these electronics. On the other hand, highly sophisticated but extremely reliable, batch-fabrication-capable and mature complementary metal oxide semiconductor (CMOS)-based technology has facilitated tremendous growth of today\\'s digital world using thin-film-based electronics; in particular, bulk monocrystalline silicon (100) which is used in most of the electronics existing today. However, one fundamental challenge is that state-of-the-art CMOS electronics are physically rigid and brittle. Therefore, in this work, how CMOS-technology-enabled flexible and stretchable electronics can be developed is discussed, with particular focus on bulk monocrystalline silicon (100). A comprehensive information base to realistically devise an integration strategy by rational design of materials, devices and processes for Internet of Everything electronics is offered. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  11. Advanced laser technologies for high-brightness photocathode electron gun

    International Nuclear Information System (INIS)

    Tomizawa, Hiromitsu

    2012-01-01

    A laser-excited photocathode RF gun is one of the most reliable high-brightness electron beam sources for XFELs. Several 3D laser shaping methods have been developed as ideal photocathode illumination sources at SPring-8 since 2001. To suppress the emittance growth caused by nonlinear space-charge forces, the 3D cylindrical UV-pulse was optimized spatially as a flattop and temporally as squarely stacked chirped pulses. This shaping system is a serial combination of a deformable mirror that adaptively shapes the spatial profile with a genetic algorithm and a UV-pulse stacker that consists of four birefringent α-BBO crystal rods for temporal shaping. Using this 3D-shaped pulse, a normalized emittance of 1.4 πmm mrad was obtained in 2006. Utilizing laser's Z-polarization, Schottky-effect-gated photocathode gun was proposed in 2006. The cathode work functions are reduced by a laser-induced Schottky effect. As a result of focusing a radially polarized laser pulse with a hollow lens in vacuum, the Z-field (Z-polarization) is generated at the cathode. (author)

  12. Electron beam lithographic modeling assisted by artificial intelligence technology

    Science.gov (United States)

    Nakayamada, Noriaki; Nishimura, Rieko; Miura, Satoru; Nomura, Haruyuki; Kamikubo, Takashi

    2017-07-01

    We propose a new concept of tuning a point-spread function (a "kernel" function) in the modeling of electron beam lithography using the machine learning scheme. Normally in the work of artificial intelligence, the researchers focus on the output results from a neural network, such as success ratio in image recognition or improved production yield, etc. In this work, we put more focus on the weights connecting the nodes in a convolutional neural network, which are naturally the fractions of a point-spread function, and take out those weighted fractions after learning to be utilized as a tuned kernel. Proof-of-concept of the kernel tuning has been demonstrated using the examples of proximity effect correction with 2-layer network, and charging effect correction with 3-layer network. This type of new tuning method can be beneficial to give researchers more insights to come up with a better model, yet it might be too early to be deployed to production to give better critical dimension (CD) and positional accuracy almost instantly.

  13. Advanced Laser Technologies for High-brightness Photocathode Electron Gun

    Science.gov (United States)

    Tomizawa, Hiromitsu

    A laser-excited photocathode RF gun is one of the most reliable high-brightness electron beam sources for XFELs. Several 3D laser shaping methods have been developed as ideal photocathode illumination sources at SPring-8 since 2001. To suppress the emittance growth caused by nonlinear space-charge forces, the 3D cylindrical UV-pulse was optimized spatially as a flattop and temporally as squarely stacked chirped pulses. This shaping system is a serial combination of a deformable mirror that adaptively shapes the spatial profile with a genetic algorithm and a UV-pulse stacker that consists of four birefringent α-BBO crystal rods for temporal shaping. Using this 3D-shaped pulse, a normalized emittance of 1.4 π mm mrad was obtained in 2006. Utilizing laser's Z-polarization, Schottky-effect-gated photocathode gun was proposed in 2006. The cathode work functions are reduced by a laser-induced Schottky effect. As a result of focusing a radially polarized laser pulse with a hollow lens in vacuum, the Z-field (Z-polarization) is generated at the cathode.

  14. Recent progress on thin-film encapsulation technologies for organic electronic devices

    Science.gov (United States)

    Yu, Duan; Yang, Yong-Qiang; Chen, Zheng; Tao, Ye; Liu, Yun-Fei

    2016-03-01

    Among the advanced electronic devices, flexible organic electronic devices with rapid development are the most promising technologies to customers and industries. Organic thin films accommodate low-cost fabrication and can exploit diverse molecules in inexpensive plastic light emitting diodes, plastic solar cells, and even plastic lasers. These properties may ultimately enable organic materials for practical applications in industry. However, the stability of organic electronic devices still remains a big challenge, because of the difficulty in fabricating commercial products with flexibility. These organic materials can be protected using substrates and barriers such as glass and metal; however, this results in a rigid device and does not satisfy the applications demanding flexible devices. Plastic substrates and transparent flexible encapsulation barriers are other possible alternatives; however, these offer little protection to oxygen and water, thus rapidly degrading the devices. Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation into the flexible devices. Because of these (and other) reasons, there has been an intense interest in developing transparent barrier materials with much lower permeabilities, and their market is expected to reach over 550 million by 2025. In this study, the degradation mechanism of organic electronic devices is reviewed. To increase the stability of devices in air, several TFE technologies were applied to provide efficient barrier performance. In this review, the degradation mechanism of organic electronic devices, permeation rate measurement, traditional encapsulation technologies, and TFE technologies are presented.

  15. ENVIRONMENTAL TECHNOLOGY VERIFICATION REPORT - PORTABLE GAS CHROMATOGRAPH ELECTRONIC SENSOR TECHNOLOGY MODEL 4100

    Science.gov (United States)

    The U.S. Environmental Protection Agency, through the Environmental Technology Verification Program, is working to accelerate the acceptance and use of innovative technologies that improve the way the United States manages its environmental problems. As part of this program, the...

  16. Health information technology: integration of clinical workflow into meaningful use of electronic health records.

    Science.gov (United States)

    Bowens, Felicia M; Frye, Patricia A; Jones, Warren A

    2010-10-01

    This article examines the role that clinical workflow plays in successful implementation and meaningful use of electronic health record (EHR) technology in ambulatory care. The benefits and barriers of implementing EHRs in ambulatory care settings are discussed. The researchers conclude that widespread adoption and meaningful use of EHR technology rely on the successful integration of health information technology (HIT) into clinical workflow. Without successful integration of HIT into clinical workflow, clinicians in today's ambulatory care settings will continue to resist adoption and implementation of EHR technology.

  17. Integrated Approach to Industrial Packaging Design

    Science.gov (United States)

    Vorobeva, O.

    2017-11-01

    The article reviews studies in the field of industrial packaging design. The major factors which influence technological, ergonomic, economic and ecological features of packaging are established. The main modern trends in packaging design are defined, the principles of marketing communications and their influence on consumers’ consciousness are indicated, and the function of packaging as a transmitter of brand values is specified. Peculiarities of packaging technology and printing techniques in modern printing industry are considered. The role of designers in the stage-by-stage development of the construction, form and graphic design concept of packaging is defined. The examples of authentic packaging are given and the mention of the tetrahedron packaging history is made. At the end of the article, conclusions on the key research aspects are made.

  18. Intelligent food packaging - research and development

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2015-03-01

    Full Text Available Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packaging refers to a package that can sense environmental changes, and in turn, informs the users about the changes. These packaging systems contain devices that are capable of sensing and providing information about the functions and properties of the packaged foods. Also, this paper will review intelligent packaging technologies and describe different types of indicators (time-temperature indicators, freshness indicators.

  19. Ceramic packages for liquid-nitrogen operation

    International Nuclear Information System (INIS)

    Tong, H.M.; Yeh, H.L.; Goldblatt, R.D.

    1989-01-01

    To evaluate their compatibility for use in a liquid-nitrogen computer, metallized ceramic packages with test chips joined using IBM controlled-collapse solder (Pb-Sn) technology have been cycled between 30 0 C and liquid-nitrogen temperature. Room-temperature electrical resistance measurements were made at regular intervals of cycles to determine whether solder failure accompanied by a significant resistance increase had occurred. For the failed solder joints characterized by the highest thermal shear strain amplitude of 3.3 percent, the authors were able to estimate the number of liquid-nitrogen cycles needed to produce the corresponding failure rate using a room-temperature solder lifetime model. Cross-sectional examination of the failed solder joints using scanning electron microscopy and energy dispersive X-ray analysis indicated solder cracking occurring at the solder-ceramic interface. Chip pull tests on cycled packages yielded strengths far exceeding the minimal requirement. Mechanisms involving the formation of intermetallics were proposed to account for the observed solder fracture modes after liquid-nitrogen cycling and after chip pull. Furthermore, scanning electron microscopic examination of pulled chips in cycled packages showed no apparent sign of cracking in quartz and polyimide for chip insulation

  20. Electron Emitter for small-size Electrodynamic Space Tether using MEMS Technology

    DEFF Research Database (Denmark)

    Fleron, René A. W.; Blanke, Mogens

    2004-01-01

    Adjustment of the orbit of a spacecraft using the forces created by an electro-dynamic space-tether has been shown as a theoretic possibility in recent literature. Practical implementation is being pursued for larger scale missions where a hot filament device controls electron emission...... and the current flowing in the electrodynamic space tether. Applications to small spacecraft, or space debris in the 1–10 kg range, possess difficulties with electron emission technology, as low power emitting devices are needed. This paper addresses the system concepts of a small spacecraft electrodynamic tether...... system with focus on electron emitter design and manufacture using micro-electro-mechanical- system (MEMS) technology. The paper addresses the system concepts of a small size electrodynamic tether mission and shows a novel electron emitter for the 1-2 mA range where altitude can be effectively affected...

  1. Tamper indicating packaging

    International Nuclear Information System (INIS)

    Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

    1994-01-01

    Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL

  2. The Ettention software package

    International Nuclear Information System (INIS)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-01-01

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  3. The Ettention software package

    Energy Technology Data Exchange (ETDEWEB)

    Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

    2016-02-15

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  4. 3D detector and electronics integration technologies: Applications to ILC, SLHC, and beyond

    International Nuclear Information System (INIS)

    Lipton, Ronald

    2011-01-01

    The application of vertically integrated (3D) electronics to particle physics has been explored by the our group for the past several years. We have successfully designed the first vertically integrated demonstrator chip for ILC vertex detection in the three-tier MIT-Lincoln Labs process. We have also studied sensor integration with electronics through oxide bonding and silicon-on-insulator technology. This paper will discuss the status of these studies and prospects for future work.

  5. 3D detector and electronics integration technologies: Applications to ILC, SLHC, and beyond

    Energy Technology Data Exchange (ETDEWEB)

    Lipton, Ronald, E-mail: lipton@fnal.gov [Fermilab, P.O. Box 500, Batavia, IL 60510 (United States)

    2011-04-21

    The application of vertically integrated (3D) electronics to particle physics has been explored by the our group for the past several years. We have successfully designed the first vertically integrated demonstrator chip for ILC vertex detection in the three-tier MIT-Lincoln Labs process. We have also studied sensor integration with electronics through oxide bonding and silicon-on-insulator technology. This paper will discuss the status of these studies and prospects for future work.

  6. Smart packaging systems for food applications: a review.

    Science.gov (United States)

    Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

    2015-10-01

    Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

  7. Innovative, wearable snap connector technology for improved device networking in electronic garments

    Science.gov (United States)

    Kostrzewski, Andrew A.; Lee, Kang S.; Gans, Eric; Winterhalter, Carole A.; Jannson, Tomasz P.

    2007-04-01

    This paper discusses Physical Optics Corporation's (POC) wearable snap connector technology that provides for the transfer of data and power throughout an electronic garment (e-garment). These connectors resemble a standard garment button and can be mated blindly with only one hand. Fully compatible with military clothing, their application allows for the networking of multiple electronic devices and an intuitive method for adding/removing existing components from the system. The attached flexible cabling also permits the rugged snap connectors to be fed throughout the standard webbing found in military garments permitting placement in any location within the uniform. Variations of the snap electronics/geometry allow for integration with USB 2.0 devices, RF antennas, and are capable of transferring high bandwidth data streams such as the 221 Mbps required for VGA video. With the trend towards providing military officers with numerous electronic devices (i.e., heads up displays (HMD), GPS receiver, PDA, etc), POC's snap connector technology will greatly improve cable management resulting in a less cumbersome uniform. In addition, with electronic garments gaining widespread adoption in the commercial marketplace, POC's technology is finding applications in such areas as sporting good manufacturers and video game technology.

  8. Development of Pixel Front-End Electronics using Advanced Deep Submicron CMOS Technologies

    CERN Document Server

    Havránek, Miroslav; Dingfelder, Jochen

    The content of this thesis is oriented on the R&D; of microelectronic integrated circuits for processing the signal from particle sensors and partially on the sensors themselves. This work is motivated by ongoing upgrades of the ATLAS Pixel Detector at CERN laboratory and by exploration of new technologies for the future experiments in particle physics. Evolution of technologies for the fabrication of microelectronic circuits follows Moore’s laws. Transistors become smaller and electronic chips reach higher complexity. Apart from this, silicon foundries become more open to smaller customers and often provide non-standard process options. Two new directions in pixel technologies are explored in this thesis: design of pixel electronics using ultra deep submicron (65 nm) CMOS technology and Depleted Monolithic Active Pixel Sensors (DMAPS). An independent project concerning the measurement of pixel capacitance with a dedicated measurement chip is a part of this thesis. Pixel capacitance is one of the key pa...

  9. Enabling Patient Control of Personal Electronic Health Records Through Distributed Ledger Technology.

    Science.gov (United States)

    Cunningham, James; Ainsworth, John

    2017-01-01

    The rise of distributed ledger technology, initiated and exemplified by the Bitcoin blockchain, is having an increasing impact on information technology environments in which there is an emphasis on trust and security. Management of electronic health records, where both conformation to legislative regulations and maintenance of public trust are paramount, is an area where the impact of these new technologies may be particularly beneficial. We present a system that enables fine-grained personalized control of third-party access to patients' electronic health records, allowing individuals to specify when and how their records are accessed for research purposes. The use of the smart contract based Ethereum blockchain technology to implement this system allows it to operate in a verifiably secure, trustless, and openly auditable environment, features crucial to health information systems moving forward.

  10. Transforming health care the financial impact of technology, electronic tools and data mining

    CERN Document Server

    Fasano, Phil

    2013-01-01

    The future of healthcare technologies, and what they mean for investors and entrepreneurs The healthcare technology revolution is just around the corner. And when it arrives, it will change and enrich our lives in ways we can only begin to imagine. Doctors will perform blood pressure readings via video chat and nutritionists will analyze diet based on photos taken with cellphone cameras. Transforming Health Care combines healthcare, technology, and finance in an innovative new way that explains the future of healthcare and its effects on patient care, exploring the emergence of electronic tools that will transform the medical industry. Explaining how technology, not politics, will lead the future of the healthcare revolution, author and healthcare technology expert Phil Fasano presents real-life examples that show how the next generation of medical breakthroughs will come from the instant exchange of information across the world Explores how new technologies will radically change the future of healthcare by m...

  11. Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

    Directory of Open Access Journals (Sweden)

    Xuelin Wang

    2016-11-01

    Full Text Available This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc. to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good product—all of which are challenges faced by current liquid metal flexible printed electronics—are discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.

  12. Metastable Packaging For Transient Electronics

    Science.gov (United States)

    2014-09-01

    26  Figure 27. Raman Spectra of PPA Thermal Degradation Products, PPA, oPA and Coating ....... 27  List of Tables Table Page... magnesium (Mg) resistors onto the PPA/PAG substrates. Using Mg resistors as a model system, two different PAGs were investigated, triphenylsulfonium...during casting. 3.1.3 Effect of Polymer on Mg Circuit Traces To demonstrate the effect of polymer on the chemical stability of magnesium (Mg) circuits

  13. Design and application of mathematical model for strategic planning of technology transfer in Iran's packaging industries company (I.P.I.C)

    International Nuclear Information System (INIS)

    Aliahmadi, A.

    2001-01-01

    Selecting right strategies for technology transfer and R and D projects is vital for developing countries. A number of researchers have di sussed the problem and applied different techniques, such as Engineering Economics Analysis, Ranking Methods, Goal Programming, Integer Programming and Analytical Hierarchy Process, to this problem. They haven't discussed the problems of developing countries in their models from a strategic planning point of view. In this paper the model of Moore and Ghand-Foruch is used and developed to improve the strategic planning for technology acquisition in developing countries. The proposed model consists of two phases, in which the first phase deals with calculating the utility of different strategies, policies and programs by considering critical, quantitative and qualitative factors. The second phase optimizes the total utility of strategic planning by using Mixed Integer Linear Programming while considering the constraints on budget, manpower, time etc. At the end, the result of application of the model in an Iranian industry (Iran's Packaging Industries Company) is discussed

  14. The development of an electronic business based on the MySQL technology

    Directory of Open Access Journals (Sweden)

    Andreea IONESCU

    2011-09-01

    Full Text Available This article aims to demonstrate the importance of using relational database management system in working with web applications. We chose MySQL technology like representative relational database management system because has: portability, scalability, speed, is easy to use, is open source, is widely used by web developers and provides good security. We watched the analysis of an electronic business. We also presented the technologies that we have used: PHP, MySQL, HTML, CSS.

  15. Amdahl 470 Chip Package

    CERN Multimedia

    1975-01-01

    In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

  16. ACTIVE PACKAGING SYSTEM FOR MEAT AND MEAT PRODUCTS

    Directory of Open Access Journals (Sweden)

    Adriana Pavelková

    2012-10-01

    Full Text Available In the recent past, food packaging was used to enable marketing of products and to provide passive protection against environmental contaminations or influences that affect the shelf life of the products. However, unlike traditional packaging, which must be totally inert, active packaging is designed to interact with the contents and/or the surrounding environment. Interest in the use of active packaging systems for meat and meat products has increased in recent years. Active packaging systems are developed with the goal of extending shelf life for foods and increasing the period of time that the food is high quality. Developments in active packaging have led to advances in many areas, including delayed oxidation and controlled respiration rate, microbial growth, and moisture migration. Active packaging technologies include some physical, chemical, or biological action which changes interactions between a package, product, and/or headspace of the package in order to get a desired outcome. Active packaging systems discussed include oxygen scavengers, carbon dioxide scavengers and emitters, moisture control agents, flavour/odour absorbers and releasers  and antimicrobial packaging technologies. Active packaging is typically found in two types of systems; sachets and pads which are placed inside of packages, and active ingredients that are incorporated directly into packaging materials.  Recognition of the benefits of active packaging technologies by the food industry, development of economically viable packaging systems and increased consumer acceptance is necessary for commercial realisation of these packaging technologies.doi:10.5219/205

  17. Advanced Technology in Small Packages Enables Space Science Research Nanosatellites: Examples from the NASA Miniature X-ray Solar Spectrometer CubeSat

    Science.gov (United States)

    Woods, T. N.

    2017-12-01

    Nanosatellites, including the CubeSat class of nanosatellites, are about the size of a shoe box, and the CubeSat modular form factor of a Unit (1U is 10 cm x 10 cm x 10 cm) was originally defined in 1999 as a standardization for students developing nanosatellites. Over the past two decades, the satellite and instrument technologies for nanosatellites have progressed to the sophistication equivalent to the larger satellites, but now available in smaller packages through advanced developments by universities, government labs, and space industries. For example, the Blue Canyon Technologies (BCT) attitude determination and control system (ADCS) has demonstrated 3-axis satellite control from a 0.5-Unit system with 8 arc-second stability using reaction wheels, torque rods, and a star tracker. The first flight demonstration of the BCT ADCS was for the NASA Miniature X-ray Solar Spectrometer (MinXSS) CubeSat. The MinXSS CubeSat mission, which was deployed in May 2016 and had its re-entry in May 2017, provided space weather measurements of the solar soft X-rays (SXR) variability using low-power, miniaturized instruments. The MinXSS solar SXR spectra have been extremely useful for exploring flare energetics and also for validating the broadband SXR measurements from the NOAA GOES X-Ray Sensor (XRS). The technology used in the MinXSS CubeSat and summary of science results from the MinXSS-1 mission will be presented. Web site: http://lasp.colorado.edu/home/minxss/

  18. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  19. Theoretical and practical considerations for teaching diagnostic electronic-nose technologies to clinical laboratory technicians

    Science.gov (United States)

    Alphus D. Wilson

    2012-01-01

    The rapid development of new electronic technologies and instruments, utilized to perform many current clinical operations in the biomedical field, is changing the way medical health care is delivered to patients. The majority of test results from laboratory analyses, performed with these analytical instruments often prior to clinical examinations, are frequently used...

  20. Vertical and Horizontal Integration of Laboratory Curricula and Course Projects across the Electronic Engineering Technology Program

    Science.gov (United States)

    Zhan, Wei; Goulart, Ana; Morgan, Joseph A.; Porter, Jay R.

    2011-01-01

    This paper discusses the details of the curricular development effort with a focus on the vertical and horizontal integration of laboratory curricula and course projects within the Electronic Engineering Technology (EET) program at Texas A&M University. Both software and hardware aspects are addressed. A common set of software tools are…

  1. Introducing Electronic Textbooks as Daily-Use Technology in Schools: A Top-Down Adoption Process

    Science.gov (United States)

    Chiu, Thomas K. F.

    2017-01-01

    This study took frequency of use and the adoption process into account to define the participants and external variables of the research model. School electronic textbooks are a daily-use technology and they are adopted in a compulsory, top-down way. Their introduction can evoke feelings of anxiety among teachers because of a possible increase in…

  2. The Impact of Software on Associate Degree Programs in Electronic Engineering Technology.

    Science.gov (United States)

    Hata, David M.

    1986-01-01

    Assesses the range and extent of computer assisted instruction software available in electronic engineering technology education. Examines the need for software skills in four areas: (1) high-level languages; (2) assembly language; (3) computer-aided engineering; and (4) computer-aided instruction. Outlines strategies for the future in three…

  3. Electronic Communications Technologies and the Transition to College: Links to Parent-Child Attachment and Adjustment

    Science.gov (United States)

    Sarigiani, Pamela A.; Trumbell, Jill M.; Camarena, Phame M.

    2013-01-01

    Electronic communications technologies (ECTs) help college students and parents remain in contact. Because recent reports have emphasized a link between ECTs, helicopter parenting, and autonomy issues, this study focused on the significance of contact patterns for attachment and student adjustment. First-semester college students (199 female, 81…

  4. Lively package

    International Nuclear Information System (INIS)

    Jaremko, G.

    1997-01-01

    Progress on the Lloydminster Heavy Oil Interpretive Centre, sponsored by the Lloydminster Oilfield Technical Society and expected to open in late 1998, was discussed. Some $150,000 of the $750,000 budget is already in the bank, and another $150,000 is in the pipeline. The Centre will be added to an existing and well-established visitor's site. It is reported to contain a lively and imaginatively-designed exhibit package, and promises to become a combination of educational tool and tourist attraction for the town of Lloydminster, Saskatchewan, in the heart of heavy oil country

  5. ANTIMICROBIALS USED IN ACTIVE PACKAGING FILMS

    OpenAIRE

    Dıblan, Sevgin; Kaya, Sevim

    2017-01-01

    Active packaging technology is one of the innovativemethods for preserving of food products, and antimicrobial packaging films is amajor branch and promising application of this technology. In order to controlmicrobial spoilage and also contamination of pathogen onto processed or fresh food,antimicrobial agent(s) is/are incorporated into food packaging structure.Polymer type as a carrier of antimicrobial can be petroleum-based plastic orbiopolymer: because of environmental concerns researcher...

  6. American Society for Therapeutic Radiology and Oncology (ASTRO) Emerging Technology Committee report on electronic brachytherapy.

    Science.gov (United States)

    Park, Catherine C; Yom, Sue S; Podgorsak, Matthew B; Harris, Eleanor; Price, Robert A; Bevan, Alison; Pouliot, Jean; Konski, Andre A; Wallner, Paul E

    2010-03-15

    The development of novel technologies for the safe and effective delivery of radiation is critical to advancing the field of radiation oncology. The Emerging Technology Committee of the American Society for Therapeutic Radiology and Oncology appointed a Task Group within its Evaluation Subcommittee to evaluate new electronic brachytherapy methods that are being developed for, or are already in, clinical use. The Task Group evaluated two devices, the Axxent Electronic Brachytherapy System by Xoft, Inc. (Fremont, CA), and the Intrabeam Photon Radiosurgery Device by Carl Zeiss Surgical (Oberkochen, Germany). These devices are designed to deliver electronically generated radiation, and because of their relatively low energy output, they do not fall under existing regulatory scrutiny of radioactive sources that are used for conventional radioisotope brachytherapy. This report provides a descriptive overview of the technologies, current and future projected applications, comparison of competing technologies, potential impact, and potential safety issues. The full Emerging Technology Committee report is available on the American Society for Therapeutic Radiology and Oncology Web site. Copyright 2010. Published by Elsevier Inc.

  7. American Society for Therapeutic Radiology and Oncology (ASTRO) Emerging Technology Committee Report on Electronic Brachytherapy

    International Nuclear Information System (INIS)

    Park, Catherine C.; Yom, Sue S.; Podgorsak, Matthew B.; Harris, Eleanor; Price, Robert A.; Bevan, Alison; Pouliot, Jean; Konski, Andre A.; Wallner, Paul E.

    2010-01-01

    The development of novel technologies for the safe and effective delivery of radiation is critical to advancing the field of radiation oncology. The Emerging Technology Committee of the American Society for Therapeutic Radiology and Oncology appointed a Task Group within its Evaluation Subcommittee to evaluate new electronic brachytherapy methods that are being developed for, or are already in, clinical use. The Task Group evaluated two devices, the Axxent Electronic Brachytherapy System by Xoft, Inc. (Fremont, CA), and the Intrabeam Photon Radiosurgery Device by Carl Zeiss Surgical (Oberkochen, Germany). These devices are designed to deliver electronically generated radiation, and because of their relatively low energy output, they do not fall under existing regulatory scrutiny of radioactive sources that are used for conventional radioisotope brachytherapy. This report provides a descriptive overview of the technologies, current and future projected applications, comparison of competing technologies, potential impact, and potential safety issues. The full Emerging Technology Committee report is available on the American Society for Therapeutic Radiology and Oncology Web site.

  8. RECENT TRENDS IN PACKAGING SYSTEMS FOR PHARMACEUTICAL PRODUCTS

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2014-12-01

    Full Text Available Background:  In recent years, pharmaceutical packaging market was one of the fastest growing areas of the packaging industry. At the same time the packaging manufacturers put high demands on quality and safety. Methods: Review of innovations in packaging systems for pharmaceutical products was made including newest information of researches and achievements of recent years. Results and conclusion: Observed in recent years the development of pharmaceutical packaging market expanded due to with the huge technological advances that allow introduction of new packaging. Also, in this study presented intelligent packaging in pharmacy and innovation in child-resistance packaging.

  9. Summary Describing Integration of ERM Methodology into Supervisory Control Framework with Software Package Documentation; Advanced Reactor Technology Milestone: M4AT-16PN2301052

    Energy Technology Data Exchange (ETDEWEB)

    Ramuhalli, Pradeep [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Hirt, Evelyn H. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Dib, Gerges [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Veeramany, Arun [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Bonebrake, Christopher A. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Roy, Surajit [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

    2016-09-20

    This project involved the development of enhanced risk monitors (ERMs) for active components in Advanced Reactor (AdvRx) designs by integrating real-time information about equipment condition with risk monitors. Health monitoring techniques in combination with predictive estimates of component failure based on condition and risk monitors can serve to indicate the risk posed by continued operation in the presence of detected degradation. This combination of predictive health monitoring based on equipment condition assessment and risk monitors can also enable optimization of maintenance scheduling with respect to the economics of plant operation. This report summarizes PNNL’s multi-year project on the development and evaluation of an ERM concept for active components while highlighting FY2016 accomplishments. Specifically, this report provides a status summary of the integration and demonstration of the prototypic ERM framework with the plant supervisory control algorithms being developed at Oak Ridge National Laboratory (ORNL), and describes additional case studies conducted to assess sensitivity of the technology to different quantities. Supporting documentation on the software package to be provided to ONRL is incorporated in this report.

  10. Thomson, his discovery of the electron and the twentieth century science and technology

    International Nuclear Information System (INIS)

    Ahmad, N.

    1997-01-01

    Sir J. J. Thomson was the first to discover a subatomic particle i. e. electron. Due to this discovery he is remembered in the history as T he Atom Smasher . He was a great experimentalists and a devoted physicist. He himself, his son and his seven pupils earned Noble prizes on the basis of their scientific discoveries. The discovery of electron by Sir Thomson in 1897, at Cavendish Laboratory, has rewritten the entire physical science. Although electron has wide spread applications in almost every field, yet its exact nature is not fully known. This article briefly describes the life of Sir Thomson, his achievements and the impact of his discovery of electron on the twentieth century science and technology. (author)

  11. Development of pixel front-end electronics using advanced deep submicron CMOS technologies

    International Nuclear Information System (INIS)

    Havranek, Miroslav

    2014-09-01

    The content of this thesis is oriented on the R and D of microelectronic integrated circuits for processing the signal from particle sensors and partially on the sensors themselves. This work is motivated by ongoing upgrades of the ATLAS Pixel Detector at CERN laboratory and by exploration of new technologies for the future experiments in particle physics. Evolution of technologies for the fabrication of microelectronic circuits follows Moore's laws. Transistors become smaller and electronic chips reach higher complexity. Apart from this, silicon foundries become more open to smaller customers and often provide non-standard process options. Two new directions in pixel technologies are explored in this thesis: design of pixel electronics using ultra deep submicron (65 nm) CMOS technology and Depleted Monolithic Active Pixel Sensors (DMAPS). An independent project concerning the measurement of pixel capacitance with a dedicated measurement chip is a part of this thesis. Pixel capacitance is one of the key parameters for design of the pixel front-end electronics and thus it is closely related to the content of the thesis. The theoretical background, aspects of chip design, performance of chip prototypes and prospect for design of large pixel chips are comprehensively described in five chapters of the thesis.

  12. Development of pixel front-end electronics using advanced deep submicron CMOS technologies

    Energy Technology Data Exchange (ETDEWEB)

    Havranek, Miroslav

    2014-09-15

    The content of this thesis is oriented on the R and D of microelectronic integrated circuits for processing the signal from particle sensors and partially on the sensors themselves. This work is motivated by ongoing upgrades of the ATLAS Pixel Detector at CERN laboratory and by exploration of new technologies for the future experiments in particle physics. Evolution of technologies for the fabrication of microelectronic circuits follows Moore's laws. Transistors become smaller and electronic chips reach higher complexity. Apart from this, silicon foundries become more open to smaller customers and often provide non-standard process options. Two new directions in pixel technologies are explored in this thesis: design of pixel electronics using ultra deep submicron (65 nm) CMOS technology and Depleted Monolithic Active Pixel Sensors (DMAPS). An independent project concerning the measurement of pixel capacitance with a dedicated measurement chip is a part of this thesis. Pixel capacitance is one of the key parameters for design of the pixel front-end electronics and thus it is closely related to the content of the thesis. The theoretical background, aspects of chip design, performance of chip prototypes and prospect for design of large pixel chips are comprehensively described in five chapters of the thesis.

  13. Application of pulse power technology to ultra high energy electron accelerators

    International Nuclear Information System (INIS)

    Nation, J.A.

    1989-01-01

    The author presents in this paper a review of the application of pulse power technology to the development of high gradient electron accelerators. The technology demands are relatively modest compared to the ultra high power technology used for inertial confinement fusion drivers. With the advent of magnetic switching intense electron beams can be generated with a sufficiently high repetition rate to be of interest for high energy electron accelerator driver applications. Most of the techniques considered rely on the excitation of large amplitude waves on the beams. Within this framework there are two broad categories of accelerator, those in which the waves are directly excited in and supported by the medium and, secondly, those where the waves are used to generate radiofrequency signals which are then coupled via structures to the beam being accelerated. In what follows we shall consider both approaches. Present-day pulse power technology limits pulse durations to about 100 nsec. Consequently, if these sources are to be used, we will need to use high group velocity structures to avoid the need for short accelerator module lengths. An advantage of the short pulse duration is that the available acceleration voltage gradient increases compared to that obtained using conventional rf drivers. 19 references, 9 figures, 1 table

  14. Challenges for eco-design of emerging technologies: The case of electronic textiles

    International Nuclear Information System (INIS)

    Köhler, Andreas R.

    2013-01-01

    Highlights: • Recent innovations of electronic textiles and their end-of-life impacts are reviewed. • The properties of e-textiles are examined against Design for Recycling (DfR) principles. • Eco-design strategies for sustainable product development are discussed. • Compatibility standards for e-textiles are proposed as a waste prevention strategy. • Labelling of e-textiles is suggested as a measure to facilitate recycling. - Abstract: The combination of textile and electronic technologies results in new challenges for sustainable product design. Electronic textiles (e-textiles) feature a seamless integration of textiles with electronics and other high-tech materials. Such products may, if they become mass consumer applications, result in a new kind of waste that could be difficult to recycle. The ongoing innovation process of e-textiles holds opportunities to prevent future end-of-life impacts. Implementing eco-design in the technological development process can help to minimise future waste. However, the existing Design for Recycling (DfR) principles for textiles or electronics do not match with the properties of the combined products. This article examines possibilities to advance eco-design of a converging technology. DfR strategies for e-textiles are discussed from the background of contemporary innovation trends. Three waste preventative eco-design approaches for e-textiles are discussed: 1 harnessing the inherent advantages of smart materials for sustainable design; 2 establishing open compatibility standards; 3 labelling the e-textiles to facilitate their recycling. It is argued that life-cycle thinking needs to be implemented concurrent to the technological development process

  15. Test and evaluation report for Lockheed Idaho Technologies Company, arrow-pak packaging, docket 95-40-7A, type A container

    International Nuclear Information System (INIS)

    Kelly, D.L.

    1996-01-01

    This report incorporates the U.S. Department of Energy, Office of Facility Safety Analysis (DOE/EH-32) approval letter for packaging use. This report documents the U.S. Department of Transportation Specification 7A Type A (DOT-7A) compliance test results of the Arrow-Pak packaging. The Arrow-Pak packaging system consists of Marlex M-8000 Driscopipe, manufactured by Phillips-Driscopipe, Inc., and is sealed with two dome-shaped end caps manufactured from the same materials. The patented sealing process involves the use of electrical energy to heat opposing faces of the pipe and end caps, and hydraulic rams to press the heated surfaces together. This fusion process produces a homogeneous bonding of the end cap to the pipe. The packaging may be used with or without the two internal plywood spacers. This packaging configuration described in this report is designed to ship Type A quantities of solid radioactive materials

  16. Final evaluation report for Lockheed Idaho Technologies Company, ARROW-PAK packaging, Docket 95-40-7A, Type A container

    International Nuclear Information System (INIS)

    Kelly, D.L.

    1995-11-01

    The report documents the U.S. Department of Transportation Specification 7A Type A (DOT-7A) compliance test results of the ARROW-PAK packaging. The ARROW-PAK packaging system consists of Marlex M-8000 Driscopipe (Series 8000 [gas] or Series 8600 [industrial]) resin pipe, manufactured by Phillips-Driscopipe, Inc., and is sealed with two dome-shaped end caps manufactured from the same materials. The patented sealing process involves the use of electrical energy to heat opposing faces of the pipe and end caps, and hydraulic rams to press the heated surfaces together. This fusion process produces a homogeneous bonding of the end cap to the pipe. The packaging may be used with or without the two internal plywood spacers. This packaging was evaluated and tested in October 1995. The packaging configuration described in this report is designed to ship Type A quantities of solid radioactive materials, Form No. 1, Form No. 2, and Form No. 3

  17. STUDYING TECHNOLOGIES FOR CREATING ELECTRONIC TERMINOLOGICAL BASES IN THE PROCESS OF PROFESSIONAL TRAINING OF TRANSLATORS

    Directory of Open Access Journals (Sweden)

    Svitlana M. Amelina

    2017-09-01

    Full Text Available The article deals with the peculiarities of studying the technologies of creating electronic terminology databases at different stages of professional training of future translators in accordance with the level of their information competence. The issues of studying terminology management in foreign universities are considered. It is clarified that the ability to create and to use terminology databases is included in the curricula of disciplines on translation practice and translation technologies. There are various ways of creating terminological databases depending on their structure and technology. It is accentuated on mastering the technology of forming terminology databases by extracting terms from specialized texts. It is noted that the accumulation of own terminological resources makes it possible to use them in high-tech translation systems.

  18. Sticker electronics

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-09-08

    Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.

  19. School Superintendents' Use of Electronic Communication Technology and Its Impact on Their Efficacy as a School District Leader

    Science.gov (United States)

    Brock, Cecilia

    2017-01-01

    As apex leaders, school superintendents are impacted by the continuous demand to be effective while utilizing electronic communication technology. The purpose of this study is to investigate how the use of electronic communication technology impacts a school superintendent's efficacy. Public education, in the twenty-first century, finds itself in…

  20. An AES Study of the Room Temperature Surface Conditioning of Technological Metal Surfaces by Electron Irradiation

    OpenAIRE

    Scheuerlein, C; Hilleret, Noël; Taborelli, M; Brown, A; Baker, M A

    2002-01-01

    The modifications to technological copper and niobium surfaces induced by 2.5 keV electron irradiation have been investigated in the context of the conditioning process occurring in particle accelerator ultra high vacuum systems. Changes in the elemental surface composition have been found using Scanning Auger Microscopy (SAM) by monitoring the carbon, oxygen and metal Auger peak intensities as a function of electron irradiation in the dose range 10-6 to 10-2 C mm-2. The surface analysis resu...

  1. Electron beam technology for multipollutant emissions control from heavy fuel oil-fired boiler.

    Science.gov (United States)

    Chmielewski, Andrzej G; Ostapczuk, Anna; Licki, Janusz

    2010-08-01

    The electron beam treatment technology for purification of exhaust gases from the burning of heavy fuel oil (HFO) mazout with sulfur content approximately 3 wt % was tested at the Institute of Nuclear Chemistry and Technology laboratory plant. The parametric study was conducted to determine the sulfur dioxide (SO2), oxides of nitrogen (NO(x)), and polycyclic aromatic hydrocarbon (PAH) removal efficiency as a function of temperature and humidity of irradiated gases, absorbed irradiation dose, and ammonia stoichiometry process parameters. In the test performed under optimal conditions with an irradiation dose of 12.4 kGy, simultaneous removal efficiencies of approximately 98% for SO2, and 80% for NO(x) were recorded. The simultaneous decrease of PAH and one-ringed aromatic hydrocarbon (benzene, toluene, and xylenes [BTX]) concentrations was observed in the irradiated flue gas. Overall removal efficiencies of approximately 42% for PAHs and 86% for BTXs were achieved with an irradiation dose 5.3 kGy. The decomposition ratio of these compounds increased with an increase of absorbed dose. The decrease of PAH and BTX concentrations was followed by the increase of oxygen-containing aromatic hydrocarbon concentrations. The PAH and BTX decomposition process was initialized through the reaction with hydroxyl radicals that formed in the electron beam irradiated flue gas. Their decomposition process is based on similar principles as the primary reaction concerning SO2 and NO(x) removal; that is, free radicals attack organic compound chains or rings, causing volatile organic compound decomposition. Thus, the electron beam flue gas treatment (EBFGT) technology ensures simultaneous removal of acid (SO2 and NO(x)) and organic (PAH and BTX) pollutants from flue gas emitted from burning of HFO. This technology is a multipollutant emission control technology that can be applied for treatment of flue gas emitted from coal-, lignite-, and HFO-fired boilers. Other thermal processes such

  2. High-power free-electron lasers-technology and future applications

    Science.gov (United States)

    Socol, Yehoshua

    2013-03-01

    Free-electron laser (FEL) is an all-electric, high-power, high beam-quality source of coherent radiation, tunable - unlike other laser sources - at any wavelength within wide spectral region from hard X-rays to far-IR and beyond. After the initial push in the framework of the “Star Wars” program, the FEL technology benefited from decades of R&D and scientific applications. Currently, there are clear signs that the FEL technology reached maturity, enabling real-world applications. E.g., successful and unexpectedly smooth commissioning of the world-first X-ray FEL in 2010 increased in one blow by more than an order of magnitude (40×) wavelength region available by FEL technology and thus demonstrated that the theoretical predictions just keep true in real machines. Experience of ordering turn-key electron beamlines from commercial companies is a further demonstration of the FEL technology maturity. Moreover, successful commissioning of the world-first multi-turn energy-recovery linac demonstrated feasibility of reducing FEL size, cost and power consumption by probably an order of magnitude in respect to previous configurations, opening way to applications, previously considered as non-feasible. This review takes engineer-oriented approach to discuss the FEL technology issues, keeping in mind applications in the fields of military and aerospace, next generation semiconductor lithography, photo-chemistry and isotope separation.

  3. Microwave Technology for Waste Management Applications Including Disposition of Electronic Circuitry

    International Nuclear Information System (INIS)

    Wicks, G.G.; Clark, D.E.; Schulz, R.L.

    1998-01-01

    Advanced microwave technology is being developed nationally and internationally for a variety of waste management and environmental remediation purposes. These efforts include treatment and destruction of a vast array of gaseous, liquid and solid hazardous wastes as well as subsequent immobilization of hazardous components into leach resistant forms. Microwave technology provides an important contribution to an arsenal of existing remediation methods that are designed to protect the public and environment from the undesirable consequences of hazardous materials. One application of special interest is the treatment of discarded electronic circuitry using a new hybrid microwave treatment process and subsequent reclamation of the precious metals within

  4. Microwave technology for waste management applications including disposition of electronic circuitry

    International Nuclear Information System (INIS)

    Wicks, G.G.; Clark, D.E.; Schulz, R.L.; Folz, D.C.

    1995-01-01

    Microwave technology is being developed nationally and internationally for a variety of environmental remediation purposes. These efforts include treatment and destruction of a vast array of gaseous, liquid and solid hazardous wastes as well as subsequent immobilization of selected components. Microwave technology provides an important contribution to an arsenal of existing remediation methods that are designed to protect the public and environment from undesirable consequences of hazardous materials. Applications of microwave energy for environmental remediation will be discussed. Emphasized will be a newly developed microwave process designed to treat discarded electronic circuitry and reclaim the precious metals within for reuse

  5. Proceedings of the international conference on nascent technologies in the engineering fields of mechanical, electrical, electronics and telecommunication and computer/information technology: souvenir

    International Nuclear Information System (INIS)

    2015-01-01

    This conference contains papers on grid computing, advanced networking, data mining, biometric technologies, social networks and social aspects of information technology, robotics and mechatronics, advances in manufacturing technology, modelling and simulation of mechanical systems, recent trends in refrigeration and air conditioning, energy conservation and alternative fuels and advances in vibration control and its techniques. It also addresses issues in the field of power generation transmission and distribution, energy management and energy efficiency, applications of power electronics and solid state devices, renewable energy technology, distributed generation and micro grid, drives, controls and automation and power quality. The electronics and telecommunication track received good response in the fields of wired and wireless communication, advanced communications, digital signal processing and its applications, optical and microwave communication, embedded and VLSI technology, micro electronics and nano-technology, antenna applications and solid state devices. Papers relevant to INIS are indexed separately

  6. New Content Addressable Memory (CAM) Technologies for Big Data and Intelligent Electronics Enabled by Magneto-Electric Ternary CAM

    Science.gov (United States)

    2017-12-11

    AFRL-RY-WP-TR-2017-0198 NEW CONTENT ADDRESSABLE MEMORY (CAM) TECHNOLOGIES FOR BIG DATA AND INTELLIGENT ELECTRONICS ENABLED BY MAGNETO-ELECTRIC...MEMORY (CAM) TECHNOLOGIES FOR BIG DATA AND INTELLIGENT ELECTRONICS ENABLED BY MAGNETO-ELECTRIC TERNARY CAM 5a. CONTRACT NUMBER FA8650-16-1-7655 5b... electronic applications, such as internet of things, big data, wireless sensors, and mobile devices, have begun to focus on the importance of energy

  7. Extreme temperature packaging: challenges and opportunities

    Science.gov (United States)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  8. Power Electronics – The Key Technology for Renewable Energy System Integration

    DEFF Research Database (Denmark)

    Blaabjerg, Frede; Yang, Yongheng; Ma, Ke

    2015-01-01

    The energy paradigms in many countries (e.g. Germany and Denmark) have experienced a significant change from fossil-based resources to clean renewables (e.g. wind turbines and photovoltaics) in the past few decades. The scenario of highly penetrated renewables is going to be further enhanced...... – Denmark expects to be 100 % fossil-free by 2050. Consequently, it is required that the production, distribution and use of the energy should be as technologically efficient as possible and incentives to save energy at the end-user should also be strengthened. In order to realize the transition smoothly...... and effectively, energy conversion systems, currently based on power electronics technology, will again play an essential role in this energy paradigm shift. Using highly efficient power electronics in power generation, power transmission/distribution and end-user application, together with advanced control...

  9. Power Electronics – Key Technology for Renewable Energy Systems – Status and Future

    DEFF Research Database (Denmark)

    Blaabjerg, Frede; Yang, Yongheng; Ma, Ke

    2013-01-01

    play an essential role. Using highly efficient power electronics in power generation, power transmission/ distribution and end-user application, together with advanced control solutions, can pave the way for renewable energies. In view of this, some of the most emerging renewable energies, e.g. wind......The energy paradigms in many countries (e.g. Germany and Denmark) have experienced a significant change from fossil-based resources to clean renewables in the past few decades. The scenario of highly penetrated renewables is going to be further enhanced. This requires that the production......, distribution and use of the energy should be as technological efficient as possible and incentives to save energy at the end-user should also be streng-thened. In order to realize the transition smoothly and effectively, energy conversion systems, currently based on power electronics technology, will again...

  10. Effect of accelerated electron beams on technological properties of ferriquarzites of the Mikhajlovskij ore deposit

    International Nuclear Information System (INIS)

    Potapov, S.A.; Chakturiya, V.A.; Polyakov, V.A.; Rostovtsev, V.I.

    1989-01-01

    Method for enrichment of ferruginous quartzites of the Kursk magnetic anomaly, using electron irradiation was tested. Samples were irradiated by 2 MeV accelerated electron beam from IZU-6 industrial accelerator. The absorbed dose was equal to 0.14; 0.40; 0.75 Mrad for different types of quartzites. It is shown that sample irradiation elevates grindability of ferrugineous quartzites of all technological types. Enrichment factors increase. Iron extraction to concentrate grows. Extraction of easily enriched ores increases after irradiation by 2.86 %, quality - by 0.6 %; for oxidized ferruginous quartzites - 3.7 % and 1.5 % respectively. Productivity of grinding process increases 1.8-1.3 times. The described technique is promising and should be introduced possibility of elevating grinding productivity 2.0-2.2 times with increase of technological indices of magnetic separation by 2.5-4.0 % when using more powerful accelerators was established

  11. Flexible MEMS: A novel technology to fabricate flexible sensors and electronics

    Science.gov (United States)

    Tu, Hongen

    This dissertation presents the design and fabrication techniques used to fabricate flexible MEMS (Micro Electro Mechanical Systems) devices. MEMS devices and CMOS(Complementary Metal-Oxide-Semiconductor) circuits are traditionally fabricated on rigid substrates with inorganic semiconductor materials such as Silicon. However, it is highly desirable that functional elements like sensors, actuators or micro fluidic components to be fabricated on flexible substrates for a wide variety of applications. Due to the fact that flexible substrate is temperature sensitive, typically only low temperature materials, such as polymers, metals, and organic semiconductor materials, can be directly fabricated on flexible substrates. A novel technology based on XeF2(xenon difluoride) isotropic silicon etching and parylene conformal coating, which is able to monolithically incorporate high temperature materials and fluidic channels, was developed at Wayne State University. The technology was first implemented in the development of out-of-plane parylene microneedle arrays that can be individually addressed by integrated flexible micro-channels. These devices enable the delivery of chemicals with controlled temporal and spatial patterns and allow us to study neurotransmitter-based retinal prosthesis. The technology was further explored by adopting the conventional SOI-CMOS processes. High performance and high density CMOS circuits can be first fabricated on SOI wafers, and then be integrated into flexible substrates. Flexible p-channel MOSFETs (Metal-Oxide-Semiconductor Field-Effect-Transistors) were successfully integrated and tested. Integration of pressure sensors and flow sensors based on single crystal silicon has also been demonstrated. A novel smart yarn technology that enables the invisible integration of sensors and electronics into fabrics has been developed. The most significant advantage of this technology is its post-MEMS and post-CMOS compatibility. Various high

  12. Electronic Nose Technology to Measure Soil Microbial Activity and Classify Soil Metabolic Status

    OpenAIRE

    Fabrizio De Cesare; Elena Di Mattia; Simone Pantalei; Emiliano Zampetti; Vittorio Vinciguerra; Antonella Macagnano

    2011-01-01

    The electronic nose (E-nose) is a sensing technology that has been widely used to monitor environments in the last decade. In the present study, the capability of an E-nose, in combination with biochemical and microbiological techniques, of both detecting the microbial activity and estimating the metabolic status of soil ecosystems, was tested by measuring on one side respiration, enzyme activities and growth of bacteria in natural but simplified soil ecosystems over 23 days of incubation thr...

  13. Gender differences in technology acceptance in selected South African companies: Implications for electronic learning

    Directory of Open Access Journals (Sweden)

    Willie T. Chinyamurindi

    2010-11-01

    Research: The objective of this study was to investigate trainees’ acceptance of electronic coursework as an instruction and learning technique in various industries in the South African context. Motivation for the study: A persistent gender imbalance in the South African work-place has been noted to exist chiefly in the Science, Engineering and Technology (SET sectors, areas that have an important bearing on South Africa’s global competitiveness. This study explores how gender imbalance manifests in terms of trainee acceptance of electronic coursework. Research design, approach and method: A cross-sectional survey design was used. A survey was conducted amongst 191 employees in the SET sector. The measuring instrument used was the Technology Acceptance Instrument (TAI and included measures of Computer Self-Efficacy (CSE, Perceived Ease of Use (PEU, Perceived Usefulness (PU and Behavioural Intention to Use (BI. Main findings: Women ratings of the TAI to use the electronic coursework were slightly higher than men’s ratings. Multiple regression analyses were also carried out to measure the variation in the level of influence with gender as a predictor variable. The results showed that compared to women, men had a lower salient effect of elements of the TAI, notably, CSE–PU; PU–BI and BI–PEU. However, compared to men, women had a higher salient effect in terms of the relationship between CSE–PU and PU–PEU. Practical implications: The implication of the results is that interventions that focus on the human resources development of employees using electronic coursework (namely, CSE, PEU, PU and BI are worth considering as they influence the acceptance of the interventions. Contribution/value-add: The study contributes to existing knowledge about the conditions that precede employee acceptance of an electronic coursework intervention within the South African context. The study shows the important role dimensions of the Technology Acceptance Instrument

  14. Diverse Applications of Electronic-Nose Technologies in Agriculture and Forestry

    Science.gov (United States)

    Wilson, Alphus D.

    2013-01-01

    Electronic-nose (e-nose) instruments, derived from numerous types of aroma-sensor technologies, have been developed for a diversity of applications in the broad fields of agriculture and forestry. Recent advances in e-nose technologies within the plant sciences, including improvements in gas-sensor designs, innovations in data analysis and pattern-recognition algorithms, and progress in material science and systems integration methods, have led to significant benefits to both industries. Electronic noses have been used in a variety of commercial agricultural-related industries, including the agricultural sectors of agronomy, biochemical processing, botany, cell culture, plant cultivar selections, environmental monitoring, horticulture, pesticide detection, plant physiology and pathology. Applications in forestry include uses in chemotaxonomy, log tracking, wood and paper processing, forest management, forest health protection, and waste management. These aroma-detection applications have improved plant-based product attributes, quality, uniformity, and consistency in ways that have increased the efficiency and effectiveness of production and manufacturing processes. This paper provides a comprehensive review and summary of a broad range of electronic-nose technologies and applications, developed specifically for the agriculture and forestry industries over the past thirty years, which have offered solutions that have greatly improved worldwide agricultural and agroforestry production systems. PMID:23396191

  15. Diverse applications of electronic-nose technologies in agriculture and forestry.

    Science.gov (United States)

    Wilson, Alphus D

    2013-02-08

    Electronic-nose (e-nose) instruments, derived from numerous types of aroma-sensor technologies, have been developed for a diversity of applications in the broad fields of agriculture and forestry. Recent advances in e-nose technologies within the plant sciences, including improvements in gas-sensor designs, innovations in data analysis and pattern-recognition algorithms, and progress in material science and systems integration methods, have led to significant benefits to both industries. Electronic noses have been used in a variety of commercial agricultural-related industries, including the agricultural sectors of agronomy, biochemical processing, botany, cell culture, plant cultivar selections, environmental monitoring, horticulture, pesticide detection, plant physiology and pathology. Applications in forestry include uses in chemotaxonomy, log tracking, wood and paper processing, forest management, forest health protection, and waste management. These aroma-detection applications have improved plant-based product attributes, quality, uniformity, and consistency in ways that have increased the efficiency and effectiveness of production and manufacturing processes. This paper provides a comprehensive review and summary of a broad range of electronic-nose technologies and applications, developed specifically for the agriculture and forestry industries over the past thirty years, which have offered solutions that have greatly improved worldwide agricultural and agroforestry production systems.

  16. Advancing Partner Notification Through Electronic Communication Technology: A Review of Acceptability and Utilization Research.

    Science.gov (United States)

    Pellowski, Jennifer; Mathews, Catherine; Kalichman, Moira O; Dewing, Sarah; Lurie, Mark N; Kalichman, Seth C

    2016-06-01

    A cornerstone of sexually transmitted infection (STI) prevention is the identification, tracing, and notification of sex partners of index patients. Although partner notification reduces disease burden and prevents new infections as well as reinfections, studies show that only a limited number of partners are ever notified. Electronic communication technologies, namely, the Internet, text messaging, and phone calls (i.e., e-notification), have the potential to expand partner services. We conducted a systematic review of studies that have investigated the acceptability and utility of e-notification. We identified 23 studies that met the following criteria: (a) 9 studies presented data on the acceptability of technology-based communications for contacting sex partner(s), and (b) 14 studies reported on the utilization of communication technologies for partner notification. Studies found high levels of interest in and acceptability of e-notification; however, there was little evidence for actual use of e-notification. Taken together, results suggest that electronic communications could have their greatest impact in notifying less committed partners who would otherwise be uninformed of their STI exposure. In addition, all studies to date have been conducted in resource-rich countries, although the low cost of e-notification may have its greatest impact in resource-constrained settings. Research is needed to determine the best practices for exploiting the opportunities afforded by electronic communications for expanding STI partner services.

  17. Nanosecond pulse-width electron diode based on dielectric wall accelerator technology

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Quantang, E-mail: zhaoquantang@impcas.ac.cn [Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000 (China); University of Chinese Academy of Sciences, Beijing 100049 (China); Zhang, Z.M.; Yuan, P.; Cao, S.C.; Shen, X.K.; Jing, Y. [Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000 (China); Yu, C.S. [Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000 (China); University of Chinese Academy of Sciences, Beijing 100049 (China); Li, Z.P.; Liu, M.; Xiao, R.Q. [Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000 (China); Zong, Y.; Wang, Y.R. [Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000 (China); University of Chinese Academy of Sciences, Beijing 100049 (China); Zhao, H.W. [Institute of Modern Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

    2013-11-21

    An electron diode using a short section of dielectric wall accelerator (DWA) has been under development at the Institute of Modern Physics (IMP), Chinese Academy of Sciences. Tests have been carried out with spark gap switches triggered by lasers. The stack voltage efficiency of a four-layer of Blumleins reached about 60–70% with gas filled spark gap switching. The generated pulse voltage of peak amplitude of 23 kV and pulse width of 5 ns is used to extract and accelerate an electron beam of 320 mA, measured by a fast current transformer. A nanosecond pulse width electron diode was achieved successfully. Furthermore, the principle of a DWA is well proven and the development details and discussions are presented in this article. -- Highlights: •The key technology of DWA, including switches and pulse forming lines were studied. •The SiC PCSS obtained from Shanghai Institute were tested. •Two layers ZIP lines (new structure) and four layers Blumlein lines were studied with laser triggered spark gap switches. •A nanosecond pulse-width electron diode based on DWA technologies is achieved and studied experimentally. •The principle of DWA is also proved by the diode.

  18. Electron beam processing technology for modification of different types of cellulose pulps for production of derivatives

    International Nuclear Information System (INIS)

    Iller, E.; Kukielka, A.; Mikolajczyk, W.; Starostka, P.; Stupinska, H.

    2002-01-01

    Institute of Nuclear Chemistry and Technology, Pulp and Paper Research Institute and Institute of Chemical Fibers carry out a joint research project in order to develop the radiation methods modification of cellulose pulps for production of cellulose derivatives such as carbamate (CC), carboxymethyl cellulose (CMC) and methylcellulose (MC). Three different types of textile pulps: Alicell (A); Borregaard (B), Ketchikan (K) and Kraft softwood (PSS) and hardwood (PSB) pulps have been irradiated with 10 MeV electron beam from LAE 13/9 linear accelerator with doses of 5, 10, 15, 20, 25 and 50 kGy. After electron beam treatment the samples of cellulose pulps have been examined by using of structural and physico-chemical methods. Electron paramagnetic resonance spectroscopy (EPR), gel permeation chromatography (GPC) and infrared spectroscopy (IRS) were applied for determination of structural changes in irradiated cellulose pulps. By means of analytical methods, such parameters as: viscosity, average degree of polymerization (DP) and α-cellulose contents were evaluated. Based on EPR and GPC investigations the relationship between concentrations of free radicals and decreasing polymerization degrees in electron beam treatment pulps has been confirmed. The carboxymethylcellulose, methylcellulose and cellulose carbamate were prepared using the raw material of radiation modified pulps. Positive results of investigations will allow for determination of optimum conditions for electron beam modification of selected cellulose paper and textile pulps. Such procedure leads to limit the amounts of chemical activators used in methods for preparation cellulose derivatives. The proposed electron beam technology is new approaches in technical solution and economic of process of cellulose derivatives preparation. (author)

  19. Radiation effects evaluation for electrons sheaf in packages resistance in a Lasioderma serricorne, Plodia interpunctella and Sitophilus zeamais; Avaliacao dos efeitos da radiacao por feixe de eletrons na resistencia de embalagens a Lasioderma serricorne, Plodia interpunctella e Sitophilus zeamais

    Energy Technology Data Exchange (ETDEWEB)

    Alves, Juliana Nazare

    2011-07-01

    The plagues of stored products consist of a man problem, depreciating products and causing economical damages. Among these curses we have Lasioderma serricorne (F. 1792), Sitophilus zeamais (M. 1855) and Plodia interpunctella (H. 1813) known by infesting stored products as: grains, brans, flours, coffee, tobacco, dried fruits and spices. These curses perforate and penetrate the packages, ovipositing over the substratum. In this context the package plays a fundamental part, preventing the contact and curses' proliferation in the packed product. So, to protect the packed product and to prolong its shelf life, the package should have good mechanical resistance to tension and perforation, good sealing, good barrier properties and should not transfer odors nor strange flavors to the packed product. The ionizing radiation can cause structural changes in polymer packages, these changes are caused by the scission processes and reticulation of the polymers chains. These are concurrent processes and the predominance of one over the other depends on the chemical structure of the polymer, the irradiation conditions and specific factors of the material that will absorb the energy. This work had the objective to evaluate the changes in mechanical properties of package structures used to store granola, cereal bar and pasta, as well as its resistance to perforation by L. serricorne, P. interpunctella and S. zeamais, when submitted to electrons sheaf radiation. In this methodology were used five structures of commercially utilized packages to store granola, cereal bar and pasta composed by (Polypropylene bi-oriented metallic/Polypropylene bi-oriented coextruded - BOPPmet/BOPP 50 {mu}m), (Polypropylene bi-oriented/Polypropylene - BOPP/PP 50 {mu}m), Poli (ethylene terephthalate) metallic/Polypropylene bi-oriented coextruded - PETmet/BOPP 32 {mu}m), Poli (ethylene terephthalate) /Polypropylene - PET/PP1 72 {mu}m), Poli (ethylene terephthalate)/Polypropylene - PET/PP2 32 {mu

  20. Nanofabrication Technology for Production of Quantum Nano-Electronic Devices Integrating Niobium Electrodes and Optically Transparent Gates

    Science.gov (United States)

    2018-01-01

    TECHNICAL REPORT 3086 January 2018 Nanofabrication Technology for Production of Quantum Nano-electronic Devices Integrating Niobium Electrodes...work described in this report was performed for the by the Advanced Concepts and Applied Research Branch (Code 71730) and the Science and Technology ...Applied Sciences Division iii EXECUTIVE SUMMARY This technical report demonstrates nanofabrication technology for Niobium heterostructures and