Functional Requirements for an Electronic Work Package System

Energy Technology Data Exchange (ETDEWEB)

Oxstrand, Johanna H. [Idaho National Lab. (INL), Idaho Falls, ID (United States)

2016-12-01

This document provides a set of high level functional requirements for a generic electronic work package (eWP) system. The requirements have been identified by the U.S. nuclear industry as a part of the Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative. The functional requirements are mainly applied to eWP system supporting Basic and Moderate types of smart documents, i.e., documents that have fields for recording input such as text, dates, numbers, and equipment status, and documents which incorporate additional functionalities such as form field data “type“ validation (e.g. date, text, number, and signature) of data entered and/or self-populate basic document information (usually from existing host application meta data) on the form when the user first opens it. All the requirements are categorized by the roles; Planner, Supervisor, Craft, Work Package Approval Reviewer, Operations, Scheduling/Work Control, and Supporting Functions. The categories Statistics, Records, Information Technology are also included used to group the requirements. All requirements are presented in Section 2 through Section 11. Examples of more detailed requirements are provided for the majority of high level requirements. These examples are meant as an inspiration to be used as each utility goes through the process of identifying their specific requirements. The report’s table of contents provides a summary of the high level requirements.

Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

Science.gov (United States)

Ghaffarian, Reza; Evans, John W.

2014-01-01

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

Diamond-based heat spreaders for power electronic packaging applications

Science.gov (United States)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging

Electronic packaging: new results in singulation by Laser Microjet

Science.gov (United States)

Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

2004-07-01

Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Science.gov (United States)

Sampson, Michael J.

2010-01-01

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

2016 China Academic Conference on Printing, Packaging Engineering & Media Technology

CERN Document Server

Ouyang, Yun; Xu, Min; Yang, Li; Ouyang, Yujie

2017-01-01

This book includes a selection of reviewed papers presented at the 2016 China Academic Conference on Printing, Packaging Engineering & Media Technology, held on November 25-27, 2016 in Xi’an, China. The conference was jointly organized by China Academy of Printing Technology, Xi’an University of Technology and Stuttgart Media University of Germany. The proceedings cover the recent outcomes on color science and technology, image processing technology, digital media technology, digital process management technology in packaging and packaging etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, material science, computer science, digital media and network technology fields.

Anticounterfeit packaging technologies

Directory of Open Access Journals (Sweden)

Ruchir Y Shah

2010-01-01

Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

System issues for multichip packaging

Science.gov (United States)

Sage, Maurice G.; Hartley, Neil

1991-04-01

It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2015-01-01

This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

Wafer-level vacuum/hermetic packaging technologies for MEMS

Science.gov (United States)

Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

2010-02-01

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

Application of electron irradiation to food containers and packaging materials

International Nuclear Information System (INIS)

Ueno, Koji

2010-01-01

Problems caused by microbial contamination and hazardous chemicals have attracted much attention in the food industry. The number of systems such as hygienic management systems and Hazard Analysis Critical Control Point (HACCP) systems adopted in the manufacturing process is increasing. As manufacturing process control has become stricter, stricter control is also required for microbial control for containers and packaging materials (from disinfection to sterilization). Since safe and reliable methods for sterilizing food containers and packaging materials that leave no residue are required, electron beam sterilization used for medical equipment has attracted attention from the food industry. This paper describes an electron irradiation facility, methods for applying electron beams to food containers and packaging materials, and products irradiated with electron beams. (author)

Advanced flip chip packaging

CERN Document Server

Lai, Yi-Shao; Wong, CP

2013-01-01

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

Decontamination of food packaging using electron beam--status and prospects

Energy Technology Data Exchange (ETDEWEB)

Mittendorfer, J. E-mail: htcmitt@eunet.at; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E

2002-03-01

In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

Decontamination of food packaging using electron beam—status and prospects

Science.gov (United States)

Mittendorfer, J.; Bierbaumer, H. P.; Gratzl, F.; Kellauer, E.

2002-03-01

In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

Decontamination of food packaging using electron beam--status and prospects

International Nuclear Information System (INIS)

Mittendorfer, J.; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E.

2002-01-01

In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding

Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

KAUST Repository

Sevilla, Galo T.; Cordero, Marlon D.; Nassar, Joanna M.; Hanna, Amir; Kutbee, Arwa T.; Carreno, Armando Arpys Arevalo; Hussain, Muhammad Mustafa

2016-01-01

High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

KAUST Repository

Sevilla, Galo T.

2016-10-14

High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

Science.gov (United States)

Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

2012-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

RF and microwave microelectronics packaging II

CERN Document Server

Sturdivant, Rick

2017-01-01

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

Electronic technology

International Nuclear Information System (INIS)

Kim, Jin Su

2010-07-01

This book is composed of five chapters, which introduces electronic technology about understanding of electronic, electronic component, radio, electronic application, communication technology, semiconductor on its basic, free electron and hole, intrinsic semiconductor and semiconductor element, Diode such as PN junction diode, characteristic of junction diode, rectifier circuit and smoothing circuit, transistor on structure of transistor, characteristic of transistor and common emitter circuit, electronic application about electronic equipment, communication technology and education, robot technology and high electronic technology.

Development in Electronic Packaging – Moving to 3D System Configuration

Directory of Open Access Journals (Sweden)

I. Szendiuch

2011-04-01

Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

Radiation disinfestation of used packagings: irradiation trials with electron beams

International Nuclear Information System (INIS)

Ignatowicz, S.; Zaedee, I.

1994-01-01

Used bags, sacks and other packagings are often infested with insects and mites - pest of stored products. Such packagings provide a source of infestation of a new lot or unit of agricultural products. Cleaning of repeatedly used packages is the most important preventive method. After using, the bags and sacks should be carefully beaten with a mechanical or hand beater. When pests are found, the packages should be disinfested with hot air or hot water. Larger numbers of bags are usually fumigated in a special fumigation chamber. Disinfestation by radiation processing is potentially a feasible substitute for chemical fumigation. In the present paper trials of radiation disinfestation of used bags are described and discussed. Information about using electron beams for pest disinfestation of jute and polyvinyl chloride bags (plastic bags) is provided. The absorbed dose is the most important irradiation process parameter. The lethal effects equivalent to chemical insecticides are obtained by high doses of ionizing radiation. Control of insect and/or mite infestation of the repeatedly used packagings may be secured by ionizing radiation applied at 2-3 kGy. These doses result in complete mortality of stored product pests within a few days. The radiation must penetrate deeply into the target product at sufficient level. Gamma rays and X-rays penetrate into the treated products easily but electron radiation penetrating is much lower, depending on electron energy applied. The results of this study indicate that bags made of polyvinyl chloride may be disinfested with electron beams when are created as separate units or batches up to 50 bags. Penetrability of jute bags is lower than the plastic bags. Therefore the jute bags should be irradiated with electrons as batches containing no more than 30 bags. (author)

Advanced materials for thermal management of electronic packaging

CERN Document Server

Tong, Xingcun Colin

2011-01-01

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility

Recent trends and future of pharmaceutical packaging technology

Directory of Open Access Journals (Sweden)

Nityanand Zadbuke

2013-01-01

Full Text Available The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

Recent trends and future of pharmaceutical packaging technology.

Science.gov (United States)

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-04-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

Recent trends and future of pharmaceutical packaging technology

Science.gov (United States)

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-01-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

International Collaboration in Packaging Education: Hands-on System-on-Package (SOP) Graduate Level Courses at Indian Institute of Science and Georgia Tech PRC

OpenAIRE

Varadarajan, Mahesh; Bhattacharya, Swapan; Doraiswami, Ravi; Rao, Ananda G; Rao, NJ; May, Gary; Conrad, Leyla; Tummala, Rao

2005-01-01

System-on-Package (SOP) continues to revolutionize the realization of convergent systems in microelectronics packaging. The SOP concept which began at the Packaging Research Center (PRC) at Georgia Tech has benefited its international collaborative partners in education including the Indian Institute of Science (IISc). The academic program for electronics packaging currently in the Centre for Electronics Design and Technology (CEDT) at IISc is aimed at educating a new breed of globally-compet...

NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

Science.gov (United States)

Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

Electron-processing technology: A promising application for the viscose industry

Science.gov (United States)

Stepanik, T. M.; Rajagopal, S.; Ewing, D.; Whitehouse, R.

1998-06-01

In marketing its IMPELA ® line of high power, high-throughput industrial accelerators, Atomic Energy of Canada Limited (AECL) is working with viscose (rayon) companies world-wide to integrate electron-processing technology as part of the viscose manufacturing process. The viscose industry converts cellulose wood pulp into products such as staple fiber, filament, cord, film, packaging, and non-edible sausage casings. This multibillion dollar industry is currently suffering from high production costs, and is facing increasingly stringent environmental regulations. The use of electron-treated pulp can significantly lower production costs and can provide equally significant environmental benefits. This paper describes our current understanding of the benefits of using electron-treated pulp in this process, and AECL's efforts in developing this technology.

Package Technology for Manufacture of Caprolactam Developed by SINOPEC Commands Internationally Leading Position

Institute of Scientific and Technical Information of China (English)

无

2008-01-01

@@ In October one of SINOPEC's ten core projects to be tackled- "Development of package technology for the 140kt/a caprolactam unit" had passed the technical appraisal organized by the SINOPEC Group.This package technology integrates new techniques relating to the production of cyclohexanone via oxidation of ethylene oxide,the production of cyclohexanone-oxime through ammoximation of cyclohexanone,the triple rearrangement of cyclohexanoneoxime,and the purification ofcaprolactam.The overall package technology has reached the internationally advanced level with independent intellectual property rights,and has filed or has been granted a lot of Chinese and overseas patents.This package technology has been successfully adopted in commercial scale at the Baling Petrochemical Company.

Materials for advanced packaging

CERN Document Server

Wong, CP

2017-01-01

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

Science.gov (United States)

Kolacz, John S.; Clapper, Randy S.; Wade, Raymond P.

2006-01-01

The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

A QR code identification technology in package auto-sorting system

Science.gov (United States)

di, Yi-Juan; Shi, Jian-Ping; Mao, Guo-Yong

2017-07-01

Traditional manual sorting operation is not suitable for the development of Chinese logistics. For better sorting packages, a QR code recognition technology is proposed to identify the QR code label on the packages in package auto-sorting system. The experimental results compared with other algorithms in literatures demonstrate that the proposed method is valid and its performance is superior to other algorithms.

Development of utility generic functional requirements for electronic work packages and computer-based procedures

Energy Technology Data Exchange (ETDEWEB)

Oxstrand, Johanna [Idaho National Lab. (INL), Idaho Falls, ID (United States)

2017-06-01

The Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative is a step toward a vision of implementing an eWP framework that includes many types of eWPs. This will enable immediate paper-related cost savings in work management and provide a path to future labor efficiency gains through enhanced integration and process improvement in support of the Nuclear Promise (Nuclear Energy Institute 2016). The NEWPER initiative was organized by the Nuclear Information Technology Strategic Leadership (NITSL) group, which is an organization that brings together leaders from the nuclear utility industry and regulatory agencies to address issues involved with information technology used in nuclear-power utilities. NITSL strives to maintain awareness of industry information technology-related initiatives and events and communicates those events to its membership. NITSL and LWRS Program researchers have been coordinating activities, including joint organization of NEWPER-related meetings and report development. The main goal of the NEWPER initiative was to develop a set of utility generic functional requirements for eWP systems. This set of requirements will support each utility in their process of identifying plant-specific functional and non-functional requirements. The NEWPER initiative has 140 members where the largest group of members consists of 19 commercial U.S. nuclear utilities and eleven of the most prominent vendors of eWP solutions. Through the NEWPER initiative two sets of functional requirements were developed; functional requirements for electronic work packages and functional requirements for computer-based procedures. This paper will describe the development process as well as a summary of the requirements.

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

Technology station in electronics at the Tshwane University of Technology: strengthening technological innovation activities amongst SMEs and students

CSIR Research Space (South Africa)

Jacobs, SJ

2009-01-01

Full Text Available that technology and science are closely intertwined (Gibbons et a/., 1994). Thus in this mode of the production of knowledge, innovation is often a process of moving back and forth between invention and/or design, development and testing, redesign... through-hole components and Component identification hardware, surface-mount components, surface-mount IC chip components, Metal Electrode Faces (MELFs), Small Outline Transistors (SOTs) and Discrete Packaging (DPAK). Handling in electronics assembly...

Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

Science.gov (United States)

Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

2012-01-01

Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

Energy Technology Data Exchange (ETDEWEB)

Kuper, Cameron Mathias [Univ. of New Mexico, Albuquerque, NM (United States)

2015-12-10

The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

Future Perspective : Design Process of Perfume Packaging

OpenAIRE

Anderson, Duncan

2016-01-01

In a world where technology develops at a rapid speed a packaging designer should have the ability to adapt to the challenges in a world where the packaging landscape might look far more different from today. This thesis will look at possible future scenarios relating to resources, infrastructure and consumer behaviour in the year 2050. It will then go on to discuss the emergence of new packaging materials pitted to replace plastic, as well as take a look at printed electronics in packaging a...

Practical Packaging Technology for Microfluidic Systems

International Nuclear Information System (INIS)

Lee, Hwan Yong; Han, Song I; Han, Ki Ho

2010-01-01

This paper presents the technology for the design, fabrication, and characterization of a microfluidic system interface (MSI): the purpose of this technology is to enable the integration of complex microfluidic systems. The MSI technology can be applied in a simple manner for realizing complex arrangements of microfluidic interconnects, integrated microvalves for fluid control, and optical windows for on-chip optical processes. A microfluidic system for the preparation of genetic samples was used as the test vehicle to prove the effectiveness of the MSI technology for packaging complex microfluidic systems with multiple functionalities. The miniaturized genetic sample preparation system comprised several functional compartments, including compartments for cell purification, cell separation, cell lysis, solid-phase DNA extraction, polymerase chain reaction, and capillary electrophoresis. Additionally, the functional operation of the solid-phase extraction and PCR thermocycling compartments was demonstrated by using the MSI

Technology transfer package on seismic base isolation - Volume III

Energy Technology Data Exchange (ETDEWEB)

NONE

1995-02-14

This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume III contains supporting materials not included in Volumes I and II.

Japan's technology and manufacturing infrastructure

Science.gov (United States)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Decal electronics for printed high performance cmos electronic systems

KAUST Repository

Hussain, Muhammad Mustafa

2017-11-23

High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

A computer code package for electron transport Monte Carlo simulation

International Nuclear Information System (INIS)

Popescu, Lucretiu M.

1999-01-01

A computer code package was developed for solving various electron transport problems by Monte Carlo simulation. It is based on condensed history Monte Carlo algorithm. In order to get reliable results over wide ranges of electron energies and target atomic numbers, specific techniques of electron transport were implemented such as: Moliere multiscatter angular distributions, Blunck-Leisegang multiscatter energy distribution, sampling of electron-electron and Bremsstrahlung individual interactions. Path-length and lateral displacement corrections algorithms and the module for computing collision, radiative and total restricted stopping powers and ranges of electrons are also included. Comparisons of simulation results with experimental measurements are finally presented. (author)

Technology transfer package on seismic base isolation - Volume II

Energy Technology Data Exchange (ETDEWEB)

NONE

1995-02-14

This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume II contains the proceedings for the Short Course on Seismic Base Isolation held in Berkeley, California, August 10-14, 1992.

Sustainable packaging design for consumer electronics products: Balancing marketing, logistics and environmental requirements

OpenAIRE

Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

2007-01-01

Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of sophistication of data concerning a packagings marketing performance is limited, decisions are often strongly based on beliefs. This is reflected in inconsistencies in packaging that is currently in...

A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages

International Nuclear Information System (INIS)

Kay, N.R.; Ghosh, S.; Guven, I.; Madenci, E.

2006-01-01

This study concerns the development of a combined experimental and analytical technique to determine the critical values of fracture parameters for interfaces between dissimilar materials in electronic packages. This technique utilizes specimens from post-production electronic packages. The mechanical testing is performed inside a scanning electron microscope while the measurements are achieved by means of digital image correlation. The measured displacements around the crack tip are used as the boundary conditions for the analytical model to compute the energy release rate. The critical energy release rate values obtained from post-production package specimens are obtained to be lower than those laboratory specimens

Test facilities for radioactive material transport packages (AEA Technology, Winfrith, UK)

International Nuclear Information System (INIS)

Burgess, M.H.

1991-01-01

Transport packages for radioactive materials are tested to demonstrate compliance with national and international regulations. The involvement of AEA Technology is traced from the establishment of the early IAEA Regulations. Transport package design, testing, assessment and approval requires a wide variety of skills and facilities. The comprehensive capability of AEA Technology in these areas is described with references to practical experience in the form of a short bibliography. The facilities described include drop-test cranes and targets (up to 700te); air guns for impacts up to sonic velocities; pool fires, furnaces and rigs for thermal tests including heat dissipation on prototype flasks; shielding facilities and instruments; criticality simulations and leak test instruments. These are illustrated with photographs demonstrating the comprehensive nature of package testing services supplied to customers. (author)

AlN 3D Thermal Packaging, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — This proposal addresses the need for compact, lightweight packaging to cool high heat producing electronics. Technology Assessment & Transfer, Inc. (TA&T)...

Pilot Project Technology Business Case: Mobile Work Packages

Energy Technology Data Exchange (ETDEWEB)

Thomas, Ken [Idaho National Lab. (INL), Idaho Falls, ID (United States); Lawrie, Sean [ScottMadden, Inc., Raleigh, NC (United States); Niedermuller, Josef [ScottMadden, Inc., Raleigh, NC (United States)

2015-05-01

Performance advantages of the new pilot project technologies are widely acknowledged, but it has proven difficult for utilities to derive business cases for justifying investment in these new capabilities. Lack of a business case is often cited by utilities as a barrier to pursuing wide-scale application of digital technologies to nuclear plant work activities. The decision to move forward with funding usually hinges on demonstrating actual cost reductions that can be credited to budgets and thereby truly reduce O&M or capital costs. Technology enhancements, while enhancing work methods and making work more efficient, often fail to eliminate workload such that it changes overall staffing and material cost requirements. It is critical to demonstrate cost reductions or impacts on non-cost performance objectives in order for the business case to justify investment by nuclear operators. The Business Case Methodology (BCM) was developed in September of 2015 to frame the benefit side of II&C technologies to address the “benefit” side of the analysis—as opposed to the cost side—and how the organization evaluates discretionary projects (net present value (NPV), accounting effects of taxes, discount rates, etc.). The cost and analysis side is not particularly difficult for the organization and can usually be determined with a fair amount of precision (not withstanding implementation project cost overruns). It is in determining the “benefits” side of the analysis that utilities have more difficulty in technology projects and that is the focus of this methodology. The methodology is presented in the context of the entire process, but the tool provided is limited to determining the organizational benefits only. This report describes a the use of the BCM in building a business case for mobile work packages, which includes computer-based procedures and other automated elements of a work package. Key to those impacts will be identifying where the savings are �

MEMS packaging: state of the art and future trends

Science.gov (United States)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

Interferometry for the LISA technology package LTP: an update

International Nuclear Information System (INIS)

Heinzel, G; Bogenstahl, J; Braxmaier, C; Danzmann, K; Garcia, A; Guzman, F; Hough, J; Hoyland, D; Jennrich, O; Killow, C; Robertson, D; Sodnik, Z; Steier, F; Ward, H; Wand, V

2006-01-01

This paper gives an update on the status of the LISA technology package (LTP) which is to be launched in 2009 by ESA as a technology demonstration mission for the spaceborne gravitational wave observatory LISA. The dominant noise source in the interferometer prototype has been investigated and improved such that it is now comfortably below its budget at all frequencies

Technology transfer package on seismic base isolation - Volume I

Energy Technology Data Exchange (ETDEWEB)

NONE

1995-02-14

This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume I contains the proceedings of the Workshop on Seismic Base Isolation for Department of Energy Facilities held in Marina Del Rey, California, May 13-15, 1992.

Low-Cost and Low-Temperature Integration Methods for System-in-Package

NARCIS (Netherlands)

Palacios Aguilera, N.B.

2013-01-01

Packaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different

Image Fusion Technologies In Commercial Remote Sensing Packages

OpenAIRE

Al-Wassai, Firouz Abdullah; Kalyankar, N. V.

2013-01-01

Several remote sensing software packages are used to the explicit purpose of analyzing and visualizing remotely sensed data, with the developing of remote sensing sensor technologies from last ten years. Accord-ing to literature, the remote sensing is still the lack of software tools for effective information extraction from remote sensing data. So, this paper provides a state-of-art of multi-sensor image fusion technologies as well as review on the quality evaluation of the single image or f...

RF and microwave integrated circuit development technology, packaging and testing

CERN Document Server

Gamand, Patrice; Kelma, Christophe

2018-01-01

RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development. In addition, the authors provide practical answers and solutions regarding the choice of technology, the packaging solutions and the effects on the performance on the circuit and to the industrial testing strategy. It will also discuss future trends and challenges and includes case studies to illustrate examples. * Offers an overview of the challenges in RF/microwave product design * Provides practical answers to packaging issues and evaluates its effect on the performance of the circuit * Includes industrial testing strategies * Examines relevant RF MIC technologies and the factors which affect the choice of technology for a particular application, e.g. technical performance and cost * Discusses future trends and challen...

Microelectronic packaging

CERN Document Server

Datta, M; Schultze, J Walter

2004-01-01

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

Sensors and packages based on LTCC and thick-film technology for ...

Indian Academy of Sciences (India)

Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a ...

The use of modified packaging in the technology of butter

Directory of Open Access Journals (Sweden)

L. V. Golubeva

2017-01-01

Full Text Available Improving the food industry has led to a significant increase in the role of packaging in food production. At present, so-called "active packings" have appeared that have a positive effect on the product in contact with it, including through the use of antimicrobial additives. Work has been carried out on the use of a water-soluble form of chitosan in the technological process for the production of creamy butter "Krestyanskoe". The sample of chitosan was dissolved in drinking water with ascorbic acid (mass fraction 1%. The resulting chitosan solution was applied to the packaging material-aluminum laminated foil. Packaging is considered suitable for use after complete evaporation of moisture at room temperature from the surface of the material. The process of obtaining butter cream was carried out according to a conventional technological scheme by converting high-fat cream. It is determined that butter "Peasant" with chitosan is microbiologically more resistant than the control sample. The effect of the mass fraction of chitosan in the inner layer of the packaging material on the contacting product was experimentally established. It is established that the developed modified package allows to reduce the number of pathogens on the oil surface. In the course of storage, the control samples before the experimental ones showed the first signs of spoilage: an acidic unpleasant smell appeared and an aftertaste that sharply increased by the end of the storage period. The results of determining the organoleptic properties of the products correlated with physicochemical and microbiological indices. On the surface of the oil of the control samples, a more active development of yeast and mold fungi was observed. It is determined that the use of chitosan solution inhibits the development of mold fungi and yeast. The possibility of increasing the shelf life of butter "Peasant" in modified packaging by an average of 30% is proved.

DEEP DRAWING TECHNOLOGY WITH WALL IRONING IN MASS PACKAGING INDUSTRY

Directory of Open Access Journals (Sweden)

Saša Ranđelović

2017-04-01

Full Text Available Aluminum is a metal that is being increasingly used in the packaging industry in the modern metal forming technology, but it also provides a good opportunity for effective advertising and product promotion. Processing technologies for aluminum plastic deformation ensure superior packaging that meets the most rigorous demands in the food, pharmaceutical, chemical, and other industries. It is the case of mass production with very little material loss that offers the possibility of multiple recycling. On the other hand, today's products for general purpose consumers cannot be imagined without aggressive advertising that has a major impact on customers. Modern graphics techniques for printing images and different basic surfaces offer great opportunities that manufacturers use widely in the promotion and sale of their products.

Radiation treatment for sterilization of packaging materials

International Nuclear Information System (INIS)

Haji-Saeid, Mohammad; Sampa, Maria Helena O.; Chmielewski, Andrzej G.

2007-01-01

Treatment with gamma and electron radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in the aseptic processing of foods and pharmaceuticals. The effect of irradiation on these materials is crucial for packaging engineering to understand the effects of these new treatments. Packaging material may be irradiated either prior to or after filling. The irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceutical, and medical device industries in the United States, Europe, and Canada. Radiation effects on packaging material properties still need further investigation. This paper summarizes the work done by different groups and discusses recent developments in regulations and testing procedures in the field of packaging technology

Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology

International Nuclear Information System (INIS)

Wang, Jiachou; Li, Xinxin

2013-01-01

An on-chip integrated packaging-stress-suppressed suspension (PS 3 ) technology for a packaging-stress-free pressure sensor is proposed and developed. With a MIS (microholes interetch and sealing) micromachining process implemented only from the front-side of a single-side polished (1 1 1) silicon wafer, a compact cantilever-shaped PS 3 is on-chip integrated surrounding a piezoresistive pressure-sensing structure to provide a packaging-process/substrate-friendly method for low-cost but high-performance sensor applications. With the MIS process, the chip size of the PS 3 -enclosed pressure sensor is as small as 0.8 mm × 0.8 mm. Compared with a normal pressure sensor without PS 3 (but with an identical pressure-sensing structure), the proposed pressure sensor has the same sensitivity of 0.046 mV kPa −1 (3.3 V) −1 . However, without using the thermal compensation technique, a temperature coefficient of offset of only 0.016% °C −1 FS is noted for the sensor with PS 3 , which is about 15 times better than that for the sensor without PS 3 . Featuring effective isolation and elimination of the influence from packaging stress, the PS 3 technique is promising to be widely used for packaging-friendly mechanical sensors. (paper)

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

Science.gov (United States)

Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

2011-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

Polymer dispensing and embossing technology for the lens type LED packaging

Science.gov (United States)

Chien, Chien-Lin Chang; Huang, Yu-Che; Hu, Syue-Fong; Chang, Chung-Min; Yip, Ming-Chuen; Fang, Weileun

2013-06-01

This study presents a ring-type micro-structure design on the substrate and its corresponding micro fabrication processes for a lens-type light-emitting diode (LED) package. The dome-type or crater-type silicone lenses are achieved by a dispensing and embossing process rather than a molding process. Silicone with a high viscosity and thixotropy index is used as the encapsulant material. The ring-type micro structure is adopted to confine the dispensed silicone encapsulant so as to form the packaged lens. With the architecture and process described, this LED package technology herein has three merits: (1) the flexibility of lens-type LED package designs is enhanced; (2) a dome-type package design is used to enhance the intensity; (3) a crater-type package design is used to enhance the view angle. Measurement results show the ratio between the lens height and lens radius can vary from 0.4 to 1 by changing the volume of dispensed silicone. The view angles of dome-type and crater-type packages can reach 155° ± 5° and 175° ± 5°, respectively. As compared with the commercial plastic leaded chip carrier-type package, the luminous flux of a monochromatic blue light LED is improved by 15% by the dome-type package (improved by 7% by the crater-type package) and the luminous flux of a white light LED is improved by 25% by the dome-type package (improved by 13% by the crater-type package). The luminous flux of monochromatic blue light LED and white light LED are respectively improved by 8% and 12% by the dome-type package as compare with the crater-type package.

The Packaging Technology Study on Smart Composite Structure Based on The Embedded FBG Sensor

Science.gov (United States)

Zhang, Youhong; Chang, Xinlong; Zhang, Xiaojun; He, Xiangyong

2018-03-01

It is convenient to carry out the health monitoring of the solid rocket engine composite shell based on the embedded FBG sensor. In this paper, the packaging technology using one-way fiber layer of prepreg fiberglass/epoxy resin was proposed. The proposed packaging process is simple, and the packaged sensor structure size is flexible and convenient to use, at the mean time, the packaged structure has little effect on the pristine composite material structure.

Meat quality assessment by electronic nose (machine olfaction technology).

Science.gov (United States)

Ghasemi-Varnamkhasti, Mahdi; Mohtasebi, Seyed Saeid; Siadat, Maryam; Balasubramanian, Sundar

2009-01-01

Over the last twenty years, newly developed chemical sensor systems (so called "electronic noses") have made odor analyses possible. These systems involve various types of electronic chemical gas sensors with partial specificity, as well as suitable statistical methods enabling the recognition of complex odors. As commercial instruments have become available, a substantial increase in research into the application of electronic noses in the evaluation of volatile compounds in food, cosmetic and other items of everyday life is observed. At present, the commercial gas sensor technologies comprise metal oxide semiconductors, metal oxide semiconductor field effect transistors, organic conducting polymers, and piezoelectric crystal sensors. Further sensors based on fibreoptic, electrochemical and bi-metal principles are still in the developmental stage. Statistical analysis techniques range from simple graphical evaluation to multivariate analysis such as artificial neural network and radial basis function. The introduction of electronic noses into the area of food is envisaged for quality control, process monitoring, freshness evaluation, shelf-life investigation and authenticity assessment. Considerable work has already been carried out on meat, grains, coffee, mushrooms, cheese, sugar, fish, beer and other beverages, as well as on the odor quality evaluation of food packaging material. This paper describes the applications of these systems for meat quality assessment, where fast detection methods are essential for appropriate product management. The results suggest the possibility of using this new technology in meat handling.

[Evaluation and selection of VOCs treatment technologies in packaging and printing industry].

Science.gov (United States)

Wang, Hai-Lin; Wang, Jun-Hui; Zhu, Chun-Lei; Nie, Lei; Hao, Zheng-Ping

2014-07-01

Volatile organic compounds (VOCs) play an important role in urban air pollution. Activities of industries including the packaging and printing industries are regarded as the major sources. How to select the suitable treating techniques is the major problem for emission control. In this article, based on the VOCs emission characteristics of the packaging and printing industry and the existing treatment technologies, using the analytic hierarchy process (AHP) model, an evaluation system for VOCs selection was established and all the technologies used for treatment were assessed. It showed that the priority selection was in the following order: Carbon Fiber Adsorption-Desorption > Granular Carbon Adsorption-Desorption > Thermal Combustion > Regenerative Combustion > Catalytic combustion > Rotary adsorption-concentration and combustion > Granular Carbon adsorption-concentration and combustion. Carbon Fiber Adsorption-Desorption was selected as the best available technology due to its highest weight among those technologies.

MEMS packaging

CERN Document Server

Hsu , Tai-Ran

2004-01-01

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

Carbon Nano tube Composites for Electronic Packaging Applications: A Review

International Nuclear Information System (INIS)

Aryasomayajula, L.; Wolter, K.J.

2013-01-01

Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nano tubes has opened new possibilities to face challenges better. Carbon Nano tubes are known for their high mechanical strength, excellent thermal and electrical properties. Recent research has made progress in fabricating carbon nano tube metal matrix and polymer-based composites. The methods of fabrication of these composites, their properties and possible applications restricted to the field of electronic packaging have been discussed in this paper. Experimental and theoretical calculations have shown improved mechanical and physical properties like tensile stress, toughness, and improved electrical and thermal properties. They have also demonstrated the ease of production of the composites and their adaptability as one can tailor their properties as per the requirement. This paper reviews work reported on fabricating and characterizing carbon- nano tube-based metal matrix and polymer composites. The focus of this paper is mainly to review the importance of these composites in the field of electronics packaging.

Technological challenges of addressing new and more complex migrating products from novel food packaging materials.

Science.gov (United States)

Munro, Ian C; Haighton, Lois A; Lynch, Barry S; Tafazoli, Shahrzad

2009-12-01

The risk assessment of migration products resulting from packaging material has and continues to pose a difficult challenge. In most jurisdictions, there are regulatory requirements for the approval or notification of food contact substances that will be used in packaging. These processes generally require risk assessment to ensure safety concerns are addressed. The science of assessing food contact materials was instrumental in the development of the concept of Threshold of Regulation and the Threshold of Toxicological Concern procedures. While the risk assessment process is in place, the technology of food packaging continues to evolve to include new initiatives, such as the inclusion of antimicrobial substances or enzyme systems to prevent spoilage, use of plastic packaging intended to remain on foods as they are being cooked, to the introduction of more rigid, stable and reusable materials, and active packaging to extend the shelf-life of food. Each new technology brings with it the potential for exposure to new and possibly novel substances as a result of migration, interaction with other chemical packaging components, or, in the case of plastics now used in direct cooking of products, degradation products formed during heating. Furthermore, the presence of trace levels of certain chemicals from packaging that were once accepted as being of low risk based on traditional toxicology studies are being challenged on the basis of reports of adverse effects, particularly with respect to endocrine disruption, alleged to occur at very low doses. A recent example is the case of bisphenol A. The way forward to assess new packaging technologies and reports of very low dose effects in non-standard studies of food contact substances is likely to remain controversial. However, the risk assessment paradigm is sufficiently robust and flexible to be adapted to meet these challenges. The use of the Threshold of Regulation and the Threshold of Toxicological Concern concepts may

A multimedia package for particle technology

International Nuclear Information System (INIS)

Mathers, B.; Rhodes, M.; Iveson, S.

2002-01-01

A CD-ROM-based package is being prepared for Particle Technology education. It is based on the textbook 'Introduction to Particle Technology' by Martin Rhodes, and aims to expand on the information given in the text by making best possible use of the advantages offered by the CD-ROM format, including use of videos, animations and interactive functions. The CD-ROM will be divided into the same twelve sections as the text. Each section will have subsections of: 1) Industrial Relevance (showing a video and/or photos and explanation of how the subject matter is used in industry). 2) Experiment/Demonstration (a video where measurements can be taken by the user, or explanatory video and raw data provided. The user will be given directions on how to carry out the experiment and the necessary calculations). 3) Quiz (multiple choice format testing the knowledge gained in the previous sections). 4) Calculators (allowing the user to easily make important particle technology calculations) The CD-ROM will allow users the opportunity to observe particulate processes and operations without the necessity of participating in laboratories or site visits, and will therefore be a useful tool for distance education, for users learning on an individual basis or as an addition to institutionally based particle technology courses

Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules

OpenAIRE

Lostetter, Alexander B.

1998-01-01

High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and thus ultimately reduce the cost of the power electronic circuits. The problem with this strategy in conventional packaging, however, is that at high frequencies, interconnects between the power devic...

Packaging and testing of multi-wavelength DFB laser array using REC technology

Science.gov (United States)

Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guanghui; Luan, Jia

2014-02-01

Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310 nm and 8-channel @1550 nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35 dB average Side Mode Suppression Ratio (SMSR). When I=35 mA, we obtain the total output power of 1 mW for 4-channel @1310 nm, and 227 μw for 8-channel @1550 nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10 G or even 8×10 G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.

MO-H-19A-03: Patient Specific Bolus with 3D Printing Technology for Electron Radiotherapy

International Nuclear Information System (INIS)

Zou, W; Swann, B; Siderits, R; McKenna, M; Khan, A; Yue, N; Zhang, M; Fisher, T

2014-01-01

Purpose: Bolus is widely used in electron radiotherapy to achieve desired dose distribution. 3D printing technologies provide clinicians with easy access to fabricate patient specific bolus accommodating patient body surface irregularities and tissue inhomogeneity. This study presents the design and the clinical workflow of 3D printed bolus for patient electron therapy in our clinic. Methods: Patient simulation CT images free of bolus were exported from treatment planning system (TPS) to an in-house developed software package. Bolus with known material properties was designed in the software package and then exported back to the TPS as a structure. Dose calculation was carried out to examine the coverage of the target. After satisfying dose distribution was achieved, the bolus structure was transferred in Standard Tessellation Language (STL) file format for the 3D printer to generate the machine codes for printing. Upon receiving printed bolus, a quick quality assurance was performed with patient resimulated with bolus in place to verify the bolus dosimetric property before treatment started. Results: A patient specific bolus for electron radiotherapy was designed and fabricated in Form 1 3D printer with methacrylate photopolymer resin. Satisfying dose distribution was achieved in patient with bolus setup. Treatment was successfully finished for one patient with the 3D printed bolus. Conclusion: The electron bolus fabrication with 3D printing technology was successfully implemented in clinic practice

MO-H-19A-03: Patient Specific Bolus with 3D Printing Technology for Electron Radiotherapy

Energy Technology Data Exchange (ETDEWEB)

Zou, W; Swann, B; Siderits, R; McKenna, M; Khan, A; Yue, N; Zhang, M [Rutgers University, New Brunswick, NJ (United States); Fisher, T [Memorial Medical Center, Modesto, CA (United States)

2014-06-15

Purpose: Bolus is widely used in electron radiotherapy to achieve desired dose distribution. 3D printing technologies provide clinicians with easy access to fabricate patient specific bolus accommodating patient body surface irregularities and tissue inhomogeneity. This study presents the design and the clinical workflow of 3D printed bolus for patient electron therapy in our clinic. Methods: Patient simulation CT images free of bolus were exported from treatment planning system (TPS) to an in-house developed software package. Bolus with known material properties was designed in the software package and then exported back to the TPS as a structure. Dose calculation was carried out to examine the coverage of the target. After satisfying dose distribution was achieved, the bolus structure was transferred in Standard Tessellation Language (STL) file format for the 3D printer to generate the machine codes for printing. Upon receiving printed bolus, a quick quality assurance was performed with patient resimulated with bolus in place to verify the bolus dosimetric property before treatment started. Results: A patient specific bolus for electron radiotherapy was designed and fabricated in Form 1 3D printer with methacrylate photopolymer resin. Satisfying dose distribution was achieved in patient with bolus setup. Treatment was successfully finished for one patient with the 3D printed bolus. Conclusion: The electron bolus fabrication with 3D printing technology was successfully implemented in clinic practice.

Physical packaging and organization of the drift chamber electronics system for the Stanford Large Detector

International Nuclear Information System (INIS)

Haller, G.M.; Freytag, M.L.; Mazaheri, G.; Olsen, J.; Paffrath, L.

1990-10-01

In this paper the logical organization, physical packaging, and operation of the drift chamber electronics for the SLD at SLAC is described. The system processes signals from approximately 7000 drift wires and is unusual in that most electronic functions are packaged on printed circuit boards within the detector. The circuits reside on signal-processing motherboards, controller boards, signal-transition boards, power-distribution boards, and fiber-optics-to-electrical conversion boards. The interaction and interconnection of these boards with respect to signal and control flow are presented. 11 refs., 7 figs

Meat Quality Assessment by Electronic Nose (Machine Olfaction Technology

Directory of Open Access Journals (Sweden)

Sundar Balasubramanian

2009-07-01

Full Text Available Over the last twenty years, newly developed chemical sensor systems (so called “electronic noses” have made odor analyses possible. These systems involve various types of electronic chemical gas sensors with partial specificity, as well as suitable statistical methods enabling the recognition of complex odors. As commercial instruments have become available, a substantial increase in research into the application of electronic noses in the evaluation of volatile compounds in food, cosmetic and other items of everyday life is observed. At present, the commercial gas sensor technologies comprise metal oxide semiconductors, metal oxide semiconductor field effect transistors, organic conducting polymers, and piezoelectric crystal sensors. Further sensors based on fibreoptic, electrochemical and bi-metal principles are still in the developmental stage. Statistical analysis techniques range from simple graphical evaluation to multivariate analysis such as artificial neural network and radial basis function. The introduction of electronic noses into the area of food is envisaged for quality control, process monitoring, freshness evaluation, shelf-life investigation and authenticity assessment. Considerable work has already been carried out on meat, grains, coffee, mushrooms, cheese, sugar, fish, beer and other beverages, as well as on the odor quality evaluation of food packaging material. This paper describes the applications of these systems for meat quality assessment, where fast detection methods are essential for appropriate product management. The results suggest the possibility of using this new technology in meat handling.

Control Technologies for Room Air-conditioner and Packaged Air-conditioner

Science.gov (United States)

Ito, Nobuhisa

Trends of control technologies about air-conditioning machineries, especially room or packaged air conditioners, are presented in this paper. Multiple air conditioning systems for office buildings are mainly described as one application of the refrigeration cycle control technologies including sensors for thermal comfort and heating/ cooling loads are also described as one of the system control technologies. Inverter systems and related technologies for driving variable speed compressors are described in both case of including induction motors and brushless DC motors. Technologies for more accurate control to meet various kind of regulations such as ozone layer destruction, energy saving and global warming, and for eliminating harmonic distortion of power source current, as a typical EMC problem, will be urgently desired.

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

Science.gov (United States)

Ren, Huai-Hui; Wang, Xi-Shu

2014-04-01

This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

Lithium niobate packaging challenges

International Nuclear Information System (INIS)

Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

1988-01-01

The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

Strategic Business-IT alignment of application software packages: Bridging the Information Technology gap

Directory of Open Access Journals (Sweden)

Wandi Kruger

2012-09-01

Full Text Available An application software package implementation is a complex endeavour, and as such it requires the proper understanding, evaluation and redefining of the current business processes to ensure that the implementation delivers on the objectives set at the start of the project. Numerous factors exist that may contribute to the unsuccessful implementation of application software packages. However, the most significant contributor to the failure of an application software package implementation lies in the misalignment of the organisation’s business processes with the functionality of the application software package. Misalignment is attributed to a gap that exists between the business processes of an organisation and what functionality the application software package has to offer to translate the business processes of an organisation into digital form when implementing and configuring an application software package. This gap is commonly referred to as the information technology (IT gap. This study proposes to define and discuss the IT gap. Furthermore this study will make recommendations for aligning the business processes with the functionality of the application software package (addressing the IT gap. The end result of adopting these recommendations will be more successful application software package implementations.

Applications of Active Packaging in Breads

Directory of Open Access Journals (Sweden)

Ali Göncü

2017-10-01

Full Text Available Changes on consumer preferences lead to innovations and improvements in new packaging technologies. With these new developments passive packaging technologies aiming to protect food nowadays have left their place to active and intelligent packaging technologies that have other various functions beside protection of food. Active packaging is defined as an innovative packaging type and its usage increases the shelf life of food significantly. Applications of active packaging have begun to be used for packaging of breads. In this study active packaging applications in breads have been reviewed.

Determinants of Adoption of Wheat Production Technology Package by Smallholder Farmers: Evidences from Eastern Ethiopia

Directory of Open Access Journals (Sweden)

Degefu Kebede

2017-03-01

Full Text Available A study was conducted to analyze factors influencing adoption of wheat technology packages by smallholder farmers in Gurawa, Meta and Habro districts in eastern Ethiopia. The analysis was based on a household survey data collected from 136 randomly selected households. A Two-limit Tobit model was used to elucidate factors affecting adoption of technology packages measured based on an index derived from five components of wheat technologies which included row planting, pesticide application, use of improved varieties, and application of inorganic fertilizers, namely, Diammonium Phosphate (DAP and Urea. Among the variables included in the model, variation in district, gender, age of the household head, education status of the household head, farm size, distance to market, distance to FTC (Farmers’ Training Centers, cooperative membership, dependency ratio, and annual income of the households were found to significantly affect the adoption of wheat technology packages. Policy makers, planners and development practitioners should give due attention to these determinants to support smallholder farmers in wheat production and enhance gains derived from it.

The commoditization of consumer electronics products and its influence on packaging design

NARCIS (Netherlands)

Wever, R.; Boks, C.; Stevels, A.

2008-01-01

The traditional purpose of packaging for consumer electronics (CE) products was to get them in one piece from the factory to the consumers home. It was purely focused on the physical distribution. In that time, buying a CE product could be considered a major family investment. However, times have

Literacity: A multimedia adult literacy package combining NASA technology, recursive ID theory, and authentic instruction theory

Science.gov (United States)

Willis, Jerry; Willis, Dee Anna; Walsh, Clare; Stephens, Elizabeth; Murphy, Timothy; Price, Jerry; Stevens, William; Jackson, Kevin; Villareal, James A.; Way, Bob

1994-01-01

An important part of NASA's mission involves the secondary application of its technologies in the public and private sectors. One current application under development is LiteraCity, a simulation-based instructional package for adults who do not have functional reading skills. Using fuzzy logic routines and other technologies developed by NASA's Information Systems Directorate and hypermedia sound, graphics, and animation technologies the project attempts to overcome the limited impact of adult literacy assessment and instruction by involving the adult in an interactive simulation of real-life literacy activities. The project uses a recursive instructional development model and authentic instruction theory. This paper describes one component of a project to design, develop, and produce a series of computer-based, multimedia instructional packages. The packages are being developed for use in adult literacy programs, particularly in correctional education centers. They use the concepts of authentic instruction and authentic assessment to guide development. All the packages to be developed are instructional simulations. The first is a simulation of 'finding a friend a job.'

Electron beam technology as a new industrial processing tool in Malaysia

International Nuclear Information System (INIS)

Zaman, K.

1996-01-01

Electron beam cross-linked products such as heat resistant automobile and home appliance wires, heat shrinkable tubes, sleeves, end caps for power and electronic industries, plastic packaging and semiconductors are commercially available in Malaysia and most of them are imported products. However, recently there are three newly established in-house industrial electron beam accelerators, in operation in Malaysia for cross-linking of home appliance wires and plastic packaging. Another electron beam accelerator of 3.0 MV, 90 kW is stationed in MINT which is used for research as well as for irradiation services. Research on electron beam cross-linking of natural polymer is one of the main subjects of interest. (author)

Electronics practice technology

International Nuclear Information System (INIS)

1995-01-01

This book concentrates on electronic technology. It deals with kinds of terminal and mounting such as teflon terminal, steatite terminal, and harmonica terminal, small parts like connector, plug jack, vernier dial, and coupling, termination of wiring, kinds of switch and mounting, a condenser, fixed resistor, trance coil, loading of semiconductor, mounting of high input impedance circuit, mounting of electric power circuit, manufacturing of print substrate and practice of manufacturing for print substrate. This is one of series books on electronic technology.

Sustainable packaging design for consumer electronics products : Balancing marketing, logistics and environmental requirements

NARCIS (Netherlands)

Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

2007-01-01

Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of

penORNL: a parallel Monte Carlo photon and electron transport package using PENELOPE

International Nuclear Information System (INIS)

Bekar, Kursat B.; Miller, Thomas Martin; Patton, Bruce W.; Weber, Charles F.

2015-01-01

The parallel Monte Carlo photon and electron transport code package penORNL was developed at Oak Ridge National Laboratory to enable advanced scanning electron microscope (SEM) simulations on high-performance computing systems. This paper discusses the implementations, capabilities and parallel performance of the new code package. penORNL uses PENELOPE for its physics calculations and provides all available PENELOPE features to the users, as well as some new features including source definitions specifically developed for SEM simulations, a pulse-height tally capability for detailed simulations of gamma and x-ray detectors, and a modified interaction forcing mechanism to enable accurate energy deposition calculations. The parallel performance of penORNL was extensively tested with several model problems, and very good linear parallel scaling was observed with up to 512 processors. penORNL, along with its new features, will be available for SEM simulations upon completion of the new pulse-height tally implementation.

Ceramic packages for liquid-nitrogen operation

International Nuclear Information System (INIS)

Tong, H.M.; Yeh, H.L.; Goldblatt, R.D.

1989-01-01

To evaluate their compatibility for use in a liquid-nitrogen computer, metallized ceramic packages with test chips joined using IBM controlled-collapse solder (Pb-Sn) technology have been cycled between 30 0 C and liquid-nitrogen temperature. Room-temperature electrical resistance measurements were made at regular intervals of cycles to determine whether solder failure accompanied by a significant resistance increase had occurred. For the failed solder joints characterized by the highest thermal shear strain amplitude of 3.3 percent, the authors were able to estimate the number of liquid-nitrogen cycles needed to produce the corresponding failure rate using a room-temperature solder lifetime model. Cross-sectional examination of the failed solder joints using scanning electron microscopy and energy dispersive X-ray analysis indicated solder cracking occurring at the solder-ceramic interface. Chip pull tests on cycled packages yielded strengths far exceeding the minimal requirement. Mechanisms involving the formation of intermetallics were proposed to account for the observed solder fracture modes after liquid-nitrogen cycling and after chip pull. Furthermore, scanning electron microscopic examination of pulled chips in cycled packages showed no apparent sign of cracking in quartz and polyimide for chip insulation

Vault Nanoparticles Packaged with Enzymes as an Efficient Pollutant Biodegradation Technology.

Science.gov (United States)

Wang, Meng; Abad, Danny; Kickhoefer, Valerie A; Rome, Leonard H; Mahendra, Shaily

2015-11-24

Vault nanoparticles packaged with enzymes were synthesized as agents for efficiently degrading environmental contaminants. Enzymatic biodegradation is an attractive technology for in situ cleanup of contaminated environments because enzyme-catalyzed reactions are not constrained by nutrient requirements for microbial growth and often have higher biodegradation rates. However, the limited stability of extracellular enzymes remains a major challenge for practical applications. Encapsulation is a recognized method to enhance enzymatic stability, but it can increase substrate diffusion resistance, lower catalytic rates, and increase the apparent half-saturation constants. Here, we report an effective approach for boosting enzymatic stability by single-step packaging into vault nanoparticles. With hollow core structures, assembled vault nanoparticles can simultaneously contain multiple enzymes. Manganese peroxidase (MnP), which is widely used in biodegradation of organic contaminants, was chosen as a model enzyme in the present study. MnP was incorporated into vaults via fusion to a packaging domain called INT, which strongly interacts with vaults' interior surface. MnP fused to INT and vaults packaged with the MnP-INT fusion protein maintained peroxidase activity. Furthermore, MnP-INT packaged in vaults displayed stability significantly higher than that of free MnP-INT, with slightly increased Km value. Additionally, vault-packaged MnP-INT exhibited 3 times higher phenol biodegradation in 24 h than did unpackaged MnP-INT. These results indicate that the packaging of MnP enzymes in vault nanoparticles extends their stability without compromising catalytic activity. This research will serve as the foundation for the development of efficient and sustainable vault-based bioremediation approaches for removing multiple contaminants from drinking water and groundwater.

Test facilities for radioactive material transport packages (AEA Technology plc, Winfrith,UK)

International Nuclear Information System (INIS)

Gillard, J.E.

2001-01-01

Transport containers for radioactive materials are tested to demonstrate compliance with national and international standards. Transport package design, testing, assessment and approval requires a wide range of skills and facilities. The comprehensive capability of AEA Technology in these areas is described. The facilities described include drop-test cranes and targets (up to 700 tonne); pool fires, furnaces and rigs for thermal tests, including heat dissipation on prototype flasks; shielding facilities; criticality simulations and leak test techniques. These are illustrated with photographs demonstrating the comprehensive nature of package testing services supplied to customers. (author)

Test facilities for radioactive material transport packages (AEA Technology plc, Winfrith,UK)

Energy Technology Data Exchange (ETDEWEB)

Gillard, J.E

2001-07-01

Transport containers for radioactive materials are tested to demonstrate compliance with national and international standards. Transport package design, testing, assessment and approval requires a wide range of skills and facilities. The comprehensive capability of AEA Technology in these areas is described. The facilities described include drop-test cranes and targets (up to 700 tonne); pool fires, furnaces and rigs for thermal tests, including heat dissipation on prototype flasks; shielding facilities; criticality simulations and leak test techniques. These are illustrated with photographs demonstrating the comprehensive nature of package testing services supplied to customers. (author)

Extreme temperature packaging: challenges and opportunities

Science.gov (United States)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

Assessment of microelectronics packaging for high temperature, high reliability applications

Energy Technology Data Exchange (ETDEWEB)

Uribe, F.

1997-04-01

This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

Extension Learners' Use of Electronic Technology

Science.gov (United States)

Guenthner, Joseph F.; Swan, Benjamin G.

2011-01-01

Extension clientele use electronic technology for entertainment, communication, and business. Educational programs that use electronic technology can enhance learning. To learn more about use of electronic technology among Extension clientele, we surveyed 80 university students and 135 potato farmers. We found that the farmers were likely to use…

Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

Directory of Open Access Journals (Sweden)

Masaru Ishizuka

2011-01-01

Full Text Available In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

Science.gov (United States)

Bryant, Robert G.

2007-01-01

Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

Electron Technology: ELTE 2016

Science.gov (United States)

Pisarkiewicz, Tadeusz; Kucewicz, Wojciech

2016-12-01

In this paper we present a review of research results and technical accomplishments presented by researchers from technical universities, governmental institutes and research companies during the XIIth Scientific Conference Electron Technology, ELTE 2016. This review is based on materials presented at four topical conference sessions: Microelectronics and Nanoelectronics, Photonics, Materials and Technologies, and Microsystems and also on materials presented by invited speakers at two dedicated sessions. Oral sessions were accompanied by the poster sessions. In effect about 50 papers gathered in this volume reflect the topics discussed at the Conference. A short description of technological and measurement possibilities in the laboratories of Academic Centre for Materials and Nanotechnology and also in the Department of Electronics of the Faculty of Computer Science, Electronics and Telecommunications AGH UST are given.

Demonstration of a Prototype Hydrogen Sensor and Electronics Package - Progress Report 2

Energy Technology Data Exchange (ETDEWEB)

Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

2016-06-14

This is the second progress report on the demonstration of a prototype hydrogen sensor and electronics package. It goes into detail about the five tasks, four of which are already completed as of August 2016, with the final to be completed by January 26, 2017. Then the budget is detailed along with the planned work for May 27, 2016 to July 27, 2016.

Miniature stick-packaging--an industrial technology for pre-storage and release of reagents in lab-on-a-chip systems.

Science.gov (United States)

van Oordt, Thomas; Barb, Yannick; Smetana, Jan; Zengerle, Roland; von Stetten, Felix

2013-08-07

Stick-packaging of goods in tubular-shaped composite-foil pouches has become a popular technology for food and drug packaging. We miniaturized stick-packaging for use in lab-on-a-chip (LOAC) systems to pre-store and on-demand release the liquid and dry reagents in a volume range of 80-500 μl. An integrated frangible seal enables the pressure-controlled release of reagents and simplifies the layout of LOAC systems, thereby making the package a functional microfluidic release unit. The frangible seal is adjusted to defined burst pressures ranging from 20 to 140 kPa. The applied ultrasonic welding process allows the packaging of temperature sensitive reagents. Stick-packs have been successfully tested applying recovery tests (where 99% (STDV = 1%) of 250 μl pre-stored liquid is released), long-term storage tests (where there is loss of only <0.5% for simulated 2 years) and air transport simulation tests. The developed technology enables the storage of a combination of liquid and dry reagents. It is a scalable technology suitable for rapid prototyping and low-cost mass production.

Packaging Concerns/Techniques for Large Devices

Science.gov (United States)

Sampson, Michael J.

2009-01-01

This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

International Nuclear Information System (INIS)

Zhang Guang-Chen; Feng Shi-Wei; Zhou Zhou; Li Jing-Wan; Guo Chun-Sheng

2011-01-01

The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip-level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

Science.gov (United States)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

XRAY applied program package for calculation of electron-photon fields in the energy range of 1-1000 keV

International Nuclear Information System (INIS)

Lappa, A.V.; Khadyeva, Z.M.; Burmistrov, D.S.; Vasil'ev, O.N.

1990-01-01

The package of applied XRAY programs is intended for calculating the linear and fluctuation characteristics of photon and electron radiation fields in heterogeneous medium within 1-1000 keV energy range. The XRAY program package consists of moduli written in FORTRAN-IV and data files. 9 refs

Wafer-level chip-scale packaging analog and power semiconductor applications

CERN Document Server

Qu, Shichun

2015-01-01

This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

CEPXS/ONELD: A one-dimensional coupled electron-photon discrete ordinates code package

International Nuclear Information System (INIS)

Lorence, L.J. Jr.; Morel, J.E.

1992-01-01

CEPXS/ONELD is a discrete ordinates transport code package that can model the electron-photon cascade from 100 MeV to 1 keV. The CEPXS code generates fully-coupled multigroup-Legendre cross section data. This data is used by the general-purpose discrete ordinates code, ONELD, which is derived from the Los Alamos ONEDANT and ONBTRAN codes. Version 1.0 of CEPXS/ONELD was released in 1989 and has been primarily used to analyze the effect of radiation environments on electronics. Version 2.0 is under development and will include user-friendly features such as the automatic selection of group structure, spatial mesh structure, and S N order

Maintainability design criteria for packaging of spacecraft replaceable electronic equipment.

Science.gov (United States)

Kappler, J. R.; Folsom, A. B.

1972-01-01

Maintainability must be designed into long-duration spacecraft and equipment to provide the required high probability of mission success with the least cost and weight. The ability to perform repairs quickly and easily in a space environment can be achieved by imposing specific maintainability design criteria on spacecraft equipment design and installation. A study was funded to investigate and define design criteria for electronic equipment that would permit rapid removal and replacement in a space environment. The results of the study are discussed together with subsequent simulated zero-g demonstration tests of a mockup with new concepts for packaging.

Trends in Food Packaging.

Science.gov (United States)

Ott, Dana B.

1988-01-01

This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

Smart packaging systems for food applications: a review.

Science.gov (United States)

Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

2015-10-01

Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

Integrated Approach to Industrial Packaging Design

Science.gov (United States)

Vorobeva, O.

2017-11-01

The article reviews studies in the field of industrial packaging design. The major factors which influence technological, ergonomic, economic and ecological features of packaging are established. The main modern trends in packaging design are defined, the principles of marketing communications and their influence on consumers’ consciousness are indicated, and the function of packaging as a transmitter of brand values is specified. Peculiarities of packaging technology and printing techniques in modern printing industry are considered. The role of designers in the stage-by-stage development of the construction, form and graphic design concept of packaging is defined. The examples of authentic packaging are given and the mention of the tetrahedron packaging history is made. At the end of the article, conclusions on the key research aspects are made.

Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

International Nuclear Information System (INIS)

Hoshi, T; Fujiwara, T

2009-01-01

An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

Photonics and nanophotonics and information and communication technologies in modern food packaging.

Science.gov (United States)

Sarapulova, Olha; Sherstiuk, Valentyn; Shvalagin, Vitaliy; Kukhta, Aleksander

2015-01-01

The analysis of the problem of conjunction of information and communication technologies (ICT) with packaging industry and food production was made. The perspective of combining the latest advances of nanotechnology, including nanophotonics, and ICT for creating modern smart packaging was shown. There were investigated luminescent films with zinc oxide nanoparticles, which change luminescence intensity as nano-ZnO interacts with decay compounds of food products, for active and intelligent packaging. High luminescent transparent films were obtained from colloidal suspension of ZnO and polyvinylpyrrolidone (PVP). The influence of molecular mass, concentration of nano-ZnO, and film thickness on luminescent properties of films was studied in order to optimize the content of the compositions. The possibility of covering the obtained films with polyvinyl alcohol was considered for eliminating water soluble properties of PVP. The luminescent properties of films with different covers were studied. The insoluble in water composition based on ZnO stabilized with colloidal silicon dioxide and PVP in polymethylmethacrylate was developed, and the luminescent properties of films were investigated. The compositions are non-toxic, safe, and suitable for applying to the inner surface of active and intelligent packaging by printing techniques, such as screen printing, flexography, inkjet, and pad printing.

Photonics and Nanophotonics and Information and Communication Technologies in Modern Food Packaging

Science.gov (United States)

Sarapulova, Olha; Sherstiuk, Valentyn; Shvalagin, Vitaliy; Kukhta, Aleksander

2015-05-01

The analysis of the problem of conjunction of information and communication technologies (ICT) with packaging industry and food production was made. The perspective of combining the latest advances of nanotechnology, including nanophotonics, and ICT for creating modern smart packaging was shown. There were investigated luminescent films with zinc oxide nanoparticles, which change luminescence intensity as nano-ZnO interacts with decay compounds of food products, for active and intelligent packaging. High luminescent transparent films were obtained from colloidal suspension of ZnO and polyvinylpyrrolidone (PVP). The influence of molecular mass, concentration of nano-ZnO, and film thickness on luminescent properties of films was studied in order to optimize the content of the compositions. The possibility of covering the obtained films with polyvinyl alcohol was considered for eliminating water soluble properties of PVP. The luminescent properties of films with different covers were studied. The insoluble in water composition based on ZnO stabilized with colloidal silicon dioxide and PVP in polymethylmethacrylate was developed, and the luminescent properties of films were investigated. The compositions are non-toxic, safe, and suitable for applying to the inner surface of active and intelligent packaging by printing techniques, such as screen printing, flexography, inkjet, and pad printing.

Active Packaging Coatings

Directory of Open Access Journals (Sweden)

Luis J. Bastarrachea

2015-11-01

Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

ACTIVE PACKAGING SYSTEM FOR MEAT AND MEAT PRODUCTS

Directory of Open Access Journals (Sweden)

Adriana Pavelková

2012-10-01

Full Text Available In the recent past, food packaging was used to enable marketing of products and to provide passive protection against environmental contaminations or influences that affect the shelf life of the products. However, unlike traditional packaging, which must be totally inert, active packaging is designed to interact with the contents and/or the surrounding environment. Interest in the use of active packaging systems for meat and meat products has increased in recent years. Active packaging systems are developed with the goal of extending shelf life for foods and increasing the period of time that the food is high quality. Developments in active packaging have led to advances in many areas, including delayed oxidation and controlled respiration rate, microbial growth, and moisture migration. Active packaging technologies include some physical, chemical, or biological action which changes interactions between a package, product, and/or headspace of the package in order to get a desired outcome. Active packaging systems discussed include oxygen scavengers, carbon dioxide scavengers and emitters, moisture control agents, flavour/odour absorbers and releasers  and antimicrobial packaging technologies. Active packaging is typically found in two types of systems; sachets and pads which are placed inside of packages, and active ingredients that are incorporated directly into packaging materials.  Recognition of the benefits of active packaging technologies by the food industry, development of economically viable packaging systems and increased consumer acceptance is necessary for commercial realisation of these packaging technologies.doi:10.5219/205

Radiation cross-linked plastics: a versatile material solution for packaging, automotive, Electrotechnic and Electronics

International Nuclear Information System (INIS)

Rouif, Sophie

2004-01-01

Used since the beginning of the 1970s for the production of halogen-free and heat-resistant cables and wires, for conditioning polyethylene hot-water pipes or for the manufacture of heat shrinkable tubes and of tyres, radiation cross-linking is developing fastly today on the scale of plastic-moulded parts, and not only by the mean of EB, but also under gamma rays. Indeed, it improves considerably the performances of a great number of plastics among thermoplastics, elastomers and thermoplastic elastomers (TPE). Radiation cross-linking reinforces the dimensional stability of polymers in chemically aggressive and high-temperature conditions. Radiation cross-linked-based engineering plastics offers OEM and end users in many branches of industry both technical and economical advantages in comparison with high-performances plastics. They constitute a technical and economical compromise between engineering plastics that failed and high-performances plastic, often over-tailored and expensive. This modern industrial technology gives way to new applications and perspectives in various sectors (packaging, automotive, electrotechnic and electronics, including connectors, surface-mounted devices, integrated circuits, 3D-MID, etc.) that are described in the paper

The Next Technology Revolution - Nano Electronic Technology

Science.gov (United States)

Turlik, Iwona

2004-03-01

Nanotechnology is a revolutionary engine that will engender enormous changes in a vast majority of today's industries and markets, while potentially creating whole new industries. The impact of nanotechnology is particularly significant in the electronics industry, which is constantly driven by the need for higher performance, increased functionality, smaller size and lower cost. Nanotechnology can influence many of the hundreds of components that are typically assembled to manufacture modern electronic devices. Motorola manufactures electronics for a wide range of industries and communication products. In this presentation, the typical components of a cellular phone are outlined and technology requirements for future products, the customer benefits, and the potential impact of nanotechnology on many of the components are discussed. Technology needs include reliable materials supply, processes for high volume production, experimental and simulation tools, etc. For example, even routine procedures such as failure characterization may require the development of new tools for investigating nano-scale phenomena. Business needs include the development of an effective, high volume supply chain for nano-materials and devices, disruptive product platforms, and visible performance impact on the end consumer. An equally significant long-term industry need is the availability of science and engineering graduates with a multidisciplinary focus and a deep understanding of the fundamentals of nano-technology, that can harness the technology to create revolutionary products.

Genome packaging in viruses

OpenAIRE

Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

2010-01-01

Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

Packaging - Materials review

Energy Technology Data Exchange (ETDEWEB)

Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

2014-06-16

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

Packaging - Materials review

Science.gov (United States)

Herrmann, Matthias

2014-06-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

Packaging - Materials review

International Nuclear Information System (INIS)

Herrmann, Matthias

2014-01-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and the New Tenets for Cost Conscious Mission Assurance on Electrical, Electronic, and Electromechanical (EEE) Parts

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2015-01-01

The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.

Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

International Nuclear Information System (INIS)

Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung-hyun; Nah, Jae-Woong; Paik, Kyung-Wook; Kwon, Dongil

2004-01-01

Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 deg. C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA)

Packaging for Food Service

Science.gov (United States)

Stilwell, E. J.

1985-01-01

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Industrial applications of electron beam technology

International Nuclear Information System (INIS)

Khairul Zaman Mohd Dahlan

1997-01-01

Electron beam technology was first introduced in Malaysia in 1989 with the conclusion of the bilateral cooperation between the Malaysian Institute for Nuclear Technology Research (MINT) and Japan International Co-operation Agency (JICA) on Radiation Application Projects. Two electron beam accelerators with energy of 3.0 MeV and 200 keV were installed at MINT. These two accelerators pave the way for R and D to be carried out in radiation processing of polymers for cross-linking and surface curing. In 1994, another electron beam accelerator was installed in the private sector for cross-linking of home appliance wires. Since then, two more accelerators were installed in the private sector for cross-linking of heat shrinkable plastic films. Recently, a local company has acquired a low energy electron beam machine for cross-linking of plastic film. Within a period of 7 years, industrial applications of electron beam technology in Malaysia have increased significantly

The NASA Electronic Parts and Packaging (NEPP) Program - Presentation to Korean Aerospace Research Institute

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.

Technological Innovations in the Food Packaging: a case study of adoption of active packaging in coffee roaster companies

Directory of Open Access Journals (Sweden)

Mário Otávio Batalha

2010-12-01

Full Text Available Most of technological innovations in agro-food systems are created by “supporting industries”, the group where packaging industries are inserted. This article presents the packaging innovations used in food industries, particularly, the active packaging. This paper deals with an adoption case of a degassing one-way valve, describing this innovation and its impacts in two coffee companies. This study can be classified as a documental, qualitative-descriptive and empirical research, using indirect documentation technique and case study analysis. According to this case, the valve made possible the diversification of the company product line and product quality improvement. There were no complications involving an additional cost to the customers. However, it has been observed that this additional cost from technology adoption makes difficult the diffusion of this valve in other similar products.Grande parcela das inovações tecnológicas dos sistemas agroindustriais é gerada pelas “indústrias de apoio”, grupo no qual as indústrias de embalagens se inserem. Esse artigo discute as inovações em embalagens destinadas à indústria de alimentos, em especial as chamadas embalagens ativas. Discute-se o caso de adoção da válvula unidirecional de alívio de gases, descrevendo a inovação e seus impactos em duas indústria processadoras de café nas empresas. A pesquisa desenvolvida é de ordem documental e qualitativo-descritiva de caráter empírica, usando técnica de análise de documentação indireta e estudo de caso . No caso abordado, a válvula possibilitou a diversificação da linha de produtos e o incremento da sua qualidade, não havendo complicações no que se refere ao repasse do custo adicional para o consumidor desse produto. Contudo, verifica-se que esse custo adicional da adoção da tecnologia dificulta a difusão da válvula em produtos similares.

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Science.gov (United States)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Power cycling test of a 650 V discrete GaN-on-Si power device with a laminated packaging embedding technology

DEFF Research Database (Denmark)

Song, Sungyoung; Munk-Nielsen, Stig; Uhrenfeldt, Christian

2017-01-01

A GaN-on-Si power device is a strong candidate to replace power components based on silicon in high-end market for low-voltage applications, thanks to its electrical characteristics. To maximize opportunities of the GaN device in field applications, a package technology plays an important role...... in a discrete GaN power device. A few specialized package technologies having very lower stray inductance and higher thermal conductivity have been proposed for discrete GaN-on-Si power devices. Despite their superior performance, there has been little discussion of their reliability. The paper presents a power...... cycling test of a discrete GaN power device employing a laminated embedded packaging technology subjected to 125 degrees Celsius junction temperature swing. Failure modes are described with collected electrical characteristics and measured temperature data under the test. In conclusion, physical...

29 CFR 1615.135 - Electronic and information technology requirements.

Science.gov (United States)

2010-07-01

... 29 Labor 4 2010-07-01 2010-07-01 false Electronic and information technology requirements. 1615... INFORMATION TECHNOLOGY § 1615.135 Electronic and information technology requirements. (a) Development, procurement, maintenance, or use of electronic and information technology.—When developing, procuring...

Fatigue failure of pb-free electronic packages under random vibration loads

Science.gov (United States)

Saravanan, S.; Prabhu, S.; Muthukumar, R.; Gowtham Raj, S.; Arun Veerabagu, S.

2018-03-01

The electronic equipment are used in several fields like, automotive, aerospace, consumer goods where they are subjected to vibration loads leading to failure of solder joints used in these equipment. This paper presents a methodology to predict the fatigue life of Pb-free surface mounted BGA packages subjected to random vibrations. The dynamic characteristics of the PCB, such as the natural frequencies, mode shapes and damping ratios were determined. Spectrum analysis was used to determine the stress response of the critical solder joint and the cumulative fatigue damage accumulated by the solder joint for a specific duration was determined.

A computer code package for Monte Carlo photon-electron transport simulation Comparisons with experimental benchmarks

International Nuclear Information System (INIS)

Popescu, Lucretiu M.

2000-01-01

A computer code package (PTSIM) for particle transport Monte Carlo simulation was developed using object oriented techniques of design and programming. A flexible system for simulation of coupled photon, electron transport, facilitating development of efficient simulation applications, was obtained. For photons: Compton and photo-electric effects, pair production and Rayleigh interactions are simulated, while for electrons, a class II condensed history scheme was considered, in which catastrophic interactions (Moeller electron-electron interaction, bremsstrahlung, etc.) are treated in detail and all other interactions with reduced individual effect on electron history are grouped together using continuous slowing down approximation and energy straggling theories. Electron angular straggling is simulated using Moliere theory or a mixed model in which scatters at large angles are treated as distinct events. Comparisons with experimentally benchmarks for electron transmission and bremsstrahlung emissions energy and angular spectra, and for dose calculations are presented

ANTIMICROBIALS USED IN ACTIVE PACKAGING FILMS

OpenAIRE

Dıblan, Sevgin; Kaya, Sevim

2017-01-01

Active packaging technology is one of the innovativemethods for preserving of food products, and antimicrobial packaging films is amajor branch and promising application of this technology. In order to controlmicrobial spoilage and also contamination of pathogen onto processed or fresh food,antimicrobial agent(s) is/are incorporated into food packaging structure.Polymer type as a carrier of antimicrobial can be petroleum-based plastic orbiopolymer: because of environmental concerns researcher...

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

Tamper indicating packaging

International Nuclear Information System (INIS)

Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

1994-01-01

Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL

Some thermo-electromagnetic applications to fusion technology of a general purpose CAD package

International Nuclear Information System (INIS)

Girdinio, P.; Molfino, P.; Molinari, G.; Raia, G.; Rosatelli, F.; Viviani, A.

1985-01-01

A general purpose CAD package is applied to the solution of problems related to fusion technology. The problems solved are the interacting electromagnetic and thermal fields in a resistive toroidal coil and the design of the poloidal field coils in Tokamak machines. In both cases, the procedure used is reported and the results obtained are displayed and discussed

Some thermo-electromagnetic applications to fusion technology of a general purpose CAD package

International Nuclear Information System (INIS)

Girdinio, P.; Molfino, P.; Molinari, G.; Viviani, A.; Raia, G.; Rosatelli, F.

1984-01-01

A general purpose CAD package is applied to the solution of problems related to fusion technology. The problems solved are the interacting electromagnetic and thermal fields in a resistive toroidal coil and the design of the poloidal field coils in Tokamak machines. In both cases, the procedure used is reported and the results obtained are displayed and discussed. (author)

Information Technology in project-organized electronic and computer technology engineering education

DEFF Research Database (Denmark)

Nielsen, Kirsten Mølgaard; Nielsen, Jens Frederik Dalsgaard

1999-01-01

This paper describes the integration of IT in the education of electronic and computer technology engineers at Institute of Electronic Systems, Aalborg Uni-versity, Denmark. At the Institute Information Technology is an important tool in the aspects of the education as well as for communication...

Data analysis for the LISA Technology Package

Energy Technology Data Exchange (ETDEWEB)

Hewitson, M; Danzmann, K; Diepholz, I; GarcIa, A [Albert-Einstein-Institut, Max-Planck-Institut fuer Gravitationsphysik und Universitaet Hannover, 30167 Hannover (Germany); Armano, M; Fauste, J [European Space Agency, ESAC, Villanueva de la Canada, 28692 Madrid (Spain); Benedetti, M [Dipartimento di Ingegneria dei Materiali e Tecnologie Industriali, Universita di Trento and INFN, Gruppo Collegato di Trento, Mesiano, Trento (Italy); Bogenstahl, J [Department of Physics and Astronomy, University of Glasgow, Glasgow (United Kingdom); Bortoluzzi, D; Bosetti, P; Cristofolini, I [Dipartimento di Ingegneria Meccanica e Strutturale, Universita di Trento and INFN, Gruppo Collegato di Trento, Mesiano, Trento (Italy); Brandt, N [Astrium GmbH, 88039 Friedrichshafen (Germany); Cavalleri, A; Ciani, G; Dolesi, R; Ferraioli, L [Dipartimento di Fisica, Universita di Trento and INFN, Gruppo Collegato di Trento, 38050 Povo, Trento (Italy); Cruise, M [Department of Physics and Astronomy, University of Birmingham, Birmingham (United Kingdom); Fertin, D; GarcIa, C [European Space Agency, ESTEC, 2200 AG Noordwijk (Netherlands); Fichter, W, E-mail: martin.hewitson@aei.mpg.d [Institut fuer Flugmechanik und Flugregelung, 70569 Stuttgart (Germany)

2009-05-07

The LISA Technology Package (LTP) on board the LISA Pathfinder mission aims to demonstrate some key concepts for LISA which cannot be tested on ground. The mission consists of a series of preplanned experimental runs. The data analysis for each experiment must be designed in advance of the mission. During the mission, the analysis must be carried out promptly so that the results can be fed forward into subsequent experiments. As such a robust and flexible data analysis environment needs to be put in place. Since this software is used during mission operations and effects the mission timeline, it must be very robust and tested to a high degree. This paper presents the requirements, design and implementation of the data analysis environment (LTPDA) that will be used for analysing the data from LTP. The use of the analysis software to perform mock data challenges (MDC) is also discussed, and some highlights from the first MDC are presented.

Data analysis for the LISA Technology Package

International Nuclear Information System (INIS)

Hewitson, M; Danzmann, K; Diepholz, I; GarcIa, A; Armano, M; Fauste, J; Benedetti, M; Bogenstahl, J; Bortoluzzi, D; Bosetti, P; Cristofolini, I; Brandt, N; Cavalleri, A; Ciani, G; Dolesi, R; Ferraioli, L; Cruise, M; Fertin, D; GarcIa, C; Fichter, W

2009-01-01

The LISA Technology Package (LTP) on board the LISA Pathfinder mission aims to demonstrate some key concepts for LISA which cannot be tested on ground. The mission consists of a series of preplanned experimental runs. The data analysis for each experiment must be designed in advance of the mission. During the mission, the analysis must be carried out promptly so that the results can be fed forward into subsequent experiments. As such a robust and flexible data analysis environment needs to be put in place. Since this software is used during mission operations and effects the mission timeline, it must be very robust and tested to a high degree. This paper presents the requirements, design and implementation of the data analysis environment (LTPDA) that will be used for analysing the data from LTP. The use of the analysis software to perform mock data challenges (MDC) is also discussed, and some highlights from the first MDC are presented.

Characterization of integrated circuit packaging materials

CERN Document Server

Moore, Thomas

1993-01-01

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

Linac technology for free-electron lasers

International Nuclear Information System (INIS)

Cooper, R.K.; Morton, P.L.; Wilson, P.B.; Keefe, D.; Faltens, A.

1983-01-01

The purpose of this paper is to concentrate on the properties of high-energy electron linear accelerators for use in free-electron lasers operating principally in the Compton regime. To fix our focus somewhat, we shall consider electron energies in the 20- to 200-MeV range and consider requirements for high-power free-electron lasers operating in the 0.5- to 10-μm range. Preliminary remarks are made on high-power free-electron laser amplifiers and oscillators and some desirable characteristics of the linacs that deliver electron beams for these devices. Both the high peak-current requirements of the amplifier and the high pulse-repetition frequency requirements of the oscillator can be met by present-day linac technology, although not necessarily by the same machine. In this papers second and third section, the technology of two rather different types of linear accelerators, the rf linac and the induction linac, is reviewed. In conclusion, applications to the Free Electron Lasers are stated

Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

Science.gov (United States)

Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

2013-03-01

Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

48 CFR 1352.239-71 - Electronic and information technology.

Science.gov (United States)

2010-10-01

... Electronic and information technology. As prescribed in 48 CFR 1339.270(a), insert the following provision: Electronic and Information Technology (APR 2010) (a) To be considered eligible for award, offerors must propose electronic and information technology (EIT) that meet the applicable Access Board accessibility...

Spin polarized electron source technology transferred from HE accelerators to electron microscopes

International Nuclear Information System (INIS)

Nakanishi, Tsutomu

2009-01-01

For many years, we have developed a technology of spin-polarized-electron-source (PES) for a future linear collider project (ILC). Various new techniques for achieving high polarization, high quantum efficiency, high current density, sub-nanosecond multi-bunch generation etc. were developed. Two fundamental technologies; reduction of dark current and preparation of extremely high vacuum environment to protect the Negative Electron Affinity (NEA) surface have been also developed. Using these PES technologies and a new transmission type photocathode, we recently succeeded in producing the high brightness and high polarization electron beam for the low energy electron microscope (LEEM). Our Spin-LEEM system enables the world-first dynamic observation of surface magnetic domain formed by evaporation on the metal substrate with ∼ 20 nm space resolutions. (author)

Electronic Nose Technology and its Applications

Directory of Open Access Journals (Sweden)

Esmaeil MAHMOUDI

2009-08-01

Full Text Available In the past decade, Electronic Nose instrumentation has generated much interest internationally for its potential to solve a wide variety of problems in fragrance and cosmetics production, food and beverages manufacturing, chemical engineering, environmental monitoring and more recently medical diagnostic, bioprocesses and clinical diagnostic plant diseases. This instrument measure electrical resistance changes generated by adsorption of volatiles to the surface of electro active- polymer coated sensor- unique digital electronic fingerprint of aroma derived from multi-sensor- responses to distinct mixture of microbial volatiles. Major advances in information and gas sensor technology could enhance the diagnostic power of future bio-electronic nose and facilitate global surveillance mode of disease control and management. Several dozen companies are now designed and selling electronic nose units globally for a wide variety of expending markets. The present review includes principles of electronic nose technology, biosensor structure and applications of electronic nose in many fields.

Technical Support Document: 50% Energy Savings Design Technology Packages for Highway Lodging Buildings

Energy Technology Data Exchange (ETDEWEB)

Jiang, Wei; Gowri, Krishnan; Lane, Michael D.; Thornton, Brian A.; Rosenberg, Michael I.; Liu, Bing

2009-09-28

This Technical Support Document (TSD) describes the process, methodology and assumptions for development of the 50% Energy Savings Design Technology Packages for Highway Lodging Buildings, a design guidance document intended to provide recommendations for achieving 50% energy savings in highway lodging properties over the energy-efficiency levels contained in ANSI/ASHRAE/IESNA Standard 90.1-2004, Energy Standard for Buildings Except Low-Rise Residential Buildings.

Thermal expansion model for multiphase electronic packaging materials

International Nuclear Information System (INIS)

Allred, B.E.; Warren, W.E.

1991-01-01

Control of thermal expansion is often necessary in the design and selection of electronic packages. In some instances, it is desirable to have a coefficient of thermal expansion intermediate between values readily attainable with single or two phase materials. The addition of a third phase in the form of fillers, whiskers, or fibers can be used to attain intermediate expansions. To help design the thermal expansion of multiphase materials for specific applications, a closed form model has been developed that accurately predicts the effective elastic properties of isotropic filled materials and transversely isotropic lamina. Properties of filled matrix materials are used as inputs to the lamina model to obtain the composite elastic properties as a function of the volume fraction of each phase. Hybrid composites with two or more fiber types are easily handled with this model. This paper reports that results for glass, quartz, and Kevlar fibers with beta-eucryptite filled polymer matrices show good agreement with experimental results for X, Y, and Z thermal expansion coefficients

Applications and advances in electronic-nose technologies

Science.gov (United States)

A. D. Wilson; M. Baietto

2009-01-01

Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software...

On-orbit alignment and diagnostics for the LISA Technology Package

International Nuclear Information System (INIS)

MarIn, A F GarcIa; Wand, V; Steier, F; Cervantes, F Guzman; Bogenstahl, J; Jennrich, O; Heinzel, G; Danzmann, K

2006-01-01

This paper presents a procedure to perform fully autonomous on-orbit alignment of the interferometer on board the LISA Technology Package (LTP). LTP comprises two free-floating test masses as inertial sensors that additionally serve as end mirrors of a set of interferometers. From the output signals of the interferometers, a subset has been selected to obtain alignment information of the test masses. Based on these signals, an alignment procedure was developed and successfully tested on the engineering model of the optical bench. Furthermore, operation procedures for the characterization of critical on-orbit properties of the optical metrology system (e.g. fibre noise) have been established

Successful completion of the development and testing of a coal to fuel cell grade hydrogen technology package for New Zealand

Energy Technology Data Exchange (ETDEWEB)

Anthony H. Clemens; Tana P. Levi; Robert S. Whitney; Alister I. Gardiner

2009-07-01

A technology package for the production, from New Zealand lignite, of high purity hydrogen suitable for use in an alkaline fuel cell has been successfully developed and tested. The technology involves the integration of an air-blown 1 tonne per day fluidised bed gasifier with a range of downstream syngas clean-up components leading to the fuel cell. The development of the technology package was built on earlier work that showed New Zealand lignites to be among the most reactive in the world and well suited to fluidised bed gasification. The reason for their high reactivity was shown to be due to the presence of ion-exchanged calcium within the lignite structure. The clean-up line is comprised of some commonly used 'off the shelf' technologies. These include a cyclone and Venturi scrubber for particulate and condensables capture respectively and a high temperature water gas shift reactor. It also contains a less commonly used counterflow caustic wash packed column for H{sub 2}S removal and an experimental membrane for final hydrogen separation. The clean-up line is constructed so that it may be used to testbed other new syngas clean-up technologies. The paper describes the new technology package, considers several issues that arose during its development and how these were addressed. It also considers the future development of the technology including co-gasification with biomass and conversion to an oxygen blown unit for synfuel production. 20 refs., 4 figs., 1 tab.

Test Plan for Lockheed Idaho Technologies Company (LITCO), ARROW-PAK Packaging, Docket 95-40-7A, Type A Container

International Nuclear Information System (INIS)

Kelly, D.L.

1995-01-01

This report documents the U.S. Department of Transportation Specification 7A Type A (DOT-7A) compliance testing to be followed for qualification of the Lockheed Idaho Technologies Company, ARROW-PAK, for use as a Type A Packaging. The packaging configuration being tested is intended for transportation of radioactive solids, Form No. 1, Form No. 2, and Form No. 3

Technology Acceptance of Electronic Medical Records by Nurses

Science.gov (United States)

Stocker, Gary

2010-01-01

The purpose of this study was to evaluate the Technology Acceptance Model's (TAM) relevance of the intention of nurses to use electronic medical records in acute health care settings. The basic technology acceptance research of Davis (1989) was applied to the specific technology tool of electronic medical records (EMR) in a specific setting…

Smart Packaging Technologies and Their Application in Conventional Meat Packaging Systems

Science.gov (United States)

O'Grady, Michael N.; Kerry, Joseph P.

Preservative packaging of meat and meat products should maintain acceptable appearance, odour and flavour and should delay the onset of microbial spoilage. Typically fresh red meats are placed on trays and over-wrapped with an oxygen permeable film or alternatively, meats are stored in modified atmosphere packages (MAP) containing high levels of oxygen and carbon dioxide (80% O2:20% CO2) (Georgala & Davidson, 1970). Cooked meats are usually stored in 70% N2:30% CO2 (Smiddy, Papkovsky, & Kerry, 2002). The function of oxygen in MAP is to maintain acceptable fresh meat colour and carbon dioxide inhibits the growth of spoilage bacteria (Seideman & Durland, 1984). Nitrogen is used as an inert filler gas either to reduce the proportions of the other gases or to maintain the pack shape (Bell & Bourke, 1996).

Standard semiconductor packaging for high-reliability low-cost MEMS applications

Science.gov (United States)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Fresh meat packaging: consumer acceptance of modified atmosphere packaging including carbon monoxide.

Science.gov (United States)

Grebitus, Carola; Jensen, Helen H; Roosen, Jutta; Sebranek, Joseph G

2013-01-01

Consumers' perceptions and evaluations of meat quality attributes such as color and shelf life influence purchasing decisions, and these product attributes can be affected by the type of fresh meat packaging system. Modified atmosphere packaging (MAP) extends the shelf life of fresh meat and, with the inclusion of carbon monoxide (CO-MAP), achieves significant color stabilization. The objective of this study was to assess whether consumers would accept specific packaging technologies and what value consumers place on ground beef packaged under various atmospheres when their choices involved the attributes of color and shelf life. The study used nonhypothetical consumer choice experiments to determine the premiums that consumers are willing to pay for extended shelf life resulting from MAP and for the "cherry red" color in meat resulting from CO-MAP. The experimental design allowed determination of whether consumers would discount foods with MAP or CO-MAP when (i) they are given more detailed information about the technologies and (ii) they have different levels of individual knowledge and media exposure. The empirical analysis was conducted using multinomial logit models. Results indicate that consumers prefer an extension of shelf life as long as the applied technology is known and understood. Consumers had clear preferences for brighter (aerobic and CO) red color and were willing to pay $0.16/lb ($0.35/kg) for each level of change to the preferred color. More information on MAP for extending the shelf life and on CO-MAP for stabilizing color decreased consumers' willingness to pay. An increase in personal knowledge and media exposure influenced acceptance of CO-MAP negatively. The results provide quantitative measures of how packaging affects consumers' acceptance and willingness to pay for products. Such information can benefit food producers and retailers who make decisions about investing in new packaging methods.

2015 4th China Academic Conference on Printing and Packaging

CERN Document Server

Xu, Min; Yang, Li; Ouyang, Yujie

2016-01-01

This book includes a selection of reviewed papers presented at the 2015, 4th China Academic Conference on Printing and Packaging, which was held on October 22-24, 2015 in Hangzhou, China. The conference was jointly organized by the China Academy of Printing Technology, Beijing Institute of Graphic Communication, and Hangzhou Dianzi University. With 3 keynote talks and 200 presented papers on graphic communications, packaging technologies and materials, the conference attracted more than 400 scientists.  These proceedings cover the recent research outcomes on color science and technology, image-processing technology, digital-media technology, printing-engineering technology, packaging-engineering technology etc. They will be of interest to university researchers, R&D engineers and graduate students in graphic communications, packaging, color science, image science, materials science, computer science, digital media and network technology fields.

Design Brief--Packaging: More than Just a Box! Communications: Getting the Message across with Advertising. Technology Learning Activities.

Science.gov (United States)

Technology Teacher, 1991

1991-01-01

Each technology learning activity in this article includes content description, objectives, required materials, challenge, and evaluation questions. Subjects are designing product packages and communication through advertising. (SK)

On interactions between Packaging and Logistics - Exploring implications of technological developments

OpenAIRE

Hellström, Daniel

2007-01-01

Packaging is a fundamental element in logistics systems. Packaging not only affects every logistical activity; it is also recognised as having a significant impact on logistics costs and performance. In order for logisticians and packaging professionals to gain insight into packaging-dependent costs and performance, the interactions between packaging systems and logistics systems must be understood. This is instead of dividing packaging and logistics into separate systems which are analysed o...

Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

Science.gov (United States)

Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

2017-08-30

The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

Experimental and theoretical analyses of package-on-package structure under three-point bending loading

International Nuclear Information System (INIS)

Jia Su; Wang Xi-Shu; Ren Huai-Hui

2012-01-01

High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates a chip scale package (CSP) in the top package and a fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results. (condensed matter: structural, mechanical, and thermal properties)

TREK1-a program package of modeling of the ion implantation of materials used in electronic techniques

International Nuclear Information System (INIS)

Leont'ev, A.V.; Nechaev, S.V.

1999-01-01

A package of computer programs is described which treats the slowing down of ions in solids by the means of Monte-Carlo method in the binary collision approximation for an amorphous substance using a screened Coulomb potential for nuclear collisions and the Brandt-Kitagawa theory for the electronic energy loss. For each nuclear collision, the impact parameter and the azimuthal deflection angle are determined from random numbers. The package contains a program of calculation of ion implantation whose features are described above, a database 'MME' (Materials of Micro Electronics) which stores all necessary data for the calculation, and a database control application providing an easy access to the data in MME. The programs of the package are made to run under Windows 95/98 and Windows NT operating systems. They were created using the following means: Borland Delphi 3.0, Paradox 7.0, Borland Database Engine 4.5. The running time of the calculation process depends on the problem chosen and is mainly influenced by the number of pseudo ions, their energy and atomic properties of the target. For the test example of 100 keV boron atoms incident PMMA, a calculation with 1*10 4 pseudo ions on a computer with the Pentium-166 processor requires about 2 min compared to 7 min by well known Trim95

Mathematics for electronic technology

CERN Document Server

Howson, D P

1975-01-01

Mathematics for Electronic Technology is a nine-chapter book that begins with the elucidation of the introductory concepts related to use of mathematics in electronic engineering, including differentiation, integration, partial differentiation, infinite series, vectors, vector algebra, and surface, volume and line integrals. Subsequent chapters explore the determinants, differential equations, matrix analysis, complex variable, topography, graph theory, and numerical analysis used in this field. The use of Fourier method for harmonic analysis and the Laplace transform is also described. The ma

Application of GA package in functional packaging

Science.gov (United States)

Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

2018-05-01

The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

Energy Technology Data Exchange (ETDEWEB)

Hoshi, T [Department of Applied Mathematics and Physics, Tottori University, Tottori 680-8550 (Japan); Fujiwara, T [Core Research for Evolutional Science and Technology, Japan Science and Technology Agency (CREST-JST) (Japan)

2009-02-11

An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

The Ettention software package

International Nuclear Information System (INIS)

Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

2016-01-01

We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

The Ettention software package

Energy Technology Data Exchange (ETDEWEB)

Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

2016-02-15

We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

The influence of electron-beam irradiation on some mechanical properties of commercial multilayer flexible packaging materials (PET MET/LDPE)

International Nuclear Information System (INIS)

Nogueira, Beatriz R.; Oliveira, Vitor M.; Moura, Esperidiana A.B.; Ortiz, Angel V.

2009-01-01

The treatment with electron-beam radiation is a promising approach to the controllable modification of the properties of the polymeric flexible packaging materials, in order to adjust their properties. In recent years electron-beam irradiation have been efficiently applied in the flexible packaging industry to promote crosslinking and scission of the polymeric chains in order to improve material mechanical properties. On the other hand, ionizing irradiation can also affect the polymeric materials itself leading to a production of free radicals. These free radicals can in turn lead to degradation and or cross-linking phenomena. The influence of electron beam irradiation on mechanical properties of commercial multilayer flexible packaging materials based on laminated low-density polyethylene (LDPE) and metallized poly(ethylene terephthalate) (PET) was studied. The PETmet/LDPE structure was irradiated with doses up to 120 kGy, using a 1.5 MeV electron beam accelerator, dose rate 11.22kGy/s, at room temperature in presence of air. The results showed that penetration resistance of the irradiated PETmet/LDPE film increase up to 10 %, except for radiation dose of 30 kGy that resulted in a slight decrease of ca. 3%, while the sealing resistance decreased ca. 8-26% in all doses (p < 0.05). In addition, the samples of PETmet/LDPE film at 45, 60, 75 and 105 kGy presented a gain up to 18 % in their original tensile strength at break, a gain of ca. 38% in their original elongation at break for radiation dose of 45 kGy and ca. 17% for radiation doses of 60, 75 and 120 kGy. (author)

Using computer technology to identify the appropriate radioactive materials packaging

International Nuclear Information System (INIS)

Driscoll, K.L.; Conan, M.R.

1989-01-01

The Radioactive Materials Packaging (RAMPAC) database is designed to store and retrieve information on all non-classified packages certified for the transport of radioactive materials within the boundaries of the US. The information in RAMPAC is publicly available, and the database has been designed so that individuals without programming experience can search for and retrieve information using a menu-driven system. RAMPAC currently contains information on over 650 radioactive material shipping packages. Information is gathered from the US Department of Energy (DOE), the US Department of transportation (DOT), and the US Nuclear Regulatory Commission (NRC). RAMPAC is the only tool available to radioactive material shippers that contains and reports packaging information from all three Federal Agencies. The DOT information includes package listings from Canada, France, Germany, Great Britain, and Japan, which have DOT revalidations for their certificates of competent authority and are authorized for use within the US for import and export shipments only. RAMPAC was originally developed in 1981 by DOE as a research and development tool. In recent years, however, RAMPAC has proven to be highly useful to operational personnel. As packages become obsolete or materials to be transported change, shippers of radioactive materials must be able to determine if alternative packages exist before designing new packages. RAMPAC is designed to minimize the time required to make this determination, thus assisting the operational community in meeting their goals

39 CFR 255.4 - Accessibility to electronic and information technology.

Science.gov (United States)

2010-07-01

... AND INFORMATION TECHNOLOGY § 255.4 Accessibility to electronic and information technology. (a) In... burden, that the electronic and information technology the agency procures allows— (1) Individuals with... 39 Postal Service 1 2010-07-01 2010-07-01 false Accessibility to electronic and information...

Building the electronic industry's roadmaps

Science.gov (United States)

Boulton, William R.

1995-02-01

JTEC panelists found a strong consistency among the electronics firms they visited: all the firms had clear visions or roadmaps for their research and development activities and had committed resources to ensure that they achieve targeted results. The overarching vision driving Japan's electronics industry is that of achieving market success through developing appealing, high-quality, low-cost consumer goods - ahead of the competition. Specifics of the vision include improving performance, quality, and portability of consumer electronics products. Such visions help Japanese companies define in detail the roadmaps they will follow to develop new and improved electronic packaging technologies.

QMCPACK: an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

Science.gov (United States)

Kim, Jeongnim; Baczewski, Andrew D.; Beaudet, Todd D.; Benali, Anouar; Chandler Bennett, M.; Berrill, Mark A.; Blunt, Nick S.; Josué Landinez Borda, Edgar; Casula, Michele; Ceperley, David M.; Chiesa, Simone; Clark, Bryan K.; Clay, Raymond C., III; Delaney, Kris T.; Dewing, Mark; Esler, Kenneth P.; Hao, Hongxia; Heinonen, Olle; Kent, Paul R. C.; Krogel, Jaron T.; Kylänpää, Ilkka; Li, Ying Wai; Lopez, M. Graham; Luo, Ye; Malone, Fionn D.; Martin, Richard M.; Mathuriya, Amrita; McMinis, Jeremy; Melton, Cody A.; Mitas, Lubos; Morales, Miguel A.; Neuscamman, Eric; Parker, William D.; Pineda Flores, Sergio D.; Romero, Nichols A.; Rubenstein, Brenda M.; Shea, Jacqueline A. R.; Shin, Hyeondeok; Shulenburger, Luke; Tillack, Andreas F.; Townsend, Joshua P.; Tubman, Norm M.; Van Der Goetz, Brett; Vincent, Jordan E.; ChangMo Yang, D.; Yang, Yubo; Zhang, Shuai; Zhao, Luning

2018-05-01

QMCPACK is an open source quantum Monte Carlo package for ab initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater–Jastrow type trial wavefunctions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary-field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performance computing architectures, including multicore central processing unit and graphical processing unit systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://qmcpack.org.

Structure of a headful DNA-packaging bacterial virus at 2.9 Å resolution by electron cryo-microscopy.

Science.gov (United States)

Zhao, Haiyan; Li, Kunpeng; Lynn, Anna Y; Aron, Keith E; Yu, Guimei; Jiang, Wen; Tang, Liang

2017-04-04

The enormous prevalence of tailed DNA bacteriophages on this planet is enabled by highly efficient self-assembly of hundreds of protein subunits into highly stable capsids. These capsids can stand with an internal pressure as high as ∼50 atmospheres as a result of the phage DNA-packaging process. Here we report the complete atomic model of the headful DNA-packaging bacteriophage Sf6 at 2.9 Å resolution determined by electron cryo-microscopy. The structure reveals the DNA-inflated, tensed state of a robust protein shell assembled via noncovalent interactions. Remarkable global conformational polymorphism of capsid proteins, a network formed by extended N arms, mortise-and-tenon-like intercapsomer joints, and abundant β-sheet-like mainchain:mainchain intermolecular interactions, confers significant strength yet also flexibility required for capsid assembly and DNA packaging. Differential formations of the hexon and penton are mediated by a drastic α-helix-to-β-strand structural transition. The assembly scheme revealed here may be common among tailed DNA phages and herpesviruses.

Evaluation of the effects of electron-beam irradiation on the puncture resistance by Lasioderma serricorne in flexible packaging of granola

International Nuclear Information System (INIS)

Oliveira, Vitor M.; Alves, Juliana N.; Nogueira, Beatriz R.; Moura, Esperidiana A.B.; Ortiz, Angel V.; Potenza, Marcos R.

2009-01-01

Lasioderma serricorne is a beetle that infests stored and industrialized dry foods such as cereal bars, granola, flour and pasta, amongst others, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by L. serricorne in BOPP/PP structure, used commercially as granola packaging after electron-beam irradiation. The irradiations were performed using a 1.5 MeV electron beam accelerator, dose rate of 11.22 kGy/s, at room temperature in presence of air, doses up to 120 kGy. After irradiation the BOPP/PP samples were subjected to tests of puncture resistance by L. serricorne, tensile strength, friction coefficient, penetration and seal strength. Results showed decreases in the original mechanical properties of the structure according to the radiation doses applied and effective resistance against punctures by L. serricorne (p<0.05). The results indicate that the irradiated and non-irradiated BOPP/PP structure, in the conditions studied in this work, is resistant against L. serricorne, however the decreases observed in the mechanical properties of the irradiated structure may turn it inappropriate for packaging granola. (author)

Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

Energy Technology Data Exchange (ETDEWEB)

Murray, Kieran A., E-mail: kmurray@research.ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); Kennedy, James E., E-mail: jkennedy@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); McEvoy, Brian, E-mail: Brian.Mcevoy@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Vrain, Olivier, E-mail: Olivier.Vrain@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Ryan, Damien, E-mail: Damien.Ryan@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Cowman, Richard, E-mail: Richard.Cowman@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Higginbotham, Clement L., E-mail: chigginbotham@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland)

2014-06-01

The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance.

Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

International Nuclear Information System (INIS)

Murray, Kieran A.; Kennedy, James E.; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L.

2014-01-01

The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance

Sticker electronics

KAUST Repository

Hussain, Muhammad Mustafa

2017-09-08

Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.

Electronic components and technology

CERN Document Server

Sangwine, Stephen

2007-01-01

Most introductory textbooks in electronics focus on the theory while leaving the practical aspects to be covered in laboratory courses. However, the sooner such matters are introduced, the better able students will be to include such important concerns as parasitic effects and reliability at the very earliest stages of design. This philosophy has kept Electronic Components and Technology thriving for two decades, and this completely updated third edition continues the approach with a more international outlook.Not only does this textbook introduce the properties, behavior, fabrication, and use

Research and Development of Fully Automatic Alien Smoke Stack and Packaging System

Science.gov (United States)

Yang, Xudong; Ge, Qingkuan; Peng, Tao; Zuo, Ping; Dong, Weifu

2017-12-01

The problem of low efficiency of manual sorting packaging for the current tobacco distribution center, which developed a set of safe efficient and automatic type of alien smoke stack and packaging system. The functions of fully automatic alien smoke stack and packaging system adopt PLC control technology, servo control technology, robot technology, image recognition technology and human-computer interaction technology. The characteristics, principles, control process and key technology of the system are discussed in detail. Through the installation and commissioning fully automatic alien smoke stack and packaging system has a good performance and has completed the requirements for shaped cigarette.

Thermal interface material characterization for cryogenic electronic packaging solutions

Science.gov (United States)

Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

2017-12-01

As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

Electron treatment of wood pulp for the viscose process

Science.gov (United States)

Stepanik, T. M.; Ewing, D. E.; Whitehouse, R.

2000-03-01

Electron processing is currently being evaluated by several viscose producers for integration into their process. The viscose industry converts dissolving wood pulp into products such as staple fibre, filament, cord, film, packaging, and non-edible sausage casings. These materials are used in the clothing, drapery, hygiene, automobile, food, and packaging industries. Viscose producers are facing increasingly high production costs and stringent environmental regulations that have forced some plants to close. Electron treatment of wood pulp can significantly reduce the amounts of chemicals used for producing viscose and the production of hazardous pollutants. Acsion Industries has worked with companies worldwide to demonstrate the benefits of using electron treated pulp for producing viscose (rayon). This paper describes the viscose process, the benefits of using electron treatment in the viscose process, and Acsion's efforts in developing this technology.

Applications and Advances in Electronic-Nose Technologies

Directory of Open Access Journals (Sweden)

Manuela Baietto

2009-06-01

Full Text Available Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software innovations and progress in microcircuitry design and systems integration. The invention of many new e-nose sensor types and arrays, based on different detection principles and mechanisms, is closely correlated with the expansion of new applications. Electronic noses have provided a plethora of benefits to a variety of commercial industries, including the agricultural, biomedical, cosmetics, environmental, food, manufacturing, military, pharmaceutical, regulatory, and various scientific research fields. Advances have improved product attributes, uniformity, and consistency as a result of increases in quality control capabilities afforded by electronic-nose monitoring of all phases of industrial manufacturing processes. This paper is a review of the major electronic-nose technologies, developed since this specialized field was born and became prominent in the mid 1980s, and a summarization of some of the more important and useful applications that have been of greatest benefit to man.

Intelligent food packaging - research and development

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2015-03-01

Full Text Available Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packaging refers to a package that can sense environmental changes, and in turn, informs the users about the changes. These packaging systems contain devices that are capable of sensing and providing information about the functions and properties of the packaged foods. Also, this paper will review intelligent packaging technologies and describe different types of indicators (time-temperature indicators, freshness indicators.

IFT Scientific Status Summary 2008: Innovative Food Packaging Solutions

Science.gov (United States)

Food and beverage packaging comprises 55-65% of the $110 billion value of packaging in the United States. This review provides a summary of innovative technology developments in food packaging. The expanded role of food and beverage packaging is reviewed. Active and intelligent food packaging, ba...

16 CFR 6.152 - Program accessibility: Electronic and information technology.

Science.gov (United States)

2010-01-01

... information technology. 6.152 Section 6.152 Commercial Practices FEDERAL TRADE COMMISSION ORGANIZATION... information technology. (a) When developing, procuring, maintaining, or using electronic and information... electronic and information technology allows, regardless of the type of medium of the technology: (1...

Investigation of an Electrostatic Discharge Protective Biodegradable Packaging Foam in the Logistic Chain

Directory of Open Access Journals (Sweden)

Mojzes Ákos

2014-11-01

Full Text Available Since the beginning of the 20th century, logistics has undergone a huge technological development, which has, however, resulted in many negative effects as well. The industry, particularly in the packaging industry has been a massive waste producer, although recently it has forced the use of new materials and it started to focus on environmentally friendly technologies. During the transportation of finished and semi-finished Electrostatic Discharge (ESD sensitive products, the product packaging system has a vital role. These kind of packaging materials must be suitable to both logistic (protection against mechanical and environmental stresses and special ESD protection requirements. During the transportation of printed-circuit electronic products, ESD defense is then of primary significance. However there is a huge disadvantage for the use of various shield bags. Namely, this kind of associated packaging is particularly pollutant, it causes a lot of inconvenience in the form of waste. In order to rule out these materials from the packaging system, new innovative solutions have to be found. The investigated TPS (thermoplastic starch biodegradable foam is subjected to a validation, a long process to certify that this material unites properties of two types of packaging materials at the same time. On the one hand, this packaging foam has to meet the requirements product defense. On the other hand, the material must be anti-static under the logistic stress effects. In case it is found suitable, it can be an alternative of the conventional materials. In this article, we investigate the ESD characteristic of TPS foam. As this material sensitive for environmental parameters during transportation, we make the relevant Surface Resistance (Rs tests on different temperature and humidity conditions. Based on result, the decision of the application can be done, as an ESD packaging material.

Packaging technology of LEDs for LCD backlights

International Nuclear Information System (INIS)

Fan Manning; Liang Meng; Wang Guohong

2009-01-01

We design a package patterned with red and green emitting phosphors excited by a blue LED to emit tri-basic mixing color. For high backlight display quality, we compare several phosphors. According to our measurements, green phosphors 0752G, 0753G and red phosphor 0763R are preferred for producing a good backlight source. Compared to RGB-LED backlight units, this frame typically benefits the lighting uniformity, and can simplify the structures. It also provides higher color render and better CCT than the traditional package method of a yellow phosphor with a blue chip. However, its light efficiency needs to be further improved for the use of backlights for LCDs.

Harsh-Environment Packaging for Downhole Gas and Oil Exploration

Energy Technology Data Exchange (ETDEWEB)

Shubhra Bansal; Junghyun Cho; Kevin Durocher; Chris Kapusta; Aaron Knobloch; David Shaddock; Harry Schoeller; Hua Xia

2007-08-31

This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the thermal-mechanical models of the material interactions and developing test structures to confirm these models. Discussions were initiated with the major General Electric (GE) businesses that currently sell into markets requiring high temperature electronics and packaging. They related the major modes of failure they encounter routinely and the hurdles needed to be overcome in order to improve the temperature specifications of these products. We consulted with our GE business partners about the reliability specifications and investigated specifications and guidelines that from IPC and the SAE body that is currently developing guidelines for electronics package reliability. Following this, a risk analysis was conducted for the program to identify the critical risks which need to be mitigated in order to demonstrate a flex-based packaging approach under these conditions. This process identified metal/polyimide adhesion, via reliability for flex substrates and high temperature interconnect as important technical areas for reliability improvement.

Advanced thermal management technologies for defense electronics

Science.gov (United States)

Bloschock, Kristen P.; Bar-Cohen, Avram

2012-05-01

Thermal management technology plays a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. For the past decade, and particularly, the past 4 years, the Defense Advanced Research Projects Agency (DARPA) has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT). An overview of the TMT program will be presented with emphasis on the goals and status of these efforts relative to the current State-of-the-Art. The presentation will close with future challenges and opportunities in the thermal management of defense electronics.

Thermo-mechanical model optimization of HB-LED packaging

NARCIS (Netherlands)

Yuan, C.A.; Erinc, M.; Gielen, A.W.J.; Waal, A. van der; Driel, W. van; Zhang, K.

2011-01-01

Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packaging plays a

Accessible Electronic and Information Technology

Science.gov (United States)

This Policy establishes EPA's responsibilities and procedures for making its Electronic and Information Technology (EIT) products accessible to all people, including people with disabilities, in accordance with Section 508 of the Rehabilitation Act.

Power electronics applied to industrial systems and transports

CERN Document Server

Patin, Nicolas

2015-01-01

Power electronics is based on the switching operating mode of semiconductor components. On this basis, the concepts of type (voltage or current) and reversibility of interconnected sources make it possible to apply a methodology for the synthesis of various types of converters. This book also focuses on the importance of packaging by reviewing the electrical representation of components’ thermal models and the currently available electronics’ cooling technologies. Modeling is discussed, as well as different technological aspects used in the engineering design of an electronic power converter, useful for obtaining satisfactory performance and reliability.

Status report on the relativistic electron beam technology

International Nuclear Information System (INIS)

Iyyengar, S.K.; Ron, P.H.; Rohatgi, V.K.

1974-01-01

The status of technology of the pulsed relativistic electron beam (REB) has been examined and summarised in this report. With the present technology the beam generator can be used either as a source of intense electron burst or to produce bursts of positive ions x and γ-rays, and neutrons by suitable secondary reactions. A large number of applications have been identified where this technology can play an important role. Typical applications of the technology include : (a) generation and heating of fusion plasma (b) development of high power laser and (c) sterilisation and radiation sources. The present day cost of radiation produced by REB is competitive with the cost of radiation produced from Co 60 source. At the same time there are indications that the cost of radiation from REB source can be significantly reduced with advanced technology. The type of equipment developed by various laboratories to study realitivistic electron beams is also included in this report. (author)

Establishing a store baseline during interim storage of waste packages and a review of potential technologies for base-lining

Energy Technology Data Exchange (ETDEWEB)

McTeer, Jennifer; Morris, Jenny; Wickham, Stephen [Galson Sciences Ltd. Oakham, Rutland (United Kingdom); Bolton, Gary [National Nuclear Laboratory Risley, Warrington (United Kingdom); McKinney, James; Morris, Darrell [Nuclear Decommissioning Authority Moor Row, Cumbria (United Kingdom); Angus, Mike [National Nuclear Laboratory Risley, Warrington (United Kingdom); Cann, Gavin; Binks, Tracey [National Nuclear Laboratory Sellafield (United Kingdom)

2013-07-01

Interim storage is an essential component of the waste management lifecycle, providing a safe, secure environment for waste packages awaiting final disposal. In order to be able to monitor and detect change or degradation of the waste packages, storage building or equipment, it is necessary to know the original condition of these components (the 'waste storage system'). This paper presents an approach to establishing the baseline for a waste-storage system, and provides guidance on the selection and implementation of potential base-lining technologies. The approach is made up of two sections; assessment of base-lining needs and definition of base-lining approach. During the assessment of base-lining needs a review of available monitoring data and store/package records should be undertaken (if the store is operational). Evolutionary processes (affecting safety functions), and their corresponding indicators, that can be measured to provide a baseline for the waste-storage system should then be identified in order for the most suitable indicators to be selected for base-lining. In defining the approach, identification of opportunities to collect data and constraints is undertaken before selecting the techniques for base-lining and developing a base-lining plan. Base-lining data may be used to establish that the state of the packages is consistent with the waste acceptance criteria for the storage facility and to support the interpretation of monitoring and inspection data collected during store operations. Opportunities and constraints are identified for different store and package types. Technologies that could potentially be used to measure baseline indicators are also reviewed. (authors)

Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

NARCIS (Netherlands)

Tian, J.

2013-01-01

The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

Technology and applications of electron accelerator

International Nuclear Information System (INIS)

Natsir, M.

1998-01-01

Technology of electron accelerator have been developed so fast in advanced countries. It was applied in the research and development (R and D) and comercially in various industries. The industries applying electron accelerator includes polymers industry, sterilization of medical tools, material surface modification, and environmental management. The radiation process using electron beam is an ionization radiation process. Two facilities of electron accelerator have been established in pilot scale at the Centre for the Application of Isotope and Radiation CAIR-BATAN, Jakarta, for the RandD of radiation process technology and in demonstrating the electron accelerator application in industry in Indonesia. The first has low energy specification of 300 keV, 50 mA, EPS-300 type and the second has medium energy specification of 2 MeV, 10 mA dynamitron model GJ-2 type. Both the electron accelerators have an electron penetration depth capability of 0.6 and 12 mm, respectively, for the double side irradiation in the materials with density of 1 g/cm 3 . They also highly capacity production and electron beam cross-section of 120 cm length and 10 cm width. The beam will go through the atmosphere for irradiation samples or industrial products. The radiation dose can be selected precisely by adjusting the electron beam current and conveyor speed. Both of these facilities were applied in many aspects RandD, for examples dosimetry, wood surface coating, cross-linking of polymer, heatshrincable tube, polymer grafting, plastic degradation, food preservation, sterilization and so on. Engineering factors of radiation design process and general observation of electron accelerator application in RandD for various industries in Indonesia are briefly discussed

Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

Science.gov (United States)

Riggs, William R.

1994-05-01

SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

Radiation effects evaluation for electrons sheaf in packages resistance in a Lasioderma serricorne, Plodia interpunctella and Sitophilus zeamais

International Nuclear Information System (INIS)

Alves, Juliana Nazare

2011-01-01

The plagues of stored products consist of a man problem, depreciating products and causing economical damages. Among these curses we have Lasioderma serricorne (F. 1792), Sitophilus zeamais (M. 1855) and Plodia interpunctella (H. 1813) known by infesting stored products as: grains, brans, flours, coffee, tobacco, dried fruits and spices. These curses perforate and penetrate the packages, ovipositing over the substratum. In this context the package plays a fundamental part, preventing the contact and curses' proliferation in the packed product. So, to protect the packed product and to prolong its shelf life, the package should have good mechanical resistance to tension and perforation, good sealing, good barrier properties and should not transfer odors nor strange flavors to the packed product. The ionizing radiation can cause structural changes in polymer packages, these changes are caused by the scission processes and reticulation of the polymers chains. These are concurrent processes and the predominance of one over the other depends on the chemical structure of the polymer, the irradiation conditions and specific factors of the material that will absorb the energy. This work had the objective to evaluate the changes in mechanical properties of package structures used to store granola, cereal bar and pasta, as well as its resistance to perforation by L. serricorne, P. interpunctella and S. zeamais, when submitted to electrons sheaf radiation. In this methodology were used five structures of commercially utilized packages to store granola, cereal bar and pasta composed by (Polypropylene bi-oriented metallic/Polypropylene bi-oriented coextruded - BOPPmet/BOPP 50 μm), (Polypropylene bi-oriented/Polypropylene - BOPP/PP 50 μm), Poli (ethylene terephthalate) metallic/Polypropylene bi-oriented coextruded - PETmet/BOPP 32 μm), Poli (ethylene terephthalate) /Polypropylene - PET/PP1 72 μm), Poli (ethylene terephthalate)/Polypropylene - PET/PP2 32 μm). The structures

Preferences of Informal Carers on Technology Packages to Support Meal Production by People Living with Dementia, Elicited from Personalised AT and ICT Product Brochures

Directory of Open Access Journals (Sweden)

Maria Laura De Filippis

2017-01-01

Full Text Available Assistive technology (AT can help support the continued independence of people living with dementia, supported by informal carers. Opinions and preferences of informal carers towards a range of assistive and digital information and communication technologies (ICT to support food purchase and menu selection, including navigation and online shopping, and safe meal-making by individuals living with dementia were investigated. General attitudes and experiences with assistive technologies were first probed by means of a focus group with carers (n = 6, organised through the Alzheimer’s Society in Nottingham, England. A series of AT/ICT product brochures were then produced, describing packages of technologies to enable meal production. Task-specific questions were asked of carers (n = 10 at local Memory Cafés as to the perceived capabilities of each individual for shopping and meal-making. Carers were asked to make pair-wise choices in order to select a personalised brochure and to complete a questionnaire to elicit the practicality, desirability and affordability of specific products and to probe for preferences amongst key features. Opinions on ease-of-use, aesthetics, expected safety-in-use, independence of use and stigma related to the technology packages were also collected. Results showed that carers are able to make detailed choices and express preferences about assistive and digital technologies for the individuals in their care, and customise their enabler package. Most believed that having an enabler package would improve safety. Greater exposure of carers to newer digital products would be beneficial. The brochure method could be employed on consumer websites and by AT assessors.

Sticker electronics

KAUST Repository

Hussain, Muhammad Mustafa; Torres Sevilla, Galo Andres; Diaz Cordero, Marlon Steven

2017-01-01

Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces

Selective joining technique for high power electronics; Selektive Verbindungstechnik fuer die Leistungselektronik

Energy Technology Data Exchange (ETDEWEB)

Fehrenbach, Manfred [EUTECT GmbH, Dusslingen (Germany)

2012-11-01

Stringent demands are placed on the quality, reliability and workmanship of electronic components in modern automotive electronics, high-performance LEDs (HLEDs) and regenerative electrical power generation. Automated selective integrated circuit packaging processes are increasingly becoming irreplaceable. Integrated circuit packing can be performed by means of mini-wave, laser, iron or hot-bar soldering, as well as the micro welding process. In addition to the modification of existing technologies, this also requires new joining technologies and test strategies for quality assurance. Interdisciplinary expertise with regard to process technology and system function is therefore essential for sound process assurance, maximum effectiveness and added value in the joining process. This article addresses the processing of THT electronics assemblies in the areas of printed-circuit boards, LEDs, flex foils, leadframes, hybrids and special types. Using high-power LED processes as examples, integrated circuit packaging is described for IMS, Osram Philips, Samsung and further LED designs, as well as printed-circuit board, flex-foil and jumper connections to the associated LED heat sinks. (orig.)

48 CFR 311.7000 - Defining electronic information technology requirements.

Science.gov (United States)

2010-10-01

... 48 Federal Acquisition Regulations System 4 2010-10-01 2010-10-01 false Defining electronic information technology requirements. 311.7000 Section 311.7000 Federal Acquisition Regulations System HEALTH... Accessibility Standards 311.7000 Defining electronic information technology requirements. HHS staff that define...

The application package DeCA for calculating cyclic accelerators

International Nuclear Information System (INIS)

Gladkikh, P.I.; Zelinsky, A.Yu.; Strelkov, M.A.

1993-01-01

The application Package DeCA (Design Cyclic Accelerator) is offered to solve a set of problem which arise on designing electron storage rings. The package is based on the block principle. This makes it extremely flexible in designing storage rings and investigating beam dynamics in them. The package is intended for a user not familiar with programming languages, it is arranged so that the user familiar with FORTRAN-77 can easily extend the package functions. This is of particular interest, when the input data are the storage ring or electron bunch parameters. The code allows operation in both the batch and interactive modes. The programming language is FORTRAN-77. The capacity of the total package is 40,000 code lines. The necessary main storage capacity for the total version is 4 Mbytes

Determining the feasibility of objective adherence measurement with blister packaging smart technology.

Science.gov (United States)

van Onzenoort, Hein A; Neef, Cees; Verberk, Willem W; van Iperen, H Peter; de Leeuw, Peter W; van der Kuy, Paul-Hugo M

2012-05-15

The results of a feasibility study of blister-pack smart technology for monitoring medication adherence are reported. Research in the area of objective therapy compliance measurement has led to the development of microprocessor-driven systems that record the time a unit dose is removed from blister packaging. One device under development is the Smart Blister-a label imprinted with event-detection circuitry that can be affixed to standard commercial blister cards. In the first trial of the device in actual clinical practice, 115 community-dwelling Dutch patients receiving valsartan maintenance therapy (160 mg once daily) were given 14-day blister packages equipped with the Smart Blister. On the return of empty blister cards to the 20 participating community pharmacies, the stored information was scanned and downloaded for data analysis and patient counseling purposes. A total of 245 Smart Blister-equipped packages were used by valsartan recipients during the eight-month study. The device was largely effective in recording patient and blister-card identification data and other desired information. However, in 17% of cases, the Smart Blister system registered multiple tablet-removal events at the same time, presumably indicating unintentional breakage of nearby conductive circuits and the need for design refinements. The Smart Blister-equipped medication cards were generally well received by patients and pharmacies. An evaluation of the functionality and robustness of the Smart Blister in a real-world clinical practice situation yielded some promising results, but the findings also indicated a need for design refinements and additional performance testing of the device.

HF electronic tubes. Technologies, grid tubes and klystrons

International Nuclear Information System (INIS)

Lemoine, Th.

2009-01-01

This article gives an overview of the basic technologies of electronic tubes: cathodes, electronic optics, vacuum and high voltage. Then the grid tubes, klystrons and inductive output tubes (IOT) are introduced. Content: 1 - context and classification; 2 - electronic tube technologies: cathodes, electronic optics, magnetic confinement (linear tubes), periodic permanent magnet (PPM) focussing, collectors, depressed collectors; 3 - vacuum technologies: vacuum quality, surface effects and interaction with electrostatic and RF fields, secondary emission, multipactor effect, thermo-electronic emission; 4 - grid tubes: operation of a triode, tetrodes, dynamic operation and classes of use, 'common grid' and 'common cathode' operation, ranges of utilisation and limitations, operation of a tetrode on unadjusted load, lifetime of a tetrode, uses of grid tubes; 5 - klystrons: operation, impact of space charge, multi-cavity klystrons, interaction efficiency, extended interaction klystrons, relation between interaction efficiency, perveance and efficiency, ranges of utilization and power limitations, multi-beam klystrons and sheet beam klystrons, operation on unadjusted load, klystron band pass and lifetime, uses; 6 - IOT: principle of operation, ranges of utilisation and limitations, interaction efficiency and depressed collector IOT, IOT lifetime and uses. (J.S.)

RECENT TRENDS IN PACKAGING SYSTEMS FOR PHARMACEUTICAL PRODUCTS

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2014-12-01

Full Text Available Background:  In recent years, pharmaceutical packaging market was one of the fastest growing areas of the packaging industry. At the same time the packaging manufacturers put high demands on quality and safety. Methods: Review of innovations in packaging systems for pharmaceutical products was made including newest information of researches and achievements of recent years. Results and conclusion: Observed in recent years the development of pharmaceutical packaging market expanded due to with the huge technological advances that allow introduction of new packaging. Also, in this study presented intelligent packaging in pharmacy and innovation in child-resistance packaging.

International Conference on NextGen Electronic Technologies

CERN Document Server

Thalmann, Nadia; Bhaaskaran, V

2017-01-01

This book is a collection of keynote lectures from international experts presented at International Conference on NextGen Electronic Technologies (ICNETS2-2016). ICNETS2 encompasses six symposia covering all aspects of electronics and communications domains, including relevant nano/micro materials and devices . This volume comprises of recent research in areas like computational signal processing analysis, intelligent embedded systems, nanoelectronic materials and devices, optical and microwave technologies, VLSI design: circuits systems and application, and wireless communication networks, and the internet of things. The contents of this book will be useful to researchers, professionals, and students working in the core areas of electronics and their applications, especially to signal processing, embedded systems, and networking.

Sustainable Steel Carburization by Using Snack Packaging Plastic Waste as Carbon Resources

Directory of Open Access Journals (Sweden)

Songyan Yin

2018-01-01

Full Text Available In recent years, the research regarding waste conversion to resources technology has attracted growing attention with the continued increase of waste accumulation issues and rapid depletion of natural resources. However, the study, with respect to utilizing plastics waste as carbon resources in the metals industry, is still limited. In this work, an environmentally friendly approach to utilize snack packaging plastic waste as a valuable carbon resources for steel carburization is investigated. At high temperature, plastic waste could be subject to pyrolytic gasification and decompose into small molecular hydrocarbon gaseous products which have the potential to be used as carburization agents for steel. When heating some snack packaging plastic waste and a steel sample together at the carburization temperature, a considerable amount of carbon-rich reducing gases, like methane, could be liberated from the plastic waste and absorbed by the steel sample as a carbon precursor for carburization. The resulting carburization effect on steel was investigated by optical microscopy, scanning electron microscopy, electron probe microanalyzer, and X-ray photoelectron spectrometer techniques. These investigation results all showed that snack packaging plastic waste could work effectively as a valuable carbon resource for steel carburization leading to a significant increase of surface carbon content and the corresponding microstructure evolution in steel.

Research and Application of WCF Technology in Data Acquisition of Ultra-high Speed Packaging Machine

Directory of Open Access Journals (Sweden)

Qian Jie

2016-01-01

Full Text Available By introducing WCF technology on data acquisition of ultra-high speed packaging machine, data acquisition system reads dates of machine in polling mode through the WCF client, which can achieve accurate data collection, and effectively isolate the data acquisition system and the machine control system. It enhances the security of data interaction between systems, but also reduces the coupling degree between systems.

Non-destructive testing of electronic component packages

International Nuclear Information System (INIS)

Anderle, C.

1975-01-01

A non-destructive method of investigating packaged parts of semiconductor components by X radiation is described and the relevant theoretical relations limiting this technique are derived. The application of the technique is demonstrated in testing several components. The described method is iNsimple and quick. (author)

12 CFR 352.5 - Accessibility to electronic and information technology.

Science.gov (United States)

2010-01-01

... and information technology. (a) In accordance with section 508 of the Rehabilitation Act, the FDIC shall ensure, absent an undue burden, that the electronic and information technology the agency develops... or procurement of electronic and information technology that meets the standards published by the...

Development of Transportation Package for Medical and Industrial Radioisotope

Energy Technology Data Exchange (ETDEWEB)

Seo, K. S.; Lee, J. C.; Bang, K. S. (and others)

2007-06-15

The objective of this project is development of RI transport package and establishment of transportation system. This report describes the objective of project, necessaries, state of related technology, scope and results, proposal for application etc. The scope of the project consist of establishment of performance test system for type-A package for medical use, development of type-B package for industrial use and development of casting technology for DU shield and evaluation of shielding efficiency. The research results obtained from this project are expected to be utilized as a basic data for design, analysis, test and license of transport package.

Values of Modern Technology to Electronic Media Management in ...

African Journals Online (AJOL)

This paper examines the influence, impact and communicative values of modern technology to electronic media management in Nigeria. It evaluates changes in distribution and consumer technologies, the impact on media content, new business models for the electronic media, and concludes with a discussion of issues ...

A comparison and benchmark of two electron cloud packages

Energy Technology Data Exchange (ETDEWEB)

Lebrun, Paul L.G.; Amundson, James F; Spentzouris, Panagiotis G; Veitzer, Seth A

2012-01-01

We present results from precision simulations of the electron cloud (EC) problem in the Fermilab Main Injector using two distinct codes. These two codes are (i)POSINST, a F90 2D+ code, and (ii)VORPAL, a 2D/3D electrostatic and electromagnetic code used for self-consistent simulations of plasma and particle beam problems. A specific benchmark has been designed to demonstrate the strengths of both codes that are relevant to the EC problem in the Main Injector. As differences between results obtained from these two codes were bigger than the anticipated model uncertainties, a set of changes to the POSINST code were implemented. These changes are documented in this note. This new version of POSINST now gives EC densities that agree with those predicted by VORPAL, within {approx}20%, in the beam region. The root cause of remaining differences are most likely due to differences in the electrostatic Poisson solvers. From a software engineering perspective, these two codes are very different. We comment on the pros and cons of both approaches. The design(s) for a new EC package are briefly discussed.

Advanced Space Suit Portable Life Support Subsystem Packaging Design

Science.gov (United States)

Howe, Robert; Diep, Chuong; Barnett, Bob; Thomas, Gretchen; Rouen, Michael; Kobus, Jack

2006-01-01

This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

Interferometry for the LISA technology package (LTP) aboard SMART-2

International Nuclear Information System (INIS)

Heinzel, G; Braxmaier, C; Schilling, R; Ruediger, A; Robertson, D; Plate, M te; Wand, V; Arai, K; Johann, U; Danzmann, K

2003-01-01

The interferometer of the LISA technology package (LTP) on SMART-2 is needed to verify the performance of the gravitational sensors by monitoring the distance between two test masses with a noise level of 10 pm Hz -1/2 between 3 mHz and 30 mHz. It must continuously track the motion of the test mass distance while that distance changes by many μm with a speed of up to 20 μm s -1 , without losing track of the sign of the motion and without exerting any influence on the test masses that might lead to a motion above that level. As a result of a detailed comparison study, a heterodyne Mach-Zehnder interferometer was selected as the baseline for the SMART-2 mission. Its design and expected performance are described in this paper

3D packaging of a microfluidic system with sensory applications

Science.gov (United States)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

LTP - LISA technology package: Development challenges of a spaceborne fundamental physics experiment

International Nuclear Information System (INIS)

Gerndt, R

2009-01-01

The LISA Technology Package (LTP) is the main payload onboard the LISA Pathfinder Spacecraft. The LTP Instrument together with the Drag-Free Attitude Control System (DFACS) and the respective LTP and DFACS operational software forms the LTP Experiment. It is completed by the FEEPs of the LPF spacecraft that are controlled by DFACS in order to control the spacecraft's attitude along with the experiment's needs. This article concentrates on aspects of the Industrial development of the LTP Instrument items and on essential performance issues of LTP. Examples of investigations on specific issue will highlight the kind of special problems to be solved for LTP in close cooperation with the Scientific Community.

HIGH VOLTAGE ENVIRONMENTAL APPLICATIONS, INC.ELECTRON BEAM TECHNOLOGY - INNOVATIVE TECHNOLOGY EVALUATION REPORT

Science.gov (United States)

This report evaluates a high-voltage electron beam (E-beam) technology's ability to destroy volatile organic compounds (VOCs) and other contaminants present in liquid wastes. Specifically, this report discusses performance and economic data from a Superfund Innovative Technology...

Multimedia package for LRFD concrete bridge design.

Science.gov (United States)

2009-02-01

This Project developed a Load and Resistance Factor Design (LRFD) multimedia package to provide a practical introduction and an in-depth understanding of the technological advances in the design of concrete bridges. This package can be used to train ...

Nanotechnology: An Untapped Resource for Food Packaging.

Science.gov (United States)

Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

2017-01-01

Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

Innovative food processing technology using ohmic heating and aseptic packaging for meat.

Science.gov (United States)

Ito, Ruri; Fukuoka, Mika; Hamada-Sato, Naoko

2014-02-01

Since the Tohoku earthquake, there is much interest in processed foods, which can be stored for long periods at room temperature. Retort heating is one of the main technologies employed for producing it. We developed the innovative food processing technology, which supersede retort, using ohmic heating and aseptic packaging. Electrical heating involves the application of alternating voltage to food. Compared with retort heating, which uses a heat transfer medium, ohmic heating allows for high heating efficiency and rapid heating. In this paper we ohmically heated chicken breast samples and conducted various tests on the heated samples. The measurement results of water content, IMP, and glutamic acid suggest that the quality of the ohmically heated samples was similar or superior to that of the retort-heated samples. Furthermore, based on the monitoring of these samples, it was observed that sample quality did not deteriorate during storage. © 2013. Published by Elsevier Ltd on behalf of The American Meat Science Association. All rights reserved.

Analysis of Design of Mixed-Signal Electronic Packaging

National Research Council Canada - National Science Library

Pileggi, Lawrence

1999-01-01

The objective of this project is to develop innovative algorithms and prototype tools that will help facilitate the design of mixed signal multi-chip modules and packaging in a manner that is similar...

Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications.

Science.gov (United States)

Morris, Michael A; Padmanabhan, Sibu C; Cruz-Romero, Malco C; Cummins, Enda; Kerry, Joseph P

2017-10-01

Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased customer demands for longer product shelf-life and storage capability. Consequently, conventional packaging materials and systems will have to evolve to meet these challenges. This review presents some of the new strategies that have been developed by employing novel nanotechnological concepts which have demonstrated some promise in significantly extending the shelf-life of muscle-based foods by providing commercially-applicable, antimicrobially-active, smart packaging solutions. The primary focus of this paper is applied to subject aspects, such as; material chemistries employed, forming methods utilised, interactions of the packaging functionalities including nanomaterials employed with polymer substrates and how such materials ultimately affect microbes. In order that such materials become industrially feasible, it is important that safe, stable and commercially-viable packaging materials are shown to be producible and effective in order to gain public acceptance, legislative approval and industrial adoption. Copyright © 2017. Published by Elsevier Ltd.

Interactive orbit control package for INDUS-2 storage ring

International Nuclear Information System (INIS)

Walia, A.A.S.; Ghodke, A.D.; Fatnani, Pravin; Bhujle, A.G.; Singh, Gurnam

2003-01-01

Maintaining the proper electron beam orbit is very important for all light sources. This package designed in Meatball provides for orbit control by just drag and drop. Simulation of Indus-2 storage ring in this package makes it useful for beam dynamic studies as well. Package functionality and architecture is described. (author)

Interactive orbit control package for INDUS-2 storage ring

Energy Technology Data Exchange (ETDEWEB)

Walia, A A.S.; Ghodke, A D; Fatnani, Pravin; Bhujle, A G; Singh, Gurnam [Centre for Advanced Technology, Indore (India)

2003-07-01

Maintaining the proper electron beam orbit is very important for all light sources. This package designed in Meatball provides for orbit control by just drag and drop. Simulation of Indus-2 storage ring in this package makes it useful for beam dynamic studies as well. Package functionality and architecture is described. (author)

Integrated microsystems packaging approach with LCP

Science.gov (United States)

Jaynes, Paul; Shacklette, Lawrence W.

2006-05-01

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging

Directory of Open Access Journals (Sweden)

Siyu Cai

2016-12-01

Full Text Available In this work, a novel processing method called powder thixoforming was proposed to prepare composites reinforced with 50 vol % of SiC particles (SiCp that were used for electronic packaging in order to investigate the effects of remelting duration on its microstructure and properties. Optical Microscope (OM, Scanning Electron Microscope (SEM, X-ray Diffraction (XRD and Transmission Electron Microscope (TEM methods were applied for the material characterization and the corresponding physical and mechanical properties were examined in detail. The obtained results indicate that the remelting duration exerted a large effect on the microstructure as well as the SiCp/Al interfacial reaction. The density and hardness of the composite continuously increased with increasing remelting duration. The thermal conductivity (TC and bending strength (BS first increased during the initial 90 min and then decreased. The remelting duration exerted a limited influence on the coefficient of thermal expansion (CTE. The optimal TC, BS, and hardness of these composites were up to 135.79 W/(m·K, 348.53 MPa, and 105.23 HV, respectively, and the CTE was less than 6.5 ppm/K after the composites were remelted at 600 °C for 90 min. The properties of the composites could thus be controlled to conform to the application requirements for electronic packaging materials.

76 FR 77738 - Telecommunications Act Accessibility Guidelines; Electronic and Information Technology...

Science.gov (United States)

2011-12-14

... Telecommunications Act Accessibility Guidelines and its Electronic and Information Technology Accessibility Standards... electronic and information technology covered by Section 508 of the Rehabilitation Act Amendments of 1998. 76.... 2011-07] RIN 3014-AA37 Telecommunications Act Accessibility Guidelines; Electronic and Information...

Advanced Manufacturing Systems in Food Processing and Packaging Industry

International Nuclear Information System (INIS)

Sani, Mohd Shafie; Aziz, Faieza Abdul

2013-01-01

In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

Advanced Manufacturing Systems in Food Processing and Packaging Industry

Science.gov (United States)

Shafie Sani, Mohd; Aziz, Faieza Abdul

2013-06-01

In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

Development directions of packaging made from polymer materials

Directory of Open Access Journals (Sweden)

Jovanović Slobodan

2011-01-01

Full Text Available World packaging market achieves turnover of about $620 billion per year with one third of this amount being associated to packaging made from polymer materials. It is expected that this kind of packaging consumption will hold at least 3% of world packaging market share in the next five years and that it will surpass the consumption of all other materials used in the packaging production. This can be contributed to product quality, low production costs as well as significant investments made in the development of polymer materials, packaging technology and packaging. This paper presents some development directions for packaging made from polymer materials, such as: packaging in the protective atmosphere, the use of active and intelligent packaging, and the use of biopolymers and recycled polymers for packaging production that come into direct contact with the packed product.

New Possibilities of Power Electronic Structures Using SiC Technology

Directory of Open Access Journals (Sweden)

Robert Sul

2006-01-01

Full Text Available This paper is dedicated to the recent unprecedented boom of SiC electronic technology. The contribution deals with brief survey of those properties. In particular, the differences (both good and bad between SiC electronics technology and well-known silicon VLSI technology are highlighted. Projected performance benefits of SiC electronics are given for several large-scale applications on the end of the contribution. The basic properties of SiC material have been discussed already on the beginning of 80’s, also at our university.

Advances in electronic-nose technologies developed for biomedical applications.

Science.gov (United States)

Wilson, Alphus D; Baietto, Manuela

2011-01-01

The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

Advances in Electronic-Nose Technologies Developed for Biomedical Applications

Directory of Open Access Journals (Sweden)

Alphus D. Wilson

2011-01-01

Full Text Available The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

Biobased Packaging - Application in Meat Industry

Directory of Open Access Journals (Sweden)

S. Wilfred Ruban

2009-04-01

Full Text Available Because of growing problems of waste disposal and because petroleum is a nonrenewable resource with diminishing quantities, renewed interest in packaging research is underway to develop and promote the use of “bio-plastics.” In general, compared to conventional plastics derived from petroleum, bio-based polymers have more diverse stereochemistry and architecture of side chains which enable research scientists a greater number of opportunities to customize the properties of the final packaging material. The primary challenge facing the food (Meat industry in producing bio-plastic packaging, currently, is to match the durability of the packaging with product shelf-life. Notable advances in biopolymer production, consumer demand for more environmentally-friendly packaging, and technologies that allow packaging to do more than just encompass the food are driving new and novel research and developments in the area of packaging for muscle foods. [Vet. World 2009; 2(2.000: 79-82

Effects of health-oriented descriptors on combustible cigarette and electronic cigarette packaging: an experiment among adult smokers in the United States.

Science.gov (United States)

Sanders-Jackson, Ashley; Tan, Andy S L; Yie, Kyeungyeun

2017-10-05

Certain tobacco companies use health-oriented descriptors (eg, 100% organic) on product packaging and advertising of combustible cigarettes or electronic cigarettes (e-cigarettes) that create a 'health halo' around smoking and vaping. Previous observational research suggests that such language may be associated with more favourable attitudes and reduced risk perceptions toward these brands compared with others. This study aimed to determine the effects of health-oriented descriptors on smokers' attitude toward the brand, perception of packaging information, comparative harm versus other brands and intention to purchase either combustible cigarettes or e-cigarettes. US adult smokers were randomly assigned to view either a health-oriented language package ('100% organic,' 'all natural' or 'no additives'), traditional marketing language package ('fine quality,' 'premium blend' or '100% original') or a no-language package of a combustible cigarette brand (Study 1, n=405) or an e-cigarette brand (Study 2, n=396) in an experimental design. Study 1: Participants in the health-oriented condition reported more favourable perceptions toward the package information, lower comparative harm and higher intention to purchase combustible cigarettes versus the no language control. In addition, participants in the health-oriented condition reported more positive attitude toward the brand and lower comparative harm versus the traditional marketing condition. Study 2: Compared with the traditional marketing condition, participants in the health-oriented condition reported greater intention to purchase Absolute e-cigarettes. There were no significant differences in attitude toward the brand, perception of packaging information and comparative harm versus other brands across conditions. The effect of health-oriented language was significant for combustible cigarettesand e-cigarette packages. Policies to restrict health-oriented language on cigarette and e-cigarette packaging are

Antimicrobial packaging with natural compunds - a review

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2016-12-01

Full Text Available Background:  Packaging problems are an integral part of logistics and the implementation of packaging significantly affects the effectiveness of logistics processes, as a factor which increases the safety and the quality of products being transported. Active packaging is an area of technology needed to meet the requirements of the contemporary consumer. Active packaging creates additional opportunities in systems for packing goods, as well as offering a solution in which the packaging, the product and surroundings interact. Furthermore, active packaging allows packaging to interact with food and the environment and play a dynamic role in food preservation. The main role of antimicrobial packaging is to inhibit the growth of microorganisms that reduce the quality of the packaged product. Methods: The application of natural antimicrobial agents appears to be safe for food products. Also, these compounds have potential applications as a natural preservative in the food packaging industry. This study presents some antibacterial agents, namely chitosan, nisin and pectins. Results and conclusion: Natural substances used in active packaging can eliminate the danger of chemical substances migrating to food.

LTP - LISA technology package: Development challenges of a spaceborne fundamental physics experiment

Energy Technology Data Exchange (ETDEWEB)

Gerndt, R, E-mail: ruediger.gerndt@astrium.eads.ne [Astrium Satellites GmbH, Claude-Dornier-Str., 88090 Immenstaad (Germany)

2009-03-01

The LISA Technology Package (LTP) is the main payload onboard the LISA Pathfinder Spacecraft. The LTP Instrument together with the Drag-Free Attitude Control System (DFACS) and the respective LTP and DFACS operational software forms the LTP Experiment. It is completed by the FEEPs of the LPF spacecraft that are controlled by DFACS in order to control the spacecraft's attitude along with the experiment's needs. This article concentrates on aspects of the Industrial development of the LTP Instrument items and on essential performance issues of LTP. Examples of investigations on specific issue will highlight the kind of special problems to be solved for LTP in close cooperation with the Scientific Community.

Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications

OpenAIRE

Morris, Michael A.; Padmanabhan, Sibu C.; Cruz-Romero, Malco C.; Cummins, Enda; Kerry, Joseph P.

2017-01-01

Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased custom...

Neural Implants, Packaging for Biocompatible Implants, and Improving Fabricated Capacitors

Science.gov (United States)

Agger, Elizabeth Rose

We have completed the circuit design and packaging procedure for an NIH-funded neural implant, called a MOTE (Microscale Optoelectronically Transduced Electrode). Neural recording implants for mice have greatly advanced neuroscience, but they are often damaging and limited in their recording location. This project will result in free-floating implants that cause less damage, provide rapid electronic recording, and increase range of recording across the cortex. A low-power silicon IC containing amplification and digitization sub-circuits is powered by a dual-function gallium arsenide photovoltaic and LED. Through thin film deposition, photolithography, and chemical and physical etching, the Molnar Group and the McEuen Group (Applied and Engineering Physics department) will package the IC and LED into a biocompatible implant approximately 100microm3. The IC and LED are complete and we have begun refining this packaging procedure in the Cornell NanoScale Science & Technology Facility. ICs with 3D time-resolved imaging capabilities can image microorganisms and other biological samples given proper packaging. A portable, flat, easily manufactured package would enable scientists to place biological samples on slides directly above the Molnar group's imaging chip. We have developed a packaging procedure using laser cutting, photolithography, epoxies, and metal deposition. Using a flip-chip method, we verified the process by aligning and adhering a sample chip to a holder wafer. In the CNF, we have worked on a long-term metal-insulator-metal (MIM) capacitor characterization project. Former Fellow and continuing CNF user Kwame Amponsah developed the original procedure for the capacitor fabrication, and another former fellow, Jonilyn Longenecker, revised the procedure and began the arduous process of characterization. MIM caps are useful to clean room users as testing devices to verify electronic characteristics of their active circuitry. This project's objective is to

Applications of electron beam technology for healthcare and environment

International Nuclear Information System (INIS)

Varshney, Lalit

2013-01-01

Radiation technology has matured from lab scale to industrial scale in many areas of interests to industry, healthcare, agriculture and environment. Some of the well established applications include radiation sterilization, wires and cable, composites for automobiles, radiation surface curing, nanomaterials, hydrogels and special materials for nuclear and aerospace industry, radiation treatment of effluents, sewage sludge etc. These applications are as a result of characteristics of high energy radiation like gamma and electron beams which are able to deliver energy directly at molecular level. Unlike nuclear based radiations, electron beam accelerator technology is amenable to easy acceptance by public as well has capability to manipulate processes and product treatment to produce varieties of advanced/smart materials for healthcare and environment. Faster dose rates and depth profiling are the important characteristics of electron beam technology which gives it an edge over gamma radiation processing. Department of Atomic Energy has an ambitious program to indigenously develop accelerator technology and utilize them for national progress. In the presentation some important applications of radiation technology will be discussed. (author)

Technology scan for electronic toll collection.

Science.gov (United States)

2008-06-01

The purpose of this project was to identify and assess available technologies and methodologies for electronic toll collection (ETC) and to develop recommendations for the best way(s) to implement toll collection in the Louisville metropolitan area. ...

Antimicrobial food packaging: potential and pitfalls

Science.gov (United States)

Malhotra, Bhanu; Keshwani, Anu; Kharkwal, Harsha

2015-01-01

Nowadays food preservation, quality maintenance, and safety are major growing concerns of the food industry. It is evident that over time consumers’ demand for natural and safe food products with stringent regulations to prevent food-borne infectious diseases. Antimicrobial packaging which is thought to be a subset of active packaging and controlled release packaging is one such promising technology which effectively impregnates the antimicrobial into the food packaging film material and subsequently delivers it over the stipulated period of time to kill the pathogenic microorganisms affecting food products thereby increasing the shelf life to severe folds. This paper presents a picture of the recent research on antimicrobial agents that are aimed at enhancing and improving food quality and safety by reduction of pathogen growth and extension of shelf life, in a form of a comprehensive review. Examination of the available antimicrobial packaging technologies is also presented along with their significant impact on food safety. This article entails various antimicrobial agents for commercial applications, as well as the difference between the use of antimicrobials under laboratory scale and real time applications. Development of resistance amongst microorganisms is considered as a future implication of antimicrobials with an aim to come up with actual efficacies in extension of shelf life as well as reduction in bacterial growth through the upcoming and promising use of antimicrobials in food packaging for the forthcoming research down the line. PMID:26136740

Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends.

Science.gov (United States)

Murray, Kieran A; Kennedy, James E; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L

2014-06-01

The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. Copyright © 2014. Published by Elsevier B.V.

Packaging for consumer electronic products: The need for integrating design and engineering

OpenAIRE

Wever, R.; Boks, C.; Stevels, A.

2008-01-01

From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of packaging for CE goods would imply a process that takes into account all requirements, whether they are technical, financial, environmental or psychological in nature, and that also incorporates the rel...

Technological guns which form the profiled electron beans

International Nuclear Information System (INIS)

Mel'nik, V.I.

1998-01-01

Electron guns with high-voltage glow discharge are developed which form disc - and tubule-like,hollow conic and linear electron beams,as well as devices and systems for control of gun parameter and technological processes in low and intermediate vacuum

Effects of electron beam radiation on mechanical properties and on the resistance to punctures caused by Plodia interpunctella in cereal bar packaging

International Nuclear Information System (INIS)

Alves, Juliana N.; Moura, Esperidiana A.B.; Oliveira, Vitor M.; Potenza, Marcos R.; Arthur, Valter

2009-01-01

Plodia interpunctella is an important pest in stored products in the tropical and subtropical regions, infesting grains and flours. The adult of P. interpunctella is a small butterfly with about 15 - 20mm of spread and the female places separately of 100 the 400 eggs in groups on the grains whose hard incubation some days. This insect infesting diverse types of food packaging, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by P. interpunctella in BOPPmet/BOPP structure, used commercially as cereal bar packaging, after electron beam irradiation. The material samples were irradiated up to 120 kGy using a 1.5 MeV electrostatic accelerator, at room temperature, in air, dose rate 11.22 kGy/s. Irradiation doses were measured using cellulose triacetate film dosimeters 'CTA-FTR-125' from Fuji Photo Film Co. Ltd. After irradiation the BOPPmet/BOPP samples were subjected to tests of puncture resistance by P. interpunctella, tensile tests and penetration resistance. The results showed significant decreases (p<0.05) in the original mechanical properties of the structures according to the radiation doses applied and effective resistance against punctures by P. interpunctella for irradiated and nonirradiated BOPPmet/BOPP samples. These results indicate that non-irradiated and irradiated BOPPmet/BOPP structure presents puncture resistance against P. interpunctella and that electron-beam irradiation, in conditions studied in this work, may turn the structure inappropriate for cereal bar packaging, due to high reduction its mechanical properties after irradiation. (author)

Recent developments in intelligent packaging for enhancing food quality and safety.

Science.gov (United States)

Sohail, Muhammad; Sun, Da-Wen; Zhu, Zhiwei

2018-03-07

The role of packaging cannot be denied in the life cycle of any food product. Intelligent packaging is an emerging technology in the food packaging sector. Although it still needs its full emergence in the market, its importance has been proved for the maintenance of food quality and safety. The present review describes several aspects of intelligent packaging. It first highlights different tools used in intelligent packaging and elucidates the role of these packaging devices for maintaining the quality of different food items in terms of controlling microbial growth and gas concentration, and for providing convenience and easiness to its users in the form of time temperature indication. This review also discusses other intelligent packaging solutions in supply chain management of food products to control theft and counterfeiting conducts and broaden the image of the food companies in terms of branding and marketing. Overall, intelligent packaging can ensure food quality and safety in the food industry, however there are still some concerns over this emerging technology including high cost and legal aspects, and thus future work should be performed to overcome these problems for further promoting its applications in the food industry. Moreover, work should also be carried out to combine several single intelligent packaging devices into a single one, so that most of the benefits from this emerging technology can be achieved.

Molding compound trends in a denser packaging world: Qualification tests and reliability concerns

Science.gov (United States)

Nguyen, L. T.; Lo, R. H. Y.; Chen, A. S.; Belani, J. G.

1993-12-01

Molding compound development has traditionally been driven by the memory market, then subsequent applications filter down to other IC technologies such as logic, analog, and ASIC. However, this strategy has changed lately with the introduction of thin packages such as PQFP & TSOP. Rather than targeting a compound for a family of IC such as DRAM or SRAM, compound development efforts are now focused at specific classes of packages. The configurations of these thin packages impose new functional requirements that need to be revisited to provide the optimized combination of properties. The evolution of qualification tests mirrors the advances in epoxy and compounding technologies. From the first standard novolac-based epoxies of the 1970s to the latest 3(sup rd)-generation ultra-low stress materials, longer test times at increasingly harsher environments were achieved. This paper benchmarks the current reliability tests used by the electronic industry, examines those tests that affect and are affected by the molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability, package stresses, package cracking, halogen-induced intermetallic growth at bond pads, moisture-induced corrosion, and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended. Accelerated tests are designed to apply to a limited quantity of devices, bias, or environmental conditions larger than usual ratings, to intensify failure mechanisms that would occur under normal operating conditions. The observed behavior is then extrapolated from the lot to the entire population. Emphasis is on compressing the time necessary to obtain reliability data. This approach has two main drawbacks. With increasingly complex devices, even accelerated tests are expensive. And with new technologies, it becomes

The role of packaging in preserving the quality of food

International Nuclear Information System (INIS)

Varsanyi, I.

1979-01-01

The causes of food decomposition and the different conserving methods are reviewed. Among the physical conserving procedures the ionizing gamma and electron radiations are more and more widely used. The applied radiation dose is intended to exterminate even the most resistant microorganisms, e.g. the spores of Clostridium botulinum, but it should not damage the food product. The appropiate packaging material should be chosen according to the conserving technology, as radiation may alter the consistence of modern plastics (they become more rigid or fragile) or chemical disintegration can be induced rendering the product unenjoyable. (L.E.)

Low voltage electron beam accelerators

International Nuclear Information System (INIS)

Ochi, Masafumi

2003-01-01

Widely used electron accelerators in industries are the electron beams with acceleration voltage at 300 kV or less. The typical examples are shown on manufactures in Japan, equipment configuration, operation, determination of process parameters, and basic maintenance requirement of the electron beam processors. New electron beam processors with acceleration voltage around 100 kV were introduced maintaining the relatively high dose speed capability of around 10,000 kGy x mpm at production by ESI (Energy Science Inc. USA, Iwasaki Electric Group). The application field like printing and coating for packaging requires treating thickness of 30 micron or less. It does not require high voltage over 110 kV. Also recently developed is a miniature bulb type electron beam tube with energy less than 60 kV. The new application area for this new electron beam tube is being searched. The drive force of this technology to spread in the industries would be further development of new application, process and market as well as the price reduction of the equipment, upon which further acknowledgement and acceptance of the technology to societies and industries would entirely depend. (Y. Tanaka)

Low voltage electron beam accelerators

Energy Technology Data Exchange (ETDEWEB)

Ochi, Masafumi [Iwasaki Electric Co., Ltd., Tokyo (Japan)

2003-02-01

Widely used electron accelerators in industries are the electron beams with acceleration voltage at 300 kV or less. The typical examples are shown on manufactures in Japan, equipment configuration, operation, determination of process parameters, and basic maintenance requirement of the electron beam processors. New electron beam processors with acceleration voltage around 100 kV were introduced maintaining the relatively high dose speed capability of around 10,000 kGy x mpm at production by ESI (Energy Science Inc. USA, Iwasaki Electric Group). The application field like printing and coating for packaging requires treating thickness of 30 micron or less. It does not require high voltage over 110 kV. Also recently developed is a miniature bulb type electron beam tube with energy less than 60 kV. The new application area for this new electron beam tube is being searched. The drive force of this technology to spread in the industries would be further development of new application, process and market as well as the price reduction of the equipment, upon which further acknowledgement and acceptance of the technology to societies and industries would entirely depend. (Y. Tanaka)

Warpage behavior analysis in package processes of embedded copper substrates

Directory of Open Access Journals (Sweden)

Hwang Yeong-Maw

2017-01-01

Full Text Available With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packaging technology, especially for substrates with embedded copper trace. During the packaging process, the substrate usually warps because of the heating process. In this paper, a finite element software ANSYS is used to model the embedded copper trace substrate and simulate the thermal and deformation behaviors of the substrate during the heating package process. A fixed geometric configuration equivalent to the real structure is duplicated to make the simulation of the warpage behavior of the substrate feasible. An empirical formula for predicting the warpage displacements is also established.

Polymedication Electronic Monitoring System (POEMS) - a new technology for measuring adherence.

Science.gov (United States)

Arnet, Isabelle; Walter, Philipp N; Hersberger, Kurt E

2013-01-01

Reliable and precise measurement of patient adherence to medications is feasible by incorporating a microcircuitry into pharmaceutical packages of various designs, such that the maneuvers needed to remove a dose of drug are detected, time-stamped, and stored. The principle is called "electronic medication event monitoring" but is currently limited to the monitoring of a single drug therapy. Our aims were introducing a new technology; a clear, self-adhesive polymer film, with printed loops of conductive wires that can be affixed to multidrug punch cards for the electronic adherence monitoring of multiple medication regimens (Polymedication Electronic Monitoring System, POEMS), and illustrating potential benefits for patient care. We present a preliminary report with one patient experience. Our illustrative case was supplied with a pre-filled 7-day multiple medication punch card with unit-of-use doses for specific times of the day (six pills in the morning cavity, two pills in the evening cavity, and one pill in case of insomnia in the bedtime cavity), with the new electronic film affixed on it. The intake times over 1 week were extremely skewed (median intake hours at 2:00 pm for the morning doses and at 6:40 pm for the evening doses). After an intervention aimed at optimizing the timing adherence, the morning and evening intake hours became more balanced, with 42.3% of correct dosing intervals (±3 h) for drugs with twice daily intake (vs. 0% before the intervention). The electronic monitoring of the entire therapy revealed an intake pattern that would have remained undiscovered with any other device and allowed a personalized intervention to correct an inadequate medication intake behavior. POEMS may guide health professionals when they need to optimize a pharmacotherapy because of suspected insufficient adherence. Further, knowing the intake pattern of the entire pharmacotherapy can elucidate unreached clinical outcome, drug-drug interactions, and drug resistance

Study on tamper-indicating technology in electronic seals system

International Nuclear Information System (INIS)

Xu Xiong; Han Feng; Zuo Guangxia; Zhao Xin; Zhang Quanhu; Di Yuming

2009-01-01

To strengthen our national arms control verification technical storage and deepen electronic seals' research, this paper mainly introduces seals' characteristics, functions and work principle, studies on tamper-indicating technology which is a key technology in electronic seals, designs some hardware circuit such as optical transceiver, temperature detection circuit, move detection circuit, re-prized circuit and so on, also designs a software program which is used for recording the destroying or tampering events' information. Experimental results show that electronic seals system can record the destroying or tampering events' information accurately and quickly, and give corresponding tamper-indication. (authors)

Software Package STATISTICA and Educational Process

Directory of Open Access Journals (Sweden)

Demidova Liliya

2016-01-01

Full Text Available The paper describes the main aspects of application of the software package STATISTICA in the educational process. Technologies of data mining which can be useful for students researches have been considered. The main tools of these technologies have been discussed.

Applications and technology of electron beam accelerators

International Nuclear Information System (INIS)

Sethi, R.C.

2005-01-01

Traditionally, accelerators have been employed for pursuing research in basic sciences. But over the last couple of decades their uses have proliferated into the applied fields as well. The major credit for which goes to the electron beams. Electron beams or the radiations generated by them are being extensively used in almost all the applied areas. This article is a brief account of the impact made by the accelerator based electron beams and the attempts initiated by DAE for building a base in this technology. (author)

Food packaging and radiation sterilization

International Nuclear Information System (INIS)

Kawamura, Yoko

1998-01-01

Radiation sterilization has several merits that it is a positively effective sterilization method, it can be used to sterilize low heat-resistant containers and high gas barrier films, and there is no possibility of residual chemicals being left in the packages. It has been commercially used in 'Bag in a Box' and some food containers. The γ ray and an electron beam are commonly used in radiation sterilization. The γ ray can sterilize large size containers and containers with complex shapes or sealed containers due to its strong transmission capability. However, since the equipment tends to be large and expensive, it is generally used in off production lines. On the other hand, it is possible to install and electron beam system on food production lines since the food can be processed in a short time due to its high beam coefficient and its ease of maintenance, even though an electron beam has limited usage such as sterilizing relatively thin materials and surface sterilization due to the weak transmission. A typical sterilization dose is approximately 10-30 kGy. Direct effects impacting packaging materials, particularly plastics, include scission of polymer links, cross-linkage between polymers, and generating radiolysis products such as hydrogen, methane, aliphatic hydrocarbons, etc. Furthermore, under the existence of oxygen, the oxygen radicals generated by the radiation will oxidize and peroxidize polymer chains and will generate alcohol and carbonyl groups, which shear polymer links, and generate oxygen containing low molecular compounds. As a result, degradation of physical strength such as elongation and seal strength, generating foreign odor, and an increase in global migration values shown in an elution test are sometimes evident. The food packages have different shapes, materials, additives, number of microorganisms and purpose. Therefor the effects of radiation, the optimum dose and so on must be investigated on the individual package. (J.P.N.)

Electro-Optics Millimeter/Microwave Technology in Japan. Report of DoD Technology Team.

Science.gov (United States)

1985-05-01

sink packages covering frequencies up to 94 GHz is being produced. They are suitable for both con- tinuous wave (CW) and pulsed operations. Mean -time...Processing Tel ecommunications Semiconductor and Electronic Components The Technology Team visited the Fujitsu Laboratory, Kanagawa. Topics covered included...Japan, the representatives of the Government of Japan and the Government of the United States of America have held discussions on the ways and means to

International PolyScene-workshop on polymer electronics. Proceedings

Energy Technology Data Exchange (ETDEWEB)

NONE

2003-07-01

Topics of this proceedings are: RFID: tagging the opportunities and threats for polymer electronics; polymeric semiconductor development for thin film transistors; hole and electron transport in semiconducting polymers for organic electronics; a circuit based strategy for the development of polymer TFTS; towards a technology for all-polymer electronics; electrically doped organic semiconductors: physics and device applications; organic solar cells and photodetectors; organic solar cells: trends, challenges and positioning in the field of thin-film solar cell technologies; technical production of plastic solar cells: an overview; optical and ESR studies on polymer/fullerene composites for solar cells; targets for OTFT development for active matrix displays; reflective electroactive display (READ) technology and opportunities in printed devices; OFETs, OLEDs, OLDs: organic devices for future polytronic systems; design of active polymer materials and their application in electronic devices; blue emitting ALQ3 for full color organic displays; technologies for the reel-to-reel production of flexible polytronic systems; new developments in polyester films for flexible electronics; printed conductive polymer structures; non-lithographic patterning of polymer transistors; laser structuring- a method for polymer and metal patterning; direct printing of polymer transistor circuits; molecular design of interphases - the key for the development of reliable polymer based products; wafer level packaging - encapsulation of micro structures.

ADVANCED TECHNOLOGIES OF ELECTRONIC EDUCATIONAL SYSTEMS DEVELOPMENT

Directory of Open Access Journals (Sweden)

M. Shishkina

2011-11-01

Full Text Available Actual problems and contradictions of electronic educational systems development are described: availability of education, quality of educational services; individualization of education; exposures and advantages in using of computer technology; standardization of technologies and resources. Tendencies of their solution in the view of development of new advanced technologies of e-education are specified. The essence and advantages of using the cloud computing technologies as a new platform of distributed learning are specified. Advanced directions of cloud-based data usage in executive system of education are declared: access management, content management, asset management, communications management.

Availability, Price, and Packaging of Electronic Cigarettes and E-Liquids in Guatemala City Retailers.

Science.gov (United States)

Chacon, Violeta; Arriaza, Astrid; Cavazos-Rehg, Patricia; Barnoya, Joaquin

2018-01-05

Electronic cigarettes (e-cigarettes) have the potential to normalize smoking and undermine tobacco control efforts. However, if well regulated, they also have a potential as smoking cessation aids. This study sought to determine the availability and types of e-cigarettes and e-liquids in Guatemala. We also assessed packaging characteristics and price. We surveyed a convenient sample of 39 Guatemala City retailers and purchased all e-cigarettes and e-liquids available. Duplicate samples (same brand, e-liquid type, flavor, nicotine content, or packaging) were purchased when prices were different between each other. Country of manufacture, flavor, expiration date, nicotine concentration, and price were recorded. We also documented package marketing strategies and warning labels. We purchased 64 e-cigarettes (53 unique and 11 duplicates) and 57 e-liquids (52 unique and 5 duplicates), mostly found on mall retailers. Most e-cigarettes (42, 66%) were first generation, followed by second (18, 28%) and third generations (4, 6%). Price of e-cigarettes differed significantly by generation. Most e-cigarettes (31, 58%) and 24 (46%) e-liquids did not include warning labels. Nicotine content was reported in 21 (39%) e-cigarettes that included e-liquids and 41 (79%) e-liquids' packages. E-cigarettes and e-liquids are available among a variety of retailers in Guatemala City and the industry is taking advantage of the fact that they are not regulated (eg, health claims, minimum sales age, and taxation). Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. To the best of our knowledge, this is the first study describing e-cigarettes and e-liquids available in retailers in a low/middle-income country like Guatemala. E-cigarettes and e-liquids were found in a variety of types, flavors, and nicotine concentrations in Guatemalan retailers. Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. © The Author

The Ettention software package.

Science.gov (United States)

Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

2016-02-01

We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

Small compact pulsed electron source for radiation technologies

International Nuclear Information System (INIS)

Korenev, Sergey

2002-01-01

The small compact pulsed electron source for radiation technologies is considered in the report. The electron source consists of pulsed high voltage Marx generator and vacuum diode with explosive emission cathode. The main parameters of electron source are next: kinetic energy is 100-150 keV, beam current is 5-200 A and pulse duration is 100-400 nsec. The distribution of absorbed doses in irradiated materials is considered. The physical feasibility of pulsed low energy electron beam for applications is considered

Printed electronic on flexible and glass substrates

Science.gov (United States)

Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna

2010-09-01

Organic electronics is a platform technology that enables multiple applications based on organic electronics but varied in specifications. Organic electronics is based on the combination of new materials and cost-effective, large area production processes that provide new fields of application. Organic electronic by its size, weight, flexibility and environmental friendliness electronics enables low cost production of numerous electrical components and provides for such promising fields of application as: intelligent packaging, low cost RFID, flexible solar cells, disposable diagnostic devices or games, and printed batteries [1]. The paper presents results of inkjetted electronics elements on flexible and glass substrates. The investigations was target on characterizing shape, surface and geometry of printed structures. Variety of substrates were investigated, within some, low cost, non specialized substrate, design for other purposes than organic electronic.

Effects of wafer-level packaging on millimetre-wave antennas

KAUST Repository

Abutarboush, Hattan

2011-11-01

A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna\\'s reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.

Packaged solar water heating technology: twenty years of progress

International Nuclear Information System (INIS)

Morrison, Graham; Wood, Byard

2000-01-01

The world market for packaged solar water heaters is reviewed, and descriptions are given of the different types of solar domestic water heaters (SDWH), design concepts for packaged SDWH, thermosyphon SDWH, evacuated insulation and excavated tube collectors, seasonally biased solar collectors, heat pump water heaters, and photovoltaic water heaters. The consumer market value for SDWHs is explained, and the results of a survey of solar water heating are summarised covering advantages, perceived disadvantages, the relative importance of purchase decision factors, experience with system components, and the most frequent maintenance problems. The durability, reliability, and performance of SDWHs are discussed

Enhanced lateral heat dissipation packaging structure for GaN HEMTs on Si substrate

International Nuclear Information System (INIS)

Cheng, Stone; Chou, Po-Chien; Chieng, Wei-Hua; Chang, E.Y.

2013-01-01

This work presents a technology for packaging AlGaN/GaN high electron mobility transistors (HEMTs) on a Si substrate. The GaN HEMTs are attached to a V-groove copper base and mounted on a TO-3P leadframe. The various thermal paths from the GaN gate junction to the case are carried out for heat dissipation by spreading to protective coating; transferring through the bond wires; spreading in the lateral device structure through the adhesive layer, and vertical heat spreading of silicon chip bottom. Thermal characterization showed a thermal resistance of 13.72 °C/W from the device to the TO-3P package. Experimental tests of a 30 mm gate-periphery single chip packaged in a 5 × 3 mm V-groove Cu base with a 100 V drain bias showed power dissipation of 22 W. -- Highlights: ► An enhanced packaging structure designed for AlGaN/GaN HEMTs on an Si substrate. ► The V-groove copper base is designed on the device periphery surface heat conduction for enhancing Si substrate thermal dissipation. ► The proposed device shows a lower thermal resistance and upgrade in thermal conductivity capability. ► This work provides useful thermal IR imagery information to aid in designing high efficiency package for GaN HEMTs on Si

Robust design and thermal fatigue life prediction of anisotropic conductive film flip chip package

International Nuclear Information System (INIS)

Nam, Hyun Wook

2004-01-01

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF(Anisotropic Conductive Film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design Of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2 nd DOE was conducted to obtain RSM equation for the choose 3 design parameter. The coefficient of determination (R 2 ) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for Feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430μm, and 78μm, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter

TECHNOLOGY FOR DEVELOPMENT OF ELECTRONIC TEXTBOOK ON HANDICRAFTS METHODOLOGY

Directory of Open Access Journals (Sweden)

Iryna V. Androshchuk

2017-10-01

Full Text Available The main approaches to defining the concept of electronic textbook have been analyzed in the article. The main advantages of electronic textbooks in the context of future teachers’ training have been outlined. They are interactivity, feedback provision, availability of navigation and search engine. The author has presented and characterized the main stages in the technology of development of an electronic textbook on Handicraft and Technology Training Methodology: determination of its role and significance in the process of mastering the discipline; justification of its structure; outline of the stages of its development in accordance with the defined structure. The characteristic feature of the developed electronic textbook is availability of macro- and microstructure. Macrostructure is viewed as a sequence of components of the electronic textbook that are manifested in its content; microstructure is considered to be an internal pattern of each component of macrostructure.

Organic electronics emerging concepts and technologies

CERN Document Server

Santato, Clara

2013-01-01

An overview of the tremendous potential of organic electronics, concentrating on those emerging topics and technologies that will form the focus of research over the next five to ten years. The young and energetic team of editors with an excellent research track record has brought together internationally renowned authors to review up-and-coming topics, some for the first time, such as organic spintronics, iontronics, light emitting transistors, organic sensors and advanced structural analysis. As a result, this book serves the needs of experienced researchers in organic electronics, graduate

High Temperature Wireless Communication And Electronics For Harsh Environment Applications

Science.gov (United States)

Hunter, G. W.; Neudeck, P. G.; Beheim, G. M.; Ponchak, G. E.; Chen, L.-Y

2007-01-01

In order for future aerospace propulsion systems to meet the increasing requirements for decreased maintenance, improved capability, and increased safety, the inclusion of intelligence into the propulsion system design and operation becomes necessary. These propulsion systems will have to incorporate technology that will monitor propulsion component conditions, analyze the incoming data, and modify operating parameters to optimize propulsion system operations. This implies the development of sensors, actuators, and electronics, with associated packaging, that will be able to operate under the harsh environments present in an engine. However, given the harsh environments inherent in propulsion systems, the development of engine-compatible electronics and sensors is not straightforward. The ability of a sensor system to operate in a given environment often depends as much on the technologies supporting the sensor element as the element itself. If the supporting technology cannot handle the application, then no matter how good the sensor is itself, the sensor system will fail. An example is high temperature environments where supporting technologies are often not capable of operation in engine conditions. Further, for every sensor going into an engine environment, i.e., for every new piece of hardware that improves the in-situ intelligence of the components, communication wires almost always must follow. The communication wires may be within or between parts, or from the engine to the controller. As more hardware is added, more wires, weight, complexity, and potential for unreliability is also introduced. Thus, wireless communication combined with in-situ processing of data would significantly improve the ability to include sensors into high temperature systems and thus lead toward more intelligent engine systems. NASA Glenn Research Center (GRC) is presently leading the development of electronics, communication systems, and sensors capable of prolonged stable

Industrial packaging and assembly infrastructure for MOEMS

Science.gov (United States)

van Heeren, Henne

2004-01-01

In a mature industry all elements of the supply chain are available and are more or less in balance. Mainstream technologies are defined and well supported by a chain of specialist companies. Those specialist companies, offering services ranging from consultancy to manufacturing subcontracting, are an essential element in the industrialization. There specialization and dedication to one or a few elements in the technology increases professionalism and efficiency. The MOEMS industry however, is still in its infancy. After the birth and growth of many companies aiming at development of products, the appearance of companies aiming at the production of components and systems, we see know the first companies concentrating on the delivering of services to this industry. We can divide them in the like : * Design and Engineering companies * Foundries * Assembly and Packaging providers * Design and simulation software providers For manufacturing suppliers and customers the lack of industry standards and mainstream technologies is a serious drawback. Insight in availability and trends in technology is important to make the right choices in the field of industrialization and production. This awareness was the reason to perform a detailed study to the companies supplying commercial services in this field. This article focuses on one important part of this study: packaging and assembly. This tends to remain a bottleneck at the end of the design cycle, often delaying and sometimes preventing industrialization and commercialization. For nearly all MEMS/MST products literally everything comes together in the packaging and assembly. This is the area of full integration: electrical, mechanical, optical fluidic, magnetic etc. functionalities come together. The problems associated with the concentration of functionalities forms a big headache for the designer. Conflicting demands, of which functionality versus economics is only one, and technical hurdles have to overcome. Besides that

Effects of wafer-level packaging on millimetre-wave antennas

KAUST Repository

Abutarboush, Hattan; Tawfik, Hani H.; Soliman, Ezzeldin A.; Sallam, Mai O.; Shamim, Atif; Sedky, Sherif M.

2011-01-01

methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna

Packaging for consumer electronic products : The need for integrating design and engineering

NARCIS (Netherlands)

Wever, R.; Boks, C.; Stevels, A.

2008-01-01

From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of

Polymers for electronic & photonic application

CERN Document Server

Wong, C P

2013-01-01

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be info

Radioactive waste package assay facility. Volume 1. Application of assay technology

International Nuclear Information System (INIS)

Findlay, D.J.S.; Green, T.H.; Molesworth, T.V.; Staniforth, D.; Strachan, N.R.; Rogers, J.D.; Wise, M.O.; Forrest, K.R.

1992-01-01

This report, in three volumes, covers the work carried out by Taylor Woodrow Construction Ltd., and two major sub-contractors: Harwell Laboratory (AEA Technology) and Siemens Plessey Controls Ltd., on the development of a radioactive waste package assay facility, for cemented 500 litre intermediate level waste drums. In volume 1, the reasons for assay are considered together with the various techniques that can be used, and the information that can be obtained. The practical problems associated with the use of the various techniques in an integrated assay facility are identified, and the key parameters defined. Engineering and operational features are examined and provisional designs proposed for facilities at three throughput levels: 15,000, 750 and 30 drums per year respectively. The capital and operating costs for such facilities have been estimated. A number of recommendations are made for further work. 16 refs., 14 figs., 13 tabs

Technology of electron beam welding for Zr-4 alloy spacer grid

International Nuclear Information System (INIS)

Pei Qiusheng; Wu Xueyi; Yang Qishun

1989-10-01

The welding technology for Zr-4 alloy spacer grid by using vacuum electron beam was studied. Through a series of welding technological experiments, metallographic examinations of seam structure and detecting tests for welding defect by X-ray defectoscopy, a good welding technology was selected to meet the requirements. The experimental results indicated that the Zr-4 alloy spacer grid welded by vacuum electron beam welding is feasible

Automated Work Package: Conceptual Design and Data Architecture

Energy Technology Data Exchange (ETDEWEB)

Al Rashdan, Ahmad [Idaho National Lab. (INL), Idaho Falls, ID (United States); Oxstrand, Johanna [Idaho National Lab. (INL), Idaho Falls, ID (United States); Agarwal, Vivek [Idaho National Lab. (INL), Idaho Falls, ID (United States)

2016-05-26

The automated work package (AWP) is one of the U.S. Department of Energy’s (DOE) Light Water Reactor Sustainability Program efforts to enhance the safety and economics of the nuclear power industry. An AWP is an adaptive and interactive work package that intelligently drives the work process according to the plant condition, resources status, and users progress. The AWP aims to automate several manual tasks of the work process to enhance human performance and reduce human errors. Electronic work packages (eWPs), studied by the Electric Power Research Institute (EPRI), are work packages that rely to various extent on electronic data processing and presentation. AWPs are the future of eWPs. They are envisioned to incorporate the advanced technologies of the future, and thus address the unresolved deficiencies associated with the eWPs in a nuclear power plant. In order to define the AWP, it is necessary to develop an ideal envisioned scenario of the future work process without any current technology restriction. The approach followed to develop this scenario is specific to every stage of the work process execution. The scenario development resulted in fifty advanced functionalities that can be part of the AWP. To rank the importance of these functionalities, a survey was conducted involving several U.S. nuclear utilities. The survey aimed at determining the current need of the nuclear industry with respect to the current work process, i.e. what the industry is satisfied with, and where the industry envisions potential for improvement. The survey evaluated the most promising functionalities resulting from the scenario development. The results demonstrated a significant desire to adopt the majority of these functionalities. The results of the survey are expected to drive the Idaho National Laboratory (INL) AWP research and development (R&D). In order to facilitate this mission, a prototype AWP is needed. Since the vast majority of earlier efforts focused on the

Automated Work Package: Conceptual Design and Data Architecture

International Nuclear Information System (INIS)

Al Rashdan, Ahmad; Oxstrand, Johanna; Agarwal, Vivek

2016-01-01

The automated work package (AWP) is one of the U.S. Department of Energy's (DOE) Light Water Reactor Sustainability Program efforts to enhance the safety and economics of the nuclear power industry. An AWP is an adaptive and interactive work package that intelligently drives the work process according to the plant condition, resources status, and users progress. The AWP aims to automate several manual tasks of the work process to enhance human performance and reduce human errors. Electronic work packages (eWPs), studied by the Electric Power Research Institute (EPRI), are work packages that rely to various extent on electronic data processing and presentation. AWPs are the future of eWPs. They are envisioned to incorporate the advanced technologies of the future, and thus address the unresolved deficiencies associated with the eWPs in a nuclear power plant. In order to define the AWP, it is necessary to develop an ideal envisioned scenario of the future work process without any current technology restriction. The approach followed to develop this scenario is specific to every stage of the work process execution. The scenario development resulted in fifty advanced functionalities that can be part of the AWP. To rank the importance of these functionalities, a survey was conducted involving several U.S. nuclear utilities. The survey aimed at determining the current need of the nuclear industry with respect to the current work process, i.e. what the industry is satisfied with, and where the industry envisions potential for improvement. The survey evaluated the most promising functionalities resulting from the scenario development. The results demonstrated a significant desire to adopt the majority of these functionalities. The results of the survey are expected to drive the Idaho National Laboratory (INL) AWP research and development (R&D). In order to facilitate this mission, a prototype AWP is needed. Since the vast majority of earlier efforts focused on the frontend

DensToolKit: A comprehensive open-source package for analyzing the electron density and its derivative scalar and vector fields

Science.gov (United States)

Solano-Altamirano, J. M.; Hernández-Pérez, Julio M.

2015-11-01

DensToolKit is a suite of cross-platform, optionally parallelized, programs for analyzing the molecular electron density (ρ) and several fields derived from it. Scalar and vector fields, such as the gradient of the electron density (∇ρ), electron localization function (ELF) and its gradient, localized orbital locator (LOL), region of slow electrons (RoSE), reduced density gradient, localized electrons detector (LED), information entropy, molecular electrostatic potential, kinetic energy densities K and G, among others, can be evaluated on zero, one, two, and three dimensional grids. The suite includes a program for searching critical points and bond paths of the electron density, under the framework of Quantum Theory of Atoms in Molecules. DensToolKit also evaluates the momentum space electron density on spatial grids, and the reduced density matrix of order one along lines joining two arbitrary atoms of a molecule. The source code is distributed under the GNU-GPLv3 license, and we release the code with the intent of establishing an open-source collaborative project. The style of DensToolKit's code follows some of the guidelines of an object-oriented program. This allows us to supply the user with a simple manner for easily implement new scalar or vector fields, provided they are derived from any of the fields already implemented in the code. In this paper, we present some of the most salient features of the programs contained in the suite, some examples of how to run them, and the mathematical definitions of the implemented fields along with hints of how we optimized their evaluation. We benchmarked our suite against both a freely-available program and a commercial package. Speed-ups of ˜2×, and up to 12× were obtained using a non-parallel compilation of DensToolKit for the evaluation of fields. DensToolKit takes similar times for finding critical points, compared to a commercial package. Finally, we present some perspectives for the future development and

APPLICATION OF NANOTECHNOLOGY IN FOOD PACKAGING

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2014-04-01

Full Text Available Nanotechnology involves the design, production and use of structures through control of the size and shape of the materials at the nanometre scale. Also, nanomaterials have been already applied in many fields of human life. Nanocomposites have already led to several innovations with potential applications in the food packaging sector. The use of nanocomposite formulations is expected to considerably enhance the shelf-life of many types of food. This improvement can lead to lower weight packages because less material is needed to obtain the same or even better barrier properties. This, in turn, can lead to reduced package cost with less packaging waste. Antimicrobial packaging is another area with high potential for applying nanocomposite technology. Nanostructured antimicrobials have a higher surface area-to-volume ratio when compared with their higher scale counterparts. Therefore, antimicrobial nanocomposite packaging systems are supposed to be particularly efficient in their activities against microbial cells. In this review, definition of nanomaterials is presented. Besides, the paper shows examples of nanocomposities and antimicrobial nanopackaging mainly with the use of nanosilver. Moreover, nanoparticles such ZnO, TiO2, MgO and nanosensors in packaging were presented.

Radiation sterilization and food packaging

International Nuclear Information System (INIS)

Harrison, N.

1991-01-01

Food irradiation by gamma radiation or electron beams offers a number of benefits to be consumer and to the food industry. Low doses can delay fruit ripening while higher doses can reduce or eliminate pathrogenic microorganisms and control insect infestation. However, ionizing radiations are known to have an effect on the plastics used for food packaging, especially PVC and polyethylene. This chapter looks at food irradiation generally, including legislation on the irradiation of food packaging materials. The effect on specific polymers (PVC, polyethylenes, polypropylene, polystyrene, polyamides and flexible laminates) is then considered. It is concluded that few of the plastics used for food packaging are significantly affected by an overall average dose of 10KGy, the maximum likely for the irradiation of prepackaged food in the United Kingdom. (UK)

Segmentation and packaging reactor vessels internals

International Nuclear Information System (INIS)

Boucau, Joseph

2014-01-01

Document available in abstract form only, full text follows: With more than 25 years of experience in the development of reactor vessel internals and reactor vessel segmentation and packaging technology, Westinghouse has accumulated significant know-how in the reactor dismantling market. The primary challenges of a segmentation and packaging project are to separate the highly activated materials from the less-activated materials and package them into appropriate containers for disposal. Since disposal cost is a key factor, it is important to plan and optimize waste segmentation and packaging. The choice of the optimum cutting technology is also important for a successful project implementation and depends on some specific constraints. Detailed 3-D modeling is the basis for tooling design and provides invaluable support in determining the optimum strategy for component cutting and disposal in waste containers, taking account of the radiological and packaging constraints. The usual method is to start at the end of the process, by evaluating handling of the containers, the waste disposal requirements, what type and size of containers are available for the different disposal options, and working backwards to select a cutting method and finally the cut geometry required. The 3-D models can include intelligent data such as weight, center of gravity, curie content, etc, for each segmented piece, which is very useful when comparing various cutting, handling and packaging options. The detailed 3-D analyses and thorough characterization assessment can draw the attention to material potentially subject to clearance, either directly or after certain period of decay, to allow recycling and further disposal cost reduction. Westinghouse has developed a variety of special cutting and handling tools, support fixtures, service bridges, water filtration systems, video-monitoring systems and customized rigging, all of which are required for a successful reactor vessel internals

Application of the Technology Acceptance Model (TAM) in electronic ...

African Journals Online (AJOL)

Application of the Technology Acceptance Model (TAM) in electronic ticket purchase for ... current study examined the perceived usefulness and ease of use of online technology ... The findings are discussed in the light of these perspectives.

Applications of electron accelerator in Malaysia

Energy Technology Data Exchange (ETDEWEB)

Khairul Zaman Hj. Mohd Dahlan [Malaysian Institute for Nuclear Technology Research (MINT), Bangi, Selangor Darul Ehsan (Malaysia)

2003-02-01

Current status of radiation processing, as one of the core research programs of the Malaysian Institute for Nuclear Technology Research (MINT), is presented. Industrial applications of six electron accelerators from 150 kV up to 3 MV in Malaysia now in operation are mainly for curing of surface coatings, crosslinking of tubes, heat shrinkable tubes and packaging films, crosslinking of wire insulation. Their performances are listed. New technology now in R and D stage includes natural rubber, sago starch and chitosan for biomedical applications, and radiation curable materials from oil palm for pressure sensitive adhesive and printing ink. (S. Ohno)

Applications of electron accelerator in Malaysia

International Nuclear Information System (INIS)

Khairul Zaman Hj. Mohd Dahlan

2003-01-01

Current status of radiation processing, as one of the core research programs of the Malaysian Institute for Nuclear Technology Research (MINT), is presented. Industrial applications of six electron accelerators from 150 kV up to 3 MV in Malaysia now in operation are mainly for curing of surface coatings, crosslinking of tubes, heat shrinkable tubes and packaging films, crosslinking of wire insulation. Their performances are listed. New technology now in R and D stage includes natural rubber, sago starch and chitosan for biomedical applications, and radiation curable materials from oil palm for pressure sensitive adhesive and printing ink. (S. Ohno)

Technology for the compatible integration of silicon detectors with readout electronics

International Nuclear Information System (INIS)

Zimmer, G.

1984-01-01

Compatible integration of detectors and readout electronics on the same silicon substrate is of growing interest. As the methods of microelectronics technology have already been adapted for detector fabrication, a common technology basis for detectors and readout electronics is available. CMOS technology exhibits most attractive features for the compatible realization of readout electronics when advanced LSI processing steps are combined with detector requirements. The essential requirements for compatible integration are the availability of high resistivity (100)-oriented single crystalline silicon substrate, the formation of suitably doped areas for MOS circuits and the isolation of the low voltage circuit from the detector operated at much higher supply voltage. Junction isolation as a first approach based on present production technology and dielectric isolation based on an advanced SOI-LSI technology are discussed as the most promising solutions for present and future applications, respectively. (orig.)

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

Science.gov (United States)

Ramesham, Rajeshuni

2011-01-01

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Past, current and potential utilisation of active and intelligent packaging systems for meat and muscle-based products: A review.

Science.gov (United States)

Kerry, J P; O'Grady, M N; Hogan, S A

2006-09-01

Interest in the use of active and intelligent packaging systems for meat and meat products has increased in recent years. Active packaging refers to the incorporation of additives into packaging systems with the aim of maintaining or extending meat product quality and shelf-life. Active packaging systems discussed include oxygen scavengers, carbon dioxide scavengers and emitters, moisture control agents and anti-microbial packaging technologies. Intelligent packaging systems are those that monitor the condition of packaged foods to give information regarding the quality of the packaged food during transport and storage. The potential of sensor technologies, indicators (including integrity, freshness and time-temperature (TTI) indicators) and radio frequency identification (RFID) are evaluated for potential use in meat and meat products. Recognition of the benefits of active and intelligent packaging technologies by the food industry, development of economically viable packaging systems and increased consumer acceptance is necessary for commercial realisation of these packaging technologies.

Natural biopolimers in organic food packaging

Science.gov (United States)

Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

2014-05-01

Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

Scale-up considerations relevant to experimental studies of nuclear waste-package behavior

International Nuclear Information System (INIS)

Coles, D.G.; Peters, R.D.

1986-04-01

Results from a study that investigated whether testing large-scale nuclear waste-package assemblages was technically warranted are reported. It was recognized that the majority of the investigations for predicting waste-package performance to date have relied primarily on laboratory-scale experimentation. However, methods for the successful extrapolation of the results from such experiments, both geometrically and over time, to actual repository conditions have not been well defined. Because a well-developed scaling technology exists in the chemical-engineering discipline, it was presupposed that much of this technology could be applicable to the prediction of waste-package performance. A review of existing literature documented numerous examples where a consideration of scaling technology was important. It was concluded that much of the existing scale-up technology is applicable to the prediction of waste-package performance for both size and time extrapolations and that conducting scale-up studies may be technically merited. However, the applicability for investigating the complex chemical interactions needs further development. It was recognized that the complexity of the system, and the long time periods involved, renders a completely theoretical approach to performance prediction almost hopeless. However, a theoretical and experimental study was defined for investigating heat and fluid flow. It was concluded that conducting scale-up modeling and experimentation for waste-package performance predictions is possible using existing technology. A sequential series of scaling studies, both theoretical and experimental, will be required to formulate size and time extrapolations of waste-package performance

Inkjet printing of UHF antennas on corrugated cardboards for packaging applications

Energy Technology Data Exchange (ETDEWEB)

Sowade, Enrico, E-mail: enrico.sowade@mb.tu-chemnitz.de [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Göthel, Frank [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Zichner, Ralf [Department Printed Functionalities, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz (Germany); Baumann, Reinhard R. [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Department Printed Functionalities, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz (Germany)

2015-03-30

Highlights: • Inkjet printing of UHF antennas on cardboard substrates. • Development of primer layer to compensate the absorptiveness of the cardboard and the rough surface. • Manufacturing of UHF antennas in a fully digital manner for packaging applications. - Abstract: In this study, a method based on inkjet printing has been established to develop UHF antennas on a corrugated cardboard for packaging applications. The use of such a standardized, paper-based packaging substrate as material for printing electronics is challenging in terms of its high surface roughness and high ink absorption rate, especially when depositing very thin films with inkjet printing technology. However, we could obtain well-defined silver layers on the cardboard substrates due to a primer layer approach. The primer layer is based on a UV-curable ink formulation and deposited as well as the silver ink with inkjet printing technology. Industrial relevant printheads were chosen for the deposition of the materials. The usage of inkjet printing allows highest flexibility in terms of pattern design. The primer layer was proven to optimize the surface characteristics of the substrate, mainly reducing the surface roughness and water absorptiveness. Thanks to the primer layer approach, ultra-high-frequency (UHF) radio-frequency identification (RFID) antennas were deposited by inkjet printing on the corrugated cardboards. Along with the characterization and interpretation of electrical properties of the established conductive antenna patterns, the performance of the printed antennas were analyzed in detail by measuring the scattering parameter S{sub 11} and the antenna gain.

Antimicrobial nanomaterials for food packaging applications

Directory of Open Access Journals (Sweden)

Radusin Tanja I.

2016-01-01

Full Text Available Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to these challenges, with different solutions-from improvements in materials properties to active packaging solutions, or both at the same time. Incorporation of nanoparticles into polymer matrix and preparation of hybrid materials is one of the methods of modification of polymer properties. Nano scaled materials with antimicrobial properties can act as active components when added into polymer, thereby leading to prolonged protective function of pristine food packaging material. This paper presents a review in the field of antimicrobial nanomaterials for food packaging in turn of technology, application and regulatory issues.

Development of polymer packaging for power cable

Directory of Open Access Journals (Sweden)

S. Sremac

2014-10-01

Full Text Available This paper discusses the issues of product design and the procedure of developing polymer packaging as one of the most important engineering tasks. For the purpose of packing power cables a polymer packaging has been designed in the form of drum. Packaging and many other consumer products are largely produced using polymeric materials due to many positive features. High Density Polyethylene is the type of polyethylene proposed for packaging purposes due to its low degree of branching and strong intermolecular forces. Transport and storage processes were automated based on the radio-frequency identification technology. The proposed system is flexible in terms of its possibility of accepting and processing different types of cables and other products.

3D Printing Technologies for Flexible Tactile Sensors toward Wearable Electronics and Electronic Skin

Directory of Open Access Journals (Sweden)

Changyong Liu

2018-06-01

Full Text Available 3D printing has attracted a lot of attention in recent years. Over the past three decades, various 3D printing technologies have been developed including photopolymerization-based, materials extrusion-based, sheet lamination-based, binder jetting-based, power bed fusion-based and direct energy deposition-based processes. 3D printing offers unparalleled flexibility and simplicity in the fabrication of highly complex 3D objects. Tactile sensors that emulate human tactile perceptions are used to translate mechanical signals such as force, pressure, strain, shear, torsion, bend, vibration, etc. into electrical signals and play a crucial role toward the realization of wearable electronics and electronic skin. To date, many types of 3D printing technologies have been applied in the manufacturing of various types of tactile sensors including piezoresistive, capacitive and piezoelectric sensors. This review attempts to summarize the current state-of-the-art 3D printing technologies and their applications in tactile sensors for wearable electronics and electronic skin. The applications are categorized into five aspects: 3D-printed molds for microstructuring substrate, electrodes and sensing element; 3D-printed flexible sensor substrate and sensor body for tactile sensors; 3D-printed sensing element; 3D-printed flexible and stretchable electrodes for tactile sensors; and fully 3D-printed tactile sensors. Latest advances in the fabrication of tactile sensors by 3D printing are reviewed and the advantages and limitations of various 3D printing technologies and printable materials are discussed. Finally, future development of 3D-printed tactile sensors is discussed.

Technology and Power. A Foucauldian Analysis of Electronic Monitoring Discourses

Directory of Open Access Journals (Sweden)

Anna Vitores

2007-05-01

Full Text Available The article aims to show the importance of FOUCAULT within social studies of science and technology. It also illustrates how a Foucauldian analysis can be useful for studies of science, technology and society focused on power effects. To accomplish these objectives we analyze the emergence of a specific techno-scientific innovation: the electronic monitoring of offenders. We map the discontinuities and discourse dispersions linked to those practices that constitute different materializations of this electronic device. Because we start from questions concerning power technologies, rather than simply analyzing the ideologies and knowledges that legitimate electronic monitoring and its technical reliability, we attend to the assemblage of discourses, rhetorics, vocabularies, techniques and procedures by which knowledge is intertwined and joins with the exercise of power. In this way, we show how one of FOUCAULT's technologies of power—disciplinary technology—is articulated, nourished and contradicted by other emergent logics drawing on new forms of regulation and social control. URN: urn:nbn:de:0114-fqs070225

Electron gun for technological linear accelerator

International Nuclear Information System (INIS)

Khodak, I.V.; Kushnir, V.A.; Mirochenko, V.V.; Stepin, D.L.; Zavada, L.M.

2000-01-01

The work is purposed to the design of diode electron gun for powerful technologic electron linac and to experimental investigations of the beam parameters at the gun exit.The gun feature is the quick cathode replacement.This is very impotent for operating of the accelerator.The gun optics and beam parameters were calculated using the EGUN code.Beam parameters were investigated as at the special test stand so as component of the linac injector.The gun produces the beam current of 2 A at the anode voltage 25 kV.Measured beam parameters correspond to calculated results

Anticipated development in radioactive materials packaging and transport systems

International Nuclear Information System (INIS)

Williams, L.D.; Rhoads, R.E.; Hall, R.J.

1976-07-01

Closing the light water reactor fuel cycle and the use of mixed oxide fuels will produce materials such as solidified high level waste, cladding hulls and plutonium from Pu recycle fuel that have not been transported extensively in the past. Changes in allowable gaseous emissions from fuel cycle facilities may require the collection and transportation of radioactive noble gases and tritium. Although all of these materials could be transported in existing radioactive material packaging, economic considerations will make it desirable to develop new packaging specifically designed for each material. Conceptual package designs for these materials are reviewed. Special Nuclear Material transportation safeguards are expected to have a significant impact on future fuel cycle transportation. This subject is reviewed briefly. Other factors that could affect fuel cycle transportation are also discussed. Development of new packaging for radioactive materials is not believed to require the development of new technologies. New package designs will be primarily an adaptation of existing technology to fit the changing needs of a growing nuclear power industry. 23 references

High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

Energy Technology Data Exchange (ETDEWEB)

Zhou, Yongcun; Liu, Feng, E-mail: liufeng@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi' an Shaanxi 710072 (China)

2016-08-22

The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.

Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan

Science.gov (United States)

Washio, Kunihiko; Kouta, Hikaru

2002-06-01

This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

Cigarette package design: opportunities for disease prevention.

Science.gov (United States)

Difranza, J R; Clark, D M; Pollay, R W

2002-06-15

To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

Technology of silicon charged-particle detectors developed at the Institute of Electron Technology (ITE)

Science.gov (United States)

Wegrzecka, Iwona; Panas, Andrzej; Bar, Jan; Budzyński, Tadeusz; Grabiec, Piotr; Kozłowski, Roman; Sarnecki, Jerzy; Słysz, Wojciech; Szmigiel, Dariusz; Wegrzecki, Maciej; Zaborowski, Michał

2013-07-01

The paper discusses the technology of silicon charged-particle detectors developed at the Institute of Electron Technology (ITE). The developed technology enables the fabrication of both planar and epiplanar p+-ν-n+ detector structures with an active area of up to 50 cm2. The starting material for epiplanar structures are silicon wafers with a high-resistivity n-type epitaxial layer ( ν layer - ρ < 3 kΩcm) deposited on a highly doped n+-type substrate (ρ< 0,02Ωcm) developed and fabricated at the Institute of Electronic Materials Technology. Active layer thickness of the epiplanar detectors (νlayer) may range from 10 μm to 150 μm. Imported silicon with min. 5 kΩcm resistivity is used to fabricate planar detectors. Active layer thickness of the planar detectors (ν) layer) may range from 200 μm to 1 mm. This technology enables the fabrication of both discrete and multi-junction detectors (monolithic detector arrays), such as single-sided strip detectors (epiplanar and planar) and double-sided strip detectors (planar). Examples of process diagrams for fabrication of the epiplanar and planar detectors are presented in the paper, and selected technological processes are discussed.

Verification of the thermal design of electronic equipment

Energy Technology Data Exchange (ETDEWEB)

Hienonen, R.; Karjalainen, M.; Lankinen, R. [VTT Automation, Espoo (Finland). ProTechno

1997-12-31

The project `Verification of the thermal design of electronic equipment` studied the methodology to be followed in the verification of thermal design of electronic equipment. This project forms part of the `Cool Electronics` research programme funded by TEKES, the Finnish Technology Development Centre. This project was carried out jointly by VTT Automation, Lappeenranta University of Technology, Nokia Research Center and ABB Industry Oy VSD-Technology. The thermal design of electronic equipment has a significant impact on the cost, reliability, tolerance to different environments, selection of components and materials, and ergonomics of the product. This report describes the method for verification of thermal design. It assesses the goals set for thermal design, environmental requirements, technical implementation of the design, thermal simulation and modelling, and design qualification testing and the measurements needed. The verification method covers all packaging levels of electronic equipment from the system level to the electronic component level. The method described in this report can be used as part of the quality system of a corporation. The report includes information about the measurement and test methods needed in the verification process. Some measurement methods for the temperature, flow and pressure of air are described. (orig.) Published in Finnish VTT Julkaisuja 824. 22 refs.

International Conference on Emerging Research in Electronics, Computer Science and Technology

CERN Document Server

Sheshadri, Holalu; Padma, M

2014-01-01

PES College of Engineering is organizing an International Conference on Emerging Research in Electronics, Computer Science and Technology (ICERECT-12) in Mandya and merging the event with Golden Jubilee of the Institute. The Proceedings of the Conference presents high quality, peer reviewed articles from the field of Electronics, Computer Science and Technology. The book is a compilation of research papers from the cutting-edge technologies and it is targeted towards the scientific community actively involved in research activities.

Intelligence and innovation in the packaging

International Nuclear Information System (INIS)

Kandile, N.G.

2005-01-01

Plastic polymers account for about 20 percent (by volume) of landfill space. Many cities have run out of space to dispose of their trash and are paying to ship their trash to remote locations. It is estimated that known global resources of oil will run dry in 80 years, natural gas in 70 years and coal in 700 years, but the economic impact of the depletion could hit much sooner; since prices will likely soar as resources are depleted. It is clear that researchers need to work toward replacing fossil fuel resources with renewable resources as both fuel and raw materials for many petroleum-based products . It wasn't too long ago that containers incorporating a modest percentage of recycled material represented the leading edge of environmentally responsible packaging. And while packagers continue to better the environment by using recycled content, a new category of environmentally friendly packaging materials has emerged: packaging made from renewable resources, including cornstarch, polylactic acid, and limestone. One of the newest applications of s ustainablev packaging is. The Plantic tm , a biodegradable polymer from Plantic Technologies, for a thermoformed tray . This material replaces polyvinyl chloride and PET trays and is more in line with the environmental policy. Using the Plantic technology reduce the environmental impact of packaging, without compromising the quality of the product or its presentation . Eife Cycle Assessment is a technique that could help to assess the benefits and drawbacks of Plantic tm ., According to The Society of Environmental Toxicology and Chemistry (SETAC), Eife Cycle Assessment is a n objective process to evaluate the environmental burdens associated with a product, process, or activity by identifying and quantifying energy and materials used and wastes released to the environment, and to evaluate and implement opportunities to effect environmental improvements . Eife Cycle Assessment involves three main stages: inventory

The Impact of Electronic Communication Technology on Written Language

Science.gov (United States)

Hamzah, Mohd. Sahandri Gani B.; Ghorbani, Mohd. Reza; Abdullah, Saifuddin Kumar B.

2009-01-01

Communication technology is changing things. Language is no exception. Some language researchers argue that language is deteriorating due to increased use in electronic communication. The present paper investigated 100 randomly selected electronic mails (e-mails) and 50 short messaging system (SMS) messages of a representative sample of…

Cold Plasma Treatment of Biodegradable films and smart packaging

OpenAIRE

Pankaj, Shashi

2015-01-01

Cold plasma is an emerging technology offering many potential applications for food packaging. While it was originally developed to increase the surface energy of polymers, enhancing their adhesion and printability, it has recently emerged as a powerful tool for surface sterilisation of both food and food packaging materials. The food packaging industry is still dominated by petroleum derived polymers but in the past few decades there has been significant interest in the development of enviro...

Electron Beam Technology for Environmental Pollution Control.

Science.gov (United States)

Chmielewski, Andrzej G; Han, Bumsoo

2016-10-01

Worldwide, there are over 1700 electron beam (EB) units in commercial use, providing an estimated added value to numerous products, amounting to 100 billion USD or more. High-current electron accelerators are used in diverse industries to enhance the physical and chemical properties of materials and to reduce undesirable contaminants such as pathogens, toxic byproducts, or emissions. Over the past few decades, EB technologies have been developed aimed at ensuring the safety of gaseous and liquid effluents discharged to the environment. It has been demonstrated that EB technologies for flue gas treatment (SO x and NO x removal), wastewater purification, and sludge hygienization can be effectively deployed to mitigate environmental degradation. Recently, extensive work has been carried out on the use of EB for environmental remediation, which also includes the removal of emerging contaminants such as VOCs, endocrine disrupting chemicals (EDCs), and potential EDCs.

Recent progress on thin-film encapsulation technologies for organic electronic devices

Science.gov (United States)

Yu, Duan; Yang, Yong-Qiang; Chen, Zheng; Tao, Ye; Liu, Yun-Fei

2016-03-01

Among the advanced electronic devices, flexible organic electronic devices with rapid development are the most promising technologies to customers and industries. Organic thin films accommodate low-cost fabrication and can exploit diverse molecules in inexpensive plastic light emitting diodes, plastic solar cells, and even plastic lasers. These properties may ultimately enable organic materials for practical applications in industry. However, the stability of organic electronic devices still remains a big challenge, because of the difficulty in fabricating commercial products with flexibility. These organic materials can be protected using substrates and barriers such as glass and metal; however, this results in a rigid device and does not satisfy the applications demanding flexible devices. Plastic substrates and transparent flexible encapsulation barriers are other possible alternatives; however, these offer little protection to oxygen and water, thus rapidly degrading the devices. Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation into the flexible devices. Because of these (and other) reasons, there has been an intense interest in developing transparent barrier materials with much lower permeabilities, and their market is expected to reach over 550 million by 2025. In this study, the degradation mechanism of organic electronic devices is reviewed. To increase the stability of devices in air, several TFE technologies were applied to provide efficient barrier performance. In this review, the degradation mechanism of organic electronic devices, permeation rate measurement, traditional encapsulation technologies, and TFE technologies are presented.

Development in the Active Packaging of Foods | Vermeiren | Journal ...

African Journals Online (AJOL)

... of the art about the experimental development and commercialisation of active packaging concepts, (3) provide a scope of applications and (4) discuss the obstacles to be overcome in order to make extensive commercial application of active packaging in Europe feasible. The Journal of Food Technology in Africa Volume ...

The future of active and intelligent packaging industry

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2013-06-01

Full Text Available Background: Innovation in food and beverage packaging is mostly driven by consumer needs and demands influenced by changing global trends, such as increased life expectancy, fewer organizations investing in food production and distribution. Food industry has seen great advances in the packaging sector since its inception in the 18th century with most active and intelligent innovations occurring during the past century. These advances have led to improved food quality and safety. Active and intelligent packaging is new and exciting area of technology  which efficient contemporary consumer response. Materials and methods: On the basis of broad review of the current state of the art in world literature, the market active and intelligent packaging is discussed. Results: This paper shows present innovation in the market active and intelligent packaging. Conclusion: Research and development in the field of active and intelligent packaging materials is very dynamic and develops in relation with the search for environment friendly packaging solutions. Besides, active and intelligent packaging is becoming more and more widely used for food products. The future of this type of packaging system seems to be very interesting.

Shielding design of radioactive contaminated metal waste packaging

International Nuclear Information System (INIS)

Zou Wenhua; Dong Zhiqiang; Yao Zhenyu; Xu Shuhe; Wang Wen

2015-01-01

Focusing on the cylindrical source model to calculate γ dose field of waste packages with the relative formulae then derived. By comparing the calculated data of waste packages of type Ⅷ steel box with the monitoring data, it is found that the cylinder source model could accurately reflect the distributions of γ dose of the waste package. Based on the results of the cylindrical source model, a reasonable shielding technology applicable to waste package containers was designed to meet relevant requirements prescribed in standards about the transport and disposal of radioactive materials. The cylinder source model calculated dose distributions for single package in this paper is simple and easy to implement but slightly larger than the monitoring data providing a certain safety margin for the shielding design. It is suitable for radiological engineering practices. (authors)

23 CFR 950.5 - Requirement to use electronic toll collection technology.

Science.gov (United States)

2010-04-01

... shall use an electronic toll collection system as the method for collecting tolls from vehicle operators... 23 Highways 1 2010-04-01 2010-04-01 false Requirement to use electronic toll collection technology... TRANSPORTATION SYSTEMS ELECTRONIC TOLL COLLECTION § 950.5 Requirement to use electronic toll collection...

The portability of the "Electronics Workbench" simulation software to China

NARCIS (Netherlands)

Collis, Betty; Zhi-Cheng, Dong

1993-01-01

This article discusses the portability of the Canadian-made simulation software package, "Electronic Workbench" package (EWB) to China. As part of a larger project investigating the portability of various educational software packages, the EWB package was used in electronics instruction in China and

Performance characteristics of the 12 GHz, 200 watt Transmitter Experiment Package for CTS. [Communication Technology Satellite

Science.gov (United States)

Miller, E. F.; Fiala, J. L.; Hansen, I. G.

1975-01-01

Measured performance characteristics from ground test of the Transmitter Experiment Package (TEP) for the Communications Technology Satellite are presented. The experiment package consists of a 200 W Output Stage Tube (OST) powered by a Power Processing System (PPS). Descriptions of both the PPS and OST are given. The PPS provides the necessary voltages with a measured dc/dc conversion efficiency of 89 per cent. The OST, a traveling wave tube with multiple collectors, has a saturated rf output power of 224 W and operates at an overall efficiency exceeding 40 per cent over an 85 MHz bandwidth at 12 GHz. OST performance given includes frequency response, saturation characteristics, group delay, AM to PM conversion, intermodulation distortion, and two channel gain suppression. Single and dual channel FM video performance is presented. It was determined that for 12 MHz peak to peak frequency deviation on each channel, dual channel FM television signals can be transmitted through the TEP at 60 W, each channel, with 40 MHz channel spacing (center to center).

Cigarette package design: opportunities for disease prevention

Directory of Open Access Journals (Sweden)

Pollay RW

2003-01-01

Full Text Available Abstract Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

CMOS technology: a critical enabler for free-form electronics-based killer applications

Science.gov (United States)

Hussain, Muhammad M.; Hussain, Aftab M.; Hanna, Amir

2016-05-01

Complementary metal oxide semiconductor (CMOS) technology offers batch manufacturability by ultra-large-scaleintegration (ULSI) of high performance electronics with a performance/cost advantage and profound reliability. However, as of today their focus has been on rigid and bulky thin film based materials. Their applications have been limited to computation, communication, display and vehicular electronics. With the upcoming surge of Internet of Everything, we have critical opportunity to expand the world of electronics by bridging between CMOS technology and free form electronics which can be used as wearable, implantable and embedded form. The asymmetry of shape and softness of surface (skins) in natural living objects including human, other species, plants make them incompatible with the presently available uniformly shaped and rigidly structured today's CMOS electronics. But if we can break this barrier then we can use the physically free form electronics for applications like plant monitoring for expansion of agricultural productivity and quality, we can find monitoring and treatment focused consumer healthcare electronics - and many more creative applications. In our view, the fundamental challenge is to engage the mass users to materialize their creative ideas. Present form of electronics are too complex to understand, to work with and to use. By deploying game changing additive manufacturing, low-cost raw materials, transfer printing along with CMOS technology, we can potentially stick high quality CMOS electronics on any existing objects and embed such electronics into any future objects that will be made. The end goal is to make them smart to augment the quality of our life. We use a particular example on implantable electronics (brain machine interface) and its integration strategy enabled by CMOS device design and technology run path.

Ferroelectric Electron Emission Principles and Technology

CERN Document Server

Riege, H

1997-01-01

The spontaneous electrical polarization of ferroelectric materials can be changed either by reversal or by phase transition from a ferroelectric into a non-ferroelectric state or vice versa. If spontaneous polarization changes are induced with fast heat, mechanical pressure, laser or electric field pulses on a submicrosecond time scale, strong uncompensated surface charge densities and related polarization fields are generated, which may lead to the intense self-emission of electrons from the negatively charged free surface areas of the ferroelectric sample. Hence, electron guns can be built with extraction-field-free ferroelectric cathodes, which may be easily separated from the high-field regions of post-accelerating gap structures. The intensity, the energy, the temporal and spatial distribution, and the repetitition rate of the emitted electron beams can be controlled within wide limits via the excitation pulses and external focusing and accelerating electromagnetic fields. The technological advantages an...

Design aspects of plutonium air-transportable packages

International Nuclear Information System (INIS)

Allen, G.C.; Moya, J.L.; Pierce, J.D.; Attaway, S.W.

1989-01-01

Recent worldwide interest in transporting plutonium powders by air has created a need for expanding the packaging technology base as well as improving their understanding of how plutonium air transport (PAT) packagings perform during severe accident tests. Historically it has not been possible to establish design rules for individual package components because of the complex way parts interacted in forming a successful whole unit. Also, computer analyses were only considered valid for very limited portions of the design effort because of large deformations, localized tearing occurring in the package during accident testing, and extensive use of orthotropic materials. Consequently, iterative design and experimentation has historically been used to develop plutonium air-transportable packages. Full-scale prototypes have been tested since scaling of packages utilizing wood as an energy absorber and thermal insulator has not proven to be very successful. This is because the wood grain and dynamic performance of the wood during crush do not always scale. The high cost of full-scale testing of large packages has certainly hindered obtaining additional data and development new designs. The testing criteria for PAT packages, as described in the US Nuclear Regulatory Commission's Qualification Criteria to Certify a Package for Air Transport of Plutonium, NUREG-0360, 1978, are summarized. Computer modeling techniques have greatly improved over the last ten years, and there are some areas of opportunity for future applications to plutonium air-transportable package design problems. Having developed a better understanding of the performance of current packages, they have the opportunity to make major improvements in new packaging concepts. Each of these areas is explored in further depth to establish their impact on design practices for air-transportable packages

Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

NARCIS (Netherlands)

Van Den Ende, D.A.; Van De Wiel, H.J.; Kusters, R.H.L.; Sridhar, A.; Schram, J.F.M.; Cauwe, M.; Van Den Brand, J.

2014-01-01

Ultra-thin chips of less than 20 μm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these

Flexible technology for Electronics: Its Derivatives and Possibilities

OpenAIRE

Deovrat Phal; Akshay Narkar

2014-01-01

With the inkjet printing technology becoming more popular, integration of circuits developed on flexible substrates which are easily embedded inside the machine as against the rigid PCB circuits is becoming more prevalent. Much of the research has been done in applications of such circuits in human body implants or for other low cost applications. This paper concentrates particularly on applications of such circuits in the field of consumer electronics, disposable electronics,...

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

Science.gov (United States)

Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

2013-09-01

Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

An overview of power electronic converter technology for renewable energy systems

DEFF Research Database (Denmark)

Chen, Zhe

2013-01-01

This chapter presents power electronic technology which is an enabling tool for modern wind and marine energy conversion systems. In this chapter, the main power electronic devices are described. Various power electronic converter topologies are represented, and commonly used modulation schemes...

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Completion of the Radioactive Materials Packaging Handbook

International Nuclear Information System (INIS)

Shappert, L.B.

1998-02-01

The Radioactive Materials Packaging Handbook: Design, Operation and Maintenance, which will serve as a replacement for the Cask Designers Guide (Shappert, 1970), has now been completed and submitted to the Oak Ridge National Laboratory (ORNL) electronics publishing group for layout and printing; it is scheduled to be printed in late spring 1998. The Handbook, written by experts in their particular fields, is a compilation of technical chapters that address the design aspects of a package intended for transporting radioactive material in normal commerce; it was prepared under the direction of M. E. Wangler of the US Department of Energy (DOE) and is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators on specific aspects of package design, and the types of analyses that should be considered when designing a package to carry radioactive materials

Technology and application of two sets of industrial electron accelerators

International Nuclear Information System (INIS)

Hua Degen

2000-01-01

The radiation industry in China Academy of Engineering Physics (CAEP) has had a big scale, and the two sets of industrial electron accelerators play important roles. The Electron Processing System (E.P.S), which was introduced in 1987, is a powerful electron accelerator. And the 10 MeV Accelerator, which is a traveling wave linear electron accelerator, has the higher electron energy. Both of the stes are equipped the driving devices under the beam, and has made a considerable economic results. This article describes the technology and application of the two electron accelerators. (author)

CMOS technology: a critical enabler for free-form electronics-based killer applications

KAUST Repository

Hussain, Muhammad Mustafa

2016-05-17

Complementary metal oxide semiconductor (CMOS) technology offers batch manufacturability by ultra-large-scaleintegration (ULSI) of high performance electronics with a performance/cost advantage and profound reliability. However, as of today their focus has been on rigid and bulky thin film based materials. Their applications have been limited to computation, communication, display and vehicular electronics. With the upcoming surge of Internet of Everything, we have critical opportunity to expand the world of electronics by bridging between CMOS technology and free form electronics which can be used as wearable, implantable and embedded form. The asymmetry of shape and softness of surface (skins) in natural living objects including human, other species, plants make them incompatible with the presently available uniformly shaped and rigidly structured today’s CMOS electronics. But if we can break this barrier then we can use the physically free form electronics for applications like plant monitoring for expansion of agricultural productivity and quality, we can find monitoring and treatment focused consumer healthcare electronics – and many more creative applications. In our view, the fundamental challenge is to engage the mass users to materialize their creative ideas. Present form of electronics are too complex to understand, to work with and to use. By deploying game changing additive manufacturing, low-cost raw materials, transfer printing along with CMOS technology, we can potentially stick high quality CMOS electronics on any existing objects and embed such electronics into any future objects that will be made. The end goal is to make them smart to augment the quality of our life. We use a particular example on implantable electronics (brain machine interface) and its integration strategy enabled by CMOS device design and technology run path. © (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is

Radiolysis products and sensory properties of electron-beam-irradiated high-barrier food-packaging films containing a buried layer of recycled low-density polyethylene.

Science.gov (United States)

Chytiri, S D; Badeka, A V; Riganakos, K A; Kontominas, M G

2010-04-01

The aim was to study the effect of electron-beam irradiation on the production of radiolysis products and sensory changes in experimental high-barrier packaging films composed of polyamide (PA), ethylene-vinyl alcohol (EVOH) and low-density polyethylene (LDPE). Films contained a middle buried layer of recycled LDPE, while films containing 100% virgin LDPE as the middle buried layer were taken as controls. Irradiation doses ranged between zero and 60 kGy. Generally, a large number of radiolysis products were produced during electron-beam irradiation, even at the lower absorbed doses of 5 and 10 kGy (approved doses for food 'cold pasteurization'). The quantity of radiolysis products increased with irradiation dose. There were no significant differences in radiolysis products identified between samples containing a recycled layer of LDPE and those containing virgin LDPE (all absorbed doses), indicating the 'functional barrier' properties of external virgin polymer layers. Sensory properties (mainly taste) of potable water were affected after contact with irradiated as low as 5 kGy packaging films. This effect increased with increasing irradiation dose.

Innovative, wearable snap connector technology for improved device networking in electronic garments

Science.gov (United States)

Kostrzewski, Andrew A.; Lee, Kang S.; Gans, Eric; Winterhalter, Carole A.; Jannson, Tomasz P.

2007-04-01

This paper discusses Physical Optics Corporation's (POC) wearable snap connector technology that provides for the transfer of data and power throughout an electronic garment (e-garment). These connectors resemble a standard garment button and can be mated blindly with only one hand. Fully compatible with military clothing, their application allows for the networking of multiple electronic devices and an intuitive method for adding/removing existing components from the system. The attached flexible cabling also permits the rugged snap connectors to be fed throughout the standard webbing found in military garments permitting placement in any location within the uniform. Variations of the snap electronics/geometry allow for integration with USB 2.0 devices, RF antennas, and are capable of transferring high bandwidth data streams such as the 221 Mbps required for VGA video. With the trend towards providing military officers with numerous electronic devices (i.e., heads up displays (HMD), GPS receiver, PDA, etc), POC's snap connector technology will greatly improve cable management resulting in a less cumbersome uniform. In addition, with electronic garments gaining widespread adoption in the commercial marketplace, POC's technology is finding applications in such areas as sporting good manufacturers and video game technology.

The magnetic diagnostics subsystem of the LISA Technology Package

Energy Technology Data Exchange (ETDEWEB)

Diaz-Aguilo, M; Garcia-Berro, E [Departament de Fisica Aplicada, Universitat Politecnica de Catalunya, c/Esteve Terrades, 5, 08860 Castelldefels (Spain); Lobo, A; Mateos, N; Sanjuan, J, E-mail: marc.diaz.aguilo@fa.upc.ed [Institut d' Estudis Espacials de Catalunya, c/Gran Capita 2-4, Edif. Nexus 104, 08034 Barcelona (Spain)

2010-05-01

The Magnetic Diagnostics Subsystem of the LISA Technology Package (LTP) on board the LISA Pathfinder (LPF) spacecraft includes a set of four tri-axial fluxgate magnetometers, intended to measure with high precision the magnetic field at the positions they occupy. However, their readouts do not provide a direct measurement of the magnetic field at the positions of the test masses. Therefore, an interpolation method must be implemented to obtain this information. However, such interpolation process faces serious difficulties. Indeed, the size of the interpolation region is excessive for a linear interpolation to be reliable, and the number of magnetometer channels does not provide sufficient data to go beyond that poor approximation. Recent research points to a possible alternative to address the magnetic interpolation problem by means of neural network algorithms. The key point of this approach is the ability neural networks have to learn from suitable training data representing the magnetic field behaviour. Despite the large distance to the test masses and the insufficient magnetic readings, artificial neural networks are able to significantly reduce the estimation error to acceptable levels. The learning efficiency can be best improved by making use of data obtained from on-ground measurements prior to mission launch in all relevant satellite locations and under real operation conditions. Reliable information on that appears to be essential for a meaningful assessment of magnetic noise in the LTP.

The magnetic diagnostics subsystem of the LISA Technology Package

International Nuclear Information System (INIS)

Diaz-Aguilo, M; Garcia-Berro, E; Lobo, A; Mateos, N; Sanjuan, J

2010-01-01

The Magnetic Diagnostics Subsystem of the LISA Technology Package (LTP) on board the LISA Pathfinder (LPF) spacecraft includes a set of four tri-axial fluxgate magnetometers, intended to measure with high precision the magnetic field at the positions they occupy. However, their readouts do not provide a direct measurement of the magnetic field at the positions of the test masses. Therefore, an interpolation method must be implemented to obtain this information. However, such interpolation process faces serious difficulties. Indeed, the size of the interpolation region is excessive for a linear interpolation to be reliable, and the number of magnetometer channels does not provide sufficient data to go beyond that poor approximation. Recent research points to a possible alternative to address the magnetic interpolation problem by means of neural network algorithms. The key point of this approach is the ability neural networks have to learn from suitable training data representing the magnetic field behaviour. Despite the large distance to the test masses and the insufficient magnetic readings, artificial neural networks are able to significantly reduce the estimation error to acceptable levels. The learning efficiency can be best improved by making use of data obtained from on-ground measurements prior to mission launch in all relevant satellite locations and under real operation conditions. Reliable information on that appears to be essential for a meaningful assessment of magnetic noise in the LTP.

Packaging of silicon sensors for microfluidic bio-analytical applications

International Nuclear Information System (INIS)

Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

2009-01-01

A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

Fecundity of Tribolium castaneum and Tribolium confusum adults after exposure to deltamethrin packaging

Science.gov (United States)

The red flour beetle, Tribolium castaneum (Herbst), and the confused flour beetle, Tribolium confusum Jacquelin du Val, are packaging invaders and will exploit any rip, tear, or defect in packaged food and infest the contents. Impregnating packaging materials with insecticides is a novel technologic...

Sterile Product Packaging and Delivery Systems.

Science.gov (United States)

Akers, Michael J

2015-01-01

Both conventional and more advanced product container and delivery systems are the focus of this brief article. Six different product container systems will be discussed, plus advances in primary packaging for special delivery systems and needle technology.

Investigations into High Temperature Components and Packaging

Energy Technology Data Exchange (ETDEWEB)

Marlino, L.D.; Seiber, L.E.; Scudiere, M.B.; M.S. Chinthavali, M.S.; McCluskey, F.P.

2007-12-31

The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105 C water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability. This report is organized with testing of new high temperature capacitors in Section 2 and testing of new 150 C junction temperature trench insulated gate bipolar transistor (IGBTs) in Section 3. Section 4 addresses some operational OPAL-GT information, which was necessary for developing module level tests. Section 5 summarizes calibration of equipment needed for the high temperature testing. Section 6 details some additional work that was funded on silicon carbide (SiC) device testing for high temperature use, and Section 7 is the complete text of a report funded from this effort summarizing packaging methods and their reliability issues for use in high temperature power electronics. Components were tested to evaluate the performance characteristics of the component at different operating temperatures. The temperature of the component is determined by the ambient temperature (i.e., temperature surrounding the device) plus the

Low-cost millimeter-wave transceiver module using SMD packaged MMICs

NARCIS (Netherlands)

Heijningen, M. van; Gauthier, G.

2004-01-01

This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and

Low-Cost Millimeter-Wave Transceiver Module using SMD packaged MMICs.

NARCIS (Netherlands)

2004-01-01

This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and

Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

DEFF Research Database (Denmark)

Jiang, Chenhui; Krozer, Viktor; Bach, H.-G.

2009-01-01

In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode...... conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates...

Reflective Packaging

Science.gov (United States)

1994-01-01

The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

Sensors and Micromachined Devices for the Automotive and New Markets: The Delphi Delco Electronics MEMS Story.

Science.gov (United States)

Logsdon, James

2002-03-01

This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.

Electronics, information, Communication and high technology

International Nuclear Information System (INIS)

1999-11-01

The contents of this book are summary of investigation, investigation system, purpose of investigation, characteristic of this investigation, important studying and development filed, compare of the level of research and development, policy, characteristic of the respondent, a future illustration in 2025 cause of hindrance of realization, propel method of research and development, the prediction of the realization period the result of investigation in electronics, information communication and high technology.

Raman spectroscopy, electronic microscopy and SPME-GC-MS to elucidate the mode of action of a new antimicrobial food packaging material.

Science.gov (United States)

Clemente, Isabel; Aznar, Margarita; Salafranca, Jesús; Nerín, Cristina

2017-02-01

One critical challenge when developing a new antimicrobial packaging material is to demonstrate the mode of action of the antimicrobials incorporated into the packaging. For this task, several analytical techniques as well as microbiology are required. In this work, the antimicrobial properties of benzyl isothiocyanate, allyl isothiocyanate and essential oils of cinnamon and oregano against several moulds and bacteria have been evaluated. Benzyl isothiocyanate showed the highest antimicrobial activity and it was selected for developing the new active packaging material. Scanning electron microscopy and Raman spectroscopy were successfully used to demonstrate the mode of action of benzyl isothiocyanate on Escherichia coli. Bacteria exhibited external modifications such as oval shape and the presence of septum surface, but they did not show any disruption or membrane damage. To provide data on the in vitro action of benzyl isothiocyanate and the presence of inhibition halos, the transfer mechanism to the cells was assessed using solid-phase microextraction-gas chromatography-mass spectrometry. Based on the transfer system, action mechanism and its stronger antimicrobial activity, benzyl isothiocyanate was incorporated to two kinds of antimicrobial labels. The labels were stable and active for 140 days against two mould producers of ochratoxin A; Penicillium verrucosum is more sensitive than Aspergillus ochraceus. Details about the analytical techniques and the results obtained are shown and discussed. Graphical Abstract Antimicrobial evaluation of pure compounds, incorporation in the packaging and study for mode of action on S. coli by Raman, SEM and SPME-GC-MS.

ESTAR, PSTAR, ASTAR. A PC package for calculating stopping powers and ranges of electrons, protons and helium ions. Version 2

International Nuclear Information System (INIS)

Berger, M.J.

1993-01-01

A PC package is documented for calculating stopping powers and ranges of electrons, protons and helium ions in matter for energies from 1 keV up to 10 GeV. Stopping powers and ranges for electrons can be calculated for any element, compound or mixture. Stopping powers and ranges of protons and helium ions can be calculated for 74 materials (26 elements and 48 compounds and mixtures). The files are stored on two HD diskettes in compressed form. Both executable files for IBM PC and Fortran-77 source files are provided. All three programs require 5.2 Mb of disk space. This set of two diskettes with detailed documentation is available upon request, cost free, from the IAEA Nuclear Data Section. (author). 25 refs, 4 tabs

Effects of Technological Parameters and Fishing Ground on Quality Attributes of Thawed, Chilled Cod Fillets Stored in Modified Atmosphere Packaging

DEFF Research Database (Denmark)

Bøknæs, Niels; Østerberg, Carsten; Sørensen, Rie

2001-01-01

. The parameters investigated were: (1) packaging in modified atmosphere during frozen storage, (2)frozen storage period and temperature, (3),fishing ground and chill storage temperature, together with (4) the addition of trimethylamine oxide (TMAO) and sodium chloride (NaCl) to cod fillets before freezing......Effects were studied of various technological parameters and fishing ground on quality attributes of thawed, chilled cod fillets stored in modified atmosphere packaging Frozen fillets of Baltic Sea and Barents Sea cod, representing two commercial fishing grounds, were used as raw material...... of Baltic Sea cod. Therefore, addition of trimethylamine oxide and NaCl to Baltic Sea cod fillets was evaluated and shown to protect P, phosphoreum against fro::en storage inactivation and this explained the observed differences in growth of the spoilage bacteria and trimethylamine production between thawed...

Inspection and verification of waste packages for near surface disposal

International Nuclear Information System (INIS)

2000-01-01

Extensive experience has been gained with various disposal options for low and intermediate level waste at or near surface disposal facilities. Near surface disposal is based on proven and well demonstrated technologies. To ensure the safety of near surface disposal facilities when available technologies are applied, it is necessary to control and assure the quality of the repository system's performance, which includes waste packages, engineered features and natural barriers, as well as siting, design, construction, operation, closure and institutional controls. Recognizing the importance of repository performance, the IAEA is producing a set of technical publications on quality assurance and quality control (QA/QC) for waste disposal to provide Member States with technical guidance and current information. These publications cover issues on the application of QA/QC programmes to waste disposal, long term record management, and specific QA/QC aspects of waste packaging, repository design and R and D. Waste package QA/QC is especially important because the package is the primary barrier to radionuclide release from a disposal facility. Waste packaging also involves interface issues between the waste generator and the disposal facility operator. Waste should be packaged by generators to meet waste acceptance requirements set for a repository or disposal system. However, it is essential that the disposal facility operator ensure that waste packages conform with disposal facility acceptance requirements. Demonstration of conformance with disposal facility acceptance requirements can be achieved through the systematic inspection and verification of waste packages at both the waste generator's site and at the disposal facility, based on a waste package QA/QC programme established by the waste generator and approved by the disposal operator. However, strategies, approaches and the scope of inspection and verification will be somewhat different from country to country

Effects of gamma irradiation on Commercial Food Packaging films

International Nuclear Information System (INIS)

Cabalar, P.J.; Abad, L.V.; Laurio, C.

2015-01-01

Gamma Radiation is a well-known technology to inactivate bacterial pathogens in food products. Currently, there is a growing interest in this technology considering its advantage of being a non-thermal process and the convenience of food being pre-packaged in its final form before treatment that prevents possible recontamination. The process of irradiating pre-packaged food requires that appropriate packaging materials are chosen as this would play a vital role in the quality assessment and safety evaluation of the irradiated products. Irradiation can cause changes to the packaging materials that might affect its integrity and functionality as a barrier e.g. to chemical or microbial contamination. Likewise, components of packaging materials that have been irradiated may migrate to food as a result of irradiation. Hence, this study was conducted to screen locally available commercial packaging films and determine its effect with radiation. Commercials packaging films made up of PET / FOIL / PE, Plain PET 12 / Foil 7 / PE 100, VMPET 12 / PE 70, OPP 20 / Foil 6.5 / PE 40, PET 12 / CPS 40, PET 12 / PE 50, Laminated PET / PE, Nylon / PE, and Nylon 15 / PE 50 were investigated for its effect with gamma radiation at 10 kGy. Their mechanical and thermal properties generally did not show any changes after irradiation except for OPP 20/ Foil 6.5 / PE 40. Gel Permeation Chromatography of leachates from water samples detected the presence of high molecular weight radiolytic products especially from laminated PET/PE films. Radiation effects were minimal for VMPET12/PE70, Nylon/PE and Nylon 15/PE 50 films. Preliminary results, using the stable isotope technique, to study the leachates in the water samples in contact with the packaging materials reveal an indicative increase in δ"1"8O"0/_0_0 and δD 0/_0_0.(author)

Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

Directory of Open Access Journals (Sweden)

Xuelin Wang

2016-11-01

Full Text Available This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc. to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good product—all of which are challenges faced by current liquid metal flexible printed electronics—are discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.

Advances in Packaging Methods, Processes and Systems

Directory of Open Access Journals (Sweden)

Nitaigour Premchand Mahalik

2014-10-01

Full Text Available The food processing and packaging industry is becoming a multi-trillion dollar global business. The reason is that the recent increase in incomes in traditionally less economically developed countries has led to a rise in standards of living that includes a significantly higher consumption of packaged foods. As a result, food safety guidelines have been more stringent than ever. At the same time, the number of research and educational institutions—that is, the number of potential researchers and stakeholders—has increased in the recent past. This paper reviews recent developments in food processing and packaging (FPP, keeping in view the aforementioned advancements and bearing in mind that FPP is an interdisciplinary area in that materials, safety, systems, regulation, and supply chains play vital roles. In particular, the review covers processing and packaging principles, standards, interfaces, techniques, methods, and state-of-the-art technologies that are currently in use or in development. Recent advances such as smart packaging, non-destructive inspection methods, printing techniques, application of robotics and machineries, automation architecture, software systems and interfaces are reviewed.

Development of Specifications for Radioactive Waste Packages

International Nuclear Information System (INIS)

2006-10-01

The main objective of this publication is to provide guidelines for the development of waste package specifications that comply with waste acceptance requirements for storage and disposal of radioactive waste. It will assist waste generators and waste package producers in selecting the most significant parameters and in developing and implementing specifications for each individual type of waste and waste package. This publication also identifies and reviews the activities and technical provisions that are necessary to meet safety requirements; in particular, selection of the significant safety parameters and preparation of specifications for waste forms, waste containers and waste packages using proven approaches, methods and technologies. This report provides guidance using a systematic, stepwise approach, integrating the technical, organizational and administrative factors that need to be considered at each step of planning and implementing waste package design, fabrication, approval, quality assurance and control. The report reflects the considerable experience and knowledge that has been accumulated in the IAEA Member States and is consistent with the current international requirements, principles, standards and guidance for the safe management of radioactive waste

Development of Specifications for Radioactive Waste Packages

Energy Technology Data Exchange (ETDEWEB)

NONE

2006-10-15

The main objective of this publication is to provide guidelines for the development of waste package specifications that comply with waste acceptance requirements for storage and disposal of radioactive waste. It will assist waste generators and waste package producers in selecting the most significant parameters and in developing and implementing specifications for each individual type of waste and waste package. This publication also identifies and reviews the activities and technical provisions that are necessary to meet safety requirements; in particular, selection of the significant safety parameters and preparation of specifications for waste forms, waste containers and waste packages using proven approaches, methods and technologies. This report provides guidance using a systematic, stepwise approach, integrating the technical, organizational and administrative factors that need to be considered at each step of planning and implementing waste package design, fabrication, approval, quality assurance and control. The report reflects the considerable experience and knowledge that has been accumulated in the IAEA Member States and is consistent with the current international requirements, principles, standards and guidance for the safe management of radioactive waste.

Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

Science.gov (United States)

Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S. R.; Silveira, Carlos G.; Rela, Paulo R.

2012-08-01

The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO2 and NOX removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and

Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

International Nuclear Information System (INIS)

Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S.R.; Silveira, Carlos G.

2012-01-01

The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO 2 and NO X removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and

Managing electronic records methods, best practices, and technologies

CERN Document Server

Smallwood, Robert F

2013-01-01

The ultimate guide to electronic records management, featuring a collaboration of expert practitioners including over 400 cited references documenting today's global trends, standards, and best practices Nearly all business records created today are electronic, and are increasing in number at breathtaking rates, yet most organizations do not have the policies and technologies in place to effectively organize, search, protect, preserve, and produce these records. Authored by an internationally recognized expert on e-records in collaboration with leading subject matter experts worldwide

Exploiting Nanotechnology and Radiation Technologies to Develop New Eco-Sustainable Nanomaterials for Food Packaging Suitable for Sterilization by Irradiation. Chapter 11

Energy Technology Data Exchange (ETDEWEB)

Silvestre, C.; Pezzuto, M.; Duraccio, D.; Marra, A.; Cimmino, S. [Istituto di Chimica e Tecnologia dei Polimeri, Consiglio Nazionale delle Ricerhe, Via Campi Flegrei 34, 80078, Pozzuoli, Napoli (Italy)

2014-07-15

The objective of the study is to develop new food packaging nanomaterials based on biopolymers (PLA) to be used in prepackaged foods intended for radiation. The processing conditions were optimized, and the properties of the systems before irradiation were studied. From these studies, the following conclusions were drawn: 1) The final properties of polymer nanocomposites depend on their structure and morphology, and 2) Improved properties can be achieved only if a good dispersion and distribution are realized in the polymer nanomaterials. The team at Istituto di Chimica e Tecnologia dei Polimeri, Consiglio Nazionale delle Ricerhe (ICTP/CNR) participated in the IAEA CRP on “Application of Radiation Processing Technology in the Development of Advanced Packaging Materials for Food Products”. (author)

Advanced Image Processing Package for FPGA-Based Re-Programmable Miniature Electronics

National Research Council Canada - National Science Library

Ovod, Vladimir I; Baxter, Christopher R; Massie, Mark A; McCarley, Paul L

2005-01-01

.... An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical background...

Ceramic ball grid array package stress analysis

Science.gov (United States)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

Packaging of structural health monitoring components

Science.gov (United States)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Packaging and transportation of radioactive materials

Energy Technology Data Exchange (ETDEWEB)

None

1978-01-01

The presentations made at the Symposium on Packaging and Transportation of Radioactive Materials are included. The purpose of the meeting was for the interchange of information on the technology and politics of radioactive material transportation. Separate abstracts were prepared for individual items. (DC)

Packaging and transportation of radioactive materials

International Nuclear Information System (INIS)

1978-01-01

The presentations made at the Symposium on Packaging and Transportation of Radioactive Materials are included. The purpose of the meeting was for the interchange of information on the technology and politics of radioactive material transportation. Separate abstracts were prepared for individual items

Special Article Ethics and Electronic Health Information Technology ...

African Journals Online (AJOL)

Objectives: The National Health Insurance Scheme (NHIS), and the National Identification Authority (NIA), pose ethical challenges to the physician-patient relationship due to interoperability. This paper explores (1) the national legislation on Electronic Health Information Technology (EHIT), (2) the ethics of information ...

A 3D printed dual GSM band near isotropic on-package antenna

KAUST Repository

Zhen, Su; Shamim, Atif

2017-01-01

.67 and 3.27 dBi at 900 MHz and 1800 MHz respectively). The antenna is printed with silver ink on a 3D printed polymer based package. The package houses the GSM electronics and the battery. By optimizing the antenna arms width and length, a near

Power Electronics Thermal Management R&D (Presentation)

Energy Technology Data Exchange (ETDEWEB)

Waye, S.

2014-11-01

This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus on thermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxes which much be removed from a smaller footprint, requiring advanced cooling strategies.

Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

International Nuclear Information System (INIS)

Blanton, P.

2000-01-01

This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

Columbus electronic freight management evaluation : achieving business benefits with EFM technologies.

Science.gov (United States)

2009-03-01

Effective innovation in information technology (IT) may be the most important tool for the private and public sectors to respond to international supply chain capacity constraints and congestion. Electronic Freight Management (EFM) technologies are m...

Innovative technologies in course Electrical engineering and electronics

Science.gov (United States)

Kuznetsov, E. V.; Kiselev, V. I.; Kulikova, E. A.

2017-11-01

Department of Electrical Engineering and Nondestructive Testing, NRU “MPEI”, has been working on development Electronic Learning Resources (ELRs) in course Electrical Engineering and Electronics for several years. This work have been focused on education intensification and effectiveness while training bachelors in nonelectrical specializations including students from Thermal and Atomic Power Engineering Institute. The developed ELRs are united in a tutorial module consisting of three parts (Electrical Circuits, Electrical Machines, Basics of Electronics): electronic textbook and workbook (ETW); virtual laboratory sessions (VLS); training sessions (ETS); personal tasks (PT); testing system that contains electronic tests in all course subjects and built-in verification of a student’s work results in ETW, VLS, ETS, PT. The report presents samples of different ELRs in html format and MathCAD, MatLAB Simulink applications, copyrighted programs in Java2, Delphi, VB6, C++. The report also contains the experience description, advantages and disadvantages of the new technologies. It is mentioned that ELRs provide new opportunities in course studying.

Advanced engineering materials and thick film hybrid circuit technology

International Nuclear Information System (INIS)

Faisal, S.; Aslam, M.; Mehmood, K.

2006-01-01

The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

Engineering tradeoffs in miniaturization of electronics for very large detectors

International Nuclear Information System (INIS)

Larsen, R.S.

1987-10-01

The trend toward Application-Specific Integrated Circuits and similar systems-on-a-chip-technologies is fueling a new wave of innovation in detector electronics, just in time to address some of the problems being introduced by detectors which will approach a million channels of electronics. The cost-effectiveness of these technologies can be easily demonstrated, and the trend of the past twenty years of achieving more powerful electronics at a lower per-channel cost should receive a major impetus. The investment required in the new technologies will reshape the work force of most laboratories, by providing more and better tools, and by requiring training or retraining of significant numbers of personnel. The need for new instrumentation standards will arise at new levels in the detectors of the future. The laboratories must also invest heavily in integrating various computer aided engineering and computer aided design tools into a smoothly functioning system. They must also establish a new and different kind of working relationship with vendors and suppliers of both basic devices as well as standard packaged products. This paper discusses three concepts

Electron Emitter for small-size Electrodynamic Space Tether using MEMS Technology

DEFF Research Database (Denmark)

Fleron, René A. W.; Blanke, Mogens

2004-01-01

Adjustment of the orbit of a spacecraft using the forces created by an electro-dynamic space-tether has been shown as a theoretic possibility in recent literature. Practical implementation is being pursued for larger scale missions where a hot filament device controls electron emission...... and the current flowing in the electrodynamic space tether. Applications to small spacecraft, or space debris in the 1–10 kg range, possess difficulties with electron emission technology, as low power emitting devices are needed. This paper addresses the system concepts of a small spacecraft electrodynamic tether...... system with focus on electron emitter design and manufacture using micro-electro-mechanical- system (MEMS) technology. The paper addresses the system concepts of a small size electrodynamic tether mission and shows a novel electron emitter for the 1-2 mA range where altitude can be effectively affected...

CERN's web application updates for electron and laser beam technologies

CERN Document Server

Sigas, Christos

2017-01-01

This report describes the modifications at CERN's web application for electron and laser beam technologies. There are updates at both the front and the back end of the application. New electron and laser machines were added and also old machines were updated. There is also a new feature for printing needed information.

Intelligent Packaging Systems: Sensors and Nanosensors to Monitor Food Quality and Safety

Directory of Open Access Journals (Sweden)

Guillermo Fuertes

2016-01-01

Full Text Available The application of nanotechnology in different areas of food packaging is an emerging field that will grow rapidly in the coming years. Advances in food safety have yielded promising results leading to the development of intelligent packaging (IP. By these containers, it is possible to monitor and provide information of the condition of food, packaging, or the environment. This article describes the role of the different concepts of intelligent packaging. It is possible that this new technology could reach enhancing food safety, improving pathogen detection time, and controlling the quality of food and packaging throughout the supply chain.

Packaging & Other Structures. Stuff That Works! A Technology Curriculum for the Elementary Grades.

Science.gov (United States)

Benenson, Gary

This book explores all kinds of packaging materials including bags, boxes, etc. and how they are used to protect and display products. Contents are divided into six chapters: (1) "Appetizers" includes activities that can be done individually to become familiar with the topic of packaging and structures; (2) "Concepts" provides…

Stepwise expansion of the bacteriophage ϕ6 procapsid: possible packaging intermediates.

Science.gov (United States)

Nemecek, Daniel; Cheng, Naiqian; Qiao, Jian; Mindich, Leonard; Steven, Alasdair C; Heymann, J Bernard

2011-11-25

The initial assembly product of bacteriophage ϕ6, the procapsid, undergoes major structural transformation during the sequential packaging of its three segments of single-stranded RNA. The procapsid, a compact icosahedrally symmetric particle with deeply recessed vertices, expands to the spherical mature capsid, increasing the volume available to accommodate the genome by 2.5-fold. It has been proposed that expansion and packaging are linked, with each stage in expansion presenting a binding site for a particular RNA segment. To investigate procapsid transformability, we induced expansion by acidification, heating, and elevated salt concentration. Cryo-electron microscopy reconstructions after all three treatments yielded the same partially expanded particle. Analysis by cryo-electron tomography showed that all vertices of a given capsid were either in a compact or an expanded state, indicating a highly cooperative transition. To benchmark the mature capsid, we analyzed filled (in vivo packaged) capsids. When these particles were induced to release their RNA, they reverted to the same intermediate state as expanded procapsids (intermediate 1) or to a second, further expanded state (intermediate 2). This partial reversibility of expansion suggests that the mature spherical capsid conformation is obtained only when sufficient outward pressure is exerted by packaged RNA. The observation of two intermediates is consistent with the proposed three-step packaging process. The model is further supported by the observation that a mutant capable of packaging the second RNA segment without previously packaging the first segment has enhanced susceptibility for switching spontaneously from the procapsid to the first intermediate state. Published by Elsevier Ltd.

Microstructure and property measurements on in situ TiB2/70Si–Al composite for electronic packaging applications

International Nuclear Information System (INIS)

Zhang, L.; Gan, G.S.; Yang, B.

2012-01-01

Highlights: ► 2.0 wt.%TiB 2 /70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB 2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties. -- Abstract: A novel reactive technique has been employed in fabrication of 2.0 wt.%TiB 2 /70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB 2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0 wt.%TiB 2 /70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.

Computation of integral electron storage ring beam characteristics in the application package DeCA. Version 3.3. A physical model

International Nuclear Information System (INIS)

Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

1993-01-01

In calculations and optimization of electron storage ring lattices, aside from solving the problem of particle motion stability in the ring and calculating ring structure functions and betatron tune, it is of great importance to determine the integral characteristics such as momentum compaction factor, chromaticity of the lattice, emittance, energy spread, bunch size, beam lifetime, etc. Knowing them, one is able to determine all most important properties which the beam would have in the storage ring, as well as to work out requirements for physical equipment of the ring. In this respect it is of importance to have a possibility of calculating rapidly all the parameters required. This paper describes convenient algorithms for calculating integral beam characteristics in electron storage rings, which are employed in the application package DeCA

High-power free-electron lasers-technology and future applications

Science.gov (United States)

Socol, Yehoshua

2013-03-01

Free-electron laser (FEL) is an all-electric, high-power, high beam-quality source of coherent radiation, tunable - unlike other laser sources - at any wavelength within wide spectral region from hard X-rays to far-IR and beyond. After the initial push in the framework of the “Star Wars” program, the FEL technology benefited from decades of R&D and scientific applications. Currently, there are clear signs that the FEL technology reached maturity, enabling real-world applications. E.g., successful and unexpectedly smooth commissioning of the world-first X-ray FEL in 2010 increased in one blow by more than an order of magnitude (40×) wavelength region available by FEL technology and thus demonstrated that the theoretical predictions just keep true in real machines. Experience of ordering turn-key electron beamlines from commercial companies is a further demonstration of the FEL technology maturity. Moreover, successful commissioning of the world-first multi-turn energy-recovery linac demonstrated feasibility of reducing FEL size, cost and power consumption by probably an order of magnitude in respect to previous configurations, opening way to applications, previously considered as non-feasible. This review takes engineer-oriented approach to discuss the FEL technology issues, keeping in mind applications in the fields of military and aerospace, next generation semiconductor lithography, photo-chemistry and isotope separation.

The development of MEMS device packaging technology using proton beam

International Nuclear Information System (INIS)

Hyeon, J. W.; Kong, Y. J.; Kim, E. H.; Kim, H. S.; No, S. J.

2006-05-01

Wafer-bonding techniques are key issues for the commercialization of MEMS(MicroElectroMechanical Systems) devices. The anodic bonding method and the wafer direct-bonding method are well-known major techniques for wafer bonding. Due to the anodic bonding method includes high voltage processes above 1.5 kV, the MEMS devices can be damaged during the bonding process or malfunctioned while long-term operation. On the other hand, since the wafer direct-bonding method includes a high temperature processes above 1000 .deg. C, temperature-sensitive materials and integrated circuits will be damaged or degraded during the bonding processes. Therefore, high-temperature bonding processes are not applicable for fabricating or packaging devices where temperature-sensitive materials exist. During the past few years, much effort has been undertaken to find a reliable bonding process that can be conducted at a low temperature. Unfortunately, these new bonding processes depend highly on the bonding material, surface treatment and surface flatness. In this research, a new packaging method using proton beam irradiation is proposed. While the energy loss caused in an irradiated material by X-rays or electron beams decreases with the surface distance, the energy loss caused by proton beams has a maximum value at the Bragg peak. Thus, the localized energy produced at the Bragg peak of the proton beams can be used to bond pyrex glass on a silicon wafer, so the MEMS damage is expected to be minimized. The localized heating caused by as well as the penetration depth, or the proton beam has been investigated. The energy absorbed in a stack of pyrex glass/silicon wafers due to proton-beam irradiation was numerically calculated for various proton energies by using the SRIM program. The energy loss was shown to be sufficiently localized at the interface between the pyrex glass and the silicon wafer. Proton beam irradiation was performed in the common environment of room temperature and

Application of nano-packaging in aquatics

Directory of Open Access Journals (Sweden)

D Jafarpour

2018-03-01

Conclusion: With regard to aquatics high nutritional value and their important presence in diet one should think of a way to increase it's survivability and maintaining quality. For this, nano technology can help packaging aquatics. Nano can be applied considerably in food health and environment protection.

Future applications of electronic-nose technologies in healthcare and biomedicine

Science.gov (United States)

Alphus D. Wilson

2011-01-01

The development and utilization of many new electronic-nose (e-nose) applications in the healthcare and biomedical fields have continued to rapidly accelerate over the past 20 years. Innovative e-nose technologies are providing unique solutions to a diversity of complex problems in biomedicine that are now coming to fruition. A wide range of electronic-nose instrument...

Power Electronics as key technology in wind turbines

DEFF Research Database (Denmark)

Blaabjerg, Frede

2005-01-01

This paper discuss the development in wind turbines in a two-decade perspective looking at the technology based on track records. Different power electronic topologies for interfacing the wind turbine to the grid are discussed and related to the possibility for the wind turbine to act as a power...

High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

Science.gov (United States)

Neudeck, Philip G.; Okojie, Robert S.; Chen, Liang-Yu

2002-01-01

It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

Food packaging materials and radiation processing of food: a brief review

International Nuclear Information System (INIS)

Chuaqui-Offermanns, N.

1989-01-01

Food is usually packaged to prevent microbial contamination and spoilage. Ionizing radiation can be applied to food-packaging materials in two ways: (i) sterilization of packaging materials for aseptic packaging, and (ii) radiation processing of prepackaged food. In aseptic packaging, a sterile package is filled with a sterile product in a microbiologically controlled environment. In irradiation of prepackaged food, the food and the packaging material are irradiated simultaneously. For both applications, the radiation stability of the packaging material is a key consideration if the technology is to be used successfully. To demonstrate the radiation stability of the packaging material, it must be shown that irradiation does not significantly alter the physical and chemical properties of the material. The irradiated material must protect the food from environmental contamination while maintaining its organoleptic and toxicological properties. Single-layer plastics cannot meet the requirements of either application. Multilayered structures produced by coextrusion would likely satisfy the demands of radiation processing prepackaged food. In aseptic packaging, the package is irradiated prior to filling, making demands on toxicological safety less stringent. Therefore, multilayered structures produced by coextrusion, lamination or co-injection moulding could satisfy the requirements. (author)

DOE-EM-45 Packaging Operations And Maintenance Course

International Nuclear Information System (INIS)

Watkins, R.; England, J.

2010-01-01

Savannah River National Laboratory - Savannah River Packaging Technology (SRNL-SRPT) delivered the inaugural offering of the Packaging Operations and Maintenance Course for DOE-EM-45's Packaging Certification Program (PCP) at the University of South Carolina Aiken on September 1 and 2, 2009. Twenty-nine students registered, attended, and completed this training. The DOE-EM-45 Packaging Certification Program (PCP) sponsored the presentation of a new training course, Packaging Maintenance and Operations, on September 1-2, 2009 at the University of South Carolina Aiken (USC-Aiken) campus in Aiken, SC. The premier offering of the course was developed and presented by the Savannah River National Laboratory, and attended by twenty-nine students across the DOE, NNSA and private industry. This training informed package users of the requirements associated with handling shipping containers at a facility (user) level and provided a basic overview of the requirements typically outlined in Safety Analysis Report for Packaging (SARP) Chapters 1, 7, and 8. The course taught packaging personnel about the regulatory nature of SARPs to help reduce associated and often costly packaging errors. Some of the topics covered were package contents, loading, unloading, storage, torque requirements, maintaining records, how to handle abnormal conditions, lessons learned, leakage testing (including demonstration), and replacement parts. The target audience for this course was facility operations personnel, facility maintenance personnel, and field quality assurance personnel who are directly involved in the handling of shipping containers. The training also aimed at writers of SARP Chapters 1, 7, and 8, package designers, and anyone else involved in radioactive material packaging and transportation safety. Student feedback and critiques of the training were very positive. SRNL will offer the course again at USC Aiken in September 2010.

Hanford high-level waste melter system evaluation data packages

International Nuclear Information System (INIS)

Elliott, M.L.; Shafer, P.J.; Lamar, D.A.; Merrill, R.A.; Grunewald, W.; Roth, G.; Tobie, W.

1996-03-01

The Tank Waste Remediation System is selecting a reference melter system for the Hanford High-Level Waste vitrification plant. A melter evaluation was conducted in FY 1994 to narrow down the long list of potential melter technologies to a few for testing. A formal evaluation was performed by a Melter Selection Working Group (MSWG), which met in June and August 1994. At the June meeting, MSWG evaluated 15 technologies and selected six for more thorough evaluation at the Aug. meeting. All 6 were variations of joule-heated or induction-heated melters. Between the June and August meetings, Hanford site staff and consultants compiled data packages for each of the six melter technologies as well as variants of the baseline technologies. Information was solicited from melter candidate vendors to supplement existing information. This document contains the data packages compiled to provide background information to MSWG in support of the evaluation of the six technologies. (A separate evaluation was performed by Fluor Daniel, Inc. to identify balance of plant impacts if a given melter system was selected.)

Organic electronics: materials, technology and circuit design developments enabling new applications

NARCIS (Netherlands)

Leeuw, de D.M.; Cantatore, E.

2009-01-01

Organic electronics is growing to become an important new field in the global electronics market. RFID labels, flexible displays, solar cells, OLED-based lighting and displays are only some of the innovative products enabled by technologies based on organic semiconductors. Starting from a short

Pulsed electron accelerator for radiation technologies in the enviromental applications

Science.gov (United States)

Korenev, Sergey

1997-05-01

The project of pulsed electron accelerator for radiation technologies in the environmental applications is considered. An accelerator consists of high voltage generator with vacuum insulation and vacuum diode with plasma cathode on the basis discharge on the surface of dielectric of large dimensions. The main parameters of electron accelerators are following: kinetic energy 0.2 - 2.0 MeV, electron beam current 1 - 30 kA and pulse duration 1- 5 microseconds. The main applications of accelerator for decomposition of wastewaters are considered.

Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

OpenAIRE

Shan, Kun; Julius, Joezer

2015-01-01

AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

Proceedings of 8. national conference on nuclear electronic and nuclear detection technology: Pt.1

International Nuclear Information System (INIS)

1996-01-01

The 8th National Conference on Nuclear Electronics and Nuclear Detection Technology was held during 2-7, 12, 1996 in Zhuhai, Guangdong, China. 184 pieces of papers were collected in the conference proceedings. The contents of the conference proceedings are: nuclear electronics, nuclear detectors, nuclear instruments and its application, nuclear medical electronics, computer applications in nuclear sciences and technology, measurement of nuclear monitoring and nuclear explosion, radiation hardened electronics, liquid scintillation counting techniques and miscellaneous. Reported hereafter is the first part of the proceedings

The Innovations, Technology and Waste Management Approaches to Safely Package and Transport the World's First Radioactive Fusion Research Reactor for Burial

International Nuclear Information System (INIS)

Keith Rule; Erik Perry; Jim Chrzanowski; Mike Viola; Ron Strykowsky

2003-01-01

Original estimates stated that the amount of radioactive waste that will be generated during the dismantling of the Tokamak Fusion Test Reactor will approach two million kilograms with an associated volume of 2,500 cubic meters. The materials were activated by 14 MeV neutrons and were highly contaminated with tritium, which present unique challenges to maintain integrity during packaging and transportation. In addition, the majority of this material is stainless steel and copper structural metal that were specifically designed and manufactured for this one-of-a-kind fusion research reactor. This provided further complexity in planning and managing the waste. We will discuss the engineering concepts, innovative practices, and technologies that were utilized to size reduce, stabilize, and package the many unique and complex components of this reactor. This waste was packaged and shipped in many different configurations and methods according to the transportation regulations and disposal facility requirements. For this particular project, we were able to utilize two separate disposal facilities for burial. This paper will conclude with a complete summary of the actual results of the waste management costs, volumes, and best practices that were developed from this groundbreaking and successful project

Completion of the radioactive materials packaging handbook

International Nuclear Information System (INIS)

Shappert, L.B.

1998-01-01

'The Radioactive Materials Packaging Handbook: Design, Operation and Maintenance', which will serve as a replacement for the 'Cask Designers Guide'(1970), has now been completed and submitted to the Oak Ridge National Laboratory (ORNL) electronics publishing group for layout and printing; it is scheduled to be printed in late spring 1998. The Handbook, written by experts in their particular fields, is a compilation of technical chapters that address the design aspects of a package intended for transporting radioactive material in normal commerce; it was prepared under the direction of M. E. Wangler of the US DOE and is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators on specific aspects of package design, and the types of analyses that should be considered when designing a package to carry radioactive materials. Even though the Handbook is concerned with both small and large packagings, most of the emphasis is placed on large packagings that are capable of transporting fissile, radioactive sources (e.g. spent fuels). The safety analysis reports for packagings (SARPs) must address the widest range of technical topics in order to meet United States and/or international regulations, all of which are covered in the Handbook. One of the primary goals of the Handbook is to provide information which would guide designers of radioactive materials packages to make decisions that would most likely be acceptable to regulatory agencies during the approval process of the packaging. It was therefore important to find those authors who not only were experts in one or more of the areas that are addressed in a SARP, but who also had been exposed to the regulatory process or had operational experience dealing with a wide variety of package types. Twenty-five such people have contributed their time and talents to the development of this document, mostly on a volunteer basis

White LED with High Package Extraction Efficiency

International Nuclear Information System (INIS)

Yi Zheng; Stough, Matthew

2008-01-01

The goal of this project is to develop a high efficiency phosphor converting (white) Light Emitting Diode (pcLED) 1-Watt package through an increase in package extraction efficiency. A transparent/translucent monolithic phosphor is proposed to replace the powdered phosphor to reduce the scattering caused by phosphor particles. Additionally, a multi-layer thin film selectively reflecting filter is proposed between blue LED die and phosphor layer to recover inward yellow emission. At the end of the project we expect to recycle approximately 50% of the unrecovered backward light in current package construction, and develop a pcLED device with 80 lm/W e using our technology improvements and commercially available chip/package source. The success of the project will benefit luminous efficacy of white LEDs by increasing package extraction efficiency. In most phosphor-converting white LEDs, the white color is obtained by combining a blue LED die (or chip) with a powdered phosphor layer. The phosphor partially absorbs the blue light from the LED die and converts it into a broad green-yellow emission. The mixture of the transmitted blue light and green-yellow light emerging gives white light. There are two major drawbacks for current pcLEDs in terms of package extraction efficiency. The first is light scattering caused by phosphor particles. When the blue photons from the chip strike the phosphor particles, some blue light will be scattered by phosphor particles. Converted yellow emission photons are also scattered. A portion of scattered light is in the backward direction toward the die. The amount of this backward light varies and depends in part on the particle size of phosphors. The other drawback is that yellow emission from phosphor powders is isotropic. Although some backward light can be recovered by the reflector in current LED packages, there is still a portion of backward light that will be absorbed inside the package and further converted to heat. Heat generated

A systematic review of portable electronic technology for health education in resource-limited settings.

Science.gov (United States)

McHenry, Megan S; Fischer, Lydia J; Chun, Yeona; Vreeman, Rachel C

2017-08-01

The objective of this study is to conduct a systematic review of the literature of how portable electronic technologies with offline functionality are perceived and used to provide health education in resource-limited settings. Three reviewers evaluated articles and performed a bibliography search to identify studies describing health education delivered by portable electronic device with offline functionality in low- or middle-income countries. Data extracted included: study population; study design and type of analysis; type of technology used; method of use; setting of technology use; impact on caregivers, patients, or overall health outcomes; and reported limitations. Searches yielded 5514 unique titles. Out of 75 critically reviewed full-text articles, 10 met inclusion criteria. Study locations included Botswana, Peru, Kenya, Thailand, Nigeria, India, Ghana, and Tanzania. Topics addressed included: development of healthcare worker training modules, clinical decision support tools, patient education tools, perceptions and usability of portable electronic technology, and comparisons of technologies and/or mobile applications. Studies primarily looked at the assessment of developed educational modules on trainee health knowledge, perceptions and usability of technology, and comparisons of technologies. Overall, studies reported positive results for portable electronic device-based health education, frequently reporting increased provider/patient knowledge, improved patient outcomes in both quality of care and management, increased provider comfort level with technology, and an environment characterized by increased levels of technology-based, informal learning situations. Negative assessments included high investment costs, lack of technical support, and fear of device theft. While the research is limited, portable electronic educational resources present promising avenues to increase access to effective health education in resource-limited settings, contingent

Application of pulse power technology to ultra high energy electron accelerators

International Nuclear Information System (INIS)

Nation, J.A.

1989-01-01

The author presents in this paper a review of the application of pulse power technology to the development of high gradient electron accelerators. The technology demands are relatively modest compared to the ultra high power technology used for inertial confinement fusion drivers. With the advent of magnetic switching intense electron beams can be generated with a sufficiently high repetition rate to be of interest for high energy electron accelerator driver applications. Most of the techniques considered rely on the excitation of large amplitude waves on the beams. Within this framework there are two broad categories of accelerator, those in which the waves are directly excited in and supported by the medium and, secondly, those where the waves are used to generate radiofrequency signals which are then coupled via structures to the beam being accelerated. In what follows we shall consider both approaches. Present-day pulse power technology limits pulse durations to about 100 nsec. Consequently, if these sources are to be used, we will need to use high group velocity structures to avoid the need for short accelerator module lengths. An advantage of the short pulse duration is that the available acceleration voltage gradient increases compared to that obtained using conventional rf drivers. 19 references, 9 figures, 1 table

Development of High Temperature Capacitor Technology and Manufacturing Capability

Energy Technology Data Exchange (ETDEWEB)

None, None

2011-05-15

The goal of the Development of High Temperature Capacitor Technology and Manufacturing Capability program was to mature a production-ready supply chain for reliable 250°C FPE (fluorinated polyester) film capacitors by 2011. These high-temperature film capacitors enable both the down hole drilling and aerospace industries by enabling a variety of benefits including: - Deeper oil exploration in higher temperature and pressure environments - Enabling power electronic and control equipment to operate in higher temperature environments - Enabling reduced cooling requirements of electronics - Increasing reliability and life of capacitors operating below rated temperature - Enabling capacitors to handle higher electrical losses without overheating. The key challenges to bringing the FPE film capacitors to market have been manufacturing challenges including: - FPE Film is difficult to handle and wind, resulting in poor yields - Voltage breakdown strength decreases when the film is wound into capacitors (~70% decrease) - Encapsulation technologies must be improved to enable higher perature operation - Manufacturing and test cycle time is very long As a direct result of this program most of the manufacturing challenges have been met. The FPE film production metalization and winding yield has increased to over 82% from 70%, and the voltage breakdown strength of the wound capacitors has increased 270% to 189 V/μm. The high temperature packaging concepts are showing significant progress including promising results for lead attachments and hermetic packages at 200°C and non-hermetic packages at 250°C. Manufacturing and test cycle time will decrease as the market for FPE capacitors develops.

Fiscal 1998 R and D report on femtosecond technology (ultra-short pulse optoelectronics technology); 1998 nendo femuto byo technology no kenkyu kaihatsu (chotan pulse hikari electronics gijutsu kaihatsu) seika hokokusho

Energy Technology Data Exchange (ETDEWEB)

NONE

1999-03-01

This report reports the result of the fiscal 1998 R and D on femtosecond technology supported by NEDO. For creation of industrial basic technologies supporting the advanced information society in the 21st century, ultra-high speed electronics technology including new functions beyond the speed limit of conventional electronics technologies is indispensable. From such viewpoint, this R and D aims at establishment of the basic technology necessary for ultra- high speed electronics technology through R and D of technology controlling conditions of beams and electrons in a femtosecond (10{sup -15}-10{sup -12} seconds) region. In fiscal 1998, this project first succeeded in fabrication of a prototype pulse compressor by using semiconductors, and developed a new pulse compressing method by using fibers to generate ultra-short pulse of 38fs. By developing new materials for intersubband transition where ultra-high speed responses can be expected, optical absorption by intersubband transition was first confirmed at optical communication wavelength. The main result for every theme is reported and explained. (NEDO)

Radiation sensitivity of foodborne pathogens in meat byproducts with different packaging

International Nuclear Information System (INIS)

Yong, Hae In; Kim, Hyun-Joo; Nam, Ki Chang; Kwon, Joong Ho; Jo, Cheorun

2015-01-01

The aim of this study was to determine radiation sensitivity of Escherichia coli O157:H7 and Listeria monocytogenes in edible meat byproducts. Seven beef byproducts (heart, liver, lung, lumen, omasum, large intestine, and small intestine) and four pork byproducts (heart, large intestine, liver, and small intestine) were used. Electron beam irradiation significantly reduced the numbers of pathogenic microorganisms in meat byproducts and no viable cells were detected in both aerobically- and vacuum-packaged samples irradiated at 4 kGy. Meat byproducts packed under vacuum had higher D 10 value than the ones packed aerobically. No significant difference was observed between the D 10 values of E. coli O157:H7 and L. monocytogenes inoculated in either aerobically or vacuum packaged samples. These results suggest that low-dose electron beam irradiation can significantly decrease microbial numbers and reduce the risk of meat byproduct contamination by the foodborne pathogens. - Highlights: • Radiation sensitivities of pathogens in meat byproduct were tested. • Electron beam irradiation of 3 or 4 kGy reduced pathogens by> 9 log • The D 10 values were lower in the aerobic-packaging than under vacuum condition

Power electronics - The key technology for Renewable Energy Systems

DEFF Research Database (Denmark)

Blaabjerg, Frede; Ma, Ke; Yang, Yongheng

2014-01-01

The energy paradigms in many countries (e.g. Germany and Denmark) have experienced a significant change from fossil-based resources to clean renewables (e.g. wind turbines and photovoltaics) in the past few decades. The scenario of highly penetrated renewables is going to be further enhanced...... - Denmark expects to be 100 % fossil-free by 2050. Consequently, it is required that the production, distribution and use of the energy should be as technologically efficient as possible and incentives to save energy at the end-user should also be strengthened. In order to realize the transition smoothly...... and effectively, energy conversion systems, currently based on power electronics technology, will again play an essential role in this energy paradigm shift. Using highly efficient power electronics in power generation, power transmission/distribution and end-user application, together with advanced control...