WorldWideScience

Sample records for electronic packaging applications

  1. 500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

    Science.gov (United States)

    Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

    2016-01-01

    High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

  2. Diamond-based heat spreaders for power electronic packaging applications

    Science.gov (United States)

    Guillemet, Thomas

    As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging

  3. Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

    CERN Document Server

    Liu, Yong

    2012-01-01

    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

  4. Application of electron irradiation to food containers and packaging materials

    International Nuclear Information System (INIS)

    Ueno, Koji

    2010-01-01

    Problems caused by microbial contamination and hazardous chemicals have attracted much attention in the food industry. The number of systems such as hygienic management systems and Hazard Analysis Critical Control Point (HACCP) systems adopted in the manufacturing process is increasing. As manufacturing process control has become stricter, stricter control is also required for microbial control for containers and packaging materials (from disinfection to sterilization). Since safe and reliable methods for sterilizing food containers and packaging materials that leave no residue are required, electron beam sterilization used for medical equipment has attracted attention from the food industry. This paper describes an electron irradiation facility, methods for applying electron beams to food containers and packaging materials, and products irradiated with electron beams. (author)

  5. Carbon Nano tube Composites for Electronic Packaging Applications: A Review

    International Nuclear Information System (INIS)

    Aryasomayajula, L.; Wolter, K.J.

    2013-01-01

    Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nano tubes has opened new possibilities to face challenges better. Carbon Nano tubes are known for their high mechanical strength, excellent thermal and electrical properties. Recent research has made progress in fabricating carbon nano tube metal matrix and polymer-based composites. The methods of fabrication of these composites, their properties and possible applications restricted to the field of electronic packaging have been discussed in this paper. Experimental and theoretical calculations have shown improved mechanical and physical properties like tensile stress, toughness, and improved electrical and thermal properties. They have also demonstrated the ease of production of the composites and their adaptability as one can tailor their properties as per the requirement. This paper reviews work reported on fabricating and characterizing carbon- nano tube-based metal matrix and polymer composites. The focus of this paper is mainly to review the importance of these composites in the field of electronics packaging.

  6. Electronic equipment packaging technology

    CERN Document Server

    Ginsberg, Gerald L

    1992-01-01

    The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

  7. Packaging Technologies for 500C SiC Electronics and Sensors

    Science.gov (United States)

    Chen, Liang-Yu

    2013-01-01

    Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

  8. Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

    Science.gov (United States)

    Ghaffarian, Reza

    2015-01-01

    The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

  9. Power Electronics Packaging Reliability | Transportation Research | NREL

    Science.gov (United States)

    Packaging Reliability Power Electronics Packaging Reliability A photo of a piece of power electronics laboratory equipment. NREL power electronics packaging reliability research investigates the electronics packaging around a semiconductor switching device determines the electrical, thermal, and

  10. Polymers for electronic & photonic application

    CERN Document Server

    Wong, C P

    2013-01-01

    The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be info

  11. Application of GA package in functional packaging

    Science.gov (United States)

    Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

    2018-05-01

    The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

  12. Packaging and Embedded Electronics for the Next Generation

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  13. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  14. Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

    International Nuclear Information System (INIS)

    Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung-hyun; Nah, Jae-Woong; Paik, Kyung-Wook; Kwon, Dongil

    2004-01-01

    Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 deg. C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA)

  15. Annual Symposium in Electronics Packaging

    CERN Document Server

    1991-01-01

    Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be cle...

  16. The application package DeCA for calculating cyclic accelerators

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Zelinsky, A.Yu.; Strelkov, M.A.

    1993-01-01

    The application Package DeCA (Design Cyclic Accelerator) is offered to solve a set of problem which arise on designing electron storage rings. The package is based on the block principle. This makes it extremely flexible in designing storage rings and investigating beam dynamics in them. The package is intended for a user not familiar with programming languages, it is arranged so that the user familiar with FORTRAN-77 can easily extend the package functions. This is of particular interest, when the input data are the storage ring or electron bunch parameters. The code allows operation in both the batch and interactive modes. The programming language is FORTRAN-77. The capacity of the total package is 40,000 code lines. The necessary main storage capacity for the total version is 4 Mbytes

  17. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal; Romenesco, Bruce

    2011-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  18. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal

    2000-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  19. Japan's electronic packaging technologies

    Science.gov (United States)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  20. 75 FR 22437 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2010-04-28

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application packages are available from the IRS at this time... Elderly (TCE) Program is July 9, 2010. ADDRESSES: Electronic copies of the application package can be...

  1. 76 FR 30243 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2011-05-24

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application Packages are available from the IRS on May 23, 2011... Elderly (TCE) Program is June 30, 2011. Electronic copies of the application package can be obtained by...

  2. Applications of Active Packaging in Breads

    Directory of Open Access Journals (Sweden)

    Ali Göncü

    2017-10-01

    Full Text Available Changes on consumer preferences lead to innovations and improvements in new packaging technologies. With these new developments passive packaging technologies aiming to protect food nowadays have left their place to active and intelligent packaging technologies that have other various functions beside protection of food. Active packaging is defined as an innovative packaging type and its usage increases the shelf life of food significantly. Applications of active packaging have begun to be used for packaging of breads. In this study active packaging applications in breads have been reviewed.

  3. Optical Thermal Characterization Enables High-Performance Electronics Applications

    Energy Technology Data Exchange (ETDEWEB)

    2016-02-01

    NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.

  4. Functional Requirements for an Electronic Work Package System

    Energy Technology Data Exchange (ETDEWEB)

    Oxstrand, Johanna H. [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2016-12-01

    This document provides a set of high level functional requirements for a generic electronic work package (eWP) system. The requirements have been identified by the U.S. nuclear industry as a part of the Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative. The functional requirements are mainly applied to eWP system supporting Basic and Moderate types of smart documents, i.e., documents that have fields for recording input such as text, dates, numbers, and equipment status, and documents which incorporate additional functionalities such as form field data “type“ validation (e.g. date, text, number, and signature) of data entered and/or self-populate basic document information (usually from existing host application meta data) on the form when the user first opens it. All the requirements are categorized by the roles; Planner, Supervisor, Craft, Work Package Approval Reviewer, Operations, Scheduling/Work Control, and Supporting Functions. The categories Statistics, Records, Information Technology are also included used to group the requirements. All requirements are presented in Section 2 through Section 11. Examples of more detailed requirements are provided for the majority of high level requirements. These examples are meant as an inspiration to be used as each utility goes through the process of identifying their specific requirements. The report’s table of contents provides a summary of the high level requirements.

  5. Assessment of microelectronics packaging for high temperature, high reliability applications

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, F.

    1997-04-01

    This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

  6. Application of phase change materials in thermal management of electronics

    International Nuclear Information System (INIS)

    Kandasamy, Ravi; Wang Xiangqi; Mujumdar, Arun S.

    2007-01-01

    Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications

  7. Electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

  8. Packaging of silicon sensors for microfluidic bio-analytical applications

    International Nuclear Information System (INIS)

    Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

    2009-01-01

    A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

  9. Electronic packaging: new results in singulation by Laser Microjet

    Science.gov (United States)

    Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

    2004-07-01

    Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

  10. NASA Electronic Parts and Packaging (NEPP) Program - Update

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

  11. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

    Directory of Open Access Journals (Sweden)

    Masaru Ishizuka

    2011-01-01

    Full Text Available In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

  12. Decontamination of food packaging using electron beam--status and prospects

    Energy Technology Data Exchange (ETDEWEB)

    Mittendorfer, J. E-mail: htcmitt@eunet.at; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E

    2002-03-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

  13. Decontamination of food packaging using electron beam—status and prospects

    Science.gov (United States)

    Mittendorfer, J.; Bierbaumer, H. P.; Gratzl, F.; Kellauer, E.

    2002-03-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

  14. Decontamination of food packaging using electron beam--status and prospects

    International Nuclear Information System (INIS)

    Mittendorfer, J.; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E.

    2002-01-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding

  15. JTEC Panel report on electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

  16. Extreme temperature packaging: challenges and opportunities

    Science.gov (United States)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  17. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.; Cordero, Marlon D.; Nassar, Joanna M.; Hanna, Amir; Kutbee, Arwa T.; Carreno, Armando Arpys Arevalo; Hussain, Muhammad Mustafa

    2016-01-01

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  18. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.

    2016-10-14

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  19. Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

    2015-01-01

    This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

  20. Use of EVOH for Food Packaging Applications

    OpenAIRE

    Gavara, Rafael; Catalá Moragrega, Ramón; López Carballo, Gracia; Cerisuelo, Josep Pascual; Domínguez, Irene; Muriel Galet, Virginia; Hernández Muñoz, Pilar

    2017-01-01

    Ethylene-vinyl alcohol copolymers (EVOH) are a family of thermoplastic polymers with application in many industrial sectors including packaging and, especially, food packaging. The main characteristic of EVOH copolymers for packaging applications is their outstanding barrier to gases (oxygen, carbon dioxide, …) and organic vapors (food aroma). EVOH is applied in multilayer structures for bags, trays, cups, bottles, squeezable tubes or jars to protect oxygen-sensitive products. However, the hy...

  1. Electrically and Thermally Conducting Nanocomposites for Electronic Applications

    Directory of Open Access Journals (Sweden)

    Daryl Santos

    2010-02-01

    Full Text Available Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i dispersion of carbon nanotubes in the polymer host, (ii carbon nanotube-polymer interaction and the nature of the interface, and (iii alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.

  2. Application of Green Environmentally Friendly Materials in Food Packaging

    Directory of Open Access Journals (Sweden)

    Jixia Li

    2017-11-01

    Full Text Available With social development, requirements on the spiritual and material life have increased. However, some environmental issues appear, for example, in food packaging. Application of environment-friendly materials in food packaging has been more and more attractive. This study analyses the characteristics of degradable food packaging material and the existing problems, proposes the manufacturing of food packaging with poly(lactic acid/nanocrystalline cellulose composite material, tests its thermal and mechanical properties, and applies it to the design of food packaging. The results demonstrate that the thermal and mechanical properties of the material could satisfy the requirements of food packaging and that the material is applicable to the design of food packaging in the future. This work provides a reference for the application of green, environment-friendly materials in the design of food packaging.

  3. Development in Electronic Packaging – Moving to 3D System Configuration

    Directory of Open Access Journals (Sweden)

    I. Szendiuch

    2011-04-01

    Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

  4. Microstructure and property measurements on in situ TiB2/70Si–Al composite for electronic packaging applications

    International Nuclear Information System (INIS)

    Zhang, L.; Gan, G.S.; Yang, B.

    2012-01-01

    Highlights: ► 2.0 wt.%TiB 2 /70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB 2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties. -- Abstract: A novel reactive technique has been employed in fabrication of 2.0 wt.%TiB 2 /70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB 2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0 wt.%TiB 2 /70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.

  5. Computation of integral electron storage ring beam characteristics in the application package DeCA. Version 3.3. A physical model

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

    1993-01-01

    In calculations and optimization of electron storage ring lattices, aside from solving the problem of particle motion stability in the ring and calculating ring structure functions and betatron tune, it is of great importance to determine the integral characteristics such as momentum compaction factor, chromaticity of the lattice, emittance, energy spread, bunch size, beam lifetime, etc. Knowing them, one is able to determine all most important properties which the beam would have in the storage ring, as well as to work out requirements for physical equipment of the ring. In this respect it is of importance to have a possibility of calculating rapidly all the parameters required. This paper describes convenient algorithms for calculating integral beam characteristics in electron storage rings, which are employed in the application package DeCA

  6. Radiation disinfestation of used packagings: irradiation trials with electron beams

    International Nuclear Information System (INIS)

    Ignatowicz, S.; Zaedee, I.

    1994-01-01

    Used bags, sacks and other packagings are often infested with insects and mites - pest of stored products. Such packagings provide a source of infestation of a new lot or unit of agricultural products. Cleaning of repeatedly used packages is the most important preventive method. After using, the bags and sacks should be carefully beaten with a mechanical or hand beater. When pests are found, the packages should be disinfested with hot air or hot water. Larger numbers of bags are usually fumigated in a special fumigation chamber. Disinfestation by radiation processing is potentially a feasible substitute for chemical fumigation. In the present paper trials of radiation disinfestation of used bags are described and discussed. Information about using electron beams for pest disinfestation of jute and polyvinyl chloride bags (plastic bags) is provided. The absorbed dose is the most important irradiation process parameter. The lethal effects equivalent to chemical insecticides are obtained by high doses of ionizing radiation. Control of insect and/or mite infestation of the repeatedly used packagings may be secured by ionizing radiation applied at 2-3 kGy. These doses result in complete mortality of stored product pests within a few days. The radiation must penetrate deeply into the target product at sufficient level. Gamma rays and X-rays penetrate into the treated products easily but electron radiation penetrating is much lower, depending on electron energy applied. The results of this study indicate that bags made of polyvinyl chloride may be disinfested with electron beams when are created as separate units or batches up to 50 bags. Penetrability of jute bags is lower than the plastic bags. Therefore the jute bags should be irradiated with electrons as batches containing no more than 30 bags. (author)

  7. Packaging Technologies for High Temperature Electronics and Sensors

    Science.gov (United States)

    Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

    2013-01-01

    This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

  8. Advanced materials for thermal management of electronic packaging

    CERN Document Server

    Tong, Xingcun Colin

    2011-01-01

    The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility

  9. 77 FR 20695 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2012-04-05

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application Packages are available electronically from the IRS on May 1, 2012 by visiting: IRS.gov (key [[Page 20696

  10. Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

    NARCIS (Netherlands)

    Tian, J.

    2013-01-01

    The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

  11. NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

    Science.gov (United States)

    Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

    2018-01-01

    NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

  12. Application of active packaging systems in probiotic foods

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2013-09-01

    Full Text Available Background: The packaging of the product has an important role in the protection of the stability of the final product. The use of active packaging system is due to play an increasingly important role by offering numerous and innovative solutions for extending the shelf-life or improve food quality and safety. Methods: On the basis of broad review of the current state of the art in world literature, application of packaging systems in probiotics foods was discussed. Results: In this study presented research and development in packaging systems for probiotics foods, using suitable materials with combine passive with active packaging solutions. Conclusion: Active packages with incorporated oxygen barrier materials or films with selective permeability properties also have potential applications in the packaging of probiotic food products. This is a broad field of research for scientists and industry.

  13. 78 FR 17777 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2013-03-22

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application Packages are available electronically from the IRS on May 1, 2013 by visiting: IRS.gov (key word search--``TCE'') or through Grants.gov . The deadline...

  14. Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

    Science.gov (United States)

    Kolacz, John S.; Clapper, Randy S.; Wade, Raymond P.

    2006-01-01

    The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

  15. Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

    Science.gov (United States)

    Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

    2012-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

  16. MINUIT package parallelization and applications using the RooFit package

    International Nuclear Information System (INIS)

    Lazzaro, Alfio; Moneta, Lorenzo

    2010-01-01

    The fitting procedures are based on numerical minimization of functions. The MINUIT package is the most common package used for such procedures in High Energy Physics community. The main algorithm in this package, MIGRAD, searches the minimum of a function using the gradient information. For each minimization iteration, MIGRAD requires the calculation of the derivative for each free parameter of the function to be minimized. Minimization is required for data analysis problems based on the maximum likelihood technique. The calculation of complex likelihood functions, with several free parameters, many independent variables and large data samples, can be very CPU-time consuming. Then, the minimization process requires the calculation of the likelihood functions several times for each minimization iteration. In this paper we will show how MIGRAD algorithm and the likelihood function calculation can be easily parallelized using Message Passing Interface techniques. We will present the speed-up improvements obtained in typical physics applications such as complex maximum likelihood fits using the RooFit package.

  17. Quantum lattice model solver package HΦ. Applications to thermal and spin excitations in proximity of spin liquids

    International Nuclear Information System (INIS)

    Yamaji, Youhei; Misawa, Takahiro; Yoshimi, Kazuyoshi; Kawamura, Mitsuaki; Kawashima, Naoki; Todo, Synge

    2017-01-01

    HΦ is a program package based on the Lanczos-type method applicable to a broad range of quantum lattice models. HΦ has a flexible and simple-to-use interface, and runs efficiently on massively parallel computers. Unlike most existing packages, HΦ supports finite-temperature calculations. In this article, we apply HΦ to typical strongly correlated electron systems in proximity to quantum spin liquids. (author)

  18. Industrial applications or electron beams

    International Nuclear Information System (INIS)

    Martin, J. I.

    2001-01-01

    Industrial use of electron beams began in the 1950's with the crosslinking of polyethylene film and wire insulation. Today the number of electron beam Processing Systems installed for industrial applications throughout the world has grown to more than six hundred stations in over 35 countries. Total installed power is now approaching 40 megawatts (over 8 million tons of products per year). Electron beam is now utilized by many major industries including plastics, automotive, rubber goods, wire and cable, electrical insulation, semiconductor, medical, packaging, or pollution control. The principal effect of high-energy electrons is to produce ions in the materials treated, resulting in the liberation of orbital electrons. As a result, the original molecule is modified and the ree radicals combine to form new molecules with new chemical reactions or dis organisation od the DNA chains of living organisms (insects, fungus, microorganisms, etc.). (Author) 8 refs

  19. Smart packaging systems for food applications: a review.

    Science.gov (United States)

    Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

    2015-10-01

    Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

  20. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

  1. APPLICATION OF NANOTECHNOLOGY IN FOOD PACKAGING

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2014-04-01

    Full Text Available Nanotechnology involves the design, production and use of structures through control of the size and shape of the materials at the nanometre scale. Also, nanomaterials have been already applied in many fields of human life. Nanocomposites have already led to several innovations with potential applications in the food packaging sector. The use of nanocomposite formulations is expected to considerably enhance the shelf-life of many types of food. This improvement can lead to lower weight packages because less material is needed to obtain the same or even better barrier properties. This, in turn, can lead to reduced package cost with less packaging waste. Antimicrobial packaging is another area with high potential for applying nanocomposite technology. Nanostructured antimicrobials have a higher surface area-to-volume ratio when compared with their higher scale counterparts. Therefore, antimicrobial nanocomposite packaging systems are supposed to be particularly efficient in their activities against microbial cells. In this review, definition of nanomaterials is presented. Besides, the paper shows examples of nanocomposities and antimicrobial nanopackaging mainly with the use of nanosilver. Moreover, nanoparticles such ZnO, TiO2, MgO and nanosensors in packaging were presented.

  2. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  3. Decal electronics for printed high performance cmos electronic systems

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-11-23

    High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

  4. Emerging Chitosan-Based Films for Food Packaging Applications.

    Science.gov (United States)

    Wang, Hongxia; Qian, Jun; Ding, Fuyuan

    2018-01-17

    Recent years have witnessed great developments in biobased polymer packaging films for the serious environmental problems caused by the petroleum-based nonbiodegradable packaging materials. Chitosan is one of the most abundant biopolymers after cellulose. Chitosan-based materials have been widely applied in various fields for their biological and physical properties of biocompatibility, biodegradability, antimicrobial ability, and easy film forming ability. Different chitosan-based films have been fabricated and applied in the field of food packaging. Most of the review papers related to chitosan-based films are focusing on antibacterial food packaging films. Along with the advances in the nanotechnology and polymer science, numerous strategies, for instance direct casting, coating, dipping, layer-by-layer assembly, and extrusion, have been employed to prepare chitosan-based films with multiple functionalities. The emerging food packaging applications of chitosan-based films as antibacterial films, barrier films, and sensing films have achieved great developments. This article comprehensively reviews recent advances in the preparation and application of engineered chitosan-based films in food packaging fields.

  5. 7 CFR 1944.72 - Application packaging orientation and training.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 13 2010-01-01 2009-01-01 true Application packaging orientation and training. 1944... SERVICE, RURAL BUSINESS-COOPERATIVE SERVICE, RURAL UTILITIES SERVICE, AND FARM SERVICE AGENCY, DEPARTMENT... Grants § 1944.72 Application packaging orientation and training. Agency approval officials will orient...

  6. Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

    Science.gov (United States)

    Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

    2012-01-01

    Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

  7. Antimicrobial nanomaterials for food packaging applications

    Directory of Open Access Journals (Sweden)

    Radusin Tanja I.

    2016-01-01

    Full Text Available Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to these challenges, with different solutions-from improvements in materials properties to active packaging solutions, or both at the same time. Incorporation of nanoparticles into polymer matrix and preparation of hybrid materials is one of the methods of modification of polymer properties. Nano scaled materials with antimicrobial properties can act as active components when added into polymer, thereby leading to prolonged protective function of pristine food packaging material. This paper presents a review in the field of antimicrobial nanomaterials for food packaging in turn of technology, application and regulatory issues.

  8. Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

    Energy Technology Data Exchange (ETDEWEB)

    Kuper, Cameron Mathias [Univ. of New Mexico, Albuquerque, NM (United States)

    2015-12-10

    The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

  9. Polysaccharide-Based Membranes in Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Ana R. V. Ferreira

    2016-04-01

    Full Text Available Plastic packaging is essential nowadays. However, the huge environmental problem caused by landfill disposal of non-biodegradable polymers in the end of life has to be minimized and preferentially eliminated. The solution may rely on the use of biopolymers, in particular polysaccharides. These macromolecules with film-forming properties are able to produce attracting biodegradable materials, possibly applicable in food packaging. Despite all advantages of using polysaccharides obtained from different sources, some drawbacks, mostly related to their low resistance to water, mechanical performance and price, have hindered their wider use and commercialization. Nevertheless, with increasing attention and research on this field, it has been possible to trace some strategies to overcome the problems and recognize solutions. This review summarizes some of the most used polysaccharides in food packaging applications.

  10. Polysaccharide-Based Membranes in Food Packaging Applications

    Science.gov (United States)

    Ferreira, Ana R. V.; Alves, Vítor D.; Coelhoso, Isabel M.

    2016-01-01

    Plastic packaging is essential nowadays. However, the huge environmental problem caused by landfill disposal of non-biodegradable polymers in the end of life has to be minimized and preferentially eliminated. The solution may rely on the use of biopolymers, in particular polysaccharides. These macromolecules with film-forming properties are able to produce attracting biodegradable materials, possibly applicable in food packaging. Despite all advantages of using polysaccharides obtained from different sources, some drawbacks, mostly related to their low resistance to water, mechanical performance and price, have hindered their wider use and commercialization. Nevertheless, with increasing attention and research on this field, it has been possible to trace some strategies to overcome the problems and recognize solutions. This review summarizes some of the most used polysaccharides in food packaging applications. PMID:27089372

  11. Applications of electron accelerator in Malaysia

    Energy Technology Data Exchange (ETDEWEB)

    Khairul Zaman Hj. Mohd Dahlan [Malaysian Institute for Nuclear Technology Research (MINT), Bangi, Selangor Darul Ehsan (Malaysia)

    2003-02-01

    Current status of radiation processing, as one of the core research programs of the Malaysian Institute for Nuclear Technology Research (MINT), is presented. Industrial applications of six electron accelerators from 150 kV up to 3 MV in Malaysia now in operation are mainly for curing of surface coatings, crosslinking of tubes, heat shrinkable tubes and packaging films, crosslinking of wire insulation. Their performances are listed. New technology now in R and D stage includes natural rubber, sago starch and chitosan for biomedical applications, and radiation curable materials from oil palm for pressure sensitive adhesive and printing ink. (S. Ohno)

  12. Applications of electron accelerator in Malaysia

    International Nuclear Information System (INIS)

    Khairul Zaman Hj. Mohd Dahlan

    2003-01-01

    Current status of radiation processing, as one of the core research programs of the Malaysian Institute for Nuclear Technology Research (MINT), is presented. Industrial applications of six electron accelerators from 150 kV up to 3 MV in Malaysia now in operation are mainly for curing of surface coatings, crosslinking of tubes, heat shrinkable tubes and packaging films, crosslinking of wire insulation. Their performances are listed. New technology now in R and D stage includes natural rubber, sago starch and chitosan for biomedical applications, and radiation curable materials from oil palm for pressure sensitive adhesive and printing ink. (S. Ohno)

  13. Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

  14. A computer code package for Monte Carlo photon-electron transport simulation Comparisons with experimental benchmarks

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    2000-01-01

    A computer code package (PTSIM) for particle transport Monte Carlo simulation was developed using object oriented techniques of design and programming. A flexible system for simulation of coupled photon, electron transport, facilitating development of efficient simulation applications, was obtained. For photons: Compton and photo-electric effects, pair production and Rayleigh interactions are simulated, while for electrons, a class II condensed history scheme was considered, in which catastrophic interactions (Moeller electron-electron interaction, bremsstrahlung, etc.) are treated in detail and all other interactions with reduced individual effect on electron history are grouped together using continuous slowing down approximation and energy straggling theories. Electron angular straggling is simulated using Moliere theory or a mixed model in which scatters at large angles are treated as distinct events. Comparisons with experimentally benchmarks for electron transmission and bremsstrahlung emissions energy and angular spectra, and for dose calculations are presented

  15. Broadband Packaging of Photodetectors for 100 Gb/s Ethernet Applications

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Krozer, Viktor; Bach, Heinz-Gunter

    2013-01-01

    The packing structure of functional modules is a major limitaion in achieving a desired performance for 100 Gb/s ethernet applications. This paper presents a methodology of developing advanced packaging of photodetectors (PDs) for high-speed data transmission applications by using 3-D electromagn......The packing structure of functional modules is a major limitaion in achieving a desired performance for 100 Gb/s ethernet applications. This paper presents a methodology of developing advanced packaging of photodetectors (PDs) for high-speed data transmission applications by using 3-D...... electromagnetic (EM) simulations. A simplified model of the PD module is first used to analyze and optimize packaging structures and propose an optimal packaging design based on the simplified model. Although a PD module with improved performance proved the success of the optimal packaging design, the simplified...... of limiting the bandwidth of PD modules. After eliminating the mode mismatch effect by improving the chip-conductor-backed coplanar waveguide transition, a final optimal packaging structure is implemented for the PD module with reduced attenuation up to 100 GHz and a broader 3-dB bandwidth of more than 90 GHz...

  16. Application of Green Environmentally Friendly Materials in Food Packaging

    OpenAIRE

    Jixia Li

    2017-01-01

    With social development, requirements on the spiritual and material life have increased. However, some environmental issues appear, for example, in food packaging. Application of environment-friendly materials in food packaging has been more and more attractive. This study analyses the characteristics of degradable food packaging material and the existing problems, proposes the manufacturing of food packaging with poly(lactic acid)/nanocrystalline cellulose composite material, tests its therm...

  17. Non-destructive testing of electronic component packages

    International Nuclear Information System (INIS)

    Anderle, C.

    1975-01-01

    A non-destructive method of investigating packaged parts of semiconductor components by X radiation is described and the relevant theoretical relations limiting this technique are derived. The application of the technique is demonstrated in testing several components. The described method is iNsimple and quick. (author)

  18. Strategic Business-IT alignment of application software packages: Bridging the Information Technology gap

    Directory of Open Access Journals (Sweden)

    Wandi Kruger

    2012-09-01

    Full Text Available An application software package implementation is a complex endeavour, and as such it requires the proper understanding, evaluation and redefining of the current business processes to ensure that the implementation delivers on the objectives set at the start of the project. Numerous factors exist that may contribute to the unsuccessful implementation of application software packages. However, the most significant contributor to the failure of an application software package implementation lies in the misalignment of the organisation’s business processes with the functionality of the application software package. Misalignment is attributed to a gap that exists between the business processes of an organisation and what functionality the application software package has to offer to translate the business processes of an organisation into digital form when implementing and configuring an application software package. This gap is commonly referred to as the information technology (IT gap. This study proposes to define and discuss the IT gap. Furthermore this study will make recommendations for aligning the business processes with the functionality of the application software package (addressing the IT gap. The end result of adopting these recommendations will be more successful application software package implementations.

  19. A computer code package for electron transport Monte Carlo simulation

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    1999-01-01

    A computer code package was developed for solving various electron transport problems by Monte Carlo simulation. It is based on condensed history Monte Carlo algorithm. In order to get reliable results over wide ranges of electron energies and target atomic numbers, specific techniques of electron transport were implemented such as: Moliere multiscatter angular distributions, Blunck-Leisegang multiscatter energy distribution, sampling of electron-electron and Bremsstrahlung individual interactions. Path-length and lateral displacement corrections algorithms and the module for computing collision, radiative and total restricted stopping powers and ranges of electrons are also included. Comparisons of simulation results with experimental measurements are finally presented. (author)

  20. Sustainable packaging design for consumer electronics products: Balancing marketing, logistics and environmental requirements

    OpenAIRE

    Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

    2007-01-01

    Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of sophistication of data concerning a packagings marketing performance is limited, decisions are often strongly based on beliefs. This is reflected in inconsistencies in packaging that is currently in...

  1. A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages

    International Nuclear Information System (INIS)

    Kay, N.R.; Ghosh, S.; Guven, I.; Madenci, E.

    2006-01-01

    This study concerns the development of a combined experimental and analytical technique to determine the critical values of fracture parameters for interfaces between dissimilar materials in electronic packages. This technique utilizes specimens from post-production electronic packages. The mechanical testing is performed inside a scanning electron microscope while the measurements are achieved by means of digital image correlation. The measured displacements around the crack tip are used as the boundary conditions for the analytical model to compute the energy release rate. The critical energy release rate values obtained from post-production package specimens are obtained to be lower than those laboratory specimens

  2. Application package DeCA. Version 3.3

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

    1993-01-01

    The application package DeCA (Design of Cyclic Accelerators) is intended for solving a wide range of problems related to the dynamics of charged particle beams in cyclic accelerators and storage rings. It can be used for both design or modification purposes and numerical experimentation. The package DeCA consist of several program blocks, which are unified by functional principle. In this article we are consider the description of two blocks: the control block (COMM), and the description of magnetic elements and lattices block (IMOS). The formats of package commands, language of lattice definition and list of own commands of these blocks are described. (author). 4 refs., 3 ape

  3. The innovative application studty on eco-packaging design and materials

    Directory of Open Access Journals (Sweden)

    Cui Yong Min

    2016-01-01

    Full Text Available The paper solves the increasingly deteriorate environmental problems by positively exploring how to utilize and develop eco-packaging design reasonably. The paper explores an effective method that combines eco-packaging and environmental protection materials, hoping to define the sustainable development road of packaging design. The paper is centered on the design application of eco-packaging and environmental protection materials, applies and analyzes the method to obtain innovative design requirements and development tendency of eco-packaging design by analyzing status and significance of eco-packaging design, combining with the development and main types of eco-packaging packaging materials, and based on the achievements acquired by eco-packaging and environmental protection materials. Meanwhile, the paper also reveals mutual dependence and mutual promotion of eco-packaging design and eco-packaging materials.

  4. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  5. Thermal expansion model for multiphase electronic packaging materials

    International Nuclear Information System (INIS)

    Allred, B.E.; Warren, W.E.

    1991-01-01

    Control of thermal expansion is often necessary in the design and selection of electronic packages. In some instances, it is desirable to have a coefficient of thermal expansion intermediate between values readily attainable with single or two phase materials. The addition of a third phase in the form of fillers, whiskers, or fibers can be used to attain intermediate expansions. To help design the thermal expansion of multiphase materials for specific applications, a closed form model has been developed that accurately predicts the effective elastic properties of isotropic filled materials and transversely isotropic lamina. Properties of filled matrix materials are used as inputs to the lamina model to obtain the composite elastic properties as a function of the volume fraction of each phase. Hybrid composites with two or more fiber types are easily handled with this model. This paper reports that results for glass, quartz, and Kevlar fibers with beta-eucryptite filled polymer matrices show good agreement with experimental results for X, Y, and Z thermal expansion coefficients

  6. The innovative application studty on eco-packaging design and materials

    OpenAIRE

    Cui Yong Min; Ren Xin Guang

    2016-01-01

    The paper solves the increasingly deteriorate environmental problems by positively exploring how to utilize and develop eco-packaging design reasonably. The paper explores an effective method that combines eco-packaging and environmental protection materials, hoping to define the sustainable development road of packaging design. The paper is centered on the design application of eco-packaging and environmental protection materials, applies and analyzes the method to obtain innovative design r...

  7. Comparison of PV system design software packages for urban applications

    Energy Technology Data Exchange (ETDEWEB)

    Gharakhani Siraki, Arbi; Pillay, Pragasen

    2010-09-15

    A large number of software packages are available for solar resource evaluation and PV system design. However, few of them are suitable for urban applications. In this paper a comparison has been made between two specifically designed solar tools known as the Ecotect 2010 and the PVsyst 5.05. Conclusions have been made for proper use of these packages based on their specifications and privileges. Moreover, the calculations have been repeated with HOMER software package (which is a generic tool) for the same location. The results suggest that a generic solar software tool should not be used for an urban application.

  8. Inkjet printing of UHF antennas on corrugated cardboards for packaging applications

    Energy Technology Data Exchange (ETDEWEB)

    Sowade, Enrico, E-mail: enrico.sowade@mb.tu-chemnitz.de [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Göthel, Frank [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Zichner, Ralf [Department Printed Functionalities, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz (Germany); Baumann, Reinhard R. [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Department Printed Functionalities, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz (Germany)

    2015-03-30

    Highlights: • Inkjet printing of UHF antennas on cardboard substrates. • Development of primer layer to compensate the absorptiveness of the cardboard and the rough surface. • Manufacturing of UHF antennas in a fully digital manner for packaging applications. - Abstract: In this study, a method based on inkjet printing has been established to develop UHF antennas on a corrugated cardboard for packaging applications. The use of such a standardized, paper-based packaging substrate as material for printing electronics is challenging in terms of its high surface roughness and high ink absorption rate, especially when depositing very thin films with inkjet printing technology. However, we could obtain well-defined silver layers on the cardboard substrates due to a primer layer approach. The primer layer is based on a UV-curable ink formulation and deposited as well as the silver ink with inkjet printing technology. Industrial relevant printheads were chosen for the deposition of the materials. The usage of inkjet printing allows highest flexibility in terms of pattern design. The primer layer was proven to optimize the surface characteristics of the substrate, mainly reducing the surface roughness and water absorptiveness. Thanks to the primer layer approach, ultra-high-frequency (UHF) radio-frequency identification (RFID) antennas were deposited by inkjet printing on the corrugated cardboards. Along with the characterization and interpretation of electrical properties of the established conductive antenna patterns, the performance of the printed antennas were analyzed in detail by measuring the scattering parameter S{sub 11} and the antenna gain.

  9. The Ettention software package

    International Nuclear Information System (INIS)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-01-01

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  10. The Ettention software package

    Energy Technology Data Exchange (ETDEWEB)

    Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

    2016-02-15

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  11. Miniature sensor suitable for electronic nose applications

    DEFF Research Database (Denmark)

    Pinnaduwage, L. A.; Gehl, A. C.; Allman, S. L.

    2007-01-01

    A major research effort has been devoted over the years for the development of chemical sensors for the detection of chemical and explosive vapors. However, the deployment of such chemical sensors will require the use of multiple sensors probably tens of sensors in a sensor package to achieve sel...... microcantilevers. The sensor can detect parts-per-trillion concentrations of DMMP within 10 s exposure times. The small size of the sensor makes it ideally suited for electronic nose applications. © 2007 American Institute of Physics....

  12. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    Science.gov (United States)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  13. TREK1-a program package of modeling of the ion implantation of materials used in electronic techniques

    International Nuclear Information System (INIS)

    Leont'ev, A.V.; Nechaev, S.V.

    1999-01-01

    A package of computer programs is described which treats the slowing down of ions in solids by the means of Monte-Carlo method in the binary collision approximation for an amorphous substance using a screened Coulomb potential for nuclear collisions and the Brandt-Kitagawa theory for the electronic energy loss. For each nuclear collision, the impact parameter and the azimuthal deflection angle are determined from random numbers. The package contains a program of calculation of ion implantation whose features are described above, a database 'MME' (Materials of Micro Electronics) which stores all necessary data for the calculation, and a database control application providing an easy access to the data in MME. The programs of the package are made to run under Windows 95/98 and Windows NT operating systems. They were created using the following means: Borland Delphi 3.0, Paradox 7.0, Borland Database Engine 4.5. The running time of the calculation process depends on the problem chosen and is mainly influenced by the number of pseudo ions, their energy and atomic properties of the target. For the test example of 100 keV boron atoms incident PMMA, a calculation with 1*10 4 pseudo ions on a computer with the Pentium-166 processor requires about 2 min compared to 7 min by well known Trim95

  14. Application of common packaging materials in the probiotic fresh cheese production

    Directory of Open Access Journals (Sweden)

    Mirela Iličić

    2016-03-01

    Full Text Available The aim of this work was to investigate the application of common packaging materials polypropylene (PP and polystyrene (PS in the probiotic fresh cheese production packaging. Probiotic and traditional cheeses were produced from milk with standardized milk fat content of 2.3 g/100 g including the application of two cultures (probiotic and traditional. The samples were packed in the PP and PS cups and stored at 4 ºC for 30 days. The observed permeability of gases through the two applied packaging materials was significantly different. Cheese samples were analysed for microbiological properties whereby lactic acid bacteria, Bifidobacterium sp. and aerobic mesophilic bacteria (AMB were determined. Packaging materials showed no significant effect on the content of ascorbic acid which is known to be sensitive to the presence of oxygen.

  15. Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules

    OpenAIRE

    Lostetter, Alexander B.

    1998-01-01

    High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and thus ultimately reduce the cost of the power electronic circuits. The problem with this strategy in conventional packaging, however, is that at high frequencies, interconnects between the power devic...

  16. CONSUL code package application for LMFR core calculations

    Energy Technology Data Exchange (ETDEWEB)

    Chibinyaev, A.V.; Teplov, P.S.; Frolova, M.V. [RNC ' Kurchatovskiy institute' , Kurchatov sq.1, Moscow (Russian Federation)

    2008-07-01

    CONSUL code package designed for the calculation of reactor core characteristics has been developed at the beginning of 90's. The calculation of nuclear reactor core characteristics is carried out on the basis of correlated neutron, isotope and temperature distributions. The code package has been generally used for LWR core characteristics calculations. At present CONSUL code package was adapted to calculate liquid metal fast reactors (LMFR). The comparisons with IAEA computational test 'Evaluation of benchmark calculations on a fast power reactor core with near zero sodium void effect' and BN-1800 testing calculations are presented in the paper. The IAEA benchmark core is based on the innovative core concept with sodium plenum above the core BN-800. BN-1800 core is the next development step which is foreseen for the Russian fast reactor concept. The comparison of the operational parameters has shown good agreement and confirms the possibility of CONSUL code package application for LMFR core calculation. (authors)

  17. Physical packaging and organization of the drift chamber electronics system for the Stanford Large Detector

    International Nuclear Information System (INIS)

    Haller, G.M.; Freytag, M.L.; Mazaheri, G.; Olsen, J.; Paffrath, L.

    1990-10-01

    In this paper the logical organization, physical packaging, and operation of the drift chamber electronics for the SLD at SLAC is described. The system processes signals from approximately 7000 drift wires and is unusual in that most electronic functions are packaged on printed circuit boards within the detector. The circuits reside on signal-processing motherboards, controller boards, signal-transition boards, power-distribution boards, and fiber-optics-to-electrical conversion boards. The interaction and interconnection of these boards with respect to signal and control flow are presented. 11 refs., 7 figs

  18. Halloysite Nanocapsules Containing Thyme Essential Oil: Preparation, Characterization, and Application in Packaging Materials.

    Science.gov (United States)

    Jang, Si-Hoon; Jang, So-Ri; Lee, Gyeong-Min; Ryu, Jee-Hoon; Park, Su-Il; Park, No-Hyung

    2017-09-01

    Halloysite nanotubes (HNTs), which are natural nanomaterials, have a hollow tubular structure with about 15 nm inner and 50 nm outer diameters. Because of their tubular shape, HNTs loaded with various materials have been investigated as functional nanocapsules. In this study, thyme essential oil (TO) was encapsulated successfully in HNTs using vacuum pulling methods, followed by end-capping or a layer-by-layer surface coating process for complete encapsulation. Nanocapsules loaded with TO were mixed with flexographic ink and coated on a paper for applications as food packaging materials. Scanning electron microscopy and transmission electron microscopy were used to characterize the morphology of the nanocapsules and to confirm the TO loading of the nanocapsules. Fourier transform infrared spectroscopy and thermogravimetric analyses analysis were used to complement the structural information. In addition, the controlled release of TO from the nanocapsules showed sustained release properties over a period of many days. The results reveal that the release properties of TO in these nanocapsules could be controlled by surface modifications such as end-capping and/or surface coating of bare nanocapsules. The packaging paper with TO-loaded HNT capsules was effective in eliminating against Escherichia coli during the first 5 d and showed strong antibacterial activity for about 10 d. © 2017 Institute of Food Technologists®.

  19. Advanced Image Processing Package for FPGA-Based Re-Programmable Miniature Electronics

    National Research Council Canada - National Science Library

    Ovod, Vladimir I; Baxter, Christopher R; Massie, Mark A; McCarley, Paul L

    2005-01-01

    .... An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical background...

  20. Nanocomposites in food packaging applications and their risk assessment for health

    Science.gov (United States)

    Honarvar, Zohreh; Hadian, Zahra; Mashayekh, Morteza

    2016-01-01

    Nanotechnology has shown many advantages in different fields. As the uses of nanotechnology have progressed, it has been found to be a promising technology for the food packaging industry in the global market. It has proven capabilities that are valuable in packaging foods, including improved barriers; mechanical, thermal, and biodegradable properties; and applications in active and intelligent food packaging. Examples of the latter are anti-microbial agents and nanosensors, respectively. However, the use of nanocomposites in food packaging might be challenging due to the reduced particle size of nanomaterials and the fact that the chemical and physical characteristics of such tiny materials may be quite different from those of their macro-scale counterparts. In order to discuss the potential risks of nanoparticles for consumers, in addition to the quantification of data, a thorough investigation of their characteristics is required. Migration studies must be conducted to determine the amounts of nanomaterials released into the food matrices. In this article, different applications of nanocomposites in food packaging, migration issues, analyzing techniques, and the main concerns about their usage are discussed briefly. PMID:27504168

  1. Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Krozer, Viktor; Bach, H.-G.

    2009-01-01

    In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode...... conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates...

  2. 7 CFR Exhibit D to Subpart B of... - Designated Counties for Housing Application Packaging Grants

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 13 2010-01-01 2009-01-01 true Designated Counties for Housing Application Packaging... Application Packaging Grants Pt. 1944, Subpt. B, Exh. D Exhibit D to Subpart B of Part 1944—Designated Counties for Housing Application Packaging Grants ER25my05.036 ER25my05.037 ER25my05.038 ER25my05.039 [70...

  3. Industrial applications of electron beam accelerators

    International Nuclear Information System (INIS)

    Braid, W.G. Jr.

    1976-01-01

    The use of electron beam accelerators for crosslinking polyolefins for shrinking food packaging is discussed. Irradiation procedures, accelerator characteristics, and industrial operations are described

  4. Sterilized PP/HMSPP cushion foams for medical and food packaging applications

    International Nuclear Information System (INIS)

    Cardoso, Elisabeth C.L.; Lima, L. Filipe C.P.; Parra, Duclerc F.; Lugao, Ademar B.; Bueno, N.R.; Gasparin, Eleosmar

    2009-01-01

    Treatment with gamma radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in aseptic processing of foods and pharmaceuticals. Packaging materials may be irradiated either prior or after filling; the irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceuticals and medical devices. Cushion foams are used to help protect fragile items during moving transport. Shock, vibration and damage are avoided by the cushioning effect and chances of product damage are reduced. It is easy to use and perforated for easy tearing. Cushion foams are employed to wrap glasses, plates, crockery, lamps, electronics and other breakable items. This paper presents special cushion foams to be used for medical and food packaging applications; so, these foams will be gamma irradiated before getting in contact with these special articles. Foams were previously produced from a 50% blending Polypropylene homopolymer / High Melt Strength Polypropylene (HMSPP) thereof, that presented following results for properties assessed: melt flow index, 230 deg C - 3.67 g/10 minutes; crystallinity = 47%; melt strength, at 200 deg C = 7.3 cN. This admixture was further fed into the barrel of a single-screw extruder, Rheomex 332 p, equipped with 3:1,33 d screw and 19/33 special screw for foaming, with standard controller and monitored panel, temperature controller (2 channels), melt temperature (2 channels) and melt pressure (4 channels). By using a 175/200/210/220/165/25 (deg C) profile temperature, and after attaining a homogeneous melting, a given amount of physical blowing agent (nitrogen) was injected and mixed with the polymer melt stream to produce the foam. Foamed extrudate was subjected to sterilization radiation doses: 25, 50, 75 and 100 kGy and further evaluated as per: appearance (whiteness / yellowness) and temperature dependent oxidative-induction time (TOIT) tests, by comparing

  5. The commoditization of consumer electronics products and its influence on packaging design

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    The traditional purpose of packaging for consumer electronics (CE) products was to get them in one piece from the factory to the consumers home. It was purely focused on the physical distribution. In that time, buying a CE product could be considered a major family investment. However, times have

  6. MEMS packaging: state of the art and future trends

    Science.gov (United States)

    Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

    1998-07-01

    Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

  7. The Ettention software package.

    Science.gov (United States)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

  8. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    Science.gov (United States)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  9. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Siyu Cai

    2016-12-01

    Full Text Available In this work, a novel processing method called powder thixoforming was proposed to prepare composites reinforced with 50 vol % of SiC particles (SiCp that were used for electronic packaging in order to investigate the effects of remelting duration on its microstructure and properties. Optical Microscope (OM, Scanning Electron Microscope (SEM, X-ray Diffraction (XRD and Transmission Electron Microscope (TEM methods were applied for the material characterization and the corresponding physical and mechanical properties were examined in detail. The obtained results indicate that the remelting duration exerted a large effect on the microstructure as well as the SiCp/Al interfacial reaction. The density and hardness of the composite continuously increased with increasing remelting duration. The thermal conductivity (TC and bending strength (BS first increased during the initial 90 min and then decreased. The remelting duration exerted a limited influence on the coefficient of thermal expansion (CTE. The optimal TC, BS, and hardness of these composites were up to 135.79 W/(m·K, 348.53 MPa, and 105.23 HV, respectively, and the CTE was less than 6.5 ppm/K after the composites were remelted at 600 °C for 90 min. The properties of the composites could thus be controlled to conform to the application requirements for electronic packaging materials.

  10. Laser applications in the electronics and optoelectronics industry in Japan

    Science.gov (United States)

    Washio, Kunihiko

    1999-07-01

    This paper explains current status and technological trends in laser materials processing applications in electronics and optoelectronics industry in Japan. Various laser equipment based on solid state lasers or gas lasers such as excimer lasers or CO2 lasers has been developed and applied in manufacturing electronic and optoelectronic devices to meet the strong demands for advanced device manufacturing technologies for high-performance, lightweight, low power-consumption portable digital electronic appliances, cellular mobile phones, personal computers, etc. Representative applications of solid-state lasers are, opaque and clear defects repairing of photomasks for LSIs and LCDs, trimming of thick-film chip resistors and low resistance metal resistors, laser cutting and drilling of thin films for high-pin count semiconductor CSP packages, laser patterning of thin-film amorphous silicon solar cells, and laser welding of electronic components such as hard-disk head suspensions, optical modules, miniature relays and lithium ion batteries. Compact and highly efficient diode- pumped and Q-switched solid-state lasers in second or third harmonic operation mode are now being increasingly incorporated in various laser equipment for fine material processing. Representative applications of excimer lasers are, sub-quarter micron design-rule LSI lithography and low- temperature annealing of poly-silicon TFT LCD.

  11. Preparation of conductive paper composites based on natural cellulosic fibers for packaging applications.

    Science.gov (United States)

    Youssef, Ahmed M; El-Samahy, Magda Ali; Abdel Rehim, Mona H

    2012-08-01

    Conducting paper based on natural cellulosic fibers and conductive polymers was prepared using unbleached bagasse and/or rice straw fibers (as cellulosic raw materials) and polyaniline (PANi) as conducting polymer. These composites were synthesized by in situ emulsion polymerization using ammonium persulfate (APS) as oxidant in the presence of dodecylbenzene sulfonic acid (DBSA) as emulsifier. The prepared composites were characterized using Fourier transform infrared (FTIR), thermal gravimetric analysis (TGA), differential scanning calorimeter (DSC), and their morphology was investigated using scanning electron microscope (SEM). Electrical conductivity measurements showed that the conductivity of the paper sheets increases by increasing the ratio of PANi in the composite. Mechanical properties of the paper sheets were also investigated, the results revealed that the values of breaking length, burst factor, and tear factor are decreased with increasing ratio of added PANi, and this effect is more pronounced in bagasse-based composites. The new conductive composites can have potential use as anti-static packaging material or anti-bacterial paper for packaging applications. Copyright © 2012 Elsevier Ltd. All rights reserved.

  12. Sustainable packaging design for consumer electronics products : Balancing marketing, logistics and environmental requirements

    NARCIS (Netherlands)

    Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

    2007-01-01

    Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of

  13. penORNL: a parallel Monte Carlo photon and electron transport package using PENELOPE

    International Nuclear Information System (INIS)

    Bekar, Kursat B.; Miller, Thomas Martin; Patton, Bruce W.; Weber, Charles F.

    2015-01-01

    The parallel Monte Carlo photon and electron transport code package penORNL was developed at Oak Ridge National Laboratory to enable advanced scanning electron microscope (SEM) simulations on high-performance computing systems. This paper discusses the implementations, capabilities and parallel performance of the new code package. penORNL uses PENELOPE for its physics calculations and provides all available PENELOPE features to the users, as well as some new features including source definitions specifically developed for SEM simulations, a pulse-height tally capability for detailed simulations of gamma and x-ray detectors, and a modified interaction forcing mechanism to enable accurate energy deposition calculations. The parallel performance of penORNL was extensively tested with several model problems, and very good linear parallel scaling was observed with up to 512 processors. penORNL, along with its new features, will be available for SEM simulations upon completion of the new pulse-height tally implementation.

  14. An Assessment of the Library Application Software Packages in ...

    African Journals Online (AJOL)

    Journal Home > Vol 7, No 2 (2007) > ... the study examined the adopted softwares' security, compatibility/capabilities, ... The study found that most application packages available in the Nigerian automation market place are effective since they ...

  15. 3D packaging of a microfluidic system with sensory applications

    Science.gov (United States)

    Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

    1997-09-01

    Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

  16. Biosynthesis and Characterization of AgNPs-Silk/PVA Film for Potential Packaging Application.

    Science.gov (United States)

    Tao, Gang; Cai, Rui; Wang, Yejing; Song, Kai; Guo, Pengchao; Zhao, Ping; Zuo, Hua; He, Huawei

    2017-06-17

    Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP) is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag⁺ by the tyrosine residue of fibroin, and then prepared AgNPs-silk/poly(vinyl alcohol) (PVA) composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs-silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs-silk/PVA film offers more choices to be potentially applied in the active packaging field.

  17. Biosynthesis and Characterization of AgNPs–Silk/PVA Film for Potential Packaging Application

    Directory of Open Access Journals (Sweden)

    Gang Tao

    2017-06-01

    Full Text Available Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag+ by the tyrosine residue of fibroin, and then prepared AgNPs–silk/poly(vinyl alcohol (PVA composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs–silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs–silk/PVA film offers more choices to be potentially applied in the active packaging field.

  18. 75 FR 25319 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages; Correction

    Science.gov (United States)

    2010-05-07

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... the Elderly (TCE) Program Availability of Application Packages, which was published in the Federal... application packages for the 2011 Tax Counseling for the Elderly (TCE) Program. FOR FURTHER INFORMATION...

  19. Packaging printed circuit boards: A production application of interactive graphics

    Science.gov (United States)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  20. Wafer-level chip-scale packaging analog and power semiconductor applications

    CERN Document Server

    Qu, Shichun

    2015-01-01

    This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

  1. Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

    Science.gov (United States)

    Bryant, Robert G.

    2007-01-01

    Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

  2. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  3. Prospects for application of post-consumer used plastics in food packaging.

    Science.gov (United States)

    Miltz, J; Ram, A; Nir, M M

    1997-01-01

    The two most widely used polymers in packaging in recent years are polyethylene terephthalate (PET) and polyethylene (PE). The biggest fractions of these polymers are not re-utilized, in spite of the fact that they possess excellent properties even after their first application. The ban on using recycled polymers in food packaging applications and the lack of good value outlets for these materials causes them to end up in landfills. The high cost nylon, used in packaging primarily as high gas barrier laminates with PE, also finds its way to landfills. In this case, the reason is the difficulty of recycling different polymers that are incompatible. Thus, the Municipal Solid Waste (MSW) stream transferred to landfills contains many plastic packages. These packages are being blamed as a major pollutant of the environment in spite of the fact that all plastics contribute only a small percentage to the weight of the garbage in landfills. If proper and cost effective applications for the recycled polymers could be developed, the waste related to their disposal could be limited. In addition, the contribution of plastic packages to the environmental problem could be diminished. In the present paper, the possibility of sandwiching a contaminated PET layer between two layers of the virgin material was studied. The aim of the study was to determine whether such an operation could lower the migration level of contaminants from a multilayer structure (containing a recycled layer of PET) to values below the limits required by regulatory agencies. The diffusion coefficients (required to determine migration) of four organic liquids in PET were determined. As a result of the sandwiching operation, the amount of pollutant (toluene) migrating into the food simulant was reduced by two orders of magnitude. The properties of PE/nylon blends were also studied. It was found that the high gas barrier properties of nylon are preserved in the blend when proper processing conditions are used

  4. Demonstration of a Prototype Hydrogen Sensor and Electronics Package - Progress Report 2

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-06-14

    This is the second progress report on the demonstration of a prototype hydrogen sensor and electronics package. It goes into detail about the five tasks, four of which are already completed as of August 2016, with the final to be completed by January 26, 2017. Then the budget is detailed along with the planned work for May 27, 2016 to July 27, 2016.

  5. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  6. Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

    Energy Technology Data Exchange (ETDEWEB)

    Bennion, K.; Moreno, G.

    2010-04-27

    Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

  7. Packaging Concerns/Techniques for Large Devices

    Science.gov (United States)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  8. Biobased Packaging - Application in Meat Industry

    Directory of Open Access Journals (Sweden)

    S. Wilfred Ruban

    2009-04-01

    Full Text Available Because of growing problems of waste disposal and because petroleum is a nonrenewable resource with diminishing quantities, renewed interest in packaging research is underway to develop and promote the use of “bio-plastics.” In general, compared to conventional plastics derived from petroleum, bio-based polymers have more diverse stereochemistry and architecture of side chains which enable research scientists a greater number of opportunities to customize the properties of the final packaging material. The primary challenge facing the food (Meat industry in producing bio-plastic packaging, currently, is to match the durability of the packaging with product shelf-life. Notable advances in biopolymer production, consumer demand for more environmentally-friendly packaging, and technologies that allow packaging to do more than just encompass the food are driving new and novel research and developments in the area of packaging for muscle foods. [Vet. World 2009; 2(2.000: 79-82

  9. Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

    International Nuclear Information System (INIS)

    Zhang Guang-Chen; Feng Shi-Wei; Zhou Zhou; Li Jing-Wan; Guo Chun-Sheng

    2011-01-01

    The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip-level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

  10. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  11. Metal Oxide Nanostructures in Food Applications: Quality Control and Packaging

    Directory of Open Access Journals (Sweden)

    Vardan Galstyan

    2018-04-01

    Full Text Available Metal oxide materials have been applied in different fields due to their excellent functional properties. Metal oxides nanostructuration, preparation with the various morphologies, and their coupling with other structures enhance the unique properties of the materials and open new perspectives for their application in the food industry. Chemical gas sensors that are based on semiconducting metal oxide materials can detect the presence of toxins and volatile organic compounds that are produced in food products due to their spoilage and hazardous processes that may take place during the food aging and transportation. Metal oxide nanomaterials can be used in food processing, packaging, and the preservation industry as well. Moreover, the metal oxide-based nanocomposite structures can provide many advantageous features to the final food packaging material, such as antimicrobial activity, enzyme immobilization, oxygen scavenging, mechanical strength, increasing the stability and the shelf life of food, and securing the food against humidity, temperature, and other physiological factors. In this paper, we review the most recent achievements on the synthesis of metal oxide-based nanostructures and their applications in food quality monitoring and active and intelligent packaging.

  12. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Yongcun; Liu, Feng, E-mail: liufeng@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi' an Shaanxi 710072 (China)

    2016-08-22

    The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.

  13. XRAY applied program package for calculation of electron-photon fields in the energy range of 1-1000 keV

    International Nuclear Information System (INIS)

    Lappa, A.V.; Khadyeva, Z.M.; Burmistrov, D.S.; Vasil'ev, O.N.

    1990-01-01

    The package of applied XRAY programs is intended for calculating the linear and fluctuation characteristics of photon and electron radiation fields in heterogeneous medium within 1-1000 keV energy range. The XRAY program package consists of moduli written in FORTRAN-IV and data files. 9 refs

  14. Poly(hydroxyalkanoates for Food Packaging: Application and Attempts towards Implementation

    Directory of Open Access Journals (Sweden)

    M. Koller

    2014-09-01

    Full Text Available Plastics are well-established for convenient and safe packaging and distribution of food and feed goods. At present, this special sector of the plastic market displays remarkably increasing quantities of its annual production. Caused by the ongoing limitation and strongly fluctuating prices of fossil feedstocks, classically used for plastic production, there is an evident trend to switch towards so-called “bio-plastics”. Especially for bulk applications such as food packaging, a broad implementation of “bio-plastics” constitutes a future-oriented strategy to restrict the dependence of global industry on fossil feedstocks, and to diminish current problematic environmental issues arising from plastic disposal. However, food packaging demands a great deal of the utilized packaging material. This encompasses tailored mechanical properties such as low brittleness and adequate tensile strength, a sufficient barrier for oxygen, CO2, and aromatic flavors, high UV-resistance, and high water retention-capacity to block the food´s moisture content, or to prevent humidity, respectively. Due to their hydrophobic character and the broad flexibility of their mechanical features, prokaryotic poly(hydroxyalkanoates (PHAs are considered as promising materials to compete with petro-plastics on the food-packaging market. Nevertheless, short-comings in particular aspects of their material performance and economics of their biosynthesis and purification constitute stumbling blocks on the long way towards broad implementation of PHAs for food packaging. This article discusses advantages and drawbacks of PHAs as food packaging materials, and demonstrates how desired properties can be improved by the designing of novel composite materials, and also encompassing techniques by applying nanoparticles.

  15. Industrial applications or electron beams; Aplicaciones industriales de la irradiacion como servicio

    Energy Technology Data Exchange (ETDEWEB)

    Martin, J. I.

    2001-07-01

    Industrial use of electron beams began in the 1950's with the crosslinking of polyethylene film and wire insulation. Today the number of electron beam Processing Systems installed for industrial applications throughout the world has grown to more than six hundred stations in over 35 countries. Total installed power is now approaching 40 megawatts (over 8 million tons of products per year). Electron beam is now utilized by many major industries including plastics, automotive, rubber goods, wire and cable, electrical insulation, semiconductor, medical, packaging, or pollution control. The principal effect of high-energy electrons is to produce ions in the materials treated, resulting in the liberation of orbital electrons. As a result, the original molecule is modified and the ree radicals combine to form new molecules with new chemical reactions or dis organisation od the DNA chains of living organisms (insects, fungus, microorganisms, etc.). (Author) 8 refs.

  16. CEPXS/ONELD: A one-dimensional coupled electron-photon discrete ordinates code package

    International Nuclear Information System (INIS)

    Lorence, L.J. Jr.; Morel, J.E.

    1992-01-01

    CEPXS/ONELD is a discrete ordinates transport code package that can model the electron-photon cascade from 100 MeV to 1 keV. The CEPXS code generates fully-coupled multigroup-Legendre cross section data. This data is used by the general-purpose discrete ordinates code, ONELD, which is derived from the Los Alamos ONEDANT and ONBTRAN codes. Version 1.0 of CEPXS/ONELD was released in 1989 and has been primarily used to analyze the effect of radiation environments on electronics. Version 2.0 is under development and will include user-friendly features such as the automatic selection of group structure, spatial mesh structure, and S N order

  17. On the Use of PLA-PHB Blends for Sustainable Food Packaging Applications.

    Science.gov (United States)

    Arrieta, Marina Patricia; Samper, María Dolores; Aldas, Miguel; López, Juan

    2017-08-29

    Poly(lactic acid) (PLA) is the most used biopolymer for food packaging applications. Several strategies have been made to improve PLA properties for extending its applications in the packaging field. Melt blending approaches are gaining considerable interest since they are easy, cost-effective and readily available processing technologies at the industrial level. With a similar melting temperature and high crystallinity, poly(hydroxybutyrate) (PHB) represents a good candidate to blend with PLA. The ability of PHB to act as a nucleating agent for PLA improves its mechanical resistance and barrier performance. With the dual objective to improve PLAPHB processing performance and to obtain stretchable materials, plasticizers are frequently added. Current trends to enhance PLA-PHB miscibility are focused on the development of composite and nanocomposites. PLA-PHB blends are also interesting for the controlled release of active compounds in the development of active packaging systems. This review explains the most relevant processing aspects of PLA-PHB based blends such as the influence of polymers molecular weight, the PLA-PHB composition as well as the thermal stability. It also summarizes the recent developments in PLA-PHB formulations with an emphasis on their performance with interest in the sustainable food packaging field. PLA-PHB blends shows highly promising perspectives for the replacement of traditional petrochemical based polymers currently used for food packaging.

  18. Surface modification of food contact materials for processing and packaging applications

    Science.gov (United States)

    Barish, Jeffrey A.

    This body of work investigates various techniques for the surface modification of food contact materials for use in food packaging and processing applications. Nanoscale changes to the surface of polymeric food packaging materials enables changes in adhesion, wettability, printability, chemical functionality, and bioactivity, while maintaining desirable bulk properties. Polymer surface modification is used in applications such as antimicrobial or non-fouling materials, biosensors, and active packaging. Non-migratory active packagings, in which bioactive components are tethered to the package, offer the potential to reduce the need for additives in food products while maintaining safety and quality. A challenge in developing non-migratory active packaging materials is the loss of biomolecular activity that can occur when biomolecules are immobilized. Polyethylene glycol (PEG), a biocompatible polymer, is grafted from the surface of ozone treated low-density polyethylene (LDPE) resulting in a surface functionalized polyethylene to which a range of amine-terminated bioactive molecules can be immobilized. The grafting of PEG onto the surface of polymer packaging films is accomplished by free radical graft polymerization, and to covalently link an amine-terminated molecule to the PEG tether, demonstrating that amine-terminated bioactive compounds (such as peptides, enzymes, and some antimicrobials) can be immobilized onto PEG-grafted LDPE in the development of non-migratory active packaging. Fouling on food contact surfaces during food processing has a significant impact on operating efficiency and can promote biofilm development. Processing raw milk on plate heat exchangers results in significant fouling of proteins as well as minerals, and is exacerbated by the wall heating effect. An electroless nickel coating is co-deposited with polytetrafluoroethylene onto stainless steel to test its ability to resist fouling on a pilot plant scale plate heat exchanger. Further

  19. Nanotechnology in meat processing and packaging: potential applications - a review.

    Science.gov (United States)

    Ramachandraiah, Karna; Han, Sung Gu; Chin, Koo Bok

    2015-02-01

    Growing demand for sustainable production, increasing competition and consideration of health concerns have led the meat industries on a path to innovation. Meat industries across the world are focusing on the development of novel meat products and processes to meet consumer demand. Hence, a process innovation, like nanotechnology, can have a significant impact on the meat processing industry through the development of not only novel functional meat products, but also novel packaging for the products. The potential benefits of utilizing nanomaterials in food are improved bioavailability, antimicrobial effects, enhanced sensory acceptance and targeted delivery of bioactive compounds. However, challenges exist in the application of nanomaterials due to knowledge gaps in the production of ingredients such as nanopowders, stability of delivery systems in meat products and health risks caused by the same properties which also offer the benefits. For the success of nanotechnology in meat products, challenges in public acceptance, economics and the regulation of food processed with nanomaterials which may have the potential to persist, accumulate and lead to toxicity need to be addressed. So far, the most promising area for nanotechnology application seems to be in meat packaging, but the long term effects on human health and environment due to migration of the nanomaterials from the packaging needs to be studied further. The future of nanotechnology in meat products depends on the roles played by governments, regulatory agencies and manufacturers in addressing the challenges related to the application of nanomaterials in food.

  20. Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications.

    Science.gov (United States)

    Morris, Michael A; Padmanabhan, Sibu C; Cruz-Romero, Malco C; Cummins, Enda; Kerry, Joseph P

    2017-10-01

    Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased customer demands for longer product shelf-life and storage capability. Consequently, conventional packaging materials and systems will have to evolve to meet these challenges. This review presents some of the new strategies that have been developed by employing novel nanotechnological concepts which have demonstrated some promise in significantly extending the shelf-life of muscle-based foods by providing commercially-applicable, antimicrobially-active, smart packaging solutions. The primary focus of this paper is applied to subject aspects, such as; material chemistries employed, forming methods utilised, interactions of the packaging functionalities including nanomaterials employed with polymer substrates and how such materials ultimately affect microbes. In order that such materials become industrially feasible, it is important that safe, stable and commercially-viable packaging materials are shown to be producible and effective in order to gain public acceptance, legislative approval and industrial adoption. Copyright © 2017. Published by Elsevier Ltd.

  1. Maintainability design criteria for packaging of spacecraft replaceable electronic equipment.

    Science.gov (United States)

    Kappler, J. R.; Folsom, A. B.

    1972-01-01

    Maintainability must be designed into long-duration spacecraft and equipment to provide the required high probability of mission success with the least cost and weight. The ability to perform repairs quickly and easily in a space environment can be achieved by imposing specific maintainability design criteria on spacecraft equipment design and installation. A study was funded to investigate and define design criteria for electronic equipment that would permit rapid removal and replacement in a space environment. The results of the study are discussed together with subsequent simulated zero-g demonstration tests of a mockup with new concepts for packaging.

  2. The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2015-01-01

    This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

  3. Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

    International Nuclear Information System (INIS)

    Hoshi, T; Fujiwara, T

    2009-01-01

    An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

  4. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  5. Edible packaging materials.

    Science.gov (United States)

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  6. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  7. Packaging - Materials review

    Energy Technology Data Exchange (ETDEWEB)

    Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  8. Packaging - Materials review

    Science.gov (United States)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  9. Packaging - Materials review

    International Nuclear Information System (INIS)

    Herrmann, Matthias

    2014-01-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  10. Genome packaging in viruses

    OpenAIRE

    Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

    2010-01-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

  11. FUMACS-G, a Graphical User Interface for FUMACS Code Package

    International Nuclear Information System (INIS)

    Trontl, K.; Gergeta, K.; Smuc, T.

    2002-01-01

    The FUMACS (FUel MAnagement Code System) code package has been developed at Rudjer Boskovic Institute in year 1991 with the aim to enable in-core fuel management analysis of the NPP Krsko core for nominal conditions. Due to modernization and uprating of the NPP Krsko core in year 2000 and the original 1991 FUMACS inadequacy in simulating NPP Krsko core in these uprated conditions, in the year 2001 a new version of FUMACS code package has been developed - FUMACS/FEEC 2001. The code package upgrading procedure consisted of two main aspects: modifications of master files, libraries and codes necessary for proper modeling of the uprated NPP Krsko core and development of the code package structure suitable for Windows-32 environment. The latter included upgrading the source of the code from FORTRAN F77 to F90 level and development of a graphical, user-friendly interface with fully integrated electronic help system. Since the original FUMACS code package has been developed as a DOS based application, running of the code package on a Windows operating system proved to be rather inefficient and lacking in advantages of a standard Windows application. Therefore, FUMACS-G has been developed as a user friendly environment for handling off all project input and output files, as well as for easier overall project management. The design of FUMACS-G shell has been based on Microsoft application design guidelines. (author)

  12. PET based nanocomposite films for microwave packaging applications

    International Nuclear Information System (INIS)

    Galdi, M. R.; Olivieri, R.; Liguori, L.; Albanese, D.; Di Matteo, M.; Di Maio, L.

    2015-01-01

    In recent years, changes in life standards have promoted the diffusion of Ready to Cook (RTC) and Ready to Eat (RTE) products for microwave ovens. However, the main limits in microwave (MW) ovens usage are often related to the proper choice of packaging materials suitable for such technology. In fact, packages for microwaveable RTC and RTE foods should ensure adequate preservation of the product before cooking/heating such as high barriers to gases and aromas and adequate control of water vapor transmission. In addition, microwaveable packaging material must be transparent to MW, thermally stable and resistant to the mechanical stress induced by the accumulation in the head space of volatile substances produced during the cooking. Polymeric materials are good candidates for microwaveable packaging thanks to their transparency to MW. In the last years a great interest is devoted to developing innovative solution based on the use of additives or systems that act as susceptors or heating enhancers for improving the characteristics of polymers in cooking/heating in MW ovens. The present work was focused on the production and characterization of nanocomposite copolyester based films suitable for microwaveable food packaging applications. The matrices selected consist in two PET copolymers modified with carbon black (ULTRA STD) and with titanium oxide (ULTRA NA). Nanocomposite co-extruded multilayer films were produced using different percentages (0%, 2% and 4%wt/wt) of Cloisite 20A (C20A). Films were analyzed for evaluating the effect of nanofiller on the morphology and barrier properties. Moreover, to verify the effectiveness of the designed systems in reducing the cooking times of meat products, MW heating tests were carried out on pork meat hamburgers in MW oven at varying supplied powers. The cooking tests have pointed out that the selected matrices are efficient in reducing cooking times and that even low concentration of C20A acts as heating enhancers of PET

  13. PET based nanocomposite films for microwave packaging applications

    Energy Technology Data Exchange (ETDEWEB)

    Galdi, M. R., E-mail: mrgaldi@unisa.it; Olivieri, R.; Liguori, L.; Albanese, D., E-mail: dalbanese@unisa.it; Di Matteo, M.; Di Maio, L., E-mail: ldimaio@unisa.it [Industrial Engineering Department, University of Salerno, Via Giovanni Paolo II 132, 84084 Fisciano (Italy)

    2015-12-17

    In recent years, changes in life standards have promoted the diffusion of Ready to Cook (RTC) and Ready to Eat (RTE) products for microwave ovens. However, the main limits in microwave (MW) ovens usage are often related to the proper choice of packaging materials suitable for such technology. In fact, packages for microwaveable RTC and RTE foods should ensure adequate preservation of the product before cooking/heating such as high barriers to gases and aromas and adequate control of water vapor transmission. In addition, microwaveable packaging material must be transparent to MW, thermally stable and resistant to the mechanical stress induced by the accumulation in the head space of volatile substances produced during the cooking. Polymeric materials are good candidates for microwaveable packaging thanks to their transparency to MW. In the last years a great interest is devoted to developing innovative solution based on the use of additives or systems that act as susceptors or heating enhancers for improving the characteristics of polymers in cooking/heating in MW ovens. The present work was focused on the production and characterization of nanocomposite copolyester based films suitable for microwaveable food packaging applications. The matrices selected consist in two PET copolymers modified with carbon black (ULTRA STD) and with titanium oxide (ULTRA NA). Nanocomposite co-extruded multilayer films were produced using different percentages (0%, 2% and 4%wt/wt) of Cloisite 20A (C20A). Films were analyzed for evaluating the effect of nanofiller on the morphology and barrier properties. Moreover, to verify the effectiveness of the designed systems in reducing the cooking times of meat products, MW heating tests were carried out on pork meat hamburgers in MW oven at varying supplied powers. The cooking tests have pointed out that the selected matrices are efficient in reducing cooking times and that even low concentration of C20A acts as heating enhancers of PET.

  14. PET based nanocomposite films for microwave packaging applications

    Science.gov (United States)

    Galdi, M. R.; Olivieri, R.; Liguori, L.; Albanese, D.; Di Matteo, M.; Di Maio, L.

    2015-12-01

    In recent years, changes in life standards have promoted the diffusion of Ready to Cook (RTC) and Ready to Eat (RTE) products for microwave ovens. However, the main limits in microwave (MW) ovens usage are often related to the proper choice of packaging materials suitable for such technology. In fact, packages for microwaveable RTC and RTE foods should ensure adequate preservation of the product before cooking/heating such as high barriers to gases and aromas and adequate control of water vapor transmission. In addition, microwaveable packaging material must be transparent to MW, thermally stable and resistant to the mechanical stress induced by the accumulation in the head space of volatile substances produced during the cooking. Polymeric materials are good candidates for microwaveable packaging thanks to their transparency to MW. In the last years a great interest is devoted to developing innovative solution based on the use of additives or systems that act as susceptors or heating enhancers for improving the characteristics of polymers in cooking/heating in MW ovens. The present work was focused on the production and characterization of nanocomposite copolyester based films suitable for microwaveable food packaging applications. The matrices selected consist in two PET copolymers modified with carbon black (ULTRA STD) and with titanium oxide (ULTRA NA). Nanocomposite co-extruded multilayer films were produced using different percentages (0%, 2% and 4%wt/wt) of Cloisite 20A (C20A). Films were analyzed for evaluating the effect of nanofiller on the morphology and barrier properties. Moreover, to verify the effectiveness of the designed systems in reducing the cooking times of meat products, MW heating tests were carried out on pork meat hamburgers in MW oven at varying supplied powers. The cooking tests have pointed out that the selected matrices are efficient in reducing cooking times and that even low concentration of C20A acts as heating enhancers of PET.

  15. 40 CFR 262.30 - Packaging.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 25 2010-07-01 2010-07-01 false Packaging. 262.30 Section 262.30... APPLICABLE TO GENERATORS OF HAZARDOUS WASTE Pre-Transport Requirements § 262.30 Packaging. Before... the waste in accordance with the applicable Department of Transportation regulations on packaging...

  16. A 3D printed dual GSM band near isotropic on-package antenna

    KAUST Repository

    Zhen, Su

    2017-10-25

    In this paper, we propose an on-package dual band monopole antenna with near-isotropic radiation pattern for GSM mobile applications. The proposed antenna is well matched for both GSM 900 and 1800 bands and provides decent gain for both the bands (1.67 and 3.27 dBi at 900 MHz and 1800 MHz respectively). The antenna is printed with silver ink on a 3D printed polymer based package. The package houses the GSM electronics and the battery. By optimizing the antenna arms width and length, a near-isotropic radiation pattern is achieved. Unlike the published isotropic antennas which are either single band or large in size, the proposed antenna covers both GSM bands with required bandwidth and is only half wavelength long. The design is low cost and highly suitable for various GSM applications such as localization, in additional to conventional communication applications.

  17. Use and application of gelatin as potential biodegradable packaging materials for food products.

    Science.gov (United States)

    Nur Hanani, Z A; Roos, Y H; Kerry, J P

    2014-11-01

    The manufacture and potential application of biodegradable films for food application has gained increased interest as alternatives to conventional food packaging polymers due to the sustainable nature associated with their availability, broad and abundant source range, compostability, environmentally-friendly image, compatibility with foodstuffs and food application, etc. Gelatin is one such material and is a unique and popularly used hydrocolloid by the food industry today due to its inherent characteristics, thereby potentially offering a wide range of further and unique industrial applications. Gelatin from different sources have different physical and chemical properties as they contain different amino acid contents which are responsible for the varying characteristics observed upon utilization in food systems and when being utilized more specifically, in the manufacture of films. Packaging films can be successfully produced from all gelatin sources and the behaviour and characteristics of gelatin-based films can be altered through the incorporation of other food ingredients to produce composite films possessing enhanced physical and mechanical properties. This review will present the current situation with respect to gelatin usage as a packaging source material and the challenges that remain in order to move the manufacture of gelatin-based films nearer to commercial reality. Copyright © 2014 Elsevier B.V. All rights reserved.

  18. Antimicrobial Activity of TiO2 Nanoparticle-Coated Film for Potential Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Siti Hajar Othman

    2014-01-01

    Full Text Available Recent uses of titanium dioxide (TiO2 have involved various applications which include the food industry. This study aims to develop TiO2 nanoparticle-coated film for potential food packaging applications due to the photocatalytic antimicrobial property of TiO2. The TiO2 nanoparticles with varying concentrations (0–0.11 g/ 100 mL organic solvent were coated on food packaging film, particularly low density polyethylene (LDPE film. The antimicrobial activity of the films was investigated by their capability to inactivate Escherichia coli (E. coli in an actual food packaging application test under various conditions, including types of light (fluorescent and ultraviolet (UV and the length of time the film was exposed to light (one–three days. The antimicrobial activity of the TiO2 nanoparticle-coated films exposed under both types of lighting was found to increase with an increase in the TiO2 nanoparticle concentration and the light exposure time. It was also found that the antimicrobial activity of the films exposed under UV light was higher than that under fluorescent light. The developed film has the potential to be used as a food packaging film that can extend the shelf life, maintain the quality, and assure the safety of food.

  19. Nanotechnology in Meat Processing and Packaging: Potential Applications — A Review

    Directory of Open Access Journals (Sweden)

    Karna Ramachandraiah

    2015-02-01

    Full Text Available Growing demand for sustainable production, increasing competition and consideration of health concerns have led the meat industries on a path to innovation. Meat industries across the world are focusing on the development of novel meat products and processes to meet consumer demand. Hence, a process innovation, like nanotechnology, can have a significant impact on the meat processing industry through the development of not only novel functional meat products, but also novel packaging for the products. The potential benefits of utilizing nanomaterials in food are improved bioavailability, antimicrobial effects, enhanced sensory acceptance and targeted delivery of bioactive compounds. However, challenges exist in the application of nanomaterials due to knowledge gaps in the production of ingredients such as nanopowders, stability of delivery systems in meat products and health risks caused by the same properties which also offer the benefits. For the success of nanotechnology in meat products, challenges in public acceptance, economics and the regulation of food processed with nanomaterials which may have the potential to persist, accumulate and lead to toxicity need to be addressed. So far, the most promising area for nanotechnology application seems to be in meat packaging, but the long term effects on human health and environment due to migration of the nanomaterials from the packaging needs to be studied further. The future of nanotechnology in meat products depends on the roles played by governments, regulatory agencies and manufacturers in addressing the challenges related to the application of nanomaterials in food.

  20. High Temperature Wireless Communication And Electronics For Harsh Environment Applications

    Science.gov (United States)

    Hunter, G. W.; Neudeck, P. G.; Beheim, G. M.; Ponchak, G. E.; Chen, L.-Y

    2007-01-01

    In order for future aerospace propulsion systems to meet the increasing requirements for decreased maintenance, improved capability, and increased safety, the inclusion of intelligence into the propulsion system design and operation becomes necessary. These propulsion systems will have to incorporate technology that will monitor propulsion component conditions, analyze the incoming data, and modify operating parameters to optimize propulsion system operations. This implies the development of sensors, actuators, and electronics, with associated packaging, that will be able to operate under the harsh environments present in an engine. However, given the harsh environments inherent in propulsion systems, the development of engine-compatible electronics and sensors is not straightforward. The ability of a sensor system to operate in a given environment often depends as much on the technologies supporting the sensor element as the element itself. If the supporting technology cannot handle the application, then no matter how good the sensor is itself, the sensor system will fail. An example is high temperature environments where supporting technologies are often not capable of operation in engine conditions. Further, for every sensor going into an engine environment, i.e., for every new piece of hardware that improves the in-situ intelligence of the components, communication wires almost always must follow. The communication wires may be within or between parts, or from the engine to the controller. As more hardware is added, more wires, weight, complexity, and potential for unreliability is also introduced. Thus, wireless communication combined with in-situ processing of data would significantly improve the ability to include sensors into high temperature systems and thus lead toward more intelligent engine systems. NASA Glenn Research Center (GRC) is presently leading the development of electronics, communication systems, and sensors capable of prolonged stable

  1. The NASA Electronic Parts and Packaging (NEPP) Program - Presentation to Korean Aerospace Research Institute

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.

  2. Application of the GEANT3 geometry package to the description of the OPAL detector

    Energy Technology Data Exchange (ETDEWEB)

    Allison, J; Brun, R; Bruyant, F; Zanarini, P; Bullock, F W; Hobson, P R; Chang, C Y; Dumont, J J; Hemingway, R J; McPherson, A C

    1987-10-01

    We present the general features of the GEANT3 package for coding the geometrical structure of a large and complex detector in the computer programs used for their design and analysis. This package has been developed in the context of Monte Carlo studies of detector performance but should be well matched to the problem of analysis. As a specific example, we illustrate the description of the OPAL detector for the Large Electron Positron collider at CERN and show the results of a sample study using this description.

  3. Qualification of the coupled RELAP5/PANTHER/COBRA code package for licensing applications

    International Nuclear Information System (INIS)

    Schneidesch, C.R.; Zhang Jinzhao

    2004-01-01

    A coupled thermal hydraulics-neutronics code package has been developed at Tractebel Engineering (TE), in which the best-estimate thermal-hydraulic system code, RELAP5/mod2.5, is coupled with the full three-dimensional reactor core kinetics code, PANTHER, via the dynamic data exchange interface, TALINK. The Departure from Nucleate Boiling Ratio (DNBR) is calculated by the sub-channel thermal-hydraulic analysis code COBRA-3C. The package provides the capability to accurately simulate the key physical phenomena in nuclear power plant accidents with strong asymmetric behaviours and system-core interactions. This paper presents the TE coupled code package and focuses on the methodology followed for qualifying it for licensing applications. The qualification of the coupling demonstrated the robustness achieved by the combined 3-D neutron kinetics/system T-H code package for transient simulations. The coupled TE code package has been qualified and will be used at Tractebel Engineering (TE) for analyzing asymmetric PWR accidents with strong core-system interactions

  4. Fatigue failure of pb-free electronic packages under random vibration loads

    Science.gov (United States)

    Saravanan, S.; Prabhu, S.; Muthukumar, R.; Gowtham Raj, S.; Arun Veerabagu, S.

    2018-03-01

    The electronic equipment are used in several fields like, automotive, aerospace, consumer goods where they are subjected to vibration loads leading to failure of solder joints used in these equipment. This paper presents a methodology to predict the fatigue life of Pb-free surface mounted BGA packages subjected to random vibrations. The dynamic characteristics of the PCB, such as the natural frequencies, mode shapes and damping ratios were determined. Spectrum analysis was used to determine the stress response of the critical solder joint and the cumulative fatigue damage accumulated by the solder joint for a specific duration was determined.

  5. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    International Nuclear Information System (INIS)

    Sokolovskij, R; Liu, P; Van Zeijl, H W; Mimoun, B; Zhang, G Q

    2015-01-01

    Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies. (paper)

  6. 78 FR 33154 - Low Income Taxpayer Clinic Grant Program; Availability of 2014 Grant Application Package

    Science.gov (United States)

    2013-06-03

    ... Package and Guidelines (Publication 3319) for organizations interested in applying for a Low Income... nominal fee to low income taxpayers involved in tax disputes with the IRS, or educate individuals for whom... Grant Application Package and Guidelines, IRS Publication 3319 (Rev. 5-2013), can be downloaded from the...

  7. Application of electron beam irradiation, (1). Development and application of electron beam processors

    International Nuclear Information System (INIS)

    Katsumura, Yosuke

    1994-01-01

    This paper deals with characteristics, equipment (principle and kinds), present conditions, and future issues in the application of electron beam irradiation. Characteristics of electron beams are described in terms of the following: chemical and biological effects of radiation; energy and penetrating power of electron beams; and principle and kinds of electron beam accelerator. Industrial application of electron beam irradiation has advantages of high speed procedure and producibility, less energy, avoidance of poisonous gas, and extreme reduction of organic solvents to be used. The present application of electron beam irradiation cen be divided into the following: (1) hardening of resin or coated membrane; (2) improvement of macromolecular materials; (3) environmental protection; (4) sterilization; (5) food sterilization. The present equipment for electron beam irradiation is introduced according to low energy, medium energy, and high energy equipment. Finally, future issues focuses on (1) the improvement of traceability system and development of electron dosimetric techniques and (2) food sterilization. (N.K.)

  8. Plastic packaged microcircuits: Quality, reliability, and cost issues

    Science.gov (United States)

    Pecht, Michael G.; Agarwal, Rakesh; Quearry, Dan

    1993-12-01

    Plastic encapsulated microcircuits (PEMs) find their main application in commercial and telecommunication electronics. The advantages of PEMs in cost, size, weight, performance, and market lead-time, have attracted 97% of the market share of worldwide microcircuit sales. However, PEMs have always been resisted in US Government and military applications due to the perception that PEM reliability is low. This paper surveys plastic packaging with respect to the issues of reliability, market lead-time, performance, cost, and weight as a means to guide part-selection and system-design.

  9. German competent authority guidance in FE methods applications for package design assessment

    Energy Technology Data Exchange (ETDEWEB)

    Voelzke, H.; Wieser, G.; Zencker, U.; Qiao Linan; Ballheimer, V. [Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin (Germany)

    2004-07-01

    The development of new methods in analysing package designs by using the finite element method (FEM) is of increasing importance. Package designers are more and more applying the growing opportunities of numerical methods to perform safety assessments for their products which requires suited methods also for competent authorities like BAM to verify the applicants' results. This presentation gives an topical overview of the experiences and tendencies within the complex field of finite element design testing. There are at first some general and more formal aspects concerning the correct finite element program selection and documentation of modelling, material properties, boundaries and calculation results including their interpretation. To give a reliable basis to the applicants in Germany BAM has drawn up and published a Finite Element Guideline recently. Secondly, the paper discusses actual technical questions which are of a wide interest and range from mechanical reflections on cask drop and extreme impact scenarios to thermal reflections on decay heat removal and fire scenarios. Examples from BAM work on FE-development activities are shown to demonstrate the great opportunities as well as the difficulties of using finite element methods for package safety analysis and design testing.

  10. German competent authority guidance in FE methods applications for package design assessment

    International Nuclear Information System (INIS)

    Voelzke, H.; Wieser, G.; Zencker, U.; Qiao Linan; Ballheimer, V.

    2004-01-01

    The development of new methods in analysing package designs by using the finite element method (FEM) is of increasing importance. Package designers are more and more applying the growing opportunities of numerical methods to perform safety assessments for their products which requires suited methods also for competent authorities like BAM to verify the applicants' results. This presentation gives an topical overview of the experiences and tendencies within the complex field of finite element design testing. There are at first some general and more formal aspects concerning the correct finite element program selection and documentation of modelling, material properties, boundaries and calculation results including their interpretation. To give a reliable basis to the applicants in Germany BAM has drawn up and published a Finite Element Guideline recently. Secondly, the paper discusses actual technical questions which are of a wide interest and range from mechanical reflections on cask drop and extreme impact scenarios to thermal reflections on decay heat removal and fire scenarios. Examples from BAM work on FE-development activities are shown to demonstrate the great opportunities as well as the difficulties of using finite element methods for package safety analysis and design testing

  11. Effect of ionizing radiation on the properties of PLA packaging materials

    International Nuclear Information System (INIS)

    Melski, K.; Kubera, H.; Gluszewski, W.; Zimek, Z.

    2011-01-01

    Poly(lactic acid) (PLA) is attractive as a substitute for classical polymer packaging material due to its biodegradability and sufficient mechanical and barrier properties. Presented research was focused on the changes of basic mechanical parameters after ionizing irradiation performed with doses in the range of 2.5-25 kGy, commonly used in radiation sterilization and preservation of foods. Two commercial available PLA packaging films were tested. The influence of radiation dose on the mechanical properties - tensile strength and elongation were determined using standardized methods. Radiation resistance of PLA is sufficient for packaging applications. The investigations of gas products of radiolysis of PLA have been made by gas chromatography after electron beam (EB) irradiations. (authors)

  12. Application of Gelidium corneum edible films containing carvacrol for ham packages.

    Science.gov (United States)

    Lim, G O; Hong, Y H; Song, K B

    2010-01-01

    We prepared an edible film of Gelidium corneum (GC) containing carvacrol as an antimicrobial and antioxidative agent. The GC film containing carvacrol significantly decreased the WVP, while TS and %E values were increased, compared to the film without carvacrol. Increasing amounts of an antimicrobial agent increased antimicrobial activity against Escherichia coli O157:H7 and Listeria monocytogenes. Application of the film to ham packaging successfully inhibited the microbial growth and lipid oxidation of ham during storage. Our results indicate that GC film can be a useful edible packaging material for food products, and the incorporation of carvacrol in the GC film may extend the shelf life.

  13. Thermal interface material characterization for cryogenic electronic packaging solutions

    Science.gov (United States)

    Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

    2017-12-01

    As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

  14. Radiation cross-linked plastics: a versatile material solution for packaging, automotive, Electrotechnic and Electronics

    International Nuclear Information System (INIS)

    Rouif, Sophie

    2004-01-01

    Used since the beginning of the 1970s for the production of halogen-free and heat-resistant cables and wires, for conditioning polyethylene hot-water pipes or for the manufacture of heat shrinkable tubes and of tyres, radiation cross-linking is developing fastly today on the scale of plastic-moulded parts, and not only by the mean of EB, but also under gamma rays. Indeed, it improves considerably the performances of a great number of plastics among thermoplastics, elastomers and thermoplastic elastomers (TPE). Radiation cross-linking reinforces the dimensional stability of polymers in chemically aggressive and high-temperature conditions. Radiation cross-linked-based engineering plastics offers OEM and end users in many branches of industry both technical and economical advantages in comparison with high-performances plastics. They constitute a technical and economical compromise between engineering plastics that failed and high-performances plastic, often over-tailored and expensive. This modern industrial technology gives way to new applications and perspectives in various sectors (packaging, automotive, electrotechnic and electronics, including connectors, surface-mounted devices, integrated circuits, 3D-MID, etc.) that are described in the paper

  15. Interface thermal characteristics of flip chip packages - A numerical study

    International Nuclear Information System (INIS)

    Kandasamy, Ravi; Mujumdar, A.S.

    2009-01-01

    Flip chip ball grid array (FC-BGA) packages are commonly used for high inputs/outputs (I/O) ICs; they have been proven to provide good solutions for a variety of applications to maximize thermal and electrical performance. A fundamental limitation to such devices is the thermal resistance at the top of the package, which is characterized θ JC parameter. The die-to-lid interface thermal resistance is identified as a critical issue for the thermal management of electronic packages. This paper focuses on the effect of the interface material property changes on the interface thermal resistance. The effect of package's junction to case (Theta-JC or θ JC ) thermal performance is investigated for bare die, flat lid and cup lid packages using a validated thermal model. Thermal performance of a cup or flat lid attached and bare die packages were investigated for different interface materials. Improved Theta-JC performance was observed for the large die as compared to the smaller die. Several parametric studies were carried out to understand the effects of interface bond line thickness (BLT), different die sizes, the average void size during assembly and thermal conductivity of interface materials on package thermal resistance

  16. Electronic Submissions of Pesticide Applications

    Science.gov (United States)

    Applications for pesticide registration can be submitted electronically, including forms, studies, and draft product labeling. Applicants need not submit multiple electronic copies of any pieces of their applications.

  17. Trends in Food Packaging.

    Science.gov (United States)

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  18. Isothermal solidification based packaging of biosensors at low temperatures

    International Nuclear Information System (INIS)

    Sharma, R.P.; Khanna, P.K.; Kumar, D.

    2010-01-01

    Thick film Au printed square contact pads are interconnected to Cu substrates at constant pressure and temperature using the isothermal solidification of Bi-In alloy on the joining surfaces. The effect of reaction time on the mechanical strength of the package has been analyzed. Thermal stability of the fabricated specimens have been measured and discussed. The delaminated surfaces examined optically reveal the morphology of the metallization zones on the joining substrates. The scanning electron microscopy of these surfaces is reported in this paper. Tests for thermal shock, pH resistivity and shelf life have been carried out to predict the reliability of the packaging for long term applications.

  19. Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

    Science.gov (United States)

    Maxa, Jacob; Novikov, Andrej; Nowottnick, Mathias

    2017-01-01

    Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

  20. Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

    Directory of Open Access Journals (Sweden)

    Jacob Maxa

    2017-12-01

    Full Text Available Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

  1. Packaging for Sustainability

    CERN Document Server

    Lewis, Helen; Fitzpatrick, Leanne

    2012-01-01

    The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

  2. International Collaboration in Packaging Education: Hands-on System-on-Package (SOP) Graduate Level Courses at Indian Institute of Science and Georgia Tech PRC

    OpenAIRE

    Varadarajan, Mahesh; Bhattacharya, Swapan; Doraiswami, Ravi; Rao, Ananda G; Rao, NJ; May, Gary; Conrad, Leyla; Tummala, Rao

    2005-01-01

    System-on-Package (SOP) continues to revolutionize the realization of convergent systems in microelectronics packaging. The SOP concept which began at the Packaging Research Center (PRC) at Georgia Tech has benefited its international collaborative partners in education including the Indian Institute of Science (IISc). The academic program for electronics packaging currently in the Centre for Electronics Design and Technology (CEDT) at IISc is aimed at educating a new breed of globally-compet...

  3. Applications of nanotechnology in food packaging and food safety: barrier materials, antimicrobials and sensors.

    Science.gov (United States)

    Duncan, Timothy V

    2011-11-01

    In this article, several applications of nanomaterials in food packaging and food safety are reviewed, including: polymer/clay nanocomposites as high barrier packaging materials, silver nanoparticles as potent antimicrobial agents, and nanosensors and nanomaterial-based assays for the detection of food-relevant analytes (gasses, small organic molecules and food-borne pathogens). In addition to covering the technical aspects of these topics, the current commercial status and understanding of health implications of these technologies are also discussed. These applications were chosen because they do not involve direct addition of nanoparticles to consumed foods, and thus are more likely to be marketed to the public in the short term. Published by Elsevier Inc.

  4. Polyhydroxyalkanoate (PHA: Review of synthesis, characteristics, processing and potential applications in packaging

    Directory of Open Access Journals (Sweden)

    E. Bugnicourt

    2014-11-01

    Full Text Available Polyhydroxyalkanoates (PHAs are gaining increasing attention in the biodegradable polymer market due to their promising properties such as high biodegradability in different environments, not just in composting plants, and processing versatility. Indeed among biopolymers, these biogenic polyesters represent a potential sustainable replacement for fossil fuel-based thermoplastics. Most commercially available PHAs are obtained with pure microbial cultures grown on renewable feedstocks (i.e. glucose under sterile conditions but recent research studies focus on the use of wastes as growth media. PHA can be extracted from the bacteria cell and then formulated and processed by extrusion for production of rigid and flexible plastic suitable not just for the most assessed medical applications but also considered for applications including packaging, moulded goods, paper coatings, non-woven fabrics, adhesives, films and performance additives. The present paper reviews the different classes of PHAs, their main properties, processing aspects, commercially available ones, as well as limitations and related improvements being researched, with specific focus on potential applications of PHAs in packaging.

  5. An application of the GEANT3 geometry package to the description of the OPAL detector

    International Nuclear Information System (INIS)

    Allison, J.; Bullock, F.W.; Hobson, P.R.; Lorazo, B.; Mallet, J.; Patrick, G.; Possoz, A.; Rossi, A.; Bologna Univ.; Ward, D.R.; Ward, C.P.

    1987-01-01

    We present the general features of the GEANT3 package for coding the geometrical structure of a large and complex detector in the computer programs used for their design and analysis. This package has been developed in the context of Monte Carlo studies of detector performance but should be well matched to the problem of analysis. As a specific example, we illustrate the description of the OPAL detector for the Large Electron Positron collider at CERN and show the results of a sample study using this description. (orig.)

  6. WASTE PACKAGE TRANSPORTER DESIGN

    International Nuclear Information System (INIS)

    Weddle, D.C.; Novotny, R.; Cron, J.

    1998-01-01

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''

  7. Potential application of UV radiation processing in electronic packaging

    International Nuclear Information System (INIS)

    Ng Chee Mang; Lim Yoke Keem; Kumar, R.N.

    1999-01-01

    UV-curable epoxies have been formulated for use in place of the established heat cure epoxy systems for coating, adhesion and encapsulation of electronic devices. The UV-cured epoxy systems can be formulated to give comparable or even better physical and chemical properties than the more common heat cured systems. The UV systems offer significant advantage in very fast cure and hence very short production cycle time. UV systems can also be formulated to give desired properties of increased strength, high Tg, increased humidity resistance and improved temperature cycling performance

  8. Experimental and theoretical analyses of package-on-package structure under three-point bending loading

    International Nuclear Information System (INIS)

    Jia Su; Wang Xi-Shu; Ren Huai-Hui

    2012-01-01

    High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates a chip scale package (CSP) in the top package and a fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results. (condensed matter: structural, mechanical, and thermal properties)

  9. Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

    Energy Technology Data Exchange (ETDEWEB)

    DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

    2007-04-12

    This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

  10. System issues for multichip packaging

    Science.gov (United States)

    Sage, Maurice G.; Hartley, Neil

    1991-04-01

    It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

  11. Naval Waste Package Design Report

    International Nuclear Information System (INIS)

    M.M. Lewis

    2004-01-01

    A design methodology for the waste packages and ancillary components, viz., the emplacement pallets and drip shields, has been developed to provide designs that satisfy the safety and operational requirements of the Yucca Mountain Project. This methodology is described in the ''Waste Package Design Methodology Report'' Mecham 2004 [DIRS 166168]. To demonstrate the practicability of this design methodology, four waste package design configurations have been selected to illustrate the application of the methodology. These four design configurations are the 21-pressurized water reactor (PWR) Absorber Plate waste package, the 44-boiling water reactor (BWR) waste package, the 5-defense high-level waste (DHLW)/United States (U.S.) Department of Energy (DOE) spent nuclear fuel (SNF) Co-disposal Short waste package, and the Naval Canistered SNF Long waste package. Also included in this demonstration is the emplacement pallet and continuous drip shield. The purpose of this report is to document how that design methodology has been applied to the waste package design configurations intended to accommodate naval canistered SNF. This demonstrates that the design methodology can be applied successfully to this waste package design configuration and support the License Application for construction of the repository

  12. Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

    Energy Technology Data Exchange (ETDEWEB)

    Hoshi, T [Department of Applied Mathematics and Physics, Tottori University, Tottori 680-8550 (Japan); Fujiwara, T [Core Research for Evolutional Science and Technology, Japan Science and Technology Agency (CREST-JST) (Japan)

    2009-02-11

    An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

  13. Antimicrobial nanomaterials for food packaging applications

    OpenAIRE

    Radusin Tanja I.; Ristić Ivan S.; Pilić Branka M.; Novaković Aleksandra R.

    2016-01-01

    Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to ...

  14. Accessing National Water Model Output for Research and Application: An R package

    Science.gov (United States)

    Johnson, M.; Coll, J.

    2017-12-01

    With the National Water Model becoming operational in August of 2016, the need for a open source way to translate a huge amount of data into actionable intelligence and innovative research is apparent. The first step in doing this is to provide a package for accessing, managing, and writing data in a way that is both interpretable, portable, and useful to the end user in both the R environment, and other applications. This can be as simple as subsetting the outputs and writing to a CSV, but can also include converting discharge output to more meaningful statistics and measurements, and methods to visualize data in ways that are meaningful to a wider audience. The NWM R package presented here aims to serve this need through a suite of functions fit for researchers, first responders, and average citizens. A vignette of how this package can be applied to real-time flood mapping will be demonstrated.

  15. The influence of electron-beam irradiation on some mechanical properties of commercial multilayer flexible packaging materials (PET MET/LDPE)

    International Nuclear Information System (INIS)

    Nogueira, Beatriz R.; Oliveira, Vitor M.; Moura, Esperidiana A.B.; Ortiz, Angel V.

    2009-01-01

    The treatment with electron-beam radiation is a promising approach to the controllable modification of the properties of the polymeric flexible packaging materials, in order to adjust their properties. In recent years electron-beam irradiation have been efficiently applied in the flexible packaging industry to promote crosslinking and scission of the polymeric chains in order to improve material mechanical properties. On the other hand, ionizing irradiation can also affect the polymeric materials itself leading to a production of free radicals. These free radicals can in turn lead to degradation and or cross-linking phenomena. The influence of electron beam irradiation on mechanical properties of commercial multilayer flexible packaging materials based on laminated low-density polyethylene (LDPE) and metallized poly(ethylene terephthalate) (PET) was studied. The PETmet/LDPE structure was irradiated with doses up to 120 kGy, using a 1.5 MeV electron beam accelerator, dose rate 11.22kGy/s, at room temperature in presence of air. The results showed that penetration resistance of the irradiated PETmet/LDPE film increase up to 10 %, except for radiation dose of 30 kGy that resulted in a slight decrease of ca. 3%, while the sealing resistance decreased ca. 8-26% in all doses (p < 0.05). In addition, the samples of PETmet/LDPE film at 45, 60, 75 and 105 kGy presented a gain up to 18 % in their original tensile strength at break, a gain of ca. 38% in their original elongation at break for radiation dose of 45 kGy and ca. 17% for radiation doses of 60, 75 and 120 kGy. (author)

  16. QMCPACK: an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

    Science.gov (United States)

    Kim, Jeongnim; Baczewski, Andrew D.; Beaudet, Todd D.; Benali, Anouar; Chandler Bennett, M.; Berrill, Mark A.; Blunt, Nick S.; Josué Landinez Borda, Edgar; Casula, Michele; Ceperley, David M.; Chiesa, Simone; Clark, Bryan K.; Clay, Raymond C., III; Delaney, Kris T.; Dewing, Mark; Esler, Kenneth P.; Hao, Hongxia; Heinonen, Olle; Kent, Paul R. C.; Krogel, Jaron T.; Kylänpää, Ilkka; Li, Ying Wai; Lopez, M. Graham; Luo, Ye; Malone, Fionn D.; Martin, Richard M.; Mathuriya, Amrita; McMinis, Jeremy; Melton, Cody A.; Mitas, Lubos; Morales, Miguel A.; Neuscamman, Eric; Parker, William D.; Pineda Flores, Sergio D.; Romero, Nichols A.; Rubenstein, Brenda M.; Shea, Jacqueline A. R.; Shin, Hyeondeok; Shulenburger, Luke; Tillack, Andreas F.; Townsend, Joshua P.; Tubman, Norm M.; Van Der Goetz, Brett; Vincent, Jordan E.; ChangMo Yang, D.; Yang, Yubo; Zhang, Shuai; Zhao, Luning

    2018-05-01

    QMCPACK is an open source quantum Monte Carlo package for ab initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater–Jastrow type trial wavefunctions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary-field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performance computing architectures, including multicore central processing unit and graphical processing unit systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://qmcpack.org.

  17. WASTE PACKAGE TRANSPORTER DESIGN

    Energy Technology Data Exchange (ETDEWEB)

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  18. Structure of a headful DNA-packaging bacterial virus at 2.9 Å resolution by electron cryo-microscopy.

    Science.gov (United States)

    Zhao, Haiyan; Li, Kunpeng; Lynn, Anna Y; Aron, Keith E; Yu, Guimei; Jiang, Wen; Tang, Liang

    2017-04-04

    The enormous prevalence of tailed DNA bacteriophages on this planet is enabled by highly efficient self-assembly of hundreds of protein subunits into highly stable capsids. These capsids can stand with an internal pressure as high as ∼50 atmospheres as a result of the phage DNA-packaging process. Here we report the complete atomic model of the headful DNA-packaging bacteriophage Sf6 at 2.9 Å resolution determined by electron cryo-microscopy. The structure reveals the DNA-inflated, tensed state of a robust protein shell assembled via noncovalent interactions. Remarkable global conformational polymorphism of capsid proteins, a network formed by extended N arms, mortise-and-tenon-like intercapsomer joints, and abundant β-sheet-like mainchain:mainchain intermolecular interactions, confers significant strength yet also flexibility required for capsid assembly and DNA packaging. Differential formations of the hexon and penton are mediated by a drastic α-helix-to-β-strand structural transition. The assembly scheme revealed here may be common among tailed DNA phages and herpesviruses.

  19. Microcomputer applications for NSSS data package review

    International Nuclear Information System (INIS)

    Eng, D.J.; Smith, F.M.

    1984-01-01

    Associated with each component of a Nuclear Steam Supply System are the necessary supporting documents which demonstrate compliance with applicable codes, specifications and design criteria. The documents are grouped into individual data packages, and may exceed 800 in number for a major installation. A complete review, initiated by a utility in response to federal code regulations (10 CFR 50), can involve a tremendous number of review transactions. A data management system to assist the reviewer in the tracking and resolution of discrepancy items is currently under development and use. The system uses microcomputer-based relational database management software and provides complete and flexible capabilities to process database components and attributes based on user specified criteria. The completed database is a ''portable'' system, and can be utilized on an as-needed basis after the review is completed. A discrepancy analysis is performed to identify relations between manufacturer and discrepancy occurrence, part type vs. discrepancy type, etc. These results may prove useful in subsequent reviews or application to existing QA procedures

  20. Evaluation of the effects of electron-beam irradiation on the puncture resistance by Lasioderma serricorne in flexible packaging of granola

    International Nuclear Information System (INIS)

    Oliveira, Vitor M.; Alves, Juliana N.; Nogueira, Beatriz R.; Moura, Esperidiana A.B.; Ortiz, Angel V.; Potenza, Marcos R.

    2009-01-01

    Lasioderma serricorne is a beetle that infests stored and industrialized dry foods such as cereal bars, granola, flour and pasta, amongst others, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by L. serricorne in BOPP/PP structure, used commercially as granola packaging after electron-beam irradiation. The irradiations were performed using a 1.5 MeV electron beam accelerator, dose rate of 11.22 kGy/s, at room temperature in presence of air, doses up to 120 kGy. After irradiation the BOPP/PP samples were subjected to tests of puncture resistance by L. serricorne, tensile strength, friction coefficient, penetration and seal strength. Results showed decreases in the original mechanical properties of the structure according to the radiation doses applied and effective resistance against punctures by L. serricorne (p<0.05). The results indicate that the irradiated and non-irradiated BOPP/PP structure, in the conditions studied in this work, is resistant against L. serricorne, however the decreases observed in the mechanical properties of the irradiated structure may turn it inappropriate for packaging granola. (author)

  1. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

    Energy Technology Data Exchange (ETDEWEB)

    Murray, Kieran A., E-mail: kmurray@research.ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); Kennedy, James E., E-mail: jkennedy@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); McEvoy, Brian, E-mail: Brian.Mcevoy@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Vrain, Olivier, E-mail: Olivier.Vrain@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Ryan, Damien, E-mail: Damien.Ryan@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Cowman, Richard, E-mail: Richard.Cowman@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Higginbotham, Clement L., E-mail: chigginbotham@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland)

    2014-06-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance.

  2. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

    International Nuclear Information System (INIS)

    Murray, Kieran A.; Kennedy, James E.; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L.

    2014-01-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance

  3. Sticker electronics

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-09-08

    Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics (112, 122, 132) which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.

  4. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  5. 3D printed System-on-Package (SoP) for environmental sensing and localization applications

    KAUST Repository

    Zhen, Su

    2017-12-22

    This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

  6. Fabrication of antibacterial chitosan-PVA blended film using electrospray technique for food packaging applications.

    Science.gov (United States)

    Liu, Yaowen; Wang, Shuyao; Lan, Wenting

    2018-02-01

    In this study, blended films from poly(vinyl alcohol) (PVA) containing chitosan (CS) were prepared via a simple solution casting and electrospraying method. The structures of the PVA-CS films were characterized by Fourier-transform infrared spectroscopy. The morphologies of the films were observed by scanning electron microscopy. The thermal properties of the PVA-CS films were examined by thermogravimetry. The effects of CS contents on the mechanical properties, oxygen permeability values, water vapor permeation levels, and antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) strains were investigated. Compared to the pure PVA film, the PVA-CS films showed greater elongation at break, lower oxygen permeability, higher water barrier properties, and greater antibacterial activity, especially for the PVA:CS weight ratio of 75:25. The obtained results indicate the PVA-CS film may be a promising material for food packaging applications. Copyright © 2017 Elsevier B.V. All rights reserved.

  7. Lithium niobate packaging challenges

    International Nuclear Information System (INIS)

    Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

    1988-01-01

    The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

  8. Micro packaging of hermetic seal mini dual in line laser diode module for aerospace applications

    Science.gov (United States)

    Kazemi, Alex A.; Chan, Eric; Koshinz, Dennis

    2014-09-01

    Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of space applications. This paper describes a new improved micro packaging method of hermetic seal mini-DIL (dual in line) laser diode module. The problem of using a softer solder resulted in failure mechanisms observed in the mini-DIL laser diode module based laser firing unit (LFU) for ordinance ignition of a missile system. These failures included: (1) failure in light output pulse power, (2) fiber pigtail damage inside the package snout which caused low LFU production yield. Our distinctive challenge for this project is the micro packaging of mini-DIL. For this package a new technique for the hermetic sealing using a micro-soldering process was developed. The process is able to confine the solder seal to a small region inside the snout near the fiber feed-through hole on the wall of the mini-DIL package. After completing the development, which included temperature and thermal cycling, X-rays analysis showed the new method had no fiber damage after the microsoldering seal. The new process resulted in 100% success in the packaging design and was granted a patent for the innovative development.

  9. Printed electronic on flexible and glass substrates

    Science.gov (United States)

    Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna

    2010-09-01

    Organic electronics is a platform technology that enables multiple applications based on organic electronics but varied in specifications. Organic electronics is based on the combination of new materials and cost-effective, large area production processes that provide new fields of application. Organic electronic by its size, weight, flexibility and environmental friendliness electronics enables low cost production of numerous electrical components and provides for such promising fields of application as: intelligent packaging, low cost RFID, flexible solar cells, disposable diagnostic devices or games, and printed batteries [1]. The paper presents results of inkjetted electronics elements on flexible and glass substrates. The investigations was target on characterizing shape, surface and geometry of printed structures. Variety of substrates were investigated, within some, low cost, non specialized substrate, design for other purposes than organic electronic.

  10. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    Science.gov (United States)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  11. Packaging of high-power bars for optical pumping and direct applications

    Science.gov (United States)

    Heinemann, Stefan; An, Haiyan; Barnowski, Tobias; Jiang, John; Negoita, Viorel; Roff, Robert; Vethake, Thilo; Boucke, Konstantin; Treusch, Georg

    2015-03-01

    Continuous cost reduction, improved reliability and modular platform guide the design of our next generation heatsink and packaging process. Power scaling from a single device effectively lowers the cost, while electrical insulation of the heatsink, low junction temperature and hard solder enable high reliability. We report on the latest results for scaling the output power of bars for optical pumping and materials processing. The epitaxial design and geometric structures are specific for the application, while packaging with minimum thermal impedance, low stress and low smile are generic features. The isolated heatsink shows a thermal impedance of 0.2 K/W and the maximum output power is limited by the requirement of a junction temperature of less than 68oC for high reliability. Low contact impedance are addressed for drive currents of 300 A. For pumping applications, bars with a fill factor of 60% are deployed emitting more than 300 W of output power with an efficiency of about 55% and 8 bars are arranged in a compact pump module emitting 2 kW of collimated power suitable for pumping disk lasers. For direct applications we target coupling kilowatts of output powers into fibers of 100 μm diameter with 0.1 NA based on dense wavelength multiplexing. Low fill factor bars with large optical waveguide and specialized coating also emit 300 W.

  12. Active food packaging technologies.

    Science.gov (United States)

    Ozdemir, Murat; Floros, John D

    2004-01-01

    Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

  13. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  14. Harsh-Environment Packaging for Downhole Gas and Oil Exploration

    Energy Technology Data Exchange (ETDEWEB)

    Shubhra Bansal; Junghyun Cho; Kevin Durocher; Chris Kapusta; Aaron Knobloch; David Shaddock; Harry Schoeller; Hua Xia

    2007-08-31

    This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the thermal-mechanical models of the material interactions and developing test structures to confirm these models. Discussions were initiated with the major General Electric (GE) businesses that currently sell into markets requiring high temperature electronics and packaging. They related the major modes of failure they encounter routinely and the hurdles needed to be overcome in order to improve the temperature specifications of these products. We consulted with our GE business partners about the reliability specifications and investigated specifications and guidelines that from IPC and the SAE body that is currently developing guidelines for electronics package reliability. Following this, a risk analysis was conducted for the program to identify the critical risks which need to be mitigated in order to demonstrate a flex-based packaging approach under these conditions. This process identified metal/polyimide adhesion, via reliability for flex substrates and high temperature interconnect as important technical areas for reliability improvement.

  15. Antimicrobial packaging with natural compunds - a review

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2016-12-01

    Full Text Available Background:  Packaging problems are an integral part of logistics and the implementation of packaging significantly affects the effectiveness of logistics processes, as a factor which increases the safety and the quality of products being transported. Active packaging is an area of technology needed to meet the requirements of the contemporary consumer. Active packaging creates additional opportunities in systems for packing goods, as well as offering a solution in which the packaging, the product and surroundings interact. Furthermore, active packaging allows packaging to interact with food and the environment and play a dynamic role in food preservation. The main role of antimicrobial packaging is to inhibit the growth of microorganisms that reduce the quality of the packaged product. Methods: The application of natural antimicrobial agents appears to be safe for food products. Also, these compounds have potential applications as a natural preservative in the food packaging industry. This study presents some antibacterial agents, namely chitosan, nisin and pectins. Results and conclusion: Natural substances used in active packaging can eliminate the danger of chemical substances migrating to food.

  16. Application of polymer nanocomposite materials in food packaging

    Directory of Open Access Journals (Sweden)

    Amra Odobašić

    2015-01-01

    Full Text Available The term “nano” refers to nano particle size from 1 to 100 nanometers. The term "nanotechnology" was first introduced by Norio Taniguchi in 1974. Nanotechnology may be used to improve the taste and texture of food and for the production of packaging that maintain fresh product. The primary function of packaging is to maintain the quality and safety of products during transport and storage period, as well as to extend its viability by preventing unwanted effect agents such as microorganisms, chemical contaminants, oxygen, moisture and light. The aim of this paper is to point out the achievements of nanotechnology in terms of food packaging with an overview of polymers that are commonly used in food packaging, as well as strategies to improve the physical properties of polymers, including mechanical strength, thermal stability and barrier to gases. By studing of recently published literature, it was clear that nanomaterials such as nano polymers are trying to replace conventional materials in food packaging. Nanosensors can be used to prove the presence of contaminants, microtoxins and microorganisms in food.

  17. Design of compact freeform lens for application specific Light-Emitting Diode packaging.

    Science.gov (United States)

    Wang, Kai; Chen, Fei; Liu, Zongyuan; Luo, Xiaobing; Liu, Sheng

    2010-01-18

    Application specific LED packaging (ASLP) is an emerging technology for high performance LED lighting. We introduced a practical design method of compact freeform lens for extended sources used in ASLP. A new ASLP for road lighting was successfully obtained by integrating a polycarbonate compact freeform lens of small form factor with traditional LED packaging. Optical performance of the ASLP was investigated by both numerical simulation based on Monte Carlo ray tracing method and experiments. Results demonstrated that, comparing with traditional LED module integrated with secondary optics, the ASLP had advantages of much smaller size in volume (approximately 1/8), higher system lumen efficiency (approximately 8.1%), lower cost and more convenience for customers to design and assembly, enabling possible much wider applications of LED for general road lighting. Tolerance analyses were also conducted. Installation errors of horizontal and vertical deviations had more effects on the shape and uniformity of radiation pattern compared with rotational deviation. The tolerances of horizontal, vertical and rotational deviations of this lens were 0.11 mm, 0.14 mm and 2.4 degrees respectively, which were acceptable in engineering.

  18. Introduction to Software Packages. [Final Report.

    Science.gov (United States)

    Frankel, Sheila, Ed.; And Others

    This document provides an introduction to applications computer software packages that support functional managers in government and encourages the use of such packages as an alternative to in-house development. A review of current application areas includes budget/project management, financial management/accounting, payroll, personnel,…

  19. Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

    Science.gov (United States)

    Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

    2017-08-30

    The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

  20. Radiation effects evaluation for electrons sheaf in packages resistance in a Lasioderma serricorne, Plodia interpunctella and Sitophilus zeamais

    International Nuclear Information System (INIS)

    Alves, Juliana Nazare

    2011-01-01

    The plagues of stored products consist of a man problem, depreciating products and causing economical damages. Among these curses we have Lasioderma serricorne (F. 1792), Sitophilus zeamais (M. 1855) and Plodia interpunctella (H. 1813) known by infesting stored products as: grains, brans, flours, coffee, tobacco, dried fruits and spices. These curses perforate and penetrate the packages, ovipositing over the substratum. In this context the package plays a fundamental part, preventing the contact and curses' proliferation in the packed product. So, to protect the packed product and to prolong its shelf life, the package should have good mechanical resistance to tension and perforation, good sealing, good barrier properties and should not transfer odors nor strange flavors to the packed product. The ionizing radiation can cause structural changes in polymer packages, these changes are caused by the scission processes and reticulation of the polymers chains. These are concurrent processes and the predominance of one over the other depends on the chemical structure of the polymer, the irradiation conditions and specific factors of the material that will absorb the energy. This work had the objective to evaluate the changes in mechanical properties of package structures used to store granola, cereal bar and pasta, as well as its resistance to perforation by L. serricorne, P. interpunctella and S. zeamais, when submitted to electrons sheaf radiation. In this methodology were used five structures of commercially utilized packages to store granola, cereal bar and pasta composed by (Polypropylene bi-oriented metallic/Polypropylene bi-oriented coextruded - BOPPmet/BOPP 50 μm), (Polypropylene bi-oriented/Polypropylene - BOPP/PP 50 μm), Poli (ethylene terephthalate) metallic/Polypropylene bi-oriented coextruded - PETmet/BOPP 32 μm), Poli (ethylene terephthalate) /Polypropylene - PET/PP1 72 μm), Poli (ethylene terephthalate)/Polypropylene - PET/PP2 32 μm). The structures

  1. APPLICATION OF POLYURETHANE FOAM FOR IMPACT ABSORPTION AND THERMAL INSULATION FOR RADIOACTIVE MATERIALS PACKAGINGS

    International Nuclear Information System (INIS)

    Smith, A; Glenn Abramczyk, G; Paul Blanton, P; Steve Bellamy, S; William Daugherty, W; Sharon Williamson, S

    2007-01-01

    Polyurethane foam has been widely used as an impact absorbing and thermal insulating material for large radioactive materials packages, since the 1980's. With the adoption of the regulatory crush test requirement, for smaller packages, polyurethane foam has been adopted as a replacement for cane fiberboard, because of its ability to withstand the crush test. Polyurethane foam is an engineered material whose composition is much more closely controlled than that of cane fiberboard. In addition, the properties of the foam can be controlled by controlling the density of the foam. The conditions under which the foam is formed, whether confined or unconfined have an affect on foam properties. The study reported here reviewed the application of polyurethane foam in RAM packagings and compared property values reported in the literature with published property values and test results for foam specimens taken from a prototype 9977 packaging. The study confirmed that, polyurethane foam behaves in a predictable and consistent manner and fully satisfies the functional requirements for impact absorption and thermal insulation

  2. Sticker electronics

    KAUST Repository

    Hussain, Muhammad Mustafa; Torres Sevilla, Galo Andres; Diaz Cordero, Marlon Steven

    2017-01-01

    Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces

  3. The ZOOM minimization package

    International Nuclear Information System (INIS)

    Fischler, Mark S.; Sachs, D.

    2004-01-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete

  4. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  5. Future Perspective : Design Process of Perfume Packaging

    OpenAIRE

    Anderson, Duncan

    2016-01-01

    In a world where technology develops at a rapid speed a packaging designer should have the ability to adapt to the challenges in a world where the packaging landscape might look far more different from today. This thesis will look at possible future scenarios relating to resources, infrastructure and consumer behaviour in the year 2050. It will then go on to discuss the emergence of new packaging materials pitted to replace plastic, as well as take a look at printed electronics in packaging a...

  6. Wafer-level micro-optics: trends in manufacturing, testing, packaging, and applications

    Science.gov (United States)

    Voelkel, Reinhard; Gong, Li; Rieck, Juergen; Zheng, Alan

    2012-11-01

    Micro-optics is an indispensable key enabling technology (KET) for many products and applications today. Probably the most prestigious examples are the diffractive light shaping elements used in high-end DUV lithography steppers. Highly efficient refractive and diffractive micro-optical elements are used for precise beam and pupil shaping. Micro-optics had a major impact on the reduction of aberrations and diffraction effects in projection lithography, allowing a resolution enhancement from 250 nm to 45 nm within the last decade. Micro-optics also plays a decisive role in medical devices (endoscopes, ophthalmology), in all laser-based devices and fiber communication networks (supercomputer, ROADM), bringing high-speed internet to our homes (FTTH). Even our modern smart phones contain a variety of micro-optical elements. For example, LED flashlight shaping elements, the secondary camera, and ambient light and proximity sensors. Wherever light is involved, micro-optics offers the chance to further miniaturize a device, to improve its performance, or to reduce manufacturing and packaging costs. Wafer-scale micro-optics fabrication is based on technology established by semiconductor industry. Thousands of components are fabricated in parallel on a wafer. We report on the state of the art in wafer-based manufacturing, testing, packaging and present examples and applications for micro-optical components and systems.

  7. Electron grafted barrier coatings for packaging film modification

    International Nuclear Information System (INIS)

    Rangwalla, I.J.; Nablo, S.V.

    1993-01-01

    The O 2 barrier performance of organosilane films, coated, dried and electron beam grafted to polyolefin film has been studied. Excellent anti-scalping properties based upon limonene (dipentene) transmission measurements have also been observed. Results are also reported on O 2 permeability reduction when the process is applied to common barrier polymers such as EVOH and acrylonitrile. Experience with its in-line application on LDPE is discussed. (author)

  8. Electron beam simulation applicators

    International Nuclear Information System (INIS)

    Purdy, J.A.

    1983-01-01

    A system for simulating electron beam treatment portals using low-temperature melting point alloy is described. Special frames having the same physical dimensions as the electron beam applicators used on the Varian Clinac 20 linear accelerator were designed and constructed

  9. QmeQ 1.0: An open-source Python package for calculations of transport through quantum dot devices

    Science.gov (United States)

    Kiršanskas, Gediminas; Pedersen, Jonas Nyvold; Karlström, Olov; Leijnse, Martin; Wacker, Andreas

    2017-12-01

    QmeQ is an open-source Python package for numerical modeling of transport through quantum dot devices with strong electron-electron interactions using various approximate master equation approaches. The package provides a framework for calculating stationary particle or energy currents driven by differences in chemical potentials or temperatures between the leads which are tunnel coupled to the quantum dots. The electronic structures of the quantum dots are described by their single-particle states and the Coulomb matrix elements between the states. When transport is treated perturbatively to lowest order in the tunneling couplings, the possible approaches are Pauli (classical), first-order Redfield, and first-order von Neumann master equations, and a particular form of the Lindblad equation. When all processes involving two-particle excitations in the leads are of interest, the second-order von Neumann approach can be applied. All these approaches are implemented in QmeQ. We here give an overview of the basic structure of the package, give examples of transport calculations, and outline the range of applicability of the different approximate approaches.

  10. Software and package applicating for network meta-analysis: A usage-based comparative study.

    Science.gov (United States)

    Xu, Chang; Niu, Yuming; Wu, Junyi; Gu, Huiyun; Zhang, Chao

    2017-12-21

    To compare and analyze the characteristics and functions of software applications for network meta-analysis (NMA). PubMed, EMbase, The Cochrane Library, the official websites of Bayesian inference Using Gibbs Sampling (BUGS), Stata and R, and Google were searched to collect the software and packages for performing NMA; software and packages published up to March 2016 were included. After collecting the software, packages, and their user guides, we used the software and packages to calculate a typical example. All characteristics, functions, and computed results were compared and analyzed. Ten types of software were included, including programming and non-programming software. They were developed mainly based on Bayesian or frequentist theory. Most types of software have the characteristics of easy operation, easy mastery, exact calculation, or excellent graphing. However, there was no single software that performed accurate calculations with superior graphing; this could only be achieved through the combination of two or more types of software. This study suggests that the user should choose the appropriate software according to personal programming basis, operational habits, and financial ability. Then, the choice of the combination of BUGS and R (or Stata) software to perform the NMA is considered. © 2017 Chinese Cochrane Center, West China Hospital of Sichuan University and John Wiley & Sons Australia, Ltd.

  11. Development of utility generic functional requirements for electronic work packages and computer-based procedures

    Energy Technology Data Exchange (ETDEWEB)

    Oxstrand, Johanna [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2017-06-01

    The Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative is a step toward a vision of implementing an eWP framework that includes many types of eWPs. This will enable immediate paper-related cost savings in work management and provide a path to future labor efficiency gains through enhanced integration and process improvement in support of the Nuclear Promise (Nuclear Energy Institute 2016). The NEWPER initiative was organized by the Nuclear Information Technology Strategic Leadership (NITSL) group, which is an organization that brings together leaders from the nuclear utility industry and regulatory agencies to address issues involved with information technology used in nuclear-power utilities. NITSL strives to maintain awareness of industry information technology-related initiatives and events and communicates those events to its membership. NITSL and LWRS Program researchers have been coordinating activities, including joint organization of NEWPER-related meetings and report development. The main goal of the NEWPER initiative was to develop a set of utility generic functional requirements for eWP systems. This set of requirements will support each utility in their process of identifying plant-specific functional and non-functional requirements. The NEWPER initiative has 140 members where the largest group of members consists of 19 commercial U.S. nuclear utilities and eleven of the most prominent vendors of eWP solutions. Through the NEWPER initiative two sets of functional requirements were developed; functional requirements for electronic work packages and functional requirements for computer-based procedures. This paper will describe the development process as well as a summary of the requirements.

  12. Smart Packaging Technologies and Their Application in Conventional Meat Packaging Systems

    Science.gov (United States)

    O'Grady, Michael N.; Kerry, Joseph P.

    Preservative packaging of meat and meat products should maintain acceptable appearance, odour and flavour and should delay the onset of microbial spoilage. Typically fresh red meats are placed on trays and over-wrapped with an oxygen permeable film or alternatively, meats are stored in modified atmosphere packages (MAP) containing high levels of oxygen and carbon dioxide (80% O2:20% CO2) (Georgala & Davidson, 1970). Cooked meats are usually stored in 70% N2:30% CO2 (Smiddy, Papkovsky, & Kerry, 2002). The function of oxygen in MAP is to maintain acceptable fresh meat colour and carbon dioxide inhibits the growth of spoilage bacteria (Seideman & Durland, 1984). Nitrogen is used as an inert filler gas either to reduce the proportions of the other gases or to maintain the pack shape (Bell & Bourke, 1996).

  13. Industrial applications of electron accelerators

    International Nuclear Information System (INIS)

    Singh, A.

    1994-01-01

    The interaction of high-energy radiation with organic systems produces very reactive, short-lived, ionic and free-radical species. The chemical changes brought about by these species are very useful in several systems, and are the basis of the growth of the electron processing industry. Some typical areas of the industrial use of electron accelerators are crosslinking wire and cable insulation, manufacturing heat shrink plastic items, curing coatings, and partially curing rubber products. Electron accelerators are also being considered in other areas such as sewage treatment, sterilizing medical disposables, and food irradiation. An emerging application of industrial electron accelerators is the production of advanced composites for the aerospace and other industries. Traditionally, the carbon-, aramid- and glass-fibre-reinforced composites with epoxy matrices are produced by thermal curing. However, equivalent composites with acrylated-epoxy matrices can be made by electron curing. Cost estimates suggest that electron curing could be more economical than thermal curing. Food irradiation has traditionally been an application for 60 Co γ-radiation. With the increasing demand for food irradiation in various countries, it may become necessary to use electron accelerators for this purpose. Since the dose rate during gamma and electron irradiation are generally very different, a review of the relevant work on the effect of dose rates has been done. This paper presents an overview of the industrial applications of electron accelerator for radiation processing, emphasises the electron curing of advanced composites and, briefly reviews the dose-rate effects in radiation processing of advanced composites and food irradiation. (author). 84 refs., 8 tabs

  14. Gelatin-Based Films and Coatings for Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Marina Ramos

    2016-09-01

    Full Text Available This review discusses the latest advances in the composition of gelatin-based edible films and coatings, including nanoparticle addition, and their properties are reviewed along their potential for application in the food packaging industry. Gelatin is an important biopolymer derived from collagen and is extensively used by various industries because of its technological and functional properties. Nowadays, a very wide range of components are available to be included as additives to improve its properties, as well as its applications and future potential. Antimicrobials, antioxidants and other agents are detailed due to the fact that an increasing awareness among consumers regarding healthy lifestyle has promoted research into novel techniques and additives to prolong the shelf life of food products. Thanks to its ability to improve global food quality, gelatin has been particularly considered in food preservation of meat and fish products, among others.

  15. Applications of the Discrete ordinates of Oak ridge System (DOORS) package to Nuclear Engineering problems

    Energy Technology Data Exchange (ETDEWEB)

    Azmy, Y.Y. [The Pennsylvania State University, 229 Reber Building, University Park, PA 16802 (United States)]. e-mail: yya3@psu.edu

    2004-07-01

    Particle transport problems are notorious for their difficulty. This fact requires that production level computer codes designed to address realistic engineering problems possess three important features: (i) high computational efficiency as measured by solution accuracy for a fixed computational cost; (ii) a wide variety of options to enhance robustness of the transport solver; and (iii) a broad collection of support codes that extend the reach of the transport solver to a wide variety of applications. The Discrete Ordinates of Oak Ridge System (DOORS) code package was designed with these features in mind. In this paper, capabilities of member codes in the DOORS package are overviewed with particular emphasis on two newly developed peripheral codes: BOT3P the mesh-generation and visualization code package, and GipGui the graphical user interface for the cross section manipulation code, GIP. Two large applications are used to illustrate the tight coupling between the peripheral codes and the DORT and TORT transport solvers in two and three dimensional geometries, respectively. These are: (i) criticality calculations for the C5G7MOX core benchmark; and (ii) dose distribution calculations for the Target Service Cell (TSC) of the Spallation Neutron Source (SNS). (Author)

  16. Applications of the Discrete ordinates of Oak ridge System (DOORS) package to Nuclear Engineering problems

    International Nuclear Information System (INIS)

    Azmy, Y.Y.

    2004-01-01

    Particle transport problems are notorious for their difficulty. This fact requires that production level computer codes designed to address realistic engineering problems possess three important features: (i) high computational efficiency as measured by solution accuracy for a fixed computational cost; (ii) a wide variety of options to enhance robustness of the transport solver; and (iii) a broad collection of support codes that extend the reach of the transport solver to a wide variety of applications. The Discrete Ordinates of Oak Ridge System (DOORS) code package was designed with these features in mind. In this paper, capabilities of member codes in the DOORS package are overviewed with particular emphasis on two newly developed peripheral codes: BOT3P the mesh-generation and visualization code package, and GipGui the graphical user interface for the cross section manipulation code, GIP. Two large applications are used to illustrate the tight coupling between the peripheral codes and the DORT and TORT transport solvers in two and three dimensional geometries, respectively. These are: (i) criticality calculations for the C5G7MOX core benchmark; and (ii) dose distribution calculations for the Target Service Cell (TSC) of the Spallation Neutron Source (SNS). (Author)

  17. A comparison and benchmark of two electron cloud packages

    Energy Technology Data Exchange (ETDEWEB)

    Lebrun, Paul L.G.; Amundson, James F; Spentzouris, Panagiotis G; Veitzer, Seth A

    2012-01-01

    We present results from precision simulations of the electron cloud (EC) problem in the Fermilab Main Injector using two distinct codes. These two codes are (i)POSINST, a F90 2D+ code, and (ii)VORPAL, a 2D/3D electrostatic and electromagnetic code used for self-consistent simulations of plasma and particle beam problems. A specific benchmark has been designed to demonstrate the strengths of both codes that are relevant to the EC problem in the Main Injector. As differences between results obtained from these two codes were bigger than the anticipated model uncertainties, a set of changes to the POSINST code were implemented. These changes are documented in this note. This new version of POSINST now gives EC densities that agree with those predicted by VORPAL, within {approx}20%, in the beam region. The root cause of remaining differences are most likely due to differences in the electrostatic Poisson solvers. From a software engineering perspective, these two codes are very different. We comment on the pros and cons of both approaches. The design(s) for a new EC package are briefly discussed.

  18. System-in-package RF design and applications

    CERN Document Server

    Gaynor, Michael P

    2006-01-01

    In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.

  19. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2005-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

  20. Effect of Morphology and Size of Halloysite Nanotubes on Functional Pectin Bionanocomposites for Food Packaging Applications.

    Science.gov (United States)

    Makaremi, Maziyar; Pasbakhsh, Pooria; Cavallaro, Giuseppe; Lazzara, Giuseppe; Aw, Yoong Kit; Lee, Sui Mae; Milioto, Stefana

    2017-05-24

    Pectin bionanocomposite films filled with various concentrations of two different types of halloysite nanotubes were prepared and characterized in this study as potential films for food packaging applications. The two types of halloysite nanotubes were long and thin (patch) (200-30 000 nm length) and short and stubby (Matauri Bay) (50-3000 nm length) with different morphological, physical, and dispersibility properties. Both matrix (pectin) and reinforcer (halloysite nanotubes) used in this study are considered as biocompatible, natural, and low-cost materials. Various characterization tests including Fourier transform infrared spectroscopy, field emission scanning electron microscopy, release kinetics, contact angle, and dynamic mechanical analysis were performed to evaluate the performance of the pectin films. Exceptional thermal, tensile, and contact angle properties have been achieved for films reinforced by patch halloysite nanotubes due to the patchy and lengthy nature of these tubes, which form a bird nest structure in the pectin matrix. Matauri Bay halloysite nanotubes were dispersed uniformly and individually in the matrix in low and even high halloysite nanotube concentrations. Furthermore, salicylic acid as a biocidal agent was encapsulated in the halloysite nanotubes lumen to control its release kinetics. On this basis, halloysite nanotubes/salicylic acid hybrids were dispersed into the pectin matrix to develop functional biofilms with antimicrobial properties that can be extended over time. Results revealed that shorter nanotubes (Matauri Bay) had better ability for the encapsulation of salicylic acid into their lumen, while patchy structure and longer tubes of patch halloysite nanotubes made the encapsulation process more difficult, as they might need more time and energy to be fully loaded by salicylic acid. Moreover, antimicrobial activity of the films against four different strains of Gram-positive and Gram-negative bacteria indicated the

  1. Industrial applications of electron accelerators

    CERN Document Server

    Cleland, M R

    2006-01-01

    This paper addresses the industrial applications of electron accelerators for modifying the physical, chemical or biological properties of materials and commercial products by treatment with ionizing radiation. Many beneficial effects can be obtained with these methods, which are known as radiation processing. The earliest practical applications occurred during the 1950s, and the business of radiation processing has been expanding since that time. The most prevalent applications are the modification of many different plastic and rubber products and the sterilization of single-use medical devices. Emerging applications are the pasteurization and preservation of foods and the treatment of toxic industrial wastes. Industrial accelerators can now provide electron energies greater than 10 MeV and average beam powers as high as 700 kW. The availability of high-energy, high-power electron beams is stimulating interest in the use of X-rays (bremsstrahlung) as an alternative to gamma rays from radioactive nuclides.

  2. Electronic circuits fundamentals & applications

    CERN Document Server

    Tooley, Mike

    2015-01-01

    Electronics explained in one volume, using both theoretical and practical applications.New chapter on Raspberry PiCompanion website contains free electronic tools to aid learning for students and a question bank for lecturersPractical investigations and questions within each chapter help reinforce learning Mike Tooley provides all the information required to get to grips with the fundamentals of electronics, detailing the underpinning knowledge necessary to appreciate the operation of a wide range of electronic circuits, including amplifiers, logic circuits, power supplies and oscillators. The

  3. Analysis of Design of Mixed-Signal Electronic Packaging

    National Research Council Canada - National Science Library

    Pileggi, Lawrence

    1999-01-01

    The objective of this project is to develop innovative algorithms and prototype tools that will help facilitate the design of mixed signal multi-chip modules and packaging in a manner that is similar...

  4. Intelligent food packaging - research and development

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2015-03-01

    Full Text Available Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packaging refers to a package that can sense environmental changes, and in turn, informs the users about the changes. These packaging systems contain devices that are capable of sensing and providing information about the functions and properties of the packaged foods. Also, this paper will review intelligent packaging technologies and describe different types of indicators (time-temperature indicators, freshness indicators.

  5. Food Nanotechnology - Food Packaging Applications

    Science.gov (United States)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part, the impetus for this predicted growth is the ...

  6. Interactive orbit control package for INDUS-2 storage ring

    International Nuclear Information System (INIS)

    Walia, A.A.S.; Ghodke, A.D.; Fatnani, Pravin; Bhujle, A.G.; Singh, Gurnam

    2003-01-01

    Maintaining the proper electron beam orbit is very important for all light sources. This package designed in Meatball provides for orbit control by just drag and drop. Simulation of Indus-2 storage ring in this package makes it useful for beam dynamic studies as well. Package functionality and architecture is described. (author)

  7. Interactive orbit control package for INDUS-2 storage ring

    Energy Technology Data Exchange (ETDEWEB)

    Walia, A A.S.; Ghodke, A D; Fatnani, Pravin; Bhujle, A G; Singh, Gurnam [Centre for Advanced Technology, Indore (India)

    2003-07-01

    Maintaining the proper electron beam orbit is very important for all light sources. This package designed in Meatball provides for orbit control by just drag and drop. Simulation of Indus-2 storage ring in this package makes it useful for beam dynamic studies as well. Package functionality and architecture is described. (author)

  8. Intelligent food packaging - research and development

    OpenAIRE

    Renata Dobrucka; Ryszard Cierpiszewski; Andrzej Korzeniowski

    2015-01-01

    Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packa...

  9. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2003-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the WIPP management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document provides the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

  10. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2002-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT Shipping Package, and directly related components. This document complies with the minimum requirements as specified in TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event there is a conflict between this document and the SARP or C of C, the SARP and/or C of C shall govern. C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SAR P charges the WIPP Management and Operation (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize these operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

  11. Integrated microsystems packaging approach with LCP

    Science.gov (United States)

    Jaynes, Paul; Shacklette, Lawrence W.

    2006-05-01

    Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

  12. Electron accelerators: History, applications, and perspectives

    Science.gov (United States)

    Martins, M. N.; Silva, T. F.

    2014-02-01

    This paper will present an outlook on sources of radiation, focusing on electron accelerators. We will review advances that were important for the development of particle accelerators, concentrating on those that led to modern electron accelerators. Electron accelerators are multipurpose machines that deliver beams with energies spanning five orders of magnitude, and are used in applications that range from fundamental studies of particle interactions to cross-linking polymer chains in industrial plants. Each accelerator type presents specific characteristics that make it more suitable for certain applications. Our work will focus on radiation sources for medical applications, dominated by electron linacs (linear accelerators), and those used for research, field where electron rings dominate. We will outline the main technological advances that occurred in the past decades, which made possible the construction of machines fit for clinical environments. Their compactness, efficiency and reliability have been key to their acceptance in clinical applications. This outline will include advances that allowed for the construction of brighter synchrotron light sources, where the relevant beam characteristics are good optical quality and high beam current. The development of insertion devices will also be discussed, as well the development of Free Electron Lasers (FEL). We conclude the review with an outline of the new developments of electron accelerators and the expectations for Energy Recovery Linacs.

  13. Electron accelerators: History, applications, and perspectives

    International Nuclear Information System (INIS)

    Martins, M.N.; Silva, T.F.

    2014-01-01

    This paper will present an outlook on sources of radiation, focusing on electron accelerators. We will review advances that were important for the development of particle accelerators, concentrating on those that led to modern electron accelerators. Electron accelerators are multipurpose machines that deliver beams with energies spanning five orders of magnitude, and are used in applications that range from fundamental studies of particle interactions to cross-linking polymer chains in industrial plants. Each accelerator type presents specific characteristics that make it more suitable for certain applications. Our work will focus on radiation sources for medical applications, dominated by electron linacs (linear accelerators), and those used for research, field where electron rings dominate. We will outline the main technological advances that occurred in the past decades, which made possible the construction of machines fit for clinical environments. Their compactness, efficiency and reliability have been key to their acceptance in clinical applications. This outline will include advances that allowed for the construction of brighter synchrotron light sources, where the relevant beam characteristics are good optical quality and high beam current. The development of insertion devices will also be discussed, as well the development of Free Electron Lasers (FEL). We conclude the review with an outline of the new developments of electron accelerators and the expectations for Energy Recovery Linacs. - Highlights: ► We present an outlook on sources of radiation, focusing on electron accelerators. ► We review important advances for the development of modern electron accelerators. ► We outline advances that allowed for brighter synchrotron light sources. ► We describe the history of the development of electron accelerators in Brazil

  14. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2006-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  15. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2007-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  16. GT-SUPREEM: the Georgia Tech summer undergraduate packaging research and engineering experience for minorities

    Science.gov (United States)

    May, Gary S.

    1996-07-01

    The Georgia Tech SUmmer Undergraduate Packaging Research and Engineering Experience for Minorities (GT-SUPREEM) is an eight-week summer program designed to attract qualified minority students to pursue graduate degrees in packaging- related disciplines. The program is conducted under the auspices of the Georgia Tech Engineering Research Center in Low-Cost Electronic Packaging, which is sponsored by the National Science Foundation. In this program, nine junior and senior level undergraduate students are selected on a nationwide basis and paired with a faculty advisor to undertake research projects in the Packaging Research CEnter. The students are housed on campus and provided with a $DLR3,000 stipend and a travel allowance. At the conclusion of the program, the students present both oral and written project summaries. It is anticipated that this experience will motivate these students to become applicants for graduate study in ensuring years. This paper will provide an overview of the GT-SUPREEM program, including student research activities, success stories, lessons learned, and overall program outlook.

  17. Control of lipid oxidation by nonmigratory active packaging films prepared by photoinitiated graft polymerization.

    Science.gov (United States)

    Tian, Fang; Decker, Eric A; Goddard, Julie M

    2012-08-08

    Transition metal-promoted oxidation impacts the quality, shelf life, and nutrition of many packaged foods. Metal-chelating active packaging therefore offers a means to protect foods against oxidation. Herein, we report the development and characterization of nonmigratory metal-chelating active packaging. To prepare the films, carboxylic acids were grafted onto the surfaces of polypropylene films by photoinitiated graft polymerization of acrylic acid. Attenuated total reflectance/Fourier transform infrared spectroscopy, contact angle, scanning electron microscopy, and iron-chelating assay were used to characterize film properties. Graft polymerization yielded a carboxylic acid density of 68.67 ± 9.99 nmol per cm(2) film, with ferrous iron-chelating activity of 71.07 ± 12.95 nmol per cm(2). The functionalized films extended the lag phase of lipid oxidation in a soybean oil-in-water emulsion system from 2 to 9 days. The application of such nonmigratory active packaging films represents a promising approach to reduce additive use while maintaining food quality.

  18. Effects of health-oriented descriptors on combustible cigarette and electronic cigarette packaging: an experiment among adult smokers in the United States.

    Science.gov (United States)

    Sanders-Jackson, Ashley; Tan, Andy S L; Yie, Kyeungyeun

    2017-10-05

    Certain tobacco companies use health-oriented descriptors (eg, 100% organic) on product packaging and advertising of combustible cigarettes or electronic cigarettes (e-cigarettes) that create a 'health halo' around smoking and vaping. Previous observational research suggests that such language may be associated with more favourable attitudes and reduced risk perceptions toward these brands compared with others. This study aimed to determine the effects of health-oriented descriptors on smokers' attitude toward the brand, perception of packaging information, comparative harm versus other brands and intention to purchase either combustible cigarettes or e-cigarettes. US adult smokers were randomly assigned to view either a health-oriented language package ('100% organic,' 'all natural' or 'no additives'), traditional marketing language package ('fine quality,' 'premium blend' or '100% original') or a no-language package of a combustible cigarette brand (Study 1, n=405) or an e-cigarette brand (Study 2, n=396) in an experimental design. Study 1: Participants in the health-oriented condition reported more favourable perceptions toward the package information, lower comparative harm and higher intention to purchase combustible cigarettes versus the no language control. In addition, participants in the health-oriented condition reported more positive attitude toward the brand and lower comparative harm versus the traditional marketing condition. Study 2: Compared with the traditional marketing condition, participants in the health-oriented condition reported greater intention to purchase Absolute e-cigarettes. There were no significant differences in attitude toward the brand, perception of packaging information and comparative harm versus other brands across conditions. The effect of health-oriented language was significant for combustible cigarettesand e-cigarette packages. Policies to restrict health-oriented language on cigarette and e-cigarette packaging are

  19. A Kinetic Model for Predicting the Relative Humidity in Modified Atmosphere Packaging and Its Application in Lentinula edodes Packages

    Directory of Open Access Journals (Sweden)

    Li-xin Lu

    2013-01-01

    Full Text Available Adjusting and controlling the relative humidity (RH inside package is crucial for ensuring the quality of modified atmosphere packaging (MAP of fresh produce. In this paper, an improved kinetic model for predicting the RH in MAP was developed. The model was based on heat exchange and gases mass transport phenomena across the package, gases heat convection inside the package, and mass and heat balances accounting for the respiration and transpiration behavior of fresh produce. Then the model was applied to predict the RH in MAP of fresh Lentinula edodes (one kind of Chinese mushroom. The model equations were solved numerically using Adams-Moulton method to predict the RH in model packages. In general, the model predictions agreed well with the experimental data, except that the model predictions were slightly high in the initial period. The effect of the initial gas composition on the RH in packages was notable. In MAP of lower oxygen and higher carbon dioxide concentrations, the ascending rate of the RH was reduced, and the RH inside packages was saturated slowly during storage. The influence of the initial gas composition on the temperature inside package was not much notable.

  20. Scattered radiation from applicators in clinical electron beams

    International Nuclear Information System (INIS)

    Battum, L J van; Zee, W van der; Huizenga, H

    2003-01-01

    In radiotherapy with high-energy (4-25 MeV) electron beams, scattered radiation from the electron applicator influences the dose distribution in the patient. In most currently available treatment planning systems for radiotherapy this component is not explicitly included and handled only by a slight change of the intensity of the primary beam. The scattered radiation from an applicator changes with the field size and distance from the applicator. The amount of scattered radiation is dependent on the applicator design and on the formation of the electron beam in the treatment head. Electron applicators currently applied in most treatment machines are essentially a set of diaphragms, but still do produce scattered radiation. This paper investigates the present level of scattered dose from electron applicators, and as such provides an extensive set of measured data. The data provided could for instance serve as example input data or benchmark data for advanced treatment planning algorithms which employ a parametrized initial phase space to characterize the clinical electron beam. Central axis depth dose curves of the electron beams have been measured with and without applicators in place, for various applicator sizes and energies, for a Siemens Primus, a Varian 2300 C/D and an Elekta SLi accelerator. Scattered radiation generated by the applicator has been found by subtraction of the central axis depth dose curves, obtained with and without applicator. Scattered radiation from Siemens, Varian and Elekta electron applicators is still significant and cannot be neglected in advanced treatment planning. Scattered radiation at the surface of a water phantom can be as high as 12%. Scattered radiation decreases almost linearly with depth. Scattered radiation from Varian applicators shows clear dependence on beam energy. The Elekta applicators produce less scattered radiation than those of Varian and Siemens, but feature a higher effective angular variance. The scattered

  1. Structure and Properties of Chitin Whisker Reinforced Papers for Food Packaging Application

    Directory of Open Access Journals (Sweden)

    Zhihan Li

    2015-04-01

    Full Text Available In recent years, concerns about environmental waste caused by petroleum-derived chemicals as well as the consumer's demand for high quality food products, have prompted people to pay more attention to developing biodegradable food packaging materials using natural resources such as cellulose fibers and chitin derivatives. In this study, chitin whiskers have been successfully generated by hydrolyzing the α-chitin sample. Then the synthesized nano-sized chitin whiskers were used at ratios from 0.1% to 2% (wt% for improving strength properties of paper sheets by the dip-coating method. Transmission electron microscopy (TEM and field emission scanning electron microscopy (FE-SEM were used to investigate the morphology of chitin whiskers and cellulose fiber compounds. The results showed that coating with chitin whiskers brought about an increase in tear strength, burst strength, and wet and dry tensile strength, with a decrease in Zeta-potential value.

  2. Radiation treatment for sterilization of packaging materials

    International Nuclear Information System (INIS)

    Haji-Saeid, Mohammad; Sampa, Maria Helena O.; Chmielewski, Andrzej G.

    2007-01-01

    Treatment with gamma and electron radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in the aseptic processing of foods and pharmaceuticals. The effect of irradiation on these materials is crucial for packaging engineering to understand the effects of these new treatments. Packaging material may be irradiated either prior to or after filling. The irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceutical, and medical device industries in the United States, Europe, and Canada. Radiation effects on packaging material properties still need further investigation. This paper summarizes the work done by different groups and discusses recent developments in regulations and testing procedures in the field of packaging technology

  3. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends.

    Science.gov (United States)

    Murray, Kieran A; Kennedy, James E; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L

    2014-06-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. Copyright © 2014. Published by Elsevier B.V.

  4. Packaging for consumer electronic products: The need for integrating design and engineering

    OpenAIRE

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of packaging for CE goods would imply a process that takes into account all requirements, whether they are technical, financial, environmental or psychological in nature, and that also incorporates the rel...

  5. Effects of electron beam radiation on mechanical properties and on the resistance to punctures caused by Plodia interpunctella in cereal bar packaging

    International Nuclear Information System (INIS)

    Alves, Juliana N.; Moura, Esperidiana A.B.; Oliveira, Vitor M.; Potenza, Marcos R.; Arthur, Valter

    2009-01-01

    Plodia interpunctella is an important pest in stored products in the tropical and subtropical regions, infesting grains and flours. The adult of P. interpunctella is a small butterfly with about 15 - 20mm of spread and the female places separately of 100 the 400 eggs in groups on the grains whose hard incubation some days. This insect infesting diverse types of food packaging, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by P. interpunctella in BOPPmet/BOPP structure, used commercially as cereal bar packaging, after electron beam irradiation. The material samples were irradiated up to 120 kGy using a 1.5 MeV electrostatic accelerator, at room temperature, in air, dose rate 11.22 kGy/s. Irradiation doses were measured using cellulose triacetate film dosimeters 'CTA-FTR-125' from Fuji Photo Film Co. Ltd. After irradiation the BOPPmet/BOPP samples were subjected to tests of puncture resistance by P. interpunctella, tensile tests and penetration resistance. The results showed significant decreases (p<0.05) in the original mechanical properties of the structures according to the radiation doses applied and effective resistance against punctures by P. interpunctella for irradiated and nonirradiated BOPPmet/BOPP samples. These results indicate that non-irradiated and irradiated BOPPmet/BOPP structure presents puncture resistance against P. interpunctella and that electron-beam irradiation, in conditions studied in this work, may turn the structure inappropriate for cereal bar packaging, due to high reduction its mechanical properties after irradiation. (author)

  6. Novel food packaging systems with natural antimicrobial agents.

    Science.gov (United States)

    Irkin, Reyhan; Esmer, Ozlem Kizilirmak

    2015-10-01

    A new type of packaging that combines food packaging materials with antimicrobial substances to control microbial surface contamination of foods to enhance product microbial safety and to extend shelf-life is attracting interest in the packaging industry. Several antimicrobial compounds can be combined with different types of packaging materials. But in recent years, since consumer demand for natural food ingredients has increased because of safety and availability, these natural compounds are beginning to replace the chemical additives in foods and are perceived to be safer and claimed to alleviate safety concerns. Recent research studies are mainly focused on the application of natural antimicrobials in food packaging system. Biologically derived compounds like bacteriocins, phytochemicals, enzymes can be used in antimicrobial food packaging. The aim of this review is to give an overview of most important knowledge about application of natural antimicrobial packagings with model food systems and their antimicrobial effects on food products.

  7. Emotional response towards food packaging

    DEFF Research Database (Denmark)

    Liao, Lewis Xinwei; Corsi, Armando M.; Chrysochou, Polymeros

    2015-01-01

    In this paper we investigate consumers’ emotional responses to food packaging. More specifically, we use self-report and physiological measures to jointly assess emotional responses to three typical food packaging elements: colours (lowwavelength vs. high-wavelength), images (positive vs. negative...... response that can only be measured by self-report measures. We propose that a joint application of selfreport and physiological measures can lead to richer information and wider interpretation of consumer emotional responses to food packaging elements than using either measure alone....

  8. State of the Art of Antimicrobial Edible Coatings for Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Arantzazu Valdés

    2017-04-01

    Full Text Available The interest for the development of new active packaging materials has rapidly increased in the last few years. Antimicrobial active packaging is a potential alternative to protect perishable products during their preparation, storage and distribution to increase their shelf-life by reducing bacterial and fungal growth. This review underlines the most recent trends in the use of new edible coatings enriched with antimicrobial agents to reduce the growth of different microorganisms, such as Gram-negative and Gram-positive bacteria, molds and yeasts. The application of edible biopolymers directly extracted from biomass (proteins, lipids and polysaccharides or their combinations, by themselves or enriched with natural extracts, essential oils, bacteriocins, metals or enzyme systems, such as lactoperoxidase, have shown interesting properties to reduce the contamination and decomposition of perishable food products, mainly fish, meat, fruits and vegetables. These formulations can be also applied to food products to control gas exchange, moisture permeation and oxidation processes.

  9. Poly(Neopentyl Glycol Furanoate): A Member of the Furan-Based Polyester Family with Smart Barrier Performances for Sustainable Food Packaging Applications

    OpenAIRE

    Laura Genovese; Nadia Lotti; Valentina Siracusa; Andrea Munari

    2017-01-01

    In the last decade, there has been an increased interest from the food packaging industry toward the development and application of bioplastics, to contribute to the sustainable economy and to reduce the huge environmental problem afflicting the planet. In the present work, we focus on a new furan-based polyester, poly(neopentyl glycol 2,5-furanoate) (PNF) to be used for sustainable food packaging applications. The aromatic polyester was successfully synthesized with high molecular weight, th...

  10. Food packaging and radiation sterilization

    International Nuclear Information System (INIS)

    Kawamura, Yoko

    1998-01-01

    Radiation sterilization has several merits that it is a positively effective sterilization method, it can be used to sterilize low heat-resistant containers and high gas barrier films, and there is no possibility of residual chemicals being left in the packages. It has been commercially used in 'Bag in a Box' and some food containers. The γ ray and an electron beam are commonly used in radiation sterilization. The γ ray can sterilize large size containers and containers with complex shapes or sealed containers due to its strong transmission capability. However, since the equipment tends to be large and expensive, it is generally used in off production lines. On the other hand, it is possible to install and electron beam system on food production lines since the food can be processed in a short time due to its high beam coefficient and its ease of maintenance, even though an electron beam has limited usage such as sterilizing relatively thin materials and surface sterilization due to the weak transmission. A typical sterilization dose is approximately 10-30 kGy. Direct effects impacting packaging materials, particularly plastics, include scission of polymer links, cross-linkage between polymers, and generating radiolysis products such as hydrogen, methane, aliphatic hydrocarbons, etc. Furthermore, under the existence of oxygen, the oxygen radicals generated by the radiation will oxidize and peroxidize polymer chains and will generate alcohol and carbonyl groups, which shear polymer links, and generate oxygen containing low molecular compounds. As a result, degradation of physical strength such as elongation and seal strength, generating foreign odor, and an increase in global migration values shown in an elution test are sometimes evident. The food packages have different shapes, materials, additives, number of microorganisms and purpose. Therefor the effects of radiation, the optimum dose and so on must be investigated on the individual package. (J.P.N.)

  11. Light Barrier for Non-Foil Packaging

    Science.gov (United States)

    2010-12-16

    foil and all-plastic materials were retorted and a second set of all-plastic packaged entrees were Microwave Sterilized on the Washington State...Copolymers for Retort Applications; SPE Polyolefins and Flexible Packaging Conference: Society of Plastics Engineers. Newtown. CT, 43pp. Thellen C...Final Scientific Report Light Barrier for Non-Foil Packaging Contract No. W911QY-08-C-0132 Final Scientific Report Contract No. W911QY-08-C-0132

  12. ANTIMICROBIALS USED IN ACTIVE PACKAGING FILMS

    OpenAIRE

    Dıblan, Sevgin; Kaya, Sevim

    2017-01-01

    Active packaging technology is one of the innovativemethods for preserving of food products, and antimicrobial packaging films is amajor branch and promising application of this technology. In order to controlmicrobial spoilage and also contamination of pathogen onto processed or fresh food,antimicrobial agent(s) is/are incorporated into food packaging structure.Polymer type as a carrier of antimicrobial can be petroleum-based plastic orbiopolymer: because of environmental concerns researcher...

  13. Low voltage electron beam accelerators

    International Nuclear Information System (INIS)

    Ochi, Masafumi

    2003-01-01

    Widely used electron accelerators in industries are the electron beams with acceleration voltage at 300 kV or less. The typical examples are shown on manufactures in Japan, equipment configuration, operation, determination of process parameters, and basic maintenance requirement of the electron beam processors. New electron beam processors with acceleration voltage around 100 kV were introduced maintaining the relatively high dose speed capability of around 10,000 kGy x mpm at production by ESI (Energy Science Inc. USA, Iwasaki Electric Group). The application field like printing and coating for packaging requires treating thickness of 30 micron or less. It does not require high voltage over 110 kV. Also recently developed is a miniature bulb type electron beam tube with energy less than 60 kV. The new application area for this new electron beam tube is being searched. The drive force of this technology to spread in the industries would be further development of new application, process and market as well as the price reduction of the equipment, upon which further acknowledgement and acceptance of the technology to societies and industries would entirely depend. (Y. Tanaka)

  14. Low voltage electron beam accelerators

    Energy Technology Data Exchange (ETDEWEB)

    Ochi, Masafumi [Iwasaki Electric Co., Ltd., Tokyo (Japan)

    2003-02-01

    Widely used electron accelerators in industries are the electron beams with acceleration voltage at 300 kV or less. The typical examples are shown on manufactures in Japan, equipment configuration, operation, determination of process parameters, and basic maintenance requirement of the electron beam processors. New electron beam processors with acceleration voltage around 100 kV were introduced maintaining the relatively high dose speed capability of around 10,000 kGy x mpm at production by ESI (Energy Science Inc. USA, Iwasaki Electric Group). The application field like printing and coating for packaging requires treating thickness of 30 micron or less. It does not require high voltage over 110 kV. Also recently developed is a miniature bulb type electron beam tube with energy less than 60 kV. The new application area for this new electron beam tube is being searched. The drive force of this technology to spread in the industries would be further development of new application, process and market as well as the price reduction of the equipment, upon which further acknowledgement and acceptance of the technology to societies and industries would entirely depend. (Y. Tanaka)

  15. Nanocellulose in green food packaging.

    Science.gov (United States)

    Vilarinho, Fernanda; Sanches Silva, Ana; Vaz, M Fátima; Farinha, José Paulo

    2017-01-26

    The development of packaging materials with new functionalities and lower environmental impact is now an urgent need of our society. On one hand, the shelf-life extension of packaged products can be an answer to the exponential increase of worldwide demand for food. On the other hand, uncertainty of crude oil prices and reserves has imposed the necessity to find raw materials to replace oil-derived polymers. Additionally, consumers' awareness toward environmental issues increasingly pushes industries to look with renewed interest to "green" solutions. In response to these issues, numerous polymers have been exploited to develop biodegradable food packaging materials. Although the use of biopolymers has been limited due to their poor mechanical and barrier properties, these can be enhanced by adding reinforcing nanosized components to form nanocomposites. Cellulose is probably the most used and well-known renewable and sustainable raw material. The mechanical properties, reinforcing capabilities, abundance, low density, and biodegradability of nanosized cellulose make it an ideal candidate for polymer nanocomposites processing. Here we review the potential applications of cellulose based nanocomposites in food packaging materials, highlighting the several types of biopolymers with nanocellulose fillers that have been used to form bio-nanocomposite materials. The trends in nanocellulose packaging applications are also addressed.

  16. Polylactic acid/zinc oxide biocomposite films for food packaging application.

    Science.gov (United States)

    Marra, Antonella; Silvestre, Clara; Duraccio, Donatella; Cimmino, Sossio

    2016-07-01

    Although PLA is much more expensive than polyolefins, such as PP and PE, there is a great interest to propose PLA based material as alternative films for food packaging being PLA derivable from natural source, compostable and biodegradable. For this purpose the research has the task to investigate and propose PLA materials with enhanced properties to be effectively and efficiently alternative to polyolefin films for food packaging application. In this contribution, biocomposite films of PLA with 1, 3 and 5wt% of ZnO have been investigated to determine mechanical, barrier and antimicrobial (against Escherichia coli) properties. It is found that the biocomposite films are characterized by a good dispersion of the ZnO particles in PLA matrix, although no previous treatment was performed on ZnO particles, such as silanization, to decrease its incompatibility with the polymer. The biocomposite films have shown good mechanical properties, decrease of permeability to CO2 and O2, and only a slight increase to water vapour. Particularly important is that, for the biocomposite with 5wt% of ZnO, the % Reduction for E. Coli test reached the value of 99.99 already after 24h. Copyright © 2016 Elsevier B.V. All rights reserved.

  17. Availability, Price, and Packaging of Electronic Cigarettes and E-Liquids in Guatemala City Retailers.

    Science.gov (United States)

    Chacon, Violeta; Arriaza, Astrid; Cavazos-Rehg, Patricia; Barnoya, Joaquin

    2018-01-05

    Electronic cigarettes (e-cigarettes) have the potential to normalize smoking and undermine tobacco control efforts. However, if well regulated, they also have a potential as smoking cessation aids. This study sought to determine the availability and types of e-cigarettes and e-liquids in Guatemala. We also assessed packaging characteristics and price. We surveyed a convenient sample of 39 Guatemala City retailers and purchased all e-cigarettes and e-liquids available. Duplicate samples (same brand, e-liquid type, flavor, nicotine content, or packaging) were purchased when prices were different between each other. Country of manufacture, flavor, expiration date, nicotine concentration, and price were recorded. We also documented package marketing strategies and warning labels. We purchased 64 e-cigarettes (53 unique and 11 duplicates) and 57 e-liquids (52 unique and 5 duplicates), mostly found on mall retailers. Most e-cigarettes (42, 66%) were first generation, followed by second (18, 28%) and third generations (4, 6%). Price of e-cigarettes differed significantly by generation. Most e-cigarettes (31, 58%) and 24 (46%) e-liquids did not include warning labels. Nicotine content was reported in 21 (39%) e-cigarettes that included e-liquids and 41 (79%) e-liquids' packages. E-cigarettes and e-liquids are available among a variety of retailers in Guatemala City and the industry is taking advantage of the fact that they are not regulated (eg, health claims, minimum sales age, and taxation). Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. To the best of our knowledge, this is the first study describing e-cigarettes and e-liquids available in retailers in a low/middle-income country like Guatemala. E-cigarettes and e-liquids were found in a variety of types, flavors, and nicotine concentrations in Guatemalan retailers. Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. © The Author

  18. Novel silver-based nanoclay as an antimicrobial in polylactic acid food packaging coatings.

    Science.gov (United States)

    Busolo, Maria A; Fernandez, Patricia; Ocio, Maria J; Lagaron, Jose M

    2010-11-01

    This paper presents a comprehensive performance study of polylactic acid (PLA) biocomposites, obtained by solvent casting, containing a novel silver-based antimicrobial layered silicate additive for use in active food packaging applications. The silver-based nanoclay showed strong antimicrobial activity against Gram-negative Salmonella spp. Despite the fact that no exfoliation of the silver-based nanoclay in PLA was observed, as suggested by transmission electron microscopy (TEM) and wide angle X-ray scattering (WAXS) experiments, the additive dispersed nicely throughout the PLA matrix to a nanoscale, yielding nanobiocomposites. The films were highly transparent with enhanced water barrier and strong biocidal properties. Silver migration from the films to a slightly acidified water medium, considered an aggressive food simulant, was measured by stripping voltammetry. Silver migration accelerated after 6 days of exposure. Nevertheless, the study suggests that migration levels of silver, within the specific migration levels referenced by the European Food Safety Agency (EFSA), exhibit antimicrobial activity, supporting the potential application of this biocidal additive in active food-packaging applications to improve food quality and safety.

  19. Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

    Energy Technology Data Exchange (ETDEWEB)

    Devoto, D.

    2014-11-01

    The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.

  20. IN-PACKAGE CHEMISTRY ABSTRACTION

    Energy Technology Data Exchange (ETDEWEB)

    E. Thomas

    2005-07-14

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

  1. IN-PACKAGE CHEMISTRY ABSTRACTION

    International Nuclear Information System (INIS)

    E. Thomas

    2005-01-01

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H 2 O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package

  2. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2009-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  3. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2008-01-01

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the 'RH-TRU 72-B cask') and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous

  4. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2006-01-01

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 Code of Federal Regulations (CFR) 1.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these

  5. Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

    Science.gov (United States)

    Ren, Huai-Hui; Wang, Xi-Shu

    2014-04-01

    This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

  6. Application of nano-packaging in aquatics

    Directory of Open Access Journals (Sweden)

    D Jafarpour

    2018-03-01

    Conclusion: With regard to aquatics high nutritional value and their important presence in diet one should think of a way to increase it's survivability and maintaining quality. For this, nano technology can help packaging aquatics. Nano can be applied considerably in food health and environment protection.

  7. Aluminium oxide barrier films on polymeric web and their conversion for packaging applications

    OpenAIRE

    Struller, CF; Kelly, PJ; Copeland, NJ; Tobin, V; Assender, HE; Holliday, CW; Read, SJ

    2013-01-01

    In recent years, inorganic transparent barrier layers such as aluminium oxide or silicon oxide deposited onto polymer films have emerged as an attractive alternative to polymer based transparent barrier layers for flexible food packaging materials. For this application, barrier properties against water vapour and oxygen are critical. Aluminium oxide coatings can provide good barrier levels at thicknesses in the nanometre range, compared to several micrometres for polymer-based barrier layers....

  8. Technology and applications of electron accelerator

    International Nuclear Information System (INIS)

    Natsir, M.

    1998-01-01

    Technology of electron accelerator have been developed so fast in advanced countries. It was applied in the research and development (R and D) and comercially in various industries. The industries applying electron accelerator includes polymers industry, sterilization of medical tools, material surface modification, and environmental management. The radiation process using electron beam is an ionization radiation process. Two facilities of electron accelerator have been established in pilot scale at the Centre for the Application of Isotope and Radiation CAIR-BATAN, Jakarta, for the RandD of radiation process technology and in demonstrating the electron accelerator application in industry in Indonesia. The first has low energy specification of 300 keV, 50 mA, EPS-300 type and the second has medium energy specification of 2 MeV, 10 mA dynamitron model GJ-2 type. Both the electron accelerators have an electron penetration depth capability of 0.6 and 12 mm, respectively, for the double side irradiation in the materials with density of 1 g/cm 3 . They also highly capacity production and electron beam cross-section of 120 cm length and 10 cm width. The beam will go through the atmosphere for irradiation samples or industrial products. The radiation dose can be selected precisely by adjusting the electron beam current and conveyor speed. Both of these facilities were applied in many aspects RandD, for examples dosimetry, wood surface coating, cross-linking of polymer, heatshrincable tube, polymer grafting, plastic degradation, food preservation, sterilization and so on. Engineering factors of radiation design process and general observation of electron accelerator application in RandD for various industries in Indonesia are briefly discussed

  9. Transportation package design using numerical optimization

    International Nuclear Information System (INIS)

    Harding, D.C.; Witkowski, W.R.

    1991-01-01

    The purpose of this overview is twofold: first, to outline the theory and basic elements of numerical optimization; and second, to show how numerical optimization can be applied to the transportation packaging industry and used to increase efficiency and safety of radioactive and hazardous material transportation packages. A more extensive review of numerical optimization and its applications to radioactive material transportation package design was performed previously by the authors (Witkowski and Harding 1992). A proof-of-concept Type B package design is also presented as a simplified example of potential improvements achievable using numerical optimization in the design process

  10. Electron-processing technology: A promising application for the viscose industry

    Science.gov (United States)

    Stepanik, T. M.; Rajagopal, S.; Ewing, D.; Whitehouse, R.

    1998-06-01

    In marketing its IMPELA ® line of high power, high-throughput industrial accelerators, Atomic Energy of Canada Limited (AECL) is working with viscose (rayon) companies world-wide to integrate electron-processing technology as part of the viscose manufacturing process. The viscose industry converts cellulose wood pulp into products such as staple fiber, filament, cord, film, packaging, and non-edible sausage casings. This multibillion dollar industry is currently suffering from high production costs, and is facing increasingly stringent environmental regulations. The use of electron-treated pulp can significantly lower production costs and can provide equally significant environmental benefits. This paper describes our current understanding of the benefits of using electron-treated pulp in this process, and AECL's efforts in developing this technology.

  11. Thermal performance of a PCB embedded pulsating heat pipe for power electronics applications

    International Nuclear Information System (INIS)

    Kearney, Daniel J.; Suleman, Omar; Griffin, Justin; Mavrakis, Georgios

    2016-01-01

    Highlights: • Planar, compact PCB embedded pulsating heat pipe for heat spreading applications. • Embedded heat pipe operates at sub-ambient pressure with environmentally. • Compatible fluids. • Range of optimum operating conditions, orientations and fill ratios identified. - Abstract: Low voltage power electronics applications (<1.2 kV) are pushing the design envelope towards increased functionality, better reliability, low profile and reduced cost. One packaging method to enable these constraints is the integration of active power electronic devices into the printed circuit board improving electrical and thermal performance. This development requires a reliable passive thermal management solution to mitigate hot spots due to the increased heat flux density. To this end, a 44 channel open looped pulsating heat pipe (OL-PHP) is experimentally investigated for two independent dielectric working fluids – Novec"T"M 649 and Novec"T"M 774 – due to their lower pressure operation and low global warming potential compared to traditional two-phase coolants. The OL-PHP is investigated in vertical (90°) orientation with fill ratios ranging from 0.30 to 0.70. The results highlight the steady state operating conditions for each working fluid with instantaneous plots of pressure, temperature, and thermal resistance; the minimum potential bulk thermal resistance for each fill ratio and the effective thermal conductivity achievable for the OL-PHP.

  12. Electron-molecule interactions and their applications

    CERN Document Server

    Christophorou, L G

    1984-01-01

    Electron-Molecule Interactions and Their Applications, Volume 2 provides a balanced and comprehensive account of electron-molecule interactions in dilute and dense gases and liquid media. This book consists of six chapters. Chapter 1 deals with electron transfer reactions, while Chapter 2 discusses electron-molecular positive-ion recombination. The electron motion in high-pressure gases and electron-molecule interactions from single- to multiple-collision conditions is deliberated in Chapter 3. In Chapter 4, knowledge on electron-molecule interactions in gases is linked to that on similar proc

  13. Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

    Science.gov (United States)

    Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S. R.; Silveira, Carlos G.; Rela, Paulo R.

    2012-08-01

    The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO2 and NOX removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and

  14. Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

    International Nuclear Information System (INIS)

    Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S.R.; Silveira, Carlos G.

    2012-01-01

    The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO 2 and NO X removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and

  15. Packaging for consumer electronic products : The need for integrating design and engineering

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of

  16. DensToolKit: A comprehensive open-source package for analyzing the electron density and its derivative scalar and vector fields

    Science.gov (United States)

    Solano-Altamirano, J. M.; Hernández-Pérez, Julio M.

    2015-11-01

    DensToolKit is a suite of cross-platform, optionally parallelized, programs for analyzing the molecular electron density (ρ) and several fields derived from it. Scalar and vector fields, such as the gradient of the electron density (∇ρ), electron localization function (ELF) and its gradient, localized orbital locator (LOL), region of slow electrons (RoSE), reduced density gradient, localized electrons detector (LED), information entropy, molecular electrostatic potential, kinetic energy densities K and G, among others, can be evaluated on zero, one, two, and three dimensional grids. The suite includes a program for searching critical points and bond paths of the electron density, under the framework of Quantum Theory of Atoms in Molecules. DensToolKit also evaluates the momentum space electron density on spatial grids, and the reduced density matrix of order one along lines joining two arbitrary atoms of a molecule. The source code is distributed under the GNU-GPLv3 license, and we release the code with the intent of establishing an open-source collaborative project. The style of DensToolKit's code follows some of the guidelines of an object-oriented program. This allows us to supply the user with a simple manner for easily implement new scalar or vector fields, provided they are derived from any of the fields already implemented in the code. In this paper, we present some of the most salient features of the programs contained in the suite, some examples of how to run them, and the mathematical definitions of the implemented fields along with hints of how we optimized their evaluation. We benchmarked our suite against both a freely-available program and a commercial package. Speed-ups of ˜2×, and up to 12× were obtained using a non-parallel compilation of DensToolKit for the evaluation of fields. DensToolKit takes similar times for finding critical points, compared to a commercial package. Finally, we present some perspectives for the future development and

  17. Radiation sterilization and food packaging

    International Nuclear Information System (INIS)

    Harrison, N.

    1991-01-01

    Food irradiation by gamma radiation or electron beams offers a number of benefits to be consumer and to the food industry. Low doses can delay fruit ripening while higher doses can reduce or eliminate pathrogenic microorganisms and control insect infestation. However, ionizing radiations are known to have an effect on the plastics used for food packaging, especially PVC and polyethylene. This chapter looks at food irradiation generally, including legislation on the irradiation of food packaging materials. The effect on specific polymers (PVC, polyethylenes, polypropylene, polystyrene, polyamides and flexible laminates) is then considered. It is concluded that few of the plastics used for food packaging are significantly affected by an overall average dose of 10KGy, the maximum likely for the irradiation of prepackaged food in the United Kingdom. (UK)

  18. Application of a CADIS-like variance reduction technique to electron transport

    International Nuclear Information System (INIS)

    Dionne, B.; Haghighat, A.

    2004-01-01

    This paper studies the use of approximate deterministic importance functions to calculate the lower-weight bounds of the MCNP5 weight-window variance reduction technique when applied to electron transport simulations. This approach follows the CADIS (Consistent Adjoint Driven Importance Sampling) methodology developed for neutral particles shielding calculations. The importance functions are calculated using the one-dimensional CEPXS/ONELD code package. Considering a simple 1-D problem, this paper shows that our methodology can produce speedups up to ∼82 using an approximate electron importance function distributions computed in ∼8 seconds. (author)

  19. The Application Strategy of Iterative Solution Methodology to Matrix Equations in Hydraulic Solver Package, SPACE

    International Nuclear Information System (INIS)

    Na, Y. W.; Park, C. E.; Lee, S. Y.

    2009-01-01

    As a part of the Ministry of Knowledge Economy (MKE) project, 'Development of safety analysis codes for nuclear power plants', KOPEC has been developing the hydraulic solver code package applicable to the safety analyses of nuclear power plants (NPP's). The matrices of the hydraulic solver are usually sparse and may be asymmetric. In the earlier stage of this project, typical direct matrix solver packages MA48 and MA28 had been tested as matrix solver for the hydraulic solver code, SPACE. The selection was based on the reasonably reliable performance experience from their former version MA18 in RELAP computer code. In the later stage of this project, the iterative methodologies have been being tested in the SPACE code. Among a few candidate iterative solution methodologies tested so far, the biconjugate gradient stabilization methodology (BICGSTAB) has shown the best performance in the applicability test and in the application to the SPACE code. Regardless of all the merits of using the direct solver packages, there are some other aspects of tackling the iterative solution methodologies. The algorithm is much simpler and easier to handle. The potential problems related to the robustness of the iterative solution methodologies have been resolved by applying pre-conditioning methods adjusted and modified as appropriate to the application in the SPACE code. The application strategy of conjugate gradient method was introduced in detail by Schewchuk, Golub and Saad in the middle of 1990's. The application of his methodology to nuclear engineering in Korea started about the same time and is still going on and there are quite a few examples of application to neutronics. Besides, Yang introduced a conjugate gradient method programmed in C++ language. The purpose of this study is to assess the performance and behavior of the iterative solution methodology compared to those of the direct solution methodology still being preferred due to its robustness and reliability. The

  20. Comparative Packaging Study

    Science.gov (United States)

    Perchonok, Michele H.; Oziomek, Thomas V.

    2009-01-01

    Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

  1. Naval Waste Package Design Sensitivity

    International Nuclear Information System (INIS)

    T. Schmitt

    2006-01-01

    The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages

  2. Perceptions of Sustainability and Functional Aspects on Liquid Carton Board Packaging Materials versus Competing Materials for Juice Applications in Sweden

    Directory of Open Access Journals (Sweden)

    Carl Olsmats

    2015-08-01

    Full Text Available This research explores the downstream perceptions of liquid carton board versus competing materials in packaging applications for juice. The methodology used is focus groups. The context is sustainability and functional performance, and related potential implications for the beverage industry value chain. The purpose is to get a deeper insight and understanding of functionality in relation to juice beverage packaging. The results confirm that there is no optimal packaging for every juice product, but a multitude, depending on the distribution channel, retail outlet, customer preferences, and context of consumption. There are some general packaging preferences, but the main deciding criteria for purchase seem to be the product characteristics in terms of quality, taste, brand, price and shelf life. For marketing reasons, packaging has to be adopted to the product and its positioning, liquid carton board packaging seem to have some functional advantages in distribution and is considered as sustainable and functional among many consumers. Major drawbacks seem to be shape limitations, lack of transparency, and lack of a “premium look”. To improve packaging performance and avoid sub-optimization, actors in the beverage industry value chain need to be integrated in development processes.

  3. Applications and Advances in Electronic-Nose Technologies

    Directory of Open Access Journals (Sweden)

    Manuela Baietto

    2009-06-01

    Full Text Available Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software innovations and progress in microcircuitry design and systems integration. The invention of many new e-nose sensor types and arrays, based on different detection principles and mechanisms, is closely correlated with the expansion of new applications. Electronic noses have provided a plethora of benefits to a variety of commercial industries, including the agricultural, biomedical, cosmetics, environmental, food, manufacturing, military, pharmaceutical, regulatory, and various scientific research fields. Advances have improved product attributes, uniformity, and consistency as a result of increases in quality control capabilities afforded by electronic-nose monitoring of all phases of industrial manufacturing processes. This paper is a review of the major electronic-nose technologies, developed since this specialized field was born and became prominent in the mid 1980s, and a summarization of some of the more important and useful applications that have been of greatest benefit to man.

  4. Yucca Mountain Site Characterization Project Waste Package Plan

    International Nuclear Information System (INIS)

    Harrison-Giesler, D.J.; Jardine, L.J.

    1991-02-01

    The goal of the US Department of Energy's (DOE) Yucca Mountain Site Characterization Project (YMP) waste package program is to develop, confirm the effectiveness of, and document a design for a waste package and associated engineered barrier system (EBS) for spent nuclear fuel and solidified high-level nuclear waste (HLW) that meets the applicable regulatory requirements for a geologic repository. The Waste Package Plan describes the waste package program and establishes the technical approach against which overall progress can be measured. It provides guidance for execution and describes the essential elements of the program, including the objectives, technical plan, and management approach. The plan covers the time period up to the submission of a repository license application to the US Nuclear Regulatory Commission (NRC). 1 fig

  5. Directory of Certificates of Compliance for Radioactive Materials Packages: Report of NRC Approved Packages

    International Nuclear Information System (INIS)

    1993-10-01

    This directory contains a Report of NRC Approved Packages (Volume 1). The purpose of this directory is to make available a convenient source of information on Quality Assurance Programs and Packagings which have been approved by the US Nuclear Regulatory Commission. Shipments of radioactive material utilizing these packagings must be in accordance with the provisions of 49 CFR section 173.471 and 10 CFR Part 71, as applicable. In satisfying the requirements of Section 71.12, it is the responsibility of the licensees to insure themselves that they have a copy of the current approval and conduct their transportation activities in accordance with an NRC approved quality assurance program

  6. Safety analysis report for packaging: the ORNL DOT specification 6M - special form package

    Energy Technology Data Exchange (ETDEWEB)

    Schaich, R.W.

    1982-07-01

    The ORNL DOT Specification 6M - Special Form Package was fabricated at the Oak Ridge Nation al Laboratory (ORNL) for the transport of Type B solid non-fissile radioactive materials in special form. The package was evaluated on the basis of tests performed by the Dow Chemical Company, Rocky Flats Division, on the DOT-6M container and special form tests performed on a variety of stainless steel capsules at ORNL by Operations Division personnel. The results of these evaluations demonstrate that the package is in compliance with the applicable regulations for the transport of Type B quantities in special form of non-fissile radioactive materials.

  7. Safety analysis report for packaging: the ORNL DOT specification 6M - special form package

    International Nuclear Information System (INIS)

    Schaich, R.W.

    1982-07-01

    The ORNL DOT Specification 6M - Special Form Package was fabricated at the Oak Ridge Nation al Laboratory (ORNL) for the transport of Type B solid non-fissile radioactive materials in special form. The package was evaluated on the basis of tests performed by the Dow Chemical Company, Rocky Flats Division, on the DOT-6M container and special form tests performed on a variety of stainless steel capsules at ORNL by Operations Division personnel. The results of these evaluations demonstrate that the package is in compliance with the applicable regulations for the transport of Type B quantities in special form of non-fissile radioactive materials

  8. Safety analysis report for packaging: the ORNL DOT specification 6M - tritium trap package

    International Nuclear Information System (INIS)

    DeVore, J.R.

    1984-04-01

    The ORNL DOT Specification 6M--Tritium Trap Package was fabricated at the Oak Ridge National Laboratory (ORNL) for the transport of Type B quantities of tritium as solid uranium tritide. The package was evaluated on the basis of tests performed by the Dow Chemical Company, Rocky Flats Division, on the DOT-6M container, a drop test performed by the ORNL Operations Division, and International Atomic Energy Agency (IAEA) approvals on a similar tritium transport container. The results of these evaluations demonstrate that the package is in compliance with the applicable regulations for the transport of Type B quantities of tritium. 4 references, 8 figures

  9. Applications and advances in electronic-nose technologies

    Science.gov (United States)

    A. D. Wilson; M. Baietto

    2009-01-01

    Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software...

  10. Food Packaging Materials

    Science.gov (United States)

    1978-01-01

    The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

  11. Development in the Active Packaging of Foods | Vermeiren | Journal ...

    African Journals Online (AJOL)

    ... of the art about the experimental development and commercialisation of active packaging concepts, (3) provide a scope of applications and (4) discuss the obstacles to be overcome in order to make extensive commercial application of active packaging in Europe feasible. The Journal of Food Technology in Africa Volume ...

  12. Safety analysis report for packaging: the ORNL DOT Specification 20WC-5 - special form packaging

    International Nuclear Information System (INIS)

    Schaich, R.W.

    1982-10-01

    The ORNL DOT Specification 20WC-5 - Special Form Package was fabricated for the transport of large quantities of solid nonfissile radioactive materials in special form. The package was evaluated on the basis of tests performed at Sandia National Laboratories, Albuquerque, New Mexico on an identical fire and impact shield and special form tests performed on a variety of stainless steel capsules at ORNL by Operations Division personnel. The results of these evaluations demonstrate that the package is in compliance with the applicable regulations for the transport of large quantities of nonfissile radioactive materials in special form

  13. Eugenol-loaded chitosan nanoparticles: II. Application in bio-based plastics for active packaging.

    Science.gov (United States)

    Woranuch, Sarekha; Yoksan, Rangrong

    2013-07-25

    The aim of the present research was to study the possibility of using eugenol-loaded chitosan nanoparticles as antioxidants for active bio-based packaging material. Eugenol-loaded chitosan nanoparticles were incorporated into thermoplastic flour (TPF) - a model bio-based plastic - through an extrusion process at temperatures above 150°C. The influences of eugenol-loaded chitosan nanoparticles on crystallinity, morphology, thermal properties, radical scavenging activity, reducing power, tensile properties and barrier properties of TPF were investigated. Although the incorporation of 3% (w/w) of eugenol-loaded chitosan nanoparticles significantly reduced the extensibility and the oxygen barrier property of TPF, it provided antioxidant activity and improved the water vapor barrier property. In addition, TPF containing eugenol-loaded chitosan nanoparticles exhibited superior radical scavenging activity and stronger reducing power compared with TPF containing naked eugenol. The results suggest the applicability of TPF containing eugenol-loaded chitosan nanoparticles as an antioxidant active packaging material. Copyright © 2012 Elsevier Ltd. All rights reserved.

  14. 49 CFR 178.350 - Specification 7A; general packaging, Type A.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Specification 7A; general packaging, Type A. 178... FOR PACKAGINGS Specifications for Packagings for Class 7 (Radioactive) Materials § 178.350 Specification 7A; general packaging, Type A. (a) Each packaging must meet all applicable requirements of subpart...

  15. Industrial applications of electron beam technology

    International Nuclear Information System (INIS)

    Khairul Zaman Mohd Dahlan

    1997-01-01

    Electron beam technology was first introduced in Malaysia in 1989 with the conclusion of the bilateral cooperation between the Malaysian Institute for Nuclear Technology Research (MINT) and Japan International Co-operation Agency (JICA) on Radiation Application Projects. Two electron beam accelerators with energy of 3.0 MeV and 200 keV were installed at MINT. These two accelerators pave the way for R and D to be carried out in radiation processing of polymers for cross-linking and surface curing. In 1994, another electron beam accelerator was installed in the private sector for cross-linking of home appliance wires. Since then, two more accelerators were installed in the private sector for cross-linking of heat shrinkable plastic films. Recently, a local company has acquired a low energy electron beam machine for cross-linking of plastic film. Within a period of 7 years, industrial applications of electron beam technology in Malaysia have increased significantly

  16. Directory of certificates of compliance for radioactive materials packages; Summary Report of NRC Approved Packages

    International Nuclear Information System (INIS)

    1980-12-01

    This directory contains a Summary Report of NRC approved Packages (Volume 1), Certificates of Compliance (Volume 2), and a Summary Report of NRC Approved Quality Assurance Programs for Radioactive Material Packages (Volume 3). The purpose of this directory is to make available a convenient source of information on packagings which have been approved by the U.S. Nuclear Regulatory Commission. To assist in identifying packaging, and index by Model Number and corresponding Certificate of Compliance number is included at the back of each volume of the directory. The Summary Report includes a listing of all users of each package design prior to the publication date of the directory. Shipments of radioactive material using these packagings must be in accordance with the provisions of 49 CFR 173.393a and 10 CFR Part 71, as applicable. In satisfying the requirements of Section 71.12, it is the responsibility of the licensees to insure them--that they have a copy of the current approval and conduct their transportation activities in accordance with an NRC approved quality assurance program

  17. Cigarette package design: opportunities for disease prevention.

    Science.gov (United States)

    Difranza, J R; Clark, D M; Pollay, R W

    2002-06-15

    To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

  18. CYPROS - Cybernetic Program Packages

    Directory of Open Access Journals (Sweden)

    Arne Tyssø

    1980-10-01

    Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

  19. Waste Package Design Methodology Report

    Energy Technology Data Exchange (ETDEWEB)

    D.A. Brownson

    2001-09-28

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report.

  20. Waste Package Design Methodology Report

    International Nuclear Information System (INIS)

    D.A. Brownson

    2001-01-01

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report

  1. Effects of packaging and irradiation on cut vegetables

    International Nuclear Information System (INIS)

    Langerak, D.I.

    1980-01-01

    A disadvantage of packaging cut vegetables is that it accelerates microbial spoilage in the product, resulting in an unfavourable gas composition (too low O 2 content) in the packaging, which promotes fermentation. For this reason perforations in the packaging material are necessary in practise to increase the O 2 content in the packaging by which the favourable effect on the quality is partly lost. Application of ionizing rays offers, however, the possibility of using a packaging without perforations, because radiation inactivates microorganisms, so that spoilage and other undesirable conversions (e.g. Nitrate → Nitrite) are reduced. Optimal maintenance of the quality is achieved by the combination of packaging and irradiation. (orig.)

  2. Ceramic packages for liquid-nitrogen operation

    International Nuclear Information System (INIS)

    Tong, H.M.; Yeh, H.L.; Goldblatt, R.D.

    1989-01-01

    To evaluate their compatibility for use in a liquid-nitrogen computer, metallized ceramic packages with test chips joined using IBM controlled-collapse solder (Pb-Sn) technology have been cycled between 30 0 C and liquid-nitrogen temperature. Room-temperature electrical resistance measurements were made at regular intervals of cycles to determine whether solder failure accompanied by a significant resistance increase had occurred. For the failed solder joints characterized by the highest thermal shear strain amplitude of 3.3 percent, the authors were able to estimate the number of liquid-nitrogen cycles needed to produce the corresponding failure rate using a room-temperature solder lifetime model. Cross-sectional examination of the failed solder joints using scanning electron microscopy and energy dispersive X-ray analysis indicated solder cracking occurring at the solder-ceramic interface. Chip pull tests on cycled packages yielded strengths far exceeding the minimal requirement. Mechanisms involving the formation of intermetallics were proposed to account for the observed solder fracture modes after liquid-nitrogen cycling and after chip pull. Furthermore, scanning electron microscopic examination of pulled chips in cycled packages showed no apparent sign of cracking in quartz and polyimide for chip insulation

  3. Developing a model for application of electronic banking based on electronic trust

    Directory of Open Access Journals (Sweden)

    Amir Hooshang Nazarpoori

    2014-05-01

    Full Text Available This study develops a model for application of electronic banking based on electronic trust among costumers of Day bank in KhoramAbad city. A sample of 150 people was selected based on stratified random sampling. Questionnaires were used for the investigation. Results indicate that technology-based factors, user-based factors, and trust had negative relationships with perceived risk types including financial, functional, personal, and private. Moreover, trust including trust in system and trust in bank had a positive relationship with tendency to use and real application of electronic banking.

  4. Packaging review guide for reviewing safety analysis reports for packagings: Revision 0

    International Nuclear Information System (INIS)

    Fischer, L.E.; Chou, C.K.; Lloyd, W.R.; Mount, M.E.; Nelson, T.A.; Schwartz, M.W.; Witte, M.C.

    1987-09-01

    The Department of Energy (DOE) has established procedures for obtaining certification of packagings used by DOE and its contractors for the transport of radioactive materials. These certification review policies and procedures are established to ensure that DOE packaging designs and operations meet safety criteria at least equivalent to the standards prescribed by the Nuclear Regulatory Commission (NRC) certification process for packaging. The Packaging Review Guide (PRG) is not a DOE order, but has been prepared as guidance for the Packaging Certification Staff (PCS) under the Certifying Official, Office of Security Evaluations, or designated representatives. The principal purpose of the PRG is to assure the quality and uniformity of PCS reviews, and to present a well-defined base from which to evaluate proposed changes in the scope and requirements of reviews. The PRG also sets forth solutions and approaches determined to be acceptable in the past by the PCS in dealing with a specific safety issue or safety-related design area. These solutions and approaches are presented in this form so that reviewers can take consistent and well-understood positions as the same safety issues arise in future cases. An applicant submitting a SARP does not have to follow the solutions or approaches presented in the PRG. However, applicants should recognize that the PCS has spent substantial time and effort in reviewing and developing their positions for the issues. A corresponding amount of time and effort will probably be required to review and accept new or different solutions and approaches. Finally, it is also a purpose of the PRG to make information about DOE certification policy and procedures widely available to DOE field offices, DOE contractors, federal agencies, and interested members of the public. 7 refs., 15 figs., 14 tabs

  5. Radiation leakage from linac electron applicator assembly

    International Nuclear Information System (INIS)

    Keys, R.A.; Purdy, J.A.

    1984-01-01

    The electron beam applicator system currently in use on the linear accelerator is constructed of light-weight fiberglass and aluminum. With an applicator in place on the accelerator, the photon collimator jaws are automatically set several centimeters greater than the electron field size projected at the patient's surface. To ensure that no regions of high dose levels exist outside the useful beam, ionization and film measurements were made to quantitate the amount of leakage radiation through the 10 cm x 10 cm and 25 cm x 25 cm applicators. In most regions, the ionization levels at the patient's surface were below 5% of the central axis dose. In one area for the 25 cm applicator, the percentage ionization was 8.5%, which could be reduced by the addition of a small piece of 1/8 inch thick lead. However, ionization levels on the outside surface of the applicator were found to be considerably higher at certain locations for the 25 cm applicator. Results for 6, 9, 12 and 20 MeV electrons are reported here

  6. Packaging of control system software

    International Nuclear Information System (INIS)

    Zagar, K.; Kobal, M.; Saje, N.; Zagar, A.; Sabjan, R.; Di Maio, F.; Stepanov, D.

    2012-01-01

    Control system software consists of several parts - the core of the control system, drivers for integration of devices, configuration for user interfaces, alarm system, etc. Once the software is developed and configured, it must be installed to computers where it runs. Usually, it is installed on an operating system whose services it needs, and also in some cases dynamically links with the libraries it provides. Operating system can be quite complex itself - for example, a typical Linux distribution consists of several thousand packages. To manage this complexity, we have decided to rely on Red Hat Package Management system (RPM) to package control system software, and also ensure it is properly installed (i.e., that dependencies are also installed, and that scripts are run after installation if any additional actions need to be performed). As dozens of RPM packages need to be prepared, we are reducing the amount of effort and improving consistency between packages through a Maven-based infrastructure that assists in packaging (e.g., automated generation of RPM SPEC files, including automated identification of dependencies). So far, we have used it to package EPICS, Control System Studio (CSS) and several device drivers. We perform extensive testing on Red Hat Enterprise Linux 5.5, but we have also verified that packaging works on CentOS and Scientific Linux. In this article, we describe in greater detail the systematic system of packaging we are using, and its particular application for the ITER CODAC Core System. (authors)

  7. Industrial application of electron sources with plasma emitters

    CERN Document Server

    Belyuk, S I; Rempe, N G

    2001-01-01

    Paper contains a description, operation, design and parameters of electron sources with plasma emitters. One presents examples of application of these sources as part of automated electron-beam welding lines. Paper describes application of such sources for electron-beam deposition of composite powders. Electron-beam deposition is used to rebuild worn out part and to increase strength of new parts of machines and tools. Paper presents some examples of rebuilding part and the advantages gained in this case

  8. Antimicrobial food packaging: potential and pitfalls

    Science.gov (United States)

    Malhotra, Bhanu; Keshwani, Anu; Kharkwal, Harsha

    2015-01-01

    Nowadays food preservation, quality maintenance, and safety are major growing concerns of the food industry. It is evident that over time consumers’ demand for natural and safe food products with stringent regulations to prevent food-borne infectious diseases. Antimicrobial packaging which is thought to be a subset of active packaging and controlled release packaging is one such promising technology which effectively impregnates the antimicrobial into the food packaging film material and subsequently delivers it over the stipulated period of time to kill the pathogenic microorganisms affecting food products thereby increasing the shelf life to severe folds. This paper presents a picture of the recent research on antimicrobial agents that are aimed at enhancing and improving food quality and safety by reduction of pathogen growth and extension of shelf life, in a form of a comprehensive review. Examination of the available antimicrobial packaging technologies is also presented along with their significant impact on food safety. This article entails various antimicrobial agents for commercial applications, as well as the difference between the use of antimicrobials under laboratory scale and real time applications. Development of resistance amongst microorganisms is considered as a future implication of antimicrobials with an aim to come up with actual efficacies in extension of shelf life as well as reduction in bacterial growth through the upcoming and promising use of antimicrobials in food packaging for the forthcoming research down the line. PMID:26136740

  9. Power electronics handbook components, circuits and applications

    CERN Document Server

    Mazda, F F

    1993-01-01

    Power Electronics Handbook: Components, Circuits, and Applications is a collection of materials about power components, circuit design, and applications. Presented in a practical form, theoretical information is given as formulae. The book is divided into three parts. Part 1 deals with the usual components found in power electronics such as semiconductor devices and power semiconductor control components, their electronic compatibility, and protection. Part 2 tackles parts and principles related to circuits such as switches; link frequency chargers; converters; and AC line control, and Part 3

  10. Interim storage of radioactive waste packages

    International Nuclear Information System (INIS)

    1998-01-01

    This report covers all the principal aspects of production and interim storage of radioactive waste packages. The latest design solutions of waste storage facilities and the operational experiences of developed countries are described and evaluated in order to assist developing Member States in decision making and design and construction of their own storage facilities. This report is applicable to any category of radioactive waste package prepared for interim storage, including conditioned spent fuel, high level waste and sealed radiation sources. This report addresses the following issues: safety principles and requirements for storage of waste packages; treatment and conditioning methods for the main categories of radioactive waste; examples of existing interim storage facilities for LILW, spent fuel and high level waste; operational experience of Member States in waste storage operations including control of storage conditions, surveillance of waste packages and observation of the behaviour of waste packages during storage; retrieval of waste packages from storage facilities; technical and administrative measures that will ensure optimal performance of waste packages subject to various periods of interim storage

  11. Benefits of standard format and content for approval of packaging for radioactive material

    International Nuclear Information System (INIS)

    Pstrak, D.; Osgood, N.

    2004-01-01

    The U.S. Nuclear Regulatory Commission (NRC) uses Regulatory Guide 7.9, ''Standard Format and Content of Part 71 Applications for Approval of Packaging for Radioactive Material'' to provide recommendations on the preparation of applications for approval of Type B and fissile material packages. The purpose of this Regulatory Guide is to assist the applicant in preparing an application that demonstrates the adequacy of a package in meeting the 10 CFR Part 71 packaging requirements. NRC recently revised Regulatory Guide 7.9 to reflect current changes to the regulations in Part 71 as a result of a recent rulemaking that included changes to the structural, containment, and criticality requirements for packages. Overall, the NRC issues Regulatory Guides to describe methods that are acceptable to the NRC staff for implementing specific parts of the NRC's regulations, to explain techniques used by the NRC staff in evaluating specific problems, and to provide guidance to applicants. It is important to note the specific purpose of this Regulatory Guide. As the name indicates, this Guide sets forth a standard format for application submission that is acceptable to the NRC staff that, when used by the applicant, will accomplish several objectives. First, use of the guide provides a consistent and repeatable approach that indicates the information to be provided by the applicant. Second, the organization of the information in the application will assist the reviewer(s) in locating information. Ultimately, accomplishing these objectives will help to ensure the completeness of the information in the application as well as decrease the review time. From an international perspective, use of a standard format approach could enhance the efficiency with which Competent Authorities certify and validate packages for use in the packaging and transportation of radioactive material worldwide. This streamlined approach of preparing package applications could ultimately lead to uniform

  12. APPLICATION OF PARAGRAPHEMICS ELEMENTS WHILE MAKING PACKAGING

    Directory of Open Access Journals (Sweden)

    V. V. Кuzmich

    2014-01-01

    Full Text Available The paper investigates mechanisms for creation of paragraphemics elements in printed advertisement on the packaging that attract attention to semantic characteristics of words and ensure a deeper understanding of the advertising text in comparison with superficial perception

  13. System and Method for Providing a Climate Data Analytic Services Application Programming Interface Distribution Package

    Science.gov (United States)

    Schnase, John L. (Inventor); Duffy, Daniel Q. (Inventor); Tamkin, Glenn S. (Inventor)

    2016-01-01

    A system, method and computer-readable storage devices for providing a climate data analytic services application programming interface distribution package. The example system can provide various components. The system provides a climate data analytic services application programming interface library that enables software applications running on a client device to invoke the capabilities of a climate data analytic service. The system provides a command-line interface that provides a means of interacting with a climate data analytic service by issuing commands directly to the system's server interface. The system provides sample programs that call on the capabilities of the application programming interface library and can be used as templates for the construction of new client applications. The system can also provide test utilities, build utilities, service integration utilities, and documentation.

  14. Development of waste packages for TRU-disposal. 5. Development of cylindrical metal package for TRU wastes

    International Nuclear Information System (INIS)

    Mine, Tatsuya; Mizubayashi, Hiroshi; Asano, Hidekazu; Owada, Hitoshi; Otsuki, Akiyoshi

    2005-01-01

    Development of the TRU waste package for hulls and endpieces compression canisters, which include long-lived and low sorption nuclides like C-14 is essential and will contribute a lot to a reasonable enhancement of safety and economy of the TRU-disposal system. The cylindrical metal package made of carbon steel for canisters to enhance the efficiency of the TRU-disposal system and to economically improve their stacking conditions was developed. The package is a welded cylindrical construction with a deep drawn upper cover and a disc plate for a bottom cover. Since the welding is mainly made only for an upper cover and a bottom disc plate, this package has a better containment performance for radioactive nuclide and can reduce the cost for construction and manufacturing including its welding control. Furthermore, this package can be laid down in pile for stacking in the circular cross section disposal tunnel for the sedimentary rock, which can drastically minimize the space for disposal tunnel as mentioned previously in TRU report. This paper reports the results of the study for application of newly developed metal package into the previous TRU-disposal system and for the stacking equipment for the package. (author)

  15. Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications

    OpenAIRE

    Morris, Michael A.; Padmanabhan, Sibu C.; Cruz-Romero, Malco C.; Cummins, Enda; Kerry, Joseph P.

    2017-01-01

    Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased custom...

  16. A Dual Band Additively Manufactured 3D Antenna on Package with Near-Isotropic Radiation Pattern

    KAUST Repository

    Su, Zhen

    2018-04-06

    Internet of things (IoT) applications need wireless connectivity on devices with very small footprints, and in RF obscure environments. The antenna for such applications must work on multiple GSM bands (preferred choice for network connectivity), provide near isotropic radiation pattern to maintain orientation insensitive communication, be small in size so that it can be integrated with futuristic miniaturized IoT devices, and be low in cost to be implemented on billions of devices. This paper presents a novel 3D dual band near-isotropic wideband GSM antenna to fulfill these requirements. The antenna has been realized on the package of electronics through additive manufacturing to ensure efficient utilization of available space and lower cost. The proposed antenna consists of a meander line antenna that is folded on the faces of a 3D package with two variations, 0.375λ length for narrowband version and 0.67λ length for the wideband version. Theoretical conditions to achieve near isotropic radiation pattern with bent wire antennas on a 3D surface have been derived. The antenna has been optimized to operate with embedded electronics and a large metallic battery. The antenna provides 8.9% and 34.4% bandwidths, at 900 and 1800 MHz respectively with decent near isotropic radiation behavior.

  17. Documentation package for the RFID temperature monitoring system (Model 9977 packages at NTS)

    International Nuclear Information System (INIS)

    Chen, K.; Tsai, H.

    2009-01-01

    The technical basis for extending the Model 9977 shipping package periodic maintenance beyond the one-year interval to a maximum of five years is based on the performance of the O-ring seals and the environmental conditions. The DOE Packaging Certification Program (PCP) has tasked Argonne National Laboratory to develop a Radio-Frequency Identification (RFID) temperature monitoring system for use by the facility personnel at DAF/NTS. The RFID temperature monitoring system, depicted in the figure below, consists of the Mk-1 RFId tags, a reader, and a control computer mounted on a mobile platform that can operate as a stand-alone system, or it can be connected to the local IT network. As part of the Conditions of Approval of the CoC, the user must complete the prescribed training to become qualified and be certified for operation of the RFID temperature monitoring system. The training course will be administered by Argonne National Laboratory on behalf of the Headquarters Certifying Official. This is a complete documentation package for the RFID temperature monitoring system of the Model 9977 packagings at NTS. The documentation package will be used for training and certification. The table of contents are: Acceptance Testing Procedure of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Acceptance Testing Result of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Performance Test of the Single Bolt Seal Sensor for the Model 9977 Packaging; Calibration of Built-in Thermistors in RFID Tags for Nevada Test Site; Results of Calibration of Built-in Thermistors in RFID Tags; Results of Thermal Calibration of Second Batch of MK-I RFID Tags; Procedure for Installing and Removing MK-1 RFID Tag on Model 9977 Drum; User Guide for RFID Reader and Software for Temperature Monitoring of Model 9977 Drums at NTS; Software Quality Assurance Plan (SQAP) for the ARG-US System; Quality Category for the RFID Temperature Monitoring System; The

  18. The portability of the "Electronics Workbench" simulation software to China

    NARCIS (Netherlands)

    Collis, Betty; Zhi-Cheng, Dong

    1993-01-01

    This article discusses the portability of the Canadian-made simulation software package, "Electronic Workbench" package (EWB) to China. As part of a larger project investigating the portability of various educational software packages, the EWB package was used in electronics instruction in China and

  19. Food packaging materials and radiation processing of food: a brief review

    International Nuclear Information System (INIS)

    Chuaqui-Offermanns, N.

    1989-01-01

    Food is usually packaged to prevent microbial contamination and spoilage. Ionizing radiation can be applied to food-packaging materials in two ways: (i) sterilization of packaging materials for aseptic packaging, and (ii) radiation processing of prepackaged food. In aseptic packaging, a sterile package is filled with a sterile product in a microbiologically controlled environment. In irradiation of prepackaged food, the food and the packaging material are irradiated simultaneously. For both applications, the radiation stability of the packaging material is a key consideration if the technology is to be used successfully. To demonstrate the radiation stability of the packaging material, it must be shown that irradiation does not significantly alter the physical and chemical properties of the material. The irradiated material must protect the food from environmental contamination while maintaining its organoleptic and toxicological properties. Single-layer plastics cannot meet the requirements of either application. Multilayered structures produced by coextrusion would likely satisfy the demands of radiation processing prepackaged food. In aseptic packaging, the package is irradiated prior to filling, making demands on toxicological safety less stringent. Therefore, multilayered structures produced by coextrusion, lamination or co-injection moulding could satisfy the requirements. (author)

  20. Cigarette package design: opportunities for disease prevention

    Directory of Open Access Journals (Sweden)

    Pollay RW

    2003-01-01

    Full Text Available Abstract Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

  1. Low-Cost and Low-Temperature Integration Methods for System-in-Package

    NARCIS (Netherlands)

    Palacios Aguilera, N.B.

    2013-01-01

    Packaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different

  2. Nano crystals for Electronic and Optoelectronic Applications

    International Nuclear Information System (INIS)

    Zhu, T.; Cloutier, S.G.; Ivanov, I; Knappenberger Jr, K.L.; Robel, I.; Zhang, F

    2012-01-01

    Electronic and optoelectronic devices, from computers and smart cell phones to solar cells, have become a part of our life. Currently, devices with featured circuits of 45 nm in size can be fabricated for commercial use. However, further development based on traditional semiconductor is hindered by the increasing thermal issues and the manufacturing cost. During the last decade, nano crystals have been widely adopted in various electronic and optoelectronic applications. They provide alternative options in terms of ease of processing, low cost, better flexibility, and superior electronic/optoelectronic properties. By taking advantage of solution-processing, self-assembly, and surface engineering, nano crystals could serve as new building blocks for low-cost manufacturing of flexible and large area devices. Tunable electronic structures combined with small exciton binding energy, high luminescence efficiency, and low thermal conductivity make nano crystals extremely attractive for FET, memory device, solar cell, solid-state lighting/display, photodetector, and lasing applications. Efforts to harness the nano crystal quantum tunability have led to the successful demonstration of many prototype devices, raising the public awareness to the wide range of solutions that nano technology can provide for an efficient energy economy. This special issue aims to provide the readers with the latest achievements of nano crystals in electronic and optoelectronic applications, including the synthesis and engineering of nano crystals towards the applications and the corresponding device fabrication, characterization and computer modeling.

  3. An Analysis of U.S. Business Schools' Catalogs, Application Packages, and Program Materials from an International Perspective.

    Science.gov (United States)

    Webb, Marion S.; Mayer, Kenneth R.; Pioche, Virginie

    1999-01-01

    Catalogs, application packages, and program materials from 106 business schools were analyzed to determine the degree of international coverage in business schools' curricula. Findings indicated a trend to require international functional courses, such as international finance, in the traditional Master in business administration programs and to…

  4. Guidance for package approvals in the United Kingdom

    International Nuclear Information System (INIS)

    Morgan-Warren, E.J.

    2004-01-01

    Approval is required under the transport regulations for a wide range of package designs and operations, and applications for competent authority approval and validation are received from many sources, both in the UK and overseas. To assist package designers and applicants for approval, and to promote consistency in applications and their assessment, the UK Department for Transport issues guidance on the interpretation of the transport regulations and the requirements of an application for approval and its supporting safety case. The general guidance document, known as the Guide to an Application for UK Competent Authority Approval of Radioactive Material in Transport, has been issued for many years and updated to encompass the provisions of each successive edition of the IAEA transport regulations. The guide has been referred to in a number of international fora, including PATRAM, and was cited as a 'good practice' in the report of the IAEA TRANSAS appraisal of the UK in 2002. Specialist guides include the Guide to the Suitability of Elastomeric Seal Materials, which is the subject of a separate paper in this conference, and the Guide to the Approval of Freight Containers as Types IP-2 and IP-3 Packages. This paper discusses the guidance material and summarises the administrative and technical information required in support of applications for approval of package designs, special form and low-dispersible radioactive materials, shipments, special arrangements, modifications and validations. (author)

  5. Active and intelligent packaging systems for a modern society.

    Science.gov (United States)

    Realini, Carolina E; Marcos, Begonya

    2014-11-01

    Active and intelligent packaging systems are continuously evolving in response to growing challenges from a modern society. This article reviews: (1) the different categories of active and intelligent packaging concepts and currently available commercial applications, (2) latest packaging research trends and innovations, and (3) the growth perspectives of the active and intelligent packaging market. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Intelligent packaging systems which monitor the condition of the packed food or its environment are progressing towards more cost-effective, convenient and integrated systems to provide innovative packaging solutions. Market growth is expected for active packaging with leading shares for moisture absorbers, oxygen scavengers, microwave susceptors and antimicrobial packaging. The market for intelligent packaging is also promising with strong gains for time-temperature indicator labels and advancements in the integration of intelligent concepts into packaging materials. Copyright © 2014 Elsevier Ltd. All rights reserved.

  6. Electronic Attendance Application Using Raspberry Pi

    International Nuclear Information System (INIS)

    Mohd Dzul Aiman Aslan; Saaidi Ismail; Mohamad Safuan Sulaiman

    2016-01-01

    Raspberry Pi is a cheap mini-computer that officially runs on a Linux distribution Operating System (OS) such as Raspbian. It has many input and output mechanisms simulating a computer which make it useful replacement for a computer system. SimpleCV, an open source python-based image processing software and Telegram, a popular social application provide API that allow communication trough a device such as Raspberry Pi. Combining these two, an electronic attendance has been developed using open source basis, and the electronic attendance also provide enhancement of current system that is to record the person face and sending information through Telegram application. The methodology include gathering requirements on remaining system and test it on Linux which will discuss further. This project is serve as a prototype for enhancement of current Commersial Of The Shelf (COTS) electronic attendance that only record ID of the attendees. In the future, the electronic attendance can be enhanced with many features and should be make in-a-box for commercialization. (author)

  7. The Affordance Template ROS Package for Robot Task Programming

    Science.gov (United States)

    Hart, Stephen; Dinh, Paul; Hambuchen, Kimberly

    2015-01-01

    This paper introduces the Affordance Template ROS package for quickly programming, adjusting, and executing robot applications in the ROS RViz environment. This package extends the capabilities of RViz interactive markers by allowing an operator to specify multiple end-effector waypoint locations and grasp poses in object-centric coordinate frames and to adjust these waypoints in order to meet the run-time demands of the task (specifically, object scale and location). The Affordance Template package stores task specifications in a robot-agnostic XML description format such that it is trivial to apply a template to a new robot. As such, the Affordance Template package provides a robot-generic ROS tool appropriate for building semi-autonomous, manipulation-based applications. Affordance Templates were developed by the NASA-JSC DARPA Robotics Challenge (DRC) team and have since successfully been deployed on multiple platforms including the NASA Valkyrie and Robonaut 2 humanoids, the University of Texas Dreamer robot and the Willow Garage PR2. In this paper, the specification and implementation of the affordance template package is introduced and demonstrated through examples for wheel (valve) turning, pick-and-place, and drill grasping, evincing its utility and flexibility for a wide variety of robot applications.

  8. Non-equilibrium Green function method: theory and application in simulation of nanometer electronic devices

    International Nuclear Information System (INIS)

    Do, Van-Nam

    2014-01-01

    We review fundamental aspects of the non-equilibrium Green function method in the simulation of nanometer electronic devices. The method is implemented into our recently developed computer package OPEDEVS to investigate transport properties of electrons in nano-scale devices and low-dimensional materials. Concretely, we present the definition of the four real-time Green functions, the retarded, advanced, lesser and greater functions. Basic relations among these functions and their equations of motion are also presented in detail as the basis for the performance of analytical and numerical calculations. In particular, we review in detail two recursive algorithms, which are implemented in OPEDEVS to solve the Green functions defined in finite-size opened systems and in the surface layer of semi-infinite homogeneous ones. Operation of the package is then illustrated through the simulation of the transport characteristics of a typical semiconductor device structure, the resonant tunneling diodes. (review)

  9. Natural biopolimers in organic food packaging

    Science.gov (United States)

    Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

    2014-05-01

    Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

  10. Industrial applications of electron beam

    International Nuclear Information System (INIS)

    Chmielewski, A.G.

    1997-01-01

    The review of industrial applications with use of electron beams has been done. Especially the radiation technologies being developed in Poland have been shown. Industrial installations with electron accelerators as radiation source have been applied for: modification of polymers; modification of thyristors; sterilization of health care materials; radiopreservation of food and other consumer products; purification of combustion flue gases in heat and power plants. 14 refs, 6 tabs, 7 figs

  11. AlN 3D Thermal Packaging, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — This proposal addresses the need for compact, lightweight packaging to cool high heat producing electronics. Technology Assessment & Transfer, Inc. (TA&T)...

  12. Effects of wafer-level packaging on millimetre-wave antennas

    KAUST Repository

    Abutarboush, Hattan

    2011-11-01

    A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna\\'s reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations. © 2011 IEEE.

  13. Shelf life of packaged bakery goods--a review.

    Science.gov (United States)

    Galić, K; Curić, D; Gabrić, D

    2009-05-01

    Packaging requirements for fresh bakery goods are often minimal as many of the products are for immediate consumption. However, packaging can be an important factor in extending the shelf life of other cereal-based goods (toast, frozen products, biscuits, cakes, pastas). Some amount of the texture changes and flavor loss manifest over the shelf life of a soft-baked good can usually be minimized or delayed by effective use of packaging materials. The gains in the extension of shelf life will be application specific. It is recognized that defining the shelf life of a food is a difficult task and is an area of intense research for food product development scientists (food technologists, microbiologists, packaging experts). Proper application of chemical kinetic principles to food quality loss allows for efficiently designing appropriate shelf-life tests and maximizing the useful information that can be obtained from the resulting data. In the development of any new food product including reformulating, change of packaging, or storage/distribution condition (to penetrate into a new market), one important aspect is the knowledge of shelf life.

  14. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  15. Food irradiation and packaging

    International Nuclear Information System (INIS)

    Kilcast, David

    1988-01-01

    This outline review was written for 'Food Manufacture'. It deals with the known effects of irradiation on current packaging materials (glass, cellulosics, organic polymers and metals), and their implications for the effective application of the process. (U.K.)

  16. Completion of the Radioactive Materials Packaging Handbook

    International Nuclear Information System (INIS)

    Shappert, L.B.

    1998-02-01

    The Radioactive Materials Packaging Handbook: Design, Operation and Maintenance, which will serve as a replacement for the Cask Designers Guide (Shappert, 1970), has now been completed and submitted to the Oak Ridge National Laboratory (ORNL) electronics publishing group for layout and printing; it is scheduled to be printed in late spring 1998. The Handbook, written by experts in their particular fields, is a compilation of technical chapters that address the design aspects of a package intended for transporting radioactive material in normal commerce; it was prepared under the direction of M. E. Wangler of the US Department of Energy (DOE) and is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators on specific aspects of package design, and the types of analyses that should be considered when designing a package to carry radioactive materials

  17. Use of nanotechnology in food processing, packaging and safety ...

    African Journals Online (AJOL)

    Use of nanotechnology in food processing, packaging and safety – review. ... application of nanotechnology in food packaging and food contact materials, ... developing active antimicrobial and antifungal surfaces, and sensing as well as ...

  18. Radiolysis products and sensory properties of electron-beam-irradiated high-barrier food-packaging films containing a buried layer of recycled low-density polyethylene.

    Science.gov (United States)

    Chytiri, S D; Badeka, A V; Riganakos, K A; Kontominas, M G

    2010-04-01

    The aim was to study the effect of electron-beam irradiation on the production of radiolysis products and sensory changes in experimental high-barrier packaging films composed of polyamide (PA), ethylene-vinyl alcohol (EVOH) and low-density polyethylene (LDPE). Films contained a middle buried layer of recycled LDPE, while films containing 100% virgin LDPE as the middle buried layer were taken as controls. Irradiation doses ranged between zero and 60 kGy. Generally, a large number of radiolysis products were produced during electron-beam irradiation, even at the lower absorbed doses of 5 and 10 kGy (approved doses for food 'cold pasteurization'). The quantity of radiolysis products increased with irradiation dose. There were no significant differences in radiolysis products identified between samples containing a recycled layer of LDPE and those containing virgin LDPE (all absorbed doses), indicating the 'functional barrier' properties of external virgin polymer layers. Sensory properties (mainly taste) of potable water were affected after contact with irradiated as low as 5 kGy packaging films. This effect increased with increasing irradiation dose.

  19. Investigation of an Electrostatic Discharge Protective Biodegradable Packaging Foam in the Logistic Chain

    Directory of Open Access Journals (Sweden)

    Mojzes Ákos

    2014-11-01

    Full Text Available Since the beginning of the 20th century, logistics has undergone a huge technological development, which has, however, resulted in many negative effects as well. The industry, particularly in the packaging industry has been a massive waste producer, although recently it has forced the use of new materials and it started to focus on environmentally friendly technologies. During the transportation of finished and semi-finished Electrostatic Discharge (ESD sensitive products, the product packaging system has a vital role. These kind of packaging materials must be suitable to both logistic (protection against mechanical and environmental stresses and special ESD protection requirements. During the transportation of printed-circuit electronic products, ESD defense is then of primary significance. However there is a huge disadvantage for the use of various shield bags. Namely, this kind of associated packaging is particularly pollutant, it causes a lot of inconvenience in the form of waste. In order to rule out these materials from the packaging system, new innovative solutions have to be found. The investigated TPS (thermoplastic starch biodegradable foam is subjected to a validation, a long process to certify that this material unites properties of two types of packaging materials at the same time. On the one hand, this packaging foam has to meet the requirements product defense. On the other hand, the material must be anti-static under the logistic stress effects. In case it is found suitable, it can be an alternative of the conventional materials. In this article, we investigate the ESD characteristic of TPS foam. As this material sensitive for environmental parameters during transportation, we make the relevant Surface Resistance (Rs tests on different temperature and humidity conditions. Based on result, the decision of the application can be done, as an ESD packaging material.

  20. Anticounterfeit packaging technologies

    Directory of Open Access Journals (Sweden)

    Ruchir Y Shah

    2010-01-01

    Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

  1. Electron Beam Scanning in Industrial Applications

    Science.gov (United States)

    Jongen, Yves; Herer, Arnold

    1996-05-01

    Scanned electron beams are used within many industries for applications such as sterilization of medical disposables, crosslinking of wire and cables insulating jackets, polymerization and degradation of resins and biomaterials, modification of semiconductors, coloration of gemstones and glasses, removal of oxides from coal plant flue gasses, and the curing of advanced composites and other molded forms. X-rays generated from scanned electron beams make yet other applications, such as food irradiation, viable. Typical accelerators for these applications range in beam energy from 0.5MeV to 10 MeV, with beam powers between 5 to 500kW and scanning widths between 20 and 300 cm. Since precise control of dose delivery is required in many of these applications, the integration of beam characteristics, product conveyance, and beam scanning mechanisms must be well understood and optimized. Fundamental issues and some case examples are presented.

  2. Defense Waste Processing Facility Process Simulation Package Life Cycle

    International Nuclear Information System (INIS)

    Reuter, K.

    1991-01-01

    The Defense Waste Processing Facility (DWPF) will be used to immobilize high level liquid radioactive waste into safe, stable, and manageable solid form. The complexity and classification of the facility requires that a performance based operator training to satisfy Department of Energy orders and guidelines. A major portion of the training program will be the application and utilization of Process Simulation Packages to assist in training the Control Room Operators on the fluctionality of the process and the application of the Distribution Control System (DCS) in operating and managing the DWPF process. The packages are being developed by the DWPF Computer and Information Systems Simulation Group. This paper will describe the DWPF Process Simulation Package Life Cycle. The areas of package scope, development, validation, and configuration management will be reviewed and discussed in detail

  3. Assessment of environmental impact of ultraviolet radiation or electron beam cured print inks on plastic packaging materials

    International Nuclear Information System (INIS)

    Bardi, Marcelo Augusto Goncalves

    2014-01-01

    The high level of pollution generated by the inadequate disposal of polymeric materials has motivated the search for environmentally friendly systems and techniques such as the application of biodegradable polymers and the replacement of the solvent-based paint systems by those with high solids content, based water or cured by radiation, practically free of volatile organic compounds. However, the cured polymer coatings are neither soluble nor molten, increasing the complexity of the reprocessing, recycling and degradation. Thus, this work aimed to develop print inks modified with pro-degrading agents, cured by ultraviolet radiation or electron beam, for printing or decoration in plastic packaging products of short lifetime, which are biodegradable or not. Six coatings (varnish and inks in five colors: yellow, blue, white, black and red), three pro-degrading agents (cobalt stearate, cerium stearate and manganese stearate), five polymeric substrates (Ecobras®, low density polyethylene and its respective modifications with pro-degrading agents). The coatings were applied to the substrates and cured by ultraviolet radiation or electron beam, resulting in 180 samples. These materials were then exposed to accelerated aging chamber, type 'QUV', and composting in natural environment. In order to assess the effects of the polymer coatings on the degradation process of the specimens, only the yellow and black samples were exposed to a controlled composting environment via respirometry, reducing to 16 the number of samples. The organic compound generated by the biodegradation process was analyzed by the ecotoxicity tests. It was observed that the coating layer acted as a barrier that inhibits degradation of the plastic when exposed to weathering. The addition of pro-degrading agents promoted acceleration in the degradation process, promoting the migration of the metal ion to the medium without affecting the final quality of the organic compost. (author)

  4. Chitosan films and blends for packaging material.

    Science.gov (United States)

    van den Broek, Lambertus A M; Knoop, Rutger J I; Kappen, Frans H J; Boeriu, Carmen G

    2015-02-13

    An increased interest for hygiene in everyday life as well as in food, feed and medical issues lead to a strong interest in films and blends to prevent the growth and accumulation of harmful bacteria. A growing trend is to use synthetic and natural antimicrobial polymers, to provide non-migratory and non-depleting protection agents for application in films, coatings and packaging. In food packaging, antimicrobial effects add up to the barrier properties of the materials, to increase the shelf life and product quality. Chitosan is a natural bioactive polysaccharide with intrinsic antimicrobial activity and, due to its exceptional physicochemical properties imparted by the polysaccharide backbone, has been recognized as a natural alternative to chemically synthesized antimicrobial polymers. This, associated with the increasing preference for biofunctional materials from renewable resources, resulted in a significant interest on the potential for application of chitosan in packaging materials. In this review we describe the latest developments of chitosan films and blends as packaging material. Copyright © 2014 Elsevier Ltd. All rights reserved.

  5. The comparison of antimicrobial packaging properties with different applications incorporation method of active material

    Science.gov (United States)

    Anwar, R. W.; Sugiarto; Warsiki, E.

    2018-03-01

    Contamination after the processing of products during storage, distribution and marketing is one of the main causes of food safety issues. Handling of food products after processing can be done during the packaging process. Antimicrobial (AM) active packaging is one of the concept of packaging product development by utilize the interaction between the product and the packaging environment that can delay the bacterial damage by killing or reducing bacterial growth. The active system is formed by incorporating an antimicrobial agent against a packaging matrix that will function as a carrier. Many incorporation methods have been developed in this packaging-making concept which were direct mixing, polishing, and encapsulation. The aims of this research were to examine the different of the AM packaging performances including its stability and effectiveness of its function that would be produced by three different methods. The stability of the packaging function was analyzed by looking at the diffusivity of the active ingredient to the matrix using SEM. The effectiveness was analyzed by the ability of the packaging to prevent the growing of the microbial. The results showed that different incorporation methods resulted on different characteristics of the AM packaging.

  6. Cost analysis of low energy electron accelerator for film curing

    International Nuclear Information System (INIS)

    Ochi, Masafumi

    2003-01-01

    Low energy electron accelerators are recognized as one of the advanced curing means of converting processes for films and papers. In the last three years the price of the accelerator equipment has been greatly reduced. The targeted application areas are mainly processes of curing inks, coatings, and adhesives to make packaging materials. The operating cost analyses were made for electron beam (EB) processes over the conventional ones without EB. Then three new proposals for cost reduction of EB processes are introduced. Also being developed are new EB chemistries such as coatings, laminating adhesives and inks. EB processes give instantaneous cure and EB chemistries are basically non solvent causing less VOC emission to the environment. These developments of both equipment and chemistries might have a potential to change conventional packaging film industries. (author)

  7. Nanocellulose fibers applied in PLA composites for food packaging applications

    DEFF Research Database (Denmark)

    Trifol Guzman, Jon; Garciad, A.; Mericer, C.

    Poly (lactic acid) (PLA) has long been advocated as one of the best candidates for bio-based food packaging, but low thermal stability, slow crystallization, high oxygen and water permeability are drawbacks that still limits the use of PLA in a broader range of applications.The goal...... of this research project has been to improve the permeability of PLA by use of nanocellulose or by combination of nanocellulose and nanoclay in PLA composites. The cellulose nanofibers (CNF) were extracted from sisal fibers using an optimized up-scalable three-step chemical protocol. Composites with both CNF...... properties of PLA. In particular 1 wt% of CNF and NC resulted in a 63% of reduction on the oxygen transmission rate and a 57% on the water vapor transmission rate, while a 5 wt% PLA/CNF/NC resulted in a 89% and a 75% of decrease respectively....

  8. Raman spectroscopy, electronic microscopy and SPME-GC-MS to elucidate the mode of action of a new antimicrobial food packaging material.

    Science.gov (United States)

    Clemente, Isabel; Aznar, Margarita; Salafranca, Jesús; Nerín, Cristina

    2017-02-01

    One critical challenge when developing a new antimicrobial packaging material is to demonstrate the mode of action of the antimicrobials incorporated into the packaging. For this task, several analytical techniques as well as microbiology are required. In this work, the antimicrobial properties of benzyl isothiocyanate, allyl isothiocyanate and essential oils of cinnamon and oregano against several moulds and bacteria have been evaluated. Benzyl isothiocyanate showed the highest antimicrobial activity and it was selected for developing the new active packaging material. Scanning electron microscopy and Raman spectroscopy were successfully used to demonstrate the mode of action of benzyl isothiocyanate on Escherichia coli. Bacteria exhibited external modifications such as oval shape and the presence of septum surface, but they did not show any disruption or membrane damage. To provide data on the in vitro action of benzyl isothiocyanate and the presence of inhibition halos, the transfer mechanism to the cells was assessed using solid-phase microextraction-gas chromatography-mass spectrometry. Based on the transfer system, action mechanism and its stronger antimicrobial activity, benzyl isothiocyanate was incorporated to two kinds of antimicrobial labels. The labels were stable and active for 140 days against two mould producers of ochratoxin A; Penicillium verrucosum is more sensitive than Aspergillus ochraceus. Details about the analytical techniques and the results obtained are shown and discussed. Graphical Abstract Antimicrobial evaluation of pure compounds, incorporation in the packaging and study for mode of action on S. coli by Raman, SEM and SPME-GC-MS.

  9. Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan

    Science.gov (United States)

    Washio, Kunihiko; Kouta, Hikaru

    2002-06-01

    This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

  10. Time temperature indicators as devices intelligent packaging

    Directory of Open Access Journals (Sweden)

    Adriana Pavelková

    2013-01-01

    Full Text Available Food packaging is an important part of food production. Temperature is a one of crucial factor which affecting the quality and safety of food products during distribution, transport and storage. The one way of control of food quality and safety is the application of new packaging systems, which also include the intelligent or smart packaging. Intelligent packaging is a packaging system using different indicators for monitoring the conditions of production, but in particular the conditions during transport and storage. Among these indicators include the time-temperature indicators to monitor changes in temperature, which is exposed the product and to inform consumers about the potential risks associated with consumption of these products. Time temperature indicators are devices that show an irreversible change in a physical characteristic, usually color or shape, in response to temperature history. Some are designed to monitor the evolution of temperature with time along the distribution chain and others are designed to be used in the consumer packages.

  11. Recent improvements in program packages SHUFFLE and FAR

    International Nuclear Information System (INIS)

    Slavic, S.; Kromar, M.; Zefran, B.

    1996-01-01

    Program packages SHUFFLE and FAR were developed at 'Jozef Stefan' Institute to monitor all changes of fuel assemblies during a nuclear power plant operation. Both packages were written in the Clipper language which is suitable for data base applications and allows straightforward communications with other available data bases. Packages currently run on PC machines under DOS operating system. Both packages are in routine use at a nuclear power plant Krsko, but they can be applied to any PWR power plant without significant modification. Experiences obtained from the utility in past few years triggered several improvements and new features. (author)

  12. Stretchable electronics for wearable and high-current applications

    Science.gov (United States)

    Hilbich, Daniel; Shannon, Lesley; Gray, Bonnie L.

    2016-04-01

    Advances in the development of novel materials and fabrication processes are resulting in an increased number of flexible and stretchable electronics applications. This evolving technology enables new devices that are not readily fabricated using traditional silicon processes, and has the potential to transform many industries, including personalized healthcare, consumer electronics, and communication. Fabrication of stretchable devices is typically achieved through the use of stretchable polymer-based conductors, or more rigid conductors, such as metals, with patterned geometries that can accommodate stretching. Although the application space for stretchable electronics is extensive, the practicality of these devices can be severely limited by power consumption and cost. Moreover, strict process flows can impede innovation that would otherwise enable new applications. In an effort to overcome these impediments, we present two modified approaches and applications based on a newly developed process for stretchable and flexible electronics fabrication. This includes the development of a metallization pattern stamping process allowing for 1) stretchable interconnects to be directly integrated with stretchable/wearable fabrics, and 2) a process variation enabling aligned multi-layer devices with integrated ferromagnetic nanocomposite polymer components enabling a fully-flexible electromagnetic microactuator for large-magnitude magnetic field generation. The wearable interconnects are measured, showing high conductivity, and can accommodate over 20% strain before experiencing conductive failure. The electromagnetic actuators have been fabricated and initial measurements show well-aligned, highly conductive, isolated metal layers. These two applications demonstrate the versatility of the newly developed process and suggest potential for its furthered use in stretchable electronics and MEMS applications.

  13. Applications of Organic and Printed Electronics A Technology-Enabled Revolution

    CERN Document Server

    2013-01-01

    Organic and printed electronics can enable a revolution in the applications of electronics and this book offers readers an overview of the state-of-the-art in this rapidly evolving domain.  The potentially low cost, compatibility with flexible substrates and the wealth of devices that characterize organic and printed electronics will make possible applications that go far beyond the well-known displays made with large-area silicon electronics. Since organic electronics are still in their early stage, undergoing transition from lab-scale and prototype activities to production, this book serves as a valuable snapshot of the current landscape of the different devices enabled by this technology, reviewing all applications that are developing and those can be foreseen.   Provides a complete roadmap for organic and printed electronics research and development for the next several years; Includes an overview of the printing processes for organic electronics, along with state of the art applications, such as solar ...

  14. Trends in antimicrobial food packaging systems: Emitting sachets and absorbent pads

    Science.gov (United States)

    Active antimicrobial packaging interacts with packaged food and headspace to reduce, retard, or even inhibit the growth of spoilage and pathogenic microorganisms. Sachets and pads are one of the most successful applications of active food packaging. This review discusses recent developments of antim...

  15. Advances in electronic-nose technologies developed for biomedical applications.

    Science.gov (United States)

    Wilson, Alphus D; Baietto, Manuela

    2011-01-01

    The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

  16. Advances in Electronic-Nose Technologies Developed for Biomedical Applications

    Directory of Open Access Journals (Sweden)

    Alphus D. Wilson

    2011-01-01

    Full Text Available The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

  17. ESTAR, PSTAR, ASTAR. A PC package for calculating stopping powers and ranges of electrons, protons and helium ions. Version 2

    International Nuclear Information System (INIS)

    Berger, M.J.

    1993-01-01

    A PC package is documented for calculating stopping powers and ranges of electrons, protons and helium ions in matter for energies from 1 keV up to 10 GeV. Stopping powers and ranges for electrons can be calculated for any element, compound or mixture. Stopping powers and ranges of protons and helium ions can be calculated for 74 materials (26 elements and 48 compounds and mixtures). The files are stored on two HD diskettes in compressed form. Both executable files for IBM PC and Fortran-77 source files are provided. All three programs require 5.2 Mb of disk space. This set of two diskettes with detailed documentation is available upon request, cost free, from the IAEA Nuclear Data Section. (author). 25 refs, 4 tabs

  18. Waste package/repository impact study: Final report

    Energy Technology Data Exchange (ETDEWEB)

    1985-09-01

    The Waste Package/Repository Impact Study was conducted to evaluate the feasibility of using the current reference salt waste package in the salt repository conceptual design. All elements of the repository that may impact waste package parameters, i.e., (size, weight, heat load) were evaluated. The repository elements considered included waste hoist feasibility, transporter and emplacement machine feasibility, subsurface entry dimensions, feasibility of emplacement configuration, and temperature limits. The evaluations are discussed in detail with supplemental technical data included in Appendices to this report, as appropriate. Results and conclusions of the evaluations are discussed in light of the acceptability of the current reference waste package as the basis for salt conceptual design. Finally, recommendations are made relative to the salt project position on the application of the reference waste package as a basis for future design activities. 31 refs., 11 figs., 11 tabs.

  19. Waste package/repository impact study: Final report

    International Nuclear Information System (INIS)

    1985-09-01

    The Waste Package/Repository Impact Study was conducted to evaluate the feasibility of using the current reference salt waste package in the salt repository conceptual design. All elements of the repository that may impact waste package parameters, i.e., (size, weight, heat load) were evaluated. The repository elements considered included waste hoist feasibility, transporter and emplacement machine feasibility, subsurface entry dimensions, feasibility of emplacement configuration, and temperature limits. The evaluations are discussed in detail with supplemental technical data included in Appendices to this report, as appropriate. Results and conclusions of the evaluations are discussed in light of the acceptability of the current reference waste package as the basis for salt conceptual design. Finally, recommendations are made relative to the salt project position on the application of the reference waste package as a basis for future design activities. 31 refs., 11 figs., 11 tabs

  20. Survey of potential electronic applications of high temperature superconductors

    International Nuclear Information System (INIS)

    Hammond, R.B.; Bourne, L.C.

    1991-01-01

    In this paper the authors present a survey of the potential electronic applications of high temperature superconductor (HTSC) thin films. During the past four years there has been substantial speculation on this topic. The authors will cover only a small fraction of the potential electronic applications that have been identified. Their treatment is influenced by the developments over the past few years in materials and device development and in market analysis. They present their view of the most promising potential applications. Superconductors have two important properties that make them attractive for electronic applications. These are (a) low surface resistance at high frequencies, and (b) the Josephson effect

  1. In-Package Chemistry Abstraction

    Energy Technology Data Exchange (ETDEWEB)

    E. Thomas

    2004-11-09

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste

  2. In-Package Chemistry Abstraction

    International Nuclear Information System (INIS)

    E. Thomas

    2004-01-01

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

  3. Application of electron accelerator worldwide

    International Nuclear Information System (INIS)

    Machi, Sueo

    2003-01-01

    Electron accelerator is an important radiation source for radiation technology, which covers broad fields such as industry, health care, food and environmental protection. There are about 1,000 electron accelerators for radiation processing worldwide. Electron accelerator has advantage over Co-60 irradiator in term of high dose rate and power, assurance of safety, and higher economic performance at larger volume of irradiation. Accelerator generating higher energy in the range of 10 MeV and high power electron beam is now commercially available. There is a trend to use high-energy electron accelerator replacing Co-60 in case of large through-put of medical products. Irradiated foods, in particular species, are on the commercial market in 35 countries. Electron accelerator is used efficiently and economically for production of new or modified polymeric materials through radiation-induced cross-linking, grafting and polymerization reaction. Another important application of electron beam is the curing of surface coatings in the manufacture of products. Electron accelerators of large capacity are used for cleaning exhaust gases in industrial scale. Economic feasibility studies of this electron beam process have shown that this technology is more cost effective than the conventional process. It should be noted that the conventional limestone process produce gypsum as a by-product, which cannot be used in some countries. By contrast, the by-product of the electron beam process is a valuable fertilizer. (Y. Tanaka)

  4. Application of electron accelerator worldwide

    Energy Technology Data Exchange (ETDEWEB)

    Machi, Sueo [Japan Atomic Industrial Forum, Inc., Tokyo (Japan)

    2003-02-01

    Electron accelerator is an important radiation source for radiation technology, which covers broad fields such as industry, health care, food and environmental protection. There are about 1,000 electron accelerators for radiation processing worldwide. Electron accelerator has advantage over Co-60 irradiator in term of high dose rate and power, assurance of safety, and higher economic performance at larger volume of irradiation. Accelerator generating higher energy in the range of 10 MeV and high power electron beam is now commercially available. There is a trend to use high-energy electron accelerator replacing Co-60 in case of large through-put of medical products. Irradiated foods, in particular species, are on the commercial market in 35 countries. Electron accelerator is used efficiently and economically for production of new or modified polymeric materials through radiation-induced cross-linking, grafting and polymerization reaction. Another important application of electron beam is the curing of surface coatings in the manufacture of products. Electron accelerators of large capacity are used for cleaning exhaust gases in industrial scale. Economic feasibility studies of this electron beam process have shown that this technology is more cost effective than the conventional process. It should be noted that the conventional limestone process produce gypsum as a by-product, which cannot be used in some countries. By contrast, the by-product of the electron beam process is a valuable fertilizer. (Y. Tanaka)

  5. Ferrite nanoparticles: Synthesis, characterisation and applications in electronic device

    Energy Technology Data Exchange (ETDEWEB)

    Kefeni, Kebede K., E-mail: kkefeni@gmail.com; Msagati, Titus A.M.; Mamba, Bhekie B.

    2017-01-15

    Highlights: • Available synthesis methods of ferrite nanoparticles (FNPs) are briefly reviewed. • Summary of the advantage and limitation of FNPs synthesis techniques are presented. • The existing most common FNPs characterisation techniques are briefly reviewed. • Major application areas of FNPs in electronic materials are reviewed. - Abstract: Ferrite nanoparticles (FNPs) have attracted a great interest due to their wide applications in several areas such as biomedical, wastewater treatment, catalyst and electronic device. This review focuses on the synthesis, characterisation and application of FNPs in electronic device with more emphasis on the recently published works. The most commonly used synthesis techniques along with their advantages and limitations are discussed. The available characterisation techniques and their application in electronic materials such as sensors and biosensors, energy storage, microwave device, electromagnetic interference shielding and high-density recording media are briefly reviewed.

  6. Applications in Electronics Pervading Industry, Environment and Society

    CERN Document Server

    2016-01-01

    This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. A wide spectrum of application domains are covered, from automotive to space and from health to security, and special attention is devoted to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2014 APPLEPIES Conference, held in Rome, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas covered by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and th...

  7. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    Science.gov (United States)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

  8. Printed circuits and their applications : Which way forward?

    NARCIS (Netherlands)

    Cantatore, Eugenio; Kratochvil, E.J.W.L.

    2015-01-01

    The continuous advancements in printed electronics make nowadays feasible the design of printed circuits which enable meaningful applications. Examples include ultra-low cost sensors embedded in food packaging, large-area sensing surfaces and biomedical assays. This paper offers an overview of

  9. Materials and applications of bioresorbable electronics

    Science.gov (United States)

    Huang, Xian

    2018-01-01

    Bioresorbable electronics is a new type of electronics technology that can potentially lead to biodegradable and dissolvable electronic devices to replace current built-to-last circuits predominantly used in implantable devices and consumer electronics. Such devices dissolve in an aqueous environment in time periods from seconds to months, and generate biological safe products. This paper reviews materials, fabrication techniques, and applications of bioresorbable electronics, and aims to inspire more revolutionary bioresorbable systems that can generate broader social and economic impact. Existing challenges and potential solutions in developing bioresorbable electronics have also been presented to arouse more joint research efforts in this field to build systematic technology framework. Project supported by the National Natural Science Foundation of China (No. 61604108) and the Natural Science Foundation of Tianjin (No. 16JCYBJC40600).

  10. Calibration data Analysis Package (CAP): An IDL based widget application for analysis of X-ray calibration data

    Science.gov (United States)

    Vaishali, S.; Narendranath, S.; Sreekumar, P.

    An IDL (interactive data language) based widget application developed for the calibration of C1XS (Narendranath et al., 2010) instrument on Chandrayaan-1 is modified to provide a generic package for the analysis of data from x-ray detectors. The package supports files in ascii as well as FITS format. Data can be fitted with a list of inbuilt functions to derive the spectral redistribution function (SRF). We have incorporated functions such as `HYPERMET' (Philips & Marlow 1976) including non Gaussian components in the SRF such as low energy tail, low energy shelf and escape peak. In addition users can incorporate additional models which may be required to model detector specific features. Spectral fits use a routine `mpfit' which uses Leven-Marquardt least squares fitting method. The SRF derived from this tool can be fed into an accompanying program to generate a redistribution matrix file (RMF) compatible with the X-ray spectral analysis package XSPEC. The tool provides a user friendly interface of help to beginners and also provides transparency and advanced features for experts.

  11. Migration and sorption phenomena in packaged foods.

    Science.gov (United States)

    Gnanasekharan, V; Floros, J D

    1997-10-01

    Rapidly developing analytical capabilities and continuously evolving stringent regulations have made food/package interactions a subject of intense research. This article focuses on: (1) the migration of package components such as oligomers and monomers, processing aids, additives, and residual reactants in to packaged foods, and (2) sorption of food components such as flavors, lipids, and moisture into packages. Principles of diffusion and thermodynamics are utilized to describe the mathematics of migration and sorption. Mathematical models are developed from first principles, and their applicability is illustrated using numerical simulations and published data. Simulations indicate that available models are system (polymer-penetrant) specific. Furthermore, some models best describe the early stages of migration/sorption, whereas others should be used for the late stages of these phenomena. Migration- and/or sorption-related problems with respect to glass, metal, paper-based and polymeric packaging materials are discussed, and their importance is illustrated using published examples. The effects of migrating and absorbed components on food safety, quality, and the environment are presented for various foods and packaging materials. The impact of currently popular packaging techniques such as microwavable, ovenable, and retortable packaging on migration and sorption are discussed with examples. Analytical techniques for investigating migration and sorption phenomena in food packaging are critically reviewed, with special emphasis on the use and characteristics of food-simulating liquids (FSLs). Finally, domestic and international regulations concerning migration in packaged foods, and their impact on food packaging is briefly presented.

  12. Lattice Boltzmann schemes for convection-diffusion phenomena : application to packages of agricultural products

    NARCIS (Netherlands)

    Sman, van der R.G.M.

    1999-01-01

    Packaging is crucial for the control of quality of fresh agricultural products. How to optimise the packaging design for a particular product and distribution chain, is still not fully understood. Various empirical studies have shown that existing packaging designs can still be improved

  13. Feature Selection with the Boruta Package

    OpenAIRE

    Kursa, Miron B.; Rudnicki, Witold R.

    2010-01-01

    This article describes a R package Boruta, implementing a novel feature selection algorithm for finding emph{all relevant variables}. The algorithm is designed as a wrapper around a Random Forest classification algorithm. It iteratively removes the features which are proved by a statistical test to be less relevant than random probes. The Boruta package provides a convenient interface to the algorithm. The short description of the algorithm and examples of its application are presented.

  14. Electronics for a focal plane crystal spectrometer

    International Nuclear Information System (INIS)

    Goeke, R.F.

    1978-01-01

    The HEAO-B program forced the usual constraints upon the spacecraft experimental electronics: high reliability, low power consumption, and tight packaging at reasonable cost. The programmable high voltage power supplies were unique in both application and simplicity of manufacture. The hybridized measurement chain is a modification of that used on the SAS-C program; the charge amplifier design in particular shows definite improvement in performance over previous work

  15. The application of electron paramagnetic resonance in biomedical research

    International Nuclear Information System (INIS)

    Qu Ximei; Wang Liqin; Zhang Wenyi; Liu Zhongchao; Cui Songye; Feng Xin; Jiaoling

    2013-01-01

    Electron paramagnetic resonance technique has been found more than half a century, for free radicals detection application, it has been applied to various research studies, and promotes the development of the biomedicine. This article summarized the various free radicals measurement by the electron paramagnetic resonance in biology tissue, and the application of the spin labeling and electron paramagnetic resonance imaging technology in biomedicine. (authors)

  16. The Effect of wheat straw particle size on the mechanical and water absorption properties of wheat straw/low density polyethylene biocomposites for packaging applications

    Directory of Open Access Journals (Sweden)

    Behjat Tajeddin

    2017-08-01

    Full Text Available Natural composites with biodegradability properties can be used as a renewable alternative to replacing conventional plastics. Thus, to reduce the plastics applications in the packaging industry, biocomposites content of wheat straw (with 40, 100, 140 mesh as a natural biodegradable composite and low density polyethylene (LDPE as a common synthetic polymer in the packaging industry were prepared and characterized by the mechanical and water absorption properties. Polyethylene-graft-maleic anhydride was used as a compatibilizer material. Morphology of wheat straw flour was studied by optical microscope to obtain the aspect ratio (L/D. The tensile and flexural tests were applied for determining mechanical properties and scanning electron microscope (SEM was used for particles distribution and sample structures. The water absorption of the samples was calculated by weight difference. The results indicated that the particle size of wheat straw four and the L/D amount are Significantly affected on the tensile strength and water absorption of the samples. However, the effect of wheat sraw particle size on the flexural strength was not significant. Overall conclusions show that by increasing the particle size of the filler (wheat straw, can prepare the biocomposite with better tensile strength and less water absorption compared with smaller particle size.

  17. A 3D printed dual GSM band near isotropic on-package antenna

    KAUST Repository

    Zhen, Su; Shamim, Atif

    2017-01-01

    .67 and 3.27 dBi at 900 MHz and 1800 MHz respectively). The antenna is printed with silver ink on a 3D printed polymer based package. The package houses the GSM electronics and the battery. By optimizing the antenna arms width and length, a near

  18. Effect of PPG-PEG-PPG on the tocopherol-controlled release from films intended for food-packaging applications.

    Science.gov (United States)

    Castro López, María del Mar; Dopico García, Sonia; Ares Pernas, Ana; López Vilariño, José Manuel; González Rodríguez, María Victoria

    2012-08-22

    The feasibility of novel controlled release systems for the delivery of active substances from films intended for food packaging was investigated. Because polyolefins are used highly for food-packaging applications, the reported high retention degree of antioxidants has limited their use for active packaging. Thus, in this study, PP films modified with different chain extenders have been developed to favor and control the release rates of the low molecular weight antioxidant tocopherol. The use of different chain extenders as polymer modifiers (PE-PEG M(w), 575; and PPG-PEG-PPG M(w), 2000) has caused significant changes in tocopherol-specific release properties. High-performance liquid chromatography coupled to PDA-FL and PDA-MS was used to test tocopherol and chain extender migration, respectively. The release of tocopherol from the prepared films with two chain extenders into two food simulants was studied. Different temperatures and storage times were also tested. Varying the structural features of the films with the incorporation of different levels of PPG-PEG-PPG, the release of tocopherol (food-packaging additive) into different ethanolic simulants could be clearly controlled. The effect of the temperature and storage time on the release of the antioxidant has been outstanding as their values increased. The migration of the chain extender, also tested, was well below the limits set by European legislation.

  19. Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

    Science.gov (United States)

    Ghaffaroam. Reza

    2014-01-01

    Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

  20. Universal storage/transport/disposal packages

    International Nuclear Information System (INIS)

    Smith, M.L.

    1992-01-01

    In this paper a concept for a more robust Engineered Barrier System (EBS) that is part of an integrated waste management system is presented. This integrated system uses a thick walled metal package as the basic component of an integrated system for utility site storage, MRS storage, transportation, and disposal. Overpacks are used where necessary to supplement the basic package in each application. This integrated system combines the advantages of a robust EBS (improved margin and confidence in the repository) with a systems approach that can simplify the waste management system and reduce costs

  1. Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

    International Nuclear Information System (INIS)

    Blanton, P.

    2000-01-01

    This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

  2. Design aspects of plutonium air-transportable packages

    International Nuclear Information System (INIS)

    Allen, G.C.; Moya, J.L.; Pierce, J.D.; Attaway, S.W.

    1989-01-01

    Recent worldwide interest in transporting plutonium powders by air has created a need for expanding the packaging technology base as well as improving their understanding of how plutonium air transport (PAT) packagings perform during severe accident tests. Historically it has not been possible to establish design rules for individual package components because of the complex way parts interacted in forming a successful whole unit. Also, computer analyses were only considered valid for very limited portions of the design effort because of large deformations, localized tearing occurring in the package during accident testing, and extensive use of orthotropic materials. Consequently, iterative design and experimentation has historically been used to develop plutonium air-transportable packages. Full-scale prototypes have been tested since scaling of packages utilizing wood as an energy absorber and thermal insulator has not proven to be very successful. This is because the wood grain and dynamic performance of the wood during crush do not always scale. The high cost of full-scale testing of large packages has certainly hindered obtaining additional data and development new designs. The testing criteria for PAT packages, as described in the US Nuclear Regulatory Commission's Qualification Criteria to Certify a Package for Air Transport of Plutonium, NUREG-0360, 1978, are summarized. Computer modeling techniques have greatly improved over the last ten years, and there are some areas of opportunity for future applications to plutonium air-transportable package design problems. Having developed a better understanding of the performance of current packages, they have the opportunity to make major improvements in new packaging concepts. Each of these areas is explored in further depth to establish their impact on design practices for air-transportable packages

  3. Application of Poly(hydroxyalkanoate) In Food Packaging: Improvements by Nanotechnology

    OpenAIRE

    Khosravi-Darani, K.; Bucci, D. Z.

    2015-01-01

    The environmental impact of plastic usage is of critical concern and too great to repair. A shift toward biodegradable food packaging is one option. The aim of this review paper is the study of the potential of biodegradable materials for food packaging. The main characteristics in relation to food usage can be narrowed down to mass transfer (gas and water vapor), thermal and mechanical properties. Among several kinds of biodegradable polymers, poly(hydroxyalkanoate) is one of the favorable c...

  4. Directory of certificates of compliance for radioactive materials packages. Volume 1, Revision 17: Report of NRC approved packages

    International Nuclear Information System (INIS)

    1994-10-01

    This directory contains a Report of NRC Approved Packages (Volume 1), Certificates of Compliance (Volume 2), and a Report of NRC Approved Quality Assurance Programs for Radioactive Materials Packages (Volume 3). The purpose of this directory is to make available a convenient source of information on Quality Assurance Programs and Packagings which have been approved by the US Nuclear Regulatory Commission. Shipments of radioactive material utilizing these packagings must be in accordance with the provisions of 49 CFR section 173.471 and 10 CFR Part 71, as applicable. In satisfying the requirements of Section 71.12, it is the responsibility of the licensees to insure themselves that they have a copy of the current approval and conduct their transportation activities in accordance with an NRC approved quality assurance program

  5. The Application of PSIM & Matlab/ Simulink in Teaching of Power Electronics Courses

    Directory of Open Access Journals (Sweden)

    Sameer Hanna Khader

    2011-07-01

    Full Text Available This paper presents a comparison analysis between two engineering software platforms, Matlab/Simulink & PSIM, which are used as major educational tools in teaching of power electronics and electrical drive courses, in additional to conducted research in these fields. The comparison analysis is based on studying the design simplicity of the module, time consumed in building of the module, accuracy, functionality, simulation time, and the acceptability of obtained results. Various power electronic simulation circuits are illustrated and the results are processed and displayed. The simulation results states that Matlab/Simulink is a suitable platform for control and regulation of simulation processes, in additional to its dominant role in conducting research tasks. Conversely, PSIM is dedicated to power electronic circuits and machine simulation tasks with fast and robust algorithms and suitable for educational purposes. It is recommended that both packages can be used in teaching power electronics courses.

  6. Around and about an application of the GAMLSS package to non-stationary flood frequency analysis

    Science.gov (United States)

    Debele, S. E.; Bogdanowicz, E.; Strupczewski, W. G.

    2017-08-01

    The non-stationarity of hydrologic processes due to climate change or human activities is challenging for the researchers and practitioners. However, the practical requirements for taking into account non-stationarity as a support in decision-making procedures exceed the up-to-date development of the theory and the of software. Currently, the most popular and freely available software package that allows for non-stationary statistical analysis is the GAMLSS (generalized additive models for location, scale and shape) package. GAMLSS has been used in a variety of fields. There are also several papers recommending GAMLSS in hydrological problems; however, there are still important issues which have not previously been discussed concerning mainly GAMLSS applicability not only for research and academic purposes, but also in a design practice. In this paper, we present a summary of our experiences in the implementation of GAMLSS to non-stationary flood frequency analysis, highlighting its advantages and pointing out weaknesses with regard to methodological and practical topics.

  7. Feature Selection with the Boruta Package

    Directory of Open Access Journals (Sweden)

    Miron B. Kursa

    2010-10-01

    Full Text Available This article describes a R package Boruta, implementing a novel feature selection algorithm for finding emph{all relevant variables}. The algorithm is designed as a wrapper around a Random Forest classification algorithm. It iteratively removes the features which are proved by a statistical test to be less relevant than random probes. The Boruta package provides a convenient interface to the algorithm. The short description of the algorithm and examples of its application are presented.

  8. Study of herbicide ametryne degradation in HDPE packaging using the advanced oxidation process by ionizing radiation

    International Nuclear Information System (INIS)

    Andrade, Debora Cristina de

    2008-01-01

    This study is part of the project with the objective to evaluate pesticides degradation for decontamination of commercial polymeric packaging of high density polyethylene, HDPE, used in agriculture. The herbicide used to this study was the herbicide ametryne (commercial name, Gesapax 500), due to its great use, mainly on field crops and on corn. Ametryne is commercialized since 1975, and, depending on the pesticide formulation and type of application, residues may be detectable in water, soil and on the surfaces for months or years. In order to evaluate the efficiency of radiation processing on removal the pesticides contamination, HDPE packaging were irradiated using Radiation Dynamics Electron Beam Accelerator with 1,5 MeV energy and 37 kW, in batch system. The samples were irradiated with water, in various absorbed doses. Ametryne was analyzed by gas chromatography (GC Shimadzu 17A), after extraction with hexane/dichloromethane (1:1 v/v) solution. The calibration curve was obtained with a regression coefficient of 0.986, and the relative standard deviation was lower than 10%. The radiation processing yield was evaluated by the rate of ametryne degradation and by the destruction G-value (Gd). The electron beam irradiation processing, showed high efficiency in destroying ametryne in the HDPE packaging when the samples were irradiated in presence of small quantities of water. (author)

  9. Green Composites Made of Bamboo Fabric and Poly (Lactic) Acid for Packaging Applications—A Review

    Science.gov (United States)

    Nurul Fazita, M.R.; Jayaraman, Krishnan; Bhattacharyya, Debes; Mohamad Haafiz, M.K.; Saurabh, Chaturbhuj K.; Hussin, M. Hazwan; H.P.S., Abdul Khalil

    2016-01-01

    Petroleum based thermoplastics are widely used in a range of applications, particularly in packaging. However, their usage has resulted in soaring pollutant emissions. Thus, researchers have been driven to seek environmentally friendly alternative packaging materials which are recyclable as well as biodegradable. Due to the excellent mechanical properties of natural fibres, they have been extensively used to reinforce biopolymers to produce biodegradable composites. A detailed understanding of the properties of such composite materials is vital for assessing their applicability to various products. The present review discusses several functional properties related to packaging applications in order to explore the potential of bamboo fibre fabric-poly (lactic) acid composites for packaging applications. Physical properties, heat deflection temperature, impact resistance, recyclability and biodegradability are important functional properties of packaging materials. In this review, we will also comprehensively discuss the chronological events and applications of natural fibre biopolymer composites. PMID:28773558

  10. PAINeT: An object-oriented software package for simulations of flow-field, transport coefficients and flux terms in non-equilibrium gas mixture flows

    Science.gov (United States)

    Istomin, V. A.

    2018-05-01

    The software package Planet Atmosphere Investigator of Non-equilibrium Thermodynamics (PAINeT) has been devel-oped for studying the non-equilibrium effects associated with electronic excitation, chemical reactions and ionization. These studies are necessary for modeling process in shock tubes, in high enthalpy flows, in nozzles or jet engines, in combustion and explosion processes, in modern plasma-chemical and laser technologies. The advantages and possibilities of the package implementation are stated. Within the framework of the package implementation, based on kinetic theory approximations (one-temperature and state-to-state approaches), calculations are carried out, and the limits of applicability of a simplified description of shock-heated air flows and any other mixtures chosen by the user are given. Using kinetic theory algorithms, a numerical calculation of the heat fluxes and relaxation terms can be performed, which is necessary for further comparison of engineering simulation with experi-mental data. The influence of state-to-state distributions over electronic energy levels on the coefficients of thermal conductivity, diffusion, heat fluxes and diffusion velocities of the components of various gas mixtures behind shock waves is studied. Using the software package the accuracy of different approximations of the kinetic theory of gases is estimated. As an example state-resolved atomic ionized mixture of N/N+/O/O+/e- is considered. It is shown that state-resolved diffusion coefficients of neutral and ionized species vary from level to level. Comparing results of engineering applications with those given by PAINeT, recommendations for adequate models selection are proposed.

  11. Application of design of experiments to welding process of food packaging

    Directory of Open Access Journals (Sweden)

    Jan Hron

    2013-01-01

    Full Text Available Design of experiments is one of the many problem-solving quality tools that can be used for various investigations such as finding the significant factors in a process, the effect of each factor on the outcome, the variance in the process, troubleshooting the machine problems, screening the parameters, and modeling the processes. The objectives of the experiment in this study are two-fold. The first objective is to identify the parameters of food packaging welding, which influence the response strength of a weld. The second objective is to identify the process parameters that affect the variability in the weld strength. The results of the experiment have stimulated the engineering team within the company to extend the applications of DOE in other core processes for performance improvement and variability reduction activities.

  12. Review of criticality safety and shielding analysis issues for transportation packages

    International Nuclear Information System (INIS)

    Parks, C.V.; Broadhead, B.L.

    1995-01-01

    The staff of the Nuclear Engineering Applications Section (NEAS) at Oak Ridge National Laboratory (ORNL) have been involved for over 25 years with the development and application of computational tools for use in analyzing the criticality safety and shielding features of transportation packages carrying radioactive material (RAM). The majority of the computational tools developed by ORNL/NEAS have been included within the SCALE modular code system (SCALE 1995). This code system has been used throughout the world for the evaluation of nuclear facility and package designs. With this development and application experience as a basis, this paper highlights a number of criticality safety and shielding analysis issues that confront the designer and reviewer of a new RAM package. Changes in the types and quantities of material that need to be shipped will keep these issues before the technical community and provide challenges to future package design and certification

  13. Development and Application of Chlorinated, Fluorinated and Technological Polymer Films Modified by Grafting Process Using Electron Beam and Gamma Radiation

    Energy Technology Data Exchange (ETDEWEB)

    Manzoli, J E [Nuclear Energy National Commission, Nuclear and Energetic Research Institute, Sao Paulo (Brazil); Universidade Sao Judas Tadeu, Sao Paulo (Brazil); Geraldo, A B.C.; Moura, E; Somesari, E S.R.; Silveira, C G; Oikawa, H; Moreira, N S; Forbicini, C [Nuclear Energy National Commission, Nuclear and Energetic Research Institute, Sao Paulo (Brazil); Tenorio, E [FATEC, Tatui (Brazil); Augusto, C G [IFSP, Sao Paulo (Brazil); Universidade Sao Judas Tadeu, Sao Paulo (Brazil); Panzarini, L C.G.A. [FEI, Sao Bernardo do Campo (Brazil)

    2012-09-15

    The ionizing irradiation (electron beam and gamma irradiation) induced grafting to fluorinated and chlorinated polymeric films were studied. Styrene grafting onto fluorinated and perfluorinated polymers and their ulterior sulfonation constitute a process to produce ionomers for many applications. The modification of polyvinylchloride with dimethylaminethylmethacrylate-heparin grafting attempt for the fact that grafting can be applied in packaging industry as an alternative for decreasing of plasticizer or another chemical species migration, in many cases nocivus contaminant for human health, and, in the specific study of this project, to obtain a less thrombogenic polymer surface to be used in medical applications. The results indicate mutual styrene grafting performed by industrial EB accelerator can be a fast alternative to produce ionomers that can compete in market. The numerical method to simulate diffusion process evolved is simple and fast and applied to fit experimental results. (author)

  14. Stepwise expansion of the bacteriophage ϕ6 procapsid: possible packaging intermediates.

    Science.gov (United States)

    Nemecek, Daniel; Cheng, Naiqian; Qiao, Jian; Mindich, Leonard; Steven, Alasdair C; Heymann, J Bernard

    2011-11-25

    The initial assembly product of bacteriophage ϕ6, the procapsid, undergoes major structural transformation during the sequential packaging of its three segments of single-stranded RNA. The procapsid, a compact icosahedrally symmetric particle with deeply recessed vertices, expands to the spherical mature capsid, increasing the volume available to accommodate the genome by 2.5-fold. It has been proposed that expansion and packaging are linked, with each stage in expansion presenting a binding site for a particular RNA segment. To investigate procapsid transformability, we induced expansion by acidification, heating, and elevated salt concentration. Cryo-electron microscopy reconstructions after all three treatments yielded the same partially expanded particle. Analysis by cryo-electron tomography showed that all vertices of a given capsid were either in a compact or an expanded state, indicating a highly cooperative transition. To benchmark the mature capsid, we analyzed filled (in vivo packaged) capsids. When these particles were induced to release their RNA, they reverted to the same intermediate state as expanded procapsids (intermediate 1) or to a second, further expanded state (intermediate 2). This partial reversibility of expansion suggests that the mature spherical capsid conformation is obtained only when sufficient outward pressure is exerted by packaged RNA. The observation of two intermediates is consistent with the proposed three-step packaging process. The model is further supported by the observation that a mutant capable of packaging the second RNA segment without previously packaging the first segment has enhanced susceptibility for switching spontaneously from the procapsid to the first intermediate state. Published by Elsevier Ltd.

  15. Shielding design of radioactive contaminated metal waste packaging

    International Nuclear Information System (INIS)

    Zou Wenhua; Dong Zhiqiang; Yao Zhenyu; Xu Shuhe; Wang Wen

    2015-01-01

    Focusing on the cylindrical source model to calculate γ dose field of waste packages with the relative formulae then derived. By comparing the calculated data of waste packages of type Ⅷ steel box with the monitoring data, it is found that the cylinder source model could accurately reflect the distributions of γ dose of the waste package. Based on the results of the cylindrical source model, a reasonable shielding technology applicable to waste package containers was designed to meet relevant requirements prescribed in standards about the transport and disposal of radioactive materials. The cylinder source model calculated dose distributions for single package in this paper is simple and easy to implement but slightly larger than the monitoring data providing a certain safety margin for the shielding design. It is suitable for radiological engineering practices. (authors)

  16. Investigations into High Temperature Components and Packaging

    Energy Technology Data Exchange (ETDEWEB)

    Marlino, L.D.; Seiber, L.E.; Scudiere, M.B.; M.S. Chinthavali, M.S.; McCluskey, F.P.

    2007-12-31

    The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105 C water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability. This report is organized with testing of new high temperature capacitors in Section 2 and testing of new 150 C junction temperature trench insulated gate bipolar transistor (IGBTs) in Section 3. Section 4 addresses some operational OPAL-GT information, which was necessary for developing module level tests. Section 5 summarizes calibration of equipment needed for the high temperature testing. Section 6 details some additional work that was funded on silicon carbide (SiC) device testing for high temperature use, and Section 7 is the complete text of a report funded from this effort summarizing packaging methods and their reliability issues for use in high temperature power electronics. Components were tested to evaluate the performance characteristics of the component at different operating temperatures. The temperature of the component is determined by the ambient temperature (i.e., temperature surrounding the device) plus the

  17. A cost effective total power radiometer package for atmospheric research

    International Nuclear Information System (INIS)

    Lyons, B.N.; Kelly, W.M.; Vizard, D.R.; Lidholm, U.S.

    1993-01-01

    Millimeter wave radiometers are being increasingly used for plasma diagnostics and remote sensing applications. To date however the widespread use of such systems, particularly for applications requiring frequency coverage above 100 GHz, have been inhibited by the lack of availability of an appropriately specified commercial package. This paper outlines the design and construction of such a radiometer package and gives details of results obtained to date

  18. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2008-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  19. Cold Plasma Treatment of Biodegradable films and smart packaging

    OpenAIRE

    Pankaj, Shashi

    2015-01-01

    Cold plasma is an emerging technology offering many potential applications for food packaging. While it was originally developed to increase the surface energy of polymers, enhancing their adhesion and printability, it has recently emerged as a powerful tool for surface sterilisation of both food and food packaging materials. The food packaging industry is still dominated by petroleum derived polymers but in the past few decades there has been significant interest in the development of enviro...

  20. Human exposure assessment of silver and copper migrating from an antimicrobial nanocoated packaging material into an acidic food simulant.

    Science.gov (United States)

    Hannon, Joseph Christopher; Kerry, Joseph P; Cruz-Romero, Malco; Azlin-Hasim, Shafrina; Morris, Michael; Cummins, Enda

    2016-09-01

    To examine the human exposure to a novel silver and copper nanoparticle (AgNP and CuNP)/polystyrene-polyethylene oxide block copolymer (PS-b-PEO) food packaging coating, the migration of Ag and Cu into 3% acetic acid (3% HAc) food simulant was assessed at 60 °C for 10 days. Significantly lower migration was observed for Ag (0.46 mg/kg food) compared to Cu (0.82 mg/kg food) measured by inductively coupled plasma - atomic emission spectrometry (ICP-AES). In addition, no distinct population of AgNPs or CuNPs were observed in 3% HAc by nanoparticle tracking analysis (NTA) and transmission electron microscopy (TEM). The predicted human exposure to Ag and Cu was used to calculate a margin of exposure (MOE) for ionic species of Ag and Cu, which indicated the safe use of the food packaging in a hypothetical scenario (e.g. as fruit juice packaging). While migration exceeded regulatory limits, the calculated MOE suggests current migration limits may be conservative for specific nano-packaging applications. Copyright © 2016 Elsevier Ltd. All rights reserved.

  1. Biodegradable PLA composites with different fillers for food packaging application

    OpenAIRE

    Marra, Antonella

    2015-01-01

    The food packaging initially born as a "container" of food for the sale of quantities defined in adequate conditions of hygiene, then had to perform the function of "protection" of the food in respect of environment. Today, in fact, the most important function of the packaging, when it comes to preservation technology, is to prevent deterioration of the food, to extend the duration of use of a food and to maintain and /or to increase its quality and integrity. So the main purpose of food pa...

  2. Inspection, testing, and operating requiremens for the packaging and shipping of uranium trioxide in 55-gallon Department of Transportation (DOT) Specification 6M shipping packagings

    International Nuclear Information System (INIS)

    Toomer, D.V.

    1991-06-01

    This document identifies the inspection, testing and operating requirements for the packaging, loading, and shipping of uranium trioxide (UO 3 ) in 55-gallon DOT Specification 6M shipping packagings from the Idaho Chemical Processing Plant (ICPP). Compliance with this document assures established controls for the purchasing, packaging, loading, and shipping of DOT Specification 6M shipping packagings are maintained in strict accordance with applicable Code of Federal Regulations (CFRs) and Department of Energy (DOE) Orders. 7 refs., 3 figs., 1 tab

  3. Dosimetric differences between electrons beams with rio applicators of GMV and conventional Elekta applicators

    International Nuclear Information System (INIS)

    Sendon del Rio, J. R.; Ayala Lazaro, R.; Jimenez Rojas, M. R.; Gomez Cores, S.; Gonzalez Ruiz, C.; Garcia Hernandez, M. J.; Lopez Bote, M. A.

    2013-01-01

    Intraoperative radiotherapy (River) is a form of cancer treatment that consists of a session of radiation ionizing on macroscopic tumor or tumor bed surgically exposed. In our institution, is administered with beams of electrons in a Linear Accelerator for use general and adapted through specific (applicators RIVER). In this work we studied the dosimetry differences between modified by applicators electron beams conventional and they changed by applicators River. (Author)

  4. Application of systems engineering to determine performance requirements for repository waste packages

    International Nuclear Information System (INIS)

    Aitken, E.A.; Stimmell, G.L.

    1987-01-01

    The waste package for a nuclear waste repository in salt must contribute substantially to the performance objectives defined by the Salt Repository Project (SRP) general requirements document governing disposal of high-level waste. The waste package is one of the engineered barriers providing containment. In establishing the performance requirements for a project focused on design and fabrication of the waste package, the systems engineering methodology has been used to translate the hierarchy requirements for the repository system to specific performance requirements for design and fabrication of the waste package, a subsystem of the repository. This activity is ongoing and requires a methodology that provides traceability and is capable of iteration as baseline requirements are refined or changed. The purpose of this summary is to describe the methodology being used and the way it can be applied to similar activities in the nuclear industry

  5. Development of Transportation Package for Medical and Industrial Radioisotope

    Energy Technology Data Exchange (ETDEWEB)

    Seo, K. S.; Lee, J. C.; Bang, K. S. (and others)

    2007-06-15

    The objective of this project is development of RI transport package and establishment of transportation system. This report describes the objective of project, necessaries, state of related technology, scope and results, proposal for application etc. The scope of the project consist of establishment of performance test system for type-A package for medical use, development of type-B package for industrial use and development of casting technology for DU shield and evaluation of shielding efficiency. The research results obtained from this project are expected to be utilized as a basic data for design, analysis, test and license of transport package.

  6. Biological applications of phase-contrast electron microscopy.

    Science.gov (United States)

    Nagayama, Kuniaki

    2014-01-01

    Here, I review the principles and applications of phase-contrast electron microscopy using phase plates. First, I develop the principle of phase contrast based on a minimal model of microscopy, introducing a double Fourier-transform process to mathematically formulate the image formation. Next, I explain four phase-contrast (PC) schemes, defocus PC, Zernike PC, Hilbert differential contrast, and schlieren optics, as image-filtering processes in the context of the minimal model, with particular emphases on the Zernike PC and corresponding Zernike phase plates. Finally, I review applications of Zernike PC cryo-electron microscopy to biological systems such as protein molecules, virus particles, and cells, including single-particle analysis to delineate three-dimensional (3D) structures of protein and virus particles and cryo-electron tomography to reconstruct 3D images of complex protein systems and cells.

  7. Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

    Science.gov (United States)

    Wu, Chih-Hao; Thompson, Furman V.

    2017-01-01

    Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

  8. Hybrid nanocellulose/nanoclay composites for food packaging applications

    DEFF Research Database (Denmark)

    Trifol Guzman, Jon

    ™ 30B) were prepared and evaluated for use in food packaging. It was determined that composites with CNF or CNC and clay led to a great reduction in the oxygen transmission rate (OTR)and the water vapour transmission rate (WVTR) (up to a 90% reduction in the OTR and 76% in theWVTR for PLA/CNF 5%/C30B 5...... to larger spherulite sizes, which had a more significant impacton water diffusion and transparency reduction but also showed an increased water sorption. Finally, it was found that cellulose nanofibers reduced water diffusion to an extent similar to C30B (21% vs.27%), while hybrid composites showed 49......% decrease, albeit CNF based composites showed increased water sorption (7% for PLA/CNF 1% composite and 9% for PLA/CNF 1%/C30B 1% when compared with neat PLA).The reduced diffusivity of the hybrid nanocomposites suggested that the material was promising for active packaging, since low diffusivity leads...

  9. Application of principal component and factor analyses in electron spectroscopy

    International Nuclear Information System (INIS)

    Siuda, R.; Balcerowska, G.

    1998-01-01

    Fundamentals of two methods, taken from multivariate analysis and known as principal component analysis (PCA) and factor analysis (FA), are presented. Both methods are well known in chemometrics. Since 1979, when application of the methods to electron spectroscopy was reported for the first time, they became to be more and more popular in different branches of electron spectroscopy. The paper presents examples of standard applications of the method of Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and electron energy loss spectroscopy (EELS). Advantages one can take from application of the methods, their potentialities as well as their limitations are pointed out. (author)

  10. Practical application of HgI2 detectors to a space-flight scanning electron microscope

    Science.gov (United States)

    Bradley, J. G.; Conley, J. M.; Albee, A. L.; Iwanczyk, J. S.; Dabrowski, A. J.

    1989-01-01

    Mercuric iodide X-ray detectors have been undergoing tests in a prototype scanning electron microscope system being developed for unmanned space flight. The detector program addresses the issues of geometric configuration in the SEM, compact packaging that includes separate thermoelectric coolers for the detector and FET, X-ray transparent hermetic encapsulation and electrical contacts, and a clean vacuum environment.

  11. Nanotechnology: An Untapped Resource for Food Packaging.

    Science.gov (United States)

    Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

    2017-01-01

    Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

  12. Electronic Nose Technology and its Applications

    Directory of Open Access Journals (Sweden)

    Esmaeil MAHMOUDI

    2009-08-01

    Full Text Available In the past decade, Electronic Nose instrumentation has generated much interest internationally for its potential to solve a wide variety of problems in fragrance and cosmetics production, food and beverages manufacturing, chemical engineering, environmental monitoring and more recently medical diagnostic, bioprocesses and clinical diagnostic plant diseases. This instrument measure electrical resistance changes generated by adsorption of volatiles to the surface of electro active- polymer coated sensor- unique digital electronic fingerprint of aroma derived from multi-sensor- responses to distinct mixture of microbial volatiles. Major advances in information and gas sensor technology could enhance the diagnostic power of future bio-electronic nose and facilitate global surveillance mode of disease control and management. Several dozen companies are now designed and selling electronic nose units globally for a wide variety of expending markets. The present review includes principles of electronic nose technology, biosensor structure and applications of electronic nose in many fields.

  13. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and the New Tenets for Cost Conscious Mission Assurance on Electrical, Electronic, and Electromechanical (EEE) Parts

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2015-01-01

    The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.

  14. Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

    OpenAIRE

    Shan, Kun; Julius, Joezer

    2015-01-01

    AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

  15. Power electronic converters and systems frontiers and applications

    CERN Document Server

    Trzynadlowski, Andrzej M

    2016-01-01

    Power electronics is a branch of electrical engineering dealing with conversion and control of electric power using semiconductor power switches. This book provides an overview of modern power electronic converters and systems, and their applications.

  16. Completion of the radioactive materials packaging handbook

    International Nuclear Information System (INIS)

    Shappert, L.B.

    1998-01-01

    'The Radioactive Materials Packaging Handbook: Design, Operation and Maintenance', which will serve as a replacement for the 'Cask Designers Guide'(1970), has now been completed and submitted to the Oak Ridge National Laboratory (ORNL) electronics publishing group for layout and printing; it is scheduled to be printed in late spring 1998. The Handbook, written by experts in their particular fields, is a compilation of technical chapters that address the design aspects of a package intended for transporting radioactive material in normal commerce; it was prepared under the direction of M. E. Wangler of the US DOE and is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators on specific aspects of package design, and the types of analyses that should be considered when designing a package to carry radioactive materials. Even though the Handbook is concerned with both small and large packagings, most of the emphasis is placed on large packagings that are capable of transporting fissile, radioactive sources (e.g. spent fuels). The safety analysis reports for packagings (SARPs) must address the widest range of technical topics in order to meet United States and/or international regulations, all of which are covered in the Handbook. One of the primary goals of the Handbook is to provide information which would guide designers of radioactive materials packages to make decisions that would most likely be acceptable to regulatory agencies during the approval process of the packaging. It was therefore important to find those authors who not only were experts in one or more of the areas that are addressed in a SARP, but who also had been exposed to the regulatory process or had operational experience dealing with a wide variety of package types. Twenty-five such people have contributed their time and talents to the development of this document, mostly on a volunteer basis

  17. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions, LLC

    2003-01-01

    The purpose of this program guidance document is to provide technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the SARP and/or C of C shall govern. The C of C states: ''...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, ''Operating Procedures,'' of the application.'' It further states: ''...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, ''Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC approved, users need to be familiar with 10 CFR (section) 71.11, ''Deliberate Misconduct.'' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the RH-TRU 72-B packaging. This Program Guidance standardizes instructions for all users. Users shall follow these instructions. Following these instructions assures that operations are safe and meet the requirements of the SARP. This document is available on the Internet at: ttp://www.ws/library/t2omi/t2omi.htm. Users are responsible for ensuring they are using the current revision and change notices. Sites may prepare their own document using the word

  18. Software package as an information center product

    International Nuclear Information System (INIS)

    Butler, M.K.

    1977-01-01

    The Argonne Code Center serves as a software exchange and information center for the U.S. Energy Research and Development Administration and the Nuclear Regulatory Commission. The goal of the Center's program is to provide a means for sharing of software among agency offices and contractors, and for transferring computing applications and technology, developed within the agencies, to the information-processing community. A major activity of the Code Center is the acquisition, review, testing, and maintenance of a collection of software--computer systems, applications programs, subroutines, modules, and data compilations--prepared by agency offices and contractors to meet programmatic needs. A brief review of the history of computer program libraries and software sharing is presented to place the Code Center activity in perspective. The state-of-the-art discussion starts off with an appropriate definition of the term software package, together with descriptions of recommended package contents and the Carter's package evaluation activity. An effort is made to identify the various users of the product, to enumerate their individual needs, to document the Center's efforts to meet these needs and the ongoing interaction with the user community. Desirable staff qualifications are considered, and packaging problems, reviewed. The paper closes with a brief look at recent developments and a forecast of things to come. 2 tables

  19. Power electronics for renewable energy systems, transportation and industrial applications

    CERN Document Server

    Malinowski, Mariusz; Al-Haddad, Kamal

    2014-01-01

    Power Electronics for Renewable Energy, Transportation, and Industrial Applications combines state-of-the-art global expertise to present the latest research on power electronics and its application in transportation, renewable energy, and different industrial applications. This timely book aims to facilitate the implementation of cutting-edge techniques to design problems offering innovative solutions to the growing power demands in small- and large-size industries. Application areas in the book range from smart homes and electric and plug-in hybrid electrical vehicles (PHEVs), to smart distribution and intelligence operation centers where significant energy efficiency improvements can be achieved through the appropriate use and design of power electronics and energy storage devices.

  20. Application of humidity-controlled dynamic mechanical analysis (DMA-RH) to moisture-sensitive edible casein films for use in food packaging

    Science.gov (United States)

    Protein-based and other hydrophilic thin films are promising materials for the manufacture of edible food packaging and other food and non-food applications. Calcium caseinate (CaCas) films are highly hygroscopic and physical characterization under broad environmental conditions is critical to appli...

  1. Radiation sensitivity of foodborne pathogens in meat byproducts with different packaging

    International Nuclear Information System (INIS)

    Yong, Hae In; Kim, Hyun-Joo; Nam, Ki Chang; Kwon, Joong Ho; Jo, Cheorun

    2015-01-01

    The aim of this study was to determine radiation sensitivity of Escherichia coli O157:H7 and Listeria monocytogenes in edible meat byproducts. Seven beef byproducts (heart, liver, lung, lumen, omasum, large intestine, and small intestine) and four pork byproducts (heart, large intestine, liver, and small intestine) were used. Electron beam irradiation significantly reduced the numbers of pathogenic microorganisms in meat byproducts and no viable cells were detected in both aerobically- and vacuum-packaged samples irradiated at 4 kGy. Meat byproducts packed under vacuum had higher D 10 value than the ones packed aerobically. No significant difference was observed between the D 10 values of E. coli O157:H7 and L. monocytogenes inoculated in either aerobically or vacuum packaged samples. These results suggest that low-dose electron beam irradiation can significantly decrease microbial numbers and reduce the risk of meat byproduct contamination by the foodborne pathogens. - Highlights: • Radiation sensitivities of pathogens in meat byproduct were tested. • Electron beam irradiation of 3 or 4 kGy reduced pathogens by> 9 log • The D 10 values were lower in the aerobic-packaging than under vacuum condition

  2. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  3. Toward Environmentally Robust Organic Electronics: Approaches and Applications.

    Science.gov (United States)

    Lee, Eun Kwang; Lee, Moo Yeol; Park, Cheol Hee; Lee, Hae Rang; Oh, Joon Hak

    2017-11-01

    Recent interest in flexible electronics has led to a paradigm shift in consumer electronics, and the emergent development of stretchable and wearable electronics is opening a new spectrum of ubiquitous applications for electronics. Organic electronic materials, such as π-conjugated small molecules and polymers, are highly suitable for use in low-cost wearable electronic devices, and their charge-carrier mobilities have now exceeded that of amorphous silicon. However, their commercialization is minimal, mainly because of weaknesses in terms of operational stability, long-term stability under ambient conditions, and chemical stability related to fabrication processes. Recently, however, many attempts have been made to overcome such instabilities of organic electronic materials. Here, an overview is provided of the strategies developed for environmentally robust organic electronics to overcome the detrimental effects of various critical factors such as oxygen, water, chemicals, heat, and light. Additionally, molecular design approaches to π-conjugated small molecules and polymers that are highly stable under ambient and harsh conditions are explored; such materials will circumvent the need for encapsulation and provide a greater degree of freedom using simple solution-based device-fabrication techniques. Applications that are made possible through these strategies are highlighted. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  4. Applications for electronic documents

    International Nuclear Information System (INIS)

    Beitel, G.A.

    1995-01-01

    This paper discusses the application of electronic media to documents, specifically Safety Analysis Reports (SARs), prepared for Environmental Restoration and Waste Management (ER ampersand WM) programs being conducted for the Department of Energy (DOE) at the Idaho National Engineering Laboratory (INEL). Efforts are underway to upgrade our document system using electronic format. To satisfy external requirements (DOE, State, and Federal), ER ampersand WM programs generate a complement of internal requirements documents including a SAR and Technical Safety Requirements along with procedures and training materials. Of interest, is the volume of information and the difficulty in handling it. A recently prepared ER ampersand WM SAR consists of 1,000 pages of text and graphics; supporting references add 10,000 pages. Other programmatic requirements documents consist of an estimated 5,000 pages plus references

  5. DMAIC Application and Fault Analysis of Metal Packaging in the Canning Industry

    Directory of Open Access Journals (Sweden)

    Rafael Santos de Souza

    2017-11-01

    Full Text Available In the food industry, quality assurance is strongly associated with consumer safety and the risk of compromising the purity of products. Specifically, in the canning industries, rusty, dented or bulging cans may contain bacteria and cause foodborne illness. This article discusses the application of DMAIC and failure analysis to reduce the number of crushed cans in a canning industry. The methodology was of an applied nature, with an exploratory objective, a qualitative and quantitative approach and a case study method used. Through statistical analysis, it was found that the amount of dented packaging in the production process, which comprises the steps of filling, seaming and basketing, was high. The step with the highest number of crushed cans between three stages was seaming. This was followed by the application of FMEA failure analysis related to the use of an automated seaming machine. Finally, an action plan was roposed to solve the problem of cans crushed in the seaming step and the results demonstrate the improvements obtained before the target after 4 months (August-November 2015.

  6. Permeation mechanisms of pulsed microwave plasma deposited silicon oxide films for food packaging applications

    International Nuclear Information System (INIS)

    Deilmann, Michael; Grabowski, Mirko; Theiss, Sebastian; Bibinov, Nikita; Awakowicz, Peter

    2008-01-01

    Silicon oxide barrier layers are deposited on polyethylene terephthalate as permeation barriers for food packaging applications by means of a low pressure microwave plasma. Hexamethyldisiloxane (HMDSO) and oxygen are used as process gases to deposit SiO x coatings via pulsed low pressure plasmas. The layer composition of the coating is investigated by Fourier transform infrared spectroscopy and energy dispersive x-ray spectroscopy to show correlations with barrier properties of the films. The oxygen permeation barrier is determined by the carrier gas method using an electrochemical detector. The transition from low to high barrier films is mapped by the transition from organic SiO x C y H z layers to quartz-like SiO 1.7 films containing silanol bound hydrogen. A residual permeation as low as J = 1 ± 0.3 cm 3 m -2 day -1 bar -1 is achieved, which is a good value for food packaging applications. Additionally, the activation energy E p of oxygen permeation is analysed and a strong increase from E p = 31.5 kJ mol -1 for SiO x C y H z -like coatings to E p = 53.7 kJ mol -1 for SiO 1.7 films is observed by increasing the oxygen dilution of HMDSO:O 2 plasma. The reason for the residual permeation of high barrier films is discussed and coating defects are visualized by capacitively coupled atomic oxygen plasma etching of coated substrates. A defect density of 3000 mm -2 is revealed

  7. Polynomial expressions of electron depth dose as a function of energy in various materials: application to thermoluminescence (TL) dosimetry

    Energy Technology Data Exchange (ETDEWEB)

    Deogracias, E.C.; Wood, J.L.; Wagner, E.C.; Kearfott, K.J

    1999-02-11

    The CEPXS/ONEDANT code package was used to produce a library of depth-dose profiles for monoenergetic electrons in various materials for energies ranging from 500 keV to 5 MeV in 10 keV increments. The various materials for which depth-dose functions were derived include: lithium fluoride (LiF), aluminium oxide (Al{sub 2}O{sub 3}), beryllium oxide (BeO), calcium sulfate (CaSO{sub 4}), calcium fluoride (CaF{sub 2}), lithium boron oxide (LiBO), soft tissue, lens of the eye, adiopose, muscle, skin, glass and water. All materials data sets were fit to five polynomials, each covering a different range of electron energies, using a least squares method. The resultant three dimensional, fifth-order polynomials give the dose as a function of depth and energy for the monoenergetic electrons in each material. The polynomials can be used to describe an energy spectrum by summing the doses at a given depth for each energy, weighted by the spectral intensity for that energy. An application of the polynomial is demonstrated by explaining the energy dependence of thermoluminescent detectors (TLDs) and illustrating the relationship between TLD signal and actual shallow dose due to beta particles.

  8. Aspects of safety assessments for package with additional equipment components

    International Nuclear Information System (INIS)

    Reiche, I.; Boerst, F.M.; Krietsch, T.

    2004-01-01

    Many paragraphs in TS-R-1 contain the terms ''package'' or ''packaging''. These terms are defined in TS-R-1 paras 230 and 231 and explained in TS-G-1.1 paras 230.1 - 230.6. The importance of a consistent understanding of these definitions has been shown by recent discussions during the assessment of applications for package design approval. There was disagreement, if equipment components attached to the container body during transport, e.g. a transport frame, should be considered part of the package and taken into account in the safety assessment for the package. Discussions were also caused by the way inner design components are treated in the safety assessment of the package. This paper summarises the regulatory requirements to such additional equipment components and presents the way of their inclusion into the package design approval process in Germany

  9. Active and intelligent packaging: The indication of quality and safety.

    Science.gov (United States)

    Janjarasskul, Theeranun; Suppakul, Panuwat

    2018-03-24

    The food industry has been under growing pressure to feed an exponentially increasing world population and challenged to meet rigorous food safety law and regulation. The plethora of media consumption has provoked consumer demand for safe, sustainable, organic, and wholesome products with "clean" labels. The application of active and intelligent packaging has been commercially adopted by food and pharmaceutical industries as a solution for the future for extending shelf life and simplifying production processes; facilitating complex distribution logistics; reducing, if not eliminating the need for preservatives in food formulations; enabling restricted food packaging applications; providing convenience, improving quality, variety and marketing features; as well as providing essential information to ensure consumer safety. This chapter reviews innovations of active and intelligent packaging which advance packaging technology through both scavenging and releasing systems for shelf life extension, and through diagnostic and identification systems for communicating quality, tracking and brand protection.

  10. New Nanocomposite Materials with Improved Mechanical Strength and Tailored Coefficient of Thermal Expansion for Electro-Packaging Applications

    Directory of Open Access Journals (Sweden)

    Abdollah Saboori

    2017-12-01

    Full Text Available In this research, copper nanocomposites reinforced by graphene nanoplatelets (GNPs were fabricated using a wet mixing method followed by a classical powder metallurgy route. In order to find the best dispersion technique, ball milling and wet mixing were chosen. Qualitative evaluation of the structure of the graphene after mixing indicated that the wet mixing is an appropriate technique to disperse the GNPs. Thereafter, the influence of graphene content on microstructure, density, hardness, elastic modulus, and thermal expansion coefficient of composites was investigated. It was shown that by increasing the graphene content the aggregation of graphene is more obvious and, thus, these agglomerates affect the final properties adversely. In comparison with the unreinforced Cu, Cu–GNP composites were lighter, and their hardness and Young’s modulus were higher as a consequence of graphene addition. According to the microstructural observation of pure copper and its composites after sintering, it was concluded that grain refinement is the main mechanism of strengthening in this research. Apart from the mechanical characteristics, the coefficient of thermal expansion of composites decreased remarkably and the combination of this feature with appropriate mechanical properties can make them a promising candidate for use in electronic packaging applications.

  11. Strategy and Software Application of Fresh Produce Package Design to Attain Optimal Modified Atmosphere

    Directory of Open Access Journals (Sweden)

    Dong Sun Lee

    2014-01-01

    Full Text Available Modified atmosphere packaging of fresh produce relies on the attainment of desired gas concentration inside the package resulting from product respiration and package’s gas transfer. Systematic package design method to achieve the target modified atmosphere was developed and constructed as software in terms of selecting the most appropriate film, microperforations, and/or CO2 scavenger. It incorporates modeling and/or database construction on the produce respiration, gas transfer across the plastic film and microperforation, and CO2 absorption by the scavenger. The optimization algorithm first selects the packaging film and/or microperforations to have the target O2 concentration in response to the respiration and then tunes the CO2 concentration by CO2 absorber when it goes above its tolerance limit. The optimization method tested for green pepper, strawberry, and king oyster mushroom packages was shown to be effective to design the package and the results obtained were consistent with literature work and experimental atmosphere.

  12. Radiation sterilization of plastic packing materials and aseptic packaging

    International Nuclear Information System (INIS)

    Tokuoka, Keiko

    1986-01-01

    In the present day of 'satiation', quality, not quantity, is emphasized for foods, the consumers being oriented toward raw and healthy foodstuff. Aseptic Packaging is excellent means of conservation. While conventionally chemicals have been used for sterilization of packing materials for aseptic packaging, the sterilization by radiation is used in part recently. The following are described : history of aseptic packaging and its features, sterilization by radiation, γ-ray sterilization of large-sized containers, the development of an aseptic packaging system using electron rays, the occurrence of offensive odors from packing materials (comparison of odors from various materials, volatile substances occurring in irradiated polyethylene, influence of film grade upon the formation of carboxylic acid, influence of the irradiation conditions upon the occurrences of volatile substances, volatile substances occurring in the irradiation of bag-in-box packing materials), changes in properties of the packing materials. (Mori, K.)

  13. Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications

    KAUST Repository

    Shaikh, Sohail F.

    2017-01-17

    The state-of-the-art electronics technology has been an integral part of modern advances. The prevalent rise of the mobile device and computational technology in the age of information technology offers exciting applications that are attributed to sophisticated, enormously reliable, and most mature CMOS-based electronics. We are accustomed to high performance, cost-effective, multifunctional, and energy-efficient scaled electronics. However, they are rigid, bulky, and brittle. The convolution of flexibility and stretchability in electronics for emerging Internet of Everything application can unleash smart application horizon in unexplored areas, such as robotics, healthcare, smart cities, transport, and entertainment systems. While flexible and stretchable device themes are being remarkably chased, the realization of the fully compliant electronic system is unaddressed. Integration of data processing, storage, communication, and energy management devices complements a compliant system. Here, a comprehensive review is presented on necessity and design criteria for freeform (physically flexible and stretchable) compliant high-performance CMOS electronic systems.

  14. Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology

    International Nuclear Information System (INIS)

    Wang, Jiachou; Li, Xinxin

    2013-01-01

    An on-chip integrated packaging-stress-suppressed suspension (PS 3 ) technology for a packaging-stress-free pressure sensor is proposed and developed. With a MIS (microholes interetch and sealing) micromachining process implemented only from the front-side of a single-side polished (1 1 1) silicon wafer, a compact cantilever-shaped PS 3 is on-chip integrated surrounding a piezoresistive pressure-sensing structure to provide a packaging-process/substrate-friendly method for low-cost but high-performance sensor applications. With the MIS process, the chip size of the PS 3 -enclosed pressure sensor is as small as 0.8 mm × 0.8 mm. Compared with a normal pressure sensor without PS 3 (but with an identical pressure-sensing structure), the proposed pressure sensor has the same sensitivity of 0.046 mV kPa −1 (3.3 V) −1 . However, without using the thermal compensation technique, a temperature coefficient of offset of only 0.016% °C −1 FS is noted for the sensor with PS 3 , which is about 15 times better than that for the sensor without PS 3 . Featuring effective isolation and elimination of the influence from packaging stress, the PS 3 technique is promising to be widely used for packaging-friendly mechanical sensors. (paper)

  15. Investigation of thermal management materials for automotive electronic control units

    International Nuclear Information System (INIS)

    Mallik, Sabuj; Ekere, Ndy; Best, Chris; Bhatti, Raj

    2011-01-01

    Today's electronics packages are smaller and more powerful than ever before. This leads to ever increasing thermal challenges for the systems designer. The automotive electronic control unit (ECU) package faces the same challenge of thermal management as the industry in general. This is coupled with the latest European Union legislation (Euro 6 standard) which forced the ECU manufacturers to completely re-design their ECU platform with improved hardware and software capability. This will result in increased power densities and therefore, the ability to dissipate heat will be a key factor. A higher thermal conductivity (TC) material for the ECU housing (than the currently used Aluminium) could improve heat dissipation from the ECU. This paper critically reviews the state-of-the-art in thermal management materials which may be applicable to an automotive ECU. This review shows that of the different materials currently available, the Al/SiC composites in particular have very good potential for automotive ECU application. In terms of metal composites processing, the liquid metal infiltration process is recommended as it has a lower processing cost and it also has the ability to produce near net-shape materials.

  16. Directory of Certificates of Compliance for Radioactive Materials Packages: Report of NRC Approved Quality Assurance Programs for Radioactive Materials Packages

    International Nuclear Information System (INIS)

    1993-10-01

    This directory contains a Report of NRC Approved Packages (Volume 1), Certificates of Compliance (Volume 2), and a Report of NRC Approved Quality Assurance Programs for Radioactive Materials Packages (Volume 3). The purpose of this directory is to make available a convenient source of information on Quality Assurance Programs and Packagings which have been approved by the US Nuclear Regulatory Commission. Shipments of radioactive material utilizing these packagings must be in accordance with the provisions of 49 CFR section 173.471 and 10 CFR Part 71, as applicable. In satisfying the requirements of Section 71.12, it is the responsibility of the licensees to insure themselves that they have a copy of the current approval and conduct their transportation activities in accordance with an NRC approved quality assurance program

  17. Competent authority approval of package designs in the United Kingdom

    International Nuclear Information System (INIS)

    Morgan-Warren, E.J.

    1999-01-01

    Type B packages and all packages containing fissile material, as well as special form radioactive materials, special arrangements and certain shipments, are required to be approved by the competent authority. In the United Kingdom competent authority approval is carried out on behalf of the Secretary of State by the Radioactive Materials Transport Division (RMTD) of the Department of the Environment, Transport and the Regions (DETR). Competent authority approval of a package design is given only after a detailed assessment of the design by the specialist staff of RMTD. There are three facets to the assessment procedure, namely engineering, criticality and radiation protection, and quality assurance. The engineering assessor ensures that the designer has demonstrated the integrity of the containment and shielding systems under the regulatory conditions. The criticality assessor examines criticality safety and radiation protection measures, and together with the engineering assessor, decides whether this is maintained under regulatory conditions. The quality assurance assessor verifies that the applicant has established the necessary controls to ensure that the design requirements are met. The applicant is responsible for making the case for approval, but the assessment is facilitated if the competent authority is involved with the designer at an early stage in development and during the construction of any test prototype. When a regulatory test programme is required, it is designed and carried out by the applicant, but agreed and witnessed by representatives of RMTD. Following the test programme, the applicant submits a formal application, supported by a design safety report (DSR). The DSR provides a full analysis of the design and the test results, including the behaviour of the package under normal and accident conditions of transport, the manufacturing and maintenance procedures, quality assurance and the emergency provisions for the operation of the package

  18. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  19. Application of constraint satisfaction algorithms for conditioning and packing activated control rod assemblies in MOSAIK"R-casks. Application of constraint satisfaction algorithms for conditioning and packaging 160 control rod assemblies

    International Nuclear Information System (INIS)

    Harding, P.J.

    2017-01-01

    In the wake of the decommissioning of numerous nuclear power plants in Germany, techniques to reduce the number of costly waste casks or containers are sought after. The large bandwidth of limits (dose rate, mass, individual nuclide activities, chemical composition...) the waste packages have to comply with for both interim storage facilities and the repository Konrad render the manual planning of packaging concepts prohibitive. However, in the past, the planning for packaging has been performed in this way, albeit on the basis of several facilitating assumptions. Surprisingly, to the best of our knowledge, the automated computer-assisted generation of packaging plans for radioactive waste has not been demonstrated previously. In this talk we demonstrate how the conditioning and packing of 160 control rod assemblies was optimised using constraint satisfaction algorithms. These algorithms can be executed by a computer in a few minutes, thus considerably accelerating the generation of packaging plans, while optimising the utilisation of the waste casks and containers with respect to mass, activity, dose rate, etc. This automated and computer-assisted procedure took into account complex logistical boundary conditions present during decommissioning, such as space requirements, the sequence of the waste and the (lack of) availability of suitable waste casks. In addition, packaging concepts based on several scenarios (cask availability, space requirements,...) were easily and automatically generated once the packaging rules had been coded. We demonstrate the successful application of these algorithms to a real packaging campaign of control rod assemblies of a boiling water reactor, for which excellent results were achieved. We also present an outlook of a much larger scale project, in which the logistics and storage of radioactive waste packages is mathematically optimised. Finally, we give prospects on these techniques to others, similar logistical problems currently

  20. 21 CFR 1311.120 - Electronic prescription application requirements.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 9 2010-04-01 2010-04-01 false Electronic prescription application requirements. 1311.120 Section 1311.120 Food and Drugs DRUG ENFORCEMENT ADMINISTRATION, DEPARTMENT OF JUSTICE... application must clear the plain text password from the application memory to prevent the unauthorized access...

  1. 9975 Shipping package component long-term degradation rates

    Energy Technology Data Exchange (ETDEWEB)

    Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

    2017-06-28

    Special nuclear materials are being stored in the K-Area Complex using 3013 containers that are held within Model 9975 shipping packages. The service life for these packages in storage was recently increased from 15 to 20 years, since some of these packages have been stored for nearly 15 years. A strategy is also being developed whereby such storage might be extended beyond 20 years. This strategy is based on recent calculations that support acceptable 9975 package performance for 20 years with internal heat loads up to 19 watts, and identifies a lower heat load limit for which the package components should degrade at half the bounding rate or less, thus doubling the effective storage life for these lower wattage packages. The components of the 9975 package that are sensitive to aging under storage conditions are the fiberboard overpack and the O-ring seals, although some degradation of the lead shield and outer drum are also possible. This report summarizes degradation rates applicable to lower heat load storage conditions. In particular, the O-ring seals should provide leak-tight performance for more than 40 years in packages for which their maximum temperature is ≤135 °F. Similarly, the fiberboard should remain acceptable in performance of its required safety functions for up to 40 years in packages with a maximum fiberboard temperature ≤125 °F.

  2. Application of electron beam for preparation of membranes

    International Nuclear Information System (INIS)

    Mohamed Mahmoud Nasef

    2004-01-01

    Membranes have generated considerable interest in a number of technologically significant fields, such as chemical, biochemical and biomedical engineering. However, it becomes important to design and develop particular membranes for specific applications. Radiation induced grafting of hydrophilic monomers into polymeric films has been found to be an appealing method for producing various membranes. The method has the flexibility of using various types of radiation, such as γ-rays, electron beam, and plasma, irrespective of the shape and size of the polymer. Of all, electron beam accelerator is an advantageous source of high-energy radiations that can initiate grafting reactions required for preparation of membranes particularly when pilot production and commercial applications are sought. The grafting penetration can be varied from surface to bulk of membranes by applying acceleration energy. This article briefly reviews the use of electron beam radiation to prepare various membranes by radiation induced grafting of vinyl and acrylic monomers onto polymer films. Some basic fundamentals of radiation induced grafting and advantages of electron beam over Co-60 are highlighted. Potential applications of radiation-grafted membranes in various fields are also surveyed. (author)

  3. Antioxidant films based on cross-linked methyl cellulose and native Chilean berry for food packaging applications.

    Science.gov (United States)

    López de Dicastillo, Carol; Rodríguez, Francisco; Guarda, Abel; Galotto, Maria José

    2016-01-20

    Development of antioxidant and antimicrobial active food packaging materials based on biodegradable polymer and natural plant extracts has numerous advantages as reduction of synthetic additives into the food, reduction of plastic waste, and food protection against microorganisms and oxidation reactions. In this way, active films based on methylcellulose (MC) and maqui (Aristotelia chilensis) berry fruit extract, as a source of antioxidants agents, were studied. On the other hand, due to the high water affinity of MC, this polymer was firstly cross-linked with glutaraldehyde (GA) at different concentrations. The results showed that the addition of GA decreased water solubility, swelling, water vapor permeability of MC films, and the release of antioxidant substances from the active materials increased with the concentration of GA. Natural extract and active cross-linked films were characterized in order to obtain the optimal formulation with the highest antioxidant activity and the best physical properties for latter active food packaging application. Copyright © 2015 Elsevier Ltd. All rights reserved.

  4. Strategies to improve the mechanical strength and water resistance of agar films for food packaging applications.

    Science.gov (United States)

    Sousa, Ana M M; Gonçalves, Maria P

    2015-11-05

    Agar films possess several properties adequate for food packaging applications. However, their high cost-production and quality variations caused by physiological and environmental factors affecting wild seaweeds make them less attractive for industries. In this work, native (NA) and alkali-modified (AA) agars obtained from sustainably grown seaweeds (integrated multi-trophic aquaculture) were mixed with locust bean gum (LBG) to make 'knife-coated' films with fixed final concentration (1 wt%) and variable agar/LBG ratios. Agar films were easier to process upon LBG addition (viscosity increase and gelling character decrease of the film-forming solutions observed by dynamic oscillatory and steady shear measurements). The mechanical properties and water resistance were optimal for films with 50 and/or 75% LBG contents and best in the case of NA (cheaper to extract). These findings can help reduce the cost-production of agar packaging films. Moreover, the controlled cultivation of seaweeds can provide continuous and reliable feedstock for transformation industries. Copyright © 2015 Elsevier Ltd. All rights reserved.

  5. Irradiation of packaged food

    International Nuclear Information System (INIS)

    Kilcast, D.

    1990-01-01

    Food irradiation is used to improve the safety of food by killing insects and microorganisms, to inhibit sprouting in crops such as onions and potatoes and to control ripening in agricultural produce. In order to prevent re-infestation and re-contamination it is essential that the food is suitably packed. Consequently, the packaging material is irradiated whilst in contact with the food, and it is important that the material is resistant to radiation-induced changes. In this paper the nature of the irradiation process is reviewed briefly, together with the known effects of irradiation on packaging materials and their implications for the effective application of food irradiation. Recent research carried out at the Leatherhead Food RA on the possibility of taint transfer into food is described. (author)

  6. High-Power Electron Accelerators for Space (and other) Applications

    Energy Technology Data Exchange (ETDEWEB)

    Nguyen, Dinh Cong [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Lewellen, John W. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-05-23

    This is a presentation on high-power electron accelerators for space and other applications. The main points covered are: electron beams for space applications, new designs of RF accelerators, high-power high-electron mobility transistors (HEMT) testing, and Li-ion battery design. In summary, the authors have considered a concept of 1-MeV electron accelerator that can operate up to several seconds. This concept can be extended to higher energy to produce higher beam power. Going to higher beam energy requires adding more cavities and solid-state HEMT RF power devices. The commercial HEMT have been tested for frequency response and RF output power (up to 420 W). Finally, the authors are testing these HEMT into a resonant load and planning for an electron beam test in FY17.

  7. Advances in Packaging Methods, Processes and Systems

    Directory of Open Access Journals (Sweden)

    Nitaigour Premchand Mahalik

    2014-10-01

    Full Text Available The food processing and packaging industry is becoming a multi-trillion dollar global business. The reason is that the recent increase in incomes in traditionally less economically developed countries has led to a rise in standards of living that includes a significantly higher consumption of packaged foods. As a result, food safety guidelines have been more stringent than ever. At the same time, the number of research and educational institutions—that is, the number of potential researchers and stakeholders—has increased in the recent past. This paper reviews recent developments in food processing and packaging (FPP, keeping in view the aforementioned advancements and bearing in mind that FPP is an interdisciplinary area in that materials, safety, systems, regulation, and supply chains play vital roles. In particular, the review covers processing and packaging principles, standards, interfaces, techniques, methods, and state-of-the-art technologies that are currently in use or in development. Recent advances such as smart packaging, non-destructive inspection methods, printing techniques, application of robotics and machineries, automation architecture, software systems and interfaces are reviewed.

  8. The application of NISA II FEM package in seismic qualification of small class IE electric motors

    International Nuclear Information System (INIS)

    Fancev, T.; Saban, I.; Grgic, D.

    1995-01-01

    According to the IEEE standards 323/1974 and 344/1975, seismic qualification of class IE equipment is appropriate combination of test and analysis methods. Complex equipment and assemblies are usually tested through seismic testing. The analysis is recommended for simple equipment that can be easily modeled to correctly predict its response. This article deals with the application of NISA II FEM package in 3D FE modeling and mode shape calculations of small power low voltage electric motors. (author)

  9. High-Throughput Printing Process for Flexible Electronics

    Science.gov (United States)

    Hyun, Woo Jin

    Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

  10. Reflective Packaging

    Science.gov (United States)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  11. AZTEC: A parallel iterative package for the solving linear systems

    Energy Technology Data Exchange (ETDEWEB)

    Hutchinson, S.A.; Shadid, J.N.; Tuminaro, R.S. [Sandia National Labs., Albuquerque, NM (United States)

    1996-12-31

    We describe a parallel linear system package, AZTEC. The package incorporates a number of parallel iterative methods (e.g. GMRES, biCGSTAB, CGS, TFQMR) and preconditioners (e.g. Jacobi, Gauss-Seidel, polynomial, domain decomposition with LU or ILU within subdomains). Additionally, AZTEC allows for the reuse of previous preconditioning factorizations within Newton schemes for nonlinear methods. Currently, a number of different users are using this package to solve a variety of PDE applications.

  12. Advanced Manufacturing Systems in Food Processing and Packaging Industry

    International Nuclear Information System (INIS)

    Sani, Mohd Shafie; Aziz, Faieza Abdul

    2013-01-01

    In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

  13. Advanced Manufacturing Systems in Food Processing and Packaging Industry

    Science.gov (United States)

    Shafie Sani, Mohd; Aziz, Faieza Abdul

    2013-06-01

    In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

  14. A guide to the suitability of elastomeric seal materials for use in radioactive material transport packages

    International Nuclear Information System (INIS)

    Vince, D.J.

    2004-01-01

    Elastomeric seals are a frequently favoured method of sealing Radioactive Material Transport (RMT) packages. The sealing technology has been proven for many years in a wide range of industrial applications. The requirements of the RMT package applications, however, are significantly different from those commonly found in other industries. This guide outlines the Regulatory performance requirements placed on an RMT package sealing system by TS-R-1, and then summarises the material, environment and geometry characteristics of elastomeric seals relevant to RMT applications. Tables in the guide list typical material properties for a range of elastomeric materials commonly used in RMT packages

  15. The Packaging Handbook -- A guide to package design

    International Nuclear Information System (INIS)

    Shappert, L.B.

    1995-01-01

    The Packaging Handbook is a compilation of 14 technical chapters and five appendices that address the life cycle of a packaging which is intended to transport radioactive material by any transport mode in normal commerce. Although many topics are discussed in depth, this document focuses on the design aspects of a packaging. The Handbook, which is being prepared under the direction of the US Department of Energy, is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators in specific aspects of packaging design, and the types of analyses that should be seriously considered when developing the packaging design. Even though the Handbook is concerned with all packagings, most of the emphasis is placed on large packagings that are capable of transporting large radioactive sources that are also fissile (e.g., spent fuel). These are the types of packagings that must address the widest range of technical topics in order to meet domestic and international regulations. Most of the chapters in the Handbook have been drafted and submitted to the Oak Ridge National Laboratory for editing; the majority of these have been edited. This report summarizes the contents

  16. Intracellular Crosslinking of Filoviral Nucleoproteins with Xintrabodies Restricts Viral Packaging

    Directory of Open Access Journals (Sweden)

    Tamarand Lee Darling

    2017-09-01

    Full Text Available Viruses assemble large macromolecular repeat structures that become part of the infectious particles or virions. Ribonucleocapsids (RNCs of negative strand RNA viruses are a prime example where repetition of nucleoprotein (NP along the genome creates a core polymeric helical scaffold that accommodates other nucleocapsid proteins including viral polymerase. The RNCs are transported through the cytosol for packaging into virions through association with viral matrix proteins at cell membranes. We hypothesized that RNC would be ideal targets for crosslinkers engineered to promote aberrant protein–protein interactions, thereby blocking their orderly transport and packaging. Previously, we had generated single-domain antibodies (sdAbs against Filoviruses that have all targeted highly conserved C-terminal regions of NP known to be repetitively exposed along the length of the RNCs of Marburgvirus (MARV and Ebolavirus (EBOV. Our crosslinker design consisted of dimeric sdAb expressed intracellularly, which we call Xintrabodies (X- for crosslinking. Electron microscopy of purified NP polymers incubated with purified sdAb constructs showed NP aggregation occurred in a genus-specific manner with dimeric and not monomeric sdAb. A virus-like particle (VLP assay was used for initial evaluation where we found that dimeric sdAb inhibited NP incorporation into VP40-based VLPs whereas monomeric sdAb did not. Inhibition of NP packaging was genus specific. Confocal microscopy revealed dimeric sdAb was diffuse when expressed alone but focused on pools of NP when the two were coexpressed, while monomeric sdAb showed ambivalent partition. Infection of stable Vero cell lines expressing dimeric sdAb specific for either MARV or EBOV NP resulted in smaller plaques and reduced progeny of cognate virus relative to wild-type Vero cells. Though the impact was marginal at later time-points, the collective data suggest that viral replication can be reduced by crosslinking

  17. Recovery of leaded-frame metals from integrated circuit package; Shuseki kairo package kara no lead frame kinzoku no kaishu

    Energy Technology Data Exchange (ETDEWEB)

    Rokukawa, N.; Sakamoto, H. [National Institute for Resources and Environment, Tsukuba (Japan)

    1997-12-25

    Discussions were given on separation and recovery of leaded-frame metals from an integrated circuit (IC) package. A printed wiring board in an electronic device is mounted with an IC package molded with an IC as a major component, and composed of IC chips, leaded-frame metals (the pin section retains the IC chips safely in a mold, and plays a role of terminal with an external circuit), and mold material (thermally hardened and reinforced resin). Quantity of IC packages discarded as a result of the deterioration due to aging is increasing year after year. IC package test pieces were crushed in a mortar, selected of metals manually, and classified by using a magnet and a sieve. The leaded-frame metals were easily separated from the mold material by crushing, and capable of being recovered by using a magnet. However, since the recovered leaded-frame metals are alloys having different compositions, how each metal component could be separated and refined is an important problem to be solved. For the time being, the metals may be utilized as structural materials for building materials by melting and alloying the leaded-frame metals. 10 refs., 7 tabs.

  18. Characterization of an Olive Flounder Bone Gelatin-Zinc Oxide Nanocomposite Film and Evaluation of Its Potential Application in Spinach Packaging.

    Science.gov (United States)

    Beak, Songee; Kim, Hyeri; Song, Kyung Bin

    2017-11-01

    Olive flounder bone gelatin (OBG) was used for a film base material in this study. In addition, zinc oxide nanoparticles (ZnO) were incorporated into the OBG film to prepare a nanocomposite film and to impart antimicrobial activity to it. The tensile strength of the OBG film increased by 6.62 MPa, and water vapor permeability and water solubility decreased by 0.93 × 10 -9 g/m s Pa and 13.79%, respectively, by the addition of ZnO to the OBG film. In particular, the OBG-ZnO film exhibited antimicrobial activity against Listeria monocytogenes. To investigate the applicability of the OBG-ZnO packaging film, fresh spinach was wrapped in this film and stored for a week. The results indicated that the OBG-ZnO film showed antimicrobial activity against L. monocytogenes inoculated on spinach without affecting the quality of spinach, such as vitamin C content and color. Thus, the OBG-ZnO nanocomposite film can be applied as an efficient antimicrobial food packaging material. As a base material of edible films, gelatin was extracted from olive flounder bone, which is fish processing by-product. Olive flounder bone gelatin (OBG) nanocomposite films were prepared with zinc oxide nanoparticles (ZnO). For an application to antimicrobial packaging, spinach was wrapped with the OBG-ZnO nanocomposite film. © 2017 Institute of Food Technologists®.

  19. Process Variability and Capability in Candy Production and Packaging

    Science.gov (United States)

    Lembke, Ronald S.

    2016-01-01

    In this short, in-class activity, students use fun size packages of M&Ms to study process variability, including a real-world application of C[subscript pk]. How process variability and legal requirements force the company to put "Not Labeled for Individual Retail Sale" on each fun size package is discussed, as is the economics of…

  20. High temperature, radiation hardened electronics for application to nuclear power plants

    International Nuclear Information System (INIS)

    Gover, J.E.

    1980-01-01

    Electronic circuits were developed and built at Sandia for many aerospace and energy systems applications. Among recent developments were high temperature electronics for geothermal well logging and radiation hardened electronics for a variety of aerospace applications. Sandia has also been active in technology transfer to commercial industry in both of these areas

  1. Scattered radiation from applicators in clinical electron beams.

    NARCIS (Netherlands)

    Battum, L.J. van; Zee, W. van der; Huizenga, H.

    2003-01-01

    In radiotherapy with high-energy (4-25 MeV) electron beams, scattered radiation from the electron applicator influences the dose distribution in the patient. In most currently available treatment planning systems for radiotherapy this component is not explicitly included and handled only by a slight

  2. Application of chitosan as biomaterial for active packaging of ethylene absorber

    Science.gov (United States)

    Warsiki, E.

    2018-03-01

    Chitosan was used for active packaging of ethylene absorber that can change the head space of food packaging to extend the shelf life. The purpose of this study was to develop active packaging from chitosan and KMnO4 and apply the active film to package tomatoes. Active film was prepared by mixing chitosan 6 g, 140 mL of acetic acid 1%, 60 mL of aquadest, 2 mL sorbitol, and KMnO4 with concentration of 3 g, 5 g, and 7 g. After 5 days of storage, the film used to wrap the tomatoes was sweated. The best formulation to absorb the ethylene was made from 7 g of KMnO4 since it could inhibit tomatoes from shortly ripening compared to other formulations. The fruits were packed at room temperature had a high hardness as much as 17,79 mm/50mg/5s compared to the control of 3,47 mm/50mg/5s, while at the refrigerator, the tomato had lower hardness value of the 2,72 mm/50mg/5s compared to the control of 4,29 mm/50mg/5s. Addition of KMnO4 on the film could maintain the value °Hue either for all treated sample and control in the range of the yellow to red.

  3. Directory of certificates of compliance for radioactive materials packages

    International Nuclear Information System (INIS)

    1991-10-01

    This directory contains a Report of NRC Approved Packages (Volume 1) for Radioactive Materials Packages. The purpose of this directory is to make available a convenient source of information on Quality Assurance Programs and Packagings which have been approved by the US Nuclear Regulatory Commission. Shipments of radioactive material utilizing these packagings must be in accordance with the provisions of 49 CFR section 173.471 and 10 CFR Part 71, as applicable. In satisfying the requirements of Section 71.12, it is the responsibility of the licensees to insure themselves that they have a copy of the current approval and conduct their transportation activities in accordance with an NRC approved quality assurance program

  4. Optimization of an impact limiter for radioactive waste packaging

    International Nuclear Information System (INIS)

    Mourao, Rogerio Pimenta; Mattar Neto, Miguel

    1999-01-01

    A certain class of packages for the transportation of radioactive wastes - type B packages in the transport jargon - is supposed to resist to a series of postulated tests, the most severe for the majority of the packages being the 9 m height drop test. To improve the performance of the packages under this test, impact limiters are added to them, normally as a removable overpack, with the primary goal of reducing the deceleration loads transmitted to the packages and their contents. The first impact limiter concept, developed during the '70s, used a shell-type impact limiter attached to both ends of the package. Later on, wood was tested as impact limiter filling, which improved the package's mechanical performance, but not its thermal resistance. The popularization of the polymeric materials and their growing use in engineer applications have led to the use of these materials in impact limiters, with the extra advantage of the polymers good thermal properties. This paper proposes a methodology for the optimization of an impact limiter for a package for the conditioning of spent sealed sources. Two simplified methods for the design of impact limiters are presented. Finally, a brief discussion is presented on the methodology usually employed in the design of accident-resisting packages. (author)

  5. Flexible packaging for PV modules

    Science.gov (United States)

    Dhere, Neelkanth G.

    2008-08-01

    Economic, flexible packages that provide needed level of protection to organic and some other PV cells over >25-years have not yet been developed. However, flexible packaging is essential in niche large-scale applications. Typical configuration used in flexible photovoltaic (PV) module packaging is transparent frontsheet/encapsulant/PV cells/flexible substrate. Besides flexibility of various components, the solder bonds should also be flexible and resistant to fatigue due to cyclic loading. Flexible front sheets should provide optical transparency, mechanical protection, scratch resistance, dielectric isolation, water resistance, UV stability and adhesion to encapsulant. Examples are Tefzel, Tedlar and Silicone. Dirt can get embedded in soft layers such as silicone and obscure light. Water vapor transmittance rate (WVTR) of polymer films used in the food packaging industry as moisture barriers are ~0.05 g/(m2.day) under ambient conditions. In comparison, light emitting diodes employ packaging components that have WVTR of ~10-6 g/(m2.day). WVTR of polymer sheets can be improved by coating them with dense inorganic/organic multilayers. Ethylene vinyl acetate, an amorphous copolymer used predominantly by the PV industry has very high O2 and H2O diffusivity. Quaternary carbon chains (such as acetate) in a polymer lead to cleavage and loss of adhesional strength at relatively low exposures. Reactivity of PV module components increases in presence of O2 and H2O. Adhesional strength degrades due to the breakdown of structure of polymer by reactive, free radicals formed by high-energy radiation. Free radical formation in polymers is reduced when the aromatic rings are attached at regular intervals. This paper will review flexible packaging for PV modules.

  6. Application of digital radiography for the non-destructive characterization of radioactive waste packages

    International Nuclear Information System (INIS)

    Lierse, C.; Goebel, H.; Kaciniel, E.; Buecherl, T.; Krebs, K.

    1995-01-01

    Digital radiography (DR) using gamma-rays is a powerful tool for the non-destructive determination of various parameters which are relevant within the quality control procedure of radioactive waste packages prior to an interim storage or a final disposal. DR provides information about the waste form and the extent of filling in a typical container. It can identify internal structures and defects, gives their geometric dimensions and helps to detect non-declared inner containers, shielding materials etc. From a digital radiographic image the waste matrix homogeneity may be determined and mean attenuation coefficients as well as density values for selected regions of interest can be calculated. This data provides the basis for an appropriate attenuation correction of gamma emission measurements (gamma scanning) and makes a reliable quantification of gamma emitters in waste containers possible. Information from DR measurements are also used for the selection of interesting height positions of the object which are subsequently inspected in more detail by other non-destructive methods, e. g. by transmission computerized tomography (TCT). The present paper gives important technical specifications of an integrated tomography system (ITS) which is used to perform digital radiography as well as transmission/emission computerized tomography (TCT/ECT) on radioactive waste packages. It describes the DR mode and some of its main applications and shows typical examples of radiographs of real radioactive waste drums

  7. 5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

    KAUST Repository

    Shamim, Atif

    2012-01-01

    A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator\\'s inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.

  8. 5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

    KAUST Repository

    Shamim, Atif; Arsalan, Muhammad; Hojjat, Nasrin; Roy, Langis

    2012-01-01

    A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.

  9. Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

    Science.gov (United States)

    Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

    2011-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

  10. General Corrosion and Localized Corrosion of Waste Package Outer Barrier

    Energy Technology Data Exchange (ETDEWEB)

    K.G. Mon

    2004-10-01

    The waste package design for the License Application is a double-wall waste package underneath a protective drip shield (BSC 2004 [DIRS 168489]; BSC 2004 [DIRS 169480]). The purpose and scope of this model report is to document models for general and localized corrosion of the waste package outer barrier (WPOB) to be used in evaluating waste package performance. The WPOB is constructed of Alloy 22 (UNS N06022), a highly corrosion-resistant nickel-based alloy. The inner vessel of the waste package is constructed of Stainless Steel Type 316 (UNS S31600). Before it fails, the Alloy 22 WPOB protects the Stainless Steel Type 316 inner vessel from exposure to the external environment and any significant degradation. The Stainless Steel Type 316 inner vessel provides structural stability to the thinner Alloy 22 WPOB. Although the waste package inner vessel would also provide some performance for waste containment and potentially decrease the rate of radionuclide transport after WPOB breach before it fails, the potential performance of the inner vessel is far less than that of the more corrosion-resistant Alloy 22 WPOB. For this reason, the corrosion performance of the waste package inner vessel is conservatively ignored in this report and the total system performance assessment for the license application (TSPA-LA). Treatment of seismic and igneous events and their consequences on waste package outer barrier performance are not specifically discussed in this report, although the general and localized corrosion models developed in this report are suitable for use in these scenarios. The localized corrosion processes considered in this report are pitting corrosion and crevice corrosion. Stress corrosion cracking is discussed in ''Stress Corrosion Cracking of the Drip Shield, the Waste Package Outer Barrier, and the Stainless Steel Structural Material'' (BSC 2004 [DIRS 169985]).

  11. Distinct DNA exit and packaging portals in the virus Acanthamoeba polyphaga mimivirus.

    Science.gov (United States)

    Zauberman, Nathan; Mutsafi, Yael; Halevy, Daniel Ben; Shimoni, Eyal; Klein, Eugenia; Xiao, Chuan; Sun, Siyang; Minsky, Abraham

    2008-05-13

    Icosahedral double-stranded DNA viruses use a single portal for genome delivery and packaging. The extensive structural similarity revealed by such portals in diverse viruses, as well as their invariable positioning at a unique icosahedral vertex, led to the consensus that a particular, highly conserved vertex-portal architecture is essential for viral DNA translocations. Here we present an exception to this paradigm by demonstrating that genome delivery and packaging in the virus Acanthamoeba polyphaga mimivirus occur through two distinct portals. By using high-resolution techniques, including electron tomography and cryo-scanning electron microscopy, we show that Mimivirus genome delivery entails a large-scale conformational change of the capsid, whereby five icosahedral faces open up. This opening, which occurs at a unique vertex of the capsid that we coined the "stargate", allows for the formation of a massive membrane conduit through which the viral DNA is released. A transient aperture centered at an icosahedral face distal to the DNA delivery site acts as a non-vertex DNA packaging portal. In conjunction with comparative genomic studies, our observations imply a viral packaging pathway akin to bacterial DNA segregation, which might be shared by diverse internal membrane-containing viruses.

  12. Distinct DNA exit and packaging portals in the virus Acanthamoeba polyphaga mimivirus.

    Directory of Open Access Journals (Sweden)

    Nathan Zauberman

    2008-05-01

    Full Text Available Icosahedral double-stranded DNA viruses use a single portal for genome delivery and packaging. The extensive structural similarity revealed by such portals in diverse viruses, as well as their invariable positioning at a unique icosahedral vertex, led to the consensus that a particular, highly conserved vertex-portal architecture is essential for viral DNA translocations. Here we present an exception to this paradigm by demonstrating that genome delivery and packaging in the virus Acanthamoeba polyphaga mimivirus occur through two distinct portals. By using high-resolution techniques, including electron tomography and cryo-scanning electron microscopy, we show that Mimivirus genome delivery entails a large-scale conformational change of the capsid, whereby five icosahedral faces open up. This opening, which occurs at a unique vertex of the capsid that we coined the "stargate", allows for the formation of a massive membrane conduit through which the viral DNA is released. A transient aperture centered at an icosahedral face distal to the DNA delivery site acts as a non-vertex DNA packaging portal. In conjunction with comparative genomic studies, our observations imply a viral packaging pathway akin to bacterial DNA segregation, which might be shared by diverse internal membrane-containing viruses.

  13. Workshop on scientific and industrial applications of free electron lasers

    International Nuclear Information System (INIS)

    Difilippo, F.C.; Perez, R.B.

    1990-05-01

    A Workshop on Scientific and Industrial Applications of Free Electron Lasers was organized to address potential uses of a Free Electron Laser in the infrared wavelength region. A total of 13 speakers from national laboratories, universities, and the industry gave seminars to an average audience of 30 persons during June 12 and 13, 1989. The areas covered were: Free Electron Laser Technology, Chemistry and Surface Science, Atomic and Molecular Physics, Condensed Matter, and Biomedical Applications, Optical Damage, and Optoelectronics

  14. MOlecular MAterials Property Prediction Package (MOMAP) 1.0: a software package for predicting the luminescent properties and mobility of organic functional materials

    Science.gov (United States)

    Niu, Yingli; Li, Wenqiang; Peng, Qian; Geng, Hua; Yi, Yuanping; Wang, Linjun; Nan, Guangjun; Wang, Dong; Shuai, Zhigang

    2018-04-01

    MOlecular MAterials Property Prediction Package (MOMAP) is a software toolkit for molecular materials property prediction. It focuses on luminescent properties and charge mobility properties. This article contains a brief descriptive introduction of key features, theoretical models and algorithms of the software, together with examples that illustrate the performance. First, we present the theoretical models and algorithms for molecular luminescent properties calculation, which includes the excited-state radiative/non-radiative decay rate constant and the optical spectra. Then, a multi-scale simulation approach and its algorithm for the molecular charge mobility are described. This approach is based on hopping model and combines with Kinetic Monte Carlo and molecular dynamics simulations, and it is especially applicable for describing a large category of organic semiconductors, whose inter-molecular electronic coupling is much smaller than intra-molecular charge reorganisation energy.

  15. Application of electron accelerator for thin film in Indonesia

    International Nuclear Information System (INIS)

    Danu, Sugiarto; Darsono, Dadang

    2004-01-01

    Electron accelerator is widely used for the crosslinking of wire and cable insulation, the treatment of heat shrinkable products, precuring of tire components, and the sterilization of medical products. Research and development the use of electron accelerator for thin film in Indonesia covered radiation curing of surface coating, crosslinking of poly (butylenes succinate), crosslinking of wire, cable and heat shrinkable, sterilization of wound dressing, and prevulcanization of tire. In general, comparing with conventional method, electron beam processing have some advantages, such as, less energy consumption, much higher production rate, processing ability at ambient temperature and environmental friendly. Indonesia has a great potential to develop the application of electron accelerator, due to the remarkable growth industrial sector, the abundant of natural resources and the increasing demand of the high quality products. This paper describes the activities concerning with R and D, and application of electron accelerator for processing of thin film. (author)

  16. CERN's web application updates for electron and laser beam technologies

    CERN Document Server

    Sigas, Christos

    2017-01-01

    This report describes the modifications at CERN's web application for electron and laser beam technologies. There are updates at both the front and the back end of the application. New electron and laser machines were added and also old machines were updated. There is also a new feature for printing needed information.

  17. 49 CFR 173.472 - Requirements for exporting DOT Specification Type B and fissile packages.

    Science.gov (United States)

    2010-10-01

    ... or (202) 366-3650, or by electronic mail (e-mail) to “[email protected]” Each request is considered in... the package identification marking indicated in the U.S. Competent Authority Certificate. (e) Before... into or through which the package will be transported, unless the offeror has documentary evidence that...

  18. Perceived risks and perceived benefits of different nanotechnology foods and nanotechnology food packaging.

    Science.gov (United States)

    Siegrist, Michael; Stampfli, Nathalie; Kastenholz, Hans; Keller, Carmen

    2008-09-01

    Nanotechnology has the potential to generate new food products and new food packaging. In a mail survey in the German speaking part of Switzerland, lay people's (N=337) perceptions of 19 nanotechnology applications were examined. The goal was to identify food applications that are more likely and food applications that are less likely to be accepted by the public. The psychometric paradigm was employed, and applications were described in short scenarios. Results suggest that affect and perceived control are important factors influencing risk and benefit perception. Nanotechnology food packaging was assessed as less problematic than nanotechnology foods. Analyses of individual data showed that the importance of naturalness in food products and trust were significant factors influencing the perceived risk and the perceived benefit of nanotechnology foods and nanotechnology food packaging.

  19. Is the test of senior friendly/child resistant packaging ethical?

    Science.gov (United States)

    Bix, Laura; de la Fuente, Javier; Pimple, Kenneth D; Kou, Eric

    2009-12-01

    Research has documented the drastic reduction of unintentional poisonings of children since the introduction of child resistant (CR) packaging. However, studies also indicate that consumers report difficulty using CR packages, in part because tests which determine the 'senior friendliness' of CR designs that are used throughout the world disallow people with 'overt or obvious' disabilities from being test subjects. Our review of drug package usability suggests that the current tests of CR packaging can and should be revised to correct this problem. We use US legislation, regulation and data to exemplify these points, but the conclusions are applicable to all protocols that include the exclusionary provision.

  20. Analysis of the three-dimensional delamination behavior of stretchable electronics applications

    NARCIS (Netherlands)

    Sluis, van der O.; Timmermans, P.H.M.; Zanden, van der E.J.L.; Hoefnagels, J.P.M.; Ernst, L.J.

    2009-01-01

    Stretchable electronics offer potential application areasin biological implants interacting with human tissue. Furthermore, they facilitate increased design freedom of electronic products. Typical applications can be found in healthcare, wellness and functional clothes. A key requirement on these