WorldWideScience

Sample records for electronic packaging applications

  1. Diamond-based heat spreaders for power electronic packaging applications

    Science.gov (United States)

    Guillemet, Thomas

    As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging

  2. Carbon Nano tube Composites for Electronic Packaging Applications: A Review

    International Nuclear Information System (INIS)

    Aryasomayajula, L.; Wolter, K.J.

    2013-01-01

    Composite engineering comprises of metal matrix composites. They have high strength-weight ratio, better stiffness, economical production, and ease of availability of raw materials. The discovery of carbon nano tubes has opened new possibilities to face challenges better. Carbon Nano tubes are known for their high mechanical strength, excellent thermal and electrical properties. Recent research has made progress in fabricating carbon nano tube metal matrix and polymer-based composites. The methods of fabrication of these composites, their properties and possible applications restricted to the field of electronic packaging have been discussed in this paper. Experimental and theoretical calculations have shown improved mechanical and physical properties like tensile stress, toughness, and improved electrical and thermal properties. They have also demonstrated the ease of production of the composites and their adaptability as one can tailor their properties as per the requirement. This paper reviews work reported on fabricating and characterizing carbon- nano tube-based metal matrix and polymer composites. The focus of this paper is mainly to review the importance of these composites in the field of electronics packaging.

  3. Application of electron irradiation to food containers and packaging materials

    International Nuclear Information System (INIS)

    Ueno, Koji

    2010-01-01

    Problems caused by microbial contamination and hazardous chemicals have attracted much attention in the food industry. The number of systems such as hygienic management systems and Hazard Analysis Critical Control Point (HACCP) systems adopted in the manufacturing process is increasing. As manufacturing process control has become stricter, stricter control is also required for microbial control for containers and packaging materials (from disinfection to sterilization). Since safe and reliable methods for sterilizing food containers and packaging materials that leave no residue are required, electron beam sterilization used for medical equipment has attracted attention from the food industry. This paper describes an electron irradiation facility, methods for applying electron beams to food containers and packaging materials, and products irradiated with electron beams. (author)

  4. Electronic equipment packaging technology

    CERN Document Server

    Ginsberg, Gerald L

    1992-01-01

    The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

  5. 500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

    Science.gov (United States)

    Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

    2016-01-01

    High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

  6. Potential application of UV radiation processing in electronic packaging

    International Nuclear Information System (INIS)

    Ng Chee Mang; Lim Yoke Keem; Kumar, R.N.

    1999-01-01

    UV-curable epoxies have been formulated for use in place of the established heat cure epoxy systems for coating, adhesion and encapsulation of electronic devices. The UV-cured epoxy systems can be formulated to give comparable or even better physical and chemical properties than the more common heat cured systems. The UV systems offer significant advantage in very fast cure and hence very short production cycle time. UV systems can also be formulated to give desired properties of increased strength, high Tg, increased humidity resistance and improved temperature cycling performance

  7. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal; Romenesco, Bruce

    2011-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  8. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal

    2000-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  9. Japan's electronic packaging technologies

    Science.gov (United States)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  10. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

    Directory of Open Access Journals (Sweden)

    Masaru Ishizuka

    2011-01-01

    Full Text Available In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

  11. Power Electronics Packaging Reliability | Transportation Research | NREL

    Science.gov (United States)

    Packaging Reliability Power Electronics Packaging Reliability A photo of a piece of power electronics laboratory equipment. NREL power electronics packaging reliability research investigates the electronics packaging around a semiconductor switching device determines the electrical, thermal, and

  12. Application of GA package in functional packaging

    Science.gov (United States)

    Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

    2018-05-01

    The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

  13. Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

    International Nuclear Information System (INIS)

    Lee, Baik-Woo; Jang, Woosoon; Kim, Dong-Won; Jeong, Jeung-hyun; Nah, Jae-Woong; Paik, Kyung-Wook; Kwon, Dongil

    2004-01-01

    Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 deg. C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA)

  14. Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

    Science.gov (United States)

    Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

    2012-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

  15. Annual Symposium in Electronics Packaging

    CERN Document Server

    1991-01-01

    Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be cle...

  16. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  17. Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

    CERN Document Server

    Liu, Yong

    2012-01-01

    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

  18. Packaging and Embedded Electronics for the Next Generation

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  19. Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

    Science.gov (United States)

    Ghaffarian, Reza

    2015-01-01

    The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

  20. Applications of Active Packaging in Breads

    Directory of Open Access Journals (Sweden)

    Ali Göncü

    2017-10-01

    Full Text Available Changes on consumer preferences lead to innovations and improvements in new packaging technologies. With these new developments passive packaging technologies aiming to protect food nowadays have left their place to active and intelligent packaging technologies that have other various functions beside protection of food. Active packaging is defined as an innovative packaging type and its usage increases the shelf life of food significantly. Applications of active packaging have begun to be used for packaging of breads. In this study active packaging applications in breads have been reviewed.

  1. Electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

  2. Computation of integral electron storage ring beam characteristics in the application package DeCA. Version 3.3. A physical model

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

    1993-01-01

    In calculations and optimization of electron storage ring lattices, aside from solving the problem of particle motion stability in the ring and calculating ring structure functions and betatron tune, it is of great importance to determine the integral characteristics such as momentum compaction factor, chromaticity of the lattice, emittance, energy spread, bunch size, beam lifetime, etc. Knowing them, one is able to determine all most important properties which the beam would have in the storage ring, as well as to work out requirements for physical equipment of the ring. In this respect it is of importance to have a possibility of calculating rapidly all the parameters required. This paper describes convenient algorithms for calculating integral beam characteristics in electron storage rings, which are employed in the application package DeCA

  3. Polymers for electronic & photonic application

    CERN Document Server

    Wong, C P

    2013-01-01

    The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be info

  4. Use of EVOH for Food Packaging Applications

    OpenAIRE

    Gavara, Rafael; Catalá Moragrega, Ramón; López Carballo, Gracia; Cerisuelo, Josep Pascual; Domínguez, Irene; Muriel Galet, Virginia; Hernández Muñoz, Pilar

    2017-01-01

    Ethylene-vinyl alcohol copolymers (EVOH) are a family of thermoplastic polymers with application in many industrial sectors including packaging and, especially, food packaging. The main characteristic of EVOH copolymers for packaging applications is their outstanding barrier to gases (oxygen, carbon dioxide, …) and organic vapors (food aroma). EVOH is applied in multilayer structures for bags, trays, cups, bottles, squeezable tubes or jars to protect oxygen-sensitive products. However, the hy...

  5. Microstructure and property measurements on in situ TiB2/70Si–Al composite for electronic packaging applications

    International Nuclear Information System (INIS)

    Zhang, L.; Gan, G.S.; Yang, B.

    2012-01-01

    Highlights: ► 2.0 wt.%TiB 2 /70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB 2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties. -- Abstract: A novel reactive technique has been employed in fabrication of 2.0 wt.%TiB 2 /70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB 2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0 wt.%TiB 2 /70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.

  6. The application package DeCA for calculating cyclic accelerators

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Zelinsky, A.Yu.; Strelkov, M.A.

    1993-01-01

    The application Package DeCA (Design Cyclic Accelerator) is offered to solve a set of problem which arise on designing electron storage rings. The package is based on the block principle. This makes it extremely flexible in designing storage rings and investigating beam dynamics in them. The package is intended for a user not familiar with programming languages, it is arranged so that the user familiar with FORTRAN-77 can easily extend the package functions. This is of particular interest, when the input data are the storage ring or electron bunch parameters. The code allows operation in both the batch and interactive modes. The programming language is FORTRAN-77. The capacity of the total package is 40,000 code lines. The necessary main storage capacity for the total version is 4 Mbytes

  7. Electronic packaging: new results in singulation by Laser Microjet

    Science.gov (United States)

    Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

    2004-07-01

    Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

  8. Food Nanotechnology - Food Packaging Applications

    Science.gov (United States)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part, the impetus for this predicted growth is the ...

  9. Functional Requirements for an Electronic Work Package System

    Energy Technology Data Exchange (ETDEWEB)

    Oxstrand, Johanna H. [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2016-12-01

    This document provides a set of high level functional requirements for a generic electronic work package (eWP) system. The requirements have been identified by the U.S. nuclear industry as a part of the Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative. The functional requirements are mainly applied to eWP system supporting Basic and Moderate types of smart documents, i.e., documents that have fields for recording input such as text, dates, numbers, and equipment status, and documents which incorporate additional functionalities such as form field data “type“ validation (e.g. date, text, number, and signature) of data entered and/or self-populate basic document information (usually from existing host application meta data) on the form when the user first opens it. All the requirements are categorized by the roles; Planner, Supervisor, Craft, Work Package Approval Reviewer, Operations, Scheduling/Work Control, and Supporting Functions. The categories Statistics, Records, Information Technology are also included used to group the requirements. All requirements are presented in Section 2 through Section 11. Examples of more detailed requirements are provided for the majority of high level requirements. These examples are meant as an inspiration to be used as each utility goes through the process of identifying their specific requirements. The report’s table of contents provides a summary of the high level requirements.

  10. Packaging Technologies for 500C SiC Electronics and Sensors

    Science.gov (United States)

    Chen, Liang-Yu

    2013-01-01

    Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

  11. APPLICATION OF NANOTECHNOLOGY IN FOOD PACKAGING

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2014-04-01

    Full Text Available Nanotechnology involves the design, production and use of structures through control of the size and shape of the materials at the nanometre scale. Also, nanomaterials have been already applied in many fields of human life. Nanocomposites have already led to several innovations with potential applications in the food packaging sector. The use of nanocomposite formulations is expected to considerably enhance the shelf-life of many types of food. This improvement can lead to lower weight packages because less material is needed to obtain the same or even better barrier properties. This, in turn, can lead to reduced package cost with less packaging waste. Antimicrobial packaging is another area with high potential for applying nanocomposite technology. Nanostructured antimicrobials have a higher surface area-to-volume ratio when compared with their higher scale counterparts. Therefore, antimicrobial nanocomposite packaging systems are supposed to be particularly efficient in their activities against microbial cells. In this review, definition of nanomaterials is presented. Besides, the paper shows examples of nanocomposities and antimicrobial nanopackaging mainly with the use of nanosilver. Moreover, nanoparticles such ZnO, TiO2, MgO and nanosensors in packaging were presented.

  12. Antimicrobial nanomaterials for food packaging applications

    Directory of Open Access Journals (Sweden)

    Radusin Tanja I.

    2016-01-01

    Full Text Available Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to these challenges, with different solutions-from improvements in materials properties to active packaging solutions, or both at the same time. Incorporation of nanoparticles into polymer matrix and preparation of hybrid materials is one of the methods of modification of polymer properties. Nano scaled materials with antimicrobial properties can act as active components when added into polymer, thereby leading to prolonged protective function of pristine food packaging material. This paper presents a review in the field of antimicrobial nanomaterials for food packaging in turn of technology, application and regulatory issues.

  13. Packaging Technologies for High Temperature Electronics and Sensors

    Science.gov (United States)

    Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

    2013-01-01

    This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

  14. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.

    2016-10-14

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  15. Decal Electronics: Printable Packaged with 3D Printing High-Performance Flexible CMOS Electronic Systems

    KAUST Repository

    Sevilla, Galo T.; Cordero, Marlon D.; Nassar, Joanna M.; Hanna, Amir; Kutbee, Arwa T.; Carreno, Armando Arpys Arevalo; Hussain, Muhammad Mustafa

    2016-01-01

    High-performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll-to-roll fashion for highly manufacturable printed flexible high-performance electronic systems.

  16. NASA Electronic Parts and Packaging (NEPP) Program - Update

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

  17. JTEC Panel report on electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

  18. Advanced materials for thermal management of electronic packaging

    CERN Document Server

    Tong, Xingcun Colin

    2011-01-01

    The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility

  19. 76 FR 30243 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2011-05-24

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application Packages are available from the IRS on May 23, 2011... Elderly (TCE) Program is June 30, 2011. Electronic copies of the application package can be obtained by...

  20. 75 FR 22437 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2010-04-28

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application packages are available from the IRS at this time... Elderly (TCE) Program is July 9, 2010. ADDRESSES: Electronic copies of the application package can be...

  1. A computer code package for electron transport Monte Carlo simulation

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    1999-01-01

    A computer code package was developed for solving various electron transport problems by Monte Carlo simulation. It is based on condensed history Monte Carlo algorithm. In order to get reliable results over wide ranges of electron energies and target atomic numbers, specific techniques of electron transport were implemented such as: Moliere multiscatter angular distributions, Blunck-Leisegang multiscatter energy distribution, sampling of electron-electron and Bremsstrahlung individual interactions. Path-length and lateral displacement corrections algorithms and the module for computing collision, radiative and total restricted stopping powers and ranges of electrons are also included. Comparisons of simulation results with experimental measurements are finally presented. (author)

  2. Smart packaging systems for food applications: a review.

    Science.gov (United States)

    Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

    2015-10-01

    Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

  3. Packaging of silicon sensors for microfluidic bio-analytical applications

    International Nuclear Information System (INIS)

    Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

    2009-01-01

    A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

  4. 77 FR 20695 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2012-04-05

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application Packages are available electronically from the IRS on May 1, 2012 by visiting: IRS.gov (key [[Page 20696

  5. Assessment of microelectronics packaging for high temperature, high reliability applications

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, F.

    1997-04-01

    This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

  6. Application of Green Environmentally Friendly Materials in Food Packaging

    Directory of Open Access Journals (Sweden)

    Jixia Li

    2017-11-01

    Full Text Available With social development, requirements on the spiritual and material life have increased. However, some environmental issues appear, for example, in food packaging. Application of environment-friendly materials in food packaging has been more and more attractive. This study analyses the characteristics of degradable food packaging material and the existing problems, proposes the manufacturing of food packaging with poly(lactic acid/nanocrystalline cellulose composite material, tests its thermal and mechanical properties, and applies it to the design of food packaging. The results demonstrate that the thermal and mechanical properties of the material could satisfy the requirements of food packaging and that the material is applicable to the design of food packaging in the future. This work provides a reference for the application of green, environment-friendly materials in the design of food packaging.

  7. Industrial applications or electron beams

    International Nuclear Information System (INIS)

    Martin, J. I.

    2001-01-01

    Industrial use of electron beams began in the 1950's with the crosslinking of polyethylene film and wire insulation. Today the number of electron beam Processing Systems installed for industrial applications throughout the world has grown to more than six hundred stations in over 35 countries. Total installed power is now approaching 40 megawatts (over 8 million tons of products per year). Electron beam is now utilized by many major industries including plastics, automotive, rubber goods, wire and cable, electrical insulation, semiconductor, medical, packaging, or pollution control. The principal effect of high-energy electrons is to produce ions in the materials treated, resulting in the liberation of orbital electrons. As a result, the original molecule is modified and the ree radicals combine to form new molecules with new chemical reactions or dis organisation od the DNA chains of living organisms (insects, fungus, microorganisms, etc.). (Author) 8 refs

  8. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  9. Radiation disinfestation of used packagings: irradiation trials with electron beams

    International Nuclear Information System (INIS)

    Ignatowicz, S.; Zaedee, I.

    1994-01-01

    Used bags, sacks and other packagings are often infested with insects and mites - pest of stored products. Such packagings provide a source of infestation of a new lot or unit of agricultural products. Cleaning of repeatedly used packages is the most important preventive method. After using, the bags and sacks should be carefully beaten with a mechanical or hand beater. When pests are found, the packages should be disinfested with hot air or hot water. Larger numbers of bags are usually fumigated in a special fumigation chamber. Disinfestation by radiation processing is potentially a feasible substitute for chemical fumigation. In the present paper trials of radiation disinfestation of used bags are described and discussed. Information about using electron beams for pest disinfestation of jute and polyvinyl chloride bags (plastic bags) is provided. The absorbed dose is the most important irradiation process parameter. The lethal effects equivalent to chemical insecticides are obtained by high doses of ionizing radiation. Control of insect and/or mite infestation of the repeatedly used packagings may be secured by ionizing radiation applied at 2-3 kGy. These doses result in complete mortality of stored product pests within a few days. The radiation must penetrate deeply into the target product at sufficient level. Gamma rays and X-rays penetrate into the treated products easily but electron radiation penetrating is much lower, depending on electron energy applied. The results of this study indicate that bags made of polyvinyl chloride may be disinfested with electron beams when are created as separate units or batches up to 50 bags. Penetrability of jute bags is lower than the plastic bags. Therefore the jute bags should be irradiated with electrons as batches containing no more than 30 bags. (author)

  10. Thermal expansion model for multiphase electronic packaging materials

    International Nuclear Information System (INIS)

    Allred, B.E.; Warren, W.E.

    1991-01-01

    Control of thermal expansion is often necessary in the design and selection of electronic packages. In some instances, it is desirable to have a coefficient of thermal expansion intermediate between values readily attainable with single or two phase materials. The addition of a third phase in the form of fillers, whiskers, or fibers can be used to attain intermediate expansions. To help design the thermal expansion of multiphase materials for specific applications, a closed form model has been developed that accurately predicts the effective elastic properties of isotropic filled materials and transversely isotropic lamina. Properties of filled matrix materials are used as inputs to the lamina model to obtain the composite elastic properties as a function of the volume fraction of each phase. Hybrid composites with two or more fiber types are easily handled with this model. This paper reports that results for glass, quartz, and Kevlar fibers with beta-eucryptite filled polymer matrices show good agreement with experimental results for X, Y, and Z thermal expansion coefficients

  11. Application of Green Environmentally Friendly Materials in Food Packaging

    OpenAIRE

    Jixia Li

    2017-01-01

    With social development, requirements on the spiritual and material life have increased. However, some environmental issues appear, for example, in food packaging. Application of environment-friendly materials in food packaging has been more and more attractive. This study analyses the characteristics of degradable food packaging material and the existing problems, proposes the manufacturing of food packaging with poly(lactic acid)/nanocrystalline cellulose composite material, tests its therm...

  12. Non-destructive testing of electronic component packages

    International Nuclear Information System (INIS)

    Anderle, C.

    1975-01-01

    A non-destructive method of investigating packaged parts of semiconductor components by X radiation is described and the relevant theoretical relations limiting this technique are derived. The application of the technique is demonstrated in testing several components. The described method is iNsimple and quick. (author)

  13. Biobased Packaging - Application in Meat Industry

    Directory of Open Access Journals (Sweden)

    S. Wilfred Ruban

    2009-04-01

    Full Text Available Because of growing problems of waste disposal and because petroleum is a nonrenewable resource with diminishing quantities, renewed interest in packaging research is underway to develop and promote the use of “bio-plastics.” In general, compared to conventional plastics derived from petroleum, bio-based polymers have more diverse stereochemistry and architecture of side chains which enable research scientists a greater number of opportunities to customize the properties of the final packaging material. The primary challenge facing the food (Meat industry in producing bio-plastic packaging, currently, is to match the durability of the packaging with product shelf-life. Notable advances in biopolymer production, consumer demand for more environmentally-friendly packaging, and technologies that allow packaging to do more than just encompass the food are driving new and novel research and developments in the area of packaging for muscle foods. [Vet. World 2009; 2(2.000: 79-82

  14. Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules

    OpenAIRE

    Lostetter, Alexander B.

    1998-01-01

    High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and thus ultimately reduce the cost of the power electronic circuits. The problem with this strategy in conventional packaging, however, is that at high frequencies, interconnects between the power devic...

  15. NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

    Science.gov (United States)

    Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

    2018-01-01

    NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

  16. Application of active packaging systems in probiotic foods

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2013-09-01

    Full Text Available Background: The packaging of the product has an important role in the protection of the stability of the final product. The use of active packaging system is due to play an increasingly important role by offering numerous and innovative solutions for extending the shelf-life or improve food quality and safety. Methods: On the basis of broad review of the current state of the art in world literature, application of packaging systems in probiotics foods was discussed. Results: In this study presented research and development in packaging systems for probiotics foods, using suitable materials with combine passive with active packaging solutions. Conclusion: Active packages with incorporated oxygen barrier materials or films with selective permeability properties also have potential applications in the packaging of probiotic food products. This is a broad field of research for scientists and industry.

  17. Microcomputer applications for NSSS data package review

    International Nuclear Information System (INIS)

    Eng, D.J.; Smith, F.M.

    1984-01-01

    Associated with each component of a Nuclear Steam Supply System are the necessary supporting documents which demonstrate compliance with applicable codes, specifications and design criteria. The documents are grouped into individual data packages, and may exceed 800 in number for a major installation. A complete review, initiated by a utility in response to federal code regulations (10 CFR 50), can involve a tremendous number of review transactions. A data management system to assist the reviewer in the tracking and resolution of discrepancy items is currently under development and use. The system uses microcomputer-based relational database management software and provides complete and flexible capabilities to process database components and attributes based on user specified criteria. The completed database is a ''portable'' system, and can be utilized on an as-needed basis after the review is completed. A discrepancy analysis is performed to identify relations between manufacturer and discrepancy occurrence, part type vs. discrepancy type, etc. These results may prove useful in subsequent reviews or application to existing QA procedures

  18. 7 CFR 1944.72 - Application packaging orientation and training.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 13 2010-01-01 2009-01-01 true Application packaging orientation and training. 1944... SERVICE, RURAL BUSINESS-COOPERATIVE SERVICE, RURAL UTILITIES SERVICE, AND FARM SERVICE AGENCY, DEPARTMENT... Grants § 1944.72 Application packaging orientation and training. Agency approval officials will orient...

  19. A computer code package for Monte Carlo photon-electron transport simulation Comparisons with experimental benchmarks

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    2000-01-01

    A computer code package (PTSIM) for particle transport Monte Carlo simulation was developed using object oriented techniques of design and programming. A flexible system for simulation of coupled photon, electron transport, facilitating development of efficient simulation applications, was obtained. For photons: Compton and photo-electric effects, pair production and Rayleigh interactions are simulated, while for electrons, a class II condensed history scheme was considered, in which catastrophic interactions (Moeller electron-electron interaction, bremsstrahlung, etc.) are treated in detail and all other interactions with reduced individual effect on electron history are grouped together using continuous slowing down approximation and energy straggling theories. Electron angular straggling is simulated using Moliere theory or a mixed model in which scatters at large angles are treated as distinct events. Comparisons with experimentally benchmarks for electron transmission and bremsstrahlung emissions energy and angular spectra, and for dose calculations are presented

  20. APPLICATION OF PARAGRAPHEMICS ELEMENTS WHILE MAKING PACKAGING

    Directory of Open Access Journals (Sweden)

    V. V. Кuzmich

    2014-01-01

    Full Text Available The paper investigates mechanisms for creation of paragraphemics elements in printed advertisement on the packaging that attract attention to semantic characteristics of words and ensure a deeper understanding of the advertising text in comparison with superficial perception

  1. Antimicrobial nanomaterials for food packaging applications

    OpenAIRE

    Radusin Tanja I.; Ristić Ivan S.; Pilić Branka M.; Novaković Aleksandra R.

    2016-01-01

    Food packaging industry presents one of the fastest growing industries nowadays. New trends in this industry, which include reducing food as well as packaging waste, improved preservation of food and prolonged shelf-life together with substitution of petrochemical sources with renewable ones are leading to development of this industrial area in diverse directions. This multidisciplinary challenge is set up both in front of food and material scientists. Nanotechnology is recently answering to ...

  2. Electronic Submissions of Pesticide Applications

    Science.gov (United States)

    Applications for pesticide registration can be submitted electronically, including forms, studies, and draft product labeling. Applicants need not submit multiple electronic copies of any pieces of their applications.

  3. Maintainability design criteria for packaging of spacecraft replaceable electronic equipment.

    Science.gov (United States)

    Kappler, J. R.; Folsom, A. B.

    1972-01-01

    Maintainability must be designed into long-duration spacecraft and equipment to provide the required high probability of mission success with the least cost and weight. The ability to perform repairs quickly and easily in a space environment can be achieved by imposing specific maintainability design criteria on spacecraft equipment design and installation. A study was funded to investigate and define design criteria for electronic equipment that would permit rapid removal and replacement in a space environment. The results of the study are discussed together with subsequent simulated zero-g demonstration tests of a mockup with new concepts for packaging.

  4. Electron beam simulation applicators

    International Nuclear Information System (INIS)

    Purdy, J.A.

    1983-01-01

    A system for simulating electron beam treatment portals using low-temperature melting point alloy is described. Special frames having the same physical dimensions as the electron beam applicators used on the Varian Clinac 20 linear accelerator were designed and constructed

  5. Application of nano-packaging in aquatics

    Directory of Open Access Journals (Sweden)

    D Jafarpour

    2018-03-01

    Conclusion: With regard to aquatics high nutritional value and their important presence in diet one should think of a way to increase it's survivability and maintaining quality. For this, nano technology can help packaging aquatics. Nano can be applied considerably in food health and environment protection.

  6. An Assessment of the Library Application Software Packages in ...

    African Journals Online (AJOL)

    Journal Home > Vol 7, No 2 (2007) > ... the study examined the adopted softwares' security, compatibility/capabilities, ... The study found that most application packages available in the Nigerian automation market place are effective since they ...

  7. Electronic circuits fundamentals & applications

    CERN Document Server

    Tooley, Mike

    2015-01-01

    Electronics explained in one volume, using both theoretical and practical applications.New chapter on Raspberry PiCompanion website contains free electronic tools to aid learning for students and a question bank for lecturersPractical investigations and questions within each chapter help reinforce learning Mike Tooley provides all the information required to get to grips with the fundamentals of electronics, detailing the underpinning knowledge necessary to appreciate the operation of a wide range of electronic circuits, including amplifiers, logic circuits, power supplies and oscillators. The

  8. Comparison of PV system design software packages for urban applications

    Energy Technology Data Exchange (ETDEWEB)

    Gharakhani Siraki, Arbi; Pillay, Pragasen

    2010-09-15

    A large number of software packages are available for solar resource evaluation and PV system design. However, few of them are suitable for urban applications. In this paper a comparison has been made between two specifically designed solar tools known as the Ecotect 2010 and the PVsyst 5.05. Conclusions have been made for proper use of these packages based on their specifications and privileges. Moreover, the calculations have been repeated with HOMER software package (which is a generic tool) for the same location. The results suggest that a generic solar software tool should not be used for an urban application.

  9. Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

    Science.gov (United States)

    Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

    2015-01-01

    This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

  10. Thermal interface material characterization for cryogenic electronic packaging solutions

    Science.gov (United States)

    Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

    2017-12-01

    As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

  11. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  12. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

  13. Optical Thermal Characterization Enables High-Performance Electronics Applications

    Energy Technology Data Exchange (ETDEWEB)

    2016-02-01

    NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.

  14. 78 FR 17777 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

    Science.gov (United States)

    2013-03-22

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... for the Elderly (TCE) Program. DATES: Application Packages are available electronically from the IRS on May 1, 2013 by visiting: IRS.gov (key word search--``TCE'') or through Grants.gov . The deadline...

  15. Application package DeCA. Version 3.3

    International Nuclear Information System (INIS)

    Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

    1993-01-01

    The application package DeCA (Design of Cyclic Accelerators) is intended for solving a wide range of problems related to the dynamics of charged particle beams in cyclic accelerators and storage rings. It can be used for both design or modification purposes and numerical experimentation. The package DeCA consist of several program blocks, which are unified by functional principle. In this article we are consider the description of two blocks: the control block (COMM), and the description of magnetic elements and lattices block (IMOS). The formats of package commands, language of lattice definition and list of own commands of these blocks are described. (author). 4 refs., 3 ape

  16. Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

  17. Emerging Chitosan-Based Films for Food Packaging Applications.

    Science.gov (United States)

    Wang, Hongxia; Qian, Jun; Ding, Fuyuan

    2018-01-17

    Recent years have witnessed great developments in biobased polymer packaging films for the serious environmental problems caused by the petroleum-based nonbiodegradable packaging materials. Chitosan is one of the most abundant biopolymers after cellulose. Chitosan-based materials have been widely applied in various fields for their biological and physical properties of biocompatibility, biodegradability, antimicrobial ability, and easy film forming ability. Different chitosan-based films have been fabricated and applied in the field of food packaging. Most of the review papers related to chitosan-based films are focusing on antibacterial food packaging films. Along with the advances in the nanotechnology and polymer science, numerous strategies, for instance direct casting, coating, dipping, layer-by-layer assembly, and extrusion, have been employed to prepare chitosan-based films with multiple functionalities. The emerging food packaging applications of chitosan-based films as antibacterial films, barrier films, and sensing films have achieved great developments. This article comprehensively reviews recent advances in the preparation and application of engineered chitosan-based films in food packaging fields.

  18. Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

    Science.gov (United States)

    Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

    2012-01-01

    Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

  19. Package

    Directory of Open Access Journals (Sweden)

    Arsić Zoran

    2013-01-01

    Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

  20. A comparison and benchmark of two electron cloud packages

    Energy Technology Data Exchange (ETDEWEB)

    Lebrun, Paul L.G.; Amundson, James F; Spentzouris, Panagiotis G; Veitzer, Seth A

    2012-01-01

    We present results from precision simulations of the electron cloud (EC) problem in the Fermilab Main Injector using two distinct codes. These two codes are (i)POSINST, a F90 2D+ code, and (ii)VORPAL, a 2D/3D electrostatic and electromagnetic code used for self-consistent simulations of plasma and particle beam problems. A specific benchmark has been designed to demonstrate the strengths of both codes that are relevant to the EC problem in the Main Injector. As differences between results obtained from these two codes were bigger than the anticipated model uncertainties, a set of changes to the POSINST code were implemented. These changes are documented in this note. This new version of POSINST now gives EC densities that agree with those predicted by VORPAL, within {approx}20%, in the beam region. The root cause of remaining differences are most likely due to differences in the electrostatic Poisson solvers. From a software engineering perspective, these two codes are very different. We comment on the pros and cons of both approaches. The design(s) for a new EC package are briefly discussed.

  1. Electron grafted barrier coatings for packaging film modification

    International Nuclear Information System (INIS)

    Rangwalla, I.J.; Nablo, S.V.

    1993-01-01

    The O 2 barrier performance of organosilane films, coated, dried and electron beam grafted to polyolefin film has been studied. Excellent anti-scalping properties based upon limonene (dipentene) transmission measurements have also been observed. Results are also reported on O 2 permeability reduction when the process is applied to common barrier polymers such as EVOH and acrylonitrile. Experience with its in-line application on LDPE is discussed. (author)

  2. Application of phase change materials in thermal management of electronics

    International Nuclear Information System (INIS)

    Kandasamy, Ravi; Wang Xiangqi; Mujumdar, Arun S.

    2007-01-01

    Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications

  3. Polysaccharide-Based Membranes in Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Ana R. V. Ferreira

    2016-04-01

    Full Text Available Plastic packaging is essential nowadays. However, the huge environmental problem caused by landfill disposal of non-biodegradable polymers in the end of life has to be minimized and preferentially eliminated. The solution may rely on the use of biopolymers, in particular polysaccharides. These macromolecules with film-forming properties are able to produce attracting biodegradable materials, possibly applicable in food packaging. Despite all advantages of using polysaccharides obtained from different sources, some drawbacks, mostly related to their low resistance to water, mechanical performance and price, have hindered their wider use and commercialization. Nevertheless, with increasing attention and research on this field, it has been possible to trace some strategies to overcome the problems and recognize solutions. This review summarizes some of the most used polysaccharides in food packaging applications.

  4. Polysaccharide-Based Membranes in Food Packaging Applications

    Science.gov (United States)

    Ferreira, Ana R. V.; Alves, Vítor D.; Coelhoso, Isabel M.

    2016-01-01

    Plastic packaging is essential nowadays. However, the huge environmental problem caused by landfill disposal of non-biodegradable polymers in the end of life has to be minimized and preferentially eliminated. The solution may rely on the use of biopolymers, in particular polysaccharides. These macromolecules with film-forming properties are able to produce attracting biodegradable materials, possibly applicable in food packaging. Despite all advantages of using polysaccharides obtained from different sources, some drawbacks, mostly related to their low resistance to water, mechanical performance and price, have hindered their wider use and commercialization. Nevertheless, with increasing attention and research on this field, it has been possible to trace some strategies to overcome the problems and recognize solutions. This review summarizes some of the most used polysaccharides in food packaging applications. PMID:27089372

  5. Packaging printed circuit boards: A production application of interactive graphics

    Science.gov (United States)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  6. MINUIT package parallelization and applications using the RooFit package

    International Nuclear Information System (INIS)

    Lazzaro, Alfio; Moneta, Lorenzo

    2010-01-01

    The fitting procedures are based on numerical minimization of functions. The MINUIT package is the most common package used for such procedures in High Energy Physics community. The main algorithm in this package, MIGRAD, searches the minimum of a function using the gradient information. For each minimization iteration, MIGRAD requires the calculation of the derivative for each free parameter of the function to be minimized. Minimization is required for data analysis problems based on the maximum likelihood technique. The calculation of complex likelihood functions, with several free parameters, many independent variables and large data samples, can be very CPU-time consuming. Then, the minimization process requires the calculation of the likelihood functions several times for each minimization iteration. In this paper we will show how MIGRAD algorithm and the likelihood function calculation can be easily parallelized using Message Passing Interface techniques. We will present the speed-up improvements obtained in typical physics applications such as complex maximum likelihood fits using the RooFit package.

  7. Predictive microbiology for food packaging applications

    Science.gov (United States)

    Mathematical modeling has been applied to describe the microbial growth and inactivation in foods for decades and is also known as ‘Predictive microbiology’. When models are developed and validated, their applications may save cost and time. The Pathogen Modeling Program (PMP), a collection of mode...

  8. 3D packaging of a microfluidic system with sensory applications

    Science.gov (United States)

    Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

    1997-09-01

    Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

  9. Applications for electronic documents

    International Nuclear Information System (INIS)

    Beitel, G.A.

    1995-01-01

    This paper discusses the application of electronic media to documents, specifically Safety Analysis Reports (SARs), prepared for Environmental Restoration and Waste Management (ER ampersand WM) programs being conducted for the Department of Energy (DOE) at the Idaho National Engineering Laboratory (INEL). Efforts are underway to upgrade our document system using electronic format. To satisfy external requirements (DOE, State, and Federal), ER ampersand WM programs generate a complement of internal requirements documents including a SAR and Technical Safety Requirements along with procedures and training materials. Of interest, is the volume of information and the difficulty in handling it. A recently prepared ER ampersand WM SAR consists of 1,000 pages of text and graphics; supporting references add 10,000 pages. Other programmatic requirements documents consist of an estimated 5,000 pages plus references

  10. Analysis of Design of Mixed-Signal Electronic Packaging

    National Research Council Canada - National Science Library

    Pileggi, Lawrence

    1999-01-01

    The objective of this project is to develop innovative algorithms and prototype tools that will help facilitate the design of mixed signal multi-chip modules and packaging in a manner that is similar...

  11. Sustainable packaging design for consumer electronics products: Balancing marketing, logistics and environmental requirements

    OpenAIRE

    Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

    2007-01-01

    Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of sophistication of data concerning a packagings marketing performance is limited, decisions are often strongly based on beliefs. This is reflected in inconsistencies in packaging that is currently in...

  12. Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

    NARCIS (Netherlands)

    Tian, J.

    2013-01-01

    The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

  13. Electronic Noses and Applications

    Directory of Open Access Journals (Sweden)

    Martine LUMBRERAS

    2014-05-01

    Full Text Available Electronic noses are customized devices employed to detect and to identify gaseous mixtures, even to give the concentration of the atmosphere components. Nowadays, the research in this domain is more and more growing, in Europe and other countries in the world, for many applications, such as environmental protection, food industries, perfumery, public safety, medicine, and pharmacy. Electronic noses allow to detect many organic volatile compounds, for which there is no specific detector. They constitute an alternative to complex, long, and too expensive existing methods, unable to ensure continuous monitoring. Their conception deals with many related areas (metrology, chemistry, physics, electronics, informatics, statistics, modelisation as well as areas related to the molecules to be detected. The system training is a primary step: during a measurement under a gaseous atmosphere, we must record the sensor time-responses in a treatment system, while specifying the name of the concerned odor. This process must be repeated many times for each studied atmosphere, and for all the chosen atmospheres. So a learning data base can be created, made from representative parameters of all the realized measures. After this training stage, clustering software will classify the data analysis in “concentration” or “nature” groups. Using the group separation rules given by this supervised classification, the system will be able to find itself the name of an odor or a concentration.

  14. A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages

    International Nuclear Information System (INIS)

    Kay, N.R.; Ghosh, S.; Guven, I.; Madenci, E.

    2006-01-01

    This study concerns the development of a combined experimental and analytical technique to determine the critical values of fracture parameters for interfaces between dissimilar materials in electronic packages. This technique utilizes specimens from post-production electronic packages. The mechanical testing is performed inside a scanning electron microscope while the measurements are achieved by means of digital image correlation. The measured displacements around the crack tip are used as the boundary conditions for the analytical model to compute the energy release rate. The critical energy release rate values obtained from post-production package specimens are obtained to be lower than those laboratory specimens

  15. Applications of electron accelerator in Malaysia

    Energy Technology Data Exchange (ETDEWEB)

    Khairul Zaman Hj. Mohd Dahlan [Malaysian Institute for Nuclear Technology Research (MINT), Bangi, Selangor Darul Ehsan (Malaysia)

    2003-02-01

    Current status of radiation processing, as one of the core research programs of the Malaysian Institute for Nuclear Technology Research (MINT), is presented. Industrial applications of six electron accelerators from 150 kV up to 3 MV in Malaysia now in operation are mainly for curing of surface coatings, crosslinking of tubes, heat shrinkable tubes and packaging films, crosslinking of wire insulation. Their performances are listed. New technology now in R and D stage includes natural rubber, sago starch and chitosan for biomedical applications, and radiation curable materials from oil palm for pressure sensitive adhesive and printing ink. (S. Ohno)

  16. Applications of electron accelerator in Malaysia

    International Nuclear Information System (INIS)

    Khairul Zaman Hj. Mohd Dahlan

    2003-01-01

    Current status of radiation processing, as one of the core research programs of the Malaysian Institute for Nuclear Technology Research (MINT), is presented. Industrial applications of six electron accelerators from 150 kV up to 3 MV in Malaysia now in operation are mainly for curing of surface coatings, crosslinking of tubes, heat shrinkable tubes and packaging films, crosslinking of wire insulation. Their performances are listed. New technology now in R and D stage includes natural rubber, sago starch and chitosan for biomedical applications, and radiation curable materials from oil palm for pressure sensitive adhesive and printing ink. (S. Ohno)

  17. Industrial applications of electron beam accelerators

    International Nuclear Information System (INIS)

    Braid, W.G. Jr.

    1976-01-01

    The use of electron beam accelerators for crosslinking polyolefins for shrinking food packaging is discussed. Irradiation procedures, accelerator characteristics, and industrial operations are described

  18. Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

    Science.gov (United States)

    Bryant, Robert G.

    2007-01-01

    Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

  19. CONSUL code package application for LMFR core calculations

    Energy Technology Data Exchange (ETDEWEB)

    Chibinyaev, A.V.; Teplov, P.S.; Frolova, M.V. [RNC ' Kurchatovskiy institute' , Kurchatov sq.1, Moscow (Russian Federation)

    2008-07-01

    CONSUL code package designed for the calculation of reactor core characteristics has been developed at the beginning of 90's. The calculation of nuclear reactor core characteristics is carried out on the basis of correlated neutron, isotope and temperature distributions. The code package has been generally used for LWR core characteristics calculations. At present CONSUL code package was adapted to calculate liquid metal fast reactors (LMFR). The comparisons with IAEA computational test 'Evaluation of benchmark calculations on a fast power reactor core with near zero sodium void effect' and BN-1800 testing calculations are presented in the paper. The IAEA benchmark core is based on the innovative core concept with sodium plenum above the core BN-800. BN-1800 core is the next development step which is foreseen for the Russian fast reactor concept. The comparison of the operational parameters has shown good agreement and confirms the possibility of CONSUL code package application for LMFR core calculation. (authors)

  20. Nanotechnology in meat processing and packaging: potential applications - a review.

    Science.gov (United States)

    Ramachandraiah, Karna; Han, Sung Gu; Chin, Koo Bok

    2015-02-01

    Growing demand for sustainable production, increasing competition and consideration of health concerns have led the meat industries on a path to innovation. Meat industries across the world are focusing on the development of novel meat products and processes to meet consumer demand. Hence, a process innovation, like nanotechnology, can have a significant impact on the meat processing industry through the development of not only novel functional meat products, but also novel packaging for the products. The potential benefits of utilizing nanomaterials in food are improved bioavailability, antimicrobial effects, enhanced sensory acceptance and targeted delivery of bioactive compounds. However, challenges exist in the application of nanomaterials due to knowledge gaps in the production of ingredients such as nanopowders, stability of delivery systems in meat products and health risks caused by the same properties which also offer the benefits. For the success of nanotechnology in meat products, challenges in public acceptance, economics and the regulation of food processed with nanomaterials which may have the potential to persist, accumulate and lead to toxicity need to be addressed. So far, the most promising area for nanotechnology application seems to be in meat packaging, but the long term effects on human health and environment due to migration of the nanomaterials from the packaging needs to be studied further. The future of nanotechnology in meat products depends on the roles played by governments, regulatory agencies and manufacturers in addressing the challenges related to the application of nanomaterials in food.

  1. Quantum lattice model solver package HΦ. Applications to thermal and spin excitations in proximity of spin liquids

    International Nuclear Information System (INIS)

    Yamaji, Youhei; Misawa, Takahiro; Yoshimi, Kazuyoshi; Kawamura, Mitsuaki; Kawashima, Naoki; Todo, Synge

    2017-01-01

    HΦ is a program package based on the Lanczos-type method applicable to a broad range of quantum lattice models. HΦ has a flexible and simple-to-use interface, and runs efficiently on massively parallel computers. Unlike most existing packages, HΦ supports finite-temperature calculations. In this article, we apply HΦ to typical strongly correlated electron systems in proximity to quantum spin liquids. (author)

  2. PET based nanocomposite films for microwave packaging applications

    International Nuclear Information System (INIS)

    Galdi, M. R.; Olivieri, R.; Liguori, L.; Albanese, D.; Di Matteo, M.; Di Maio, L.

    2015-01-01

    In recent years, changes in life standards have promoted the diffusion of Ready to Cook (RTC) and Ready to Eat (RTE) products for microwave ovens. However, the main limits in microwave (MW) ovens usage are often related to the proper choice of packaging materials suitable for such technology. In fact, packages for microwaveable RTC and RTE foods should ensure adequate preservation of the product before cooking/heating such as high barriers to gases and aromas and adequate control of water vapor transmission. In addition, microwaveable packaging material must be transparent to MW, thermally stable and resistant to the mechanical stress induced by the accumulation in the head space of volatile substances produced during the cooking. Polymeric materials are good candidates for microwaveable packaging thanks to their transparency to MW. In the last years a great interest is devoted to developing innovative solution based on the use of additives or systems that act as susceptors or heating enhancers for improving the characteristics of polymers in cooking/heating in MW ovens. The present work was focused on the production and characterization of nanocomposite copolyester based films suitable for microwaveable food packaging applications. The matrices selected consist in two PET copolymers modified with carbon black (ULTRA STD) and with titanium oxide (ULTRA NA). Nanocomposite co-extruded multilayer films were produced using different percentages (0%, 2% and 4%wt/wt) of Cloisite 20A (C20A). Films were analyzed for evaluating the effect of nanofiller on the morphology and barrier properties. Moreover, to verify the effectiveness of the designed systems in reducing the cooking times of meat products, MW heating tests were carried out on pork meat hamburgers in MW oven at varying supplied powers. The cooking tests have pointed out that the selected matrices are efficient in reducing cooking times and that even low concentration of C20A acts as heating enhancers of PET

  3. PET based nanocomposite films for microwave packaging applications

    Energy Technology Data Exchange (ETDEWEB)

    Galdi, M. R., E-mail: mrgaldi@unisa.it; Olivieri, R.; Liguori, L.; Albanese, D., E-mail: dalbanese@unisa.it; Di Matteo, M.; Di Maio, L., E-mail: ldimaio@unisa.it [Industrial Engineering Department, University of Salerno, Via Giovanni Paolo II 132, 84084 Fisciano (Italy)

    2015-12-17

    In recent years, changes in life standards have promoted the diffusion of Ready to Cook (RTC) and Ready to Eat (RTE) products for microwave ovens. However, the main limits in microwave (MW) ovens usage are often related to the proper choice of packaging materials suitable for such technology. In fact, packages for microwaveable RTC and RTE foods should ensure adequate preservation of the product before cooking/heating such as high barriers to gases and aromas and adequate control of water vapor transmission. In addition, microwaveable packaging material must be transparent to MW, thermally stable and resistant to the mechanical stress induced by the accumulation in the head space of volatile substances produced during the cooking. Polymeric materials are good candidates for microwaveable packaging thanks to their transparency to MW. In the last years a great interest is devoted to developing innovative solution based on the use of additives or systems that act as susceptors or heating enhancers for improving the characteristics of polymers in cooking/heating in MW ovens. The present work was focused on the production and characterization of nanocomposite copolyester based films suitable for microwaveable food packaging applications. The matrices selected consist in two PET copolymers modified with carbon black (ULTRA STD) and with titanium oxide (ULTRA NA). Nanocomposite co-extruded multilayer films were produced using different percentages (0%, 2% and 4%wt/wt) of Cloisite 20A (C20A). Films were analyzed for evaluating the effect of nanofiller on the morphology and barrier properties. Moreover, to verify the effectiveness of the designed systems in reducing the cooking times of meat products, MW heating tests were carried out on pork meat hamburgers in MW oven at varying supplied powers. The cooking tests have pointed out that the selected matrices are efficient in reducing cooking times and that even low concentration of C20A acts as heating enhancers of PET.

  4. PET based nanocomposite films for microwave packaging applications

    Science.gov (United States)

    Galdi, M. R.; Olivieri, R.; Liguori, L.; Albanese, D.; Di Matteo, M.; Di Maio, L.

    2015-12-01

    In recent years, changes in life standards have promoted the diffusion of Ready to Cook (RTC) and Ready to Eat (RTE) products for microwave ovens. However, the main limits in microwave (MW) ovens usage are often related to the proper choice of packaging materials suitable for such technology. In fact, packages for microwaveable RTC and RTE foods should ensure adequate preservation of the product before cooking/heating such as high barriers to gases and aromas and adequate control of water vapor transmission. In addition, microwaveable packaging material must be transparent to MW, thermally stable and resistant to the mechanical stress induced by the accumulation in the head space of volatile substances produced during the cooking. Polymeric materials are good candidates for microwaveable packaging thanks to their transparency to MW. In the last years a great interest is devoted to developing innovative solution based on the use of additives or systems that act as susceptors or heating enhancers for improving the characteristics of polymers in cooking/heating in MW ovens. The present work was focused on the production and characterization of nanocomposite copolyester based films suitable for microwaveable food packaging applications. The matrices selected consist in two PET copolymers modified with carbon black (ULTRA STD) and with titanium oxide (ULTRA NA). Nanocomposite co-extruded multilayer films were produced using different percentages (0%, 2% and 4%wt/wt) of Cloisite 20A (C20A). Films were analyzed for evaluating the effect of nanofiller on the morphology and barrier properties. Moreover, to verify the effectiveness of the designed systems in reducing the cooking times of meat products, MW heating tests were carried out on pork meat hamburgers in MW oven at varying supplied powers. The cooking tests have pointed out that the selected matrices are efficient in reducing cooking times and that even low concentration of C20A acts as heating enhancers of PET.

  5. Metal Oxide Nanostructures in Food Applications: Quality Control and Packaging

    Directory of Open Access Journals (Sweden)

    Vardan Galstyan

    2018-04-01

    Full Text Available Metal oxide materials have been applied in different fields due to their excellent functional properties. Metal oxides nanostructuration, preparation with the various morphologies, and their coupling with other structures enhance the unique properties of the materials and open new perspectives for their application in the food industry. Chemical gas sensors that are based on semiconducting metal oxide materials can detect the presence of toxins and volatile organic compounds that are produced in food products due to their spoilage and hazardous processes that may take place during the food aging and transportation. Metal oxide nanomaterials can be used in food processing, packaging, and the preservation industry as well. Moreover, the metal oxide-based nanocomposite structures can provide many advantageous features to the final food packaging material, such as antimicrobial activity, enzyme immobilization, oxygen scavenging, mechanical strength, increasing the stability and the shelf life of food, and securing the food against humidity, temperature, and other physiological factors. In this paper, we review the most recent achievements on the synthesis of metal oxide-based nanostructures and their applications in food quality monitoring and active and intelligent packaging.

  6. The innovative application studty on eco-packaging design and materials

    Directory of Open Access Journals (Sweden)

    Cui Yong Min

    2016-01-01

    Full Text Available The paper solves the increasingly deteriorate environmental problems by positively exploring how to utilize and develop eco-packaging design reasonably. The paper explores an effective method that combines eco-packaging and environmental protection materials, hoping to define the sustainable development road of packaging design. The paper is centered on the design application of eco-packaging and environmental protection materials, applies and analyzes the method to obtain innovative design requirements and development tendency of eco-packaging design by analyzing status and significance of eco-packaging design, combining with the development and main types of eco-packaging packaging materials, and based on the achievements acquired by eco-packaging and environmental protection materials. Meanwhile, the paper also reveals mutual dependence and mutual promotion of eco-packaging design and eco-packaging materials.

  7. Miniature sensor suitable for electronic nose applications

    DEFF Research Database (Denmark)

    Pinnaduwage, L. A.; Gehl, A. C.; Allman, S. L.

    2007-01-01

    A major research effort has been devoted over the years for the development of chemical sensors for the detection of chemical and explosive vapors. However, the deployment of such chemical sensors will require the use of multiple sensors probably tens of sensors in a sensor package to achieve sel...... microcantilevers. The sensor can detect parts-per-trillion concentrations of DMMP within 10 s exposure times. The small size of the sensor makes it ideally suited for electronic nose applications. © 2007 American Institute of Physics....

  8. Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

    Science.gov (United States)

    Kolacz, John S.; Clapper, Randy S.; Wade, Raymond P.

    2006-01-01

    The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

  9. Introduction and NASA Electronic Parts and Packaging (NEPP) Program Overview

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2014-01-01

    This presentation includes an introduction to the space radiation environment, the effects on electronics, the environment in action, flight projects, mission needs, and radiation hardness assurance (RHA).

  10. Advanced Image Processing Package for FPGA-Based Re-Programmable Miniature Electronics

    National Research Council Canada - National Science Library

    Ovod, Vladimir I; Baxter, Christopher R; Massie, Mark A; McCarley, Paul L

    2005-01-01

    .... An advanced image-processing package has been designed at Nova Sensors to re-configure the FPGA-based co-processor board for numerous applications including motion detection, optical background...

  11. Decontamination of food packaging using electron beam—status and prospects

    Science.gov (United States)

    Mittendorfer, J.; Bierbaumer, H. P.; Gratzl, F.; Kellauer, E.

    2002-03-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

  12. Decontamination of food packaging using electron beam--status and prospects

    Energy Technology Data Exchange (ETDEWEB)

    Mittendorfer, J. E-mail: htcmitt@eunet.at; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E

    2002-03-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

  13. Decontamination of food packaging using electron beam--status and prospects

    International Nuclear Information System (INIS)

    Mittendorfer, J.; Bierbaumer, H.P.; Gratzl, F.; Kellauer, E.

    2002-01-01

    In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding

  14. Electron beams and applications

    International Nuclear Information System (INIS)

    Haouat, G.; Couillaud, C.

    1998-01-01

    Studies of the physical properties of the ELSA-linac electron beam are presented. They include measurements of the characteristic beam parameter and analyzes of the beam transport using simulation codes. The aim of these studies is to determine the best conditions for production of intense and very short electron bunches and to optimize the transport of space-charge dominated beams. Precise knowledge of the transport dynamics allows to produce beams with the required characteristics for light production in Free-Electron Laser (FEL), and to give a good description of energy-transfer phenomena between electrons and photons in the wriggler. The particular features of ELSA authorize studies of high-intensity, high-brightness beam properties, especially the halo surrounding the dense core of the electron bunches, which is formed by the space charge effects. It is also shown that the ELSA facility is well suited for the fabrication of very short γ and X-rays sources for applied research in nuclear and plasma physics, or for time response studies of fast detectors. (author)

  15. Gelatin-Based Films and Coatings for Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Marina Ramos

    2016-09-01

    Full Text Available This review discusses the latest advances in the composition of gelatin-based edible films and coatings, including nanoparticle addition, and their properties are reviewed along their potential for application in the food packaging industry. Gelatin is an important biopolymer derived from collagen and is extensively used by various industries because of its technological and functional properties. Nowadays, a very wide range of components are available to be included as additives to improve its properties, as well as its applications and future potential. Antimicrobials, antioxidants and other agents are detailed due to the fact that an increasing awareness among consumers regarding healthy lifestyle has promoted research into novel techniques and additives to prolong the shelf life of food products. Thanks to its ability to improve global food quality, gelatin has been particularly considered in food preservation of meat and fish products, among others.

  16. Physical packaging and organization of the drift chamber electronics system for the Stanford Large Detector

    International Nuclear Information System (INIS)

    Haller, G.M.; Freytag, M.L.; Mazaheri, G.; Olsen, J.; Paffrath, L.

    1990-10-01

    In this paper the logical organization, physical packaging, and operation of the drift chamber electronics for the SLD at SLAC is described. The system processes signals from approximately 7000 drift wires and is unusual in that most electronic functions are packaged on printed circuit boards within the detector. The circuits reside on signal-processing motherboards, controller boards, signal-transition boards, power-distribution boards, and fiber-optics-to-electrical conversion boards. The interaction and interconnection of these boards with respect to signal and control flow are presented. 11 refs., 7 figs

  17. Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

    Energy Technology Data Exchange (ETDEWEB)

    Kuper, Cameron Mathias [Univ. of New Mexico, Albuquerque, NM (United States)

    2015-12-10

    The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

  18. Development in Electronic Packaging – Moving to 3D System Configuration

    Directory of Open Access Journals (Sweden)

    I. Szendiuch

    2011-04-01

    Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

  19. Electronic applications presentation

    Science.gov (United States)

    Grants.gov requirement effective February 17, 2015. All initial applications submitted for competitiveawards based on solicitations issued on or after February 17, 2015 must be submitted to EPAelectronically through Grants.gov.

  20. High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

    Energy Technology Data Exchange (ETDEWEB)

    Zhou, Yongcun; Liu, Feng, E-mail: liufeng@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi' an Shaanxi 710072 (China)

    2016-08-22

    The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PI composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.

  1. The NASA Electronic Parts and Packaging (NEPP) Program: An Overview

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    This presentation provides an overview of the NEPP Program. The NEPP Mission is to provide guidance to NASA for the selection and application of microelectronics technologies; Improve understanding of the risks related to the use of these technologies in the space environment; Ensure that appropriate research is performed to meet NASA mission assurance needs. NEPP's Goals are to provide customers with appropriate and cost-effective risk knowledge to aid in: Selection and application of microelectronics technologies; Improved understanding of risks related to the use of these technologies in the space environment; Appropriate evaluations to meet NASA mission assurance needs; Guidelines for test and application of parts technologies in space; Assurance infrastructure and support for technologies in use by NASA space systems.

  2. The innovative application studty on eco-packaging design and materials

    OpenAIRE

    Cui Yong Min; Ren Xin Guang

    2016-01-01

    The paper solves the increasingly deteriorate environmental problems by positively exploring how to utilize and develop eco-packaging design reasonably. The paper explores an effective method that combines eco-packaging and environmental protection materials, hoping to define the sustainable development road of packaging design. The paper is centered on the design application of eco-packaging and environmental protection materials, applies and analyzes the method to obtain innovative design r...

  3. 7 CFR Exhibit D to Subpart B of... - Designated Counties for Housing Application Packaging Grants

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 13 2010-01-01 2009-01-01 true Designated Counties for Housing Application Packaging... Application Packaging Grants Pt. 1944, Subpt. B, Exh. D Exhibit D to Subpart B of Part 1944—Designated Counties for Housing Application Packaging Grants ER25my05.036 ER25my05.037 ER25my05.038 ER25my05.039 [70...

  4. Nanocellulose fibers applied in PLA composites for food packaging applications

    DEFF Research Database (Denmark)

    Trifol Guzman, Jon; Garciad, A.; Mericer, C.

    Poly (lactic acid) (PLA) has long been advocated as one of the best candidates for bio-based food packaging, but low thermal stability, slow crystallization, high oxygen and water permeability are drawbacks that still limits the use of PLA in a broader range of applications.The goal...... of this research project has been to improve the permeability of PLA by use of nanocellulose or by combination of nanocellulose and nanoclay in PLA composites. The cellulose nanofibers (CNF) were extracted from sisal fibers using an optimized up-scalable three-step chemical protocol. Composites with both CNF...... properties of PLA. In particular 1 wt% of CNF and NC resulted in a 63% of reduction on the oxygen transmission rate and a 57% on the water vapor transmission rate, while a 5 wt% PLA/CNF/NC resulted in a 89% and a 75% of decrease respectively....

  5. Inkjet printing of UHF antennas on corrugated cardboards for packaging applications

    Energy Technology Data Exchange (ETDEWEB)

    Sowade, Enrico, E-mail: enrico.sowade@mb.tu-chemnitz.de [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Göthel, Frank [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Zichner, Ralf [Department Printed Functionalities, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz (Germany); Baumann, Reinhard R. [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz (Germany); Department Printed Functionalities, Fraunhofer Institute for Electronic Nano Systems (ENAS), Chemnitz (Germany)

    2015-03-30

    Highlights: • Inkjet printing of UHF antennas on cardboard substrates. • Development of primer layer to compensate the absorptiveness of the cardboard and the rough surface. • Manufacturing of UHF antennas in a fully digital manner for packaging applications. - Abstract: In this study, a method based on inkjet printing has been established to develop UHF antennas on a corrugated cardboard for packaging applications. The use of such a standardized, paper-based packaging substrate as material for printing electronics is challenging in terms of its high surface roughness and high ink absorption rate, especially when depositing very thin films with inkjet printing technology. However, we could obtain well-defined silver layers on the cardboard substrates due to a primer layer approach. The primer layer is based on a UV-curable ink formulation and deposited as well as the silver ink with inkjet printing technology. Industrial relevant printheads were chosen for the deposition of the materials. The usage of inkjet printing allows highest flexibility in terms of pattern design. The primer layer was proven to optimize the surface characteristics of the substrate, mainly reducing the surface roughness and water absorptiveness. Thanks to the primer layer approach, ultra-high-frequency (UHF) radio-frequency identification (RFID) antennas were deposited by inkjet printing on the corrugated cardboards. Along with the characterization and interpretation of electrical properties of the established conductive antenna patterns, the performance of the printed antennas were analyzed in detail by measuring the scattering parameter S{sub 11} and the antenna gain.

  6. Sustainable packaging design for consumer electronics products : Balancing marketing, logistics and environmental requirements

    NARCIS (Netherlands)

    Wever, R.; Boks, C.B.; Pratama, I.; Stevels, A.L.N.

    2007-01-01

    Packaging design for consumer electronic products is a challenge because contradictory demands from a distribution perspective and a marketing perspective have to be balanced. With several company departments involved and powerful external stakeholders this is a complicated matter. As the level of

  7. The commoditization of consumer electronics products and its influence on packaging design

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    The traditional purpose of packaging for consumer electronics (CE) products was to get them in one piece from the factory to the consumers home. It was purely focused on the physical distribution. In that time, buying a CE product could be considered a major family investment. However, times have

  8. The NASA Electronic Parts and Packaging (NEPP) Program - Presentation to Korean Aerospace Research Institute

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.

  9. Demonstration of a Prototype Hydrogen Sensor and Electronics Package - Progress Report 2

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Amanda S. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Brosha, Eric [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-06-14

    This is the second progress report on the demonstration of a prototype hydrogen sensor and electronics package. It goes into detail about the five tasks, four of which are already completed as of August 2016, with the final to be completed by January 26, 2017. Then the budget is detailed along with the planned work for May 27, 2016 to July 27, 2016.

  10. Metastable Polymers for On Demand Transient Electronic Packaging

    Science.gov (United States)

    2018-01-17

    a triggerable polymer for engineering applications. 25 Approved for public release; distribution is unlimited. 6 REFERENCES (1) Aso, C.; Tagami, S...Macromolecules 1969, 2, 414. (2) Aso, C.; Tagami, S.; Kunitake, T. Journal of Polymer Science Part A-1: Polymer Chemistry 1969, 7, 497. (3) Hernandez...R. Advanced Materials 2014, 26, 7637. (4) Ito, H.; Willson, C. G. Polymer Engineering & Science 1983, 23, 1012. (5) Ito, H.; England, W. P.; Ueda, M

  11. Industrial applications of electron accelerators

    CERN Document Server

    Cleland, M R

    2006-01-01

    This paper addresses the industrial applications of electron accelerators for modifying the physical, chemical or biological properties of materials and commercial products by treatment with ionizing radiation. Many beneficial effects can be obtained with these methods, which are known as radiation processing. The earliest practical applications occurred during the 1950s, and the business of radiation processing has been expanding since that time. The most prevalent applications are the modification of many different plastic and rubber products and the sterilization of single-use medical devices. Emerging applications are the pasteurization and preservation of foods and the treatment of toxic industrial wastes. Industrial accelerators can now provide electron energies greater than 10 MeV and average beam powers as high as 700 kW. The availability of high-energy, high-power electron beams is stimulating interest in the use of X-rays (bremsstrahlung) as an alternative to gamma rays from radioactive nuclides.

  12. Application of electron accelerator worldwide

    International Nuclear Information System (INIS)

    Machi, Sueo

    2003-01-01

    Electron accelerator is an important radiation source for radiation technology, which covers broad fields such as industry, health care, food and environmental protection. There are about 1,000 electron accelerators for radiation processing worldwide. Electron accelerator has advantage over Co-60 irradiator in term of high dose rate and power, assurance of safety, and higher economic performance at larger volume of irradiation. Accelerator generating higher energy in the range of 10 MeV and high power electron beam is now commercially available. There is a trend to use high-energy electron accelerator replacing Co-60 in case of large through-put of medical products. Irradiated foods, in particular species, are on the commercial market in 35 countries. Electron accelerator is used efficiently and economically for production of new or modified polymeric materials through radiation-induced cross-linking, grafting and polymerization reaction. Another important application of electron beam is the curing of surface coatings in the manufacture of products. Electron accelerators of large capacity are used for cleaning exhaust gases in industrial scale. Economic feasibility studies of this electron beam process have shown that this technology is more cost effective than the conventional process. It should be noted that the conventional limestone process produce gypsum as a by-product, which cannot be used in some countries. By contrast, the by-product of the electron beam process is a valuable fertilizer. (Y. Tanaka)

  13. Application of electron accelerator worldwide

    Energy Technology Data Exchange (ETDEWEB)

    Machi, Sueo [Japan Atomic Industrial Forum, Inc., Tokyo (Japan)

    2003-02-01

    Electron accelerator is an important radiation source for radiation technology, which covers broad fields such as industry, health care, food and environmental protection. There are about 1,000 electron accelerators for radiation processing worldwide. Electron accelerator has advantage over Co-60 irradiator in term of high dose rate and power, assurance of safety, and higher economic performance at larger volume of irradiation. Accelerator generating higher energy in the range of 10 MeV and high power electron beam is now commercially available. There is a trend to use high-energy electron accelerator replacing Co-60 in case of large through-put of medical products. Irradiated foods, in particular species, are on the commercial market in 35 countries. Electron accelerator is used efficiently and economically for production of new or modified polymeric materials through radiation-induced cross-linking, grafting and polymerization reaction. Another important application of electron beam is the curing of surface coatings in the manufacture of products. Electron accelerators of large capacity are used for cleaning exhaust gases in industrial scale. Economic feasibility studies of this electron beam process have shown that this technology is more cost effective than the conventional process. It should be noted that the conventional limestone process produce gypsum as a by-product, which cannot be used in some countries. By contrast, the by-product of the electron beam process is a valuable fertilizer. (Y. Tanaka)

  14. Industrial applications of electron accelerators

    International Nuclear Information System (INIS)

    Singh, A.

    1994-01-01

    The interaction of high-energy radiation with organic systems produces very reactive, short-lived, ionic and free-radical species. The chemical changes brought about by these species are very useful in several systems, and are the basis of the growth of the electron processing industry. Some typical areas of the industrial use of electron accelerators are crosslinking wire and cable insulation, manufacturing heat shrink plastic items, curing coatings, and partially curing rubber products. Electron accelerators are also being considered in other areas such as sewage treatment, sterilizing medical disposables, and food irradiation. An emerging application of industrial electron accelerators is the production of advanced composites for the aerospace and other industries. Traditionally, the carbon-, aramid- and glass-fibre-reinforced composites with epoxy matrices are produced by thermal curing. However, equivalent composites with acrylated-epoxy matrices can be made by electron curing. Cost estimates suggest that electron curing could be more economical than thermal curing. Food irradiation has traditionally been an application for 60 Co γ-radiation. With the increasing demand for food irradiation in various countries, it may become necessary to use electron accelerators for this purpose. Since the dose rate during gamma and electron irradiation are generally very different, a review of the relevant work on the effect of dose rates has been done. This paper presents an overview of the industrial applications of electron accelerator for radiation processing, emphasises the electron curing of advanced composites and, briefly reviews the dose-rate effects in radiation processing of advanced composites and food irradiation. (author). 84 refs., 8 tabs

  15. Industrial applications of electron beam

    International Nuclear Information System (INIS)

    Chmielewski, A.G.

    1997-01-01

    The review of industrial applications with use of electron beams has been done. Especially the radiation technologies being developed in Poland have been shown. Industrial installations with electron accelerators as radiation source have been applied for: modification of polymers; modification of thyristors; sterilization of health care materials; radiopreservation of food and other consumer products; purification of combustion flue gases in heat and power plants. 14 refs, 6 tabs, 7 figs

  16. TREK1-a program package of modeling of the ion implantation of materials used in electronic techniques

    International Nuclear Information System (INIS)

    Leont'ev, A.V.; Nechaev, S.V.

    1999-01-01

    A package of computer programs is described which treats the slowing down of ions in solids by the means of Monte-Carlo method in the binary collision approximation for an amorphous substance using a screened Coulomb potential for nuclear collisions and the Brandt-Kitagawa theory for the electronic energy loss. For each nuclear collision, the impact parameter and the azimuthal deflection angle are determined from random numbers. The package contains a program of calculation of ion implantation whose features are described above, a database 'MME' (Materials of Micro Electronics) which stores all necessary data for the calculation, and a database control application providing an easy access to the data in MME. The programs of the package are made to run under Windows 95/98 and Windows NT operating systems. They were created using the following means: Borland Delphi 3.0, Paradox 7.0, Borland Database Engine 4.5. The running time of the calculation process depends on the problem chosen and is mainly influenced by the number of pseudo ions, their energy and atomic properties of the target. For the test example of 100 keV boron atoms incident PMMA, a calculation with 1*10 4 pseudo ions on a computer with the Pentium-166 processor requires about 2 min compared to 7 min by well known Trim95

  17. Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Krozer, Viktor; Bach, H.-G.

    2009-01-01

    In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode...... conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates...

  18. Radiation cross-linked plastics: a versatile material solution for packaging, automotive, Electrotechnic and Electronics

    International Nuclear Information System (INIS)

    Rouif, Sophie

    2004-01-01

    Used since the beginning of the 1970s for the production of halogen-free and heat-resistant cables and wires, for conditioning polyethylene hot-water pipes or for the manufacture of heat shrinkable tubes and of tyres, radiation cross-linking is developing fastly today on the scale of plastic-moulded parts, and not only by the mean of EB, but also under gamma rays. Indeed, it improves considerably the performances of a great number of plastics among thermoplastics, elastomers and thermoplastic elastomers (TPE). Radiation cross-linking reinforces the dimensional stability of polymers in chemically aggressive and high-temperature conditions. Radiation cross-linked-based engineering plastics offers OEM and end users in many branches of industry both technical and economical advantages in comparison with high-performances plastics. They constitute a technical and economical compromise between engineering plastics that failed and high-performances plastic, often over-tailored and expensive. This modern industrial technology gives way to new applications and perspectives in various sectors (packaging, automotive, electrotechnic and electronics, including connectors, surface-mounted devices, integrated circuits, 3D-MID, etc.) that are described in the paper

  19. 75 FR 25319 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages; Correction

    Science.gov (United States)

    2010-05-07

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program... the Elderly (TCE) Program Availability of Application Packages, which was published in the Federal... application packages for the 2011 Tax Counseling for the Elderly (TCE) Program. FOR FURTHER INFORMATION...

  20. Strategic Business-IT alignment of application software packages: Bridging the Information Technology gap

    Directory of Open Access Journals (Sweden)

    Wandi Kruger

    2012-09-01

    Full Text Available An application software package implementation is a complex endeavour, and as such it requires the proper understanding, evaluation and redefining of the current business processes to ensure that the implementation delivers on the objectives set at the start of the project. Numerous factors exist that may contribute to the unsuccessful implementation of application software packages. However, the most significant contributor to the failure of an application software package implementation lies in the misalignment of the organisation’s business processes with the functionality of the application software package. Misalignment is attributed to a gap that exists between the business processes of an organisation and what functionality the application software package has to offer to translate the business processes of an organisation into digital form when implementing and configuring an application software package. This gap is commonly referred to as the information technology (IT gap. This study proposes to define and discuss the IT gap. Furthermore this study will make recommendations for aligning the business processes with the functionality of the application software package (addressing the IT gap. The end result of adopting these recommendations will be more successful application software package implementations.

  1. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    Science.gov (United States)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  2. penORNL: a parallel Monte Carlo photon and electron transport package using PENELOPE

    International Nuclear Information System (INIS)

    Bekar, Kursat B.; Miller, Thomas Martin; Patton, Bruce W.; Weber, Charles F.

    2015-01-01

    The parallel Monte Carlo photon and electron transport code package penORNL was developed at Oak Ridge National Laboratory to enable advanced scanning electron microscope (SEM) simulations on high-performance computing systems. This paper discusses the implementations, capabilities and parallel performance of the new code package. penORNL uses PENELOPE for its physics calculations and provides all available PENELOPE features to the users, as well as some new features including source definitions specifically developed for SEM simulations, a pulse-height tally capability for detailed simulations of gamma and x-ray detectors, and a modified interaction forcing mechanism to enable accurate energy deposition calculations. The parallel performance of penORNL was extensively tested with several model problems, and very good linear parallel scaling was observed with up to 512 processors. penORNL, along with its new features, will be available for SEM simulations upon completion of the new pulse-height tally implementation.

  3. Smart Packaging Technologies and Their Application in Conventional Meat Packaging Systems

    Science.gov (United States)

    O'Grady, Michael N.; Kerry, Joseph P.

    Preservative packaging of meat and meat products should maintain acceptable appearance, odour and flavour and should delay the onset of microbial spoilage. Typically fresh red meats are placed on trays and over-wrapped with an oxygen permeable film or alternatively, meats are stored in modified atmosphere packages (MAP) containing high levels of oxygen and carbon dioxide (80% O2:20% CO2) (Georgala & Davidson, 1970). Cooked meats are usually stored in 70% N2:30% CO2 (Smiddy, Papkovsky, & Kerry, 2002). The function of oxygen in MAP is to maintain acceptable fresh meat colour and carbon dioxide inhibits the growth of spoilage bacteria (Seideman & Durland, 1984). Nitrogen is used as an inert filler gas either to reduce the proportions of the other gases or to maintain the pack shape (Bell & Bourke, 1996).

  4. Halloysite Nanocapsules Containing Thyme Essential Oil: Preparation, Characterization, and Application in Packaging Materials.

    Science.gov (United States)

    Jang, Si-Hoon; Jang, So-Ri; Lee, Gyeong-Min; Ryu, Jee-Hoon; Park, Su-Il; Park, No-Hyung

    2017-09-01

    Halloysite nanotubes (HNTs), which are natural nanomaterials, have a hollow tubular structure with about 15 nm inner and 50 nm outer diameters. Because of their tubular shape, HNTs loaded with various materials have been investigated as functional nanocapsules. In this study, thyme essential oil (TO) was encapsulated successfully in HNTs using vacuum pulling methods, followed by end-capping or a layer-by-layer surface coating process for complete encapsulation. Nanocapsules loaded with TO were mixed with flexographic ink and coated on a paper for applications as food packaging materials. Scanning electron microscopy and transmission electron microscopy were used to characterize the morphology of the nanocapsules and to confirm the TO loading of the nanocapsules. Fourier transform infrared spectroscopy and thermogravimetric analyses analysis were used to complement the structural information. In addition, the controlled release of TO from the nanocapsules showed sustained release properties over a period of many days. The results reveal that the release properties of TO in these nanocapsules could be controlled by surface modifications such as end-capping and/or surface coating of bare nanocapsules. The packaging paper with TO-loaded HNT capsules was effective in eliminating against Escherichia coli during the first 5 d and showed strong antibacterial activity for about 10 d. © 2017 Institute of Food Technologists®.

  5. Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

    International Nuclear Information System (INIS)

    Hoshi, T; Fujiwara, T

    2009-01-01

    An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

  6. 78 FR 33154 - Low Income Taxpayer Clinic Grant Program; Availability of 2014 Grant Application Package

    Science.gov (United States)

    2013-06-03

    ... Package and Guidelines (Publication 3319) for organizations interested in applying for a Low Income... nominal fee to low income taxpayers involved in tax disputes with the IRS, or educate individuals for whom... Grant Application Package and Guidelines, IRS Publication 3319 (Rev. 5-2013), can be downloaded from the...

  7. Application of polymer nanocomposite materials in food packaging

    Directory of Open Access Journals (Sweden)

    Amra Odobašić

    2015-01-01

    Full Text Available The term “nano” refers to nano particle size from 1 to 100 nanometers. The term "nanotechnology" was first introduced by Norio Taniguchi in 1974. Nanotechnology may be used to improve the taste and texture of food and for the production of packaging that maintain fresh product. The primary function of packaging is to maintain the quality and safety of products during transport and storage period, as well as to extend its viability by preventing unwanted effect agents such as microorganisms, chemical contaminants, oxygen, moisture and light. The aim of this paper is to point out the achievements of nanotechnology in terms of food packaging with an overview of polymers that are commonly used in food packaging, as well as strategies to improve the physical properties of polymers, including mechanical strength, thermal stability and barrier to gases. By studing of recently published literature, it was clear that nanomaterials such as nano polymers are trying to replace conventional materials in food packaging. Nanosensors can be used to prove the presence of contaminants, microtoxins and microorganisms in food.

  8. System-in-package RF design and applications

    CERN Document Server

    Gaynor, Michael P

    2006-01-01

    In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.

  9. Biodegradable PLA composites with different fillers for food packaging application

    OpenAIRE

    Marra, Antonella

    2015-01-01

    The food packaging initially born as a "container" of food for the sale of quantities defined in adequate conditions of hygiene, then had to perform the function of "protection" of the food in respect of environment. Today, in fact, the most important function of the packaging, when it comes to preservation technology, is to prevent deterioration of the food, to extend the duration of use of a food and to maintain and /or to increase its quality and integrity. So the main purpose of food pa...

  10. Cashew gum and gelatin blend for food packaging application

    Science.gov (United States)

    Cashew gum (CG) and gelatin (G) films were developed using the casting method and response surface methodology. The objective was produce packaging films from CG/G blends that exhibit effective barrier properties. A study of zeta potential versus pH was first carried out to determine the isoelectric...

  11. Preparation of conductive paper composites based on natural cellulosic fibers for packaging applications.

    Science.gov (United States)

    Youssef, Ahmed M; El-Samahy, Magda Ali; Abdel Rehim, Mona H

    2012-08-01

    Conducting paper based on natural cellulosic fibers and conductive polymers was prepared using unbleached bagasse and/or rice straw fibers (as cellulosic raw materials) and polyaniline (PANi) as conducting polymer. These composites were synthesized by in situ emulsion polymerization using ammonium persulfate (APS) as oxidant in the presence of dodecylbenzene sulfonic acid (DBSA) as emulsifier. The prepared composites were characterized using Fourier transform infrared (FTIR), thermal gravimetric analysis (TGA), differential scanning calorimeter (DSC), and their morphology was investigated using scanning electron microscope (SEM). Electrical conductivity measurements showed that the conductivity of the paper sheets increases by increasing the ratio of PANi in the composite. Mechanical properties of the paper sheets were also investigated, the results revealed that the values of breaking length, burst factor, and tear factor are decreased with increasing ratio of added PANi, and this effect is more pronounced in bagasse-based composites. The new conductive composites can have potential use as anti-static packaging material or anti-bacterial paper for packaging applications. Copyright © 2012 Elsevier Ltd. All rights reserved.

  12. Dosimetry for electron beam application

    International Nuclear Information System (INIS)

    Miller, A.

    1983-12-01

    This report describes two aspects of electron beam dosimetry, on one hand development of film dosimeters and measurements of their properties, and on the other hand development of calorimeters for calibration of routine dosimeters, e.g. thin films. Two types of radiochromic thin film dosimeters have been developed in this department, and the properties of these and commercially available dosimeters have been measured and found to be comparable. Calorimeters which are in use for routine measurements, are being investigated with reference to their application as standardizing instruments, and new calorimeters are being developed. (author)

  13. Sterilized PP/HMSPP cushion foams for medical and food packaging applications

    International Nuclear Information System (INIS)

    Cardoso, Elisabeth C.L.; Lima, L. Filipe C.P.; Parra, Duclerc F.; Lugao, Ademar B.; Bueno, N.R.; Gasparin, Eleosmar

    2009-01-01

    Treatment with gamma radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in aseptic processing of foods and pharmaceuticals. Packaging materials may be irradiated either prior or after filling; the irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceuticals and medical devices. Cushion foams are used to help protect fragile items during moving transport. Shock, vibration and damage are avoided by the cushioning effect and chances of product damage are reduced. It is easy to use and perforated for easy tearing. Cushion foams are employed to wrap glasses, plates, crockery, lamps, electronics and other breakable items. This paper presents special cushion foams to be used for medical and food packaging applications; so, these foams will be gamma irradiated before getting in contact with these special articles. Foams were previously produced from a 50% blending Polypropylene homopolymer / High Melt Strength Polypropylene (HMSPP) thereof, that presented following results for properties assessed: melt flow index, 230 deg C - 3.67 g/10 minutes; crystallinity = 47%; melt strength, at 200 deg C = 7.3 cN. This admixture was further fed into the barrel of a single-screw extruder, Rheomex 332 p, equipped with 3:1,33 d screw and 19/33 special screw for foaming, with standard controller and monitored panel, temperature controller (2 channels), melt temperature (2 channels) and melt pressure (4 channels). By using a 175/200/210/220/165/25 (deg C) profile temperature, and after attaining a homogeneous melting, a given amount of physical blowing agent (nitrogen) was injected and mixed with the polymer melt stream to produce the foam. Foamed extrudate was subjected to sterilization radiation doses: 25, 50, 75 and 100 kGy and further evaluated as per: appearance (whiteness / yellowness) and temperature dependent oxidative-induction time (TOIT) tests, by comparing

  14. Fatigue failure of pb-free electronic packages under random vibration loads

    Science.gov (United States)

    Saravanan, S.; Prabhu, S.; Muthukumar, R.; Gowtham Raj, S.; Arun Veerabagu, S.

    2018-03-01

    The electronic equipment are used in several fields like, automotive, aerospace, consumer goods where they are subjected to vibration loads leading to failure of solder joints used in these equipment. This paper presents a methodology to predict the fatigue life of Pb-free surface mounted BGA packages subjected to random vibrations. The dynamic characteristics of the PCB, such as the natural frequencies, mode shapes and damping ratios were determined. Spectrum analysis was used to determine the stress response of the critical solder joint and the cumulative fatigue damage accumulated by the solder joint for a specific duration was determined.

  15. The NASA Electronic Parts and Packaging (NEPP) Program: NEPP Overview - Automotive Electronics

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    The results of NASAs studies into the appropriateness of using U.S. Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Council's AECQ standardization program, the second part provides a summary of the results of NASA's procurement and testing experiences and other lessons learned along with preliminary test results.

  16. Gain Enhanced LTCC System-on-Package for UMRR Applications

    KAUST Repository

    Shamim, Atif

    2014-10-14

    An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

  17. Gain Enhanced LTCC System-on-Package for UMRR Applications

    KAUST Repository

    Shamim, Atif; Ghaffar, Farhan Abdul; Khalid, Muhammad Umair; Salama, Khaled N.

    2014-01-01

    An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

  18. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    Science.gov (United States)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  19. CEPXS/ONELD: A one-dimensional coupled electron-photon discrete ordinates code package

    International Nuclear Information System (INIS)

    Lorence, L.J. Jr.; Morel, J.E.

    1992-01-01

    CEPXS/ONELD is a discrete ordinates transport code package that can model the electron-photon cascade from 100 MeV to 1 keV. The CEPXS code generates fully-coupled multigroup-Legendre cross section data. This data is used by the general-purpose discrete ordinates code, ONELD, which is derived from the Los Alamos ONEDANT and ONBTRAN codes. Version 1.0 of CEPXS/ONELD was released in 1989 and has been primarily used to analyze the effect of radiation environments on electronics. Version 2.0 is under development and will include user-friendly features such as the automatic selection of group structure, spatial mesh structure, and S N order

  20. Broadband Packaging of Photodetectors for 100 Gb/s Ethernet Applications

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Krozer, Viktor; Bach, Heinz-Gunter

    2013-01-01

    The packing structure of functional modules is a major limitaion in achieving a desired performance for 100 Gb/s ethernet applications. This paper presents a methodology of developing advanced packaging of photodetectors (PDs) for high-speed data transmission applications by using 3-D electromagn......The packing structure of functional modules is a major limitaion in achieving a desired performance for 100 Gb/s ethernet applications. This paper presents a methodology of developing advanced packaging of photodetectors (PDs) for high-speed data transmission applications by using 3-D...... electromagnetic (EM) simulations. A simplified model of the PD module is first used to analyze and optimize packaging structures and propose an optimal packaging design based on the simplified model. Although a PD module with improved performance proved the success of the optimal packaging design, the simplified...... of limiting the bandwidth of PD modules. After eliminating the mode mismatch effect by improving the chip-conductor-backed coplanar waveguide transition, a final optimal packaging structure is implemented for the PD module with reduced attenuation up to 100 GHz and a broader 3-dB bandwidth of more than 90 GHz...

  1. DEVELOPING APPLICATIONS FOR ELECTRONIC BUSINESS

    Directory of Open Access Journals (Sweden)

    Georgeta Șoavă

    2012-12-01

    Full Text Available We are in the early 3rd millennium as companies face the need to exploit technology changing computer environments, in order to improve customer satisfaction and reduce costs. Thus, the development of e-business, the efficient use of new information technologies in business, by developing an alternative sales channel with relatively low costs, it manages to establish relationships with incomparably greater number of customers, to traditional approaches. Starting from these general considerations, we conducted this work we divided it into four parts. In the first part we present general context in which companies can achieve needs using new technologies, then we reviewed the basic elements in developing e-business type applications presenting their main benefits. Next, I approached refining models for e-business software development and use of distributed architectures for electronic commerce, concluding with a set of conclusions.

  2. Effect of Morphology and Size of Halloysite Nanotubes on Functional Pectin Bionanocomposites for Food Packaging Applications.

    Science.gov (United States)

    Makaremi, Maziyar; Pasbakhsh, Pooria; Cavallaro, Giuseppe; Lazzara, Giuseppe; Aw, Yoong Kit; Lee, Sui Mae; Milioto, Stefana

    2017-05-24

    Pectin bionanocomposite films filled with various concentrations of two different types of halloysite nanotubes were prepared and characterized in this study as potential films for food packaging applications. The two types of halloysite nanotubes were long and thin (patch) (200-30 000 nm length) and short and stubby (Matauri Bay) (50-3000 nm length) with different morphological, physical, and dispersibility properties. Both matrix (pectin) and reinforcer (halloysite nanotubes) used in this study are considered as biocompatible, natural, and low-cost materials. Various characterization tests including Fourier transform infrared spectroscopy, field emission scanning electron microscopy, release kinetics, contact angle, and dynamic mechanical analysis were performed to evaluate the performance of the pectin films. Exceptional thermal, tensile, and contact angle properties have been achieved for films reinforced by patch halloysite nanotubes due to the patchy and lengthy nature of these tubes, which form a bird nest structure in the pectin matrix. Matauri Bay halloysite nanotubes were dispersed uniformly and individually in the matrix in low and even high halloysite nanotube concentrations. Furthermore, salicylic acid as a biocidal agent was encapsulated in the halloysite nanotubes lumen to control its release kinetics. On this basis, halloysite nanotubes/salicylic acid hybrids were dispersed into the pectin matrix to develop functional biofilms with antimicrobial properties that can be extended over time. Results revealed that shorter nanotubes (Matauri Bay) had better ability for the encapsulation of salicylic acid into their lumen, while patchy structure and longer tubes of patch halloysite nanotubes made the encapsulation process more difficult, as they might need more time and energy to be fully loaded by salicylic acid. Moreover, antimicrobial activity of the films against four different strains of Gram-positive and Gram-negative bacteria indicated the

  3. The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2015-01-01

    This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

  4. Active and Intelligent Materials for Food Packaging Applications

    OpenAIRE

    Buškuvienė, Nijolė; Jankauskaitė, Virginija

    2017-01-01

    World Health Organization (WHO) reveals the growing problem of food-borne illness around the world. Hundreds of millions of people worldwide are getting sick from contaminated food, because 1/3 - 1/2 of food products are not consumed (EC Directives 80/590/EEC and 89/109/EEC). Therefore, the preservation of food freshness and shelf life extension is important task for researchers around the world. In the last decade, much attention is paid to active and intelligent packaging investigation, dev...

  5. Application of common packaging materials in the probiotic fresh cheese production

    Directory of Open Access Journals (Sweden)

    Mirela Iličić

    2016-03-01

    Full Text Available The aim of this work was to investigate the application of common packaging materials polypropylene (PP and polystyrene (PS in the probiotic fresh cheese production packaging. Probiotic and traditional cheeses were produced from milk with standardized milk fat content of 2.3 g/100 g including the application of two cultures (probiotic and traditional. The samples were packed in the PP and PS cups and stored at 4 ºC for 30 days. The observed permeability of gases through the two applied packaging materials was significantly different. Cheese samples were analysed for microbiological properties whereby lactic acid bacteria, Bifidobacterium sp. and aerobic mesophilic bacteria (AMB were determined. Packaging materials showed no significant effect on the content of ascorbic acid which is known to be sensitive to the presence of oxygen.

  6. Hybrid nanocellulose/nanoclay composites for food packaging applications

    DEFF Research Database (Denmark)

    Trifol Guzman, Jon

    ™ 30B) were prepared and evaluated for use in food packaging. It was determined that composites with CNF or CNC and clay led to a great reduction in the oxygen transmission rate (OTR)and the water vapour transmission rate (WVTR) (up to a 90% reduction in the OTR and 76% in theWVTR for PLA/CNF 5%/C30B 5...... to larger spherulite sizes, which had a more significant impacton water diffusion and transparency reduction but also showed an increased water sorption. Finally, it was found that cellulose nanofibers reduced water diffusion to an extent similar to C30B (21% vs.27%), while hybrid composites showed 49......% decrease, albeit CNF based composites showed increased water sorption (7% for PLA/CNF 1% composite and 9% for PLA/CNF 1%/C30B 1% when compared with neat PLA).The reduced diffusivity of the hybrid nanocomposites suggested that the material was promising for active packaging, since low diffusivity leads...

  7. Electrically and Thermally Conducting Nanocomposites for Electronic Applications

    Directory of Open Access Journals (Sweden)

    Daryl Santos

    2010-02-01

    Full Text Available Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i dispersion of carbon nanotubes in the polymer host, (ii carbon nanotube-polymer interaction and the nature of the interface, and (iii alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.

  8. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  9. A novel polymer nanotube composite for photovoltaic packaging applications

    International Nuclear Information System (INIS)

    Ravichandran, J; Manna, I; Manoj, A G; Liu, J; Carroll, D L

    2008-01-01

    Packaging of organic photovoltaic (OPV) devices is an important issue which has been rarely addressed in the past. With the recent reports of high efficiency organic photovoltaics (6%), the need to produce materials which can effectively protect the device from degradation due to exposure to oxygen, moisture and radiation is pressing. We report a novel Saran (a co-polymer of vinylidene chloride and acrylonitrile) based polymer nanotube composite, which shows high transparency in the visible region, good barrier properties and thermal stability, for use as an encapsulant for OPV devices. Different loadings of Saran and boron nitride nanotubes were taken and the composites were prepared to optimize the composition of the composite. UV-visible spectroscopy, infra-red spectroscopy and thermal analysis were used to characterize the composite. The barrier properties of the composite were tested on poly(3-hexylthiophene), which is used in high efficiency OPV devices

  10. Micro packaging of hermetic seal mini dual in line laser diode module for aerospace applications

    Science.gov (United States)

    Kazemi, Alex A.; Chan, Eric; Koshinz, Dennis

    2014-09-01

    Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of space applications. This paper describes a new improved micro packaging method of hermetic seal mini-DIL (dual in line) laser diode module. The problem of using a softer solder resulted in failure mechanisms observed in the mini-DIL laser diode module based laser firing unit (LFU) for ordinance ignition of a missile system. These failures included: (1) failure in light output pulse power, (2) fiber pigtail damage inside the package snout which caused low LFU production yield. Our distinctive challenge for this project is the micro packaging of mini-DIL. For this package a new technique for the hermetic sealing using a micro-soldering process was developed. The process is able to confine the solder seal to a small region inside the snout near the fiber feed-through hole on the wall of the mini-DIL package. After completing the development, which included temperature and thermal cycling, X-rays analysis showed the new method had no fiber damage after the microsoldering seal. The new process resulted in 100% success in the packaging design and was granted a patent for the innovative development.

  11. Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications.

    Science.gov (United States)

    Morris, Michael A; Padmanabhan, Sibu C; Cruz-Romero, Malco C; Cummins, Enda; Kerry, Joseph P

    2017-10-01

    Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased customer demands for longer product shelf-life and storage capability. Consequently, conventional packaging materials and systems will have to evolve to meet these challenges. This review presents some of the new strategies that have been developed by employing novel nanotechnological concepts which have demonstrated some promise in significantly extending the shelf-life of muscle-based foods by providing commercially-applicable, antimicrobially-active, smart packaging solutions. The primary focus of this paper is applied to subject aspects, such as; material chemistries employed, forming methods utilised, interactions of the packaging functionalities including nanomaterials employed with polymer substrates and how such materials ultimately affect microbes. In order that such materials become industrially feasible, it is important that safe, stable and commercially-viable packaging materials are shown to be producible and effective in order to gain public acceptance, legislative approval and industrial adoption. Copyright © 2017. Published by Elsevier Ltd.

  12. Packaging Concerns/Techniques for Large Devices

    Science.gov (United States)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  13. Availability, Price, and Packaging of Electronic Cigarettes and E-Liquids in Guatemala City Retailers.

    Science.gov (United States)

    Chacon, Violeta; Arriaza, Astrid; Cavazos-Rehg, Patricia; Barnoya, Joaquin

    2018-01-05

    Electronic cigarettes (e-cigarettes) have the potential to normalize smoking and undermine tobacco control efforts. However, if well regulated, they also have a potential as smoking cessation aids. This study sought to determine the availability and types of e-cigarettes and e-liquids in Guatemala. We also assessed packaging characteristics and price. We surveyed a convenient sample of 39 Guatemala City retailers and purchased all e-cigarettes and e-liquids available. Duplicate samples (same brand, e-liquid type, flavor, nicotine content, or packaging) were purchased when prices were different between each other. Country of manufacture, flavor, expiration date, nicotine concentration, and price were recorded. We also documented package marketing strategies and warning labels. We purchased 64 e-cigarettes (53 unique and 11 duplicates) and 57 e-liquids (52 unique and 5 duplicates), mostly found on mall retailers. Most e-cigarettes (42, 66%) were first generation, followed by second (18, 28%) and third generations (4, 6%). Price of e-cigarettes differed significantly by generation. Most e-cigarettes (31, 58%) and 24 (46%) e-liquids did not include warning labels. Nicotine content was reported in 21 (39%) e-cigarettes that included e-liquids and 41 (79%) e-liquids' packages. E-cigarettes and e-liquids are available among a variety of retailers in Guatemala City and the industry is taking advantage of the fact that they are not regulated (eg, health claims, minimum sales age, and taxation). Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. To the best of our knowledge, this is the first study describing e-cigarettes and e-liquids available in retailers in a low/middle-income country like Guatemala. E-cigarettes and e-liquids were found in a variety of types, flavors, and nicotine concentrations in Guatemalan retailers. Our findings support the need for further research on e-cigarettes and e-liquids in Guatemala. © The Author

  14. Biosynthesis and Characterization of AgNPs-Silk/PVA Film for Potential Packaging Application.

    Science.gov (United States)

    Tao, Gang; Cai, Rui; Wang, Yejing; Song, Kai; Guo, Pengchao; Zhao, Ping; Zuo, Hua; He, Huawei

    2017-06-17

    Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP) is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag⁺ by the tyrosine residue of fibroin, and then prepared AgNPs-silk/poly(vinyl alcohol) (PVA) composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs-silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs-silk/PVA film offers more choices to be potentially applied in the active packaging field.

  15. Biosynthesis and Characterization of AgNPs–Silk/PVA Film for Potential Packaging Application

    Directory of Open Access Journals (Sweden)

    Gang Tao

    2017-06-01

    Full Text Available Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag+ by the tyrosine residue of fibroin, and then prepared AgNPs–silk/poly(vinyl alcohol (PVA composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs–silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs–silk/PVA film offers more choices to be potentially applied in the active packaging field.

  16. Development of utility generic functional requirements for electronic work packages and computer-based procedures

    Energy Technology Data Exchange (ETDEWEB)

    Oxstrand, Johanna [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2017-06-01

    The Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative is a step toward a vision of implementing an eWP framework that includes many types of eWPs. This will enable immediate paper-related cost savings in work management and provide a path to future labor efficiency gains through enhanced integration and process improvement in support of the Nuclear Promise (Nuclear Energy Institute 2016). The NEWPER initiative was organized by the Nuclear Information Technology Strategic Leadership (NITSL) group, which is an organization that brings together leaders from the nuclear utility industry and regulatory agencies to address issues involved with information technology used in nuclear-power utilities. NITSL strives to maintain awareness of industry information technology-related initiatives and events and communicates those events to its membership. NITSL and LWRS Program researchers have been coordinating activities, including joint organization of NEWPER-related meetings and report development. The main goal of the NEWPER initiative was to develop a set of utility generic functional requirements for eWP systems. This set of requirements will support each utility in their process of identifying plant-specific functional and non-functional requirements. The NEWPER initiative has 140 members where the largest group of members consists of 19 commercial U.S. nuclear utilities and eleven of the most prominent vendors of eWP solutions. Through the NEWPER initiative two sets of functional requirements were developed; functional requirements for electronic work packages and functional requirements for computer-based procedures. This paper will describe the development process as well as a summary of the requirements.

  17. Electron-molecule interactions and their applications

    CERN Document Server

    Christophorou, L G

    1984-01-01

    Electron-Molecule Interactions and Their Applications, Volume 2 provides a balanced and comprehensive account of electron-molecule interactions in dilute and dense gases and liquid media. This book consists of six chapters. Chapter 1 deals with electron transfer reactions, while Chapter 2 discusses electron-molecular positive-ion recombination. The electron motion in high-pressure gases and electron-molecule interactions from single- to multiple-collision conditions is deliberated in Chapter 3. In Chapter 4, knowledge on electron-molecule interactions in gases is linked to that on similar proc

  18. Packaging protein drugs as bacterial inclusion bodies for therapeutic applications

    Directory of Open Access Journals (Sweden)

    Villaverde Antonio

    2012-06-01

    Full Text Available Abstract A growing number of insights on the biology of bacterial inclusion bodies (IBs have revealed intriguing utilities of these protein particles. Since they combine mechanical stability and protein functionality, IBs have been already exploited in biocatalysis and explored for bottom-up topographical modification in tissue engineering. Being fully biocompatible and with tuneable bio-physical properties, IBs are currently emerging as agents for protein delivery into mammalian cells in protein-replacement cell therapies. So far, IBs formed by chaperones (heat shock protein 70, Hsp70, enzymes (catalase and dihydrofolate reductase, grow factors (leukemia inhibitory factor, LIF and structural proteins (the cytoskeleton keratin 14 have been shown to rescue exposed cells from a spectrum of stresses and restore cell functions in absence of cytotoxicity. The natural penetrability of IBs into mammalian cells (reaching both cytoplasm and nucleus empowers them as an unexpected platform for the controlled delivery of essentially any therapeutic polypeptide. Production of protein drugs by biopharma has been traditionally challenged by IB formation. However, a time might have arrived in which recombinant bacteria are to be engineered for the controlled packaging of therapeutic proteins as nanoparticulate materials (nanopills, for their extra- or intra-cellular release in medicine and cosmetics.

  19. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  20. Use of the GATE Monte Carlo package for dosimetry applications

    Energy Technology Data Exchange (ETDEWEB)

    Visvikis, D. [INSERM U650, LaTIM, University Hospital Medical School, F 29609 Brest (France)]. E-mail: Visvikis.Dimitris@univ-brest.fr; Bardies, M. [INSERM U601, CHU Nantes, F 44093 Nantes (France); Chiavassa, S. [INSERM U601, CHU Nantes, F 44093 Nantes (France); Danford, C. [Department of Medical Physics, MSKCC, New York (United States); Kirov, A. [Department of Medical Physics, MSKCC, New York (United States); Lamare, F. [INSERM U650, LaTIM, University Hospital Medical School, F 29609 Brest (France); Maigne, L. [Departement de Curietherapie-Radiotherapie, Centre Jean Perrin, F 63000 Clemont-Ferrand (France); Staelens, S. [UGent-ELIS, St-Pietersnieuwstraat, 41, B 9000 Gent (Belgium); Taschereau, R. [CRUMP Institute for Molecular Imaging, UCLA, Los Angeles (United States)

    2006-12-20

    One of the roles for Monte Carlo (MC) simulation studies is in the area of dosimetry. A number of different codes dedicated to dosimetry applications are available and widely used today, such as MCNP, EGSnrc and PTRAN. However, such codes do not easily facilitate the description of complicated 3D sources or emission tomography systems and associated data flow, which may be useful in different dosimetry application domains. Such problems can be overcome by the use of specific MC codes such as GATE (GEANT4 Application to Tomographic Emission), which is based on Geant4 libraries, providing a scripting interface with a number of advantages for the simulation of SPECT and PET systems. Despite this potential, its major disadvantage is in terms of efficiency involving long execution times for applications such as dosimetry. The strong points and disadvantages of GATE in comparison to other dosimetry specific codes are discussed and illustrated in terms of accuracy, efficiency and flexibility. A number of features, such as the use of voxelised and moving sources, as well as developments such as advanced visualization tools and the development of dose estimation maps allowing GATE to be used for dosimetry applications are presented. In addition, different examples from dosimetry applications with GATE are given. Finally, future directions with respect to the use of GATE for dosimetry applications are outlined.

  1. Application of the GEANT3 geometry package to the description of the OPAL detector

    Energy Technology Data Exchange (ETDEWEB)

    Allison, J; Brun, R; Bruyant, F; Zanarini, P; Bullock, F W; Hobson, P R; Chang, C Y; Dumont, J J; Hemingway, R J; McPherson, A C

    1987-10-01

    We present the general features of the GEANT3 package for coding the geometrical structure of a large and complex detector in the computer programs used for their design and analysis. This package has been developed in the context of Monte Carlo studies of detector performance but should be well matched to the problem of analysis. As a specific example, we illustrate the description of the OPAL detector for the Large Electron Positron collider at CERN and show the results of a sample study using this description.

  2. An application of the GEANT3 geometry package to the description of the OPAL detector

    International Nuclear Information System (INIS)

    Allison, J.; Bullock, F.W.; Hobson, P.R.; Lorazo, B.; Mallet, J.; Patrick, G.; Possoz, A.; Rossi, A.; Bologna Univ.; Ward, D.R.; Ward, C.P.

    1987-01-01

    We present the general features of the GEANT3 package for coding the geometrical structure of a large and complex detector in the computer programs used for their design and analysis. This package has been developed in the context of Monte Carlo studies of detector performance but should be well matched to the problem of analysis. As a specific example, we illustrate the description of the OPAL detector for the Large Electron Positron collider at CERN and show the results of a sample study using this description. (orig.)

  3. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    International Nuclear Information System (INIS)

    Sokolovskij, R; Liu, P; Van Zeijl, H W; Mimoun, B; Zhang, G Q

    2015-01-01

    Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies. (paper)

  4. Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

    Science.gov (United States)

    Ren, Huai-Hui; Wang, Xi-Shu

    2014-04-01

    This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

  5. Fabrication of antibacterial chitosan-PVA blended film using electrospray technique for food packaging applications.

    Science.gov (United States)

    Liu, Yaowen; Wang, Shuyao; Lan, Wenting

    2018-02-01

    In this study, blended films from poly(vinyl alcohol) (PVA) containing chitosan (CS) were prepared via a simple solution casting and electrospraying method. The structures of the PVA-CS films were characterized by Fourier-transform infrared spectroscopy. The morphologies of the films were observed by scanning electron microscopy. The thermal properties of the PVA-CS films were examined by thermogravimetry. The effects of CS contents on the mechanical properties, oxygen permeability values, water vapor permeation levels, and antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) strains were investigated. Compared to the pure PVA film, the PVA-CS films showed greater elongation at break, lower oxygen permeability, higher water barrier properties, and greater antibacterial activity, especially for the PVA:CS weight ratio of 75:25. The obtained results indicate the PVA-CS film may be a promising material for food packaging applications. Copyright © 2017 Elsevier B.V. All rights reserved.

  6. Nanocomposites in food packaging applications and their risk assessment for health

    Science.gov (United States)

    Honarvar, Zohreh; Hadian, Zahra; Mashayekh, Morteza

    2016-01-01

    Nanotechnology has shown many advantages in different fields. As the uses of nanotechnology have progressed, it has been found to be a promising technology for the food packaging industry in the global market. It has proven capabilities that are valuable in packaging foods, including improved barriers; mechanical, thermal, and biodegradable properties; and applications in active and intelligent food packaging. Examples of the latter are anti-microbial agents and nanosensors, respectively. However, the use of nanocomposites in food packaging might be challenging due to the reduced particle size of nanomaterials and the fact that the chemical and physical characteristics of such tiny materials may be quite different from those of their macro-scale counterparts. In order to discuss the potential risks of nanoparticles for consumers, in addition to the quantification of data, a thorough investigation of their characteristics is required. Migration studies must be conducted to determine the amounts of nanomaterials released into the food matrices. In this article, different applications of nanocomposites in food packaging, migration issues, analyzing techniques, and the main concerns about their usage are discussed briefly. PMID:27504168

  7. On the Use of PLA-PHB Blends for Sustainable Food Packaging Applications.

    Science.gov (United States)

    Arrieta, Marina Patricia; Samper, María Dolores; Aldas, Miguel; López, Juan

    2017-08-29

    Poly(lactic acid) (PLA) is the most used biopolymer for food packaging applications. Several strategies have been made to improve PLA properties for extending its applications in the packaging field. Melt blending approaches are gaining considerable interest since they are easy, cost-effective and readily available processing technologies at the industrial level. With a similar melting temperature and high crystallinity, poly(hydroxybutyrate) (PHB) represents a good candidate to blend with PLA. The ability of PHB to act as a nucleating agent for PLA improves its mechanical resistance and barrier performance. With the dual objective to improve PLAPHB processing performance and to obtain stretchable materials, plasticizers are frequently added. Current trends to enhance PLA-PHB miscibility are focused on the development of composite and nanocomposites. PLA-PHB blends are also interesting for the controlled release of active compounds in the development of active packaging systems. This review explains the most relevant processing aspects of PLA-PHB based blends such as the influence of polymers molecular weight, the PLA-PHB composition as well as the thermal stability. It also summarizes the recent developments in PLA-PHB formulations with an emphasis on their performance with interest in the sustainable food packaging field. PLA-PHB blends shows highly promising perspectives for the replacement of traditional petrochemical based polymers currently used for food packaging.

  8. A Kinetic Model for Predicting the Relative Humidity in Modified Atmosphere Packaging and Its Application in Lentinula edodes Packages

    Directory of Open Access Journals (Sweden)

    Li-xin Lu

    2013-01-01

    Full Text Available Adjusting and controlling the relative humidity (RH inside package is crucial for ensuring the quality of modified atmosphere packaging (MAP of fresh produce. In this paper, an improved kinetic model for predicting the RH in MAP was developed. The model was based on heat exchange and gases mass transport phenomena across the package, gases heat convection inside the package, and mass and heat balances accounting for the respiration and transpiration behavior of fresh produce. Then the model was applied to predict the RH in MAP of fresh Lentinula edodes (one kind of Chinese mushroom. The model equations were solved numerically using Adams-Moulton method to predict the RH in model packages. In general, the model predictions agreed well with the experimental data, except that the model predictions were slightly high in the initial period. The effect of the initial gas composition on the RH in packages was notable. In MAP of lower oxygen and higher carbon dioxide concentrations, the ascending rate of the RH was reduced, and the RH inside packages was saturated slowly during storage. The influence of the initial gas composition on the temperature inside package was not much notable.

  9. Board Level Proton Testing Book of Knowledge for NASA Electronic Parts and Packaging Program

    Science.gov (United States)

    Guertin, Steven M.

    2017-01-01

    This book of knowledge (BoK) provides a critical review of the benefits and difficulties associated with using proton irradiation as a means of exploring the radiation hardness of commercial-off-the-shelf (COTS) systems. This work was developed for the NASA Electronic Parts and Packaging (NEPP) Board Level Testing for the COTS task. The fundamental findings of this BoK are the following. The board-level test method can reduce the worst case estimate for a board's single-event effect (SEE) sensitivity compared to the case of no test data, but only by a factor of ten. The estimated worst case rate of failure for untested boards is about 0.1 SEE/board-day. By employing the use of protons with energies near or above 200 MeV, this rate can be safely reduced to 0.01 SEE/board-day, with only those SEEs with deep charge collection mechanisms rising this high. For general SEEs, such as static random-access memory (SRAM) upsets, single-event transients (SETs), single-event gate ruptures (SEGRs), and similar cases where the relevant charge collection depth is less than 10 µm, the worst case rate for SEE is below 0.001 SEE/board-day. Note that these bounds assume that no SEEs are observed during testing. When SEEs are observed during testing, the board-level test method can establish a reliable event rate in some orbits, though all established rates will be at or above 0.001 SEE/board-day. The board-level test approach we explore has picked up support as a radiation hardness assurance technique over the last twenty years. The approach originally was used to provide a very limited verification of the suitability of low cost assemblies to be used in the very benign environment of the International Space Station (ISS), in limited reliability applications. Recently the method has been gaining popularity as a way to establish a minimum level of SEE performance of systems that require somewhat higher reliability performance than previous applications. This sort of application of

  10. Application of Gelidium corneum edible films containing carvacrol for ham packages.

    Science.gov (United States)

    Lim, G O; Hong, Y H; Song, K B

    2010-01-01

    We prepared an edible film of Gelidium corneum (GC) containing carvacrol as an antimicrobial and antioxidative agent. The GC film containing carvacrol significantly decreased the WVP, while TS and %E values were increased, compared to the film without carvacrol. Increasing amounts of an antimicrobial agent increased antimicrobial activity against Escherichia coli O157:H7 and Listeria monocytogenes. Application of the film to ham packaging successfully inhibited the microbial growth and lipid oxidation of ham during storage. Our results indicate that GC film can be a useful edible packaging material for food products, and the incorporation of carvacrol in the GC film may extend the shelf life.

  11. Laser applications in the electronics and optoelectronics industry in Japan

    Science.gov (United States)

    Washio, Kunihiko

    1999-07-01

    This paper explains current status and technological trends in laser materials processing applications in electronics and optoelectronics industry in Japan. Various laser equipment based on solid state lasers or gas lasers such as excimer lasers or CO2 lasers has been developed and applied in manufacturing electronic and optoelectronic devices to meet the strong demands for advanced device manufacturing technologies for high-performance, lightweight, low power-consumption portable digital electronic appliances, cellular mobile phones, personal computers, etc. Representative applications of solid-state lasers are, opaque and clear defects repairing of photomasks for LSIs and LCDs, trimming of thick-film chip resistors and low resistance metal resistors, laser cutting and drilling of thin films for high-pin count semiconductor CSP packages, laser patterning of thin-film amorphous silicon solar cells, and laser welding of electronic components such as hard-disk head suspensions, optical modules, miniature relays and lithium ion batteries. Compact and highly efficient diode- pumped and Q-switched solid-state lasers in second or third harmonic operation mode are now being increasingly incorporated in various laser equipment for fine material processing. Representative applications of excimer lasers are, sub-quarter micron design-rule LSI lithography and low- temperature annealing of poly-silicon TFT LCD.

  12. Poly(hydroxyalkanoates for Food Packaging: Application and Attempts towards Implementation

    Directory of Open Access Journals (Sweden)

    M. Koller

    2014-09-01

    Full Text Available Plastics are well-established for convenient and safe packaging and distribution of food and feed goods. At present, this special sector of the plastic market displays remarkably increasing quantities of its annual production. Caused by the ongoing limitation and strongly fluctuating prices of fossil feedstocks, classically used for plastic production, there is an evident trend to switch towards so-called “bio-plastics”. Especially for bulk applications such as food packaging, a broad implementation of “bio-plastics” constitutes a future-oriented strategy to restrict the dependence of global industry on fossil feedstocks, and to diminish current problematic environmental issues arising from plastic disposal. However, food packaging demands a great deal of the utilized packaging material. This encompasses tailored mechanical properties such as low brittleness and adequate tensile strength, a sufficient barrier for oxygen, CO2, and aromatic flavors, high UV-resistance, and high water retention-capacity to block the food´s moisture content, or to prevent humidity, respectively. Due to their hydrophobic character and the broad flexibility of their mechanical features, prokaryotic poly(hydroxyalkanoates (PHAs are considered as promising materials to compete with petro-plastics on the food-packaging market. Nevertheless, short-comings in particular aspects of their material performance and economics of their biosynthesis and purification constitute stumbling blocks on the long way towards broad implementation of PHAs for food packaging. This article discusses advantages and drawbacks of PHAs as food packaging materials, and demonstrates how desired properties can be improved by the designing of novel composite materials, and also encompassing techniques by applying nanoparticles.

  13. Antimicrobial Activity of TiO2 Nanoparticle-Coated Film for Potential Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Siti Hajar Othman

    2014-01-01

    Full Text Available Recent uses of titanium dioxide (TiO2 have involved various applications which include the food industry. This study aims to develop TiO2 nanoparticle-coated film for potential food packaging applications due to the photocatalytic antimicrobial property of TiO2. The TiO2 nanoparticles with varying concentrations (0–0.11 g/ 100 mL organic solvent were coated on food packaging film, particularly low density polyethylene (LDPE film. The antimicrobial activity of the films was investigated by their capability to inactivate Escherichia coli (E. coli in an actual food packaging application test under various conditions, including types of light (fluorescent and ultraviolet (UV and the length of time the film was exposed to light (one–three days. The antimicrobial activity of the TiO2 nanoparticle-coated films exposed under both types of lighting was found to increase with an increase in the TiO2 nanoparticle concentration and the light exposure time. It was also found that the antimicrobial activity of the films exposed under UV light was higher than that under fluorescent light. The developed film has the potential to be used as a food packaging film that can extend the shelf life, maintain the quality, and assure the safety of food.

  14. Packaging for consumer electronic products: The need for integrating design and engineering

    OpenAIRE

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of packaging for CE goods would imply a process that takes into account all requirements, whether they are technical, financial, environmental or psychological in nature, and that also incorporates the rel...

  15. Applications of the Automated SMAC Modal Parameter Extraction Package

    International Nuclear Information System (INIS)

    MAYES, RANDALL L.; DORRELL, LARRY R.; KLENKE, SCOTT E.

    1999-01-01

    An algorithm known as SMAC (Synthesize Modes And Correlate), based on principles of modal filtering, has been in development for a few years. The new capabilities of the automated version are demonstrated on test data from a complex shell/payload system. Examples of extractions from impact and shaker data are shown. The automated algorithm extracts 30 to 50 modes in the bandwidth from each column of the frequency response function matrix. Examples of the synthesized Mode Indicator Functions (MIFs) compared with the actual MIFs show the accuracy of the technique. A data set for one input and 170 accelerometer outputs can typically be reduced in an hour. Application to a test with some complex modes is also demonstrated

  16. Accessing National Water Model Output for Research and Application: An R package

    Science.gov (United States)

    Johnson, M.; Coll, J.

    2017-12-01

    With the National Water Model becoming operational in August of 2016, the need for a open source way to translate a huge amount of data into actionable intelligence and innovative research is apparent. The first step in doing this is to provide a package for accessing, managing, and writing data in a way that is both interpretable, portable, and useful to the end user in both the R environment, and other applications. This can be as simple as subsetting the outputs and writing to a CSV, but can also include converting discharge output to more meaningful statistics and measurements, and methods to visualize data in ways that are meaningful to a wider audience. The NWM R package presented here aims to serve this need through a suite of functions fit for researchers, first responders, and average citizens. A vignette of how this package can be applied to real-time flood mapping will be demonstrated.

  17. Qualification of the coupled RELAP5/PANTHER/COBRA code package for licensing applications

    International Nuclear Information System (INIS)

    Schneidesch, C.R.; Zhang Jinzhao

    2004-01-01

    A coupled thermal hydraulics-neutronics code package has been developed at Tractebel Engineering (TE), in which the best-estimate thermal-hydraulic system code, RELAP5/mod2.5, is coupled with the full three-dimensional reactor core kinetics code, PANTHER, via the dynamic data exchange interface, TALINK. The Departure from Nucleate Boiling Ratio (DNBR) is calculated by the sub-channel thermal-hydraulic analysis code COBRA-3C. The package provides the capability to accurately simulate the key physical phenomena in nuclear power plant accidents with strong asymmetric behaviours and system-core interactions. This paper presents the TE coupled code package and focuses on the methodology followed for qualifying it for licensing applications. The qualification of the coupling demonstrated the robustness achieved by the combined 3-D neutron kinetics/system T-H code package for transient simulations. The coupled TE code package has been qualified and will be used at Tractebel Engineering (TE) for analyzing asymmetric PWR accidents with strong core-system interactions

  18. Dosimetry for Electron Beam Applications

    DEFF Research Database (Denmark)

    Miller, Arne

    1983-01-01

    This report describes two aspects of electron bean dosimetry, on one hand developaent of thin fil« dosimeters and measurements of their properties, and on the other hand developaent of calorimeters for calibration of routine dosimeters, e.g. thin films. Two types of radiochromic thin film...

  19. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Siyu Cai

    2016-12-01

    Full Text Available In this work, a novel processing method called powder thixoforming was proposed to prepare composites reinforced with 50 vol % of SiC particles (SiCp that were used for electronic packaging in order to investigate the effects of remelting duration on its microstructure and properties. Optical Microscope (OM, Scanning Electron Microscope (SEM, X-ray Diffraction (XRD and Transmission Electron Microscope (TEM methods were applied for the material characterization and the corresponding physical and mechanical properties were examined in detail. The obtained results indicate that the remelting duration exerted a large effect on the microstructure as well as the SiCp/Al interfacial reaction. The density and hardness of the composite continuously increased with increasing remelting duration. The thermal conductivity (TC and bending strength (BS first increased during the initial 90 min and then decreased. The remelting duration exerted a limited influence on the coefficient of thermal expansion (CTE. The optimal TC, BS, and hardness of these composites were up to 135.79 W/(m·K, 348.53 MPa, and 105.23 HV, respectively, and the CTE was less than 6.5 ppm/K after the composites were remelted at 600 °C for 90 min. The properties of the composites could thus be controlled to conform to the application requirements for electronic packaging materials.

  20. Packaging for consumer electronic products : The need for integrating design and engineering

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2008-01-01

    From the perspective of a multinational corporation producing durable consumer goods sustainable packaging is packaging that fulfils the right functionalities in the most efficient way. In order to achieve this, an integral design process is required. Such an integral approach to the design of

  1. Surface modification of food contact materials for processing and packaging applications

    Science.gov (United States)

    Barish, Jeffrey A.

    This body of work investigates various techniques for the surface modification of food contact materials for use in food packaging and processing applications. Nanoscale changes to the surface of polymeric food packaging materials enables changes in adhesion, wettability, printability, chemical functionality, and bioactivity, while maintaining desirable bulk properties. Polymer surface modification is used in applications such as antimicrobial or non-fouling materials, biosensors, and active packaging. Non-migratory active packagings, in which bioactive components are tethered to the package, offer the potential to reduce the need for additives in food products while maintaining safety and quality. A challenge in developing non-migratory active packaging materials is the loss of biomolecular activity that can occur when biomolecules are immobilized. Polyethylene glycol (PEG), a biocompatible polymer, is grafted from the surface of ozone treated low-density polyethylene (LDPE) resulting in a surface functionalized polyethylene to which a range of amine-terminated bioactive molecules can be immobilized. The grafting of PEG onto the surface of polymer packaging films is accomplished by free radical graft polymerization, and to covalently link an amine-terminated molecule to the PEG tether, demonstrating that amine-terminated bioactive compounds (such as peptides, enzymes, and some antimicrobials) can be immobilized onto PEG-grafted LDPE in the development of non-migratory active packaging. Fouling on food contact surfaces during food processing has a significant impact on operating efficiency and can promote biofilm development. Processing raw milk on plate heat exchangers results in significant fouling of proteins as well as minerals, and is exacerbated by the wall heating effect. An electroless nickel coating is co-deposited with polytetrafluoroethylene onto stainless steel to test its ability to resist fouling on a pilot plant scale plate heat exchanger. Further

  2. Power electronics handbook components, circuits and applications

    CERN Document Server

    Mazda, F F

    1993-01-01

    Power Electronics Handbook: Components, Circuits, and Applications is a collection of materials about power components, circuit design, and applications. Presented in a practical form, theoretical information is given as formulae. The book is divided into three parts. Part 1 deals with the usual components found in power electronics such as semiconductor devices and power semiconductor control components, their electronic compatibility, and protection. Part 2 tackles parts and principles related to circuits such as switches; link frequency chargers; converters; and AC line control, and Part 3

  3. Assessment of environmental impact of ultraviolet radiation or electron beam cured print inks on plastic packaging materials

    International Nuclear Information System (INIS)

    Bardi, Marcelo Augusto Goncalves

    2014-01-01

    The high level of pollution generated by the inadequate disposal of polymeric materials has motivated the search for environmentally friendly systems and techniques such as the application of biodegradable polymers and the replacement of the solvent-based paint systems by those with high solids content, based water or cured by radiation, practically free of volatile organic compounds. However, the cured polymer coatings are neither soluble nor molten, increasing the complexity of the reprocessing, recycling and degradation. Thus, this work aimed to develop print inks modified with pro-degrading agents, cured by ultraviolet radiation or electron beam, for printing or decoration in plastic packaging products of short lifetime, which are biodegradable or not. Six coatings (varnish and inks in five colors: yellow, blue, white, black and red), three pro-degrading agents (cobalt stearate, cerium stearate and manganese stearate), five polymeric substrates (Ecobras®, low density polyethylene and its respective modifications with pro-degrading agents). The coatings were applied to the substrates and cured by ultraviolet radiation or electron beam, resulting in 180 samples. These materials were then exposed to accelerated aging chamber, type 'QUV', and composting in natural environment. In order to assess the effects of the polymer coatings on the degradation process of the specimens, only the yellow and black samples were exposed to a controlled composting environment via respirometry, reducing to 16 the number of samples. The organic compound generated by the biodegradation process was analyzed by the ecotoxicity tests. It was observed that the coating layer acted as a barrier that inhibits degradation of the plastic when exposed to weathering. The addition of pro-degrading agents promoted acceleration in the degradation process, promoting the migration of the metal ion to the medium without affecting the final quality of the organic compost. (author)

  4. Use and application of gelatin as potential biodegradable packaging materials for food products.

    Science.gov (United States)

    Nur Hanani, Z A; Roos, Y H; Kerry, J P

    2014-11-01

    The manufacture and potential application of biodegradable films for food application has gained increased interest as alternatives to conventional food packaging polymers due to the sustainable nature associated with their availability, broad and abundant source range, compostability, environmentally-friendly image, compatibility with foodstuffs and food application, etc. Gelatin is one such material and is a unique and popularly used hydrocolloid by the food industry today due to its inherent characteristics, thereby potentially offering a wide range of further and unique industrial applications. Gelatin from different sources have different physical and chemical properties as they contain different amino acid contents which are responsible for the varying characteristics observed upon utilization in food systems and when being utilized more specifically, in the manufacture of films. Packaging films can be successfully produced from all gelatin sources and the behaviour and characteristics of gelatin-based films can be altered through the incorporation of other food ingredients to produce composite films possessing enhanced physical and mechanical properties. This review will present the current situation with respect to gelatin usage as a packaging source material and the challenges that remain in order to move the manufacture of gelatin-based films nearer to commercial reality. Copyright © 2014 Elsevier B.V. All rights reserved.

  5. Electron accelerators: History, applications, and perspectives

    Science.gov (United States)

    Martins, M. N.; Silva, T. F.

    2014-02-01

    This paper will present an outlook on sources of radiation, focusing on electron accelerators. We will review advances that were important for the development of particle accelerators, concentrating on those that led to modern electron accelerators. Electron accelerators are multipurpose machines that deliver beams with energies spanning five orders of magnitude, and are used in applications that range from fundamental studies of particle interactions to cross-linking polymer chains in industrial plants. Each accelerator type presents specific characteristics that make it more suitable for certain applications. Our work will focus on radiation sources for medical applications, dominated by electron linacs (linear accelerators), and those used for research, field where electron rings dominate. We will outline the main technological advances that occurred in the past decades, which made possible the construction of machines fit for clinical environments. Their compactness, efficiency and reliability have been key to their acceptance in clinical applications. This outline will include advances that allowed for the construction of brighter synchrotron light sources, where the relevant beam characteristics are good optical quality and high beam current. The development of insertion devices will also be discussed, as well the development of Free Electron Lasers (FEL). We conclude the review with an outline of the new developments of electron accelerators and the expectations for Energy Recovery Linacs.

  6. Industrial applications of electron beam technology

    International Nuclear Information System (INIS)

    Khairul Zaman Mohd Dahlan

    1997-01-01

    Electron beam technology was first introduced in Malaysia in 1989 with the conclusion of the bilateral cooperation between the Malaysian Institute for Nuclear Technology Research (MINT) and Japan International Co-operation Agency (JICA) on Radiation Application Projects. Two electron beam accelerators with energy of 3.0 MeV and 200 keV were installed at MINT. These two accelerators pave the way for R and D to be carried out in radiation processing of polymers for cross-linking and surface curing. In 1994, another electron beam accelerator was installed in the private sector for cross-linking of home appliance wires. Since then, two more accelerators were installed in the private sector for cross-linking of heat shrinkable plastic films. Recently, a local company has acquired a low energy electron beam machine for cross-linking of plastic film. Within a period of 7 years, industrial applications of electron beam technology in Malaysia have increased significantly

  7. Electron accelerators: History, applications, and perspectives

    International Nuclear Information System (INIS)

    Martins, M.N.; Silva, T.F.

    2014-01-01

    This paper will present an outlook on sources of radiation, focusing on electron accelerators. We will review advances that were important for the development of particle accelerators, concentrating on those that led to modern electron accelerators. Electron accelerators are multipurpose machines that deliver beams with energies spanning five orders of magnitude, and are used in applications that range from fundamental studies of particle interactions to cross-linking polymer chains in industrial plants. Each accelerator type presents specific characteristics that make it more suitable for certain applications. Our work will focus on radiation sources for medical applications, dominated by electron linacs (linear accelerators), and those used for research, field where electron rings dominate. We will outline the main technological advances that occurred in the past decades, which made possible the construction of machines fit for clinical environments. Their compactness, efficiency and reliability have been key to their acceptance in clinical applications. This outline will include advances that allowed for the construction of brighter synchrotron light sources, where the relevant beam characteristics are good optical quality and high beam current. The development of insertion devices will also be discussed, as well the development of Free Electron Lasers (FEL). We conclude the review with an outline of the new developments of electron accelerators and the expectations for Energy Recovery Linacs. - Highlights: ► We present an outlook on sources of radiation, focusing on electron accelerators. ► We review important advances for the development of modern electron accelerators. ► We outline advances that allowed for brighter synchrotron light sources. ► We describe the history of the development of electron accelerators in Brazil

  8. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and the New Tenets for Cost Conscious Mission Assurance on Electrical, Electronic, and Electromechanical (EEE) Parts

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2015-01-01

    The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.

  9. Applications of nanotechnology in food packaging and food safety: barrier materials, antimicrobials and sensors.

    Science.gov (United States)

    Duncan, Timothy V

    2011-11-01

    In this article, several applications of nanomaterials in food packaging and food safety are reviewed, including: polymer/clay nanocomposites as high barrier packaging materials, silver nanoparticles as potent antimicrobial agents, and nanosensors and nanomaterial-based assays for the detection of food-relevant analytes (gasses, small organic molecules and food-borne pathogens). In addition to covering the technical aspects of these topics, the current commercial status and understanding of health implications of these technologies are also discussed. These applications were chosen because they do not involve direct addition of nanoparticles to consumed foods, and thus are more likely to be marketed to the public in the short term. Published by Elsevier Inc.

  10. QMCPACK: an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

    Science.gov (United States)

    Kim, Jeongnim; Baczewski, Andrew D.; Beaudet, Todd D.; Benali, Anouar; Chandler Bennett, M.; Berrill, Mark A.; Blunt, Nick S.; Josué Landinez Borda, Edgar; Casula, Michele; Ceperley, David M.; Chiesa, Simone; Clark, Bryan K.; Clay, Raymond C., III; Delaney, Kris T.; Dewing, Mark; Esler, Kenneth P.; Hao, Hongxia; Heinonen, Olle; Kent, Paul R. C.; Krogel, Jaron T.; Kylänpää, Ilkka; Li, Ying Wai; Lopez, M. Graham; Luo, Ye; Malone, Fionn D.; Martin, Richard M.; Mathuriya, Amrita; McMinis, Jeremy; Melton, Cody A.; Mitas, Lubos; Morales, Miguel A.; Neuscamman, Eric; Parker, William D.; Pineda Flores, Sergio D.; Romero, Nichols A.; Rubenstein, Brenda M.; Shea, Jacqueline A. R.; Shin, Hyeondeok; Shulenburger, Luke; Tillack, Andreas F.; Townsend, Joshua P.; Tubman, Norm M.; Van Der Goetz, Brett; Vincent, Jordan E.; ChangMo Yang, D.; Yang, Yubo; Zhang, Shuai; Zhao, Luning

    2018-05-01

    QMCPACK is an open source quantum Monte Carlo package for ab initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater–Jastrow type trial wavefunctions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary-field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performance computing architectures, including multicore central processing unit and graphical processing unit systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://qmcpack.org.

  11. 3D printed System-on-Package (SoP) for environmental sensing and localization applications

    KAUST Repository

    Zhen, Su

    2017-12-22

    This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

  12. The application of NISA II FEM package in seismic qualification of small class IE electric motors

    International Nuclear Information System (INIS)

    Fancev, T.; Saban, I.; Grgic, D.

    1995-01-01

    According to the IEEE standards 323/1974 and 344/1975, seismic qualification of class IE equipment is appropriate combination of test and analysis methods. Complex equipment and assemblies are usually tested through seismic testing. The analysis is recommended for simple equipment that can be easily modeled to correctly predict its response. This article deals with the application of NISA II FEM package in 3D FE modeling and mode shape calculations of small power low voltage electric motors. (author)

  13. Aluminium oxide barrier films on polymeric web and their conversion for packaging applications

    OpenAIRE

    Struller, CF; Kelly, PJ; Copeland, NJ; Tobin, V; Assender, HE; Holliday, CW; Read, SJ

    2013-01-01

    In recent years, inorganic transparent barrier layers such as aluminium oxide or silicon oxide deposited onto polymer films have emerged as an attractive alternative to polymer based transparent barrier layers for flexible food packaging materials. For this application, barrier properties against water vapour and oxygen are critical. Aluminium oxide coatings can provide good barrier levels at thicknesses in the nanometre range, compared to several micrometres for polymer-based barrier layers....

  14. Materials and applications of bioresorbable electronics

    Science.gov (United States)

    Huang, Xian

    2018-01-01

    Bioresorbable electronics is a new type of electronics technology that can potentially lead to biodegradable and dissolvable electronic devices to replace current built-to-last circuits predominantly used in implantable devices and consumer electronics. Such devices dissolve in an aqueous environment in time periods from seconds to months, and generate biological safe products. This paper reviews materials, fabrication techniques, and applications of bioresorbable electronics, and aims to inspire more revolutionary bioresorbable systems that can generate broader social and economic impact. Existing challenges and potential solutions in developing bioresorbable electronics have also been presented to arouse more joint research efforts in this field to build systematic technology framework. Project supported by the National Natural Science Foundation of China (No. 61604108) and the Natural Science Foundation of Tianjin (No. 16JCYBJC40600).

  15. Electronic Nose Technology and its Applications

    Directory of Open Access Journals (Sweden)

    Esmaeil MAHMOUDI

    2009-08-01

    Full Text Available In the past decade, Electronic Nose instrumentation has generated much interest internationally for its potential to solve a wide variety of problems in fragrance and cosmetics production, food and beverages manufacturing, chemical engineering, environmental monitoring and more recently medical diagnostic, bioprocesses and clinical diagnostic plant diseases. This instrument measure electrical resistance changes generated by adsorption of volatiles to the surface of electro active- polymer coated sensor- unique digital electronic fingerprint of aroma derived from multi-sensor- responses to distinct mixture of microbial volatiles. Major advances in information and gas sensor technology could enhance the diagnostic power of future bio-electronic nose and facilitate global surveillance mode of disease control and management. Several dozen companies are now designed and selling electronic nose units globally for a wide variety of expending markets. The present review includes principles of electronic nose technology, biosensor structure and applications of electronic nose in many fields.

  16. APPLICATION OF POLYURETHANE FOAM FOR IMPACT ABSORPTION AND THERMAL INSULATION FOR RADIOACTIVE MATERIALS PACKAGINGS

    International Nuclear Information System (INIS)

    Smith, A; Glenn Abramczyk, G; Paul Blanton, P; Steve Bellamy, S; William Daugherty, W; Sharon Williamson, S

    2007-01-01

    Polyurethane foam has been widely used as an impact absorbing and thermal insulating material for large radioactive materials packages, since the 1980's. With the adoption of the regulatory crush test requirement, for smaller packages, polyurethane foam has been adopted as a replacement for cane fiberboard, because of its ability to withstand the crush test. Polyurethane foam is an engineered material whose composition is much more closely controlled than that of cane fiberboard. In addition, the properties of the foam can be controlled by controlling the density of the foam. The conditions under which the foam is formed, whether confined or unconfined have an affect on foam properties. The study reported here reviewed the application of polyurethane foam in RAM packagings and compared property values reported in the literature with published property values and test results for foam specimens taken from a prototype 9977 packaging. The study confirmed that, polyurethane foam behaves in a predictable and consistent manner and fully satisfies the functional requirements for impact absorption and thermal insulation

  17. Software and package applicating for network meta-analysis: A usage-based comparative study.

    Science.gov (United States)

    Xu, Chang; Niu, Yuming; Wu, Junyi; Gu, Huiyun; Zhang, Chao

    2017-12-21

    To compare and analyze the characteristics and functions of software applications for network meta-analysis (NMA). PubMed, EMbase, The Cochrane Library, the official websites of Bayesian inference Using Gibbs Sampling (BUGS), Stata and R, and Google were searched to collect the software and packages for performing NMA; software and packages published up to March 2016 were included. After collecting the software, packages, and their user guides, we used the software and packages to calculate a typical example. All characteristics, functions, and computed results were compared and analyzed. Ten types of software were included, including programming and non-programming software. They were developed mainly based on Bayesian or frequentist theory. Most types of software have the characteristics of easy operation, easy mastery, exact calculation, or excellent graphing. However, there was no single software that performed accurate calculations with superior graphing; this could only be achieved through the combination of two or more types of software. This study suggests that the user should choose the appropriate software according to personal programming basis, operational habits, and financial ability. Then, the choice of the combination of BUGS and R (or Stata) software to perform the NMA is considered. © 2017 Chinese Cochrane Center, West China Hospital of Sichuan University and John Wiley & Sons Australia, Ltd.

  18. Application of electron beam irradiation, (1). Development and application of electron beam processors

    International Nuclear Information System (INIS)

    Katsumura, Yosuke

    1994-01-01

    This paper deals with characteristics, equipment (principle and kinds), present conditions, and future issues in the application of electron beam irradiation. Characteristics of electron beams are described in terms of the following: chemical and biological effects of radiation; energy and penetrating power of electron beams; and principle and kinds of electron beam accelerator. Industrial application of electron beam irradiation has advantages of high speed procedure and producibility, less energy, avoidance of poisonous gas, and extreme reduction of organic solvents to be used. The present application of electron beam irradiation cen be divided into the following: (1) hardening of resin or coated membrane; (2) improvement of macromolecular materials; (3) environmental protection; (4) sterilization; (5) food sterilization. The present equipment for electron beam irradiation is introduced according to low energy, medium energy, and high energy equipment. Finally, future issues focuses on (1) the improvement of traceability system and development of electron dosimetric techniques and (2) food sterilization. (N.K.)

  19. Nanotechnology in Meat Processing and Packaging: Potential Applications — A Review

    Directory of Open Access Journals (Sweden)

    Karna Ramachandraiah

    2015-02-01

    Full Text Available Growing demand for sustainable production, increasing competition and consideration of health concerns have led the meat industries on a path to innovation. Meat industries across the world are focusing on the development of novel meat products and processes to meet consumer demand. Hence, a process innovation, like nanotechnology, can have a significant impact on the meat processing industry through the development of not only novel functional meat products, but also novel packaging for the products. The potential benefits of utilizing nanomaterials in food are improved bioavailability, antimicrobial effects, enhanced sensory acceptance and targeted delivery of bioactive compounds. However, challenges exist in the application of nanomaterials due to knowledge gaps in the production of ingredients such as nanopowders, stability of delivery systems in meat products and health risks caused by the same properties which also offer the benefits. For the success of nanotechnology in meat products, challenges in public acceptance, economics and the regulation of food processed with nanomaterials which may have the potential to persist, accumulate and lead to toxicity need to be addressed. So far, the most promising area for nanotechnology application seems to be in meat packaging, but the long term effects on human health and environment due to migration of the nanomaterials from the packaging needs to be studied further. The future of nanotechnology in meat products depends on the roles played by governments, regulatory agencies and manufacturers in addressing the challenges related to the application of nanomaterials in food.

  20. Technology and applications of electron accelerator

    International Nuclear Information System (INIS)

    Natsir, M.

    1998-01-01

    Technology of electron accelerator have been developed so fast in advanced countries. It was applied in the research and development (R and D) and comercially in various industries. The industries applying electron accelerator includes polymers industry, sterilization of medical tools, material surface modification, and environmental management. The radiation process using electron beam is an ionization radiation process. Two facilities of electron accelerator have been established in pilot scale at the Centre for the Application of Isotope and Radiation CAIR-BATAN, Jakarta, for the RandD of radiation process technology and in demonstrating the electron accelerator application in industry in Indonesia. The first has low energy specification of 300 keV, 50 mA, EPS-300 type and the second has medium energy specification of 2 MeV, 10 mA dynamitron model GJ-2 type. Both the electron accelerators have an electron penetration depth capability of 0.6 and 12 mm, respectively, for the double side irradiation in the materials with density of 1 g/cm 3 . They also highly capacity production and electron beam cross-section of 120 cm length and 10 cm width. The beam will go through the atmosphere for irradiation samples or industrial products. The radiation dose can be selected precisely by adjusting the electron beam current and conveyor speed. Both of these facilities were applied in many aspects RandD, for examples dosimetry, wood surface coating, cross-linking of polymer, heatshrincable tube, polymer grafting, plastic degradation, food preservation, sterilization and so on. Engineering factors of radiation design process and general observation of electron accelerator application in RandD for various industries in Indonesia are briefly discussed

  1. Prospects for application of post-consumer used plastics in food packaging.

    Science.gov (United States)

    Miltz, J; Ram, A; Nir, M M

    1997-01-01

    The two most widely used polymers in packaging in recent years are polyethylene terephthalate (PET) and polyethylene (PE). The biggest fractions of these polymers are not re-utilized, in spite of the fact that they possess excellent properties even after their first application. The ban on using recycled polymers in food packaging applications and the lack of good value outlets for these materials causes them to end up in landfills. The high cost nylon, used in packaging primarily as high gas barrier laminates with PE, also finds its way to landfills. In this case, the reason is the difficulty of recycling different polymers that are incompatible. Thus, the Municipal Solid Waste (MSW) stream transferred to landfills contains many plastic packages. These packages are being blamed as a major pollutant of the environment in spite of the fact that all plastics contribute only a small percentage to the weight of the garbage in landfills. If proper and cost effective applications for the recycled polymers could be developed, the waste related to their disposal could be limited. In addition, the contribution of plastic packages to the environmental problem could be diminished. In the present paper, the possibility of sandwiching a contaminated PET layer between two layers of the virgin material was studied. The aim of the study was to determine whether such an operation could lower the migration level of contaminants from a multilayer structure (containing a recycled layer of PET) to values below the limits required by regulatory agencies. The diffusion coefficients (required to determine migration) of four organic liquids in PET were determined. As a result of the sandwiching operation, the amount of pollutant (toluene) migrating into the food simulant was reduced by two orders of magnitude. The properties of PE/nylon blends were also studied. It was found that the high gas barrier properties of nylon are preserved in the blend when proper processing conditions are used

  2. Development of the simulation package 'ELSES' for extra-large-scale electronic structure calculation

    Energy Technology Data Exchange (ETDEWEB)

    Hoshi, T [Department of Applied Mathematics and Physics, Tottori University, Tottori 680-8550 (Japan); Fujiwara, T [Core Research for Evolutional Science and Technology, Japan Science and Technology Agency (CREST-JST) (Japan)

    2009-02-11

    An early-stage version of the simulation package 'ELSES' (extra-large-scale electronic structure calculation) is developed for simulating the electronic structure and dynamics of large systems, particularly nanometer-scale and ten-nanometer-scale systems (see www.elses.jp). Input and output files are written in the extensible markup language (XML) style for general users. Related pre-/post-simulation tools are also available. A practical workflow and an example are described. A test calculation for the GaAs bulk system is shown, to demonstrate that the present code can handle systems with more than one atom species. Several future aspects are also discussed.

  3. Potential application of electron accelerators in Malaysia

    Energy Technology Data Exchange (ETDEWEB)

    Alang Md Rashid, Nahrul Khair; Mohd Dahlan, Khairul Zaman [Nuclear Energy Unit, Bangi, Selangor (Malaysia)

    1994-12-31

    Briefly discussed some applications of electron accelerators i.e. sterilization, pasteurization (high energy EBM - up to 10 MV), crosslinking of wire and cable and insulation (medium energy EBM - 1 to 5 MV), treatment of flue gases for removal of NO sub x and SO sub x from burning coal(low energy EBM - 700 to 900 kV), curing of surface coatings, printing ink, adhesives (low energy EBM - 200 to 500 kV); advantages and electron beam processing.

  4. Potential application of electron accelerators in Malaysia

    International Nuclear Information System (INIS)

    Nahrul Khair Alang Md Rashid; Khairul Zaman Mohd Dahlan

    1994-01-01

    Briefly discussed some applications of electron accelerators i.e. sterilization, pasteurization (high energy EBM - up to 10 MV), crosslinking of wire and cable and insulation (medium energy EBM - 1 to 5 MV), treatment of flue gases for removal of NO sub x and SO sub x from burning coal(low energy EBM - 700 to 900 kV), curing of surface coatings, printing ink, adhesives (low energy EBM - 200 to 500 kV); advantages and electron beam processing

  5. System and Method for Providing a Climate Data Analytic Services Application Programming Interface Distribution Package

    Science.gov (United States)

    Schnase, John L. (Inventor); Duffy, Daniel Q. (Inventor); Tamkin, Glenn S. (Inventor)

    2016-01-01

    A system, method and computer-readable storage devices for providing a climate data analytic services application programming interface distribution package. The example system can provide various components. The system provides a climate data analytic services application programming interface library that enables software applications running on a client device to invoke the capabilities of a climate data analytic service. The system provides a command-line interface that provides a means of interacting with a climate data analytic service by issuing commands directly to the system's server interface. The system provides sample programs that call on the capabilities of the application programming interface library and can be used as templates for the construction of new client applications. The system can also provide test utilities, build utilities, service integration utilities, and documentation.

  6. XRAY applied program package for calculation of electron-photon fields in the energy range of 1-1000 keV

    International Nuclear Information System (INIS)

    Lappa, A.V.; Khadyeva, Z.M.; Burmistrov, D.S.; Vasil'ev, O.N.

    1990-01-01

    The package of applied XRAY programs is intended for calculating the linear and fluctuation characteristics of photon and electron radiation fields in heterogeneous medium within 1-1000 keV energy range. The XRAY program package consists of moduli written in FORTRAN-IV and data files. 9 refs

  7. Nano crystals for Electronic and Optoelectronic Applications

    International Nuclear Information System (INIS)

    Zhu, T.; Cloutier, S.G.; Ivanov, I; Knappenberger Jr, K.L.; Robel, I.; Zhang, F

    2012-01-01

    Electronic and optoelectronic devices, from computers and smart cell phones to solar cells, have become a part of our life. Currently, devices with featured circuits of 45 nm in size can be fabricated for commercial use. However, further development based on traditional semiconductor is hindered by the increasing thermal issues and the manufacturing cost. During the last decade, nano crystals have been widely adopted in various electronic and optoelectronic applications. They provide alternative options in terms of ease of processing, low cost, better flexibility, and superior electronic/optoelectronic properties. By taking advantage of solution-processing, self-assembly, and surface engineering, nano crystals could serve as new building blocks for low-cost manufacturing of flexible and large area devices. Tunable electronic structures combined with small exciton binding energy, high luminescence efficiency, and low thermal conductivity make nano crystals extremely attractive for FET, memory device, solar cell, solid-state lighting/display, photodetector, and lasing applications. Efforts to harness the nano crystal quantum tunability have led to the successful demonstration of many prototype devices, raising the public awareness to the wide range of solutions that nano technology can provide for an efficient energy economy. This special issue aims to provide the readers with the latest achievements of nano crystals in electronic and optoelectronic applications, including the synthesis and engineering of nano crystals towards the applications and the corresponding device fabrication, characterization and computer modeling.

  8. Applications of the Discrete ordinates of Oak ridge System (DOORS) package to Nuclear Engineering problems

    Energy Technology Data Exchange (ETDEWEB)

    Azmy, Y.Y. [The Pennsylvania State University, 229 Reber Building, University Park, PA 16802 (United States)]. e-mail: yya3@psu.edu

    2004-07-01

    Particle transport problems are notorious for their difficulty. This fact requires that production level computer codes designed to address realistic engineering problems possess three important features: (i) high computational efficiency as measured by solution accuracy for a fixed computational cost; (ii) a wide variety of options to enhance robustness of the transport solver; and (iii) a broad collection of support codes that extend the reach of the transport solver to a wide variety of applications. The Discrete Ordinates of Oak Ridge System (DOORS) code package was designed with these features in mind. In this paper, capabilities of member codes in the DOORS package are overviewed with particular emphasis on two newly developed peripheral codes: BOT3P the mesh-generation and visualization code package, and GipGui the graphical user interface for the cross section manipulation code, GIP. Two large applications are used to illustrate the tight coupling between the peripheral codes and the DORT and TORT transport solvers in two and three dimensional geometries, respectively. These are: (i) criticality calculations for the C5G7MOX core benchmark; and (ii) dose distribution calculations for the Target Service Cell (TSC) of the Spallation Neutron Source (SNS). (Author)

  9. German competent authority guidance in FE methods applications for package design assessment

    International Nuclear Information System (INIS)

    Voelzke, H.; Wieser, G.; Zencker, U.; Qiao Linan; Ballheimer, V.

    2004-01-01

    The development of new methods in analysing package designs by using the finite element method (FEM) is of increasing importance. Package designers are more and more applying the growing opportunities of numerical methods to perform safety assessments for their products which requires suited methods also for competent authorities like BAM to verify the applicants' results. This presentation gives an topical overview of the experiences and tendencies within the complex field of finite element design testing. There are at first some general and more formal aspects concerning the correct finite element program selection and documentation of modelling, material properties, boundaries and calculation results including their interpretation. To give a reliable basis to the applicants in Germany BAM has drawn up and published a Finite Element Guideline recently. Secondly, the paper discusses actual technical questions which are of a wide interest and range from mechanical reflections on cask drop and extreme impact scenarios to thermal reflections on decay heat removal and fire scenarios. Examples from BAM work on FE-development activities are shown to demonstrate the great opportunities as well as the difficulties of using finite element methods for package safety analysis and design testing

  10. German competent authority guidance in FE methods applications for package design assessment

    Energy Technology Data Exchange (ETDEWEB)

    Voelzke, H.; Wieser, G.; Zencker, U.; Qiao Linan; Ballheimer, V. [Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin (Germany)

    2004-07-01

    The development of new methods in analysing package designs by using the finite element method (FEM) is of increasing importance. Package designers are more and more applying the growing opportunities of numerical methods to perform safety assessments for their products which requires suited methods also for competent authorities like BAM to verify the applicants' results. This presentation gives an topical overview of the experiences and tendencies within the complex field of finite element design testing. There are at first some general and more formal aspects concerning the correct finite element program selection and documentation of modelling, material properties, boundaries and calculation results including their interpretation. To give a reliable basis to the applicants in Germany BAM has drawn up and published a Finite Element Guideline recently. Secondly, the paper discusses actual technical questions which are of a wide interest and range from mechanical reflections on cask drop and extreme impact scenarios to thermal reflections on decay heat removal and fire scenarios. Examples from BAM work on FE-development activities are shown to demonstrate the great opportunities as well as the difficulties of using finite element methods for package safety analysis and design testing.

  11. Applications of the Discrete ordinates of Oak ridge System (DOORS) package to Nuclear Engineering problems

    International Nuclear Information System (INIS)

    Azmy, Y.Y.

    2004-01-01

    Particle transport problems are notorious for their difficulty. This fact requires that production level computer codes designed to address realistic engineering problems possess three important features: (i) high computational efficiency as measured by solution accuracy for a fixed computational cost; (ii) a wide variety of options to enhance robustness of the transport solver; and (iii) a broad collection of support codes that extend the reach of the transport solver to a wide variety of applications. The Discrete Ordinates of Oak Ridge System (DOORS) code package was designed with these features in mind. In this paper, capabilities of member codes in the DOORS package are overviewed with particular emphasis on two newly developed peripheral codes: BOT3P the mesh-generation and visualization code package, and GipGui the graphical user interface for the cross section manipulation code, GIP. Two large applications are used to illustrate the tight coupling between the peripheral codes and the DORT and TORT transport solvers in two and three dimensional geometries, respectively. These are: (i) criticality calculations for the C5G7MOX core benchmark; and (ii) dose distribution calculations for the Target Service Cell (TSC) of the Spallation Neutron Source (SNS). (Author)

  12. Wafer-level chip-scale packaging analog and power semiconductor applications

    CERN Document Server

    Qu, Shichun

    2015-01-01

    This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

  13. State of the Art of Antimicrobial Edible Coatings for Food Packaging Applications

    Directory of Open Access Journals (Sweden)

    Arantzazu Valdés

    2017-04-01

    Full Text Available The interest for the development of new active packaging materials has rapidly increased in the last few years. Antimicrobial active packaging is a potential alternative to protect perishable products during their preparation, storage and distribution to increase their shelf-life by reducing bacterial and fungal growth. This review underlines the most recent trends in the use of new edible coatings enriched with antimicrobial agents to reduce the growth of different microorganisms, such as Gram-negative and Gram-positive bacteria, molds and yeasts. The application of edible biopolymers directly extracted from biomass (proteins, lipids and polysaccharides or their combinations, by themselves or enriched with natural extracts, essential oils, bacteriocins, metals or enzyme systems, such as lactoperoxidase, have shown interesting properties to reduce the contamination and decomposition of perishable food products, mainly fish, meat, fruits and vegetables. These formulations can be also applied to food products to control gas exchange, moisture permeation and oxidation processes.

  14. Electron Beam Scanning in Industrial Applications

    Science.gov (United States)

    Jongen, Yves; Herer, Arnold

    1996-05-01

    Scanned electron beams are used within many industries for applications such as sterilization of medical disposables, crosslinking of wire and cables insulating jackets, polymerization and degradation of resins and biomaterials, modification of semiconductors, coloration of gemstones and glasses, removal of oxides from coal plant flue gasses, and the curing of advanced composites and other molded forms. X-rays generated from scanned electron beams make yet other applications, such as food irradiation, viable. Typical accelerators for these applications range in beam energy from 0.5MeV to 10 MeV, with beam powers between 5 to 500kW and scanning widths between 20 and 300 cm. Since precise control of dose delivery is required in many of these applications, the integration of beam characteristics, product conveyance, and beam scanning mechanisms must be well understood and optimized. Fundamental issues and some case examples are presented.

  15. Extreme temperature packaging: challenges and opportunities

    Science.gov (United States)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  16. Radiation leakage from linac electron applicator assembly

    International Nuclear Information System (INIS)

    Keys, R.A.; Purdy, J.A.

    1984-01-01

    The electron beam applicator system currently in use on the linear accelerator is constructed of light-weight fiberglass and aluminum. With an applicator in place on the accelerator, the photon collimator jaws are automatically set several centimeters greater than the electron field size projected at the patient's surface. To ensure that no regions of high dose levels exist outside the useful beam, ionization and film measurements were made to quantitate the amount of leakage radiation through the 10 cm x 10 cm and 25 cm x 25 cm applicators. In most regions, the ionization levels at the patient's surface were below 5% of the central axis dose. In one area for the 25 cm applicator, the percentage ionization was 8.5%, which could be reduced by the addition of a small piece of 1/8 inch thick lead. However, ionization levels on the outside surface of the applicator were found to be considerably higher at certain locations for the 25 cm applicator. Results for 6, 9, 12 and 20 MeV electrons are reported here

  17. Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes

    Science.gov (United States)

    Dalverny, O.; Alexis, J.

    2018-02-01

    This article deals with thermo-mechanical behavior of power electronic modules used in several transportation applications as railway, aeronautic or automotive systems. Due to a multi-layered structures, involving different materials with a large variation of coefficient of thermal expansion, temperature variations originated from active or passive cycling (respectively from die dissipation or environmental constraint) induces strain and stresses field variations, giving fatigue phenomenon of the system. The analysis of the behavior of these systems and their dimensioning require the implementation of complex modeling strategies by both the multi-physical and the multi-scale character of the power modules. In this paper we present some solutions for studying the thermomechanical behavior of brazed assemblies as well as taking into account the interfaces represented by the numerous metallizations involved in the process assembly.

  18. Applications for Energy Recovering Free Electron Lasers

    Energy Technology Data Exchange (ETDEWEB)

    George Neil

    2007-08-01

    The availability of high-power, high-brilliance sources of tunable photons from energy-recovered Free Electron Lasers is opening up whole new fields of application of accelerators in industry. This talk will review some of the ideas that are already being put into production, and some of the newer ideas that are still under development.

  19. Structure and Properties of Chitin Whisker Reinforced Papers for Food Packaging Application

    Directory of Open Access Journals (Sweden)

    Zhihan Li

    2015-04-01

    Full Text Available In recent years, concerns about environmental waste caused by petroleum-derived chemicals as well as the consumer's demand for high quality food products, have prompted people to pay more attention to developing biodegradable food packaging materials using natural resources such as cellulose fibers and chitin derivatives. In this study, chitin whiskers have been successfully generated by hydrolyzing the α-chitin sample. Then the synthesized nano-sized chitin whiskers were used at ratios from 0.1% to 2% (wt% for improving strength properties of paper sheets by the dip-coating method. Transmission electron microscopy (TEM and field emission scanning electron microscopy (FE-SEM were used to investigate the morphology of chitin whiskers and cellulose fiber compounds. The results showed that coating with chitin whiskers brought about an increase in tear strength, burst strength, and wet and dry tensile strength, with a decrease in Zeta-potential value.

  20. High Temperature Wireless Communication And Electronics For Harsh Environment Applications

    Science.gov (United States)

    Hunter, G. W.; Neudeck, P. G.; Beheim, G. M.; Ponchak, G. E.; Chen, L.-Y

    2007-01-01

    In order for future aerospace propulsion systems to meet the increasing requirements for decreased maintenance, improved capability, and increased safety, the inclusion of intelligence into the propulsion system design and operation becomes necessary. These propulsion systems will have to incorporate technology that will monitor propulsion component conditions, analyze the incoming data, and modify operating parameters to optimize propulsion system operations. This implies the development of sensors, actuators, and electronics, with associated packaging, that will be able to operate under the harsh environments present in an engine. However, given the harsh environments inherent in propulsion systems, the development of engine-compatible electronics and sensors is not straightforward. The ability of a sensor system to operate in a given environment often depends as much on the technologies supporting the sensor element as the element itself. If the supporting technology cannot handle the application, then no matter how good the sensor is itself, the sensor system will fail. An example is high temperature environments where supporting technologies are often not capable of operation in engine conditions. Further, for every sensor going into an engine environment, i.e., for every new piece of hardware that improves the in-situ intelligence of the components, communication wires almost always must follow. The communication wires may be within or between parts, or from the engine to the controller. As more hardware is added, more wires, weight, complexity, and potential for unreliability is also introduced. Thus, wireless communication combined with in-situ processing of data would significantly improve the ability to include sensors into high temperature systems and thus lead toward more intelligent engine systems. NASA Glenn Research Center (GRC) is presently leading the development of electronics, communication systems, and sensors capable of prolonged stable

  1. Radiation effects evaluation for electrons sheaf in packages resistance in a Lasioderma serricorne, Plodia interpunctella and Sitophilus zeamais

    International Nuclear Information System (INIS)

    Alves, Juliana Nazare

    2011-01-01

    The plagues of stored products consist of a man problem, depreciating products and causing economical damages. Among these curses we have Lasioderma serricorne (F. 1792), Sitophilus zeamais (M. 1855) and Plodia interpunctella (H. 1813) known by infesting stored products as: grains, brans, flours, coffee, tobacco, dried fruits and spices. These curses perforate and penetrate the packages, ovipositing over the substratum. In this context the package plays a fundamental part, preventing the contact and curses' proliferation in the packed product. So, to protect the packed product and to prolong its shelf life, the package should have good mechanical resistance to tension and perforation, good sealing, good barrier properties and should not transfer odors nor strange flavors to the packed product. The ionizing radiation can cause structural changes in polymer packages, these changes are caused by the scission processes and reticulation of the polymers chains. These are concurrent processes and the predominance of one over the other depends on the chemical structure of the polymer, the irradiation conditions and specific factors of the material that will absorb the energy. This work had the objective to evaluate the changes in mechanical properties of package structures used to store granola, cereal bar and pasta, as well as its resistance to perforation by L. serricorne, P. interpunctella and S. zeamais, when submitted to electrons sheaf radiation. In this methodology were used five structures of commercially utilized packages to store granola, cereal bar and pasta composed by (Polypropylene bi-oriented metallic/Polypropylene bi-oriented coextruded - BOPPmet/BOPP 50 μm), (Polypropylene bi-oriented/Polypropylene - BOPP/PP 50 μm), Poli (ethylene terephthalate) metallic/Polypropylene bi-oriented coextruded - PETmet/BOPP 32 μm), Poli (ethylene terephthalate) /Polypropylene - PET/PP1 72 μm), Poli (ethylene terephthalate)/Polypropylene - PET/PP2 32 μm). The structures

  2. Proceedings of the International Electronic Circuit Packaging Symposium (3rd) on Advances in Electronic Circuit Packaging Held at Boulder, Colorado on 15-17 August 1962. Volume 3,

    Science.gov (United States)

    1963-01-01

    the connector pin, which was then sol - dered at various levels of wire build up. It is proposed, with a slight modification of the connector terminal...sacrificial anode for galvanic protection of other metals. Aluminum Aluminum and its alloys show promise for applications in long-life oceano - graphic...section of a dumet weld lead. Calculations and actual heat measurements on the effects of welding and sol - dering within 0.060 in. of the component

  3. Packaging of high-power bars for optical pumping and direct applications

    Science.gov (United States)

    Heinemann, Stefan; An, Haiyan; Barnowski, Tobias; Jiang, John; Negoita, Viorel; Roff, Robert; Vethake, Thilo; Boucke, Konstantin; Treusch, Georg

    2015-03-01

    Continuous cost reduction, improved reliability and modular platform guide the design of our next generation heatsink and packaging process. Power scaling from a single device effectively lowers the cost, while electrical insulation of the heatsink, low junction temperature and hard solder enable high reliability. We report on the latest results for scaling the output power of bars for optical pumping and materials processing. The epitaxial design and geometric structures are specific for the application, while packaging with minimum thermal impedance, low stress and low smile are generic features. The isolated heatsink shows a thermal impedance of 0.2 K/W and the maximum output power is limited by the requirement of a junction temperature of less than 68oC for high reliability. Low contact impedance are addressed for drive currents of 300 A. For pumping applications, bars with a fill factor of 60% are deployed emitting more than 300 W of output power with an efficiency of about 55% and 8 bars are arranged in a compact pump module emitting 2 kW of collimated power suitable for pumping disk lasers. For direct applications we target coupling kilowatts of output powers into fibers of 100 μm diameter with 0.1 NA based on dense wavelength multiplexing. Low fill factor bars with large optical waveguide and specialized coating also emit 300 W.

  4. Polyhydroxyalkanoate (PHA: Review of synthesis, characteristics, processing and potential applications in packaging

    Directory of Open Access Journals (Sweden)

    E. Bugnicourt

    2014-11-01

    Full Text Available Polyhydroxyalkanoates (PHAs are gaining increasing attention in the biodegradable polymer market due to their promising properties such as high biodegradability in different environments, not just in composting plants, and processing versatility. Indeed among biopolymers, these biogenic polyesters represent a potential sustainable replacement for fossil fuel-based thermoplastics. Most commercially available PHAs are obtained with pure microbial cultures grown on renewable feedstocks (i.e. glucose under sterile conditions but recent research studies focus on the use of wastes as growth media. PHA can be extracted from the bacteria cell and then formulated and processed by extrusion for production of rigid and flexible plastic suitable not just for the most assessed medical applications but also considered for applications including packaging, moulded goods, paper coatings, non-woven fabrics, adhesives, films and performance additives. The present paper reviews the different classes of PHAs, their main properties, processing aspects, commercially available ones, as well as limitations and related improvements being researched, with specific focus on potential applications of PHAs in packaging.

  5. The Application Strategy of Iterative Solution Methodology to Matrix Equations in Hydraulic Solver Package, SPACE

    International Nuclear Information System (INIS)

    Na, Y. W.; Park, C. E.; Lee, S. Y.

    2009-01-01

    As a part of the Ministry of Knowledge Economy (MKE) project, 'Development of safety analysis codes for nuclear power plants', KOPEC has been developing the hydraulic solver code package applicable to the safety analyses of nuclear power plants (NPP's). The matrices of the hydraulic solver are usually sparse and may be asymmetric. In the earlier stage of this project, typical direct matrix solver packages MA48 and MA28 had been tested as matrix solver for the hydraulic solver code, SPACE. The selection was based on the reasonably reliable performance experience from their former version MA18 in RELAP computer code. In the later stage of this project, the iterative methodologies have been being tested in the SPACE code. Among a few candidate iterative solution methodologies tested so far, the biconjugate gradient stabilization methodology (BICGSTAB) has shown the best performance in the applicability test and in the application to the SPACE code. Regardless of all the merits of using the direct solver packages, there are some other aspects of tackling the iterative solution methodologies. The algorithm is much simpler and easier to handle. The potential problems related to the robustness of the iterative solution methodologies have been resolved by applying pre-conditioning methods adjusted and modified as appropriate to the application in the SPACE code. The application strategy of conjugate gradient method was introduced in detail by Schewchuk, Golub and Saad in the middle of 1990's. The application of his methodology to nuclear engineering in Korea started about the same time and is still going on and there are quite a few examples of application to neutronics. Besides, Yang introduced a conjugate gradient method programmed in C++ language. The purpose of this study is to assess the performance and behavior of the iterative solution methodology compared to those of the direct solution methodology still being preferred due to its robustness and reliability. The

  6. Structure of a headful DNA-packaging bacterial virus at 2.9 Å resolution by electron cryo-microscopy.

    Science.gov (United States)

    Zhao, Haiyan; Li, Kunpeng; Lynn, Anna Y; Aron, Keith E; Yu, Guimei; Jiang, Wen; Tang, Liang

    2017-04-04

    The enormous prevalence of tailed DNA bacteriophages on this planet is enabled by highly efficient self-assembly of hundreds of protein subunits into highly stable capsids. These capsids can stand with an internal pressure as high as ∼50 atmospheres as a result of the phage DNA-packaging process. Here we report the complete atomic model of the headful DNA-packaging bacteriophage Sf6 at 2.9 Å resolution determined by electron cryo-microscopy. The structure reveals the DNA-inflated, tensed state of a robust protein shell assembled via noncovalent interactions. Remarkable global conformational polymorphism of capsid proteins, a network formed by extended N arms, mortise-and-tenon-like intercapsomer joints, and abundant β-sheet-like mainchain:mainchain intermolecular interactions, confers significant strength yet also flexibility required for capsid assembly and DNA packaging. Differential formations of the hexon and penton are mediated by a drastic α-helix-to-β-strand structural transition. The assembly scheme revealed here may be common among tailed DNA phages and herpesviruses.

  7. Overview on thermal and mechanical challenges of high power RF electronic packaging

    NARCIS (Netherlands)

    Yuan, C.A.; Kregting, R.; Driel, W. van; Gielen, A.W.J.; Xiao, A.; Zhang, G.Q.

    2011-01-01

    High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics

  8. Axial Vircator for Electronic Warfare Applications

    Directory of Open Access Journals (Sweden)

    L. Drazan

    2009-12-01

    Full Text Available This paper deals with a high power microwave generator with virtual cathode – vircator in axial release for electronic warfare applications. The classification of directed energy weapons microwave (DEWM is introduced together with basic block diagrams of a particular class of DEWM. In the paper, methods for designing vircator pulsed power supply, axial vircator structure, measurement methods and experimental results are presented. The vircator in electromagnetic ammunition is powered by magneto-cumulative generator and in weapons for defense of objects (WDO, it is powered by Marx generator. The possible applications of a vircator in the DEWM area are discussed.

  9. Design of compact freeform lens for application specific Light-Emitting Diode packaging.

    Science.gov (United States)

    Wang, Kai; Chen, Fei; Liu, Zongyuan; Luo, Xiaobing; Liu, Sheng

    2010-01-18

    Application specific LED packaging (ASLP) is an emerging technology for high performance LED lighting. We introduced a practical design method of compact freeform lens for extended sources used in ASLP. A new ASLP for road lighting was successfully obtained by integrating a polycarbonate compact freeform lens of small form factor with traditional LED packaging. Optical performance of the ASLP was investigated by both numerical simulation based on Monte Carlo ray tracing method and experiments. Results demonstrated that, comparing with traditional LED module integrated with secondary optics, the ASLP had advantages of much smaller size in volume (approximately 1/8), higher system lumen efficiency (approximately 8.1%), lower cost and more convenience for customers to design and assembly, enabling possible much wider applications of LED for general road lighting. Tolerance analyses were also conducted. Installation errors of horizontal and vertical deviations had more effects on the shape and uniformity of radiation pattern compared with rotational deviation. The tolerances of horizontal, vertical and rotational deviations of this lens were 0.11 mm, 0.14 mm and 2.4 degrees respectively, which were acceptable in engineering.

  10. Wafer-level micro-optics: trends in manufacturing, testing, packaging, and applications

    Science.gov (United States)

    Voelkel, Reinhard; Gong, Li; Rieck, Juergen; Zheng, Alan

    2012-11-01

    Micro-optics is an indispensable key enabling technology (KET) for many products and applications today. Probably the most prestigious examples are the diffractive light shaping elements used in high-end DUV lithography steppers. Highly efficient refractive and diffractive micro-optical elements are used for precise beam and pupil shaping. Micro-optics had a major impact on the reduction of aberrations and diffraction effects in projection lithography, allowing a resolution enhancement from 250 nm to 45 nm within the last decade. Micro-optics also plays a decisive role in medical devices (endoscopes, ophthalmology), in all laser-based devices and fiber communication networks (supercomputer, ROADM), bringing high-speed internet to our homes (FTTH). Even our modern smart phones contain a variety of micro-optical elements. For example, LED flashlight shaping elements, the secondary camera, and ambient light and proximity sensors. Wherever light is involved, micro-optics offers the chance to further miniaturize a device, to improve its performance, or to reduce manufacturing and packaging costs. Wafer-scale micro-optics fabrication is based on technology established by semiconductor industry. Thousands of components are fabricated in parallel on a wafer. We report on the state of the art in wafer-based manufacturing, testing, packaging and present examples and applications for micro-optical components and systems.

  11. Electronic Attendance Application Using Raspberry Pi

    International Nuclear Information System (INIS)

    Mohd Dzul Aiman Aslan; Saaidi Ismail; Mohamad Safuan Sulaiman

    2016-01-01

    Raspberry Pi is a cheap mini-computer that officially runs on a Linux distribution Operating System (OS) such as Raspbian. It has many input and output mechanisms simulating a computer which make it useful replacement for a computer system. SimpleCV, an open source python-based image processing software and Telegram, a popular social application provide API that allow communication trough a device such as Raspberry Pi. Combining these two, an electronic attendance has been developed using open source basis, and the electronic attendance also provide enhancement of current system that is to record the person face and sending information through Telegram application. The methodology include gathering requirements on remaining system and test it on Linux which will discuss further. This project is serve as a prototype for enhancement of current Commersial Of The Shelf (COTS) electronic attendance that only record ID of the attendees. In the future, the electronic attendance can be enhanced with many features and should be make in-a-box for commercialization. (author)

  12. Synaptic electronics: materials, devices and applications.

    Science.gov (United States)

    Kuzum, Duygu; Yu, Shimeng; Wong, H-S Philip

    2013-09-27

    In this paper, the recent progress of synaptic electronics is reviewed. The basics of biological synaptic plasticity and learning are described. The material properties and electrical switching characteristics of a variety of synaptic devices are discussed, with a focus on the use of synaptic devices for neuromorphic or brain-inspired computing. Performance metrics desirable for large-scale implementations of synaptic devices are illustrated. A review of recent work on targeted computing applications with synaptic devices is presented.

  13. Synaptic electronics: materials, devices and applications

    International Nuclear Information System (INIS)

    Kuzum, Duygu; Yu, Shimeng; Philip Wong, H-S

    2013-01-01

    In this paper, the recent progress of synaptic electronics is reviewed. The basics of biological synaptic plasticity and learning are described. The material properties and electrical switching characteristics of a variety of synaptic devices are discussed, with a focus on the use of synaptic devices for neuromorphic or brain-inspired computing. Performance metrics desirable for large-scale implementations of synaptic devices are illustrated. A review of recent work on targeted computing applications with synaptic devices is presented. (topical review)

  14. ESTAR, PSTAR, ASTAR. A PC package for calculating stopping powers and ranges of electrons, protons and helium ions. Version 2

    International Nuclear Information System (INIS)

    Berger, M.J.

    1993-01-01

    A PC package is documented for calculating stopping powers and ranges of electrons, protons and helium ions in matter for energies from 1 keV up to 10 GeV. Stopping powers and ranges for electrons can be calculated for any element, compound or mixture. Stopping powers and ranges of protons and helium ions can be calculated for 74 materials (26 elements and 48 compounds and mixtures). The files are stored on two HD diskettes in compressed form. Both executable files for IBM PC and Fortran-77 source files are provided. All three programs require 5.2 Mb of disk space. This set of two diskettes with detailed documentation is available upon request, cost free, from the IAEA Nuclear Data Section. (author). 25 refs, 4 tabs

  15. Electronic Cigarette Refill Liquids: Child-Resistant Packaging, Nicotine Content, and Sales to Minors2

    Science.gov (United States)

    Buettner-Schmidt, Kelly; Miller, Donald R.; Balasubramanian, Narayanaganesh

    2016-01-01

    Purpose To determine the accuracy of the labeled quantity of the nicotine content of the e-liquids sold in unlicensed vape stores, whether the packaging of e-liquids sold within the vape stores was child-resistant, whether minors were present within vape stores, and whether sales to minors occurred. This study was conducted across North Dakota prior to implementation of a new e-cigarette state law and provided a baseline assessment before enactment of the new legal requirements. Design and Methods We tested samples of e-liquids and performed observations in 16 stores that were selling e-cigarettes but were not legally required to be licensed for tobacco retail. The e-liquids were analyzed for nicotine content using a validated high-performance liquid chromatography method for nicotine analysis. Results Of the 70 collected e-liquid samples that claimed to contain nicotine, 17% contained more than the labeled quantity and 34% contained less than the labeled quantity by 10% or more, with one sample containing 172% more than the labeled quantity. Of the 94 e-liquid containers sampled, only 35% were determined to be child-resistant. Minors were present in stores, although no sales to minors occurred. Conclusions Mislabeling of nicotine in e-liquids is common and exposes the user to the harmful effects of nicotine. The lack of child-resistant packaging for this potentially toxic substance is a serious public health problem. E-cigarettes should be included in the legal definition of tobacco products, child-resistant packaging and nicotine labeling laws should be enacted and strictly enforced, and vape stores should be licensed by states. PMID:27079973

  16. Electronic Cigarette Refill Liquids: Child-Resistant Packaging, Nicotine Content, and Sales to Minors.

    Science.gov (United States)

    Buettner-Schmidt, Kelly; Miller, Donald R; Balasubramanian, Narayanaganesh

    2016-01-01

    To determine the accuracy of the labeled quantity of the nicotine content of the e-liquids sold in unlicensed vape stores, whether the packaging of e-liquids sold within the vape stores was child-resistant, whether minors were present within vape stores, and whether sales to minors occurred. This study was conducted across North Dakota prior to implementation of a new e-cigarette state law and provided a baseline assessment before enactment of the new legal requirements. We tested samples of e-liquids and performed observations in 16 stores that were selling e-cigarettes but were not legally required to be licensed for tobacco retail. The e-liquids were analyzed for nicotine content using a validated high-performance liquid chromatography method for nicotine analysis. Of the 70 collected e-liquid samples that claimed to contain nicotine, 17% contained more than the labeled quantity and 34% contained less than the labeled quantity by 10% or more, with one sample containing 172% more than the labeled quantity. Of the 94 e-liquid containers sampled, only 35% were determined to be child-resistant. Minors were present in stores, although no sales to minors occurred. Mislabeling of nicotine in e-liquids is common and exposes the user to the harmful effects of nicotine. The lack of child-resistant packaging for this potentially toxic substance is a serious public health problem. E-cigarettes should be included in the legal definition of tobacco products, child-resistant packaging and nicotine labeling laws should be enacted and strictly enforced, and vape stores should be licensed by states. Copyright © 2016 Elsevier Inc. All rights reserved.

  17. Deep Impact Delta II Launch Vehicle Cracked Thick Film Coating on Electronic Packages Technical Consultation Report

    Science.gov (United States)

    Cameron, Kenneth D.; Kichak, Robert A.; Piascik, Robert S.; Leidecker, Henning W.; Wilson, Timmy R.

    2009-01-01

    The Deep Impact spacecraft was launched on a Boeing Delta II rocket from Cape Canaveral Air Force Station (CCAFS) on January 12, 2005. Prior to the launch, the Director of the Office of Safety and Mission Assurance (OS&MA) requested the NASA Engineering and Safety Center (NESC) lead a team to render an independent opinion on the rationale for flight and the risk code assignments for the hazard of cracked Thick Film Assemblies (TFAs) in the E-packages of the Delta II launch vehicle for the Deep Impact Mission. The results of the evaluation are contained in this report.

  18. Heterogeneous Electronics – Wafer Level Integration, Packaging, and Assembly Facility

    Data.gov (United States)

    Federal Laboratory Consortium — This facility integrates active electronics with microelectromechanical (MEMS) devices at the miniature system scale. It obviates current size-, weight-, and power...

  19. Perceptions of Sustainability and Functional Aspects on Liquid Carton Board Packaging Materials versus Competing Materials for Juice Applications in Sweden

    Directory of Open Access Journals (Sweden)

    Carl Olsmats

    2015-08-01

    Full Text Available This research explores the downstream perceptions of liquid carton board versus competing materials in packaging applications for juice. The methodology used is focus groups. The context is sustainability and functional performance, and related potential implications for the beverage industry value chain. The purpose is to get a deeper insight and understanding of functionality in relation to juice beverage packaging. The results confirm that there is no optimal packaging for every juice product, but a multitude, depending on the distribution channel, retail outlet, customer preferences, and context of consumption. There are some general packaging preferences, but the main deciding criteria for purchase seem to be the product characteristics in terms of quality, taste, brand, price and shelf life. For marketing reasons, packaging has to be adopted to the product and its positioning, liquid carton board packaging seem to have some functional advantages in distribution and is considered as sustainable and functional among many consumers. Major drawbacks seem to be shape limitations, lack of transparency, and lack of a “premium look”. To improve packaging performance and avoid sub-optimization, actors in the beverage industry value chain need to be integrated in development processes.

  20. Peripheral dose outside applicators in electron beams

    International Nuclear Information System (INIS)

    Chow, James C L; Grigorov, Grigor N

    2006-01-01

    The peripheral dose outside the applicators in electron beams was studied using a Varian 21 EX linear accelerator. To measure the peripheral dose profiles and point doses for the applicator, a solid water phantom was used with calibrated Kodak TL films. Peak dose spot was observed in the 4 MeV beam outside the applicator. The peripheral dose peak was very small in the 6 MeV beam and was ignorable at higher energies. Using the 10 x 10 cm 2 cutout and applicator, the dose peak for the 4 MeV beam was about 12 cm away from the field central beam axis (CAX) and the peripheral dose profiles did not change with depths measured at 0.2, 0.5 and 1 cm. The peripheral doses and profiles were further measured by varying the angle of obliquity, cutout and applicator size for the 4 MeV beam. The local peak dose was increased with about 3% per degree angle of obliquity, and was about 1% of the prescribed dose (angle of obliquity equals zero) at 1 cm depth in the phantom using the 10 x 10 cm 2 cutout and applicator. The peak dose position was also shifted 7 mm towards the CAX when the angle of obliquity was increased from 0 to 15 deg. (note)

  1. Polylactic acid/zinc oxide biocomposite films for food packaging application.

    Science.gov (United States)

    Marra, Antonella; Silvestre, Clara; Duraccio, Donatella; Cimmino, Sossio

    2016-07-01

    Although PLA is much more expensive than polyolefins, such as PP and PE, there is a great interest to propose PLA based material as alternative films for food packaging being PLA derivable from natural source, compostable and biodegradable. For this purpose the research has the task to investigate and propose PLA materials with enhanced properties to be effectively and efficiently alternative to polyolefin films for food packaging application. In this contribution, biocomposite films of PLA with 1, 3 and 5wt% of ZnO have been investigated to determine mechanical, barrier and antimicrobial (against Escherichia coli) properties. It is found that the biocomposite films are characterized by a good dispersion of the ZnO particles in PLA matrix, although no previous treatment was performed on ZnO particles, such as silanization, to decrease its incompatibility with the polymer. The biocomposite films have shown good mechanical properties, decrease of permeability to CO2 and O2, and only a slight increase to water vapour. Particularly important is that, for the biocomposite with 5wt% of ZnO, the % Reduction for E. Coli test reached the value of 99.99 already after 24h. Copyright © 2016 Elsevier B.V. All rights reserved.

  2. Eugenol-loaded chitosan nanoparticles: II. Application in bio-based plastics for active packaging.

    Science.gov (United States)

    Woranuch, Sarekha; Yoksan, Rangrong

    2013-07-25

    The aim of the present research was to study the possibility of using eugenol-loaded chitosan nanoparticles as antioxidants for active bio-based packaging material. Eugenol-loaded chitosan nanoparticles were incorporated into thermoplastic flour (TPF) - a model bio-based plastic - through an extrusion process at temperatures above 150°C. The influences of eugenol-loaded chitosan nanoparticles on crystallinity, morphology, thermal properties, radical scavenging activity, reducing power, tensile properties and barrier properties of TPF were investigated. Although the incorporation of 3% (w/w) of eugenol-loaded chitosan nanoparticles significantly reduced the extensibility and the oxygen barrier property of TPF, it provided antioxidant activity and improved the water vapor barrier property. In addition, TPF containing eugenol-loaded chitosan nanoparticles exhibited superior radical scavenging activity and stronger reducing power compared with TPF containing naked eugenol. The results suggest the applicability of TPF containing eugenol-loaded chitosan nanoparticles as an antioxidant active packaging material. Copyright © 2012 Elsevier Ltd. All rights reserved.

  3. Strategies to improve the mechanical strength and water resistance of agar films for food packaging applications.

    Science.gov (United States)

    Sousa, Ana M M; Gonçalves, Maria P

    2015-11-05

    Agar films possess several properties adequate for food packaging applications. However, their high cost-production and quality variations caused by physiological and environmental factors affecting wild seaweeds make them less attractive for industries. In this work, native (NA) and alkali-modified (AA) agars obtained from sustainably grown seaweeds (integrated multi-trophic aquaculture) were mixed with locust bean gum (LBG) to make 'knife-coated' films with fixed final concentration (1 wt%) and variable agar/LBG ratios. Agar films were easier to process upon LBG addition (viscosity increase and gelling character decrease of the film-forming solutions observed by dynamic oscillatory and steady shear measurements). The mechanical properties and water resistance were optimal for films with 50 and/or 75% LBG contents and best in the case of NA (cheaper to extract). These findings can help reduce the cost-production of agar packaging films. Moreover, the controlled cultivation of seaweeds can provide continuous and reliable feedstock for transformation industries. Copyright © 2015 Elsevier Ltd. All rights reserved.

  4. Around and about an application of the GAMLSS package to non-stationary flood frequency analysis

    Science.gov (United States)

    Debele, S. E.; Bogdanowicz, E.; Strupczewski, W. G.

    2017-08-01

    The non-stationarity of hydrologic processes due to climate change or human activities is challenging for the researchers and practitioners. However, the practical requirements for taking into account non-stationarity as a support in decision-making procedures exceed the up-to-date development of the theory and the of software. Currently, the most popular and freely available software package that allows for non-stationary statistical analysis is the GAMLSS (generalized additive models for location, scale and shape) package. GAMLSS has been used in a variety of fields. There are also several papers recommending GAMLSS in hydrological problems; however, there are still important issues which have not previously been discussed concerning mainly GAMLSS applicability not only for research and academic purposes, but also in a design practice. In this paper, we present a summary of our experiences in the implementation of GAMLSS to non-stationary flood frequency analysis, highlighting its advantages and pointing out weaknesses with regard to methodological and practical topics.

  5. Application of digital radiography for the non-destructive characterization of radioactive waste packages

    International Nuclear Information System (INIS)

    Lierse, C.; Goebel, H.; Kaciniel, E.; Buecherl, T.; Krebs, K.

    1995-01-01

    Digital radiography (DR) using gamma-rays is a powerful tool for the non-destructive determination of various parameters which are relevant within the quality control procedure of radioactive waste packages prior to an interim storage or a final disposal. DR provides information about the waste form and the extent of filling in a typical container. It can identify internal structures and defects, gives their geometric dimensions and helps to detect non-declared inner containers, shielding materials etc. From a digital radiographic image the waste matrix homogeneity may be determined and mean attenuation coefficients as well as density values for selected regions of interest can be calculated. This data provides the basis for an appropriate attenuation correction of gamma emission measurements (gamma scanning) and makes a reliable quantification of gamma emitters in waste containers possible. Information from DR measurements are also used for the selection of interesting height positions of the object which are subsequently inspected in more detail by other non-destructive methods, e. g. by transmission computerized tomography (TCT). The present paper gives important technical specifications of an integrated tomography system (ITS) which is used to perform digital radiography as well as transmission/emission computerized tomography (TCT/ECT) on radioactive waste packages. It describes the DR mode and some of its main applications and shows typical examples of radiographs of real radioactive waste drums

  6. Lattice Boltzmann schemes for convection-diffusion phenomena : application to packages of agricultural products

    NARCIS (Netherlands)

    Sman, van der R.G.M.

    1999-01-01

    Packaging is crucial for the control of quality of fresh agricultural products. How to optimise the packaging design for a particular product and distribution chain, is still not fully understood. Various empirical studies have shown that existing packaging designs can still be improved

  7. Environmental applications of electron-beam technology

    International Nuclear Information System (INIS)

    Pikaev, A.K.

    2001-01-01

    The main directions of modern environmental applications of electron-beam technology are the following: 1) treatment of polluted natural and drinking water, municipal and industrial wastewater, other liquid wastes; 2) purification of gases; 3) treatment of sewage sludges; 4) treatment of solid wastes (medical wastes, contaminated soil and so on). In some cases, the results of respective researches and developments found a large-scale application. For example, recently several industrial plants for electron-beam purification of flue gases of thermal power plants from SO2 and NOx were created in China, Poland and Japan. In the report, a brief summary of the most important results obtained in the mentioned directions will be presented. A special attention will be paid to the data in the first direction. In particular, the recent results on radiation treatment of some liquid systems obtained in the laboratory under author's leadership will be considered. One of them is water polluted with petroleum products (motor oil, diesel fuel, residual fuel oil). The pollutants were present in water in dissolved form and as a separate phase. It was found that irradiation (dose 25-40 kGy) decomposes and removes the pollutants as a precipitate. The second system is natural oil gas consisting of gaseous and low-boiling hydrocarbons, water and so on. Laboratory- and pilot-scale (with electron accelerator of 0.7 MeV and 30 kW) studies have shown that electron-beam treatment (in a recycling regime with continuous sampling the liquid phase) of this gas leads to the formation of a mixture of liquid branched hydrocarbons, alcohols, ethers and so on, i.e., there is a radiation-induced liquefaction of the natural oil gas. The mechanism of radiolytic conversions occurring in the mentioned systems will be discussed

  8. SWISTRACK - AN OPEN SOURCE, SOFTWARE PACKAGE APPLICABLE TO TRACKING OF FISH LOCOMOTION AND BEHAVIOUR

    DEFF Research Database (Denmark)

    Steffensen, John Fleng

    2010-01-01

    including swimming speed, acceleration and directionality of movements as well as the examination of locomotory panems during swimming. SWiSlrdL:k, a [n: t; and downloadable software package (available from www.sourceforge.com) is widely used for tracking robots, humans and other animals. Accordingly......, Swistrack can be easily adopted for the tracking offish. Benefits associated with the free software include: • Contrast or marker based tracking enabling tracking of either the whole animal, or tagged marks placed upon the animal • The ability to track multiple tags placed upon an individual animal • Highly...... effective background subtraction algorithms and filters ensuring smooth tracking of fish • Application of tags of different colour enables the software to track multiple fish without the problem of track exchange between individuals • Low processing requirements enable tracking in real-time • Further...

  9. Application of design of experiments to welding process of food packaging

    Directory of Open Access Journals (Sweden)

    Jan Hron

    2013-01-01

    Full Text Available Design of experiments is one of the many problem-solving quality tools that can be used for various investigations such as finding the significant factors in a process, the effect of each factor on the outcome, the variance in the process, troubleshooting the machine problems, screening the parameters, and modeling the processes. The objectives of the experiment in this study are two-fold. The first objective is to identify the parameters of food packaging welding, which influence the response strength of a weld. The second objective is to identify the process parameters that affect the variability in the weld strength. The results of the experiment have stimulated the engineering team within the company to extend the applications of DOE in other core processes for performance improvement and variability reduction activities.

  10. Industrial applications or electron beams; Aplicaciones industriales de la irradiacion como servicio

    Energy Technology Data Exchange (ETDEWEB)

    Martin, J. I.

    2001-07-01

    Industrial use of electron beams began in the 1950's with the crosslinking of polyethylene film and wire insulation. Today the number of electron beam Processing Systems installed for industrial applications throughout the world has grown to more than six hundred stations in over 35 countries. Total installed power is now approaching 40 megawatts (over 8 million tons of products per year). Electron beam is now utilized by many major industries including plastics, automotive, rubber goods, wire and cable, electrical insulation, semiconductor, medical, packaging, or pollution control. The principal effect of high-energy electrons is to produce ions in the materials treated, resulting in the liberation of orbital electrons. As a result, the original molecule is modified and the ree radicals combine to form new molecules with new chemical reactions or dis organisation od the DNA chains of living organisms (insects, fungus, microorganisms, etc.). (Author) 8 refs.

  11. Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

    Science.gov (United States)

    Maxa, Jacob; Novikov, Andrej; Nowottnick, Mathias

    2017-01-01

    Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

  12. Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

    Directory of Open Access Journals (Sweden)

    Jacob Maxa

    2017-12-01

    Full Text Available Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

  13. Permeation mechanisms of pulsed microwave plasma deposited silicon oxide films for food packaging applications

    International Nuclear Information System (INIS)

    Deilmann, Michael; Grabowski, Mirko; Theiss, Sebastian; Bibinov, Nikita; Awakowicz, Peter

    2008-01-01

    Silicon oxide barrier layers are deposited on polyethylene terephthalate as permeation barriers for food packaging applications by means of a low pressure microwave plasma. Hexamethyldisiloxane (HMDSO) and oxygen are used as process gases to deposit SiO x coatings via pulsed low pressure plasmas. The layer composition of the coating is investigated by Fourier transform infrared spectroscopy and energy dispersive x-ray spectroscopy to show correlations with barrier properties of the films. The oxygen permeation barrier is determined by the carrier gas method using an electrochemical detector. The transition from low to high barrier films is mapped by the transition from organic SiO x C y H z layers to quartz-like SiO 1.7 films containing silanol bound hydrogen. A residual permeation as low as J = 1 ± 0.3 cm 3 m -2 day -1 bar -1 is achieved, which is a good value for food packaging applications. Additionally, the activation energy E p of oxygen permeation is analysed and a strong increase from E p = 31.5 kJ mol -1 for SiO x C y H z -like coatings to E p = 53.7 kJ mol -1 for SiO 1.7 films is observed by increasing the oxygen dilution of HMDSO:O 2 plasma. The reason for the residual permeation of high barrier films is discussed and coating defects are visualized by capacitively coupled atomic oxygen plasma etching of coated substrates. A defect density of 3000 mm -2 is revealed

  14. Electron collisions—experiment, theory, and applications

    Science.gov (United States)

    Bartschat, Klaus

    2018-07-01

    Electron collisions with atoms, ions, and molecules have represented an important area of ‘applied quantum mechanics’ for more than a century. This Topical Review is the write-up of the Allis Prize Lecture given by the author at the 2016 meeting of the Division of Atomic, Molecular, and Optical Physics of the American Physical Society and the 2017 Gaseous Electronics Conference. In light of the enormous size of the field, the examples presented were selected in order to tell the story of how experimental and theoretical/numerical methods have developed over time, how fruitful collaborations between data producers (experimentalists and theorists) and data users have led to significant progress, and how the results of these studies, which were often designed for fundamental research in order to push both experiment and theory to new frontiers, continue to be highly sought after for modeling applications in a variety of fields. The impact of electron collision studies on other fields, such as photoinduced processes and quantum information, is also discussed.

  15. The Ettention software package

    International Nuclear Information System (INIS)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-01-01

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  16. The Ettention software package

    Energy Technology Data Exchange (ETDEWEB)

    Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

    2016-02-15

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  17. Modifying thin film diamond for electronic applications

    International Nuclear Information System (INIS)

    Baral, B.

    1999-01-01

    The unique combination of properties that diamond possesses are being exploited in both electronic and mechanical applications. An important step forward in the field has been the ability to grow thin film diamond by chemical vapour deposition (CVD) methods and to control parameters such as crystal orientation, dopant level and surface roughness. An extensive understanding of the surface of any potential electronic material is vital to fully comprehend its behaviour within device structures. The surface itself ultimately controls key aspects of device performance when interfaced with other materials. This study has provided insight into important chemical reactions on polycrystalline CVD diamond surfaces, addressing how certain surface modifications will ultimately affect the properties of the material. A review of the structure, bonding, properties and potential of diamond along with an account of the current state of diamond technology and CVD diamond growth is provided. The experimental chapter reviews bulk material and surface analytical techniques employed in this work and is followed by an investigation of cleaning treatments for polycrystalline CVD diamond aimed at removing non-diamond carbon from the surface. Selective acid etch treatments are compared and contrasted for efficacy with excimer laser irradiation and hydrogen plasma etching. The adsorption/desorption kinetics of potential dopant-containing precursors on polycrystalline CVD diamond surfaces have been investigated to compare their effectiveness at introducing dopants into the diamond during the growth stage. Both boron and sulphur-containing precursor compounds have been investigated. Treating polycrystalline CVD diamond in various atmospheres / combination of atmospheres has been performed to enhance electron field emission from the films. Films which do not emit electrons under low field conditions can be modified such that they emit at fields as low as 10 V/μm. The origin of this enhancement

  18. Balancing Environmental Performance with Sales Functionalities in Packaging for Consumer Electronic Products

    NARCIS (Netherlands)

    Wever, R.; Boks, C.; Stevels, A.

    2006-01-01

    Two major changes are currently taking place in the world of Consumer Electronics. They are, first, the relocation of production to low-wage countries, in particularly China. This results in longer distribution distances, which lead to a higher relative importance of this phase in the entire life

  19. The comparison of antimicrobial packaging properties with different applications incorporation method of active material

    Science.gov (United States)

    Anwar, R. W.; Sugiarto; Warsiki, E.

    2018-03-01

    Contamination after the processing of products during storage, distribution and marketing is one of the main causes of food safety issues. Handling of food products after processing can be done during the packaging process. Antimicrobial (AM) active packaging is one of the concept of packaging product development by utilize the interaction between the product and the packaging environment that can delay the bacterial damage by killing or reducing bacterial growth. The active system is formed by incorporating an antimicrobial agent against a packaging matrix that will function as a carrier. Many incorporation methods have been developed in this packaging-making concept which were direct mixing, polishing, and encapsulation. The aims of this research were to examine the different of the AM packaging performances including its stability and effectiveness of its function that would be produced by three different methods. The stability of the packaging function was analyzed by looking at the diffusivity of the active ingredient to the matrix using SEM. The effectiveness was analyzed by the ability of the packaging to prevent the growing of the microbial. The results showed that different incorporation methods resulted on different characteristics of the AM packaging.

  20. Applications of laser printing for organic electronics

    Science.gov (United States)

    Delaporte, Ph.; Ainsebaa, A.; Alloncle, A.-P.; Benetti, M.; Boutopoulos, C.; Cannata, D.; Di Pietrantonio, F.; Dinca, V.; Dinescu, M.; Dutroncy, J.; Eason, R.; Feinaugle, M.; Fernández-Pradas, J.-M.; Grisel, A.; Kaur, K.; Lehmann, U.; Lippert, T.; Loussert, C.; Makrygianni, M.; Manfredonia, I.; Mattle, T.; Morenza, J.-L.; Nagel, M.; Nüesch, F.; Palla-Papavlu, A.; Rapp, L.; Rizvi, N.; Rodio, G.; Sanaur, S.; Serra, P.; Shaw-Stewart, J.; Sones, C. L.; Verona, E.; Zergioti, I.

    2013-03-01

    The development of organic electronic requires a non contact digital printing process. The European funded e-LIFT project investigated the possibility of using the Laser Induced Forward Transfer (LIFT) technique to address this field of applications. This process has been optimized for the deposition of functional organic and inorganic materials in liquid and solid phase, and a set of polymer dynamic release layer (DRL) has been developed to allow a safe transfer of a large range of thin films. Then, some specific applications related to the development of heterogeneous integration in organic electronics have been addressed. We demonstrated the ability of LIFT process to print thin film of organic semiconductor and to realize Organic Thin Film Transistors (OTFT) with mobilities as high as 4 10-2 cm2.V-1.s-1 and Ion/Ioff ratio of 2.8 105. Polymer Light Emitting Diodes (PLED) have been laser printed by transferring in a single step process a stack of thin films, leading to the fabrication of red, blue green PLEDs with luminance ranging from 145 cd.m-2 to 540 cd.m-2. Then, chemical sensors and biosensors have been fabricated by printing polymers and proteins on Surface Acoustic Wave (SAW) devices. The ability of LIFT to transfer several sensing elements on a same device with high resolution allows improving the selectivity of these sensors and biosensors. Gas sensors based on the deposition of semiconducting oxide (SnO2) and biosensors for the detection of herbicides relying on the printing of proteins have also been realized and their performances overcome those of commercial devices. At last, we successfully laser-printed thermoelectric materials and realized microgenerators for energy harvesting applications.

  1. Genome packaging in viruses

    OpenAIRE

    Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

    2010-01-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

  2. New Nanocomposite Materials with Improved Mechanical Strength and Tailored Coefficient of Thermal Expansion for Electro-Packaging Applications

    Directory of Open Access Journals (Sweden)

    Abdollah Saboori

    2017-12-01

    Full Text Available In this research, copper nanocomposites reinforced by graphene nanoplatelets (GNPs were fabricated using a wet mixing method followed by a classical powder metallurgy route. In order to find the best dispersion technique, ball milling and wet mixing were chosen. Qualitative evaluation of the structure of the graphene after mixing indicated that the wet mixing is an appropriate technique to disperse the GNPs. Thereafter, the influence of graphene content on microstructure, density, hardness, elastic modulus, and thermal expansion coefficient of composites was investigated. It was shown that by increasing the graphene content the aggregation of graphene is more obvious and, thus, these agglomerates affect the final properties adversely. In comparison with the unreinforced Cu, Cu–GNP composites were lighter, and their hardness and Young’s modulus were higher as a consequence of graphene addition. According to the microstructural observation of pure copper and its composites after sintering, it was concluded that grain refinement is the main mechanism of strengthening in this research. Apart from the mechanical characteristics, the coefficient of thermal expansion of composites decreased remarkably and the combination of this feature with appropriate mechanical properties can make them a promising candidate for use in electronic packaging applications.

  3. Electron accelerators and applications in Korea

    International Nuclear Information System (INIS)

    Han, Bumsoo

    2006-01-01

    Types of high-energy radiation were discovered more than one hundred years ago. Since then, properties of radiation providing ability to modify physico-chemical properties of materials have found many applications. Radiation technologies applying gamma sources as well as electron accelerators for treatment of materials are well-established processes. Worldwide, there are over 2000 industrial gamma irradiators and 1,300 industrial electron accelerators in operation that are being widely used for sterilization, food irradiation and polymer processing. Indeed, radiation processing is today a well established multi-billion dollar industry world over that is providing unique high value products for mankind in an environmentally friendly manner. Electron accelerators are introduced at late 70s in Korea, firstly for researches and later for insulated wire and cable production, and up to now, over 30 accelerators are used in industries. They are mainly for cable productions, thermo-shrinkable materials, foam sheets, coating and curing and others. While polymerization and polymer modification have proved to be the most widespread applications of radiation processing, many other applications, such as environmental protection is becoming an increasingly important concern in industrialized nations, and wide ranging investigations have identified several areas of waste control to which radiation processing may contribute. In recent years, large metropolitan cities including Seoul, Tokyo and other major cities have been facing the challenge of increasing environmental pollution resulting from ever increasing population and industrial activities. As a result, issues regarding environmental pollution, be it air, liquid or solid, are becoming significant matters of concern. The realization that such pollutants pose a serious threat to human health has necessitated the need for development of cost effective and environmentally friendly technologies to overcome the problem. Radiation

  4. Development and analytical characterization of vitamin(s)-loaded chitosan nanoparticles for potential food packaging applications

    International Nuclear Information System (INIS)

    Aresta, Antonella; Calvano, Cosima Damiana; Trapani, Adriana; Cellamare, Saverio; Zambonin, Carlo Giorgio; De Giglio, Elvira

    2013-01-01

    Most vitamins are well-known natural antioxidant agents which can be usefully employed for foods preservation to increase their shelf life. In the present study, we aimed to investigate the potential of vitamin-based chitosan nanoparticles (CSNPs) for novel food packaging application. In particular, Vitamin C- and/or E-loaded CSNPs were formulated following the ionic gelation technique and using sulfobutylether-β-cyclodextrin as cross-linking agent. The obtained CSNPs were characterized in terms of size and zeta potential measurements, leading to size range of 375–503 nm and zeta range values from +16.0 to +33.8 mV. At the solid-state, the same particles were subjected to X-ray photoelectron spectroscopy, differential scanning calorimetry and Fourier transform infrared spectroscopy. Then, the antioxidant potential of the produced vitamin(s) nanoparticulate formulations has been evaluated through 1,1-diphenyl-2-picrylhydrazyl test, a rapid spectrophotometric assay. The standardized procedure was used on vitamin(s)-modified CSNPs systems to determine both the amount of active vitamin(s) loaded in CSNPs and their release performances by in vitro release studies. Of all, high vitamins association efficiency along with an improvement of their shelf life (also under light exposure up to 7 days) were achieved. Altogether, the results suggest that Vitamin E is available in a hydrophilic delivery system able to replace organic solvents usually used for the solubilization of this antioxidant agent. In conclusion, these nanocarriers represent a promising strategy for the co-administration of Vitamin E and Vitamin C in packaging materials intended for a better storage of hydrophilic and/or lipophilic food.

  5. Development and analytical characterization of vitamin(s)-loaded chitosan nanoparticles for potential food packaging applications

    Energy Technology Data Exchange (ETDEWEB)

    Aresta, Antonella, E-mail: antonellamaria.aresta@uniba.it; Calvano, Cosima Damiana [University of Bari, Department of Chemistry (Italy); Trapani, Adriana; Cellamare, Saverio [University of Bari, Department of Pharmacy-Drug Sciences (Italy); Zambonin, Carlo Giorgio; De Giglio, Elvira [University of Bari, Department of Chemistry (Italy)

    2013-04-15

    Most vitamins are well-known natural antioxidant agents which can be usefully employed for foods preservation to increase their shelf life. In the present study, we aimed to investigate the potential of vitamin-based chitosan nanoparticles (CSNPs) for novel food packaging application. In particular, Vitamin C- and/or E-loaded CSNPs were formulated following the ionic gelation technique and using sulfobutylether-{beta}-cyclodextrin as cross-linking agent. The obtained CSNPs were characterized in terms of size and zeta potential measurements, leading to size range of 375-503 nm and zeta range values from +16.0 to +33.8 mV. At the solid-state, the same particles were subjected to X-ray photoelectron spectroscopy, differential scanning calorimetry and Fourier transform infrared spectroscopy. Then, the antioxidant potential of the produced vitamin(s) nanoparticulate formulations has been evaluated through 1,1-diphenyl-2-picrylhydrazyl test, a rapid spectrophotometric assay. The standardized procedure was used on vitamin(s)-modified CSNPs systems to determine both the amount of active vitamin(s) loaded in CSNPs and their release performances by in vitro release studies. Of all, high vitamins association efficiency along with an improvement of their shelf life (also under light exposure up to 7 days) were achieved. Altogether, the results suggest that Vitamin E is available in a hydrophilic delivery system able to replace organic solvents usually used for the solubilization of this antioxidant agent. In conclusion, these nanocarriers represent a promising strategy for the co-administration of Vitamin E and Vitamin C in packaging materials intended for a better storage of hydrophilic and/or lipophilic food.

  6. Electron holography-basics and applications

    International Nuclear Information System (INIS)

    Lichte, Hannes; Lehmann, Michael

    2008-01-01

    Despite the huge progress achieved recently by means of the corrector for aberrations, allowing now a true atomic resolution of 0.1 nm, hence making it an unrivalled tool for nanoscience, transmission electron microscopy (TEM) suffers from a severe drawback: in a conventional electron micrograph only a poor phase contrast can be achieved, i.e. phase structures are virtually invisible. Therefore, conventional TEM is nearly blind for electric and magnetic fields, which are pure phase objects. Since such fields provoked by the atomic structure, e.g. of semiconductors and ferroelectrics, largely determine the solid state properties, hence the importance for high technology applications, substantial object information is missing. Electron holography in TEM offers the solution: by superposition with a coherent reference wave, a hologram is recorded, from which the image wave can be completely reconstructed by amplitude and phase. Now the object is displayed quantitatively in two separate images: one representing the amplitude, the other the phase. From the phase image, electric and magnetic fields can be determined quantitatively in the range from micrometre down to atomic dimensions by all wave optical methods that one can think of, both in real space and in Fourier space. Electron holography is pure wave optics. Therefore, we discuss the basics of coherence and interference, the implementation into a TEM, the path of rays for recording holograms as well as the limits in lateral and signal resolution. We outline the methods of reconstructing the wave by numerical image processing and procedures for extracting the object properties of interest. Furthermore, we present a broad spectrum of applications both at mesoscopic and atomic dimensions. This paper gives an overview of the state of the art pointing at the needs for further development. It is also meant as encouragement for those who refrain from holography, thinking that it can only be performed by specialists in

  7. Development of active, nanoparticle, antimicrobial technologies for muscle-based packaging applications

    OpenAIRE

    Morris, Michael A.; Padmanabhan, Sibu C.; Cruz-Romero, Malco C.; Cummins, Enda; Kerry, Joseph P.

    2017-01-01

    Fresh and processed muscle-based foods are highly perishable food products and packaging plays a crucial role in providing containment so that the full effect of preservation can be achieved through the provision of shelf-life extension. Conventional packaging materials and systems have served the industry well, however, greater demands are being placed upon industrial packaging formats owing to the movement of muscle-based products to increasingly distant markets, as well as increased custom...

  8. An Analysis of U.S. Business Schools' Catalogs, Application Packages, and Program Materials from an International Perspective.

    Science.gov (United States)

    Webb, Marion S.; Mayer, Kenneth R.; Pioche, Virginie

    1999-01-01

    Catalogs, application packages, and program materials from 106 business schools were analyzed to determine the degree of international coverage in business schools' curricula. Findings indicated a trend to require international functional courses, such as international finance, in the traditional Master in business administration programs and to…

  9. DMAIC Application and Fault Analysis of Metal Packaging in the Canning Industry

    Directory of Open Access Journals (Sweden)

    Rafael Santos de Souza

    2017-11-01

    Full Text Available In the food industry, quality assurance is strongly associated with consumer safety and the risk of compromising the purity of products. Specifically, in the canning industries, rusty, dented or bulging cans may contain bacteria and cause foodborne illness. This article discusses the application of DMAIC and failure analysis to reduce the number of crushed cans in a canning industry. The methodology was of an applied nature, with an exploratory objective, a qualitative and quantitative approach and a case study method used. Through statistical analysis, it was found that the amount of dented packaging in the production process, which comprises the steps of filling, seaming and basketing, was high. The step with the highest number of crushed cans between three stages was seaming. This was followed by the application of FMEA failure analysis related to the use of an automated seaming machine. Finally, an action plan was roposed to solve the problem of cans crushed in the seaming step and the results demonstrate the improvements obtained before the target after 4 months (August-November 2015.

  10. Investigation of metallic, ceramic, and polymeric materials for engineered barrier applications in nuclear-waste packages

    International Nuclear Information System (INIS)

    Westerman, R.E.

    1980-10-01

    An effort to develop licensable engineered barrier systems for the long-term (about 1000 yr) containment of nuclear wastes under conditions of deep continental geologic disposal has been underway at Pacific Northwest Laboratory since January 1979, under the auspices of the High-Level Waste Immobilization Program. In the present work, the barrier system comprises the hard or structural elements of the package: the canister, the overpack(s), and the hole sleeve. A number of candidate metallic, ceramic, and polymeric materials were put through mechanical, corrosion, and leaching screening tests to determine their potential usefulness in barrier-system applications. Materials demonstrating adequate properties in the screening tests will be subjected to more detailed property tests, and, eventually, cost/benefit analyses, to determine their ultimate applicability to barrier-system design concepts. The following materials were investigated: two titanium alloys of Grade 2 and Grade 12; 300 and 400 series stainless steels, Inconels, Hastelloy C-276, titanium, Zircoloy, copper-nickel alloys and cast irons; total of 14 ceramic materials, including two grades of alumina, plus graphite and basalt; and polymers such as polyamide-imide, polyarylene, polyimide, polyolefin, polyphenylene sulfide, polysulfone, fluoropolymer, epoxy, furan, silicone, and ethylene-propylene terpolymer (EPDM) rubber. The most promising candidates for further study and potential use in engineered barrier systems were found to be rubber, filled polyphenylene sulfide, fluoropolymer, and furan derivatives

  11. Effects of health-oriented descriptors on combustible cigarette and electronic cigarette packaging: an experiment among adult smokers in the United States.

    Science.gov (United States)

    Sanders-Jackson, Ashley; Tan, Andy S L; Yie, Kyeungyeun

    2017-10-05

    Certain tobacco companies use health-oriented descriptors (eg, 100% organic) on product packaging and advertising of combustible cigarettes or electronic cigarettes (e-cigarettes) that create a 'health halo' around smoking and vaping. Previous observational research suggests that such language may be associated with more favourable attitudes and reduced risk perceptions toward these brands compared with others. This study aimed to determine the effects of health-oriented descriptors on smokers' attitude toward the brand, perception of packaging information, comparative harm versus other brands and intention to purchase either combustible cigarettes or e-cigarettes. US adult smokers were randomly assigned to view either a health-oriented language package ('100% organic,' 'all natural' or 'no additives'), traditional marketing language package ('fine quality,' 'premium blend' or '100% original') or a no-language package of a combustible cigarette brand (Study 1, n=405) or an e-cigarette brand (Study 2, n=396) in an experimental design. Study 1: Participants in the health-oriented condition reported more favourable perceptions toward the package information, lower comparative harm and higher intention to purchase combustible cigarettes versus the no language control. In addition, participants in the health-oriented condition reported more positive attitude toward the brand and lower comparative harm versus the traditional marketing condition. Study 2: Compared with the traditional marketing condition, participants in the health-oriented condition reported greater intention to purchase Absolute e-cigarettes. There were no significant differences in attitude toward the brand, perception of packaging information and comparative harm versus other brands across conditions. The effect of health-oriented language was significant for combustible cigarettesand e-cigarette packages. Policies to restrict health-oriented language on cigarette and e-cigarette packaging are

  12. The application of electron paramagnetic resonance in biomedical research

    International Nuclear Information System (INIS)

    Qu Ximei; Wang Liqin; Zhang Wenyi; Liu Zhongchao; Cui Songye; Feng Xin; Jiaoling

    2013-01-01

    Electron paramagnetic resonance technique has been found more than half a century, for free radicals detection application, it has been applied to various research studies, and promotes the development of the biomedicine. This article summarized the various free radicals measurement by the electron paramagnetic resonance in biology tissue, and the application of the spin labeling and electron paramagnetic resonance imaging technology in biomedicine. (authors)

  13. Electronic Out-fall Inspection Application - 12007

    Energy Technology Data Exchange (ETDEWEB)

    Weymouth, A Kent III; Pham, Minh; Messick, Chuck [Savannah River Nuclear Solutions, Aiken, South Carolina 29808 (United States)

    2012-07-01

    In early 2009 an exciting opportunity was presented to the Geographic Information Systems (GIS) team at the Savannah River Site (SRS). The SRS maintenance group was directed to maintain all Out-falls on Site, increasing their workload from 75 to 183 out-falls with no additional resources. The existing out-fall inspection system consisted of inspections performed manually and documented via paper trail. The inspections were closed out upon completion of activities and placed in file cabinets with no central location for tracking/trending maintenance activities. A platform for meeting new improvements required for documentation by the Department of Health and Environmental Control (DHEC) out-fall permits was needed to replace this current system that had been in place since the 1980's. This was accomplished by building a geographically aware electronic application that improved reliability of site out-fall maintenance and ensured consistent standards were maintained for environmental excellence and worker efficiency. Inspections are now performed via tablet and uploaded to a central point. Work orders are completed and closed either in the field using tablets (mobile application) or in their offices (via web portal) using PCs. And finally completed work orders are now stored in a central database allowing trending of maintenance activities. (authors)

  14. The Mathematica package TopoID and its application to the Higgs boson production cross section

    Energy Technology Data Exchange (ETDEWEB)

    Hoff, Jens

    2016-07-15

    We present the Mathematica package TopoID which aims at the automation of several steps in multiloop calculations. The algorithm which lies at the very core of the package is described and illustrated with an example. The main features of TopoID are stated and some of them are briefly demonstrated for NLO or NNLO Higgs boson production.

  15. Trends in Food Packaging.

    Science.gov (United States)

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  16. Power electronic converters and systems frontiers and applications

    CERN Document Server

    Trzynadlowski, Andrzej M

    2016-01-01

    Power electronics is a branch of electrical engineering dealing with conversion and control of electric power using semiconductor power switches. This book provides an overview of modern power electronic converters and systems, and their applications.

  17. Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

    International Nuclear Information System (INIS)

    Zhang Guang-Chen; Feng Shi-Wei; Zhou Zhou; Li Jing-Wan; Guo Chun-Sheng

    2011-01-01

    The evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistor (HEMT) by structure function method is proposed in this paper. The evaluation is based on the transient heating measurement of the AlGaN/GaN HEMT by pulsed electrical temperature sensitive parameter method. The extracted chip-level and package-level thermal resistances of the packaged multi-finger AlGaN/GaN HEMT with 400-μm SiC substrate are 22.5 K/W and 7.2 K/W respectively, which provides a non-invasive method to evaluate the chip-level thermal resistance of packaged AlGaN/GaN HEMTs. It is also experimentally proved that the extraction of the chip-level thermal resistance by this proposed method is not influenced by package form of the tested device and temperature boundary condition of measurement stage. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

  18. PLA and two components silicon rubber blends aiming for frozen foods packaging applications

    Directory of Open Access Journals (Sweden)

    Utai Meekum

    2018-03-01

    Full Text Available Designing of PLA and two components silicone rubber blends was studies. Frozen food packaging application is the main ultimate aim. The statistical method using 23 DOE was conducted. The standard testing methods, in particular impact testing at sub-zero temperature, were performed. The preliminary blend formula comprised 1.0 phr of silane and polyester polyols, respectively, was initially resolved. Then, the optimize the silicone portion in the blends was determined. Blending formula using 8.0 phr of silicone with respect to PLA matrix gave rise to the overall satisfactory properties. 3. TETA was used as the silicone curing agent and reactively blended onto the ingredients. TETA at 0.4 phr, with respect to the silicone, enhanced the mechanical properties, especially flexibility and toughness, of the PLA/silicone blend. Exceeding the optimal TETA loading would cause the chain scission and also the dilution effects. Hence, marginal inferior properties of the blends were be experienced. The preliminary biodegradability investigation found that the PLA/silicone blend initially triggered at the second week. Its degradation rate was likely to be faster than neat PLA. Keywords: PLA/silicone blends, Mechanical properties, Sub-zero impact strength

  19. Evaluation of antimicrobial activity of silver nanoparticles for carboxymethylcellulose film applications in food packaging.

    Science.gov (United States)

    Siqueira, Maria C; Coelho, Gustavo F; de Moura, Márcia R; Bresolin, Joana D; Hubinger, Silviane Z; Marconcini, José M; Mattoso, Luiz H C

    2014-07-01

    In this study, silver nanoparticles were prepared and incorporated into carboxymethylcellulose films to evaluate the antimicrobial activity for food packaging applications. The techniques carried out for material characterization were: infrared spectroscopy and thermal analysis for the silver nanoparticles and films, as well as particle size distribution for the nanoparticles and water vapor permeability for the films. The antimicrobial activity of silver nanoparticles prepared by casting method was investigated. The minimum inhibitory concentration (MIC) value of the silver nanoparticles to test Gram-positive (Enterococcus faecalis) and Gram-negative (Escherichia coli) microorganisms was carried out by the serial dilution technique, tested in triplicate to confirm the concentration used. The results were developed using the Mcfarland scale which indicates that the presence or absence of turbidity tube demonstrates the inhibition of bacteria in relation to the substance inoculated. It was found that the silver nanoparticles inhibited the growth of the tested microorganisms. The carboxymethylcellulose film embedded with silver nanoparticles showed the best antimicrobial effect against Gram-positive (E. faecalis) and Gram-negative (E. coli) bacteria (0.1 microg cm(-3)).

  20. PLA and single component silicone rubber blends for sub-zero temperature blown film packaging applications

    Science.gov (United States)

    Meekum, Utai; Khiansanoi, Apichart

    2018-06-01

    The poly(lactic acid) (PLA) blend with single component silicone rubber in the presence of reactive amino silane coupling agent and polyester polyols plasticizer were studied. The manufacturing of film packaging for sub-zero temperature applications from the PLA blend was the main objective. The mechanical properties, especially the impact strengths, of PLA/silicone blends were significantly depended on the silicone loading. The outstanding impact strengths, tested at sub-zero temperature, of the blend having silicone content of 8.0 phr was achieved. It was chosen as the best candidate for the processability improvement. Adding the talc filler into the PLA/silicone blend to enhance the rheological properties was investigated. The ductility of the talc filled blends were decreased with increasing the filler contents. However, the shear viscosity of the blend was raised with talc loading. The blend loaded with 40 phr of talc filler was justified as the optimal formula for the blown film process testing and it was successfully performed with a few difficulties. The obtained blown film showed relative good flexibility in comparison with LDPE but it has low transparency.

  1. PLA and two components silicon rubber blends aiming for frozen foods packaging applications

    Science.gov (United States)

    Meekum, Utai; Khiansanoi, Apichart

    2018-03-01

    Designing of PLA and two components silicone rubber blends was studies. Frozen food packaging application is the main ultimate aim. The statistical method using 23 DOE was conducted. The standard testing methods, in particular impact testing at sub-zero temperature, were performed. The preliminary blend formula comprised 1.0 phr of silane and polyester polyols, respectively, was initially resolved. Then, the optimize the silicone portion in the blends was determined. Blending formula using 8.0 phr of silicone with respect to PLA matrix gave rise to the overall satisfactory properties. 3. TETA was used as the silicone curing agent and reactively blended onto the ingredients. TETA at 0.4 phr, with respect to the silicone, enhanced the mechanical properties, especially flexibility and toughness, of the PLA/silicone blend. Exceeding the optimal TETA loading would cause the chain scission and also the dilution effects. Hence, marginal inferior properties of the blends were be experienced. The preliminary biodegradability investigation found that the PLA/silicone blend initially triggered at the second week. Its degradation rate was likely to be faster than neat PLA.

  2. Industrial application of electron sources with plasma emitters

    CERN Document Server

    Belyuk, S I; Rempe, N G

    2001-01-01

    Paper contains a description, operation, design and parameters of electron sources with plasma emitters. One presents examples of application of these sources as part of automated electron-beam welding lines. Paper describes application of such sources for electron-beam deposition of composite powders. Electron-beam deposition is used to rebuild worn out part and to increase strength of new parts of machines and tools. Paper presents some examples of rebuilding part and the advantages gained in this case

  3. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  4. Renewable fibers and bio-based materials for packaging applications - A review of recent developments

    DEFF Research Database (Denmark)

    Johansson, Caisa; Bras, Julien; Mondragon, Inaki

    2012-01-01

    This review describes the state-of-the-art of material derived from the forest sector with respect to its potential for use in the packaging industry. Some innovative approaches are highlighted. The aim is to cover recent developments and key challenges for successful introduction of renewable...... materials in the packaging market. The covered subjects are renewable fibers and bio-based polymers for use in bioplastics or as coatings for paper-based packaging materials. Current market sizes and forecasts are also presented. Competitive mechanical, thermal, and barrier properties along with material...

  5. SS-Wrapper: a package of wrapper applications for similarity searches on Linux clusters

    Directory of Open Access Journals (Sweden)

    Lefkowitz Elliot J

    2004-10-01

    Full Text Available Abstract Background Large-scale sequence comparison is a powerful tool for biological inference in modern molecular biology. Comparing new sequences to those in annotated databases is a useful source of functional and structural information about these sequences. Using software such as the basic local alignment search tool (BLAST or HMMPFAM to identify statistically significant matches between newly sequenced segments of genetic material and those in databases is an important task for most molecular biologists. Searching algorithms are intrinsically slow and data-intensive, especially in light of the rapid growth of biological sequence databases due to the emergence of high throughput DNA sequencing techniques. Thus, traditional bioinformatics tools are impractical on PCs and even on dedicated UNIX servers. To take advantage of larger databases and more reliable methods, high performance computation becomes necessary. Results We describe the implementation of SS-Wrapper (Similarity Search Wrapper, a package of wrapper applications that can parallelize similarity search applications on a Linux cluster. Our wrapper utilizes a query segmentation-search (QS-search approach to parallelize sequence database search applications. It takes into consideration load balancing between each node on the cluster to maximize resource usage. QS-search is designed to wrap many different search tools, such as BLAST and HMMPFAM using the same interface. This implementation does not alter the original program, so newly obtained programs and program updates should be accommodated easily. Benchmark experiments using QS-search to optimize BLAST and HMMPFAM showed that QS-search accelerated the performance of these programs almost linearly in proportion to the number of CPUs used. We have also implemented a wrapper that utilizes a database segmentation approach (DS-BLAST that provides a complementary solution for BLAST searches when the database is too large to fit into

  6. SS-Wrapper: a package of wrapper applications for similarity searches on Linux clusters.

    Science.gov (United States)

    Wang, Chunlin; Lefkowitz, Elliot J

    2004-10-28

    Large-scale sequence comparison is a powerful tool for biological inference in modern molecular biology. Comparing new sequences to those in annotated databases is a useful source of functional and structural information about these sequences. Using software such as the basic local alignment search tool (BLAST) or HMMPFAM to identify statistically significant matches between newly sequenced segments of genetic material and those in databases is an important task for most molecular biologists. Searching algorithms are intrinsically slow and data-intensive, especially in light of the rapid growth of biological sequence databases due to the emergence of high throughput DNA sequencing techniques. Thus, traditional bioinformatics tools are impractical on PCs and even on dedicated UNIX servers. To take advantage of larger databases and more reliable methods, high performance computation becomes necessary. We describe the implementation of SS-Wrapper (Similarity Search Wrapper), a package of wrapper applications that can parallelize similarity search applications on a Linux cluster. Our wrapper utilizes a query segmentation-search (QS-search) approach to parallelize sequence database search applications. It takes into consideration load balancing between each node on the cluster to maximize resource usage. QS-search is designed to wrap many different search tools, such as BLAST and HMMPFAM using the same interface. This implementation does not alter the original program, so newly obtained programs and program updates should be accommodated easily. Benchmark experiments using QS-search to optimize BLAST and HMMPFAM showed that QS-search accelerated the performance of these programs almost linearly in proportion to the number of CPUs used. We have also implemented a wrapper that utilizes a database segmentation approach (DS-BLAST) that provides a complementary solution for BLAST searches when the database is too large to fit into the memory of a single node. Used together

  7. Thermoelectric cooler application in electronic cooling

    International Nuclear Information System (INIS)

    Chein Reiyu; Huang Guanming

    2004-01-01

    This study addresses thermoelectric cooler (TEC) applications in the electronic cooling. The cold side temperature (T c ) and temperature difference between TEC cold and hot sides (ΔT=T h -T c , T h =temperature of hot side of TEC) were used as the parameters. The cooling capacity, junction temperature, coefficient of performance (COP) of TEC and the required heat sink thermal resistance at the TEC hot side were computed. The results indicated that the cooling capacity could be increased as T c increased and ΔT was reduced. The maximum cooling capacity and chip junction temperature obtained were 207 W and 88 deg. C, respectively. The required heat sink thermal resistance on TEC hot side was 0.054 deg. C/W. Larger cooling capacity and higher COP could be obtained when the TEC was operated in the enforced regimes (ΔT c values and heat sink thermal resistance at the TEC hot side. A microchannel heat sink using water or air as the coolant was demonstrated to meet the low thermal heat sink resistance requirement for TEC operated at maximum cooling capacity conditions

  8. Application of systems engineering to determine performance requirements for repository waste packages

    International Nuclear Information System (INIS)

    Aitken, E.A.; Stimmell, G.L.

    1987-01-01

    The waste package for a nuclear waste repository in salt must contribute substantially to the performance objectives defined by the Salt Repository Project (SRP) general requirements document governing disposal of high-level waste. The waste package is one of the engineered barriers providing containment. In establishing the performance requirements for a project focused on design and fabrication of the waste package, the systems engineering methodology has been used to translate the hierarchy requirements for the repository system to specific performance requirements for design and fabrication of the waste package, a subsystem of the repository. This activity is ongoing and requires a methodology that provides traceability and is capable of iteration as baseline requirements are refined or changed. The purpose of this summary is to describe the methodology being used and the way it can be applied to similar activities in the nuclear industry

  9. Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications

    KAUST Repository

    Shaikh, Sohail F.; Ghoneim, Mohamed T.; Sevilla, Galo T.; Nassar, Joanna M.; Hussain, Aftab M.; Hussain, Muhammad Mustafa

    2017-01-01

    of flexibility and stretchability in electronics for emerging Internet of Everything application can unleash smart application horizon in unexplored areas, such as robotics, healthcare, smart cities, transport, and entertainment systems. While flexible

  10. Application of Poly(hydroxyalkanoate) In Food Packaging: Improvements by Nanotechnology

    OpenAIRE

    Khosravi-Darani, K.; Bucci, D. Z.

    2015-01-01

    The environmental impact of plastic usage is of critical concern and too great to repair. A shift toward biodegradable food packaging is one option. The aim of this review paper is the study of the potential of biodegradable materials for food packaging. The main characteristics in relation to food usage can be narrowed down to mass transfer (gas and water vapor), thermal and mechanical properties. Among several kinds of biodegradable polymers, poly(hydroxyalkanoate) is one of the favorable c...

  11. Strategy and Software Application of Fresh Produce Package Design to Attain Optimal Modified Atmosphere

    Directory of Open Access Journals (Sweden)

    Dong Sun Lee

    2014-01-01

    Full Text Available Modified atmosphere packaging of fresh produce relies on the attainment of desired gas concentration inside the package resulting from product respiration and package’s gas transfer. Systematic package design method to achieve the target modified atmosphere was developed and constructed as software in terms of selecting the most appropriate film, microperforations, and/or CO2 scavenger. It incorporates modeling and/or database construction on the produce respiration, gas transfer across the plastic film and microperforation, and CO2 absorption by the scavenger. The optimization algorithm first selects the packaging film and/or microperforations to have the target O2 concentration in response to the respiration and then tunes the CO2 concentration by CO2 absorber when it goes above its tolerance limit. The optimization method tested for green pepper, strawberry, and king oyster mushroom packages was shown to be effective to design the package and the results obtained were consistent with literature work and experimental atmosphere.

  12. System on Package (SoP) Millimeter Wave Filters for 5G Applications

    KAUST Repository

    Showail, Jameel

    2018-05-01

    Bandpass filters are an essential component of wireless communication systems that only transmits frequencies corresponding to the communication band and rejects all other frequencies. As the deployment of 5G draws nearer, first deployments are expected in 2020 [1], the need for viable filters at the new frequency bands becomes more imminent. Size and performance are two critical considerations for a filter that will be used in emerging mobile communication applications. The high frequency of 5G communication, 28 GHz as opposed to sub 6 GHz for nearly all previous communication protocols, means that previously utilized lumped component based solutions cannot be implemented since they are ill-suited for mm-wave applications. The focus of this work is the miniaturization of a high-performance filter. The Substrate Integrated Waveguide (SIW) is a high performance and promising structure and Low Temperature Co-Fired Ceramic (LTCC) is a high-performance material that both can operate at higher frequencies than the technologies used for previous telecommunication generations. To miniaturize the structure, a compact folded four-cavity SIW filter is designed, implemented and tested. The feeding structure is integrated into the filter to exploit the System on Package (SoP) attributes of LTCC and further reduce the total area of the filter individually and holistically when looking at the final integrated system. Two unique three dimensional (3D) integrated SoP LTCC two-stage SIW single cavity filters and one unique four-cavity filter all with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The better single cavity design provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB. The fabricated four-cavity filter has a 3-dB bandwidth of .98GHz centered at 27.465 GHz, and with an insertion loss of -2.66 dB. The designs presented

  13. Effect of PPG-PEG-PPG on the tocopherol-controlled release from films intended for food-packaging applications.

    Science.gov (United States)

    Castro López, María del Mar; Dopico García, Sonia; Ares Pernas, Ana; López Vilariño, José Manuel; González Rodríguez, María Victoria

    2012-08-22

    The feasibility of novel controlled release systems for the delivery of active substances from films intended for food packaging was investigated. Because polyolefins are used highly for food-packaging applications, the reported high retention degree of antioxidants has limited their use for active packaging. Thus, in this study, PP films modified with different chain extenders have been developed to favor and control the release rates of the low molecular weight antioxidant tocopherol. The use of different chain extenders as polymer modifiers (PE-PEG M(w), 575; and PPG-PEG-PPG M(w), 2000) has caused significant changes in tocopherol-specific release properties. High-performance liquid chromatography coupled to PDA-FL and PDA-MS was used to test tocopherol and chain extender migration, respectively. The release of tocopherol from the prepared films with two chain extenders into two food simulants was studied. Different temperatures and storage times were also tested. Varying the structural features of the films with the incorporation of different levels of PPG-PEG-PPG, the release of tocopherol (food-packaging additive) into different ethanolic simulants could be clearly controlled. The effect of the temperature and storage time on the release of the antioxidant has been outstanding as their values increased. The migration of the chain extender, also tested, was well below the limits set by European legislation.

  14. Synthesis of knowledge on the long-term behaviour of concretes. Applications to cemented waste packages

    International Nuclear Information System (INIS)

    Richet, C.; Galle, C.; Le Bescop, P.; Peycelon, H.; Bejaoui, S.; Tovena, I.; Pointeau, I.; L'Hostis, V.; Levera, P.

    2004-03-01

    As stipulated in the former law of December 91 relating to 'concrete waste package', a progress report (phenomenological reference document) was first provided in 1999. The objective was to make an assessment of the knowledge acquired on the long-term behaviour of cement-based waste packages in the context of deep disposal and/or interim storage. The present document is an updated summary report. It takes into account a new knowledge assessment, considers coupled mechanisms and should contribute to the first performance studies (operational calculations). Handling and radio-nuclides (RN) confinement are the two major functional properties requested from the concrete used for the waste packages. In unsaturated environment (interim storage/disposal prior to closing), the main problem is the generation of cracks in the material. This aspect is a key parameter from the mechanical point of view (retrievability). It can have a major impact on the disposal phase (confinement). In saturated environment (disposal post-closing phase), the main concern is the chemical degradation of the waste package concrete submitted to underground waters leaching. In this context, the major thema are: the durability of the concretes under water (chemical degradation) and in unsaturated medium (corrosion of reinforcement), matter transport, RN retention, chemistry / transport / mechanical couplings. On the other hand, laboratory data on the behaviour of concretes are used to evaluate the RN source term of waste packages in function of time (concrete waste package OPerational Model, i.e. 'Concrete MOP'). The 'MOP' provides the physico-chemical description of the RN release in relationship with the waste package degradation itself. This description is based on simplified phenomenology for which only dimensioning mechanisms are taken into account. The use of Diffu-Ca code (basic module for the MOP) on the CASTEM numerical plate-form, already allows operational predictions. (authors)

  15. Application of principal component and factor analyses in electron spectroscopy

    International Nuclear Information System (INIS)

    Siuda, R.; Balcerowska, G.

    1998-01-01

    Fundamentals of two methods, taken from multivariate analysis and known as principal component analysis (PCA) and factor analysis (FA), are presented. Both methods are well known in chemometrics. Since 1979, when application of the methods to electron spectroscopy was reported for the first time, they became to be more and more popular in different branches of electron spectroscopy. The paper presents examples of standard applications of the method of Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and electron energy loss spectroscopy (EELS). Advantages one can take from application of the methods, their potentialities as well as their limitations are pointed out. (author)

  16. Edible packaging materials.

    Science.gov (United States)

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  17. Hexavalent Chrome Free Coatings for Electronics Applications: Joint Test Report

    Science.gov (United States)

    Rothgeb, Matt; Kessel, Kurt

    2013-01-01

    The overall objective of the Hexavalent Chrome Free Coatings for Electronics Applications project is to evaluate and test pretreatments not containing hexavalent chrome in avionics and electronics housing applications. This objective will be accomplished by testing strong performing coating systems from prior NASA and DoD testing or new coating systems as determined by the stakeholders.

  18. Advances in Electronic Commerce, Web Application and Communication v.1

    CERN Document Server

    Lin, Sally; Second International Conference on Electronic Commerce, Web Application and Communication (ECWAC 2012)

    2012-01-01

    ECWAC2012 is an integrated conference devoted to Electronic Commerce, Web Application and Communication. In the this proceedings you can find the carefully reviewed scientific outcome of the second International Conference on Electronic Commerce, Web Application and Communication (ECWAC 2012) held at March 17-18,2012  in Wuhan, China, bringing together researchers from all around the world in the field.

  19. CERN's web application updates for electron and laser beam technologies

    CERN Document Server

    Sigas, Christos

    2017-01-01

    This report describes the modifications at CERN's web application for electron and laser beam technologies. There are updates at both the front and the back end of the application. New electron and laser machines were added and also old machines were updated. There is also a new feature for printing needed information.

  20. Applications and advances in electronic-nose technologies

    Science.gov (United States)

    A. D. Wilson; M. Baietto

    2009-01-01

    Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software...

  1. Advances in Electronic Commerce, Web Application and Communication v.2

    CERN Document Server

    Lin, Sally; Second International Conference on Electronic Commerce, Web Application and Communication (ECWAC 2012)

    2012-01-01

    ECWAC2012 is an integrated conference devoted to Electronic Commerce, Web Application and Communication. In the this proceedings you can find the carefully reviewed scientific outcome of the second International Conference on Electronic Commerce, Web Application and Communication (ECWAC 2012) held at March 17-18,2012  in Wuhan, China, bringing together researchers from all around the world in the field.

  2. AN APPLICATION OF ELECTRONIC AMPLIFIER STETHOSCOPE

    Directory of Open Access Journals (Sweden)

    Alper KAÇAR

    2014-05-01

    Full Text Available Electronic stethoscopes are one of the important medical devices which affects the self-diagnostic or remote diagnostic in medical area. Rather the general stethoscopes, electronic ones increases the sound amplitude and quality. By filtering ambient noise, they can be used for advance analysis of heart or lung related diseases.

  3. Polycystalline silicon thin films for electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Jaeger, Christian Claus

    2012-01-15

    with an activation energy of E{sub A}{sup poly-Si}=1.1 eV. By long-lasting tempering or a short high-temperature step finally the stable layer configuration substrate/Al+Si islands(hillocks)/poly-Si can be reached (E{sub A}{sup hillocks}=2.4 eV). The further main topic of this thesis is the study of the applicability of the poly-silicon layers fabricated by means of the ALILE and R-ALILE process for electronic applications. First thin-film transistors were studied. Additionally thin-film solar cells with microcrystalline silicon as absorber material on polycrystalline R-ALILE seed layers were fabricated. Finally the suitedness of the fabricated poly-silicon layers for crytographic applications were studied.

  4. Workshop on scientific and industrial applications of free electron lasers

    International Nuclear Information System (INIS)

    Difilippo, F.C.; Perez, R.B.

    1990-05-01

    A Workshop on Scientific and Industrial Applications of Free Electron Lasers was organized to address potential uses of a Free Electron Laser in the infrared wavelength region. A total of 13 speakers from national laboratories, universities, and the industry gave seminars to an average audience of 30 persons during June 12 and 13, 1989. The areas covered were: Free Electron Laser Technology, Chemistry and Surface Science, Atomic and Molecular Physics, Condensed Matter, and Biomedical Applications, Optical Damage, and Optoelectronics

  5. Evaluation of the effects of electron-beam irradiation on the puncture resistance by Lasioderma serricorne in flexible packaging of granola

    International Nuclear Information System (INIS)

    Oliveira, Vitor M.; Alves, Juliana N.; Nogueira, Beatriz R.; Moura, Esperidiana A.B.; Ortiz, Angel V.; Potenza, Marcos R.

    2009-01-01

    Lasioderma serricorne is a beetle that infests stored and industrialized dry foods such as cereal bars, granola, flour and pasta, amongst others, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by L. serricorne in BOPP/PP structure, used commercially as granola packaging after electron-beam irradiation. The irradiations were performed using a 1.5 MeV electron beam accelerator, dose rate of 11.22 kGy/s, at room temperature in presence of air, doses up to 120 kGy. After irradiation the BOPP/PP samples were subjected to tests of puncture resistance by L. serricorne, tensile strength, friction coefficient, penetration and seal strength. Results showed decreases in the original mechanical properties of the structure according to the radiation doses applied and effective resistance against punctures by L. serricorne (p<0.05). The results indicate that the irradiated and non-irradiated BOPP/PP structure, in the conditions studied in this work, is resistant against L. serricorne, however the decreases observed in the mechanical properties of the irradiated structure may turn it inappropriate for packaging granola. (author)

  6. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

    International Nuclear Information System (INIS)

    Murray, Kieran A.; Kennedy, James E.; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L.

    2014-01-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance

  7. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends

    Energy Technology Data Exchange (ETDEWEB)

    Murray, Kieran A., E-mail: kmurray@research.ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); Kennedy, James E., E-mail: jkennedy@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland); McEvoy, Brian, E-mail: Brian.Mcevoy@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Vrain, Olivier, E-mail: Olivier.Vrain@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Ryan, Damien, E-mail: Damien.Ryan@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Cowman, Richard, E-mail: Richard.Cowman@synergyhealthplc.com [Synergy Health, IDA Business and Technology Park, Sragh, Tullamore, Co. Offaly (Ireland); Higginbotham, Clement L., E-mail: chigginbotham@ait.ie [Materials Research Institute, Athlone Institute of Technology, Dublin Road, Athlone, Co. Westmeath (Ireland)

    2014-06-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. - Highlights: • PEBA was melt blended with Irganox 565 and Tinuvin 783. • All virgin and blended PEBA samples were exposed to electron beam irradiation. • Virgin and blended PEBA was exposed to different temperatures during irradiation. • Non-vacuum and vacuum packed PEBA samples were compared following irradiation. • Virgin PEBA with non-vacuum packaging in dry ice improved the radiation resistance.

  8. 5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

    KAUST Repository

    Shamim, Atif

    2012-01-01

    A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator\\'s inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.

  9. An open-source software package for multivariate modeling and clustering: applications to air quality management.

    Science.gov (United States)

    Wang, Xiuquan; Huang, Guohe; Zhao, Shan; Guo, Junhong

    2015-09-01

    This paper presents an open-source software package, rSCA, which is developed based upon a stepwise cluster analysis method and serves as a statistical tool for modeling the relationships between multiple dependent and independent variables. The rSCA package is efficient in dealing with both continuous and discrete variables, as well as nonlinear relationships between the variables. It divides the sample sets of dependent variables into different subsets (or subclusters) through a series of cutting and merging operations based upon the theory of multivariate analysis of variance (MANOVA). The modeling results are given by a cluster tree, which includes both intermediate and leaf subclusters as well as the flow paths from the root of the tree to each leaf subcluster specified by a series of cutting and merging actions. The rSCA package is a handy and easy-to-use tool and is freely available at http://cran.r-project.org/package=rSCA . By applying the developed package to air quality management in an urban environment, we demonstrate its effectiveness in dealing with the complicated relationships among multiple variables in real-world problems.

  10. 5GHz LTCC-based aperture coupled wireless transmitter for system-on-package applications

    KAUST Repository

    Shamim, Atif; Arsalan, Muhammad; Hojjat, Nasrin; Roy, Langis

    2012-01-01

    A novel System-on-Package (SoP) implementation is presented for a transmitter (TX) module which makes use of electromagnetic coupling between the TX chip and the package antenna. The TX chip is realized in 0.13μm CMOS process and comprises an on-chip antenna, which serves as the oscillator's inductor as well. The TX chip is housed in a Low Temperature Co-fired Ceramic (LTCC) package with a patch antenna. The on-chip antenna feeds the LTCC patch antenna through aperture coupling, thus negating the need for RF buffer amplifiers, matching elements, baluns, bond wires and package transmission lines. This is the first ever demonstration of wireless-interconnect between on-chip and package antennas which increases the gain and range of the TX module manyfold with respect to the on-chip antenna alone. Though the range of the TX SoP increases considerably, power consumption remains the same as that of the TX chip only. A simple analytical model for the new wireless-interconnect has been developed which helps determine the optimum position of the chip with respect to the aperture in the ground plane.

  11. Survey of potential electronic applications of high temperature superconductors

    International Nuclear Information System (INIS)

    Hammond, R.B.; Bourne, L.C.

    1991-01-01

    In this paper the authors present a survey of the potential electronic applications of high temperature superconductor (HTSC) thin films. During the past four years there has been substantial speculation on this topic. The authors will cover only a small fraction of the potential electronic applications that have been identified. Their treatment is influenced by the developments over the past few years in materials and device development and in market analysis. They present their view of the most promising potential applications. Superconductors have two important properties that make them attractive for electronic applications. These are (a) low surface resistance at high frequencies, and (b) the Josephson effect

  12. Printed Dielectric Mirrors and their Application in Organic Electronics

    OpenAIRE

    Bronnbauer, Carina

    2017-01-01

    Organic electronics are one of the future technologies of these days. It offers many advantages in comparison to heavy metal based inorganic electronics. For example, organic electronics are available in various colors, are often semitransparent, they can be fully solution processed and thus allow printing on top of rigid as well as on flexible substrates. All these characteristics enable a complete new area of applications for electronics. For example, the integration of semitransparent phot...

  13. Technology and application of two sets of industrial electron accelerators

    International Nuclear Information System (INIS)

    Hua Degen

    2000-01-01

    The radiation industry in China Academy of Engineering Physics (CAEP) has had a big scale, and the two sets of industrial electron accelerators play important roles. The Electron Processing System (E.P.S), which was introduced in 1987, is a powerful electron accelerator. And the 10 MeV Accelerator, which is a traveling wave linear electron accelerator, has the higher electron energy. Both of the stes are equipped the driving devices under the beam, and has made a considerable economic results. This article describes the technology and application of the two electron accelerators. (author)

  14. Application of Digital Image Correlation to Measurement of Packaging Material Mechanical Properties

    Directory of Open Access Journals (Sweden)

    Jian-Wei Zhou

    2013-01-01

    Full Text Available Among various packaging materials, papers and polymer plastics are the most common due to their light weights, low costs, and other advantages. However, their mechanical properties are difficult to measure precisely because of their softness. To overcome the difficulty, a new measure instrument prototype is proposed based on an optical method known as the digital image correlation (DIC. Experiments are designed to apply the DIC to measure mechanical properties of flexible packaging materials, including the stress-strain relationship, the Poisson ratio, the coefficient of heat expansion, the creep deformation, and the top-pressure deformation of corrugated box. In addition, the low frequency vibration of package is simulated, and the vibration frequencies are measured by DIC. Results obtained in the experiments illustrate the advantages of the DIC over traditional methods: noncontact, no reinforced effect, high precision over entire area, wide measurement range, and good measurement stability.

  15. Application of in silico modelling to estimate toxicity of migrating substances from food packaging.

    Science.gov (United States)

    Price, Nicholas; Chaudhry, Qasim

    2014-09-01

    This study derived toxicity estimates for a set of 136 chemical migrants from food packaging materials using in silico (computational) modelling and read across approaches. Where available, the predicted results for mutagenicity and carcinogenicity were compared with published experimental data. As the packaging compounds are subject to safety assessment, the migrating substances were more likely to be negative for both the endpoints. A set of structural analogues with positive experimental data for carcinogenicity and/or mutagenicity was therefore used as a positive comparator. The results showed that a weight of evidence assembled from different in silico models and read-across from already-tested structurally similar compounds can provide a rapid and reliable means for rapid screening of new yet-untested intentional or unintentional chemical compounds that may migrate to packaged foodstuffs. Crown Copyright © 2014. Published by Elsevier Ltd. All rights reserved.

  16. Applications and technology of electron beam accelerators

    International Nuclear Information System (INIS)

    Sethi, R.C.

    2005-01-01

    Traditionally, accelerators have been employed for pursuing research in basic sciences. But over the last couple of decades their uses have proliferated into the applied fields as well. The major credit for which goes to the electron beams. Electron beams or the radiations generated by them are being extensively used in almost all the applied areas. This article is a brief account of the impact made by the accelerator based electron beams and the attempts initiated by DAE for building a base in this technology. (author)

  17. Application of the ASME code in designing containment vessels for packages used to transport radioactive materials

    International Nuclear Information System (INIS)

    Raske, D.T.; Wang, Z.

    1992-01-01

    The primary concern governing the design of shipping packages containing radioactive materials is public safety during transport. When these shipments are within the regulatory jurisdiction of the US Department of Energy, the recommended design criterion for the primary containment vessel is either Section III or Section VIII, Division 1, of the ASME Boiler and Pressure Vessel Code, depending on the activity of the contents. The objective of this paper is to discuss the design of a prototypic containment vessel representative of a packaging for the transport of high-level radioactive material

  18. Inkjet and screen printing for electronic applications

    OpenAIRE

    Medina Rodríguez, Beatriz

    2016-01-01

    Printed electronics (PE) is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. Electrically functional, electronic or optical inks are deposited on the substrate, creating active or passive devices. PE offers a great advantage when compared to traditional processes or microelectronics du...

  19. Freeform Compliant CMOS Electronic Systems for Internet of Everything Applications

    KAUST Repository

    Shaikh, Sohail F.

    2017-01-17

    The state-of-the-art electronics technology has been an integral part of modern advances. The prevalent rise of the mobile device and computational technology in the age of information technology offers exciting applications that are attributed to sophisticated, enormously reliable, and most mature CMOS-based electronics. We are accustomed to high performance, cost-effective, multifunctional, and energy-efficient scaled electronics. However, they are rigid, bulky, and brittle. The convolution of flexibility and stretchability in electronics for emerging Internet of Everything application can unleash smart application horizon in unexplored areas, such as robotics, healthcare, smart cities, transport, and entertainment systems. While flexible and stretchable device themes are being remarkably chased, the realization of the fully compliant electronic system is unaddressed. Integration of data processing, storage, communication, and energy management devices complements a compliant system. Here, a comprehensive review is presented on necessity and design criteria for freeform (physically flexible and stretchable) compliant high-performance CMOS electronic systems.

  20. Some thermo-electromagnetic applications to fusion technology of a general purpose CAD package

    International Nuclear Information System (INIS)

    Girdinio, P.; Molfino, P.; Molinari, G.; Raia, G.; Rosatelli, F.; Viviani, A.

    1985-01-01

    A general purpose CAD package is applied to the solution of problems related to fusion technology. The problems solved are the interacting electromagnetic and thermal fields in a resistive toroidal coil and the design of the poloidal field coils in Tokamak machines. In both cases, the procedure used is reported and the results obtained are displayed and discussed

  1. Some thermo-electromagnetic applications to fusion technology of a general purpose CAD package

    International Nuclear Information System (INIS)

    Girdinio, P.; Molfino, P.; Molinari, G.; Viviani, A.; Raia, G.; Rosatelli, F.

    1984-01-01

    A general purpose CAD package is applied to the solution of problems related to fusion technology. The problems solved are the interacting electromagnetic and thermal fields in a resistive toroidal coil and the design of the poloidal field coils in Tokamak machines. In both cases, the procedure used is reported and the results obtained are displayed and discussed. (author)

  2. Application of chitosan as biomaterial for active packaging of ethylene absorber

    Science.gov (United States)

    Warsiki, E.

    2018-03-01

    Chitosan was used for active packaging of ethylene absorber that can change the head space of food packaging to extend the shelf life. The purpose of this study was to develop active packaging from chitosan and KMnO4 and apply the active film to package tomatoes. Active film was prepared by mixing chitosan 6 g, 140 mL of acetic acid 1%, 60 mL of aquadest, 2 mL sorbitol, and KMnO4 with concentration of 3 g, 5 g, and 7 g. After 5 days of storage, the film used to wrap the tomatoes was sweated. The best formulation to absorb the ethylene was made from 7 g of KMnO4 since it could inhibit tomatoes from shortly ripening compared to other formulations. The fruits were packed at room temperature had a high hardness as much as 17,79 mm/50mg/5s compared to the control of 3,47 mm/50mg/5s, while at the refrigerator, the tomato had lower hardness value of the 2,72 mm/50mg/5s compared to the control of 4,29 mm/50mg/5s. Addition of KMnO4 on the film could maintain the value °Hue either for all treated sample and control in the range of the yellow to red.

  3. 3D printed System-on-Package (SoP) for environmental sensing and localization applications

    KAUST Repository

    Zhen, Su; Bilal, Rana Muhammad; Shamim, Atif

    2017-01-01

    This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor

  4. An absorbent for an application to a package for a liquid radioactive isotope for medical usage

    International Nuclear Information System (INIS)

    Bang, K.S.; Lim, S.P.; Lee, J.C.; Seo, K.S.; Han, H.S.

    2004-01-01

    A radioactive isotope has to be safely transport from the producing center to the consuming center. The shipping package to safely transport the radioactive isotope should be able to withstand the prescribed conditions by law. In the field of nuclear medicine, the radioactive isotope is used in a liquid or capsule form. A Type A package, which is to transport liquid radioactive materials, shall be provided with a containment system composed of primary inner and secondary outer containment components or shall be provided with sufficient absorbent material to absorb twice the volume of the liquid contents. Hospitals prefer to use not only convenient but also re-usable packages. To apply an absorbent material to the Type A package, that is to transport liquid radioactive isotope, the free absorbency of the absorbents was estimated. In the case of a liquid with NaOH 0.4%, the free absorbency of the melanine form was the most superior at 91 g/g. In the case of a liquid with Na 0.9%, the free absorbency of the melanine form was the most excellent at 88 g/g also

  5. 77 FR 25787 - Low Income Taxpayer Clinic Grant Program; Availability of 2013 Grant Application Package

    Science.gov (United States)

    2012-05-01

    ... DEPARTMENT OF THE TREASURY Internal Revenue Service Low Income Taxpayer Clinic Grant Program... Package and Guidelines (Publication 3319) for organizations interested in applying for a Low Income... nominal fee to low income taxpayers involved in tax controversies with the IRS, or inform individuals for...

  6. Application of geometry correction factors for low-level waste package dose measurements. Revision 1

    International Nuclear Information System (INIS)

    Chandler, M.C.; Parish, B.

    1995-01-01

    Plans are to determine the Cs-137 content of low-level waste packages generated in High-Level Waste by measuring the radiation level at a specified distance from the package with a hand-held radiation instrument. The measurement taken at this specified distance, either 3 or 5 feet, is called the far-field measurement. This report documents a method for adjusting the gamma exposure rate (mR/hr) reading used in dose-to-curie determinations when the far-field measurement equals the background reading. This adjustment is necessary to reduce the conservatism resulting from using a minimum detection limit exposure rate for the dose-to-curie determination for the far-field measurement position. To accomplish this adjustment, the near-field (5 cm) measurement is multiplied by a geometry correction factor to obtain an estimate of the far field exposure rate (which is below instrument sensitivity). This estimate of the far field exposure rate is used to estimate the Cs-137 curie content of the package. This report establishes the geometry correction factors for the dose-to-curie determination when the far-field gamma exposure measurement equals the background reading. This report also provides a means of demonstrating compliance to 1S Manual requirements for exposure rate readings at different locations from waste packages while specifying only two measurement positions. This demonstration of compliance is necessary to minimize the number of locations exposure rate measurements that are required, i.e., ALARA

  7. The Effect of wheat straw particle size on the mechanical and water absorption properties of wheat straw/low density polyethylene biocomposites for packaging applications

    Directory of Open Access Journals (Sweden)

    Behjat Tajeddin

    2017-08-01

    Full Text Available Natural composites with biodegradability properties can be used as a renewable alternative to replacing conventional plastics. Thus, to reduce the plastics applications in the packaging industry, biocomposites content of wheat straw (with 40, 100, 140 mesh as a natural biodegradable composite and low density polyethylene (LDPE as a common synthetic polymer in the packaging industry were prepared and characterized by the mechanical and water absorption properties. Polyethylene-graft-maleic anhydride was used as a compatibilizer material. Morphology of wheat straw flour was studied by optical microscope to obtain the aspect ratio (L/D. The tensile and flexural tests were applied for determining mechanical properties and scanning electron microscope (SEM was used for particles distribution and sample structures. The water absorption of the samples was calculated by weight difference. The results indicated that the particle size of wheat straw four and the L/D amount are Significantly affected on the tensile strength and water absorption of the samples. However, the effect of wheat sraw particle size on the flexural strength was not significant. Overall conclusions show that by increasing the particle size of the filler (wheat straw, can prepare the biocomposite with better tensile strength and less water absorption compared with smaller particle size.

  8. Effects of electron beam radiation on mechanical properties and on the resistance to punctures caused by Plodia interpunctella in cereal bar packaging

    International Nuclear Information System (INIS)

    Alves, Juliana N.; Moura, Esperidiana A.B.; Oliveira, Vitor M.; Potenza, Marcos R.; Arthur, Valter

    2009-01-01

    Plodia interpunctella is an important pest in stored products in the tropical and subtropical regions, infesting grains and flours. The adult of P. interpunctella is a small butterfly with about 15 - 20mm of spread and the female places separately of 100 the 400 eggs in groups on the grains whose hard incubation some days. This insect infesting diverse types of food packaging, depreciating the products and causing economic losses. It is therefore critical for these products a packaging that presents, in addition to good mechanical, barrier and machinability properties, a good resistance to puncture by insects, in order to prevent the contact and spread of pests in the packaged food. This study evaluates the changes on mechanical properties and puncture resistance by P. interpunctella in BOPPmet/BOPP structure, used commercially as cereal bar packaging, after electron beam irradiation. The material samples were irradiated up to 120 kGy using a 1.5 MeV electrostatic accelerator, at room temperature, in air, dose rate 11.22 kGy/s. Irradiation doses were measured using cellulose triacetate film dosimeters 'CTA-FTR-125' from Fuji Photo Film Co. Ltd. After irradiation the BOPPmet/BOPP samples were subjected to tests of puncture resistance by P. interpunctella, tensile tests and penetration resistance. The results showed significant decreases (p<0.05) in the original mechanical properties of the structures according to the radiation doses applied and effective resistance against punctures by P. interpunctella for irradiated and nonirradiated BOPPmet/BOPP samples. These results indicate that non-irradiated and irradiated BOPPmet/BOPP structure presents puncture resistance against P. interpunctella and that electron-beam irradiation, in conditions studied in this work, may turn the structure inappropriate for cereal bar packaging, due to high reduction its mechanical properties after irradiation. (author)

  9. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    Directory of Open Access Journals (Sweden)

    Zhuhao Gong

    2018-02-01

    Full Text Available A radio-frequency micro-electro-mechanical system (RF MEMS wafer-level packaging (WLP method using pre-patterned benzo-cyclo-butene (BCB polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to generate the housing cavity, the BCB sealing ring was protected by a sputtered Cr/Au (chromium/gold layer. The average measured thickness of the BCB layer was 5.9 μm. In contrast to the conventional methods of spin-coating BCB after fabricating cavities, the pre-patterned BCB method presented BCB bonding layers with better quality on severe topography surfaces in terms of increased uniformity of thickness and better surface flatness. The observation of the bonded layer showed that no void or gap formed on the protruding coplanar waveguide (CPW lines. A shear strength test was experimentally implemented as a function of the BCB widths in the range of 100–400 μm. The average shear strength of the packaged device was higher than 21.58 MPa. A RF MEMS switch was successfully packaged using this process with a negligible impact on the microwave characteristics and a significant improvement in the lifetime from below 10 million to over 1 billion. The measured insertion loss of the packaged RF MEMS switch was 0.779 dB and the insertion loss deterioration caused by the package structure was less than 0.2 dB at 30 GHz.

  10. 21 CFR 1311.120 - Electronic prescription application requirements.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 9 2010-04-01 2010-04-01 false Electronic prescription application requirements. 1311.120 Section 1311.120 Food and Drugs DRUG ENFORCEMENT ADMINISTRATION, DEPARTMENT OF JUSTICE... application must clear the plain text password from the application memory to prevent the unauthorized access...

  11. Poly(Neopentyl Glycol Furanoate): A Member of the Furan-Based Polyester Family with Smart Barrier Performances for Sustainable Food Packaging Applications

    OpenAIRE

    Laura Genovese; Nadia Lotti; Valentina Siracusa; Andrea Munari

    2017-01-01

    In the last decade, there has been an increased interest from the food packaging industry toward the development and application of bioplastics, to contribute to the sustainable economy and to reduce the huge environmental problem afflicting the planet. In the present work, we focus on a new furan-based polyester, poly(neopentyl glycol 2,5-furanoate) (PNF) to be used for sustainable food packaging applications. The aromatic polyester was successfully synthesized with high molecular weight, th...

  12. Applications of electron linacs to ADS: one potential path forward

    International Nuclear Information System (INIS)

    Wells, D.P.; Harmon, J.F.

    2011-01-01

    The application of electron linac accelerators to ADS systems offers a number of advantages for ADS applications. We propose a path forward with electron linac-driven ADS that takes advantage of those important ADS applications that are most easily achieved at relatively low cost, and then building on those successes to enable the more difficult applications with larger impact. We argue that the applications that are most easily achieved are medical isotope production, materials irradiation and environmental applications. The accelerator and target demands for each of these applications are essentially the same as for the ADS needs in energy production and the transmutation of waste. The successful demonstration of these important and highly-visible applications will, in turn, lead to greater visibility and funding to further major advances of ADS systems in energy production, nuclear waste transmutation, and applications to the thorium fuel cycle. (author)

  13. Reflective Packaging

    Science.gov (United States)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  14. Packaging - Materials review

    Energy Technology Data Exchange (ETDEWEB)

    Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  15. Packaging - Materials review

    Science.gov (United States)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  16. Packaging - Materials review

    International Nuclear Information System (INIS)

    Herrmann, Matthias

    2014-01-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  17. Electron beam welding fundamentals and applications

    International Nuclear Information System (INIS)

    Mara, G.L.; Armstrong, R.E.

    1975-01-01

    The electron beam welding process is described and the unique mode of operation and penetration explained by a description of the forces operating within the weld pool. This penetration model is demonstrated by high speed cinematography of the weld pool on several materials. The conditions under which weld defects are formed are discussed and examples are presented. (auth)

  18. Raman spectroscopy, electronic microscopy and SPME-GC-MS to elucidate the mode of action of a new antimicrobial food packaging material.

    Science.gov (United States)

    Clemente, Isabel; Aznar, Margarita; Salafranca, Jesús; Nerín, Cristina

    2017-02-01

    One critical challenge when developing a new antimicrobial packaging material is to demonstrate the mode of action of the antimicrobials incorporated into the packaging. For this task, several analytical techniques as well as microbiology are required. In this work, the antimicrobial properties of benzyl isothiocyanate, allyl isothiocyanate and essential oils of cinnamon and oregano against several moulds and bacteria have been evaluated. Benzyl isothiocyanate showed the highest antimicrobial activity and it was selected for developing the new active packaging material. Scanning electron microscopy and Raman spectroscopy were successfully used to demonstrate the mode of action of benzyl isothiocyanate on Escherichia coli. Bacteria exhibited external modifications such as oval shape and the presence of septum surface, but they did not show any disruption or membrane damage. To provide data on the in vitro action of benzyl isothiocyanate and the presence of inhibition halos, the transfer mechanism to the cells was assessed using solid-phase microextraction-gas chromatography-mass spectrometry. Based on the transfer system, action mechanism and its stronger antimicrobial activity, benzyl isothiocyanate was incorporated to two kinds of antimicrobial labels. The labels were stable and active for 140 days against two mould producers of ochratoxin A; Penicillium verrucosum is more sensitive than Aspergillus ochraceus. Details about the analytical techniques and the results obtained are shown and discussed. Graphical Abstract Antimicrobial evaluation of pure compounds, incorporation in the packaging and study for mode of action on S. coli by Raman, SEM and SPME-GC-MS.

  19. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  20. MEMS packaging: state of the art and future trends

    Science.gov (United States)

    Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

    1998-07-01

    Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

  1. The Ettention software package.

    Science.gov (United States)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

  2. Applications of electron beam to precoated steel

    International Nuclear Information System (INIS)

    Koshiishi, K.; Masuhara, K.

    1992-01-01

    Applications of EB to precoated steel started with paint cure and have expanded to film lamination and surface modification. These applications can offer precoated steel some advantages which are difficult or impossible to gain by thermal methods. But there are also such problems as adhesion, formability and paintability in EB processing. In practice, using EB technologies along with thermal technologies cannot be avoided for precoated steel at the present. Future development of EB applications to precoated steel will depend on how we can seek superiority and distinction of EB technology against conventional and competitive technologies. (author)

  3. Calibration data Analysis Package (CAP): An IDL based widget application for analysis of X-ray calibration data

    Science.gov (United States)

    Vaishali, S.; Narendranath, S.; Sreekumar, P.

    An IDL (interactive data language) based widget application developed for the calibration of C1XS (Narendranath et al., 2010) instrument on Chandrayaan-1 is modified to provide a generic package for the analysis of data from x-ray detectors. The package supports files in ascii as well as FITS format. Data can be fitted with a list of inbuilt functions to derive the spectral redistribution function (SRF). We have incorporated functions such as `HYPERMET' (Philips & Marlow 1976) including non Gaussian components in the SRF such as low energy tail, low energy shelf and escape peak. In addition users can incorporate additional models which may be required to model detector specific features. Spectral fits use a routine `mpfit' which uses Leven-Marquardt least squares fitting method. The SRF derived from this tool can be fed into an accompanying program to generate a redistribution matrix file (RMF) compatible with the X-ray spectral analysis package XSPEC. The tool provides a user friendly interface of help to beginners and also provides transparency and advanced features for experts.

  4. 9975 Shipping Package Performance Of Alternate Materials For Long-Term Storage Application

    International Nuclear Information System (INIS)

    Skidmore, E.; Hoffman, E.; Daugherty, W.

    2010-01-01

    The Model 9975 shipping package specifies the materials of construction for its various components. With the loss of availability of material for two components (cane fiberboard overpack and Viton(reg s ign) GLT O-rings), alternate materials of construction were identified and approved for use for transport (softwood fiberboard and Viton(reg s ign) GLT-S O-rings). As these shipping packages are part of a long-term storage configuration at the Savannah River Site, additional testing is in progress to verify satisfactory long-term performance of the alternate materials under storage conditions. The test results to date can be compared to comparable results on the original materials of construction to draw preliminary conclusions on the performance of the replacement materials.

  5. Three dimensional field computation software package DE3D and its applications

    International Nuclear Information System (INIS)

    Fan Mingwu; Zhang Tianjue; Yan Weili

    1992-07-01

    A software package, DE3D that can be run on PC for three dimensional electrostatic and magnetostatic field analysis has been developed in CIAE (China Institute of Atomic Energy). Two scalar potential method and special numerical techniques have made the code with high precision. It can be used for electrostatic and magnetostatic fields computations with complex boundary conditions. In the most cases, the result accuracy is better than 1% comparing with the measured. In some situations, the results are more acceptable than the other codes because some tricks are used for the current integral. Typical examples, design of a cyclotron magnet and magnetic elements on its beam transport line, given in the paper show how the program helps the designer to improve the design of the product. The software package could bring advantages to the producers and designers

  6. Novel applications of the x-ray tracing software package McXtrace

    DEFF Research Database (Denmark)

    Bergbäck Knudsen, Erik; Nielsen, Martin Meedom; Haldrup, Kristoffer

    2014-01-01

    We will present examples of applying the X-ray tracing software package McXtrace to different kinds of X-ray scattering experiments. In particular we will be focusing on time-resolved type experiments. Simulations of full scale experiments are particularly useful for this kind, especially when...... some of the issues encountered. Generally more than one or all of these effects are present at once. Simulations can in these cases be used to identify distinct footprints of such distortions and thus give the experimenter a means of deconvoluting them from the signal. We will present a study...... of this kind along with the newest developments of the McXtrace software package....

  7. Particle Data Management Software for 3DParticle Tracking Velocimetry and Related Applications – The Flowtracks Package

    Directory of Open Access Journals (Sweden)

    Yosef Meller

    2016-06-01

    Full Text Available The Particle Tracking Velocimetry (PTV community employs several formats of particle information such as position and velocity as function of time, i.e. trajectory data, as a result of diverging needs unmet by existing formats, and a number of different, mostly home-grown, codes for handling the data. Flowtracks is a Python package that provides a single code base for accessing different formats as a database, i.e. storing data and programmatically manipulating them using format-agnostic data structures. Furthermore, it offers an HDF5-based format that is fast and extensible, obviating the need for other formats. The package may be obtained from https://github.com/OpenPTV/postptv and used as-is by many fluid-dynamics labs, or with minor extensions adhering to a common interface, by researchers from other fields, such as biology and population tracking.

  8. Packaging Aspects of Photodetector Modules for 100 Gbit/s Ethernet Applications

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Mekonnen, G.G.; Krozer, Viktor

    2008-01-01

    Packaging is a major problem at millimetre-wave frequencies approaching 100 GHz. In this paper we present that insertion losses in a multi-chip module (MCM) can be less IL ...-backed coplanar waveguides (CBCPWs) with vias is accurately analyzed using 3D electromagnetic (EM) simulation over a wide frequency range. Patch antenna mode resonances are identified as a major origin of resonances in simulated and measured transmission characteristics of the CBCPW with vias. Based on EM...

  9. Research and Application of WCF Technology in Data Acquisition of Ultra-high Speed Packaging Machine

    Directory of Open Access Journals (Sweden)

    Qian Jie

    2016-01-01

    Full Text Available By introducing WCF technology on data acquisition of ultra-high speed packaging machine, data acquisition system reads dates of machine in polling mode through the WCF client, which can achieve accurate data collection, and effectively isolate the data acquisition system and the machine control system. It enhances the security of data interaction between systems, but also reduces the coupling degree between systems.

  10. Preparation and application of agar/alginate/collagen ternary blend functional food packaging films.

    Science.gov (United States)

    Wang, Long-Feng; Rhim, Jong-Whan

    2015-09-01

    Ternary blend agar/alginate/collagen (A/A/C) hydrogel films with silver nanoparticles (AgNPs) and grapefruit seed extract (GSE) were prepared. Their performance properties, transparency, tensile strength (TS), water vapor permeability (WVP), water contact angle (CA), water swelling ratio (SR), water solubility (WS), and antimicrobial activity were determined. The A/A/C film was highly transparent, and both AgNPs and GSE incorporated blend films (A/A/C(AgNPs) and A/A/C(GSE)) exhibited UV-screening effect, especially, the A/A/C(GSE) film had high UV-screening effect without sacrificing the transmittance. In addition, the A/A/C blend films formed efficient hydrogel film with the water holding capacity of 23.6 times of their weight. Both A/A/C(AgNPs) and A/A/C(GSE) composite films exhibited strong antimicrobial activity against both Gram-positive (Listeria monocytogenes) and Gram-negative (Escherichia coli) food-borne pathogenic bacteria. The test results of fresh potatoes packaging revealed that all the A/A/C ternary blend films prevented forming of condensed water on the packaged film surface, both A/A/C(AgNPs) and A/A/C(GSE) composite films prevented greening of potatoes during storage. The results indicate that the ternary blend hydrogel films incorporated with AgNPs or GSE can be used not only as antifogging packaging films for highly respiring fresh agriculture produce, but also as an active food packaging system utilizing their strong antimicrobial activity. Copyright © 2015 Elsevier B.V. All rights reserved.

  11. The Application and Evaluation of Modified Atmosphere Packaging in Selected Minimally Processed Vegetables

    OpenAIRE

    Greene, Aine, (Thesis)

    2003-01-01

    The central aim of this study was to optimise the processing and storage of selected vegetable within the parameters of extended shelf life, time/temperature relationships and sensory quality. The vegetables were selected on the basis of the results of a survey of the Irish vegetable industry. The current literature in the field of modified atmosphere packaging (MAP) and the Irish vegetable industry was reviewed. The current state and future requirements of the Irish vegetable industry was in...

  12. Estimating added sugars in US consumer packaged goods: An application to beverages in 2007–08

    OpenAIRE

    Ng, Shu Wen; Bricker, Gregory; Li, Kuo-ping; Yoon, Emily Ford; Kang, Jiyoung; Westrich, Brian

    2015-01-01

    This study developed a method to estimate added sugar content in consumer packaged goods (CPG) that can keep pace with the dynamic food system. A team including registered dietitians, a food scientist and programmers developed a batch-mode ingredient matching and linear programming (LP) approach to estimate the amount of each ingredient needed in a given product to produce a nutrient profile similar to that reported on its nutrition facts label (NFL). Added sugar content was es...

  13. Application of the Technology Acceptance Model (TAM) in electronic ...

    African Journals Online (AJOL)

    Application of the Technology Acceptance Model (TAM) in electronic ticket purchase for ... current study examined the perceived usefulness and ease of use of online technology ... The findings are discussed in the light of these perspectives.

  14. Power electronic converter systems for direct drive renewable energy applications

    DEFF Research Database (Denmark)

    Chen, Zhe

    2013-01-01

    This chapter presents power electronic conversion systems for wind and marine energy generation applications, in particular, direct drive generator energy conversion systems. Various topologies are presented and system design optimization and reliability are briefly discussed....

  15. Ferrite nanoparticles: Synthesis, characterisation and applications in electronic device

    Energy Technology Data Exchange (ETDEWEB)

    Kefeni, Kebede K., E-mail: kkefeni@gmail.com; Msagati, Titus A.M.; Mamba, Bhekie B.

    2017-01-15

    Highlights: • Available synthesis methods of ferrite nanoparticles (FNPs) are briefly reviewed. • Summary of the advantage and limitation of FNPs synthesis techniques are presented. • The existing most common FNPs characterisation techniques are briefly reviewed. • Major application areas of FNPs in electronic materials are reviewed. - Abstract: Ferrite nanoparticles (FNPs) have attracted a great interest due to their wide applications in several areas such as biomedical, wastewater treatment, catalyst and electronic device. This review focuses on the synthesis, characterisation and application of FNPs in electronic device with more emphasis on the recently published works. The most commonly used synthesis techniques along with their advantages and limitations are discussed. The available characterisation techniques and their application in electronic materials such as sensors and biosensors, energy storage, microwave device, electromagnetic interference shielding and high-density recording media are briefly reviewed.

  16. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  17. Application of Lemongrass Oil-Containing Polylactic Acid Films to the Packaging of Pork Sausages.

    Science.gov (United States)

    Yang, Hyun-Ju; Song, Kyung Bin

    2016-01-01

    Polylactic acid (PLA) is a biodegradable and renewable polymer, which represents a valuable alternative to plastic packaging films, often associated with environmental problems. In this study, we tested the suitability of PLA as a biodegradable packaging film and assessed the antimicrobial activity of lemongrass oil (LO), incorporated into the PLA film in different concentrations. To obtain the optimal physical properties for PLA films, tensile strength, elongation at break, and water vapor permeability were measured under different preparation conditions. In addition, the antimicrobial activity of the LO contained in the PLA film against Listeria monocytogenes was investigated by disc diffusion and viable cell count. Among all concentrations tested, 2% LO was the most suitable in terms of antimicrobial activity and physical properties of the PLA film. Based on these results, we used the PLA film containing 2% LO to pack pork sausages; after 12 d of storage at 4℃, the population of inoculated L. monocytogenes in the sausage samples wrapped with the PLA film containing 2% LO was reduced by 1.47 Log CFU/g compared with the control samples. Our data indicate that PLA films containing 2% LO represent a valuable means for antimicrobial sausage packaging.

  18. Study of applicable methods on safety verification of disposal facilities and waste packages

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2013-08-15

    Three subjects about safety verification on the disposal of low level radioactive waste were investigated in FY. 2012. For radioactive waste disposal facilities, specs and construction techniques of covering with soil to prevent possible destruction caused by natural events (e.g. earthquake) were studied to consider verification methods for those specs. For waste packages subject to near surface pit disposal, settings of scaling factor and average radioactivity concentration (hereafter referred to as ''SF'') on container-filled and solidified waste packages generated from Kashiwazaki Kariwa Nuclear Power Station Unit 1-5, setting of cesium residual ratio of molten solidified waste generated from Tokai and Tokai No.2 Power Stations, etc. were studied. Those results were finalized in consideration of the opinion from advisory panel, and publicly opened as JNES-EV reports. In FY 2012, five JNES reports were published and these have been used as standards of safety verification on waste packages. The verification method of radioactive wastes subject to near-surface trench disposal and intermediate depth disposal were also studied. For radioactive wastes which will be returned from overseas, determination methods of radioactive concentration, heat rate and hydrogen generation rate of CSD-C were established. Determination methods of radioactive concentration and heat rate of CSD-B were also established. These results will be referred to verification manuals. (author)

  19. Application of Lemongrass Oil-Containing Polylactic Acid Films to the Packaging of Pork Sausages

    Science.gov (United States)

    2016-01-01

    Polylactic acid (PLA) is a biodegradable and renewable polymer, which represents a valuable alternative to plastic packaging films, often associated with environmental problems. In this study, we tested the suitability of PLA as a biodegradable packaging film and assessed the antimicrobial activity of lemongrass oil (LO), incorporated into the PLA film in different concentrations. To obtain the optimal physical properties for PLA films, tensile strength, elongation at break, and water vapor permeability were measured under different preparation conditions. In addition, the antimicrobial activity of the LO contained in the PLA film against Listeria monocytogenes was investigated by disc diffusion and viable cell count. Among all concentrations tested, 2% LO was the most suitable in terms of antimicrobial activity and physical properties of the PLA film. Based on these results, we used the PLA film containing 2% LO to pack pork sausages; after 12 d of storage at 4℃, the population of inoculated L. monocytogenes in the sausage samples wrapped with the PLA film containing 2% LO was reduced by 1.47 Log CFU/g compared with the control samples. Our data indicate that PLA films containing 2% LO represent a valuable means for antimicrobial sausage packaging. PMID:27433114

  20. Scattered radiation from applicators in clinical electron beams

    International Nuclear Information System (INIS)

    Battum, L J van; Zee, W van der; Huizenga, H

    2003-01-01

    In radiotherapy with high-energy (4-25 MeV) electron beams, scattered radiation from the electron applicator influences the dose distribution in the patient. In most currently available treatment planning systems for radiotherapy this component is not explicitly included and handled only by a slight change of the intensity of the primary beam. The scattered radiation from an applicator changes with the field size and distance from the applicator. The amount of scattered radiation is dependent on the applicator design and on the formation of the electron beam in the treatment head. Electron applicators currently applied in most treatment machines are essentially a set of diaphragms, but still do produce scattered radiation. This paper investigates the present level of scattered dose from electron applicators, and as such provides an extensive set of measured data. The data provided could for instance serve as example input data or benchmark data for advanced treatment planning algorithms which employ a parametrized initial phase space to characterize the clinical electron beam. Central axis depth dose curves of the electron beams have been measured with and without applicators in place, for various applicator sizes and energies, for a Siemens Primus, a Varian 2300 C/D and an Elekta SLi accelerator. Scattered radiation generated by the applicator has been found by subtraction of the central axis depth dose curves, obtained with and without applicator. Scattered radiation from Siemens, Varian and Elekta electron applicators is still significant and cannot be neglected in advanced treatment planning. Scattered radiation at the surface of a water phantom can be as high as 12%. Scattered radiation decreases almost linearly with depth. Scattered radiation from Varian applicators shows clear dependence on beam energy. The Elekta applicators produce less scattered radiation than those of Varian and Siemens, but feature a higher effective angular variance. The scattered

  1. Application of carbon nanoclusters in electronics

    Science.gov (United States)

    Krachkovskaya, T. M.; Sahadji, G. V.; Emelyanov, A. S.; Silaeva, M. V.

    2018-04-01

    Nanocarbon material (Ugleron and Astralens) is used for the first time for the production of metal porous cathode (MPC). It can be assumed that its implementation in the MPC matrix can change the mechanism and rate of occurrence of three-phase reactions of formation of active elements and oxygen and, thereby, improve its emission properties. The new technology of manufacturing MPC is aimed at solving the problem of increasing the durability of electro vacuum devices - more than 100,000 hours. The obtained results are intended for use in technologies for manufacturing of electron sources for electro vacuum devices used in space communication and navigation systems. In addition, they can be useful for other areas of electronics that use a metal-porous thermal cathode as sources of electron emission. There are manufactured models with the use of Ugleron and Astralens in a sponge and emission substance. A layout using Ugleron in the emission substance is tested for durability and currently has an operating time of 40,000 hours. A model with the use of Astralens and Ugleron in a sponge and emission substance respectively is tested for maximum current density. To date, it shows results comparable to the standard cathode. However, there is a suggestion that cathodes with Astralens and Ugleron have a lower evaporation rate of the active substance. There is predicted longer durability than for the standard cathode at the same emissivity.

  2. Scattered radiation from applicators in clinical electron beams.

    NARCIS (Netherlands)

    Battum, L.J. van; Zee, W. van der; Huizenga, H.

    2003-01-01

    In radiotherapy with high-energy (4-25 MeV) electron beams, scattered radiation from the electron applicator influences the dose distribution in the patient. In most currently available treatment planning systems for radiotherapy this component is not explicitly included and handled only by a slight

  3. Surface analysis by electron spectroscopy. General concepts and applications

    International Nuclear Information System (INIS)

    Feliu, S.

    1993-01-01

    An introduction is made to the techniques of electron spectroscopy (XPS and AES) used in the study of surface phenomena. Their theoretical principles, the singular information supplied by these techniques and their basic instrumentation (vacuum systems, excitation sources and electron analysers) are described. A revision of their applications to the Materials Science and the Corrosion Sciences is also made. Author. 44 refs

  4. Potential applications of electron emission membranes in medicine

    Energy Technology Data Exchange (ETDEWEB)

    Bilevych, Yevgen [Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin (Germany); University of Bonn, Bonn (Germany); Brunner, Stefan E. [Delft University of Technology, Delft (Netherlands); Stefan Meyer Institute for Subatomic Physics, Austrian Academy of Sciences, Vienna (Austria); Chan, Hong Wah; Charbon, Edoardo [Delft University of Technology, Delft (Netherlands); Graaf, Harry van der, E-mail: vdgraaf@nikhef.nl [Delft University of Technology, Delft (Netherlands); Nikhef, Science Park 105, 1098 XG Amsterdam (Netherlands); Hagen, Cornelis W. [Delft University of Technology, Delft (Netherlands); Nützel, Gert; Pinto, Serge D. [Photonis, Roden (Netherlands); Prodanović, Violeta [Delft University of Technology, Delft (Netherlands); Rotman, Daan [Delft University of Technology, Delft (Netherlands); Nikhef, Science Park 105, 1098 XG Amsterdam (Netherlands); University of Amsterdam, Amsterdam (Netherlands); Santagata, Fabio [State Key Lab for Solid State Lighti Changzhou base, F7 R& D HUB 1, Science and Education Town, Changzhou 213161, Jangsu Province (China); Sarro, Lina; Schaart, Dennis R. [Delft University of Technology, Delft (Netherlands); Sinsheimer, John; Smedley, John [Brookhaven National Laboratory, Upton, NY (United States); Tao, Shuxia; Theulings, Anne M.M.G. [Delft University of Technology, Delft (Netherlands); Nikhef, Science Park 105, 1098 XG Amsterdam (Netherlands)

    2016-02-11

    With a miniaturised stack of transmission dynodes, a noise free amplifier is being developed for the detection of single free electrons, with excellent time- and 2D spatial resolution and efficiency. With this generic technology, a new family of detectors for individual elementary particles may become possible. Potential applications of such electron emission membranes in medicine are discussed.

  5. Handbook of power systems engineering with power electronics applications

    CERN Document Server

    Hase, Yoshihide

    2012-01-01

    Formerly known as Handbook of Power System Engineering, this second edition provides rigorous revisions to the original treatment of systems analysis together with a substantial new four-chapter section on power electronics applications. Encompassing a whole range of equipment, phenomena, and analytical approaches, this handbook offers a complete overview of power systems and their power electronics applications, and presents a thorough examination of the fundamental principles, combining theories and technologies that are usually treated in separate specialised fields, in a single u

  6. In vitro toxicological assessment of clays for their use in food packaging applications.

    Science.gov (United States)

    Maisanaba, Sara; Puerto, María; Pichardo, Silvia; Jordá, María; Moreno, F Javier; Aucejo, Susana; Jos, Ángeles

    2013-07-01

    Montmorillonite based clays have a wide range of applications that are going to contribute to increase human exposure to these materials. One of the most promising uses of clays is the development of reinforced food contact materials that results in nanocomposites with improved barrier properties. Different organoclays have been developed introducing modifiers in the natural clay which is commercially available. However, the toxicological aspects of these materials have been scarcely studied so far. In the present study, the cytotoxic effects of a non-modified clay (Cloisite Na+) and an organoclay (Cloisite 30B) have been investigated in the hepatic cell line HepG2. Only Cloisite 30B showed cytotoxicity. In order to elucidate the toxic mechanisms underlying these effects, apoptosis, inflammation, oxidative stress and genotoxicity biomarkers were assayed. Moreover, a morphology study with light and electron microscopy was performed. Results showed genotoxic effects and glutathione decrease. The most relevant ultraestructural alterations observed were mitochondrial degeneration, dilated endomembrane systems, heterophagosomes formation, fat droplets appearance and presence of nuclear lipid inclusions. Cloisite 30B, therefore, induces toxic effects in HepG2 cells. Further research is needed to assess the risk of this clay on the human health. Copyright © 2013 Elsevier Ltd. All rights reserved.

  7. Semiconductor nanowires and templates for electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Ying, Xiang

    2009-07-15

    This thesis starts by developing a platform for the organized growth of nanowires directly on a planar substrate. For this, a method to fabricate horizontal porous alumina membranes is studied. The second part of the thesis focuses on the study of nanowires. It starts by the understanding of the growth mechanisms of germanium nanowires and follows by the structural and electrical properties at the single nanowire level. Horizontally aligned porous anodic alumina (PAA) was used as a template for the nanowire synthesis. Three PAA arrangements were studied: - high density membranes - micron-sized fingers - multi-contacts Membranes formed by a high density of nanopores were obtained by anodizing aluminum thin films. Metallic and semiconducting nanowires were synthesized into the PAA structures via DC deposition, pulsed electro-depostion and CVD growth. The presence of gold, copper, indium, nickel, tellurium, and silicon nanowires inside PAA templates was verified by SEM and EDX analysis. Further, room-temperature transport measurements showed that the pores are completely filled till the bottom of the pores. In this dissertation, single crystalline and core-shell germanium nanowires are synthesized using indium and bismuth as catalyst in a chemical vapor deposition procedure with germane (GeH{sub 4}) as growth precursor. A systematic growth study has been performed to obtain high aspect-ratio germanium nanowires. The influence of the growth conditions on the final morphology and the crystalline structure has been determined via scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). In the case of indium catalyzed germanium nanowires, two different structures were identified: single crystalline and crystalline core-amorphous shell. The preferential growth axis of both kinds of nanowires is along the [110] direction. The occurrence of the two morphologies was found to only depend on the nanowire dimension. In the case of bismuth

  8. The influence of electron-beam irradiation on some mechanical properties of commercial multilayer flexible packaging materials (PET MET/LDPE)

    International Nuclear Information System (INIS)

    Nogueira, Beatriz R.; Oliveira, Vitor M.; Moura, Esperidiana A.B.; Ortiz, Angel V.

    2009-01-01

    The treatment with electron-beam radiation is a promising approach to the controllable modification of the properties of the polymeric flexible packaging materials, in order to adjust their properties. In recent years electron-beam irradiation have been efficiently applied in the flexible packaging industry to promote crosslinking and scission of the polymeric chains in order to improve material mechanical properties. On the other hand, ionizing irradiation can also affect the polymeric materials itself leading to a production of free radicals. These free radicals can in turn lead to degradation and or cross-linking phenomena. The influence of electron beam irradiation on mechanical properties of commercial multilayer flexible packaging materials based on laminated low-density polyethylene (LDPE) and metallized poly(ethylene terephthalate) (PET) was studied. The PETmet/LDPE structure was irradiated with doses up to 120 kGy, using a 1.5 MeV electron beam accelerator, dose rate 11.22kGy/s, at room temperature in presence of air. The results showed that penetration resistance of the irradiated PETmet/LDPE film increase up to 10 %, except for radiation dose of 30 kGy that resulted in a slight decrease of ca. 3%, while the sealing resistance decreased ca. 8-26% in all doses (p < 0.05). In addition, the samples of PETmet/LDPE film at 45, 60, 75 and 105 kGy presented a gain up to 18 % in their original tensile strength at break, a gain of ca. 38% in their original elongation at break for radiation dose of 45 kGy and ca. 17% for radiation doses of 60, 75 and 120 kGy. (author)

  9. Decal electronics for printed high performance cmos electronic systems

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-11-23

    High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

  10. Pulsed electron accelerator for radiation technologies in the enviromental applications

    Science.gov (United States)

    Korenev, Sergey

    1997-05-01

    The project of pulsed electron accelerator for radiation technologies in the environmental applications is considered. An accelerator consists of high voltage generator with vacuum insulation and vacuum diode with plasma cathode on the basis discharge on the surface of dielectric of large dimensions. The main parameters of electron accelerators are following: kinetic energy 0.2 - 2.0 MeV, electron beam current 1 - 30 kA and pulse duration 1- 5 microseconds. The main applications of accelerator for decomposition of wastewaters are considered.

  11. Power electronics basics operating principles, design, formulas, and applications

    CERN Document Server

    Rozanov, Yuriy; Chaplygin, Evgeny; Voronin, Pavel

    2015-01-01

    Power Electronics Basics: Operating Principles, Design, Formulas, and Applications provides fundamental knowledge for the analysis and design of modern power electronic devices. This concise and user-friendly resource:Explains the basic concepts and most important terms of power electronicsDescribes the power assemblies, control, and passive components of semiconductor power switchesCovers the control of power electronic devices, from mathematical modeling to the analysis of the electrical processesAddresses pulse-width modulation, power quality control, and multilevel, modular, and multicell

  12. Application of electron accelerator for thin film in Indonesia

    International Nuclear Information System (INIS)

    Danu, Sugiarto; Darsono, Dadang

    2004-01-01

    Electron accelerator is widely used for the crosslinking of wire and cable insulation, the treatment of heat shrinkable products, precuring of tire components, and the sterilization of medical products. Research and development the use of electron accelerator for thin film in Indonesia covered radiation curing of surface coating, crosslinking of poly (butylenes succinate), crosslinking of wire, cable and heat shrinkable, sterilization of wound dressing, and prevulcanization of tire. In general, comparing with conventional method, electron beam processing have some advantages, such as, less energy consumption, much higher production rate, processing ability at ambient temperature and environmental friendly. Indonesia has a great potential to develop the application of electron accelerator, due to the remarkable growth industrial sector, the abundant of natural resources and the increasing demand of the high quality products. This paper describes the activities concerning with R and D, and application of electron accelerator for processing of thin film. (author)

  13. High-Power Electron Accelerators for Space (and other) Applications

    Energy Technology Data Exchange (ETDEWEB)

    Nguyen, Dinh Cong [Los Alamos National Lab. (LANL), Los Alamos, NM (United States); Lewellen, John W. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-05-23

    This is a presentation on high-power electron accelerators for space and other applications. The main points covered are: electron beams for space applications, new designs of RF accelerators, high-power high-electron mobility transistors (HEMT) testing, and Li-ion battery design. In summary, the authors have considered a concept of 1-MeV electron accelerator that can operate up to several seconds. This concept can be extended to higher energy to produce higher beam power. Going to higher beam energy requires adding more cavities and solid-state HEMT RF power devices. The commercial HEMT have been tested for frequency response and RF output power (up to 420 W). Finally, the authors are testing these HEMT into a resonant load and planning for an electron beam test in FY17.

  14. Applications in Electronics Pervading Industry, Environment and Society

    CERN Document Server

    2016-01-01

    This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. A wide spectrum of application domains are covered, from automotive to space and from health to security, and special attention is devoted to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2014 APPLEPIES Conference, held in Rome, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas covered by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and th...

  15. 2015 Applications in Electronics Pervading Industry, Environment and Society Conference

    CERN Document Server

    2017-01-01

    This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2015 ApplePies Conference, held in Rome, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the ...

  16. Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications

    International Nuclear Information System (INIS)

    Ngo, H-D; Hiess, Andre; Seidemann, Volker; Studzinski, Daniel; Lange, Martin; Leib, Juergen; Shariff, Dzafir; Ashraf, Huma; Steel, Mike; Atabo, Lilian; Reast, Jon

    2006-01-01

    This paper is a brief report of plasma etching as applied to pattern transfer in silicon. It will focus more on concept overview and strategies for etching of tapered features of interest for MEMS and Wafer Level Packaging (WLP). The basis of plasma etching, the dry etching technique, is explained and plasma configurations are described elsewhere. An important feature of plasma etching is the possibility to achieve etch anisotropy. The plasma etch process is extremely sensitive to many variables such as mask material, mask openings and more important the plasma parameters

  17. Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Johansen, Tom Keinicke; Krozer, Viktor

    2007-01-01

    In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110GHz. Higher-order resonances are observed in both measurement and simulation...... results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly...

  18. Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

    OpenAIRE

    Zhuhao Gong; Yulong Zhang; Xin Guo; Zewen Liu

    2018-01-01

    A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to gener...

  19. The ZOOM minimization package

    International Nuclear Information System (INIS)

    Fischler, Mark S.; Sachs, D.

    2004-01-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete

  20. Active food packaging technologies.

    Science.gov (United States)

    Ozdemir, Murat; Floros, John D

    2004-01-01

    Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

  1. Effective applications of auger electron spectroscopy

    International Nuclear Information System (INIS)

    Golnabi, H.

    1996-01-01

    The goal of this study is to explore different aspects of the AES process and to present the new techniques which can be used effectively for analytical purposes. More emphasis is given to AES data acquisition, sensitivity factor and Auger intensity. The experimental details of a typical scanning Auger microprobe (SAM) is also presented. Applications of AES to selected systems such as microelectronic devices, superconductors, an in metallurgy are described

  2. Multifrequency Electron Paramagnetic Resonance Theory and Applications

    CERN Document Server

    Misra, Sushil K

    2011-01-01

    Filling the gap for a systematic, authoritative, and up-to-date review of this cutting-edge technique, this book covers both low and high frequency EPR, emphasizing the importance of adopting the multifrequency approach to study paramagnetic systems in full detail by using the EPR method. In so doing, it discusses not only the underlying theory and applications, but also all recent advances -- with a final section devoted to future perspectives.

  3. Advances in electronic-nose technologies developed for biomedical applications

    Science.gov (United States)

    Dan Wilson; Manuela. Baietto

    2011-01-01

    The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and...

  4. Applications of electronic noses in meat analysis

    Directory of Open Access Journals (Sweden)

    Elżbieta GÓRSKA-HORCZYCZAK

    2016-01-01

    Full Text Available Abstract Electronic noses are devices able to characterize and differentiate the aroma profiles of various food, especially meat and meat products. During recent years e-noses have been widely used in food analysis and proved to provide a fast, simple, non-expensive and non-destructive method of food assessment and quality control. The aim of this study is to summarize the most important features of this analytic tool and to present basic fields and typical areas of e-nose use as well as most commonly used sensor types and patterns for e-nose design. Prospects for the future development of this technique are presented. Methods and research results presented in this manuscript may be a guideline for practical e-nose use.

  5. Electronic microscopy application in artificial minerals

    International Nuclear Information System (INIS)

    Gomez, L E.

    1995-07-01

    One of the uses of electronic microscopy in combination with the analysis microprobe EDAX is to characterize the properties of the minerals. The technique consist of studying the chemical composition by elements or by oxides of particles which can be enlarged successfully up to 100000x. With the help of the optical microscope one is able to determine the textual characteristics, the form, cleavage and other cristallographic properties which, combined with microprobe analysis enable one to determine its classification. The industrial processes which use ovens usually have problems due to the formation of impurities, spots and abnormal aspects which are reflected in a lower quality of the final material produced. These types of defects appear in minerals which are made in laboratories; knowing the natural minerals one can exercise a better quality control since this permits to know the behaviour of the raw material at a particular temperature and its reactions depending on the additives used

  6. Physics of electronic materials principles and applications

    CERN Document Server

    Rammer, Jorgen

    2017-01-01

    Adopting a uniquely pedagogical approach, this comprehensive textbook on the quantum mechanics of semiconductor materials and devices focuses on the materials, components and devices themselves whilst incorporating a substantial amount of fundamental physics related to condensed matter theory and quantum mechanics. Written primarily for advanced undergraduate students in physics and engineering, this book can also be used as a supporting text for introductory quantum mechanics courses, and will be of interest to anyone interested in how electronic devices function at a fundamental level. Complete with numerous exercises, and with all the necessary mathematics and physics included in appendices, this book guides the reader seamlessly through the principles of quantum mechanics and the quantum theory of metals and semiconductors, before describing in detail how devices are exploited within electric circuits and in the hardware of computers, for example as amplifiers, switches and transistors. Includes nume...

  7. Electronically commutated motors for vehicle applications

    Science.gov (United States)

    Echolds, E. F.

    1980-02-01

    Two permanent magnet electronically commutated motors for electric vehicle traction are discussed. One, based on existing technology, produces 23 kW (peak) at 26,000 rpm, and 11 kW continuous at 18,000 rpm. The motor has a conventional design: a four-pole permanent magnet rotor and a three-phase stator similar to those used on ordinary induction motors. The other, advanced technology motor, is rated at 27 kW (peak) at 14,000 rpm, and 11 kW continuous at 10,500 rpm. The machine employs a permanent magnet rotor and a novel ironless stator design in an axial air gap, homopolar configuration. Comparison of the new motors with conventional brush type machines indicates potential for substantial cost savings.

  8. Developing a model for application of electronic banking based on electronic trust

    Directory of Open Access Journals (Sweden)

    Amir Hooshang Nazarpoori

    2014-05-01

    Full Text Available This study develops a model for application of electronic banking based on electronic trust among costumers of Day bank in KhoramAbad city. A sample of 150 people was selected based on stratified random sampling. Questionnaires were used for the investigation. Results indicate that technology-based factors, user-based factors, and trust had negative relationships with perceived risk types including financial, functional, personal, and private. Moreover, trust including trust in system and trust in bank had a positive relationship with tendency to use and real application of electronic banking.

  9. Advances in electronic-nose technologies developed for biomedical applications.

    Science.gov (United States)

    Wilson, Alphus D; Baietto, Manuela

    2011-01-01

    The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

  10. Advances in Electronic-Nose Technologies Developed for Biomedical Applications

    Directory of Open Access Journals (Sweden)

    Alphus D. Wilson

    2011-01-01

    Full Text Available The research and development of new electronic-nose applications in the biomedical field has accelerated at a phenomenal rate over the past 25 years. Many innovative e-nose technologies have provided solutions and applications to a wide variety of complex biomedical and healthcare problems. The purposes of this review are to present a comprehensive analysis of past and recent biomedical research findings and developments of electronic-nose sensor technologies, and to identify current and future potential e-nose applications that will continue to advance the effectiveness and efficiency of biomedical treatments and healthcare services for many years. An abundance of electronic-nose applications has been developed for a variety of healthcare sectors including diagnostics, immunology, pathology, patient recovery, pharmacology, physical therapy, physiology, preventative medicine, remote healthcare, and wound and graft healing. Specific biomedical e-nose applications range from uses in biochemical testing, blood-compatibility evaluations, disease diagnoses, and drug delivery to monitoring of metabolic levels, organ dysfunctions, and patient conditions through telemedicine. This paper summarizes the major electronic-nose technologies developed for healthcare and biomedical applications since the late 1980s when electronic aroma detection technologies were first recognized to be potentially useful in providing effective solutions to problems in the healthcare industry.

  11. Lithium niobate packaging challenges

    International Nuclear Information System (INIS)

    Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

    1988-01-01

    The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

  12. Packaging for Sustainability

    CERN Document Server

    Lewis, Helen; Fitzpatrick, Leanne

    2012-01-01

    The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

  13. A FREQUENCY-BASED LINGUISTIC APPROACH TO PROTEIN DECODING AND DESIGN: SIMPLE CONCEPTS, DIVERSE APPLICATIONS, AND THE SCS PACKAGE

    Directory of Open Access Journals (Sweden)

    Kenta Motomura

    2013-02-01

    Full Text Available Protein structure and function information is coded in amino acid sequences. However, the relationship between primary sequences and three-dimensional structures and functions remains enigmatic. Our approach to this fundamental biochemistry problem is based on the frequencies of short constituent sequences (SCSs or words. A protein amino acid sequence is considered analogous to an English sentence, where SCSs are equivalent to words. Availability scores, which are defined as real SCS frequencies in the non-redundant amino acid database relative to their probabilistically expected frequencies, demonstrate the biological usage bias of SCSs. As a result, this frequency-based linguistic approach is expected to have diverse applications, such as secondary structure specifications by structure-specific SCSs and immunological adjuvants with rare or non-existent SCSs. Linguistic similarities (e.g., wide ranges of scale-free distributions and dissimilarities (e.g., behaviors of low-rank samples between proteins and the natural English language have been revealed in the rank-frequency relationships of SCSs or words. We have developed a web server, the SCS Package, which contains five applications for analyzing protein sequences based on the linguistic concept. These tools have the potential to assist researchers in deciphering structurally and functionally important protein sites, species-specific sequences, and functional relationships between SCSs. The SCS Package also provides researchers with a tool to construct amino acid sequences de novo based on the idiomatic usage of SCSs.

  14. A frequency-based linguistic approach to protein decoding and design: Simple concepts, diverse applications, and the SCS Package

    Science.gov (United States)

    Motomura, Kenta; Nakamura, Morikazu; Otaki, Joji M.

    2013-01-01

    Protein structure and function information is coded in amino acid sequences. However, the relationship between primary sequences and three-dimensional structures and functions remains enigmatic. Our approach to this fundamental biochemistry problem is based on the frequencies of short constituent sequences (SCSs) or words. A protein amino acid sequence is considered analogous to an English sentence, where SCSs are equivalent to words. Availability scores, which are defined as real SCS frequencies in the non-redundant amino acid database relative to their probabilistically expected frequencies, demonstrate the biological usage bias of SCSs. As a result, this frequency-based linguistic approach is expected to have diverse applications, such as secondary structure specifications by structure-specific SCSs and immunological adjuvants with rare or non-existent SCSs. Linguistic similarities (e.g., wide ranges of scale-free distributions) and dissimilarities (e.g., behaviors of low-rank samples) between proteins and the natural English language have been revealed in the rank-frequency relationships of SCSs or words. We have developed a web server, the SCS Package, which contains five applications for analyzing protein sequences based on the linguistic concept. These tools have the potential to assist researchers in deciphering structurally and functionally important protein sites, species-specific sequences, and functional relationships between SCSs. The SCS Package also provides researchers with a tool to construct amino acid sequences de novo based on the idiomatic usage of SCSs. PMID:24688703

  15. Power electronics for renewable energy systems, transportation and industrial applications

    CERN Document Server

    Malinowski, Mariusz; Al-Haddad, Kamal

    2014-01-01

    Power Electronics for Renewable Energy, Transportation, and Industrial Applications combines state-of-the-art global expertise to present the latest research on power electronics and its application in transportation, renewable energy, and different industrial applications. This timely book aims to facilitate the implementation of cutting-edge techniques to design problems offering innovative solutions to the growing power demands in small- and large-size industries. Application areas in the book range from smart homes and electric and plug-in hybrid electrical vehicles (PHEVs), to smart distribution and intelligence operation centers where significant energy efficiency improvements can be achieved through the appropriate use and design of power electronics and energy storage devices.

  16. Antimicrobial Films Based on Chitosan and Methylcellulose Containing Natamycin for Active Packaging Applications

    Directory of Open Access Journals (Sweden)

    Serena Santonicola

    2017-10-01

    Full Text Available Biodegradable polymers are gaining interest as antimicrobial carriers in active packaging. In the present study, two active films based on chitosan (1.5% w/v and methylcellulose (3% w/v enriched with natamycin were prepared by casting. The antimicrobial’s release behavior was evaluated by immersion of the films in 95% ethanol (v/v at different temperatures. The natamycin content in the food simulant was determined by reversed-high performance liquid chromatography with diode-array detection (HPLC-DAD. The apparent diffusion (DP and partition (KP/S coefficients were calculated using a mathematical model based on Fick’s Second Law. Results showed that the release of natamycin from chitosan based film (DP = 3.61 × 10−13 cm2/s was slower, when compared with methylcellulose film (DP = 3.20 × 10−8 cm2/s at the same temperature (p < 0.05. To evaluate the antimicrobial efficiency of active films, cheese samples were completely covered with the films, stored at 20 °C for 7 days, and then analyzed for moulds and yeasts. Microbiological analyses showed a significant reduction in yeasts and moulds (7.91 log CFU/g in samples treated with chitosan active films (p < 0.05. The good compatibility of natamycin with chitosan, the low Dp, and antimicrobial properties suggested that the film could be favorably used in antimicrobial packagings.

  17. A 4 × 2 switch matrix in QFN24 package for 0.5–3 GHz application

    International Nuclear Information System (INIS)

    Liu Yuzhe; Mu Pengfei; Gong Renjie; Wan Jing; Zhang Yulin; Yan Yuepeng

    2014-01-01

    This paper presents a 4 × 2 switching matrix implemented in the Win 0.5 μm GaAs pseudomorphic high electron mobility transistor process, it covers the 0.5–3 GHz frequency range. The switch matrix is composed of 4 SPDT switch whose two output ports can simultaneously select the input port and a 4 to 8 bit digital decoder, both the radio frequency (RF) part and the digital part are integrated into one single chip. The chip is packaged in a low cost QFN24 plastic package. On chip shunt, capacitors at the input ports are taken to compensate for the bonding wire inductance effect. The designed switch matrix shows a good measured performance: the insertion loss is less than 5.5 dB, the isolation is no worse than 30 dB, the return loss of input ports and output ports is better than −10 dB, the input 1 dB compression point is better than 25.6 dBm, and the OIP3 is better than 37 dBm. The chip size of the switch matrix is only 1.45 × 1.45 mm 2 . (semiconductor integrated circuits)

  18. Applications of electron beam in nanotechnology

    International Nuclear Information System (INIS)

    Khairul Zaman Hj. Mohd Dahlan; Jamaliah Sharif

    2005-01-01

    The use of radiation technique to process nanostructured materials or to produce nanostructured materials have been shown technically superior as alternative and viable techniques for further commercial exploitation. Research on radiation processing of nanocomposites have been initiated at the Radiation Processing Technology Division of MINT in the past three years. The main focus of this research is to utilize indigenous natural polymer for production of nanocomposites material. Natural rubber/clay composites and thermoplastic natural rubber/clay composites are the important materials that under studied. The natural rubber used in this work is of grade SMRL (Standard Malaysian Rubber) and the clay used was sodium montmorillonite modified with various types of cationic surfactants in order to make the galleries hydrophobic and thus more compatible with the elastomer. The natural rubber/clay nanocomposites were prepared by melt mixing. The compound was then irradiated using electron beam at optimum dose of 250 kGy. X-ray diffraction results indicated intercalation of the natural rubber into silicate interlayer. Upon irradiation at 250 kGy, the tensile strength of the NR/Na-MMT nanocomposites constantly reduced slightly with increasing clay loading, whereas the tensile strengths of NR/DDA-MMT and NR/ODA-MMT increases to optimum levels, 12.1 MPa and 9.5 MPa respectively at 3 phr clay contents. On the other hand, the elongation of NR/DDA-MMT nanocomposites is less affected with increasing clay content up to 3 phr. (author)

  19. Effects of temperature, packaging and electron beam irradiation processing conditions on the property behaviour of Poly (ether-block-amide) blends.

    Science.gov (United States)

    Murray, Kieran A; Kennedy, James E; McEvoy, Brian; Vrain, Olivier; Ryan, Damien; Cowman, Richard; Higginbotham, Clement L

    2014-06-01

    The radiation stability of Poly (ether-block-amide) (PEBA) blended with a multifunctional phenolic antioxidant and a hindered amide light stabiliser was examined under various temperatures, packaging and electron beam processing conditions. FTIR revealed that there were slight alterations to the PEBA before irradiation; however, these became more pronounced following irradiation. The effect of varying the temperature, packaging and processing conditions on the resultant PEBA properties was apparent. For example, rheology demonstrated that the structural properties could be enhanced by manipulating the aforementioned criteria. Mechanical testing exhibited less radiation resistance when the PEBA samples were vacuum packed and exposed to irradiation. MFI and AFM confirmed that the melting strength and surface topography could be reduced/increased depending on the conditions employed. From this study it was concluded that virgin PEBA submerged in dry ice with non-vacuum packaging during the irradiation process, provided excellent radiation resistance (20.9% improvement) in contrast to the traditional method. Copyright © 2014. Published by Elsevier B.V.

  20. Liquid phase exfoliated graphene for electronic applications

    Science.gov (United States)

    Sukumaran, Sheena S.; Jinesh, K. B.; Gopchandran, K. G.

    2017-09-01

    Graphene dispersions were prepared using the liquid phase exfoliation method with three different surfactants. One surfactant was used from each of the surfactant types, anionic, cationic, and non-ionic; those used, were sodium dodecylbenzene sulfonate (SDBS), cetyltrimethylammonium bromide (CTAB) and polyvinylpyrrolidone (PVP), respectively. Raman spectroscopy was used to investigate the number of layers and the nature of any defects present in the exfoliated graphene. The yield of graphene was found to be less with the non-ionic surfactant, PVP. The deconvolution of 2D peaks at ~2700 cm-1 indicated that graphene prepared using these surfactants resulted in sheets consisting of few-layer graphene. The ratio of intensity of the D and G bands in the Raman spectra showed that edge defect density is high for samples prepared with SDBS compared to the other two, and is attributed to the smaller size of the graphene sheets, as shown in the electron micrographs. In the case of the dispersion in PVP, it is found that the sizes of the graphene sheets are highly sensitive to the concentration of the surfactant used. Here, we have made an attempt to investigate the local density of states in the graphene sheets by measuring the tunnelling current-voltage characteristics. Graphene layers have shown consistent p-type behaviour when exfoliated with SDBS and n-type behaviour when exfoliated with CTAB, with a larger band gap for graphene exfoliated using CTAB. Hence, in addition to the known advantages of liquid phase exfoliation, we found that by selecting suitable surfactants, to a certain extent it is possible to tune the band gap and determine the type of majority carriers.

  1. Toward Environmentally Robust Organic Electronics: Approaches and Applications.

    Science.gov (United States)

    Lee, Eun Kwang; Lee, Moo Yeol; Park, Cheol Hee; Lee, Hae Rang; Oh, Joon Hak

    2017-11-01

    Recent interest in flexible electronics has led to a paradigm shift in consumer electronics, and the emergent development of stretchable and wearable electronics is opening a new spectrum of ubiquitous applications for electronics. Organic electronic materials, such as π-conjugated small molecules and polymers, are highly suitable for use in low-cost wearable electronic devices, and their charge-carrier mobilities have now exceeded that of amorphous silicon. However, their commercialization is minimal, mainly because of weaknesses in terms of operational stability, long-term stability under ambient conditions, and chemical stability related to fabrication processes. Recently, however, many attempts have been made to overcome such instabilities of organic electronic materials. Here, an overview is provided of the strategies developed for environmentally robust organic electronics to overcome the detrimental effects of various critical factors such as oxygen, water, chemicals, heat, and light. Additionally, molecular design approaches to π-conjugated small molecules and polymers that are highly stable under ambient and harsh conditions are explored; such materials will circumvent the need for encapsulation and provide a greater degree of freedom using simple solution-based device-fabrication techniques. Applications that are made possible through these strategies are highlighted. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  2. Radioactive waste package assay facility. Volume 1. Application of assay technology

    International Nuclear Information System (INIS)

    Findlay, D.J.S.; Green, T.H.; Molesworth, T.V.; Staniforth, D.; Strachan, N.R.; Rogers, J.D.; Wise, M.O.; Forrest, K.R.

    1992-01-01

    This report, in three volumes, covers the work carried out by Taylor Woodrow Construction Ltd., and two major sub-contractors: Harwell Laboratory (AEA Technology) and Siemens Plessey Controls Ltd., on the development of a radioactive waste package assay facility, for cemented 500 litre intermediate level waste drums. In volume 1, the reasons for assay are considered together with the various techniques that can be used, and the information that can be obtained. The practical problems associated with the use of the various techniques in an integrated assay facility are identified, and the key parameters defined. Engineering and operational features are examined and provisional designs proposed for facilities at three throughput levels: 15,000, 750 and 30 drums per year respectively. The capital and operating costs for such facilities have been estimated. A number of recommendations are made for further work. 16 refs., 14 figs., 13 tabs

  3. Packaged silica microsphere-taper coupling system for robust thermal sensing application.

    Science.gov (United States)

    Yan, Ying-Zhan; Zou, Chang-Ling; Yan, Shu-Bin; Sun, Fang-Wen; Ji, Zhe; Liu, Jun; Zhang, Yu-Guang; Wang, Li; Xue, Chen-Yang; Zhang, Wen-Dong; Han, Zheng-Fu; Xiong, Ji-Jun

    2011-03-28

    We propose and realize a novel packaged microsphere-taper coupling structure (PMTCS) with a high quality factor (Q) up to 5×10(6) by using the low refractive index (RI) ultraviolet (UV) glue as the coating material. The optical loss of the PMTCS is analyzed experimentally and theoretically, which indicate that the Q is limited by the glue absorption and the radiation loss. Moreover, to verify the practicability of the PMTCS, thermal sensing experiments are carried out, showing the excellent convenience and anti-jamming ability of the PMTCS with a high temperature resolution of 1.1×10(-3) ◦C. The experiments also demonstrate that the PMTCS holds predominant advantages, such as the robustness, mobility, isolation, and the PMTCS can maintain the high Q for a long time. The above advantages make the PMTCS strikingly attractive and potential in the fiber-integrated sensors and laser.

  4. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  5. Silicon nanocrystal films for electronic applications

    Energy Technology Data Exchange (ETDEWEB)

    Lechner, Robert W.

    2009-02-06

    Whether nanoparticles of silicon are really suited for such applications, whether layers fabricated from this exhibit semiconducting properties, whether they can be doped, and whether for instance via the doping the conductivity can be tuned, was studied in the present thesis. Starting material for this were on the one hand spherical silicon nanocrystals with a sharp size distribution and mean diameters in the range from 4-50 nm. Furthermore silicon particle were available, which are with 50-500 nm distinctly larger and exhibit a broad distribution of the mean size and a polycrystalline fine structure with strongly bifurcated external morphology. The small conductivities and tje low mobility values of the charge carriers in the layers of silicon nanocrystals suggest to apply suited thermal after-treatment procedures. So was found that the aluminium-induced layer exchange (ALILE) also can be transferred to the porous layers of nanocrystals. With the deuteron passivation a method was available to change the charge-carrier concentration in the polycrystalline layers. Additionally to ALILE laser crystallization as alternative after-treatment procedure of the nanocrystal layers was studied.

  6. Molecular modeling and multiscaling issues for electronic material applications

    CERN Document Server

    Iwamoto, Nancy; Yuen, Matthew; Fan, Haibo

    Volume 1 : Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications.  Part I presents  the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue.  Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example ...

  7. Food irradiation and packaging

    International Nuclear Information System (INIS)

    Kilcast, David

    1988-01-01

    This outline review was written for 'Food Manufacture'. It deals with the known effects of irradiation on current packaging materials (glass, cellulosics, organic polymers and metals), and their implications for the effective application of the process. (U.K.)

  8. Sample Development on Java Smart-Card Electronic Wallet Application

    OpenAIRE

    Toma Cristian

    2009-01-01

    In this paper, are highlighted concepts as: complete Java card application, life cycle of an applet, and a practical electronic wallet sample implemented in Java card technology. As a practical approach it would be interesting building applets for ID, Driving License, Health-Insurance smart cards, for encrypt and digitally sign documents, for E-Commerce and for accessing critical resources in government and military field. The end of this article it is presented a java card electronic wallet ...

  9. Industrial applications of electron beam; Przemyslowe zastosowamia wiazki elektronow

    Energy Technology Data Exchange (ETDEWEB)

    Chmielewski, A G [Institute of Nuclear Chemistry and Technology, Warsaw (Poland)

    1997-10-01

    The review of industrial applications with use of electron beams has been done. Especially the radiation technologies being developed in Poland have been shown. Industrial installations with electron accelerators as radiation source have been applied for: modification of polymers; modification of thyristors; sterilization of health care materials; radiopreservation of food and other consumer products; purification of combustion flue gases in heat and power plants. 14 refs, 6 tabs, 7 figs.

  10. ADaCGH: A parallelized web-based application and R package for the analysis of aCGH data.

    Directory of Open Access Journals (Sweden)

    Ramón Díaz-Uriarte

    Full Text Available BACKGROUND: Copy number alterations (CNAs in genomic DNA have been associated with complex human diseases, including cancer. One of the most common techniques to detect CNAs is array-based comparative genomic hybridization (aCGH. The availability of aCGH platforms and the need for identification of CNAs has resulted in a wealth of methodological studies. METHODOLOGY/PRINCIPAL FINDINGS: ADaCGH is an R package and a web-based application for the analysis of aCGH data. It implements eight methods for detection of CNAs, gains and losses of genomic DNA, including all of the best performing ones from two recent reviews (CBS, GLAD, CGHseg, HMM. For improved speed, we use parallel computing (via MPI. Additional information (GO terms, PubMed citations, KEGG and Reactome pathways is available for individual genes, and for sets of genes with altered copy numbers. CONCLUSIONS/SIGNIFICANCE: ADACGH represents a qualitative increase in the standards of these types of applications: a all of the best performing algorithms are included, not just one or two; b we do not limit ourselves to providing a thin layer of CGI on top of existing BioConductor packages, but instead carefully use parallelization, examining different schemes, and are able to achieve significant decreases in user waiting time (factors up to 45x; c we have added functionality not currently available in some methods, to adapt to recent recommendations (e.g., merging of segmentation results in wavelet-based and CGHseg algorithms; d we incorporate redundancy, fault-tolerance and checkpointing, which are unique among web-based, parallelized applications; e all of the code is available under open source licenses, allowing to build upon, copy, and adapt our code for other software projects.

  11. Antioxidant films based on cross-linked methyl cellulose and native Chilean berry for food packaging applications.

    Science.gov (United States)

    López de Dicastillo, Carol; Rodríguez, Francisco; Guarda, Abel; Galotto, Maria José

    2016-01-20

    Development of antioxidant and antimicrobial active food packaging materials based on biodegradable polymer and natural plant extracts has numerous advantages as reduction of synthetic additives into the food, reduction of plastic waste, and food protection against microorganisms and oxidation reactions. In this way, active films based on methylcellulose (MC) and maqui (Aristotelia chilensis) berry fruit extract, as a source of antioxidants agents, were studied. On the other hand, due to the high water affinity of MC, this polymer was firstly cross-linked with glutaraldehyde (GA) at different concentrations. The results showed that the addition of GA decreased water solubility, swelling, water vapor permeability of MC films, and the release of antioxidant substances from the active materials increased with the concentration of GA. Natural extract and active cross-linked films were characterized in order to obtain the optimal formulation with the highest antioxidant activity and the best physical properties for latter active food packaging application. Copyright © 2015 Elsevier Ltd. All rights reserved.

  12. Applications and Advances in Electronic-Nose Technologies

    Directory of Open Access Journals (Sweden)

    Manuela Baietto

    2009-06-01

    Full Text Available Electronic-nose devices have received considerable attention in the field of sensor technology during the past twenty years, largely due to the discovery of numerous applications derived from research in diverse fields of applied sciences. Recent applications of electronic nose technologies have come through advances in sensor design, material improvements, software innovations and progress in microcircuitry design and systems integration. The invention of many new e-nose sensor types and arrays, based on different detection principles and mechanisms, is closely correlated with the expansion of new applications. Electronic noses have provided a plethora of benefits to a variety of commercial industries, including the agricultural, biomedical, cosmetics, environmental, food, manufacturing, military, pharmaceutical, regulatory, and various scientific research fields. Advances have improved product attributes, uniformity, and consistency as a result of increases in quality control capabilities afforded by electronic-nose monitoring of all phases of industrial manufacturing processes. This paper is a review of the major electronic-nose technologies, developed since this specialized field was born and became prominent in the mid 1980s, and a summarization of some of the more important and useful applications that have been of greatest benefit to man.

  13. Proceedings of the FNCA workshop on application of electron accelerator

    International Nuclear Information System (INIS)

    Yoshii, Fumio; Kume, Tamikazu

    2003-02-01

    'Forum for Nuclear Cooperation in Asia (FNCA) Workshop on Application of Electron Accelerator' was sponsored by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) and hosted by Japan Atomic Energy Research Institute (JAERI) and Japan Atomic Industry Forum (JAIF). It was held at the Takasaki Radiation Chemistry Research Establishment (TRCRE), JAERI, Takasaki, Japan from 28 January to 1 February, 2002. The Workshop was attended by experts on application of electron accelerator from each of the participating countries, i.e. China, Indonesia, Korea, Malaysia, The Philippines, Thailand and Vietnam and 16 participants from Japan. A total of 17 papers including invited papers on the current status of application of electron accelerator in the participating countries were presented. The characteristics of various kinds of electron accelerators were introduced. Current research and development on the utilization radiation processing for natural rubber latex, natural polymer solution, polymer films, sterilization of spices and seeds, radiation treatment of flue gases and dioxin in liquid, solid, and gases were reported. Based on the proposed needs from the participating countries, the work plan was discussed and agreed on application of electron accelerator for liquid and for solid (thin films and granules/powder). All manuscripts submitted by every speaker were included in the proceedings. The 16 of the presented papers are indexed individually. (J.P.N.)

  14. Proceedings of the FNCA workshop on application of electron accelerator

    Energy Technology Data Exchange (ETDEWEB)

    Yoshii, Fumio; Kume, Tamikazu (eds.) [Japan Atomic Energy Research Inst., Takasaki, Gunma (Japan). Takasaki Radiation Chemistry Research Establishment

    2003-02-01

    'Forum for Nuclear Cooperation in Asia (FNCA) Workshop on Application of Electron Accelerator' was sponsored by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) and hosted by Japan Atomic Energy Research Institute (JAERI) and Japan Atomic Industry Forum (JAIF). It was held at the Takasaki Radiation Chemistry Research Establishment (TRCRE), JAERI, Takasaki, Japan from 28 January to 1 February, 2002. The Workshop was attended by experts on application of electron accelerator from each of the participating countries, i.e. China, Indonesia, Korea, Malaysia, The Philippines, Thailand and Vietnam and 16 participants from Japan. A total of 17 papers including invited papers on the current status of application of electron accelerator in the participating countries were presented. The characteristics of various kinds of electron accelerators were introduced. Current research and development on the utilization radiation processing for natural rubber latex, natural polymer solution, polymer films, sterilization of spices and seeds, radiation treatment of flue gases and dioxin in liquid, solid, and gases were reported. Based on the proposed needs from the participating countries, the work plan was discussed and agreed on application of electron accelerator for liquid and for solid (thin films and granules/powder). All manuscripts submitted by every speaker were included in the proceedings. The 16 of the presented papers are indexed individually. (J.P.N.)

  15. Adhesives technology for electronic applications materials, processing, reliability

    CERN Document Server

    Licari, James J

    2011-01-01

    Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book par

  16. Handbook of polymer coatings for electronics chemistry, technology and applications

    CERN Document Server

    Licari, James J

    1990-01-01

    This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered

  17. Biological applications of ultraviolet free-electron lasers

    International Nuclear Information System (INIS)

    Sutherland, J.C.

    1997-10-01

    This review examines the possibilities for biological research using the three ultraviolet free-electron lasers that are nearing operational status in the US. The projected operating characteristics of major interest in biological research of the free-electron lasers at Brookhaven National Laboratory, the Thomas Jefferson National Accelerator Facility, and Duke University are presented. Experimental applications in the areas of far- and vacuum ultraviolet photophysics and photochemistry, structural biology, environmental photobiology, and medical research are discussed and the prospects for advances in these areas, based upon the characteristics of the new ultraviolet free-electron lasers, are evaluated

  18. 10 MeV RF electron linac for industrial applications

    International Nuclear Information System (INIS)

    2017-01-01

    Electron linacs have found numerous applications in the field of radiation processing on an industrial scale. High power RF electron linacs are commonly used for food irradiation, medical sterilization, cross-linking of polymers, etc. For this purpose, the 10 MeV RF linac has been indigenously designed, developed, commissioned and is being used regularly at 3 kW beam power. This paper gives a brief description of the linac and its utilization for various applications. Safety considerations and regulatory aspects of the linac are also discussed

  19. Sticker electronics

    KAUST Repository

    Hussain, Muhammad Mustafa; Torres Sevilla, Galo Andres; Diaz Cordero, Marlon Steven

    2017-01-01

    Electronic stickers may be manufactured on flexible substrates (110, 120, 130) as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces

  20. WASTE PACKAGE TRANSPORTER DESIGN

    International Nuclear Information System (INIS)

    Weddle, D.C.; Novotny, R.; Cron, J.

    1998-01-01

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''

  1. WASTE PACKAGE TRANSPORTER DESIGN

    Energy Technology Data Exchange (ETDEWEB)

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  2. Electron spectroscopy for surface analysis - the ES300 electron spectrometer and its applications

    International Nuclear Information System (INIS)

    Walker, J.A.J.; Price, W.B.

    1980-07-01

    The features of the ES300 electron spectrometer are described together with factors which affect the energy spectrum, experimental variables and interpretation of the spectral information. A discussion of five applications illustrates the use of X-ray photo-electron spectroscopy (XPS) in the diverse work of the Risley Nuclear Power Development Laboratories (RNL). The analytical results are given for each of the examples and their interpretation discussed in the chemical context of the original problem. (author)

  3. Dosimetric differences between electrons beams with rio applicators of GMV and conventional Elekta applicators

    International Nuclear Information System (INIS)

    Sendon del Rio, J. R.; Ayala Lazaro, R.; Jimenez Rojas, M. R.; Gomez Cores, S.; Gonzalez Ruiz, C.; Garcia Hernandez, M. J.; Lopez Bote, M. A.

    2013-01-01

    Intraoperative radiotherapy (River) is a form of cancer treatment that consists of a session of radiation ionizing on macroscopic tumor or tumor bed surgically exposed. In our institution, is administered with beams of electrons in a Linear Accelerator for use general and adapted through specific (applicators RIVER). In this work we studied the dosimetry differences between modified by applicators electron beams conventional and they changed by applicators River. (Author)

  4. Radiolysis products and sensory properties of electron-beam-irradiated high-barrier food-packaging films containing a buried layer of recycled low-density polyethylene.

    Science.gov (United States)

    Chytiri, S D; Badeka, A V; Riganakos, K A; Kontominas, M G

    2010-04-01

    The aim was to study the effect of electron-beam irradiation on the production of radiolysis products and sensory changes in experimental high-barrier packaging films composed of polyamide (PA), ethylene-vinyl alcohol (EVOH) and low-density polyethylene (LDPE). Films contained a middle buried layer of recycled LDPE, while films containing 100% virgin LDPE as the middle buried layer were taken as controls. Irradiation doses ranged between zero and 60 kGy. Generally, a large number of radiolysis products were produced during electron-beam irradiation, even at the lower absorbed doses of 5 and 10 kGy (approved doses for food 'cold pasteurization'). The quantity of radiolysis products increased with irradiation dose. There were no significant differences in radiolysis products identified between samples containing a recycled layer of LDPE and those containing virgin LDPE (all absorbed doses), indicating the 'functional barrier' properties of external virgin polymer layers. Sensory properties (mainly taste) of potable water were affected after contact with irradiated as low as 5 kGy packaging films. This effect increased with increasing irradiation dose.

  5. On the applicability of one- and many-electron quantum chemistry models for hydrated electron clusters

    Science.gov (United States)

    Turi, László

    2016-04-01

    We evaluate the applicability of a hierarchy of quantum models in characterizing the binding energy of excess electrons to water clusters. In particular, we calculate the vertical detachment energy of an excess electron from water cluster anions with methods that include one-electron pseudopotential calculations, density functional theory (DFT) based calculations, and ab initio quantum chemistry using MP2 and eom-EA-CCSD levels of theory. The examined clusters range from the smallest cluster size (n = 2) up to nearly nanosize clusters with n = 1000 molecules. The examined cluster configurations are extracted from mixed quantum-classical molecular dynamics trajectories of cluster anions with n = 1000 water molecules using two different one-electron pseudopotenial models. We find that while MP2 calculations with large diffuse basis set provide a reasonable description for the hydrated electron system, DFT methods should be used with precaution and only after careful benchmarking. Strictly tested one-electron psudopotentials can still be considered as reasonable alternatives to DFT methods, especially in large systems. The results of quantum chemistry calculations performed on configurations, that represent possible excess electron binding motifs in the clusters, appear to be consistent with the results using a cavity structure preferring one-electron pseudopotential for the hydrated electron, while they are in sharp disagreement with the structural predictions of a non-cavity model.

  6. On the applicability of one- and many-electron quantum chemistry models for hydrated electron clusters

    Energy Technology Data Exchange (ETDEWEB)

    Turi, László, E-mail: turi@chem.elte.hu [Department of Physical Chemistry, Eötvös Loránd University, P.O. Box 32, H-1518 Budapest 112 (Hungary)

    2016-04-21

    We evaluate the applicability of a hierarchy of quantum models in characterizing the binding energy of excess electrons to water clusters. In particular, we calculate the vertical detachment energy of an excess electron from water cluster anions with methods that include one-electron pseudopotential calculations, density functional theory (DFT) based calculations, and ab initio quantum chemistry using MP2 and eom-EA-CCSD levels of theory. The examined clusters range from the smallest cluster size (n = 2) up to nearly nanosize clusters with n = 1000 molecules. The examined cluster configurations are extracted from mixed quantum-classical molecular dynamics trajectories of cluster anions with n = 1000 water molecules using two different one-electron pseudopotenial models. We find that while MP2 calculations with large diffuse basis set provide a reasonable description for the hydrated electron system, DFT methods should be used with precaution and only after careful benchmarking. Strictly tested one-electron psudopotentials can still be considered as reasonable alternatives to DFT methods, especially in large systems. The results of quantum chemistry calculations performed on configurations, that represent possible excess electron binding motifs in the clusters, appear to be consistent with the results using a cavity structure preferring one-electron pseudopotential for the hydrated electron, while they are in sharp disagreement with the structural predictions of a non-cavity model.

  7. Polymeric phase change nanocomposite (PMMA/Fe:ZnO) for electronic packaging application

    Science.gov (United States)

    Maji, Pranabi; Choudhary, Ram Bilash; Majhi, Malati

    2018-01-01

    This paper reported the effect of Fe-doped ZnO (Fe:ZnO) nanoparticles on the structural, morphological, thermal, optical and dielectric properties of PMMA matrix. Fe-doped ZnO nanoparticle was synthesized by co-precipitation method, after its surface modification incorporated into the PMMA matrix by free radical polymerization method. The phase analysis and crystal structure were investigated by XRD and FTIR technique. These studies confirmed the chemical structure of the PMMA/Fe:ZnO nanocomposite. FESEM image showed the pyramidal shape and high porosity of PMMA/Fe:ZnO nanocomposite. Thermal analysis of the sample was carried out by thermo-gravimetric analyzer. PMMA/Fe:ZnO nanocomposite was found to have better thermal stability compared to pure one. Broadband dielectric spectroscopic technique was used to investigate the transition of electrical properties of Fe-doped ZnO nanoparticle reinforced PMMA matrix in temperature range 313-373 K. The results elucidated a phase transition from glassy to rubbery state at 344 K.

  8. Optimization and application of electron acceleration in relativistic laser plasmas

    International Nuclear Information System (INIS)

    Koenigstein, Thomas

    2013-01-01

    This thesis describes experiments and simulations of the acceleration of electrons to relativistic energies (toward γ e ∼ 10 3 ) by structures in plasmas which are generated by ultrashort (pulse length < 10 -14 s) laser pulses. The first part of this work discusses experiments in a parameter space where quasimonoenergetic electron bunches are generated in subcritical (gaseous) plasmas and compares them to analytical scalings. A primary concern in this work is to optimize the stability of the energy and the pointing of the electrons. The second part deals with acceleration of electrons along the surface of solid substrates by laser-plasma interaction. The measurements show good agreement with existing analytical scalings and dedicated numerical simulations. In the third part, two new concepts for multi-stage acceleration will be presented and parameterised by analytical considerations and numerical simulations. The first method uses electron pairs, as produced in the first part, to transfer energy from the first bunch to the second by means of a plasma wave. The second method utilizes a low intensity laser pulse in order to inject electrons from a neutral gas into the accelerating phase of a plasma wave. The final chapter proposes and demonstrates a first application that has been developed in collaboration with ESA. The use of electron beams with exponential energy distribution, as in the second part of this work, offers the potential to investigate the resistance of electronic components against space radiation exposure.

  9. License Application Design Selection Feature Report: Waste Package Self Shielding Design Feature 13

    International Nuclear Information System (INIS)

    Tang, J.S.

    2000-01-01

    In the Viability Assessment (VA) reference design, handling of waste packages (WPs) in the emplacement drifts is performed remotely, and human access to the drifts is precluded when WPs are present. This report will investigate the feasibility of using a self-shielded WP design to reduce the radiation levels in the emplacement drifts to a point that, when coupled with ventilation, will create an acceptable environment for human access. This provides the benefit of allowing human entry to emplacement drifts to perform maintenance on ground support and instrumentation, and carry out performance confirmation activities. More direct human control of WP handling and emplacement operations would also be possible. However, these potential benefits must be weighed against the cost of implementation, and potential impacts on pre- and post-closure performance of the repository and WPs. The first section of this report will provide background information on previous investigations of the self-shielded WP design feature, summarize the objective and scope of this document, and provide quality assurance and software information. A shielding performance and cost study that includes several candidate shield materials will then be performed in the subsequent section to allow selection of two self-shielded WP design options for further evaluation. Finally, the remaining sections will evaluate the impacts of the two WP self-shielding options on the repository design, operations, safety, cost, and long-term performance of the WPs with respect to the VA reference design

  10. Functional chitosan-based grapefruit seed extract composite films for applications in food packaging technology

    International Nuclear Information System (INIS)

    Tan, Y.M.; Lim, S.H.; Tay, B.Y.; Lee, M.W.; Thian, E.S.

    2015-01-01

    Highlights: • Chitosan-based grapefruit seed extract (GFSE) films were solution casted. • GFSE was uniformly dispersed within all chitosan film matrices. • All chitosan-based composite films showed remarkable transparency. • Increasing amounts of GFSE incorporated increased the elongation at break of films. • Chitosan-based GFSE composite films inhibited the proliferation of fungal growth. - Abstract: Chitosan-based composite films with different amounts of grapefruit seed extract (GFSE) (0.5, 1.0 and 1.5% v/v) were fabricated via solution casting technique. Experimental results showed that GFSE was uniformly dispersed within all chitosan film matrices. The presence of GFSE made the films more amorphous and tensile strength decreased, while elongation at break values increased as GFSE content increased. Results from the measurement of light transmission revealed that increasing amounts of GFSE (from 0.5 to 1.5% v/v) did not affect transparency of the films. Furthermore, packaging of bread samples with chitosan-based GFSE composite films inhibited the proliferation of fungal growth as compared to control samples. Hence, chitosan-based GFSE composite films have the potential to be a useful material in the area of food technology

  11. Covalent immobilization of lysozyme on ethylene vinyl alcohol films for nonmigrating antimicrobial packaging applications.

    Science.gov (United States)

    Muriel-Galet, V; Talbert, J N; Hernandez-Munoz, P; Gavara, R; Goddard, J M

    2013-07-10

    The objective of this study was to develop a new antimicrobial film, in which lysozyme was covalently attached onto two different ethylene vinyl alcohol copolymers (EVOH 29 and EVOH 44). The EVOH surface was modified with UV irradiation treatment to generate carboxylic acid groups, and lysozyme was covalently attached to the functionalized polymer surface. Surface characterization of control and modified films was performed using attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and dye assay. The value of protein loading after attachment on the surface was 8.49 μg protein/cm(2) and 5.74 μg protein/cm(2) for EVOH 29 and EVOH 44, respectively, after 10 min UV irradiation and bioconjugation. The efficacy of the EVOH-lysozyme films was assessed using Micrococcus lysodeikticus. The antimicrobial activity of the films was tested against Listeria monocytogenes and was similar to an equivalent amount of free enzyme. The reduction was 1.08 log for EVOH 29-lysozyme, 0.95 log for EVOH 44-lysozyme, and 1.34 log for free lysozyme. This work confirmed the successful use of lysozyme immobilization on the EVOH surface for antimicrobial packaging.

  12. Silver Nanoparticles Synthesized Using Mint Extract and their Application in Chitosan/Gelatin Composite Packaging Film

    Science.gov (United States)

    Bhoir, Shraddha A.; Chawla, S. P.

    The present study reports synthesis of silver nanoparticles (AgNPs) using mint extract (ME) in the presence of polyvinyl alcohol (PVA) as capping material. PVA, ME and silver nitrate at concentration of 1%, 0.01% and 0.02%, respectively were found to be optimum for the synthesis of nanoparticles. The formation of AgNPs was confirmed by measuring surface plasmon resonance (SPR) peak. The intensity of SPR peak remained unaltered thus suggesting stability of colloid without aggregation during storage. The nanoparticles inhibited the growth of food borne bacteria namely Escherichia coli, Pseudomonas aeruginosa and Bacillus cereus. The incorporation of these nanoparticles in chitosan and gelatin blend resulted in homogenous films. Mechanical properties and water vapor transmission rate of chitosan-gelatin films improved due to addition of AgNPs, whereas optical (opacity and UV light transmittance) and oxygen permeability properties remained unchanged. These films had the ability to inhibit growth of 5 log CFU of the above test organisms. These findings suggest that the AgNPs obtained by reduction of silver by ME can be effectively utilized to prepare antibacterial eco-friendly food packaging material.

  13. Application of laser spot cutting on spring contact probe for semiconductor package inspection

    Science.gov (United States)

    Lee, Dongkyoung; Cho, Jungdon; Kim, Chan Ho; Lee, Seung Hwan

    2017-12-01

    A packaged semiconductor has to be electrically tested to make sure they are free of any manufacturing defects. The test interface, typically employed between a Printed Circuit Board and the semiconductor devices, consists of densely populated Spring Contact Probe (SCP). A standard SCP typically consists of a plunger, a barrel, and an internal spring. Among these components, plungers are manufactured by a stamping process. After stamping, plunger connecting arms need to be cut into pieces. Currently, mechanical cutting has been used. However, it may damage to the body of plungers due to the mechanical force engaged at the cutting point. Therefore, laser spot cutting is considered to solve this problem. The plunger arm is in the shape of a rectangular beam, 50 μm (H) × 90 μm (W). The plunger material used for this research is gold coated beryllium copper. Laser parameters, such as power and elapsed time, have been selected to study laser spot cutting. Laser material interaction characteristics such as a crater size, material removal zone, ablation depth, ablation threshold, and full penetration are observed. Furthermore, a carefully chosen laser parameter (Etotal = 1000mJ) to test feasibility of laser spot cutting are applied. The result show that laser spot cutting can be applied to cut SCP.

  14. Functional chitosan-based grapefruit seed extract composite films for applications in food packaging technology

    Energy Technology Data Exchange (ETDEWEB)

    Tan, Y.M. [Department of Mechanical Engineering, National University of Singapore (Singapore); Lim, S.H.; Tay, B.Y. [Forming Technology Group, Singapore Institute of Manufacturing Technology (Singapore); Lee, M.W. [Food Innovation and Resource Centre, Singapore Polytechnic (Singapore); Thian, E.S., E-mail: mpetes@nus.edu.sg [Department of Mechanical Engineering, National University of Singapore (Singapore)

    2015-09-15

    Highlights: • Chitosan-based grapefruit seed extract (GFSE) films were solution casted. • GFSE was uniformly dispersed within all chitosan film matrices. • All chitosan-based composite films showed remarkable transparency. • Increasing amounts of GFSE incorporated increased the elongation at break of films. • Chitosan-based GFSE composite films inhibited the proliferation of fungal growth. - Abstract: Chitosan-based composite films with different amounts of grapefruit seed extract (GFSE) (0.5, 1.0 and 1.5% v/v) were fabricated via solution casting technique. Experimental results showed that GFSE was uniformly dispersed within all chitosan film matrices. The presence of GFSE made the films more amorphous and tensile strength decreased, while elongation at break values increased as GFSE content increased. Results from the measurement of light transmission revealed that increasing amounts of GFSE (from 0.5 to 1.5% v/v) did not affect transparency of the films. Furthermore, packaging of bread samples with chitosan-based GFSE composite films inhibited the proliferation of fungal growth as compared to control samples. Hence, chitosan-based GFSE composite films have the potential to be a useful material in the area of food technology.

  15. Estimating added sugars in US consumer packaged goods: An application to beverages in 2007–08

    Science.gov (United States)

    Ng, Shu Wen; Bricker, Gregory; Li, Kuo-ping; Yoon, Emily Ford; Kang, Jiyoung; Westrich, Brian

    2015-01-01

    This study developed a method to estimate added sugar content in consumer packaged goods (CPG) that can keep pace with the dynamic food system. A team including registered dietitians, a food scientist and programmers developed a batch-mode ingredient matching and linear programming (LP) approach to estimate the amount of each ingredient needed in a given product to produce a nutrient profile similar to that reported on its nutrition facts label (NFL). Added sugar content was estimated for 7021 products available in 2007–08 that contain sugar from ten beverage categories. Of these, flavored waters had the lowest added sugar amounts (4.3g/100g), while sweetened dairy and dairy alternative beverages had the smallest percentage of added sugars (65.6% of Total Sugars; 33.8% of Calories). Estimation validity was determined by comparing LP estimated values to NFL values, as well as in a small validation study. LP estimates appeared reasonable compared to NFL values for calories, carbohydrates and total sugars, and performed well in the validation test; however, further work is needed to obtain more definitive conclusions on the accuracy of added sugar estimates in CPGs. As nutrition labeling regulations evolve, this approach can be adapted to test for potential product-specific, category-level, and population-level implications. PMID:26273127

  16. Estimating added sugars in US consumer packaged goods: An application to beverages in 2007-08.

    Science.gov (United States)

    Ng, Shu Wen; Bricker, Gregory; Li, Kuo-Ping; Yoon, Emily Ford; Kang, Jiyoung; Westrich, Brian

    2015-11-01

    This study developed a method to estimate added sugar content in consumer packaged goods (CPG) that can keep pace with the dynamic food system. A team including registered dietitians, a food scientist and programmers developed a batch-mode ingredient matching and linear programming (LP) approach to estimate the amount of each ingredient needed in a given product to produce a nutrient profile similar to that reported on its nutrition facts label (NFL). Added sugar content was estimated for 7021 products available in 2007-08 that contain sugar from ten beverage categories. Of these, flavored waters had the lowest added sugar amounts (4.3g/100g), while sweetened dairy and dairy alternative beverages had the smallest percentage of added sugars (65.6% of Total Sugars; 33.8% of Calories). Estimation validity was determined by comparing LP estimated values to NFL values, as well as in a small validation study. LP estimates appeared reasonable compared to NFL values for calories, carbohydrates and total sugars, and performed well in the validation test; however, further work is needed to obtain more definitive conclusions on the accuracy of added sugar estimates in CPGs. As nutrition labeling regulations evolve, this approach can be adapted to test for potential product-specific, category-level, and population-level implications.

  17. Empirical models for end-use properties prediction of LDPE: application in the flexible plastic packaging industry

    Directory of Open Access Journals (Sweden)

    Maria Carolina Burgos Costa

    2008-03-01

    Full Text Available The objective of this work is to develop empirical models to predict end use properties of low density polyethylene (LDPE resins as functions of two intrinsic properties easily measured in the polymers industry. The most important properties for application in the flexible plastic packaging industry were evaluated experimentally for seven commercial polymer grades. Statistical correlation analysis was performed for all variables and used as the basis for proper choice of inputs to each model output. Intrinsic properties selected for resin characterization are fluidity index (FI, which is essentially an indirect measurement of viscosity and weight average molecular weight (MW, and density. In general, models developed are able to reproduce and predict experimental data within experimental accuracy and show that a significant number of end use properties improve as the MW and density increase. Optical properties are mainly determined by the polymer morphology.

  18. Detailed Wave Function Analysis for Multireference Methods: Implementation in the Molcas Program Package and Applications to Tetracene.

    Science.gov (United States)

    Plasser, Felix; Mewes, Stefanie A; Dreuw, Andreas; González, Leticia

    2017-11-14

    High-level multireference computations on electronically excited and charged states of tetracene are performed, and the results are analyzed using an extensive wave function analysis toolbox that has been newly implemented in the Molcas program package. Aside from verifying the strong effect of dynamic correlation, this study reveals an unexpected critical influence of the atomic orbital basis set. It is shown that different polarized double-ζ basis sets produce significantly different results for energies, densities, and overall wave functions, with the best performance obtained for the atomic natural orbital (ANO) basis set by Pierloot et al. Strikingly, the ANO basis set not only reproduces the energies but also performs exceptionally well in terms of describing the diffuseness of the different states and of their attachment/detachment densities. This study, thus, not only underlines the fact that diffuse basis functions are needed for an accurate description of the electronic wave functions but also shows that, at least for the present example, it is enough to include them implicitly in the contraction scheme.

  19. Stretchable electronics for wearable and high-current applications

    Science.gov (United States)

    Hilbich, Daniel; Shannon, Lesley; Gray, Bonnie L.

    2016-04-01

    Advances in the development of novel materials and fabrication processes are resulting in an increased number of flexible and stretchable electronics applications. This evolving technology enables new devices that are not readily fabricated using traditional silicon processes, and has the potential to transform many industries, including personalized healthcare, consumer electronics, and communication. Fabrication of stretchable devices is typically achieved through the use of stretchable polymer-based conductors, or more rigid conductors, such as metals, with patterned geometries that can accommodate stretching. Although the application space for stretchable electronics is extensive, the practicality of these devices can be severely limited by power consumption and cost. Moreover, strict process flows can impede innovation that would otherwise enable new applications. In an effort to overcome these impediments, we present two modified approaches and applications based on a newly developed process for stretchable and flexible electronics fabrication. This includes the development of a metallization pattern stamping process allowing for 1) stretchable interconnects to be directly integrated with stretchable/wearable fabrics, and 2) a process variation enabling aligned multi-layer devices with integrated ferromagnetic nanocomposite polymer components enabling a fully-flexible electromagnetic microactuator for large-magnitude magnetic field generation. The wearable interconnects are measured, showing high conductivity, and can accommodate over 20% strain before experiencing conductive failure. The electromagnetic actuators have been fabricated and initial measurements show well-aligned, highly conductive, isolated metal layers. These two applications demonstrate the versatility of the newly developed process and suggest potential for its furthered use in stretchable electronics and MEMS applications.

  20. New Approach on Sunflower Seeds Processing: Kernel with Several Technological Applications, Husks Package, Different Fat Content Tahini and Halva Properties

    Directory of Open Access Journals (Sweden)

    Vlad Mureşan

    2015-11-01

    Full Text Available Sunflower is the basic oil-crop in Central and Eastern Europe. As sunflower seeds are mainly used for oil production, the most of the kernels available on the market show high oil content (>55%. Consequently, when sunflower kernel paste (tahini is used in different food products, oil exudation occurs.The aim of current work was to use entirely the sunflower seeds by partially defatting and obtaining different fat content sunflower pastes with multiple food applications, while using the husks for developing an ecological package. Sunflower kernels were industrially roasted in a continuous roasting drum.  Raw and roasted kernels were pressed at pilot plant scale by using a laboratory expeller. Partially defatted sunflower paste was obtained from the press cakes by employing a ball mill. Different fat content tahini samples were obtained by adding the required amount of oil to the partially defatted paste. Tahini samples fat content ranged from 45 to 60%. Tahini and halva were chosen as a study model. Decreasing tahini oil content increased its colloidal stability during storage, a similar trend being noticed when halva samples were stored. Moreover, halva texture analysis and sensory characteristics were assessed for selecting the optimum tahini oil content and thermal treatment. Various sunflower kernel food applications were proposed by obtaining the related prototypes at pilot plant scale: roasted sunflower kernel biscuits, sunflower spreadable cream filled biscuits, hummus, sunflower paste coated in chocolate, sunflower kernel chikki and bars, as well as an innovative ecological package based on the resulting sunflower husks and a starch adhesive. 

  1. Modified hydrotalcite-like compounds as active fillers of biodegradable polymers for drug release and food packaging applications.

    Science.gov (United States)

    Costantino, Umberto; Nocchetti, Morena; Tammaro, Loredana; Vittoria, Vittoria

    2012-11-01

    This review treats the recent patents and related literature, mainly from the Authors laboratories, on biomedical and food packaging applications of nano-composites constituted of biodegradable polymers filled with micro or nano crystals of organically modified Layered Double Hydroxides of Hydrotalcite type. After a brief outline of the chemical and structural aspects of Hydrotalcite-like compounds (HTlc) and of their manipulation via intercalation of functional molecular anions to obtain materials for numerous, sometime unexpected applications, the review approaches the theme in three separated parts. Part 1 deals with the synthetic method used to prepare the pristine Mg-Al and Zn-Al HTlc and with the procedures of their functionalization with anti-inflammatory (diclofenac), antibacterial (chloramphenicol hemisuccinate), antifibrinolytic (tranexamic acid) drugs and with benzoates with antimicrobial activity. Procedures used to form (nano) composites of polycaprolactone, used as an example of biodegradable polymer, and functionalized HTlc are also reported. Part 2 discusses a patent and related papers on the preparation and biomedical use of a controlled delivery system of the above mentioned pharmacologically active substances. After an introduction dealing with the recent progress in the field of local drug delivery systems, the chemical and structural aspects of the patented system constituted of a biodegradable polymer and HTlc loaded with the active substances will be presented together with an extensive discussion of the drug release in physiological medium. Part 3 deals with a recent patent and related papers on chemical, structural and release property of antimicrobial species of polymeric films containing antimicrobial loaded HTlc able to act as active packaging for food products prolonging their shelf life.

  2. User's guide for ABCI version 9.4 (azimuthal beam cavity interaction) and introducing the ABCI windows application package

    International Nuclear Information System (INIS)

    Chin, Yong Ho

    2005-12-01

    ABCI is a computer program which solves the Maxwell equations directly in the time domain when a bunched beam goes through an axi-symmetric structure on or off axis. An arbitrary charge distribution can be defined by the user (default=Gaussian). This document is meant to be a comprehensive user's guide to describe all features of ABCI version 9.4, including also all additions since the release of the guide for version 8.8. All appendixes from the previous two user's guides that contain different important topics are also quoted. The main advantages of ABCI lie in its high speed of execution, the minimum use of computer memory, implementation of Napoly integration method and many elaborate options of Fourier transformations. In the version 9.4, even wake potentials for a counter-rotating beam of opposite charge can be calculated instead of usual ones for a beam trailing the driving beams. Now, the Windows application version of ABCI is available as a package which includes ABCI stand-alone executable modules, the sample input files, the source codes, manuals and the Windows version of TopDrawer, TopDrawW. This package can be downloaded from the ABCI home page: http://abci.kek.jp/abci.htm. Just by drag-and-droping an input file on the icon of ABCI application, all the calculation results pop out. Neither compilation of the source code nor installation of the program to Windows is necessary. Together with the TopDrawer for Windows, all works (computation of wake fields, generation of figures and so on) can be done simply and easily on Windows alone. How to use ABCI on Windows and how to install the program to other computer systems are explained at the end of this manual. (author)

  3. Generation and application of bessel beams in electron microscopy

    Energy Technology Data Exchange (ETDEWEB)

    Grillo, Vincenzo, E-mail: vincenzo.grillo@cnr.it [CNR-Istituto Nanoscienze, Centro S3, Via G Campi 213/a, I-41125 Modena (Italy); CNR-IMEM, Parco Area delle Scienze 37/A, I-43124 Parma (Italy); Harris, Jérémie [Department of Physics, University of Ottawa, 25 Templeton St., Ottawa, Ontario, Canada K1N 6N5 (Canada); Gazzadi, Gian Carlo [CNR-Istituto Nanoscienze, Centro S3, Via G Campi 213/a, I-41125 Modena (Italy); Balboni, Roberto [CNR-IMM Bologna, Via P. Gobetti 101, 40129 Bologna (Italy); Mafakheri, Erfan [Dipartimento di Fisica Informatica e Matematica, Università di Modena e Reggio Emilia, via G Campi 213/a, I-41125 Modena (Italy); Dennis, Mark R. [H.H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL (United Kingdom); Frabboni, Stefano [CNR-Istituto Nanoscienze, Centro S3, Via G Campi 213/a, I-41125 Modena (Italy); Dipartimento di Fisica Informatica e Matematica, Università di Modena e Reggio Emilia, via G Campi 213/a, I-41125 Modena (Italy); Boyd, Robert W.; Karimi, Ebrahim [Department of Physics, University of Ottawa, 25 Templeton St., Ottawa, Ontario, Canada K1N 6N5 (Canada)

    2016-07-15

    We report a systematic treatment of the holographic generation of electron Bessel beams, with a view to applications in electron microscopy. We describe in detail the theory underlying hologram patterning, as well as the actual electron-optical configuration used experimentally. We show that by optimizing our nanofabrication recipe, electron Bessel beams can be generated with relative efficiencies reaching 37±3%. We also demonstrate by tuning various hologram parameters that electron Bessel beams can be produced with many visible rings, making them ideal for interferometric applications, or in more highly localized forms with fewer rings, more suitable for imaging. We describe the settings required to tune beam localization in this way, and explore beam and hologram configurations that allow the convergences and topological charges of electron Bessel beams to be controlled. We also characterize the phase structure of the Bessel beams generated with our technique, using a simulation procedure that accounts for imperfections in the hologram manufacturing process. - Highlights: • Bessel beams with different convergence, topological charge, visible fringes are demonstrated. • The relation between the Fresnel hologram and the probe shape is explained by detailed calculations and experiments. • Among the holograms here presented the highest relative efficiency is 37%, the best result ever reached for blazed holograms.

  4. Generation and application of bessel beams in electron microscopy

    International Nuclear Information System (INIS)

    Grillo, Vincenzo; Harris, Jérémie; Gazzadi, Gian Carlo; Balboni, Roberto; Mafakheri, Erfan; Dennis, Mark R.; Frabboni, Stefano; Boyd, Robert W.; Karimi, Ebrahim

    2016-01-01

    We report a systematic treatment of the holographic generation of electron Bessel beams, with a view to applications in electron microscopy. We describe in detail the theory underlying hologram patterning, as well as the actual electron-optical configuration used experimentally. We show that by optimizing our nanofabrication recipe, electron Bessel beams can be generated with relative efficiencies reaching 37±3%. We also demonstrate by tuning various hologram parameters that electron Bessel beams can be produced with many visible rings, making them ideal for interferometric applications, or in more highly localized forms with fewer rings, more suitable for imaging. We describe the settings required to tune beam localization in this way, and explore beam and hologram configurations that allow the convergences and topological charges of electron Bessel beams to be controlled. We also characterize the phase structure of the Bessel beams generated with our technique, using a simulation procedure that accounts for imperfections in the hologram manufacturing process. - Highlights: • Bessel beams with different convergence, topological charge, visible fringes are demonstrated. • The relation between the Fresnel hologram and the probe shape is explained by detailed calculations and experiments. • Among the holograms here presented the highest relative efficiency is 37%, the best result ever reached for blazed holograms.

  5. DensToolKit: A comprehensive open-source package for analyzing the electron density and its derivative scalar and vector fields

    Science.gov (United States)

    Solano-Altamirano, J. M.; Hernández-Pérez, Julio M.

    2015-11-01

    DensToolKit is a suite of cross-platform, optionally parallelized, programs for analyzing the molecular electron density (ρ) and several fields derived from it. Scalar and vector fields, such as the gradient of the electron density (∇ρ), electron localization function (ELF) and its gradient, localized orbital locator (LOL), region of slow electrons (RoSE), reduced density gradient, localized electrons detector (LED), information entropy, molecular electrostatic potential, kinetic energy densities K and G, among others, can be evaluated on zero, one, two, and three dimensional grids. The suite includes a program for searching critical points and bond paths of the electron density, under the framework of Quantum Theory of Atoms in Molecules. DensToolKit also evaluates the momentum space electron density on spatial grids, and the reduced density matrix of order one along lines joining two arbitrary atoms of a molecule. The source code is distributed under the GNU-GPLv3 license, and we release the code with the intent of establishing an open-source collaborative project. The style of DensToolKit's code follows some of the guidelines of an object-oriented program. This allows us to supply the user with a simple manner for easily implement new scalar or vector fields, provided they are derived from any of the fields already implemented in the code. In this paper, we present some of the most salient features of the programs contained in the suite, some examples of how to run them, and the mathematical definitions of the implemented fields along with hints of how we optimized their evaluation. We benchmarked our suite against both a freely-available program and a commercial package. Speed-ups of ˜2×, and up to 12× were obtained using a non-parallel compilation of DensToolKit for the evaluation of fields. DensToolKit takes similar times for finding critical points, compared to a commercial package. Finally, we present some perspectives for the future development and

  6. Design of Functional Polyesters for Electronic and Biological Applications

    OpenAIRE

    Nelson, Ashley Marie

    2015-01-01

    Melt polymerization and novel monomers enabled the synthesis of polyesters for electronic and biological applications. Inspiration from nature and a passion for environmental preservation instigated an emphasis on the incorporation of renewable resources into polymeric materials. Critical analysis of current research surrounding bisphenol-A replacements and ioncontaining segmented polyurethanes aided in identifying benchmark polymers, including limitations, challenges, and future needs. Struc...

  7. Application of electron beams to environmental conservation technology

    International Nuclear Information System (INIS)

    Pikaev, A.K.

    1992-01-01

    The paper is a review of current status of the application of electron beams to environmental conservation technology. Different aspects of radiation treatment of natural and polluted drinking water, radiation purification of industrial and municipal wastes, radiation treatment of sewage sludge and radiation purification of exhaust gases are considered. The special attention is paid to the respective pilot and industrial facilities. (author) 70 refs

  8. Dromion solutions for an electron acoustic wave and its application ...

    Indian Academy of Sciences (India)

    Davey–Stewartson equation; electron acoustic wave; space plasma. ... Its potential application in different physical fields are also well .... bi-linear method. .... One of the authors, S S Ghosh, would like to thank CSIR for its financial assistance ...

  9. Application of local vacuum slide sealing electron beam welding procedure

    International Nuclear Information System (INIS)

    Sato, Shozo; Takano, Genta; Minami, Masaharu; Enami, Koji; Uchikawa, Takashi; Kuri, Shuhei

    1982-01-01

    Electron beam welding process is efficient and is superior in workmanship and its application to the welding of large plate structures is eagerly awaited. However, since electron beam welding is generally performed with the object of welding entirely put in a vacuum chamber, high welding cost becomes a problem. In response to this demand, two kinds of local vacuum slide sealing type electron beam welding machines have been developed. These welding machines are designed to perform welding with only the neighborhood of the weld line put in vacuum, one of which is for longitudinal joints and the other for circumferential joints. The welding machine for circumferential joints has been put to practical use for the welding of nucear fusion reactor vacuum vessels (outside diameter 3.5 m, inside diameter 1.7 m), showing that it is applicable to the welding of large structures. (author)

  10. Biological applications of phase-contrast electron microscopy.

    Science.gov (United States)

    Nagayama, Kuniaki

    2014-01-01

    Here, I review the principles and applications of phase-contrast electron microscopy using phase plates. First, I develop the principle of phase contrast based on a minimal model of microscopy, introducing a double Fourier-transform process to mathematically formulate the image formation. Next, I explain four phase-contrast (PC) schemes, defocus PC, Zernike PC, Hilbert differential contrast, and schlieren optics, as image-filtering processes in the context of the minimal model, with particular emphases on the Zernike PC and corresponding Zernike phase plates. Finally, I review applications of Zernike PC cryo-electron microscopy to biological systems such as protein molecules, virus particles, and cells, including single-particle analysis to delineate three-dimensional (3D) structures of protein and virus particles and cryo-electron tomography to reconstruct 3D images of complex protein systems and cells.

  11. Application of electron beam curing in web-offset printing

    International Nuclear Information System (INIS)

    Rodrigues, A.M.; Newcomb, W.T.

    1984-01-01

    Four years ago, the first commercial installation of an electron beam processor, coupled with a high speed web offset printing press was described. This line has been in operation since and its success demonstrates the advantages and feasibility of such an application. Just recently, another company has announced that it is using electron beam curing in its printing lines. Judging from the amount of inquiries and opportunities being actively pursued one can state that the use of electron beam systems in printing applications has come of age. This paper describes the advantages of this process, the characteristics of the equipment that are important for industrial use in a multishift environment, and addresses its economics through analysis of some major cost elements

  12. Gain-enhanced LTCC system-on-package for automotive UMRR applications

    KAUST Repository

    Ghaffar, Farhan A.; Khalid, Muhammad Umair; Salama, Khaled N.; Shamim, Atif

    2012-01-01

    .22 cm) can communicate up to 67 m. The design's compactness, robustness, transmission power and resultant communication range are highly suitable for Universal Medium Range Radar (UMRR) applications. © 2010 IEEE.

  13. Preparation and characterization of milk protein films and their application for packaging of Cheddar cheese.

    Science.gov (United States)

    Wagh, Y R; Pushpadass, Heartwin A; Emerald, F Magdaline Eljeeva; Nath, B Surendra

    2014-12-01

    Casein and whey protein concentrate (WPC) films, plasticized with glycerol and sorbitol independently, were prepared by casting. The film thickness, water vapour and oxygen permeation and tensile and moisture sorption properties of the films were determined. The tensile strength (TS), tensile strain (TE) and elastic modulus (EM) of the films ranged from 0.71 to 4.58 MPa, 19.22 to 66.63 % and 2.05 to 6.93 MPa, respectively. The film properties were influenced by the type of biopolymer (casein and whey protein concentrate), plasticizer and its concentration. Increasing the plasticizer concentration, increased the film thickness, TE and water vapour permeability (WVP), but decreased the TS and EM. As the concentration of plasticizer increased to the highest level, the film thickness increased from 0.168 to 0.305 mm for glycerol-plasticized films and from 0.251 to 0.326 mm for sorbitol-plasticized films. The film thickness increased because the amount of plasticizer in the film network increased and the amount of biopolymer remained same. Casein films showed superior tensile properties as compared to WPC films. The WVP of both casein and WPC films lied between 3.87 and 13.97 g.mm./(m(2).h.kPa). The moisture sorption isotherms of both films were typical of high-protein material, and were adequately described by the GAB model. The oxygen permeability of casein films was relatively lower than that of WPC films, regardless of the plasticizer used. The sensory data revealed that the organoleptic quality of Cheddar cheese was unaffected by milk-protein film packaging.

  14. Quantum entanglement in electron optics generation, characterization, and applications

    CERN Document Server

    Chandra, Naresh

    2013-01-01

    This monograph forms an interdisciplinary study in atomic, molecular, and quantum information (QI) science. Here a reader will find that applications of the tools developed in QI provide new physical insights into electron optics as well as properties of atoms & molecules which, in turn, are useful in studying QI both at fundamental and applied levels. In particular, this book investigates entanglement properties of flying electronic qubits generated in some of the well known processes capable of taking place in an atom or a molecule following the absorption of a photon. Here, one can generate Coulombic or fine-structure entanglement of electronic qubits. The properties of these entanglements differ not only from each other, but also from those when spin of an inner-shell photoelectron is entangled with the polarization of the subsequent fluorescence. Spins of an outer-shell electron and of a residual photoion can have free or bound entanglement in a laboratory.

  15. Outline of FNCA project on application of electron accelerator

    International Nuclear Information System (INIS)

    Kume, Tamikazu

    2005-01-01

    FNCA (Forum for Nuclear Cooperation in Asia) activities in the field of electron accelerator applications are reported. The paper mainly reports on the achievement of the 3rd workshop to discuss status of utilization of electron accelerator for thin films/hydrogel in the FNCA participating countries, China, Indonesia, Japan, Korea, Malaysia, Philippines, Thailand, and Vietnam, held in August, 2003, at Kuala Lumpur. Cross-linking of thin film from sago starch polymer blend using the Cureton (200 keV, 20 mA) and cross-linking of hydrogel for wound dressing and CMC paste-like sheet using the medium energy (3.0 MeV, 30 mA) electron accelerator of MINT (from Malaysia) were successfully demonstrated. Efforts are being made by Vietnam, Thailand and Philippines having no electron accelerator to acquire the machine for R and D and commercial use in the near future. (S. Ohno)

  16. Electronic sputtering of biomolecules and its application in mass spectrometry

    International Nuclear Information System (INIS)

    Haakansson, P.; Sundqvist, B.U.R.

    1989-01-01

    In 1974 Macfarlane discovered that fast heavy ions from a 252-Cf source can desorb and ionize molecules from a solid surface. The mass of the molecules was determined by time-of-flight technique. It has been shown that the desorption mechanism is associated with the electron part of the stopping power of the primary ion and the name 'electron sputtering' has been adopted for the phenomenon to distinguish it from the well-known sputtering process with ions of KeV energy. A review of electronic sputtering of biomolecules will be given as well as recent measurements on Langmuir-Blodgett films. One important application of electronic sputtering is in the field of mass spectrometry. With this technique large and nonvolatile molecules can be studied. Particularly adsorption of biomolecules to a nitrocellulose backing has proven to be very useful. Examples will be given of mass spectra from peptides with a molecular weight above 20,000 u. (author)

  17. The development of novel smart packaging labels and mobile application for protection, information and identification of product shelf life

    Directory of Open Access Journals (Sweden)

    Stefan Đurđević

    2015-12-01

    Full Text Available Use of mobile devices for the purpose of reading information from the packaging has already been present for some time. Today present applications that replace bar or QR code readers with a mobile camera interact with the database server successfully and transmit information about the product. This paper shows the conceptual solution for reading not only product information but also the condition of the product in terms of freshness, shelf-life and protection. The paper gives an overview of existing solutions of special inks that could be used in order to create smart labels, the algorithm for data reading through the camera of the mobile devices and mobile application. The aim is to set up a concept for the development of smart labels, from the standpoint of the materials and existing QR codes, but also to define the basis for the development of mobile application that can provide information on the state of the product in interaction with special inks.

  18. Chemical Vapor-Deposited (CVD) Diamond Films for Electronic Applications

    Science.gov (United States)

    1995-01-01

    Diamond films have a variety of useful applications as electron emitters in devices such as magnetrons, electron multipliers, displays, and sensors. Secondary electron emission is the effect in which electrons are emitted from the near surface of a material because of energetic incident electrons. The total secondary yield coefficient, which is the ratio of the number of secondary electrons to the number of incident electrons, generally ranges from 2 to 4 for most materials used in such applications. It was discovered recently at the NASA Lewis Research Center that chemical vapor-deposited (CVD) diamond films have very high secondary electron yields, particularly when they are coated with thin layers of CsI. For CsI-coated diamond films, the total secondary yield coefficient can exceed 60. In addition, diamond films exhibit field emission at fields orders of magnitude lower than for existing state-of-the-art emitters. Present state-of-the-art microfabricated field emitters generally require applied fields above 5x10^7 V/cm. Research on field emission from CVD diamond and high-pressure, high-temperature diamond has shown that field emission can be obtained at fields as low as 2x10^4 V/cm. It has also been shown that thin layers of metals, such as gold, and of alkali halides, such as CsI, can significantly increase field emission and stability. Emitters with nanometer-scale lithography will be able to obtain high-current densities with voltages on the order of only 10 to 15 V.

  19. Packaging microservices

    DEFF Research Database (Denmark)

    Montesi, Fabrizio; Thrane, Dan Sebastian

    2017-01-01

    We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

  20. CYPROS - Cybernetic Program Packages

    Directory of Open Access Journals (Sweden)

    Arne Tyssø

    1980-10-01

    Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

  1. Development and application of advanced methods for electronic structure calculations

    DEFF Research Database (Denmark)

    Schmidt, Per Simmendefeldt

    . For this reason, part of this thesis relates to developing and applying a new method for constructing so-called norm-conserving PAW setups, that are applicable to GW calculations by using a genetic algorithm. The effect of applying the new setups significantly affects the absolute band positions, both for bulk......This thesis relates to improvements and applications of beyond-DFT methods for electronic structure calculations that are applied in computational material science. The improvements are of both technical and principal character. The well-known GW approximation is optimized for accurate calculations...... of electronic excitations in two-dimensional materials by exploiting exact limits of the screened Coulomb potential. This approach reduces the computational time by an order of magnitude, enabling large scale applications. The GW method is further improved by including so-called vertex corrections. This turns...

  2. A Trusted Smart Phone and Its Applications in Electronic Payment

    Institute of Scientific and Technical Information of China (English)

    2007-01-01

    With the growing intelligence and popularity of mobile phones, and the trend of cellular network's convergence to IP based network, more and more mobile applications emerge on the market. For mission critical applications, like the electronic payment which will be discussed in this paper, the lack of trust in the underlying mobile infrastructure and secure interface to legacy systems (for this case, the banking systems) poses obstacles to their widespread presence in mobile services. Recently, the exposure of hacking of iPhone and other smart phones further emphasizes the criticality of establishing a trust platform for mobile applications. This paper analyzes the building blocks of the trusted smart phone, and proposes a framework to provide a trusted platform for mobile electronic payment. Such a proposed system may allow direct interface to the banking systems due to the banking industry recognized strong security, and hence, may enable its widespread use.

  3. Thermal performance of a PCB embedded pulsating heat pipe for power electronics applications

    International Nuclear Information System (INIS)

    Kearney, Daniel J.; Suleman, Omar; Griffin, Justin; Mavrakis, Georgios

    2016-01-01

    Highlights: • Planar, compact PCB embedded pulsating heat pipe for heat spreading applications. • Embedded heat pipe operates at sub-ambient pressure with environmentally. • Compatible fluids. • Range of optimum operating conditions, orientations and fill ratios identified. - Abstract: Low voltage power electronics applications (<1.2 kV) are pushing the design envelope towards increased functionality, better reliability, low profile and reduced cost. One packaging method to enable these constraints is the integration of active power electronic devices into the printed circuit board improving electrical and thermal performance. This development requires a reliable passive thermal management solution to mitigate hot spots due to the increased heat flux density. To this end, a 44 channel open looped pulsating heat pipe (OL-PHP) is experimentally investigated for two independent dielectric working fluids – Novec"T"M 649 and Novec"T"M 774 – due to their lower pressure operation and low global warming potential compared to traditional two-phase coolants. The OL-PHP is investigated in vertical (90°) orientation with fill ratios ranging from 0.30 to 0.70. The results highlight the steady state operating conditions for each working fluid with instantaneous plots of pressure, temperature, and thermal resistance; the minimum potential bulk thermal resistance for each fill ratio and the effective thermal conductivity achievable for the OL-PHP.

  4. Validation of the superconducting 3.9 GHz cavity package for the European X-ray Free Electron Laser

    Science.gov (United States)

    Maiano, C. G.; Branlard, J.; Hüning, M.; Jensch, K.; Kostin, D.; Matheisen, A.; Möller, W.-D.; Sulimov, A.; Vogel, E.; Bosotti, A.; Chen, J. F.; Moretti, M.; Paparella, R.; Pierini, P.; Sertore, D.

    2017-04-01

    A full test of the cavity package concept under realistic operating condition was a necessary step before the assembly of the European XFEL (EXFEL) 3.9 GHz superconducting system and its installation in the accelerator. One cavity, equipped with magnetic shielding, power coupler and frequency tuner has been tested in a specially designed single cavity cryostat in one of the test benches of the DESY Accelerator Module Test Facility (AMTF). The cavity was operated at high pulsed power up to an accelerating field of 24 MV /m , above the quench accelerating field of 21 MV /m achieved during the continuous wave (CW) vertical qualification test and with a large margin with respect to the EXFEL maximum operating specification of 15 MV /m for the 3.9 GHz system. All subsystems under test—coupler, tuner, waveguide tuners, low level radio-frequency (LLRF) system—were qualified to their design performances.

  5. Eco-friendly biorefractory films of gelatin and TEMPO-oxidized cellulose ester for food packaging application.

    Science.gov (United States)

    Zhuang, Chen; Tao, Furong; Cui, Yuezhi

    2017-08-01

    In recent years, many types of food-packaging films and composites have been prepared using gelatin because of its good film-forming ability, non-toxic nature and cost-effectiveness. However, the relatively weak thermal stability, poor mechanical properties and easily-degradable quality limit the potential application of gelatin as a practical material. Microcrystalline cellulose (MCC), which comprises one of the most abundant biomass resources, has been regarded as a safe and reliable food additive because it has the same ingredients as the cellulose in people's daily intake. Food-packaging films with the excellent properties provided by gelatin and oxidized-cellulose represent a topic of great interest. MCC was modified by 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO)-mediated oxidation and chosen as the base of the macromolecule cross-linker (TMN). After modification of gelatin film by TMN, the minimum amount of free -NH 2 in solution was 4.8 × 10 -4  mol g -1 ). The thermal property obviously increased (from 322.31  o C to 352.63  o C) and was crucial for usage in the food industry. The highest water contact value 123.09° (η = 25%) indicated a better surface hydrophobicity. The higher E ab (58.88%) and lower E m (77.16%) demonstrated that a more flexible and shatter-proof material was obtained. Water vapor uptake studies suggested increased moisture absorption and greater swelling ability. The film material obtained in the present study was safe, stable, eco-friendly and biorefractory and could also be decomposed completely by the environment after disposal as a result of the properties of the ingredients gelatin and cellulose. The incorporation of a cellulosic cross-linker to gelatin-based films was an ideal choice with respect to developing a packaging for the food industry. © 2016 Society of Chemical Industry. © 2016 Society of Chemical Industry.

  6. Application of low energy electron beam to precoated steel plates

    International Nuclear Information System (INIS)

    Koshiishi, Kenji

    1989-01-01

    Recently in the fields of home electric appliances, machinery and equipment and interior building materials, the needs for the precoated steel plates having the design and function of high class increase rapidly. In order to cope with such needs, the authors have advanced the examination on the application of electron beam hardening technology to precoated steel plates, and developed the precoated steel plates of high grade and high design 'Super Tecstar EB Series' by utilizing low energy electron beam. The features of this process are (1) hardening can be done at room temperature in a short time-thermally weak films can be adhered, (2) high energy irradiation-the hardening of thick enamel coating and the adhesion of colored films are feasible, (3) the use of monomers of low molecular weight-by high crosslinking, the performance of high sharpness, high hardness, anti-contamination property and so on can be given. The application to precoated steel plate production process is the coating and curing of electron beam hardening type paints, the coating of films with electron beam hardening type adhesives, and the reforming of surface polymer layers by impregnating monomers and causing graft polymerization with electron beam irradiation. The outline of the Super Tecstar EB Series is described. (K.I.)

  7. Application of electron beam for preparation of membranes

    International Nuclear Information System (INIS)

    Mohamed Mahmoud Nasef

    2004-01-01

    Membranes have generated considerable interest in a number of technologically significant fields, such as chemical, biochemical and biomedical engineering. However, it becomes important to design and develop particular membranes for specific applications. Radiation induced grafting of hydrophilic monomers into polymeric films has been found to be an appealing method for producing various membranes. The method has the flexibility of using various types of radiation, such as γ-rays, electron beam, and plasma, irrespective of the shape and size of the polymer. Of all, electron beam accelerator is an advantageous source of high-energy radiations that can initiate grafting reactions required for preparation of membranes particularly when pilot production and commercial applications are sought. The grafting penetration can be varied from surface to bulk of membranes by applying acceleration energy. This article briefly reviews the use of electron beam radiation to prepare various membranes by radiation induced grafting of vinyl and acrylic monomers onto polymer films. Some basic fundamentals of radiation induced grafting and advantages of electron beam over Co-60 are highlighted. Potential applications of radiation-grafted membranes in various fields are also surveyed. (author)

  8. Development of superconducting cryo-electron microscope and its applications

    International Nuclear Information System (INIS)

    Iwatsuki, Masashi

    1988-01-01

    Recently, a superconducting cryo-electron microscope in which specimens are cooled to the liquid helium temperature (4.2 K) has been developed. The main components and functional features of this new microscope are reported together with application data on polyethylene, poly (4-methyl-1-pentene), valonia cellulose, rock salt, ice crystallites and ceramic superconductor. The resistance to electron radiation damage, of beam-sensitive specimens including polymers has been increased more than ten times. Thus, the microscope has made it possible to take high resolution images and to analyze the crystal-structure of micro-areas. (orig.) [de

  9. Organic structures design applications in optical and electronic devices

    CERN Document Server

    Chow, Tahsin J

    2014-01-01

    ""Presenting an overview of the syntheses and properties of organic molecules and their applications in optical and electronic devices, this book covers aspects concerning theoretical modeling for electron transfer, solution-processed micro- and nanomaterials, donor-acceptor cyclophanes, molecular motors, organogels, polyazaacenes, fluorogenic sensors based on calix[4]arenes, and organic light-emitting diodes. The publication of this book is timely because these topics have become very popular nowadays. The book is definitely an excellent reference for scientists working in these a

  10. High speed electronic imaging application in aeroballistic research

    International Nuclear Information System (INIS)

    Brown, R.R.; Parker, J.R.

    1984-01-01

    Physical and temporal restrictions imposed by modern aeroballistics have pushed imaging technology to the point where special photoconductive surfaces and high-speed support electronics are dictated. Specifications for these devices can be formulated by a methodical analysis of critical parameters and how they interact. In terms of system theory, system transfer functions and state equations can be used in optimal coupling of devices to maximize system performance. Application of these methods to electronic imaging at the Eglin Aeroballistics Research Facility is described in this report. 7 references, 14 figures, 1 table

  11. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  12. Application of humidity-controlled dynamic mechanical analysis (DMA-RH) to moisture-sensitive edible casein films for use in food packaging

    Science.gov (United States)

    Protein-based and other hydrophilic thin films are promising materials for the manufacture of edible food packaging and other food and non-food applications. Calcium caseinate (CaCas) films are highly hygroscopic and physical characterization under broad environmental conditions is critical to appli...

  13. From Standard Application Packages to Enterprise Systems - A Matter of Opportunities

    Science.gov (United States)

    Nilsson, Anders G.

    The purpose of this chapter is to make clearer the meaning behind the concepts of “standard application package” and “enterprise system.” There is today a confusion in our IS field about the connection between the two concepts and how they have appeared historically? The main idea is to contrast them against each other and in this sense to study which opportunities organizations and companies can achieve with these two different IT environments. This transparency will give business and IT people a better understanding for managing investments in information systems more professionally. The research approach is characterized as “consumable research” (Robey, and Markus, Information Resources Management Journal, 11(1): 7-15, 1998) based on theoretical knowledge integrated with business practice from the IS field. Our background is through working with practical methods for customer involvement (purchasing, implementation, maintenance) as well as performing vendor studies of the software application industry.

  14. Low-temperature, low-loss zero level packaging techniques for RF applications by using a photopatternable dry film

    International Nuclear Information System (INIS)

    Kim, J; Seok, S; Rolland, N; Rolland, P-A

    2012-01-01

    This paper presents a low-temperature zero-level packaging technique using a dry film type of PerMX polymer for RF devices. Silicon cap packaging with PerMX sealing ring and PerMX cap packaging through multilayer lamination have been implemented. All of the fabrication process has been performed at temperature less than 150 °C. The influence of each packaging cap on the packaged coplanar waveguide was first investigated using the HFSS electromagnetic simulation. The RF measurement results showed that both packaging caps did not have significant influence on the performance of transmission lines. The insertion loss changes before and after packaging were almost negligible up to 30 GHz, and the return losses were better than 20 dB. Also, the deformation of PerMX structures concerning the packaging processes has been studied. For silicon capping, the volumetric compression of PerMX sealing ring by the bonding process has been observed. For PerMX cap packaging, the deflection of the polymer cap has been investigated as a function of sealing ring width for the different cap size. Measured results had good agreement with the ANSYS simulated ones. (paper)

  15. The Physics and Applications of High Brightness Electron Beams

    Science.gov (United States)

    Palumbo, Luigi; Rosenzweig, J.; Serafini, Luca

    2007-09-01

    Plenary sessions. RF deflector based sub-Ps beam diagnostics: application to FEL and advanced accelerators / D. Alesini. Production of fermtosecond pulses and micron beam spots for high brightness electron beam applications / S.G. Anderson ... [et al.]. Wakefields of sub-picosecond electron bunches / K.L.F. Bane. Diamond secondary emitter / I. Ben-Zvi ... [et al.]. Parametric optimization for an X-ray free electron laser with a laser wiggler / R. Bonifacio, N. Piovella and M.M. Cola. Needle cathodes for high-brightness beams / C.H. Boulware ... [et al.]. Non linear evolution of short pulses in FEL cascaded undulators and the FEL harmonic cascade / L. Giannessi and P. Musumeci. High brightness laser induced multi-meV electron/proton sources / D. Giulietti ... [et al.]. Emittance limitation of a conditioned beam in a strong focusing FEL undulator / Z. Huang, G. Stupakov and S. Reiche. Scaled models: space-charge dominated electron storage rings / R.A. Kishek ... [et al.]. High brightness beam applications: energy recovered linacs / G.A. Krafft. Maximizing brightness in photoinjectors / C. Limborg-Deprey and H. Tomizawa. Ultracold electron sources / O.J. Luiten ... [et al.]. Scaling laws of structure-based optical accelerators / A. Mizrahi, V. Karagodsky and L. Schächter. High brightness beams-applications to free-electron lasers / S. Reiche. Conception of photo-injectors for the CTF3 experiment / R. Roux. Superconducting RF photoinjectors: an overview / J. Sekutowicz. Status and perspectives of photo injector developments for high brightness beams / F. Stephan. Results from the UCLA/FNLP underdense plasma lens experiment / M.C. Thompson ... [et al.]. Medical application of multi-beam compton scattering monochromatic tunable hard X-ray source / M. Uesaka ... [et al.]. Design of a 2 kA, 30 fs RF-photoinjector for waterbag compression / S.B. Van Der Geer, O.J. Luiten and M.J. De Loos. Proposal for a high-brightness pulsed electron source / M. Zolotorev ... [et al

  16. Potential ceramics processing applications with high-energy electron beams

    International Nuclear Information System (INIS)

    Struve, K.W.; Turman, B.N.

    1993-01-01

    High-energy, high-current electron beams may offer unique features for processing of ceramics that are not available with any other heat source. These include the capability to instantaneously heat to several centimeters in depth, to preferentially deposit energy in dense, high-z materials, to process at atmospheric pressures in air or other gases, to have large control over heating volume and heating rate, and to have efficient energy conversion. At a recent workshop organized by the authors to explore opportunities for electron beam processing of ceramics, several applications were identified for further development. These were ceramic joining, fabrication of ceramic powders, and surface processing of ceramics. It may be possible to join ceramics by either electron-beam brazing or welding. Brazing with refractory metals might also be feasible. The primary concern for brazing is whether the braze material can wet to the ceramic when rapidly heated by an electron beam. Raw ceramic powders, such as silicon nitride and aluminum nitride, which are difficult to produce by conventional techniques, could possibly be produced by vaporizing metals in a nitrogen atmosphere. Experiments need to be done to verify that the vaporized metal can fully react with the nitrogen. By adjusting beam parameters, high-energy beams can be used to remove surface flaws which are often sites of fracture initiation. They can also be used for surface cleaning. The advantage of electron beams rather than ion beams for this application is that the heat deposition can be graded into the material. The authors will discuss the capabilities of beams from existing machines for these applications and discuss planned experiments

  17. Applications of Free Electron Lasers in Biology and Medicine

    International Nuclear Information System (INIS)

    Pelka, J.B.; Tybor, K.R.; Nietubyc, R.; Wrochna, G.

    2010-01-01

    The advent of free electron lasers opens up new opportunities to probe the dynamics of ultrafast processes and the structure of matter with unprecedented spatial and temporal resolution. New methods inaccessible with other known types of radiation sources can be developed, resulting in a breakthrough in deep understanding the fundamentals of life as well as in numerous medical and biological applications. In the present work the properties of free electron laser radiation that make the sources excellent for probing biological matter at an arbitrary wavelength, in a wide range of intensities and pulse durations are briefly discussed. A number of biophysical and biomedical applications of the new sources, currently considered among the most promising in the field, are presented. (author)

  18. The application of similar image retrieval in electronic commerce.

    Science.gov (United States)

    Hu, YuPing; Yin, Hua; Han, Dezhi; Yu, Fei

    2014-01-01

    Traditional online shopping platform (OSP), which searches product information by keywords, faces three problems: indirect search mode, large search space, and inaccuracy in search results. For solving these problems, we discuss and research the application of similar image retrieval in electronic commerce. Aiming at improving the network customers' experience and providing merchants with the accuracy of advertising, we design a reasonable and extensive electronic commerce application system, which includes three subsystems: image search display subsystem, image search subsystem, and product information collecting subsystem. This system can provide seamless connection between information platform and OSP, on which consumers can automatically and directly search similar images according to the pictures from information platform. At the same time, it can be used to provide accuracy of internet marketing for enterprises. The experiment shows the efficiency of constructing the system.

  19. The Application of Similar Image Retrieval in Electronic Commerce

    Directory of Open Access Journals (Sweden)

    YuPing Hu

    2014-01-01

    Full Text Available Traditional online shopping platform (OSP, which searches product information by keywords, faces three problems: indirect search mode, large search space, and inaccuracy in search results. For solving these problems, we discuss and research the application of similar image retrieval in electronic commerce. Aiming at improving the network customers’ experience and providing merchants with the accuracy of advertising, we design a reasonable and extensive electronic commerce application system, which includes three subsystems: image search display subsystem, image search subsystem, and product information collecting subsystem. This system can provide seamless connection between information platform and OSP, on which consumers can automatically and directly search similar images according to the pictures from information platform. At the same time, it can be used to provide accuracy of internet marketing for enterprises. The experiment shows the efficiency of constructing the system.

  20. The Application of Similar Image Retrieval in Electronic Commerce

    Science.gov (United States)

    Hu, YuPing; Yin, Hua; Han, Dezhi; Yu, Fei

    2014-01-01

    Traditional online shopping platform (OSP), which searches product information by keywords, faces three problems: indirect search mode, large search space, and inaccuracy in search results. For solving these problems, we discuss and research the application of similar image retrieval in electronic commerce. Aiming at improving the network customers' experience and providing merchants with the accuracy of advertising, we design a reasonable and extensive electronic commerce application system, which includes three subsystems: image search display subsystem, image search subsystem, and product information collecting subsystem. This system can provide seamless connection between information platform and OSP, on which consumers can automatically and directly search similar images according to the pictures from information platform. At the same time, it can be used to provide accuracy of internet marketing for enterprises. The experiment shows the efficiency of constructing the system. PMID:24883411