WorldWideScience

Sample records for density interconnect printed

  1. Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

    Science.gov (United States)

    de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

    2018-05-01

    We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

  2. Patterned electrodeposition of interconnects using microcontact printing

    NARCIS (Netherlands)

    Hovestad, A.; Rendering, H.; Maijenburg, A.W.

    2012-01-01

    Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of

  3. Laser printing of 3D metallic interconnects

    Science.gov (United States)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  4. Laser printed interconnects for flexible electronics

    Science.gov (United States)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  5. An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

    CERN Document Server

    Da Silva, Vitor; Watts, David; Van der Bij, Erik; Banhidi, Z; Berbiers, Julien; Lampl, W; Marchesotti, M; Rangod, Stephane; Sbrissa, E; Schuh, S; Voss, Rüdiger; Zhuravlov, V

    2004-01-01

    The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching instead of laser, plasma or other etching techniques and can be implemented in a chain production line. This results in an overall reduced operation and maintenance cost and a much shorter hole production time as compared with other microvia processes. copy Emerald Group Publishing Limited. 4 Refs.4 An essential part of the Muon Spectrometer of the ATLAS experiment is based on the Monitored Drift Tube (MDT) technology. About 1200 muon drift chambers are being built at 13 institutes all over the world. The MDT chambers require an exceptional mechanical construction accuracy of better than 20 mu m. A dedicated X-ray tomograph has been developed at CERN since 1996 to control the mechanical quality of the chambers. The...

  6. Design rules for vertical interconnections by reverse offset printing

    Science.gov (United States)

    Kusaka, Yasuyuki; Kanazawa, Shusuke; Ushijima, Hirobumi

    2018-03-01

    Formation of vertical interconnections by reverse offset printing was investigated, particularly focusing on the transfer step, in which an ink pattern is transferred from a polydimethylsiloxane (PDMS) sheet for the step coverage of contact holes. We systematically examined the coverage of contact holes made of a tapered photoresist layer by varying the hole size, the hole depth, PDMS elasticity, PDMS thickness, printing speed, and printing indentation depth. Successful ink filling was achieved when the PDMS was softer, and the optimal PDMS thickness varied depending on the size of the contact holes. This behaviour is related to the bell-type uplift deformation of incompressible PDMS, which can be described by contact mechanics numerical simulations. Based on direct observation of PDMS/resist-hole contact behaviour, the step coverage of contact holes typically involves two steps of contact area growth: (i) the PDMS first touches the bottom of the holes and then (ii) the contact area gradually and radially widens toward the tapered sidewall. From an engineering perspective, it is pointed out that mechanical synchronisation mismatch in the roll-to-sheet type printing invokes the cracking of ink layers at the edges of contact holes. According to the above design rule, ink filling into a contact hole with thickness of 2.5 µm and radius of 10 µm was achieved. Contact chain patterns with 1386 points of vertical interconnections with the square hole size of up to 10 µm successfully demonstrated the validity of the technique presented herein.

  7. High-density hybrid interconnect methodologies

    International Nuclear Information System (INIS)

    John, J.; Zimmermann, L.; Moor, P.De; Hoof, C.Van

    2003-01-01

    Full text: The presentation gives an overview of the state-of-the-art of hybrid integration and in particular the IMEC technological approaches that will be able to address future hybrid detector needs. The dense hybrid flip-chip integration of an array of detectors and its dedicated readout electronics can be achieved with a variety of solderbump techniques such as pure Indium or Indium alloys, Ph-In, Ni/PbSn, but also conducting polymers... Particularly for cooled applications or ultra-high density applications, Indium solderbump technology (electroplated or evaporated) is the method of choice. The state-of-the-art of solderbump technologies that are to a high degree independent of the underlying detector material will be presented and examples of interconnect densities between 5x1E4cm-2 and 1x1E6 cm-2 will be demonstrated. For several classes of detectors, flip-chip integration is not allowed since the detectors have to be illuminated from the top. This applies to image sensors for EUV applications such as GaN/AlGaN based detectors and to MEMS-based sensors. In such cases, the only viable interconnection method has to be through the (thinned) detector wafer followed by a solderbump-based integration. The approaches for dense and ultra-dense through-the-wafer interconnect 'vias' will be presented and wafer thinning approaches will be shown

  8. Interconnect patterns for printed organic thermoelectric devices with large fill factors

    Science.gov (United States)

    Gordiz, Kiarash; Menon, Akanksha K.; Yee, Shannon K.

    2017-09-01

    Organic materials can be printed into thermoelectric (TE) devices for low temperature energy harvesting applications. The output voltage of printed devices is often limited by (i) small temperature differences across the active materials attributed to small leg lengths and (ii) the lower Seebeck coefficient of organic materials compared to their inorganic counterparts. To increase the voltage, a large number of p- and n-type leg pairs is required for organic TEs; this, however, results in an increased interconnect resistance, which then limits the device output power. In this work, we discuss practical concepts to address this problem by positioning TE legs in a hexagonal closed-packed layout. This helps achieve higher fill factors (˜91%) than conventional inorganic devices (˜25%), which ultimately results in higher voltages and power densities due to lower interconnect resistances. In addition, wiring the legs following a Hilbert spacing-filling pattern allows for facile load matching to each application. This is made possible by leveraging the fractal nature of the Hilbert interconnect pattern, which results in identical sub-modules. Using the Hilbert design, sub-modules can better accommodate non-uniform temperature distributions because they naturally self-localize. These device design concepts open new avenues for roll-to-roll printing and custom TE module shapes, thereby enabling organic TE modules for self-powered sensors and wearable electronic applications.

  9. Printed polymer photonic devices for optical interconnect systems

    Science.gov (United States)

    Subbaraman, Harish; Pan, Zeyu; Zhang, Cheng; Li, Qiaochu; Guo, L. J.; Chen, Ray T.

    2016-03-01

    Polymer photonic device fabrication usually relies on the utilization of clean-room processes, including photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which are expensive and are limited to areas as large as a wafer. Utilizing a novel and a scalable printing process involving ink-jet printing and imprinting, we have fabricated polymer based photonic interconnect components, such as electro-optic polymer based modulators and ring resonator switches, and thermo-optic polymer switch based delay networks and demonstrated their operation. Specifically, a modulator operating at 15MHz and a 2-bit delay network providing up to 35.4ps are presented. In this paper, we also discuss the manufacturing challenges that need to be overcome in order to make roll-to-roll manufacturing practically viable. We discuss a few manufacturing challenges, such as inspection and quality control, registration, and web control, that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. We have overcome these challenges, and currently utilizing our inhouse developed hardware and software tools, <10μm alignment accuracy at a 5m/min is demonstrated. Such a scalable roll-to-roll manufacturing scheme will enable the development of unique optoelectronic devices which can be used in a myriad of different applications, including communication, sensing, medicine, security, imaging, energy, lighting etc.

  10. Chip-by-chip configurable interconnection using digital printing techniques

    International Nuclear Information System (INIS)

    Mashayekhi, Mohammad; Carrabina, Jordi; Winchester, Lee; Laurila, Mika-Matti; Mäntysalo, Matti; Ogier, Simon; Terés, Lluís

    2017-01-01

    Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results. (paper)

  11. Ultra-stretchable Interconnects for high-density stretchable electronics

    NARCIS (Netherlands)

    Shafqat, S.; Hoefnagels, J.P.M.; Savov, A.; Joshi, S.; Dekker, R.; Geers, M.G.D.

    2017-01-01

    The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for

  12. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

    Directory of Open Access Journals (Sweden)

    Salman Shafqat

    2017-09-01

    Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

  13. Characteristics of via-hole interconnections fabricated by using an inkjet printing method

    International Nuclear Information System (INIS)

    Yang, Yong Suk; You, In Kyu; Koo, Jae Bon; Lee, Sang Seok; Lim, Sang Chul; Kang, Seong Youl; Noh, Yong Young

    2010-01-01

    Inkjet printing is a familiar technique that creates and releases droplets of fluid on demand and precisely deposits those droplets on a substrate. It has received increased attention for its novelty and ability to produce patterned and template material structures. In the application of electronic interconnection fabrication, drop-on-demand inkjet printers especially offer the advantages of contactless printing and eliminat the use of a die or photomask. In this study, we created a via-hole interconnecting structure through a polymer insulator layer by using an inkjet printing. When the droplets of Ag ink were dropped onto a PMMA/Au/Cr/SiO 2 /Si area and the Ag film was annealed at high temperatures, the Ag ink containing solvents penetrated into the PMMA layer and generated the conducting paths between the top Ag and the bottom Au electrodes by partial dissolution and swelling of the polymer. The surface and the cross-sectional topologies of the formed via-holes were investigated by using an optical microscope and a field emission transmission electron microscope.

  14. Deposition and characterisation of copper for high density interconnects

    International Nuclear Information System (INIS)

    McCusker, N.

    1999-09-01

    Copper has been deposited by sputtering and investigated for application as high density interconnects, with a view to maximising its performance and reliability. A sputter deposition process using gettering has been developed, which produces consistently pure, low resistivity films. A relationship between film thickness and resistivity has been explained by studying the grain growth process in copper films using atomic force microscopy. The Maydas-Shatzkes model has been used to separate the contributions of grain boundary and surface scattering to thin film resistivity, in copper and gold. Stress and texture in copper film have been studied. Annealing has been used to promote grain growth and texture development. Electromigration has been studied in copper and aluminium interconnects using a multi-line accelerated test set-up. A difference in failure distributions and void morphologies has been explained by an entirely different damage mechanism. The importance of surface/interface migration in electromigration damage of copper lines has been established and explained using a grain boundary-grooving model. A tantalum overlayer was found to extend the lifetime of copper lines. A composite sputtering target has been used to deposit copper/zirconium alloy films. The composition of the alloys was studied by Rutherford backscattering, Auger and secondary neutral mass spectrometry. The alloy films had an improved electromigration lifetime. A surface controlled mechanism is proposed to explain the advantage. A metal oxide semiconductor (MOS) capacitor technique is used to investigate barrier reliability. Tungsten is shown to be an effective diffusion barrier for copper, up to 700 deg. C. (author)

  15. Is there a sex difference in palm print ridge density?

    Science.gov (United States)

    Kanchan, Tanuj; Krishan, Kewal; Aparna, K R; Shyamsundar, S

    2013-01-01

    Analysis of fingerprints and palm prints at the crime scene is vital to identify the suspect and establish a crime. Dermatoglyphics can even be valuable in identification of a dismembered hand during medicolegal investigations to establish the identity of an individual in cases of mass disasters/mass homicides. The present research studies the variation in ridge density in different areas of the palm prints among men and women. The four prominent areas were analysed on the palm prints that included central prominent part of the thenar eminence (P1), hypothenar region; inner to the proximal axial triradius (P2), medial mount; proximal to the triradius of the second digit (P3) and lateral mount; proximal to the triradius of the fifth digit (P4). The mean palm print ridge density was significantly higher among women than men in all the designated areas in both hands except for the P3 area in the right hand. Statistically significant differences were observed in the palm print ridge density between the different palm areas in men and women in right and left hands. No significant right-left differences were observed in the palm print ridge density in any of the four areas of palm prints among men. In women, right-left differences were observed only in the P3 and P4 areas of palm prints. This preliminary study indicates that though the palm print ridge density is a sexually dimorphic variable, its utility for estimation of sex in forensic identification may be limited owing to significant overlapping of values.

  16. High Density Interconnect Microstrip Patch Antenna for 5G Base Stations with Integrated Filtering Performance

    Directory of Open Access Journals (Sweden)

    Marco Salucci

    2018-04-01

    Full Text Available The elementary radiator of a planar array for next generation millimeter-wave (mm-wave 5G base stations is described. The antenna is designed for high density interconnect (HDI manufacturing for yielding a compact, densely-interconnected, and highly-integrable stacked structure. The layout of the single element is determined by directly optimizing key radiation features of the whole planar arrangement according to specific application-driven requirements. In addition, thanks to the exploitation of a spline-shaped modelling of the radiator, suitable performance in terms of impedance matching, realized gain, half-power beamwidth (HPBW, polarization purity, and inter-element isolation are achieved within the 28-GHz pass-band. Moreover, integrated out-of-band filtering capabilities are obtained in selected and wide non-contiguous stop-bands without additional circuitry.

  17. Optical interconnects

    CERN Document Server

    Chen, Ray T

    2006-01-01

    This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

  18. Effect of coating density on oxidation resistance and Cr vaporization from solid oxide fuel cell interconnects

    Science.gov (United States)

    Talic, Belma; Falk-Windisch, Hannes; Venkatachalam, Vinothini; Hendriksen, Peter Vang; Wiik, Kjell; Lein, Hilde Lea

    2017-06-01

    Manganese cobalt spinel oxides are promising materials for protective coatings for solid oxide fuel cell (SOFC) interconnects. To achieve high density such coatings are often sintered in a two-step procedure, involving heat treatment first in reducing and then in oxidizing atmospheres. Sintering the coating inside the SOFC stack during heating would reduce production costs, but may result in a lower coating density. The importance of coating density is here assessed by characterization of the oxidation kinetics and Cr evaporation of Crofer 22 APU with MnCo1.7Fe0.3O4 spinel coatings of different density. The coating density is shown to have minor influence on the long-term oxidation behavior in air at 800 °C, evaluated over 5000 h. Sintering the spinel coating in air at 900 °C, equivalent to an in-situ heat treatment, leads to an 88% reduction of the Cr evaporation rate of Crofer 22 APU in air-3% H2O at 800 °C. The air sintered spinel coating is initially highly porous, however, densifies with time in interaction with the alloy. A two-step reduction and re-oxidation heat treatment results in a denser coating, which reduces Cr evaporation by 97%.

  19. Long-term osseointegration of 3D printed CoCr constructs with an interconnected open-pore architecture prepared by electron beam melting.

    Science.gov (United States)

    Shah, Furqan A; Omar, Omar; Suska, Felicia; Snis, Anders; Matic, Aleksandar; Emanuelsson, Lena; Norlindh, Birgitta; Lausmaa, Jukka; Thomsen, Peter; Palmquist, Anders

    2016-05-01

    In orthopaedic surgery, cobalt chromium (CoCr) based alloys are used extensively for their high strength and wear properties, but with concerns over stress shielding and bone resorption due to the high stiffness of CoCr. The structural stiffness, principally related to the bulk and the elastic modulus of the material, may be lowered by appropriate design modifications, to reduce the stiffness mismatch between metal/alloy implants and the adjacent bone. Here, 3D printed CoCr and Ti6Al4V implants of similar macro-geometry and interconnected open-pore architecture prepared by electron beam melting (EBM) were evaluated following 26week implantation in adult sheep femora. Despite higher total bone-implant contact for Ti6Al4V (39±4%) than CoCr (27±4%), bone formation patterns were similar, e.g., densification around the implant, and gradual ingrowth into the porous network, with more bone in the outer half (periphery) than the inner half (centre). Raman spectroscopy revealed no major differences in mineral crystallinity, the apatite-to-collagen ratio, or the carbonate-to-phosphate ratio. Energy dispersive X-ray spectroscopy showed similar Ca/P ratio of the interfacial tissue adjacent to both materials. Osteocytes made direct contact with CoCr and Ti6Al4V. While osteocyte density and distribution in the new-formed bone were largely similar for the two alloys, higher osteocyte density was observed at the periphery of the porous network for CoCr, attributable to slower remodelling and a different biomechanical environment. The results demonstrate the possibility to achieve bone ingrowth into open-pore CoCr constructs, and attest to the potential for fabricating customised osseointegrated CoCr implants for load-bearing applications. Although cobalt chromium (CoCr) based alloys are used extensively in orthopaedic surgery, stress shielding due to the high stiffness of CoCr is of concern. To reduce the stiffness mismatch between CoCr and bone, CoCr and Ti6Al4V implants having

  20. Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects

    Science.gov (United States)

    Park, Young-Joon; Andleigh, Vaibhav K.; Thompson, Carl V.

    1999-04-01

    An electromigration model is developed to simulate the reliability of Al and Al-Cu interconnects. A polynomial expression for the free energy of solution by Murray [Int. Met. Rev. 30, 211 (1985)] was used to calculate the chemical potential for Al and Cu while the diffusivities were defined based on a Cu-trapping model by Rosenberg [J. Vac. Sci. Technol. 9, 263 (1972)]. The effects of Cu on stress evolution and lifetime were investigated in all-bamboo and near-bamboo stud-to-stud structures. In addition, the significance of the effect of mechanical stress on the diffusivity of both Al and Cu was determined in all-bamboo and near-bamboo lines. The void nucleation and growth process was simulated in 200 μm, stud-to-stud lines. Current density scaling behavior for void-nucleation-limited failure and void-growth-limited failure modes was simulated in long, stud-to-stud lines. Current density exponents of both n=2 for void nucleation and n=1 for void growth failure modes were found in both pure Al and Al-Cu lines. Limitations of the most widely used current density scaling law (Black's equation) in the analysis of the reliability of stud-to-stud lines are discussed. By modifying the input materials properties used in this model (when they are known), this model can be adapted to predict the reliability of other interconnect materials such as pure Cu and Cu alloys.

  1. Application of Inkjet Printing in High-Density Pixelated RGB Quantum Dot-Hybrid LEDs

    KAUST Repository

    Haverinen, Hanna; Jabbour, Ghassan E.

    2012-01-01

    to fabricate high-density, pixelated (quarter video graphics array (QVGA) format), monochromatic and RGB quantum dots light-emitting diodes (QDLEDs), where inkjet printing is used to deposit the light-emitting layer of QDs. It shows some of the factors

  2. Application of Inkjet Printing in High-Density Pixelated RGB Quantum Dot-Hybrid LEDs

    KAUST Repository

    Haverinen, Hanna

    2012-05-23

    Recently, an intriguing solution to obtain better color purity has been to introduce inorganic emissive quantum dots (QDs) into an otherwise OLED structure. The emphasis of this chapter is to present a simple discussion of the first attempts to fabricate high-density, pixelated (quarter video graphics array (QVGA) format), monochromatic and RGB quantum dots light-emitting diodes (QDLEDs), where inkjet printing is used to deposit the light-emitting layer of QDs. It shows some of the factors that have to be considered in order to achieve the desired accuracy and printing quality. The successful operation of the RGB printed devices indicates the potential of the inkjet printing approach in the fabrication of full-color QDLEDs for display application. However, further optimization of print quality is still needed in order to eliminate the formation of pinholes, thus maximizing energy transfer from organic layers to the QDs and in turn increasing the performance of the devices. Controlled Vocabulary Terms: ink jet printing; LED displays; LED lamps; organic light emitting diodes; quantum dots

  3. Material matters: Analysis of density uncertainty in 3D printing and its consequences for radiation oncology.

    Science.gov (United States)

    Craft, Daniel F; Kry, Stephen F; Balter, Peter; Salehpour, Mohammad; Woodward, Wendy; Howell, Rebecca M

    2018-04-01

    Using 3D printing to fabricate patient-specific devices such as tissue compensators, boluses, and phantoms is inexpensive and relatively simple. However, most 3D printing materials have not been well characterized, including their radiologic tissue equivalence. The purposes of this study were to (a) determine the variance in Hounsfield Units (HU) for printed objects, (b) determine if HU varies over time, and (c) calculate the clinical dose uncertainty caused by these material variations. For a sample of 10 printed blocks each of PLA, NinjaFlex, ABS, and Cheetah, the average HU and physical density were tracked at initial printing and over the course of 5 weeks, a typical timeframe for a standard course of radiotherapy. After initial printing, half the blocks were stored in open boxes, the other half in sealed bags with desiccant. Variances in HU and density over time were evaluated for the four materials. Various clinical photon and electron beams were used to evaluate potential errors in clinical depth dose as a function of assumptions made during treatment planning. The clinical depth error was defined as the distance between the correctly calculated 90% isodose line and the 90% isodose line calculated using clinically reasonable, but simplified, assumptions. The average HU measurements of individual blocks of PLA, ABS, NinjaFlex, and Cheetah varied by as much as 121, 30, 178, and 30 HU, respectively. The HU variation over 5 weeks was much smaller for all materials. The magnitude of clinical depth errors depended strongly on the material, energy, and assumptions, but some were as large as 9.0 mm. If proper quality assurance steps are taken, 3D printed objects can be used accurately and effectively in radiation therapy. It is critically important, however, that the properties of any material being used in patient care be well understood and accounted for. © 2018 American Association of Physicists in Medicine.

  4. Density comparison of 3D printing materials and the human body

    Energy Technology Data Exchange (ETDEWEB)

    Savi, M.; Silveira, L.C.; Cechinel, C.M.; Soares, F.A.P., E-mail: Matheus.savi@ifsc.edu.br [Instituo Federal de Santa Catarina (IFSC), Florianópolis (Brazil). Departamento Acadêmico de Saúde e Serviços; Potiens, M.P.A. [Instituto de Pesquisas Energéticas Nucleares (IPEN/CNEN-SP), São Paulo, SP (Brazil). Lab. de Calibração de Instrumentos

    2017-07-01

    Introduction: Phantoms are commonly used for teaching and radiation dosimetry as a simulator of the human body in order that no individual be exposed to radiation during training and research. Some are the properties that can be used as a measurement parameter in a phantom: density, energy compatibility, attenuation and scattering of the radiation, anthropomorphism, among others. 3D printing has revolutionized many areas of knowledge, including those that make use of radiations. In this context, this study aims to evaluate the density of various materials applied in 3D printing and compare found values with human body density in ICRP 110. Methods: Cubes with 2cm edges were printed on 12 materials of different compositions with internal filling of 60 %, 80% and 100%, weighed on a precision balance and measured with a caliper. Results: The densities found ranged from 0,575 g/cm³ to 2,624 g/cm³ for 60% infill, 0,686 g/cm³ to 3,091 g/cm³ for 80% and 0,794 g/cm³ to 3,572 g/cm³ for 100%. Densities related to teeth, bones, muscles, fat, among others, could be created from specific infill variations. Conclusion: All analyzed materials have the capacity to mimic the structures described in ICRP 110 when the percentage of filling are varied. However, even achieving human tissue density the materials may be not adequate for attenuation and require further experiments. (author)

  5. Density comparison of 3D printing materials and the human body

    International Nuclear Information System (INIS)

    Savi, M.; Silveira, L.C.; Cechinel, C.M.; Soares, F.A.P.; Potiens, M.P.A.

    2017-01-01

    Introduction: Phantoms are commonly used for teaching and radiation dosimetry as a simulator of the human body in order that no individual be exposed to radiation during training and research. Some are the properties that can be used as a measurement parameter in a phantom: density, energy compatibility, attenuation and scattering of the radiation, anthropomorphism, among others. 3D printing has revolutionized many areas of knowledge, including those that make use of radiations. In this context, this study aims to evaluate the density of various materials applied in 3D printing and compare found values with human body density in ICRP 110. Methods: Cubes with 2cm edges were printed on 12 materials of different compositions with internal filling of 60 %, 80% and 100%, weighed on a precision balance and measured with a caliper. Results: The densities found ranged from 0,575 g/cm³ to 2,624 g/cm³ for 60% infill, 0,686 g/cm³ to 3,091 g/cm³ for 80% and 0,794 g/cm³ to 3,572 g/cm³ for 100%. Densities related to teeth, bones, muscles, fat, among others, could be created from specific infill variations. Conclusion: All analyzed materials have the capacity to mimic the structures described in ICRP 110 when the percentage of filling are varied. However, even achieving human tissue density the materials may be not adequate for attenuation and require further experiments. (author)

  6. Oxide-confined 2D VCSEL arrays for high-density inter/intra-chip interconnects

    Science.gov (United States)

    King, Roger; Michalzik, Rainer; Jung, Christian; Grabherr, Martin; Eberhard, Franz; Jaeger, Roland; Schnitzer, Peter; Ebeling, Karl J.

    1998-04-01

    We have designed and fabricated 4 X 8 vertical-cavity surface-emitting laser (VCSEL) arrays intended to be used as transmitters in short-distance parallel optical interconnects. In order to meet the requirements of 2D, high-speed optical links, each of the 32 laser diodes is supplied with two individual top contacts. The metallization scheme allows flip-chip mounting of the array modules junction-side down on silicon complementary metal oxide semiconductor (CMOS) chips. The optical and electrical characteristics across the arrays with device pitch of 250 micrometers are quite homogeneous. Arrays with 3 micrometers , 6 micrometers and 10 micrometers active diameter lasers have been investigated. The small devices show threshold currents of 600 (mu) A, single-mode output powers as high as 3 mW and maximum wavelength deviations of only 3 nm. The driving characteristics of all arrays are fully compatible to advanced 3.3 V CMOS technology. Using these arrays, we have measured small-signal modulation bandwidths exceeding 10 GHz and transmitted pseudo random data at 8 Gbit/s channel over 500 m graded index multimode fiber. This corresponds to a data transmission rate of 256 Gbit/s per array of 1 X 2 mm2 footprint area.

  7. Vibration Characteristics for Moving Printing Membrane with Variable Density along the Lateral Direction

    Directory of Open Access Journals (Sweden)

    Mingyue Shao

    2017-01-01

    Full Text Available The vibration model of moving membrane with variable density distribution is established, and the density distribution of the moving membrane varies along the lateral direction. The transverse vibration differential equations of moving membrane are established based on D’Alembert’s principle and discretized by using the differential quadrature method (DQM. The relationships of the first three dimensionless complex frequencies between dimensionless speed, density coefficient, and tension ratio of the membrane are analyzed by numerical calculation. The effects of the density coefficient and the tension ratio on transverse vibration characteristics of the membrane are investigated. The relationship between density coefficient and critical speed is obtained. The numerical results show that the density coefficient and the tension ratio have important influence on the stability of moving membrane. So the study provides a theoretical basis for improving the working stability of the membrane in the high-speed printing process.

  8. Effect of coating density on oxidation resistance and Cr vaporization from solid oxide fuel cell interconnects

    DEFF Research Database (Denmark)

    Talic, Belma; Falk-Windisch, Hannes; Venkatachalam, Vinothini

    2017-01-01

    •Protective action of dense and porous spinel coatings on Crofer 22 APU was compared. •Reduction and re-oxidation produces denser coatings than heat treating in air only. •Coating density has minor influence on oxidation resistance at 800 °C in air. •Dense coating resulted in three times lower Cr...... evaporation rate than porous coating....

  9. Color Mixing Correction for Post-printed Patterns on Colored Background Using Modified Particle Density Model

    OpenAIRE

    Suwa , Misako; Fujimoto , Katsuhito

    2006-01-01

    http://www.suvisoft.com; Color mixing occurs between background and foreground colors when a pattern is post-printed on a colored area because ink is not completely opaque. This paper proposes a new method for the correction of color mixing in line pattern such as characters and stamps, by using a modified particle density model. Parameters of the color correction can be calculated from two sets of foreground and background colors. By employing this method, the colors of foreground patterns o...

  10. Ultra-precision fabrication of high density micro-optical backbone interconnections for data center and mobile application

    Science.gov (United States)

    Lohmann, U.; Jahns, J.; Wagner, T.; Werner, C.

    2012-10-01

    A microoptical 3D interconnection scheme and fabricated samples of this fiberoptical multi-channel interconnec- tion with an actual capacity of 144 channels were shown. Additionally the aspects of micrometer-fabrication of such microoptical interconnection modules in the view of alignment-tolerances were considered. For the realiza- tion of the interconnection schemes, the approach of planar-integrated free space optics (PIFSO) is used with its well known advantages. This approach offers the potential for complex interconnectivity, and yet compact size.

  11. High frequency P(VDF-TrFE) copolymer broadband annular array ultrasound transducers using high density flexible circuit interconnect

    Science.gov (United States)

    Gottlieb, Emanuel J.; Cannata, Jonathan M.; Hu, Chang Hong; Shung, K. K.

    2005-04-01

    A kerfless eight element high frequency ultrasound annular array transducer using 9 μm P(VDF-TrFE) bonded to a high density flexible interconnect was fabricated. The flexible circuit composed of Kapton polyimide film with gold electrode pattern of equal area annuli apertures on the top side of a 50 μm thick Kapton polyimide film. Each element had several 30 μm diameter electroplated vias that connected to electrode traces on the bottom side of the Kapton polyimide film. There was a 30 μm spacing between elements. The total aperture of the array was 3.12 mm. The transducer's performance has been modeled by implementing the Redwood version of the Mason model into PSpice and using the Krimholtz, Leedom and Matthaei (KLM) model utilized in the commercial software PiezoCAD. The transducer"s performance was evaluated by measuring the electrical impedance with a HP 4194 impedance analyzer, pulse echo response using a Panametrics 5900 pulser/receiver and crosstalk measurement for each element in the array. The measured electrical impedance for each element was 540 Ω and -84° phase. In order to improve device sensitivity an inductor was attached in series with each element to reduce the insertion loss to 33 dB. The measured average center frequency and bandwidth of each element was 55 MHz and 50% respectively. The measured crosstalk at the center frequency was -45 dB in water.

  12. Selective Laser Sintering of PA2200: Effects of print parameters on density, accuracy, and surface roughness

    Energy Technology Data Exchange (ETDEWEB)

    Bajric, Sendin [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2017-06-12

    Additive manufacturing needs a broader selection of materials for part production. In order for the Los Alamos National Laboratory (LANL) to investigate new materials for selective laser sintering (SLS), this paper reviews research on the effect of print parameters on part density, accuracy, and surface roughness of polyamide 12 (PA12, PA2200). The literature review serves to enhance the understanding of how changing the laser powder, scan speed, etc. will affect the mechanical properties of a commercial powder. By doing so, this understanding will help the investigation of new materials for SLS.

  13. Interconnection Guidelines

    Science.gov (United States)

    The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

  14. SU-C-213-02: Characterizing 3D Printing in the Fabrication of Variable Density Phantoms

    Energy Technology Data Exchange (ETDEWEB)

    Madamesila, J; McGeachy, P; Villarreal-Barajas, J; Khan, R [The University of Calgary, Calgary, AB (Canada)

    2015-06-15

    Purpose: In this work, we present characterization, process flow, quality control and application of 3D fabricated low density phantoms for radiotherapy quality assurance. Methods: A Rostock delta 3D printer using polystyrene filament of diameter 1.75 mm was used to print geometric volumes of 2×2×1 cm{sup 3} of varying densities. The variable densities of 0.1 to 0.75 g/cm {sup 3} were created by modulating the infill. A computed tomography (CT) scan was performed to establish an infill-density calibration curve as well as characterize the quality of the print such as uniformity and the infill pattern. The time required to print these volumes was also recorded. Using the calibration, two low density cones (0.19, 0.52 g/cm{sup 3}) were printed and benchmarked against commercially available phantoms. The dosimetric validation of the low density scaling of Anisotropic Analytical Algorithm (AAA) was performed by using a 0.5 g/cm{sup 3} slab of 10×10×2.4 cm{sup 3} with EBT3 GafChromic film. The gamma analysis at 3%/3mm criteria were compared for the measured and computed dose planes. Results: Analysis of the volume of air pockets in the infill resulted in a reasonable uniformity for densities 0.4 to 0.75 g/cm{sup 3}. Printed phantoms with densities below 0.4 g/cm{sup 3} exhibited a higher ratio of air to polystyrene resulting in large non-uniformity. Compared to the commercial inserts, good agreement was observed only for the printed 0.52 g/cm{sup 3} cone. Dosimetric comparison for a printed low density volume placed in-between layers of solid water resulted in >95% gamma agreement between AAA calculated dose planes and measured EBT3 films for a 6MV 5×5 cm{sup 2} clinical beam. The comparison showed disagreement in the penumbra region. Conclusion: In conclusion, 3D printing technology opens the door to desktop fabrication of variable density phantoms at economical prices in an efficient manner for the quality assurance needs of a small clinic.

  15. SU-C-213-02: Characterizing 3D Printing in the Fabrication of Variable Density Phantoms

    International Nuclear Information System (INIS)

    Madamesila, J; McGeachy, P; Villarreal-Barajas, J; Khan, R

    2015-01-01

    Purpose: In this work, we present characterization, process flow, quality control and application of 3D fabricated low density phantoms for radiotherapy quality assurance. Methods: A Rostock delta 3D printer using polystyrene filament of diameter 1.75 mm was used to print geometric volumes of 2×2×1 cm 3 of varying densities. The variable densities of 0.1 to 0.75 g/cm 3 were created by modulating the infill. A computed tomography (CT) scan was performed to establish an infill-density calibration curve as well as characterize the quality of the print such as uniformity and the infill pattern. The time required to print these volumes was also recorded. Using the calibration, two low density cones (0.19, 0.52 g/cm 3 ) were printed and benchmarked against commercially available phantoms. The dosimetric validation of the low density scaling of Anisotropic Analytical Algorithm (AAA) was performed by using a 0.5 g/cm 3 slab of 10×10×2.4 cm 3 with EBT3 GafChromic film. The gamma analysis at 3%/3mm criteria were compared for the measured and computed dose planes. Results: Analysis of the volume of air pockets in the infill resulted in a reasonable uniformity for densities 0.4 to 0.75 g/cm 3 . Printed phantoms with densities below 0.4 g/cm 3 exhibited a higher ratio of air to polystyrene resulting in large non-uniformity. Compared to the commercial inserts, good agreement was observed only for the printed 0.52 g/cm 3 cone. Dosimetric comparison for a printed low density volume placed in-between layers of solid water resulted in >95% gamma agreement between AAA calculated dose planes and measured EBT3 films for a 6MV 5×5 cm 2 clinical beam. The comparison showed disagreement in the penumbra region. Conclusion: In conclusion, 3D printing technology opens the door to desktop fabrication of variable density phantoms at economical prices in an efficient manner for the quality assurance needs of a small clinic

  16. Behavior of printable formulations of loperamide and caffeine on different substrates--effect of print density in inkjet printing

    DEFF Research Database (Denmark)

    Genina, Natalja; Fors, Daniela; Palo, Mirja

    2013-01-01

    The primary goal of the current work was to study the applicability of precision inkjet printing in fabrication of personalized doses of active pharmaceutical ingredients (APIs). Loperamide hydrochloride (LOP) and caffeine (CAF) were used as model compounds. Different doses of the drugs in a single...

  17. Three-dimensional printing of stem cell-laden hydrogels submerged in a hydrophobic high-density fluid

    International Nuclear Information System (INIS)

    Duarte Campos, Daniela F; Blaeser, Andreas; Weber, Michael; Fischer, Horst; Jäkel, Jörg; Neuss, Sabine; Jahnen-Dechent, Wilhelm

    2013-01-01

    Over the last decade, bioprinting technologies have begun providing important tissue engineering strategies for regenerative medicine and organ transplantation. The major drawback of past approaches has been poor or inadequate material-printing device and substrate combinations, as well as the relatively small size of the printed construct. Here, we hypothesise that cell-laden hydrogels can be printed when submerged in perfluorotributylamine (C 12 F 27 N), a hydrophobic high-density fluid, and that these cells placed within three-dimensional constructs remain viable allowing for cell proliferation and production of extracellular matrix. Human mesenchymal stem cells and MG-63 cells were encapsulated into agarose hydrogels, and subsequently printed in high aspect ratio in three dimensional structures that were supported in high density fluorocarbon. Three-dimensional structures with various shapes and sizes were manufactured and remained stable for more than six months. Live/dead and DAPI stainings showed viable cells 24 h after the printing process, as well as after 21 days in culture. Histological and immunohistochemical analyses after 14 and 21 days revealed viable cells with marked matrix production and signs of proliferation. The compressive strength values of the printed gels consequently increased during the two weeks in culture, revealing encouraging results for future applications in regenerative medicine. (paper)

  18. 3D printed Ti6Al4V implant surface promotes bone maturation and retains a higher density of less aged osteocytes at the bone-implant interface.

    Science.gov (United States)

    Shah, Furqan A; Snis, Anders; Matic, Aleksandar; Thomsen, Peter; Palmquist, Anders

    2016-01-01

    For load-bearing orthopaedic applications, metal implants having an interconnected pore structure exhibit the potential to facilitate bone ingrowth and the possibility for reducing the stiffness mismatch between the implant and bone, thus eliminating stress-shielding effects. 3D printed solid and macro-porous Ti6Al4V implants were evaluated after six-months healing in adult sheep femora. The ultrastructural composition of the bone-implant interface was investigated using Raman spectroscopy and electron microscopy, in a correlative manner. The mineral crystallinity and the mineral-to-matrix ratios of the interfacial tissue and the native bone were found to be similar. However, lower Ca/P ratios, lower carbonate content, but higher proline, phenylalanine and tyrosine levels indicated that the interfacial tissue remained less mature. Bone healing was more advanced at the porous implant surface (vs. the solid implant surface) based on the interfacial tissue ν1 CO3(2-)/ν2 PO4(3-) ratio, phenylalanine and tyrosine levels approaching those of the native bone. The mechanosensing infrastructure in bone, the osteocyte lacuno-canalicular network, retained ∼40% more canaliculi per osteocyte lacuna, i.e., a 'less aged' morphology at the interface. The osteocyte density per mineralised surface area was ∼36-71% higher at the interface after extended healing periods. In osseointegration research, the success of an implant surface or design is commonly determined by quantifying the amount of new bone, rather than its maturation, composition and structure. This work describes a novel correlative methodology to investigate the ultrastructure and composition of bone formed around and within 3D printed Ti6Al4V implants having an interconnected open-pore structure. Raman spectroscopy demonstrates that the molecular composition of the interfacial tissue at different implant surfaces may vary, suggesting differences in the extent to which bone maturation occurs even after long

  19. Transurban interconnectivities

    DEFF Research Database (Denmark)

    Jørgensen, Claus Møller

    2012-01-01

    This essay discusses the interpretation of the revolutionary situations of 1848 in light of recent debates on interconnectivity in history. The concept of transurban interconnectivities is proposed as the most precise concept to capture the nature of interconnectivity in 1848. It is argued....... It is argued that circulating political communication accounts for similarities with respect to political agenda, organisational form and political repertoire evident in urban settings across Europe. This argument is supported by a series of examples of local organisation and local appropriations of liberalism...

  20. MoS2/Ni3S4 composite nanosheets on interconnected carbon shells as an excellent supercapacitor electrode architecture for long term cycling at high current densities

    Science.gov (United States)

    Qin, Shengchun; Yao, Tinghui; Guo, Xin; Chen, Qiang; Liu, Dequan; Liu, Qiming; Li, Yali; Li, Junshuai; He, Deyan

    2018-05-01

    In this paper, we report an electrode architecture of molybdenum disulfide (MoS2)/nickel sulfide (Ni3S4) composite nanosheets anchored on interconnected carbon (C) shells (C@MoS2/Ni3S4). Electrochemical measurements indicate that the C@MoS2/Ni3S4 structure possesses excellent supercapacitive properties especially for long term cycling at high current densities. A specific capacitance as high as ∼640.7 F g-1 can still be delivered even after 10,000 cycles at a high current density of 20 A g-1. From comparison of microstructures and electrochemical properties of the related materials/structures, the improved performance of C@MoS2/Ni3S4 can be attributed to the relatively dispersedly distributed nanosheet-shaped MoS2/Ni3S4 that provides efficient contact with electrolyte and effectively buffers the volume change during charge/discharge processes, enhanced cycling stability by MoS2, and reduced equivalent series resistance by the interconnected C shells.

  1. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    International Nuclear Information System (INIS)

    Sabourin, D; Snakenborg, D; Dufva, M

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications

  2. Interconnected networks

    CERN Document Server

    2016-01-01

    This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

  3. Three-dimensional printing and deformation behavior of low-density target structures by two-photon polymerization

    Science.gov (United States)

    Liu, Ying; Stein, Ori; Campbell, John H.; Jiang, Lijia; Petta, Nicole; Lu, Yongfeng

    2017-08-01

    Two-photon polymerization (2PP), a 3D nano to microscale additive manufacturing process, is being used for the first time to fabricate small custom experimental packages ("targets") to support laser-driven high-energy-density (HED) physics research. Of particular interest is the use of 2PP to deterministically print low-density, low atomic-number (CHO) polymer matrices ("foams") at millimeter scale with sub-micrometer resolution. Deformation during development and drying of the foam structures remains a challenge when using certain commercial photo-resins; here we compare use of acrylic resins IP-S and IP-Dip. The mechanical strength of polymeric beam and foam structures is examined particularly the degree of deformation that occurs during the development and drying processes. The magnitude of the shrinkage in the two resins in quantified by printing sample structures and by use of FEA to simulate the deformation. Capillary drying forces are shown to be small and likely below the elastic limit of the core foam structure. In contrast the substantial shrinkage in IP-Dip ( 5-10%) cause large shear stresses and associated plastic deformation particularly near constrained boundaries such as the substrate and locations with sharp density variation. The inherent weakness of stitching boundaries is also evident and in certain cases can lead to delamination. Use of IP-S shows marked reduction in deformation with a minor loss of print resolution

  4. Interconnection between precipitation density, soil contamination levels and 90Sr and 137Cs content in food stuffs

    International Nuclear Information System (INIS)

    Knizhnikov, V.A.; Petukhova, Eh.V.

    1980-01-01

    Presented are the data dynamically characterizing the density of radioactive fallout, contamination of soil and the main kinds of food stuffs with 137 Cs and 90 Sr. It is shown that 90 Sr contamination of bakery products in the country within the whole period of observation is in direct dependence on the density of atmospheric fallouts as a whole in the northern hemisphere. In the reverse, 90 Sr potato contamination primarily correlates with nuclide content in the soil. The dependence between milk contamination and fallout density has an intermediate character as compared with the above types of food stuffs. The same is true for 137 Cs, but a clear tendency to a faster decrease in the level of food stuffs contamination is observed. The importance of the soil way in food stuffs contamination and peculiarities of nuclide migration in food stuffs from various types of soil are considered

  5. Analysis of the trade-offs between conventional and superconducting interconnections

    International Nuclear Information System (INIS)

    Frye, R.

    1989-01-01

    Superconductivity can now be achieved at temperatures compatible with semiconductor device operation. This raises the interesting possibility of using the new, high-temperature superconducting ceramics for interconnections in electronic systems. This paper examines some of the consequences of a resistance-free interconnection medium. A problem with conventional conductors in electronic systems is that the resistance of wires increases quadratically as the wire dimensions are scaled down. Below some minimum cross-sectional area, determined by the metal resistivity and wire length, the resistance in these lines begins to severely limit their bandwidth. Superconductors, on the other hand, are not constrained by the same scaling rules. They provide a high bandwidth interconnection at all sizes and lengths. The limitations for superconductors are set by their critical current densities. If line dimensions become too small, a superconductor will no longer support an adequate flow of current. An analysis is presented examining the performance trade-offs for conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. An important result of the analysis is that it determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. This identifies particular interconnection technologies for which high-temperature superconductors show the most promise

  6. A metallic buried interconnect process for through-wafer interconnection

    International Nuclear Information System (INIS)

    Ji, Chang-Hyeon; Herrault, Florian; Allen, Mark G

    2008-01-01

    In this paper, we present the design, fabrication process and experimental results of electroplated metal interconnects buried at the bottom of deep silicon trenches with vertical sidewalls. A manual spray-coating process along with a unique trench-formation process has been developed for the electroplating of a metal interconnection structure at the bottom surface of the deep trenches. The silicon etch process combines the isotropic dry etch process and conventional Bosch process to fabricate a deep trench with angled top-side edges and vertical sidewalls. The resulting trench structure, in contrast to the trenches fabricated by wet anisotropic etching, enables spray-coated photoresist patterning with good sidewall and top-side edge coverage while maintaining the ability to form a high-density array of deep trenches without excessive widening of the trench opening. A photoresist spray-coating process was developed and optimized for the formation of electroplating mold at the bottom of 300 µm deep trenches having vertical sidewalls. A diluted positive tone photoresist with relatively high solid content and multiple coating with baking between coating steps has been experimentally proven to provide high quality sidewall and edge coverage. To validate the buried interconnect approach, a three-dimensional daisy chain structure having a buried interconnect as the bottom connector and traces on the wafer surface as the top conductor has been designed and fabricated

  7. Photochemical Copper Coating on 3D Printed Thermoplastics

    Science.gov (United States)

    Yung, Winco K. C.; Sun, Bo; Huang, Junfeng; Jin, Yingdi; Meng, Zhengong; Choy, Hang Shan; Cai, Zhixiang; Li, Guijun; Ho, Cheuk Lam; Yang, Jinlong; Wong, Wai Yeung

    2016-08-01

    3D printing using thermoplastics has become very popular in recent years, however, it is challenging to provide a metal coating on 3D objects without using specialized and expensive tools. Herein, a novel acrylic paint containing malachite for coating on 3D printed objects is introduced, which can be transformed to copper via one-step laser treatment. The malachite containing pigment can be used as a commercial acrylic paint, which can be brushed onto 3D printed objects. The material properties and photochemical transformation processes have been comprehensively studied. The underlying physics of the photochemical synthesis of copper was characterized using density functional theory calculations. After laser treatment, the surface coating of the 3D printed objects was transformed to copper, which was experimentally characterized by XRD. 3D printed prototypes, including model of the Statue of Liberty covered with a copper surface coating and a robotic hand with copper interconnections, are demonstrated using this painting method. This composite material can provide a novel solution for coating metals on 3D printed objects. The photochemical reduction analysis indicates that the copper rust in malachite form can be remotely and photo-chemically reduced to pure copper with sufficient photon energy.

  8. X-ray photoelectron spectroscopy, depth profiling, and elemental imaging of metal/polyimide interfaces of high density interconnect packages subjected to temperature and humidity

    International Nuclear Information System (INIS)

    Jung, David R.; Ibidunni, Bola; Ashraf, Muhammad

    1998-01-01

    X-ray photoelectron spectroscopy (XPS) was used to analyze surfaces and buried interfaces of a tape ball grid array (TBGA) interconnect package that was exposed to temperature and humidity testing (the pressure cooker test or PCT). Two metallization structures, employing 3.5 and 7.5 nm Cr adhesion layers, respectively, showed dramatically different results in the PCT. For the metallization with 3.5 nm Cr, spontaneous failure occurred on the polymer side of the metal/polyimide interface. Copper and other metals were detected by XPS on and below this polymer surface. For the metallization with 7.5 nm Cr, which did not delaminate in the PCT, the metallization was manually peeled away and also showed failure at the polymer side of the interface. Conventional XPS taken from a 1 mm diameter area showed the presence of metals on and below this polymer surface. Detailed spatially-resolved analysis using small area XPS (0.1 mm diameter area) and imaging XPS (7 μm resolution) showed that this metal did not migrate through and below the metal/polymer interface, but around and outside of the metallized area

  9. Epidemics in interconnected small-world networks.

    Science.gov (United States)

    Liu, Meng; Li, Daqing; Qin, Pengju; Liu, Chaoran; Wang, Huijuan; Wang, Feilong

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS) model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  10. Epidemics in interconnected small-world networks.

    Directory of Open Access Journals (Sweden)

    Meng Liu

    Full Text Available Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks has rarely been considered. Here, we study the susceptible-infected-susceptible (SIS model of epidemic spreading in a system comprising two interconnected small-world networks. We find that the epidemic threshold in such networks decreases when the rewiring probability of the component small-world networks increases. When the infection rate is low, the rewiring probability affects the global steady-state infection density, whereas when the infection rate is high, the infection density is insensitive to the rewiring probability. Moreover, epidemics in interconnected small-world networks are found to spread at different velocities that depend on the rewiring probability.

  11. Brookhaven segment interconnect

    International Nuclear Information System (INIS)

    Morse, W.M.; Benenson, G.; Leipuner, L.B.

    1983-01-01

    We have performed a high energy physics experiment using a multisegment Brookhaven FASTBUS system. The system was composed of three crate segments and two cable segments. We discuss the segment interconnect module which permits communication between the various segments

  12. Benefits of transmission interconnections

    International Nuclear Information System (INIS)

    Lyons, D.

    2006-01-01

    The benefits of new power transmission interconnections from Alberta were discussed with reference to the challenges and measures needed to move forward. Alberta's electricity system has had a long period of sustained growth in generation and demand and this trend is expected to continue. However, no new interconnections have been built since 1985 because the transmission network has not expanded in consequence with the growth in demand. As such, Alberta remains weakly interconnected with the rest of the western region. The benefits of stronger transmission interconnections include improved reliability, long-term generation capability, hydrothermal synergies, a more competitive market, system efficiencies and fuel diversity. It was noted that the more difficult challenges are not technical. Rather, the difficult challenges lie in finding an appropriate business model that recognizes different market structures. It was emphasized that additional interconnections are worthwhile and will require significant collaboration among market participants and governments. It was concluded that interties enable resource optimization between systems and their benefits far exceed their costs. tabs., figs

  13. Packaging Printing Today

    OpenAIRE

    Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

  14. Low power interconnect design

    CERN Document Server

    Saini, Sandeep

    2015-01-01

    This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.   ·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses; ·         Focuses on Deep Sub micron technology devices and interconnects; ·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics;  ·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for del...

  15. Interconnecting with VIPs

    Science.gov (United States)

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  16. CAISSON: Interconnect Network Simulator

    Science.gov (United States)

    Springer, Paul L.

    2006-01-01

    Cray response to HPCS initiative. Model future petaflop computer interconnect. Parallel discrete event simulation techniques for large scale network simulation. Built on WarpIV engine. Run on laptop and Altix 3000. Can be sized up to 1000 simulated nodes per host node. Good parallel scaling characteristics. Flexible: multiple injectors, arbitration strategies, queue iterators, network topologies.

  17. Photovoltaic sub-cell interconnects

    Energy Technology Data Exchange (ETDEWEB)

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

    2017-05-09

    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  18. Electromagnetism and interconnections

    CERN Document Server

    Charruau, S

    2009-01-01

    This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.

  19. Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

    Science.gov (United States)

    Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

    2016-09-01

    Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

  20. Interconnectivity: Benefits and Challenges

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2010-09-15

    Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

  1. Interconnection of Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-04-19

    This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

  2. Electrohydrodynamic direct—writing of conductor—insulator-conductor multi-layer interconnection

    International Nuclear Information System (INIS)

    Zheng Gao-Feng; Pei Yan-Bo; Wang Xiang; Zheng Jian-Yi; Sun Dao-Heng

    2014-01-01

    A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor—insulator—conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10 −7 Ω·m and 1.39 × 10 −7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor—insulator—conductor multi-layer interconnections in the electronic industry

  3. Interconnection policy: a theoretical survey

    Directory of Open Access Journals (Sweden)

    César Mattos

    2003-01-01

    Full Text Available This article surveys the theoretical foundations of interconnection policy. The requirement of an interconnection policy should not be taken for granted in all circumstances, even considering the issue of network externalities. On the other hand, when it is required, an encompassing interconnection policy is usually justified. We provide an overview of the theory on interconnection pricing that results in several different prescriptions depending on which problem the regulator aims to address. We also present a survey on the literature on two-way interconnection.

  4. LHC beampipe interconnection

    CERN Document Server

    Particle beams circulate for around 10 hours in the Large Hadron Collider (LHC). During this time, the particles make four hundred million revolutions of the machine, travelling a distance equivalent to the diameter of the solar system. The beams must travel in a pipe which is emptied of air, to avoid collisions between the particles and air molecules (which are considerably bigger than protons). The beam pipes are pumped down to an air pressure similar to that on the surface of the moon. Much of the LHC runs at 1.9 degrees above absolute zero. When material is cooled, it contracts. The interconnections must absorb this contraction whilst maintaining electrical connectivity.

  5. Computer simulation of electromigration in microelectronics interconnect

    OpenAIRE

    Zhu, Xiaoxin

    2014-01-01

    Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly and packaging industry as electronics components and interconnects get smaller and smaller. According...

  6. A one-semester course in modeling of VSLI interconnections

    CERN Document Server

    Goel, Ashok

    2015-01-01

    Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

  7. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    KAUST Repository

    Qaiser, Nadeem

    2017-11-21

    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.

  8. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    KAUST Repository

    Qaiser, Nadeem; Khan, S. M.; Nour, Maha A.; Rehman, M. U.; Rojas, J. P.; Hussain, Muhammad Mustafa

    2017-01-01

    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.

  9. Fuel cell system with interconnect

    Science.gov (United States)

    Goettler, Richard; Liu, Zhien

    2017-12-12

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  10. Policy issues in interconnecting networks

    Science.gov (United States)

    Leiner, Barry M.

    1989-01-01

    To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

  11. Epidemics on interconnected networks

    Science.gov (United States)

    Dickison, Mark; Havlin, S.; Stanley, H. E.

    2012-06-01

    Populations are seldom completely isolated from their environment. Individuals in a particular geographic or social region may be considered a distinct network due to strong local ties but will also interact with individuals in other networks. We study the susceptible-infected-recovered process on interconnected network systems and find two distinct regimes. In strongly coupled network systems, epidemics occur simultaneously across the entire system at a critical infection strength βc, below which the disease does not spread. In contrast, in weakly coupled network systems, a mixed phase exists below βc of the coupled network system, where an epidemic occurs in one network but does not spread to the coupled network. We derive an expression for the network and disease parameters that allow this mixed phase and verify it numerically. Public health implications of communities comprising these two classes of network systems are also mentioned.

  12. Internet printing

    Science.gov (United States)

    Rahgozar, M. Armon; Hastings, Tom; McCue, Daniel L.

    1997-04-01

    The Internet is rapidly changing the traditional means of creation, distribution and retrieval of information. Today, information publishers leverage the capabilities provided by Internet technologies to rapidly communicate information to a much wider audience in unique customized ways. As a result, the volume of published content has been astronomically increasing. This, in addition to the ease of distribution afforded by the Internet has resulted in more and more documents being printed. This paper introduces several axes along which Internet printing may be examined and addresses some of the technological challenges that lay ahead. Some of these axes include: (1) submission--the use of the Internet protocols for selecting printers and submitting documents for print, (2) administration--the management and monitoring of printing engines and other print resources via Web pages, and (3) formats--printing document formats whose spectrum now includes HTML documents with simple text, layout-enhanced documents with Style Sheets, documents that contain audio, graphics and other active objects as well as the existing desktop and PDL formats. The format axis of the Internet Printing becomes even more exciting when one considers that the Web documents are inherently compound and the traversal into the various pieces may uncover various formats. The paper also examines some imaging specific issues that are paramount to Internet Printing. These include formats and structures for representing raster documents and images, compression, fonts rendering and color spaces.

  13. Printed Electronics

    Science.gov (United States)

    Korkut, Sibel (Inventor); Chiang, Katherine S. (Inventor); Crain, John M. (Inventor); Aksay, Ilhan A. (Inventor); Lettow, John S. (Inventor); Chen, Chuan-Hua (Inventor); Prud'Homme, Robert K. (Inventor)

    2018-01-01

    Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed.

  14. Digital printing

    Science.gov (United States)

    Sobotka, Werner K.

    1997-02-01

    Digital printing is described as a tool to replace conventional printing machines completely. Still this goal was not reached until now with any of the digital printing technologies to be described in the paper. Productivity and costs are still the main parameters and are not really solved until now. Quality in digital printing is no problem anymore. Definition of digital printing is to transfer digital datas directly on the paper surface. This step can be carried out directly or with the use of an intermediate image carrier. Keywords in digital printing are: computer- to-press; erasable image carrier; image carrier with memory. Digital printing is also the logical development of the new digital area as it is pointed out in Nicholas Negropotes book 'Being Digital' and also the answer to networking and Internet technologies. Creating images text and color in one country and publishing the datas in another country or continent is the main advantage. Printing on demand another big advantage and last but not least personalization the last big advantage. Costs and being able to coop with this new world of prepress technology is the biggest disadvantage. Therefore the very optimistic growth rates for the next few years are really nonexistent. The development of complete new markets is too slow and the replacing of old markets is too small.

  15. Flex-prints for the Mu3e experiment

    Energy Technology Data Exchange (ETDEWEB)

    Dittmeier, Sebastian [Physikalisches Institut, Universitaet Heidelberg (Germany); Collaboration: Mu3e-Collaboration

    2016-07-01

    Mu3e is a novel experiment dedicated to the search for the charged lepton flavor violating decay μ{sup +} → e{sup +}e{sup -}e{sup +} with a targeted sensitivity of a branching ratio (BR) down to 10{sup -16}. Within the standard model of particle physics this process is extremely suppressed to BR<10{sup -54}. Thus, any observation would be a clear sign for new physics beyond the standard model. The Mu3e detector consists of a silicon pixel tracking detector using the novel HV-MAPS (High Voltage Monolithic Active Pixel Sensor) technology to measure the momentum of the decay products, and scintillating fibres and tiles for precise timing. The pixel sensors are thinned to 50 μ m to achieve a material budget of about 0.1% radiation length per tracking layer. The pixel sensors are powered and connected to readout frontend boards using custom designed flex-prints, which are low material interconnects with a high signal density. We present studies of high speed data transmission up to 3.2 Gb/s over flex-print prototypes produced in-house. The design of the flex-prints for the Mu3e detector will be discussed. A 3-layer design including power, ground and slow control distribution, as well as 9 1.25 Gb/s data transmission lines for the readout of the pixel sensors is foreseen.

  16. Thermoelectric Coolers with Sintered Silver Interconnects

    Science.gov (United States)

    Kähler, Julian; Stranz, Andrej; Waag, Andreas; Peiner, Erwin

    2014-06-01

    The fabrication and performance of a sintered Peltier cooler (SPC) based on bismuth telluride with sintered silver interconnects are described. Miniature SPC modules with a footprint of 20 mm2 were assembled using pick-and-place pressure-assisted silver sintering at low pressure (5.5 N/mm2) and moderate temperature (250°C to 270°C). A modified flip-chip bonder combined with screen/stencil printing for paste transfer was used for the pick-and-place process, enabling high positioning accuracy, easy handling of the tiny bismuth telluride pellets, and immediate visual process control. A specific contact resistance of (1.4 ± 0.1) × 10-5 Ω cm2 was found, which is in the range of values reported for high-temperature solder interconnects of bismuth telluride pellets. The realized SPCs were evaluated from room temperature to 300°C, considerably outperforming the operating temperature range of standard commercial Peltier coolers. Temperature cycling capability was investigated from 100°C to 235°C over more than 200 h, i.e., 850 cycles, during which no degradation of module resistance or cooling performance occurred.

  17. Review of Recent Inkjet-Printed Capacitive Tactile Sensors

    Directory of Open Access Journals (Sweden)

    Ahmed Salim

    2017-11-01

    Full Text Available Inkjet printing is an advanced printing technology that has been used to develop conducting layers, interconnects and other features on a variety of substrates. It is an additive manufacturing process that offers cost-effective, lightweight designs and simplifies the fabrication process with little effort. There is hardly sufficient research on tactile sensors and inkjet printing. Advancements in materials science and inkjet printing greatly facilitate the realization of sophisticated tactile sensors. Starting from the concept of capacitive sensing, a brief comparison of printing techniques, the essential requirements of inkjet-printing and the attractive features of state-of-the art inkjet-printed tactile sensors developed on diverse substrates (paper, polymer, glass and textile are presented in this comprehensive review. Recent trends in inkjet-printed wearable/flexible and foldable tactile sensors are evaluated, paving the way for future research.

  18. Plasmonic colour laser printing

    DEFF Research Database (Denmark)

    Zhu, Xiaolong; Vannahme, Christoph; Højlund-Nielsen, Emil

    2016-01-01

    -beam lithography (EBL) or focused ion beam (FIB), both expensive and not scalable processes that are not suitable for post-processing customization. Here we show a method of colour printing on nanoimprinted plasmonic metasurfaces using laser post-writing. Laser pulses induce transient local heat generation...... that leads to melting and reshaping of the imprinted nanostructures. Depending on the laser pulse energy density, different surface morphologies that support different plasmonic resonances leading to different colour appearances can be created. Using this technique we can print all primary colours...

  19. Copper Nanowire Production for Interconnect Applications

    Science.gov (United States)

    Han, Jin-Woo (Inventor); Meyyappan, Meyya (Inventor)

    2014-01-01

    A method of fabricating metallic Cu nanowires with lengths up to about 25 micrometers and diameters in a range 20-100 nanometers, or greater if desired. Vertically oriented or laterally oriented copper oxide structures (CuO and/or Cu2O) are grown on a Cu substrate. The copper oxide structures are reduced with 99+ percent H or H2, and in this reduction process the lengths decrease (to no more than about 25 micrometers), the density of surviving nanostructures on a substrate decreases, and the diameters of the surviving nanostructures have a range, of about 20-100 nanometers. The resulting nanowires are substantially pure Cu and can be oriented laterally (for local or global interconnects) or can be oriented vertically (for standard vertical interconnects).

  20. Accurate Modeling Method for Cu Interconnect

    Science.gov (United States)

    Yamada, Kenta; Kitahara, Hiroshi; Asai, Yoshihiko; Sakamoto, Hideo; Okada, Norio; Yasuda, Makoto; Oda, Noriaki; Sakurai, Michio; Hiroi, Masayuki; Takewaki, Toshiyuki; Ohnishi, Sadayuki; Iguchi, Manabu; Minda, Hiroyasu; Suzuki, Mieko

    This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully, incorporated and universally expressed. In addition, we have developed specific test patterns for the model parameters extraction, and an efficient extraction flow. We have extracted the model parameters for 0.15μm CMOS using this method and confirmed that 10%τpd error normally observed with conventional LPE (Layout Parameters Extraction) was completely dissolved. Moreover, it is verified that the model can be applied to more advanced technologies (90nm, 65nm and 55nm CMOS). Since the interconnect delay variations due to the processes constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

  1. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  2. Location constrained resource interconnection

    International Nuclear Information System (INIS)

    Hawkins, D.

    2008-01-01

    This presentation discussed issues related to wind integration from the perspective of the California Independent System Operator (ISO). Issues related to transmission, reliability, and forecasting were reviewed. Renewable energy sources currently used by the ISO were listed, and details of a new transmission financing plan designed to address the location constraints of renewable energy sources and provide for new transmission infrastructure was presented. The financing mechanism will be financed by participating transmission owners through revenue requirements. New transmission interconnections will include network facilities and generator tie-lines. Tariff revisions have also been implemented to recover the costs of new facilities and generators. The new transmission project will permit wholesale transmission access to areas where there are significant energy resources that are not transportable. A rate impact cap of 15 per cent will be imposed on transmission owners to mitigate short-term costs to ratepayers. The presentation also outlined energy resource area designation plans, renewable energy forecasts, and new wind technologies. Ramping issues were also discussed. It was concluded that the ISO expects to ensure that 20 per cent of its energy will be derived from renewable energy sources. tabs., figs

  3. Area array interconnection handbook

    CERN Document Server

    Totta, Paul A

    2012-01-01

    Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later famil...

  4. The best printing methods to print satellite images

    Directory of Open Access Journals (Sweden)

    G.A. Yousif

    2011-12-01

    In this paper different printing systems were used to print an image of SPOT-4 satellite, caver part of Sharm Elshekh area, Sinai, Egypt, on the same type of paper as much as possible, especially in the photography. This step is followed by measuring the experimental data, and analyzed colors to determine the best printing systems for satellite image printing data. The laser system is the more printing system where produce a wider range of color and highest densities of ink and access much color detail. Followed by the offset system which it recorded the best dot gain. Moreover, the study shows that it can use the advantages of each method according to the satellite image color and quantity to be produced.

  5. Optics vs copper: from the perspective of "Thunderbolt" interconnect technology

    Science.gov (United States)

    Cheng, Hengju; Krause, Christine; Ko, Jamyuen; Gao, Miaobin; Liu, Guobin; Wu, Huichin; Qi, Mike; Lam, Chun-Chit

    2013-02-01

    Interconnect technology has been progressed at a very fast pace for the past decade. The signaling rates have steadily increased from 100:Mb/s to 25Gb/s. In every generation of interconnect technology evolution, optics always seems to take over at first, however, at the end, the cost advantage of copper wins over. Because of this, optical interconnects are limited to longer distance links where the attenuation in copper cable is too large for the integrated circuits to compensate. Optical interconnect has long been viewed as the premier solution in compared with copper interconnect. With the release of Thunderbolt technology, we are entering a new era in consumer electronics that runs at 10Gb/s line rate (20Gb/s throughput per connector interface). Thunderbolt interconnect technology includes both active copper cables and active optical cables as the transmission media which have very different physical characteristics. In order for optics to succeed in consumer electronics, several technology hurdles need to be cleared. For example, the optical cable needs to handle the consumer abuses such as pinch and bend. Also, the optical engine used in the active optical cable needs to be physically very small so that we don't change the looks and feels of the cable/connector. Most importantly, the cost of optics needs to come down significantly to effectively compete with the copper solution. Two interconnect technologies are compared and discussed on the relative cost, power consumption, form factor, density, and future scalability.

  6. Interconnecting heterogeneous database management systems

    Science.gov (United States)

    Gligor, V. D.; Luckenbaugh, G. L.

    1984-01-01

    It is pointed out that there is still a great need for the development of improved communication between remote, heterogeneous database management systems (DBMS). Problems regarding the effective communication between distributed DBMSs are primarily related to significant differences between local data managers, local data models and representations, and local transaction managers. A system of interconnected DBMSs which exhibit such differences is called a network of distributed, heterogeneous DBMSs. In order to achieve effective interconnection of remote, heterogeneous DBMSs, the users must have uniform, integrated access to the different DBMs. The present investigation is mainly concerned with an analysis of the existing approaches to interconnecting heterogeneous DBMSs, taking into account four experimental DBMS projects.

  7. Printed photodetectors

    International Nuclear Information System (INIS)

    Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

    2015-01-01

    Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems. (paper)

  8. Printed photodetectors

    Science.gov (United States)

    Pace, Giuseppina; Grimoldi, Andrea; Sampietro, Marco; Natali, Dario; Caironi, Mario

    2015-10-01

    Photodetectors convert light pulses into electrical signals and are fundamental building blocks for any opto-electronic system adopting light as a probe or information carrier. They have widespread technological applications, from telecommunications to sensors in industrial, medical and civil environments. Further opportunities are plastic short-range communications systems, interactive large-area surfaces and light-weight, flexible, digital imagers. These applications would greatly benefit from the cost-effective fabrication processes enabled by printing technology. While organic semiconductors are the most investigated materials for printed photodetectors, and are the main focus of the present review, there are notable examples of other inorganic or hybrid printable semiconductors for opto-electronic systems, such as quantum-dots and nanowires. Here we propose an overview on printed photodetectors, including three-terminal phototransistors. We first give a brief account of the working mechanism of these light sensitive devices, and then we review the recent progress achieved with scalable printing techniques such as screen-printing, inkjet and other non-contact technologies in the development of all-printed or hybrid systems.

  9. Optoelectronic interconnects for 3D wafer stacks

    Science.gov (United States)

    Ludwig, David; Carson, John C.; Lome, Louis S.

    1996-01-01

    Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

  10. Universal Interconnection Technology Workshop Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    Sheaffer, P.; Lemar, P.; Honton, E. J.; Kime, E.; Friedman, N. R.; Kroposki, B.; Galdo, J.

    2002-10-01

    The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology, approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.

  11. Printed Electronics

    Science.gov (United States)

    Wade, Jessica; Hollis, Joseph Razzell; Wood, Sebastian

    2018-04-01

    The combination of printing technology with manufacturing electronic devices enables a new paradigm of printable electronics, where 'smart' functionality can be readily incorporated into almost any product at low cost. Over recent decades, rapid progress has been made in this field, which is now emerging into the industrial andcommercial realm. However, successful development and commercialisation on a large scale presents some significant technical challenges. For fully-printable electronic systems, all the component parts must be deposited from solutions (inks), requiring the development of new inorganic, organic and hybrid materials.A variety of traditional printing techniques are being explored and adapted forprinting these new materials in ways that result in the best performing electronicdevices. Whilst printed electronics research has initially focused on traditional typesof electronic device such as light-emitting diodes, transistors, and photovoltaics, it is increasingly apparent that a much wider range of applications can be realised. The soft and stretchable nature of printable materials makes them perfect candidates forbioelectronics, resulting in a wealth of research looking at biocompatible printable inks and biosensors. Regardless of application, the properties of printed electronicmaterials depend on the chemical structures, processing conditions, device architecture,and operational conditions, the complex inter-relationships of which aredriving ongoing research. We focus on three particular 'hot topics', where attention is currently focused: novel materials, characterisation techniques, and device stability. With progress advancing very rapidly, printed electronics is expected to grow over the next decade into a key technology with an enormous economic and social impact.

  12. Misalignment corrections in optical interconnects

    Science.gov (United States)

    Song, Deqiang

    Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

  13. Modular cryogenic interconnects for multi-qubit devices

    Energy Technology Data Exchange (ETDEWEB)

    Colless, J. I.; Reilly, D. J., E-mail: david.reilly@sydney.edu.au [ARC Centre of Excellence for Engineered Quantum Systems, School of Physics, The University of Sydney, Sydney, NSW 2006 (Australia)

    2014-11-15

    We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with −3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.

  14. Manufacturing of planar ceramic interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  15. Customizing digital printing for fine art practice

    Science.gov (United States)

    Parraman, Carinna E.; Thirkell, Paul; Hoskins, Steve; Wang, Hong Qiang; Laidler, Paul

    2005-01-01

    The presentation will demonstrate how through alternative methods of digital print production the Centre for Fine Print Research (CFPR) is developing methodologies for digital printing that attempt to move beyond standard reproductive print methods. Profiling is used for input and output hardware, along with bespoke profiling for fine art printmaking papers. Examples of artist's work, and examples from the Perpetual Portfolio are included - an artist in residence scheme for selected artists wanting to work at the Centre and to make a large-format digital print. Colour is an important issue: colour fidelity, colour density on paper, colour that can be achieved through multiple-pass printing. Research is also underway to test colour shortfalls in the current inkjet ink range, and to extend colour through the use of traditional printing inks.

  16. Cellular structures with interconnected microchannels

    Science.gov (United States)

    Shaefer, Robert Shahram; Ghoniem, Nasr M.; Williams, Brian

    2018-01-30

    A method for fabricating a cellular tritium breeder component includes obtaining a reticulated carbon foam skeleton comprising a network of interconnected ligaments. The foam skeleton is then melt-infiltrated with a tritium breeder material, for example, lithium zirconate or lithium titanate. The foam skeleton is then removed to define a cellular breeder component having a network of interconnected tritium purge channels. In an embodiment the ligaments of the foam skeleton are enlarged by adding carbon using chemical vapor infiltration (CVI) prior to melt-infiltration. In an embodiment the foam skeleton is coated with a refractory material, for example, tungsten, prior to melt infiltration.

  17. 3D Printing of Ball Grid Arrays

    Science.gov (United States)

    Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

    Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

  18. Fusion-bonded fluidic interconnects

    NARCIS (Netherlands)

    Fazal, I.; Elwenspoek, Michael Curt

    2008-01-01

    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are

  19. Nanophotonic Devices for Optical Interconnect

    DEFF Research Database (Denmark)

    Van Thourhout, D.; Spuesens, T.; Selvaraja, S.K.

    2010-01-01

    We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity...... of the passive routing circuits and their thermal tuning. Finally, we discuss the performance of a wavelength selective detector....

  20. Regulatory Issues Surrounding Merchant Interconnection

    International Nuclear Information System (INIS)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections

  1. Regulatory Issues Surrounding Merchant Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert [Office for Energy Regulation (DTe), The Hague (Netherlands)

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections.

  2. Local Network Wideband Interconnection Alternatives.

    Science.gov (United States)

    1984-01-01

    signal. 3.2.2 Limitations Although satellites offer the advantages of insensitivity to distance, point-to-multipoint communication capability and...Russell, the CATV franchisee for the town of Bedford, has not yit set rates for leasing channels on their network. If this network were interconnected

  3. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observ...

  4. A multimaterial electrohydrodynamic jet (E-jet) printing system

    International Nuclear Information System (INIS)

    Sutanto, E; Shigeta, K; Kim, Y K; Graf, P G; Hoelzle, D J; Barton, K L; Alleyne, A G; Ferreira, P M; Rogers, J A

    2012-01-01

    Electrohydrodynamic jet (E-jet) printing has emerged as a high-resolution alternative to other forms of direct solution-based fabrication approaches, such as ink-jet printing. This paper discusses the design, integration and operation of a unique E-jet printing platform. The uniqueness lies in the ability to utilize multiple materials in the same overall print-head, thereby enabling increased degrees of heterogeneous integration of different functionalities on a single substrate. By utilizing multiple individual print-heads, with a carrousel indexing among them, increased material flexibility is achieved. The hardware design and system operation for a relatively inexpensive system are developed and presented. Crossover interconnects and multiple fluorescent tagged proteins, demonstrating printed electronics and biological sensing applications, respectively. (paper)

  5. Digital Textile Printing

    OpenAIRE

    Moltchanova, Julia

    2011-01-01

    Rapidly evolving technology of digital printing opens new opportunities on many markets. One of them is the printed fabric market where printing companies as well as clients benefit from new printing methods. This thesis focuses on the digital textile printing technology and its implementation for fabric-on-demand printing service in Finland. The purpose of this project was to study the technology behind digital textile printing, areas of application of this technology, the requirements ...

  6. Digital Inkjet Textile Printing

    OpenAIRE

    Wang, Meichun

    2017-01-01

    Digital inkjet textile printing is an emerging technology developed with the rise of the digital world. It offers a possibility to print high-resolution images with unlimited color selection on fabrics. Digital inkjet printing brings a revolutionary chance for the textile printing industry. The history of textile printing shows the law how new technology replaces the traditional way of printing. This indicates the future of digital inkjet textile printing is relatively positive. Differen...

  7. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  8. Quantitative analysis and optimization of gravure printed metal ink, dielectric, and organic semiconductor films.

    Science.gov (United States)

    Higgins, Stuart G; Boughey, Francesca L; Hills, Russell; Steinke, Joachim H G; Muir, Beinn V O; Campbell, Alasdair J

    2015-03-11

    Here we demonstrate the optimization of gravure printed metal ink, dielectric, and semiconductor formulations. We present a technique for nondestructively imaging printed films using a commercially available flatbed scanner, combined with image analysis to quantify print behavior. Print speed, cliché screen density, nip pressure, the orientation of print structures, and doctor blade extension were found to have a significant impact on the quality of printed films, as characterized by the spreading of printed structures and variation in print homogeneity. Organic semiconductor prints were observed to exhibit multiple periodic modulations, which are correlated to the underlying cell structure.

  9. All-zigzag graphene nanoribbons for planar interconnect application

    Science.gov (United States)

    Chen, Po-An; Chiang, Meng-Hsueh; Hsu, Wei-Chou

    2017-07-01

    A feasible "lightning-shaped" zigzag graphene nanoribbon (ZGNR) structure for planar interconnects is proposed. Based on the density functional theory and non-equilibrium Green's function, the electron transport properties are evaluated. The lightning-shaped structure increases significantly the conductance of the graphene interconnect with an odd number of zigzag chains. This proposed technique can effectively utilize the linear I-V characteristic of asymmetric ZGNRs for interconnect application. Variability study accounting for width/length variation and the edge effect is also included. The transmission spectra, transmission eigenstates, and transmission pathways are analyzed to gain the physical insights. This lightning-shaped ZGNR enables all 2D material-based devices and circuits on flexible and transparent substrates.

  10. 47 CFR 90.477 - Interconnected systems.

    Science.gov (United States)

    2010-10-01

    ... part and medical emergency systems in the 450-470 MHz band, interconnection will be permitted only... operating on frequencies in the bands below 800 MHz are not subject to the interconnection provisions of...

  11. Series-Interconnected Plastic Dye-Sensitized Solar Cells Prepared by Low- Temperature Binder-Free Titania Paste

    Directory of Open Access Journals (Sweden)

    Erlyta Septa Rosa

    2014-10-01

    Full Text Available The aim of this research is to study dye-sensitized solar cells (DSSC. This was implemented on a flexible polyethylene terephthalate (PET substrate using a mixture of transparent and scattered mesoporous anatase-titania as the electron transport layer for the photoelectrode. This mixture of anatase titania performed a dual function of light scattering and efficient dye absorption. In this study, a porous nano-TiO2 film was prepared on indium tin oxide (ITO coated polyethylene terephthalate (PET by using a binder-free titania paste; on it, a DSSC was fabricated. The paste which contained a mixture of TiO2 nanoparticles, acid chloride, and ethanol was printed on two patterns of 1x6 cm2 active areas followed by sintered at 120 ºC to form TiO2 films. A commercial dye, N719, was adsorbed on the surface of TiO2 films and assembled to two platinized conductive plastic patterns to form a counter electrode and thus a sandwich-type dye cell. Finally, a solution of KI/I2 electrolytes was injected into the cell in which a couple of sandwich-type dye cells with an active area of 6 cm2 for each cell were series interconnected with a z-type interconnection between the photoelectrode of one cell and the counter electrode of another cell. The cell performance was characterized by employing simulated solar light at an intensity of 50 mW/cm2. The results showed interconnected cells generating a short-circuit photocurrent density of 2.34 mA/cm2, an open-circuit voltage of 1.10 volt, and overall 0.172% power conversion efficiency.

  12. Fusion-bonded fluidic interconnects

    International Nuclear Information System (INIS)

    Fazal, I; Elwenspoek, M C

    2008-01-01

    A new approach to realize fluidic interconnects based on the fusion bonding of glass tubes with silicon is presented. Fusion bond strength analyses have been carried out. Experiments with plain silicon wafers and coated with silicon oxide and silicon nitride are performed. The obtained results are discussed in terms of the homogeneity and strength of fusion bond. High pressure testing shows that the bond strength is large enough for most applications of fluidic interconnects. The bond strength for 525 µm thick silicon, with glass tubes having an outer diameter of 6 mm and with a wall thickness of 2 mm, is more than 60 bars after annealing at a temperature of 800 °C

  13. System interconnection studies using WASP

    Energy Technology Data Exchange (ETDEWEB)

    Bayrak, Y [Turkish Electricity Generation and Transmission Corp., Ankara (Turkey)

    1997-09-01

    The aim of this paper is to describe the application of WASP as a modelling tool for determining the development of two electric systems with interconnections. A case study has been carried out to determine the possibilities of transfer of baseload energy between Turkey and a neighboring country. The objective of this case study is to determine the amount of energy that can be transferred, variations of Loss Probability (LOLP) and unserved energy, and the cost of additional generation with interconnection. The break-even cost will be determined to obtain the minimum charge rate at which TEAS (Turkish Electricity Generation-Transmission Corp.) needs to sell the energy in order to recover the costs. The minimum charge rate for both capacity and energy will be estimated without considering extra capacity additions, except for the ones needed by the Turkish system alone. (author). 2 figs, 3 tabs.

  14. Multilevel Dual Damascene copper interconnections

    Science.gov (United States)

    Lakshminarayanan, S.

    Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400o

  15. Optical interconnect technologies for high-bandwidth ICT systems

    Science.gov (United States)

    Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

    2016-03-01

    The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

  16. Superconducting Thin-Film Interconnects for Cryogenic Photon Detector Arrays, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Advanced imaging spectrometers for x-ray astronomy will require significant improvements in the high density interconnects between the detector arrays and the first...

  17. Driving Interconnected Networks to Supercriticality

    Directory of Open Access Journals (Sweden)

    Filippo Radicchi

    2014-04-01

    Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

  18. 18 CFR 292.306 - Interconnection costs.

    Science.gov (United States)

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any electric...

  19. Hybrid 3D Printing of Soft Electronics.

    Science.gov (United States)

    Valentine, Alexander D; Busbee, Travis A; Boley, John William; Raney, Jordan R; Chortos, Alex; Kotikian, Arda; Berrigan, John Daniel; Durstock, Michael F; Lewis, Jennifer A

    2017-10-01

    Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  20. In-memory interconnect protocol configuration registers

    Energy Technology Data Exchange (ETDEWEB)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  1. In-memory interconnect protocol configuration registers

    Science.gov (United States)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  2. Epidemic spreading on interconnected networks.

    Science.gov (United States)

    Saumell-Mendiola, Anna; Serrano, M Ángeles; Boguñá, Marián

    2012-08-01

    Many real networks are not isolated from each other but form networks of networks, often interrelated in nontrivial ways. Here, we analyze an epidemic spreading process taking place on top of two interconnected complex networks. We develop a heterogeneous mean-field approach that allows us to calculate the conditions for the emergence of an endemic state. Interestingly, a global endemic state may arise in the coupled system even though the epidemics is not able to propagate on each network separately and even when the number of coupling connections is small. Our analytic results are successfully confronted against large-scale numerical simulations.

  3. Interconnect fatigue design for terrestrial photovoltaic modules

    Science.gov (United States)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1982-03-01

    The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field.

  4. Integrated Optical Interconnect Architectures for Embedded Systems

    CERN Document Server

    Nicolescu, Gabriela

    2013-01-01

    This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

  5. Multi-net optimization of VLSI interconnect

    CERN Document Server

    Moiseev, Konstantin; Wimer, Shmuel

    2015-01-01

    This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

  6. Visualizing interconnections among climate risks

    Science.gov (United States)

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.

    2015-12-01

    It is now widely recognized that climate change is affecting various sectors of the world. Climate change impact on one sector may spread out to other sectors including those seemingly remote, which we call "interconnections of climate risks". While a number of climate risks have been identified in the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5), there has been no attempt to explore their interconnections comprehensively. Here we present a first and most exhaustive visualization of climate risks drawn based on a systematic literature survey. Our risk network diagrams depict that changes in the climate system impact natural capitals (terrestrial water, crop, and agricultural land) as well as social infrastructures, influencing the socio-economic system and ultimately our access to food, water, and energy. Our findings suggest the importance of incorporating climate risk interconnections into impact and vulnerability assessments and call into question the widely used damage function approaches, which address a limited number of climate change impacts in isolation. Furthermore, the diagram is useful to educate decision makers, stakeholders, and general public about cascading risks that can be triggered by the climate change. Socio-economic activities today are becoming increasingly more inter-dependent because of the rapid technological progress, urbanization, and the globalization among others. Equally complex is the ecosystem that is susceptible to climate change, which comprises interwoven processes affecting one another. In the context of climate change, a number of climate risks have been identified and classified according to regions and sectors. These reports, however, did not fully address the inter-relations among risks because of the complexity inherent in this issue. Climate risks may ripple through sectors in the present inter-dependent world, posing a challenge ahead of us to maintain the resilience of the system. It is

  7. Interconnect rise time in superconducting integrating circuits

    International Nuclear Information System (INIS)

    Preis, D.; Shlager, K.

    1988-01-01

    The influence of resistive losses on the voltage rise time of an integrated-circuit interconnection is reported. A distribution-circuit model is used to present the interconnect. Numerous parametric curves are presented based on numerical evaluation of the exact analytical expression for the model's transient response. For the superconducting case in which the series resistance of the interconnect approaches zero, the step-response rise time is longer but signal strength increases significantly

  8. Analysis of 3D Printed Diopside Scaffolds Properties for Tissue Engineering

    Directory of Open Access Journals (Sweden)

    Tingting LIU

    2015-11-01

    Full Text Available Diopside exhibits favorable potential for bone repair on account of the good mechanical performance, bioactivity and biocompatibility. In this paper, diopside scaffolds with high pore interconnectivity were successfully fabricated by laser three-dimensional (3D printing. The microstructure and mechanical performance of the diopside scaffolds were studied. The experimental analysis indicated that diopside particles gradually fused together until a dense structure was built with an energy density increasing in the range between 2.4 and 4.8 J·mm-2. Meanwhile, compressive strength and fracture toughness increased gradually from 5.96 ± 0.88 MPa to 10.87 ± 0.55 MPa. However, mechanical properties decreased due to the appearance of voids when energy density were 5.4 and 6 J·mm-2. Simulated body fluid (SBF tests showed that apatite crystals formed on the diopside scaffolds surface, and the apatite crystals increased with soaking time. Cell culture tests indicated the scaffolds supported the adhesion and growth of MG-63 cells. The study suggested that diopside scaffolds fabricated by laser 3D printing are promising candidates for bone tissue engineering.DOI: http://dx.doi.org/10.5755/j01.ms.21.4.9845

  9. Report on achievements in fiscal 1998. Development of technologies to put photovoltaic power generation systems into practical use - Demonstrative research on photovoltaic power generation system (Study on grid interconnection technique for dispersed photovoltaic systems under high-density connection); 1998 nendo taiyoko hatsuden system jitsuyoka gijutsu kaihatsu seika hokokusho. Taiyoko hatsuden system no jissho kenkyu (komitsudo renkei gijutsu no kenkyu)

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    1999-03-01

    Interconnecting photovoltaic systems with power transmission systems under high density affects power quality, protection, maintenance and stability of the transmission lines. As measures to deal with this issue, investigations are being made on (1) elucidation of effects imposed on transmission lines, (2) establishment of countermeasure technologies, and (3) technological options leading to higher value addition. In Item (1), with an objective to identify the current status, evaluations were given on prevention of independent operation of commercially available inverters, and on their stabilizing performance against system fluctuation. The evaluations were performed by conducting a test for multiple unit operation in parallel and a single unit performance test. The test result indicated that, while the prevention performance can be satisfied, maloperation has occurred frequently due to the system fluctuation, and that voltage rise due to the inverter was suppressed effectively by using the simultaneous control of active and reactive powers. In Item (2), a demonstration test was launched on an inverter incorporating a new prevention device. The effective means to suppress voltage rise in the high-voltage power transmission lines is the discrete voltage suppression by controlling reactive power. In addition, a proposal was made on a new voltage and phase detection method that can be used at short circuit of the high-voltage transmission lines. In Item (3), having a photovoltaic system contain a small size batteries was found effective in suppressing the power generation output variation, and in smoothing the loads. (NEDO)

  10. Printed organic thin-film transistor-based integrated circuits

    International Nuclear Information System (INIS)

    Mandal, Saumen; Noh, Yong-Young

    2015-01-01

    Organic electronics is moving ahead on its journey towards reality. However, this technology will only be possible when it is able to meet specific criteria including flexibility, transparency, disposability and low cost. Printing is one of the conventional techniques to deposit thin films from solution-based ink. It is used worldwide for visual modes of information, and it is now poised to enter into the manufacturing processes of various consumer electronics. The continuous progress made in the field of functional organic semiconductors has achieved high solubility in common solvents as well as high charge carrier mobility, which offers ample opportunity for organic-based printed integrated circuits. In this paper, we present a comprehensive review of all-printed organic thin-film transistor-based integrated circuits, mainly ring oscillators. First, the necessity of all-printed organic integrated circuits is discussed; we consider how the gap between printed electronics and real applications can be bridged. Next, various materials for printed organic integrated circuits are discussed. The features of these circuits and their suitability for electronics using different printing and coating techniques follow. Interconnection technology is equally important to make this product industrially viable; much attention in this review is placed here. For high-frequency operation, channel length should be sufficiently small; this could be achievable with a combination of surface treatment-assisted printing or laser writing. Registration is also an important issue related to printing; the printed gate should be perfectly aligned with the source and drain to minimize parasitic capacitances. All-printed organic inverters and ring oscillators are discussed here, along with their importance. Finally, future applications of all-printed organic integrated circuits are highlighted. (paper)

  11. Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

    DEFF Research Database (Denmark)

    Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver

    2008-01-01

    A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment. Integrated fluidic interconnections appear to be a good solution for interconn...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

  12. Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Martin

    2010-01-01

    We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

  13. Chip-Level Electromigration Reliability for Cu Interconnects

    International Nuclear Information System (INIS)

    Gall, M.; Oh, C.; Grinshpon, A.; Zolotov, V.; Panda, R.; Demircan, E.; Mueller, J.; Justison, P.; Ramakrishna, K.; Thrasher, S.; Hernandez, R.; Herrick, M.; Fox, R.; Boeck, B.; Kawasaki, H.; Haznedar, H.; Ku, P.

    2004-01-01

    Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability concerns for most advanced process technologies. Ever increasing operating current densities and the introduction of low-k materials in the backend process scheme are some of the issues that threaten reliable, long-term operation at elevated temperatures. The traditional method of verifying EM reliability only through current density limit checks is proving to be inadequate in general, or quite expensive at the best. A Statistical EM Budgeting (SEB) methodology has been proposed to assess more realistic chip-level EM reliability from the complex statistical distribution of currents in a chip. To be valuable, this approach requires accurate estimation of currents for all interconnect segments in a chip. However, no efficient technique to manage the complexity of such a task for very large chip designs is known. We present an efficient method to estimate currents exhaustively for all interconnects in a chip. The proposed method uses pre-characterization of cells and macros, and steps to identify and filter out symmetrically bi-directional interconnects. We illustrate the strength of the proposed approach using a high-performance microprocessor design for embedded applications as a case study

  14. Network interconnections: an architectural reference model

    NARCIS (Netherlands)

    Butscher, B.; Lenzini, L.; Morling, R.; Vissers, C.A.; Popescu-Zeletin, R.; van Sinderen, Marten J.; Heger, D.; Krueger, G.; Spaniol, O.; Zorn, W.

    1985-01-01

    One of the major problems in understanding the different approaches in interconnecting networks of different technologies is the lack of reference to a general model. The paper develops the rationales for a reference model of network interconnection and focuses on the architectural implications for

  15. Epidemics in interconnected small-world networks

    NARCIS (Netherlands)

    Liu, M.; Li, D.; Qin, P.; Liu, C.; Wang, H.; Wang, F.

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks

  16. Colligation, Or the Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Falster, Peter

    1998-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in pure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  17. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  18. Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

    Science.gov (United States)

    Aggarwal, Ankur

    With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is

  19. Microtexture of Strain in electroplated copper interconnects

    International Nuclear Information System (INIS)

    Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.; Patel, J.R.

    2001-01-01

    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbeam x-ray diffraction (MBXRD) that have enabled measurement not only of the microstructure of totally encapsulated conductors but also of the local stresses in them on a micron and submicron scale. White x-rays from the Advanced Light Source were focused to a micron spot size by Kirkpatrick-Baez mirrors. The sample was stepped under the micro-beam and Laue images obtained at each sample location using a CCD area detector. Microstructure and local strain were deduced from these images. Cu lines with widths ranging from 0.8 mm to 5 mm and thickness of 1 mm were investigated. Comparisons are made between the capabilities of MBXRD and the well established techniques of broad beam XRD, electron back scatter diffraction (EBSD) and focused ion beam imagining (FIB)

  20. 3D High Density mmWave Interconnects, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Nuvotronics has developed and optimized the PolyStrataTM process for the fabrication of intricate microwave and millimeter-wave devices. These devices have primarily...

  1. Integrated optoelectronic materials and circuits for optical interconnects

    International Nuclear Information System (INIS)

    Hutcheson, L.D.

    1988-01-01

    Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

  2. Checking a printed board

    CERN Multimedia

    1977-01-01

    An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

  3. Large Bone Vertical Augmentation Using a Three-Dimensional Printed TCP/HA Bone Graft: A Pilot Study in Dog Mandible

    OpenAIRE

    Carrel, Jean-Pierre; Wiskott, Anselm; Scherrer, Susanne; Durual, Stéphane

    2016-01-01

    Osteoflux is a three-dimensional printed calcium phosphate porous structure for oral bone augmentation. It is a mechanically stable scaffold with a well-defined interconnectivity and can be readily shaped to conform to the bone bed's morphology

  4. Scalable, full-colour and controllable chromotropic plasmonic printing

    Science.gov (United States)

    Xue, Jiancai; Zhou, Zhang-Kai; Wei, Zhiqiang; Su, Rongbin; Lai, Juan; Li, Juntao; Li, Chao; Zhang, Tengwei; Wang, Xue-Hua

    2015-01-01

    Plasmonic colour printing has drawn wide attention as a promising candidate for the next-generation colour-printing technology. However, an efficient approach to realize full colour and scalable fabrication is still lacking, which prevents plasmonic colour printing from practical applications. Here we present a scalable and full-colour plasmonic printing approach by combining conjugate twin-phase modulation with a plasmonic broadband absorber. More importantly, our approach also demonstrates controllable chromotropic capability, that is, the ability of reversible colour transformations. This chromotropic capability affords enormous potentials in building functionalized prints for anticounterfeiting, special label, and high-density data encryption storage. With such excellent performances in functional colour applications, this colour-printing approach could pave the way for plasmonic colour printing in real-world commercial utilization. PMID:26567803

  5. Enhancing Ecoefficiency in Shrimp Farming through Interconnected Ponds

    Directory of Open Access Journals (Sweden)

    Ramón Héctor Barraza-Guardado

    2015-01-01

    Full Text Available The future development of shrimp farming needs to improve its ecoefficiency. The purpose of this study was to evaluate water quality, flows, and nitrogen balance and production parameters on a farm with interconnected pond design to improve the efficiency of the semi-intensive culture of Litopenaeus vannamei ponds. The study was conducted in 21 commercial culture ponds during 180 days at densities of 30–35 ind m−2 and daily water exchange <2%. Our study provides evidence that by interconnecting ponds nutrient recycling is favored by promoting the growth of primary producers of the pond as chlorophyll a. Based on the mass balance and flow of nutrients this culture system reduces the flow of solid, particulate organic matter, and nitrogen compounds to the environment and significantly increases the efficiency of water (5 to 6.5 m3 kg−1 cycle−1, when compared with traditional culture systems. With this culture system it is possible to recover up to 34% of the total nitrogen entering the system, with production in excess of 4,000 kg ha−1 shrimp. We believe that the production system with interconnected ponds is a technically feasible model to improve ecoefficiency production of shrimp farming.

  6. An RLC interconnect analyzable crosstalk model considering self-heating effect

    International Nuclear Information System (INIS)

    Zhu Zhang-Ming; Liu Shu-Bin

    2012-01-01

    According to the thermal profile of actual multilevel interconnects, in this paper we propose a temperature distribution model of multilevel interconnects and derive an analytical crosstalk model for the distributed resistance—inductance—capacitance (RLC) interconnect considering effect of thermal profile. According to the 65-nm complementary metal—oxide semiconductor (CMOS) process, we compare the proposed RLC analytical crosstalk model with the Hspice simulation results for different interconnect coupling conditions and the absolute error is within 6.5%. The computed results of the proposed analytical crosstalk model show that RCL crosstalk decreases with the increase of current density and increases with the increase of insulator thickness. This analytical crosstalk model can be applied to the electronic design automation (EDA) and the design optimization for nanometer CMOS integrated circuits. (interdisciplinary physics and related areas of science and technology)

  7. SSC [Superconducting Super Collider] magnet mechanical interconnections

    International Nuclear Information System (INIS)

    Bossert, R.C.; Niemann, R.C.; Carson, J.A.; Ramstein, W.L.; Reynolds, M.P.; Engler, N.H.

    1989-03-01

    Installation of superconducting accelerator dipole and quadrupole magnets and spool pieces in the SSC tunnel requires the interconnection of the cryostats. The connections are both of an electrical and mechanical nature. The details of the mechanical connections are presented. The connections include piping, thermal shields and insulation. There are seven piping systems to be connected. These systems must carry cryogenic fluids at various pressures or maintain vacuum and must be consistently leak tight. The interconnection region must be able to expand and contract as magnets change in length while cooling and warming. The heat leak characteristics of the interconnection region must be comparable to that of the body of the magnet. Rapid assembly and disassembly is required. The magnet cryostat development program is discussed. Results of quality control testing are reported. Results of making full scale interconnections under magnet test situations are reviewed. 11 figs., 4 tabs

  8. Optical Interconnects for Future Data Center Networks

    CERN Document Server

    Bergman, Keren; Tomkos, Ioannis

    2013-01-01

    Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

  9. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  10. The Interconnections of the LHC Cryomagnets

    CERN Document Server

    Jacquemod, A; Skoczen, Blazej; Tock, J P

    2001-01-01

    The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

  11. Recent Development of SOFC Metallic Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  12. Fabrication method to create high-aspect ratio pillars for photonic coupling of board level interconnects

    Science.gov (United States)

    Debaes, C.; Van Erps, J.; Karppinen, M.; Hiltunen, J.; Suyal, H.; Last, A.; Lee, M. G.; Karioja, P.; Taghizadeh, M.; Mohr, J.; Thienpont, H.; Glebov, A. L.

    2008-04-01

    An important challenge that remains to date in board level optical interconnects is the coupling between the optical waveguides on printed wiring boards and the packaged optoelectronics chips, which are preferably surface mountable on the boards. One possible solution is the use of Ball Grid Array (BGA) packages. This approach offers a reliable attachment despite the large CTE mismatch between the organic FR4 board and the semiconductor materials. Collimation via micro-lenses is here typically deployed to couple the light vertically from the waveguide substrate to the optoelectronics while allowing for a small misalignment between board and package. In this work, we explore the fabrication issues of an alternative approach in which the vertical photonic connection between board and package is governed by a micro-optical pillar which is attached both to the board substrate and to the optoelectronic chips. Such an approach allows for high density connections and small, high-speed detector footprints while maintaining an acceptable tolerance between board and package. The pillar should exhibit some flexibility and thus a high-aspect ratio is preferred. This work presents and compares different fabrication methods and applies different materials for such high-aspect ratio pillars. The different fabrication methods are: photolithography, direct laser writing and deep proton writing. The selection of optical materials that was investigated is: SU8, Ormocers, PU and a multifunctional acrylate polymer. The resulting optical pillars have diameters ranging from 20um up to 80um, with total heights ranging between 30um and 100um (symbol for micron). The aspect-ratio of the fabricated structures ranges from 1.5 to 5.

  13. Epidemics spreading in interconnected complex networks

    International Nuclear Information System (INIS)

    Wang, Y.; Xiao, G.

    2012-01-01

    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  14. Epidemics spreading in interconnected complex networks

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Y. [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Institute of High Performance Computing, Agency for Science, Technology and Research (A-STAR), Singapore 138632 (Singapore); Xiao, G., E-mail: egxxiao@ntu.edu.sg [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)

    2012-09-03

    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  15. Screen-Printing Fabrication and Characterization of Stretchable Electronics.

    Science.gov (United States)

    Suikkola, Jari; Björninen, Toni; Mosallaei, Mahmoud; Kankkunen, Timo; Iso-Ketola, Pekka; Ukkonen, Leena; Vanhala, Jukka; Mäntysalo, Matti

    2016-05-13

    This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-μm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2 mΩ/◽, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag.

  16. Screen-Printing Fabrication and Characterization of Stretchable Electronics

    Science.gov (United States)

    Suikkola, Jari; Björninen, Toni; Mosallaei, Mahmoud; Kankkunen, Timo; Iso-Ketola, Pekka; Ukkonen, Leena; Vanhala, Jukka; Mäntysalo, Matti

    2016-01-01

    This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-μm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2 mΩ/◽, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag. PMID:27173424

  17. Interconnect mechanisms in microelectronic packaging

    Science.gov (United States)

    Roma, Maria Penafrancia C.

    alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

  18. Printing quality control automation

    Science.gov (United States)

    Trapeznikova, O. V.

    2018-04-01

    One of the most important problems in the concept of standardizing the process of offset printing is the control the quality rating of printing and its automation. To solve the problem, a software has been developed taking into account the specifics of printing system components and the behavior in printing process. In order to characterize the distribution of ink layer on the printed substrate the so-called deviation of the ink layer thickness on the sheet from nominal surface is suggested. The geometric data construction the surface projections of the color gamut bodies allows to visualize the color reproduction gamut of printing systems in brightness ranges and specific color sectors, that provides a qualitative comparison of the system by the reproduction of individual colors in a varying ranges of brightness.

  19. Introduction to printed electronics

    CERN Document Server

    Suganuma, Katsuaki

    2014-01-01

    This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

  20. Making PMT halftone prints

    Energy Technology Data Exchange (ETDEWEB)

    Corey, J.D.

    1977-05-01

    In the printing process for technical reports presently used at Bendix Kansas City Division, photographs are reproduced by pasting up PMT halftone prints on the artwork originals. These originals are used to make positive-working plastic plates for offset lithography. Instructions for making good-quality halftone prints using Eastman Kodak's PMT materials and processes are given in this report. 14 figures.

  1. Print and Manuscript

    OpenAIRE

    Erne, Lukas Christian

    2007-01-01

    Positioning Shakespeare at the "crossroads of manuscript and print" and exploring what the choice of print or manuscript reveals about the poet's intended audience and the social persona the poet wanted to assume and fashion, argues that "Shakespeare's authorial self-presentation begins as a poet and, more specifically, as a print-published poet" with the publication of Venus and Adonis in 1593 and the allusion to the publication of Rape of Lucrece in the next year. Yet also considers the imp...

  2. Engraving Print Classification

    International Nuclear Information System (INIS)

    Hoelck, Daniel; Barbe, Joaquim

    2008-01-01

    A print is a mark, or drawing, made in or upon a plate, stone, woodblock or other material which is cover with ink and then is press usually into a paper reproducing the image on the paper. Engraving prints usually are image composed of a group of binary lines, specially those are made with relief and intaglio techniques. Varying the number and the orientation of lines, the drawing of the engraving print is conformed. For this reason we propose an application based on image processing methods to classify engraving prints

  3. Investigation and experimental validation of the contribution of optical interconnects in the SYMPHONIE massively parallel computer

    International Nuclear Information System (INIS)

    Scheer, Patrick

    1998-01-01

    Progress in microelectronics lead to electronic circuits which are increasingly integrated, with an operating frequency and an inputs/outputs count larger than the ones supported by printed circuit board and back-plane technologies. As a result, distributed systems with several boards cannot fully exploit the performance of integrated circuits. In synchronous parallel computers, the situation is worsen since the overall system performances rely on the efficiency of electrical interconnects between the integrated circuits which include the processing elements (PE). The study of a real parallel computer named SYMPHONIE shows for instance that the system operating frequency is far smaller than the capabilities of the microelectronics technology used for the PE implementation. Optical interconnections may cancel these limitations by providing more efficient connections between the PE. Especially, free-space optical interconnections based on vertical-cavity surface-emitting lasers (VCSEL), micro-lens and PIN photodiodes are compatible with the required features of the PE communications. Zero bias modulation of VCSEL with CMOS-compatible digital signals is studied and experimentally demonstrated. A model of the propagation of truncated gaussian beams through micro-lenses is developed. It is then used to optimise the geometry of the detection areas. A dedicated mechanical system is also proposed and implemented for integrating free-space optical interconnects in a standard electronic environment, representative of the one of parallel computer systems. A specially designed demonstrator provides the experimental validation of the above physical concepts. (author) [fr

  4. Development formulation of crafts weaving batik ikat East Java: Strategic block and interconnection

    Directory of Open Access Journals (Sweden)

    Didiek Tranggono

    2015-08-01

    Full Text Available Batik tenun ikat has been the traditional legacy in some areas of East Java. This research is based on the findings and analysis on batik tenun ikat in Kediri and Lamongan. The data were collected from observation, in depth-interview, and printed documentations. The SWOT analysis showed that batik tenun ikat in Kediri and Lamongan got the position number two (2. Thus, the priority strategies are 1 extending partnership, 2 diversification of products and 3 e-marketing and integrated one-web destination. In applying those strategies the need of implementation of strategic block and interconnection is inevitable. Strategic blocs and interconnection would deeply increased the connectivity among the actors and hence between the economic elements.

  5. Cesium reservoir and interconnective components

    International Nuclear Information System (INIS)

    1994-03-01

    The program objective is to demonstrate the technology readiness of a TFE (thermionic fuel element) suitable for use as the basic element in a thermionic reactor with electric power output in the 0.5 to 5.0 MW range. A thermionic converter must be supplied with cesium vapor for two reasons. Cesium atoms adsorbed on the surface of the emitter cause a reduction of the emitter work function to permit high current densities without excessive heating of the emitter. The second purpose of the cesium vapor is to provide space-charge neutralization in the emitter-collector gap so that the high current densities may flow across the gap unattenuated. The function of the cesium reservoir is to provide a source of cesium atoms, and to provide a reserve in the event that cesium is lost from the plasma by any mechanism. This can be done with a liquid cesium metal reservoir in which case it is heated to the desired temperature with auxiliary heaters. In a TFE, however, it is desirable to have the reservoir passively heated by the nuclear fuel. In this case, the reservoir must operate at a temperature intermediate between the emitter and the collector, ruling out the use of liquid reservoirs. Integral reservoirs contained within the TFE will produce cesium vapor pressures in the desired range at typical electrode temperatures. The reservoir material that appears to be the best able to meet requirements is graphite. Cesium intercalates easily into graphite, and the cesium pressure is insensitive to loading for a given intercalation stage. The goals of the cesium reservoir test program were to verify the performance of Cs-graphite reservoirs in the temperature-pressure range of interest to TFE operation, and to test the operation of these reservoirs after exposure to a fast neutron fluence corresponding to seven year mission lifetime. In addition, other materials were evaluated for possible use in the integral reservoir

  6. High-resolution direct 3D printed PLGA scaffolds: print and shrink

    International Nuclear Information System (INIS)

    Chia, Helena N; Wu, Benjamin M

    2015-01-01

    Direct three-dimensional printing (3DP) produces the final part composed of the powder and binder used in fabrication. An advantage of direct 3DP is control over both the microarchitecture and macroarchitecture. Prints which use porogen incorporated in the powder result in high pore interconnectivity, uniform porosity, and defined pore size after leaching. The main limitations of direct 3DP for synthetic polymers are the use of organic solvents which can dissolve polymers used in most printheads and limited resolution due to unavoidable spreading of the binder droplet after contact with the powder. This study describes a materials processing strategy to eliminate the use of organic solvent during the printing process and to improve 3DP resolution by shrinking with a non-solvent plasticizer. Briefly, poly(lactic-co-glycolic acid) (PLGA) powder was prepared by emulsion solvent evaporation to form polymer microparticles. The printing powder was composed of polymer microparticles dry mixed with sucrose particles. After printing with a water-based liquid binder, the polymer microparticles were fused together to form a network by solvent vapor in an enclosed vessel. The sucrose is removed by leaching and the resulting scaffold is placed in a solution of methanol. The methanol acts as a non-solvent plasticizer and allows for polymer chain rearrangement and efficient packing of polymer chains. The resulting volumetric shrinkage is ∼80% at 90% methanol. A complex shape (honey-comb) was designed, printed, and shrunken to demonstrate isotropic shrinking with the ability to reach a final resolution of ∼400 μm. The effect of type of alcohol (i.e. methanol or ethanol), concentration of alcohol, and temperature on volumetric shrinking was studied. This study presents a novel materials processing strategy to overcome the main limitations of direct 3DP to produce high resolution PLGA scaffolds. (paper)

  7. High-resolution direct 3D printed PLGA scaffolds: print and shrink.

    Science.gov (United States)

    Chia, Helena N; Wu, Benjamin M

    2014-12-17

    Direct three-dimensional printing (3DP) produces the final part composed of the powder and binder used in fabrication. An advantage of direct 3DP is control over both the microarchitecture and macroarchitecture. Prints which use porogen incorporated in the powder result in high pore interconnectivity, uniform porosity, and defined pore size after leaching. The main limitations of direct 3DP for synthetic polymers are the use of organic solvents which can dissolve polymers used in most printheads and limited resolution due to unavoidable spreading of the binder droplet after contact with the powder. This study describes a materials processing strategy to eliminate the use of organic solvent during the printing process and to improve 3DP resolution by shrinking with a non-solvent plasticizer. Briefly, poly(lactic-co-glycolic acid) (PLGA) powder was prepared by emulsion solvent evaporation to form polymer microparticles. The printing powder was composed of polymer microparticles dry mixed with sucrose particles. After printing with a water-based liquid binder, the polymer microparticles were fused together to form a network by solvent vapor in an enclosed vessel. The sucrose is removed by leaching and the resulting scaffold is placed in a solution of methanol. The methanol acts as a non-solvent plasticizer and allows for polymer chain rearrangement and efficient packing of polymer chains. The resulting volumetric shrinkage is ∼80% at 90% methanol. A complex shape (honey-comb) was designed, printed, and shrunken to demonstrate isotropic shrinking with the ability to reach a final resolution of ∼400 μm. The effect of type of alcohol (i.e. methanol or ethanol), concentration of alcohol, and temperature on volumetric shrinking was studied. This study presents a novel materials processing strategy to overcome the main limitations of direct 3DP to produce high resolution PLGA scaffolds.

  8. Printing Has a Future

    Directory of Open Access Journals (Sweden)

    Hans Georg Wenke

    2004-12-01

    Full Text Available Printing will also be done in the future. Printed items meet basic needs and are deeply anchored in people’s habits. Being able to handle and collect printed matter is highly attractive. And paper is now more alive than ever. It is therefore too shortsighted to disclaim the importance of one of the still large economic sectors just because of a few looming-recession instigated market shifts.The exciting aspect of drupa 2004 is: printing will be reinvented, so to speak. Much more printing will be done in the future than at present. On the one hand, people are concentrating on process optimization and automation to ensure this. Measuring and testing, process control and optimization, and linking up "office software" with printing technology will be very central topics at drupa 2004. Electronics and print are not rivals; a symbiosis exists. And printing is high-tech: hardly any other multifaceted sector which has been so successful for centuries is as computerized as the printing industry.A series of "new chapters" in the variety of printing possibilities will be opened at drupa. Talk will be generated by further technical developments, often the connection between paper/cardboard and electronics, the link between the office world and graphics industry, text databases and their link-up to graphic page production tools, and "on the fly" dynamic printing over networks.All of this and more belongs to future potentialities, which are so substantial overall, the outlook is by no means black for the "black art". Like its predecessors, drupa 2004 is also a product trade fair. However, more than ever before in its history, it is also an "information village". The exhibits are useful, because they occasionally make what this means visible.

  9. Comprehensive evaluation of global energy interconnection development index

    Science.gov (United States)

    Liu, Lin; Zhang, Yi

    2018-04-01

    Under the background of building global energy interconnection and realizing green and low-carbon development, this article constructed the global energy interconnection development index system which based on the current situation of global energy interconnection development. Through using the entropy method for the weight analysis of global energy interconnection development index, and then using gray correlation method to analyze the selected countries, this article got the global energy interconnection development index ranking and level classification.

  10. Carbon nanotube and graphene nanoribbon interconnects

    CERN Document Server

    Das, Debaprasad

    2014-01-01

    "The book, Caron Nanotube and Graphene Nanoribbon Interconnects, authored by Drs. Debapraad Das and Hafizur Rahaman serves as a good source of material on CNT and GNR interconnects for readers who wish to get into this area and also for practicing engineers who would like to be updated in advances of this field."-Prof. Ashok Srivastava, Louisiana State University, Baton Rouge, USA"Mathematical analysis included in each and every chapter is the main strength of the materials. ... The book is very precise and useful for those who are working in this area. ... highly focused, very compact, and easy to apply. ... This book depicts a detailed analysis and modelling of carbon nanotube and graphene nanoribbon interconnects. The book also covers the electrical circuit modelling of carbon nanotubes and graphene nanoribbons."-Prof. Chandan Kumar Sarkar, Jadavpur University, Kolkata, India.

  11. Packaging and interconnection for superconductive circuitry

    International Nuclear Information System (INIS)

    Anacker, W.

    1976-01-01

    A three dimensional microelectronic module packaged for reduced signal propagation delay times including a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon is described. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconnection wiring to contact the lands of the circuit carrying means. Further interconnecting wiring may take the form of integrated circuit wiring on the reverse side of the supporting means. The low heat dissipation of the superconductive circuitry allows the circuit carrying means to be spaced approximately no less than 30 mils apart. The three dimensional arrangement provides lower random propagation delays than would a planar array of circuits

  12. Full page fax print

    Indian Academy of Sciences (India)

    user

    thesis, i.e., using light energy to fix CO. 2. ) is called ... required to convert polymeric constituents into soluble forms, suitable ... biomass as interconnected mycorrhizal hyphae. ... cellulase, xylanase, pectin methyl esterase, peroxidase and pro-.

  13. Decal electronics for printed high performance cmos electronic systems

    KAUST Repository

    Hussain, Muhammad Mustafa

    2017-11-23

    High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

  14. Silicon photonic IC embedded optical-PCB for high-speed interconnect application

    Science.gov (United States)

    Kallega, Rakshitha; Nambiar, Siddharth; Kumar, Abhai; Ranganath, Praveen; Selvaraja, Shankar Kumar

    2018-02-01

    Optical-Printed Circuit Board (PCB) is an emerging optical interconnect technology to bridge the gap between the board edge and the processing module. The technology so far has been used as a broadband transmitter using polymer waveguides in the PCB. In this paper, we report a Silicon Nitride based photonic IC embedded in the PCB along with the polymers as waveguides in the PCB. The motivation for such integration is to bring routing capability and to reduce the power loss due to broadcasting mode.

  15. Printing Ancient Terracotta Warriors

    Science.gov (United States)

    Gadecki, Victoria L.

    2010-01-01

    Standing in awe in Xian, China, at the Terra Cotta warrior archaeological site, the author thought of sharing this experience and excitement with her sixth-grade students. She decided to let her students carve patterns of the ancient soldiers to understand their place in Chinese history. They would make block prints and print multiple soldiers on…

  16. Print like an Egyptian.

    Science.gov (United States)

    Weisensee, Marilyn

    1990-01-01

    Describes a relief printmaking unit for sixth graders with the objective of decorating the inside of a pyramid. Ancient Egyptian imagery was used to help students become familiar with the style. Students designed and printed linoleum prints in different colors. They then critiqued their work and made their selection for the pyramid. (KM)

  17. Optical interconnect for large-scale systems

    Science.gov (United States)

    Dress, William

    2013-02-01

    This paper presents a switchless, optical interconnect module that serves as a node in a network of identical distribution modules for large-scale systems. Thousands to millions of hosts or endpoints may be interconnected by a network of such modules, avoiding the need for multi-level switches. Several common network topologies are reviewed and their scaling properties assessed. The concept of message-flow routing is discussed in conjunction with the unique properties enabled by the optical distribution module where it is shown how top-down software control (global routing tables, spanning-tree algorithms) may be avoided.

  18. Regulate or deregulate. Influencing network interconnection charges

    Energy Technology Data Exchange (ETDEWEB)

    Van De Wielle, B.

    2003-06-01

    We study the choice between regulating interconnection charges or delegating their determination to the operators, both in a non-mature and a mature market. Three regulatory regimes are considered: full, cost-based and bill-and-keep. Delegation corresponds to bargaining about the interconnection charges using the regulatory schemes as disagreement outcomes. Applying regulation benefits the consumers. Under full regulation, access charges account for asymmetries and allow a unique Ramsey price. Delegation benefits the operators. In a mature market delegation robs the government of any market influence. In a non-mature market government preferences coincide with those of the largest operator and are disadvantageous for entry.

  19. Digital optical interconnects for photonic computing

    Science.gov (United States)

    Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.

    1994-05-01

    A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

  20. 3D printing technologies for electrochemical energy storage

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Feng; Wei, Min; Viswanathan, Vilayanur V.; Swart, Benjamin; Shao, Yuyan; Wu, Gang; Zhou, Chi

    2017-10-01

    Fabrication of electrodes and electrolytes play an important role in promoting the performance of electrochemical energy storage (EES) devices such as batteries and supercapacitors. Traditional fabrication techniques have limited capability in controlling the geometry and architecture of the electrode and solid-state electrolytes, which would otherwise compromise the performance. 3D printing, a disruptive manufacturing technology, has emerged as an innovative approach to fabricating EES devices from nanoscale to macroscale and from nanowatt to megawatt, providing great opportunities to accurately control device geometry (e.g., dimension, porosity, morphology) and structure with enhanced specific energy and power densities. Moreover, the additive manufacturing nature of 3D printing provides excellent controllability of the electrode thickness with much simplified process in a cost effective manner. With the unique spatial and temporal material manipulation capability, 3D printing can integrate multiple nanomaterials in the same print, and multi-functional EES devices (including functional gradient devices) can be fabricated. Herein, we review recent advances in 3D printing of EES devices. We focused on two major 3D printing technologies including direct writing and inkjet printing. The direct material deposition characteristics of these two processes enable them to print on a variety of flat substrates, even a conformal one, well suiting them to applications such as wearable devices and on-chip integrations. Other potential 3D printing techniques such as freeze nano-printing, stereolithography, fused deposition modeling, binder jetting, laminated object manufacturing, and metal 3D printing are also introduced. The advantages and limitations of each 3D printing technology are extensively discussed. More importantly, we provide a perspective on how to integrate the emerging 3D printing with existing technologies to create structures over multiple length scale from

  1. Electrical transport and electromigration studies on nickel encapsulated carbon nanotubes: possible future interconnects

    International Nuclear Information System (INIS)

    Kulshrestha, Neha; Misra, D S; Misra, Abhishek

    2013-01-01

    We nominate the nickel filled multiwalled carbon nanotubes (MWNTs) as potential candidates to cope with challenges in persistent scaling for future interconnect technology. The insights into electrical transport through nickel filled carbon nanotubes provide an effective solution for major performance and reliability issues such as the increasing resistivity of metals at reduced scales, electromigration at high current densities and the problem of diffusion and corrosion faced by the existing copper interconnect technology. Furthermore, the nickel filled MWNTs outperform their hollow counterparts, the unfilled MWNTs, carrying at least one order higher current density, with increased time to failure. The results suggest that metal filled carbon nanotubes can provide a twofold benefit: (1) the metal filling provides an increased density of states for the system leading to a higher current density compared to hollow MWNTs, (2) metal out-diffusion and corrosion is prevented by the surrounding graphitic walls. (paper)

  2. Green interconnecting materials for semiconductor industry

    NARCIS (Netherlands)

    Matin, M.A.; Vellinga, W.P.; Geers, M.G.D.; Sawada, K.; Ishida, M.

    2009-01-01

    Interconnecting materials experience a complex thermo-mechanical load in applications. This may lead to the formation of macroscopic cracks resulting from induced stresses of the differences in thermal expansion coefficients on a sample scale (since different materials are involved) and on a grain

  3. Electric network interconnection of Mashreq Arab Countries

    International Nuclear Information System (INIS)

    El-Amin, I.M.; Al-Shehri, A.M.; Opoku, G.; Al-Baiyat, S.A.; Zedan, F.M.

    1994-01-01

    Power system interconnection is a well established practice for a variety of technical and economical reasons. Several interconnected networks exist worldwide for a number of factors. Some of these networks cross international boundaries. This presentation discusses the future developments of the power systems of Mashreq Arab Countries (MAC). MAC consists of Bahrain, Egypt, Iraq, Jordan, Kuwait, Lebanon, Oman, Qatar, Saudi Arabia, United Arab Emirates (UAE), and Yemen. Mac power systems are operated by government or semigovernment bodies. Many of these countries have national or regional electric grids but are generally isolated from each other. With the exception of Saudi Arabia power systems, which employ 60 Hz, all other MAC utilities use 50 Hz frequency. Each country is served by one utility, except Saudi Arabia, which is served by four major utilities and some smaller utilities serving remote towns and small load centers. The major utilities are the Saudi Consolidated electric Company in the Eastern Province (SCECO East), SCECO Center, SCECO West, and SCECO South. These are the ones considered in this study. The energy resources in MAC are varied. Countries such as Egypt, Iraq, and Syria have significant hydro resources.The gulf countries and Iraq have abundant fossil fuel, The variation in energy resources as well as the characteristics of the electric load make it essential to look into interconnections beyond the national boundaries. Most of the existing or planned interconnections involve few power systems. A study involving 12 countries and over 20 utilities with different characteristics represents a very large scale undertaking

  4. Health and the environment: Examining some interconnections

    International Nuclear Information System (INIS)

    Nair, G.; Castelino, J.; Parr, R.M.

    1994-01-01

    In various ways, the IAEA is working with national and international agencies to broaden scientific understanding of the interconnections between the environment and human health. Often nuclear and related technologies are applied in the search for answers to complex and puzzling questions. This article highlights some of that work, illustrating the dimensions of both the problems and the potential solutions

  5. Systems theory of interconnected port contact systems

    NARCIS (Netherlands)

    Eberard, D.; Maschke, B.M.; Schaft, A.J. van der

    2005-01-01

    Port-based network modeling of a large class of complex physical systems leads to dynamical systems known as port-Hamiltonian systems. The key ingredient of any port-Hamiltonian system is a power-conserving interconnection structure (mathematically formalized by the geometric notion of a Dirac

  6. Experimental demonstration of titanium nitride plasmonic interconnects

    DEFF Research Database (Denmark)

    Kinsey, N.; Ferrera, M.; Naik, G. V.

    2014-01-01

    An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 mu m. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 mu m...

  7. Nominate an Organization | Distributed Generation Interconnection

    Science.gov (United States)

    Collaborative | NREL Nominate an Organization Nominate an Organization Do you know of an organization doing high-quality, innovative work on the interconnection of distributed generation? Want to practices by nominating an organization to be profiled in an online case study! Please include your

  8. Adapting Memory Hierarchies for Emerging Datacenter Interconnects

    Institute of Scientific and Technical Information of China (English)

    江涛; 董建波; 侯锐; 柴琳; 张立新; 孙凝晖; 田斌

    2015-01-01

    Efficient resource utilization requires that emerging datacenter interconnects support both high performance communication and efficient remote resource sharing. These goals require that the network be more tightly coupled with the CPU chips. Designing a new interconnection technology thus requires considering not only the interconnection itself, but also the design of the processors that will rely on it. In this paper, we study memory hierarchy implications for the design of high-speed datacenter interconnects—particularly as they affect remote memory access—and we use PCIe as the vehicle for our investigations. To that end, we build three complementary platforms: a PCIe-interconnected prototype server with which we measure and analyze current bottlenecks; a software simulator that lets us model microarchitectural and cache hierarchy changes;and an FPGA prototype system with a streamlined switchless customized protocol Thunder with which we study hardware optimizations outside the processor. We highlight several architectural modifications to better support remote memory access and communication, and quantify their impact and limitations.

  9. An architectural model for network interconnection

    NARCIS (Netherlands)

    van Sinderen, Marten J.; Vissers, C.A.; Kalin, T.

    1983-01-01

    This paper presents a technique of successive decomposition of a common users' activity to illustrate the problems of network interconnection. The criteria derived from this approach offer a structuring principle which is used to develop an architectural model that embeds heterogeneous subnetworks

  10. Identifying influential spreaders in interconnected networks

    International Nuclear Information System (INIS)

    Zhao, Dawei; Li, Lixiang; Huo, Yujia; Yang, Yixian; Li, Shudong

    2014-01-01

    Identifying the most influential spreaders in spreading dynamics is of the utmost importance for various purposes for understanding or controlling these processes. The existing relevant works are limited to a single network. Most real networks are actually not isolated, but typically coupled and affected by others. The properties of epidemic spreading have recently been found to have some significant differences in interconnected networks from those in a single network. In this paper, we focus on identifying the influential spreaders in interconnected networks. We find that the well-known k-shell index loses effectiveness; some insignificant spreaders in a single network become the influential spreaders in the whole interconnected networks while some influential spreaders become no longer important. The simulation results show that the spreading capabilities of the nodes not only depend on their influence for the network topology, but also are dramatically influenced by the spreading rate. Based on this perception, a novel index is proposed for measuring the influential spreaders in interconnected networks. We then support the efficiency of this index with numerical simulations. (paper)

  11. Electro-optic techniques for VLSI interconnect

    Science.gov (United States)

    Neff, J. A.

    1985-03-01

    A major limitation to achieving significant speed increases in very large scale integration (VLSI) lies in the metallic interconnects. They are costly not only from the charge transport standpoint but also from capacitive loading effects. The Defense Advanced Research Projects Agency, in pursuit of the fifth generation supercomputer, is investigating alternatives to the VLSI metallic interconnects, especially the use of optical techniques to transport the information either inter or intrachip. As the on chip performance of VLSI continues to improve via the scale down of the logic elements, the problems associated with transferring data off and onto the chip become more severe. The use of optical carriers to transfer the information within the computer is very appealing from several viewpoints. Besides the potential for gigabit propagation rates, the conversion from electronics to optics conveniently provides a decoupling of the various circuits from one another. Significant gains will also be realized in reducing cross talk between the metallic routings, and the interconnects need no longer be constrained to the plane of a thin film on the VLSI chip. In addition, optics can offer an increased programming flexibility for restructuring the interconnect network.

  12. Fully Printed Flexible Single-Chip RFID Tag with Light Detection Capabilities

    Directory of Open Access Journals (Sweden)

    Aniello Falco

    2017-03-01

    Full Text Available A printed passive radiofrequency identification (RFID tag in the ultra-high frequency band for light and temperature monitoring is presented. The whole tag has been manufactured by printing techniques on a flexible substrate. Antenna and interconnects are realized with silver nanoparticles via inkjet printing. A sprayed photodetector performs the light monitoring, whereas temperature measurement comes from an in-built sensor in the silicon RFID chip. One of the advantages of this system is the digital read-out and transmission of the sensors information on the RFID tag that ensures reliability. Furthermore, the use of printing techniques allows large-scale manufacturing and the direct fabrication of the tag on the desired surface. This work proves for the first time the feasibility of the embedment of large-scale organic photodetectors onto inkjet printed RFID tags. Here, we solve the problem of integration of different manufacturing techniques to develop an optimal final sensor system.

  13. Operational parameters of an opto-electronic neural network employing fixed planar holographic interconnects

    Science.gov (United States)

    Keller, P. E.; Gmitro, A. F.

    1993-07-01

    A prototype neutral network system of multifaceted, planar interconnection holograms and opto-electronic neurons is analyzed. This analysis shows that a hologram fabricated with electron-beam lithography has the capacity to connect 6700 neuron outputs to 6700 neuron inputs, and that, the encoded synaptic weights have a precision of approximately 5 bits. Higher interconnection densities can be achieved by accepting a lower synaptic weight accuracy. For systems employing laser diodes at the outputs of the neurons, processing rates in the range of 45 to 720 trillion connections per second can potentially be achieved.

  14. Review of Interconnection Practices and Costs in the Western States

    Energy Technology Data Exchange (ETDEWEB)

    Bird, Lori A [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Flores-Espino, Francisco [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Volpi, Christina M [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Ardani, Kristen B [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Manning, David [Western Interstate Energy Board (WIEB); McAllister, Richard [Western Interstate Energy Board (WIEB)

    2018-04-27

    The objective of this report is to evaluate the nature of barriers to interconnecting distributed PV, assess costs of interconnection, and compare interconnection practices across various states in the Western Interconnection. The report addresses practices for interconnecting both residential and commercial-scale PV systems to the distribution system. This study is part of a larger, joint project between the Western Interstate Energy Board (WIEB) and the National Renewable Energy Laboratory (NREL), funded by the U.S. Department of Energy, to examine barriers to distributed PV in the 11 states wholly within the Western Interconnection.

  15. 3D printed plastics for beam modulation in proton therapy

    International Nuclear Information System (INIS)

    Lindsay, C; Hoehr, C; Kumlin, J; Schaffer, P; Jirasek, A; Lee, R; Martinez, D M

    2015-01-01

    Two 3D printing methods, fused filament fabrication (FFF) and PolyJet™ (PJ) were investigated for suitability in clinical proton therapy (PT) energy modulation. Measurements of printing precision, printed density and mean stopping power are presented. FFF is found to be accurate to 0.1 mm, to contain a void fraction of 13% due to air pockets and to have a mean stopping power dependent on geometry. PJ was found to print accurate to 0.05 mm, with a material density and mean stopping power consistent with solid poly(methyl methacrylate) (PMMA). Both FFF and PJ were found to print significant, sporadic defects associated with sharp edges on the order of 0.2 mm. Site standard PT modulator wheels were printed using both methods. Measured depth-dose profiles with a 74 MeV beam show poor agreement between PMMA and printed FFF wheels. PJ printed wheel depth-dose agreed with PMMA within 1% of treatment dose except for a distal falloff discrepancy of 0.5 mm. (note)

  16. Colour printing techniques

    OpenAIRE

    Parraman, C.

    2017-01-01

    Invited chapter in the book Colour Design: Theories and Applications. In PART 3 COLOUR, DESIGN AND COLORATION this chapter covers:\\ud - Hardcopy colour: analogue versus digital\\ud - Colour theory in relation to printing\\ud - Overview of halftoning and digital print technologies\\ud - Overview and development of inks\\ud - Inkjet papers and inks\\ud - Recent and future trends in colour, printing inks and hardware.\\ud \\ud This book differs from other existing books in the field, with the aim of an...

  17. Sound insulation performance of plates with interconnected distributed piezoelectric patches

    Directory of Open Access Journals (Sweden)

    Yi Kaijun

    2017-02-01

    Full Text Available This paper deals with the sound insulation performance of a thin plate with interconnected distributed piezoelectric patches. Piezoelectric patches are periodically bonded on the surfaces of the plate in a collocated fashion, and are interconnected via an inductive circuit network. This piezoelectric system is termed as piezo-electromechanical (PEM plate in the paper. Homogenization methods are involved under a sub-wavelength assumption to analytically develop the dynamical equations for the PEM plate. The dispersion relationships and energy densities of the wave modes propagating in the PEM plate are studied; the sub-wavelength assumption is verified for the simulations in this paper. The coincidence frequency of the PEM plate is researched, and results show that the coincidence frequency of the PEM plate will disappear at certain circumstances; mathematical and physical explanations are made for this phenomenon. The disappearance of the coincidence frequency is used to optimize the value of inductance, for the purpose of improving the sound transmission loss of the PEM plate.

  18. X-Ray Microdiffraction as a Probe to Reveal Flux Divergences in Interconnects

    Science.gov (United States)

    Spolenak, R.; Tamura, N.; Patel, J. R.

    2006-02-01

    Most reliability issues in interconnect systems occur at a local scale and many of them include the local build-up of stresses. Typical failure mechanisms are electromigration and stress voiding in interconnect lines and fatigue in surface acoustic wave devices. Thus a local probe is required for the investigation of these phenomena. In this paper the application of the Laue microdiffraction technique to investigate flux divergences in interconnect systems will be described. The deviatoric strain tensor of single grains can be correlated with the local microstructure, orientation and defect density. Especially the latter led to recent results about the correlation of stress build-up and orientation in Cu lines and electromigration-induced grain rotation in Cu and Al lines.

  19. Printed circuit for ATLAS

    CERN Multimedia

    Laurent Guiraud

    1999-01-01

    A printed circuit board made by scientists in the ATLAS collaboration for the transition radiaton tracker (TRT). This will read data produced when a high energy particle crosses the boundary between two materials with different electrical properties.

  20. Three-Dimensional Printed Graphene Foams.

    Science.gov (United States)

    Sha, Junwei; Li, Yilun; Villegas Salvatierra, Rodrigo; Wang, Tuo; Dong, Pei; Ji, Yongsung; Lee, Seoung-Ki; Zhang, Chenhao; Zhang, Jibo; Smith, Robert H; Ajayan, Pulickel M; Lou, Jun; Zhao, Naiqin; Tour, James M

    2017-07-25

    An automated metal powder three-dimensional (3D) printing method for in situ synthesis of free-standing 3D graphene foams (GFs) was successfully modeled by manually placing a mixture of Ni and sucrose onto a platform and then using a commercial CO 2 laser to convert the Ni/sucrose mixture into 3D GFs. The sucrose acted as the solid carbon source for graphene, and the sintered Ni metal acted as the catalyst and template for graphene growth. This simple and efficient method combines powder metallurgy templating with 3D printing techniques and enables direct in situ 3D printing of GFs with no high-temperature furnace or lengthy growth process required. The 3D printed GFs show high-porosity (∼99.3%), low-density (∼0.015g cm -3 ), high-quality, and multilayered graphene features. The GFs have an electrical conductivity of ∼8.7 S cm -1 , a remarkable storage modulus of ∼11 kPa, and a high damping capacity of ∼0.06. These excellent physical properties of 3D printed GFs indicate potential applications in fields requiring rapid design and manufacturing of 3D carbon materials, for example, energy storage devices, damping materials, and sound absorption.

  1. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  2. Development and operation of interconnections in a restructuring context

    International Nuclear Information System (INIS)

    2003-01-01

    In many countries the electrical network is not fully interconnected and the best technical solution to achieve interconnection has to be found. At the same time the electricity industry is being restructured and interconnecting independent energy markets presents technical challenges. It is therefore timely to consider interconnection development and operation options: examine the benefits of interconnecting electrical networks and the development strategies, review the interconnection design options and the technologies available, identify the operational issues, the security problems of large interconnected systems, the protection issues, consider the impact of the restructuring of the electrical supply industry, assess the political, environmental and social implications of interconnections. reorganized in slovenia from 5-7 april 2004. (author)

  3. National Offshore Wind Energy Grid Interconnection Study Full Report

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  4. 3D Printing of Scaffolds for Tissue Regeneration Applications

    Science.gov (United States)

    Do, Anh-Vu; Khorsand, Behnoush; Geary, Sean M.; Salem, Aliasger K.

    2015-01-01

    The current need for organ and tissue replacement, repair and regeneration for patients is continually growing such that supply is not meeting the high demand primarily due to a paucity of donors as well as biocompatibility issues that lead to immune rejection of the transplant. In an effort to overcome these drawbacks, scientists working in the field of tissue engineering and regenerative medicine have investigated the use of scaffolds as an alternative to transplantation. These scaffolds are designed to mimic the extracellular matrix (ECM) by providing structural support as well as promoting attachment, proliferation, and differentiation with the ultimate goal of yielding functional tissues or organs. Initial attempts at developing scaffolds were problematic and subsequently inspired a growing interest in 3D printing as a mode for generating scaffolds. Utilizing three-dimensional printing (3DP) technologies, ECM-like scaffolds can be produced with a high degree of complexity and precision, where fine details can be included at a micron level. In this review, we discuss the criteria for printing viable and functional scaffolds, scaffolding materials, and 3DP technologies used to print scaffolds for tissue engineering. A hybrid approach, employing both natural and synthetic materials, as well as multiple printing processes may be the key to yielding an ECM-like scaffold with high mechanical strength, porosity, interconnectivity, biocompatibility, biodegradability, and high processability. Creating such biofunctional scaffolds could potentially help to meet the demand by patients for tissues and organs without having to wait or rely on donors for transplantation. PMID:26097108

  5. Characterization of a Cobalt-Tungsten Interconnect

    DEFF Research Database (Denmark)

    Harthøj, Anders; Holt, Tobias; Caspersen, Michael

    2012-01-01

    is to act both as a diffusion barrier for chromium and provide better protection against high temperature oxidation than a pure cobalt coating. This work presents a characterization of a cobalt-tungsten alloy coating electrodeposited on the ferritic steel Crofer 22 H which subsequently was oxidized in air......A ferritic steel interconnect for a solid oxide fuel cell must be coated in order to prevent chromium evaporation from the steel substrate. The Technical University of Denmark and Topsoe Fuel Cell have developed an interconnect coating based on a cobalt-tungsten alloy. The purpose of the coating...... for 300 h at 800 °C. The coating was characterized with Glow Discharge Optical Spectroscopy (GDOES), Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD). The oxidation properties were evaluated by measuring weight change of coated samples of Crofer 22 H and Crofer 22 APU as a function...

  6. Interconnection of bundled solid oxide fuel cells

    Science.gov (United States)

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  7. Si micro photonics for optical interconnection

    International Nuclear Information System (INIS)

    Wada, K.; Ahn, D.H.; Lim, D.R.; Michel, J.; Kimerling, L.C.

    2006-01-01

    This paper reviews current status of silicon microphotonics and the recent prototype of on-chip optical interconnection. Si microphotonics pursues complementary metal oxide semiconductor (CMOS)-compatibility of photonic devices to reduce the materials diversity eventually to integrate on Si chips. Fractal optical H-trees have been implemented on a chip and found to be a technology breakthrough beyond metal interconnection. It has shown that large RC time constants associated with metal can be eliminated at least long distant data communication on a chip, and eventually improve yield and power issues. This has become the world's first electronic and photonic integrated circuits (EPICs) and the possibility of at least 10 GHz clocking for personal computers has been demonstrated

  8. Architecture for on-die interconnect

    Science.gov (United States)

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  9. Development of Interconnect Technologies for Particle Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Tripathi, Mani [Univ. of California, Davis, CA (United States)

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  10. Print Quality of Ink Jet Printed PVC Foils

    Directory of Open Access Journals (Sweden)

    Nemanja Kašiković

    2015-09-01

    Full Text Available Digital printing technique is used for a wide variety of substrates, one of which are PVC foils. Samples used in this research were printed by digital ink jet printing technique using Mimaki JV22 printing machine and J-Eco Subly Nano inks. As printing substrates, two different types of materials were used (ORACAL 640 - Print Vinyl and LG Hausys LP2712. A test card consisting of fields of CMYK colours was created and printed, varying the number of ink layers applied. Samples were exposed to light after the printing process. Spectrophotometric measurements were conducted before and after the light treatment. Based on spectrophotometricaly obtained data, colour differences ΔE2000 were calculated. Results showed that increasing number of layers, as well as the right choice of substrates, can improve the behaviour of printed product during exploitation.

  11. Interconnection of psychology, color and design

    OpenAIRE

    Minchuk, A. M.; Kudryashova, Aleksandra Vladimirovna

    2016-01-01

    The paper presents the direct interconnection between color, design and psychology on the basis of theoretical and historical analysis. It describes the peculiarities of how peopleperceive color. In the paper some of the historical details concerning the way our ancestors used color are presented and the modern scientific discoveries in the field of psychology, which give the evidence of the great psychological, emotional and physical influence of color on a person are shown as well. The pape...

  12. Viewing Integrated-Circuit Interconnections By SEM

    Science.gov (United States)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  13. The first LHC sector is fully interconnected

    CERN Multimedia

    2006-01-01

    Sector 7-8 is the first sector of the LHC to become fully operational. All the magnets, cryogenic line, vacuum chambers and services are interconnected. The cool down of this sector can soon commence. LHC project leader Lyn Evans, the teams from CERN's AT/MCS, AT/VAC and AT/MEL groups, and the members of the IEG consortium celebrate the completion of the first LHC sector. The 10th of November was a red letter day for the LHC accelerator teams, marking the completion of the first sector of the machine. The magnets of sector 7-8, together with the cryogenic line, the vacuum chambers and the distribution feedboxes (DFBs) are now all completely interconnected. Sector 7-8 has thus been closed and is the first LHC sector to become operational. The interconnection work required several thousand electrical, cryogenic and insulating connections to be made on the 210 interfaces between the magnets in the arc, the 30 interfaces between the special magnets and the interfaces with the cryogenic line. 'This represent...

  14. Implementation of interconnect simulation tools in spice

    Science.gov (United States)

    Satsangi, H.; Schutt-Aine, J. E.

    1993-01-01

    Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

  15. The variability of interconnected wind plants

    International Nuclear Information System (INIS)

    Katzenstein, Warren; Fertig, Emily; Apt, Jay

    2010-01-01

    We present the first frequency-dependent analyses of the geographic smoothing of wind power's variability, analyzing the interconnected measured output of 20 wind plants in Texas. Reductions in variability occur at frequencies corresponding to times shorter than ∼24 h and are quantified by measuring the departure from a Kolmogorov spectrum. At a frequency of 2.8x10 -4 Hz (corresponding to 1 h), an 87% reduction of the variability of a single wind plant is obtained by interconnecting 4 wind plants. Interconnecting the remaining 16 wind plants produces only an additional 8% reduction. We use step change analyses and correlation coefficients to compare our results with previous studies, finding that wind power ramps up faster than it ramps down for each of the step change intervals analyzed and that correlation between the power output of wind plants 200 km away is half that of co-located wind plants. To examine variability at very low frequencies, we estimate yearly wind energy production in the Great Plains region of the United States from automated wind observations at airports covering 36 years. The estimated wind power has significant inter-annual variability and the severity of wind drought years is estimated to be about half that observed nationally for hydroelectric power.

  16. Energetic diversification in the interconnected electric system

    International Nuclear Information System (INIS)

    Villanueva M, C.; Beltran M, H.; Serrano G, J.A.

    2007-01-01

    In the interconnected electric system of Mexico the demanded electricity in different timetable periods it is synthesized in the annual curve of load duration, which is characterized by three regions. The energy in every period is quantified according to the under curve areas in each region, which depend of the number of hours in that the power demand exceeds the minimum and the intermediate demands respectively that are certain percentages of the yearly maximum demand. In that context, the generating power stations are dispatched according to the marginal costs of the produced electricity and the electric power to be generated every year by each type of central it is located in some of the regions of the curve of load duration, as they are their marginal costs and their operation characteristic techniques. By strategic reasons it is desirable to diversify the primary energy sources that are used in the national interconnected system to generate the electricity that demand the millions of consumers that there are in Mexico. On one hand, when intensifying the use of renewable sources and of nucleo electric centrals its decrease the import volumes of natural gas, which has very volatile prices and it is a fuel when burning in the power stations produces hothouse gases that are emitted to the atmosphere. On the other hand, when diversifying the installed capacity of the different central types in the interconnected system, a better adaptation of the produced electricity volumes is achieved by each type to the timetable variation, daily, weekly and seasonal of the electric demand, as one manifests this in the curve of load duration. To exemplify a possible diversification plan of the installed capacity in the national interconnected system that includes nucleo electric centrals and those that use renewable energy, charts are presented that project of 2005 at 2015 the capacity, energy and ost of the electricity of different central types, located in each one of the

  17. Algorithms of control parameters selection for automation of FDM 3D printing process

    Directory of Open Access Journals (Sweden)

    Kogut Paweł

    2017-01-01

    Full Text Available The paper presents algorithms of control parameters selection of the Fused Deposition Modelling (FDM technology in case of an open printing solutions environment and 3DGence ONE printer. The following parameters were distinguished: model mesh density, material flow speed, cooling performance, retraction and printing speeds. These parameters are independent in principle printing system, but in fact to a certain degree that results from the selected printing equipment features. This is the first step for automation of the 3D printing process in FDM technology.

  18. Economic and environmental benefits of interconnected systems. The Spanish example

    International Nuclear Information System (INIS)

    Chicharro, A.S.; Dios Alija, R. de

    1996-01-01

    The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author)

  19. Printed Spacecraft Separation System

    Energy Technology Data Exchange (ETDEWEB)

    Dehoff, Ryan R [ORNL; Holmans, Walter [Planetary Systems Corporation

    2016-10-01

    In this project Planetary Systems Corporation proposed utilizing additive manufacturing (3D printing) to manufacture a titanium spacecraft separation system for commercial and US government customers to realize a 90% reduction in the cost and energy. These savings were demonstrated via “printing-in” many of the parts and sub-assemblies into one part, thus greatly reducing the labor associated with design, procurement, assembly and calibration of mechanisms. Planetary Systems Corporation redesigned several of the components of the separation system based on additive manufacturing principles including geometric flexibility and the ability to fabricate complex designs, ability to combine multiple parts of an assembly into a single component, and the ability to optimize design for specific mechanical property targets. Shock absorption was specifically targeted and requirements were established to attenuate damage to the Lightband system from shock of initiation. Planetary Systems Corporation redesigned components based on these requirements and sent the designs to Oak Ridge National Laboratory to be printed. ORNL printed the parts using the Arcam electron beam melting technology based on the desire for the parts to be fabricated from Ti-6Al-4V based on the weight and mechanical performance of the material. A second set of components was fabricated from stainless steel material on the Renishaw laser powder bed technology due to the improved geometric accuracy, surface finish, and wear resistance of the material. Planetary Systems Corporation evaluated these components and determined that 3D printing is potentially a viable method for achieving significant cost and savings metrics.

  20. Printing at CERN

    CERN Multimedia

    Otto, R

    2007-01-01

    For many years CERN had a very sophisticated print server infrastructure which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today’s situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer regis...

  1. CERN printing infrastructure

    International Nuclear Information System (INIS)

    Otto, R; Sucik, J

    2008-01-01

    For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all (∼1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration

  2. Application to printed resistors

    International Nuclear Information System (INIS)

    Hachiyanagi, Yoshimi; Uraki, Hisatsugu; Sawamura, Masashi

    1989-01-01

    Most of printed circuit boards are made at present by etching copper foils which are laminated on insulating composite boards of paper/phenol resin or glass nonwoven fabric/epoxy rein. This is called subtractive process, and since this is a wet process, the problem of coping with the pollution due to etching solution, plating solution and others is involved. As the method of solving this problem, attention has been paid to the dry process which forms conductor patterns by screen printing using electro-conductive paste. For such resin substrates, generally polymer thick films (PTF) using thermosetting resin as the binder are used. Also the research on the formation of resistors, condensers and other parts by printing using the technology of cermet thick films (CTF) and PTF is active, and it is partially put in practical use. The problems are the deformation and deterioration of substrates, therefore, as the countermeasures, electron beam hardening type PTF has been studied, and various pastes have been developed. In this paper, electron beam hardening type printed resistors are reported. The features, resistance paste, and a number of the experiments on printed resistors are described. (K.I.)

  3. CERN printing infrastructure

    Energy Technology Data Exchange (ETDEWEB)

    Otto, R; Sucik, J [CERN, Geneva (Switzerland)], E-mail: Rafal.Otto@cern.ch, E-mail: Juraj.Sucik@cern.ch

    2008-07-15

    For many years CERN had a very sophisticated print server infrastructure [13] which supported several different protocols (AppleTalk, IPX and TCP/IP) and many different printing standards. Today's situation differs a lot: we have a much more homogenous network infrastructure, where TCP/IP is used everywhere and we have less printer models, which almost all work using current standards (i.e. they all provide PostScript drivers). This change gave us the possibility to review the printing architecture aiming at simplifying the infrastructure in order to achieve full automation of the service. The new infrastructure offers both: LPD service exposing print queues to Linux and Mac OS X computers and native printing for Windows based clients. The printer driver distribution is automatic and native on Windows and automated by custom mechanisms on Linux, where the appropriate Foomatic drivers are configured. Also the process of printer registration and queue creation is completely automated following the printer registration in the network database. At the end of 2006 we have moved all ({approx}1200) CERN printers and all users' connections at CERN to the new service. This paper will describe the new architecture and summarize the process of migration.

  4. 3D Printed Photoresponsive Devices Based on Shape Memory Composites.

    Science.gov (United States)

    Yang, Hui; Leow, Wan Ru; Wang, Ting; Wang, Juan; Yu, Jiancan; He, Ke; Qi, Dianpeng; Wan, Changjin; Chen, Xiaodong

    2017-09-01

    Compared with traditional stimuli-responsive devices with simple planar or tubular geometries, 3D printed stimuli-responsive devices not only intimately meet the requirement of complicated shapes at macrolevel but also satisfy various conformation changes triggered by external stimuli at the microscopic scale. However, their development is limited by the lack of 3D printing functional materials. This paper demonstrates the 3D printing of photoresponsive shape memory devices through combining fused deposition modeling printing technology and photoresponsive shape memory composites based on shape memory polymers and carbon black with high photothermal conversion efficiency. External illumination triggers the shape recovery of 3D printed devices from the temporary shape to the original shape. The effect of materials thickness and light density on the shape memory behavior of 3D printed devices is quantified and calculated. Remarkably, sunlight also triggers the shape memory behavior of these 3D printed devices. This facile printing strategy would provide tremendous opportunities for the design and fabrication of biomimetic smart devices and soft robotics. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  5. Crosstalk in modern on-chip interconnects a FDTD approach

    CERN Document Server

    Kaushik, B K; Patnaik, Amalendu

    2016-01-01

    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  6. Carbon nanotubes for interconnects process, design and applications

    CERN Document Server

    Dijon, Jean; Maffucci, Antonio

    2017-01-01

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

  7. Decentralised output feedback control of Markovian jump interconnected systems with unknown interconnections

    Science.gov (United States)

    Li, Li-Wei; Yang, Guang-Hong

    2017-07-01

    The problem of decentralised output feedback control is addressed for Markovian jump interconnected systems with unknown interconnections and general transition rates (TRs) allowed to be unknown or known with uncertainties. A class of decentralised dynamic output feedback controllers are constructed, and a cyclic-small-gain condition is exploited to dispose the unknown interconnections so that the resultant closed-loop system is stochastically stable and satisfies an H∞ performance. With slack matrices to cope with the nonlinearities incurred by unknown and uncertain TRs in control synthesis, a novel controller design condition is developed in linear matrix inequality formalism. Compared with the existing works, the proposed approach leads to less conservatism. Finally, two examples are used to illustrate the effectiveness of the new results.

  8. A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

    Science.gov (United States)

    2014-05-19

    complete our senses and enhance our performances. As we see some sparks of efforts appearing in the markets such as vending machines by mood, soft...Tapthimthong for assistance with the bending cycling setup at the machine shop of the Institut fuer Mikroproduktionstechnik at Leibniz Universitaet...making use of the lotus effect, the epoxy resin does not wet PTFE, and the ring can be removed effortlessly. Besides, the resin is non-filled, and

  9. High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

    NARCIS (Netherlands)

    Kouters, M.H.M.; Ubachs, R.; Wiel, H.J. van de; Waal, A. van der; Veer, J. van der

    2011-01-01

    Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic

  10. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    International Nuclear Information System (INIS)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; Hummelgård, Magnus; Olin, Håkan; Hummelgård, Christine

    2014-01-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  11. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    Science.gov (United States)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  12. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    Energy Technology Data Exchange (ETDEWEB)

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik [Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Magnus; Olin, Håkan [Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Christine [Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

  13. Computer Security: Printing confidentially

    CERN Document Server

    Stefan Lueders, Computer Security Team

    2015-01-01

    Have you ever hesitated to print a confidential document using CERN printers? Or perhaps you have rushed quickly to the printer after hitting the “print” button in order to avoid someone else getting hold of and reading your document? These times are over now with the new printing infrastructure!   Indeed, many of us regularly print out confidential documents like our salary slips, MARS forms, tendering documents and drafts of preliminary papers. The upcoming CERN data protection policy will require all of us to respect the confidentiality of such documents and, as the word “confidential” implies, access to “confidential” or sensitive documents will be tightly controlled. What can we do about the public printers located in many buildings, floors and shared spaces - accessible not only to CERN staff and users but also to visitors and guests? Some printers are located in the vicinity of restaurants, cafeterias or close to paths taken b...

  14. Effect of layer thickness and printing orientation on mechanical properties and dimensional accuracy of 3D printed porous samples for bone tissue engineering.

    Directory of Open Access Journals (Sweden)

    Arghavan Farzadi

    Full Text Available Powder-based inkjet 3D printing method is one of the most attractive solid free form techniques. It involves a sequential layering process through which 3D porous scaffolds can be directly produced from computer-generated models. 3D printed products' quality are controlled by the optimal build parameters. In this study, Calcium Sulfate based powders were used for porous scaffolds fabrication. The printed scaffolds of 0.8 mm pore size, with different layer thickness and printing orientation, were subjected to the depowdering step. The effects of four layer thicknesses and printing orientations, (parallel to X, Y and Z, on the physical and mechanical properties of printed scaffolds were investigated. It was observed that the compressive strength, toughness and Young's modulus of samples with 0.1125 and 0.125 mm layer thickness were more than others. Furthermore, the results of SEM and μCT analyses showed that samples with 0.1125 mm layer thickness printed in X direction have more dimensional accuracy and significantly close to CAD software based designs with predefined pore size, porosity and pore interconnectivity.

  15. Colour print workflow and methods for multilayering of colour and decorative inks using UV inkjet for fine art printing

    Science.gov (United States)

    Parraman, Carinna

    2012-01-01

    In order to increase density of colour and improve ink coverage when printing onto a range of non standard substrates, this paper will present research into multi-layering of colour and the appearance of colour at 'n' levels of ink coverage. Returning to our original investigation of artist's requirements when making inkjet prints, these observations are based on empirical approaches that address the need to present physical data that is more useful and meaningful to the designer. The study has used multi-pass printed colour charts to measure colour and to provide users with an understanding at a soft-preview level to demonstrate the appearance of printed colour on different substrates. Test results relating to the appearance of print on different surfaces, and a series of case studies will be presented using recent research into the capabilities of UV printing technology, which has widened the opportunities for the designer to print onto non-standard materials. It will also present a study into layering of greys and gloss in order to improve the appearance of printed images onto metal.

  16. Interconnecting PV on New York City's Secondary Network Distribution System

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, K; Coddington, M; Burman, K; Hayter, S; Kroposki, B; Watson, and A

    2009-11-01

    less expensive distributed PV system interconnections. To assess ways to improve the interconnection process, NREL conducted a four-part study with support from DOE. The NREL team then compiled the final reports from each study into this report. In Section 1PV Deployment Analysis for New York City we analyze the technical potential for rooftop PV systems in the city. This analysis evaluates potential PV power production in ten Con Edison networks of various locations and building densities (ranging from high density apartments to lower density single family homes). Next, we compare the potential power production to network loads to determine where and when PV generation is most likely to exceed network load and disrupt network protection schemes. The results of this analysis may assist Con Edison in evaluating future PV interconnection applications and in planning future network protection system upgrades. This analysis may also assist other utilities interconnecting PV systems to networks by defining a method for assessing the technical potential of PV in the network and its impact on network loads. Section 2. A Briefing for Policy Makers on Connecting PV to a Network Grid presents an overview intended for nontechnical stakeholders. This section describes the issues associated with interconnecting PV systems to networks, along with possible solutions. Section 3. Technical Review of Concerns and Solutions to PV Interconnection in New York City summarizes common concerns of utility engineers and network experts about interconnecting PV systems to secondary networks. This section also contains detailed descriptions of nine solutions, including advantages and disadvantages, potential impacts, and road maps for deployment. Section 4. Utility Application Process Reviewlooks at utility interconnection application processes across the country and identifies administrative best practices for efficient PV interconnection.

  17. Printed MIMO antenna engineering

    CERN Document Server

    Sharawi, Mohammad S

    2014-01-01

    Wireless communications has made a huge leap during the past two decades. The multiple-input-multiple-output (MIMO) technology was proposed in the 1990's as a viable solution that can overcome the data rate limit experienced by single-input-single-output (SISO) systems. This resource is focused on printed MIMO antenna system design. Printed antennas are widely used in mobile and handheld terminals due to their conformity with the device, low cost, good integration within the device elements and mechanical parts, as well as ease of fabrication.A perfect design companion for practicing engineers

  18. Primer printed circuit boards

    CERN Document Server

    Argyle, Andrew

    2009-01-01

    Step-by-step instructions for making your own PCBs at home. Making your own printed circuit board (PCB) might seem a daunting task, but once you master the steps, it's easy to attain professional-looking results. Printed circuit boards, which connect chips and other components, are what make almost all modern electronic devices possible. PCBs are made from sheets of fiberglass clad with copper, usually in multiplelayers. Cut a computer motherboard in two, for instance, and you'll often see five or more differently patterned layers. Making boards at home is relatively easy

  19. Environmental Regulation Impacts on Eastern Interconnection Performance

    Energy Technology Data Exchange (ETDEWEB)

    Markham, Penn N [ORNL; Liu, Yilu [ORNL; Young II, Marcus Aaron [ORNL

    2013-07-01

    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  20. Optical Interconnection Via Computer-Generated Holograms

    Science.gov (United States)

    Liu, Hua-Kuang; Zhou, Shaomin

    1995-01-01

    Method of free-space optical interconnection developed for data-processing applications like parallel optical computing, neural-network computing, and switching in optical communication networks. In method, multiple optical connections between multiple sources of light in one array and multiple photodetectors in another array made via computer-generated holograms in electrically addressed spatial light modulators (ESLMs). Offers potential advantages of massive parallelism, high space-bandwidth product, high time-bandwidth product, low power consumption, low cross talk, and low time skew. Also offers advantage of programmability with flexibility of reconfiguration, including variation of strengths of optical connections in real time.

  1. Interconnectivity and the Electronic Academic Library

    Directory of Open Access Journals (Sweden)

    Donald E. Riggs

    1988-03-01

    Full Text Available 無Due to the emphasis on the use of computing networks on campuses and to the very nature of more information being accessible to library users only via electronic means, we are witnessing a migration to electronic academic libraries. this new type of library is being required to have interconnections with the campus' other online information/data systems. Arizona State University libraries have been provided the opportunity to develop an electronic library that will be the focal point of a campus-wide information/data network.

  2. Advances in Home Photo Printing

    Institute of Scientific and Technical Information of China (English)

    Qian Lin; Brian Atkins; Huitao Luo

    2004-01-01

    With digital camera adoptions going main stream, consumers capture a record number of photos.Currently, the majority of the digital photos are printed at home. One of the key enablers of this transformation is the advancement of home photo printing technologies. In the past few years, inkjet printing technologies have continued to deliver smaller drop size, larger number of inks, and longer-lasting prints. In the mean time, advanced image processing automatically enhances captured digital photos while being printed. The combination of the above two forces has closed the gap between the home photo prints and AgX prints. It will give an overview of the home photo printing market and technology trends, and discuss major advancements in automatic image processing.

  3. 3D Printing A Survey

    Directory of Open Access Journals (Sweden)

    Muhammad Zulkifl Hasan

    2017-08-01

    Full Text Available Solid free fabrication SFF are produced to enhance the printing instrument utilizing distinctive strategies like Piezo spout control multi-spout injet printers or STL arrange utilizing cutting information. The procedure is utilized to diminish the cost and enhance the speed of printing. A few techniques take long at last because of extra process like dry the printing. This study will concentrate on SFFS utilizing UV gum for 3D printing.

  4. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    Energy Technology Data Exchange (ETDEWEB)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-12-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

  5. Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

    Directory of Open Access Journals (Sweden)

    Rajeswari Packianathan

    2015-01-01

    Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

  6. A laser printing based approach for printed electronics

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

    2016-03-07

    Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

  7. A laser printing based approach for printed electronics

    International Nuclear Information System (INIS)

    Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

    2016-01-01

    Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

  8. National Offshore Wind Energy Grid Interconnection Study

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB Inc; Liu, Shu [ABB Inc; Ibanez, Eduardo [National Renewable Energy Laboratory; Pennock, Ken [AWS Truepower; Reed, Greg [University of Pittsburgh; Hanes, Spencer [Duke Energy

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  9. Interconnected ponds operation for flood hazard distribution

    Science.gov (United States)

    Putra, S. S.; Ridwan, B. W.

    2016-05-01

    The climatic anomaly, which comes with extreme rainfall, will increase the flood hazard in an area within a short period of time. The river capacity in discharging the flood is not continuous along the river stretch and sensitive to the flood peak. This paper contains the alternatives on how to locate the flood retention pond that are physically feasible to reduce the flood peak. The flood ponds were designed based on flood curve number criteria (TR-55, USDA) with the aim of rapid flood peak capturing and gradual flood retuning back to the river. As a case study, the hydrologic condition of upper Ciliwung river basin with several presumed flood pond locations was conceptually designed. A fundamental tank model that reproducing the operation of interconnected ponds was elaborated to achieve the designed flood discharge that will flows to the downstream area. The flood hazard distribution status, as the model performance criteria, will be computed within Ciliwung river reach in Manggarai Sluice Gate spot. The predicted hazard reduction with the operation of the interconnected retention area result had been bench marked with the normal flow condition.

  10. Message Passing Framework for Globally Interconnected Clusters

    International Nuclear Information System (INIS)

    Hafeez, M; Riaz, N; Asghar, S; Malik, U A; Rehman, A

    2011-01-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  11. Towards energy aware optical networks and interconnects

    Science.gov (United States)

    Glesk, Ivan; Osadola, Tolulope; Idris, Siti

    2013-10-01

    In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

  12. Inkjet Printed Radio Frequency Passive Components

    KAUST Repository

    McKerricher, Garret

    2015-12-01

    density capacitors of 400 pF/mm2 with self-resonant frequencies into the GHz regime is developed in this thesis. A multilayer fully printed process is demonstrated using PVP dielectric and dissolving type vias, giving better than 0.1 ohm resistance. In the multilayer process, capacitors and inductors have self-resonant frequencies around 1GHz. These fully printed devices have quality factors less than 10. Finally, 3D inkjet-printed UV-cured material is utilized with a novel silver organo-complex ink at 80oC providing conductivity of 1x107 S/m. A lumped element filter is demonstrated with an insertion loss of only 0.8 dB at 1GHz. The combination of inkjet printing 3D polymer and conductive metal together allows for complex shapes. A fully printed antenna with 81% radiation efficiency is shown. With these promising results and future advances in conductive inks and low-loss dielectrics, the performance of inkjet passives could one day overcome conventional fabrication methods.

  13. Cyclic deformation-induced solute transport in tissue scaffolds with computer designed, interconnected, pore networks: experiments and simulations.

    Science.gov (United States)

    Den Buijs, Jorn Op; Dragomir-Daescu, Dan; Ritman, Erik L

    2009-08-01

    Nutrient supply and waste removal in porous tissue engineering scaffolds decrease from the periphery to the center, leading to limited depth of ingrowth of new tissue into the scaffold. However, as many tissues experience cyclic physiological strains, this may provide a mechanism to enhance solute transport in vivo before vascularization of the scaffold. The hypothesis of this study was that pore cross-sectional geometry and interconnectivity are of major importance for the effectiveness of cyclic deformation-induced solute transport. Transparent elastic polyurethane scaffolds, with computer-programmed design of pore networks in the form of interconnected channels, were fabricated using a 3D printing and injection molding technique. The scaffold pores were loaded with a colored tracer for optical contrast, cyclically compressed with deformations of 10 and 15% of the original undeformed height at 1.0 Hz. Digital imaging was used to quantify the spatial distribution of the tracer concentration within the pores. Numerical simulations of a fluid-structure interaction model of deformation-induced solute transport were compared to the experimental data. The results of experiments and modeling agreed well and showed that pore interconnectivity heavily influences deformation-induced solute transport. Pore cross-sectional geometry appears to be of less relative importance in interconnected pore networks. Validated computer models of solute transport can be used to design optimal scaffold pore geometries that will enhance the convective transport of nutrients inside the scaffold and the removal of waste, thus improving the cell survivability deep inside the scaffold.

  14. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    International Nuclear Information System (INIS)

    Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

    2011-01-01

    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency, therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements. The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a global bus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided design of nanometer scale on-chip buses. (interdisciplinary physics and related areas of science and technology)

  15. Print Advertisements in Malaysia

    Science.gov (United States)

    Hashim, Azirah

    2010-01-01

    This paper examines print advertisements in Malaysia to determine how advertisers seek to achieve their primary goal of persuading or influencing an audience by the use of both language and visuals. It describes the main component moves and rhetorical strategies used by writers to articulate the communicative purpose of the genre and the language…

  16. Linoleum Block Printing Revisited.

    Science.gov (United States)

    Chetelat, Frank J.

    1980-01-01

    The author discusses practical considerations of teaching linoleum block printing in the elementary grades (tool use, materials, motivation) and outlines a sequence of design concepts in this area for the primary, intermediate and junior high grades. A short list of books and audiovisual aids is appended. (SJL)

  17. "Printed-circuit" rectenna

    Science.gov (United States)

    Dickinson, R. M.

    1977-01-01

    Rectifying antenna is less bulky structure for absorbing transmitted microwave power and converting it into electrical current. Printed-circuit approach, using microstrip technology and circularly polarized antenna, makes polarization orientation unimportant and allows much smaller arrays for given performance. Innovation is particularly useful with proposed electric vehicles powered by beam microwaves.

  18. Print advertising: vivid content

    NARCIS (Netherlands)

    Fennis, B.M.; Das, E.; Fransen, M.L.

    2012-01-01

    The present research examines the effects of vivid ad content in two types of appeal in print ads as a function of individual differences in chronically experienced vividness of visual imagery. For informational ads for a functional product, vivid ad content strongly affected individuals high in

  19. Print advertising : Vivid content

    NARCIS (Netherlands)

    Fennis, B.M.; Das, E.H.H.J.; Fransen, M.L.

    The present research examines the effects of vivid ad content in two types of appeal in print ads as a function of individual differences in chronically experienced vividness of visual imagery. For informational ads for a functional product, vivid ad content strongly affected individuals high in

  20. Fabrication of high aspect ratio through-wafer copper interconnects by reverse pulse electroplating

    International Nuclear Information System (INIS)

    Gu, Changdong; Zhang, Tong-Yi; Xu, Hui

    2009-01-01

    This study aims to fabricate high aspect ratio through-wafer copper interconnects by a simple reverse pulse electroplating technique. High aspect-ratio (∼18) through-wafer holes obtained by a two-step deep reactive ion etching (DRIE) process exhibit a taper profile, which might automatically optimize the local current density distribution during the electroplating process, thereby achieving void-free high aspect-ratio copper vias

  1. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  2. Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

    Science.gov (United States)

    Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

    1996-01-01

    A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

  3. High-Resolution Printing of 3D Structures Using an Electrohydrodynamic Inkjet with Multiple Functional Inks.

    Science.gov (United States)

    An, Byeong Wan; Kim, Kukjoo; Lee, Heejoo; Kim, So-Yun; Shim, Yulhui; Lee, Dae-Young; Song, Jun Yeob; Park, Jang-Ung

    2015-08-05

    Electrohydrodynamic-inkjet-printed high-resolution complex 3D structures with multiple functional inks are demonstrated. Printed 3D structures can have a variety of fine patterns, such as vertical or helix-shaped pillars and straight or rounded walls, with high aspect ratios (greater than ≈50) and narrow diameters (≈0.7 μm). Furthermore, the formation of freestanding, bridge-like Ag wire structures on plastic substrates suggests substantial potentials as high-precision, flexible 3D interconnects. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  4. Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

    Science.gov (United States)

    Rogers, John A.; Nuzzo, Ralph; Kim, Hoon-sik; Brueckner, Eric; Park, Sang Il; Kim, Rak Hwan

    2017-05-09

    Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

  5. Compact Interconnection Networks Based on Quantum Dots

    Science.gov (United States)

    Fijany, Amir; Toomarian, Nikzad; Modarress, Katayoon; Spotnitz, Matthew

    2003-01-01

    Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary

  6. Current Solutions: Recent Experience in Interconnecting Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Johnson, M.

    2003-09-01

    This report catalogues selected real-world technical experiences of utilities and customers that have interconnected distributed energy assets with the electric grid. This study was initiated to assess the actual technical practices for interconnecting distributed generation and had a particular focus on the technical issues covered under the Institute of Electrical and Electronics Engineers (IEEE) 1547(TM) Standard for Interconnecting Distributed Resources With Electric Power Systems.

  7. Interconnection network architectures based on integrated orbital angular momentum emitters

    Science.gov (United States)

    Scaffardi, Mirco; Zhang, Ning; Malik, Muhammad Nouman; Lazzeri, Emma; Klitis, Charalambos; Lavery, Martin; Sorel, Marc; Bogoni, Antonella

    2018-02-01

    Novel architectures for two-layer interconnection networks based on concentric OAM emitters are presented. A scalability analysis is done in terms of devices characteristics, power budget and optical signal to noise ratio by exploiting experimentally measured parameters. The analysis shows that by exploiting optical amplifications, the proposed interconnection networks can support a number of ports higher than 100. The OAM crosstalk induced-penalty, evaluated through an experimental characterization, do not significantly affect the interconnection network performance.

  8. Self-Rerouting and Curative Interconnect Technology (SERCUIT)

    Science.gov (United States)

    2017-12-01

    SPECIAL REPORT RDMR-CS-17-01 SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) Shiv Joshi Concepts to Systems, Inc...Final 4. TITLE AND SUBTITLE Self-Rerouting and Curative Interconnect Technology (SERCUIT) 5. FUNDING NUMBERS 6. AUTHOR(S) Shiv Joshi...concepts2systems.com (p) 434-207-5189 x (f) Click to view full size Title Contract Number SELF-REROUTING AND CURATIVE INTERCONNECT TECHNOLOGY (SERCUIT) W911W6-17-C-0029

  9. Solvents interactions with thermochromic print

    Directory of Open Access Journals (Sweden)

    Mirela Rožić

    2017-12-01

    Full Text Available In this study, the interactions between different solvents (benzene, acetone, cyclohexanone, various alcohols and water and thermochromic printing ink were investigated. Thermochromic printing ink was printed on metal surface. Components of thermochromic printing inks are polymeric microcapsules and classic yellow offset printing ink. Below its activation temperature, dye and developer within the microcapsules form a blue coloured complex. Therefore, thermochromic print is green. By heating above the activation temperature, blue colour of the complex turns into the leuco dye colourless state and the green colour of the prints turns into the yellow colour of the classic offset pigment. The results of the interaction with various solvents show that the thermochromic print is stable in all tested solvents except in ethanol, acetone and cyclohexanone. In ethanol, the green colour of the print becomes yellow. SEM analysis shows that microcapsules are dissolved. In acetone and cyclohexanone, the green colour of the print turns into blue, and the microcapsules become significantly more visible. Thus, the yellow pigment interacts with examined ketones. Based on the obtained interactions it can be concluded that the microcapsules have more polar nature than the classical pigment particles. Solvent-thermocromic print interactions were analysed using Hansen solubility parameters that rank the solvents based on their estimated interaction capabilities.

  10. Optical fabrication of lightweighted 3D printed mirrors

    Science.gov (United States)

    Herzog, Harrison; Segal, Jacob; Smith, Jeremy; Bates, Richard; Calis, Jacob; De La Torre, Alyssa; Kim, Dae Wook; Mici, Joni; Mireles, Jorge; Stubbs, David M.; Wicker, Ryan

    2015-09-01

    Direct Metal Laser Sintering (DMLS) and Electron Beam Melting (EBM) 3D printing technologies were utilized to create lightweight, optical grade mirrors out of AlSi10Mg aluminum and Ti6Al4V titanium alloys at the University of Arizona in Tucson. The mirror prototypes were polished to meet the λ/20 RMS and λ/4 P-V surface figure requirements. The intent of this project was to design topologically optimized mirrors that had a high specific stiffness and low surface displacement. Two models were designed using Altair Inspire software, and the mirrors had to endure the polishing process with the necessary stiffness to eliminate print-through. Mitigating porosity of the 3D printed mirror blanks was a challenge in the face of reconciling new printing technologies with traditional optical polishing methods. The prototypes underwent Hot Isostatic Press (HIP) and heat treatment to improve density, eliminate porosity, and relieve internal stresses. Metal 3D printing allows for nearly unlimited topological constraints on design and virtually eliminates the need for a machine shop when creating an optical quality mirror. This research can lead to an increase in mirror mounting support complexity in the manufacturing of lightweight mirrors and improve overall process efficiency. The project aspired to have many future applications of light weighted 3D printed mirrors, such as spaceflight. This paper covers the design/fab/polish/test of 3D printed mirrors, thermal/structural finite element analysis, and results.

  11. Standard practice for preparing sulfur prints for macrostructural evaluation

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2008-01-01

    1.1 This practice provides information required to prepare sulfur prints (also referred to as Baumann Prints) of most ferrous alloys to reveal the distribution of sulfide inclusions. 1.2 The sulfur print reveals the distribution of sulfides in steels with bulk sulfur contents between about 0.010 and 0.40 weight percent. 1.3 Certain steels contain complex sulfides that do not respond to the test solutions, for example, steels containing titanium sulfides or chromium sulfides. 1.4 The sulfur print test is a qualitative test. The density of the print image should not be used to assess the sulfur content of a steel. Under carefully controlled conditions, it is possible to compare print image intensities if the images are formed only by manganese sulfides. 1.5 The sulfur print image will reveal details of the solidification pattern or metal flow from hot or cold working on appropriately chosen and prepared test specimens. 1.6 This practice does not address acceptance criteria based on the use of the method. ...

  12. Distributed Energy Resources Interconnection Systems: Technology Review and Research Needs

    Energy Technology Data Exchange (ETDEWEB)

    Friedman, N. R.

    2002-09-01

    Interconnecting distributed energy resources (DER) to the electric utility grid (or Area Electric Power System, Area EPS) involves system engineering, safety, and reliability considerations. This report documents US DOE Distribution and Interconnection R&D (formerly Distributed Power Program) activities, furthering the development and safe and reliable integration of DER interconnected with our nation's electric power systems. The key to that is system integration and technology development of the interconnection devices that perform the functions necessary to maintain the safety, power quality, and reliability of the EPS when DER are connected to it.

  13. Cost based interconnection charges as a way to induce competition

    DEFF Research Database (Denmark)

    Falch, Morten

    The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debat...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

  14. Financial viability of the Sonora-Baja California interconnection line

    International Nuclear Information System (INIS)

    Alonso, G.; Ortega, G.

    2017-09-01

    In the Development Program of the National Electricity Sector 2015-2029, an electric interconnection line between Sonora and Baja California (Mexico) is proposed, this study analyzes the financial viability of this interconnection line based on the maximum hourly and seasonal energy demand between both regions and proposes alternatives for the supply of electric power that supports the economic convenience of this interconnection line. The results show that additional capacity is required in Sonora to cover the maximum demands of both regions since in the current condition of the National Electric System the interconnection line is not justified. (Author)

  15. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-12-05

    ... Electronics Engineers (IEEE) Standard 1547 for Interconnecting Distributed Resources with Electric Power... discriminatory manner.\\38\\ \\37\\ The Electricity Consumers Resource Council, American Chemistry Council, American...

  16. 77 FR 43561 - Proposed Eligibility Criteria for Bound Printed Matter Parcels

    Science.gov (United States)

    2012-07-25

    ... economical ground-based product containing qualifying bound printed matter, weighing no more than 15 pounds... the minimum physical density threshold to qualify for BPM parcel pricing. The proposed density... a density value of the parcel, measured in pounds/cubic foot. For example, the density of a BPM...

  17. Asynchronous decentralized method for interconnected electricity markets

    International Nuclear Information System (INIS)

    Huang, Anni; Joo, Sung-Kwan; Song, Kyung-Bin; Kim, Jin-Ho; Lee, Kisung

    2008-01-01

    This paper presents an asynchronous decentralized method to solve the optimization problem of interconnected electricity markets. The proposed method decomposes the optimization problem of combined electricity markets into individual optimization problems. The impact of neighboring markets' information is included in the objective function of the individual market optimization problem by the standard Lagrangian relaxation method. Most decentralized optimization methods use synchronous models of communication to exchange updated market information among markets during the iterative process. In this paper, however, the solutions of the individual optimization problems are coordinated through an asynchronous communication model until they converge to the global optimal solution of combined markets. Numerical examples are presented to demonstrate the advantages of the proposed asynchronous method over the existing synchronous methods. (author)

  18. Virtual interconnection platform initiative scoping study

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kou, Gefei [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Pan, Zuohong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); King Jr., Thomas J. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2016-01-01

    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  19. New transmission interconnection reduces consumer costs

    Energy Technology Data Exchange (ETDEWEB)

    Anon.

    2008-09-15

    The Central American electric interconnection system (SIEPAC) project will involve the construction of a 1830 km 230 kV transmission system that will link Guatemala, El Salvador, Honduras, Costa Rica, Nicaragua, and Panama. The system is expected to alleviate the region's power shortages and reduce electricity costs for consumers. Costs for the SIEPAC project have been estimated at $370 million. The system will serve approximately 37 million customers, and will include 15 substations. The contract for building the electrical equipment has been awarded to Schweitzer Engineering Laboratories (SEL) who plan to manufacture components at a plant in Mexico. The equipment will include high speed line protection, automation, and control systems. Line current differential systems and satellite-synchronized clocks will also be used. The new transmission system is expected to be fully operational by 2009. 1 fig.

  20. SIDES - Segment Interconnect Diagnostic Expert System

    International Nuclear Information System (INIS)

    Booth, A.W.; Forster, R.; Gustafsson, L.; Ho, N.

    1989-01-01

    It is well known that the FASTBUS Segment Interconnect (SI) provides a communication path between two otherwise independent, asynchronous bus segments. The SI is probably the most important module in any FASTBUS data acquisition network since it's failure to function can cause whole segments of the network to be inaccessible and sometimes inoperable. This paper describes SIDES, an intelligent program designed to diagnose SI's both in situ as they operate in a data acquisition network, and in the laboratory in an acceptance/repair environment. The paper discusses important issues such as knowledge acquisition; extracting knowledge from human experts and other knowledge sources. SIDES can benefit high energy physics experiments, where SI problems can be diagnosed and solved more quickly. Equipment pool technicians can also benefit from SIDES, first by decreasing the number of SI's erroneously turned in for repair, and secondly as SIDES acts as an intelligent assistant to the technician in the diagnosis and repair process

  1. Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

    KAUST Repository

    Kim, Sangkil; Shamim, Atif; Georgiadis, Apostolos; Aubert, Herve; Tentzeris, Manos M.

    2016-01-01

    In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

  2. Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

    KAUST Repository

    Kim, Sangkil

    2016-02-11

    In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

  3. Electric power grid interconnection in Northeast Asia

    International Nuclear Information System (INIS)

    Yun, Won-Cheol; Zhang, Zhong Xiang

    2006-01-01

    In spite of regional closeness, energy cooperation in Northeast Asia has remained unexplored. However, this situation appears to be changing. The government of South Korea seems to be very enthusiastic for power grid interconnection between the Russian Far East and South Korea to overcome difficulties in finding new sites for building power facilities to meet its need for increased electricity supplies. This paper analyzes the feasibility of this electric power grid interconnection route. The issues addressed include electricity market structures; the prospects for electric power industry restructuring in the Russian Federation and South Korea; the political issues related to North Korea; the challenges for the governments involved and the obstacles anticipated in moving this project forward; project financing and the roles and concerns from multilateral and regional banks; and institutional framework for energy cooperation. While there are many technical issues that need to be resolved, we think that the great challenge lies in the financing of this commercial project. Thus, the governments of the Russian Federation and South Korea involved in the project need to foster the development of their internal capital markets and to create confidence with international investors. To this end, on energy side, this involves defining a clear energy policy implemented by independent regulators, speeding up the already started but delayed reform process of restructuring electric power industry and markets, and establishing a fair and transparent dispute resolution mechanism in order to reduce non-commercial risks to a minimum. The paper argues that establishing a framework for energy cooperation in this region will contribute positively towards that end, although views differ regarding its specific form. Finally, given that North Korea has a crucial transit role to play and faces a very unstable political situation, it is concluded that moving the project forward needs to be

  4. The Role of Some Retention Aids in Water Based Gravure Printing

    International Nuclear Information System (INIS)

    El-Sherbiny, S.; Morsy, F.A.; Abdel- Sayed, E.S.

    2005-01-01

    Several commercial retention systems employing either synthetic or natural additives are now able to achieve an acceptable level of filler retention even during high speed paper forming. However, despite their importance, there have been very few reports in the literature regarding the influence of different retention aids on gravure water based ink printability. In the current work, a series of uncoated hand sheets containing the retention aids rosin aids rosin-alum, cationic starch, polyacrylamide and chitosan were prepared under controlled ph conditions. Chitosan is a natural additive only very recently employed in commercial papermaking systems. After printing with two water based ink systems, both printability and print quality were then assessed in terms of print density, gloss and ink transfer. The effect of surfactant addition to gravure water based ink was also studied. The results showed that the amount of ink transferred and the print density both decreased as the percentage of the selected additives increased. The addition of chitosan to the paper furnish led to a substantial decrease in both the amount of ink transferred and the print density compared to the other additives. Conversely, the presence of surfactant in the printing ink enhanced the print density and also increased the amount of ink transferred. In addition, results obtained demonstrated that printing with water based ink greatly decreased the print gloss in comparison to the paper gloss. Increasing the addition level of the selected additives led to an increase of print gloss due to a decrease in the amount of ink transferred. Increasing the ph of the pulp suspension containing 1 % of the selected additives increased the print density in all cases, except when using cationic starch

  5. Biomimetic 4D printing

    Science.gov (United States)

    Sydney Gladman, A.; Matsumoto, Elisabetta A.; Nuzzo, Ralph G.; Mahadevan, L.; Lewis, Jennifer A.

    2016-04-01

    Shape-morphing systems can be found in many areas, including smart textiles, autonomous robotics, biomedical devices, drug delivery and tissue engineering. The natural analogues of such systems are exemplified by nastic plant motions, where a variety of organs such as tendrils, bracts, leaves and flowers respond to environmental stimuli (such as humidity, light or touch) by varying internal turgor, which leads to dynamic conformations governed by the tissue composition and microstructural anisotropy of cell walls. Inspired by these botanical systems, we printed composite hydrogel architectures that are encoded with localized, anisotropic swelling behaviour controlled by the alignment of cellulose fibrils along prescribed four-dimensional printing pathways. When combined with a minimal theoretical framework that allows us to solve the inverse problem of designing the alignment patterns for prescribed target shapes, we can programmably fabricate plant-inspired architectures that change shape on immersion in water, yielding complex three-dimensional morphologies.

  6. Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

    OpenAIRE

    Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong

    2013-01-01

    The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity se...

  7. Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%

    Energy Technology Data Exchange (ETDEWEB)

    Arafat, Yeasir; Dutta, Indranath; Panat, Rahul, E-mail: Rahul.panat@wsu.edu [School of Mechanical and Materials Engineering, Washington State University, Pullman, Washington 99163 (United States)

    2015-08-24

    Metal interconnects in flexible and wearable devices are heterogeneous metal-polymer systems that are expected to sustain large deformation without failure. The principal strategy to make strain tolerant interconnect lines on flexible substrates has comprised of creating serpentine structures of metal films with either in-plane or out-of-plane waves, using porous substrates, or using highly ductile materials such as gold. The wavy and helical serpentine patterns preclude high-density packing of interconnect lines on devices, while ductile materials such as Au are cost prohibitive for real world applications. Ductile copper films can be stretched if bonded to the substrate, but show high level of cracking beyond few tens of % strain. In this paper, we demonstrate a material system consisting of Indium metal film over an elastomer (PDMS) with a discontinuous Cr layer such that the metal interconnect can be stretched to extremely high linear strain (up to 100%) without any visible cracks. Such linear strain in metal interconnects exceeds that reported in literature and is obtained without the use of any geometrical manipulations or porous substrates. Systematic experimentation is carried out to explain the mechanisms that allow the Indium film to sustain the high strain level without failure. The islands forming the discontinuous Cr layer are shown to move apart from each other during stretching without delamination, providing strong adhesion to the Indium film while accommodating the large strain in the system. The Indium film is shown to form surface wrinkles upon release from the large strain, confirming its strong adhesion to PDMS. A model is proposed based upon the observations that can explain the high level of stretch-ability of the Indium metal film over the PDMS substrate.

  8. Recent trends in print portals and Web2Print applications

    Science.gov (United States)

    Tuijn, Chris

    2009-01-01

    For quite some time now, the printing business has been under heavy pressure because of overcapacity, dropping prices and the delocalization of the production to low income countries. To survive in this competitive world, printers have to invest in tools that, on one hand, reduce the production costs and, on the other hand, create additional value for their customers (print buyers). The creation of customer portals on top of prepress production systems allowing print buyers to upload their content, approve the uploaded pages based on soft proofs (rendered by the underlying production system) and further follow-up the generation of the printed material, has been illustrative in this respect. These developments resulted in both automation for the printer and added value for the print buyer. Many traditional customer portals assume that the printed products have been identified before they are presented to the print buyer in the portal environment. The products are, in this case, typically entered by the printing organization in a so-called MISi system after the official purchase order has been received from the print buyer. Afterwards, the MIS system then submits the product to the customer portal. Some portals, however, also support the initiation of printed products by the print buyer directly. This workflow creates additional flexibility but also makes things much more complex. We here have to distinguish between special products that are defined ad-hoc by the print buyer and standardized products that are typically selected out of catalogs. Special products are most of the time defined once and the level of detail required in terms of production parameters is quite high. Systems that support such products typically have a built-in estimation module, or, at least, a direct connection to an MIS system that calculates the prices and adds a specific mark-up to calculate a quote. Often, the markup is added by an account manager on a customer by customer basis; in this

  9. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    International Nuclear Information System (INIS)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-01-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

  10. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    Energy Technology Data Exchange (ETDEWEB)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-05-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

  11. The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology.

    Science.gov (United States)

    Kang, Sung-Won; Choi, Hyeob; Park, Hyung-Il; Choi, Byoung-Gun; Im, Hyobin; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung; Roh, Jung-Sim

    2017-11-07

    Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable "smart wear" for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study.

  12. The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology

    Directory of Open Access Journals (Sweden)

    Sung-Won Kang

    2017-11-01

    Full Text Available Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable “smart wear” for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study.

  13. Updating Small Generator Interconnection Procedures for New Market Conditions

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  14. Optimal interconnection and renewable targets for north-west Europe

    International Nuclear Information System (INIS)

    Lynch, Muireann Á.; Tol, Richard S.J.; O'Malley, Mark J.

    2012-01-01

    We present a mixed-integer, linear programming model for determining optimal interconnection for a given level of renewable generation using a cost minimisation approach. Optimal interconnection and capacity investment decisions are determined under various targets for renewable penetration. The model is applied to a test system for eight regions in Northern Europe. It is found that considerations on the supply side dominate demand side considerations when determining optimal interconnection investment: interconnection is found to decrease generation capacity investment and total costs only when there is a target for renewable generation. Higher wind integration costs see a concentration of wind in high-wind regions with interconnection to other regions. - Highlights: ► We use mixed-integer linear programming to determine optimal interconnection locations for given renewable targets. ► The model is applied to a test system for eight regions in Northern Europe. ► Interconnection reduces costs only when there is a renewable target. ► Wind integration costs affect the interconnection portfolio.

  15. 14 CFR 29.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow between them due to gravity or flight accelerations, it must be impossible for fuel to flow between tanks in...

  16. Robert Aymar seals the last interconnect in the LHC

    CERN Multimedia

    Maximilien Brice

    2007-01-01

    The LHC completes the circle. On 7 November, in a brief ceremony in the LHC tunnel, CERN Director General Robert Aymar (Photo 1) sealed the last interconnect between the main magnets of the Large Hadron Collider (LHC). Jean-Philippe Tock, leader of the Interconnections team, tightens the last bolt (Photos 4-8).

  17. Circuit and interconnect design for high bit-rate applications

    NARCIS (Netherlands)

    Veenstra, H.

    2006-01-01

    This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate

  18. Inkjet-Printed Lithium-Sulfur Microcathodes for All-Printed, Integrated Nanomanufacturing.

    Science.gov (United States)

    Milroy, Craig A; Jang, Seonpil; Fujimori, Toshihiko; Dodabalapur, Ananth; Manthiram, Arumugam

    2017-03-01

    Improved thin-film microbatteries are needed to provide appropriate energy-storage options to power the multitude of devices that will bring the proposed "Internet of Things" network to fruition (e.g., active radio-frequency identification tags and microcontrollers for wearable and implantable devices). Although impressive efforts have been made to improve the energy density of 3D microbatteries, they have all used low energy-density lithium-ion chemistries, which present a fundamental barrier to miniaturization. In addition, they require complicated microfabrication processes that hinder cost-competitiveness. Here, inkjet-printed lithium-sulfur (Li-S) cathodes for integrated nanomanufacturing are reported. Single-wall carbon nanotubes infused with electronically conductive straight-chain sulfur (S@SWNT) are adopted as an integrated current-collector/active-material composite, and inkjet printing as a top-down approach to achieve thin-film shape control over printed electrode dimensions is used. The novel Li-S cathodes may be directly printed on traditional microelectronic semicoductor substrates (e.g., SiO 2 ) or on flexible aluminum foil. Profilometry indicates that these microelectrodes are less than 10 µm thick, while cyclic voltammetry analyses show that the S@SWNT possesses pseudocapacitive characteristics and corroborates a previous study suggesting the S@SWNT discharge via a purely solid-state mechanism. The printed electrodes produce ≈800 mAh g -1 S initially and ≈700 mAh g -1 after 100 charge/discharge cycles at C/2 rate. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  19. Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

    Science.gov (United States)

    Ramesham, Rajeshuni

    2011-01-01

    A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

  20. Simple and accurate model for voltage-dependent resistance of metallic carbon nanotube interconnects: An ab initio study

    International Nuclear Information System (INIS)

    Yamacli, Serhan; Avci, Mutlu

    2009-01-01

    In this work, development of a voltage dependent resistance model for metallic carbon nanotubes is aimed. Firstly, the resistance of metallic carbon nanotube interconnects are obtained from ab initio simulations and then the voltage dependence of the resistance is modeled through regression. Self-consistent non-equilibrium Green's function formalism combined with density functional theory is used for calculating the voltage dependent resistance of metallic carbon nanotubes. It is shown that voltage dependent resistances of carbon nanotubes can be accurately modeled as a polynomial function which enables rapid integration of carbon nanotube interconnect models into electronic design automation tools.

  1. Durability of ink jet prints

    International Nuclear Information System (INIS)

    Dobric, E; Mirkovic, I Bolanca; Bolanca, Z

    2010-01-01

    The aim of this paper is the result presentation of some optical properties research for ink jet prints after: exposing the prints to the mixed daylight and artificial light, exposing of prints to the sun-light through the glass window, and exposing of prints to outdoor conditions during the summer months. The prints obtained by piezoelectric and thermal ink jet technologies were used in the researches. The dye-based inks and the pigmented inks based on water and the low solvent inks were used. The results of these researches, except the scientific contribution in the domain of understanding and explaining the environmental conditions on the gamut size, i.e. the range of color tonality, colorimetric stability and print quality, can be used by the ink and paper manufacturers in new formulations, offer data for the printer producers for further production and evaluation of the position of their products.

  2. Mapping of interconnection of climate risks

    Science.gov (United States)

    Yokohata, Tokuta; Tanaka, Katsumasa; Nishina, Kazuya; Takanashi, Kiyoshi; Emori, Seita; Kiguchi, Masashi; Iseri, Yoshihiko; Honda, Yasushi; Okada, Masashi; Masaki, Yoshimitsu; Yamamoto, Akitomo; Shigemitsu, Masahito; Yoshimori, Masakazu; Sueyoshi, Tetsuo; Iwase, Kenta; Hanasaki, Naota; Ito, Akihiko; Sakurai, Gen; Iizumi, Toshichika; Oki, Taikan

    2015-04-01

    Anthropogenic climate change possibly causes various impacts on human society and ecosystem. Here, we call possible damages or benefits caused by the future climate change as "climate risks". Many climate risks are closely interconnected with each other by direct cause-effect relationship. In this study, the major climate risks are comprehensively summarized based on the survey of studies in the literature using IPCC AR5 etc, and their cause-effect relationship are visualized by a "network diagram". This research is conducted by the collaboration between the experts of various fields, such as water, energy, agriculture, health, society, and eco-system under the project called ICA-RUS (Integrated Climate Assessment - Risks, Uncertainties and Society). First, the climate risks are classified into 9 categories (water, energy, food, health, disaster, industry, society, ecosystem, and tipping elements). Second, researchers of these fields in our project survey the research articles, and pick up items of climate risks, and possible cause-effect relationship between the risk items. A long list of the climate risks is summarized into ~130, and that of possible cause-effect relationship between the risk items is summarized into ~300, because the network diagram would be illegible if the number of the risk items and cause-effect relationship is too large. Here, we only consider the risks that could occur if climate mitigation policies are not conducted. Finally, the chain of climate risks is visualized by creating a "network diagram" based on a network graph theory (Fruchtman & Reingold algorithm). Through the analysis of network diagram, we find that climate risks at various sectors are closely related. For example, the decrease in the precipitation under the global climate change possibly causes the decrease in river runoff and the decrease in soil moisture, which causes the changes in crop production. The changes in crop production can have an impact on society by

  3. Fuel cell electrode interconnect contact material encapsulation and method

    Science.gov (United States)

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  4. Next generation space interconnect research and development in space communications

    Science.gov (United States)

    Collier, Charles Patrick

    2017-11-01

    Interconnect or "bus" is one of the critical technologies in design of spacecraft avionics systems that dictates its architecture and complexity. MIL-STD-1553B has long been used as the avionics backbone technology. As avionics systems become more and more capable and complex, however, limitations of MIL-STD-1553B such as insufficient 1 Mbps bandwidth and separability have forced current avionics architects and designers to use combination of different interconnect technologies in order to meet various requirements: CompactPCI is used for backplane interconnect; LVDS or RS422 is used for low and high-speed direct point-to-point interconnect; and some proprietary interconnect standards are designed for custom interfaces. This results in a very complicated system that consumes significant spacecraft mass and power and requires extensive resources in design, integration and testing of spacecraft systems.

  5. Optical backplane interconnect switch for data processors and computers

    Science.gov (United States)

    Hendricks, Herbert D.; Benz, Harry F.; Hammer, Jacob M.

    1989-01-01

    An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

  6. Solar-cell interconnect design for terrestrial photovoltaic modules

    Science.gov (United States)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1984-01-01

    Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

  7. Nanoantenna couplers for metal-insulator-metal waveguide interconnects

    Science.gov (United States)

    Onbasli, M. Cengiz; Okyay, Ali K.

    2010-08-01

    State-of-the-art copper interconnects suffer from increasing spatial power dissipation due to chip downscaling and RC delays reducing operation bandwidth. Wide bandwidth, minimized Ohmic loss, deep sub-wavelength confinement and high integration density are key features that make metal-insulator-metal waveguides (MIM) utilizing plasmonic modes attractive for applications in on-chip optical signal processing. Size-mismatch between two fundamental components (micron-size fibers and a few hundred nanometers wide waveguides) demands compact coupling methods for implementation of large scale on-chip optoelectronic device integration. Existing solutions use waveguide tapering, which requires more than 4λ-long taper distances. We demonstrate that nanoantennas can be integrated with MIM for enhancing coupling into MIM plasmonic modes. Two-dimensional finite-difference time domain simulations of antennawaveguide structures for TE and TM incident plane waves ranging from λ = 1300 to 1600 nm were done. The same MIM (100-nm-wide Ag/100-nm-wide SiO2/100-nm-wide Ag) was used for each case, while antenna dimensions were systematically varied. For nanoantennas disconnected from the MIM; field is strongly confined inside MIM-antenna gap region due to Fabry-Perot resonances. Major fraction of incident energy was not transferred into plasmonic modes. When the nanoantennas are connected to the MIM, stronger coupling is observed and E-field intensity at outer end of core is enhanced more than 70 times.

  8. Interconnected V2O5 nanoporous network for high-performance supercapacitors.

    Science.gov (United States)

    Saravanakumar, B; Purushothaman, Kamatchi K; Muralidharan, G

    2012-09-26

    Vanadium pentoxide (V(2)O(5)) has attracted attention for supercapcitor applications because of its extensive multifunctional properties. In the present study, V(2)O(5) nanoporous network was synthesized via simple capping-agent-assisted precipitation technique and it is further annealed at different temperatures. The effect of annealing temperature on the morphology, electrochemical and structural properties, and stability upon oxidation-reduction cycling has been analyzed for supercapacitor application. We achieved highest specific capacitance of 316 F g(-1) for interconnected V(2)O(5) nanoporous network. This interconnected nanoporous network creates facile nanochannels for ion diffusion and facilitates the easy accessibility of ions. Moreover, after six hundred consecutive cycling processes the specific capacitance has changed only by 24%. A simple cost-effective preparation technique of V(2)O(5) nanoporous network with excellent capacitive behavior, energy density, and stability encourages its possible commercial exploitation for the development of high-performance supercapacitors.

  9. Electrical tomography using atomic force microscopy and its application towards carbon nanotube-based interconnects

    International Nuclear Information System (INIS)

    Schulze, A; Hantschel, T; Dathe, A; Eyben, P; Vandervorst, W; Ke, X

    2012-01-01

    The fabrication and integration of low-resistance carbon nanotubes (CNTs) for interconnects in future integrated circuits requires characterization techniques providing structural and electrical information at the nanometer scale. In this paper we present a slice-and-view approach based on electrical atomic force microscopy. Material removal achieved by successive scanning using doped ultra-sharp full-diamond probes, manufactured in-house, enables us to acquire two-dimensional (2D) resistance maps originating from different depths (equivalently different CNT lengths) on CNT-based interconnects. Stacking and interpolating these 2D resistance maps results in a three-dimensional (3D) representation (tomogram). This allows insight from a structural (e.g. size, density, distribution, straightness) and electrical point of view simultaneously. By extracting the resistance evolution over the length of an individual CNT we derive quantitative information about the resistivity and the contact resistance between the CNT and bottom electrode. (paper)

  10. Electromigration in integrated circuit interconnects studied by X-ray microscopy

    CERN Document Server

    Schneider, G; Anderson, E; Bates, W; Salmassi, F; Nachimuthu, P; Pearson, A; Richardson, D; Hambach, D; Hoffmann, N; Hasse, W; Hoffmann, K

    2003-01-01

    To study mass transport phenomena in advanced microelectronic devices with X-rays requires penetration of dielectric and Si layers up to 30 mu m thick. X-ray imaging at 1.8 keV photon energy provides a high amplitude contrast between Cu or Al interconnects and dielectric layers and can penetrate through the required thickness. To perform X-ray microscopy at 1.8 keV, a new Ru/Si multilayer was designed for the transmission X-ray microscope XM-1 installed at the Advanced Light Source in Berkeley. The mass flow in a passivated Cu interconnect was studied at current densities up to 10 sup 7 A/cm sup 2. In addition, we demonstrated the high material contrast from different elements in integrated circuits with a resolution of about 40 nm.

  11. Influence of Micro-Damage on Reliability of Cryogenic Bellows in the LHC Interconnections

    CERN Document Server

    Garion, C

    2008-01-01

    To achieve maximum beam energy in the LHC the accumulated length of the interconnections between LHC main magnets has been limited to around 3% of the total magnetic length in the Arcs and Dispersion Suppressors. Such a low ratio leads to a very compact design of components located in the LHC interconnections. This implies development and evolution of high intensity plastic strain fields in the stainless steel expansion bellows subjected to thermo-mechanical loads at low temperatures. These components have been optimised to ensure high reliability standards required for the LHC. Nevertheless, initial damage can occur and lead to a premature fatigue failure. For structures in which plasticity is not confined to the crack tip region, standard failure mechanics, based classically on the stress intensity factor or the strain energy density release rate, can not be used. In the present paper, a constitutive model taking into account plastic strain induced g->a' phase transformation and orthotropic ductile damage i...

  12. Electromigration in integrated circuit interconnects studied by X-ray microscopy

    Energy Technology Data Exchange (ETDEWEB)

    Schneider, G. E-mail: gschnei1@gwdg.de; Denbeaux, G.; Anderson, E.; Bates, W.; Salmassi, F.; Nachimuthu, P.; Pearson, A.; Richardson, D.; Hambach, D.; Hoffmann, N.; Hasse, W.; Hoffmann, K

    2003-01-01

    To study mass transport phenomena in advanced microelectronic devices with X-rays requires penetration of dielectric and Si layers up to 30 {mu}m thick. X-ray imaging at 1.8 keV photon energy provides a high amplitude contrast between Cu or Al interconnects and dielectric layers and can penetrate through the required thickness. To perform X-ray microscopy at 1.8 keV, a new Ru/Si multilayer was designed for the transmission X-ray microscope XM-1 installed at the Advanced Light Source in Berkeley. The mass flow in a passivated Cu interconnect was studied at current densities up to 10{sup 7} A/cm{sup 2}. In addition, we demonstrated the high material contrast from different elements in integrated circuits with a resolution of about 40 nm.

  13. Quality Control of the Print with the Application of Statistical Methods

    Science.gov (United States)

    Simonenko, K. V.; Bulatova, G. S.; Antropova, L. B.; Varepo, L. G.

    2018-04-01

    The basis for standardizing the process of offset printing is the control of print quality indicators. The solution of this problem has various approaches, among which the most important are statistical methods. Practical implementation of them for managing the quality of the printing process is very relevant and is reflected in this paper. The possibility of using the method of constructing a Control Card to identify the reasons for the deviation of the optical density for a triad of inks in offset printing is shown.

  14. 3D printing for dummies

    CERN Document Server

    Hausman, Kalani Kirk

    2014-01-01

    Get started printing out 3D objects quickly and inexpensively! 3D printing is no longer just a figment of your imagination. This remarkable technology is coming to the masses with the growing availability of 3D printers. 3D printers create 3-dimensional layered models and they allow users to create prototypes that use multiple materials and colors.  This friendly-but-straightforward guide examines each type of 3D printing technology available today and gives artists, entrepreneurs, engineers, and hobbyists insight into the amazing things 3D printing has to offer. You'll discover methods for

  15. 76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...

    Science.gov (United States)

    2011-07-28

    ...-002; Docket No. EL11-20-001] PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference On June 13, 2011, the Commission issued... Resources Services, Inc., Maryland Public Service Commission, Monitoring Analytics, L.L.C., National Rural...

  16. 76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...

    Science.gov (United States)

    2011-07-07

    .... EL11-20-001] PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of... Sell Offers for Planned Generation Capacity Resources submitted into PJM's Reliability Pricing Model... presents an opportunity to exercise buyer market power; (2) whether the Fixed Resource Requirement (FRR...

  17. Interconnection issues in Ontario : a status check

    International Nuclear Information System (INIS)

    Helbronner, V.

    2010-01-01

    This PowerPoint presentation discussed wind and renewable energy interconnection issues in Ontario. The province's Green Energy Act established a feed-in tariff (FIT) program and provided priority connection access to the electricity system for renewable energy generation facilities that meet regulatory requirements. As a result of the province's initiatives, Hydro One has identified 20 priority transmission expansion projects and is focusing on servicing renewable resource clusters. As of October 2010, the Ontario Power Authority (OPA) has received 1469 MW of FIT contracts executed for wind projects. A further 5953 MW of wind projects are awaiting approval. A Korean consortium is now planning to develop 2500 MW of renewable energy projects in the province. The OPA has also been asked to develop an updated transmission expansion plan. Transmission/distribution availability tests (TAT/DAT) have been established to determine if there is sufficient connection availability for FIT application projects. Economic connection tests (ECTs) are conducted to assess whether grid upgrade costs to enable additional FIT capacity are justifiable. When projects pass the ECT, grid upgrades needed for the connection included in grid expansion plans. Ontario's long term energy plan was also reviewed. tabs., figs.

  18. Thermal Runaways in LHC Interconnections: Experiments

    CERN Document Server

    Willering, G P; Bottura, L; Scheuerlein, C; Verweij, A P

    2011-01-01

    The incident in the LHC in September 2008 occurred in an interconnection between two magnets of the 13 kA dipole circuit. This event was traced to a defect in one of the soldered joints between two superconducting cables stabilized by a copper busbar. Further investigation revealed defective joints of other types. A combination of (1) a poor contact between the superconducting cable and the copper stabilizer and (2) an electrical discontinuity in the stabilizer at the level of the connection can lead to an unprotected quench of the busbar. Once the heating power in the unprotected superconducting cable exceeds the heat removal capacity a thermal run-away occurs, resulting in a fast melt-down of the non-stabilized cable. We have performed a thorough investigation of the conditions upon which a thermal run-away in the defect can occur. To this aim, we have prepared heavily instrumented samples with well-defined and controlled defects. In this paper we describe the experiment, and the analysis of the data, and w...

  19. Versioning of printed products

    Science.gov (United States)

    Tuijn, Chris

    2005-01-01

    During the definition of a printed product in an MIS system, a lot of attention is paid to the production process. The MIS systems typically gather all process-related parameters at such a level of detail that they can determine what the exact cost will be to make a specific product. This information can then be used to make a quote for the customer. Considerably less attention is paid to the content of the products since this does not have an immediate impact on the production costs (assuming that the number of inks or plates is known in advance). The content management is typically carried out either by the prepress systems themselves or by dedicated workflow servers uniting all people that contribute to the manufacturing of a printed product. Special care must be taken when considering versioned products. With versioned products we here mean distinct products that have a number of pages or page layers in common. Typical examples are comic books that have to be printed in different languages. In this case, the color plates can be shared over the different versions and the black plate will be different. Other examples are nation-wide magazines or newspapers that have an area with regional pages or advertising leaflets in different languages or currencies. When considering versioned products, the content will become an important cost factor. First of all, the content management (and associated proofing and approval cycles) becomes much more complex and, therefore, the risk that mistakes will be made increases considerably. Secondly, the real production costs are very much content-dependent because the content will determine whether plates can be shared across different versions or not and how many press runs will be needed. In this paper, we will present a way to manage different versions of a printed product. First, we will introduce a data model for version management. Next, we will show how the content of the different versions can be supplied by the customer

  20. Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

    Science.gov (United States)

    Schleunitz, A.; Klein, J. J.; Krupp, A.; Stender, B.; Houbertz, R.; Gruetzner, G.

    2017-02-01

    The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

  1. Conductive silver ink printing through the laser-induced forward transfer technique

    International Nuclear Information System (INIS)

    Florian, C.; Caballero-Lucas, F.; Fernández-Pradas, J.M.; Artigas, R.; Ogier, S.; Karnakis, D.; Serra, P.

    2015-01-01

    Highlights: • We have devised a strategy which allows eliminating the bulging problem during the LIFT of conductive lines. • The strategy consists of the alternate deposition of two sets of non-overlapping droplets with an intermediate drying step. • The process allows mitigating capillary flows along the printed line which are responsible for bulging and line breakup. • Conductivity measurements of laser cured lines prove the feasibility of the technique for the fabrication of interconnects. - Abstract: Laser induced forward transfer (LIFT) is a technique which allows printing a wide variety of materials. It presents several advantages over inkjet printing, such as a potentially higher resolution, being free from clogging issues, and the possibility to work with a much broader range of viscosities. LIFT appears, therefore, as an interesting alternative in all those fields where miniaturization is a major requirement, as in the microelectronics industry. The fabrication of electronic devices requires the printing of small, narrow and thin conductive lines, and in this work we investigate the printing of continuous lines of conductive silver ink on glass substrates through LIFT. Lines are initially formed through sequentially printing adjacent droplets with different overlaps. We show that above a certain overlap continuous lines can be obtained, but unfortunately they show bulging, a problem which compromises the functionality of the lines. In order to solve the problem, other printing strategies are tested; they consist in printing adjacent droplets in alternate sequences. It is found that the alternate printing of two overlapping sets of droplets with an intermediate drying step allows obtaining functional continuous lines without bulging

  2. Conductive silver ink printing through the laser-induced forward transfer technique

    Energy Technology Data Exchange (ETDEWEB)

    Florian, C.; Caballero-Lucas, F.; Fernández-Pradas, J.M. [Departament de Física Aplicada i Òptica, Universitat de Barcelona, Martí i Franquès 1, E-08028 Barcelona (Spain); Artigas, R. [Sensofar-Tech S.L., Parc Audiovisual de Catalunya, Crta. BV1274 Km1, E-08225 Terrassa (Spain); Ogier, S. [Center for Process Innovation Ltd, The Wilton Centre, TS10 4RF Cleveland (United Kingdom); Karnakis, D. [Oxford Lasers Ltd, Unit 8 Moorbrook Park, OX11 7HP Didcot (United Kingdom); Serra, P., E-mail: pserra@ub.edu [Departament de Física Aplicada i Òptica, Universitat de Barcelona, Martí i Franquès 1, E-08028 Barcelona (Spain)

    2015-05-01

    Highlights: • We have devised a strategy which allows eliminating the bulging problem during the LIFT of conductive lines. • The strategy consists of the alternate deposition of two sets of non-overlapping droplets with an intermediate drying step. • The process allows mitigating capillary flows along the printed line which are responsible for bulging and line breakup. • Conductivity measurements of laser cured lines prove the feasibility of the technique for the fabrication of interconnects. - Abstract: Laser induced forward transfer (LIFT) is a technique which allows printing a wide variety of materials. It presents several advantages over inkjet printing, such as a potentially higher resolution, being free from clogging issues, and the possibility to work with a much broader range of viscosities. LIFT appears, therefore, as an interesting alternative in all those fields where miniaturization is a major requirement, as in the microelectronics industry. The fabrication of electronic devices requires the printing of small, narrow and thin conductive lines, and in this work we investigate the printing of continuous lines of conductive silver ink on glass substrates through LIFT. Lines are initially formed through sequentially printing adjacent droplets with different overlaps. We show that above a certain overlap continuous lines can be obtained, but unfortunately they show bulging, a problem which compromises the functionality of the lines. In order to solve the problem, other printing strategies are tested; they consist in printing adjacent droplets in alternate sequences. It is found that the alternate printing of two overlapping sets of droplets with an intermediate drying step allows obtaining functional continuous lines without bulging.

  3. Weather resistance of inkjet prints on plastic substrates

    Directory of Open Access Journals (Sweden)

    Rozália Szentgyörgyvölgyi

    2015-06-01

    Full Text Available The development of wide format inkjet printers made the technology available for large area commercials. Outdoor advertising uses a wide range of substrate including paperboard, vinyl, canvas, mesh; the material of the substrate itself has to endure the physical and chemical effects of local weather. Weather elements (humidity, wind, solar irradiation degrade printed products inevitably; plastic products have better resistance against them, than paper based substrates. Service life of the printed product for outdoor application is a key parameter from the customer’s point of view. There are two ways to estimate expected lifetime: on site outdoor testing or laboratory testing. In both cases weathering parameters can be monitored, however laboratory testing devices may produce the desired environmental effects and thus accelerate the aging process. Our research objective was to evaluate the effects of artificial weathering on prints produced by inkjet technology on plastic substrates. We used a large format CMYK inkjet printer (Mutoh Rockhopper II, with Epson DX 4 print heads to print our test chart on two similar substrates (PVC coated tarpaulins with grammages 400 g/m2 and 440 g/m2. Specimen were aged in an Atlas Suntest XLS+ material tester device for equal time intervals. We measured and calculated the gradual changes of the optical properties (optical density, tone value, colour shifts of the test prints.

  4. Plasmonic laser printing for functional metasurfaces

    DEFF Research Database (Denmark)

    Zhu, Xiaolong; Carstensen, M. S.; Vannahme, Christoph

    2016-01-01

    Recently, we show a method of color printing on nanoimprinted plasmonic metasurfaces using laser post-writing. Laser pulses induce transient local heat generation that leads to melting and reshaping of the imprinted nanostructures [1]. Depending on the laser pulse energy density, different surface...... morphologies that support different plasmonic resonances can be created. This technology creates a laser printer capable of producing color images with a resolution up to 127,000 DPI. With tailored trains of laser pulses, multiple optical states are flatiron onto the metasurface film with a nanoscale...

  5. Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

    International Nuclear Information System (INIS)

    Majumder, M.K.; Pandya, N.D.; Kaushik, B.K.; Manhas, S.K.

    2013-01-01

    Carbon nanotube (CN T) can be considered as an emerging interconnect material in current nano scale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

  6. Philosophical Intelligence: Letters, Print, and Experiment during Napoleon's Continental Blockade.

    Science.gov (United States)

    Watts, Iain P

    2015-12-01

    This essay investigates scientific exchanges between Britain and France from 1806 to 1814, at the height of the Napoleonic Wars. It argues for a picture of scientific communication that sees letters and printed texts not as separate media worlds, but as interconnected bearers of time-critical information within a single system of intelligence gathering and experimental practice. During this period, Napoleon Bonaparte's Continental System blockade severed most links between Britain and continental Europe, yet scientific communications continued--particularly on electrochemistry, a subject of fierce rivalry between Britain and France. The essay traces these exchanges using the archive of a key go-between, the English man of science Sir Charles Blagden. The first two sections look at Blagden's letter-writing operation, reconstructing how he harnessed connections with neutral American diplomats, merchants, and the State to get scientific intelligence between London and Paris. The third section, following Blagden's words from Britain to France to America, looks at how information in letters cross-fertilized with information in print. The final section considers how letters and print were used together to solve the difficult practical problem of replicating experiments across the blockade.

  7. 3D printing of mineral-polymer bone substitutes based on sodium alginate and calcium phosphate.

    Science.gov (United States)

    Egorov, Aleksey A; Fedotov, Alexander Yu; Mironov, Anton V; Komlev, Vladimir S; Popov, Vladimir K; Zobkov, Yury V

    2016-01-01

    We demonstrate a relatively simple route for three-dimensional (3D) printing of complex-shaped biocompatible structures based on sodium alginate and calcium phosphate (CP) for bone tissue engineering. The fabrication of 3D composite structures was performed through the synthesis of inorganic particles within a biopolymer macromolecular network during 3D printing process. The formation of a new CP phase was studied through X-ray diffraction, Fourier transform infrared spectroscopy and scanning electron microscopy. Both the phase composition and the diameter of the CP particles depend on the concentration of a liquid component (i.e., the "ink"). The 3D printed structures were fabricated and found to have large interconnected porous systems (mean diameter ≈800 μm) and were found to possess compressive strengths from 0.45 to 1.0 MPa. This new approach can be effectively applied for fabrication of biocompatible scaffolds for bone tissue engineering constructions.

  8. 3D printing of mineral–polymer bone substitutes based on sodium alginate and calcium phosphate

    Directory of Open Access Journals (Sweden)

    Aleksey A. Egorov

    2016-11-01

    Full Text Available We demonstrate a relatively simple route for three-dimensional (3D printing of complex-shaped biocompatible structures based on sodium alginate and calcium phosphate (CP for bone tissue engineering. The fabrication of 3D composite structures was performed through the synthesis of inorganic particles within a biopolymer macromolecular network during 3D printing process. The formation of a new CP phase was studied through X-ray diffraction, Fourier transform infrared spectroscopy and scanning electron microscopy. Both the phase composition and the diameter of the CP particles depend on the concentration of a liquid component (i.e., the “ink”. The 3D printed structures were fabricated and found to have large interconnected porous systems (mean diameter ≈800 μm and were found to possess compressive strengths from 0.45 to 1.0 MPa. This new approach can be effectively applied for fabrication of biocompatible scaffolds for bone tissue engineering constructions.

  9. Analysis of interconnecting energy systems over a synchronized life cycle

    International Nuclear Information System (INIS)

    Nian, Victor

    2016-01-01

    Highlights: • A methodology is developed for evaluating a life cycle of interconnected systems. • A new concept of partial temporal boundary is introduced via quantitative formulation. • The interconnecting systems are synchronized through the partial temporal boundary. • A case study on the life cycle of the coal–uranium system is developed. - Abstract: Life cycle analysis (LCA) using the process chain analysis (PCA) approach has been widely applied to energy systems. When applied to an individual energy system, such as coal or nuclear electricity generation, an LCA–PCA methodology can yield relatively accurate results with its detailed process representation based on engineering data. However, there are fundamental issues when applying conventional LCA–PCA methodology to a more complex life cycle, namely, a synchronized life cycle of interconnected energy systems. A synchronized life cycle of interconnected energy systems is established through direct interconnections among the processes of different energy systems, and all interconnecting systems are bounded within the same timeframe. Under such a life cycle formation, there are some major complications when applying conventional LCA–PCA methodology to evaluate the interconnecting energy systems. Essentially, the conventional system and boundary formulations developed for a life cycle of individual energy system cannot be directly applied to a life cycle of interconnected energy systems. To address these inherent issues, a new LCA–PCA methodology is presented in this paper, in which a new concept of partial temporal boundary is introduced to synchronize the interconnecting energy systems. The importance and advantages of these new developments are demonstrated through a case study on the life cycle of the coal–uranium system.

  10. Additive Manufacturing of Syntactic Foams: Part 2: Specimen Printing and Mechanical Property Characterization

    Science.gov (United States)

    Singh, Ashish Kumar; Saltonstall, Brooks; Patil, Balu; Hoffmann, Niklas; Doddamani, Mrityunjay; Gupta, Nikhil

    2018-03-01

    High-density polyethylene (HDPE) and its fly ash cenosphere-filled syntactic foam filaments have been recently developed. These filaments are used for three-dimensional (3D) printing using a commercial printer. The developed syntactic foam filament (HDPE40) contains 40 wt.% cenospheres in the HDPE matrix. Printing parameters for HDPE and HDPE40 were optimized for use in widely available commercial printers, and specimens were three-dimensionally (3D) printed for tensile testing at strain rate of 10-3 s-1. Process optimization resulted in smooth operation of the 3D printer without nozzle clogging or cenosphere fracture during the printing process. Characterization results revealed that the tensile modulus values of 3D-printed HDPE and HDPE40 specimens were higher than those of injection-molded specimens, while the tensile strength was comparable, but the fracture strain and density were lower.

  11. Remote Collaborative 3D Printing - Process Investigation

    Science.gov (United States)

    2016-04-01

    COLLABORATIVE 3D PRINTING - PROCESS INVESTIGATION Cody M. Reese, PE CAD MODEL PRINT MODEL PRINT PREVIEW PRINTED PART AERIAL VIRTUAL This...REMOTE COLLABORATIVE 3D PRINTING - PROCESS INVESTIGATION 5b. GRANT NUMBER 5c. PROGRAM ELEMENT NUMBER 6. AUTHOR(S) 5d. PROJECT NUMBER Cody M. Reese...release; distribution is unlimited. 13. SUPPLEMENTARY NOTES 14. ABSTRACT The Remote Collaborative 3D Printing project is a collaboration between

  12. Inkjet printed electronics using copper nanoparticle ink

    OpenAIRE

    Kang, Jin Sung; Kim, Hak Sung; Ryu, Jongeun; Thomas Hahn, H.; Jang, Seonhee; Joung, Jae Woo

    2010-01-01

    Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200 °C of low temperature in N2 gas condition. The printed electrodes were made with various widths and thickness. In order to control the thickness of the printed electrode, number of printing was varied. Resistivity of printed electrode was calculated from the cross-sectional area measure...

  13. Interacting Social Processes on Interconnected Networks.

    Directory of Open Access Journals (Sweden)

    Lucila G Alvarez-Zuzek

    Full Text Available We propose and study a model for the interplay between two different dynamical processes -one for opinion formation and the other for decision making- on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = -2,-1, 1, 2, describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2 or a moderate (S = ±1 is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1 or against (S = -1 the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A when the reinforcement overcomes a crossover value r*(β, while a negative consensus happens for r βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*.

  14. Genomic Predictability of Interconnected Biparental Maize Populations

    Science.gov (United States)

    Riedelsheimer, Christian; Endelman, Jeffrey B.; Stange, Michael; Sorrells, Mark E.; Jannink, Jean-Luc; Melchinger, Albrecht E.

    2013-01-01

    Intense structuring of plant breeding populations challenges the design of the training set (TS) in genomic selection (GS). An important open question is how the TS should be constructed from multiple related or unrelated small biparental families to predict progeny from individual crosses. Here, we used a set of five interconnected maize (Zea mays L.) populations of doubled-haploid (DH) lines derived from four parents to systematically investigate how the composition of the TS affects the prediction accuracy for lines from individual crosses. A total of 635 DH lines genotyped with 16,741 polymorphic SNPs were evaluated for five traits including Gibberella ear rot severity and three kernel yield component traits. The populations showed a genomic similarity pattern, which reflects the crossing scheme with a clear separation of full sibs, half sibs, and unrelated groups. Prediction accuracies within full-sib families of DH lines followed closely theoretical expectations, accounting for the influence of sample size and heritability of the trait. Prediction accuracies declined by 42% if full-sib DH lines were replaced by half-sib DH lines, but statistically significantly better results could be achieved if half-sib DH lines were available from both instead of only one parent of the validation population. Once both parents of the validation population were represented in the TS, including more crosses with a constant TS size did not increase accuracies. Unrelated crosses showing opposite linkage phases with the validation population resulted in negative or reduced prediction accuracies, if used alone or in combination with related families, respectively. We suggest identifying and excluding such crosses from the TS. Moreover, the observed variability among populations and traits suggests that these uncertainties must be taken into account in models optimizing the allocation of resources in GS. PMID:23535384

  15. Quality Inspection of Printed Texts

    DEFF Research Database (Denmark)

    Pedersen, Jesper Ballisager; Nasrollahi, Kamal; Moeslund, Thomas B.

    2016-01-01

    -folded: for costumers of the printing and verification system, the overall grade used to verify if the text is of sufficient quality, while for printer's manufacturer, the detailed character/symbols grades and quality measurements are used for the improvement and optimization of the printing task. The proposed system...

  16. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  17. The Enhanced Segment Interconnect for FASTBUS data communications

    International Nuclear Information System (INIS)

    Machen, D.R.; Downing, R.W.; Kirsten, F.A.; Nelson, R.O.

    1987-01-01

    The Enhanced Segment Interconnect concept (ESI) for improved FASTBUS data communications is a development supported by the U.S. Department of Energy under the Small Business Innovation Research (SBIR) program. The ESI will contain both the Segment Interconnect (SI) Tyhpe S-1 and an optional buffered interconnect for store-and-forward data communications; fiber-optic-coupled serial ports will provide optional data paths. The ESI can be applied in large FASTBUS-implemented physics experiments whose data-set or data-transmission distance requirements dictate alternate approaches to data communications. This paper describes the functions of the ESI and the status of its development, now 25% complete

  18. Some Thoughts on Contemporary Graphic Print

    Directory of Open Access Journals (Sweden)

    Stefan Skiba

    2016-09-01

    Full Text Available The production requirements of original graphic works of art have changed since 1980. The development of digital printing using lightfast colors now rivals traditional techniques such as wood cut, screen print, lithography, etching etc. Today, with respect to artistic legitimacy, original graphics using traditional printing techniques compete with original graphics produced by digital printing techniques on the art market. What criteria distinguish traditional printing techniques from those of digital printing in the production and acquisition of original graphics? What consequences is the serious artist faced with when deciding to implement digital print production? How does digital print change original graphic acquisition decisions?

  19. 3D-printed gelatin scaffolds of differing pore geometry modulate hepatocyte function and gene expression.

    Science.gov (United States)

    Lewis, Phillip L; Green, Richard M; Shah, Ramille N

    2018-03-15

    Three dimensional (3D) printing is highly amenable to the fabrication of tissue-engineered organs of a repetitive microstructure such as the liver. The creation of uniform and geometrically repetitive tissue scaffolds can also allow for the control over cellular aggregation and nutrient diffusion. However, the effect of differing geometries, while controlling for pore size, has yet to be investigated in the context of hepatocyte function. In this study, we show the ability to precisely control pore geometry of 3D-printed gelatin scaffolds. An undifferentiated hepatocyte cell line (HUH7) demonstrated high viability and proliferation when seeded on 3D-printed scaffolds of two different geometries. However, hepatocyte specific functions (albumin secretion, CYP activity, and bile transport) increases in more interconnected 3D-printed gelatin cultures compared to a less interconnected geometry and to 2D controls. Additionally, we also illustrate the disparity between gene expression and protein function in simple 2D culture modes, and that recreation of a physiologically mimetic 3D environment is necessary to induce both expression and function of cultured hepatocytes. Three dimensional (3D) printing provides tissue engineers the ability spatially pattern cells and materials in precise geometries, however the biological effects of scaffold geometry on soft tissues such as the liver have not been rigorously investigated. In this manuscript, we describe a method to 3D print gelatin into well-defined repetitive geometries that show clear differences in biological effects on seeded hepatocytes. We show that a relatively simple and widely used biomaterial, such as gelatin, can significantly modulate biological processes when fabricated into specific 3D geometries. Furthermore, this study expands upon past research into hepatocyte aggregation by demonstrating how it can be manipulated to enhance protein function, and how function and expression may not precisely correlate in

  20. Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current

    Science.gov (United States)

    Luo, X. M.; Zhang, B.; Zhang, G. P.

    2014-09-01

    Thermal fatigue failure of metallization interconnect lines subjected to alternating currents (AC) is becoming a severe threat to the long-term reliability of micro/nanodevices with increasing electrical current density/power. Here, thermal fatigue failure behaviors and damage mechanisms of nanocrystalline Au interconnect lines on the silicon glass substrate have been investigated by applying general alternating currents (the pure alternating current coupled with a direct current (DC) component) with different frequencies ranging from 0.05 Hz to 5 kHz. We observed both thermal fatigue damages caused by Joule heating-induced cyclic strain/stress and electromigration (EM) damages caused by the DC component. Besides, the damage formation showed a strong electrically-thermally-mechanically coupled effect and frequency dependence. At lower frequencies, thermal fatigue damages were dominant and the main damage forms were grain coarsening with grain boundary (GB) cracking/voiding and grain thinning. At higher frequencies, EM damages took over and the main damage forms were GB cracking/voiding of smaller grains and hillocks. Furthermore, the healing effect of the reversing current was considered to elucidate damage mechanisms of the nanocrystalline Au lines generated by the general AC. Lastly, a modified model was proposed to predict the lifetime of the nanocrystalline metal interconnect lines, i.e., that was a competing drift velocity-based approach based on the threshold time required for reverse diffusion/healing to occur.

  1. Nano/CMOS architectures using a field-programmable nanowire interconnect

    International Nuclear Information System (INIS)

    Snider, Gregory S; Williams, R Stanley

    2007-01-01

    A field-programmable nanowire interconnect (FPNI) enables a family of hybrid nano/CMOS circuit architectures that generalizes the CMOL (CMOS/molecular hybrid) approach proposed by Strukov and Likharev, allowing for simpler fabrication, more conservative process parameters, and greater flexibility in the choice of nanoscale devices. The FPNI improves on a field-programmable gate array (FPGA) architecture by lifting the configuration bit and associated components out of the semiconductor plane and replacing them in the interconnect with nonvolatile switches, which decreases both the area and power consumption of the circuit. This is an example of a more comprehensive strategy for improving the efficiency of existing semiconductor technology: placing a level of intelligence and configurability in the interconnect can have a profound effect on integrated circuit performance, and can be used to significantly extend Moore's law without having to shrink the transistors. Compilation of standard benchmark circuits onto FPNI chip models shows reduced area (8 x to 25 x), reduced power, slightly lower clock speeds, and high defect tolerance-an FPNI chip with 20% defective junctions and 20% broken nanowires has an effective yield of 75% with no significant slowdown along the critical path, compared to a defect-free chip. Simulations show that the density and power improvements continue as both CMOS and nano fabrication parameters scale down, although the maximum clock rate decreases due to the high resistance of very small (<10 nm) metallic nanowires

  2. Opto-Electronic and Interconnects Hierarchical Design Automation System (OE-IDEAS)

    National Research Council Canada - National Science Library

    Turowski, M

    2004-01-01

    As microelectronics technology continues to advance, the associated electrical interconnection technology is not likely to keep pace, due to many parasitic effects appearing in metallic interconnections...

  3. Knowledge Access in Rural Inter-connected Areas Network ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... the existing network to include two thematic networks on food security and rural ... Woman conquering male business in Yemen : Waleya's micro-enterprise.

  4. Free-Space Optical Interconnect Employing VCSEL Diodes

    Science.gov (United States)

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

    2009-01-01

    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  5. Knowledge Access in Rural Inter-connected Areas Network ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... poor by sharing innovations, best practices and indigenous knowledge using ... A third thematic network - on knowledge management strategies - will play an ...

  6. A proposed holistic approach to on-chip, off-chip, test, and package interconnections

    Science.gov (United States)

    Bartelink, Dirk J.

    1998-11-01

    The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

  7. Interconnected Power Systems Mexico-Guatemala financed by BID

    International Nuclear Information System (INIS)

    Martinez, Veronica

    2003-01-01

    The article describes the plans for the interconnection of the electric power systems of Guatemala, El Salvador, Honduras, Nicaragua, Costa Rica, Panama and Mexico within the project Plan Pueba Panama. The objective of the interconnection is to create an electric market in the region that contributes to reduce costs and prices. The project will receive a financing of $37.5 millions of US dollars from the Banco Intrameramericano de Desarrollo (BID)

  8. Robust design of head interconnect for hard disk drive

    Science.gov (United States)

    Gao, X. K.; Liu, Q. H.; Liu, Z. J.

    2005-05-01

    Design of head interconnect is one of the important issues for hard disk drives with higher data rate and storage capacity. The impedance of interconnect and electromagnetic coupling influence the quality level of data communication. Thus an insightful study on how the trace configuration affects the impedance and crosstalk is necessary. An effective design approach based on Taguchi's robust design method is employed therefore in an attempt to realize impedance matching and crosstalk minimization with the effects of uncontrollable sources taken into consideration.

  9. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Science.gov (United States)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    1984-01-01

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  10. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Science.gov (United States)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  11. Load shedding scheme in the south/southeastern interconnected system

    Energy Technology Data Exchange (ETDEWEB)

    Vieira Filho, Xisto; Couri, J J.G.; Gomes, P; Almeida, P C [ELETROBRAS, Rio de Janeiro, RJ (Brazil)

    1988-12-31

    This paper presents some characteristics of the Brazilian interconnected system and discusses the load shedding scheme in its different stages considering the beginning of operation of the Itaipu power plant. The present situation of the South and Southeastern load shedding scheme combination is also commented. Finally, the interconnected system evolution and the effects on the load shedding schemes are discussed. 4 refs., 5 figs., 2 tabs.

  12. Microintaglio Printing for Soft Lithography-Based in Situ Microarrays

    Directory of Open Access Journals (Sweden)

    Manish Biyani

    2015-07-01

    Full Text Available Advances in lithographic approaches to fabricating bio-microarrays have been extensively explored over the last two decades. However, the need for pattern flexibility, a high density, a high resolution, affordability and on-demand fabrication is promoting the development of unconventional routes for microarray fabrication. This review highlights the development and uses of a new molecular lithography approach, called “microintaglio printing technology”, for large-scale bio-microarray fabrication using a microreactor array (µRA-based chip consisting of uniformly-arranged, femtoliter-size µRA molds. In this method, a single-molecule-amplified DNA microarray pattern is self-assembled onto a µRA mold and subsequently converted into a messenger RNA or protein microarray pattern by simultaneously producing and transferring (immobilizing a messenger RNA or a protein from a µRA mold to a glass surface. Microintaglio printing allows the self-assembly and patterning of in situ-synthesized biomolecules into high-density (kilo-giga-density, ordered arrays on a chip surface with µm-order precision. This holistic aim, which is difficult to achieve using conventional printing and microarray approaches, is expected to revolutionize and reshape proteomics. This review is not written comprehensively, but rather substantively, highlighting the versatility of microintaglio printing for developing a prerequisite platform for microarray technology for the postgenomic era.

  13. Electrochemical fabrication of interconnected tungsten bronze nanosheets for high performance supercapacitor

    Science.gov (United States)

    Yang, Gan; Liu, Xiao-Xia

    2018-04-01

    Interconnected H0.12WO3ṡH2O nanosheets with high electrochemical performances are fabricated on partial exfoliated graphite substrate (Ex-GF) by potential-limited pulse galvanostatic method (PLPG). The dead volume problem of bulk pesudocapacitive materials is addressed by the novel interconnected nanosheets structure, enabling a large specific capacitance of 5.95 F cm-2 (495.8 F g-1) at 2 mA cm-2. Merited from the fluent electrolyte penetration channels established by the plenty voids among nanosheets, as well as fast electron transportation in the electronic conductive tungsten bronze which is directly grown from graphite substrate, the obtained WO3/Ex-GF demonstrates excellent rate capability. The material can maintain 60.0% of its capacitance when the discharge current density increases from 2 to 100 mA cm-2. Moreover, WO3/Ex-GF doesn't show capacitance decay after 5000 galvanostatic charge-discharge cycles, displaying its super stability. Furthermore, a high performance asymmetric supercapacitor assembled by using WO3/Ex-GF and electrochemical fabricated MnO2/Ex-GF as negative and positive electrodes, respectively displays a high energy density of 2.88 mWh cm-3 at the power density of 11.1 mW cm-3, demonstrating its potential application for energy storage.

  14. Nanostructured CuS networks composed of interconnected nanoparticles for asymmetric supercapacitors.

    Science.gov (United States)

    Fu, Wenbin; Han, Weihua; Zha, Heming; Mei, Junfeng; Li, Yunxia; Zhang, Zemin; Xie, Erqing

    2016-09-21

    Nanostructured metal sulfides with excellent electrochemical activity and electrical conductivity are particularly promising for applications in high-performance energy storage devices. Here, we report on the facile synthesis of nanostructured CuS networks composed of interconnected nanoparticles as novel battery-type materials for asymmetric supercapacitors. We find that the CuS networks exhibit a high specific capacity of 49.8 mA g(-1) at a current density of 1 A g(-1), good rate capability and cycle stability. The superior performance could be attributed to the interconnected nanoparticles of CuS networks, which can facilitate electrolyte diffusion and provide fast electron pathways. Furthermore, an aqueous asymmetric supercapacitor has been assembled by using the CuS networks as the positive electrode and activated carbon as the negative electrode. The assembled device can work at a high operating voltage of 1.6 V and show a maximum energy density of 17.7 W h kg(-1) at a power density of 504 W kg(-1). This study indicates that the CuS networks have great potential for supercapacitor applications.

  15. Three-dimensional interconnected porous graphitic carbon derived from rice straw for high performance supercapacitors

    Science.gov (United States)

    Jin, Hong; Hu, Jingpeng; Wu, Shichao; Wang, Xiaolan; Zhang, Hui; Xu, Hui; Lian, Kun

    2018-04-01

    Three-dimensional interconnected porous graphitic carbon materials are synthesized via a combination of graphitization and activation process with rice straw as the carbon source. The physicochemical properties of the three-dimensional interconnected porous graphitic carbon materials are characterized by Nitrogen adsorption/desorption, Fourier-transform infrared spectroscopy, X-ray diffraction, Raman spectroscopy, Scanning electron microscopy and Transmission electron microscopy. The results demonstrate that the as-prepared carbon is a high surface area carbon material (a specific surface area of 3333 m2 g-1 with abundant mesoporous and microporous structures). And it exhibits superb performance in symmetric double layer capacitors with a high specific capacitance of 400 F g-1 at a current density of 0.1 A g-1, good rate performance with 312 F g-1 under a current density of 5 A g-1 and favorable cycle stability with 6.4% loss after 10000 cycles at a current density of 5 A g-1 in the aqueous electrolyte of 6M KOH. Thus, rice straw is a promising carbon source for fabricating inexpensive, sustainable and high performance supercapacitors' electrode materials.

  16. Synthesis of polyaniline-based inks for inkjet printed devices: electrical characterization highlighting the effect of primary and secondary doping

    International Nuclear Information System (INIS)

    Chiolerio, Alessandro; Bocchini, Sergio; Porro, Samuele; Perrone, Denis; Fabrizio Pirri, Candido; Scaravaggi, Francesco; Beretta, Davide; Caironi, Mario

    2015-01-01

    Engineering applications for printed electronics demand solution processable electrically conductive materials, in the form of inks, to realize interconnections, piezoresistive pressure sensors, thermoresistive temperature sensors, and many other devices. Polyaniline is an intrinsically conductive polymer with modest electrical properties but clear advantages in terms of solubility and stability with temperature and in time. A comprehensive study, starting from its synthesis, primary doping, inkjet printing and secondary doping is presented, with the aim of elucidating the doping agent effects on its morphology, printability and electronic performance. (paper)

  17. Rapid prototyping for tissue-engineered bone scaffold by 3D printing and biocompatibility study.

    Science.gov (United States)

    He, Hui-Yu; Zhang, Jia-Yu; Mi, Xue; Hu, Yang; Gu, Xiao-Yu

    2015-01-01

    The prototyping of tissue-engineered bone scaffold (calcined goat spongy bone-biphasic ceramic composite/PVA gel) by 3D printing was performed, and the biocompatibility of the fabricated bone scaffold was studied. Pre-designed STL file was imported into the GXYZ303010-XYLE 3D printing system, and the tissue-engineered bone scaffold was fabricated by 3D printing using gel extrusion. Rabbit bone marrow stromal cells (BMSCs) were cultured in vitro and then inoculated to the sterilized bone scaffold obtained by 3D printing. The growth of rabbit BMSCs on the bone scaffold was observed under the scanning electron microscope (SEM). The effect of the tissue-engineered bone scaffold on the proliferation and differentiation of rabbit BMSCs using MTT assay. Universal testing machine was adopted to test the tensile strength of the bone scaffold. The leachate of the bone scaffold was prepared and injected into the New Zealand rabbits. Cytotoxicity test, acute toxicity test, pyrogenic test and intracutaneous stimulation test were performed to assess the biocompatibility of the bone scaffold. Bone scaffold manufactured by 3D printing had uniform pore size with the porosity of about 68.3%. The pores were well interconnected, and the bone scaffold showed excellent mechanical property. Rabbit BMSCs grew and proliferated on the surface of the bone scaffold after adherence. MTT assay indicated that the proliferation and differentiation of rabbit BMSCs on the bone scaffold did not differ significantly from that of the cells in the control. In vivo experiments proved that the bone scaffold fabricated by 3D printing had no acute toxicity, pyrogenic reaction or stimulation. Bone scaffold manufactured by 3D printing allows the rabbit BMSCs to adhere, grow and proliferate and exhibits excellent biomechanical property and high biocompatibility. 3D printing has a good application prospect in the prototyping of tissue-engineered bone scaffold.

  18. The best printing methods to print satellite images

    OpenAIRE

    G.A. Yousif; R.Sh. Mohamed

    2011-01-01

    Printing systems operate in general as a system of color its color scale is limited as compared with the system color satellite images. Satellite image is building from very small cell named pixel, which represents the picture element and the unity of color when the image is displayed on the screen, this unit becomes lesser in size and called screen point. This unit posseses different size and shape from the method of printing to another, depending on the output resolution, tools and material...

  19. Plasmonic laser printing for ink-free color decoration

    DEFF Research Database (Denmark)

    Zhu, Xiaolong; Vannahme, Christoph; Højlund-Nielsen, Emil

    2016-01-01

    Here we show a method of color printing on nanoimprinted plasmonic metasurfaces [1] using laser post-writing. Laser pulses induce transient local heat generation that leads to melting and reshaping of the imprinted nanostructures [2]. This leads to melting and reshaping of the imprinted 20nm Al...... also be used on a larger scale to personify products such as mobile phones with unique decorations, names, etc‥ This laser technology may create environmentally sound color printing solutions and simplify the production for consumer products....... structures embedded in plastics. Depending on the laser pulse energy density, different surface morphologies that support different plasmonic resonances leading to different color appearances can be created. Color printing by this technology has several advantages over dye technology: ink/toner-free, sub...

  20. Detection of latent prints by Raman imaging

    Science.gov (United States)

    Lewis, Linda Anne [Andersonville, TN; Connatser, Raynella Magdalene [Knoxville, TN; Lewis, Sr., Samuel Arthur

    2011-01-11

    The present invention relates to a method for detecting a print on a surface, the method comprising: (a) contacting the print with a Raman surface-enhancing agent to produce a Raman-enhanced print; and (b) detecting the Raman-enhanced print using a Raman spectroscopic method. The invention is particularly directed to the imaging of latent fingerprints.

  1. 3D Printing Factors Important for the Fabrication of Polyvinylalcohol Filament-Based Tablets.

    Science.gov (United States)

    Tagami, Tatsuaki; Fukushige, Kaori; Ogawa, Emi; Hayashi, Naomi; Ozeki, Tetsuya

    2017-01-01

    Three-dimensional (3D) printers have been applied in many fields, including engineering and the medical sciences. In the pharmaceutical field, approval of the first 3D-printed tablet by the U.S. Food and Drug Administration in 2015 has attracted interest in the manufacture of tablets and drugs by 3D printing techniques as a means of delivering tailor-made drugs in the future. In current study, polyvinylalcohol (PVA)-based tablets were prepared using a fused-deposition-modeling-type 3D printer and the effect of 3D printing conditions on tablet production was investigated. Curcumin, a model drug/fluorescent marker, was loaded into PVA-filament. We found that several printing parameters, such as the rate of extruding PVA (flow rate), can affect the formability of the resulting PVA-tablets. The 3D-printing temperature is controlled by heating the print nozzle and was shown to affect the color of the tablets and their curcumin content. PVA-based infilled tablets with different densities were prepared by changing the fill density as a printing parameter. Tablets with lower fill density floated in an aqueous solution and their curcumin content tended to dissolve faster. These findings will be useful in developing drug-loaded PVA-based 3D objects and other polymer-based articles prepared using fused-deposition-modeling-type 3D printers.

  2. SU-E-T-455: Characterization of 3D Printed Materials for Proton Beam Therapy

    International Nuclear Information System (INIS)

    Zou, W; Siderits, R; McKenna, M; Khan, A; Yue, N; McDonough, J; Yin, L; Teo, B; Fisher, T

    2014-01-01

    Purpose: The widespread availability of low cost 3D printing technologies provides an alternative fabrication method for customized proton range modifying accessories such as compensators and boluses. However the material properties of the printed object are dependent on the printing technology used. In order to facilitate the application of 3D printing in proton therapy, this study investigated the stopping power of several printed materials using both proton pencil beam measurements and Monte Carlo simulations. Methods: Five 3–4 cm cubes fabricated using three 3D printing technologies (selective laser sintering, fused-deposition modeling and stereolithography) from five printers were investigated. The cubes were scanned on a CT scanner and the depth dose curves for a mono-energetic pencil beam passing through the material were measured using a large parallel plate ion chamber in a water tank. Each cube was measured from two directions (perpendicular and parallel to printing plane) to evaluate the effects of the anisotropic material layout. The results were compared with GEANT4 Monte Carlo simulation using the manufacturer specified material density and chemical composition data. Results: Compared with water, the differences from the range pull back by the printed blocks varied and corresponded well with the material CT Hounsfield unit. The measurement results were in agreement with Monte Carlo simulation. However, depending on the technology, inhomogeneity existed in the printed cubes evidenced from CT images. The effect of such inhomogeneity on the proton beam is to be investigated. Conclusion: Printed blocks by three different 3D printing technologies were characterized for proton beam with measurements and Monte Carlo simulation. The effects of the printing technologies in proton range and stopping power were studied. The derived results can be applied when specific devices are used in proton radiotherapy

  3. Keeping the Classics in Print.

    Science.gov (United States)

    Lerner, Fred

    1993-01-01

    Provides an overview of science fiction titles in print and discusses the value of science fiction as a literary form. Specific titles are included, and the need for formats designed for permanent preservation in libraries is discussed. (EAM)

  4. Reviewing printed and electronic dictionaries

    DEFF Research Database (Denmark)

    Nielsen, Sandro

    2009-01-01

    Dictionary reviewing is an integral part of the lexicographic universe. However, lexicographers have called for generally applicable principles embracing both printed and electronic dictionaries. I propose that scholarly reviews contain information that is useful to their intended audiences...

  5. 3D Printed Robotic Hand

    Science.gov (United States)

    Pizarro, Yaritzmar Rosario; Schuler, Jason M.; Lippitt, Thomas C.

    2013-01-01

    Dexterous robotic hands are changing the way robots and humans interact and use common tools. Unfortunately, the complexity of the joints and actuations drive up the manufacturing cost. Some cutting edge and commercially available rapid prototyping machines now have the ability to print multiple materials and even combine these materials in the same job. A 3D model of a robotic hand was designed using Creo Parametric 2.0. Combining "hard" and "soft" materials, the model was printed on the Object Connex350 3D printer with the purpose of resembling as much as possible the human appearance and mobility of a real hand while needing no assembly. After printing the prototype, strings where installed as actuators to test mobility. Based on printing materials, the manufacturing cost of the hand was $167, significantly lower than other robotic hands without the actuators since they have more complex assembly processes.

  6. 3D printing in dentistry.

    Science.gov (United States)

    Dawood, A; Marti Marti, B; Sauret-Jackson, V; Darwood, A

    2015-12-01

    3D printing has been hailed as a disruptive technology which will change manufacturing. Used in aerospace, defence, art and design, 3D printing is becoming a subject of great interest in surgery. The technology has a particular resonance with dentistry, and with advances in 3D imaging and modelling technologies such as cone beam computed tomography and intraoral scanning, and with the relatively long history of the use of CAD CAM technologies in dentistry, it will become of increasing importance. Uses of 3D printing include the production of drill guides for dental implants, the production of physical models for prosthodontics, orthodontics and surgery, the manufacture of dental, craniomaxillofacial and orthopaedic implants, and the fabrication of copings and frameworks for implant and dental restorations. This paper reviews the types of 3D printing technologies available and their various applications in dentistry and in maxillofacial surgery.

  7. Disposal of old printed journals

    Indian Academy of Sciences (India)

    2018-02-21

    Feb 21, 2018 ... Notice inviting Tender for Disposal of Old Printed Journals & Old News Papers. Indian Academy of ... The competent authority also reserves the right to reject any or all the tenders without assigning any reason thereof. 19.

  8. The Printing Industry Presses on.

    Science.gov (United States)

    Cutshall, Sandy

    2002-01-01

    The printing and graphic arts industry has been transformed, not replaced, by new technologies. The coming decades hold challenging opportunities for those entering the field of graphic communications and for those educating this new work force. (JOW)

  9. Screen printed Y and Bi-based superconductors

    Science.gov (United States)

    Haertling, Gene H.; Hsi, Chi-Shiung

    1992-01-01

    High T(sub c) superconducting thick film was prepared by screen printing process. Y-based (YBa2Cu3O(7 - x)) superconducting thick films were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconducting thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T(sub c) and J(sub c) values were obtained from the films printed on these substrates. Critical temperatures of YBa2Cu3O(7 - x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities of these films were less than 2 A/cm(exp 2). Higher T(sub c) and J(sub c) films were printed on the YSZ substrates; T(sub c) = 86.4 K and J(sub c) = 50.4 A/cm(exp 2). Multiple lead samples were also prepared on the YSZ substrates. These showed lower T(sub c) and J(sub c) values than plain samples. The heat treatment conditions of the multiple lead samples are still under investigation. Bi-based superconductor thick films have been obtained so far. Improving the superconducting properties of the BSCCO screen printed thick films will be emphasized in future work.

  10. Semiotic Analysis Of Mcdonald's Printed Advertisement

    OpenAIRE

    URAIDA, SITI

    2014-01-01

    Keywords: Semiotic, printed advertisement, sign, icon, symbol, index, connotation, myth Printed advertisement has a promotional function as medium to advertise aproduct. It implicitly persuades people to create demand of product which is being advertised. In this study, the writer uses printed advertisement of McDonald's fast food company as the object. The printed advertisement was analyzed by usingSemiotics study. There are seven printed advertisements that were analyzes in this study. All ...

  11. Natural fibre composites for 3D Printing

    OpenAIRE

    Pandey, Kapil

    2015-01-01

    3D printing has been common option for prototyping. Not all the materials are suitable for 3D printing. Various studies have been done and still many are ongoing regarding the suitability of the materials for 3D printing. This thesis work discloses the possibility of 3D printing of certain polymer composite materials. The main objective of this thesis work was to study the possibility for 3D printing the polymer composite material composed of natural fibre composite and various different ...

  12. 3D-Printed Millimeter Wave Structures

    Science.gov (United States)

    2016-03-14

    demonstrates the resolution of the printer with a 10 micron nozzle. Figure 2: Measured loss tangent of SEBS and SBS samples. 3D - Printed Millimeter... 3D printing of styrene-butadiene-styrene (SBS) and styrene ethylene/butylene-styrene (SEBS) is used to demonstrate the feasibility of 3D - printed ...Additionally, a dielectric lens is printed which improves the antenna gain of an open-ended WR-28 waveguide from 7 to 8.5 dBi. Keywords: 3D printing

  13. Inkjet and screen printing for electronic applications

    OpenAIRE

    Medina Rodríguez, Beatriz

    2016-01-01

    Printed electronics (PE) is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. Electrically functional, electronic or optical inks are deposited on the substrate, creating active or passive devices. PE offers a great advantage when compared to traditional processes or microelectronics du...

  14. Process Developed for Generating Ceramic Interconnects With Low Sintering Temperatures for Solid Oxide Fuel Cells

    Science.gov (United States)

    Zhong, Zhi-Min; Goldsby, Jon C.

    2005-01-01

    Solid oxide fuel cells (SOFCs) have been considered as premium future power generation devices because they have demonstrated high energy-conversion efficiency, high power density, and extremely low pollution, and have the flexibility of using hydrocarbon fuel. The Solid-State Energy Conversion Alliance (SECA) initiative, supported by the U.S. Department of Energy and private industries, is leading the development and commercialization of SOFCs for low-cost stationary and automotive markets. The targeted power density for the initiative is rather low, so that the SECA SOFC can be operated at a relatively low temperature (approx. 700 C) and inexpensive metallic interconnects can be utilized in the SOFC stack. As only NASA can, the agency is investigating SOFCs for aerospace applications. Considerable high power density is required for the applications. As a result, the NASA SOFC will be operated at a high temperature (approx. 900 C) and ceramic interconnects will be employed. Lanthanum chromite-based materials have emerged as a leading candidate for the ceramic interconnects. The interconnects are expected to co-sinter with zirconia electrolyte to mitigate the interface electric resistance and to simplify the processing procedure. Lanthanum chromites made by the traditional method are sintered at 1500 C or above. They react with zirconia electrolytes (which typically sinter between 1300 and 1400 C) at the sintering temperature of lanthanum chromites. It has been envisioned that lanthanum chromites with lower sintering temperatures can be co-fired with zirconia electrolyte. Nonstoichiometric lanthanum chromites can be sintered at lower temperatures, but they are unstable and react with zirconia electrolyte during co-sintering. NASA Glenn Research Center s Ceramics Branch investigated a glycine nitrate process to generate fine powder of the lanthanum-chromite-based materials. By simultaneously doping calcium on the lanthanum site, and cobalt and aluminum on the

  15. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Science.gov (United States)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2016-05-03

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  16. 76 FR 16405 - Notice of Attendance at PJM INterconnection, L.L.C., Meetings

    Science.gov (United States)

    2011-03-23

    ... INterconnection, L.L.C., Meetings The Federal Energy Regulatory Commission (Commission) hereby gives notice that members of the Commission and Commission staff may attend upcoming PJM Interconnection, L.L.C., (PJM...: Docket No. EL05-121, PJM Interconnection, L.L.C. Docket No. ER06-456, PJM Interconnection, L.L.C. Docket...

  17. Electrode and interconnect for miniature fuel cells using direct methanol feed

    Science.gov (United States)

    Narayanan, Sekharipuram R. (Inventor); Valdez, Thomas I. (Inventor); Clara, Filiberto (Inventor)

    2004-01-01

    An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

  18. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2017-04-04

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  19. Customization of flexographic printing plates related to uvc-induced changes in the crosslinking degree

    Directory of Open Access Journals (Sweden)

    Tamara Tomašegović

    2016-11-01

    Full Text Available In this paper, the swelling properties of photopolymer flexographic printing plates related to the variations of UVC post-treatment have been analysed. The aim of the research was to interconnect the changes in the crosslinking degree of the photopolymer material occurring due to the modified UVC radiation of the printing plate and the changes of its surface free energy crucial in the graphic reproduction process. Changes in the crosslinking degree in the photopolymer materials have been analysed by the swelling experiments. Results have proven that the partial dissolution of the photopolymer material caused by the immersion of the printing plates in various solvents is in the direct relation with the changes of the dispersive surface free energy. UVC post-treatment, used for the crosslinking termination and the definition of the surface properties of printing plates, is therefore directly affecting the resistivity of the printing plate in the solvent environment. By calculating the correlation coefficients for the weight loss of the photopolymer material in solvents and the dispersive surface free energy, the relation between the crosslinking degree and the UVC post-treatment has been established.

  20. Emerging Carbon and Post-Carbon Nanomaterial Inks for Printed Electronics.

    Science.gov (United States)

    Secor, Ethan B; Hersam, Mark C

    2015-02-19

    Carbon and post-carbon nanomaterials present desirable electrical, optical, chemical, and mechanical attributes for printed electronics, offering low-cost, large-area functionality on flexible substrates. In this Perspective, recent developments in carbon nanomaterial inks are highlighted. Monodisperse semiconducting single-walled carbon nanotubes compatible with inkjet and aerosol jet printing are ideal channels for thin-film transistors, while inkjet, gravure, and screen-printable graphene-based inks are better-suited for electrodes and interconnects. Despite the high performance achieved in prototype devices, additional effort is required to address materials integration issues encountered in more complex systems. In this regard, post-carbon nanomaterial inks (e.g., electrically insulating boron nitride and optically active transition-metal dichalcogenides) present promising opportunities. Finally, emerging work to extend these nanomaterial inks to three-dimensional printing provides a path toward nonplanar devices. Overall, the superlative properties of these materials, coupled with versatile assembly by printing techniques, offer a powerful platform for next-generation printed electronics.

  1. Customized biomimetic scaffolds created by indirect three-dimensional printing for tissue engineering

    International Nuclear Information System (INIS)

    Lee, Ju-Yeon; Choi, Bogyu; Wu, Benjamin; Lee, Min

    2013-01-01

    Three-dimensional printing (3DP) is a rapid prototyping technique that can create complex 3D structures by inkjet printing of a liquid binder onto powder biomaterials for tissue engineering scaffolds. Direct fabrication of scaffolds from 3DP, however, imposes a limitation on material choices by manufacturing processes. In this study, we report an indirect 3DP approach wherein a positive replica of desired shapes was printed using gelatin particles, and the final scaffold was directly produced from the printed mold. To create patient-specific scaffolds that match precisely to a patient's external contours, we integrated our indirect 3DP technique with imaging technologies and successfully created custom scaffolds mimicking human mandibular condyle using polycaprolactone and chitosan for potential osteochondral tissue engineering. To test the ability of the technique to precisely control the internal morphology of the scaffolds, we created orthogonal interconnected channels within the scaffolds using computer-aided-design models. Because very few biomaterials are truly osteoinductive, we modified inert 3D printed materials with bioactive apatite coating. The feasibility of these scaffolds to support cell growth was investigated using bone marrow stromal cells (BMSC). The BMSCs showed good viability in the scaffolds, and the apatite coating further enhanced cellular spreading and proliferation. This technique may be valuable for complex scaffold fabrication. (paper)

  2. Printing nanotube/nanowire for flexible microsystems

    Science.gov (United States)

    Tortorich, Ryan P.; Choi, Jin-Woo

    2014-04-01

    Printing has become an emerging manufacturing technology for mechanics, electronics, and consumer products. Additionally, both nanotubes and nanowires have recently been used as materials for sensors and electrodes due to their unique electrical and mechanical properties. Printed electrodes and conductive traces particularly offer versatility of fabricating low-cost, disposable, and flexible electrical devices and microsystems. While various printing methods such as screen printing have been conventional methods for printing conductive traces and electrodes, inkjet printing has recently attracted great attention due to its unique advantages including no template requirement, rapid printing at low cost, on-demand printing capability, and precise control of the printed material. Computer generated conductive traces or electrode patterns can simply be printed on a thin film substrate with proper conductive ink consisting of nanotubes or nanowires. However, in order to develop nanotube or nanowire ink, there are a few challenges that need to be addressed. The most difficult obstacle to overcome is that of nanotube/nanowire dispersion within a solution. Other challenges include adjusting surface tension and controlling viscosity of the ink as well as treating the surface of the printing substrate. In an attempt to pave the way for nanomaterial inkjet printing, we present a method for preparing carbon nanotube ink as well as its printing technique. A fully printed electrochemical sensor using inkjet-printed carbon nanotube electrodes is also demonstrated as an example of the possibilities for this technology.

  3. Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

    Science.gov (United States)

    Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

    1998-05-10

    We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

  4. Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

    Science.gov (United States)

    Subbaraman, Harish; Hen, Ray T.; Lu, Xuejun; Chen, Maggie Yihong

    2013-01-01

    NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to

  5. Architecture-Level Exploration of Alternative Interconnection Schemes Targeting 3D FPGAs: A Software-Supported Methodology

    Directory of Open Access Journals (Sweden)

    Kostas Siozios

    2008-01-01

    Full Text Available In current reconfigurable architectures, the interconnection structures increasingly contribute more to the delay and power consumption. The demand for increased clock frequencies and logic density (smaller area footprint makes the problem even more important. Three-dimensional (3D architectures are able to alleviate this problem by accommodating a number of functional layers, each of which might be fabricated in different technology. However, the benefits of such integration technology have not been sufficiently explored yet. In this paper, we propose a software-supported methodology for exploring and evaluating alternative interconnection schemes for 3D FPGAs. In order to support the proposed methodology, three new CAD tools were developed (part of the 3D MEANDER Design Framework. During our exploration, we study the impact of vertical interconnection between functional layers in a number of design parameters. More specifically, the average gains in operation frequency, power consumption, and wirelength are 35%, 32%, and 13%, respectively, compared to existing 2D FPGAs with identical logic resources. Also, we achieve higher utilization ratio for the vertical interconnections compared to existing approaches by 8% for designing 3D FPGAs, leading to cheaper and more reliable devices.

  6. Generation adequacy and transmission interconnection in regional electricity markets

    International Nuclear Information System (INIS)

    Cepeda, Mauricio; Saguan, Marcelo; Finon, Dominique; Pignon, Virginie

    2009-01-01

    The power system capacity adequacy has public good features that cannot be entirely solved by electricity markets. Regulatory intervention is then necessary and established methods have been used to assess adequacy and help regulators to fix this market failure. In regional electricity markets, transmission interconnections play an important role in contributing to adequacy. However, the adequacy problem and related policy are typically considered at a national level. This paper presents a simple model to study how the interconnection capacity interacts with generation adequacy. First results indicate that increasing interconnection capacity between systems improves adequacy up to a certain level; further increases do not procure additional adequacy improvements. Furthermore, besides adequacy improvement, increasing transmission capacity under asymmetric adequacy criteria or national system characteristics could create several concerns about externalities. These results imply that regional coordination of national adequacy policies is essential to internalise adequacy of cross-border effects.

  7. Performance of WCN diffusion barrier for Cu multilevel interconnects

    Science.gov (United States)

    Lee, Seung Yeon; Ju, Byeong-Kwon; Kim, Yong Tae

    2018-04-01

    The electrical and thermal properties of a WCN diffusion barrier have been studied for Cu multilevel interconnects. The WCN has been prepared using an atomic layer deposition system with WF6-CH4-NH3-H2 gases and has a very low resistivity of 100 µΩ cm and 96.9% step coverage on the high-aspect-ratio vias. The thermally stable WCN maintains an amorphous state at 800 °C and Cu/WCN contact resistance remains within a 10% deviation from the initial value after 700 °C. The mean time to failure suggests that the Cu/WCN interconnects have a longer lifetime than Cu/TaN and Cu/WN interconnects because WCN prevents Cu migration owing to the stress evolution from tensile to compressive.

  8. Net Metering and Interconnection Procedures-- Incorporating Best Practices

    Energy Technology Data Exchange (ETDEWEB)

    Jason Keyes, Kevin Fox, Joseph Wiedman, Staff at North Carolina Solar Center

    2009-04-01

    State utility commissions and utilities themselves are actively developing and revising their procedures for the interconnection and net metering of distributed generation. However, the procedures most often used by regulators and utilities as models have not been updated in the past three years, in which time most of the distributed solar facilities in the United States have been installed. In that period, the Interstate Renewable Energy Council (IREC) has been a participant in more than thirty state utility commission rulemakings regarding interconnection and net metering of distributed generation. With the knowledge gained from this experience, IREC has updated its model procedures to incorporate current best practices. This paper presents the most significant changes made to IREC’s model interconnection and net metering procedures.

  9. Bi cluster-assembled interconnects produced using SU8 templates

    International Nuclear Information System (INIS)

    Partridge, J G; Matthewson, T; Brown, S A

    2007-01-01

    Bi clusters with an average diameter of 25 nm have been deposited from an inert gas aggregation source and assembled into thin-film interconnects which are formed between planar electrical contacts and supported on Si substrates passivated with Si 3 N 4 or thermally grown oxide. A layer of SU8 (a negative photoresist based on EPON SU-8 epoxy resin) is patterned using optical or electron-beam lithography, and it defines the position and dimensions of the cluster film. The conduction between the contacts is monitored throughout the deposition/assembly process, and subsequent I(V) characterization is performed in situ. Bi cluster-assembled interconnects have been fabricated with nanoscale widths and with up to 1:1 thickness:width aspect ratios. The conductivity of these interconnects has been increased, post-deposition, using a simple thermal annealing process

  10. Carbon nanotube based VLSI interconnects analysis and design

    CERN Document Server

    Kaushik, Brajesh Kumar

    2015-01-01

    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

  11. 3D Printed Bionic Nanodevices.

    Science.gov (United States)

    Kong, Yong Lin; Gupta, Maneesh K; Johnson, Blake N; McAlpine, Michael C

    2016-06-01

    The ability to three-dimensionally interweave biological and functional materials could enable the creation of bionic devices possessing unique and compelling geometries, properties, and functionalities. Indeed, interfacing high performance active devices with biology could impact a variety of fields, including regenerative bioelectronic medicines, smart prosthetics, medical robotics, and human-machine interfaces. Biology, from the molecular scale of DNA and proteins, to the macroscopic scale of tissues and organs, is three-dimensional, often soft and stretchable, and temperature sensitive. This renders most biological platforms incompatible with the fabrication and materials processing methods that have been developed and optimized for functional electronics, which are typically planar, rigid and brittle. A number of strategies have been developed to overcome these dichotomies. One particularly novel approach is the use of extrusion-based multi-material 3D printing, which is an additive manufacturing technology that offers a freeform fabrication strategy. This approach addresses the dichotomies presented above by (1) using 3D printing and imaging for customized, hierarchical, and interwoven device architectures; (2) employing nanotechnology as an enabling route for introducing high performance materials, with the potential for exhibiting properties not found in the bulk; and (3) 3D printing a range of soft and nanoscale materials to enable the integration of a diverse palette of high quality functional nanomaterials with biology. Further, 3D printing is a multi-scale platform, allowing for the incorporation of functional nanoscale inks, the printing of microscale features, and ultimately the creation of macroscale devices. This blending of 3D printing, novel nanomaterial properties, and 'living' platforms may enable next-generation bionic systems. In this review, we highlight this synergistic integration of the unique properties of nanomaterials with the

  12. 3D Printed Bionic Nanodevices

    Science.gov (United States)

    Kong, Yong Lin; Gupta, Maneesh K.; Johnson, Blake N.; McAlpine, Michael C.

    2016-01-01

    Summary The ability to three-dimensionally interweave biological and functional materials could enable the creation of bionic devices possessing unique and compelling geometries, properties, and functionalities. Indeed, interfacing high performance active devices with biology could impact a variety of fields, including regenerative bioelectronic medicines, smart prosthetics, medical robotics, and human-machine interfaces. Biology, from the molecular scale of DNA and proteins, to the macroscopic scale of tissues and organs, is three-dimensional, often soft and stretchable, and temperature sensitive. This renders most biological platforms incompatible with the fabrication and materials processing methods that have been developed and optimized for functional electronics, which are typically planar, rigid and brittle. A number of strategies have been developed to overcome these dichotomies. One particularly novel approach is the use of extrusion-based multi-material 3D printing, which is an additive manufacturing technology that offers a freeform fabrication strategy. This approach addresses the dichotomies presented above by (1) using 3D printing and imaging for customized, hierarchical, and interwoven device architectures; (2) employing nanotechnology as an enabling route for introducing high performance materials, with the potential for exhibiting properties not found in the bulk; and (3) 3D printing a range of soft and nanoscale materials to enable the integration of a diverse palette of high quality functional nanomaterials with biology. Further, 3D printing is a multi-scale platform, allowing for the incorporation of functional nanoscale inks, the printing of microscale features, and ultimately the creation of macroscale devices. This blending of 3D printing, novel nanomaterial properties, and ‘living’ platforms may enable next-generation bionic systems. In this review, we highlight this synergistic integration of the unique properties of nanomaterials with

  13. Influence of cell printing on biological characters of chondrocytes.

    Science.gov (United States)

    Qu, Miao; Gao, Xiaoyan; Hou, Yikang; Shen, Congcong; Xu, Yourong; Zhu, Ming; Wang, Hengjian; Xu, Haisong; Chai, Gang; Zhang, Yan

    2015-01-01

    To establish a two-dimensional biological printing technique of chondrocytes and compare the difference of related biological characters between printed chondrocytes and unprinted cells so as to control the cell transfer process and keep cell viability after printing. Primary chondrocytes were obtained from human mature and fetal cartilage tissues and then were regularly sub-cultured to harvest cells at passage 2 (P2), which were adjusted to the single cell suspension at a density of 1×10(6)/mL. The experiment was divided into 2 groups: experimental group P2 chondrocytes were transferred by rapid prototype biological printer (driving voltage value 50 V, interval in x-axis 300 μm, interval in y-axis 1500 μm). Afterwards Live/Dead viability Kit and flow cytometry were respectively adopted to detect cell viability; CCK-8 Kit was adopted to detect cell proliferation viability; immunocytochemistry, immunofluorescence and RT-PCR was employed to identify related markers of chondrocytes; control group steps were the same as the printing group except that cell suspension received no printing. Fluorescence microscopy and flow cytometry analyses showed that there was no significant difference between experimental group and control group in terms of cell viability. After 7-day in vitro culture, control group exhibited higher O.D values than experimental group from 2nd day to 7th day but there was no distinct difference between these two groups (P>0.05). Inverted microscope observation demonstrated that the morphology of these two groups had no significant difference either. Similarly, Immunocytochemistry, immunofluorescence and RT-PCR assays also showed that there was no significant difference in the protein and gene expression of type II collagen and aggrecan between these two groups (P>0.05). Conclusion Cell printing has no distinctly negative effect on cell vitality, proliferation and phenotype of chondrocytes. Biological printing technique may provide a novel approach

  14. Natural gas and electrical interconnections in the Mediterranean Basin

    International Nuclear Information System (INIS)

    Grenon, M.

    1992-01-01

    Intermediate and long term socio-economical and energetic scenarios have shown that mediterranean basin countries will know a great growth of energy demand, particularly power demand. The first part of this paper describes the main projects for the establishment of interconnected natural gas systems through Mediterranean sea, by pipelines (Algeria-Tunisia-Libya project, Algeria-Morocco-Spain project, Libya-Italy project). The second part describes the main projects of electrical networks with the establishment of undersea links between Spain and Morocco, and between Italy and Tunisia; beefing up the interconnections between the North African countries; and developing ties in the Near East (from Egypt to Turkey)

  15. EEG simulation by 2D interconnected chaotic oscillators

    International Nuclear Information System (INIS)

    Kubany, Adam; Mhabary, Ziv; Gontar, Vladimir

    2011-01-01

    Research highlights: → ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. → An inverse problem solution (PRCGA) is proposed. → Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  16. Fundamentals of reliability engineering applications in multistage interconnection networks

    CERN Document Server

    Gunawan, Indra

    2014-01-01

    This book presents fundamentals of reliability engineering with its applications in evaluating reliability of multistage interconnection networks. In the first part of the book, it introduces the concept of reliability engineering, elements of probability theory, probability distributions, availability and data analysis.  The second part of the book provides an overview of parallel/distributed computing, network design considerations, and more.  The book covers a comprehensive reliability engineering methods and its practical aspects in the interconnection network systems. Students, engineers, researchers, managers will find this book as a valuable reference source.

  17. Load Frequency Control of AC Microgrid Interconnected Thermal Power System

    Science.gov (United States)

    Lal, Deepak Kumar; Barisal, Ajit Kumar

    2017-08-01

    In this paper, a microgrid (MG) power generation system is interconnected with a single area reheat thermal power system for load frequency control study. A new meta-heuristic optimization algorithm i.e. Moth-Flame Optimization (MFO) algorithm is applied to evaluate optimal gains of the fuzzy based proportional, integral and derivative (PID) controllers. The system dynamic performance is studied by comparing the results with MFO optimized classical PI/PID controllers. Also the system performance is investigated with fuzzy PID controller optimized by recently developed grey wolf optimizer (GWO) algorithm, which has proven its superiority over other previously developed algorithm in many interconnected power systems.

  18. EEG simulation by 2D interconnected chaotic oscillators

    Energy Technology Data Exchange (ETDEWEB)

    Kubany, Adam, E-mail: adamku@bgu.ac.i [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel); Mhabary, Ziv; Gontar, Vladimir [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel)

    2011-01-15

    Research highlights: ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. An inverse problem solution (PRCGA) is proposed. Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  19. Supplemental Information for New York State Standardized Interconnection Requirements

    Energy Technology Data Exchange (ETDEWEB)

    Ingram, Michael [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narang, David J. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Mather, Barry A. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Kroposki, Benjamin D. [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-10-24

    This document is intended to aid in the understanding and application of the New York State Standardized Interconnection Requirements (SIR) and Application Process for New Distributed Generators 5 MW or Less Connected in Parallel with Utility Distribution Systems, and it aims to provide supplemental information and discussion on selected topics relevant to the SIR. This guide focuses on technical issues that have to date resulted in the majority of utility findings within the context of interconnecting photovoltaic (PV) inverters. This guide provides background on the overall issue and related mitigation measures for selected topics, including substation backfeeding, anti-islanding and considerations for monitoring and controlling distributed energy resources (DER).

  20. Compact models and performance investigations for subthreshold interconnects

    CERN Document Server

    Dhiman, Rohit

    2014-01-01

    The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wi

  1. 3D-printing zirconia implants; a dream or a reality? An in-vitro study evaluating the dimensional accuracy, surface topography and mechanical properties of printed zirconia implant and discs.

    Science.gov (United States)

    Osman, Reham B; van der Veen, Albert J; Huiberts, Dennis; Wismeijer, Daniel; Alharbi, Nawal

    2017-11-01

    The aim of this study was to evaluate the dimensional accuracy, surface topography of a custom designed, 3D-printed zirconia dental implant and the mechanical properties of printed zirconia discs. A custom designed implant was 3D-printed in zirconia using digital light processing technique (DLP). The dimensional accuracy was assessed using the digital-subtraction technique. The mechanical properties were evaluated using biaxial flexure strength test. Three different build angles were adopted to print the specimens for the mechanical test; 0°(Vertical), 45° (Oblique) and 90°(Horizontal) angles. The surface topography, crystallographic phase structure and surface roughness were evaluated using scanning electron microscopy analysis (SEM), X-ray diffractometer and confocal microscopy respectively. The printed implant was dimensionally accurate with a root mean square (RMSE) value of 0.1mm. The Weibull analysis revealed a statistically significant higher characteristic strength (1006.6MPa) of 0° printed specimens compared to the other two groups and no significant difference between 45° (892.2MPa) and 90° (866.7MPa) build angles. SEM analysis revealed cracks, micro-porosities and interconnected pores ranging in size from 196nm to 3.3µm. The mean Ra (arithmetic mean roughness) value of 1.59µm (±0.41) and Rq (root mean squared roughness) value of 1.94µm (±0.47) was found. A crystallographic phase of primarily tetragonal zirconia typical of sintered Yttria tetragonal stabilized zirconia (Y-TZP) was detected. DLP prove to be efficient for printing customized zirconia dental implants with sufficient dimensional accuracy. The mechanical properties showed flexure strength close to those of conventionally produced ceramics. Optimization of the 3D-printing process parameters is still needed to improve the microstructure of the printed objects. Copyright © 2017 Elsevier Ltd. All rights reserved.

  2. Print Finishing: From Manual to Automated Print Finishing

    Directory of Open Access Journals (Sweden)

    Gareth Ward

    2004-12-01

    Full Text Available Meeting the demand for faster turnrounds and shorter print runs goes beyond making the printing press easier to set up and change. There is little point in producing plates and then sheets from a press if the post press area does not change to keep abreast of developments in prepress and the print room. The greatest impact is going to come from JDF, the end to end production data format which is finding wide spread acceptance in print areas. To date finishing equipment manufacturers are not as well represented within the CIP4 organisation as prepress and press vendors, but the major manufacturers are members. All are working to the goal of complete connectivity.The idea of JDF is that if the format of a print product like a magazine is known during the creation phases, the information can be used to preset machinery that is going to be used to produce it, so avoiding input errors and saving manufacturing time.A second aspect to JDF is that information about performance and progress is gathered and can be retrieved from a central point or made available to a customer. Production scheduling and costing becomes more accurate and customer relationships are deepened. However JDF to its fullest extent is not yet in use in connecting the finishing area to the rest of the printing plant. Around the world different companies are testing the idea of JDF to connect saddle stitchers, guillotines and binders with frantic work underway to be able to show results soon.

  3. Printed all-solid flexible microsupercapacitors: towards the general route for high energy storage devices

    International Nuclear Information System (INIS)

    Wang, Ye; Shi, Yumeng; Zhao, Cheng Xi; Wong, Jen It; Yang, Hui Ying; Sun, Xiao Wei

    2014-01-01

    A novel method for fabricating all-solid flexible microsupercapacitors (MSCs) was proposed and developed by utilizing screen printing technology. A typical printed MSC is composed of a printed Ag electrode, MnO 2 /onion-like carbon (MnO 2 /OLC) as active material and a polyvinyl alcohol:H 3 PO 4 (PVA:H 3 PO 4 ) as solid electrolyte. A capacity of 7.04 mF cm −2 was achieved for the screen printed MnO 2 /OLC MSCs at a current density of 20 μA cm −2 . It also showed an excellent cycling stability, with 80% retention of the specific capacity after 1000 cycles. The printed all-solid flexible MSCs exhibited remarkably high mechanical flexibility when the devices were bent to a radius of 3.5 mm. In addition, all-solid MSCs were successfully demonstrated by screen printing technique on various substrates, such as silicon, glass and conventional printing paper. Moreover, the screen printing technique can be extended to other active materials, such as OLC and carbon nanotubes. This method provides a general route for printable all-solid flexible MSCs, which is compatible with the roll-to-roll process for various high performance active materials. (paper)

  4. 3D Printing: Print the future of ophthalmology.

    Science.gov (United States)

    Huang, Wenbin; Zhang, Xiulan

    2014-08-26

    The three-dimensional (3D) printer is a new technology that creates physical objects from digital files. Recent technological advances in 3D printing have resulted in increased use of this technology in the medical field, where it is beginning to revolutionize medical and surgical possibilities. It is already providing medicine with powerful tools that facilitate education, surgical planning, and organ transplantation research. A good understanding of this technology will be beneficial to ophthalmologists. The potential applications of 3D printing in ophthalmology, both current and future, are explored in this article. Copyright 2014 The Association for Research in Vision and Ophthalmology, Inc.

  5. Balkan Print Forum – Dynamic Balkan Print Media Community

    Directory of Open Access Journals (Sweden)

    Rossitza Velkova

    2011-11-01

    Full Text Available Founded in October 2006, the Balkan Print Forum is gradually becoming an important regional institution. Its main targets are to share experiences and know-how,to initiate and intensify contacts and to support joint projects in the Balkan region.Since drupa 2008 there are 11 member countries of the Balkan Print Forum:Albania, Bosnia and Herzegovina, Bulgaria, Croatia, Former Yugoslav Republic of Macedonia, Greece, Hungary, Romania, Serbia, Slovenia and Turkey. Partners of BPF are some companies and universities from Russia and Ukraine.

  6. A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

    International Nuclear Information System (INIS)

    Broadbent, H A; Ketterl, T P; Reid, C S

    2010-01-01

    The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

  7. Zirconia UV-curable colloids for additive manufacturing via hybrid inkjet printing-stereolithography

    DEFF Research Database (Denmark)

    Rosa, Massimo; Barou, C.; Esposito, Vincenzo

    2018-01-01

    Currently, additive manufacturing of ceramics by stereolithography (SLA) is limited to single materials and by a poor thickness resolution that strongly depends on the ceramic particles-UV light interaction. Combining selective laser curing with inkjet printing represents a novel strategy...... to overcome these constrains. Nonetheless, this approach requires UV-curable inks that allow hardening of the printed material and sintering to high density. In this work, we report how to design an ink for inkjet printing of yttria stabilized zirconia (YSZ) which can be impressed by addition of UV...

  8. Impact of Particle Size of Ceramic Granule Blends on Mechanical Strength and Porosity of 3D Printed Scaffolds

    Directory of Open Access Journals (Sweden)

    Sebastian Spath

    2015-07-01

    Full Text Available 3D printing is a promising method for the fabrication of scaffolds in the field of bone tissue engineering. To date, the mechanical strength of 3D printed ceramic scaffolds is not sufficient for a variety of applications in the reconstructive surgery. Mechanical strength is directly in relation with the porosity of the 3D printed scaffolds. The porosity is directly influenced by particle size and particle-size distribution of the raw material. To investigate this impact, a hydroxyapatite granule blend with a wide particle size distribution was fractioned by sieving. The specific fractions and bimodal mixtures of the sieved granule blend were used to 3D print specimens. It has been shown that an optimized arrangement of fractions with large and small particles can provide 3D printed specimens with good mechanical strength due to a higher packing density. An increase of mechanical strength can possibly expand the application area of 3D printed hydroxyapatite scaffolds.

  9. Nanoparticle composites for printed electronics

    International Nuclear Information System (INIS)

    Männl, U; Van den Berg, C; Magunje, B; Härting, M; Britton, D T; Jones, S; Van Staden, M J; Scriba, M R

    2014-01-01

    Printed Electronics is a rapidly developing sector in the electronics industry, in which nanostructured materials are playing an increasingly important role. In particular, inks containing dispersions of semiconducting nanoparticles, can form nanocomposite materials with unique electronic properties when cured. In this study we have extended on our previous studies of functional nanoparticle electronic inks, with the development of a solvent-based silicon ink for printed electronics which is compatible with existing silver inks, and with the investigation of other metal nanoparticle based inks. It is shown that both solvent-based and water-based inks can be used for both silver conductors and semiconducting silicon, and that qualitatively there is no difference in the electronic properties of the materials printed with a soluble polymer binder to when an acrylic binder is used. (paper)

  10. All-printed paper memory

    KAUST Repository

    He, Jr-Hau

    2016-08-11

    All-printed paper-based substrate memory devices are described. In an embodiment, a paper-based memory device is prepared by coating one or more areas of a paper substrate with a conductor material such as a carbon paste, to form a first electrode of a memory, depositing a layer of insulator material, such as titanium dioxide, over one or more areas of the conductor material, and depositing a layer of metal over one or more areas of the insulator material to form a second electrode of the memory. In an embodiment, the device can further include diodes printed between the insulator material and the second electrode, and the first electrode and the second electrodes can be formed as a crossbar structure to provide a WORM memory. The various layers and the diodes can be printed onto the paper substrate by, for example, an ink jet printer.

  11. Patterned Liquid Metal Contacts for Printed Carbon Nanotube Transistors.

    Science.gov (United States)

    Andrews, Joseph B; Mondal, Kunal; Neumann, Taylor V; Cardenas, Jorge A; Wang, Justin; Parekh, Dishit P; Lin, Yiliang; Ballentine, Peter; Dickey, Michael D; Franklin, Aaron D

    2018-05-14

    Flexible and stretchable electronics are poised to enable many applications that cannot be realized with traditional, rigid devices. One of the most promising options for low-cost stretchable transistors are printed carbon nanotubes (CNTs). However, a major limiting factor in stretchable CNT devices is the lack of a stable and versatile contact material that forms both the interconnects and contact electrodes. In this work, we introduce the use of eutectic gallium-indium (EGaIn) liquid metal for electrical contacts to printed CNT channels. We analyze thin-film transistors (TFTs) fabricated using two different liquid metal deposition techniques-vacuum-filling polydimethylsiloxane (PDMS) microchannel structures and direct-writing liquid metals on the CNTs. The highest performing CNT-TFT was realized using vacuum-filled microchannel deposition with an in situ annealing temperature of 150 °C. This device exhibited an on/off ratio of more than 10 4 and on-currents as high as 150 μA/mm-metrics that are on par with other printed CNT-TFTs. Additionally, we observed that at room temperature the contact resistances of the vacuum-filled microchannel structures were 50% lower than those of the direct-write structures, likely due to the poor adhesion between the materials observed during the direct-writing process. The insights gained in this study show that stretchable electronics can be realized using low-cost and solely solution processing techniques. Furthermore, we demonstrate methods that can be used to electrically characterize semiconducting materials as transistors without requiring elevated temperatures or cleanroom processes.

  12. The Fabrication of Non-Implant 3D Printed Nose

    Directory of Open Access Journals (Sweden)

    Chuan Yong Leng

    2018-01-01

    Full Text Available Non-surgical rhinoplasty procedures which involves the use of injectable derma fillers are highly risky as patients are susceptible to side effects and complications that may cause unwanted changes in their appearance. This research explores an alternative method of non-surgical rhinoplasty for patients seeking augmentation of the nose with the use of three-dimensional (3D printing. Most rhinoplasty procedures are conducted with the intention of enhancing the aesthetical features of the nose, a 3D model nose was designed based on the combination of the average and the ideal aesthetic parameters of the Northern European Caucasians and South Asia Chinese nose. The modelling of nose is done using the SolidWorks CAD software. An initial design was sketched in a polygon mesh form and further improved on. Different printing materials and infill densities were compared to determine the suitable printing technique. The final nose model is then printed using the Ultimaker 3D printer using Polylactic acid (PLA with an infill density of 100% at a thickness of 1.4 mm. An inner layer to the 3D printed nose was developed for comfortable attachment of the nose model to human skin. The inner layer was fabricated using agar gelatine. Experiments were carried out to increase the strength and adhesiveness of the gelatine so that it could adhere to the human skin and the PLA surface. Tensile and adhesive strength tests were carried out to determine the suitable gel composition for the attachment of the nose to the user’s face. The key outcome from the experiments using natural gelatine was capability of gel to act as an inner layer for the temporary attachment of the 3D nose model to the human skin

  13. Fully roll-to-roll gravure printed rectenna on plastic foils for wireless power transmission at 13.56 MHz.

    Science.gov (United States)

    Park, Hyejin; Kang, Hwiwon; Lee, Yonggil; Park, Yongsu; Noh, Jinsoo; Cho, Gyoujin

    2012-08-31

    Wireless power transmission to inexpensive and disposable smart electronic devices is one of the key issues for the realization of a ubiquitous society where sensor networks such as RFID tags, price tags, smart logos, signage and sensors could be fully interconnected and utilized by DC power of less than 0.3 W. This DC power can be provided by inductively coupled AC from a 13.56 MHz power transmitter through a rectenna, consisting of an antenna, a diode and a capacitor, which would be cheap to integrate with inexpensive smart electronic devices. To integrate the rectenna with a minimum cost, a roll-to-roll (R2R) gravure printing process has been considered to print the rectenna on plastic foils. In this paper, R2R gravure printing systems including printing condition and four different nanoparticle based inks will be reported to print the rectenna (antenna, diode and capacitor) on plastic foils at a printing speed of 8 m min(-1) and more than 90% device yield for a wireless power transmission of 0.3 W using a standard 13.56 MHz power transmitter.

  14. Optical interconnection networks for high-performance computing systems

    International Nuclear Information System (INIS)

    Biberman, Aleksandr; Bergman, Keren

    2012-01-01

    Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers. (review article)

  15. Encoded low swing for ultra low power interconnect

    NARCIS (Netherlands)

    Krishnan, R.; Pineda de Gyvez, J.

    2003-01-01

    We present a novel encoded-low swing technique for ultra low power interconnect. Using this technique and an efficient circuit implementation, we achieve an average of 45.7% improvement in the power-delay product over the schemes utilizing low swing techniques alone, for random bit streams. Also, we

  16. Distributed Robustness Analysis of Interconnected Uncertain Systems Using Chordal Decomposition

    DEFF Research Database (Denmark)

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard

    2014-01-01

    Large-scale interconnected uncertain systems commonly have large state and uncertainty dimensions. Aside from the heavy computational cost of performing robust stability analysis in a centralized manner, privacy requirements in the network can also introduce further issues. In this paper, we util...

  17. Interconnecting Microgrids via the Energy Router with Smart Energy Management

    Directory of Open Access Journals (Sweden)

    Yingshu Liu

    2017-08-01

    Full Text Available A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage equipment. The key idea is to establish complementary energy exchange between adjacent microgrids through a multiport electrical energy router, according to the consideration that adjacent microgrids may differ substantially in terms of their patterns of energy production and consumption, which can be utilized to compensate for each other’s instant energy deficit. Based on multiport bidirectional voltage source converters (VSCs and a shared direct current (DC power line, the energy router serves as an energy hub, and enables flexible energy flow among the adjacent microgrids and the main grid. The analytical model is established for the whole system, including the energy router, the interconnected microgrids and the main grid. Various operational modes of the interconnected microgrids, facilitated by the energy router, are analyzed, and the corresponding control strategies are developed. Simulations are carried out on the Matlab/Simulink platform, and the results have demonstrated the validity and reliability of the idea for microgrid interconnection as well as the corresponding control strategies for flexible energy flow.

  18. FDTD technique based crosstalk analysis of bundled SWCNT interconnects

    International Nuclear Information System (INIS)

    Duksh, Yograj Singh; Kaushik, Brajesh Kumar; Agarwal, Rajendra P.

    2015-01-01

    The equivalent electrical circuit model of a bundled single-walled carbon nanotube based distributed RLC interconnects is employed for the crosstalk analysis. The accurate time domain analysis and crosstalk effect in the VLSI interconnect has emerged as an essential design criteria. This paper presents a brief description of the numerical method based finite difference time domain (FDTD) technique that is intended for estimation of voltages and currents on coupled transmission lines. For the FDTD implementation, the stability of the proposed model is strictly restricted by the Courant condition. This method is used for the estimation of crosstalk induced propagation delay and peak voltage in lossy RLC interconnects. Both functional and dynamic crosstalk effects are analyzed in the coupled transmission line. The effect of line resistance on crosstalk induced delay, and peak voltage under dynamic and functional crosstalk is also evaluated. The FDTD analysis and the SPICE simulations are carried out at 32 nm technology node for the global interconnects. It is observed that the analytical results obtained using the FDTD technique are in good agreement with the SPICE simulation results. The crosstalk induced delay, propagation delay, and peak voltage obtained using the FDTD technique shows average errors of 4.9%, 3.4% and 0.46%, respectively, in comparison to SPICE. (paper)

  19. The myth of interconnected plastids and related phenomena.

    Science.gov (United States)

    Schattat, Martin H; Barton, Kiah A; Mathur, Jaideep

    2015-01-01

    Studies spread over nearly two and a half centuries have identified the primary plastid in autotrophic algae and plants as a pleomorphic, multifunctional organelle comprising of a double-membrane envelope enclosing an organization of internal membranes submerged in a watery stroma. All plastid units have been observed extending and retracting thin stroma-filled tubules named stromules sporadically. Observations on living plant cells often convey the impression that stromules connect two or more independent plastids with each other. When photo-bleaching techniques were used to suggest that macromolecules such as the green fluorescent protein could flow between already interconnected plastids, for many people this impression changed to conviction. However, it was noticed only recently that the concept of protein flow between plastids rests solely on the words "interconnected plastids" for which details have never been provided. We have critically reviewed botanical literature dating back to the 1880s for understanding this term and the phenomena that have become associated with it. We find that while meticulously detailed ontogenic studies spanning nearly 150 years have established the plastid as a singular unit organelle, there is no experimental support for the idea that interconnected plastids exist under normal conditions of growth and development. In this review, while we consider several possibilities that might allow a single elongated plastid to be misinterpreted as two or more interconnected plastids, our final conclusion is that the concept of direct protein flow between plastids is based on an unfounded assumption.

  20. Load frequency control of three area interconnected hydro-thermal ...

    African Journals Online (AJOL)

    This paper present analysis on dynamic performance of Load Frequency Control (LFC) of three area interconnected hydrothermal reheat power system by the use of Artificial Intelligent and PI Controller. In the proposed scheme, control methodology developed using conventional PI controller, Artificial Neural Network ...

  1. Optimal interconnect ATPG under a ground-bounce constraint

    NARCIS (Netherlands)

    Hollmann, H.D.L.; Marinissen, E.J.; Vermeulen, B.

    In order to prevent ground bounce, Automatic Test Pattern Generation (ATPG) algorithms for wire interconnects have recently been extended with the capability to restrict the maximal Hamming distance between any two consecutive test patterns to a user-defined integer, referred to as the

  2. Time analysis of interconnection network implemented on the honeycomb architecture

    Energy Technology Data Exchange (ETDEWEB)

    Milutinovic, D [Inst. Michael Pupin, Belgrade (Yugoslavia)

    1996-12-31

    Problems of time domains analysis of the mapping of interconnection networks for parallel processing on one form of uniform massively parallel architecture of the cellular type are considered. The results of time analysis are discussed. It is found that changing the technology results in changing the mapping rules. 17 refs.

  3. Area analysis of interconnection networks implemented on the honeycomb architecture

    Energy Technology Data Exchange (ETDEWEB)

    Milutinovic, D

    1996-12-31

    The are utilization of interconnection networks for parallel processing on one form of uniform parallel architecture of cellular type is analyzed. Formulae for the number of cells necessity to realize a networks and the efficiency factor of the system are derived. 15 refs.

  4. 14 CFR 25.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Powerplant Fuel System § 25.957 Flow between interconnected tanks. If fuel can be pumped from one tank to another in flight, the fuel tank vents and the fuel transfer system must be designed so that no structural damage to the tanks can occur because of overfilling. ...

  5. On Interconnections of Infinite-dimensional Port-Hamiltonian Systems

    NARCIS (Netherlands)

    Pasumarthy, Ramkrishna; Schaft, Arjan J. van der

    2004-01-01

    Network modeling of complex physical systems leads to a class of nonlinear systems called port-Hamiltonian systems, which are defined with respect to a Dirac structure (a geometric structure which formalizes the power-conserving interconnection structure of the system). A power conserving

  6. On interconnections of infinite-dimensional port-Hamiltonian systems

    NARCIS (Netherlands)

    Ramkrishna Pasumarthy, R.P.; van der Schaft, Arjan

    2004-01-01

    Network modeling of complex physical systems leads to a class of nonlinear systems called port-Hamiltonian systems, which are defined with respect to a Dirac structure (a geometric structure which formalizes the power-conserving interconnection structure of the system). A power conserving

  7. Bandwidth Analysis of Functional Interconnects Used as Test Access Mechanism

    NARCIS (Netherlands)

    Van den Berg, A.; Ren, P.; Marinissen, E.J.; Gaydadjiev, G.; Goossens, K.

    2010-01-01

    Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or

  8. Bandwidth analysis of functional interconnects used as test access mechanism

    NARCIS (Netherlands)

    Berg, van den Ardy; Ren, P.; Marinissen, Erik Jan; Gaydadjiev, G.N.; Goossens, K.G.W.

    2010-01-01

    Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or

  9. Cascade-robustness optimization of coupling preference in interconnected networks

    International Nuclear Information System (INIS)

    Zhang, Xue-Jun; Xu, Guo-Qiang; Zhu, Yan-Bo; Xia, Yong-Xiang

    2016-01-01

    Highlights: • A specific memetic algorithm was proposed to optimize coupling links. • A small toy model was investigated to examine the underlying mechanism. • The MA optimized strategy exhibits a moderate assortative pattern. • A novel coupling coefficient index was proposed to quantify coupling preference. - Abstract: Recently, the robustness of interconnected networks has attracted extensive attentions, one of which is to investigate the influence of coupling preference. In this paper, the memetic algorithm (MA) is employed to optimize the coupling links of interconnected networks. Afterwards, a comparison is made between MA optimized coupling strategy and traditional assortative, disassortative and random coupling preferences. It is found that the MA optimized coupling strategy with a moderate assortative value shows an outstanding performance against cascading failures on both synthetic scale-free interconnected networks and real-world networks. We then provide an explanation for this phenomenon from a micro-scope point of view and propose a coupling coefficient index to quantify the coupling preference. Our work is helpful for the design of robust interconnected networks.

  10. Security challenges for cooperative and interconnected mobility systems

    NARCIS (Netherlands)

    Bijlsma, T.; Kievit, S. de; Sluis, H.J.D. van de; Nunen, E. van; Passchier, I.; Luiijf, H.A.M.

    2013-01-01

    Software is becoming an important part of the innovation for vehicles. In addition, the systems in vehicles become interconnected and also get external connections, to the internet and Vehicular Ad hoc NETworks (VANETs). These trends form a combined security and safety threat, because recent

  11. A high-speed interconnect network using ternary logic

    DEFF Research Database (Denmark)

    Madsen, Jens Kargaard; Long, S. I.

    1995-01-01

    This paper describes the design and implementation of a high-speed interconnect network (ICN) for a multiprocessor system using ternary logic. By using ternary logic and a fast point-to-point communication technique called STARI (Self-Timed At Receiver's Input), the communication between...

  12. Early resistance change and stress/electromigrationmodeling in aluminium interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.; Schoenmaker, W.

    1997-01-01

    A complete description for early resistance change and two dimensional simulation of mechanical stress evolution in confined Al interconnects, related to the electromigration, is given in this paper. The model, combines the stress/ vacancy concentration evolution with the early resistance change of

  13. Knowledge Access in Rural Inter-connected Areas Network ...

    International Development Research Centre (IDRC) Digital Library (Canada)

    Knowledge Access in Rural Inter-connected Areas Network (KariaNet) - Phase II ... and indigenous knowledge using information and communication technologies (ICTs) ... for research proposals on the aforementioned topics, action-research projects, ... Evaluating knowledge-sharing methods to improve land utilization and ...

  14. Advanced Modulation Techniques for High-Performance Computing Optical Interconnects

    DEFF Research Database (Denmark)

    Karinou, Fotini; Borkowski, Robert; Zibar, Darko

    2013-01-01

    We experimentally assess the performance of a 64 × 64 optical switch fabric used for ns-speed optical cell switching in supercomputer optical interconnects. More specifically, we study four alternative modulation formats and detection schemes, namely, 10-Gb/s nonreturn-to-zero differential phase-...

  15. The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

    Directory of Open Access Journals (Sweden)

    Amlan Ganguly

    2018-02-01

    Full Text Available With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

  16. A Novel 2D Porous Print Fabric-like α-Fe_2O_3 Sheet with High Performance as the Anode Material for Lithium-ion Battery

    International Nuclear Information System (INIS)

    Zhang, Suyue; Zhang, Peigen; Xie, Anjian; Li, Shikuo; Huang, Fangzhi; Shen, Yuhua

    2016-01-01

    Anode materials are very crucial in lithium ion batteries. Exploring the simple and low cost production of anodes with excellent electrochemical performance remains a great challenge. Here, we used natural flower spikes of Typha orientalis as the bio-templates and organizers to prepare a novel two-dimensional (2D) porous print fabric-like α-Fe_2O_3 sheet with thickness of about 30 nm. The prepared large-area sheets were orderly assembled by many nanosheets or nanoparticles, and two kinds of pore structures, such as pores with average diameter of about 50 nm or pore channels with aspect ratio of ca. 4, presented between adjacent nanosheets. The pre-treatment by ammonium for flower spikes has a great effect on the microstructure and electrochemical performance of the products. As the anode material for lithium ion battery (LIB), the as-obtained porous print fabric-like α-Fe_2O_3 sheets show an initial discharge capacity of 2264 mA h g"−"1 and the specific capacity of 1028 mA h g"−"1 after 100 cycles at a current density of 500 mA g"−"1, which is higher than the theoretical capacity of α-Fe_2O_3 (1007 mA h g"−"1). This highly reversible capacity is attributed to the very thin large-area sheet structure, and many pores or pore channels among the interconnected nanosheets, which could increase lithium-ion mobility, facilitate the transport of electrons and shorten the distance for Li"+ diffusion, and also buffer large volume changes of the anodes during lithium insertion and extraction at the same time. The synthesis process is very simple, providing a low-cost production approach toward high-performance energy storage materials.

  17. Large Bone Vertical Augmentation Using a Three-Dimensional Printed TCP/HA Bone Graft: A Pilot Study in Dog Mandible.

    Science.gov (United States)

    Carrel, Jean-Pierre; Wiskott, Anselm; Scherrer, Susanne; Durual, Stéphane

    2016-12-01

    Osteoflux is a three-dimensional printed calcium phosphate porous structure for oral bone augmentation. It is a mechanically stable scaffold with a well-defined interconnectivity and can be readily shaped to conform to the bone bed's morphology. An animal experiment is reported whose aim was to assess the performance and safety of the scaffold in promoting vertical growth of cortical bone in the mandible. Four three-dimensional blocks (10 mm length, 5 mm width, 5 mm height) were affixed to edentulous segments of the dog's mandible and covered by a collagen membrane. During bone bed preparation, particular attention was paid not to create defects 0.5 mm or more so that the real potential of the three-dimensional block in driving vertical bone growth can be assessed. Histomorphometric analyses were performed after 8 weeks. At 8 weeks, the three-dimensional blocks led to substantial vertical bone growth up to 4.5 mm from the bone bed. Between 0 and 1 mm in height, 44% of the surface was filled with new bone, at 1 to 3 mm it was 20% to 35%, 18% at 3 to 4, and ca. 6% beyond 4 mm. New bone was evenly distributed along in mesio-distal direction and formed a new crest contour in harmony with the natural mandibular shape. After two months of healing, the three-dimensional printed blocks conducted new bone growth above its natural bed, up to 4.5 mm in a canine mandibular model. Furthermore, the new bone was evenly distributed in height and density along the block. These results are very promising and need to be further evaluated by a complete powerful study using the same model. © 2016 Wiley Periodicals, Inc.

  18. At the speed of light? electricity interconnections for Europe

    International Nuclear Information System (INIS)

    Nies, S.

    2010-01-01

    Electricity moves almost at the speed of light: 273,000 km per second. The speed of electricity makes it the ultimate 'just in time' commodity. A problem anywhere can be transmitted every where in a nanosecond. Electricity interconnection is a prominent issue in the news, sometimes even featured as a panacea for the shortcomings of the European electricity market - a panacea that will ensure security o supply, solidarity and pave the way for a promising use of renewables in the future. The present study is devoted to electricity interconnections in Europe, their current state and the projects concerning them. The study addresses the following questions: - What is the role of interconnections in the development of a sustainable grid that can emerge from the existing pieces, make optimum use of existing generation capacity, ensure energy security, and offer economies of scales? What is their role in the process of building a different energy concept, one that would be concerned with climate change and thus in favour of the use of renewables? - How are existing interconnections exploited and governed, and how can their exploitation be improved? Does the EU need more and new interconnections; and if so, where and why, and who is going to finance them? Prominent projects as such as Desertec, the debate on DC or AC lines, or the limits of synchronization, as well as the state of a potential East-West electricity linkage between Former Soviet Union and EU, termed UCTE-UPS/IPS, are discussed in the volume. Part I develops definitions and basic notions necessary for the understanding of the subject. It also addresses the independent variables that influence interconnections (here the dependent variable), and recounts the historical legacies and their enduring impact on today's grid. Part II is devoted to the EU legal framework and to the complex landscape of governance and its current state of transition. Part III addresses the management of existing interconnections and

  19. 3D inkjet printed radio frequency inductors and capacitors

    KAUST Repository

    Vaseem, Mohammad; McKerricher, Garret; Shamim, Atif

    2016-01-01

    fully printed RF components, the substrate must also be printed. 3D printing of polymers can be an ideal mechanism for printing substrates, however typically such materials cannot handle high sintering temperatures (>150 0C) required for nanoparticles

  20. Interconnected α-Fe2O3 nanosheet arrays as high-performance anode materials for lithium-ion batteries

    International Nuclear Information System (INIS)

    Cai, Dandan; Li, Dongdong; Ding, Liang-Xin; Wang, Suqing; Wang, Haihui

    2016-01-01

    The electrode materials with structure stability and binder-free are urgently required for improving the electrochemical performance of lithium-ion batteries. In this work, interconnected α-Fe 2 O 3 nanosheet arrays directly grown on Ti foil were fabricated via a facile galvanostatic electrodeposition method followed by thermal treatment. The as-prepared α-Fe 2 O 3 has an open network structure constituted of interconnected nanosheets and can be directly used as integrated electrodes for lithium-ion batteries. The α-Fe 2 O 3 nanosheet arrays exhibit a high reversible capacity of 986.3 mAh g −1 at a current density of 100 mA g −1 . Moreover, a reversible capacity of ca. 425.9 mAh g −1 is achieved even at a superhigh current density of 10 A g −1 , which is higher than the theoretical capacity of commercially used graphite. The excellent performance could be attributed to the efficient electron transport, the large electrode/electrolyte interfaces and the good accommodations for volume expansion from the interconnected nanosheet arrays structure.

  1. Printing of the year book, carton boxes and printed envelopes

    Indian Academy of Sciences (India)

    2018-01-18

    Jan 18, 2018 ... Technology, Government of India needs the following book to be printed ... of the documents are not enclosed, the quotation will not be considered. ... The EMD of selected bidder will be kept as security deposit till ... via E-Mail.

  2. Cultural stereotypes in Nigerian print media advertisements ...

    African Journals Online (AJOL)

    Cultural stereotypes in Nigerian print media advertisements. ... Abstract. This study set out to examine the extent to which cultural stereotype roles are depicted in print advertisements in Nigeria. It specifically ... AJOL African Journals Online.

  3. Intrinsic defects in 3D printed materials

    OpenAIRE

    Bolton, Christopher; Dagastine, Raymond

    2015-01-01

    We discuss the impact of bulk structural defects on the coherence, phase and polarisation of light passing through transparent 3D printed materials fabricated using a variety of commercial print technologies.

  4. Assessment of on-farm anaerobic digester grid interconnections

    International Nuclear Information System (INIS)

    Ruhnke, W.

    2006-01-01

    While several anaerobic digestion (AD) pilot plants have recently been built in Canada, early reports suggest that interconnection barriers are delaying their widescale implementation. This paper examined grid interconnection experiences from the perspectives of farmers, local distributing companies (LDCs) and other stakeholders. The aim of the paper was to identify challenges to the implementation of AD systems. Case studies included an Ontario Dairy Herd AD system generating 50 kW; a Saskatchewan hog farm AD system generating 120 kW and an Alberta outdoor beef feedlot AD system generating 1000 kW. Two survey forms were created for project operators, and LDCs. The following 3 category barriers were identified: (1) technical concerns over islanding conditions, power quality requirements, power flow studies and other engineering analyses; (2) business practices barriers such as a lack of response after initial utility contact; and (3) regulatory barriers including the unavailability of fair buy-back rates, the lack of net metering programs, restrictive net metering programs, and pricing issues. It was suggested that collaborative efforts among all stakeholders are needed to resolve barriers quickly. Recommendations included the adoption of uniform technical standards for connecting generators to the grid, as well as adopting standard commercial practices for any required LDC interconnection review. It was also suggested that standard business terms for interconnection agreements should be established. Regulatory principles should be compatible with distributed power choices in regulated and unregulated markets. It was concluded that resolving interconnection barriers is a critical step towards realizing market opportunities available for AD technologies. refs., tabs., figs

  5. Second generation anthropomorphic physical phantom for mammography and DBT: Incorporating voxelized 3D printing and inkjet printing of iodinated lesion inserts

    Science.gov (United States)

    Sikaria, Dhiraj; Musinsky, Stephanie; Sturgeon, Gregory M.; Solomon, Justin; Diao, Andrew; Gehm, Michael E.; Samei, Ehsan; Glick, Stephen J.; Lo, Joseph Y.

    2016-03-01

    Physical phantoms are needed for the evaluation and optimization of new digital breast tomosynthesis (DBT) systems. Previously, we developed an anthropomorphic phantom based on human subject breast CT data and fabricated using commercial 3D printing. We now present three key advancements: voxelized 3D printing, photopolymer material doping, and 2D inkjet printing of lesion inserts. First, we bypassed the printer's control software in order to print in voxelized form instead of conventional STL surfaces, thus improving resolution and allowing dithering to mix the two photopolymer materials into arbitrary proportions. We demonstrated ability to print details as small as 150μm, and dithering to combine VeroWhitePlus and TangoPlus in 10% increments. Second, to address the limited attenuation difference among commercial photopolymers, we evaluated a beta sample from Stratasys with increased TiO2 doping concentration up to 2.5%, which corresponded to 98% breast density. By spanning 36% to 98% breast density, this doubles our previous contrast. Third, using inkjet printers modified to print with iopamidol, we created 2D lesion patterns on paper that can be sandwiched into the phantom. Inkjet printing has advantages of being inexpensive and easy, and more contrast can be delivered through overprinting. Printing resolution was maintained at 210 μm horizontally and 330 μm vertically even after 10 overprints. Contrast increased linearly with overprinting at 0.7% per overprint. Together, these three new features provide the basis for creating a new anthropomorphic physical breast phantom with improved resolution and contrast, as well as the ability to insert 2D lesions for task-based assessment of performance.

  6. InGaAs/InP Monolithic Interconnected Modules (MIM) for Thermophotovoltaic Applications

    Science.gov (United States)

    Wilt, David M.; Fatemi, Navid S.; Jenkins, Phillip P.; Weizer, Victor G.; Hoffman, Richard W., Jr.; Scheiman, David A.; Murray, Christopher S.; Riley, David R.

    2004-01-01

    There has been a traditional trade-off in thermophotovoltaic (TPV) energy conversion development between systems efficiency and power density. This trade-off originates from the use of front surface spectral controls such as selective emitters and various types of filters. A monolithic interconnected module (MIM) structure has been developed which allows for both high power densities and high system efficiencies. The MIM device consists of many individual indium gallium arsenide (InGaAs) devices series -connected on a single semi-insulating indium phosphide (InP) substrate. The MIMs are exposed to the entire emitter output, thereby maximizing output power density. An infrared (IR) reflector placed on the rear surface of the substrate returns the unused portion of the emitter output spectrum back to the emitter for recycling, thereby providing for high system efficiencies. Initial MIM development has focused on a 1 sq cm device consisting of eight series interconnected cells. MIM devices, produced from 0,74 eV InGAAs, have demonstrated V(sub infinity) = 3.23 volts, J(sub sc) = 70 mA/sq cm and a fill factor of 66% under flashlamp testing. Infrared (IR) reflectance measurement (less than 2 microns) of these devices indicate a reflectivity of less than 82%. MIM devices produced from 0.55 eV InGaAs have also been den=monstrated. In addition, conventional p/n InGaAs devices with record efficiencies (11.7% AM1) have been demonstrated.

  7. 3D Printing Electrically Small Spherical Antennas

    DEFF Research Database (Denmark)

    Kim, Oleksiy S.

    2013-01-01

    3D printing is applied for rapid prototyping of an electrically small spherical wire antenna. The model is first printed in plastic and subsequently covered with several layers of conductive paint. Measured results are in good agreement with simulations.......3D printing is applied for rapid prototyping of an electrically small spherical wire antenna. The model is first printed in plastic and subsequently covered with several layers of conductive paint. Measured results are in good agreement with simulations....

  8. Strategies in the digital printing value system

    OpenAIRE

    Mejtoft, Thomas

    2006-01-01

    The research objective of this thesis is to identify corporate strategies and strategic decisions in the digital printing business and to analyze how these have evolved due to the introduction of digital printing. This thesis comprises three separate studies, all based on qualitative case methodology. The first study is focused on digital printing houses and how their business strategies have changed due to their investment in digital printing production equipment. The second study concentrat...

  9. Experiments on Printed Intelligence and Its Applications

    OpenAIRE

    Barbonelova, Angelina

    2015-01-01

    Printed intelligence technology refers to products and systems that are produced using traditional printing methods and that are able to communicate or react with the user, environment or other products and systems. The technology provides the foundations of innovative products such as printed OLEDs (organic light emitting device), electroluminescent displays, organic photovoltaics, thin film batteries and disposable sensors. This study presents research on different printing techniques i...

  10. Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology

    Directory of Open Access Journals (Sweden)

    Yong-Jun Li

    2012-03-01

    Full Text Available We proposed intercalation of hexagonal boron nitride (hBN in multilayer graphene to improve its performance in ultra-scaled interconnects for integrated circuit. The effect of intercalated hBN layer in bilayer graphene is investigated using non-equilibrium Green's functions. We find the hBN intercalated bilayer graphene exhibit enhanced transport properties compared with pristine bilayer ones, and the improvement is attributed to suppression of interlayer scattering and good planar bonding condition of inbetween hBN layer. Based on these results, we proposed a via structure that not only benefits from suppressed interlayer scattering between multilayer graphene, but also sustains the unique electrical properties of graphene when many graphene layers are stacking together. The ideal current density across the structure can be as high as 4.6×109 A/cm2 at 1V, which is very promising for the future high-performance interconnect.

  11. Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology

    Science.gov (United States)

    Li, Yong-Jun; Sun, Qing-Qing; Chen, Lin; Zhou, Peng; Wang, Peng-Fei; Ding, Shi-Jin; Zhang, David Wei

    2012-03-01

    We proposed intercalation of hexagonal boron nitride (hBN) in multilayer graphene to improve its performance in ultra-scaled interconnects for integrated circuit. The effect of intercalated hBN layer in bilayer graphene is investigated using non-equilibrium Green's functions. We find the hBN intercalated bilayer graphene exhibit enhanced transport properties compared with pristine bilayer ones, and the improvement is attributed to suppression of interlayer scattering and good planar bonding condition of inbetween hBN layer. Based on these results, we proposed a via structure that not only benefits from suppressed interlayer scattering between multilayer graphene, but also sustains the unique electrical properties of graphene when many graphene layers are stacking together. The ideal current density across the structure can be as high as 4.6×109 A/cm2 at 1V, which is very promising for the future high-performance interconnect.

  12. Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect

    Science.gov (United States)

    Barabash, R. I.; Ice, G. E.; Tamura, N.; Valek, B. C.; Bravman, J. C.; Spolenak, R.; Patel, J. R.

    2003-05-01

    Electromigration during accelerated testing can induce plastic deformation in apparently undamaged Al interconnect lines as recently revealed by white beam scanning x-ray microdiffraction. In the present article, we provide a first quantitative analysis of the dislocation structure generated in individual micron-sized Al grains during an in situ electromigration experiment. Laue reflections from individual interconnect grains show pronounced streaking during the early stages of electromigration. We demonstrate that the evolution of the dislocation structure during electromigration is highly inhomogeneous and results in the formation of unpaired randomly distributed dislocations as well as geometrically necessary dislocation boundaries. Approximately half of all unpaired dislocations are grouped within the walls. The misorientation created by each boundary and density of unpaired individual dislocations is determined. The origin of the observed plastic deformation is considered in view of the constraints for dislocation arrangements under the applied electric field during electromigration.

  13. 3D-Printing Electrolytes for Solid-State Batteries.

    Science.gov (United States)

    McOwen, Dennis W; Xu, Shaomao; Gong, Yunhui; Wen, Yang; Godbey, Griffin L; Gritton, Jack E; Hamann, Tanner R; Dai, Jiaqi; Hitz, Gregory T; Hu, Liangbing; Wachsman, Eric D

    2018-05-01

    Solid-state batteries have many enticing advantages in terms of safety and stability, but the solid electrolytes upon which these batteries are based typically lead to high cell resistance. Both components of the resistance (interfacial, due to poor contact with electrolytes, and bulk, due to a thick electrolyte) are a result of the rudimentary manufacturing capabilities that exist for solid-state electrolytes. In general, solid electrolytes are studied as flat pellets with planar interfaces, which minimizes interfacial contact area. Here, multiple ink formulations are developed that enable 3D printing of unique solid electrolyte microstructures with varying properties. These inks are used to 3D-print a variety of patterns, which are then sintered to reveal thin, nonplanar, intricate architectures composed only of Li 7 La 3 Zr 2 O 12 solid electrolyte. Using these 3D-printing ink formulations to further study and optimize electrolyte structure could lead to solid-state batteries with dramatically lower full cell resistance and higher energy and power density. In addition, the reported ink compositions could be used as a model recipe for other solid electrolyte or ceramic inks, perhaps enabling 3D printing in related fields. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  14. Biodegradable 3D printed polymer microneedles for transdermal drug delivery.

    Science.gov (United States)

    Luzuriaga, Michael A; Berry, Danielle R; Reagan, John C; Smaldone, Ronald A; Gassensmith, Jeremiah J

    2018-04-17

    Biodegradable polymer microneedle (MN) arrays are an emerging class of transdermal drug delivery devices that promise a painless and sanitary alternative to syringes; however, prototyping bespoke needle architectures is expensive and requires production of new master templates. Here, we present a new microfabrication technique for MNs using fused deposition modeling (FDM) 3D printing using polylactic acid, an FDA approved, renewable, biodegradable, thermoplastic material. We show how this natural degradability can be exploited to overcome a key challenge of FDM 3D printing, in particular the low resolution of these printers. We improved the feature size of the printed parts significantly by developing a post fabrication chemical etching protocol, which allowed us to access tip sizes as small as 1 μm. With 3D modeling software, various MN shapes were designed and printed rapidly with custom needle density, length, and shape. Scanning electron microscopy confirmed that our method resulted in needle tip sizes in the range of 1-55 μm, which could successfully penetrate and break off into porcine skin. We have also shown that these MNs have comparable mechanical strengths to currently fabricated MNs and we further demonstrated how the swellability of PLA can be exploited to load small molecule drugs and how its degradability in skin can release those small molecules over time.

  15. Simulations for printing contacts with near field x-rays

    International Nuclear Information System (INIS)

    Bourdillon, Antony J; Boothroyd, Chris B

    2005-01-01

    In ultra high resolution lithography, sometimes called near field x-ray lithography, Fresnel diffraction is deliberately used to increase resolution: the contraction in current occurring beyond a clear mask feature has, further, important experimentally beneficial effects that were previously overlooked. All the key features of the technique have, by now, been demonstrated and previously reported. The technique is also an enhancement of the most-developed next generation lithography. The enhancement has fundamental advantages, including an increase in mask-wafer Gap (the Gap scales as the square of the width of a clear mask feature); reduced exposure times; more easily fabricated masks; high density prints by multiple exposures; high contrast; elimination of sidebands; reduction in the effects of mask defects, compact masks, etc. We have, previously reported experimental and simulated prints from lines and more complex flag and bridge structures; here we report simulations for symmetrical contacts. More particularly, in the printing of circular features, it is shown that a demagnification factor around 7 can be routinely used to optimize mask-wafer Gap. Although the Gap is significantly extended by using larger clear mask features, finer prints can still be developed

  16. Printing Values In Interactive ROOT

    CERN Document Server

    Perovic, Boris

    2015-01-01

    This project report summarizes the work I have been performing during the past twelve weeks as a Summer Student intern working on ROOT project in the SFT group, PH department, under the supervision of Axel Naumann and Danilo Piparo. One of the widely requested features for ROOT was improved interactive shell experience as well as improved printing of object values. Solving this issue was the goal of this project. Primarily, we have enabled printing of the collections. Secondly, we have unified the printing interface, making it much more robust and extendible. Thirdly, we have implemented printing of nested collections in a flexible and user-friendly manner. Finally, we have added an interactive mode, allowing for paginated output. At the beginning of the report, ROOT is presented with examples of where it is used and how important it is. Then, the motivation behind the project is elaborated, by presenting the previous state of the software package and its potential for improvement. Further, the process in wh...

  17. All-printed paper memory

    KAUST Repository

    Lien, Derhsien

    2014-08-26

    We report the memory device on paper by means of an all-printing approach. Using a sequence of inkjet and screen-printing techniques, a simple metal-insulator-metal device structure is fabricated on paper as a resistive random access memory with a potential to reach gigabyte capacities on an A4 paper. The printed-paper-based memory devices (PPMDs) exhibit reproducible switching endurance, reliable retention, tunable memory window, and the capability to operate under extreme bending conditions. In addition, the PBMD can be labeled on electronics or living objects for multifunctional, wearable, on-skin, and biocompatible applications. The disposability and the high-security data storage of the paper-based memory are also demonstrated to show the ease of data handling, which are not achievable for regular silicon-based electronic devices. We envision that the PPMDs manufactured by this cost-effective and time-efficient all-printing approach would be a key electronic component to fully activate a paper-based circuit and can be directly implemented in medical biosensors, multifunctional devices, and self-powered systems. © 2014 American Chemical Society.

  18. Catalytic microcontact printing without ink

    NARCIS (Netherlands)

    Li, X.; Péter, M.; Huskens, Jurriaan; Reinhoudt, David

    2003-01-01

    A novel microcontact printing technique is described that does not require ink. Patterns were created by direct contact of oxidized PDMS stamps with silyl ether-derivatized, acid-labile SAMs on gold. The surface of the stamps was oxidized by oxygen plasma to give a layer of silicon oxide. These

  19. Microcontact printing: limitations and achievements

    NARCIS (Netherlands)

    Perl, A.; Reinhoudt, David; Huskens, Jurriaan

    2009-01-01

    Microcontact printing (µCP) offers a simple and low-cost surface patterning methodology with high versatility and sub-micrometer accuracy. The process has undergone a spectacular evolution since its invention, improving its capability to form sub-100 nm SAM patterns of various polar and apolar

  20. All-printed paper memory

    KAUST Repository

    He, Jr-Hau; Lin, Chun-Ho; Lien, Der-Hsien

    2016-01-01

    All-printed paper-based substrate memory devices are described. In an embodiment, a paper-based memory device is prepared by coating one or more areas of a paper substrate with a conductor material such as a carbon paste, to form a first electrode

  1. Tender for printing annual report

    Indian Academy of Sciences (India)

    Technology, Govt. of India, needs book “Annual Report” to be printed as per below mentioned specification .Eligible vendors (as ... any one of the documents asked is not enclosed, the quotation will not be considered. ... The EMD of selected bidder(s) will be kept as security deposit till ... contract by telephonically or E-Mail.

  2. Latin American Folk Art Prints

    Science.gov (United States)

    Navah, Jan

    2011-01-01

    Latin American customs and colors play an important role as second graders are introduced to multicultural experiences through food, music, dance, art, and craft. In this article, the author describes a printing project inspired by Guatemalan weavings and amate bark paintings. (Contains 2 online resources.)

  3. Printing in Ubiquitous Computing Environments

    NARCIS (Netherlands)

    Karapantelakis, Athanasios; Delvic, Alisa; Zarifi Eslami, Mohammed; Khamit, Saltanat

    Document printing has long been considered an indispensable part of the workspace. While this process is considered trivial and simple for environments where resources are ample (e.g. desktop computers connected to printers within a corporate network), it becomes complicated when applied in a mobile

  4. FDTD based transition time dependent crosstalk analysis for coupled RLC interconnects

    International Nuclear Information System (INIS)

    Sharma, Devendra Kumar; Kaushik, Brajesh Kumar; Sharma, R. K.

    2014-01-01

    The performance of high density chips operating in the GHz range is mostly affected by on-chip interconnects. The interconnect delay depends on many factors, a few of them are inputs toggling patterns, line and coupling parasitics, input rise/fall time and source/load characteristics. The transition time of the input is of prime importance in high speed circuits. This paper addresses the FDTD based analysis of transition time effects on functional and dynamic crosstalk. The analysis is carried out for equal and unequal transition times of coupled inputs. The analysis of the effects of unequal rise time is equally important because practically, it is quite common to have mismatching in the rise time of the signals transmitting through different length wires. To demonstrate the effects, two distributed RLC lines coupled inductively and capacitively are taken into consideration. The FDTD technique is used because it gives accurate results and carries time domain analysis of coupled lines. The number of lumps in SPICE simulations is considered the same as those of spatial segments. To validate the FDTD computed results, SPICE simulations are run and results are compared. A good agreement of the computed results has been observed with respect to SPICE simulated results. An average error of less than 3.2% is observed in the computation of the performance parameters using the proposed method. (semiconductor integrated circuits)

  5. Roll-offset printed transparent conducting electrode for organic solar cells

    International Nuclear Information System (INIS)

    Kim, Inyoung; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

    2015-01-01

    Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J sc ), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J sc . - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic solar

  6. Roll-offset printed transparent conducting electrode for organic solar cells

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Inyoung, E-mail: ikim@kimm.re.kr; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

    2015-04-01

    Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J{sub sc}), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J{sub sc}. - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic

  7. 3D printing PLGA: a quantitative examination of the effects of polymer composition and printing parameters on print resolution

    Science.gov (United States)

    Guo, Ting; Holzberg, Timothy R; Lim, Casey G; Gao, Feng; Gargava, Ankit; Trachtenberg, Jordan E; Mikos, Antonios G; Fisher, John P

    2018-01-01

    In the past few decades, 3D printing has played a significant role in fabricating scaffolds with consistent, complex structure that meet patient-specific needs in future clinical applications. Although many studies have contributed to this emerging field of additive manufacturing, which includes material development and computer-aided scaffold design, current quantitative analyses do not correlate material properties, printing parameters, and printing outcomes to a great extent. A model that correlates these properties has tremendous potential to standardize 3D printing for tissue engineering and biomaterial science. In this study, we printed poly(lactic-co-glycolic acid) (PLGA) utilizing a direct melt extrusion technique without additional ingredients. We investigated PLGA with various lactic acid: glycolic acid (LA:GA) molecular weight ratios and end caps to demonstrate the dependence of the extrusion process on the polymer composition. Micro-computed tomography was then used to evaluate printed scaffolds containing different LA:GA ratios, composed of different fiber patterns, and processed under different printing conditions. We built a statistical model to reveal the correlation and predominant factors that determine printing precision. Our model showed a strong linear relationship between the actual and predicted precision under different combinations of printing conditions and material compositions. This quantitative examination establishes a significant foreground to 3D print biomaterials following a systematic fabrication procedure. Additionally, our proposed statistical models can be applied to couple specific biomaterials and 3D printing applications for patient implants with particular requirements. PMID:28244880

  8. 3D printing PLGA: a quantitative examination of the effects of polymer composition and printing parameters on print resolution.

    Science.gov (United States)

    Guo, Ting; Holzberg, Timothy R; Lim, Casey G; Gao, Feng; Gargava, Ankit; Trachtenberg, Jordan E; Mikos, Antonios G; Fisher, John P

    2017-04-12

    In the past few decades, 3D printing has played a significant role in fabricating scaffolds with consistent, complex structure that meet patient-specific needs in future clinical applications. Although many studies have contributed to this emerging field of additive manufacturing, which includes material development and computer-aided scaffold design, current quantitative analyses do not correlate material properties, printing parameters, and printing outcomes to a great extent. A model that correlates these properties has tremendous potential to standardize 3D printing for tissue engineering and biomaterial science. In this study, we printed poly(lactic-co-glycolic acid) (PLGA) utilizing a direct melt extrusion technique without additional ingredients. We investigated PLGA with various lactic acid:glycolic acid (LA:GA) molecular weight ratios and end caps to demonstrate the dependence of the extrusion process on the polymer composition. Micro-computed tomography was then used to evaluate printed scaffolds containing different LA:GA ratios, composed of different fiber patterns, and processed under different printing conditions. We built a statistical model to reveal the correlation and predominant factors that determine printing precision. Our model showed a strong linear relationship between the actual and predicted precision under different combinations of printing conditions and material compositions. This quantitative examination establishes a significant foreground to 3D print biomaterials following a systematic fabrication procedure. Additionally, our proposed statistical models can be applied to couple specific biomaterials and 3D printing applications for patient implants with particular requirements.

  9. Extrusion-based 3D printing of poly(propylene fumarate) scaffolds with hydroxyapatite gradients

    Science.gov (United States)

    Trachtenberg, Jordan E.; Placone, Jesse K.; Smith, Brandon T.; Fisher, John P.; Mikos, Antonios G.

    2017-01-01

    The primary focus of this work is to present the current challenges of printing scaffolds with concentration gradients of nanoparticles with an aim to improve the processing of these scaffolds. Furthermore, we address how print fidelity is related to material composition and emphasize the importance of considering this relationship when developing complex scaffolds for bone implants. The ability to create complex tissues is becoming increasingly relevant in the tissue engineering community. For bone tissue engineering applications, this work demonstrates the ability to use extrusion-based printing techniques to control the spatial deposition of hydroxyapatite (HA) nanoparticles in a 3D composite scaffold. In doing so, we combined the benefits of synthetic, degradable polymers, such as poly(propylene fumarate) (PPF), with osteoconductive HA nanoparticles that provide robust compressive mechanical properties. Furthermore, the final 3D printed scaffolds consisted of well-defined layers with interconnected pores, two critical features for a successful bone implant. To demonstrate a controlled gradient of HA, thermogravimetric analysis was carried out to quantify HA on a per-layer basis. Moreover, we non-destructively evaluated the tendency of HA particles to aggregate within PPF using micro-computed tomography (µCT). This work provides insight for proper fabrication and characterization of composite scaffolds containing particle gradients and has broad applicability for future efforts in fabricating complex scaffolds for tissue engineering applications. PMID:28125380

  10. 3D printing of porous hydroxyapatite scaffolds intended for use in bone tissue engineering applications.

    Science.gov (United States)

    Cox, Sophie C; Thornby, John A; Gibbons, Gregory J; Williams, Mark A; Mallick, Kajal K

    2015-02-01

    A systematic characterisation of bone tissue scaffolds fabricated via 3D printing from hydroxyapatite (HA) and poly(vinyl)alcohol (PVOH) composite powders is presented. Flowability of HA:PVOH precursor materials was observed to affect mechanical stability, microstructure and porosity of 3D printed scaffolds. Anisotropic behaviour of constructs and part failure at the boundaries of interlayer bonds was highlighted by compressive strength testing. A trade-off between the ability to facilitate removal of PVOH thermal degradation products during sintering and the compressive strength of green parts was revealed. The ultimate compressive strength of 55% porous green scaffolds printed along the Y-axis and dried in a vacuum oven for 6h was 0.88 ± 0.02 MPa. Critically, the pores of 3D printed constructs could be user designed, ensuring bulk interconnectivity, and the imperfect packing of powder particles created an inherent surface roughness and non-designed porosity within the scaffold. These features are considered promising since they are known to facilitate osteoconduction and osteointegration in-vivo. Characterisation techniques utilised in this study include two funnel flow tests, scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), compressive strength testing and computed tomography (CT). Copyright © 2014 Elsevier B.V. All rights reserved.

  11. 3D printing of porous hydroxyapatite scaffolds intended for use in bone tissue engineering applications

    Energy Technology Data Exchange (ETDEWEB)

    Cox, Sophie C.; Thornby, John A.; Gibbons, Gregory J., E-mail: G.J.Gibbons@warwick.ac.uk; Williams, Mark A.; Mallick, Kajal K.

    2015-02-01

    A systematic characterisation of bone tissue scaffolds fabricated via 3D printing from hydroxyapatite (HA) and poly(vinyl)alcohol (PVOH) composite powders is presented. Flowability of HA:PVOH precursor materials was observed to affect mechanical stability, microstructure and porosity of 3D printed scaffolds. Anisotropic behaviour of constructs and part failure at the boundaries of interlayer bonds was highlighted by compressive strength testing. A trade-off between the ability to facilitate removal of PVOH thermal degradation products during sintering and the compressive strength of green parts was revealed. The ultimate compressive strength of 55% porous green scaffolds printed along the Y-axis and dried in a vacuum oven for 6 h was 0.88 ± 0.02 MPa. Critically, the pores of 3D printed constructs could be user designed, ensuring bulk interconnectivity, and the imperfect packing of powder particles created an inherent surface roughness and non-designed porosity within the scaffold. These features are considered promising since they are known to facilitate osteoconduction and osteointegration in-vivo. Characterisation techniques utilised in this study include two funnel flow tests, scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), compressive strength testing and computed tomography (CT). - Highlights: • Flowability of HA and PVOH powders corresponded to scaffold printability. • Anisotropic behaviour of 3D printed scaffolds was highlighted by compressive tests. • Maximum compressive strength of 3D printed 55% porous scaffolds was 0.88 MPa. • Imperfect packing of precursors resulted in a rough surface and microporosity. • A CT method was designed and used to quantify designed and non-designed porosity.

  12. 3D printing of porous hydroxyapatite scaffolds intended for use in bone tissue engineering applications

    International Nuclear Information System (INIS)

    Cox, Sophie C.; Thornby, John A.; Gibbons, Gregory J.; Williams, Mark A.; Mallick, Kajal K.

    2015-01-01

    A systematic characterisation of bone tissue scaffolds fabricated via 3D printing from hydroxyapatite (HA) and poly(vinyl)alcohol (PVOH) composite powders is presented. Flowability of HA:PVOH precursor materials was observed to affect mechanical stability, microstructure and porosity of 3D printed scaffolds. Anisotropic behaviour of constructs and part failure at the boundaries of interlayer bonds was highlighted by compressive strength testing. A trade-off between the ability to facilitate removal of PVOH thermal degradation products during sintering and the compressive strength of green parts was revealed. The ultimate compressive strength of 55% porous green scaffolds printed along the Y-axis and dried in a vacuum oven for 6 h was 0.88 ± 0.02 MPa. Critically, the pores of 3D printed constructs could be user designed, ensuring bulk interconnectivity, and the imperfect packing of powder particles created an inherent surface roughness and non-designed porosity within the scaffold. These features are considered promising since they are known to facilitate osteoconduction and osteointegration in-vivo. Characterisation techniques utilised in this study include two funnel flow tests, scanning electron microscopy (SEM), Fourier transform infrared spectroscopy (FTIR), compressive strength testing and computed tomography (CT). - Highlights: • Flowability of HA and PVOH powders corresponded to scaffold printability. • Anisotropic behaviour of 3D printed scaffolds was highlighted by compressive tests. • Maximum compressive strength of 3D printed 55% porous scaffolds was 0.88 MPa. • Imperfect packing of precursors resulted in a rough surface and microporosity. • A CT method was designed and used to quantify designed and non-designed porosity

  13. Three-dimensional printing of porous ceramic scaffolds for bone tissue engineering.

    Science.gov (United States)

    Seitz, Hermann; Rieder, Wolfgang; Irsen, Stephan; Leukers, Barbara; Tille, Carsten

    2005-08-01

    This article reports a new process chain for custom-made three-dimensional (3D) porous ceramic scaffolds for bone replacement with fully interconnected channel network for the repair of osseous defects from trauma or disease. Rapid prototyping and especially 3D printing is well suited to generate complex-shaped porous ceramic matrices directly from powder materials. Anatomical information obtained from a patient can be used to design the implant for a target defect. In the 3D printing technique, a box filled with ceramic powder is printed with a polymer-based binder solution layer by layer. Powder is bonded in wetted regions. Unglued powder can be removed and a ceramic green body remains. We use a modified hydroxyapatite (HA) powder for the fabrication of 3D printed scaffolds due to the safety of HA as biocompatible implantable material and efficacy for bone regeneration. The printed ceramic green bodies are consolidated at a temperature of 1250 degrees C in a high temperature furnace in ambient air. The polymeric binder is pyrolysed during sintering. The resulting scaffolds can be used in tissue engineering of bone implants using patient-derived cells that are seeded onto the scaffolds. This article describes the process chain, beginning from data preparation to 3D printing tests and finally sintering of the scaffold. Prototypes were successfully manufactured and characterized. It was demonstrated that it is possible to manufacture parts with inner channels with a dimension down to 450 microm and wall structures with a thickness down to 330 microm. The mechanical strength of dense test parts is up to 22 MPa. Copyright 2005 Wiley Periodicals, Inc.

  14. Vertically aligned multiwalled carbon nanotubes as electronic interconnects

    Science.gov (United States)

    Gopee, Vimal Chandra

    The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace copper. Carbon nanotubes have been studied as a suitable replacement for copper due to its superior electrical, thermal and mechanical properties. One of the advantages of using carbon nanotubes is their high current carrying capacity which has been demonstrated to be three orders of magnitude greater than that of copper. Most approaches in the implementation of carbon nanotubes have so far focused on the growth in vias which limits their application. In this work, a process is described for the transfer of carbon nanotubes to substrates allowing their use for more varied applications. Arrays of vertically aligned multiwalled carbon nanotubes were synthesised by photo-thermal chemical vapour deposition with high growth rates. Raman spectroscopy was used to show that the synthesised carbon nanotubes were of high quality. The carbon nanotubes were exposed to an oxygen plasma and the nature of the functional groups present was determined using X-ray photoelectron spectroscopy. Functional groups, such as carboxyl, carbonyl and hydroxyl groups, were found to be present on the surface of the multiwalled carbon nanotubes after the functionalisation process. The multiwalled carbon nanotubes were metallised after the functionalisation process using magnetron sputtering. Two materials, solder and sintered silver, were chosen to bind carbon nanotubes to substrates so as to enable their transfer and also to make electrical contact. The wettability of solder to carbon nanotubes was investigated and it was demonstrated that both functionalisation and metallisation were required in order for solder to bond with the carbon nanotubes. Similarly, functionalisation followed by metallisation

  15. Sex Determination from Fingerprint Ridge Density | Gungadin ...

    African Journals Online (AJOL)

    This study was conducted with an aim to establish a relationship between sex and fingerprint ridge density. The fingerprints were taken from 500 subjects (250 males and 250 females) in the age group of 18-60 years. After taking fingerprints, the ridges were counted in the upper portion of the radial border of each print for all ...

  16. Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Kao, Li-Chi; Hsu, Li-Hsuan; Brahma, Sanjaya; Huang, Bo-Chia; Liu, Chun-Chu; Lo, Kuang-Yao, E-mail: kuanglo@mail.ncku.edu.tw

    2016-12-01

    Highlights: • Actual Cu interconnect experiences many times of annealing and then cause the stress. • Stack Cu grains with varying grain size successively to enhance packed density. • XRD and PBR analyze the residual stress of local and average area of plated Cu film. • High packed Cu grain with stable stress proved by texture of Cu(1 1 1) and Cu(2 0 0). - Abstract: In this work, we programmed the plating current to stack the different size of copper (Cu) grain and analyzed the relation between the sequence of different Cu grain size and the stability of the residual stress. The residual stress was measured with varying times of annealing process in order to reach the purpose of simulating the actual Cu interconnect process. We found that varied plating strategy will make different stabilization condition of residual stress through the proof of X-ray diffraction (XRD) and optical parallel beams reflection (PBR) method. The accumulation of Cu grains, formed by Cu grain with successive variation in grain size, would enhance the packing density better than only single grain size in the finite space. The high density of the grain boundary in the electroplated Cu film will be eliminated through annealing process and it will help to suppress the void formation in further interconnect process. The electroplated Cu film with the plating current of saw tooth wave can soon reach a stable tensile stress through annealing since the Cu grains with high packing density will be quickly eliminated to approach the minimum of the strain energy which reflects to variation in the texture of Cu (2 0 0). The result of this work illustrates the importance of how to stack different size of Cu grain, for achieving a densely packed Cu film which close to the Cu bulk.

  17. 75 FR 6020 - Electrical Interconnection of the Lower Snake River Wind Energy Project

    Science.gov (United States)

    2010-02-05

    ... DEPARTMENT OF ENERGY Bonneville Power Administration Electrical Interconnection of the Lower Snake River Wind Energy Project AGENCY: Bonneville Power Administration (BPA), Department of Energy (DOE... (BPA) has decided to offer Puget Sound Energy Inc., a Large Generator Interconnection Agreement for...

  18. Cost-estimating for commercial digital printing

    Science.gov (United States)

    Keif, Malcolm G.

    2007-01-01

    The purpose of this study is to document current cost-estimating practices used in commercial digital printing. A research study was conducted to determine the use of cost-estimating in commercial digital printing companies. This study answers the questions: 1) What methods are currently being used to estimate digital printing? 2) What is the relationship between estimating and pricing digital printing? 3) To what extent, if at all, do digital printers use full-absorption, all-inclusive hourly rates for estimating? Three different digital printing models were identified: 1) Traditional print providers, who supplement their offset presswork with digital printing for short-run color and versioned commercial print; 2) "Low-touch" print providers, who leverage the power of the Internet to streamline business transactions with digital storefronts; 3) Marketing solutions providers, who see printing less as a discrete manufacturing process and more as a component of a complete marketing campaign. Each model approaches estimating differently. Understanding and predicting costs can be extremely beneficial. Establishing a reliable system to estimate those costs can be somewhat challenging though. Unquestionably, cost-estimating digital printing will increase in relevance in the years ahead, as margins tighten and cost knowledge becomes increasingly more critical.

  19. Selecting suitable enclosures for digitally printed materials

    International Nuclear Information System (INIS)

    Burge, D; Rima, L

    2010-01-01

    It cannot be assumed that storage enclosures considered safe for traditionally printed images and documents are suitable for modern, digitally printed materials. In this project, a large variety of digital print types were tested using a modified version of the ISO 18916 Imaging materials-Processed imaging materials-Photographic activity test for enclosure materials standard to assess the risk to digital prints by paper enclosures known to be inert or reactive with traditional photographic prints. The types of enclosures tested included buffered and non-buffered cotton papers, and groundwood paper. In addition, qualitative filter paper that had been wetted and dried with either an acidic or basic solution was also tested to determine the effects of enclosure pH on digitally printed materials. It was determined that, in general, digital prints tended to be less reactive with various enclosure types than traditional prints. Digital prints were most sensitive to paper that contained groundwood. The enclosure reactivity test results were then integrated with previous published work on the tendencies of various enclosure types to abrade, ferrotype, or block to digital prints in order to create a comprehensive set of recommendations for digital print storage enclosures.

  20. Conductive polymer/metal composites for interconnect of flexible devices

    Science.gov (United States)

    Kawakita, Jin; Hashimoto Shinoda, Yasuo; Shuto, Takanori; Chikyow, Toyohiro

    2015-06-01

    An interconnect of flexible and foldable devices based on advanced electronics requires high electrical conductivity, flexibility, adhesiveness on a plastic substrate, and efficient productivity. In this study, we investigated the applicability of a conductive polymer/metal composite to the interconnect of flexible devices. By combining an inkjet process and a photochemical reaction, micropatterns of a polypyrrole/silver composite were formed on flexible plastic substrates with an average linewidth of approximately 70 µm within 10 min. The conductivity of the composite was improved to 6.0 × 102 Ω-1·cm-1. From these results, it is expected that the conducting polymer/metal composite can be applied to the microwiring of flexible electronic devices.

  1. Security analysis of interconnected AC/DC systems

    DEFF Research Database (Denmark)

    Eriksson, Robert

    2015-01-01

    This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid...... any line or transformer limits. Simulations were performed in a model of the Nordic power system where a dc grid is placed on top. The simulation supports the method as a tool to consider transfer limits in the grid to avoid violate the same and increase the security after a converter outage........ The redistribution of power has a sudden effect on the power-flow in the interconnected ac system. This may cause overloading of lines and transformers resulting in disconnection of equipment, and as a consequence cascading failure. The PTDF is used as a method to analyze and avoid violating limits by in the dc...

  2. Methodology for assessing the impacts of distributed generation interconnection

    Directory of Open Access Journals (Sweden)

    Luis E. Luna

    2011-06-01

    Full Text Available This paper proposes a methodology for identifying and assessing the impact of distributed generation interconnection on distribution systems using Monte Carlo techniques. This methodology consists of two analysis schemes: a technical analysis, which evaluates the reliability conditions of the distribution system; on the other hand, an economic analysis that evaluates the financial impacts on the electric utility and its customers, according to the system reliability level. The proposed methodology was applied to an IEEE test distribution system, considering different operation schemes for the distributed generation interconnection. The application of each one of these schemes provided significant improvements regarding the reliability and important economic benefits for the electric utility. However, such schemes resulted in negative profitability levels for certain customers, therefore, regulatory measures and bilateral contracts were proposed which would provide a solution for this kind of problem.

  3. TEM sample preparation by FIB for carbon nanotube interconnects

    International Nuclear Information System (INIS)

    Ke, Xiaoxing; Bals, Sara; Romo Negreira, Ainhoa; Hantschel, Thomas; Bender, Hugo; Van Tendeloo, Gustaaf

    2009-01-01

    A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5 kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects.

  4. TEM sample preparation by FIB for carbon nanotube interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Ke, Xiaoxing, E-mail: xiaoxing.ke@ua.ac.be [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); Bals, Sara [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium); Romo Negreira, Ainhoa [IMEC, Kapeldreef 75, B-3001 Leuven (Belgium); Metallurgy and Materials Engineering Department, KU Leuven, Kasteelpark Arenberg 44, Leuven B-3001 (Belgium); Hantschel, Thomas; Bender, Hugo [IMEC, Kapeldreef 75, B-3001 Leuven (Belgium); Van Tendeloo, Gustaaf [EMAT, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium)

    2009-10-15

    A powerful method to study carbon nanotubes (CNTs) grown in patterned substrates for potential interconnects applications is transmission electron microscopy (TEM). However, high-quality TEM samples are necessary for such a study. Here, TEM specimen preparation by focused ion beam (FIB) has been used to obtain lamellae of patterned samples containing CNTs grown inside contact holes. A dual-cap Pt protection layer and an extensive 5 kV cleaning procedure are applied in order to preserve the CNTs and avoid deterioration during milling. TEM results show that the inner shell structure of the carbon nanotubes has been preserved, which proves that focused ion beam is a useful technique to prepare TEM samples of CNT interconnects.

  5. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    DEFF Research Database (Denmark)

    Wang, Feng; Li, Lijuan; Li, Canbing

    2018-01-01

    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distri......The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG....... The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by using the KS test and the maximum likelihood estimation (MLE). The blackouts data in China were used...

  6. Optimal interconnection trees in the plane theory, algorithms and applications

    CERN Document Server

    Brazil, Marcus

    2015-01-01

    This book explores fundamental aspects of geometric network optimisation with applications to a variety of real world problems. It presents, for the first time in the literature, a cohesive mathematical framework within which the properties of such optimal interconnection networks can be understood across a wide range of metrics and cost functions. The book makes use of this mathematical theory to develop efficient algorithms for constructing such networks, with an emphasis on exact solutions.  Marcus Brazil and Martin Zachariasen focus principally on the geometric structure of optimal interconnection networks, also known as Steiner trees, in the plane. They show readers how an understanding of this structure can lead to practical exact algorithms for constructing such trees.  The book also details numerous breakthroughs in this area over the past 20 years, features clearly written proofs, and is supported by 135 colour and 15 black and white figures. It will help graduate students, working mathematicians, ...

  7. Reconfigurable optical interconnection network for multimode optical fiber sensor arrays

    Science.gov (United States)

    Chen, R. T.; Robinson, D.; Lu, H.; Wang, M. R.; Jannson, T.; Baumbick, R.

    1992-01-01

    A single-source, single-detector architecture has been developed to implement a reconfigurable optical interconnection network multimode optical fiber sensor arrays. The network was realized by integrating LiNbO3 electrooptic (EO) gratings working at the Raman Na regime and a massive fan-out waveguide hologram (WH) working at the Bragg regime onto a multimode glass waveguide. The glass waveguide utilized the whole substrate as a guiding medium. A 1-to-59 massive waveguide fan-out was demonstrated using a WH operating at 514 nm. Measured diffraction efficiency of 59 percent was experimentally confirmed. Reconfigurability of the interconnection was carried out by generating an EO grating through an externally applied electric field. Unlike conventional single-mode integrated optical devices, the guided mode demonstrated has an azimuthal symmetry in mode profile which is the same as that of a fiber mode.

  8. Interconnection test framework for the CMS level-1 trigger system

    International Nuclear Information System (INIS)

    Hammer, J.; Magrans de Abril, M.; Wulz, C.E.

    2012-01-01

    The Level-1 Trigger Control and Monitoring System is a software package designed to configure, monitor and test the Level-1 Trigger System of the Compact Muon Solenoid (CMS) experiment at CERN's Large Hadron Collider. It is a large and distributed system that runs over 50 PCs and controls about 200 hardware units. The objective of this paper is to describe and evaluate the architecture of a distributed testing framework - the Interconnection Test Framework (ITF). This generic and highly flexible framework for creating and executing hardware tests within the Level-1 Trigger environment is meant to automate testing of the 13 major subsystems interconnected with more than 1000 links. Features include a web interface to create and execute tests, modeling using finite state machines, dependency management, automatic configuration, and loops. Furthermore, the ITF will replace the existing heterogeneous testing procedures and help reducing both maintenance and complexity of operation tasks. (authors)

  9. A reference model for space data system interconnection services

    Science.gov (United States)

    Pietras, John; Theis, Gerhard

    1993-01-01

    The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

  10. PRINTING TECHNIQUES: RECENT DEVELOPMENTS IN PHARMACEUTICAL TECHNOLOGY.

    Science.gov (United States)

    Jamroz, Witold; Kurek, Mateusz; Lyszczarz, Ewelina; Brniak, Witold; Jachowicz, Renata

    2017-05-01

    In the last few years there has been a huge progress in a development of printing techniques and their application in pharmaceutical sciences and particularly in the pharmaceutical technology. The variety of printing methods makes it necessary to systemize them, explain the principles of operation, and specify the possibilities of their use in pharmaceutical technology. This paper aims to review the printing techniques used in a drug development process. The growing interest in 2D and 3D printing methods results in continuously increasing number of scientific papers. Introduction of the first printed drug Spritam@ to the market seems to be a milestone of the 3D printing development. Thus, a particular aim of this review is to show the latest achievements of the researchers in the field of the printing medicines.

  11. Mod silver metallization: Screen printing and ink-jet printing

    Science.gov (United States)

    Vest, R. W.; Vest, G. M.

    1985-01-01

    Basic material efforts have proven to be very successful. Adherent and conductive films were achieved. A silver neodecanoate/bismuth 2-ethylhexanoate mixture has given the best results in both single and double layer applications. Another effort is continuing to examine the feasibility of applying metallo-organic deposition films by use of an ink jet printer. Direct line writing would result in a saving of process time and materials. So far, some well defined lines have been printed.

  12. Building an organic computing device with multiple interconnected brains

    OpenAIRE

    Pais-Vieira, Miguel; Chiuffa, Gabriela; Lebedev, Mikhail; Yadav, Amol; Nicolelis, Miguel A. L.

    2015-01-01

    Recently, we proposed that Brainets, i.e. networks formed by multiple animal brains, cooperating and exchanging information in real time through direct brain-to-brain interfaces, could provide the core of a new type of computing device: an organic computer. Here, we describe the first experimental demonstration of such a Brainet, built by interconnecting four adult rat brains. Brainets worked by concurrently recording the extracellular electrical activity generated by populations of cortical ...

  13. Authentication in Virtual Organizations: A Reputation Based PKI Interconnection Model

    Science.gov (United States)

    Wazan, Ahmad Samer; Laborde, Romain; Barrere, Francois; Benzekri, Abdelmalek

    Authentication mechanism constitutes a central part of the virtual organization work. The PKI technology is used to provide the authentication in each organization involved in the virtual organization. Different trust models are proposed to interconnect the different PKIs in order to propagate the trust between them. While the existing trust models contain many drawbacks, we propose a new trust model based on the reputation of PKIs.

  14. Interconnection France-England; Interconnexion France-Angleterre

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    These documents defines the interconnection France-England rules for the 2000 MW DC submarine cable directly linking the transmission networks of England and Wales and France. Rights to use Interconnector capacity from 1 April 2001 are to be offered through competitive tenders and auctions, full details of which are set out in the Rules. The contract and a guide to the application form are provided. (A.L.B.)

  15. Interconnected microbiomes and resistomes in low-income human habitats

    OpenAIRE

    Pehrsson, Erica C.; Tsukayama, Pablo; Patel, Sanket; Mej?a-Bautista, Melissa; Sosa-Soto, Giordano; Navarrete, Karla M.; Calderon, Maritza; Cabrera, Lilia; Hoyos-Arango, William; Bertoli, M. Teresita; Berg, Douglas E.; Gilman, Robert H.; Dantas, Gautam

    2016-01-01

    Summary Antibiotic-resistant infections annually claim hundreds of thousands of lives worldwide. This problem is exacerbated by resistance gene exchange between pathogens and benign microbes from diverse habitats. Mapping resistance gene dissemination between humans and their environment is a public health priority. We characterized the bacterial community structure and resistance exchange networks of hundreds of interconnected human fecal and environmental samples from two low-income Latin A...

  16. Synthesis of micro-sized interconnected Si-C composites

    Science.gov (United States)

    Wang, Donghai; Yi, Ran; Dai, Fang

    2016-02-23

    Embodiments provide a method of producing micro-sized Si--C composites or doped Si--C and Si alloy-C with interconnected nanoscle Si and C building blocks through converting commercially available SiO.sub.x (0

  17. Smart hospitality—Interconnectivity and interoperability towards an ecosystem

    OpenAIRE

    Buhalis, Dimitrios; Leung, Rosanna

    2018-01-01

    The Internet and cloud computing changed the way business operate. Standardised web-based applications simplify data interchange which allow internal applications and business partners systems to become interconnected and interoperable. This study conceptualises the smart and agile hospitality enterprises of the future, and proposes a smart hospitality ecosystem that adds value to all stakeholders. Internal data from applications among all stakeholders, consolidated with external environment ...

  18. Design and Training of Limited-Interconnect Architectures

    Science.gov (United States)

    1991-07-16

    and signal processing. Neuromorphic (brain like) models, allow an alternative for achieving real-time operation tor such tasks, while having a...compact and robust architecture. Neuromorphic models consist of interconnections of simple computational nodes. In this approach, each node computes a...operational performance. I1. Research Objectives The research objectives were: 1. Development of on- chip local training rules specifically designed for

  19. Overvoltages related to distributed generation-power system interconnection transformer

    Energy Technology Data Exchange (ETDEWEB)

    Zamanillo, G.R.; Gomez, J.C.; Florena, E.F. [Rio Cuarto National University (IPSEP/UNRC), Cordoba (Argentina). Electric Power Systems Protection Institute], Email: jcgomez@ing.unrc.edu.ar

    2009-07-01

    The energy crisis that experiences the world drives to carry to an extreme, the use of all energy sources which are available. The sources need to be connected to the electric network in their next point, requiring of electric-electronic interfaces. The traditional electric power systems are changing their characteristics, in what concerns to structure, operation and on overvoltage generation. This change is not taking place in coordinated form among the involved sectors. The interconnection of a Distributed Generator (DG) directly with the power system is objectionable and risky. It is required of an interconnection transformer which performs several functions. Rigid specifications do not exist in this respect, for the variety of systems in use in the world, nevertheless there are utilities recommendations. Overvoltages caused by the DG, which arise due to the change of structure of the electric system, are explained. The transformer connection selection, presents positive and negative aspects that impact the utility and the user in a different or many times in an antagonistic way. The phenomenon of balanced and unbalanced ferroresonance overvoltage is studied. This phenomenon can takes place when using DG, either with synchronous or asynchronous generator, and for any type of connection of the transformer. The necessary conditions so that the phenomenon appears are presented. Eight interconnection transformer connection ways were studied. It is concluded that the solutions to reach by means of the employment of the DG, offer technical-economic advantages so much to the utility as to the user. It is also concluded in this work that the more advisable interconnection type is function of the system connection type. (author)

  20. Stackable Form-Factor Peripheral Component Interconnect Device and Assembly

    Science.gov (United States)

    Somervill, Kevin M. (Inventor); Ng, Tak-kwong (Inventor); Torres-Pomales, Wilfredo (Inventor); Malekpour, Mahyar R. (Inventor)

    2013-01-01

    A stackable form-factor Peripheral Component Interconnect (PCI) device can be configured as a host controller or a master/target for use on a PCI assembly. PCI device may comprise a multiple-input switch coupled to a PCI bus, a multiplexor coupled to the switch, and a reconfigurable device coupled to one of the switch and multiplexor. The PCI device is configured to support functionality from power-up, and either control function or add-in card function.