Bournonite PbCuSbS3 : Stereochemically Active Lone-Pair Electrons that Induce Low Thermal Conductivity.

Science.gov (United States)

Dong, Yongkwan; Khabibullin, Artem R; Wei, Kaya; Salvador, James R; Nolas, George S; Woods, Lilia M

2015-10-26

An understanding of the structural features and bonding of a particular material, and the properties these features impart on its physical characteristics, is essential in the search for new systems that are of technological interest. For several relevant applications, the design or discovery of low thermal conductivity materials is of great importance. We report on the synthesis, crystal structure, thermal conductivity, and electronic-structure calculations of one such material, PbCuSbS3 . Our analysis is presented in terms of a comparative study with Sb2 S3 , from which PbCuSbS3 can be derived through cation substitution. The measured low thermal conductivity of PbCuSbS3 is explained by the distortive environment of the Pb and Sb atoms from the stereochemically active lone-pair s(2) electrons and their pronounced repulsive interaction. Our investigation suggests a general approach for the design of materials for phase-change-memory, thermal-barrier, thermal-rectification and thermoelectric applications, as well as other functions for which low thermal conductivity is purposefully sought. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Model of thermal conductivity of anisotropic nanodiamond

International Nuclear Information System (INIS)

Dudnik, S.F.; Kalinichenko, A.I.; Strel'nitskij, V.E.

2014-01-01

Dependence of thermal conductivity of nanocrystalline diamond on grain size and shape is theoretically investigated. Nanodiamond is considered as two-phase material composed of diamond grains characterizing by three main dimensions and segregated by thin graphite layers with electron, phonon or hybrid thermal conductivity. Influence of type of thermal conductance and thickness of boundary layer on thermal conductivity of nanodiamond is analyzed. Derived dependences of thermal conductivity on grain dimensions are compared with experimental data

Gallium ion implantation greatly reduces thermal conductivity and enhances electronic one of ZnO nanowires

Directory of Open Access Journals (Sweden)

Minggang Xia

2014-05-01

Full Text Available The electrical and thermal conductivities are measured for individual zinc oxide (ZnO nanowires with and without gallium ion (Ga+ implantation at room temperature. Our results show that Ga+ implantation enhances electrical conductivity by one order of magnitude from 1.01 × 103 Ω−1m−1 to 1.46 × 104 Ω−1m−1 and reduces its thermal conductivity by one order of magnitude from 12.7 Wm−1K−1 to 1.22 Wm−1K−1 for ZnO nanowires of 100 nm in diameter. The measured thermal conductivities are in good agreement with those in theoretical simulation. The increase of electrical conductivity origins in electron donor doping by Ga+ implantation and the decrease of thermal conductivity is due to the longitudinal and transverse acoustic phonons scattering by Ga+ point scattering. For pristine ZnO nanowires, the thermal conductivity decreases only two times when its diameter reduces from 100 nm to 46 nm. Therefore, Ga+-implantation may be a more effective method than diameter reduction in improving thermoelectric performance.

Calculating lattice thermal conductivity: a synopsis

Science.gov (United States)

Fugallo, Giorgia; Colombo, Luciano

2018-04-01

We provide a tutorial introduction to the modern theoretical and computational schemes available to calculate the lattice thermal conductivity in a crystalline dielectric material. While some important topics in thermal transport will not be covered (including thermal boundary resistance, electronic thermal conduction, and thermal rectification), we aim at: (i) framing the calculation of thermal conductivity within the general non-equilibrium thermodynamics theory of transport coefficients, (ii) presenting the microscopic theory of thermal conduction based on the phonon picture and the Boltzmann transport equation, and (iii) outlining the molecular dynamics schemes to calculate heat transport. A comparative and critical addressing of the merits and drawbacks of each approach will be discussed as well.

Low thermal conductivity skutterudites

Energy Technology Data Exchange (ETDEWEB)

Fleurial, J P; Caillat, T; Borshchevsky, A

1997-07-01

Recent experimental results on semiconductors with the skutterudite crystal structure show that these materials possess attractive transport properties and have a good potential for achieving ZT values substantially larger than for state-of-the-art thermoelectric materials. Both n-type and p-type conductivity samples have been obtained, using several preparation techniques. Associated with a low hole effective mass, very high carrier mobilities, low electrical resistivities and moderate Seebeck coefficients are obtained in p-type skutterudites. For a comparable doping level, the carrier mobilities of n-type samples are about an order of magnitude lower than the values achieved on p-type samples. However, the much larger electron effective masses and Seebeck coefficients on p-type samples. However, the much larger electron effective masses and Seebeck coefficients make n-type skutterudite promising candidates as well. Unfortunately, the thermal conductivities of the binary skutterudites compounds are too large, particularly at low temperatures, to be useful for thermoelectric applications. Several approaches to the reduction of the lattice thermal conductivity in skutterudites are being pursued: heavy doping, formation of solid solutions and alloys, study of novel ternary and filled skutterudite compounds. All those approaches have already resulted in skutterudite compositions with substantially lower thermal conductivity values in these materials. Recently, superior thermoelectric properties in the moderate to high temperature range were achieved for compositions combining alloying and filling of the skutterudite structure. Experimental results and mechanisms responsible for low thermal conductivity in skutterudites are discussed.

Thermal conductivity of high purity vanadium

International Nuclear Information System (INIS)

Jung, W.D.

1975-01-01

The thermal conductivity, Seebeck coefficient, and electrical resistivity of four high-purity vanadium samples were measured over the temperature range 5 to 300 0 K. The highest purity sample had a resistance ratio (rho 273 /rho 4 . 2 ) of 1524. The highest purity sample had a thermal conductivity maximum of 920 W/mK at 9 0 K and had a thermal conductivity of 35 W/mK at room temperature. At low temperatures, the thermal resistivity was limited by the scattering of electrons by impurities and phonons. The thermal resistivity of vanadium departed from Matthiessen's rule at low temperatures. The electrical resistivity and Seebeck coefficient of high purity vanadium showed no anomalous behavior above 130 0 K. The intrinsic electrical resistivity at low temperatures was due primarily to interband scattering of electrons. The Seebeck coefficient was positive from 10 to 240 0 K and had a maximum which was dependent upon sample purity

Thermal conductivity of sputtered amorphous Ge films

International Nuclear Information System (INIS)

Zhan, Tianzhuo; Xu, Yibin; Goto, Masahiro; Tanaka, Yoshihisa; Kato, Ryozo; Sasaki, Michiko; Kagawa, Yutaka

2014-01-01

We measured the thermal conductivity of amorphous Ge films prepared by magnetron sputtering. The thermal conductivity was significantly higher than the value predicted by the minimum thermal conductivity model and increased with deposition temperature. We found that variations in sound velocity and Ge film density were not the main factors in the high thermal conductivity. Fast Fourier transform patterns of transmission electron micrographs revealed that short-range order in the Ge films was responsible for their high thermal conductivity. The results provide experimental evidences to understand the underlying nature of the variation of phonon mean free path in amorphous solids

Electronic structures, elastic properties, and minimum thermal conductivities of cermet M{sub 3}AlN

Energy Technology Data Exchange (ETDEWEB)

Wang, Jin [Faculty of Materials and Energy, Southwest University, Chongqing 400715 (China); Key Laboratory of Liquid–Solid Structural Evolution and Processing of Materials, Ministry of Education, Shandong University, Jinan 250061 (China); Chen, ZhiQian, E-mail: chen_zq@swu.edu.cn [Faculty of Materials and Energy, Southwest University, Chongqing 400715 (China); Li, ChunMei; Li, Feng; Nie, ChaoYin [Faculty of Materials and Energy, Southwest University, Chongqing 400715 (China)

2014-08-15

The electronic structures and elastic anisotropies of cubic Ti{sub 3}AlN, Zr{sub 3}AlN, and Hf{sub 3}AlN are investigated by pseudopotential plane-wave method based on density functional theory. At the Fermi level, the electronic structures of these compounds are successive with no energy gap between conduct and valence bands, and exhibit metallicity in ground states. In valence band of each partial density of states, the different orbital electrons indicate interaction of corresponding atoms. In addition, the anisotropy of Hf{sub 3}AlN is found to be significantly different from that of Ti{sub 3}AlN and Zr{sub 3}AlN, which involve the differences in the bonding strength. It is notable that Hf{sub 3}AlN is a desired thermal barrier material with the lowest thermal conductivity at high temperature among the three compounds. - Graphical abstract: 1.Young's moduli of anti-perovskite Ti{sub 3}AlN, Zr{sub 3}AlN, and Hf{sub 3}AlN in full space. 2.Electron density differences on crystal planes (1 0 0), (2 0 0), and (1 1 0) of anti-perovskite Zr{sub 3}AlN. - Highlights: • We calculated three anti-perovskite cermets with first-principles theory. • We illustrated 3D Young modulus and found the anomalous anisotropy. • We explained the anomaly and calculated the minimum thermal conductivities.

Profile consistency, anomalous electron thermal conduction, and confinement analysis of tokamak devices

International Nuclear Information System (INIS)

Qu Wenxiao

1992-01-01

Assuming that there exists a position in the tokamak plasma where the energy transport is dominated by local anomalous electron thermal conduction and taking advantage of the basic experimental result usually referred to as profile consistency, the authors obtain a more convincing approach to the description of the confinement property of tokamak devices without touching upon the physical mechanism of global plasma energy transport. 8 refs

Electrical and Thermal Conductivity and Conduction Mechanism of Ge2Sb2Te5 Alloy

Science.gov (United States)

Lan, Rui; Endo, Rie; Kuwahara, Masashi; Kobayashi, Yoshinao; Susa, Masahiro

2018-06-01

Ge2Sb2Te5 alloy has drawn much attention due to its application in phase-change random-access memory and potential as a thermoelectric material. Electrical and thermal conductivity are important material properties in both applications. The aim of this work is to investigate the temperature dependence of the electrical and thermal conductivity of Ge2Sb2Te5 alloy and discuss the thermal conduction mechanism. The electrical resistivity and thermal conductivity of Ge2Sb2Te5 alloy were measured from room temperature to 823 K by four-terminal and hot-strip method, respectively. With increasing temperature, the electrical resistivity increased while the thermal conductivity first decreased up to about 600 K then increased. The electronic component of the thermal conductivity was calculated from the Wiedemann-Franz law using the resistivity results. At room temperature, Ge2Sb2Te5 alloy has large electronic thermal conductivity and low lattice thermal conductivity. Bipolar diffusion contributes more to the thermal conductivity with increasing temperature. The special crystallographic structure of Ge2Sb2Te5 alloy accounts for the thermal conduction mechanism.

Electrical and Thermal Conductivity and Conduction Mechanism of Ge2Sb2Te5 Alloy

Science.gov (United States)

Lan, Rui; Endo, Rie; Kuwahara, Masashi; Kobayashi, Yoshinao; Susa, Masahiro

2017-11-01

Ge2Sb2Te5 alloy has drawn much attention due to its application in phase-change random-access memory and potential as a thermoelectric material. Electrical and thermal conductivity are important material properties in both applications. The aim of this work is to investigate the temperature dependence of the electrical and thermal conductivity of Ge2Sb2Te5 alloy and discuss the thermal conduction mechanism. The electrical resistivity and thermal conductivity of Ge2Sb2Te5 alloy were measured from room temperature to 823 K by four-terminal and hot-strip method, respectively. With increasing temperature, the electrical resistivity increased while the thermal conductivity first decreased up to about 600 K then increased. The electronic component of the thermal conductivity was calculated from the Wiedemann-Franz law using the resistivity results. At room temperature, Ge2Sb2Te5 alloy has large electronic thermal conductivity and low lattice thermal conductivity. Bipolar diffusion contributes more to the thermal conductivity with increasing temperature. The special crystallographic structure of Ge2Sb2Te5 alloy accounts for the thermal conduction mechanism.

Studies on thermal properties and thermal control effectiveness of a new shape-stabilized phase change material with high thermal conductivity

International Nuclear Information System (INIS)

Cheng Wenlong; Liu Na; Wu Wanfan

2012-01-01

In order to overcome the difficulty of conventional phase change materials (PCMs) in packaging, the shape-stabilized PCMs are proposed to be used in the electronic device thermal control. However, the conventional shape-stabilized PCMs have the drawback of lower thermal conductivity, so a new shape-stabilized PCM with high thermal conductivity, which is suitable for thermal control of electronic devices, is prepared. The thermal properties of n-octadecane-based shape-stabilized PCM are tested and analyzed. The heat storage/release performance is studied by numerical simulation. Its thermal control effect for electronic devices is also discussed. The results show that the expanded graphite (EG) can greatly improve the thermal conductivity of the material with little effect on latent heat and phase change temperature. When the mass fraction of EG is 5%, thermal conductivity has reached 1.76 W/(m K), which is over 4 times than that of the original one. Moreover, the material has larger latent heat and good thermal stability. The simulation results show that the material can have good heat storage/release performance. The analysis of the effect of thermal parameters on thermal control effect for electronic devices provides references to the design of phase change thermal control unit. - Highlights: ► A new shape-stabilized PCM with higher thermal conductivity is prepared. ► The material overcomes the packaging difficulty of traditional PCMs used in thermal control unit. ► The EG greatly improves thermal conductivity with little effect on latent heat. ► The material has high thermal stability and good heat storage/release performance. ► The effectiveness of the material for electronic device thermal control is proved.

ELECTRON THERMAL CONDUCTION AS A POSSIBLE PHYSICAL MECHANISM TO MAKE THE INNER HELIOSHEATH THINNER

International Nuclear Information System (INIS)

Izmodenov, V. V.; Alexashov, D. B.; Ruderman, M. S.

2014-01-01

We show that electron thermal conductivity may strongly affect the heliosheath plasma flow and the global pattern of the solar wind's interaction with the local interstellar medium. In particular, it leads to strong reduction of the inner heliosheath thickness, which makes it possible to explain (qualitatively) why Voyager 1 (V1) has crossed the heliopause at an unexpectedly small heliocentric distance of 122 AU. To estimate the effect of thermal conductivity, we consider a limiting case when thermal conduction is very effective. To do that, we assume the plasma flow in the entire heliosphere is nearly isothermal. Due to this effect, the heliospheric distance of the termination shock has increased by about 15 AU in the V1 direction compared with the adiabatic case with γ = 5/3. The heliospheric distance of the heliopause has decreased by about 27 AU. As a result, the thickness of the inner heliosheath in the model has decreased by about 42 AU and has become equal to 32 AU

Tailoring the thermal conductivity of the powder bed in Electron Beam Melting (EBM) Additive Manufacturing.

Science.gov (United States)

Smith, C J; Tammas-Williams, S; Hernandez-Nava, E; Todd, I

2017-09-05

Metallic powder bed additive manufacturing is capable of producing complex, functional parts by repeatedly depositing thin layers of powder particles atop of each other whilst selectively melting the corresponding part cross-section into each layer. A weakness with this approach arises when melting overhanging features, which have no prior melted material directly beneath them. This is due to the lower thermal conductivity of the powder relative to solid material, which as a result leads to an accumulation of heat and thus distortion. The Electron Beam Melting (EBM) process alleviates this to some extent as the powder must first be sintered (by the beam itself) before it is melted, which results in the added benefit of increasing the thermal conductivity. This study thus sought to investigate to what extent the thermal conductivity of local regions in a titanium Ti-6Al-4V powder bed could be varied by imparting more energy from the beam. Thermal diffusivity and density measurements were taken of the resulting sintered samples, which ranged from being loosely to very well consolidated. It was found that the calculated thermal conductivity at two temperatures, 40 and 730 °C, was more than doubled over the range of input energies explored.

The effect of radiation induced electrical conductivity (RIC) on the thermal conductivity

International Nuclear Information System (INIS)

White, D.P.

1993-01-01

Microwave heating of plasmas in fusion reactors requires the development of microwave windows through which the microwaves can pass without great losses. The degradation of the thermal conductivity of alumina in a radiation environment is an important consideration in reliability studies of these microwave windows. Several recent papers have addressed this question at higher temperatures and at low temperatures. The current paper extends the low temperature calculations to determine the effect of phonon-electron scattering on the thermal conductivity at 77 K due to RIC. These low temperature calculations are of interest because the successful application of high power (>1 MW) windows for electron cyclotron heating systems in fusion reactors will most likely require cryogenic cooling to take advantage of the low loss tangent and higher thermal conductivity of candidate window materials at these temperatures

Fuel thermal conductivity (FTHCON). Status report

International Nuclear Information System (INIS)

Hagrman, D.L.

1979-02-01

An improvement of the fuel thermal conductivity subcode is described which is part of the fuel rod behavior modeling task performed at EG and G Idaho, Inc. The original version was published in the Materials Properties (MATPRO) Handbook, Section A-2 (Fuel Thermal Conductivity). The improved version incorporates data which were not included in the previous work and omits some previously used data which are believed to come from cracked specimens. The models for the effect of porosity on thermal conductivity and for the electronic contribution to thermal coductivity have been completely revised in order to place these models on a more mechanistic basis. As a result of modeling improvements the standard error of the model with respect to its data base has been significantly reduced

Thermal conductivities and conduction mechanisms of Sb-Te Alloys at high temperatures

International Nuclear Information System (INIS)

Lan, Rui; Endo, Rie; Kobayashi, Yoshinao; Susa, Masahiro; Kuwahara, Masashi

2011-01-01

Sb-Te alloys have drawn much attention due to its application in phase change memory as well as the unique properties as chalcogenide. In this work, the thermal conductivities of Sb-x mol%Te alloys (x = 14, 25, 44, 60, 70, and 90) have been measured by the hot strip method from room temperature up to temperature just below the respective melting points. For the intermetallic compound Sb 2 Te 3 (x = 60), the thermal conductivity decreases up to approximately 600 K and then increases. For other Sb-x mol%Te alloys where x > 60, the thermal conductivities of the alloys decrease with increasing temperature. In contrast, for x < 60, the thermal conductivities of the alloys keep roughly constant up to approximately 600 K and then increase with increasing temperature. It is proposed that free electron dominates the heat transport below 600 K, and ambipolar diffusion also contributes to the increase in the thermal conductivity at higher temperatures. The prediction equation from temperature and chemical composition has been proposed for thermal conductivities of Sb-Te alloys.

The critical particle size for enhancing thermal conductivity in metal nanoparticle-polymer composites

Science.gov (United States)

Lu, Zexi; Wang, Yan; Ruan, Xiulin

2018-02-01

Polymers used as thermal interface materials are often filled with high-thermal conductivity particles to enhance the thermal performance. Here, we have combined molecular dynamics and the two-temperature model in 1D to investigate the impact of the metal filler size on the overall thermal conductivity. A critical particle size has been identified above which thermal conductivity enhancement can be achieved, caused by the interplay between high particle thermal conductivity and the added electron-phonon and phonon-phonon thermal boundary resistance brought by the particle fillers. Calculations on the SAM/Au/SAM (self-assembly-monolayer) system show a critical thickness Lc of around 10.8 nm. Based on the results, we define an effective thermal conductivity and propose a new thermal circuit analysis approach for the sandwiched metal layer that can intuitively explain simulation and experimental data. The results show that when the metal layer thickness decreases to be much smaller than the electron-phonon cooling length (or as the "thin limit"), the effective thermal conductivity is just the phonon portion, and electrons do not participate in thermal transport. As the thickness increases to the "thick limit," the effective thermal conductivity recovers the metal bulk value. Several factors that could affect Lc are discussed, and it is discovered that the thermal conductivity, thermal boundary resistance, and the electron-phonon coupling factor are all important in controlling Lc.

Thermal conductivity issues of EB-PVD thermal barrier coatings

Energy Technology Data Exchange (ETDEWEB)

Schulz, U.; Raetzer-Scheibe, H.J.; Saruhan, B. [DLR - German Aerospace Center, Institute of Materials Research, 51170 Cologne (Germany); Renteria, A.F. [BTU, Physical Metallurgy and Materials Technology, Cottbus (Germany)

2007-09-15

The thermal conductivity of electron-beam physical vapor deposited (EB-PVD) thermal barrier coatings (TBCs) was investigated by the Laser Flash technique. Sample type and methodology of data analyses as well as atmosphere during the measurement have some influence on the data. A large variation of the thermal conductivity was found by changes in TBC microstructure. Exposure at high temperature caused sintering of the porous microstructure that finally increased thermal conductivity up to 30 %. EB-PVD TBCs show a distinct thickness dependence of the thermal conductivity due to the anisotropic microstructure in thickness direction. Thin TBCs had a 20 % lower thermal conductivity than thick coatings. New compositions of the ceramic top layer offer the largest potential to lower thermal conductivity. Values down to 0.8W/(mK) have been already demonstrated with virgin coatings of pyrochlore compositions. (Abstract Copyright [2007], Wiley Periodicals, Inc.) [German] Die Waermeleitfaehigkeit von elektronenstrahl-aufgedampften (EB-PVD) Waermedaemmschichten (TBCs) wurde mittels Laser-Flash untersucht. Probentyp, Messmethodik und die Atmosphaere waehrend der Messung haben einen Einfluss auf die Ergebnisse. Aenderungen in der Mikrostruktur der TBC fuehrten zu grossen Unterschieden der Waermeleitfaehigkeit. Eine Hochtemperaturbelastung verursachte Sintervorgaenge in der poroesen Mikrostruktur, was die Waermeleitfaehigkeit um bis zu 30 % ansteigen liess. EB-PVD TBCs zeigen eine deutliche Dickenabhaengigkeit der Waermeleitfaehigkeit durch die Anisotropie der Mikrostruktur in dieser Richtung. Duenne TBCs haben eine um 20 % geringere Waermeleitfaehigkeit als dicke Schichten. Neue Zusammensetzungen der keramischen Deckschicht bieten die groessten Moeglichkeiten fuer eine Reduktion der Waermeleitfaehigkeit. Werte bis zu 0,8 W/(mK) wurden damit bereits erreicht. (Abstract Copyright [2007], Wiley Periodicals, Inc.)

Thermal Conductivity of Nanotubes: Effects of Chirality and Isotope Impurity

OpenAIRE

Gang, Zhang; Li, Baowen

2005-01-01

We study the dependence of thermal conductivity of single walled nanotubes (SWNT) on chirality and isotope impurity by nonequilibrium molecular dynamics method with accurate potentials. It is found that, contrary to electronic conductivity, the thermal conductivity is insensitive to the chirality. The isotope impurity, however, can reduce the thermal conductivity up to 60% and change the temperature dependence behavior. We also study the dependence of thermal conductivity on tube length for t...

Thermal conductivity of Cu–4.5 Ti alloy

Indian Academy of Sciences (India)

The thermal conductivity (TC) of peak aged Cu–4.5 wt% Ti alloy was measured at different temperatures and studied its variation with temperature. It was found that TC increased with increasing temperature. Phonon and electronic components of thermal conductivity were computed from the results. The alloy exhibits an ...

Thermal conductivity of nanoscale thin nickel films

Institute of Scientific and Technical Information of China (English)

YUAN Shiping; JIANG Peixue

2005-01-01

The inhomogeneous non-equilibrium molecular dynamics (NEMD) scheme is applied to model phonon heat conduction in thin nickel films. The electronic contribution to the thermal conductivity of the film is deduced from the electrical conductivity through the use of the Wiedemann-Franz law. At the average temperature of T = 300 K, which is lower than the Debye temperature ()D = 450 K,the results show that in a film thickness range of about 1-11 nm, the calculated cross-plane thermal conductivity decreases almost linearly with the decreasing film thickness, exhibiting a remarkable reduction compared with the bulk value. The electrical and thermal conductivities are anisotropic in thin nickel films for the thickness under about 10 nm. The phonon mean free path is estimated and the size effect on the thermal conductivity is attributed to the reduction of the phonon mean free path according to the kinetic theory.

Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology

International Nuclear Information System (INIS)

Yang Yuching; Chang Winjin; Fang Tehua; Fang Shihchung

2008-01-01

In this study, a general methodology for determining the thermal conductance between the probe tip and the workpiece during microthermal machining using Scanning Thermal Microscopy (SThM) has been proposed. The processing system was considered as an inverse heat conduction problem with an unknown thermal conductance. Temperature dependence for the material properties and thermal conductance in the analysis of heat conduction is taken into account. The conjugate gradient method is used to solve the inverse problem. Furthermore, this methodology can also be applied to estimate the thermal contact conductance in other transient heat conduction problems, like metal casting process, injection molding process, and electronic circuit systems

Study of the effect of neutron and electron irradiations on the low temperature thermal conductivity of germanium and silicon

International Nuclear Information System (INIS)

Vandevyver, M.

1967-06-01

The main results obtained from this work are the following: 1 Neutron irradiation (at 300 deg. K) produces lattice defects in germanium and silicon, and a corresponding very large lowering of the thermal conductivity is observed in the low temperature region (4-300 ). The results obtained have been explained with the help of the following hypotheses: for silicon a scattering of phonons by the stress fields produced by the defects; for germanium, a supplementary scattering of the electron phonon type. 2 Annealing treatments carried out on these materials above 373 deg. K restored the thermal conductivity over the whole temperature range of the measurements (4-300 deg. K); in the case of both germanium and silicon there were two steps in the annealing process. 3 A study of the thermal conductivity of germanium (initially P or N) after an electronic irradiation showed that the scattering of phonons could depend on the state of charge of the defects thus produced. (author) [fr

Cooled electronic system with thermal spreaders coupling electronics cards to cold rails

Science.gov (United States)

Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; Iyengar, Madhusudan K; Kamath, Vinod; Kochuparambil, Bejoy J; Schmidt, Roger R; Schultz, Mark D; Simco, Daniel P; Steinke, Mark E

2013-07-23

Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Electron thermal conductivity from heat wave propagation in Wendelstein 7-AS

Energy Technology Data Exchange (ETDEWEB)

Giannone, L.; Erckmann, V; Gasparino, U; Hartfuss, H J; Kuehner, G; Maassberg, H; Stroth, U; Tutter, M [Association Euratom-Max-Planck-Institut fuer Plasmaphysik, Garching (Germany); W7-AS Team; ECRH Group IPF Stuttgart; Gyrotron Group KFK Karlsruhe

1992-11-01

Heat wave propagation experiments have been carried out on the Wendelstein 7-AS stellarator. The deposition of electron cyclotron resonance heating power is highly localized in the plasma centre, so that power modulation produces heat waves which propagate away from the deposition volume. Radiometry of the electron cyclotron emission is used to measure the generated temperature perturbation. The propagation time delay of the temperature perturbation as a function of distance to the power deposition region is used to determine the electron thermal conductivity [chi][sub e]. This value is then compared with the value determined by global power balance. In contrast to sawtooth propagation experiments in tokamaks, it is found that the value of [chi][sub e] from heat wave propagation is comparable to that calculated by power balance. In addition, inward propagating waves were produced by choosing a power deposition region away from the plasma centre. Experiments were carried out at 70 GHz in the ordinary mode and at 140 GHz in the extraordinary mode. Variations of the modulation power amplitude have demonstrated that the inferred value of [chi][sub e] is independent of the amplitude of the induced temperature perturbations. (author). 29 refs, 11 figs, 5 tabs.

Power Electronics Thermal Management

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilberto [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

2017-08-07

Thermal modeling was conducted to evaluate and develop thermal management strategies for high-temperature wide-bandgap (WBG)-based power electronics systems. WBG device temperatures of 175 degrees C to 250 degrees C were modeled under various under-hood temperature environments. Modeling result were used to identify the most effective capacitor cooling strategies under high device temperature conditions.

Low-temperature thermal conductivity of terbium-gallium garnet

International Nuclear Information System (INIS)

Inyushkin, A. V.; Taldenkov, A. N.

2010-01-01

Thermal conductivity of paramagnetic Tb 3 Ga 5 O 12 (TbGG) terbium-gallium garnet single crystals is investigated at temperatures from 0.4 to 300 K in magnetic fields up to 3.25 T. A minimum is observed in the temperature dependence κ(T) of thermal conductivity at T min = 0.52 K. This and other singularities on the κ(T) dependence are associated with scattering of phonons from terbium ions. The thermal conductivity at T = 5.1 K strongly depends on the magnetic field direction relative to the crystallographic axes of the crystal. Experimental data are considered using the Debye theory of thermal conductivity taking into account resonance scattering of phonons from Tb 3+ ions. Analysis of the temperature and field dependences of the thermal conductivity indicates the existence of a strong spin-phonon interaction in TbGG. The low-temperature behavior of the thermal conductivity (field and angular dependences) is mainly determined by resonance scattering of phonons at the first quasi-doublet of the electron spectrum of Tb 3+ ion.

Thermal conductivity of Cu–4⋅5 Ti alloy

Indian Academy of Sciences (India)

Unknown

Abstract. The thermal conductivity (TC) of peak aged Cu–4⋅5 wt% Ti alloy was measured at different tem- peratures and studied its variation with temperature. It was found that TC increased with increasing tem- perature. Phonon and electronic components of thermal conductivity were computed from the results. The.

EFFECT OF FINITE LARMOR RADIUS CORRECTIONS ON THE THERMAL INSTABILITY OF THERMALLY CONDUCTING VISCOUS PLASMA WITH HALL CURRENT AND ELECTRON INERTIA

Energy Technology Data Exchange (ETDEWEB)

Jain, Shweta; Sharma, Prerana [Physics Department, Ujjain Engineering College, Ujjain, MP-456010 (India); Kaothekar, Sachin [Physics Department, Mahakal Institute of Technology, Ujjain, MP-456664 (India); Chhajlani, R. K., E-mail: sackaothekar@gmail.com [Retired, School of Studies in Physics, Vikram University Ujjain, MP-456010 (India)

2016-10-01

The thermal instability of an infinite homogeneous, thermally conducting, and rotating plasma, incorporating finite electrical resistivity, finite electron inertia, and an arbitrary radiative heat-loss function in the presence of finite Larmor radius corrections and Hall current, has been studied. Analysis has been made with the help of linearized magnetohydrodynamics (MHD) equations. A general dispersion relation is obtained using the normal mode analysis method, and the dispersion relation is discussed for longitudinal propagation and transverse propagation separately. The dispersion relation has been solved numerically to obtain the dependence of the growth rate on the various parameters involved. The conditions of modified thermal instability and stability are discussed in the different cases of interest.

The Influence of a TiN Film on the Electronic Contribution to the Thermal Conductivity of a TiC Film in a TiN-TiC Layer System

Science.gov (United States)

Jagannadham, K.

2018-01-01

TiC and TiN films were deposited by reactive magnetron sputtering on Si substrates. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) characterization of the microstructure and interface structure have been carried out and the stoichiometric composition of TiC is determined. Thermal conductivity and interface thermal conductance between different layers in the films are evaluated by the transient thermo reflectance (TTR) and three-omega (3- ω) methods. The results showed that the thermal conductivity of the TiC films increased with temperature. The thermal conductivity of TiC in the absence of TiN is dominated by phonon contribution. The electronic contribution to the thermal conductivity of TiC in the presence of TiN is found to be more significant. The interface thermal conductance of the TiC/TiN interface is much larger than that of interfaces at Au/TiC, TiC/Si, or TiN/Si. The interface thermal conductance between TiC and TiN is reduced by the layer formed as a result of interdiffusion.

Thermal Conductivity of Metallic Uranium

Energy Technology Data Exchange (ETDEWEB)

Hin, Celine

2018-03-10

This project has developed a modeling and simulation approaches to predict the thermal conductivity of metallic fuels and their alloys. We focus on two methods. The first method has been developed by the team at the University of Wisconsin Madison. They developed a practical and general modeling approach for thermal conductivity of metals and metal alloys that integrates ab-initio and semi-empirical physics-based models to maximize the strengths of both techniques. The second method has been developed by the team at Virginia Tech. This approach consists of a determining the thermal conductivity using only ab-initio methods without any fitting parameters. Both methods were complementary. The models incorporated both phonon and electron contributions. Good agreement with experimental data over a wide temperature range were found. The models also provided insight into the different physical factors that govern the thermal conductivity under different temperatures. The models were general enough to incorporate more complex effects like additional alloying species, defects, transmutation products and noble gas bubbles to predict the behavior of complex metallic alloys like U-alloy fuel systems under burnup. 3 Introduction Thermal conductivity is an important thermal physical property affecting the performance and efficiency of metallic fuels [1]. Some experimental measurement of thermal conductivity and its correlation with composition and temperature from empirical fitting are available for U, Zr and their alloys with Pu and other minor actinides. However, as reviewed in by Kim, Cho and Sohn [2], due to the difficulty in doing experiments on actinide materials, thermal conductivities of metallic fuels have only been measured at limited alloy compositions and temperatures, some of them even being negative and unphysical. Furthermore, the correlations developed so far are empirical in nature and may not be accurate when used for prediction at conditions far from those

Fuel thermal conductivity (FTHCON). Status report. [PWR; BWR

Energy Technology Data Exchange (ETDEWEB)

Hagrman, D. L.

1979-02-01

An improvement of the fuel thermal conductivity subcode is described which is part of the fuel rod behavior modeling task performed at EG and G Idaho, Inc. The original version was published in the Materials Properties (MATPRO) Handbook, Section A-2 (Fuel Thermal Conductivity). The improved version incorporates data which were not included in the previous work and omits some previously used data which are believed to come from cracked specimens. The models for the effect of porosity on thermal conductivity and for the electronic contribution to thermal coductivity have been completely revised in order to place these models on a more mechanistic basis. As a result of modeling improvements the standard error of the model with respect to its data base has been significantly reduced.

Thermal conductivity of silicon nanocrystals and polystyrene nanocomposite thin films

International Nuclear Information System (INIS)

Juangsa, Firman Bagja; Muroya, Yoshiki; Nozaki, Tomohiro; Ryu, Meguya; Morikawa, Junko

2016-01-01

Silicon nanocrystals (SiNCs) are well known for their size-dependent optical and electronic properties; they also have the potential for low yet controllable thermal properties. As a silicon-based low-thermal conductivity material is required in microdevice applications, SiNCs can be utilized for thermal insulation. In this paper, SiNCs and polymer nanocomposites were produced, and their thermal conductivity, including the density and specific heat, was measured. Measurement results were compared with thermal conductivity models for composite materials, and the comparison shows a decreasing value of the thermal conductivity, indicating the effect of the size and presence of the nanostructure on the thermal conductivity. Moreover, employing silicon inks at room temperature during the fabrication process enables a low cost of fabrication and preserves the unique properties of SiNCs. (paper)

Significantly enhanced thermal conductivity of indium arsenide nanowires via sulfur passivation.

Science.gov (United States)

Xiong, Yucheng; Tang, Hao; Wang, Xiaomeng; Zhao, Yang; Fu, Qiang; Yang, Juekuan; Xu, Dongyan

2017-10-16

In this work, we experimentally investigated the effect of sulfur passivation on thermal transport in indium arsenide (InAs) nanowires. Our measurement results show that thermal conductivity can be enhanced by a ratio up to 159% by sulfur passivation. Current-voltage (I-V) measurements were performed on both unpassivated and S-passivated InAs nanowires to understand the mechanism of thermal conductivity enhancement. We observed a remarkable improvement in electrical conductivity upon sulfur passivation and a significant contribution of electrons to thermal conductivity, which account for the enhanced thermal conductivity of the S-passivated InAs nanowires.

Study on thermal conductive BN/novolac resin composites

International Nuclear Information System (INIS)

Li, Shasha; Qi, Shuhua; Liu, Nailiang; Cao, Peng

2011-01-01

Highlights: → Boron nitride (BN) particles were used to modify novolac resin. → BN particles were pretreated by γ-aminopropyltriethoxysilane. → The thermal conductivity trend of composite almost agrees with the predicted data from the Maxwell-Eucken model. → At BN concentration of 80 wt.%, thermal conductivity value of composite is 4.5 times that of pure novolac resin. → Combined use of the larger and smaller particles with a mass ratio of 1:2 provides the composites with the maximum thermal conductivity among the testing systems. → The composite thermal property also increases with an increase in the BN concentration. - Abstract: In this study, γ-aminopropyltriethoxysilane-treated boron nitride (BN) particles were used to modify novolac resin. The effect of varying the BN concentration, particle size, and hybrid BN fillers with the binary particle size distribution on the thermal conductivity of the composites was investigated. Scanning electron microscopy (SEM) imaging showed homogeneously dispersed treated BN particles in the matrix. Furthermore, the thermal conductivity increased as the BN concentration was increased. This behavior was also observed when the filler size was increased. Experimentally obtained thermal conductivity values agree with the predicted data from the Maxwell-Eucken model well at less than 70 wt.% BN loading. A larger particle size BN-filled novolac resin exhibits a higher thermal conductivity than a smaller particle size BN-filled one. The combined use of 0.5 and 15 μm particles with a mass ratio of 2:1 achieved the maximum thermal conductivity among the testing systems. The thermal resistance properties of the composites were also studied.

Thermal computations for electronics conductive, radiative, and convective air cooling

CERN Document Server

Ellison, Gordon

2010-01-01

IntroductionPrimary mechanisms of heat flowConductionApplication example: Silicon chip resistance calculationConvectionApplication example: Chassis panel cooled by natural convectionRadiationApplication example: Chassis panel cooled only by radiation 7Illustrative example: Simple thermal network model for a heat sinked power transistorIllustrative example: Thermal network circuit for a printed circuit boardCompact component modelsIllustrative example: Pressure and thermal circuits for a forced air cooled enclosureIllustrative example: A single chip package on a printed circuit board-the proble

Effect of fission fragment on thermal conductivity via electrons with an energy about 0.5 MeV in fuel rod gap

Directory of Open Access Journals (Sweden)

F Golian

2017-02-01

Full Text Available The heat transfer process from pellet to coolant is one of the important issues in nuclear reactor. In this regard, the fuel to clad gap and its physical and chemical properties are effective factors on heat transfer in nuclear fuel rod discussion. So, the energy distribution function of electrons with an energy about 0.5 MeV in fuel rod gap in Busherhr’s VVER-1000 nuclear reactor was investigated in this paper. Also, the effect of fission fragments such as Krypton, Bromine, Xenon, Rubidium and Cesium on the electron energy distribution function as well as the heat conduction via electrons in the fuel rod gap have been studied. For this purpose, the Fokker- Planck equation governing the stochastic behavior of electrons in absorbing gap element has been applied in order to obtain the energy distribution function of electrons. This equation was solved via Runge-Kutta numerical method. On the other hand, the electron energy distribution function was determined by using Monte Carlo GEANT4 code. It was concluded that these fission fragments have virtually insignificant effect on energy distribution of electrons and therefore, on thermal conductivity via electrons in the fuel to clad gap. It is worth noting that this result is consistent with the results of other experiments. Also, it is shown that electron relaxation in gap leads to decrease in thermal conductivity via electrons

Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding

Science.gov (United States)

Zhang, Xiaoliang; Gao, Yufei; Chen, Yuli; Hu, Ming

2016-01-01

Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transport manipulation in a controllable and precise manner. In this paper we systematically studied the effect of interlayer covalent bonding, in particular different interlay bonding arrangement, on the thermal conductivity of bilayer graphene using equilibrium molecular dynamics simulations. It is revealed that, the thermal conductivity of randomly bonded bilayer graphene decreases monotonically with the increase of interlayer bonding density, however, for the regularly bonded bilayer graphene structure the thermal conductivity possesses unexpectedly non-monotonic dependence on the interlayer bonding density. The results suggest that the thermal conductivity of bilayer graphene depends not only on the interlayer bonding density, but also on the detailed topological configuration of the interlayer bonding. The underlying mechanism for this abnormal phenomenon is identified by means of phonon spectral energy density, participation ratio and mode weight factor analysis. The large tunability of thermal conductivity of bilayer graphene through rational interlayer bonding arrangement paves the way to achieve other desired properties for potential nanoelectronics applications involving graphene layers. PMID:26911859

Nanostructure design for drastic reduction of thermal conductivity while preserving high electrical conductivity.

Science.gov (United States)

Nakamura, Yoshiaki

2018-01-01

The design and fabrication of nanostructured materials to control both thermal and electrical properties are demonstrated for high-performance thermoelectric conversion. We have focused on silicon (Si) because it is an environmentally friendly and ubiquitous element. High bulk thermal conductivity of Si limits its potential as a thermoelectric material. The thermal conductivity of Si has been reduced by introducing grains, or wires, yet a further reduction is required while retaining a high electrical conductivity. We have designed two different nanostructures for this purpose. One structure is connected Si nanodots (NDs) with the same crystal orientation. The phonons scattering at the interfaces of these NDs occurred and it depended on the ND size. As a result of phonon scattering, the thermal conductivity of this nanostructured material was below/close to the amorphous limit. The other structure is Si films containing epitaxially grown Ge NDs. The Si layer imparted high electrical conductivity, while the Ge NDs served as phonon scattering bodies reducing thermal conductivity drastically. This work gives a methodology for the independent control of electron and phonon transport using nanostructured materials. This can bring the realization of thermoelectric Si-based materials that are compatible with large scale integrated circuit processing technologies.

High thermal conductivity materials for thermal management applications

Science.gov (United States)

Broido, David A.; Reinecke, Thomas L.; Lindsay, Lucas R.

2018-05-29

High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.

Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling

Science.gov (United States)

Ren, Zongqing; Lee, Jaeho

2018-01-01

Artificial nanostructures have improved prospects of thermoelectric systems by enabling selective scattering of phonons and demonstrating significant thermal conductivity reductions. While the low thermal conductivity provides necessary temperature gradients for thermoelectric conversion, the heat generation is detrimental to electronic systems where high thermal conductivity are preferred. The contrasting needs of thermal conductivity are evident in thermoelectric cooling systems, which call for a fundamental breakthrough. Here we show a silicon nanostructure with vertically etched holes, or holey silicon, uniquely combines the low thermal conductivity in the in-plane direction and the high thermal conductivity in the cross-plane direction, and that the anisotropy is ideal for lateral thermoelectric cooling. The low in-plane thermal conductivity due to substantial phonon boundary scattering in small necks sustains large temperature gradients for lateral Peltier junctions. The high cross-plane thermal conductivity due to persistent long-wavelength phonons effectively dissipates heat from a hot spot to the on-chip cooling system. Our scaling analysis based on spectral phonon properties captures the anisotropic size effects in holey silicon and predicts the thermal conductivity anisotropy ratio up to 20. Our numerical simulations demonstrate the thermoelectric cooling effectiveness of holey silicon is at least 30% greater than that of high-thermal-conductivity bulk silicon and 400% greater than that of low-thermal-conductivity chalcogenides; these results contrast with the conventional perception preferring either high or low thermal conductivity materials. The thermal conductivity anisotropy is even more favorable in laterally confined systems and will provide effective thermal management solutions for advanced electronics.

Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling.

Science.gov (United States)

Ren, Zongqing; Lee, Jaeho

2018-01-26

Artificial nanostructures have improved prospects of thermoelectric systems by enabling selective scattering of phonons and demonstrating significant thermal conductivity reductions. While the low thermal conductivity provides necessary temperature gradients for thermoelectric conversion, the heat generation is detrimental to electronic systems where high thermal conductivity are preferred. The contrasting needs of thermal conductivity are evident in thermoelectric cooling systems, which call for a fundamental breakthrough. Here we show a silicon nanostructure with vertically etched holes, or holey silicon, uniquely combines the low thermal conductivity in the in-plane direction and the high thermal conductivity in the cross-plane direction, and that the anisotropy is ideal for lateral thermoelectric cooling. The low in-plane thermal conductivity due to substantial phonon boundary scattering in small necks sustains large temperature gradients for lateral Peltier junctions. The high cross-plane thermal conductivity due to persistent long-wavelength phonons effectively dissipates heat from a hot spot to the on-chip cooling system. Our scaling analysis based on spectral phonon properties captures the anisotropic size effects in holey silicon and predicts the thermal conductivity anisotropy ratio up to 20. Our numerical simulations demonstrate the thermoelectric cooling effectiveness of holey silicon is at least 30% greater than that of high-thermal-conductivity bulk silicon and 400% greater than that of low-thermal-conductivity chalcogenides; these results contrast with the conventional perception preferring either high or low thermal conductivity materials. The thermal conductivity anisotropy is even more favorable in laterally confined systems and will provide effective thermal management solutions for advanced electronics.

Electron conductivity model for dense plasmas

International Nuclear Information System (INIS)

Lee, Y.T.; More, R.M.

1984-01-01

An electron conductivity model for dense plasmas is described which gives a consistent and complete set of transport coefficients including not only electrical conductivity and thermal conductivity, but also thermoelectric power, and Hall, Nernst, Ettinghausen, and Leduc--Righi coefficients. The model is useful for simulating plasma experiments with strong magnetic fields. The coefficients apply over a wide range of plasma temperature and density and are expressed in a computationally simple form. Different formulas are used for the electron relaxation time in plasma, liquid, and solid phases. Comparisons with recent calculations and available experimental measurement show the model gives results which are sufficiently accurate for many practical applications

A nano-graphite/paraffin phase change material with high thermal conductivity

International Nuclear Information System (INIS)

Li, Min

2013-01-01

Highlights: ► Paraffin and NG formed a nanoscale compound. ► The thermal conductivity increased gradually with the content of NG. ► The thermal conductivity of the material containing 10% NG were 0.9362 W/m K. - Abstract: Nano-graphite (NG)/paraffin composites were prepared as composite phase change materials. NG has the function of improving the thermal conductivity of the composite. The microstructure and thermal properties of the materials were examined with environmental scanning electron microscopy and differential scanning calorimetry. The results indicated that the NG layers were randomly dispersed in the paraffin, and the thermal conductivity increased gradually with the content of NG. Thermal conductivity of the material containing 10% NG were 0.9362 W/m K

Method for estimating the lattice thermal conductivity of metallic alloys

International Nuclear Information System (INIS)

Yarbrough, D.W.; Williams, R.K.

1978-08-01

A method is described for calculating the lattice thermal conductivity of alloys as a function of temperature and composition for temperatures above theta/sub D//2 using readily available information about the atomic species present in the alloy. The calculation takes into account phonon interactions with point defects, electrons and other phonons. Comparisons between experimental thermal conductivities (resistivities) and calculated values are discussed for binary alloys of semiconductors, alkali halides and metals. A discussion of the theoretical background is followed by sufficient numerical work to facilitate the calculation of lattice thermal conductivity of an alloy for which no conductivity data exist

Thermal expansion and thermal conductivity characteristics of Cu–Al2O3 nanocomposites

International Nuclear Information System (INIS)

Fathy, A.; El-Kady, Omyma

2013-01-01

Highlights: ► The copper–alumina composites were prepared by powder metallurgy (P/M) method with nano-Cu/Al 2 O 3 powders. ► The Al 2 O 3 content was added by 2.5, 7.5 and 12.5 wt.% to the Cu matrix to detect its effect on thermal conductivity and thermal expansion behavior of the resultant Cu/Al 2 O 3 nanocomposites. ► The results showed that alumina nanoparticles (30 nm) were distributed in the copper matrix in a homogeneous manner. ► The measured thermal conductivity for the Cu–Al 2 O 3 nanocomposites decreased from 384 to 78.1 W/m K with increasing Al 2 O 3 content from 0 to 12.5 wt.%. ► Accordingly, the coefficient of thermal expansion (CTE) was tailored from 33 × 10 −6 to 17.74 × 10 −6 /K, which is compatible with the CTE of semiconductors in electronic packaging applications. - Abstract: Copper–alumina composites were prepared by powder metallurgy (P/M) technology. Nano-Cu/Al 2 O 3 powders, was deoxidized from CuO/Al 2 O 3 powders which synthesized by thermochemical technique by addition of Cu powder to an aqueous solution of aluminum nitrate. The Al 2 O 3 content was added by 2.5, 7.5 and 12.5 wt.% to the Cu matrix to detect its effect on thermal conductivity and thermal expansion behavior of the resultant Cu/Al 2 O 3 nanocomposites. The results showed that alumina nanoparticles (30 nm) were distributed in the copper matrix in a homogeneous manner. The measured thermal conductivity for the Cu–Al 2 O 3 nanocomposites decreased from 384 to 78.1 W/m K with increasing Al 2 O 3 content from 0 to 12.5 wt.%. The large variation in the thermal conductivities can be related to the microstructural characteristics of the interface between Al 2 O 3 and the Cu-matrix. Accordingly, the coefficient of thermal expansion (CTE) was tailored from 33 × 10 −6 to 17.74 × 10 −6 /K, which is compatible with the CTE of semiconductors in electronic packaging applications. The reduction of thermal conductivity and coefficient of thermal expansion were

A 3D graphene interface (Si-doped) of Ag matrix with excellent electronic transmission and thermal conductivity via nano-assembly modification

Science.gov (United States)

Ye, Xianzhu; Li, Ming; Zhang, Yafei

2018-04-01

The wide development of electronic materials requires higher load capacity and high temperature resistance. In this study, a novel architecture was fabricated consisting of a 3D reduced graphene oxide (rGO)-Si interface using a simple nano-assembly sintering to achieve high current capacity and excellent thermal features. Via the analysis of catalytic oxidation for methanol, the loading catalytic activity of nano-Ag still remained to a certain extent for the composite with 0.8 vol.% rGO. The final Ag-rGO composite apparently possesses a higher initial oxidation temperature and lower rate of oxidation for internal passing and shielding, and the thermal conductivity is significantly enhanced from 344 to 407 W m‑1 K‑1. Importantly, with a 3D synergistic transportation network, the resistivity of the Ag-rGO composite is much lower than pure Ag, and with a longer conductive time under a stress condition of current density of 6.0  ×  104 A cm‑2. Thermal-electronic features demonstrate that the dispersed graphene interface can efficiently suppress the primary failure pathways (high temperature) in Ag matrix and make it uniquely efficient for the advancement of microscale and thermal-management electronics.

Thermal conductivity engineering in width-modulated silicon nanowires and thermoelectric efficiency enhancement

Science.gov (United States)

Zianni, Xanthippi

2018-03-01

Width-modulated nanowires have been proposed as efficient thermoelectric materials. Here, the electron and phonon transport properties and the thermoelectric efficiency are discussed for dimensions above the quantum confinement regime. The thermal conductivity decreases dramatically in the presence of thin constrictions due to their ballistic thermal resistance. It shows a scaling behavior upon the width-modulation rate that allows for thermal conductivity engineering. The electron conductivity also decreases due to enhanced boundary scattering by the constrictions. The effect of boundary scattering is weaker for electrons than for phonons and the overall thermoelectric efficiency is enhanced. A ZT enhancement by a factor of 20-30 is predicted for width-modulated nanowires compared to bulk silicon. Our findings indicate that width-modulated nanostructures are promising for developing silicon nanostructures with high thermoelectric efficiency.

Thermal and electrical conductivities of high purity tantalum

International Nuclear Information System (INIS)

Archer, S.L.

1978-01-01

The electrical resistivity and thermal conductivity of three high purity tantalum samples have been measured as functions of temperature over a temperature range of 5K to 65K. Sample purities ranged up to a resistivity ratio of 1714. The highest purity sample had a residual resistivity of .76 x 10 -10 OMEGA-m. The intrinsic resistivity varied as T 3 . 9 from 10K to 31K. The thermal conductivity of the purest sample had a maximum of 840 W/mK at 9.8K. The intrinsic thermal resistivity varied as T 2 . 4 from 10K to 35K. At low temperatures electrons were scattered primarily by impurities and by phonons with both interband and intraband transitions observed. The electrical and thermal resistivity is departed from Matthiessen's rule at low temperatures

Optical Thermal Characterization Enables High-Performance Electronics Applications

Energy Technology Data Exchange (ETDEWEB)

2016-02-01

NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.

Crystallite Size Effect on Thermal Conductive Properties of Nonwoven Nanocellulose Sheets.

Science.gov (United States)

Uetani, Kojiro; Okada, Takumi; Oyama, Hideko T

2015-07-13

The thermal conductive properties, including the thermal diffusivity and resultant thermal conductivity, of nonwoven nanocellulose sheets were investigated by separately measuring the thermal diffusivity of the sheets in the in-plane and thickness directions with a periodic heating method. The cross-sectional area (or width) of the cellulose crystallites was the main determinant of the thermal conductive properties. Thus, the results strongly indicate that there is a crystallite size effect on phonon conduction within the nanocellulose sheets. The results also indicated that there is a large interfacial thermal resistance between the nanocellulose surfaces. The phonon propagation velocity (i.e., the sound velocity) within the nanocellulose sheets was estimated to be ∼800 m/s based on the relationship between the thermal diffusivities and crystallite widths. The resulting in-plane thermal conductivity of the tunicate nanocellulose sheet was calculated to be ∼2.5 W/mK, markedly higher than other plastic films available for flexible electronic devices.

High Thermal Conductivity Materials

CERN Document Server

Shinde, Subhash L

2006-01-01

Thermal management has become a ‘hot’ field in recent years due to a need to obtain high performance levels in many devices used in such diverse areas as space science, mainframe and desktop computers, optoelectronics and even Formula One racing cars! Thermal solutions require not just taking care of very high thermal flux, but also ‘hot spots’, where the flux densities can exceed 200 W/cm2. High thermal conductivity materials play an important role in addressing thermal management issues. This volume provides readers a basic understanding of the thermal conduction mechanisms in these materials and discusses how the thermal conductivity may be related to their crystal structures as well as microstructures developed as a result of their processing history. The techniques for accurate measurement of these properties on large as well as small scales have been reviewed. Detailed information on the thermal conductivity of diverse materials including aluminum nitride (AlN), silicon carbide (SiC), diamond, a...

High thermal conductivity in soft elastomers with elongated liquid metal inclusions

OpenAIRE

Bartlett, Michael D.; Kazem, Navid; Powell-Palm, Matthew J.; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan A.; Majidi, Carmel

2017-01-01

Efficient thermal transport is critical for applications ranging from electronics and energy to advanced manufacturing and transportation; it is essential in emerging domains like wearable computing and soft robotics, which require thermally conductive materials that are also soft and stretchable. However, heat transport within soft materials is limited by the dynamics of phonon transport, which results in a trade-off between thermal conductivity and compliance. We overcome this by engineerin...

Measurement of thermal conductance

International Nuclear Information System (INIS)

Kuchnir, M.

1977-01-01

The 6-m long, 45-kG, warm-iron superconducting magnets envisioned for the Energy Doubler stage of the Fermilab accelerator require stiff supports with minimized thermal conductances in order to keep the refrigeration power reasonable. The large number of supports involved in the system required a careful study of their heat conduction from the room temperature wall to the intercepting refrigeration at 20 0 K and to the liquid helium. For this purpose the thermal conductance of this support was measured by comparing it with the thermal conductance of a copper strap of known geometry. An association of steady-state thermal analysis and experimental thermal conductivity techniques forms the basis of this method. An important advantage is the automatic simulation of the 20 0 K refrigeration intercept by the copper strap, which simplifies the apparatus considerably. This relative resistance technique, which uses electrical analogy as a guideline, is applicable with no restrictions for materials with temperature-independent thermal conductivity. For other materials the results obtained are functions of the specific temperature interval involved in the measurements. A comprehensive review of the literature on thermal conductivity indicates that this approach has not been used before. A demonstration of its self-consistency is stressed here rather than results obtained for different supports

Effect of electronic contribution on temperature-dependent thermal transport of antimony telluride thin film

Energy Technology Data Exchange (ETDEWEB)

Lee, Won-Yong; Park, No-Won [Department of Physics, Chung-Ang University, Seoul 156-756 (Korea, Republic of); Hong, Ji-Eun [Department of Materials Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of); Yoon, Soon-Gil, E-mail: sgyoon@cnu.ac.kr [Department of Materials Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of); Koh, Jung-Hyuk [School of Electrical and Electronics Engineering, Chung-Ang University, Seoul 156-756 (Korea, Republic of); Lee, Sang-Kwon, E-mail: sangkwonlee@cau.ac.kr [Department of Physics, Chung-Ang University, Seoul 156-756 (Korea, Republic of)

2015-01-25

Highlights: • We investigated thermal transport of the antimony telluride thin films. • The contribution of the electronic thermal conductivity increased up to ∼77% at 300 K. • We theoretically analyze and explain the high contribution of electronic component. - Abstract: We study the theoretical and experimental characteristics of thermal transport of 100 nm and 500 nm-thick antimony telluride (Sb{sub 2}Te{sub 3}) thin films prepared by radio frequency magnetron sputtering. The thermal conductivity was measured at temperatures ranging from 20 to 300 K, using four-point-probe 3-ω method. Out-of-plane thermal conductivity of the Sb{sub 2}Te{sub 3} thin film was much lesser in comparison to the bulk material in the entire temperature range, confirming that the phonon- and electron-boundary scattering are enhanced in thin films. Moreover, we found that the contribution of the electronic thermal conductivity (κ{sub e}) in total thermal conductivity (κ) linearly increased up to ∼77% at 300 K with increasing temperature. We theoretically analyze and explain the high contribution of electronic component of thermal conductivity towards the total thermal conductivity of the film by a modified Callaway model. Further, we find the theoretical model predictions to correspond well with the experimental results.

Thermal Conductivity on the Nanofluid of Graphene and Silver Nanoparticles Composite Material.

Science.gov (United States)

Myekhlai, Munkhshur; Lee, Taejin; Baatar, Battsengel; Chung, Hanshik; Jeong, Hyomin

2016-02-01

The composite material consisted of graphene (GN) and silver nanoparticles (AgNPs) has been essential topic in science and industry due to its unique thermal, electrical and antibacterial proper- ties. However, there are scarcity studies based on their thermal properties of nanofluids. Therefore, GN-AgNPs composite material was synthesized using facile and environment friendly method and further nanofluids were prepared by ultrasonication in this study. The morphological and structural investigations were carried out using scanning electron microscope (SEM), transmission electron microscope (TEM), X-ray diffractometer (XRD) as well as ultra violet (UV)-visible spectroscopy. Furthermore, thermal conductivity measurements were performed for as-prepared nanofluids. As a result of thermal conductivity study, GN-AgNPs composite material was considerably enhanced the thermal conductivity of base fluid (water) by to 6.59% for the nanofluid (0.2 wt% GN and 0.4 wt% AgNPs).

Power Electronics Thermal Management Research: Annual Progress Report

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilberto [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

2017-10-19

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Reliable WBG devices are capable of operating at elevated temperatures (≥ 175 °Celsius). However, packaging WBG devices within an automotive inverter and operating them at higher junction temperatures will expose other system components (e.g., capacitors and electrical boards) to temperatures that may exceed their safe operating limits. This creates challenges for thermal management and reliability. In this project, system-level thermal analyses are conducted to determine the effect of elevated device temperatures on inverter components. Thermal modeling work is then conducted to evaluate various thermal management strategies that will enable the use of highly efficient WBG devices with automotive power electronic systems.

Electronic Conductivity of Vanadium-Tellurite Glass-Ceramics

DEFF Research Database (Denmark)

Kjeldsen, Jonas; Yue, Yuanzheng; Bragatto, Caio B.

2013-01-01

In this paper, we investigate the electronic conductivity of 2TeO2-V2O5 glass-ceramics with crystallinity ranging from 0 to 100 wt.%, i.e., from entirely amorphous to completely crystalline. The glass is prepared by the melt quenching technique, and the crystal is prepared by subsequent heat...... spectroscopy. We find similar activation energies for both glass and crystal, implying that they have similar conduction mechanisms, i.e., thermally activated hopping. The electronic conductivity of 2TeO2-V2O5 glass is about one order of magnitude higher than that of the corresponding crystal......, and a percolation phenomenon occurs at a glass fraction of 61 wt.%, increasing from a lower conductivity in the crystal to a higher conductivity in the glass. We explain the behavior of electronic conduction in the 2TeO2-V2O5 glass-ceramics by considering constriction effects between particles as well...

The Thermal Conductivity of Earth's Core: A Key Geophysical Parameter's Constraints and Uncertainties

Science.gov (United States)

Williams, Q.

2018-05-01

The thermal conductivity of iron alloys at high pressures and temperatures is a critical parameter in governing ( a) the present-day heat flow out of Earth's core, ( b) the inferred age of Earth's inner core, and ( c) the thermal evolution of Earth's core and lowermost mantle. It is, however, one of the least well-constrained important geophysical parameters, with current estimates for end-member iron under core-mantle boundary conditions varying by about a factor of 6. Here, the current state of calculations, measurements, and inferences that constrain thermal conductivity at core conditions are reviewed. The applicability of the Wiedemann-Franz law, commonly used to convert electrical resistivity data to thermal conductivity data, is probed: Here, whether the constant of proportionality, the Lorenz number, is constant at extreme conditions is of vital importance. Electron-electron inelastic scattering and increases in Fermi-liquid-like behavior may cause uncertainties in thermal conductivities derived from both first-principles-associated calculations and electrical conductivity measurements. Additional uncertainties include the role of alloying constituents and local magnetic moments of iron in modulating the thermal conductivity. Thus, uncertainties in thermal conductivity remain pervasive, and hence a broad range of core heat flows and inner core ages appear to remain plausible.

Ultra-low thermal conductivities of hot-pressed attapulgite and its potential as thermal insulation material

Energy Technology Data Exchange (ETDEWEB)

Liu, Yuan; Ren, Zhifeng, E-mail: bohr123@163.com, E-mail: zren@uh.edu [Department of Physics and TcSUH, University of Houston, Houston, Texas 77204 (United States); Wang, Xiuzhang [Department of Physics and TcSUH, University of Houston, Houston, Texas 77204 (United States); Hubei Key Laboratory of Pollutant Analysis and Reuse Technology and School of Physics and Electronic Science, Hubei Normal University, Huangshi, Hubei 435002 (China); Wang, Yumei [Department of Physics and TcSUH, University of Houston, Houston, Texas 77204 (United States); Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190 (China); Tang, Zhongjia; Makarenko, Tatyana; Guloy, Arnold [Department of Chemistry, University of Houston, Houston, Texas 77204 (United States); Zhang, Qinyong, E-mail: bohr123@163.com, E-mail: zren@uh.edu [Center for Advanced Materials and Energy, Xihua University, Chengdu, Sichuan 610039 (China)

2016-03-07

In the past, there have been very few reports on thermal properties of attapulgite which is a widely used clay mineral. In this work, we report on extremely low thermal conductivities in attapulgite samples synthesized by hot-pressing. Attapulgite powder was hot-pressed at different temperatures into bulk samples, and a systematic study was conducted on the microstructures and thermal properties. Differential scanning calorimetry analysis shows that hot-pressing induces a rapid dehydration of the attapulgite powders. X-ray diffraction data and scanning/transmission electron microscopy reveal that the hot-pressed attapulgite features high porosity and complex microstructures, including an amorphous phase. As a result, the hot-pressed attapulgite exhibits thermal conductivity less than 2.5 W m{sup −1} K{sup −1} up to 600 °C. For one sample with porosity of 45.7%, the thermal conductivity is as low as 0.34 W m{sup −1} K{sup −1} at 50 °C. This suggests the potential of hot-pressed attapulgite as a candidate for thermal barrier materials.

Thermal Conductivity of EB-PVD Thermal Barrier Coatings Evaluated by a Steady-State Laser Heat Flux Technique

Science.gov (United States)

Zhu, Dongming; Miller, Robert A.; Nagaraj, Ben A.; Bruce, Robert W.

2000-01-01

The thermal conductivity of electron beam-physical vapor deposited (EB-PVD) Zr02-8wt%Y2O3 thermal barrier coatings was determined by a steady-state heat flux laser technique. Thermal conductivity change kinetics of the EB-PVD ceramic coatings were also obtained in real time, at high temperatures, under the laser high heat flux, long term test conditions. The thermal conductivity increase due to micro-pore sintering and the decrease due to coating micro-delaminations in the EB-PVD coatings were evaluated for grooved and non-grooved EB-PVD coating systems under isothermal and thermal cycling conditions. The coating failure modes under the high heat flux test conditions were also investigated. The test technique provides a viable means for obtaining coating thermal conductivity data for use in design, development, and life prediction for engine applications.

A Combination of Boron Nitride Nanotubes and Cellulose Nanofibers for the Preparation of a Nanocomposite with High Thermal Conductivity.

Science.gov (United States)

Zeng, Xiaoliang; Sun, Jiajia; Yao, Yimin; Sun, Rong; Xu, Jian-Bin; Wong, Ching-Ping

2017-05-23

With the current development of modern electronics toward miniaturization, high-degree integration and multifunctionalization, considerable heat is accumulated, which results in the thermal failure or even explosion of modern electronics. The thermal conductivity of materials has thus attracted much attention in modern electronics. Although polymer composites with enhanced thermal conductivity are expected to address this issue, achieving higher thermal conductivity (above 10 W m -1 K -1 ) at filler loadings below 50.0 wt % remains challenging. Here, we report a nanocomposite consisting of boron nitride nanotubes and cellulose nanofibers that exhibits high thermal conductivity (21.39 W m -1 K -1 ) at 25.0 wt % boron nitride nanotubes. Such high thermal conductivity is attributed to the high intrinsic thermal conductivity of boron nitride nanotubes and cellulose nanofibers, the one-dimensional structure of boron nitride nanotubes, and the reduced interfacial thermal resistance due to the strong interaction between the boron nitride nanotubes and cellulose nanofibers. Using the as-prepared nanocomposite as a flexible printed circuit board, we demonstrate its potential usefulness in electronic device-cooling applications. This thermally conductive nanocomposite has promising applications in thermal interface materials, printed circuit boards or organic substrates in electronics and could supplement conventional polymer-based materials.

Thermal conductivity of a film of single walled carbon nanotubes measured with infrared thermal imager

Science.gov (United States)

Feng, Ya; Inoue, Taiki; Xiang, Rong; Chiashi, Shohei; Maruyama, Shigeo

Heat dissipation has restricted the modern miniaturization trend with the development of electronic devices. Theoretically proven to be with high axial thermal conductivity, single walled carbon nanotubes (SWNT) have long been expected to cool down the nanoscale world. Even though the tube-tube contact resistance limits the capability of heat transfer of the bulk film, the high intrinsic thermal conductivity of SWNT still glorify the application of films of SWNT network as a thermal interface material. In this work, we proposed a new method to straightly measure the thermal conductivity of SWNT film. We bridged two cantilevered Si thin plate with SWNT film, and kept a steady state heat flow in between. With the infrared camera to record the temperature distribution, the Si plates with known thermal conductivity can work as a reference to calculate the heat flux going through the SWNT film. Further, the thermal conductivity of the SWNT film can be obtained through Fourier's law after deducting the effect of thermal radiation. The sizes of the structure, the heating temperature, the vacuum degree and other crucial impact factors are carefully considered and analyzed. The author Y. F. was supported through the Advanced Integration Science Innovation Education and Research Consortium Program by the Ministry of Education, Culture, Sport, Science and Technology.

Thermal conductivity of supercooled water.

Science.gov (United States)

Biddle, John W; Holten, Vincent; Sengers, Jan V; Anisimov, Mikhail A

2013-04-01

The heat capacity of supercooled water, measured down to -37°C, shows an anomalous increase as temperature decreases. The thermal diffusivity, i.e., the ratio of the thermal conductivity and the heat capacity per unit volume, shows a decrease. These anomalies may be associated with a hypothesized liquid-liquid critical point in supercooled water below the line of homogeneous nucleation. However, while the thermal conductivity is known to diverge at the vapor-liquid critical point due to critical density fluctuations, the thermal conductivity of supercooled water, calculated as the product of thermal diffusivity and heat capacity, does not show any sign of such an anomaly. We have used mode-coupling theory to investigate the possible effect of critical fluctuations on the thermal conductivity of supercooled water and found that indeed any critical thermal-conductivity enhancement would be too small to be measurable at experimentally accessible temperatures. Moreover, the behavior of thermal conductivity can be explained by the observed anomalies of the thermodynamic properties. In particular, we show that thermal conductivity should go through a minimum when temperature is decreased, as Kumar and Stanley observed in the TIP5P model of water. We discuss physical reasons for the striking difference between the behavior of thermal conductivity in water near the vapor-liquid and liquid-liquid critical points.

The effect of electron thermal conduction on plasma pressure gradient during reconnection of magnetic field lines

International Nuclear Information System (INIS)

Chu, T.K.

1987-12-01

The interplay of electron cross-field thermal conduction and the reconnection of magnetic field lines around an m = 1 magnetic island prior to a sawtooth crash can generate a large pressure gradient in a boundary layer adjacent to the reconnecting surface, leading to an enhanced gradient of poloidal beta to satisfy the threshold condition for ideal MHD modes. This narrow boundary layer and the short onset time of a sawtooth crash can be supported by fine-grained turbulent processes in a tokamak plasma. 11 refs

Measurement of thermal conductivity of Bi2Te3 nanowire using high-vacuum scanning thermal wave microscopy

Science.gov (United States)

Park, Kyungbae; Hwang, Gwangseok; Kim, Hayeong; Kim, Jungwon; Kim, Woochul; Kim, Sungjin; Kwon, Ohmyoung

2016-02-01

With the increasing application of nanomaterials in the development of high-efficiency thermoelectric energy conversion materials and electronic devices, the measurement of the intrinsic thermal conductivity of nanomaterials in the form of nanowires and nanofilms has become very important. However, the current widely used methods for measuring thermal conductivity have difficulties in eliminating the influence of interfacial thermal resistance (ITR) during the measurement. In this study, by using high-vacuum scanning thermal wave microscopy (HV-STWM), we propose a quantitative method for measuring the thermal conductivity of nanomaterials. By measuring the local phase lag of high-frequency (>10 kHz) thermal waves passing through a nanomaterial in a high-vacuum environment, HV-STWM eliminates the measurement errors due to ITR and the distortion due to heat transfer through air. By using HV-STWM, we measure the thermal conductivity of a Bi2Te3 nanowire. Because HV-STWM is quantitatively accurate and its specimen preparation is easier than in the thermal bridge method, we believe that HV-STWM will be widely used for measuring the thermal properties of various types of nanomaterials.

Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics

Science.gov (United States)

Bozorg-Grayeli, Elah; Li, Zijian; Asheghi, Mehdi; Delgado, Gil; Pokrovsky, Alexander; Panzer, Matthew; Wack, Daniel; Goodson, Kenneth E.

2012-10-01

Extreme ultraviolet (EUV) lithography requires nanostructured optical components, whose reliability can be influenced by radiation absorption and thermal conduction. Thermal conduction analysis is complicated by sub-continuum electron and phonon transport and the lack of thermal property data. This paper measures and interprets thermal property data, and their evolution due to heating exposure, for Mo/Si EUV mirrors with 6.9 nm period and Mo/Si thickness ratios of 0.4/0.6 and 0.6/0.4. We use time-domain thermoreflectance and the 3ω method to estimate the thermal resistance between the Ru capping layer and the Mo/Si multilayers (RRu-Mo/Si = 1.5 m2 K GW-1), as well as the out-of-plane thermal conductivity (kMo/Si 1.1 W m-1 K-1) and thermal anisotropy (η = 13). This work also reports the impact of annealing on thermal conduction in a co-deposited MoSi2 layer, increasing the thermal conductivity from 1.7 W m-1 K-1 in the amorphous phase to 2.8 W m-1 K-1 in the crystalline phase.

Thermal characterization of screen printed conductive pastes for RFID antennas

Energy Technology Data Exchange (ETDEWEB)

Janeczek, Kamil, E-mail: kamil.janeczek@itr.org.pl [Tele and Radio Research Institute, 11 Ratuszowa Street, 03-450 Warsaw (Poland); Jakubowska, Malgorzata [Institute of Electronic Materials Technology, 133 Wolczynska Street, 01-919 Warsaw (Poland); Warsaw University of Technology, Institute of Metrology and Biomedical Engineering, 8 Sankt Andrzej Bobola Street, 02-525 Warsaw (Poland); Mlozniak, Anna [Institute of Electronic Materials Technology, 133 Wolczynska Street, 01-919 Warsaw (Poland); Koziol, Grazyna [Tele and Radio Research Institute, 11 Ratuszowa Street, 03-450 Warsaw (Poland)

2012-09-01

Thermal resistance is an essential aspect of electronic circuits designing. It leads to unexpected changes in electronic components during their work. In this study, new materials for screen printed RFID tag's antennas were characterized in terms of their resistance to thermal exposure. Polymer materials containing silver flakes, silver nanopowder, carbon nanotubes or conductive polymer PEDOT:PSS were elaborated and used for antenna printing on flexible materials. In order to verify their long term susceptibility to damages caused by the changing environmental conditions, the temperature cycling test was used in three different temperature ranges: +65 Degree-Sign C, -12 Degree-Sign C, -40 Degree-Sign C/+85 Degree-Sign C (3 h in each temp., dwell time 1 h). The highest durability to thermal exposure exhibited the paste with carbon nanotubes dispersed in poly(methyl methacrylate) PMMA and the lowest one - the paste with conductive polymer PEDOT:PSS.

Thermal characterization of screen printed conductive pastes for RFID antennas

International Nuclear Information System (INIS)

Janeczek, Kamil; Jakubowska, Małgorzata; Młożniak, Anna; Kozioł, Grażyna

2012-01-01

Thermal resistance is an essential aspect of electronic circuits designing. It leads to unexpected changes in electronic components during their work. In this study, new materials for screen printed RFID tag's antennas were characterized in terms of their resistance to thermal exposure. Polymer materials containing silver flakes, silver nanopowder, carbon nanotubes or conductive polymer PEDOT:PSS were elaborated and used for antenna printing on flexible materials. In order to verify their long term susceptibility to damages caused by the changing environmental conditions, the temperature cycling test was used in three different temperature ranges: +65 °C, −12 °C, −40 °C/+85 °C (3 h in each temp., dwell time 1 h). The highest durability to thermal exposure exhibited the paste with carbon nanotubes dispersed in poly(methyl methacrylate) PMMA and the lowest one – the paste with conductive polymer PEDOT:PSS.

Thermal conductivity of hyperstoichiometric SIMFUEL

Energy Technology Data Exchange (ETDEWEB)

Lucuta, P G; Verrall, R A [Chalk River Labs., AECL Research, Chalk River, ON (Canada); Matzke, H [CEC Joint Research Centre, Karlsruhe (Germany)

1997-08-01

At extended burnup, reduction in fuel thermal conductivity occurs as fission-gas bubble, solid fission-product (dissolved and precipitated) build-up, and the oxygen-to-uranium ratio (O/U) possible increases. The effects of solid fission products and the deviation from stoichiometry can be investigated using SIMFUEL (SIMulated high-burnup UO{sub 2} FUEL). The reduction in fuel conductivity due to solid fission products was assessed and reported previously. In this paper, thermal conductivity measurements on hyperstoichiometric SIMFUEL and UO{sub 2+x} investigating the effect of the excess of oxygen on fuel thermal properties, are reported. The thermal diffusivity, specific heat and density of hyperstorichiometric SIMFUEL and UO{sub 2+x}, annealed at the same oxygen potential, were measured to obtain thermal conductivity. The excess of oxygen lowered to the thermal diffusivity, but did not significantly affect the specific heat. The thermal conductivity of UO{sub 2+x} (no fission products present) decreases with an increasing O/U ratio; a reduction of 15%, 37% and 56% at 600 deg. C, and 11%, 23% and 33% at 1500 deg. C, was found for O/U ratios of 2.007, 2.035 and 2.084, respectively. For the SIMFUEL annealed at {Delta}Go{sub 2} = -245 kJ/mol (corresponding to UO{sub 2,007}), the thermal conductivity was practically unchanged, although for the higher oxygen potentials ({Delta}Go{sub 2} {>=} -205 kJ/mol) a reduction in thermal conductivity of the same order as in UO{sub 2+x} W as measured. For SIMFUEL, annealed in reducing conditions, the fission products lowered thermal conductivity significantly. However, for high oxygen potentials ({Delta}Go{sub 2} {>=} -205 kJ/mol), the thermal conductivities of UO{sub 2+x} and SIMFUEL were found to be approximately equal in the temperature range of 600 to 1500 deg. C. Consequently, excess oxygen is the dominant factor contributing to thermal conductivity degradation at high oxygen potentials. (author). 9 figs, 2 tabs.

Thermal conductivity of hyperstoichiometric SIMFUEL

International Nuclear Information System (INIS)

Lucuta, P.G.; Verrall, R.A.; Matzke, H.

1997-01-01

At extended burnup, reduction in fuel thermal conductivity occurs as fission-gas bubble, solid fission-product (dissolved and precipitated) build-up, and the oxygen-to-uranium ratio (O/U) possible increases. The effects of solid fission products and the deviation from stoichiometry can be investigated using SIMFUEL (SIMulated high-burnup UO 2 FUEL). The reduction in fuel conductivity due to solid fission products was assessed and reported previously. In this paper, thermal conductivity measurements on hyperstoichiometric SIMFUEL and UO 2+x investigating the effect of the excess of oxygen on fuel thermal properties, are reported. The thermal diffusivity, specific heat and density of hyperstorichiometric SIMFUEL and UO 2+x , annealed at the same oxygen potential, were measured to obtain thermal conductivity. The excess of oxygen lowered to the thermal diffusivity, but did not significantly affect the specific heat. The thermal conductivity of UO 2+x (no fission products present) decreases with an increasing O/U ratio; a reduction of 15%, 37% and 56% at 600 deg. C, and 11%, 23% and 33% at 1500 deg. C, was found for O/U ratios of 2.007, 2.035 and 2.084, respectively. For the SIMFUEL annealed at ΔGo 2 = -245 kJ/mol (corresponding to UO 2,007 ), the thermal conductivity was practically unchanged, although for the higher oxygen potentials (ΔGo 2 ≥ -205 kJ/mol) a reduction in thermal conductivity of the same order as in UO 2+x W as measured. For SIMFUEL, annealed in reducing conditions, the fission products lowered thermal conductivity significantly. However, for high oxygen potentials (ΔGo 2 ≥ -205 kJ/mol), the thermal conductivities of UO 2+x and SIMFUEL were found to be approximately equal in the temperature range of 600 to 1500 deg. C. Consequently, excess oxygen is the dominant factor contributing to thermal conductivity degradation at high oxygen potentials. (author). 9 figs, 2 tabs

Thermal Conductivity of Nanotubes Revisited: Effects of Chirality, Isotope Impurity, Tube Length, and Temperature

OpenAIRE

Zhang, Gang; Li, Baowen

2004-01-01

We study the dependence of thermal conductivity of single walled nanotubes (SWNT) on chirality, isotope impurity, tube length and temperature by nonequilibrium molecular dynamics method with accurate potentials. It is found that, contrary to electronic conductivity, the thermal conductivity is insensitive to the chirality. The isotope impurity, however, can reduce the thermal conductivity up to 60% and change the temperature dependence behavior. We also found that the tube length dependence o...

Thermal pressure and isochoric thermal conductivity of solid CO2

International Nuclear Information System (INIS)

Purs'kij, O.Yi.

2005-01-01

The analysis of the correlation between the thermal pressure and the isochoric thermal conductivity of solid CO 2 has been carried out. The temperature dependences of the thermal pressure and isochoric thermal conductivity for samples with various molar volumes have been obtained. The isothermal pressure dependences of the thermal conductivity of solid CO 2 have been calculated. The form of the temperature dependence of the isochoric thermal conductivity taking the thermal pressure into account has been revealed. Behaviour of the isochoric thermal conductivity is explained by phonon-phonon interaction and additional influence of the thermal pressure

Shape memory thermal conduction switch

Science.gov (United States)

Vaidyanathan, Rajan (Inventor); Krishnan, Vinu (Inventor); Notardonato, William U. (Inventor)

2010-01-01

A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A movable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member for thermally coupling the first member to the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 K, a transformation range <40 K, and a hysteresis of <10 K. A bias spring is between the first member and the second member. At the phase change the switch provides a distance change (displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.

Effects of thermal efficiency in DCMD and the preparation of membranes with low thermal conductivity

Energy Technology Data Exchange (ETDEWEB)

Li, Zhehao, E-mail: ccgri_lzh@163.com [Changchun Gold Research Institute, 130012 (China); Peng, Yuelian, E-mail: pyl@live.com.au [Department of Chemistry and Chemical Engineering, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100124 (China); Dong, Yajun; Fan, Hongwei [Department of Chemistry and Chemical Engineering, College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100124 (China); Chen, Ping [The Research Institute of Environmental Protection, North China Pharmaceutical Group Corporation, 050015 (China); Qiu, Lin [Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing 100190 (China); Jiang, Qi [National Major Science and Technology Program Management Office for Water Pollution Control and Treatment, MEP, 100029 (China)

2014-10-30

Highlights: • The effects on vapor flux and thermal efficiency were simulated. • The conditions favoring vapor flux also favored thermal efficiency. • Four microporous polymer membranes were compared. • The SiO{sub 2} aerogel coating reduced the thermal conductivity of polymer membranes. • A 3ω technique was used to measure the thermal conductivity of membranes. - Abstract: The effects of the membrane characteristics and operational conditions on the vapor flux and thermal efficiency in a direct contact membrane distillation (DCMD) process were studied with a mathematical simulation. The membrane temperature, driving force of vapor transfer, membrane distillation coefficient, etc. were used to analyze the effects. The operating conditions that increased the vapor flux improved the thermal efficiency. The membrane characteristics of four microporous membranes and their performances in DCMD were compared. A polysulfone (PSf) membrane prepared via vapor-induced phase separation exhibited the lowest thermal conductivity. The PSf and polyvinylidene difluoride (PVDF) membranes were modified using SiO{sub 2} aerogel blending and coating to reduce the thermal conductivity of the membrane. The coating process was more effective than the blending process toward this end. The changes in the structure of the modified membrane were observed with a scanning electron microscope. Si was found on the modified membrane surface with an energy spectrometer. The PVDF composite and support membranes were tested during the DCMD process; the composite membrane had a higher vapor flux and a better thermal efficiency than the support. A new method based on a 3ω technique was used to measure the thermal conductivity of the membranes.

Effects of thermal efficiency in DCMD and the preparation of membranes with low thermal conductivity

International Nuclear Information System (INIS)

Li, Zhehao; Peng, Yuelian; Dong, Yajun; Fan, Hongwei; Chen, Ping; Qiu, Lin; Jiang, Qi

2014-01-01

Highlights: • The effects on vapor flux and thermal efficiency were simulated. • The conditions favoring vapor flux also favored thermal efficiency. • Four microporous polymer membranes were compared. • The SiO 2 aerogel coating reduced the thermal conductivity of polymer membranes. • A 3ω technique was used to measure the thermal conductivity of membranes. - Abstract: The effects of the membrane characteristics and operational conditions on the vapor flux and thermal efficiency in a direct contact membrane distillation (DCMD) process were studied with a mathematical simulation. The membrane temperature, driving force of vapor transfer, membrane distillation coefficient, etc. were used to analyze the effects. The operating conditions that increased the vapor flux improved the thermal efficiency. The membrane characteristics of four microporous membranes and their performances in DCMD were compared. A polysulfone (PSf) membrane prepared via vapor-induced phase separation exhibited the lowest thermal conductivity. The PSf and polyvinylidene difluoride (PVDF) membranes were modified using SiO 2 aerogel blending and coating to reduce the thermal conductivity of the membrane. The coating process was more effective than the blending process toward this end. The changes in the structure of the modified membrane were observed with a scanning electron microscope. Si was found on the modified membrane surface with an energy spectrometer. The PVDF composite and support membranes were tested during the DCMD process; the composite membrane had a higher vapor flux and a better thermal efficiency than the support. A new method based on a 3ω technique was used to measure the thermal conductivity of the membranes

Power Electronics Thermal Management R&D: Annual Report

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilbert [National Renewable Energy Lab. (NREL), Golden, CO (United States)

2016-04-08

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Device- and system-level thermal analyses are conducted to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

Convective and conduction heat transfer study on a mig-type electron gun

International Nuclear Information System (INIS)

Patire Junior, H.; Barroso, J.J.

1996-01-01

A convective and conducting heat transfer study of a magnetron injection electron gun has been made to minimize the temperature distribution in the gun elements while keeping the required operating temperature at 1000 0 C of the emitter. Appropriate materials were selected to reduce thermal losses and to improve the gun design from a constructional point of view aiming at extending the capabilities of the electron gun. A thermal probe to determine the air velocity and the convective heat transfer coefficient has been constructed to determine the external boundary condition of the ceramic shell and external flanges. A study the contact resistance for all the gun elements has been made to minimize the conduction thermal losses. A software has been used to simulate a thermal model considering the three processes of thermal transfer, namely, conduction, convection and radiation and the influence of the physical properties of the materials used. (author). 7 refs., 5 figs., 1 tab

Thermal conductivity model for nanofiber networks

Science.gov (United States)

Zhao, Xinpeng; Huang, Congliang; Liu, Qingkun; Smalyukh, Ivan I.; Yang, Ronggui

2018-02-01

Understanding thermal transport in nanofiber networks is essential for their applications in thermal management, which are used extensively as mechanically sturdy thermal insulation or high thermal conductivity materials. In this study, using the statistical theory and Fourier's law of heat conduction while accounting for both the inter-fiber contact thermal resistance and the intrinsic thermal resistance of nanofibers, an analytical model is developed to predict the thermal conductivity of nanofiber networks as a function of their geometric and thermal properties. A scaling relation between the thermal conductivity and the geometric properties including volume fraction and nanofiber length of the network is revealed. This model agrees well with both numerical simulations and experimental measurements found in the literature. This model may prove useful in analyzing the experimental results and designing nanofiber networks for both high and low thermal conductivity applications.

Thermal conductivity model for nanofiber networks

Energy Technology Data Exchange (ETDEWEB)

Zhao, Xinpeng [Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA; Huang, Congliang [Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA; School of Electrical and Power Engineering, China University of Mining and Technology, Xuzhou 221116, China; Liu, Qingkun [Department of Physics, University of Colorado, Boulder, Colorado 80309, USA; Smalyukh, Ivan I. [Department of Physics, University of Colorado, Boulder, Colorado 80309, USA; Materials Science and Engineering Program, University of Colorado, Boulder, Colorado 80309, USA; Yang, Ronggui [Department of Mechanical Engineering, University of Colorado, Boulder, Colorado 80309, USA; Materials Science and Engineering Program, University of Colorado, Boulder, Colorado 80309, USA; Buildings and Thermal Systems Center, National Renewable Energy Laboratory, Golden, Colorado 80401, USA

2018-02-28

Understanding thermal transport in nanofiber networks is essential for their applications in thermal management, which are used extensively as mechanically sturdy thermal insulation or high thermal conductivity materials. In this study, using the statistical theory and Fourier's law of heat conduction while accounting for both the inter-fiber contact thermal resistance and the intrinsic thermal resistance of nanofibers, an analytical model is developed to predict the thermal conductivity of nanofiber networks as a function of their geometric and thermal properties. A scaling relation between the thermal conductivity and the geometric properties including volume fraction and nanofiber length of the network is revealed. This model agrees well with both numerical simulations and experimental measurements found in the literature. This model may prove useful in analyzing the experimental results and designing nanofiber networks for both high and low thermal conductivity applications.

A thermal conductivity model for U-­Si compounds

Energy Technology Data Exchange (ETDEWEB)

Zhang, Yongfeng [Idaho National Lab. (INL), Idaho Falls, ID (United States); Andersson, Anders David Ragnar [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

2017-02-02

U₃Si₂ is a candidate for accident tolerant nuclear fuel being developed as an alternative to UO₂ in commercial light water reactors (LWRs). One of its main benefits compared to UO₂ is higher thermal conductivity that increases with temperature. This increase is contrary to UO₂, for which the thermal conductivity decreases with temperature. The reason for the difference is the electronic origin of thermal conductivity in U₃Si₂, as compared to the phonon mechanism responsible for thermal transport in UO₂. The phonon thermal conductivity in UO₂ is unusually low for a fluorite oxide due to the strong interaction with the spins in the paramagnetic phase. The thermal conductivity of U₃Si₂ as well as other U-­Si compounds has been measured experimentally [1-­4]. However, for fuel performance simulations it is also critical to model the degradation of the thermal conductivity due to damage and microstructure evolution caused by the reactor environment (irradiation and high temperature). For UO₂ this reduction is substantial and it has been the topic of extensive NEAMS research resulting in several publications [5, 6]. There are no data or models for the evolution of the U₃Si₂ thermal conductivity under irradiation. We know that the intrinsic thermal conductivities of UO₂ (semi-conductor) and U₃Si₂ (metal) are very different, and we do not necessarily expect the dependence on damage to be the same either, which could present another advantage for the silicide fuel. In this report we summarize the first step in developing a model for the thermal conductivity of U-­Si compounds with the goal of capturing the effect of damage in U₃Si₂. Next year, we will focus on lattice damage. We will also attempt to assess the impact of fission gas bubbles.

Thermal conductivities of phosphorene allotropes from first-principles calculations: a comparative study.

Science.gov (United States)

Zhang, J; Liu, H J; Cheng, L; Wei, J; Liang, J H; Fan, D D; Jiang, P H; Shi, J

2017-07-04

Phosphorene has attracted tremendous interest recently due to its intriguing electronic properties. However, the thermal transport properties of phosphorene, especially for its allotropes, are still not well-understood. In this work, we calculate the thermal conductivities of five phosphorene allotropes (α-, β-, γ-, δ- and ζ-phase) by using phonon Boltzmann transport theory combined with first-principles calculations. It is found that the α-phosphorene exhibits considerable anisotropic thermal transport, while it is less obvious in the other four phosphorene allotropes. The highest thermal conductivity is found in the β-phosphorene, followed by the δ-, γ- and ζ-phase. The much lower thermal conductivity of the ζ-phase can be attributed to its relatively complex atomic configuration. It is expected that the rich thermal transport properties of phosphorene allotropes can have potential applications in the thermoelectrics and thermal management.

Laboratory electron exposure of TSS-1 thermal control coating

Science.gov (United States)

Vaughn, J. A.; Mccollum, M.; Carruth, M. R., Jr.

1995-01-01

RM400, a conductive thermal control coating, was developed for use on the exterior shell of the tethered satellite. Testing was performed by the Engineering Physics Division to quantify effects of the space environment on this coating and its conductive and optical properties. Included in this testing was exposure of RM400 to electrons with energies ranging from 0.1 to 1 keV, to simulate electrons accelerated from the ambient space plasma when the tethered satellite is fully deployed. During this testing, the coating was found to luminesce, and a prolonged exposure of the coating to high-energy electrons caused the coating to darken. This report describes the tests done to quantify the degradation of the thermal control properties caused by electron exposure and to measure the luminescence as a function of electron energy and current density to the satellite.

Experimental Preparation and Numerical Simulation of High Thermal Conductive Cu/CNTs Nanocomposites

Directory of Open Access Journals (Sweden)

Muhsan Ali Samer

2014-07-01

Full Text Available Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu reinforced by multi-walled carbon nanotubes (CNTs up to 10 vol. % was prepared and their thermal behaviour was measured experimentally and evaluated using numerical simulation. In order to numerically predict the thermal behaviour of Cu/CNTs composites, three different prediction methods were performed. The results showed that rules of mixture method records the highest thermal conductivity for all predicted composites. In contrast, the prediction model which takes into account the influence of the interface thermal resistance between CNTs and copper particles, has shown the lowest thermal conductivity which considered as the closest results to the experimental measurement. The experimentally measured thermal conductivities showed remarkable increase after adding 5 vol.% CNTs and higher than the thermal conductivities predicted via Nan models, indicating that the improved fabrication technique of powder injection molding that has been used to produced Cu/CNTs nanocomposites has overcome the challenges assumed in the mathematical models.

Carbon nanotube: nanodiamond Li-ion battery cathodes with increased thermal conductivity

Science.gov (United States)

Salgado, Ruben; Lee, Eungiee; Shevchenko, Elena V.; Balandin, Alexander A.

2016-10-01

Prevention of excess heat accumulation within the Li-ion battery cells is a critical design consideration for electronic and photonic device applications. Many existing approaches for heat removal from batteries increase substantially the complexity and overall weight of the battery. Some of us have previously shown a possibility of effective passive thermal management of Li-ion batteries via improvement of thermal conductivity of cathode and anode material1. In this presentation, we report the results of our investigation of the thermal conductivity of various Li-ion cathodes with incorporated carbon nanotubes and nanodiamonds in different layered structures. The cathodes were synthesized using the filtration method, which can be utilized for synthesis of commercial electrode-active materials. The thermal measurements were conducted with the "laser flash" technique. It has been established that the cathode with the carbon nanotubes-LiCo2 and carbon nanotube layered structure possesses the highest in-plane thermal conductivity of 206 W/mK at room temperature. The cathode containing nanodiamonds on carbon nanotubes structure revealed one of the highest cross-plane thermal conductivity values. The in-plane thermal conductivity is up to two orders-of-magnitude greater than that in conventional cathodes based on amorphous carbon. The obtained results demonstrate a potential of carbon nanotube incorporation in cathode materials for the effective thermal management of Li-ion high-powered density batteries.

Thermal conductivity of unsaturated clay-rocks

Directory of Open Access Journals (Sweden)

D. Jougnot

2010-01-01

Full Text Available The parameters used to describe the electrical conductivity of a porous material can be used to describe also its thermal conductivity. A new relationship is developed to connect the thermal conductivity of an unsaturated porous material to the thermal conductivity of the different phases of the composite, and two electrical parameters called the first and second Archie's exponents. A good agreement is obtained between the new model and thermal conductivity measurements performed using packs of glass beads and core samples of the Callovo-Oxfordian clay-rocks at different saturations of the water phase. We showed that the three model parameters optimised to fit the new model against experimental data (namely the thermal conductivity of the solid phase and the two Archie's exponents are consistent with independent estimates. We also observed that the anisotropy of the effective thermal conductivity of the Callovo-Oxfordian clay-rock was mainly due to the anisotropy of the thermal conductivity of the solid phase.

Thermal conduction down steep temperature gradients

International Nuclear Information System (INIS)

Bell, A.R.; Evans, R.G.; Nicholas, D.J.

1980-08-01

The Fokker-Planck equation has been solved numerically in one spatial and two velocity dimensions in order to study thermal conduction in large temperature gradients. An initially cold plasma is heated at one end of the spatial grid producing temperature gradients with scale lengths of a few times the electron mean free path. The heat flow is an order of magnitude smaller than that predicted by the classical theory which is valid in the limit of small temperature gradients. (author)

Hydrogenation of Penta-Graphene Leads to Unexpected Large Improvement in Thermal Conductivity.

Science.gov (United States)

Wu, Xufei; Varshney, Vikas; Lee, Jonghoon; Zhang, Teng; Wohlwend, Jennifer L; Roy, Ajit K; Luo, Tengfei

2016-06-08

Penta-graphene (PG) has been identified as a novel two-dimensional (2D) material with an intrinsic bandgap, which makes it especially promising for electronics applications. In this work, we use first-principles lattice dynamics and iterative solution of the phonon Boltzmann transport equation (BTE) to determine the thermal conductivity of PG and its more stable derivative, hydrogenated penta-graphene (HPG). As a comparison, we also studied the effect of hydrogenation on graphene thermal conductivity. In contrast to hydrogenation of graphene, which leads to a dramatic decrease in thermal conductivity, HPG shows a notable increase in thermal conductivity, which is much higher than that of PG. Considering the necessity of using the same thickness when comparing thermal conductivity values of different 2D materials, hydrogenation leads to a 63% reduction in thermal conductivity for graphene, while it results in a 76% increase for PG. The high thermal conductivity of HPG makes it more thermally conductive than most other semiconducting 2D materials, such as the transition metal chalcogenides. Our detailed analyses show that the primary reason for the counterintuitive hydrogenation-induced thermal conductivity enhancement is the weaker bond anharmonicity in HPG than PG. This leads to weaker phonon scattering after hydrogenation, despite the increase in the phonon scattering phase space. The high thermal conductivity of HPG may inspire intensive research around HPG and other derivatives of PG as potential materials for future nanoelectronic devices. The fundamental physics understood from this study may open up a new strategy to engineer thermal transport properties of other 2D materials by controlling bond anharmonicity via functionalization.

Reduce the Sensitivity of CL-20 by Improving Thermal Conductivity Through Carbon Nanomaterials.

Science.gov (United States)

Wang, Shuang; An, Chongwei; Wang, Jingyu; Ye, Baoyun

2018-03-27

The graphene (rGO) and carbon nanotube (CNT) were adopted to enhance the thermal conductivity of CL-20-based composites as conductive fillers. The microstructure features were characterized using scanning electron microscopy (SEM) and X-ray diffraction (XRD), and tested the properties by differential scanning calorimeter (DSC), static electricity accumulation, special height, thermal conductivity, and detonation velocity. The results showed that the mixture of rGO and CNT had better effect in thermal conductivity than rGO or CNT alone under the same loading (1 wt%) and it formed a three-dimensional heat-conducting network structure to improve the heat property of the system. Besides, the linear fit proved that the thermal conductivity of the CL-20-based composites were negatively correlated with the impact sensitivity, which also explained that the impact sensitivity was significantly reduced after the thermal conductivity increased and the explosive still maintained better energy.

Reduce the Sensitivity of CL-20 by Improving Thermal Conductivity Through Carbon Nanomaterials

Science.gov (United States)

Wang, Shuang; An, Chongwei; Wang, Jingyu; Ye, Baoyun

2018-03-01

The graphene (rGO) and carbon nanotube (CNT) were adopted to enhance the thermal conductivity of CL-20-based composites as conductive fillers. The microstructure features were characterized using scanning electron microscopy (SEM) and X-ray diffraction (XRD), and tested the properties by differential scanning calorimeter (DSC), static electricity accumulation, special height, thermal conductivity, and detonation velocity. The results showed that the mixture of rGO and CNT had better effect in thermal conductivity than rGO or CNT alone under the same loading (1 wt%) and it formed a three-dimensional heat-conducting network structure to improve the heat property of the system. Besides, the linear fit proved that the thermal conductivity of the CL-20-based composites were negatively correlated with the impact sensitivity, which also explained that the impact sensitivity was significantly reduced after the thermal conductivity increased and the explosive still maintained better energy.

Thermal Conductivity Analysis and Lifetime Testing of Suspension Plasma-Sprayed Thermal Barrier Coatings

Directory of Open Access Journals (Sweden)

Nicholas Curry

2014-08-01

Full Text Available Suspension plasma spraying (SPS has become an interesting method for the production of thermal barrier coatings for gas turbine components. The development of the SPS process has led to structures with segmented vertical cracks or column-like structures that can imitate strain-tolerant air plasma spraying (APS or electron beam physical vapor deposition (EB-PVD coatings. Additionally, SPS coatings can have lower thermal conductivity than EB-PVD coatings, while also being easier to produce. The combination of similar or improved properties with a potential for lower production costs makes SPS of great interest to the gas turbine industry. This study compares a number of SPS thermal barrier coatings (TBCs with vertical cracks or column-like structures with the reference of segmented APS coatings. The primary focus has been on lifetime testing of these new coating systems. Samples were tested in thermo-cyclic fatigue at temperatures of 1100 °C for 1 h cycles. Additional testing was performed to assess thermal shock performance and erosion resistance. Thermal conductivity was also assessed for samples in their as-sprayed state, and the microstructures were investigated using SEM.

Thermal Properties and Phonon Spectral Characterization of Synthetic Boron Phosphide for High Thermal Conductivity Applications.

Science.gov (United States)

Kang, Joon Sang; Wu, Huan; Hu, Yongjie

2017-12-13

Heat dissipation is an increasingly critical technological challenge in modern electronics and photonics as devices continue to shrink to the nanoscale. To address this challenge, high thermal conductivity materials that can efficiently dissipate heat from hot spots and improve device performance are urgently needed. Boron phosphide is a unique high thermal conductivity and refractory material with exceptional chemical inertness, hardness, and high thermal stability, which holds high promises for many practical applications. So far, however, challenges with boron phosphide synthesis and characterization have hampered the understanding of its fundamental properties and potential applications. Here, we describe a systematic thermal transport study based on a synergistic synthesis-experimental-modeling approach: we have chemically synthesized high-quality boron phosphide single crystals and measured their thermal conductivity as a record-high 460 W/mK at room temperature. Through nanoscale ballistic transport, we have, for the first time, mapped the phonon spectra of boron phosphide and experimentally measured its phonon mean free-path spectra with consideration of both natural and isotope-pure abundances. We have also measured the temperature- and size-dependent thermal conductivity and performed corresponding calculations by solving the three-dimensional and spectral-dependent phonon Boltzmann transport equation using the variance-reduced Monte Carlo method. The experimental results are in good agreement with that predicted by multiscale simulations and density functional theory, which together quantify the heat conduction through the phonon mode dependent scattering process. Our finding underscores the promise of boron phosphide as a high thermal conductivity material for a wide range of applications, including thermal management and energy regulation, and provides a detailed, microscopic-level understanding of the phonon spectra and thermal transport mechanisms of

External electric field driving the ultra-low thermal conductivity of silicene.

Science.gov (United States)

Qin, Guangzhao; Qin, Zhenzhen; Yue, Sheng-Ying; Yan, Qing-Bo; Hu, Ming

2017-06-01

The manipulation of thermal transport is in increasing demand as heat transfer plays a critical role in a wide range of practical applications, such as efficient heat dissipation in nanoelectronics and heat conduction hindering in solid-state thermoelectrics. It is well established that the thermal transport in semiconductors and insulators (phonons) can be effectively modulated by structure engineering or materials processing. However, almost all the existing approaches involve altering the original atomic structure of materials, which would be hindered due to either irreversible structure change or limited tunability of thermal conductivity. Motivated by the inherent relationship between phonon behavior and interatomic electrostatic interaction, we comprehensively investigate the effect of external electric field, a widely used gating technique in modern electronics, on the lattice thermal conductivity (κ). Taking two-dimensional silicon (silicene) as a model, we demonstrate that by applying an electric field (E z = 0.5 V Å -1 ) the κ of silicene can be reduced to a record low value of 0.091 W m -1 K -1 , which is more than two orders of magnitude lower than that without an electric field (19.21 W m -1 K -1 ) and is even comparable to that of the best thermal insulation materials. Fundamental insights are gained from observing the electronic structures. With an electric field applied, due to the screened potential resulting from the redistributed charge density, the interactions between silicon atoms are renormalized, leading to phonon renormalization and the modulation of phonon anharmonicity through electron-phonon coupling. Our study paves the way for robustly tuning phonon transport in materials without altering the atomic structure, and would have significant impact on emerging applications, such as thermal management, nanoelectronics and thermoelectrics.

Evaluation of uranium dioxide thermal conductivity using molecular dynamics simulations

International Nuclear Information System (INIS)

Kim, Woongkee; Kaviany, Massoud; Shim, J. H.

2014-01-01

It can be extended to larger space, time scale and even real reactor situation with fission product as multi-scale formalism. Uranium dioxide is a fluorite structure with Fm3m space group. Since it is insulator, dominant heat carrier is phonon, rather than electrons. So, using equilibrium molecular dynamics (MD) simulation, we present the appropriate calculation parameters in MD simulation by calculating thermal conductivity and application of it to the thermal conductivity of polycrystal. In this work, we investigate thermal conductivity of uranium dioxide and optimize the parameters related to its process. In this process, called Green Kubo formula, there are two parameters i.e correlation length and sampling interval, which effect on ensemble integration in order to obtain thermal conductivity. Through several comparisons, long correlation length and short sampling interval give better results. Using this strategy, thermal conductivity of poly crystal is obtained and comparison with that of pure crystal is made. Thermal conductivity of poly crystal show lower value that that of pure crystal. In further study, we broaden the study to transport coefficient of radiation damaged structures using molecular dynamics. Although molecular dynamics is tools for treating microscopic scale, most macroscopic issues related to nuclear materials such as voids in fuel materials and weakened mechanical properties by radiation are based on microscopic basis. Thus, research on microscopic scale would be expanded in this field and many hidden mechanism in atomic scales will be revealed via both atomic scale simulations and experiments

Electron heat conduction and suprathermal particles

International Nuclear Information System (INIS)

Bakunin, O.G.; Krasheninnikov, S.I.

1991-01-01

As recognized at present, the applicability of Spitzer-Harm's theory on electron heat conduction along the magnetic field is limited by comparatively small values of the thermal electron mean free path ratio, λ to the characteristic length of changes in plasma parameters, L: γ=λ/L≤10 -2 . The stationary kinetic equation for the electron distribution function inhomogeneous along the x-axis f e (v,x) allows one to have solutions in the self-similar variables. The objective of a given study is to generalize the solutions for the case of arbitrary Z eff , that will allow one to compare approximate solutions to the kinetic equation with the precise ones in a wide range of parameters. (author) 8 refs., 2 figs

Thermal conductance of heat transfer interfaces for conductively cooled superconducting magnets

International Nuclear Information System (INIS)

Cooper, T.L.; Walters, J.D.; Fikse, T.H.

1996-01-01

Minimizing thermal resistances across interfaces is critical for efficient thermal performance of conductively cooled superconducting magnet systems. Thermal conductance measurements have been made for a flexible thermal coupling, designed to accommodate magnet-to-cryocooler and cryocooler-to-shield relative motion, and an interface incorporating Multilam designed as a sliding thermal connector for cryocoolers. Temperature changes were measured across each interface as a function of heat input. Thermal conductances have been calculated for each interface, and the impact of each interface on conductively cooled magnet systems will be discussed

Controlling Thermal Conduction by Graded Materials

Science.gov (United States)

Ji, Qin; Huang, Ji-Ping

2018-04-01

Manipulating thermal conductivities are fundamentally important for controlling the conduction of heat at will. Thermal cloaks and concentrators, which have been extensively studied recently, are actually graded materials designed according to coordinate transformation approaches, and their effective thermal conductivity is equal to that of the host medium outside the cloak or concentrator. Here we attempt to investigate a more general problem: what is the effective thermal conductivity of graded materials? In particular, we perform a first-principles approach to the analytic exact results of effective thermal conductivities of materials possessing either power-law or linear gradation profiles. On the other hand, by solving Laplace’s equation, we derive a differential equation for calculating the effective thermal conductivity of a material whose thermal conductivity varies along the radius with arbitrary gradation profiles. The two methods agree with each other for both external and internal heat sources, as confirmed by simulation and experiment. This work provides different methods for designing new thermal metamaterials (including thermal cloaks and concentrators), in order to control or manipulate the transfer of heat. Support by the National Natural Science Foundation of China under Grant No. 11725521, by the Science and Technology Commission of Shanghai Municipality under Grant No. 16ZR1445100

Temperature-dependent thermal conductivity of flexible yttria-stabilized zirconia substrate via 3ω technique

Energy Technology Data Exchange (ETDEWEB)

Singh, Shivkant; Yarali, Milad; Mavrokefalos, Anastassios [Department of Mechanical Engineering, University of Houston, Houston, TX (United States); Shervin, Shahab [Materials Science and Engineering Program, University of Houston, Houston, TX (United States); Venkateswaran, Venkat; Olenick, Kathy; Olenick, John A. [ENrG Inc., Buffalo, NY (United States); Ryou, Jae-Hyun [Department of Mechanical Engineering, University of Houston, Houston, TX (United States); Materials Science and Engineering Program, University of Houston, Houston, TX (United States); Texas Center for Superconductivity, University of Houston (TcSUH), Houston, TX (United States)

2017-10-15

Thermal management in flexible electronic has proven to be challenging thereby limiting the development of flexible devices with high power densities. To truly enable the technological implementation of such devices, it is imperative to develop highly thermally conducting flexible substrates that are fully compatible with large-scale fabrication. Here, we present the thermal conductivity of state-of-the-art flexible yttria-stabilized zirconia (YSZ) substrates measured using the 3ω technique, which is already commercially manufactured via roll-to-roll technique. We observe that increasing the grain size increases the thermal conductivity of the flexible 3 mol.% YSZ, while the flexibility and transparency of the sample are hardly affected by the grain size enlargement. We exhibit thermal conductivity values of up to 4.16 Wm{sup -1}K {sup -1} that is at least 4 times higher than state-of-the-art polymeric flexible substrates. Phonon-hopping model (PHM) for granular material was used to fit the measured thermal conductivity and accurately define the thermal transport mechanism. Our results show that through grain size optimization, YSZ flexible substrates can be realized as flexible substrates, that pave new avenues for future novel application in flexible electronics through the utilization of both their ceramic structural flexibility and high heat dissipating capability. (copyright 2017 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

Test design requirements: Thermal conductivity probe testing

International Nuclear Information System (INIS)

Heath, R.E.

1985-01-01

This document establishes the test design requirements for development of a thermal conductivity probe test. The thermal conductivity probe determines in situ thermal conductivity using a line source transient heat conduction analysis. This document presents the rationale for thermal conductivity measurement using a thermal conductivity probe. A general test description is included. Support requirements along with design constraints are detailed to allow simple design of the thermal conductivity probe and test. The schedule and delivery requirements of the responsible test designer are also included. 7 refs., 1 fig

Anomalous conductivity and electron heating in a plasma unstable to the two-stream instability

International Nuclear Information System (INIS)

Clark, W.H.M.; Hamberger, S.M.

1979-01-01

An experiment to excite the electron-ion two-stream instability in a cylindrical Q-machine plasma column is described. The mechanism for establishing a large pulsed electron drift velocity in the plasma by applying a potential difference between the end electrodes is discussed. The pulsed current-voltage characteristic of the plasma column and the temporal evolution of the electron density, drift velocity and thermal velocity are measured. In contrast with the behaviour of some computer simulations of the two-stream instability, the plasma exhibits a constant conductivity and the electron thermal velocity increases to values far in excess of the drift velocity. The electrical dissipation is consistent with the increase of the electron thermal energy, both indicating an anomalous conductivity of the same order as an empirical scaling found in earlier experiments on a toroidal discharge. (author)

Seeded growth of boron arsenide single crystals with high thermal conductivity

Science.gov (United States)

Tian, Fei; Song, Bai; Lv, Bing; Sun, Jingying; Huyan, Shuyuan; Wu, Qi; Mao, Jun; Ni, Yizhou; Ding, Zhiwei; Huberman, Samuel; Liu, Te-Huan; Chen, Gang; Chen, Shuo; Chu, Ching-Wu; Ren, Zhifeng

2018-01-01

Materials with high thermal conductivities are crucial to effectively cooling high-power-density electronic and optoelectronic devices. Recently, zinc-blende boron arsenide (BAs) has been predicted to have a very high thermal conductivity of over 2000 W m-1 K-1 at room temperature by first-principles calculations, rendering it a close competitor for diamond which holds the highest thermal conductivity among bulk materials. Experimental demonstration, however, has proved extremely challenging, especially in the preparation of large high quality single crystals. Although BAs crystals have been previously grown by chemical vapor transport (CVT), the growth process relies on spontaneous nucleation and results in small crystals with multiple grains and various defects. Here, we report a controllable CVT synthesis of large single BAs crystals (400-600 μm) by using carefully selected tiny BAs single crystals as seeds. We have obtained BAs single crystals with a thermal conductivity of 351 ± 21 W m-1 K-1 at room temperature, which is almost twice as conductive as previously reported BAs crystals. Further improvement along this direction is very likely.

On the Boltzmann Equation of Thermal Transport for Interacting Phonons and Electrons

Directory of Open Access Journals (Sweden)

Amelia Carolina Sparavigna

2016-05-01

Full Text Available The thermal transport in a solid can be determined by means of the Boltzmann equations regarding its distributions of phonons and electrons, when the solid is subjected to a thermal gradient. After solving the coupled equations, the related thermal conductivities can be obtained. Here we show how to determine the coupled equations for phonons and electrons.

Composites of aluminum alloy and magnesium alloy with graphite showing low thermal expansion and high specific thermal conductivity

Science.gov (United States)

Oddone, Valerio; Boerner, Benji; Reich, Stephanie

2017-12-01

High thermal conductivity, low thermal expansion and low density are three important features in novel materials for high performance electronics, mobile applications and aerospace. Spark plasma sintering was used to produce light metal-graphite composites with an excellent combination of these three properties. By adding up to 50 vol.% of macroscopic graphite flakes, the thermal expansion coefficient of magnesium and aluminum alloys was tuned down to zero or negative values, while the specific thermal conductivity was over four times higher than in copper. No degradation of the samples was observed after thermal stress tests and thermal cycling. Tensile strength and hardness measurements proved sufficient mechanical stability for most thermal management applications. For the production of the alloys, both prealloyed powders and elemental mixtures were used; the addition of trace elements to cope with the oxidation of the powders was studied.

Multifunctional Lattices with Low Thermal Expansion and Low Thermal Conductivity

Science.gov (United States)

Xu, Hang; Liu, Lu; Pasini, Damiano

Systems in space are vulnerable to large temperature changes when travelling into and out of the Earth's shadow. Variations in temperature can lead to undesired geometric changes in susceptible applications requiring very fine precision. In addition, temperature-sensitive electronic equipment hosted in a satellite needs adequate thermal-control to guarantee a moderate ambient temperature. To address these specifications, materials with low coefficient of thermal expansion (CTE) and low coefficient of thermal conductivity (CTC) over a wide range of temperatures are often sought, especially for bearing components in satellites. Besides low CTE and low CTC, these materials should also provide desirable stiffness, strength and extraordinarily low mass. This work presents ultralightweight bi-material lattices with tunable CTE and CTC, besides high stiffness and strength. We show that the compensation of the thermal expansion and joint rotation at the lattice joints can be used as an effective strategy to tailor thermomechanical performance. Proof-of-concept lattices are fabricated from Al and Ti alloy sheets via a simple snap-fit technique and vacuum brazing, and their CTE and CTC are assessed via a combination of experiments and theory. Corresponding Author.

Effect of copper content on the thermal conductivity and thermal expansion of Al–Cu/diamond composites

International Nuclear Information System (INIS)

Wu, Jianhua; Zhang, Hailong; Zhang, Yang; Li, Jianwei; Wang, Xitao

2012-01-01

Highlights: ► Al–Cu/diamond composites have been produced by a squeeze casting method. ► Cu alloying is an effective approach to promoting interface bonding between metal matrix and diamond. ► Alloying Cu to Al matrix improves thermal conductivity and reduces coefficient of thermal expansion of the composites. -- Abstract: Al–Cu matrix composites reinforced with diamond particles (Al–Cu/diamond composites) have been produced by a squeeze casting method. Cu content added to Al matrix was varied from 0 to 3.0 wt.% to detect the effect on thermal conductivity and thermal expansion behavior of the resultant Al–Cu/diamond composites. The measured thermal conductivity for the Al–Cu/diamond composites increased from 210 to 330 W/m/K with increasing Cu content from 0 to 3.0 wt.%. Accordingly, the coefficient of thermal expansion (CTE) was tailored from 13 × 10 −6 to 6 × 10 −6 /K, which is compatible with the CTE of semiconductors in electronic packaging applications. The enhanced thermal conductivity and reduced coefficient of thermal expansion were ascribed to strong interface bonding in the Al–Cu/diamond composites. Cu addition has lowered the melting point and resulted in the formation of Al 2 Cu phase in Al matrix. This is the underlying mechanism responsible for the strengthening of Al–Cu/diamond interface. The results show that Cu alloying is an effective approach to promoting interface bonding between Al and diamond.

Thermal conductivity of high performance carbon nanotube yarn-like fibers

Energy Technology Data Exchange (ETDEWEB)

Mayhew, Eric; Prakash, Vikas, E-mail: vikas.prakash@case.edu [Department of Mechanical and Aerospace Engineering, Case Western Reserve University, Cleveland, Ohio 44106-7222 (United States)

2014-05-07

In the present paper, we present results of thermal conductivity measurements in free standing carbon nanotube (CNT) yarn-like fibers. The measurements are made using a T-type experimental configuration utilizing a Wollaston-wire hot probe inside a scanning electron microscope. In this technique, a suspended platinum wire is used both as a heater and a thermal sensor. A low frequency alternating current source is used to heat the probe wire while the third harmonic voltage across the wire is measured by a lock-in amplifier. The conductivity is deduced from an analytical model that relates the drop in the spatially averaged temperature of the wire to that of the sample. The average thermal conductivity of the neat CNT fibers and the CNT –polymer composite fibers is found to be 448 W/m-K and 225 W/m-K, respectively. These values for conductivity are amongst the highest measured for CNT yarn-like fibers fabricated using a dry spinning process from vertically aligned CNT arrays. The enhancement in thermal conductivity is understood to be due to an increase in the CNT fiber elastic stiffness during the draw and twist operations, lower CNT thermal contact resistance due to increase in CNT contact area, and better alignment of the CNT fibrils along the length of the fiber.

Auto-Thermal Reforming Using Mixed Ion-Electronic Conducting Ceramic Membranes for a Small-Scale H2 Production Plant

Directory of Open Access Journals (Sweden)

Vincenzo Spallina

2015-03-01

Full Text Available The integration of mixed ionic electronic conducting (MIEC membranes for air separation in a small-to-medium scale unit for H2 production (in the range of 650–850 Nm3/h via auto-thermal reforming of methane has been investigated in the present study. Membranes based on mixed ionic electronic conducting oxides such as Ba0.5Sr0.5Co0.8Fe0.2O3-δ (BSCF give sufficiently high oxygen fluxes at temperatures above 800 °C with high purity (higher than 99%. Experimental results of membrane permeation tests are presented and used for the reactor design with a detailed reactor model. The assessment of the H2 plant has been carried out for different operating conditions and reactor geometry and an energy analysis has been carried out with the flowsheeting software Aspen Plus, including also the turbomachines required for a proper thermal integration. A micro-gas turbine is integrated in the system in order to supply part of the electricity required in the system. The analysis of the system shows that the reforming efficiency is in the range of 62%–70% in the case where the temperature at the auto-thermal reforming membrane reactor (ATR-MR is equal to 900 °C. When the electric consumption and the thermal export are included the efficiency of the plant approaches 74%–78%. The design of the reactor has been carried out using a reactor model linked to the Aspen flowsheet and the results show that with a larger reactor volume the performance of the system can be improved, especially because of the reduced electric consumption. From this analysis it has been found that for a production of about 790 Nm3/h pure H2, a reactor with a diameter of 1 m and length of 1.8 m with about 1500 membranes of 2 cm diameter is required.

Thermal conductivity of Al–Cu–Mg–Si alloys: Experimental measurement and CALPHAD modeling

Energy Technology Data Exchange (ETDEWEB)

Zhang, Cong [State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan 410083 (China); Sino-German cooperation group “Microstructure in Al alloys”, Central South University, Changsha, Hunan 410083 (China); Du, Yong, E-mail: yong-du@csu.edu.cn [State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan 410083 (China); Sino-German cooperation group “Microstructure in Al alloys”, Central South University, Changsha, Hunan 410083 (China); Liu, Shuhong; Liu, Yuling [State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan 410083 (China); Sino-German cooperation group “Microstructure in Al alloys”, Central South University, Changsha, Hunan 410083 (China); Sundman, Bo. [INSTN, CEA Saclay, 91191 Gif-sur-Yvette Cedex (France)

2016-07-10

Highlights: • The thermal conductivities of Al–x wt% Cu (x = 1, 3, 5, 15 and 30) and Al–y wt% Si (y = 2, 12.5 and 20) alloys were determined. • The reported thermal conductivities of Al–Cu–Mg–Si system were critically reviewed. • The CALPHAD approach was applied for the modeling of thermal conductivity. • The applicability of CALPHAD technique in the modeling of thermal conductivity was discussed. - Abstract: In the present work, the thermal conductivities and microstructure of Al–x wt% Cu (x = 1, 3, 5, 15 and 30) and Al–y wt% Si (y = 2, 12.5 and 20) alloys were investigated by using laser-flash method, scanning electron microscopy (SEM) and X-ray diffraction (XRD). Besides, a CALPHAD (CALculation of PHAse Diagram) approach to evaluate the thermal conductivity of Al–Cu–Mg–Si system was performed. The numerical models for the thermal conductivity of pure elements and stoichiometric phases were described as polynomials, and the coefficients were optimized via PARROT module of Thermal-Calc software applied to the experimental data. The thermal conductivity of (Al)-based solid solutions was described by using Redlich–Kister interaction parameters. For alloys in two-phase region, the interface scattering parameter was proposed in the modeling to describe the impediment of interfaces on the heat transfer. Finally, a set of self-consistent parameters for the description of thermal conductivity in Al–Cu–Mg–Si system was obtained, and comprehensive comparisons between the calculated and measured thermal conductivities show that the experimental information is satisfactorily accounted for by the present modeling.

Simultaneous measurement of thermal conductivity, thermal diffusivity and prediction of effective thermal conductivity of porous consolidated igneous rocks at room temperature

International Nuclear Information System (INIS)

Aurangzeb; Ali, Zulqurnain; Gurmani, Samia Faiz; Maqsood, Asghari

2006-01-01

Thermal conductivity, thermal diffusivity and heat capacity per unit volume of porous consolidated igneous rocks have been measured, simultaneously by Gustafsson's probe at room temperature and normal pressure using air as saturant. Data are presented for eleven samples of dunite, ranging in porosity from 0.130 to 0.665% by volume, taken from Chillas near Gilgit, Pakistan. The porosity and density parameters have been measured using American Society of Testing and Materials (ASTM) standards at ambient conditions. The mineral composition of samples has been analysed from their thin sections (petrography). An empirical model to predict the thermal conductivity of porous consolidated igneous rocks is also proposed. The thermal conductivities are predicted by some of the existing models along with the proposed one. It is observed that the values of effective thermal conductivity predicted by the proposed model are in agreement with the experimental thermal conductivity data within 6%

Thermal stability and electrical conductivity in polyethers-molybdenum disulfide nanocomposites

International Nuclear Information System (INIS)

Mirabal, N.; Aguirre, P.; Santa Ana, M.A.; Benavente, E.; Gonzalez, Guillermo

2003-01-01

The intercalation of poly(ethylene oxide) (PEO), into molybdenum disulfide, like that of other electron pair donors, leads to mixed ionic-electronic conductors. At room temperature, intercalates show electrical and lithium-ion conductivities better than MoS 2 and bulk PEO composites, respectively. However, these products are known to be sensitive to temperature; indeed, in the range 80-100 deg. C an irreversible decrease of the electrical conductivity is observed. In order to investigate these features, the thermal behavior of a series of polyethers of different molecular weights (poly(ethylene glycol) (Mw 3400) and PEO with Mw in the range 10 4 -4x10 6 , pure and intercalated in MoS 2 , (Li x (MoS 2 )(polyether) y with x∼0.1 and y=1.1-1.5), was comparatively analyzed. Furthermore, the effect of thermal treatment of the sample on the electrical conductivity was studied for one of the intercalated products. Results indicate that irreversible changes, detected by both loss of weight and a significant conductivity lowering, are occurring in the range from about 100 deg. C to a temperature near to the decomposition point of the organic phase at about 350 deg. C

Interlayer thermal conductance within a phosphorene and graphene bilayer.

Science.gov (United States)

Hong, Yang; Zhang, Jingchao; Zeng, Xiao Cheng

2016-11-24

Monolayer graphene possesses unusual thermal properties, and is often considered as a prototype system for the study of thermal physics of low-dimensional electronic/thermal materials, despite the absence of a direct bandgap. Another two-dimensional (2D) atomic layered material, phosphorene, is a natural p-type semiconductor and it has attracted growing interest in recent years. When a graphene monolayer is overlaid on phosphorene, the hybrid van der Waals (vdW) bilayer becomes a potential candidate for high-performance thermal/electronic applications, owing to the combination of the direct-bandgap properties of phosphorene with the exceptional thermal properties of graphene. In this work, the interlayer thermal conductance at the phosphorene/graphene interface is systematically investigated using classical molecular dynamics (MD) simulation. The transient pump-probe heating method is employed to compute the interfacial thermal resistance (R) of the bilayer. The predicted R value at the phosphorene/graphene interface is 8.41 × 10 -8 K m 2 W -1 at room temperature. Different external and internal conditions, i.e., temperature, contact pressure, vacancy defect, and chemical functionalization, can all effectively reduce R at the interface. Numerical results of R reduction as a function of temperature, interfacial coupling strength, defect ratio, or hydrogen coverage are reported with the most R reduction amounting to 56.5%, 70.4%, 34.8% and 84.5%, respectively.

Method for Measuring Thermal Conductivity of Small Samples Having Very Low Thermal Conductivity

Science.gov (United States)

Miller, Robert A.; Kuczmarski, Maria a.

2009-01-01

This paper describes the development of a hot plate method capable of using air as a standard reference material for the steady-state measurement of the thermal conductivity of very small test samples having thermal conductivity on the order of air. As with other approaches, care is taken to ensure that the heat flow through the test sample is essentially one-dimensional. However, unlike other approaches, no attempt is made to use heated guards to block the flow of heat from the hot plate to the surroundings. It is argued that since large correction factors must be applied to account for guard imperfections when sample dimensions are small, it may be preferable to simply measure and correct for the heat that flows from the heater disc to directions other than into the sample. Experimental measurements taken in a prototype apparatus, combined with extensive computational modeling of the heat transfer in the apparatus, show that sufficiently accurate measurements can be obtained to allow determination of the thermal conductivity of low thermal conductivity materials. Suggestions are made for further improvements in the method based on results from regression analyses of the generated data.

Thermal conductivity and thermal diffusivity of solid UO2

International Nuclear Information System (INIS)

Fink, J.K.; Chasanov, M.G.; Leibowitz, L.

1981-06-01

New equations for the thermal conductivity of solid UO 2 were derived based upon a nonlinear least squares fit of the data available in the literature. In the development of these equations, consideration was given to their thermodynamic consistency with heat capacity and density and theoretical consistency with enthalpy and heat capacity. Consistent with our previous treatment of enthalpy and heat capacity, 2670 K was selected as the temperature of a phase transition. A nonlinear equation, whose terms represent contributions due to phonons and electrons, was selected for the temperature region below 2670 K. Above 2670 K, the data were fit by a linear equation

Fiber/matrix interfacial thermal conductance effect on the thermal conductivity of SiC/SiC composites

International Nuclear Information System (INIS)

Nguyen, Ba Nghiep; Henager, Charles H.

2013-01-01

SiC/SiC composites used in fusion reactor applications are subjected to high heat fluxes and require knowledge and tailoring of their in-service thermal conductivity. Accurately predicting the thermal conductivity of SiC/SiC composites as a function of temperature will guide the design of these materials for their intended use, which will eventually include the effects of 14-MeV neutron irradiations. This paper applies an Eshelby–Mori–Tanaka approach (EMTA) to compute the thermal conductivity of unirradiated SiC/SiC composites. The homogenization procedure includes three steps. In the first step EMTA computes the homogenized thermal conductivity of the unidirectional (UD) SiC fiber embraced by its coating layer. The second step computes the thermal conductivity of the UD composite formed by the equivalent SiC fibers embedded in a SiC matrix, and finally the thermal conductivity of the as-formed SiC/SiC composite is obtained by averaging the solution for the UD composite over all possible fiber orientations using the second-order fiber orientation tensor. The EMTA predictions for the transverse thermal conductivity of several types of SiC/SiC composites with different fiber types and interfaces are compared to the predicted and experimental results by Youngblood et al. [J. Nucl. Mater. 307–311 (2002) 1120–1125, Fusion Sci. Technol. 45 (2004) 583–591, Compos. Sci. Technol. 62 (2002) 1127–1139.

Thermal conductivities of single- and multi-layer phosphorene: a molecular dynamics study.

Science.gov (United States)

Zhang, Ying-Yan; Pei, Qing-Xiang; Jiang, Jin-Wu; Wei, Ning; Zhang, Yong-Wei

2016-01-07

As a new two-dimensional (2D) material, phosphorene has drawn growing attention owing to its novel electronic properties, such as layer-dependent direct bandgaps and high carrier mobility. Herein we investigate the in-plane and cross-plane thermal conductivities of single- and multi-layer phosphorene, focusing on geometrical (sample size, orientation and layer number) and strain (compression and tension) effects. A strong anisotropy is found in the in-plane thermal conductivity with its value along the zigzag direction being much higher than that along the armchair direction. Interestingly, the in-plane thermal conductivity of multi-layer phosphorene is insensitive to the layer number, which is in strong contrast to that of graphene where the interlayer interactions strongly influence the thermal transport. Surprisingly, tensile strain leads to an anomalous increase in the in-plane thermal conductivity of phosphorene, in particular in the armchair direction. Both the in-plane and cross-plane thermal conductivities can be modulated by external strain; however, the strain modulation along the cross-plane direction is more effective and thus more tunable than that along the in-plane direction. Our findings here are of great importance for the thermal management in phosphorene-based nanoelectronic devices and for thermoelectric applications of phosphorene.

Models of electron conductivity which lead to ablation stabilization of fluid instabilities in laser-driven implosions

International Nuclear Information System (INIS)

Lindl, J.D.; Mead, W.C.

1975-01-01

LASNEX calculations with a modified electron conductivity show the existence of a firepolishing stabilization effect. By modifying the thermal conductivity so that K α T/sup n//rho/sup m/, one is able to construct a situation in which the electrons deposit their energy in a thin layer at the ablation surface and closely match the zero order solutions assumed earlier. The firepolishing effect appears to require that a significant fraction of the total pressure be due to the ablation process itself rather than the thermal pressure in the corona gas. It also requires KL approximately 1 where L is the scale height for decay of thermal perturbations generated at the ablation surface. For classical electron conductivity, because the thermal flux depends linearly on the grams/cm 2 necessary to stop the electrons, (1/rho) nabla rho approximately (1/T) nabla T near the ablation surface so that the pressure is nearly constant across the ablation surface. Hence there is no ablation pressure as such and no firepolishing effect for electron-driven implosions

Thermal conductivity of electrospun polyethylene nanofibers.

Science.gov (United States)

Ma, Jian; Zhang, Qian; Mayo, Anthony; Ni, Zhonghua; Yi, Hong; Chen, Yunfei; Mu, Richard; Bellan, Leon M; Li, Deyu

2015-10-28

We report on the structure-thermal transport property relation of individual polyethylene nanofibers fabricated by electrospinning with different deposition parameters. Measurement results show that the nanofiber thermal conductivity depends on the electric field used in the electrospinning process, with a general trend of higher thermal conductivity for fibers prepared with stronger electric field. Nanofibers produced at a 45 kV electrospinning voltage and a 150 mm needle-collector distance could have a thermal conductivity of up to 9.3 W m(-1) K(-1), over 20 times higher than the typical bulk value. Micro-Raman characterization suggests that the enhanced thermal conductivity is due to the highly oriented polymer chains and enhanced crystallinity in the electrospun nanofibers.

Effect of Si doping on the thermal conductivity of bulk GaN at elevated temperatures – theory and experiment

Directory of Open Access Journals (Sweden)

P. P. Paskov

2017-09-01

Full Text Available The effect of Si doping on the thermal conductivity of bulk GaN was studied both theoretically and experimentally. The thermal conductivity of samples grown by Hydride Phase Vapor Epitaxy (HVPE with Si concentration ranging from 1.6×1016 to 7×1018 cm-3 was measured at room temperature and above using the 3ω method. The room temperature thermal conductivity was found to decrease with increasing Si concentration. The highest value of 245±5 W/m.K measured for the undoped sample was consistent with the previously reported data for free-standing HVPE grown GaN. In all samples, the thermal conductivity decreased with increasing temperature. In our previous study, we found that the slope of the temperature dependence of the thermal conductivity gradually decreased with increasing Si doping. Additionally, at temperatures above 350 K the thermal conductivity in the highest doped sample (7×1018 cm-3 was higher than that of lower doped samples. In this work, a modified Callaway model adopted for n-type GaN at high temperatures was developed in order to explain such unusual behavior. The experimental data was analyzed with examination of the contributions of all relevant phonon scattering processes. A reasonable match between the measured and theoretically predicted thermal conductivity was obtained. It was found that in n-type GaN with low dislocation densities the phonon-free-electron scattering becomes an important resistive process at higher temperatures. At the highest free electron concentrations, the electronic thermal conductivity was suggested to play a role in addition to the lattice thermal conductivity and compete with the effect of the phonon-point-defect and phonon-free-electron scattering.

Thermal conductivity of organic semi-conducting materials using 3omega and photothermal radiometry techniques

Directory of Open Access Journals (Sweden)

Reisdorffer Frederic

2014-01-01

Full Text Available Organic semiconductors for opto-electronic devices show several defects which can be enhanced while increasing the operating temperature. Their thermal management and especially the reduction of their temperature are of great interest. For the heat transfer study, one has to measure the thermal conductivity of thin film organic materials. However the major difficulty for this measurement is the very low thickness of the films which needs the use of very specific techniques. In our work, the 3-omega and photothermal radiometric methods were used to measure the thermal conductivity of thin film organic semiconducting material (Alq3. The measurements were performed as function of the thin film thickness from 45 to 785 nm and also of its temperature from 80 to 350 K. With the 3 omega method, a thermal conductivity value of 0.066 W.m−1K−1 was obtained for Alq3 thin film of 200 nm at room temperature, in close agreement with the photothermal value. Both techniques appear to be complementary: the 3 omega method is easier to implement for large temperature range and small thicknesses down to a few tens of nanometers whereas the photothermal method is more suitable for thicknesses over 200nm since it provides additional information such as the thin film volumetric heat capacity.

Thermal conductivity and phase-change properties of aqueous alumina nanofluid

International Nuclear Information System (INIS)

Teng, Tun-Ping

2013-01-01

Highlights: ► The alumina nanofluid with chitosan was produced by two-step synthesis method. ► The k and phase-change properties of alumina nanofluid were examined. ► Adding Al 2 O 3 nanoparticles into water indeed improves the k. ► Adding the chitosan decreases the thermal conductivity of alumina nanofluid. ► The T cp and h c are 53.4% and 97.8% of those in DW with the optimal combination. - Abstract: This study uses thermal conductivity and differential scanning calorimeter experiments to explore the thermal conductivity and phase-change properties of alumina (Al 2 O 3 )–water nanofluid produced using a two-step synthesis method. Deionized water (DW) is used as a control group, and the Al 2 O 3 –water nanofluid uses chitosan as a dispersant. Nanoparticle morphology and materials were confirmed using transmission electron microscopy (TEM) and X-ray diffraction (XRD), respectively. The results show that adding Al 2 O 3 nanoparticles to DW improves DW thermal conductivity, but adding chitosan reduces the thermal conductivity of Al 2 O 3 –water nanofluid. Adding the nanoparticles to DW affects the phase-change peak temperature and phase change heat. The optimal combination is 0.1 wt.% chitosan and 0.5 wt.% Al 2 O 3 nanoparticles; the charging phase-change peak temperature and latent heat are 53.4% and 97.8% of those in DW, respectively

Tensile fracture and thermal conductivity characterization of toughened epoxy/CNT nanocomposites

Energy Technology Data Exchange (ETDEWEB)

Balakrishnan, Anandh [School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK 73019 (United States); Saha, Mrinal C., E-mail: msaha@ou.edu [School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK 73019 (United States)

2011-01-25

Rubber toughened epoxy/CNT nanocomposites were manufactured at different weight percents between 0 and 1% of multiwall carbon nanotube (MWNT) using a high intensity ultrasonic liquid processor with a titanium probe. Mechanical properties of manufactured dog bone samples were measured in tension and the results indicated a maximum of 23% increase in the elastic modulus at 0.6% by weight of MWNT. However, the fracture strength showed a maximum decrease of about 11% as a function of increasing MWNT loading. Scanning Electron Microscopy (SEM) images from the neat samples revealed a distinct circular pit at the top left edge of the specimen with an overall tearing deformation causing the fracture paths. Comparatively, all nanocomposite samples on an average seemed to show a prominent brittle fracture with little or no evidence of circular pit formation. The amount of tearing deformation seemed to be enhanced in the nanocomposite specimens as compare to the neat ones. Finally, Transmission Electron Microscopy images indicated that different states of dispersion exist in all of the nanocomposite samples. The data showed that agglomeration of nanotubes increases as a function of weight percent. In addition to mechanical property characterization, thermal conductivity of all the samples was determined as a function of temperature between 30 deg. C and 100 deg. C using the 3{omega} method. The tested samples showed an almost 16% increase in thermal conductivity. The minimal enhancement in thermal conductivity has been analyzed from the standpoint of the Effective Medium Theory. Interfacial thermal resistances exhibit no order of magnitude changes explaining the conductivity results.

Tensile fracture and thermal conductivity characterization of toughened epoxy/CNT nanocomposites

International Nuclear Information System (INIS)

Balakrishnan, Anandh; Saha, Mrinal C.

2011-01-01

Rubber toughened epoxy/CNT nanocomposites were manufactured at different weight percents between 0 and 1% of multiwall carbon nanotube (MWNT) using a high intensity ultrasonic liquid processor with a titanium probe. Mechanical properties of manufactured dog bone samples were measured in tension and the results indicated a maximum of 23% increase in the elastic modulus at 0.6% by weight of MWNT. However, the fracture strength showed a maximum decrease of about 11% as a function of increasing MWNT loading. Scanning Electron Microscopy (SEM) images from the neat samples revealed a distinct circular pit at the top left edge of the specimen with an overall tearing deformation causing the fracture paths. Comparatively, all nanocomposite samples on an average seemed to show a prominent brittle fracture with little or no evidence of circular pit formation. The amount of tearing deformation seemed to be enhanced in the nanocomposite specimens as compare to the neat ones. Finally, Transmission Electron Microscopy images indicated that different states of dispersion exist in all of the nanocomposite samples. The data showed that agglomeration of nanotubes increases as a function of weight percent. In addition to mechanical property characterization, thermal conductivity of all the samples was determined as a function of temperature between 30 deg. C and 100 deg. C using the 3ω method. The tested samples showed an almost 16% increase in thermal conductivity. The minimal enhancement in thermal conductivity has been analyzed from the standpoint of the Effective Medium Theory. Interfacial thermal resistances exhibit no order of magnitude changes explaining the conductivity results.

Relation of Thermal Conductivity with Process Induced Anisotropic Void Systems in EB-PVD PYSZ Thermal Barrier Coatings

Energy Technology Data Exchange (ETDEWEB)

Renteria, A. Flores; Saruhan-Brings, B.; Ilavsky, J.

2008-03-03

Thermal barrier coatings (TBCs) deposited by Electron-beam physical deposition (EB-PVD) protect the turbine blades situated at the high pressure sector of the aircraft and stationary turbines. It is an important task to uphold low thermal conductivity in TBCs during long-term service at elevated temperatures. One of the most promising methods to fulfil this task is to optimize the properties of PYSZ-based TBC by tailoring its microstructure. Thermal conductivity of the EB-PVD produced PYSZ TBCs is influenced mainly by the size, shape, orientation and volume of the various types of porosity present in the coatings. These pores can be classified as open (inter-columnar and between feather arms gaps) and closed (intra-columnar pores). Since such pores are located within the three-dimensionally deposited columns and enclose large differences in their sizes, shapes, distribution and anisotropy, the accessibility for their characterization is very complex and requires the use of sophisticated methods. In this work, three different EB-PVD TBC microstructures were manufactured by varying the process parameters, yielding various characteristics of their pores. The corresponding thermal conductivities in as-coated state and after ageing at 11000C/1h and 100h were measured via Laser Flash Analysis Method (LFA). The pore characteristics and their individual effect on the thermal conductivity are analysed by USAXS which is supported by subsequent modelling and LFA methods, respectively. Evident differences in the thermal conductivity values of each microstructure were found in as-coated and aged conditions. In summary, broader columns introduce higher values in thermal conductivity. In general, thermal conductivity increases after ageing for all three investigated microstructures, although those with initial smaller pore surface area show smaller changes.

Relation of thermal conductivity with process induced anisotropic void system in EB-PVD PYSZ thermal barrier coatings.

Energy Technology Data Exchange (ETDEWEB)

Renteria, A. F.; Saruhan, B.; Ilavsky, J.; German Aerospace Center

2007-01-01

Thermal barrier coatings (TBCs) deposited by Electron-beam physical deposition (EB-PVD) protect the turbine blades situated at the high pressure sector of the aircraft and stationary turbines. It is an important task to uphold low thermal conductivity in TBCs during long-term service at elevated temperatures. One of the most promising methods to fulfil this task is to optimize the properties of PYSZ-based ,TBC by tailoring its microstructure. Thermal conductivity of the EB-PVD produced PYSZ TBCs is influenced mainly by the size, shape, orientation and volume of the various types of porosity present in the coatings. These pores can be classified as open (inter-columnar and between feather arms gaps) and closed (intra-columnar pores). Since such pores are located within the three-dimensionally deposited columns and enclose large differences in their sizes, shapes, distribution and anisotropy, the accessibility for their characterization is very complex and requires the use of sophisticated methods. In this work, three different EB-PVD TBC microstructures were manufactured by varying the process parameters, yielding various characteristics of their pores. The corresponding thermal conductivities in as-coated state and after ageing at 1100C/1h and 100h were measured via Laser Flash Analysis Method (LFA). The pore characteristics and their individual effect on the thermal conductivity are analysed by USAXS which is supported by subsequent modelling and LFA methods, respectively. Evident differences in the thermal conductivity values of each microstructure were found in as-coated and aged conditions. In summary, broader columns introduce higher values in thermal conductivity. In general, thermal conductivity increases after ageing for all three investigated microstructures, although those with initial smaller pore surface area show smaller changes.

Theoretical prediction of thermal conductivity for thermal protection systems

International Nuclear Information System (INIS)

Gori, F.; Corasaniti, S.; Worek, W.M.; Minkowycz, W.J.

2012-01-01

The present work is aimed to evaluate the effective thermal conductivity of an ablative composite material in the state of virgin material and in three paths of degradation. The composite material is undergoing ablation with formation of void pores or char and void pores. The one dimensional effective thermal conductivity is evaluated theoretically by the solution of heat conduction under two assumptions, i.e. parallel isotherms and parallel heat fluxes. The paper presents the theoretical model applied to an elementary cubic cell of the composite material which is made of two crossed fibres and a matrix. A numerical simulation is carried out to compare the numerical results with the theoretical ones for different values of the filler volume fraction. - Highlights: ► Theoretical models of the thermal conductivity of an ablative composite. ► Composite material is made of two crossed fibres and a matrix. ► Three mechanisms of degradation are investigated. ► One dimensional thermal conductivity is evaluated by the heat conduction equation. ► Numerical simulations to be compared with the theoretical models.

Thermal conductivity characteristics of dewatered sewage sludge by thermal hydrolysis reaction.

Science.gov (United States)

Song, Hyoung Woon; Park, Keum Joo; Han, Seong Kuk; Jung, Hee Suk

2014-12-01

The purpose of this study is to quantify the thermal conductivity of sewage sludge related to reaction temperature for the optimal design of a thermal hydrolysis reactor. We continuously quantified the thermal conductivity of dewatered sludge related to the reaction temperature. As the reaction temperature increased, the dewatered sludge is thermally liquefied under high temperature and pressure by the thermal hydrolysis reaction. Therefore, the bound water in the sludge cells comes out as free water, which changes the dewatered sludge from a solid phase to slurry in a liquid phase. As a result, the thermal conductivity of the sludge was more than 2.64 times lower than that of the water at 20. However, above 200, it became 0.704 W/m* degrees C, which is about 4% higher than that of water. As a result, the change in physical properties due to thermal hydrolysis appears to be an important factor for heat transfer efficiency. Implications: The thermal conductivity of dewatered sludge is an important factor the optimal design of a thermal hydrolysis reactor. The dewatered sludge is thermally liquefied under high temperature and pressure by the thermal hydrolysis reaction. The liquid phase slurry has a higher thermal conductivity than pure water.

Synthesis and thermal properties of the MA/HDPE composites with nano-additives as form-stable PCM with improved thermal conductivity

International Nuclear Information System (INIS)

Tang, Yaojie; Su, Di; Huang, Xiang; Alva, Guruprasad; Liu, Lingkun; Fang, Guiyin

2016-01-01

Highlights: • MA/HDPE composites with nano-additives were prepared for thermal conductivity enhancement. • Microstructure and chemical structure of the FSPCM were analyzed. • Thermal properties and thermal reliability of the FSPCM were investigated. • Thermal conductivity of the FSPCM can be enhanced by adding NAO and NG. - Abstract: For the purpose of improving the thermal conductivity of the form–stable phase change materials (FSPCM), two types of nano–powders with high thermal conductivity were added into the samples. In the modified FSPCM, myristic acid (MA) was used as a solid–liquid phase change material (PCM), high density polyethylene (HDPE) acted as supporting material to prevent the leakage of the melted MA. Nano–Al 2 O 3 (NAO) and nano–graphite (NG) were the additives for thermal conductivity enhancement. Scanning electronic microscope (SEM), Fourier transformation infrared spectroscope (FT–IR) and X-ray diffractometer (XRD) were used to analyze the microstructure, chemical structure and crystalline phase of the samples, respectively. Furthermore, the specific latent heat and phase transition temperature, thermal conductivity and thermal reliability were investigated using differential scanning calorimeter (DSC), thermal conductivity meter and thermo–gravimetric analyzer (TGA). The results showed that the MA was uniformly absorbed in the HDPE matrices and there was no leakage during the melting process when the mass fraction of the MA in the MA/HDPE composite was less than 70%. The DSC results revealed that the modified FSPCM have a constant phase change temperature and high specific latent heat. The thermal conductivity of the FSPCM was measured in the solid (30 °C) and liquid (60 °C) states of the MA. When the mass fraction of nano–powder additives is 12%, the thermal conductivities of the FSPCM increase by 95% (NAO) and 121% (NG) at 30 °C. It is anticipated that the FSPCM possess a potential application for thermal energy

Thermal Conductivity of Polymer Composite poypropilene-Sand

International Nuclear Information System (INIS)

Betha; Mashuri; Sudirman; Karo Karo, Aloma

2001-01-01

Thermal conductivity composite materials polypropylene (PP)-sand have been investigated. PP composite with sand to increase thermal conductivity from the polymer. The composite in this observation is done by mixing matrix (PP melt flow 2/10)and filler sand)by means tool labo plastomil. The result of thermal conductivity is composite of PP-sand which is obtained increase and followed by the raising of filler particle volume fraction. The analysis of thermal conductivity based on the model Cheng and Vachon, model Lewis and Nielsen where this model has the function to support experiment finding. It is proved that Lewis' and Nielsen's model almost approach experiment result. And then thermal conductivity raising will be analyzed by the model of pararel-series conductive with the two (2)phases system. It is showed that sand in PP MF 2 composite have the big role to increase the thermal conductivity than sand in PP MF 10 composition, but it is not easy to shape conductive medium

Thermal conductivity from hierarchical heat sinks using carbon nanotubes and graphene nanosheets.

Science.gov (United States)

Hsieh, Chien-Te; Lee, Cheng-En; Chen, Yu-Fu; Chang, Jeng-Kuei; Teng, Hsi-sheng

2015-11-28

The in-plane (kip) and through-plane (ktp) thermal conductivities of heat sinks using carbon nanotubes (CNTs), graphene nanosheets (GNs), and CNT/GN composites are extracted from two experimental setups within the 323-373 K temperature range. Hierarchical three-dimensional CNT/GN frameworks display higher kip and ktp values, as compared to the CNT- and GN-based heat sinks. The kip and ktp values of the CNT/GN-based heat sink reach as high as 1991 and 76 W m(-1) K(-1) at 323 K, respectively. This improved thermal conductivity is attributed to the fact that the hierarchical heat sink offers a stereo thermal conductive network that combines point, line, and plane contact, leading to better heat transport. Furthermore, the compression treatment provided an efficient route to increase both kip and ktp values. This result reveals that the hierarchical carbon structures become denser, inducing more thermal conductive area and less thermal resistivity, i.e., a reduced possibility of phonon-boundary scattering. The correlation between thermal and electrical conductivity (ε) can be well described by two empirical equations: kip = 567 ln(ε) + 1120 and ktp = 20.6 ln(ε) + 36.1. The experimental results are obtained within the temperature range of 323-373 K, suitably complementing the thermal management of chips for consumer electronics.

Thermal conductivity of tungsten–copper composites

International Nuclear Information System (INIS)

Lee, Sang Hyun; Kwon, Su Yong; Ham, Hye Jeong

2012-01-01

Highlights: ► We present the temperature dependence of the thermophysical properties for tungsten–copper composite from room temperature to 400 °C. The powders of tungsten–copper were produced by the spray conversion method and the W–Cu alloys were fabricated by the metal injection molding. Thermal conductivity and thermal expansion of tungsten–copper composite was controllable by volume fraction copper. - Abstract: As the speed and degree of integration of semiconductor devices increases, more heat is generated, and the performance and lifetime of semiconductor devices depend on the dissipation of the generated heat. Tungsten–copper alloys have high electrical and thermal conductivities, low contact resistances, and low coefficients of thermal expansion, thus allowing them to be used as a shielding material for microwave packages, and heat sinks for high power integrated circuits (ICs). In this study, the thermal conductivity and thermal expansion of several types of tungsten–copper (W–Cu) composites are investigated, using compositions of 5–30 wt.% copper balanced with tungsten. The tungsten–copper powders were produced using the spray conversion method, and the W–Cu alloys were fabricated via the metal injection molding. The tungsten–copper composite particles were nanosized, and the thermal conductivity of the W–Cu alloys gradually decreases with temperature increases. The thermal conductivity of the W–30 wt.% Cu composite was 238 W/(m K) at room temperature.

The Measurement of Thermal Conductivities of Silica and Carbon Black Powders at Different pressures by Thermal COnductivity Probe

Institute of Scientific and Technical Information of China (English)

X.G.Liang; X.S.Ge; 等

1992-01-01

This investigation was done to study the gas filled powder insulation and thermal conductivity probe for the measurent of thermal conductivity of powders.The mathematical analysis showed that the heat capacity of the probe itself and the thermal rsistance between the probe and powder must be considered .The authors developed a slender probe and measured the effective thermal conductivity of sillca and carbon black powders under a variety of conditions.

Thermal conductivity of a h-BCN monolayer.

Science.gov (United States)

Zhang, Ying-Yan; Pei, Qing-Xiang; Liu, Hong-Yuan; Wei, Ning

2017-10-18

A hexagonal graphene-like boron-carbon-nitrogen (h-BCN) monolayer, a new two-dimensional (2D) material, has been synthesized recently. Herein we investigate for the first time the thermal conductivity of this novel 2D material. Using molecular dynamics simulations based on the optimized Tersoff potential, we found that the h-BCN monolayers are isotropic in the basal plane with close thermal conductivity magnitudes. Though h-BCN has the same hexagonal lattice as graphene and hexagonal boron nitride (h-BN), it exhibits a much lower thermal conductivity than the latter two materials. In addition, the thermal conductivity of h-BCN monolayers is found to be size-dependent but less temperature-dependent. Modulation of the thermal conductivity of h-BCN monolayers can also be realized by strain engineering. Compressive strain leads to a monotonic decrease in the thermal conductivity while the tensile strain induces an up-then-down trend in the thermal conductivity. Surprisingly, the small tensile strain can facilitate the heat transport of the h-BCN monolayers.

Ballistic and Diffusive Thermal Conductivity of Graphene

Science.gov (United States)

Saito, Riichiro; Masashi, Mizuno; Dresselhaus, Mildred S.

2018-02-01

This paper is a contribution to the Physical Review Applied collection in memory of Mildred S. Dresselhaus. Phonon-related thermal conductivity of graphene is calculated as a function of the temperature and sample size of graphene in which the crossover of ballistic and diffusive thermal conductivity occurs at around 100 K. The diffusive thermal conductivity of graphene is evaluated by calculating the phonon mean free path for each phonon mode in which the anharmonicity of a phonon and the phonon scattering by a 13C isotope are taken into account. We show that phonon-phonon scattering of out-of-plane acoustic phonon by the anharmonic potential is essential for the largest thermal conductivity. Using the calculated results, we can design the optimum sample size, which gives the largest thermal conductivity at a given temperature for applying thermal conducting devices.

Reduction of thermal conductivity in YxSb2-xTe3 for phase change memory

Science.gov (United States)

Li, Zhen; Miao, Naihua; Zhou, Jian; Xu, Huibin; Sun, Zhimei

2017-11-01

Thermal conductivity (κ) is one of the fundamental properties of materials for phase change memory (PCM) application, as the set/reset processes strongly depend upon heat dissipation and transport. The κ of phase change materials in both amorphous and crystalline phases should be quite small, because it determines how energy-efficient the PCM device is during programming. At a high temperature, the electronic thermal conductivity (κe) is always notable for semiconductors, which is still lacking for antimony telluride under doping in the literature as far as we know. In this paper, using density functional theory and Boltzmann transport equations, we report calculations of lattice thermal conductivity κL and electronic thermal conductivity κe of the yttrium doped antimony telluride. We show that the average value of thermal conductivity decreases from ˜2.5 W m-1 K-1 for Sb2Te3 to ˜1.5 W m-1 K-1 for Y0.167Sb1.833Te3. This can be attributed to the reduced κL and κe, especially the κe at high temperature (near melting point). We further point out that the increased effective mass of carriers and the flat valance band edge are responsible for the decrease of κe. The reduced thermal conductivity is highly desirable for the decrease of heat dissipation and transport in PCM operations, which can increase the density of memory and reduce energy consumption.

Four-phonon scattering significantly reduces intrinsic thermal conductivity of solids

Science.gov (United States)

Feng, Tianli; Lindsay, Lucas; Ruan, Xiulin

2017-10-01

For decades, the three-phonon scattering process has been considered to govern thermal transport in solids, while the role of higher-order four-phonon scattering has been persistently unclear and so ignored. However, recent quantitative calculations of three-phonon scattering have often shown a significant overestimation of thermal conductivity as compared to experimental values. In this Rapid Communication we show that four-phonon scattering is generally important in solids and can remedy such discrepancies. For silicon and diamond, the predicted thermal conductivity is reduced by 30% at 1000 K after including four-phonon scattering, bringing predictions in excellent agreement with measurements. For the projected ultrahigh-thermal conductivity material, zinc-blende BAs, a competitor of diamond as a heat sink material, four-phonon scattering is found to be strikingly strong as three-phonon processes have an extremely limited phase space for scattering. The four-phonon scattering reduces the predicted thermal conductivity from 2200 to 1400 W/m K at room temperature. The reduction at 1000 K is 60%. We also find that optical phonon scattering rates are largely affected, being important in applications such as phonon bottlenecks in equilibrating electronic excitations. Recognizing that four-phonon scattering is expensive to calculate, in the end we provide some guidelines on how to quickly assess the significance of four-phonon scattering, based on energy surface anharmonicity and the scattering phase space. Our work clears the decades-long fundamental question of the significance of higher-order scattering, and points out ways to improve thermoelectrics, thermal barrier coatings, nuclear materials, and radiative heat transfer.

The lattice thermal conductivity of pure metals: Aluminium and Indium, ch. 4

International Nuclear Information System (INIS)

Lang, H.N. de

1977-01-01

The lattice conductivity of aluminium and indium has been determined by reducing the electronic thermal conductivity by means of a magnetic field. This was done using the Corbino configuration which prevents the thermal Hall field from forming, hence produces the largest magnetoresistance for a given field strength. In this way for the first time the lattice conductivity of Al and In was measured by the magnetic field method. Apart from a discussion of these results, a comprehensive and critical examination is given of the different methods to determine the lattice conductivity of metals, the phenomenon of the linear magnetoresistance, the quadratic field dependence of the MR and the anomalous lattice conductivity of Potassium as well as the phenomenon of curve crossing

Temperature dependence of the thermal conductivity in chiral carbon nanotubes

Energy Technology Data Exchange (ETDEWEB)

Mensah, N.G. [Department of Mathematics, University of Cape Coast, Cape Coast (Ghana); Abdus Salam International Centre for Theoretical Physics, Trieste (Italy); Nkrumah, G. [Department of Physics, University of Ghana, Legon, Accra (Ghana) and Abdus Salam International Centre for Theoretical Physics, Trieste (Italy)]. E-mail: geon@ug.edu.gh; Mensah, S.Y. [Department of Physics, Laser and Fibre Optics Centre, University of Cape Coast, Cape Coast (Ghana); Allotey, F.K.A. [Institute of Mathematical Sciences, Accra (Ghana)

2004-08-30

The thermal conductivity of a chiral carbon nanotube (CCNT) is calculated using a tractable analytical approach. This is based on solving the Boltzmann kinetic equation with energy dispersion relation obtained in the tight binding approximation. The results obtained are numerically analysed. Unusually high electron thermal conductivity {chi}{sub ez} is observed along the tubular axis. The dependence of {chi}{sub ez} against temperature T was plotted for varying {delta}{sub z} and a given {delta}{sub s} ({delta}{sub z} and {delta}{sub s} are the overlapping integrals (exchange energy) for the jumps along the tubular axis and the base helix, respectively). It is noted that {chi}{sub ez} shows a peaking behaviour before falling off at higher temperature. As {delta}{sub z} varies from 0.010 eV to 0.048 eV for a given {delta}{sub s}=0.0150 eV, the peak values of {chi}{sub ez} shift from 40000 W/m K at 100 K to 55000 W/m K at about 300 K. Interestingly our results at 104 K which is 41000 W/m K and occurred at {delta}{sub z}=0.023 eV compares very well with that reported for a 99.9% isotopically enriched {sup 12}C diamond crystal. Another interesting result obtained is the fact that the circumferential electron thermal conductivity {chi}{sub ec} appears to be very small. The ratio of {chi}{sub ez} to {chi}{sub ec} is of the order of 2.

Thermal conductivity of REIn3 compounds

International Nuclear Information System (INIS)

Mucha, J

2006-01-01

The results of measurements of the thermal conductivity of REIn 3 (RE Pr, Nd, Dy, Ho, Tm) compounds as a function of the temperature in the interval 4-300 K in the absence and in the presence of an external magnetic field of 8 T are presented. Except for PRIn 3 all the compounds are antiferromagnetic. YIn 3 was also measured as a reference compound. The results were analysed in the paramagnetic phase, where an influence of the crystalline electric field on the thermal conductivity was found. Drastic changes in the thermal conductivity were observed and analysed in the vicinity of the Neel temperature and in the antiferromagnetic phases of the compounds. Below the Neel temperature an additional magnon contribution to the thermal conductivity was separated out

Time-resolved probing of electron thermal conduction in femtosecond-laser-pulse-produced plasmas

International Nuclear Information System (INIS)

Vue, B.T.V.

1993-06-01

We present time-resolved measurements of reflectivity, transmissivity and frequency shifts of probe light interacting with the rear of a disk-like plasma produced by irradiation of a transparent solid target with 0.1ps FWHM laser pulses at peak intensity 5 x 10 l4 W/CM 2 . Experimental results show a large increase in reflection, revealing rapid formation of a steep gradient and overdense surface plasma layer during the first picosecond after irradiation. Frequency shifts due to a moving ionization created by thermal conduction into the solid target are recorded. Calculations using a nonlinear thermal heat wave model show good agreement with the measured frequency shifts, further confining the strong thermal transport effect

Power Electronics Thermal Management | Transportation Research | NREL

Science.gov (United States)

Power Electronics Thermal Management Power Electronics Thermal Management A photo of water boiling in liquid cooling lab equipment. Power electronics thermal management research aims to help lower the investigates and develops thermal management strategies for power electronics systems that use wide-bandgap

Strongly anisotropic thermal conductivity and adequate breathability of bilayered films for heat management of on-skin electronics

Science.gov (United States)

Zhou, Tianle; Wei, Hao; Tan, Huaping; Wang, Xin; Zeng, Haibo; Liu, Xiaoheng; Nagao, Shijo; Koga, Hirotaka; Nogi, Masaya; Sugahara, Tohru; Suganuma, Katsuaki

2018-07-01

Thin-film wearable electronics are required to be directly laminated on to human skin for reliable, sensitive bio-sensing but with minimal irritation to the user after long-time use. Excellent heat management films with strongly anisotropic thermal conductivity (K) and adequate breathability are increasingly desirable for shielding the skin from heating while allowing the skin to breathe properly. Here, interfacial self-assembly of a graphene oxide (GO) film covering an ambient-dried bacterial cellulose aerogel (AD-BCA) film followed by laser reduction was proposed to prepare laser-reduced GO (L-rGO)/AD-BCA bilayered films. The AD-BCA substrate provides low cross-plane K (K ⊥  ≈  0.052 W mK‑1), high breathability, and high compressive and tensile resistance by ‘partially’ inheriting the pore structure from bacterial cellulose (BC) gel. The introduction of an upper L-rGO film, which is only 0.31 wt% content, dramatically increases the in-plane K (K // ) from 0.3 W mK‑1 in AD-BCA to 10.72 W mK‑1 owing to the highly in-plane oriented, continuous, uniform assembling geometry of the GO film; while K ⊥ decreases to a lower value of 0.033 W mK‑1, mainly owing to the air pockets between L-rGO multilayers caused by the laser reduction. The bilayered films achieve a K // /K ⊥ of 325, which is substantially larger even than that of graphite and similar polymer composites. They permit high transmission rates for water vapor (416.78 g/m2/day, >204 g/m2/day of normal skin) and O2 (449.35 cm3/m2/day). The combination of strongly anisotropic thermal conductivity and adequate breathability facilitates applications in heat management in on-skin electronics.

Thermal Transport in Diamond Films for Electronics Thermal Management

Science.gov (United States)

2018-03-01

AFRL-RY-WP-TR-2017-0219 THERMAL TRANSPORT IN DIAMOND FILMS FOR ELECTRONICS THERMAL MANAGEMENT Samuel Graham Georgia Institute of Technology MARCH... ELECTRONICS THERMAL MANAGEMENT 5a. CONTRACT NUMBER FA8650-15-C-7517 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 61101E 6. AUTHOR(S) Samuel...seeded sample (NRL 010516, Die A5). The NCD membrane and Al layer thicknesses, tNCD, were measured via transmission electron microscopy (TEM). The

Thermal conductivities of phosphorene allotropes from first-principles calculations: a comparative study

OpenAIRE

Zhang, J.; Liu, H. J.; Cheng, L.; Wei, J.; Liang, J. H.; Fan, D. D.; Jiang, P. H.; Shi, J.

2017-01-01

Phosphorene has attracted tremendous interest recently due to its intriguing electronic properties. However, the thermal transport properties of phosphorene, especially for its allotropes, are still not well-understood. In this work, we calculate the thermal conductivities of five phosphorene allotropes ({\\alpha}-, \\b{eta}-, {\\gamma}-, {\\delta}- and {\\zeta}-phase) by using phonon Boltzmann transport theory combined with first-principles calculations. It is found that the {\\alpha}-phosphorene ...

Gas thermal conductivity (GASCON, GTHCON, GJUMP)

International Nuclear Information System (INIS)

Hagrman, D.L.

1979-10-01

Revised models are presented for the thermal conductivity of initial and fission gases present in LWR fuel rods. The report will become part of an update to the Materials Properties (MATPRO) Handbook used in the fuel rod behavior modeling task performed at the INEL. The revision to the previous MATPRO gas thermal conductivity model replaces correlations based on smoothed values of thermal conductivity published by Gandhi and Saxena with correlations which incorporate new high temperature helium conductivity data. Also, uncertainty estimates have been provided and a consistent treatment of the effects of long mean free paths is employed

High-Thermal-Conductivity Fabrics

Science.gov (United States)

Chibante, L. P. Felipe

2012-01-01

Heat management with common textiles such as nylon and spandex is hindered by the poor thermal conductivity from the skin surface to cooling surfaces. This innovation showed marked improvement in thermal conductivity of the individual fibers and tubing, as well as components assembled from them. The problem is centered on improving the heat removal of the liquid-cooled ventilation garments (LCVGs) used by astronauts. The current design uses an extensive network of water-cooling tubes that introduces bulkiness and discomfort, and increases fatigue. Range of motion and ease of movement are affected as well. The current technology is the same as developed during the Apollo program of the 1960s. Tubing material is hand-threaded through a spandex/nylon mesh layer, in a series of loops throughout the torso and limbs such that there is close, form-fitting contact with the user. Usually, there is a nylon liner layer to improve comfort. Circulating water is chilled by an external heat exchanger (sublimator). The purpose of this innovation is to produce new LCVG components with improved thermal conductivity. This was addressed using nanocomposite engineering incorporating high-thermalconductivity nanoscale fillers in the fabric and tubing components. Specifically, carbon nanotubes were added using normal processing methods such as thermoplastic melt mixing (compounding twin screw extruder) and downstream processing (fiber spinning, tubing extrusion). Fibers were produced as yarns and woven into fabric cloths. The application of isotropic nanofillers can be modeled using a modified Nielsen Model for conductive fillers in a matrix based on Einstein s viscosity model. This is a drop-in technology with no additional equipment needed. The loading is limited by the ability to maintain adequate dispersion. Undispersed materials will plug filtering screens in processing equipment. Generally, the viscosity increases were acceptable, and allowed the filled polymers to still be

Thermal conductivity and heat transfer in superlattices

Energy Technology Data Exchange (ETDEWEB)

Chen, G; Neagu, M; Borca-Tasciuc, T

1997-07-01

Understanding the thermal conductivity and heat transfer processes in superlattice structures is critical for the development of thermoelectric materials and devices based on quantum structures. This work reports progress on the modeling of thermal conductivity of superlattice structures. Results from the models established based on the Boltzmann transport equation could explain existing experimental results on the thermal conductivity of semiconductor superlattices in both in plane and cross-plane directions. These results suggest the possibility of engineering the interfaces to further reduce thermal conductivity of superlattice structures.

Preparation and thermal performance of paraffin/Nano-SiO2 nanocomposite for passive thermal protection of electronic devices

International Nuclear Information System (INIS)

Wang, Yaqin; Gao, Xuenong; Chen, Peng; Huang, Zhaowen; Xu, Tao; Fang, Yutang; Zhang, Zhengguo

2016-01-01

Highlights: • Three types of paraffin/nano-SiO 2 nanocomposites were prepared and characterized. • Thermo-physical properties of these composites were determined and compared. • One composite with lower thermal conductivity showed better thermal insulation properties. • This composite was identified as thermal insulation material for electronic components. - Abstract: In this paper, three grades of nano silicon dioxide (nano-SiO 2 ), NS1, NS2 and NS3, were mixed into paraffin to prepare nanocomposites as novel insulation materials for electronic passive thermal protection applications. The optimal mass percentages of paraffin for the three composites, NS1P, NS2P and NS3P, were determined to be 75%, 70% and 65%, respectively. Investigations by means of scanning electron micrographs (SEM), differential scanning calorimeter (DSC), thermogravimetric analysis (TG), hot disk analyzer and thermal protection performance tests were devoted to the morphology, thermal properties and thermal protection performance analysis of composites. Experimental results showed that paraffin uniformly distributed into the pores and on the surface of nano-SiO 2 . Melting points of composites declined and experimental latent heat became lower than the calculated values with the decrease of nano-SiO 2 pore size. The NS1P composite had larger thermal storage capacity, better reliability and stability compared with NS2P and NS3P. In addition, compared with 90% wt.% paraffin/EG composite, the incorporation of NS1 (25 wt.%) into paraffin caused not only 63.2% reduction in thermal conductivity, but also 21.8% increase in thermal protection time affected by the ambient temperature. Thus those good properties confirmed that NS1P (75 wt.%) composite was a viable candidate for protecting electronic devices under high temperature environment.

Thermal Conductivity of the Multicomponent Neutral Atmosphere

Science.gov (United States)

Pavlov, A. V.

2017-12-01

Approximate expressions for the thermal conductivity coefficient of the multicomponent neutral atmosphere consisting of N2, O2, O, He, and H are analyzed and evaluated for the atmospheric conditions by comparing them with that given by the rigorous hydrodynamic theory. The new approximations of the thermal conductivity coefficients of simple gases N2, O2, O, He, and H are derived and used. It is proved that the modified Mason and Saxena approximation of the atmospheric thermal conductivity coefficient is more accurate in reproducing the atmospheric values of the rigorous hydrodynamic thermal conductivity coefficient in comparison with those that are generally accepted in atmospheric studies. This approximation of the thermal conductivity coefficient is recommended to use in calculations of the neutral temperature of the atmosphere.

Determination of thermal conductivity of magnesium-alloys

Institute of Scientific and Technical Information of China (English)

无

2001-01-01

An indirect method, Angstroms method was adopted and an instrument was designed to determine the thermal conductivity of magnesium metal and alloys. Angstroms method is an axial periodic heat flow technique by which the thermal diffusivity can be measured directly. Then thermal conductivity can be obtained with relation to thermal diffusivity. Compared with the recommended data from the literature the fitted values of the thermal diffiusivity correspond with 3%, and the credible probability of the thermal conductivity in the range of 0-450 ℃ is about 95%. The method is applicable in the given temperature range.

Thermal Conductivity of Foam Glass

DEFF Research Database (Denmark)

Petersen, Rasmus Rosenlund; König, Jakob; Yue, Yuanzheng

Due to the increased focus on energy savings and waste recycling foam glass materials have gained increased attention. The production process of foam glass is a potential low-cost recycle option for challenging waste, e.g. CRT glass and industrial waste (fly ash and slags). Foam glass is used...... as thermal insulating material in building and chemical industry. The large volume of gas (porosity 90 – 95%) is the main reason of the low thermal conductivity of the foam glass. If gases with lower thermal conductivity compared to air are entrapped in the glass melt, the derived foam glass will contain...... only closed pores and its overall thermal conductivity will be much lower than that of the foam glass with open pores. In this work we have prepared foam glass using different types of recycled glasses and different kinds of foaming agents. This enabled the formation of foam glasses having gas cells...

Thermal conductivity and thermal rectification in unzipped carbon nanotubes

International Nuclear Information System (INIS)

Ni Xiaoxi; Li Baowen; Zhang Gang

2011-01-01

We study the thermal transport in completely unzipped carbon nanotubes, which are called graphene nanoribbons, partially unzipped carbon nanotubes, which can be seen as carbon-nanotube-graphene-nanoribbon junctions, and carbon nanotubes by using molecular dynamics simulations. It is found that the thermal conductivity of a graphene nanoribbon is much less than that of its perfect carbon nanotube counterparts because of the localized phonon modes at the boundary. A partially unzipped carbon nanotube has the lowest thermal conductivity due to additional localized modes at the junction region. More strikingly, a significant thermal rectification effect is observed in both partially unzipped armchair and zigzag carbon nanotubes. Our results suggest that carbon-nanotube-graphene-nanoribbon junctions can be used in thermal energy control.

Characterization of dispersed and aggregated Al2O3 morphologies for predicting nanofluid thermal conductivities

International Nuclear Information System (INIS)

Feng Xuemei; Johnson, Drew W.

2013-01-01

Nanofluids are reported to have enhanced thermal conductivities resulting from nanoparticle aggregation. The goal of this study was to explore through experimental measurements, dispersed and aggregated morphology effects on enhanced thermal conductivities for Al 2 O 3 nanoparticles with a primary size of 54.2 ± 2.0 nm. Aggregation effects were investigated by measuring thermal conductivity of different particle morphologies that occurred under different aggregation conditions. Fractal dimensions and aspect ratios were used to quantify the aggregation morphologies. Fractal dimensions were measured using static light scattering and imaging techniques. Aspect ratios were measured using dynamic light scattering, scanning electron microscopy, and atomic force microscopy. Results showed that the enhancements in thermal conductivity can be predicted with effective medium theory when aspect ratio was considered.

Homogenized thermal conduction model for particulate foods

OpenAIRE

Chinesta , Francisco; Torres , Rafael; Ramón , Antonio; Rodrigo , Mari Carmen; Rodrigo , Miguel

2002-01-01

International audience; This paper deals with the definition of an equivalent thermal conductivity for particulate foods. An homogenized thermal model is used to asses the effect of particulate spatial distribution and differences in thermal conductivities. We prove that the spatial average of the conductivity can be used in an homogenized heat transfer model if the conductivity differences among the food components are not very large, usually the highest conductivity ratio between the foods ...

Heat pipes with variable thermal conductance property for space applications

Energy Technology Data Exchange (ETDEWEB)

Kravets, V.; Alekseik, Ye.; Alekseik, O.; Khairnasov, S. [National Technical University of Ukraine, Kyiv (Ukraine); Baturkin, V.; Ho, T. [Explorationssysteme RY-ES, Bremen (Germany); Celotti, L. [Active Space Technologies GmbH, Berlin (Germany)

2017-06-15

The activities presented in this paper demonstrate a new approach to provide passive thermal control using heat pipes, as demonstrated on the electronic unit of DLR’s MASCOT lander, which embarked on the NEA sample return mission Hayabusa 2 (JAXA). The focus is on the development and testing of heat pipes with variable thermal conductance in a predetermined temperature range. These heat pipes act as thermal switches. Unlike standard gasloaded heat pipes and thermal-diode heat pipes construction of presented heat pipes does not include any additional elements. Copper heat pipes with metal fibrous wicks were chosen as baseline design. We obtained positive results by choosing the heat carrier and structural parameters of the wick (i.e., pore diameter, porosity, and permeability). The increase in the thermal conductivity of the heat pipes from 0.04 W/K to 2.1 W/K was observed in the temperature range between −20 °C and +55 °C. Moreover, the heat pipes transferred the predetermined power of not less than 10 W within the same temperature range. The heat pipes have been in flight since December 2014, and the supporting telemetry data were obtained in September 2015. The data showed the nominal operation of the thermal control system.

Thermal conductivity of glass copper-composite

International Nuclear Information System (INIS)

Kinoshita, Makoto; Terai, Ryohei; Haidai, Haruki

1980-01-01

Glass-metal composites are to be one of the answers for promoting thermal conduction in the glassy solids containing high-level radioactive wastes. In order to investigate the effect of metal addition on thermal conductivity of glasses, glass-copper composites were selected, and the conductivities of the composites were measured and discussed in regards to copper content and microstructure. Fully densified composites were successfully prepared by pressure sintering of the powder mixtures of glass and copper at temperatures above the yield points of the constituent glasses if the copper content was not so much. The conductivity was measured by means of a comparative method, in which the thermal gradient of the specimen was compared with that of quartz glass as standard under thermally steady state. Measurements were carried out at around 50 0 C. The thermal conductivity increased with increasing content of copper depending on the kind of copper powder used. The conductivities of the composites of the same copper content differed considerably each another. Fine copper powder was effective on increasing conductivity, and the conductivity became about threefold of that of glass by mixing the fine copper powder about 10 vol%. For the composites containing the fine copper powder less than 5 vol%, the conductivity obeyed so-called logarithmic rule, one of the mixture rules of conductivity, whereas for composites containing more than 5 vol%, the conductivity remarkably increased apart from the rule. This fact suggests that copper becomes continuous in the composite when the copper content increased beyond 5 vol%. For the composites containing coarse copper powder, the conductivity was increased not significantly, and obeyed an equation derived from the model in which conductive material dispersed in less conductive one. (author)

Thermal effects in microfluidics with thermal conductivity spatially modulated

Science.gov (United States)

Vargas Toro, Agustín.

2014-05-01

A heat transfer model on a microfluidic is resolved analytically. The model describes a fluid at rest between two parallel plates where each plate is maintained at a differentially specified temperature and the thermal conductivity of the microfluidic is spatially modulated. The heat transfer model in such micro-hydrostatic configuration is analytically resolved using the technique of the Laplace transform applying the Bromwich Integral and the Residue theorem. The temperature outline in the microfluidic is presented as an infinite series of Bessel functions. It is shown that the result for the thermal conductivity spatially modulated has as a particular case the solution when the thermal conductivity is spatially constant. All computations were performed using the computer algebra software Maple. It is claimed that the analytical obtained results are important for the design of nanoscale devices with applications in biotechnology. Furthermore, it is suggested some future research lines such as the study of the heat transfer model in a microfluidic resting between coaxial cylinders with radially modulated thermal conductivity in order to achieve future developments in this area.

Thermal conductivity of hydrate-bearing sediments

Science.gov (United States)

Cortes, Douglas D.; Martin, Ana I.; Yun, Tae Sup; Francisca, Franco M.; Santamarina, J. Carlos; Ruppel, Carolyn D.

2009-01-01

A thorough understanding of the thermal conductivity of hydrate-bearing sediments is necessary for evaluating phase transformation processes that would accompany energy production from gas hydrate deposits and for estimating regional heat flow based on the observed depth to the base of the gas hydrate stability zone. The coexistence of multiple phases (gas hydrate, liquid and gas pore fill, and solid sediment grains) and their complex spatial arrangement hinder the a priori prediction of the thermal conductivity of hydrate-bearing sediments. Previous studies have been unable to capture the full parameter space covered by variations in grain size, specific surface, degree of saturation, nature of pore filling material, and effective stress for hydrate-bearing samples. Here we report on systematic measurements of the thermal conductivity of air dry, water- and tetrohydrofuran (THF)-saturated, and THF hydrate–saturated sand and clay samples at vertical effective stress of 0.05 to 1 MPa (corresponding to depths as great as 100 m below seafloor). Results reveal that the bulk thermal conductivity of the samples in every case reflects a complex interplay among particle size, effective stress, porosity, and fluid-versus-hydrate filled pore spaces. The thermal conductivity of THF hydrate–bearing soils increases upon hydrate formation although the thermal conductivities of THF solution and THF hydrate are almost the same. Several mechanisms can contribute to this effect including cryogenic suction during hydrate crystal growth and the ensuing porosity reduction in the surrounding sediment, increased mean effective stress due to hydrate formation under zero lateral strain conditions, and decreased interface thermal impedance as grain-liquid interfaces are transformed into grain-hydrate interfaces.

Ultrahigh thermal conductivity of isotopically enriched silicon

Science.gov (United States)

Inyushkin, Alexander V.; Taldenkov, Alexander N.; Ager, Joel W.; Haller, Eugene E.; Riemann, Helge; Abrosimov, Nikolay V.; Pohl, Hans-Joachim; Becker, Peter

2018-03-01

Most of the stable elements have two and more stable isotopes. The physical properties of materials composed of such elements depend on the isotopic abundance to some extent. A remarkably strong isotope effect is observed in the phonon thermal conductivity, the principal mechanism of heat conduction in nonmetallic crystals. An isotopic disorder due to random distribution of the isotopes in the crystal lattice sites results in a rather strong phonon scattering and, consequently, in a reduction of thermal conductivity. In this paper, we present new results of accurate and precise measurements of thermal conductivity κ(T) for silicon single crystals having three different isotopic compositions at temperatures T from 2.4 to 420 K. The highly enriched crystal containing 99.995% of 28Si, which is one of the most perfect crystals ever synthesized, demonstrates a thermal conductivity of about 450 ± 10 W cm-1 K-1 at 24 K, the highest measured value among bulk dielectrics, which is ten times greater than the one for its counterpart natSi with the natural isotopic constitution. For highly enriched crystal 28Si and crystal natSi, the measurements were performed for two orientations [001] and [011], a magnitude of the phonon focusing effect on thermal conductivity was determined accurately at low temperatures. The anisotropy of thermal conductivity disappears above 31 K. The influence of the boundary scattering on thermal conductivity persists sizable up to much higher temperatures (˜80 K). The κ(T) measured in this work gives the most accurate approximation of the intrinsic thermal conductivity of single crystal silicon which is determined solely by the anharmonic phonon processes and diffusive boundary scattering over a wide temperature range.

Thermal conductivity of granular materials

Energy Technology Data Exchange (ETDEWEB)

Buyevich, Yu A

1974-01-01

Stationary heat transfer in a granular material consisting of a continuous medium containing spherical granules of other substances is considered under the assumption that the spatial distribution of granules is random. The effective thermal conductivity characterizing macroscopic heat transfer in such a material is expressed as a certain function of the conductivities and volume fractions of the medium and dispersed substances. For reasons of mathematical analogy, all the results obtained for the thermal conductivity are valid while computing the effective diffusivity of some admixture in granular materials as well as for evaluation of the effective electric conductivity or the mean dielectric and magnetic permeabilities of granular conductors and dielectrics. (23 refs.)

Review on mathematical basis for thermal conduction equation

Energy Technology Data Exchange (ETDEWEB)

Park, D. G.; Kim, H. M

2007-10-15

In the view point of thermal conductivity measurement technology, It is very useful to understand mathematical theory of thermal conduction equation in order to evaluation of measurement data and to solve diverse technical problem in measurement. To approach this mathematical theory, thermal conduction equation is derived by Fourier thermal conduction law. Since thermal conduction equation depends on the Lapacian operator basically, mathematical meaning of Lapalacian and various diffusion equation including Laplacian have been studied. Stum-Liouville problem and Bessel function were studied in this report to understand analytical solution of various diffusion equation.

Review on mathematical basis for thermal conduction equation

International Nuclear Information System (INIS)

Park, D. G.; Kim, H. M.

2007-10-01

In the view point of thermal conductivity measurement technology, It is very useful to understand mathematical theory of thermal conduction equation in order to evaluation of measurement data and to solve diverse technical problem in measurement. To approach this mathematical theory, thermal conduction equation is derived by Fourier thermal conduction law. Since thermal conduction equation depends on the Lapacian operator basically, mathematical meaning of Lapalacian and various diffusion equation including Laplacian have been studied. Stum-Liouville problem and Bessel function were studied in this report to understand analytical solution of various diffusion equation

Development of irradiated UO2 thermal conductivity model

International Nuclear Information System (INIS)

Lee, Chan Bock; Bang Je-Geon; Kim Dae Ho; Jung Youn Ho

2001-01-01

Thermal conductivity model of the irradiated UO 2 pellet was developed, based upon the thermal diffusivity data of the irradiated UO 2 pellet measured during thermal cycling. The model predicts the thermal conductivity by multiplying such separate correction factors as solid fission products, gaseous fission products, radiation damage and porosity. The developed model was validated by comparison with the variation of the measured thermal diffusivity data during thermal cycling and prediction of other UO 2 thermal conductivity models. Since the developed model considers the effect of gaseous fission products as a separate factor, it can predict variation of thermal conductivity in the rim region of high burnup UO 2 pellet where the fission gases in the matrix are precipitated into bubbles, indicating that decrease of thermal conductivity by bubble precipitation in rim region would be significantly compensated by the enhancing effect of fission gas depletion in the UO 2 matrix. (author)

Thermal conductivity and electrical resistivity of cadmium arsenide (Cd3As2) in the temperature range 4.2-40K1

International Nuclear Information System (INIS)

Bartkowski, K.; Ratalowicz, J.; Zdanowicz, W.

1986-01-01

Results on electrical resistivity and thermal conductivity measured in the temperature range 4.2-40 K are presented for single-crystal and polycrystalline samples of Cd 3 As 2 . Hall effect has been studied at temperatures of 4.2, 77, and 300K. The calculated value of the conduction electron concentration was in the range 1.87-1.95 10 24 m -3 . Electrical resistivity of all investigated samples was independent of temperature up to about 10K and increased slowsly at higher temperatures. The thermal conductivity shows a maximum in the region in which the lattice component of thermal conductivity dominates. The strong anistropy of the lattice component determines the anisotropy of the total thermal conductivity. The electronic component of thermal conductivity does not exhibit any anisotropy and shows a maximum at a temperature of about 300 K

THERMAL CONDUCTIVITY OF NON-REPOSITORY LITHOSTRATIGRAPHIC LAYERS

International Nuclear Information System (INIS)

R. JONES

2004-01-01

This model report addresses activities described in ''Technical Work Plan for: Near-Field Environment and Transport Thermal Properties and Analysis Reports Integration'' (BSC 2004 [DIRS 171708]). The model develops values for thermal conductivity, and its uncertainty, for the nonrepository layers of Yucca Mountain; in addition, the model provides estimates for matrix porosity and dry bulk density for the nonrepository layers. The studied lithostratigraphic units, as identified in the ''Geologic Framework Model'' (GFM 2000) (BSC 2004 [DIRS 170029]), are the Timber Mountain Group, the Tiva Canyon Tuff, the Yucca Mountain Tuff, the Pah Canyon Tuff, the Topopah Spring Tuff (excluding the repository layers), the Calico Hills Formation, the Prow Pass Tuff, the Bullfrog Tuff, and the Tram Tuff. The deepest model units of the GFM (Tund and Paleozoic) are excluded from this study because no data suitable for model input are available. The parameter estimates developed in this report are used as input to various models and calculations that simulate heat transport through the rock mass. Specifically, analysis model reports that use product output from this report are: (1) Drift-scale coupled processes (DST and TH seepage) models; (2) Drift degradation analysis; (3) Multiscale thermohydrologic model; and (4) Ventilation model and analysis report. In keeping with the methodology of the thermal conductivity model for the repository layers in ''Thermal Conductivity of the Potential Repository Horizon'' (BSC 2004 [DIRS 169854]), the Hsu and others (1995 [DIRS 158073]) three-dimensional (3-D) cubic model (referred to herein as ''the Hsu model'') was used to represent the matrix thermal conductivity as a function of the four parameters (matrix porosity, thermal conductivity of the saturating fluid, thermal conductivity of the solid, and geometric connectivity of the solid). The Hsu model requires input data from each test specimen to meet three specific conditions: (1) Known value

Reduced thermal conductivity due to scattering centers in p-type SiGe alloys

International Nuclear Information System (INIS)

Beaty, J.S.; Rolfe, J.L.; Vandersande, J.; Fleurial. J.P.

1992-01-01

This paper reports that a theoretical model has been developed that predicts that the addition of ultra-fine, inert, phonon-scattering centers to SiGe thermoelectric material will reduce its thermal conductivity and improve its figure-of-merit. To investigate this prediction, ultra-fine particulates (20 Angstrom to 200 Angstrom) of boron nitride have been added to boron doped, p-type, 80/20 SiGe. All previous SiGe samples produced from ultra-fine SiGe powder without additions had lower thermal conductivities than standard SiGe, but high temperature (1525 K) heat treatment increased their thermal conductivity back to the value for standard SiGe. Transmission Electron Microscopy has been used to confirm the presence of occluded particulates and X-ray diffraction has been used to determine the composition to be BN

Electron thermal confinement in a partially stochastic magnetic structure

Science.gov (United States)

Morton, L. A.; Young, W. C.; Hegna, C. C.; Parke, E.; Reusch, J. A.; Den Hartog, D. J.

2018-04-01

Using a high-repetition-rate Thomson scattering diagnostic, we observe a peak in electron temperature Te coinciding with the location of a large magnetic island in the Madison Symmetric Torus. Magnetohydrodynamic modeling of this quasi-single helicity plasma indicates that smaller adjacent islands overlap with and destroy the large island flux surfaces. The estimated stochastic electron thermal conductivity ( ≈30 m 2/s ) is consistent with the conductivity inferred from the observed Te gradient and ohmic heating power. Island-shaped Te peaks can result from partially stochastic magnetic islands.

Estimating thermal diffusivity and specific heat from needle probe thermal conductivity data

Science.gov (United States)

Waite, W.F.; Gilbert, L.Y.; Winters, W.J.; Mason, D.H.

2006-01-01

Thermal diffusivity and specific heat can be estimated from thermal conductivity measurements made using a standard needle probe and a suitably high data acquisition rate. Thermal properties are calculated from the measured temperature change in a sample subjected to heating by a needle probe. Accurate thermal conductivity measurements are obtained from a linear fit to many tens or hundreds of temperature change data points. In contrast, thermal diffusivity calculations require a nonlinear fit to the measured temperature change occurring in the first few tenths of a second of the measurement, resulting in a lower accuracy than that obtained for thermal conductivity. Specific heat is calculated from the ratio of thermal conductivity to diffusivity, and thus can have an uncertainty no better than that of the diffusivity estimate. Our thermal conductivity measurements of ice Ih and of tetrahydrofuran (THF) hydrate, made using a 1.6 mm outer diameter needle probe and a data acquisition rate of 18.2 pointss, agree with published results. Our thermal diffusivity and specific heat results reproduce published results within 25% for ice Ih and 3% for THF hydrate. ?? 2006 American Institute of Physics.

Conductivity study of thermally stabilized RuO2/polythiophene nanocomposites

Science.gov (United States)

Hebbar, Vidyashree; Bhajantri, R. F.

2018-04-01

The polymer nanocomposites of Ruthenium oxide (RuO2) filled polythiophene (PT) were synthesized by polymerization using chemical method. The purity of the synthesized polymer composite is verified using X-Ray diffraction (XRD). The structural discrepancies of the RuO2 filled PT composites are studied by Fourier transform infrared (FT-IR) spectroscopy. The phase transition and thermal stability of the prepared composite is revised by thermal characterization such as differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The DC conductivity of RuO2 filled PT composite in the form of pellets is calculated using current-voltage (I-V) characterization by two-probe method. The enhancement in conductivity with increased RuO2 content in PT matrix is examined, which is the required property for electrical and electronic applications in supercapacitors.

Increased thermal conductivity monolithic zeolite structures

Science.gov (United States)

Klett, James; Klett, Lynn; Kaufman, Jonathan

2008-11-25

A monolith comprises a zeolite, a thermally conductive carbon, and a binder. The zeolite is included in the form of beads, pellets, powders and mixtures thereof. The thermally conductive carbon can be carbon nano-fibers, diamond or graphite which provide thermal conductivities in excess of about 100 W/mK to more than 1,000 W/mK. A method of preparing a zeolite monolith includes the steps of mixing a zeolite dispersion in an aqueous colloidal silica binder with a dispersion of carbon nano-fibers in water followed by dehydration and curing of the binder is given.

An Innovative High Thermal Conductivity Fuel Design

Energy Technology Data Exchange (ETDEWEB)

Jamil A. Khan

2009-11-21

Thermal conductivity of the fuel in today's Light Water Reactors, Uranium dioxide, can be improved by incorporating a uniformly distributed heat conducting network of a higher conductivity material, Silicon Carbide. The higher thermal conductivity of SiC along with its other prominent reactor-grade properties makes it a potential material to address some of the related issues when used in UO2 [97% TD]. This ongoing research, in collaboration with the University of Florida, aims to investigate the feasibility and develop a formal methodology of producing the resultant composite oxide fuel. Calculations of effective thermal conductivity of the new fuel as a function of %SiC for certain percentages and as a function of temperature are presented as a preliminary approach. The effective thermal conductivities are obtained at different temperatures from 600K to 1600K. The corresponding polynomial equations for the temperature-dependent thermal conductivities are given based on the simulation results. Heat transfer mechanism in this fuel is explained using a finite volume approach and validated against existing empirical models. FLUENT 6.1.22 was used for thermal conductivity calculations and to estimate reduction in centerline temperatures achievable within such a fuel rod. Later, computer codes COMBINE-PC and VENTURE-PC were deployed to estimate the fuel enrichment required, to maintain the same burnup levels, corresponding to a volume percent addition of SiC.

An Innovative High Thermal Conductivity Fuel Design

International Nuclear Information System (INIS)

Khan, Jamil A.

2009-01-01

Thermal conductivity of the fuel in today's Light Water Reactors, Uranium dioxide, can be improved by incorporating a uniformly distributed heat conducting network of a higher conductivity material, Silicon Carbide. The higher thermal conductivity of SiC along with its other prominent reactor-grade properties makes it a potential material to address some of the related issues when used in UO2 (97% TD). This ongoing research, in collaboration with the University of Florida, aims to investigate the feasibility and develop a formal methodology of producing the resultant composite oxide fuel. Calculations of effective thermal conductivity of the new fuel as a function of %SiC for certain percentages and as a function of temperature are presented as a preliminary approach. The effective thermal conductivities are obtained at different temperatures from 600K to 1600K. The corresponding polynomial equations for the temperature-dependent thermal conductivities are given based on the simulation results. Heat transfer mechanism in this fuel is explained using a finite volume approach and validated against existing empirical models. FLUENT 6.1.22 was used for thermal conductivity calculations and to estimate reduction in centerline temperatures achievable within such a fuel rod. Later, computer codes COMBINE-PC and VENTURE-PC were deployed to estimate the fuel enrichment required, to maintain the same burnup levels, corresponding to a volume percent addition of SiC.

Experimental determination of thermal conductivity and gap conductance of fuel rod for HTGR

International Nuclear Information System (INIS)

Kikuchi, Teruo; Iwamoto, Kazumi; Ikawa, Katsuichi; Ishimoto, Kiyoshi

1985-01-01

The thermal conductivity of fuel compacts and the gap conductance between the fuel compact and the graphite sleeve in fuel rods for a high-temperature gas-cooled reactor (HTGR) were measured by the center heating method. These measurements were made as functions of volume percent particle loading and temperature for thermal conductivity and as functions of gap distance and gas composition for gap conductance. The thermal conductivity of fuel compacts decreases with increasing temperature and with increasing particle loading. The gap conductance increases with increasing temperature and decrease with increasing gap distance. A good gap conductance was observed with helium fill gas. It was seen that the gap conductance was dependent on the thermal conductivity of fill gas and conductance by radiation and could be neglected the conductance through solid-solid contact points of fuel compact and graphite sleeve. (author)

Learning from Natural Nacre: Constructing Layered Polymer Composites with High Thermal Conductivity.

Science.gov (United States)

Pan, Guiran; Yao, Yimin; Zeng, Xiaoliang; Sun, Jiajia; Hu, Jiantao; Sun, Rong; Xu, Jian-Bin; Wong, Ching-Ping

2017-09-27

Inspired by the microstructures of naturally layered and highly oriented materials, such as natural nacre, we report a thermally conductive polymer composite that consists of epoxy resin and Al 2 O 3 platelets deposited with silver nanoparticles (AgNPs). Owing to their unique two-dimensional structure, Al 2 O 3 platelets are stacked together via a hot-pressing technique, resulting in a brick-and-mortar structure, which is similar to the one of natural nacre. Moreover, the AgNPs deposited on the surfaces of the Al 2 O 3 platelets act as bridges that link the adjacent Al 2 O 3 platelets due to the reduced melting point of the AgNPs. As a result, the polymer composite with 50 wt % filler achieves a maximum thermal conductivity of 6.71 W m -1 K -1 . In addition, the small addition of AgNPs (0.6 wt %) minimally affects the electrical insulation of the composites. Our bioinspired approach will find uses in the design and fabrication of thermally conductive materials for thermal management in modern electronics.

Thermal and electrical conductivities of Cd-Zn alloys

International Nuclear Information System (INIS)

Saatci, B; Ari, M; Guenduez, M; Meydaneri, F; Bozoklu, M; Durmus, S

2006-01-01

The composition and temperature dependences of the thermal and electrical conductivities of three different Cd-Zn alloys have been investigated in the temperature range of 300-650 K. Thermal conductivities of the Cd-Zn alloys have been determined by using the radial heat flow method. It has been found that the thermal conductivity decreases slightly with increasing temperature and the data of thermal conductivity are shifting together to the higher values with increasing Cd composition. In addition, the electrical measurements were determined by using a standard DC four-point probe technique. The resistivity increases linearly and the electrical conductivity decreases exponentially with increasing temperature. The resistivity and electrical conductivity are independent of composition of Cd and Zn. Also, the temperature coefficient of Cd-Zn alloys has been determined, which is independent of composition of Cd and Zn. Finally, Lorenz number has been calculated using the thermal and electrical conductivity values at 373 and 533 K. The results satisfy the Wiedemann-Franz (WF) relation at T 373 K), the WF relation could not hold and the phonon component contribution of thermal conductivity dominates the thermal conduction

Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity.

Science.gov (United States)

Yao, Yimin; Sun, Jiajia; Zeng, Xiaoliang; Sun, Rong; Xu, Jian-Bin; Wong, Ching-Ping

2018-03-01

Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through-plane thermal conductivity of these polymer composites usually yields an undesired value (below 3.0 Wm -1 K -1 ). Here, construction of a 3D phonon skeleton is reported composed of stacked boron nitride (BN) platelets reinforced with reduced graphene oxide (rGO) for epoxy composites by the combination of ice-templated and infiltrating methods. At a low filler loading of 13.16 vol%, the resulting 3D BN-rGO/epoxy composites exhibit an ultrahigh through-plane thermal conductivity of 5.05 Wm -1 K -1 as the best thermal-conduction performance reported so far for BN sheet-based composites. Theoretical models qualitatively demonstrate that this enhancement results from the formation of phonon-matching 3D BN-rGO networks, leading to high rates of phonon transport. The strong potential application for thermal management has been demonstrated by the surface temperature variations of the composites with time during heating and cooling. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Thermal conductivity of carbon nanotube cross-bar structures

International Nuclear Information System (INIS)

Evans, William J; Keblinski, Pawel

2010-01-01

We use non-equilibrium molecular dynamics (NEMD) to compute the thermal conductivity (κ) of orthogonally ordered cross-bar structures of single-walled carbon nanotubes. Such structures exhibit extremely low thermal conductivity in the range of 0.02-0.07 W m -1 K -1 . These values are five orders of magnitude smaller than the axial thermal conductivity of individual carbon nanotubes, and are comparable to the thermal conductivity of still air.

Robust design and thermal fatigue life prediction of anisotropic conductive film flip chip package

International Nuclear Information System (INIS)

Nam, Hyun Wook

2004-01-01

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF(Anisotropic Conductive Film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design Of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2 nd DOE was conducted to obtain RSM equation for the choose 3 design parameter. The coefficient of determination (R 2 ) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for Feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430μm, and 78μm, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter

Thermal conductivity of vertically aligned carbon nanotube arrays: Growth conditions and tube inhomogeneity

Energy Technology Data Exchange (ETDEWEB)

Bauer, Matthew L.; Pham, Quang N.; Saltonstall, Christopher B.; Norris, Pamela M. [Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904-4746 (United States)

2014-10-13

The thermal conductivity of vertically aligned carbon nanotube arrays (VACNTAs) grown on silicon dioxide substrates via chemical vapor deposition is measured using a 3ω technique. For each sample, the VACNTA layer and substrate are pressed to a heating line at varying pressures to extract the sample's thermophysical properties. The nanotubes' structure is observed via transmission electron microscopy and Raman spectroscopy. The presence of hydrogen and water vapor in the fabrication process is tuned to observe the effect on measured thermal properties. The presence of iron catalyst particles within the individual nanotubes prevents the array from achieving the overall thermal conductivity anticipated based on reported measurements of individual nanotubes and the packing density.

Thermal conductivity of bulk GaN—Effects of oxygen, magnesium doping, and strain field compensation

International Nuclear Information System (INIS)

Simon, Roland B.; Anaya, Julian; Kuball, Martin

2014-01-01

The effect of oxygen doping (n-type) and oxygen (O)-magnesium (Mg) co-doping (semi-insulating) on the thermal conductivity of ammonothermal bulk GaN was studied via 3-omega measurements and a modified Callaway model. Oxygen doping was shown to significantly reduce thermal conductivity, whereas O-Mg co-doped GaN exhibited a thermal conductivity close to that of undoped GaN. The latter was attributed to a decreased phonon scattering rate due the compensation of impurity-generated strain fields as a result of dopant-complex formation. The results have great implications for GaN electronic and optoelectronic device applications on bulk GaN substrates

The spiral field inhibition of thermal conduction in two-fluid solar wind models

Science.gov (United States)

Nerney, S.; Barnes, A.

1978-01-01

The paper reports on two-field models which include the inhibition of thermal conduction by the spiraling interplanetary field to determine whether any of the major conclusions obtained by Nerney and Barnes (1977) needs to be modified. Comparisons with straight field line models reveal that for most base conditions, the primary effect of the inhibition of thermal conduction is the bottling-up of heat in the electrons as well as the quite different temperature profiles at a large heliocentric radius. The spiral field solutions show that coronal hole boundary conditions do not correspond to states of high-speed streams as observed at 1 AU. The two-fluid models suggest that the spiral field inhibition of thermal conduction in the equatorial plane will generate higher gas pressures in comparison with flows along the solar rotation axis (between 1 and 10 AU). In particular, massive outflows of stellar winds, such as outflow from T Tauri stars, cannot be driven by thermal conduction. The conclusions of Nerney and Barnes remain essentially unchanged.

Size dictated thermal conductivity of GaN

Science.gov (United States)

Beechem, Thomas E.; McDonald, Anthony E.; Fuller, Elliot J.; Talin, A. Alec; Rost, Christina M.; Maria, Jon-Paul; Gaskins, John T.; Hopkins, Patrick E.; Allerman, Andrew A.

2016-09-01

The thermal conductivity of n- and p-type doped gallium nitride (GaN) epilayers having thicknesses of 3-4 μm was investigated using time domain thermoreflectance. Despite possessing carrier concentrations ranging across 3 decades (1015-1018 cm-3), n-type layers exhibit a nearly constant thermal conductivity of 180 W/mK. The thermal conductivity of p-type epilayers, in contrast, reduces from 160 to 110 W/mK with increased doping. These trends—and their overall reduction relative to bulk—are explained leveraging established scattering models where it is shown that, while the decrease in p-type layers is partly due to the increased impurity levels evolving from its doping, size effects play a primary role in limiting the thermal conductivity of GaN layers tens of microns thick. Device layers, even of pristine quality, will therefore exhibit thermal conductivities less than the bulk value of 240 W/mK owing to their finite thickness.

The contribution of thermal radiation to the thermal conductivity of porous UO2

International Nuclear Information System (INIS)

Bakker, K.; Kwast, H.; Cordfunke, E.H.P.

1994-09-01

The influence of cylindrical, spherical and ellipsoidal inclusions on the overall thermal conductivity was computed with the finite element technique. The results of these calculations were compared with equations that describe the effect of inclusions on the overall thermal conductivity. The analytical equation of Schulz that describes the effect of inclusions on the overall thermal conductivity is in good agreement with the results of the finite element computations. This good agreement shows that among a variety of porosity correction formulas, the equation of Schulz gives the best description of the effect of inclusions on the overall thermal conductivity. This equation and the results of finite element calculations allow us to compute the contribution of radiation to the overall thermal conductivity of UO 2 with oblate ellipsoidal porosity. The present radiation calculations show that Hayes and Peddicord overestimated the contribution of thermal radiation to the thermal conductivity. (orig.)

Effect of cobalt doping on thermal conductivity of YBa2Cu3O7-δ superconductor

International Nuclear Information System (INIS)

Suleiman, B.M.; Boerjesson, L.; Berastegui, P.

1996-01-01

The thermal conductivity of YBa 2 Cu 3 O 7-δ and YBa 2 Cu 3-x Co x O 7-δ (x=0.1) sintered compounds has been measured to investigate the effect of Co doping on the thermal conduction processes. The measurements were performed using the transient-plane-source technique. The thermal conductivity of the doped sample qualitatively resembles that of the corresponding undoped sample, but with values a factor of 2 lower. This decrease in thermal conductivity is attributed to scattering mechanisms due to enhancement of the microstructural imperfections and the decoupling between the conducting Cu-O planes as a result of Co-doping in the chain sites. An attempt was made to interpret the peak of the thermal conductivity below T c in terms of a theoretical model based on weakly damped collective electron excitations of the Bose type, with an acoustic dispersion relation (acoustic plasmons), inside the superconducting gap 2Δ(T). copyright 1996 The American Physical Society

Anisotropic in-plane thermal conductivity observed in few-layer black phosphorus

Science.gov (United States)

Luo, Zhe; Maassen, Jesse; Deng, Yexin; Du, Yuchen; Garrelts, Richard P.; Lundstrom, Mark S; Ye, Peide D.; Xu, Xianfan

2015-01-01

Black phosphorus has been revisited recently as a new two-dimensional material showing potential applications in electronics and optoelectronics. Here we report the anisotropic in-plane thermal conductivity of suspended few-layer black phosphorus measured by micro-Raman spectroscopy. The armchair and zigzag thermal conductivities are ∼20 and ∼40 W m−1 K−1 for black phosphorus films thicker than 15 nm, respectively, and decrease to ∼10 and ∼20 W m−1 K−1 as the film thickness is reduced, exhibiting significant anisotropy. The thermal conductivity anisotropic ratio is found to be ∼2 for thick black phosphorus films and drops to ∼1.5 for the thinnest 9.5-nm-thick film. Theoretical modelling reveals that the observed anisotropy is primarily related to the anisotropic phonon dispersion, whereas the intrinsic phonon scattering rates are found to be similar along the armchair and zigzag directions. Surface scattering in the black phosphorus films is shown to strongly suppress the contribution of long mean-free-path acoustic phonons. PMID:26472191

Thermal diffusivity and thermal conductivity of (Th,U)O2 fuels

International Nuclear Information System (INIS)

Sengupta, A.K.; Jarvis, T.; Nair, M.R.; Ramachandran, R.; Mujumdar, S.; Purushotham, D.S.C.

2000-05-01

India has vast reserves of thorium (> 460,000 tons) and sustained work on all aspects of thorium utilization has been initiated. In this context work on fabrication of sintered thoria and mixed (Th,U)O 2 pellets and evaluation of their thermophysical properties have been taken up in Radiometallurgy Division. Thermal conductivity, being the most important thermal properties, has been calculated using the experimentally measured thermal diffusivity, density and literature values of specific heats for ThO 2 and thoria containing 2,4,6,10 and 20% UO 2 . Thermal diffusivity was measured experimentally by the laser flash method from 600 to 1600 deg C in vacuum. It was observed that thermal conductivity of ThO 2 and mixed (Th,U)O 2 decrease with increase in temperature. It was also observed that the conductivity decreases with increase in UO 2 content, the decrease being more at lower temperature than that at higher temperatures. Empirical relations correlating thermal conductivity to temperatures have been generated by the least square fit method and reported. (author)

Invert Effective Thermal Conductivity Calculation

International Nuclear Information System (INIS)

M.J. Anderson; H.M. Wade; T.L. Mitchell

2000-01-01

The objective of this calculation is to evaluate the temperature-dependent effective thermal conductivities of a repository-emplaced invert steel set and surrounding ballast material. The scope of this calculation analyzes a ballast-material thermal conductivity range of 0.10 to 0.70 W/m · K, a transverse beam spacing range of 0.75 to 1.50 meters, and beam compositions of A 516 carbon steel and plain carbon steel. Results from this calculation are intended to support calculations that identify waste package and repository thermal characteristics for Site Recommendation (SR). This calculation was developed by Waste Package Department (WPD) under Office of Civilian Radioactive Waste Management (OCRWM) procedure AP-3.12Q, Revision 1, ICN 0, Calculations

Tailoring thermal conductivity via three-dimensional porous alumina.

Science.gov (United States)

Abad, Begoña; Maiz, Jon; Ruiz-Clavijo, Alejandra; Caballero-Calero, Olga; Martin-Gonzalez, Marisol

2016-12-09

Three-dimensional anodic alumina templates (3D-AAO) are an astonishing framework with open highly ordered three-dimensional skeleton structures. Since these templates are architecturally different from conventional solids or porous templates, they teem with opportunities for engineering thermal properties. By establishing the mechanisms of heat transfer in these frameworks, we aim to create materials with tailored thermal properties. The effective thermal conductivity of an empty 3D-AAO membrane was measured. As the effective medium theory was not valid to extract the skeletal thermal conductivity of 3D-AAO, a simple 3D thermal conduction model was developed, based on a mixed series and parallel thermal resistor circuit, giving a skeletal thermal conductivity value of approximately 1.25 W·m -1 ·K -1 , which matches the value of the ordinary AAO membranes prepared from the same acid solution. The effect of different filler materials as well as the variation of the number of transversal nanochannels and the length of the 3D-AAO membrane in the effective thermal conductivity of the composite was studied. Finally, the thermal conductivity of two 3D-AAO membranes filled with cobalt and bismuth telluride was also measured, which was in good agreement with the thermal model predictions. Therefore, this work proved this structure as a powerful approach to tailor thermal properties.

Tailoring thermal conductivity via three-dimensional porous alumina

Science.gov (United States)

Abad, Begoña; Maiz, Jon; Ruiz-Clavijo, Alejandra; Caballero-Calero, Olga; Martin-Gonzalez, Marisol

2016-01-01

Three-dimensional anodic alumina templates (3D-AAO) are an astonishing framework with open highly ordered three-dimensional skeleton structures. Since these templates are architecturally different from conventional solids or porous templates, they teem with opportunities for engineering thermal properties. By establishing the mechanisms of heat transfer in these frameworks, we aim to create materials with tailored thermal properties. The effective thermal conductivity of an empty 3D-AAO membrane was measured. As the effective medium theory was not valid to extract the skeletal thermal conductivity of 3D-AAO, a simple 3D thermal conduction model was developed, based on a mixed series and parallel thermal resistor circuit, giving a skeletal thermal conductivity value of approximately 1.25 W·m−1·K−1, which matches the value of the ordinary AAO membranes prepared from the same acid solution. The effect of different filler materials as well as the variation of the number of transversal nanochannels and the length of the 3D-AAO membrane in the effective thermal conductivity of the composite was studied. Finally, the thermal conductivity of two 3D-AAO membranes filled with cobalt and bismuth telluride was also measured, which was in good agreement with the thermal model predictions. Therefore, this work proved this structure as a powerful approach to tailor thermal properties. PMID:27934930

THERMAL CONDUCTIVITY OF NON-REPOSITORY LITHOSTRATIGRAPHIC LAYERS

Energy Technology Data Exchange (ETDEWEB)

R. JONES

2004-10-22

This model report addresses activities described in ''Technical Work Plan for: Near-Field Environment and Transport Thermal Properties and Analysis Reports Integration'' (BSC 2004 [DIRS 171708]). The model develops values for thermal conductivity, and its uncertainty, for the nonrepository layers of Yucca Mountain; in addition, the model provides estimates for matrix porosity and dry bulk density for the nonrepository layers. The studied lithostratigraphic units, as identified in the ''Geologic Framework Model'' (GFM 2000) (BSC 2004 [DIRS 170029]), are the Timber Mountain Group, the Tiva Canyon Tuff, the Yucca Mountain Tuff, the Pah Canyon Tuff, the Topopah Spring Tuff (excluding the repository layers), the Calico Hills Formation, the Prow Pass Tuff, the Bullfrog Tuff, and the Tram Tuff. The deepest model units of the GFM (Tund and Paleozoic) are excluded from this study because no data suitable for model input are available. The parameter estimates developed in this report are used as input to various models and calculations that simulate heat transport through the rock mass. Specifically, analysis model reports that use product output from this report are: (1) Drift-scale coupled processes (DST and TH seepage) models; (2) Drift degradation analysis; (3) Multiscale thermohydrologic model; and (4) Ventilation model and analysis report. In keeping with the methodology of the thermal conductivity model for the repository layers in ''Thermal Conductivity of the Potential Repository Horizon'' (BSC 2004 [DIRS 169854]), the Hsu et al. (1995 [DIRS 158073]) three-dimensional (3-D) cubic model (referred to herein as ''the Hsu model'') was used to represent the matrix thermal conductivity as a function of the four parameters (matrix porosity, thermal conductivity of the saturating fluid, thermal conductivity of the solid, and geometric connectivity of the solid). The Hsu model requires input data

Alignment of Boron Nitride Nanofibers in Epoxy Composite Films for Thermal Conductivity and Dielectric Breakdown Strength Improvement.

Science.gov (United States)

Wang, Zhengdong; Liu, Jingya; Cheng, Yonghong; Chen, Siyu; Yang, Mengmeng; Huang, Jialiang; Wang, Hongkang; Wu, Guanglei; Wu, Hongjing

2018-04-15

Development of polymer-based composites with simultaneously high thermal conductivity and breakdown strength has attracted considerable attention owing to their important applications in both electronic and electric industries. In this work, boron nitride (BN) nanofibers (BNNF) are successfully prepared as fillers, which are used for epoxy composites. In addition, the BNNF in epoxy composites are aligned by using a film casting method. The composites show enhanced thermal conductivity and dielectric breakdown strength. For instance, after doping with BNNF of 2 wt%, the thermal conductivity of composites increased by 36.4% in comparison with that of the epoxy matrix. Meanwhile, the breakdown strength of the composite with 1 wt% BNNF is 122.9 kV/mm, which increased by 6.8% more than that of neat epoxy (115.1 kV/mm). Moreover, the composites have maintained a low dielectric constant and alternating current conductivity among the range of full frequency, and show a higher thermal decomposition temperature and glass-transition temperature. The composites with aligning BNNF have wide application prospects in electronic packaging material and printed circuit boards.

The contribution of thermal radiation to the thermal conductivity of porous UO2

International Nuclear Information System (INIS)

Bakker, K.; Kwast, H.; Cordfunke, E.H.P.

1995-01-01

The influence of cylindrical, spherical and ellipsoidal inclusions on the overall thermal conductivity was computed with the finite element technique. The results of these calculations were compared with equations that describe the effect of inclusions on the overall thermal conductivity. The analytical equation of Schulz [B. Schulz, KfK-1988 (1974)] that describes the effect of inclusions on the overall thermal conductivity is in good agreement with the results of the finite element computations. This good agreement shows that among a variety of porosity correction formulas, the equation of Schulz gives the best description of the effect of inclusions on the overall thermal conductivity. This equation and the results of finite element calculations allow us to compute the contribution of radiation to the overall thermal conductivity of UO 2 with oblate ellipsoidal porosity. The present radiation calculations show that Hayes and Peddicord [S.L. Hayes and K.L. Peddicord, J. Nucl. Mater. 202 (1993) 87] overestimated the contribution of thermal radiation to the thermal conductivity. ((orig.))

An Optimized Thermal Analysis of Electronic Unit Used in Aircraft

International Nuclear Information System (INIS)

Shah, A.N.; Mir, F.; Farooq, M.; Farooq, M.

2014-01-01

In a field where change and growth is inevitable, new electronic packaging problems continuously arise. Smaller, but more powerful devices are prone to overheating causing intermittent system failures, corrupted signals and outright system failure. Current study is focused on the analysis of the optimized working of electronic equipment from thermal point of view. In order to achieve the objective, an approach was developed for the thermal analysis of Printed Circuit Board (PCB) including the heat dissipation of its electronic components and then removal of the heat in a sophisticated manner by considering the conduction and convection modes of heat transfer. Mathematical modeling was carried out for a certain problem to address the thermal design, and then a program was developed in MATLAB for the solution of model by using Newton-Raphson method. The proposed unit is to be mounted on an aircraft having suspected thermal characteristics owing to abrupt changes in pressure and temperature as aircraft moves quickly from a lower altitude to higher altitude. In current study, dominant mode of heat transfer was conduction revealing that the major portion of heat transfer takes place by copper cladding and that heat conduction along the length of PCB can be improved enormously by using even thin layer of copper. The results confirmed that temperatures of all the electronic components were within derated values. Meanwhile, it was known that convection also plays a significant role in the reduction of temperatures of the components. The reduction in nodal temperature was in the range of 13 to 42 %. Furthermore, altitude variation from sea level to 15240 m (above sea level) caused the reduction in pressure from 1atm to 0.1095 atm. Consequently, the temperature of the electronic components increased from 73.25 degree C to 83.83 degree C for first node 'a', and from 66.04 degree C to 68.47 degree C for last node 'n' because of the decrease in the convective heat transfer

Ultrahigh lattice thermal conductivity in topological semimetal TaN caused by a large acoustic-optical gap.

Science.gov (United States)

Guo, San-Dong; Liu, Bang-Gui

2018-03-14

Topological semimetals may have potential applications such as in topological qubits, spintronics and quantum computations. Efficient heat dissipation is a key factor for the reliability and stability of topological semimetal-based nano-electronics devices, which is closely related to high thermal conductivity. In this work, the elastic properties and lattice thermal conductivity of TaN are investigated using first-principles calculations and the linearized phonon Boltzmann equation within the single-mode relaxation time approximation. According to the calculated bulk modulus, shear modulus and C 44 , TaN can be regarded as a potential incompressible and hard material. The room-temperature lattice thermal conductivity is predicted to be 838.62 [Formula: see text] along the a axis and 1080.40 [Formula: see text] along the c axis, showing very strong anisotropy. It is found that the lattice thermal conductivity of TaN is several tens of times higher than other topological semimetals, such as TaAs, MoP and ZrTe, which is due to the very longer phonon lifetimes for TaN than other topological semimetals. The very different atomic masses of Ta and N atoms lead to a very large acoustic-optical band gap, and then prohibit the scattering between acoustic and optical phonon modes, which gives rise to very long phonon lifetimes. Calculated results show that isotope scattering has little effect on lattice thermal conductivity, and that phonons with mean free paths larger than 20 (80) [Formula: see text] along the c direction at 300 K have little contribution to the total lattice thermal conductivity. This work implies that TaN-based nano-electronics devices may be more stable and reliable due to efficient heat dissipation, and motivates further experimental works to study lattice thermal conductivity of TaN.

Ultrahigh lattice thermal conductivity in topological semimetal TaN caused by a large acoustic-optical gap

Science.gov (United States)

Guo, San-Dong; Liu, Bang-Gui

2018-03-01

Topological semimetals may have potential applications such as in topological qubits, spintronics and quantum computations. Efficient heat dissipation is a key factor for the reliability and stability of topological semimetal-based nano-electronics devices, which is closely related to high thermal conductivity. In this work, the elastic properties and lattice thermal conductivity of TaN are investigated using first-principles calculations and the linearized phonon Boltzmann equation within the single-mode relaxation time approximation. According to the calculated bulk modulus, shear modulus and C 44, TaN can be regarded as a potential incompressible and hard material. The room-temperature lattice thermal conductivity is predicted to be 838.62 W~m-1~K^{-1} along the a axis and 1080.40 W~m-1~K^{-1} along the c axis, showing very strong anisotropy. It is found that the lattice thermal conductivity of TaN is several tens of times higher than other topological semimetals, such as TaAs, MoP and ZrTe, which is due to the very longer phonon lifetimes for TaN than other topological semimetals. The very different atomic masses of Ta and N atoms lead to a very large acoustic-optical band gap, and then prohibit the scattering between acoustic and optical phonon modes, which gives rise to very long phonon lifetimes. Calculated results show that isotope scattering has little effect on lattice thermal conductivity, and that phonons with mean free paths larger than 20 (80) μm along the c direction at 300 K have little contribution to the total lattice thermal conductivity. This work implies that TaN-based nano-electronics devices may be more stable and reliable due to efficient heat dissipation, and motivates further experimental works to study lattice thermal conductivity of TaN.

Anisotropic in-plane thermal conductivity in multilayer silicene

Science.gov (United States)

Zhou, Yang; Guo, Zhi-Xin; Chen, Shi-You; Xiang, Hong-Jun; Gong, Xin-Gao

2018-06-01

We systematically study thermal conductivity of multilayer silicene by means of Boltzmann Transportation Equation (BTE) method. We find that their thermal conductivity strongly depends on the surface structures. Thermal conductivity of bilayer silicene varies from 3.31 W/mK to 57.9 W/mK with different surface structures. Also, the 2 × 1 surface reconstruction induces unusual large thermal conductivity anisotropy, which reaches 70% in a four-layer silicene. We also find that the anisotropy decreases with silicene thickness increasing, owing to the significant reduction of thermal conductivity in the zigzag direction and its slight increment in the armchair direction. Finally, we find that both the phonon-lifetime anisotropy and the phonon-group-velocity anisotropy contribute to the thermal conductivity anisotropy of multilayer silicene. These findings could be helpful in the field of heat management, thermoelectric applications involving silicene and other multilayer nanomaterials with surface reconstructions in the future.

The effect of reinforcement volume ratio on porosity and thermal conductivity in Al-Mgo composites

Directory of Open Access Journals (Sweden)

Recep Calin

2012-12-01

Full Text Available In this study, the effects of reinforcement volume ratios (RVR on composite structure and thermal conductivity were examined in Al-MgO reinforced metal matrix composites (MMCs of 5%, 10% and 15% RVR produced by melt stirring. In the production of composites, EN AW 1050A aluminum alloy was used as the matrix material and MgO powders with particle size of -105 µm were used as the reinforcement material. For every composite specimen was produced at 500 rev/min stirring speed, at 750 °C liquid matrix temperature and 4 minutes stirring time. Composite samples were cooled under normal atmosphere. Then, microstructures of the samples were determined and evaluated by using Scanning Electron Microscope (SEM and Energy Dispersive X-ray Spectroscopy (EDS analysis. In general, it was observed that the reinforcement exhibited a homogeneous distribution. Furthermore, it was determined that the increase in the RVR increased porosity. From the Scanning Electron Microscope images, a thermal Ansys model was generated to determine effective thermal conductivity. Effective thermal conductivity of Al-MgO composites increased with the decrease in reinforcement volume ratio.

Nanoscale size dependence parameters on lattice thermal conductivity of Wurtzite GaN nanowires

International Nuclear Information System (INIS)

Mamand, S.M.; Omar, M.S.; Muhammad, A.J.

2012-01-01

Graphical abstract: Temperature dependence of calculated lattice thermal conductivity of Wurtzite GaN nanowires. Highlights: ► A modified Callaway model is used to calculate lattice thermal conductivity of Wurtzite GaN nanowires. ► A direct method is used to calculate phonon group velocity for these nanowires. ► 3-Gruneisen parameter, surface roughness, and dislocations are successfully investigated. ► Dislocation densities are decreases with the decrease of wires diameter. -- Abstract: A detailed calculation of lattice thermal conductivity of freestanding Wurtzite GaN nanowires with diameter ranging from 97 to 160 nm in the temperature range 2–300 K, was performed using a modified Callaway model. Both longitudinal and transverse modes are taken into account explicitly in the model. A method is used to calculate the Debye and phonon group velocities for different nanowire diameters from their related melting points. Effect of Gruneisen parameter, surface roughness, and dislocations as structure dependent parameters are successfully used to correlate the calculated values of lattice thermal conductivity to that of the experimentally measured curves. It was observed that Gruneisen parameter will decrease with decreasing nanowire diameters. Scattering of phonons is assumed to be by nanowire boundaries, imperfections, dislocations, electrons, and other phonons via both normal and Umklapp processes. Phonon confinement and size effects as well as the role of dislocation in limiting thermal conductivity are investigated. At high temperatures and for dislocation densities greater than 10 14 m −2 the lattice thermal conductivity would be limited by dislocation density, but for dislocation densities less than 10 14 m −2 , lattice thermal conductivity would be independent of that.

Nanoscale size dependence parameters on lattice thermal conductivity of Wurtzite GaN nanowires

Energy Technology Data Exchange (ETDEWEB)

Mamand, S.M., E-mail: soran.mamand@univsul.net [Department of Physics, College of Science, University of Sulaimani, Sulaimanyah, Iraqi Kurdistan (Iraq); Omar, M.S. [Department of Physics, College of Science, University of Salahaddin, Arbil, Iraqi Kurdistan (Iraq); Muhammad, A.J. [Department of Physics, College of Science, University of Kirkuk, Kirkuk (Iraq)

2012-05-15

Graphical abstract: Temperature dependence of calculated lattice thermal conductivity of Wurtzite GaN nanowires. Highlights: Black-Right-Pointing-Pointer A modified Callaway model is used to calculate lattice thermal conductivity of Wurtzite GaN nanowires. Black-Right-Pointing-Pointer A direct method is used to calculate phonon group velocity for these nanowires. Black-Right-Pointing-Pointer 3-Gruneisen parameter, surface roughness, and dislocations are successfully investigated. Black-Right-Pointing-Pointer Dislocation densities are decreases with the decrease of wires diameter. -- Abstract: A detailed calculation of lattice thermal conductivity of freestanding Wurtzite GaN nanowires with diameter ranging from 97 to 160 nm in the temperature range 2-300 K, was performed using a modified Callaway model. Both longitudinal and transverse modes are taken into account explicitly in the model. A method is used to calculate the Debye and phonon group velocities for different nanowire diameters from their related melting points. Effect of Gruneisen parameter, surface roughness, and dislocations as structure dependent parameters are successfully used to correlate the calculated values of lattice thermal conductivity to that of the experimentally measured curves. It was observed that Gruneisen parameter will decrease with decreasing nanowire diameters. Scattering of phonons is assumed to be by nanowire boundaries, imperfections, dislocations, electrons, and other phonons via both normal and Umklapp processes. Phonon confinement and size effects as well as the role of dislocation in limiting thermal conductivity are investigated. At high temperatures and for dislocation densities greater than 10{sup 14} m{sup -2} the lattice thermal conductivity would be limited by dislocation density, but for dislocation densities less than 10{sup 14} m{sup -2}, lattice thermal conductivity would be independent of that.

Thermal conductivity of molten metals

Energy Technology Data Exchange (ETDEWEB)

Peralta-Martinez, Maria Vita

2000-02-01

A new instrument for the measurement of the thermal conductivity of molten metals has been designed, built and commissioned. The apparatus is based on the transient hot-wire technique and it is intended for operation over a wide range of temperatures, from ambient up to 1200 K, with an accuracy approaching 2%. In its present form the instrument operates up to 750 K. The construction of the apparatus involved four different stages, first, the design and construction of the sensor and second, the construction of an electronic system for the measurement and storage of data. The third stage was the design and instrumentation of the high temperature furnace for the melting and temperature control of the sample, and finally, an algorithm was developed for the extraction of the thermal conductivity from the raw measurement data. The sensor consists of a cylindrical platinum-wire symmetrically sandwiched between two rectangular plane sheets of alumina. The rectangular sensor is immersed in the molten metal of interest and a voltage step is applied to the ends of the platinum wire to induce heat dissipation and a consequent temperature rise which, is in part, determined by the thermal conductivity of the molten metal. The process is described by a set of partial differential equations and appropriate boundary conditions rather than an approximate analytical solution. An electronic bridge configuration was designed and constructed to perform the measurement of the resistance change of the platinum wire in the time range 20 {mu}s to 1 s. The resistance change is converted to temperature change by a suitable calibration. From these temperature measurements as a function of time the thermal conductivity of the molten metals has been deduced using the Finite Element Method for the solution of the working equations. This work has achieved its objective of improving the accuracy of the measurement of the thermal conductivity of molten metals from {+-}20% to {+-}2%. Measurements

Tuning the thermal conductivity of silicon carbide by twin boundary: a molecular dynamics study

International Nuclear Information System (INIS)

Liu, Qunfeng; Wang, Liang; Shen, Shengping; Luo, Hao

2017-01-01

Silicon carbide (SiC) is a semiconductor with excellent mechanical and physical properties. We study the thermal transport in SiC by using non-equilibrium molecular dynamics simulations. The work is focused on the effects of twin boundaries and temperature on the thermal conductivity of 3C-SiC. We find that compared to perfect SiC, twinned SiC has a markedly reduced thermal conductivity when the twin boundary spacing is less than 100 nm. The Si–Si twin boundary is more effective to phonon scattering than the C–C twin boundary. We also find that the phonon scattering effect of twin boundary decreases with increasing temperature. Our findings provide insights into the thermal management of SiC-based electronic devices and thermoelectric applications. (paper)

Anomalously temperature-dependent thermal conductivity of monolayer GaN with large deviations from the traditional 1 /T law

Science.gov (United States)

Qin, Guangzhao; Qin, Zhenzhen; Wang, Huimin; Hu, Ming

2017-05-01

Efficient heat dissipation, which is featured by high thermal conductivity, is one of the crucial issues for the reliability and stability of nanodevices. However, due to the generally fast 1 /T decrease of thermal conductivity with temperature increase, the efficiency of heat dissipation quickly drops down at an elevated temperature caused by the increase of work load in electronic devices. To this end, pursuing semiconductor materials that possess large thermal conductivity at high temperature, i.e., slower decrease of thermal conductivity with temperature increase than the traditional κ ˜1 /T relation, is extremely important to the development of disruptive nanoelectronics. Recently, monolayer gallium nitride (GaN) with a planar honeycomb structure emerges as a promising new two-dimensional material with great potential for applications in nano- and optoelectronics. Here, we report that, despite the commonly established 1 /T relation of thermal conductivity in plenty of materials, monolayer GaN exhibits anomalous behavior that the thermal conductivity almost decreases linearly over a wide temperature range above 300 K, deviating largely from the traditional κ ˜1 /T law. The thermal conductivity at high temperature is much larger than the expected thermal conductivity that follows the general κ ˜1 /T trend, which would be beneficial for applications of monolayer GaN in nano- and optoelectronics in terms of efficient heat dissipation. We perform detailed analysis on the mechanisms underlying the anomalously temperature-dependent thermal conductivity of monolayer GaN in the framework of Boltzmann transport theory and further get insight from the view of electronic structure. Beyond that, we also propose two required conditions for materials that would exhibit similar anomalous temperature dependence of thermal conductivity: large difference in atom mass (huge phonon band gap) and electronegativity (LO-TO splitting due to strong polarization of bond). Our

Thermal conductivity measurements in unsaturated hydrate-bearing sediments

Science.gov (United States)

Dai, Sheng; Cha, Jong-Ho; Rosenbaum, Eilis J.; Zhang, Wu; Seol, Yongkoo

2015-08-01

Current database on the thermal properties of hydrate-bearing sediments remains limited and has not been able to capture their consequential changes during gas production where vigorous phase changes occur in this unsaturated system. This study uses the transient plane source (TPS) technique to measure the thermal conductivity of methane hydrate-bearing sediments with various hydrate/water/gas saturations. We propose a simplified method to obtain thermal properties from single-sided TPS signatures. Results reveal that both volume fraction and distribution of the pore constituents govern the thermal conductivity of unsaturated specimens. Thermal conductivity hysteresis is observed due to water redistribution and fabric change caused by hydrate formation and dissociation. Measured thermal conductivity increases evidently when hydrate saturation Sh > 30-40%, shifting upward from the geometric mean model prediction to a Pythagorean mixing model. These observations envisage a significant drop in sediment thermal conductivity when residual hydrate/water saturation falls below ~40%, hindering further gas production.

Low temperature thermal conductivities of glassy carbons

International Nuclear Information System (INIS)

Anderson, A.C.

1979-01-01

The thermal conductivity of glassy carbon in the temperature range 0.1 to 100 0 K appears to depend only on the temperature at which the material was pyrolyzed. The thermal conductivity can be related to the microscopic structure of glassy carbon. The reticulated structure is especially useful for thermal isolation at cryogenic temperatures

Preparation and properties of highly conductive palmitic acid/graphene oxide composites as thermal energy storage materials

International Nuclear Information System (INIS)

Mehrali, Mohammad; Latibari, Sara Tahan; Mehrali, Mehdi; Indra Mahlia, Teuku Meurah; Cornelis Metselaar, Hendrik Simon

2013-01-01

PA/GO (palmitic acid/graphene oxide) as PCMs (phase change materials) prepared by vacuum impregnation method, have high thermal conductivity. The GO (graphene oxide) composite was used as supporting material to improve thermal conductivity and shape stabilization of composite PCM (phase change material). SEM (Scanning electronic microscope), FT-IR (Fourier transformation infrared spectroscope) and XRD (X-ray diffractometer) were applied to determine microstructure, chemical structure and crystalloid phase of palmitic acid/GO composites, respectively. DSC (Differential scanning calorimeter) test was done to investigate thermal properties which include melting and solidifying temperatures and latent heat. FT-IR analysis represented that the composite instruction of porous palmitic acid and GO were physical. The temperatures of melting, freezing and latent heats of the composite measured through DSC analysis were 60.45, 60.05 °C, 101.23 and 101.49 kJ/kg, respectively. Thermal cycling test showed that the form-stable composite PCM has good thermal reliability and chemical stability. Thermal conductivity of the composite PCM was improved by more than three times from 0.21 to 1.02. As a result, due to their acceptable thermal properties, good thermal reliability, chemical stability and great thermal conductivities, we can consider the prepared form-stable composites as highly conductive PCMs for thermal energy storage applications. - Highlights: • Novel composite PCM with high thermal conductivity and latent heat storage. • New thermal cycling test for thermal reliability of composite PCMs. • Increasing thermal conductivity of composite PCM with graphene oxide. • Increasing thermal stability of phase change material by adding graphene oxide

Enhanced thermoelectric efficiency via orthogonal electrical and thermal conductances in phosphorene.

Science.gov (United States)

Fei, Ruixiang; Faghaninia, Alireza; Soklaski, Ryan; Yan, Jia-An; Lo, Cynthia; Yang, Li

2014-11-12

Thermoelectric devices that utilize the Seebeck effect convert heat flow into electrical energy and are highly desirable for the development of portable, solid state, passively powered electronic systems. The conversion efficiencies of such devices are quantified by the dimensionless thermoelectric figure of merit (ZT), which is proportional to the ratio of a device's electrical conductance to its thermal conductance. In this paper, a recently fabricated two-dimensional (2D) semiconductor called phosphorene (monolayer black phosphorus) is assessed for its thermoelectric capabilities. First-principles and model calculations reveal not only that phosphorene possesses a spatially anisotropic electrical conductance, but that its lattice thermal conductance exhibits a pronounced spatial-anisotropy as well. The prominent electrical and thermal conducting directions are orthogonal to one another, enhancing the ratio of these conductances. As a result, ZT may reach the criterion for commercial deployment along the armchair direction of phosphorene at T = 500 K and is close to 1 even at room temperature given moderate doping (∼2 × 10(16) m(-2) or 2 × 10(12) cm(-2)). Ultimately, phosphorene hopefully stands out as an environmentally sound thermoelectric material with unprecedented qualities. Intrinsically, it is a mechanically flexible material that converts heat energy with high efficiency at low temperatures (∼300 K), one whose performance does not require any sophisticated engineering techniques.

Thermal conductivity of catalyst layer of polymer electrolyte membrane fuel cells: Part 1 - Experimental study

Science.gov (United States)

Ahadi, Mohammad; Tam, Mickey; Saha, Madhu S.; Stumper, Jürgen; Bahrami, Majid

2017-06-01

In this work, a new methodology is proposed for measuring the through-plane thermal conductivity of catalyst layers (CLs) in polymer electrolyte membrane fuel cells. The proposed methodology is based on deconvolution of bulk thermal conductivity of a CL from measurements of two thicknesses of the CL, where the CLs are sandwiched in a stack made of two catalyst-coated substrates. Effects of hot-pressing, compression, measurement method, and substrate on the through-plane thermal conductivity of the CL are studied. For this purpose, different thicknesses of catalyst are coated on ethylene tetrafluoroethylene (ETFE) and aluminum (Al) substrates by a conventional Mayer bar coater and measured by scanning electron microscopy (SEM). The through-plane thermal conductivity of the CLs is measured by the well-known guarded heat flow (GHF) method as well as a recently developed transient plane source (TPS) method for thin films which modifies the original TPS thin film method. Measurements show that none of the studied factors has any effect on the through-plane thermal conductivity of the CL. GHF measurements of a non-hot-pressed CL on Al yield thermal conductivity of 0.214 ± 0.005 Wṡm-1ṡK-1, and TPS measurements of a hot-pressed CL on ETFE yield thermal conductivity of 0.218 ± 0.005 Wṡm-1ṡK-1.

Thermal Conductivity of Carbon Nanotubes Embedded in Solids

Institute of Scientific and Technical Information of China (English)

CAO Bing-Yang; HOU Quan-Wen

2008-01-01

@@ A carbon-nanotube-atom fixed and activated scheme of non-equilibrium molecular dynamics simulations is put forward to extract the thermal conductivity of carbon nanotubes (CNTs) embedded in solid argon. Though a 6.5% volume fraction of CNTs increases the composite thermal conductivity to about twice as much as that of the pure basal material, the thermal conductivity of CNTs embedded in solids is found to be decreased by 1/8-1/5with reference to that of pure ones. The decrease of the intrinsic thermal conductivity of the solid-embedded CNTs and the thermal interface resistance are demonstrated to be responsible for the results.

Self-similar variables and the problem of nonlocal electron heat conductivity

International Nuclear Information System (INIS)

Krasheninnikov, S.I.; Bakunin, O.G.

1993-10-01

Self-similar solutions of the collisional electron kinetic equation are obtained for the plasmas with one (1D) and three (3D) dimensional plasma parameter inhomogeneities and arbitrary Z eff . For the plasma parameter profiles characterized by the ratio of the mean free path of thermal electrons with respect to electron-electron collisions, γ T , to the scale length of electron temperature variation, L, one obtains a criterion for determining the effect that tail particles with motion of the non-diffusive type have on the electron heat conductivity. For these conditions it is shown that the use of a open-quotes symmetrizedclose quotes kinetic equation for the investigation of the strong nonlocal effect of suprathermal electrons on the electron heat conductivity is only possible at sufficiently high Z eff (Z eff ≥ (L/γ T ) 1/2 ). In the case of 3D inhomogeneous plasma (spherical symmetry), the effect of the tail electrons on the heat transport is less pronounced since they are spread across the radius r

A first principles study of the electronic structure, elastic and thermal properties of UB{sub 2}

Energy Technology Data Exchange (ETDEWEB)

Jossou, Ericmoore, E-mail: ericmoore.jossou@usask.ca [Department of Mechanical Engineering, College of Engineering, University of Saskatchewan, 57 Campus Drive, Saskatoon, S7N 5A9, Saskatchewan (Canada); Malakkal, Linu [Department of Mechanical Engineering, College of Engineering, University of Saskatchewan, 57 Campus Drive, Saskatoon, S7N 5A9, Saskatchewan (Canada); Szpunar, Barbara; Oladimeji, Dotun [Department of Physics and Engineering Physics, College of Art and Science, University of Saskatchewan, 116 Science Place, Saskatoon, S7N 5E2, Saskatchewan (Canada); Szpunar, Jerzy A. [Department of Mechanical Engineering, College of Engineering, University of Saskatchewan, 57 Campus Drive, Saskatoon, S7N 5A9, Saskatchewan (Canada)

2017-07-15

Uranium diboride (UB{sub 2}) has been widely deployed for refractory use and is a proposed material for Accident Tolerant Fuel (ATF) due to its high thermal conductivity. However, the applicability of UB{sub 2} towards high temperature usage in a nuclear reactor requires the need to investigate the thermomechanical properties, and recent studies have failed in highlighting applicable properties. In this work, we present an in-depth theoretical outlook of the structural and thermophysical properties of UB{sub 2}, including but not limited to elastic, electronic and thermal transport properties. These calculations were performed within the framework of Density Functional Theory (DFT) + U approach, using Quantum ESPRESSO (QE) code considering the addition of Coulomb correlations on the uranium atom. The phonon spectra and elastic constant analysis show the dynamic and mechanical stability of UB{sub 2} structure respectively. The electronic structure of UB{sub 2} was investigated using full potential linear augmented plane waves plus local orbitals method (FP-LAPW+lo) as implemented in WIEN2k code. The absence of a band gap in the total and partial density of states confirms the metallic nature while the valence electron density plot reveals the presence of covalent bond between adjacent B-B atoms. We predicted the lattice thermal conductivity (k{sub L}) by solving Boltzmann Transport Equation (BTE) using ShengBTE. The second order harmonic and third-order anharmonic interatomic force constants required as input to ShengBTE was calculated using the Density-functional perturbation theory (DFPT). However, we predicted the electronic thermal conductivity (k{sub el}) using Wiedemann-Franz law as implemented in Boltztrap code. We also show that the sound velocity along ‘a’ and ‘c’ axes exhibit high anisotropy, which accounts for the anisotropic thermal conductivity of UB{sub 2}. - Highlights: •Prediction of electronic structure and thermophysical properties of UB

Thermal conductivity model for nanoporous thin films

Science.gov (United States)

Huang, Congliang; Zhao, Xinpeng; Regner, Keith; Yang, Ronggui

2018-03-01

Nanoporous thin films have attracted great interest because of their extremely low thermal conductivity and potential applications in thin thermal insulators and thermoelectrics. Although there are some numerical and experimental studies about the thermal conductivity of nanoporous thin films, a simplified model is still needed to provide a straightforward prediction. In this paper, by including the phonon scattering lifetimes due to film thickness boundary scattering, nanopore scattering and the frequency-dependent intrinsic phonon-phonon scattering, a fitting-parameter-free model based on the kinetic theory of phonon transport is developed to predict both the in-plane and the cross-plane thermal conductivities of nanoporous thin films. With input parameters such as the lattice constants, thermal conductivity, and the group velocity of acoustic phonons of bulk silicon, our model shows a good agreement with available experimental and numerical results of nanoporous silicon thin films. It illustrates that the size effect of film thickness boundary scattering not only depends on the film thickness but also on the size of nanopores, and a larger nanopore leads to a stronger size effect of the film thickness. Our model also reveals that there are different optimal structures for getting the lowest in-plane and cross-plane thermal conductivities.

Effect of stacking sequence and surface treatment on the thermal conductivity of multilayered hybrid nano-composites

Science.gov (United States)

Papanicolaou, G. C.; Pappa, E. J.; Portan, D. V.; Kotrotsos, A.; Kollia, E.

2018-02-01

The aim of the present investigation was to study the effect of both the stacking sequence and surface treatment on the thermal conductivity of multilayered hybrid nano-composites. Four types of multilayered hybrid nanocomposites were manufactured and tested: Nitinol- CNTs (carbon nanotubes)- Acrylic resin; Nitinol- Acrylic resin- CNTs; Surface treated Nitinol- CNTs- Acrylic resin and Surface treated Nitinol- Acrylic resin- CNTs. Surface treatment of Nitinol plies was realized by means of the electrochemical anodization. Surface topography of the anodized nitinol sheets was investigated through Scanning Electron Microscopy (SEM). It was found that the overall thermal response of the manufactured multilayered nano-composites was greatly influenced by both the anodization and the stacking sequence. A theoretical model for the prediction of the overall thermal conductivity has been developed considering the nature of the different layers, their stacking sequence as well as the interfacial thermal resistance. Thermal conductivity and Differential Scanning Calorimetry (DSC) measurements were conducted, to verify the predicted by the model overall thermal conductivities. In all cases, a good agreement between theoretical predictions and experimental results was found.

Thermal conductivity and thermal rectification in graphene nanoribbons: a molecular dynamics study.

Science.gov (United States)

Hu, Jiuning; Ruan, Xiulin; Chen, Yong P

2009-07-01

We have used molecular dynamics to calculate the thermal conductivity of symmetric and asymmetric graphene nanoribbons (GNRs) of several nanometers in size (up to approximately 4 nm wide and approximately 10 nm long). For symmetric nanoribbons, the calculated thermal conductivity (e.g., approximately 2000 W/m-K at 400 K for a 1.5 nm x 5.7 nm zigzag GNR) is on the similar order of magnitude of the experimentally measured value for graphene. We have investigated the effects of edge chirality and found that nanoribbons with zigzag edges have appreciably larger thermal conductivity than nanoribbons with armchair edges. For asymmetric nanoribbons, we have found significant thermal rectification. Among various triangularly shaped GNRs we investigated, the GNR with armchair bottom edge and a vertex angle of 30 degrees gives the maximal thermal rectification. We also studied the effect of defects and found that vacancies and edge roughness in the nanoribbons can significantly decrease the thermal conductivity. However, substantial thermal rectification is observed even in the presence of edge roughness.

Overview of thermal conductivity models of anisotropic thermal insulation materials

Science.gov (United States)

Skurikhin, A. V.; Kostanovsky, A. V.

2017-11-01

Currently, the most of existing materials and substances under elaboration are anisotropic. It makes certain difficulties in the study of heat transfer process. Thermal conductivity of the materials can be characterized by tensor of the second order. Also, the parallelism between the temperature gradient vector and the density of heat flow vector is violated in anisotropic thermal insulation materials (TIM). One of the most famous TIM is a family of integrated thermal insulation refractory material («ITIRM»). The main component ensuring its properties is the «inflated» vermiculite. Natural mineral vermiculite is ground into powder state, fired by gas burner for dehydration, and its precipitate is then compressed. The key feature of thus treated batch of vermiculite is a package structure. The properties of the material lead to a slow heating of manufactured products due to low absorption and high radiation reflection. The maximum of reflection function is referred to infrared spectral region. A review of current models of heat propagation in anisotropic thermal insulation materials is carried out, as well as analysis of their thermal and optical properties. A theoretical model, which allows to determine the heat conductivity «ITIRM», can be useful in the study of thermal characteristics such as specific heat capacity, temperature conductivity, and others. Materials as «ITIRM» can be used in the metallurgy industry, thermal energy and nuclear power-engineering.

Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method

International Nuclear Information System (INIS)

Jiang, Longtao; Wang, Pingping; Xiu, Ziyang; Chen, Guoqin; Lin, Xiu; Dai, Chen; Wu, Gaohui

2015-01-01

In this work, aluminum matrix composites reinforced with diamond particles (diamond/aluminum composites) were fabricated by squeeze casting method. The material exhibited a thermal conductivity as high as 613 W / (m · K). The obtained composites were investigated by scanning electron microscope and transmission electron microscope in terms of the (100) and (111) facets of diamond particles. The diamond particles were observed to be homogeneously distributed in the aluminum matrix. The diamond (111) /Al interface was found to be devoid of reaction products. While at the diamond (100) /Al interface, large-sized aluminum carbides (Al 4 C 3 ) with twin-crystal structure were identified. The interfacial characteristics were believed to be responsible for the excellent thermal conductivity of the material. - Graphical abstract: Display Omitted - Highlights: • Squeeze casting method was introduced to fabricate diamond/Al composite. • Sound interfacial bonding with excellent thermal conductivity was produced. • Diamond (111) / aluminum interface was firstly characterized by TEM/HRTEM. • Physical combination was the controlling bonding for diamond (111) /aluminum. • The growth mechanism of Al 4 C 3 was analyzed by crystallography theory

The thermodynamical foundation of electronic conduction in solids

Science.gov (United States)

Bringuier, E.

2018-03-01

In elementary textbooks, the microscopic justification of Ohm’s local law in a solid medium starts with Drude’s classical model of electron transport and next discusses the quantum-dynamical and statistical amendments. In this paper, emphasis is laid instead upon the thermodynamical background motivated by the Joule-Lenz heating effect accompanying conduction and the fact that the conduction electrons are thermalized at the lattice temperature. Both metals and n-type semiconductors are considered; but conduction under a magnetic field is not. Proficiency in second-year thermodynamics and vector analysis is required from an undergraduate university student in physics so that the content of the paper can be taught to third-year students. The necessary elements of quantum mechanics are posited in this paper without detailed justification. We start with the equilibrium-thermodynamic notion of the chemical potential of the electron gas, the value of which distinguishes metals from semiconductors. Then we turn to the usage of the electrochemical potential in the description of near-equilibrium electron transport. The response of charge carriers to the electrochemical gradient involves the mobility, which is the reciprocal of the coefficient of the effective friction force opposing the carrier drift. Drude’s calculation of mobility is restated with the dynamical requirements of quantum physics. Where the carrier density is inhomogeneous, there appears diffusion, the coefficient of which is thermodynamically related to the mobility. Next, it is remarked that the release of heat was ignored in Drude’s original model. In this paper, the flow of Joule heat is handled thermodynamically within an energy balance where the voltage generator, the conduction electrons and the host lattice are involved in an explicit way. The notion of dissipation is introduced as the rate of entropy creation in a steady state. The body of the paper is restricted to the case of one

Effect of graphene layer thickness and mechanical compliance on interfacial heat flow and thermal conduction in solid-liquid phase change materials.

Science.gov (United States)

Warzoha, Ronald J; Fleischer, Amy S

2014-08-13

Solid-liquid phase change materials (PCMs) are attractive candidates for thermal energy storage and electronics cooling applications but have limited applicability in state-of-the-art technologies due to their low intrinsic thermal conductivities. Recent efforts to incorporate graphene and multilayer graphene into PCMs have led to the development of thermal energy storage materials with remarkable values of bulk thermal conductivity. However, the full potential of graphene as a filler material for the thermal enhancement of PCMs remains unrealized, largely due to an incomplete understanding of the physical mechanisms that govern thermal transport within graphene-based nanocomposites. In this work, we show that the number of graphene layers (n) within an individual graphene nanoparticle has a significant effect on the bulk thermal conductivity of an organic PCM. Results indicate that the bulk thermal conductivity of PCMs can be tuned by over an order of magnitude simply by adjusting the number of graphene layers (n) from n = 3 to 44. Using scanning electron microscopy in tandem with nanoscale analytical techniques, the physical mechanisms that govern heat flow within a graphene nanocomposite PCM are found to be nearly independent of the intrinsic thermal conductivity of the graphene nanoparticle itself and are instead found to be dependent on the mechanical compliance of the graphene nanoparticles. These findings are critical for the design and development of PCMs that are capable of cooling next-generation electronics and storing heat effectively in medium-to-large-scale energy systems, including solar-thermal power plants and building heating and cooling systems.

Rectification of electronic heat current by a hybrid thermal diode.

Science.gov (United States)

Martínez-Pérez, Maria José; Fornieri, Antonio; Giazotto, Francesco

2015-04-01

Thermal diodes--devices that allow heat to flow preferentially in one direction--are one of the key tools for the implementation of solid-state thermal circuits. These would find application in many fields of nanoscience, including cooling, energy harvesting, thermal isolation, radiation detection and quantum information, or in emerging fields such as phononics and coherent caloritronics. However, both in terms of phononic and electronic heat conduction (the latter being the focus of this work), their experimental realization remains very challenging. A highly efficient thermal diode should provide a difference of at least one order of magnitude between the heat current transmitted in the forward temperature (T) bias configuration (Jfw) and that generated with T-bias reversal (Jrev), leading to ℛ = Jfw/Jrev ≫ 1 or ≪ 1. So far, ℛ ≈ 1.07-1.4 has been reported in phononic devices, and ℛ ≈ 1.1 has been obtained with a quantum-dot electronic thermal rectifier at cryogenic temperatures. Here, we show that unprecedentedly high ratios of ℛ ≈ 140 can be achieved in a hybrid device combining normal metals tunnel-coupled to superconductors. Our approach provides a high-performance realization of a thermal diode for electronic heat current that could be successfully implemented in true low-temperature solid-state thermal circuits.

Thermal conductivity of an organic phase change material/expanded graphite composite across the phase change temperature range and a novel thermal conductivity model

International Nuclear Information System (INIS)

Ling, Ziye; Chen, Jiajie; Xu, Tao; Fang, Xiaoming; Gao, Xuenong; Zhang, Zhengguo

2015-01-01

Highlights: • Expanded graphite can improve thermal conductivity of RT44HC by 20–60 times. • Thermal conductivity of PCM/EG composites keeps constant before/after melting. • Thermal conductivity of PCMs nearly doubled during phase changing. • Thermal conductivity of composite PCM increases with density and percentage of EG. • The simple model predicts thermal conductivity of EG-based composites accurately. - Abstract: This work studies factors that affect the thermal conductivity of an organic phase change material (PCM), RT44HC/expanded graphite (EG) composite, which include: EG mass fraction, composite PCM density and temperature. The increase of EG mass fraction and bulk density will both enhance thermal conductivity of composite PCMs, by up to 60 times. Thermal conductivity of RT44HC/EG composites remains independent on temperature outside the phase change range (40–45 °C), but nearly doubles during the phase change. The narrow temperature change during the phase change allows the maximum heat flux or minimum temperature for heat source if attaching PCMs to a first (constant temperature) or second (constant heat flux) thermal boundary. At last, a simple thermal conductivity model for EG-based composites is put forward, based on only two parameters: mass fraction of EG and bulk density of the composite. This model is validated with experiment data presented in this paper and in literature, showing this model has general applicability to any composite of EG and poor thermal conductive materials

Thermal Conductivity Measurement of Anisotropic Biological Tissue In Vitro

Science.gov (United States)

Yue, Kai; Cheng, Liang; Yang, Lina; Jin, Bitao; Zhang, Xinxin

2017-06-01

The accurate determination of the thermal conductivity of biological tissues has implications on the success of cryosurgical/hyperthermia treatments. In light of the evident anisotropy in some biological tissues, a new modified stepwise transient method was proposed to simultaneously measure the transverse and longitudinal thermal conductivities of anisotropic biological tissues. The physical and mathematical models were established, and the analytical solution was derived. Sensitivity analysis and experimental simulation were performed to determine the feasibility and measurement accuracy of simultaneously measuring the transverse and longitudinal thermal conductivities. The experimental system was set up, and its measurement accuracy was verified by measuring the thermal conductivity of a reference standard material. The thermal conductivities of the pork tenderloin and bovine muscles were measured using the traditional 1D and proposed methods, respectively, at different temperatures. Results indicate that the thermal conductivities of the bovine muscle are lower than those of the pork tenderloin muscle, whereas the bovine muscle was determined to exhibit stronger anisotropy than the pork tenderloin muscle. Moreover, the longitudinal thermal conductivity is larger than the transverse thermal conductivity for the two tissues and all thermal conductivities increase with the increase in temperature. Compared with the traditional 1D method, results obtained by the proposed method are slightly higher although the relative deviation is below 5 %.

Anisotropy in thermal conductivity of graphite flakes–SiC_p/matrix composites: Implications in heat sinking design for thermal management applications

International Nuclear Information System (INIS)

Molina, J.M.; Louis, E.

2015-01-01

Within the frame of heat dissipation for electronics, a very interesting family of anisotropic composite materials, fabricated by liquid infiltration of a matrix into preforms of oriented graphite flakes and SiC particles, has been recently proposed. Aiming to investigate the implications of the inherent anisotropy of these composites on their thermal conductivity, and hence on their potential applications, materials with matrices of Al–12 wt.% Si alloy and epoxy polymer have been fabricated. Samples have been cut at a variable angle with respect to the flakes plane and thermal conductivity has been measured by means of two standard techniques, namely, steady state technique and laser flash method. Experimental results are presented and discussed in terms of current models, from which important technological implications for heat sinking design can be derived. - Highlights: • Anisotropy in thermal conductivity of graphite flakes-based composites is evaluated. • Samples are cut in a direction forming a variable angle with the oriented flakes. • For angles 0° and 90°, thermal conductivity does not depend on sample geometry. • For intermediate angles, thermal conductivity strongly depends on sample geometry. • “Thin” samples must be thicker than 600 μm, “thick” samples must be encapsulated.

Thermal expansion anomaly and thermal conductivity of U3O8

International Nuclear Information System (INIS)

Schulz, B.

1975-01-01

The anomaly in the thermal expansion of U 3 O 8 and results of the thermal conductivity of this compound are described. U 3 O 8 powder heat treated at 1,223 K was consolidated by pressing and sintering in air at 1,223 and 1,373 K to a density of 66% and 80.8% TD. The O/U ratio was 2.67 and 2.63 respectively, the crystal structure being orthorhombic in both cases. For UOsub(2.63) the thermal linear expansion was measured in the temperature range 293 K-1,063 K in pressing direction and normal to it, while for UOsub(2.67) measurements were done parallel to the pressing direction. The curves of the linear thermal expansion from 373 K up to 623 K show negative values and above positive for the three curves. The results are related to known data of phase-transition-temperatures of the orthorhombic U 3 O 8 . Measurements of the thermal conductivity were done on UOsub(2.67). Because of the high porosity of the samples, known relationships for the porosity correction of the thermal conductivity were proved on alumina with 34 % porosity. The values of the thermal conductivity of UOsub(2.67) (corrected to zero porosity) show a very slight temperature dependence, they are about three times lower than those of the stoichiometric uranium dioxide in the same temperature range

Hydrogen bonding-assisted thermal conduction in β-sheet crystals of spider silk protein

Science.gov (United States)

Zhang, Lin; Chen, Teli; Ban, Heng; Liu, Ling

2014-06-01

Using atomistic simulations, we demonstrate that β-sheet, an essential component of spider silk protein, has a thermal conductivity 1-2 orders of magnitude higher than that of some other protein structures reported in the literature. In contrast to several other nanostructured materials of similar bundled/layered structures (e.g. few-layer graphene and bundled carbon nanotubes), the β-sheet is found to uniquely feature enhanced thermal conductivity with an increased number of constituting units, i.e. β-strands. Phonon analysis identifies inter-β-strand hydrogen bonding as the main contributor to the intriguing phenomenon, which prominently influences the state of phonons in both low- and high-frequency regimes. A thermal resistance model further verifies the critical role of hydrogen bonding in thermal conduction through β-sheet structures.Using atomistic simulations, we demonstrate that β-sheet, an essential component of spider silk protein, has a thermal conductivity 1-2 orders of magnitude higher than that of some other protein structures reported in the literature. In contrast to several other nanostructured materials of similar bundled/layered structures (e.g. few-layer graphene and bundled carbon nanotubes), the β-sheet is found to uniquely feature enhanced thermal conductivity with an increased number of constituting units, i.e. β-strands. Phonon analysis identifies inter-β-strand hydrogen bonding as the main contributor to the intriguing phenomenon, which prominently influences the state of phonons in both low- and high-frequency regimes. A thermal resistance model further verifies the critical role of hydrogen bonding in thermal conduction through β-sheet structures. Electronic supplementary information (ESI) available: Structure of the β-sheets, computational model, determination of area and temperature gradient, and additional phonon DOS results. See DOI: 10.1039/c4nr01195c

Using Nanoparticles for Enhance Thermal Conductivity of Latent Heat Thermal Energy Storage

Directory of Open Access Journals (Sweden)

Baydaa Jaber Nabhan

2015-06-01

Full Text Available Phase change materials (PCMs such as paraffin wax can be used to store or release large amount of energy at certain temperature at which their solid-liquid phase changes occurs. Paraffin wax that used in latent heat thermal energy storage (LHTES has low thermal conductivity. In this study, the thermal conductivity of paraffin wax has been enhanced by adding different mass concentration (1wt.%, 3wt.%, 5wt.% of (TiO2 nano-particles with about (10nm diameter. It is found that the phase change temperature varies with adding (TiO2 nanoparticles in to the paraffin wax. The thermal conductivity of the composites is found to decrease with increasing temperature. The increase in thermal conductivity has been found to increase by about (10% at nanoparticles loading (5wt.% and 15oC.

Thermal conductivity analysis and applications of nanocellulose materials

Science.gov (United States)

Uetani, Kojiro; Hatori, Kimihito

2017-01-01

Abstract In this review, we summarize the recent progress in thermal conductivity analysis of nanocellulose materials called cellulose nanopapers, and compare them with polymeric materials, including neat polymers, composites, and traditional paper. It is important to individually measure the in-plane and through-plane heat-conducting properties of two-dimensional planar materials, so steady-state and non-equilibrium methods, in particular the laser spot periodic heating radiation thermometry method, are reviewed. The structural dependency of cellulose nanopaper on thermal conduction is described in terms of the crystallite size effect, fibre orientation, and interfacial thermal resistance between fibres and small pores. The novel applications of cellulose as thermally conductive transparent materials and thermal-guiding materials are also discussed. PMID:29152020

Tuning thermal conduction via extended defects in graphene

Science.gov (United States)

Huang, Huaqing; Xu, Yong; Zou, Xiaolong; Wu, Jian; Duan, Wenhui

2013-05-01

Designing materials for desired thermal conduction can be achieved via extended defects. We theoretically demonstrate the concept by investigating thermal transport in graphene nanoribbons (GNRs) with the extended line defects observed by recent experiments. Our nonequilibrium Green's function study excluding phonon-phonon interactions finds that thermal conductance can be tuned over wide ranges (more than 50% at room temperature), by controlling the orientation and the bond configuration of the embedded extended defect. Further transmission analysis reveals that the thermal-conduction tuning is attributed to two fundamentally different mechanisms, via modifying the phonon dispersion and/or tailoring the strength of defect scattering. The finding, applicable to other materials, provides useful guidance for designing materials with desired thermal conduction.

Extremely high thermal conductivity anisotropy of double-walled carbon nanotubes

Directory of Open Access Journals (Sweden)

Zhaoji Ma

2017-06-01

Full Text Available Based on molecular dynamics simulations, we reveal that double-walled carbon nanotubes can possess an extremely high anisotropy ratio of radial to axial thermal conductivities. The mechanism is basically the same as that for the high thermal conductivity anisotropy of graphene layers - the in-plane strong sp2 bonds lead to a very high intralayer thermal conductivity while the weak van der Waals interactions to a very low interlayer thermal conductivity. However, different from flat graphene layers, the tubular structures of carbon nanotubes result in a diameter dependent thermal conductivity. The smaller the diameter, the larger the axial thermal conductivity but the smaller the radial thermal conductivity. As a result, a DWCNT with a small diameter may have an anisotropy ratio of thermal conductivity significantly higher than that for graphene layers. The extremely high thermal conductivity anisotropy allows DWCNTs to be a promising candidate for thermal management materials.

Power Electronics and Thermal Management | Transportation Research | NREL

Science.gov (United States)

Power Electronics and Thermal Management Power Electronics and Thermal Management This is the March Gearhart's testimony. Optical Thermal Characterization Enables High-Performance Electronics Applications New vehicle electronics systems are being developed at a rapid pace, and NREL is examining strategies to

Through-thickness thermal conductivity enhancement of graphite film/epoxy composite via short duration acidizing modification

Science.gov (United States)

Wang, Han; Wang, Shaokai; Lu, Weibang; Li, Min; Gu, Yizhou; Zhang, Yongyi; Zhang, Zuoguang

2018-06-01

Graphite films have excellent in-plane thermal conductivity but extremely low through-thickness thermal conductivity because of their intrinsic inter-layer spaces. To improve the inter-layer heat transfer of graphite films, we developed a simple interfacial modification with a short duration mixed-acid treatment. The effects of the mixture ratio of sulfuric and nitric acids and treatment time on the through-thickness thermal properties of graphite films were studied. The modification increased the through-thickness thermal conductivity by 27% and 42% for the graphite film and its composite, respectively. X-ray photoelectron spectroscopy, X-ray powder diffraction, and scanning electron microscopy results indicated that the acidification process had two competing effects: the positive contribution made by the enhanced interaction between the graphite layers induced by the functional groups and the negative effect from the destruction of the graphite layers. As a result, an optimal acidification method was found to be sulfuric/nitric acid treatment with a mixture ratio of 3:1 for 15 min. The resultant through-thickness thermal conductivity of the graphite film could be improved to 0.674 W/mK, and the corresponding graphite/epoxy composite shows a through-thickness thermal conductivity of 0.587 W/mK. This method can be directly used for graphite films and their composite fabrication to improve through-thickness thermal conductivity.

Thermal conductivity of multi-walled carbon nanotube sheets: radiation losses and quenching of phonon modes

Energy Technology Data Exchange (ETDEWEB)

Aliev, Ali E; Lima, Marcio H; Baughman, Ray H [Alan G MacDiarmid NanoTech Institute, University of Texas at Dallas, Richardson, TX 75083 (United States); Silverman, Edward M, E-mail: Ali.Aliev@utdallas.edu [Northrop Grumman Space Technology, Redondo Beach, CA 90278 (United States)

2010-01-22

The extremely high thermal conductivity of individual carbon nanotubes, predicted theoretically and observed experimentally, has not yet been achieved for large nanotube assemblies. Resistances at tube-tube interconnections and tube-electrode interfaces have been considered the main obstacles for effective electronic and heat transport. Here we show that, even for infinitely long and perfect nanotubes with well-designed tube-electrode interfaces, excessive radial heat radiation from nanotube surfaces and quenching of phonon modes in large bundles are additional processes that substantially reduce thermal transport along nanotubes. Equivalent circuit simulations and an experimental self-heating 3{omega} technique were used to determine the peculiarities of anisotropic heat flow and thermal conductivity of single MWNTs, bundled MWNTs and aligned, free-standing MWNT sheets. The thermal conductivity of individual MWNTs grown by chemical vapor deposition and normalized to the density of graphite is much lower ({kappa}{sub MWNT} = 600 {+-} 100 W m{sup -1} K{sup -1}) than theoretically predicted. Coupling within MWNT bundles decreases this thermal conductivity to 150 W m{sup -1} K{sup -1}. Further decrease of the effective thermal conductivity in MWNT sheets to 50 W m{sup -1} K{sup -1} comes from tube-tube interconnections and sheet imperfections like dangling fiber ends, loops and misalignment of nanotubes. Optimal structures for enhancing thermal conductivity are discussed.

On non-extensive nature of thermal conductivity

Indian Academy of Sciences (India)

Abstract. In this paper we study non-extensive nature of thermal conductivity. It is observed that there is similarity between non-extensive entropic index and fractal dimension obtained for the silica aerogel thermal conductivity data at low temperature.

Advances in estimation technology of thermal conductivity of irradiated fuels (1). Application of a thermal microscope to measure the thermal conductivity of the second phases in irradiated pellets

International Nuclear Information System (INIS)

Uno, Masayoshi; Murakami, Yukihiro

2011-01-01

CeO 2 sample as a surrogate for fuel and BaCeO 3 and BaMoO 4 samples as surrogates for the second phases, which have a lower thermal conductivity than the fuel matrix, were made. The thermal conductivity of these samples was measured by a thermal microscope. In this method, the thermal conductivity of a small region (e.g. 20 μm x 20 μm) of the sample can be measured. The valid thermal conductivity values for all the samples were obtained and the conditions of sample surface preparation and the thermal microscope measurement were found out. The thermal conductivity of a CeO 2 composite pellet which had the BaCeO 3 or BaMoO 4 second phase layer was also estimated. (author)

The Evaporation and Survival of Cluster Galaxy Coronae. I. The Effectiveness of Isotropic Thermal Conduction Including Saturation

Energy Technology Data Exchange (ETDEWEB)

Vijayaraghavan, Rukmani; Sarazin, Craig, E-mail: rukmani@virginia.edu [Department of Astronomy, University of Virginia, 530 McCormick Rd., Charlottesville, VA 22904 (United States)

2017-05-20

We simulate the evolution of cluster galaxy hot interstellar medium (ISM) gas that is a result of the effects of ram pressure and thermal conduction in the intracluster medium (ICM). At the density and temperature of the ICM, the mean free paths of ICM electrons are comparable to the sizes of galaxies, therefore electrons can efficiently transport heat that is due to thermal conduction from the hot ICM to the cooler ISM. Galaxies consisting of dark matter halos and hot gas coronae are embedded in an ICM-like “wind tunnel” in our simulations. In this paper, we assume that thermal conduction is isotropic and include the effects of saturation. We find that as heat is transferred from the ICM to the ISM, the cooler denser ISM expands and evaporates. This process is significantly faster than gas loss due to ram pressure stripping; for our standard model galaxy, the evaporation time is 160 Myr, while the ram pressure stripping timescale is 2.5 Gyr. Thermal conduction also suppresses the formation of shear instabilities, and there are no stripped ISM tails since the ISM evaporates before tails can form. Observations of long-lived X-ray emitting coronae and ram pressure stripped X-ray tails in galaxies in group and cluster environments therefore require that thermal conduction is suppressed or offset by some additional physical process. The most likely process is anisotropic thermal conduction that is due to magnetic fields in the ISM and ICM, which we simulate and study in the next paper in this series.

The Evaporation and Survival of Cluster Galaxy Coronae. I. The Effectiveness of Isotropic Thermal Conduction Including Saturation

International Nuclear Information System (INIS)

Vijayaraghavan, Rukmani; Sarazin, Craig

2017-01-01

We simulate the evolution of cluster galaxy hot interstellar medium (ISM) gas that is a result of the effects of ram pressure and thermal conduction in the intracluster medium (ICM). At the density and temperature of the ICM, the mean free paths of ICM electrons are comparable to the sizes of galaxies, therefore electrons can efficiently transport heat that is due to thermal conduction from the hot ICM to the cooler ISM. Galaxies consisting of dark matter halos and hot gas coronae are embedded in an ICM-like “wind tunnel” in our simulations. In this paper, we assume that thermal conduction is isotropic and include the effects of saturation. We find that as heat is transferred from the ICM to the ISM, the cooler denser ISM expands and evaporates. This process is significantly faster than gas loss due to ram pressure stripping; for our standard model galaxy, the evaporation time is 160 Myr, while the ram pressure stripping timescale is 2.5 Gyr. Thermal conduction also suppresses the formation of shear instabilities, and there are no stripped ISM tails since the ISM evaporates before tails can form. Observations of long-lived X-ray emitting coronae and ram pressure stripped X-ray tails in galaxies in group and cluster environments therefore require that thermal conduction is suppressed or offset by some additional physical process. The most likely process is anisotropic thermal conduction that is due to magnetic fields in the ISM and ICM, which we simulate and study in the next paper in this series.

Effect of heat treatment temperature on binder thermal conductivities

International Nuclear Information System (INIS)

Wagner, P.

1975-12-01

The effect of heat treatment on the thermal conductivities of a pitch and a polyfurfuryl alcohol binder residue was investigated. Graphites specially prepared with these two binders were used for the experiments. Measured thermal conductivities were treated in terms of a two-component system, and the binder thermal conductivities were calculated. Both binder residues showed increased thermal conductivity with increased heat treatment temperature

Structure impact on the thermal and electronic properties of bismuth telluride by ab-initio and molecular dynamics calculations

International Nuclear Information System (INIS)

Termentzidis, K; Pokropivny, A; Xiong, S-Y; Chumakov, Y; Volz, S; Woda, M; Cortona, P

2012-01-01

We use molecular dynamics and ab-initio methods to predict the thermal and electronic properties of new materials with high figures of merit. The simulated systems are bulk bismuth tellurides with antisite and vacancy defects. Optimizations of the materials under investigation are performed by the SIESTA code for subsequent calculations of force constants, electronic properties, and Seebeck coefficients. The prediction of the thermal conductivity is made by Non-Equilibrium Molecular Dynamics (NEMD) using the LAMMPS code. The thermal conductivity of bulk bismuth telluride with different stoichiometry and with a number of substitution defects is calculated. We have found that the thermal conductivity can be decreased by 60% by introducing vacancy defects. The calculated thermal conductivities for the different structures are compared with the available experimental and theoretical results.

Thermal conductivity and thermal expansion of hot-pressed trisodium uranate (Na3UO4)

International Nuclear Information System (INIS)

Hofman, G.L.; Bottcher, J.H.; Buzzell, J.A.; Schwartzenberger, G.M.

1986-01-01

Thermal conductivity and thermal expansion of Na 3 UO 4 prepared by two different reaction processes were determined over a temperature range of 20-1000 0 C. Compositional differences in the samples resulting from the different reaction processes have a pronounced effect on thermal expansion and on thermal conductivity below 500 0 C. Above 500 0 C, these compositional differences in the thermal conductivities decrease. (orig.)

Optimizing the design of nanostructures for improved thermal conduction within confined spaces

Directory of Open Access Journals (Sweden)

Fan Jintu

2011-01-01

Full Text Available Abstract Maintaining constant temperature is of particular importance to the normal operation of electronic devices. Aiming at the question, this paper proposes an optimum design of nanostructures made of high thermal conductive nanomaterials to provide outstanding heat dissipation from the confined interior (possibly nanosized to the micro-spaces of electronic devices. The design incorporates a carbon nanocone for conducting heat from the interior to the exterior of a miniature electronic device, with the optimum diameter, D 0, of the nanocone satisfying the relationship: D0 2 (x ∝ x 1/2 where x is the position along the length direction of the carbon nanocone. Branched structure made of single-walled carbon nanotubes (CNTs are shown to be particularly suitable for the purpose. It was found that the total thermal resistance of a branched structure reaches a minimum when the diameter ratio, β* satisfies the relationship: β* = γ -0.25b N -1/k* , where γ is ratio of length, b = 0.3 to approximately 0.4 on the single-walled CNTs, b = 0.6 to approximately 0.8 on the multiwalled CNTs, k* = 2 and N is the bifurcation number (N = 2, 3, 4 .... The findings of this research provide a blueprint in designing miniaturized electronic devices with outstanding heat dissipation. PACS numbers: 44.10.+i, 44.05.+e, 66.70.-f, 61.48.De

Thermal Conductivity of Wurtzite Zinc-Oxide from First-Principles Lattice Dynamics – a Comparative Study with Gallium Nitride

Science.gov (United States)

Wu, Xufei; Lee, Jonghoon; Varshney, Vikas; Wohlwend, Jennifer L.; Roy, Ajit K.; Luo, Tengfei

2016-01-01

Wurtzite Zinc-Oxide (w-ZnO) is a wide bandgap semiconductor that holds promise in power electronics applications, where heat dissipation is of critical importance. However, large discrepancies exist in the literature on the thermal conductivity of w-ZnO. In this paper, we determine the thermal conductivity of w-ZnO using first-principles lattice dynamics and compare it to that of wurtzite Gallium-Nitride (w-GaN) – another important wide bandgap semiconductor with the same crystal structure and similar atomic masses as w-ZnO. However, the thermal conductivity values show large differences (400 W/mK of w-GaN vs. 50 W/mK of w-ZnO at room temperature). It is found that the much lower thermal conductivity of ZnO originates from the smaller phonon group velocities, larger three-phonon scattering phase space and larger anharmonicity. Compared to w-GaN, w-ZnO has a smaller frequency gap in phonon dispersion, which is responsible for the stronger anharmonic phonon scattering, and the weaker interatomic bonds in w-ZnO leads to smaller phonon group velocities. The thermal conductivity of w-ZnO also shows strong size effect with nano-sized grains or structures. The results from this work help identify the cause of large discrepancies in w-ZnO thermal conductivity and will provide in-depth understanding of phonon dynamics for the design of w-ZnO-based electronics. PMID:26928396

Mean free path dependent phonon contributions to interfacial thermal conductance

Energy Technology Data Exchange (ETDEWEB)

Tao, Yi; Liu, Chenhan; Chen, Weiyu; Cai, Shuang; Chen, Chen; Wei, Zhiyong; Bi, Kedong; Yang, Juekuan; Chen, Yunfei, E-mail: yunfeichen@seu.edu.cn

2017-06-15

Interfacial thermal conductance as an accumulation function of the phonon mean free path is rigorously derived from the thermal conductivity accumulation function. Based on our theoretical model, the interfacial thermal conductance accumulation function between Si/Ge is calculated. The results show that the range of mean free paths (MFPs) for phonons contributing to the interfacial thermal conductance is far narrower than that for phonons contributing to the thermal conductivity. The interfacial thermal conductance is mainly contributed by phonons with shorter MFPs, and the size effects can be observed only for an interface constructed by nanostructures with film thicknesses smaller than the MFPs of those phonons mainly contributing to the interfacial thermal conductance. This is why most experimental measurements cannot detect size effects on interfacial thermal conductance. A molecular dynamics simulation is employed to verify our proposed model. - Highlights: • A model to account for the interfacial thermal conductance as an accumulation function of phonon mean free path is proposed; • The model predicts that the range of mean free paths (MFPs) for phonons contributing to the interfacial thermal conductance is far narrower than that contributing to the thermal conductivity; • This model can be conveniently implemented to estimate the size effects on the interfacial thermal conductance for the interfaces formed by a nanostructure contacting a substrate.

Measurement of the Thermal Conductivity of Nano-fluid for the advanced heat exchanger

International Nuclear Information System (INIS)

Yoo, Shin; Lee, Jae Young

2006-01-01

The enhancement of heat transfer has been widely investigated to provide an effective way to cool down the modern electronic devices. Among the methods, Choi discovered a large amount of increase of thermal conductivity when nano sized particles were suspended in the fluid. It was first introduced by Masuda as a potential heat transfer enhancement media and since then, many researchers have investigated the nanofluids phenomena. Many researchers reported in substantially increasing the thermal conductivity of fluids by adding small amounts of suspended metallic oxide nanoparticles of Cu, CuO, Al 2 O 3 and carbon nano-tube. Masuda reported that the use Al 2 O 3 particles of 13 nm at 4.3% volume fraction increased the thermal conductivity of water by 30%. For carbon nano-tube nanofluids shows even greater enhancement. Xie et al. measured the thermal conductivity of carbon nanotube suspended in organic liquid and water with the enhancement of 10-20%. Recent studies have shown that inserting just 1% concentration of nano-particles sometimes increases about maximum 40% of thermal conductivity. However, there is still few experiments done for TiO 2 nanoparticles. Murshed found that the enhancement of thermal conductivity shows about 30% with 15nm in diameter with maximum 5% volume fraction and about 40% enhancement is observed using 15nmD x 40nm rod-shape nanoparticles of TiO 2 . The present experimental shows that a 20% maximum of enhancement in thermal conductivity using TiO 2 of 10nm for 3% volume fraction. Theses results are compared with previous research with theoretical models. As the first step of the heat transfer of nano fluid, the theories related to the nanofluids investigations have been discussed to understand not only the mechanism of thermal conductivity measurement, but also to understand the nanofluid behavior. Colloidal stability is the key to the nanofluid considered to prevent the agglomeration. Through the results, we will discuss the importance of

Thermal Conductivity of Superconductors in the Intermediate State: Size Effect in a Longitudinal Lamellar Structure

International Nuclear Information System (INIS)

Suter, J.M.; Rinderer, L.

1978-01-01

The thermal conductivity of type I superconductors has been measured in a well-defined, optically controlled intermediate-state configuration the so-called longitudinal lamellar structure (LLS). A regular arrangement of alternating normal and superconducting lamellas is obtained in an elongated plate by applying the magnetic field obliquely (following Sharvin) and decreasing it from the critical values. The heat current is set parallel to the lamellas. Due to the peculiar reflection law governing the quasiparticle reflections at a normal-superconductor interphase boundary, the thermal conductivity of the LLS is reduced when the electronic mean free path is larger than or comparable to the width of the lamellas. As first pointed out by Andreev, the reflection occurs with vecotr-momentum conservation, and only the quasiparticles moving nearly parallel to the lamellas can transport heat efficiently. The corresponding reduction of the thermal conductivity is a size effect.Systematic measurements of the thermal conductivity of the LLS in high-purity lead and tin are interpreted in terms of the size-effect model. The parameters of the model were experimentally determined in a preliminary study, to enable an unambiguous comparison with the theory. In particular, the geometrical aspects of the structures were studied using a magnetooptical technique. Interesting results on the characteristics of the LLS were obtained. The thermal conductivity data on lead essentially confirm the size-effect description. In tin heat transport by the lamellas of both types takes place, the heat carriers being the electrons (T > or approx. = 1.6 K). The discrepancy between the predictions of the size-effect model and the observed values in tin are attributed to an oversimplified calculation of the contribution of the superconducting lamellas to the conductivity

Synergistically improved thermal conductivity of polyamide-6 with low melting temperature metal and graphite

Directory of Open Access Journals (Sweden)

Y. C. Jia

2016-08-01

Full Text Available Low melting temperature metal (LMTM-tin (Sn was introduced into polyamide-6 (PA6 and PA6/graphite composites respectively to improve the thermal conductivity of PA6 by melt processing (extruding and injection molding. After introducing Sn, the thermal conductivity of PA6/Sn was nearly constant because of the serious agglomeration of Sn. However, when 20 wt% (5.4 vol% of Sn was added into PA6 containing 50 wt% (33.3 vol% of graphite, the thermal conductivity of the composite was dramatically increased to 5.364 versus 1.852 W·(m·K–1 for the PA6/graphite composite, which suggests that the incorporation of graphite and Sn have a significant synergistic effect on the thermal conductivity improvement of PA6. What is more, the electrical conductivity of the composite increased nearly 8 orders of magnitudes after introducing both graphite and Sn. Characterization of microstructure and energy dispersive spectrum analysis (EDS indicates that the dispersion of Sn in PA6/graphite/Sn was much more uniform than that of PA6/Sn composite. According to Differential Scanning Calorimetry measurement and EDS, the uniform dispersion of Sn in PA6/graphite/Sn and the high thermal conductivity of PA6/graphite/Sn are speculated to be related with the electron transfer between graphite and Sn, which makes Sn distribute evenly around the graphite layers.

Thermal Properties of Asphalt Mixtures Modified with Conductive Fillers

Directory of Open Access Journals (Sweden)

Byong Chol Bai

2015-01-01

Full Text Available This paper investigates the thermal properties of asphalt mixtures modified with conductive fillers used for snow melting and solar harvesting pavements. Two different mixing processes were adopted to mold asphalt mixtures, dry- and wet-mixing, and two conductive fillers were used in this study, graphite and carbon black. The thermal conductivity was compared to investigate the effects of asphalt mixture preparing methods, the quantity, and the distribution of conductive filler on thermal properties. The combination of conductive filler with carbon fiber in asphalt mixture was evaluated. Also, rheological properties of modified asphalt binders with conductive fillers were measured using dynamic shear rheometer and bending beam rheometer at grade-specific temperatures. Based on rheological testing, the conductive fillers improve rutting resistance and decrease thermal cracking resistance. Thermal testing indicated that graphite and carbon black improve the thermal properties of asphalt mixes and the combined conductive fillers are more effective than the single filler.

Lower-Conductivity Ceramic Materials for Thermal-Barrier Coatings

Science.gov (United States)

Bansal, Narottam P.; Zhu, Dongming

2006-01-01

Doped pyrochlore oxides of a type described below are under consideration as alternative materials for high-temperature thermal-barrier coatings (TBCs). In comparison with partially-yttria-stabilized zirconia (YSZ), which is the state-of-the-art TBC material now in commercial use, these doped pyrochlore oxides exhibit lower thermal conductivities, which could be exploited to obtain the following advantages: For a given difference in temperature between an outer coating surface and the coating/substrate interface, the coating could be thinner. Reductions in coating thicknesses could translate to reductions in weight of hot-section components of turbine engines (e.g., combustor liners, blades, and vanes) to which TBCs are typically applied. For a given coating thickness, the difference in temperature between the outer coating surface and the coating/substrate interface could be greater. For turbine engines, this could translate to higher operating temperatures, with consequent increases in efficiency and reductions in polluting emissions. TBCs are needed because the temperatures in some turbine-engine hot sections exceed the maximum temperatures that the substrate materials (superalloys, Si-based ceramics, and others) can withstand. YSZ TBCs are applied to engine components as thin layers by plasma spraying or electron-beam physical vapor deposition. During operation at higher temperatures, YSZ layers undergo sintering, which increases their thermal conductivities and thereby renders them less effective as TBCs. Moreover, the sintered YSZ TBCs are less tolerant of stress and strain and, hence, are less durable.

Technical assistance for development of thermally conductive nitride filler for epoxy molding compounds

Energy Technology Data Exchange (ETDEWEB)

Ryu, Ho Jin; Song, Kee Chan; Jung, In Ha

2005-07-15

Technical assistance was carried out to develop nitride filler for thermally conductive epoxy molding compounds. Carbothermal reduction method was used to fabricate silicon nitride powder from mixtures of silica and graphite powders. Microstructure and crystal structure were observed by using scanning electron microscopy and x-ray diffraction technique. Thermal properties of epoxy molding compounds containing silicon nitride were measured by using laser flash method. Fabrication process of silicon nitride nanowire was developed and was applied to a patent.

Thermal conductivity of uranium dioxide

International Nuclear Information System (INIS)

Pillai, C.G.S.; George, A.M.

1993-01-01

The thermal conductivity of uranium dioxide of composition UO 2.015 was measured from 300 to 1400 K. The phonon component of the conductivity is found to be quantitatively accounted for by the theoretical expression of Slack derived by modifying the Leibfried-Schlomann equation. (orig.)

Tuning thermal conductivity in molybdenum disulfide by electrochemical intercalation

Science.gov (United States)

Zhu, Gaohua; Liu, Jun; Zheng, Qiye; Zhang, Ruigang; Li, Dongyao; Banerjee, Debasish; Cahill, David G.

2016-01-01

Thermal conductivity of two-dimensional (2D) materials is of interest for energy storage, nanoelectronics and optoelectronics. Here, we report that the thermal conductivity of molybdenum disulfide can be modified by electrochemical intercalation. We observe distinct behaviour for thin films with vertically aligned basal planes and natural bulk crystals with basal planes aligned parallel to the surface. The thermal conductivity is measured as a function of the degree of lithiation, using time-domain thermoreflectance. The change of thermal conductivity correlates with the lithiation-induced structural and compositional disorder. We further show that the ratio of the in-plane to through-plane thermal conductivity of bulk crystal is enhanced by the disorder. These results suggest that stacking disorder and mixture of phases is an effective mechanism to modify the anisotropic thermal conductivity of 2D materials. PMID:27767030

Nonlinear vs. bolometric radiation response and phonon thermal conductance in graphene-superconductor junctions

International Nuclear Information System (INIS)

Vora, Heli; Nielsen, Bent; Du, Xu

2014-01-01

Graphene is a promising candidate for building fast and ultra-sensitive bolometric detectors due to its weak electron-phonon coupling and low heat capacity. In order to realize a practical graphene-based bolometer, several important issues, including the nature of radiation response, coupling efficiency to the radiation and the thermal conductance need to be carefully studied. Addressing these issues, we present graphene-superconductor junctions as a viable option to achieve efficient and sensitive bolometers, with the superconductor contacts serving as hot electron barriers. For a graphene-superconductor device with highly transparent interfaces, the resistance readout in the presence of radio frequency radiation is dominated by non-linear response. On the other hand, a graphene-superconductor tunnel device shows dominantly bolometric response to radiation. For graphene devices fabricated on SiO 2 substrates, we confirm recent theoretical predictions of T 2 temperature dependence of phonon thermal conductance in the presence of disorder in the graphene channel at low temperatures

Experimental investigation of thermal conduction and related phenomena in a laser heated plasma

International Nuclear Information System (INIS)

Gray, D.R.

1979-02-01

Thermal conduction in plasmas is of major importance especially in controlled nuclear fusion studies. Direct measurements are rare. When the temperature gradient in a plasma becomes large enough classical thermal conduction (Heat flux q = -kΔT) no longer applies and it is thought that q is limited to some fraction of the free streaming limit qsub(m). The main experiment is the heating of a z-pinch plasma by a fast rising, intense carbon dioxide laser pulse. Electron temperature and density in time and space are diagnosed by ruby laser scattering. The profiles obtained were consistent with a flux limited to approximately 3% of the free streaming limit. Ion acoustic turbulence is observed along the temperature gradient. It is shown that the observed turbulence level is consistent with the heat flux limitation. At electron densities > 10 17 cm -3 backscattered light is observed from the plasma whose growth rate implies that it is Brillouin scattered. (author)

Power Electronics Thermal Management R&D

Energy Technology Data Exchange (ETDEWEB)

Moreno, Gilbert; Bennion, Kevin

2016-06-08

This project will develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter designs). The use of WBG-based devices in automotive power electronics will improve efficiency and increase driving range in electric-drive vehicles; however, the implementation of this technology is limited, in part, due to thermal issues. This project will develop system-level thermal models to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

Thermal conductivity of ytterbia-stabilized zirconia

International Nuclear Information System (INIS)

Feng, Jing; Ren, Xiaorui; Wang, Xiaoyan; Zhou, Rong; Pan, Wei

2012-01-01

The 3–10 mol.% Yb 2 O 3 –ZrO 2 (YbSZ) ceramics were synthesized by solid reaction methods and sintered at 1600 °C. The phases were identified by high-resolution X-ray diffraction with a K α1 monochromator, and it was found that the tetragonal-prime phases exist in 3–6 mol.% YbSZ. The thermal conductivity of the sintered YbSZ ceramics were measured using a laser flash method and it was demonstrated that the values of the thermal conductivities of the 5 and 10 mol.% YbSZ ceramics are the lowest at high and room temperature, respectively, and much lower than that of 7YSZ. The lower thermal conductivity of YbSZ ceramics may be due to the heavier dopant of ytterbium and the tetragonal-prime ZrO 2 phase.

Anisotropy in thermal conductivity of graphite flakes–SiC{sub p}/matrix composites: Implications in heat sinking design for thermal management applications

Energy Technology Data Exchange (ETDEWEB)

Molina, J.M., E-mail: jmmj@ua.es [Instituto Universitario de Materiales de Alicante, Universidad de Alicante, Ap. 99, E-03080 Alicante (Spain); Departamento de Física Aplicada, Universidad de Alicante, Ap. 99, E-03080 Alicante (Spain); Departamento de Química Inorgánica, Universidad de Alicante, Ap. 99, | E-03080 Alicante (Spain); Louis, E. [Instituto Universitario de Materiales de Alicante, Universidad de Alicante, Ap. 99, E-03080 Alicante (Spain); Departamento de Física Aplicada, Universidad de Alicante, Ap. 99, E-03080 Alicante (Spain); Unidad Asociada del Consejo Superior de Investigaciones Científicas, Universidad de Alicante, Ap. 99, | E-03080 Alicante (Spain)

2015-11-15

Within the frame of heat dissipation for electronics, a very interesting family of anisotropic composite materials, fabricated by liquid infiltration of a matrix into preforms of oriented graphite flakes and SiC particles, has been recently proposed. Aiming to investigate the implications of the inherent anisotropy of these composites on their thermal conductivity, and hence on their potential applications, materials with matrices of Al–12 wt.% Si alloy and epoxy polymer have been fabricated. Samples have been cut at a variable angle with respect to the flakes plane and thermal conductivity has been measured by means of two standard techniques, namely, steady state technique and laser flash method. Experimental results are presented and discussed in terms of current models, from which important technological implications for heat sinking design can be derived. - Highlights: • Anisotropy in thermal conductivity of graphite flakes-based composites is evaluated. • Samples are cut in a direction forming a variable angle with the oriented flakes. • For angles 0° and 90°, thermal conductivity does not depend on sample geometry. • For intermediate angles, thermal conductivity strongly depends on sample geometry. • “Thin” samples must be thicker than 600 μm, “thick” samples must be encapsulated.

Thermal Conductivity of Copoly(ethylene vinyl acetate)/Nano-Filler Blends

Science.gov (United States)

Ghose, S.; Watson, K. A.; Working, D. C.; Connell, J. W.; Smith, J. G.; Lin, Y.; Sun, Y. P.

2007-01-01

The development of flexible, thermally conductive fabrics and plastic tubes for the Liquid Cooling and Ventilation Garment (LCVG) are needed to reduce weight and improve the mobility, comfort, and performance of future spacesuits. Such improvements would allow astronauts to operate more efficiently and safely for extended extravehicular activities. As a continuation of our work on the improvement of thermal conductivity (TC) of polymeric materials, nanocomposites were prepared from copoly(ethylene vinyl acetate), trade name Elvax 260TradeMark), metallized carbon nanofibers (CNFs), nickel (Ni) nanostrands, boron nitride both alone and as mixtures with aluminum powder. The nanocomposites were prepared by melt mixing at various loading levels and subsequently fabricated into several material forms (i.e., ribbons, tubes, and compression molded plaques) for analysis. Ribbons and tubes were extruded to form samples in which the nanoparticles were aligned in the direction of flow. The degree of dispersion and alignment of the nanoparticles were investigated using high-resolution scanning electron microscopy. Tensile properties of the aligned samples were determined at room temperature. TC measurements were performed using a laser flash (Nanoflash(TradeMark) technique. The TC of the samples was measured in both the direction of alignment as well as transverse. Tubing of comparable dimensions to that used in the LCVG was extruded from select compositions and the thermal conductivities of the tubes measured.

Calibration of non-ideal thermal conductivity sensors

Directory of Open Access Journals (Sweden)

N. I. Kömle

2013-04-01

Full Text Available A popular method for measuring the thermal conductivity of solid materials is the transient hot needle method. It allows the thermal conductivity of a solid or granular material to be evaluated simply by combining a temperature measurement with a well-defined electrical current flowing through a resistance wire enclosed in a long and thin needle. Standard laboratory sensors that are typically used in laboratory work consist of very thin steel needles with a large length-to-diameter ratio. This type of needle is convenient since it is mathematically easy to derive the thermal conductivity of a soft granular material from a simple temperature measurement. However, such a geometry often results in a mechanically weak sensor, which can bend or fail when inserted into a material that is harder than expected. For deploying such a sensor on a planetary surface, with often unknown soil properties, it is necessary to construct more rugged sensors. These requirements can lead to a design which differs substantially from the ideal geometry, and additional care must be taken in the calibration and data analysis. In this paper we present the performance of a prototype thermal conductivity sensor designed for planetary missions. The thermal conductivity of a suite of solid and granular materials was measured both by a standard needle sensor and by several customized sensors with non-ideal geometry. We thus obtained a calibration curve for the non-ideal sensors. The theory describing the temperature response of a sensor with such unfavorable length-to-diameter ratio is complicated and highly nonlinear. However, our measurements reveal that over a wide range of thermal conductivities there is an almost linear relationship between the result obtained by the standard sensor and the result derived from the customized, non-ideal sensors. This allows for the measurement of thermal conductivity values for harder soils, which are not easily accessible when using

Detection of electron and hole traps in CdZnTe radiation detectors by thermoelectric emission spectroscopy and thermally stimulated conductivity

International Nuclear Information System (INIS)

Lee, E.Y.; Brunett, B.A.; Olsen, R.W.; Van Scyoc, J.M. III; Hermon, H.; James, R.B.

1998-01-01

The electrical properties of CdZnTe radiation detectors are largely determined by electron and hole traps in this material. The traps, in addition to degrading the detector performance, can function as dopants and determine the resistivity of the material. Thermoelectric emission spectroscopy and thermally stimulated conductivity are used to detect these traps in a commercially available spectrometer-grade CdZnTe detector, and the electrical resistivity is measured as a function of temperature. A deep electron trap having an energy of 695 meV and cross section of 8 x 10 -16 cm 2 is detected and three hole traps having energies of 70 ± 20 meV, 105 ± 30 meV and 694 ± 162 meV are detected. A simple model based on these traps explains quantitatively all the data, including the electrical properties at room temperature and also their temperature dependence

Ceramic/Metal Composites with Positive Temperature Dependence of Thermal Conductivity

International Nuclear Information System (INIS)

Li Jianhui; Yu Qi; Sun Wei; Zhang Rui; Wang Ke; Li Jingfeng; Ichigozaki, Daisuke

2013-01-01

Most materials show decreasing thermal conductivity with increasing temperature, but an opposite temperature dependence of thermal conductivity is required for some industrial applications. The present work was conducted with a motivation to develop composite materials with a positive temperature dependence of thermal conductivity. ZrO 2 / stainless steel powders (304L) composite, with 3% stearic acid, was prepared by normal sintering under the protecting of Ar after mixing by mechanical ball milling technique. With the 304L content increasing from 10% to 20%, the thermal conductivity values increased. For all samples, the thermal conductivity in the temperature range of room temperature to 700 °C decreased with temperature below 300 °C, and then began to increase. The increasing thermal conductivity of the composites (within the high temperature range was attributed to the difference of the thermal conductivity and thermal expansion coefficient between ZrO 2 ceramic and 304L stainless steel powders. Two simple models were also used to estimate the thermal conductivity of the composites, which were in good agreement with the experiment results.

Anisotropic thermal conductivity in epoxy-bonded magnetocaloric composites

Science.gov (United States)

Weise, Bruno; Sellschopp, Kai; Bierdel, Marius; Funk, Alexander; Bobeth, Manfred; Krautz, Maria; Waske, Anja

2016-09-01

Thermal management is one of the crucial issues in the development of magnetocaloric refrigeration technology for application. In order to ensure optimal exploitation of the materials "primary" properties, such as entropy change and temperature lift, thermal properties (and other "secondary" properties) play an important role. In magnetocaloric composites, which show an increased cycling stability in comparison to their bulk counterparts, thermal properties are strongly determined by the geometric arrangement of the corresponding components. In the first part of this paper, the inner structure of a polymer-bonded La(Fe, Co, Si)13-composite was studied by X-ray computed tomography. Based on this 3D data, a numerical study along all three spatial directions revealed anisotropic thermal conductivity of the composite: Due to the preparation process, the long-axis of the magnetocaloric particles is aligned along the xy plane which is why the in-plane thermal conductivity is larger than the thermal conductivity along the z-axis. Further, the study is expanded to a second aspect devoted to the influence of particle distribution and alignment within the polymer matrix. Based on an equivalent ellipsoids model to describe the inner structure of the composite, numerical simulation of the thermal conductivity in different particle arrangements and orientation distributions were performed. This paper evaluates the possibilities of microstructural design for inducing and adjusting anisotropic thermal conductivity in magnetocaloric composites.

Variable Thermal Conductivity on Compressible Boundary Layer ...

African Journals Online (AJOL)

In this paper, variable thermal conductivity on heat transfer over a circular cylinder is presented. The concept of assuming constant thermal conductivity on materials is however not efficient. Hence, the governing partial differential equation is reduced using non-dimensionless variables into a system of coupled non-linear ...

Thermal conductivity of a superconducting spin-glass

International Nuclear Information System (INIS)

Crisan, M.

1988-01-01

The temperature dependence of the thermal conductivity for a superconducting spin-glass is calculated, taking a short-range spin-spin interaction in a super-conductor carrying a uniform flow. The presence of the short-range interaction between frozen spins gives rise to a strong depression in the thermal conductivity

Study of thermal conductivity of multilayer insulation

International Nuclear Information System (INIS)

Dutta, D.; Sundaram, S.; Nath, G.K.; Sethuram, N.P.; Chandrasekharan, T.; Varadarajan, T.G.

1994-01-01

This paper presents experimental determination of the apparent thermal conductivity of multilayer insulation for a cryogenic system. The variation of thermal conductivity with residual gas pressure is studied and the optimum vacuum for good insulating performance is determined. Evaporation loss technique for heat-inleak determination is employed. (author)

Thermal conductivity of different colored compomers.

Science.gov (United States)

Guler, Cigdem; Keles, Ali; Guler, Mehmet S; Karagoz, Sendogan; Cora, Ömer N; Keskin, Gul

2017-11-10

Compomers are mostly used in primary dentition. The thermal conductivity properties of traditional or colored compomers have not been investigated in detail so far. The aim of this in vitro study was to assess and compare the thermal conductivities of traditional and colored compomers. Two sets of compomers - namely, Twinky Star (available in berry, lemon, green, silver, blue, pink, gold and orange shades) and Dyract Extra (available in B1, A3 and A2 shades) - were included in this study. All of the traditional and colored compomers were applied to standard molds and polymerized according to the manufacturers' instructions. Three samples were prepared from each compomer. Measurements were conducted using a heat conduction test setup, and the coefficient of heat conductivity was calculated for each material. The heat conductivity coefficients were statistically analyzed using Kruskal-Wallis and Duncan tests. Uncertainty analysis was also performed on the calculated coefficients of heat conductivity. Statistically significant differences were found (p<0.05) between the thermal conductivity properties of the traditional and colored compomers examined. Among all of the tested compomers, the silver shade compomer exhibited the highest coefficient of heat conductivity (p<0.05), while the berry shade exhibited the lowest coefficient (p<0.05). Uncertainty analyses revealed that 6 out of 11 samples showed significant differences. The silver shade compomer should be avoided in deep cavities. The material properties could be improved for colored compomers.

Passive thermal management system for downhole electronics in harsh thermal environments

International Nuclear Information System (INIS)

Shang, Bofeng; Ma, Yupu; Hu, Run; Yuan, Chao; Hu, Jinyan; Luo, Xiaobing

2017-01-01

Highlights: • A passive thermal management system is proposed for downhole electronics. • Electronics temperature can be maintained within 125 °C for six-hour operating time. • The result shows potential application for the logging tool in oil and gas industry. - Abstract: The performance and reliability of downhole electronics will degrade in high temperature environments. Various active cooling techniques have been proposed for thermal management of such systems. However, these techniques require additional power input, cooling liquids and other moving components which complicate the system. This study presents a passive Thermal Management System (TMS) for downhole electronics. The TMS includes a vacuum flask, Phase Change Material (PCM) and heat pipes. The thermal characteristics of the TMS is evaluated experimentally. The results show that the system maintains equipment temperatures below 125 °C for a six-hour operating period in a 200 °C downhole environment, which will effectively protect the downhole electronics.

Development of In-plane Thermal Conductivity Calculation Methods in Thin Films

Directory of Open Access Journals (Sweden)

A. A. Barinov

2017-01-01

Full Text Available The future nanoelectronics development involves using the smaller- -and-smaller-sized circuit components based on the micro- and nanostructures. This causes a growth of the specific heat flows up to 100 W/cm2. Since performance of electronic devices is strongly dependent on the temperature there is a challenge to create the heat transfer models, which take into account the size effect and ensure a reliable estimate of the thermal conductivity. This is one of the crucial tasks for development of new generations of integrated circuits.The paper studies heat transfer processes using the silicon thin films as an example. Thermal conductivity calculations are performed taking into account the influence of the classical size effect in the context of the Sondheimer model based on the solution of the Boltzmann transport equation.The paper, for the first time, presents and considers the influence of various factors on the thermal conductivity of thin films, namely temperature, film thickness, polarization of the phonon waves (transverse and longitudinal, velocity and relaxation time versus frequency for the phonons of different wave types.Based on the analysis, three models with different accuracy are created to estimate the influence of detailing processes under consideration on the thermal conductivity in a wide range of temperatures (from 10 K to 450 К and film thickness (from 10 nm to 100 µm.So in the model I for the first time in calculating thermal conductivity of thin films we properly and circumstantially take into account the dependence of the velocity and the relaxation time of phonons on the frequency and polarization. The obtained values are in a good agreement with available experimental data and theoretical models of other authors. In the following models we use few average methods for relaxation times and velocities, which leads to significant reduction in calculating accuracy up to the values exceeding 100%.Therefore, when calculating

Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method

Energy Technology Data Exchange (ETDEWEB)

Jiang, Longtao, E-mail: longtaojiang@163.com [Department of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Wang, Pingping [Department of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Xiu, Ziyang [Skate Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 (China); Chen, Guoqin [Department of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Lin, Xiu [Heilongjiang Academy of Industrial Technology, Harbin 150001 (China); Dai, Chen; Wu, Gaohui [Department of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China)

2015-08-15

In this work, aluminum matrix composites reinforced with diamond particles (diamond/aluminum composites) were fabricated by squeeze casting method. The material exhibited a thermal conductivity as high as 613 W / (m · K). The obtained composites were investigated by scanning electron microscope and transmission electron microscope in terms of the (100) and (111) facets of diamond particles. The diamond particles were observed to be homogeneously distributed in the aluminum matrix. The diamond{sub (111)}/Al interface was found to be devoid of reaction products. While at the diamond{sub (100)}/Al interface, large-sized aluminum carbides (Al{sub 4}C{sub 3}) with twin-crystal structure were identified. The interfacial characteristics were believed to be responsible for the excellent thermal conductivity of the material. - Graphical abstract: Display Omitted - Highlights: • Squeeze casting method was introduced to fabricate diamond/Al composite. • Sound interfacial bonding with excellent thermal conductivity was produced. • Diamond{sub (111)}/ aluminum interface was firstly characterized by TEM/HRTEM. • Physical combination was the controlling bonding for diamond{sub (111)}/aluminum. • The growth mechanism of Al{sub 4}C{sub 3} was analyzed by crystallography theory.

Electrical and thermal conductivities in dense plasmas

Energy Technology Data Exchange (ETDEWEB)

Faussurier, G., E-mail: gerald.faussurier@cea.fr; Blancard, C.; Combis, P.; Videau, L. [CEA, DAM, DIF, F-91297 Arpajon (France)

2014-09-15

Expressions for the electrical and thermal conductivities in dense plasmas are derived combining the Chester-Thellung-Kubo-Greenwood approach and the Kramers approximation. The infrared divergence is removed assuming a Drude-like behaviour. An analytical expression is obtained for the Lorenz number that interpolates between the cold solid-state and the hot plasma phases. An expression for the electrical resistivity is proposed using the Ziman-Evans formula, from which the thermal conductivity can be deduced using the analytical expression for the Lorenz number. The present method can be used to estimate electrical and thermal conductivities of mixtures. Comparisons with experiment and quantum molecular dynamics simulations are done.

UJI KONDUKTIVITAS TERMAL PADA DAUN BAYAM DENGAN MENGGUNAKAN THERMAL CONDUCTIVITY APPARATUS

OpenAIRE

Firmansyah, Firmansyah; Syafutra, Heriyanto; Sidikrubadi, Sidikrubadi; Irzaman, Irzaman

2017-01-01

Abstract Has successfully tested thermal conductivity on spinach leaves by using Thermal Conductivity Apparatus. Thermal conductivity Apparatus assisted with Steam generator, Caliper, Micrometer, and iron. The thermal conductivity value of spinach leaves is 0.5208 watts / (m.K). This thermal conductivity test on foliage, fruits using Thermal Conductivity Apparatus are very easy to do in Basic Physics Laboratory by physics study program students in Indonesia. Keywords: Thermal Conductivi...

Remarkable reduction of thermal conductivity in phosphorene phononic crystal

International Nuclear Information System (INIS)

Xu, Wen; Zhang, Gang

2016-01-01

Phosphorene has received much attention due to its interesting physical and chemical properties, and its potential applications such as thermoelectricity. In thermoelectric applications, low thermal conductivity is essential for achieving a high figure of merit. In this work, we propose to reduce the thermal conductivity of phosphorene by adopting the phononic crystal structure, phosphorene nanomesh. With equilibrium molecular dynamics simulations, we find that the thermal conductivity is remarkably reduced in the phononic crystal. Our analysis shows that the reduction is due to the depressed phonon group velocities induced by Brillouin zone folding, and the reduced phonon lifetimes in the phononic crystal. Interestingly, it is found that the anisotropy ratio of thermal conductivity could be tuned by the ‘non-square’ pores in the phononic crystal, as the phonon group velocities in the direction with larger projection of pores is more severely suppressed, leading to greater reduction of thermal conductivity in this direction. Our work provides deep insight into thermal transport in phononic crystals and proposes a new strategy to reduce the thermal conductivity of monolayer phosphorene. (paper)

Design and Construction of a Thermal Contact Resistance and Thermal Conductivity Measurement System

Science.gov (United States)

2015-09-01

thank my Mom, Dad , Allison, Jessica, and father-in-law, Tom, for always being there to listen and encourage me. xxiv THIS PAGE INTENTIONALLY...thermal conductivity is temperature measurement inaccuracies. A probe constructed of a poor thermally conductive material when inserted into a hot...interface- resistance-measurement-using-a-transient-method/ [26] H. Fukushima, L. T. Drzal, B. P. Rook and M. J. Rich , “Thermal conductivity of exfoliated

Simultaneous measurements of thermal conductivity and electrical conductivity of micro-machined Silicon films

International Nuclear Information System (INIS)

Hagino, H; Kawahara, Y; Goto, A; Miyazaki, K

2012-01-01

The in-plane effective thermal conductivity of free-standing Si thin films with periodic micropores was measured at -100 to 0 °C. The Si thin films with micropores were prepared from silicon-on-insulator (SOI) wafers by standard microfabrication processes. The dimensions of the free-standing Si thin films were 200μm×150μm×2 μm, with staggered 4 μm pores having an average pitch of 4 mm. The Si thin film serves both as a heater and thermometer. The average temperature rise of the thin film is a function of its in-plane thermal conductivity. The effective thermal conductivity was calculated using a simple one-dimensional heat conduction model. The measured thermal conductivity was much lower than that expected based on classical model evaluations. A significant phonon size effect was observed even in the microsized structures, and the mean free path for phonons is very long even at the room temperature.

Thermal conductivity prediction of closed-cell aluminum alloy considering micropore effect

Directory of Open Access Journals (Sweden)

Donghui Zhang

2015-02-01

Full Text Available Large quantities of micro-scale pores are observed in the matrix of closed-cell aluminum alloy by scanning electron microscope, which indicates the dual-scale pore characteristics. Corresponding to this kind of special structural morphology, a new kind of dual-scale method is proposed to estimate its effective thermal conductivity. Comparing with the experimental results, the article puts forward the view that the prediction accuracy can be improved by the dual-scale method greatly. Different empirical formulas are also investigated in detail. It provides a new method for thermal properties estimation and makes preparation for more suitable empirical formula for closed-cell aluminum alloy.

Effects of nano-void density, size and spatial population on thermal conductivity: a case study of GaN crystal

International Nuclear Information System (INIS)

Zhou, X W; Jones, R E

2012-01-01

The thermal conductivity of a crystal is sensitive to the presence of surfaces and nanoscale defects. While this opens tremendous opportunities to tailor thermal conductivity, true ‘phonon engineering’ of nanocrystals for a specific electronic or thermoelectric application can only be achieved when the dependence of thermal conductivity on the defect density, size and spatial population is understood and quantified. Unfortunately, experimental studies of the effects of nanoscale defects are quite challenging. While molecular dynamics simulations are effective in calculating thermal conductivity, the defect density range that can be explored with feasible computing resources is unrealistically high. As a result, previous work has not generated a fully detailed understanding of the dependence of thermal conductivity on nanoscale defects. Using GaN as an example, we have combined a physically motivated analytical model and highly converged large-scale molecular dynamics simulations to study the effects of defects on thermal conductivity. An analytical expression for thermal conductivity as a function of void density, size, and population has been derived and corroborated with the model, simulations, and experiments. (paper)

Advanced thermal management technologies for defense electronics

Science.gov (United States)

Bloschock, Kristen P.; Bar-Cohen, Avram

2012-05-01

Thermal management technology plays a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. For the past decade, and particularly, the past 4 years, the Defense Advanced Research Projects Agency (DARPA) has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT). An overview of the TMT program will be presented with emphasis on the goals and status of these efforts relative to the current State-of-the-Art. The presentation will close with future challenges and opportunities in the thermal management of defense electronics.

Study of thermal conductivity of multilayer insulation

Energy Technology Data Exchange (ETDEWEB)

Dutta, D; Sundaram, S; Nath, G K; Sethuram, N P; Chandrasekharan, T; Varadarajan, T G [Heavy Water Division, Bhabha Atomic Research Centre, Mumbai (India)

1994-06-01

This paper presents experimental determination of the apparent thermal conductivity of multilayer insulation for a cryogenic system. The variation of thermal conductivity with residual gas pressure is studied and the optimum vacuum for good insulating performance is determined. Evaporation loss technique for heat-inleak determination is employed. (author). 3 refs., 3 figs.

Round robin testing of thermal conductivity reference materials

International Nuclear Information System (INIS)

Hulstrom, L.C.; Tye, R.P.; Smith, S.E.

1985-07-01

The Basalt Waste Isolation Project (BWIP), operated by Rockwell Hanford Operations, has a need to determine the thermal properties of basalt in the region being considered for a nuclear waste repository in basalt. Experimental data on thermal conductivity and its variation with temperature are information required for the characterization of basalt. To establish thermal conductivity values for the reference materials, an interlaboratory measurements program was undertaken. The program was planned to meet the objectives of performing an experimental characterization of the new stock and providing a detailed analysis of the results such that reference values of thermal conductivity could be determined. This program of measurements of the thermal conductivity of Pyrex 7740 and Pyroceram 9606 has produced recommended values that are within +- 1% of those accepted previously. These measurements together with those of density indicate that the present lots of material are similar to those previously available. Pyrex 7740 and Pyroceram 9606 can continue to be used with confidence as thermal conductivity reference materials for studies on rocks and minerals and other materials of similar thermal conductivity. The uncertainty range for Pyrex 7740 and Pyroceram 9606 up to 300 0 C is +- 10.3% and +- 5.6%, respectively. This range is similar to that indicated for the previously recommended values proposed some 18 years ago. It would appear that the overall state of the art in thermal conductivity measurements for materials in this range has changed little in the intervening years. The above uncertainties, which would have been greater had not three data sets been eliminated, are greater than those which are normally claimed for each individual method. Analyses of these differences through refinements in techniques and additional measurements to higher temperatures are required. 13 refs., 7 figs., 4 tabs

Thermal conductivity of highly porous mullite material

International Nuclear Information System (INIS)

Barea, Rafael; Osendi, Maria Isabel; Ferreira, Jose M.F.; Miranzo, Pilar

2005-01-01

The thermal diffusivity of highly porous mullite materials (35-60 vol.% porosity) has been measured up to 1000 deg C by the laser flash method. These materials were fabricated by a direct consolidation method based on the swelling properties of starch granules in concentrated aqueous suspensions and showed mainly spherical shaped pores of about 30 μm in diameter. From the point of view of heat conduction, they behave as a bi-phase material of voids dispersed in the continuous mullite matrix. The temperature dependence of thermal conductivity for the different porosities was modeled by a simple equation that considers the contribution to heat conduction of the mullite matrix and the gas inside the pores, as well as the radiation. The thermal conductivity of the matrix was taken from the measurements done in a dense mullite while the conductivity in the voids was assumed to be that of the testing atmosphere

Reduced thermal conductivity of isotopically modulated silicon multilayer structures

DEFF Research Database (Denmark)

Bracht, H.; Wehmeier, N.; Eon, S.

2012-01-01

We report measurements of the thermal conductivity of isotopically modulated silicon that consists of alternating layers of highly enriched silicon-28 and silicon-29. A reduced thermal conductivity of the isotopically modulated silicon compared to natural silicon was measured by means of time......-resolved x-ray scattering. Comparison of the experimental results to numerical solutions of the corresponding heat diffusion equations reveals a factor of three lower thermal conductivity of the isotope structure compared to natural Si. Our results demonstrate that the thermal conductivity of silicon can...

Thermal conductivity of polymer composites with oriented boron nitride

International Nuclear Information System (INIS)

Ahn, Hong Jun; Eoh, Young Jun; Park, Sung Dae; Kim, Eung Soo

2014-01-01

Highlights: • Thermal conductivity depended on the orientation of BN in the polymer matrices. • Hexagonal boron nitride (BN) particles were treated by C 27 H 27 N 3 O 2 and C 14 H 6 O 8 . • Amphiphilic-agent-treated BN particles are more easily oriented in the composite. • BN/PVA composites with C 14 H 6 O 8 -treated BN showed the highest thermal conductivity. • Thermal conductivity of the composites was compared with several theoretical models. - Abstract: Thermal conductivity of boron nitride (BN) with polyvinyl alcohol (PVA) and/or polyvinyl butyral (PVB) was investigated as a function of the degree of BN orientation, the numbers of hydroxyl groups in the polymer matrices and the amphiphilic agents used. The composites with in-plane orientation of BN showed a higher thermal conductivity than the composites with out-of-plane orientation of BN due to the increase of thermal pathway. For a given BN content, the composites with in-plane orientation of BN/PVA showed higher thermal conductivity than the composites with in-plane orientation of BN/PVB. This result could be attributed to the improved degree of orientation of BN, caused by a larger number of hydroxyl groups being present. Those treated with C 14 H 6 O 8 amphiphilic agent demonstrated a higher thermal conductivity than those treated by C 27 H 27 N 3 O 2 . The measured thermal conductivity of the composites was compared with that predicted by the several theoretical models

Effect of Microstructure on the Thermal Conductivity of Plasma Sprayed Y2O3 Stabilized Zirconia (8% YSZ

Directory of Open Access Journals (Sweden)

Ningning Hu

2017-11-01

Full Text Available In this paper, the effect of microstructure on the thermal conductivity of plasma-sprayed Y2O3 stabilized ZrO2 (YSZ thermal barrier coatings (TBCs is investigated. Nine freestanding samples deposited on aluminum alloys are studied. Cross-section morphology such as pores, cracks, m-phase content, grain boundary density of the coated samples are examined by scanning electron microscopy (SEM and electron back-scattered diffraction (EBSD. Multiple linear regressions are used to develop quantitative models that describe the relationship between the particle parameters, m-phase content and features of the microstructure such as porosity, crack-porosity, and the length density of small and big angle-cracks. Moreover, the relationship between the microstructure and thermal conductivity is investigated. Results reveal that the thermal conductivity of the coating is mainly determined by the microstructure and grain boundary density at room temperature (25 °C, and by the length density of big-angle-crack, monoclinic phase content and grain boundary density at high temperature (1200 °C.

Hyper-resistivity and electron thermal conductivity due to destroyed magnetic surfaces in axisymmetric plasma equilibria

Energy Technology Data Exchange (ETDEWEB)

Weening, R. H. [Department of Radiologic Sciences, Thomas Jefferson University, 901 Walnut Street, Philadelphia, Pennsylvania 19107-5233 (United States)

2012-06-15

In order to model the effects of small-scale current-driven magnetic fluctuations in a mean-field theoretical description of a large-scale plasma magnetic field B(x,t), a space and time dependent hyper-resistivity {Lambda}(x,t) can be incorporated into the Ohm's law for the parallel electric field E Dot-Operator B. Using Boozer coordinates, a theoretical method is presented that allows for a determination of the hyper-resistivity {Lambda}({psi}) functional dependence on the toroidal magnetic flux {psi} for arbitrary experimental steady-state Grad-Shafranov axisymmetric plasma equilibria, if values are given for the parallel plasma resistivity {eta}({psi}) and the local distribution of any auxiliary plasma current. Heat transport in regions of plasma magnetic surfaces destroyed by resistive tearing modes can then be modeled by an electron thermal conductivity k{sub e}({psi})=({epsilon}{sub 0}{sup 2}m{sub e}/e{sup 2}){Lambda}({psi}), where e and m{sub e} are the electron charge and mass, respectively, while {epsilon}{sub 0} is the permittivity of free space. An important result obtained for axisymmetric plasma equilibria is that the {psi}{psi}-component of the metric tensor of Boozer coordinates is given by the relation g{sup {psi}{psi}}({psi}){identical_to}{nabla}{psi} Dot-Operator {nabla}{psi}=[{mu}{sub 0}G({psi})][{mu}{sub 0}I({psi})]/{iota}({psi}), with {mu}{sub 0} the permeability of free space, G({psi}) the poloidal current outside a magnetic surface, I({psi}) the toroidal current inside a magnetic surface, and {iota}({psi}) the rotational transform.

Gas storage carbon with enhanced thermal conductivity

Science.gov (United States)

Burchell, Timothy D.; Rogers, Michael Ray; Judkins, Roddie R.

2000-01-01

A carbon fiber carbon matrix hybrid adsorbent monolith with enhanced thermal conductivity for storing and releasing gas through adsorption and desorption is disclosed. The heat of adsorption of the gas species being adsorbed is sufficiently large to cause hybrid monolith heating during adsorption and hybrid monolith cooling during desorption which significantly reduces the storage capacity of the hybrid monolith, or efficiency and economics of a gas separation process. The extent of this phenomenon depends, to a large extent, on the thermal conductivity of the adsorbent hybrid monolith. This invention is a hybrid version of a carbon fiber monolith, which offers significant enhancements to thermal conductivity and potential for improved gas separation and storage systems.

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Science.gov (United States)

Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E.

2018-03-27

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

In-plane and cross-plane thermal conductivities of molybdenum disulfide

International Nuclear Information System (INIS)

Ding, Zhiwei; Pei, Qing-Xiang; Zhang, Yong-Wei; Jiang, Jin-Wu

2015-01-01

We investigate the in-plane and cross-plane thermal conductivities of molybdenum disulfide (MoS 2 ) using non-equilibrium molecular dynamics simulations. We find that the in-plane thermal conductivity of monolayer MoS 2 is about 19.76 W mK −1 . Interestingly, the in-plane thermal conductivity of multilayer MoS 2 is insensitive to the number of layers, which is in strong contrast to the in-plane thermal conductivity of graphene where the interlayer interaction strongly affects the in-plane thermal conductivity. This layer number insensitivity is attributable to the finite energy gap in the phonon spectrum of MoS 2 , which makes the phonon–phonon scattering channel almost unchanged with increasing layer number. For the cross-plane thermal transport, we find that the cross-plane thermal conductivity of multilayer MoS 2 can be effectively tuned by applying cross-plane strain. More specifically, a 10% cross-plane compressive strain can enhance the thermal conductivity by a factor of 10, while a 5% cross-plane tensile strain can reduce the thermal conductivity by 90%. Our findings are important for thermal management in MoS 2 based nanodevices and for thermoelectric applications of MoS 2 . (paper)

Discussion on the thermal conductivity enhancement of nanofluids

Science.gov (United States)

2011-01-01

Increasing interests have been paid to nanofluids because of the intriguing heat transfer enhancement performances presented by this kind of promising heat transfer media. We produced a series of nanofluids and measured their thermal conductivities. In this article, we discussed the measurements and the enhancements of the thermal conductivity of a variety of nanofluids. The base fluids used included those that are most employed heat transfer fluids, such as deionized water (DW), ethylene glycol (EG), glycerol, silicone oil, and the binary mixture of DW and EG. Various nanoparticles (NPs) involving Al2O3 NPs with different sizes, SiC NPs with different shapes, MgO NPs, ZnO NPs, SiO2 NPs, Fe3O4 NPs, TiO2 NPs, diamond NPs, and carbon nanotubes with different pretreatments were used as additives. Our findings demonstrated that the thermal conductivity enhancements of nanofluids could be influenced by multi-faceted factors including the volume fraction of the dispersed NPs, the tested temperature, the thermal conductivity of the base fluid, the size of the dispersed NPs, the pretreatment process, and the additives of the fluids. The thermal transport mechanisms in nanofluids were further discussed, and the promising approaches for optimizing the thermal conductivity of nanofluids have been proposed. PMID:21711638

Enhancing the Electronic Conductivity of Vanadium-tellurite Glasses by Tuning the Redox State

DEFF Research Database (Denmark)

Kjeldsen, Jonas; Yue, Yuanzheng

Transition metal oxides are used in a variety of electronic purposes, e.g., vanadium tellurite as cathode material in high-power demanding batteries. By tuning the redox state of vanadium, it is possible to achieve a lower internal resistance within the entire battery unit, thus a higher capacity....... In this work we vary the redox state of a given vanadium tellurite system by performing post heat-treatment in controlled atmosphere. This process is in theory not limited only to varying electronic conductivity, but also varying the glass structure, and hence, changing properties of the glasses, e.g, thermal...... and mechanical properties. Finally we give insight into the relation between the redox state and electronic conductivity....

Significant Enhancement of Thermal Conductivity in Nanofibrillated Cellulose Films with Low Mass Fraction of Nanodiamond.

Science.gov (United States)

Song, Na; Cui, Siqi; Hou, Xingshuang; Ding, Peng; Shi, Liyi

2017-11-22

High thermal conductive nanofibrillated cellulose (NFC) hybrid films based on nanodiamond (ND) were fabricated by a facile vacuum filtration technique. In this issue, the thermal conductivity (TC) on the in-plane direction of the NFC/ND hybrid film had a significant enhancement of 775.2% at a comparatively low ND content (0.5 wt %). The NFC not only helps ND to disperse in the aqueous medium stably but also plays a positive role in the formation of the hierarchical structure. ND could form a thermal conductive pathway in the hierarchical structures under the intermolecular hydrogen bonds. Moreover, the hybrid films composed of zero-dimensional ND and one-dimensional NFC exhibit remarkable mechanical properties and optical transparency. The NFC/ND hybrid films possessing superior TC, mechanical properties, and optical transparency can open applications for portable electronic equipment as a lateral heat spreader.

Hydroxylated graphene-based flexible carbon film with ultrahigh electrical and thermal conductivity.

Science.gov (United States)

Ding, Jiheng; Ur Rahman, Obaid; Zhao, Hongran; Peng, Wanjun; Dou, Huimin; Chen, Hao; Yu, Haibin

2017-09-29

Graphene-based films are widely used in the electronics industry. Here, surface hydroxylated graphene sheets (HGS) have been synthesized from natural graphite (NG) by a rapid and efficient molten hydroxide-assisted exfoliation technique. This method enables preparation of aqueous dispersible graphene sheets with a high dispersed concentration (∼10.0 mg ml -1 ) and an extraordinary production yield (∼100%). The HGS dispersion was processed into graphene flexible film (HGCF) through fast filtration, annealing treatment and mechanical compression. The HGS endows graphene flexible film with a high electrical conductivity of 11.5 × 10 4 S m -1 and a superior thermal conductivity of 1842 W m -1 K -1 . Simultaneously, the superflexible HGCF could endure 3000 repeated cycles of bending or folding. As a result, this graphene flexible film is expected to be integrated into electronic packaging and high-power electronics applications.

Quantum decoherence in electronic current flowing through carbon nanotubes induced by thermal atomic vibrations

Science.gov (United States)

Ishizeki, Keisuke; Sasaoka, Kenji; Konabe, Satoru; Souma, Satofumi; Yamamoto, Takahiro

2018-06-01

We theoretically investigate quantum decoherence in electronic currents flowing through metallic carbon nanotubes caused by thermal atomic vibrations using the time-dependent Schrödinger equation for an open system. We reveal that the quantum coherence of conduction electrons decays exponentially with tube length at a fixed temperature, and that the decay rate increases with temperature. We also find that the phase relaxation length due to the thermal atomic vibrations is inversely proportional to temperature.

Mixed ionic-electronic conduction in Ni doped lanthanum gallate perovskites

Energy Technology Data Exchange (ETDEWEB)

Long, N.J.; Tuller, H.L.

1998-07-01

Lanthanum gallate is a promising material for monolithic fuel cells or oxygen pumps, i.e., one in which the electrolyte and electrodes are formed from a common phase. The authors have investigated La{sub 1{minus}x}Sr{sub x}Ga{sub 1{minus}y}Ni{sub y}O{sub 3} (LSGN{sub x{minus}y}) with x = 0.1 and y = 0.2 and 0.5 as a potential cathode material for such an electrochemical device. The {sigma}(PO{sub 2},T) for LSGN{sub 10--20} points to a p-type electronic conductivity at high PO{sub 2} and predominantly ionic conductivity at low PO{sub 2}. LSGN{sub 10-50} has an electronic conductivity suitable for SOFC applications of approximately 50 S/cm in air at high temperature. AC impedance spectroscopy on an electron blocking cell of the form M/LSG/LSGN/LSG/M was used to isolate the ionic conductivity in the LSGN{sub 10--20} material. The ionic conductivity was found to have a similar magnitude and activation energy to that of undoped LSG material with {sigma}{sub i} = 0.12 S/cm at 800 C and E{sub A} = 1.0 {+-} 0.1 eV. Thermal expansion measurements on the LSGN materials were characterized as a function of temperature and dopant level and were found to match that of the electrolyte under operating conditions.

Thermal conductivity of mesoporous films measured by Raman spectroscopy

Science.gov (United States)

Stoib, B.; Filser, S.; Petermann, N.; Wiggers, H.; Stutzmann, M.; Brandt, M. S.

2014-04-01

We measure the in-plane thermal conductance of mesoporous Ge and SiGe thin films using the Raman-shift method and, based on a finite differences simulation accounting for the geometry of the sample, extract the in-plane thermal conductivity. For a suspended thin film of laser-sintered SiGe nanoparticles doped with phosphorus, we find an effective in-plane thermal conductivity of 0.05 W/m K in vacuum for a temperature difference of 400 K and a mean temperature of 500 K. Under similar conditions, the effective in-plane thermal conductivity of a laser-sintered undoped Ge nanoparticle film is 0.5 W/m K. Accounting for a porosity of approximately 50%, the normalized thermal conductivities are 0.1 W/m K and 1 W/m K, respectively. The thermoelectric performance is discussed, considering that the electrical in-plane conductivity is also affected by the mesoporosity.

Effective thermal conductivity of advanced ceramic breeder pebble beds

Energy Technology Data Exchange (ETDEWEB)

Pupeschi, S., E-mail: simone.pupeschi@kit.edu; Knitter, R.; Kamlah, M.

2017-03-15

As the knowledge of the effective thermal conductivity of ceramic breeder pebble beds under fusion relevant conditions is essential for the development of solid breeder blanket concepts, the EU advanced and reference lithium orthosilicate material were investigated with a newly developed experimental setup based on the transient hot wire method. The effective thermal conductivity was investigated in the temperature range RT–700 °C. Experiments were performed in helium and air atmospheres in the pressure range 0.12–0.4 MPa (abs.) under a compressive load up to 6 MPa. Results show a negligible influence of the chemical composition of the solid material on the bed’s effective thermal conductivity. A severe reduction of the effective thermal conductivity was observed in air. In both atmospheres an increase of the effective thermal conductivity with the temperature was detected, while the influence of the compressive load was found to be small. A clear dependence of the effective thermal conductivity on the pressure of the filling gas was observed in helium in contrast to air, where the pressure dependence was drastically reduced.

Thermal conductivity of multibarrier waste form components

International Nuclear Information System (INIS)

Lokken, R.O.

1981-01-01

The multiple barrier concept of radioactive waste immobilization under investigation at Pacific Northwest Laboratory (PNL) uses composite waste forms which exhibit enhanced inertness through improvements in thermal stability, mechanical strength, and leachability by the use of coatings and metal matrices. Since excessive heat may be generated by radioactive decay of the waste, the thermal conductivity of the various barriers, and more importantly of the composite, becomes an important parameter in design criteria. This report presents results of thermal conductivity measurements on 21 various glass, ceramic, metal and composite materials used in multibarrier waste forms development

A Numerical Study on Phonon Spectral Contributions to Thermal Conduction in Silicon-on-Insulator Transistor Using Electron-Phonon Interaction Model

Energy Technology Data Exchange (ETDEWEB)

Kang, Hyung-sun; Koh, Young Ha; Jin, Jae Sik [Chosun College of Science and Technology, Gwangju (Korea, Republic of)

2017-06-15

The aim of this study is to understand the phonon transfer characteristics of a silicon thin film transistor. For this purpose, the Joule heating mechanism was considered through the electron-phonon interaction model whose validation has been done. The phonon transport characteristics were investigated in terms of phonon mean free path for the variations in the device power and silicon layer thickness from 41 nm to 177 nm. The results may be used for developing the thermal design strategy for achieving reliability and efficiency of the silicon-on-insulator (SOI) transistor, further, they will increase the understanding of heat conduction in SOI systems, which are very important in the semiconductor industry and the nano-fabrication technology.

Thermal conductivity tests on buffermasses of bentonite/silt

International Nuclear Information System (INIS)

Knutsson, S.

1977-09-01

The investigation concerns the thermal conductivity of the bentonite/quartz buffer mass suggested as embedding substance for radioactive canisters. The first part presents the theoretical relationships associated with the various heat transfer mechanisms in moist granular materials. Chapter 3 describes the author's experimental determination of the thermal conductivity of the buffer mass. The tested mass consisted of 10 percent (by weight) bentonite and 90 percent natural silt. Four tests were made with different water content values and degree of water saturation. A comparison between the measured and calculated thermal conductivities is given. It is shown that the conductivity can be calculated with an accuracy of +-20 percent. (author)

Thermal conductivity of niobium single crystals in a magnetic field

International Nuclear Information System (INIS)

Gladun, C.; Vinzelberg, H.

1980-01-01

The thermal conductivity in longitudinal magnetic fields up to 5 T and in the temperature range 3.5 to 15 K is measured in two high purity niobium single crystals having residual resistivity ratios of 22700 and 19200 and orientations of the rod axis [110] and [100]. The investigations show that by means of the longitudinal magnetic field the thermal conductivity may decrease only to a limiting value. In the crystal directions [110] and [100] for the ratio of the thermal conductivity in zero field and the thermal conductivity in the saturation field the temperature-independent factors 1.92 and 1.27, respectively, are determined. With the aid of these factors the thermal conductivity in the normal state is evaluated from the measured values of thermal conductivity below Tsub(c) in the magnetic field. The different conduction and scattering mechanisms are discussed. (author)

Minimized thermal conductivity in highly stable thermal barrier W/ZrO{sub 2} multilayers

Energy Technology Data Exchange (ETDEWEB)

Doering, Florian; Major, Anna; Eberl, Christian; Krebs, Hans-Ulrich [University of Goettingen, Institut fuer Materialphysik, Goettingen (Germany)

2016-10-15

Nanoscale thin-film multilayer materials are of great research interest since their large number of interfaces can strongly hinder phonon propagation and lead to a minimized thermal conductivity. When such materials provide a sufficiently small thermal conductivity and feature in addition also a high thermal stability, they would be possible candidates for high-temperature applications such as thermal barrier coatings. For this article, we have used pulsed laser deposition in order to fabricate thin multilayers out of the thermal barrier material ZrO{sub 2} in combination with W, which has both a high melting point and high density. Layer thicknesses were designed such that bulk thermal conductivity is governed by the low value of ZrO{sub 2}, while ultrathin W blocking layers provide a high number of interfaces. By this phonon scattering, reflection and shortening of mean free path lead to a significant reduction in overall thermal conductivity even below the already low value of ZrO{sub 2}. In addition to this, X-ray reflectivity measurements were taken showing strong Bragg peaks even after annealing such multilayers at 1300 K. Those results identify W/ZrO{sub 2} multilayers as desired thermally stable, low-conductivity materials. (orig.)

Effective thermal conductivity of nanofluids: the effects of microstructure

International Nuclear Information System (INIS)

Fan Jing; Wang Liqiu

2010-01-01

We examine numerically the effects of particle-fluid thermal conductivity ratio, particle volume fraction, particle size distribution and particle aggregation on macroscale thermal properties for seven kinds of two-dimensional nanofluids. The results show that the radius of gyration and the non-dimensional particle-fluid interfacial area are two important parameters in characterizing the geometrical structure of nanoparticles. A non-uniform particle size is found to be unfavourable for the conductivity enhancement, while particle-aggregation benefits the enhancement especially when the radius of gyration of aggregates is large. Without considering the interfacial thermal resistance, a larger non-dimensional particle-fluid interfacial area between the base fluid and the nanoparticles is also desirable for enhancing thermal conductivity. The nanofluids with nanoparticles of connected cross-shape show a much higher (lower) effective thermal conductivity when the particle-fluid conductivity ratio is larger (smaller) than 1.

High-temperature thermal conductivity of uranium chromite and uranium niobate

International Nuclear Information System (INIS)

Fedoseev, D.V.; Varshavskaya, I.G.; Lavrent'ev, A.V.; Oziraner, S.N.; Kuznetsova, D.G.

1979-01-01

The technique of determining thermal conductivity coefficient of uranium niobate and uranium chromite on heating with laser radiation is described. Determined is the coefficient of free-convective heat transfer (with provision for a conduction component) by means of a standard specimen. The thermal conductivity coefficients of uranium chromite and niobate were measured in the 1300-1700 K temperature range. The results are presented in a diagram form. It has been calculated, that the thermal conductivity coefficient for uranium niobate specimens is greater in comparison with uranium chromite specimens. The thermal conductivity coefficients of the materials mentioned depend on temperature very slightly. Thermal conductivity of the materials considerably depends on their porosity. The specimens under investigation were fabricated by the pressing method and had the following porosity: uranium chromite - 30 %, uranium niobate - 10 %. Calculation results show, that thermal conductivity of dense uranium chromite is higher than thermal conductivity of dense uranium niobate. The experimental error equals approximately 20 %, that is mainly due to the error of measuring the temperature equal to +-25 deg, with a micropyrometer

Controlling thermal chaos in the mantle by positive feedback from radiative thermal conductivity

Directory of Open Access Journals (Sweden)

F. Dubuffet

2002-01-01

Full Text Available The thermal conductivity of mantle materials has two components, the lattice component klat from phonons and the radiative component krad due to photons. These two contributions of variable thermal conductivity have a nonlinear dependence in the temperature, thus endowing the temperature equation in mantle convection with a strongly nonlinear character. The temperature derivatives of these two mechanisms have different signs, with ∂klat /∂T negative and dkrad /dT positive. This offers the possibility for the radiative conductivity to control the chaotic boundary layer instabilities developed in the deep mantle. We have parameterized the weight factor between krad and klat with a dimensionless parameter f , where f = 1 corresponds to the reference conductivity model. We have carried out two-dimensional, time-dependent calculations for variable thermal conductivity but constant viscosity in an aspect-ratio 6 box for surface Rayleigh numbers between 106 and 5 × 106. The averaged Péclet numbers of these flows lie between 200 and 2000. Along the boundary in f separating the chaotic and steady-state solutions, the number decreases and the Nusselt number increases with internal heating, illustrating the feedback between internal heating and radiative thermal conductivity. For purely basal heating situation, the time-dependent chaotic flows become stabilized for values of f of between 1.5 and 2. The bottom thermal boundary layer thickens and the surface heat flow increases with larger amounts of radiative conductivity. For magnitudes of internal heating characteristic of a chondritic mantle, much larger values of f , exceeding 10, are required to quench the bottom boundary layer instabilities. By isolating the individual conductive mechanisms, we have ascertained that the lattice conductivity is partly responsible for inducing boundary layer instabilities, while the radiative conductivity and purely depth-dependent conductivity exert a stabilizing

A recommendation for the thermal conductivity of oxide fuels

International Nuclear Information System (INIS)

Kang, K. H.; Ryu, H. J.; Song, K. C.; Yang, M. S.; Na, S. H.; Lee, Y. W.; Moon, H. S.; Kim, H. S.

2004-01-01

The thermal conductivity of nuclear fuel is one of the most important properties because it affects the fuel operating temperature. Therefore, it influences almost all the important processes occurred in nuclear fuel during irradiation, such as gas release, swelling and grain growth. The model of the thermal conductivity of nuclear fuel should be used in the codes to evaluate the performance of it analytically and be required in the nuclear fuel research and development. The thermal conductivity, k, of UO 2 depends on the deviation from stoichiometry, x, the burnup, b, and the fractional porosity, p, as well as the temperature, T: k = k(x, b, p, T), (1) Changes in thermal conductivity occur during irradiation because of fission-gas bubble formation, pores, cracks, fission product build-up and possible changes in the oxygen to uranium ratio (O/U). The dependence on temperature and porosity has been well studied and incorporated in computer codes used for the in-pile fuel behavior analysis. There are several studies on the effect of impurity on the thermal conductivity of UO 2 . In this paper, the variables affected on the thermal conductivity were studied. The available data of the thermal conductivity of UO 2 , UO 2+x , (U, Pu)O 2 , (U, Pu)O 2 and simulated fuel for irradiation fuel were reviewed and analyzed. The best models were recommended

Thermal conductivity measurements of Pacific illite sediment

International Nuclear Information System (INIS)

Hickox, C.E.; McVey, D.F.; Miller, J.B.; Olson, L.O.; Silva, A.J.

1986-01-01

Results are reported for effective thermal conductivity measurements performed in situ and in core samples of illite marine sediment. The measurements were obtained during a recent oceanographic expedition to a study site in the north central region of the Pacific Ocean. This study was undertaken in support of the US Subseabed Disposal Project, the purpose of which is to investigate the scientific feasibility of using the fine grained sediments of the sea floor as a repository for high level nuclear waste. In situ measurements were made and 1.5-meter long hydrostatic piston cores were taken, under remote control, from a platform that was lowered to the sea floor, 5844 m below sea level. The in situ measurement of thermal conductivity was made at a nominal depth of 80 cm below the sediment surface using a specially developed, line source, needle probe. Thermal conductivity measurements in three piston cores and one box core (obtained several kilometers from the study site) were made on shipboard using a miniature needle probe. The in situ thermal conductivity was approximately 0.91 W/m.K. Values determined from the cores were within the range 0.81 to 0.89 W/m.K

Model calculation of thermal conductivity in antiferromagnets

Energy Technology Data Exchange (ETDEWEB)

Mikhail, I.F.I., E-mail: ifi_mikhail@hotmail.com; Ismail, I.M.M.; Ameen, M.

2015-11-01

A theoretical study is given of thermal conductivity in antiferromagnetic materials. The study has the advantage that the three-phonon interactions as well as the magnon phonon interactions have been represented by model operators that preserve the important properties of the exact collision operators. A new expression for thermal conductivity has been derived that involves the same terms obtained in our previous work in addition to two new terms. These two terms represent the conservation and quasi-conservation of wavevector that occur in the three-phonon Normal and Umklapp processes respectively. They gave appreciable contributions to the thermal conductivity and have led to an excellent quantitative agreement with the experimental measurements of the antiferromagnet FeCl{sub 2}. - Highlights: • The Boltzmann equations of phonons and magnons in antiferromagnets have been studied. • Model operators have been used to represent the magnon–phonon and three-phonon interactions. • The models possess the same important properties as the exact operators. • A new expression for the thermal conductivity has been derived. • The results showed a good quantitative agreement with the experimental data of FeCl{sub 2}.

Study on thermal conductivity of HTR spherical fuel element matrix graphite

International Nuclear Information System (INIS)

Zhang Kaihong; Liu Xiaoxue; Zhao Hongsheng; Li Ziqiang; Tang Chunhe

2014-01-01

Taking the spherical fuel element matrix graphite ball samples as an example, this paper introduced the principle and method of laser thermal conductivity meter, as well as the specific heat capacity, and analyzed the effects of different test methods and sampling methods on the thermal conductivities at 1000 ℃ of graphite material. The experimental results show that the thermal conductivities of graphite materials tested by synchronous thermal analyzer combining with laser thermal conductivity meter were different from that directly by laser thermal conductivity meter, the former was more reliable and accurate than the later; When sampling from different positions, central samples had higher thermal conductivities than edging samples, which was related to the material density and porosity at the different locations; the thermal conductivities had obvious distinction between samples from different directions, which was because the layer structure of polycrystalline graphite preferred orientation under pressure, generally speaking, the thermal conductivities perpendicular to the molding direction were higher than that parallel to the molding direction. Besides this, the test results show that the thermal conductivities of all the graphite material samples were greater than 30 W/(m (K), achieving the thermal performance index of high temperature gas cooled reactor. (authors)