WorldWideScience

Sample records for continuous chip material

  1. Combinatorial materials synthesis and high-throughput screening: an integrated materials chip approach to mapping phase diagrams and discovery and optimization of functional materials.

    Science.gov (United States)

    Xiang, X D

    Combinatorial materials synthesis methods and high-throughput evaluation techniques have been developed to accelerate the process of materials discovery and optimization and phase-diagram mapping. Analogous to integrated circuit chips, integrated materials chips containing thousands of discrete different compositions or continuous phase diagrams, often in the form of high-quality epitaxial thin films, can be fabricated and screened for interesting properties. Microspot x-ray method, various optical measurement techniques, and a novel evanescent microwave microscope have been used to characterize the structural, optical, magnetic, and electrical properties of samples on the materials chips. These techniques are routinely used to discover/optimize and map phase diagrams of ferroelectric, dielectric, optical, magnetic, and superconducting materials.

  2. Precision Photothermal Annealing of Nanoporous Gold Thin Films for the Microfabrication of a Single-chip Material Libraries

    Energy Technology Data Exchange (ETDEWEB)

    Harris, C. D. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Shen, N. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Rubenchik, A. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Demos, S. G. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Matthews, M. J. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2015-06-30

    Single-chip material libraries of thin films of nanostructured materials are a promising approach for high throughput studies of structure-property relationship in the fields of physics and biology. Nanoporous gold (np-Au), produced by an alloy corrosion process, is a nanostructured material of specific interest in both these fields. One attractive property of np-Au is its self-similar coarsening behavior by thermally induced surface diffusion. However, traditional heat application techniques for the modification of np-Au are bulk processes that cannot be used to generate a library of different pore sizes on a single chip. Laser micromachining offers an attractive solution to this problem by providing a means to apply energy with high spatial and temporal resolution. In the present study we use finite element multiphysics simulations to predict the effects of laser mode (continuous-wave vs. pulsed) and supporting substrate thermal conductivity on the local np-Au film temperatures during photothermal annealing and subsequently investigate the mechanisms by which the np-Au network is coarsening. Our simulations predict that continuous-wave mode laser irradiation on a silicon supporting substrate supports the widest range of morphologies that can be created through the photothermal annealing of thin film np-Au. Using this result we successfully fabricate a single-chip material library consisting of 81 np-Au samples of 9 different morphologies for use in increased throughput material interaction studies.

  3. Materials for microfluidic chip fabrication.

    Science.gov (United States)

    Ren, Kangning; Zhou, Jianhua; Wu, Hongkai

    2013-11-19

    Through manipulating fluids using microfabricated channel and chamber structures, microfluidics is a powerful tool to realize high sensitive, high speed, high throughput, and low cost analysis. In addition, the method can establish a well-controlled microenivroment for manipulating fluids and particles. It also has rapid growing implementations in both sophisticated chemical/biological analysis and low-cost point-of-care assays. Some unique phenomena emerge at the micrometer scale. For example, reactions are completed in a shorter amount of time as the travel distances of mass and heat are relatively small; the flows are usually laminar; and the capillary effect becomes dominant owing to large surface-to-volume ratios. In the meantime, the surface properties of the device material are greatly amplified, which can lead to either unique functions or problems that we would not encounter at the macroscale. Also, each material inherently corresponds with specific microfabrication strategies and certain native properties of the device. Therefore, the material for making the device plays a dominating role in microfluidic technologies. In this Account, we address the evolution of materials used for fabricating microfluidic chips, and discuss the application-oriented pros and cons of different materials. This Account generally follows the order of the materials introduced to microfluidics. Glass and silicon, the first generation microfluidic device materials, are perfect for capillary electrophoresis and solvent-involved applications but expensive for microfabriaction. Elastomers enable low-cost rapid prototyping and high density integration of valves on chip, allowing complicated and parallel fluid manipulation and in-channel cell culture. Plastics, as competitive alternatives to elastomers, are also rapid and inexpensive to microfabricate. Their broad variety provides flexible choices for different needs. For example, some thermosets support in-situ fabrication of

  4. A Novel Pressure Indicator for Continuous Flow PCR Chip Using Micro Molded PDMS Pillar Arrays

    National Research Council Canada - National Science Library

    Zhao, Yi; Zhang, Xin

    2005-01-01

    .... Continuous flow PCR chip releases biologists from their laborious exercises. The use of such chip is, however, hindered by costly expense of the syringe pump, which is used to maintain a constant flow rate...

  5. Individualized Pixel Synthesis and Characterization of Combinatorial Materials Chips

    Directory of Open Access Journals (Sweden)

    Xiao-Dong Xiang

    2015-06-01

    Full Text Available Conventionally, an experimentally determined phase diagram requires studies of phase formation at a range of temperatures for each composition, which takes years of effort from multiple research groups. Combinatorial materials chip technology, featuring high-throughput synthesis and characterization, is able to determine the phase diagram of an entire composition spread of a binary or ternary system at a single temperature on one materials library, which, though significantly increasing efficiency, still requires many libraries processed at a series of temperatures in order to complete a phase diagram. In this paper, we propose a “one-chip method” to construct a complete phase diagram by individually synthesizing each pixel step by step with a progressive pulse of energy to heat at different temperatures while monitoring the phase evolution on the pixel in situ in real time. Repeating this process pixel by pixel throughout the whole chip allows the entire binary or ternary phase diagram to be mapped on one chip in a single experiment. The feasibility of this methodology is demonstrated in a study of a Ge-Sb-Te ternary alloy system, on which the amorphous-crystalline phase boundary is determined.

  6. Materials Characterization of CIGS solar cells on Top of CMOS chips

    NARCIS (Netherlands)

    Lu, J.; Liu, W.; Kovalgin, A.Y.; Sun, Y.; Schmitz, J.; Venkatasubramanian, R.; Radousky, H.; Liang, H.

    2011-01-01

    In the current work, we present a detailed study on the material properties of the CIGS layers, fabricated on top of the CMOS chips, and compare the results with the fabrication on standard glass substrates. Almost identical elemental composition on both glass and CMOS chips (within measurement

  7. Bubble-free on-chip continuous-flow polymerase chain reaction: concept and application.

    Science.gov (United States)

    Wu, Wenming; Kang, Kyung-Tae; Lee, Nae Yoon

    2011-06-07

    Bubble formation inside a microscale channel is a significant problem in general microfluidic experiments. The problem becomes especially crucial when performing a polymerase chain reaction (PCR) on a chip which is subject to repetitive temperature changes. In this paper, we propose a bubble-free sample injection scheme applicable for continuous-flow PCR inside a glass/PDMS hybrid microfluidic chip, and attempt to provide a theoretical basis concerning bubble formation and elimination. Highly viscous paraffin oil plugs are employed in both the anterior and posterior ends of a sample plug, completely encapsulating the sample and eliminating possible nucleation sites for bubbles. In this way, internal channel pressure is increased, and vaporization of the sample is prevented, suppressing bubble formation. Use of an oil plug in the posterior end of the sample plug aids in maintaining a stable flow of a sample at a constant rate inside a heated microchannel throughout the entire reaction, as compared to using an air plug. By adopting the proposed sample injection scheme, we demonstrate various practical applications. On-chip continuous-flow PCR is performed employing genomic DNA extracted from a clinical single hair root sample, and its D1S80 locus is successfully amplified. Also, chip reusability is assessed using a plasmid vector. A single chip is used up to 10 times repeatedly without being destroyed, maintaining almost equal intensities of the resulting amplicons after each run, ensuring the reliability and reproducibility of the proposed sample injection scheme. In addition, the use of a commercially-available and highly cost-effective hot plate as a potential candidate for the heating source is investigated.

  8. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  9. In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

    International Nuclear Information System (INIS)

    Wang Yuelin; Li Tie; Zhang Xiao; Zeng Hongjiang; Jin Qinhua

    2014-01-01

    Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope (SEM) and a transmission electron microscope (TEM) with the help of traditional micro-electro-mechanical system (MEMS) technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young's modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices. (invited papers)

  10. Perspective: Fabrication of integrated organ-on-a-chip via bioprinting.

    Science.gov (United States)

    Yang, Qingzhen; Lian, Qin; Xu, Feng

    2017-05-01

    Organ-on-a-chip has emerged as a powerful platform with widespread applications in biomedical engineering, such as pathology studies and drug screening. However, the fabrication of organ-on-a-chip is still a challenging task due to its complexity. For an integrated organ-on-a-chip, it may contain four key elements, i.e., a microfluidic chip, live cells/microtissues that are cultured in this chip, components for stimulus loading to mature the microtissues, and sensors for results readout. Recently, bioprinting has been used for fabricating organ-on-a-chip as it enables the printing of multiple materials, including biocompatible materials and even live cells in a programmable manner with a high spatial resolution. Besides, all four elements for organ-on-a-chip could be printed in a single continuous procedure on one printer; in other words, the fabrication process is assembly free. In this paper, we discuss the recent advances of organ-on-a-chip fabrication by bioprinting. Light is shed on the printing strategies, materials, and biocompatibility. In addition, some specific bioprinted organs-on-chips are analyzed in detail. Because the bioprinted organ-on-a-chip is still in its early stage, significant efforts are still needed. Thus, the challenges presented together with possible solutions and future trends are also discussed.

  11. Edge chipping resistance and flexural strength of polymer infiltrated ceramic network and resin nanoceramic restorative materials.

    Science.gov (United States)

    Argyrou, Renos; Thompson, Geoffrey A; Cho, Seok-Hwan; Berzins, David W

    2016-09-01

    Two novel restorative materials, a polymer infiltrated ceramic network (PICN) and a resin nanoceramic (RNC), for computer-assisted design and computer-assisted manufacturing (CAD-CAM) applications have recently become commercially available. Little independent evidence regarding their mechanical properties exists to facilitate material selection. The purpose of this in vitro study was to measure the edge chipping resistance and flexural strength of the PICN and RNC materials and compare them with 2 commonly used feldspathic ceramic (FC) and leucite reinforced glass-ceramic (LRGC) CAD-CAM materials that share the same clinical indications. PICN, RNC, FC, and LRGC material specimens were obtained by sectioning commercially available CAD-CAM blocks. Edge chipping test specimens (n=20/material) were adhesively attached to a resin substrate before testing. Edge chips were produced using a 120-degree, sharp, conical diamond indenter mounted on a universal testing machine and positioned 0.1 to 0.7 mm horizontally from the specimen's edge. The chipping force was plotted against distance to the edge, and the data were fitted to linear and quadratic equations. One-way ANOVA determined intergroup differences (α=.05) in edge chipping toughness. Beam specimens (n=22/material) were tested for determining flexural strength using a 3-point bend test. Weibull statistics determined intergroup differences (α=.05). Flexural modulus and work of fracture were also calculated, and 1-way ANOVA determined intergroup differences (α=.05) RESULTS: Significant (Pmaterials for the 4 mechanical properties. Specifically, the material rankings were edge chipping toughness: RNC>LRGC=FC>PICN; flexural strength: RNC=LRGC>PICN>FC; flexural modulus: RNCLRGC=PICN>FC. The RNC material demonstrated superior performance for the mechanical properties tested compared with the other 3 materials. Copyright © 2016 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All

  12. On-chip photonic memory elements employing phase-change materials.

    Science.gov (United States)

    Rios, Carlos; Hosseini, Peiman; Wright, C David; Bhaskaran, Harish; Pernice, Wolfram H P

    2014-03-05

    Phase-change materials integrated into nanophotonic circuits provide a flexible way to realize tunable optical components. Relying on the enormous refractive-index contrast between the amorphous and crystalline states, such materials are promising candidates for on-chip photonic memories. Nonvolatile memory operation employing arrays of microring resonators is demonstrated as a route toward all-photonic chipscale information processing. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  13. Kinetic model for torrefaction of wood chips in a pilot-scale continuous reactor

    DEFF Research Database (Denmark)

    Shang, Lei; Ahrenfeldt, Jesper; Holm, Jens Kai

    2014-01-01

    accordance with the model data. In an additional step a continuous, pilot scale reactor was built to produce torrefied wood chips in large quantities. The "two-step reaction in series" model was applied to predict the mass yield of the torrefaction reaction. Parameters used for the calculation were...... at different torrefaction temperatures, it was possible to predict the HHV of torrefied wood chips from the pilot reactor. The results from this study and the presented modeling approach can be used to predict the product quality from pilot scale torrefaction reactors based on small scale experiments and could...

  14. Influences of Cutting Speed and Material Mechanical Properties on Chip Deformation and Fracture during High-Speed Cutting of Inconel 718

    Directory of Open Access Journals (Sweden)

    Bing Wang

    2018-03-01

    Full Text Available The paper aims to investigate the influences of material constitutive and fracture parameters in addition to cutting speed on chip formation during high-speed cutting of Inconel 718. Finite element analyses for chip formation are conducted with Johnson–Cook constitutive and fracture models. Meanwhile, experiments of high-speed orthogonal cutting are performed to verify the simulation results with cutting speeds ranging from 50 m/min to 7000 m/min. The research indicates that the chip morphology transforms from serrated to fragmented at the cutting speed of 7000 m/min due to embrittlement of the workpiece material under ultra-high cutting speeds. The parameter of shear localization sensitivity is put forward to describe the influences of material mechanical properties on serrated chip formation. The results demonstrate that the effects of initial yield stress and thermal softening coefficient on chip shear localization are much more remarkable than the other constitutive parameters. For the material fracture parameters, the effects of initial fracture strain and exponential factor of stress state on chip shear localization are more much prominent. This paper provides guidance for controlling chip formation through the adjustment of material mechanical properties and the selection of appropriate cutting parameters.

  15. Influences of Cutting Speed and Material Mechanical Properties on Chip Deformation and Fracture during High-Speed Cutting of Inconel 718.

    Science.gov (United States)

    Wang, Bing; Liu, Zhanqiang; Hou, Xin; Zhao, Jinfu

    2018-03-21

    The paper aims to investigate the influences of material constitutive and fracture parameters in addition to cutting speed on chip formation during high-speed cutting of Inconel 718. Finite element analyses for chip formation are conducted with Johnson-Cook constitutive and fracture models. Meanwhile, experiments of high-speed orthogonal cutting are performed to verify the simulation results with cutting speeds ranging from 50 m/min to 7000 m/min. The research indicates that the chip morphology transforms from serrated to fragmented at the cutting speed of 7000 m/min due to embrittlement of the workpiece material under ultra-high cutting speeds. The parameter of shear localization sensitivity is put forward to describe the influences of material mechanical properties on serrated chip formation. The results demonstrate that the effects of initial yield stress and thermal softening coefficient on chip shear localization are much more remarkable than the other constitutive parameters. For the material fracture parameters, the effects of initial fracture strain and exponential factor of stress state on chip shear localization are more much prominent. This paper provides guidance for controlling chip formation through the adjustment of material mechanical properties and the selection of appropriate cutting parameters.

  16. Microfluidic Platform for the Long-Term On-Chip Cultivation of Mammalian Cells for Lab-On-A-Chip Applications.

    Science.gov (United States)

    Bunge, Frank; Driesche, Sander van den; Vellekoop, Michael J

    2017-07-10

    Lab-on-a-Chip (LoC) applications for the long-term analysis of mammalian cells are still very rare due to the lack of convenient cell cultivation devices. The difficulties are the integration of suitable supply structures, the need of expensive equipment like an incubator and sophisticated pumps as well as the choice of material. The presented device is made out of hard, but non-cytotoxic materials (silicon and glass) and contains two vertical arranged membranes out of hydrogel. The porous membranes are used to separate the culture chamber from two supply channels for gases and nutrients. The cells are fed continuously by diffusion through the membranes without the need of an incubator and low requirements on the supply of medium to the assembly. The diffusion of oxygen is modelled in order to find the optimal dimensions of the chamber. The chip is connected via 3D-printed holders to the macroscopic world. The holders are coated with Parlyene C to ensure that only biocompatible materials are in contact with the culture medium. The experiments with MDCK-cells show the successful seeding inside the chip, culturing and passaging. Consequently, the presented platform is a step towards Lab-on-a-Chip applications that require long-term cultivation of mammalian cells.

  17. Material Biocompatibility for PCR Microfluidic Chips

    KAUST Repository

    Kodzius, Rimantas

    2010-04-23

    As part of the current miniaturization trend, biological reactions and processes are being adapted to microfluidics devices. PCR is the primary method employed in DNA amplification, its miniaturization is central to efforts to develop portable devices for diagnostics and testing purposes. A problem is the PCR-inhibitory effect due to interaction between PCR reagents and the surrounding environment, which effect is increased in high-surface-are-to-volume ration microfluidics. In this study, we evaluated the biocompatibility of various common materials employed in the fabrication of microfluidic chips, including silicon, several kinds of silicon oxide, glasses, plastics, wax, and adhesives. Two-temperature PCR was performed with these materials to determine their PCR-inhibitory effect. In most of the cases, addition of bovine serum albumin effectively improved the reaction yield. We also studied the individual PCR components from the standpoint of adsorption. Most of the materials did not inhibit the DNA, whereas they did show noticeable interaction with the DNA polymerase. Our test, instead of using microfluidic devices, can be easily conducted in common PCR tubes using a standard bench thermocycler. Our data supports an overview of the means by which the materials most bio-friendly to microfluidics can be selected.

  18. Material Biocompatibility for PCR Microfluidic Chips

    KAUST Repository

    Kodzius, Rimantas; Chang, Donald Choy; Gong, Xiuqing; Wen, Weijia; Wu, Jinbo; Xiao, Kang; Yi, Xin

    2010-01-01

    As part of the current miniaturization trend, biological reactions and processes are being adapted to microfluidics devices. PCR is the primary method employed in DNA amplification, its miniaturization is central to efforts to develop portable devices for diagnostics and testing purposes. A problem is the PCR-inhibitory effect due to interaction between PCR reagents and the surrounding environment, which effect is increased in high-surface-are-to-volume ration microfluidics. In this study, we evaluated the biocompatibility of various common materials employed in the fabrication of microfluidic chips, including silicon, several kinds of silicon oxide, glasses, plastics, wax, and adhesives. Two-temperature PCR was performed with these materials to determine their PCR-inhibitory effect. In most of the cases, addition of bovine serum albumin effectively improved the reaction yield. We also studied the individual PCR components from the standpoint of adsorption. Most of the materials did not inhibit the DNA, whereas they did show noticeable interaction with the DNA polymerase. Our test, instead of using microfluidic devices, can be easily conducted in common PCR tubes using a standard bench thermocycler. Our data supports an overview of the means by which the materials most bio-friendly to microfluidics can be selected.

  19. X-γ dose rate continuous monitor with wide range based on single-chip microcomputer

    International Nuclear Information System (INIS)

    Wu Debo; Ling Qiu; Guo Lanying; Yang Binhua

    2007-01-01

    This paper describes a concept about circuit designing of X-γ dose rate continuous monitor with wide range based on single-chip microcomputer, and also presents the design procedure of hardware and software, and gives several methods for solving the design procedure of hardware and software with emphasis. (authors)

  20. Ultrasonic Vibration Assisted Grinding of Bio-ceramic Materials: Modeling, Simulation, and Experimental Investigations on Edge Chipping

    Science.gov (United States)

    Tesfay, Hayelom D.

    Bio-ceramics are those engineered materials that find their applications in the field of biomedical engineering or medicine. They have been widely used in dental restorations, repairing bones, joint replacements, pacemakers, kidney dialysis machines, and respirators. etc. due to their physico-chemical properties, such as excellent corrosion resistance, good biocompatibility, high strength and high wear resistance. Because of their inherent brittleness and hardness nature they are difficult to machine to exact sizes and dimensions. Abrasive machining processes such as grinding is one of the most widely used manufacturing processes for bioceramics. However, the principal technical challenge resulted from these machining is edge chipping. Edge chipping is a common edge failure commonly observed during the machining of bio-ceramic materials. The presence of edge chipping on bio-ceramic products affects dimensional accuracy, increases manufacturing cost, hider their industrial applications and causes potential failure during service. To overcome these technological challenges, a new ultrasonic vibration-assisted grinding (UVAG) manufacturing method has been developed and employed in this research. The ultimate aim of this study is to develop a new cost-effective manufacturing process relevant to eliminate edge chippings in grinding of bio-ceramic materials. In this dissertation, comprehensive investigations will be carried out using experimental, theoretical, and numerical approaches to evaluate the effect of ultrasonic vibrations on edge chipping of bioceramics. Moreover, effects of nine input variables (static load, vibration frequency, grinding depth, spindle speed, grinding distance, tool speed, grain size, grain number, and vibration amplitude) on edge chipping will be studied based on the developed models. Following a description of previous research and existing approaches, a series of experimental tests on three bio-ceramic materials (Lava, partially fired Lava

  1. Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

    Directory of Open Access Journals (Sweden)

    Chang-Chun Lee

    2015-08-01

    Full Text Available three-dimensional integrated circuit (3D-IC structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their surrounding wafer level underfill (WLUF. The mechanical properties of this equivalent material, including Young’s modulus (E, Poisson’s ratio, shear modulus, and coefficient of thermal expansion (CTE, are directly obtained by applying either a tensile load or a constant displacement, and by increasing the temperature during simulations, respectively. Analytic results indicate that at least eight microbumps at the outermost region of the chip stacking structure need to be considered as an accurate stress/strain contour in the concerned region. In addition, a factorial experimental design with analysis of variance is proposed to optimize chip stacking structure reliability with four factors: chip thickness, substrate thickness, CTE, and E-value. Analytic results show that the most significant factor is CTE of WLUF. This factor affects microbump reliability and structural warpage under a temperature cycling load and high-temperature bonding process. WLUF with low CTE and high E-value are recommended to enhance the assembly reliability of the 3D-IC architecture.

  2. Selection of Easily Accessible PCR- and Bio-Compatible Materials for Microfluidic Chips

    KAUST Repository

    Xiao, Kang; Kodzius, Rimantas; Wu, Jinbo

    2013-01-01

    Conventional fabrication of microfluidic chip is a complicated and time, effort and material consuming process. Consequently, due to high expenses, it has poor applicability for performing mass biological analysis by microfluidics. In this study, we

  3. Selection of Easily Accessible PCR- and Bio-Compatible Materials for Microfluidic Chips

    KAUST Repository

    Xiao, Kang

    2013-10-30

    Conventional fabrication of microfluidic chip is a complicated and time, effort and material consuming process. Consequently, due to high expenses, it has poor applicability for performing mass biological analysis by microfluidics. In this study, we repor

  4. Calculating Parameters of Chip Formation and Cutting Forces of Plastic Materials

    Directory of Open Access Journals (Sweden)

    S. V Grubyi

    2017-01-01

    Full Text Available In addition to the kinematics and geometric parameters of the tool, parameters of chip formation and cutting forces lay the groundwork for theoretical analysis of various types of machining.The objective of research activities is to develop a calculation technique to evaluate parameters of chip formation and cutting forces when machining such plastic materials as structural carbon and alloy steels, and aluminum alloys. The subject of research activities is directly a cutting process, algorithms and calculation methods in the field under consideration. A theoretical (calculated method to analyse parameters was used. The results of qualitative and quantitative calculations were compared with the published experimental data.As to the chip formation and cutting forces, a model with a single shear plane is analyzed, which allows a quantitative evaluation of the parameters and of the process factors. Modern domestic and foreign authors’ publications of cutting metals use this model on the reasonable grounds. The novelty of the proposed technique is that calculation of parameters and cutting forces does not require experimental research activities and is based on using the known mechanical characteristics of machined and tool materials. The calculation results are parameters, namely the shear angle, velocity factor of the chip, relative shift, friction coefficient at the front surface, cutting forces, etc. Calculation of these parameters will allow us to pass on to the thermo-physical problems, analysis of tool wear and durability, accuracy, quality and performance rate.The sequence of calculations is arranged in the developed user program in an algorithmic programming language with results in graphical or tabulated view. The calculation technique is a structural component of the cutting theory and is to be used in conducting research activities and engineering calculations in this subject area.

  5. Chip compacting press; Jido kirikuzu asshukuki

    Energy Technology Data Exchange (ETDEWEB)

    Oura, K. [Yuken Kogyo Co. Ltd., Kanagawa (Japan)

    1998-08-15

    The chips exhausted from various machine tools are massy, occupy much space and make working environment worse by staying added cutting oil to lower part. The chips are exhausted as a result of machining and have not constant quality. Even if used material is same the chips have various shapes and properties by kinds and machining methods of used machine tools, and are troublesome materials from a standpoint of their treatment. Pressing and solidification of the chips have frequently been tried. A chip compacting press introduced in this paper, a relatively cheap chip compacting press aimed for relatively small scale chip treatment, and has such characteristics and effects as follows. Chips are pressed and solidified by each raw material, so fractional management can be easily conducted. As casting metal chips and curled chips of iron and aluminum can be pressed to about 1/3 to 1/5 and about 1/40, respectively, space saving can be conducted. Chip compacting pressing upgrades its transporting efficiency to make possible to reduce its transporting cost. As chip solidification controls its oxidation and most cutting oil are removed, chips are easy to recycle. 2 figs., 1 tab.

  6. SU-8 as a material for lab-on-a-chip-based mass spectrometry.

    Science.gov (United States)

    Arscott, Steve

    2014-10-07

    This short review focuses on the application of SU-8 for the microchip-based approach to the miniaturization of mass spectrometry. Chip-based mass spectrometry will make the technology commonplace and bring benefits such as lower costs and autonomy. The chip-based miniaturization of mass spectrometry necessitates the use of new materials which are compatible with top-down fabrication involving both planar and non-planar processes. In this context, SU-8 is a very versatile epoxy-based, negative tone resist which is sensitive to ultraviolet radiation, X-rays and electron beam exposure. It has a very wide thickness range, from nanometres to millimetres, enabling the formation of mechanically rigid, very high aspect ratio, vertical, narrow width structures required to form microfluidic slots and channels for laboratory-on-a-chip design. It is also relatively chemically resistant and biologically compatible in terms of the liquid solutions used for mass spectrometry. This review looks at the impact and potential of SU-8 on the different parts of chip-based mass spectrometry - pre-treatment, ionization processes, and ion sorting and detection.

  7. Wax-bonding 3D microfluidic chips

    KAUST Repository

    Gong, Xiuqing; Yi, Xin; Xiao, Kang; Li, Shunbo; Kodzius, Rimantas; Qin, Jianhua; Wen, Weijia

    2013-01-01

    We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

  8. Wax-bonding 3D microfluidic chips

    KAUST Repository

    Gong, Xiuqing

    2013-10-10

    We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.

  9. Active 2D materials for on-chip nanophotonics and quantum optics

    Directory of Open Access Journals (Sweden)

    Shiue Ren-Jye

    2017-03-01

    Full Text Available Two-dimensional materials have emerged as promising candidates to augment existing optical networks for metrology, sensing, and telecommunication, both in the classical and quantum mechanical regimes. Here, we review the development of several on-chip photonic components ranging from electro-optic modulators, photodetectors, bolometers, and light sources that are essential building blocks for a fully integrated nanophotonic and quantum photonic circuit.

  10. A deterministic guide for material and mode dependence of on-chip electro-optic modulator performance

    Science.gov (United States)

    Amin, Rubab; Suer, Can; Ma, Zhizhen; Sarpkaya, Ibrahim; Khurgin, Jacob B.; Agarwal, Ritesh; Sorger, Volker J.

    2017-10-01

    Electro-optic modulation is a key function in optical data communication and possible future optical computing engines. The performance of modulators intricately depends on the interaction between the actively modulated material and the propagating waveguide mode. While high-performing modulators were demonstrated before, the approaches were taken as ad-hoc. Here we show the first systematic investigation to incorporate a holistic analysis for high-performance and ultra-compact electro-optic modulators on-chip. We show that intricate interplay between active modulation material and optical mode plays a key role in the device operation. Based on physical tradeoffs such as index modulation, loss, optical confinement factors and slow-light effects, we find that bias-material-mode regions exist where high phase modulation and high loss (absorption) modulation is found. This work paves the way for a holistic design rule of electro-optic modulators for on-chip integration.

  11. An electrodynamic preconcentrator integrated thermoelectric biosensor chip for continuous monitoring of biochemical process

    International Nuclear Information System (INIS)

    Choi, Yong-Hwan; Kim, Min-gu; Kang, Dong-Hyun; Sim, Jaesam; Kim, Jongbaeg; Kim, Yong-Jun

    2012-01-01

    This paper proposes an integrated sensor chip for continuous monitoring of a biochemical process. It is composed of a preconcentrator and a thermoelectric biosensor. In the preconcentrator, the concentration of the injected biochemical sample is electrodynamically condensed. Then, in the downstream thermoelectric biosensor, the preconcentrated target molecules react with sequentially injected capture molecules and generate reaction heat. The reaction heat is detected based on the thermoelectric effect, and an integrated split-flow microchannel improves the sensor stability by providing ability to self-compensate thermal noise. These sequential preconcentration and detection processes are performed in completely label-free and continuous conditions and consequently enhance the sensor sensitivity. The performance of the integrated biosensor chip was evaluated at various flow rates and applied voltages. First, in order to verify characteristics of the fabricated preconcentrator, 10 µm -diameter polystyrene (PS) particles were used. The particles were concentrated by applying ac voltage from 0 to 16 V pp at 3 MHz at various flow rates. In the experimental result, approximately 92.8% of concentration efficiency was achieved at a voltage over 16 V pp and at a flow rate below 100 µl h −1 . The downstream thermoelectric biosensor was characterized by measuring reaction heat of biotin–streptavidin interaction. The preconcentrated streptavidin-coated PS particles flow into the reaction chamber and react with titrated biotin. The measured output voltage was 288.2 µV at a flow rate of 100 µl h −1 without preconcentration. However, by using proposed preconcentrator, an output voltage of 812.3 µV was achieved with a 16 V pp -applied preconcentration in the same given sample and flow rate. According to these results, the proposed label-free biomolecular preconcentration and detection technique can be applied in continuous and high-throughput biochemical applications

  12. Effect of residual chips on the material removal process of the bulk metallic glass studied by in situ scratch testing inside the scanning electron microscope

    Directory of Open Access Journals (Sweden)

    Hu Huang

    2012-12-01

    Full Text Available Research on material removal mechanism is meaningful for precision and ultra-precision manufacturing. In this paper, a novel scratch device was proposed by integrating the parasitic motion principle linear actuator. The device has a compact structure and it can be installed on the stage of the scanning electron microscope (SEM to carry out in situ scratch testing. Effect of residual chips on the material removal process of the bulk metallic glass (BMG was studied by in situ scratch testing inside the SEM. The whole removal process of the BMG during the scratch was captured in real time. Formation and growth of lamellar chips on the rake face of the Cube-Corner indenter were observed dynamically. Experimental results indicate that when lots of chips are accumulated on the rake face of the indenter and obstruct forward flow of materials, materials will flow laterally and downward to find new location and direction for formation of new chips. Due to similar material removal processes, in situ scratch testing is potential to be a powerful research tool for studying material removal mechanism of single point diamond turning, single grit grinding, mechanical polishing and grating fabrication.

  13. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  14. A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection

    OpenAIRE

    Diwei He; Stephen P. Morgan; Dimitrios Trachanis; Jan van Hese; Dimitris Drogoudis; Franco Fummi; Francesco Stefanni; Valerio Guarnieri; Barrie R. Hayes-Gill

    2015-01-01

    Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 ?m CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the...

  15. High temperature coatings from post processing Fe-based chips and Ni-based alloys as a solution for critical raw materials

    Science.gov (United States)

    Dudziak, T.; Olbrycht, A.; Polkowska, A.; Boron, L.; Skierski, P.; Wypych, A.; Ambroziak, A.; Krezel, A.

    2018-03-01

    Due to shortage of natural resources worldwide, it is a need to develop innovative technologies, to save natural resources and secure Critical Raw Materials (CRM). On the other hand, these new technologies should move forward materials engineering in order to develop better materials for extreme conditions. One way to develop new materials is to use post processing chips of austenitic steels (i.e. 304L stainless steel: 18/10 Cr/Ni) and other materials such as Ni-based alloy with high Cr content. In this work, the results of the preliminary study on the High Velocity Oxy Fuel (HVOF) coatings developed from 304L stainless steel chips and Haynes® 282® Ni- based alloys are shown. The study obeys development of the powder for HVOF technology. The produced coatings were exposed at high temperature at 500 and 700 °C for 100 and 300 hours respectively to assess corrosion behaviour.

  16. Rapid identification of Yersinia pestis and Brucella melitensis by chip-based continuous flow PCR

    Science.gov (United States)

    Dietzsch, Michael; Hlawatsch, Nadine; Melzer, Falk; Tomaso, Herbert; Gärtner, Claudia; Neubauer, Heinrich

    2012-06-01

    To combat the threat of biological agents like Yersinia pestis and Brucella melitensis in bioterroristic scenarios requires fast, easy-to-use and safe identification systems. In this study we describe a system for rapid amplification of specific genetic markers for the identification of Yersinia pestis and Brucella melitensis. Using chip based PCR and continuous flow technology we were able to amplify the targets simultaneously with a 2-step reaction profile within 20 minutes. The subsequent analysis of amplified fragments by standard gel electrophoresis requires another 45 minutes. We were able to detect both pathogens within 75 minutes being much faster than most other nucleic acid amplification technologies.

  17. Compound soil-tyre chips modified by cement as a road construction material

    Directory of Open Access Journals (Sweden)

    Panu Promputthangkoon

    2013-10-01

    Full Text Available This research attempts to overcome the two problems of low-quality soil and a growing number of discarded tyres bymixing low-CBR soil with recycled tyre chips. The compound soil-tyre chips was then stabilised by Portland cement with theaim of using them as a new material in road construction in order to reduce the occurrence of shrinkage cracks. To achievethe purposes of this research three standard geotechnical testing programmes were employed: (1 modified compaction tests,(2 California Bearing Ratio tests (CBR, and (3 unconfined compression tests. The modified compaction test results provedthat for the mixtures having very low tyre chips and cement content, the behaviour is very complex. It was also observed thatthe greater the percentage of rubber added the lower the global density. However, this is predictable as the specific gravityof the rubber is much lower than that of the soil. For the relationship between the optimum moisture content (OMC and thecement content, it was observed that there is no clear pattern.For the specimens having no cement added, the CBR for unsoaked specimens was observed to be greater than that forsoaked specimens. However, when the cement was introduced the CBR test showed that the resistance to penetration for thesoaked specimens was significantly greater, indicating the effects of cement added on the strength. In addition, it was foundthat the CBR values for both soaked and unsoaked specimens gradually increased with the increase of cement content.Lastly, the unconfined compressive strength progressively increased with the increased percentage of cement.

  18. Recycling melting process of the zirconium alloy chips

    Energy Technology Data Exchange (ETDEWEB)

    Reis, Luis A.M. dos; Mucsi, Cristiano S.; Tavares, Luiz A.P.; Alencar, Maicon C.; Gomes, Maurilio P.; Barbosa, Luzinete P.; Rossi, Jesualdo L., E-mail: luisreis.09@gmail.com, E-mail: csmucsi@gmail.com [Instituto de Pesquisas Energéticas e Nucleares (IPEN/CNEN-SP), São Paulo, SP (Brazil)

    2017-07-01

    Pressurized water reactors (PWR) commonly use {sup 235}U enriched uranium dioxide pellets as a nuclear fuel, these are assembled and stacked in zirconium alloy tubes and end caps (M5, Zirlo, Zircaloy). During the machining of these components large amounts of chips are generated which are contaminated with cutting fluid. Its storage presents safety and environmental risks due to its pyrophoric and reactive nature. Recycling industry shown interest in its recycling due to its strategic importance. This paper presents a study on the recycling process and the results aiming the efficiency in the cleaning process; the quality control; the obtaining of the pressed electrodes and finally the melting in a Vacuum Arc Remelting furnace (VAR). The recycling process begins with magnetic separation of possible ferrous alloys chips contaminant, the washing of the cutting fluid that is soluble in water, washing with an industrial degreaser, followed by a rinse with continuous flow of water under high pressure and drying with hot air. The first evaluation of the process was done by an Energy Dispersive X-rays Fluorescence Spectrometry (EDXRFS) showed the presence of 10 wt. % to 17 wt. % of impurities due the mixing with stainless steel machining chips. The chips were then pressed in a custom-made matrix of square section (40 x 40 mm - 500 mm in length), resulting in electrodes with 20% of apparent density of the original alloy. The electrode was then melted in a laboratory scale VAR furnace at the CCTM-IPEN, producing a massive ingot with 0.8 kg. It was observed that the samples obtained from Indústrias Nucleares do Brasil (INB) are supposed to be secondary scrap and it is suggested careful separation in the generation of this material. The melting of the chips is possible and feasible in a VAR furnace which reduces the storage volume by up to 40 times of this material, however, it is necessary to correct the composition of the alloy for the melting of these ingots. (author)

  19. Recycling melting process of the zirconium alloy chips

    International Nuclear Information System (INIS)

    Reis, Luis A.M. dos; Mucsi, Cristiano S.; Tavares, Luiz A.P.; Alencar, Maicon C.; Gomes, Maurilio P.; Barbosa, Luzinete P.; Rossi, Jesualdo L.

    2017-01-01

    Pressurized water reactors (PWR) commonly use 235 U enriched uranium dioxide pellets as a nuclear fuel, these are assembled and stacked in zirconium alloy tubes and end caps (M5, Zirlo, Zircaloy). During the machining of these components large amounts of chips are generated which are contaminated with cutting fluid. Its storage presents safety and environmental risks due to its pyrophoric and reactive nature. Recycling industry shown interest in its recycling due to its strategic importance. This paper presents a study on the recycling process and the results aiming the efficiency in the cleaning process; the quality control; the obtaining of the pressed electrodes and finally the melting in a Vacuum Arc Remelting furnace (VAR). The recycling process begins with magnetic separation of possible ferrous alloys chips contaminant, the washing of the cutting fluid that is soluble in water, washing with an industrial degreaser, followed by a rinse with continuous flow of water under high pressure and drying with hot air. The first evaluation of the process was done by an Energy Dispersive X-rays Fluorescence Spectrometry (EDXRFS) showed the presence of 10 wt. % to 17 wt. % of impurities due the mixing with stainless steel machining chips. The chips were then pressed in a custom-made matrix of square section (40 x 40 mm - 500 mm in length), resulting in electrodes with 20% of apparent density of the original alloy. The electrode was then melted in a laboratory scale VAR furnace at the CCTM-IPEN, producing a massive ingot with 0.8 kg. It was observed that the samples obtained from Indústrias Nucleares do Brasil (INB) are supposed to be secondary scrap and it is suggested careful separation in the generation of this material. The melting of the chips is possible and feasible in a VAR furnace which reduces the storage volume by up to 40 times of this material, however, it is necessary to correct the composition of the alloy for the melting of these ingots. (author)

  20. Optimizing Polymer Lab-on-Chip Platforms for Ultrasonic Manipulation: Influence of the Substrate

    Directory of Open Access Journals (Sweden)

    Itziar González

    2015-05-01

    Full Text Available The choice of substrate material in a chip that combines ultrasound with microfluidics for handling biological and synthetic microparticles can have a profound effect on the performance of the device. This is due to the high surface-to-volume ratio that exists within such small structures and acquires particular relevance in polymer-based resonators with 3D standing waves. This paper presents three chips developed to perform particle flow-through separation by ultrasound based on a polymeric SU-8 layer containing channelization over three different substrates: Polymethyl methacrylate (PMMA; Pyrex; and a cracked PMMA composite-like structure. Through direct observations of polystyrene microbeads inside the channel, the three checked chips exhibit their potential as disposable continuous concentration devices with different spatial pressure patterns at frequencies of resonance close to 1 Mhz. Chips with Pyrex and cracked PMMA substrates show restrictions on the number of pressure nodes established in the channel associated with the inhibition of 3D modes in the solid structure. The glass-substrate chip presents some advantages associated with lower energy requirements to collect particles. According to the results, the use of polymer-based chips with rigid substrates can be advantageous for applications that require short treatment times (clinical tests handling human samples and low-cost fabrication.

  1. Multivariate Correlation between Analysis Data on Dissolved Organic Material from Scots Pine (Pinus sylvestris Chips and their Autohydrolysis Pre-Treatment Conditions

    Directory of Open Access Journals (Sweden)

    Joni Lehto

    2013-11-01

    Full Text Available Various chemometric techniques were used to establish the relationship between the autohydrolysis conditions prior to pulping and the chemical compositions of the soluble organic materials removed from Scots pine (Pinus sylvestris wood chips. The aqueous chip pre-treatments (autohydrolysis were administered at 130 °C and 150 °C for 30, 60, 90, and 120 min, and the hydrolysates obtained were characterized in terms of total carbohydrates (various mono-, oligo-, and polysaccharides together with uronic acid side groups, volatile acids (acetic and formic acids, lignin, and furans (furfural and 5-(hydroxymethylfurfural. Based on the analytical data gathered, a relatively accurate model for pine chip autohydrolysis was developed.

  2. Self-powered integrated systems-on-chip (energy chip)

    KAUST Repository

    Hussain, Muhammad Mustafa

    2010-04-23

    In today\\'s world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient power to run those devices, several critical technical challenges need to be overcome: a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low power consumption, faster response, higher sensitivity and batch production (low cost). b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new functionalities that were previously underutilized in the macro/micro dimension. c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand. We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

  3. Self-powered integrated systems-on-chip (energy chip)

    Science.gov (United States)

    Hussain, M. M.; Fahad, H.; Rojas, J.; Hasan, M.; Talukdar, A.; Oommen, J.; Mink, J.

    2010-04-01

    In today's world, consumer driven technology wants more portable electronic gadgets to be developed, and the next big thing in line is self-powered handheld devices. Therefore to reduce the power consumption as well as to supply sufficient power to run those devices, several critical technical challenges need to be overcome: a. Nanofabrication of macro/micro systems which incorporates the direct benefit of light weight (thus portability), low power consumption, faster response, higher sensitivity and batch production (low cost). b. Integration of advanced nano-materials to meet the performance/cost benefit trend. Nano-materials may offer new functionalities that were previously underutilized in the macro/micro dimension. c. Energy efficiency to reduce power consumption and to supply enough power to meet that low power demand. We present a pragmatic perspective on a self-powered integrated System on Chip (SoC). We envision the integrated device will have two objectives: low power consumption/dissipation and on-chip power generation for implementation into handheld or remote technologies for defense, space, harsh environments and medical applications. This paper provides insight on materials choices, intelligent circuit design, and CMOS compatible integration.

  4. Exploration within the Network-on-Chip Paradigm

    NARCIS (Netherlands)

    Wolkotte, P.T.

    2009-01-01

    A general purpose processor used to consist of a single processing core, which performed and controlled all tasks on the chip. Its functionality and maximum clock frequency grew steadily over the years. Due to the continuous increase of the number of transistors available on-chip and the operational

  5. A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection

    Directory of Open Access Journals (Sweden)

    Diwei He

    2015-07-01

    Full Text Available Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 µm CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the transimpedance amplifier, transimpedance gain of the transimpedance amplifier, and the central frequency and bandwidth of the analogue band-pass filters, show a good match (within 1% with the circuit simulations. With modulated light source and integrated lock-in detection the sensor effectively suppresses the interference from ambient light and 1/f noise. In a breath hold and release experiment the single chip sensor demonstrates consistent and comparable performance to commercial pulse oximetry devices with a mean of 1.2% difference. The single-chip sensor enables a compact and robust design solution that offers a route towards wearable devices for health monitoring.

  6. A Single-Chip CMOS Pulse Oximeter with On-Chip Lock-In Detection.

    Science.gov (United States)

    He, Diwei; Morgan, Stephen P; Trachanis, Dimitrios; van Hese, Jan; Drogoudis, Dimitris; Fummi, Franco; Stefanni, Francesco; Guarnieri, Valerio; Hayes-Gill, Barrie R

    2015-07-14

    Pulse oximetry is a noninvasive and continuous method for monitoring the blood oxygen saturation level. This paper presents the design and testing of a single-chip pulse oximeter fabricated in a 0.35 µm CMOS process. The chip includes photodiode, transimpedance amplifier, analogue band-pass filters, analogue-to-digital converters, digital signal processor and LED timing control. The experimentally measured AC and DC characteristics of individual circuits including the DC output voltage of the transimpedance amplifier, transimpedance gain of the transimpedance amplifier, and the central frequency and bandwidth of the analogue band-pass filters, show a good match (within 1%) with the circuit simulations. With modulated light source and integrated lock-in detection the sensor effectively suppresses the interference from ambient light and 1/f noise. In a breath hold and release experiment the single chip sensor demonstrates consistent and comparable performance to commercial pulse oximetry devices with a mean of 1.2% difference. The single-chip sensor enables a compact and robust design solution that offers a route towards wearable devices for health monitoring.

  7. Dry Machining Aeronautical Aluminum Alloy AA2024-T351: Analysis of Cutting Forces, Chip Segmentation and Built-Up Edge Formation

    Directory of Open Access Journals (Sweden)

    Badis Haddag

    2016-08-01

    Full Text Available In this paper, machining aeronautical aluminum alloy AA2024-T351 in dry conditions was investigated. Cutting forces, chip segmentation, and built-up edge formation were analyzed. Machining tests revealed that the chip formation process depends on cutting conditions and tool geometry. So continuous and segmented chips are generated. Under some cutting conditions, built-up edge formation occurs. A predictive machining theory, based on a finite elements method (FEM, was applied to reproduce and explain these phenomena. Thermomechanical behaviors of the work material and the tool-work material interface were considered. Results of the proposed modelling were compared to experimental data for a wide range of cutting speed. It was shown that the feed force is well reproduced by the ALE-FE (arbitrary lagrangian-eulerian finite element formulation and highly underestimated by the lagrangian finite element (LAG-FE one. While, the periodic localized shear band, leading to a chip segmentation, is well reproduced with the Lagrangian FE formulation. It was found that the chip segmentation can be correlated to the cutting force evolution using the defined chip segmentation intensity parameter. For the built-up edge (BUE phenomenon, it was shown that it depends on the contact/friction at the tool-chip interface, and this is possible to simulate by making the friction coefficient time-dependent.

  8. In-plane material continuity for the discrete material optimization method

    DEFF Research Database (Denmark)

    Sørensen, Rene; Lund, Erik

    2015-01-01

    When performing discrete material optimization of laminated composite structures, the variation of the in-plane material continuity is typically governed by the size of the finite element discretization. For a fine mesh, this can lead to designs that cannot be manufactured due to the complexity...

  9. Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

    Science.gov (United States)

    Michaelides, Stylianos

    Flip Chip on Board (FCOB) and Chip-Scale Packages (CSPs) are relatively new technologies that are being increasingly used in the electronic packaging industry. Compared to the more widely used face-up wirebonding and TAB technologies, flip-chips and most CSPs provide the shortest possible leads, lower inductance, higher frequency, better noise control, higher density, greater input/output (I/O), smaller device footprint and lower profile. However, due to the short history and due to the introduction of several new electronic materials, designs, and processing conditions, very limited work has been done to understand the role of material, geometry, and processing parameters on the reliability of flip-chip devices. Also, with the ever-increasing complexity of semiconductor packages and with the continued reduction in time to market, it is too costly to wait until the later stages of design and testing to discover that the reliability is not satisfactory. The objective of the research is to develop integrated process-reliability models that will take into consideration the mechanics of assembly processes to be able to determine the reliability of face-down devices under thermal cycling and long-term temperature dwelling. The models incorporate the time and temperature-dependent constitutive behavior of various materials in the assembly to be able to predict failure modes such as die cracking and solder cracking. In addition, the models account for process-induced defects and macro-micro features of the assembly. Creep-fatigue and continuum-damage mechanics models for the solder interconnects and fracture-mechanics models for the die have been used to determine the reliability of the devices. The results predicted by the models have been successfully validated against experimental data. The validated models have been used to develop qualification and test procedures for implantable medical devices. In addition, the research has helped develop innovative face

  10. Review - On-chip diamagnetic repulsion in continuous flow

    Directory of Open Access Journals (Sweden)

    Mark D Tarn, Noriyuki Hirota, Alexander Iles and Nicole Pamme

    2009-01-01

    Full Text Available We explore the potential of a microfluidic continuous flow particle separation system based on the repulsion of diamagnetic materials from a high magnetic field. Diamagnetic polystyrene particles in paramagnetic manganese (II chloride solution were pumped into a microfluidic chamber and their deflection behaviour in a high magnetic field applied by a superconducting magnet was investigated. Two particle sizes (5 and 10 μm were examined in two concentrations of MnCl2 (6 and 10%. The larger particles were repelled to a greater extent than the smaller ones, and the effect was greatly enhanced when the particles were suspended in a higher concentration of MnCl2. These findings indicate that the system could be viable for the separation of materials of differing size and/or diamagnetic susceptibility, and as such could be suitable for the separation and sorting of small biological species for subsequent studies.

  11. On-chip determination of C-reactive protein using magnetic particles in continuous flow.

    Science.gov (United States)

    Phurimsak, Chayakom; Tarn, Mark D; Peyman, Sally A; Greenman, John; Pamme, Nicole

    2014-11-04

    We demonstrate the application of a multilaminar flow platform, in which functionalized magnetic particles are deflected through alternating laminar flow streams of reagents and washing solutions via an external magnet, for the rapid detection of the inflammatory biomarker, C-reactive protein (CRP). The two-step sandwich immunoassay was accomplished in less than 60 s, a vast improvement on the 80-300 min time frame required for enzyme-linked immunosorbent assays (ELISA) and the 50 min necessary for off-chip magnetic particle-based assays. The combination of continuous flow and a stationary magnet enables a degree of autonomy in the system, while a detection limit of 0.87 μg mL(-1) makes it suitable for the determination of CRP concentrations in clinical diagnostics. Its applicability was further proven by assaying real human serum samples and comparing those results to values obtained using standard ELISA tests.

  12. Local structure of metallic chips examined by X-ray microdiffraction

    International Nuclear Information System (INIS)

    Saksl, K.; Rokicki, P.; Siemers, C.; Ostroushko, D.; Bednarčík, J.; Rütt, U.

    2013-01-01

    Highlights: •We present a detailed microstructure and phase analysis of chips produced by cutting. •3D analysis proved mixed nature of shear bands propagation to the material. •We examine phase composition of the chips by focused X-ray beam. •Crystallites in segment and shear band change their orientation up to 10°. -- Abstract: Nickel-base alloys are used in high-temperature applications whenever steels or titanium alloys cannot be applied anymore. This class of alloys is furthermore used in low-temperature applications in the oil or gas industry in case the corrosion resistance of stainless steels in related liquid media is not sufficient and titanium alloys would be too expensive. Nickel-base alloys, however, due to their high strength and toughness can be machined only at low cutting speeds as otherwise poor surface quality and enhanced tool wear is observed. From all aspects influencing the machinability, the chip formation mechanism is the key factor and only a thorough understanding of this mechanism can lead to an optimisation of the cutting process. In the current study, a detailed microstructure and phase analysis of Alloy 625 chips produced in an orthogonal cutting process at conventional cutting speeds is presented. Utilising hard monochromatic X-rays focused down to micrometre size, microstructural differences between distinct structural units of the chips, namely, the segments and shear bands, are investigated. Scanning cross sections of the chips with this small beam allowed us to determine misorientation between the segments and shear bands crystal lattices which as we found are not changing abruptly but continuously, with an absolute difference up to 10°

  13. Local structure of metallic chips examined by X-ray microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Saksl, K., E-mail: ksaksl@imr.saske.sk [Institut of Materials Research, Slovak Academy of Sciences, Watsonova 47, 040 01 Košice (Slovakia); Rokicki, P. [The Faculty of Mechanical Engineering and Aeronautics, Rzeszow University of Technology, Al. Powstancow Warszawy 12, 35-959 Rzeszow (Poland); Siemers, C. [Institut fuer Werkstoffe, Technische Universitaet Braunschweig, Langer Kamp 8, 38106 Braunschweig (Germany); Ostroushko, D. [Faculty of Metallurgy and Materials Engineering, VŠB – Technical University of Ostrava, 17.listopadu 15, 708 33 Ostrava (Czech Republic); Bednarčík, J.; Rütt, U. [HASYLAB at DESY, Notkestr. 85, D-22607 Hamburg (Germany)

    2013-12-25

    Highlights: •We present a detailed microstructure and phase analysis of chips produced by cutting. •3D analysis proved mixed nature of shear bands propagation to the material. •We examine phase composition of the chips by focused X-ray beam. •Crystallites in segment and shear band change their orientation up to 10°. -- Abstract: Nickel-base alloys are used in high-temperature applications whenever steels or titanium alloys cannot be applied anymore. This class of alloys is furthermore used in low-temperature applications in the oil or gas industry in case the corrosion resistance of stainless steels in related liquid media is not sufficient and titanium alloys would be too expensive. Nickel-base alloys, however, due to their high strength and toughness can be machined only at low cutting speeds as otherwise poor surface quality and enhanced tool wear is observed. From all aspects influencing the machinability, the chip formation mechanism is the key factor and only a thorough understanding of this mechanism can lead to an optimisation of the cutting process. In the current study, a detailed microstructure and phase analysis of Alloy 625 chips produced in an orthogonal cutting process at conventional cutting speeds is presented. Utilising hard monochromatic X-rays focused down to micrometre size, microstructural differences between distinct structural units of the chips, namely, the segments and shear bands, are investigated. Scanning cross sections of the chips with this small beam allowed us to determine misorientation between the segments and shear bands crystal lattices which as we found are not changing abruptly but continuously, with an absolute difference up to 10°.

  14. Programmable lab-on-a-chip system for single cell analysis

    Science.gov (United States)

    Thalhammer, S.

    2009-05-01

    The collection, selection, amplification and detection of minimum genetic samples became a part of everyday life in medical and biological laboratories, to analyze DNA-fragments of pathogens, patient samples and traces on crime scenes. About a decade ago, a handful of researchers began discussing an intriguing idea. Could the equipment needed for everyday chemistry and biology procedures be shrunk to fit on a chip in the size of a fingernail? Miniature devices for, say, analysing DNA and proteins should be faster and cheaper than conventional versions. Lab-on-a-chip is an advanced technology that integrates a microfluidic system on a microscale chip device. The "laboratory" is created by means of channels, mixers, reservoirs, diffusion chambers, integrated electrodes, pumps, valves and more. With lab-ona- chip technology, complete laboratories on a square centimetre can be created. Here, a multifunctional programmable Lab-on-a-Chip driven by nanofluidics and controlled by surface acoustic waves (SAW) is presented. This system combines serial DNA-isolation-, amplification- and array-detection-process on a modified glass-platform. The fluid actuation is controlled via SAW by interdigital transducers implemented in the chemical modified chip surface. The chemical surface modification allows fluid handling in the sub-microliter range. Minute amount of sample material is extracted by laser-based microdissection out of e.g. histological sections at the single cell level. A few picogram of genetic material are isolated and transferred via a low-pressure transfer system (SPATS) onto the chip. Subsequently the genetic material inside single droplets, which behave like "virtual" beaker, is transported to the reaction and analysis centers on the chip surface via surface acoustic waves, mainly known as noise dumping filters in mobile phones. At these "biological reactors" the genetic material is processed, e.g. amplified via polymerase chain reaction methods, and genetically

  15. Price of forest chips decreasing

    International Nuclear Information System (INIS)

    Hakkila, P.

    2001-01-01

    Use of forest chips was studied in 1999 in the national Puuenergia (Wood Energy) research program. Wood combusting heating plants were questioned about are the main reasons restricting the increment of the use of forest chips. Heating plants, which did not use forest chips at all or which used less than 250 m 3 (625 bulk- m 3 ) in 1999 were excluded. The main restrictions for additional use of forest chips were: too high price of forest chips; lack of suppliers and/or uncertainty of deliveries; technical problems of reception and processing of forest chips; insufficiency of boiler output especially in winter; and unsatisfactory quality of chips. The price of forest chips becomes relatively high because wood biomass used for production of forest chips has to be collected from wide area. Heavy equipment has to be used even though small fragments of wood are processed, which increases the price of chips. It is essential for forest chips that the costs can be pressed down because competition with fossil fuels, peat and industrial wood residues is hard. Low market price leads to the situation in which forest owner gets no price of the raw material, the entrepreneurs operate at the limit of profitability and renovation of machinery is difficult, and forest chips suppliers have to sell the chips at prime costs. Price of forest chips has decreased significantly during the past decade. Nominal price of forest chips is now lower than two decades ago. The real price of chips has decreased even more than the nominal price, 35% during the past decade and 20% during the last five years. Chips, made of small diameter wood, are expensive because the price includes the felling costs and harvesting is carried out at thinning lots. Price is especially high if chips are made of delimbed small diameter wood due to increased the work and reduced amount of chips. The price of logging residue chips is most profitable because cutting does not cause additional costs. Recovery of chips is

  16. Stone as material for production of chipped artifacts in Early and Middle Neolithic of Serbia

    Directory of Open Access Journals (Sweden)

    Šarić Josip A.

    2002-01-01

    Full Text Available In this work we studied artifacts from 20 Early and Middle Neolithic sites in Serbia. Stone used as raw material for production of chipped tools are defined and we pointed to inadequate usage of certain terms. By using of the data from geologic literature and statistical analysis of representation of certain stone at distinct sites we present assumption about location of primary occurrence of so called "Balkan flint" and obsidian in the territory of Serbia.

  17. METAL CHIP HEATING PROCESS INVESTIGATION (Part I

    Directory of Open Access Journals (Sweden)

    O. M. Dyakonov

    2007-01-01

    Full Text Available The main calculation methods for heat- and mass transfer in porous heterogeneous medium have been considered. The paper gives an evaluation of the possibility to apply them for calculation of metal chip heating process. It has been shown that a description of transfer processes in a chip has its own specific character that is attributed to difference between thermal and physical properties of chip material and lubricant-coolant components on chip surfaces. It has been determined that the known expressions for effective heat transfer coefficients can be used as basic ones while approaching mutually penetrating continuums. A mathematical description of heat- and mass transfer in chip medium can be considered as a basis of mathematical modeling, numerical solution and parameter optimization of the mentioned processes.

  18. Research of Dielectric Breakdown Micro fluidic Sampling Chip

    International Nuclear Information System (INIS)

    Jiang, F.; Lei, Y.; Yu, J.

    2013-01-01

    Micro fluidic chip is mainly driven electrically by external electrode and array electrode, but there are certain disadvantages in both of ways, which affect the promotion and application of micro fluidic technology. This paper discusses a scheme that uses the conductive solution in a microchannel made by PDMS, replacing electrodes and the way of dielectric breakdown to achieve microfluidic chip driver. It could reduce the driving voltage and simplify the chip production process. To prove the feasibility of this method, we produced a micro fluidic chip used in PDMS material with the lithography technology and experimented it. The results showed that using the dielectric breakdown to achieve microfluidic chip driver is feasible, and it has certain application prospect.

  19. NREL Patents Method for Continuous Monitoring of Materials During

    Science.gov (United States)

    Manufacturing | News | NREL NREL Patents Method for Continuous Monitoring of Materials During Manufacturing News Release: NREL Patents Method for Continuous Monitoring of Materials During Manufacturing NREL's Energy Systems Integration Facility (ESIF). More information, including the published patent, can

  20. Biostability of an implantable glucose sensor chip

    Science.gov (United States)

    Fröhlich, M.; Birkholz, M.; Ehwald, K. E.; Kulse, P.; Fursenko, O.; Katzer, J.

    2012-12-01

    Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and Ra roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

  1. Biostability of an implantable glucose sensor chip

    International Nuclear Information System (INIS)

    Fröhlich, M; Ehwald, K E; Kulse, P; Fursenko, O; Katzer, J; Birkholz, M

    2012-01-01

    Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO 2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and R a roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

  2. Pelly Crossing wood chip boiler

    Energy Technology Data Exchange (ETDEWEB)

    1985-03-11

    The Pelly wood chip project has demonstrated that wood chips are a successful fuel for space and domestic water heating in a northern climate. Pelly Crossing was chosen as a demonstration site for the following reasons: its extreme temperatures, an abundant local supply of resource material, the high cost of fuel oil heating and a lack of local employment. The major obstacle to the smooth operation of the boiler system was the poor quality of the chip supply. The production of poor quality chips has been caused by inadequate operation and maintenance of the chipper. Dull knives and faulty anvil adjustments produced chips and splinters far in excess of the one centimetre size specified for the system's design. Unanticipated complications have caused costs of the system to be higher than expected by approximately $15,000. The actual cost of the project was approximately $165,000. The first year of the system's operation was expected to accrue $11,600 in heating cost savings. This estimate was impossible to confirm given the system's irregular operation and incremental costs. Consistent operation of the system for a period of at least one year plus the installation of monitoring devices will allow the cost effectiveness to be calculated. The wood chip system's impact on the environment was estimated to be minimal. Wood chip burning was considered cleaner and safer than cordwood burning. 9 refs., 6 figs., 6 tabs.

  3. Pavement system with rubber tire chips in subgrade

    Energy Technology Data Exchange (ETDEWEB)

    Ashtakala, B.; Hoque, A.K.M.M. [Concordia Univ., Montreal, PQ (Canada). Dept. of Civil Engineering

    1995-12-31

    A pavement design method was developed in which shredded rubber tire chips mixed with sand were used as a material for pavement subgrade. Rubber tire chips are highly compressible and produce both elastic and plastic deformations under the application of loads. Sand was added to fill the void between the tire chips and make the mixture a strong material. The design method considered the vertical compressive strain produced by the design life traffic load 18k (80 KN) repetitions. The equivalent thicknesses of the layers above the subgrade corresponding to this vertical compressive strain were determined using contour charts. From this equivalent thickness, the thicknesses for asphalt pavement, base, and sub-base were determined by Odemark`s method. 3 refs., 1 tab., 3 figs.

  4. The extended Beer-Lambert theory for ray tracing modeling of LED chip-scaled packaging application with multiple luminescence materials

    Science.gov (United States)

    Yuan, Cadmus C. A.

    2015-12-01

    Optical ray tracing modeling applied Beer-Lambert method in the single luminescence material system to model the white light pattern from blue LED light source. This paper extends such algorithm to a mixed multiple luminescence material system by introducing the equivalent excitation and emission spectrum of individual luminescence materials. The quantum efficiency numbers of individual material and self-absorption of the multiple luminescence material system are considered as well. By this combination, researchers are able to model the luminescence characteristics of LED chip-scaled packaging (CSP), which provides simple process steps and the freedom of the luminescence material geometrical dimension. The method will be first validated by the experimental results. Afterward, a further parametric investigation has been then conducted.

  5. Covering of milled peat stockpile with wood chips; Jyrsinturveauman peittaeminen hakkeella

    Energy Technology Data Exchange (ETDEWEB)

    Franssila, T.; Leinonen, A.

    1996-12-31

    The aim of this project is to research the applicability of wooden materials for protection of milled peat stockpile against losses during storaging. Water transmission features of sawdust, wastewood chip and whole tree chip were investigated in laboratory with raining experiments. The plan for raining experiments was made with experiment planning program and results were analysed with multivariate analysis. Freezing features were investigated thorough breaking tests with hydraulic piston vice. Laboratory experiments were completed with field tests in Laakasuo near Sotkamo. On the basis of results covering peat stockpiles with sawdust is fully competitive comparing to present covering methods. Chip materials are technically not as good covering materials as sawdust

  6. Lab-on a-Chip

    Science.gov (United States)

    1999-01-01

    Labs on chips are manufactured in many shapes and sizes and can be used for numerous applications, from medical tests to water quality monitoring to detecting the signatures of life on other planets. The eight holes on this chip are actually ports that can be filled with fluids or chemicals. Tiny valves control the chemical processes by mixing fluids that move in the tiny channels that look like lines, connecting the ports. Scientists at NASA's Marshall Space Flight Center (MSFC) in Huntsville, Alabama designed this chip to grow biological crystals on the International Space Station (ISS). Through this research, they discovered that this technology is ideally suited for solving the challenges of the Vision for Space Exploration. For example, thousands of chips the size of dimes could be loaded on a Martian rover looking for biosignatures of past or present life. Other types of chips could be placed in handheld devices used to monitor microbes in water or to quickly conduct medical tests on astronauts. The portable, handheld Lab-on-a Chip Application Development Portable Test System (LOCAD-PTS) made its debut flight aboard Discovery during the STS-116 mission launched December 9, 2006. The system allowed crew members to monitor their environment for problematic contaminants such as yeast, mold, and even E.coli, and salmonella. Once LOCAD-PTS reached the ISS, the Marshall team continued to manage the experiment, monitoring the study from a console in the Payload Operations Center at MSFC. The results of these studies will help NASA researchers refine the technology for future Moon and Mars missions. (NASA/MSFC/D.Stoffer)

  7. The Impact Of Surface Shape Of Chip-Breaker On Machined Surface

    Science.gov (United States)

    Šajgalík, Michal; Czán, Andrej; Martinček, Juraj; Varga, Daniel; Hemžský, Pavel; Pitela, David

    2015-12-01

    Machined surface is one of the most used indicators of workpiece quality. But machined surface is influenced by several factors such as cutting parameters, cutting material, shape of cutting tool or cutting insert, micro-structure of machined material and other known as technological parameters. By improving of these parameters, we can improve machined surface. In the machining, there is important to identify the characteristics of main product of these processes - workpiece, but also the byproduct - the chip. Size and shape of chip has impact on lifetime of cutting tools and its inappropriate form can influence the machine functionality and lifetime, too. This article deals with elimination of long chip created when machining of shaft in automotive industry and with impact of shape of chip-breaker on shape of chip in various cutting conditions based on production requirements.

  8. Rapid Construction of Fe-Co-Ni Composition-Phase Map by Combinatorial Materials Chip Approach.

    Science.gov (United States)

    Xing, Hui; Zhao, Bingbing; Wang, Yujie; Zhang, Xiaoyi; Ren, Yang; Yan, Ningning; Gao, Tieren; Li, Jindong; Zhang, Lanting; Wang, Hong

    2018-03-12

    One hundred nanometer thick Fe-Co-Ni material chips were prepared and isothermally annealed at 500, 600, and 700 °C, respectively. Pixel-by-pixel composition and structural mapping was performed by microbeam X-ray at synchrotron light source. Diffraction images were recorded at a rate of 1 pattern/s. The XRD patterns were automatically processed, phase-identified, and categorized by hierarchical clustering algorithm to construct the composition-phase map. The resulting maps are consistent with corresponding isothermal sections reported in the ASM Alloy Phase Diagram Database, verifying the effectiveness of the present approach in phase diagram construction.

  9. Forecasting forest chip energy production in Finland 2008-2014

    International Nuclear Information System (INIS)

    Linden, Mikael

    2011-01-01

    Energy policy measures aim to increase energy production from forest chips in Finland to 10 TWh by year 2010. However, on the regional level production differences are large, and the regional estimates of the potential base of raw materials for the production of forest chips are heterogeneous. In order to analyse the validity of the above target, two methods are proposed to derive forecasts for region-level energy production from forest chips in Finland in the years 2008-2014. The plant-level data from 2003-2007 gives a starting point for a detailed statistical analysis of present and future region-level forest chip production. Observed 2008 regional levels are above the estimated prediction 95% confidence intervals based on aggregation of plant-level time averages. A simple time trend model with fixed-region effects provides accurate forecasts for the years 2008-2014. Forest chip production forecast confidence intervals cover almost all regions for the 2008 levels and the estimates of potential production levels for 2014. The forecast confidence intervals are also derived with re-sampling methods, i.e. with bootstrap methods, to obtain more reliable results. Results confirm that a general materials shortfall is not expected in the near future for forest chip energy production in Finland.

  10. The recycling through melting machining chips: preliminary results

    Energy Technology Data Exchange (ETDEWEB)

    Pereira, Luiz A.T.; Rossi, Jesualdo L., E-mail: luiz.atp@uol.com.br, E-mail: jelrossi@ipen.br [Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil). Centro de Ciência e Tecnologia de Materiais

    2017-07-01

    PWR (Pressurized Water Reactor) reactors employ as nuclear fuel UO{sub 2} pellets packed in zirconium alloy tubes, called cladding. In the manufacture of the tubes, machining chips are generated which cannot be discarded, since the recycling of this material is strategic in terms of nuclear technology, legislation, economics and the environment. These nuclear alloys are very expensive and are not produced in Brazil and are imported for the manufacture of nuclear fuel. In this work, it will examined methods not yet studied to recycle Zircaloy chips using electron beam furnace in order to obtain ingots. In addition, it is intended to carry out the melting of new Zircaloy alloys, from the melting of zirconium sponge obtained in IPEN and imported and Zircaloy bars. The mechanical properties and the present phases of the material should be determined, as well as, the characterization of the microstructures by optical microscopy. This work, therefore, aims at the creation of a new line of research where methods will be approached to recycle the Zircaloy chips and to reduce in 30 times the volume by means of melting the enormous amount of material stored in the form of machining chips, being able to do others components for nuclear or chemical industry use, as well as conducting basic development research. (author)

  11. Firing with wood chips in heating and cogeneration plants

    International Nuclear Information System (INIS)

    Kofman, P.D.

    1992-01-01

    The document was produced for use as detailed teaching material aimed at spreading information on the use of wood chips as fuel for heating and cogeneration plants. It includes information and articles on wood fuels generally, combustion values, chopping machines, suppliers, occupational health hazards connected with the handling of wood chips, measuring amounts, the selection of types, prices, ash, environmental aspects and information on the establishment of a wood-chip fired district heating plant. (AB)

  12. On-chip power delivery and management

    CERN Document Server

    Vaisband, Inna P; Popovich, Mikhail; Mezhiba, Andrey V; Köse, Selçuk; Friedman, Eby G

    2016-01-01

    This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

  13. Industry trends in chip storage and handling

    Science.gov (United States)

    Tim McDonald; Alastair Twaddle

    2000-01-01

    A survey was conducted of US pulp and paper mills to characterize chip pile management trends. The survey was developed by members of the TAPPI Fiber Raw Material Supply Committee and mailed out in December of 1999. There were a total of 80 respondents to the survey. A typical mill was foudn to maintain one sofhvood and one hardwood chip pile, with maximum inventory of...

  14. Fundamental investigation on influence of external heat on chip formation during thermal assisted machining

    Science.gov (United States)

    Alkali, A. U.; Ginta, T. L.; Abdulrani, A. M.; Elsiti, N. M.

    2018-04-01

    Various heat sources have been investigated by numerous researchers to reveal machinability benefits of thermally assisted machining (TAM) process. Fewer engineering materials have been tested. In the same vein, those researches continue to demonstrate effective performance of TAM in terms of bulk material removal rate, improved surface finish, prolong tool life and reduction of cutting forces among others. Experimental investigation on the strain-hardenability and flow stress of material removed with respect to increase in temperature in TAM has not been given attention in previous studies. This study investigated the pattern of chip morphology and segmentation giving close attention to influence of external heat source responsible for strain – hardenability of the material removed during TAM and dry machining at room temperature. Full immersion down cut milling was used throughout the machining conditions. Machining was conducted on AISI 316L using uncoated tungsten carbide end mill insert at varying cutting speeds (V) of 50, 79, and 100 m/min, and feed rates (f) of 0.15, 0.25, and 0.4 mm/tooth while the depth of cut was maintained at 0.2mm throughout the machining trials. The analyses of chip formation, segmentations and stain hardenability were carried out by using LMU light microscope, field emission microscopy and micro indentation. The study observed that build up edge is formed when a stagnation zone develops in front of tool tip which give rise to poor thermal gradient for conduction heat to be transferred within the bulk material during dry machining. This promotes varying strain – hardening of the material removed with evident high chips hardness and thickness, whereas TAM circumvents such impairment by softening the shear zone through local preheat.

  15. Timber Chips as the Insulation Material for Energy Saving in Prefabricated Offices

    Directory of Open Access Journals (Sweden)

    Yupeng Wang

    2016-06-01

    Full Text Available This research demonstrates the feasibility of a roof insulation method for prefabricated offices that uses vinyl packed timber chips to reduce air conditioning loads (hereinafter referred to as AC loads and which also improves indoor thermal comfort. The advantages of the new roof insulation method were revealed through comparing the impacts of four roof types on prefabricated offices. The AC load and indoor thermal comfort (surface temperature and air temperature were evaluated. The disposal of scrap timber discarded from building construction projects is costing money, and is also a waste of natural resources. The assessment of a new roof insulation method with timber chips demonstrates the advanced usage of timber chips, reducing the environmental load in the building construction process. On the other hand, since prefabricated offices have lower thermal storage capacities and are less airtight than RC (reinforced concrete or S (steel structured buildings, the AC load consumption and indoor thermal comfort exacerbation in prefabricated offices is more serious. Especially in summer, a large amount of solar energy absorption from the roof raises the indoor air temperature and significantly increases the cooling load. This research contributes to the environmental design for prefabricated offices, and develops a method for the reuse of wood chips.

  16. Mastering multi-depth bio-chip patterns with DVD LBRs

    Science.gov (United States)

    Carson, Doug

    2017-08-01

    Bio chip and bio disc are rapidly growing technologies used in medical, health and other industries. While there are numerous unique designs and features, these products all rely on precise three-dimensional micro-fluidic channels or arrays to move, separate and combine samples under test. These bio chip and bio disc consumables are typically manufactured by molding these parts to a precise three-dimensional pattern on a negative metal stamper, or they can be made in smaller quantities using an appropriate curable resin and a negative mold/stamper. Stampers required for bio chips have been traditionally made using either micro machining or XY stepping lithography. Both of these technologies have their advantages as well as limitations when it comes to creating micro-fluidic patterns. Significant breakthroughs in continuous maskless lithography have enabled accurate and efficient manufacturing of micro-fluidic masters using LBRs (Laser Beam Recorders) and DRIE (Deep Reactive Ion Etching). The important advantages of LBR continuous lithography vs. XY stepping lithography and micro machining are speed and cost. LBR based continuous lithography is >100x faster than XY stepping lithography and more accurate than micro machining. Several innovations were required in order to create multi-depth patterns with sub micron accuracy. By combining proven industrial LBRs with DCA's G3-VIA pattern generator and DRIE, three-dimensional bio chip masters and stampers are being manufactured efficiently and accurately.

  17. Toxicity of invert drilling muds composted with wood/bark chips

    Energy Technology Data Exchange (ETDEWEB)

    Bessie, K. [EBA Engineering Consultants Ltd., Calgary, AB (Canada)

    2006-07-01

    Since the early to mid 1990s, many companies have composted invert (diesel) drilling muds with wood chips/bark chips in the green (forestry) zone as a method of drilling mud treatment. This presentation addressed the toxicity of invert drilling muds composted with wood/bark chips and provided some background on composted invert drilling mud (CIDM). EBA Engineering monitored 22 third-party sites in 2002, some of which were biopiles, and others land treatment areas (LTAs). Active treatment started between 1995 and 1999 and some LTAs were seeded with varying degrees of success. Composted materials had hydrocarbon odour and staining and were very moist. Materials exceeded Alberta Environment guidelines for petroleum hydrocarbons (PHCs) and sometimes barium. Most sites were within areas that had forestry production/wildlife as end land use. Receptors included plants, soil invertebrates by soil contact, and wildlife by ingestion. Stakeholder meetings were held for their input and an ecotoxicity study was developed. Material tested, tests and species used as well as results of the ecotoxicity study were presented. A comparison of results to other EBA composting studies was also given. It was concluded that CIDM affects the reproduction of earthworms and springtails, and plant growth; wood/barks chips themselves can be ecotoxic; and, other compost studies with finely ground sawdust and no bark chips had less ecotoxicity. tabs., figs.

  18. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  19. Ultrahigh-speed hybrid laser for silicon photonic integrated chips

    DEFF Research Database (Denmark)

    Chung, Il-Sug; Park, Gyeong Cheol; Ran, Qijiang

    2013-01-01

    Increasing power consumption for electrical interconnects between and inside chips is posing a real challenge to continue the performance scaling of processors/computers as predicted by D. Moore. In recent processors, energy consumption for electrical interconnects is half of power supplied...... and will be 80% in near future. This challenge strongly has motivated replacing electrical interconnects with optical ones even in chip level communications [1]. This chip-level optical interconnects need quite different performance of optoelectronic devices than required for conventional optical communications....... For a light source, the energy consumption per sending a bit is required to be

  20. Silicon Chip-to-Chip Mode-Division Multiplexing

    DEFF Research Database (Denmark)

    Baumann, Jan Markus; Porto da Silva, Edson; Ding, Yunhong

    2018-01-01

    A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes.......A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes....

  1. Experiment list: SRX620297 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available body=Pol II (Santa Cruz Biotechnology, N20, sc-899) http://dbarchive.biosciencedb...IP-Seq source_name=NIH3T3 fibroblasts || culture condition=continuous culture || chemicals=DMSO || chip anti

  2. Analysis of Large-Strain Extrusion Machining with Different Chip Compression Ratios

    Directory of Open Access Journals (Sweden)

    Wen Jun Deng

    2012-01-01

    Full Text Available Large-Strain Extrusion Machining (LSEM is a novel-introduced process for deforming materials to very high plastic strains to produce ultra-fine nanostructured materials. Before the technique can be exploited, it is important to understand the deformation behavior of the workpiece and its relationship to the machining parameters and friction conditions. This paper reports finite-element method (FEM analysis of the LSEM process to understand the evolution of temperature field, effective strain, and strain rate under different chip compression ratios. The cutting and thrust forces are also analyzed with respect to time. The results show that LSEM can produce very high strains by changing in the value of chip compression ratio, thereby enabling the production of nanostructured materials. The shape of the chip produced by LSEM can also be geometrically well constrained.

  3. On-chip spectroscopy with thermally tuned high-Q photonic crystal cavities

    Energy Technology Data Exchange (ETDEWEB)

    Liapis, Andreas C., E-mail: andreas.liapis@gmail.com; Gao, Boshen; Siddiqui, Mahmudur R. [The Institute of Optics, University of Rochester, Rochester, New York 14627 (United States); Shi, Zhimin [Department of Physics, University of South Florida, Tampa, Florida 33620 (United States); Boyd, Robert W. [The Institute of Optics, University of Rochester, Rochester, New York 14627 (United States); Department of Physics and School of Electrical Engineering and Computer Science, University of Ottawa, Ottawa, Ontario K1N 6N5 (Canada)

    2016-01-11

    Spectroscopic methods are a sensitive way to determine the chemical composition of potentially hazardous materials. Here, we demonstrate that thermally tuned high-Q photonic crystal cavities can be used as a compact high-resolution on-chip spectrometer. We have used such a chip-scale spectrometer to measure the absorption spectra of both acetylene and hydrogen cyanide in the 1550 nm spectral band and show that we can discriminate between the two chemical species even though the two materials have spectral features in the same spectral region. Our results pave the way for the development of chip-size chemical sensors that can detect toxic substances.

  4. Self-Organized Construction with Continuous Building Material

    DEFF Research Database (Denmark)

    Heinrich, Mary Katherine; Wahby, Mostafa; Divband Soorati, Mohammad

    2016-01-01

    Self-organized construction with continuous, structured building material, as opposed to modular units, offers new challenges to the robot-based construction process and lends the opportunity for increased flexibility in constructed artifact properties, such as shape and deformation. As an example...... investigation, we look at continuous filaments organized into braided structures, within the context of bio-hybrids constructing architectural artifacts. We report the result of an early swarm robot experiment. The robots successfully constructed a braid in a self-organized process. The construction process can...... be extended by using different materials and by embedding sensors during the self-organized construction directly into the braided structure. In future work, we plan to apply dedicated braiding robot hardware and to construct sophisticated 3-d structures with local variability in patterns of filament...

  5. MOISTURE HUMIDITY EQUILIBRIUM OF WOOD CHIPS FROM ENERGETIC CROPS

    Directory of Open Access Journals (Sweden)

    Jan Barwicki

    2008-09-01

    Full Text Available Processes occurring during storage of wood chips for energetic or furniture industry purposes were presented. As a result of carried out investigations, dependences of temperature and relative humidity changes of surrounding air were shown. Modified Henderson equation can be utilized for computer simulation of storing and drying processes concerning wood chips for energetic and furniture industry purposes. It reflects also obtained results from experiments carried out with above mentioned material. Using computer simulation program we can examine different wood chips storing conditions to avoid overheating and loss problems.

  6. Wood chip delivery and research project at Mikkeli region

    International Nuclear Information System (INIS)

    Saksa, T.; Auvinen, P.

    1995-01-01

    In 1994, a large-scale energywood production chain was started as a co-operation project by the Mikkeli city forest office and local forestry societies. Over 60 000 m 3 (about 46 000 MWh of energy) of forest processed chips were delivered to Pursiala heat and power plant in Mikkeli. About 60 % of these chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 51 FIM/m 3 (68 FIM/MWh) for the whole tree chips and 40 FIM/m 3 (53 FIM/MWh) for logging waste chips. The delivery costs of wood chips could compete with those of fuel peat only in the most favourable cases. The resources of forest processed chips were studied on the basis of forestry plans. According to the study, there is enough raw material for permanent, large-scale delivery of forest processed chips (up to 250 000 m 3 /a) in the forests located at a distance of under 40 road kilometers from the Pursiala heat and power plant. The following project stages will involve further development of the wood chip delivery chain logistics, as well as improvement of logging and chipping equipment and methods in energywood and logging waste production. Also the effects of wood energy production on the economy and environment of the whole Mikkeli region will be studied. (author)

  7. Continuous spray forming of functionally gradient materials

    International Nuclear Information System (INIS)

    McKechnie, T.N.; Richardson, E.H.

    1995-01-01

    Researchers at Plasma Processes Inc. have produced a Functional Gradient Material (FGM) through advanced vacuum plasma spray processing for high heat flux applications. Outlined in this paper are the manufacturing methods used to develop a four component functional gradient material of copper, tungsten, boron, and boron nitride. The FGM was formed with continuous gradients and integral cooling channels eliminating bondlines and providing direct heat transfer from the high temperature exposed surface to a cooling medium. Metallurgical and x-ray diffraction analyses of the materials formed through innovative VPS (vacuum plasma spray) processing are also presented. Applications for this functional gradient structural material range from fusion reactor plasma facing components to missile nose cones to boilers

  8. Radioactivity changes during burning of peat and chip

    International Nuclear Information System (INIS)

    Hedvall, R.; Erlandsson, B.; Mattsson, S.

    1985-01-01

    The increasing use of peat and chip as fuel materials in fossil-fuel power plants has resulted in the need for information about the change in radionuclides concentration in fuel after combustion. The paper describes a study of natural radionuclides from the uranium- and the thorium series and 40 K, as well as fission products from atmospheric nuclear explosions, in ashes from five peat and chip fuelled power plants in Sweden

  9. Chipping operations and efficiency in different operational environments

    Energy Technology Data Exchange (ETDEWEB)

    Roeser, D.; Mola-Yudego, B.; Prinz, R.; Emer, B.; Sikanen, L., e-mail: dominik.roser@metla.fi

    2012-11-01

    This research analyses the productivity of energy wood chipping operations at several sites in Austria and Finland. The aim of the work is to examine the differences in productivity and the effects of the operational environment for the chipping of bioenergy at the roadside. Furthermore, the study quantifies the effects of different variables such as forest energy assortments, tree species, sieve size and machines on the overall productivity of chipping. The results revealed that there are significant differences in the chipping productivity in Austria and Finland which are largely based on the use of different sieve sizes. Furthermore, the different operational environments in both countries, as well as the characteristics of the raw material also seem to have an effect on productivity. In order to improve the chipping productivity, particularly in Central European conditions, all relevant stakeholders need to work jointly to find solutions that will allow a greater variation of chip size. Furthermore, in the future more consideration has to be given to the close interlinkage between the chipper, crane and grapple. As a result, investments costs can be optimized and operational costs and stress on the machines reduced. (orig.)

  10. Interfacing Lab-on-a-Chip Embryo Technology with High-Definition Imaging Cytometry.

    Science.gov (United States)

    Zhu, Feng; Hall, Christopher J; Crosier, Philip S; Wlodkowic, Donald

    2015-08-01

    To spearhead deployment of zebrafish embryo biotests in large-scale drug discovery studies, automated platforms are needed to integrate embryo in-test positioning and immobilization (suitable for high-content imaging) with fluidic modules for continuous drug and medium delivery under microperfusion to developing embryos. In this work, we present an innovative design of a high-throughput three-dimensional (3D) microfluidic chip-based device for automated immobilization and culture and time-lapse imaging of developing zebrafish embryos under continuous microperfusion. The 3D Lab-on-a-Chip array was fabricated in poly(methyl methacrylate) (PMMA) transparent thermoplastic using infrared laser micromachining, while the off-chip interfaces were fabricated using additive manufacturing processes (fused deposition modelling and stereolithography). The system's design facilitated rapid loading and immobilization of a large number of embryos in predefined clusters of traps during continuous microperfusion of drugs/toxins. It was conceptually designed to seamlessly interface with both upright and inverted fluorescent imaging systems and also to directly interface with conventional microtiter plate readers that accept 96-well plates. Compared with the conventional Petri dish assays, the chip-based bioassay was much more convenient and efficient as only small amounts of drug solutions were required for the whole perfusion system running continuously over 72 h. Embryos were spatially separated in the traps that assisted tracing single embryos, preventing interembryo contamination and improving imaging accessibility.

  11. Flip chip assembly of thinned chips for hybrid pixel detector applications

    International Nuclear Information System (INIS)

    Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

  12. Continuous Materiality: Through a Hierarchy of Computational Codes

    Directory of Open Access Journals (Sweden)

    Jichen Zhu

    2008-01-01

    Full Text Available The legacy of Cartesian dualism inherent in linguistic theory deeply influences current views on the relation between natural language, computer code, and the physical world. However, the oversimplified distinction between mind and body falls short of capturing the complex interaction between the material and the immaterial. In this paper, we posit a hierarchy of codes to delineate a wide spectrum of continuous materiality. Our research suggests that diagrams in architecture provide a valuable analog for approaching computer code in emergent digital systems. After commenting on ways that Cartesian dualism continues to haunt discussions of code, we turn our attention to diagrams and design morphology. Finally we notice the implications a material understanding of code bears for further research on the relation between human cognition and digital code. Our discussion concludes by noticing several areas that we have projected for ongoing research.

  13. Estimate the thermomechanical fatigue life of two flip chip packages

    International Nuclear Information System (INIS)

    Pash, R.A.; Ullah, H.S.; Khan, M.Z.

    2005-01-01

    The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

  14. THE LINE FOR PRODUCTION OF DRIED APPLES, PEARS, CARROTS, PUMPKIN AND CHIPS

    Directory of Open Access Journals (Sweden)

    G. V. Kalashnikov

    2015-01-01

    Full Text Available The line is intended for processing of fruit and vegetable raw materials and receiving dried apples, pears, carrots, pumpkins and the fruit-and-vegetable of chips. The line solves problems of improvement of quality of a ready-made product and thermal production efficiency due to more rational alternation of the technological modes of a moisture increment and dehumidification with high extent of use of an energy potential of the heat carrier, use of the inert heat carrier (steam identical by the form for technological thermal processes, decrease in specific energy consumption and metal consumption, and also an intensification of moisture evaporation and creation of the compact multipurpose technological line for production of fruit and vegetable products with the expanded range. The technological production line of dried apples, pears, carrots, pumpkin and fruit and vegetable chips contains the jet washer, the inspection conveyor, the size grader, the car for removal of a seed nest and the device are sharp fruits and vegetables on plates, the sulfiter, the dryer and the packing automatic packing machine. Thus the line contains the combined toroidal device for heatmoisture of handling continuous action divided into sections: section of heating of raw materials, section of convective drying, section of preliminary hydration, which is located between microwave drying sections, and the section of cooling of the dried-up product intended for bringing a product to final readiness. The equipment complex from the drum car with the washing block and multipurpose installation with crushing of raw materials and office of sunflower seeds taking into account raw materials type is provided in lines. Are used recirculation a contour, the heating of the initial raw material fulfilled after drying of pairs and a condensate in the closed contour for creation energy-saving of the "know-how" of a ready product. The line represents modular blocks and is recustomized

  15. On-chip photonic integrated circuit structures for millimeter and terahertz wave signal generation

    NARCIS (Netherlands)

    Gordón, C.; Guzmán, R. C.; Corral, V.; Carpintero, G.; Leijtens, X.

    2015-01-01

    We present two different on-chip photonic integrated circuit (PIC) structures for continuous-wave generation of millimeter and terahertz waves, each one using a different approach. One approach is the optical heterodyne method, using an on-chip arrayed waveguide grating laser (OC-AWGL) which is

  16. Impact of high-pressure coolant supply on chip formation in milling

    Science.gov (United States)

    Klocke, F.; Döbbeler, B.; Lakner, T.

    2017-10-01

    Machining of titanium alloys is considered as difficult, because of their high temperature strength, low thermal conductivity and low E-modulus, which contributes to high mechanical loads and high temperatures in the contact zone between tool and workpiece. The generated heat in the cutting zone can be dissipated only in a low extent. When cutting steel materials, up to 75% of the process heat is transported away by the chips, contrary to only 25% when machining titanium alloys. As a result, the cutting tool heats up, which leads to high tool wear. Therefore, machining of titanium alloys is only possible with relatively low cutting speeds. This leads to low levels of productivity for milling processes with titanium alloys. One way to increase productivity is to use more cutting edges in tools with the same diameter. However, the limiting factor of adding more cutting edges to a milling tool is the minimum size of the chip spaces, which are sufficient for a stable chip evacuation. This paper presents experimental results on the chip formation and chip size influenced by high-pressure coolant supply, which can lead to smaller chips and to smaller sizes of the chip spaces, respectively. Both influences, the pressure of the supplied coolant and the volumetric flow rate were individually examined. Alpha-beta annealed titanium TiAl6V4 was examined in relation to the reference material quenched and tempered steel 42CrMo4+QT (AISI 4140+QT). The work shows that with proper chip control due to high-pressure coolant supply in milling, the number of cutting edges on the same diameter tool can be increased, which leads to improved productivity.

  17. Chip-Level Electromigration Reliability for Cu Interconnects

    International Nuclear Information System (INIS)

    Gall, M.; Oh, C.; Grinshpon, A.; Zolotov, V.; Panda, R.; Demircan, E.; Mueller, J.; Justison, P.; Ramakrishna, K.; Thrasher, S.; Hernandez, R.; Herrick, M.; Fox, R.; Boeck, B.; Kawasaki, H.; Haznedar, H.; Ku, P.

    2004-01-01

    Even after the successful introduction of Cu-based metallization, the electromigration (EM) failure risk has remained one of the most important reliability concerns for most advanced process technologies. Ever increasing operating current densities and the introduction of low-k materials in the backend process scheme are some of the issues that threaten reliable, long-term operation at elevated temperatures. The traditional method of verifying EM reliability only through current density limit checks is proving to be inadequate in general, or quite expensive at the best. A Statistical EM Budgeting (SEB) methodology has been proposed to assess more realistic chip-level EM reliability from the complex statistical distribution of currents in a chip. To be valuable, this approach requires accurate estimation of currents for all interconnect segments in a chip. However, no efficient technique to manage the complexity of such a task for very large chip designs is known. We present an efficient method to estimate currents exhaustively for all interconnects in a chip. The proposed method uses pre-characterization of cells and macros, and steps to identify and filter out symmetrically bi-directional interconnects. We illustrate the strength of the proposed approach using a high-performance microprocessor design for embedded applications as a case study

  18. Research Progress of Microfluidic Chips Preparation and its Optical Element

    Directory of Open Access Journals (Sweden)

    Feng WANG

    2014-03-01

    Full Text Available Microfluidic technology is the emerging technologies in researching fluid channel and related applications in the micro and nano-scale space. Microfluidic chip is a new miniaturized rapid analysis platform by microfluidic technology, it has many characteristics such as liquid flow control, minimal reagent consumption, rapid analysis, which is widely used in physics, chemistry, biology, and engineering science and other fields, it has strong interdisciplinary. This paper mainly discusses research progress of materials used for microfluidic chips and the devices based on microfluidic technology, including microfluidic chip, microfluidic optical devices, microfluidic laser preparation, microfluidic chip applications, focusing on the quasi-molecular laser processing technology and femtosecond laser processing technology in the microfluidic devices preparation, and make development prospects for it.

  19. Cerenkov radiation imaging as a method for quantitative measurements of beta particles in a microfluidic chip

    International Nuclear Information System (INIS)

    Cho, Jennifer S; Taschereau, Richard; Olma, Sebastian; Liu Kan; Chen Yichun; Shen, Clifton K-F; Van Dam, R Michael; Chatziioannou, Arion F

    2009-01-01

    It has been observed that microfluidic chips used for synthesizing 18 F-labeled compounds demonstrate visible light emission without nearby scintillators or fluorescent materials. The origin of the light was investigated and found to be consistent with the emission characteristics from Cerenkov radiation. Since 18 F decays through the emission of high-energy positrons, the energy threshold for beta particles, i.e. electrons or positrons, to generate Cerenkov radiation was calculated for water and polydimethylsiloxane (PDMS), the most commonly used polymer-based material for microfluidic chips. Beta particles emitted from 18 F have a continuous energy spectrum, with a maximum energy that exceeds this energy threshold for both water and PDMS. In addition, the spectral characteristics of the emitted light from 18 F in distilled water were also measured, yielding a broad distribution from 300 nm to 700 nm, with higher intensity at shorter wavelengths. A photograph of the 18 F solution showed a bluish-white light emitted from the solution, further suggesting Cerenkov radiation. In this study, the feasibility of using this Cerenkov light emission as a method for quantitative measurements of the radioactivity within the microfluidic chip in situ was evaluated. A detector previously developed for imaging microfluidic platforms was used. The detector consisted of a charge-coupled device (CCD) optically coupled to a lens. The system spatial resolution, minimum detectable activity and dynamic range were evaluated. In addition, the calibration of a Cerenkov signal versus activity concentration in the microfluidic chip was determined. This novel method of Cerenkov radiation measurements will provide researchers with a simple yet robust quantitative imaging tool for microfluidic applications utilizing beta particles.

  20. Real-time studies of chemical reactions in lab-on-a-chip devices

    NARCIS (Netherlands)

    Brivio, M.

    2005-01-01

    The realization of a lab-on-a-chip system in which chemical reactions are carried out in a continuous flow mode and monitored on-line by a suitable analytical technique is the main topic of this thesis. Two types of a lab-on-a-chip were realized, both using mass spectrometry (MS) as the on-line

  1. Analysis of the Chip Geometry in Dry Machining of Aeronautical Aluminum Alloys

    Directory of Open Access Journals (Sweden)

    Francisco Javier Trujillo Vilches

    2017-01-01

    Full Text Available Aluminum alloys are widely used in the manufacturing of structural parts for aircraft, frequently in combination with other materials such as CFRP (Carbon Fiber Reinforced Polymer, to form FML (Fiber Metal Laminates structures (CFRP/Al. The dry machining of these structures presents several problems, some of which are related to chip evacuation, either when machining aluminum alloys as an isotropic material, or during hybridization with composites. In this work, a study of the way in which cutting parameters influence the chip morphology in the dry machining of UNS A97075-T6 (Al-Zn and UNS A92024-T3 (Al-Cu alloys, is performed. Thus, different geometric parameters of the chip morphology have been obtained, and their evolution with feed has been analysed. Finally, the different relationships which occur between these geometric parameters and feed, have been obtained. These relationships allow a prediction of the evolution of some of the geometric parameters of the chip, as a function of feed.

  2. Flip chip assembly of thinned chips for hybrid pixel detector applications

    CERN Document Server

    Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

    2014-01-01

    There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

  3. Generation of segmental chips in metal cutting modeled with the PFEM

    Science.gov (United States)

    Rodriguez Prieto, J. M.; Carbonell, J. M.; Cante, J. C.; Oliver, J.; Jonsén, P.

    2017-09-01

    The Particle Finite Element Method, a lagrangian finite element method based on a continuous Delaunay re-triangulation of the domain, is used to study machining of Ti6Al4V. In this work the method is revised and applied to study the influence of the cutting speed on the cutting force and the chip formation process. A parametric methodology for the detection and treatment of the rigid tool contact is presented. The adaptive insertion and removal of particles are developed and employed in order to sidestep the difficulties associated with mesh distortion, shear localization as well as for resolving the fine-scale features of the solution. The performance of PFEM is studied with a set of different two-dimensional orthogonal cutting tests. It is shown that, despite its Lagrangian nature, the proposed combined finite element-particle method is well suited for large deformation metal cutting problems with continuous chip and serrated chip formation.

  4. On-chip concentration of bacteria using a 3D dielectrophoretic chip and subsequent laser-based DNA extraction in the same chip

    International Nuclear Information System (INIS)

    Cho, Yoon-Kyoung; Kim, Tae-hyeong; Lee, Jeong-Gun

    2010-01-01

    We report the on-chip concentration of bacteria using a dielectrophoretic (DEP) chip with 3D electrodes and subsequent laser-based DNA extraction in the same chip. The DEP chip has a set of interdigitated Au post electrodes with 50 µm height to generate a network of non-uniform electric fields for the efficient trapping by DEP. The metal post array was fabricated by photolithography and subsequent Ni and Au electroplating. Three model bacteria samples (Escherichia coli, Staphylococcus epidermidis, Streptococcus mutans) were tested and over 80-fold concentrations were achieved within 2 min. Subsequently, on-chip DNA extraction from the concentrated bacteria in the 3D DEP chip was performed by laser irradiation using the laser-irradiated magnetic bead system (LIMBS) in the same chip. The extracted DNA was analyzed with silicon chip-based real-time polymerase chain reaction (PCR). The total process of on-chip bacteria concentration and the subsequent DNA extraction can be completed within 10 min including the manual operation time.

  5. Microfluidic "Pouch" Chips for Immunoassays and Nucleic Acid Amplification Tests.

    Science.gov (United States)

    Mauk, Michael G; Liu, Changchun; Qiu, Xianbo; Chen, Dafeng; Song, Jinzhao; Bau, Haim H

    2017-01-01

    Microfluidic cassettes ("chips") for processing and analysis of clinical specimens and other sample types facilitate point-of-care (POC) immunoassays and nucleic acid based amplification tests. These single-use test chips can be self-contained and made amenable to autonomous operation-reducing or eliminating supporting instrumentation-by incorporating laminated, pliable "pouch" and membrane structures for fluid storage, pumping, mixing, and flow control. Materials and methods for integrating flexible pouch compartments and diaphragm valves into hard plastic (e.g., acrylic and polycarbonate) microfluidic "chips" for reagent storage, fluid actuation, and flow control are described. We review several versions of these pouch chips for immunoassay and nucleic acid amplification tests, and describe related fabrication techniques. These protocols thus offer a "toolbox" of methods for storage, pumping, and flow control functions in microfluidic devices.

  6. Continuous fluid bed reactor for fissionable material

    International Nuclear Information System (INIS)

    Ziegler, D.L.

    1975-01-01

    Plutonium (Pu) purification and plutonium hexafluoride (PuF 6 ) formation are achieved on a continuous basis by feeding particulate material into one end of an elongated and horizontally disposed vessel having an upper section with generally converging side walls and a lower section with generally vertical side walls, compartmented throughout its length by transversely disposed baffles, so that particulate material flows through the vessel in vertical generally zigzag fashion, being fluidized by dispersing gas that enters the compartment from a lower narrow compartment and discharges through an upper widened compartment. Vaporous PuF 6 formed from a reaction between the dispersing gas and the particulate material discharges through the upper widened compartment and solid impurities discharge for collection through a port at a far or distal end of the elongated vessel. (U.S.)

  7. Genomic prediction of starch content and chipping quality in tetraploid potato using genotyping-by-sequencing

    DEFF Research Database (Denmark)

    Sverrisdóttir, Elsa; Byrne, Stephen; Nielsen, Ea Høegh Riis

    2017-01-01

    continue to fall. In this study, we have generated genomic prediction models for starch content and chipping quality in tetraploid potato to facilitate varietal development. Chipping quality was evaluated as the colour of a potato chip after frying following cold induced sweetening. We used genotyping...... genomic estimated breeding values. Cross-validated prediction correlations of 0.56 and 0.73 were obtained within the training population for starch content and chipping quality, respectively, while correlations were lower when predicting performance in the test panel, at 0.30–0.31 and 0...

  8. Making the invisible visible: a microfluidic chip using a low refractive index polymer.

    Science.gov (United States)

    Hanada, Yasutaka; Ogawa, Tatsuya; Koike, Kazuhiko; Sugioka, Koji

    2016-07-07

    Microfluidic frameworks known as micro-total-analysis-systems or lab-on-a-chip have become versatile tools in cell biology research, since functional biochips are able to streamline dynamic observations of various cells. Glass or polymers are generally used as the substrate due to their high transparency, chemical stability and cost-effectiveness. However, these materials are not well suited for the microscopic observation of cell migration at the fluid boundary due to the refractive index mismatch between the medium and the biochip material. For this reason, we have developed a new method of fabricating three-dimensional (3D) microfluidic chips made of the low refractive index fluoric polymer CYTOP. This novel fabrication procedure involves the use of a femtosecond laser for direct writing, followed by wet etching with a dilute fluorinated solvent and annealing, to create high-quality 3D microfluidic chips inside a polymer substrate. A microfluidic chip made in this manner enabled us to more clearly observe the flagellum motion of a Dinoflagellate moving in circles near the fluid surface compared to the observations possible using conventional microfluidic chips. We believe that CYTOP microfluidic chips made using this new method may allow more detailed analysis of various cell migrations near solid boundaries.

  9. Application of the MASSAHAKE-method for birch whole tree chips and for the production of raw material for mechanical pulp production; MASSAHAKE-menetelmaen soveltaminen koivulle sekae mekaanisen massan raaka-ainetuotantoon

    Energy Technology Data Exchange (ETDEWEB)

    Ahonen, M; Seppaenen, V; Nikala, L

    1997-12-31

    The objectives of this project for the year 1995 were: (1) To develop the grinding process in order to decrease the wood losses in grinder, (2) To find the connection between the initial values in the process and the quality of the pulp chips, (3) To find out the behaviour of chips from mixed tree species in the MASSAHAKE process, (4) To find out the amount of knots in the pulp chips from the MASSAHAKE-process and (5) To find out the critical factors in big fuel stock made of the fuel fraction from the MASSAHAKE-process. The research with grinder was made with five different types of grinder plates. One of the blade sets was used as a reference where all the other sets were compared. In the second task a relationship between three most important initial values and the quality of pulp chips was determined. These values were: the feeding capacity of the whole tree chips to the process, the sensitivity of the optical sorter and the pixel size of bark to be removed in optical sorter. Based on the research and analysis results a linear model describing the process was made. In the third task the behaviour of mixed tree chips in the process was examined and also some full scale pulping experiments were done. Comparing the knot content of the pulp chips both from MASSAHAKE-process and normal pulp chip process a significant difference was noticed. The pulp chips from MASSAHAKE-system contained only 1/3 of the knots in normal de-barking+chipping pulp chip line. With decreased knot content a 1-3 % increase in digester capacity could be reached. Finally in fuel fraction storing research a significant dry material loss was determined

  10. Application of the MASSAHAKE-method for birch whole tree chips and for the production of raw material for mechanical pulp production; MASSAHAKE-menetelmaen soveltaminen koivulle sekae mekaanisen massan raaka-ainetuotantoon

    Energy Technology Data Exchange (ETDEWEB)

    Ahonen, M.; Seppaenen, V.; Nikala, L.

    1996-12-31

    The objectives of this project for the year 1995 were: (1) To develop the grinding process in order to decrease the wood losses in grinder, (2) To find the connection between the initial values in the process and the quality of the pulp chips, (3) To find out the behaviour of chips from mixed tree species in the MASSAHAKE process, (4) To find out the amount of knots in the pulp chips from the MASSAHAKE-process and (5) To find out the critical factors in big fuel stock made of the fuel fraction from the MASSAHAKE-process. The research with grinder was made with five different types of grinder plates. One of the blade sets was used as a reference where all the other sets were compared. In the second task a relationship between three most important initial values and the quality of pulp chips was determined. These values were: the feeding capacity of the whole tree chips to the process, the sensitivity of the optical sorter and the pixel size of bark to be removed in optical sorter. Based on the research and analysis results a linear model describing the process was made. In the third task the behaviour of mixed tree chips in the process was examined and also some full scale pulping experiments were done. Comparing the knot content of the pulp chips both from MASSAHAKE-process and normal pulp chip process a significant difference was noticed. The pulp chips from MASSAHAKE-system contained only 1/3 of the knots in normal de-barking+chipping pulp chip line. With decreased knot content a 1-3 % increase in digester capacity could be reached. Finally in fuel fraction storing research a significant dry material loss was determined

  11. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  12. Ammonia, Total Reduced Sulfides, and Greenhouse Gases of Pine Chip and Corn Stover Bedding Packs.

    Science.gov (United States)

    Spiehs, Mindy J; Brown-Brandl, Tami M; Parker, David B; Miller, Daniel N; Berry, Elaine D; Wells, James E

    2016-03-01

    Bedding materials may affect air quality in livestock facilities. Our objective in this study was to compare headspace concentrations of ammonia (NH), total reduced sulfides (TRS), carbon dioxide (CO), methane (CH), and nitrous oxide (NO) when pine wood chips ( spp.) and corn stover ( L.) were mixed in various ratios (0, 10, 20, 30, 40, 60, 80, and 100% pine chips) and used as bedding with manure. Air samples were collected from the headspace of laboratory-scaled bedded manure packs weekly for 42 d. Ammonia concentrations were highest for bedded packs containing 0, 10, and 20% pine chips (equivalent to 501.7, 502.3, and 502.3 mg m, respectively) in the bedding mixture and were lowest when at least 80% pine chips were used as bedding (447.3 and 431.0 mg m, respectively for 80 and 100% pine chip bedding). The highest NH concentrations were observed at Day 28. The highest concentration of TRS was observed when 100% pine chips were used as bedding (11.4 µg m), with high concentrations occurring between Days 7 and 14, and again at Day 35. Greenhouse gases were largely unaffected by bedding material but CH and CO concentrations increased as the bedded packs aged and NO concentrations were highly variable throughout the incubation. We conclude that a mixture of bedding material that contains 30 to 40% pine chips may be the ideal combination to reduce both NH and TRS emissions. All gas concentrations increased as the bedded packs aged, suggesting that frequent cleaning of facilities would improve air quality in the barn, regardless of bedding materials used. Copyright © by the American Society of Agronomy, Crop Science Society of America, and Soil Science Society of America, Inc.

  13. Chips 2020

    CERN Document Server

    2016-01-01

    The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising  Moore-like exponential g...

  14. Nano technologies for Biosensor and Bio chip

    International Nuclear Information System (INIS)

    Kim, I.M.; Park, T.J.; Paskaleva, E.E.; Sun, F.; Seo, J.W.; Mehta, K.K.

    2015-01-01

    The bio sensing devices are characterized by their biological receptors, which have specificity to their corresponding analytes. These analytes are a vast and diverse group of biological molecules, DNAs, proteins (such as antibodies), fatty acids, or entire biological systems, such as pathogenic bacteria, viruses, cancerous cells, or other living organisms. A main challenge in the development of biosensor applications is the efficient recognition of a biological signal in a low signal-to-noise ratio environment, and its transduction into an electrochemical, optical, or other signals. The advent of nano material technology greatly increased the potential for achieving exquisite sensitivity of such devises, due to the innate high surface-to-volume ratio and high reactivity of the nano material. The second major challenge facing the biosensor application, that of sca lability, is addressed by multiplexing and miniaturizing of the biosensor devises into a bio chip. In recent years, biosensor and bio chip technologies have made significant progress by taking advantages of diverse kinds of nano materials that are derived from nano technology

  15. Reducing the Edge Chipping for Capillary End Face Grinding and Polishing

    Directory of Open Access Journals (Sweden)

    Hošek J.

    2013-05-01

    Full Text Available This paper presents results of glass capillary end face grinding and polishing by approach that reduces the edge chipping. Brittle materials have natural tendency for edge chipping what leads to beveling the sharp edges. Not beveled sharp edges on glass capillary are important for special applications like surface tension measurement of small liquid samples. We use common grinding and polishing process for capillary end face machining modified with gradual decreasing of grinding load based on the relation of the critical chipping load. Achieved surface roughness is measured using atomic force microscopy (AFM. Capillary inner edge quality is checked both with optical microscopes and electron microscope too. We achieved a non-chipped capillary inner edge with radius down to 100 nm.

  16. Integration of microelectronic chips in microfluidic systems on printed circuit board

    International Nuclear Information System (INIS)

    Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

    2012-01-01

    A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

  17. Crosstalk in modern on-chip interconnects a FDTD approach

    CERN Document Server

    Kaushik, B K; Patnaik, Amalendu

    2016-01-01

    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  18. Origami chip-on-sensor design: progress and new developments

    International Nuclear Information System (INIS)

    Irmler, C; Bergauer, T; Frankenberger, A; Friedl, M; Gfall, I; Valentan, M; Ishikawa, A; Kato, E; Negishi, K; Kameswara, R; Mohanty, G; Onuki, Y; Shimizu, N; Tsuboyama, T

    2013-01-01

    The Belle II silicon vertex detector will consist of four layers of double-sided silicon strip detectors, arranged in ladders. Each sensor will be read out individually by utilizing the Origami chip-on-sensor concept, where the APV25 chips are placed on flexible circuits, glued on top of the sensors. Beside a best compromise between low material budget and sufficient SNR, this concept allows efficient CO 2 cooling of the readout chips by a single, thin cooling pipe per ladder. Recently, we assembled a module consisting of two consecutive 6'' double-sided silicon strip detectors, both read out by Origami flexes. Such a compound of Origami modules is required for the ladders of the outer Belle II SVD layers. Consequently, it is intended to verify the scalability of the assembly procedure, the performance of combined Origami flexes as well as the efficiency of the CO 2 cooling system for a higher number of APV25 chips.

  19. An Automatic Baseline Regulation in a Highly Integrated Receiver Chip for JUNO

    Science.gov (United States)

    Muralidharan, P.; Zambanini, A.; Karagounis, M.; Grewing, C.; Liebau, D.; Nielinger, D.; Robens, M.; Kruth, A.; Peters, C.; Parkalian, N.; Yegin, U.; van Waasen, S.

    2017-09-01

    This paper describes the data processing unit and an automatic baseline regulation of a highly integrated readout chip (Vulcan) for JUNO. The chip collects data continuously at 1 Gsamples/sec. The Primary data processing which is performed in the integrated circuit can aid to reduce the memory and data processing efforts in the subsequent stages. In addition, a baseline regulator compensating a shift in the baseline is described.

  20. A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

    Science.gov (United States)

    Huang, Che-Wei; Huang, Yu-Jie; Lu, Shey-Shi; Lin, Chih-Ting

    2012-01-01

    A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC) architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm) integrated a humidity sensor, an interface circuit, a digital controller, and an On-Off Keying (OOK) wireless transceiver. With low power consumption, i.e., 750 μW without RF operation, the sensitivity of developed sensor chip was experimentally verified in the relative humidity (RH) range from 32% to 60%. The response time of the chip was also experimentally verified to be within 5 seconds from RH 36% to RH 64%. As a consequence, the implemented humidity SSoC paves the way toward the an ultra-small sensor system for various applications.

  1. STUDY OF CHIP IGNITION AND CHIP MORPHOLOGY AFTER MILLING OF MAGNESIUM ALLOYS

    Directory of Open Access Journals (Sweden)

    Ireneusz Zagórski

    2016-12-01

    Full Text Available The paper analyses the impact of specified technological parameters of milling (vc, fz, ap on time to ignition. Stages leading to chip ignition were analysed. Metallographic images of magnesium chip were presented. No significant difference was observed in time to ignition in different chip fractions. Moreover, the surface of chips was free of products of ignition and signs of strong oxidation.

  2. The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

    Directory of Open Access Journals (Sweden)

    Amlan Ganguly

    2018-02-01

    Full Text Available With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

  3. Influence of various alternative bedding materials on pododermatitis in broilers raised in a built-up litter system

    Science.gov (United States)

    Broilers in the United States are frequently raised on built-up litter systems, primarily bedded with pine wood chips (shavings) or sawdust. There is continuing interest in alternative bedding materials as pine products are often in short supply and prices rise accordingly. Alternative bedding mat...

  4. Improvement in the competitiveness of an upgrading process of whole-tree chips; Kokopuuhakkeen puhdistusprosessin kilpailukyvyn parantaminen

    Energy Technology Data Exchange (ETDEWEB)

    Asplund, D [Jyvaeskylaen Teknologiakeskus Oy, Jyvaeskylae (Finland); Seppaenen, V [VTT Energy, Jyvaeskylae (Finland)

    1997-12-01

    Development of the upgrading method for whole-tree chips will be continued from the stage achieved in connection with the construction of the Kankaanpaeae demonstration plant in Finland. The aim is to reduce production costs by process-technical modifications and by equipment development and to increase the value of products. The target is to reduce the production costs of the fuel by at least FIM 7/MWh and to assort the pine pulp chips at least to two classes on the basis of fibre length. In preliminary tests with fibre length, principles of assorting were determined. Tests were carried out with a belt conveyor that throws chips to different distances according to mass and volume. The aim is to assort the chips according to dry-fresh density, which correlates with the fibre length. Modifications were designed and realised at the MASSAHAKE plant for the production of pine chips. By changing the chip size the pine chips can be upgraded in accordance with the pricing of saw chips. Process-technical changes can also be made to improve the yield and bark content of pulp chips. The economic effect of these modifications will not be seen until the pricing of products corresponds to the calculations. The changes affecting the yield will be realised according to the production level. It has been verified that it is possible to achieve cost savings and additional income, when the fuel cost is reduced by FIM 4.3 - 34.8/MWh, depending on the method of calculation. The project will be continued in 1997 by further development of assorting, by process and equipment-technical development of the MASSAHAKE method and by applying results to practice. (orig.)

  5. Specific Features of Chip Making and Work-piece Surface Layer Formation in Machining Thermal Coatings

    Directory of Open Access Journals (Sweden)

    V. M. Yaroslavtsev

    2016-01-01

    Full Text Available A wide range of unique engineering structural and performance properties inherent in metallic composites characterizes wear- and erosion-resistant high-temperature coatings made by thermal spraying methods. This allows their use both in manufacturing processes to enhance the wear strength of products, which have to operate under the cyclic loading, high contact pressures, corrosion and high temperatures and in product renewal.Thermal coatings contribute to the qualitative improvement of the technical level of production and product restoration using the ceramic composite materials. However, the possibility to have a significantly increased product performance, reduce their factory labour hours and materials/output ratio in manufacturing and restoration is largely dependent on the degree of the surface layer quality of products at their finishing stage, which is usually provided by different kinds of machining.When machining the plasma-sprayed thermal coatings, a removing process of the cut-off layer material is determined by its distinctive features such as a layered structure, high internal stresses, low ductility material, high tendency to the surface layer strengthening and rehardening, porosity, high abrasive properties, etc. When coatings are machined these coating properties result in specific characteristics of chip formation and conditions for formation of the billet surface layer.The chip formation of plasma-sprayed coatings was studied at micro-velocities using an experimental tool-setting microscope-based setup, created in BMSTU. The setup allowed simultaneous recording both the individual stages (phases of the chip formation process and the operating force factors.It is found that formation of individual chip elements comes with the multiple micro-cracks that cause chipping-off the small particles of material. The emerging main crack in the cut-off layer of material leads to separation of the largest chip element. Then all the stages

  6. Multiparameter Sensor Chip with Barium Strontium Titanate as Multipurpose Material

    OpenAIRE

    Huck, Christina; Poghossian, Arshak; Kerroumi, Iman; Schusser, Sebastian; Backer, Matthias; Zander, Willi; Schubert, Juergen; Buniatyan, Vahe V; Martirosyan, Norayr W; Wagner, Patrick Hermann; Schoning, Michael J

    2014-01-01

    It is well known that biochemical and biotechnological processes are strongly dependent and affected by a variety of physico-chemical parameters such as pH value, temperature, pressure and electrolyte conductivity. Therefore, these quantities have to be monitored or controlled in order to guarantee a stable process operation, optimization and high yield. In this work, a sensor chip for the multiparameter detection of three physico-chemical parameters such as electrolyte conductivity, pH and t...

  7. Low-Cost Chemical-Responsive Adhesive Sensing Chips.

    Science.gov (United States)

    Tan, Weirui; Zhang, Liyuan; Shen, Wei

    2017-12-06

    Chemical-responsive adhesive sensing chip is a new low-cost analytical platform that uses adhesive tape loaded with indicator reagents to detect or quantify the target analytes by directly sticking the tape to the samples of interest. The chemical-responsive adhesive sensing chips can be used with paper to analyze aqueous samples; they can also be used to detect and quantify solid, particulate, and powder analytes. The colorimetric indicators become immediately visible as the contact between the functionalized adhesives and target samples is made. The chemical-responsive adhesive sensing chip expands the capability of paper-based analytical devices to analyze solid, particulate, or powder materials via one-step operation. It is also a simpler alternative way, to the covalent chemical modification of paper, to eliminate indicator leaching from the dipstick-style paper sensors. Chemical-responsive adhesive chips can display analytical results in the form of colorimetric dot patterns, symbols, and texts, enabling clear understanding of assay results by even nonprofessional users. In this work, we demonstrate the analyses of heavy metal salts in silica powder matrix, heavy metal ions in water, and bovine serum albumin in an aqueous solution. The detection is one-step, specific, sensitive, and easy-to-operate.

  8. Dr. Monaco Examines Lab-on a-Chip

    Science.gov (United States)

    2003-01-01

    Dr. Lisa Monaco, Marshall Space Flight Center's (MSFC's) project scientist for the Lab-on-a-Chip Applications Development (LOCAD) program, examines a lab on a chip. The small dots are actually ports where fluids and chemicals can be mixed or samples can be collected for testing. Tiny channels, only clearly visible under a microscope, form pathways between the ports. Many chemical and biological processes, previously conducted on large pieces of laboratory equipment, can now be performed on these small glass or plastic plates. Monaco and other researchers at MSFC in Huntsville, Alabama, are customizing the chips to be used for many space applications, such as monitoring microbes inside spacecraft and detecting life on other planets. The portable, handheld Lab-on-a Chip Application Development Portable Test System (LOCAD-PTS) made its debut flight aboard Discovery during the STS-116 mission launched December 9, 2006. The system allowed crew members to monitor their environment for problematic contaminants such as yeast, mold, and even E.coli, and salmonella. Once LOCAD-PTS reached the International Space Station (ISS), the Marshall team continued to manage the experiment, monitoring the study from a console in the Payload Operations Center at MSFC. The results of these studies will help NASA researchers refine the technology for future Moon and Mars missions. (NASA/MSFC/D.Stoffer)

  9. Modeling, analysis and optimization of network-on-chip communication architectures

    CERN Document Server

    Ogras, Umit Y

    2013-01-01

    Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. This book explores outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.

  10. A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

    Directory of Open Access Journals (Sweden)

    Chih-Ting Lin

    2012-08-01

    Full Text Available A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm integrated a humidity sensor, an interface circuit, a digital controller, and an On-Off Keying (OOK wireless transceiver. With low power consumption, i.e., 750 μW without RF operation, the sensitivity of developed sensor chip was experimentally verified in the relative humidity (RH range from 32% to 60%. The response time of the chip was also experimentally verified to be within 5 seconds from RH 36% to RH 64%. As a consequence, the implemented humidity SSoC paves the way toward the an ultra-small sensor system for various applications.

  11. A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

    Directory of Open Access Journals (Sweden)

    Chang-Hung Lee

    2014-05-01

    Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  12. A low-power integrated humidity CMOS sensor by printing-on-chip technology.

    Science.gov (United States)

    Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

    2014-05-23

    A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

  13. Flexible production and logistics of wood chips; Joustava hakkeen valmistus ja logistiikka

    Energy Technology Data Exchange (ETDEWEB)

    Haemaelaeinen, M; Pankakari, P [Metsaeenergia Meter Ky, Louhi (Finland)

    1997-12-31

    The target of the project was to develop a multi-purpose chipper-lorry (MOHA), which could be used both as chipping and transportation unit. MOHA is capable of chipping trees directly from the lot, so the size of the storage plays no role. Even though the MOHA-unit can be used as an individual transportation unit, it can also be used for feeding any further dispatch unit equipped with interchangeable container system e.g. when the transportation distances are long and the ordered volumes of wood chips are large. Previous projects concerning chipping-logistics are based on various intermediate storage models, but the MOHA delivers the chips strait from the lot to the site of utilization. The raw material short-distance haulage is reduced from previous 150 - 250 m to 1 - 50 m. In this new delivery model chips are bunkered only at largest heating plants. At smaller heating plants no bunker storages are needed. MOHA collects self the load, delivers it, brings, if controlled properly, back-haul, and delivers it to another site of utilization

  14. Flexible production and logistics of wood chips; Joustava hakkeen valmistus ja logistiikka

    Energy Technology Data Exchange (ETDEWEB)

    Haemaelaeinen, M.; Pankakari, P. [Metsaeenergia Meter Ky, Louhi (Finland)

    1996-12-31

    The target of the project was to develop a multi-purpose chipper-lorry (MOHA), which could be used both as chipping and transportation unit. MOHA is capable of chipping trees directly from the lot, so the size of the storage plays no role. Even though the MOHA-unit can be used as an individual transportation unit, it can also be used for feeding any further dispatch unit equipped with interchangeable container system e.g. when the transportation distances are long and the ordered volumes of wood chips are large. Previous projects concerning chipping-logistics are based on various intermediate storage models, but the MOHA delivers the chips strait from the lot to the site of utilization. The raw material short-distance haulage is reduced from previous 150 - 250 m to 1 - 50 m. In this new delivery model chips are bunkered only at largest heating plants. At smaller heating plants no bunker storages are needed. MOHA collects self the load, delivers it, brings, if controlled properly, back-haul, and delivers it to another site of utilization

  15. Fractional-Order Identification and Control of Heating Processes with Non-Continuous Materials

    Directory of Open Access Journals (Sweden)

    Riccardo Caponetto

    2016-11-01

    Full Text Available The paper presents a fractional order model of a heating process and a comparison of fractional and standard PI controllers in its closed loop system. Preliminarily, an enhanced fractional order model for the heating process on non-continuous materials has been identified through a fitting algorithm on experimental data. Experimentation has been carried out on a finite length beam filled with three non-continuous materials (air, styrofoam, metal buckshots in order to identify a model in the frequency domain and to obtain a relationship between the fractional order of the heating process and the different materials’ properties. A comparison between the experimental model and the theoretical one has been performed, proving a significant enhancement of the fitting performances. Moreover the obtained modelling results confirm the fractional nature of the heating processes when diffusion occurs in non-continuous composite materials, and they show how the model’s fractional order can be used as a characteristic parameter for non-continuous materials with different composition and structure. Finally, three different kinds of controllers have been applied and compared in order to keep constant the beam temperature constant at a fixed length.

  16. EVALUATION OF THERMAL EFFICIENCY OF THE TECHNOLOGICAL SCHEME OF APPLE CHIPS AND DRIED FRUITS PRODUCTION

    Directory of Open Access Journals (Sweden)

    G. V. Kalashnikov

    2014-01-01

    Full Text Available The estimation of thermodynamic perfection of separate technological processes is executed at heat-moisture of handling of fruit and a line of manufacture of fruit apple chips and dried fruits. The technological scheme of a line of processing of fruits and manufactures of fruit chips on the basis of convection and the microwave-dryings suggested resource-saving. The technique is made and results of calculation of thermal expenses for various schemes of manufacture of apple chips are resulted. For the offered scheme material, thermal and power streams on the basis of balance parities of technological processes are certain. The comparative thermal production efficiency of apple chips for a base foreign variant and the offered technological scheme with the closed cycle of use of the heat-carrier and the combined convection-microwave-drying is shown. In this paper we define the thermal and energy flows for the processes of convective drying, pre-microwave drying, hydrothermal treatment and final microwave drying plant material, which are one of the main stages of the production of all kinds of fruit and vegetable concentrates, including fruit apple chips. Resource-saving ways moisture-heat of handling (hydration, blanching, drying, etc. produce raw materials in the production of food concentrates suggested a reduced water flow with a high degree of use of its potential power and microwave sources. To assess the thermal efficiency of the various processes and production schemes used as indicators of thermal efficiency and proposed value of specific heat (kJ / kg given mass productivity per unit of feedstock and translational moisture. The values of the mass fraction of the heat of material flows for the base and the proposed resource-saving production scheme fruit chips, for example, apple, based on a combination of convection-microwave drying each control surface.

  17. A single-chip computer analysis system for liquid fluorescence

    International Nuclear Information System (INIS)

    Zhang Yongming; Wu Ruisheng; Li Bin

    1998-01-01

    The single-chip computer analysis system for liquid fluorescence is an intelligent analytic instrument, which is based on the principle that the liquid containing hydrocarbons can give out several characteristic fluorescences when irradiated by strong light. Besides a single-chip computer, the system makes use of the keyboard and the calculation and printing functions of a CASIO printing calculator. It combines optics, mechanism and electronics into one, and is small, light and practical, so it can be used for surface water sample analysis in oil field and impurity analysis of other materials

  18. Silicon carbide transparent chips for compact atomic sensors

    Science.gov (United States)

    Huet, L.; Ammar, M.; Morvan, E.; Sarazin, N.; Pocholle, J.-P.; Reichel, J.; Guerlin, C.; Schwartz, S.

    2017-11-01

    Atom chips [1] are an efficient tool for trapping, cooling and manipulating cold atoms, which could open the way to a new generation of compact atomic sensors addressing space applications. This is in particular due to the fact that they can achieve strong magnetic field gradients near the chip surface, hence strong atomic confinement at moderate electrical power. However, this advantage usually comes at the price of reducing the optical access to the atoms, which are confined very close to the chip surface. We will report at the conference experimental investigations showing how these limits could be pushed farther by using an atom chip made of a gold microcircuit deposited on a single-crystal Silicon Carbide (SiC) substrate [2]. With a band gap energy value of about 3.2 eV at room temperature, the latter material is transparent at 780nm, potentially restoring quasi full optical access to the atoms. Moreover, it combines a very high electrical resistivity with a very high thermal conductivity, making it a good candidate for supporting wires with large currents without the need of any additional electrical insulation layer [3].

  19. Chip-to-Chip Half Duplex Spiking Data Communication over Power Supply Rails

    Science.gov (United States)

    Hashida, Takushi; Nagata, Makoto

    Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at more than 100Mbps. A pair of transceivers consumes 1.35mA from 3.3V, at 130Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by 30dB, purifying power supply current for internal circuits. Bi-directional spiking communication was successfully examined in a 90-nm CMOS prototype setup of on-chip waveform capturing. A micro controller forwards clock pulses to and receives data streams from a comparator based waveform capturer formed on a different chip, through a single pair of power and ground traces. The bit error rate is small enough not to degrade waveform acquisition capability, maintaining the spurious free dynamic range of higher than 50dB.

  20. Implementing oxygen control in chip-based cell and tissue culture systems.

    Science.gov (United States)

    Oomen, Pieter E; Skolimowski, Maciej D; Verpoorte, Elisabeth

    2016-09-21

    Oxygen is essential in the energy metabolism of cells, as well as being an important regulatory parameter influencing cell differentiation and function. Interest in precise oxygen control for in vitro cultures of tissues and cells continues to grow, especially with the emergence of the organ-on-a-chip and the desire to emulate in vivo conditions. This was recently discussed in this journal in a Critical Review by Brennan et al. (Lab Chip (2014). DOI: ). Microfluidics can be used to introduce flow to facilitate nutrient supply to and waste removal from in vitro culture systems. Well-defined oxygen gradients can also be established. However, cells can quickly alter the oxygen balance in their vicinity. In this Tutorial Review, we expand on the Brennan paper to focus on the implementation of oxygen analysis in these systems to achieve continuous monitoring. Both electrochemical and optical approaches for the integration of oxygen monitoring in microfluidic tissue and cell culture systems will be discussed. Differences in oxygen requirements from one organ to the next are a challenging problem, as oxygen delivery is limited by its uptake into medium. Hence, we discuss the factors determining oxygen concentrations in solutions and consider the possible use of artificial oxygen carriers to increase dissolved oxygen concentrations. The selection of device material for applications requiring precise oxygen control is discussed in detail, focusing on oxygen permeability. Lastly, a variety of devices is presented, showing the diversity of approaches that can be employed to control and monitor oxygen concentrations in in vitro experiments.

  1. Determination of Apparent Amylose Content in Rice by Using Paper-Based Microfluidic Chips.

    Science.gov (United States)

    Hu, Xianqiao; Lu, Lin; Fang, Changyun; Duan, Binwu; Zhu, Zhiwei

    2015-11-11

    Determination of apparent amylose content in rice is a key function for rice research and the rice industry. In this paper, a novel approach with paper-based microfluidic chip is reported to determine apparent amylose content in rice. The conventional color reaction between amylose and iodine was employed. Blue color of amylose-iodine complex generated on-chip was converted to gray and measured with Photoshop after the colored chip was scanned. The method for preparation of the paper chip is described. In situ generation of iodine for on-chip color reaction was designed, and factors influencing color reaction were investigated in detail. Elimination of yellow color interference of excess iodine by exploiting color removal function of Photoshop was presented. Under the optimized conditions, apparent amylose content in rice ranging from 1.5 to 26.4% can be determined, and precision was 6.3%. The analytical results obtained with the developed approach were in good agreement with those with the continuous flow analyzer method.

  2. Epoxy Chip-in-Carrier Integration and Screen-Printed Metalization for Multichannel Microfluidic Lab-on-CMOS Microsystems.

    Science.gov (United States)

    Li, Lin; Yin, Heyu; Mason, Andrew J

    2018-04-01

    The integration of biosensors, microfluidics, and CMOS instrumentation provides a compact lab-on-CMOS microsystem well suited for high throughput measurement. This paper describes a new epoxy chip-in-carrier integration process and two planar metalization techniques for lab-on-CMOS that enable on-CMOS electrochemical measurement with multichannel microfluidics. Several design approaches with different fabrication steps and materials were experimentally analyzed to identify an ideal process that can achieve desired capability with high yield and low material and tool cost. On-chip electrochemical measurements of the integrated assembly were performed to verify the functionality of the chip-in-carrier packaging and its capability for microfluidic integration. The newly developed CMOS-compatible epoxy chip-in-carrier process paves the way for full implementation of many lab-on-CMOS applications with CMOS ICs as core electronic instruments.

  3. Hydrogen interactions with silicon-on-insulator materials

    OpenAIRE

    Rivera de Mena, A.J.

    2003-01-01

    The booming of microelectronics in recent decades has been made possible by the excellent properties of the Si/SiO2 interface in oxide on silicon systems.. This semiconductor/insulator combination has proven to be of great value for the semiconductor industry. It has made it possible to continuously increase the number of transistors per chip until the physical limit of integration is now almost reached. Silicon-on-insulator (SOI) materials were early on seen as a step in the logical evolutio...

  4. Ring resonator-based single-chip 1x8 optical beam forming network in LPCVD waveguide technology

    NARCIS (Netherlands)

    Zhuang, L.; Roeloffzen, C.G.H.; Heideman, Rene; Borreman, A.; Meijerink, Arjan; van Etten, Wim; Koonen, A.M.J.; Leijtens, X.J.M.; van den Boom, H.P.A.; Verdurmen, E.J.M.; Molina Vázquez, J.

    2006-01-01

    Optical ring resonators (ORRs) are good candidates to provide continuously tunable delay in beam forming networks (BFNs) for phased array antenna systems. Delay and splitting/combining elements can be integrated on a single optical chip to form an OBFN. A state-of-the-art 1×8 OBFN chip has been

  5. A proposed holistic approach to on-chip, off-chip, test, and package interconnections

    Science.gov (United States)

    Bartelink, Dirk J.

    1998-11-01

    The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must

  6. A scalable single-chip multi-processor architecture with on-chip RTOS kernel

    NARCIS (Netherlands)

    Theelen, B.D.; Verschueren, A.C.; Reyes Suarez, V.V.; Stevens, M.P.J.; Nunez, A.

    2003-01-01

    Now that system-on-chip technology is emerging, single-chip multi-processors are becoming feasible. A key problem of designing such systems is the complexity of their on-chip interconnects and memory architecture. It is furthermore unclear at what level software should be integrated. An example of a

  7. Device for continuous analysis of a stream of material

    International Nuclear Information System (INIS)

    Krampe, G.

    1981-01-01

    A radioactive radiation source and a radioactive detector are associated, as a unit, with equipment for conveying coal or other material in a continuous stream. One part of the conveying path or the whole path lies in the irradiation zone of the source, and the detector receives the radiation reflected by the material. The radiation source and the detector are carried by impacting means situated on the conveying path in such a way as to deflect the material from a portion of the conveying means travelling in a first direction, on to another portion travelling in a second direction intersecting the first direction. (author)

  8. A 3D Microfluidic Chip for Electrochemical Detection of Hydrolysed Nucleic Bases by a Modified Glassy Carbon Electrode

    Directory of Open Access Journals (Sweden)

    Jana Vlachova

    2015-01-01

    Full Text Available Modification of carbon materials, especially graphene-based materials, has wide applications in electrochemical detection such as electrochemical lab-on-chip devices. A glassy carbon electrode (GCE modified with chemically alternated graphene oxide was used as a working electrode (glassy carbon modified by graphene oxide with sulphur containing compounds and Nafion for detection of nucleobases in hydrolysed samples (HCl pH = 2.9, 100 °C, 1 h, neutralization by NaOH. It was found out that modification, especially with trithiocyanuric acid, increased the sensitivity of detection in comparison with pure GCE. All processes were finally implemented in a microfluidic chip formed with a 3D printer by fused deposition modelling technology. As a material for chip fabrication, acrylonitrile butadiene styrene was chosen because of its mechanical and chemical stability. The chip contained the one chamber for the hydrolysis of the nucleic acid and another for the electrochemical detection by the modified GCE. This chamber was fabricated to allow for replacement of the GCE.

  9. A 3D microfluidic chip for electrochemical detection of hydrolysed nucleic bases by a modified glassy carbon electrode.

    Science.gov (United States)

    Vlachova, Jana; Tmejova, Katerina; Kopel, Pavel; Korabik, Maria; Zitka, Jan; Hynek, David; Kynicky, Jindrich; Adam, Vojtech; Kizek, Rene

    2015-01-22

    Modification of carbon materials, especially graphene-based materials, has wide applications in electrochemical detection such as electrochemical lab-on-chip devices. A glassy carbon electrode (GCE) modified with chemically alternated graphene oxide was used as a working electrode (glassy carbon modified by graphene oxide with sulphur containing compounds and Nafion) for detection of nucleobases in hydrolysed samples (HCl pH = 2.9, 100 °C, 1 h, neutralization by NaOH). It was found out that modification, especially with trithiocyanuric acid, increased the sensitivity of detection in comparison with pure GCE. All processes were finally implemented in a microfluidic chip formed with a 3D printer by fused deposition modelling technology. As a material for chip fabrication, acrylonitrile butadiene styrene was chosen because of its mechanical and chemical stability. The chip contained the one chamber for the hydrolysis of the nucleic acid and another for the electrochemical detection by the modified GCE. This chamber was fabricated to allow for replacement of the GCE.

  10. Near-chip compliant layer for reducing perimeter stress during assembly process

    Energy Technology Data Exchange (ETDEWEB)

    Schultz, Mark D.; Takken, Todd E.; Tian, Shurong; Yao, Yuan

    2018-03-20

    A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.

  11. Development of processes for zircaloy chips recycling by electric arc furnace remelting and powder metallurgy

    International Nuclear Information System (INIS)

    Pereira, Luiz Alberto Tavares

    2014-01-01

    PWR reactors employ, as nuclear fuel, UO 2 pellets with Zircaloy clad. In the fabrication of fuel element parts, machining chips from the alloys are generated. As the Zircaloy chips cannot be discarded as ordinary metallic waste, the recycling of this material is important for the Brazilian Nuclear Policy, which targets the reprocess of Zircaloy residues for economic and environmental aspects. This work presents two methods developed in order to recycle Zircaloy chips. In one of the methods, Zircaloy machining chips were refused using an electric-arc furnace to obtain small laboratory ingots. The second one uses powder metallurgy techniques, where the chips were submitted to hydriding process and the resulting material was milled, isostatically pressed and vacuum sintered. The ingots were heat-treated by vacuum annealing. The microstructures resulting from both processing methods were characterized using optical and scanning electron microscopy. Chemical composition, crystal phases and hardness were also determined. The results showed that the composition of recycled Zircaloy comply with the chemical specifications and presented adequate microstructure for nuclear use. The good results of the powder metallurgy method suggest the possibility of producing small parts, like cladding end-caps, using near net shape sintering. (author)

  12. Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems

    DEFF Research Database (Denmark)

    Kistrup, Kasper; Poulsen, Carl Esben; Hansen, Mikkel Fougt

    2015-01-01

    Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) Self-aligned gapless bonding of a two-part chip with a tolerance of 50 um; (2...... solutions offered here can significantly help bridge the gap between academia and industry, where the differences in production methods and materials pose a challenge when transferring technology....

  13. Efficient large volume electroporation of dendritic cells through micrometer scale manipulation of flow in a disposable polymer chip

    DEFF Research Database (Denmark)

    Selmeczi, David; Hansen, Thomas; Met, Özcan

    2011-01-01

    We present a hybrid chip of polymer and stainless steel designed for high-throughput continuous electroporation of cells in suspension. The chip is constructed with two parallel stainless steel mesh electrodes oriented perpendicular to the liquid flow. The relatively high hydrodynamic resistance ...

  14. Mechanisms and FEM Simulation of Chip Formation in Orthogonal Cutting In-Situ TiB₂/7050Al MMC.

    Science.gov (United States)

    Xiong, Yifeng; Wang, Wenhu; Jiang, Ruisong; Lin, Kunyang; Shao, Mingwei

    2018-04-15

    The in-situ TiB₂/7050Al composite is a new kind of Al-based metal matrix composite (MMC) with super properties, such as low density, improved strength, and wear resistance. This paper, for a deep insight into its cutting performance, involves a study of the chip formation process and finite element simulation during orthogonal cutting in-situ TiB₂/7050Al MMC. With chips, material properties, cutting forces, and tool geometry parameters, the Johnson-Cook (J-C) constitutive equation of in-situ TiB₂/7050Al composite was established. Then, the cutting simulation model was established by applying the Abaqus-Explicit method, and the serrated chip, shear plane, strain rate, and temperature were analyzed. The experimental and simulation results showed that the obtained material's constitutive equation was of high reliability, and the saw-tooth chips occurred commonly under either low or high cutting speed and small or large feed rate. From result analysis, it was found that the mechanisms of chip formation included plastic deformation, adiabatic shear, shearing slip, and crack extension. In addition, it was found that the existence of small, hard particles reduced the ductility of the MMC and resulted in segmental chips.

  15. Recent advances in design and fabrication of on-chip micro-supercapacitors

    Science.gov (United States)

    Beidaghi, Majid; Wang, Chunlei

    2012-06-01

    Recent development in miniaturized electronic devices has increased the demand for power sources that are sufficiently compact and can potentially be integrated on a chip with other electronic components. Miniaturized electrochemical capacitors (EC) or micro-supercapacitors have great potential to complement or replace batteries and electrolytic capacitors in a variety of applications. Recently, we have developed several types of micro-supercapacitors with different structural designs and active materials. Carbon-Microelectromechanical Systems (C-MEMS) with three dimensional (3D) interdigital structures are employed both as electrode material for electric double layer capacitor (EDLC) or as three dimensional (3D) current collectors of pseudo-capacitive materials. More recently, we have also developed microsupercapacitor based on hybrid graphene and carbon nanotube interdigital structures. In this paper, the recent advances in design and fabrication of on-chip micro-supercapacitors are reviewed.

  16. On-chip electrochromic micro display for a disposable bio-sensor chip

    Science.gov (United States)

    Zhu, Yanjun; Tsukamoto, Takashiro; Tanaka, Shuji

    2017-12-01

    This paper reports an on-chip electrochromic micro display made of polyaniline (PANi) which can be easily made on a CMOS chip. Micro-patterned PANi thin films were selectively deposited on pre-patterned microelectrodes by using electrodeposition. The optimum conditions for deposition and electrochromism were investigated. An 8-pixel on-chip micro display was made on a Si chip. The color of each PANi film could be independently but simultaneously controlled, which means any 1-byte digital data could be displayed on the display. The PANi display had a response time as fast as about 100 ms, which means the transfer data rate was as fast as 80 bits per second.

  17. Y2O3-W Continuous Graded Materials by Co-sedimentation

    Directory of Open Access Journals (Sweden)

    WANG Shi-yang

    2017-09-01

    Full Text Available The raw Y2O3 powder was classified and graded based on modified co-sedimentation mathematical model,using the size distribution of W particles as the known condition. Y2O3-W continuous graded materials with the composition distribution index P values of 1.0, 0.7, 0.3 and 0.1 were prepared by co-sedimentation and hot-pressing. The results show that the Y2O3 powder consistent with the design requirements can be obtained by graduation method. The gradient continuity of materials can be verified by microstructure observation and hardness testing.

  18. Internalization of subcellular-scale microfabricated chips by healthy and cancer cells

    Science.gov (United States)

    Wong, H.-S. Philip

    2018-01-01

    Continuous monitoring of physiological parameters inside a living cell will lead to major advances in our understanding of biology and complex diseases, such as cancer. It also enables the development of new medical diagnostics and therapeutics. Progress in nanofabrication and wireless communication has opened up the potential of making a wireless chip small enough that it can be wholly inserted into a living cell. To investigate how such chips could be internalized into various types of living single cells and how this process might affect cells’ physiology, we designed and fabricated a series of multilayered micron-scale tag structures with different sizes as potential RFID (Radio Frequency IDentification) cell trackers. While the present structures are test structures that do not resonate, the tags that do resonate have similar structure from device fabrication, material properties, and device size point of view. The structures are in four different sizes, the largest with the lateral dimension of 9 μm × 21 μm. The thickness for these structures is kept constant at 1.5 μm. We demonstrate successful delivery of our fabricated chips into various types of living cells, such as melanoma skin cancer, breast cancer, colon cancer and healthy/normal fibroblast skin cells. To our surprise, we observed a remarkable internalization rate difference between each cell type; the uptake rate was faster for more aggressive cancer cells than the normal/healthy cells. Cell viability before and after tag cellular internalization and persistence of the internalized tags have also been recorded over the course of five days of incubation. These results establish the foundations of the possibility of long term, wireless, intracellular physiological signal monitoring. PMID:29601607

  19. Development of a portable analyzer with polymer lab-on-a-chip (LOC) for continuous sampling and monitoring of Pb(II).

    Science.gov (United States)

    Jang, A; Zou, Z; MacKnight, E; Wu, P M; Kim, I S; Ahn, C H; Bishop, P L

    2009-01-01

    A new portable analyzer with polymer lab-on-a-chip (LOC) has been designed, fabricated and fully characterized for continuous sampling and monitoring of lead (Pb(II)) in this work. As the working electrodes of the sensor, bismuth (Bi (III)) which allowed the advantage of being more environmentally friendly than traditional mercury drop electrodes was used, while maintaining similar sensitivity and other desirable characteristics. The size of a portable analyzer was 30 cmx23 cmx7 cm, and the weight was around 3 kg. The small size gives the advantage of being portable for field use while not sacrificing portability for accuracy of measurement. Furthermore, the autonomous system developed in coordination with the development of new polymer LOC integrated with electrochemical sensors can provide an innovative way to monitor surface waters in an efficient, cost-effective and sustainable manner.

  20. A tri-continuous mesoporous material with a silica pore wall following a hexagonal minimal surface

    KAUST Repository

    Han, Yu

    2009-04-06

    Ordered porous materials with unique pore structures and pore sizes in the mesoporous range (2-50nm) have many applications in catalysis, separation and drug delivery. Extensive research has resulted in mesoporous materials with one-dimensional, cage-like and bi-continuous pore structures. Three families of bi-continuous mesoporous materials have been made, with two interwoven but unconnected channels, corresponding to the liquid crystal phases used as templates. Here we report a three-dimensional hexagonal mesoporous silica, IBN-9, with a tri-continuous pore structure that is synthesized using a specially designed cationic surfactant template. IBN-9 consists of three identical continuous interpenetrating channels, which are separated by a silica wall that follows a hexagonal minimal surface. Such a tri-continuous mesostructure was predicted mathematically, but until now has not been observed in real materials. © 2009 Macmillan Publishers Limited. All rights reserved.

  1. A tri-continuous mesoporous material with a silica pore wall following a hexagonal minimal surface

    KAUST Repository

    Han, Yu; Zhang, Daliang; Chng, Leng Leng; Sun, Junliang; Zhao, L. J.; Zou, Xiaodong; Ying, Jackie

    2009-01-01

    Ordered porous materials with unique pore structures and pore sizes in the mesoporous range (2-50nm) have many applications in catalysis, separation and drug delivery. Extensive research has resulted in mesoporous materials with one-dimensional, cage-like and bi-continuous pore structures. Three families of bi-continuous mesoporous materials have been made, with two interwoven but unconnected channels, corresponding to the liquid crystal phases used as templates. Here we report a three-dimensional hexagonal mesoporous silica, IBN-9, with a tri-continuous pore structure that is synthesized using a specially designed cationic surfactant template. IBN-9 consists of three identical continuous interpenetrating channels, which are separated by a silica wall that follows a hexagonal minimal surface. Such a tri-continuous mesostructure was predicted mathematically, but until now has not been observed in real materials. © 2009 Macmillan Publishers Limited. All rights reserved.

  2. Microarrays (DNA Chips) for the Classroom Laboratory

    Science.gov (United States)

    Barnard, Betsy; Sussman, Michael; BonDurant, Sandra Splinter; Nienhuis, James; Krysan, Patrick

    2006-01-01

    We have developed and optimized the necessary laboratory materials to make DNA microarray technology accessible to all high school students at a fraction of both cost and data size. The primary component is a DNA chip/array that students "print" by hand and then analyze using research tools that have been adapted for classroom use. The…

  3. Small-scale, self-propagating combustion realized with on-chip porous silicon.

    Science.gov (United States)

    Piekiel, Nicholas W; Morris, Christopher J

    2015-05-13

    For small-scale energy applications, energetic materials represent a high energy density source that, in certain cases, can be accessed with a very small amount of energy input. Recent advances in microprocessing techniques allow for the implementation of a porous silicon energetic material onto a crystalline silicon wafer at the microscale; however, combustion at a small length scale remains to be fully investigated, particularly with regards to the limitations of increased relative heat loss during combustion. The present study explores the critical dimensions of an on-chip porous silicon energetic material (porous silicon + sodium perchlorate (NaClO4)) required to propagate combustion. We etched ∼97 μm wide and ∼45 μm deep porous silicon channels that burned at a steady rate of 4.6 m/s, remaining steady across 90° changes in direction. In an effort to minimize the potential on-chip footprint for energetic porous silicon, we also explored the minimum spacing between porous silicon channels. We demonstrated independent burning of porous silicon channels at a spacing of 0.5 m on a chip surface area of 1.65 cm(2). Smaller porous silicon channels of ∼28 μm wide and ∼14 μm deep were also utilized. These samples propagated combustion, but at times, did so unsteadily. This result may suggest that we are approaching a critical length scale for self-propagating combustion in a porous silicon energetic material.

  4. Microstructure Reconstruction of Sheet Molding Composite Using a Random Chips Packing Algorithm

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Tianyu; Xu, Hongyi; Chen, Wei

    2017-04-06

    Fiber-reinforced polymer composites are strong candidates for structural materials to replace steel and light alloys in lightweight vehicle design because of their low density and relatively high strength. In the integrated computational materials engineering (ICME) development of carbon fiber composites, microstructure reconstruction algorithms are needed to generate material microstructure representative volume element (RVE) based on the material processing information. The microstructure RVE reconstruction enables the material property prediction by finite element analysis (FEA)This paper presents an algorithm to reconstruct the microstructure of a chopped carbon fiber/epoxy laminate material system produced by compression molding, normally known as sheet molding compounds (SMC). The algorithm takes the result from material’s manufacturing process as inputs, such as the orientation tensor of fibers, the chopped fiber sheet geometry, and the fiber volume fraction. The chopped fiber sheets are treated as deformable rectangle chips and a random packing algorithm is developed to pack these chips into a square plate. The RVE is built in a layer-by-layer fashion until the desired number of lamina is reached, then a fine tuning process is applied to finalize the reconstruction. Compared to the previous methods, this new approach has the ability to model bended fibers by allowing limited amount of overlaps of rectangle chips. Furthermore, the method does not need SMC microstructure images, for which the image-based characterization techniques have not been mature enough, as inputs. Case studies are performed and the results show that the statistics of the reconstructed microstructures generated by the algorithm matches well with the target input parameters from processing.

  5. Rapid and simple half-quantitative measurement alpha-fetoprotein by poly(dimethylsiloxane) microfluidic chip immunochromatographic assay

    Science.gov (United States)

    Tong, Chao; Jin, Qinghui; Zhao, Jianlong

    2008-03-01

    In this article, a kind of microfluidic method based on MEMS technology combined with gold immunochromatographic assay (GICA) is developed and discussed. Compared to the traditional GICA, this method supplies us convenient, multi-channel, in-parallel, low cost and similar efficiency approach in the fields of alpha-fetopro-tei (AFP)detection. Firstly, we improved the adhesion between the model material SU-8 and Silicon wafer, optimized approaches of the fabrication of the SU-8 model systematically, and fabricate the PDMS micro fluid chip with good reproduction successfully. Secondly, Surface modification and antibody immobilization methods with the GICA on the PDMS micro fluid analysis chip are studied, we choose the PDMS material and transfer GICA to the PDMS micro fluid chip successfully after researching the antibody immobilization efficiency of different materials utilized in fabrication of the micro fluid chip. In order to improve the reaction efficiency of the immobilized antibody, we studied the characteristics of micro fluid without the gas drive, and the fluid velocity control in our design; we also design structure of grove to strengthen the ability of immobilizing the antibody. The stimulation of the structure shows that it achieves great improvement and experiments prove the design is feasible.

  6. Neuromorphic VLSI Models of Selective Attention: From Single Chip Vision Sensors to Multi-chip Systems.

    Science.gov (United States)

    Indiveri, Giacomo

    2008-09-03

    Biological organisms perform complex selective attention operations continuously and effortlessly. These operations allow them to quickly determine the motor actions to take in response to combinations of external stimuli and internal states, and to pay attention to subsets of sensory inputs suppressing non salient ones. Selective attention strategies are extremely effective in both natural and artificial systems which have to cope with large amounts of input data and have limited computational resources. One of the main computational primitives used to perform these selection operations is the Winner-Take-All (WTA) network. These types of networks are formed by arrays of coupled computational nodes that selectively amplify the strongest input signals, and suppress the weaker ones. Neuromorphic circuits are an optimal medium for constructing WTA networks and for implementing efficient hardware models of selective attention systems. In this paper we present an overview of selective attention systems based on neuromorphic WTA circuits ranging from single-chip vision sensors for selecting and tracking the position of salient features, to multi-chip systems implement saliency-map based models of selective attention.

  7. Neuromorphic VLSI Models of Selective Attention: From Single Chip Vision Sensors to Multi-chip Systems

    Directory of Open Access Journals (Sweden)

    Giacomo Indiveri

    2008-09-01

    Full Text Available Biological organisms perform complex selective attention operations continuously and effortlessly. These operations allow them to quickly determine the motor actions to take in response to combinations of external stimuli and internal states, and to pay attention to subsets of sensory inputs suppressing non salient ones. Selective attention strategies are extremely effective in both natural and artificial systems which have to cope with large amounts of input data and have limited computational resources. One of the main computational primitives used to perform these selection operations is the Winner-Take-All (WTA network. These types of networks are formed by arrays of coupled computational nodes that selectively amplify the strongest input signals, and suppress the weaker ones. Neuromorphic circuits are an optimal medium for constructing WTA networks and for implementing efficient hardware models of selective attention systems. In this paper we present an overview of selective attention systems based on neuromorphic WTA circuits ranging from single-chip vision sensors for selecting and tracking the position of salient features, to multi-chip systems implement saliency-map based models of selective attention.

  8. "Hook"-calibration of GeneChip-microarrays: Chip characteristics and expression measures

    Directory of Open Access Journals (Sweden)

    Krohn Knut

    2008-08-01

    Full Text Available Abstract Background Microarray experiments rely on several critical steps that may introduce biases and uncertainty in downstream analyses. These steps include mRNA sample extraction, amplification and labelling, hybridization, and scanning causing chip-specific systematic variations on the raw intensity level. Also the chosen array-type and the up-to-dateness of the genomic information probed on the chip affect the quality of the expression measures. In the accompanying publication we presented theory and algorithm of the so-called hook method which aims at correcting expression data for systematic biases using a series of new chip characteristics. Results In this publication we summarize the essential chip characteristics provided by this method, analyze special benchmark experiments to estimate transcript related expression measures and illustrate the potency of the method to detect and to quantify the quality of a particular hybridization. It is shown that our single-chip approach provides expression measures responding linearly on changes of the transcript concentration over three orders of magnitude. In addition, the method calculates a detection call judging the relation between the signal and the detection limit of the particular measurement. The performance of the method in the context of different chip generations and probe set assignments is illustrated. The hook method characterizes the RNA-quality in terms of the 3'/5'-amplification bias and the sample-specific calling rate. We show that the proper judgement of these effects requires the disentanglement of non-specific and specific hybridization which, otherwise, can lead to misinterpretations of expression changes. The consequences of modifying probe/target interactions by either changing the labelling protocol or by substituting RNA by DNA targets are demonstrated. Conclusion The single-chip based hook-method provides accurate expression estimates and chip-summary characteristics

  9. Polymer Micro- and Nanofabrication for On-Chip Immune Cell Handling

    DEFF Research Database (Denmark)

    Hobæk, Thor Christian

    , disposable polymer chips were fabricated by injection molding and ultrasonic welding for the generation of a large number of mature DCs in a closed microfluidic perfusion culture. By using low gas permeable tubings and chip materials, a constant pH and bubble-free culture medium was maintained for 7 days...... olefin copolymer (COC) over large surface areas by injection molding, using nanostructured mold inlays patterned by high-throughput deep-UV stepper photolithography. Injection molding at constant mold temperature below the glass transition point was significantly improved using nanostructured ceramic...... outside a CO2 cell incubator. Numerical simulations of oxygen transport were performed to establish guidelines for medium exchange rates in an impermeable culture system. Maturation of CD83+ mature DCs generated from CD14+ monocytes was demonstrated inside the disposable culture chip, with a yield almost...

  10. Pixel detector readout chip

    CERN Multimedia

    1991-01-01

    Close-up of a pixel detector readout chip. The photograph shows an aera of 1 mm x 2 mm containing 12 separate readout channels. The entire chip contains 1000 readout channels (around 80 000 transistors) covering a sensitive area of 8 mm x 5 mm. The chip has been mounted on a silicon detector to detect high energy particles.

  11. Geotechnical properties of peat soil stabilised with shredded waste tyre chips

    Directory of Open Access Journals (Sweden)

    M.A. Rahgozar

    2016-02-01

    Full Text Available To accommodate major civil engineering projects in or in the vicinity of peatlands, it is essential to stabilise peat deposits. On the other hand, the accumulation of waste tyres in recent decades has caused environmental problems around the world. An effective remedy for both issues is to use scrap tyre material to stabilise problematic peat soils. This article reports an experimental investigation of the effects of adding shredded tyre chips on the stability and bearing capacity of peat soil. Peat soil samples from the Chaghakhor Wetland (Chaharmahal and Bakhtiari Province, Iran were mixed with sand at a constant dosage of 400 kg m-3 and different percentages (0 %, 5 %, 10 %, 15 % and 20 % by weight of shredded tyre chips. The unconfined compressive strength, effective cohesion, angle of internal friction and coefficient of permeability were measured for all of these mixtures. The results showed that adding shredded tyre chips significantly improved the geotechnical properties of the peat soil. The mixture with 10 % shredded tyre chips showed the highest unconfined compressive strength; the one with 15 % tyre chips exhibited the highest ductility; and adding 20 % shredded tyre chips provided the highest values for angle of internal friction, effective cohesion and coefficient of permeability. Scanning Electron Micrographs (SEM showed that the pore spaces in the stabilised peat were mostly filled with sand.

  12. Characterization of porous silicon integrated in liquid chromatography chips

    NARCIS (Netherlands)

    Tiggelaar, Roald M.; Verdoold, Vincent; Eghbali, H.; Desmet, G.; Gardeniers, Johannes G.E.

    2009-01-01

    Properties of porous silicon which are relevant for use of the material as a stationary phase in liquid chromatography chips, like porosity, pore size and specific surface area, were determined with high-resolution SEM and N2 adsorption–desorption isotherms. For the anodization conditions

  13. Preservation of forest wood chips

    Energy Technology Data Exchange (ETDEWEB)

    Kofman, P.D.; Thomsen, I.M.; Ohlsson, C.; Leer, E.; Ravn Schmidt, E.; Soerensen, M.; Knudsen, P.

    1999-01-01

    As part of the Danish Energy Research Programme on biomass utilisation for energy production (EFP), this project concerns problems connected to the handling and storing of wood chips. In this project, the possibility of preserving wood chips of the Norway Spruce (Picea Abies) is addressed, and the potential improvements by anaerobic storage are tested. Preservation of wood chips aims at reducing dry matter losses from extensive heating during storage and to reduce production of fungal spores. Fungal spores pose a health hazards to workers handling the chips. Further the producers of wood chips are interested in such a method since it would enable them to give a guarantee for the delivery of homogeneous wood chips also during the winter period. Three different types of wood chips were stored airtight and further one of these was stored in accordance with normal practise and use as reference. The results showed that airtight storage had a beneficial impact on the quality of the chips: no redistribution of moisture, low dry matter losses, unfavourable conditions for microbial activity of most fungi, and the promotion of yeasts instead of fungi with airborne spores. Likewise the firing tests showed that no combustion problems, and no increased risk to the environment or to the health of staff is caused by anaerobic storage of wood chips. In all, the tests of the anaerobic storage method of forest wood chips were a success and a large-scale test of the method will be carried out in 1999. (au)

  14. Site-Specific Growth and in Situ Integration of Different Nanowire Material Networks on a Single Chip: Toward a Nanowire-Based Electronic Nose for Gas Detection.

    Science.gov (United States)

    Hrachowina, Lukas; Domènech-Gil, Guillem; Pardo, Antonio; Seifner, Michael S; Gràcia, Isabel; Cané, Carles; Romano-Rodríguez, Albert; Barth, Sven

    2018-03-23

    A new method for the site-selective synthesis of nanowires has been developed to enable material growth with defined morphology and, at the same time, different composition on the same chip surface. The chemical vapor deposition approach for the growth of these nanowire-based resistive devices using micromembranes can be easily modified and represents a simple, adjustable fabrication process for the direct integration of nanowire meshes in multifunctional devices. This proof-of-concept study includes the deposition of SnO 2 , WO 3 , and Ge nanowires on the same chip. The individual resistors exhibit adequate gas sensing responses toward changing gas concentrations of CO, NO 2 , and humidity diluted in synthetic air. The data have been processed by principal component analysis with cluster responses that can be easily separated, and thus, the devices described herein are in principle suitable for environmental monitoring.

  15. Continuous Microfluidics (Ecology-on-a-Chip) Experiments for Long Term Observation of Bacteria at Liquid-Liquid Interfaces

    Science.gov (United States)

    Miranda, Michael; White, Andrew; Jalali, Maryam; Sheng, Jian

    2017-11-01

    A microfluidic bioassay incorporating a peristaltic pump and chemostat capable of continuously culturing a bacterial suspension through a microchannel for an extended period of time relevant to ecological processes is presented. A single crude oil droplet is dispensed on-chip and subsequently pinned to the top and bottom surfaces of the microchannel to establish a vertical curved oil-water interface to observe bacteria without boundary interference. The accumulation of extracellular polymeric substances (EPS), microbial film formation, and aggregation is provided by DIC microscopy with an EMCCD camera at an interval of 30 sec. Cell-interface interactions such as cell translational and angular motilities as well as encountering, attachment, detachment to the interface are obtained by a high speed camera at 1000 fps with a sampling interval of 10 min. Experiments on Pseudomonas sp. (P62) and isolated EPS suspensions from Sagitulla Stelleta and Roseobacter show rapid formation of bacterial aggregates including EPS streamers stretching tens of drop diameters long. These results provide crucial insights into environmentally relevant processes such as the initiation of marine oil snow, an alternative mode of biodegradation to conventional bioconsumption. Funded by GoMRI, NSF, ARO.

  16. Construction and test of the first Belle II SVD ladder implementing the origami chip-on-sensor design

    International Nuclear Information System (INIS)

    Irmler, C.; Bauer, A.; Bergauer, T.; Adamczyk, K.; Bacher, S.; Aihara, H.; Angelini, C.; Batignani, G.; Bettarini, S.; Bosi, F.; Aziz, T.; Babu, V.; Bahinipati, S.; Barberio, E.; Baroncelli, Ti.; Baroncelli, To.; Basith, A.K.; Behera, P.K.; Bhuyan, B.; Bilka, T.

    2016-01-01

    The Belle II Silicon Vertex Detector comprises four layers of double-sided silicon strip detectors (DSSDs), consisting of ladders with two to five sensors each. All sensors are individually read out by APV25 chips with the Origami chip-on-sensor concept for the central DSSDs of the ladders. The chips sit on flexible circuits that are glued on the top of the sensors. This concept allows a low material budget and an efficient cooling of the chips by a single pipe per ladder. We present the construction of the first SVD ladders and results from precision measurements and electrical tests

  17. Study on VCSEL laser heating chip in nuclear magnetic resonance gyroscope

    Science.gov (United States)

    Liang, Xiaoyang; Zhou, Binquan; Wu, Wenfeng; Jia, Yuchen; Wang, Jing

    2017-10-01

    In recent years, atomic gyroscope has become an important direction of inertial navigation. Nuclear magnetic resonance gyroscope has a stronger advantage in the miniaturization of the size. In atomic gyroscope, the lasers are indispensable devices which has an important effect on the improvement of the gyroscope performance. The frequency stability of the VCSEL lasers requires high precision control of temperature. However, the heating current of the laser will definitely bring in the magnetic field, and the sensitive device, alkali vapor cell, is very sensitive to the magnetic field, so that the metal pattern of the heating chip should be designed ingeniously to eliminate the magnetic field introduced by the heating current. In this paper, a heating chip was fabricated by MEMS process, i.e. depositing platinum on semiconductor substrates. Platinum has long been considered as a good resistance material used for measuring temperature The VCSEL laser chip is fixed in the center of the heating chip. The thermometer resistor measures the temperature of the heating chip, which can be considered as the same temperature of the VCSEL laser chip, by turning the temperature signal into voltage signal. The FPGA chip is used as a micro controller, and combined with PID control algorithm constitute a closed loop control circuit. The voltage applied to the heating resistor wire is modified to achieve the temperature control of the VCSEL laser. In this way, the laser frequency can be controlled stably and easily. Ultimately, the temperature stability can be achieved better than 100mK.

  18. The impact of CHIP premium increases on insurance outcomes among CHIP eligible children.

    Science.gov (United States)

    Nikolova, Silviya; Stearns, Sally

    2014-03-03

    Within the United States, public insurance premiums are used both to discourage private health policy holders from dropping coverage and to reduce state budget costs. Prior research suggests that the odds of having private coverage and being uninsured increase with increases in public insurance premiums. The aim of this paper is to test effects of Children's Health Insurance Program (CHIP) premium increases on public insurance, private insurance, and uninsurance rates. The fact that families just below and above a state-specific income cut-off are likely very similar in terms of observable and unobservable characteristics except the premium contribution provides a natural experiment for estimating the effect of premium increases. Using 2003 Medical Expenditure Panel Survey (MEPS) merged with CHIP premiums, we compare health insurance outcomes for CHIP eligible children as of January 2003 in states with a two-tier premium structure using a cross-sectional regression discontinuity methodology. We use difference-in-differences analysis to compare longitudinal insurance outcomes by December 2003. Higher CHIP premiums are associated with higher likelihood of private insurance. Disenrollment from CHIP in response to premium increases over time does not increase the uninsurance rate. When faced with higher CHIP premiums, private health insurance may be a preferable alternative for CHIP eligible families with higher incomes. Therefore, competition in the insurance exchanges being formed under the Affordable Care Act could enhance choice.

  19. Composite material dosimeters

    Science.gov (United States)

    Miller, Steven D.

    1996-01-01

    The present invention is a composite material containing a mix of dosimeter material powder and a polymer powder wherein the polymer is transparent to the photon emission of the dosimeter material powder. By mixing dosimeter material powder with polymer powder, less dosimeter material is needed compared to a monolithic dosimeter material chip. Interrogation is done with excitation by visible light.

  20. Robust design and thermal fatigue life prediction of anisotropic conductive film flip chip package

    International Nuclear Information System (INIS)

    Nam, Hyun Wook

    2004-01-01

    The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF(Anisotropic Conductive Film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design Of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2 nd DOE was conducted to obtain RSM equation for the choose 3 design parameter. The coefficient of determination (R 2 ) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for Feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430μm, and 78μm, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter

  1. UW VLSI chip tester

    Science.gov (United States)

    McKenzie, Neil

    1989-12-01

    We present a design for a low-cost, functional VLSI chip tester. It is based on the Apple MacIntosh II personal computer. It tests chips that have up to 128 pins. All pin drivers of the tester are bidirectional; each pin is programmed independently as an input or an output. The tester can test both static and dynamic chips. Rudimentary speed testing is provided. Chips are tested by executing C programs written by the user. A software library is provided for program development. Tests run under both the Mac Operating System and A/UX. The design is implemented using Xilinx Logic Cell Arrays. Price/performance tradeoffs are discussed.

  2. Numerical investigation of thermal performance of a water-cooled mini-channel heat sink for different chip arrangement

    Energy Technology Data Exchange (ETDEWEB)

    Tikadar, Amitav, E-mail: amitav453@gmail.com; Hossain, Md. Mahamudul; Morshed, A. K. M. M. [Department of Mechanical Engineering, Bangladesh University of Engineering and Technology, Dhaka, 1000 (Bangladesh)

    2016-07-12

    Heat transfer from electronic chip is always challenging and very crucial for electronic industry. Electronic chips are assembled in various manners according to the design conditions and limitationsand thus the influence of chip assembly on the overall thermal performance needs to be understand for the efficient design of electronic cooling system. Due to shrinkage of the dimension of channel and continuous increment of thermal load, conventional heat extraction techniques sometimes become inadequate. Due to high surface area to volume ratio, mini-channel have the natural advantage to enhance convective heat transfer and thus to play a vital role in the advanced heat transfer devices with limited surface area and high heat flux. In this paper, a water cooled mini-channel heat sink was considered for electronic chip cooling and five different chip arrangements were designed and studied, namely: the diagonal arrangement, parallel arrangement, stacked arrangement, longitudinal arrangement and sandwiched arrangement. Temperature distribution on the chip surfaces was presented and the thermal performance of the heat sink in terms of overall thermal resistance was also compared. It is found that the sandwiched arrangement of chip provides better thermal performance compared to conventional in line chip arrangement.

  3. Cache-aware network-on-chip for chip multiprocessors

    Science.gov (United States)

    Tatas, Konstantinos; Kyriacou, Costas; Dekoulis, George; Demetriou, Demetris; Avraam, Costas; Christou, Anastasia

    2009-05-01

    This paper presents the hardware prototype of a Network-on-Chip (NoC) for a chip multiprocessor that provides support for cache coherence, cache prefetching and cache-aware thread scheduling. A NoC with support to these cache related mechanisms can assist in improving systems performance by reducing the cache miss ratio. The presented multi-core system employs the Data-Driven Multithreading (DDM) model of execution. In DDM thread scheduling is done according to data availability, thus the system is aware of the threads to be executed in the near future. This characteristic of the DDM model allows for cache aware thread scheduling and cache prefetching. The NoC prototype is a crossbar switch with output buffering that can support a cache-aware 4-node chip multiprocessor. The prototype is built on the Xilinx ML506 board equipped with a Xilinx Virtex-5 FPGA.

  4. Dental Stem Cell Migration on Pulp Ceiling Cavities Filled with MTA, Dentin Chips, or Bio-Oss

    Directory of Open Access Journals (Sweden)

    Stefania Lymperi

    2015-01-01

    Full Text Available MTA, Bio-Oss, and dentin chips have been successfully used in endodontics. The aim of this study was to assess the adhesion and migration of dental stem cells on human pulp ceiling cavities filled with these endodontic materials in an experimental model, which mimics the clinical conditions of regenerative endodontics. Cavities were formed, by a homemade mold, on untouched third molars, filled with endodontic materials, and observed with electron microscopy. Cells were seeded on cavities’ surface and their morphology and number were analysed. The phenomenon of tropism was assessed in a migration assay. All three materials demonstrated appropriate microstructures for cell attachment. Cells grew on all reagents, but they showed a differential morphology. Moreover, variations were observed when comparing cells numbers on cavity’s filling versus the surrounding dentine disc. The highest number of cells was recorded on dentin chips whereas the opposite was true for Bio-Oss. This was confirmed in the migration assay where a statistically significant lower number of cells migrated towards Bio-Oss as compared to MTA and dentin chips. This study highlights that MTA and dentin chips have a greater potential compared to Bio-Oss regarding the attraction of dental stem cells and are good candidates for bioengineered pulp regeneration.

  5. Experiment list: SRX122496 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available || chip antibody=Rel || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip ant...ibody catalog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc

  6. Tests of UFXC32k chip with CdTe pixel detector

    Science.gov (United States)

    Maj, P.; Taguchi, T.; Nakaye, Y.

    2018-02-01

    The paper presents the performance of the UFXC32K—a hybrid pixel detector readout chip working with CdTe detectors. The UFXC32K has a pixel pitch of 75 μm and can cope with both input signal polarities. This functionality allows operating with widely used silicon sensors collecting holes and CdTe sensors collecting electrons. This article describes the chip focusing on solving the issues connected to high-Z sensor material, namely high leakage currents, slow charge collection time and thick material resulting in increased charge-sharring effects. The measurements were conducted with higher X-ray energies including 17.4 keV from molybdenum. Conclusions drawn inside the paper show the UFXC32K's usability for CdTe sensors in high X-ray energy applications.

  7. On-chip Mach-Zehnder interferometer for OCT systems

    Science.gov (United States)

    van Leeuwen, Ton G.; Akca, Imran B.; Angelou, Nikolaos; Weiss, Nicolas; Hoekman, Marcel; Leinse, Arne; Heideman, Rene G.

    2018-04-01

    By using integrated optics, it is possible to reduce the size and cost of a bulky optical coherence tomography (OCT) system. One of the OCT components that can be implemented on-chip is the interferometer. In this work, we present the design and characterization of a Mach-Zehnder interferometer consisting of the wavelength-independent splitters and an on-chip reference arm. The Si3N4 was chosen as the material platform as it can provide low losses while keeping the device size small. The device was characterized by using a home-built swept source OCT system. A sensitivity value of 83 dB, an axial resolution of 15.2 μm (in air) and a depth range of 2.5 mm (in air) were all obtained.

  8. Smart vision chips: An overview

    Science.gov (United States)

    Koch, Christof

    1994-01-01

    This viewgraph presentation presents four working analog VLSI vision chips: (1) time-derivative retina, (2) zero-crossing chip, (3) resistive fuse, and (4) figure-ground chip; work in progress on computing motion and neuromorphic systems; and conceptual and practical lessons learned.

  9. Experiment list: SRX122465 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 6 || chip antibody=Relb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Bethyl || chip anti...body catalog number 1=A302-183A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2

  10. Harshlight: a "corrective make-up" program for microarray chips

    Directory of Open Access Journals (Sweden)

    Wittkowski Knut M

    2005-12-01

    Full Text Available Abstract Background Microscopists are familiar with many blemishes that fluorescence images can have due to dust and debris, glass flaws, uneven distribution of fluids or surface coatings, etc. Microarray scans do show similar artifacts, which might affect subsequent analysis. Although all but the starkest blemishes are hard to find by the unaided eye, particularly in high-density oligonucleotide arrays (HDONAs, few tools are available to help with the detection of those defects. Results We develop a novel tool, Harshlight, for the automatic detection and masking of blemishes in HDONA microarray chips. Harshlight uses a combination of statistic and image processing methods to identify three different types of defects: localized blemishes affecting a few probes, diffuse defects affecting larger areas, and extended defects which may invalidate an entire chip. Conclusion We demonstrate the use of Harshlight can materially improve analysis of HDONA chips, especially for experiments with subtle changes between samples. For the widely used MAS5 algorithm, we show that compact blemishes cause an average of 8 gene expression values per chip to change by more than 50%, two of them by more than twofold; our masking algorithm restores about two thirds of this damage. Large-scale artifacts are successfully detected and eliminated.

  11. Experiment list: SRX122555 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available chip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip anti...body catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-7

  12. A single microfluidic chip with dual surface properties for protein drug delivery.

    Science.gov (United States)

    Bokharaei, Mehrdad; Saatchi, Katayoun; Häfeli, Urs O

    2017-04-15

    Principles of double emulsion generation were incorporated in a glass microfluidic chip fabricated with two different surface properties in order to produce protein loaded polymer microspheres. The microspheres were produced by integrating two microfluidic flow focusing systems and a multi-step droplet splitting and mixing system into one chip. The chip consists of a hydrophobic and a hydrophilic section with two different heights, 12μm and 45μm, respectively. As a result, the protein is homogenously distributed throughout the polymer microsphere matrix, not just in its center (which has been studied before). In our work, the inner phase was bovine serum albumin (BSA) in phosphate buffered saline, the disperse phase was poly (lactic acid) in chloroform and the continuous phase was an aqueous solution of poly(vinyl alcohol). After solvent removal, BSA loaded microspheres with an encapsulation efficiency of up to 96% were obtained. Our results show the feasibility of producing microspheres loaded with a hydrophilic drug in a microfluidic system that integrates different microfluidic units into one chip. Copyright © 2017 Elsevier B.V. All rights reserved.

  13. On-chip digital power supply control for system-on-chip applications

    NARCIS (Netherlands)

    Meijer, M.; Pineda de Gyvez, J.; Otten, R.H.J.M.

    2005-01-01

    The authors presented an on-chip, fully-digital, power-supply control system. The scheme consists of two independent control loops that regulate power supply variations due to semiconductor process spread, temperature, and chip's workload. Smart power-switches working as linear voltage regulators

  14. Prediction of 3D chip formation in the facing cutting with lathe machine using FEM

    Science.gov (United States)

    Prasetyo, Yudhi; Tauviqirrahman, Mohamad; Rusnaldy

    2016-04-01

    This paper presents the prediction of the chip formation at the machining process using a lathe machine in a more specific way focusing on facing cutting (face turning). The main purpose is to propose a new approach to predict the chip formation with the variation of the cutting directions i.e., the backward and forward direction. In addition, the interaction between stress analysis and chip formation on cutting process was also investigated. The simulations were conducted using three dimensional (3D) finite element method based on ABAQUS software with aluminum and high speed steel (HSS) as the workpiece and the tool materials, respectively. The simulation result showed that the chip resulted using a backward direction depicts a better formation than that using a conventional (forward) direction.

  15. BioMEMS and Lab-on-a-Chip Course Education at West Virginia University

    Directory of Open Access Journals (Sweden)

    Yuxin Liu

    2011-01-01

    Full Text Available With the rapid growth of Biological/Biomedical MicroElectroMechanical Systems (BioMEMS and microfluidic-based lab-on-a-chip (LOC technology to biological and biomedical research and applications, demands for educated and trained researchers and technicians in these fields are rapidly expanding. Universities are expected to develop educational plans to address these specialized needs in BioMEMS, microfluidic and LOC science and technology. A course entitled BioMEMS and Lab-on-a-Chip was taught recently at the senior undergraduate and graduate levels in the Department of Computer Science and Electrical Engineering at West Virginia University (WVU. The course focused on the basic principles and applications of BioMEMS and LOC technology to the areas of biomedicine, biology, and biotechnology. The course was well received and the enrolled students had diverse backgrounds in electrical engineering, material science, biology, mechanical engineering, and chemistry. Student feedback and a review of the course evaluations indicated that the course was effective in achieving its objectives. Student presentations at the end of the course were a highlight and a valuable experience for all involved. The course proved successful and will continue to be offered regularly. This paper provides an overview of the course as well as some development and future improvements.

  16. Advanced engineering materials and thick film hybrid circuit technology

    International Nuclear Information System (INIS)

    Faisal, S.; Aslam, M.; Mehmood, K.

    2006-01-01

    The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

  17. A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Irmler, C., E-mail: christian.irmler@oeaw.ac.at [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Higuchi, T. [University of Tokyo, Kavli Institute for Physics and Mathematics of the Universe, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8583 (Japan); Ishikawa, A. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Joo, C. [Seoul National University, High Energy Physics Laboratory, 25-107 Shinlim-dong, Kwanak-gu, Seoul 151-742 (Korea, Republic of); Kah, D.H.; Kang, K.H. [Kyungpook National University, Department of Physics, 1370 Sankyuk Dong, Buk Gu, Daegu 702-701 (Korea, Republic of); Rao, K.K. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Kato, E. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Mohanty, G.B. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Negishi, K. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Onuki, Y.; Shimizu, N. [University of Tokyo, Department of Physics, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan); Tsuboyama, T. [KEK, 1-1 Oho, Tsukuba, Ibaraki 305-0801 (Japan); Valentan, M. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria)

    2013-12-21

    B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO{sub 2} system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules.

  18. A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

    International Nuclear Information System (INIS)

    Irmler, C.; Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I.; Higuchi, T.; Ishikawa, A.; Joo, C.; Kah, D.H.; Kang, K.H.; Rao, K.K.; Kato, E.; Mohanty, G.B.; Negishi, K.; Onuki, Y.; Shimizu, N.; Tsuboyama, T.; Valentan, M.

    2013-01-01

    B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO 2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules

  19. Supply chains of forest chip production in Finland

    Energy Technology Data Exchange (ETDEWEB)

    Kaerhae, Kalle (Metsaeteho Oy, Helsinki (Finland)), e-mail: kalle.karha@metsateho.fi

    2010-07-15

    The Metsaeteho study investigated how logging residue chips, stump wood chips, and chips from small sized thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2008. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2008 by these suppliers was 6.5 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected in March-May 2009. The majority of the logging residue chips and chips from small-sized thinning wood were produced using the roadside chipping supply chain in Finland in 2008. The chipping at plant supply chain was also significant in the production of logging residue chips. 70% of all stump wood chips consumed were comminuted at the plant and 29% at terminals. The role of the terminal chipping supply chain was also significant in the production of chips from logging residues and small-sized wood chips. When producing chips from large-sized (rotten) roundwood, nearly a half of chips were comminuted at plants and more than 40% at terminals

  20. Supply systems of forest chip production in Finland

    Energy Technology Data Exchange (ETDEWEB)

    Kaerhae, K. (Metsaeteho Oy, Helsinki (Finland)), e-mail: kalle.karha@metsateho.fi

    2010-07-01

    The Metsaeteho study investigated how logging residue chips, stump wood chips, and chips from small-diameter thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2009. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2009 by these suppliers was 8,4 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected from March-May, 2010. The majority of the logging residue chips and chips from small-diameter thinning wood were produced using the roadside chipping supply system in Finland in 2009. The chipping at plant supply system was also significant in the production of logging residue chips. Nearly 70 % of all stump wood chips consumed were comminuted at the plant and 28 % at terminals. The role of the terminal chipping supply system was also significant in the production of chips from logging residues and small-diameter wood chips. When producing chips from large-sized (rotten) roundwood, similarly roughly 70 % of chips were comminuted at plants and 23 % at terminals. (orig.)

  1. Supply chains of forest chip production in Finland

    Energy Technology Data Exchange (ETDEWEB)

    Kaerhae, K. (Metsaeteho Oy, Helsinki (Finland)), Email: kalle.karha@metsateho.fi

    2009-07-01

    The Metsaeteho study investigated how logging residue chips. stump wood chips, and chips from small-sized thinning wood and large-sized (rotten) roundwood used by heating and power plants were produced in Finland in 2008. Almost all the major forest chip suppliers in Finland were involved in the study. The total volume of forest chips supplied in 2008 by these suppliers was 6,5 TWh. The study was implemented by conducting an e-mail questionnaire survey and telephone interviews. Research data was collected in March-May 2009. The majority of the logging residue chips and chips from small-sized thinning wood were produced using the roadside chipping supply chain in Finland in 2008. The chipping at plant supply chain was also significant in the production of logging residue chips. 70% of all stump wood chips consumed were comminuted at the plant and 29% at terminals. The role of the terminal chipping supply chain was also significant in the production of chips from logging residues and small-sized wood chips. When producing chips from large-sized (rotten) roundwood, nearly a half of chips were comminuted at plants and more than 40 % at terminals. (orig.)

  2. Single chip camera active pixel sensor

    Science.gov (United States)

    Shaw, Timothy (Inventor); Pain, Bedabrata (Inventor); Olson, Brita (Inventor); Nixon, Robert H. (Inventor); Fossum, Eric R. (Inventor); Panicacci, Roger A. (Inventor); Mansoorian, Barmak (Inventor)

    2003-01-01

    A totally digital single chip camera includes communications to operate most of its structure in serial communication mode. The digital single chip camera include a D/A converter for converting an input digital word into an analog reference signal. The chip includes all of the necessary circuitry for operating the chip using a single pin.

  3. Generation of ultrasound in materials using continuous-wave lasers.

    Science.gov (United States)

    Caron, James N; DiComo, Gregory P; Nikitin, Sergei

    2012-03-01

    Generating and detecting ultrasound is a standard method of nondestructive evaluation of materials. Pulsed lasers are used to generate ultrasound remotely in situations that prohibit the use of contact transducers. The scanning rate is limited by the repetition rates of the pulsed lasers, ranging between 10 and 100 Hz for lasers with sufficient pulse widths and energies. Alternately, a high-power continuous-wave laser can be scanned across the surface, creating an ultrasonic wavefront. Since generation is continuous, the scanning rate can be as much as 4 orders of magnitude higher than with pulsed lasers. This paper introduces the concept, comparing the theoretical scanning speed with generation by pulsed laser. © 2012 Optical Society of America

  4. Real-time tunability of chip-based light source enabled by microfluidic mixing

    DEFF Research Database (Denmark)

    Olsen, Brian Bilenberg; Rasmussen, Torben; Balslev, Søren

    2006-01-01

    We demonstrate real-time tunability of a chip-based liquid light source enabled by microfluidic mixing. The mixer and light source are fabricated in SU-8 which is suitable for integration in SU-8-based laboratory-on-a-chip microsystems. The tunability of the light source is achieved by changing...... the concentration of rhodamine 6G dye inside two integrated vertical resonators, since both the refractive index and the gain profile are influenced by the dye concentration. The effect on the refractive index and the gain profile of rhodamine 6G in ethanol is investigated and the continuous tuning of the laser...

  5. Impact of Cutting Forces and Chip Microstructure in High Speed Machining of Carbon Fiber – Epoxy Composite Tube

    Directory of Open Access Journals (Sweden)

    Roy Y. Allwin

    2017-09-01

    Full Text Available Carbon fiber reinforced polymeric (CFRP composite materials are widely used in aerospace, automobile and biomedical industries due to their high strength to weight ratio, corrosion resistance and durability. High speed machining (HSM of CFRP material is needed to study the impact of cutting parameters on cutting forces and chip microstructure which offer vital inputs to the machinability and deformation characteristics of the material. In this work, the orthogonal machining of CFRP was conducted by varying the cutting parameters such as cutting speed and feed rate at high cutting speed/feed rate ranges up to 346 m/min/ 0.446 mm/rev. The impact of the cutting parameters on cutting forces (principal cutting, feed and thrust forces and chip microstructure were analyzed. A significant impact on thrust forces and chip segmentation pattern was seen at higher feed rates and low cutting speeds.

  6. Ultra-thin chip technology and applications

    CERN Document Server

    2010-01-01

    Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

  7. An economic evaluation of a chlorhexidine chip for treating chronic periodontitis: the CHIP (chlorhexidine in periodontitis) study.

    Science.gov (United States)

    Henke, C J; Villa, K F; Aichelmann-Reidy, M E; Armitage, G C; Eber, R M; Genco, R J; Killoy, W J; Miller, D P; Page, R C; Polson, A M; Ryder, M I; Silva, S J; Somerman, M J; Van Dyke, T E; Wolff, L F; Evans, C J; Finkelman, R D

    2001-11-01

    The authors previously suggested that an adjunctive, controlled-release chlorhexidine, or CHX, chip may reduce periodontal surgical needs at little additional cost. This article presents an economic analysis of the CHX chip in general dental practice. In a one-year prospective clinical trial, 484 chronic periodontitis patients in 52 general practices across the United States were treated with either scaling and root planing, or SRP, plus any therapy prescribed by treating, unblinded dentists; or SRP plus other therapy as above but including the CHX chip. Economic data were collected from bills, case report forms and 12-month treatment recommendations from blinded periodontist evaluators. Total dental charges were higher for SRP + CHX chip patients vs. SRP patients when CHX chip costs were included (P = .027) but lower when CHX chip costs were excluded (P = .012). About one-half of the CHX chip acquisition cost was offset by savings in other charges. SRP + CHX chip patients were about 50 percent less likely to undergo surgical procedures than were SRP patients (P = .021). At the end of the trial, periodontist evaluators recommended similar additional procedures for both groups: SRP, about 46 percent; maintenance, about 37 percent; surgery, 56 percent for SRP alone and 63 percent for SRP + CHX chip. Adjunctive CHX chip use for general-practice patients with periodontitis increased costs but reduced surgeries over one year. At study's end, periodontists recommended similar additional surgical treatment for both groups. In general practice, routine use of the CHX chip suggests that costs will be partially offset by reduced surgery over at least one year.

  8. Reconfigurable radio-frequency arbitrary waveforms synthesized in a silicon photonic chip.

    Science.gov (United States)

    Wang, Jian; Shen, Hao; Fan, Li; Wu, Rui; Niu, Ben; Varghese, Leo T; Xuan, Yi; Leaird, Daniel E; Wang, Xi; Gan, Fuwan; Weiner, Andrew M; Qi, Minghao

    2015-01-12

    Photonic methods of radio-frequency waveform generation and processing can provide performance advantages and flexibility over electronic methods due to the ultrawide bandwidth offered by the optical carriers. However, bulk optics implementations suffer from the lack of integration and slow reconfiguration speed. Here we propose an architecture of integrated photonic radio-frequency generation and processing and implement it on a silicon chip fabricated in a semiconductor manufacturing foundry. Our device can generate programmable radio-frequency bursts or continuous waveforms with only the light source, electrical drives/controls and detectors being off-chip. It modulates an individual pulse in a radio-frequency burst within 4 ns, achieving a reconfiguration speed three orders of magnitude faster than thermal tuning. The on-chip optical delay elements offer an integrated approach to accurately manipulating individual radio-frequency waveform features without constraints set by the speed and timing jitter of electronics, and should find applications ranging from high-speed wireless to defence electronics.

  9. 3D stacked chips from emerging processes to heterogeneous systems

    CERN Document Server

    Fettweis, Gerhard

    2016-01-01

    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D I...

  10. InP on SOI devices for optical communication and optical network on chip

    Science.gov (United States)

    Fedeli, J.-M.; Ben Bakir, B.; Olivier, N.; Grosse, Ph.; Grenouillet, L.; Augendre, E.; Phillippe, P.; Gilbert, K.; Bordel, D.; Harduin, J.

    2011-01-01

    For about ten years, we have been developing InP on Si devices under different projects focusing first on μlasers then on semicompact lasers. For aiming the integration on a CMOS circuit and for thermal issue, we relied on SiO2 direct bonding of InP unpatterned materials. After the chemical removal of the InP substrate, the heterostructures lie on top of silicon waveguides of an SOI wafer with a separation of about 100nm. Different lasers or photodetectors have been achieved for off-chip optical communication and for intra-chip optical communication within an optical network. For high performance computing with high speed communication between cores, we developed InP microdisk lasers that are coupled to silicon waveguide and produced 100μW of optical power and that can be directly modulated up to 5G at different wavelengths. The optical network is based on wavelength selective circuits with ring resonators. InGaAs photodetectors are evanescently coupled to the silicon waveguide with an efficiency of 0.8A/W. The fabrication has been demonstrated at 200mm wafer scale in a microelectronics clean room for CMOS compatibility. For off-chip communication, silicon on InP evanescent laser have been realized with an innovative design where the cavity is defined in silicon and the gain localized in the QW of bonded InP hererostructure. The investigated devices operate at continuous wave regime with room temperature threshold current below 100 mA, the side mode suppression ratio is as high as 20dB, and the fibercoupled output power is {7mW. Direct modulation can be achieved with already 6G operation.

  11. Photonic network-on-chip design

    CERN Document Server

    Bergman, Keren; Biberman, Aleksandr; Chan, Johnnie; Hendry, Gilbert

    2013-01-01

    This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing photonic network-on-chip architectures for future many-core high performance chip multiprocessors. The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and network-on-chip theory and existing research, and finishing with describing various architectures, their characteristics, and the impact they will have on a computing system. After acquainting

  12. Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

    DEFF Research Database (Denmark)

    2000-01-01

    towards diaphragm. Surface of the chip (2) has electrical conductors (14) to connect chip with IC chip (3). USE - For use in miniature electroacoustic devices such as hearing aid. ADVANTAGE - Since sound inlet is covered by filter, dust, moisture and other impurities do not obstruct interior and sound...... inlet of microphone. External electrical connection can be made economically reliable and the thermal stress is avoided with the small size solid state silicon based condenser microphone....

  13. High-performance, scalable optical network-on-chip architectures

    Science.gov (United States)

    Tan, Xianfang

    The rapid advance of technology enables a large number of processing cores to be integrated into a single chip which is called a Chip Multiprocessor (CMP) or a Multiprocessor System-on-Chip (MPSoC) design. The on-chip interconnection network, which is the communication infrastructure for these processing cores, plays a central role in a many-core system. With the continuously increasing complexity of many-core systems, traditional metallic wired electronic networks-on-chip (NoC) became a bottleneck because of the unbearable latency in data transmission and extremely high energy consumption on chip. Optical networks-on-chip (ONoC) has been proposed as a promising alternative paradigm for electronic NoC with the benefits of optical signaling communication such as extremely high bandwidth, negligible latency, and low power consumption. This dissertation focus on the design of high-performance and scalable ONoC architectures and the contributions are highlighted as follow: 1. A micro-ring resonator (MRR)-based Generic Wavelength-routed Optical Router (GWOR) is proposed. A method for developing any sized GWOR is introduced. GWOR is a scalable non-blocking ONoC architecture with simple structure, low cost and high power efficiency compared to existing ONoC designs. 2. To expand the bandwidth and improve the fault tolerance of the GWOR, a redundant GWOR architecture is designed by cascading different type of GWORs into one network. 3. The redundant GWOR built with MRR-based comb switches is proposed. Comb switches can expand the bandwidth while keep the topology of GWOR unchanged by replacing the general MRRs with comb switches. 4. A butterfly fat tree (BFT)-based hybrid optoelectronic NoC (HONoC) architecture is developed in which GWORs are used for global communication and electronic routers are used for local communication. The proposed HONoC uses less numbers of electronic routers and links than its counterpart of electronic BFT-based NoC. It takes the advantages of

  14. Experiment list: SRX214086 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available entiated || cell line=KH2 || chip antibody 1=none || chip antibody manufacturer 1=none || chip antibody 2=none || chip antibody manuf...acturer 2=none http://dbarchive.biosciencedbc.jp/kyushu-

  15. Optical lattice on an atom chip

    DEFF Research Database (Denmark)

    Gallego, D.; Hofferberth, S.; Schumm, Thorsten

    2009-01-01

    Optical dipole traps and atom chips are two very powerful tools for the quantum manipulation of neutral atoms. We demonstrate that both methods can be combined by creating an optical lattice potential on an atom chip. A red-detuned laser beam is retroreflected using the atom chip surface as a high......-quality mirror, generating a vertical array of purely optical oblate traps. We transfer thermal atoms from the chip into the lattice and observe cooling into the two-dimensional regime. Using a chip-generated Bose-Einstein condensate, we demonstrate coherent Bloch oscillations in the lattice....

  16. Experiment list: SRX214071 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available Undifferentiated || treatment=Overexpress Sox2-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacturer 2=

  17. Experiment list: SRX214075 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available age=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

  18. Experiment list: SRX214074 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ge=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

  19. Experiment list: SRX214072 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=none || chip antibody manufacture...r 1=none || chip antibody 2=V5 || chip antibody manufacture

  20. An optimized protocol for isolating primary epithelial cell chromatin for ChIP.

    Directory of Open Access Journals (Sweden)

    James A Browne

    Full Text Available A critical part of generating robust chromatin immunoprecipitation (ChIP data is the optimization of chromatin purification and size selection. This is particularly important when ChIP is combined with next-generation sequencing (ChIP-seq to identify targets of DNA-binding proteins, genome-wide. Current protocols refined by the ENCODE consortium generally use a two-step cell lysis procedure that is applicable to a wide variety of cell types. However, the isolation and size selection of chromatin from primary human epithelial cells may often be particularly challenging. These cells tend to form sheets of formaldehyde cross-linked material in which cells are resistant to membrane lysis, nuclei are not released and subsequent sonication produces extensive high molecular weight contamination. Here we describe an optimized protocol to prepare high quality ChIP-grade chromatin from primary human bronchial epithelial cells. The ENCODE protocol was used as a starting point to which we added the following key steps to separate the sheets of formaldehyde-fixed cells prior to lysis. (1 Incubation of the formaldehyde-fixed adherent cells in Trypsin-EDTA (0.25% room temperature for no longer than 5 min. (2 Equilibration of the fixed cells in detergent-free lysis buffers prior to each lysis step. (3 The addition of 0.5% Triton X-100 to the complete cell membrane lysis buffer. (4 Passing the cell suspension (in complete cell membrane lysis buffer through a 25-gauge needle followed by continuous agitation on ice for 35 min. Each step of the modified protocol was documented by light microscopy using the Methyl Green-Pyronin dual dye, which stains cytoplasm red (Pyronin and the nuclei grey-blue (Methyl green. This modified method is reproducibly effective at producing high quality sheared chromatin for ChIP and is equally applicable to other epithelial cell types.

  1. Experiment list: SRX214067 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available fferentiated || cell line=F9 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufacture...r 1=Santa Cruz || chip antibody 2=none || chip antibody manufacturer 2=none http://dbarchive.bioscien

  2. Study on boiling heat transfer from diode elements in an integrated circuit chip

    Energy Technology Data Exchange (ETDEWEB)

    Hijikata, Kunio; Nagasaki, Takao; Kurata, Naoki (Tokyo Institute of Technology Faculty of Engineering (Japan))

    1989-02-25

    By temperature measurement of elements in boiling experiments with diodes in an integrated circuit (IC) chip, characteristics of boiling heat transfer from tiny heat generating elements in an IC chip and thermal transfer characteristics of multiple heating elements adjoining positioned were studied. The Package of an IC was removed by acid to expose the IC chip. Electricity is applied to the diode in the IC to study the heat transfer properties. The heat transfer rate from a tiny heating element on an IC is greater than that from the conventional continual heated surface. In the case of heat generation by two adjoining elements, the relationship between the total amount of heat and the temperature of elements shows the same characteristics as in the case with a single element. The boiling heat transfer properties of an element in an IC chip are influenced by such microstructure surrounding the element as the pattern of wiring. Heat transfer increases with the decreasing size of the heating element by the heat transfer to the substrate beneath the element. 10 refs., 15 figs.

  3. Experiment list: SRX122523 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Irf2 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

  4. Experiment list: SRX122414 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  5. Experiment list: SRX214077 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available erentiated || treatment=Overexpress Sox17_V5 tagged || cell line=KH2 || chip antibody 1=Sox17 || chip antibody manufacture...r 1=R&D || chip antibody 2=V5 || chip antibody manufacturer 2=Invit

  6. Experiment list: SRX122485 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100

  7. Experiment list: SRX122521 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Irf2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

  8. Experiment list: SRX122417 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  9. Experiment list: SRX122520 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Irf2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://

  10. Experiment list: SRX122413 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Junb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http:/

  11. Experiment list: SRX122412 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Junb || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http:/

  12. Experiment list: SRX122406 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Irf1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 http:/

  13. Experiment list: SRX122415 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  14. Experiment list: SRX122416 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catalog ...number 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://d

  15. Experiment list: SRX122565 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat2 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 http:/

  16. Experiment list: SRX122510 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Egr1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog... number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-110 ht

  17. Experiment list: SRX122519 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Irf2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http:

  18. Experiment list: SRX122472 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Runx1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab61753 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-8564 http

  19. Experiment list: SRX122473 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Runx1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab61753 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-8564

  20. Experiment list: SRX122497 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Rel || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http:

  1. Experiment list: SRX122410 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog n...umber 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://db

  2. Experiment list: SRX186172 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 1=YY1 || chip antibody manufacturer 1=Abcam || chip antibody 2=YY1 || chip antibody manufacturer 2=Santa Cru...ip-Seq; Mus musculus; ChIP-Seq source_name=Rag1 -/- pro-B cells || chip antibody

  3. Experiment list: SRX122493 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf4 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab28830-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-200

  4. Experiment list: SRX122571 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat2 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 http

  5. Experiment list: SRX122411 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Junb || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog n...umber 1=ab28838 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-46 http://db

  6. Experiment list: SRX122498 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Rel || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http:

  7. Experiment list: SRX122516 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Irf2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody catalo...g number 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http:

  8. Experiment list: SRX122495 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Rel || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody catal...og number 1=sc-71 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-70 http://

  9. On-chip single photon filtering and multiplexing in hybrid quantum photonic circuits.

    Science.gov (United States)

    Elshaari, Ali W; Zadeh, Iman Esmaeil; Fognini, Andreas; Reimer, Michael E; Dalacu, Dan; Poole, Philip J; Zwiller, Val; Jöns, Klaus D

    2017-08-30

    Quantum light plays a pivotal role in modern science and future photonic applications. Since the advent of integrated quantum nanophotonics different material platforms based on III-V nanostructures-, colour centers-, and nonlinear waveguides as on-chip light sources have been investigated. Each platform has unique advantages and limitations; however, all implementations face major challenges with filtering of individual quantum states, scalable integration, deterministic multiplexing of selected quantum emitters, and on-chip excitation suppression. Here we overcome all of these challenges with a hybrid and scalable approach, where single III-V quantum emitters are positioned and deterministically integrated in a complementary metal-oxide-semiconductor-compatible photonic circuit. We demonstrate reconfigurable on-chip single-photon filtering and wavelength division multiplexing with a foot print one million times smaller than similar table-top approaches, while offering excitation suppression of more than 95 dB and efficient routing of single photons over a bandwidth of 40 nm. Our work marks an important step to harvest quantum optical technologies' full potential.Combining different integration platforms on the same chip is currently one of the main challenges for quantum technologies. Here, Elshaari et al. show III-V Quantum Dots embedded in nanowires operating in a CMOS compatible circuit, with controlled on-chip filtering and tunable routing.

  10. Fabrication of pseudo-spin-MOSFETs using a multi-project wafer CMOS chip

    Science.gov (United States)

    Nakane, R.; Shuto, Y.; Sukegawa, H.; Wen, Z. C.; Yamamoto, S.; Mitani, S.; Tanaka, M.; Inomata, K.; Sugahara, S.

    2014-12-01

    We demonstrate monolithic integration of pseudo-spin-MOSFETs (PS-MOSFETs) using vendor-made MOSFETs fabricated in a low-cost multi-project wafer (MPW) product and lab-made magnetic tunnel junctions (MTJs) formed on the topmost passivation film of the MPW chip. The tunneling magnetoresistance (TMR) ratio of the fabricated MTJs strongly depends on the surface roughness of the passivation film. Nevertheless, after the chip surface was atomically flattened by SiO2 deposition on it and successive chemical-mechanical polish (CMP) process for the surface, the fabricated MTJs on the chip exhibits a sufficiently large TMR ratio (>140%) adaptable to the PS-MOSFET application. The implemented PS-MOSFETs show clear modulation of the output current controlled by the magnetization configuration of the MTJs, and a maximum magnetocurrent ratio of 90% is achieved. These magnetocurrent behaviour is quantitatively consistent with those predicted by HSPICE simulations. The developed integration technique using a MPW CMOS chip would also be applied to monolithic integration of CMOS devices/circuits and other various functional devices/materials, which would open the door for exploring CMOS-based new functional hybrid circuits.

  11. Experiment list: SRX122563 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  12. Experiment list: SRX122564 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  13. Experiment list: SRX122488 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 h

  14. Experiment list: SRX122491 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

  15. Experiment list: SRX122548 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody... catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A

  16. Experiment list: SRX122468 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Rela || treatment=LPS || time=0 min || chip antibody manufacturer 1=Bethyl || chip antibody catalo...g number 1=A301-824A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-372 htt

  17. Experiment list: SRX122561 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  18. Experiment list: SRX122409 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Irf1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody cata...log number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 htt

  19. Experiment list: SRX122487 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Atf3 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 h

  20. Experiment list: SRX122552 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibo...dy catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753

  1. Experiment list: SRX122408 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Irf1 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab52520 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-640 http

  2. Experiment list: SRX122513 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Egr1 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Abcam || chip antibody catal...og number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-110

  3. Experiment list: SRX122567 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 ht

  4. Experiment list: SRX122490 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=30 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

  5. Experiment list: SRX122558 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available hip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antib...ody catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-75

  6. Experiment list: SRX122494 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available hip antibody=Atf4 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab28830-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-2

  7. Experiment list: SRX122557 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available hip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antib...ody catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-75

  8. Experiment list: SRX122492 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=60 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cat...alog number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 htt

  9. Experiment list: SRX122549 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody... catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A

  10. Experiment list: SRX122484 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ntibody=Atf3 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody cata...log number 1=sc-188 || chip antibody manufacturer 2=Abcam || chip antibody catalog number 2=ab70005-100 http

  11. Experiment list: SRX122514 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available tibody=Irf2 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Abcam || chip antibody catalog nu...mber 1=ab65048 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-498 http://db

  12. Experiment list: SRX122570 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 ht

  13. Experiment list: SRX122569 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat2 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody ca...talog number 1=ab53149 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-839 h

  14. Experiment list: SRX122511 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Egr1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Abcam || chip antibody cat...alog number 1=ab54966-100 || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-11

  15. Experiment list: SRX122471 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Rela || treatment=LPS || time=60 min || chip antibody manufacturer 1=Bethyl || chip antibody cat...alog number 1=A301-824A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-372

  16. Experiment list: SRX122554 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ip antibody=Stat1 || treatment=LPS || time=120 min || chip antibody manufacturer 1=Santa Cruz || chip antibo...dy catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753

  17. The FEM simulation of continuous rotary extrusion (CRE) of aluminum alloy AA3003

    Science.gov (United States)

    Rajendran, Nijenthan; Valberg, Henry; Misiolek, Wojciech Z.

    2017-10-01

    Continuous Rotary Extrusion (CRE) process is also known in literature under Conform TM name and it is mainly used for the continuous extrusion of Aluminum and Copper alloys. CRE use a feedstock in the form of rod, powders and chips, which are fed into the groove of the rotating wheel. As the wheel rotates the feedstock moves along with it due to friction with the wheel. Once the feedstock reaches the abutment the material deforms plastically and it is extruded through the die. CRE has lot to offer when compared to other more conventional extrusion processes such as low energy input, no limit in billet length as it is a continuous process as well as improved material physical properties due to plastic deformation under constant parameters. In this work a FEM model has been developed using Deform TM 3D, to study the metal flow and state variables of AA3003 CRE extrusion. The effect of extrusion wheel velocity has been investigated. The results show that increase in wheel velocity will heat up the feedstock metal due to high shear deformation and higher friction, which significantly changes metal flow conditions at the die exit.

  18. Experiment list: SRX122551 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ca...talog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A htt

  19. Experiment list: SRX122546 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody ...catalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A h

  20. Experiment list: SRX122547 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

  1. Experiment list: SRX214084 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available turer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox17-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufac

  2. Experiment list: SRX122544 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

  3. Experiment list: SRX214082 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available facturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...age=Undifferentiated || treatment=Overexpress Sox17EK-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manu

  4. Experiment list: SRX122466 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available p antibody=Relb || treatment=LPS || time=30 min || chip antibody manufacturer 1=Bethyl || chip antibody cata...log number 1=A302-183A || chip antibody manufacturer 2=Santa Cruz || chip antibody catalog number 2=sc-226 h

  5. Experiment list: SRX122545 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available antibody=Stat1 || treatment=LPS || time=0 min || chip antibody manufacturer 1=Santa Cruz || chip antibody c...atalog number 1=sc-346 || chip antibody manufacturer 2=Bethyl || chip antibody catalog number 2=A302-753A ht

  6. Experiment list: SRX214080 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available cturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufa

  7. Experiment list: SRX214081 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available cturer 1=Santa Cruz || chip antibody 2=V5 || chip antibody manufacture...ge=Undifferentiated || treatment=Overexpress Sox2KE-V5 tagged || cell line=KH2 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufa

  8. Non-Magnetic On-Chip Resonant Acousto-Optic Isolator at 780 nm

    Science.gov (United States)

    2017-08-04

    actuator on a piezoelectric substrate. We fabricated the device using only CMOS-compatible dielectric materials with the assistance of e- beam...on-chip, without the use of magnetic fields or magneto-optical materials. Our technical approach was to employ momentum-conservation in photon-phonon...interactions to break the propagation symmetry of light using a unidirectional acoustic pump. This acoustic wave was transduced using an RF-driven SAW

  9. Experiment list: SRX214068 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available inoic acid || cell line=F9 || chip antibody 1=Pou5f1/Oct4 || chip antibody manufacturer 1=Santa Cruz || chip... antibody 2=none || chip antibody manufacturer 2=none http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachDat

  10. Optimum Compressive Strength of Hardened Sandcrete Building Blocks with Steel Chips

    Directory of Open Access Journals (Sweden)

    Alohan Omoregie

    2013-02-01

    Full Text Available The recycling of steel chips into an environmentally friendly, responsive, and profitable commodity in the manufacturing and construction industries is a huge and difficult challenge. Several strategies designed for the management and processing of this waste in developed countries have been largely unsuccessful in developing countries mainly due to its capital-intensive nature. To this end, this investigation attempts to provide an alternative solution to the recycling of this material by maximizing its utility value in the building construction industry. This is to establish their influence on the compressive strength of sandcrete hollow blocks and solid cubes with the aim of specifying the range percent of steel chips for the sandcrete optimum compressive strength value. This is particularly important for developing countries in sub-Saharan Africa, and even Latin America where most sandcrete blocks exhibit compressive strengths far below standard requirements. Percentages of steel chips relative to the weight of cement were varied and blended with the sand in an attempt to improve the sand grading parameters. The steel chips variations were one, two, three, four, five, ten and fifteen percent respectively. It was confirmed that the grading parameters were improved and there were significant increases in the compressive strength of the blocks and cube samples. The greatest improvement was noticed at four percent steel chips and sand combination. Using the plotted profile, the margin of steel chips additions for the optimum compressive strength was also established. It is recommended that steel chip sandcrete blocks are suitable for both internal load bearing, and non-load bearing walls, in areas where they are not subjected to moisture ingress. However, for external walls, and in areas where they are liable to moisture attack after laying, the surfaces should be well rendered. Below ground level, the surfaces should be coated with a water

  11. Large power microwave nonlinear effects on multifunction amplifier chip for Ka-band T/R module of phased array radar

    Science.gov (United States)

    Guo, Guo; Gu, Ling; Wu, Ruowu; Xu, Xiong; Zhou, Taifu; Niu, Xinjian; Liu, Yinghui; Wang, Hui; Wei, Yanyu; Guo, Changyong

    2017-12-01

    Nonlinear effects of large power millimeter wave on critical chips for the T/R module of phased array radar is experimental studied and analyzed in this paper. A multifunction amplifier chip is selected for our experiments. A solid continuous wave (CW) source and a large power pulsed magnetron are both employed to generate the Ka-band microwave. The input-output characteristics, the degradation and destroy threshold of the chips are obtained through a series of experimental tests. At last, the results are given by figures and analyzed theoretically.

  12. Apparatus and method for continuous production of materials

    Science.gov (United States)

    Chang, Chih-hung; Jin, Hyungdae

    2014-08-12

    Embodiments of a continuous-flow injection reactor and a method for continuous material synthesis are disclosed. The reactor includes a mixing zone unit and a residence time unit removably coupled to the mixing zone unit. The mixing zone unit includes at least one top inlet, a side inlet, and a bottom outlet. An injection tube, or plurality of injection tubes, is inserted through the top inlet and extends past the side inlet while terminating above the bottom outlet. A first reactant solution flows in through the side inlet, and a second reactant solution flows in through the injection tube(s). With reference to nanoparticle synthesis, the reactant solutions combine in a mixing zone and form nucleated nanoparticles. The nucleated nanoparticles flow through the residence time unit. The residence time unit may be a single conduit, or it may include an outer housing and a plurality of inner tubes within the outer housing.

  13. ALICE chip processor

    CERN Multimedia

    Maximilien Brice

    2003-01-01

    This tiny chip provides data processing for the time projection chamber on ALICE. Known as the ALICE TPC Read Out (ALTRO), this device was designed to minimize the size and power consumption of the TPC front end electronics. This single chip contains 16 low-power analogue-to-digital converters with six million transistors of digital processing and 8 kbits of data storage.

  14. 27 CFR 19.318 - Addition of caramel to rum or brandy and addition of oak chips to spirits.

    Science.gov (United States)

    2010-04-01

    ... or brandy and addition of oak chips to spirits. 19.318 Section 19.318 Alcohol, Tobacco Products and... PLANTS Production § 19.318 Addition of caramel to rum or brandy and addition of oak chips to spirits. Caramel possessing no material sweetening properties may be added to rum or brandy on bonded premises...

  15. Nitrogen Immobilization in Plant Growth Substrates: Clean Chip Residual, Pine Bark, and Peatmoss

    Directory of Open Access Journals (Sweden)

    Cheryl R. Boyer

    2012-01-01

    Full Text Available Rising costs of potting substrates have caused horticultural growers to search for alternative, lower-cost materials. Objectives of this study were to determine the extent of nitrogen immobilization and microbial respiration in a high wood-fiber content substrate, clean chip residual. Microbial activity and nitrogen availability of two screen sizes (0.95 cm and 0.48 cm of clean chip residual were compared to control treatments of pine bark and peatmoss in a 60-day incubation experiment. Four rates (0, 1, 2, or 3 mg of supplemental nitrogen were assessed. Peatmoss displayed little microbial respiration over the course of the study, regardless of nitrogen rate; followed by pine bark, 0.95 cm clean chip residual, and 0.48 cm clean chip residual. Respiration increased with increasing nitrogen. Total inorganic nitrogen (plant available nitrogen was greatest with peatmoss; inorganic nitrogen in other treatments were similar at the 0, 1, and 2 mg supplemental nitrogen rates, while an increase occurred with the highest rate (3 mg. Clean chip residual and pine bark were similar in available nitrogen compared to peatmoss. This study suggests that nitrogen immobilization in substrates composed of clean chip residual is similar to pine bark and can be treated with similar fertilizer amendments during nursery production.

  16. Continuous welding of unidirectional fiber reinforced thermoplastic tape material

    Science.gov (United States)

    Schledjewski, Ralf

    2017-10-01

    Continuous welding techniques like thermoplastic tape placement with in situ consolidation offer several advantages over traditional manufacturing processes like autoclave consolidation, thermoforming, etc. However, still there is a need to solve several important processing issues before it becomes a viable economic process. Intensive process analysis and optimization has been carried out in the past through experimental investigation, model definition and simulation development. Today process simulation is capable to predict resulting consolidation quality. Effects of material imperfections or process parameter variations are well known. But using this knowledge to control the process based on online process monitoring and according adaption of the process parameters is still challenging. Solving inverse problems and using methods for automated code generation allowing fast implementation of algorithms on targets are required. The paper explains the placement technique in general. Process-material-property-relationships and typical material imperfections are described. Furthermore, online monitoring techniques and how to use them for a model based process control system are presented.

  17. Computer Simulation of Replaceable Many Sider Plates (RMSP) with Enhanced Chip-Breaking Characteristics

    OpenAIRE

    Korchuganova, Mariya Anatolievna; Syrbakov, Andrey Pavlovich; Chernysheva, Tatiana Yurievna; Ivanov, G.; Gnedasch, E.

    2016-01-01

    Out of all common chip curling methods, a special tool face form has become the most widespread which is developed either by means of grinding or by means of profile pressing in the production process of RMSP. Currently, over 15 large tool manufacturers produce tools using instrument materials of over 500 brands. To this, we must add a large variety of tool face geometries, which purpose includes the control over form and dimensions of the chip. Taking into account all the many processed mate...

  18. Driving the SID chip: Assembly language, composition, and sound design for the C64

    Directory of Open Access Journals (Sweden)

    James Newman

    2017-12-01

    Full Text Available The MOS6581, more commonly known as the Sound Interface Device, or SID chip, was the sonic heart of the Commodore 64 home computer. By considering the chip’s development, specification, uses and creative abuses by composers and programmers, alongside its continuing legacy, this paper argues that, more than any other device, the SID chip is responsible for shaping the sound of videogame music. Compared with the brutal atonality of chips such as Atari’s TIA, the SID chip offers a complex 3-channel synthesizer with dynamic waveform selection, per-channel ADSR envelopes, multi-mode filter, ring and cross modulation. However, while the specification is sophisticated, the exploitation of the vagaries and imperfections of the chip are just as significant to its sonic character. As such, the compositional, sound design and programming techniques developed by 1980s composer-coders like Rob Hubbard and Martin Galway are central in defining the distinctive sound of C64 gameplay. Exploring the affordances of the chip and the distinctive ways they were harnessed, the argument of this paper centers on the inexorable link between the technological and the musical. Crucially, composers like Hubbard et al. developed their own bespoke low-level drivers to interface with the SID chip to create pseudo-polyphony through rapid arpeggiation and channel sharing, drum synthesis through waveform manipulation, portamento, and even sample playback. This paper analyses the indivisibility of sound design, synthesis and composition in the birth of these musical forms and aesthetics, and assesses their impact on what would go on to be defined as chiptunes.

  19. Pin-count reduction for continuous flow microfluidic biochips

    DEFF Research Database (Denmark)

    Schneider, Alexander; Pop, Paul; Madsen, Jan

    2017-01-01

    Microfluidic biochips are replacing the conventional biochemical analyzers integrating the necessary functions on-chip. We are interested in flow-based biochips, where a continuous flow of liquid is manipulated using integrated microvalves, controlled from external pressure sources via off...

  20. A continuous-discontinuous approach to simulate failure of quasi-brittle materials

    NARCIS (Netherlands)

    Moonen, P.; Sluys, L.J.; Carmeliet, J.

    2009-01-01

    A continuous-discontinuous approach to simulate failure is presented. The formulation covers both diffuse damage processes in the bulk material as well as the initiation and propagation of discrete cracks. Comparison with experimental data on layered sandstone shows that the modeling strategy

  1. Interface analysis of embedded chip resistor device package and its effect on drop shock reliability.

    Science.gov (United States)

    Park, Se-Hoon; Kim, Sun Kyoung; Kim, Young-Ho

    2012-04-01

    In this study, the drop reliability of an embedded passive package is investigated under JESD22-B111 condition. Chip resistors were buried in a PCB board, and it was electrically interconnected by electroless and electrolytic copper plating on a tin pad of a chip resistor without intermetallic phase. However tin, nickel, and copper formed a complex intermetallic phase, such as (Cu, Ni)6Sn5, (Cu, Ni)3Sn, and (Ni, Cu)3Sn2, at the via interface and via wall after reflow and aging. Since the amount of the tin layer was small compared with the solder joint, excessive intermetallic layer growth was not observed during thermal aging. Drop failures are always initiated at the IMC interface, and as aging time increases Cu-Sn-Ni IMC phases are transformed continuously due to Cu diffusion. We studied the intermetallic formation of the Cu via interface and simulated the stress distribution of drop shock by using material properties and board structure of embedded passive boards. The drop simulation was conducted according to the JEDEC standard. It was revealed that the crack starting point related to failure fracture changed due to intermetallic phase transformation along the via interface, and the position where failure occurs experimentally agrees well with our simulation results.

  2. Development of rapid, continuous calibration techniques and implementation as a prototype system for civil engineering materials evaluation

    International Nuclear Information System (INIS)

    Scott, M. L.; Gagarin, N.; Mekemson, J. R.; Chintakunta, S. R.

    2011-01-01

    Until recently, civil engineering material calibration data could only be obtained from material sample cores or via time consuming, stationary calibration measurements in a limited number of locations. Calibration data are used to determine material propagation velocities of electromagnetic waves in test materials for use in layer thickness measurements and subsurface imaging. Limitations these calibration methods impose have been a significant impediment to broader use of nondestructive evaluation methods such as ground-penetrating radar (GPR). In 2006, a new rapid, continuous calibration approach was designed using simulation software to address these measurement limitations during a Federal Highway Administration (FHWA) research and development effort. This continuous calibration method combines a digitally-synthesized step-frequency (SF)-GPR array and a data collection protocol sequence for the common midpoint (CMP) method. Modeling and laboratory test results for various data collection protocols and materials are presented in this paper. The continuous-CMP concept was finally implemented for FHWA in a prototype demonstration system called the Advanced Pavement Evaluation (APE) system in 2009. Data from the continuous-CMP protocol is processed using a semblance/coherency analysis to determine material propagation velocities. Continuously calibrated pavement thicknesses measured with the APE system in 2009 are presented. This method is efficient, accurate, and cost-effective.

  3. XA readout chip characteristics and CdZnTe spectral measurements

    International Nuclear Information System (INIS)

    Barbier, L.M.; Birsa, F.; Odom, J.

    1999-01-01

    The authors report on the performance of a CdZnTe (CZT) array readout by an XA (X-ray imaging chip produced at the AMS foundry) application specific readout chip (ASIC). The array was designed and fabricated at NASA/Goddard Space Flight Center (GSFC) as a prototype for the Burst Arc-Second Imaging and Spectroscopy gamma-ray instrument. The XA ASIC was obtained from Integrated Detector and Electronics (IDE), in Norway. Performance characteristics and spectral data for 241 Am are presented both at room temperature and at -20 C. The measured noise (σ) was 2.5 keV at 60 keV at room temperature. This paper represents a progress report on work with the XA ASIC and CZT detectors. Work is continuing and in particular, larger arrays are planned for future NASA missions

  4. Core-shell magnetic nanoparticles for on-chip RF inductors

    KAUST Repository

    Koh, Kisik

    2013-01-01

    FeNi3 based core-shell magnetic nanoparticles are demonstrated as the magnetic core material for on-chip, radio frequency (RF) inductors. FeNi3 nanoparticles with 50-150 nm in diameter with 15-20 nm-thick SiO2 coating are chemically synthesized and deposited on a planar inductor as the magnetic core to enhance both inductance (L) and quality factor (Q) of the inductor. Experimentally, the ferromagnetic resonant frequency of the on-chip inductors based on FeNi3 core-shell nanoparticles has been shown to be over several GHz. A post-CMOS process has been developed to integrate the magnetic nanoparticles to a planar inductor and inductance enhancements up to 50% of the original magnitude with slightly enhanced Q-factor up to 1 GHz have been achieved. © 2013 IEEE.

  5. Experimental and theoretical analysis of integrated circuit (IC) chips on flexible substrates subjected to bending

    Science.gov (United States)

    Chen, Ying; Yuan, Jianghong; Zhang, Yingchao; Huang, Yonggang; Feng, Xue

    2017-10-01

    The interfacial failure of integrated circuit (IC) chips integrated on flexible substrates under bending deformation has been studied theoretically and experimentally. A compressive buckling test is used to impose the bending deformation onto the interface between the IC chip and the flexible substrate quantitatively, after which the failed interface is investigated using scanning electron microscopy. A theoretical model is established based on the beam theory and a bi-layer interface model, from which an analytical expression of the critical curvature in relation to the interfacial failure is obtained. The relationships between the critical curvature, the material, and the geometric parameters of the device are discussed in detail, providing guidance for future optimization flexible circuits based on IC chips.

  6. Chemical changes and increased degradability of wheat straw and oak wood chips treated with the white rot fungi Ceriporiopsis subvermispora and Lentinula edodes

    NARCIS (Netherlands)

    Kuijk, van Sandra J.A.; Sonnenberg, Anton S.M.; Baars, Johan J.P.; Hendriks, Wouter H.; Río, del José C.; Rencoret, Jorge; Gutiérrez, Ana; Ruijter, de Norbert C.A.; Cone, John W.

    2017-01-01

    Wheat straw and oak wood chips were incubated with Ceriporiopsis subvermispora and Lentinula edodes for 8 weeks. Samples from the fungal treated substrates were collected every week for chemical characterization. L. edodes continuously grew during the 8 weeks on both wheat straw and oak wood chips,

  7. Thermal interface material characterization for cryogenic electronic packaging solutions

    Science.gov (United States)

    Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

    2017-12-01

    As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

  8. Modification of Cell Wall Polysaccharides during Drying Process Affects Texture Properties of Apple Chips

    Directory of Open Access Journals (Sweden)

    Min Xiao

    2018-01-01

    Full Text Available The influences of hot air drying (AD, medium- and short-wave infrared drying (IR, instant controlled pressure drop drying (DIC, and vacuum freeze drying (FD on cell wall polysaccharide modification were studied, and the relationship between the modifications and texture properties was analyzed. The results showed that the DIC treated apple chips exhibited the highest crispness (92 and excellent honeycomb-like structure among all the dried samples, whereas the FD dried apple chips had low crispness (10, the minimum hardness (17.4 N, and the highest volume ratio (0.76 and rehydration ratio (7.55. Remarkable decreases in the contents of total galacturonic acid and the amounts of water extractable pectin (WEP were found in all the dried apple chips as compared with the fresh materials. The highest retention of WEP fraction (102.7 mg/g AIR was observed in the FD dried apple chips, which may lead to a low structural rigidity and may be partially responsible for the lower hardness of the FD apple chips. In addition, the crispness of the apple chips obtained by DIC treatment, as well as AD and IR at 90°C, was higher than that of the samples obtained from the other drying processes, which might be due to the severe degradation of pectic polysaccharides, considering the results of the amounts of pectic fractions, the molar mass distribution, and concentrations of the WEP fractions. Overall, the data suggested that the modifications of pectic polysaccharides of apple chips, including the amount of the pectic fractions and their structural characteristics and the extent of degradation, significantly affect the texture of apple chips.

  9. Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design

    Directory of Open Access Journals (Sweden)

    Oluwole John Famoriji

    2017-01-01

    Full Text Available Wireless chip area network which enables wireless communication among chips fosters development in wireless communication and it is envisioned that future hardware system and developmental functionality will require multimaterial. However, the traditional system architecture is limited by channel bandwidth-limited interfaces, throughput, delay, and power consumption and as a result limits the efficiency and system performance. Wireless interconnect has been proposed to overcome scalability and performance limitations of multihop wired architectures. Characterization and modeling of channel become more important for specification of choice of modulation or demodulation techniques, channel bandwidths, and other mitigation techniques for channel distortion and interference such as equalization. This paper presents an analytical channel model for characterization, modeling, and analysis of wireless chip-to-chip or interchip interconnects in wireless chip area network with a particular focus on large-scale analysis. The proposed model accounts for both static and dynamic channel losses/attenuation in high-speed systems. Simulation and evaluation of the model with experimental data conducted in a computer desktop casing depict that proposed model matched measurement data very closely. The transmission of EM waves via a medium introduces molecular absorption due to various molecules within the material substance. This model is a representative of channel loss profile in wireless chip-area-network communication and good for future electronic circuits and high-speed systems design.

  10. Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries

    Directory of Open Access Journals (Sweden)

    Shantonu Biswas

    2016-03-01

    Full Text Available This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical connection process is driven by the surface free energy of molten solder bumps where the authors have made a contribution. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current robotic pick and place and serial wire bonding concepts. The following parts will be discussed: (2 Single-step assembly of LED arrays containing a repetition of a single component type; (3 Multi-step assembly of more than one component type adding a sequence and geometrical shape confinement to the basic concept to build more complex structures; demonstrators contain (3.1 self-packaging surface mount devices, and (3.2 multi-chip assemblies with unique angular orientation. Subsequently, measures are discussed (4 to enable the assembly of microscopic chips (10 μm–1 mm; a different transport method is introduced; demonstrators include the assembly of photovoltaic modules containing microscopic silicon tiles. Finally, (5 the extension to enable large area assembly is presented; a first reel-to-reel assembly machine is realized; the machine is applied to the field of solid state lighting and the emerging field of stretchable electronics which requires the assembly and electrical connection of semiconductor devices over exceedingly large area substrates.

  11. Thermal Characterization of Nanostructures and Advanced Engineered Materials

    Science.gov (United States)

    Goyal, Vivek Kumar

    Continuous downscaling of Si complementary metal-oxide semiconductor (CMOS) technology and progress in high-power electronics demand more efficient heat removal techniques to handle the increasing power density and rising temperature of hot spots. For this reason, it is important to investigate thermal properties of materials at nanometer scale and identify materials with the extremely large or extremely low thermal conductivity for applications as heat spreaders or heat insulators in the next generation of integrated circuits. The thin films used in microelectronic and photonic devices need to have high thermal conductivity in order to transfer the dissipated power to heat sinks more effectively. On the other hand, thermoelectric devices call for materials or structures with low thermal conductivity because the performance of thermoelectric devices is determined by the figure of merit Z=S2sigma/K, where S is the Seebeck coefficient, K and sigma are the thermal and electrical conductivity, respectively. Nanostructured superlattices can have drastically reduced thermal conductivity as compared to their bulk counterparts making them promising candidates for high-efficiency thermoelectric materials. Other applications calling for thin films with low thermal conductivity value are high-temperature coatings for engines. Thus, materials with both high thermal conductivity and low thermal conductivity are technologically important. The increasing temperature of the hot spots in state-of-the-art chips stimulates the search for innovative methods for heat removal. One promising approach is to incorporate materials, which have high thermal conductivity into the chip design. Two suitable candidates for such applications are diamond and graphene. Another approach is to integrate the high-efficiency thermoelectric elements for on-spot cooling. In addition, there is strong motivation for improved thermal interface materials (TIMs) for heat transfer from the heat-generating chip

  12. Mapping three-dimensional temperature in microfluidic chip.

    KAUST Repository

    Wu, Jinbo

    2013-11-25

    Three-dimensional (3D) temperature mapping method with high spatial resolution and acquisition rate is of vital importance in evaluating thermal processes in micro-environment. We have synthesized a new temperature-sensitive functional material (Rhodamine B functionalized Polydimethylsiloxane). By performing optical sectioning of this material, we established an advanced method for visualizing the micro-scale 3D thermal distribution inside microfluidic chip with down to 10 ms temporal resolution and 2 ~ 6 °C temperature resolution depending the capture parameters. This method is successfully applied to monitor the local temperature variation throughout micro-droplet heat transfer process and further reveal exothermic nanoliter droplet reactions to be unique and milder than bench-top experiment.

  13. Dust Emission Induced By Friction Modifications At Tool Chip Interface In Dry Machining In MMCp

    International Nuclear Information System (INIS)

    Kremer, Arnaud; El Mansori, Mohamed

    2011-01-01

    This paper investigates the relationship between dust emission and tribological conditions at the tool-chip interface when machining Metal Matrix composite reinforced with particles (MMCp) in dry mode. Machining generates aerosols that can easily be inhaled by workers. Aerosols may be composed of oil mist, tool material or alloying elements of workpiece material. Bar turning tests were conducted on a 2009 aluminum alloy reinforced with different level of Silicon Carbide particles (15, 25 and 35% of SiCp). Variety of PCD tools and nanostructured diamond coatings were used to analyze their performances on air pollution. A spectrometer was used to detect airborne aerosol particles in the size range between 0.3μm to 20 μm and to sort them in 15 size channels in real time. It was used to compare the effects of test parameters on dust emission. Observations of tool face and chip morphology reveal the importance of friction phenomena. It was demonstrated that level of friction modifies chip curvature and dust emission. The increase of level of reinforcement increase the chip segmentation and decrease the contact length and friction area. A ''running in'' phenomenon with important dust emission appeared with PCD tool due to the tool rake face flatness. In addition dust generation is more sensitive to edge integrity than power consumption.

  14. Dust Emission Induced By Friction Modifications At Tool Chip Interface In Dry Machining In MMCp

    Science.gov (United States)

    Kremer, Arnaud; El Mansori, Mohamed

    2011-01-01

    This paper investigates the relationship between dust emission and tribological conditions at the tool-chip interface when machining Metal Matrix composite reinforced with particles (MMCp) in dry mode. Machining generates aerosols that can easily be inhaled by workers. Aerosols may be composed of oil mist, tool material or alloying elements of workpiece material. Bar turning tests were conducted on a 2009 aluminum alloy reinforced with different level of Silicon Carbide particles (15, 25 and 35% of SiCp). Variety of PCD tools and nanostructured diamond coatings were used to analyze their performances on air pollution. A spectrometer was used to detect airborne aerosol particles in the size range between 0.3μm to 20 μm and to sort them in 15 size channels in real time. It was used to compare the effects of test parameters on dust emission. Observations of tool face and chip morphology reveal the importance of friction phenomena. It was demonstrated that level of friction modifies chip curvature and dust emission. The increase of level of reinforcement increase the chip segmentation and decrease the contact length and friction area. A "running in" phenomenon with important dust emission appeared with PCD tool due to the tool rake face flatness. In addition dust generation is more sensitive to edge integrity than power consumption.

  15. Automated, Ultra-Sterile Solid Sample Handling and Analysis on a Chip

    Science.gov (United States)

    Mora, Maria F.; Stockton, Amanda M.; Willis, Peter A.

    2013-01-01

    There are no existing ultra-sterile lab-on-a-chip systems that can accept solid samples and perform complete chemical analyses without human intervention. The proposed solution is to demonstrate completely automated lab-on-a-chip manipulation of powdered solid samples, followed by on-chip liquid extraction and chemical analysis. This technology utilizes a newly invented glass micro-device for solid manipulation, which mates with existing lab-on-a-chip instrumentation. Devices are fabricated in a Class 10 cleanroom at the JPL MicroDevices Lab, and are plasma-cleaned before and after assembly. Solid samples enter the device through a drilled hole in the top. Existing micro-pumping technology is used to transfer milligrams of powdered sample into an extraction chamber where it is mixed with liquids to extract organic material. Subsequent chemical analysis is performed using portable microchip capillary electrophoresis systems (CE). These instruments have been used for ultra-highly sensitive (parts-per-trillion, pptr) analysis of organic compounds including amines, amino acids, aldehydes, ketones, carboxylic acids, and thiols. Fully autonomous amino acid analyses in liquids were demonstrated; however, to date there have been no reports of completely automated analysis of solid samples on chip. This approach utilizes an existing portable instrument that houses optics, high-voltage power supplies, and solenoids for fully autonomous microfluidic sample processing and CE analysis with laser-induced fluorescence (LIF) detection. Furthermore, the entire system can be sterilized and placed in a cleanroom environment for analyzing samples returned from extraterrestrial targets, if desired. This is an entirely new capability never demonstrated before. The ability to manipulate solid samples, coupled with lab-on-a-chip analysis technology, will enable ultraclean and ultrasensitive end-to-end analysis of samples that is orders of magnitude more sensitive than the ppb goal given

  16. Laboratory Studies of Cometary Materials - Continuity Between Asteroid and Comet

    Science.gov (United States)

    Messenger, Scott; Walker, Robert M.

    2015-01-01

    Laboratory analysis of cometary samples have been enabled by collection of cometary dust in the stratosphere by high altitude aircraft and by the direct sampling of the comet Wild-2 coma by the NASA Stardust spacecraft. Cometary materials are composed of a complex assemblage of highly primitive, unprocessed interstellar and primordial solar system materials as well as a variety of high temperature phases that must have condensed in the inner regions of the protoplanetary disk. These findings support and contradict conclusions of comet properties based solely on astronomical observations. These sample return missions have instead shown that there is a continuity of properties between comets and asteroids, where both types of materials show evidence for primitive and processed materials. Furthermore, these findings underscore the importance and value of direct sample return. There will be great value in comparing the findings of the Stardust cometary coma sample return mission with those of future asteroid surface sample returns OSIRIS-REx and Hayabusa II as well as future comet nucleus sample returns.

  17. Computer Simulation of Replaceable Many Sider Plates (RMSP) with Enhanced Chip-Breaking Characteristics

    Science.gov (United States)

    Korchuganova, M.; Syrbakov, A.; Chernysheva, T.; Ivanov, G.; Gnedasch, E.

    2016-08-01

    Out of all common chip curling methods, a special tool face form has become the most widespread which is developed either by means of grinding or by means of profile pressing in the production process of RMSP. Currently, over 15 large tool manufacturers produce tools using instrument materials of over 500 brands. To this, we must add a large variety of tool face geometries, which purpose includes the control over form and dimensions of the chip. Taking into account all the many processed materials, specific tasks of the process planner, requirements to the quality of manufactured products, all this makes the choice of a proper tool which can perform the processing in the most effective way significantly harder. Over recent years, the nomenclature of RMSP for lathe tools with mechanical mounting has been considerably broadened by means of diversification of their faces

  18. Optimal selection of TLD chips

    International Nuclear Information System (INIS)

    Phung, P.; Nicoll, J.J.; Edmonds, P.; Paris, M.; Thompson, C.

    1996-01-01

    Large sets of TLD chips are often used to measure beam dose characteristics in radiotherapy. A sorting method is presented to allow optimal selection of chips from a chosen set. This method considers the variation

  19. MASSAHAKE whole tree harvesting method for pulp raw-material and fuel -- R&D in 1993--1998

    Energy Technology Data Exchange (ETDEWEB)

    Asplund, D.A.; Ahonen, M.A. [Technical Research Centre of Finland, Jyvaeskylae (Finland)

    1993-12-31

    In Finland biofuels and hydropower are the only indigenous fuels available. Peat, wood and wood derived fuels form about 18% of total primary energy requirement. The largest wood and wood fuel user in Finland is wood processing industry, paper, pulp, sawmills. Due to silvicultural activities the growth of forests has developed an instant need for first thinnings. This need is about 12% of total stem wood growth. With conventional harvesting methods this would produce about 8 mill. m{sup 3} pulp raw material and 2 mill. m{sup 3} wood fuel. By using integrated harvesting methods about 12 mill. m{sup 3} pulp raw material and 8 mill. m{sup 3} (about 1, 3 mill. toe) fuel could be produced. At the moment, there is no economically profitable method for harvesting first thinning trees for industrial use or energy production. Hence, there are a few ongoing research projects aiming at solving the question of integrated harvesting. MASSAHAKE chip purification method has been under R&D since 1987. Research with continuous experimental line (capacity 5--10 loose-m{sup 3}) has been done in 1991 and 1992. The research has concentrated on pine whole tree chip treatment, but preliminary tests with birch whole tree chips has been done. The experiment line will be modified for birth whole tree chips during 1993. Based on the research results more than 60% of the whole tree chips can be separated to pulp raw material with < 1% bark content. This amount is 1.5--2 times more than with present technology. The yield of fuel fraction is 2--4 times higher compared to present methods. Fuel fraction is homogeneous and could be used in most furnaces for energy production. By replacing fossil fuels with wood fuel in energy production it is possible to reduce CO{sub 2}-emissions significantly. This paper presents the wood fuel research areas in Finland and technical potential of MASSAHAKE-method including the plant for building a demonstration plant based on this technology.

  20. Applications of Continuous-Flow Photochemistry in Organic Synthesis, Material Science, and Water Treatment.

    Science.gov (United States)

    Cambié, Dario; Bottecchia, Cecilia; Straathof, Natan J W; Hessel, Volker; Noël, Timothy

    2016-09-14

    Continuous-flow photochemistry in microreactors receives a lot of attention from researchers in academia and industry as this technology provides reduced reaction times, higher selectivities, straightforward scalability, and the possibility to safely use hazardous intermediates and gaseous reactants. In this review, an up-to-date overview is given of photochemical transformations in continuous-flow reactors, including applications in organic synthesis, material science, and water treatment. In addition, the advantages of continuous-flow photochemistry are pointed out and a thorough comparison with batch processing is presented.

  1. Methods for size classification of wood chips

    Energy Technology Data Exchange (ETDEWEB)

    Hartmann, Hans; Boehm, Thorsten [Technologie- und Foerderzentrum im Kompetenzzentrum fuer Nachwachsende Rohstoffe (TFZ), Schulgasse 18, D-94315 Straubing (Germany); Daugbjerg Jensen, Peter [Forest and Landscape FLD, The Royal Veterinary and Agricultural University, Rolighedsvej 23, DK-1958 Frederiksberg C (Denmark); Temmerman, Michaeel; Rabier, Fabienne [Centre wallon de Recherches agronomiques CRA-W Departement Genie rural, 146, Chaussee de Namur, B-5030 Gembloux (Belgium); Golser, Michael [Holzforschung Austria HFA Franz Grill-Stra beta e 7, A-1031 Wien (Austria)

    2006-11-15

    Methods for size classification of wood chips were analysed in an international round robin using 13 conventional wood chip samples and two specially prepared standard samples, one from wood chips and one from hog fuel. The true size distribution of these two samples (according to length, width and height) had been determined stereometrically (reference method) using a digital calliper gauge and by weighing each of the about 7000 wood particles per sample. Five different horizontal and three rotary screening devices were tested using five different screen hole diameters (3.15, 8, 16, 45, 63mm, round holes). These systems are compared to a commercially available continuously measuring image analysis equipment. The results show that among the devices of a measuring principle-horizontal and rotary screening-the results are quite comparable, while there is a severe incompatibility when distributions are determined by different measuring principles. Highest conformity with the reference values is given for measurements with an image analysis system, whereas for all machines with horizontal screens the median value of the size distribution only reached between one-third to half of the reference median value for the particle length distribution. These deviations can be attributed to a higher particle misplacement, which is particularly found in the larger fractions. Such differences decrease when the particle's shape is more roundish (i.e. sphericity closer to one). The median values of length distributions from screenings with a rotary classifier are between the measurements from an image analysis and horizontal screening devices. (author)

  2. Experiment list: SRX110782 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e3 (ab6002, abcam), Pol II (CTD4H8, Millipore) || chip antibody 1 manufacturer=ab...cam || chip antibody 2=Pol II (CTD4H8, Millipore) || chip antibody 2 manufacturer=Millipore http://dbarchive

  3. Continuous weighing of conveyor-transported materials based on gamma radiation conversion to electric current

    International Nuclear Information System (INIS)

    The principle is described of the continuous weighing of conveyer-transported materials applied in the food industry. The weighing technique is based on the measurement of the absorption of gamma radiation emitted by a source located behind the material to be scaled. (Z.M.)

  4. Integrated optoelectronic materials and circuits for optical interconnects

    International Nuclear Information System (INIS)

    Hutcheson, L.D.

    1988-01-01

    Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

  5. Avaliação da aceitação de "chips" de mandioca Acceptance evaluation of cassava chips

    Directory of Open Access Journals (Sweden)

    Regina Kitagawa Grizotto

    2003-12-01

    Full Text Available Pré-tratamentos como o cozimento, a fermentação natural e a secagem parcial foram aplicados em raízes de mandioca, visando a obtenção de "chips" comestíveis. A avaliação sensorial foi feita com base na aceitação e aparência dos "chips" das variedades IAC Mantiqueira e IAC 576.70. Trinta consumidores potenciais do produto foram selecionados em função da disponibilidade e interesse em participar dos testes. Foi utilizada escala hedônica de 7 pontos, onde os provadores avaliaram as amostras delineadas em blocos casualizados. Os resultados obtidos mostraram que os "chips" controle e pré-cozidos foram aceitos sensorialmente, apresentado médias de 5,1 (gostei ligeiramente para IAC Mantiqueira e 6,0 (gostei moderadamente para IAC 576.70. Os "chips" pré-fermentados de ambas variedades foram rejeitados. Os termos de agrado mais comentados pelos provadores foram "sabor de mandioca", "crocância" e "textura". Os termos de desagrado mais citados incluem "textura dura", "falta sabor de mandioca" e "gosto de óleo". Os provadores consideraram adequada a aparência dos "chips" de ambas variedades, sendo ligeiramente preferida a aparência dos "chips" da IAC 576.70, com exceção dos "chips" cozidos por 8 minutos e os fermentados, rejeitados pelos consumidores. A cor amarela da polpa pode ter influenciado a aceitação da variedade IAC 576.70. A composição centesimal e o teor de fibras na mandioca in natura e, o teor de lipídeos em "chips" de mandioca, também foram apresentados.Pre-treatments such as cooking, natural fermentation and partial drying were applied to cassava roots, aimed at obtaining edible cassava chips. The sensory evaluation was based on the acceptance and appearance of the chips, using the varieties IAC Mantiqueira and IAC 576.70. Thirty potential consumers of the product were selected based on their availability and interest. A 7-point hedonic scale was used, all the judges evaluating all the samples using a randomised

  6. Application of wood chips for soil mulching in the cultivation of ornamental grasses

    Directory of Open Access Journals (Sweden)

    Henschke Monika

    2016-12-01

    Full Text Available A mulch is a layer of material applied to the surface of the soil. Mulching plays an important role in the maintenance of green spaces. Organic materials are still sought for the preparation of mulches. Recently interest in wood chips has grown. The aim of the study was to determine the effect of mulching with pine and birch chips on the contents of phenolic compounds in the soil, as well as on the growth and flowering of ornamental grasses – Bouteloua gracilis (Kunth. Lag. ex Griffiths, Panicum virgatum L. and Pennisetum alopecuroides L. The content of phenolic compounds in the soil steadily increased from spring to autumn. Mulching led to a substantial increase in the level of phenolic compounds. In the first year of cultivation more phenolic compounds were released by chips of pine than birch, while in the second year this difference did not occur. Mulching had a negative impact on the growth and flowering of ornamental grasses, especially in the first year of cultivation. Ornamental grass sensitivity to the substances released from mulches decreased with the age of the plants and was dependent on the species – Bouteloua gracilis was found to be particularly sensitive.

  7. Fully Automated On-Chip Imaging Flow Cytometry System with Disposable Contamination-Free Plastic Re-Cultivation Chip

    Directory of Open Access Journals (Sweden)

    Tomoyuki Kaneko

    2011-06-01

    Full Text Available We have developed a novel imaging cytometry system using a poly(methyl methacrylate (PMMA based microfluidic chip. The system was contamination-free, because sample suspensions contacted only with a flammable PMMA chip and no other component of the system. The transparency and low-fluorescence of PMMA was suitable for microscopic imaging of cells flowing through microchannels on the chip. Sample particles flowing through microchannels on the chip were discriminated by an image-recognition unit with a high-speed camera in real time at the rate of 200 event/s, e.g., microparticles 2.5 μm and 3.0 μm in diameter were differentiated with an error rate of less than 2%. Desired cells were separated automatically from other cells by electrophoretic or dielectrophoretic force one by one with a separation efficiency of 90%. Cells in suspension with fluorescent dye were separated using the same kind of microfluidic chip. Sample of 5 μL with 1 × 106 particle/mL was processed within 40 min. Separated cells could be cultured on the microfluidic chip without contamination. The whole operation of sample handling was automated using 3D micropipetting system. These results showed that the novel imaging flow cytometry system is practically applicable for biological research and clinical diagnostics.

  8. Study of cutting speed on surface roughness and chip formation when machining nickel-based alloy

    International Nuclear Information System (INIS)

    Khidhir, Basim A.; Mohamed, Bashir

    2010-01-01

    Nickel- based alloy is difficult-to-machine because of its low thermal diffusive property and high strength at higher temperature. The machinability of nickel- based Hastelloy C-276 in turning operations has been carried out using different types of inserts under dry conditions on a computer numerical control (CNC) turning machine at different stages of cutting speed. The effects of cutting speed on surface roughness have been investigated. This study explores the types of wear caused by the effect of cutting speed on coated and uncoated carbide inserts. In addition, the effect of burr formation is investigated. The chip burr is found to have different shapes at lower speeds. Triangles and squares have been noticed for both coated and uncoated tips as well. The conclusion from this study is that the transition from thick continuous chip to wider discontinuous chip is caused by different types of inserts. The chip burr has a significant effect on tool damage starting in the line of depth-of-cut. For the coated insert tips, the burr disappears when the speed increases to above 150 m/min with the improvement of surface roughness; increasing the speed above the same limit for uncoated insert tips increases the chip burr size. The results of this study showed that the surface finish of nickel-based alloy is highly affected by the insert type with respect to cutting speed changes and its effect on chip burr formation and tool failure

  9. Machinability of advanced materials

    CERN Document Server

    Davim, J Paulo

    2014-01-01

    Machinability of Advanced Materials addresses the level of difficulty involved in machining a material, or multiple materials, with the appropriate tooling and cutting parameters.  A variety of factors determine a material's machinability, including tool life rate, cutting forces and power consumption, surface integrity, limiting rate of metal removal, and chip shape. These topics, among others, and multiple examples comprise this research resource for engineering students, academics, and practitioners.

  10. The Design, Fabrication and Characterization of a Transparent Atom Chip

    Directory of Open Access Journals (Sweden)

    Ho-Chiao Chuang

    2014-06-01

    Full Text Available This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments.

  11. The Design, Fabrication and Characterization of a Transparent Atom Chip

    Science.gov (United States)

    Chuang, Ho-Chiao; Huang, Chia-Shiuan; Chen, Hung-Pin; Huang, Chi-Sheng; Lin, Yu-Hsin

    2014-01-01

    This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments. PMID:24922456

  12. Chip-to-chip SnO2 nanowire network sensors for room temperature H2 detection

    Science.gov (United States)

    Köck, A.; Brunet, E.; Mutinati, G. C.; Maier, T.; Steinhauer, S.

    2012-06-01

    The employment of nanowires is a very powerful strategy to improve gas sensor performance. We demonstrate a gas sensor device, which is based on silicon chip-to-chip synthesis of ultralong tin oxide (SnO2) nanowires. The sensor device employs an interconnected SnO2 nanowire network configuration, which exhibits a huge surface-to-volume ratio and provides full access of the target gas to the nanowires. The chip-to-chip SnO2 nanowire device is able to detect a H2 concentration of only 20 ppm in synthetic air with ~ 60% relative humidity at room temperature. At an operating temperature of 300°C a concentration of 50 ppm H2 results in a sensitivity of 5%. At this elevated temperature the sensor shows a linear response in a concentration range between 10 ppm and 100 ppm H2. The SnO2-nanowire fabrication procedure based on spray pyrolysis and subsequent annealing is performed at atmospheric pressure, requires no vacuum and allows upscale of the substrate to a wafer size. 3D-integration with CMOS chips is proposed as viable way for practical realization of smart nanowire based gas sensor devices for the consumer market.

  13. ChIP on SNP-chip for genome-wide analysis of human histone H4 hyperacetylation

    Directory of Open Access Journals (Sweden)

    Porter Christopher J

    2007-09-01

    Full Text Available Abstract Background SNP microarrays are designed to genotype Single Nucleotide Polymorphisms (SNPs. These microarrays report hybridization of DNA fragments and therefore can be used for the purpose of detecting genomic fragments. Results Here, we demonstrate that a SNP microarray can be effectively used in this way to perform chromatin immunoprecipitation (ChIP on chip as an alternative to tiling microarrays. We illustrate this novel application by mapping whole genome histone H4 hyperacetylation in human myoblasts and myotubes. We detect clusters of hyperacetylated histone H4, often spanning across up to 300 kilobases of genomic sequence. Using complementary genome-wide analyses of gene expression by DNA microarray we demonstrate that these clusters of hyperacetylated histone H4 tend to be associated with expressed genes. Conclusion The use of a SNP array for a ChIP-on-chip application (ChIP on SNP-chip will be of great value to laboratories whose interest is the determination of general rules regarding the relationship of specific chromatin modifications to transcriptional status throughout the genome and to examine the asymmetric modification of chromatin at heterozygous loci.

  14. Simulating the Effect of Modulated Tool-Path Chip Breaking On Surface Texture and Chip Length

    Energy Technology Data Exchange (ETDEWEB)

    Smith, K.S.; McFarland, J.T.; Tursky, D. A.; Assaid, T. S.; Barkman, W. E.; Babelay, Jr., E. F.

    2010-04-30

    One method for creating broken chips in turning processes involves oscillating the cutting tool in the feed direction utilizing the CNC machine axes. The University of North Carolina at Charlotte and the Y-12 National Security Complex have developed and are refining a method to reliably control surface finish and chip length based on a particular machine's dynamic performance. Using computer simulations it is possible to combine the motion of the machine axes with the geometry of the cutting tool to predict the surface characteristics and map the surface texture for a wide range of oscillation parameters. These data allow the selection of oscillation parameters to simultaneously ensure broken chips and acceptable surface characteristics. This paper describes the machine dynamic testing and characterization activities as well as the computational method used for evaluating and predicting chip length and surface texture.

  15. Cutting zone area and chip morphology in high-speed cutting of titanium alloy Ti-6Al-4V

    International Nuclear Information System (INIS)

    Ke, Qing Chan; Xu, Daochun; Xiong, Dan Ping

    2017-01-01

    The titanium alloy Ti-6Al-4V has superior properties but poor machinability, yet is widely used in aerospace and biomedical industries. Chip formation and cutting zone area are important factors that have received limited attention. Thus, we propose a high-speed orthogonal cutting model for serrated chip formation. The high speed orthogonal cutting of Ti-6Al-4V was studied with a cutting speed of 10-160 m/min and a feed of 0.07-0.11 mm/r. Using theoretical models and experimental results, parameters such as chip shape, serration level, slip angle, and shear slip distance were investigated. Cutting zone boundaries (tool-chip contact length, length of shear plane, and critical slip plane) and cutting zone area were obtained. The results showed that discontinuous, long-curling, and continuous chips were formed at low, medium, and high speeds, respectively. Serration level, shear slip distance, and slip angle rose with increasing cutting speed. The length of shear plane, tool-chip contact, and critical slip plane varied subtly with increased cutting speed, and rose noticeably with increased feed. Cutting zone area grew weakly with increased cutting speed, levelling off at high cutting speed; however, it rose noticeably with increased feed. This study furthers our understanding of the shear slip phenomenon and the mechanism of serrated chip formation

  16. Cutting zone area and chip morphology in high-speed cutting of titanium alloy Ti-6Al-4V

    Energy Technology Data Exchange (ETDEWEB)

    Ke, Qing Chan; Xu, Daochun; Xiong, Dan Ping [School of Technology, Beijing Forestry University, Beijing (China)

    2017-01-15

    The titanium alloy Ti-6Al-4V has superior properties but poor machinability, yet is widely used in aerospace and biomedical industries. Chip formation and cutting zone area are important factors that have received limited attention. Thus, we propose a high-speed orthogonal cutting model for serrated chip formation. The high speed orthogonal cutting of Ti-6Al-4V was studied with a cutting speed of 10-160 m/min and a feed of 0.07-0.11 mm/r. Using theoretical models and experimental results, parameters such as chip shape, serration level, slip angle, and shear slip distance were investigated. Cutting zone boundaries (tool-chip contact length, length of shear plane, and critical slip plane) and cutting zone area were obtained. The results showed that discontinuous, long-curling, and continuous chips were formed at low, medium, and high speeds, respectively. Serration level, shear slip distance, and slip angle rose with increasing cutting speed. The length of shear plane, tool-chip contact, and critical slip plane varied subtly with increased cutting speed, and rose noticeably with increased feed. Cutting zone area grew weakly with increased cutting speed, levelling off at high cutting speed; however, it rose noticeably with increased feed. This study furthers our understanding of the shear slip phenomenon and the mechanism of serrated chip formation.

  17. Low Power Camera-on-a-Chip Using CMOS Active Pixel Sensor Technology

    Science.gov (United States)

    Fossum, E. R.

    1995-01-01

    A second generation image sensor technology has been developed at the NASA Jet Propulsion Laboratory as a result of the continuing need to miniaturize space science imaging instruments. Implemented using standard CMOS, the active pixel sensor (APS) technology permits the integration of the detector array with on-chip timing, control and signal chain electronics, including analog-to-digital conversion.

  18. Construction of a liver sinusoid based on the laminar flow on chip and self-assembly of endothelial cells.

    Science.gov (United States)

    Mi, Shengli; Yi, Xiaoman; Du, Zhichang; Xu, Yuanyuan; Sun, Wei

    2018-02-20

    The liver is one of the main metabolic organs, and nearly all ingested drugs will be metabolized by the liver. Only a small fraction of drugs are able to come onto the market during drug development, and hepatic toxicity is a major cause for drug failure. Since drug development is costly in both time and materials, an in vitro liver model that can accelerate bioreactions in the liver and reduce drug consumption is imperative in the pharmaceutical industry. The liver on a chip is an ideal alternative for its controllable environment and tiny size, which means constructing a more biomimetic model, reducing material consumption as well as promoting drug diffusion and reaction. In this study, taking advantage of the laminar flow on chips and using natural degradable gel rat tail Collagen-I, we constructed a liver sinusoid on a chip. By synchronously injecting two kinds of cell-laden collagen, HepG2-laden collagen and HUVEC-laden collagen, we formed two collagen layers with a clear borderline. By controlling the HUVEC density and injection of growth factors, HUVECs in collagen formed a monolayer through self-assembly. Thus, a liver sinusoid on a chip was achieved in a more biomimetic environment with a more controllable and uniform distribution of discrete HUVECs. Viability, album secretion and urea synthesis of the live sinusoid on a chip were analysed on days 3, 5 and 7 after collagen injection with acetaminophen treatment at 0 (control), 10 and 20 mM. The results indicated that our liver sinusoid on a chip was able to maintain bioactivity and function for at least 7 d and was beneficial for hepatotoxic drug screening.

  19. Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects

    International Nuclear Information System (INIS)

    Sangirov Jamshid; Ukaegbu Ikechi Augustine; Lee Tae-Woo; Park Hyo-Hoon; Sangirov Gulomjon

    2013-01-01

    A power-aware transceiver for half-duplex bidirectional chip-to-chip optical interconnects has been designed and fabricated in a 0.13 μm complementary metal–oxide–semiconductor (CMOS) technology. The transceiver can detect the presence and absence of received signals and saves 55% power in Rx enabled mode and 45% in Tx enabled mode. The chip occupies an area of 1.034 mm 2 and achieves a 3-dB bandwidth of 6 GHz and 7 GHz in Tx and Rx modes, respectively. The disabled outputs for the Tx and Rx modes are isolated with 180 dB and 139 dB, respectively, from the enabled outputs. Clear eye diagrams are obtained at 4.25 Gbps for both the Tx and Rx modes. (semiconductor integrated circuits)

  20. Biodegradable scaffold with built-in vasculature for organ-on-a-chip engineering and direct surgical anastomosis

    Science.gov (United States)

    Zhang, Boyang; Montgomery, Miles; Chamberlain, M. Dean; Ogawa, Shinichiro; Korolj, Anastasia; Pahnke, Aric; Wells, Laura A.; Massé, Stéphane; Kim, Jihye; Reis, Lewis; Momen, Abdul; Nunes, Sara S.; Wheeler, Aaron R.; Nanthakumar, Kumaraswamy; Keller, Gordon; Sefton, Michael V.; Radisic, Milica

    2016-06-01

    We report the fabrication of a scaffold (hereafter referred to as AngioChip) that supports the assembly of parenchymal cells on a mechanically tunable matrix surrounding a perfusable, branched, three-dimensional microchannel network coated with endothelial cells. The design of AngioChip decouples the material choices for the engineered vessel network and for cell seeding in the parenchyma, enabling extensive remodelling while maintaining an open-vessel lumen. The incorporation of nanopores and micro-holes in the vessel walls enhances permeability, and permits intercellular crosstalk and extravasation of monocytes and endothelial cells on biomolecular stimulation. We also show that vascularized hepatic tissues and cardiac tissues engineered by using AngioChips process clinically relevant drugs delivered through the vasculature, and that millimetre-thick cardiac tissues can be engineered in a scalable manner. Moreover, we demonstrate that AngioChip cardiac tissues implanted with direct surgical anastomosis to the femoral vessels of rat hindlimbs establish immediate blood perfusion.

  1. Experiment list: SRX485203 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346544: Rhino ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq ...source_name=Rhino ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult ||... Sex=female || tissue=ovary || germline knock-down=control || chip antibody=custo

  2. Experiment list: SRX485202 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346543: Rhino ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq ...source_name=Rhino ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult ||... Sex=female || tissue=ovary || germline knock-down=control || chip antibody=custo

  3. Experiment list: SRX485210 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 6551: Deadlock ChIP from deadlock germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name...=Deadlock ChIP from deadlock germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=deadlock || chip antibody=custom-made

  4. Experiment list: SRX485211 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346552: Cutoff ChIP from control germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=...Cutoff ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female... || tissue=ovary || germline knock-down=control || chip antibody=custom-made rabb

  5. On-chip antenna: Practical design and characterization considerations

    KAUST Repository

    Shamim, Atif; Salama, Khaled N.; Sedky, S.; Soliman, E. A.

    2012-01-01

    This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

  6. On-chip antenna: Practical design and characterization considerations

    KAUST Repository

    Shamim, Atif

    2012-07-28

    This paper highlights the challenges of an emergent field, namely, on-chip antenna design. Consistent with the RF System-on-Chip (SoC) concept, co-design strategy for circuits and on-chip antennas is described. A number of design and layout issues, arising from the highly integrated nature of this kind of systems, are discussed. The characterization difficulties related to on-chip antennas radiation properties are also highlighted. Finally, a novel on-wafer test fixture is proposed to measure the gain and radiation pattern of the on-chip antennas in the anechoic chamber.

  7. Measuring coating thicknesses on continuously moving material

    International Nuclear Information System (INIS)

    Holler, J.H.; Stanton, W.B.; Spongr, J.J.; Joffe, B.B.; Raffelsberger, P.W.; Tiebor, J.E.

    1982-01-01

    A method and apparatus using radiation techniques for measuring coating thicknesses on continuously moving strip material without altering a predetermined path along which it travels. A shuttle carrying a measuring probe having a radioactive isotope source and a detection device is provided for reciprocation along a preselected segment of the path of the strip. The shuttle and the probe are releasably engaged with the strip and carried thereby for synchronous movement therewith in the forward direction during a measurement cycle, and are disengaged from the strip when no measurement is being made, the movement of the shuttle then being controlled by an independent drive mechanism, shown as a belt drive, which reciprocates the shuttle along the rails. A belt drives it forward more slowly than the strip, which then engages the shuttle to pull it at strip speed, allowed by a pulley clutch. (author)

  8. One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

    International Nuclear Information System (INIS)

    Sabourin, D; Dufva, M; Jensen, T; Kutter, J; Snakenborg, D

    2010-01-01

    A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfaces by direct micromilling. Upon UV-assisted bonding the tubing is trapped in the ports of the PMMA chip and forms an integrated, in-plane and adhesive-free interconnection. The interconnections support the average pressure of 6.1 bar and can be made with small dead volumes. A comparison is made to a similar interconnection approach which uses tubing to act as a gasket between a needle and port on the microfluidic chip. (technical note)

  9. Influence of passivation process on chip performance

    NARCIS (Netherlands)

    Lu, J.; Kovalgin, Alexeij Y.; Schmitz, Jurriaan

    2009-01-01

    In this work, we have studied the performance of CMOS chips before and after a low temperature post-processing step. In order to prevent damage to the IC chips by the post-processing steps, a first passivation layers is needed on top of the IC chips. Two different passivation layer deposition

  10. Experiment list: SRX485205 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 46546: Rhino ChIP from deadlock germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=R...hino ChIP from deadlock germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female ...|| tissue=ovary || germline knock-down=deadlock || chip antibody=custom-made rabb

  11. Experiment list: SRX485212 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346553: Cutoff ChIP from cutoff germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=C...utoff ChIP from cutoff germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female |...| tissue=ovary || germline knock-down=cutoff || chip antibody=custom-made rabbit

  12. Experiment list: SRX485206 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346547: Rhino ChIP from cutoff germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=Rh...ino ChIP from cutoff germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female || ...tissue=ovary || germline knock-down=cutoff || chip antibody=custom-made rabbit po

  13. Experiment list: SRX485209 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346550: Deadlock ChIP from control germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_nam...e=Deadlock ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=control || chip antibody=custom-made

  14. The use of forest chips in Finland

    International Nuclear Information System (INIS)

    Hakkila, P.

    2001-01-01

    International commitments require the industrial world to restrict their greenhouse gas emissions. In Finland, where the annual timber cut per capita is more than ten times the average cut in the other EU countries, the primary means to reduce CO 2 emissions is to replace fossil fuels with forest biomass. The annual consumption of wood-based energy corresponds to 6 million tonnes of oil equivalent (toe) or almost 20% of the total primary energy consumption. The goal is to rise the annual production of wood-based energy to 7.8 million toe by 2010. Substantial part of the targeted increase could be obtained by forest chips produced of unmerchantable small-diameter trees and logging residues. The goal for 2010 is to use 5 million solid m 3 of forest chips, which equals to 0.9 million toe. The use of forest chips is increasing. About 474 000 solid m 3 of forest chips were used as fuel in 1999. At the moment, the growth is rapid especially in cogeneration plants producing both heat and electricity. The growth is based primarily on chips obtained from logging residues. The price of forest chips decreased considerably during the 1990s but the price range remained wide. Chips made of logging residues are cheaper than those made of small trees. The average price of forest chips at the plant, VAT excluded, is about 53 FIM per MWh. In Sweden, the average price is more than 40% higher

  15. Heat management in integrated circuits on-chip and system-level monitoring and cooling

    CERN Document Server

    Ogrenci-Memik, Seda

    2016-01-01

    This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

  16. Microfluidics and Lab-on-a-Chip Devices

    DEFF Research Database (Denmark)

    Castillo, Jaime

    2015-01-01

    The rapid advances in microfabrication and nanofabrication in combination with the synthesis and discovery of new materials have propelled the drive to develop new technological devices such as smartphones, personal and tablet computers. These devices have changed the way humankind interacts......TAS technologies need to join forces with those behind the new communication devices which provide sources of power, detection and data transmission complementing the features that lab-on-a-chip and microTAS platforms can offer. An increasing number of microfluidic-based devices, developed both in small start...

  17. Experiment list: SRX485220 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 53 GSM1346561: RNA Polymerase II ChIP from rhino germline knock-down ovaries; Drosophila melanogaster; ChIP-...Seq source_name=RNA Polymerase II ChIP from rhino germline knock-down ovaries || developmental stage=4-6 day...s old adult || Sex=female || tissue=ovary || germline knock-down=rhino || chip an

  18. Experiment list: SRX485204 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346545: Rhino ChIP from rhino germline knock-down ovaries; Drosophila melanogaster; ChIP-Seq source_name=Rhi...no ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female || ti...ssue=ovary || germline knock-down=rhino || chip antibody=custom-made rabbit polyc

  19. Experiment list: SRX485208 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 346549: Rhino ChIP from piwi germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq sou...rce_name=Rhino ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=piwi || chip antibody=custom-made ra

  20. Fabrication of Polymerase Chain Reaction Plastic Lab-on-a-Chip Device for Rapid Molecular Diagnoses

    Directory of Open Access Journals (Sweden)

    Kieu The Loan Trinh

    2016-05-01

    Full Text Available Purpose: We aim to fabricate a thermoplastic poly(methylmethacrylate (PMMA Lab-on-a-Chip device to perform continuous- flow polymerase chain reactions (PCRs for rapid molecular detection of foodborne pathogen bacteria. Methods: A miniaturized plastic device was fabricated by utilizing PMMA substrates mediated by poly(dimethylsiloxane interfacial coating, enabling bonding under mild conditions, and thus avoiding the deformation or collapse of microchannels. Surface characterizations were carried out and bond strength was measured. The feasibility of the Lab-on-a-Chip device for performing on-chip PCR utilizing a lab-made, portable dual heater was evaluated. The results were compared with those obtained using a commercially available thermal cycler. Results: A PMMA Lab-on-a-Chip device was designed and fabricated for conducting PCR using foodborne pathogens as sample targets. A robust bond was established between the PMMA substrates, which is essential for performing miniaturized PCR on plastic. The feasibility of on-chip PCR was evaluated using Escherichia coli O157:H7 and Cronobacter condimenti, two worldwide foodborne pathogens, and the target amplicons were successfully amplified within 25 minutes. Conclusions: In this study, we present a novel design of a low-cost and high-throughput thermoplastic PMMA Lab-on-a-Chip device for conducting microscale PCR, and we enable rapid molecular diagnoses of two important foodborne pathogens in minute resolution using this device. In this regard, the introduced highly portable system design has the potential to enable PCR investigations of many diseases quickly and accurately.

  1. Grinding damage assessment for CAD-CAM restorative materials.

    Science.gov (United States)

    Curran, Philippe; Cattani-Lorente, Maria; Anselm Wiskott, H W; Durual, Stéphane; Scherrer, Susanne S

    2017-03-01

    To assess surface/subsurface damage after grinding with diamond discs on five CAD-CAM restorative materials and to estimate potential losses in strength based on crack size measurements of the generated damage. The materials tested were: Lithium disilicate (LIT) glass-ceramic (e.max CAD), leucite glass-ceramic (LEU) (Empress CAD), feldspar ceramic (VM2) (Vita Mark II), feldspar ceramic-resin infiltrated (EN) (Enamic) and a composite reinforced with nano ceramics (LU) (Lava Ultimate). Specimens were cut from CAD-CAM blocs and pair-wise mirror polished for the bonded interface technique. Top surfaces were ground with diamond discs of respectively 75, 54 and 18μm. Chip damage was measured on the bonded interface using SEM. Fracture mechanics relationships were used to estimate fracture stresses based on average and maximum chip depths assuming these to represent strength limiting flaws subjected to tension and to calculate potential losses in strength compared to manufacturer's data. Grinding with a 75μm diamond disc induced on a bonded interface critical chips averaging 100μm with a potential strength loss estimated between 33% and 54% for all three glass-ceramics (LIT, LEU, VM2). The softer materials EN and LU were little damage susceptible with chips averaging respectively 26μm and 17μm with no loss in strength. Grinding with 18μm diamond discs was still quite detrimental for LIT with average chip sizes of 43μm and a potential strength loss of 42%. It is essential to understand that when grinding glass-ceramics or feldspar ceramics with diamond discs surface and subsurface damage are induced which have the potential of lowering the strength of the ceramic. Careful polishing steps should be carried out after grinding especially when dealing with glass-ceramics. Copyright © 2017 The Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

  2. Experimental study of the chip morphology in turning hardened AISI D2 steel

    Energy Technology Data Exchange (ETDEWEB)

    Mhamdi, Mohamed Baccar; Bayraktar, Emin [Supmeca, Paris (France); Salem, Sahbi Ben; Boujelbene, Mohamed [National Engineering School of Tunis, Tunis (Turkey)

    2013-11-15

    The study of local mechanisms of material removal is essential in all problems of shaping by machining. Indeed, the mastery of surfaces generated by cutting requires an understanding of cutting mechanisms. The turning of steels with high mechanical properties using the cutting tool, often called 'hard turning,' is a new technique for the mechanical industry, and hence the need to understand the cutting mechanisms. The steel type EN X160CrMoV12 treated to 62 HRC (cold work tool steel: AISI D2 with a martensite matrix and distribution of primary and secondary carbides) is the subject of this study. Hard turning tests were carried out for this steel at different cutting conditions, with the aim to understand the mechanism of chip formation in order to be able to obtain the optimal cutting conditions. The chips obtained were examined under a microscope. The observation showed that the chip formation is influenced by cutting conditions. The chips contained a white layer, and this layer was examined under scanning electronic microscope (SEM) to study its variation depending on cutting parameters. The study shown, that cutting forces decrease with the increase of cutting speed. However, ANOVA method was used to establish the effect of the cutting conditions on experimental obtained results. Analysis of plastic deformation of the chip and the shear angle was made according to cutting conditions. Finally, a microhardness test was carried out to relate the mechanical properties and the microstructures of white layers.

  3. A contact-lens-shaped IC chip technology

    International Nuclear Information System (INIS)

    Liu, Ching-Yu; Yang, Frank; Teng, Chih-Chiao; Fan, Long-Sheng

    2014-01-01

    We report on novel contact-lens-shaped silicon integrated circuit chip technology for applications such as forming a conforming retinal prosthesis. This is achieved by means of patterning thin films of high residual stress on top of a shaped thin silicon substrate. Several strategies are employed to achieve curvatures of various amounts. Firstly, high residual stress on a thin film makes a thin chip deform into a designed three-dimensional shape. Also, a series of patterned stress films and ‘petal-shaped’ chips were fabricated and analyzed. Large curvatures can also be formed and maintained by the packaging process of bonding the chips to constraining elements such as thin-film polymer ring structures. As a demonstration, a complementary metal oxide semiconductor transistor (CMOS) image-sensing retina chip is made into a contact-lens shape conforming to a human eyeball 12.5 mm in radius. This non-planar and flexible chip technology provides a desirable device surface interface to soft tissues or non-planar bio surfaces and opens up many other possibilities for biomedical applications. (paper)

  4. Experiment list: SRX485222 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 4me2 ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_na...me=H3K4me2 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fe...male || tissue=ovary || germline knock-down=control || chip antibody=Anti-dimethy

  5. Experiment list: SRX485221 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available K4me2 ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_n...ame=H3K4me2 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=control || chip antibody=Anti-dimeth

  6. Integration of continuous-flow sampling with microchip electrophoresis using poly(dimethylsiloxane)-based valves in a reversibly sealed device.

    Science.gov (United States)

    Li, Michelle W; Martin, R Scott

    2007-07-01

    Here we describe a reversibly sealed microchip device that incorporates poly(dimethylsiloxane) (PDMS)-based valves for the rapid injection of analytes from a continuously flowing stream into a channel network for analysis with microchip electrophoresis. The microchip was reversibly sealed to a PDMS-coated glass substrate and microbore tubing was used for the introduction of gas and fluids to the microchip device. Two pneumatic valves were incorporated into the design and actuated on the order of hundreds of milliseconds, allowing analyte from a continuously flowing sampling stream to be injected into an electrophoresis separation channel. The device was characterized in terms of the valve actuation time and pushback voltage. It was also found that the addition of sodium dodecyl sulfate (SDS) to the buffer system greatly increased the reproducibility of the injection scheme and enabled the analysis of amino acids derivatized with naphthalene-2,3-dicarboxaldehyde/cyanide. Results from continuous injections of a 0.39 nL fluorescein plug into the optimized system showed that the injection process was reproducible (RSD of 0.7%, n = 10). Studies also showed that the device was capable of monitoring off-chip changes in concentration with a device lag time of 90 s. Finally, the ability of the device to rapidly monitor on-chip concentration changes was demonstrated by continually sampling from an analyte plug that was derivatized upstream from the electrophoresis/continuous flow interface. A reversibly sealed device of this type will be useful for the continuous monitoring and analysis of processes that occur either off-chip (such as microdialysis sampling) or on-chip from other integrated functions.

  7. Rework of flip chip bonded radiation pixel detectors

    International Nuclear Information System (INIS)

    Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

    2008-01-01

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

  8. Rework of flip chip bonded radiation pixel detectors

    Energy Technology Data Exchange (ETDEWEB)

    Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

    2008-06-11

    In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

  9. Multimedia-Based Chip Design Education.

    Science.gov (United States)

    Catalkaya, Tamer; Golze, Ulrich

    This paper focuses on multimedia computer-based training programs on chip design. Their development must be fast and economical, in order to be affordable by technical university institutions. The self-produced teaching program Illusion, which demonstrates a monitor controller as an example of a small but complete chip design, was implemented to…

  10. One-step fabrication of an organ-on-a-chip with spatial heterogeneity using a 3D bioprinting technology.

    Science.gov (United States)

    Lee, Hyungseok; Cho, Dong-Woo

    2016-07-05

    Although various types of organs-on-chips have been introduced recently as tools for drug discovery, the current studies are limited in terms of fabrication methods. The fabrication methods currently available not only need a secondary cell-seeding process and result in severe protein absorption due to the material used, but also have difficulties in providing various cell types and extracellular matrix (ECM) environments for spatial heterogeneity in the organs-on-chips. Therefore, in this research, we introduce a novel 3D bioprinting method for organ-on-a-chip applications. With our novel 3D bioprinting method, it was possible to prepare an organ-on-a-chip in a simple one-step fabrication process. Furthermore, protein absorption on the printed platform was very low, which will lead to accurate measurement of metabolism and drug sensitivity. Moreover, heterotypic cell types and biomaterials were successfully used and positioned at the desired position for various organ-on-a-chip applications, which will promote full mimicry of the natural conditions of the organs. The liver organ was selected for the evaluation of the developed method, and liver function was shown to be significantly enhanced on the liver-on-a-chip, which was prepared by 3D bioprinting. Consequently, the results demonstrate that the suggested 3D bioprinting method is easier and more versatile for production of organs-on-chips.

  11. Low Loss Nanostructured Polymers for Chip-scale Waveguide Amplifiers.

    Science.gov (United States)

    Chen, George F R; Zhao, Xinyu; Sun, Yang; He, Chaobin; Tan, Mei Chee; Tan, Dawn T H

    2017-06-13

    On-chip waveguide amplifiers offer higher gain in small device sizes and better integration with photonic devices than the commonly available fiber amplifiers. However, on-chip amplifiers have yet to make its way into the mainstream due to the limited availability of materials with ideal light guiding and amplification properties. A low-loss nanostructured on-chip channel polymeric waveguide amplifier was designed, characterized, fabricated and its gain experimentally measured at telecommunication wavelength. The active polymeric waveguide core comprises of NaYF 4 :Yb,Er,Ce core-shell nanocrystals dispersed within a SU8 polymer, where the nanoparticle interfacial characteristics were tailored using hydrolyzed polyhedral oligomeric silsesquioxane-graft-poly(methyl methacrylate) to improve particle dispersion. Both the enhanced IR emission intensity from our nanocrystals using a tri-dopant scheme and the reduced scattering losses from our excellent particle dispersion at a high solid loading of 6.0 vol% contributed to the outstanding optical performance of our polymeric waveguide. We achieved one of the highest reported gain of 6.6 dB/cm using a relatively low coupled pump power of 80 mW. These polymeric waveguide amplifiers offer greater promise for integrated optical circuits due to their processability and integration advantages which will play a key role in the emerging areas of flexible communication and optoelectronic devices.

  12. Experiment list: SRX485218 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available K9me3 ChIP from piwi germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_name...=H3K9me3 ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female ...|| tissue=ovary || germline knock-down=piwi || chip antibody=Histone H3K9me3 anti

  13. Experiment list: SRX485213 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available K9me3 ChIP from control germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_n...ame=H3K9me3 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=control || chip antibody=Histone H3K

  14. Experiment list: SRX485214 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available K9me3 ChIP from control germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_n...ame=H3K9me3 ChIP from control germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=f...emale || tissue=ovary || germline knock-down=control || chip antibody=Histone H3K

  15. Foreign material exclusion program

    International Nuclear Information System (INIS)

    Perez Moreno, J.; Folguera Mateo, M.

    2015-01-01

    Foreign material is any element that is not part of the system as it has been designed. For example dirt, loose parts, wires, chips, etc. that may affect the operation of the system or component. (Author)

  16. The economic efficiency of forest energy wood chip production in regional use – A case study

    Directory of Open Access Journals (Sweden)

    Dalibor Šafařík

    2013-01-01

    Full Text Available This regional project case study deals with the limiting factors of economic efficiency in the production of forest energy wood chips. The evaluation of production efficiency made use of data obtained from the Lesy města Brna, a.s. (Forest of the City of Brno, Corp., which were subjected to two static methods of investment evaluation: an analysis of the tipping point and determination of the limit of variable costs and a dynamic modified tipping point analysis using cash flow (i.e. cash break even analysis. The results have confirmed an established hypothesis, namely that the decisive factor in the profitability of the production of forest energy wood chips hinges on the costs incurred in the gathering of raw material and the distribution of the produced chips. The results include a further limiting factor: transportation costs to the final consumption location. The output of the study is a recommendation that the concentration of residual forest materials not exceed a distance of 250 m from the place of production to the point of disintegration and that the transport distance of energy chips not exceed 50 km from the place of disintegration to the final consumption point. These limiting values help quantify the full internal costs per cost unit, full internal cost profitability, total revenue profitability and annual profitability expressed in terms of fixed assets depreciation without factoring in financial aid.

  17. 75 FR 16149 - Medicaid and CHIP Programs; Meeting of the CHIP Working Group-April 26, 2010

    Science.gov (United States)

    2010-03-31

    ... DEPARTMENT OF HEALTH AND HUMAN SERVICES Centers for Medicare & Medicaid Services [CMS-2312-N] DEPARTMENT OF LABOR Employee Benefits Security Administration Medicaid and CHIP Programs; Meeting of the CHIP Working Group-- April 26, 2010 AGENCIES: Centers for Medicare & Medicaid Services (CMS), Department of...

  18. 3D-Printed Chips: Compatibility of Additive Manufacturing Photopolymeric Substrata with Biological Applications

    Directory of Open Access Journals (Sweden)

    Megan Carve

    2018-02-01

    Full Text Available Additive manufacturing (AM is ideal for building adaptable, structurally complex, three-dimensional, monolithic lab-on-chip (LOC devices from only a computer design file. Consequently, it has potential to advance micro- to milllifluidic LOC design, prototyping, and production and further its application in areas of biomedical and biological research. However, its application in these areas has been hampered due to material biocompatibility concerns. In this review, we summarise commonly used AM techniques: vat polymerisation and material jetting. We discuss factors influencing material biocompatibility as well as methods to mitigate material toxicity and thus promote its application in these research fields.

  19. Reclamation Of Plant Wastes (Straw And Obtaining (Nano Chips With Bactericidal Properties Based On Them

    Directory of Open Access Journals (Sweden)

    Leonidovna Voropaeva Nadezda

    2015-09-01

    Full Text Available Rape, camelina, wheat and Jerusalem artichoke vegetable wastes (straw as annually renewable raw materials were processed into activated carbons, which were modified with silver nanoparticles for carbonaceous sorbents to acquire specific properties, since carbonaceous sorbents are usually widely used in the food industry, agriculture, medicine and other fields of human activity. The technology to obtain active carbons from agricultural crop residues has been developed, active carbon physico-chemical and adsorption properties, textural characteristics have been studied, new functional carbon (nano materials with antibacterial activity containing (nano particles of silver have been obtained, their influence within (nano chip composition on rape crop growth, development and yield has been studied. In the conducted field tests, the highest activity was noted when using the (nano chip whose structure included RAC - camelina and silver nanoparticles. Besides, when nano chips are used for seed treatment, the yield increase makes up 11.6 % for nanoparticles containing Ag, for plant active carbons (PAC (rape with Ag this index makes up 28.1 %, for RAC (Camelina with Ag it makes up 55.8 % (compared to the control variant, which can be explained by the differences in the sorption characteristics of the studied radio activated carbons. Our results and the previous studies of other authors can prove the fact that silver nanoparticles (including those being a part of (nano chips “get” into the biochemical processes and have a pronounced phytostimulating effect on plants, which was especially obvious when suppressing the activity of plant pathogenic microflora by silver nanoparticles.

  20. High coincidence-to-accidental ratio continuous-wave photon-pair generation in a grating-coupled silicon strip waveguide

    DEFF Research Database (Denmark)

    Guo, Kai; Christensen, Erik Nicolai; Christensen, Jesper Bjerge

    2017-01-01

    We demonstrate a very high coincidence-to-accidental ratio of 673 using continuous-wave photon-pair generation in a silicon strip waveguide through spontaneous four-wave mixing. This result is obtained by employing on-chip photonic-crystal-based grating couplers for both low-loss fiber......-to-chip coupling and on-chip suppression of generated spontaneous Raman scattering noise. We measure a minimum heralded second-order correlation of g(H)((2)) (0) = 0.12, demonstrating that our source operates in the single- photon regime with low noise. (C) 2017 The Japan Society of Applied Physics...

  1. Solid state isotopic power source for computer chips

    International Nuclear Information System (INIS)

    Brown, P.M.

    1992-01-01

    This paper reports that recent developments in materials technology now make it possible to fabricate nonthermal thin-film isotopic energy converters (REC) with a specific power of 24 W/kg and 5 to 10 year working life at 5 to 10 Watts. This creates applications never before possible, such as placing the power supply directly on integrated circuit chips. The efficiency of the REC is about 25% which is two to three times greater than the 6 to 8% capabilities of current thermoelectric systems

  2. Modelling, Synthesis, and Configuration of Networks-on-Chips

    DEFF Research Database (Denmark)

    Stuart, Matthias Bo

    This thesis presents three contributions in two different areas of network-on-chip and system-on-chip research: Application modelling and identifying and solving different optimization problems related to two specific network-on-chip architectures. The contribution related to application modelling...... is an analytical method for deriving the worst-case traffic pattern caused by an application and the cache-coherence protocol in a cache-coherent shared-memory system. The contributions related to network-on-chip optimization problems consist of two parts: The development and evaluation of six heuristics...... for solving the network synthesis problem in the MANGO network-on-chip, and the identification and formalization of the ReNoC configuration problem together with three heuristics for solving it....

  3. Technology Development of Salak (Salacca Zalacca) Chips With Vacuum Frying Machine Base On Expert System In Kramat-Bangkalan Regency

    Science.gov (United States)

    Rosida, D. F.; Happyanto; Anggraeni; Sugiarto; Hapsari

    2018-01-01

    Agropolitan Program is one form of regional development to improve agribusiness system and effort to improve the welfare of the community. One of the leading commodities in Bangkalan agroclimates is salak which is a potentially very large commodity to be developed. Salak commodities in Kramat Bangkalan Indonesia have developed varous salak produced such as dates of salak, syrup and dodol salak. Salak chips was the target of innovation from processed salak. The Production of salak chips using frying technology with vacuum system to obtain crunchy chips. To get the results need to be developed synergy technology to combine the process conditions and the right system in producing good quality salak chips. Bangkalan Regency is the potential to continue to develop products using a variety of salak to the processed form of vacuum frying machine based on expert system so that the resulting product would be great texture, aroma and taste. This will make the area of Bangkalan, Indonesia be more independent in producing and increasing revenue.

  4. Experiment list: SRX485216 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 3K9me3 ChIP from rhino germline knock-down ovaries, replicate 2; Drosophila melanogaster; ChIP-Seq source_na...me=H3K9me3 ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=fema...le || tissue=ovary || germline knock-down=rhino || chip antibody=Histone H3K9me3

  5. Experiment list: SRX485215 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available K9me3 ChIP from rhino germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_nam...e=H3K9me3 ChIP from rhino germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=femal...e || tissue=ovary || germline knock-down=rhino || chip antibody=Histone H3K9me3 a

  6. Experiment list: SRX485217 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 3K9me3 ChIP from piwi germline knock-down ovaries, replicate 1; Drosophila melanogaster; ChIP-Seq source_nam...e=H3K9me3 ChIP from piwi germline knock-down ovaries || developmental stage=4-6 days old adult || Sex=female... || tissue=ovary || germline knock-down=piwi || chip antibody=Histone H3K9me3 ant

  7. Mechanisms and FEM Simulation of Chip Formation in Orthogonal Cutting In-Situ TiB2/7050Al MMC

    Science.gov (United States)

    Wang, Wenhu; Jiang, Ruisong; Lin, Kunyang; Shao, Mingwei

    2018-01-01

    The in-situ TiB2/7050Al composite is a new kind of Al-based metal matrix composite (MMC) with super properties, such as low density, improved strength, and wear resistance. This paper, for a deep insight into its cutting performance, involves a study of the chip formation process and finite element simulation during orthogonal cutting in-situ TiB2/7050Al MMC. With chips, material properties, cutting forces, and tool geometry parameters, the Johnson–Cook (J–C) constitutive equation of in-situ TiB2/7050Al composite was established. Then, the cutting simulation model was established by applying the Abaqus–Explicit method, and the serrated chip, shear plane, strain rate, and temperature were analyzed. The experimental and simulation results showed that the obtained material’s constitutive equation was of high reliability, and the saw-tooth chips occurred commonly under either low or high cutting speed and small or large feed rate. From result analysis, it was found that the mechanisms of chip formation included plastic deformation, adiabatic shear, shearing slip, and crack extension. In addition, it was found that the existence of small, hard particles reduced the ductility of the MMC and resulted in segmental chips. PMID:29662047

  8. A novel conductive-polymer-based integration process for high-performance flip-chip packages

    Science.gov (United States)

    Lohokare, Saurabh

    Conductive polymers have recently attracted considerable attention for low-temperature fabrication of lead-free, reworkable, and flexible flip-chip interconnects. Using these materials, I demonstrate in this thesis a process that enables low-cost and high-resolution flip-chip interconnects using conventional micro-fabrication techniques. This fabrication process offers improved performance as compared to conventional flip-chip techniques, such as screen-printing, and allows for definition of interconnects with excellent surface uniformity and control over the bump profile. In order to demonstrate the utility and wide applicability of this process, several test implementations that serve as case studies were investigated. Specifically, novel InGaAsSb avalanche photodiodes (APDs), operating around lambda = 2m and targeted for free-space communication and biomedical spectroscopy applications, were fabricated and flip-chip-integrated to test the static electrical characteristics of the polymer bumps. Additionally, the dynamic electrical performance characteristics of the polymer bumps were studied by using AlGaAsSb/AlGaSb p-i-n photodetectors as a case study. The fabrication of these photodetectors, operating around lambda = 1.55mum and targeted for optical communication applications, was accomplished using a customized inductively coupled plasma (ICP) etch process that resulted in a low dark current and excellent speed (3dB bandwidth of 10GHz) and, responsivity (60% external quantum efficiency) characteristics. Furthermore, flip-chip integration was used to demonstrate a three-dimensional, point-to-point micro-optical interconnect, which was 2.33mm-long in a system 15.27mm3 in volume. Lastly, high-speed parallel optical interconnects were demonstrated using polymer-flip-chip-integrated 10GHz vertical-cavity surface-emitting laser (VCSEL) and DOEs. Such interconnects offer the ability to alleviate the communication bottleneck that is projected to occur in future, high

  9. A High-Voltage SOI CMOS Exciter Chip for a Programmable Fluidic Processor System.

    Science.gov (United States)

    Current, K W; Yuk, K; McConaghy, C; Gascoyne, P R C; Schwartz, J A; Vykoukal, J V; Andrews, C

    2007-06-01

    A high-voltage (HV) integrated circuit has been demonstrated to transport fluidic droplet samples on programmable paths across the array of driving electrodes on its hydrophobically coated surface. This exciter chip is the engine for dielectrophoresis (DEP)-based micro-fluidic lab-on-a-chip systems, creating field excitations that inject and move fluidic droplets onto and about the manipulation surface. The architecture of this chip is expandable to arrays of N X N identical HV electrode driver circuits and electrodes. The exciter chip is programmable in several senses. The routes of multiple droplets may be set arbitrarily within the bounds of the electrode array. The electrode excitation waveform voltage amplitude, phase, and frequency may be adjusted based on the system configuration and the signal required to manipulate a particular fluid droplet composition. The voltage amplitude of the electrode excitation waveform can be set from the minimum logic level up to the maximum limit of the breakdown voltage of the fabrication technology. The frequency of the electrode excitation waveform can also be set independently of its voltage, up to a maximum depending upon the type of droplets that must be driven. The exciter chip can be coated and its oxide surface used as the droplet manipulation surface or it can be used with a top-mounted, enclosed fluidic chamber consisting of a variety of materials. The HV capability of the exciter chip allows the generated DEP forces to penetrate into the enclosed chamber region and an adjustable voltage amplitude can accommodate a variety of chamber floor thicknesses. This demonstration exciter chip has a 32 x 32 array of nominally 100 V electrode drivers that are individually programmable at each time point in the procedure to either of two phases: 0deg and 180deg with respect to the reference clock. For this demonstration chip, while operating the electrodes with a 100-V peak-to-peak periodic waveform, the maximum HV electrode

  10. ReseqChip: Automated integration of multiple local context probe data from the MitoChip array in mitochondrial DNA sequence assembly

    Directory of Open Access Journals (Sweden)

    Spang Rainer

    2009-12-01

    Full Text Available Abstract Background The Affymetrix MitoChip v2.0 is an oligonucleotide tiling array for the resequencing of the human mitochondrial (mt genome. For each of 16,569 nucleotide positions of the mt genome it holds two sets of four 25-mer probes each that match the heavy and the light strand of a reference mt genome and vary only at their central position to interrogate all four possible alleles. In addition, the MitoChip v2.0 carries alternative local context probes to account for known mtDNA variants. These probes have been neglected in most studies due to the lack of software for their automated analysis. Results We provide ReseqChip, a free software that automates the process of resequencing mtDNA using multiple local context probes on the MitoChip v2.0. ReseqChip significantly improves base call rate and sequence accuracy. ReseqChip is available at http://code.open-bio.org/svnweb/index.cgi/bioperl/browse/bioperl-live/trunk/Bio/Microarray/Tools/. Conclusions ReseqChip allows for the automated consolidation of base calls from alternative local mt genome context probes. It thereby improves the accuracy of resequencing, while reducing the number of non-called bases.

  11. Microfungi problem, health aspects. [Storage of wood fuel chips

    Energy Technology Data Exchange (ETDEWEB)

    Jirjis, Raida (Swedish Univ. of Agricultural Sciences, Uppsala (SE). Dept. of Forest Products)

    1988-11-01

    The storage of wood fuel chips, in general, leads to the establishment of microbial activity in the pile. Fungi are one of these microorganisms which can grow vigorously in stored forest products. Different types of fungi are commonly present on wood chip pile; rot fungi, blue stain fungi and moulds. Each fungis has its optimum temperature and humidity. Fungi also differ in their ability to utilize different components of the biofuel; moulds are unable to degrade lignin and only few species can degrade cellulose. Rot fungi on the other hand can attack all parts of the substrate and degrade it to varying degrees. Sporulation in fungi is their mechanisms for reproduction and survival. The spores are produced asexually in special spore carriers which are specific for each type of fungi. In stored wood chip pile the sporulation of moulds is the source of health hazard due to its ability to produce very large numbers of microspores in a short period. These microspores are usually airborne and they are almost always present in air but their numbers differ with time, weather and location. Most people can tolerate the presence of these microfungi at concentrations up to 10{sup 6} spore/m{sup 3} air, but a more intense exposure of 10{sup 10} spores/m{sup 3} air con provoke allergic reactions in certain individuals causing allergic alveolitis. The growth of different fungi on stored wood chips pile depends on the time and the system of storage that is used for that pile. In general, indoors storage, high moisture contents and excess of fine fractions are factors that could lead to intensive fungal activity. Handling of such material necessitate the use of protective helmet to avoid the risks of allergic reactions. (4 refs.) (au).

  12. Nanoscale on-chip all-optical logic parity checker in integrated plasmonic circuits in optical communication range

    Science.gov (United States)

    Wang, Feifan; Gong, Zibo; Hu, Xiaoyong; Yang, Xiaoyu; Yang, Hong; Gong, Qihuang

    2016-01-01

    The nanoscale chip-integrated all-optical logic parity checker is an essential core component for optical computing systems and ultrahigh-speed ultrawide-band information processing chips. Unfortunately, little experimental progress has been made in development of these devices to date because of material bottleneck limitations and a lack of effective realization mechanisms. Here, we report a simple and efficient strategy for direct realization of nanoscale chip-integrated all-optical logic parity checkers in integrated plasmonic circuits in the optical communication range. The proposed parity checker consists of two-level cascaded exclusive-OR (XOR) logic gates that are realized based on the linear interference of surface plasmon polaritons propagating in the plasmonic waveguides. The parity of the number of logic 1s in the incident four-bit logic signals is determined, and the output signal is given the logic state 0 for even parity (and 1 for odd parity). Compared with previous reports, the overall device feature size is reduced by more than two orders of magnitude, while ultralow energy consumption is maintained. This work raises the possibility of realization of large-scale integrated information processing chips based on integrated plasmonic circuits, and also provides a way to overcome the intrinsic limitations of serious surface plasmon polariton losses for on-chip integration applications. PMID:27073154

  13. Nanoscale on-chip all-optical logic parity checker in integrated plasmonic circuits in optical communication range.

    Science.gov (United States)

    Wang, Feifan; Gong, Zibo; Hu, Xiaoyong; Yang, Xiaoyu; Yang, Hong; Gong, Qihuang

    2016-04-13

    The nanoscale chip-integrated all-optical logic parity checker is an essential core component for optical computing systems and ultrahigh-speed ultrawide-band information processing chips. Unfortunately, little experimental progress has been made in development of these devices to date because of material bottleneck limitations and a lack of effective realization mechanisms. Here, we report a simple and efficient strategy for direct realization of nanoscale chip-integrated all-optical logic parity checkers in integrated plasmonic circuits in the optical communication range. The proposed parity checker consists of two-level cascaded exclusive-OR (XOR) logic gates that are realized based on the linear interference of surface plasmon polaritons propagating in the plasmonic waveguides. The parity of the number of logic 1s in the incident four-bit logic signals is determined, and the output signal is given the logic state 0 for even parity (and 1 for odd parity). Compared with previous reports, the overall device feature size is reduced by more than two orders of magnitude, while ultralow energy consumption is maintained. This work raises the possibility of realization of large-scale integrated information processing chips based on integrated plasmonic circuits, and also provides a way to overcome the intrinsic limitations of serious surface plasmon polariton losses for on-chip integration applications.

  14. Thermal-Aware Scheduling for Future Chip Multiprocessors

    Directory of Open Access Journals (Sweden)

    Pedro Trancoso

    2007-04-01

    Full Text Available The increased complexity and operating frequency in current single chip microprocessors is resulting in a decrease in the performance improvements. Consequently, major manufacturers offer chip multiprocessor (CMP architectures in order to keep up with the expected performance gains. This architecture is successfully being introduced in many markets including that of the embedded systems. Nevertheless, the integration of several cores onto the same chip may lead to increased heat dissipation and consequently additional costs for cooling, higher power consumption, decrease of the reliability, and thermal-induced performance loss, among others. In this paper, we analyze the evolution of the thermal issues for the future chip multiprocessor architectures and show that as the number of on-chip cores increases, the thermal-induced problems will worsen. In addition, we present several scenarios that result in excessive thermal stress to the CMP chip or significant performance loss. In order to minimize or even eliminate these problems, we propose thermal-aware scheduler (TAS algorithms. When assigning processes to cores, TAS takes their temperature and cooling ability into account in order to avoid thermal stress and at the same time improve the performance. Experimental results have shown that a TAS algorithm that considers also the temperatures of neighboring cores is able to significantly reduce the temperature-induced performance loss while at the same time, decrease the chip's temperature across many different operation and configuration scenarios.

  15. Novel Non-Intrusive Trans-Dermal Remote Wireless Micro-Fluidic Monitoring System Applied to Continuous Glucose and Lactate Assays for Casualty Care and Combat Readiness Assessment

    Science.gov (United States)

    2004-09-01

    identification of the lettered features. 2.2 BFIT Sampling Chip The BFIT sampling chip is a flexible patch-like chip with a multilayer polymeric metal...PPy) and glucose oxidase (GOD). The BFIT fabrication process uses SU8 as a principal structural material consisting of five steps (Figure 2). This...process is a subset of an earlier technology developed for the polymer material PDMS.11,12,13,14,15 The first step was the deposition of a Teflon

  16. Insulating materials from renewable raw materials. 3. upd. ed.; Daemmstoffe aus nachwachsenden Rohstoffen

    Energy Technology Data Exchange (ETDEWEB)

    Brandhorst, Joerg; Spritzendorfer, Josef; Gildhorn, Kai; Hemp, Markus

    2009-07-01

    Due to increasing energy prices, obligations to climatic protection and the desire for comfortable, allergy-free living, the thermal insulation is a central question with building and sanitation. Under this aspect, the contribution under consideration describes the very dynamic market of the insulating materials from renewable raw materials and deals with the questions of the users. In particular, the following raw materials are considered in the production of insulating materials: Wood fibre, wood chips, wood wool, sheep wool, flax, hemp, reeds, straw, cellulose.

  17. Oxygen Carrier Aided Combustion (OCAC of Wood Chips in a Semi-Commercial Circulating Fluidized Bed Boiler Using Manganese Ore as Bed Material

    Directory of Open Access Journals (Sweden)

    Magnus Rydén

    2016-11-01

    Full Text Available Oxygen Carrier Aided Combustion (OCAC is realized by using an active oxygen-carrying bed material in fluidized bed boilers. The active material is reduced in fuel rich parts of the boiler and oxidized in air rich parts. Advantages could be achieved such as new mechanisms for oxygen transport in space and time. Here calcined manganese ore has been used as active bed material in a 12 MWth circulating fluidized bed boiler. The fuel was wood chips and the campaign lasted more than two weeks. From an operational point of view, manganese ore worked excellently. From the temperature profile of the boiler it can be concluded that fuel conversion was facilitated, especially in the dense bottom bed. The effect did not always translate to reduced emissions, which suggests that final combustion in the cyclone outlet was also influenced. Substituting 10% of the sand bed with manganese ore made it possible to reduce the air to fuel ratio without generating large amounts of CO. The use of 100% manganese ore resulted in higher emissions of CO than the sand reference, but, when combined sulphur feeding, dramatic reductions in CO emissions, up to 90% compared to sand reference, was achieved.

  18. 75 FR 30046 - Medicaid and CHIP Programs; Meeting of the CHIP Working Group-June 14, 2010

    Science.gov (United States)

    2010-05-28

    ..., Employee Benefits Security Administration, DOL at (202) 693-8335. News media representatives must contact... eligible for benefits under titles XIX or XXI of the Social Security Act (the Act) to enable them to enroll...] DEPARTMENT OF LABOR Employee Benefits Security Administration Medicaid and CHIP Programs; Meeting of the CHIP...

  19. Continuous shear - a method for studying material elements passing a stationary shear plane

    DEFF Research Database (Denmark)

    Lindegren, Maria; Wiwe, Birgitte; Wanheim, Tarras

    2003-01-01

    circumferential groove. Normally shear in metal forming processes is of another nature, namely where the material elements move through a stationary shear zone, often of small width. In this paper a method enabling the simulation of this situation is presented. A tool for continuous shear has beeen manufactured...... and tested with AlMgSil and copper. The sheared material has thereafter been tested n plane strain compression with different orientation concerning the angle between the shear plane and the compression direction....

  20. Instrument for measuring moisture in wood chips

    Energy Technology Data Exchange (ETDEWEB)

    Werme, L

    1980-06-01

    A method to determine the moisture content in wood chips, in batch and on-line, has been investigated. The method can be used for frozen and non frozen chips. Samples of wood chips are thawn and dryed with microwaves. During the drying the sample is weighed continously and the rate of drying is measured. The sample is dried t 10 percent moisture content. The result is extrapolated to the drying rate zero. The acccuracy at the method is 1.6 to 1.7 percent for both frozen and non frozen chips. The accuracy of the method is considered acceptable, but sofisticated sampling equipment is necessary. This makes the method too complex to make the instrument marketable.

  1. Characterizing Rat PNS Electrophysiological Response to Electrical Stimulation Using in vitro Chip-Based Human Investigational Platform (iCHIP)

    Energy Technology Data Exchange (ETDEWEB)

    Khani, Joshua [Georgetown Univ., Washington, DC (United States); Prescod, Lindsay [Georgetown Univ., Washington, DC (United States); Enright, Heather [Georgetown Univ., Washington, DC (United States); Felix, Sarah [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Osburn, Joanne [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Wheeler, Elizabeth [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Kulp, Kris [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2015-08-18

    Ex vivo systems and organ-on-a-chip technology offer an unprecedented approach to modeling the inner workings of the human body. The ultimate goal of LLNL’s in vitro Chip-based Human Investigational Platform (iCHIP) is to integrate multiple organ tissue cultures using microfluidic channels, multi-electrode arrays (MEA), and other biosensors in order to effectively simulate and study the responses and interactions of the major organs to chemical and physical stimulation. In this study, we focused on the peripheral nervous system (PNS) component of the iCHIP system. Specifically we sought to expound on prior research investigating the electrophysiological response of rat dorsal root ganglion cells (rDRGs) to chemical exposures, such as capsaicin. Our aim was to establish a protocol for electrical stimulation using the iCHIP device that would reliably elicit a characteristic response in rDRGs. By varying the parameters for both the stimulation properties – amplitude, phase width, phase shape, and stimulation/ return configuration – and the culture conditions – day in vitro and neural cell types - we were able to make several key observations and uncover a potential convention with a minimal number of devices tested. Future work will seek to establish a standard protocol for human DRGs in the iCHIP which will afford a portable, rapid method for determining the effects of toxins and novel therapeutics on the PNS.

  2. Rapid and Low-Cost CRP Measurement by Integrating a Paper-Based Microfluidic Immunoassay with Smartphone (CRP-Chip)

    Science.gov (United States)

    Dong, Meili; Wu, Jiandong; Ma, Zimin; Peretz-Soroka, Hagit; Zhang, Michael; Komenda, Paul; Tangri, Navdeep; Liu, Yong; Rigatto, Claudio; Lin, Francis

    2017-01-01

    Traditional diagnostic tests for chronic diseases are expensive and require a specialized laboratory, therefore limiting their use for point-of-care (PoC) testing. To address this gap, we developed a method for rapid and low-cost C-reactive protein (CRP) detection from blood by integrating a paper-based microfluidic immunoassay with a smartphone (CRP-Chip). We chose CRP for this initial development because it is a strong biomarker of prognosis in chronic heart and kidney disease. The microfluidic immunoassay is realized by lateral flow and gold nanoparticle-based colorimetric detection of the target protein. The test image signal is acquired and analyzed using a commercial smartphone with an attached microlens and a 3D-printed chip–phone interface. The CRP-Chip was validated for detecting CRP in blood samples from chronic kidney disease patients and healthy subjects. The linear detection range of the CRP-Chip is up to 2 μg/mL and the detection limit is 54 ng/mL. The CRP-Chip test result yields high reproducibility and is consistent with the standard ELISA kit. A single CRP-Chip can perform the test in triplicate on a single chip within 15 min for less than 50 US cents of material cost. This CRP-Chip with attractive features of low-cost, fast test speed, and integrated easy operation with smartphones has the potential to enable future clinical PoC chronic disease diagnosis and risk stratification by parallel measurements of a panel of protein biomarkers. PMID:28346363

  3. Real-time PCR Machine System Modeling and a Systematic Approach for the Robust Design of a Real-time PCR-on-a-Chip System

    Directory of Open Access Journals (Sweden)

    Da-Sheng Lee

    2010-01-01

    Full Text Available Chip-based DNA quantification systems are widespread, and used in many point-of-care applications. However, instruments for such applications may not be maintained or calibrated regularly. Since machine reliability is a key issue for normal operation, this study presents a system model of the real-time Polymerase Chain Reaction (PCR machine to analyze the instrument design through numerical experiments. Based on model analysis, a systematic approach was developed to lower the variation of DNA quantification and achieve a robust design for a real-time PCR-on-a-chip system. Accelerated lift testing was adopted to evaluate the reliability of the chip prototype. According to the life test plan, this proposed real-time PCR-on-a-chip system was simulated to work continuously for over three years with similar reproducibility in DNA quantification. This not only shows the robustness of the lab-on-a-chip system, but also verifies the effectiveness of our systematic method for achieving a robust design.

  4. Modified precision-husky progrind H-3045 for chipping biomass

    Science.gov (United States)

    Dana Mitchell; Fernando Seixas; John. Klepac

    2008-01-01

    A specific size of whole tree chip was needed to co-mill wood chips with coal. The specifications are stringent because chips must be mixed with coal, as opposed to a co-firing process. In co-firing, two raw products are conveyed separately to a boiler. In co-milling, such as at Alabama Power's Plant Gadsden, the chip and coal mix must pass through a series of...

  5. Experiment list: SRX319558 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available | cell type=mouse embryonic stem cells || genotype/variation=expressing control BirA || chip beads=Dynabeads... MyOne Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.bioscienc

  6. Experiment list: SRX319557 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available se embryonic stem cells || genotype/variation=expressing Flag-bio tagged Nanog || chip beads=Dynabeads MyOne... Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.biosciencedbc.j

  7. Proposing and evaluating applications for products obtained during chromium chip alkaline hydrolysis produced during leather tanning

    Directory of Open Access Journals (Sweden)

    Andrea Díaz

    2006-09-01

    Full Text Available Some applications for products obtained by chromium chip alkaline hydrolysis produced during leather tanning were evaluated in this work, considering the concept of maximising tanneries’ solid residue reuse for different industrial applications and minimising the environmental impact so produced. When Cr(OH is transformed into Cr (OH(SO it can be used in tanning leather (i.e. as tanning salt. When compared to commercial salts, 2 4 it was determined that it could be applied to mixtures containing this salt, replacing it by up to 40%. Chromium content reduction was evaluated for collagen hydrolyzate by pH control after alkaline hydrolysis of the chips and by applying adsorbent materials such as bentonite, alfalfa and sorghum biomass and activated charcoal, a maximum 55% Cr removal being obtained when the first two adsorbent materials were used.

  8. A simple clockless Network-on-Chip for a commercial audio DSP chip

    DEFF Research Database (Denmark)

    Stensgaard, Mikkel Bystrup; Bjerregaard, Tobias; Sparsø, Jens

    2006-01-01

    We design a very small, packet-switched, clockless Network-on-Chip (NoC) as a replacement for the existing crossbar-based communication infrastructure in a commercial audio DSP chip. Both solutions are laid out in a 0.18 um process, and compared in terms of area, power consumption and routing...... to the existing crossbar, it allows all blocks to communicate. The total wire length is decreased by 22% which eases the layout process and makes the design less prone to routing congestion. Not least, the communicating blocks are decoupled by means of the NoC, providing a Globally-Asynchronous, Locally...

  9. Experiment list: SRX319556 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ype=mouse embryonic stem cells || genotype/variation=expressing Flag-bio tagged Dax1 || chip beads=Dynabeads... MyOne Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.bioscienc

  10. Experiment list: SRX319553 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available se embryonic stem cells || genotype/variation=expressing Flag-bio tagged Tip60 || chip beads=Dynabeads MyOne... Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.biosciencedbc.j

  11. Experiment list: SRX319555 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ype=mouse embryonic stem cells || genotype/variation=expressing Flag-bio tagged Dax1 || chip beads=Dynabeads... MyOne Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.bioscienc

  12. Experiment list: SRX319551 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available use embryonic stem cells || genotype/variation=expressing Flag-bio tagged Dmap1 || chip beads=Dynabeads MyOn...e Streptavidin T1 || chip beads vendor=Invitrogen http://dbarchive.biosciencedbc.

  13. Space division multiplexing chip-to-chip quantum key distribution

    DEFF Research Database (Denmark)

    Bacco, Davide; Ding, Yunhong; Dalgaard, Kjeld

    2017-01-01

    nodes of the quantum keys to their respective destinations. In this paper we present an experimental demonstration of a photonic integrated silicon chip quantum key distribution protocols based on space division multiplexing (SDM), through multicore fiber technology. Parallel and independent quantum...

  14. Microfluidics without channels: highly-flexible synthesis on a digital-microfluidic chip for production of diverse PET tracers

    Energy Technology Data Exchange (ETDEWEB)

    Van Dam, Robert Michael [Univ. of California, Los Angeles, CA (United States)

    2010-09-01

    Positron emission tomography (PET) imaging is used for fundamental studies of living biological organisms and microbial ecosystems in applications ranging from biofuel production to environmental remediation to the study, diagnosis, and treatment monitoring of human disease. Routine access to PET imaging, to monitor biochemical reactions in living organisms in real time, could accelerate a broad range of research programs of interest to DOE. Using PET requires access to short-lived radioactive-labeled compounds that specifically probe the desired living processes. The overall aims of this project were to develop a miniature liquid-handling technology platform (called “microfluidics”) that increases the availability of diverse PET probes by reducing the cost and complexity of their production. Based on preliminary experiments showing that microfluidic chips can synthesis such compounds, we aimed to advance this technology to improve its robustness, increase its flexibility for a broad range of probes, and increase its user-friendliness. Through the research activities of this project, numerous advances were made; Tools were developed to enable the visualization of radioactive materials within microfluidic chips; Fundamental advances were made in the microfluidic chip architecture and fabrication process to increase its robustness and reliability; The microfluidic chip technology was shown to produce useful quantities of an example PET probes, and methods to further increase the output were successfully pursued; A “universal” chip was developed that could produce multiple types of PET probes, enabling the possibility of “on demand” synthesis of different probes; and Operation of the chip was automated to ensure minimal radiation exposure to the operator Based on the demonstrations of promising technical feasibility and performance, the microfluidic chip technology is currently being commercialized. It is anticipated that costs of microfluidic chips can be

  15. Wood harvesting as chunkwood chips and multi-stage chipping; Puun korjuu palahakkeena ja monivaiheinen lastuaminen

    Energy Technology Data Exchange (ETDEWEB)

    Kaipainen, H; Seppaenen, V

    1997-12-31

    The task for the year 1995 was to define the preliminary results of the previous years, to measure the productivity of a harvester, designed for production of chunkwood, and the properties of the chunks. The costs of the PALAPUU method from the felling site to pulpwood chips were to be examined on this basis. Because the prototype of the harvester was not yet available for field tests, the costs were partially calculated on the basis of previous measurements, completed by productivity data obtained from the time-consumption measurements of a multi-tree harvester, applied with minor alteration for this purpose. According to the calculations the PALAPUU method cannot compete with partial-tree or shortwood methods. The profitability of the method could be improved by adding the transportation density and the productivity of the harvester. It is also possible to procure timber to the mill as partial-trees and to chunk it while feeding it into the drum. Chipping tests were made using the steel-frame-chipper owned by VTT Construction Technology. The blade construction of the chipper was changed so, that it was possible to adjust the cutting thickness of the chips to 4 mm, while in the previous mill-tests it had been 6 mm. The chips were used for cooking tests in the Department of Chemistry of the University of Jyvaeskylae. The results showed that the thinner chips were cooked further under the same cooking conditions. By using the chunkwood method it is possible to harvest 10-70 more biomass for the mills, than it is possible in the pulpwood harvesting

  16. Wood harvesting as chunkwood chips and multi-stage chipping; Puun korjuu palahakkeena ja monivaiheinen lastuaminen

    Energy Technology Data Exchange (ETDEWEB)

    Kaipainen, H.; Seppaenen, V.

    1996-12-31

    The task for the year 1995 was to define the preliminary results of the previous years, to measure the productivity of a harvester, designed for production of chunkwood, and the properties of the chunks. The costs of the PALAPUU method from the felling site to pulpwood chips were to be examined on this basis. Because the prototype of the harvester was not yet available for field tests, the costs were partially calculated on the basis of previous measurements, completed by productivity data obtained from the time-consumption measurements of a multi-tree harvester, applied with minor alteration for this purpose. According to the calculations the PALAPUU method cannot compete with partial-tree or shortwood methods. The profitability of the method could be improved by adding the transportation density and the productivity of the harvester. It is also possible to procure timber to the mill as partial-trees and to chunk it while feeding it into the drum. Chipping tests were made using the steel-frame-chipper owned by VTT Construction Technology. The blade construction of the chipper was changed so, that it was possible to adjust the cutting thickness of the chips to 4 mm, while in the previous mill-tests it had been 6 mm. The chips were used for cooking tests in the Department of Chemistry of the University of Jyvaeskylae. The results showed that the thinner chips were cooked further under the same cooking conditions. By using the chunkwood method it is possible to harvest 10-70 more biomass for the mills, than it is possible in the pulpwood harvesting

  17. Comparison of a Ring On-Chip Network and a Code-Division Multiple-Access On-Chip Network

    Directory of Open Access Journals (Sweden)

    Xin Wang

    2007-01-01

    Full Text Available Two network-on-chip (NoC designs are examined and compared in this paper. One design applies a bidirectional ring connection scheme, while the other design applies a code-division multiple-access (CDMA connection scheme. Both of the designs apply globally asynchronous locally synchronous (GALS scheme in order to deal with the issue of transferring data in a multiple-clock-domain environment of an on-chip system. The two NoC designs are compared with each other by their network structures, data transfer principles, network node structures, and their asynchronous designs. Both the synchronous and the asynchronous designs of the two on-chip networks are realized using a hardware-description language (HDL in order to make the entire designs suit the commonly used synchronous design tools and flow. The performance estimation and comparison of the two NoC designs which are based on the HDL realizations are addressed. By comparing the two NoC designs, the advantages and disadvantages of applying direct connection and CDMA connection schemes in an on-chip communication network are discussed.

  18. Experiment list: SRX319550 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e embryonic stem cells || genotype/variation=expressing Flag-bio tagged Myc || chip beads=Dynabeads MyOne Streptavidin T1 || chip bea...ds vendor=Invitrogen http://dbarchive.biosciencedbc.jp/k

  19. 3D-printed microfluidic chips with patterned, cell-laden hydrogel constructs.

    Science.gov (United States)

    Knowlton, Stephanie; Yu, Chu Hsiang; Ersoy, Fulya; Emadi, Sharareh; Khademhosseini, Ali; Tasoglu, Savas

    2016-06-20

    Three-dimensional (3D) printing offers potential to fabricate high-throughput and low-cost fabrication of microfluidic devices as a promising alternative to traditional techniques which enables efficient design iterations in the development stage. In this study, we demonstrate a single-step fabrication of a 3D transparent microfluidic chip using two alternative techniques: a stereolithography-based desktop 3D printer and a two-step fabrication using an industrial 3D printer based on polyjet technology. This method, compared to conventional fabrication using relatively expensive materials and labor-intensive processes, presents a low-cost, rapid prototyping technique to print functional 3D microfluidic chips. We enhance the capabilities of 3D-printed microfluidic devices by coupling 3D cell encapsulation and spatial patterning within photocrosslinkable gelatin methacryloyl (GelMA). The platform presented here serves as a 3D culture environment for long-term cell culture and growth. Furthermore, we have demonstrated the ability to print complex 3D microfluidic channels to create predictable and controllable fluid flow regimes. Here, we demonstrate the novel use of 3D-printed microfluidic chips as controllable 3D cell culture environments, advancing the applicability of 3D printing to engineering physiological systems for future applications in bioengineering.

  20. Comparative studies on storage and drying of chips and chunks in Norway

    Energy Technology Data Exchange (ETDEWEB)

    Gjoelsjoe, S. (Norwegian Forest Research Inst. (Norway))

    1988-11-01

    Knowledge of sporulation and alteration in moisture content and dry-matter content is essential when trying to determine optimal conditions for storage of wood fuel. The object of this experiment has been to study the progression of these variables in wood fuel of varying sizes. The material used was debranched stemwood of birch. The wood was comminuted up and stored in three different sizes. The sizes were chips (length approx. 3 cm), chunkwood (approx. 8 cm) and firewood (approx. 15 cm). The fuelwood was stored in bines of 10 m{sup 3} with netting floor and netting walls. Six of the bins were covered, the remaining six were without cover. The highest temperature increase was found in chips, particularly during the first stages of storage when temperature reached approximately 30 C. The other fuel sizes had temperature close to ambient temperature. At the start of the test, moisture content was approximately 40 %. By the end of the test the moisture content was below 20% for firewood and chunkwood under cover. The moisture was measured 50 cm from the top and 50 cm from the sidewall of the bin. Whilst chips without cover had a moisture content of more than 60%. Storage under cover resulted in a higher reduction of moisture content than storage without cover. The smaller sizes exhibited the greatest difference in moisture content. The highest dry-matter loss during the storage time was found in chips stored under cover, approximately 1.2% per month. Dry-matter loss was lowest in firewood stored under cover 0.07% per month. Dry-matter loss decreased with increasing size. Spores and dust particles had the highest concentrations in chips and lowest in firewood. (12 refs., 10 figs., 8 tabs.) (au).

  1. A fast template matching method for LED chip Localization

    Directory of Open Access Journals (Sweden)

    Zhong Fuqiang

    2015-01-01

    Full Text Available Efficiency determines the profits of the semiconductor producers. So the producers spare no effort to enhance the efficiency of every procedure. The purpose of the paper is to present a method to shorten the time to locate the LED chips on wafer. The method consists of 3 steps. Firstly, image segmentation and blob analyzation are used to predict the positions of potential chips. Then predict the orientations of potential chips based on their dominant orientations. Finally, according to the positions and orientations predicted above, locate the chips precisely based on gradient orientation features. Experiments show that the algorithm is faster than the traditional method we choose to locate the LED chips. Besides, even the orientations of the chips on wafer are of big deviation to the orientation of the template, the efficiency of this method won't be affected.

  2. Study of the ALICE Investigator chip in view of the requirements at CLIC

    CERN Document Server

    AUTHOR|(SzGeCERN)754303; Dannheim, Dominik; Fiergolski, Adrian; Van Hoorne, Jacobus Willem; Hynds, Daniel; Klempt, Wolfgang; Nurnberg, Andreas Matthias; Sielewicz, Krzysztof Marek; Snoeys, Walter

    2017-01-01

    CLIC is an option for a future high energy linear $e^{+}e^{−}$ collider at CERN in the post-LHC era. The CLIC machine is designed to reach centre-of-mass energies ranging from a few hundred GeV up to 3 TeV. To achieve high precision measurements, e.g. of the Higgs- width, challenging requirements are imposed on the CLIC detector. A single point tracking resolution of 7 μm and a material budget of 1-2%$X_{0}$ per layer are required for the tracker. Moreover, to suppress background hits from beam-beam interactions, a precise time slicing of hits of 10 ns is needed. To address these requirements, a large area silicon tracker is foreseen for the detector at CLIC. In this context, integrated technologies are promising candidates to achieve large scale production and low material budget. The Investigator chip is a test chip developed for the ALICE Inner Tracking System upgrade, implemented in a 180 nm CMOS process on a high resistivity substrate. It contains various test-matrices with analogue functionality, whi...

  3. Experiment list: SRX180159 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available sd || cell type=hemogenic endothelium || chip antibody=CEBPb || chip antibody vendor=santa cruz biotechnol...ogy http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachData/bw/SRX180159.bw http://

  4. Experiment list: SRX112178 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available line=OS25 ES cells || chip antibody=8WG16 (MMS-126R, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Magnetic beads http://dbarchive.biosciencedbc.jp/kyushu-u/mm

  5. Mechanical properties of freeze-dried and irradiated bone chips, fascia lata and dura mater

    International Nuclear Information System (INIS)

    De Guzman, Z.M.; Vajaradul, Y.

    1996-01-01

    The comparison strengths of freeze-dried and irradiated bone chips such as three-dimensional cortex (3DC) and two-cortico cancellous (2CC) are investigated. The results show that the (3DC) exhibits a higher compression strength (1.2kN cm -2 in deep frozen states. Rehydration of the freeze-dried bone chips after 15 min with normal saline solution restores the strength of materials by 30%. The tensile strengths of fascia lata and dura mater are also studied. A marked decrease of tensile strength is noted in the irradiated and freeze-dried samples, however, reconstitution with normal saline solution restores the tensile strength of the tissues to about 40-56%. (author). 8 refs., 6figs

  6. Tunable on chip optofluidic laser

    DEFF Research Database (Denmark)

    Bakal, Avraham; Vannahme, Christoph; Kristensen, Anders

    2016-01-01

    On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range.......On chip tunable laser is demonstrated by realizing a microfluidic droplet array. The periodicity is controlled by the pressure applied to two separate inlets, allowing to tune the lasing frequency over a broad spectral range....

  7. HARDWARE IMPLEMENTATION OF PIPELINE BASED ROUTER DESIGN FOR ON-CHIP NETWORK

    Directory of Open Access Journals (Sweden)

    U. Saravanakumar

    2012-12-01

    Full Text Available As the feature size is continuously decreasing and integration density is increasing, interconnections have become a dominating factor in determining the overall quality of a chip. Due to the limited scalability of system bus, it cannot meet the requirement of current System-on-Chip (SoC implementations where only a limited number of functional units can be supported. Long global wires also cause many design problems, such as routing congestion, noise coupling, and difficult timing closure. Network-on-Chip (NoC architectures have been proposed to be an alternative to solve the above problems by using a packet-based communication network. In this paper, the Circuit-Switched (CS Router was designed and analysed the various parameters such as power, timing and area. The CS router has taken more number of cycles to transfer the data from source to destination. So the pipelining concept was implemented by adding registers in the CS router architecture. The proposed architecture increases the speed of operation and reduces the critical path of the circuit. The router has been implemented using Verilog HDL. The parameters area, power and timing were calculated in 130 nm CMOS technology using Synopsys tool with nominal operating voltage of 1V and packet size is 39 bits. Finally power, area and time of these two routers have been analysed and compared.

  8. Experiment list: SRX185907 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available Homo sapiens; ChIP-Seq source_name=MCF-7 breast adenocarcinoma cells, control, FOXM1 ChIP || cell_line=MCF-...7 || cell_type=ER-positive breast adenocarcinoma cells || treatment=DMSO || chip_

  9. Experiment list: SRX319552 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available embryonic stem cells || genotype/variation=expressing Flag-bio tagged E2F4 || chip beads=Dynabeads MyOne Streptavidin T1 || chip bea...ds vendor=Invitrogen http://dbarchive.biosciencedbc.jp/k

  10. Experiment list: SRX112184 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available line=OS25 ES cells || chip antibody=CTD4H8 (MMS-128P, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Sepharose beads http://dbarchive.biosciencedbc.jp/kyushu-u/m

  11. Experiment list: SRX367328 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nology) || sirna transfection=siCTL http://dbarchive.bio...=HEK293T cell || cell line=Human Embryonic Kidney 293 cells || chip antibody=CDK9 || chip antibody details=2316S (Cell Signaling Tech

  12. Experiment list: SRX543048 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/ea...CID.adh murine thymic lymphoma || development stage=DN3 || chip antibody=rabbit anti-Miz-1 || chip antibody vendor=Santa Cruz Biotech

  13. Design of Networks-on-Chip for Real-Time Multi-Processor Systems-on-Chip

    DEFF Research Database (Denmark)

    Sparsø, Jens

    2012-01-01

    This paper addresses the design of networks-on-chips for use in multi-processor systems-on-chips - the hardware platforms used in embedded systems. These platforms typically have to guarantee real-time properties, and as the network is a shared resource, it has to provide service guarantees...... (bandwidth and/or latency) to different communication flows. The paper reviews some past work in this field and the lessons learned, and the paper discusses ongoing research conducted as part of the project "Time-predictable Multi-Core Architecture for Embedded Systems" (T-CREST), supported by the European...

  14. CMOS Image Sensors: Electronic Camera On A Chip

    Science.gov (United States)

    Fossum, E. R.

    1995-01-01

    Recent advancements in CMOS image sensor technology are reviewed, including both passive pixel sensors and active pixel sensors. On- chip analog to digital converters and on-chip timing and control circuits permit realization of an electronic camera-on-a-chip. Highly miniaturized imaging systems based on CMOS image sensor technology are emerging as a competitor to charge-coupled devices for low cost uses.

  15. Experiment list: SRX185915 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available mo sapiens; ChIP-Seq source_name=MCF-7 breast adenocarcinoma cells, control, FOXM1 ChIP || cell_line=MCF-7 |...| cell_type=ER-positive breast adenocarcinoma cells || treatment=DMSO || chip_tar

  16. Experiment list: SRX185909 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available omo sapiens; ChIP-Seq source_name=MCF-7 breast adenocarcinoma cells, control, FOXM1 ChIP || cell_line=MCF-7 ...|| cell_type=ER-positive breast adenocarcinoma cells || treatment=DMSO || chip_ta

  17. Experiment list: SRX185917 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available omo sapiens; ChIP-Seq source_name=MCF-7 breast adenocarcinoma cells, control, FOXM1 ChIP || cell_line=MCF-7 ...|| cell_type=ER-positive breast adenocarcinoma cells || treatment=DMSO || chip_ta

  18. Experiment list: SRX112179 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available =OS25 ES cells || chip antibody=H5 (MMS-129R, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads=Magnetic bea...ds http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachDa

  19. Experiment list: SRX367330 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nology) || sirna transfection=siBrd4 http://dbarchive.bi...=HEK293T cell || cell line=Human Embryonic Kidney 293 cells || chip antibody=CDK9 || chip antibody details=2316S (Cell Signaling Tech

  20. Wood chips procurement and research project at the Mikkeli region

    International Nuclear Information System (INIS)

    Saksa, T.; Auvinen, P.

    1996-01-01

    In 1993-94, a large-scale energywood production chain started as a co-operation project by the Mikkeli city forest office and local forestry societies. In 1995 over 115 000 m 3 (about 85 000 MWh of energy) of wood chips were delivered to Pursiala heat and power plant in Mikkeli. About 75 % of these chips was forest processed chips. About 70 % of the forest processed chips was whole tree chips from improvement cuttings of young forest stands and the rest was logging waste chips from regeneration cutting areas. The average total delivery costs of forest processed chips after reduction of energywood and other subsidies were approximately 45 FIM/m 3 (60 FIM/MWh) for the whole tree chips and 38 FIM/m 3 (50 FIM/MWh) for logging waste chips. The delivery costs of forest processed chips could meet the target of Bioenergy Research Programme (45 FIM/MWh) only in the most favourable cases. In an average the delivery costs were about 9 FIM/MWh more than the price obtained when sold to the heat and power plant. However the wood chip production created 27 new jobs and the increase of income to the local economy was about 2.2 milj. FIM /year. The local communities got new tax revenue about 3 FIM/MWh. The gain for the forestry was approximated to be 5 - 6 FIM/MWh. The resources of forest processed chips were studied on the basis of stand measurements. According to the study the most remarkable energywood resources were in young thinning stands on Oxalis-Myrtillus and Myrtillus forest site types. On Oxalis-Myrtillus type almost every and on Myrtillus type every second stand included energywood more than 40 m 3 /ha

  1. A primary battery-on-a-chip using monolayer graphene

    Science.gov (United States)

    Iost, Rodrigo M.; Crespilho, Frank N.; Kern, Klaus; Balasubramanian, Kannan

    2016-07-01

    We present here a bottom-up approach for realizing on-chip on-demand batteries starting out with chemical vapor deposition-grown graphene. Single graphene monolayers contacted by electrode lines on a silicon chip serve as electrodes. The anode and cathode are realized by electrodeposition of zinc and copper respectively onto graphene, leading to the realization of a miniature graphene-based Daniell cell on a chip. The electrolyte is housed partly in a gel and partly in liquid form in an on-chip enclosure molded using a 3d printer or made out of poly(dimethylsiloxane). The realized batteries provide a stable voltage (∼1.1 V) for many hours and exhibit capacities as high as 15 μAh, providing enough power to operate a pocket calculator. The realized batteries show promise for deployment as on-chip power sources for autonomous systems in lab-on-a-chip or biomedical applications.

  2. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  3. Microfluidic Organ-on-a-Chip Models of Human IntestineSummary

    Directory of Open Access Journals (Sweden)

    Amir Bein

    Full Text Available Microfluidic organ-on-a-chip models of human intestine have been developed and used to study intestinal physiology and pathophysiology. In this article, we review this field and describe how microfluidic Intestine Chips offer new capabilities not possible with conventional culture systems or organoid cultures, including the ability to analyze contributions of individual cellular, chemical, and physical control parameters one-at-a-time; to coculture human intestinal cells with commensal microbiome for extended times; and to create human-relevant disease models. We also discuss potential future applications of human Intestine Chips, including how they might be used for drug development and personalized medicine. Keywords: Organs-on-Chips, Gut-on-a-Chip, Intestine-on-a-Chip, Microfluidic

  4. Experiment list: SRX112176 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available e=OS25 ES cells || chip antibody=CTD4H8 (MMS-128P, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Magnetic beads http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/e

  5. Developing an Integrated Design Strategy for Chip Layout Optimization

    NARCIS (Netherlands)

    Wits, Wessel Willems; Jauregui Becker, Juan Manuel; van Vliet, Frank Edward; te Riele, G.J.

    2011-01-01

    This paper presents an integrated design strategy for chip layout optimization. The strategy couples both electric and thermal aspects during the conceptual design phase to improve chip performances; thermal management being one of the major topics. The layout of the chip circuitry is optimized

  6. Metaphase FISH on a Chip: Miniaturized Microfluidic Device for Fluorescence in situ Hybridization

    DEFF Research Database (Denmark)

    Vedarethinam, Indumathi; Shah, Pranjul Jaykumar; Dimaki, Maria

    2010-01-01

    -FISH, the process continues to be a manual, labour intensive, expensive and time consuming technique, often taking over 3-5 days, even in dedicated labs. We have developed a novel microFISH device to perform metaphase FISH on a chip which overcomes many shortcomings of the current laboratory protocols. This work...... also introduces a novel splashing device for preparing metaphase spreads on a microscope glass slide, followed by a rapid adhesive tape-based bonding protocol leading to rapid fabrication of the microFISH device. The microFISH device allows for an optimized metaphase FISH protocol on a chip with over...... a 20-fold reduction in the reagent volume. This is the first demonstration of metaphase FISH on a microfluidic device and offers a possibility of automation and significant cost reduction of many routine diagnostic tests of genetic anomalies....

  7. Single-chip ring resonator-based 1 x 8 optical beam forming network in CMOS-compatible waveguide technology

    NARCIS (Netherlands)

    Zhuang, L.; Roeloffzen, C.G.H.; Heideman, Rene; Borreman, A.; Meijerink, Arjan; van Etten, Wim

    2007-01-01

    Optical ring resonators (ORRs) are good candidates to provide continuously tunable delay in optical beam forming networks (OBFNs) for phased array antenna systems. Delay and splitting/combining elements can be integrated on a single optical chip to form an OBFN. A state-of-the-art ring resonator-

  8. Opto-electronic DNA chip-based integrated card for clinical diagnostics.

    Science.gov (United States)

    Marchand, Gilles; Broyer, Patrick; Lanet, Véronique; Delattre, Cyril; Foucault, Frédéric; Menou, Lionel; Calvas, Bernard; Roller, Denis; Ginot, Frédéric; Campagnolo, Raymond; Mallard, Frédéric

    2008-02-01

    Clinical diagnostics is one of the most promising applications for microfluidic lab-on-a-chip or lab-on-card systems. DNA chips, which provide multiparametric data, are privileged tools for genomic analysis. However, automation of molecular biology protocol and use of these DNA chips in fully integrated systems remains a great challenge. Simplicity of chip and/or card/instrument interfaces is amongst the most critical issues to be addressed. Indeed, current detection systems for DNA chip reading are often complex, expensive, bulky and even limited in terms of sensitivity or accuracy. Furthermore, for liquid handling in the lab-on-cards, many devices use complex and bulky systems, either to directly manipulate fluids, or to ensure pneumatic or mechanical control of integrated valves. All these drawbacks prevent or limit the use of DNA-chip-based integrated systems, for point-of-care testing or as a routine diagnostics tool. We present here a DNA-chip-based protocol integration on a plastic card for clinical diagnostics applications including: (1) an opto-electronic DNA-chip, (2) fluid handling using electrically activated embedded pyrotechnic microvalves with closing/opening functions. We demonstrate both fluidic and electric packaging of the optoelectronic DNA chip without major alteration of its electronical and biological functionalities, and fluid control using novel electrically activable pyrotechnic microvalves. Finally, we suggest a complete design of a card dedicated to automation of a complex biological protocol with a fully electrical fluid handling and DNA chip reading.

  9. Integrated lasers for polymer Lab-on-a-Chip systems

    DEFF Research Database (Denmark)

    Mappes, Timo; Vannahme, Christoph; Grosmann, Tobias

    2012-01-01

    We develop optical Lab-on-a-Chips on different platforms for marker-based and label-free biophotonic sensor applications. Our chips are based on polymers and fabricated by mass production technologies to integrate microfluidic channels, optical waveguides and miniaturized lasers.......We develop optical Lab-on-a-Chips on different platforms for marker-based and label-free biophotonic sensor applications. Our chips are based on polymers and fabricated by mass production technologies to integrate microfluidic channels, optical waveguides and miniaturized lasers....

  10. Experiment list: SRX262781 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available _name=NIH3T3_SRF_15 || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=SRF || chip antibody vendor=Santa Cruz Biotec...hnology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/e

  11. Experiment list: SRX262786 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available H3T3_MRTFA_15 || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=MRTF-A || chip antibody vendor=Santa Cruz Biotechno...logy http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/each

  12. Experiment list: SRX262791 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available IH3T3_MRTFB_LAT || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=MRTF-B || chip antibody vendor=Santa Cruz Biotech...nology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/ea

  13. Experiment list: SRX262782 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available echnology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9...ce_name=NIH3T3_SRF_15 || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=SRF || chip antibody vendor=Santa Cruz Biot

  14. Experiment list: SRX262788 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available IH3T3_MRTFA_UO || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=MRTF-A || chip antibody vendor=Santa Cruz Biotechn...ology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eac

  15. Experiment list: SRX262787 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available IH3T3_MRTFA_LAT || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=MRTF-A || chip antibody vendor=Santa Cruz Biotech...nology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/ea

  16. Experiment list: SRX262780 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available chnology http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/...e_name=NIH3T3_SRF_03 || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=SRF || chip antibody vendor=Santa Cruz Biote

  17. In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon

    Science.gov (United States)

    Tokel, Onur; Turnalı, Ahmet; Makey, Ghaith; Elahi, Parviz; ćolakoǧlu, Tahir; Ergeçen, Emre; Yavuz, Ã.-zgün; Hübner, René; Zolfaghari Borra, Mona; Pavlov, Ihor; Bek, Alpan; Turan, Raşit; Kesim, Denizhan Koray; Tozburun, Serhat; Ilday, Serim; Ilday, F. Ã.-mer

    2017-10-01

    Silicon is an excellent material for microelectronics and integrated photonics1-3, with untapped potential for mid-infrared optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow the fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realized with techniques like reactive ion etching. Embedded optical elements7, electronic devices and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1-µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has an optical index different to that in unmodified parts, enabling the creation of numerous photonic devices. Optionally, these parts can be chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface—that is, `in-chip'—microstructures for microfluidic cooling of chips, vias, micro-electro-mechanical systems, photovoltaic applications and photonic devices that match or surpass corresponding state-of-the-art device performances.

  18. In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon.

    Science.gov (United States)

    Tokel, Onur; Turnali, Ahmet; Makey, Ghaith; Elahi, Parviz; Çolakoğlu, Tahir; Ergeçen, Emre; Yavuz, Özgün; Hübner, René; Borra, Mona Zolfaghari; Pavlov, Ihor; Bek, Alpan; Turan, Raşit; Kesim, Denizhan Koray; Tozburun, Serhat; Ilday, Serim; Ilday, F Ömer

    2017-10-01

    Silicon is an excellent material for microelectronics and integrated photonics1-3 with untapped potential for mid-IR optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realised with techniques like reactive ion etching. Embedded optical elements, like in glass7, electronic devices, and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1 µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has a different optical index than unmodified parts, which enables numerous photonic devices. Optionally, these parts are chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface, i.e. , " in-chip" microstructures for microfluidic cooling of chips, vias, MEMS, photovoltaic applications and photonic devices that match or surpass the corresponding state-of-the-art device performances.

  19. 3D Printing of Organs-On-Chips.

    Science.gov (United States)

    Yi, Hee-Gyeong; Lee, Hyungseok; Cho, Dong-Woo

    2017-01-25

    Organ-on-a-chip engineering aims to create artificial living organs that mimic the complex and physiological responses of real organs, in order to test drugs by precisely manipulating the cells and their microenvironments. To achieve this, the artificial organs should to be microfabricated with an extracellular matrix (ECM) and various types of cells, and should recapitulate morphogenesis, cell differentiation, and functions according to the native organ. A promising strategy is 3D printing, which precisely controls the spatial distribution and layer-by-layer assembly of cells, ECMs, and other biomaterials. Owing to this unique advantage, integration of 3D printing into organ-on-a-chip engineering can facilitate the creation of micro-organs with heterogeneity, a desired 3D cellular arrangement, tissue-specific functions, or even cyclic movement within a microfluidic device. Moreover, fully 3D-printed organs-on-chips more easily incorporate other mechanical and electrical components with the chips, and can be commercialized via automated massive production. Herein, we discuss the recent advances and the potential of 3D cell-printing technology in engineering organs-on-chips, and provides the future perspectives of this technology to establish the highly reliable and useful drug-screening platforms.

  20. Chip-based microtrap arrays for cold polar molecules

    Science.gov (United States)

    Hou, Shunyong; Wei, Bin; Deng, Lianzhong; Yin, Jianping

    2017-12-01

    Compared to the atomic chip, which has been a powerful platform to perform an astonishing range of applications from rapid Bose-Einstein condensate (BEC) production to the atomic clock, the molecular chip is only in its infant stages. Recently a one-dimensional electric lattice was demonstrated to trap polar molecules on a chip. This excellent work opens up the way to building a molecular chip laboratory. Here we propose a two-dimensional (2D) electric lattice on a chip with concise and robust structure, which is formed by arrays of squared gold wires. Arrays of microtraps that originate in the microsize electrodes offer a steep gradient and thus allow for confining both light and heavy polar molecules. Theoretical analysis and numerical calculations are performed using two types of sample molecules, N D3 and SrF, to justify the possibility of our proposal. The height of the minima of the potential wells is about 10 μm above the surface of the chip and can be easily adjusted in a wide range by changing the voltages applied on the electrodes. These microtraps offer intriguing perspectives for investigating cold molecules in periodic potentials, such as quantum computing science, low-dimensional physics, and some other possible applications amenable to magnetic or optical lattice. The 2D adjustable electric lattice is expected to act as a building block for a future gas-phase molecular chip laboratory.

  1. Energy dissipation effects on imaging of soft materials by dynamic atomic force microscopy: A DNA-chip study

    Energy Technology Data Exchange (ETDEWEB)

    Phaner-Goutorbe, M., E-mail: magali.phaner@ec-lyon.fr [Université de Lyon, Institut des Nanotechnologies de Lyon (INL) UMR CNRS 5270, Ecole Centrale de Lyon, 36 Avenue Guy de Collongue, 69134 Ecully (France); Iazykov, M. [Université de Lyon, laboratoire de Physique, Ecole Normale Supérieure de Lyon, 46 allée d' Italie 69364 Lyon cedex 07 (France); Villey, R. [Université de Lyon, Institut des Nanotechnologies de Lyon (INL) UMR CNRS 5270, Ecole Centrale de Lyon, 36 Avenue Guy de Collongue, 69134 Ecully (France); Université de Lyon, laboratoire de Physique de la Matière Condensée et Nanostructures, Université Claude Bernard Lyon 1, Domaine Scientifique de la Doua, Bâtiment Léon Brillouin 43 boulevard du 11 Novembre 1918, F 69622 Villeurbanne (France); Sicard, D.; Robach, Y. [Université de Lyon, Institut des Nanotechnologies de Lyon (INL) UMR CNRS 5270, Ecole Centrale de Lyon, 36 Avenue Guy de Collongue, 69134 Ecully (France)

    2013-05-01

    Using amplitude-mode AFM (AM-AFM), we have obtained valuable information during these recent years through the study of amplitude and phase shift dependence on tip–sample separation, leading to a comprehensive understanding of the interaction processes. Two imaging regimes, attractive and repulsive, have been identified and a relationship between phase and dissipative energy was established, providing information on observed material properties. Most of the previous studies have concerned model systems: either hard or soft materials. In this paper, we present the analysis of a mixed system of soft structures on a hard substrate. This is a DNA chip for biological applications consisting of oligonucleotides covalently linked by a layer of silane to a silicon substrate. A detailed study of amplitude-phase curves as a function of the tip–sample separation allowed us to define the best experimental conditions to obtain specific information: we got reliable conditions to minimize noise during topographic imaging and an understanding of the processes of energy dissipation involved in the DNA breaking for DNA arrays. By calculating the energy dissipated as a function of the amplitude of oscillation, we have demonstrated a transition from an energy dissipation process governed by localized viscoelastic interactions (due to the soft layer) to a process governed by extended irreversible deformations (due to the hard substrate). Highlights: ► Amplitude mode AFM analysis of a DNA array is presented. ► Reliable conditions for noise minimization on topographic images are presented. ► Phase, amplitude vs distance curves are analyzed for different setpoint amplitudes. ► Energy dissipation processes are described from viscoelasticity to DNA breaking.

  2. MHz-level self-sustained pulsation in polymer microspheres on a chip

    Directory of Open Access Journals (Sweden)

    Zhou-Chen Luo

    2014-12-01

    Full Text Available We observe MHz-level periodic self-sustained pulsation (SSP in the transmission spectrum of a polydimethylsiloxane (PDMS spherical microcavity on a silicon chip, under a fixed-frequency continuous laser excitation. The SSP results from the strong competition between the thermo-optic and thermal expansion effects of PDMS within the cavity mode volume. The experimental results show good agreement with the theoretical prediction by considering the modification of the thermal expansion coefficient and the temperature distribution within the mode volume.

  3. An Energy-Efficient Reconfigurable Circuit Switched Network-on-Chip

    NARCIS (Netherlands)

    Wolkotte, P.T.; Smit, Gerardus Johannes Maria; Rauwerda, G.K.; Smit, L.T.

    Network-on-Chip (NoC) is an energy-efficient on-chip communication architecture for multi-tile System-on-Chip (SoC) architectures. The SoC architecture, including its run-time software, can replace inflexible ASICs for future ambient systems. These ambient systems have to be flexible as well as

  4. Energy Model of Networks-on-Chip and a Bus

    NARCIS (Netherlands)

    Wolkotte, P.T.; Smit, Gerardus Johannes Maria; Kavaldjiev, N.K.; Becker, Jens E.; Becker, Jürgen; Nurmi, J.; Takala, J.; Hamalainen, T.D.

    2005-01-01

    A Network-on-Chip (NoC) is an energy-efficient onchip communication architecture for Multi-Processor Systemon-Chip (MPSoC) architectures. In earlier papers we proposed two Network-on-Chip architectures based on packet-switching and circuit-switching. In this paper we derive an energy model for both

  5. Reagent-loaded plastic microfluidic chips for detecting homocysteine

    International Nuclear Information System (INIS)

    Suk, Ji Won; Jang, Jae-Young; Cho, Jun-Hyeong

    2008-01-01

    This report describes the preliminary study on plastic microfluidic chips with pre-loaded reagents for detecting homocysteine (Hcy). All reagents needed in an Hcy immunoassay were included in a microfluidic chip to remove tedious assay steps. A simple and cost-effective bonding method was developed to realize reagent-loaded microfluidic chips. This technique uses an intermediate layer between two plastic substrates by selectively patterning polydimethylsiloxane (PDMS) on the embossed surface of microchannels and fixing the substrates under pressure. Using this bonding method, the competitive immunoassay for SAH, a converted form of Hcy, was performed without any damage to reagents in chips, and the results showed that the fluorescent signal from antibody antigen binding decreased as the SAH concentration increased. Based on the SAH immunoassay, whole immunoassay steps for Hcy detection were carried out in plastic microfluidic chips with all necessary reagents. These experiments demonstrated the feasibility of the Hcy immunoassay in microfluidic devices

  6. Experiment list: SRX262797 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 3T3_SAP1_03 || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=SAP-1a || chip antibody vendor=Santa Cruz Biotechnolo...gy http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachDa

  7. Experiment list: SRX262799 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available H3T3_SAP1_LAT || cell line=NIH3T3 fibroblasts || genotype=normal || chip antibody=SAP-1a || chip antibody vendor=Santa Cruz Biotechno...logy http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/each

  8. Experiment list: SRX352046 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available SM1232564: CSB M CHIP; Homo sapiens; ChIP-Seq source_name=fibroblast_menadione_CSB-ChIP || cell type=fibroblast || treated with=menad...ione || chip antibody=Mouse monoclonal anti-CSB N Terminus (1B1) http://dbarchive.b

  9. Microneedle Array Interface to CE on Chip

    NARCIS (Netherlands)

    Lüttge, Regina; Gardeniers, Johannes G.E.; Vrouwe, E.X.; van den Berg, Albert; Northrup, M.A.; Jensen, K.F; Harrison, D.J.

    2003-01-01

    This paper presents a microneedle array sampler interfaced to a capillary electrophoresis (CE) glass chip with integrated conductivity detection electrodes. A solution of alkali ions was electrokinetically loaded through the microneedles onto the chip and separation was demonstrated compared to a

  10. Experiment list: SRX144526 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available stein-Barr Virus transformed 11803840,92.5,91.6,38 GSM922971: NRF2 ChIP vehicle treated rep2; Homo sapiens; ...ChIP-Seq source_name=NRF2 ChIP vehicle treated || biomaterial_provider=Coriell; h

  11. Experiment list: SRX151245 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 0: CTCF ChIPSeq; Homo sapiens; ChIP-Seq source_name=BCBL1 pleural effusion lymphoma, CTCF ChIP || cell line=...BCBL1 || cell type=KSHV-infected pleural effusion lymphoma cells || chip antibody=rabbit anti-CTCF || antibo

  12. chipPCR: an R package to pre-process raw data of amplification curves.

    Science.gov (United States)

    Rödiger, Stefan; Burdukiewicz, Michał; Schierack, Peter

    2015-09-01

    Both the quantitative real-time polymerase chain reaction (qPCR) and quantitative isothermal amplification (qIA) are standard methods for nucleic acid quantification. Numerous real-time read-out technologies have been developed. Despite the continuous interest in amplification-based techniques, there are only few tools for pre-processing of amplification data. However, a transparent tool for precise control of raw data is indispensable in several scenarios, for example, during the development of new instruments. chipPCR is an R: package for the pre-processing and quality analysis of raw data of amplification curves. The package takes advantage of R: 's S4 object model and offers an extensible environment. chipPCR contains tools for raw data exploration: normalization, baselining, imputation of missing values, a powerful wrapper for amplification curve smoothing and a function to detect the start and end of an amplification curve. The capabilities of the software are enhanced by the implementation of algorithms unavailable in R: , such as a 5-point stencil for derivative interpolation. Simulation tools, statistical tests, plots for data quality management, amplification efficiency/quantification cycle calculation, and datasets from qPCR and qIA experiments are part of the package. Core functionalities are integrated in GUIs (web-based and standalone shiny applications), thus streamlining analysis and report generation. http://cran.r-project.org/web/packages/chipPCR. Source code: https://github.com/michbur/chipPCR. stefan.roediger@b-tu.de Supplementary data are available at Bioinformatics online. © The Author 2015. Published by Oxford University Press. All rights reserved. For Permissions, please e-mail: journals.permissions@oup.com.

  13. Electromagnetic design methods in systems-on-chip: integrated filters for wireless CMOS RFICs

    International Nuclear Information System (INIS)

    Contopanagos, Harry

    2005-01-01

    We present general methods for designing on-chip CMOS passives and utilizing these integrated elements to design on-chip CMOS filters for wireless communications. These methods rely on full-wave electromagnetic numerical calculations that capture all the physics of the underlying foundry technologies. This is especially crucial for deep sub-micron CMOS technologies as it is important to capture the physical effects of finite (and mediocre) Q-factors limited by material losses and constraints on expensive die area, low self-resonance frequencies and dual parasitics that are particularly prevalent in deep sub-micron CMOS processes (65 nm-0.18 μm. We use these integrated elements in an ideal synthesis of a Bluetooth/WLAN pass-band filter in single-ended or differential architectures, and show the significant deviations of the on-chip filter response from the ideal one. We identify which elements in the filter circuit need to maximize their Q-factors and which Q-factors do not affect the filter performance. This saves die area, and predicts the FET parameters (especially transconductances) and negative-resistance FET topologies that have to be integrated in the filter to restore its performance. (invited paper)

  14. Electromagnetic design methods in systems-on-chip: integrated filters for wireless CMOS RFICs

    Energy Technology Data Exchange (ETDEWEB)

    Contopanagos, Harry [Institute for Microelectronics, NCSR ' Demokritos' , PO Box 60228, GR-153 10 Aghia Paraskevi, Athens (Greece)

    2005-01-01

    We present general methods for designing on-chip CMOS passives and utilizing these integrated elements to design on-chip CMOS filters for wireless communications. These methods rely on full-wave electromagnetic numerical calculations that capture all the physics of the underlying foundry technologies. This is especially crucial for deep sub-micron CMOS technologies as it is important to capture the physical effects of finite (and mediocre) Q-factors limited by material losses and constraints on expensive die area, low self-resonance frequencies and dual parasitics that are particularly prevalent in deep sub-micron CMOS processes (65 nm-0.18 {mu}m. We use these integrated elements in an ideal synthesis of a Bluetooth/WLAN pass-band filter in single-ended or differential architectures, and show the significant deviations of the on-chip filter response from the ideal one. We identify which elements in the filter circuit need to maximize their Q-factors and which Q-factors do not affect the filter performance. This saves die area, and predicts the FET parameters (especially transconductances) and negative-resistance FET topologies that have to be integrated in the filter to restore its performance. (invited paper)

  15. Synthesis of on-chip control circuits for mVLSI biochips

    DEFF Research Database (Denmark)

    Potluri, Seetal; Schneider, Alexander Rüdiger; Hørslev-Petersen, Martin

    2017-01-01

    them to laboratory environments. To address this issue, researchers have proposed methods to reduce the number of offchip pressure sources, through integration of on-chip pneumatic control logic circuits fabricated using three-layer monolithic membrane valve technology. Traditionally, mVLSI biochip......-chip control circuit design and (iii) the integration of on-chip control in the placement and routing design tasks. In this paper we present a design methodology for logic synthesis and physical synthesis of mVLSI biochips that use on-chip control. We show how the proposed methodology can be successfully...... applied to generate biochip layouts with integrated on-chip pneumatic control....

  16. Experiment list: SRX150568 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available is=Adenocarcinoma 59265240,72.4,16.4,4779 GSM935489: Harvard ChipSeq HeLa-S3 RPC155 std source_name=HeLa-S3 ...|| biomaterial_provider=ATCC || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipS

  17. Experiment list: SRX150661 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available is=Adenocarcinoma 59396606,71.7,11.1,1200 GSM935582: Harvard ChipSeq HeLa-S3 BRF1 std source_name=HeLa-S3 ||... biomaterial_provider=ATCC || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq

  18. Experiment list: SRX150495 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available is=Adenocarcinoma 62508352,67.6,8.4,1556 GSM935416: Harvard ChipSeq HeLa-S3 ZZZ3 std source_name=HeLa-S3 || ...biomaterial_provider=ATCC || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq

  19. Experiment list: SRX150565 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available =Adenocarcinoma 54953593,74.3,12.2,1703 GSM935486: Harvard ChipSeq HeLa-S3 BDP1 std source_name=HeLa-S3 || b...iomaterial_provider=ATCC || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq |

  20. Performance evaluation of chip seals in Idaho.

    Science.gov (United States)

    2010-08-01

    The intent of this research project is to identify a wide variety of parameters that influence the performance of pavements treated via chip seals within the State of Idaho. Chip sealing is currently one of the most popular methods of maintenance for...

  1. Experiment list: SRX507380 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available + (wildtype) || age of animals=1-5 day old || tissue=Ovaries || chip antibody=anti-HP1 || chip antibody vend...1770: WT anti-HP1- replicate#2; Drosophila melanogaster; ChIP-Seq source_name=WT_WT_anti-HP1 || strain=piwi/

  2. Experiment list: SRX176054 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nosis=Carcinoma 13338805,91.2,4.9,792 GSM984386: LNCAP AR vehicle; Homo sapiens; ChIP-Seq source_name=prosta...te cancer cells || cell line=LNCaP || chip antibody=AR || chip antibody manufacturer=Abcam || treatment=EtOH vehicle

  3. Experiment list: SRX144525 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available neage=mesoderm|Description=parental cell type to lymphoblastoid cell lines 14487710,85.8,82.8,188 GSM922970: NRF2 ChIP vehicle... treated rep1; Homo sapiens; ChIP-Seq source_name=NRF2 ChIP vehicle treated || biomaterial

  4. Experiment list: SRX144524 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available neage=mesoderm|Description=parental cell type to lymphoblastoid cell lines 4766716,6.2,89.4,0 GSM922969: NRF2 ChIP vehicle... treated pilot; Homo sapiens; ChIP-Seq source_name=NRF2 ChIP vehicle treated || biomaterial_pr

  5. Experiment list: SRX151246 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available 11: SMC1 ChIPSeq; Homo sapiens; ChIP-Seq source_name=BCBL1 pleural effusion lymphoma, SMC1 ChIP || cell line...=BCBL1 || cell type=KSHV-infected pleural effusion lymphoma cells || chip antibody=rabbit anti-SMC1 || antib

  6. New generation of single-chip microcomputers focused on cost performance

    Energy Technology Data Exchange (ETDEWEB)

    Akao, Y.; Iwashita, H. (Hitachi, Ltd., Tokyo (Japan))

    1993-06-01

    A single-chip microcomputer which incorporates a CPU (central processing unit), memory, and peripheral functions in one chip has been increasingly applied to various fields as the heart of electronic equipment in terms of its economy, compactness, lightness, and suitability for mass production. In response to a wide variety of needs, a lineup must have substantial breadth with regard to performance, on-chip memory capacity, on-chip peripheral functions, operating voltage, and packaging. In particular, low-voltage high-speed operation, high integration, expanded address space, and improved software productivity, which are required for mobile communication terminals, are the common needs for single-chip microcomputers. In accordance with these needs, Hitachi has been actively developing new products. The present paper introduces Hitachi's lineup of single-chip microcomputers. 10 figs., 1 tab.

  7. Adiabatic shear banding and scaling laws in chip formation with application to cutting of Ti-6Al-4V

    Science.gov (United States)

    Molinari, A.; Soldani, X.; Miguélez, M. H.

    2013-11-01

    The phenomenon of adiabatic shear banding is analyzed theoretically in the context of metal cutting. The mechanisms of material weakening that are accounted for are (i) thermal softening and (ii) material failure related to a critical value of the accumulated plastic strain. Orthogonal cutting is viewed as a unique configuration where adiabatic shear bands can be experimentally produced under well controlled loading conditions by individually tuning the cutting speed, the feed (uncut chip thickness) and the tool geometry. The role of cutting conditions on adiabatic shear banding and chip serration is investigated by combining finite element calculations and analytical modeling. This leads to the characterization and classification of different regimes of shear banding and the determination of scaling laws which involve dimensionless parameters representative of thermal and inertia effects. The analysis gives new insights into the physical aspects of plastic flow instability in chip formation. The originality with respect to classical works on adiabatic shear banding stems from the various facets of cutting conditions that influence shear banding and from the specific role exercised by convective flow on the evolution of shear bands. Shear bands are generated at the tool tip and propagate towards the chip free surface. They grow within the chip formation region while being convected away by chip flow. It is shown that important changes in the mechanism of shear banding take place when the characteristic time of shear band propagation becomes equal to a characteristic convection time. Application to Ti-6Al-4V titanium are considered and theoretical predictions are compared to available experimental data in a wide range of cutting speeds and feeds. The fundamental knowledge developed in this work is thought to be useful not only for the understanding of metal cutting processes but also, by analogy, to similar problems where convective flow is also interfering with

  8. Experiment list: SRX150586 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available -Barr Virus 33195472,90.4,25.9,15633 GSM935507: Harvard ChipSeq GM12878 NF-YB IgG-mus source_name=GM12878 ||...?PgId=165&q=GM12878 || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq || dat

  9. Experiment list: SRX150496 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available ein-Barr Virus 63040797,85.0,19.7,1435 GSM935417: Harvard ChipSeq GM12878 SPT20 std source_name=GM12878 || b...gId=165&q=GM12878 || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq || datat

  10. Experiment list: SRX150585 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available -Barr Virus 32926476,94.0,12.0,2668 GSM935506: Harvard ChipSeq GM12878 NF-YA IgG-mus source_name=GM12878 || ...PgId=165&q=GM12878 || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq || data

  11. A Chip for an Implantable Neural Stimulator

    DEFF Research Database (Denmark)

    Gudnason, Gunnar; Bruun, Erik; Haugland, Morten

    2000-01-01

    This paper describes a chip for a multichannel neural stimulator for functional electrical stimulation (FES). The purpose of FES is to restore muscular control in disabled patients. The chip performs all the signal processing required in an implanted neural stimulator. The power and digital data...

  12. Experiment list: SRX153146 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available -Seq source_name=Human breast adenocarcinoma cell-line MCF7 || cell-line=MCF7 || passage=5 || chip antibody=...n=Pleura|Tissue Diagnosis=Adenocarcinoma 60170246,98.4,5.7,16756 GSM946850: MCF7 H3K27ac; Homo sapiens; ChIP

  13. Experiment list: SRX176063 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available =Carcinoma 11279321,95.5,3.6,13985 GSM984395: LNCAP ACH3 vehicle; Homo sapiens; ChIP-Seq source_name=prostat...e cancer cells || cell line=LNCaP || chip antibody=AcH3 || chip antibody manufacturer=Millipore || treatment=EtOH vehicle

  14. Experiment list: SRX176057 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available nosis=Carcinoma 21582823,90.1,7.3,1074 GSM984389: 22RV1 AR vehicle; Homo sapiens; ChIP-Seq source_name=prost...ate cancer cells || cell line=22RV1 || chip antibody=AR || chip antibody manufacturer=Abcam || treatment=EtOH vehicle

  15. Experiment list: SRX144527 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available neage=mesoderm|Description=parental cell type to lymphoblastoid cell lines 8704444,92.1,92.5,9 GSM922972: NRF2 ChIP vehicle... treated rep3; Homo sapiens; ChIP-Seq source_name=NRF2 ChIP vehicle treated || biomaterial_pr

  16. Experiment list: SRX160914 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available M970829: IgG for KSHV LANA; Homo sapiens; ChIP-Seq source_name=BCBL1 pleural effusion lymphoma, IgG ChIP || ...cell line=BCBL1 || cell type=KSHV-infected pleural effusion lymphoma cells || chip antibody=Rabbit IgG [Sant

  17. Experiment list: SRX160915 [Chip-atlas[Archive

    Lifescience Database Archive (English)

    Full Text Available M970828: IgG for CTCF SMC1; Homo sapiens; ChIP-Seq source_name=BCBL1 pleural effusion lymphoma, IgG ChIP || ...cell line=BCBL1 || cell type=KSHV-infected pleural effusion lymphoma cells || chip antibody=Mouse IgG [Santa

  18. Ammonia, total reduced sulfides, and greenhouse gases of pine chip and corn stover bedding packs

    Science.gov (United States)

    Bedding materials may affect air quality in livestock facilities. The objective of this study was to compare headspace concentrations of ammonia (NH3), total reduced sulfides (TRS), carbon dioxide (CO2),methane (CH4), and nitrous oxide (N2O) when pine wood chips and corn stover were mixed in various...

  19. Ion Chromatography-on-a-chip for Water Quality Analysis

    Science.gov (United States)

    Kidd, R. D.; Noell, A.; Kazarians, G.; Aubrey, A. D.; Scianmarello, N.; Tai, Y.-C.

    2015-01-01

    We report progress towards developing a Micro-Electro-Mechanical Systems (MEMS)- based ion chromatograph (IC) for crewed spacecraft water analysis. This IC-chip is an offshoot of a NASA-funded effort to produce a high performance liquid chromatograph (HPLC)-chip. This HPLC-chip system would require a desalting (i.e. ion chromatography) step. The complete HPLC instrument consists of the Jet Propulsion Labortory's (JPL's) quadrupole ion trap mass spectrometer integrated with a state-of-the-art MEMS liquid chromatograph (LC) system developed by the California Institute of Technology's (Caltech's) Micromachining Laboratory. The IC version of the chip consist of an electrolysis-based injector, a separation column, two electrolysis pumps for gradient generation, mixer, and a built-in conductivity detector. The HPLC version of the chip also includes a nanospray tip. The low instrument mass, coupled with its high analytical capabilities, makes the LC chip ideally suitable for wide range of applications such as trace contaminant, inorganic analytical science and, when coupled to a mass spectrometer, a macromolecular detection system for either crewed space exploration vehicles or robotic planetary missions.

  20. Chapter 5. Technological aspects of obtaining of ethynyl-piperidol polymers. 5.1. Elaboration of method of continuous production of bandaging material

    International Nuclear Information System (INIS)

    Khalikov, D.Kh.

    2012-01-01

    The elaboration of method of continuous production of styptic and antibacterial material was the purpose of present scientific research. The flowsheet of continuous production of styptic and antibacterial material was elaborated and described. The process of iodine sorption by modified materials was studied. The iodine sorption by modified materials in moment of its formation from the potassium iodide was studied as well. The influence of nature of grafted polymer on sorption of iodide ions was studied as well.